Title: Chemical mechanical planarization of microelectronic materials /
Authors: Steigerwald, Joseph M.; Murarka, S. P.; Gutmann, Ronald J.
Publisher: J. Wiley,
Year: 1996
Subjects: Microelectronics Materials.; Grinding and polishing.; Chemical mechanical planarization.
Abstract: Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann - all leading CMP pioneers - provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers.