bluuebunny/crossref_metadata_2025_split huggingface dataset:
Comparing Behaviors of FIB Toolsets in a Large Scale Automated XTEM Sample Preparation Setup
Authors: Dixit Vikas , You Yilhwan , Gauntt Bryan , Lee Taehun 
Published: October 2022

Abstract
Moore’s law has been a major driving force in the development of novel semiconductor devices and has continued to hold its relevance over the years. The resultant, smaller and more powerful, microprocessors not only cater to the ever-increasing demands of the existing needs but also are important enablers of novel applications and discoveries in different areas. Several critical features of these latest devices are in the atomic to nanometer scale, which has enhanced the necessity of a largescale transmission electron microscopy (TEM) imaging-based metrology and failure analysis for their process development. As a result, the automation of lamella preparation using focused ion beam (FIB) and TEM imaging has gathered an enormous momentum in last few years. A key aspect of automating a large-scale TEM sample preparation not only involves the calibration of a given FIB tool to achieve an acceptable and repeatable quality of TEM samples but also to ensure that sample quality is consistent across the entire fleet of toolsets. In this work, the performance of three ThermoFisher Exsolve toolsets using a common tool calibration method for both, lamella thickness and targeting, has been compared. It was found that in general, thickness of TEM lamella showed a larger variation as compared to targeting over the period of one month. Lamella thickness showed a decreasing trend, and it entailed a need of recalibrating the tools in an interval of two weeks so that the variation in both thickness and targeting for the fleet can be kept within the desired specifications of ±3 nm (2σ).
Develop a Time Efficient Method to Enhance the FIB Process on Die Backside Metallization (BSM) Analysis
Authors: Wee Lo Chea , Yee Tan Sze , Ong Alice 
Published: October 2022

Abstract
Nowadays, semiconductor components are widely used in home electronic appliances, vehicles, industrial motor controls and beyond. The performance and reliability of these components are becoming more crucial and critical. Generally, a semiconductor component consists of lead frames, wires, dies and die attaches. Within the die, the die backside metallization, also known as “BSM,” plays an important role in electronic component manufacturing. The BSM is a layer that promotes good adhesion, electrical properties and long-term stability as a conductive pathway to the circuits. As such, the inspection on BSM is needed to ensure robustness. Several conventional methods have been developed to analyze the die backside metallization. In this paper, we will discuss the inspection on backside metallization and comparison among five sample preparation methods: mechanical cross section with ion milling, mechanical cross section with FIB cleaning, die frontside decapsulation with FIB cut from die surface and FIB cut from die sidewall, and component frontside lapping with FIB from the remaining silicon. Result comparison will be discussed in case studies and the advantages and disadvantages of the five methods will be compared.
Emerging Nonvolatile Memories—An Assessment of Vulnerability to Probing Attacks
Authors: Biswas Liton Kumar , Shafkat M. , Khan M. , Lavdas Leonidas , Asadizanjani Navid 
Published: October 2022

Abstract
Probing and imaging techniques that are conventionally used for failure analysis pose a major threat to the confidentiality and the integrity of data stored in non-volatile memory (NVM) cells integrated into a silicon chip. These techniques fall under the umbrella of physical attacks, which unlock tremendous capabilities for an attacker trying to access secret information stored in a target NVM. How vulnerable an NVM cell is to these attacks depends on device physics and the operational principles of the memory cell. The wide range of emerging NVM technologies opens new opportunities for attackers. Without significant attention to these emerging threats, confidential data stored in NVMs can get compromised without much effort, given access to advanced failure analysis tools. We aim to show how attackers can use their knowledge of how a memory device works to find out a suitable probing or imaging modality to extract the stored secret.
Overcoming Challenging Failure Analysis Sample Types on a Single IR/Raman Platform!
Authors: Anderson Jay , Lo Michael K. F. , Dillon Eoghan P. , Kansiz Mustafa 
Published: October 2022

Abstract
This paper describes a new infrared (IR) technique that offers sub-micron spatial resolution with a pump-probe scheme that can offer simultaneous collection of IR and Raman spectra at the same spatial resolution. The technique uses a single beam to collect both IR and Raman spectra using a technique called Optical Photothermal Infrared (O-PTIR). The O-PTIR technique provides constant spatial resolution over the entire mid-IR range due to the use of a fixed wavelength probe beam at 532 nm. The paper provides examples that highlight the advantages of the novel technique for addressing challenges that are commonly observed in the failure and contamination analysis community.
A Correlative Microscopic Workflow For Nanoscale Failure Analysis and Characterization of Advanced Electronics Packages
Authors: Rodgers Thomas , Gu Allen , Johnson Greg , Terada Masako , Cohan Nathaniel , Viswanathan Vignesh , Phaneuf Michael W. , de Fourestier Joachim , Ruttan Ethan , McCracken Stewart , Costello Suzanne , Robinson Aidan M , Gibson Andrew , Balfour Alan 
Published: October 2022

Abstract
Microscopic imaging and characterization of semiconductor devices and material properties often begin with a sample preparation step. A variety of sample preparation methods such as mechanical lapping and broad ion beam (BIB) milling have been widely used in physical failure analysis (FPA) workflows, allowing internal defects to be analyzed with high-resolution scanning electron microscopy (SEM). However, these traditional methods become less effective for more complicated semiconductor devices, because the cross-sectioning accuracy and reliability do not satisfy the need to inspect nanometer scale structures. Recent trends on multi-chip stacking and heterogenous integration exacerbate the ineffectiveness. Additionally, the surface prepared by these methods are not sufficient for high-resolution imaging, often resulting in distorted sample information. In this work, we report a novel correlative workflow to improve the cross-sectioning accuracy and generate distortion-free surface for SEM analysis. Several semiconductor samples were imaged with 3D X-ray microscopy (XRM) in a non-destructive manner, yielding volumetric data for users to visualize and navigate at submicron accuracy in three dimensions. With the XRM data to serve as 3D maps of true package structures, the possibility to miss or destroy the fault regions is largely eliminated in PFA workflows. In addition to the correlative workflow, we will also demonstrate a proprietary micromachining process which is capable of preparing deformation-free surfaces for SEM analysis.
Novel and Efficient Approach in Determining Glue Coverage for Wafers Mounted with Glass Carriers
Authors: Muniandy Lingeswarran , Kiong Eric Wong Soon , Ismail Danial , Theng Tan Theng , Pavic Ivan 
Published: October 2022

Abstract
Viewing the cross section of wafers with glass carriers has always been a challenging task. Add on to observing and determining the glue coverage is an uphill struggle due to the fragile nature of the glue. The traditional technique of cleaving wafers equipped with glass carriers is neither promising nor highly successful. In addition to the mentioned disadvantages, the presence of glass carrier would mean cleaving the wafer with a diamond scriber, a dangerous technique due to the possibility of fragmentation of the glass carrier which could be a potential safety hazard. Time consuming, low success rate, lack of finesse and potential safety hazard of the conventional cleaving method had paved the path of an alternative technique to assess glue coverage for wafers equipped with glass carriers. This manuscript would give an elaborate insight of a novel technique employed in analysing the glue coverage of wafers with glass carriers.
Optimization of Annealing Process Conditions to Reduce Gate Induced Drain Leakage Current in Buried-Gate FETs
Authors: Kim Youmin , Kim Donghbin , Choi Byoungdeog 
Published: October 2022

Abstract
As devices shrink, mitigating off-state power consumption has become a major concern for dynamic random access memory (DRAM) product development. The interface trap induced reduction of the retention time of DRAM cells has become increasingly critical due to aggressive device shrinkage. In this paper, the influence of reliability evaluation after device manufacturing on the number of interface traps in buried-channel-array-transistors and the optimal H2 annealing temperature were investigated for the reduction of trap-induced leakage currents that cause retention time degradation in DRAM cells. This study is expected to solve the problem of retention time and off-state power consumption caused by interface traps and to be utilized as a cornerstone for next-generation DRAM development.
AFM in SEM for Device Characterization and Defect Localization
Authors: Johnson Gregory M. , Hitzel Frank 
Published: October 2022

Abstract
The results of analyses on a commercially available 7 nm SRAM, using an in-situ AFM inside a SEM, are presented. In addition to typical results for conductive AFM, a novel method is described that uses the SEM beam to prepare a region for additional material removal, thus bringing out clearer electrical data. This would be of exceptional value for technology nodes using cobalt as a contact material. Finally, techniques making use of the current from the SEM beam as the source of current during the measurement are described. The technique may have value for well resistance measurements using in-situ structures on live product, a survey of junction health, or the localization of point defects.
The Fundamentals of Nanoprobe Analysis (2022 Update)
Authors: Mulder Randal 
Published: October 2022

Abstract
This presentation provides an overview of nanoprobe systems and what they reveal about defects and abnormalities in semiconductor device structures and materials. The presentation covers the basic operating principles, implementation, and capabilities of atomic force probe and beam-based imaging techniques, including AFP pico-current contrast and scanning capacitance imaging, SEM/FIB active voltage contrast imaging, and SEM/FIB electron-beam absorbed current (EBAC), induced current (EBIC), and induced resistance change (EBIRCH) imaging. It also includes guidelines for probing transistors and copper metallization and case studies in which nanoprobing was used to analyze gate oxide and substrate defects, intermittent bit cell failures, threshold voltage shifts, and time-domain popcorn noise.
Defect Localization by Lock-In-Thermography
Authors: Brand Sebastian 
Published: October 2022

Abstract
This presentation provides an overview of lock-in thermography and its application in semiconductor failure analysis. It begins with a review of direct thermal imaging, IR transmission and detection, and the fundamentals of lock-in measurements. It compares and contrasts steady-state IR imaging with lock-in thermography and shows how lock-in frequency and the shape of the excitation signal can be varied to increase signal-to-noise ratio and reduce acquisition time, thereby exposing a wider range of defects. It also presents several case studies in which lock-in thermography is used to diagnose shorts and hot spots in packaged devices, electronic systems, and 3D assemblies.
Flip-Chip and Backside Techniques (2022 Update)
Authors: Cole Edward I. , Fishgrab Kira L. , Barton Daniel L. , Bernhard-Höfer Karoline 
Published: October 2022

Abstract
This presentation covers the basic physics needed to understand and to effectively apply backside IC analysis techniques to flip-chip packaged die. It describes the principles of light transmission through silicon and the factors that influence optical image formation from the backside of the wafer or die. It also provides information on the tools and techniques used to expose surfaces, regions, and features of interest for analysis. It describes the steps involved in CNC milling, mechanical grinding and polishing, reactive ion etching (RIE), laser microchemical (LMC) etching, and milling and etching by focused ion beam (FIB). It explains where and how each technique is used and quantifies the capabilities of different combinations of methods.
Basics and Current Aspects of Scanning Electron Microscopy (2022 Update)
Authors: Stegmann Heiko 
Published: October 2022

Abstract
This presentation addresses topics of relevance to scanning electron microscopy, including SEM basics, electron guns, electron optics, beam-specimen interactions, signal detection, sample prep and cleanliness, low-voltage imaging, nonconductive imaging, voltage contrast, stage biasing, electron channeling contrast imaging, magnetic contrast imaging, STEM-in-SEM, 3D imaging and analytics, image post-processing, and automation.
THE SOUND PARADIGM OF VASYL STEFANYK’S NOVELLA «A STONE CROSS»
Authors: Horbolis Larysa 
Published: October 2022

The aim. The article suggests a new view on the organization and structure of Vasyl Stefanyk’s novella “A Stone Cross” that determines the elucidation of an intermedial issue in the analysis of the writer’s famous work: the unity of a word and sound palette in the fictional text of the novella author’s prose. Therefore, the aim of the article is to study through the prism of one novella a general tendency of Vasyl Stefanyk’s creative work: the synthesis of literature and art, the study of methodological approaches to interpreting the phenomena of intermediacy in the novellas of the classic of our national literature.
The research methods. For the analysis the synthesis of principles and methods of scientific researchis implemented, first of all, of intertextual, comparative-typological, intermedial, poetological and biographical ones.
The research results. The interpretation of Vasyl Stefanyk’s novella “A Stone Cross” through the prism of verbal and music-sound aspects promotes understanding of the writer’s rich in senses well-known work. That is why the selected poetic analysis of each part of “A Stone Cross” is the most acceptable for researching the textual longevity of sounds and music in the novella’s general structure. In the research process of the sound paradigm of Vasyl Stefanyk’s work, its groundbreaking essence, the peculiarity of its style, modern poetics are proved that undoubtedly affected the precision and powerful energy of its word form.
The scientific novelty. In the research there is achieved a new reading of the text of Vasyl Stefanyk’s novella “A Stone Cross”, for the first time there is performed the analysis of its sound contour by means of which the subtexts and hidden senses of the work are decoded. Such a cutting-edge approach proposes a fresh view on the Ukrainian author’s modernistic searches: the sound, music, song, dance identify the main hero Ivan Didukh, generally psychologise the text of the work.
The practical significance. The obtained research results may be used in further research of Vasyl Stefanyk’s creative work from positions of contemporary literary studies, particularly the proposed interpretational approach is one of the segments of a poly-aspectual interpretation of the deep in its contents work that has already become classical both in the sphere education and in scientific studies of today’s researchers of Vasyl Stefanyk’s creative work.
“IN LITERATURE, HE IS AN EXTRAORDINARY ARTIST”: THE INTERMEDIAL EMPHASES OF LITERARY RECEPTIONS OF VASYL STEFANYK’S
Authors: Mocherniuk Nataliia 
Published: October 2022

The paper provides an overview of literary studies focusing on the work of Vasyl Stefanyk, in which the reception of short stories draws on vocabulary from different visual arts. In their efforts to unravel the secrets of the writer’s style, scholars often consciously or intuitively compare his artistic style to other arts, using their toolkit. Stepan Smal-Stotsky, Olha Kobylianska, Lesia Ukrainka, Ivan Franko, Bohdan Lepky, Antin Krushelnytskyi, Serhii Yefremov, Ivan Trush, Alexandra Chernenko, Yulian Vassyian, Mykhailyna Kotsyibynsky as well as many current scholars resort to comparisons with graphics, painting, photography and architecture. The focus is on this distinctive perception of the writer’s poetics in connection with attempts to explain his aesthetic and artistic strands. The importance of J. Vassian’s conclusion, whісh considers the artistic world of the writer in comparison with Wagner’s Gesamtkunstwerk, a synthetic and comprehensive work of art, is emphasized. Such a literary vision has a significant interpretive potential in the intermedia aspect and requires further scientific development. It is proved that Stefanyk's artistic word gives impulses to other arts. The latest evidence of this already applies to the art of cinema. Stefanyk is potentially extremely cinematic, as evidenced by modern researchers in their publications.
Vasyl Stefanyk’s short stories are thus endowed with a great power of influence on other types of art, which should be traced in the following studies.
VASYL STEFANYK IN THE FIELD OF HIS READING
Authors: Kovalets Lidiia 
Published: October 2022

On the basis of primarily epistolary and memoirs, various manifestations of Vasyl Stefanyk’s reading behaviour are considered. It consisted of active searching for books, thoughtfulconversation with texts, deep psychological reactions to some of them, forming his own opinion about them, involving of famous people in reading. It was observed that, given the dynamics and its external manifestations, Stefanyk’s reading action had several stages: the early one, which concerned primary and gymnasium education, the Krakow one, connected with his medical studies at the Jagiellonian University, and the last one (from the 1900s), a period spent mainly on native land.
A rich factual material was analysed. It testified that the main segment in the field of Stefanyk’s reading was foreign, primarily Western European literature, especially prose, but also poetry and drama, as well as Ukrainian literature. The author of the «Stone Cross» also had ample opportunities thanks to mastering books in four languages: besides Ukrainian also Russian, Polish and German. The article also attempts to understand the features of the phenomenon of Stefanyk as a reader, which naturally agreed with the psychophysical features of Stefanyk as a man. Reading itself provided writer’s thorough, first of all philological education and turned out to be the same original and productive form of his creative activity as a purely literary work.
SYNTAGMATICS OF HERO-AUTHOR CONNECTIONS IN THE WORKS OF LESYA UKRAINKA AND VASYL STEFANYK
Authors: Romanov Sergiy 
Published: October 2022

In the article, the work of Lesia Ukrainka and Vasyl Stefanyk is considered through the connections between the hero and the author. These connections in the study are taken as the basis for the development of the literary text due to the specifics of its functioning in the system writer – critic – reader. Thus, the aim of the work is to identify the features of the poetics of the main Ukrainian artists of the era of the frontier, in particular the defining in modernism plot and meaningful self-projection of creative personality. The results of scientific research in certain areas include: comparative delineation of the ways of work of writers with factual material (folklore, mythology, history, realities of the author&apos;s era, etc.); identifying the artistic style of the playwright and novelist; identification of leading ideological and plot models for both artists; analysis of the mechanisms of development and functioning of the character sphere; detection of algorithms of text influence on the reader.
The achievements of practical significance in the proposed article can be considered to include the approbation of the individual search strategy in the science of Lesia Ukrainka and Stefanyk studies, implemented in the fields of literary, philosophical and psychological discourses. Under this review, the frontal application of the methods of comparative studies for the study of artistic phenomena of the mononational register may also be interesting. In terms of scientific novelty, the article also differs primarily in the way of researching psychobiographies and creative paths of contemporary writers, which is to compare the identities of artists associated with the phenomenon, trend and personal relationships.
METHODOLOGICAL APPROACHES TO THE FORMATION OF INNOVATIVE ENTERPRISE MANAGEMENT TECHNOLOGIES IN THE DYNAMIC BUSINESS ENVIRONMENT OF CONSTRUCTION DEVELOPMENT
Authors: Shpakov Andrii 
Published: October 2022

The scientific-applied task of increasing the accuracy of the determination of the estimated value of the construction object (estimated cost of the construction object) requires new methods of solution, especially for construction objects that are planned for inclusion in the investment program. There is still no complete information about the processes of formation of the ECCO and the system of management decisions that ensure planning, regulation and cost control during the implementation of investment programs. What is needed is not just information, but a knowledge base, which, as the analysis showed, is rather characterized by its absence, since the composition of the input data and the requirements for them have not been determined for the substantiation of the ECCO and its management. According to the author, in order to solve this task, it is advisable to create an organizational and economic mechanism for the management of ECCO, the key blocks of which are the developed economic-mathematical model of ECCO (EMM ECCO) and the organizational model of management of ECCO (OMM ECCO) in order to provide informational support and interaction of construction stakeholders. Within the framework of the research methodology, the conceptual and methodological principles of the implementation of the project of strategic innovative changes for construction stakeholder enterprises are substantiated: these principles are formed through the integration of methodical platforms of enterprise economy, strategic management and construction development is considered as a target project and a regulated environment for the achievement of planned improvements by stakeholders enterprise and changing the enterprise's position in the market of construction works and services through the implementation of the intra-firm strategic innovation project. The key to the success of the application of the created methodological foundation for the needs of adaptation and development of the construction enterprise is the properly identified "state of enterprise adaptability and identified maturity to the implementation of changes." Within such identification, the limits of the situational-strategic maturity of implementing changes for the enterprise-stakeholder are stratified, and the economic features of the processes that take place in the enterprise at each level of maturity are summarized. Five levels of maturity are defined, each of which has its own characteristics of strategy, description and formalization of business processes, structuring of management technologies, and the state of formation of the information and communication space.