bluuebunny/crossref_metadata_2025_split huggingface dataset:
Effects of Brain Gymnastics on Decreased Stress Levels in College Students
Authors: Sri Sartini  , Amirullah  , Aszrul AB  
Published: February 2022

The background of this study is non-pharmacological management to reduce stress one of which is brain gymnastics. Brain gymnastic movements can activate the neocortex and sympathetic nerves to reduce the increased production of adrenaline hormones in the body that can relieve psychological tension as well as physical tension. The purpose of this study is to find out the effect of brain gymnastics on the decrease in stress levels in students of the final level of the DIII Health Analyst Stikes Panrita Husada Bulukumba in 2019. The method used in this research using a pre-experiment research design with the one-group pre-post test design method. Sampling by means of Nonprobability sampling: Consecutive sampling with a total of 28 respondents. Measurement of stress levels using a watershed questionnaire (Depression Anxiety Stress Scale) with statistical tests used is a paired t-test. The results of this study showed that there was an effect of brain gymnastics exercise on the decrease in stress levels in students of the final level of the DIII Health Analyst Stikes Panrita Husada Bulukumba with a mean Pretest score of 22.61 while the mean Postest 12.75 so that the average value of changes in pretest and posttest stress levels with a mean value of 9,857 with an std. deviation of 3,354. In conclusion, there is a meaningful influence on brain gymnastics training on the decrease in stress levels in students of the final level of the DIII Health Analyst Stikes Panrita Husada Bulukumba 2019.
Importance of endometrial biopsy in premenopausal women without risk factors for endometrial cancer
Authors: SOYKAN SERT Zekiye 
Published: February 2022

Objective: In women with abnormal uterine bleeding, the appropriate age for endometrial biopsy remains controversial. In this study, we aimed to evaluate the importance of endometrial biopsy in premenopausal women aged 40-49 years who presented with menorrhagia but did not have risk factors for endometrial cancer.
Material And Methods: The records of patients who underwent endometrial biopsy for diagnostic purposes at the gynecology and obstetrics clinic of our hospital between January 1, 2017 and October 31, 2021 were retrospectively reviewed. Among these patients, premenopausal women aged 40-49 years with menorrhagia who had endometrial biopsy results were included in the sample. Patients with risk factors were excluded from the study.
Results: A total of 176 premenopausal patients with menorrhagia were included in the study. According to the biopsy results of these patients without risk factors, no malignancy was detected. Endometrial hyperplasia was present in six patients (3.4%), of whom (0.6%) had hyperplasia with atypia and five (2.8%) had hyperplasia without atypia.
Conclusion: We found a minimal risk of neoplastic and preneoplastic disease in premenopausal women aged 40-49 years with menorrhagia but no risk factors for endometrial cancer. Endometrial biopsy indications should be reviewed in this patient group.
SQuIGGL⃗E
: Studying Quenching in Intermediate-z Galaxies—Gas,
AnguL⃗ar
Momentum, and Evolution
Authors: Suess Katherine A. , Kriek Mariska , Bezanson Rachel , Greene Jenny E. , Setton David , Spilker Justin S. , Feldmann Robert , Goulding Andy D. , Johnson Benjamin D. , Leja Joel , Narayanan Desika , Hall-Hooper Khalil , Hunt Qiana , Lower Sidney , Verrico Margaret 
Published: February 2022

Abstract
We describe the Studying Quenching in Intermediate-z Galaxies: Gas,

angu

L
→

ar

momentum, and Evolution (

SQuIGG

L

⃗

E

) survey of intermediate-redshift post-starburst galaxies. We leverage the large sky coverage of the Sloan Digital Sky Survey to select ∼ 1300 recently quenched galaxies at 0.5 < z ≤ 0.9 based on their unique spectral shapes. These bright, intermediate-redshift galaxies are ideal laboratories to study the physics responsible for the rapid quenching of star formation: they are distant enough to be useful analogs for high-redshift quenching galaxies, but low enough redshift that multiwavelength follow-up observations are feasible with modest telescope investments. We use the Prospector code to infer the stellar population properties and nonparametric star formation histories (SFHs) of all galaxies in the sample. We find that

SQuIGG

L

⃗

E

galaxies are both very massive (M
* ∼ 1011.25
M
⊙) and quenched, with inferred star formation rates ≲1 M
⊙ yr−1, more than an order of magnitude below the star-forming main sequence. The best-fit SFHs confirm that these galaxies recently quenched a major burst of star formation: >75% of

SQuIGG

L

⃗

E

galaxies formed at least a quarter of their total stellar mass in the recent burst, which ended just ∼200 Myr before observation. We find that

SQuIGG

L

⃗

E

galaxies are on average younger and more burst-dominated than most other z ≲ 1 post-starburst galaxy samples. This large sample of bright post-starburst galaxies at intermediate redshift opens a wide range of studies into the quenching process. In particular, the full

SQuIGG

L

⃗

E

survey will investigate the molecular gas reservoirs, morphologies, kinematics, resolved stellar populations, active galactic nucleus incidence, and infrared properties of this unique sample of galaxies in order to place definitive constraints on the quenching process.
Synthesis, molecular docking, ADMET study and in vitro pharmacological research of 7-(2-chlorophenyl)-4-(4-methylthiazol-5-yl)-4,6,7,8-tetrahydroquinoline-2,5(1H,3H)-dione as a promising non-opioid analgesic drug
Authors: Kravchenko Aleksey D. , Pyatigorskaya Natalia V. , Brkich Galina E. , Yevsieieva Larysa V. , Kyrychenko Alexander V. , Kovalenko Sergiy M. 
Published: February 2022

Introduction: The discovery of novel drugs that can block the transmission of pain signals for treating the pain of various etiologies is an urgent topic in pharmaceutics. The aim of this paper is to synthesize and to investigate in vitro and in silico characteristics of a promising novel compound: 7-(2-chlorophenyl)-4-(4-methylthiazol-5-yl)-4,6,7,8-tetrahydroquinoline-2,5(1H,3H)-dione (HSV-DKH-0450).
Materials and methods: The specific activity and the inhibitory mechanism of HSV-DKH-0450 were studied using the HEK293 culture cells expressing the IPTG-induced TRPA1 ion channels. Cardiotoxicity was determined by estimating the binding of HSV-DKH-0450 to the hERG channel. Inhibition of human liver cytochromes was determined by the effect on the activity of cytochromes 1A2, 2C9, 2D6, 2C8, and 3A4. Cellular toxicity was assessed by the effect on the viability of human hepatocytes. ADMET properties were evaluated using admetSAR and SwissADME web-based tools. Molecular docking was carried out using AutoDock Vina tools to predict the binding affinity of all HSV-DKH-0450 stereoisomers toward the TRPA1 and TRPV1 receptors.
Results and discussion: In silico predictions of ADMET properties of HSV-DKH-0450 showed that it has optimal pharmaceutical profiles. A series of in vitro pharmacological studies revealed that HSV-DKH-0450 is a promising antagonist of the TRPA1 ion channel with the IC50 of 91.3 nM. The molecular docking of HSV-DKH-0450 stereoisomers against the TRPA1 and TRPV1 receptors demonstrates that they all are characterized by an approximately similar high binding affinity.
Conclusion: The obtained data for substance HSV-DKH-0450 look promising for its further development as a potential therapeutic agent for pain relief.
A Virtual EMG Signal Control and Analysis for Optimal Hardware Design
Authors: Aljobouri Hadeel K. 
Published: February 2022

Background: A muscle-computer interface is one of the new applications of the human-computer interface technologies and specifically the brain-computer interface. Brain-muscle-computer interface based on the Electromyography (EMG) signal. EMG signal is an electrical activity from a muscle that is used as an input for effecting several tasks.Objective: This work presented an interfacing process between the Graphical User Interface (GUI) and hardware system. Using the implemented system, the researcher shall deals with the raw EMG data easily by analyzing the signal from the muscle sensor detection.Material and Methods: A novel virtual EMG signal control and analysis system design is proposed in this work. The system consists mainly of two parts, hardware and software toolbox. Hardware design is mainly dependent on using a muscle movement sensor as well as the feedback from the virtual toolbox. The virtual software design offers a relatively simple design of a friendly graphical user interface. It consists mainly of the input EMG signal and output signal after using different processing methods. Feedback response from the final EMG signal results after the processing may help the designer to present the optimal hardware design.Results: The output results show the output performance of the proposed virtual EMG data controlling and analysis with the implemented hardware design of the muscle sensor movement detection. The results show promise that these interfaces may provide a new option to benefit the designer in choosing the optimal prosthesis design of severely disabled persons.
Advanced Glycation End Products (AGEs) Inhibit Macrophage Efferocytosis of Apoptotic β Cells through Binding to the Receptor for AGEs
Authors: Mao Qian-Yun , He Sun-Yue , Hu Qiu-Yue , Lu Yao , Niu Yi-Xin , Li Xiao-Yong , Zhang Hong-Mei , Qin Li , Su Qing 
Published: February 2022

Abstract
Pancreatic β cell apoptosis is important in the pathogenesis of type 2 diabetes mellitus (T2DM). Generally, apoptotic β cells are phagocytosed by macrophages in a process known as “efferocytosis.” Efferocytosis is critical to the resolution of inflammation and is impaired in T2DM. Advanced glycation end products (AGEs), which are increased in T2DM, are known to suppress phagocytosis function in macrophages. In this study, we found that AGEs inhibited efferocytosis of apoptotic β cells by primary peritoneal macrophages in C57BL/6J mice or mouse macrophage cell line Raw264.7. Mechanistically, AGEs inhibit efferocytosis by blocking Ras-related C3 botulinum toxin substrate 1 activity and cytoskeletal rearrangement through receptor for advanced glycation end products/ras homolog family member A/Rho kinase signaling in macrophages. Furthermore, it was observed that AGEs decreased the secretion of anti-inflammatory factors and promoted the proinflammatory ones to modulate the inflammation function of efferocytosis. Taken together, our results indicate that AGEs inhibit efferocytosis through binding to receptor for advanced glycation end products and activating ras homolog family member A/Rho kinase signaling, thereby inhibiting the anti-inflammatory function of efferocytosis.
MAXQFP: NXP's new package solution for automotive application
Authors: Lee Chu-Chung Stephen , Tran Tu-Anh , Mawer Andrew , Pang XS , Yao JZ 
Published: February 2022

Abstract
172-lead (16x16 mm body size) and 100-lead (10x10 mm body size) MAXQFP's and 172 MAXQFP_EP (exposed pad) for automotive industry are introduced. The advantage of MAXQFP as compare to standard LQFP/QFP packages will be outlined. Thermal & mechanical simulation results were performed to prove its advantage over conventional LQFP and LQFP_EP. The challenges in manufacturing, designs and concerns of tighter lead pitches for MAXQFP are briefly addressed. Methods and data to resolve these challenges will be shown. For example, Sn whisker and Sn migration both are concerns to MAXQFP because of smaller distance between adjacent leads. The board-level solder joint reliability (SJR) has been collected to prove it is AEC G1 compliant. Visual inspection methods and requirements on AOI (automatic object inspection) systems on solider joints of J-leads of MAXQFP for are proposed. Standard AEC G1 component level reliability stresses defined at AEC Q100 which are TC (temperature cycling), HTSL (high temperature storage life), THB (Temperature Humidity Biased) and uHAST (un-biased HAST) tests are summarized Since Cu wires were used, AEC Q006 data are also collected. Assembly challenges are described. Future works will be summarized.
Coronavirus, chip boom, and supply shortage: The new normal for global semiconductor manufacturing
Authors: Rothrock Stephen M. 
Published: February 2022

Abstract
Over the past 50 years, the semiconductor industry has faced its fair share of difficult challenges. The COVID-19 pandemic the world is currently experiencing has caused the worst downturn since the financial crisis of 2008, devastating global economies. And yet, the semiconductor industry has repeatedly shown incredible resilience in the face of adversity. Despite the pandemic, the market has not experienced such a dramatic upturn since 2003 and as a result, the new market upturn breaks open the fundamental flaws and risks of manufacturing concentration and outsourcing.
At a time when the world is precariously dependent on Taiwan for semiconductors, how can the global supply chain forecast, manage, and plan for such sudden shifts in the future? Now more than ever before, advanced technology companies need to keep the finger on the pulse of supply and demand to successfully inform their strategic manufacturing decisions and remain agile to ensure continuity of supply. As chip demand booms in the midst of a supply shortage over the coming months and supply is no longer a given, what does the future hold for manufacturing fabs? Will greenfield become the rule rather than the exception in this new normal? How will the market upturn impact global fab location choices?
Reflecting on some 20 years of experience completing international semiconductor manufacturing asset transactions in North America, Europe, and Asia, ATREG Founder, President, and CEO Stephen M. Rothrock will provide insights into the current global manufacturing asset market and how it is likely to evolve as part of the current market upturn.
Lithography Solutions for Submicron Panel-Level Packaging
Authors: Shelton Doug 
Published: February 2022

Abstract
Heterogeneous Integration of logic, memory, photonic, analog and other value-adding functions is one approach for increasing electronic system efficiency, performance and bandwidth while helping reduce overall manufacturing costs. To capitalize on Heterogeneous Integration benefits, designers are requiring finer resolution Redistribution Layer patterning and larger package sizes to maximize System-in-Package integration possibilities.
Production of large-package electronics systems is well-suited for Panel Level Packaging (PLP) and achieving uniform submicron patterning across the entire rectangular panel is a key lithography challenge. To meet this challenge, Canon developed the first lithography exposure system or stepper that is capable of achieving submicron resolution on 500 mm panels. The stepper features a panel handling system for processing panels up to 515 mm x 515 mm in size and is also equipped with wide-field projection lens featuring a maximum 0.24 Numerical Aperture and a large 52 mm x 68 mm image field.
This paper will report on evaluation results for a submicron PLP process using the panel stepper and will introduce high-resolution PLP process challenges including warped panel handling. Process results on Copper Clad Laminate (CCL) substrates will be reported including pattern uniformity, adjacent shot stitching accuracy and overlay accuracy on substrates containing die-placement error that is common in Fan-Out processes.
Low Temperature Curable Low Dk & Df Polyimide for Antenna in Package
Authors: Araki Hitoshi , Shimada Akira , Ogasawara Hisashi , Jukei Masaya , Fujiwara Takenori , Tomikawa Masao 
Published: February 2022

Abstract
In this paper, we developed novel low temperature curable (around 200~250 °C) low Dk (2.7) & Df (0.002) polyimide with high glass transition temperature (170 °C) and elongation (100%). We also developed negative tone photosensitive polyimide with low Dk (3.0) & Df (0.007) by photo initiator and cross linker. Material types of them are liquid or B-stage sheet materials. Patterning methods of the non-photosensitive polyimides were imprint and UV laser ablation. Resolution of those process were 10um via and 30um via respectively. Photosensitive polyimide was patterned by photolithographic tool. We fabricated fine patterned polyimide of photosensitive polyimide by photolithography. We investigated the frequency dependence of the novel low Dk & Df polyimide up to 95 GHz, and confirmed that Df gradually increased from 0.002 to 0.005 as the frequency increased. To confirm effect of the novel polyimide, insertion loss of micro-strip line whose length was 10 mm were measured using the new developed polyimide. Insertion loss (S21 parameter) of the novel polyimide was 0.8 and that was less than half of conventional polyimide. RDL structure was fabricated by novel low Dk and Df polyimide and we tested bump shear strength after thermal cycle test. All shear mode were ductile solder failure without polyimide delamination. Because our novel polyimides show excellent dielectric, thermal and mechanical properties, they are suitable to insulator of RDL for FO-AiP.
Stabilized Sanathanan-Koerner Iteration for Rational Transfer Function Approximation of Scattering Parameters
Authors: Ma Andrew , Deaton Daniel , Engin Arif Ege 
Published: February 2022

Abstract
The vector-fitting algorithm has been the predominant method of macromodeling of high-frequency circuits for the past 20 years. Vector fitting is based on a partial-fractions basis to avoid the ill-conditioning of the Vandermonde matrices in direct fitting of the polynomial coefficients of a rational function. In a recent formulation of the Sanathanan- Koerner iteration, an orthogonal basis is obtained using the Arnoldi iteration significantly improving the conditioning and accuracy of rational approximation. This Stabilized Sanathanan-Koerner (SSK) iteration has been mostly applied on closed-form functions or data with no noise. We will utilize this SSK formulation for high-frequency package interconnect macromodeling. The method will be tested using empirical scattering parameters on a noisy transmission line system. The resultant curve fit will then be compared to several other polynomial and rational linear approximation methods, including the standard polynomial approximation. We show that the SSK method compares favorably to these different methods and provide a curve fit that can provide a reasonable approximation over different frequency ranges.
Design and Implementation of Harmonic RFID Based on Conventional UHF System
Authors: Purandare Aditya , Chu Yihang , Kumar Deepak , Mondal Saikat , Mason Andrew J. , Chahal Prem 
Published: February 2022

Abstract
There has been growing interest in the use of passive harmonic RFIDs for diverse range of applications. Conventional RFIDs are prone to self-jamming and multipath interference, and these challenges can be mitigated using the harmonic RFID design. Recently several harmonic RFID designs have been demonstrated. However, there are many designs related, packaging and intellectual property challenges associated with new tag designs. It has been well known that conventional RFIDs produce harmonic content, which is typically suppressed to reduce background noise. Previous experiments have demonstrated that the harmonics generated by conventional RFIDs can be utilized to enhance their performance. In this paper, an RFID chip is characterized for the generation of harmonic frequencies. This is carried out by designing a high frequency board that contains calibration structures along with structures to characterize the RFID chip using a one port network. An equivalent model is then developed, which in turn is used to design a dual band antenna that works at the fundamental and harmonic frequencies. In addition, the conventional RFID interrogator is modified to accommodate the measurement of harmonics generated by the RFIDs. A complete harmonic tag system is designed and implemented, and an example application of harmonic RFID is demonstrated. Here, the harmonic RFID tag is used in an industrial setting where there is large clutter (large reflections from metal structures).
Additively Manufactured Extreme Temperature Electronics Packaging
Authors: Shaddock David , Hoel Cathleen , Stoffel Nancy , Poliks Mark , Alhendi Mohammed 
Published: February 2022

Abstract
There is growing interest in extreme temperature electronics to support the mission needs to sense, actuate, and communicate at temperatures beyond the normal range of operations in commercial and military applications. Reliable packaging in the temperature range of more than 300°C has been demonstrated using ceramic multi-chip modules using conventional hybrid circuit technology. This approach typically requires high NRE costs and lead time. Additive manufacturing processes of metals, ceramics, conductors, and dielectrics provides a digital transformation of hybrid circuit manufacturing technology that reduces time and cost for packaging with the added benefits of novel 3D structures and embedded features. This report presents the results of testing to characterize important electrical and mechanical properties of additively manufactured packaging materials (substrates, conductor, dielectrics) and die interconnect methods needed for 300 to 750 °C electronic packaging designs.
Chiplets Heterogeneous Integration on High-Density Hybrid Substrate Using an Interconnect-Layer
Authors: Peng Chia-Yu , Lau John H , Ko Cheng-Ta , Lee Paul , Lin Eagle , Yang Kai-Ming , Lin Puru Bruce , Xia Tim , Chang Leo , Liu Ning , Lin Curry , Lee Tzu Nien , Wang Jason , Ma Mike , Tseng Tzyy-Jang 
Published: February 2022

Abstract
In this study, a high-density organic hybrid substrate for chiplets heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, fabrication, and characterization of the hybrid substrate with an interconnect-layer. A non-linear finite element analysis is performed to show the state of stress at the vias filled with a conductive paste of the interconnect-layer.
A Substrate-less Process for Heterogeneous Integration of mm-Wave Circuits
Authors: Crump Cameron , Chu Yihang , Chahal Premjeet 
Published: February 2022

Abstract
In this paper, a new ultra-compact substrate-less approach to heterogeneous integration of millimeter wave circuits is demonstrated. In the proposed process, active and passive components are placed face down on a temporary carrier. A thick layer of benzocyclobutene (BCB) is deposited surrounding these components using aerosol jet printing (AJP). This is followed by a combination of the blanket deposition of silver conductor and perforated BCB layers. This approach allows for the placement of chips close to each other leading to heterogeneous integration. Also, the front side is made planar, which allows for subsequent processing of low-loss interconnects. Here, as a proof of concept, a simple interconnect between two chips, placed close to each other, is demonstrated.
Advanced wire bonding standards for European automotive and power electronics industry
Authors: Schmitz Stefan , Schneider-Ramelow Martin 
Published: February 2022

Abstract
This article presents the wire bond standard DVS-2811, which is widely used in German-speaking and European countries. Introduced in 1996, this standard now contains definitions and limits for all currently used bonding methods, including the shear test on heavy/thick wire bond connections, which is missing in all other official standards. Especially considering the growing number of users in battery bonding, the specification of appropriate limits for testing thick wires is of important significance. In addition to an overview of the current status, an outlook is given on further updates that are due in the next 1–2 years.