bluuebunny/crossref_metadata_2025_split huggingface dataset:
PENYULUHAN TENTANG NARKOTIKA DAN SANKSI HUKUM DI DESA MERANGIN
Authors: Saputra Rian Prayudi 
Published: August 2022

Narkotika dan psikotropika merupakan obat atau bahan yang bermanfaat di bidang pengobatan, pelayanan kesehatan, dan pengembangan ilmu pengetahuan, dan pada sisi lain dapat menimbulkan ketergantungan yang sangat merugikan apabila dipergunakan tanpa pengendalian, pengawasan yang ketat dan seksama. Zat-zat narkotika yang semula ditunjukkan untuk kepentingan pengobatan, namun dengan perkembangan ilmu pengetahuan dan teknologi, jenis-jenis narkotika dapat diolah sedemikian banyak serta dapat pula disalah gunakan fungsinya. Peningkatan pengawasan dan pengendalian sebagai upaya mencegah dan memberantas penyalahgunaan dan peredaran gelap narkoba sangat diperlukan, karena kejahatan di bidang ini semakin berkembang baik dari segi kualitas maupun kuantitas. Sebagai contoh masyarakat di masyarakat Salo yang resah akibat beredar nya narkotika di kalangan Masyarakat dan anak dimerangin. Atas keluhan orang tua dan kurang nya eduksi dampak bahaya narkotika yang banyak tidak diketahui oleh masyarakat, orang tua dan anak-anak. Tindak pidana narkoba yang telah berkembang menjadi kejahatan yang bersifat transnasional yang dilakukan dengan menggunakan modus operandi dan teknologi yang canggih, termasuk pengamanan hasil-hasil tindak pidana narkoba. Perkembangan kualitas tindak pidana narkoba tersebut sudah menjadi ancaman yang sangat serius bagi kehidupan umat manusia, khususnya generasi muda, bahkan dapat menimbulkan bahaya yang lebih besar lagi bagi kehidupan dan nilai-nilai budaya bangsa. Anak adalah bagian dari generasi muda sebagai salah satu sumber daya manusia yang merupakan potensi dan penerus cita-cita perjuangan bangsa, yang memiliki peranan strategis dan mempunyai ciri dan sifat khusus, memerlukan pembinaan dan perlindungan dalam rangka menjamin pertumbuhan dan perkembangan fisik, mental, dan sosial secara utuh, serasi, selaras, dan seimbang. Pembicaraan tentang anak dan perlindungannya tidak akan pernah berhenti sepanjang sejarahkehidupan, karena anak adalah generasi penerus bangsa dan penerus pembangunan,yaitu generasi penerus yang dipersiapkan sebagai subyek pelaksana pembangunan yang berkelanjutan dan pemegang kendali masa depan suatu negara, tidak terkecuali Indonesia. Perlindungaan anak Indonesia berarti melindungi potensi sumber daya insani dan membangun manusia seutuhnya, menuju masyarakat yang adil dan makmur, materiil spiritual berdasarkan Pancasila dan UUD 1945. Dari pembicaraan tentang anak dan perlindungan inilah kita sering dihadapkan adanya penyimpangan perilaku di kalangan anak. Bahkan terdapat anak yang melakukan perbuatan melanggar hukum, salah satunya adalah penyalahgunaan narkoba. Bahaya penyalahgunaan narkoba dikalangan generasi muda merupakan suatu gejala sosial dalam masyarakat yang membawa dampak disegala aspek kehidupan.
Morphometrics of Adult Chinese Citrus Fly Bactrocera minax (Enderlein) (Diptera: Tephritidae) in Nepal
Authors: Adhikari D , Thapa R B , Joshi S L , Du J J 
Published: August 2022

Morphometric study of adult Chinese citrus fly, Bactrocera minax (Enderlein) was carried out on May, 2020 at Sindhuli, Nepal. The mean body length of female recorded significantly higher, 14.29 ± 0.20 mm, than male, 12.52 ± 0.26 mm, with the mean difference of 1.77 mm (p = ≤ 0.001). Females had a wider body (3.90 ± 0.06 mm) compared to males (3.39 ± 0.05 mm) (p = ≤ 0.001) which differed significantly by 0.51 mm. Adult female possessed a wider wingspan, i.e. 23.51 ± 0.23 mm significantly different than adult male, i.e. 22.80 ± 0.19 mm with the mean difference of 0.71 mm (p = ≤ 0.05). Similarly, the average wing length measured 8.82 ± 0.13mm in male and 9.05 ± 0.11 mm in female with the mean difference of 0.23 mm. The ovipositor length recorded 4.52 ± 0.12 mm. This information is useful to distinguish between Chinese citrus fly and other fruit fly species of citrus orchards and useful in planning of the suitable management options.
अनुराधा : पहिचान र विद्रोह {Anuradha: Identity and Rebellion}
Authors: पन्त ‘प्रतीक्षा’ Panta 'Pratikshya' साधना sadhana 
Published: August 2022

विजय मल्लको ‘अनुराधा’ उपन्यासमा पितृसत्तात्मक मूल्य–मान्यताभित्र नारीले झेल्नुपर्ने उत्पीडनको प्रस्तुति गर्नाका साथै सोही उत्पीडनका बिचबाट नायिका अनुराधाको विद्रोह अभिव्यक्त भएको छ । त्यसैले प्रस्तुत लेखमा आमूल नारीवादी सैद्धान्तिक मान्यताअन्तर्गत पहिचान र विद्रोहका आधारहरूको प्रस्तुति गर्दै पितृसत्तात्मक सामाजिक संरचनाभित्र नारीहरूले झेल्ने उत्पीडन तथा त्यसका विरुद्ध उनीहरूले चाहेको पहिचान तथा विद्रोह सम्बन्धी मान्यताको चर्चा गरिएको छ । उपर्युक्त सैद्धान्तिक मान्यताका आधारमा अनुराधा उपन्यासमा प्रयुक्त पितृसत्तात्मक मूल्यभित्र अभिव्यक्त पहिचान र विद्रोहको विश्लेषण गरिएको प्रस्तुत लेखमा मल्लले आफ्नो यस उपन्यासमा नारीउत्पीडन तथा पहिचान र विद्रोहको प्रस्तुतिका माध्यमबाट स्थापित पुरातन मूल्यमान्यतामा परिवर्तन हुनुपर्ने आशय व्यक्त गरेको निष्कर्ष निकालिएको छ ।
{Vijay Malla is a feminist novelist. His novel Anuradha is also analyzable from a feminist perspective. It is structured in a patriarchal social environment. In addition to presenting the oppression that women have to endure within the patriarchal values amid the same oppression, the heroine Anuradha has revolted against the oppression in search of her existence. Although this novel has been analyzed from other angles, it has not been done from a feminist angle. To fill this gap, the present article explores the contexts of identity and rebellion by collecting data from library work and making the feminist theoretical framework the basis of analysis. The data is analyzed in an explanatory and critical method. In this novel, it is concluded that there is a need to change the old values established through the presentation of women's oppression and identity, and rebellion.}
भाषा र वाक् भाषिक सिद्धान्त साहित्य विश्लेषणको आधार {Language and Speech Theory: The Basis of Literary Analysis}
Authors: शर्मा Sharma सुकुम Sukum 
Published: August 2022

ससुरका भाषासम्बन्धी मान्यता भाषा ( Langue ) र वाक् (Parole) का केन्द्रमा रही यस लेखमा साहित्यको अध्ययन, विश्लेषणको एक आधार वा पद्धति निर्माण गरिएको छ । ससुरको मान्यता सामाजिक पक्ष भाषा र वैयक्तिक प्रयोगबोली भन्ने रहेको छ । यस आधारमा रहेर साहित्य सिर्जना या चिन्तनका विश्लेषणका क्रममा सामाजिक पक्ष र वैयक्तिक पक्षको खोजी गरिएको छ । यसमा भाषालाई सामाजिक पक्ष र बोली वैयक्तिक पक्षका आधारबाट भाषिक व्याख्या गर्दा बनाइएका मान्यता साहित्यका सन्दर्भमा प्रयोग गरी साहित्य सिर्जनाको दार्शनिक आधार र विश्लेषणको स्पष्ट खाका कोरिएको छ । भाषा समाजको आधारभित्र रहेर बोलीका रूपमा मूर्त हुन्छ भन्ने मान्यताबाट आन्तरिक र बाह्य संरचनाको चिन्तनगत परम्परा विकास भएको छ र यो मान्यता साहित्य सिर्जनामा पनि देखिन्छ भन्ने निष्कर्ष यस अध्ययनमा आएको छ । भाषा र वाकको यही सामाजिक र वैयक्तिक पक्षको आधारमा रहेर साहित्यको मूल्यबोधको मार्ग निर्धारण गर्दा साहित्यको आधार पनि समाजसँग जोडिएको हुन्छ र साहित्यिकता समाजको साझा पक्ष हो भने रचना बोली जस्तै वैयक्तिक पक्षमा अर्थिने गर्दछ भन्ने मान्यता यस लेखमा प्रस्तावना गरिएको छ । भाषा र बोलीको सम्बन्धगत मान्यतासँग साहित्यको समाज र व्यक्तिसँगको उत्तरदायित्वको अर्थ नै यस लेखमा खोजी गरिएको विशेषपक्ष हो । यस लेखमा नमुना पद्धतिबाट सामग्री चयन गरिएको छ र विश्लेषणमा गुणात्मक अध्ययन पद्धति अवलम्बन गरिएको छ । यस क्रममा आफर कृतिको साहित्यिकता र रचनागत पक्षको मूल्यबोध गर्दै यस मान्यताको व्यावहारिक प्रयोग पनि यस लेखमा प्रस्तुत छ ।
{This article does a comparative study and analysis of literature focusing on the ideas of Ferdinand de Saussure, langue and parole. Saussure believed that the social aspect waste language and that the language of personal use was parole. The process of analyzing literary creation or thought has explored the social and individual aspects. It identifies the social function of language and interprets dialect based on individual aspects in the context of literature. It emphasizes that language is an abstract expression of a society that exists within a dialect. A contemplative tradition has developed around language's internal and external structure in this context. This study concluded that this concept is also seen in the creation of literature. Language and speech play an important role in determining the value of literature. Thus, the basis of literature is also connected to society. If this literature is a common element of society, it implies the individual element, such as composition and speech. This article explains how this relationship is accomplished. In this article, it is the meaning of the responsibility of literature towards society and individuality along with the related beliefs of language and dialect that are explored. This article was accumulated using the sampling method. The analysis in this article has been conducted using a qualitative method. In this article, the value of the literary and creative side of the work called the text Aaphar is emphasized. The practical application of this belief is also discussed.}
High Stability, High Enthalpy APS Process Based on Combined Wall and Gas Stabilizations of Plasma (Part 1: Process and Coatings Introduction)
Authors: Mor Gianpaolo , Belashchenko Vladimir 
Published: August 2022

Abstract
The paper describes the major features of a recently developed high voltage – low current air plasma spray (APS) process and torch that is based on combined wall and gas stabilizations of plasma (C+Plasma). It is shown that the C+Plasma process is capable of efficiently generating stable plasmas without drifting or pulsing. Plasma gas selection includes N2, N2-H2, N2-Ar-H2, Ar-H2(He), etc. Availability of stable N2-H2 plasmas having enthalpies within 30-70 kJ/sl range offers a new level of APS efficiency and coating quality. The paper includes illustrations of the C+Plasma durability, stability and expanded operating window. The process capability is also illustrated by properties of the advanced MCrAlY bond coatings and dense segmented TBCs (thermal barrier coating).
Wear Behaviour of Conventional and Nanostructured Thin Films of Titanium Aluminium Nitride
Authors: Grewal Jasmaninder Singh , Sidhu Buta Singh , Prakash Satya 
Published: August 2022

Abstract
Titanium aluminium based nitride (Ti, Al)N coatings possess excellent tribological behaviour with respect to metal cutting and polymer forming contacts. In the present work TiAlN coatings were deposited by plasma spray process. Three coatings of TiAlN were deposited on AISI-347 grade boiler steel substrate out of which two were thin nano coatings deposited at different temperatures of 500°C and 200°C and one conventional coating was deposited by plasma spraying. The as sprayed coatings were characterized with relative to coating thickness, microhardness, porosity and microstructure. The optical microscopy (OM), the XRD analysis and field mission scanning electron microscope (FESEM with EDAX attachment) techniques have been used to identify various phases formed after coating deposited on the surface of the substrate. Subsequently the sliding wear behaviour of uncoated, PVD sprayed nanostructured thin TiAlN coatings deposited at 500°C and 200°C and plasma sprayed conventional coated AISI-347 grade boiler steel were investigated according to ASTM standard G99-03 using pin on disk wear test rig. Cumulative wear volume loss and coefficient of friction, μ were calculated for the coated as well as uncoated specimens for 10, 15 and 20 N normal loads at a constant sliding velocity of 1 m/sec. The worn out samples were analysed with SEM/EDAX. Wear rates in terms of volumetric loss (mm³/g) for uncoated and coated alloys were compared. The nanostructured TiAlN coatings deposited at 500°C and 200°C has shown minimum wear rate as compared to conventional TiAlN coating and uncoated AISI-347 grade boiler steel. Nanostructured TiAlN coatings were found to be successful in retaining surface contact with the substrate after the wear tests.
Trends and Roadmap for Outsourcing and Services in the FA Industry
Authors: Villemain Michel 
Published: August 2022

Abstract
The market for semiconductor manufacturing equipment has consolidated rapidly over the last decade; where there were once hundreds of potential customers, there are now perhaps a dozen in the first tier. This transformation has been driven primarily by the dramatic growth in the cost and complexity of the manufacturing process and has caused a shift in the priorities that guide purchasing decisions—from technical performance to asset utilization. These changes are also reflected in the failure analysis (FA) lab, where rising tool costs and operator expertise requirements have made it increasingly difficult to justify the investment required to maintain a complete state-of-the-art capability. Outsourcing some FA activity has become increasingly attractive.
Laser-Induced Detection Sensitivity Enhancement with Laser Pulsing
Authors: Quah Alfred C.T. , Meng Chua Choon , Tan Soon Huat , Koh Lian Ser , Phang Jacob C.H. , Tan Tam Lyn , Gan Chee Lip 
Published: August 2022

Abstract
The use of a pulsed laser with a lock-in amplifier has been shown to increase the detection sensitivity of scanning optical microscopes by a factor of ten. In this article, the authors explain how they implement laser pulsing without a lock-in amplifier through software control. The detection sensitivity of their method, which is based on a digital signal integration algorithm, has been shown to be comparable to that achieved with a lock-in amplifier. Several case studies illustrate the effectiveness of the technique for locating various types of defects.
Distortion-Free Measurements of Analog Circuits by Time-Resolved Emission
Authors: Sarault Keith R. , Boon Gerben 
Published: August 2022

Abstract
Time-resolved emission (TRE) systems are used in many FA labs for internal timing analysis of digital ICs. In this article, the authors explain how they use TRE systems to diagnose analog circuit failures as well. The key to their success is the use of an asynchronous trigger on the emission detector, which eliminates measurement error due to nonlinear distortion. A case study of an analog amplifier failure caused by a polysilicon short demonstrates the effectiveness of their technique.
Advanced Flash Memory Analysis
Authors: Harber Keith , Subramanian Sam , Chrastecky Tony , Ly Kheim , Petri Charles 
Published: August 2022

Abstract
This article presents a case study involving flash memory bit failures characterized by threshold voltage changes due to positive gate disturb stress. An inconsistency in failing bit behavior, which was found to be dependent on the test mode, was explored to provide an electrical explanation for the failure. The underlying defect was isolated and subsequently identified by physical analysis.
Managing Safety in a Failure Analysis Laboratory
Authors: Keating Fergal 
Published: August 2022

Abstract
This article discusses the importance of failure analysis lab safety and presents best practices for setting up and maintaining an effective safety program. It explains how to identify hazards and assess risks associated with X-ray and laser radiation, liquid nitrogen, compressed gases, and soldering processes. It also discusses the use of personal protective equipment, the implementation of practical controls, key performance indicators, and safety standards and regulations.
ISTFA 2009 Panel Discussion: “The FA Engineer’s Career—Past, Present, and Future. What Does the Future Hold for a Career in This Field?”
Authors: Keim Martin 
Published: August 2022

Abstract
Summary of a panel discussion held at ISTFA 2009 to address the following questions. Where is failure analysis heading as a business? What career options are open to an engineer in this field? How do I demonstrate my value to management? Which skills and knowledge will be needed tomorrow? What can I do to find new employment? Should I start or continue my career in semiconductor failure analysis?
Focus on Innovation in Failure Analysis Technology
Authors: Vallett Dave 
Published: August 2022

Abstract
The EDFAS Board of Directors (BOD) has undertaken an initiative to help drive the development of failure analysis methods as leading-edge semiconductor technology approaches the sub-20 nm regime. To streamline efforts and leverage existing work, the BOD recently surveyed its constituency to gauge their opinions on the capability gaps identified by the Sematech councils. This article briefly discusses the methodology of the survey and provides a summary of the responses along with key findings.
What’s Been Happening with the IVAs?
Authors: Cole Edward I. 
Published: August 2022

Abstract
One of the pioneering developers of induced voltage alteration (IVA) measurement techniques assesses the current state of the technology, the impact of major advancements, and the potential for further improvements. The assessment pays particular attention to biasing approaches, phase-locked loop detection techniques, the effect of solid immersion lenses on spatial resolution, and the emergence of production-type sample preparation methods.
Understanding the Effects of Local Structures on TIVA Profiles Using Thermal Modeling and Simulation
Authors: Tangyunyong Paiboon , Cole Edward I. 
Published: August 2022

Abstract
Thermally-induced voltage alteration (TIVA) is a laser-based method for localizing interconnect defects in ICs. Its main limitation is that the laser must heat the defect and change its resistance sufficiently to produce a measurable voltage alteration. Anything that interferes with laser absorption or alters defect heating makes TIVA less effective. This article presents the results of a study on the effects of local structures on TIVA imaging. The authors selected a polysilicon-metal test structure as the focal point of their study, which entailed experimental investigation along with modeling and simulation. It was found that the TIVA profiles on this structure are strongly influenced by local geometry, particularly the variation of interlevel silicon dioxide thickness and the placement of polysilicon lines with respect to aluminum lines. Understanding such relationships is essential for locating defects using TIVA techniques.
Advanced Dynamic Laser-Stimulation Methods Using Lock-In and Mixed-Frequency Techniques
Authors: Brillert Christof , Qian Zhongling , Burmer Christian 
Published: August 2022

Abstract
A wide range of electrical faults are revealed through thermal laser stimulation (TLS). In principle, an electrical parameter, typically current or voltage, is monitored for changes caused by the heating effects of the laser. Most test setups are designed to limit the activity of the device in order to minimize the signal-to-noise ratio, but in some cases, the fault’s electrical footprint can only be detected when the device is stimulated in a dynamic way. This article describes the setup and implementation of various dynamic TLS methods and presents example applications demonstrating the advantages and limitations of each approach.
Site-Specific Analysis of Advanced Packaging Enabled by Focused Ion Beams
Authors: Young Richard J. 
Published: August 2022

Abstract
Packaging integration continues to increase in complexity, driving more samples into FA labs for development support and analysis. For many of the jobs, there is also a need for larger removal volumes, compounding the demand for tool time and throughput. Focused ion beam (FIB) and dual-beam FIB/SEM systems are helping to relieve the pressure with their ability to create site-specific cross sections and to facilitate gate-level circuit rewire and debug. This article reviews the impact of packaging trends on failure analysis along with recent improvements in FIB technology. It also presents examples that illustrate how these new FIB techniques are being applied to solve emerging packaging challenges.
ISTFA 2010: ISTFA 2010 Wrap-Up
Authors: Vanderlinde William 
Published: August 2022

Abstract
The 36th International Symposium for Testing and Failure Analysis (ISTFA 2010) was held in Dallas, Texas, November 14-18, 2010. This article gives a brief summary of the keynote presentation, technical program, panel discussions, tutorials, and User’s Group meetings.
Recent Advances in Acoustic Microimaging of Thin-Silicon Devices
Authors: Semmens Janet , Adams Tom 
Published: August 2022

Abstract
Acoustic microimaging has advanced over the past few years in response to the growing use of thinner silicon die and innovative packaging designs. This article reviews the basic principles of acoustic imaging technology and describes some of the applications made possible by improvements in spatial resolution, focal length, F-number, and water couplant temperature control. It also discusses common imaging challenges and explains how they can be resolved.
Commentary on Applications of EDS in Silicon IC Manufacturing and Failure Analysis
Authors: Li-Lung Lai 
Published: August 2022

Abstract
This article provides a practical overview of energy-dispersive spectroscopy (EDS) and its various uses in semiconductor device manufacturing and failure analysis. It explains how EDS techniques are typically implemented, compares and contrasts different methods, and discusses the factors that determine spatial and energy resolution, measurement depth, sensitivity, signal-to-noise ratio, and ease of use.
Variations on FIB in situ Lift-Out for TEM Sample Preparation
Authors: Hartfield Cheryl , Hammer Matt , Amador Gonzalo , Moore Tom 
Published: August 2022

Abstract
This article discusses the practice of FIB-based in situ lift-out, a sample preparation method that has proven particularly useful for failure analysis. It explains how samples are now being made for a wide range of TEM techniques, including holography, tomography, high-angle annular dark-field scanning, and electron energy-loss spectroscopy. In most cases, achieving optimal quality requires the use of alternate FIB milling angles, as in plan-view, sideways, and backside milling, all of which are discussed.
Tin Whisker Risk Assessment for Space Systems
Authors: Mason Maribeth , Eng Genghmun , Leung Martin , Stupian Gary , Yeoh Terence 
Published: August 2022

Abstract
Tin whiskers are single-crystal filaments that can grow from tin-plated copper or nickel components. This article discusses the effect of plating thickness, composition, and grain size on tin whisker formation and explains how to assess damage potential based on microanalysis, whisker length distribution models, and metal vapor arc risk factors. The authors also present and analyze several examples of failures caused by tin whisker formation in space systems.
Finding the Invisible Contaminants in CMOS Image Sensor Pixels: The DCS Technique
Authors: Domengie Florian , Morin Pierre , Bauza Daniel 
Published: August 2022

Abstract
This article discusses the basic principles of dark current spectroscopy (DCS), a measurement technique that can detect and identify low levels of metal contaminants in CMOS image sensors. An example is given in which DCS is used to determine the concentration of tungsten and gold contaminants in an image sensor and estimate the dark current generated by a single atom of each metal.
New Challenges in Testing and Failure Analysis for Microsystems-Enabled Photovoltaics Modules
Authors: Cruz-Campa Jose-Luis , Kim Bongsang , Jared Bradley , Okandan Murat , Nielson Gregory N. , Ballance Mark , Nordquist Chris , Sweatt William , Lentine Anthony 
Published: August 2022

Abstract
Engineers at Sandia National Laboratories have developed a technology that may bring down the cost and improve the efficiency of photovoltaic energy conversion. Here they explain how they manufacture photovoltaic modules containing as many as 100,000 silicon solar cells using conventional IC fabrication and PCB assembly techniques. They also explain how they estimate module efficiency based on the IV characteristics of individual cells and the detection of open and short circuits.