bluuebunny/crossref_metadata_2025_split huggingface dataset:
Pitfalls and Traps of Failure Analysis
Authors: Burgess David 
Published: August 2022

Abstract
Diagnostic failure analysis tools provide essential information about where a defect is located and what materials are present, but that information must be combined with other data to establish cause and corrective action. Mistakes made at this stage of the investigation can be extremely costly. This article identifies some of the pitfalls and traps that failure analysts can fall into and explains how to avoid them. It provides three examples of misdiagnosed failures and helps readers to see what led analysts astray.
Fault Site Localization Technique by Imaging with Nanoprobes
Authors: Nokuo Takeshi , Furuya Hitoshi 
Published: August 2022

Abstract
This article discusses the advantages of SEM-based nanoprobing and the various ways it can be used to locate defects associated with IC failures. It describes the basic measurement physics of electron beam induced current, absorbed electron, and voltage distribution contrast imaging and presents examples showing how the different methods are used to isolate low- and high-resistance sites, shorts, and opens as well as ion implantation and metal patterning defects.
Lock-in Thermography: A Versatile Tool for Failure Analysis of Solar Cells
Authors: Bauer Jan , Breitenstein Otwin , Wagner Jan-Martin 
Published: August 2022

Abstract
Lock-in thermography (LIT) is a powerful fault isolation and characterization tool for solar cell ICs. This article describes the basic LIT imaging process on silicon wafer-based solar cells as well as its various modes, applications, and results.
How to Succeed in Failure Analysis and Fail in Root-Cause Analysis
Authors: Horev Menachem 
Published: August 2022

Abstract
Root-cause analysis and FA work hand-in-hand to identify the source of a problem, gather relevant data, and resolve the issue. However, even experienced professionals can succeed in FA while failing in the outcome. This article explains how to avoid common traps, dead ends, and faulty thought processes in the search for root causes.
Nanoprobing SRAM Bit Cells with High-Speed Pulses
Authors: Stallcup Richard E. , Inoue Kanzan 
Published: August 2022

Abstract
This article presents a nanoprobing method that uses high-speed pulses to characterize in-die SRAM bit cells. The authors describe the basic setup of the test system and demonstrate its use on a six-transistor bit cell failure. The method reduces fault localization time and decreases the possibility of deprocessing past the fail because testing is done at metallization layer 1. The bit’s reaction is captured in the form of analog current measurements, resulting in a unique signature of the failure.
Detrimental Effects of Excessive Gold Plating on Lead-Free Solder Joints
Authors: Asrar Nausha 
Published: August 2022

Abstract
This article presents two case histories that shed light on the role of gold in lead-free solder joint failures and the damage mechanisms involved. One of the failures, a brittle fracture of the solder joint, is attributed to the synergistic effects of voids, intermetallic compounds, and CTE mismatch. The investigation of the other failure revealed evidence of tin-whisker formation. As the author explains, the growth of tin whiskers is due to compressive stress in the tin solder material caused by diffusion of end-cap metals (Ni and Cu) and the formation of Sn-Ni-Au intermetallics. In both cases, the failures can be prevented by limiting the thickness of gold on all components.
Scanning Capacitance Microscopy (SCM) Applications in Failure Analysis
Authors: Wang Xiang-Dong 
Published: August 2022

Abstract
Scanning capacitance microscopy (SCM) has proven to be an effective tool for investigating doping-related failure mechanism in ICs. The examples in this article show how the author used SCM to solve various problems including premature breakdown due to pattern misalignment, threshold voltage variations caused by poly gate doping anomalies, and source-drain leakage due to channeling effects.
Emerging Techniques for 3-D Integrated System-in-Package Failure Diagnostics
Authors: Altmann Frank , Petzold Matthias 
Published: August 2022

Abstract
Failure analysis is becoming increasingly difficult with the emergence of 3D integrated packages due to their complex layouts, diverse materials, shrinking dimensions, and tight fits. This article demonstrates several FA techniques, including high-frequency scanning acoustic microscopy, lock-in thermography, and FIB cross-sectioning in combination with plasma ion etching or laser ablation. Detailed case studies show how the various methods can be used to analyze bonding integrity between different materials, chip-to-chip interface structures, buried interconnect defects, and through-silicon vias at either the device or package level.
ESREF 2011 in Bordeaux
Authors: Perdu Philippe 
Published: August 2022

Abstract
The 22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2011) was held October 3 to 7, 2011, in Bordeaux, France. The conference concentrated on two main areas in electronics that concern designers, manufacturers, and users: (1) strategy for quality and reliability assessment of electronic circuits and systems, and (2) advanced analysis techniques for technology and product evaluation. This article reports on highlights of the technical program.
G-19 Update: Management of Testing and Inspection Data Generated from Counterfeit Parts Inspection
Authors: Sood Bhanu , George Paula M. 
Published: August 2022

Abstract
Counterfeit electronic parts have become a significant cause of concern in the electronics part supply chain. Several factors that contribute to the targeting of the electrical, electronic, and electromechanical (EEE) parts market by counterfeiters include parts obsolescence, extended lead times, the absence of verification tools, the availability of scrapped or salvaged parts, and the high costs associated with inspection/testing procedures. This article reports on the status of efforts by the G-19 Committee of SAE International to develop standards in response to increasing numbers of counterfeit parts in the supply chain.
Space Domain Reflectometry for Opens Detection in Stacked-Die Packages
Authors: Gaudestad Jan , Talanov Vladimir V. , Chih Huang Po 
Published: August 2022

Abstract
Failure analysis labs are fairly well equipped for dealing with shorts and leakages in stacked-die packages, but are at a disadvantage when it comes to opens, particularly those at the die or die interconnect level. This article presents a new FA technique that has the potential to make up for this shortcoming. The new method, called space domain reflectometry (SDR), is based on radio-frequency magnetic current imaging, and as the authors show, is capable of accurately locating a dead open in a double-stacked BGA package, even when the full stack is encapsulated in molding compound.
Failure Analysis of Electronic Material Using Cryogenic FIB-SEM
Authors: Antoniou Nicholas 
Published: August 2022

Abstract
FIB milling is difficult if not impossible with III-V compound semiconductors and certain interconnect metals because the materials do not react well with the gallium used in most FIB systems. This article discusses the nature of the problem and explains how cryogenic FIB-SEM techniques provide a solution. It describes the basic setup of a FIB-SEM system and provides examples of its use on InN nanocrystals, GaN films, and copper-containing multilayer photovoltaic materials.
The IARPA Circuit Analysis Tools Program
Authors: McCants Carl E. 
Published: August 2022

Abstract
The semiconductor industry continues to scale microelectronics in accordance with Moore’s Law, as the minimum feature size on integrated circuits has decreased from 800 nm in 1993 to 90 nm in 2003 to 22 nm today. In addition, manufacturing advances include 3-D packaging, with multiple dice stacked in various configurations, and 3-D integrated circuits that use through-silicon vias or through-oxide vias to connect the various dice layers. The Intelligence Advanced Research Projects Activity (IARPA) Circuit Analysis Tools (CAT) program is developing tools and techniques to ensure that the U.S. government has capabilities for circuit analysis at future technology nodes, specifically at 22 nm and beyond, and for chips assembled using advanced packaging techniques. This column describes the CAT program activities and goals.
Finding the “When” and Improving the “Where” With Picosecond Time-Resolved LADA
Authors: Bodoh Dan , Erington Kent 
Published: August 2022

Abstract
Laser-assisted device alteration (LADA) is an effective tool for identifying speed-limiting paths in ICs. When implemented with a continuous wave laser, it can reveal where the speed-limiting path resides but not when the slow (or fast) logic transition is occurring. To overcome this limitation, an enhanced version of the technique has been developed. This article discusses the capabilities of the new method, called picosecond time-resolved LADA, and explains how it complements the existing failure analysis toolset, facilitating faster resolution of issues and root-cause identification.
Emerging Techniques in Atomic Force Microscopy: Diamond Milling and Electrostatic Force Microscopy
Authors: Ippolito Stephen , Zumwalt Sean , Erickson Andy 
Published: August 2022

Abstract
Atomic force microscopy has been a consistent factor in the advancements of the past decade in IC nanoprobing and failure analysis. Over that time, many new atomic force measurement techniques have been adopted by the IC analysis community, including scanning conductance, scanning capacitance, pulsed current-voltage, and capacitance-voltage spectroscopy. More recently, two new techniques have emerged: diamond probe milling and electrostatic force microscopy (EFM). As the authors of the article explain, diamond probe milling using an atomic force microscope is a promising new method for in situ, localized, precision delayering of ICs, while active EFM is a nondestructive alternative to EBAC microscopy for localization of opens in IC analysis.
A Process for Thinning and Polishing Highly Warped Die to High Surface Quality And Consistent Thickness: Part I
Authors: Martin Kirk A. 
Published: August 2022

Abstract
This article, the first in a two-part series, discusses the challenges of thinning highly warped die and explains how they can be overcome with contour machining driven by thickness measurements. The machine that was used measures die surface profiles in situ, producing a wire frame model by which it controls the rotation and movement of the tooling spindle. The thinning process used in this demonstration consists of a grinding step followed by several rounds of lapping, resulting in a uniform die thickness with minimal surface imperfections. The mechanical limitations of flattening a curved die in preparation for die thinning will be discussed in Part II of this article in the November 2015 issue of EDFA.
Take a Closer Look at Electrically-Enhanced LADA: Setup
Authors: Goh S.H. , Yeoh B.L. , You G.F. , Chan Y.H. , Lin Zhao , Lam Jeffrey , Chua C.M. 
Published: August 2022

Abstract
This article explains how hardware and software enhancements bring new capabilities to one of the most widely used soft-defect localization techniques. It discusses the basic concept of electrically enhanced laser-assisted device alteration (EeLADA) and demonstrates its use on different types of soft and hard defects. It also discusses the relative advantages of hardware and software implementations.
3-D Technology: Failure Analysis Challenges
Authors: De Wolf Ingrid 
Published: August 2022

Abstract
Chip-level 3D integration, where chips are thinned, stacked, and vertically interconnected using TSVs and microbumps, brings as many challenges as it does improvements, particularly in the area of failure analysis. This article assesses the capabilities of various FA techniques in light of the challenges posed by 3D integration and identifies current shortcomings and future needs.
Medical Applications of Vat Polymerization
Authors: Kanematsu Hideyuki , Barry Dana M. , Noorani Rafiqul , McGrath Paul 
Published: August 2022

Abstract
Of the seven additive manufacturing (AM) processes, this article focuses on the vat photopolymerization, or simply vat polymerization, process, while briefly discussing the other six AM processes. Vat polymerization and its characteristics, AM applications in medical fields, and the regulatory challenges of vat polymerization-based bioprinting are presented.
URGENSI PENCEGAHAN PERUNDUNGAN DUNIA MAYA (CYBERBULLYING) TERHADAP PELAJAR
Authors: Al Adawiah Rabiah , Esther Masri  
Published: August 2022

Perundungan dunia maya (Cyberbullying) telah menjadi fenomena yang mengkhawatirkan dalam satu dekade terakhir, terutama di kalangan pelajar. Cyberbullying merupakan bentuk baru dari bullying yang melibatkan penggunaan media elektronik. Berbeda dengan bentuk-bentuk bullying lainnya, cyberbullying mencapai audiens yang jauh lebih luas dengan kecepatan tinggi, melampaui batas waktu dan ruang fisik dan pribadi. Dampak kasus cyberbullying lebih dahsyat daripada perundungan biasa, karena meninggalkan rekam digital seperti foto, video, dan tulisan sehingga ingatan dan rasa malu bagi korban akan terus ada selama jejak digital tersebut diakses oleh orang lain. Oleh karena itu, pentingnya upaya pencegahan agar dapat terhindar dan tidak terjerumus dalam bahaya dan dampak cyberbullying beserta aspek hukum yang mengaturnya. Kegiatan yang dilakukan di kalangan pelajar berupa penyuluhan melalui Webinar merupakan upaya pencegahan (preventif) yang perlu dilakukan agar siswa dapat terhindar dari bahaya dan dampak perundungan dunia maya (cyberbullying) serta aspek hukum yang mengatur jika terjadi tindakan cyberbullying. Tujuan dari kegiatan ini adalah meningkatkan pengetahuan dan pemahaman kepada siswa SMK Industri Nasional 1, Setu Bekasi, agar terhindar dari tindakan cyberbullying baik sebagai pelaku maupun korban.
Distribusi Spasial Habitat Larva, Kepadatan Anopheles sp dan Kasus malaria di Kampung Kiren Distrik Bonggo Kabupaten Sarmi
Authors: Hastuty Henny Sesanti Budi , Herman Theresie Chindyana , Pabarri Irfan , Randa Hiskia Batara , Bisim Yusuf Syerim 
Published: August 2022

Geographic Information Systems (GIS) can be used to describe health problems, one of the problem can be described is malaria. Malaria is still a major health problem for people in Papua. Papua Annual Parasite Incidence (API) is the highest in Indonesia (Kemenkes RI, 2017). This study aims to describe the spatial distribution of larval habitat, adult mosquito density, and the distribution of malaria patients in January-April 2019 in Kiren Village, Bonggo District. The results showed that there were 29 positive habitats of Anopheles sp larvae, consisting of puddles (69.0%), sago marsh (3.4%), artificial ponds (13.8%), and gutters (13, 8%), the habitat is spread almost evenly throughout the Kiren Village area. Larvae species caught were: An.punctulatus (17.2%), An.maculatus (31.0%), An.farauti (6.9%), An.telatelatus (3.4%), and An.longirostris (31.0%) and not identified 10.3%. The highest density of adult mosquitoes is 7 mosquito/person/ night, the lowest is 1.5 mosquito/person/night, with an average of 3.6 mosquito/ person/night. Adult mosquito species caught : An.maculatus (37.9%), An.karwari (10.3%), An.punctulatus (31.0%), An.farauti (13.8%), and An.longoristris (6.9%). Malaria patients highest based on age group is in the 20-44 years (39.3%), and by sex in the female group (62.5%). The conclusions of this study are as follows: the highest larval habitat is puddles, the most caught larvae species are An.maculatus and An.longirostris, high mosquito density/ high MBR, adult mosquito species are mostly caught is An.punctulatus, the highest malaria patients based on age group is in the 20-44 years old and based on sex from female group
DYNAMIC ARCHIVE DISTRIBUTION APPLICATION FOR PT. PERUSAHAAN GAS NEGARA TBK AREA SEMARANG
Authors: Jaya Sulistiyo Mutiara , Hermawan Iwan , Suwardi Suwardi 
Published: August 2022

<p><em>PT. Perusahaan Gas Negara Tbk (PGN) is a company engaged in the field of natural gas transmission and distribution in Indonesia. One of the sales offices is in Semarang, Central Java. Administrative activities in a service company like PGN really need to be considered. One such activity is the management and distribution of archives. Archives are very useful for companies in various activities. The purpose of this research is to provide convenience in the management and distribution of archives at PGN area Semarang. This study designed a dynamic archive distribution application using software Microsoft Visual FoxPro 9.0 with rapid application development (RAD) research methods. The results of this study provide efficiency in managing archives such as input, retrieval, and distribution of archives at PGN area Semarang. </em></p>
Analysis of the effect of Customer Value and Service Quality on Customer Satisfaction at PT Tera Logistik Indonesia Semarang Branch
Authors: Yoza Prima - , Suroija Noor - , Wahyuni Sri - 
Published: August 2022

<em>The title of this research is The Effect of Customer Value and Service Quality on Customer Satisfaction at PT Tera Logistik Indonesia Semarang Branch. PT Tera Logistik Indonesia Semarang branch is one of 57 ship agency companies in Semarang, Central Java (inaportnet.dephub.go.id). This condition make the company to compete for customer. As a company engaged in service sector, the compatition is competing to provide satisfactory services to consumer. At PT Tera Logistik Indonesia there was a decrease in the number of service usage in 2019, the decrease in the number of customers was inseparable from the quality of service and value provided by the company to customers. The purpose of this study was to analyze the effect of customer value and service quality on customer satisfaction at PT Tera Logistik Indonesia Semarang branch. This study used a saturated sampling technique, with a sample size of 39 customers. The analysis technique used is multiple linear regression and classical assumption test. The results of this study indicate that partially, customer value has a significant effect on customer satisfaction and service quality has a significant effect on customer satisfaction. And simultaneously the variables of customer value and service quality have a significant and positive effect on customer satisfaction with an influence contribution of 53.7%. This shows that PT Tera Logistik Indonesia Semarang Branch has to pay attention of satisfaction from customers needs to increasing customer value and the quality service that provided to customers.</em>
Penerapan Model Latihan Daya Tahan Kardiovaskuler With The Ball Permainan Sepak Bola SSB BU Pratama
Authors: Sandika Adhis , Mahfud Imam 
Published: August 2022

This study discusses the cardiovascular endurance training model to increase the VO2max of soccer players. The aim of this cardio research is to determine cardiovascular improvement through the application of an endurance training model with soccer ball players aged 14-17 years. This research applies an experimental method using the One Group Pretest Posttest Design. The sample in this study was 30 Bintang Utara Star Pratama Soccer School’s players. A total of 30 players who were actively practicing and were not injured from all Bintang Utara Pratama Soccer School’s players. Based on the results of the study, which showed that the cardiovascular endurance training model with the soccer ball players was 0.00 0.05 then the control group got a significance value of 0.873 0.05, so it can be concluded that there was a significant effect on the experimental group. Keywords : Training, Cardiovaskuler, Soccer
Analisis Nilai Nilai Pendidikan Karakter Pada Siswa Ektrakurikuler Karate BKC SMAN 1 Terbanggi Besar
Authors: Suanda Suanda , Nugroho Reza Adhi 
Published: August 2022

Pendidikan karakter menjadi isu penting dalam dunia pendidikan akhir-akhir ini, hal ini berkaitan dengan fenomena dekadensi moral yang terjadi ditengah-tengah masyarakat maupun di lingkungan pemerintah yang semakin meningkat dan beragam. Karakter harus ditanamkan sejak usia dini karena sangat penting untuk kehidupannya nanti. Didalam penelitian ini Penelitian ini menggunakan teknik analisis data deskriptif kuantitatif dengan menggunkan teknik survey yaitu menggunakan dengan sampel sebanyak 20 siswa. Hasil penelitian pada faktor Disiplin paling tinggi berada pada kategori “sedang” dengan persentase sebesar 40% yaitu sebanyak 8 siswa, Hasil penelitian pada faktor kejujuran paling tinggi berada pada kategori “Tinggi” dengan persentase sebesar 50% yaitu 10, faktor taggung jawab pendahuluan paling tinggi berada pada kategori “tinggi” dengan persentase sebesar 35% yaitu sebanyak 7 siswa, pada faktor kreatif paling tinggi berada pada kategori tinggi dan sedang dengan persentase sebesar 30% sebanyak 6 siswa dari 20 siswa.
Determinación de riesgos de desastres e incidencia del cambio climático en la comunidad de Punta Chame, Panamá
Authors: Guevara T. Jenny M. , Douglas Abdiel I. , García-Maraña Karina , Barria Yesenia 
Published: August 2022

La comunidad de Punta Chame, se ubica en la vertiente pacífica panameña. Actualmente, está siendo afectada ampliamente por amenazas, que están relacionadas con los efectos del cambio climático en Panamá. Esta investigación tiene el objetivo de favorecer la prevención de riesgos de desastres y la adaptación al cambio climático a nivel comunitario, a través de ella se identificaron las principales amenazas climáticas, vulnerabilidades y capacidades en Punta Chame, utilizando el método de entrevistas semiestructuradas a los actores de la comunidad (gobierno local, pobladores, empresarios), en conjunto de la Herramienta Rápida de Estimación del Riesgo de la Oficina de las Naciones Unidas para la Reducción del Riesgo de Desastres. En estos análisis las principales amenazas identificadas por la comunidad son: erosión costera, inundaciones costeras, marejadas y vendavales. Por su parte, las entrevistas posicionaron a los vendavales, como el principal riesgo; mientras que la herramienta posicionó a los incendios como la amenaza más alta. La información levantada en este estudio se utilizó para la elaboración de un plan de adaptación y gestión de riesgo de desastre que aumente la resiliencia de la comunidad ante los efectos del cambio climático.
Capacidad de fitorremediación de hierro de las lentejas de agua (Lemna minor) y la hydrilla (Hydrilla verticillata)
Authors: Bustamante Alexandra , González Marieth , Montero Solano Alejandra I. , Valdivieso Eileen , Domínguez Viccelda 
Published: August 2022

Este artículo describe el análisis realizado a la capacidad de las lentejas de agua (Lemna minor) de fitorremediar concentraciones de hierro, comparándolas con la capacidad de la hydrilla (Hydrilla verticillata) durante siete días. Para realizar este estudio se utilizó agua declorada, a la cual se le agregó sulfato ferroso (II) heptahidratado (FeSO4∙7H2O) y se analizó las diferentes características químicas y físicas del agua. Tanto las lentejas de agua como la hydrilla presentaron una capacidad inicial de absorción similar durante las primeras 48 horas del experimento, presentando un porcentaje de reducción de la concentración de hierro en el agua de 49.07% por parte de la lenteja de agua y un 42.90% para la hydrilla. Al incrementar el intervalo de tiempo (t > 1 día) se ralentizó el proceso de absorción gradualmente hasta obtener un porcentaje de reducción mínimo de 1.10% para las lentejas de agua y un 15.93% para la hydrilla antes de presentar una desorción de 4.44% y 22.73% respectivamente al final del experimento. La hydrilla, con un porcentaje de reducción de hierro del 53.02%, en comparación al 51.44% de las lentejas de agua. Ambas especies demostraron una gran capacidad para remover hierro en agua, con potencial a ser un método económicamente viable para la fitorremediación del hierro en un medio acuático.