bluuebunny/crossref_metadata_2025_split huggingface dataset:
No general pathological significance of aphantasia: An evaluation based on criteria for mental disorders
Authors: Monzel Merlin , Vetterlein Annabel , Reuter Martin 
Published: December 2022

As awareness of the phenomenon of aphantasia (= lack of voluntary imagery) has increased in recent years, many psychotherapists ponder its clinical implications. The present study investigates whether aphantasia meets the criteria for mental disorders, i.e. statistical rarity, impairment in activities of daily living, violation of social norms and inappropriate behavior and personal distress. Prevalence of aphantasia was determined meta‐analytically based on 3,543 participants. An international sample of 156 participants with aphantasia (58.3% male; Mage = 35.23) and 131 controls (65.6% male; Mage = 28.88) was assessed with the Reading the Mind in the Eyes Test, the Questionnaire for the Assessment of Everyday Memory Performance and the Aphantasia Distress Questionnaire, as well as measures of depression, anxiety and well‐being. The prevalence of aphantasia was estimated at 3.5 to 4.8%. Participants with aphantasia scored significantly lower than controls on every day and autobiographical memory, but not on theory of mind. A subgroup of 34.7% of participants with aphantasia reported distress significantly associated with lower well‐being and high levels of anxiety and depression. The level of distress increased with poorer performance in autobiographical memory and theory of mind. Although aphantasia meets the criterion of statistical rarity, the impact on activities of daily living and personal distress is too weak to justify a classification as a mental disorder. In a subgroup, however, distress can reach clinically relevant levels. In individual cases, it is therefore advisable to conduct a psychological assessment, for example by means of the Aphantasia Distress Questionnaire.
Struggle for Transdisciplinary Moments: Building Partnerships for Resettlement
Authors: Blakeman Haley , Simms Jessica R. Z. , Waller Helen L. , Jenkins Pam , Cass Katherine 
Published: December 2022

The effects of climate change are both acute and chronic, leaving many communities in a perpetual state of uncertainty. For others, there is no such uncertainty—their communities will soon be uninhabitable. Some levels of government have begun to recognize and slowly respond to communities facing the possibilities of relocation. This paper considers the impact of transdisciplinary thinking and collaborative moments in the planning phase of one of the few community‐scale managed retreat attempts in the United States. In January 2016, the US Department of Housing and Urban Development (HUD) awarded the state of Louisiana $48.3 million to plan, design, and implement a structured and scalable resettlement with former and current residents of Isle de Jean Charles. The paper uses data from surveys and interviews with the practitioner team, fieldnotes, review of published reports, and a sample of more than 400 media accounts. Our analysis highlights how developing a transdisciplinary process may render a new understanding to the tasks and meanings of planning resettlements in the future.
Difference between SARS‐CoV‐2, seasonal coronavirus, influenza, and respiratory syncytial virus infection in solid organ transplant recipients
Authors: Mendoza Maria A. , Motoa Gabriel , Raja Mohammed A. , Frattaroli Paola , Fernandez Anmary , Anjan Shweta , Courel Steve C. , Natori Akina , O'Brien Cristopher B. , Phancao Anita , Sinha Neeraj , Vianna Rodrigo , Loebe Mathias , Ciancio Gaetano , Simkins Jacques , Abbo Lilian , Guerra Giselle , Natori Yoichiro 
Published: December 2022

AbstractBackgroundSevere acute respiratory syndrome coronavirus 2 (SARS‐CoV‐2) pandemic has been raging since the end of 2019 and has shown worse outcomes in solid organ transplant (SOT) recipients. The clinical differences as well as outcomes between respiratory viruses have not been well defined in this population.MethodsThis is a retrospective cohort study of adult SOT recipients with nasopharyngeal swab or bronchoalveolar lavage PCR positive for either SARS‐CoV‐2, seasonal coronavirus, respiratory syncytial virus (RSV) or influenza virus from January 2017 to October 2020. The follow up period was 3 months. Clinical characteristics and outcomes were evaluated.ResultsA total of 377 recipients including 157 SARS‐CoV‐2, 70 seasonal coronavirus, 50 RSV and 100 influenza infections were identified. The most common transplanted organ was kidney 224/377 (59.4%). Lower respiratory tract infection (LRTI) was found in 210/377 (55.7%) and the risk factors identified with multivariable analysis were SARS‐CoV‐2 infection, steroid use, and older age. Co‐ and secondary infections were seen in 77/377 (20.4%) recipients with bacterial pathogens as dominant. Hospital admission was seen in 266/377 (67.7%) recipients without significant statistical difference among viruses, however, ICU admission, mechanical ventilation and mortality were higher with SARS‐CoV‐2 infection. In the multivariable model, the risk factors for mortality were SARS‐CoV‐2 infection and older age.ConclusionsWe found higher incidence of ICU admission, mechanical ventilation, and mortality among SARS‐CoV‐2 infected recipients. Older age was found to be the risk factor for lower respiratory tract infection and mortality for SARS‐CoV‐2, coronaviruses, RSV and influenza virus groups.
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Conceptualising multispecies collaboration: Work, animal labour, and Nature‐based Solutions
Authors: Welden E. A. 
Published: December 2022

AbstractTracing the story of beaver restoration across California, this paper investigates the emerging discourse of ‘working with nature’ through the lens of animal work and labour, exploring possibilities for, multispecies collaboration. At the intersection of animal geographies, environmental anthropology, and geographies of conservation, this paper finds three concurrent modes of working with beaver: beaver as labourer, beaver as coworker, and beaver as community. Beaver as labourer emerges as a mode where beavers go from material resource to low‐wage labourer, their liveliness predicated on their ability to be working for humans. Beaver as coworker transitions beavers from labourers to workers, respected for their skills as ecosystem engineers to be working with. Beaver as community emerges as a mode in which beavers and humans live with each other as kin, amidst wider multispecies assemblages. This mode sets the foundation to theorise the concept of multispecies collaboration, a term often used in the literature without definition. This paper explores the concept through theories of animal work and labour, challenging the premise of work altogether, while situating multispecies collaboration as an in‐between, a both/and space of working and living with ‘nature’. This paper serves as an reflection on the ways in which humans ‘work with nature’, in a time where various nonhumans are being made to be ‘workers’. It presents and analyses these relations, ruminates on implications for governance of these multispecies spaces, and develops the concept of multispecies collaboration as a critical consideration for Nature‐based Solutions.
Additive Manufacturing of Electronic Patterns for Harsh Environments
Authors: Delavault Nicolas , Lacondemine Tanguy , Kalmar Rémy , Fendler Manuel , Achache Sofiane , Sanchette Frederic 
Published: December 2022

Abstract
The last decade has seen emerged numeric transition in industry, bringing new building blocks: Internet of Things (IoT) and additive manufacturing. A whole big new challenge was born based on sensors integration with the capability to bring intelligence into objects leveraging on additive manufacturing topological optimization, and thus operating in harsh environment thanks to efficient packaging. This work presents a new way to create 3D printed electronic patterns, based on Paste Extrusion Modeling (also called Direct Ink Writing) to extrude a superposition of insulator and conductive inorganic materials. Their raw compositions were characterized through EDS and XRD and compared to their datasheets. The obtained patterns show great electrical behavior under mechanical oscillation, opening possibilities for strain measurement.
Liquid Cooling Practice on Meta’s AI Training Platform
Authors: Chen Cheng , Mithani Noman , Jin Tiffany , Guo Allen 
Published: December 2022

Abstract
Due to continuous growth of AI accelerator chip power and heat flux, implementation of advanced cooling technologies for AI platforms seems to be inevitable for hyper scale users. Liquid cooling is one of the relatively more mature category of advanced cooling technologies, and has been adopted in a variety of forms across industry. However, not all liquid cooling solutions are able to deliver high performance with reasonable cost and efficiency. In addition, it’s not straightforward to arrive at proper balance of performance, reliability, serviceability, and scalability for a product, and prepare the facility accordingly to align with long term strategy.
In this presentation, we will introduce a passive cold plate loop solution (Tide 1.0), based on Meta’s AI training platform (Zion) with eight Open Accelerator Modules (OAM). It reflects the design considerations on performance and serviceability. Thermal simulation and optimization studies will be presented. The solution was tested on dummy thermal test vehicles and real functional system, along with cooling capability forecast. Results showed a good match between simulation, TTV test and real system test. The resulting performance demonstrated strong use case of liquid cooling solutions on upcoming AI platforms.
RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study
Authors: Liu Fenny , Huang Sean , Yu Sheng Fong , Li Chun Yen , Hung Liang-Yih , Wang Yu Po 
Published: December 2022

Abstract
The restriction of hazardous substances directive is an environmental directive being passed by the European Union in February 2003. It was scheduled to be effective from on July 1, 2006. It mainly aims at product ingredients and engineering process standards in manufacturing. Any electrical and electronic equipment contains hazardous substances over the regulated limitation will not be allowed to be offered on the market in European Union. Mar 31, 2015, European Union issued a directive to add four new restrictions on the concentration of phthalates that were Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP) and Diisobutyl phthalate (DIBP). The limitation of concentration by weight is 0.1% for each substance.
The phthalates which are used as plasticizers to be used in indirectly material as dicing tape for the semiconductor industry. Many related researches mentioned that temperature and time effects on the migration of DEHP, which means the product existed the risk to be contaminated. Therefore, DEHP is phased out from indirectly material to evaluate DEHP-free indirectly material. The manufacture result is shown in this study to evaluate new indirectly material without DEHP.
Compact and Highly Thermal-Hydraulic Efficient Air-Cooled Closed Loop Thermosyphon Cooling System for High Intense Heat Load Dissipation of Future Microprocessors
Authors: Minazzo Enzo M. , Rouaze Gautier , Marcinichen Jackson B. , Thome John R. , Zhang L. Winston 
Published: December 2022

Abstract
A very compact air-cooled loop thermosyphon cooling system (LTS) was designed, prototyped and tested for microprocessor cooling application. It was designed specifically for 2U servers and heat loads up to 400 W in a footprint area of 40 mm per 40 mm. The low pressure and low GWP working fluid R1233zd(E) was used. Tests were done for two ambient temperatures (22 °C and 40 °C) and included optimal charge determination as well as extensive tests at optimal charge. Values of performance ratio, simply defined as heat load divided by fan power consumption, higher than 30 were observed for the maximum heat load of 400 W. The experimental results were also used to validate JJ Cooling Innovation’s inhouse proprietary solver developed to design the LTS and results will be presented.
Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics
Authors: Iradukunda Ange-Christian , Huitink David , Gebrael Tarek , Miljkovic Nenad 
Published: December 2022

Abstract
The voltage shielding capacity of a hydrofluoroether type fluid, specifically HFE7500 along with that of Parylene C based conformal surface coatings are explored. Both voltage blocking technologies demonstrated an ability to maintain good voltage blocking capacity even when exposed to field strengths as high as 16.8kV/mm in the case of the dielectric fluid and 33.5 kV/mm for 2μm-thick layers of Parylene C. To potentially improve voltage blocking characteristics while minimizing thermal resistance, this study also explores the combined voltage shielding capacity of HFE7500 coupled with thin Parylene C coatings deposited via chemical vapor deposition (CVD). Breakdown tests on point-point electrodes coated with a 10μm film of this coating returned results that showed diminished breakdown voltage compared to bare electrodes. This may be attributed to several factors including the ionization of the coating that initiates breakdown at a reduced field strength.
Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components
Authors: Lall Pradeep , Goyal Kartik , Miller Scott 
Published: December 2022

Abstract
In this paper, the Inkjet printing technique is utilized to characterize the printed circuit performance with surface mount components when exposed to 50°C temperature. Functional circuits such as low pass and high pass filters are printed, and their frequency performance is studied against temperature. Additive electronics manufacturing is rapidly evolving with novel end applications due to the research efforts currently being pursued. A constant pressure of innovation is increasing on the state-of-art printing techniques to further the use and implementation that can help reduce manufacturing costs. The realization of functional additively printed circuits requires the ability to attach surface mount components on additively printed traces. However, the attachment of surface mount components on additively printed circuits is not well understood owing to the interaction of the process parameters with the realized performance of the attached components. This paper demonstrates some of the widely used circuits such as low-pass and high pass filters with surface mount components on additive printed traces. FHE has found applications in wearable product platforms. For wearable applications, it is common for electronics to sustain human body temperatures and temperature rise resulting from heat dissipation during operation. In order to simulate operational temperature exposure, the fabricated functional circuits are subjected to 50°C exposure. The viability of inkjet printed functional circuits with surface mount components and their response under sustained temperature exposure has been studied.
Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation
Authors: Lall Pradeep , Kasturi Madhu , Wu Haotian , Davis Edward 
Published: December 2022

Abstract
The automotive underhood electronics are subjected to temperatures in the range of 150 to 200°C for prolonged periods. The coefficient of thermal expansion mismatch between the chip and the substrate results in the fatigue-failure of solder joints when operating at high temperatures. Underfills provide extra support to the flip-chip bumps, enhancing the fatigue life and reducing the solder joint strains. Models and material degradation data are needed for the underfills exposed to high temperatures. The effect of the evolution of non-linear constitutive behavior of underfills on the solder balls and the study of the evolution of viscoelastic behavior of underfills have not been studied. In this paper, the evolution of underfill properties over 1-year has been measured for two underfills at sustained high-temperature operation. The aging data has been reported at 30, 60, 120, 240, and 360 days at 100°C, 125°C, and 150°C. The effect of non-linear property (Prony series) evolution of underfills on the FCBGA (Flip Chip Ball Grid Array) package reliability has been evaluated. The quarter FCBGA package is modeled from −40°C to 125°C. The results show that the flip-chip plastic work per unit volume of pristine-linear-elastic constitute model underfill FCBGA was much lower compared to pristine-viscoelastic underfill model FCBGA. Results show the importance of considering the non-linear underfill properties instead of linear properties.
Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging
Authors: Lall Pradeep , Choudhury Padmanava , Williamson Jaimal 
Published: December 2022

Abstract
Modern computing platforms used in data centers or harsh environment platforms would be exposed to sustained high temperatures over an extended period of time. Thermal interface materials are extensively used to transport heat from the die surfaces to the Cu-heat spreader. The TIM interface may be exposed to compression in addition to thermal mismatch during power cycling and environmental temperature cycling. Failure of the interface may be a precursor of system failure owing to the subsequent temperature rise. Reliability assurance in the use case scenario requires a fundamental understanding of the interface’s robustness and evolution under operational loads. In this study, the TIM-Cu interfaces were subjected to high temperatures prior to measuring the interface’s critical stress intensity factors. Four-point bend specimens were fabricated and subjected to sustained high temperatures for 15 days, 30 days, 45 days, 60 days, 90 days, and 120 days at temperatures of 100°C, and 150°C. Tests were conducted to determine interfacial delamination of the sample specimen and identify the critical steady-state energy release rates. A digital image correlation approach was also employed to comprehend the progression of crack growth and the crack tip opening displacement (CTOD) to assess the deterioration of various TIM interfaces at various aging durations.
Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling
Authors: Clarke Zion , Smith Sonya , Whitt Reece , Huitink David 
Published: December 2022

Abstract
The objective of this study is to quantify heat transfer direct cooling channel enhancements in single phase for optimal cooling. A device is created to mitigate hot spots in high voltage and high-power density electronics. This design study is for power modules with high heat fluxes specifically, SiC/Si-IGBT hybrid inverter systems requiring enhanced cooling. Experimental test for this heat sink device consists of flow loop tests through conventional hot plates with a first-generation heat sink device attached. This heat spreading device consists of an internal manifold design that is empirically correlated and simulated to help identify enhanced cooling techniques. Developing a framework of designing single nozzle manifolds to identify ideal angles of separation, nozzle chord lengths, and entrance/outlet region diameters for analysis of varying design layouts. Using computational fluid dynamics (CFD) to create an effective process that offers optimal geometry configurations for jet impinging heat sink devices. The present analysis investigates and defines parameters to predict design behaviors for optimal thermal performance of a localized cooling heat spreading device.
Study of Interface Monotonic and Fatigue Fracture Measurements at the Substrate Potting Compound Interfaces Under Flexure Loading
Authors: Lall Pradeep , Choudhury Padmanava , Blecker Ken 
Published: December 2022

Abstract
Electronics in harsh environments are often subjected to extreme shock loading up to 50,000Gs, moisture, and high temperature. Potting of PCBs is often used to provide protection from extreme mechanical shock loads, vibration loads, and thermo-mechanical loads. The cured potting materials are prone to interfacial delamination under dynamic shock loading, which in turn may potentially cause failures in the package interconnects. The literature on potting compounds primarily focuses on the reliability in end application or the study of bulk material properties. This paper uses a four-point bend specimen to study the Substrate/Epoxy system and measure the fracture parameters of the bi-material strips to determine the interface delamination mechanisms. The bi-material strips of Substrate/Epoxy was kept at elevated temperatures of 100°C for aging. Then the sample specimens were subjected to quasi-static monotonic and cyclic loading to observe the critical stress intensity factors, fatigue slope parameters, and degradation interfaces bond adhesion of bi-material strips. Epoxy-A is a stiff material with 12,260 psi of tensile strength. The monotonic critical stress intensity factors and fatigue crack growth of the interfacial delamination for the two epoxy systems were characterized using strain energy release rate. A prediction of a number of cycles to failure and the performance of different epoxy system resistance was evaluated during cyclic bending loading using Paris Power Law.
Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days
Authors: Lall Pradeep , Saha Mrinmoy , Suhling Jeff , Blecker Ken 
Published: December 2022

Abstract
In aerospace, military, and automotive applications, various electronic parts may be subjected to sustained operation at high and low surrounding temperatures as well as high strain-rate loads. Previous research studies have shown that material properties of undoped SAC alloys evolve even at moderate temperatures after a prolonged period of storage. A variety of dopants has been introduced into SAC alloy formulations in order to reduce the aging effects. In this study, two doped SAC solder called QSAC10 and QSAC20, have been subjected to high strain rate testing after keeping them in storage at temperature of 50°C for 120 days. Samples with no aging to 120 days aged samples have been subjected to uniaxial tensile tests to measure the mechanical properties of SAC+Bi solders. The High and Low operating temperatures used in this experiment ranged from −65°C to 200°C. Then the experimental material data was used to compute the constants for the Anand Visco-Plasticity model. Using the Anand constitutive model, the material constitutive behavior has been implemented in a finite element framework to simulate the drop events.