bluuebunny/crossref_metadata_2025_split huggingface dataset:
Jean-Marie Carré et les origines historiques et politiques de l’imagologie comparatiste
Authors: Martí Monterde Antoni 
Published: February 2022

L’objectif de cet article est de présenter les origines de l’imagologie comparatiste, et notamment les travaux de Jean-Marie Carré, comme une proposition méthodologique profondément marquée par la Première et la Deuxième Guerres Mondiales. Le commentaire des deux œuvres majeures de Carré : Goethe en Angleterre (1920) et Les Écrivains français et le mirage allemand 1800-1940 . (1947) et la relecture de nombreux articles oubliés démontrent comment pendant ces années si difficiles la tentative de fournir au comparatisme français une méthodologie à partir de laquelle appréhender l’image de l’Autre est devenue un lieu où s’expriment les tensions entre la France et l’Allemagne, jusqu’à remettre en question une partie des valeurs qu’on associe traditionnellement au comparatisme. C’est pourquoi, dans le contexte actuel de revitalisation du discours imagologique, désormais conscient de sa dimension politique, reprendre les travaux oubliés de Carré permettra d’aborder cette partie peu étudiée de l’histoire du comparatisme.
Célébrer la beauté
Authors: Brunel Pierre 
Published: February 2022

À partir de ce titre, Pierre Brunel a voulu montrer comment François Cheng dans ses Cinq méditations sur la Beauté a étendu à tous les humains la mission que Rilke a assignée au poète. En suivant l’ordre de ces cinq méditations, il rappelle le rapprochement entre la beauté de la Nature et la beauté de la femme, l’hésitation de Baudelaire entre fascination et doute qu’inspire cette apparente beauté, poussant le paradoxe de la beauté du bizarre jusqu’à une question au sujet de la beauté du laid et du démon, et à partir de là, il revient vers un nouveau rapprochement entre Rilke et Cheng sous le signe de l’Ouvert et de « cette chose magique qui est l’art » quand il promeut une telle ouverture.
Taking Stock: Research on the Reception and Translation of Baudelaire in Spain
Authors: Hambrook Glyn 
Published: February 2022

Le bicentenaire de la naissance de Baudelaire en 2021 rend opportun un bilan de recherche sur la réception en Espagne du poète des Fleurs du mal , sujet abordé déjà dans presque soixante-dix livres, articles, chapitres, revues, et thèses apparus à partir de 1959, tous recueillis dans cet article sous la forme d’une annexe. Cet état présent propose une synthèse des principales tendances et les principaux axes de recherche sur la traduction de Baudelaire et la critique de son œuvre en Espagne, ainsi que sur sa présence, soit concrète soit paradigmatique, dans la littérature espagnole du XIX e au XXI e siècles. La conclusion esquisse des directions que pourrait prendre la recherche sur la réception de Baudelaire en Espagne dans l’avenir.
False Alert Detection Based on Deep Learning and Machine Learning
Authors: Li Shudong , Qin Danyi , Wu Xiaobo , Li Juan , Li Baohui , Han Weihong 
Published: February 2022

Among the large number of network attack alerts generated every day, actual security incidents are usually overwhelmed by a large number of redundant alerts. Therefore, how to remove these redundant alerts in real time and improve the quality of alerts is an urgent problem to be solved in large-scale network security protection. This paper uses the method of combining machine learning and deep learning to improve the effect of false alarm detection and then more accurately identify real alarms, that is, in the process of training the model, the features of a hidden layer output of the DNN model are used as input to train the machine learning model. In order to verify the proposed method, we use the marked alert data to do classification experiments, and finally use the accuracy recall rate, precision, and F1 value to evaluate the model. Good results have been obtained.
Design Constraints and Scale Down Evolution in Advanced Semiconductor Packages
Authors: Kim Byong Jin , Lee SangHyeon , Shim JaeBeom , Cho Nam-Hee , Khim JinYoung 
Published: February 2022

ABSTRACT
Wafer fabrication (fab) technology has been scaling down for several decades but now faces many barriers to overcome in terms of technology as well as economy. Beyond Moore's law, the scaling becomes a question of how to cost effectively integrate more functions and achieve better performance. For this matter, the semiconductor industry is looking for packaging solutions using system-on-chip (SoC) or System in Package (SiP) technologies.
In this paper, using a commercial mobile application processor (AP), design factors for package integration have been identified and the next level of integration will be proposed by design simulation. The commercial mobile AP package is a good candidate for identifying major design factors because it has evolved in both fab processing and package-level design over many years. Package platform has evolved from a single package to a stack die package and Package-on-Package (PoP) structure. As it is scaled down and interfaced more closely with memory, package technology has evolved but now faces various challenges in structure along with many design constraints. To address these issues, the major drivers and design challenges in package technology will be identified and future direction be proposed.
Fine Line and Low Stress RDL Solition for Fan-Out Wafer Level & Panel Level Packaging
Authors: Matsuura Yoshinori , Yoshida Tatsuya , Komiya Yukiko , Nakamura Toshimi , Yanai Takenori , Okuyama Kazuhiro , Kitabatake Yukiko , Ishii Rintaro , Hayashi Katsuyuki , Kubota Takashi , Fujii Joji 
Published: February 2022

Abstract
Process limitations faced during the construction and integration of current and next generation advanced packages require a new RDL (Redistribution Layer) approach to overcome fine L/S and stress constraints. If interactions between design, process and materials are not optimized or controlled, then yield loss and higher cost result. RDL is an integral part of a package and with greater design complexity the number of such layers also increase.
This paper introduces a new RDL concept through HRDP® (High Resolution Debondable Panel) technology. It has received industry wide attention, especially for Fan-Out, Chip Last, Wafer Level & Panel Level package assemblies. The structure and materials for HRDP® are described. The applicable HRDP® carrier can be provided in various dimensions and thicknesses for round panels and for square/rectangular panels with glass or silicon to match customer requirements. This accommodates process simplification and improves interfacial stresses. The process steps using HRDP® are elaborated, which essentially use existing tools in RDL metal patterning (i.e., Lithography, Developer/Descum etc.) without disrupting the assembly line layout and process flow.
HRDP® is compatible with existing dielectrics and photoresists. It has been demonstrated that based upon the capabilities of dielectrics and photoresists used for RDL in the bump fab, fine L/S geometries of 2/2 um and less have been achieved. Reliability data has been shared.
Photonic Debonding for Wafer-Level Packaging
Authors: Turkani Vikram , Akhavan Vahid , Schroder Kurt , Liu Xiao , Prenger Luke , Martinez Xavier 
Published: February 2022

Abstract
Temporary bonding and debonding (TB/DB) processes have emerged as promising solutions in wafer-level packaging technology. These processes offer a pathway to wafer thinning and subsequent backside processing, which are crucial in enabling heterogenous integration using technologies such as 3D through-silicon-vias (TSVs) and fan-out wafer-level packaging. These are critical for overall device miniaturization and increased performance. In this work, a novel photonic debonding (PDB) method and the corresponding bonding material are presented. PDB enhances the TB/DB process by overcoming many of the disadvantages associated with traditional debonding methods. PDB uses pulsed broadband light (200 nm – 1100 nm) from flashlamps to debond temporarily bonded wafer pairs with glass as the carrier wafer. These flashlamps generate high-intensity pulses of light (up to 45 kW/cm2) over short time intervals (~100 μs) to facilitate the debonding. Feasibility of the PDB in the TB/DB process is demonstrated by successfully debonding thinned (&lt;70 μm) silicon wafers from glass carriers. Post-debond cleaning of the thinned wafers and carriers is evaluated. With uniform, large-area illumination (75 mm x 150 mm) per flashlamp and with the ability to concatenate lamps to increase the illumination area of the PDB tool, the PDB method offers a high-throughput and low-cost debonding solution for both wafer-level and panel-level packaging technologies.
High UV Transmission Glass Carriers for Advanced Packaging
Authors: Zhang Jay , Dutta Indy , Brueckner Julia , Bono Katsumi ,   Corning Incorporated
Published: February 2022

Abstract
Glass carrier wafers are used in many temporary bonding and debonding applications such as wafer thinning and fan-out wafer level packaging. For light-based debonding, a UV light source is often chosen for one or more of the following reasons: limiting light penetration into the sensitive die area; providing uniform light beam energy distribution; minimizing heat problems; maximizing overall process throughput. Corning has recently developed high UV transmission glass carrier wafers in response to market demand. In this paper, we will discuss the benefits of using such glass wafers for 308nm excimer laser debonding as well as a shorter wavelength UV lamp debonding cases.
Design of Coaxial TGV Substrates; Enhancing RF Via to Via Isolation
Authors: LeClair Tim , Martin Steve 
Published: February 2022

ABSTRACT
Enhanced electronic substrate design objectives for higher frequency products (5G telecom systems) can now be achieved with the use of novel coaxial-thru-via configurations in glass (TGVs). When compared with standard pillar filled thru-vias in glass, coaxial-thru-vias exhibit greater than 40dB improvement in via-to-via crosstalk isolation and 0.5dB improvement in insertion loss both at 30 GHz. Coaxial-Thru-Vias provide precise unadjusted 50 Ohm impedance matching device designs at the 5G product frequencies. The coaxial dielectric core chemistry is modifiable to tune electrical parameters to meet specific design requirements.
This paper summarizes all designs, simulations, and modeling performed to date. The superior properties of coaxial vias in glass and fused silica over standard pillar vias are documented and captured in sweeps to 100 GHz. Via and pitch dimensions of 100/200 and 50/100 um have been assessed. Manufacturing methods have been demonstrated using thick film conductor materials in prototype designs. Coaxial vias can optionally be fabricated as dual-purpose configurations reducing thru-via count requirements, substrate footprints, and package/module costs.
Advanced Packaging Technology for Novel 1-dimensional and 2-dimensional VCSEL Arrays
Authors: Dohle Rainer , Henning Gerold , Wallrodt Maximilian , Gréus Christoph , Neumeyr Christian 
Published: February 2022

Abstract
In this paper we present an optimized manufacturing technique for special long-wavelength 1-dimensional and 2-dimensional Vertical Cavity Surface Emitting Laser Diode (VCSEL) arrays with focus on die bonding and a special wire bonding process as well as additional possibilities to make the manufacturing more productive and to increase the product quality, reliability, and life time. VCSEL arrays have a very broad application potential. Objective of this paper is the development of an assembly technology for long-wavelength VCSEL arrays with high positioning accuracy for automated production with high total yield, using gold-based conductive glue (because silver migration is a concern) securing high yield and extremely high reliability and lifetime. Due to special customer requirements, a final thickness of the conductive glue of 35 micron with low standard deviation is necessary. For highest reliability, gold wire bonding of the top side contact of the VCSEL to a silicon substrate with gold metallization has been a customer requirement. With the described technique we develop and produce customer specific products with dedicated wavelength, performance, and packaging options. Bases on our findings, very flexible and scalable solutions are possible, matching many different applications. Finally, we will present an overview of our results on the physical and electro-optical characterization of the VCSEL devices. This yielded a very productive manufacturing technique, meeting the requirements mentioned above. Special design features of the VCSEL ensure that the relatively high thermal resistance of the cured conductive glue layer does not impair the electro-optical properties or the lifetime of the VCSELs. For the interconnection of the top side contact we used gold wire with 20 microns diameter, using ball-wedge, Stand-Off Stich Bond process with special loop geometry, required by the customer. Due to the properties of the semiconductor material of the VCSELs a low bonding temperature is required, enabled by our special wire bonding process. Gold wire bonding delivered excellent results, by far exceeding the customer specification. The optical spectrum of the VCSELs and other measurements indicate that the assembly processes do not harm the laser diodes or their electro-optical properties. All customer requirements for the 1-dimensional and 2-dimensional VCSEL arrays have been met. The electro-optical and burn-in data furnished proof of the quality of the engineered assembly technology. The technologies developed for low current as well as high current laser arrays will enable new devices for a huge amount of new applications because of the novel manufacturing processes as well as innovative packaging of the VCSEL arrays.
Low Transmission Loss Cu Wirings with Smooth Seed Layer and High Adhesion against Prepregs
Authors: Hirano Kazue , Toba Masaya , Yamaguchi Masaki 
Published: February 2022

Abstract
Semiconductor packages for high performance devices with printed circuit boards having multi wiring layers such as FC-BGA have been attracting the attention in order to realize ultra-reliable and low latency communications in 5G networking. Cu wirings for the package are usually fabricated by semi-additive process (SAP) with desmear process and/or modified semi-additive process (MSAP) by using Cu foil with large surface roughness. Though a desmear process and Cu foil can obtain enough adhesion between dielectric and Cu seed layer by anchoring effect to secure reliabilities, the interface between dielectric and Cu seed layer should be smooth to achieve low attenuation of electric signals at high frequencies. Here, instead of that processes, we applied an UV modification for the surface of our developed prepreg in order to realize a smooth and high adhesive seed layer against the dielectric. We also conducted chemical modification for the surface of Cu foil to achieve low attenuation of transmission loss and high adhesion against prepreg. We successfully assembled Cu wirings with L/S = 6/6 μm on prepregs by SAP. High peel strength between Cu foil and prepreg was obtained due to chemical modification for the surface of Cu foil. The normalized transmission loss of Cu wiring assembled through MSAP was improved as compared to Cu foil with rough surface.
The effect of direct cell injury inflicted by cryotherapy on eyelid sebaceous gland carcinoma cells: An ex-vivo experimental study
Authors: Alam Md Shahid , Banerjee Prabrisha , Krishnakumar Subramanian 
Published: February 2022

Purpose:
To evaluate the effect of direct cell injury of cryotherapy on eyelid sebaceous gland carcinoma cells by an ex vivo cryotherapy experiment.

Methods:
It was a prospective interventional case series. Six patients with biopsy-proven nodular sebaceous gland carcinoma were included. After excision of the mass, a thin slice of the mass resembling the thickness of the conjunctiva was shaved off and was oriented over the broad end of a tissue forceps. Cryotherapy was applied to both its anterior and posterior aspects by the triple freeze-thaw technique. The mass was then labeled and sent separately for histopathological evaluation by fixation and staining.

Results:
A total of six patients with a mean age of 58.2 ± 15.5 years were included. There were four females and two males. The mean duration of the lesion was 21.6 ± 17.51 months. All patients had involvement of the upper eyelid. The patients were clinically staged as T2b (n=2), T1a (n=2), T2c (n=1), and T3a (n=1) respectively. There was no regional lymphadenopathy or metastasis in any of the cases. The experimental cryo-tissue containing the cryo-treated lesion revealed the presence of viable tumor cells (>50%) in all six specimens.

Conclusion:
The direct cell injury caused by cryotherapy may not be sufficient to kill all the residual sebaceous gland carcinoma cells on the tumor bed.
Methylation of APC2, NR3C1, and DRD2 gene promoters in turkish patients with tobacco use disorder
Authors: Halit Çınarka , Y Niksarlıoğlu Elif , M Aytaç Hasan , Sacide Pehlivan , Yasemin Oyacı , Deniz Doğan , A Uysal Mehmet 
Published: February 2022

ABSTRACT

Background:
Many studies have investigated the association of the methylation of gene and tobacco use disorders (TUD), but results remain ambiguous.

Aims:
This study evaluated the relationship between methylation of Adenomatosis Polyposis Coli (APC), Nuclear Receptor subfamily 3 group C member 1 (NR3C1), Dopamine D2 receptor (DRD2) gene promoters, and its effect on TUD.

Subjects and Methods:
We recruited 154 active smokers and 111 healthy non-smoker controls. PCR based methods on genomic DNA characterized the methylation of APC2, NR3C1, and DRD2 gene promoters.

Results:
We have found a significant difference in methylation of APC2 for TUD compared to healthy controls (P < 0.001). The partial methylation ratio was about an eight-fold increase in smokers compared to healthy controls. NR3C1 methylation was slightly higher in TUD patients compared to the control group, but the difference was not significant between the two groups (%95.33 vs. 91.08, P = 0.269). DRD2 methylation ratio was not significant between TUD patients and healthy control groups (P = 0.894).

Conclusion:
We think that it is important to detect APC2 methylated cases earlier and to advise them to quit smoking.
Utility of sonographic transcerebellar diameter in the assessment of gestational age in normal and intrauterine growth-retarded fetuses
Authors: Singh J , Thukral CL , Singh P , Pahwa S , Choudhary G 
Published: February 2022

ABSTRACT

Background:
The fetal cerebellum has been shown to be least affected by external pressures and molding during pregnancy and therefore might provide more accurate estimation of GA.

Aims:
To study the utility of transcerebellar diameter (TCD) measured by ultrasound for the detection of GA in normal and intrauterine growth-retarded (IUGR) fetuses.

Subjects and Methods:
This cross-sectional study comprised 500 antenatal patients with a GA between 14 and 39 weeks and who were certain of their last menstrual periods. The TCD was measured ultrasonographically and the corresponding GA was determined. The GA was also determined with other customarily used sonographic parameters such as biparietal diameter (BPD), head circumference (HC), abdominal circumference (AC), and femur length (FL) and compared with TCD. Data of normal pregnancy patients was used to formulate nomograms by taking the 5th, 50th, and 95th percentile measurements. TCD to AC ratio was also calculated in both normal (n = 424) and IUGR pregnancies (n = 76).

Results:
TCD showed significant correlation with gestational age (GA) measured by last menstrual period (LMP) as well as with GA calculated with other biometric fetal parameters. TCD also showed significant correlation with GA in normal (R2 = 0.979) as well as with IUGR pregnancies (R2 = 0.942). TCD to AC ratio remained fairly constant in normal pregnancies while it was increased in IUGR pregnancies.

Conclusions:
TCD and TCD/AC ratio can be employed as an objective parameter to establish the GA in normal as well as IUGR pregnancy cases.
Multisystem Inflammatory Syndrome in Children: Follow-Up of a Cohort from North India
Authors: Awasthi Puspraj , Kumar Vijay , Naganur Sanjeev , Nallasamy Karthi , Angurana Suresh Kumar , Bansal Arun , Manoj Rohit Kumar , Jayashree Muralidharan 
Published: February 2022

ABSTRACT.
Multisystem inflammatory syndrome in children (MIC-S) is a hyperinflammatory manifestation of severe acute respiratory syndrome coronavirus-2 (SARS-CoV-2) infection. Information on the long-term outcome of MIS-C is limited. This study was conducted to describe the long-term outcome of MIS-C from a tertiary care center in North India. Children admitted with MIS-C from September 2020 to January 2021 were followed up after discharge until June 2021. The details during the acute phase (clinical features, investigations, treatment, and outcome) and follow-up (symptoms, echocardiographic findings, ongoing treatment, and outcome) were collected retrospectively. During the acute phase, 40 children presented at median (interquartile range [IQR]) age of 7 (5–10) years with fever, mucocutaneous, gastrointestinal, and respiratory symptoms. The majority (66.7%) of the children had positive SARS-CoV-2 serology and elevated inflammatory markers (C-reactive protein, procalcitonin, ferritin, D-dimer, and fibrinogen), lymphopenia, and thrombocytopenia. Eighty percent had shock, 72.5% had myocardial dysfunction (left ventricular ejection fraction <55%), and 22.5% had coronary artery dilatation or aneurysm. Treatment included pediatric intensive care unit admission (85%), intravenous immunoglobulin (100%), steroids (85%), aspirin (80%), vasoactive drugs (72.5%), and invasive mechanical ventilation (22.5%). Two (5%) children died because of refractory shock. Thirty-four children were followed up with until a median (IQR) of 5 (3–6) months. During the follow-up, a majority were asymptomatic, myocardial function returned to normal in all, and only one had coronary artery aneurysm. Prednisolone and aspirin were given for a median (IQR) of 3 (2–4) weeks and 4 (4–6) weeks after discharge, respectively. There was one readmission and no death during the follow-up. To conclude, the long-term outcome of MIS-C is generally favorable with resolution of cardiovascular manifestations (myocardial dysfunction and coronary artery changes) in the majority of children during follow-up.
Florística e estrutura arbórea de ilhas de mata em áreas de savana do norte da Amazônia brasileira
Authors: Santos Naiara Marta Conceição dos , Do Vale Júnior José Frutuoso , Barbosa Reinaldo Imbrozio 
Published: February 2022

Ilhas de mata são fragmentos florestais isolados, encontrados em zonas de contato savana-floresta dos neotrópicos. Informações sobre a comunidade arbórea dessas formações podem indicar a necessidade de estabelecer políticas de conservação que resguardem esses remanescentes florestais paleoclimáticos. Foi realizado um inventário florestal da comunidade arbórea de quatro ilhas de floresta sazonal dispersas em uma área de savana em Roraima, extremo norte da Amazônia brasileira. Duas ilhas foram definidas como pequenas (5-10 ha), uma como média (10-20 ha) e outra como grande (20-60 ha). Todas perturbadas por extração seletiva e fogo. Foram amostrados 470 indivíduos com diâmetro à Altura do Peito (DAP) ≥ 5 cm, pertencentes a 52 espécies, 41 gêneros e 25 famílias. As famílias mais ricas em espécies foram fabaceae (11) e sapotaceae (6). A maioria das espécies era de pioneiras (55,8%). Abarema jupunba (fabaceae) e Chrysophyllum argenteum (sapotaceae) foram comuns às quatro ilhas. Maior similaridade florística foi detectada entre as ilhas de maior área física. Intensidade e escala de tempo pós-distúrbio foram fatores importantes no impedimento da construção de um forte padrão entre estrutura horizontal (número de indivíduos, DAP e área basal) e dimensão das ilhas, embora riqueza e diversidade tenham indicado dependência do tamanho do fragmento.