bluuebunny/crossref_metadata_2025_split huggingface dataset:
The Electrochemical Growth of 2D Metals on Insulators Using a Graphene Interface
Authors: Medina Arturo , Drexler Matthew N , Lee Dong-Chan , Boruta Michael , Boruta Nicholas , Alamgir Faisal M. 
Published: November 2022

2D confined metals (2D-M) under heteroepitaxial relations with graphene (Gr) allow for the potential control of chemical properties of the 2D-M by an external electric field. If this external electric field is supplied by an insulating substrate (such as a dielectric or a ferroelectric), then it can enable a non-Faradaic manipulation of electrocatalytic reactions via the M-Gr electrocatalyst system. In this work, we will explore the architecture of a 2D metal-graphene (2D M-Gr), where the substrate is supplying an electric field as well as fulfilling the role of the insulating substrate (dielectric) in the system. The insulating substrate will carry an embedded electron charge at the interface between two dielectric (DE) layers, close to the surface of the metal, allowing for electronic influence on the metal. In this system, graphene acts as an imperfect screener of electric fields allowing the dielectric/ferroelectric-generated field to influence the metal. We find that providing an approximate potential of 0.1 V yields a significant increase in the hydrogen evolution current within a 2D platinum/graphene (2D Pt/Gr) system. Extended X-ray absorption fine structure (EXAFS) studies are used to examine 2D M-Gr epitaxy. EXAFS results indicate a strain condition imposed by Gr on the metal grown, where Gr is constraining nearest-neighbor distances through epitaxial directions. Experimental research on the strain induced in graphene-templated Pt monolayers by Alamgir et al. found that a single graphene layer induces a 3.5% compressive strain on the Pt adlayer deposited onto it, increasing the catalytic activity of the system In the 2D M-Gr system, our strained, epitaxially grown metal on Gr will be demonstrated on an Au/Gr/DE and Pd/Gr/DE system.
References:

Abdelhafiz, Ali, et al. “Layer-by-Layer Evolution of Structure, Strain, and Activity for the Oxygen Evolution Reaction in Graphene-Templated PT Monolayers.” ACS Applied Materials & Interfaces, vol. 7, no. 11, 2015, pp. 6180–6188., https://doi.org/10.1021/acsami.5b00182.

Figure 1
Recent Advances in Electrodeposition of Copper Ultrathin Films on Cobalt Substrate
Authors: Guo Lian , Han Jianwen , Yakobson Eric , Shao Wenbo , Whitten Kyle , Najjar Elie 
Published: November 2022

As the miniaturization trend in integrated circuits fabrication continues, alternative liner materials in copper interconnects have been actively explored. Cobalt has been widely investigated and employed due to its low resistance at nanoscales, integration compatibility, as well as benefit of improving copper electromigration resistance. However, direct electrodeposition of copper onto cobalt remains less explored due to the stability issue of cobalt in acidic copper damascene process. Subsequent processes of copper seeding and copper electroplating face increasing technical difficulties when widths and aspect ratios of electro-fill features become more challenging.
Direct electrodeposition of copper on cobalt has been explored in acidic and alkaline chemistries, both of which were formulated by MacDermid Alpha Semiconductor Solutions. In both cases, well-adherent, nearly-pinhole-free, and ultrathin Cu has been successfully electrodeposited onto cobalt substrate with less than 10% cobalt loss. SEM images in Figure 1 imply uniform dispersion of copper on cobalt. XRF and ICP analysis confirm that the thinnest copper films deposited could be no thicker than 2 nm. Corrosion test in acidic copper plating bath shows that an ultrathin copper layer of thickness less than 2 nm can effectively suppress cobalt dissolution by a factor of three in comparison to non-coated bare cobalt.
This work could pave the avenue towards direct copper electrodeposition onto cobalt liner in semiconductor manufacturing for advanced technology nodes.

Figure 1. Top-down SEM images. (left) As-received cobalt substrate; (center) Cu of 2 nm nominal thickness electrodeposited on cobalt from an acidic solution; (right) Cu of 2 nm nominal thickness electrodeposited on cobalt from an alkaline solution. All three images have the same scale and scale bars are 200 nm.

Figure 1
Development of a Quantitative and Predictive Model for Electrodeposition of Metals and Alloys with Experimental Verifications
Authors: Ma Yifan , Pepas Jakub , Kang Minju , Carsley John , Chen Hailong 
Published: November 2022

Electrodeposition is widely used in the refinery, manufacture, and coating of metals and alloys. Electrodeposition is a complicated process with many factors, such as deposition potential, current density, electrolyte composition and concentration, convection, additives, and temperature, can have significant impacts on the phase composition, morphology, and particle size of the deposited metals/alloys, thus consequentially impacting the physical and chemical properties of the deposited parts. In the past, a recipe for a particular metal/alloy electrodeposition is commonly established through trial-and-error tests, which is very time consuming. Here we report our recent efforts trying to build a quantitative and predictive model based on ex situ and in situ experimental characterizations of electrodeposition processes.
To build the model, we chose copper as the model material for electrodeposition. A few electrochemical cells which have different geometries and dimensions and provide non-uniform current density distributions were designed and used. Through variation of the electrode placement and cell geometry, the current density distribution on the working electrode in the electrodeposition process can be tuned. The amount and growth rate of the deposited Cu layer in various electrochemical cells and under different deposition conditions (such as different potential, electrolyte concentration or physical location) were experimentally measured with using carefully calibrated and normalized X-ray diffraction (XRD) data. A multi-physics multi-scale model was developed to quantify the distribution of the current density and the growth rate of deposited Cu at different locations. The experimentally measured data was used to verify and improve the model. The results showed that the model can accurately predict the distribution of the current density with given nominal deposition potential or current, and thus predict the growth rate of the deposited Cu phase.
The success of this model offers hopes to rationally design the deposition of metals and alloys to replace conventional trial-and-error method. The impact of different deposition substrates, additives, electrolyte concentrations will also be discussed. Proof-of-concept experiments also demonstrated that this rational design method can be applied to the design of electrodeposition of alloys, offering a much broader range of potential applications.
Pulsed Electrophoretic Deposition of Nanocarbons and Their Optical, Thermal, and Electrical Applications
Authors: Wang Dan , Hall Timothy , Snyder Stephen , Radhakrishnan Rajeswaran , Liu Danny , Le Huong , Inman Maria , Taylor E. Jennings 
Published: November 2022

Electrophoretic deposition (EPD) is a well-established, scalable industrial manufacturing technology for depositing a wide variety of coatings across a broad range of substrates, geometries and sizes. Conventional electrophoretic deposition (EPD) is the migration of small, suspended particles in a liquid driven by a constant electrical potential difference. As a subset of electrodeposition, EPD has been used to deposit layers on various conducting and semiconducting surfaces from polar, aqueous, and non-polar suspensions. On the other hand, state of the art developments within nanoscience and nanotechnology has opened a new vista for the field of nanocarbon materials. Nanostructured carbon materials, such as carbon nanotubes, graphene, carbon quantum dots, etc., exhibit excellent physical and chemical properties, and have been gaining attention in both fundamental research and technological applications.
In this invited presentation, Faraday Technology will discuss an innovative electrophoretic deposition (EPD) manufacturing process, based on the use of pulsed electric fields, for controlled, reproducible, scalable deposition of a wide variety of nanocarbon based coatings across a broad range of substrates, geometries and sizes (Figure 1). The effects of waveforms, electrolytes, substrates, etc. on the formation of robust and uniform coating will be discussed in this talk. The optical and electrical properties, and environmental survivability of nanocarbon coatings will be demonstrated via a variety of testing or characterizations. Faraday will also introduce their applications ranging from low-reflective coatings, solar absorber, high emissivity coatings, to thin film electrodes for energy storage.
In summary, a scalable EPD manufacturing process for fabricating nanocarbon based coatings have been developed at Faraday for various applications ranging from optical, thermal, to electrical fields.

Acknowledgements: The financial support from NASA SBIR program through contracts No. 80NNSC18P2062 & 80NSSC19C0177, DOD DMEA STTR program through grant No. HQ0727-21-P-0029, DARPA SBIR program through grant No. W31P4Q-22-C-0014, DOD MDA STTR program through grant No. HQ0147-19-C-7065, DOD Air Force SBIR program through grant No. FA9453-19-P-0573, NASA SBIR program through contracts No. 80NSSC20C0287 are acknowledged.

Figure 1
Electro-Codeposition of Composite Materials for Enhanced Thermal and Electrical Properties
Authors: Hall Timothy , Wang Dan , Le Huong , Garich Holly , Minary Majid 
Published: November 2022

State of the art cryocoolers, high powered electronic systems, and space platforms require next generation high conductivity composite materials that can reduce product weight while improving performance. To meet this need, Faraday Technology with the help of Universities, National Labs, and industrial partners is developing a scalable electro-codeposition method to produce high conductivity hybrid graphene/copper composite materials.
Specifically, this talk will highlight two activities ongoing at Faraday and demonstrate the feasibility of fabricating either composite or laminated graphene-copper hybrid foils or direct printed composite nanowires via a pulse electro-codeposition approach. These activities indicated these composite materials can achieve a greater than 50% reduction in sheet resistance and a ~50% increase in mechanical strain compared to Cu foils. Additionally, we identified a strong dependance of material surface roughness on the measurement of thermal conductivity when using the 3-ω technique in a Closed Cycle He Cryostat. We will also discuss the opportunity to produce a wide range of material shapes by enabling a direct print apparatus that combines x,y,z control methods with an electro-codeposition printhead. If successful we envision that method to print next generation composite materials like ‘covetics’ that have the potential to meet many of the electronics and space community’s needs by enabling in space structural repairs, fabrication of new electronic components or sensors, or be utilized as heat exchanger composite materials. Finally, this activity also identified commercial partners interested in integrating these next generation into high powered electronics like laser diodes or invertors for electric vehicles.
Exchange Coupled SmCo5/FeCo Core/Shell Nanocomposites Fabricated By Ultrasound Assisted Electroless Deposition
Authors: Kim Jaehun , Lee Gyutae , Kim In Yea , Kim Chae Yoon , Lim Gi hwan , Lee Min-Jeong , Kim Dong Hyun , Kim Jong-ryoul , Lim Jae-Hong 
Published: November 2022

Owing to high Saturation Magnetization (Ms) and high Remanence Magnetization (Mr), Rare Earth (RE) based Permanent Magnet (PM) has been widely used in various applications such as motor in Electric Vehicle (EV) and generator. With increasing concerns about climate change, EV is considered as a next generation vehicle because EV did not emit pollutants such as CO2, NOx and SOx. Over the past years, Nd2Fe14B is mainly used as PM in EV due to excellent maximum energy product (BHmax) around room temperature. However, The Nd2Fe14B has relatively low operating temperature (<200℃), which limits high speed operation. On the other hand, SmCo5 possesses high thermal, chemical stability and coercivity (Hc), making it a suitable magnetic material for high speed operation in harsh environment. However, unfortunately SmCo5 PM was only used in limited areas due to the lower Ms, Mr, BHmax than Nd2Fe14B. Therefore, interest in research to improve magnetic properties of SmCo5 is increasing. In particular, exchange coupling in core/shell structure between hard magnetic core and soft magnetic shell has attracted much attention because it can increase Ms, Mr, BHmax simultaneously while reducing high price RE element. In our work, we utilized electroless deposition on SmCo5 Nanoparticles (NPs) to fabricate exchange coupled SmCo5/FeCo hard/soft nanocomposites because of low cost and easy to control the soft phase thickness by modulating electrolyte bath parameters such as pH, temperature and additives. However, prior research clarified that the exchange coupling in 0-Dimensional NPs via electroless deposition was difficult because of inevitable particle aggregation caused by magnetic dipoles. Thus, inhibition of particle aggregation would be significant breakthrough. Accordingly, we prevented particle aggregation through ultrasound during the electroless deposition process.
The SmCo5 NPs were fabricated through Sn-sensitization, Pd-activation, and ultrasound assisted FeCo-electroless deposition, successively. Figure 1 shows that the schematic illustration of the effects of ultrasound. The magnetic properties of SmCo5/FeCo NPs were measured by Vibrating-Sample Magnetometer (VSM). When ultrasound was not applied, the hard magnetic properties reduced due to agglomerated NPs. On the other hand, in case ultrasound was applied exhibits exchange coupled hysteresis loop. Figure 2 shows that minor hysteresis loops of exchange coupled SmCo5/FeCo NPs fabricated by ultrasound assisted electroless deposition. We successfully fabricated exchange coupled SmCo5/FeCo NPs and the Ms, Mr, theoretical BHmax increased about 11%, 10.7%, 24.3%, respectively.
As a result, SmCo5/FeCo which fabricated by ultrasound assisted electroless deposition showed the increase in magnetic properties while maintaining Mr/Ms, which might broaden the future application fields.

Figure 1
Transformation in the Industry Leads to Future Challenges of Electrodeposition
Authors: Venz Rainer 
Published: November 2022

Abstract:

Industries are developing permanently and therefore are in a constant change. In the last couple of years, some fundamental changes started and will lead to significant challenges of electrodeposition technologies.
What are the drivers for such changes? There are two main drivers, one is the legislation, with the REACh as a prominent example, that requires to replace many substances. For the plating industry, the main three substance are hexavalent chrome, Cobalt and PFOS, but also many others.
The other driver is the transition of vehicles from internal combustion engines (ICE) to alternative drive train concepts, mainly e-mobility. This transformation gives a new focus on the requirements. The classical requirements, like corrosion- or wear resistance and decorative finishes, will be advanced to multi-functional layers with a strategic focus to electronics and functionalization of components. Electro-deposited layers will play a key role to fulfil such requirements in the future.
As a consequence, the requirements to the end product changes and the electroplating industry has new challenges to meet this new requirements.

Quick summary and benefit for the audience:

The presentation will show examples for global changes in our industry, highlight the resulting technology trends and give examples for potential solutions.
Electrodeposition of Molybdenum from Water-in-Salt Electrolytes
Authors: Liu Quanhong , Huang Qiang 
Published: November 2022

Molybdenum is attractive to the manufacturing industry due to its high melting point and extremely low thermal expansion. Generally, Mo can be produced by thermal spraying, sintering, and pressing at high temperatures. Electrodeposition has been used widely as low-temperature method to prepare metals and alloys as coatings or films. However, it is well-known that metallic molybdenum is difficult to deposit from aqueous solution due to its highly negative reversible potential. More recently, a few studies have successfully deposited metallic molybdenum from highly concentrated acetate solutions1,2 as a thick coating on metallic objects. In this work, we report a systematic study on Mo deposition using this electrolyte system under the umbrella of water-in-salt concept. Aqueous electrolytes with an extremely high concentration of salt, known as water-in-salt electrolytes, offer a special electrolyte environment for electrodeposition where free water molecules are reduced by the hydration of salt.
This report focuses on the effects of substrate and electrolyte chemistry on the Mo deposition process as well as the film properties. In this study, Cu electrode is fabricated by depositing Cu layer on Pt electrode. The electrochemical behavior is studied using cyclic voltammetry on Pt and Cu disc electrodes, as shown in Figure 1. Mo deposition starts at about -2.0 V on both Pt and Cu. In the anodic scan, the deposited Mo film begins to dissolve at -0.7V. X-ray fluorescence is used to measure film thickness, which is consistent with the stripping charge according to Faraday’s laws. However, the amount of Mo deposited on Cu, represented by the anodic stripping charge excluding the charge for Cu stripping, is much higher than that on Pt electrode. On the other hand, the presence of CH3COOK is found extremely critical for Mo deposition despite of a high total concentration of acetate. It is believed to relate to a suppressed proton reduction in presence of alkaline metal cations in a super highly concentrated acetate electrolyte. This correlation between hydrogen evolution reaction and Mo deposition is also consistent with the promoted deposition rate on Cu than on Pt surface. DC deposition studies are carried out to further verify these observations and to allow characterization of deposited Mo. Details will be further discussed in the poster presentation.
1 Morley, T. J. et al., "The deposition of smooth metallic molybdenum from aqueous electrolytes containing molybdate ions," Electrochemistry Communications
15, 78-80 (2012).
2 Syed, R. et al., "Electrodeposition of thick metallic amorphous molybdenum coating from aqueous electrolyte," Surface & Coatings Technology
261, 15-20 (2015).

Figure 1
An Application Based Introduction to the Brush Plating Technique
Authors: Thomas Joshua , Milosevic Danijela 
Published: November 2022

Selective or brush plating is an application method for electrodeposition which can be used for depositing an array of pure metals, alloys, and composite materials onto conductive surfaces. Brush plating has seen its most advantageous use in plating smaller areas of larger parts because the amount of masking used can be reduced, and smaller volumes of solution can be utilized compared to traditional tank plating methods. These same characteristics make brush plating portable and repair operations can be conducted in the field, at times without even disassembling equipment. Brush plating is currently used across a multitude of industrial applications in the fields of aerospace, oil and gas, marine environments, semiconductors, and other manufacturing.
‘Brush’ plating is often considered a manual technique where a technician directly applies the anode (wrapped in the ‘brush’ material) to the surface to be plated. The brush material must be a porous, non-conductive, flexible material which electrically separates the anode from the surface to be plated. The plating solution is absorbed into the brush material around the anode prior to plating by dipping it into a vessel containing the solution. Alternatively, solution can be pumped directly through the anode to the surface to be plated. As a result, smaller volumes of solution can be used because the entire part is not immersed in a large tank containing the plating solution. Masking can be placed around the area to be plated without needing to mask off every surface that isn’t receiving a deposit.
The current density used for brush plating is often high (0.2 to 1.5 A/cm2) relative to other electrochemical plating techniques. Brush plating solutions are typically highly concentrated and the brushing action against the surface where deposition is occurring allows for replenishment of the ion to be plated very close to the interface with the cathode. This allows for high plating rates (Up to 500 µm/hr) depending on the solution and other plating parameters utilized.
This presentation will introduce the audience to the brush plating technique through the use of current and classical applications with multiple deposits. Pros and cons of the technique for different circumstances will be discussed. The influence of the brush material on the electrochemical interface during plating and the resulting deposit will be highlighted. Current research includes the development of deposits for chrome alternatives, alloys for corrosion resistance, and applying deposits to challenging substrates.