bluuebunny/crossref_metadata_2025_split huggingface dataset:
Enghlish-language educational models in medical university
Authors: Kryshinska T.Y. , Sharun A.V. , Zakharov S.V. , Stepanskyi D.A. 
Published: October 2022

The article considers two approaches to training in high medical school: 1) using English as a Medium of Instruction and 2) Content and Language Integrated Learning the emergence of which was related to a wide spread of bilingualism in society, importance of increase in competitiveness of graduates of domestic universities on international labor market. The authors present the models of teaching within the stated approaches which promote the efficiency of professional training of future doctors in solving professional problems on the basis of implementation of foreign language competence. The paper defines the conditions of content and language integrated models implementation into the learning process. In conclusion, it is noted that the integration of subject and language experience contributes to the optimization of foreign language training and significant improvement of the quality of the educational process. The most pressing issues requiring additional research are identified.
Perception of the epidemic risks of the COVID-19 pandemic by the population of Ukraine
Authors: Dorohan` S.B. , Shevchenko A.A. , Kulagin A.A. , Liashchenko O.V. , Lobas V.M. , Mikriukova N.G. , Kostetsky I.V. 
Published: October 2022

In the social network Facebook from April 2020 to October 2020 an online survey using the "Google Form" was conducted to study the perception of the COVID-19 pandemic by the residents of Ukraine. The study involved 550 participants residing in the Ukraine-controlled territory and the city of Kyiv. The data are as follows: the coronavirus is considered a serious danger by 33.3±2.0% of respondents and 11.6±1.4% agree with certain doubts (in total – Σ44.9±2.1%); 21.1±1.7% believe that the coronavirus is not serious and 17.3±1.6% believe that it is probably not serious (Σ38,4±2.1%). COVID-19 is recognized as a pandemic by 73.6±1.9% of respondents, of them 45.6±2.1% of respondents completely agree with this statement. Different views towards the severity of the problem show little but reliable correlation with age (rc =0,23; p<0.001), gender (rc =0,21; p<0,001) of the respondents, as well as with the size of the locality where respondents live (rc =0.30; p<0.001). It was revealed that men (47.2±3.6%), persons over 50 years of age (47.5±5.0%) and residents of small towns with a population of 3,000 to 10,0000 residents (47.7±4.3%) are more skeptical about this issue. The majority of respondents have a moderate level of epidemiological vigilance – 299 (54.4±2.1%); this means that a person emphasizes the seriousness and real threats of coronavirus infection, perceives and adheres to the adopted measures, but with certain hesitations. A high level of epidemiological vigilance characterized by confidence in the real situation and the adopted measures is found in 119 (21.6±1.8%) respondents. A low level of epidemiological vigilance is in 121 (22.0±1.8%) res­pon­dents. Only 11 people (2.0±0.6%) have the overall sum of points, which indicates the absence of epidemiological vigilance.
Does the Market Respond to Management Aggressiveness?
Authors: Kristabel Agatha Jane , Wijaya Riesanti Edie 
Published: October 2022

This study aims to examine market behavior towards management aggressiveness from the perspective of screening theory. Screening theory assumes that the market has limited information on companies. This study uses 852 companies taken from companies listed on the IDX from 2016 to 2018. This study provides empirical evidence about the response of capital markets to management aggressiveness. Over-aggressive management is very dangerous for the company. For this reason, the researcher also examines whether the board of commissioners, foreign institutional ownership, and the presence of auditors are capable of improving market response to management aggressiveness. The results provide evidence that the market does not respond to management aggressiveness. It means that the screening theory is able to explain that the market does not consider whether management is aggressive or not in making their investment decisions. However, the existence of foreign institutional ownership as well as the existence of auditors is something that is considered by the market. The market has responded positively to their existence in suppressing management aggressiveness. Thus, Screening theory proves that the market has limited information about company management. However, they require different information from that provided by management in making strategic decisions.
A cross-sectional study determining the prevalence of musculoskeletal diseases in automotive factory workers
Authors: Sirzai Hulya , Dundar Emine Ahi 
Published: October 2022

Background/Aim: Work-related musculoskeletal disorders (WMSDs) develop due to exposure to physical and psycho-social factors in the work environment. The diagnostic criteria and prevalence of WMSDs are not well established. In this study, we aimed to determine which WMSDs occur in automotive industry workers and what the underlying risk factors may be.
Methods: A cross-sectional study was designed that included 200 automotive industry workers who were diagnosed with a WMSD by physical and radiological examination in the physical therapy and rehabilitation outpatient clinic in the past year. We recorded demographic data, risk factors and WMSD diagnosis names for the patients.
Results: In our study, the most common diagnosis was low back disorder (66.5%), followed by neck and shoulder (58%) and upper extremity (23%) disorders. There was a statistically significant increase in the occurrences of shoulder-neck diseases, upper extremity, and low back-lower extremity diseases in workers with inappropriate posture (P < 0.001). Workers who exerted heavy effort or performed repetitive motions were statistically more likely to experience upper extremity disorders (P < 0.001) as well as low back-lower extremity disorders (P = 0.020 and P < 0.001, respectively); there was no statistically significant change in the incidence of shoulder and neck diseases with heavy effort (P = 0.538).
Conclusion: WMSD is a serious health and economic problem. In our study, we found that low back and lower extremities and neck and shoulder problems are the most common types of WMSDs in individuals working in the automotive sector. Not using proper posture while working causes health problems in the shoulders, neck, upper extremities and low back and lower extremities. Employees in this sector should be encouraged to use good work ergonomics.
Semiotic Approach in Lighting Product Design
Authors: ÇORBACIOĞLU Eda 
Published: October 2022

Today, in addition to the basic functions of saving from darkness, it is also important for the lighting products to carry aesthetic values. In the designs, it is aimed to show the spaces different than they are, even to highlight them, to present successful, creative, artistic images and to create visual effects.
Lighting products are design products that contain aesthetic elements in terms of being selectable and attracting attention. Industrial products carry meaning in respect to their cultural and communal reality. Therefore, these products are means of communication, and signs are one of the important tools for establishing this communication. In terms of designers, it is important to use the signs conveniently to convey the product to the target group.
The aim of this study is to reveal how the semiotic approach can contribute to the design process. It is foreseen that the designs that are created by the designers with the inspiration of semiotic approach can easily find response in terms of marketability and perceptibility in the target audience.
In the study, as a method some home lighting products were selected from various sources and the examples were analyzed by using Peirce's triple semiotic classification of icon, index, and symbol. As a result of this semiotic analysis, it has been determined that using the visual elements in lighting product design is a frequently used method in design to make the products to be adopted by the target group. In the product design process, it has been seen that the semiotic elements guide the designers with deliberative placements, give them a creative perspective and inspire them.
3D Power Module Packages—Failure Analysis Challenges & How to Overcome Them
Authors: Baig Mirza Imran 
Published: October 2022

Abstract
3D package technologies like Multi-Chip Modules (MCM) and System in Package (SIP) have been in the semiconductor package industry for some time now. At the advent these technologies were mostly incorporated for digital solutions, however more recently these packaged solutions have been increasingly used for analog technologies specifically for power applications. With these packaged innovations increasingly adapted, Failure Analysis (FA) takes a central stage not just in supporting customer returned devices but also in root cause investigations leading to new product development, qualifications and ramp to market. These 3D heterogeneous packages however pose multiple newer challenges to FA compared to traditional single chip package solutions. This paper presents some of these Failure Analysis challenges encountered most commonly on analog 3D power modules and talks about possible solutions to overcome them with case studies. Further it also addresses solution that will require FA to think and adapt improved tool sets whether it’s newer solutions that market has to offer or modification to existing approach including chemical recipes, decapsulation methods, etc. to navigate these intricate packages.
A BERT-Based Report Classification for Semiconductor Failure Analysis
Authors: Grabner Corinna , Safont-Andreu Anna , Burmer Christian , Schekotihin Konstantin 
Published: October 2022

Abstract
Failure Analysis (FA) is a complex activity that requires careful and complete documentation of all findings and conclusions to preserve knowledge acquired by engineers in this process. Modern FA systems store this data in text or image formats and organize it in databases, file shares, wikis, or other human-readable forms. Given a large volume of generated FA data, navigating it or searching for particular information is hard since machines cannot process the stored knowledge automatically and require much interaction with experts. In this paper, we investigate applications of modern Natural Language Processing (NLP) approaches to the classification of FA texts with respect to electrical and/or physical failures they describe. In particular, we study the efficiency of pretrained Language Models (LM) in the semiconductors domain for text classification with deep neural networks. Evaluation results of LMs show that their vocabulary is not suitable for FA applications, and the best classification accuracy of appr. 60% and 70% for physical and electrical failures, respectively, can only be reached with fine-tuning techniques.
The Low-Voltage Limits of Lithium-Ion Batteries—Overdischarge and Degradation from a Safety Perspective
Authors: Cohn Adam P. , Hayes Troy A. , Harding Jonathon R. , Horn Quinn C. 
Published: October 2022

Abstract
Despite modern battery management systems, rechargeable lithium-ion batteries can be subjected to varying levels of overdischarge during transport, storage and use in the field. While the general degradation risks associated with overdischarge are well documented, there are not widely accepted cell voltages at which the onset of such degradation processes occur. In this work, reference electrode testing is performed to study a variety of commercial lithium-ion cells during varying levels of overdischarge. Common trends between different types of lithium-ion cells are first identified, and the resulting implications are discussed.
Improved Failure Analysis Success Rate & Efficiency Through Readiness & Smart Solutions for Bench Testing & Fault Localization
Authors: Kabadi Rajesh , Muela Leandro 
Published: October 2022

Abstract
Failure Analysts are often required to work on a vast array of part types. These integrated circuits (IC) can have wide ranging functions and applications. Also, the ICs can be offered in a multitude of package types. All these factors compound the challenges faced by the Failure Analysts. This paper provides a brief snapshot of one approach adopted by the ON Semiconductor Product Analysis Labs to prepare in advance for the products that offer significant challenges in terms of electrical bench testing and fault localization. The approach demonstrates how the prospects of success of a given failure analysis (FA) case can be improved by making available smart solutions that cut down on the effort required for bench testing, defect localization and failure verification activities. This in turn can contribute to cycle time reduction and improve overall efficiency of the FA process.
2GHz Contactless Electron Beam Probing
Authors: Leslie Neel , Vickers James , Freeman Blake , Samani Seema , Sabbineni Prasad , Vedagarbha Praveen 
Published: October 2022

Abstract
Recently, electron beam probing (EBP) has had a resurgence in failure analysis communities due to its clear resolution advantage compared to optical techniques. This paper describes an approach for a detailed advanced logic e-beam probing system, capable of measuring both high bandwidth waveforms and frequency maps. An investigation of optimizing the signal-to-noise of the pulsed beam is presented. By minimizing the working distance and the use of quadrature signal analysis, the e-beam prober is capable of high bandwidth and high-resolution data with adequate signal-to-noise. The use of such system provides a scalable solution for electrical failure analysis for advanced logic integrated circuits.
Failure Analysis Techniques for Detection of Copper Migration in Die Attach Film
Authors: Bejo Dubhe Cyrine , Posadas Greg Harold , Guzman Romel De , Gobway Margie Dalen 
Published: October 2022

Abstract
Newly designed products require extensive reliability and stress testing to catch early failures due to defects during fabrication or assembly processes before they can be introduced to the market. Failure analysis plays an important role in verifying these failures and defining the root cause which will drive relevant process resolution and quality improvement. In this paper, the authors demonstrate comprehensive and innovative failure analysis techniques on leakage current localization to prove the defect mechanism of copper migration seen from the internal lead fingers into the die’s substrate on a device with chip-on-lead architecture.
Corrosion Mechanisms of Copper and Gold Ball Bonds
Authors: Qin Wentao 
Published: October 2022

Abstract
Copper ball bonding is the most widely used interconnection method in microelectronic packages. It has enabled many modern technologies, but the bond can fail due to corrosion. This paper concerns quantitative analyses of corrosion products of passing and failing copper ball bonds, and correlation with the corrosion thermodynamics. The role each element in the aluminum-copper intermetallic compound plays during crevice corrosion is described, and relative abundances of the oxidized elements are estimated. New insights regarding mechanisms of the highest vulnerability to corrosion attack in the thin film-stack across the bond are presented. Limited data indicate the same corrosion mechanisms for Au ball bonds.
The Impact of Ambient Humidity on the Surface Conductance of SiNx Films for Application in Capacitive MEMS Switches
Authors: Birmpiliotis Dimitris , Papaioannou George 
Published: October 2022

Abstract
The present paper provides an inexpensive method to assess the surface charge density variance directly in capacitive MEMS switches. It was found experimentally that the charge variance decay is directly associated with the presence of ambient humidity, which increases the dielectric film surface conductance. This result is qualitatively confirmed with the aid of interdigitated comb structures, where the same behavior was detected.
Decapsulating Small Outline Transistor Packaged Devices Using Acrylic Molding Technique
Authors: Saputil John Michael 
Published: October 2022

Abstract
As the electronics industry moves towards miniaturization, the semiconductor industry provided packaging innovations to meet the demands for smaller footprints. One of the packaging solutions is the small outline transistor (SOT) which is widely used in various applications including automotive engine downsizing. Decapsulation of small packaged devices like a 1.3mm by 2.9mm SOT is one of the greatest challenges in failure analysis. The destructive nature of decapsulation may cause inadvertent and permanent damage, hindering further electrical verification on the unit. In this paper, a novel method for decapsulating SOT devices is presented utilizing the use of acrylic molding to avoid damage on the units during decapsulation process. Results show that the use of acrylic molding is an effective method in decapsulating SOT packaged devices maintaining die functionality, hence, addressing the decapsulation issues and risks caused by other existing decapsulation methods.
Review of Scanning Probe Microscopy Methods for Failure Analysis
Authors: De Wolf Peter 
Published: October 2022

Abstract
This presentation provides an introduction to atomic force microscopy (AFM) and its many uses in semiconductor failure analysis. It provides examples showing how AFM is used to obtain information on electric fields, surface potential, current, resistance, capacitance, impedance, carrier concentration, mechanical contact (height and energy dissipation), temperature, and composition. It also addresses a number of related issues including the use of external stimuli, sample preparation requirements, and probe tip selection.
Charged Particle Systems—Fundamentals and Opportunities (2022 Update)
Authors: Principe Edward 
Published: October 2022

Abstract
This presentation covers ion beam analytical tools, their capabilities, and uses. It provides an overview of ion sources, examines emerging trends in surface analysis, and assesses the potential of ultrafast lasers for panoscopic patterning, athermal ablation, and elemental analysis. It compares and contrasts liquid metal, gas field, and plasma sources and presents examples highlighting the capabilities of FIB-SIMS and FIB-SEM Auger/XPS surface analysis techniques. It also introduces computationally guided microspectroscopy (CGM) and assesses its potential impact on multi-variant analysis, point spread deconvolution, and compressed sensing.
Additive Manufacturing in Medicine and Craniofacial Applications of 3D Printing
Authors: Spake Carole S.L. , Woo Albert S. 
Published: October 2022

Abstract
This article provides highlights of the general process and workflow of creating a 3D-printed model from a medical image and discusses the applications of additively manufactured materials. It provides a brief background on Food and Drug Administration (FDA) classification and regulation of medical devices, with an emphasis on 3D-printed devices. Then, the article discusses two broad applications of 3D printing in craniofacial surgery: surgery and education. Next, it discusses, with respect to surgical applications, preoperative planning, use in the operating room, surgical guides, and implants. The article includes sections on education that focus on the use of 3D-printed surgical simulators and other tools to teach medical students and residents. It briefly touches on the FDA regulations associated with the respective application of 3D printing in medicine. Lastly, the article briefly discusses the state of medical billing and reimbursement for this service.
Inkjetting of Biomaterials
Authors: Barui Srimanta 
Published: October 2022

Abstract
Inkjet printing is extremely precise in terms of the ejected microdroplets (picoliter volume), contributing an unparalleled lateral resolution. Additionally, the benefits of high-speed deposition, contactless ink delivery, and the use of a range of ink materials endorse this technique as suitable for high-throughput 3D manufacturing. This article provides an overview of inkjet 3D printing (also referred to as 3D inkjetting). It then highlights the major components and accessories used in commercial and laboratory-based 3D inkjet printers. Next, the article describes the process physics of the transient phenomena involved in both binder-jetting- and direct-inkjetting-based 3D printing. It then discusses the scope and advantages of 3D inkjetting in the manufacturing of metallic, ceramic, and polymer-based biomaterials. The article also discusses several approaches and methodologies to examine the in vitro cytocompatibility and in vivo biocompatibility of both binder-jetted and direct-inkjetted scaffolds for biomedical applications. Finally, it discusses the challenges and troubleshooting methodologies in 3D inkjetting of biomaterials.
Powder-Bed Fusion of Polymers
Authors: Whenish Ruban , Hameed Pearlin , Alexander Revathi , Nathanael Joseph , Manivasagam Geetha 
Published: October 2022

Abstract
According to International Organization for Standardization (ISO)/ASTM International 52900, additive manufacturing (AM) can be classified into material extrusion, material jetting, vat photo polymerization, binder jetting, sheet lamination, powder-bed fusion (PBF), and directed-energy deposition. This article discusses the processes involved in polymer powder 3D printing using laser fusion/ sintering and fusing agents and energy, as well as the thermally fused PBF. It provides information on polymer powder parameters and modeling, the powder-handling system, powder characterization, the flowability of powder feedstock, and polymer part characteristics. The article describes the types of polymers in PBF, the processes involved in powder recycling, and the prospects of PBF in AM. In addition, the biomedical application of polyether ether ketone (PEEK) is also covered.
Directed-Energy Deposition
Authors: Nartu Mohan Sai Kiran Kumar Yadav , Sharma Shashank , Mantri Srinivas Aditya , Joshi Sameehan S. , Pantawane Mangesh V. , Mazumder Sangram , Dahotre Narendra B. , Banerjee Rajarshi 
Published: October 2022

AbstractThis article focuses on the directed-energy deposition (DED) additive manufacturing (AM) technique of biomedical alloys. First, it provides an overview of the DED process. This is followed by a section describing the design and development of the multiphysics computational modeling of the layer-by-layer fusion-based DED process. A brief overview of the primary governing equations, boundary conditions, and numerical methods prescribed for modeling laser-based metal AM is then presented. Next, the article discusses fundamental concepts related to laser surface melting and laser-assisted bioceramic coatings/composites on implant surfaces, with particular examples related to biomedical magnesium and titanium alloys. It then provides a review of the processes involved in DED of biomedical stainless steels, Co-Cr-Mo alloys, and biomedical titanium alloys. Further, the article covers novel applications of DED for titanium-base biomedical implants. It concludes with a section on the forecast of DED in biomedical applications.
Selective Laser Sintering of Hydroxyapatite-Based Materials for Tissue Engineering
Authors: Softas Christos 
Published: October 2022

Abstract
Hydroxyapatite (HA) is one of the most popular materials in tissue scaffold engineering due to its similarity to the nature of human bone; it accounts for more than half of the total weight of the latter. Selective laser sintering (SLS) is an additive manufacturing method that is used in producing tissue engineering parts from HA feedstocks. This article provides a brief overview of the process itself, along with a detailed review of HA-based tissue engineering applications using SLS. Discussion on the various polymer composites is presented. A detailed overview of selected publications on HA-based SLS studies is listed, which provides insight regarding technical aspects of processing HA powder feedstocks.