bluuebunny/crossref_metadata_2025_split huggingface dataset:
Electrically Insulative Film Adhesive with Enhanced Thermal Performance to Assemble High Power Density Electronic Devices
Authors: Zhao Yuan , Tolla Bruno , Katze Doug , Wood John , Pre Ana , Gao Junbo 
Published: May 2023

Assembly adhesives play a critical role in microelectronic packaging and contribute significant value for circuit assembly interconnection, protection, and thermal management. Of particular interest with today’s more powerful systems is thermal management of high-power density electronic systems, including power modules, power amplifiers, communication systems, and directed energy systems. As requirements for performance and functionality increase, heat generated from these devices increases exponentially. For example, local heat flux can easily exceed 50 W/cm2 for IGBT power modules while it may reach several hundred Watts/cm2 at active areas for Gallium Nitride (GaN) power amplifiers. Simultaneously, many of these systems demand a higher level of electrical insulation to eliminate or minimize current leakage to ensure high reliability over a long service life. Effectively and safely dissipating the high heat and ensuring excellent electrical insulation has become an increasingly critical and challenging task in the microelectronics packaging technology for aerospace and defense systems. This paper presents integration of thermally conductive adhesives with an electrically insulative polyimide film into a carefully engineered laminate, which enables high thermal transfer and robust electrical insulation. This new film adhesive provides outstanding compliance and augmented tolerance to large topographical features and warpage (5-7 mils). This film adhesive is one of the potential solutions to addresses the evolving needs of the electronics assembly industry in the areas of management of high-power systems
Investigation of electroless copper plating with high plating coverage in small BVH for next generation fine pattern SAP
Authors: Yoshida Shinichiro , Nakayama Tomoharu , Yamamoto Hisamitsu 
Published: May 2023

Printed wiring board (PWB) used for package substrates are required to have higher circuit densities. We anticipate that PWB circuit patterns and blind via hole (BVH) will continue to be miniaturized due to higher density requirements. The electroless copper plating solution generally used has less chemical material supply to the inside of the BVH than the surface of the substrate. As a result, the copper thickness at the bottom of the BVH tends to be thinner than that on the surface of the substrate. It is difficult to uniformly deposit the electroless copper plating in the BVH on the package substrate by the semi-additive process (SAP), especially when the BVH are becoming smaller. Therefore, we investigated additives that suppress the electroless copper plating deposition on the surface of the substrate and additives that improve the permeability of the plating solution into the BVH. Two additives have been discovered that dramatically improve the plating uniformity in the small BVH compared to the conventional bath. In addition, we used this plating solution with the new additives to evaluate the internal stress and peel strength of the electroless copper plating film. As a result, it was confirmed that both internal stress and peel strength were improved compared to the conventional bath.
A Closed Form Method Combined with the Steinberg’s Solution to Estimate Number of Fatigue Cycles for Lead-Free Solders
Authors: Nguyen Tuan H. 
Published: May 2023

Solder joints of components are normally the most susceptible to the vibration loading conditions. The Steinberg’s closed form solution has been widely used in industries to identify high risk components to be candidates for detailed finite element (FE) durability analysis under vibration loads. Unfortunately, the Steinberg’s closed form solution is only applicable to the SnPb, not the lead-free materials (SAC); therefore, it would be troublesome to identify high risk SAC components, especially if there are numerous SAC components in the BOM. This paper is to present a method that would be able to combine with the Steinberg’s closed form solution to identify high risk SAC components. This method is developed from comparison between SnPb and SAC fatigue vs. strain range relationship using the high and low cycles of fatigue Coffin Manson closed form equation. In addition, this method can also predict solder joint fatigue cycles of one material using the already-derived fatigue cycles from another material without re-running detailed FE analysis. This additional feature would help, for example, to make prediction if re-ball from SAC to SnPb or vice versa would pose any risks. It is strongly recommended to utilize this method when assessing lead-free components under vibration as currently it is only available method to serve this purpose.
Reconfigurable NEMS based Advance Packaging for Anti Reverse Engineering and Counterfeiting
Authors: Khan Aslam A. , Sahebkar Keon , Need Ryan F. , Tehranipoor Mark M. , Asadizanjani Navid 
Published: May 2023

The chips used in modern electronic devices are mainly manufactured and packaged by Outsourced Semiconductor Assembly and Test (OSAT) facilities and are potentially vulnerable to hardware attacks. Due to the complexity of the global supply chain, it is difficult to track the full fabrication process by the foundries or the intellectual property (IP) owners. Additionally, the design for fabricating and packaging the chip made by IP owners remains the same and visible throughout the process. Hence, this design can be seen by every entity in the supply chain using physical inspection techniques, making it vulnerable if any adversaries are present in the supply chain. Security threats such as IP piracy, overbuilding, reverse engineering, and counterfeiting are thus possible by potential adversaries in the supply chain. These attacks have become an increasing concern in the world of trusted microelectronics as supply chain globalization continues to develop. Several security methods have already been developed to protect and detect such threats until they become embedded into sensitive systems, such as logic locking, obfuscating, physically unclonable functions (PUF), and hardware metering. However, these existing prevention methods have their limitations or are not applicable to all devices. In general, only a few existing methods make use of the inherent characteristics of electronic devices and materials to provide reliable security. Hence, novel security and assurance strategies with minimal changes or modifications in the fabrication of the system circuit are urgently required. This paper proposes a novel technique of obfuscation and locking using a reconfigurable nano-electromechanical system (NEMS) based advanced package throughout the supply chain. Using this novel technique, the netlist/golden design for heterogeneously integrated devices will be hidden from malicious adversaries, and the IP designer will have control of its design until it reaches the end-user.
Optimization of the Copper Microstructure to Improve Copper-to-Copper Direct Bonding
Authors: Schmidt Ralf , Schwarz Christian , Tamer Erkin , Dieter Sascha 
Published: May 2023

Advanced packaging solutions and heterogeneous integration are key technologies to enable devices with improved operating characteristics, including higher performance, increasing power efficiency, and decreasing form factor. Packages with high interconnect densities are required to efficiently combine, e.g., processing and memory units but impose restrictions to the pitch of the interconnects. Conventional technologies, including wire bonds and flip chip bonds are limited to larger pitches and, therefore, not suitable to meet the requirements of upcoming packaging technologies with respect to interconnect densities. Direct copper-to-copper interconnects are supposed to allow such small pitches of 10 µm or even below. However, formation of such bonds usually requires high temperatures and pressures. Temperature-sensitive devices like DRAM components restrict the maximum temperature that can be applied to the package. Thus, copper material is required, which allows bond formation at relatively low temperatures. In this context, hybrid bonding processes were discussed that involve initial bond formation via the usually oxide-based dielectric at room temperature followed by copper-to-copper bonding at elevated temperatures. The copper material is usually prepared by electrolytic deposition and the properties of the respective deposits may be modified by properly designed organic additives as well as process parameters. Strong bond formation of the copper should be obtained upon grain growth over the interface of the two deposits, which are brought into contact during the bonding step. In order to facilitate such growth at relatively low temperatures, suitable microstructures need to be prepared. Ideally, morphologies should be chosen in a way that they can be maintained throughout all process steps after the electrolytic deposition but, at the same time, allow grain growth over the interface during copper-to-copper bonding. Various strategies to enable improved seamless grain growth but maintain a metastable microstructure throughout the preceding process steps and the corresponding unique copper microstructures will be compared. In this context, different electrolytic copper deposition processes, the resulting microstructures, as well as their respective advantages and challenges with regards to copper-to-copper bond formation will be discussed.
Algorithm for Ultrasonic Wire Bond Outlier Classification
Authors: Villa Pedro , Seppänen Henri 
Published: May 2023

Wedge bonders use ultrasonic energy to bond metal wires onto metal substrates in a process that takes milliseconds. In high-volume production, failures cause downtime and costs. On-line monitoring systems are used to reduce the failures and determine the root cause. We developed and tested an algorithm to classify outliers in ultrasonic wire bond production. The algorithm is used in large wire wedge bonders to measure and analyze process signals and detect and classify bond outliers. It helps bonder operators, production supervisors and process engineers to detect process deviations and fix the underlying root causes. The algorithm measures bond signals, such as deformation, ultrasonic current, and ultrasonic frequency. Bonds are automatically divided into subgroups based on bond order and process parameters, and the signals within a subgroup are then normalized. For outlier classification, the features are extracted from the normalized signals and combined into failure class values. The failure classes such as contamination, no wire, high deformation, misaligned wire, and unstable substrate, are calculated independently. We measured the detection rates for large wire aluminum bond failure classes and demonstrate how the algorithm calculates failure class values from the signals. Additionally, we show how new signal features and failure classes can be defined to detect production-specific or rare failure classes.
Uneven Donor Engagement and Fraught Transboundary Conservation Approaches
Authors: Kachena Lameck , Spiegel Samuel J. 
Published: May 2023

Abstract
Mainstream environmental literature has often presented the initiation of transfrontier conservation areas (TFCAs) in southern Africa as progress, obscuring the influences of geopolitics and capitalist power relationships that shape TFCA initiatives. Recognising the need to explore trajectories that threaten the very core of what TFCA approaches, in theory, stand for, we undertook an ethnographic study in the Chimanimani TFCA along the Zimbabwe-Mozambique border to examine outcomes of uneven funding commitments associated with geopolitics and neoliberal conservation initiatives. We discuss how on the Mozambique side, access to donor funding linked to neoliberal programming has been associated with unfulfilled promises of ‘conservation-based enterprises’ and the grabbing of livelihood resources, while constricted access to conservation funding has been instrumentalised as a rationale for coercive ‘fortress conservation’ approaches in Zimbabwe, shaping tensions between park authorities and buffer communities. Communities on both sides of the TFCA experience unintended socio-ecological trajectories associated with economic inequalities and systems of exploitation, in turn leading to fraught conservation in the TFCA. Considering how these inequalities in TFCA management have also been worsened by shocks, including extreme climatic events and the COVID-19 pandemic, we conclude that more attention is warranted to the impact of uneven donor engagement driven by neoliberal principles and geopolitics on conservation.
A Phantom Study on Feasibility of Manual Field-in-Field Clinical Implementation for Total Body Irradiation and Comparison of Midplane Dose with Different Bilateral TBI Techniques
Authors: Pandu Bharath , Khanna D. , Mohandass P. , Elavarasan Rajadurai , Ninan Hima , Vivek T. R. , Jacob Saro 
Published: May 2023

Objective:
The aim of this study is to implement a new treatment technique in total body irradiation (TBI) using the manual field-in-field-TBI (MFIF-TBI) technique and dosimetrically verifying its results with respect to compensator-based TBI (CB-TBI) and open field TBI technique.

Materials and Methods:
A rice flour phantom (RFP) was placed on TBI couch with knee bent position at 385 cm source to surface distance. Midplane depth (MPD) was calculated for skull, umbilicus, and calf regions by measuring separations. Three subfields were opened manually for different regions using the multi-leaf collimator and jaws. The treatment Monitor unit (MU) was calculated based on each subfield size. In the CB-TBI technique, Perspex was used as a compensator. Treatment MU was calculated using MPD of umbilicus region and the required compensator thickness was calculated. For open field TBI, treatment MU was calculated using MPD of umbilicus region, and the treatment was executed without placing compensator. The diodes were placed on the surface of RFP to measure the delivered dose and the results were compared.

Results:
The MFIF-TBI results showed that the deviation was within ± 3.0% for the different regions, except for the neck for which the deviation was 8.72%. In the CB-TBI delivery, the dose deviation was ± 3.0% for different regions in the RFP. The open field TBI results showed that the dose deviation was not within the limit ± 10.0%.

Conclusion:
The MFIF-TBI technique can be implemented for TBI treatment as no TPS is required, and laborious process of making a compensator can be avoided while ensuring that the dose uniformity in all the regions within the tolerance limit.
Monte Carlo Modeling of Dynamic Tumor Tracking on a Gimbaled Linear Accelerator
Authors: Carpentier Emilie E. , Mcdermott Ronan L. , Su Shiqin , Rostamzadeh Maryam , Popescu I. Antoniu , Bergman Alanah M. , Mestrovic Ante 
Published: May 2023

Purpose and Aim:
The Vero4DRT (Brainlab AG) linear accelerator is capable of dynamic tumor tracking (DTT) by panning/tilting the radiation beam to follow respiratory-induced tumor motion in real time. In this study, the panning/tilting motion is modeled in Monte Carlo (MC) for quality assurance (QA) of four-dimensional (4D) dose distributions created within the treatment planning system (TPS).

Materials and Methods:
Step-and-shoot intensity-modulated radiation therapy plans were optimized for 10 previously treated liver patients. These plans were recalculated on multiple phases of a 4D computed tomography (4DCT) scan using MC while modeling panning/tilting. The dose distributions on each phase were accumulated to create a respiratory-weighted 4D dose distribution. Differences between the TPS and MC modeled doses were examined.

Results:
On average, 4D dose calculations in MC showed the maximum dose of an organ at risk (OAR) to be 10% greater than the TPS’ three-dimensional dose calculation (collapsed cone [CC] convolution algorithm) predicted. MC’s 4D dose calculations showed that 6 out of 24 OARs could exceed their specified dose limits, and calculated their maximum dose to be 4% higher on average (up to 13%) than the TPS’ 4D dose calculations. Dose differences between MC and the TPS were greatest in the beam penumbra region.

Conclusion:
Modeling panning/tilting for DTT has been successfully modeled with MC and is a useful tool to QA respiratory-correlated 4D dose distributions. The dose differences between the TPS and MC calculations highlight the importance of using 4D MC to confirm the safety of OAR doses before DTT treatments.
Assessment of abnormal involuntary movements in psychiatric patients: A cross-sectional study
Authors: Jaitpal Varun , Faye Abhijeet , Tadke Rahul , Gawande Sushil , Kirpeker Vivek , Bhave Sudhir 
Published: May 2023

Abstract

Context:
Movement disorders can be hyperkinetic or hypokinetic. They can be further classified as involuntary, semi-voluntary, voluntary, and automatic. These disabling and distressing disorders can be attributed largely to either neurological dysfunction or adverse effects of medications. Uncommon presentations of these disorders are often missed. It is important to study this aspect in psychiatric patients to plan appropriate measures and help improve the quality of life in these patients.

Aims:
The aim of this study was to estimate the prevalence and nature of abnormal involuntary movements in psychiatric patients.

Settings and Design:
This was a cross-sectional study that was conducted in an outpatient department/inpatient department (OPD/IPD) of tertiary-health care setting.

Materials and Methods:
After the institutional ethics committee’s permission, 50 patients attending the psychiatry OPD/IPD were enrolled and interviewed after taking their written informed consent. A semi-structured-proforma, questionnaire prepared for the study, and the AIMS scale were administered for the assessment. Data were analyzed statistically and results were obtained. Epi-info 7 software was used and prevalence rates were calculated.

Results:
Approximately 22% of cases of abnormal movements were identified by AIMS criteria, whereas 64% of cases were identified by questionnaire criteria. Significantly more (42%) cases were picked up by questionnaire method over AIMS-criteria. Tremors of hands and feet were the most common abnormal involuntary movement seen in 54% of participants as per the questionnaire, and, they were seen mostly in patients on antipsychotics.

Conclusions:
Abnormal involuntary movements are common among psychiatric patients, more commonly in patients on antipsychotics. Many cases often go undiagnosed, which suggests that better assessment modalities should be adopted for appropriate detection and management besides standard scales like AIMS.
Elder Abuse in Rural Belagavi
Authors: Malhotra Nishtha , Shivaswamy M. S. 
Published: May 2023

Background:
Elder abuse is defined by the WHO as: “a single or repeated act or lack of appropriate action, occurring within any relationship where there is an expectation of trust, which causes harm or distress to an older person.” Elder abuse has always been considered a western problem and its existence in India has never been acknowledged seriously. The present study aimed to find the prevalence of elder abuse and assess the sociodemographic determinants for the same.

Materials and Methods:
A cross-sectional, questionnaire-based study was conducted among 400 in elderly population of age ≥60 years, residing for at least 1 year in rural field practice areas of primary health-care Vantamuri in Belagavi taluka and district, Karnataka state, India, by systematic random sampling from January 1, to December 30, 2020. A set of pretested standardized questionnaires consisting of three parts, including “Modified Geriatric Mistreatment Scale” to assess the elder abuse prevalence, were used. Statistical analysis was done by using rates, proportions, and percentages, and the association was tested with Chi-square test and binary logistic regression.

Results:
Among the 400 elderly participants, the overall prevalence of elder abuse was found to be 68 (17%). Among all these cases, maximum number of them were facing psychological abuse (59, 52%), followed by economic exploitation (24, 21%), neglect (23, 20%), and physical abuse (8, 7%). None of the participants had experienced sexual abuse. Statistically significant association was present between the occurrence of abuse and sociodemographic characteristics such as age ≥70 years, illiteracy, elderly living with family/spouse, and living in a house owned by spouse/others or a rented place.

Conclusion:
The prevalence of elder abuse was found to be low (17%) as compared to what was expected (35%). Elder abuse exists in India in various forms, and it is imperative to form new policies and strategies by the government, police, health administration, and NGOs to prevent abuse of elderly population in rural India.
A Cross-sectional Study to Evaluate Hand Preferences from Performance Measures Namely Work Done, Nerve Conduction Velocity, and Bimanual Coordination among Phase I Medical Students
Authors: Bagi Jaysheela , Kour Harpreet 
Published: May 2023

Background and Objective of the Study:
Most of the individuals classify themselves as right or left handed but it is not entirely clear whether handedness should be determined based on preference inventories, hand performance tasks, or a combination of both. The strength and significance of the relationship between hand preference and performance asymmetries have always been contested.

Materials and Methods:
This cross-sectional study has evaluated different performance measures to predict hand preference among a total of 150 1st year medical students. The performance measures included work done by ergography, nerve conduction velocity test, and bimanual coordination test.

Results:
A statistically significant correlation was found between hand performance and preference measures (P < 0.05 was considered as significant).

Conclusion:
This study helps to understand the degree of hand dominance on various performance tasks. In particular to medical profession, this study may help in the modifications of the instruments and training given to medical students in improving their bimanual dexterity.