bluuebunny/crossref_metadata_2025_split huggingface dataset:
Niveles Séricos de Vitamina D y su Relación con el Grado de Conminución Ósea, en Pacientes con Fracturas de Cadera
Authors: Gordillo Méndez Eduardo Jesús , López Estrada Drusso , Carrera Paz Verónica Guadalupe 
Published: January 2025

Introducción: La vitamina D es una hormona cuya función es captar calcio desde el medio externo. Siendo esencial para la homeostasis ósea. Incrementándose su estudio en los últimos 20 años. Su deficiencia repercute en la disminución de los niveles del calcio, la elevación de la paratohormona y aumento de la remodelación ósea, disminuyendo la masa mineral ósea y aumentando el riesgo de fracturas. Siendo común en pacientes mayores y se relaciona con fracturas de cadera en dicha población. Objetivo: Determinar la relación de los niveles séricos de vitamina D con el grado de conminución ósea, en pacientes mayores de 50 años con diagnóstico de fracturas de cadera por mecanismo de lesión de bajo impacto atendidos en un hospital del sureste del país. Material y método: estudio cuantitativo, descriptivo, transversal y prospectivo, con adultos mayores de 50 años, con fractura de cadera secundaria a un mecanismo de lesión de bajo impacto, con un nivel sérico de vitamina D cuantificado, sin evidencia de territorio previamente patológico, o mecanismo de lesión de alto impacto. Realización de encuesta, formación de base de datos de los pacientes muestra, procesamiento de la información en software IBM SPSS. Resultados: Cumplieron con los criterios de inclusión del estudio 25 pacientes. Los cuales 56% fueron mujeres, la media del IMC fue de 30, el 52% estuvo en el grado de deficiencia y 36% de insuficiencia, el 52% tuvo un patrón de fractura definido como fragmentado, y 28% un patrón multifragmentado, así como un 72% de los pacientes encontrándose con algún déficit de vitamina D y un patrón fragmentado o multifragmentado de fractura. Además, se encontró una relación entre la hipovitaminosis D y la hipertensión arterial estando presente en un 72% de la población muestra. Conclusión: La hipovitaminosis D está relacionada al mayor grado de conminución de la fractura, las comorbilidades como la hipertensión están asociados a bajos niveles séricos de la misma.
Radio Follow-up Observations of SN 2023ixf by Japanese and Korean Very Long Baseline Interferometers
Authors: Iwata Yuhei , Akimoto Masanori , Matsuoka Tomoki , Maeda Keiichi , Yonekura Yoshinori , Tominaga Nozomu , Moriya Takashi J. , Fujisawa Kenta , Niinuma Kotaro , Yoon Sung-Chul , Lee Jae-Joon , Jung Taehyun , Byun Do-Young 
Published: January 2025

Abstract
We report on radio follow-up observations of the nearby Type II supernova SN 2023ixf, spanning from 1.7 to 269.9 days after the explosion, conducted using three very long baseline interferometers (VLBIs), which are the Japanese VLBI Network, the VLBI Exploration of Radio Astrometry, and the Korean VLBI Network. In three observation epochs (152.3, 206.1, and 269.9 days), we detected emission at the 6.9 and 8.4 GHz bands, with a flux density of ~5 mJy. The flux density reached a peak at around 206.1 days, which is longer than the timescale to reach the peak observed in typical Type II supernovae. Based on an analytical model of radio emission, our late-time detections were inferred to be due to decreasing optical depth. In this case, the mass-loss rate of the progenitor is estimated to have increased from ~10−6–10−5
M
⊙ yr−1 to ~10−4
M
⊙ yr−1 between 28 and 6 yr before the explosion. Our radio constraints are also consistent with the mass-loss rate needed to produce a confined circumstellar medium proposed by previous studies, which suggest that the mass-loss rate increased from ~10−4
M
⊙ yr−1 to ≳10−2
M
⊙ yr−1 in the last few years before the explosion.
Improving Medication-Related Safety for Residents in Nursing Homes: A Qualitative Study
Authors: Shieu Bianca , Lee Ya-Wen , Epps Fayron , Wang Mei-Chen , Harris John 
Published: January 2025

Purpose
To gain a better understanding of the perceptions of RNs on medication safety concerns and potential solutions for nursing home (NH) residents.

Method
This prospective, qualitative study used semi-structured phone interviews with a description approach. We used purposeful sampling to recruit 12 RNs employed at two NHs in the northeastern region of the United States. The Systems Engineering Initiative for Patient Safety constructs informed the interview guide, coding, and qualitative theme identification.

Results
We categorized non–user-friendly charting systems and gained insights into more experience with paper-based charting under the technology component. For the organization component, participants identified the importance of teamwork, communication, and leadership. Participants also mentioned how education and nationality of training impact medication administration (MA) safety. Task-related concerns revealed how different care approaches, extreme workload variation, and task prioritization during the day are perceived as critical issues that need to be addressed. Staff shortages were also expressed as an environment-related concern.

Conclusion

Findings highlight the importance of appropriate nurse-to-patient ratio, the significance of user-friendly charting systems, and customizing the interface of MA in the charting system. [
Journal of Gerontological Nursing, 51
(3), 38–43.]
Déconstruire les stéréotypes de genre au sein de sa classe : étude sur l’influence des enseignant·es dans les classes primaires de Genève
Authors: Fracheboud Orane , Hull Jenna , Magni Giorgia 
Published: January 2025

Dans une société où les inégalités structurelles entre les sexes persistent, un changement serait envisageable si l’institution scolaire s’investissait activement dans des initiatives visant à promouvoir l’égalité des sexes. Dans la lutte contre les stéréotypes de genre à l’école primaire l’enseignant·e joue un rôle central, mais est-ce qu’elle ou il détient une réelle marge de manœuvre pour les contrer au sein de sa classe ? Cette recherche a pour objectif de comprendre si le changement des représentations des élèves par un enseignement à l’égalité des sexes relève d’une utopie ou si les enseignant·es détiennent un impact réel sur les représentations des futures générations. À cette fin, le dispositif mis en place vise à comparer une classe d’élèves de 2Ph (5-6 ans) avec une classe d’élèves de 8Ph (11-12 ans), aﬁn d’estimer la marge de manœuvre de l’enseignant·e au début de l’école obligatoire en Suisse, jusqu’au terme du cursus primaire. Par « marge de manœuvre », nous entendons la possibilité d’action des enseignant·es visant à amener les élèves vers une évolution dans leurs représentations. Nous montrerons que l’école peut faire bouger les élèves dans leur socialisation primaire, malgré la socialisation qu’ils/elles peuvent acquérir hors de l’école.
Entretien avec Murielle Gerin à propos de son ouvrage Concrétiser l'égalité des sexes : écrire ensemble au CP. Dialogues didactiques
Authors: Pasquier Gaël 
Published: January 2025

Dans son ouvrage, Concrétiser l'égalité des sexes : écrire ensemble au CP. Dialogues didactiques, Murielle Gerin prend le parti de s’interroger sur ce que signifie éduquer à l’égalité des sexes à travers la mise en œuvre d’une ingénierie didactique de co-écriture fille-garçon en classe de Cours Préparatoire. Chaque étape de son livre permet de mesurer que l’égalité n’est pas un « donné » des situations de classe, qu’elle ne saurait jamais aller de soi ou se limiter à des intentions, mais qu’elle est à conquérir par une investigation rigoureuse de ce qui se passe réellement entre les élèves, entre les élèves et l’enseignant·e, au cœur même des situations d’enseignement/apprentissage. Dans l’entrevue qui suit, l’autrice partage avec Gaël Pasquier les idées fortes de sa recherche.
“On ne peut rester neutre dans un train en marche”
Authors: Boubaker Manel Ben 
Published: January 2025

À partir d’un récit d’analyse de pratiques sur l’intégration des questions antiracistes et antisexistes dans mes classes en lycée, je souhaite analyser les apports comme des limites de cette praxis (Freire, 1967) dans une institution scolaire qui invisibilise les rapports de genre, de race et de classe pour toustes, élèves comme personnels. Le titre de mon article rappelle notre impossible neutralité enseignante. Nous ne pouvons pas nous croire neutres dans une institution (figurée par le train en marche) qui reproduit elle-même des dominations systémiques. Je pars de l’hypothèse que pour révolutionner son enseignement, il faut basculer - car une révolution est d’abord au sens étymologique un point de bascule - dans ses pratiques comme dans son positionnement. Un processus révolutionnaire est avant tout un acte d’empouvoirement, dans le sens de la conscientização théorisée par Paulo Freire, et une pédagogie véritablement antiraciste et antisexiste a pour objectif également de redonner le pouvoir aux élèves. Mais comment basculer vers ces pédagogies concrètement ? Dans un premier temps, je m’intéresserai à la façon d’introduire le désordre (Fanon, 1961) dans sa classe et questionner sa pédagogie. Ensuite, je mettrai en évidence que l’action individuelle dans le cadre de sa classe ne suffit pas, et qu’il faut adopter la figure de la rabat-joie féministe (Ahmed, 2024) dans toute l’institution scolaire. Enfin, j’explorerai des pratiques collectives porteuses d’espoir.
Définir le concept de consentement en contexte éducatif : proposition à partir de la Toile de l’égalité
Authors: Montigny Béatrice de , Brunet Marie-Hélène 
Published: January 2025

Le mouvement #MeToo et ses suites ont contribué à multiplier les discussions entourant le concept de consentement et à mettre en lumière ses liens avec la prévention des violences sexuelles (Moyano et al., 2023). Toutefois, depuis déjà plusieurs décennies, le concept fait l’objet de discussions aux niveaux juridique, académique et populaire. Dans un premier temps, nous explorerons les différentes définitions théorisées à l’intérieur des champs de savoir juridique, philosophique et scolaire (Beres, 2014; Hickman & Muehlenhard, 1999; Hörnle, 1998; Hurd, 1996). Dans un deuxième temps, nous analyserons de quelle manière ces diverses conceptions influencent ou limitent la compréhension du consentement, notamment en lien avec la prévention des violences sexuelles (Hall, 2019; Schneider & Hirsch, 2018). Enfin, nous proposerons une définition propre à l’enseignement-apprentissage du concept de consentement en se basant sur la Toile de l’égalité proposée par Collet et al. (2024).
Palmyre-Tadmor : une histoire politique et sociale des ruines
Authors: Gillot Laurence 
Published: January 2025

L’étude sur la longue durée du processus de patrimonialisation des ruines et du site archéologique de Palmyre permet de saisir l’évolution des regards et des usages, à la fois politiques et sociaux, des ruines de cette ancienne cité caravanière, devenu lieu de mémoire, à la fois national et mondial, ainsi que site patrimonial et touristique majeur en Syrie. Palmyre est également objet de convoitises et un lieu de conflits où les récentes destructions par Daech et les débats consécutifs sur sa reconstruction, ont également rappelé l’importance des enjeux idéologiques et touristiques associés à ce site. En outre ces processus ont été marqués par l’engagement d’acteurs divers : voyageurs, archéologues, institutions étrangères et nationales, associations, populations locales, ont ainsi contribué à la reconnaissance et la transmission d’un patrimoine tantôt partagé, tantôt contesté. Le présent article montre ainsi que l’élaboration de Palmyre comme patrimoine s’est effectuée sur une longue durée, et fut marquée par des mouvements de construction/déconstruction, oubli-abandon/redécouverte-réusage.
A Novel Photosensitive Permanent Bonding Material for Polymer/Metal Hybrid Bonding
Authors: Huang Baron , Tsai Duo , Liu Xiao , Puligadda Rama 
Published: January 2025

Wafer-level hybrid bonding techniques, which provide simultaneous bonding between metal-metal and between dielectric-dielectric layers, has attracted more attention in recent years for fabricating 3D integrated circuits with high bandwidth and high interconnect density. However, there are some issues for conventional hybrid bonding using silicon oxide as the dielectric, such as the high stress and low tolerance to height difference of bonding interface, which limits its applications for 3D heterogeneous integration. In this paper, a novel negative-tone photosensitive polymeric bonding material is proposed to be used as a dielectric to enable polymer/metal hybrid bonding. Compared to silicon oxide, the polymeric material with low Young’s modules is able to absorb thermally induced stress created during bonding process and results in lower bow for the bonded substrates. The key features for the photosensitive permanent bonding material include 1) low dielectric constant and dissipation factor; 2) superior thermal stability (>350°C); 3) excellent fine-pitch capability (4 micron); and 4) low processing and curing temperatures (<200°C). The photosensitive permanent bonding material has also been demonstrated to be able to be patterned and bonded to another Si or glass substrate with good adhesion and no obvious defects. The details of the material characterization, process optimization, reliability, and preliminary polymer/metal hybrid bonding results will be presented in the paper.
Copper Wire Ready for Automotive AEC Requirements?
Authors: Crockett William 
Published: January 2025

Wire bonding is widely used in the microelectronics industry to assemble the vast majority of semiconductor packages, electrically connecting Aluminum (Al) bond pads on the IC chips to the corresponding bond pads on the plastic or lead frame chip carriers. The Industry has short listed several common Bond wires which usually consist of good conductor metals such as Gold (Au), Aluminum (Al), and Copper (Cu). Gold has been the most preferred material because of its long successful history, extensive reliability data, resistance to surface corrosion and wire ductility during the wire bonding process. However, as the price of gold is currently in a global volatile market, the microelectronics industry has once again been presented with cost driver opportunities for bonding wire material for High Reliability Applications such as Automotive Applications. Many companies have looked at bare Copper wire as a viable replacement option for Gold wire, however many barriers were encountered using conventional Copper wire in advanced packaging and assembly. The main industry shortcomings were; reduced lifespan of Copper wire (productivity and reliability), necessity to use wire surface oxidation which limited shelf/bonder life and hard ball formation at the tip of the bonding wire. Cu wire presents challenges in meeting reliability standards for Automotive AEC requirements. The discussion will cover the influences of various wire types and mold compound interactions on the package reliability for Automotive AEC requirements. Extended reliability of Cu wire types will be investigated after unbiased/biased (HAST) and high temperature storage life (HTSL) at 150C, 175C aging temperatures. Failure mechanisms will be presented after observations of extended reliability tests on bonded Cu wire samples. Future engineering work should be focused on the utilization of best known methods (BKM) and predictions of Cu wire reliability testing to understand the initial failure point risk in Automotive device packaging.
Improved Optical Profiler Metrology for Advanced Packaging
Authors: Lesko Samuel , Cid Robert 
Published: January 2025

Advanced packaging challenges standard metrology means, notably optical profilers, by shrinking dimensions and spacings between interconnect (RDL, Bump, via). New needs such as die flatness and roughness also raise up due to the critical requirement of robust stacking into complex 3D assembly. Challenges translate into demand for both higher lateral and vertical resolution. In this talk, we will introduce optical profiler based on White Light Interferometry principle (WLI) which has inherent advantages combining lateral resolution below micron level as well as providing sub-nanometer vertical resolution at all magnifications. We will explain how this technology can not only provide solution for current Re-Distribution Layer (RDL), bump and Under Bump Metallization (UBM) but also scope through new development with future roadmap. Talk will further develop topics into two main directions. The first one consists on studying or monitoring the low roughness of die and supporting sacrificial wafer in case of Chip-on-Wafer-on-Substrate (CoWos). Roughness indeed plays key role in adequate adhesion between die and wafer on top of possible impact from surface contamination. Curvature of die can also trigger issues during anchoring process for which control of overall die shape is beneficial. In both cases, WLI optical profiler fulfills stringent metrology via sub-nanometer vertical resolution along large field of view. Throughput and 10’s picometer (pm) repeatability are then compatible with inline control through integration of wafer handler. The second direction will focus on panel level integration with measurement on next generation RDL. We will illustrate how large optical platform can scope with 600mm by 600 mm panel and provide metrology for Critical Dimensions on RDL. Notably, we will present evidences of metrology capability for 1µm and 0.8µm RDL technology by using newly developed super-resolution algorithm. This algorithm allows 2x enhancement regarding lateral resolution making possible measurement of high dense RDL or bump array. Finally, we will present data regarding high aspect ratio Through Silicon Via (TSV) with regular objective up to 1:20. WLI technology uniquely provides technical advantages such as combination of parallel light injection, ability to scope with weak signals and nanometer repeatability. Conclusion will open possible expansion of technology to measure with high throughput PhotoResist (PR) layer thickness as well as thin insulative oxide layer.
Permanent Bonding Adhesive: A Novel Permanent Bonding Material
Authors: Stanley Trevor , Sejoubsari Reihaneh , Liu Xiao 
Published: January 2025

Permanent wafer bonding in advanced microelectronic and microelectromechanical systems platforms includes direct, anodic, solder, eutectic, thermocompression, direct metal-to-metal, ultrasonic, and adhesive bonding. Among all these techniques, this work focuses on wafer bonding using polymeric adhesives. Adhesive bonding is a powerful technique that uses a polymeric intermediate layer to create a bond between two surfaces or wafers. The main advantages of adhesive bonding are simplicity, greater design flexibility, surface planarization and low bonding temperature. Three-dimensional integrated circuits (3D-ICs), microelectromechanical systems (MEMS) and IC integration, wafer-level packaging (WLP), and biomedical microelectromechanical systems/micro total analysis systems (BioMEMS/µTAS) frequently use an adhesive bonding approach. Greater design flexibility, surface planarization, and low bonding temperature are main advantages of adhesive bonding. Various polymeric materials have been reported being utilized as adhesive bonding layers but moisture absorption, limited thermal stability, and long- term reliability of many of these polymers can still cause manufacturers to withhold the processes from high-volume production. Benzocyclobutene (BCB), a widely used bonding adhesive, faces challenges to achieve void-free adhesive bonding with simultaneous high post-bonding alignment accuracy. This paper introduces a novel permanent bonding material with low moisture absorption and high thermal stability that is available in both photosensitive and non-photosensitive formulations. Details of the material and process optimization along with reliability and performance results will be discussed in this paper. Improved rheology that results in better planarization, improved bond quality and low bonding temperature that enables high throughput and void-free bonding with high post-bonding alignment accuracy are advantages of this permanent bonding material.
Solution for Accelerator Wall of HPC with HBM Integrated Packages
Authors: You JinWei 
Published: January 2025

With 4 billion-scaled daily-online- population in digital world, it becomes that the driving force of global economic is increasing the capital expenditure on cloud infrastructure deployed. As the architecture of high performance computing (HPC) is the trending on heterogeneous interconnection package (HIP) and three-dimension stacked platform as one of direction to migrate the accelerator wall. The routing path out of memory-bank is majority index reflecting on computing performance at band-width, data-rate latency, and power efficiency with rephrasing the Moore¡¦s Law on logic cell development. The numbers of packaged platform options is pop-up in semiconductor industry, momentum growing at on-and-off die scale packaging platform. The catalogue in industry is divided by three group: silicon bridge interposer, fan-out routed technology, substrate-selective replaced by silicon bridge die. In-depth reviewing the HIP packaging profile: First, silicon bridge interposer is strength on the surface of three-dimension thermal dissipation flow and equipping the less than 1/1 um L/S capability but mineral cost of silicon manufacturing is jeopardizing the ROI issue on expensive for consuming the deployed routed area. Second, fan-out routed technology is deploying the routing capability ranging from 2/2 um to 10/10 um L/S outline profile as flexible connection platform. Third, substrate-selective replaced by silicon bridge die is to leverage mature flip chip platform, it did provide the competitive pricing solution but the embedded die bridge technology is to constrain the power and computing at horizon scalable out deployment. This paper is to present the electrical metrics on HBM Integrated Packages at industry benchmark catalogue by simulation software analysis. The software modeling is to render the transportation performance of bit source deployed at high speed memory bank connection, and communicate the through-hole-via routing at fan-out scalable area, then reach to another logic cell chip bank. The strength is grouping the diversity transistor layout power-supplied at three-dimension building for avoiding the horizon transistor current constrain. The raised-module solution is key to jump across the accelerator wall with the advocating on bit-per-joule and ROI for next high performance computing.