bluuebunny/crossref_metadata_2025_split huggingface dataset:
Socjalizacja i kultura polityczna
Authors: Marzęcki Radosław 
Published: January 2025

DEFINICJA POJĘCIA: Socjalizacja polityczna jest procesem nabywania przez jednostki poznawczych, afektywnych i oceniających orientacji wobec systemu politycznego i jego instytucji, jak również określonych standardów zachowań politycznych poprzez obserwację, internalizację, przekształcanie, aktualizację oraz twórcze rozwijanie wzorów kultury politycznej zbiorowości, w których te jednostki funkcjonują.
ANALIZA HISTORYCZNA POJĘCIA: Termin „socjalizacja polityczna” wprowadzono do dyskursu naukowego w latach 50. XX wieku. W kolejnej dekadzie upowszechniło się pojęcie kultury politycznej. Od samego początku w pracach amerykańskich politologów oba zjawiska postrzegano w kategoriach ciągu przyczynowo-skutkowego: traktując socjalizację polityczną jako proces adaptacji do kultury politycznej danego społeczeństwa.
UJĘCIE PROBLEMOWE POJĘCIA: Z toczonej od końca lat 50. XX wieku naukowej dyskusji o socjalizacji politycznej wyłania się szereg zagadnień problemowych, które zachowały swoją aktualność. Dotyczą one m.in. trwałości oddziaływań socjalizacyjnych w toku życia jednostki, kluczowych czynników i podmiotów socjalizacji, kierunków wpływu czy eksponowanych w przestrzeni publicznej i medialnej wzorców zachowań politycznych.
REFLEKSJA SYSTEMATYCZNA Z WNIOSKAMI I REKOMENDACJAMI: Charakter procesu socjalizacji oraz istota kultury politycznej powodują, że kształtowanie pożądanych (np. z punktu widzenia jakości systemu demokratycznego) orientacji politycznych odbywa się w bardzo długim okresie, a dodatkowo może być stale „aktualizowane” poprzez osobiste doświadczenia jednostek. Prowadzi to do refleksji nad treścią wyzwań, które stoją przed różnymi podmiotami i instytucjami, powołanymi do tego, by wspierać efektywne społeczeństwo demokratyczne.
Analisis Pengaruh Infill Density terhadap Kekuatan Tarik Filamen Polyethylene Terephthalate Glycol
Authors: Kadafu Abidin , Nurida Finahari  , Dadang Hermawan  , Leo Hutri Wicaksono  
Published: January 2025

Printer 3D adalah proses membuat sebuah objek atau prototipe manufaktur aditif (AM) melalui model digital. Teknologi 3D merupkan salah satu teknologi yang biasanya digunakan untuk mencetak sebuah objek yang di gambar dalam bentuk 3 dimensi. Tujuan dari penelitian ingin yaitu menganalisis pengaruh infill density terhadap kekuatan tarik pada filamen Polyethylene Terephthalate Glycol. Metode yang digunakan yaitu metode eksperimen mengunakan mesin cetak 3D, dengan variasi infill density 40%,60%dan80%. Hasil yang didapatkan dengan mengunakan variasi pegujian kekuatan tarik spesimen dengan infill density 40% memiliki nilai 9,61 Mpa, infill density 60% memiliki nilai 12,68 Mpa dan infill density 80% memiliki nilai 15,20 Mpa. Maka dapat disimpulkan bahwa infill density 80% dengan nilai 15,20 Mpa yang lebih tinggi dikarenakan pada infill density 80% memiliki nilai kpadatan yang sangat baik mengakibatkan nilai tegangan yang di hasilkan lebih tinggi.
Pengembangan Aplikasi Keselamatan dan Kesehatan Kerja CAPEDE (Checklist Alat Pelindung Diri) Berbasis Android pada Pekerja Di Industri Karet Kota Palembang
Authors: Doeangge Lala Febri Annissa , Noviadi Pitri , Adzra Shafiyah Atiqa , Putri Gledisyah Kurnia 
Published: January 2025

Latar Belakang: Alat Pelindung Diri (APD) adalah kelengkapan yang wajib digunakan saat bekerja sesuai kebutuhan untuk menjaga keselamatan pekerja maupun orang yang disekelilingnya. Tujuan dari penggunaan APD adalah untuk mencegah terjadinya perpindahan energi / kontak antara pekerja dengan material / mesin yang digunakan pada saat bekerja sehingga menimbulkan kecelakaan / cacat / luka / penyakit akibat kerja. Tujuan: Penelitian ini bertujuan mntuk membuat perancangan aplikasi K3 CAPEDE yang dapat digunakan pekerja PT. X. Metode: Jenis penelitian ini adalah penelitian Research and Development (R & D) dengan metode four D (4D), meliputi tahapan pendefinisian (define), perancangan (design), pengembangan (development), dan penyebaran (disseminate). Penelitian dilaksanakan di PT. X dengan waktu pada tanggal 1 Agustus 2023– 30 Oktober 2023. Populasi seluruh pekerja di PT. X dan sampel pada penelitian ini adalah 30 orang pekerja bagian produksi PT. X. Pengambilan sampel dengan menggunakan metode purposive sampling. Pengumpulan data dalam penelitian ini dilakukan secara wawancara dan observasi. Analisis data menggunakan analisis data kuantitatif. Hasil: Hasil penelitian dengan melalui beberapa tahapan metode 4 D didapatkan bahwa aplikasi K3 CAPEDE telah memenuhi kelayakan kategori sangat layak baik dari penilaian pakar K3 (88,75%) dan ahli media (85%) dan penilaian sangat baik oleh pekerja (77,12%). Kesimpulan: Saran yang dapat diberikan adalah hasil penelitian ini semoga dapat diimplementasikan ke depannya pada bidang keilmuan keselamatan dan kesehatan kerja khususnya dalam penggunaan APD pada beberapa perusahaan.
Revisiting episodic-like memory in scrub jays: Is there more we can still learn from what–where–when caching behaviour?
Authors: Worsfold Ella , Clayton Nicola S. , Cheke Lucy G. 
Published: January 2025

AbstractProfessor Nicola Clayton is perhaps best known for her work on food-caching scrub jays. Her seminal 1998 paper, together with Anthony Dickinson, showed that scrub jays could remember what food they had cached, where and how long ago, suggesting memory ability that is ‘episodic-like’ in nature. Here, we present data from a previously unpublished study that sought to replicate and extend these findings. The results replicate previous findings and address potential alternative explanations for earlier results. We argue that the controlled behavioural analyses introduced in this study have the potential to add nuance to our understanding of memory in scrub jay cache retrieval, and to inspire new studies exploring this phenomenon, about which we still have so much to learn.
EFEKTIFITAS PEMBERIAN ASI TERHADAP NYERI BAYI DENGAN TINDAKAN PENGAMBILAN SAMPEL DARAH DI RUANG PERINATOLOGI RS PKU MUHAMMADIYAH SURAKARTA
Authors: Rochmani Rizania , Anik Enikmawati  , Nevia Zulfatunnisa  
Published: January 2025

Bayi di ruang intensif sering mendapat tindakan yang mengakibatkan nyeri. Bayi yang sering terpapar nyeri berisko mengalami gangguan perkembangan otak, syaraf dan perilaku. Pemberian ASI sebelum pengambilan darah merupakan tatalaksana nonfarmakologi yang membantu menurunkan nyeri. Tujuan penelitian ini adalah untuk mengetahui efektifitas pemberian ASI terhadap nyeri bayi saat pengambilan sampel darah. Penelitian ini merupakan penelitian kuantitatif dengan desain quasy experiment post test control group design, dengan teknik purposive sampling dan pendekatan cross sectional. Analisa data menggunakan uji statistik mann whitney. Populasi penelitian ini adalah bayi yang di rawat di ruang perinatologi RS PKU Muhammadiyah Surakarta sebanyak 28 bayi. Hasil penelitian menunjukkan ada respon fisik bayi berupa ekspresi, tangisan, pola nafas, reflek kaki tangan, tingkat kesadaran, dan nilai nadi. Kenaikan nadi berbanding lurus dengan nyeri, semakin tinggi nyeri nadinya semakin meningkat. Hasil uji mann whitney menunjukkan nilai p value 0,000 maka P < 0,05 yang artinya terdapat efektifitas pada pemberian ASI dengan nyeri bayi saat dilakukan pengambilan sampel darah, dimana kelompok kontrol mayoritas skala nyeri sedang dan kelompok intervensi mayoritas nyeri ringan. Kesimpulan penelitian ini adalah pemberian ASI efektif dalam menurunkan nyeri bayi saat pengambilan sampel darah.
Kata kunci: ASI, nyeri bayi, nonfarmakologis, pengambilan sampel darah
Infant in intensive care often receive procedures that cause pain. Infant who are frequently exposed to pain are at risk of experiencing brain, nerve and behavioral development disorders. Giving breast milk before blood collection is a non-pharmacological treatment that helps reduce pain. The aim of this study was to determine the effectiveness of breastfeeding on infant pain when taking blood samples. This is quantitative research, quasy experiment post test control group design, with purposive sampling techniques and a cross sectional approach, using the mann whitney statistical analysis test. there were physical responses of the baby in the form of expressions, crying, breathing patterns, hand-leg reflexes, level of consciousness, and pulse values. The increase in pulse is directly proportional to pain, the higher the pain, the more the pulse increases. The results of the Mann Whitney test show that p value of 0.000, so p value < 0.05, which means that there is effectiveness in breastfeeding for infant pain when blood samples are taken, where the majority of the control group has moderate pain scale and the intervention group has the majority of mild pain. The conclusion of this study is that breastfeeding is effective in reducing infant pain during blood sampling.
Keyword: baby pain, blood samples, breast milk, non-pharmacological
KESIAPAN DASAWISMA DALAM PROGRAM WILAGA CETING STUDI KUALITATIF DI PUSKESMAS SIBELA KOTA SURAKARTA
Authors: Mulyanti Sri , Budi Astuti Athanasia 
Published: January 2025

Anak kurang gizi kronis masih merupakan masalah kesehatan anak di Indonesia yang berdampak pada masih tingginya angka stunting. Hasil Survei Status Gizi Indonesia (SSGI) prevalensi stunting di Indonesia 2022, turun dari 24,4% menjadi 21,6%, masih lebih tinggi dari standar WHO yaitu 20%. Diperlukan peran serta dasawisma dalam mendukung inovasi peningkatan gizi pada anak. Tujuan penelitian ini untuk menganalisis persepsi kesiapan dasawisma dalam mendukung program Wilaga Ceting. Jenis penelitian adalah qualitatif dengan pendekatan tematik. Subyek penelitian adalah delapan informan yang diambil secara multistage random sampling. Data diambil dengan wawancara mendalam menggunakan pedoman wawancara semi terstruktur, dilakukan Pebruari – Juni 2024. Hasil dari penelitian menunjukkan persespi kader dasawisma: 1) Stunting adalah anak pendek akibat gangguan pertumbuhan anak yang terjadi karena kurang gizi. 2) Jumlah stunting di Kota Suarkarta masih cukup tinggi 3) Program Wilaga Ceting sangat bagus sehingga perlu didukung oleh masyarakat, 4) Kader dasawisma membutuhkan pelatihan untuk mendukung program wilaga ceting. Kesimpulan penelitian adalah Kader Dasawisma siap mendukung program inovasi wilaga ceting.
Kata kunci: dasa wisma, kader kesehatan, stunting, wilaga ceting
Chronically malnourished children are still a child health problem in Indonesia which has an impact on the still high rate of stunting. The results of the Indonesian Nutritional Status Survey (SSGI) show that the prevalence of stunting in Indonesia in 2022 has decreased from 24.4% to 21.6%, still higher than the WHO standard of 20%. There is a need for an equal role in supporting innovations to improve nutrition for children. The aim of this research is to Analyzing perceptions of the readiness of dasa homesteads in supporting the Wilaga Ceting program. This type of research is Qualitative research with a thematic approach. The research subjects were eight informants taken using multistage random sampling. Data was taken by in-depth interviews using semi-structured interview guidelines, conducted February-June 2024. The results showed that perception of Dasa Wisma cadres: 1) Stunting is a child who is short due to impaired child growth which occurs due to malnutrition. 2) The number of stunting in Surakarta City is still quite high. 3) The Wilaga Ceting program is very good so it needs to be supported by the community. 4) Dasa Wisma cadres need training to support the Wilaga Ceting program. The conclusion of the research is that Knolewdge and motivation Dasa Wisma cadres are ready to support the Wilaga Ceting innovation program.
Keyword: dasa wisma, health cadres, stunting, wilaga ceting
Hot Spot Offset Variability from Magnetohydrodynamical Thermoresistive Instability in Hot Jupiters
Authors: Hardy Raphaël , Charbonneau Paul , Cumming Andrew 
Published: January 2025

Abstract
Hot Jupiter (HJ) atmospheres are possibly subject to a thermoresistive instability (TRI). Such an instability may develop as the ohmic heating increases the electrical conductivity in a positive feedback loop, which ultimately leads to a runaway of the atmospheric temperature. We extend our previous axisymmetric one-dimensional radial model, by representing the temperature and magnetic diffusivity as a first-order Fourier expansion in longitude. This allows us to predict the hot spot offset during the rapid unfolding of the TRI and following Alfvénic oscillations. The instability is periodically triggered and damped within ≈10–40 days, depending on the magnetic field strength, with months of slow buildup between recurring bursts. We show a few representative simulations undergoing TRI, in which the peak flux offset varies between approximately ±60∘ on a timescale of a few days with potentially observable brightness variations. Therefore, this TRI could be an observable feature of HJs, given the right timing of observation and transit and the right planetary parameters.
Latitude Quenching Nonlinearity in the Solar Dynamo
Authors: Yeates Anthony R. , Bertello Luca , Pevtsov Alexander A. , Pevtsov Alexei A. 
Published: January 2025

Abstract
We compare two candidate nonlinearities for regulating the solar cycle within the Babcock–Leighton paradigm: tilt quenching (whereby the tilt of active regions is reduced in stronger cycles) and latitude quenching (whereby flux emerges at higher latitudes in stronger solar cycles). Digitized historical observations are used to build a database of individual magnetic plage regions from 1923 to 1985. The regions are selected by thresholding in Ca ii K synoptic maps, with polarities constrained using Mount Wilson Observatory sunspot measurements. The resulting data show weak evidence for tilt quenching, but much stronger evidence for latitude quenching. Further, we use proxy observations of the polar field from faculae to construct a best-fit surface flux transport model driven by our database of emerging regions. A better fit is obtained when the sunspot measurements are used, compared to a reference model where all polarities are filled using Hale's Law. The optimization suggests clearly that the “dynamo effectivity range” of the Sun during this period should be less than 10°; this is also consistent with latitude quenching being dominant over tilt quenching.
Innovative Package on Package Solution: M-Series Fan-Out (mPoP)
Authors: Kim Byung Cheol 
Published: January 2025

Maximizing the advantages of M-Series which are superior reliability and high electrical performance with cost-effective and productive, the stackable package on package (mPoP) structure has been developed for a competitive integration solution of large application processor (AP) with high density routing and memory device based on M-Series technology. Introduced mPoP demonstrates an exceptionally thin profile of less than 0.45mm with a minimum 0.15mm height of the Cu post structure enabling 3D interconnection. mPoP aims to provide Low-band (DRAM stacks on the top of the AP) to high-band (DRAM stacks on the bottom of the AP) structures with a double-sided 3D platform. Furthermore, The mPoP structure is to be realized in the 600mm Panel Level Package(PLP) platform using the same process integration on the Cu stud & Post, panelization, and build-up processes. 600mm PLP will achieve around 5.0 times of package quantity compared with 300mm round. mPoP with Adaptive Patterning technology enables multi-layer RDL with fine line and space together with wider tolerance of die placement variations and allows the industry’s best design rules for scaling. With these, the heterogeneous integrated designs with M-Series will be also explored. This paper will show how M-Series(TM) fan-out wafer level packaging technology enables a stackable package on package structure extending to 600mm PLP together with heterogeneous multi-chip solutions. We will also present major design considerations and process integration opportunities for future development.
Flexibility of System Technology Co-Optimization (STCO) Demands a Shift-Left Process and Methodology
Authors: Viklund Per 
Published: January 2025

The huge costs and lack of flexibility in traditional SoC design have led to the STCO concept (System Technology Co-Optimization) where an SoC type system is fractioned into smaller modules that can be asynchronously designed by dispersed teams and be combined together into a larger highly flexible system using chiplet based package design and/or 3D Packaging. With the larger flexibility offered, comes several additional challenges in the form of Power integrity, Signal Integrity, Thermal performance, Warp and Mechanical stress. Finding and having to fix such issues late in the design cycle becomes exorbitantly expensive. A ‘left shift’ approach is suggested where very early but due to a preliminary design state, approximate analysis, can be performed and its results drive design decisions as well as corrections to mitigate the risk of failing later verification. We will examine how such early analysis in complex High-Density Advanced Packaging enables designers to spot potential issues early to avoid building in constructs that later will cause failures and require major re-design. While verification type analysis of a completed design can offer very accurate results, it’s way too late in the process to provide value. The Shift Left approach means applying multi-physics analysis very early in the design process: already at the prototyping and design planning stage where very little is known about the design. We will show how a minimum of input still provides enough detail to drive a left shift process. This paper focuses on Power and Signal integrity prototyping in STCO High-Density Advanced Packaging (HDAP) but the approach applies equally to thermal, warp and mechanical stress.
Advanced Packaging Dielectric for 5G
Authors: Miskiewicz Pawel , Larbig Greg , Satake Noboru , Pradella Jens , Meyer Frank , Koch Matthias 
Published: January 2025

The packaging requirements for high frequency applications and heterogeneous integration have brought well established dielectric materials to their limits. While there is a demand for increased technical performance, mainly low dielectric constant and low dielectric loss, trade-offs in processing conditions and yield are hardly acceptable. In order to address the technical challenges, Merck KGaA has developed a novel type of dielectric material, looking beyond existing classic polymers like polyimide or polybenzoxazole. The framework of the development was established around the key requirements from the industry, both on the process and material itself. With 5G applications in mind, low dielectric constant and loss are required. From the process side, compatibility with existing photolithography, low film shrinkage during curing processes and in general reduction of the stress, seen e.g. as warpage, are considered critical. Our materials demonstrated dielectrics properties which fit very well into 5G devices, with Dk ~ 2.5 and Df <0.005 for the frequency up to 75Ghz. In combination with low water uptake, that ensures compatibility with designed for 5G technology. When approaching the processing aspects, we looked at broad picture of what can cause the issues, beyond purely numerical specification: Our materials are designed to be primarily curable with UV light at room temperature, with shrinkage during curing <5%, as that process ensures low build-up stress. Photosensitivity also enabled compatibility with photolithography, showing L/S feature below 5µm and still fully reworkable with standard, non-NMP, organic solvents. Warpage issue has been addressed not only by UV cure at room temperature but also by distinctive behavior of CTE across the temperature range, where CTE values are similar at temperatures below and above Tg. That special feature, in combination with Young Modulus <2GPa and elongation >20% enables significant stress reduction during processing and subsequent use of the packaged device. Our new materials offer a combination of advanced performance and processing advantages leading to increased throughput and yield. Thus, offering a competitive advantage for tomorrow’s packaging designs.
Emerging Process and Assembly Challenges in Electronics Manufacturing
Authors: Farris Glenn 
Published: January 2025

Semiconductor and Semi equipment industries expect to see a strong upturn in the next few years. 5G, AI, Edge Computing, Persistent Memory, Integrated Power Management, and the transition to sub 5nm silicon technology are all driving the need for innovative packaging solutions. These solutions integrate silicon produced with disparate process nodes and deliver maximum performance at optimal cost. Heterogeneous Integration, utilizing a multitude of interconnect methodologies (from Fan-out to Silicon Interposer, to Chiplet), addresses this challenge but requires unique solutions for efficient, cost effective die placement. This presentation will look at the challenges and potential approaches for efficient and cost effective solutions.
Power Packaging Trends in Emerging 48V Ecosystem
Authors: Sattu Ajay 
Published: January 2025

Recently, the semiconductor industry has seen significant technology and product development in application areas such as automotive, datacom, telecom and automation. System demands such as higher power density, higher switching efficiency and smaller form factors are becoming more important to reduce effective carbon footprint. Consequently, a new 48V system design has gained lot of attention. For example, the applicability of the 48V design/architecture was seen primarily in automotive mild hybrid cars and data center power delivery. In the world of automotive, degree of electrification, comfort features and advanced driver assistance systems (ADAS) in a car, result in need for higher total power budget. However, existing vehicle power tree is powered directly from a 12V lead acid battery to the mechanical auxiliary loads (typically <5-7 kW) such as water and oil pumps, climate compressor, active roll control, headlights and taillights. This, along with stricter emission norms from Corporate Average Fuel Economy (CAFE) standards and power hungry ADAS systems make it challenging to improve efficiency. Data centers offer services such as data storage, processing, networking and distribution. To manage these services, operators need power in the order of several 100’s of MW. As much as 40% of the operating costs of the data center comes from the energy needed to power and cool racks of servers. Amid the growing service demand, increasing efficiency and power density has become a priority for data center operators. On average, approximately 30-35% of power is wasted in the conversion from the AC grid to the microprocessors of an individual server. However, to realize system benefits, packaging technologies must not limit achievable electrical and thermal benefits. Historically, power device packaging has evolved from through hole packages such as TO247 and TO220 with long leads to surface mount components with shorter leads such as D2PAK, DPAK and SO8. Further, leaded packages have been replaced with lead-less surface mount options such as TOLL and PQFN, offering higher levels of integration. Package innovation has always been driven to improve parasitic resistances, inductances, thermal resistances and reliability. This presentation will explore some of the recent trends and new ideas in packaging technologies and their potential for addressing system performance requirements.