bluuebunny/crossref_metadata_2025_split huggingface dataset:
From paternalistic stereotypes to overtly negative storytelling: A critical narrative analysis of how British Conservative leaders talk about young people (2005-2022)
Authors: Bonnet Alma-Pierre 
Published: January 2025

Le Parti conservateur britannique n’a jamais vraiment été populaire auprès des jeunes. Au début du xxie siècle, il a pourtant tenté de remédier à cette situation. David Cameron, par exemple, a essayé de décontaminer la marque conservatrice en donnant à son parti une image plus inclusive et en phase avec des sujets à même de séduire les jeunes électeurs, comme l’environnement et les droits des homosexuels. Pourtant, en 2019, après presque une décennie au pouvoir, les Conservateurs ont obtenu un score très faible auprès des jeunes, tout en remportant une de leurs victoires les plus éclatantes. Ce manque apparent de représentativité pourrait expliquer la désillusion croissante des jeunes à l’égard de la politique. En conséquence, les partis politiques ont tendance à ignorer les besoins de ceux qui ne votent pas pour eux. Cet article postule que ce cercle vicieux n’est pas une fatalité et qu’il est en fait renforcé, en partie, par la représentation négative des jeunes dans le discours conservateur. Pour vérifier cette hypothèse, nous proposons d’adopter une approche critique afin d’analyser le storytelling utilisé par différents leaders conservateurs pour parler des jeunes lors des conférences annuelles du parti, de 2005 à 2022.
Vers de nouvelles formes générationnelles d’engagement au Parti travailliste britannique ?
Authors: Jara-Joly Nicolas , Rayer Denis 
Published: January 2025

Entre 2015 et 2020, le Parti travailliste de Jeremy Corbyn, un parti traditionnel dirigé par un soixantenaire peu charismatique, a profité d’une très forte popularité dans la jeunesse britannique. Ce phénomène, a priori contre-intuitif, a pu être lié au programme du parti, à ses méthodes de campagne ou à la personnalité de J. Corbyn. Peu de travaux se sont toutefois intéressés aux jeunes militants et à la façon dont ils influencent et renouvellent les modalités du militantisme au sein du Labour. Cet article explore cette question en se penchant sur le cas d’étude du festival The World Transformed, un espace de mobilisation, de participation et de sociabilité conçu par ces jeunes pour servir de liant entre le militantisme de mouvement social et le militantisme partisan. Il met ainsi en évidence les formes d’engagement hybride qui caractérisent les usages militants de ce festival.
Mémoires vivantes et archives d’un espoir déçu
Authors: Caille Frédéric , Mouthon Alexandre 
Published: January 2025

Dans le débat sur le changement climatique et les alternatives aux combustibles fossiles, les expérimentations des énergies renouvelables sont des « objets politiques ». Leurs résultats questionnent la place de la technique dans la politique étrangère et dans l’aide au développement, ainsi que les choix énergétiques induits par les pays des Nords. Pour comprendre les installations solaires de l’entreprise Sofretes, installées dans plusieurs pays des Suds dans les années 1970-1980, il a fallu ainsi « inventer » des archives du solaire. En relatant l’enquête, nous montrons en quoi, en s’appuyant sur une relation de confiance et d’échange avec les témoins encore en vie, elle renouvelle l’historiographie du solaire et ouvre de nouvelles perspectives pour l’histoire politique des énergies.
Magnetic Core Inductor Embedded in Laminates for 3D Integrations
Authors: Wu Yanze , Yeng I-Chen , Yu Hongbin 
Published: January 2025

The strong demand for the 3D packaging technology has accelerated the miniaturization of passive devices, and inductors are facing challenges because the inductance value will be sacrificed when the size is shrinking. The magnetic core is one of the solutions due to its enhancement of inductance density but it will also add complexity to the fabrication process. In this work, a novel method to fabricate the magnetic core inductors on flexible substrates is proposed and demonstrated. The inductor has a stacking structure of three layers: the Cu trace layer, and the two layers of magnetic core (under and above the Cu). The Cu trace is patterned by the wet etch process on the flexible PCB, and the upper layer magnetic core is directly sputtered on the Cu trace layer with the Ajinomoto buildup film covering the Cu surface as insulation. A polyimide layer on the carrier wafer is prepared as the substrate for the lower magnetic core layer and the pattern is also created by the liftoff process. Then, the two finished layers are aligned and bonded with a flip-chip bonder with high precision and efficiency. Before the whole fabrication process, the patterns of the Cu trace and magnetic core are designed and optimized by the finite element analysis software to extract the parameters for comparison. And finally, the finished devices are measured with the radiofrequency probe station. The result shows that the inductance density and the quality factor of the magnetic core inductor could be 3.61 nH/mm2 and 6.22, respectively, with the device size being only 0.95 mm2. Compare with the air core inductor with the same Cu trace pattern, the magnetic core inductor elevates the inductance by 10% and still keep the same low profile, of which the thickness of the whole device is within 100 micron. These parameters are measured and extracted at 100 MHz and this is the widely used frequency for the power delivery applications such as the in-chip integrated voltage regulators.
High Performance TIM for Lidded FCBGA Products
Authors: Kweon YoungDo 
Published: January 2025

The need for high thermal performance semiconductor packages, such as lidded Flip Chip ball grid arrays (FCBGAs), is increasing for the next high-end central processing unit (CPU) semiconductor devices. However, today’s major polymer thermal interface materials (TIMs) have limited thermal conductivity. Also, because the polymer TIMs are located between the heat spreader (metal lid) and device die backside in the lidded FCBGA structure, assembly quality is critical to achieve low thermal contact resistance for high thermal dissipation performance. Therefore, optimal TIM selection is essential for enhanced thermal performance at the package level. In this paper, advanced TIMs are discussed for next-generation FCBGAs, specifically, TIM1 for large body and die sizes including a 2.5D multi-chip module (MCM).
Challenges for Achieving Automotive Grade 1/0 Reliability in FCBGA and fcCSP Packages
Authors: Olmstead Knowlton 
Published: January 2025

Achieving the Automotive Electronics Council (AEC) Q-100 specification for Grade 1 and 0 reliability introduces unique challenges as thermal cycling (TC) and high temperature storage (HTS) requirements increase. New automotive packages require increased integration of device functionality for sensors, driver assistance systems, infotainment and in-vehicle networking which pushes demand for larger package sizes. This increase in package size and thermal cycling over a large temperature range (from -55 to 150°C) introduces high thermomechanical stress to the package. Additionally, high operating temperatures and the need for 15-year reliability with zero-defect quality are driving qualifications that extend beyond the AEC Q-100 specification conditions. These factors present material challenges such as intermetallic compound (IMC) growth, degradation of organic materials and increased likelihood of wear-out failures from thermomechanical stresses. This presentation provides an update on flip chip Chip Scale Packaging (fcCSP) and Flip Chip ball grid array (FCBGA) material and package development to achieve Grade 1/0 reliability. Simulation of key mechanical properties such as the modulus of elasticity and the coefficient of thermal expansion (CTE) and material aging experiments have highlighted the need to identify substrate materials, underfills and epoxy molding compounds (EMCs) that can withstand harsh TC and HTS conditions up to 175°C. To reduce thermomechanical stress in TC, low CTE substrate materials are needed. Results from prior experiments and current work have identified a robust bill of materials (BOM) for a 35 mm body size FCBGA and 12 mm body fcCSP package capable of achieving Grade 1 reliability. The remaining challenges and potential solutions are discussed for selecting materials capable of reaching Grade 0 and extended qualifications.
Advancements of Temporary Bond and Debond: Creating Photonic Debonding Methods and Materials for Wafer-Level Packaging
Authors: Prenger Luke 
Published: January 2025

Wafer-level packaging (WLP) has become an ever-advancing technology to assist in the advancement of integrated circuit (IC) performance by creating a faster package with shorter interconnects between multiple ICs. Advancing the technologies for WLP have become more important as the years have gone by in order to compensate for the slowing down of Moore’s Law, so that performance increase and cost reduction can be maintained at a study pace. Due to the need of newer technologies, more investments are being made by outsourced semiconductor assembly and test (OSAT) facilities, packaging houses, foundries, and integrated device manufacturers (IDMs) in advanced packaging. One important field in advanced packaging that is benefiting from the investments being made is temporary bond and debond (TB/DB) technologies, where adoption and use of these technologies are steadily increasing due to the rise of more complex problems. TB/DB has been commonly utilized to enable technologies such as fan-out wafer-level packing (FOWLP), where highly warped epoxy mold compound (EMC) wafers are used, to help reduce the overall warpage of the wafer as well as enable backside processing of the EMC wafers. Traditionally, TB/DB has utilized three main debond methods: thermal slide debond, mechanical debond, and laser debond. Each of the three debond methods have their own advantages and disadvantages compared to each other, offer different types of combinations of material systems, and offer different levels of wafer throughput. In this paper, a novel flashlamp-based photonic debonding method, and corresponding materials, will be discussed. The photonic debond method combines advantages of the other debonding systems, while reducing the disadvantages. This new debond technology drastically increases throughput by offering debond times within the seconds range for the whole wafer, will provide a lower cost of ownership, and offer a wide variety of material solutions consisting of thermoplastic, thermoset, and multifunctional materials.
Adaptive Patterning Techniques for the Chiplet Era
Authors: Bishop Craig 
Published: January 2025

As the industry has evolved to deliver heterogenous integration, chiplets, and high-density interconnect, so has Deca’s Adaptive Patterning (TM) (AP) technology. Wafer and panel fan-out, fan-out on substrate, and other embedded die interconnect technologies all have inherent natural variations in the manufacturing process, with die-shift typically having the highest impact. Rather than fight variation by using high accuracy, lower throughput equipment, AP takes a different approach and accommodates variation through real-time design-during-manufacturing. First a high-speed optical scanner measures the actual position of each die, next the AP software system generates a unique per-unit lithography pattern adapted to its individual measurement, and finally the specific per-unit patterns are implemented with a single-pass, mask-less lithography system. Techniques such as Adaptive Alignment for single-die, and Adaptive Routing for multi-die integration are used to enable the highest density design rules. This publication will present two newly developed AP techniques that allow further scaling to high density interconnect. The first, Progressive Adaptive Alignment, extends previous techniques to allow distribution of the die-shift across all layers in the stack-up. Example design studies will be shown to illustrate the advantages for fan-out on substrate and package-on-package (PoP). The second technique, Adaptive Shapes, dynamically redesigns power planes, signal planes, and fill metal to account for measured die-shift. Adaptive power planes and signal planes provide robust signal integrity for multi-die integration, while dynamic metal fill optimizes the topography in multi-RDL products, delivering real-time design-for-manufacturing (DFM). An example design study with multiple HBM memory interfaces will explore possible applications and benefits for designs with 2µm, and finer, lines. These Adaptive Patterning techniques offer a compelling solution for chiplet integration. Removing traditional fixed photomasks from the equation breaks through conventional barriers to fine-pitch, high density, and high-yield for embedded die structures.
Advanced Packaging Leading Electronics Industry Transition into Next Decade
Authors: Trivedi Vaibhav 
Published: January 2025

PRESENTATION OUTLINE • Emerging Markets & Trends • Major shifts in Advanced packaging over last 5 years: Historical Perspective • Leading Advanced Packaging form factors • Supply Chain landscape / Advanced Packaging supplier Eco-system • Emerging trends in Advanced packaging & Market Drivers for next 5 years • Fan-out packaging as an enabler in electronics industry transition and its role in shaping semiconductor supply chain
Coating Adhesion Testing
Authors: Monaghan Tom 
Published: January 2025

Knowles Corp. has been producing SiSonic Surface Mount MEMS microphones since 2002 and is in its fourth generation of development. Over 10 billion of these units have been shipped to date. These microphone assemblies contain a MEMS device and an ASIC mounted to a PCB. They all use a metal can to protect the electronics, act as an RF shield and establish either the front volume (with a port hole in the can) or the back volume (with a port hole in the PCB under the MEMS device) for the microphone. These cans are generally bathtub shaped. During the first level assembly process, the cans are soldered down to the PCB and laser marked. The assembled units are then diced, tested and placed into tape and reel in preparation for the second level assembly. Recently, several customers have requested improved RF performance, due to the application environment of the microphones. One customer has required a coating on the inside of the can to achieve this decrease in the radiated RF of the microphone. This coating may be applied using several different methods: direct injection molding, offline molding and gluing into the can or spray coating. The coating can be one of several different materials. Part of the requirement for this new can with coating configuration is to quantify the level of adhesion between the coating and the can. There are a few standard methods currently used to determine the level of adhesion between a film or coating and a substrate: peel testing, shear testing and tensile pull testing. All of these methodologies work well for planar geometries, but are not well suited for variable geometries like a can. Drop testing is also used to check adhesion, but it does not quantify the level of adhesion between two materials. A new test must be developed to support the coating technology needed for this process improvement. This paper will describe the materials, tooling, the process of sample preparation and the test procedures that were developed to support the adhesion test. Several different materials and several different application methods for this material were tested. This test procedure is currently in production. The advantages to this procedure are that the test jigs can be reused and the materials are readily available. The test jigs can be modified for application to different geometries, different coating materials and different coating methods.
Beurling type invariant subspaces on Hardy and Bergman spaces of the unit ball or polydisk
Authors: Gu Caixing , Luo Shuaibing , Ma Pan 
Published: January 2025

AbstractMcCullough and Trent generalize Beurling–Lax–Halmos invariant subspace theorem for the shift on Hardy space of the unit disk to the multi-shift on Drury–Arveson space of the unit ball by representing an invariant subspace of the multi-shift as the range of a multiplication operator that is a partial isometry. By using their method, we obtain similar representations for a class of invariant subspaces of the multi-shifts on Hardy and Bergman spaces of the unit ball or polydisk. Our results are surprisingly general and include several important classes of invariant subspaces on the unit ball or polydisk.
Product of two involutions in quaternionic special linear group
Authors: Gongopadhyay Krishnendu , Lohan Tejbir , Maity Chandan 
Published: January 2025

Abstract
An element of a group is called reversible if it is conjugate to its own inverse. Reversible elements are closely related to strongly reversible elements, which can be expressed as a product of two involutions. In this paper, we classify the reversible and strongly reversible elements in the quaternionic special linear group

$ \mathrm {SL}(n,\mathbb {H})$

and quaternionic projective linear group

$ \mathrm {PSL}(n,\mathbb {H})$

. We prove that an element of

$ \mathrm {SL}(n,\mathbb {H})$

(resp.

$ \mathrm {PSL}(n,\mathbb {H})$

) is reversible if and only if it is a product of two skew-involutions (resp. involutions).
Study of Morphology and Growth of Alocasia spp. from Papua, Indonesia
Authors: Daawia Daawia , Kartika Juang Gema , Krisantini Krisantini , Rahayu Megayani Sri , Asih Ni Putu Sri , Matra Deden D. , Suhartawan Bambang 
Published: January 2025

Alocasia is a genus of perennial, flowering plants from Araceae, native to tropical and subtropical Asia and eastern Australia. The corms of some Alocasia species are edible, but many Alocasia species are cultivated as ornamentals. Despite the rich biodiversity of Alocasia, there have been limited studies on the morphology and anatomy of these genera. Our study aimed to describe the morphology and growth patterns of two Alocasia species found in Papua, one of the remote regions in Indonesia, A. brancifolia and A. lauterbachiana. The existence of A. lauterbachiana in Papua has never been reported before. The two Alocasia species can be distinguished by their distinct leaf shapes and colors. Alocasia brancifolia has pinnatifid leaves, while A. lauterbachiana has serrated leaves. The leaf of A. brancifolia is thin and predominantly green with faint spots, while the petioles exhibit stripes of brown and green, whereas A. lauterbachiana leaves are thicker and have darker green and reddish color. Due to their attractive leaf shape and colors, both species have the potential to be developed as ornamental potted plants. In terms of growth, A. lauterbachiana exhibited faster growth than A. brancifolia. However, A. brancifolia demonstrated a 50% increase in multiplication over the 16-week study period, while A. lauterbachiana primarily grew taller and larger. This information could prove valuable for future studies to optimize the growth and cultivation techniques of the two Alocasia species for commercial purposes, particularly ornamental foliage plants.
Legal Reconstruction of Error in Persona Cases: Justice Enforcement Challenges Based on Due Process of Law Principle
Authors: Haniyah Haniyah 
Published: January 2025

The case of misidentification of the perpetrators of the murder that occurred in Cirebon in 2016 involving Pegi Setiawan as a suspect reveals challenges in the investigation process and the enforcement of justice in Indonesia. This research aims to reconstruct the law regarding the phenomenon of error in persona and analyze the process of examining criminal cases related to wrongful arrest. The research method used is a normative approach with a statue approach, a conceptual approach, and a case approach. This research involves the investigation process and case study of the murder of Vina Cirebon. The study results show that, in this case, law enforcement officials were unprofessional in identifying the perpetrator, which led to the wrong determination of the suspect. In addition, investigation procedures not by the law's provisions lead to human rights violations. These findings also show that law enforcement officials must pay more attention to the correct procedures to avoid harming innocent individuals. In conclusion, improvements in investigative mechanisms, forensic technology, and increased education and training for law enforcement are needed to prevent misidentification and fair law enforcement.
History and current status of plant genetic resources conserved and maintained by the Hungarian central genebank
Authors: Ay Zoltan , Simon Attila , Gyurkó Adrienn , Fekete Evelin , Horváth Balázs , Baktay Borbála 
Published: January 2025

The predecessor of the National Centre for Biodiversity and Gene Conservation (NBGK) was established in Hungary in 1959. The 1950s were hectic times for Hungarian plant breeders, and many new genetic materials were registered in the National List of Varieties. In order to save obsolete genetic resources, in 1959 the government founded the Agrobotanical Institute at Tápiószele to prevent plant genetic erosion in the Pannonian region. The centre started its operation with 16,596 accessions. Their quantity continuously increased thanks to collecting missions and international connections. The NBGK collection is composed of cereals (37.3%), vegetables (18.7%), legumes (17.4%), industrial crops (5.29%), fruits and grapes (3.85%) and others. NBGK has operated under its current name since 2019 with the same mission as when it was first established. Today, it is the seventh largest genebank in Europe with 57,381 accessions of 1,745 plant species across 605 genera. Almost 95% of samples are maintained in the form of seeds in 15 cooled storage rooms (at temperatures of 5–8°C or -18°C), while the others are conserved in vitro, in the form of tubers or field collections. Sharing genetic materials has been a crucial part of the institute’s activities since the beginning. Between 2019 and 2023, a total of 92,100 samples were distributed to a variety of partners, mainly gardeners and farmers (83.85%) and NGOs (14.63%). Researchers, breeders and universities account for only 1.52% of seed requests, which is the opposite of what is observed in other genebanks.
Maintaining Yogyakarta’s Market Traditions to Develop Islamic Trade in Indonesia
Authors: Utomo Yuana Tri , Karim Muhammad Abdul 
Published: January 2025

The purpose of this study is twofold, namely: uncovering traditions in Yogyakarta's traditional markets in the face of free competition and developing them into Islamic trade clean from the influence of capitalism. Researchers used the main information from observations and interviews with traditional market participants, namely: one person from the Yogyakarta palace, one market authority, one trader, one buyer, and one person from the market association. Supporting information is taken from the researcher's readings on literature documents related to the research topic, such as articles that have been published in journals and library books. After the information is collected, it is then analyzed interactively throughout the research period by triangulating continuously until it is saturated. The results of this study show that traditional market traditions in Yogyakarta, such as market kekancingan, supervision by market lurah, kirab, and market grebeg, have been maintained from the onslaught of the free market so that it continues to exist until now because of the spirit of market players driven by Islamic motivation, namely worshipping Allah SWT. These traditions can be developed to be stronger to revive Islamic trade in an Islamic economic system that can match capitalism. This method of developing the tradition by adding a complete understanding of the concept of the market in the Islamic economic system. The findings of this study are expected to contribute to adding to the discourse of the market concept in Islamic economic studies and can practically be applied by the authorities for the protection of traditional markets from modern market attacks.