bluuebunny/crossref_metadata_2025_split huggingface dataset:
Lunéville au miroir de Versailles : reflets d’un regard distancié (1698-1737)
Authors: Franz Thierry 
Published: May 2023

Dès le xviiie siècle, le château de Lunéville est considéré comme le « Versailles » de la Lorraine, duché alors indépendant de son voisin le royaume de France, auquel il sera officiellement rattaché en 1766, à la mort du dernier duc, Stanislas Leszczyński (1677-1766), ancien roi de Pologne et beau-père de Louis XV. Pourtant, l’étude des chantiers des résidences reconstruites par ses prédécesseurs conduit à nuancer l’idée d’une copie servile du modèle français. Le duc Léopold (1679-1729), formé à la cour impériale à Vienne, et son épouse la duchesse Élisabeth-Charlotte d’Orléans (1676-1744), nièce de Louis XIV qui a grandi à Versailles, ont uni ces références culturelles dans leurs aspirations pratiques, matérialisées dans leurs appartements des palais de Nancy et plus encore de Lunéville. L’architecture et le mobilier mettent en exergue un cérémonial du quotidien élaboré par le duc et la duchesse, comme une symbiose entre les références française et impériale. La préservation de leur vie intime, selon un exemple venu de Vienne, était contrebalancée par une exposition très significative de la personne de la duchesse, en particulier lors de la cérémonie de sa toilette publique, trait distinctif de la culture de cour originale développée en Lorraine au début du xviiie siècle.
Versailles in England: Culture, Commerce and Diplomacy, from Charles II to Louis XVI
Authors: Mansel Philip 
Published: May 2023

The English fascination for Versailles and the French court was reflected not only in numerous visits to the palace in France, but also in gardens, architecture, decoration and manners in England. Diplomats, such as Ralph Montagu, later Master of the Great Wardrobe in England, craftsmen such as Daniel Marot, a Huguenot refugee who had worked for Louis XIV, and travellers brought their direct experience of Versailles to England. Particularly in its use of frescoes with monarchical themes and in the prominence and furnishings of the King’s Bedchamber, Versailles was one of the models (although not the only one) for Hampton Court Palace, Boughton and Chatsworth, among other houses. Recent work by Anna Keay, Simon Thurley and others confirms that some rituals and fashions followed at Versailles also influenced the English court: especially under Charles II, the first English king to have a lever and a coucher; William III, who planned his own Trianon beside Hampton Court; and the future George IV, who filled Carlton House with furniture like that at Versailles. The influence of Versailles in England shows the power of court culture to outweigh wars and national rivalries.
Le mythe de Versailles (xviie-xixe siècle)
Authors: Sabatier Gérard 
Published: May 2023

Versailles fut pendant les xviiie et xixe siècles le phare de l’Europe des cours. Non un paradigme, mais un mythe, élaboré par des strates successives de visiteurs étrangers, originaires principalement des mondes britanniques et germaniques. Se constitua ainsi un imaginaire fait de déférence envers un style de pouvoir, un mode de sociabilité, une esthétique du cadre de vie, puis peu à peu d’une recherche du temps perdu, nostalgie, ou simple curiosité. Le mythe ne fut pas uniquement construction mentale, il eut des effets concrets. L’instrumentalisation se retrouve dans le costume de cour espagnol comme dans la distribution des appartements palatiaux en Lorraine. Il peut enfin « se retourner », et passer d’une acception à son contraire, du positif au négatif si, comme dans l’exemple italien, on en suit le devenir sur le long terme. Abordé de l’extérieur, le mythe de Versailles fait la preuve de sa grande plasticité.
L’habit à la française en Espagne : le modèle vestimentaire versaillais à la cour de Philippe V
Authors: Giorgi Arianna 
Published: May 2023

Pour les Espagnols, le début du xviiie siècle marque l’avènement d’une nouvelle dynastie sur le trône d’Espagne, celle des Bourbons. L’arrivée du duc d’Anjou entraîne un changement dans le cérémonial et l’étiquette de la Maison royale, ainsi que le transfert culturel de l’habit à la française. Interprétée comme une initiation, une assimilation ou même une adoption, la question vestimentaire intéresse depuis des années l’historiographie, qui voit dans le sacre du premier Bourbon un jalon dans la modernisation du fonctionnement et des apparences de la cour espagnole. Cette étude analyse l’arrivée et l’influence de ce modèle vestimentaire à la cour de Philippe V. Le costume versaillais fait polémique et divise la noblesse. En nous appuyant sur les archives royales et nationales espagnoles, nous verrons comment, après l’intronisation du premier Bourbon, cette tenue est devenue un élément déterminant pour accéder au monarque et à ses faveurs. Elle incarnait, à l’instar des usages en vigueur à Versailles, une forme de distinction réservée à une certaine élite au sein du palais.
Un juge activiste ? Les choix du Conseil constitutionnel dans les décisions n° 2023-4 RIP et n° 2023-849 DC du 14 avril 2023
Authors: Bottini Eleonora , Bouaziz Margaux , Hennette-Vauchez Stéphanie 
Published: May 2023

Une lecture croisée des deux décisions RIP et DC rendues par le Conseil constitutionnel le 14 avril 2023 dans le cadre de la réforme des retraites fait ressortir son activisme plus que sa retenue. Si le label du « juge activiste » est souvent utilisé pour qualifier l’audace interprétative et le fait de ne pas reculer face à des grandes questions sociales et politiques, il peut aussi décrire un autre aspect du travail du juge, notamment constitutionnel : la distribution des pouvoirs. En exerçant le contrôle de constitutionnalité de la loi, le Conseil constitutionnel contribue en effet à délimiter (et donc, répartir) les pouvoirs des institutions qui prennent part au travail législatif. C’est en ce sens que nous proposons ici de considérer que les deux décisions DC et RIP rendues par le Conseil constitutionnel le 14 avril 2023 dans le cadre de la réforme des retraites dénotent une forme d’“activisme”. Loin de s’en tenir à une intervention neutre ne faisant que confirmer ou répliquer un déséquilibre institutionnel inhérent à la Constitution de 1958, nous soutenons qu’il l’a en réalité aggravé. Lues ensemble, les deux décisions illustrent en effet un double mouvement : d’un côté, l’exécutif est soumis à très peu de contraintes et a les coudées franches pour mener des réformes, quelle que soit leur importance, y compris par des voies parlementaires peu orthodoxes ; de l’autre, l’opposition parlementaire est soumise à des contraintes très fortes pour mener à bien tout projet de RIP.
Thick-film – a mature technology at the cutting edge of advances in the electronics industry
Authors: Berube Gregory M. 
Published: May 2023

For decades, thick-film technology has proven to be a dependable, cost-efficient method for highly reliable electronic circuitry and components. Hybrid microelectronics was the first major application for fired thick-film materials, finding its way into military and aerospace applications, where reliability is paramount. Inner and outer electrodes for passive components have been another traditional thick-film market. One of the main advantages of thick film is that it is an additive process, where the various conductor, resistor, and dielectric pastes are screen-printed and fired or cured in succession to form the circuit. This results in cost-efficient processing for the circuit manufacturer. Patterned screens are relatively easy to manufacture, allowing for flexibility in circuit design, and screen printing allows for flexibility in feature sizes from hundreds of microns down to 30 microns or less. The main drivers in electronics today are miniaturization – higher circuit density, adaptation to new forms such as 3D and flexible substrates, and ecological factors such as reduced energy consumption, waste reduction, and reduction in the use of toxic substances (RoHS – REACH). Thick film has evolved to address these main drivers and due to its reliability, flexibility, and adaptability, The technology has found new applications. 5G telecommunications utilizes highly conductive silver coatings on signal filters for low losses. Automobiles have historically used thick film technology in fuel/air sensors, air bag deployment sensors, and electronic control units (ECUs). Current vehicles have become computers on wheels and have multiple driver assistance sensors (ADAS), e.g. lane departure warning, blind spot monitoring, automatic braking, regenerative braking, and fully autonomous driving. Both fired and non-fired thick-film technology is enabling these developments. Also in the automotive space, applications include thick film heaters for cabin comfort, heaters keeping ADAS sensors free from frost and snow, and heaters for battery management systems (BMS) in electric vehicles. Polymer thick-film (PTF) pastes for cured (90 – 250o 1. C) electronic circuitry on temperature sensitive polymers have also been around for decades, used in membrane touch-switch keypads and similar circuity. Recently, new applications have emerged for PTF in printed electronics, where the ability to develop flexible, highly durable pastes is enabling new applications in flexible displays, medical monitoring, and performance enhancement in sports. As the megatrends continue to drive the advancement in technologies, the versatility, reliability, and adaptability of thick-film technology is expected to continue to facilitate these advancements. Heraeus Electronics, with its extensive portfolio of thick-film pastes and matched systems, is primed to support these advancements.
Design of Wafer Level Solder Seals – A Surface Energy Perspective
Authors: Marinis Thomas F. , Soucy Joseph W. 
Published: May 2023

Wafer level vacuum packaging of quartz resonators and microelectromechanical system (MEMS) inertial sensors and RF switches have been successfully demonstrated by a number of investigators. The majority of these devices were sealed using reflow of gold-tin solder because of its superior hermeticity and benign processing conditions as compared to seals made using glass frit or anodic bonding. These successes have motivated efforts to integrate multiple sensors and active silicon devices within the same package to achieve improved performance and further reduce system size and cost. Sealing these large, heterogeneous assemblies at wafer level presents a more challenging problem than sealing small individual sensors, primarily due to wafer bow and irregularities in the seal surfaces. Wafer bow has been addressed in sealing wafers of individual sensors by plating metal stops adjacent to the seal rings, which allow the wafers to be pressed together to flatten the seal areas during bonding. This strategy cannot always be applied to sealing system devices because the amount of wafer bow is greater than that associated with more uniform wafers of sensors and the larger area of system devices increase the residual stress on the solder seal. An alternative approach to pressing wafers flat throughout the bond process would be to relax the force during reflow and allow the solder to bridge the nonplanar interface. We have used analytical and numerical calculations to investigate the interplay between seal width, height and shape of the seal gap, and solder volume associated with this bonding strategy. A set of soldering experiments were conducted on test articles that allowed us to independently vary these parameters to evaluate our model predictions.
Double Sided Integrated GaN Power Module with Double Pulse Test (DPT) Verification
Authors: Sinha Sourish S. , Cheng Tzu-Hsuan , Hopkins Dr. Douglas C. 
Published: May 2023

Wide Bandgap devices (WBG) have led to an era of high speed and high voltage operations that were not previously achievable with silicon devices. However, packaging of these devices in the power module has been a challenge due to higher switching rates which can cause several amperes of displacement current to flow through the parasitic capacitance of the package thus impacting the gate driver operation and the switching ability of the device. The severity of this current increases in thin packaging substrates unlike the traditional inorganic substrates e.g. DBC and thus a thorough investigation is needed before it can be used with WBG semiconductors. The objective of this paper is to discuss ways to reduce as well as manipulate the parasitic capacitance at different locations in the power modules to reduce the magnitude of the peak and RMS value of the displacement current and have a better gate drive signal and power waveform. To study this, a Double Pulse Test (DPT) simulation study has been conducted to show how an intelligent distribution of parasitic capacitance benefits the device functioning. This has been validated through experimental fabrication and DPT of dense power module following proposed guidelines. A detailed description of the design of a high-speed capable DPT circuit and measurement setup has been specified to show the steps needed for reliable testing and measurement.
Design to cost Ag free silicon nitride AMB substrate for automotive power module applications
Authors: Mustain Habib , Schwöbel André , Fabian Benjamin , Schnee Daniel , Anton Miric 
Published: May 2023

Silver free AMB technology addresses the cost-performance gap between the active metal brazed (AMB) Si3N4 based metal ceramic substrates (MCS) suitable for automotive applications and the cost-efficient direct copper bonded (DCB) Al2O3 substrates suitable for applications with lower requirements. The cost-reduction of the condura®.ultra process is achieved by using a silver free brazing technology combined with an efficient brazing process. Within this report we will demonstrate the thermal cycling capability, the peel strength of the condura®.ultra process combined with a design to cost Si3N4 ceramic substrate. Additionally showing results regarding isolation partial discharge of performance and robustness in thermal resistance measurements.
A Comprehensive Evaluation of Al Heavy Wire Bonding and Ribbon Bonding Application in high power WBG Power Modules
Authors: Li Yang , Hassan Mustafeez , Wu Yuxuan , Emon Asif Imran , Deng Shiyue , Luo Fang , Deshpande Amol , McKeown Michael 
Published: May 2023

Targeting at a comprehensive Multiphysics evaluation for Al wire and ribbon bonding technologies for WBG power module, this paper investigates and compares the stray inductance, heat dissipation and fatigue life between these two bonding schemes in an XHP packaging designed in house. During calculation, it was tried to keep equivalent volume for the Al ribbon when substituting local Al wires for fair comparison. Results of stray inductance show extremely limit bonding-type dependence in ranges from 1 kHz to 10 MHz, and further expanding ribbon size to varied levels still presents negligible impact. The two bonding technologies do not prove their capability in sharing either static or transient thermal loads when the baseplate bottom is efficiently liquid cooled. Detailed study confirms that heat dissipates dominantly in vertical direction to the Cu baseplate rather than through Al bonds. Ultimately, the only noticeable benefit of Al ribbon in our multiscale analysis is its improved reliability during temperature cycling, with data supporting a 2.17× times longer lifetime of Al ribbon when comparing to its Al wire counterpart.
A novel hybrid method to integrate delicate MEMS components into a FOWLP
Authors: Braun Tanja , Dreissigacker Marc , Wöhrmann Markus , Becker Karl-Friedrich , Schneider-Ramelow Martin 
Published: May 2023

A steep increase in IoT- and smart devices fuels the need for ever more miniaturized and highly integrated microelectronic packages. Fan-Out technology is well suited for this task, as it allows for heterogeneous (co-)integration of sensor elements and corresponding circuitry. Following a Chip-First approach in Fan-Out Wafer-Level Packaging (FOWLP), protection of delicate sensor areas during compression molding and formation of redistribution layers (RDL) becomes a key part of the manufacturing process chain. Such areas include thin membranes, antireflective coatings, air bridges or media access for gas sensors. We demonstrate a novel packaging method for a MEMS pressure sensor with corresponding ASIC (application-specific integrated circuit). We integrate vertical interconnect elements (VIE), instead of employing laser drilling for via formation and thereby avoid debris and reduce the overall package thickness. The hybrid approach, at heart, relies on a structured adhesive layer, onto which components are placed prior to compression molding. Due to its thermal and mechanical stability, the patterned thin film adhesive serves as a (first) dielectric layer. Process development includes warpage management to allow for laser debonding from temporary glass carriers and RDL processing compatible with delicate MEMS surfaces. Summarizing, we present a novel process variant to avoid common issues related to sensor surface integrity using Fan Out technology and thus allow for highly miniaturized System in Package (SiP) concepts with sensor integration by mold embedding.
Advancing Reliable High-Temperature Electronics through Compatible Material Interfaces
Authors: Kupernik J. , Bakowski M. , Chiolino N. , Barlow M. , Dyer B. , Francis A. M. 
Published: May 2023

The need for digital control and observability is continuing to expand into inhospitable environments - engines, energy exploration systems and space exploration. The limited available selection of components to fabricate modules for these high temperature environments, both active and passive, force manufacturers into packaging compromises that limit the performance and reliability of these modules. The lack of selection, as well as ordering requirements, dramatically slows prototyping cycles and the creation of solutions. Production of thermally hardened active and passive components that are designed and fabricated with packaging in mind can extend the operating temperature range of heterogeneously integrated systems. Ozark IC has demonstrated a wire bonding process that shows reliable powered function of a heterogeneously integrated system at 200°C for over 7500 hours. Ozark IC has also tested modules packaged with homogeneous gold metallization that endure powered function at 800°C for 1 to 50 hours, and powered function at 500°C for more than 100 hours. Increasing the availability of newly manufactured semiconductor die and passive components with compatible metallization would enable these high temperature packaging methods to rapidly advance the state of the art for thermally hardened electronics systems. The views, opinions and/or findings expressed are those of the author and should not be interpreted as representing the official views or policies of the Department of Defense or the U.S. Government.
Silicone Migration Risks and Mitigation in Thermal Materials
Authors: Misra Sanjay 
Published: May 2023

Thermal interface materials (TIMs) are ubiquitous in electronics cooling in a wide variety of applications in Industrial, Automotive and Consumer electronics. TIMs comprise of a compliant polymeric matrix with thermally conductive fillers. Silicones are the polymer of first choice due to the special characteristics of thermal stability and ability to fine tune the modulus across a wide range. Silicone migration can be a concern, whether real or through perception. Here we describe various types of silicone migration quantitatively in terms of polymer basics. We will describe analytical methods characterizing migration and provide typical quantitative ranges. We also address what the real risks are for specific applications, quantitative as well as qualitative. Finally, we will describe mitigation measures, if needed, through silicone modification or replacement with other polymers.
Optimization of Additively Manufactured Interposers for DC and RF Applications in Printed Circuit Boards
Authors: Lamport Emily , Luce Andrew , Piro Yuri , Trulli Susan , Akyurtlu Alkim 
Published: May 2023

Additive manufacturing (AM) for printed electronics (PE), though still in its infancy, has seen major growth in the past few years. AM techniques have several benefits over traditional manufacturing, namely the reduction of waste material and the increased efficiency in producing prototypes. However, there are disadvantages associated with AM, the most prevalent being a low throughput of parts. Limited research has been done to increase the throughput to the scale of traditional manufacturing methods. To combine the benefits of both AM and traditional manufacturing techniques, this paper discusses a hybrid printed circuit board (PCB) assembly that employs an additively manufactured interposer to serve as a DC interconnect between the AM structure and the PCB manufactured with traditional methods.
The Science of Adhesion Insights to Understanding Adhesive Performance
Authors: Katze Douglas , Zhao Yuan , Roberts Rose 
Published: May 2023

The continued integration of smaller, higher-functioning devices in the Aerospace, Defense & Space sectors is making it more challenging than ever to minimize assembly failure, especially where reliability is top priority and fail-safe processes, and materials are the standard. Assembly failures due to poor adhesive bonding tend to linger causing excessive manufacturing downtime, scrap, costly rework, and delays. This paper introduces the science behind adhesion. Regardless of the application, the market or the adhesive technology being used, such as epoxy, silicone, urethane, paste or film, achieving a proper assembly bond is critical for application success. Adhesion is achieved via two mechanisms, mechanical and chemical bonding. To optimize this the adhesive must flow (or wet) across the substrate. This maximizes the interaction between the adhesive and substrate allowing flow into microscopic substrate pores for enhanced mechanical bonding as well as interaction between adhesive and substrate for chemical bonding. The molecular force of attraction between an adhesive and the substrate is determined by the surface energy of the substrates. The substrate surface energy influences the ability of the adhesive to flow and wet the substrate impacting adhesion. Measuring substrate water contact angle is an easy method to determine the relative surface energy thereby gaining information about the pending adhesive bond. This paper reviews these key factors for adhesion and presents results of an application study aimed at understanding the sensitivity and relationship of substrate water contact angle versus substrate cleanliness. The goal is to be able to use substrate water contact angle measurements as a predictive tool for adhesion.
Wide process latitude, Pb-free low temperature co-fired ceramic (LTCC)
Authors: Laughlin Brian , Salah Ahmed , Anderson Russell , Yoon Young , Schickling Brad ,   Micromax™
Published: May 2023

Low temperature co-fired ceramics, LTCC, are an established material platform for making high-quality, high-performance, and high-reliability electronic devices; however, systems exhibiting a sufficiently wide processing window have traditionally employed Pb-containing glasses. Micromax™ GreenTape™ LF95C has been introduced as a Pb-free LTCC system with a host of attractive physical, thermal, and electronic properties including repeatable shrinkage, dielectric loss of <0.005 at 10 GHz, refire stability, and a full Ag-based metallization system. The ceramic densifies by glass viscous flow which provides the ability to co-fire over a wide process window. The high-conductivity Ag metallization, low Df, and repeatable shrinkage and Dk make LF95C an excellent material platform for producing high-reliability electronic devices while advancing sustainability goals and working to satisfy the spirit of the REACH and RoHS initiatives.