bluuebunny/crossref_metadata_2025_split huggingface dataset:
On Demand Bit-Level SRAM Validation using CW 785nm Laser-Induced Fault Analysis (LIFA)
Authors: Serrels Keith A. , Dickson Kris , Howard Clifford , Garcia Jose , Foote Eric , Clark Gary , Gonzalez Ben , Nwokolo Chinemerem 
Published: November 2023

Abstract
We present the first experimental demonstration of on demand bit-level Static Random Access Memory (SRAM) validation and isolation through the exploitation of a continuous wave (CW) 785nm Laser-Induced Fault Analysis (LIFA) system. Through careful test pattern edits and the observation of a simple pass/fail flag, the ability to spatially map the physical location of pre-selected bits in 40nm, 16nm, and 5nm SRAM arrays using correlation units is confirmed. This work demonstrates a novel and highly-efficient methodology for rapid bit-level logical-to-physical identification. It also improves localization efficacy over conventional bitmap validation best-known methods (BKM) which typically rely on post-fail Photo-Emission Microscopy (PEM) and/or Soft Defect Localization / Laser-Assisted Device Alteration (LADA) performed on an actual fail unit. This new technique re-defines the state-of-the-art in SRAM bitmap validation and localization and offers a pathway to significantly improve cycle time for both product bitmap qualification and subsequent root cause identification.
Effective Fault Localization Approach for High Speed Transceiver Failure: From Non-destructive to Destructive
Authors: Khei Kuan Lai , Ning Liew Chiun , Lay Goh Lay , Jun Wu Jia , Suthar Sailesh 
Published: November 2023

Abstract
It has been a challenge to perform failure analysis for miniaturization of process node technology in high-speed transceiver. Failure analysis plays an important role in root cause analysis to enable R&D, product quality & reliabily improvement. This paper demonstrated an effective FA approach on a real case with ADPLL functional failure within a high-Speed transceiver in complex sub-nano FPGA. This successful case is achieved by incorporating Analog Probe (APROBE), Infrared Emission Microscopy (IREM), extensive layout study, delayering, Nanoprobing and Scanning Electron Microscopy (SEM) for defect localization.
In-Situ Global Ultra Thinning of Live Chip Backside for Digital Forensic and Failure Analysis
Authors: Schot Kees , Fukami Aya 
Published: November 2023

Abstract
This paper presents an empirical investigation into the application of backside thinning techniques, while preserving the packaging integrity and mounting of the target system-on-a- chip (SoC) on a printed circuitboard (PCB) within a smartphone. Such thinning procedures are often indispensable in the domain of digital forensics, as they facilitate subsequent modifications to the SoC for in-depth analysis. Crucially, these modifications must be executed without compromising the core functionality of the target smartphone. By employing reactive ion etching, we effectively achieved comprehensive thinning of bulk side of a SoC with more than 100 mm2 surface area to a sub-10μm thickness.
Spatial Resolution Enhancement of Time-Resolved Photon Emission Imaging with Superconducting Nanowire Single Photon Detector
Authors: Chinone Norimichi , Terada Hirotoshi , Nakamura Tomonori , Yokoyama Yoshiyuki , Matsumoto Toru 
Published: November 2023

Abstract
High-speed time-resolved emission analysis is an attractive failure analysis technique because of its non-invasiveness. Super-conductive nanowire single photon detector (SNSPD or SSPD) is a key candidate of key device for time-resolved emission analysis. In this paper, we demonstrate time-resolved emission and its application of spatial resolution enhancement. We could confirm that time-resolved emission imaging can enhance spatial resolution by simple mathematical operations compared to static emission analysis, which is effective for finding emission spots before detailed time-resolved data investigations.
Large Area Imaging for Metrology with High Accuracy Using Scanning Electron Microscope
Authors: Kim Kyungbin , Kim Eugene , Choi Innyeong , Jun Kwon Woo , Kang Christopher H. 
Published: November 2023

Abstract
As semiconductor devices continue to decrease in size and pitch, demands for accurate microstructural analysis have increased to enable downward scaling. Critical dimension (CD) metrology is key to delivering process insights, but at such scales, rigorous metrology analysis providing high precision data may lack desired throughput. CD measurement using the scanning electron microscope (SEM) is a widely used technique, however, to acquire large area SEM images with high precision, multiple image stitching is currently required. In this paper, a new method for precise and efficient metrology analysis is introduced. This study demonstrates that large area imaging with ultra-high pixel resolution can deliver better throughput while maintaining the same level of precision that can be achieved by the traditional method.
The Influence of Temperature on Photoresist Profiles during TEM Sample Preparation using Cryo-FIB
Authors: Hye Hyun Ji , Cho Youngjin , Cho Hyoungsic , Kim Seojin , Chang Choi In , Kim Beomjun , Kim Yoonhae , Kang Christopher H. 
Published: November 2023

Abstract
Photoresist (PR) profiles tend to have deformation and shrinkage with typical transmission electron microscopy (TEM) sample preparation methods using a focused ion beam scanning electron microscope (FIB-SEM). As the temperature increases during the TEM sample preparation, it may lead to deformation and shrinkage in PR profiles. In this study, we analyze the impact when performing the sample preparation at a cold temperature using a cryo-FIB to minimize deformation and shrinkage issues. To test this methodology, the TEM sample preparation process was performed under different conditions. From these experiments, the TEM results with full cryo conditions showed that the PR line to space ratio was closest to the target, which is the sample’s real line to space ratio (1:1), and the bottom anti-reflective coating (BARC) shrinkage was minimized.
Magneto-Optic Kerr Imaging Technique for Localizing Magnetic Failures
Authors: Anthony Ricky , O’Sullivan Jer 
Published: November 2023

Abstract
The paper describes the Magneto-Optic Kerr (MOKE) Imaging technique for imaging magnetic response of soft magnetic materials at external magnetic field. This method can be applied for investigating domain wall formations and propagation, localizing magnetic failing sites, and analyzing hysteresis response of the films at varying magnetic field strengths. The paper describes some use cases of this technique for failure analysis in magnetic sensors, whereby in some cases delayering have been developed prior to imaging.
Automated Algorithm of Die Filter for PFA Sampling
Authors: Liao Yougui , Pontoh Marsela , Lenzi Tyler 
Published: November 2023

Abstract
The goal of this project is to develop an automated algorithm of die filter to minimize the number of dies for PFA engineers to review and to confirm before PFA submission. This can reduce the workload of PFA engineers so that the PFA engineers can focus their investigations on few wafers and dies and thus the PFA job submission can be more efficient and accurate. The number, type, and location of dies for PFA sampling can be automatically given by following the rules set by PFA engineers.
Reliable Backside IC Preparation Down to STI Level Using Chemical Mechanical Polishing (CMP) with Highly Selective Slurry
Authors: Herfurth Norbert , Adesunkanmi Awwal A. , Zwicker Gerfried , Boit Christian 
Published: November 2023

Abstract
When aiming for extreme thinning of the bulk silicon down to the shallow trench isolation (STI) level, endpoint determination is a challenging task. Here, we present a novel approach providing reliable access to the STI level of single dies. Therefore, we transfer the wafer-based CMP process to be applicable to single dies on a table-top machine. In a first step, the developed process is applied to the whole IC backside simultaneously. Using a highly selective slurry with a material removal ratio from Si to SiO of more than 500:1 ensures that the STI level remains intact. Two types of samples have been prepared for experiments performed for this paper. A 115mm x 80mm flip-chip bonded device with a bulk silicon thickness of 500μm has been prepared to STI level within less than 4 hours.
Antenna-in-Package Assurance with Radio Frequency Fingerprint
Authors: Noor Rouhan , Biswas Liton Kumar , Shafkat M. , Khan M. , Yoon Yong-Kyu , Asadizanjani Navid 
Published: November 2023

Abstract
Antenna-in-packaging (AiP) enables the next generation of high-performance wireless 5G mmWave communication and beyond by incorporating antenna arrays in small form factors using System in Package (SiP) technology. The trend toward heterogeneous integration and advanced packaging will likely introduce more complexity to the semiconductor supply chain. In addition, there is also the risk of becoming more susceptible to security vulnerabilities associated with advanced packaging. This paper provides an overview of the supply chain vulnerabilities in advanced packaging and heterogeneous integration, followed by the existing security, reliability issues, and assurance of AiP. Apart from discussing existing physical modalities of AiP assurance and vulnerabilities, we propose Radio Frequency Fingerprint (RFF) as a new physical modality for AiP assurance. We also discuss possible future research direction and application of RFF in AiP assurance.
Multilayer pFIB Trenches for Multiple Tip EBAC/EBIRCH Analysis and Internal Node Transistor Characterization
Authors: Pronin Nick , Larentis Stefano , Wu Carey , Foote Eric , Clark Gary , Ly Khiem , Levenson Jacob , Dickson Kristofor , Petri Charles , Gomez Nelson , Chrastecky Tony 
Published: November 2023

Abstract
In this work, we present three case studies that highlight the novelty and effectiveness of using multiple plasma FIB trenches to simultaneously access multiple metal layers for nanoprobing failure analysis. Multilayer access enabled otherwise impossible two-tip current imaging techniques and allowed us to fully characterize suspect logic gate transistors by exposing internal nodes, while preserving higher metal inputs and outputs. The presented case studies focus on late node planar and established FinFET technologies. The delayering techniques used are not necessarily technology dependent, but highly scaled and advanced processes generally require smaller trench areas for multilayer access. The minimum trench dimensions are limited by ion beam imaging resolution and trench-nanoprobe tip geometry.
In-Situ Junction Analysis in SiC (and GaN)
Authors: Johnson Gregory M. , Stegmann Heiko , Rodgers Thomas , Hitzel Frank , Rummel Andreas , Mello Domenico , Kuball Martin 
Published: November 2023

Abstract
A commercially available 4H-SiC power device and a GaN on SiC HEMT were examined with Ga-FIB sectioning and various junction analysis techniques. The impact of Ga-FIB on the electronic properties of such power devices is observed to be less significant than anticipated. A field of view was FIB-milled into the structure, exposing a row of devices. In this window, p/n junctions were evaluated by Passive Voltage Contrast (PVC), Electron Beam Induced Current (EBIC), and Kelvin Force Probe Microscopy (KFPM). Results showed excellent fidelity to expectations and each technique brought out new insights. In further work, the gate voltage was varied and the changing of depletion zones upon device turn-on was observed. This work: 1) Demonstrates complete sufficiency of Ga-FIB cross sections for regular cross-sectional work. 2) Demonstrates a novel method for investigating junction properties from Ga-FIB sections of power devices which largely leaves the rest of the device intact. 3) Provides some assurance that the Ga-FIB does not severely impact the evaluation of junction properties in some power semiconductors. 4) Points to alternative mechanism for device turn-on.
A Different Approach for Failure Fault Isolation in 4H-SiC Power Devices Using Thermal Analysis
Authors: Barbarino P. P. , Vitanza E. , Anastasi G. , Astuto M. , Calvagno G. , Giarrizzo F. , Mello D. 
Published: November 2023

Abstract
Power devices technology and in particular devices based on 4H-SiC require a thick metal layer in top to make a source contact and on the backside to make a drain contact. These metal layers are the main problem for fault isolation activities. Up today, many fault isolation techniques do not allow for results, and it is mandatory to remove this layer before performing them. During the metal removal on wafer there is a high probability of damaging the sample or breaking the wafer, especially if the latter is very thin. In this analysis we show a methodology that allows fault isolation analysis, performed on wafers with metal layers, preventing the risks of sample damage induced from preparation.
Assessing Electronics with Advanced 3D X-ray Microscopy Techniques and Electron Microscopy
Authors: Villarraga-Gómez Herminso , Crosby Kyle , Terada Masako , Rad Mansoureh Norouzi 
Published: November 2023

Abstract
This paper presents advanced workflows that combine 3D Xray microscopy (XRM), nanoscale tomography, and electron microscopy to generate a detailed visualization of the interior of electronic devices and assemblies to enable the study of internal components for failure analysis (FA). Newly developed techniques such as the integration of deep-learning (DL) based algorithms for 3D image reconstruction are also discussed in this article. In addition, a DL-based tool (called DeepScout) is introduced that uses high-resolution 3D XRM datasets as training data for lower-resolution, larger field-of-view datasets and scales larger-volume data using a neural network model. Ultimately, these workflows can be run independently or complementary to other multiscale correlative microscopy evaluations, e.g., electron microscopy, and will provide valuable insights into the inner workings of electronic packages and integrated circuits at multiple length scales, from macroscopic features on electronic devices (i.e., hundreds of mm) to microscopic details in electronic components (in the tens of nm). Understanding advanced electronic systems through X-ray imaging and electron microscopy, and possibly complemented with some additional correlative microscopy investigations, can speed development time, increase cost efficiency, and simplify FA and quality inspection of printed circuit boards (PCBs) and electronic devices assembled with new emerging technologies.
Visual Examination, Downselection, and Field Photography
Authors: Johnson Matthew S. , Johnson Jack 
Published: November 2023

Abstract
With regard to documentation and photography of a catastrophic event, the field investigator's duties are fundamentally different from those of the laboratory-based analyst, even though both share the same goals. This article presents a case study on documentation considerations during the field investigation. It provides a detailed discussion on the general procedure to downselect from a multicomponent assemblage to a set of potential primary failed components. The article describes visual examination in macrofractography.
IDIOMS AND SLOGANS IN POSTER LIKE PROPAGANDA
Authors: Dvalidze Nino 
Published: November 2023

21-st century is very busy, contradictive and tensed because of several cores of wars, accordingly abundant information flows out from the internet. Nobody has time to read several pages for a long time. Minimalism in words is appreciated more. As the 12 th century renaissance period Georgian poet Shota Rustaveli said in the prologue to his famous masterpiece "The Man in the Panther’s Skin”: “A long word is told shortly” (in few words is uttered a long discourse) as “Minstrelsy is, first of all, a branch of wisdom “…
So, the idioms, slogans, proverbs, parables, some other kinds of phrasal verbs and witty sayings are still the object of scientific studies as far as they have been in use side by side with ballads, poems, songs and preaches since time immemorial up today. You may meet them in modern publicist texts, in posters, in adverts, in web design as well. Therefore, interpreting the idioms adequately isn’t so easy. It’s well known that idioms are the set of fixed expressions, which is impossible to understand directly and, in most cases, one should consult with the dictionaries of idioms.
Thus, presented article’s topicality is conditioned by researching some idioms in posters for filling the information gap and developing intercultural dialogue. The methodology of investigation is qualitative, based on researching different posters, describing and analyzing.
Propaganda is an attempt to inﬂuence peoples’ opinions or behavior through the use of specific images and words. It usually gives limited information which is heavily biased in its presentation. Propaganda typically achieves its aims by generating an emotional reaction in the viewer. For much of the twentieth century, public posters were a common way for governments to use propaganda to persuade their citizens. They often relied upon simple images in order to manipulate people through fear or guilt. Propaganda uses stereotypes so that audiences can readily identify which people group is the target of the poster.
KEVALIDAN MODUL AJAR MATEMATIKA BERBASIS SENI VISUAL GEOMETRI UNTUK MENINGKAATKAN KEMAMPUAN PENALARAN MATEMATIS SISWA SEKOLAH DASAR DI KABUPATEN REJANG LEBONG
Authors: Mandasari Novianti , Kusnanto R. Angga Bagus 
Published: November 2023

This study aims to produce mathematics teaching modules based on visual arts geometry to improve the mathematical reasoning skills of Rejang lebong district elementary school students that are valid. The research method used is development research with a 4D development model, which consists of Difine, Design, Development and Desimate stages. The instrument used to answer the research objectives is in the form of a validity questionnaire, consisting of a linguist questionnaire, a material expert questionnaire, and a media expert questionnaire. The data in this study were analyzed using the Aiken V formula. Based on the results of the validity analysis of the three experts, an average value of 0.913 was obtained which was included in the interpretation category of Aiken's validity included in category V > 0.80 with very high information or can be said to be valid.
PENINGKATAN HASIL BELAJAR MATEMATIKA DENGAN MENGGUNAKAN MODEL PEMBELAJARAN DIRECT INSTRUCTION DI KELAS XI SMK MUHAMMADIYAH TEGAL
Authors: Suharyanto Awik 
Published: November 2023

This study aims to improve mathematics learning outcomes using the direct learning model of grade XI students of SMK Muhammadiyah Tegal for the 2022/2023 academic year. The research method used in this study is Classroom Action Research (PTK) This research was conducted in two cycles, the sample in this study was grade XI students of SMK Muhammadiyah Tegal. The results of the research obtained in this study were the average student learning outcomes in the pre-cycle was 58.24 then in the first cycle the average acquisition of student learning outcomes was 65.59 with classical learning completeness of 35.29%, in the second cycle the average acquisition of learning outcomes was 75 with classical learning completeness of 82.36%. Based on the results of this study, it can be concluded that the direct learning model can improve students' mathematics learning outcomes.
ANALISIS PENGGUNAAN KINCIR ANGIN SEBAGAI SUMBER ENERGI ALTERNATIF CADANGAN YANG TERBARUKAN
Authors: Novit Andariani , Sudarti Sudarti , Yushardi Yushardi 
Published: November 2023

Angin adalah salah satu dari banyak sumber energi alternatif yang bisa dimanfaatkan. Pemanfaatan sumber energi alternatif juga dinilai lebih ramah lingkungan dan tidak akan membuat kita takut akan ketersediannya. Keberadaan angin tidak mungkin habis, namun mungkin kualitasnya yang dapat menurun. Lain halnya dengan bahan bakar fosil yang mungkin saja bisa habis. Saat ini sudah banyak manusia yang sadar akan lingkungan. Sehingga mulai banyak inovasi beralih pada bahan bakar ramah lingkungan. Kincir angin berfungsi untuk mengubah energi angin menjadi energi listrik menggunakan bantuan Motor DC. Kincir angin terdapat dua jenis, yaitu kincir angin sumbu vertikal dan kincir angin sumbu horizontal. Alasan pemilihan Kincir angin disebabkan karena ramah lingkungan serta dapat memanfaatkan tenaga angin sebagai sumber energinya. Akhir-akhir ini semakin banyak orang yang sadar akan lingkungan. Sehingga sudah banyak juga orang yang sadar akan kondisi lingkungan. Dengan sadar akan lingkungan, manusia sudah menciptakan banyak inovasi penggunaan energi alternatif. Salah satu contoh penggunaan Pembangkit Tistrik Tenaga Bayu (angin) adalah PLTB Jeneponto yang terletak di Kabupaten Jeneponto provinsi Sulawesi Selatan dan PLTB Tanah Laut di Kabupaten Tanah Laut provinsi Kalimantan Selatan.
Ефективність використання комбінації рофлуміласту та кверцетину для корекції кисеньнезалежних механізмів і фагоцитарної активності клітин макрофагальної системи у хворих із загостренням хронічних обструктивних захворювань легень при поєднанні з ішемічною
Authors: Gerych Р. R. , Yatsyshyn R. I. 
Published: November 2023

Вивчали кисень незалежні реакції та фагоцитарну активність клітин макрофагальної системи у хворих із загостренням хронічного обструктивного захворювання легень (ХОЗЛ) ІІ–ІІІ ступеня при поєднанні з ішемічною хворобою серця (ІХС). Встановлено підвищення кисеньнезалежних реакцій моноцитів і нейтрофільних гранулоцитів та зменшення величини показників, що характеризують функціональний стан фагоцитуючих клітин. Це свідчить про зниження функціональної здатності макрофагальної фагоцитуючої системи (МФС) у хворих із загостренням ХОЗЛ, яке перебігає самостійно абопри поєднанні з ІХС (стабільна стенокардія напруження – ССН І–ІІ функціонального класу). Вираженість імунодефіцитного стану, за показниками клітинного компонента неспецифічного імунітету, у пацієнтів із загостренням ХОЗЛ ІІ–ІІІ стадії при поєднанні із супутньою ІХС посилюється з прогресуванням серцевої недостатності. Включення до базисної терапії загострення ХОЗЛ і стандартного лікування ІХС комбінації препаратів рофлуміласту і кверцетину зумовлює нормалізацію фагоцитарних показників МФС, що вказує на покращання імунологічного стану та поліпшує перфузії міокарда за показниками добового моніторування ЕКГ.