bluuebunny/crossref_metadata_2025_split huggingface dataset:
PENYELESAIAN MASALAH KETENAGAKERJAAN BAGI PEKERJA YANG MENDAPAT UPAH TIDAK LAYAK DI MASA PANDEMI COVID-19 SECARA MEDIASI
Authors: Kartikasari Erny , Warka Made , Kongres Evi 
Published: November 2023

AbstractThis study aims to determine legal protection for workers against wage issues during the Covid-19 pandemic. Research in this journal uses a normative research method. Article 88a paragraph (1) of Law Number 11 of 2020 concerning Work Copyright states: that labor rights to wages arise when a work relationship is established between workers and entrepreneurs/companies and ends when the employment relationship is terminated. The results of the study concluded that in terms of labor wage protection and protection for workers in their place of work, entrepreneurs/companies can postpone wage payments (if the entrepreneur/company cannot pay wages according to the minimum wage), by initiating negotiations with workers or labor unions related to the suspension. The postponement of payment of minimum wages by employers to workers does not immediately eliminate the obligation of employers/companies to pay the difference in minimum wages during the suspension. With the existence of Covid-19 the government issued SE No. M/3/HK.04/III/2020 concerning Labor Protection and Business continuity in the context of preventing Covid-19. So that the issuance of the Ministerial Decree is expected to help provide protection and work continuity for workers/laborers and maintain business continuity.Keywords: employment; wagesAbstrakPenelitian ini bertujuan untuk mengetahui perlindungan hukum bagi pekerja terhadap masalah upah di masa pandemi Covid-19. Penelitian dalam jurnal ini memakai metode penelitian normatif. Pasal 88 huruf a ayat (1) Undang-Undang Republik Indonesia Nomor 11 Tahun 2020 tentang Cipta Kerja menyatakan bahwa Hak buruh atas upah yang timbul saat terjalin hubungan kerja antara buruh dengan pengusaha/perusahaan dan berakhir saat terjadi putusnya hubungan kerja. Hasil penelitian disimpulkan bahwa dalam hal perlindungan upah buruh dan perlindungan bagi buruh di tempatnya bekerja pengusaha/perusahaan bisa melakukan penangguhan pembayaran upah (jikalau pengusaha/perusahaan tidak dapat bayar upah sesuai upah minim), dengan diawali melakukan rundingan dengan buruh atau serikat pekerja terkait penangguhan tersebut. Penangguhan pembayaran upah minim oleh pengusaha kepada buruh tidak langsung menghilangkan kewajiban pengusaha/perusahaan untuk pembayaran selisih upah minim selama penangguhan. Dengan adanya Covid-19 pemerintah mengeluarkan SE No. M/3/HK.04/III/2020 mengenai Perlindungan Buruh dan kelangsungan Usaha dalam rangka pencegahan Covid-19. Sehingga dengan dikeluarkannya SE Menaker tersebut diharapkan dapat membantu memberikan perlindungan dan kelangsungan bekerja bagi pekerja/buruh serta menjaga kelangsungan usaha.
Pengubahan Jangka Waktu PKWT dalam Perspektif Hak Tenaga Kerja untuk Mendapat Jaminan Pekerjaan Tetap
Authors: Novianto Rizal Dwi , Simangunsong Frans 
Published: November 2023

Dalam penelitian ini bertujuan mencari tahu jaminan tenaga kerja untuk mendapat pekerjaan tetap pasca omnibus law bagi tenaga kerja kontrak pasca pengubahan ketentuan masa jangka waktu PKWT dalam Undang-Undang Cipta Kerja beserta aturan pelaksananya. Dalam penelitian yang ini menggunakan metode penelitian normatif. Pada awalnya, ketentuan jangka waktu PKWT termuat pada Undang-Undang Nomor 13 tahun 2003 yang kemudian ketentuan itu dihapus dan dilakukan perubahan dalam Undang-Undang Nomor 11 tahun 2020 serta diatur lebih rinci dalam Peraturan Pemerintah Nomor 35 tahun 2021 sebagai aturan pelaksananya. Pengubahan jangka waktu PKWT ini menimbulkan beberapa kerugian bagi tenaga kerja kontrak sehingga mengancam hak asasi manusianya seperti kesejahteraan dan penghidupan yang layak. Perubahan jangka waktu PKWT menjadi lebih lama dan tidak adanya jaminan tenaga kerja kontrak untuk mendapat jaminan pekerjaan yang secara menetap. Sehingga kerugian yang dihasilkan ini, memberikan dampak pada kesejahteraan dan kehidupan yang layak bagi tenaga kerja kontrak. Disisi lain, kesejahteraan masyarakat dalam konteks mendapat pekerjaan dan penghidupan yang layak telah dijamin oleh Undang-Undang Dasar Negara Republik Indonesia tahun 1945 sebagai aturan tertinggi dalam peraturan perundang-undangan.
DISKRIMINASI HAK TERHADAP KETURUNAN EKS ANGGOTA PARTAI KOMUNIS INDONESIA (PKI)
Authors: Dermawan Fito 
Published: November 2023

Penelitian ini bertujuan untuk mengetahui dampak Tritura yaitu pembubaran PKI beserta ormas-ormasnya yang berakibat adanya perlakuan diskriminatif pada keluarga dan keturunan mantan anggota PKI. Kebijakan Orde Baru yaitu secara tegas bertentangan dengan UUD 1945 yang tidak menghargai persamaan hak warga Negara dalam kehidupan berbangsa dan bernegara. Metode yang digunakan dalam penelitian ini ialah metode penelitian kualitatif dengan menggunakan pendekatan penelitian deksriptif. Batasan spasial pada penelitian ini adalah Kota Madiun dan Blitar. Hasil penelitian ini untuk memperoleh informasi mengenai kebijakan-kebijakan yang dianggap diskriminatif dan mengintervensi keluarga dan keturunan eks anggota PKI. Bentuk diskriminasi terlihat dalam kehidupan sehari-hari seperti bidang politik, ekonomi, dan lain-lain. Pada akhirnya kebijakan-kebijakan yang dinilai diskriminasi tersebut penting untuk dipertimbangkan untuk dikaji dan diuji. Karena hal tersebut dinilai tidak relevan dengan Hak Azasi Manusia dan makna yang terkandung dalam UUD 1945.Kata kunci: Orde Lama, Orde Baru, PKI dan Keturunan.
KAJIAN HAK WARGA KAMPUNG POJOK JAKARTA AKAN AKSES TRANSPORTASI
Authors: Rosantiningsih Ika , Yola Lin 
Published: November 2023

Kawasan Muara Baru merupakan sebuah kawasan di pesisir utara Jakarta yang dihuni padat penduduk dan cenderung kumuh, mereka terdiri atas warga Kampung Pojok, warga Kampung Rumah Pompa serta warga Rusunawa Waduk Pluit. Permasalahan yang terjadi adalah belum terpenuhinya akses yang layak untuk menuju jalan raya terdekat, tidak adanya jalur pedestrian, hingga minim akses transportasi publik. Penelitian ini bertujuan untuk mengkaji hak warga Muara Baru dalam memperoleh aksesibilitas menjangkau wilayah lain di DKI Jakarta, akses transportasi ke pusat kota dan kelayakannya. Pendekatan penelitian menggunakan metode kualitatif deskriptif berupa studi kasus, pengamatan langsung, observasi dan analisis menggunakan google maps dan peta jakartasatu. Hasil penelitian menunjukkan bahwa akses transportasi publik warga pesisir Muara Baru ke pusat kota memerlukan penggantian moda dengan jarak tempuh hingga 2 jam serta jarak tempuh sekitar 14 KM. Transportasi yang disediakan pemerintah belum memadai karena masih minimnya jangkauan rute serta armada bus Transjakarta, dan belum terlayani oleh jaklingko sebagai penghubung ke tempat publik lainnya, minimnya aksesibilitas yang dimiliki saat ini yang membuat warga belum memperoleh hak aksesibilitasnya sebagai warga kota. Pemerintah perlu mengkaji kembali kebutuhan akses publik serta kegiatan yang diakomodir didalamnya agar kawasan tersebut dapat lebih terjangkau.
Analysis of the Braking System in the Gardapati Prototype Energy Saving Car
Authors: Davista Halim , Syafri Syafri , Huda Fablil , Anuar Kaspul 
Published: November 2023

The braking system is one of the crucial components in a vehicle because braking is a vital safety feature of the vehicle. The braking system functions to reduce or slow down the speed and stop the vehicle, as well as to enable the possibility of parking the vehicle on a downward slope. The braking system under investigation is examined in the prototype vehicle called Gardapati, which employs a hydraulic brake system. Gardapati is a vehicle created by students from the University of Riau's Mechanical Engineering Department, affiliated with the UKM Selembayung, following the standard references provided by the Energy-Efficient Vehicle Competition organized by BPTI.
This final project will involve several calculations related to the braking system, following the specifications used in the Gardapati vehicle. First, calculations will determine the dynamic braking force required (Fb) when the vehicle is moving at a speed of 50 km/h with a distance of 20 meters, as well as the static braking force (Fb) required when the vehicle is on an incline of 11.2 degrees, adjusted to the requirements and regulations of the 2023 Energy-Efficient Vehicle Competition (KMHE). Then, the braking distance will be calculated for speeds of 30, 40, and 50 km/h on dry and wet asphalt road conditions.
From the calculation results and data analysis, it is found that the required dynamic braking force (Fb) is 510,76 N, and the static braking force (Fb) is 830,31 N. Meanwhile, the minimum braking distance is observed on dry asphalt road conditions at a speed of 30 km/h with a percentage error of 1,59 %, where the theoretical value is 5.67 m and the actual value is 5,76 m. On the other hand, the highest braking distance is observed on wet asphalt road conditions at a speed of 50 km/h with a percentage error of 7,39%, where the theoretical value is 14.47 m and the actual value is 15.54 m. Of the two road conditions, the largest percentage error occurs when testing the vehicle at speeds of 30, 40, and 50 km/h on wet asphalt conditions, amounting to 4,61%. With this level of percentage error, it can be concluded that the variation in the obtained data is relatively small, which is less than 10%.
Advances in High-Resolution Non-Destructive Defect Localization Based on Machine Learning Enhanced Signal Processing
Authors: Brand Sebastian , Kögel Michael , Grosse Christian , Altmann Frank , Hollerith Christian , Gounet Pascal 
Published: November 2023

Abstract
Non-destructive inspection and analysis techniques are crucial for quality assessment and defect analysis in various industries. They enable for screening and monitoring of parts and products without alteration or impact, facilitating the exploration of material interactions and defect formation. With increasing complexity in microelectronic technologies, high reliability, robustness and thus, successful failure analysis is essential. Machine learning (ML) approaches have been developed and evaluated for the analysis of acoustic echo signals and time-resolved thermal responses for assessing their ability for defect detection. In the present paper different ML architectures were evaluated, including 1D and 2D convolutional neural networks (CNNs) after transforming time-domain data into the spectra-land wavelet domains. Results showed that 2D CNN with wavelet domain representation performed best, however at the expense of additional computational effort. Furthermore, ML-based analysis was explored for lock-in thermography to detect and locate defects in the axial dimension based on thermal emissions. While promising, further research is needed to fully realize its potential.
Evaluation of Inductor for Solderability and Drop Damage Susceptibility
Authors: Marshall Mack , Huang Edward , Rajaraman Arun , Grosjean David 
Published: November 2023

Abstract
Lead-free solder joints tend to be more susceptible to brittle fracture, and thus susceptible to drop-damage. Drop testing of handheld ultrasound devices revealed broken solder joints on a large inductor component. Analysis of the cracks showed a dual intermetallic compound (IMC) layer of Ni3Sn4 (closest to the nickel) and (Ni,Cu)6Sn5, with the crack occurring in between the two layers. The inductor had a tinned nickel lead finish; the solder was SAC305 (a common lead-free solder comprising Sn, Ag, and Cu); and the printed circuit board (PCB) had a standard copper finish. The failure occurred very soon after manufacture and had not been enhanced by temperature cycling or aging, but it was not a time-zero failure: mechanical shocks from drops were required to propagate the crack through the joint fully. Strain measurements did not find any large strains after reflow and assembly, and no other components on the board showed cracking. There was no cracking observed at the PCB (Cu) side of the solder joint. The solution ultimately was to redesign the board, replacing the large single component with several smaller ones.
Intricacies in the Failure Analysis of Integrated Capacitors
Authors: Mahinay Christopher S. , Reyes Christian , Calanog Ricardo , Mendaros Raymond 
Published: November 2023

Abstract
Integrated capacitors use metal plates such as in Metal-Insulator-Metal (MIM) and Metal-Oxide-Metal (MOM) capacitors while Polysilicon and Silicon (Si) substrate for metal-oxide-semiconductor (MOS) capacitors. Three major challenges and solutions were discussed in this technical paper. First, the failure site localization of a subtle defect in the capacitor plates. To determine the specific location of the defect site, Electron Beam Induced Current (EBIC) analysis was performed while the part was biased using a nano-probe set-up under Scanning Electron Microscopy (SEM) environment. Second, Failure Mechanism contentions between Electrically Induced Physical Damage (EIPD) or Fabrication process defect particularly, for damage site that is not at the edge of the capacitor and without obvious manifestations of Fabrication process anomalies such as bulging, void, unetched material or shifts in the planarity of the die layers. To further understand the defect site, Scanning Transmission Electron Microscopy (STEM) coupled with Energy-Dispersive X-ray Spectroscopy (EDS) were utilized to obtain high magnification imaging and elemental area mapping. Third, misled conclusion to be an EIPD site manifested by burnt and reflowed metallization. The EIPD site was only a secondary effect of a capacitor dielectric breakdown. This has been uncovered after understanding the circuit connectivity, inspections of the capacitors connected to the EIPD site, fault isolation and further physical failure analysis were performed. As results of the Failure Analysis (FA), Customer and Analog Devices Incorporated (ADI) manufacturing hold lots were accurately dispositioned and related corrective actions were precisely identified and implemented.
Backside Analysis Strategy to Identify a Package Related Failure Mode at an Automotive Magnetic Sensor Device
Authors: Simon-Najasek M. , Naumann F. , Huebner S. , Lejoyeux M. , Altmann F. , Lindner A. 
Published: November 2023

Abstract
This paper presents a root cause analysis case study of defective Hall-effect sensor devices. The study identified a complex failure mode caused by chip-package interaction, which has a similar signature to discharging defects such as ESDFOS. However, the study revealed that the defect was induced by local mechanical force applied to IC structures due to the presence of large irregular-shaped filler particles within the mold compound. Extensive failure analysis work was conducted to identify the failure mode, including the development of a new backside analysis strategy to preserve the mold compound during IC defect localization and screening. A combination of different failure analysis techniques was used, including CMP delayering, PFIB trenching, SEM PVC imaging, and large area FIB cross-sectioning. The study found that the mold compound of the package caused thermos-mechanical strain onto the silica filler particle due to epoxy shrinkage during the molding process. Additionally, extra-large, irregularly shaped filler particles (called twin particles), located on top of the chip surface, can cause locally high compression stresses onto the IC layers, initiating cracks in the isolation layers under certain conditions forming a leakage path over the time. Thermo-mechanical finite element analysis was applied to verify the mechanical load condition for these large irregular-shaped filler particles. As a result, an additional polyimide layer was introduced onto the IC to mitigate the mechanical stress of mold compound particles to avoid this failure mode.
Benchmarking ResCav – A Resonant Cavity System Used to Detect Counterfeit Microelectronics
Authors: Nechiyil Aditya , Lee Robert , Chapman Gregg , McCue Jamin J. 
Published: November 2023

Abstract
Counterfeit integrated circuits (ICs) continue to persist in the supply chain causing early failure in electronics that unknowingly incorporate them. With counterfeiters becoming more adept at replicating ICs, the need for systems and processes to identify counterfeit ICs has been growing in recent years. In this paper, we benchmark the resonant cavity system (ResCav) by evaluating its ability to distinguish ICs with minor circuit variations. A baseline IC group along with 5 variant groups with changes made solely to their die were examined in this paper. Using a supervised machine learning algorithm, the system was able to distinguish every group of ICs amongst each other with an average weighted precision above 90% in every comparison scenario. The system’s ability to distinguish these subtle changes means that it would be suitable when used as a system for counterfeit detection, where the detection of minor deviations is pertinent. This could ultimately lead to the creation of a rapid, precise, and non-destructive system that can screen ICs for conformance.
Methods to Enhance Infrared Imaging for Defect Localization Using Lock-in Thermography
Authors: Sharma Anjanashree M.R. , Jacobs Kristof J.P. , De Wolf Ingrid 
Published: November 2023

Abstract
In this paper, we demonstrate three approaches to enhance the topographical contrast of infrared images obtained from lockin thermography (LIT). Infrared imaging, particularly LIT, is one of the extensively used techniques for failure analysis (FA) in the semiconductor industry. However, low-contrast topography images are obtained at room temperature from conventional LIT due to poor emissivity contrast in the devices and the limitation on the performance of the infrared camera. The gray-scale topographical contrast is improved by 85% when the device under test is heated from room temperature to 75°C, using a printed circuit board heater. Furthermore, a heat-assisted LIT approach is proposed and demonstrated at the die level on an electrically leaky silicon interposer sample. The topographical contrast and the signal intensity of the hotspot obtained are enhanced when compared to the classical LIT, which is performed at room temperature. Further, the dual LIT approach is developed to reduce the thermal budget of the heat-assisted approach. The hotspot amplitude and improved topography image are obtained from two consecutive lock-in measurements. In addition, the topography image from this technique is obtained by averaging several hundred frames from the camera for a period of ten minutes, which results in an image that is less susceptible to input noise levels. To increase the throughput of the FA process, quadrature lock-in thermography, a dual-purpose measurement technique is shown. A high-contrast topography image and the hotspot location are obtained from the same lock-in thermogram by performing trigonometric conditioning. The throughput from this approach is the same as the classical LIT technique.
Logical to Physical SRAM Bitmap Verification with Fault Localization
Authors: Maggiacomo Alexander , Pahari Rabindra , Schaefer Torsten , Billus Gregory , Shekar Suresh , Kodali Satish , Beaudoin Felix , Sinnott Aaron 
Published: November 2023

Abstract
Physical Failure Analysis (PFA) is essential for SRAM yield learning, especially in new technologies or FAB transfers. For this to be successful, physical coordinates for tested bitcell failures must be accurately calculated and verified. The timeline for this process can vary dramatically based on the extent and complexity of any issues. This paper details the successful use of fault localization on isolated, voltage sensitive failures to achieve confidence in verification of physical location prior to PFA.
Electron Beam Induced Resistance Change for Isolation of Wordline Shorts in 3D Replacement Gate NAND
Authors: Rich Chandler , Harlow Wayne , Muñoz Becky , Sandoval Regino , Davis J. Temo , Williams Scott 
Published: November 2023

Abstract
In this paper, we present a new application of electron beam induced resistance change (EBIRCH) as a means to spatially isolate wordline shorts in 3D replacement gate NAND for high-precision physical failure analysis (PFA).
Defect Isolation in Advanced Nodes Large Circuitry Structures using a Combination of FIB Circuit Edits and Passive Voltage Contrast
Authors: Rodder Michael Allen , Cha Gina , Tovar Gil , Chin Cheong Kah , Penley Christopher 
Published: November 2023

Abstract
In this paper, we discuss and showcase a 2-step defect isolation methodology by combining Focused Ion Beam “circuit editing” (FIB circuit edit) and Passive Voltage Contrast (PVC) imaging. The combo technique is an effective, robust, and time saving method for isolating defects in large area circuit structures for advanced nodes. The application of FIB circuit edits successfully enhanced the PVC efficiency in defect isolation. More importantly, the developed 2-step methodology improves failure analysis (FA) success rate and quality, and reduces FA turn-aroundtime (TAT).
Low-kV FIB Applications and Workflows for Advanced Circuit Edit
Authors: Yan Rongjin , Vaghayenegar Majid , Donnet David , Buxbaum Alex 
Published: November 2023

Abstract
Circuit edit (CE) workflows are well established for FIB energies of 30kV and above. The small spot size associated with such energies provides good milling acuity and imaging resolution needed for advanced CE applications. However, with the introduction of FinFET transistors and decreasing technology nodes, the dramatic reduction in STI to gate distance reduction poses some challenges to circuit editing at these high energies. These include transistor performance degradation due to Ga+ implantation as well as significant lateral scattering beyond the Node Access Hole (NAH) as defined by the pattern. In addition, the relatively fast milling speeds may not give enough control to the user to endpoint at the appropriate layer. In this paper, a group of FinFET transistors on a special test chip was edited with the Ga beam at different energies. Transistor performances were then characterized to evaluate any degradation. The resulting characterization revealed how the transistor performance was affected by the injected ion beams and provided a guideline for the low-kV circuit edit workflow. A novel low-kV FIB workflow was proposed to minimize the transistor damage and maintain the IC functionality after the CE process. The workflow was applied to a challenging CE problem on a 5nm FinFET device. This task included step by step backside delayering at 5kV, preparing the sample for the final circuit edit operation at Metal-1. Working at low landing energies (e.g. 5kV) lowers subsurface damage and reduces etching speed, but with trade offs including lower image resolution, milling acuity, sputtering yield and signal to noise ratio (SNR). However, the consequences of these effects can be mitigated by use of appropriate chemistries with closed loop delivery control and extremely low beam currents (≤1pA), in concert with double aperture beam shaping to minimize beam tails. On the 5nm FinFET device, we demonstrate good delayering control by optimization of beam currents, and gas delivery on the Centrios HX circuit edit system from Thermo Scientific.