bluuebunny/crossref_metadata_2025_split huggingface dataset:
Transformation of the Mexican statistical and geographical system
Authors: Calvillo-Vives Gilberto 
Published: January 2025

The transformation of the Mexican Statistical and Geographical System has gone through a Constitutional Reform whose core elements are: the entitlement of the Congress to legislate on statistical and geographical information matters and to establish a National System of Statistical and Geographical Information coordinated by INEGI. The Reform has to be understood within a context of political evolution and change towards democracy during the 20th century, when a very powerful presidential regime drove Mexico, leading to a general social perception that the Government manipulated key statistical information for its own convenience. It was a felt need in the society to overcome this credibility crisis and to promote a more comprehensive and transparent National Information System, with the coordination of an autonomous institution. The System is organized in 3 subsystems: Economic and financial statistics; Social and Demographic statistics; and Environmental and Geographical Information, to produce and disseminate information of national importance. The main challenge ahead after the constitutional amendment, deals with the functioning of the System and the efficient coordinating role of INEGI, in accordance with the principles of accessibility, transparency, objectivity and independence.
Preliminary Phytochemical and Biological Investigations on Different Fractional Extracts of Sarcochlamys pulcherrima (Roxb.) Leaves
Authors: Chowdhury Labuni , Homa Zilly , Tasneem Zakya , Hossen Md Shafiul , Rashid Mohammad A , Ibrahim Mohammed 
Published: January 2025

The current study aimed to investigate the phytochemicals and anti-inflammatory, antioxidant, thrombolytic, and membrane stabilization properties of the Sarcochlamys pulcherrima (Roxb.) leaves by using various fractional extracts. The present study found alkaloids, tannins, flavonoids, reducing sugar, gums, and amides in its hydroalcoholic extract; flavonoids and saponins in its chloroform extract; and steroids and amides in its n-hexane extract. The maximal inhibition values were found for the hydroalcoholic and chloroform fractions in the antioxidant test at a dosage of 100 µg/ml. In addition, at 500 µg/ml concentration, all three extracts demonstrated substantial activity in the anti-inflammatory test accounted for 89.1%, 88.5%, and 82.8% for hydroalcoholic, chloroform, and n-hexane extracts, respectively, compared to the 95.9% for standard (Diclofenac-Na) at the same concentration. In case of thrombolytic activity, the tested extracts showed very weak clot lysis compared to the reference standard, streptokinase. In the membrane stabilization activity test, hydroalcoholic, chloroform, and n-hexane extracts were found to be 52.67%, 50.21%, and 15.52% at 1000 µg/ml, respectively. In comparison, the standard (Aspirin) showed 67.11% at 1000 µg/ml. Thus, overall findings suggested that the hydroalcoholic and chloroform extracts possess significant membrane-stabilizing activity at 1000 µg/ml.
Bangladesh Pharmaceutical Journal 28(1): 63-69, 2025 (January)
Exploration of Genetic Variants Associated with Lung Cancer: A Comprehensive Review
Authors: Hanif Hasibul Islam , Hossen Md Shafiul , Papia Sonia Akther , Trisha Samina Yesmin , Medha Nowsin Tabassum , Ibrahim Mohammed , Rahman Mohammad Sharifur , Rashid Mohammad A 
Published: January 2025

Lung cancer (LC) is a widespread and prevalent disease with a high death rate. The occurrence of this terrible disease is greatly influenced by genetic, occupational and environmental risk factors. Therefore, the present review aimed to investigate and accumulate the information regarding the causative gene of lung cancer. The articles included in this study were retrieved from various online sources, including Cochrane Library, Google Scholar, EMBASE, PubMed and Web of Science databases up to October 2024. Data were extracted based on the PRISMA 2020 guidelines. The study recognized several genetic mutations that are accountable for the progression of lung cancer. The most common identified lung cancer associated with genes include XRCC1, XRCC4, KRAS, TP53, EGFR, PI3KCA, ERCC2/XPD MET, ALK1, BRAF, HER2, LTKB-1/STK11, AKT1 and MAP2K1. Additionally, HER2, MAP2K1/MEK1, AKT, NRAS and various combinations of co-occurring mutations were also noted as stimulators of this cancer. These genes instigate lung cancer either by impairing DNA repair efficiency or interacting with various signaling pathways that result in cell proliferation, differentiation, angiogenesis, invasion and metastasis, such as, PI3k/AKT (phosphatidylinositol 3-kinase/protein kinase B) pathway, MAPKs (mitogen-activated protein) pathway, PKC (protein kinase C), JAK/STAT (Janus kinase/signal transducer and activator of transcription) pathway, as well as RAS signaling. Studying epigenetic mechanisms in lung cancer is crucial to understand the genetic variant linked to the disease and identify potential therapeutic targets and molecular targets of drugs.
Bangladesh Pharmaceutical Journal 28(1): 114-125, 2025 (January)
Supporting a state in developing a working theory of improvement for promoting equity in science education
Authors: Penuel William R. , Neill Tiffany N. , Campbell Todd 
Published: January 2025

IntroductionThis study was undertaken to explore the potential of developing a working theory of improvement for creating a more equitable system of science education at the level of a US state. We ask: How can tools from a long-term research-practice partnership support a state team in initiating improvement research toward promoting a more equitable system of science education?MethodsThis design study took place in winter 2024 in a single state. External partners supported leaders of a single state in the US Northeast to support a process of articulating aims, specifying primary and secondary drivers, and identifying change strategies to promote a more equitable system of science education in the state, grounded in the vision of A Framework for K-12 Science Education (National Research Council, 2012). In this paper, we rely on descriptive analyses of joint meetings and a focus group with state leaders describe the tools supporting the process of development, the team’s use of the tools to generate an early draft of the Driver Diagram, and issues surfaced while developing it with a team of interest holders in the state.ResultsTwo meanings of equity emerged as significant within the series of meetings: that of the importance of universal access to professional learning and the importance of students having opportunities to experience culturally relevant instruction. The issues surfaced highlighted the need for infrastructures for professional learning to reach a diverse group of interest holders in science, including teachers, school leaders, and district leaders across the state. They also saw curriculum materials that connect to students’ everyday lives and community priorities as key drivers for equitable change in the system, around which professional learning activities should be organized. The team also surfaced several policy changes needed to implement change strategies, only some of which team members felt they had some authority.DiscussionWhere past researchers have observed that equity can disappear as a focus during implementation of reforms, this study found that developing an aim statement and driver diagram helped energize and refocus a team’s implementation efforts geared toward a vision for science teaching and learning that is focused on ensuring all students can engage in meaningful science learning that is culturally and locally relevant to them.
Determining the levels of pelvic floor disorders in women diagnosed with urinary incontinence: a mix-method study
Authors: Yalazı Rüveyda Ölmez , Demirci Nurdan 
Published: January 2025

IntroductionUrinary incontinence (UI) significantly affects women’s quality of life and may contribute to pelvic floor disorders. This study aimed to investigate the impact of UI on pelvic floor disorders through a mixed-methods approach.MethodsA convergent parallel design was employed, integrating quantitative and qualitative data. Quantitative data were collected using the “Global Pelvic Floor Disorders Questionnaire,” and semi-structured interviews were conducted for qualitative insights. Quantitative data were analyzed using SPSS 26.0, while qualitative data underwent content analysis with MAXQDA Pro 22 software.ResultsAmong the participants, 41.7% were diagnosed with stress urinary incontinence, which was associated with the highest level of discomfort. Qualitative findings revealed four main categories: effects on daily life, emotional and psychological effects, coping strategies, and treatment approaches and expectations. Participants reported that UI led to social isolation, reduced self-esteem, and increased anxiety.DiscussionThe findings highlight that UI adversely affects both the physical and psychosocial well-being of women. Addressing this condition requires a holistic approach combining medical treatment with psychosocial support to mitigate its multifaceted impact.
Autour de la chaintre
Authors: Taverdet Gérard 
Published: January 2025

On lit dans la plupart des ouvrages de dialectologie et de toponymie une forme
chaintre , paradoxalement absente des grands dictionnaires étymologiques, comme le
FEW . On explique généralement ce terme par le latin cancer (homonyme de
cancer “crabe”), terme latin fort rare et auquel on a donné le sens de barreau. Cette explication ne donne pas entière satisfaction aussi bien du point de vue phonétique que du point de vue sémantique. Il importe de reprendre la question et de voir si les chaintres
(déjà signalées par Littré) n’ont pas une origine à la fois plus simple et plus vraisemblable.
Pré-operatório de crianças com Síndrome do Respirador Oral: usando uma estratégia lúdica para melhoria do cuidado
Authors: Cunha Paulo André Gonçalves da , Amaral Naiade de Oliveira do , Oliveira Camila Araújo , Olinto Bianca Sousa Duarte Rotoli , Rodrigues Lorena Gonçalves 
Published: January 2025

A preparação psicológica das crianças para um procedimento cirurgico deve ser vista como uma etapa importante do processo, assim como exames e avaliacões de risco cirúrgico. Durante o pré operatorio, é comum que os menores apresentem comportamentos que traduzem stress por não compreenderem adequadamente qual sera o passo a passo entre a entrada no hospital e o retorno à sua casa. Dessa forma, objetivamos investigar a eficácia de um instrumento lúdico, uma revista em quadrinhos, na preparação de crianças para adenoamigdalectomia, a partir da percepção de profissionais de saúde e de outras áreas pedagógicas sobre a importância desse tipo de ferramenta. Utilizando como metodologia uma revisão integrativa do tema, seguido da produção de um tecnologia educacional. Por fim, avaliação e validação da tecnologia educacional por profissionais especializados, a partir da Escala Likert. Os resultados apontam que para 90% dos profissionais que atuam nas áreas de saude e educação entrevistados, o uso de um material lúdico de qualidade, contribui para a melhoria do cuidado das crianças no processo pré-operatório, sendo totalmente adequadas para esse processo.
A Dual Active Black Hole Candidate with Mass Ratio ~7:1 in a Disk Galaxy
Authors: Cao Xiao , Chen Yan-Mei , Shi Yong , Wang Junfeng , Zhou Zhijie , Bao Min , Gu Qiusheng , Moiseev Alexei , Ho Luis C. , Wang Lan , Zeng Guangquan 
Published: January 2025

Abstract
Dual active galactic nuclei (AGNs) with comparable masses are commonly witnessed among the major merged galaxies with interaction remnants. Considering almost every massive galaxy is associated with multiple dwarf satellites around it, minor mergers involving galaxies with disproportional stellar masses should be much more common than major mergers, which would naturally lead to black hole (BH) pairs with significantly different masses. However, dual AGNs generated by minor mergers involving one or two dwarf galaxies are exceptionally rare and understudied. Moreover, good estimates of the masses of both BHs are not yet available to test this idea. Here we report the evidence of a dual AGN candidate with mass ratio ~7:1 located in an undisturbed disk galaxy. We identify the central BH with mass of 9.4 × 106
M
⊙ from its radio emission as well as AGN-driven galactic-scale biconical outflows. The off-centered BH generates obvious broad and narrow emission-line regions, which gives us a robust estimation of a 1.3 × 106
M
⊙ BH mass. We explore alternative scenarios for explaining the observational features of this system, including the complex gas kinematics triggered by central AGN activity and dust attenuation of the broad-line region of the central BH, finding that they failed to fully account for the kinematics of both the redshifted off-centered broad and narrow emission-line components.
Revitalizing Domestic Semiconductor Manufacturing: Challenges, Opportunities and Emerging Applications
Authors: Litecky Mark 
Published: January 2025

• 60% of microelectronics devices will be on 65 nm or higher platforms through 2030* • Investments are concentrated at the leading edge • Mature nodes offer a base on which advanced emerging technologies can be layered • Advanced Packaging is an opportunity to advance the leading edge of semiconductor technology
Application of Picosecond Acoustic Metrology for monitoring Metal Films in Advanced Packaging
Authors: Mehendale M. , Park K. , Han Y. T. , Dai J. , Kim C. , Antonelli G. A. , Mukundhan P. 
Published: January 2025

High-performance computing applications such as artificial intelligence, and machine learning require massive amount of parallel processing requiring significant memory bandwidth. High bandwidth memory (HBM) solutions have been optimized to enable such applications. HBM consists of core DRAM die and a logic buffer die in a vertically stacked 3D structure. Customers are adopting front-end solutions to meet the shrinking process tolerances and to meet the stringent reliability requirements. [1] Picosecond acoustic metrology is a well-established technique for in-line measurements [2-3] and can be applied to meet the challenges of advanced packaging applications. In this paper, we shall present system-level improvements and specific use cases that have accelerated adoption of the technology in fan-out wafer level packaging (FOWLP) and in the HBM process loop. In the FOWLP process, re-distribution lines (RDL) play a critical role in how I/Os are connected and measuring RDL thickness before and after copper seed etch is necessary as it impacts line resistance and leakage current. In the TSV process loop, multi-layer metal stack such as gold/nickel/copper is used to form pads for bonding to the micropillar. The thickness of each of the layers plays a critical role in reliability performance and hence in-line process control requires layer to layer thickness monitoring is. Similarly, in the microbump process flow, controlling copper seed/barrier thickness is critical as the relative bump heights will vary as a function of the copper seed thickness variation impacting bump co-planarity [4-5]. References 1. S. Ha, S. Lee, GH. Bae, DS. Lee, S.H. Kim, BW. Woo, N-H Lee, YS. Lee and S. Pae, “Reliability Characterization of HBM featuring HK+MG Logic Chip with Multi-stacked DRAMs,” 2023 IEEE International Reliability Physics Symposium (IRPS), May 2023 2. J. Dai., J. Chen, M. Mehendale, M. Alves, J. Ding, F. Shen, R. Mair, A. Hegde, P. Mukundhan, J. Shen, C. Kim, “Comprehensive In-line Metrology for Advanced RDL Process Monitoring”, IMAPS 2017 3. Parker Huang, Bruce Chiu, Jay Chao, Chun Hung Lu, Stephen Chen, Jay Chen Fei Shen, Jian Ding, Johnny Dai, Priya Mukundhan, and Timothy Kryman., Optical and Acoustic Metrology Techniques for 2.5D and 3D Advanced Packaging, In Proceeding of the IMAPS Device Packaging, San Diego, 2014. 4. J. Derakhshandeh, Inge De Preter, Carine Gerets, Lin Tong Hou, N. Heylen, Eric Beyne, Gerald Beyer, John Slabbekoorn, Vikas Dubey, Anne Jourdain, Goedele Potoms, Fumihiro Inoue, Geraldine Jamieson, Kevin Vandersmissen, Samuel Suhard, Tomas Webers, Giovanni Capuz, Teng Yue Wang, Kenneth June Rebibis, Andy Miller, “3D Stacking Using Bump-Less Process for Sub 10µm Pitch Interconnects,” ECTC 2016 5. C. Chen, D. Yu, and K. Chen, “Vertical Interconnects of Microbumps In 3D Integration,” MRS Bulletin, Vol. 40, March 2015, 257-262
High Density Organic Substrates for Chiplet Technologies
Authors: Böttcher Lars 
Published: January 2025

The industry’s increasing demand for high-performance electronic devices with better functionality, lower power consumption and higher speed is driving innovation in advanced packaging technology. Improving semiconductor chip performance and advancing package characteristics are critical. These ever-increasing demands on electronic systems have led to the current trend of increasingly relying on so-called chiplets instead of individual chips. In detail, this means that individual silicon building blocks or functional units, which can also be developed and manufactured independently of each other, are combined to form a very powerful overall system. These then find application, for example, in neural networks or advanced driver assistance systems, and generally in all types of AI systems. Since miniaturization of the semiconductor chip is a major challenge, minimizing the wiring length in the package by using denser and thinner interconnects is crucial. The high number of inputs and outputs (I/O) in these high-density packages reduces the structural size of lines and spaces (L/S), and the quality of interconnection of these fine spaces can drastically affect the performance of the device. This paper presents the development of the required technology blocks for high-density redistribute layers needed to realize such organic substrates. The technology approach used is an advanced semi-additive processing (aSAP) at large panel level. This technology involves the use of dielectric layers, such as ABF or similar, PVD seeding and additive electrolytic copper deposition. The following various interconnect blocks required are discussed in detail: Vertical interconnects can be made by laser drilling, lithography when photo-imageable dielectrics are used, or plasma with reactive ion etching (RIE). The process options and limitations are discussed in detail. Horizontal interconnects are fabricated by seeding, photo-imaging of plating masks and subsequent copper deposition, and resist and seed removal. Photo-imaging is an important process step in this process. The evolution towards line and space structures targeting 5µm and further to 2µm on large panels up to 610x457mm² is described in detail. Finally, first electrical test data and the resulting process yield for different structure sizes are presented and discussed.
The Mid-Atlantic Semiconductor Hub (MASH): A Distributed Network of Resources and Talent to Reassert U.S. Leadership in Semiconductor Manufacturing
Authors: Lopez Daniel 
Published: January 2025

The MASH “distributed” network of facilities and cloud of expertise will support technology transition to manufacturing and offer redundancy of resources. MASH will give access to one of the world’s largest nanofabrication, packaging, and characterization facility by linking and enhancing the facilities in the hub. MASH will focus on helping the semiconductor industry to transition Materials into Systems: advanced communications, non-volatile memory, More than Moore devices, IIoT , Artificial Intelligence, edge computing, wireless communications, quantum devices, environmental sustainability, and materials and substrates. MASH activities will center around three cross-cutting areas: • Si-adjacent technologies, • Advanced packaging, • Digital Twins & AI for semiconductor processes. MASH will develop skills-based educational and workforce development plans to attract people to the field, provide companies with an agile system to meet staffing requirements, and at the same time, enhance racial and socioeconomic diversity.
A Novel, Automated Measurement and Analysis Technique forBonding Energy of Fusion and Hybrid Wafer to Wafer Bonding
Authors: Tuchman Andrew , Hoshino Satohiko , Gildea Adam , Netzband Christopher , Son Ilseok 
Published: January 2025

Wafer bond quality is determined through Dual Cantilever Beam (DCB, Mazara method) testing. However, DCB is influenced by environmental and human factors and prone to large measurement error (>20%). Here, we demonstrate novel, automated measurement and analysis to remove these factors delivering industry leading accuracy (<5% error) and throughput (>100x). Bonding Energy (BE) is a crucial parameter for evaluating wafer bonding quality and determining whether bonded wafers can survive downstream processes in next generation 3D integration. There are several methods to measure bonding energy, but the dual cantilever beam (DCB) method is widely used due to its simplicity and cost-effectiveness. In DCB, a razor blade is inserted between two bonded wafers and the bonding energy is calculated from the length of the resulting crack. However, due to human and environmental factors, the error in DCB is often too large to make accurate and consistent measurements. The main environmental factor is stress corrosion where ambient water reacts with stressed siloxane bonds to prematurely break bonds causing BE to decrease over time. This means the bonding energy over time is proportional to the ambient humidity. Humidity can be removed using a glovebox, but this significantly reduces throughput due to purge/pump times and increases measurement complexity and cost. Here, we automate the crack length measurement in DCB to remove human measurement error and develop a novel method to remove the impact of stress corrosion without a glovebox. This technique also allows us to detect residual water in the bonding interface. Using our new technique, the bonding energy of fusion and hybrid bonded wafers are measured with <5% error. From these findings, we propose a new industry standard for measuring and reporting bonding energy in wafer-to-wafer bonding.
Scalable Core Package for Power Module with Double-Sided Cooling Capability Applying Fan-out Panel-Level Process Suitable for SiC and GaN
Authors: Takao Katsuhiro , Kuroha Atsushi , Kawada Michihito , Kono Ichiro , Suzuki Takashi , Aizawa Yoshiaki 
Published: January 2025

Recently, as the demand for electric vehicles, charging infrastructure and renewable energy grows in response to the need for energy conservation and a low-carbon society, there has been growing interest in the development of SiC, which offers advantages in high-temperature operation, high-speed operation and low ON-resistance. SiC is expected to have lower heat loss and higher switching conversion efficiency. Several SiC inverter modules (packaging) have been proposed, but further concept development is needed in terms of size/thickness, heat dissipation characteristics, parasitic resistance and inductance. In this report, we propose a thinner, smaller and higher heat dissipation SiC core module package with double-sided cooling capability by applying Fan-Out panel level process. The package internal wiring consists of Cu Via and large-area fan-out RDL, enabling high heat dissipation, low resistance and low inductance. These have the advantage of maintaining surge voltages equivalent to those of Si and also reducing current variations between SiC chips, which also allows for fast switching. On the other hand, SiC crystals are harder than Si crystals (about 3 times), so the compressive stress on the chip is greater, requiring less stress and less warpage at the package level. We have confirmed by thermal stress simulations that stress and warpage reduction can be achieved by applying EMC materials with high Tg but very low Young’s modulus. In this report, we report the results of verification by simulation and actual prototypes in terms of heat dissipation and thermal stress.