bluuebunny/crossref_metadata_2025_split huggingface dataset:
Responding to avian influenza A H5N1 detection on a hospital property in Maine—An interdisciplinary approach
Authors: Krueger Anna , Myles Devin J. F. , Rice Carrie P. , Taylor Tegwin K. , Hurwitz Carolyn , Morris Jesse , Robinson Sara 
Published: November 2023

AbstractBackgroundThe risk of infection with avian influenza A viruses currently circulating in wild and domestic birds in the Americas is considered low for the general public; however, detections in humans have been reported and warning signs of increased zoonotic potential have been identified. In December 2022, two Canada geese residing on the grounds of an urban hospital in Maine tested positive for influenza A H5N1 clade 2.3.4.4b.AimsGiven the opportunity for exposure to staff and hospital visitors through potentially infected faeces on the property, public health authorities determined mitigation efforts were needed to prevent the spread of disease. The ensuing response relied on collaboration between the public health and animal health agencies to guide the hospital through efforts in preventing possible zoonotic transmission to humans.Materials and MethodsMitigation efforts included staff communication and education, environmental cleaning and disinfection, enhanced illness surveillance among staff and patients, and exposure and source reduction.ResultsNo human H5N1 cases were identified, and no additional detections in birds on the property occurred. Hospital staff identified barriers to preparedness resulting from a lack of understanding of avian influenza A viruses and transmission prevention methods, including avian influenza risk in resident wild bird populations and proper wildlife management methods.ConclusionAs this virus continues to circulate at the animal‐human interface, this event and resulting response highlights the need for influenza A H5N1 risk awareness and guidance for facilities and groups not traditionally involved in avian influenza responses.
Prioritisation of Needs and Opportunities for Promoting Circular Economy When Managing Materials and Waste Arising From Nuclear Decommissioning
Authors: Pancotti Federica , Bruno Aina , Wasselin Virginie , Maitre Melanie , Kennes Christian , Vaillant Ludovic , Larsson Arne , Harvey Elizabeth , Szőke Réka , Aldave De Las Heras Laura , Poškas Gintautas , Banford Anthony , Meteyer Alison , Jacops Elke , Oxberry David , Mikšová Jitka , Sciacqua Rossella 
Published: November 2023

Abstract
The Euratom HARPERS (HARmonised PracticEs, Regulations and Standards in waste management and decommissioning) project aims to establish and clarify the benefits and added value of a more aligned practices, methodologies and approaches for prioritised topics related to decommissioning and initial phases of radioactive waste handling, including shared processing facilities between Member States (MS).
The HARPERS project has a two-phase approach: the first phase involves engaging with Stakeholders to assess needs and pros/cons for harmonisation and to identify priority areas for deeper analysis. The second phase will pursue deeper engagement with Stakeholders to further assess the highest ranked priority areas in the three technical Work Packages. In Phase 2 the industry and business impacts resulting from the project findings will be also evaluated.
Work Package 4 (WP4) of HARPERS project is focused on addressing the most important conditions and opportunities for promoting Circular Economy approaches when managing materials and waste arising from nuclear decommissioning across Europe.
For the prioritisation of needs and opportunities for Circular Economy considerations, a detailed list of topics (challenges/needs - related to alignment of practices and approaches) has been developed. Topics were clustered into 7 main categories and discussed with interested external stakeholders during dedicated on-line workshops conducted in January and February 2023.
Criteria for the prioritisation of topics, based on drivers relating to societal impacts, actor-specific impacts, scientific impacts and financial impacts, have been developed and discussed during the workshops too.
This work presents the preliminary outcomes of the two online workshops.
Decreasing Level Activities and Releasing Wastes: It’s Now Possible Thanks to a New Electrodecontamination Implementation
Authors: Gal Michaël , Reuter Olaf , Damerval Frédérique 
Published: November 2023

Abstract
The ORANO la Hague plant (Manche) must be innovative in dismantling its old facilities.
In particularly, the dismantling HAO’s cells (High Activities Oxides building) involves the clean-up of equipment in cells that was used to shear and dissolve spent fuel.
Electro chemical Decontamination (ED) was extensively used in the pre-maintenance job decontamination for its high efficiency and innocuousness towards the components treated. It generates low amount of effluent, usually exhibit high contamination and dose rate as DF high as 1000 were commonly obtained.
Its ventures in the D&D areas were rare, because of the complex set-up.
Addressing a recurrent implementation issue, ORANO DS is developing, from an equipment developed by the company REUTER GmbH, a simple solution to be able to use ED to treat metal waste which, after clean-up operations, has an activity not compatible with surface waste disposal. Electro-decontamination will also be used to reduce the level of radiological exposure, to allow human access and to keep compatible conditions for the nuclear measure in Zone 4 (e.g. cell 916 HAO).
The purpose of this technical development in collaboration with REUTER GmbH is to adapt an ED equipment to allow its use in a specific nuclear environment: work in zone 4, where access is forbidden to humans and interventions are carried out by remote handling.
PREDIS Collaboration to Advance the Predisposal Management of Radioactive Waste
Authors: Oksa Maria 
Published: November 2023

Abstract
PREDIS - Predisposal management of radioactive waste is a European Commission funded project to develop predisposal activities on treatment and conditioning methodologies. The target is for wastes, which yet haven’t adequate or industrially mature solutions, including metallic materials, liquid organic and solid organic waste. PREDIS project also addresses testing and evaluating innovations and digitalization solutions for cemented waste handling and pre-disposal storage. The scope of the PREDIS project includes characterization, treatment and conditioning of the waste streams, demonstrations and performance evaluation of the waste streams to verify safety and effectiveness of the new solutions. Environmental assessment of the processes and residual products, economic assessment of the treatment processes and finally guidelines for use, to ensure deployment of the new solutions are also in focus of the project.
The four-year PREDIS project that started in September 2020 with 47 seven partners in 17 countries has been strong in development, collaboration and sharing information on predisposal activities both in technical issues and in strategic research agenda, waste acceptance criteria and life cycle assessment. One target of the project has been to develop the knowledge management programme and support training and mobility activities in collaboration with EJP EURAD. PREDIS project has close collaboration with stakeholders and end users, having an End User Group of 25 organisations. PREDIS project has already widely disseminated the project results via webinars, open workshops and international conferences, and had close dialogue with the stakeholders to share the relevant information on predisposal issues. This paper will present the main achievements in the research and development collaboration aspect of the PREDIS project.
Lessons Learned From Implementing Training and Mobility Programmes Within EC H2020 Projects EURAD and PREDIS
Authors: Miksova Jitka , Belmans Niels , Carbol Paul , Holt Erika , Valls Alba , Faltejsek Jiří , Coeck Michele 
Published: November 2023

Abstract
Both EURAD and PREDIS are addressing research, strategic studies and knowledge management (KM) in the field of radioactive waste management (RWM). PREDIS is focusing on radioactive waste predisposal, while EURAD on overall aspects of RWM with s special focus on geological disposal of radioactive waste. Both are partially financially supported by the European Commission.
Since inception, the KM activites are essential to ensure efficient knowledge transfer among the community. The projects contribute training amd mobility aspects, also including the ‘School of Radioactive Waste Management’, while using available research infrastructures and providing a platform for knowledge exchange.
Besides training courses, both projects regularly organize topical webinars with worldwide participant and facilitate exchange of students and experts between institutes. A number of initiatives are taken to give visibility to students in the R&D programmes, thus supporting their networking and possibilities for mentoring.
Viewing of Radioactive Material Including Vitrification Processes
Authors: Canty Christopher , Canty Tod 
Published: November 2023

Abstract
High Temperature cameras allow ideal visual inspection and verification in extreme temperature environments. A unique fused glass seal provides an impenetrable safety barrier between the camera electronics and the harsh process environments. The camera is protected from high temperatures, fumes and radiation. The dynamic imaging system provides a live view of the process, and analyzes the process by generating critical real time measurement data.
In nuclear waste vitrification, radioactive material is heated with glass forming additives and poured into a containment vessel to cool into a uniform glass product. The use of high temperature camera systems allows verification that the melting and cooling processes are uniform and repeatable, by providing a live view and analysis of the process. This allows for maximum efficiency and safety, while maximizing the percentage of waste that can be immobilized in the glass product.
The paper outlines the critical steps in the disposal of nuclear waste, including the vitrification processes. The strategies used to ensure process safety and efficiency are examined and the critical measurements in each step are determined. It is demonstrated that High Temperature cameras are a useful tool for monitoring those critical measurements to improve the processes of nuclear waste vitrification.
Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
Authors: Shahi Pardeep , Heydari Ali , Eslami Bahareh , Radmard Vahideh , Hinge Chandraprakash , Modi Himanshu , Chinthaparthy Lochan Sai Reddy , Tradat Mohammad , Agonafer Dereje , Rodriguez Jeremy 
Published: November 2023

Abstract
Demand is growing for the dense and high-performing IT computing capacity to support artificial intelligence, deep learning, machine learning, autonomous cars, the Internet of things, etc. This led to an unprecedented growth in transistor density for high-end CPUs and GPUs, creating thermal design power (TDP) of even more than 700 watts for some of the NVIDIA existing GPUs. Cooling these high TDP chips with air cooling comes with a cost of the higher form factor of servers and noise produced by server fans close to the permissible limit. To overcome these issues for high TDP chips advanced cooling technologies, need to be investigated. Liquid cooling is becoming more mainstream to overcome the some of challenges mentioned above. Direct-to-chip cold plate-based liquid cooling is highly efficient and becoming more reliable as the advancement in technology is taking place. Several components are used in the liquid-cooled data centers for the deployment of cold plate based direct to chip liquid cooling like cooling loops, rack manifolds, CDUs, row manifolds, quick disconnects, flow control valves, etc. Row manifolds used in liquid cooling are used to distribute secondary coolant to the rack manifolds. Characterizing these row manifolds to understand the pressure drops and flow distribution for better data center design and energy efficiency is important. In this paper, the methodology is developed to characterize the row manifolds. Water-based coolant Propylene glycol 25% was used as the coolant for the experiments and experiments were conducted at 21 °C coolant supply temperature. Highly calibrated Pressure sensors were used at the supply port of the row manifolds and the inlet-outlet of the main hose to measure the supply pressure of ports and pressure drop across the row manifold respectively. Similarly, ultrasonic flow sensors were used to measure the flow rate at each supply port and the main entrance of the row manifold. Two, six-port row manifolds’ P-Q curves were generated, and the value of supply pressure and the flow rate were measured at each port. The results obtained from the experiments were validated by a technique called Flow Network Modeling (FNM). FNM is a 1-D simulation suited for the analysis of flow distribution in liquid cooling systems. The FNM technique uses the overall flow and thermal characteristics to represent the behavior of individual components. Therefore, the solution of conservation equations over the network enables efficient prediction of the flow rates, pressures, and temperatures in a complete liquid-cooling system.
Study of Reliable Chip Last Process for Fan Out Wafer Level Package
Authors: Liu Shuai-Lin , Kao Nicholas , Lin Vito , Zhang Ken , Wang Yu-Po 
Published: November 2023

Abstract
Package on Package (PoP) is one of packing technology to implement in mobile application. PoP is a stacking technology to integrate two or more separated packages. Specifically for application processor or baseband die of smartphone and tablets, the design to stack AP/BB chip and memory package is adopted generally in iOS or Android phones. One of PoP structure, substrate base of high bandwidth PoP (HBW-PoP), is a mature packaging type and has accessed to market in recent years. Seeking to the alternative PoP technologies, the demand is to reduce package dimension to cram more chip functions and expand battery capacity by size as larger as possible. Fan out wafer level package (FOWLP) efficiently enable higher I/O counts for high performance edge computing by re-distribution organic layers (RDL). In addition, the more advanced silicon node, the higher cost design houses bear in packaging development. Therefore, this study is that we propose a fan out package on package (FO-PoP) with chip last process, which features have higher process yield, shorter cycle time benefits than chip first platform. Organic RDL can miniaturize package height by replacing substrate base PoP. The total height can reach less than 0.5mm and meet up the market trend in wearable and smartphone applications. Known-good-die (KGD) feature of chip last process extremely control RDL process yield to reduce AP dies loss and further improve overall packaging yield. Then, the in-parallel process between bottom RDL and die micro-bumping process can shorten cycle time for production efficiency. In this paper, test vehicle verification includes warpage in the criteria and reliability validation passed by packaging level reliability and board level reliability.
L2A CDUs Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning
Authors: Heydari Ali , Soud Qusai , Tradat Mohammad , Gharaibeh Ahmad , Fallahtafti Najmeh , Rodriguez Jeremy , Sammakia Bahgat 
Published: November 2023

Abstract
As the online frameworks and services are growing rapidly with the evolution of web-based Artificial Intelligence (AI) applications, server rooms are upgrading in computational capacity and size to keep up with these demands. Enterprise companies with their limited capacity server rooms struggle to keep up with these increasing computational demands. Hence, some of them end up outsourcing their servers to co-located facilities (Co-Lo) and the others choose to upgrade their existing server rooms. Correspondingly, the thermal load associated with such upgrades is typically tremendous. Approximately around 40% of the power consumed by datacentres is dissipated as heat. Conventional HVAC systems fail to satisfy the requirements of such server capacities. Not only do they struggle to fulfil the cooling load, but their maldistribution of cool air into the server room forms a major cause for hotspots formation. To tackle this issue, Liquid-to-Air (L2A) Coolant Distribution Units (CDUs) are being used as a liquid-based cooling solution for rack-level cooling. This type of CDUs provide efficient cooling for servers through liquid coolant that is distributed into cooling loops mounted on top of each server board. The generated heat is curried away using this liquid coolant back to the CDU, which then dissipates it into the surrounding air using dedicated pumps, fans, and heat exchanger, hence the name Liquid-to-Air.
In the present work, one of the most popular liquid cooling strategies is explored based on various scenarios. the performance of a 24-kW liquid to Air (L2A) CDU is judged based on cooling effect, stability, and reliability. The study is curried out experimentally, in which a test rack with three thermal test vehicles (TTVs) are used to investigate various operation scenarios. Both liquid coolant and air sides of this experimental setup are equipped with the required instrumentations to monitor and analyse the tests. All test cases were taken in a room with limited air conditioning to resemble the environment of upgraded server rooms with conventional AC systems. Moreover, the impact of using such high-power density cooling unit on the server room environment with restricted HVAC system is also brought to light. Environmental and human comfort parameters such as noise, air velocity, and ambient temperature are measured under various operation conditions and benchmarked against their ranges for human comfort as listed in ASHREE standards. At the end of this research, recommendations for best practice are provided along with areas of enhancement for the selected system.
Thermal-Hydraulic Characterization of Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter. Part I: Design and Experiments
Authors: Rouaze Gautier , Minazzo Enzo M. , Marcinichen Jackson B. , Thome John R. , Buining Fred 
Published: November 2023

Abstract
The delivery of computing services — including storage, databases, networking, software, analytics, artificial intelligence (AI) and more — has started with Cloud Computing (CC) over the Internet, delivered from off-premise datacenters, running infrastructure at scale with a pay as you go service to their end customers. As the Internet of Everything (IoE) continues to evolve, parts of these services are migrating from the centralized locations (Cloud) to more decentralized locations closer to the end-user, e.g. Fog Computing (FC), Edge Computing (EC) and only recently on to the end-user device itself, the Mist Computing (MC). By 2025, Gartner predicts 75% of the data will be processed at the Edge. Applications are characterized by big data and near real-time processes in various areas, such as: energy management, highways, buildings, plant automation, supply chain, visual security, signage, and mobile-EC. Unlike for Cloud systems, reference frameworks and standards for FC and EC are still in an early stage of development or non-existant for MC.
As part of the European project BRAINE (a 28-partner consortium), a novel type of Edge MicroDataCenter (EMDC) providing cost-effective, powerful computing resources close to endusers and specifically designed for AI elaborations is being developed with very efficient cooling that nears being completely passive.
The present study concentrates on experimental validations of a new highly efficient, passive thermosyphon cooling system (patent pending by October 2023) thermally managing the level and uniformity of temperature for all the electronics in the package (no air cooling at all within the computer chassis). The primary objective is the cooling of 11 nodes (which include CPUs, FPGAs, GPUs and Storage) considering one heat sink evaporator per node. Presently, a first prototype as a simplified EMDC with 4 slots (i.e 4 nodes) has been fabricated and the entire thermosyphon cooling system evaluated. The experimental results are presented. The working fluids used are the new environmentally friendly refrigerants R1233zd(E) and R1234ze(E).
It is highlighted that BRAINE’s overall aim is to boost the development of the Edge framework and specifically energy-efficient hardware and AI-empowered software systems, capable of processing Big Data at the Edge, performing AI functions, supporting security, data privacy and sovereignty. Then, cooling is one of the most important aspect in this new technological challenge. In fact, our cooling system has no moving parts inside computer (solid-state) and our thermosyphon has an energy efficiency ratio of heat dissipation-to-cooling fan power up to 64-to-1.
Prediction of Pad Cratering Performance at Copper-Resin Interfaces With Multiple Reflows
Authors: Lall Pradeep , Pandurangan Aathi Raja Ram , Choudhury Padmanava 
Published: November 2023

Abstract
Pad cratering is one of the major failure modes encountered during PCB assembly and operation. Fracture is generally mechanically induced between the outermost layer of board resin and copper foil, between the resin and the glass fibers, or in the bulk resin of the printed circuit board. Prior work on the reliability of printed circuit board assemblies focuses on solder joint fatigue. However, data on the reliability of pad cratering and predictive models on expected pad-crater propensity are scarce. Mechanical characteristics of the copper/resin interfaces and bulk resin material evolve with reflows. Pad cratering at copper-to-resin interfaces with respect to reflows has not been studied widely yet. Ten distinct bulk resin materials have been investigated to compute the evolution of bulk resin properties. Copper-to-resin interfacial samples have been tested under four-point bend loading with respect to reflow conditions. The evolution of bulk resin properties has been considered for computing the evolution of copper/resin interfacial properties. The steady-state energy release rate and Interfacial Fracture Toughness are determined for each testing condition. This research would be useful in proposing a copper/resin interface combination that is more reliable against pad cratering. Based on the data captured, a predictive regression model has been developed to predict the material combinations providing the best reliability against pad cratering.