bluuebunny/crossref_metadata_2025_split huggingface dataset:
Le désir, miroir du voyage : Une lecture des « amours » de Maxime Du Camp dans Par les champs et par les grèves
Authors: Ménager Catherine 
Published: March 2024

Par les champs et par les grèves est le récit coécrit du voyage en Bretagne entrepris par Gustave Flaubert et Maxime Du Camp en 1847. Dans les chapitres pairs, Maxime Du Camp ose évoquer ses rencontres amoureuses dans un style explicite qui aurait pu choquer son lectorat. L’évolution de son désir peut s’analyser comme une image du voyage en soi : de sa naissance à sa disparition, en passant par son apogée, avec pour perspective, un renouvellement. Ces choix prouvent que Du Camp cherchait à asseoir son statut de futur écrivain voyageur. Ils prouvent également l’influence de la poétique de Chateaubriand en matière de récit viatique telle que Jean-Claude Berchet l’a analysée. Enfin, cette étude ciblée montre que le texte de Du Camp n’est pas sans incidence sur l’œuvre de Gustave Flaubert.
Critical Care Nurses’ Moral Resilience, Moral Injury, Institutional Betrayal, and Traumatic Stress After COVID-19
Authors: Weissinger Guy M. , Swavely Deborah , Holtz Heidi , Brewer Katherine C. , Alderfer Mary , Lynn Lisa , Yoder Angela , Adil Thomas , Wasser Tom , Cifra Danielle , Rushton Cynda 
Published: March 2024

BackgroundTraumatic stress and moral injury may contribute to burnout, but their relationship to institutional betrayal and moral resilience is poorly understood, leaving risk and protective factors understudied.ObjectivesTo examine traumatic stress symptoms, moral injury symptoms, moral resilience, and institutional betrayal experienced by critical care nurses and examine how moral injury and traumatic stress symptoms relate to moral resilience, institutional betrayal, and patient-related burnout.MethodsThis cross-sectional study included 121 critical care nurses and used an online survey. Validated instruments were used to measure key variables. Descriptive statistics, regression analyses, and group t tests were used to examine relationships among variables.ResultsOf participating nurses, 71.5% reported significant moral injury symptoms and/or traumatic stress. Both moral injury symptoms and traumatic stress were associated with burnout. Regression models showed that institutional betrayal was associated with increased likelihood of traumatic stress and moral injury. Increases in scores on Response to Moral Adversity subscale of moral resilience were associated with a lower likelihood of traumatic stress and moral injury symptoms.ConclusionsMoral resilience, especially response to difficult circumstances, may be protective in critical care environments, but system factors (eg, institutional betrayal) must also be addressed systemically rather than relying on individual-level interventions to address nurses’ needs.
YTHDC1/CRM1 Facilitates m6A-Modified circRNA388 Nuclear Export to Induce Coelomocyte Autophagy via the miR-2008/ULK Axis in Apostichopus japonicus
Authors: Liu Jiqing , Shao Yina , Li Chenghua 
Published: March 2024

Abstract
N 6-methyladenosine (m6A), the most prevalent internal modification in eukaryotic RNA, was able to mediate circular RNA (circRNA) function in many immune processes. Nevertheless, the functional role of m6A-modified circRNAs in innate immunity of invertebrates remained unclear. In this study, we identified m6A-modified circRNA388 from cultured sea cucumber (Apostichopus japonicus) coelomocytes, which was mainly detected in cytoplasm after Vibrio splendidus infection. A knockdown assay indicated that cytoplasm circRNA388 promoted coelomocyte autophagy and decreased the number of intracellular V. splendidus. Mechanistically, the circRNA388 in the cytoplasm directly sponged miR-2008 to block its interaction with Unc-51–like kinase 1 from A. japonicus (AjULK) and further promoted autophagy to resist V. splendidus infection. More importantly, we found that m6A modification was vital to circRNA388 nuclear export with YTH domain–containing protein 1 from A. japonicus (AjYTHDC1) as the reader. AjYTHDC1 facilitated the nuclear export of m6A-modified circRNA388 via interaction with exportin-1 (chromosomal maintenance 1) from A. japonicus (AjCRM1). Knockdown of AjCRM1 could significantly decrease the content of cytoplasm circRNA388. Overall, our results provide the first evidence that nuclear export of m6A-modified circRNA388 is dependent on the novel AjCRM1 to our knowledge, which was further promoted coelomocyte autophagy by miR-2008/AjULK axis to clear intracellular V. splendidus.
Solder-less Fine Pitch Copper-to-Copper Bonding
Authors: Lay Nicholas , Rahim Kaysar 
Published: March 2024

The industry has been looking to increase pitch scaling through various methods. One of these methods is an alternative to solid-state solder bonding. However, very few processes can compete with solder bonding’s fast speed, low cost, and flexibility. The approach with the biggest potential for connecting fine pitch interconnects in high-density semiconductor packaging is solder-less copper-to-copper direct bonding. There are many benefits to using copper-to-copper direct bonding, including the ability to achieve ultra-fine-pitch (bump pitch 10 μm), higher reliability (both thermo-mechanically and better electromigration behavior), low resistance, as well as the lack of concern for solder hierarchy for multiple reflow. This copper-to-copper direct bonding technology enables a variety of 2.5D/3D advanced packaging architectures and is also suitable for multi-die stacking. In this study, we report the investigation of a direct copper-to-copper bonding methodology and reliability of the bonded components. Our process differs from common hybrid bonding copper-to-copper techniques, in that it is designed for low volume highly complex products. This technology allows a die-to-die and die-to-wafer process using thermocompression bonding under a deoxidizing vapor flow for direct copper-to-copper bonding. The process does not require high temperature oven annealing and can be done in a normal atmospheric environment. The investigated bonding process is ideal for high power, high thermal, high density 3D stacking and high-speed digital communication applications. We demonstrated the bonding procedure using a test vehicle with 40 μm diameter pillars and 80-μm bump pitch. We investigated the effects of bonding force and evaluated joint reliability. Interconnect/bond strength was determined through destructive shear testing and cross-sectional analysis. A scanning electron microscope was used to inspect and examine the bonded joint quality. Finally, completed assemblies were thermal cycled to evaluate degradation of joint strength under induced stress, and resistance measurements were performed to evaluate the electrical performance of the bonded copper joint.
A Comprehensive Study of Surface Finishes for High Frequency/High Speed Applications
Authors: Xu Frank , Bunce Martin , Watkowski Jim , Lifton Anna , Rangaraju Ragu Raj , Bumagat Rommel 
Published: March 2024

The introduction of 5G/6G created growing demand for faster rates of data transfer and operation at higher frequencies, pushing signals to travel towards the outer edges of conductors. Therefore, the surface finish applied over the copper circuitry is now gaining more attention. It has been previously shown that the low conductivity and magnetic properties of the Electroless Nickel (EN) layer negatively affect electrical signals as they travel along the conductor outer surfaces, leading to insertion losses. Subsequent studies show that reducing the EN thickness can offset some of the insertion losses observed, leading to a reduction in insertion losses. In more recent times “Nickel Free’ finishes, such as EPIG (Electroless Palladium - Immersion Gold, no EN) have been promoted as solutions to improving signal losses at higher frequency. Exactly how much high frequency performance these new “nickel-free” finishes by the user has not yet been fully quantified, and what are the considerations or trade-off’s for solderjoint reliability with smaller diameter solder spheres when assembled using these newer surface finishes? Comprehensive studies of signal loss, solderjoint reliability testing (ball shear, drop shock, electromigration) and other critical to quality performance data were undertaken for standard ENEPIG, Thinner EN ENEPIG’s, EPIG (no EN) as well Immersion Silver, OSP and a new Ag/Au surface finish. All surface finishes were compared across the performance requirement matrix and a Quality Function Deployment was constructed to produce a data driven tool to align surface finish performance against design needs, allowing for optimal surface finish selection for each application.
Unlocking the True Power of Additive Manufacturing for EMI Shielding
Authors: Scheibel Markus G. , Kaiser Michael P. , Balasubramaniam Sutharsan , Chernobryvko Mykola , Köszegi Julia-Marie , Dreissigacker Marc , Adler Marius , Braun Tanja , Huang Chuan I "Eric" , Li Meng "Jason" , Thomas Muriel , Vollmann Franz 
Published: March 2024

Miniaturization trends in electronic packaging led to reduced spacing of individual packages on the printed circuit boards and thus increased the overall electromagnetic interference (EMI) levels within a device. State-of-the-art conformal coatings as EMI shielding layers are typically applied via sputter technology and offer design limitations with respect to coating selectivity on individual positions of the overall package. Our new technology of additively Ag layer application via inkjet printing overcomes today’s design limitations and is key enabler for next generations packaging designs. In this study, we compare the shielding effectiveness (S.E.) on specifically designed transmission line emitter samples coated with state-of-the-art sputtered conformal layers against silver coatings applied via inkjet printing of particle free metal organic decomposition inks to evaluate the new technology for its potential on package level shielding performance. Mechanical and electrical characterization of the silver coatings indicate appropriate tools to specify layer characteristics and ensure S.E. of 40 dB or higher at frequencies of 800 MHz and higher. The suitability of our well-tailored silver coatings to match typical S.E. requirements is shown with even much thinner layer thickness as compared to state-of-the-art coatings.
Reliable Solder Columns to Replace Solder Balls in Large 2.5D Heterogeneous Packages
Authors: Hart Martin 
Published: March 2024

Solder balls are well suited for interconnecting normal sized ball grid array (BGA) components to printed circuit boards (PCB). However, solder balls are prone to cracking (failure) caused by excessive stresses inherently found in advanced packaging such as large-sized heterogeneous 2.5D packages where multiple dies are placed side-by-side. The growth trend is to make larger and larger BGA processors exceeding 60x60mm in size for AI and data centers. A plethora of new processor substrate and interposer designs are coming on line such as Chip-on-Wafer-on-Substrates (CoWoS). For that reason, more instances of solder ball delamination and cracking on large-sized BGA packages are probable. Solder columns were produced more than 50 years ago to reduce cracking in large ceramic packages, especially for use in harsh environments found in aerospace and defense applications. However, such legacy solder column technology is limited to Tin-Lead (SnPb) alloys. The challenge is to make Lead Free solder columns that satisfy demand for RoHS compliance, while still providing adequate stress relief (compliancy) for extending the operational life of large sized heterogeneous 2.5D processors for mission critical applications. This paper describes our ongoing work to innovate non-collapsible, compliant Lead-Free Braided Copper Solder Columns to reduce strain caused by the Coefficient of Thermal Expansion (CTE) mismatch between large BGA packages and FR4 PCBs. A braid, consisting of 16 fine copper alloy wires, serves as an exoskeleton sleeve around a solder column to provide mechanical support as well as compliancy. This novel solder column technology supports market trends to scale up the size of chip packaging while maintaining reliability. Our focus was to quickly characterize Lead-Free solder column core materials and braiding alloys by employing “Fail-Fast” destructive accelerated mechanical bend testing in our lab. Since there is an ongoing interest in Tin-Lead alloys, this paper also discusses data on Tin-Lead alloys for comparative purposes.
Impact of Cu Protrusion on Connection Resistance in Hybrid Bonding of Via-middle TSV Wafer
Authors: Watanabe Naoya , Yamamoto Hiroshi , Mitsui Takahiko 
Published: March 2024

In this study, we investigated the impact of Cu protrusion on the connection resistance as detailed data regarding the hybrid bonding of the via-middle through-silicon-via (TSV) wafer. After several Cu TSV wafers and Cu electrode wafers with different amounts of Cu protrusion were prepared and bonded via a surface-activated bonding method using ultrathin Si films, the connection resistance of bonded wafers (that is, the sum of the TSV, Cu electrode, and interface resistances) was evaluated via four-terminal measurements. The results demonstrate that the amount of Cu protrusion is a crucial parameter for the hybrid bonding of via-middle TSV wafers with ultrathin Si films, and an electrical connection between the TSV and Cu electrode can be achieved without heat treatment by adjusting the Cu protrusion.
Gold Coated Silver Bonding Wire and Its Consistent Reliability Performances
Authors: Murali Sarangapani , Mariyappan Dhayalan , Qing Tan Tze , Keong Loke Chee , Kumar Balasubramanian Senthil , Sungsig SS Kang 
Published: March 2024

Thermal aging of gold coated silver bonded ball with aluminium bond pads exhibited a stable interface without Kirkendall voids until 4000h at 200°C for an un-molded device tested under vacuum. Ball and stitch pull remains in strength and remained constant until 4000 hours of aging. The growth of aluminides at the bond interface is about 4.5µm for 4000 hours of aging. The electrical resistance of the bonded ball remains the same until 4000 hours at 175°C for an epoxy molded device, molded with 5 to 7 pH green epoxy molding compound containing low chlorine and sulfur. Interestingly, the bonded ball interface of epoxy molded device has sustained 480h on biased Highly Accelerated Stress Test (bHAST) at +20V bias, 130°C, 85%RH. The bonded ball interface is stable until 1000 hours on unbiased HAST (uHAST) at 130°C, 85% RH as well. Cross-sectional ovservations of the bonded balls revealed the presence of intermetallic phases at the bond interface. However, formation of Kirkendall voids or crack propagatioon due to galvanic corrosions are absent.
Optimizing Type 7 Solder Paster Formulation and Compatibility with Assembly Technology for Sub-75um System-in-Package Applications
Authors: Griffith Evan 
Published: March 2024

For System-in-Package (SiP) assembly, solder paste printing remains the preferred solder application method of choice. However, as passive components (008004) and next-generation flip-chip components continue to shrink, smaller stencil openings are needed and these small stencil apertures still need to achieve consistent printing. In addition, as component standoff height continues to decrease for fine-pitch applications, the cleanability of the final SiP build becomes a concern; for many applications which require water-soluble pastes, pure DI water becomes difficult to use when the standoff height lessens. This paper will investigate important parameters from a materials supplier’s perspective for meeting the challenges of fine-feature solder paste printing and package assembly. First, innovations in solder powder technology will be discussed which allow for consistent solder paste (Type 7) printing at 60um apertures. Next, the effect of stencil technology will be discussed. Many stencil manufacturers are approaching a manufacturing limit both with respect to stencil thinness and aperture size. This paper will discuss two common stencil manufacturing designs, laser-cut and electroform, and present findings on the effect these designs have on solder paste print consistency. Lastly, solder paste cleanability will be discussed; the results of a study investigating novel Type-7 solder pastes for use with semi-aqueous cleaning technology will be presented. Important process considerations with respect to stencil and package cleaning will also be discussed.
Tata Memorial Centre Evidence Based Management of Colorectal cancer
Authors: Saklani Avanish , Kazi Mufaddal , Desouza Ashwin , Sharma Ankit , Engineer Reena , Krishnatry Rahul , Gudi Shivkumar , Ostwal Vikas , Ramaswamy Anant , Dhanwat Aditya , Bhargava Prabhat , Mehta Shaesta , Sundaram Sridhar , Kale Aditya , Goel Mahesh , Patkar Shraddha , Vartey Gurudutt , Kulkarni Suyash , Baheti Akshay , Ankathi Suman , Haria Purvi , Katdare Aparna , Choudhari Amit , Ramadwar Mukta , Menon Munita , Patil Prachi 
Published: March 2024

Abstract
This review article examines the evidence-based management of colorectal cancers, focusing on topics characterized by ongoing debates and evolving evidence. To contribute to the scientific discourse, we intentionally exclude subjects with established guidelines, concentrating instead on areas where the current understanding is dynamic. Our analysis encompasses a thorough exploration of critical themes, including the evidence surrounding complete mesocolic excision and D3 lymphadenectomy in colon cancers. Additionally, we delve into the evolving landscape of perioperative chemotherapy in both colon and rectal cancers, considering its nuanced role in the context of contemporary treatment strategies. Advancements in surgical techniques are a pivotal aspect of our discussion, with an emphasis on the utilization of minimally invasive approaches such as laparoscopy and robotic surgery in both colon and rectal cancers, including advanced rectal cases. Moving beyond conventional radical procedures, we scrutinize the feasibility and implications of endoscopic resections for small tumors, explore the paradigm of organ preservation in locally advanced rectal cancers, and assess the utility of total neoadjuvant therapy in the current treatment landscape. Our final segment reviews pivotal trials that have significantly influenced the management of colorectal liver and peritoneal metastasis.
Neurosonograms in very preterm neonates: Findings, risk factors, and association with neurodevelopmental outcome: A retrospective study
Authors: Kurup Shyam Kumar Sasidhara , Pournami Femitha , Prithvi Ajai Kumar , Kolisambeevi Arif Abdulsalam , Panackal Anila V. , Prabhakar Jyothi , Jain Naveen 
Published: March 2024

Abstract

Background:
Neurosonogram (NSG) is a widely used, noninvasive bedside investigation in neonatal intensive care. Yet, actual data on the proportions of abnormal findings, specific conclusions, and its ability to predict outcomes are sparse. We aimed to study these aspects in very preterm infants who are a high-risk group.

Materials and Methods:
This retrospective descriptive study aimed at analyzing reports of postnatal age-specific NSG reports done in very preterm neonates, and their associations with risk factors. Follow-up information prospectively recorded by the child development services was analyzed for the association of NSG abnormalities with neurodevelopmental impairment (NDI).

Results:
Clinical and radiological details of 323 very preterm neonates were analyzed. Abnormal NSG (defined as ≥Grade 3 intraventricular hemorrhage/≥Grade 2 periventricular leukomalacia/ventriculomegaly) was reported in 42 infants (13%) at or less than term postmenstrual age; 8% of babies at ≤2 weeks postnatal age; and 12% at 36–40 weeks. Choroid plexus cyst was the most common “other” findings. Gestational age <28 weeks, chorioamnionitis, extensive resuscitation, ventilation >24 h, and culture-proven sepsis were independent risk factors for abnormal NSG in the first 2 weeks of life. Of the babies followed up, 19.25% babies had NDI. The sensitivity of any abnormal NSG was only 16% and the specificity was 91% to predict NDI. The negative predictive value of abnormal NSG for NDI was 79.5%.

Conclusion:
In very preterm, any abnormal NSG (till term postmenstrual age) was reported in 13% of very preterm. The ability to predict NDI using abnormal NSG reports has a test accuracy of 73.8%.
Main issues in penetrating keratoplasty
Authors: Alió Jorge L. , Niazi Sana , Doroodgar Farideh , Barrio Jorge L. Alió Del , Hashemi Hassan , Javadi Mohammad Ali 
Published: March 2024

Abstract:
This review explores contemporary challenges in penetrating keratoplasty (PK), focusing on technical intricacies, technological advancements, and strategies for preventing graft rejection. A systematic literature search from January 2018 to July 2023 was conducted across PubMed, Cochrane, Web of Science, Scopus, and EMBASE. The inclusion criteria comprised studies on PK and its comparison with other corneal pathologies, with emphasis on keratoconus (KC). Two independent reviewers screened studies, extracting relevant data. The review covers PK evolution, highlighting infra-red femtosecond lasers’ impact on graft shapes, minimizing astigmatism, and enhancing wound healing. Graft rejection, a primary complication, is examined, detailing risk factors and preventive measures. Preoperative considerations, diagnostic techniques for rejection, and PK in KC are discussed. Postoperative care’s significance, including intraocular pressure monitoring and steroid administration, is emphasized. The paper concludes with a comprehensive approach to prevent graft rejection, involving topical and systemic medications. An outlook on evolving monoclonal antibody research is presented. As the field progresses, personalized approaches and ongoing therapeutic exploration are expected to refine strategies, enhancing PK outcomes.
Spectral theory of the invariant Laplacian on the disk and the sphere – a complex analysis approach
Authors: Heins Michael , Moucha Annika , Roth Oliver 
Published: March 2024

AbstractThe central theme of this paper is the holomorphic spectral theory of the canonical Laplace operator of the complementof the “complexified unit circle”$\{(z,w) \in \widehat {{\mathbb C}}^2 \colon z \cdot w = 1\}$. We start by singling out a distinguished set of holomorphic eigenfunctions on the bidisk in terms of hypergeometric${}_2F_1$functions and prove that they provide a spectral decomposition of every holomorphic eigenfunction on the bidisk. As a second step, we identify the maximal domains of definition of these eigenfunctions and show that these maximal domains naturally determine the fine structure of the eigenspaces. Our main result gives an intrinsic classification of all closed Möbius invariant subspaces of eigenspaces of the canonical Laplacian of$\Omega $. Generalizing foundational prior work of Helgason and Rudin, this provides a unifying complex analytic framework for the real-analytic eigenvalue theories of both the hyperbolic and spherical Laplace operators on the open unit disk resp. the Riemann sphere and, in particular, shows how they are interrelated with one another.