Evaluation of Upscaling the Selective Electrophoretic Deposition of Reduced Graphene Oxide on Miniaturized Au Interdigital Electrodes from Chip-to Wafer-Level
Authors: Baeuscher Manuel , Henke Matthaeus , Hoeppner Katrin , Mackowiak Piotr , Schiffer Michael , Schneider-Ramelow Martin 
Published: March 2024

Today’s novel materials challenge the research industry to enhance the performance and to reduce the power consumption of microchips as well as to develop new sensor principles. All this applies pressure on the investigation of new economical mass production technologies for the integration into standard process sequences or on top of state-of-the-art CMOS devices. Since the discovery of graphene in 2004, many different variations have been investigated, thus the number of publications of graphene-based content grew from a few in 2004 exponential to 1.2 million only in 2019, according to Google Scholar analysis. The deposition of graphene-based materials at wafer-level is still difficult to do economically on standard SEMI wafers up to 8” diameter. In this publication, the selective electrophoretic deposition (EPD) of reduced graphene oxide flakes (rGO) will be shown. This technique is a very promising deposition method for large scale fabrication. The EPD of rGO particles is the only known way to create 3D surface topologies for an enhanced sensing area of electrochemical sensor applications e.g. biosensors. The electrical and chemical properties of this novel material provides a broad range of applications for possible sensor solutions [1, 2]. Firstly, the deposition will be shown on chip scale to gain optimum parameters in suspension preparation and EPD deposition time/voltage for a uniform particle deposition over the sensor area. Shortcuts from particles between the transmission lines or co-deposition on reference electrodes have to be avoided. This leads to a high selectivity in rGO particle deposition on Au-structures. Afterwards designs and experiments have been made on array level and a proof of concept wafer-level deposition with a low volume suspension is demonstrated. In previous work, the adhesion of rGO on Au structures in electrochemical sensors with a liquid flow, showed a migration of the deposited particles with the friction of the liquid [3]. Therefore, standard separation of particle agglomeration or splitting of primary particles with ultra sonic sonotrodes are not sufficient to gain highly concentrated suspensions with homogenous target particle distributions (< 0,5µm ≤ 1µm ≥ 5µm). For this reason, a novel particle crushing preparation by ball milling is introduced and enhanced selectivity with an improved adhesion is demonstrated. A full process of the preparation of the colloidal suspension with the definition of target particle sizes with an optimum zeta potential will be provided and the cathodic electrophoretic deposition shown [4, 5]. For the evaluation of the deposition experiments, stereo microscopy is used to reveal the selectivity on the interdigital electrode (IDE) structures (sensor area) and scanning electron microscopy (SEM) analysis is used to characterize particle sizes and 3D topography, in terms of primary and secondary particles (agglomerates). For this study, IDE structures with 15 different geometry variations (3µm to 15µm lines and spaces) are used that were manufactured [6] to evaluate the rGO deposition on chip level. A novel multisensory array design with eight sensing areas are presented, combined with wafer-level deposition as a proof of concept on a 200mm wafer.