bluuebunny/crossref_metadata_2025_split huggingface dataset:
Fab@Home: the personal desktop fabricator kit
Authors: Malone Evan , Lipson Hod 
Published: July 2007

PurposeSolid freeform fabrication (SFF) has the potential to revolutionize manufacturing, even to allow individuals to invent, customize, and manufacture goods cost‐effectively in their own homes. Commercial freeform fabrication systems – while successful in industrial settings – are costly, proprietary, and work with few, expensive, and proprietary materials, limiting the growth and advancement of the technology. The open‐source Fab@Home Project has been created to promote SFF technology by placing it in the hands of hobbyists, inventors, and artists in a form which is simple, cheap, and without restrictions on experimentation. This paper aims to examine this.Design/methodology/approachA simple, low‐cost, user modifiable freeform fabrication system has been designed, called the Fab@Home Model 1, and the designs, documentation, software, and source code have been published on a user‐editable “wiki” web site under the open‐source BSD License. Six systems have been built, and three of them given away to interested users in return for feedback on the system and contributions to the web site.FindingsThe Fab@Home Model 1 can build objects comprising multiple materials, with sub‐millimeter‐scale features, and overall dimensions larger than 20 cm. In its first six months of operation, the project has received more than 13 million web site hits, and media coverage by several international news and technology magazines, web sites, and programs. Model 1s are being used in a university engineering course, a Model 1 will be included in an exhibit on the history of plastics at the Science Museum London, UK, and kits can now be purchased commercially.Research limitations/implicationsThe ease of construction and operation of the Model 1 has not been well tested. The materials cost for construction (US$2,300) has prevented some interested people from building systems of their own.Practical implicationsThe energetic public response to the Fab@Home project confirms the broad appeal of personal freeform fabrication technology. The diversity of interests and desired applications expressed by the public suggests that the open‐source approach to accelerating the expansion of SFF technology embodied in the Fab@Home project may well be successful.Originality/valueFab@Home is unique in its goal of popularizing and advancing SFF technology for its own sake. The RepRap project in the UK predates Fab@Home, but aims to build machines which can make most of their own parts. The two projects are complementary in many respects, and fruitful exchanges of ideas and designs between them are expected.
A semi‐analytic approach for direct slicing of free form surfaces for layered manufacturing
Authors: Chakraborty Debapriya , Roy Choudhury Asimava 
Published: July 2007

PurposeThis paper aims to develop an efficient surface‐plane intersection (SPI) algorithm for direct slicing of free‐form surfaces to be produced by layered manufacturing.Design/methodology/approachA semi‐analytical method for direct slicing has been formulated and tested on Bezier and B‐spline surfaces commonly used in CAD modeling. This method solves for the intersection points by a “root” finding procedure and establishes their connectivity, unlike the conventional “marching” procedures.FindingsThe proposed algorithm solves intersection contours between free form surfaces and planes. The solution procedure is efficient with respect to computational time and accuracy (feature detection) over some of the conventional SPI strategies. The method involves a global solution procedure in contention with the traditional methodologies which are generally spatially distinctive in approach.Research limitations/implicationsUse of higher order terms in the representation of parametric surfaces makes the algorithm computationally intensive and time‐expensive.Practical implicationsThis algorithm would be of practical use in the direct slicing of free form surfaces used in CAD modeling. Direct slicing methods solve for the actual intersection of surface and plane without resorting to “tessellation.” Reducing the computation time and detection of features within a given resolution is of primary importance for developing commercial rapid prototyping software, which is achieved in the present paper.Originality/valueA novel method has been developed for SPI for use in direct slicing of CAD models. While a major proportion of the direct slicing strategies employ the “marching” procedure involving determination of “critical points,” the proposed method utilizes the evaluation of “roots” of a surface in a global manner to determine the intersection points with proper connectivity. Hence, it is effective in reducing the computation time and is simple but generic in approach. Although Bezier and B‐spline surfaces are used as the representative cases, the algorithm can be extended for any parametric surface for direct slicing.
The effect of message appeals countering unrealistic optimism on purchase intentions
Authors: Pornpitakpan Chanthika , Green Robert T. 
Published: July 2007

PurposeThis study seeks to examine which types of message appeals are more effective in reducing unrealistic optimism (a tendency for people to believe that they are less susceptible than others to encounter negative outcomes) and inducing purchase intentions of preemptive products in collectivist and individualist cultures.Design/methodology/approachAn experiment is conducted with 131 US, 111 Singaporean, and 127 Thai undergraduates.FindingsThe findings confirm the existence of unrealistic optimism in the marketing setting and show that: lower levels of optimism are associated with higher purchase intentions for the product; hazard‐related behavior‐priming ad appeals lead to higher purchase intentions than ads without priming; Singaporeans show higher purchase intentions than Americans for both the risk‐priming and the expert ad appeals, and they also show higher purchase intentions than Thais for expert ad appeals.Research limitations/implicationsThe samples, while well matched, consist of undergraduate students who are not necessarily representative of the populations as a whole. The samples also come from only three countries. Finally, only one product is employed.Practical implicationsThe study suggests that: external‐control/collectivist cultures may be more influenced by advertising, regardless of the appeal employed; different types of cultures may require different amounts of advertising to achieve equal levels of effectiveness; unrealistic optimism needs to be addressed by marketers of preemptive products; marketers should use ads that prime risky behaviors when promoting products for reducing/preventing undesirable outcomes/hazards.Originality/valueThe study has re‐affirmed that unrealistic optimism exists, and that this phenomenon exists internationally with respect to a relatively lower‐involvement risk product category than had previously been studied. It has unveiled relationships between optimism and purchase intentions. Finally, the study has identified both similarities and differences in terms of the existence of unrealistic optimism and the relative effectiveness of different message types across cultures.
Supply chain coordination issues: an SAP‐LAP framework
Authors: Arshinder  , Kanda Arun , Deshmukh S.G. 
Published: July 2007

PurposeSupply chain coordination is concerned with managing dependencies between various supply chain members and the joint efforts of all supply chain members to achieve mutually defined goals. There are different coordination mechanisms reported in the literature that have been discussed in isolation like information sharing, information technology, long‐term partnerships, and joint decision making which help in coordinating supply chain members. Various coordination models have been proposed considering isolated activities of the supply chain. There is a need to consider a holistic perspective of coordination in the entire supply chain. This paper sets out to analyze a case study of XYZ, a leading automotive parts manufacturer in India, to throw light on the status of coordination in its supply chain.Design/methodology/approachA situation‐actor‐process (SAP)‐learning‐action‐performance (LAP) model has been applied to analyze the case study of XYZ. The situation represents the present scenario of the organization. Actors are the participants, influencing the situation to evolve different business processes. Based on SAP, various learning issues have been analyzed which lead to suitable action followed by impact of SAP on the performance of the supply chain of the organization.FindingsVarious issues that need attention are: the type of relationship with suppliers and buyers, coordination effort with supply chain members, various mechanisms like information sharing, information technology, information systems, joint decision making, and flexibility required to adopt the above‐mentioned issues of coordination.Research limitations/implicationsThe flexible model of SAP‐LAP is used to explain soft and hard issues of supply chain coordination in a managerial context with reference to a dynamic SAP‐LAP model as applied to the case of XYZ.Practical implicationsThe flexible model of SAP‐LAP presents the situation of coordination to participants who may initiate the processes needed to be coordinated. It also helps in identifying flexibility gaps in adoption of coordination mechanisms. The synthesis of SAP leads to LAP, which bridges the gap of flexibility by suggesting improvement actions on the gaps of flexibility or the learning from the present situation, actors and processes.Originality/valueThis is a novel approach to analyze quantitative and qualitative issues of supply chain coordination in a single model comprising various perspectives on coordination, coordination mechanisms, and flexibility required to coordinate, and the impact of coordination on performance of the supply chain.
Ethnically targeted advertising: views of those not targeted
Authors: Cyril de Run Ernest 
Published: July 2007

PurposeThis paper sets out to extend current knowledge on advertising effects on those not targeted by noting unintended consequences on attitudinal, emotional, and behavioral reactions.Design/methodology/approachThis paper tests these effects based on relevant theories in the communication and advertising literature on two distinct ethnic groups (Malay and Chinese) in Kuala Lumpur, Malaysia utilizing questionnaires based on a fictitious advertisement for the dominant and non‐dominant ethnic group in Malaysia. The advertisement used was for a fictitious can of drink and its design was common in Malaysia. Data collected were analyzed using Manova, General Linear Model, and Bonferoni.FindingsThere were negative attitudinal, emotional, and behavioral reactions by those not targeted who saw these advertisements.Research limitations/implicationsOne limitation is that the study used two different advertisements, but each respondent saw only one. The advertisement was also for a fictitious product. Future research will benefit from further improvements (impact of product type or advertisement format) and replication of other ethnic groups or targeted groups.Practical implicationsA practical implication is the importance of predetermining the appropriate use of language and dominance of the targeted group. Targeted communications strategy may not be the most effective method of communicating with a specific ethnic group in a plural society.Originality/valueThe major contribution of this paper consists of the determination of negative effects of advertising on those not targeted, and the finding that the level of dominance plays a role in consumers’ reactions towards targeted advertising. The paper is of value to advertisers, researchers in advertising, and social science scientists.
An in‐depth examination of China's advertising regulation system
Authors: Gao Zhihong 
Published: July 2007

PurposeThis paper seeks to propose a framework for systematically investigating international advertising regulation; to provide an in‐depth understanding of the Chinese advertising regulation system; and to use China as a case study to examine how various global and local forces interact and negotiate the landscape of international advertising regulation.Design/methodology/approachThe paper employs historical analysis; and textual analysis to achieve its purpose.FindingsChinese advertising regulation relies largely on government regulation, and self‐regulation plays a much subdued and marginal role. The Chinese regulator aims to control the negative effects of advertising through rigorous regulation as well as certification and censorship programs, but its various advertising laws and regulations are invariably phrased in vague and general terms, so that enforcement and compliance become a major issue. The lack of autonomous trade and consumer organizations combined with minimal public participation in the system further reduces its transparency and effectiveness.Practical implicationsThe paper offers a detailed road‐map for advertising professionals to navigate the complex Chinese advertising regulation system.Originality/valueThe paper is the first English article to provide a systematic examination of Chinese advertising regulation.
Optimal wire sizing of buffered global interconnects
Authors: Tang Min , Mao J.F. , Jiang L.L. 
Published: July 2007

PurposeThis paper aims to obtain the optimal wire sizing of buffered global interconnects and to investigate the impact of weight factor on the optimized system performance for various technology nodes.Design/methodology/approachThe width and spacing of interconnects are optimized under two scenarios, and corresponding optimum line width is determined by minimizing the value of power‐delay product which is defined as a figure of merit (FOM). Based on the results, the impact of weight factor on the optimized system performance, such as delay and power dissipation per unit length, is analyzed for various technology nodes.FindingsThe analytical expressions of the optimum width are derived under two scenarios. Better FOMs can be achieved for theS=Wscenario, but the wireability of the chip degrades considerably. The optimized delay increases with the increasing of weight factor, while the optimized power dissipation decreases with it. For a given weight factor, smaller latency and less power dissipation can be achieved for theS=Wcase.Originality/valueThe analytical expressions of the optimum width of interconnects are given, and a comprehensive study of the impact of weight factor on the optimized results under two scenarios is presented.
Recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging
Authors: Zhong Z.W. , Tee T.Y. , Luan J‐E. 
Published: July 2007

PurposeThis paper seeks to review recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging.Design/methodology/approachOf the 91 journal papers, 59 were published in 2005‐2007 and topics related to wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging are reviewed.FindingsResearch on advanced wire bonding is continuously performed for advanced and complex applications such as stacked‐dies wire bonding, wire bonding of low‐k ultra‐fine‐pitch devices, and copper wire bonding. Owing to its many advantages, flip chip using adhesive has gained more popularity. Research on the reliability of lead‐free solder joints is being conducted world‐wide. The new challenges, solutions and new developments are discussed in this paper.Research limitations/implicationsBecause of page limitation of this review paper and the large number of the journal papers available, only a brief review is conducted. Further reading is needed for more details.Originality/valueThis review paper attempts to provide introduction to recent developments and the trends in terms of the topics for advanced microelectronics packaging. With the references provided, readers may explore more deeply, focusing on a particular issue.
Studies on laser ablation of low temperature co‐fired ceramics (LTCC)
Authors: Yung Winco K.C. , Zhu Jijun 
Published: July 2007

PurposeLow temperature co‐fired ceramics (LTCC) material is introduced as an excellent alternative to silicon, glass, or plastic materials for the fabrication of miniaturised analytical devices, though it is most widely used in the automotive and microwave industries. The paper aims to study the laser ablation of LTCC material.Design/methodology/approachThis kind of green tape material is mechanised by excimer laser (KrF, 248 nm) and UV laser (Nd: YAG, 355 nm), and for the first time by infra‐red laser (1,090 nm). The optical photos and the scanning electronic microscope (SEM) photos of the LTCC ablated by different kinds of laser sources are given in this paper.FindingsWhen using the UV laser, the tapered structure can be easily seen from the SEM photo. However, a kind of clear and perfect ablation of LTCC can be seen for the first time by the 1,090 nm infra‐red laser ablation.Originality/valueThe laser ablation of LTCC by optical fibre sources is discussed.
A 3.5‐GHz, low voltage, current draining folded mixer in 0.18‐μm CMOS technology
Authors: Ramiah Harikrishnan , Zainal Azni Zulkifli Tun 
Published: July 2007

PurposeThis paper sets out to design and realize a highly linear, wide dynamic range and high switching efficiency integrated CMOS up‐conversion mixer for two‐step IEEE 802.1a WLAN transmitter application in 0.18‐μm deep submicron CMOS technology.Design/methodology/approachA folded current draining low‐voltage mixer architecture is explored and an extensive simulation carried out utilizing Cadence Spectre‐RF tool in optimizing the linearity, input third‐order intercept point (IIP3), the dynamic range, 1 dB compression point (P−1dB), power dissipation and reduction of switching quadCgs, input gate‐source capacitance, in enhancing the switching efficiency of the proposed architecture.FindingsA highly linear, high input dynamic range, low voltage folded up‐conversion mixer architecture is realized in a significant comparable performance with respect to conventional reported architecture, indicating −8.87 dBm of OIP3 corresponding to 15.27 dBm IIP3 and 4.37 dBm of P−1dBin 0.18‐μm CMOS technology.Research limitations/implicationsThe optimized mixer architecture is stringent to an up‐converter application. To be utilized as a down converter at the receiver end, parameters, namely as noise figure and conversion gain, are of additional importance.Practical implicationsThe designed folded mixer architecture is in need of integration to a two‐step up‐conversion transmitter architecture which relaxes the injection pulling effect for a given low voltage headroom, with low power dissipation design.Originality/valueIn this work, an integrated folded architecture with on‐chip process, voltage and temperature compensated biasing circuit is explored and enhanced, raising awareness of adapting improved multiplier blocks in achieving optimal performance in WLAN transceiver architecture.
Thermal modeling of semiconductor devices in power modules
Authors: Ammous Kaiçar , Abid Slim , Ammous Anis 
Published: July 2007

PurposeThe paper aims to focus on the semiconductor temperature prediction in the multichip modules by using a simplified 1D model, easy to implement in the electronic simulation tools.Design/methodology/approachAccurate prediction of temperature variation of power semiconductor devices in power electronic circuits is important for obtaining optimum designs and estimating reliability levels. Temperature estimation of power electronic devices has generally been performed using transient thermal equivalent circuits. This paper has studied the thermal behaviour of the power modules. The study leads to correcting the junction temperature values estimated from the transient thermal impedance of each component operating alone. The corrections depend on multidimensional thermal phenomena in the structure.FindingsThe classic analysis of thermal phenomena in the multichip structures, independently of powers’ dissipated magnitude and boundary conditions, is not correct. An advanced 1D thermal model based on the finite element method is proposed. It takes into account the effect of the heat‐spreading angle of the different devices in the module.Originality/valueThe paper focuses on mathematical model of the thermal behaviour in the power module. The study leads to a correction of the junction temperature values estimated from the transient thermal impedance of each component given by manufacturers. The proposed model gives a good trade‐off between accuracy, efficiency and simulation cost.
Ku band response of Ag thick film microstripline to NixZn1−xFe2O4 overlay
Authors: Lonkar U.B. , Puri Vijaya 
Published: July 2007

PurposeThis paper aims to study tuning effects on thick film microstripline due to ferrite thick film overlay.Design/methodology/approachThe possibility of obtaining tuning characteristics in the Ku band microwave region in the absence of external magnetic field by a simple process of using NixZn1−xFe2O4 thick film and bulk as in‐touch overlay over Ag thick film microstripline was investigated. The microstripline is basically a non‐resonant component with high‐transmission at a large microwave frequency band. The ferrite was synthesized by precursor method and the thick films were deposited by screen printing.FindingsIt was found that tuning characteristics were observed and composition, thickness and precursor dependent changes occurred. The changes with composition are more prominent in the 14.5‐16.5 GHz range. Also, the ferrite thick film overlay produces a deep notch at 15.7 GHz. It is observed that the pellet overlay also makes the microstripline very dispersive with a high‐insertion loss in the 16‐17 GHz range. The presence of permeability‐related effects interfering with the normal propagation of the microstrip circuits might be causing the changes in the circuits.Originality/valueOwing to the NixZn1−xFe2O4 overlay the simple microstripline can be tuned to have narrow band filter type of characteristics. Thick film NixZn1−xFe2O4 overlay gives the added advantage of planer configuration along with cost‐effectiveness in the absence of magnetic field.