bluuebunny/crossref_metadata_2025_split huggingface dataset:
Thin Film Al‐Al2O3‐Al Capacitors With Dielectric Layer Formed at400℃
Authors: Osadnik S. J. , Berlicki T. 
Published: June 2007

A comparative study is made of Al2O3 layers formed at 400℃ in molten
KNO3 and Al2O3 formed at room temperature in a common solution of ammonium pentaborate in ethylene glycol. At 400℃ and constant current
(0.5 mA/cm2 ) the linear anodization range is limited to 2.7 V by scintillation and local oxide breakdowns.
Nonporous 200 Å thick (0.4 μF/cm2) oxide layers were produced at 2.0 V (400℃) and 8 V (20℃). Electron
diffraction indicated a γ‐Al2O3 structure at an anodization temperature of 400℃ and amorphous structure at
room anodization temp. The initial values of tan δ were 100  ·  10−4  ±  40  ·  10−4 and 400  ·  10−4  ±  200  ·  10−4
respectively.Capacitance and tan δ measurements during accelerated life test indicated that the films produced at 400℃ are
not superior to those formed at room temperature. In both cases a diffusion of metal at the metal‐oxide interface
seems to be the main ageing mechanism.The internal electrical field measured by the C‐V method was unchanged in γ‐Al2O3 layers during the life test.
Stencil Screens for Fine‐Line Printing
Authors: Stalnecker, Stewart G. 
Published: June 2007

During the past decade, the thick film process has become a viable technology for the production of numerous
varieties of electronic circuits. Improvements in the quality of the substrates, the thick film inks, and the
manufacturing equipment have all been significant. In addition, the quality of the stencil screens has also been
improved to aid the process. New types of mesh material, improved emulsion systems and better control of the
screen parameters have all been realized. These refinements in the screen making materials and processes have all
contributed to the feasibility for printing complex resistor and conductor networks, hybrid circuits, multilayer
arrays, and sophisticated watch and display patterns.This paper will present the critical parameters of the screen mesh materials and compare the characteristics of
the screen mesh materials and compare the characteristics of the nylon, polyester, stainless steel and metalized
polyester fabrics. A new fine‐wire 325 mesh stainless steel will be discussed and the significant impact on the
technology of fine‐line printing will be illustrated. In addition, recent developments in screen emulsions will be
offered and pictures of fine‐line patterns will be shown.
Application of Conductive Adhesives in Microcircuits for “Long‐Life” Equipment
Authors: Kooring C. W. L. , Riphagen D. 
Published: June 2007

The results of a study of the application of conductive adhesives for attaching semiconductor chips to thin film Au
conductors is presented.The study concentrates on measuring the stability of the electrical conductivity of adhesive bonds for
semiconductor chips.Four types of conductive bonding agents and two types of semiconductor back metallization were tested at
raised temperatures for up to 10,000 hours.
Tape Automated Bonding for High Density Packaging
Authors: Kurzweil Karel 
Published: June 2007

High density packaging of semiconductor devices is necessary for high performance in compact electronic systems.
But the assembly technology must also remain cost attractive.Through the development efforts conducted during the past years in the world, the Tape Automated Bonding –
TAB – has become the assembly technology allowing a very high density packaging. In combination with substrate
technology it has grown into a complete, cost effective, micropackaging concept.The paper describes the main technical characteristics of this packaging concept. Specific equipments for TAB
were designed and built by CII‐Honeywell Bull for installation in the factory. These equipments are not only those,
directly related to the TAB technology processing steps but include also other equipments like high precision thick
film printer.The main features of the new micropackaging facility are also presented. Some examples of high density packages
built with tape automated bonding are described and some of the main quality and reliability aspects are discussed.
Possibilities for Air Fireable Base Metal Conductors
Authors: Stein S. J. , Huang C. , Cang L. 
Published: June 2007

This paper discusses the status of thick conductive films formed by firing in air. The metals under study include nickel,
chromium, aluminum and copper. The properties of the films are presented for firing temperatures ranging from 580
to 850 degrees C. Compatibility with various dielectrics and glasses have been studied. Multilayer wiring seems
promising. Potential uses on porcelain enamelled steel, window glass and alumina substrates seem feasible.Initial studies have been made of compatibility with thick film ruthenium‐based resistors. Some preliminary
information on termination resistance and other properties observed in such combinations is presented.Possible applications in gas discharge displays for cathodes and conductor runs are discussed. Potential uses may
include economical ground planes, solar cell electrodes, varistor and thermistor terminations, and resistance
thermometers.
A Thick Film Hybrid IC Amplifier for Industrial Use
Authors: Tosaki Hiromi , Ikegami Akira , Okayama Tsutomu , Matsuoka Yoshitaka 
Published: June 2007

Electronic circuits for industrial uses must satisfy the following requirements: low sensitivity to changes in the
surrounding temperature, high reliability, and small size. In the amplifier for a pressure transmitter described here, the
temperature dependences of its properties, Zero point and Span, are intensively influenced by TCRs of the resistors
used, and by a mismatching of the temperature dependences of the off‐set voltages between the two operational
amplifier IC chips. As forthe thick film resistors, it has been cleared that the DuPont 1700 series resistor pastes are
the most suitable:TCRs of less than +80 ppm/°C can be attained, and the change in resistance of the overglazed and
laser trimmed resistors is less than +0.1% after 5000 hours at 200°C. As for the operational amplifier IC chips, their
temperature dependences of the off‐set voltages are checked individually, utilizing a ceramic carrier containing an
operational amplifier IC chip. Then a pair of ceramic carriers, with a minimum mismatching of their temperature
dependences, is mounted on a thick film circuit substrate by a Pb/Sn solder reflowing. The various transistor chips are
divided into three functional blocks, and bonded into three ceramic carriers. Utilization of ceramic carriers in all active
devices employed results in sufficient standardization in the characterization of the semiconductor devices and in the
hybridizing process.In the thick film hybrid IC amplifier for a pressure transmitter thus developed, the temperature dependences of
Zero point and Span are less than –0.5% FS/100°C, respectively. The drifts of Zero point and Span are less than
±0.1% FS in the period of 3000 hours of an operating test with DC 24 V loading at 100°C.
An Interactive Design System for Hybrid ICs
Authors: Shiraishi Hiroshi , Kawamura Kaoru , Hayashi Masaaki 
Published: June 2007

In hybrid integrated circuit mask design, the design quality largely depends on the designer′s experience and
creativity. It is difficult to completely automate the design process as is done with LSIs or printed circuit boards. It is
important to incorporate flexibility into the system.This paper describes an interactive design system for laying out hybrid ICs. The system is implemented on a large
host computer, and graphic display terminals are connected to it in a time sharing environment. The system provides
designers with many interactive facilities which are useful in designing hybrid ICs. In addition to highly interactive
dialogue, the system has capabilities such as dynamic checking of the designer′s operations against a set of design
rules, or automatic generation of standardized element patterns.The system outputs mask information, design documents and so on which are used in the CAM of hybrid ICs. The
system is being used at Fujitsu and is contributing to high reliability of the design, and shortening the design period.
Multi‐Layer 2 Mil Line Technology
Authors: Saito Tamio , Fukumoto Yoshikatsu 
Published: June 2007

Multi‐layer 2 mil line technology has been increasingly required for VLSI and very high speed logic devices. This
technology makes it possible to shorten the length of interconnection lines between VLSI silicon chips. Thus the signal
propagation delay on the transmission lines can be minimized.Multi‐layer 2 mil line technology research history, the new method and usages are discussed in this paper.
Defect Density and Electrical Properties of Vacuum Evaporated Copper Films From Annealing Studies of Electrical Resistance
Authors: Narayandas K. , Radhakrishnan M. , Balasubramanian C. 
Published: June 2007

Copper films (210 – 1650 Å) were deposited onto glass microslides by vacuum evaporation. The films were subjected to heat treatment at a constant rate and the variation of electrical resistance with temperature was measured. The defect density and activation energy were calculated for different thicknesses from the knowledge of the change in electrical resistance with temperature and time. The defect density, F0 (E)max, varies from 17.2 to 6.05 μΩ•cm eV−1 in the thickness range 210 – 1650 Å whereas no appreciable variation in the activation energy is observed.Thickness dependence of resistivity and temperature coefficient of resistivity (TCR) were studied in the above thickness range and the bulk resistivity and TCR were found to be 1.75 μΩ•cm and 5.5 × 10−3 K−1 respectively. Assuming the scattering coefficient to be zero, the mean free path of conduction electrons was estimated. From the knowledge of the bulk resistivity and mean free path, the Fermi surface area and the effective free electron density per atom were evaluated as 21.86 × 1016 cm−2 and 0.92 respectively.
Aging Degradation of Ni and NiCr‐Ni Thin Film Conductor Systems
Authors: Gorecka-Drzazga A. , Muszynska D. 
Published: June 2007

In this paper an experimental procedure for the evaluation of the Ni and NiCr‐Ni new low cost conductor systems is described. The possibility of an application of these conductor systems as a contact material for thin film resistors has been examined. A special test pattern with intermittent pattern resistors and meander patterns of conductor and resistive material was applied. The quality of thin film resistor contacts is defined by the constancy of their electrical and physical properties during exploitation. Following the R.T. Galla distributed parameter analysis model the calculation of the aging degradation of the Ni and NiCr‐Ni conductor systems has been carried out.Considering the degradation values it seems that the Ni one‐component conductor system is superior to the NiCr‐Ni two‐component system. From this investigation we can conclude that the quality of studied conductor systems is satisfactory in applications where corrosion resistance is not critical.
The Effect of Sequential Heat Treatment on Resistance and Temperature Coefficient of Resistance (TCR) of NiCr Thin Films
Authors: Stepien B. , Wojtczak K. 
Published: June 2007

Measurements have been made of resistivity as a function of temperature in the range 290 to 600°K for vacuum deposited NiCr thin films subjected to different heat treatments in air.While the films prior to heat treatment exhibit a negative TCR in the range 290 to 390°K, after heat treatment the TCR becomes positive and almost constant, in the temperature range 290 to 600°K. The TCR increases when further sequential cycles of heat treatment are applied.
An Inexpensive Diffusion Furnace
Authors: Haskard M. R. , Bannigan J. 
Published: June 2007

The paper describes the design of a low cost diffusion furnace suitable for monolythic circuit manufacture in
educational and other establishments, where throughput is small. Features include maximum temperature of
1300℃, direct reading set temperature dial, flat zone 55 mm and an idle temperature of 420℃ when the
furnace is not in use.Four such furnaces have been in operation at the School of Electronic Engineering, South Australian
Institute of Technology, each for a twelve month period and have given trouble free operation.
PFA-100 closure times in preoperative screening in 500 pediatric patients
Authors: Roschitz Birgit , Thaller Sigrid , Koestenberger Martin , Wirnsberger Andrea , Leschnik Bettina , Fritsch Peter , Muntean Wolfgang 
Published: June 2007

SummaryThree to five percent of patients undergoing surgery have either an acquired or congenital platelet defect or von Willebrand disease (vWD). The predictive value of preoperative coagulation screening is questionable. PFA-100 is now routinely used in preoperative screening in our pediatric outpatient service. We wanted to assess whether the PFA-100 would help to identify patients with primary haemostatic defects or if the additional use of PFA-100 would add to the problem of unnecessary pathologic preoperative laboratory values resulting in delay of surgical procedure. We investigated 500 children consecutively seen in our outpatient service before surgery. Blood cell count, aPTT, PFA-100 closure times (CT) were done in all patients. If abnormalities were found, the patient was presented to a haemostatic expert. vWF:AG, R:Cof and factorVIII were analysed in all patients with prolonged closure times and APTT values. One hundred twenty-six patients (25.2%) showed abnormalities in APTT and/or PFA-100. Further investigations in 89 of these 126 patients did not yield a specific diagnosis; neither diagnostic criteria for impaired haemostasis were found by questionnaire. None of these 89 patients had a bleeding complication during surgery. Forty-eight patients showed prolonged CTs. Twelve patients with low vWF:AG were detected, 10 of these patients were found by PFA-100. Four of these patients did present with normal APTT values. Our study shows that similar to the APTT the PFA-100 is probably only a good screening method when a haemostatic defect in a patient is clinically likely, especially to screen forVWD, and the test should not be used in general unselective screening.
Lack of urokinase plasminogen activator promotes progression and instability of atherosclerotic lesions in apolipoprotein E-knockout mice
Authors: Dellas Claudia , Schremmer Carmen , Hasenfuss Gerd , Konstantinides Stavros , Schäfer Katrin 
Published: June 2007

SummaryUrokinase plasminogen activator (uPA) is strongly expressed in atherosclerotic lesions, but the overall effect of the protease on plaque composition and growth remains controversial. In the present study, apolipoprotein E-deficient (apoE-/-) mice were intercrossed with mice which were lacking the uPA gene (doubleknockout; DKO). In ferric chloride-induced carotid artery lesions in chow-fed mice, uPA deficiency increased neointimal size (P=0.015) and luminal stenosis (P=0.014), while reducing media thickness (P=0.002). A lack of uPA also increased the size of and the luminal obstruction from atherosclerotic plaques at the coronary and brachiocephalic arteries of apoE-/- mice. Plaques were characterised by a higher fibrinogen/fibrin content and a decrease in cellularity and collagen content. When apoE-/- and DKO mice were analysed as a single group, a significant correlation was found between the α-actin (smooth muscle cell) and collagen content of atherosclerotic lesions (r = 0.554; P<0.05), and a negative correlation existed between the α-actin and fibrin/fibrinogen immunopositive area (r = –0.791; P<0.001). Further analysis of brachiocephalic atherosclerosis, a predilection site for plaque rupture in the apoE-/- mouse, revealed signs of plaque vulnerability, including a reduced cap-to-intima ratio (0.21 ± 0.04 vs. 0.37 ± 0.05; P=0.03) and more frequent detection of intraplaque haemorrhage (56% vs. 13%; P<0.01) and buried fibrous caps (1.8 ± 0.5 vs. 0.5 ± 0.2; P=0.02) in DKO compared to apoE-/- mice. These results indicate that, at least at (patho)physiologic concentrations, uPA is essential for maintaining the cellularity and collagen content and, possibly, the stability of lesions, both by preventing excessive intramural fibrin accumulation and by facilitating cell migration and invasion.
The effect of dalteparin on coagulation activation during pregnancy in women with thrombophilia
Authors: Abou-Nassar Karim , Kovacs Michael , Kahn Susan , Wells Philip , Doucette Steve , Ramsay Tim , Clement Anne Marie , Khurana Rshmi , MacKinnon Karen , Blostein Mark , Solymoss Susan , Kingdom John , Sermer Matthew , Rey Evelyne , Rodger Marc ,   the TIPPS investigators
Published: June 2007

SummaryLow-molecular-weight heparin (LMWH) is increasingly being used for prophylaxis of venous thromboembolism (VTE) and prevention of pregnancy associated morbidity in pregnant women with thrombophilia. We sought to determine if the administration of prophylactic doses of LMWH downregulates coagulation activation in high risk pregnant women with thrombophilia. This sub-study was planned as part of a randomized open label controlled trial (Thrombophilia in Pregnancy Prophylaxis Study[TIPPS])in which patients at high risk of pregnancy complications with confirmed thrombophilia are randomized to receive either dalteparin (5,000 units/day until 20 weeks then 5,000 units q12h until 37 weeks or onset of labor) or no treatment. Blood samples were collected at baseline, day 7–9 (after starting study drug), week 20 (before increasing study drug), week 36 (prior to stopping study drug) and at the time of admission to the labor and delivery unit. Samples were not drawn at fixed times in relation to drug injection. These samples were analyzed for levels of thrombin-antithrombin complexes (TAT), prothrombin fragments 1+2 (F1.2), D-dimer and anti-Xa activity. Generalized linear mixed models were used for statistical analysis and model results were controlled for age, smoking status, type of thrombophilia and predisposing risk factors. The effect of dalteparin onTAT levels was defined as the primary outcome. Of 198 patients eligible, 114 were enrolled in TIPPS. Ninety-one were eligible for the TIPPS coagulation activation sub-study and randomized. Thirty-nine patients were analyzed in the treatment group (dalteparin) and 46 patients in the control group (no intervention). Levels of coagulation activation factors F1.2, TAT and D-dimer increased significantly throughout pregnancy in both groups (p<0.0001). Dalteparin prophylaxis resulted in a significant increase in anti-Xa activity through pregnancy (p<0.0001) compared to controls. Dalteparin had no significant effects on the levels of TAT, F1.2 and D-dimer throughout pregnancy in thrombophilic women.A post-hoc Monte Carlo power analysis revealed that our study had 100% and 88% power to detect reductions in TAT values on treatment of 50% and 25%, respectively. Prophylaxis with dalteparin at doses used in this study did not reduce coagulation activation in high risk thrombophilic women during pregnancy.
Monitoring direct thrombin inhibitors with a plasma diluted thrombin time
Authors: Love Jason , Ferrell Chris , Chandler Wayne 
Published: June 2007

SummaryActivated partial thromboplastin time (aPTT) monitoring of direct thrombin inhibitors (DTIs) is vulnerable to interference from many sources. If the baseline aPTT is prolonged, as occurs with lupus inhibitors, alternative methods are required to monitor DTI levels. We compared the plasma diluted thrombin time (1:4 dilution of patient plasma with normal plasma) and the aPTT in patient samples spiked with argatroban, bivalirudin, or lepirudin at three concentration levels. Each drug was spiked into five samples with lupus inhibitors, five samples with deficient vitamin K-dependent factors, three samples with elevated D-dimers, and eight samples with normal baseline aPTT values. The aPTT overestimated the spiked DTI concentration in all samples with lupus inhibitors, low levels of vitamin K-dependent factors, and elevated D-dimers. In samples with normal baseline aPTTs, the aPTT failed to correctly estimate the spiked drug concentration in four of 24 samples spiked with argatroban, seven of 24 spiked with lepirudin, and three of 24 spiked with bivalirudin. The plasma diluted thrombin time was not affected by lupus inhibitors, low vitamin K-dependent factor levels or elevated D-dimer levels and correctly estimated the spiked drug level in 63 of 63 samples spiked with argatroban, 63 of 63 samples spiked with bivalirudin, and 62 of 63 samples spiked with lepirudin. In conclusion, the plasma diluted thrombin time appears to be a viable alternative to the aPTT for monitoring DTI levels, especially in patients with lupus inhibitors or low levels of vitamin K-dependent factors.
Clinical implications of gene polymorphisms in venous leg ulcer: A model in tissue injury and reparative process
Authors: Gemmati Donato , Zamboni Paolo 
Published: June 2007

SummaryWound healing is a multi-step process involving complex pathways at cell and molecular level. Lack of understanding of the molecular mechanisms and pathogenesis of impaired healing in chronic leg ulcers limits clinical assessment and management. In addition, individual genetic background certainly affects the response to treatment and specifically modulates the unfavourable lesion environment.Although the number of actors involved in the aetiology of chronic wounds is extremely high, the ability to find out groups of candidate genes on the basis of clinical and physio-pathological findings is a crucial step.The present review demonstrates how recognition of functional gene variants, mostly single nucleotide polymorphisms (SNPs), significantly involved in wound healing and venous ulcer establishment, extra- ordinarily helps prognosis, diagnosis and treatment of chronic wounds.We deal with on how one can manage SNPs in coagulation factor XIII (FXIII) and hemochromatosis (HFE) genes as molecular markers or prognostic tools. In this fashion, we could pave the way for strategies aimed to single out in advance categories of patients at increased risk to develop severe complications of chronic venous disorders, or to predict the healing time after surgical intervention. Because of its relevant epidemiology and its easily visualized lesions, venous leg ulcer is an ideal model for investigating, the mechanisms of tissue injury and reparative process,as well as the influence of different genetic backgrounds.
Heparin induces mobilization of osteoprotegerin into the circulation
Authors: Brodin Ellen , Sveinbjörnsson Baldur , Hansen John-Bjarne , Vik Anders 
Published: June 2007

SummaryHeparin treatment may induce osteoporosis by an unknown mechanism. Osteoprotegerin (OPG), a glycoprotein with a heparin-binding site, is a decoy receptor for RANKL which is responsible for osteoclast development.The objective was to investigate the effect of unfractionated heparin (UFH) and low-molecular-weight heparin (LMWH; dalteparin) on plasma levels of OPG.Twenty-two male students were allocated to the following treatment regimens; A) one bolus of 5,000 IU UFH iv followed by infusion of 450 IU/kg/24 h for 72 hours (n=7), B) sc administration of LMWH (200 IU/kg) once daily for 72 hours (n=8), C) sc administration of 100 IU/kg LMWH once (n=8), D) sc administration of 250 IU/kg UFH once (n=7), E) control infusion of saline for 12 hours (n=7). UFH boluses of 5,000 IU were given 4 and 24 hours after cessation of regimens A and B. Bolus injection of UFH iv caused a prompt increase in plasma OPG from 0.68 ng/ml (SD=0.09) to 1.13 ng/ml (SD=0.30) (p=0.003) which declined during the continuous UFH infusion and reached baseline values after 8 hours (regime A). Similar increases in plasma OPG was obtained by repeated UFH boluses after cessation of treatment. Subcutaneous administration of LMWH (200 IU/kg) caused a modest, but significant (p=0.002) increase in plasma OPG similar to the mobilization by 250 IU/kg UFH sc, but the LMWH treatment caused a three-fold higher anti-Xa activity (p<0.001). We conclude that UFH causes a more pronounced vascular mobilization of OPG than LMWH, indicating that UFH has a higher affinity for OPG than LMWH.