bluuebunny/crossref_metadata_2025_split huggingface dataset:
Glass Devices for Next-Generation Packaging and RF Signal Conditioning
Authors: Flemming Jeb H. 
Published: February 2024

The push for higher communications frequencies, greater system integration, and smaller space imparts many unique challenges on RF and packaging engineers in the development of next generation cellular products for 5G, WiFi 6, Military, and other applications. Traditional materials, such as LTCC, organic laminates, and silicon face major limitations to dramatically improve system size, weight, and performance (SWAP). Photosensitive Glass-Ceramics (PSG) have gained a lot of attention as a next generation RF and RF packaging substrate for their ability to simultaneously solve these two important challenges. In this paper the authors will present on our work using PSG for RF and RF packaging solutions. We will share (1) the advantages of using PSG for advanced RF packages, and (2) our work demonstrating glass as an RF substrate integrating discrete components and embedded die for passive RF filters, and (3) our work towards building vertically stacked glass packages for advanced RF systems-in-package (SiP). The described work presents a manufacturing platform for the production of vertically stacked glass substrates with integrated high Quality Factor passive devices, such as inductors and capacitors, and heterogeneously integrated surface mount devices for advanced RF systems-in-package. The presented material demonstrates a production and assembly process for the manufacturing of advanced systems. In this paper, we present design, production, assembly considerations that impact size, weight, and performance (SWAP) metrics for a variety of product definitions and multiple simulation vs. product testing to demonstrate a reliable design to product flow.
Development of Electronic Packages with Integrated Environmental Mitigation
Authors: Rudd Carl , Bond Artie , English Brian , Hamlin Benoit , Adams Mark , Dean Robert 
Published: February 2024

This paper demonstrates the techniques to integrate environmental protection into large format ceramic chip carriers using agile manufacturing techniques. Electronics packaging is critical for protecting integrated circuits and MEMS devices from austere environments. Typically, protecting packaged devices and circuit boards adds significant size to an assembly. Incorporating environmental mitigation strategies within the packages can reduce the total system size. In this effort, we developed a multi-faceted strategy to vibration, thermal, RF, and radiation interference with packaged chip. This effort included development of a thermomechanical isolation platform and RF shielding designs compatible with agile manufacturing methods (e.g., additive manufacturing). Shielding design evaluated materials to block external RF or radiation damage. Thermal isolation and vibration stress control was demonstrated using a suspended interposer. Lastly, ceramic demonstrator packages were printed using stereolithography, and were shown to survive high heat environments via heating with a 2000°C torch. Collectively, these results show that it is possible to provide environmental protection to essential chip and sensors within the package itself, reducing the volume needed for integration into flight systems. Furthermore, EngeniusMicro and partners have done so in using methodologies that allow for their production on-demand, both domestically and at the point-of-need.
Incorporating Hierarchical Construction for Advanced IC Packaging
Authors: Cone Chris , Hudson Ed 
Published: February 2024

Advancements in IC packaging manufacturing have given rise to the growing trend disaggregating large SoC into smaller die/chipets. This significantly raises the barrier for IC package designers with increasing design complexity and exploding pin counts. Trying to employ traditional package design solutions – where each device is modeled as a single flat entity – is time consuming and unnecessarily risks delaying production. In this paper, we present a new approach IC package floor-planning using hierarchical device modeling system assembly. The key benefit of adopting hierarchy inside of a design is clear – a seemingly large and complex design can be disaggregated into smaller and easier to manage building blocks based on collection attributes such as function and position. In IC packaging there are two key classes of design structures which lend easily to disaggregation. These are die-to-die signal interfaces and power distribution networks. Die to die signal interfaces are implemented as uniform signal bump collections placed at least twice in the system but usually used several times to link several dies. Similarly, power distribution networks typically replicated in several regions of the system design and the bump assignment often assigned to meet a specific physical implementation such as checker-board bump pattern for a two-layer power ground mesh. These design structures can in turn be placed or arrayed in various combinations to create larger composite building blocks in the full design assembly. Yet unlike in IC design, the key challenge with adopting hierarchical device modeling in IC packaging is that the top-level floorplan demands a unique signal connectivity definition regardless of the placement hierarchy. While there are brute force methods of doing this such as performing manual connectivity edits to add prefixes of suffices to the top-level signal, these are time consuming and error prone – particularly when design updates are required. To properly address the top-level connectivity, this paper introduces a novel method to assign connectivity based on topological pin regions defined over bump collections which can then be used to automatically define the top-level connectivity bump based on system attributes such as the parent instance and region names. Using topological pin regions in hierarchical construction allows design updates at the building block level to instantly propagate to the full design. Package designers need to employ all tools available to address the significant device complexity and an explosion in pin count in today’s IC packaging designs. Through hierarchical device modeling construction with topological region-based connectivity, we highlight that large and seemingly complex designs are easily broken down into easily manageable building blocks.
Advanced Packaging Capabilities at Intel
Authors: Sotir John 
Published: February 2024

Heterogeneous Integration (HI) is undeniably the vehicle to drive continued advances in Compute and Communications. Advanced Packaging Architectures today provide unprecedented levels of Heterogeneous Integration in Client, Server and Discrete Graphics. Intel committed to a vision of developing heterogeneously integrated leadership products using advanced packaging technologies to match the functionality of a monolithic SOC and more….. We continue to scale our Advanced Packaging Technologies Roadmap. Federal Engagements in multiple programs (e.g. SHIP) allowing Intel to drive design and prototype diverse configurations for U.S. Government / and Defense Industrial Base; USG/DIB partnering critical for HI advancements.
Reshoring Advanced Packaging to Enable Modernization Activities
Authors: Smelker Tom 
Published: February 2024

Globalization has migrated Advanced Packaging to the Pacific Rim for decades. Current geopolitics is driving instability in the region and increasing the risk of access to leading edge microelectronics and packaging capabilities. This has created substantial risks to western countries as they strategically modernize. At the same time, Advanced Packaging is more critical in solutions as we transition to Heterogeneous Integrated (HI) architectures enabling processing to move to the sensor.
Heterogeneous Integration of Chiplets, Lego-like IP for More than Moore
Authors: Felton Keith 
Published: February 2024

The semiconductor industry is facing an inflection point as higher cost, lower yield, and reticle size limitations drive the need for viable alternatives to traditional monolithic solutions, which are hitting or coming close to the limits of manufacturing and physics. This is driving an emerging trend to disaggregate what typically would be implemented as an SoC into solid, fabricated IP blocks, otherwise known as chiplets. These chiplets typically provide a specific function implemented in an optimal chip process node. Several chiplets and an optional, custom SOC device mounted and interconnected in a single packing using high speed/bandwidth interfaces that will then deliver monolithic or greater performance at a reduced cost, higher yield, and with only a slightly larger area as a heterogeneous integrated advanced package. As fabless semiconductor companies begin to bring these disaggregated chiplets to market, their successful adoption requires the fabless semiconductor industry to standardize on a set of interface protocols that will offer Lego-like plug and play compatibility between different suppliers chiplets creating a truly open ecosystem and supply chain. When it comes to the physical heterogeneous integration of these chiplets it is typically achieved using a high-performance silicon-like interposer substrate. Such substrates typically require silicon-like design rules and design techniques along with their own specific analysis and verification requirements. The supply chain for these substrates does not change significantly, it is still typically the leading semiconductor foundries and OSATs however the level of interaction, requirements, and signoff approvals does change bringing often new demands and challenges. Is this a revolution or an evolution, it depends on your starting point? Does it need an entirely new set of workflows and design tools? Can we evolve in some stepwise linear process from where we are today with monolithic or traditional system-in-package type designs into this next-generation design environment? This paper will explore these new challenges and outline 5 key workflows that address and manage them. These 5 workflows span interlinked domain areas starting with architecture definition before progressing to design that incorporates planning, prototyping, and technology co-optimization of the chosen architecture as well as the detailed physical implementation of substrates before moving to multi-physics analysis, device-level test, and then manufacturing. This paper will then recommend workflow adoption focus areas that we have seen provide immediate heterogeneous integration capability benefits while providing a managed methodology adoption and migration process that minimizes disruption, risk, and of course cost that can bring heterogeneous integration based chiplet design within reach of the mainstream instead of only being accessible to the mega iDMs and fabless semi’s.
Genetic diversity of the S-type small subunit ribosomal RNA gene of Plasmodium knowlesi isolates from Sabah, Malaysian Borneo and Peninsular Malaysia
Authors: Chong Eric Tzyy Jiann , Neoh Joveen Wan Fen , Lau Tiek Ying , Chua Kek Heng , Lim Yvonne Ai-Lian , Lee Ping-Chin 
Published: February 2024

Objective:
To determine the genetic diversity of Plasmodium (P.) knowlesi isolates from Sabah, Malaysian Borneo and Peninsular Malaysia, targeting the S-type SSU rRNA gene and including aspects of natural selection and haplotype.

Methods:
Thirty-nine blood samples infected with P. knowlesi were collected in Sabah, Malaysian Borneo and Peninsular Malaysia. The S-type SSU rRNA gene was amplified using polymerase chain reaction, cloned into a vector, and sequenced. The natural selection and haplotype of the S-type SSU rRNA gene sequences were determined using DnaSP v6 and illustrated using NETWORK v10. This study's 39 S-type SSU rRNA sequences and eight sequences from the Genbank database were subjected to phylogenetic analysis using MEGA 11.

Results:
Overall, the phylogenetic analysis showed no evidence of a geographical cluster of P. knowlesi isolates from different areas in Malaysia based on the S-type SSU rRNA gene sequences. The S-type SSU rRNA gene sequences were relatively conserved and with a purifying effect. Haplotype sharing of the S-type SSU rRNA gene was observed between the P. knowlesi isolates in Sabah, Malaysian Borneo, but not between Sabah, Malaysian Borneo and Peninsular Malaysia.

Conclusions:
This study suggests that the S-type SSU rRNA gene of P. knowlesi isolates in Sabah, Malaysian Borneo, and Peninsular Malaysia has fewer polymorphic sites, representing the conservation of the gene. These features make the S-type SSU rRNA gene suitable for comparative studies, such as determining the evolutionary relationships and common ancestry among P. knowlesi species.
Social Media and Urticaria - A Data Audit of Facebook®, LinkedIn®, and Twitter® Posts
Authors: Mondal Himel , Dhabal Arunima , Mondal Shaikat , Podder Indrashis 
Published: February 2024

Abstract

Introduction:
Urticaria is a common debilitating dermatological disorder impairing a patient’s quality of life. Such patients are increasingly using socialmedia to manage their health and interact with peers, particularly during the ongoing COVID-19 pandemic.

Objectives:
To explore and analyse the quality of urticaria related social-media information available to patients.

Materials and Methods:
An in-depth data audit of the three most commonly used social networks viz. Facebook®, LinkedIn®, and Twitter® were done on a single day, as posts may change or lose relevance over time. The word “urticaria” was searched on three social media, and the first 100 posts in each were further analysed. The post-creator was either categorised as “individual” or “group”, and non-English posts were excluded. All types of posts have been analysed, including text, images, video, and website links. We also collected the comments/replies, share/re-tweet, and likes on the posts.

Results:
Among the total 300 social-media posts, the highest number of “individual” posts was on LinkedIn® followed by Twitter® and Facebook® (χ2 = 82.86, P < 0.0001). Regarding thematic content, most Facebook® posts discussed disease symptoms, followed by the promotion of journal or blog posts, and discussion about causative and triggering agents. LinkedIn® was primarily used for the promotion of journal articles or blog posts, followed by educational webinars and urticaria treatment stories. Twitter® users mostly interacted with peers about their urticaria symptoms and perceived etiologic and triggering factors. Regarding the type of post, images were maximally shared on Facebook®, while video/video links and web links were highest on LinkedIn® (χ2 = 21.59, P < 0.0001).

Conclusion:
The overall quality of urticaria related information on these 3 social media platforms is satisfactory for patients. Dermatologists may consider utilising social media to further educate such patients and improve the overall treatment outcome. The use of such networking channels will continue to grow, as communication remains crucial for urticaria management.
The Significance of Eosinophil-to-Lymphocyte Ratio in Predicting Response to Omalizumab Treatment in Patients with Bullous Pemphigoid: A Case Series
Authors: Akin Gülfem , Avci Ceylan , Akarsu Sevgi 
Published: February 2024

Abstract
Omalizumab, a monoclonal anti-IgE antibody, has been used off-label in a few case series of bullous pemphigoids (BPs) with rapid efficacy and high safety profile. However, there is a lack of data to select patients who would get the most therapeutic benefit from omalizumab therapy. To assess if eosinophil-to-lymphocyte ratio (ELR), total serum IgE level, and serum eosinophil percentage would be useful in predicting response to omalizumab therapy in patients with BP. Medical records of 10 patients with BP treated with omalizumab were retrospectively analysed for clinical and laboratory data. ELRs, total serum IgE levels, and serum eosinophil percentages were compared between groups of complete responders and partial responders/flare-ups, but the results were not statistically significant. Studies with larger sample sizes should be done to predict the role of type 2 immunity markers in omalizumab therapy of BP patients.
A Rare Cutaneous Malignancy: A Primary Cutaneous Carcinosarcoma with Adnexal Epithelial Component (Trichoblastic Carcinosarcoma) of Left Temporal Region
Authors: Nagose Vaishali B. , Ingle Sachin S. , Chandak Nilesh O. , Gondane Shirish R. 
Published: February 2024

Abstract
Primary cutaneous carcinosarcoma (PCCS) is a rare cutaneous biphasic tumour with just 120 cases being reported till date. The epithelial component trichoblastic carcinoma/ malignant trichoblastoma (trichoblastic carcinosarcoma) is even rarer, so is the present case. An eighty years old male patient presented with a rapidly progressing ulceroproliferative nodular growth on the left temporal region. The incisional biopsy showed primary cutaneous carcinomasarcoma (PCCS). IHC showed epithelial and stromal component marked exclusively for pancytokeratin (AE1/AE3) CK5&6/ p40 and vimentin respectively. Both components were immunopositive for D2-40 and immunonegative for BerEP4/ S100/ Melan A/ MITF, thus final diagnosis given was Trichoblastic carcinosarcoma. Wide excision of the lesion with local rotation flap and skin grafting (thigh skin) was done. Patient remains disease free after four years also. Present case thus highlights the importance of HPE, IHC and early surgery for excellent prognosis of PCCS.
Photodynamic Therapy Combined with Liquid Nitrogen Cryotherapy and Curettage for the Treatment of Recalcitrant Periungual and Subungual Warts: Clinical Experience and Literature Review
Authors: Xie Kuixia , Cheng Meihong , He Bo , Li Wei , Zhong Wenying 
Published: February 2024

Abstract
Warts are caused by human papillomavirus (HPV) infection and can involve multiple parts of skin and mucosa, of which periungual and subungual warts are the most difficult to treat. Periungual or subungual wart is verruca vulgaris growing around or under the fingernail, destroying and deforming the nail and nail bed. Currently, liquid nitrogen cryotherapy and CO2 laser are often used for the treatment. Clinically, few doctors routinely use photodynamic therapy (PDT) to treat viral warts. We used PDT combined with liquid nitrogen cryotherapy and curettage to successfully treat a case of intractable periungual and subungual warts.
Association of Protein Tyrosine Phosphatase Receptor Type D and Serine Racemase Genetic Variants with Type 2 Diabetes in Malaysian Indians
Authors: Saif-Ali Riyadh , Al-Hamodi Zaid , Salem Sameer D. , AL-Habori Molham , Al-Dubai Sami A. , Ismail Ikram S. 
Published: February 2024

Abstract

Introduction:
Type 2 diabetes (T2D) candidate genes, protein tyrosine phosphatase receptor type D (PTPRD), and serine racemase (SRR) were suggested by a genome-wide association study (GWAS) in the Chinese population. Association studies have been replicated among East Asian populations. The association of PTPRD and SRR genetic variants with T2D in Southeast Asian populations still needs to be studied. This study aimed to investigate the association of PTPRD and SSR genetic variants with T2D in Malaysian Indian subjects.

Methods:
The single nucleotide polymorphisms (SNPs) of PTPRD (rs649891 and rs17584499) and SRR (rs4523957, rs391300, and rs8081273) were genotyped in 397 T2D and 285 normal Malaysian Indian subjects.

Results:
The homozygous dominant genotype of rs17584499 is frequent in diabetic patients (56.5%) compared to normal subjects (47.3%). In contrast, the homozygous recessive genotype of rs8081273 is more frequent among normal subjects (12.5%) than diabetic patients (5.6%). The dominant genetic model showed that PTPRD rs17584499 (CC) is a risk factor for T2D (OR = 1.42, P = 0.029), whereas the recessive genetic model showed that SRS SNP rs8081273 was protective for T2D (OR = 0.42, P = 0.003).

Conclusion:
This study confirmed the association of PTPRD rs17584499 genetic variations with T2D in Malaysian Indians. While the SRR rs8081273 (TT) genotype showed protection against T2D, more investigation in different populations is required to confirm this protection.
Pandemic Restrictions and Weight Changes during Inpatient Care in an Intermediate Stay Unit in Patients with Severe Mental Illness
Authors: Sankaranarayanan Anoop , Lee Da Young , Murali Vijaya , Andrade Chittaranjan 
Published: February 2024

Objective:
Weight gain can harm health and be socially stigmatizing. We sought to determine whether weight gain during the inpatient stay, as collateral damage related to lockdown, was more in patients admitted during the lockdown in the first pandemic year than in those admitted during the same period in the immediately preceding year. To our knowledge, this has not been previously investigated.

Methods:
We extracted from medical record weight data during two similar 4-month periods (April–July) in 2019 and 2020. We examined the impact of the ward restrictions during the pandemic lockdown on weight gain using multivariable regression analysis, adjusting for potential confounding variables selected a priori: age, sex, baseline weight, metabolic syndrome or antipsychotic load, and duration of inpatient stay.

Results:
There were 59 patients, almost all with schizophrenia spectrum disorders. Patients admitted in 2019 (n = 27) were significantly more likely to consume alcohol or use illicit substances, but otherwise did not differ much from those admitted in 2020 (n = 32). Weight gain during inpatient stay was not statistically significant for 2019 (+1.85 kg; P = 0.22), 2020 (+0.74 kg; P = 0.26), or for the 2 years combined (+1.25 kg; P = 0.10). Finally, weight gain during inpatient stay did not differ between 2019 and 2020 (P = 0.83). In the regression analysis, the year of admission was not significantly associated with change in weight during inpatient stay (beta, −0.11; P = 0.43).

Conclusions:
Our findings validate our ward strategies to reduce the risk of weight gain during lockdown in inpatients with severe mental illness.
Little Ironweed and Java Tea in herbal toothpaste reduced dentine permeability: An in vitro study
Authors: Vajrabhaya La-ongthong , Korsuwannawong Suwanna , Harnirattisai Cholthacha , Teanchai Chayada , Salee Weena 
Published: February 2024

Abstract

Aim:
To determine the effect of an herbal toothpaste containing Little Ironweed and Java Tea, on reducing dentine permeability in vitro.

Materials and Methods:
Dentine discs from human mandibular third molars were divided into three groups and brushed with herbal toothpaste, nonherbal toothpaste, or deionized water. Each group was immersed in artificial saliva (AS) or 6% citric acid. The permeability of each dentine disc was evaluated before and after saliva or acid challenge using a fluid filtration system. The morphology of dentine discs after treatment was observed using scanning electron microscopy (SEM). The mean permeabilities were statistically analyzed using analysis of variance and Tukey’s test.

Results:
The nonherbal and herbal toothpaste groups demonstrated reduced dentine permeability. AS immersion decreased dentine permeability in both toothpaste groups with values lower than the control group. Dentine permeability values increased after acid immersion in the toothpaste groups and were similar to each other. SEM revealed small granular crystal-like and round particles on the dentine surface and opening of dentinal tubules of both toothpaste groups. More dentinal tubules were opened after brushing with deionized water.

Conclusions:
The reduction of dentine permeability caused by the herbal toothpaste was similar to that of the nonherbal toothpaste after brushing and the simulated oral conditions. Both herbal plants have the possibility to alleviate clinical hypersensitivity by reducing dentine permeability. Little Ironweed and Java Tea in the toothpaste composition is a potential choice for treating hypersensitive dentine.