bluuebunny/crossref_metadata_2025_split huggingface dataset:
On the Systematics of the Number of Heavy Prongs in Proton‐Nucleus Interactions in Emulsion
Authors: Daftari I. K. , Bhattacharjee D. K. , Naha S. C. , Ghosh D. C. , Roy T. 
Published: July 2007

AbstractThe systematics of the number of heavy prongs in proton‐nucleus interactions in emulsion in the energy range from a few GeV to few hundred GeV have been studied. The results disfavour the secondary processes in the target nucleus in general and intranuclear cascading of hadrons in particular.
Quantum Electrodynamics in Solids
Authors: Matsumoto H. , Semenoff G. , Umezawa H. , Tachiki M. 
Published: July 2007

AbstractA quantum field theoretical treatment of electromagnetic fields in solid is presented. The photon propagator is obtained when the current‐current correlation function is given. From the relations among matrix elements which are a consequence of the local gauge invariance of the theory, the classical Maxwell equations are derived by means of the boson transformation which is the mathematical realization of a boson condensation. The relation of the microscopic functions to the phenomenological quantities is presented.
Topological Charges in Gauge Theories
Authors: Leinaas J. M. 
Published: July 2007

AbstractTopological and geometric aspects of gauge theories are examined. The geometry of the fiber‐bundle formulation of gauge theories is discussed and compared with the formalism of general relativity. The basic role played by the parallel displacement operator of this geometry is examined. With this operator a gauge independent characterization of various topological singularities and non‐singular soliton configurations is carried out.
Accelerated life‐test experiments on low‐power rectifier diodes
Authors: Windel Joachim 
Published: July 2007

AbstractLow‐power rectifier diodes were stressed by different forward currents IF, reverse voltages UR, and ambient temperatures a for a time interval (0, t*) in order to analyse the resulting distributions. Owing to the limitations in the test time, t*, the gathering of comprehensive information about their performance requires high stress levels without exceeding either physical limits or the limits for initiating thermal runaway. First, the results of lifetime experiments related to the middle stress region were described by a Weibull distribution with constant shape parameter and stress‐dependent scale parameter. This model, however, did not fit sufficiently the typical features of the real‐life distribution. Therefore a non‐parametric measure called the average initial reliability in (O,t*) was defined using the experimental results. Its stress dependence was estimated. The results are guiding figures of stress conditions both for accelerated tests and for circuits with high demands on reliability.
Temperature dependence of microelectronic device failures
Authors: Pecht Michael , Lall Pradeep , Whelan Stanley J. 
Published: July 2007

AbstractRecently, the use and the applicability of reliability prediction models for microelectronic devices using the temperature‐dependent Eyring and Arrhenius function, have been criticized. In fact, the temperature dependence of failure mechanisms of microelectronic devices and electronic equipment in general has been questioned. This paper discusses the effect of temperature on microelectronic failure mechanisms at various device failure sites. This paper also presents information on those mechanisms which may be more appropriately modelled by functions dependent on temperature change, the rate of temperature change and spatial temperature gradients.
Estimation of the mean cumulative number of failures in a repairable system with mixed exponential component lifetimes
Authors: Hansen Christian Kornerup , Thyregod Poul 
Published: July 2007

AbstractComponents in electronic systems are often observed to be likely to fail at an early age, an effect well known as the ‘infant mortality’ effect. Similarly, for systems composed of such components, a decrease in the rate of occurrence of failures, usually called the ‘reliability improvement’ effect, is seen in the early operating period. In this paper we show that such improvement may be considered as a simple consequence of the heterogeneity among the components in the population. We present a simple three‐parameter model for the distribution of the component lifetime, which has a simple physical interpretation, and from which we obtain methods for statistical inference, suitable for implementation on even small computers. The methods have been applied successfully to field failure data, collected from an industrial company.
On parameter design optimization procedures
Authors: Yum Bong‐Jin , Ko Sun‐Woo 
Published: July 2007

AbstractThe Taguchi idea of parameter design has received considerable attention from statisticians and engineers. However, it is only recently that some of the underlying principles of his ideas have been clarified and other alternative procedures have been proposed. This paper reviews the currently available procedures for parameter design in terms of minimizing expected loss. Advantages and disadvantages of each procedure are discussed for the three types of performance characteristics, and guidelines are provided for the choice of an appropriate procedure for a given parameter design problem.
Modern reliability assurance of integrated circuits—A strategy based on technology capability assessment and production reproducibility control
Authors: Gerling W. 
Published: July 2007

AbstractTechnological innovations provide integrated circuits of increased functionality and complexity, and modern design tools facilitate a new multiplicity of products, such as application‐specific products (ASICs). Traditional qualification procedures cannot keep pace with this evolution with respect to requirements of product reliability, ability of qualifying the multiplicity of future products, and market demands for saving cost and time.A further development of a reliability assurance concept, which will be discussed here, considers design tools, basic product elements, materials, manufacturing process and controls as a ‘system’, which has to be qualified with respect to the consistency and efficiency of all of the implemented reliability assurance measures. The concept is based on the manufacturer's ‘system’ knowledge and responsibility. It is compatible with the relevant requirements of ISO 9000 and recent military standard proposals. The procedure is applied to commercial products.The main part of this concept is the qualification of the manufacturing technology. The procedure is organized as a continuous process starting at the concept phase of a new technology and its pilot product. The various steps then follow the development, the pre‐series and series production phases. The reliability aspects concentrate on the physical properties of product elements relevant to their stability and endurance, i.e. the potential failure mechanisms and their root causes as reliability risks. Thus a major part of reliability testing for the qualification of the pilot product of a new technology can be performed without the use of the final product version. The benefits derivable from this approach are savings in time and cost as well as the capability to handle future product multiplicity.
A som study of DC‐PBH laser catastrophic failures
Authors: Montangero Paolo , Liberatore Michele , Arman Giuseppina 
Published: July 2007

AbstractOBIC and PL imaging modes of a SOM have been successfully applied to the failure analysis of catastrophically degraded DC‐PBH lasers. High lateral resolution, variable in‐depth penetration and selective excitation are the most interesting features. A degradation mechanism has been found due to the development of leakage paths in the confining junctions.
Choosing the best set of quality judges: A new quality tool
Authors: Hoffman Lorrie L. 
Published: July 2007

AbstractThis article presents a technique which allows one to choose the ‘best’ set of quality judges. The methodology can be applied to any situation requiring discernment of a qualified inspector of products or service. The approach presented in this article selects judges who align their quality criteria with the prevailing expert. Multidimensional scaling is conducted on a disagreement matrix formed by executing multiple pairwise comparisons. An example of voice quality judging is included in the article as a practical example of the technique.
Low‐cost physical analysis techniques for the failure analysis of semiconductor components
Authors: Glacet J. Y. , Dall'oro G. Guerri 
Published: July 2007

AbstractFailure analysis of semiconductor components should not only be considered as an ever increasing costly activity which is economically difficult to support, to develop, and to justify, because of the continuous technology evolution. Analytical techniques such as integrated circuit pin‐to‐pin electrical test, plastic package opening with the acid dropper, hot spot detection with liquid crystals, EBIC, voltage contrast in static and voltage coding modes, can be developed and applied in failure analysis laboratories with low‐cost equipment. Although they are not intended to replace some well‐known expensive and sophisticated analytical tools, they can provide efficient results.
Environmental testing and component reliability observations of telecommunications equipment operated in tropical climatic conditions
Authors: Sinnadurai Nihal , Kuppuswamy T. S. , Chandramouli R. , Rao B. K. N. 
Published: July 2007

AbstractSafeguarding the reliability of electronics exposed to the severe conditions occurring in tropical climates, such as India, has not been adequately understood or dealt with in international specifications. Consequently, components and equipment supplied to such specifications have failed in such climates. The vulnerability of supposedly hermetic components has been suspected as a result of a full analysis of moisture ingress, and this has been borne out by comprehensive analyses of the actual failures of components supplied to international specifications, and the climatic conditions actually occurring in India. Understanding of reliability assessment and achievement has been significantly advanced by such analysis and has shown the necessity and applicability of the highly accelerated stress testing technique invented at British Telecom Laboratories more than two decades ago. Comparison has shown the significant cost benefit from the use of plastic encapsulated devices of proven reliability.
Plastic encapsulated ics in military equipment reliability prediction modelling
Authors: Brizoux M. , Deleuze G. , Digout R. , Nallino M. 
Published: July 2007

AbstractThis paper introduces a reliability prediction model for plastic encapsulated integrated circuits to be used in professional or defence electronics applications. The first part is a comparison between different reliability prediction models: their hypotheses, assumptions and validity domains are examined; constructive criticism is made and model amendments proposed for plastic encapsulated ICs reliability prediction. The second part presents the model itself. It addresses also thermal and environmental aspects. The third part explains how numerical values are found to fill the model and how it reflects the reliability of today's state‐of‐the‐art of plastic encapsulation. In conclusion, we present the improvements that this model can bring to reliability prediction, in the particular case of plastic packages.
Asics failure analysis using two complementary techniques: External electrical testing and internal contactless laser beam testing
Authors: Bouvet C. , Fouillat P. , Dom J. P. , Danto Y. 
Published: July 2007

AbstractFunctional tests with an electrical tester have revealed defects in an ASIC. Results analysis leads to incriminating different areas of the layout. A laser beam tester localizes the logic operator responsible for the dysfunction observed with the electrical tester.
GaAs MMIC reliability studies
Authors: Anderson W. T. , Roussos J. A. , Christianson K. A. 
Published: July 2007

AbstractThree types of GaAs monolithic microwave integrated circuits (MMICs) were RF high temperature accelerated life tested to determine the median time before failure (MTBF). Life testing was performed under the d.c. bias conditions and RF input power levels the MMICs would be expected to use under actual operating conditions. the accelleration condition was to raise the base‐plate temperature high enough to result in degradation in approximately 1000 hours at the highest test temperature. Because the MMICs were designed for power applications, the input signal level was large enough to cause approximately 1 dB compression. Device failure was defined as a 20 per cent decrease in output power as measured at 125°C, or room temperature when the temperature control system was turned off. Under these conditions the MTBF extrapolated to a channel temperature of 125°C varied between 8 × 103 hours and 2 × 105 hours depending on the MMIC type. The primary failure mode appeared to be surface leakage currents under the passivation layer.
Component lifetime models based on weibull mixtures and competing risks
Authors: Hansen Christian Kornerup , Thyregod Poul 
Published: July 2007

AbstractThis paper gives a review of the statistical modelling of lifetimes of electronic components. The models considered are all based on Weibull (and exponential) distributions combined as either finite mixtures, competing risks or both. A convenient notation is introduced for this general class of models, which includes the traditional monotone hazard rate models, the bathtub model, as well as the more sophisticated roller coaster models. The main advantage of this concept is that a model may be determined by relatively few parameters, and that furthermore each parameter may have a physical interpretation in terms of initial flaws or defects as well as long‐term wear out or deterioration. The properties of the distributions are investigated in examples with different scale and shape parameters, and for different types of combinations. Also, the models are compared with another class of models based on combinations of exponential distributions, known as the phase‐type models. Finally a brief discussion of model selection and estimation methods is included.
An extended mathematical model for failure kinetics
Authors: Drapella Antoni 
Published: July 2007

AbstractIn practice we often observe some kind of ‘self‐acceleration’ when degradation causes the local temperature to increase, and in turn the temperature accelerates degradation. In this paper an extended model for failure kinetics is proposed to describe the phenomenon mentioned above. It is a common belief that a non‐linear relation between logarithmic lifetime and inverse temperature reveals a change of failure mechanisms. The results of the paper tell us that non‐linearity may be produced by a single failure process with more complex failure kinetics than the simple reaction of the first order.
Software reliability model selection
Authors: Khoshgoftaar Taghi M. , Woodcock Timothy G. 
Published: July 2007

AbstractNo one software reliability growth model has ever been shown to work well in all circumstances. This paper presents our evaluation results for two case studies in which the Akaike information criterion (AIC) was used. The AIC not only selects the best model among several reliability models, but also possess favourable properties that practitioners like to see in their software reliability modelling practices. These properties include simplicity, accuracy and ease of application. We propose using the Akaike information criterion to select the best model for each software system.
On the measurement of field return rates
Authors: Shen Michael S. 
Published: July 2007

AbstractA set of well‐defined equations is required for quantifying statistical product quality and reliability. Specific equations and their inherent measurement errors as a function of reporting period, lead time and fluctuating shipment levels are discussed. This paper covers three quality and reliability measurements, two being new‐shipment measurements: (1) overall embedded annualized field return rate, (2) short‐term or four‐quarter rolling annualized field return rate, and one being repair quality: Rate of re‐return.
A comparative reliability assessment of 750nm, 1060nm and 1300nm high power surface light emitting diodes
Authors: Lindsay C. E. 
Published: July 2007

AbstractA comparative study of the reliability of high power double heterojunction surface light emitting diodes (SLEDs) operating at 750nm, 1060nm and 1300nm is reported. Data analysis from 9500 hours of fully automated life testing concludes that extremely reliable devices can be produced. Degradation and failure characteristics specific to each operating wavelength are described and related to structural and performance data on each device batch. Median life and activation energies are calculated.
The key features of Japanese total quality control
Authors: Dale B. G. 
Published: July 2007

AbstractThis paper reports the main findings of a mission of manufacturing executives to study total quality control (TQC) in six major Japanese companies. The paper outlines why TQC is important to Japanese companies and identifies five main pillars of their TQC activities—policy deployment, organization and planning, education and training, involvement of every employee in quality improvement, and day‐to‐day quality assurance and control. Some popular misconceptions about Japanese‐style TQC are examined, including that they do not experience any difficulties in getting top management involved in TQC, that quality control circles are successful in every department and that incoming supplies are never inspected. The paper concludes by presenting some lessons for Western managements.
A new approach to reliability of commercial and military aerospace products: Beyond military quality/reliability standards
Authors: Kromholtz Gregory A. , Condra Lloyd W. 
Published: July 2007

AbstractRecent changes in the commercial and military aerospace industries have caused us to question the traditional ways of measuring, predicting and assuring product reliability. These industries have been unique in that both quality and reliability have been almost completely controlled by government standards, a condition that will not survive the current upheaval in these markets. Traditional reliability prediction methods for military and commercial aerospace products use a probabilistic approach, such as that of MIL‐HDBK‐217, and Reliability Assurance relies on fixed quality levels in design and manufacture. These approaches almost uniformly assume that predicted equipment reliability is the sum of the predicted reliabilities of the electronic and electromechanical parts in the equipment and that once designed, reliability is a fixed attribute of the hardware. This paper describes a comprehensive approach to avionics reliability assurance which addresses all potential causes of unreliability. It is applicable to both commercial and military products. The approaches described here may be viewed as the next logical step beyond the traditional approach to quality and reliability found in current Military Standards.This paper is a call to change the way we think about reliability assurance in the military and aerospace markets. Six new approaches are suggested: (1) Adopt a continuous improvement, zero‐defects mentality in the design of military and aerospace products; (2) develop a design‐to‐world‐class cost and schedule mentality; (3) adapt world‐class process control methods to low‐volume, high‐reliability manufacturing; (4) accept ownership for quality and reliability of all components and materials; (5) adapt world‐class design practices to military and aerospace products; and (6) recognize that quality and reliability of parts, materials, and systems are the responsibility of those who manufacture them.Although ELDEC Corporation is installing a system with the above features, the implementation of these approaches will be unique to each user. The system described in this paper involves the use of many currently popular TQM methods, such as statistical process control, design of experiments and concurrent engineering. It also involves interaction of many functions within the manufacturing organization, as well as with suppliers and customers. Our listing of methods is not intended to be comprehensive, just illustrative.
Reliability simulations of the endurance performance of FLOTOX EEPROM cells using spice
Authors: Gigon F. , Papadas C. , Ghibaudo G. , Pananakakis G. , Mortini P. 
Published: July 2007

AbstractA SPICE model which enables transient simulations of the programming window degradation in FLOTOX EEPROM cells to be performed is presented. The simulation enables the endurance characteristics of the memory cells to be predicted at CAD level, when provided with the memory cell geometry, the programming conditions and the tunnel oxide quality. Thereby, the optimization of the cells' geometry with respect to the endurance performance as well as the selection of the optimum programming conditions which minimize the window degradation become possible, even prior to the fabrication of the memory cells.
Failures of ALGaAs/GaAs HEMTs induced by hot electrons
Authors: Tedesco C. , Canali C. , Magistrali F. , Paccagnella A. , Zanoni E. 
Published: July 2007

AbstractWe present in this work the rapid and irreversible degradation of electrical characteristics induced by hot electrons in unpassivated AlGaAs/GaAs HEMTs. When devices are biased at high drain‐source voltages carriers can reach high energies and give rise to impact ionization phenomena. Devices biased in these conditions show a decrease of drain current, an increase of parasitic drain resistance and an increase of transconductance frequency dispersion. Degradation has been found proportional to the maximum electric field in the channel. Results suggest that hot electrons generate deep levels in the access region between gate and drain contacts possibly at the interfaces between the semiconductor layers in the gate‐drain region.
Use of off‐line and on‐line controls for the manufacture of quality rings for bearings—a case study
Authors: John Abraham P. , Bhadury Bikash 
Published: July 2007

AbstractThe paper is a report of an investigative study carried out to evaluate the quality of rings manufactured for rolling element bearings. The rings are manufactured from 36–75 mm diameter bars of high‐carbon high‐chromium bearing steel, grade SAE‐52100 conforming to ASTM A295‐1984 in a ring plant, which essentially consists of an induction furnace and a fast‐acting hot forging machine consisting of a set of feed rolls, hot shear and four forming stations. The ring plant is capable of producing 17 million rings per annum. Thus the volume of rings produced is very large and the project was undertaken with the objective of process improvement to build in confidence during the manufacture of the product so that it can be sent out without final inspection. The project was carried out in three phases, namely use of variables charts together with the identification of the causal factors for the ovality of rings with the help of cause‐and‐effect diagrams, followed by process optimization using parameter design, and this, in turn, was followed by on‐line control procedure instituted for the control of the variable which deteriorates with time.