bluuebunny/crossref_metadata_2025_split huggingface dataset:
Comparison of Enameled Steel Substrate Properties for Thick Film Use
Authors: Stein S. J. , Huang C. , Gelb A. S. 
Published: June 2007

Porcelain enameled steels have had a long history of industrial, structural and related applications. Recent interest
in such materials has centered on electrical uses as a substrate for hybrid circuits, additive printed wiring, and
packaging. A study of some of the critical properties of available enameled steels was undertaken.Five types of enameled steel substrates from three manufacturers were tested. The electrical properties studied
included dielectric constant, dissipation factor, voltage breakdown, surface and bulk insulation resistance. The
effect of humidity on the insulation resistance of the enamel coatings themselves was compared. The influence of
the thermal conductivity of the substrates was also examined.The properties of a thick film resistor system was determined on the various enamel steel substrates. The
properties tested included resistivity and TCR firing sensitivity.The effect of the type of substrate on the properties of a selection of thick film conductors was determined.
Conductivity and gold and aluminum wire bond strength were compared on the various substrates.The dielectric properties of a multilayer/crossover dielectric thick film material were compared among 96%
alumina, soda‐lime glass and the various enameled steel substrates.Many individual differences between the enameled steel substrates were found. However, all of the substrates
could be utilized to produce satisfactory thick film circuits when the proper choice of thick film materials was made.Continuing changes, improvements and additional sources of supply are expected to overcome some of the
present shortcomings. These should enhance the use of such substrates for large area uses and lower cost applications.
Optimization of Thick Film Resistors for Low Drift
Authors: Björklund Gunnar , Linde Lars 
Published: June 2007

In order to minimize drift in a thick film resistor both printing and trimming parameters have to be optimized
carefully.With the aid of a linear theoretical model it is shown how the resistance drift in the bulk transition zone
and terminals of the resistor can be calculated for both trimmed and untrimmed resistors.The theoretical results are used for optimization of laser trimmed high ohmic resistors. The experimental
results are in good agreement with the theoretical predictions and confirm that thick film resistors can be
optimized for low drift.
AVI Transponder
Authors: Kamata Shoichi , Kimura Yoshinori , Sakuragi Johji 
Published: June 2007

A newly developed AVI transponder is to be used in Automatic Vehicle Identification (AVI) system, which provides
identification of moving vehicles passing by a certain location, as to its registration number, and classification etc. This
AVI system is characterized by the fact that it utilizes ceramic resonators in the composition of a transponder
identification code, and a single microwave carrier to convey an interrogation signal to, and a response signal from,
that transponder.The transponder is a completely passive device free of any power supply, and operates as a “Reflector”. Overall
external dimensions of transponder are 7 × 10 × 1 cm with a weight of 150 grams, the unit is compact, light weight
and can be mounted easily on the vehicle, and is easy to carry.All of the circuitry required for the transponder is provided in the form of microstrip lines utilizing MIC (Microwave
Integrated Circuit) technology on the PTFE‐glass fibre laminate substrate. The transponder circuitry, which consists
of printed antenna, microwave modem circuit and medium frequency circuit, is patterned on both surfaces of the single
substrate. In this paper, operation principle, circuitry and construction of the transponder will be described.
Thick Film Temperature Compensating Circuit for Semiconductor StrainGauges
Authors: Arima Hideo , Ikegami Akira , Tosaki Hiromi , Ai Mitsuo , Matsuoka Yoshitaka , Okayama Tsutomu 
Published: June 2007

Thick film circuits were developed for temperature compensating of semiconductor strain gauges and for connecting
the gauges to amplifiers in electronic pressure and differential pressure transmitters. In each circuit, ten Au pads for
Al wire bonding and thirteen Ag/Pd pads for soldering must be fabricated on a small substrate. The results of the
research are shown below.(1) The resistance values and the thermistor constants required for the thermistors are 0.9 ± 0.09 kilo‐ohm and
2500 ± 40 Kelvin, respectively. Those characteristics are realized by developing a paste composition composed of a
new spinel type oxide (Mn1.6Co0.8Ni0.35Ru0.25O4) RuO2 and glass.(2) Accelerated life tests of the thick film thermistors reveal that the resistance drift rates of the thermistors are less
than ±0.02 %/year at 120°C.(3) Life tests clarify that the wire bonding pads fabricated by using ESL 8882 Au paste keep more than 4 grams in
pull strength, and that the soldering pads fabricated by using Sumitomo CLP 495A Ag/Pd paste are more than 1
kilo‐gram in pull strength.(4) The temperature dependence of zero shift and span shift in the pressure transmitter are suppresed within ±0.2%
between –40°C and 120°C by using the thick film circuit developed.
Hybrid Voltage Regulator for Automobiles
Authors: Sawamura Akihiro , Takahashi Tadashi , Denda Sei-Ichi 
Published: June 2007

In the course of the development of hybrid voltage regulators for automobile use, increasing the reverse blocking
voltage with decreasing of saturation voltage for output power darlington transistors, the capability of monolithic IC
chip against surge pulses generated in cars, and an improvement of the pattern design of thick film in order to
withstand temperature cycling, have been important subjects. Power darlingtons have more than 150 V of reverse
voltage as well as large secondary breakdown capacity and less than 1.2 V of saturation voltage. A monolithic chip
having small saturation voltage and more than 500 mA of surge current capability, has been developed. A
neck‐shaped thick film pattern was developed to make soldering in a controlled manner. The problems in the earlier
stage with surge current and temperature cycling have been almost solved by these improvements.In this paper the characteristics of the transistor and the monolithic chip the structure of the device and related
problems observed in temperature cycling are described.
Process and Accelerated Aging Test of GANG Bonding for Gold‐PlatedTAB Outer Leads
Authors: Nitta M. , Tsuge T. , Hiki Y. , Kato R. 
Published: June 2007

This paper presents the evaluation results of thermocompression GANG Bonding of gold‐plated TAB outer leads to
three kinds of metallized ceramic substrates. Gold‐Selective Plating (GSP) substrates for multi‐chip package, Thick
Film (TF) substrates for multi‐chip package and Single Chip Packages (SCP) which have a trimetal combination of
refractory metal (tungsten), Nickel and Gold.The bonding parameters such as the bonding tool (thermode) temperature, pressure, bonding time and preheat
temperature were examined on each substrate to get optimum values. As the result, a relation between pull strength
and the lead deformation shows that the TAB leads should be bonded with 15–65 percent deformation, the recommended parameters are; the tool temperature of 380–430℃, the bonding pressure ranging from 35 to
45 kg/mm2, with the preheat temperature of 150℃ and the bonding time from 1.0 to 2.5 seconds.The evaluation of initial bondability shows that TAB GANG Bonding has the capability of excellent bonding
strength; above 120 grams with standard deviation of less than 20 grams, and the necessity of OLB pads flatness; less
than ±12 μm for one ounce copper lead. The normal storage of the substrate and the lead does not affect the
bondability. And the results of accelerated aging test of 125℃, 150℃ and 175℃ for more than 8,000 hours show
that a lifetime of greater than 70 years at 65℃ operating temperature is predicted. The effective activation energy for
the pull strength degradation is 0.86–1.05 eV. This is in reasonable agreement with predictions for interdiffusion of
Cu–Au. And no significant degradation of the electric resistance was observed on the GSP samples.The feasibility and the high reliability of the GANG Bonding for gold‐plated TAB outer leads were confirmed.
New Thick Film Functional Devices
Authors: Taketa Y. , Abe O. , Haradome M. 
Published: June 2007

The development of thick‐film functional devices having oscillation, negative resistance, switching, memory and so on
has been needed.New non‐volatile memory devices manufactured of Nb2O5‐based thick‐film have now been created. The thick‐film
devices have been prepared by using common thick‐film technology such as screen printing, drying and firing. The
characteristics and the operation of the devices are as follows:When a dc voltage is applied to the devices, rapid resistance change, so called switching effect, occurs. The devices
have low resistance state. Even when the voltage is removed completely, the devices do not return to high resistance
state and keep low resistance state. However, when alternating voltage is impressed upon the devices, the low
resistance state goes to the high resistance state. The recovery time of the resistance state depends upon the frequency
of applied ac voltage. The higher frequency voltage that is applied, the sooner the recovery time becomes. The
threshold voltage exponentially increases with higher frequency of an applied ac voltage.In addition to the memory effect, the Nb2O5‐based thick‐film devices have a switching and oscillation characteristic.
Low‐Value Nickel Resistors Electroless‐Plated on “IMST” Substratefor Power Hybrid ICs
Authors: Miura N. , Fuura Y. , Kazami A. 
Published: June 2007

This paper describes a new resistor formation technique, characterized by the use of our unique hybrid IC substrate
(IMST substrate) and the electroless nickel plating on it.The evaluation of various electroless nickel plating baths to deposit nickel alloy with a different composition for
each is included. The resistor properties of the nickel film from a selected bath are showed. The plating conditions
affecting the resistance are discussed. Finally, the application to the built‐in emitter resistors of the IMST audio power
hybrid IC is presented.
Application‐Oriented Description of the Quality of Electronic Components (ppm Concept)
Authors: Junghans Wolfgang 
Published: June 2007

Traditionally the production quality of components is described by “acceptable quality levels” (AQL). Agreements, referring to this principle, determine the acceptance or refusal of batches that have been sample tested. An acceptable quality of level is interpreted as a tolerated limit. In reality true values of quality must be better. An AQL value cannot define a real quality level. Furthermore, increasing requirements for component quality lead to low figures for the permissible amount of faulty devices in batches, and the method of sample testing becomes insufficient.For these reasons it seems to be of major importance to establish a better standard for the definition of quality. The application oriented description of quality data offers a possible solution. A good exchange of experience between supplier and user, based on a close and quality loop, is necessary.For contractual purposes AQL values remain important, but their meaning needs a new interpretation.
The Influence of Electrical Pulses on Thick Film (Du Pont 1421 Birox) Resistors
Authors: Kozlowski J. M. , Tancula M. 
Published: June 2007

This paper presents data on the effect of electric pulses on thick film resistors made using Du Pont 1421 Birox resistor pastes.Resistance changes during the application of the electric pulses were investigated. Two types of change were observed: reversible and irreversible (i.e. catastrophic).In order to illustrate the causes of these changes, observations of the film on a scanning electron microscope were made. Microcracks were observed in the film, which were mostly responsible for the permanent resistance changes.
A Chronological List of References on Switched Capacitor Circuits
Authors: Vandewalle J. 
Published: June 2007

A chronological list of 440 references on switched capacitor circuits is compiled. Such circuits have cut the cost of filters and signal processing devices for telecommunications, speech and consumer products because they can be easily integrated on a chip. The bibliography shows the explosion of interest since 1977 by IC designers, CAD developers and circuit and filter theorists and practitioners alike.Very specialized publications as well as elementary papers and books have been included.
High Density Packaging Technology
Authors: Nishi Yusaku , Mizuno Kazuo 
Published: June 2007

A chip and wire, high density packaging approach has resulted in a low cost, large scale, high density, multi‐chip package (MCP). The package includes 76 ICs, 1 resistor, and 34 capacitor chips on a 2 in × 3 in multilayer ceramic substrate (MLS) with 92 I/O leads. The package has a solder‐sealed, metal cover over the chip‐mount area, and a heat sink on the back side of the MLS.The primary yield was found to be around 70%. The rest was reworked with no significant labour. The software as well as hardware to minimize the test/rework labour would be a key to success in chip and wire MCPs. Also, efforts were made to reduce the material cost and the assembly labour. The thick film MLS was replaced by the ceramic MLS. The wire bonding was automated. Overall efforts reduced package cost to 1.25 times the conventional DIP‐on‐PCB counterpart (7.5 in × 9.1 in). Estimating its effectiveness at a system level, the reduction in the number of boards, connectors and cables would give MCPs an advantage over their counterparts. The improvement in reliability would be another advantageA comparison with other high density packaging technologies, chip carrier, and chip on tape, is also described.
Parallel decrease of tissue factor surface exposure and increase of tissue factor microparticle release by the n-3 fatty acid docosahexaenoate in endothelial cells
Authors: Turco Serena Del , Basta Giuseppina , Lazzerini Guido , Evangelista Monica , Rainaldi Giuseppe , Tanganelli Piero , Camera Marina , Tremoli Elena , Caterina Raffaele De 
Published: June 2007

SummaryTissue factor (TF) is expressed on the endothelium in response to inflammatory mediators, giving endothelial cells a pro-thrombotic phenotype. Since fish-derived n-3 fatty acids (FA) have been associated with reduced incidence of myocardial infarction, we investigated the endothelial effects of the most abundant n-3 FA, docosahexaenoate (DHA), on TF expression. Human umbilical vein endothelial cells were pre-incubated with DHA (or stearate and arachidonate as controls) for 48–72 hours, and then stimulated with bacterial lipopolysaccharide (LPS) or tumor necrosis factor-α. Pre-incubation of endothelial cells with DHA (but not stearate or arachidonate) concentration-dependently reduced surface protein exposure, independent of TF mRNA or total protein expression regulation. Conversely, DHA treatment in conjunction with activating stimuli, induced the release of endothelial TF-exposing microparticles from endothelial cells,quantitatively accounting for the decreasedTF cell surface exposure. In conclusion,DHA treatment, with a time-course consistent with its incorporation in membrane phospholipids, increases the release of TF-exposing microparticles from endothelial cells, accounting for decreased endothelial cell TF surface exposure, thus potentially modifying the overall endothelial control of microparticle-related effects.
Intraoperative fresh-frozen plasma versus human albumin in craniofacial surgery − A pilot study comparing coagulation profiles in infants younger than 12 months
Authors: Machotta Andreas , Riess Hanno , Kerner Sabine , Ahlers Olaf , Haberl Hannes , Dörken Bernd , Kerner Thoralf , Hildebrandt Bert 
Published: June 2007

SummaryThe transfusion of fresh-frozen plasma (FFP) is suggested to minimize dilution coagulopathy when applied instead of colloids during paediatric craniofacial surgery (pCFS). We prospectively compared plasmatic haemostaseologic function between volume replacement with FFPs versus human albumin (HA) in a pilot study. Thirty infants with primary craniosynostosis were scheduled for pCFS. In 15 of those, FFPs were available from the identical donor as for packed red blood cells (pRBC), and were thus employed for intraoperative volume replacement. The remaining 15 infants were infused with HA-5% instead. Haemoglobin (Hb)-values, global coagulation parameters (activated partial thromboplastin time-aPTT; prothrombin time-PT), selected clotting factors (F) (VIII, XI, XIII), antithrombin-AT, fibrinolytic factors (fibrinogen; plasminogen; alpha2-antiplasmin-α2A), and activation parameters (thrombin-antithrombin-complex-TAT; plasmin-antiplasmin-complex-PAP; D-dimers) were assessed and compared between both groups after induction of anaesthesia, before transfusion of pRBC, and at the end of surgery. Patients and treatment characteristics were balanced between both groups. Prolongation of aPTT and decreases of PT, FXI, FXIII, AT3, and fibrinolytic factors were more pronounced in the HA-group. Increases in F VIII activity, activation parameters, and the course of Hb-values were similar among both groups. There was no difference regarding clinical endpoints (peri-/postoperative pRBC-transfusions, postoperative blood loss). In conclusion, the application of HA was associated with a more distinct dilution of procoagulant factors, AT3, and fibrinolytic factors than the use of FFPs. However, the course of activation markers suggested a similar extent of clotting and fibrinolytic activation with the use of both transfusion regimens, and there were no differences with regard to clinical endpoints.
Molecular characterization of human B domain-specific anti-factor VIII monoclonal antibodies generated in transgenic mice
Authors: Wootla Bharath , Tarrade Catherine , Schved Jean-François , Kaveri Srini , Granier Claude , Lavigne-Lissalde Géraldine , Lacroix-Desmazes Sébastien , Villard-Saussine Sylvie 
Published: June 2007

SummaryThe development of antibodies directed against factorVIII (FVIII) represents a major hurdle in the treatment of hemophilia A. Most anti-FVIII antibodies are identified through their ability to inhibit the FVIII procoagulant activity. Many of them, however, do not interfere with the functional properties of FVIII. Antibodies directed against the B domain belong to this latter category. Here, we characterized B domain-specific human monoclonal Abs (mAbs) at the molecular level. A series of human mAbs directed against FVIII was produced upon immunization of transgenic XenoMouse mice with human recombinant FVIII (rFVIII). Selection of the hybridoma with epitope specificity for the B domain was performed by differential recognition of full-length and B domain-deleted rFVIII. None of the anti-B domain mAbs demonstrated inhibitory activity against FVIII. Three of the mAbs recognized linear epitopes: mAb 25H3 bound to the 1014HIDGPSLLIEN1024 sequence; mAbs 8E3 and 22B6 shared the same epitope, composed of residues 1534KWNEANR1540. The corresponding soluble peptides inhibited the binding of their respective mAbs to FVIII. mAbs 8E3 and 22B6 displaced the binding of FVIII to vonWillebrand factor. Moreover, some of them (in particular mAbs 4G6 and 8E3) were able to compete for binding to the B domain with the anti-FVIII Abs from hemophilia A patients without inhibitor or with low Bethesda titers. Further investigation will allow to better characterize their clinical relevance.
Models for reaction mechanisms in haemostasis – Contributions from the study of prothrombin activation
Authors: Jackson Craig 
Published: June 2007

SummaryA brief history of the development of the contemporary model for the mechanism of prothrombin activation is presented.The focus is on the advances in understanding structure-function relationships in the molecules that comprise “prothrombinase” that occurred primarily during the 1970s. A link between the “classical theory” of hemostasis and the conceptual development of activation complexes as the activators of the precursors of coagulation proteases is developed. It is argued that advances occurred when new ideas arose that could be tested and new technologies enabled more definitive experiments to be performed.
Post-Genocide Rwanda: The Changing Religious Landscape
Authors: Kubai Anne 
Published: June 2007

AbstractThis paper seeks to examine the proliferation of Pentecostal churches and the changing religious landscape of Rwanda. The horrific genocide of 1994, left the country's traditional mainline churches bloodied and the Christian faith seriously challenged. Unlike elsewhere in Africa, prior to the genocide, Pentecostal churches had not got a foot-hold in Rwanda, then referred to as the most Catholic country in Africa. In the aftermath, Rwanda has experienced a spontaneous growth of new churches imported by returnees from far and wide. Though the Catholic Church still retains its dominant position, there has been an upsurge of Protestants and the Rwandan religious landscape is changing considerably. This gospel explosion has been attributed to the enormous challenges of social-economic reconstruction of a fractured society, where reconciliation and healing are of utmost importance. By packaging their messages with hindsight of the disillusionment with the traditional churches and the spiritual as well as the material need to arise from the ashes of genocide and rebuild their lives, these churches have attracted thousands of Rwandans.
Secularization as a Property of Action
Authors: Turina Isacco 
Published: June 2007

English Assuming that religion is socially relevant to the extent that it has influence on action, the article invites reconsideration of secularization not as a long-term historical process but as a property of action: any action, or a whole domain of action (economy, warfare, art, nutrition, sex, etc.), is therefore secularized if in carrying it out people are not influenced by religious doctrines or feelings about the way it should be done, and if it is not justified on this same basis. This definition, rooted in Weber's work, is intended to be operative for qualitative research and attentive to differences and interactions between groups and individuals, even within a single nation. Traditional accounts of secularization as overall decline of religion are not discussed. Nonetheless it is stressed that these theories are employed as resources in the activity of religious groups, or, in other words, that the perceived decline of religion has implications for social change. French Partant de l’idée que la religion est socialement relevante dans la mesure ou` elle influence l’action, l’article invite à repenser la sécularisation non plus comme un processus historique de long cours, mais comme une propriété de l’action: une action (ou un domaine d’action comme l’économie, la guerre, l’art, l’alimentation, la sexualité) serait alors sécularisée si les acteurs ne sont pas influencés par une doctrine ou un sentiment religieux et s’ils n’en donnent pas une justification religieuse. Cette définition, d’origine wébérienne, devrait ětre opérationnelle pour la recherche qualitative et prěter attention aux différences et aux interactions entre groupes et individus, měme au sein d’une měme nation. Les définitions de sécularisation comme déclin général de la religion ne sont pas discutées ici. Pourtant, l’auteur souligne que ces théories sont aussi des ressources pour l’activité de groupes religieux, autrement dit que la perception du déclin de la religion a elle-měme des conséquences pour le changement social.