bluuebunny/crossref_metadata_2025_split huggingface dataset:
On the Possibility of an Upper Limit on Magnetically Induced Radius Inflation in Low-mass Stars
Authors: MacDonald J. , Mullan D. J. 
Published: February 2024

Abstract
The radii of low-mass stars are observed to be inflated above standard model predictions, especially in magnetically active stars. Typically, the empirical relative radius inflations ΔR/R are ≤10% but in (rare) cases may be ≥20%. Our magneto-convective stellar models have already replicated many empirical ΔR/R values. Here, we ask: is there any theoretical upper limit on the amount of such inflation? We use our magneto-convective model to compute ΔR/R using empirically plausible values of the surface field strength parameter δ. Inside each model, the maximum internal field is set to a particular value: B
ceil = 10, or 100 kG, or 1 MG. When B
ceil = 10 kG, peak inflation with ΔR/R ≈ 90% occurs in stars with masses of 0.7 M
⊙. With B
ceil = 100 kG, peak inflation with ΔR/R ≈ 140% occurs in stars with M ≈ 0.5 M
⊙. But with B
ceil = 1 MG, we find no peak in ΔR/R as a function of δ; instead, the larger δ is, the larger ΔR/R becomes, reaching 300%–350% in the case of the largest δ considered. Thus, magneto-convective modeling can accommodate ΔR/R values which are considerably larger than any reported empirical inflations. We find that a maximum occurs in ΔR/R as a function of δ only in model stars where the field reaches its maximum strength B
ceil inside the convective envelope. Moreover, our models of completely convective stars undergo smaller amounts of relative radius inflation than models with radiative cores, a result consistent with some previous reports.
Checklist of the marine malacofauna of Culuccia Peninsula (NW Sardinia, Italy), with notes on relevant species
Authors: Mariottini Paolo , Smriglio Carlo , Oliverio Marco , Rossi Sabrina , Di Giulio Andrea 
Published: February 2024

Culuccia is a small peninsula of about 3 km2 placed in north-western Sardinia (Italy) at the margin of the Maddalena Archipelago. The marine area surrounding this Peninsula is a Special Area of Conservation, included in the European Natura 2000 Ecological Network of protected areas, but until now, no information on biodiversity of this area is available. In 2021, a research project to study both terrestrial and marine biodiversity of Culuccia has started in order to fill this gap of knowledge.
This work provides the first inventory of the marine malacofauna of the coast of Culuccia. Fifteen sites were sampled seasonally for one-year by using different sampling methods and the present study shows the results from approximately 50 scientific SCUBA and free dive surveys, carried out in all main marine habitats of the studied area. In total, 259 species of molluscs were recorded along the coasts of the Culuccia Peninsula (0-25 m depth), belonging to the classes Bivalvia, Gastropoda, Polyplacophora and Scaphopoda. Amongst the four classes recorded, gastropods were the most represented (68.83%; 173 species), followed by bivalves (25.91%; 73 species), polyplacophorans (4.86%; 12 species) and scapophods (0.40%; 1 species). Notes about distribution, conservation status and ecology for some valuable species are provided, together with images of representative species, consisting mainly of in situ photographs. Additionally, the present investigation recorded the presence of four alien species, whose Mediterranean distribution was extended to north-western Sardinia.
Short-term clinical outcomes of percutaneous biliary tract interventions: analysis of success and complication rates
Authors: Todorov Iliya , Trayanova Daniela , Tsenovski Yordan 
Published: February 2024

Introduction: Obstructive jaundice is a clinical syndrome that is commonly seen in gastroenterology. Endoscopic retrograde cholangiopancreatography (ERCP) has been recognized as a first-choice therapeutic approach, with percutaneous biliary interventions (PBIs) being a viable alternative. Recent data questions the performance and safety profile of PBIs.Aim: The aim of the present study was to assess retrospectively the short-term clinical outcomes of PBIs in terms of technical and clinical success and adverse events (AEs) rate.Patients and methods: This is a retrospective, single-center cohort study of 62 consecutive patients subjected to PBI between January 2019 and August 2022.Results: Technical and clinical success rates of 97.10% and 79.40%, respectively were established. No PBI showed statistically significant superiority over the others. None of the evaluated factors showed significant influence on the therapeutic outcome and AEs. A total AE rate of 26.5% was calculated. All AEs were moderate to severe (grade III-IV according the Clavien-Dindo system). The mean hospital stay was 7.11±3.68 days. A total of 44.1% of the patients required multiple admissions.Existing studies establish similarly high technical (75%-100%) and acceptable clinical (84%) success rates. Alarmingly high AEs incidence of almost 50% has been found in recently published studies. Infection was the most common adverse event we found in our study. Almost universally, PBIs are used as salvage techniques in patients with malignant disease, failed prior ERCP, and poor performance status.Conclusion: PBIs remain a viable option to ERCP, but stricter patient selection and a gradual transition to EUS-guided draining procedures are likely required.
Un an après le mouvement Mahsa en Iran ; les acquis, les espoirs et les regrets d’une éco-résistance féminine
Authors: Salimikouchi Ebrahim 
Published: February 2024

Cet article tente d’analyser le mouvement Mahsa (mouvement des Iraniennes contre le système politique des mollah) en utilisant une approche semi-écologique. Les Iraniennes, en particulier les générations récentes, sont engagées depuis de nombreuses années dans une résistance civile créative pour défendre une existence plus libre et plus humaine. Depuis de nombreuses années, elles ont bien compris que la libération du corps, la liberté du choix vestimentaire et du mode de vie des femmes est un prélude nécessaire à la liberté de la société. Cela fait des années qu’elles descendent dans la rue avec des chiens, des vélos et d’autres éléments non islamiques et contraires aux normes pour changer la face de la vie. Le mouvement Mahsa montre que cette approche culturelle et écologique intelligente a largement réussi. Depuis un an, elles essaient de mener à bien ce projet émancipateur avec des revendications claires et une désobéissance civile plus large sous forme de manifestations. Ce mouvement reste donc le mouvement de protestation le plus étendu et le plus efficace des Iraniens contre l’un des systèmes politiques les plus antihumains et anti-vie. Cela apporte encore de nombreux espoirs et leçons, en particulier aux femmes de la région turbulente du Moyen-Orient. Mais en plus de ces espoirs, il est aussi un révélateur de l’indifférence et du conservatisme du monde d’aujourd’hui. Le monde n’a pas soutenu les Iraniennes autant qu’il le devrait. Elles étaient plus seules que jamais ; seules mais pleins d’espoir et convaincues qu’elles sont en train d’essayer de sauver le capital le plus précieux de l’humanité et de la démocratie : la vie.
La loi du champ faible. L’invention des droits internationaux à l’assurance sociale durant l’entre-deux-guerres
Authors: Fertikh Karim 
Published: February 2024

Avant la Seconde Guerre mondiale, les assurances sociales tombent sous l’empire du droit international. La protection qu’elles offrent au « peuple international » constitué par les migrants est fragmentaire, chicanière et dictée par des considérations géopolitiques. Cependant, un « très petit nombre d’initiés », au sein des administrations nationales – en particulier, dans cet article, des commissions administratives françaises en charge de la politique d’immigration – et internationales forgent des instruments juridiques propres à garantir à certains étrangers des droits (limités) aux assurances sociales. En se basant sur des archives (Quai d’Orsay, Archives nationales, Bureau international du Travail, etc.) et en se centrant sur le cas français, cet article analyse la formation de ce droit international de l’entre-deux-guerres en mobilisant le concept de champ faible. Il montre que ce droit, initialement inventé sur le mode de la « libéralité », finit par soumettre l’administration à la logique du droit international. Inscrite dans un espace de contraintes où s’affrontent des virtuoses du droit, l’administration nationale donne à ces droits internationaux aux assurances et à l’assistance sociales une force contraignante.
Protéger les ouvriers belges du Nord de la France, de la fin du XIX e siècle aux années 1950
Authors: Marissal Claudine 
Published: February 2024

Durant la première moitié du XX e siècle, des dizaines de milliers de travailleurs belges franchissaient chaque année la frontière pour trouver de l’emploi dans le Nord de la France. Dans une région frontalière où de fortes relations de dépendance existaient avec le pays voisin, ils accédaient généralement à l’aube du XX e siècle aux organismes de bienfaisance et de prévoyance qui agissaient au niveau local. Mais pas tous, ni aux mêmes conditions que les indigents français. La misère guettait notamment ceux et celles qui, qualifiés de saisonniers et de frontaliers, continuaient à résider en Belgique et ne pouvaient dès lors accéder à la protection sociale française. Confrontées à leur précarité, des associations de terrain, des organisations ouvrières et des localités frontalières belges se sont alors mobilisées pour assurer leur protection et obtenir leur inclusion dans les nouvelles législations sociales françaises.
‪Enseigner à penser critiquement ‪‪pour intervenir socialement‪
Authors: Motoi Ina 
Published: February 2024

D’autre part, plusieurs angles de vue, et surtout pas un seul, s’ouvrent sur les mêmes situations. Différentes modalités de réflexivité ou perspectives critiques sont enseignées pour comprendre les personnes à accompagner et ne pas leur imposer un dogme posé comme seule vérité ou raisonnement possible : la pratique réflexive, la conscientisation, la critique sociale, la pensée critique dialogique et la délibération éthique (Motoi, 2014, 2016, 2020). Le rôle critique de chacune se complexifie en s’approfondissant par la continuation de l’une dans l’autre. Dans ce sens, ces perspectives rendent visibles « la contradiction ample entre rectitude politique et pensée critique », et « la tension forte entre liberté de pensée [et de conscience] et justice administré » (Motoi, 2014, p. 8). Elles s’appuient sur deux cheminements de la pensée qui participent à la construction du rapport direct de l’étudiant au savoir : le cheminement d’une pensée naïve à une pensée réflexive et celui d’une pensée réflexive à une pensée critique dialogique. Ce qui en découle, « n’est pas un produit ou un résultat, mais un processus » (Daniel, dans Kpazaï, 2015, p. 49) d’une pensée réflexive qui cherche à saisir son contexte d’émergence sociohistorique et à se développer comme pensée critique dialogique qui est intersubjective. Ce qui lie les individus cognitivement, mais aussi socialement. Ce qui est aussi posé comme une responsabilité citoyenne partagée en travail social.
La « régulation des consommations » en addictologie : vers un nouveau paradigme socio-éducatif ?
Authors: Dutilleul Brandon 
Published: February 2024

Cet article souhaite rendre compte de la pertinence d'un changement de paradigme en addictologie en s’appuyant sur une dimension socio-éducative. Après avoir longtemps considéré l'addiction comme une maladie et l'abstinence comme seul moyen de traiter l’addiction, il semble aujourd'hui important de reconnaître certains effets d'efficience thérapeutique contrastés que ces approches induisent. À l'heure d'une reconsidération de cette philosophie d’accompagnement, déjà engagée par d'autres, il nous semble important de requestionner la place du choix dans les stratégies d’accompagnement proposées et la présence des consommations dans les parcours de vie. L’approche par la « régulation des consommations » permet justement de réintégrer le sens que les acteurs accordent à l’expérience vécue et singulière de leur(s) consommation(s).
Designing Silicon Interposers for 2.5/3DIC Heterogeneous Integration - Meeting Foundry and OSAT Requirements
Authors: Cone Chris , Metcalfe Jamie 
Published: February 2024

End market demand for higher performance, higher bandwidth and higher throughput processing such as AI, HPC, VR, 5G and even autonomous vehicles is driving the trend of heterogenous integration of ASICs, chiplets and memory, including HBM, onto advanced high-performance substrates using 2.5 and 3D IC assembly techniques that are manufactured using silicon or silicon-like processes. There are multiple suppliers of such advanced high-performance substrates ranging from the one stop mega foundries to multiple OSATs of different sizes. It’s fair to say that all of them have common design requirements or constraints that must pass a rigorous verification process of the manufacturing mask files (GDSII or OASIS). Such GDSII or OASIS files are post processed or exported from the physical design tools making the need to create the mask files with 100% fidelity an additional challenge to the design team. In this paper we will cover the major steps needed to design and implement an advanced silicon-based interposer that addresses common requirements of foundries and OSATs. We will talk about what each step is, why its required, any challenges that exist in addressing the step and actual design examples for each step. The major steps we will cover include: • What information you need from your manufacturer? • Definition of connectivity floorplanning of the interposer • Defining the interposer materials stackup vias for routing • Breakout or fanout routing from chiplet or IC pads • Power and ground mesh creation • Routing of interposer connectivity • Generation of interposer manufacturing data (GDS/OASIS) • Verification of the design to meet foundry/OSATs rules • Handoff to foundry/OSAT At the end of this paper attendees will understand what the major workflow steps for interposer design are and why. What general information they will need to obtain from their manufacturer in order to start design and how to use it. They will learn what each design step entails with clear examples which will enable creation of workflows to successfully handoff their designs to their chosen foundry or OSAT manufacturer.
EMI Shielding for System in Package Using Spray Coating and Silver Particle-Free Ink
Authors: Hannani Sima , Lemieux Melbs , McKerricher Garret 
Published: February 2024

There is a constant drive to pack electronics into smaller spaces. Recently, IoT devices such as smart watches, wearables and other connectivity devices have been major drivers of further miniaturization and spurred System in Package ‘SIP’ innovations. SIP enables several integrated circuits (ICs) along with larger capacitors/inductors to be housed in one package. Many of these ICs operate at radio frequencies and the proximity increases electromagnetic interference (EMI). The traditional solution of soldering a ‘metal can’ is not feasible. On the other hand, 5G enabled devices and high frequency communication electronics require shielding well beyond RF, typically 5 ? 25 GHz and beyond. Compartmental and conformal shielding of the package is necessary and sputtered metal has typically been utilized to provide the shield. The traditional sputtering method is a Physical Vapor Deposition process (PVD) that involves vaporizing a metal and depositing it onto the surfaces of the components. PVD is currently the most commonly used method to apply the EMI shield and it requires a complex, multi-step process. Alternatively, the technology is seeing a shift to sprayable or jettable conductive-based ink conformal shielding. This approach brings about substantial total cost of ownership and UPH/throughput advantages as the ink-based processes (spray/jet) does not require vacuum, and relatively low temperatures (at or below 180C in most cases). From a technology perspective, ink-based approaches have the advantage in shielding complex 3D, non line-of-sight packages and electronic module housings, directed (mask-less) shielding with no major drop in shielding performance or REL (reliability) behavior.
The Grinding and Polishing Technology for Various Materials
Authors: Pinto Bob , Clayfield Peter , Inoue Takeru 
Published: February 2024

We (Okamoto Machine Tool Works, Ltd.) present our grinding and polishing technology for various materials such as resin, Cu, BG tape, SiC, GaN. Our technology is able to grind and polish various types of materials from soft materials to hard materials. We have been developing a special grinding technology for soft materials. The technology is called HPD and enables to grind the soft materials which were not able to be ground with a standard grinding process or needed to be ground by rough grid size grinding wheels. You also had to make the grinding wheel wears a lot even the rough grid size grinding wheels are used in order to grind those soft materials due to the clogging. The HPD technology prevents this issue. Moreover, thanks to this technology, you can use high mesh wheels such as #4000 - #30,000. We believe that the HPD technology can be an effective technology for FOWLP, PLP, TSV grinding and BG tape grinding of flip-chip/high bumped wafers for flatness improvement. Our technology is not only for soft materials but also for difficult cut materials such as SiC and GaN. We developed high power and high-rigidity grinder for these materials. We are going to look through the SiC grinding result with our technology. Moreover, we have developed polishing technology for various types of materials including Si, SiC, GaN, InP, GaAs, and more. Our grinding and polishing technology can cover various types of materials. It is hoped that our technology helps your current process issues.
Cost Analysis of Fan-out Processes for Chiplet Packaging
Authors: Lujan Amy 
Published: February 2024

When building a design around chiplets, there are many factors to consider: industry standards, availability of chiplets within the supply chain, size requirements, and cost, to name a few. The cost of chiplet packaging is a particularly important factor that must be understood, because even if all design requirements can be met, the chiplet package will not come to fruition if the total cost is too high. The basic tradeoff between a monolithic die and a series of chiplets is a reduction in silicon costs countered by an increase in packaging costs. This analysis will compare a monolithic die flip chip package to two fan-out processes that support chiplet packaging. In the first scenario, a two-chiplet chip-last fan-out on substrate package will be compared to a standard flip chip package. For the second comparison, a monolithic flip chip package will be compared to a four-chiplet fan-out package that utilizes embedded silicon for additional interconnect. For both scenarios, a detailed cost comparison will be provided. Activity based cost modeling will be used for this analysis. In addition to looking at the direct costs of the substrate and assembly processes, yield considerations and the price of the incoming silicon (which varies by node) will be included. The goal of this analysis is to evaluate the cost of a monolithic flip chip package versus a chiplet scenario for two designs, and to highlight the cost drivers of the fan-out chiplet packaging processes.
D2W Hybrid Bonding Using High Accuracy Carrier Solutions for 3D System Integration
Authors: Uhrmann Thomas , Burggraf Jürgen , Pires Mariana , Fan Chun Ho , Ng Hoi Ping , Li Ming 
Published: February 2024

Die segmentation and chiplet integration is gaining considerable industry momentum and seen as one important integration process for 3D systems on chips. As interconnect pitches in 3D packaging become tighter with each new product generation, wafer and die bond alignment and overlay processes must also scale accordingly. 10µm pitch is setting a junction in interconnect technology. On the one hand, it is seen as the inflection point of hybrid bonding. At the same time, these extremely tight pitches enable functional partitioning of device functions onto different dies (chiplets) using die-to-wafer (D2W) hybrid bonding or wafer-to-wafer (W2W) hybrid bonding. D2W hybrid bonding is evaluated in different integration processes. While direct placement of fusion bondable dies from a film frame is researched intensely, another option is to reconstitute dies on a carrier wafer and collectively transfer the dies using W2W bonding equipment. In the presentation we will elaborate on all aspects of the die to wafer bonding for a successful single chip type process towards a full system transfer approach. We will show alignment data of the dies on the transfer carrier targeting a pick and place accuracy of <500nm and report on the alignment evolution during the process until final annealing. Further elaboration will be done on different die sizes and die thicknesses. The die flatness and high variation over the whole wafer will be evaluated according to the die dimensions. Most importantly the die high variation and planarity will be shown for different carrier systems such as thermoset and thermoplastic materials, evaluating the bonding performance in terms of alignment propagation bond line integrity.
Optimizing New Power Switch Technology
Authors: Sadri Sam 
Published: February 2024

Power switches are critical components in power conversion for a wide variety of applications, including DC-AC inverters for electric vehicles (EVs), solid state breakers, and energy storage devices. Improving the efficiency and performance of semiconductor power switch components can have wide benefits, improving the efficiency and accelerating deployment of these applications. Compared to conventional power switches, such as insulated-gate bipolar transistors (IGBTs), the B-TRAN™ bidirectional power switch from Ideal Power offers significant improvements in efficiency, reducing power losses by 50% or more depending on the application. With its higher efficiency, B-TRAN results in less heat being generated and thus has significantly lower thermal management requirements. In addition, a single B-TRAN™ replaces multiple conventional power switches for bidirectional applications. Beginning in mid-2020, Ideal Power teamed with QP Technologies, a leading provider of microelectronic packaging and assembly services, to package their B-TRAN switches in various TO packages (a wide range of small-pin-count packages often used for discrete parts such as transistors or diodes). The development work started with TO-247, then moved TO-264 packages, and finally transitioned to a custom direct-bond copper (DBC) solution. To achieve a high-reliability design, QP Technologies and Ideal Power focused on developing die and packaging designs based on flip-chip technology in lieu of wirebonding to maximize the life cycle of the product. This paper investigates the challenges, solutions and finally the fabrication of the first double-sided B-TRAN device.