bluuebunny/crossref_metadata_2025_split huggingface dataset:
Some Aspects of Multilayer Ceramic Chip Capacitors for Hybrid Circuits
Authors: Noorlander W. 
Published: June 2007

It is shown that both European and American standardization committees specify the dimensions in the same
grid and that there is no standardization of the thickness in relation to the capacitance.Of the ceramic dielectrics, special attention is paid to the instability of capacitance and losses of type II
materials due to temperature and voltage treatment.The conductivity of the inner electrodes determines the losses at 1 MHz in type I dielectrics. It is shown
that the economically interesting partial replacement of Pd by Ag can cause an increase in the losses: other
substitute metals seem more promising.The last aspect discussed is the end terminations of the capacitors. In the case of silver/palladium end
terminations the Ag/Pd ratio should be smaller than two.
The Structure and Properties of Reactively Bonded Thick Film Gold Conductors
Authors: Coleman M. V. , Gurnett G. E. 
Published: June 2007

The properties of reactively bonded gold conductors have been compared with a fritted gold conductor (DuPont
9260). Several different additives in the gold conductors were examined, including copper/copper oxide; copper
plus cadium/germanium and copper cadium and bismuth.The adhesion strength of all the conductors was found to be superior to the fritted standard, but the electrical
conductivity did not appear to be improved. These materials thus offer advantages where stronger adhesion is
required or possibly, where the interface between conductor and substrate needs to be well‐defined.
The Development of Precision Thin Film Resistors for Submerged Repeater Applications
Authors: Spiller D. O. 
Published: June 2007

The paper describes development of a low inductance thin film resistor series with a stability of ±0.15% change in
resistance, over a 25 year life, in a submerged repeater environment. (40% RH maximum and 0 to 30℃ ambient
temperature).It was first necessary to establish an appropriate mathematical model relating resistor stability with time and
temperature. This was devised from experimental data based on measured resistor drift at various temperatures, and
enabled acceleration of resistor drift to be carried out to ensure that each resistor possessed the required stability.Deposition of a secondary nichrome layer protects the gold/nichrome interface and promotes SiO2 adhesion.
This results in an improvement in the basic elevated temperature resistor stability by minimising diffusion effects of
nichrome into the conductor, and protection against electrochemical corrosion as demonstrated by 10,000 hours life
test at 83% RH @ 28℃ on 5 mW load and by elevated temperature tests under electrical loading.
Tantalum Thin Film Capacitors With Various Types ofCounterelectrodes
Authors: Ferraris G. P. , May R. 
Published: June 2007

Capacitors have been prepared from N2‐doped, triode sputtered Tantalum films by conventional anodization and
photolitographic techniques.NiCr–Au, Ta–Ti–Pd–Au, Ta–NiCr–Pd–Au have been used as counterelectrode materials and the a.c. and d.c. properties of the capacitors have been compared.It has been found that a doped Ta thin layer deposited by sputtering between the dielectric and the top electrode
does not negatively affect the capacitors characteristics; moreover, a thermal treatment at temperatures as high
as 350℃ can be tolerated.If the Ta film deposited after the dielectric formation is used for resistive elements, a fully compatible R–C
process is obtained which requires only two vacuum deposition cycles and four photolithographic steps.
Some Observations on the Accelerated Ageing of Thick‐Film Resistors
Authors: Sinnadurai F. N. , Spencer P. E. , Wilson K. J. 
Published: June 2007

Methods of accelerating the ageing of thick‐film resistors (TFRs) have been explored, with encouraging results from
experiments in which elevated temperature and damp heat were inflicted on TFRs. Consistent acceleration was
obtained by increasing temperature, whether by storage or dissipation, the activation energies for thermal ageing of
various resistor families lying in the range 0.5 eV–1.5 eV. Acceleration by humidity (RH) was also obtained,
corresponding, for example, to a halving of life for a 20% increase of RH, some resistance changes being about an
order of magnitude larger than those obtained at elevated temperature. The encapsulations played a dominant role
in the degradation of resistors under both stress conditions.According to the theories of conduction, degradation could occur because of reactions at conductive sites,
causing corresponding changes in the conductivity and resistance versus temperature (R(T)) characteristics.
Progressive degradation certainly did occur, as evidenced by the conformity of the ageing behaviour to a diffusion‐type
(time)1/2 dependence accompanied by shifts in the R(T) characteristics. Some interpretation of the
degradation has been possible by referring to an empirical model of the temperature dependence of resistance, but
conflicting changes can be reconciled with the model only by postulating competing degradation mechanisms. The
report covers an early stage of the work.
An Improved Thick Film Aluminium Conductor Process
Authors: Cooper R. E. , Linford P. F. T. , Savage J. 
Published: June 2007

Aluminium thick film conductors offer very large cost advantages compared with noble metals and can also improve
the reliability of circuits by eliminating gold‐aluminium interfaces and their attendant intermetallic phenomena. To
date however, it has not been possible to produce aluminium thick film conductors which are ultrasonically
bondable to aluminium‐silicon wire.This paper describes a study of the microstructure and line profile of a commercially available aluminium thick
film paste as a function of firing schedule. Scanning electron microscopy has revealed the mechanisms which control
the sintering process and has suggested a revised firing schedule. It is shown that firing schedules exist which yield
conductors with adequate ultrasonic bondability and conductivity. The results of bond ageing experiments on bond
strength and conductivity are given for periods of up to 1200 h at temperatures of 60–200℃.It is shown that bonds of aluminium wire to aluminium thick film are resistant to loss of bond strength but suffer
from loss of conductivity on ageing at 150℃.
How International Component Standardisation Affects Specificationand Design Work in India
Authors: Goswami Amit P. 
Published: June 2007

The specification systems available to the Indian component manufacturers are discussed and the influence these
have on the markets are examined. Quality control methods used to meet specifications are noted.The influence of the Indian Government′s pricing policy on the encouragement of indigenous production of
components has an important effect, particularly with regard to the export and import of components. The
differences that exist between component groups are outlined and it is shown that there are still important areas
where overseas collaboration is encouraged.
On the Sensitivity of Canonically Extended RC‐Active MultiloopFilters
Authors: Massara R. E. 
Published: June 2007

A class of multiloop active filters based on a double RC ladder of simple recurrent structure, constrained by a single,
positive gain, voltage‐controlled voltage source has received recent attention in the literature.Some design considerations are discussed in this paper and sensitivity results are presented which permit
comparisons to be made between filter realizations with different types of capacitance spread constraints. It is
shown that the common practice of constraining all capacitors to be equal leads to high sensitivity and that, by
relaxing this zero‐spread requirement, much more favourable sensitivity results can be obtained.
Sintering Mechanisms in Base Metal Conductors
Authors: Degraeuwe J. , Brauns E. , Van Overstraeten R. , Roos J. , Govaerts R. 
Published: June 2007

Thick film conductors based on Al, Cu and Ni have been studied. Because of its high depth of field, a SEM was
used to study the microstructures of the fired conductors.Because of the very small size of the particles in commercial Cu pastes the neck growth forms part of the grain
growth mechanism.The bonding between the particles is much stronger in Cu than in Al films; this seems to be the reason why the
sheet resistance of a Cu film virtually reaches the theoretical minimum.
Ni‐P as a New Material for Thick Film Technology
Authors: Barycka I. , Hołodnik B. , Misiuk A. 
Published: June 2007

The product of nickel ions reduction in buffered solution by hypophosphite, known as Ni‐P, was examined as a
potentially useful material for thick film technology. This material, when mixed with glass oxidizes if heated above
450℃ in an air atmosphere. For this reason we investigated the possibility of using an additive to stabilize the Ni‐P
against oxidation. We found that B2O3 as an additive showed itself to be most satisfactory. A detailed investigation
of the phase relations in heated Ni‐P, Ni‐P‐glass and Ni‐P‐glass‐B2O3 compositions was performed. The inks
prepared so far from the mixture of Ni‐P‐glass‐B2O3 can only be used in thick film technology for conductor layer
production (R□∿0.1Ω).The most satisfying and practically useful characteristics were obtained for inks produced from solid
components containing 45 to 80 wt% Ni‐P and about 10 wt% B2O3.
Permanent Interconnection Technology
Authors: Campbell D. S. , Boswell D. 
Published: June 2007

This paper is concerned with the permanent connection of electronic components into sub‐systems and is based on
the report of an ERC Working Party that investigated the subject during 1978 and 1979. After an initial description
of the interconnection concepts and the relationship the field has to electronic assembly systems in general, a survey
is given of the marketing data that is available that defines the economic importance of the field. This survey
includes new data obtained by the Working Party. Figures are given for the rest of Europe in general and the UK in
particular and it is noted that the Output at Sales Value in the UK of intereconnection technology products is almost
the same as the Output at Sales Value of ICs in the UK. Within permanent interconnection technology two‐thirds of
the Output at Sales Value is associated with PWBs and one‐third with thick/thin film circuits.Research Work in the field is discussed and a division between immediate time scale problems and those involving
a longer time scale is suggested. Twenty‐nine immediate time scale R & D problems have been recognized covering
all three interconnection technologies; longer time scale problems will be associated with the continuing decrease in
the size of add‐on electronic components.It is concluded that large, fast computer systems will require a decrease in the size and spacing of interconnections
to match those of the semiconductor chip. This means simultaneous design of semiconductor and
associated interconnection structures tasks well‐suited to vertically integrated companies. In contrast, many real
time subassemblies will benefit from greater chip complexity and need fewer outgoing leads per chip, i.e. at wider
spacings – needs that can be met by the development of existing techniques. Finally it is suggested that future
distribution of added value in electronic assembly operations is likely to give all sectors of interconnection business
a steady upward sales trend, with both hybrid and semiconductor manufacturers seeking specialized subsystems
markets to replace their present “all things to all customers” policies.
The Solution of Two‐Dimensional Heat Conduction Problems for Predicting Operating Temperature andPower Handling Capabilities of Hybrid Circuits
Authors: Ferraris G. P. , Tudanca M. 
Published: June 2007

The problems of heat conduction in hybrid thin and thick film circuits have been investigated using both
analytical and numerical approaches.The calculations were restricted to two dimensions by assuming zero temperature gradient across the thickness
of the substrate (slightly more than half millimeter).All normally recognized parameters were taken into consideration, such as film temperature, power dissipated,
substrate area, etc.Allowances have also been made for lead conduction and connection technology, for horizontal or vertical
circuit assembly, and for flush or stand‐off mounting on the mechanical support.The measured results for practical cases show close agreement with the theoretical calculations.This approach provides a simple tool for the calculation, at an early design stage of power handling capacities
of hybrid circuits using composite resistive configurations.Very little difference was found between temperatures predicted from the theoretical approach and those
measured in practical cases of circuits under load.The availability of such accurate design information means that the stability, life, and reliability of hybrid
circuits can be predicted with considerable accuracy at an early design stage.
Development of Substrate Carrier System
Authors: Miura N. , Fuura Y. , Uchida K. 
Published: June 2007

The Substrate Carrier System (S. C. System) is a new manufacturing technique for small size hybrid IC with IMST
(Insulated Metal Substrate Technology)substrate which is used for power hybrid IC (STK series). The point of this
system is to treat both substrate process and assembly process in the manufacturing process of hybrid IC, with several
IC substrates at the same time. In the printing process, multi‐IC pattern are made on a large IMST substrate at the
same time and the substrate after completion of printing process are slit‐punched to have the frame configuration
where individual IC substrates are conected by tie‐bar. Moreover in the assembly process which involves
die‐bonding and wire‐bonding, the substrate is carried by the pitch of IC substrate, utilizing the frame construction,
which can provide the automatic processes.This Substrate Carrier System is applied to many kinds of hybrid IC for low‐frequency applications as a system of
high reliability and productivity.
IC Packaging Technology for Electronic Watches
Authors: Iinuma Yoshio 
Published: June 2007

IC‐Quartz watches have been manufactured since the appearance of CMOS‐LSI about seven years ago. Nowadays,
the outside view of the quartz watch is the same as that of a mechanical watch through minimizing electronic parts such
as battery, crystal oscillator, capacitor, and IC packaging volume. Recently, IC packaging technology for electronic
wrist watches (both the analog quartz watch and digital quartz watch) has made a step foward. In Japan, some watch
makers adopt a film carrier assembly technique for producing thin and low‐priced watches. They are using 3 layers and
35 mm wide film which fits very well the substrate of the quartz watch, especially the digital quartz watch.The Citizen Watch Co., Ltd. started an investigation as to which method was suitable for IC package for watches in
1975 and adopted a flip chip technique as being the most suitable for analog quartz watches. The flip chip technique
will allow the fabrication of a very small and thin package. Important characteristics of the technique permit design
flexibility and high density packaging of the ICs. In this paper, a flip chip technique using a Printed Circuit Board as a
substrate is described.
Copper Materials System for Microcircuitry: A Status Report
Authors: Mitchell J. D. , Donohue P. C. , Needes C. R. , Funer R. E. , Uhler R. O. 
Published: June 2007

The electronics industry has become interested in a thick film materials system based on copper for both technical and
economic reasons. Copper conductors offer excellent conductivity, solderability, and solder leach resistance as well as
lower intrinsic metal cost and price stability.Significant adoption of copper in thick film applications requires a complete system of materials for the designer and
manufacturer to choose from and sufficient processing information to assist the industry to get started. Industry has
begun the adoption of copper in selected applications. Design of new applications and experience in processing will
move this technology forward in the industry.Du Pont has developed a copper materials system which includes copper conductor compositions, low K dielectric
and compatible resistor compositions. The compositions are screen printed, dried in an air atmosphere at 120℃ for
ten minutes and fired in a nitrogen atmosphere to a peak temperature of 900℃. All materials in the copper system
may be processed in commercially available atmosphere conveyor furnaces using commercial nitrogen.The copper compositions provide high adhesion conductors with resistivity values in the range of one to two
milliohms per square. They can be used to make multilayer interconnect structures, microwave circuits, and as a
replacement for Mo‐Mn metallizing. In addition, copper may be used as the conductor on porcelain‐enamelled steel
substrates. The dielectric composition provides a dense film with a dielectric constant of about eight which can be used
With copper to make multilayer interconnect structures. The resistor compositions produce resistors with temperature
coefficient of resistance (TCR) less than 150 ppm per ℃ and are useful for resistor networks and hybrid microcircuits.
Fundamental Characteristics of Solvent–Soluble Polyimide Resin as aPolymer for Hybrid Applications
Authors: Watanabe Eiki , Kanou Kyoichi , Kubota Tadashi 
Published: June 2007

Polyimide resin of solvent‐soluble type, which is called “X‐resin” in short, was discovered lately. It is soluble in
dimethylacetoamid (DMAc), and new extensive applications are expected.Some physical, chemical and electrical characteristics are studied from the viewpoint of polymer material for hybrid
application. Particularly comparison of the characteristics of X‐resin specimens before and after long term exposure
to humid and hot environments were made, remembering that electronic devices often operate under such conditions
in Japan.From the results obtained up to now, no conspicuous difference seems to exist between the characteristics of X‐resin
and those of the conventional (i.e., solvent‐insoluble) resins, as published in various literature. It should be noted,
however, that some unusual effects, i.e., the remarkable increase in surface resistivity σ, the evident decrease in tan δ,
etc., were found in X‐resin specimens after going through the above‐mentioned damp‐hot test. All those effects are
contrary to the usual concepts of deterioration of polymer materials, but are rather advantageous for hybrid
application. It is also worth noticing that silver migration into X‐resin seems scarcely to occur.Furthermore, new prospective uses of X‐resin for printed wiring boards, packaging materials, binder for paste
materials, etc., are investigated.
The Effect of High Speed Laser Trimming on Accuracy and Stabilityof Thick Film Resistors
Authors: Coté René E. 
Published: June 2007

Many recommendations have been made on the proper operating conditions for the laser trimming process. In
general these recommendations have centered on accuracy, precision or throughput. In some instances, these have
appeared to be mutually exclusive. If one wanted accuracy and precision, one had to sacrifice trimming speed and,
therefore, throughput.It has been reported that 40% of the processing cost of a thick film resistor network is due to laser trimming. To
continue to make these networks commercially attractive, the manufacturers of laser trimming systems have addressed
themselves to the problem of providing suitable cuts at higher and higher trimming speeds.It is important for the user of such a system to understand the basics of the trimming process and to have an
appreciation for the new factors which will affect the performance characteristics of laser trimmed thick film resistors.
This paper summarizes the previous work as it relates to present technology. It then attempts to develop new
guidelines for high speed laser trimming.
Heat Treatment of CdSe Thin Films and Application to Photopotentiometers
Authors: Sato Masuji , Kawai Satoru , Yamada Fumiaki 
Published: June 2007

Effects of heat treatment have been studied in a nitrogen atmosphere for improving the characteristics of poor
photoconductive CdSe evaporated films. The following results were obtained. At first light resistance and dark
resistance greatly decrease after the heat treatment of evaporated films in a pure nitrogen atmosphere for an hour.
The ratio of dark resistance to light resistance under irradiation of 1,000/ux remained as low as an order of magnitude
of 10. Secondary increase of an order of magnitude of 106 or 107 in dark resistance is obtained, adding to the post
treatment in N2 + O2 atmosphere for thirty second after the main heat treatment in N2 for an hour. The ratio of dark
to light resistance becomes an order of 108 and as for photoresponse, both rise and decay time of photocurrent
become 0.5 ms. The results indicates that heat treated films have characteristics of good photosensitivity and quick
response in photocurrent.The photopotentiometer has been analysed by using the transmission line theory and device input–output
characteristics have been related to the properties of the resistive film and photoconductive film of the device.The photopotentiometer using the improved photoconductive CdSe thin film has been fabricated and examined.
A good independent linearity of less than 2% at a speed of 2000 rpm is obtained.
Solder Paste Process of Hybrid Circuits
Authors: Takasago Hayato , Adachi Kohei , Ohnishi Youichiro , Tazuke Kazuo 
Published: June 2007

This paper describes the critical factors required for the solder paste process and its applications to Hybrid Circuits
(Solder Paste Process). It also describes the fine solder printing of substrate pads for flip chip IC and the
simultaneously thick printing of solder paste for chip capacitors and/or other parts.Through this “Solder Paste Process”, assemblies of good quality and higher yields are achieved. The results of
various evaluation and reliability tests were excellent. From this study, some new applications of solder paste are
presented.
Gold Conductor Pastes for High Density Circuit
Authors: Kadota Shiro , Shibata Koshiro 
Published: June 2007

High grade quality in fine‐line printability, non‐porosity of fired film and adhesion to substrate is required for gold conductor pastes applicable to multilayer or high density circuit. Many kinds of gold pastes were made by the changing of types and contents of main components such as gold powder, glass frit and organic vehicle. The important properties of the fired samples of the above pastes on alumina substrate and fired dielectric pastes were compared.Gold paste of the mixed bond type was recognized as superior in adhesion to alumina substrate, while that of the fritless type was found superior in adhesion to the fired dielectric paste and wire bondability. It is possible to print line of 70 μm width and spacing by using these gold pastes. If suitable printing conditions including screen are chosen, even 50 μm line width and spacing can be made. Non‐porosity measured by means of the back light porosity test and low resistivity of the samples met the requirement for the high density circuit.In this paper, various properties of the above mentioned gold pastes which are most suitable to two different type substrates will be described. Also the relation between the properties and compositions of the samples will be discussed.