bluuebunny/crossref_metadata_2025_split huggingface dataset:
Alpha-to-proton Temperature Ratio Distributions Using Parker Solar Probe Measurements
Authors: Amaro Mário B. , Vaivads Andris 
Published: March 2024

Abstract
The distributions of the temperature excess of alphas to protons (ε) were studied using Parker Solar Probe measurements for Encounters 2 through 14. The distributions were mapped based on heliographic distance, Coulomb number, plasma β, and Alfvén Mach number (M

A
). The importance of collisional effects in the thermalization of solar wind is observed for a wide range of Coulomb numbers. The distributions correlate better with N
β and NM

A
than just N. Furthermore, evidence was found for a narrow region immediately above the Alfvén surface (1 < M

A
< 2) where ε has values much higher than the mass ratio.
Small-scale Anisotropies of Cosmic Rays from Turbulent Flow
Authors: Zhang Yiran , Liu Siming 
Published: March 2024

Abstract
Within the classical convection–diffusion approximation, we show that the angular distribution of cosmic rays (CRs) in a highly turbulent flow may exhibit significant small-scale anisotropies. The CR intensity angular power spectrum C

ℓ
is then a direct reflection of interstellar turbulence, from which one expects C

ℓ
∝ ℓ
−γ−1 for ℓ ≫ 1, where γ is the power-law turbulence spectral index. Observations by IceCube and HAWC at TeV energies can be explained approximately with the Kolmogorov law γ = 5/3 with a convection velocity dispersion of 20 km s−1 on the scale of 10 pc.
Un objet pédagogique territorialisé pour enseigner les transitions et l’agroécologie
Authors: Peltier Christian 
Published: March 2024

Les transitions et l’agroécologie, et leur enseignement, interrogent les cultures professionnelles des enseignants tout autant que des professionnels de l’agriculture. Dans l’enseignement agricole français, le plan stratégique « enseigner à produire autrement » et la mise en œuvre de l’évaluation capacitaire dans des référentiels de diplôme, constituent une opportunité pour repenser les processus d’apprentissage et les évaluations comme problématisation et conceptualisation du sens des activités enseignantes. Dans cet article, nous prenons appui sur un dispositif où des situations territoriales polarisées par un objet significatif et problématique en termes de durabilité (le « poulet d’élevage », la « luzerne en collectif », etc.) sont médiatisées en situations d’enseignement-apprentissage que nous qualifions de « jeux authentiques ». Nous proposons ainsi trois outils pour une évaluation-régulation des pratiques des enseignants (activités de conception, implémentation, réassurance) et des apprentissages des apprenants dans la perspective d’un agir plus soutenable.
Evaluation of the Safety of Uninterrupted Warfarin Anticoagulation With Tranexamic Acid in Total Joint Arthroplasty
Authors: Johnston Michael G. , Porter Matthew A. , Eppich Kade E. , Gray Celeste G. , Scott David F. 
Published: March 2024

Background:
The continuation of long-term warfarin therapy is gaining acceptance in minor surgeries but maintaining therapeutic international normalized ratio (INR) values among patients during major orthopedic procedures raises concern. While bridging therapy with low-molecular-weight heparin is currently recommended for patients receiving anticoagulation, few studies have evaluated the safety of continuing warfarin during total joint arthroplasty. This study evaluated the safety and efficacy of continuous warfarin anticoagulation through total joint arthroplasty with and without prophylactic tranexamic acid (TXA).

Materials and Methods:
We conducted a retrospective, matched-pair analysis of two experimental groups of patients who underwent primary total hip arthroplasty or total knee arthroplasty performed by a single surgeon. Our first experimental group, warfarin plus TXA (warfarin+TXA), consisted of 21 patients who underwent arthroplasty while receiving therapeutic anticoagulation with warfarin (INR, 2.0–3.0) and who received prophylactic TXA. Our second experimental group, warfarin without TXA (warfarin-TXA), consisted of 40 patients who underwent arthroplasty while receiving therapeutic anticoagulation with warfarin (INR, 2.0–3.0) without prophylactic TXA.

Results:
The percent change in hemoglobin value after surgery, red blood cells transfused, surgical site infections, bleeding complications, and thrombotic complications were similar between both experimental and control groups. When comparing the historical group with the warfarin+TXA group, the addition of TXA resulted in a statistical decrease in mean red blood cells transfused and estimated blood loss, with no statistically significant increase in complications.

Conclusion:

Many factors must be considered when choosing perioperative thromboembolic prophylaxis for arthroplasty candidates with medical comorbidities requiring long-term anticoagulation. This study presents data indicating that it could be safe and effective to continue therapeutic warfarin while using prophylactic TXA. [
Orthopedics
. 2024;47(4):211–216.]
Utilization of the Reinstein ICL Sizing Formula With Hand-held Ultrasound Biomicroscopy Measurements
Authors: Izdebska Justyna , Bombuy Gimenez Jan , Przybek-Skrzypecka Joanna , Szaflik Jacek Paweł , Skrzypecki Janusz 
Published: March 2024

Purpose:
To evaluate the accuracy of the Reinstein formula with hand-held ultrasound biomicroscopy (UBM) measurements for sizing of the Implantable Collamer Lens (ICL).

Methods:
A total of 107 myopic eyes of 57 patients implanted with the ICL were included in the study. The size of the ICL was selected based on the manufacturer's recommendations. Agreement between the vault predicted by the Reinstein formula and the vault measured postoperatively was analyzed with Bland-Altman plots.

Results:
A total of 95% and 81% of patients had a postoperative vault ranging from 150 to 1,000 and 250 to 750 μm, respectively. The mean vault predicted by the Reinstein formula and the postoperative vault in the current study were 580 ± 181 and 547 ± 200 μm, respectively. The size recommendations of the Reinstein formula and the formula provided by the manufacturer, the Kojima formula, and the Dougherty formula overlapped in 50%, 57%, and 49% of eyes, respectively.

Conclusions:
The results show that the Reinstein formula combined with a hand-held UBM provides reliable sizing predictions of the ICL. However, considering that robotic UBM measurements have demonstrated a narrower range of deviation in predicting vault depth in previous studies, a direct comparison study between robotic UBM and hand-held UBM measurements is necessary to fully assess the limitations of combining hand-held UBM with the Reinstein formula.

[
J Refract Surg
. 2024;40(3):e142–e147.]
Culture, occupation et résistance en Belgique et dans le nord de la France
Authors: Vandenbussche Robert 
Published: March 2024

Les historiens de la première Guerre mondiale, ont forgé le concept de « culture de guerre » pour désigner les phénomènes culturels que fait naître le premier conflit mondial : essor de la propagande, d’idéologies marquées par l’intensité et la violence, mise en valeur du « héros ». En choisissant ce thème « Culture, occupation, résistance » nous souhaitons, en référence à 1914-1918 poser cette interrogation : la Seconde Guerre mondiale engendre-t-elle également une « culture de guerre » ? Cette question peut surprendre car les conjonctures ne se ressemblent pas. La « culture de guerre » naît et se développe à partir de sociétés en guerre dont le territoire est libre d’invasion ou d’occupation et d’États qui n’ont conclu aucun armistice et qui exploitent la culture pour justifier leur combat. L’État français, en 1940, en choisissant la collaboration avec l’Allemagne nazie, ne se met pas en situation d’aider à la diffusion d’une culture de guerre analogue à celle de 1914-1918 et encourage plutôt la soumission de la société française aux exigences de l’occupant. Néanmoins, dans sa volonté de conduire la « révolution nationale », il se propose de combattre une démocratie républicaine méprisée et de mener, en quelque sorte, une offensive intérieure après avoir suspendu la guerre extérieure. Il n’hésite pas à utiliser l’art et la culture sous toutes leurs formes pour y parvenir. C’est cette perspective que le colloque de Bondues s’est efforcé d’appréhender...
Investigation of Aluminum and Gold Flip-Chip Bonding for Quantum Device Integration
Authors: Cirulis I. , Zschenderlein U. , Braun S. , Radestock M. , Pantou R. , Vogel K. , Selbmann F. , Kurth S. , Wunderle B. , Kuhn H. 
Published: March 2024

The majority of qubit chip integration is realized in a two-dimensional (2D) architecture. Whereas 3D architecture enables more advantages like efficient interconnect routing, allowing for more compact qubit coupling geometries, reducing form factor, and increased connectivity beyond nearest-neighbor interactions. Flipchip (FC) assembly has been demonstrated to enable 3D architecture connecting qubit chip, interposer, and readout in a sandwich-like structure. Moreover, 3D integration allows the fabrication of hosting chip circuitry without degrading the qubit performance [1–4]. Different material considerations have to be taken into account since qubit operational frequency is in the gigahertz range and operating temperature is in the mK range to avoid thermal excitation. Materials that possess superconducting characteristics like Indium (In), Titanium Nitride (TiN), Tantalum Nitride (TaN), and Niobium (Nb) have been discussed as potential interconnect between building blocks [3, 5]. The In bumping on Aluminum (Al) redistribution layers require under-bump metallization (UBM) layers thus introducing multiple fabrication steps before the bonding process. An alternative approach would be to use the existing Al surface to electrochemically grow Al bumps and bond the chip using thermosonic bonding (TSB) at below 150°C to form a homogeneous metal-metal interface [6, 7].
Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process
Authors: Jang Ki-Seok , Eom Yong-Sung , Choi Gwang-Mun , Joo Jiho , Oh Jin-Hyuk , Lee Chan-Mi , Moon Yoon-Hwan , Moon Seok-Hwan , Choi Kwang-Seong 
Published: March 2024

Anisotropic conductive paste (ACP) or anisotropic conductive film (ACF) consisting of a polymer matrix and a metal-coated polymer bead are introduced as interconnection materials in mini-LED display panel packaging through a thermal compression bonding process. However, this packaging solution has been leading to important problems such as alignment difficulties due to high bonding temperature and pressure, and its repair issues for bad LED devices after the bonding process. Recently, laser-assisted bonding (LAB) process for mini-LED display packaging has been introduced to solve these problems[Ref. 1-2]. This study introduces, an anisotropic solder paste (ASP) using conductive solder particles and applies it to the mini-LED packaging through the LAB process.
Silver Bonding Wire - an Alternative for Mechanical Sensitive Chip Configurations in Automotive Electronics Packaging
Authors: Klengel Robert , Klengel Sandy , Tismer Sebastian , Araki Noritoshi , Eto Motoki , Haibara Teruo , Yamada Takashi , Feldmann Jochen , Scheer Achim , Binner Ralph , Peters Henk 
Published: March 2024

Silver (Ag) bond wires are mainly used in consumer products as a reliable low-cost alternative to gold (Au) bond wires. In previous investigations, we have shown that silver wires also have potential for use in the automotive sector (1, 2, 3, 4], where the materials are exposed to particularly harsh environmental conditions. In order to understand thc intluence of these conditions in the electronic package on the silver-aluminum material system, we carried out extensive studies on test packages built on laboratory level. For the future development of challenging automotive devices, it will be important to have a cooperation between semiconductor package developer and material supplier with an assist of characterization spccialists. In this project, we formed a threeparty project in which characterization specialists, package developer, and wire manufacturer collectivcly conduct a feasibility study of a new Ag wire material for automotive application. Two wire types (standard Ag wire and new type of Ag wire GX2s) were chosen for the investigation in direct comparison regarding long-term reliability. Samples were built under mass production conditions and then subjected to various reliability tests following AEC-Q006 requirements. Subsequently, mechanical characterizations by means of ball shear and pull tests as weil as high resolution SEM microstructure analyses on cross-section samples are applied. In the paper, results of the different tests will be summarized, but a more in-depth analysis will be given to the temperature cycle test (TCT), where the most significant differences between the sample variations occurred. Overall, the results show the importance of the knowledge for the material reliability upfront a device qualification process (robustness validation) and give further guidance for material selection.
Application of Machine Learning Methods for Process Optimization in Electronic Packaging Processes
Authors: Niegisch Corinna , Haag Sabine T. , Braun Tanja , Hoelck Ole , Schneider-Ramelow Martin 
Published: March 2024

Epoxy resins are commonly used as encapsulation materials in electronic packaging processes. Fluctuations in the materials lead to both changes in processability and to varying quality. Ideally, these variations should be identified, and measures taken as quickly as possible to reduce scrap parts and thus costs. A promising optimization approach for encapsulation processes are machine learning models, which have already shown good results in quality predictions, especially for injection molding. Subsequent quality measurements are avoided with good quality prediction models. With this type of models, not only predictions can be made, but also optimal parameter combinations can be found. In this paper, models for predicting quality criteria warpage and residual enthalpy of the epoxy molding compound were set up, trained and validated. Time series of in-situ sensors were used, from which relevant features were extracted and which, together with machine parameters, provide a dataset for prediction. The most promising prediction models are random forest regression and gradient boosting regression. T hey predict warpage with an accuracy of 90% to 91% and the residual enthalpy with an accuracy of 95%. Subsequently, optimization models of the machine parameters were set up. All relevant target variables were considered in a cost function, through the minimization of which an optimal parameter set was found. The gradient boosted tree and Bayesian optimization were determined to be the most promising models, as they lead to the lowest values of the respective cost function.
Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging
Authors: Singh Prashant Kumar , Rohlfs Patrick , Sandmann Gunther , Machani Kashi Vishwanath , Breuer Dirk , Meier Karsten , Kuechenmeister Frank , Wieland Marcel , Bock Karlheinz 
Published: March 2024

In wafer level packaging, polyimide and electroplated copper are dielectric and conducting materials respectively in the so-called redistribution layers. During the wafer fabrication process large amount of stress is generated in those layers due to curing shrinkage of the polyimide and the coefficient of thermal expansion mismatch of both materials to silicon which can lead to severe wafer bow after a high temperature curing. In different applications polyimide can be used either only as passivation layer over electroplated copper, or polyimide is applied before the redistribution layer and then a second polyimide layer is applied as passivation. In the current study the effect of different polyimide integrations is investigated. In-situ wafer bow measurements and finite element method studies were conducted with samples, with and without polyimide below redistribution layer, exposed to different curing temperatures to understand the change in wafer bow and copper residual stress. It is observed that wafers with polyimide before redistribution layer show higher stress relaxation in copper with decreasing curing temperature, resulting therefore in a lower wafer bow. A good agreement is achieved between the experimentally measured and the simulated wafer bow.
Thickness Effect of Copper Clips on Power Module Packaging Design
Authors: Wan Haiyong , Iosifidis Nikolaos , Zhang Xu , Rong Rui , Antoniou Marina , Mawby Philip 
Published: March 2024

The superior switching performance of SiC MOSFETs compared to Si devices is limited by packaging-related issues. High electromagnetic parasitics which lead to high voltage overshoots, and higher power losses are the main challenges of high frequency operation. Hence, packaging design modification and optimisation are necessary to accommodate faster switching. Copper clips replacing the bonding wires show promising results in reducing stray inductances, while enhancing the current conduction and heat dissipation since the clip are in contact with a larger area of the semiconductor chip. Silver sintering instead of soldering further improves the electrothermal behaviour. This paper investigates numerically various thicknesses of the copper clips and their effect on double-sided silver sintering, half-bridge 1200V/400A SiC MOSFET power module. Moreover, the silver layer thickness is varied to reduce th maximum stresses on the chip - silver interface.
Ayurveda holistic management of acute unilateral central serous chorioretinopathy with pigmentary epithelial detachment: A case report
Authors: Mehar Kapil , Garg Vandana , Bisht Rahul , Bavalatti Narayan , Rajagopala Manjusha 
Published: March 2024

Abstract
Central serous chorioretinopathy (CSCR) is characterized by localized serous detachment of neurosensory retina secondary to leakage of fluid from choriocapillaris, accumulating under the macula, with or without pigmented epithelial detachment. A 30-year-old male presented with complaints of sudden painless diminished vision and floaters in the right eye for 5 days. The patient had no previous history of any ocular disease and no significant systemic illness. The visual acuity as per LogMAR was 0.5 in the right eye and 0 in the left eye. The fundus examination showed round elevated detachment around the macula, which was confirmed by optical coherence tomography, showing neurosensory detachment due to serous fluid accumulation under the macula along with small pigmentary epithelial detachment. Management was done on an outpatient basis over 2.5 months, which included both internal and topical interventions along with Yoga therapy. The disease was resolved in 2.5 months with complete resolution of serous fluid. The visual acuity was brought back to normal, that is, LogMAR 0. CSCR cases can be successfully treated with an Ayurvedic holistic approach, and they respond better when treated at an early stage. These practices can be considered as an alternative.
Vatari Guggulu, Hingvashtaka Churna, and Brihat Saindhavadya Taila in the management of rheumatoid arthritis: An open-label, prospective, single-arm multi-center study
Authors: Sahu Dipsundar , Borah Taposi , Srivastava Alok , Khanduri Shruti , Rai Amit Kumar , Meher Sudhanshu K , Baruah Dinesh , Singh Krishna K , Singhal Richa , Rana Rakesh , Sharma Bhagwan S , Bhat Sulochana , Bharti  , Srikanth Narayanam , Padhi Madan M , Dhiman Kartar S 
Published: March 2024

Abstract

Background:
Despite significant advances in the diagnosis and treatment of rheumatoid arthritis (RA), the clinical outcomes remain unsatisfactory in a significant proportion of patients. Ayurveda management for RA (Amavata) has shown promising clinical outcomes in routine clinical practice and as per published research studies.

Objective:
The study was designed to assess the therapeutic effect and safety of Ayurveda interventions, Vatari Guggulu (VG), Hingvashtaka Churna (HC), and Brihat Saindhavadya Taila (BS) in the management of RA.

Materials and Methods:
An open-label, prospective, single-arm multicenter study was conducted at Ayurveda Research Institutes in Patna, Bhubaneswar, and Guwahati with a sample size of 180 participants. Patients of any gender aged 20–60 years with clinically diagnosed RA as per the revised American College of Rheumatology criteria and willing to provide written informed consent to participate in the study were included in the study. Ayurveda interventions, VG, HC, and BS, were administered to the study participants for 12 weeks, with a follow-up at four weeks without intervention. The primary outcome measure was a change in the Disease Activity Score-28 (DAS28) from baseline. The other outcome measures included change in the Indian Health Assessment Questionnaire Disability Index score (HAQ-DI), changes in the acute phase reactants (erythrocyte sedimentation rate [ESR] and C-reactive protein [CRP]), and change in the quality of life parameters (assessed through the SF-36 questionnaire).

Results:
A total of 180 participants were enrolled in the study, and data of 179 participants were considered for the final analysis. A statistically significant difference was observed in the outcome parameters, such as a mean change in the DAS28 score, HAQ-DI score, SF-36 score, and ESR and CRP levels (P < 0.001) after 12 weeks of treatment. The mean DAS28 score changed from 6.50 ± 0.790 at baseline to 4.21 ± 1.286 on week 16 follow-up (P < 0.001). No participant withdrew from the study due to adverse events. The trial interventions were well-tolerated and safe.

Conclusion:
The study outcomes provide preliminary evidence of the safety and potential benefits of the Ayurveda interventions in the management of RA. Further, randomized controlled studies may be planned to generate robust evidence on the therapeutic potential of these interventions so that they can be recommended for use in routine clinical practice.

Trial registration:
CTRI/2014/12/005242.
The role of transoral incisionless fundoplication (TIF) in the management of gastroesophageal reflux disease (GERD) following peroral endoscopic myotomy (POEM): A pilot, prospective, patient-driven study
Authors: Ayoub Fares , Keihanian Tara , Zabad Noor , Jawaid Salmaan , Patel Kalpesh , Othman Mohamed O. 
Published: March 2024

Abstract

Background:
Gastroesophageal reflux (GERD) is a concern after peroral endoscopic myotomy (POEM). Transoral incisionless fundoplication (TIF) has been recently described as a possible therapy for post-POEM GERD in case series.

Methods:
We prospectively enrolled patients undergoing POEM who agreed to participate in objective post-procedure GERD evaluation. Patients with objective evidence of GERD and suitable anatomy were offered TIF vs. proton pump inhibitor (PPI) only. Patients who underwent TIF were compared to those on PPI-only therapy after follow-up.

Results:
Of 21 enrolled POEM patients with objective testing, GERD was found in 11 (52%). Of those eligible for TIF, 4 (40%) opted to pursue TIF and were compared to those on PPI-only therapy (n = 6). Three months post-TIF, 75% of patients had discontinued or significantly decreased PPI. There were no adverse events. GERD health-related quality of life scores were low and comparable between TIF (3.75 ± 6.2) and those who remained on PPI-only therapy (4.1 ± 5).

Conclusion:
In this pilot, patient-driven prospective study, 75% of patients with post-POEM GERD undergoing TIF had stopped or significantly reduced PPI use. Post-POEM TIF is safe and effective and may be a viable alternative to PPI for POEM-related GERD; however, future studies should include a control arm and post-intervention pH monitoring.