bluuebunny/crossref_metadata_2025_split huggingface dataset:
Nurse Faculty Job Satisfaction: A Concept Analysis
Authors: Heier Cori , Nelson-Brantley Heather 
Published: March 2024

Background:
This study provides an analysis of the concept of nurse faculty job satisfaction.

Method:

Walker and Avant's (
2019
) eight-step method guided this analysis. Searches of the CINAHL, PubMed, Medline, and Cochrane databases were performed with the following terms:
faculty
,
nursing
,
nurs* faculty
,
nurs* educator
,
job satisfaction
,
work satisfaction
, and
employee satisfaction
. Thirty-seven articles published between 2010 and 2022 in the field of nursing were included.

Results:
Three defining attributes of nurse faculty job satisfaction were identified: psychological empowerment, self-efficacy, and motivational factors (achievement, recognition, responsibility, advancement, work, and growth). Antecedents included mentoring, effective leadership, structural support, and work culture and relationships. The consequences of nurse faculty job satisfaction were commitment (professional and organizational) and work efficiency, which included productivity, creativity, and innovation.

Conclusion:

This concept analysis showed the attributes of nurse faculty job satisfaction are intrinsic and the antecedents are extrinsic. An operational definition was proposed, and a conceptual model was created.

[
J Contin Educ Nurs.
2024;55(7):331–337.]
Interchangeability in Automated Corneal Diameter Measurements Across Different Biometric Devices: A Systematic Review of Agreement Studies
Authors: Muzyka-Woźniak Maria , Woźniak Slawomir , Łabuz Grzegorz 
Published: March 2024

Purpose:
To provide an up-to-date review of the agreement in automated white-to-white (WTW) measurement between the latest topographic and biometric devices.

Methods:
In this systematic review, PubMed, Web of Science, and Scopus databases were searched for articles published between 2017 and 2023, focusing on WTW agreement studies on adult, virgin eyes, with or without cataract and no other ocular comorbidities. Studies evaluating WTW measurements performed with autokeratometers, manual calipers, or manual image analysis were excluded. When available, the following metrics for the agreement of WTW measurements between pairs of devices were included: mean difference ± standard deviation, 95% limits of agreement (LoA), LoA width, 95% confidence interval (95 CI%), and intraclass correlation coefficient (ICC).

Results:
Forty-one studies, covering comparisons for 19 devices, were included. Altogether, 81 paired comparisons were performed for 4,595 eyes of 4,002 individuals. The mean difference in WTW measurements between devices ranged from 0.01 mm up to 0.96 mm, with varying CI. The 95% LoA width ranged from 0.31 to 2.45 mm (median: 0.65 mm). The majority of pairwise comparisons reported LoA wider than 0.5 mm, a clinically significant value for phakic intraocular lens sizing.

Conclusions:
Nearly all analyzed studies demonstrated the lack of interchangeability of the WTW parameter. The corneal diameter, assessed by means of grayscale en-face image analysis, tended to demonstrate the lowest agreement among devices compared to other measured biometric parameters.

[
J Refract Surg
. 2024;40(3):e182–e194.]
Concepts for realizing High-Voltage Power Modules by Embedding of SiC Semiconductors
Authors: Böttcher Lars , Ostmann Andreas , Löher Thomas , Seckel Manuel 
Published: March 2024

Today’s power electronics modules typically consist of a ceramics substrate (DBC – Direct Bond Copper), carrying IGBTs, diodes or MOSFETs. These semiconductors are soldered or sintered to the ceramics and their top sides are interconnected by thick Al wires. An integration of further components or functions on the DBC substrate is difficult or even not possible. Therefore, driver circuits and controllers have to be mounted to a separate substrate, typically an organic Printed Circuit board (PCB). The PCB has to be connected to the DBC by wires or pins. The mechanical integration of the whole system requires a bulky housing. Embedding of power semiconductors like SiC MOSFET allows a significant size reduction, improved electrical performance and a high degree of reliability of such modules. In the last years, the capability of PCB embedding technology for the realization of low and high voltage power modules was demonstrated. Fraunhofer IZM together with partners from the industry demonstrated the feasibility for different applications, from single die SiC packages to high voltage automotive traction inverters. In this paper, a general overview about innovative power module technologies will be given and the embedding of power semiconductors will be introduced in detail. It will address all most relevant point, like the demands on the semiconductor, the thermal and electrical considerations as well as the demands on the used materials. To address the integration of the required driver circuits and controllers, the idea of modularization such electronics systems will also be presented. Here already packaged components will be used and embedded into PCB layers too. As a result, a modular approach to form a complete system will be developed. Different functional layers, e.g. power switches, logic modules, will be formed and finally stacked und connected to form the system. The concept and first realized demonstrators will be discussed.
Thermally Conductive Polymer Composites with Hexagonal Boron Nitride for Medical Device Thermal Management
Authors: Do Nu Bich Duyen , Imenes Kristin , Aasmundtveit Knut E. , Nguyen Hoang-Vu , Andreassen Erik 
Published: March 2024

Polymer composites with hexagonal boron nitride (hBN) have the potential to meet the heat dissipation and electrical insulation requirements of electronic and medical devices. In this study, hBN/polymer composites were fabricated with thermoplastic polyurethane (TPU) and epoxy as matrix materials. Three hBN powder types (BN1, BN2, BN3) with different platelet sizes and degrees of agglomeration were used. BN1 (with average size of 1 μm) and BN2 (with average size of 12 μm) mainly contained hBN platelets, while BN3 (with average size of 20 μm) contained both platelets and agglomerates of platelets. BN2 gave the highest thermal conductivity, while BN1 gave the lowest thermal conductivity. Thermal simulations were performed for a medical device with a limit for the maximum surface temperature. For the encapsulation of this device, several material combinations were simulated, using anisotropic thermal conductivity data. This included encapsulations with inner layers of commercial thermally and electrically conductive materials and an outer layer of the best thermally conductive (and electrically insulating) hBN/TPU composite fabricated by the authors.
Thermal-Mechanical Analysis of a Power Module with Parametric Model Order Reduction
Authors: Hassan Sheikh , Rajaguru Pushparajah , Stoyanov Stoyan , Bailey Christopher 
Published: March 2024

This paper presents parametric model order reduction (pMOR) by the Lagrange approach of matrix interpolation for the thermal-mechanical and reliability study of a power electronics module (PEM) with nonlinear behaviours. Most previous research in model order reduction (MOR) studies reports thermal-mechanical simulations using a sequentially coupled method. In this research, a direct-coupled thermal-mechanical analysis, which simultaneously solves the thermal and structural governing equations, has been used to obtain thermal and deformation results. Furthermore, for pMOR, the linear approach of matrix interpolation is limited to linear changes between sampled-parametric points. Hence, a new way of interpolating system matrices using the Lagrange interpolation method has been adopted to implement the matrix interpolation efficiently. The parametric reduced-order model (pROM) solution by the Lagrange approach of matrix interpolation agrees well with the full-order model (FOM) and takes similar computational time as the linear (bi-linear) approach of matrix interpolation. pROM simulations offer up to 85.5% reduction in computational time.
Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications
Authors: Hecht Christoph , Schadow Eric , Sprenger Mario , Haeussler Felix , Stoll Thomas , Franke Joerg 
Published: March 2024

Additive manufacturing shows great potential to further increase the performance of power electronic modules through novel packaging concepts. Such an approach is the integrated manufacturing of metal-ceramic substrates by means of laser powder bed fusion of metals (PBF-LB/M). With this layered additive manufacturing process, planar ceramic substrates can be metallized and electrically functionalized for power electronic applications. In this paper Al2O3 ceramic substrates are metallized via PBF-LB/M by selectively melting applied powder layers with software defined geometries. The investigated powders are mixtures of copper and titanium powders with 1 wt.%, 5 wt.% and 10 wt.% titanium in order to enable bonding by creating a titanium-oxide reaction layer at the interface to the ceramic. Shear tests and microstructural investigations show that a subsequent heat treatment increases the adhesion and density of the metallization. By energy dispersive X-ray microscopy (EDX) the partial formation of reaction layers is detected.
Reliability Testing of Recycled SMD Components Reused in E-Textiles after Ageing by Washing Cycles
Authors: Hirman Martin , Navrátil Jiri , Benesová Andrea , Steiner Frantisek 
Published: March 2024

This paper presents a method for recycling and reusing SMD chip components in e-textiles using a special contacting technique. The method involves using a UV-curable, non-conductive acrylic adhesive to connect SMD components onto electrically conductive textile stretchable ribbons. At the end of the product’s life-cycle, the components are removed from the ribbon and reused to manufacture new products. The recycling procedure involves several steps, including disassembly, inspection, cleaning, repair, and reassembly of components. The results of an experiment testing the electrical resistance of new and reused components after washing and drying cycles showed that electrical resistance of reused joints did not significantly deteriorate compared to new joints. The reused components maintain their functionality and performance, suffering no significant impairment. They perform comparably to new components, even after repeated washing and drying cycles. The method offers several benefits, including conservation of raw materials, minimization of waste, and reduction of production costs. It can also help mitigate component shortages. However, it is found that the suitability of this remanufacturing method varies with different types of components. Certain component types may be more susceptible to damage or even unsuitable for this method. The method is particularly beneficial for higher-value or components experiencing market shortages, demonstrating its potential to address urgent industry challenges while contributing to environmental sustainability.
Comparing the Solderability of Different SA C0307 Composite Solder Pastes
Authors: Illés Balázs , Choi Halim , Skwarek Agata 
Published: March 2024

In the present study, the effect of four oxide ceramics (TiO2, ZnO, ZrO2, and CuO) as reinforcements were investigated on the soldering parameters of the SAC 0307 solder alloy. The oxide ceramics were used in nano-powder format. Composite solder pastes were composed by the standard ball milling process of the nano-particles into the SAC 0307 solder paste in 0.25wt% weight fraction. The wettability, shear strength, and microstructure of the composite solder joints were studied and compared. The ceramic nano-particles did not have a major effect on the wettability of the solder. Shear strength increases were observed at the composite joints, except in the case of ZnO. Generally, Sn grain refinement was found in the Sn-matrix which could be the reason for the shear strength increase.
Lamination of Capacitive Micromachined Ultrasonic Transducer on a Piezoelectric Array: Process and Evaluation
Authors: Le Duy Hoang , Manh Tung , Hoff Lars 
Published: March 2024

Harmonic imaging plays a crucial role in medical ultrasound imaging, where the transducer probes are required to emit low-frequency ultrasonic waves into the tissues, and receive reflected signals at the higher, typically the second harmonic of the transmitted wave. We have designed a unique probe with a high-frequency capacitive micromachined ultrasonic transducer (CMUT) on top of a low-frequency piezoelectric array for harmonic imaging. This paper presents a lamination process between CMUT and piezoelectric array using epoxy. The bond-line between the two components was thoroughly investigated using mechanical and electrical methods. The resulting bond-line thickness was less than 2 μm, and shear strength fell within the range 4.8 – 5.1 MPa. Additionally, electrical impedance measurement of all elements in the low-frequency array exhibited resonance shifts before and after bonding, providing further insight into the bonding process.
Epoxy Molding Compound Bleeding Reduction on Surface Mount Semiconductor Device
Authors: Leone Federico , Viviani Fulvio , Seki Hidetoshi , Ishii Masami 
Published: March 2024

Epoxy Molding Compound (EMC) bleed consists of a transparent layer of resin which mainly could occur during molding injection at material packing stage. Resin bleeds on exposed pad of a Surface Mount Device (SMD) can significantly impact the solderability performances of the package, causing failure of the product. De-flashing process after molding is generally performed to eliminate the resin bleed. However, deflashing can be performed on post-plated leadframes without critical drawback, while it is not recommended on pre-plated leadframes due to the high risk of damaging the finishing surface. In this study, an alternative approach aimed to reduce or eliminate molding compound bleed by optimizing the inorganic part of the molding compound formulation is presented. Besides the quality improvement, the presented approach provides an economical advantage since, by tuning the properties of the filler inside the EMC, it is possible to eliminate the de-flashing process from the assembly flow of a package and consequently reduce the manufacturing cost.
Evolution of Getter Technology in Electronic Hermetic Packaging
Authors: Mauri Luca , Zafarana Giovanni , Rizzi Enea , Corazza Alessio 
Published: March 2024

Hermetic packaging is a well-established technology used for sealing electronic and optoelectronic devices. A reliable and enabling way to preserve the proper stable atmosphere conditions in hermetic packages is the integration of engineered getter solutions, specifically designed for the characteristics of different packaged systems. Getter solutions may vary from sintered, compressed or sputtered metallic alloys for vacuum sealed packages to dispensable hybrid organic-inorganic materials for gas back filled devices. The paper will present the main features of getter materials suitable for different type of packages and will show their efficiency in absorbing detrimental gases in the devices.
Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in Air
Authors: Mohan Nihesh , Ahuir-Torres Juan Ignacio , Bhogaraju Sri Krishna , Kotadia Hiren R. , Elger Gordon 
Published: March 2024

Cu complex inks offer a facile and cost-effective alternative to commercial nanoparticle inks for printed electronics application. Cu complex inks are prepared by mixing Cu formate tetrahydrate (metal precursor) with amino-2-propanol (complexing agent) in a molar ratio of 1:2. A carrier solvent consisting of ethanol and ethylene glycol is then added to help adjust the rheological properties of the ink for printing purpose. The Cu complex ink having a viscosity of 12 mPa.s is then inkjet printed onto a polyimide substrate (thickness: 125 μm). After printing 10 layers, the ink is pre-dried under air at 100°C for 5 minutes followed by sintering using an IR laser (942 nm) to enable rapid thermal decomposition of the Cu formate. After sintering using a 100 W line beam laser scanned at 3 mm/sec under air; a contiguous and homogenous Cu metallic trace is formed with a minimum bulk resistivity of 4.8 μΩcm (2.84 times of bulk Cu). The laser sintered trace exhibited a highly compact and homogenous sintered structure after thermal decomposition compared to the conventional oven sintering process. Th result is remarkable and proves the importance of faster decomposition process. In contrast, sintering the same trace using slow ramp rate within the traditional oven sintering pr process, it is observed that a Cu metallic trace is formed with particles in the range of 2-5 μm that are sparsely distributed due to low metal content of Cu complex inks (< 10 metal wt.%). Due to sparse distribution of particles, a low bulk resistivity value of 102 μΩcm is obtained.
Design, Fabrication, and Characterization of a 4H-SiC CMOS Readout Circuit for Monolithic Integration with SiC Sensors
Authors: Sattari Romina , van Zeijl Henk , Zhang Guoqi 
Published: March 2024

This paper reports the design and fabrication of a 4H-SiC CMOS readout circuit enabling monolithic integration of silicon carbide (SiC) sensors and circuits. Compared to conventional Si electronics, 4H-SiC integrated circuits can sustain operation in harsh conditions such as higher temperatures and radiation levels. The proposed amplifier performance is well balanced through the temperature range of 25C to 400C. Compared to state-of-the-art, the proposed SiC readout circuit does not include any off-chip components. The amplifier is fully differential, and hence shows improved common-mode rejection and signal-to-noise ratio (SNR). It can be monolithically integrated with SiC sensors in a scalable SiC technology.
Fine Pitch Micro Indium Bump Interconnect Flip Chip Bonding
Authors: Scott Travis 
Published: March 2024

Quantum computing processors, micro LED displays and Focal Plane Array (FPA) imaging and detector devices such as infrared (IR) thermal imaging sensors are seeing higher demand as more practical applications requiring these components are coming into research and development, industrial, military and consumer markets. This paired with higher pixel and Qubit count and interconnect density, on larger and larger chips is driving hybridization and monolithic integration in these technologies. This is showing a marked increase in demand for fine pitch micro bump interconnection flip chip die bonding. However, some critical challenges facing these technologies are; larger component sizes mean higher density interconnections over increasing surface area. Submicron accuracy required to align fine pitch micro interconnect arrays. This together with the challenges facing the materials that are becoming the industry standard for these applications, such as the requirement for the assembled components to remain stable in extreme conditions such as cryogenic application environments. Combined with low loss high strength mechanical/ electrical interconnect requirements on components containing sensitive materials, structures and unmatched coefficient of thermal expansion (CTE) means that processing gases such as formic acid or high temperature reflow bonding can no longer be used to bond these devices. These challenges mean that the industry is fast approaching the limitations of even state-of-the-art die bonders and die bonding methods on the market today. This paper is going to highlight these challenges and the methods used to address them to produce large format, high density IR thermal imaging FPA devices, Quantum processors and micro LED displays using fine pitch micro Indium bump array interconnections that meet today’s industry requirements.
Measurement and Simulation of Mechanical Strength of Back-End-Of-Line Layer in Advanced CMOS Dies
Authors: Vandevelde Bart , Cox Kevin , Moloudi Reza , Labie Riet , Krantz Jason , Borden Matt , Vanstreels Kris , Gonzalez Mario 
Published: March 2024

The back-end-of-line (BEOL) layers of ICs are subjected to considerably high mechanical forces during processing and when operating in harsh conditions. Without proper design and flip chip process control, the forces induced from flip chip bumps may exceed the ultimate strength of the BEOL resulting in critical failures. It is therefore of high interest to have a measurement method to quantify the strength of the BEOL structure of a functional IC. Ultimate fracture stress values are extracted from these measurements which can be used in thermo-mechanical simulations of flip chip assemblies for survivability evaluations.
Analysis of the Impact of Environmental Conditions on the Reliability in 5G PCB Assemblies
Authors: Walter Hans , Wittler Olaf , van Dijk Marius , Huber Saskia , Köszegi Julia-Marie , Schneider-Ramelow Martin 
Published: March 2024

The designs of integrated systems are increasingly compact while the requirements of application, especially in the automotive sector, remain demanding. One main challenge is posed by the environmental conditions. In the present study, their impact on mmWave 5G PCB assemblies is evaluated with respect to both mechanical and highfrequency properties. To that end, material samples were stored at three temperatures for various durations in order to accelerate the ageing effects. Afterwards, the samples were tested by use of mechanical, dielectric and high-frequency test methods. Thermo-oxidative ageing processes were observed and lead to significant changes in mechanical and dielectric properties, with simultaneous changes of sample color. The combined approach of mechanical and high-frequency analysis allows for three innovative advantages: First, a correlation of the degradation in performance with other parameters, e.g. sample change of color, which is much easier to detect. Second, the definition of a Safe Area of Operation and a methodology to estimate the behaviour of a mmWave 5G PCB assembly over its lifetime. Finally, the study opens the pathway to a design for robustness of mmWave communication system in automotive applications.
Characterization of Embedded and Thinned RF Chips
Authors: Yin Ran , Morath Helmuth P. E. , Hoyer Christian , Nieweglowski Krzysztof , Meier Karsten , Wagner Jens , Ellinger Frank , Bock Karlheinz 
Published: March 2024

This work studies the effect of thinning down chips with transmission line structures for flexible embedding technology. Test chips with 90 Ω grounded coplanar waveguide (GCPW) transmission lines have been designed and manufactured to characterize the high-frequency performance before and after embedding in sheet molding compound (SMC), and thinning down from 300 μm to 20 μm. Molding first technology enables single-die or multiple-die thinning with the embedding material while being held in the exact position, where the subsequent fanout copper (Cu) redistribution layer (RDL) structuring realizes the direct contacts to the embedded chip, followed by semiadditive manufacturing of traces. The embedded and thinned chips are characterized by S-parameter measurements in the frequency range from 20 MHz to 65 GHz using a vector network analyzer (VNA). The results show the feasibility of the examined embedding and thinning processes which are suitable for millimeter wave (mmWave) components as shown by the example of a G-CPW transmission line without degrading its RF performance in terms of characteristic impedance and attenuation.