bluuebunny/crossref_metadata_2025_split huggingface dataset:
Identifying some critical changes required in adopting agile practices in traditional software development projects
Authors: Chandra Misra Subhas , Kumar Vinod , Kumar Uma 
Published: April 2010

PurposeAgile software development (ASD) is currently an emerging approach in software engineering for improving quality, initially advocated by a group of 17 software professionals who practice a set of “lightweight” methods, and share a common set of values of software development. Owing to the attractive claims of successes of the ASD approach, many traditional projects, which used to practice plan‐driven software development, are gradually transitioning into ASD‐based development. This paper seeks to report the results from a survey‐based ex‐post‐facto study aimed at determining the relative importance, if any, of the changes traditional plan‐driven software development projects have to undergo to adopt ASD practices.Design/methodology/approachThe study was conducted using a web‐based survey with ASD practitioners who had experience of practicing plan‐driven software development in the past. ASD practitioners from a wide range of industrial sectors participated in the study. Similarly, the study is not restricted to any specific organisation/project size, culture, or nationality – the respondents were widely geographically distributed across continents.FindingsThe study received 241 responses, of which 165 were usable. The study did not reveal any substantial difference in importance of the four classes of changes hypothesised – changes in culture, changes in management style, changes in knowledge management strategy and changes in development processes. The authors believe that this is an important finding because it is indicative of not isolating one class of changes from another in practical transition exercises. However, another noteworthy observation was that transitioning from heavily process‐centric to short, iterative, test‐driven, and people‐centric development was considered by the largest percentage (roughly 77 per cent) of respondents to be very important. The open‐ended questions in the study also revealed three additional classes of changes: changes in personal characteristics, changes in customer attitude, and changes in knowledge and education of stakeholders.Originality/valueIn this work an attempt was made to gain an understanding of the relative importance of the different critical changes that would be helpful to a project manager who is involved in the transition from traditional plan‐driven software development practices to agile software development practices.
A reliability, maintainability, and safety model to support the assessment of space vehicles
Authors: Ruiz‐Torres Alex J. , Zhang Jianmei , Zapata Edgar , Pennathur Arunkumar , Rhodes Russell , McCleskey Carey , Cowen Marcella 
Published: April 2010

PurposeThe focus of this paper is on reliability and availability design goals. It aims to provide top‐level estimates of the safety and maintainability of future spacecraft systems.Design/methodology/approachThe developed design tool uses basic reliability principles to estimate the probability of a safe mission and the need for repairs/replacement during ground processing, before launch and start of mission, based on the characteristics of the vehicle's main systems: the number of subsystems, the mean time to repair, and the per subsystem average reliability.FindingsA simple reliability, maintainability and safety model is developed to support the top‐level design process of future space transportation vehicles. It also describes how the developed design tool uses various sensitivity analysis functions to improve design decisions.Originality/valueThe goal of the developed tool is to provide engineers/vehicle developers during the early stages of design with a tool that demonstrates the effect on maintainability of improving component reliability and reducing the number of components.
An exploratory study of attendee activities at a business trade show
Authors: Gopalakrishna Srinath , Roster Catherine A. , Sridhar Shrihari 
Published: April 2010

PurposeAlthough trade shows are a significant part of the B2B communications mix, academic research in the area is sparse. To successfully manage this medium, a careful understanding of attendee behavior on the trade show floor is necessary. Drawing from the rich literature on shopper typologies in retailing (which parallels the trade show atmosphere), this paper sets out to develop a set of attendee metrics that show organizers can track regularly.Design/methodology/approachThrough latent class clustering on unique attendee‐level data from a popular computer trade show, five segments of attendee activity are uncovered that differ along dimensions such as the attendee's involvement and focus and the exhibitor's booth size, booth accessibility, and product display.FindingsSignificant heterogeneity is found in attendee activities on the show floor. There are interesting similarities and differences between the retail and B2B shopper. Implications for trade show organizers and exhibitors are discussed and directions for future research suggested.Originality/valueSince the data employed are becoming more readily available, the hope is that managers and academic researchers might find the suggested metrics and segmentation approach useful in advancing a deeper understanding of the trade show attendee.
Exploring visitor experiences at trade shows
Authors: Rinallo Diego , Borghini Stefania , Golfetto Francesca 
Published: April 2010

PurposeThe purpose of this paper is to investigate business visitor behaviour at trade shows and to propose a complementary view based on the experiential perspective in marketing.Design/methodology/approachThe paper reports an ethnographic study conducted in the context of ten international trade shows in the textile‐apparel industry in Europe.FindingsThe study sheds light on the nature of the experience provided by trade show exhibitors and organisers and on visitors' lived experiences. Trade shows immerse industrial buyers in a physical and cognitive experience that requires their active participation. Under such circumstances, industrial marketers who employ experiential marketing techniques are likely to increase their trade show performances.Originality/valueThe paper adopts a new perspective that sees business visitor behaviour from an experiential standpoint and discusses the managerial implications that highlight the interplay of exhibitors and trade show organisers in designing and setting valuable experiences for visitors.
Structure, strategy and performance of exhibitors at individual booths versus joint booths
Authors: Skallerud Kåre 
Published: April 2010

PurposeThis paper seeks to examine the differences at international trade shows between exhibitors who participate in joint booths and those who participate in individual booths. The structure, strategy and trade show performance of exhibitors at joint booths and those at individual booths are analysed.Design/methodology/approachThe paper presents an empirical study of 208 exhibitors at an international food and beverage show, focusing on the differences in structure, strategy and performance between individual exhibitors and exhibitors at joint booths. The differences are identified and discussed.FindingsIndividual exhibitors place more personnel and products at their booths and they allocate more resources, top management commitment and planning. However, exhibitors at joint booths have more formalised planning and objective setting. The performances of five groups of trade show activities were assessed. Individual exhibitors perform significantly better on image‐building activities at the show. There are no differences with regard to firm characteristics between the two participation modes.Research limitations/implicationsThe study is limited by the fact that the sampling frame is made up of exhibitors at a single international food and beverage show, and may therefore be more representative of that kind of show. Despite the limitations encountered, the findings have important implications for exhibitors at international trade shows and export marketing programmes as well as other marketing programmes offering services to international trade show exhibitors.Originality/valueA broad range of joint booths and strategy variables is investigated. Also, a more comprehensive and theoretical grounded performance measure is adopted compared with previous research.
The return on trade show information (RTSI): a conceptual analysis
Authors: Bettis‐Outland Harriette , Cromartie Jane S. , Johnston Wesley J. , Leila Borders Aberdeen 
Published: April 2010

PurposeThe purpose of this paper is to analyze the need for developing a return on trade show information (RTSI) index; this index would be used to measure the impact of information gathered at trade shows on long‐term decision making within the organization. Also, the paper aims to suggest differences in how exhibitors and visitors perceive tangible versus intangible benefits that accrue as a result of utilizing new information acquired at trade shows.Design/methodology/approachThe paper utilizes a conceptual approach, employing the market orientation framework to develop a model for the return on trade show information (RTSI). It incorporates the acquisition, dissemination and utilization of new trade show information, suggesting that perceived information quality acts as a moderator in this relationship.FindingsThe return on trade show information (RTSI) index describes both tangible and intangible benefits that accrue to the organization as a result of information acquired at trade shows. However, in some cases the same information that is acquired at trade shows is also available from alternative sources, potentially making it difficult to determine true RTSI.Originality/valueThe manuscript offers an innovative perspective for estimating the value of new information acquired at trade shows, suggesting differences in the way in which exhibitors and visitors perceive, as well as utilize, trade show information. This opens the door to future research in the area of trade show information value; in addition, this can benefit practitioners by providing a different method for evaluating the investment value of trade show participation.
Antecedents and effect of internet implementation for trade shows
Authors: Ling‐yee Li 
Published: April 2010

PurposeTaking the dynamic capability and institutional perspectives, this study seeks to examine how capability‐driven and institution‐driven factors influence usage of internet technology in trade show markets. The current study also examines the influence of the usage of the internet for trade show marketing on performance of trade shows.Design/methodology/approachStructural equation modeling was undertaken to test the research model in a sample of 414 exhibitors at the Chinese Export Commodity Fair.FindingsOverall, the results point to the powerful influence of the usage of the internet for trade show marketing on trade show performance as perceived by exhibitors. The specific results also reveal that, while a website's capability in providing quality information facilitates the usage of the company website for pre‐show promotion, an exhibitor's legitimacy motive of using its website to build up the company image contributes to the usage of the company website for at‐show selling, and the firm's inter‐functional coordinating capabilities that capitalize on internet connectivity in support of superior customer services encourage the usage of company website for post‐show follow‐up.Originality/valueThe key lesson for exhibitors is to adopt the right approach to internet marketing – using the internet primarily for “informational and communicational purpose” in pre‐show promotion, and for “customer service and support purpose” in post‐show follow‐up.
The role of virtual trade fairs in relationship value creation
Authors: Geigenmüller Anja 
Published: April 2010

PurposeThis paper seeks to provide a framework for understanding the role and contributions of virtual trade fairs in developing relationships. Using a relationship communication model, the paper aims to explore the determinants of value creation through virtual trade fairs, emphasising the impact of advanced information and communication technologies on contemporary marketing.Design/methodology/approachThe paper is a conceptual work which derives research propositions from an extended literature review.FindingsThe paper provides a rationale for factors that determine value creation through virtual trade fairs. The exhibitor firm's understanding of the importance of information, network orientation, capability of customer integration, and relationship attributes are proposed as influences on the effectiveness of virtual trade fairs.Research limitations/implicationsThe research has limitations that are due to the exploratory nature of the work. The paper suggests opportunities for further research, particularly approaches to developing measures of effectiveness for virtual trade fairs and for developing integration and interdependencies with other communication instruments.Practical implicationsReferring to existing arguments about the pros and cons of virtual trade fairs, the paper provides a deeper understanding of the content and effectiveness of virtual trade fairs.Originality/valueThe paper sheds light on a phenomenon that, despite its increasing acceptance among practitioners, remains unexplored by marketing research. By providing a better understanding of virtual trade fairs, the paper enriches research on trade fair issues.
Travel trade shows: exploratory study of exhibitors' perceptions
Authors: Yuksel Ulku , Voola Ranjit 
Published: April 2010

PurposeThe purpose of this paper is to investigate the motivations for participating in international trade shows and perceptions of effectiveness and challenges faced by exhibiting firms.Design/methodology/approachA multiple‐methodology approach is adopted. Initially, interviews are conducted with travel trade exhibitors. These then serve as a foundation for a survey of senior tourism managers.FindingsExhibitors perceive efficient and effective products/services being displayed on the stand as the central factor for success. The key motivation for participating in travel trade shows is to improve relationships with customers. The primary motivation in participating in specific travel trade shows was influenced by the reputation of the fair, and the key challenge relates to following up leads from the fair.Research limitations/implicationsAs the study emphasises tourism and travel, generalising to other trade shows must be done with caution.Practical implicationsThe intangible and simultaneous nature of the offering emphasises empathy, responsiveness and reliability of the staff and will affect visitors' perceived service quality of the interaction. Furthermore, an explanation of the various motivations may aid exhibitors in their objectives for participating in travel trade shows.Originality/valueAlthough the tourism industry, and consequently travel trade shows, are booming, little research examines the motivations and effectiveness of travel trade from the exhibitor's perspective. Furthermore, the services nature of travel trade shows and its effects on marketing travel trade shows have seen only limited investigation.
The future of trade shows: insights from a scenario analysis
Authors: Kirchgeorg Manfred , Jung Kathrin , Klante Oliver 
Published: April 2010

PurposeThis paper aims to explore key factors that will shape the future of trade shows as a marketing instrument until the year 2020. Using multi‐stage scenario analysis, the paper seeks to provide a background for the discussion of strategic decisions made by trade show companies when they respond to the challenges ahead.Design/methodology/approachThe underlying research draws on scenario analysis involving experts who represent exhibitors and trade show organisers. In total, 50 leading executives were involved. The majority of them are located in Germany, but they are exposed to the international trade show business. The probability that the identified scenarios will materialise was assessed using a representative survey of 400 German managers of exhibiting companies.FindingsWithin the study, three distinct scenarios were identified. Each scenario shows a different level of importance for trade shows as a marketing tool in the future. None of the scenarios predicts that trade shows will be completely replaced by other means, but all of the scenarios forecast a highly competitive market for trade show organisers.Research limitations/implicationsThe paper evaluates the trade show itself as a marketing instrument rather than predicting the development of the global trade show industry. As projections are determined by the characteristics of trade shows themselves, the results can add to the discussion of strategic decisions globally, even though the scenario study predominantly involved German experts.Practical implicationsThe research provides practitioners with a list of important factors that influence the performance of exhibitors and trade show organisers and hence insights into the future of trade shows as a marketing instrument.Originality/valueThe paper provides a useful multidimensional perspective on what the future may hold for trade shows.
Microelectronic packaging reliability using the RSM technique
Authors: Wu Mei-Ling 
Published: April 2010

Purpose
The purpose of this paper is to identify the critical parameters that influence ball grid array and chip size package fatigue life in a random vibration environment by using a design of experimental (DOE) approach using simulation results.

Design/methodology/approach
The use of DOE and analysis of variation to identify the critical parameters and a response surface to generate a functional form for global modeling would be determined. Once the global modeling’s functional form was known, it can be used as boundary condition, which would be input to a local model. Knowing the critical stress, one would estimate the fatigue life from a damage model. It is the curvature of the printed wiring board in the region of the component of interest that is driving the component’s solder joint damage. The approach in this present work involves global-local modeling approaches. In the global model approach, the vibration response of the printed circuit board (PCB) will be determined.

Findings
This global model will give the response of the PCB at specific component locations of interest. This response is then fed into a local stress analysis for accurate assessment of the critical stresses in the solder joints of interest. The stresses are then fed into a fatigue damage model to predict the life.

Originality/value
The analysis proposed in this paper uses a failure type approach to damage analysis and involves global and local model approaches.
Effects of Zn additions on the structure of the soldered Sn-3.5Ag and Cu interfaces
Authors: Xu R.L. , Liu Y.C. , Wei C. , Yu L.M. 
Published: April 2010

Purpose
The interfacial structure is vitally important for achieving a good joint reliability during service. The purpose of this paper is to systematically explore the effects of Zn addition into the Sn-3.5Ag eutectic solder on the formation of intermetallic compound (IMC) layer at the interface between Sn-3.5Ag-xZn (x = 0, 0.9 and 3) solders and Cu pad.

Design/methodology/approach
To obtain useful information on the formation of interfacial structure and to determine an effective way to avoid the formation of brittle joints, a series of Sn-Ag lead-free solders with different Zn contents were prepared and soldered. To investigate the IMC layers between Sn-3.5Ag-xZn (x = 0, 0.9 and 3) lead-free solders and the Cu pads, three specimens of the Sn-3.5Ag-xZn/Cu were soldered at 250°C for one min.

Findings
It is found that the addition of Zn in the Sn-3.5Ag eutectic solder can prompt the formation of Cu5Zn8 IMCs, and restrain the formation of the Cu6Sn5 IMCs. Moreover, the addition of Zn in the Sn-3.5Ag eutectic solder will reduce the solubility of Cu in the liquid solder, which accelerates the growth of the formed IMCs. Consequently, the thickness of IMC layer increases with increasing the content of Zn.

Originality/value
This paper usefully demonstrates how the addition of Zn favoured the formation of the Cu5Zn8 phase and restrained the formation of the Cu6Sn5 phase. Moreover, the addition of Zn in the Sn-Ag eutectic solder would reduce the solubility of Cu in the liquid solder, which accelerates the growth of the formed IMCs. Consequently, the thickness of the IMC layer increased with increasing concentration of Zn.
Thermomechanically loaded lead-free LGA joints in LTCC/PWB assemblies
Authors: Nousiainen Olli , Urhonen Timo , Kangasvieri Tero , Rautioaho Risto , Vähäkangas Jouko 
Published: April 2010

Purpose
The purpose of this paper is to investigate the feasibility of using land grid array (LGA) solder joints as a second-level interconnection option in low-temperature co-fired ceramic (LTCC)/printed wiring board (PWB) assemblies for telecommunication applications. The characteristic behaviour of two commercial lead-free solder materials (Sn4Ag0.5Cu and Sn3Ag0.5Cu0.5In0.05Ni) in reflow processes and thermal cycling tests are also evaluated.

Design/methodology/approach
The effect of the reflow temperature profile on voiding in two lead-free solders in LTCC/PWB assemblies was investigated using X-ray and scanning electron microscopy (SEM) investigations. The test assemblies were fabricated and exposed to a temperature cycling test (TCT) in a 0-100°C or −40 to 125°C temperature range. Organic PWB material with a low coefficient of thermal expansion (CTE) was primarily used. In addition, to compare LGA assemblies with low and high global thermal mismatches, an LTCC module/FR-4 assembly was also fabricated and exposed to a TCT in a 0-100°C temperature range. The characteristic lifetime of the test assemblies was determined using DC resistance measurements. The failure mechanisms of the interconnections were verified using scanning acoustic microscopy, SEM and finite element (FE)-SEM investigations.

Findings
This work showed that the solderability of AgPt-metallized LTCC modules was poor, resulting in excessive voiding. This problem was avoided by using pre-tinned modules. In the test assemblies, the Sn4Ag0.5Cu joints had a lower void content and a higher characteristic lifetime compared with the Sn3Ag0.5Cu0.5In0.05Ni joints. Furthermore, it was observed that the Sn3Ag0.5Cu0.5In0.05Ni joints were more prone to fail along the interface between the Ag3Sn layer and the solder matrix than were the Sn4Ag0.5Cu joints. It was assumed that the observed difference in the primary failure mechanisms resulted in the decreased lifetime duration of the SnAgCu-InNi/Arlon in both temperature cycling conditions.

Originality/value
The results proved that the solderability of both solders in AgPt-metallized modules in a typical surface mount technology process was poor; however, the solderability of the test modules can be notably enhanced with pre-tinned pads. This work also demonstrated the effect of the metallization/solder pair on the failure mechanisms and failure rate in LTCC/PWB assemblies with LGA joints; the work also proved in the TCT, over a temperature range of 0-100°C, that using the present LGA joints in LTCC/PWB assemblies with a high global thermal mismatch did not increase the lifetime duration of the joints to the preferred level (3,000 cycles), whereas the performance of these joints was adequate in assemblies with a low global thermal mismatch. Moreover, the results indicated that using the LGA joint configuration enhanced the reliability of the LTCC/PWB assemblies compared with similar assemblies with collapsible ball grid array solder spheres.