bluuebunny/crossref_metadata_2025_split huggingface dataset:
The c-Myb target gene neuromedin U functions as a novel cofactor during the early stages of erythropoiesis
Authors: Gambone Julia E. , Dusaban Stephanie S. , Loperena Roxana , Nakata Yuji , Shetzline Susan E. 
Published: March 2011

AbstractThe requirement of c-Myb during erythropoiesis spurred an interest in identifying c-Myb target genes that are important for erythroid development. Here, we determined that the neuropeptide neuromedin U (NmU) is a c-Myb target gene. Silencing NmU, c-myb, or NmU's cognate receptor NMUR1 expression in human CD34+ cells impaired burst-forming unit-erythroid (BFU-E) and colony-forming unit-erythroid (CFU-E) formation compared with control. Exogenous addition of NmU peptide to NmU or c-myb siRNA-treated CD34+ cells rescued BFU-E and yielded a greater number of CFU-E than observed with control. No rescue of BFU-E and CFU-E growth was observed when NmU peptide was exogenously added to NMUR1 siRNA-treated cells compared with NMUR1 siRNA-treated cells cultured without NmU peptide. In K562 and CD34+ cells, NmU activated protein kinase C-βII, a factor associated with hematopoietic differentiation-proliferation. CD34+ cells cultured under erythroid-inducing conditions, with NmU peptide and erythropoietin added at day 6, revealed an increase in endogenous NmU and c-myb gene expression at day 8 and a 16% expansion of early erythroblasts at day 10 compared to cultures without NmU peptide. Combined, these data strongly support that the c-Myb target gene NmU functions as a novel cofactor for erythropoiesis and expands early erythroblasts.
The role of phosphatidylinositol 3-kinase-δ in the immunomodulatory effects of lenalidomide in chronic lymphocytic leukemia
Authors: Herman Sarah E. M. , Lapalombella Rosa , Gordon Amber L. , Ramanunni Asha , Blum Kristie A. , Jones Jeffrey , Zhang Xiaoli , Lannutti Brian J. , Puri Kamal D. , Muthusamy Natarajan , Byrd John C. , Johnson Amy J. 
Published: March 2011

Abstract
In patients with chronic lymphocytic leukemia (CLL), lenalidomide can promote humoral immune responses but also induces a distinct disease-specific toxicity of tumor flare and cytokine release. These CLL-specific events result from increased expression of costimulatory molecules on B cells. Here we demonstrate that lenalidomide activation of CLL cells depends on the phosphatidylinositol 3-kinase p110δ (PI3K-δ) pathway. Inhibition of PI3K-δ signaling by the PI3K-δ-inhibiting drug, CAL-101, or by siRNA knockdown of p110δ, abrogates CLL cell activation, costimulatory molecule expression, and vascular endothelial growth factor and basic fibroblast growth factor gene expression that is induced by lenalidomide. In addition, CAL-101 attenuates lenalidomide-mediated increases in immunoglobulin M production by normal B cells. Collectively, these data demonstrate the importance of PI3K-δ signaling for lenalidomide immune modulation. These findings may guide development of strategies for the treatment of CLL that combine lenalidomide with CAL-101, with other inhibitors of the PI3K-δ pathway, or with other agents that target downstream kinases of this signaling pathway.
Hematopoietic-Prostaglandin D2 synthase through PGD2 production is involved in the adult ovarian physiology
Authors: Farhat Andalib , Philibert Pascal , Sultan Charles , Poulat Francis , Boizet-Bonhoure Brigitte 
Published: March 2011

Abstract

Background
The prostaglandin D2 (PGD2) pathway is involved in numerous biological processes and while it has been identified as a partner of the embryonic sex determining male cascade, the roles it plays in ovarian function remain largely unknown. PGD2 is secreted by two prostaglandin D synthases (Pgds); the male-specific lipocalin (L)-Pgds and the hematopoietic (H)-Pgds.

Methods
To study the expression of the Pgds in the adult ovary, in situ hybridization were performed. Then, to evaluate the role of H-Pgds produced PGD2 in the ovarian physiology, adult female mice were treated with HQL-79, a specific inhibitor of H-Pgds enzymatic activity. The effects on expression of the gonadotrophin receptors FshR and LhR, steroidogenic genes Cyp11A1, StAR and on circulating progesterone and estradiol, were observed.

Results
We report the localization of H-Pgds mRNA in the granulosa cells from the primary to pre-ovulatory follicles. We provide evidence of the role of H-Pgds-produced PGD2 signaling in the FSH signaling through increased FshR and LhR receptor expression. This leads to the activation of steroidogenic Cyp11A1 and StAR gene expression leading to progesterone secretion, independently on other prostanoid-synthetizing mechanisms. We also identify a role whereby H-Pgds-produced PGD2 is involved in the regulation of follicular growth through inhibition of granulosa cell proliferation in the growing follicles.

Conclusions
Together, these results show PGD2 signaling to interfere with FSH action within granulosa cells, thus identifying an important and unappreciated role for PGD2 signaling in modulating the balance of proliferation, differentiation and steroidogenic activity of granulosa cells.
Affirmative Warnings may be Better Understood than Negative Warnings; Standard Neonatal Intensive Care Unit Drug Infusion Concentrations; Limits Placed on Prescription Transfers by Patients; Top Drugs that Cause Violence; Vincristine Caution Statement Reworded
Authors: Cohen Michael R. , Smetzer Judy L. 
Published: March 2011

These medication errors have occurred in health care facilities at least once. They will happen again—perhaps where you work. Through education and alertness of personnel and procedural safeguards, they can be avoided. You should consider publishing accounts of errors in your newsletters and/or presenting them at your inservice training programs. Your assistance is required to continue this feature. The reports described here were received through the Institute for Safe Medication Practices (ISMP) Medication Errors Reporting Program. Any reports published by ISMP will be anonymous. Comments are also invited; the writers' names will be published if desired. ISMP may be contacted at the address shown below. Errors, close calls, or hazardous conditions may be reported directly to ISMP through the ISMP Web site ( www.ismp.org ), by calling 800-FAIL-SAFE, or via e-mail at ismpinfo@ismp.org . ISMP guarantees the confidentiality and security of the information received and respects reporters' wishes as to the level of detail included in publications.
Evaluation of Recombinant Factor VIIa Off-Label Use at an Acute Care Hospital with Established Guidelines for Use
Authors: Allen John , Alexander Earnest 
Published: March 2011

Purpose At present, there are a scarcity of data available evaluating off-label prescribing patterns of recombinant factor VIIa (rFVIIa), pharmacoeconomic impact, and patient outcomes in clinical practice in an acute care setting with guidelines in place to influence prescribing practices. The primary objective of this study was to retrospectively evaluate the off-label usage and prescribing patterns of rFVIIa at a large acute care hospital with established rFVIIa guidelines. Results During the study period, a total of 199 patients were ordered rFVIIa, of which 181 (91%) received at least one dose of rFVIIa for an off-label use (n=181). Refractory bleeding and intracerebral hemorrhage were the 2 leading uses for rFVIIa, accounting for 30% (n = 54) and 29% (n = 51) of all uses, respectively. Overall, the mean number of doses per patient for all uses was 1.79. The mean number of doses per patient by non–FDA-approved use was highest in patients with cardiac surgery and refractory bleeding. The total yearly acquisition of rFVIIa for the study institution has decreased from 5.25 mcg/patient-day in 2005 to 2.52 mcg/patient-day in 2009. Conclusion The findings are encouraging and support the impact that education of pharmacy, nursing, and physician staff along with guideline development may have on off-label rFVIIa usage. Further research evaluating the impact of rFVIIa guidelines and/or order sets is warranted.
The Microstructure and Chemistry of the Reaction between Ti and α-Al2O3
Authors: Selverian J. H. , Bortz M. , Ohuchil F. S. , Notis M. R. 
Published: March 2011

ABSTRACTThe Ti/Al2O3 system is being considered for advanced aerospace applications and is important in microelectronics where Ti is used for metallization on Al2O3 substrates. We have studied the intrinsic reactivity of Ti with the R-plane (1012) surface of α-Al2O3 by x-ray photoemission spectroscopy (XPS) and transmission electron microscopy (TEM) techniques. XPS results indicate that a for deposition of several monolayers of Ti at 25 °C, the Ti reduces the Al2O3 surface to produce Ti-O bonds. At 1000 °C the Ti reduces the Al2O3 to produce Ti-O and Ti-Al bonds. Cross-section TEM specimens were prepared from 200 nm thick Ti films deposited on Al2O3 at 25 and 800 °C to observe the interface region. In samples deposited at 25 and 800 °C, without further annealing, no reaction zone could be seen in the TEM. Ordered Ti3Al (78 ± 5 Ti, 16 ± 3 Al and 6 ± 3 0 wt pct) was observed in a sample deposited at 25 °C and annealed at 800 °C for 2 hours.
Resin Selection Criteria for Molded Electronic Packages
Authors: Rimsa S. B. 
Published: March 2011

The selection of the proper resin system for a molded PWB or electronic package must take into account considerably more parameters than simply the cost of and the ability of the polymer to fill the tooling. Molding of an electronic package is only the initial step in a multi stage sequence to produce a functional PWB or interconnect device.It is of extreme importance that a manufacturer of molded electronic packages understand not only the fabrication properties of a resin, but also those mechanical, thermal, and chemical requirements of the circuit application and assembly operations.A specific circuitry application process will usually require a specific set of substrate characteristics. These performance characteristics may relate to platability, thermal stability, modulus, compressive strength, or even adhesive bondability for a given procedure. The substrate requirements for several popular circuit application methods is reviewed.Assembly presents perhaps the most demanding area of resin performance in electronic package or PWB fabrication. The thermal stresses encountered in wave soldering and vapor phase reflow will quickly differentiate among current engineering resin offerings. The importance of controlled moisture absorption and high temperature modulus retention is explored in addition to end use environmental factors which can be of special concern.
Surface Mount Technology (SMT) Substrate Material Requirements - A Brief Review
Authors: Ibrahim A. Mahammad 
Published: March 2011

ABSTRACTThe state of the art for the printed circuit (pc) industry is the Surface Mount Technology (SMT) using leadless ceramic chip carriers (LCCCs). The SMT technique is used to design, fabricate, and assemble affordable high-speed, high-density electronic modules with reduced size and weight. However, to take full advantage of the SMT, new high-performance printed circuit board (PCB) substrate materials must be developed, especially if the goal is to satisfy the high reliability required in military applications. The most critical requirement is matching the in-plane coefficient of thermal expansion (CTE) with the SMT-PCB's and the chip carriers (LCCCs) to reduce the solderjoint stresses during thermal cycling. Solder-joint reliability can be improved significantly by tailoring the in-plane CTE to approximately 6–7 ppm/°C (of the alumina chip carrier) using Kevlar and/or quartz fabric-reinforced polymer composites, instead of conventional glass composites. Less attention has been focussed on other important requirements, e.g., out-of-plane (Z-axis) expansion, glass transition temperature (Tg), dielectric constant, and resin microcracking, which also play important roles in the overall performance of the substrate materials. For example, high Z-expansion puts additional strain on the plated through holes (PTH), thereby affecting PTR reliability. A low Tgsignificantly increases the amount of thermal stress imposed during thermal cycling on solder joints and PTH, and leads to failures. This paper contains a brief review of the requirements of a SMT-PCB substrate material, including such critical parameters as: in-plane CTE, out-of-plane CTE, Tg, dielectric constant, fiber-to-resin ratio, and resin microcracking, and their effects on solder joint reliability, PTH reliability, dimensional stability, and electrical performance.
Chromium-Polyimide Interface Chemistry
Authors: Goldberg M. J. , Clabes J. G. , Viehbeck A. , Kovac C. A. 
Published: March 2011

ABSTRACTWe have studied the reactions occurring for the deposition of chromium onto pyromellitic dianhydride -4,4′-oxydianiline (PMDA-ODA) polyimide for a wide range of metal coverages, using X-ray photoelectron spectroscopy as well as solution studies involving model compounds. A multi-step, coverage-dependent, mechanism is proposed which includes an initial electron transfer from Cr to PMDA-ODA. followed by formation of Cr-O and and Cr-N polymer-bound intermediates, At higher metal coverage, Cr-oxides and Cr-nitrides are formed which may activate the polymer for subsequent formation of Cr-carbide. No evidence was obtained in support of a model involving initial formation of a π-arene complex between chromium atoms and PMDA-ODA. In the course of this work we have shown that similarities exist between the chemistry of metal atoms in condensed phases and the reactions occurring between metal atoms and surfaces.
Superconducting Interconnections in Future High Performance Systems
Authors: Frye R. C. 
Published: March 2011

ABSTRACTNew, high temperature superconducting materials could eventually be used for interconnections in electronic systems. Such interconnections would undoubtedly cost more to implement than conventional ones, so the most likely applications would be for complex, high-speed systems that could benefit from the performance advantages of a resistance-free interconnecting medium. The problem with conventional conductors in these systems is that the resistance of wires increases quadratically as dimensions are scaled down. The most important advantage offered by superconductors is that they are not linked to this scaling rule. Their principal limitation is the maximum current density that they will support and this determines the range of applications for which they are superior to conventional conductors. An analysis will be presented which examines the relative advantages of superconductors for different critical current densities, wire dimensions and system sizes.If their critical current densities are adequate, and if they can statisfy a number of processing criteria, then superconductors could find useful applications in a number of high performance electronic systems. The most likely applications will be those demanding very high interconnection densities. Several of these systems will be discussed.
Spin-On Glass Films in Multilevel Ic Interconnection
Authors: Gupta Satish K. 
Published: March 2011

ABSTRACTAmong the variety of techniques available today for interlevel dielectric planarization, techniques based on spin-on glass (SOG) films are relatively attractive because of process simplicity and minimal equipment requirements. This paper reviews the materials and processes of SOG technology as it is applied in dielectric planarization. The SOG planarization schemes employ SOG films either as a permanent part of the interlevel insulation layer or as a sacrificial layer in the ‘etch-back” techniques. The properties of the various types of comnircially available SOG materials are discussed in relation to their functional and processing characteristics.
Materials and Processes for High Functionality Hybrid Circuit Packages
Authors: Jaffe Donald 
Published: March 2011

ABSTRACTMaterials and processes used for high functionality hybrid circuit packages based on ceramic substrates are described. Emphasis is on hybrid circuits used for telecommunications and related applications. Examples include packages utilizing thin film technology, thick film technology and combinations of the two technologies. Various thick and thin multilayer approaches to achieve high interconnection density are discussed. These employ a variety of metal conducting systems in conjunction with glasses and/or polymeric materials as dielectric insulating layers.
Packaging of Components for Optical Fiber Technoidgy
Authors: Sriram S. , Homian R. L. 
Published: March 2011

ABSTRACTA number of promising tedcniques used to intercmnect two or more optical fibers and optical fibers with guided wave optical devices are reviewed. Such waveguide-to-waveguide interconnections impose severe optical and mechanical design constraints. components used in single mode infrared optical systems use fibers of five to ten microns in core diameter. This creates the need for subnicron alignment toleranc between the waveguides. Such severe toleranc requirements are satisfied, in the case of single mode fiber connectors, through the use of precision ceramic ferrules. Achieving the same performance, when interconnecting fibers and waveguide devices, is somewhat less straightforward. Several approaches are currently under study. One such approach uses precisely etched silicon V-grooves. Another approach uses self-aligned grooves or slots that are formed in the substrate material through ion-milling or laser-assisted etching. Components used in multimode fiber systems use fiber with fifty to one thousand micron core diameters, and are therefore more forgiving to misalignment. Despite this, careful design is required to achieve satisfactory performance. The misalignment penalties associated with a number of interconnect situations are illustrated and discussed in terms of alignment tolerances and fabrication difficulties.
Measurement of Die Stress from Packaging and Effects of Thermal Cycling
Authors: Robinson Murray J. , Tsay Cliff , Buynoski Matthew , Pendse Rajendra 
Published: March 2011

ABSTRACTDuring the processing and packaging of silicon integrated circuits there are many sources of die stress. Probably the least understood and controlled is the stress introduced during the die attach and molding processes. The largest packaging stresses are due to the mismatch of the thermal expansion coefficients between the leadframe and the die,and the die and the molding material. We report results obtained by monitoring the resistance changes of implanted, p-type resistors, undergoing various heat treatments with a matrix of mold and leadframe materials.
Ceramic Optical Package: Material Requirements and Guidelines for Material Selection
Authors: Yan M. F. , Rhodes W. W. 
Published: March 2011

ABSTRACTRecently Lightwave Device Packaging Department at AT&T Bell Laboratories has demonstrated that ceramic materials can provide cost effective and high quality packages to house optical and electronic components for lightwave communication applications. In this paper we examine the material requirements for optical packages. We also study the material properties of metals and ceramics with a potential application in optical packages. In particular, we review hermeticity, thermal conductivity, thermal expansion coefficient, dielectric constant, electrical resistivity, sintering temperature and mechanical strength of these materials. Our study will provide a data base and useful guidelines for designers to make uniformed decisions on material selection for optical package. We also review the mixing rules to predict the resultant property of a composite from the known attributes of its constituents and the use of new composite materials will provide a new degree of flexibility in the optical package design.
High Frequency Dielectric Response of Calcium Aluminate Cements: Potential Packaging Substrate Materials
Authors: Sliva Paul , Leffler M. , Bliss M. , Cross L. E. , Scheetz B. E. 
Published: March 2011

ABSTRACTDielectric permittivity and loss tangent were measured on: 1) pressed disks of four different calcium aluminate cements shear mixed with water and poly(vinyl alcohol) and cured at room temperature and 2) laminates of SECAR 71 cement sintered at 1450°C. Post resonance and perturbation methods were used for microwave frequency measurements. Far infrared dielectric response of the cements was determined by FTIR in the diffuse reflectance mode. The real and imaginary parts of the relative dielectric permittivity were obtained via a conventional Kramers-Kronig analysis.
Multilayer Analysis by Focused MeV Ion Beam
Authors: Takai M. , Kinomura A. , Izumi M. , Matsunaga K. , Inoue K. , Gamo K. , Satou M. , Namba S. 
Published: March 2011

ABSTRACTA high-energy (MeV) helium ion beam has been focused down to 1 μm by a combination of piezo-driven objective slits and a magnetic quadrupole doublet. Rutherford backscattering (RBS) mapping techniques using focused MeV ion beams were, for the first time, applied to multilayered structures of metals, isolated with insulators, representing a test structure for multilayered wiring or interconnections of integrated circuits to nondestructively analyze the imperfection of the structures.
Effects of Waste Composition and Loading on the Chemical Durability of a Borosilicate Glass
Authors: Clark D.E. , Maurer C.A. , Jurgensen A.R. , Urwongse L. 
Published: March 2011

ABSTRACTThe effects of waste composition and percent loading in a borosilicate glass designed for US defense high level wastes (HLW) have been evaluated. Three types of simulated wastes were investigated; high alumina, high iron and a composite representative of an average waste composition from Savannah River Plant (SRP) waste tanks. Corrosion resistance of the borosilicate glass is significantly enhanced by the presence of any of the three types of wastes. Additionally, corrosion resistance is improved as the % waste loading is increased in the glass. The best corrosion performance was obtained with the high alumina waste in deionized water.
Quantitative Determination of Crystalline Phases in Nuclear Waste Glasses
Authors: Feld R. H. , Stammler M. 
Published: March 2011

In order to assess the longterm chemical and physical stability of high level waste glasses it is important to know the amounts of crystalline phases present.In principal all information about the crystalline state can be derived from its X-ray powder diffraction pattern,provided the spectral resolution is sufficiently high. Powderdiffraction techniques are the only means available to determine the concentration of crystalline phases in the presence of equivalent amorphous components. In addition it permits the determination of specific crystalline phases in a multicomponent system.
Structural Effects of Radiation Damage in Silica Based Glasses
Authors: Manara A. , Gibson P.N , Antonini M. 
Published: March 2011

ABSTRACTThe results of recent measurements of optical absorption, etching rate and transmission electron microscopy in pure silica and borosilicate glasses are reported and discussed. At dose saturation conditions, the dependence of the optical density associated with the production of single atomic defects from the mass of the impinging particle shows a marked saturation at masses ≥ 20 amu. The corresponding etching rates increase by about 4 times with respect to unirradiated samples. In borosilicate glasses, the temperature dependence of the threshold dose rate of electrons to initiate the nucleation of bubbles shows a marked increase from about 300° to 600° K.
Leachability of Zircon as a Function of Alpha Dose
Authors: Ewing Rodney C. , Haaker Richard F. , Lutze Werner 
Published: March 2011

ABSTRACTThe variation in the leachability of naturally occurring zircons (ZrSiO4) as a function of total alpha dose has been measured at 87°C. For calculated doses in the range of 1016to 1018alphas/gm there is an increase of one order of magnitude in the weight percent of zircon that is dissolved and an increase in the leach rate of the zircon 2.9 × 10−8to 2.3 × 10×7gm/cm2day. Totally metamict specimens (dose ≥ 1019alphas/gm) have leach rates as high as 1.8 × 10−6gm/cm2day.