bluuebunny/crossref_metadata_2025_split huggingface dataset:
The liberal Hegelianism of Edward Caird
Authors: Tyler Colin 
Published: September 2010

PurposeThe paper establishes that Edward Caird developed a distinctive form of liberal Hegelianism out of his critical responses to Kant, the romantic tradition of Rousseau, Goethe and Wordsworth and indeed Hegel himself.Design/methodology/approachThe paper presents a philosophical reconstruction of Caird's social economics that is based on a close reading of a very wide range of Caird's writings including his recently published lectures on social ethics and political economy.FindingsCaird's theory of historical development underpinned his writings on social economics. One of his greatest debts in this regard was to his interpretation of the romantics, which introduced a rich conception of higher human capacities into his critical analysis of capitalism. When combined with his critique of Kantian formalism, this led Caird towards Hegel. Yet, Caird's concerns regarding corporatism's stultifying tendencies led him to develop a dynamic form of liberal Hegelianism, which placed far greater trust than had Hegel in the ability of free conscientious citizens to restructure and enrich established social categories (classes, professions, gender roles and so on) and the system of nations which those categories helped to constitute.Practical implicationsIf Caird's liberal Hegelianism were to be adopted today, we could live in much freer, fairer and enriching communities than we do at present.Originality/valueEdward Caird has been wrongly neglected in intellectual histories of Anglo‐American political theory, and while his writings on Kant's critical philosophy have received some scholarly attention, his critique of romanticism has never received the attention it deserves. This also draws on manuscripts that have been published only within the past five years, having been edited for the first time by the author of this paper.
T.M. Knox and the study of economic activity
Authors: Connelly James 
Published: September 2010

PurposeThe purpose of this paper is to show how T.M. Knox sought to conceptualise economic activity in the context of his philosophical background and in relation to the analysis of the nature of economics offered by Lionel Robbins.Design/methodology/approachThe paper presents an historical account of the development of Knox's thought, an exposition of his position in relation to that of Robbins and an analysis of the concept of economic activity.FindingsThe paper demonstrates the profound differences between an idealist conception of economics and a scientific conception of economics. It also shows the extent to which scientific conceptions are only one among a number of possible conceptions, and that they suffer from deep and perhaps unresolvable ambiguities.Originality/valueLionel Robbins' work receives a certain amount of attention in the literature on the history of economic thought, whereas contemporary commentary by philosophers such as T.M. Knox is ignored by the histories of economic thought. This paper is unique in bringing the two together and in showing that the debate in the 1930s about the foundations of economics goes beyond the discussions and advocates typically associated with it.
Research self‐efficacy, publication output, and early career development
Authors: Hemmings Brian , Kay Russell 
Published: September 2010

PurposeThis paper has two aims: to investigate the relationship of self‐efficacy beliefs in terms of research on publication output; and, to identify the relationship of self‐efficacy beliefs about research to the publishing outputs of neophyte lecturers.Design/methodology/approachA questionnaire was utilised to obtain responses from lecturers working full‐time at two large Australian universities (n=343). The data from this sample were analysed using factor analysis, correlation, and multiple regression analysis. Data from two sub‐samples of neophyte lecturer (n1=47; n2=78) were then subjected to a multivariate analysis of variance.FindingsFour research self‐efficacy subscales were derived from a factor analysis. These subscales were positively and significantly related and accounted for 46 percent of the total variance in total publications accrued. Significant differences were found between two groups of neophyte lecturer on nearly all items forming the respective research self‐efficacy subscales. And, group membership accounted for 45.4 percent of the total variance.Originality/valueThe findings have implications both theoretically and practically. Theoretically, the research self‐efficacy construct was shown to have four underlying dimensions and to be highly predictive of a measure of publication output. From a practical perspective, the items forming the research self‐efficacy subscales could be a useful tool to promote discussion about the tasks a lecturer may need to perform during an academic career. Further, the items could be ranked in terms of their discriminative capacity and, as a result, be used as the basis for researcher development and interventions to promote improved research self‐efficacy and therefore increased publication output.
Strategic architecture for e‐learning at H.P. University
Authors: Sharma Kunal , Sood Deepak , Singh Amarjeet , Pandit Pallvi 
Published: September 2010

PurposeThe purpose of the paper is to unravel a strategic architecture for e‐learning for a traditional university like Himachal Pradesh University (H.P. University) and provide guidelines as to how to carry the implementation of e‐learning for the university of the future.Design/methodology/approachGetting to the future first is not just about excelling competitors bent on reaching the same prize. It is also concerning having one's own view of what the prize is. There can be as many prizes as runners; imagination is the only restraining factor. The paper provides a literature review for a traditional university like H.P. University to venture into e‐learning.FindingsTo venture into e‐learning, H.P. University will have to reengineer itself, understand how competition will differ in the future and capture and refine insights into future opportunities.Research limitations/implicationsThe paper has limitations that it presents a review of literature from secondary sources.Practical implicationsThe paper provides guidelines as to how to implement e‐learning which will be beneficial for both the staff and the students.Originality/valueThe paper advocates the concept of strategic thinking in the education sector for implementing e‐learning.
The practice of co‐creating leadership in high‐ and low‐performing high schools
Authors: Jarrett Ehren , Wasonga Teresa , Murphy John 
Published: September 2010

PurposeThe purpose of this paper is to examine teacher perceptions of the practice of co‐creating leadership and its potential impacts on student achievement.Design/methodology/approachUsing a quantitative approach, the study compared the levels of the practice of co‐creating leadership dispositional values and institutional conditions that facilitate the practice of co‐creating leadership between high‐ and low‐performing high schools. Data was collected using a survey. The respondents were teachers from high‐ and low‐performing high schools. The data were analyzed using descriptive statistics, t‐tests, correlations, and regression.FindingsTeachers in high‐performing schools scored significantly higher on perceptions of the practice of co‐creating leadership dispositional values and the presence of institutional conditions that facilitate the practice. Correlation analyses found positive significant relations between dispositional values and institutional conditions facilitating co‐creating leadership. High‐performing schools had high correlations. Regression analyses indicated that active listening, deep democracy, and evolving power significantly predicted teachers' perceptions of the impact of dispositional values and organizational conditions on student achievement.Originality/valueThe paper offers insights into how co‐creating leadership may have potential impact on student achievement.
Re‐conceiving managerial capture
Authors: Baker Max 
Published: September 2010

PurposeThis paper aims to respond to recent calls to rethink the concept of managerial capture as it has been used to date to explore and explain the limited impacts of new forms of stakeholder engagement.Design/methodology/approachThe paper explores the grounding of views of managerial capture in the Habermasian ideal of participative democracy. It then attempts to re‐conceive the understanding of capture by drawing on Foucault's account of disciplinary power and its constitutive effects on subjectivity.FindingsCapture appears as a managerial mindset constituted by the pervasive demand for shareholder value. When stakeholder issues are considered within this frame they must be recast in ways that pose no moral or emotional challenge to the dominant logic of shareholder maximisation. This moral distancing or amoralisation can be traced to the accounting practices that make management visible to their superiors (board of directors or more senior levels of management) in terms of their utility. In seeking the recognition of their superiors, individual managers make themselves subjects of this deeper form of capture.Practical implicationsA less restricted lens for conducting future research in managerial capture is offered. While in practice stakeholder engagement fails to live up to the Habermasian ideal, it still holds some promise for delivering management accountability.Originality/valueThe paper shows that ideas of power and subjectivity are key to an understanding of environmental accountability and open the social and environmental accountability literature to a new set of interesting problematics.
Environmental management accounting and innovation: an exploratory analysis
Authors: Ferreira Aldónio , Moulang Carly , Hendro Bayu 
Published: September 2010

PurposeIncreased awareness regarding environmental issues has encouraged organisations to use environmental management accounting (EMA), which has been said to deliver many benefits to users, including an increase in innovation. There is, however, little evidence to consubstantiate this claim and thus this paper aims to investigate the issue. It also seeks to examine the role of strategy with EMA use and innovation.Design/methodology/approachThe paper uses a survey designed and administered to management accountants and financial controllers in large Australian businesses.FindingsThe analysis suggests that EMA use has a positive association with process innovation, but not with product innovation. It also finds that the effect of strategy on innovation was driven by the level of commitment to research and development. However, no statistically significant relationship between strategy and EMA use was found. The key driver of EMA use was industry.Research limitations/implicationsThe small sample size is the most important limitation of this study and affected the statistical power of the analysis conducted. The results need to be interpreted with caution.Practical implicationsThe study suggests that EMA use is associated with process innovation, implying that economic benefits may be realised by using this technique, while simultaneously enhancing environmental performance.Originality/valueThis is the first study to provide cross‐sectional evidence of the relationship between strategy, EMA use and innovation. It is also the first to propose a research instrument to measure EMA use as a multi‐item construct.
ACF curing process optimization based on degree of cure considering contact resistance degradation of joints
Authors: Tao Bo , Yin Zhouping , Xiong Youlun 
Published: September 2010

PurposeFrom the viewpoint of degree of cure, the purpose of this paper is to find how to improve the reliability of flip‐chip packaging modules based on an anisotropically conductive adhesive ﬁlm (ACF) interconnection process.Design/methodology/approachThe work begins by revealing the correlation of adhesive strength and contact resistance of flip‐chip joint interfaces with the degree of cure of the ACF. The effect of different degrees of curing on the electrical and mechanical properties of some typical ACF‐interconnected joints is studied, and the optimum degree of cure is suggested to achieve highly reliable ACF joints, where the performance variations of the adhesion strength and contact resistance are considered simultaneously. First, the degradation data of the contact resistance of some ACF assemblies, bonded with several degrees of cure, is collected during a standard high‐hydrothermal fatigue test. The resistance distribution is verified using a two‐parameter Weibull model and the distribution parameters are estimated, respectively. After that, a reliability analysis method based on the degradation data of contact resistance is achieved, instead of the traditional failure time analysis, and the reliability index, as well as the mean‐time‐to‐degradation of the ACF joints, as a function of the degree of cure, is deduced, through which the optimum degree of cure value and recommend range are suggested.FindingsNumerical analysis and calculations are performed based on the experiments. Results show that the optimum degree of cure to achieve highly reliable joints is 83 per cent, and the recommend range is from 82 to 85 per cent for the ACF tested (considering a 95 per cent confidence interval).Originality/valueThe paper provides important support for optimizing the curing process for various ACF‐based packaging applications, such as chip‐on‐glass packaging of liquid crystal displays and flip‐chip bonding of radio frequency identification, etc.
Investigation of Sn‐Zn‐Bi solders – Part II: wetting measurements on Sn‐Zn7Bi solders on copper and on PCBs with lead‐free finishes by means of the wetting balance method
Authors: Bukat K. , Sitek J. , Kościelski M. , Moser Z. , Gąsior W. , Pstruś J. 
Published: September 2010

PurposeThe purpose of this paper is to investigate the influence of Bi additions on the wetting properties of SnZn7Bi alloys (Bi=1 and 3 per cent by mass) on a copper substrate and printed circuit boards (PCBs) with lead‐free finishes (SnCu, immersion Sn, Ni/Au, organic solderability preservative) in the presence of fluxes. The practical implications of the results is the main purpose of these investigations.Design/methodology/approachA wetting balance method was used for wetting measurements at 230 and 250°C in nitrogen and air atmospheres in the presence of ORM0‐ or ROL0‐type fluxes. The PCBs were investigated ‘as received’ and after accelerated aging. The analysis of variance (ANOVA) analysis was performed in order to explain how the main factors of the experiments (the Bi content in the alloy (1 or 3 per cent), the test temperature and the test atmosphere) influenced the wetting ability of SnZn7Bi on Cu substrates.FindingsAs expected, a higher temperature and a higher Bi content in the alloy favoured the wetting of the copper substrate in the presence of the ORM0‐type flux in a nitrogen atmosphere. These results were confirmed by ANOVA analysis. Very good results were also obtained for the SnZn7Bi3 alloy's wettability on “tin coatings” on PCBs (SnCu and immersion Sn) both “as received” and after aging, in the presence of the ORM0‐type flux, for all the applied testing conditions (in both temperatures and N2 and air atmospheres). The less active flux (ROL0) caused a worsening of the alloy's wettability properties; however, the PCBs with SnCu and immersion Sn finishes maintained their wettability, even after aging, at very good and good levels, respectively.Research limitations/implicationsIt is suggested that further studies are necessary for confirmation of the practical application, but they should be limited to the soldering of SnZnBi3 on PCBs with “tin coatings” and the quality of the solder joint performance.Practical implicationsThe best SnZn7Bi3 wetting results on PCBs with “tin coatings” (SnCu and immersion Sn) at 230 and 250°C and in N2 and air atmospheres suggest the possibility of a practical usage of the tin‐zinc‐bismuth alloys for soldering in electronics using both the ORM0‐type flux and the even less active ROL0‐type flux, which are currently used in industrial lead‐free soldering processes.Originality/valueThe wetting balance method, combined with ANOVA was used as the quickest way to determine the wettability properties of SnZn7Bi on Cu substrates. Wettability measurements were also performed on the SnZn7 and SnZn7Bi alloys with different lead‐free finishes, in different experimental conditions.
An experimental and numerical investigation into the effects of the chip‐on‐film (COF) processing parameters on the Au‐Sn bonding temperature
Authors: Liu De‐Shin , Yeh Shu‐Shen , Kao Chun‐Teh , Huang Pay‐Yau , Tsai Chia‐I , Liu An‐Hong , Ho Shu‐Ching 
Published: September 2010

PurposeThe reliability of chip‐on‐film (COF) packages is fundamentally dependent upon the quality of the eutectic Au‐Sn joint formed between the Au bumps on the integrated circuit (IC) device and the Sn‐plated Cu inner leads. Therefore, it is essential that an appropriate bonding temperature is achieved during the inner lead bonding (ILB) process. The purpose of this paper is to identify the optimal processing conditions which maximize the reliability of the Au‐Sn joints.Design/methodology/approachThe paper commences by performing an experimental investigation to establish the temperature at three specific locations within the COF/ILB system in a typical gang‐bonding process. The relationship between the setting temperature of the bonding tool and the temperature of the tool surface is then calibrated using an off‐line experimental system. An ANSYS finite element (FE) model is then constructed to simulate the temperature distribution within the COF/ILB system under representative temperature conditions. The validity of the numerical model is confirmed by comparing the simulation results with the experimental temperature measurements. The FE model is then used in a 23 factorial design process to evaluate the effect of the principal COF/ILB processing parameters, namely the contact area, the tool temperature and the stage temperature, on the temperature induced at the interface between the Au bumps on the IC chip and the Sn‐coated Cu leads on the polyimide film.FindingsThe results reveal that the interfacial bonding temperature is determined primarily by the stage temperature.Originality/valueA regression analysis model is applied to the factorial design results to construct a COF/ILB design chart which enables the rapid identification of the stage and tool temperatures required to achieve the minimum feasible eutectic bonding temperature.
Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance
Authors: Mallik S. , Schmidt M. , Bauer R. , Ekere N.N. 
Published: September 2010

PurposeThe purpose of this paper is to study the rheological behaviours of lead‐free solder pastes used for flip‐chip assembly applications and to correlate rheological behaviours with the printing performance.Design/methodology/approachA range of rheological characterization techniques including viscosity, yield stress, oscillatory and creep‐recovery tests were carried out to investigate the rheological properties and behaviours of four different solder paste formulations based on no‐clean flux composition, with different alloy composition, metal content and particle size. A series of printing tests were also conducted to correlate printing performance.FindingsThe results show that in the viscosity test, all solder pastes exhibited a shear thinning behaviour in nature with different highest maximum viscosity. The yield stress test has been used to study the effect of temperature on the flow behaviour of solder pastes. A decrease in yield stress value with temperature was observed. The results from the oscillatory test were used to study the solid‐ and liquid‐like behaviours of solder pastes. Creep‐recovery testing showed that the solder paste with smaller particle size exhibited less recovery.Research limitations/implicationsMore extensive research is needed to simulate the paste‐roll, aperture‐filling and aperture‐emptying stages of the stencil printing process using rheological test methods.Practical implicationsImplementation of these rheological characterization procedures in product development, process optimization and quality control can contribute significantly to reducing defects in the assembly of flip‐chip devices and subsequently increasing the production yield.Originality/valueThe paper shows how the viscosity, yield stress, oscillatory and creep‐recovery test methods can be successfully used to characterize the flow behaviour of solder pastes and also to predict their performance during the stencil printing process.
Creep properties of Sn‐0.7Cu composite solder joints reinforced with nano‐sized Ag particles
Authors: Tai Feng , Guo Fu , Liu Jianping , Xia Zhidong , Shi Yaowu , Lei Yongping , Li Xiaoyan 
Published: September 2010

PurposeThe purpose of this paper is to investigate the creep properties of Sn‐0.7Cu composite solder joints reinforced with optimal nano‐sized Ag particles in order to improve the creep performance of lead‐free solder joints by a composite approach.Design/methodology/approachThe composite approach has been considered as an effective method to improve the creep performance of solder joints. Nano‐sized Ag reinforcing particles were incorporated into Sn‐0.7Cu solder by mechanically mixing. A systematic creep study was carried out on nano‐composite solder joints reinforced with optimal nano‐sized Ag particles and compared with Sn‐0.7Cu solder joints at different temperatures and stress levels. A steady‐state creep constitutive equation for nano‐composite solder joints containing the best volume reinforcement was established in this study. Microstructural features of solder joints were analyzed to help determine their deformation mechanisms during creep.FindingsThe creep activation energies and stress exponents of Ag particle‐enhanced Sn‐0.7Cu lead‐free based composite solder joints were higher than those of matrix solder joints under the same stress and temperature. Thus, the creep properties of nano‐composite solder joints are better than those of Sn‐0.7Cu solder joints.Originality/valueThe findings indicated that nano‐sized Ag reinforcing particles could effectively improve the creep properties of solder joints. A new steady‐state creep constitutive equation of nano‐composite solder joints was established. Deformation mechanisms of Sn‐0.7Cu solder and nano‐composite solder joints during creep were determined.