bluuebunny/crossref_metadata_2025_split huggingface dataset:
Self‐assembly in additive manufacturing: opportunities and obstacles
Authors: Crane N.B. , Tuckerman J. , Nielson G.N. 
Published: May 2011

PurposeAdditive manufacturing (AM) offers substantial flexibility in shape, but much less flexibility in materials and functionality – particularly at small size scales. A system for automatically incorporating microscale components would enable the fabrication of objects with more functionality. The purpose of this paper is to consider the potential of self‐assembly to serve as an automated programmable integration method. In particular, it addresses the ability of random self‐assembly processes to successfully assemble objects with high performance despite the possibility of assembly errors.Design/methodology/approachA self‐assembled thermoelectric system is taken as a sample system. The performance expectations for these systems are then predicted using modified one‐dimensional models that incorporate the effects of random errors. Monte‐Carlo simulation is used to predict the likely performance of self‐assembled thermoelectric systems and evaluate the impact of key process and system design parameters.FindingsWhile assembly yield can drop quickly with increasing numbers of assembled parts, large functional assemblies can be constructed by arranging components in parallel to provide redundancy. In some cases, the performance losses are minimal. Alternatively, sensing can be incorporated to identify perfect assemblies. For small assemblies, the probability of perfection may be high enough to achieve an acceptable assembly rate. Small assemblies could then be combined into larger functional systems.Originality/valueThe paper identifies two strategies that can guide the development of AM processes that incorporate miniature components to increase the system functionality. The analysis shows that this may be possible despite significant errors in the self‐assembly process because systems may be tolerant of significant assembly errors.
Enterprise education: the effect of creativity on training outcomes
Authors: Lourenço Fernando , Jayawarna Dilani 
Published: May 2011

PurposeThis study seeks to draw on the theory of planned behaviour (TPB) to explore the effects of a creativity‐enhancing training programme on the learning intentions of nascent entrepreneurs. The key focus is to evaluate the impact of the nascent entrepreneurs' perceived level of creativity on training outcomes, measured in terms of perceived ease of use, perceived usefulness and intention to exploit learning. Implications for theory and enterprise education policy are discussed.Design/methodology/approachThe paper draws on data from a cross sectional survey of two groups of trainees: final‐year business‐enterprise degree‐students, and participants from a leading UK enterprise programme, New Entrepreneur Scholarship (NES). The data from a total sample of 384 were analysed using structural equation modelling (SEM). Data were subjected to essential validity and reliability tests prior to using in the SEM analysis.FindingsThe results supported the hypothesis that participants who perceive themselves as having higher perceptions of creativity will have higher tendencies to learn. There is also support for a full mediation role of new learning in explaining the relationship between creativity and intention to exploit learning. Creative individuals also rate other training outcomes as positive; both perceived usefulness and perceived ease‐of‐use received statistical support. Perceived usefulness acts as a strong mediator to the relationship between learning from creativity training and nascent entrepreneurs' intention to exploit their learning. On the whole, results largely agree with the TPB as applied to entrepreneurship and suggest trainees' perception of creativity as a driver for enhancing learning habits among nascent entrepreneurs.Practical implicationsThe research has highlighted several issues that influence the learning behaviour of nascent entrepreneurs and so helps to inform entrepreneurship theory and enterprise policy related to enterprise and entrepreneurship education. As this is one of the first attempts to situate enterprise education within the theory of planned behaviour, this study will particularly be useful to frame questions for future research.Originality/valueThe study is useful as it proposes a new dimension to an already popular debate around learning and entrepreneurial potential. This paper emphasises that the development of enterprising skills should be spread and integrated into different aspects within an entrepreneurship programme, as opposed to small‐blocks of consecutive sessions, to avoid negative effects caused by the perception of creativity.
Financial constraints of ethnic entrepreneurship: evidence from Germany
Authors: Bruder Jana , Neuberger Doris , Räthke‐Döppner Solvig 
Published: May 2011

PurposeThe theory of small business finance predicts that ethnic minority‐owned businesses are more likely to be credit constrained in the start‐up process than are native‐owned businesses. In Germany, empirical evidence for this issue is scarce because of missing data. This paper aims to address these issues.Design/methodology/approachThe paper reviews previous studies and uses data from a survey of ethnic and native entrepreneurs in Germany that include detailed information about start‐up financing. The hypotheses were tested for differences in financial constraints using univariate analyses and apply multivariate regression models to identify the causes of credit constraints in start‐up financing.FindingsThe data provide evidence that entrepreneurs with an immigration background (“ethnic entrepreneurs”), defined as German residents who hold foreign citizenship or who were born outside Germany, are significantly more likely to be denied credit or to be awarded smaller loans than requested than are native entrepreneurs. However, the underlying reasons for this effect may be differences in risk factors and financial relationships, rather than ethnicity.Research limitations/implicationsThe dataset consists of 234 observations. The results refer to the sample and might not be representative of ethnic minority start‐ups in general.Practical implicationsApart from the risk factors observed in the study, communication problems and lack of information about possible sources of external financing may be relevant. Better communications between financial institutions and ethnic minority businesses may help to reduce the financing gap vis‐à‐vis native entrepreneurs.Originality/valueThis is the first examination of the financial constraints of ethnic entrepreneurship in Germany using univariate and multivariate analyses. Previous evidence has been limited to observations about possible discrimination against ethnic minorities and has not tested the significance of observed differences in access to credit.
Developing a conceptual framework of strategic entrepreneurship
Authors: Luke Belinda , Kearins Kate , Verreynne Martie‐Louise 
Published: May 2011

PurposeThis paper aims to examine the integration of entrepreneurship and strategy to develop a conceptual framework of strategic entrepreneurship. The framework is developed through an analysis of theory and refined through an examination of practice.Design/methodology/approachThis framework is considered in the context of potentially entrepreneurial and strategic activity undertaken by 12 of the 17 state‐owned enterprises (SOEs) operating in New Zealand in 2006‐2007. Based on a review of documents, observation, and interviews with SOE executives, cases of 12 SOE activities were analysed to compare and contrast strategic entrepreneurship in practice.FindingsThe findings reveal distinct elements within the four activities classified as strategic entrepreneurship, activities, such as leveraging from core skills and resources from a strategic perspective, and innovation from an entrepreneurial perspective.Originality/valueThis study is one of the first to examine the nature of strategic entrepreneurship in practice and the associated financial returns.
The state of the public relations profession in the UK
Authors: Gregory Anne 
Published: May 2011

PurposeThe purpose of this paper is to provide a status report on the development of the public relations profession in the UK in the first decade of the twenty‐first century. This is the most comprehensive review to date and its aim is to provide a definitive overview of developments and trends in the UK and the issues it faces.Design/methodology/approachA review of three major surveys of the public relations profession taken at three points in the first decade of the twenty‐first century, along with six other reference reports, supplemented by appropriate literature.FindingsThe report provides a perspective on the profession as a whole, the work and demographics of professionals and CEO views on the profession and the issues and opportunities facing it.Research limitations/implicationsThe main three research studies are based mainly on membership of the professional body in the UK and therefore could have a potential bias. The four research studies which includes CEO interviews have limited numbers of participants and two studies are based on National Health Service CEOs only so the results may not be entirely representative.Practical implicationsThe uses of this study are fourfold: first, the UK public relations profession is second in size to the USA and worth investigating in its own right. Second, the study will allow comparison with other benchmark investigations in other countries. Third, the study will identify the state, issues, trends and challenges of the profession in the UK and help those studying the practice into setting a research agenda which will help the profession practically and generate opportunities for theory building and testing. Fourth, it will inform curriculum content for those designing study programmes in public relations and corporate communication.Originality/valueThe findings presented here provide the most comprehensive study of the UK profession's development over the first decade of the twenty‐first century to date.
Ethical Positioning Index (EPI): an innovative tool for differential brand positioning
Authors: Sagar Mahim , Khandelwal Rishabh , Mittal Amit , Singh Deepali 
Published: May 2011

PurposeThe purpose of this paper is to introduce the Ethical Positioning Index (EPI), an innovative ranking scale based on the ethical issues in brand positioning. This paper is based on the core idea that ethics can be used as a product differentiator and can create a strategic advantage.Design/methodology/approachFive basic elements of brand positioning, brand identity, brand image, brand personality, brand awareness, and brand communication, are blended with the three basic elements of ethics; beliefs, values, and symbols and customs. The EPI emerges from the established ethical brand positioning framework and the analysis from the conducted survey which was composed of brand positioning and ethics questions.FindingsConsumer driven weights have been obtained and a mathematical model has been proposed to evaluate the total score and finally the ranking of the brands.Research limitations/implicationsThe EPI parameters' weight will vary owing to the non‐existence of universal ethics and hence subsequently every cohort will have its own weight.Practical implicationsEPI will be an important tool from the managerial point of view as it serves as a step‐by‐step guide to compare the position of the brand in an integrated and ethical manner.Social implicationsThe EPI will bring a change in the ideology of the brands, making them employ more ethical perspectives in their branding, which will be highly welcomed by consumers and society.Originality/valueThe role of ethics in brand positioning has been studied and blended to generate a novel‐ranking scale (EPI).
Revisiting strategic communication's past to understand the present
Authors: Waters Richard D. , Lemanski Jennifer L. 
Published: May 2011

PurposeThe purpose of this paper is to compare the communication styles on the web sites of a random sample of the top American corporations and non‐profit organizations. By revisiting the traditional approach to understanding strategic communication, the four models of public relations provide insights into the direction and nature of organizational communication.Design/methodology/approachA random sample ofFortune500 (n=180) andPhilanthropy400 (n=170) was conducted. Although public relations research has never measured internet communication using the four models, the researchers created original scales to measure their web performance.FindingsThe research reveals that both corporations and non‐profits have strong preferences for using one‐way communication on their web sites. However, both groups moderately incorporated two‐way communication practices as corporations were more likely to use two‐way research practices and non‐profits were more likely to engage in conversations online.Originality/valueThis research examines organizational communication by returning to a previous method of analysis that has been cast aside by current scholars. However, assessing communication from the models of public relations perspective provides insights that current research strategies have not provided because they assume two‐way communication is the preferred form of communication.
Overview and outlook of through‐silicon via (TSV) and 3D integrations
Authors: Lau John H. 
Published: May 2011

PurposeThe purpose of this paper is to focus on through‐silicon via (TSV), with a new concept that every chip or interposer could have two surfaces with circuits. Emphasis is placed on the 3D IC integration, especially the interposer (both active and passive) technologies and their roadmaps. The origin of 3D integration is also briefly presented.Design/methodology/approachThis design addresses the electronic packaging of 3D IC integration with a passive TSV interposer for high‐power, high‐performance, high pin‐count, ultra fine‐pitch, small real‐estate, and low‐cost applications. To achieve this, the design uses chip‐to‐chip interconnections through a passive TSV interposer in a 3D IC integration system‐in‐package (SiP) format with excellent thermal management.FindingsA generic, low‐cost and thermal‐enhanced 3D IC integration SiP with a passive interposer has been proposed for high‐performance applications. Also, the origin of 3D integration and the overview and outlook of 3D Si integration and 3D IC integration have been presented and discussed. Some important results and recommendations are summarized: the TSV/redistribution layer (RDL)/integrated passive devices passive interposer, which supports the high‐power chips on top and low‐power chips at its bottom, is the gut and workhorse of the current 3D IC integration design; with the passive interposer, it is not necessary to “dig” holes on the active chips. In fact, try to avoid making TSVs in the active chips; the passive interposer provides flexible coupling for whatever chips are available and/or necessary, and enhances the functionality and possibly the routings (shorter); with the passive interposer, the TSV manufacturing cost is lower because the requirement of TSV manufacturing yield is too high (>99.99 percent) for the active chips to bear additional costs due to TSV manufacturing yield loss; with the passive interposer, wafer thinning and thin‐wafer handling costs (for the interposer) are lower because these are not needed for the active chips and thus adds no cost due to yield loss; with the current designs, all the chips are bare; the packaging cost for individual chips is eliminated; more than 90 percent of heat from the 3D IC integration SiP is dissipated from the backside of high‐power chips using a thermal interface material and heat spreader/sink; the appearance and footprint of current 3D IC integration SiP designs are very attractive to integrated device manufactures, original equipment manufactures, and electronics manufacturing services (EMS) because they are standard packages; and underfills between the copper‐filled TSV interposer and the high‐ and low‐power chips are recommended to reduce creep damage of the lead‐free microbump solder joints and prolong their lives.Originality/valueThe paper's findings will be very useful to the electronic industry.
Testing on dynamic behavior of PBGA assembly by considering fixed‐modes
Authors: Yang Ping , Chen Zixia 
Published: May 2011

PurposeThe purpose of this paper is to develop a systematic experimental investigation for testing dynamic behavior of plastic ball grid array (PBGA) integrity in electronic packaging and to investigate the dynamic behavior of PBGA assembly by considering fixed‐modes for design and reliability evaluation of PBGA packaging.Design/methodology/approachA PBGA assembly prototype with different structure and material parameters is designed and manufactured. The modal distribution under excitation cycling can be tested by hammering test. The dynamic test about the PBGA assembly prototype can be implemented with different structure characteristics, materials parameters and fixed‐modes. To illustrate the validity of experimental test, the numerical simulation for the dynamic behavior of the PBGA assembly prototype is developed by using finite element method. Comparison between the experimental results and simulation can illustrate the validity of the experimental test and finite element modeling each other.FindingsThe modal distribution test shows the influence of structure characteristics, materials parameters and fixed‐modes of PBGA assembly board. The changing trends of the dynamic modal characteristics during the dynamic excitation can be obtained with different structure characteristics, materials parameters and fixed‐modes of PBGA assembly. Test shows that the fixed location of the assembly board is the most important factor to influence the first frequency and modal deformation of the assembly board. Higher frequency and smaller deformation can be obtained when there are more constraints in printed circuit board.Research limitations/implicationsThe numerical model is a compendious model by predigesting structure. The research on more accurate mathematical model of the PBGA assembly prototype is a future work.Practical implicationsIt can imply the dynamics of PBGA assembly. It builds a basis for future work for design and reliability evaluation of PBGA packaging.Originality/valueThis paper provides useful information about the dynamic behavior of PBGA assembly with different structure characteristics, materials parameters and fixed‐modes.
Stabilization network optimization of internally matched GaN HEMTs
Authors: Luo W.J. , Chen X.J. , Yang C.Y. , Zheng Y.K. , Wei K. , Liu X.Y. 
Published: May 2011

PurposeThe purpose of this paper is to report on the stabilization network optimization of internally matched GaN high electron mobility transistors (HEMTs).Design/methodology/approachThe effects of the two stabilization networks on the characteristics of the device are discussed, such as the stability, power gain and output power.FindingsWith the optimized stabilization network, the internally matched GaN HEMTs with 16‐mm gate width exhibited good stability and delivers a 46 dBm output power with 6.1 dB power gain under the continuous wave condition at 8 GHz. By using the optimized stabilization network, the package process of the large‐scale microwave power device of GaN HEMTs can be simplified.Originality/valueThis paper provides useful information for the internally matched GaN HEMTs.
A low‐power CMOS DC‐DC buck converter with on‐chip stacked spiral inductor
Authors: Lee Chan‐Soo , Choi Ho‐Yong , Kim Yeong‐Seuk , Kim Nam‐Soo 
Published: May 2011

PurposeThe purpose of this paper is to present a fully integrated power converter. A stacked spiral inductor is applied in a voltage‐mode CMOS DC‐DC converter for the chip miniaturization and low‐power operation.Design/methodology/approachThe three‐layer spiral inductor is simulated with an equivalent circuit and applied to the DC‐DC converter. The DC‐DC buck converter has been fabricated with a standard 0.35 μm CMOS process. The power converter is measured in both experiment and simulation in terms of frequency and electrical characteristics.FindingsExperimental results show that the converter with the stacked spiral inductor operates properly with the inductance of 7.6 nH and mW power range. The measured inductance of the stacked spiral inductor is found to be almost half of the circuit designed value because of the parasitic resistances and capacitances in the spiral inductor.Originality/valueThis paper first introduces the application of the integrated stacked spiral inductor in DC‐DC buck converter for display driver circuit, which requires a low‐power operation. It also shows the fully integrated DC‐DC converter for chip miniaturization.
Compensating victims of bankrupted financial institutions: a law and economic analysis
Authors: Dijkstra Robert J. , Faure Michael G. 
Published: May 2011

PurposeThe purpose of this paper is to understand the incentive effects of existing compensation mechanisms in case of the bankruptcy of a financial institution.Design/methodology/approachThe paper uses insights of law and economics to predict the effects of compensation mechanisms on the incentives of depositors, financial institutions, financial regulators and government.FindingsThe paper shows that the current compensation system in The Netherlands will not provide sufficient incentives for all stakeholders to prevent the failure of a financial institution. Adjustments to this system are necessary to improve these incentives.Original/valueThe paper examines for the first time the impact of different compensation mechanisms on the incentives of multiple stakeholders. It also shows how these mechanisms influence each other regarding their incentive generating capability. These findings offer important insights for policy makers.
Judicial review of Financial Services Compensation Scheme's exercise of power to impose compensation costs levy
Authors: Gray Joanna 
Published: May 2011

PurposeThe purpose of this paper is to discuss the judicial review of Financial Services Compensation Scheme's (FSCS) exercise of power to impose compensation costs levy (R v. Financial Services Compensation Scheme Ltd and Financial Services Authority ex parte ABS Financial Planning and others; Queens Bench Division of High Court; Administrative Court (Birmingham); Mr Justice Beatson).Design/methodology/approachThe paper describes the judicial review action. It arose out of the FSCS imposition of an interim levy of some £32 million to defray compensation costs arising from the default of Keydata Investment Services Ltd (Keydata) and the claimants impugned, as wrong in law and procedurally incorrect, its decision in March 2010 to allocate the costs of that levy to be borne by those firms that the FSCS classified as “investment intermediaries”. The paper gives details of the decision.FindingsThe claimants argued that the error in law or irrationality were constituted by the FSCS's determination that: first, the costs of the Keydata claims arose or could be expected to arise out of one or more of the four regulated activities in the D2 sub‐class to which FSCS referred in its reasoning behind its decision. Rather, the claimants argued, the true position was that the claims did not arise out of any of these activities but arose out of Keydata's marketing of its plans; and second, the costs did not arise and could not be expected to arise out of any D1 sub‐class activity of “managing investments”.Originality/valueThis decision illustrates the increasing difficulty of drawing a clear line between discretionary management and agency broking, for the claimants made a strong argument that Keydata should be considered to have been much more than a passive distribution conduit or channel.