bluuebunny/crossref_metadata_2025_split huggingface dataset:
Risk following hospitalization in stable chronic systolic heart failure
Authors: Abrahamsson Putte , Swedberg Karl , Borer Jeffrey S. , Böhm Michael , Kober Lars , Komajda Michel , Lloyd Suzanne M. , Metra Marco , Tavazzi Luigi , Ford Ian 
Published: March 2013

AimsWe explored the impact of being hospitalized due to worsening heart failure (WHF) or a myocardial infarction (MI) on subsequent mortality in a large contemporary data set of patients with stable chronic systolic heart failure (HF).Methods and resultsA total of 6558 patients with stable systolic HF, 6505 with analysable data, with an EF of ≤35%, who were included in the Systolic Heart failure treatment with the If inhibitor ivabradine Trial (SHIFT), were followed for a median of 22.9 months with respect to hospitalizations and vital status. Among the 1288 patients who had at least one hospitalization due to WHF or MI, 455 (35.3%) died during follow‐up compared with 600 (11.5%) among patients not hospitalized for these reasons. The risk for death was highest in the early phase after hospitalization. The risk declined rapidly during the first month but remained 3.5‐fold (95% confidence interval 2.3–5.1) increased at 18 months after a first WHF hospitalization and 8.8‐fold (95% confidence interval 3.6–21.6) increased at 18 months after a first MI hospitalization.ConclusionThe present study confirms previous findings that in patients with stable chronic systolic HF, a hospitalization for WHF or MI is associated with substantially increased risk for subsequent death even with contemporary extensive background pharmacological therapy. The risk is most pronounced in the early phase of hospitalization but remains elevated even after 18 months. Preventing HF hospitalization appears as an important therapeutic objective in such patients, and a hospitalization for WHF or MI should lead to a careful therapeutic reassessment.
Performance of rice straw‐based composites using environmentally friendly polyalcoholic polymers‐based adhesive system
Authors: Basta Altaf H. , El‐Saied Houssni , Lotfy Vivian F. 
Published: March 2013

PurposeThe purpose of this paper is to study the possibility of preparing high performance, agro‐based composites from rice straw, using eco‐polyalcohol polymers‐based adhesive system. The utilization of rice straw (undesirable biowastes) for the production of high quality biocomposite products, will add economic value, help to reduce the environmental impact of waste disposal and, most importantly, provide a potentially inexpensive alternative to the existing commercial artificial wood‐panels.Design/methodology/approachSimple synthesizing and optimizing the polyalcohol polymers‐based non‐toxic adhesive system were carried out, by blending corn starch, as natural polyalcohol polymer with polyvinyl alcohol, as synthetic polyalcohol polymers‐based adhesive (St/PV adhesive), at temperature ∼75°C. The percentages of adhesive components, type of starch, bonding temperature and time were optimized. Assessment of the synthesized adhesive was performed from its adhesion behavior (bond strength), in comparison with commercial thermosetting resin (urea‐formaldehyde), as well as the properties (mechanical and physical properties) of the composites produced. The effects of amount and type of water resistance co‐additives (paraffin wax and polyester), on mechanical properties of RS‐based composite were also optimized.FindingsThe promising adhesive system exhibits improved performance over a previously commercially HCHO‐based adhesive (UF), and results bonding strength 9.8 N/mm2, as well as MOR, IB and TS of RS‐based composites up to 31 N/mm2, 0.49 N/mm2 and 20%, respectively.Research limitations/implicationsThrough the studied eco‐adhesive with relatively high natural polyalcohol polymer (starch) in presence of water‐resistance additive (PE) provided a good bonding strength and comparative RS‐based composite properties, with that produced from commercial UF. For the mechanical properties (MOR and IB) are complied the standard values; while water resistance is still higher. Further study is needed to solve this problem.Practical implicationsThe approach provided a HCHO‐free adhesive with good bonding strength, comparative board strength and water resistance, reasonable working life, and without formaldehyde emission. Starch‐based adhesive with low percentages of polyvinyl alcohol is considered a promising inexpensive alternate adhesive in wood industry based on rice straw wastes, which traditionally required expensive pMDI.Originality/valueThe paper provides a potential way to utilise undesirable rice by‐product (RS), corn starch as industrial raw material. This will benefit farmers significantly. Meanwhile, the modified starch adhesive with low percentage of PVA is promising to partly or completely replace urea formaldehyde resin and pMDI that are mainly used in wood industry, or pMDI in RS‐based artificial wood, avoiding formaldehyde emission or toxic gases during exposed to burning, and reducing the dependence on petroleum products.
Surface finish effect on reliability of SAC 305 soldered chip resistors
Authors: Collins Maurice N. , Punch Jeff , Coyle Richard 
Published: March 2013

PurposeThe purpose of this paper is to assess the long‐term reliability of lead‐free Sn96.5Ag3.0Cu0.5 (SAC305) under accelerated temperature cycling (ATC) conditions. Test vehicles consisted of commercial 2512 ceramic chip resistors soldered to printed circuit boards (PCBs) using three different Pb‐free surface finishes: organic solderability preservative (OSP), immersion silver (IAg) and electroless nickel immersion gold (ENIG).Design/methodology/approachTwo populations of solder joints were monitored continuously during a thermal cycle of 0°C to 100°C with a ramp rate of 10°C/min and a 30 min dwell at the temperature extremes. One population was cycled to 2,500 cycles, the other population was cycled to 8,250 cycles. Failures were defined in accordance with the IPC‐9701A industry test guidelines and failure data are reported as characteristic life, η. Microstructural evolution was characterised using metallographic techniques and back‐scattered scanning electron microscopy (SEM). Fractography was performed on post‐cycled resistors to determine failure mechanisms.FindingsThe results showed that the lifetime of the chip resistors could be ranked as follows: OSP>ENIG>IAg after 8,250 thermal cycles, when>73 per cent of the population had failed. It was found that the relative performance of OSP finishes improved with longer periods of cycling. This was attributed to diffusion of copper into the bulk solder and which subsequently, over time, acted as a dispersion strengthening mechanism. The relatively poor performance of IAg finishes was attributed to void formation.Originality/valueThe paper provides new and valuable information to end‐users about the long‐term reliability of lead‐free solder on three commonly used lead‐free surface finishes. The performance of each surface finish is explained in terms of microstructural evolution and void formation.
Effect of Pr on properties and Sn whisker growth of Sn‐9Zn‐xPr solder
Authors: Xue Peng , Xue Songbai , Shen Yifu , Xiao Zhengxiang , Zhu Hong , Long Weimin , Yu Xinquan 
Published: March 2013

PurposeThe purpose of this paper is to improve the properties of Sn−9Zn solder, so as to meet the requirements of industrial applications.Design/methodology/approachThe effects of Praseodymium on property and Sn whisker growth under aging treatment in Sn−9Zn lead‐free solder were investigated.FindingsThe results indicate that with the addition of rare earth Pr, the wettability and mechanical properties of Sn−9Zn solder were improved. The best wettability and comprehensive property of soldered joint is obtained when the content of Pr is 0.08 wt.%. After aging treatment at 150°C for 360 h, the mechanical properties of Sn−9Zn−0.08Pr decreased but are still obviously higher than that of Sn−9Zn. Moreover, when the content of Pr reached 0.1 wt.%, plenty of Sn−Pr compounds were found in the Sn−9Zn solder. The inevitable oxidation of Sn−Pr compounds would cause a high stress accumulated within PrSn3 phases, which would be served as driving force to induce the Sn whisker sprout and growth after aging treatment at 150°C for 120 h to 360 h. Compared with the results in Sn−9Zn−0.5Ga−0.7Pr solder that Sn whisker observed until the addition of Pr reached 0.7 wt.%, it could be inferred that the addition of Ga may react against the sprout of Sn whisker.Originality/valueIt is found that the addition of Pr can improve the properties of solder and avoid Sn whisker growth in the right range and proper conditions. The cost of the solder with added Pr is limited to RMB 2 yuan/kg so it can be widely used in industry.
Evaluation of Cu/SnAg microbump bonding processes for 3D integration using wafer‐level underfill film
Authors: Yang Tsung‐Fu , Kao Kuo‐Shu , Cheng Ren‐Chin , Chang Jing‐Yao , Zhan Chau‐Jie 
Published: March 2013

Purpose3D chip stacking is a key technology for 3D integration in which two or more chips are stacked with vertical interconnections. In the case of multi chip stacking with fine pitch microbump connections, capillary dispensing presents big limitations in terms of cost and processability. The purpose of this paper is to describe the way in which wafer‐level underfill (WLUF) process development was carried out with particular emphasis on microbump height coplanarity, bonding pressure distribution and the alignment of the microbumps. A three factorial design of experiment (DOE) was also conducted to enhance the understanding of the factors impacting the WLUF process such as bonding pressure, temperature and time on reliability test.Design/methodology/approachB‐staged WLUF was laminated on an 8″ wafer with a 30 μm pitch bump structure of 8 μm Cu/5 μm Sn2.5Ag Pb‐free solder. After wafer dicing, the chip with the WLUF was assembled on a substrate chip with the same bump structure using a high accuracy bonder. The substrate chip had metalisation (wiring) to enable evaluation of the electrical characteristics of the bonded daisy chain chips as they varied with material bonding process conditions and reliability testing.FindingsThe WLUF bonding process development pertaining to the processability and reliability for the flip chip assembly using Cu/SnAg microbumps was successful in this work.Originality/valueThe development of a WLUF bonding process that offers reliability for flip chip assembly using Cu/SnAg microbumps has been presented in this work. The critical steps, such as alignment of the WLUF coated chip with the substrate chip and void elimination, which enable this technology to work were optimised.
Application of homotopy perturbation and numerical methods to the circular porous slider
Authors: Madani M. , Khan Yasir , Mahmodi Gh. , Faraz Naeem , Yildirim Ahmet , Nasernejad B. 
Published: March 2013

PurposeThe purpose of this paper is to present the problem of three‐dimensional flow of a fluid of constant density forced through the porous bottom of a circular porous slider moving laterally on a flat plate.Design/methodology/approachThe transformed nonlinear ordinary differential equations are solved via the homotopy perturbation method (HPM) for small as well as moderately large Reynolds numbers. The convergence of the obtained HPM solution is carefully analyzed. Finally, the validity of results is verified by comparing with numerical methods and existing numerical results.FindingsClose agreement of the two sets of results is observed, thus demonstrating the accuracy of the HPM approach for the particular problem considered.Originality/valueInteresting conclusions which can be drawn from this study are that HPM is very effective and simple compared to the existing solution method, able to solve problems without using Padé approximants and can therefore be considered as a clear advantage over the N.M. Bujurke and Phan‐Thien techniques.
Homotopy analysis method for space‐ and time‐fractional KdV equation
Authors: Tauseef Mohyud‐Din Syed , Yıldırım Ahmet , Yülüklü Eda 
Published: March 2013

PurposeThe purpose of this paper is to present numerical solutions for the space‐ and time‐fractional Korteweg‐de Vries (KdV) equation using homotopy analysis method (HAM). The space and time‐fractional derivatives are described in the Caputo sense. The paper witnesses the extension of HAM for fractional KdV equations.Design/methodology/approachThis paper presents numerical solutions for the space‐ and time‐fractional KdV equation using HAM. The space and time‐fractional derivatives are described in the Caputo sense.FindingsIn this paper, the application of homotopy analysis method was extended to obtain explicit and numerical solutions of the time‐ and space‐fractional KdV equation with initial conditions. The homotopy analysis method was clearly a very efficient and powerful technique in finding the solutions of the proposed equations.Originality/valueIn this paper, the application of HAM was extended to obtain explicit and numerical solutions of the time‐ and space‐fractional KdV equation with initial conditions. The HAM was clearly very efficient and powerful technique in finding the solutions of the proposed equations. The obtained results demonstrate the reliability of the algorithm and its wider applicability to fractional nonlinear evolution equations. Finally, the recent appearance of nonlinear fractional differential equations as models in some fields such as the thermal diffusion in fractal media makes it necessary to investigate the method of solutions for such equations and the authors hope that this paper is a step in this direction.
Modified variational iteration method for solving a neutral functional‐differential equation with proportional delays
Authors: Ghaneai H. , Hosseini M.M. , Tauseef Mohyud‐Din Syed 
Published: March 2013

PurposeThe purpose of this paper is to introduce an auxiliary parameter into the well‐known variational iteration algorithm which proves very effective to control the convergence region of approximate solution.Design/methodology/approachIn this paper, an auxiliary parameter is introduced into the well‐known variational iteration algorithm which proves very effective to control the convergence region of approximate solution.FindingsThe present technology provides a simple way to adjust and control the convergence region of approximate solution for any values. An optimal auxiliary parameter can be obtained by the error of norm two of the residual function.Originality/valueIt is confirmed that submitted manuscript is original and is not being considered in any other journal.
Numerical investigation of forced convection in pin/plate‐fin heat sinks heated by impinging jet using porous medium approach
Authors: Feng S.S. , Kim T. , Lu T.J. 
Published: March 2013

PurposeThe purpose of this paper is to present a porous medium model for forced air convection in pin/plate‐fin heat sinks subjected to non‐uniform heating of a hot gas impinging jet. Parametric studies are performed to provide comparisons between inline square pin‐fin and plate‐fin heat sinks in terms of overall and local thermal performance for a fixed pressure drop.Design/methodology/approachHeat conduction in substrates is coupled with forced convection in the pin/plate‐fin flow channel. The forced convection is considered by employing the non‐Darcy model for fluid flow and the thermal non‐equilibrium model for heat transfer. A series of experiments is performed to validate the model for both the pin‐fin and plate‐fin heat sinks.FindingsThe present porous medium model is capable of capturing the presence of lateral heat spreading in the plate‐fins and the absence of lateral heat spreading in the pin‐fins under non‐uniform thermal boundary condition, attributing to the adoption of the orthotropic effective thermal conductivity for the solid phase in the energy equation. The present results show that the inline square pin‐fin heat sink has topological advantage over the plate‐fin heat sink, although the heat spreading through the plate‐fins on reducing the peak temperature on the substrate is pronounced.Originality/valueThis paper reports an original research on theoretical modeling of forced convection in pin/plate‐fin heat sinks subjected to the non‐uniform heating of an impinging jet.
Artificial compressibility based CBS solutions for double diffusive natural convection in cavities
Authors: Arpino Fausto , Massarotti Nicola , Mauro Alessandro , Nithiarasu Perumal 
Published: March 2013

PurposeThe purpose of the paper is to numerically simulate steady‐state thermo‐solutal convection in rectangular cavities with different aspect ratios, subject to horizontal temperature and concentration gradients, and validate the results against numerical and experimental data available from literature.Design/methodology/approachThe fully explicit Artificial Compressibility (AC) version of the Characteristic Based Split (CBS) scheme is adopted to solve double diffusion (DD) problems. A stabilization analysis is carried out to efficiently solve the problems considered in the present work. The thermal and solutal buoyancy forces acting on the fluid have been taken into account in case of aiding and opposing flow conditions.FindingsThe stability limits derived by the authors for the thermo‐solutal convection assume a fundamental role to efficiently solve the DD problems considered. In the cases characterized by higher Rayleigh number the convergent solution is obtained only by employing the new stability conditions. The efficient matrix free procedure employed is a powerful tool to study complex DD problems.Originality/valueIn this paper, the authors extend the stabilization analysis for the AC‐CBS scheme to the solution of DD, fundamental to efficiently solve the present problems, and apply the present fully explicit matrix free scheme, based on finite elements, to the solution of DD natural convection in cavities.
Reverse innovation: a global growth strategy that could pre‐empt disruption at home
Authors: Govindarajan Vijay , Trimble Chris 
Published: March 2013

PurposeThe authors, leading authorities on global innovation, warn that Western companies targeting emerging markets to help drive growth will likely find that the traditional strategy of global localization will prove inadequate. An alternative is their new concept of reverse innovation which this paper aims to introduce.Design/methodology/approachOne example is the portable ultrasound machine developed originally by GE in the early 2000s to meet the particular needs of the Chinese market. Technology advances have since helped propel the growth of a $250 million business opportunity for GE globally, through finding many new applications in the USA and other advanced economies.FindingsHistorically, multinationals innovated in rich countries and sold their products in poor countries. Reverse innovation is doing the opposite.Practical implicationsReverse innovation also highlights the potential for very low price‐point innovations originating in the developing world to generate new market demand back in the richer economies.Originality/valueReverse innovations can have global impact. Ultimately, they have the potential to migrate from poor countries to rich ones.
Dynamic models for managing big decisions
Authors: Arms Hanjo , Wiecher Mathias , Kleiderman Valeska 
Published: March 2013

PurposeThis paper seeks to describe a new approach to analyzing critical resource investment plans, Dynamic Decision Making (DDM), an A.T. Kearney innovation based on a sophisticated modeling process that can improve the quality and transparency of decision making.Design/methodology/approachThe paper explicates the five components of the novel DDM approach: formal, but narrowly focused, future modeling; improve the understanding and evaluation of risk; design a dynamic strategy; calculate “Total Value” of dynamic strategies and according probability distribution; and formalize the decision making process.FindingsIn a volatile environment, this system, which promotes flexibility and maps out contingency plans, has proven exceptionally useful with clients making large capital investment decisions and “Bet the Company” strategic moves.Practical implicationsEach step in the DDM decision‐making process reveals contingencies and opportunities to react to a competitor, a policy, or an environmental change – and to modify the initial plan as a result.Originality/valueThe DDM total value methodology enables managers to consider both the risks and the value of flexibility when planning a capital investment project.
Reflecting on perceived deinstitutionalization of gender‐biased employment practices in accountancy
Authors: Whiting Rosalind H. 
Published: March 2013

PurposeThe purpose of this paper is to explore the changes in gender‐biased employment practices that it is perceived have occurred in New Zealand accountancy workplaces over the last 30 years, using Oliver's model of deinstitutionalization.Design/methodology/approachSequential interviewing was carried out with 69 experienced chartered accountants and three human resource managers, and at a later date with nine young female accountants.FindingsEvidence is presented of perceived political, functional and social pressures cumulatively contributing to deinstitutionalization of overt gender‐biased employment practices, with social and legislative changes being the most influential. Deinstitutionalization appears incomplete as some more subtle gender‐biased practices still remain in New Zealand's accountancy workplaces, relating particularly to senior‐level positions.Research limitations/implicationsThis study adds to understanding of how professions evolve. The purposeful bias in the sample selection, the small size of two of the interviewee groups, and the diversity in the interviewees' workplaces are recognized limitations.Practical implicationsIdentification of further cultural change is required to deinstitutionalize the more subtle gender‐biased practices in accountancy organizations. This could help to avoid a serious deficiency of senior chartered accountants in practice in the future.Originality/valueThis paper represents one of a limited number of empirical applications of the deinstitutionalization model to organizational change and is the first to address the issue of gender‐biased practices in a profession. The use of sequential interviewing of different age groups, in order to identify and corroborate perceptions of organizational change is a novel approach.