bluuebunny/crossref_metadata_2025_split huggingface dataset:
L'obligation d'information de l'article 8-1 de la loi du 19 juillet 1976
Authors: Angeli Guillaume 
Published: October 2015

Les pouvoirs publics et les industriels sont de plus en plus sensibles à
l'état de pollution des sols servant de sites à des activités économiques, et de nouvelles normes sont venues imposer au vendeur d'informer son acquéreur de l'exploitation antérieure sur le site vendu d'une exploitation soumise aux dispositions de la loi du 19 juillet 1976 relative aux installations classées pour la protection de l'environnement. Seul le propriétaire du terrain sera tenu de cette obligation d'information, et non l'exploitant de l'activité, alors que ce dernier sera responsable devant l'administration de la remise en état du site. Cette divergence est à même de faire naître des incertitudes en matière de responsabilité effective, ainsi que des recours en cascade. De même, seul le contrat de vente est visé, et non toutes les autres formes de mutation, telles que prises de participations ou fusion-absorption, diminuant de ce fait l'intérêt de ce texte. Cette obligation d'information comprend deux volets :
- d'une part, elle portera sur le fait qu'une activité soumise à autorisation d'après la loi du 1 9 juillet 1 976 a été exploitée sur le site ;
- d'autre part, le vendeur doit informer l'acquéreur des dangers et inconvénients importants résultant de cette activité et dont il a eu connaissance, même s'il n'a pas eu la qualité d'exploitant.
Le véritable objet d'une telle obligation sera d'inciter le propriétaire d'un site industriel, même non exploitant, à se préoccuper du respect des normes environnementales se rapportant aux activités exploitées sur ce site.
Le maire et le bruit - Compétences, actions et responsabilités
Authors: Cuillandre François 
Published: October 2015

Les nuisances dues au bruit constituent une pollution très particulière.
Elles sont parmi les moins bien tolérées, car portant atteinte souvent de manière grave à la tranquillité publique. Conscient de l'importance du problème, le législateur a proclamé le droit au calme par la loi du 31 décembre 1992. Un dispositif juridique désormais complet fait du maire l'acteur principal - mais pas unique - de la lutte contre le bruit. D'une part, il est garant du respect du droit au calme dans sa commune, mais plus globalement il doit être gestionnaire du bruit. Il a un rôle préventif, conciliateur et répressif. Mais, d'autre part, sa responsabilité peut se voir engagée soit par son action, les ouvrages publics pouvant causer des dommages indemnisables, soit par son inaction pour absence ou insuffisance de mesures prises, propres à garantir la tranquillité publique.
La lutte contre le bruit doit être perçue comme un enjeu politique majeur. Le maire est certainement le mieux placé pour mener ce combat. Il en a désormais les moyens juridiques : à lui de s'en servir.
La loi du 30 décembre 1996 sur l'air et l'utilisation rationnelle de l'énergie (première partie)
Authors: Faberon Jean-Yves 
Published: October 2015

La loi du 30 décembre 1996 sur l'air et l'utilisation rationnelle de l'énergie vient remplacer la loi du 2 août 1961 relative à la lutte contre la pollution atmosphérique et les odeurs, et compléter la loi du 19 juillet 1976 relative aux installations classées pour la protection de l'environnement. Cette loi comprend tout d'abord un dispositif d'ensemble visant, dans un contexte fortement dégradé, à protéger la qualité de l'air. Elle définit dans ce but trois instruments d'évaluation de la pollution atmosphérique : les objectifs de qualité de l'air, les seuils d'alerte et les valeurs limites. Elle prend des dispositions propres à assurer le droit à l'information de la population en la matière. Et elle permet, en cas d'urgence, au préfet, de prendre des mesures fortes : de restriction ou de suspension des activités concourant aux pointes de pollution, y compris de la circulation des véhicules, la gratuité de l'accès aux transports publics en commun étant alors assurée. Elle met aussi en place ou développe des instruments de planification de la qualité de l'air : les plans régionaux pour la qualité de l'air, les plans de protection de l'atmosphère et les plans de déplacements urbains.
De plus cette loi comprend des mesures diverses qui situent le dispositif de droit de l'environnement dans son contexte global de développement durable : mesures relatives à la maîtrise de l'énergie, prenant en compte les transports, ou encore la santé. Des dispositions répressives sanctionnent effectivement cette loi.
Souffrances psychiques chez les adolescents obèses… et diabétiques
Authors: Corduan Guillaume , Rabourdin Sophie , Bergmann-Billig Joanne 
Published: October 2015

La mixité somato-psychique se retrouve fréquemment dans la nature des problématiques des jeunes passant la porte de La Maison des adolescents de Strasbourg. Les adolescents diabétiques et obèses ont d’emblée représenté une part substantielle de la population accueillie pour une souffrance morale liée à une maladie chronique. Un atelier de groupe peut être proposé en complément des entretiens habituels (individuels ou avec les parents). Mais son acceptation est délicate pour ces adolescents qui craignent le regard de l’autre. C’est pourquoi le public accueilli au sein de ce groupe devait se sentir en confiance et uni autour d’un aspect ni physique (stigmatisant) ni causal (culpabilisant). Cela a été possible en recentrant le groupe thérapeutique sur le corps, objet de souffrance qui s’impose et s’oppose à la narrativité. De cette réflexion sont nés deux ateliers, d’une part un atelier vidéo « Silence, elles tournent » et d’autre part un atelier d’inspiration sociodramatique « Jeux d’rôle ». « Silence, elles tournent » se compose d’un groupe ouvert de six jeunes filles maximum et de trois professionnels. Notre propos discutera de l’expérience de ces ateliers de groupe à la mda de Strasbourg et en pointera les limites. Nous montrerons comment en recréant un espace transitionnel de jeu, dans le sens du play winnicotien, le faire semblant créatif de ces dispositifs permet une remise en route du processus adolescent.
A Comparison of Flip Chip Bump Electromigration Reliability for Cu Pillar, High Pb, SnAg, and SnPb Bump Structures
Authors: Syed Ahmer , Dhandapani Karthikeyan , Nicholls Lou , Moody Robert , Berry C. J. , Darveaux Robert 
Published: October 2015

Electromigration failure in flip-chip bumps has emerged as a major reliability concern due to potential elimination of Pb from flip-chip bumps and a continuous drive to increased IO density resulting in a reduction of bump size and pitch. Traditionally, flip-chip interconnects incorporate a high Pb bump soldered with a SnPb eutectic paste to the substrate or another die. However, because of RoHS directives, the industry is responding with Pb free bump development, such as SnAg bump with SAC solder or Cu Pillar with SAC/SnAg solder.
Although a number of recent publications deal with electromigration reliability of Pb free and Cu Pillar bumps, a gap exists in terms of their performance comparison with high Pb and SnPb solder on the same bump geometry. The available test data is based on different test vehicles and it becomes difficult to determine the relative performance of these different metallurgies under accelerated test conditions. In addition, not all published data provides the essential parameters of Black's equation to determine the performance and reliability for actual use conditions.
This paper attempts to fill this gap by comparing electromigration performance of High Pb, SnPb eutectic, SnAg, and Cu Pillar bumps using the same test vehicle. A special test vehicle was designed with daisy chain structures for electromigration testing and the packages we assembled on test cards. The testing is being done using five (5) stress conditions (combination of current and temperature) to estimate the current density exponent, n, and activation energy, Ea, parameters for Black's equation. The reliability data as well as failure modes for these bump metallurgies will be presented in the paper.
Magnetic Field Imaging for 3D applications
Authors: Gaudestad Jan , Orozco Antonio 
Published: October 2015

The challenges that 3D integration present to Failure Analysis require the development of new Fault Isolation techniques that allows for non-destructive, true 3D failure localization.
By injecting a current in the device under test (DUT), the current generates a magnetic field around it and this magnetic field is detected by a sensor above the device. Magnetic field imaging (MFI) is a natural candidate for 3D Fault Isolation of complex 3D interconnected devices. This is because the magnetic field generated by the currents in the DUT passes unaffected through all materials used in device fabrication; the presence of multiple metal layers, dies or other opaque layers do not have any impact on the magnetic field signal. The limitations of the technique are not affected by the number of layers in the stacked devise in samples such as wirebonded stacked memory, Through Silicon Via (TSV) stacked die or even package on package (PoP). The sample is raster scanned and magnetic field is acquired at determined steps providing a magnetic image of the field distribution. This magnetic field data is typically processed using a standard inversion technique to obtain a current density map of the device. The resulting current map can then be compared to a circuit diagram, an optical or infrared image, or a non-failing part to determine the fault location. Today, giant-magnetoresistive (GMR) sensors have been added to the Superconducting Quantum Interference Device (SQUID) sensor to allow higher resolution and Fault Isolation (FI) I at die level.
Magnetic Field Imaging (MFI), using SQUID as the high sensitive magnetic sensor in combination with a high resolution GMR sensor. A solver algorithm capable of successfully reconstructing a 3D current path based on an acquired magnetic field image from both sensors has been developed. The generic 3D inverse problem has no unique solution. Given a particular 3D magnetic field distribution, there are an infinite number of current path distributions that will result in such magnetic field. This ill-posed problem has restricted, so far, the use of magnetic imaging to 2D. A different kind of 3D solver can be constructed, nevertheless capable of obtaining a single solution.
The 3D solver algorithm is not only capable of extracting the 3D current path, but it also provides valuable geometrical information about the device. Accurately being able to position each current segment in a layer allows the FA engineer to follow the current as it vertically moves from one die (or layer) to another. [1,2,3]
Aerosol Printing of High Resolution Films for LTCC-Multilayer Components
Authors: Ihle Martin , Partsch Uwe , Mosch Sindy , Goldberg Adrian 
Published: October 2015

For the electronic packaging of sensor stable and cost-efficient fine-line printing technologies on LTCC and high frequency laminates are needed. Especially common technologies like screen printing and thin film techniques are unsuitable for fine structures or too expensive. In addition there is no direct write technology for 3D-LTCC-designs as well as for high reliability Co-firing structures. Closing this gap the aerosol printing technology is used to print high resolution conductors on planar and non-planar substrates.
Aerosol printing is a direct write non-contact printing technology of functional layers. After a pneumatic atomization the ink is transformed into 1 to 5 μm droplets. The resulting, continuous aerosol stream is focused by a sheath gas in the printing head. Thus the long standoff distance between substrate and deposition tip of max. 5 mm allows the 3D-printing on non-planar substrates. With optimized inks and printing parameters line widths of 10 μm are achievable. This paper will present applications for aerosol printed functional layers on LTCC. These are, for example, aerosol printed films embedded in co-fired LTCC, fine line structures for high frequency applications and the evaluation of printed 3D-structures like LTCC-stairways. Furthermore the 90 degree contacting of unconventional sensor designs will be presented.
Design of an LTCC Structure for a Micro-Ceramic Combustor
Authors: Belavic Darko , Hrovat Marko , Dolanc Gregor , Makarovic Kostja , Zarnik Marina Santo , Holc Janez 
Published: October 2015

Advanced micro- or macro-systems are in some cases made with multilayer ceramic technology. Low-Temperature Co-fired Ceramic (LTCC) technology is considered as one of the more suitable technologies for the fabrication of ceramic micro-systems that integrate screen-printed, thick-film electronic components as well as three-dimensional buried structures, for example, cavities and channels. One of the applications is a ceramic combustor. The chemical energy of the fuel is converted into thermal energy in a chemical micro-combustor through a burning process, while the accompanying high temperatures and, frequently, high pressures impose harsh conditions on the combustor structure. Therefore, the combustor must be carefully designed not only from the functional, thermal and chemical points of view, but also with respect to the mechanical strength.
The combustor device was prepared by laminating of Du Pont 951PX LTCC green tapes. The fabricated 3D LTCC structures with buried cavities and channels including two inlets (for fuel and air), the evaporator for the fuel, the mixing system of the channels (for mixing the evaporated fuel and air), the distribution channels and eight microburners were realized. The main parts are eight micro-burners realized as buried cavities. In the burners a platinum-based catalyst was deposited to assist the oxidation, i.e., the burning, of the methanol with the air. Thickfilm, platinum-based heaters and temperature sensors are incorporated within the structure. The device was tested with different flow rates of liquid methanol (1 ml/h to 5 ml/h) and air (7 l/h to 15 l/h). The obtained temperatures were between 250°C and 450°C.
Combined 3D Micro Structuring of Ceramic Green Tape Using Punching, Embossing and Laser Processing
Authors: Hagen Gunter , Kopp Thomas , Ziesche Steffen , Partsch Uwe , Ruprecht Ester 
Published: October 2015

Multilayer ceramics technology, as LTCC, offers several advantages for the fabrication of miniaturized three-dimensional structures, e.g. for microsystem applications, where electrical, mechanical and fluidic functions can be combined in robust and compact packages. 3D features, required by those applications, are e.g. vias for electrical and thermal interconnection, cavities for chip integration and channels for fluidic functions. They can be realized, in principle, in the sintered, as well as in the green state, but structuring in the green state dominates due to the then far better machinability of the material. Ceramic green tape structuring is usually accomplished by mechanical or laser machining. Punching is the standard process for realizing vias or cavities in LTCC. By nature, only through tape features can be realized, but 3D features can be realized by stacking of several layers. Embossing can be used for the realization of quite complex 3D structures with high resolution. It can be carried out either at elevated temperature, at which the binder of the tape is softened (hot embossing) or at room temperature (cold embossing). Laser structuring is a quite flexible method, which allows both through-cutting and engraving without any specific tool. However, a certain roughness of ablated areas cannot be avoided, and depth control and uniformity of laser engraved features remain challenging.
In the present paper, the different techniques will be compared regarding their appropriateness for different structuring tasks. A combined use of punching, embossing and laser processing is described, which has been made possible by a novel machine and tool concept.
Nanocomposite Film Dielectrics for High Temperature Power Conditioning Capacitors
Authors: Slenes Kirk , Bragg Lew 
Published: October 2015

Emerging power electronics in a broad range of military, aerospace, hybrid vehicle, renewable energy and drilling applications rely on advances in dielectric materials for capacitors. Compact capacitors possessing low dielectric loss and high operating temperature capability are needed for power conditioning in advanced converter and inverter designs for these applications. Wound film capacitors represent the preferred capacitor technology but are limited by low operating temperature capabilities, &lt; 150°C, and low volumetric efficiency, capacitance per unit volume less than 1.0 μF/cc.
TPL is developing processes and manufacturing techniques for fabrication of advanced capacitor films comprised of high temperature polymers modified with ceramic nanoparticles. The selected polymers enable high temperature operation and the ceramic nanoparticles enhance volumetric efficiency by increasing the dielectric constant. The fabricated films are directly adaptable to conventional wound film capacitor construction methodologies.
This paper provides an overview of TPL's experience to-date with a film dielectric material system comprised of fluorenone polyester polymer and titanate nanoparticle filler. The fluorenone polyester polymer was selected to provide a stable operating temperature of at least 300°C, while the addition of the titanate powder increases the dielectric constant and, in turn, the volumetric efficiency of wound film capacitors constructed with this film system. Status and ongoing capacitor development issues are provided relative to the intended high temperature power conditioning applications.
Thin Film Multichip Packaging for High Temperature Digital Electronics
Authors: Fang Kun , Zhang Rui , Isaacs-Smith Tami , Johnson R. Wayne , Andarawis Emad , Vert Alexey 
Published: October 2015

Digital silicon carbide integrated circuits provide enhanced functionality for electronics in geothermal, aircraft and other high temperature applications. A multilayer thin film substrate technology has been developed to interconnect multiple SiC devices along with passive components. The conductor is vacuum deposited Ti/Ti:W/Au followed by an electroplated Au. A PECVD silicon nitride is used for the interlayer dielectric. Adhesion testing of the conductor and the dielectric was performed as deposited and after aging at 320°C. The electrical characteristics of the dielectric as a function of temperature were measured.
Thermocompression flip chip bonding of Au stud bumped SiC die was used for electrical connection of the digital die to the thin film substrate metallization. Since polymer underfills are not compatible with 300°C operation, AlN was used as the base ceramic substrate to minimize the coefficient of thermal expansion mismatch between the SiC die and the substrate. Initial die shear results are presented.
Counterfeit Detection Strategies: When to Do It / How to Do It
Authors: Caswell Greg 
Published: October 2015

Counterfeit components have been defined as a growing concern in recent years as demand increases for reducing costs. In fact the Department of Commerce has identified a 141% increase in the last three years alone. A counterfeit is any item that is not as it is represented with the intention to deceive its buyer or user. The misrepresentation is often driven by the known presence of defects or other inadequacies in regards to performance. Whether it is used for a commercial, medical or military application, a counterfeit component could cause catastrophic failure at a critical moment.
The market for long life electronics, based on commercial off the shelf (COTS) parts, such as those used in medical, military, commercial depot repair, or long term use applications (e.g. street and traffic lights, photovoltaic systems), seems to create a perfect scenario for counterfeiters. With these products, components wear out and need to be replaced long before the overall product fails. The availability of these devices can be derived in many ways. For example, a typical manufacturer may render a component obsolete by changing the design, changing the functionality, or simply discontinuing manufacture. Also, the parts that are available after a design has been discontinued are often distributed by brokers who have very little control over the source or supply. Recycling of devices has also emerged as a means of creating counterfeit devices that are presented as new. And finally, as demand and price increase, the likelihood of counterfeits also increases.
This paper will address the four unique sources of counterfeit components and insight into how they occur. Detection methodologies, such as visual inspection, mechanical robustness, X-Ray, XRF, C-SAM, Infrared Thermography, electrical characterization, decapsulation, and marking evaluations, will be compared and contrasted, as well as multiple examples of counterfeit parts identified by DfR.
Transfer molding technology for smart power electronics modules - materials and processes
Authors: Becker K.-F. , Joklitschke D. , Braun T. , Koch M. , Thomas T. , Schreier-Alt T. , Bader V. , Bauer J. , Nowak T. , Bochow-Ness O. , Aschenbrenner R. , Schneider-Ramelow M. , Lang K.-D. 
Published: October 2015

During the last years within power electronics packaging a trend towards compact power electronics modules for automotive and industrial applications could be observed, where a smart integrated control unit for motor drives is replacing bulky substrates with discrete control logic and power electronics. Most recent modules combine control and power electronics yielding maximum miniaturization. Transfer molding is the method of choice for cost effective encapsulation of such modules due to robustness of the molded modules and moderate cost of packaging. But there are challenges with this type of package:
Typically those packages are asymmetric, a substrate with single sided assembly is overmolded on the component side and the substrate backside is exposed providing a heat path for optimized cooling. This asymmetric geometry is prone to yield warped substrates, preventing optimum thermal contact to the heatsink and also putting thermomechanical stress on the encapsulated components, possibly reducing reliability.
Such packages being truly heterogeneous, combining powerICs, wire bonds, SMDs, controlICs, substrate and leadframe surfaces, the encapsulant used needs to adhere sufficiently to all surfaces present.
Additionally those packages need to operate at elevated temperatures for increased times, e.g. operate at 150 °C for 2000 h and more, so high thermal stability is of ample importance.
Within this paper a reference application is described, integrating power and control logic inside a leadframe based molded package. Taking into account the challenges mentioned above, a detailed description of material selection for this module will be given, including material analysis as rheology, reactivity, change in ɛr and thermomechanical properties as f(t,T) and of media storage. Process development tools for module molding are used to ensure manufacturability and useability. Concluding rules for encapsulant material selection and package setup are provided.