bluuebunny/crossref_metadata_2025_split huggingface dataset:
Management control system effectiveness
Authors: Su Sophia , Baird Kevin , Schoch Herbert 
Published: January 2015

Purpose– This study aims to examine the association between the use of three types of controls (input, behaviour and output) with the level of employee organisational commitment (EOC) across organisational life cycle (OLC) stages.Design/methodology/approach– Data were collected by a survey questionnaire from a random sample of 343 general managers in Australian manufacturing business units.Findings– The level of EOC was found to be highest in growth and revival stage units, suggesting that EOC relates to the level of innovation. The analysis revealed that the types of controls were significantly associated with the level of EOC. In particular, a significant positive association was found between input controls and the level of EOC in both the birth and revival stages.Originality/value– This study contributes to both the management control system (MCS) literature and practice. First, because only a limited number of studies have examined the effect of MCSs on the level of EOC, and there is no published study to date which has examined the association between the types of controls with the level of EOC from an OLC perspective, this study fills a gap in the literature by examining these associations. Secondly, the findings have important implications for Australian manufacturing organisations. Specifically, by providing an insight into the association between the types of controls with the level of EOC across OLC stages, the results suggest that managers of organisations in the birth and revival stage need to place greater emphasis on input controls so as to enhance the level of EOC.
A new approach to investigate conductive anodic filament (CAF) formation
Authors: Zou Ling Chunxian , Hunt Chris 
Published: January 2015

Purpose
– This paper aims to describe the development of an approach that uses a flexible substrate to investigate the mechanism of conductive anodic filament (CAF) growth and effect of different material and manufacturing variables.

Design/methodology/approach
– A new approach using a simulated test vehicle (STV) has been developed to study the CAF phenomena. The STV can be easily built under controlled conditions in the laboratory using different glass fibres and resin powder to investigate the effect of different variables separately on CAF. The advantage of the STV is that CAF can be formed in relatively short period in a controlled way, and CAF growth can be easily identified using a back-lighting under a microscope due to the thin flex material used as the test sample.

Findings
– STV has been used to investigate a number of effects on CAF formation: different glass fibres, reflow process, acid contamination in drilled holes, desmear process and glass bundle size. The results demonstrate that for finished fibres acid contamination (plating solution) at the electrode was necessary for CAF formation. However, for unfinished glass fibres (loom state and heat cleaned) CAF can be formed without acid contamination. The reflow process significantly increases CAF formation. Running an aggressive desmear process and using large glass fibre bundle also increased CAF formation.

Originality/value
– This new approach will be of benefit for printed circuit board (PCB) supplier to evaluate CAF performance on different resin systems and glass fibres to provide high CAF resistance quality PCBs. The test period (168 hours) would be much shorter than the traditional CAF testing (1,000 hours).
Electrical and mechanical properties of RFID chip joints assembled on flexible substrates
Authors: Janeczek Kamil , Jakubowska Małgorzata , Kozioł Grażyna , Młożniak Anna 
Published: January 2015

Purpose
– The purpose of this paper is to examine electrical and mechanical properties of radio frequency identification (RFID) chip joints assembled on a flexible substrate and made from isotropic conductive adhesives (ICAs) reinforced with graphene nanoplatelets (GPNs) or graphite nanofibers (GFNs).

Design/methodology/approach
– The ICAs reinforced with GPNs or GFNs were prepared and screen printed on a test pattern to investigate resistance and thickness of these adhesive layers. Differential Scanning Calorimetry (DSC) was performed to assess a curing behaviour of the prepared ICAs. Then, RFID chips were mounted with the prepared ICAs to the pattern of silver tracks prepared on foil. Shear test was carried out to evaluate mechanical durability of the created chip joints, and resistance measurements were carried out to evaluate electrical properties of the tested ICAs.

Findings
– The 0.5 per cent (by weight) addition of GFNs or GPNs to the ICA improved shear force values of the assembled RFID chip joints, whereas resistance of these modified adhesives increased. The DSC analysis showed that a processing temperature of the tested adhesives may range from 80 to 170°C with different curing times. It revealed a crucial influence of curing time and temperature on electrical and mechanical properties of the tested chip joints. When the chip pads were cured for too long (i.e. 60 minutes), it resulted in a resistance increase and shear force decrease of the chip joints. In turn, the increase of curing temperature from 80 to 120°C entailed improvement of electrical and mechanical properties of the assembled chips. It was also found that a failure location changed from the chip – adhesive interface towards the adhesive – substrate one when the curing temperature and time were increased.

Research limitations/implications
– Further investigations are required to examine changes thoroughly in the adhesive reinforced with GFNs after a growth of curing time. It could also be worth studying electrical and mechanical properties of the conductive adhesive with a different amount of GFNs or GPNs.

Practical implications
– The tested conductive adhesive reinforced with GFNs or GPNs can be applied in the production of RFID tags because it may enhance the mechanical properties of tags fabricated on flexible substrates.

Originality/value
– Influence of GFNs and GPNs on the electrical and mechanical properties of commercial ICAs was investigated. These properties were also examined depending on a curing time and temperature. New conductive materials were proposed and tested for a chip assembly process in fabrication of RFID tags on flexible substrates.
Thermal fatigue reliability for Cu-Pillar bump interconnection in flip chip on module and underfill effects
Authors: Kwak Jae B. , Chung Soonwan 
Published: January 2015

Purpose
– The purpose of this paper is to assess the thermo-mechanical reliability of a solder bump with different underfills, with the evaluation of different underfill materials. As there is more demand in higher input/output, smaller package size and lower cost, a flip chip mounted at the module level of a board is considered. However, bonding large chips (die) to organic module means a larger differential thermal expansion mismatch between the module and the chip. To reduce the thermal stresses and strains at solder joints, a polymer underfill is added to fill the cavity between the chip and the module. This procedure has typically, at least, resulted in an increase of the thermal fatigue life by a factor of ten, as compared to the non-underfilled case. Yet, this particular case is to deal with a flip chip mounted on both sides of a printed circuit board (PCB) module symmetrically (solder bump interconnection with Cu-Pillar). Note that Cu-Pillar bumping is known to possess good electrical properties and better electromigration performance. The drawback is that the Cu-Pillar bump can introduce high stress due to the higher stiffness of Cu compared to the solder material.

Design/methodology/approach
– As a reliability assessment, thermal cyclic loading condition was considered in this case. Thermal life prediction was conducted by using finite element analysis (FEA) and modified Darveaux’s model, considering microsize of the solder bump. In addition, thermo-mechanical properties of four different underfill materials were characterized, such as Young’s modulus at various temperatures, coefficient of temperature expansion and glass transition temperature. By implementing these properties into FEA, life prediction was accurately achieved and verified with experimental results.

Findings
– The modified life prediction method was successfully adopted for the case of Cu-Pillar bump interconnection in flip chip on the module package. Using this method, four different underfill materials were evaluated in terms of material property and affection to the fatigue life. Both predicted life and experimental results are obtained.

Originality/value
– This study introduces the technique to accurately predict thermal fatigue life for such a small scale of solder interconnection in a newly designed flip chip package. In addition, a guideline of underfill material selection was established by understanding its affection to thermo-mechanical reliability of this particular flip chip package structure.
Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint
Authors: Bernasko Peter K. , Mallik Sabuj , Takyi G. 
Published: January 2015

Purpose
– The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints.

Design/methodology/approach
– To evaluate the shear strength and IMC thickness of the 1206 chip resistor solder joints, the test vehicles were conventionally reflowed for 480 seconds at a peak temperature of 240°C at different isothermal ageing times of 100, 200 and 300 hours. A cross-sectional study was conducted on the reflowed and aged 1206 chip resistor solder joints. The shear strength of the solder joints aged at 100, 200 and 300 hours was measured using a shear tester (Dage-4000PXY bond tester).

Findings
– It was found that the growth of IMC layer thickness increases as the ageing time increases at a constant temperature of 175°C, which resulted in a reduction of solder joint strength due to its brittle nature. It was also found that the shear strength of the reflowed 1206 chip resistor solder joint was higher than the aged joints. Moreover, it was revealed that the shear strength of the 1206 resistor solder joints aged at 100, 200 and 300 hours was influenced by the ageing reaction times. The results also indicate that an increase in ageing time and temperature does not have much influence on the formation and growth of Kirkendall voids.

Research limitations/implications
– A proper correlation between shear strength and fracture mode is required.

Practical implications
– The IMC thickness can be used to predict the shear strength of the component/printed circuit board pad solder joint.

Originality/value
– The shear strength of the 1206 chip resistor solder joint is a function of ageing time and temperature (°C). Therefore, it is vital to consider the shear strength of the surface-mount chip component in high-temperature electronics.
Images of Kingship: Charles I, Accession Sermons, and the Theory of Divine Right
Authors: Kiryanova Elena 
Published: January 2015

AbstractAccession day was an important feast in the emerging political calendar of early modern Britain. Some of the sermons were published and contributed to shaping the royal image. Since a sermon was one of the few traditionally acceptable ways to criticize a monarch and to steer him or her onto the right path, a preacher could stress the ideal traits of the royal image while condemning the negative ones. I analyse this kind of sermon in the period of Charles I's Personal Rule and the Civil Wars. I examine the development of the royal image from the godlike intercessor between God and the people, to the ‘toiler’ doing his best to achieve peace, and the martyr (even before his captivity and execution), and to the democratized version of the previous ‘majestic’ image applied to ‘the magistrates’ in Westminster. This material helps us understand better the theological and political ideal of a ruler, in the years of one of the major crises of the British political system.
Mary Shelley's Frankenstein: what made the Monster monstrous?
Authors: Britton Ronald 
Published: January 2015

AbstractThis paper discusses the genesis of the famous story of Frankenstein which arose from a dream experienced by Mary Shelley whilst on a holiday shared with her husband Percy Shelley, Lord Byron, Dr Polidori and her step sister Claire Clairmont. The novel relates how the creature created by Victor Frankenstein horrifies him, is rejected by him and called a monster. The monster's ensuing despair and subsequent murderousness is eloquently described. The whole book is clearly connected to Mary Shelley's experience as an infant whose mother died after giving birth to her and her subsequent loss, as a mother, of her own new born infant. It is suggested that the novel imaginatively describes what it is to have been primarily rejected as an infant and to feel regarded as a monster.
Winnicott's invitation to ‘further games of Jung‐analysis’
Authors: Meredith‐Owen William 
Published: January 2015

AbstractWinnicott signs off his celebrated review of Jung's (1963) autobiography Memories, Dreams, Reflections with the warning that translation of ‘erreichten’ as ‘attained’ (implying assimilation) rather than as ‘reached to’, could ‘queer the pitch for further games of Jung‐analysis’. This subtly underscores his view that Jung—who he described earlier as ‘mentally split’ and lacking ‘a self with which to know’—remained essentially dissociated.However, Winnicott, whilst immersed in this work on Jung, wrote a letter to Michael Fordham describing himself as suffering ‘a lifelong malady’ of ‘dissociation’. But this he now reported repaired through a ‘splitting headache’ dream of destruction, dreamt ‘for Jung, and for some of my patients, as well as for myself’ (Winnicott 1989, p. 228).Winnicott's recurrent concern during his last decade was with ‘reaching to’—that quintessential Winnicottian term—some reparative experience that could address such difficulties in constellating a ‘unit self’. This is correlated with his engagement with Jung and tracked through his contemporaneous clinical work, particularly ‘Fear of Breakdown’ (1963).Themes first introduced by Sedgwick (2008) and developed by the author's earlier ‘Winnicott on Jung; destruction, creativity and the unrepressed unconscious’ (2011) are given further consideration.
States of grace: Eureka moments and the recognition of the unthought known
Authors: Crowther Catherine , Schmidt Martin 
Published: January 2015

AbstractIn this paper we consider states of grace in analysis. These encompass a range of phenomena which share an experience of something being received or revealed rather than produced by the ego. It feels that they are events that happen rather than events that are made to occur. They are marked by a profound sense of transformation of feeling tone. The quality of relatedness in the analytic dyad is also heightened. Some of these phenomena have been referred to as experiences of the self, synchronicities, moments of meeting, the unthought known and Eureka moments. The latter are experiences of sudden realization where a meaningful thought or image emerges which results in a dramatic shift in direction of the analysis and a transcendence of impasse. Although many authors describe these phenomena, we find that a Jungian approach provides a loom on which these threads can be woven together. Jung's concept of the transcendent function and his understanding of the gift of grace are particularly illuminating here. We also consider the conditions which allow grace to be experienced and how these inform our analytic practice.
The Use of CT Scans in Estimating Age at Death by Examining the Extent of Ectocranial Suture Closure
Authors: Boyd Kristen Leigh , Villa Chiara , Lynnerup Niels 
Published: January 2015

AbstractWe examined the utility of CT scans in the evaluation of degree of ectocranial suture closure. Five cranial points (left and right midcoronal positions, left and right midlambdoidal positions, and the lambda) were evaluated in 231 CT scans using a three‐point scoring system (open, partial closed, and closed). The slice increment and thickness varied between three groups of the scans. The results showed a good correlation between degree of suture closure and increasing age in each group. Young individuals (<40 years) and old individuals (>60 years) could be clearly distinguished from the middle‐aged individuals. ANOVA test revealed no difference between two groups of scans and between left and right sides (p > 0.05). Interobserver agreement was good, especially considering the score by sides. The results of this study create the base for developing a robust and simple method to estimate the age at death using CT scans.
Investigation on Sodium Benzoate Release from Poly(Butylene Adipate‐Co‐Terephthalate)/Organoclay/Sodium Benzoate Based Nanocomposite Film and Their Antimicrobial Activity
Authors: Mondal Dibyendu , Bhowmick Biplab , Maity Dipanwita , Mollick Md. Masud R. , Rana Dipak , Rangarajan Vivek , Sen Ramkrishna , Chattopadhyay Dipankar 
Published: January 2015

AbstractPolymeric nanocomposites embedded with nontoxic antimicrobial agents have recently gained potential industrial significance, mainly for their applicability to preserve food quality and ensure safety. In this study, a poly(butylene adipate‐co‐terephthalate) (PBAT)/organoclay (CMMT) based nanocomposite film doped with sodium benzoate (SB) as antimicrobial agent was prepared by a solution mixing process. A homogenous dispersion of organoclay (cetyltrimethylammonium‐modified montmorillonite [CMMT]) in PBAT matrix was observed by X‐ray diffraction and transmission electron microscopy. PBAT/CMMT nanocomposite film showed higher barrier properties against water and methanol vapor compared to the PBAT film. The release of SB from PBAT and its nanocomposite film was measured and the relevant data were fitted to the Weibull model. The higher values of Weibull's shape factor and scale parameter as corroborated by experimental findings indicated faster rate of SB release from PBAT/CMMT/SB nanocomposite film, when compared to the pristine PBAT film. Bacterial inhibition studies were accomplished against 2 food pathogenic bacteria, Bacillus subtilis and Staphylococcus aureus, by determining the zone of inhibition and corresponding growth profiles. Both bacterial inhibition studies and growth profiles established that PBAT/CMMT/SB demonstrated better antimicrobial activity than PBAT/SB film. Therefore, PBAT/CMMT/SB nanocomposite film can be used for food packaging application as it showed good barrier properties and antimicrobial activity against food pathogenic bacteria.
Evaluation of industrial Saccharomyces cerevisiae strains as the chassis cell for second‐generation bioethanol production
Authors: Li Hongxing , Wu Meiling , Xu Lili , Hou Jin , Guo Ting , Bao Xiaoming , Shen Yu 
Published: January 2015

SummaryTo develop a suitable Saccharomyces cerevisiae industrial strain as a chassis cell for ethanol production using lignocellulosic materials, 32 wild‐type strains were evaluated for their glucose fermenting ability, their tolerance to the stresses they might encounter in lignocellulosic hydrolysate fermentation and their genetic background for pentose metabolism. The strain BSIF, isolated from tropical fruit in Thailand, was selected out of the distinctly different strains studied for its promising characteristics. The maximal specific growth rate of BSIF was as high as 0.65 h−1 in yeast extract peptone dextrose medium, and the ethanol yield was 0.45 g g−1 consumed glucose. Furthermore, compared with other strains, this strain exhibited superior tolerance to high temperature, hyperosmotic stress and oxidative stress; better growth performance in lignocellulosic hydrolysate; and better xylose utilization capacity when an initial xylose metabolic pathway was introduced. All of these results indicate that this strain is an excellent chassis strain for lignocellulosic ethanol production.
Flexible methods for estimating genetic distances from single nucleotide polymorphisms
Authors: Joly Simon , Bryant David , Lockhart Peter J. 
Published: January 2015

Summary

With the increasing use of massively parallel sequencing approaches in evolutionary biology, the need for fast and accurate methods suitable to investigate genetic structure and evolutionary history is more important than ever. We propose new distance measures for estimating genetic distances between individuals when allelic variation, gene dosage and recombination could compromise standard approaches.

We present four distance measures based on single nucleotide polymorphisms (SNP) and evaluate them against previously published measures using coalescent‐based simulations. Simulations were used to test (i) whether the measures give unbiased and accurate distance estimates, (ii) whether they can accurately identify the genomic mixture of hybrid individuals and (iii) whether they give precise (low variance) estimates. The effect of rate variation among genes and recombination was also investigated.

The results showed that the SNP‐based genpofad distance we propose appears to work well in the widest range of circumstances. It was the most accurate and precise method for estimating genetic distances and is also relatively good at estimating the genomic mixture of hybrid individuals.

Our simulations provide benchmarks to compare the performance of different methods that estimate genetic distances between organisms.
Asp58Ala is the Predominant Mutation of the TTR Gene in Korean Patients with Hereditary Transthyretin‐Related Amyloidosis
Authors: Jang Mi‐Ae , Lee Ga Yeon , Kim Kihyun , Kim Seok‐Jin , Kim Jung‐Sun , Lee Soo‐Youn , Kim Hee‐Jin , Jeon Eun‐Seok 
Published: January 2015

SummaryHereditary transthyretin (TTR)‐related amyloidosis (ATTR) seems to be a rare autosomal‐dominant inherited form of systemic amyloidosis. Studies indicate considerable heterogeneity in the disease's presentation and genotype; however, there is little data from Korea, where the prevalence of hereditary ATTR is very low. In this study, we investigated the phenotypic and genotypic spectra of hereditary ATTR in Korea. Direct sequencing analysis was performed to detect TTR gene mutations in amyloidosis patients whose results of TTR immunohistochemical staining were positive or equivocal. Clinical presentation was categorized as exclusively cardiac, exclusively neurologic, or mixed phenotype. Of 12 genetic tests performed, seven were positive for TTR mutations. D58A (c.173A>C) was the most common mutation in this study (57%, 4/7). The majority of those patients with hereditary ATTR had the mixed phenotype (86%, 6/7). The patients with D58A mutation had older ages of disease onset (median, 61 years vs. 42 years; P = 0.08), and a higher incidence of gastrointestinal involvement (75% vs. 0%; P = 0.03) than those with other identified TTR mutations. A significant male predominance was also noted in this study (P = 0.01).