bluuebunny/crossref_metadata_2025_split huggingface dataset:
Critical Mixing Parameters for Good Control of Cement Slurry Quality
Authors: Vidick B. 
Published: October 2015

ABSTRACT
The goal of this study is to identify the critical parameters for control of slurry quality during cementing operations.
It appears that the cement mixing process can be split into two different processes:
– a mechanical one that includes the wetting of the powder, the deflocculation and the homogenisation of the resulting suspension, and – a physico-chemical one that includes during the first seconds the dissolution of some cement phases, the formation of supersaturated solutions and the precipitation of cement hydrates.
The validity of the mechanical process has been checked with inert suspensions of silica and barite as well as cement slurries of various reactivities and physical characteristics (particle size distribution). The physico-chemical process was investigated systematically first by looking at the precipitation kinetics, then inert suspensions and finally cement slurries.
The relevant mixing parameters were found to be the residence time of the slurry in the mixer and the rotational speed. Physical properties such as plastic viscosity and fluid loss are related to these two parameters via a single relation which is the mixing energy. Properties related to cement reactivities such as the yield value are affected very little by the rotational speed, but are highly dependent on the residence time in the mixer.
The influence of these two parameters on the response to different additives (dispersants, retarders, fluid-loss agents) is also presented. Finally, a comprehensive physico-chemical model of cement mixing is proposed.
Establishment of reference values for various coagulation tests in healthy Florida manatees (Trichechus manatus latirostris) and evaluation of coagulation in debilitated manatees during rehabilitation
Authors: Gerlach Trevor J. , Bandt Carsten , Conner Bobbi , Ball Ray L. 
Published: October 2015

Abstract
Objective—To establish reference ranges for coagulation parameters in healthy Florida manatees (Trichechus manatus latirostris) and compare results with those for debilitated manatees undergoing treatment at a rehabilitation facility.
Design—Prospective study.
Animals—29 healthy manatees and 45 debilitated manatees with various diseases.
Procedures—Manatees considered healthy on the basis of results of physical examination, CBC, and serum biochemical analysis underwent coagulation testing including measurement of prothrombin time, partial thromboplastin time, D-dimer concentration, platelet count, and fibrinogen concentration to establish reference ranges. For comparison, a group of manatees undergoing rehabilitation was also tested, and the results were compared. Thromboelastography was also performed on some animals.
Results—Values for D-dimer concentration were significantly higher in debilitated versus healthy animals. There was no significant difference for prothrombin time, partial thromboplastin time, platelet count, or fibrinogen concentration between groups. Thromboelastography was performed on 8 healthy animals.
Conclusions and Clinical Relevance—Reference ranges were established for various tests of coagulation that may assist clinicians during the initial evaluation and rehabilitation of Florida manatees. Future research to evaluate the effect of specific disease processes on the coagulation cascade is recommended.
Des « résidus radioactifs » au cœur d’une dyade mère-bébé ou la transmission du trauma d’une mère à son bébé
Authors: Feldman Marion , Dozio Elisabetta , El Husseini Mayssa’ , Drain Élise , Radjack Rahmethnissah , Moro Marie Rose 
Published: October 2015

Introduction : L’observation détaillée des interactions entre une mère traumatisée et son bébé renseigne sur les modalités de transmission du traumatisme psychique au bébé. Méthode : Après avoir présenté une revue de la littérature sur l’état actuel de la question, nous illustrerons la problématique par la situation clinique d’une mère haïtienne et de son enfant de 2 ans et demi, rencontrée dans une crèche préventive en région parisienne. Nous analysons la première rencontre avec cette dyade, selon l’axe de la qualité des interactions, pour voir comment un récit traumatique peut impacter sur ces liens mère-bébé, voire avec le thérapeute. Ce récit, en période périnatale, peut raviver des éléments forts d’une histoire à la fois singulière et collective. Résultats : Mère et bébé se répondent l’un et l’autre par l’émission et la réception de « résidus radioactifs ». Discussion : Ce cas clinique montre la nécessité de considérer l’aspect transculturel et l’histoire collective en association avec les événements traumatiques. Le contre-transfert peut être un outil clinique pour accéder au vécu du bébé.
Auditeurs des états financiers, attention !
Authors: Morin Danielle 
Published: October 2015

Les scandales survenus au début des années 2000 ont montré que la manipulation des états financiers s’est souvent soldée par la constatation hâtive de produits ou par la constatation de produits fictifs. S’y ajoutaient les opérations entre parties liées, les évaluations à la juste valeur, les écritures de journal non standard, les états financiers intermédiaires et la comptabilisation des courus. Certaines de ces pratiques avaient vraisemblablement échappé aux auditeurs des firmes aussi réputées qu’Andersen (notamment pour Enron et Worldcom), KPMG (pour Xerox) et Deloitte et Grant Thornton Italia (pour Parmalat). Quelles leçons les auditeurs des états financiers peuvent-ils en tirer aujourd’hui ?
Travailler en mode collaboratif : pour aller plus loin
Authors: Jacob Réal , Poitras Jean 
Published: October 2015

Avant les années 1980, les organisations devaient gérer le changement pour se distinguer. Entre 1980 et 2001, elles ont dû ajouter une nouvelle corde à leur arc : apprendre. Mais voilà qu’aujourd’hui, le monde change tellement vite et devient si complexe, si incertain et si volatil qu’elles doivent maîtriser une toute nouvelle compétence pour survivre : travailler en mode collaboratif. Ainsi, l’innovation, l’efficacité et la productivité passent aussi par la collaboration.
Les neuf piliers du pouvoir et de l’influence
Authors: Lainey Pierre 
Published: October 2015

Une bonne idée qu’on n’arrive pas à faire passer... Un dossier stratégique qui stagne... Un changement qui prend du temps à s’opérer... Voilà autant de situations frustrantes et déconcertantes auxquelles les organisations risquent tôt ou tard de se heurter. Pourquoi une idée longuement mûrie et testée ne trouve-t-elle pas écho ? Pourquoi un dossier jugé stratégique n’avance-t-il pas ? Pourquoi le changement, dont on a pourtant démontré le bien-fondé, est-il au point mort ?
L’exploitation intelligente des données : une stratégie payante
Authors: Bellavance François 
Published: October 2015

Savez-vous combien pourrait vous rapporter l’exploitation intelligente de vos données ? Ça se calcule. Et quand les calculs sont bons, cette opération peut être très payante. L’ère numérique et l’avènement des mégadonnées peuvent permettre aux entreprises de créer de la valeur et de propulser leur performance vers de nouveaux sommets. Les spécialistes en analyse de données volumineuses l’ont bien compris et savent comment exploiter ces données de manière intelligente. Voici quelques exemples qui illustrent de quelle façon l’analyse des données peut apprendre aux entreprises à innover et à accroître considérablement leur productivité.
Influence Of Solder Joint Shape On The Thermo-Mechanical Reliability Of CSP's
Authors: van Veen Co , Vandevelde Bart , Beyne Eric 
Published: October 2015

Not only the stand-off height but also the shape of a solder joint has a strong influence on the joint reliability under temperature cycling. The shape determines the size of the local stress and strain concentrations. It is therefore very important to know well the joint shape after reflow. In a previous paper closed analytical expressions were derived for liquid bump shapes, as a function of pad size and bump height [1]. The bump deformation as a function of the chip weight could be derived from the force constant.
In the present paper closed analytical expressions are derived for the force constant for liquid bumps having unequal spherical pad sizes. It turns out that the force constant for compression can be optimized as a function of the ratio of those pad sizes. The shape of the bump and especially the contact angle is of interest for modeling activities where geometrical effects do play a role. Furthermore from the variation in bumps heights on a chip an estimate can be made of the tilt of the chip after assembly. The solder profile estimation by the analytical expressions is validated by experimental results. Also a comparison with the solder profile estimation by the simulation software Surface Evolver is done. Both comparisons showed that the analytical estimation of the standoff height is very good as long as the gravitation energy contributed by the chip weight is less than 10% of the total energy.
Finally, an example is shown where the analytical model and Surface Evolver are the geometrical input for a finite element model. The example considers a CSP assembled at both sides of the printed circuit board.
Fabrication of Conductors and Inductors by Nano-Particle Deposition through Direct Write Technology
Authors: Colvin Jacob , Carter Michael , Sears James 
Published: October 2015

Direct Write Technologies are being utilized in antennas, engineered structures, sensors, and tissue engineering. One form of the Direct Write Technologies is Maskless Mesoscale Material Deposition (M3D) for Optomec, Inc. M3D is a process that uses aerosol formation, transport and deposition. Inks for the M3D utilize nano-particles in suspension for deposition. Several different conductive inks were deposited with M3D and characterized for electrical resistivity and microstructure. Soft magnetic material was formulated as an ink suspension, deposited and characterized.
This paper will report on the results obtained after sintering conductive nano-particle inks and soft magnetic material. Sintering was performed with a 2W frequency doubled Nd:YAG CW laser, a conventional muffle furnace and a novel photonic curing method. Depositions of various conductive inks were examined for physical dimensions (width and thickness) and microstructure. A study of the sintering characteristics if these ink was also included. This paper will also report on the results obtained from depositing a soft magnetic material. Permeability results were calculated from magnetic structures created with the deposition. These results are compared to conventional methods of soft magnetic material formation and construction. Physical properties of the deposited inks are also measured and reported.
Inkjet Printing of Fine-Line Thick-Film Inductors
Authors: Wassmer Marcel , Diel Waldemar , Krueger Klaus 
Published: October 2015

Inkjet printing is the emerging technology for the deposition of a variety of particles. The reliable printing of nano-silver inks shows the possibilities of digital fabrication of microelectronic circuits and raises the question for further use with other particles. To compete with common thick-film screen printing as a production method it is consequential and necessary to investigate the inkjet printing of all passive electronic thick-film components. Inductors are frequently required in electronic circuits, yet they represent a main challenge for thick-film printing. With the development of new materials, which are suitable for low-temperature cofired ceramic processes, the integration of passive components promises new applications.
In a first step, different ferrite particle compositions are dispersed to stabilized inks that can be used with a commercial inkjet print head. The stability of the ink is fundamental for reliable drop formation. In addition, the viscosity must fit to the print heads' operational ranges and the magnetic properties must be taken into account. In a second step, the effect of substrate coating and drop volume variation toward the shape of the printed structures are defined and shown. The fundamental construction methods of inkjet-printed inductors on fired ceramic are investigated. First, silver coils are printed without ferrite to optimize the printing pattern. Subsequently, coils are embedded in inkjet printed ferrite layers.
Depending on the geometrical layout, several drying and firing steps are necessary, leading to a more complex production process and influencing the electrical properties. Finally, it is shown that inkjet printing is very effective for built-up of multilayer thick-film inductors, and the high accuracy of the printing process promises accurate electrical values.
Assembly Process Development for Fine Pitch Flip Chip Silicon-to-Silicon 3D Wafer Level Integration with No Flow Underfill
Authors: Li Zhaozhi , Lee Sangil , Lewis Brian J. , Houston Paul N. , Baldwin Daniel F. , Stout Eugene A. , Tessier Theodore G. , Evans John L. 
Published: October 2015

The industry has witnessed the adoption of the flip chip for its low cost, small form factor, high performance, and great I/O flexibility. As three-dimensional (3D) packaging technology moves to the forefront, the flip chip to wafer integration, which is also a silicon-to-silicon assembly, is gaining more and more popularity.
No flow underfill is of special interest for the wafer level flip chip assembly, as it can dramatically reduce the process time and the cost per package, due to the reduction in the number of process steps as well as the dispenser and cure oven that would otherwise be necessary for the standard capillary underfill process.
This paper introduces the development of a no flow underfill process for a sub-100 micron pitch flip chip to CSP wafer level assembly. Challenges addressed include the no flow underfill reflow profile study, underfill dispense amount study, chip floating control, underfill voiding reduction, and yield improvement. Also, different no flow underfill candidates were investigated to determine the best performing processing material.
An Investigation of the Process Stability of RF SiP Made of DuPont 943 and 9K7
Authors: Bartnitzek Thomas , Purtova Tatyana , Rusch Christian , Kaminski Slawomir , Feger Till 
Published: October 2015

RF packaging is one of the most challenging but also the fastest growing topic in low temperature cofired ceramic (LTCC) technology. Today LTCC is particularly useful for advanced packages and systems-in-package because of its electrical, functional, and thermomechanical properties as well as its excellent long-term stability and reliability. LTCC combines the potential for miniaturization and low loss handling of high frequencies up to 110 GHz and it also offers the opportunity to integrate additional features. Therefore it has to go through various manufacturing steps and several refirings without any performance degradation or loss of dimensional accuracy.
This article discusses the impact of thermal postprocessing on RF characteristics and geometric properties of LTCC. Ceramic substrates with radar front ends, calibration structures, and other test vehicles made of DuPont Green Tape® 943 and 9K7 were cofired following the recommended conditions and refired several times in order to investigate and compare the influence of the postfiring. The flatness, dimensions, and RF performance of the ceramics up to 110 GHz were evaluated and compared.
Design and Characterization of a Biocompatible Packaging Concept for Implantable Electronic Devices
Authors: de Beeck Maaike Op , Qian Karen , Fiorini Paolo , Malachowski Karl , Van Hoof Chris 
Published: October 2015

A biocompatible packaging process for implantable electronic systems is described, combining biocompatibility and hermeticity with extreme miniaturization. In Phase 1 of the total packaging sequence, all chips are encapsulated in order to realize a bidirectional diffusion barrier, preventing body fluids from leaching into the package, which would cause corrosion, and preventing IC materials such as Cu from diffusing into the body, which would cause various adverse effects. For cost-effectiveness, this hermetic chip sealing is performed as a postprocessing step at the wafer level using modifications of standard clean room (CR) fabrication techniques. Well-known conductive and insulating CR materials are investigated with respect to their biocompatibility, diffusion barrier properties, and sensitivity to corrosion.
In Phase 2 of the packaging process, all chips of the final device should be electrically connected, applying a biocompatible metallization scheme using, for example, gold or platinum. For electrodes in direct contact with the tissue after implantation, IrOx metallization is proposed.
Phase 3 of device assembly is the final packaging step, during which all system components, such as electronics, passives, a battery, among others, will be interconnected. To provide sufficient mechanical support, all these components are embedded using a biocompatible elastomer such as PDMS.
Studying the Impact of Return Current Path on the EM Simulation of High-Speed Package and Board Designs
Authors: Kostka Darryl , Scogna Antonio Ciccomancini 
Published: October 2015

Three-dimensional electromagnetic simulation models are often simplified in order to reduce simulation time and memory requirements without sacrificing the accuracy of the results. A commonly adopted methodology in the simulation of complex electronic package and board designs is to truncate the size of the model, leaving only a few important features surrounding the nets of interest. In this paper we demonstrate that this simplification can have a significant impact on the simulation results if it is not performed carefully, and it can introduce spurious nonphysical resonances. The interaction between cavities and signals is first studied using a simple coupled differential via test structure. It is demonstrated that the return currents generated by these vias excite cavity resonances in power-ground plane pairs causing them to behave as parallel-plate waveguides. The role of interplane shorting vias in suppressing cavity resonances is then investigated and the impact of boundary conditions on the simulation results of package models is also shown and discussed.
The focus is then shifted to PCB/package cosimulation and the impact of different truncation schemes is discussed through the simulation of test structures of varying complexity. A simulation methodology is then proposed and is verified for a combined model of a realistic complex multilayer package and board and it is demonstrated that accurate results can be obtained through proper truncation of the geometry.
Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate
Authors: Burkhardt T. , Hornaff M. , Acker A. , Peschel T. , Beckert E. , Suphan K.-H. , Mensel K. , Jirak S. , Eberhardt R. , Tünnermann A. 
Published: October 2015

A high power UV light emitting diode (LED) multichip module package based on aluminum nitride (AlN) and alumina (Al2O3) is presented. The AlN substrate with a high thermal conductivity of up to 180 W/(m·K) and LED chips based on a copper alloy provide superb thermal management and heat extraction. Efficient cooling is an important prerequisite for the increase of extractable optical power and for the reduction of thermally induced wavelength shift. A design of a stackable module featuring arrays of 7×2 indium-gallium-aluminum-nitride UV LED chips at 395 nm is developed. This configuration of submodules allows for the scalable assembly of line sources with different lengths. Applications using UV LEDs cover market segments such as curing of adhesives, inks, and coatings, sterilization of medical equipment, and treatment of potable water, as well as various uses in chemical detection, biochemical analytics, and spectroscopy.
Thermal and thermomechanical modeling of the submount is conducted using finite element analysis. Die attach using eutectic gold-tin solder, lower melting tin-lead solder, and silver-filled adhesive are compared with respect to optical output power and wavelength drift. Mechanical strength and structure of the resulting joints are investigated using shear force measurements, cross-sectioning, and microtomography. An optical output power of 7.7 W is achieved using a cluster of 14 LED chips at 1050 mA, resulting in a peak irradiance of 33.9 W/cm2 at the LED surface with respect to the footprint and pitch of the attached chips.
Inkjet Printing of Multilayer Capacitors
Authors: Jeschke D. , Ahlfs E. , Krüger K. 
Published: October 2015

Capacitors are widely used passive components. Taking account of micro hybrid circuits, printed capacitors are desirable. However, today's screen printing technology results in very low specific capacitance per area, thus SMD components are usually preferred. In order to achieve a higher specific capacitance, simple plate capacitors are stacked to form multilayer components. Maskless inkjet printing allows for realization of such structures. To keep the process simple, in-between sintering is avoided; the entire component is cofired in one final step.
To define the geometry of the components, the general processability of the used material combination is first examined. Among other things, the extent to which the structures can be decreased in size without affecting their functionality is determined. In further experiments, the effects of thermal expansion and sinter shrinkage are analyzed.
To create multilayer capacitors, a second step takes place in which the design is completed. Vias are embedded to bypass the dielectric layer or the opposing electrode. When increasing the height of the structure, the aspect ratio that can be achieved by the printing process is considered.
Design and Fabrication of an LTCC Structure for a Microceramic Combustor
Authors: Belavic Darko , Hrovat Marko , Dolanc Gregor , Makarovic Kostja , Zarnik Marina Santo 
Published: October 2015

Advanced microsystems or macrosystems are in some cases made with multilayer ceramic technology. Low-temperature cofired ceramic (LTCC) technology is considered to be one of the more suitable technologies for the fabrication of ceramic microsystems that integrate screen-printed, thick-film electronic components as well as three-dimensional buried structures, for example, cavities and channels. One of the applications is a ceramic combustor. The chemical energy of the fuel is converted into thermal energy in a chemical microcombustor through a burning process, while the accompanying high temperatures and, frequently, high pressures, impose harsh conditions on the combustor structure. Therefore, the combustor must be carefully designed not only from the functional, thermal, and chemical points of view, but also with respect to the mechanical strength.
The combustor device was prepared by lamination of Du Pont 951PX LTCC green tapes. The fabricated 3D LTCC structures with buried cavities and channels including two inlets (for fuel and air), the evaporator for the fuel, the mixing system of the channels (for mixing the evaporated fuel and air), the distribution channels and eight microburners were realized. The main parts are eight microburners realized as buried cavities. In the burners, a platinum-based catalyst was deposited to assist the oxidation, that is, the burning, of the methanol with the air. Thick-film, platinum-based heaters and temperature sensors are incorporated within the structure. The device was tested with different flow rates of liquid methanol (1 mL/h to 5 mL/h) and air (7 L/h to 15 L/h). The temperatures obtained were between 250°C and 450°C.