bluuebunny/crossref_metadata_2025_split huggingface dataset:
The perils of protocols: acute phosphate nephropathy after intravenous phosphate replacement
Authors: Parmar Malvinder S. 
Published: October 2015

Abstract
Protocols are commonly used in the hospitals around the world and enable health care organizations to put evidence into practice and provide a framework for the management of the individual patient. Such standardization of practice is felt to reduce variations in practice and improve quality of care. However, the protocols have advantages and disadvantages. I present a case where activation of the protocols for “Electrolyte, phosphate and magnesium replacement” at the time of admission to the hospital, resulted in harm to the patient because of inappropriate timing of the test(s) with a resulting action to correct the expected laboratory abnormality. Timing of tests and administration of various medications including antibiotics in hospitalized dialysis patients is important, and both the physicians and the nursing staff require vigilance when requesting/performing tests and ordering/administering medications to dialysis patients.
The effect of temperature on the electrical characterization of a poly(phenoxy-imine)/p-silicon heterojunction
Authors: Demir Haci Ökkes , Caldıran Zakir , Meral Kadem , Şahin Yılmaz , Acar Murat , Aydogan Sakir 
Published: October 2015

AbstractA poly(phenoxy-imine)/p-silicon rectifying device was fabricated and the current-voltage characteristics of the device were examined as a function of temperature in the 40–300 K range. The temperature dependence of the main parameters, namely, the barrier height (Φb), ideality factor (η), reverse current (I0) and series resistance (Rs), were investigated. It was seen that the Φb and the I0 values of the device increased with increasing temperature, while the η and the Rs values decreased. The temperature dependences of the Φb and the η were interpreted by the assumption of a Gaussian distribution of the barrier heights arising from barrier inhomogeneities that prevailed at the interface of the poly(phenoxyimine)/p-silicon. From ln(I0/T2) vs. 1/ηT plot, the values of the activation energy (Ea) and Richardson constant (A*) were calculated as 0.324 eV and 2.84×10-7 A cm-2K-2, respectively. The experimental value of the Rs from the forward current-voltage plots decreased with an increase in the temperature.
The Nature of Genetic Variation for Complex Traits Revealed by GWAS and Regional Heritability Mapping Analyses
Authors: Caballero Armando , Tenesa Albert , Keightley Peter D 
Published: October 2015

AbstractWe use computer simulations to investigate the amount of genetic variation for complex traits that can be revealed by single-SNP genome-wide association studies (GWAS) or regional heritability mapping (RHM) analyses based on full genome sequence data or SNP chips. We model a large population subject to mutation, recombination, selection, and drift, assuming a pleiotropic model of mutations sampled from a bivariate distribution of effects of mutations on a quantitative trait and fitness. The pleiotropic model investigated, in contrast to previous models, implies that common mutations of large effect are responsible for most of the genetic variation for quantitative traits, except when the trait is fitness itself. We show that GWAS applied to the full sequence increases the number of QTL detected by as much as 50% compared to the number found with SNP chips but only modestly increases the amount of additive genetic variance explained. Even with full sequence data, the total amount of additive variance explained is generally below 50%. Using RHM on the full sequence data, a slightly larger number of QTL are detected than by GWAS if the same probability threshold is assumed, but these QTL explain a slightly smaller amount of genetic variance. Our results also suggest that most of the missing heritability is due to the inability to detect variants of moderate effect (∼0.03–0.3 phenotypic SDs) segregating at substantial frequencies. Very rare variants, which are more difficult to detect by GWAS, are expected to contribute little genetic variation, so their eventual detection is less relevant for resolving the missing heritability problem.
Incidence and Characteristics of Autoimmune Hepatitis
Authors: Jiménez-Rivera Carolina , Ling Simon C. , Ahmed Najma , Yap Jason , Aglipay Mary , Barrowman Nick , Graitson Samantha , Critch Jeff , Rashid Mohsin , Ng Vicky L. , Roberts Eve A. , Brill Herbert , Dowhaniuk Jenna K. , Bruce Garth , Bax Kevin , Deneau Mark , Guttman Orlee R. , Schreiber Richard A. , Martin Steven , Alvarez Fernando 
Published: October 2015

BACKGROUND AND OBJECTIVES:Autoimmune hepatitis (AIH) is a progressive inflammatory liver disease of unknown etiology, with limited population-based estimates of pediatric incidence. We reported the incidence of pediatric AIH in Canada and described its clinical characteristics.METHODS:We conducted a retrospective cohort study of patients aged &lt;18 years diagnosed with AIH between 2000–2009 at all pediatric centers in Canada.RESULTS:A total of 159 children with AIH (60.3% female, 13.2% type 2 AIH) were identified. Annual incidence was 0.23 per 100000 children. Median age at presentation for type 1 was 12 years (interquartile range: 11–14) versus 10 years for type 2 (interquartile range: 4.5–13) (P = .03). Fatigue (58%), jaundice (54%), and abdominal pain (49%) were the most common presenting symptoms. Serum albumin (33 vs 38 g/L; P = .03) and platelet count (187 000 vs 249 000; P &lt;.001) were significantly lower and the international normalized ratio (1.4 vs 1.2; P &lt;.001) was higher in cirrhotic versus noncirrhotic patients. Initial treatment included corticosteroids (80%), azathioprine (32%), and/or cyclosporine (13%). Response to treatment at 1 year was complete in 90%, and partial in 3%. 3% of patients had no response, and 3% responded and later relapsed. Nine patients underwent liver transplantation, and 4 patients died at a mean follow-up of 4 years.CONCLUSIONS:AIH is uncommon in children and adolescents in Canada. Type 1 AIH was diagnosed 5.5 times more frequently than type 2 AIH. Most patients respond well to conventional therapy, diminishing the need for liver transplantation.
Description of a nest of <i>Euglossa heterosticta</i> from Peru, with taxonomic notes (Hymenoptera: Apidae)
Authors: Rasmussen Claus , Sánchez Evelyn , Skov Charlotte 
Published: October 2015

The nest of Euglossa (Euglossa) heterosticta Moure is described as the first aerial nest in the otherwise cavity-nesting purpurea-group. Associated adult males and females emerged from the nest permitting taxonomic notes to be provided for the heretofore unknown female of E. heterosticta.
Winning in Acquisitions and Divestitures: Advice to Young Professionals in a Changing Company Landscape
Authors: Dang Angela , Rogers Andy 
Published: October 2015

Technical Leaders
Andy Rogers, vice president of business development at Encana, shares his thoughts on the current state of the industry and provides career advice to young professionals amid the acquisitions and divestitures (A&D) landscape.
The low commodity prices of 2015 have left some companies financially challenged and others with opportunities for business growth by means of A&Ds. For young professionals working in the industry, this can mean many things, such as the opportunity to work in a new asset or technology area, changing career streams, and even the opportunity to return to school.
Professionals are always looking to “work the right asset.” One does not necessarily want to be working an asset that might be divested by a company. Conversely, one does not necessarily want to work at a company that might be acquired by another company. What are some indicators that the asset on which one is working may be acquired or divested?
At the working level, you are probably not in tune with the strategic decisions that executive level managers are making. However, if you pay attention to the company’s strategic messages, you can potentially identify the direction in which the company is headed.
For example if your company has sent out a strategic plan to “balance their strategic mix,” it is a good indicator that the company is trying to be oilier or gassier, depending on its current portfolio. If the company is trying to become oilier, it does not take a genius to figure out that the company has to sell its gassier assets and/or aggressively develop or buy more oil assets. That is one of the more obvious scenarios one can identify.
Alternatively, keeping up with the headlines allows you to identify whether or not a company is financially stressed. Clearly, there have to be some changes in order for that company to continue to survive. In that situation, likely the company will have to sell some assets to sure up their balance sheet.
Can there be winners and losers when it comes to A&D?
There is only one case where there is a clear winner and loser. In a majority of cases, the goal is a win-win scenario for both the divesting and acquiring company. If you think about why people sell assets, there are probably three or four reasons to engage in a mergers and acquisitions (M&A) transaction.
Contact Resistance of Anisotropic Conductive Adhesives
Authors: Divigalpitiya Ranjith , Hogerton Peter 
Published: October 2015

We analyze the electrical resistance of an anisotropic conductive film (ACF) sandwiched between two conducting plates as a function of applied load by extending a published model of Shi et al [1]. In this analysis we also calculate the plate separation as a function of applied pressure when a collection of particles are trapped between two plates. The case of conducting particles with a general size distribution shows two new important results: (a) we find that the resistance of a bond or a contact is independent of the number of conducting particles under the contact pad when the particle size distribution is Gaussian, which is very much in contrast to the case of uniform sized particles; (b) also, only a very small fraction of conducting particles participate in the electrical conduction of ACF products where the actual particle size distribution can be described as a Gaussian.
We show that the experimental data supports the validity of this analysis. While this analysis confirms some of our basic notions of ACF, the surprising result of constant resistance forces us to reevaluate our long-held concept of attaching much importance to the total number of particles in a bond.
Single Sample Cylinder for RGA Correlation
Authors: Schuessler Philipp wh , Rossiter Daniel J. , Lowry Robert K. , Sierzant Sheryl M. 
Published: October 2015

A large portion the manufacturers of high reliability microelectronic devices must have those devices tested to be proven “dry”. A mass spectrographic technique, referred to as Residual Gas Analysis (RGA) has been the primary means of demonstrating that the devices contain less than the 5000 parts per million(ppm) of moisture. However, there are no standards for determining moisture levels of this nature when tested in this manner. Too often, the pass/fail criteria for a given production lot is exceeded and recourse becomes time consuming and expensive.
A small group of technologists has successfully fabricated and tested a Single Sample Cylinder (SSC) wherein moisture-laden air can be taken from one analytical facility to another for comparison analyses. The need for such a device is explained by a brief review of why “identical” microelectronic devices from the same production line have been found to contain different chemistries when analyzed via Residual Gas Analysis, per Test Method 1018 of the military standards.
The SSC is over two liters in volume; hence it can deliver hundreds of “air samples” that have the same chemical composition. It is maintained at 100° C during test but is kept at room ambient during non-analytical periods.
Several major problems had to be overcome in order to be able to continuously generate samples of the same chemistry. The primary two were moisture adsorption to all of the various exposed surfaces, and second was hydrogen diffusion from the materials of construction, with subsequent oxide reduction to form more water.
Some anomalies were experienced during initial preparation of the SSC and the early hours of equilibration. These again are believed to be adsorption/desorption related. Thereafter it was shown that the SSC could deliver samples that were within 2% of each other, or better, within a sample set. The level of precision between sample sets was +/− 2.5%.
This study was developed on a statistical basis, involving over 100 data points and was carried out over 1450 hours. The gas analyses were performed in a Defense Supply Center Columbus (DSCC) certified testing facility.
This study was conducted with the support of an additional analytical chemist and a statistician to assure that data generated met the goals of the stated objective.
Solder Joint Reliability on 3-D MID LCP Substrates
Authors: Arra Minna , Pääkkönen Esko J , Härkönen Ilkka 
Published: October 2015

This paper presents the results from an experimental reliability study. Two different kinds of SMD (surface mount device) components were assembled with Sn/Ag/Cu solder paste onto injection molded, thermoplastic LCP (liquid crystal polymer) substrates patterned with MID/LDS technology. Two different LCP grades were chosen for the experiments. The assembly was also realized on FR-4 PCBs (printed circuit boards), which served as control samples. The assemblies were exposed to a thermal cycling test followed by failure analysis.
As predicted, failures in solder joints occurred earlier on the LCP thermoplastic substrates than on the FR-4 PCB laminates. It was noticed that with one of the LCP grades, the CTE was not the major factor determining the lifetime of the solder joints. A more prominent factor was the dimensional changes that had occurred in the substrates. An SEM/EDS (scanning electron microscope/energy dispersive spectrometry) analysis on the microstructure of the LCP substrates was performed to explain the findings. The analysis showed that there were differences in the detailed microstructure between the two LCP grades. These differences seemed to be related to the different filler particles.
Microactuators for Fluidic Applications: Principles, Devices, and Systems
Authors: Adamovic Nadja , Giouroudi Ioanna , Matovic Jovan , Djinovic Zoran , Schmid Ulrich 
Published: October 2015

Much effort in microfluidics research has been aimed at designing microscale pumps, valves, switches, dispensers, mixers, filters, separators, and so on, which have a major role in the development of innovative systems like chemical process control, bioanalytical devices, medical drug delivery systems, environmental control, and others. Most of these microfluidic devices have one thing in common: the need for precise manipulation and control of small amounts of fluids.
MEMS/NEMS research is continuously opening up new knowledge on modeling approaches, novel materials, and MEMS/NEMS processing technologies that stimulate and accelerate the development of new actuation principles and novel actuator configurations.
This review paper presents research work on different actuation techniques that are used for the whole range of microfluidic applications. It covers thermomechanical and electrochemical actuation principles, as well as actuation induced with external electric or magnetic fields. It presents a brief explanation of the operating principle of each type of actuator, actuator configuration, its main characteristics, like power consumption, operational voltage, frequency range, and working fluids, and a discussion of comparisons among different actuation schemes.
This study compiles and provides some basic guidelines for selection of the actuation schemes that are currently implemented in microfluidic devices.
Reliability of Ceramic Column Grid Array (CCGA717) Interconnect Packages Under Extreme Temperatures for Space Applications*
Authors: Ramesham Rajeshuni 
Published: October 2015

Ceramic column grid array packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performance, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short-term and long-term space missions.
CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide have been assembled, inspected nondestructively, and subsequently subjected to extreme temperature thermal cycling to assess the reliability for future deep space, short- and long-term, extreme temperature missions. In this investigation, the employed temperature range covers from −185°C to +125°C extreme thermal environments. The test hardware consists of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The CCGA717 package is 33 mm × 33 mm with a 27 × 27 array of 80%/20% Pb/Sn columns on a 1.27 mm pitch. The resistance of daisy-chained, CCGA interconnects was continuously monitored as a function of thermal cycling. Electrical resistance measurements as a function of thermal cycling are reported and the tests to date have shown significant change in daisy chain resistance as a function of thermal cycling. The change in interconnect resistance becomes more noticeable as the number of thermal cycles increases. This paper will describe the experimental test results of CCGA testing under extreme temperatures. Standard Weibull analysis tools were used to extract the Weibull parameters to understand the CCGA failures. Optical inspection results clearly indicate that the solder joints of columns with the board and the ceramic package have failed as a function of thermal cycling. The first failure was observed at the 137th thermal cycle and 63.2% failures of daisy chains have occurred by about 664 thermal cycles. The shape parameter extracted from the Weibull plot was about 1.47, which indicates the failures were related to failures that occurred during the flat region or useful life region of the standard bathtub curve. Based on this experimental test data, one can use the CCGAs for the temperature range studied for ∼100 thermal cycles (ΔT = 310°C, 5°C/minute, and 15 min dwell) with a high degree of confidence for high reliability space and other applications.
Application of a Flow Optimizer in a Limited Space to Increase Series Fan Performance
Authors: Jilesen Jonathan , Harrison Howard , Lien Fue-Sang , McCumber Darryl 
Published: October 2015

The performance increase of cooling for a 1U SunFire 4100 server through the introduction of multiple flow optimizers is investigated in this article. We found that the power consumption of cooling fans could be decreased by 17–33% depending on operating conditions. The use of flow optimizers was found to reduce noise produced by cooling fans by at least 5.3 dB(A). We also discuss the use of the increased performance to increase thermal head room by increasing the flow rate of cooling air by 6.5–20.4%.
In addition, we found that a primary fan used with an exit stator allowed the overall fan module length to be reduced without a loss in performance. Reducing the length allowed the flow optimizers to fit into the standard 56-mm space previously occupied by the original series fans. CFD analysis was performed to better understand the effect of this stator on airflow.
Integration of Electrografted Layers for the Metallization of Deep TSVs
Authors: Raynal F. , Mevellec V. , Frederich N. , Suhr D. , Bispo I. , Couturier B. , Truzzi C. 
Published: October 2015

This paper describes production-readiness level of electrografted (eG) and chemical grafted (cG) layers deposited on a wide range of through silicon via (TSV) dimensions. Three layers are required to achieve via metallization: eG insulator, cG barrier, and eG copper seed.
Complete characterization of each layer of the stack has been achieved, including electrical and mechanical properties. Impact on the 3D-IC design space of the electrografting nanotechnology optimized for highly conformal growth of TSV films is discussed.
Four chemical baths are required to achieve the deposition of the three layers, shelf life, and bath monitoring strategy of each chemistry being presented in the last part of the paper. Some preliminary results of copper plating directly on top of the cG barrier are also reported.
Next Generation System in a Package Manufacturing by Embedded Chip Technologies
Authors: Boettcher Lars , Manessis D. , Karaszkiewicz S. , Ostmann A. , Reichl H. 
Published: October 2015

The embedding of active and passive components offers a wide range of benefits and potentials. With the use of laminate based technology concepts, components can be moved from surface mount into the build-up layers of substrates by embedding and thereby the third dimension will be available for further layers or assemblies.
This paper will briefly discuss the necessary process steps of the embedded chip technology and more importantly it will focus on new efforts to actually use chip embedding concepts for the realization of standard-type industrial quad flat packages with embedded chips (embedded chip QFN). Chips of 50 μm thickness, a pad pitch of 100 μm, and pad size of 85 μm are die bonded to a copper substrate and subsequently embedded in RCC (resin coated copper) layers by using vacuum lamination.
The resulting QFN packages are only 160 μm thick and provide standard pads at 400 μm pitch and a total number of 84 I/Os with dimensions of 10 × 10 mm2. All embedded chip QFN packages at the prototype level are manufactured in 250 × 300 mm2 panels.
Determination of Electric and Magnetic Properties of Commercial LTCC Soft Ferrite Material
Authors: Blaž Nelu , Marić Andrea , Radosavljević Goran , Mitrović Nebojša , Atassi Ibrahim , Smetana Walter , Živanov Ljiljana 
Published: October 2015

This paper offers an effective, accurate, and simple method for permittivity and permeability determination of an LTCC (low temperature cofired ceramic) ferrite sample. The presented research can be of importance in the fields of ferrite component design and application, as well as for RF and microwave engineering.
The characterization sample is a stack of LTCC tapes forming a toroid. Commercially available ferrite tape ESL 40012 was used and standard LTCC processing was applied for the sample fabrication. For the first time, the electrical properties of a ferrite toroid sample of ESL 40012 LTCC ferrite tape is presented at various frequencies. The electrical properties of LTCC ferrite materials, permittivity and specific resistivity, are shown in a frequency range from 10 kHz to 1 MHz using the capacitive method. The hysteresis properties of this material are also determined. B-H hysteresis loops were measured applying a maximum excitation of 2 kA/m and frequencies of 50 Hz, 500 Hz, and 1000 Hz.
Permeability is determined in the frequency range from 10 kHz to 1 GHz and a characterization procedure is divided in two segments, for low and high frequencies. Low frequency measurements (from 10 kHz to 1 MHz) are performed using LCZ meter and discrete turns of wire, while a short coaxial sample holder and vector network analyzer were used for the higher frequency range (from 300 kHz to 1 GHz).
In addition, another important factor required for the practical design of devices is presented, the temperature variation of the permeability dispersion parameters.