bluuebunny/crossref_metadata_2025_split huggingface dataset:
Stefan Heym, Christa Wolf, Heiner Müller et la chute du mur de Berlin
Authors: Bellefeuille Carol-Ann 
Published: November 2017

Stefan Heym, Christa Wolf et Heiner Müller étaient des écrivains populaires et influents en République démocratique allemande (RDA), mais se présentaient également comme des critiques du pouvoir communiste. Après la chute du mur de Berlin, ils se montrent néanmoins loyaux envers l’État et s’opposent aux citoyens qui réclament la réunification allemande. Ce discours ambigu témoigne de la stratégie de prise de parole qu’avaient adoptée ces auteurs : ils exprimaient des critiques non pour déstabiliser l’État, mais pour l’améliorer, car ils croyaient au bien-fondé du socialisme. Dans un État fermé où la littérature servait de source d’information alternative, leur loyauté critique leur permettait d’occuper une fonction légitime. Or, après 1989, cette façon d’agir n’est plus adaptée aux réalités.
Generated PSM Web Model for E-learning Platform Respecting n-tiers Architecture
Authors: Srai Aziz , Guerouate Fatima , Berbiche Naoual , HilalDrissi Hilal 
Published: November 2017

E-learning, or learning via a computer or mobile device, is growing. It can take many forms, such as an annotated PowerPoint presentation, a tutorial, or an interactive role-playing game .The possibilities are endless.
Today, 80% of companies and communities have done a number of interesting and effective e-learning solutions, and 30% of all professional training are e-learning courses. The development of these platforms is based mainly on different technologies. This technological diversity can make comparing or managing E-learning platforms difficult, and the choice of a given platform will be also complex. Therefore, to address this problem, this paper proposes a solution to generate a PSM model based on n-tier architecture from a PIM model. The language used is the QVT (Query View Transformation) transformation language.
An appraisal of recent breakthroughs in machine translation: the case of past participle-based compound adjectives in ESP
Authors: Maniez François 
Published: November 2017

Dans cet article, nous étudions la traduction automatique en français d'adjectifs composés (AC) en anglais de spécialité, en mettant l'accent sur les adjectifs constitués d'un participe passé précédé d'un nom ou d'un groupe nominal. Ces adjectifs sont omniprésents dans l'anglais scientifique ; si nombre d’entre eux font partie de termes pour lesquels il existe un équivalent de traduction stable, certains constituent encore un défi pour les traducteurs, dans la mesure où la prémodification dans le groupe nominal en anglais correspond souvent à des structures syntaxiques moins économiques dans les diverses langues romanes. Après un bref passage en revue des formes de participe passé les plus productives utilisées dans les AC, nous évaluons l’étendue de la couverture des AC formés à partir des participes passés based et induced dans une base de données terminologique connue et nous tentons d’évaluer la qualité des résultats obtenus par Google Translation à la suite des récentes améliorations qu’il a subies, notamment dans le cas de phrases où ces AC sont utilisés dans des expressions qui ne sont pas encore lexicalisées.
Electrochemical Analysis of Aged Copper Plating Bath in Wafer Level Packaging (Part 1)
Authors: Pavlov Michael , Lin Danni , Shalyt Eugene 
Published: November 2017

Abstract
Copper electroplating processes are widely used in semiconductor manufacturing, particularly during the packaging stage [1]. Copper deposition is used to build various structures including TSV, RDL, Pillars, and Micro and Mega Bumps. Those processes utilize plating solutions that contain inorganic components and organic additives [2]. During the electroplating process, the additives can partially transform into compounds that are so-called breakdown products. The presence of such breakdown products can interfere with the electrochemical analysis of organic additives. This article presents results of plating tests that show the influence of freshly produced breakdown products on analysis of organic additives. In addition, several options to eliminate this effect are presented.
Ultra-Compact Four-Channel 5–18 GHz Switched Filter Bank Utilizing PolyStrata® Microfabrication and 3D Packaging
Authors: Hermanson Chris , Reid Rob , Stacy Will 
Published: November 2017

Abstract
This paper presents a new approach to switched filter banks (SFB's) where the PolyStrata® microfabrication process is used to create three-dimensional signal routing and monolithic filter structures. This approach reduces the size of the SFB by an order of magnitude while achieving performance compared to legacy products. Nuvotronics' “Proto Filter Package” is a four-channel SFB design covering 5 – 18 GHz. It showcases how existing semiconductor and microelectronic assembly processes can be packaged with Polystrata®. The paper also describes how higher frequency designs (up to 110GHz) can be implemented using the same fabrication and assembly processes.
Reliability Analysis of a Wearable Sensor Patch (WSP) to Monitor ECG Signals
Authors: Soman Varun , Poliks Mark D. , Turner James N. , Schadt Mark , Shay Michael , Egitto Frank 
Published: November 2017

Abstract
Flexible Hybrid Electronic (FHE) devices interface flexible sensors and circuits with conventional rigid electronic components. This work reports preliminary results for the reliability aspects of a project aimed at fabricating a Wearable Sensor Patch (WSP) to monitor ECG signals. The device was fabricated by interfacing flexible electroplated Cu circuit lines and an ECG sensor on a Kapton® polyimide (PI) substrate with rigid electronics connected using SnPb solder (reflow temperature: 204 °C), making it a FHE device.
Phase I of this project faced reliability issues as Cu circuit lines were susceptible to failure due to cracking near the front-end signal conditioning chip. This issue needed to be resolved in Phase II of the project to produce a robust device fit to be used in real world applications. The effect of changes in Cu trace thickness (2 and 6 μm) and Kapton® PI thickness (2 and 5 mil) on device robustness was tested. Effect of the use of low reflow temperature SnBi solder (reflow temperature: 175 °C) on device reliability was also tested. Multiple devices fabricated using different configurations of Cu trace and Kapton® PI thicknesses and either SnPb or SnBi solder were bend tested to single out the most robust configuration. Improved solder pad design for Cu traces at solder joint sites was also tested.
It was observed that only devices with 6 μm thick Cu traces, 2 mil thick Kapton® and SnBi solder had no defects as a result of thermal cycling during fabrication. They also performed best during bend testing. Some of the factors contributing to robustness of this configuration might be lower CTE mismatch due to lower solder reflow temperature as well as greater strength under bending due to increased thickness. Improved solder pad design for Cu traces also improved device robustness considerably.
Microfabrication and Packaging Process for a Single-Chip Position, Navigation, and Timing System
Authors: Huan Junjun , Chodavarapu Vamsy P. , Xereas George , Allan Charles 
Published: November 2017

Abstract
The Global Positioning System (GPS) is the primary means of Positioning, Navigation, and Timing (PNT) for most civilian and military systems and applications. The rapid growth in autonomous systems has created a widespread interest in self-contained Inertial Navigation System (INS) for precise navigation and guidance in the absence of GPS. The microscale PNT systems need both specialized and low cost fabrication technologies to cost effectively bring these technologies to market. We describe an ultra-clean (low leak rate) wafer-level vacuum encapsulation microfabrication process of Micro-Electro-Mechanical Systems (MEMS) based sensors and devices. Using this process we have fabricated inertial sensors, frequency reference resonators, and pressure sensors. In addition to providing excellent resistance to shock and vibration, this combined microfabrication and packaging method would allow the use of high volume low cost plastic packaging at the device level. The microfabrication process is an 8” wafer process based on high aspect ratio bulk micromachining of a 30 μm thick single-crystal silicon device layer that is vacuum encapsulated at 10 mTorr between two silicon wafers with the demonstrated leak rate of only 6.5 × 10−18 atm cm3/s.
Atmospheric Probe for Real Time Weather Monitoring
Authors: Prather J. Craig , Bolt Michael , Harrell Haley , Horton Tyler , Manobianco John , Adams Mark L. 
Published: November 2017

Abstract
This work outlines the development and testing of novel in-situ atmospheric sensors. The system is designed for deployment of the sensors en masse to increase the geospatial density of atmospheric measurements. This sensor system is being designed to replace the costly, larger atmospheric sensors currently in use. Improvement in sensor technologies, substrates, and additive manufacturing techniques have allowed for such a device to be realizable. The devices contain a sensor suite that gathers temperature, relative humidity, and pressure from microsensors as well as position, velocity, and heading from a compact GPS receiver. This data is then sent to a base station for analysis by atmospheric scientists, with the potential for real time analysis.
Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology
Authors: Zhao Wei , Nakamoto Mark , Dhandapani Karthikeyan , Henderson Brian , Lindley Ron , Radojcic Riko , Ray Urmi , Gunterus Aurel , Schwarz Mark , Syed Ahmer , Ramachandran Vidhya 
Published: November 2017

Abstract
Electrical Chip Board Interaction (e-CBI) has emerged as a new risk in chip design as silicon die can directly interact with printed circuit board (PCB) in substrate-less wafer level packaging technology. To assess this risk Qualcomm Technologies, Inc. has converted an existing test chip to wafer level packaging technology. Both the measured data and simulation results show that e-CBI risk is significant and must be carefully managed.
Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
Authors: Eichwald Paul , Althoff Simon , Schemmel Reinhard , Sextro Walter , Unger Andreas , Brökelmann Michael , Hunstig Matthias 
Published: November 2017

Abstract
In power electronics, copper connector pins are e.g. used to connect control boards with power modules. The new chip generation based on SiC and GaN technology increase the power density of semiconductor modules significantly with junction temperatures reaching 200°C. To enable reliable operation at such high temperature, the soldering of these connector pins should be substituted by a multi-dimensional copper-copper bonding technology. A copper pin welded directly on DBC substrate also simplifies the assembly. With this aim, a proper bond tool and a suitable connector pin geometry are designed. This paper presents a two-dimensional trajectory approach for ultrasonic bonding of copper pieces, e.g. connector pins, with the intention to minimize mechanical stresses exposed to the substrate. This is achieved using a multi-dimensional vibration system with multiple transducers known from flip chip bonding. Applying a planar relative motion between the bonding piece and the substrate increases the induced frictional power compared to one-dimensional excitation.
The core of this work is the development of a new tool design which enables a reliable and effective transmission of the multidimensional vibration into the contact area between nail-shaped bonding piece and substrate. For this purpose, different bonding tool as well as bonding piece designs are discussed. A proper bonding tool design is selected based on the simulated alternatives. This tool is examined in bonding experiments and the results are presented. In addition, different grades of hardness for bonding piece and substrate are examined as well as different bonding parameters. Optical inspection of the bonded area shows the emergence of initial micro welds in form of a ring which is growing in direction of the interface boundaries with increasing bonding duration.
Using a Metal Oxide Adhesion Layer and Wet Chemical Cu Metallization for Fine Line Pattern Formation on Glass
Authors: Merschky Michael , Michalik Fabian , Thoms Martin , Taylor Robin , Reinoso-Cocina Diego , Hotz Stephan , Brooks Patrick 
Published: November 2017

Abstract
With the trends towards miniaturization and heterogeneous integration, both IC and advanced substrate manufacturers are striving to meet the needs of next generation platforms, to increase the density of interconnects, and generate conductors featuring finer lines and spaces. Advanced manufacturing technologies such as Semi-Additive-Processing (SAP) and Advanced Modified-Semi-Additive-Processing (amSAP) were devised, realized and implemented in order to meet these requirements. Line and space (L/S) requirements of copper conductors will be below 5/5μm for advanced substrates, with 2/2μm L/S required for chip to chip connections in the near future. Herein we report about the performance of the new developed ferric sulfate based EcoFlash™ process for SAP and amSAP application with the focus on glass as the substrate and VitroCoat as thin metal oxide adhesion promotion layer.
The adhesion promotion layer (about 5–10 nm thickness) is dip-coated by a modified sol-gel process followed by sintering which creates chemical bonds to the glass. The sol-gel dip coating process offers good coating uniformity on both Though-Glass-Via (TGV) and glass surfaces under optimized coating conditions. Uniform coating can be achieved up to aspect ratios of 10:1 by using a 300μm thick glass with 30μm diameter TGV.
The thin adhesive layer enables electroless and electrolytic copper plating directly onto glass substrates. Excellent adhesion of electroless plated copper seed layer on glass can be achieved by using the adhesive layer and annealing technology. The thin adhesive layer is non-conductive and can be easily removed from the area between circuit traces together with the electroless copper seed layer by etching with a ferric sulfate based process. We have successfully integrated the adhesion layer and electroless and electrolytic copper plating technologies into semi-additive process and seed layer etching capable producing L/S below 10 μm.
The Heat Strain of Various Athletic Surfaces: A Comparison Between Observed and Modeled Wet-Bulb Globe Temperatures
Authors: Pryor J. Luke , Pryor Riana R. , Grundstein Andrew , Casa Douglas J. 
Published: November 2017

Context:
The National Athletic Trainers' Association recommends using onsite wet-bulb globe temperature (WBGT) measurement to determine whether to modify or cancel physical activity. However, not all practitioners do so and instead they may rely on the National Weather Service (NWS) to monitor weather conditions.

Objective:
To compare regional NWS WBGT estimates with local athletic-surface readings and compare WBGT measurements among various local athletic surfaces.

Design:
Observational study.

Setting:
Athletic fields.

Main Outcome Measure(s):
Measurements from 2 identical WBGT devices were averaged on 10 athletic surfaces within an NWS station reporting radius. Athletic surfaces consisted of red and black all-weather tracks (track), blue and black hard tennis courts (tennis), nylon-knit artificial green turf, green synthetic turfgrass, volleyball sand, softball clay, natural grass (grass), and a natural lake (water). Measurements (n = 143 data pairs) were taken over 18 days (May through September) between 1 pm and 4:30 pm in direct sunlight 1.2 m above ground. The starting location was counterbalanced across surfaces. The NWS weather data were entered into an algorithm to model NWS WBGT.

Results:
Black tennis, black track, red track, and volleyball sand WBGT recordings were greater than NWS estimates (P ≤ .05). When all athletic-surface measurements were combined, NWS (26.85°C ± 2.93°C) underestimated athletic-surface WBGT measurements (27.52°C ± 3.13°C; P &lt; .001). The range of difference scores (−4.42°C to 6.14°C) and the absolute mean difference (1.71°C ± 1.32°C) were large. The difference between the onsite and NWS WBGT measurements resulted in misclassification of the heat-safety activity category 45% (65/143) of the time (= 3.857, P = .05). The WBGT of water was 1.4°C to 2.7°C lower than that of all other athletic surfaces (P = .04). We observed no other differences among athletic surfaces but noted large WBGT measurement variability among athletic playing surfaces.

Conclusions:
Clinicians should use an onsite WBGT device to determine environmental conditions and the need for modification of athletic events, especially as environmental conditions worsen. Given the large WBGT variability among athletic surfaces, WBGT measurements should be obtained from each athletic surface.
Attitudes, barriers, and practices toward research and publication among medical students at the University of Damascus, Syria
Authors: Turk Tarek , Al Saadi Tareq , Alkhatib Mahmoud , Hanafi Ibrahem , Alahdab Fares , Firwana Belal , Koudsi Maysoun , Al-Moujahed Ahmad 
Published: November 2017

AbstractIntroduction: Research is crucial for health-care delivery. However, medical students may not participate in research during their training, which might negatively affect their understanding of the importance of research and their future ability to conduct research projects. This is more prominent in developing countries. We aim to assess the attitudes of a sample of Syrian medical students toward research and suggest plausible solutions to reduce their self-reported barriers. Methods: A cross-sectional study was conducted using a self-administered, pretested questionnaire. Results: Three hundred and twenty-three responses were included. Most students demonstrated positive attitudes toward research. However, most of the responses indicated that they did not receive any training in academic writing or research and therefore did not have the opportunity to participate in formal research projects or scholarly writing. Students reported various types of barriers that challenged their progress in the field of research. Students who reported being encouraged by their professors to participate in research and writing/publishing scientific papers or reported receiving training about these activities were more likely to participate in research projects or writing scientific articles. Conclusion: Students have positive attitudes toward research and publication while they reported poor education, limited participation, and presence of many barriers that impede their participation in such activities.
The Influence of Free 3-Nitrotyrosine and Saliva on the Quantitative Analysis of Protein-Bound 3-Nitrotyrosine in Sputum
Authors: Ueshima Kazuhito , Minakata Yoshiaki , Sugiura Hisatoshi , Yanagisawa Satoru , Ichikawa Tomohiro , Akamatsu Keiichirou , Hirano Tsunahiko , Nakanishi Masanori , Matsunaga Kazuto , Yamagata Toshiyuki , Ichinose Masakazu 
Published: November 2017

BackgroundWe have recently developed a new technique for quantitatively measuring protein-bound 3-nitrotyrosine (3-NT), a footprint of nitrosative stress, utilizing high-performance liquid chromatography with an electrochemical detection (HPLC-ECD) system. Using this system, we showed that 3-NT formation was upregulated in the sputum of both COPD and asthmatic patients. However, in order to improve the accuracy of the measurement system, We have to resolve some problems which were the influence of free amino acid form of 3-NT and of salivary contamination.ObjectivesWe initially investigated the amount of the free amino acid form of 3-NT in induced sputum and compared with that of protein-bound 3-NT. Next, we evaluated the concentration of protein-bound 3-NT in saliva and compared with that in induced sputum by means of HPLC-ECD.MethodsFive male COPD patients were enrolled. Induced sputum and saliva were obtained from the patients. The free amino acid form of 3-NT in sputum and saliva was measured by HPLC-ECD, and the protein-bound 3-NT and tyrosine in sputum and saliva were enzymatically hydrolyzed by Streptomyces griseus Pronase and measured for the protein hydrolysate by HPLC-ECD.ResultsThe mean value of the amount of protein-bound 3-NT was 65.0 fmol (31.2 to 106.4 fmol). On the other hand, the amount of the free amino acid form of 3-NT was under the detection limit (<10 fmol). The levels of both 3-NT (sputum: 0.55 ± 0.15 pmol/ml, saliva: 0.02 ± 0.01 pmol/ml, p < 0.01) and tyrosine (sputum: 0.81 ± 0.43 μmol/ml, saliva: 0.07 ± 0.04 μmol/ml, p < 0.01) in saliva were significantly lower than in sputum. The percentage of 3-NT in saliva to that in sputum was about 3.1%, and that of tyrosine was about 9.0%.ConclusionThe free amino acid form of 3-NT does not affect the measurement of protein-bound 3-NT. Furthermore, the influence of salivary contamination on the measurement of protein-bound 3-NT in induced sputum by means of HPLC-ECD was very small and could be negligible.
Database Analysis of Adults with Bipolar Disorder Consuming a Micronutrient Formula
Authors: Gately Dermot , Kaplan Bonnie J. 
Published: November 2017

Background Bipolar disorder is a lifelong problem with imperfect available treatments. Recent research has shown potential benefit of nutritional treatment for mood symptoms. The goal of the current study was to determine whether adults with bipolar disorder reported treatment benefit from consuming a micronutrient formula. Methods Self-report data were available from 682 adults who reported a diagnosis of bipolar disorder; 81% were taking psychiatric medications. Those reporting additional diagnoses were excluded, as well as those who provided data <60 times during 180 days of using the micronutrients, leaving 358 for analysis. Results Mean symptom severity was 41% lower than baseline after 3 months (effect size = 0.78), and 45% lower after 6 months (effect size = 0.76) (both paired t-tests significant, p < 0.001). In terms of responder status, 53% experienced ≥50% improvement at 6 months. Half the sample were taking medications approved for bipolar disorder (lithium, anticonvulsants, atypical antipsychotics), and half were either medication-free or taking other medications: the magnitude of treatment benefit did not differ between these two groups. Regression analyses indicated that decreased symptom severity over the 6 months was associated with increasing micronutrient dosage and with reducing medication. Symptom improvements were significant and sustained at 6 months, suggesting that benefits were not attributable to placebo/expectancy effects. Conclusions Further research on this micronutrient formula is warranted.