bluuebunny/crossref_metadata_2025_split huggingface dataset:
Réformer la tarification des établissements et services médico-sociaux accompagnant les personnes handicapées et faciliter leur parcours
Authors: Deveau Annick 
Published: September 2017

En 2014, la France s’est engagée dans une réforme de la tarification des esms visant à une plus grande équité et facilitant les parcours. Pour cela, un projet, intitulé « Services et établissements : réforme pour une adéquation des financements au parcours des personnes handicapées » ( serafin-ph ) a été élaboré. Il est copiloté par la Direction générale de la cohésion sociale ( dgcs -ministère des Affaires sociales) et la Caisse nationale de solidarité pour l’autonomie ( cnsa ). Le présent article revient sur les principes qui guident le projet et sur son état d’avancement. Il contribue à montrer que la détermination d’un modèle tarifaire impose des choix fondés sur des orientations politiques et stratégiques.
Initier une logique de parcours vers l’inclusion sociale des personnes handicapées psychiques à partir d’un foyer de vie
Authors: Simeray Isabelle 
Published: September 2017

Les personnes confrontées aux manifestations psychiques chroniques sont partagées entre maladie et handicap par une réalité historique : le développement parallèle des deux mondes bien distincts de la psychiatrie et de l’action sociale, relevant de la division de notre système de protection sociale. Pourtant, chronique, variable, invisible et imprévisible, la maladie place la personne en situation de handicap social, la situant aux frontières juridiques des secteurs sanitaire et médico--social et la maintenant éloignée de la société. La création, en 2014, du premier foyer de vie accueillant exclusivement des personnes en situation de handicap psychique, dans les Alpes-de-Haute-Provence, invite les acteurs de ces deux secteurs à collaborer. Dépasser la notion sectorielle d’alternative à l’hospitalisation conduit à proposer des formes souples d’accueil qui considèrent la variabilité des troubles psychiques, dépendants de l’environnement, du traitement médical et de la relation à l’autre.
Parcours… Projet Ou bien, et si le parcours conduisait au projet
Authors: Ladsous Jacques 
Published: September 2017

En partant de deux novateurs – Deligny et Freinet – qui furent de grands pédagogues, il est possible de réfléchir sur deux concepts : parcours et projet. Dans leur démarche, c’est la demande de la personne qui est essentielle car on ne peut concevoir de projet si l’on ne cultive pas la découverte. Aboutir à un projet, c’est organiser les éléments de sa découverte pour en faire une création nouvelle. Et la découverte et la création demandent du temps, ce que l’administration n’est guère disposée à accorder. C’est le moment de revenir à l’essentiel : faire en sorte que le parcours conduise au projet, puisque l’inverse produit bien souvent des malentendus.
L’art radiophonique : histoire d’un médium de masse devenu médium artistique
Authors: Barber John 
Published: September 2017

L’article présente l’histoire illustrée de l’art radiophonique, afin de démontrer que la radio peut être employée au-delà de son rôle traditionnel de commerce ou de contrôle. Utilisant les possibilités, l’infrastructure et les technologies de la radio, l’art radio cherche à produire des artefacts créateurs d’un véritable médium radiophonique qui, tout en dépendant du canal de la radio pour leur création, leur communication et leur consommation implique l’auditoire dans de nouvelles pratiques artistiques.L’article donne accès à de nombreux extraits sonores répertoriés sur le site de Radio Nouspace : http://www.radionouspace.net/inquiries/appareil.html
Le transmédia : un dépassement du médium ?
Authors: Groupierre Karleen 
Published: September 2017

Dans un monde où les technologies numériques se démocratisent, apparaissent également des œuvres immersives déployées sur de multiples supports : les transmédias de fiction.Ces œuvres transmédias semblent amener une transformation de l'usage du médium dans la création artistique. En effet, traditionnellement, chacun décide de ce que sera la concrétisation d'une idée en œuvre par rapport à ce qu'il sait faire, à l'expérience de création qu'il a acquise dans le passé, et à son médium de prédilection. Lorsqu'un peintre crée, il verra probablement mentalement avant même d'attraper un pinceau, les pigments qu'il souhaite utiliser, le grain de la toile ou l'onctuosité de ses couleurs. Dans un élan d'anticipation de sa création, il transformera le matériel en médium.Mais que voit un artiste qui est sensibilisé à la musique, aux interfaces numériques, à la peinture, aux jeux et à la vidéo ? Quel matériel choisirait cet auteur qui n'a pas d'habitude de création attachée à un médium en particulier ? Ne pourrait-il pas voir une œuvre hybride concrétisée via différents vecteurs de création, en d'autres mots, un transmédia ? Ainsi, il existerait des auteurs capables de créer sans que leur création ne soit limitée par un médium de prédilection ; des auteurs transmédias possédant une véritable palette de médium, assemblés pour porter une même œuvre.
Evaluation of the water and sediment quality of a lotic water-body in the western coastal region of Sri Lanka using Rapid Bioassessment Protocol II (RBP II) of benthic macroinvertebrates
Authors: Wijeyaratne W. M. D. N. , Kalaotuwawe K. M. B. P. P. 
Published: September 2017

The biotic indices used in Rapid Bioassessment Protocol II (RBP II) developed by United States Environmental Protection Agency was used to assess the feasibility of using benthic macroinvertebates as bio-indicators for monitoring water and sediment quality in Ja-Ela stream, which is a lotic water body in the western coastal region of Sri Lanka. Five study sites to cover the entire length of the stream, which are in five different fringing land uses (undisturbed site, agricultural site, industrial discharge receiving site, densely populated urban site and a site close to the mouth of the stream) were sampled for water and sediment quality parameters and benthic macroinvertebrates from April to October 2015. Shannon-Weiner diversity index (H`), Hilsenhoff Family Biotic index (FBI), Taxa richness (TRI), and Ehemeroptera, Plecoptera and Trichoptera (EPT) index were calculated for each site. Results indicated significant spatial variations in BOD5, COD, visibility, nitrate concentration and total phosphorus concentrations in the water, and total organic carbon content and particle size distribution in sediments. The highest mean values for H' (2.38), TR (13.6) and EPT (6.2) were recorded from the undisturbed site. Significantly higher FBI values are recorded from the industrial discharge receiving site (6.97) and the urban site (6.81), indicating that they are the most polluted sites with higher degree of organic pollution than other sites. These biotic index values showed significant correlations with sediment and water quality characteristics of the study sites (R2 >0.5, p<0.05) The H', EPT, FBI and TR values for benthic macro-invertebrate community showed that the upstream portion of this stream is habitable to pollution sensitive taxa, while the downstream areas close to its opening to Negombo estuary are habitable by pollution tolerant taxa. Results of the present study identified the RBP II as a possible bio monitoring protocol to reflect the water and sediment quality in the Ja-Ela stream.
Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging
Authors: Lujan Amy 
Published: September 2017

In recent years, there has been increased focus on fan-out wafer level packaging with the growing inclusion of a variety of fan-out wafer level packages in mobile products. While fan-out wafer level packaging may be the right solution for many designs, it is not always the lowest cost solution. The right packaging choice is the packaging technology that meets design requirements at the lowest cost. Flip chip packaging, a more mature technology, continues to be an alternative to fan-out wafer level packaging. It is important for many in the electronic packaging industry to be able to determine whether flip chip or fan-out wafer level packaging is the most cost-effective option.
This paper will compare the cost of flip chip and fan-out wafer level packaging across a variety of designs. Additionally, the process flows for each technology will be introduced and the cost drivers highlighted. A variety of package sizes, die sizes, and design features will be covered by the cost comparison. Yield is a key component of cost and will also be considered in the analysis.
Activity based cost modeling will be used for this analysis. With this type of cost modeling, a process flow is divided into a series of activities, and the total cost of each activity is accumulated. The cost of each activity is determined by analyzing the following attributes: time required, labor required, material required (consumable and permanent), capital required, and yield loss.
The goal of this cost comparison is to determine which design features drive a design to be packaged more cost-effectively as a flip chip package, and which design features result in a lower cost fan-out wafer level package.
New Wafer Level Packaging Concept for Power LEDS
Authors: Volpert Marion , Soulier B. , Peray P. , Ait-Mani N. , Gasse A. , Henry D. , Tallet C. , Beix V. , Aboulaich A. , Zheng-Sung C. , Diot J. L. 
Published: September 2017

The demand for more efficient, cheaper, and smarter lighting system is ever increasing. Today it is well accepted that solid state lighting using high brightness LEDs is the leading technology for these lighting applications. LEDs has established itself as the solution for a large variety of applications such as street lighting, households, professional buildings etc… The growing need and incredible market for such lighting system drive the research for solutions on the cutting edge of the technology. However if the effectiveness of 2D GaN devices does not need to be proven any more, some reliability issues may arise due to difficult thermal management, proper encapsulation, good color control. Indeed one of the leading factor to improve LEDs devices as well as to reduce the price is to work on the packaging. How the interconnections or encapsulations are achieved, how the color conversion is done, or how is the heat generated handled.
The main technology for LEDs fabrication is the growth of 2D GaN over sapphire substrates. Today some of the most widely spread configurations for these 2D LEDs are common chips (CC) and vertical thin film chips (VTF). In both cases the electrical contact is achieved by gold wires and in this configuration, in addition of the wire bonding step, the useful area for light emission is decreased because of the shadowing made by the metallic grid and the bonding pad surfaces. The flip chip (FC) configuration is also available in the LED manufacturing and looks promising as it achieves smaller size package and higher current. However, in this configuration the process remains complicate, as it needs an additional step for removing this growing substrate, the main technique today consisting on the Laser Lift Off (LLO).
In this paper we present a novel approach to achieve promising LED devices. The new packaging approach uses the fabrication of nanowires over a silicon substrate, and some wafer level packaging to achieve the wires encapsulation and fabricate the P and N interconnections, using Through Silicon Vias (TSV). The silicon wafer level fabrication process achieves the possibility to use standard microelectronic equipment for the LED fabrication and its packaging. For this device specific silicon technologies are developed, such as wafer bonding and thinning, high aspect ratio TSV-last. Once fabricated the chip LEDs are diced and mounted on a specifically designed QFN which is itself directly mounted on a luminaire. The specific QFN is designed to achieve simultaneous reflow of many LEDs chips, and to properly handle the thermal management over the lifetime of the device. For test purposes and to characterize the electro-optical performances as well as some thermal resistances the LEDs are also mounted on a starboard. This new fabrication and packaging approach looks promising, and the specific technologies developed as well as the main characterization results will be presented.
Transient Liquid Phase Sintering Pastes in Heterogeneous Integration
Authors: Shearer Catherine 
Published: September 2017

Integrated package technologies continue to be the dominant trend in the electronics packaging industry. In particular, heterogeneous integration of logic and memory or sensing is an enormous growth segment for both mobile electronics and IoT applications.
In the mobile microprocessor segment of the field, the most advanced technologies will be implemented in the early adopter class. New package architectures and interconnect schemes will be vetted and implemented without significant cost pressure, performance is the driver.
In the IoT segment and downstream mobile, however; lower cost alternatives to cutting edge packaging architectures are needed to drive market growth. Sintering pastes offer an opportunity to cost-effectively enable cutting edge 3D package capability for a wider variety of applications.
In this paper we will explore the use of transient liquid phase sintering (TLPS) pastes in package-on-package (POP) schemes for integrated logic with memory or sensing functions in through mold via architectures. Through mold via technology has been well established in the industry and has significantly contributed to the adoption of three dimensional packaging architectures. The advantages of using TLPS pastes in similar structures will be detailed.
Advanced Packaging Lithography and Inspection Solutions for Next Generation FOWLP-FOPLP Processing
Authors: Silveira Elvino Da , Best Keith , Singh Gurvinder , McCleary Roger 
Published: September 2017

For more than 50 years the semiconductor industry has pursued Moore's law, continuously improving device performance, reducing cost, and scaling transistor geometries down to where advanced CMOS has reached beyond the 10nm technology node. The commensurate increase in I/O count has created many challenges for device packaging which hitherto was considered low cost with simple solutions. It was once thought that old backend foundry lithography steppers could be used to address the new packaging requirements; which was true whilst the substrates remained in the traditional 300mm Silicon format. The recent unprecedented rapid growth in Fan Out Wafer Level Packaging (FOWLP) applications has introduced a more complicated landscape of process challenges, with no restriction on substrate format, where cost is the main driver and high yields are mandatory.
This paper discusses the lithography process challenges that have ensued from disruptive FOWLP, and more recently the paradigm shift to Panel fan out Packaging. The work reports on lithography solutions for CD control over topography and high aspect ratio imaging of 2μm line/space RDL. In addition, the introduction of new inspection capabilities for defects and metrology is reported for both wafers and panels. The increase in lithography productivity and cost reduction provided by FOPLP is also discussed with production examples.
Primary factors threatening survival of SMEs in Mozambique
Authors: Alen Sawaya , Bhero Shepherd 
Published: September 2017

There is no dispute that entrepreneurship is critical for spurring entrepreneurs into launching small businesses to solve the perennial problem of youth unemployment. The prevailing viewpoint has therefore postulated on the fact that only the lack of entrepreneurship is to blame for the observed paucity of business start-ups to address the scourge of unemployment in Mozambique. This paper is based on a research that was carried out in Greater Maputo, the capital of Mozambique, involving a sample of 485 SMEs chosen using random sampling strategy. A face to face interview was conducted using structured, close-ended questionnaires to collect the primary data. The research was carried out applying quantitative methodology, using descriptive statistics and inferential research design, emphasising on frequencies and percentages as instruments of data management. The study revealed that the main problem of the start-up, growth and sustainability of SMEs was in fact inadequacy in competitiveness rather than the lack of entrepreneurship per se. The paper therefore offered recommendations on the appropriate solutions of encouraging the spirit of competitiveness within SMEs so as to deal with the scourge of youth unemployment in Mozambique.Keywords: Competitiveness, Entrepreneurship, small and medium enterprises, SMEs
Monitoring shipping emissions in the German Bight using MAX-DOAS measurements
Authors: Seyler André , Wittrock Folkard , Kattner Lisa , Mathieu-Üffing Barbara , Peters Enno , Richter Andreas , Schmolke Stefan , Burrows John P. 
Published: September 2017

Abstract. A 3-year time series of ground-based multi-axis differential optical absorption spectroscopy (MAX-DOAS) measurements of NO2 and SO2 on the island Neuwerk has been analyzed for contributions from shipping emissions. The island is located in the German Bight, close to the main shipping lane (at a distance of 6–7 km) into the river Elbe towards the harbor of Hamburg. Measurements of individual ship plumes as well as of background pollution are possible from this location. A simple approach using the column amounts of the oxygen molecule dimer or collision complex, O4, for the determination of the horizontal light path length has been applied to retrieve path-averaged volume mixing ratios. An excellent agreement between mixing ratios determined from NO2 retrievals in the UV and visible parts of the spectrum has been found, showing the validity of the approach. Obtained mixing ratios of NO2 and SO2 are compared to co-located in situ measurements showing good correlation on average but also a systematic underestimation by the MAX-DOAS O4 scaling approach. Comparing data before and after the introduction of stricter fuel sulfur content limits (from 1 to 0.1 %) on 1 January 2015 in the North Sea Emission Control Area (ECA), a significant reduction in SO2 levels is observed. For situations with wind from the open North Sea, where ships are the only local source of air pollution, the average mixing ratio of SO2 decreased by a factor of 8, while for NO2 in the whole time series from 2013 to 2016, no significant change in emissions was observed. More than 2000 individual ship emission plumes have been identified in the data and analyzed for the emission ratio of SO2 to NO2, yielding an average ratio of 0.3 for the years 2013/2014 and decreasing significantly, presumably due to lower fuel sulfur content, in 2015/2016. By sorting measurements according to the prevailing wind direction and selecting two angular reference sectors representative for wind from the open North Sea and coast excluding data with mixed air mass origin, relative contributions of ships and land-based sources to air pollution levels in the German Bight have been estimated to be around 40 % : 60 % for NO2 as well as SO2 in 2013/2014, dropping to 14 % : 86 % for SO2 in 2015/2016.
Tropospheric ozone profiles by DIAL at Maïdo Observatory (Reunion Island): system description, instrumental performance and result comparison with ozone external data set
Authors: Duflot Valentin , Baray Jean-Luc , Payen Guillaume , Marquestaut Nicolas , Posny Francoise , Metzger Jean-Marc , Langerock Bavo , Vigouroux Corinne , Hadji-Lazaro Juliette , Portafaix Thierry , De Mazière Martine , Coheur Pierre-Francois , Clerbaux Cathy , Cammas Jean-Pierre 
Published: September 2017

Abstract. In order to recognize the importance of ozone (O3) in the troposphere and lower stratosphere in the tropics, a DIAL (differential absorption lidar) tropospheric O3 lidar system (LIO3TUR) was developed and installed at the Université de la Réunion campus site (close to the sea) on Reunion Island (southern tropics) in 1998. From 1998 to 2010, it acquired 427 O3 profiles from the low to the upper troposphere and has been central to several studies. In 2012, the system was moved up to the new Maïdo Observatory facility (2160 m a.m.s.l. – metres above mean sea level) where it started operation in February 2013. The current system (LIO3T) configuration generates a 266 nm beam obtained with the fourth harmonic of a Nd:YAG laser sent into a Raman cell filled up with deuterium (using helium as buffer gas), generating the 289 and 316 nm beams to enable the use of the DIAL method for O3 profile measurements. The optimal range for the actual system is 6–19 km a.m.s.l., depending on the instrumental and atmospheric conditions. For a 1 h integration time, vertical resolution varies from 0.7 km at 6 km a.m.s.l. to 1.3 km at 19 km a.m.s.l., and mean uncertainty within the 6–19 km range is between 6 and 13 %. Comparisons with eight electrochemical concentration cell (ECC) sondes simultaneously launched from the Maïdo Observatory show good agreement between data sets with a 6.8 % mean absolute relative difference (D) between 6 and 17 km a.m.s.l. (LIO3T lower than ECC). Comparisons with 37 ECC sondes launched from the nearby Gillot site during the daytime in a ±24 h window around lidar shooting result in a 9.4 % D between 6 and 19 km a.m.s.l. (LIO3T lower than ECC). Comparisons with 11 ground-based Network for Detection of Atmospheric Composition Change (NDACC) Fourier transform infrared (FTIR) spectrometer measurements acquired during the daytime in a ±24 h window around lidar shooting show good agreement between data sets with a D of 11.8 % for the 8.5–16 km partial column (LIO3T higher than FTIR), and comparisons with 39 simultaneous Infrared Atmospheric Sounding Interferometer (IASI) observations over Reunion Island show good agreement between data sets with a D of 11.3 % for the 6–16 km partial column (LIO3T higher than IASI). ECC, LIO3TUR and LIO3T O3 monthly climatologies all exhibit the same range of values and patterns. In particular, the Southern Hemisphere biomass burning seasonal enhancement and the ozonopause altitude decrease in late austral winter–spring, as well as the sign of deep convection bringing boundary layer O3-poor air masses up to the middle–upper troposphere in late austral summer, are clearly visible in all data sets.
Husserl and Ricoeur: The Influence of Phenomenology on the Formation of Ricoeur’s Hermeneutics of the ‘Capable Human’
Authors: Moran Dermot 
Published: September 2017

The phenomenology of Edmund Husserl had a permanent and profound impact on the philosophical formation of Paul Ricoeur. One could truly say, paraphrasing Maurice Merleau-Ponty’s brilliant 1959 essay ‘The Philosopher and his Shadow’,that Husserl is the philosopher in whose shadow Ricoeur, like Merleau-Ponty, also stands, the thinker to whom he constantly returns. Husserl is Ricoeur’s philosopher of reflection, par excellence. Indeed, Ricoeur always invokes Husserl when he is discussing a paradigmatic instance of contemporary philosophy of ‘reflection’ and also of descriptive, ‘eidetic’ phenomenology. Indeed, I shall argue in this chapter that Husserl’s influence on Ricoeur was decisive and provided an eidetic, descriptive methodology which is permanently in play, even when it has to be concretized and mediated by hermeneutics, as Ricoeur proposes after 1960.