bluuebunny/crossref_metadata_2025_split huggingface dataset:
Vasoactive Therapy in Systemic Sclerosis: Real-life Therapeutic Practice in More Than 3000 Patients
Authors: Moinzadeh Pia , Riemekasten Gabriela , Siegert Elise , Fierlbeck Gerhard , Henes Joerg , Blank Norbert , Melchers Inga , Mueller-Ladner Ulf , Frerix Marc , Kreuter Alexander , Tigges Christian , Lahner Nina , Susok Laura , Guenther Claudia , Zeidler Gabriele , Pfeiffer Christiane , Worm Margitta , Karrer Sigrid , Aberer Elisabeth , Bretterklieber Agnes , Genth Ekkehard , Simon Jan C. , Distler Joerg H.W. , Hein Ruediger , Schneider Matthias , Seitz Cornelia S. , Herink Claudia , Steinbrink Kerstin , Sárdy Miklos , Varga Rita , Mensing Hartwig , Mensing Christian , Lehmann Percy , Neeck Gunther , Fiehn Christoph , Weber Manfred , Goebeler Matthias , Burkhardt Harald , Buslau Michael , Ahmadi-Simab Keihan , Himsel Andrea , Juche Aaron , Koetter Ina , Kuhn Annegret , Sticherling Michael , Hellmich Martin , Kuhr Kathrin , Krieg Thomas , Ehrchen Jan , Sunderkoetter Cord , Hunzelmann Nicolas ,   The German Network for Systemic Scleroderma
Published: November 2015

Objective.Vasculopathy is a key factor in the pathophysiology of systemic sclerosis (SSc) and the main cause for Raynaud phenomenon (RP), digital ulcers (DU), and/or pulmonary arterial hypertension (PAH). It is so far unknown how patients with SSc are treated with vasoactive agents in daily practice. To determine to which extent patients with SSc were treated with different vasoactive agents, we used data from the German Network for Systemic Scleroderma registry.Methods.The data of 3248 patients with SSc were analyzed.Results.Patients were treated with vasoactive drugs in 61.1% of cases (1984/3248). Of these, 47.6% received calcium channel inhibitors, followed by 34.2% treated with angiotensin-converting enzyme (ACE) inhibitors, 21.1% treated with intravenous (IV) prostanoids, 10.1% with pentoxifylline, 8.8% with angiotensin 1 receptor antagonists (AT1RA), 8.7% with endothelin 1 receptor antagonists (ET1RA), 4.1% with phosphodiesterase type 5 (PDE5) inhibitors, and 5.3% with others. Patients with RP received vasoactive therapy in 63.3% of cases, with DU in 70.1%, and with PAH in 78.2% of cases. Logistic regression analysis revealed that patients with PAH were significantly more often treated with PDE5 inhibitors and ET1RA, and those with DU with ET1RA and IV prostanoids. In addition, 41.8% of patients were treated with ACE inhibitors and/or AT1RA. Patients registered after 2009 received significantly more often ET1RA, AT1RA, and IV prostanoids compared with patients registered prior to 2005.Conclusion.These data clearly indicate that many patients with SSc do not yet receive sufficient vasoactive therapy. Further, in recent years, a marked change of treatment regimens can be observed.
Ensuring Suitability of Cu Wire Bonded ICs for Automotive Applications
Authors: McLeish James , Schueller Randy 
Published: November 2015

The transition to replace gold with copper bond wires in semiconductor components, primarily driven by the ever increasing price of gold wire, has been under way for several years. Cu wire bonds (Cu-WBs) are technically more challenging than gold to produce, requiring improved designs, processes and equipment. After introduction in consumer products, their use is now migrating to automotive electronics where product integrity for quality, reliability and durability (QRD) and safety over 10–15 years in a demanding harsh environment is paramount, in addition to managing cost in the highly competitive global automotive market.
Reliability issues with some Cu wire bonded components detected during the rigorous product validation durability–reliability tests of automotive electronics, however, are starting to appear. The indications are that only optimized package design with well-controlled assembly processes are suitable for high reliability (hi-rel) harsh environment applications such as automotive, military and aerospace. A concern is that non-optimized Cu-WBs and package materials issues are being detected in module-level durability validation tests in parts that were qualified as automotive grade per AEC Q-100 or AEC-Q101. This article will explore the issues and discuss potential solutions as the Automotive Electronics Council (AEC) – the organization that defines requirements for automotive grade electronic components – works to update qualification procedures for evolving Cu-wire bond technology.
Temporary Bonding and Debonding Technologies to Enable Innovative Fan-Out Embedded Interposer for High-Density Applications
Authors: Lee Alvin , Su Jay , Liu Xiao , Hung Yin-Po , Lin Yu-Min , Huang Shin-Yi , Cheng Ren-Shin , Chang Tao-Chih 
Published: November 2015

As requirements increase for mobile devices to be lighter and thinner and to operate at high speed and high bandwidth, innovations in wafer-level packaging have evolved to 3-D structures, such as package-on-package (PoP), fan-out integration, and through-silicon-via (TSV) interposer architectures. However, wafer-level packaging is still considered to be costly and slow in throughput due to wafer size limitations.
In this study, temporary bonding and debonding processes using mechanical or laser release technologies were applied in the fabrication process of an integrated embedded glass interposer as a foundation for 3-D integrated circuit (IC) packaging on panel-level packaging. Glass interposers having dimensions of 10 mm × 10 mm and a thickness of 120 μm were fabricated. The interposers had through-glass vias (TGVs) 25 μm in diameter and 3000 I/O pads of copper under-bump metallization (UBM) and were designed as a nearly full-array type. The interposers were supported by a temporary bonding material on silicon or glass wafers and embedded by built-up dielectric material on which fan-out redistribution circuit layers were deposited. For forming the pattern of the redistribution layer, a UV laser was used to form 75-μm-diameter blind vias, and conductive interconnections were made by a semi-additive process (SAP) using photolithography and electrolytic copper. The process of building up layers from the glass interposer to form an embedded fan-out interposer can eliminate a joining process required by traditional 2.5-D IC integration. Finally, the embedded fan-out carrier is separated from the glass or silicon wafer through a laser debonding process.
An experiment to study the correlation of bonding material and release material with built-up lamination in backside processes will be discussed in this paper to address full process integration on panel-size substrates. The combination of temporary bonding technology with mechanical or laser release technologies will pave the way for realizing cost-effective 3-D IC packaging on panel-level substrates.
Challenge to zero CTE and lower shrinkage organic substrate material for thin CSP package
Authors: Hashimoto Shintaro , Takanezawa Shin , Tsuchikawa Shinji , Takekoshi Masaaki , Oohashi Kenichi , Morita Koji 
Published: November 2015

Along with the advancement in miniaturizing of mobile devices, typified by smart phones and tablet PCs, the semiconductor PKG substrate installed in these devices is demanded to be thinner and higher in density. As one of the most innovative solutions, the PoP (package on package) technology, which has the three-dimensional construction, has been expanding rapidly in recent years.
However, thinner PKG such as PoP tends to warp at the assembly process and cause the decrease in the connection reliability. Therefore ultra low CTE (coefficient of thermal expansion) core materials have been needed as a key solution for the reduction of the warpage for PoP.
We have already developed and mass-produced ultra low CTE core material named E-770G (CTE value: 1.8 ppm/°C) for this application. However, the demand for lower warpage is still stronger especially for thinner PKG applications. To meet this requirement, we confirmed that not only low CTE but also lower resin shrinkage control gives big impact to warpage.
In this paper, we would like to introduce new ultra low CTE and low shrinkage core material, named E-777G for next generation thin CSP. At the same time, we would like to explain the relationship between the warpage and material properties (CTE and resin shrinkage).
E-777G has ultra low CTE and low shrinkage. These properties were achieved by applying our original resin system designed by hard segments and soft segments. Hard segments have a stack structure of aromatic ring and the strong intermolecular force between them, which lead to the ultra low CTE and low shrinkage. Soft segments of low elastic modulus can follow approximately the thermal behavior of glass fabric when heated and cooled. Consequently, the material can show the ultra low CTE which is similar to that of glass fabric itself. As a result, E-777G has achieved the ultra low CTE of 0.7 ppm/°C by TMA method which leads to significant reduction of the warpage.
In the cooling process after the reflow, the bottom PKG of PoP shows a convex warpage. It is caused by resin shrinkage of substrate in the cooling process. As the method of decreasing resin shrinkage in the cooling process, we focused on decreasing free volume of the resin. By using molecular dynamics simulation, we designed the most suitable resin composition.
Confirming the warpage property, we evaluated the warpage behavior of the bottom PKG before/after assembly process. The bottom PKG using E-777G material showed lower warpage than E-770G. We confirmed that not only the ultra low CTE but also low shrinkage of material effectively contributes to the decrease of the warpage.
Low Temperature, Fast Sintering of Micro-Scale Silver Paste for Die Attach for 300°C Applications
Authors: Yu Fang , Johnson R. Wayne , Hamilton Michael C. 
Published: November 2015

With an increasing demand for SiC and GaN high power devices that operate at high temperature, traditional solder materials are reaching their limitations in performance. In addition, there is a strong desire to eliminate high lead containing solders in Si power device packaging for use over conventional temperature range. Low temperature Ag sintering technology is a promising method for high performance lead-free die attachment. In a previous study, a pressureless sintering process and suitable metallization were demonstrated to provide high reliability die attach by using micro-size Ag sintering. The resulting die attach layer had approximately 30% porosity.
In this work, a low temperature pressure-assisted fast sintering process was examined. The porosity was decreased from 30% to 15% with application of a low pressure (7.6MPa) during a one minute sintering process. The shear strength for a 3 mm × 3 mm die was 70 MPa and the 8 mm × 8 mm die could not be sheared off due to a 100 kg shear module force limit. Both the Ag and Au metallization (die and substrate) were studied. Furthermore, a new substrate metallization combination was found that allows the use of Au thick film metallized substrates. High temperature (300 °C) storage tests for up to 2000 hours aging were conducted and results are presented.
Solder Paste Corrosivity Assesment: Bono Test
Authors: Puechagut Céline , Laügt Anne-Marie , Guéné Emmanuelle , Anisko Richard 
Published: November 2015

Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-004 corrosion tests: copper mirror, copper panel corrosion test, Surface Insulation Resistance (SIR) and Elecrochemical Migration (ECM). Other SIR and ECM tests are described in Bellcore GR-78-CORE and JIS Z3197 standards.
Although SIR and ECM tests are recognized by all standards authorities to evaluate the solder paste residue corrosivity after reflow, a more selective method, the Bono test, has been developed and implemented in some French companies as a qualification criterion. It has been proven that compared to common corrosion tests, the Bono test better differentiates the nature of solder paste residues.
Advanced lithography and electroplating approach to form high-aspect ratio copper pillars
Authors: Best Keith , McCleary Roger , Hollman Richard , Holmes Phillip 
Published: November 2015

Advanced packaging technologies continue to enable the semiconductor industry to meet the needs for ever thinner, smaller and faster components required in mobile devices and other high performance applications.
In the early days of advanced packaging, C4 solder bumps were the alternative to wire bonding. Although lead-free solder remains one of the preferred methods for assembly, tall copper structures (copper pillars) are becoming the standard interconnect solution for many applications. A process of lithography and subsequent electroplating are the mainstream process for today's copper pillar formation on wafer level for high-end flip chip devices.
The latest trends in advanced packaging require another technology development when it comes to copper pillars. Modern integration schemes such as 2.5D interposer as well as 3D stacking have pushed the limits of standard lithography and copper electroplating capabilities. Specifically, the need for fine-pitch high aspect ratio copper pillars represents a challenge. In addition, the trend towards rectangular panel-based packaging as seen with glass interposers or panel fan-out (P-FO) devices demands a challenging scale-up of lithography and electroplating equipment and processing capabilities.
This work specifically focuses on the formation of high-aspect ratio copper pillars in excess of 100μm by means of stepper-based lithography followed by electroplating. A unique test vehicle has been created to evaluate the process latitude for lithography for different resist materials as well as the specific electroplating challenges associated with these tall and narrow structures. The paper investigates the influence of key parameters such as CD uniformity, pattern density variations and resist profile on the critically important pillar height uniformity across the wafer or panel. In addition, the resist profile behavior at the substrate interface is being examined as it influences undercut behavior during wet etch of the plating seed layer. A number of wet and dry-film resist materials and appropriate lithography processes (spin coat or laminate, expose, develop) followed by copper plating based on varying chemistries and process parameters are being explored.
The paper also summarizes the current requirements for the above mentioned lithography and plating processes as seen in the industry today.
Study on electromigration in flip chip lead-free solder connections with 40 μm or 30 μm diameter on thin film ceramic substrates
Authors: Gorywoda Marek , Dohle Rainer , Kandler Bernd , Burger Bernd 
Published: November 2015

Electromigration comprises one of the processes affecting the long-term reliability of electronic devices; it has therefore been the focus of many investigations in recent years. In regards to flip chip packaging technology, the majority of published data is concerned with electromigration in solder connections to metallized organic substrates. Hardly any information is available in the literature on electromigration in lead-free solder connections on thin film ceramic substrates.
This work presents results of a study of electromigration in lead-free (SAC305) flip chip solder bumps with a nominal diameter of 40 μm or 30 μm with a pitch of 100 μm on silicon chips assembled onto thin film Al2O3 ceramic substrates. The under bump metallization (UBM) comprised of a 5 μm thick electroless nickel immersion gold (ENIG) layer directly deposited on the AlCu0.5 trace. The ceramic substrates were metallized using a thin film multilayer (NiCr-Au(1.5 μm)-Ni(2 μm) structure on the top of which wettable areas were produced with high precision by depositing flash Au (60 nm) of the required diameter (40 μm or 30 μm).
All electromigration tests were performed at the temperature of 125 °C. Initially, one chip assembly with 40 μm and one with 30 μm solder bumps was loaded with the current density of 8 kA/cm2 for 1,000 h. The assemblies did not fail and an investigation with SEM revealed no significant changes to the microstructure of the bumps. Thereafter seven chip assemblies with 40 μm solder bumps and five assemblies with 30 μm bumps were subjected to electromigration tests of 14 kA/cm2 or 25 kA/cm2, respectively. Six of the 40 μm-assemblies failed after 7,000 h and none of the 30 μm-assemblies failed after 2,500 h of test duration so far. Investigation of failed samples performed with SEM and EDX showed asymmetric changes of microstructure in respect to current flow. Several intermetallic phases were found to form in the solder. The predominant damage of the interconnects was found to occur at the cathode contact to chip; the Ni-P layers there showed typical columnar Kirkendall voids caused by migration of Ni from the layers into the solder. Failure of the contacts apparently occurred at the interface between Ni-P and solder.
In summary, the results of the study indicate a very high stability of lead-free solder connections on ceramic substrates against electromigration. This high stability is primarily due to a better heat dissipation and thus to a relatively low temperature increase of the ceramic packages caused by resistive heating during flow of electric current. In addition, the type of the metallization used in the study seems to be more resistant to electromigration than the standard PCB metallization as it does not contain a copper layer.
L/S ≤ 5/5μm Line Embedded Organic Substrate Manufacturing for 2.1D/2.5D SiP Application
Authors: Chen Yu-Hua , Cheng Shyh-Lian , Hu Dyi-Chung , Tseng Tzvy-Jang 
Published: November 2015

The requirement for IC packages with higher density interconnection with fine line feature has increased significantly recently. Current organic substrates are limited to line/space 8/8μm for Semi-additive Process(SAP), and it will cause yield loss from adhesion issue of line/space less than 5/5μm. But the impact of bad adhesion of fine line is very small in laser embedded (LE) substrate because of its embedded structure. There are several advantages of LE such as the capacity of stereo copper features and better electric performance with lower variation of trench width/depth. It can form fine pitch trench line/space even less than 3/3μm. It also can provide better design flexibility for its pad-less features and better reliability than SAP process.
In this paper, we will discuss the key of the processes and demonstrate the fabrication of fine line substrate of 3/3μm line/space by fine tuning line embedded technology. Line embedded trace was made by laser direct ablation (LDA) on organic build-up dielectric material with fine filler size. Laser ablation process capability shows excellent trench depth and shape control. In order to get better copper thickness uniformity, novel uniformity copper plating technology on via, pad and trench has developed. Low cost and uniformity copper reduction process has also been evaluated and developed.
Percutaneous Fascia Release for Treating Chronic Recurrent Gluteal Myofascial Pain—A Pilot Study of a New Technique
Authors: Chen Hsin-Shui , Lin Ming-Ta , Hong Chang-Zern , Hsieh Yueh-Ling , Chou Li-Wei 
Published: November 2015

Objective To investigate the therapeutic effectiveness of percutaneous fascia release to treat chronic recurrent gluteal myofascial pain related to recurrent tendonitis or bursitis at the attachment sites. Methods Five patients (three males, two females; aged 48.6 ± 8.9 years) with myofascial trigger points in the gluteus medius muscle were treated. Outcome measures, including pain intensity, pressure pain threshold, and the relative strength of hip abduction, were assessed before, immediately after, and six months after the treatment. The data measured before and after treatment (different times) on visual analog scale, pressure pain threshold, and relative hip abduction strength were analyzed by Wilcoxon signed-rank test and paired t-test, respectively, for the comparisons between time points. Results Reduction in pain intensity and increase in the pressure pain threshold and the relative hip abduction strength were found in all five patients after treatment when compared with those of before treatment ( P < 0.05). Moreover, all of these improvements existed for at least six months ( P > 0.05). Conclusions Percutaneous fascia release of gluteal muscle insertion sites can be used to treat chronic gluteal pain related to subtrochanteric bursitis to avoid recurrence, if other treatment cannot control the recurrence, although this was demonstrated only on a small sample size without control and blind assessment in the pilot study.
The Incorporation Problem in Interdisciplinary Legal Research: Some Conceptual Issues and a Practical Illustration
Authors: Roux Theunis Robert 
Published: November 2015

The Incorporation Problem in Interdisciplinary Legal Research: Some Conceptual Issues and a Practical Illustration
The seriousness of the incorporation problem in interdisciplinary legal research, this article argues, depends on how legal research is understood. If legal research is understood as a single, inherently interdisciplinary discipline, the problem largely falls away. On this view, the incorporation of other disciplines into legal research is what legal academics have for the last 40 years already successfully been doing. If, on the other hand, legal research is best conceived as a multi-disciplinary field, consisting of a core discipline – doctrinal research – and various other types of mono-disciplinary and interdisciplinary research, the incorporation of other disciplines presents real difficulties. For legal academics engaged in socio-legal research, in particular, two problems arise: the practical problem of trying to address a legal professional and academic audience at the same time and the philosophical problem of trying to integrate the internal perspective of doctrinal research with the external perspective of other disciplines. In the final part of the article, these practical and philosophical difficulties are illustrated by reference to the author’s research on the politics of judicial review in new democracies.
Watch Out for the Under Toad: Role and Method of Interdisciplinary Contextualisation in Comparative Legal Research
Authors: Mak Elaine 
Published: November 2015

Watch Out for the Under Toad: Role and Method of Interdisciplinary Contextualisation in Comparative Legal Research
This article studies the significance of insights from non-legal disciplines (such as political science, economics, and sociology) for comparative legal research and the methodology connected with such ‘interdisciplinary contextualisation’. Based on a theoretical analysis concerning the nature and methodology of comparative law, the article demonstrates that contextualisation of the analysis of legal rules and case law is required for a meaningful comparison between legal systems. The challenges relating to this contextualisation are illustrated on the basis of a study of the judicial use of comparative legal analysis as a source of inspiration in the judgment of difficult cases. The insights obtained from the theoretical analysis and the example are combined in a final analysis concerning the role and method of interdisciplinary contextualisation in comparative legal analysis conducted by legal scholars and legal practitioners.