bluuebunny/crossref_metadata_2025_split huggingface dataset:
Neosuture formation after endoscope-assisted craniosynostosis repair
Authors: Salehi Afshin , Ott Katherine , Skolnick Gary B. , Nguyen Dennis C. , Naidoo Sybill D. , Kane Alex A. , Woo Albert S. , Patel Kamlesh B. , Smyth Matthew D. 
Published: April 2016

OBJECTIVE
The goal of this study was to identify the rate of neosuture formation in patients with craniosynostosis treated with endoscope-assisted strip craniectomy and investigate whether neosuture formation in sagittal craniosynostosis has an effect on postoperative calvarial shape.

METHODS
The authors retrospectively reviewed 166 cases of nonsyndromic craniosynostosis that underwent endoscope-assisted repair between 2006 and 2014. Preoperative and 1-year postoperative head CT scans were evaluated, and the rate of neosuture formation was calculated. Three-dimensional reconstructions of the CT data were used to measure cephalic index (CI) (ratio of head width and length) of patients with sagittal synostosis. Regression analysis was used to calculate significant differences between patients with and without neosuture accounting for age at surgery and preoperative CI.

RESULTS
Review of 96 patients revealed that some degree of neosuture development occurred in 23 patients (23.9%): 16 sagittal, 2 bilateral coronal, 4 unilateral coronal, and 1 lambdoid synostosis. Complete neosuture formation was seen in 14 of those 23 patients (9 of 16 sagittal, 1 of 2 bilateral coronal, 3 of 4 unilateral coronal, and 1 of 1 lambdoid). Mean pre- and postoperative CI in the complete sagittal neosuture group was 67.4% and 75.5%, respectively, and in the non-neosuture group was 69.8% and 74.4%, respectively. There was no statistically significant difference in the CI between the neosuture and fused suture groups preoperatively or 17 months postoperatively in patients with sagittal synostosis.

CONCLUSIONS
Neosuture development can occur after endoscope-assisted strip craniectomy and molding helmet therapy for patients with craniosynostosis. Although the authors did not detect a significant difference in calvarial shape postoperatively in the group with sagittal synostosis, the relevance of neosuture formation remains to be determined. Further studies are required to discover long-term outcomes comparing patients with and without neosuture formation.
Computed tomography–generated anthropometric measurements of orbital relationships in normal infants and children
Authors: Pool Garrett M. , Didier Ryne A. , Bardo Dianna , Selden Nathan R. , Kuang Anna A. 
Published: April 2016

OBJECTIVE
The aim of this study was to develop soft-tissue and bony anthropometric orbital measurements in a normal pediatric population based upon CT scans.

METHODS
This was a retrospective stratified study of children with ages ranging from birth to 36 months. Head CT images for 204 children were available and obtained with 0.625–1-mm slice widths. Soft-tissue and bone windows were reviewed. Images were oriented in the Frankfort horizontal plane, and the intercanthal (IC), bony interorbital (IO), and bony lateral orbital (LO) distances were measured. Age group stratifications were 0–3, > 3–6, > 6–9, > 9–12, > 12–18, > 18–24, > 24–30, and > 30–36 months. Patients with known syndromes or craniofacial abnormalities were excluded. Statistical analysis included the mean, SD, SEM, 95% CI, and an evaluation of IO:LO ratio.

RESULTS
There was an average of 25.5 patients in each age group (range 25–27 patients). All soft-tissue and bony measurements consistently showed rapid increase from 0–6 months of age, which tapered after age > 12 months. The mean IC, bony IO, and bony LO distances started at 22.22 ± 1.13 mm, 14.16 ± 0.74 mm, and 65.56 ± 1.76 mm, and at 12 months were 27.74 ± 1.01 mm, 16.21 ± 0.75 mm, and 77.98 ± 1.57 mm, respectively. The bony LO position was equivalent to the lateral canthal position and measurements. The IC distance was approximately one-third the lateral canthal distance for all age groups.

CONCLUSIONS
This study established and reported normal anthropometric orbital measurements in a pediatric population using fine-cut craniofacial CT. These measurements are essential when evaluating children with craniofacial anomalies.
Emergence of HCV Resistance-Associated Variants in Patients Failing Sofosbuvir-Based Regimens: An Observational Cohort
Authors: André-Garnier Elisabeth , Ribeyrol Olivier , Gournay Jerome , Besse Bernard , Coste-Burel Marianne , Mabille-Archambeaud Isabelle , Billaud Eric , Biron Charlotte , Pineau Solene , Raff François , Imbert-Marcille Berthe-Marie 
Published: April 2016

Background Real-life effectiveness data of new hepatitis C direct-acting antivirals are now required. The present study aims to assess the rate of sustained viral response (SVR) and virological failure (VF) in patients infected with chronic HCV treated with sofosbuvir (SOF)-based regimens in routine medical practice. Methods This observational study included a total of 106 patients infected with HCV genotypes (G)1–4, who initiated SOF-based regimens in 2014. Viral load was followed at baseline, week (W)2, W4, W12 (or W24) and W12 post-treatment. For all VFs, resistance-associated variants (RAVs) were determined at baseline and failure by sequencing of NS5A, NS5B and/or NS3 genes, using the Sanger method. Results SVR rate was 85% for the whole cohort, 91% for the patients who underwent the full treatment course. The distribution of HCV genotypes was as follows: G1 n=66 (1a=33, 1b=29; 62%), G2 n=8 (8%), G3a n=20 (19%) and G4 n=12 (11%). The main regimens used were SOF+daclatasvir (37%), SOF+ribavirin (33%), SOF+simeprevir (26%) and SOF+ledipasvir (3%). Twenty-five (23%) patients were HIV-coinfected and 1 was HBV-coinfected. Seventy (65%) patients had a prior treatment experience. All VF were relapses ( n=9): 3 G1a, 1 G2, 4 G3a and 1 G4, and mutations conferring resistance to NS5A inhibitors were found but none for NS5B polymerase inhibitors. Conclusions In a real-life context, the rate of SVR in DAA-treated HCV-infected patients is close to clinical Phase III trial results. RAVs emerged for all patients treated by the anti-NS5A daclatasvir, and persisted several weeks after the end of treatment.
Acceptability of Lopinavir/R Pellets (Minitabs), Tablets and Syrups in HIV-Infected Children
Authors: Kekitiinwa Adeodata , Musiime Victor , Thomason Margaret J , Mirembe Grace , Lallemant Marc , Nakalanzi Sarah , Baptiste David , Walker A Sarah , Gibb Diana M , Judd Ali 
Published: April 2016

Background Lopinavir/ritonavir ‘pellets’ were recently tentatively approved for licensing. We describe their acceptability for infants and children up to 48 weeks. Methods CHAPAS-2 was a randomized, two-period crossover trial comparing syrup and pellets in HIV-infected infants ( n=19, group A, aged 3–<12 months) and children ( n=26, group B, 1–<4 years) and tablets and pellets in older children ( n=32, group C, 4–<13 years) from two clinics (‘JCRC’, ‘PIDC’) in Uganda. At week 8, all groups chose which formulation to continue. Acceptability data were collected at weeks 0, 4, 8, 12 and 48. Results For groups A and B overall, the proportion preferring pellets increased between week 0 and week 12 and decreased at week 48 (group A 37%, 72%, 44%; group B 12%, 64% and 36%, respectively), although there were marked differences between clinics. For group C, pellets were progressively less preferred to tablets over time: 41%, 19% and 13% at weeks 0, 12 and 48, respectively. During follow-up unpleasant taste was similarly reported among young children taking pellets and syrups (37%/43% group A; 29%/26% group B), whereas among older children, pellets tasted worse than tablets (40%/2%). No participants reported problems with storage/transportation for pellets (0%/0%) unlike syrups (23%/13%). Conclusions For children <4 years, pellets were more acceptable at week 12 but not week 48. Clinic differences could refect bias among health-care workers for different formulations. Pellets taste similar to syrup, are easier to store and transport than syrup and represent an alternative formulation for young children unable to swallow tablets; improvements in taste and support for healthcare workers may help sustain acceptability.
Chine-Brésil, une comparaison instructive
Authors: Salama Pierre 
Published: April 2016

Pourquoi le taux d’investissement est élevé en Chine et faible au Brésil ? Pourquoi des comportements schumpétériens semblent s’affirmer en Chine et des comportements rentiers au Brésil ? Contrairement aux idées imposées – le fameux : « there is no alternative » de Thatcher –, comparer permet de comprendre que des alternatives existent, l’imagination se nourrissant de la comparaison. L’objet des développements qui suivent est de comprendre l’essor de la Chine et du Brésil dans les années 2000, les limites aujourd’hui de leurs modes de croissance et d’imaginer enfin les alternatives possibles, en tenant compte des conflits entre les classes sociales et en leur sein.
2.5D / 3D IC Landscape: Market and Technology Trends
Authors: Ivankovic Andrej , Buisson Thibault , Pizzagalli Amandine , Towne Dave , Beica Rozalia 
Published: April 2016

The semiconductor industry is facing a new era in which device scaling and cost reduction will not continue on the path they followed for the past few decades, with Moore's law in its foundation. Advanced nodes do not bring the desired cost benefit anymore and R&D investments in new lithography solutions and devices below 10nm nodes are rising substantially. In order to answer market demands, the industry seeks further performance and functionality boosts in integration. While scaling options remain uncertain and continue to be investigated, the spotlight is turning to advanced packages. Emerging packages such as fan-out wafer level packages and 2.5D / 3D IC solutions together with upgraded flip chip BGAs aim to revive the cost/performance curve and extend both scaling and functionality roadmaps.
Future packages need to tackle the explosion in information exchange translating to high number of I/Os and be able to support heterogeneous integration. This puts particular pressure on die to board interconnects. Technologies to fill the void created in diverging PCB versus IC feature sizes are constantly under development. Three-dimensional (3D) technology using the well-known Through Silicon Via (TSV) interconnect, considered today the most advanced technology, is one emerging option that aims to enable heterogeneous integration. Such a technology is not limited to CMOS scaling in itself, it is rather based on bringing more functionality by stacking different type of devices (Logic, Memory, Analog, MEMS, Passive components…) while reducing the package form factor. This functional diversification is also known as More-than-Moore.
This work focuses on the analysis of recent developments and future trends of the 2.5D / 3D IC landscape. What's new since last year? TSV technology has already been utilized for several years within the MEMS and CMOS image sensor (CIS) market, but the news is that it finally seems to be happening within the logic and memory domain. Latest products such as AMD Radeon R9 Fury with its 2.5D configuration including HBM stacks and Samsung 3D TSV stacked DRAM, among others, aim for high volume. Fueled by consumer applications such as smartphones and tablets, the MEMS and CIS markets are expected to exhibit continuous growth over the next several years, while in the high-end market, driven by the need for further performance increase, volatile memory and especially DRAM are finally opening the doors of 2.5D / 3D IC commercial adoption.
This analysis will cover 2.5D interposer & 3DIC platforms as well as MEMS and CIS TSV packaging. Market forecasts in terms of wafer starts, market revenue, application segments and end-products will be presented. Furthermore, supply chain activities and major player interactions will be analyzed and 3D integration technology roadmaps will be reviewed. In conclusion, this study will aim at providing comprehensive insight into 2.5D / 3D IC market and technology trends.
Advancements in Glass for Packaging Applications
Authors: Adriance Kevin , Smith Gene , Shorey Aric , Lu Rachel , Smith Gene 
Published: April 2016

Glass provides many opportunities for advanced packaging. The most obvious advantage is given by the material properties. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion gives advantages to manage warp in glass core substrates and bonded stacks for both through glass vias (TGV) and carrier applications. Glass also gives advantages for developing cost effective solutions. Glass forming processes allow the potential to both form in panel format as well as to at thicknesses as low as 100 um, giving opportunities to optimize or eliminate current manufacturing methods.
As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and via/surface metallization. Of particular interest is the ability to leverage tool sets and processes for panel fabrication to enable cost structures desired by the industry. By utilizing the stiffness and adjustable CTE of glass substrates, as well as continuously reducing via size that can be made in a panel format, opportunities to manufacture glass TGV substrates in a panel format increase. We will provide an update on advancements in these areas as well as handling techniques to achieve desired process flows. We will also provide the latest demonstrations of electrical, thermal and mechanical reliability.
Embedded Die Packages and Modules for Power Electronics Applications
Authors: Boettcher Lars , Karaszkiewicz S. , Manessis D. , Ostmann A. 
Published: April 2016

Packages and modules with embedded semiconductor dies are of interest for various application fields and power classes. First packages in the lower power range are available in volume production since almost six years. Recent developments focus on medium and higher power applications raging over 500W into the kW range.
Different approaches are available to realize such packages and modules. This paper will give an overview and detailed description of the latest approaches for such embedded die structures.
In common of all of these approaches, is the use of laminate based die embedding, which uses standard PCB manufacturing technologies. Main differences are the used base substrate, which can still be a ceramic (DBC), Cu leadframe or high current substrate. Examples for the different methods will be given.
As the main part, this paper will describe concepts, which enable significant smaller form-factor of power electronics modules, thereby allowing for lower price, high reliability, capability of direct mounting on e.g. a motor so as to form one unit with the motor housing, wide switching frequency range (for large application field) and high power efficiency.
The innovative character of this packaging concept is the idea to embed the power drive components (IGBTs, MOSFETs, diode) as thinned chips into epoxy-resin layer built-up and to realize large-area interconnections on both sides by direct copper plating the dies to form a conductor structure with lowest possible electrical impedance and to achieve an optimum heat removal. In this way a thin core is formed on a large panel format which is called Embedded Power Core. The paper will specifically highlight the first results on manufacturing an embedded power discrete package as an example of an embedded power core containing a thin rectifier diode. For module realization, the power cores are interconnected to insulated metal substrates (IMS) by the use of Ag sintering interconnection technologies for the final manufacturing of Power modules.
The paper will elaborate on the sintering process for Power Core/IMS interconnections, the microscopically features of the sintered interfaces, and the lateral filling of the sintering gap with epoxy prepregs.
Firstly, 500W power modules were manufactured using this approach. Reliability testing results, solder reflow testing, temperature cycling test and active power cycling, will be discussed in detail.
A community-based case–control study of prevalence and pattern of cognitive impairments in patients with epilepsy residing in South-Eastern Nigeria
Authors: Arinzechi Eugene O. , Ogunrin Olubunmi A. , Nwosu Cosmas M. , Nwani Paul O. , Enwereji Kelechi O. , Asomugha Lasbrey A. , Dimkpa Uche 
Published: April 2016

ABSTRACT
Background: Epilepsy is the commonest neurological disorder encountered in Sub-Saharan Africa. The quality of life of patients with epilepsy (PWEs) is adversely affected by cognitive impairments. Aim: This study investigated the prevalence and pattern of cognitive impairments in PWE in Ukpo community located in a South-Eastern state in Nigeria using Community Screening Interview for Dementia (CSID) and a computer-assisted cognitive test battery (FePsy). Methods and Patients: Fifty-one PWEs were studied and compared with 51 age-, sex-and level of education-matched healthy controls. Diagnosis of epilepsy was confirmed clinically with eye-witness corroboration. Sociodemographic data and information on epilepsy variables were obtained with the aid of a questionnaire. Cognitive domains assessed include language, memory, orientation, attention, psychomotor speed and constructional praxis. Results: The prevalence rate of cognitive impairment using total CSID score was 19.6%. Analysis of CSID scores revealed significant impairment in language (17.6%), memory (29.4%), orientation (15.7%), attention (7.8%) and constructional praxis (15.7%) compared to healthy controls. A similar pattern was observed with FePsy but with better sensitivity indices for detecting cognitive impairment. Conclusion: This study indicated significant prevalence rate of cognitive impairment among treatment-naïve PWE with profound affectation of memory, mental speed and language. In addition, the FePsy was found to be more sensitive and specific in assessment of cognitive function in PWE.
Knowledge, attitude, and practice of people toward epilepsy in a South Indian village
Authors: Krishnaiah Balaji , Alwar Seenivasan P. , Ranganathan Lakshmi N. 
Published: April 2016

ABSTRACT
Introduction: People living with epilepsy continue to suffer from enacted or perceived stigma that is based on myths, misconceptions, and misunderstandings that have persisted for many years. In the last decade, there has been an increase in individual literacy rate and increased access to technology in rural population. However, it is unclear if this has any effect on knowledge, attitude, and practice (KAP) attitude toward epilepsy. Objective: Our primary aim is to evaluate KAP toward epilepsy. In addition, we also estimated the prevalence of stroke and epilepsy in rural South India. Materials and Methods: Using a 14-item questionnaire, we assessed KAP toward epilepsy and identified determinants of inappropriate attitudes toward people with epilepsy and 10-item questionnaires to assess the prevalence of epilepsy and stroke among 500 randomly selected populations in a Pattaravakkam village (Tamil Nadu, India). Results: About 87.7% of the people had heard or read about epilepsy. Negative attitudes appeared to be reinforced by beliefs that epilepsy is hereditary (23.1%), kind of insanity (22.6%), or as contagious (12.0%). The knowledge about the clinical characteristics and first aid to a person during a seizure was 25.8%. About 36.5% of people think that society discriminates people with epilepsy. Moreover, our prevalence study showed that 8.7% people are suffering from epilepsy and 3.7% had stroke previously and at the day of survey, the stroke prevalence is 3.3%. Conclusion: Even with increased literacy, technology, and communication devices, the KAP of people toward epilepsy is relatively low. General public education campaigns and specific school education campaigns children should be encouraged to increase the KAP toward epilepsy. The prevalence and pattern of epilepsy and stroke is on the higher side in the village of Pattaravakkam. Future research regarding the value of targeted education in improving KAP will be worthwhile.
An Invitation to Performative Research
Authors: Douglas Kitrina , Carless David 
Published: April 2016

Across the social sciences there has been a growing interest in arts-based and performative methodologies. Over the past decade we have created a number of research based performances utilising songs, poems and stories. Alongside these, we have also begun to explore the potential of this work through conducting further research which analyses responses from different audiences (lay and academic) to each performance. In this article we reflect some of the core reasons that underscore performative methodologies. The case we progress is that performative methodologies provide (a) a different way of ‘coming to know,’ (b) inclusive form of representation, (c) an experience, (d) a blurring the self-other divide, and (e) an alternative vision. We hope the discussion fosters a continued interest in and a greater understanding of what performative approaches might contribute as well as providing an invitation to others explore the potential of performative methodologies within their own research practice.
In the Studio: Researcher Subjectivity, the Infant Observation Method, and Researching Creative Practices
Authors: Carabine Jean 
Published: April 2016

The material for this article is taken from a psychoanalytically informed psychosocial pilot – Creative Practices and Processes that explores ‘what makes creativity possible?’ The aim of the pilot was to develop a methodology and methods that permitted an in-depth understanding of the social, psychological and material factors that facilitate creativity. The study is informed by a broadly post-Kleinian British Object Relations approach which privileges personal experience, unconscious dynamics, and the relationship between inner and outer worlds. The focus here is with the adaptation and innovative use of psychoanalytic infant observation as a psychosocial research method of ‘being with’ an artist in such a way as to gain a deep understanding of the unconscious dynamics, physical and material, spatial and temporal, and embodied experiences of creative processes and practice. The article considers the potential of psychoanalytic infant observation as a research method for informing us about creative practices and processes. The rich detail of the data is also explored for what it tells us about the research process and relationships. A key principle of infant observation is the importance of a ‘form of knowing imbued with emotional depth’ (Hollway 2012: 25) and the use of the observer's subjectivity. The article illustrates how when the researcher's subjectivity is utilised as a research tool and the researcher is open to the affective experiencing of the research process, looking and observing are not simple or straightforward research activities. Rather, we can see that they are activities that generate emotional responses, conflict, uncertainty, unease and not knowing. Using the first artist observation as an example, the research dynamics the observation are seen as involving a series of negotiations, enactments and explorations around boundaries, looking and being seen, what to observe, roles, the nature of the research and, anxiety.