bluuebunny/crossref_metadata_2025_split huggingface dataset:
“Douce France” par Carte de Séjour. Le cri du “Beur” ?
Authors: Hanus Philippe 
Published: November 2015

La musique du groupe Carte de Séjour (Rachid Taha), fondé en 1980 dans l'agglomération lyonnaise, peut être analysée comme « un cri du Beur », c'est-à-dire une prise de parole radicale de jeunes franco-maghrébins, adeptes de ce qu'on appelle « rock arabe ». Le braconnage de la langue et des sons (métissage entre reggae, punk rock et musiques méditerranéennes) est au cœur de l'aventure de cet ensemble musical à géométrie variable, mêlant sonorités électriques et instrumentations traditionnelles du Maghreb. En étudiant les conditions d'émergence d'un dispositif de création artistique protestataire – contemporain des luttes pour la reconnaissance des enfants d'immigrés nord-africains dans la société française, telles que la Marche pour l'égalité et contre le racisme de 1983 – interrogeant les appartenances sociales ou ethniques, l'aventure de Carte de Séjour exprime, durant la décennie 1980-1990, une forme originale de création musicale et de résistance aux assignations identitaires.
Georges Moustaki, « La Marseillaise » et l’air du Pirée
Authors: Sintès Pierre 
Published: November 2015

Au cours de sa longue carrière, Georges Moustaki était réputé pour être grec, sans pour autant que cette affirmation ne soit vraiment questionnée. Pourtant, les contours de cette grécité supposée ne sont pas toujours évidents à identifier. Pour mesurer la réalité des relations entre Georges Moustaki et la Grèce, ce texte propose d’examiner la trajectoire familiale de l’artiste autant que son parcours de citoyen et d’artiste, mais aussi le contexte social et idéologique dans lequel sa carrière s’est réalisée et qui peut sembler être déterminant à plus d’un titre dans les différents discours d’identification qui l’ont entouré. Pour cela, le propos se fonde sur un corpus de chansons et d’interviews données par le chanteur ainsi que sur les quelques ouvrages consacrés à sa vie. Dans cet ensemble de sources, la Grèce apparaît souvent sous un jour paradoxal : tout à la fois terre des racines revendiquées, parfois explicitement, et lieu d’origines rêvées, imaginées, fantasmées, ou encore mobilisées en fonction de différents contextes de l’entretien à proprement parler et des périodes de la vie de l’artiste.
The Growth of Advanced Packaging: An Overview of the Latest Technology Developments, Applications and Market Trends
Authors: Beica R. , Ivankovic A. , Buisson T. , Kumar S. , Azemar J. 
Published: November 2015

The semiconductor industry, for more than five decades, has followed Moore's law and was driven by miniaturization of the transistors, scaling the CMOS technology to smaller and more advanced technology nodes while, at the same time, reducing the cost. The industry is reaching now limitations in continuing this scaling process in cost effective way. While technology nodes continue to be developed and innovative solutions are being proposed, the investment required to bring such technologies to production are significantly increasing. To overcome these limitations, new packaging technologies have been developed, enabling integration of more performing as well as various type of devices within the same package.
This paper will provide an overview of current trends seen in the industry across all the packaging platforms (WLCSP1, FanOut2, Embedded Die2, Flip Chip3 and 3DIC4). Challenges, applications, positioning of the different packaging technologies by market segments (from low end to high end applications) and changes of the markets and drivers, growth rates and roadmaps will be presented. Global capacities and demands and the landscape of the packaging industry will be reviewed. Examples of teardowns to illustrate the latest packaging techniques for various devices used in latest products will be included.
System on film type substrates: processes, structure and real modules
Authors: Yang Chih Kuang 
Published: November 2015

2 real modules made by film type substrate are introduced in this article. For the first example module, a micro-processing module included 1 GHz microprocessor, LPDDR SDRAM/NAND flash combo memory and power management IC are packaged in one single module by using a 6-layer film type substrate. With small size (20×17 mm) and functions for HD resolution video and multimedia, this module has been used in smart watches and multimedia devices. The substrate in the first module has 2000 IOs and 6 layers with only 70um thickness.
For the second example module, a low power microprocessor and a Bluetooth 4.0 dual mode chip are packaged in one module by using 4-layer film type substrate. With tiny size (9.5×7.3mm) and the function for managing sensors and low power wireless communication, this module has been used in various IoT devices. In this article, the process of the film type substrate and the assembly process of the modules are also shown and discussed. We disclose the novel packaging structure as called system on film (SoFi). Our system on film (SoFi) is a packaging platform by using our film type substrate. As previous examples showed, system on film (SoFi) can miniaturize high performance modules and be applied in IoT devices very well.
Embedded solutions: Fan-out and Embedded Die Packages market and technology trends
Authors: Azémar Jérôme 
Published: November 2015

Embedded packages are nowadays not anymore just an interesting approach for some specific application. Benefiting from 3D TSV high cost, and consequently delays, these packages could fit the high expectations of the industry. Indeed, added value of embedded packages in terms of integration, reliability and even cost at system level is already clear for manufacturers. Embedded packages lacked success until 2013–2014 because of long time of qualification, few players involved and customer convincing time. The situation changed with new product announcements and strong involvement of some key players. In this presentation we will focus on two main types of embedded packages, those that are most of interest at the moment: Fan-Out and Embedded Dies packages.
The principle of Fan Out technology is to embed products in a molded compound and allow redistribution layers pitch to be independent from die size. This approach is already mature enough to have high volume products claimed by Nanium and Stats ChipPAC using eWLB type of Fan-Out. Market for Fan-Out packages in 2014 almost reached $200M and a 20% growth for the coming years is expected. Understanding the potential of that market and the high demand from telecom industry for a thin and cheap package, other important OSATs like SPIL or J-Devices are willing to enter the market with their own technologies. TSMC is also proposing its inFO process to its customers, confirming that foundries could look at the OSATs reserved market through wafer-level packages. Each player has its own view on how to gain market share and meet the challenges such as cost reduction, panel manufacturing, yield improvement, die shift…
The principle of Embedded die packages has the same purpose of promoting high integration due to placing chips within the substrate but with a different approach: Embedding is done in laminate substrates. This process is pushed by PCB manufacturers such as AT&S and could create a new supply chain with new players. One of the main advantages is to use a mature and cheap manufacturing chain created for PCB manufacturing and then having low cost for a technology that would allow a good integration and access to both sides of the chips easily. On the other hand, Embedded Die technologies are still waiting for a high volume project that shall be coming once higher yield, better resolution and clarification of the supply chain will be achieved. In this presentation we will describe what the strategies to reach that goal are.
Both technologies seem to be competing but are actually complementary and often targeting different markets. Key customers already qualified them and will open the gates for the fast growing packaging market. The presentation will provide an overview of the products announcements, commercialization roadmaps as well as market forecasts per application. Insights and trends into the different fan-out and embedded die packaging approaches by applications, business models and major players will be reviewed.
A metal oxide adhesion layer prepared with water based coating solution for wet Cu metallization of glass interposer
Authors: Liu Zhiming , Hunegnaw Sara , Fu Hailuo , Wang Jun , Magaya Tafadzwa , Merschky Michael , Bernhard Tobias , Shorey Aric , Yun Hobie 
Published: November 2015

Inorganic interposers made of glass are attractive for advanced high frequency applications and ultra- fine line patterning technology. Because glass combines a couple of benefits like large form factor, good coefficient of thermal expansion (CTE) matching to silicon, smooth surface and a low dielectric constant and loss tangent.
Recently much progress has been made with respect to glass electrical and physical properties. This allows for handling of thin glass sheets down to 100 μm in a typical PCB panel format. Also advances have been made in the area of laser drilling allowing aspect ratio up to 1:10 for 25 μm diameter of through glass via (TGV). Another major challenge is the cost competitive and reliable metallization of smooth glass, a critical prerequisite for the use of glass substrates in the electronic packaging market. Plated copper does not adhere directly to glass. Sputtering technology typically also requires a 50 nm thick adhesion promoting metal layer (like Ti) before copper can be seeded. This metal layer could not be etched together with the copper and needs to be removed between traces by etching in an additional step.
A volatile flammable solvent based metal oxide precursor coating solution has been used to make an adhesive metal oxide layer by a modified sol-gel process. To prevent potential safety issue for mass production water based metal oxide precursor coating solution so called VitroCoat GI W has been developed. The VitroCoat GI W solution can be dip-coated on flat glass surface and TGVs followed by sintering to form an ultrathin metal oxide adhesion layer (about 10nm). The thin adhesive layer enables electroless and electrolytic copper plating directly onto glass substrates without changing any of the glass properties or impacting high frequency performance. The thin metal oxide adhesive layer is non-conductive and can be easily removed from the area between circuit traces.
This paper will focus on the coating uniformity and capability of VitroCoat GI W on flat glass surface and TGVs and the adhesion of wet chemical metallization on glass interposer. This adhesion layer can be used for copper fine line patterning on glass and radio frequency (RF) device fabrication.
Hermetically Sealed Glass Packages
Authors: Keusseyan Roupen , Mobley Tim 
Published: November 2015

Significant advances have been accomplished in the field of Through Glass Via (TGV) technology; enabling a new generation of electronic designs that achieve higher performance, while leveraging low cost system solutions.
Through-hole creation methods in glass have been optimized for mass production with consistent via diameter, shape and wall chemistry/morphology. This has enabled the development of unique copper via metallization materials that exhibit very high conductivity, thermal expansion matching (with borosilicate glass) and hermeticity in the 10E-10 Atm.cc/sec range (Ultra-High Vacuum Hermeticity).
Further developments in Chemical Mechanical Polishing (CMP) for glass wafers with copper vias, surface sensitization and metal deposition techniques, have enabled thin film metallization on both sides of the glass wafer for fine line redistribution layers (RDL). The thin film RDL is compatible with the TGV with excellent continuity in conductivity. The RDL metallization is plated to allow flip chip, land grid array, wire-bond, solder, or other interconnection methods.
The paper will discuss the technical, material and process challenges in each of the areas mentioned above which enable a hermetically sealed glass package. Detailed data and experimental results will be discussed.
Critical Barriers Associated with Copper Wire
Authors: Crockett William G. 
Published: November 2015

Since around 2008, the shift from Gold (Au) bonding wire to Copper (Cu) bonding wire has been taking place, full scale, with the aim of reducing costs. When compared with Au, Cu wire presents challenges in reliability and repeatable bonding characteristics in terms of chemical stability, which is required in high reliability applications. Therefore Cu wire adoption in automotive and industrial semiconductors has been limited. Conventionally the market for Cu bonding wires has been divided into two types: bare Cu wires (high purity) and Palladium coated copper (PCC) bonding wires. These wires have yet to satisfy the required characteristics for high reliability products such as industrial and automotive electronics.
A new breed of alternative bonding wires has been developed to offer performance advantages for high reliability applications compared to bare copper wire and PCC wire. Cu alloy wire and Ag alloy wires continue their market introduction for advanced bonding applications, where bare Cu and PCC wires have known limitations.
Clinical Approaches to Vascular Anomalies of the Lip
Authors: Ryu Jeong Yeop , Lee Joon Seok , Lee Jeong Woo , Choi Kang Young , Yang Jung Dug , Cho Byung Chae , Lee Seok-Jong , Lee Jong Min , Huh Seung , Chung Ho Yun 
Published: November 2015

Background The incidence of vascular anomalies in the head and neck is higher than in the extremities. It is especially common for vascular anomalies to involve the lip. The lips are a functionally and aesthetically important component of the head and neck area. A retrospective analysis of data from our vascular anomaly center was performed in order to understand the characteristics and treatment requirements of vascular anomalies of the lip and to establish which treatments are likely to lead to the best outcomes.
Methods A retrospective review was performed of the medical records of patients diagnosed with vascular anomalies of the upper or lower lip from January 2001 to September 2013. Using clinical photographs, radiologic findings, and patient records, the diagnosis of each case and the location of the vascular anomaly were recorded, along with information about treatment and follow-up.
Results A total of 1,606 patients were diagnosed with vascular anomalies over this time period, of whom 127 (7.9%) were found to have vascular anomalies in the lip only. Surgical treatment with or without embolization, sclerotherapy, laser therapy, medication only, and observation were the treatment strategies adopted in these cases.
Conclusions Vascular anomalies of the lip should be diagnosed accurately. Radiologic diagnosis played a crucial role in treatment planning, and several techniques were used to treat vascular anomalies of the lip. When surgical excision is indicated for the correction of vascular anomalies of the lip, the aesthetic and functional characteristics of the lip should be considered.
Botulinum Toxin Therapy versus Anterior Belly of Digastric Transfer in the Management of Marginal Mandibular Branch of the Facial Nerve Palsy: A Patient Satisfaction Survey
Authors: Butler Daniel P , Leckenby Jo I , Miranda Ben H , Grobbelaar Adriaan O 
Published: November 2015

Background Botulinum toxin (BT) chemodenervation and anterior belly of digastric muscle (ABD) transfer are both treatment options in the management of an isolated marginal mandibular branch of the facial nerve (MMB) palsy. We compare the patient satisfaction following either BT injections or ABD transfer in the management of their isolated MMB palsy.
Methods Patients in the ABD-arm of the study were identified retrospectively from September 2007 to July 2014. The patients in the BT-arm of the study were identified prospectively from those attending the clinic. Both groups of patients completed a validated patient satisfaction survey. Statistical analysis was performed and a P-value <0.05 was considered statistically significant.
Results Seven patients were in the ABD-arm and 11 patients in the BT-arm of the study. The patient satisfaction in both groups was high with 45% of ABD-arm patients and 40% of BT-arm patients rating their overall outcome as 'better' or 'much better', which was significantly more than the proportion rating their outcome as 'worse' or 'much worse' (P<0.001), although there was a significant trend towards those in the ABD-arm being more likely to be dissatisfied with their outcome (P=0.01).
Conclusions BT therapy is a good first-line intervention in the management of isolated MMB palsy. We have, however, shown that the overall satisfaction in both groups is high. Therefore, in patients who would prefer a more permanent solution to manage their facial asymmetry, ABD transfer remains a satisfactory treatment option with a good level of patient satisfaction.
Two-Step Incision for Periarterial Sympathectomy of the Hand
Authors: Jeon Seung Bae , Ahn Hee Chang , Ahn Yong Su , Choi Matthew Seung Suk 
Published: November 2015

Background Surgical scars on the palmar surface of the hand may lead to functional and also aesthetic and psychological consequences. The objective of this study was to introduce a new incision technique for periarterial sympathectomy of the hand and to compare the results of the new two-step incision technique with those of a Koman incision by using an objective questionnaire.
Methods A total of 40 patients (17 men and 23 women) with intractable Raynaud's disease or syndrome underwent surgery in our hospital, conducted by a single surgeon, between January 2008 and January 2013. Patients who had undergone extended sympathectomy or vessel graft were excluded. Clinical evaluation of postoperative scars was performed in both groups one year after surgery using the patient and observer scar assessment scale (POSAS) and the Wake Forest University rating scale.
Results The total patient score was 8.59 (range, 6-15) in the two-step incision group and 9.62 (range, 7-18) in the Koman incision group. A significant difference was found between the groups in the total PS score (P-value=0.034) but not in the total observer score. Our analysis found no significant difference in preoperative and postoperative Wake Forest University rating scale scores between the two-step and Koman incision groups. The time required for recovery prior to returning to work after surgery was shorter in the two-step incision group, with a mean of 29.48 days in the two-step incision group and 34.15 days in the Koman incision group (P=0.03).
Conclusions Compared to the Koman incision, the new two-step incision technique provides better aesthetic results, similar symptom improvement, and a reduction in the recovery time required before returning to work. Furthermore, this incision allows the surgeon to access a wide surgical field and a sufficient exposure of anatomical structures.
Stabilizing Morbidity and Predicting the Aesthetic Results of Radial Forearm Free Flap Donor Sites
Authors: Yun Tae Kyoung , Yoon Eul Sik , Ahn Duck Sun , Park Seung Ha , Lee Byung Il , Kim Hyon Surk , You Hi Jin 
Published: November 2015

Background The radial forearm flap is a versatile, widely used flap. However, the possibility of donor site complications has led to concern over its use. Some surgeons prefer using other flaps whose donor sites can be closed primarily with less morbidity, including avoiding unpleasant scarring. However, in our experience, donor site stability of the radial forearm flap can be reliably achieved by using well-implemented specific procedures. Here, we present a collection of donor site cases of the radial forearm flap and investigate factors that affect the aesthetic results as the basis for a reference for selecting a radial forearm flap.
Methods In this retrospective study, we reviewed 171 cases in which a radial forearm flap was used for free tissue transfer after resecting head and neck cancer. We focused on donor site morbidity rates. Each operation involved a detailed procedure designed to minimize donor site morbidity. Moreover, statistical investigations were conducted for 22 cases to determine factors affecting the scar appearance.
Results Only one case developed total skin graft necrosis as a major complication. Scar-related aesthetic results were acceptable, and the body-mass index, body weight, diabetes, and cardiac problems were significant factors related to the appearance of scars.
Conclusions Performing the radial forearm flap using a well-implemented detailed technique helps achieve acceptable donor site morbidity results. The aesthetic results were more promising for patients without excess body weight, diabetes, or cardiac problems. Therefore, anxiety about donor site morbidity should not be a reason to avoid selecting the radial forearm flap in suitable patients.
A Proposed Architecture of Cloud Computing for Teaching and Education
Authors: Mehdi Wasan 
Published: November 2015

AbstractWorld of Many CloudsThe first question will be asked is how can cloud computing enhance the learning experience? One way is by providing on-demand access to educational content, resources, and services, on any device, whenever and wherever teachers and students happen to be. The new world of cloud-based services combines powerful computing, networking, storage, management tools, and applications to make it easier than ever to bridge the in-school and online learning worlds with secure, on-demand services. With cloud services, educators can take advantage of an interconnected world of many clouds to support individual learning needs, expand access to digital content, and innovative cloud services into an integrated architecture that helps educators deliver highly secure, cloud-based services simplify operations, and reduce costs. Implementing a cloud solution means bringing together computing, network, and storage resources into an integrated platform for delivering IT services within and between data canters. Cloud computing can help us to create a platform for delivering cloud services to teachers, administrators, and students, and can also assist us to connect with other clouds and automate management tasks.In this research work we are introducing our architecture of Cloud Computing for education and discuss the impact of our chosen architecture on learning.We are presenting here and demonstrating the advantages and impact analysis of our proposed architecture.