bluuebunny/crossref_metadata_2025_split huggingface dataset:
Pendekatan Story Telling Dalam Pembelajaran Dokkai: Penelitian Terhadap Mahasiswa Jurusan Pendidikan Bahasa Jepang
Authors: Juangsih Juju 
Published: April 2016

The research was conducted in accordance with the phenomenon occurred in Dokkai learning in which the students show lack understanding on reading. The aims of the research are: (1) to obtain clear description of the findings comprehensively about the reality in Dokkai learning of the students of JPBJ FPBS UPI as the learning goals through the story telling approach; (2) to figure out the difficulties and factors influencing the low level of understanding Japanese reading (Dokkai). The population of the research is the third semester students of Japanese Education Department FPBS UPI Bandung as 19 students taken randomly from Chuukyuu Dokkai I course. Qualitative method is employed using quasi experimental design. Thus, in the research, there is no control group as the comparing class. From the result of data analysis, we find that (1) according to the questionnaire result, 90% of the respondents respond that the story telling approach in Dokkai course is interesting; (2) the students must be able to comprehend the reading text and then retell it; (3) the class becomes more active and effective.
Selecting the Correct Model for Project Evaluation: Comment on Impact of Sustainable Soil Management Practices on Household Food Security In Ramechhap District, Nepal
Authors: Pokharel Krishna Prasad 
Published: April 2016

Conservation practices such as sustainable soil management (SSM) and no-tillage may increase production and productivity, which may help reduce food insecurity in household levels. Koirala et al. (2014) showed that the SSM practices have a high positive impact on food security and income in Ramechhap, Nepal. However, the impact of the SSM practices on food security and income were highly overestimated. Further, they did not explain how the impact of other factors on household food security and income are held constant to evaluate the impact of the SSM practices. This paper argues that the estimate of the impact of SSM practices on food security by Koirala et al. (2014) is highly upward biased due to the same unobserved factors affecting participation on the SSM practices and food security. This study shows an alternative method: an endogenous treatment effects model, which correctly estimates the impact of the SSM practices on food security. In addition, some issues that may affect food security and income measures associating with data collection are discussed. Int. J. Soc. Sci. Manage. Vol-3, issue-2: 81-86
Marketing Communication Mix of Government of Rajasthan for Various Healthcare and Family Welfare Schemes: A Case Study of Western Rural Rajasthan
Authors: Kalla Neelam 
Published: April 2016

For a marketing professional both promotion and communications are essential. In fact, without effective marketing communications the consumer stay uninformed of products and services they need, which can be satisfying their needs and necessities competently. Past researches show that the key factor behind the failure to implement the schemes effectively is lack of awareness among the potential beneficiaries. In the present study research has undertaken an endeavor to analyze the prevailing means and channels of communication and investigate their effectiveness. The paper discusses the effectiveness of various communication channels, and agents operating in rural areas of western Rajasthan for government healthcare and welfare schemes. The paper also discusses the strategic interventions and the necessary changes based on results of study which need to be incorporated to enhance the effectiveness of communication mix of Government programs. Int. J. Soc. Sci. Manage. Vol-3, issue-2: 135-140
Growth kinetics of boride layers formed on GGG 40.3 ductile iron
Authors: Ünal Fatma , Topuz Ahmet 
Published: April 2016

Abstract
In this study, kinetics of boride layers formed on the surface of ferritic GGG 40.3 ductile iron were investigated by conducting a series of experiments in Ekabor I powder at 850, 900 and 950 °C treatment temperature for 1, 2 and 4 h by using Ekabor I powder. Also, box boronizing was carried out at 950 °C for 4 h with Ekabor II powder to investigate effect of powder size. At the same time, it has been investigated whether or not iron boride layers were obtained using different powder mixtures instead of commercial powder (SiC + KBF4 + B4C). Also, the 85 wt.-% B4C + 15 wt.-% Na2CO3 powder mixture has been used. The study was aimed to inhibit the release of fluorine gas and to perform environmentally friendly working. After the experiments, it turned out that the depth of boride layers depending on treatment temperature and time ranged from 38 to 198 μm. The presence of borides were confirmed by X-ray diffraction, optical microscopy and scanning electron microscopy. A saw tooth shape morphology of boride layers has been detected in optical microscopy and scanning electron microscopy.
Tribological behavior of Al2O3 and B4C particle-reinforced copper matrix investigated by the Taguchi method
Authors: Şahin Yusuf , Öksüz K. Emre 
Published: April 2016

Abstract
There are many technical applications in which wear is a critical issue. Copper can be filled with particulate materials to enhance the tribological behavior, mechanical and physical properties as well. Copper matrix containing 10 vol.-% Al2O3 and B4C particles were produced using the powder metallurgy method and their dry wear behavior was investigated at different sliding conditions against a hardened alloy steel counterface using Taguchi technique. Four control factors like lubrication, load, sliding distance and hardness were designed in a L18 factorial orthogonal array for the experiments to investigate the wear behavior of the metal matrix composites. Moreover, a correlation derived from the results of Taguchi experimental design was proposed, resulting in a predictive equation for estimation of these properties. The experimental results showed that the weight loss was highly influenced by the lubrication factor, followed by the load factor. However, these were then followed by hardness and sliding distance. The estimated weight loss was calculated and a good agreement was observed between the predicted and actual weight loss at a confidence level of 90%. The wear resistance was significantly better for B4C particle-reinforced composites than that for the Al2O3 particle-reinforced composites. Moreover, the results were approved by scanning electron microscope micrographs of worn surfaces of the samples.
HST STIS OBSERVATIONS OF THE MIXING LAYER IN THE CAT’S EYE NEBULA*
Authors: Fang Xuan , Guerrero Martín A. , Toalá Jesús A. , Chu You-Hua , Gruendl Robert A. 
Published: April 2016

ABSTRACT
Planetary nebulae (PNe) are expected to have a ∼105 K interface layer between the

≥

106 K inner hot bubble and the ∼104 K optical nebular shell. The PN structure and evolution, and the X-ray emission, depend critically on the efficiency of the mixing of material at this interface layer. However, neither its location nor its spatial extent have ever been determined. Using high-spatial resolution HST STIS spectroscopic observations of the N v

λ
λ

1239,1243 lines in the Cat’s Eye Nebula (NGC 6543), we have detected this interface layer and determined its location, extent, and physical properties for the first time in a PN. We confirm that this interface layer, as revealed by the spatial distribution of the N v
λ1239 line emission, is located between the hot bubble and the optical nebular shell. We estimate a thickness of

1.5
×

10

16

cm and an electron density of ∼200 cm−3 for the mixing layer. With a thermal pressure of ∼2 × 10−8 dyn cm−2, the mixing layer is in pressure equilibrium with the hot bubble and ionized nebular rim of NGC 6543.
Penser en accord avec soi-même
Authors: Smilevitch Eric 
Published: April 2016

Il est acquis qu’un sujet est légalement responsable de ses actes et de ses discours, pour autant qu’ils portent socialement ou politiquement à conséquence. C’est l’unique forme de responsabilité que reconnaît le monde contemporain, formé à l’autorité de la loi. L’idée kantienne qu’il existe des « commandements » intellectuels est d’une autre teneur. Elle pose le principe d’une souveraineté spirituelle et non légale. Pour autant que, de ce que l’on pense, résulte toujours quelque conséquence, un sujet se voit enjoint de tirer jusqu’aux dernières implications de sa pensée. Soumis à la seule loi de son esprit, il est convoqué à l’exercice d’une pensée « conséquente ». Façon de dire qu’une pensée doit forcément rendre aussi quelque compte. Mais à qui ? Et que signifie « à soi-même » ?
Le contournement de la loi est-il hypocrite ?
Authors: Goltzberg Stefan 
Published: April 2016

Un phénomène intéressant apparaît dans de multiples cultures juridiques : afin de concilier la lettre de la loi et son esprit, certaines lois sont contournées – légalement. Ce contournement, qui consiste à vider la loi de son esprit tout en faisant mine de respecter sa formulation (un loophole en anglais), pose d’un point de vue éthique la question de savoir s’il n’y a pas là hypocrisie. La loi juive est ici étudiée car les contournements qu’elle autorise sont critiqués par ses détracteurs, mais également de l’intérieur : tous les contournements ne sont pas approuvés, loin s’en faut. Le présent texte, qui se veut seulement exploratoire, essaie de montrer quels contournements sont autorisés et pour quelles raisons.
Fiabilité, propreté, coût : les défis du secteur de l’électricité au Brésil
Authors: Le Tourneau François-Michel 
Published: April 2016

Depuis dix ans, la matrice de production électrique du Brésil connaît d’importants changements visant à mettre en place un système « hydrothermique » capable de répondre de manière fiable aux contraintes naturelles. Mais ce système est-il encore « propre » et peu onéreux ? Pour examiner cette question, nous proposons un regard géographique sur la production d’électricité au Brésil. Nous décrirons dans un premier temps comment le système énergétique national s’est constitué et comment il a fait le choix de l’hydroélectricité comme source principale. Nous montrons ensuite en quoi la région amazonienne constitue aujourd’hui une nouvelle frontière énergétique et les questions posées sur le plan environnemental. Nous essayerons enfin de voir comment les différents facteurs que nous mettons à jour jouent sur la fiabilité, le prix ou le caractère écologique de la production d’électricité globale du pays.
The effects of innovation on firm performance of supporting industries in Hanoi, Vietnam
Authors: Tuan Nham , Nhan Nguyen , Giang Pham , Ngoc Nguyen 
Published: April 2016

Purpose: Innovation, including product, process, marketing, and organizational innovation within a firm, is considered as one of essential component for surviving and growing. These innovation activities create value and competitive advantages for successful organizations; therefore, understanding the organization’s overall innovation is the first and foremost to understand the role of innovation on firm performance. The objective of this research is to explore two parts: the impacts of innovation on the different aspect of innovation performance, then their effects to firm performance (production, market, and financial performance).Design/methodology/approach: This study uses primary data from questionnaire survey. The questionnaire involves 4 parts including general information, innovation activities; innovative performance, and firm performance. This research focuses on firms in supporting industries of mechanics, electronics, motorbike and automobile. These firms are in a list of companies (known as The Excellent Vietnamese Companies in Northern and Central Vietnam) established by JETRO and VCCI. There are 150 firms in this list. The questionnaire survey was administered to directors, CEO of those firms during April and May, 2014. Out of the 150 questionnaires sent out, 118 were valid, accounting for 78.7% of the true response rate. Analysis methodologies of reliability, factor analysis and regression are utilized in this paper.Findings: The result demonstrated there are positive effects of process, marketing, and organizational innovations on firm performance in supporting firms. More specifically, the higher the level of innovation activities is, the greater the innovative performance is, which means the larger level of Process, organization and marketing innovation activities are, the higher level of innovative performance are likely to be. Secondly, the higher level of Process, organization and marketing innovative performance, the better level of firm performances is likely to be. To sum up, in order to improve the innovative and firm performance, those firms in supporting industry should highly concentrate on process, marketing, and organizational innovation activities, rather than product innovation activities.Originality/value: Initially, this study applies successfully the model which supposing innovation is a process, then clarifying innovation definition through the impact of innovation activities on innovative performances. Secondly, this research confirmed the positive impact of innovative performances on firm performances. It provided one more empirical evidence of the relationship between innovation and firm performance. For practitioners, organizational innovation and process innovation are more important factors affecting innovative performance and firm performance than product and marketing innovation. Therefore, enterprises should focus and mobilize resources to create improvement in organizational structure and manufacturing processes.
Preserving Nb Superconducvity in Thin Film Flexible Structures
Authors: Gupta Vaibhav , Sellers John A. , Ellis Charles D. , Zou Simin , Hernandez George A. , Bai Rujun , Cao Yang , Tuckerman David B. , Hamilton Michael C. 
Published: April 2016

Similar to observations from other groups, we have observed degradation of the superconducting properties of Nb thin films that have been subjected to subsequent high temperature fabrication processes, such as curing of a passivating polyimide layer at 350°C. This degradation may be caused by interaction with material that diffuses into the Nb during the subsequent processes, and is the subject of ongoing research. To counteract these degradation effects, we have explored multiple materials as barrier layers to attempt to isolate and protect the Nb. The effectiveness of the barrier layer depends on the use of an appropriate layer stack that minimizes degradation in the superconducting thin film, is compatible with subsequent fabrication steps, and is stable and repeatable.
We have investigated multiple material stack-ups to protect Nb-based superconducting thin film in flexible structures. We show that curing polymers above a certain temperature on top of a Nb layer can adversely affect the superconducting properties including critical transition temperature (Tc) and critical current (Ic). DC electrical characterization of patterned film test structures were carried out using a closed-cycle cryostat to determine Tc and Ic for the samples. Details of the fabrication processes, experimental procedures and performance results will be presented. Results of these experiments are expected to provide insight into possible materials stack-ups for packaging and interconnect structures for future cryogenic electronics systems.
Design of TSV-based Inductors for Internet of Things
Authors: Kim Bruce C , Mondal Saikat 
Published: April 2016

This paper describes the design of a Through Silicon Via based high density 3D inductors for Internet of Things (IoT) applications. We present some possible challenges for TSV-based inductors in IoT applications.
The current trend towards Internet of Things (IOT), System in Package (SiP) and Package-on-Package (PoP) requires meeting the power requirements of heterogeneous technologies while maintaining minimum package size. 3-D chip stacking has emerged as one of the potential solutions due to its high density integration in a 3D power electronics packaging regime. As an integral part of many power electronics applications, TSV-based inductors are becoming a popular choice because of their high inductance density due to the reduced on-chip footprint compared to conventional planar inductors. Depending on the requirement, values of these inductors could range from a few nanohenries to hundreds of microhenries. Small inductors with a high quality factor are mainly used for RF filter applications, whereas large inductors are used in power electronics packaging.
For high inductance it is necessary to use ferromagnetic materials. A conventional ferromagnetic metal core like nickel could offer high permeability, which can help to boost the inductance. However, the magnetic field lines within a metal core induce eddy current which can have multiple adverse effect in power electronics packaging. For example, it has long been known that the current can increase the resistance in transformer winding [1]. Eddy current can also heat up the core of the inductor which makes the heat sink process in 3D packaging even more challenging. One way to decrease the eddy current, is to pattern and laminate the core block into multiple segments orthogonal to the direction of the magnetic field line [2]. Another method is to increase the resistivity of the core material so that the eddy current is limited to a very small magnitude [3].
An Innovative Package EMC Solution Using a Highly Cost-Effective Sputtered Conformal Shield
Authors: Karim Nozad , Zhou Rong , Fan Jun 
Published: April 2016

High-speed digital and wireless devices radiate undesired electromagnetic noises that affect the normal operation of other devices causing electromagnetic interference (EMI) problems. Printed circuit board (PCB) and system-level shielding may alleviate inter-system EMI between the PCB board and the outside environment, but does not prevent intra-system EMI within the shielding enclosure. Package and System in Package (SiP) level shielding is often used to minimize intra-system EMI issues. An external metal lid is traditionally employed to prevent noise emission from a device, but the cost and size of this technique makes it unattractive for modern electronics. Conformal shielding is gaining momentum due to its size and height advantages. However, high cost and complexity of the sprayed coating shield prevents it from being used for a wide range of low cost commercial applications.
In this paper, an innovative shielding technology with sputtered metal conformal shield is investigated using a specially designed test vehicle. By sputtering a conductive material onto a package, a very thin (typically a few μm) metal layer is constructed on the top and around four sides of the package. This thin sputtered metal layer adds virtually zero penalty to the package size. The cost and complexity of the sputtering process is significantly lower compared to a spraying process.
Several types of shielded and unshielded modules were built and extensively tested for both far-field and near-field shielding effectiveness (SE) in a semi-anechoic chamber. The performance of the sputtered conformal shield is compared to that of an unshielded module and the sprayed shield. The measured results show that the sputtered shield performs equally well to a sprayed shield, in far field test, with most measurements better than 40 dB of SE.
In near field testing, sputtered shields mostly outperform the sprayed shield, especially when compared in the entire scanned region. A well-designed sputtered conformal shield can, therefore, be a very cost-effective EMI solution for a wide range of packages, such as SiP. Also in the paper, a full wave 3D HFSS model is presented and simulated results for both far and near field are compared with measured data.
Evaluation of High-Speed Copper Plating Products for RDL, Micropillar, and Fan-Out Applications
Authors: Thorseth Matthew A , Scalisi Mark , Lee Inho , Park Sang-Min , Lee Yil-Hak , Prange Jonathan , Imanari Masaaki , Lefebvre Mark , Calvert Jeff 
Published: April 2016

Increasing market demand for portable high-performance electronic devices is requiring an increase in the I/O density in the chip packaging used to make these products. Flip-chip interconnects that enable advanced packaging utilize a C4 bumping process with lead-free solder to make the chip interconnection. However, with the decreasing chip size and tighter I/O pitch requirements that are needed to realize high-performance, Cu pillar plating has emerged as an enabling technology to meet the technical demands. Cu pillars, capped with a lead-free solder, allow for increased I/O density while still maintaining the standoff needed for proper thermal and electrical performance of stacked chips. With this realized performance, there is expected to be a significant increase in capacity of Cu pillar in the industry, requiring electrolytic Cu plating products with fast deposition rates in order to decrease wafer plating time and increase throughput.
In this paper, Cu electroplating products are evaluated for plating performance at increased deposition rates for Cu pillar applications ranging from micropillar (&lt;20 μm feature size), to standard pillar (20 – 75 μm feature size), redistribution layer (RDL) wiring, and the emerging fan-out wafer level packaging (FO-WLP), which encompasses megapillars (&gt;150 μm feature sizes) as well as stacked via RDL designs. The chief performance criteria for evaluation is the ability to increase deposition rates while maintaining feature height uniformity, smooth and uniform feature morphology, and ability to plate a wide variety of feature sizes and shapes. Additionally, performance of these products is assessed on their ability to plate highly pure Cu deposits which enable void-free integration with lead-free solder without the need of (but is compatible with) a cost-added barrier layer.