bluuebunny/crossref_metadata_2025_split huggingface dataset:
Environmentally Isolating Packaging for MEMS Sensors
Authors: Kranz Michael , Whitley Michael , Rudd Carl , Craven Jeff D. , Clark Steven D. , Dean Robert N. , Flowers George T. 
Published: November 2017

Abstract
Microelectronic systems employing MEMS devices are often constrained by limits on size, weight, power, and cost (SWaP-C), while also being exposed to severe shock and vibration during storage, transport, and operation. This combination of requirements has proven difficult to meet using current technology. Incorporating isolators into microelectronic systems improves performance through shock and vibration, but at the expense of cost and size metrics. Systems based on MEMS technologies have the potential to improve upon size and cost metrics for many applications. MEMS technology has made significant strides in performance in recent years. MEMS-based devices are commonly found in consumer applications for a variety of functions. However, MEMS based devices have been known to experience performance degradation while operating through stressing shock and vibration environments. The goal of this work was to develop MEMS technology that is sufficiently robust as to operate through the demanding environments of systems, and to include the design, simulation, and prototype of micro-isolators capable of attenuating shock and vibration prior to their input into the MEMS devices, thereby isolating them from the harsh environment.
Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses
Authors: Lakhera Nishant , Shantaram Sandeep , Sakib AR Nazmus 
Published: November 2017

Abstract
Delamination at the mold compound and leadframe interface is the most common failure mode observed during processing and qualification of the microelectronic package. Mold compound to leadframe delamination is typically observed after environmental reliability stresses like: moisture preconditioning and reflow, air-to-air thermal cycling, biased highly accelerated stress etc. Leadframe based packages constitutes majority of microelectronic packages that are manufactured today, which makes mold compound/leadframe interface of great interest requiring thorough understanding of the adhesion characteristics and its evolution as a function of reliability stresses. This study used four-point bend testing to evaluate the adhesion strength of commercially available mold compound to bare copper and silver plated copper leadframes exposed to automotive grade environmental stresses. Results show that adhesion of mold compound to silver plated leadframes is significantly lower than adhesion to bare copper leadframes. Results obtained from this study can be used to carefully select the qualification reliability stresses to prevent overstressing the package and causing failures related to wire bond cracking, delamination etc., which have significant time and cost implications. Finite element simulations were also performed to validate the empirical adhesion test results and can be extended to full package level models to enable delamination prediction.
Reliability of Coated and Alloyed Copper/Silver Ball Bonds
Authors: Murali Sarangapani , Danila Bayaras Abito , Xi Zhang 
Published: November 2017

Abstract
The paper discusses on the reliability of coated and alloyed copper/silver ball bonds on both epoxy molded and unmolded conditions:Moisture resistance test using unmolded device at 130°C 85%RH (humidity chamber) revealed no ball lift failure until 96hours for the ball size of 1.65 times the diameter of wireCorrosion resistance test using unmolded device at room temperature by dripping (or soaking) dilute chlorine (Cl) solution revealed no ball lift failure for gold wires. Copper base wire bonds failed after 6min of storage while silver (Ag) base wire bonds showed a few bond lifts within 2min. This shows that Ag base wires are more sensitive to Cl environment than copper (Cu) base wiresA case study of epoxy molded device using green mold compound and four types of Cu and Ag base ball bonds passed on thermal ageing (HTS) at 175°C for 4000h and on +5V bHAST for 500h. The test response is by measuring electrical resistance in order not to reduce below 10% of contact resistance measured during time zero bonding○ Cross-section analysis of the samples showed intact bonding of Cu and Ag base ball bonds after 4000h of HTS○ The result shows when Cu and Ag base wire bonds molded with a good compatible green mold epoxy compound satisfy the automotive electronic council (AEC – Q006 & Q100 Rev-H, for Cu) requirements of 2X stress test with respect to electrical resistance measurementAnother case study of epoxy molded device revealed Cu and Ag base wire bonds pass 3000cycles of thermal cycling (−55°C to +150°C) without any neck/heel cracks and stitch lifts
In addition, fine wires are baked at elevated temperature under vacuum or by purging nitrogen to find the quality of wire surface. As expected, Au, Cu and Ag base wires show clean surface. For palladium (Pd) coated Cu wire, a good Pd adhesion to Cu core surface without blisters is evident.
2.5D FPGA-HBM Integration Challenges
Authors: Gandhi Jaspreet , Ang Boon , Lee Tom , Liu Henley , Kim Myongseob , Lee Ho Hyung , Refai-Ahmed Gamal , Shi Hong , Ramalingam Suresh 
Published: November 2017

Abstract
FPGA partitioning and high density integration using interposer based 2.5D stacked silicon interconnect technology (SSIT) has been the pioneering work at Xilinx for several years enabling advanced applications in high performance computing, networking, hyper scale data center and cloud services etc. With the insatiable demand for acceleration workloads, FPGAs need to be coupled with in package memory to enable higher bandwidth, lower power and smaller form factor architecture. 3D stacking based high bandwidth memory (HBM) has paved the way to realize such applications providing 10X higher bandwidth, 4X lower power vs DDR4. This paper provides an overview of unique challenges involved with 2.5D FPGA-HBM SSIT integration from design, process/package development, test and reliability point of view
Next Generation Xeon Server Package Architecture
Authors: Swaminathan Raja , Viswanath Ram , Srinivasan Sriram , Chandrasekhar Arun 
Published: November 2017

Abstract
Semiconductor industry is moving towards more and more integration to provide more functionality and add value to the processor, thereby enabling better user experience. This integration can come in 3 categories: On-die integration, On-package integration, and On-board integration. On-board integration is the typical method being used for several generations and on-die and on-package integration architectures are getting more focus due to better performance and reduced power. The key vector to enable on-die/package architectures is reduced cost and maximum features for a given substrate and socket form factor. Silicon features are also moving at a faster pace compared to the board technology. This paper details a novel package (PoINT) architecture as well as the key technology challenges that were resolved to successfully enable this architecture.
Multiphysics Performance Evaluation of Flexible Substrate Based 1.2kV SiC Half Bridge Intelligent Power Module with Stacked Dies
Authors: Zhao Xin , Jagannadham K. , Hopkins Douglas C. 
Published: November 2017

Abstract
Wide Bandgap (WBG) power devices have become the most promising solution for power conversion systems, with the best trade-off between theoretical characteristics, real commercial availability and maturity of fabrications. Advanced packaging technology is being heavily developed to take full advantages of WBG devices, in terms of materials, mechanical design, fabrication and electrical performance optimizations. In this paper, a flexible substrate based 1.2kV SiC Half Bridge Intelligent Power Module with stacked dies is introduced. The module design is based on the concept “Power Supply in Package (PSiP)”, high functionality is integrated in the module. Together with power stages, gate driver circuits, Low Dropout Regulators (LDO), digital isolators, and bootstrap circuits are integrated in the module. An ultra-thin flexible epoxy-resin based dielectric is applied in the module as substrates, its thickness can be as low as 80μm, with 8W/mK thermal conductivity. The SiC switches are double-side solderable, with copper as topside metallization on pads. No bonding wires are applied in the SiC PSiP module. The highside and lowside SiC switches on the phase leg is stacked vertically for interconnections with low parasitic and high denstiy. This work mainly addresses performance evaluation of the PSiP SiC half bridge module by multiphysics simulations. Q3D is employed to evaluate the parasitic inductance and resistance in the module, showing that parasitic inductance is lower than 1.5nH in the design. The extracted parasitics is imported in spice circuit model, simulation results show limited ringing during switching transients. Thermal simulations are employed to compare junction temperature of power modules with DBC subtrates and flexible substrates, then to evaluate the thermal performance of the designed PSiP SiC model with stacked dies. It shows that junction temperature of designed IPM is higher than regular module at same condition. The paper also provides guideline for optimized heat sink design to lower junction temperature of the SiC IPM. Mechanical simulations are employed to evaluate the pre-stress induced in modules with DBC substrate and flexible dielectric substrate, and proves that mechanical stress induced by reflowing process can be reduced significantly by using ultra-thin flexible dielectric as substrate.
Direct Aerosol Printing of Lithium-ion Batteries
Authors: Yu Xiaowei , Chen I-Meng , Sarkar Susmita , Park Jonghyun , Pan Heng , Liu Yangtao , Wang Yan , Everhart Wesley 
Published: November 2017

Abstract
Recently, additive manufacturing (AM) has brought new opportunities to the manufacturing of lithium-ion batteries (LIBs). In this study, aerosol jet printing, as a branch of AM technologies was demonstrated to fabricate lithium-ion batteries for the first time. Printable inks of two pairs of active materials for cathode and anode were developed. The effect of ink composition on the printing characteristics was studied. The developed inks were printed into Li-ion battery electrodes with specific capacities comparable to conventional slurry cast electrodes. Next, to demonstrate fully-printed electrodes, gold and copper inks were printed on top of polymer substrates and thermal/flash sintered as the current collectors for cathode and anode.
Direct sapphire to ceramic bonding for CMOS image sensor packaging using room temperature bonding technology
Authors: Lundén H. , Määttänen A. , Murphy L. 
Published: November 2017

Abstract
The aim of the study was to evaluate the use of a novel bonding technology to create a sapphire-ceramic package for CMOS image sensor devices. The package must be robust enough to be used in space flight applications: it must protect the device from external environmental conditions during testing, storage and use. A series of tests were executed to ensure the package quality. The package needs to be radiation-tolerant to ensure reliability of data in high radiation environments, such as in space. Package hermeticity is an important reliability requirement not only in space but also in other applications such as medical implants, military, nuclear inspection and telecoms.
It was proved that novel bonding technique enables direct sapphire to ceramic bonding: robust packages were manufactured. A significant improvement in moisture levels was observed compared to (typically)epoxy sealed packages: detected moisture levels were of only one tenth of what is commonly seen in the stressed image sensor packages. Environmental changes had no influence on the package & device functionality or quality.
Thick Film Materials for High Power Hybrid Circuits on Aluminum Nitride
Authors: Sgriccia Matt , Sandoval Frank , Persons Ryan 
Published: November 2017

Abstract
For over 40 years, the substrate of choice for designing and fabricating traditional hybrid circuits has been alumina. It has provided the required mechanical strength, electrical resistivity, and thermal performance needed for proper circuit operation. Over the past several years however, we have experienced a shift in hybrid technology towards electronic devices with highly complex, dense circuit configurations that produce more power and consequently, more heat than previous designs. This requires the use of a substrate with a higher thermal conductivity to properly manage the heat transfer and dissipation in order to maintain optimum performance and functionality of the end device. The thermal properties displayed by aluminum nitride provide design engineers with a reliable alternative to traditional alumina.
While creating new and exciting possibilities, the use of aluminum nitride also creates a different set of challenges for thick film suppliers and circuit fabricators. Due to the thermal expansion mismatch, as well as the chemical changes that occur to the substrate which affect adhesion during the firing process, thick film pastes previously suitable for alumina are typically not compatible with aluminum nitride. To overcome this challenge and the performance demands of high power, high reliability circuit applications, a new line of RoHS and REACH compliant thick film pastes has been developed. The following conductors are available: silver, silver/palladium, silver/platinum, copper, and gold. In addition, we have developed two resistor pastes and a compatible overglaze. This paper will discuss the aforementioned thick films and their critical performance properties before and after reliability testing. This includes adhesion for the conductors, resistance and TCR for the resistors.
High Temperature Storage Reliability of Bond Resistance of Palladium-Coated Copper Ball Bonds
Authors: Hook Michael David , Mayer Michael , Hunter Stevan 
Published: November 2017

Abstract
Reliability of wire bonds made with palladium-coated copper (PCC) wire of 25 μm diameter is studied by measuring the wire bond resistance increase over time in high temperature storage at 225 °C. Ball bonds are made on two bond pad thicknesses and tested with and without mold compound encapsulation. Bond pads are aluminum copper (Al-0.5%Cu), 800 nm and 3000 nm thick. The wirebonding pattern is arranged to facilitate 4-wire resistance measurements of 12 bond pairs in each 28-pin ceramic test package. The ball bonding recipe is optimized to minimize splash on 3000 nm Al-0.5%Cu with shear strength at least 120 MPa. Ball bond diameter is 61 μm and height is 14 μm. Measurements include bond shear test data and in-situ resistance before and during high temperature storage. Bonds on 3000 nm pads are found to be significantly more reliable than bonds on 800 nm pads within 140 h of aging.
Aluminum Wedge-Wedge Bonding Using Capillary and Ball Bonder
Authors: Murali Sarangapani , Theint Ei Phyu Phyu , Fitri Hamdan Faizul , Tiong Tan Kean , Xi Zhang 
Published: November 2017

Abstract
The paper discusses on the bondability and reliability of aluminum (Al) wedge-to-wedge bonding using fine ceramic capillary and ball bonder. Initial trials revealed aluminum build-up and poor capillary life with touch down of 20K or less. Optimizing the process parameters, switching on air-scrub, reducing shape angle to 20° instead of usual 35° and using Al-1wt%Si wire processed with refined grains revealed better capillary life with touch down of 200K without surface burrs. The method is capable of bonding complex looping and sharp acute bends. The data comprising of 1st and 2nd wedge dimensions, wedge pull, wedge shear and fracture mode for 20μm and 50μm Al-1wt%Si wires are presented. High temperature storage of aluminum wedge bonding to different substrate surfaces such as Al-0.5wt%Cu metallization, bare copper and gold plating revealed stable bond. From the wedge pull and tensile data, floor and shelf life of the wire is recommended to be 7days and 6months respectively. Evaluation of gold, copper and silver base bonding wires by this method showed feasible to bond and needs detailed studies to practice. The fusing current of Al-1wt%Si wire for varying diameter from 0.6 to 3mil and wire length from 1 to 20mm are also stated.
Glass Solutions for Packaging and IoT
Authors: Lu Rachel , Shorey Aric 
Published: November 2017

Abstract
The interest in glass as a semiconductor packaging material has continually grown over the past several years. Glass, and its material properties, provides many opportunities for application in advanced packaging. As an insulator, glass is well-suited due to its low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion gives the opportunity to better manage warp in glass core substrates as well as bonded stacks, either in carrier or interposer applications. Forming processes allow the potential to both manufacture in a panel format as well as at thicknesses as low as 100 um. Both of these give real opportunity to provide cost-effective packaging solutions. Via fabrication technology development continues to advance providing via diameters &lt; 20 um in size in a production ready environment.
As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and both via and surface metallization. Additionally, data showing the ability to achieve electrical and thermo-mechanical reliability is readily available. Here we provide the latest data on reliability and new product applications for glass-based solutions.
OPTIMIZATION OF CHEMISTRY FOR A VAPOUR PHASE PROCESS TO DEFLUX NO CLEAN LEAD FREE MATERIALS ON PCBS
Authors: Duchi Patrick J. , Cetier Jonathan , Levasseur Laurent , Coquio Jaquemine , Aguilar Rodrigo 
Published: November 2017

Abstract
The cleaning action to remove baked-on solder flux residues after reflow, also known as defluxing, from printed circuit boards has become more and more challenged because of the higher densities in today's electronics, miniaturization, lower stand off components, and complex geometries where the packaging has evolved from 2D to 3D. This situation becomes even more difficult in No Clean lead free assembly where higher process temperatures are applied causing charring to flux residues. In addition, traditional chemicals like CFC's, HCFC's, brominated solvents, detergents and glycols cannot longer do a good cleaning job anymore because most flux formulations have changed.
An hydrocarbon solvent used as co-solvent in vapour phase application has been re-formulated under three main criterias: environmental legislations, toxicity, and defluxing performance The results from the laboratory stage have been applied to clean the fluxes of three No Clean lead free solder pastes used in mass production of printed circuit boards assemblies with high densities interconnections and exposed to harsh environmental conditions.
Pharmacokinetics of Lopinavir in the LPV/R-Meltrex Formulation Compared to the LPV/R-Soft Gelatine Capsule in HIV Infected Patients
Authors: Leyh Matthias , Zipperich Sven , Winzer Ralf , Drechsel Philipp , Bogner Johannes , Trein Andreas , Schneider Lothar , Klinker Hartwig , Langmann Peter 
Published: November 2017

The protease inhibitor Lopinavir (LPV) combined with low dose ritonavir (r) in the formulation of a soft gelatine capsule (SGC) has been widely used in antiretroviral therapy and has been shown to produce safe therapeutic plasma levels. In June 2006, the LPV/r combination was approved as a tablet (TBL) in Germany and since then has replaced the capsule form. The purpose of this study was to analyze and compare pharmacokinetics of Lopinavir both in the new meltrex tablet formulation and the LPV/r soft gelatine capsule during long-term treatment of HIV. Methods Included in this study were all patients followed at multiple study centers between January 2003 and August 2007 for whom LPV plasma levels were archived during therapeutic drug monitoring. A total of 4010 LPV plasma levels from 721 patients met these inclusion criteria. From these, those patients for whom complete data sets were missing were excluded from the study. Complete data sets were defined as those data that included information regarding cumulative daily dose, the patient's anti-retroviral drug regimen, and the time of measurement after drug intake. A total of 571 LPV plasma levels from 138 patients met the full criteria for inclusion in this retrospective study. Additionally, a small prospective study of LPV plasma levels in 6 patients with 24 data points was conducted in order to increase the reliability of this report. Results At 3 h after dosing, plasma levels of LPV were significantly higher in patients who had received the meltrex tablet (Mdn = 10030 ng/ml, min = 3323, max = 17280) compared to those who had received the soft gelatine capsule (Mdn = 7964 ng/ml, min = 120, max = 17900). This difference was statistically significant (p < 0.05). There were no statistically significant differences between the LPV plasma levels of the tablet and the capsule at 6, 9 and 12 h after dosing. Additionally, there were no differences between the trough levels of LPV in the two formulations. However, great variances of plasma levels were detected at time 12 h after dosing for both treatment groups (s(capsule) = 3213 ng/ml, s(tablet) = 2273 ng/ml). Conclusion The LPV/r tablet formulation is able to produce equivalent to significantly higher plasma levels of LPV when compared with the SGC formulation at time 3 h after drug intake. In addition, the known sex difference in the pharmacokinetic profile of the tablet formulation was verified in this study.
Study of Specific Dermatoses of Pregnancy and Skin Diseases affected by Pregnancy in a Tertiary Care Rural Hospital
Authors: Khare Stuti , Singh Adarshlata 
Published: November 2017

Abstract
Aims and objectives: To study the various specific dermatoses of pregnancy and changes due to pregnancy.
Study design: A cross-sectional study was conducted in a tertiary care center, Department of Dermatology and Department of Obstetrics and Gynecology.
Materials and methods: A total of 400 pregnant females were enrolled and studied for various cutaneous changes of pregnancy. In pregnant females with specific dermatoses of pregnancy, detailed clinical examination was done regarding the morphology, pattern, and distribution of lesions. Routine blood investigations were done in all pregnant females. Biopsy was done wherever required.
Results: Among 400 pregnant females, we found 38 (9.5%) to be having specific dermatosis of pregnancy. The most common specific dermatosis of pregnancy was prurigo of pregnancy (4.75%), followed by pruritic urticarial papules and plaques (PUPP) of pregnancy (4%), intrahepatic cholestasis (ICP) of pregnancy (0.25%), and pruritic folliculitis of pregnancy (0.125%). In 9.5% females, skin diseases were caused due to pregnancy.
Ectopic Tooth in the Anterior Wall of Maxillary Sinus
Authors: Surana Sanidhya , Thakur Deepak , Kapse Sheetal , Kashyap Mukesh 
Published: November 2017

AbstractA 16-year-old male patient reported to our department with a chief complaint of pain and swelling in the upper left cheek region. On examination, a maxillary canine was found ectopically in the anterior wall of maxillary sinus. Ectopic eruption of teeth into regions other than the oral cavity is rare. We present one such case of ectopic eruption of maxillary canine.