bluuebunny/crossref_metadata_2025_split huggingface dataset:
In-line advanced process control solution for the fabrication of micro-bumps
Authors: Alliata Dario , Godny Stephane , Serrecchia Cleonisse , Combier Tristan , Sippel Astrid , Gastaldo Philippe 
Published: November 2017

Abstract
In this paper, Confocal Chromatic Microscopy was investigated to characterize the micro-bump fabrication process. We designed and fabricated in house a new detector that integrates through the same optical chromatic lens two light beams that are reflected into a 2D line scan camera and a spectrometer to obtain on the fly 2D and 3D information while scanning the wafer surface.
We inspected 300 mm round wafers hosting arrays of copper micro-bumps down to 10 μm in width and 5 μm in height at post Cu growing and etching step.
The 2D inspection revealed the presence of partial μbumps, shifted and missing μbumps. The 3D inspection could recognize shorter and taller bumps and determine the coplanarity of each bump population at die level. This information could be used to classify GOOD and BAD dies over the wafer, so that after dicing only known good dies would be used in the following advanced packaging step. In this way, the risk of shorts and / or missing contact is minimized when stacking dies either on a wafer or on a die.
Highly Reliable Cu Wiring Layer of 1/1 μm Line/Space Using Newly Designed Insulation Barrier Film
Authors: Mitsukura Kazuyuki , Abe Shinichiro , Toba Masaya , Minegishi Tomonori , Kurafuchi Kazuhiko 
Published: November 2017

Abstract
The interposer or fan-out packaging technology with ultra-fine line/space has been required in order to achieve high density interconnection between chips with low cost. In this paper, we propose the iBF (insulation barrier film) to satisfy the insulation reliability of 1/1 μm ultra-fine trench wiring. The features of iBF are very low moisture absorptivity less than 0.3%, chloride ion impurities less than 1.0 ppm and high resistance to hydrolysis. In addition, iBF has good adhesive strength to Ti and Cu. The trench wiring was fabricated for mechanical and insulation reliability evaluation using photosensitive dielectric, then covered with iBF. The obtained trench wiring with 2/2, 1.5/1.5 and 1/1 μm line/space has passed the reliability tests such as moisture sensitivity level 2, thermal cycling test and biased HAST (highly accelerated stress test). We have also verified high resolution of photosensitive dielectric and fabrication of ultra-fine trench wiring on iBF to realize fine multi-layer wiring.
Co-Simulation Based Multi-Chip Module Design Flow and Wi-Fi Module Example with Integrated BAW and LNA
Authors: Dekosky Jeff , Nair Deepukumar , Carastro Larry , Knapp Scott 
Published: November 2017

Abstract
This paper discusses an improved design flow for hybrid Multi-Chip Modules comprising of MMICs and other components. A full 3D electromagnetic co-simulation flow is proposed. Application of such a flow is demonstrated with an MCM receiver module which has a bulk acoustic wave pre-filter, a Low Noise Amplifier with a digital bypass function, and a classical 6th order filter implemented with discrete components. Detailed simulation data is provided on each component of the system and the final MCM module, that demonstrates the use of the design flow. Finally, simulation results are compared to measured data from fabricated modules to prove the validity of our design approach
Encapsulation of Microelectronic Assemblies for use in Harsh Environments
Authors: Varner H. , Mahaffey J. , Marinis T. , DiBiasio C. 
Published: November 2017

Abstract
Microelectronic systems that are intended for use in high shock and vibration environments are encapsulated to achieve stable and reliable operation. The physical design of the electronic assembly, the material properties of the encapsulant, and the magnitude and frequency of the inertial loading must all be factored into the system design. Overall robustness to shock and vibration are improved by minimizing the physical size and mass of the system, which increases its stiffness and reduces the magnitude of the inertial forces that must be supported. This work describes the development of an encapsulation process and facilities that are optimized for building high-reliability microelectronic systems that range between one and five cubic centimeters in volume. Finite Element Analysis (FEA) is used to ensure that sensitive components are not overstressed by the encapsulant as a result of residual curing stresses and inertial loading effects. Computational Fluid Dynamics (CFD) software is used to model the filling process, with the objective of identifying locations prone to void formation. The CFD models are validated via cross sectioning mechanical replicas of the system and by encapsulating enclosures fitted with viewing windows to allow sequential photographs of the progression of the fill frontier.
During fabrication, the encapsulant is dispensed under vacuum while being observed with a stereoscopic microscope. An essential component of the process is characterization of the encapsulant materials. Coefficient of thermal expansion and cure shrinkage of the encapsulant are determined by casting a sample onto a thin metal strip and extracting stress parameters with equations of a bimetallic strip. The surface energies of the encapsulant on materials in the system are measured by a modified sessile drop technique in which the material is dispensed on a coupon, cured and then measured with a profilometer. These tests are performed on each lot of material when received and periodically afterwards to monitor the condition of inventory. This paper provides a detailed description of the design process and facilities using examples from representative products.
Ablative Laser Patterning of Polymeric Dielectric Materials
Authors: Matos-Pérez Cristina R. , Blumenshine Deborah , Kirchner Lisa M. , Flaim Tony , Puligadda Rama , Hichri Habib , Arendt Markus , Lee Seongkuk 
Published: November 2017

Abstract
As the semiconductor technology and the field evolves, the need for new applications can facilitate the development of new materials and processes. Device size is continuously shrinking, and materials that have low stress can promote new developments. In this paper, the focus is on three polymeric platforms that can be used as dielectric materials with the added advantage of being patternable via laser ablation. The dielectric materials were carefully designed to exhibit low stress (low modulus and high elongation), good temperature stability, and high absorbance for laser patterning. Additionally, these materials possess a distinctly advantageous, heretofore unseen property: production of little to no debris post-ablation. Several advantages of using laser ablation as the patterning tool is that it allows room temperature processing, higher throughput, and improved resolution. In this paper, it will be demonstrated that successful patterning via laser ablation of new dielectric materials can be achieved which is beneficial to new applications and technologies.
14nm Chip Package Interaction (CPI) Technology Development
Authors: Fu Lei , Low YS , Bhagavat Milind , Barber Ivor 
Published: November 2017

Abstract
This paper presents the 14 nm chip and package interaction (CPI) challenges and development by using 140 um minimum pitch with SnAg bump in flip chip BGA package. We evaluated 14 nm back-end-of-line (BEOL) film strength/structure / adhesion with large die size of 21×21 mm2 and optimized bumping technology by passing all the CPI reliability tests (QTC, Precon, UBHAST, TCJ, MSV, and HTS) with following the JEDEC standard. We also evaluated assembly with different bump foot print at 140um bump pitch with SnAg bump, and no assembly issues were encountered. Crack stop plays very critical role in defending the crack propagation into the die active area. In our development, we observed reliability failure with severe test condition TCG (−45°C to 125°C), but passed TCJ (0°C to 100°C) with single wall crack stop on the large die size. With increasing crack stop width which enhanced the mechanical strength of crack stop, both TCG and TCJ passed. So it is strongly recommended to use wider crack stop for large dies to eliminate any failures.
Morphological and Electrical Stability Studies of Pt/Yttria-Stabilized Zirconia Nanocomposite Thin Film Cathodes for Microfabricated Solid Oxide Fuel Cells
Authors: Rottmayer Michael , Singh Raj , Huang Hong 
Published: November 2017

Abstract
Microfabricated solid oxide fuel cells (mSOFCs) have recently gained attention as a promising technology for portable power applications. At present, porous Pt is the most common cathode being investigated for mSOFCs, which has poor bulk ionic conductivity and suffers from instability due to Ostwald ripening. Nanocomposite materials based on Pt/Yttria-Stabilized Zirconia (YSZ) are a promising alternative approach for high performance mSOFCs because of their potential for providing mixed ionic-electronic conduction, improving adhesion to the YSZ electrolyte, and improving oxygen diffusion characteristics over a pure Pt material. The objective of this research was to systematically explore the processing of the nanocomposite thin films to achieve stable morphological and electrical properties for use as a mSOFC cathode. A percolation theory model was utilized to guide the processing of the Pt/YSZ composition, ensuring a networked connection of ionic- and electronic-conduction through the electrode. The Pt/YSZ nanocomposite cathodes were deposited by co-sputtering. It was observed that the Ar deposition pressure played a key role in stabilizing the morphology of the film to higher temperatures, up of 600°C. Analyses of the Pt/YSZ composite microstructure and composition by TEM confirmed an interconnected network of Pt and YSZ thereby suggesting that it is a viable candidate as a high performance and stable cathode material for mSOFCs.
Wire Bonding Looping Solutions for High Density System-in-Package (SiP)
Authors: Milton Basil , Kwon Odal , Huynh Cuong , Qin Ivy , Chylak Bob 
Published: November 2017

Abstract
System-in-Package (SiP) have seen a lot of growth in recent years especially in mobile devices due to its higher level of system integration, more design flexibility and smaller form factor. Two or more semiconductor die and passive components are usually present in a SiP device. Die to die bonding and increased I/O density are two common challenges associated with wire bonding in SiPs. High density SiP packages often have high I/O counts and tight wire clearance. As a result, the requirements for wire bond looping are high. To avoid wire shorts, the wire bond loops need to be well designed in order to have optimal wire clearance between various tiers of wire loops as well as neighboring loops. The formed loops need to have low wire sway after wire bonding and low wire sweep after molding. Due to the existence of multiple dies and other passive components within the same package, special wire bond loops with long flat lengths and sharp bending angles are sometimes necessary to clear the die edges and the other components. In this paper, we will review a few new wire bonding looping solutions including 3D looping design software, 3D loop clearance checking and multi-tier loop formation improvements. A robust package design is essential to improve production yield. A 3D looping design software has been developed to evaluate the robustness of various package designs from a wire looping perspective. The software is able to detect potential issues early on in the design cycle and evaluate alternatives quickly, therefore reduces the time to market and improves design robustness. A spatial 3D clearance checking tool has been developed to detect any interference between the densely populated wire loops. The tool can also detect interference between the wires and the edges of different dies. Furthermore, the wire clearance against various components in the package can also be assessed. Process engineers can leverage the clearance check tool and the 3D visualization of wires, multiple dies and components to aid wire bonding looping optimization. Multi-tier looping requires a large range of loop height and wire length capability. In order to achieve optimal looping for high density multi-tier applications, a separate wire bonding looping software has been developed to generate optimal wire bonding motion trajectories that can achieve the loop shapes designed by the 3D looping design software. An example of 6 loop tier application is developed and results are analyzed to show the wire bonding capabilities including looping height from 75um to 500um and wire length up to 5mm.
A novel production process for 10 μm microvias.
Authors: Renbi Abdelghani , Delsing Jerker 
Published: November 2017

Abstract
This work investigates the capability of drilling and metallization of microvias of diameter less than 10 μm with aspect ratios of 1–10, using a fully additive process.
The microvia has been produced using a sequential build up layer of urethane through which the via has been produced. The urethane layer is applied using spin-coating. Current process setting produces a 15 μm layer thickness. For thicker urethane, multiple layers are applied. Drilling of the via-hole through is made using 266 nm UV laser.
The metallisation of the via-hole was made using a process called Covalent Bonded Metallisation (CBM). This process modifies the urethane surface by a grafting process where polymers are covalently bonded to the surface where metallisation is desired. A roughly 5 μm thin film of the used grafting solution is applied to the substrate surface. The grafting process is initiated by laser which draws the patterns where copper is desired.
After laser drawing, the substrate is cleaned with deionized water. Next, the substrate is through a commercial chemical-copper process which builds copper only at the laser initiated patterns. Copper thicknesses of 1 μm is easily achievable. To increase the copper thickness, the substrate may be run into thick building chemical-copper process to achieve thicknesses up to 8 μm.
Lanreotide Autogel® in the Treatment of Acromegaly
Authors: Roelfsema Ferdinand , Biermasz Nienke R. , Pereira Alberto M. , Romijn Johannes A. 
Published: November 2017

Background In acromegaly expert surgery is curative in only about 60% of patients. Postoperative radiation therapy is associated with a high incidence of hypopituitarism and its effect on GH production is slow, so that adjuvant medical treatment becomes of importance in the management of many patients. Objective To delineate the role of lanreotide Autogel® in the treatment of acromegaly. Methods Search of Medline, Embase and Web of Science databases for clinical lanreotide studies in acromegaly. Results The weighted mean of serum GH normalization by Lanreotide Autogel®, based on 10 published clinical studies, was 58% in 370 patients. These patients were mostly switched from other somatostatin analogs. Serum IGF-I concentration normalized in 48% of these patients. Three small studies, with a total of 60 patients, compared the efficacy of octreotide LAR and that of lanreotide Autogel®. The highest dose of lanreotide appeared to be equivalent with 20 mg of octreotide LAR. Observed side effects were comparable with other somatostatin analogs, including octreotide LAR. Due to the lack of studies with previously, non-medically treated, patients no reliable data on tumor shrinkage is available. Conclusion Lanreotide Autogel®, a latecomer in the second generation of somatostatin analogs, has a therapeutic profile similarte octreotide LAR, which is now in clinical use for more than a decade. Preference for one of the drugs is dictated by the physician, patient and the cost of the drug.
Topical Testosterone Gel for the Treatment of Male Hypogonadism
Authors: Udeoji Dioma U. , Phan Anita , Katsiyiannis Peter , Willix Robert , Schwarz Ernst R. 
Published: November 2017

Objective This review describes the current knowledge of biological external testosterone (T) application using dermal products for the treatment of late-onset male hypogonadism (LOH). Methods An English language search of medical literature using Pubmed was conducted between January of 1984 and March of 2012 using the search term ‘testosterone gel’. Special emphasis was given to clinical controlled trials and large case studies. Results We describe the current knowledge on testosterone replacement therapy using gel applications. A reference search revealed 1567 publications; 44 were clinical studies in human patients with male hypogonadism, 80 were reviews, 27 were case reports, and 9 were retrospective studies. Data from the literature and from 20 clinical studies involving human patients were analyzed since they met the inclusion criteria of testosterone gel administration in hypogonadal males. For the purpose of this review, a total number of 2,378 human patients were studied. Overall, biological T administration resulted in improvement of sexual dysfunction and symptoms of metabolic syndrome and represented an effective and safe treatment option for hypogonadal men. Conclusions Administration of biological T gel appears to represent a valid alternative treatment option for male hypogonadism with a favorite efficacy and safety profile.
Profiling of Saharan dust from the Caribbean to western Africa – Part 1: Layering structures and optical properties from shipborne polarization/Raman lidar observations
Authors: Rittmeister Franziska , Ansmann Albert , Engelmann Ronny , Skupin Annett , Baars Holger , Kanitz Thomas , Kinne Stefan 
Published: November 2017

Abstract. We present final and quality-assured results of multiwavelength polarization/Raman lidar observations of the Saharan air layer (SAL) over the tropical Atlantic. Observations were performed aboard the German research vessel R/V Meteor during the 1-month transatlantic cruise from Guadeloupe to Cabo Verde over 4500 km from 61.5 to 20° W at 14–15° N in April–May 2013. First results of the shipborne lidar measurements, conducted in the framework of SALTRACE (Saharan Aerosol Long-range Transport and Aerosol–Cloud Interaction Experiment), were reported by Kanitz et al.(2014). Here, we present four observational cases representing key stages of the SAL evolution between Africa and the Caribbean in detail in terms of layering structures and optical properties of the mixture of predominantly dust and aged smoke in the SAL. We discuss to what extent the lidar results confirm the validity of the SAL conceptual model which describes the dust long-range transport and removal processes over the tropical Atlantic. Our observations of a clean marine aerosol layer (MAL, layer from the surface to the SAL base) confirm the conceptual model and suggest that the removal of dust from the MAL, below the SAL, is very efficient. However, the removal of dust from the SAL assumed in the conceptual model to be caused by gravitational settling in combination with large-scale subsidence is weaker than expected. To explain the observed homogenous (height-independent) dust optical properties from the SAL base to the SAL top, from the African coast to the Caribbean, we have to assume that the particle sedimentation strength is reduced and dust vertical mixing and upward transport mechanisms must be active in the SAL. Based on lidar observations on 20 nights at different longitudes in May 2013, we found, on average, MAL and SAL layer mean values (at 532 nm) of the extinction-to-backscatter ratio (lidar ratio) of 17±5 sr (MAL) and 43±8 sr (SAL), of the particle linear depolarization ratio of 0.025±0.015 (MAL) and 0.19±0.09 (SAL), and of the particle extinction coefficient of 67±45 Mm−1 (MAL) and 68±37 Mm−1 (SAL). The 532 nm optical depth of the lofted SAL was found to be, on average, 0.15±0.13 during the ship cruise. The comparably low values of the SAL mean lidar ratio and depolarization ratio (compared to typical pure dust values of 50–60 sr and 0.3, respectively) in combination with backward trajectories indicate a smoke contribution to light extinction of the order of 20 % during May 2013, at the end of the burning season in central-western Africa.
Simulation of the Ozone Monitoring Instrument aerosol index using the NASA Goddard Earth Observing System aerosol reanalysis products
Authors: Colarco Peter R. , Gassó Santiago , Ahn Changwoo , Buchard Virginie , da Silva Arlindo M. , Torres Omar 
Published: November 2017

Abstract. We provide an analysis of the commonly used Ozone Monitoring Instrument (OMI) aerosol index (AI) product for qualitative detection of the presence and loading of absorbing aerosols. In our analysis, simulated top-of-atmosphere (TOA) radiances are produced at the OMI footprints from a model atmosphere and aerosol profile provided by the NASA Goddard Earth Observing System (GEOS-5) Modern-Era Retrospective Analysis for Research and Applications aerosol reanalysis (MERRAero). Having established the credibility of the MERRAero simulation of the OMI AI in a previous paper we describe updates in the approach and aerosol optical property assumptions. The OMI TOA radiances are computed in cloud-free conditions from the MERRAero atmospheric state, and the AI is calculated. The simulated TOA radiances are fed to the OMI near-UV aerosol retrieval algorithms (known as OMAERUV) is compared to the MERRAero calculated AI. Two main sources of discrepancy are discussed: one pertaining to the OMI algorithm assumptions of the surface pressure, which are generally different from what the actual surface pressure of an observation is, and the other related to simplifying assumptions in the molecular atmosphere radiative transfer used in the OMI algorithms. Surface pressure assumptions lead to systematic biases in the OMAERUV AI, particularly over the oceans. Simplifications in the molecular radiative transfer lead to biases particularly in regions of topography intermediate to surface pressures of 600 and 1013.25 hPa. Generally, the errors in the OMI AI due to these considerations are less than 0.2 in magnitude, though larger errors are possible, particularly over land. We recommend that future versions of the OMI algorithms use surface pressures from readily available atmospheric analyses combined with high-spatial-resolution topographic maps and include more surface pressure nodal points in their radiative transfer lookup tables.