bluuebunny/crossref_metadata_2025_split huggingface dataset:
Plasmoid Instability in Evolving Current Sheets and Onset of Fast Reconnection
Authors: Huang Yi-Min , Comisso Luca , Bhattacharjee A. 
Published: November 2017

Abstract
The scaling of the plasmoid instability maximum linear growth rate with respect to the Lundquist number S in a Sweet–Parker current sheet,

, indicates that at high S, the current sheet will break apart before it approaches the Sweet–Parker width. Therefore, a proper description for the onset of the plasmoid instability must incorporate the evolving process of the current sheet. We carry out a series of two-dimensional simulations and develop diagnostics to separate fluctuations from an evolving background. It is found that the fluctuation amplitude starts to grow only when the linear growth rate is sufficiently high

to overcome advection loss and the stretching effect due to the outflow. The linear growth rate continues to rise until the sizes of plasmoids become comparable to the inner layer width of the tearing mode. At this point, the current sheet is disrupted and the instability enters the early nonlinear regime. The growth rate suddenly decreases, but the reconnection rate starts to rise rapidly, indicating that current sheet disruption triggers the onset of fast reconnection. We identify important timescales of the instability development, as well as scalings for the linear growth rate, current sheet width, and dominant wavenumber at disruption. These scalings depend not only on the Lundquist number, but also on the noise amplitude. A phenomenological model that reproduces scalings from simulation results is proposed. The model incorporates the effect of reconnection outflow, which is crucial for yielding a critical Lundquist number S

c
below which disruption does not occur. The critical Lundquist number S

c
is not a constant value, but has a weak dependence on the noise amplitude.
When Disorder Looks Like Order: A New Model to Explain Radial Magnetic Fields in Young Supernova Remnants
Authors: West J. L. , Jaffe T. , Ferrand G. , Safi-Harb S. , Gaensler B. M. 
Published: November 2017

Abstract
Radial magnetic fields are observed in all known young, shell-type supernova remnants in our Galaxy, including Cas A, Tycho, Kepler, and SN1006, and yet the nature of these radial fields has not been thoroughly explored. Using a 3D model, we consider the existence and observational implications of an intrinsically radial field. We also present a new explanation of the origin of the radial pattern observed from polarization data as resulting from a selection effect due to the distribution of cosmic-ray electrons (CREs). We show that quasi-parallel acceleration can concentrate CREs at regions where the magnetic field is radial, making a completely turbulent field appear ordered, when it is in fact disordered. We discuss observational properties that may help distinguish between an intrinsically radial magnetic field and the case where it only appears radial due to the CRE distribution. We also show that the case of an intrinsically radial field with a quasi-perpendicular CRE acceleration mechanism has intriguing similarities to the observed polarization properties of SN1006.
« Cette chose exquise »
Authors: Granger Christophe 
Published: November 2017

Les vacances ouvrières, en France, n’ont pas attendu les congés payés de 1936. Elles prennent vie en tant que problème politique et en tant que pratique sociale aux alentours de 1900. Le milieu des universités populaires, convaincu que les travailleurs ont droit à ce qui n’est encore qu’un privilège bourgeois, monte des colonies ouvrières de vacances ; les anarchistes y trouvent l’occasion de donner corps, l’été, à des communautés libres, et les députés socialistes déposent, en 1906, un projet de loi accordant des vacances à tous les ouvriers et ouvrières du pays. Pour décrire cette mobilisation plurielle, il faut retracer non seulement la forme concrète que prennent ces vacances ouvrières, non seulement la place qu’elles prennent dans la lutte que se livrent ceux qui se disputent la forme légitime de l’action pour le peuple, mais aussi les questions sociales nouvelles qu’elles posent, à commencer par celle de l’autonomie des ouvriers dans l’organisation des pratiques ouvrières.
Toxicity of Aqueous Alkaline Solutions to New Zealand Mudsnails, Asian Clams, and Quagga Mussels
Authors: Barenberg Amber , Moffitt Christine M. 
Published: November 2017

Abstract
We modeled the toxicity response of three important aquatic nuisance species to alkaline solutions of pH 12 to explore the potential use of chemical treatments for decontaminating infested water distribution systems, tanks, and other facilities in confined freshwater environments. Groups of quagga mussels Dreissena bugensis, New Zealand mudsnails Potamopyrgus antipodarum, and Asian clams Corbicula fluminea were tested in temperatures from 19 to 22°C in aqueous solutions adjusted to pH 12 with NaOH. The predicted 99% lethal exposure time (LT99) for adult-sized quagga mussels and New Zealand mudsnails respectively was 31.3 and 35.1 h. Longer exposures were needed to kill adult-sized Asian clams (LT99 = 208.9 h). Because of the worldwide use of NaOH as an alkaline reagent in a variety of industrial and pesticide applications, and its ease of neutralization with CO2, elevating the pH of freshwater solutions with NaOH may be a practicable management tool to remove nuisance species in biofouled canals, pipes, hatchery tanks, and other confined structures.
Gingival Tissue Inflammation Promotes Increased Matrix Metalloproteinase-12 Production by CD200Rlow Monocyte-Derived Cells in Periodontitis
Authors: Björnfot Holmström Sofia , Clark Reuben , Zwicker Stephanie , Bureik Daniela , Kvedaraite Egle , Bernasconi Eric , Nguyen Hoang Anh Thu , Johannsen Gunnar , Marsland Benjamin J. , Boström Elisabeth A. , Svensson Mattias 
Published: November 2017

Abstract
Irreversible tissue recession in chronic inflammatory diseases is associated with dysregulated immune activation and production of tissue degradative enzymes. In this study, we identified elevated levels of matrix metalloproteinase (MMP)-12 in gingival tissue of patients with the chronic inflammatory disease periodontitis (PD). The source of MMP12 was cells of monocyte origin as determined by the expression of CD14, CD68, and CD64. These MMP12-producing cells showed reduced surface levels of the coinhibitory molecule CD200R. Similarly, establishing a multicellular three-dimensional model of human oral mucosa with induced inflammation promoted MMP12 production and reduced CD200R surface expression by monocyte-derived cells. MMP12 production by monocyte-derived cells was induced by CSF2 rather than the cyclooxygenase-2 pathway, and treatment of monocyte-derived cells with a CD200R ligand reduced CSF2-induced MMP12 production. Further, MMP12-mediated degradation of the extracellular matrix proteins tropoelastin and fibronectin in the tissue model coincided with a loss of Ki-67, a protein strictly associated with cell proliferation. Reduced amounts of tropoelastin were confirmed in gingival tissue from PD patients. Thus, this novel association of the CD200/CD200R pathway with MMP12 production by monocyte-derived cells may play a key role in PD progression and will be important to take into consideration in the development of future strategies to diagnose, treat, and prevent PD.
Mode of Tolerance Induction and Requirement for Aire Are Governed by the Cell Types That Express Self-Antigen and Those That Present Antigen
Authors: Mouri Yasuhiro , Ueda Yoshihiro , Yamano Tomoyoshi , Matsumoto Minoru , Tsuneyama Koichi , Kinashi Tatsuo , Matsumoto Mitsuru 
Published: November 2017

Abstract
Aire controls the fate of autoreactive thymocytes (i.e., clonal deletion or development into regulatory T cells [Tregs]) through transcriptional control of the expression of tissue-restricted self-antigens (TRAs) from medullary thymic epithelial cells (mTECs) and bone marrow (BM)-derived cells. Although TRAs expressed by mTECs and BM-derived cells are suggested to complement each other to generate a full spectrum of TRAs, little is known about the relative contribution of TRAs from each component for establishment of self-tolerance. Furthermore, the precise role of Aire in specific types of Aire-expressing APCs remains elusive. We have approached these issues by generating two different types of transgenic mouse (Tg) model, which express a prefixed model self-antigen driven by the insulin promoter or the Aire promoter. In the insulin-promoter Tg model, mTECs alone were insufficient for clonal deletion, and BM-derived APCs were required for this action by utilizing Ag transferred from mTECs. In contrast, mTECs alone were able to induce Tregs, although at a much lower efficiency in the absence of BM-derived APCs. Importantly, lack of Aire in mTECs, but not in BM-derived APCs, impaired both clonal deletion and production of Tregs. In the Aire-promoter Tg model, both mTECs and BM-derived APCs could independently induce clonal deletion without Aire, and production of Tregs was impaired by the lack of Aire in mTECs, but not in BM-derived APCs. These results suggest that the fate of autoreactive thymocytes together with the requirement for Aire depend on the cell types that express self-antigens and the types of APCs involved in tolerance induction.
Dark Current Leakage in Optoelectronic Hermetic Packages
Authors: Dionet Clara , Perosevic Goran , Javier Jeff , Fernandez Sammie , Hurdle Taylor , Moradi Maziar , Neely Andrew , Ma Kevin , Albarghouti Marwan 
Published: November 2017

Abstract
In this work, the root cause of the increase in dark current occurring over time at high temperature in hermetic packages, such as those used in optoelectronic devices, was investigated. It was observed that hermetic Receiver Optical Subassembly (ROSA) devices show continuously increasing dark current when stressed and monitored at 85°C over an extended period of time, reaching, in some cases, values greater than 500nA. However, this increase in leakage current was recoverable once the package seal is broken, and this behavior was found to be very repeatable. Photodetectors from two different suppliers were tested and found to have dark current which is dependent on the fabrication process, as the photodetector (PD) from supplier 1 (PD1) showed three times higher leakage than the photodetector from supplier 2 (PD2). The main difference between the two photodetectors is that the polyimide layer in PD1 in significantly greater than in PD2. It was also observed that 48 hour pre-seal baking at 120°C keeps the dark current constant at much lower levels, but does not stop it completely from rising over time.
Die Placement Error management for Fan out Applications using Projection Lithography
Authors: Hichri Habib , Abdol Mo , Arendt Markus 
Published: November 2017

Abstract
Photolithography has long been the key patterning technology for structuring organic materials used in advanced packaging applications like flip-chip wafer bumping, electroplated gold, solder bumps, copper pillar technologies and redistribution layers. Photolithography is a key manufacturing process and cost contributor, the careful selection of the right exposure solution is critical to achieve the best possible cost structure in today's industrial lithography applications
We will introduce a projection exposure technology that uses a 1:1 projection lens; the projection exposure technology provides high resolution patterning performance. With the capability of varying NA from 0.07 to 0.14, a large depth of focus is obtained, that is required to ensure high pattern fidelity when working with thick resists. The projection exposure can also be applied to FOWLP applications, when the die placement data is fed into a software optimization algorithm to correct for it. We will present the projection exposure technology capability in managing the die placement error for FOWLP. In addition, details on the overlay capability of the projection exposure in thin resist are described and a Cost-of-Ownership comparison between different photolithography solutions is discussed.
Antenna Systems for Simultaneous Transmit and Receive (STAR) Applications
Authors: Etellisi Ehab A. , Elmansouri Mohamed A. , Filipovic Dejan S. 
Published: November 2017

Abstract
Several novel wideband co-polarized circulator-less monostatic antenna and array designs for co-channel simultaneous transmit and receive (STAR) applications are presented. The monostatic STAR apertures are demonstrated first by utilizing multi-arm spiral antennas where a set of arms is used for transmitting (TX) and the other set for receiving (RX). Then, square and hexagonal broadside STAR arrays utilizing closely-spaced spiral antennas are introduced. Finally, (quasi) omnidirectional circular STAR arrays based on phase modes orthogonality principles are realized using four wideband monocone antenna elements. The studied configurations are integrated with the proper beamforming networks to excite the desired modes of TX/RX operations leading to theoretically infinite isolation between TX and RX ports. Practically, the achieved isolation is limited by the electrical asymmetries of the used components. Overall, consistent wideband operation, high isolation, and decent far-field performance are achieved for all proposed STAR approaches.
Multi-factor product authentication using integrated Quick Response (QR) code pixelated antenna
Authors: Doroshewitz John , Kaur Amanpreet , Nanzer Jeffrey , Chahal Premjeet 
Published: November 2017

Abstract
A Quick Response (QR) Code style antenna is presented. Such an antenna can provide two-level authentication, both optically through the current QR technology, plus a radio frequency (RF) signature from microstrip patch antenna designed from the QR signature using copper patterning. The antenna is designed through the pixilation of a patch antenna where conductor is present in the dark regions of the optical QR code. The QR based antenna design has a unique frequency and radiation signature and can be used for RF authentication of products. The design process for the pixilation is presented as well as fabrication and measured results of a QR code antenna design. The possibility of using a Genetic Algorithm to create a “library” of acceptable antenna results in accordance with the QR data it represents is also discussed.
Strength assessment for direct-sintered Al2O3-to-Cu joints based on damage modeling
Authors: Lis Adrian , Asama Koji , Matsuda Tomoki , Sano Tomokazu , Hirose Akio 
Published: November 2017

Abstract
Metal-to-ceramics direct sintering was carried out with Al2O3 and Cu / 3 μm Ni / 1 μm Au substrates. The bonding paste consisted of micron-sized Ag2O particles and a reducing solvent that provokes Ag2O-to-Ag reduction during processing accompanied by the formation of Ag nano particles. Five different sets of process parameters resulted in different joint microstructure and strength. The experimental data was used to calibrate an elasto-visco-plastic finite element model of the sintered assembly which yielded a quantitative damage function and criterion to predict the strength of direct-sintered joints. The developed ductile damage formulation introduced a parameter ξ, i.e. the product of equivalent creep strain and stress triaxiality, that controls the tolerable plastic strain at fracture. An extended numerical parameter study subsequently revealed the complex interaction between the joint strength and microstructural joint features. Thinner joints were found to provide a slightly higher strength while the amount of sinter material and costs is significantly reduced. Moreover, it is recommended to aim at a higher level of densification at the edges and corners of sintered joints since these areas apparently contribute more to the overall mechanical strength. The developed concept is capable of tailoring the microstructure of direct-sintered joints according to the requirements or vice versa.
Demonstration of Embedded Cu Trench RDL using Panel Scale Lithography and Photosensitive Dry Film Polymer Dielectrics
Authors: Sundaram Venky , Liu Fuhan , Nair Chandra , Tummala Rao , Kubo Atsushi , Ando Tomoyuki , Best Keith , Shay Corey 
Published: November 2017

Abstract
This paper presents the first demonstration of fine pitch embedded trench RDL on glass substrates using a new family of ultra-high resolution dry film photo-sensitive polymer dielectrics and a new large area panel scale lithography tool. The specific research targets are to demonstrate multilayer RDL scaling to 1um lines and vias at &gt;200 I/Os per mm of die edge for 2.5D interposers and high density fan-out packages.
A Secure Tunable LNA Design for Internet of Things
Authors: Kim Bruce , Cho Sang-Bock 
Published: November 2017

Abstract
This paper describes the design of through-silicon via (TSV)-based inductors for a secure tunable low-noise amplifier (LNA) in Internet of Things (IoT) devices. To improve cybersecurity infrastructure, we designed a tunable LNA with hardware security. Our secure design for tunable LNA uses a ring oscillator-based physically unclonable function (PUF) circuit. For the 3D inductors, we use ferromagnetic materials to achieve high inductance with a good quality factor.
Next Generation Chip Embedding Technology for High Efficient Mid Power Modules
Authors: Essig Kay S. , Chiu CT , Kuo Jarris , Chen Phidia , Yannou Jean-Marc 
Published: November 2017

Abstract
Embedding active dies into the substrate is fulfilling integration requirements for modern communication devices, and furthermore embedding was shown to have beneficial effects on electrical performance and thermal dissipation, especially for mid power modules (from a few hundred watts to 5kW) [1–3]. It comes with strong advantages as the power modules operate at higher frequencies (MHz range) and aim to apply smaller capacitors and inductors. This approach reduces the overall PCB size and weight from system point of view. These beneficial effects were observed especially for embedded power dies that were already mounted in a lead frame cavity when embedding [3]. In this paper we shall report the development of embedded technologies for power modules mounted in a lead frame cavity and compare electrical performance, thermal dissipation and reliability results with conventional PQFN packaging [3]. We shall also report electrical performance in various operation frequency ranges from a few kHz to MHz to address the benefit on high switching frequency power modules for SiC or GaN applications. We will also address if the EMI effect can be eliminated by using chip embedded technology instead of wire bonding connection from driver to gate pad of power MOSFET chip. We will conclude that the challenges of electrical performance and thermal dissipation required for today's power modules can successfully be overcome by next generation power modules based on lead frame chip embedding.
Challenges of Large Format Packaging and Some of Its Assembly Solutions
Authors: Eric Kuah TH , Yuan Hao Ji , Chan Catherine , Kai Wu , Fan Nelson , Ming Li , Lau John , Ng Eric , Li Margie 
Published: November 2017

Abstract
This paper will focus on the technical challenges and solutions that a packaging and/or equipment engineer faces during the encapsulation of a large format substrate - either a wafer or panel substrate. This form of packaging is known as Large Format Packaging (LFP). The technical challenges and solutions discussed here include encapsulant, material dispensing strategies, direction of encapsulation, warpage management and challenges for LFP going forward. LFP as a packaging solution is an option worth exploring when the end user is willing to address its set of engineering challenges appropriately.
Development of Liquid Compression Molding (LCM) Material for Low Warpage
Authors: Kamimura Tsuyoshi , Kawamoto Satomi , Hashimoto Daisuke , Shigeno Yuto , Yoshii Haruyuki , Noma Hirokazu , Ookubo Tomohiro , Takahashi Hisato , Inoue Hidetoshi 
Published: November 2017

Abstract
This paper reports on the study of flexible epoxy resin which lowers modulus to minimize warpage while maintaining high filler content.
Liquid Compression Molding (LCM) material is an encapsulation material applied at the wafer level. LCM requires high reliability and minimized warpage after curing. The flexible epoxy resin was studied to determine if it could be technically feasible to meet the requirements.
Three epoxy resins with different structures, Conventional epoxy, and Flexible epoxy A and B, were examined. Both samples with Flexible epoxy A and B resulted in lower warpage than Conventional resin. Especially, Flexible epoxy B showed the minimal warpage with the lowest modulus. The sample with Epoxy B performs the best at 260 degree Celsius with the minimal warpage.
A reliability test of LCM with Epoxy B was also conducted assuming the application for Fan-out packaging. Epoxy B showed no delamination or cracks under a thermal cycling test up to 1,000 cycles after MSL1 moisture exposure.
Thin Film Capacitor Applications in RF/Microwave Circuits
Authors: Kuhn William B. , Wolf J. Ambrose 
Published: November 2017

Abstract
Thin-film capacitors can be created on various substrates including glass, low-temperature co-fired ceramic (LTCC), and potentially on laminate PC board materials if the surface is sufficiently smooth. This paper looks at the circuit-design issues of how such a technology could be used in high-speed digital and microwave circuits for improving both signal integrity and power integrity (SI/PI). Two primary applications are examined: the formation of a low-inductance power-supply bypass allowing reduced supply ‘noise’, and the formation of AC coupling (DC blocking) circuits with improved signal return-loss.
INDUCTORS USING 2.5D SILICON INTERPOSER WITH THICK RDL AND TSV-LAST TECHNOLOGIES
Authors: Pares G. , Michel J.-P. , Deschaseaux E. , Pernin V. , Giry A. , Ferris P. , Serhan A. 
Published: November 2017

Abstract
Silicon interposers represents an interesting alternatives to organic packages for the fabrication of complex System In Package (SIP) modules especially for RF application. Among the advantages of this technology are the capability to fabricate fine-pitch redistribution layers and also to embed high quality passive components inside the interposer. This allows the passive components to be very close to the active chips resulting in highly integrated and high performance systems. To keep the technology at a reasonable cost these last add-on features need to be fabricated with no or minor additional process steps that the ones needed for the fabrication of the interposer itself.
In this work we present the design and the fabrication of various design of planar and 3D inductor devices fully compatible with the realization of a silicon interposer that is used to host an RF transmitter system operating in the 0.4 to 1 GHz frequency range. The inductors are built using two thick levels of copper RDL, on both sides of a high resistive silicon substrate and connected by through silicon via-last (TSV-last). This later doesn't require additional metallization to be realized.
A dedicated test vehicle was designed to study various inductor types including planar spirals, 3D solenoids and 3D torus. To facilitate the design work, parameterized cells were built for each type of inductors. The structures geometry are designed and optimized, using electromagnetic simulator, to target inductance values in the range of 0.5 to 10 nH while addressing a quality factor greater than 20.
The second part of the paper focuses on the process used to build the test vehicle, especially the realization of thick copper RDL layers on both sides of the interposer silicon wafer and the TSV-last module. Physical and DC electrical characterizations are presented to assess the integrity of the individual technology modules like thick copper RDL and TSV.
The last part of the work is dedicated to the electrical characterization of the inductor devices in the targeted RF frequency range. Experimental results are presented and discussed in order to give some insight on the impact of the different design parameters on the performances of the inductors.