bluuebunny/crossref_metadata_2025_split huggingface dataset:
Additive Printing of Tight Tolerance Embedded Components via High Precision Shadow Masking and Their Integration with Traditional Circuit Board Manufacturing
Authors: Heydemann V.D. , Lauer S. , Decker W. , Slater J. , Mazurowski J. 
Published: November 2016

Abstract
Most embedded components manufactured today are made either by photolithography to pattern inner board layer materials or by placing discrete components on an inner board layer followed by planarization with a potting compound. These traditional methods produce devices with poor tolerance due to inherent variances in the photolithography and etch process, and parasitic capacitance of long traces. Discrete embedded components increase thickness and weight and suffer from reduced reliability caused by the planarization process. This paper introduces an alternative patterning method to integrate in-line embedded passive and active components without photolithography processing. This additive printing process uses high precision, high feature density shadow masks with micrometer-level registration. Devices are built layer by layer using off-the-shelf bulk materials instead of inks to produce tight tolerance passive and active components that can be integrated into traditional PCB and wafer-level processing. Examples of such additively manufactured devices for both DC and RF applications and preliminary test data are presented in this paper.
Investigation of the Defect Size and Density in Thin SiON Filmfor Organic Device Encapsulation
Authors: Chu Kunmo , Bae Ki Deok , Song Byong Gwon , Park Yong Young , Kim Jaekwan , Xianyu Wenxu , Lee Chang Seung 
Published: November 2016

Abstract
In this study, thin SiON was grown by plasma enhanced chemical vapor deposited (PECVD) method as a thin-film encapsulation (TFE) layer. For defect visualization, electroplating results in a Cu bump grown at each defect site in the SiON film where electrolytic solution establishes contact with the Ni substrate. It was inferred that the Cu bump density could be representative of the intrinsic defect densities for the SiON film. The defect density values were obtained by monitoring the Cu bumps grown at defect sites in the SiON films and then evaluating the number of densities of the Cu bumps for the corresponding defect densities.At the same time, by analyzing the cross section of the Cu bumps grown on SiON film, a linear relation between the Cu bump diameter and the defect size increase was obtained. We expect that this electroplating method allows for rapid visualization of defect distribution and quality evaluation of TFE layers.
Fabrication and characterization of advanced through glass via interconnects
Authors: Clingenpeel Timothy , Rahimi Arian , Hwangbo Seahee , Yoon Yong-Kyu , Shorey Aric 
Published: November 2016

Abstract
This work presents the fabrication process, electrical characteristics, and circuit model of through glass via (TGV) structures consisting of TGV holes with each diameter of 100 μm and different conductors including copper and composite in the frequency range of 300 kHz to 20 GHz. The Cu/NiFe superlattice metaconductors in combination with high-quality glass (Corning SGW3) are intended to reduce radio-frequency losses especially in 10 GHz and above for next generation communication applications such as 5G communications. The measured results of the copper structure are compared to simulated results. Superlattice metaconductor results will be presented. Based on the simulation and measurement results, a circuit model is demonstrated.
Glass Based Inductors, Capacitors and System-In-Package for RF Applications
Authors: Flemming Jeb H , Cook Roger , McWethy Kyle 
Published: November 2016

Abstract
Glassy materials offer a number of advantages over traditional packaging materials, such as laminates and ceramics including: (1) Better material properties, (2) decreased surface roughness to mitigate current crowding, (3) the ability to create small precise features with greater densities, and (4) the opportunity to integrate passive devices such as power inductors and High-Q inductors into an interposer substrate along with other active and passive devices. This paper will cover an overview of our efforts to create APEX® Glass based devices that form the building blocks for a variety of RF applications including power inductors, High-Q inductors, capacitors, filters and interposers. We also demonstrate the power of integrating these individual building blocks into more complex devices that offer compelling solutions for the increasingly complex RF market. Performance data is presented for power inductors and the in-glass inductors.
Ultra-High Density System-in-Package (SiP) for the Lowest Size Weight and Power (SWAP)
Authors: Barbara Bruce 
Published: November 2016

Abstract
Fan out wafer level packages have emerged across the market in an effort to reduce size and weight of electronics used in portable and wearable applications in the commercial, industrial, and the hi-reliability products space. If it is not a stationary platform, weight and volume reduction are imperative. For the stationary platforms, size and power are most critical. Integration of multiple complex heterogeneous IC components can only be done if there are a sufficient number of interconnect layers. Additionally, multiple interconnects are needed for transmission line creation and shielding. This paper provides an introduction to Aurora Semiconductor's high density packaging technology i.e. iUHD (integrated Ultra High Density) and compares it with other alternative technologies. The Aurora iUHD technology is a 2.5D/3D FOWLCSP including embedded components, TSV, multi-layer top and bottom interconnects.
Assembly Equipment Requirements for Next Generation Advanced Packaging
Authors: Chylak Bob , Clauberg Horst , Strothmann Tom 
Published: November 2016

Abstract
Device packaging is undergoing a proliferation of assembly options within the ever-expanding category of Advanced Packaging. Fan Out-Wafer Level Packages are achieving wide adoption based on improved performance and reduced package size and new System in Package products are coming to market in FOWLP, 2.5D and 3D package formats with the full capability to leverage heterogeneous integration in small package profiles. While the wide-spread adoption of thermocompression bonding and 2.5D packages predicted several years ago has not materialized to the extent predicted, advanced memory modules assembled by TCB are in high volume manufacturing, as are some high-end GPUs with integrated memory on Si interposer. High accuracy flip chip has been pushed to fine pitches that were difficult to imagine only three years ago and innovation in substrates and bonder technology is pushing the throughput and pitch capability even further. The packaging landscape, once dominated by a few large assembly providers, now includes turn-key packaging initiatives from the foundries with an expanding set of fan-out packing options. The fan-out processes include face-up and face-down methods, die first and die last methods and 2.5D or 3D package options.
Selection of the most appropriate packaging technology from the combined aspects of electrical performance, form-factor, yield and cost presents a complex problem with considerable uncertainty and high risk for capital investment. To address this problem, the industry demands flexible manufacturing solutions that can be modified and upgraded to accommodate a changing assembly environment. This presentation will present the assembly process flows for various packaging options and discuss the key aspects of the process that influence throughput, accuracy and other key quality metrics, such as package warpage. These process flows in turn impose design constraints on submodules of the bonder. It will be shown that thoughtfully designed machine architecture allows for interchangeable and upgradeable submodules that can support nearly the entire range of assembly options. As an example, a nimble, low weight, medium force, constant heat bondhead for high throughput FOWLP can be interchanged with a high force, pulse heater bondhead to support low stress/low warpage thermocompression bonding. The various configuration options for a flexible advanced packaging bonder will be reviewed along with the impact of configuration changes on throughput and accuracy.
Pre-applied inter chip fill material for 3D chip stack integration – How to improve bonding quality and reliability
Authors: Takeshita Kan , Ikemoto Makoto , Sugiyama Masaya , Yamamoto Hidehiro , Kiritani Hideki , Shen Jun-Wei , Yuge Tetsuharu , Kodama Hiroya , Kawase Yasuhiro 
Published: November 2016

Abstract
Pre-applied underfill, which is also called inter chip fill (ICF), was developed for 2D and 3D chip stack integration. We prepared many types of formulations that have a variety of chemical and mechanical properties. Using these ICFs and test vehicles, we have conducted bonding tests and following thermal cycle tests. Reliability of joined chips was largely dependent on properties of ICF, particularly on curing speed. We also found that lowering modulus moderate delamination in some cases. Thermal stress simulation was also done for stacking chips with ICF. These experimental and calculated results give us an insight into how to develop highly reliable ICF.
Effect of Vapor-Deposited Parylene Coating on Reliability of Sintered Silver Joints for Extreme Temperature Applications
Authors: Shen Zhenzhen , Reiderman Aleksey 
Published: November 2016

Abstract
Silver nano-particle (AgNP) sintering has been extensively shown to be an excellent bonding method for use in the assembly of high-temperature multi-chip modules (MCM) rated above 200° C. Among the proven advantages of using this material in the assembly are the high mechanical strength of the attachment joints, resilience to thermal cycles, low resistivity, and high thermal conductivity. One of the concerns related to the reliability of sintered silver joints is silver migration. Another concern is the change in the joint's microstructure under thermal stress. Vapor-deposited high-temperature fluorinated parylene coating (Paralyne HT) may have the potential to mitigate those concerns because of its superior conformal and crevice-penetration properties. In this work, impact of Parylene HT on sintered silver joints has been evaluated from the perspective of mechanical strength. Test vehicles were subjected to thermal cycling and high-temperature aging. To understand the sintered silver joint's failure mechanisms, shear test analysis of the cross sections and fracture surfaces was performed. In addition, the effectiveness of Parylene HT as a coating to inhibit silver migration at high humidity was evaluated. Coated and uncoated sintered silver test patterns were stressed with an electrical field inside a high-humidity chamber. The silver migration progression was monitored and compared between coated and uncoated samples during the test.
One of the findings was that the coating material penetrates the pores of the sintered silver joints, altering their mechanical performance under thermal stress. Analysis of the performance differences between coated and uncoated test vehicles is presented in the paper.
Computer-Aided Predictive Reliability Risk Analysis for High-Temperature Operation of Subsurface Electronics Development
Authors: Liew Josh , Fanini Otto 
Published: November 2016

Abstract
The engineering task to design a highly reliable printed circuit board assembly (PCBA) that can withstand high temperatures and vibration stress is a challenge faced by all downhole electronics designers in the oil and gas industry today. Discussion will focus a comprehensive Design for Reliability (DfR) process flow based on complementary use of computer-aided design (CAD) tools. The DfR can enable analysis of the PCBA electrical, vibration and thermal stresses, service life prediction, mean time between failure (MTBF) and identify potential design errors for iterative reliability improvement on the schematic-level, early in the design cycle.
Stress analysis using CAD tools includes reliability risk assessment based on historical failures (i.e., engineering practice), detects uncertain design errors, and provides MTBF predictions and life predictions for the PCBA. This approach could improve PCBA performance and reliability by and reducing the product design cost and development time including the design qualification test. The process could accelerate the product development's time-to-market, increase customer satisfaction, and save product development costs.
This paper discusses a case study used to evaluate this CAD-based DfR methodology. The paper also describes how the methodology can be used to support durability analysis at the early design stage.
Electrical Characterization of Low-Profile Copper Foil for Reduced Surface Roughness Loss
Authors: Su Qianfei , Engin A. Ege , Aguirre Jerry 
Published: November 2016

Abstract
Signal attenuation in transmission lines is a major issue for reliable transmission in high frequency range. Knowledge of the electrical parameters of printed circuit board (PCB), including dielectric constant and loss tangent, is critical. Moreover, surface roughness has a great effect on loss in high frequency. This paper demonstrates an effective simulation fitting method for electrical material characterization. Cavity resonator is chosen as the circuit for characterization. A methodology is presented to measure surface roughness from cross sections, and compared with values extracted from resonator measurements. Several materials and copper foils treatments, including low-profile, are analyzed in this paper.
Algunos apuntes sobre la digitalización y la reconstrucción virtual del Castro de San Chuis (Allande, Asturias, España)
Authors: Molina Salido Juana , Jordá Pardo Jesús F. 
Published: November 2016

<p>With the firm conviction that current archaeology needs to use all the tools that computer science provides, we have developed a project for digitising and structuring all the information gathered from the different excavation campaigns carried out in San Chuis hillfort (Allande, Asturias, Spain). In order to do it, we have developed the Spatial Data Infrastructure (SDI) of the hillfort, in order to proceed subsequently to its virtualization. To implement the SDI, we have reinstated the archaeological record in its original coordinates based on the information that we had. This restitution has allowed us to perform the spatial analysis of the elements of the record, to elaborate different plans of its distribution, not only campaigns but also types, and perform at the same time, a study of the densities. Likewise, we have developed a general database of the hillfort, in which, aside of including the detailed table of the elements of the record and their coordinates, also contains the descriptive table of the stratigraphic units (SU) and the descriptive table of the wall stratigraphic units (WSU). Finally, we have built an extensive planimetry and a web page in order to spread the information. With regard to the hillfort virtualization, we have developed two consistent models with two historical stages: the Iron Age and the Roman occupation. We have used Blender for its development.</p>
Unveiling Damnatio Memoriae. The use of 3D digital technologies for the virtual reconstruction of archaeological finds and artefacts
Authors: Manferdini Anna Maria , Gasperoni Sofia , Guidi Federica , Marchesi Marinella 
Published: November 2016

<p class="VARAbstract">In ancient Rome, <em>damnatio memoriae</em> was a practice of erasing the memory of condemned persons from historical records after their death. This practice was usually addressed by the Senate to Roman elites and emperors who were declared enemies of the State, in order to preserve the honour of Rome. This condemnation usually included practices such as, for example, the erasure of names sculpted on inscriptions and the destruction or reworking of statues and of any other image of the person. Emperor Nero, for example, was condemned to this practice immediately after his death and a wide iconographic repertoire on him was therefore destroyed or deeply damaged. This lack of information can actually be improved thanks to the possibilities of virtual restoration and reconstruction offered by 3D digital technologies.</p><p class="VARAbstract">The aim of this paper is to show how the possibility to acquire 3D reality-based data from archaeological finds allows to build 3D digital models that can be analysed and managed in a virtual environment and can be relocated, assembled or restored in order to suggest or graphically support archaeologists’ interpretations and reconstructions. The paper shows the methodology developed for the virtual restoration of the statue of Nero starting from the 3D digitization of the torso that was found 500 years ago by the Roman theatre of Bologna, Italy, the ancient Bononia.</p>
3D visualization tools to explore ancient architectures in South America
Authors: Pierdicca Roberto , Malinverni Eva Savina , Frontoni Emanuele , Colosi Francesca , Orazi Roberto 
Published: November 2016

<div class="page" title="Page 1"><div class="layoutArea"><div class="column"><div class="page" title="Page 1"><div class="layoutArea"><div class="column"><p>Chan Chan is a wide archaeological site located in Peru. Its knowledge is limited to the visit of Palacio Tschudi, the only restored up to now, whilst the majority of the site remains unknown to the visitors. The reasons are manifold. The site is very large and difficult to visit. Some well-conserved architectures, such as Huaca Arco Iris, are very far from the core centre. Furthermore, there are heavy factors of decay, mainly caused by illegal excavations, by marine salt and by the devastating phenomenon of El Niño. For these reasons, the majority of the decorative elements are protected by new mud brick walls. Finally, the vastness of the buildings makes difficult to understand their real value, even through a direct visit of the site. In order to overcome the aforesaid problems, we designed, developed and realized the museum exhibition presented in this paper. We named Esquina Multimedia an installation where every corner is aimed to solve a specific problem, providing the tourists with interactive and enjoyable applications. The virtual tour allows reaching also the unreachable areas. An Augmented Reality (AR) application has been developed in order to show ancient artefacts covered by the earth. A web-browser has been specifically designed to show bas-reliefs, with HD visualization, anaglyph stereoscopic view and a 3D virtual model of both the structures and the bas-reliefs. At the same time, a wall-mounted panel representing a metric 3D reconstruction of the building helps the user to find the artefact position. Descriptions of the hardware components and of the software details are presented, with particular focus regarding the implementation of the application, arguing how the digital approach could represent the only answer towards a full exploitation of archaeological sites. The paper also deals with the implementation of a web tool, specifically designed to display and browse 3D-Models.</p></div></div></div></div></div></div>
Huurachterstand, huisuitzetting en rechterlijke besluitvorming
Authors: Vols Michel , Minkjan Nathalie 
Published: November 2016

Home interests and personal circumstances in litigation concerning eviction because of rent arrears
Recent developments in the field of housing law have led to a renewed interest in eviction and the legal protection against homelessness. Because of European case law, courts need to apply a contextual approach in which tenants’ home interests and personal circumstances are taken into account more seriously. This paper explores the ways in which home interests and personal circumstances play a role in Dutch litigation concerning eviction because of rent arrears. Based on a quantitative systematic content analysis of nearly 100 written judgments of courts of first instance, it is found that tenants frequently advance various types of proportionality defences and refer to home interests and personal circumstances. Although Dutch courts do take these defences, home interests and personal circumstances into account, the vast majority of landlords’ claims are allowed. In one third of the analysed cases, the court dismisses the landlord’s claim and most of the time minimises the breach of the lease or refers to the disproportional effects of eviction or a tenant’s promise to change his behaviour.
KEI voorbij met ODR
Authors: Reiling Dory 
Published: November 2016

ODR and its users
‘I felt so sorry for you, such a lovely tool, and then you have no users!’ This was one of the comments after my presentation of the eKantonrechter at ODR 2016, organized by HiiL in The Hague in May 2016. ODR, online dispute resolution, was presented as a tool to solve all problems in the 4th Trend Report by HIIL after the conference. Arno Lodder, in a weblog, commented that ODR had raised hopes in its early promoters, but had not really taken off.ODR is a tool to help parties in the dispute resolve their problem. There are various examples of ODR tool: supporting double blind bidding to determine a sum of money, working out divorce settlements, negotiating a solution and taking a case to court.Interesting research questions abound in the area of ODR and its users: What paths do people take when trying to resolve a problem? How can people have ownership of their court procedure? How can solutions, ODR and court procedures, best be tailored to the type of problem?ODR and its users is a field in which law and society researchers can effectively contribute to improving digital problem solving and dispute resolution procedures in court.
Aansprakelijkheidsverzekeringen: preventie door de verzekeraar en het effect op de bescherming van de verzekerde
Authors: Henskens Charlotte 
Published: November 2016

Liability insurances: prevention tools by the insurer and the effects on the protection of the insured
Liability insurances shift the financial risk of the loss of a damage from the person who is liable for the damage to the liability insurer. To avoid negligent behavior of the insured, the insurer provides different prevention tools in the insurance policy. The insurer will attach certain sanctions or rewards to certain behavior and certain circumstances in the general conditions of the insurance contract. This research raises the question of the effectiveness of these instruments. The hypothesis is that without knowledge of the insured of these sanctions or rewards, these sanctions and rewards will not form an additional incentive for careful behavior and they will have no preventive effect. Additionally, these prevention tools may undermine the protection of the insured. For this reason the legislature has limited the freedom of contract. This study examines the extent to which the legislature has limited the possibilities of the insurer to provide in prevention tools in de insurance policy. It assesses the extent to which the legislature may or may not succeed in its purpose to protect the insured, and on the other hand, where there are still possibilities for the insurer to fulfill its prevention task.