bluuebunny/crossref_metadata_2025_split huggingface dataset:
The IC in the Flexible Hybrid Electronics Technology: Flexibility and Bend Testing
Authors: Marinov Val R. 
Published: November 2017

Abstract
Flexible Hybrid Electronics (FHE) can be described as thinned, flexible silicon chips packaged on flexible circuit board (FCB) with printed conductors and passives. The flexibility of ICs can be achieved only if the thickness of the silicon is reduced to 50μm or less. The bend testing of the ultra-thin dies is a critical issue in the FHE technology as it allows to establish the fundamental relationships between the die flexural strength, die geometry, and the methods for thinning and dicing the silicon. The conventional bend tests are not adequate for testing ultra-thin dies. Presented is a semi-empirical test method, which allows for the estimation of the flexural strength of the highly compliant ultra-thin dies. The limiting Radius of Curvature (RoC) is an important parameter for the FHE device since it accounts for the bending characteristics of the entire FHE device, not only the IC. Presented is a simple analytical approach that allows to estimate the minimum RoC for an FHE assembly.
Fine Line Routing and Micro via Patterning in ABF Enabled by Excimer Laser Ablation
Authors: Hichri Habib , Fujishima Shohei , Lee Seongkuk , Arendt Markus , Nakamura Shigeo 
Published: November 2017

Abstract
Fan-Out technologies continue to be the main driver for advanced packaging, be it on wafer level (FOWLP) or panel level (FOPLP). There is a continuing need for higher density routing and heterogeneous integration of different devices, but also for continuous cost reduction. While traditional organic flip-chip substrates using semi-additive processes (SAP) have not been able to scale to ultra-fine RDL pitches and via opening below 10um, photo-sensitive spin-on dielectrics and RDL processes used for wafer level packaging do not sufficiently address the cost reduction need, and also face serious technical challenges. This paper presents the latest results from an innovative package RDL and micro via processes using excimer laser ablation in an especially developed non-photo sensitive material, to meet the market's most stringent requirements.
To enable panel and wafer based interposers to reduce RDL cost and scale interconnect pitch to 40um and below, excimer laser ablation is introduced as a direct patterning process that uses proven industrialized excimer laser sources to emit high-energy pulses at short wavelengths to remove polymer materials with high precision and high throughput. The combination of a high-power excimer laser source, large-field laser mask and precision projection optics enables the accurate replication and placement of fine resolution circuit patterns without the need for any wet-processing. With excimer laser patterning technology the industry gains a much wider choice of dielectric materials (photo and non-photo) to help achieve further reductions in manufacturing costs as well as enhancements in interposer and package performance.
In this paper, we propose a novel patterning process that uses excimer laser ablation to integrate via and RDL traces in one patterning step, followed by seed layer deposition, plating and planarization. The capability of this excimer laser patterning process in non-photo materials Ajinomoto Build-up Film, which is abbreviated to “ABF” in this paper, will be discussed, and its technical robustness and commercial advantages are demonstrated. We will present electrical and reliability data of Via and RDL traces patterned by excimer laser in ABF material.
Characterization of Ultra-Thin Epoxy-Resin Based Dielectric Substrate for Flexible Power Electronics Applications
Authors: Zhao Xin , Jagannadham K. , Reainthippayasakul Wuttichai , Lanagan Michael T. , Hopkins Douglas C. 
Published: November 2017

Abstract
Available substrate materials for power module applications has been investigated for a long time. Though Direct Bonded Copper (DBC) substrates, nowadays, have been widely applied in power electronics applications, especially power modules, due to its superior performance in mechanical ruggedness, thermal conductivity, and isolation capability. Its cost and complicated requirements during fabrication processes are always concerns in industries. At the same time, flexible electronics has become a rapidly expanding area with commercial applications including displays, medical, automotive, sensors arrays, wearable electronics, etc. This paper will initiate an investigation on a dielectric material that has potential in high power wearable electronics applications. A recently developed ultra-thin Epoxy-Resin Based Dielectric (ERBD) substrate material which is suitable for power electronic applications, is introduced. The ERBD can be fabricated with thickness as low as 80μm, with more than 5kV DC isolation capability. Its thermal conductivity is 8W/mK, higher than similar product currently available in the market. ERBD is also able to be bonded with Cu plates on both sides. In this paper, the properties of ERBD are investigated. Scanning Electron Microscope (SEM) is applied to analyze the microstructure of ERBD, and its bonding interface with Cu plates. 3-omega and Transient Thermal Reflectance methods are employed to precisely measure the thermal conductivity. Dielectric constant and loss are measured at different frequency. Simulations are applied to correct the error from the fringing effect during the measurement. The leakage current of ERBD is also measured under different voltage and temperature with DC and AC condition. Reliability tests are conducted to examine the electrical isolation and shearing strength of ERBD. The suitability of ERBD for potential flexible power electronics application is discussed based on the results from investigation of properties of the dielectric.
A Frequency Swept Low-Cost Capacitive Fringing Field PCB Sensor
Authors: Dean Robert N. 
Published: November 2017

Abstract
Reliable, low-cost sensors are important for many applications, including agriculture, pollution monitoring and weather forecasting. Commercial printed circuit board technology is being used to develop simple sensors for these applications, where the resistance or capacitance of the sensor is measured at a single frequency to determine useful information about an environmental parameter of interest. However, by measuring the complex impedance of the sensor over a wide frequency range, additional useful information can be obtained about the sensing environment. As a proof of principle, a suitable sensor was developed and evaluated in various aqueous solutions of interest using this technique. The measured sensor impedance was reduced to a capacitance versus frequency plot and a resistance versus frequency plot. Different aqueous solution chemistries resulted in characteristic signatures on these plots that could be useful in identifying the chemical compositions of the various solutions. Di-ionized water was used as a reference for chemical comparison. Various aqueous solution chemistries were then compared with DI water, resulting in corresponding signature differences of 10% to 50%.
Practical Application and Analysis of Lead-Free Solder on Chip-On-Flip-Chip SiP for Hearing Aids
Authors: Lee Youngtak , Link Doug 
Published: November 2017

Abstract
Due to rapid growth of the microelectronics industry, packaged devices with small form factors, low costs, high power performance, and increased efficiency have become of high demand in the market. To realize the current market development trend, flip chip interconnection and System-in-Package (SiP) are some of the promising packaging solutions developed. However, a surprising amount of surface mount technology (SMT) defects are associated with the use of lead-free solder paste and methods by which the paste is applied. Two such defects are solder extrusion and tombstoning. Considerable amount of defects associated with solder overflow are found on chip-on-flip-chip (COFC) SiP in hearing aids. Through the use of design of experiments (DOE), lead-free solder defect causes on hearing aids application can be better understood and subsequently reduced or eliminated. This paper will examine the failure modes of solder extrusion and tombstoning that occurred when two different types of lead-free solders, Sn-Ag-Cu (SAC) and BiAgX were used within a SiP for attachment of surface mount devices (SMD) chip components for hearing aid applications. The practical application and analysis of lead-free solder for hearing aids will include the comprehensive failure analysis of the SMD components and compare the modeling and analysis of the two different solder types through the DOE process.
Innovative Integration Solutions for SiP Packages Using Fan-Out Wafer Level eWLB Technology
Authors: Lim Jacinta Aman , Pandey Vinayak 
Published: November 2017

Abstract
Fan-Out Wafer Level Packaging (FOWLP) has been established as one of the most versatile packaging technologies in the recent past and already accounts for a market value of over 1 billion USD due to its unique advantages. The technology combines high performance, increased functionality with a high potential for heterogeneous integration and reduced overall form factor as well as cost effectiveness. The increasing complexities in achieving a higher degree of performance, bandwidth and better power efficiency in various markets are pushing the boundaries of emerging packaging technologies to smaller form factor packaging designs with finer line/width spacing as well as improved thermal/electrical performance and the integration of System-in-Package (SiP) or 3D capabilities.
SiP technology has been evolving through utilization of various package technology building blocks to serve the market needs with respect to miniaturization, higher integration, and smaller form factor as cited above, with the added benefits of lower cost and faster time to market as compared to silicon (Si) level integration, which is commonly called system-on-chip or SoC. As such, SiP incorporates flip chip (FC), wire bond (WB), and fan-out wafer-level packaging (FOWLP) as its technology building blocks and serves various end applications ranging from radio frequency (RF), power amplifiers (PA), Micro-Electro-Mechanical-Systems (MEMS) and Sensors, and connectivity, to more advanced application processors (AP), and other logic devices such as graphics processing units (GPUs)/central processing units (CPUs). FOWLP, also referred to as advanced embedded Wafer Level Ball Grid Array (eWLB) technology, provides a versatile platform for the semiconductor industry's technology evolution from single or multi-die 2D package designs to 2.5D interposers and 3D SiP configurations.
This paper presents developments in SiP applications with eWLB/Fan-out WLP technology, integration of various functional blocks such as wire bonding, Package-on-Package (PoP), 2.5D, 3D, smaller form factor, embedded passives, multiple redistribution layer routing and z-height reduction. Test vehicles have been designed and fabricated to demonstrate and characterize these low profile and integrated packaging solutions for mobile products including Internet of Things (IoT)/wearable electronics (WE), MEMS and sensors. Finer line/width spacing of 2/2mm with multiple redistribution layers (RDL) are fabricated and implemented on the eWLB platform to enable higher interconnect density and signal routing. Assembly process details, component level reliability, board level reliability and characterization results for eWLB SiP will be discussed.
Using SPICE to Model Nonlinearities Resulting from Heterogeneous Integration of Complex Systems
Authors: Beal Aubrey N. , Dean Robert N. 
Published: November 2017

AbstractComplex systems have been modeled using SPICE. This modeling allows extension of the linear models of Si MEMS into the nonlinear regime. Previously, such analysis involved many different simulation tools. These SPICE simulation methods allow for modeling nonlinear devices alongside their supporting electronics in one simulator. Nonlinear spring constants have been modeled using SPICE and it is shown that bifurcation occurs due to large amplitude excitation. This results in nonlinear and even chaotic oscillations similar to those found in the Duffing oscillator.
Embedded Passive Circuit Elements in Low Temperature Co-Fired Ceramic Substrates for Aerospace Electronics
Authors: Smarra Devin A. , Subramanyam Guru , Chodavarapu Vamsy P. , Gogineni Sivaram P. , Semega Kenneth J. , Behbahani Alireza R. 
Published: November 2017

Abstract
The packaging technology plays a critical role in the development of environmentally robust microelectronic systems. There is great demand for microelectronic systems that can withstand harsh environments and high temperatures in numerous applications including down-hole drilling, geothermal drilling, aerospace, heavy industrial, and automotive industries. In these applications, both sensors and interface electronics could be subjected to temperatures of 200°C and beyond. Standard plastic or epoxy based printed circuit boards are not reliable at these temperatures for long term operation. Packaging techniques such as Low Temperature Co-fired Ceramic (LTCC) offer a versatile and reliable alternative to form electronic substrates. LTCC is a multi-layer packaging system that also provides the ability to embedded passive components, such as resistors and capacitors, and thermal management structures within the substrate. This work evaluates the performance of LTCC embedded passive elements from 25°C to 225°C. A variety of passive component designs are evaluated using theoretical calculations, simulations, and measurements of fabricated test structures.
Hypertension: Focus on Olmesartan Medoxomil
Authors: Bell Allison M. , Nykamp Diane 
Published: November 2017

Hypertension is the leading cause of stroke, heart failure, and ischemic heart disease. One of the key regulators of blood pressure is the renin-angiotensin aldosterone system (RAAS). Olmesartan medoxomil, an angiotensin receptor blocker (ARB), counteracts some of the primary effects of the RAAS by selectively and irreversibly binding to the type 1 angiotensin II receptor (AT1-R). The pharmacokinetic profile of this ARB allows for the convenience of one a day dosing. The pharmacodynamic profile of olmesartan is favorable because it is neither metabolized by, induces, nor inhibits the CYP450 isozyme system. The metabolism of the prodrug to the active form occurs in the gut by the enzyme arylesterase. No further metabolism and a lack of interaction with the CYP450 isozyme system leads to very few drug interactions with olmesartan medoxomil. Numerous studies have been conducted to evaluate the efficacy, safety, and tolerability of olmesartan medoxomil. Studies have been conducted to compare olmesartan medoxomil to other angiotensin receptor blockers. The efficacy of olmesartan medoxomil has been compared to other classes of antihypertensive agents. Results of all trials have proven non-inferiority of olmesartan medoxomil to other antihypertensive agents; some studies have shown superior blood pressure control provided by olmesartan medoxomil when starting dosages are evaluated. Overall, olmesartan medoxomil has the potential to facilitate the achievement of blood pressure goals, enhance compliance with a once daily dosing regimen, and is associated with minimal side effects. Olmesartan medoxomil has been proven to be a safe and effective antihypertensive drug when compared to other ARBs and other antihypertensive agents.
Time Course Analysis of Aminoglycoside-Induced Elevation of Serum Creatinine
Authors: Sweileh Waleed M. 
Published: November 2017

Objective The present study aimed to determine the time course of aminoglycoside-induced serum creatinine (SCr) elevation and compare that in patients treated with amikacin (AK) and those treated with gentamicin (GM). Methodology A one-year, non-interventional prospective study of patients with normal baseline renal function and were administered either GM or AK. The study was carried out at the internal medicine department of Al-Watani governmental hospital. Outcome of interest was the time course of serum creatinine elevation during the course of aminoglycoside therapy. Data were entered and analyzed using Statistical Package for Social Sciences (SPSS 16). Results The study was performed in 94 patients, who had to be administered GM or AK by intravenous injections. In both groups, the significant rise in SCr was detected on the 4th day of therapy. However, GM induced up to 32% increase while AK induced up to 19.5% increase in SCr from baseline levels. In the course of AK treatment, patients on single dosing frequency and those <65 years of age did not show a significant increase in SCr levels during the 6-day therapy. In the course of GM therapy, patients on single frequency dosing, younger patients and females showed a significant elevation in SCr on the 5th day while elderly, males and those on multiple dosing showed a significant elevation on the 4th day of therapy. However, all patient categories on GM therapy showed similar extent of SCr elevation. Conclusion In patients with normal renal function, GM and AK showed similar time course but different extent of SCr elevation. Amikacin induced no SCr elevation when given in single dosing frequency or when given to younger patients. Such effects were not observed with GM.
On the Size of an Expression in the Nyman–Beurling-Báez–Duarte Criterion for the Riemann Hypothesis
Authors: Maier Helmut , Rassias Michael Th. 
Published: November 2017

AbstractA crucial role in the Nyman–Beurling–Báez-Duarte approach to the Riemann Hypothesis is played by the distancewhere the infimum is over all Dirichlet polynomialsof length N. In this paper we investigate under the assumption that the Riemann zeta function has four nontrivial zeros off the critical line.
Outcome of Evidence-based Allocation of Single-dose Antibiotic extended to Three-dose Antibiotic Prophylaxis in Surgical Site Infection
Authors: Jogdand Sangita , Shinde Raju , Chandrakar Naman 
Published: November 2017

Abstract
Aim: To study the outcome of evidence-based allocation of single-dose antibiotic extended to three-dose antibiotics prophylaxis in surgical site infection (SSI).
Materials and methods: A total of 183 clean surgical procedures in all age groups and of both genders with encountered comorbidities were included in the study. Surgical procedures like inguinal hernia, primary vaginal hydrocele, congenital hernia and hydrocele, fibroadenoma, and other surface swellings were targeted procedures. These procedures were of <1 hour duration and American Society of Anesthesiologists (ASA) grades I and II in study population. Ceftriaxone with sulbactam 1.5 gm was prophylactic antibiotic given 1 hour prior to incision. Excess local signs for inflammation were observed strictly for extension of antibiotics to three doses or multiple doses.
Results: Success of evidence-based policy of randomization to single or three doses was 76.5% in all patients, and converting to three doses was 85.7%. Favorable outcome was seen in the patients with comorbidities—76.19% in hypertension, 57.14% in diabetes, and 28.57% in obesity. Only 14.3% of overall patients required extended multiple dose antibiotic therapy, which clearly projects that evidence-based policy implementation was effective in reducing number of doses.
Conclusion: Evidence-based flexible antibiotic dose is effective in commonly performed procedures even with comorbidities. Flexibility depending on local signs to modify dose policy gives piece of mind with excellent outcome.
Clinical significance: Adopting flexible antibiotic dosing reduces cost of antibiotics therapy with positive mindset for accepting reduced numbers of doses without affecting the outcome of surgical procedure.
Utility of GeneXpert in Diagnosis of Multidrug-resistant Extrapulmonary Tuberculosis
Authors: Chaudhary Ankush , Utpat Ketaki , Desai Unnati , Joshi Jyotsna 
Published: November 2017

ABSTRACT
Background: The Xpert Mycobacterium tuberculosis (MTB)/rifampicin (RIF) assay (GeneXpert) is a rapid semi-quantitative nucleic acid amplification test with established role in the diagnosis of pulmonary tuberculosis (PTB) and multidrug-resistant (MDR) PTB. We determined the performance of the GeneXpert assay for the diagnosis of extrapulmonary tuberculosis (EPTB) MDR cases.
Aims and objectives: To study the role of GeneXpert in the diagnosis of EPTB MDR.
Materials and methods: A retrospective study was conducted over a period of 2 years at a tertiary care hospital after Ethics Committee permission. Data of 44 consecutive patients of diagnosed EPTB MDR were retrieved for GeneXpert and culture drug susceptibility test (DST). Sensitivity of GeneXpert in the diagnosis of EPTB MDR was calculated comparing culture DST results.
Results: Various EPTB MDR cases studied were lymph node TB (n = 23) 51%, pleural effusion (n = 14) 32%, central nervous system TB/spinal TB/psoas abscess/gluteal abscess (n = 7) 17%. Sensitivity for GeneXpert was found to be 91.30, 57, 100% respectively. True positive and false negative were 36 and 8 cases respectively. The overall sensitivity of GeneXpert in diagnosing EPTB MDR was 81.80%. The sensitivity among lymph node, pleural effusions, and spinal/psoas abscess/gluteal abscess was 91.30, 57.14, and 100% respectively.
Conclusion: GeneXpert sensitivity for the diagnosis of EPTB MDR varied with site of extrapulmonary involvement, with lower sensitivity in pleural fluid as compared with higher sensitivity among lymph node and spine TB. Nevertheless, given the rapid turnaround time and simplicity, it is a useful tool in the diagnosis of EPTB MDR when used in correct clinical context. Subsequent confirmation with culture DST, however, is recommended to diagnose false negatives.
A Study to Compare Antigen-based Enzyme-linked Immunosorbent Assay, Rapid Method, and Microscopy for Detection of Malaria in Blood Donors to prevent Transfusion-transmitted Malaria
Authors: Shrivastava Manisha , Nirankari Priya , Singh Sangita , Navaid Seema 
Published: November 2017

Abstract
Introduction: In malaria-endemic countries, blood donors with low parasitemia may be missed at the time of screening of blood units leading to the consequences like hemolysis, morbidity, and even mortality in nonimmune transfusion recipient. This study aimed to compare peripheral blood smear (microscopy), rapid diagnostic test (RDT), and antigen detection enzyme-linked immune sorbent assay (ELISA) for the detection of Plasmodium spp. in blood donors to prevent transfusion-transmitted malaria (TTM).
Materials and methods: Samples from 100 eligible blood donors coming to donate blood at the Bhopal Memorial Hospital & Research Center blood bank were collected in ethylenediaminetetraacetic acid vial. Light microscopic examination on both thin and thick smears, RDT, and PAN-specific lactate dehydrogenase antigen detection ELISA were performed on the blood samples and the results were compared.
Results: None of the blood smears or samples from the 100 blood donors screened showed malarial parasitemia or positive result.
Conclusion: In India, the current strategy of testing blood donors is mainly restricted to microscopy and some blood banks have adapted rapid methods for antigen detection. A larger study on large sample size should be conducted to determine the most appropriate and effective malarial screening test in blood donors and, most importantly, to suggest a workable national screening policy for prevention of TTM in transfusion recipients.
Clinical significance: For screening blood units for malaria, currently available testing methodologies need to be studied in comparison with the assays with better sensitivity for increasing blood safety and reducing the complications of transmission of malaria to patients through blood transfusions.