bluuebunny/crossref_metadata_2025_split huggingface dataset:
Fear of donation‐related stimuli is reported across different levels of donation experience
Authors: France Christopher R. , France Janis L. 
Published: October 2017

BACKGROUNDThis study aimed to characterize the extent of donation‐related fears among donors with different levels of donation experience.STUDY DESIGN AND METHODSA sample of 1054 recent donors (48.3% female; mean ± SD age 33.1 ± 9.8 years) completed an anonymous, online survey of their fear of donation‐related stimuli, including blood, needles, pain, and fainting. Respondents also provided information regarding demographics, pain, and vasovagal symptoms associated with their recent donation and confidence and intention with respect to a future donation.RESULTSThe sample was divided into four donation history subgroups, including one, two or three, four or five, or six or more prior donations. A significant negative relationship was observed between donation history and each of the assessed fears, indicating less fear with more experience. However, at least one‐third of even the most experienced donors reported some fear for each of the stimuli. Further, greater fear was associated with more pain (r = 0.35–0.56, all p < 0.001) and more intense vasovagal symptom reports (r = 0.41–0.61, all p < 0.001). Finally, greater fear was associated with less donor confidence (r = –0.24 to –0.33, all p < 0.001) and lower intentions of donating again (r = –0.14 to –0.20, all p < 0.001).CONCLUSIONThese data provide novel evidence that fear persists for many donors, despite increasing experience, and suggest that a greater appreciation of individual differences in fear is needed to address these concerns and promote long‐term donor motivation.
Nonhemolytic passenger lymphocyte syndrome
Authors: Sandler S. Gerald , Han Suhua , Langeberg Albert , Matsumoto Cal , Fishbein Thomas M. 
Published: October 2017

BACKGROUNDAn 8‐month‐old recipient of a liver segment transplant had anti‐D detected for the first time in her Day 5 posttransplant plasma and anti‐C detected for the first time in her Day 55 posttransplant plasma. The donor's plasma contained anti‐C and anti‐D. Clinical and laboratory findings established a diagnosis of passenger lymphocyte syndrome (PLS). Hemolysis did not occur, because the recipient's blood group phenotype was, by chance, D– C–.STUDY DESIGN AND METHODSTo evaluate contemporary practice for diagnosing PLS, we conducted a retrospective 10‐year literature review.RESULTSThere were 31 studies (63 cases) of PLS of which eight cases (four studies) were hematopoietic stem cell and 55 (27 studies) were organ transplants. All eight (100%) hematopoietic stem cell and 52 (95%) organ transplants were associated with hemolysis. Of the four studies of hematopoietic stem cell PLS, three actively screened for posttransplant blood group antibodies. Of 27 studies of organ PLS, one actively screened for antibodies. Antibody screens detected five cases of hematopoietic stem cell PLS before hemolysis was apparent and two cases of organ PLS with antibodies without hemolysis.CONCLUSIONFocusing on hemolysis, without a comparable effort to detect donor‐derived antibodies diverts from the primary pathophysiology of PLS and limits capturing the full scope of the syndrome. Recognition of hemolytic and nonhemolytic subcategories of PLS is recommended. When feasible, an antibody screen performed on the donor's plasma when collecting the hematopoietic stem cells or before an organ harvest could result in an alert that the donor has formed an alloantibody(s) and the recipient is a risk for PLS. Alternatively, a routine antibody screen performed on the recipient's plasma 1 week posttransplant and, if negative, repeated 3 to 5 weeks posttransplant would detect any donor‐derived antibodies and improve alignment of clinical practice with the pathophysiology of PLS.
Use of the blood substitute HBOC‐201 in critically ill patients during sickle crisis: a three‐case series
Authors: Davis Jonathan M. , El‐Haj Nura , Shah Nimish N. , Schwartz Garry , Block Margaret , Wall James , Tidswell Mark , DiNino Ernest 
Published: October 2017

BACKGROUNDRed blood cell (RBC) transfusion is an important treatment modality during severe sickle cell crisis (SCC). SCC patients who refuse, or cannot accept, RBCs present a unique challenge. Acellular hemoglobin (Hb)‐based oxygen carriers (HBOCs) might be an alternative for critically ill patients in SCC with multiorgan failure due to life‐threatening anemia. HBOC‐201 (HbO2 Therapeutics) has been administered to more than 800 anemic patients in 22 clinical trials, but use of any HBOCs in critically ill sickle cell patients with organ failure is exceedingly rare. In the United States, HBOC‐201 is currently only available for expanded access.CASE REPORTWe report three cases of HBOC‐201 administered to critically ill sickle cell disease patients in SCC with multiorgan failure, either who refused RBCs (Jehovah's Witnesses) or for whom compatible RBCs were not available.RESULTSTwo patients received more than 20 units of HBOC‐201, while the other received 6. The 27 units used in the third case equals the largest volume a patient has successfully received to date. All three patients survived to hospital discharge.CONCLUSIONThese reports suggest that blood substitutes such as HBOC‐201 can provide an oxygen bridge in SCC with multiorgan failure, until corpuscular Hb levels recover to meet metabolic demand, and highlight the compelling biochemical properties that warrant further investigation.
Control of canine idiopathic nasal hyperkeratosis with a natural skin restorative balm: a randomized double‐blind placebo‐controlled study
Authors: Catarino Mathilde , Combarros‐Garcia Daniel , Mimouni Philippe , Pressanti Charline , Cadiergues Marie C. 
Published: October 2017

BackgroundNasal hyperkeratosis may cause discomfort in dogs by predisposing them to fissures and secondary bacterial infection. Approaches to treatment have been described anecdotally; the effectiveness of such therapies remains unproven.Hypothesis/ObjectivesTo investigate the efficacy of a balm containing essential oils and essential fatty acids in dogs with idiopathic nasal hyperkeratosis.AnimalsClient‐owned dogs with noncomplicated nasal hyperkeratosis.MethodsThe study was conducted as a randomized, double‐blind, placebo‐controlled clinical trial with parallel group design and two month follow‐up period. Dogs received daily topical application of a commercial balm product (group DBB) or placebo (aqueous gelling agent with preservatives, group PB). The main outcome variables were lichenification, dryness, suppleness and extent of lesions. Subjective owner satisfaction index score was a secondary variable. Evaluation was performed on days (D)0, 30 and 60. Response to treatment was assessed as the change from baseline to each examination day for each criterion.ResultsForty eight dogs, principally French (26 of 48) and English (seven of 48) bulldogs, were included and 39 completed the study. No major adverse events were reported. On D60, changes from baseline for lichenification, lesion extent, suppleness and total score were −31.2%, −18.3%, −72.8% and −36.8% in group DBB (23 dogs) and −11.9%, 2.3%, −42.1% and −14% in group PB (16 dogs), respectively. The total score was significantly improved on D60 in group DBB compared to PB (Wilcoxon–Mann–Whitney U‐test, P = 0.0016).Conclusions and clinical importanceThe balm proved safe and helpful in managing canine idiopathic noncomplicated nasal hyperkeratosis.
The progressive form in learner Englishes: Examining variation across corpora
Authors: MERILÄINEN LEA 
Published: October 2017

ABSTRACTThis article examines the English progressive form and its functions in learner English, thereby addressing the call by Mukherjee and Hundt (2011) to bring Expanding Circle Englishes and the parallels between English as a foreign language (EFL) and English as a second language (ESL) onto the agenda of English linguistics. By comparing the frequencies and functions of the progressive form in corpus data from different types of learners, this study investigates the variation induced by L1‐influence, mode of communication, proficiency differences and differing degrees of exposure to English. The results reveal similarities between learner English and both second language and native language Englishes, and support the notion of a continuum between learner English and second language varieties of English.
Prevalence, antimicrobial resistance profile and comparison of selective plating media for the isolation of Salmonella in backyard chickens from Entre Rios, Argentina
Authors: Rodríguez F. I. , Pascal D. C. , Pulido D. , Osinalde J. M. , Caffer M. I. , Bueno D. J. 
Published: October 2017

SummaryThis study was conducted to estimate the apparent prevalence of Salmonella spp. in birds kept under backyard system in Entre Ríos, Argentina, and determine the performance of two selective plating media used for Salmonella isolation, and the antimicrobial resistance of the isolated. Also, the association of farms characteristics with Salmonella presence was evaluated. A total of 657 backyard chickens and 15 gooses were sampled one time by cloacal swab, belonging to 51 and one family farms, respectively, and four counties in Entre Rios state from April 2014 to May 2015. Only four samples from backyard chickens belonged to three family farms from Uruguay County were positive to Salmonella spp., so the apparent prevalence was 0.6% for this kind of chicken. Four serovars were isolated (Salmonella ser. Lille, S. ser. Newport, S. ser. Enteritidis and S. ser. Rissen), which were susceptible to all antibiotics tested with the exception of erythromycin. For Hektoen enteric agar and brilliant green agar, relative specificity and positive predictive value were 1, and the relative sensitivity and negative predictive value did not show any difference between them. The agreement was very good between these two plating media. None of the variables studied could be selected to calculate the risk factors associated with Salmonella isolation because p > .15. Although the prevalence of Salmonella spp. is low in backyard birds in Entre Rios, the presence of S. ser. Enteritidis should not be discounted, because it is found in the county that concentrates a large population of intensive poultry production in the state.
Thermal Performance Evaluation of Three Types of Novel End-of-Aisle Cooling Systems
Authors: Sahini Manasa , Agonafer Dereje , Pandiyan Vijayalan 
Published: October 2017

Data centers house a variety of compute, storage, network IT hardware where equipment reliability is of utmost importance. Heat generated by the IT equipment can substantially reduce its service life if Tjmax, maximum temperature that the microelectronic device tolerates to guarantee reliable operation, is exceeded. Hence, data center rooms are bound to maintain continuous conditioning of the cooling medium becoming large energy consumers.
The objective of this work is to introduce and evaluate a new end-of-aisle cooling design which consists of three cooling configurations. The key objectives of close-coupled cooling are to enable a controlled cooling of the IT equipment, flexible as well as modular design, and containment of hot air exhaust from the cold air. The thermal performance of the proposed solution is evaluated using CFD modeling. A computational model of a small size data center room has been developed. Larger axial fans are selected and placed at rack-level which constitute the rack-fan wall design. The model consists of 10 electronic racks each dissipating a heat load of 8kw. The room is modeled to be hot aisle containment i.e. the hot air exhaust exiting for each row is contained and directed within a specific volume. Each rack has passive IT with no server fans and the servers are cooled by means of rack fan wall. The cold aisle is separated with hot aisle by means of banks of heat exchangers placed on the either sides of the aisle containment. Based on the placement of rack fans, the design is divided to three sub designs — case 1: passive heat exchangers with rack fan walls; case 2: active heat exchangers (HXs coupled with fans) with rack fan walls; case 3: active heat exchangers (hxs coupled with fans) with no rack fans. The cooling performance is calculated based on the thermal and flow parameters obtained for all three configurations. The computational data obtained has shown that the case 1 is used only for lower system resistance IT. However, case 2 and Case 3 can handle denser IT systems. Case 3 is the design that can consume lower fan energy as well as handle denser IT systems. The paper also discusses the cooling behavior of each type of design.
Large Flip Chip Assembly Challenges and Risk Mitigation Process
Authors: Plunkett Jeremy , Subramaniam Suresh , Islam Nokibul , KeonTaek Kang , SeonMo Gu , Ouyang Eric 
Published: October 2017

Next generation high speed network/communication packages require much larger die sizes and increased ball counts (>3000) to meet high speed, high input/output (I/O) functionality and improved reliability performance. Demand for such high speed large flip chip packages create an opportunity for highly integrated multi-chip modules (MCM’s) and 2.5D/3D silicon (Si) interposer packages which are gradually emerging to meet these requirements. Achieving both increased margins in the power delivery network and increased functionality in next generation high speed network/communication applications requires extremely efficient, low loss package designs with body sizes 50×50mm or larger. One of the biggest challenges for such large die, large body packages is how effectively the assembly risk can be mitigated while fulfilling long term package reliability and functionality. The work presented in this paper describes key factors for mitigating several assembly related issues in the industry, including package warpage/co planarity, and the identification of the optimum processes and materials for successfully manufacturing large body flip chip packages with high assembly yields.
As the body sizes and die sizes increase, the chip-to-package interaction failure risk increases significantly due to a larger distance to neutral point (DNP). Typical assembly risks are extreme low-k (ELK) delamination (white bumps) during the chip joining process, bump tearing or cracking, underfill delamination, and warpage issues. A comprehensive experiment was carried out to achieve the objective of the work. A test vehicle was developed using a 21×22mm2, flip chip copper (Cu) column bumped die placed onto a 50×50mm body size, using a multi-layer substrate with full array BGA footprint and ample passive components in the package. Processes were developed to optimize assembly yield and package reliability, including an extensive board level reliability test. Assembly materials were selected to achieve excellent assembly yield, high thermo-mechanical reliability, and increased package functionality.
Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations
Authors: Ong Chin L. , Amalfi Raffaele L. , Marcinichen Jackson B. , Lamaison Nicolas , Thome John R. 
Published: October 2017

Nowadays, datacenters heat density dissipation follows an exponential increasing trend that is reaching the heat removal limits of the traditional air-cooling technology. Two-phase cooling implemented within a gravity-driven system represents a scalable and viable long-term solution for datacenter cooling in order to increase the heat density dissipation with larger energy efficiency and lower acoustic noise. The present article builds upon the 4-part set of papers presented at ITHERM 2016 for a 15-cm height thermosyphon to cool a contemporary datacenter cabinet, providing new test data over a wider range of heat fluxes and new validations of the thermal-hydrodynamics of our thermosyphon simulation code.
The thermosyphon consists of a microchannel evaporator connected via a riser and a downcomer to a liquid-cooled condenser for the cooling of a pseudo-chip to emulate an actual server. Test results demonstrated good thermal performance coupled with uniform flow distribution for the new larger range of operating test conditions. At the maximum imposed heat load of 158 W (corresponding to a heat flux of 70 W cm−2) with a water inlet coolant at 20 °C, water mass flow rate of 12 kg h−1 and thermosyphon filling ratio of 78%, the pseudo mean chip temperature was found to be 58 °C and is well below the normal thermal limits in datacenter cooling.
Finally, the in-house LTCM’s thermosyphon simulation code was validated against an expanded experimental database of about 262 data points, demonstrating very good agreement; in fact, the pseudo mean chip temperature was predicted with an error band of about 1 K.
Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles
Authors: Athavale Jayati D. , Joshi Yogendra , Yoda Minami 
Published: October 2017

This paper presents an experimentally validated room-level computational fluid dynamics (CFD) model for raised-floor data center configurations employing active tiles. Active tiles are perforated floor tiles with integrated fans, which increase the local volume flowrate by redistributing the cold air supplied by the computer room air conditioning (CRAC) unit to the under-floor plenum. In a previous study [1], experiments were conducted to explore the potential of active tiles for economically and efficiently eliminating hot spots in data center. Our results indicated that active tiles, as the actuators closest to the racks, can significantly and quickly impact the local distribution of cooling resources. They could therefore be used in an appropriate control framework to rapidly mitigate hot spots, and maintain local conditions in an energy-efficient manner.
The numerical model of the data center room operates in an under-floor supply and ceiling return cooling configuration and consists of one cold aisle with 12 racks arranged on both sides and three CRAC units sited around the periphery of the room. The commercial computational fluid dynamics (CFD) software package Future Facilities 6SigmaDCX [2], which is specifically designed for data center simulation, is used to develop the model. First, a baseline model using only passive tiles was developed and experimental data were used to verify and calibrate plenum leakage for the room. Then a CFD model incorporating active tiles was developed for two configurations: (a) a single active tile and 9 passive tiles in the cold aisle; and (b) an aisle populated with 10 (i.e., all) active tiles. The active tiles are modeled as a combination of a grill, fan elements and flow blockages to closely mimic the actual active tile used in the experimental studies. The fan curve for the active tile fans is included in the model to account for changes in flow rate through the tiles in response to changes in plenum pressure.
The model with active tiles is validated by comparing the flow rate through the floor tiles, relative plenum pressure and rack inlet temperatures for selected racks with the experimental measurements. The predictions from the CFD model are found to be in good agreement with the experimental data, with an average discrepancy between the measured and computed values for total flow rate and rack inlet temperature less than 4% and 1.7 °C, respectively. These validated models were then used to simulate steady state and transient scenarios following cooling failure.
This physics-based and experimentally validated room-level model can be used to predict temperature and flow distributions in a data center using active tiles. These predictions can then be used to identify the optimal number and locations of active tiles to mitigate hot spots, without adversely affecting other parts of the data center.
Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading
Authors: Gonzalez-Nino David , Boteler Lauren M. , Jankowski Nicholas R. , Ibitayo Dimeji , Quintero Pedro O. 
Published: October 2017

Metallic phase change materials (PCMs) have been demonstrated as an excellent alternative to act as a passive cooling system for pulse power applications. The possibility of integrating metallic PCMs, directly on top of a heat source, reducing the thermal resistance between the device and the cooling solution, could result in a significant improvement in thermal management for transient applications. However, the effectiveness of this method of implementation will depend on the quality of the interface between the metallic PCM and the heat source.
For this work, a metallic PCM (49Bi/18Pb/12Sn/21In-Bi/Pb/Sn/In for simplicity) was placed directly on top of a device that has a layer of silicon nitride on the top. The device was pulsed with powers of 40W – 160W (84W/cm2 – 338W/cm2) with a 20 ms duration. After reaching the maximum power, the device was pulsed for a second cycle, and the temperature profiles were compared. Micrographical inspections, at the interlayer between the silicon nitride and metallic PCM, were performed before and after the pulses and compared.
A maximum temperature of ≈20–25% higher was observed in the performance (at 80W) after pulse cycling. A visual inspection at the mating surfaces, between the metallic PCM and device, showed a clear difference between the contact surfaces before and after pulses. Significant voiding at the PCM interfacial layer was observed after cyclic loading which is believed to be the cause of the recorded increment in maximum temperature.