bluuebunny/crossref_metadata_2025_split huggingface dataset:
AKTIVITAS PEMULIAAN TANAMAN DALAM PERAKITAN KLON KARET UNGGUL DI INDIA
Authors: Sayurandi Sayurandi 
Published: November 2016

India merupakan salah satu negara penghasil karet alam di dunia. Rubber Research Institute of India (RRII) terus berusaha meningkatkan produksi karet nasional antara lain melalui peningkatan produktivitas klon. Kegiatan pemuliaan dan seleksi di lembaga penelitian ini telah dilakukan sejak tahun 1954. Beberapa kegiatan pemuliaan tanaman yang telah dan sedang dilakukan adalah hibridisasi dari tetua unggul populasi Wickham 1876, seleksi ortet dan tanaman hasil hibridisasi, pengujian genotipe unggul, identifikasi klon berdasarkan morfologi, studi propagasi tanaman, pembangunan kebun biji, studi genetika dan biologi tanaman, dan evaluasi klon-klon karet hasil introduksi. Pemanfaatan plasma nutfah karet hasil koleksi IRRDB 1981 juga menjadi kegiatan penting di lembaga penelitian ini. Hasil evaluasi dari koleksi IRRDB 1981 menunjukkan bahwa beberapa genotipe hasil seleksi memiliki pertumbuhan tanaman jagur, ketahanan biotik dan abiotik yang cukup baik seperti resisten terhadap penyakit daun, toleran terhadap cekaman suhu dingin dan kekeringan. Dari hasil pengujian klon RRII seri 400 menunjukkan bahwa klon RRII 422 dan RRII 430 memiliki potensi hasil lateks paling tinggi > 50 g/p/s. Klon tersebut juga tergolong cukup resisten terhadap penyakit daun.
PRODUKTIVITAS KLON KARET IRR SERI 100 DAN 200 PADA BERBAGAI AGROKLIMAT DAN SISTEM SADAP
Authors: Daslin Aidi 
Published: November 2016

Penggunaan klon-klon karet unggul untuk penanaman komersial di perkebunan secara nyata dapat meningkatkan produktivitas tanaman. Berdasarkan hasil lapangan, produksi aktual selalu tidak mencapai potensi produksi klon. Hal ini disebabkan adanya pengaruh genetik lingkungan, maupun interaksi genetik dan lingkungan. Faktor lingkungan terkait dengan berbagai kondisi agroekosistem penanaman (agroklimat) serta perlakuan manajemen tanaman. Dalam upaya optimalisasi potensi produksi klon, dilakukan observasi kinerja klon IRR seri-100 dan seri-200 pada berbagai lingkungan agroklimat dan sistem sadap. Hasil evaluasi memperlihatkan adanya respon klon yang berbeda terhadap tiga agroklimat (daerah dengan curah hujan rendah, sedang dan tinggi) serta dua sistem penyadapan (½S d/2 dan ½S d/3. 2,5%ET). Klon terbaik dari IRR seri-100 adalah IRR 112 yang sesuai dikembangkan untuk kondisi lingkungan agroklimat kering, sedang, dan basah dengan rata-rata produktivitas dari tiga tahun sadap antara 2.141-2.734 kg/ha/tahun dan IRR 118 sesuai untuk agroklimat kering dengan produktivitas 2.200 kg/ha/tahun. Untuk IRR seri-200, klon IRR 208 sesuai dikembangkan pada daerah agroklimat kering dan sedang, dengan produktivitas sebesar 2.260 kg/ha/tahun, klon IRR 209 dan IRR 216 sesuai untuk agroklimat basah dengan produktivitas masing-masing 2.496 dan 2.393 kg/ha/tahun, sedangkan IRR 220 beradaptasi baik pada lingkungan agroklimat sedang dan basah dengan produktivitas 2.017-2.340 kg/ha/tahun. Klon IRR 112 dan IRR 118 memperlihatkan respon yang baik dengan penggunaan sistem sadap ½S d/2, dengan rata-rata produktivitas dari sembilan tahun sadap masing-masing adalah sebesar 2.499 dan 2.030 kg/ha/tahun. Klon IRR seri-200 yang memiliki rata-rata produktivitas terbaik dari tujuh tahun penyadapan dengan sistem sadap ½S d/2 adalah IRR 208 (2.273 kg/ha/tahun), IRR 212 (2.370 kg/ha/tahun) dan IRR 220 (2.304 kg/ha/tahun), dan dengan penyadapan ½S d/3. ET 2,5% adalah IRR 202 (2.634 kg/ha/tahun) dan IRR 207 (2.096 kg/ha/tahun).
KOMPARASI TEKNIS DAN FINANSIAL PENGADAAN BENIH MELALUI OKULASI TANAMAN DI POLIBEG DENGAN OKULASI DI LAPANGAN
Authors: Siagian Nurhawaty 
Published: November 2016

Benih karet untuk penanaman komersial umumnya adalah benih dalam polibeg yang diproduksi melalui okulasi batang bawah (umur ± 7 bulan) di pembibitan lapangan dan diikuti pembibitan di polibeg. Okulasi batang bawah yang masih muda (umur 3,5- 5 bulan) di pembibitan lapangan jarang dilakukan karena tingkat kematian setelah ditanam di polibeg tinggi dan pada lahan beriklim kering keragaman pertumbuhan tanaman di lapangan besar sehingga memperlambat tercapainya kriteria matang sadap. Okulasi tanaman muda biasanya hanya dilakukan di pembibitan polibeg dengan maksud mengatasi kelemahan tersebut diatas. Tulisan ini bertujuan untuk membandingkan pengadaan benih karet melalui okulasi tanaman muda di polibeg dengan okulasi di lapangan ditinjau dari segi teknis dan finansial. Penelitian dilakukan di salah satu perkebunan besar di Sumatera Utara, dengan mengamati langsung aspek teknis dan norma kerja. Data pendukung pertumbuhan tanaman di lapangan disetir dari berbagai penelitian terdahulu.Hasil penelitian menunjukkan bahwa keunggulan penggunaan benih hasil okulasi tanaman muda (berumur 3,5-5 bulan) di pembibitan polibeg dibandingkan dengan penggunaan benih diperoleh dengan cara okulasi di pembibitan lapangan adalah 1) biaya pengadaan bahan tanam lebih hemat 17%, 2) tanaman lebih mampu bertahan pada kondisi kering saat penanaman di lapangan 3) untuk pembangunan kebun karet dengan luasan tertentu dibutuhkan areal pembibitan yang lebih sedikit 4) penurunan biaya produksi tidaklah mengorbankan pertumbuhan lilit batang untuk mencapai matang sadap dan 5) untuk menghasilkan benih berpayung daun dua dibutuhkan waktu 3,5 bulan lebih singkat pada pembibitan langsung di polibeg. Untuk menjamin keberhasilan pembibitan langsung di polibeg, sangat diperlukan air yang cukup sepanjang masa pembibitan, mata okulasi dari tunas muda, juru okulasi yang terampil dan polibeg yang berkualitas baik.
Microbial evaluation of the effectiveness of different methods for cleansing clear orthodontic retainers: A randomized clinical trial
Authors: Albanna Rehaf H. , Farawanah Hisham M. , Aldrees Abdullah M. 
Published: November 2016

ABSTRACTObjective:To compare effectiveness of brushing an Essix retainer with water only and brushing followed by soaking in one of three commercial cleansing tablets.Materials and Methods:A double-blind, parallel, randomized clinical trial with a split-mouth design was completed with 60 volunteers with specific eligibility criteria assigned to three groups to compare the cleansing effectiveness of brushing an Essix retainer with water only, followed by soaking in one of three alkaline peroxide–based commercial cleansing tablets (Retainer Brite®, Kukis®, and Corega®). Each participant wore an upper Essix retainer (with an electronic microsensor) on a full-time basis for 14 days and used one of the three products on one side of the retainer for 15 min/d. The effectiveness of the cleansing tablets was tested by the scanning electron microscopy, bacterial identification, bacterial quantification, and disk diffusion methods.Results:Bacterial quantification tests demonstrated nonsignificant statistical differences between the control and test sides of the three cleansing tablets: Retainer Brite®, Kukis®, and Corega® (Mann-Whitney test P-values were .6, .37, and .5, respectively). A Kruskal-Wallis test also showed nonstatistical difference in the bacterial counts between the three groups (P-value = .5). In vitro tests showed a minimal inhibition zone of Staphylococcus epidermidis only with Corega® tablets.Conclusions:Using chemical cleansing tablets after mechanical cleansing did not significantly reduce the bacterial count in Essix retainers when compared to use of mechanical cleansing alone. However, the tablets seem to be effective against “cocci” bacterial species.
Development and Challenges of Warpage for Fan-Out Wafer-Level Package Technology
Authors: Chan Mu-Hsuan , Wang Yu-Po , Chang Ivan , Chiang James , Pan George , Kao Nicholas , Wang David 
Published: November 2016

Abstract
Fan-out wafer-level-packaging (FO-WLP) technology has been widely investigated recently with its advantages of thin form factor structure, cost effectiveness and high performance for wide range applications. Reducing wafer warpage is one of the most challenging needs to be addressed for success on subsequent processes. Therefore, the majority of studies focus on the ratio of die and compound thickness, structure design. In order to optimize the warpage for success on subsequent processes, it is indispensable to consider whole wafer process including thermal loading and stress.
In this study, reducdution of wafer warpage at each process was proposed in terms of material selection, and process optimization through finite element analysis (FEA) and experiment. Wafer process dependent modeling results were validated by experimental measurement data. The mutual relationship and effects of material property, compound thickness, and corresponding thermal influences were both investigated and addressed. Key parameters were identified based on FEA modeling results: thickness ratio of die/compound andmolding compound materials. Therefore, the geometry design with balanced die/compound ratio is optimal for warpage improvement. The effect of process will be discussed and should be considered for future package warpage characterization. Such findings have been successfully used in process optimization to reduce wafer warapge after grinding process.
NSOP Reduction for QFN RF-IC Packages
Authors: Bora Mumtaz Y. 
Published: November 2016

Abstract
Wire bonded packages using conventional copper lead frame have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – Non- stick on Pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction [1].
Effect of Temperature/Humidity Treatment on Interfacial Reliability on Screen-Printed Ag / Polyimide for Advanced Embedded Packaging Technologies
Authors: Lee Kyu Hawn , Bae Byung-Hyun , Jeong Min-Su , Kim Jeong-Kyu , Park Young-Bae 
Published: November 2016

Abstract
The effect of temperature/humidity treatment conditions on the interfacial adhesion energy between a screen printed Ag film and a polyimide substrate was evaluated by using a 90° peel test. The measured peel strength values decrease from 254.7 N/m to 59.3 N/m after the temperature/humidity treatment at 85°CC/85% relative humidity for 500 h. X-ray photoelectron spectroscopy analysis of the peeled surfaces indicates that peeling occurs cohesively inside of the polyimide, which is closely related to both the decrease in the interfacial adhesion energy and the polyimide degradation due to weak boundary layer formation.
The reliability of Ag wedge bonding with various bonding pads for power devices
Authors: Wei Xing , Yu Zhou , Yan Ge , Iizuka Tomonori , Tatsumi Kohei 
Published: November 2016

Abstract
Recent years, with the development of intelligent vehicles, power devices would be widely used. But traditional Si power devices have problems under high temperature. Now, there is a tendency that using SiC instead of Si in power devices, as SiC has a higher band gap 3.25 eV comparing with 1.12 eV of Si. So that SiC power devices can withstand higher temperature and voltage. Also SiC power devices have the advantages of lower parasitic parameters, smaller device size and shorter response time. In this study, to investigate the reliability of Ag wedge bonding, Ag wires were bonded on Al pad and Au-Ni pad. And then we did shear test after high temperature storage life test (HTSL). Finally, we used energy dispersive X-ray spectroscopy (EDS) to do cross-section observation. The results show that, for Al pad, the shear strength has decreased after annealing at 300°C with mold packages, cracks and corrosion were observed. For Au-Ni pad, the shear strength has increased after annealing, and no cracks or corrosion formed. So Ag bonding wire is proposed as an alternative to Al bonding wire for selected metal pads in power devices.
Ultrasonic Bonding on Unstable Pin
Authors: Seppänen Henri 
Published: November 2016

Abstract
In power electronics modules, ultrasonic wire bonding is a common method to make electronic connections between the connector pins and the IGBTs. In these modules the connector pins are often residing on top of the plastic frame. Due to the pins being in positions which are hard to reach, clamping of these pins is either suboptimal or not used. This poor or absent clamping combined with the plastic frame's elasticity (softness) means that the pin has more freedom to move compared to the bonding on a metal substrate or IC. In our experiments we measured the pin and the plastic frame displacement with a laser Doppler vibrometer during the ultrasonic heavy wire (400 um in diameter Al wire) bonding process. We measured that the press fitted pin can move laterally along the ultrasonic excitation axis (2.0 ± 0.2) um whereas the frame under the pin moved (0.3 ± 0.1) um. This indicates that the pin slips over the frame while bonding. The slipping of the pin is also visible on the ultrasonic frequency waveforms of the transducer. While molded pins in general are thought to be more stable compared to the press fitted pins, similar behavior is seen in heavy wire bonding where high ultrasonic power is needed. We measured molded frame displacement (0.6 ± 0.2) um while bonding on the pin. In this paper we show how to use process traces and visual inspection to detect unstable pins and how to improve bondability on unstable pins by selecting process parameters that are optimized for the unstable pins rather than stable surfaces.
Isothermal DSC study of the curing kinetics of an epoxy/silica composite for microelectronics
Authors: Granado Lérys , Kempa Stefan , Bremmert Stefanie , Gregoriades Laurence J. , Brüning Frank , Anglaret Eric , Fréty Nicole 
Published: November 2016

Abstract
Curing kinetics of an industrially important printed-circuit board (PCB) base material (epoxy-phenol/glass fillers) were studied from isothermal differential scanning calorimetry (DSC) measurements between 150 and 190 °C. The extent of cure was calculated by integration of the exothermic peak and normalization by the total heat of reaction (obtained by non-isothermal DSC). The kinetic profiles show two regimes: one fast, and one slower. The completion was reached above 180 °C. The kinetic parameters have been elucidated using an isoconversional model-free kinetic method. The linearity of Arrhenius plots was satisfactory. The apparent activation energy of curing reaction has been found to increase with the degree of conversion. The elucidation of the kinetic parameters allows us to propose an accurate and predictive description of the curing kinetics of the composite until a degree of conversion of 50%. Finally, we discuss how these kinetic measurements and models can be completed and optimized.
Wedge Bonding Wire and Ribbon to Support RF and Optoelectronic Packaging
Authors: Evans Daniel D. , Qi. Wenjuan , Bauder Kevin 
Published: November 2016

Abstract
The proliferation of mobile devices, video on-demand mobile and home, and Internet of Things (IoT), continues to drive an exponential growth in data bandwidth. Meeting the data demand requires continuous improvements in bandwidth and capacity for RF base station modules and optoelectronic modules. RF and Optoelectronic modules have many similar wire bond packaging requirements, especially as optoelectronic data rates continue to increase from 10G through 400G.
This paper will provide a survey of RF and Optoelectronic Packages and their common wire and ribbon bond requirements. The paper will also survey the packaging challenges and solutions available to process engineers. Challenges include bonding on a variety of materials, signal pins, RF loop spans and shapes for wire and ribbon, program strategies to maintain constant loop span, referencing challenges, and simplified machine user interactions.
The paper will also discuss collaborations between manufacturer and equipment supplier with helpful tips leveraging each other's strengths to transition from concept to production.
Design and Process Considerations in Transitioning From Aluminum Wire to Aluminum Ribbon
Authors: Italiano C. , Oud Y. Mindin M. 
Published: November 2016

Abstract
Bonding of power devices is experiencing a rapid transition to aluminum ribbon for many reasons. Better electrical characteristics, improved heat dissipation, fewer bonds, and improved reliability are some of the most obvious advantages. The huge increase in battery powered motors that require more powerful devices in smaller packages also increases the need for ribbon bonding. Coining has developed SPM POWER BOND RIBBON™, a high purity corrosion resistant aluminum bonding ribbon, to meet this demand. New improved spooling is now available for ribbons as large as.080 X.010, and as small as.030 X.003 mil. This spooling method decreases or eliminates most of the traditional issues with despooling of bonding ribbons and is compatible with the most commonly used bonding machines. Several Bonder Manufacturers have introduced new equipment to handle the conversion to heavy aluminum ribbon. Design consideration must be given to items such as bond pad design, loop heights, bonding angles and more. A key point to consider is that fact that one bond of a given size Bonding Ribbon can replace several wire bonds. For example: one bond of.060 X.008 ribbon can replace 6 wires of.010 diameter. This is key to increasing throughput and reliability and ultimately reducing costs. This paper will address the basic design characteristics that need to be considered in order to take advantage of this emerging technology.
PERFORMANCE EVALUATION OF GOLD (Au) WIRE AND RIBBON INTERCONNECTS IN HIGH FREQUENCY CIRCUITS
Authors: Atalan Cenk , Eker Taylan 
Published: November 2016

Abstract
Gold (Au) wires and ribbons are widely being used in military and space applications of high frequency RF/microwave circuits. The purpose of this study is to examine the RF performance of different dimensions of Au wires & ribbons, which are typically bonded in cascade and parallel forms in the circuits operating microwave frequencies within 0–50 GHz. The second goal of this study is to establish a performance chart/handbook of Au wires, ribbons for high frequency circuit designers in order to show them which type of wire or ribbon as well as which type of interconnect form is suitable for their intended design.
First, the test circuit board is manufactured by using chip & wire, epoxy attach method. The substrate material of used RF circuit materials is chosen as Alumina to minimize losses and the material of wires, ribbons are chosen as %99.99 pure Gold (Au). Au plated copper traces are used as conductive layers for optimal reliability and conductivity in the test circuit board. Automated thermosonic ball bonders are used for Au round wire bonds to reduce process errors. Manual parallel gap resistance welders and manual thermosonic wedge bonders are used for Au ribbons and always pay great attention to form the same length by using high magnification microscopes. The experiment conducted with the help of 0.7 mil, 1 mil round wires and 3×0.5 mil, 3×1 mil, 5×0.5 mil, 7×1 mil and 10×1 mil ribbons. Single bonds, parallel double bonds as well as V-type bonds, stitch over ball bonds are performed onto the circuit pads as interconnect types and forms.
The RF tests (S11 return losses and S21 insertion loss) we performed showed that 0.7 mil and 1 mil round wires can be used in the frequency range of 0–20 GHz circuits. A better RF test result can be achieved if double parallel bonding method is used. For higher frequency range, 20 to 50 GHz, 3×0.5 mil, 3×1 mil, 7×1 mil and 10×1 mil ribbons should be used. On the other hand, the bare chip bonding pads and dimensions of transmission line conductive layer bond pads are limiting the usage of desired ribbon. Last but not least, a performance chart of RF wire/ribbon interconnects including a suggestion of bonding method with sustainable current load and shape is generated for design and application engineers who are dealing with high performance circuit efficiency.
Highly Selective Wet Silicon Etch Chemistry and Process for Advanced Semiconductor Packaging
Authors: Lu Yongqiang , Collins Sian , Mauer Laura B. , Taddei John , Clark John 
Published: November 2016

Abstract
A wet silicon etch chemistry and a process using the chemistry as a simple and cost-effective alternative to the polish/plasma etch silicon thinning process are presented in this paper. The new etch chemistry improves the Si etch rate over traditional etchants such as tetramethylammonium hydroxide (TMAH). The chemistry has very high silicon etch selectivity (ratio of Si etch rate to another film etch rate) over SiO2 and over copper films, with etch selectivity greater than 8000:1 and 2500:1 respectively. Chemical compatibility with typical packaging materials such as polybenzoxazole (PBO) and polyimide (PI) are also discussed. Additionally, real production TSV wafers have been successfully processed on an advanced single wafer etch tool using the chemistry. High uniformity and smooth surface finishing have been achieved.
Improvement of Coherency of the Panel Level Package by Integrated Dry Process
Authors: Endo Shinichi , Habu Tomoyuki , Aiba Akira , Suzuki Hiroko , Takezoe Noritaka , Horibe Hiroki , Arikawa Kazuki , Miura Masaki , Kikuiri Hajime , Yabu Shintaro 
Published: November 2016

Abstract
Lately, Semi Additive process has been considered to dry processing for the downsizing of the emiconductor packages. WET process is a process depending on the chemical reaction of the chemical solution. There are many problems with the formation of the minute redistribution layer. We repeated the study of the Photodesmear technology as a new technology of the dry process, reported result in IMAPS in 2013 and 2015.
We completed a panel level experiment tool equipped with a high power irradiation light source. We reported findings of the coherency improvement by integrated dry process which fused in a Photodesmear technology and a dry seed technology.
We confirmed the following effects in integrated dry process. Desmear of micro via was difficult at a panel level. We were able to keep flatness characteristics of the resin before the plating low. We were able to confirm strong coherence of the via filled plating. VUV light irradiation is effective for the residue that is left when removing the protective film before the pre-dry seed layer process.
Integrated dry process is a key technology to establish the next generation semi additive process.