bluuebunny/crossref_metadata_2025_split huggingface dataset:
Therapeutic Ultrasound and Treadmill Training Suppress Peripheral Nerve Injury–Induced Pain in Rats
Authors: Hung Ching-Hsia , Huang Po-Ching , Tzeng Jann-Inn , Wang Jhi-Joung , Chen Yu-Wen 
Published: April 2016

AbstractBackgroundAlthough evidence suggests that therapeutic ultrasound (TU) in combination with treadmill training (TT) suppresses nerve injury–associated pain, the molecular mechanisms for this action are not clear.ObjectiveThe purpose of this research was to study the possible beneficial effects of TU and TT, alone and in combination, on 2 clinical indicators of neuropathic pain and correlate these findings with changes in inflammatory mediators within the spinal cord. Our experimental model used the well-known chronic constriction injury (CCI) of the rat sciatic nerve.DesignThis was an experimental study.MethodsEach group contained 10 rats. Group 1 underwent only the CCI procedure. Group 2 underwent a sham operation where the sciatic nerve was exposed but not ligated. Group 3 had the sham operation followed by both TT and TU. Groups 4, 5, and 6 underwent the CCI procedure followed by TT alone, TU alone, and both the TT and TU interventions, respectively. Heat and mechanical sensitivity, interleukin-6 (IL-6), interleukin-10 (IL-10), and ionized calcium binding adaptor molecule 1 (Iba1) were evaluated.ResultsCompared with group 1 animals, TT or TU, or both, produced smaller decreases in mechanical withdrawal threshold and heat withdrawal latencies. The combination of TT and TU was more effective than either treatment alone. In addition, rats that received these treatments did not express the upregulation of IL-6 and Iba1 in their spinal cords on postoperative days 14 and 28, as was found in the group 1 animals.LimitationsThese experimental findings may not be generalizable to humans.ConclusionsThe combination of TU and TT reduces neuropathic pain more than either modality alone. This beneficial effect appears related to downregulation of proinflammatory IL-6 and Iba1, while upregulating the anti-inflammatory IL-10.
Towards a successful reintroduction of capercaillies — activity, movements and diet of young released to the Lower Silesia Forest, Poland
Authors: Merta Dorota , Kobielski Janusz , Theuerkauf Jörn , Gula Roman 
Published: April 2016

Combining radio‐telemetry with direct observations, we followed 22 released juvenile captive‐bred capercaillies throughout the day to assess if their seasonal and daily patterns of activity, movements, and diet are in accordance with published information on wild birds. Day length was the most important factor determining birds' mobility and activity. Capercaillies were active for 46 ± 2% of daytime, during which they mostly foraged (30 ± 2%). The average distance travelled per day was 0.93 ± 0.14 km. The time budget of capercaillies was mostly allocated to activities on the ground but they spent at least 20% of the daytime in trees. They fed primarily on blueberries, cowberries and pine needles. The mean daily feeding time in fall and winter was 3 h, but it increased to 6 h in spring and summer. We conclude that released birds behave similarly to wild birds and reintroduction of captive‐bred capercaillies can be successful if the initial mortality is reduced.
Canine Ovariohysterectomy: A Survey of Surgeon Concerns and Surgical Complications Encountered by Newly Graduated Veterinarians
Authors: Blacklock Kelly L. Bowlt , Langer Pierre , Halfacree Zoe , Yool Donald A. , Corr Sandra , Owen Laura , Friend Ed , Ekiri Abel 
Published: April 2016

The objective of this study was to document newly qualified veterinarians' concerns and surgical complications encountered during canine ovariohysterectomy (cOVH) during the first year of general practice. A questionnaire investigating concerns about cOVH procedures was sent to all final-year veterinary students (group 1) enrolled at five UK universities. Participants were later asked to complete a similar questionnaire 6 months (group 2) and 12 months (group 3) after graduation, which involved grading their concern about different aspects of the cOVH procedure and reporting surgical complications encountered after completing three cOVHs. Responses were compared between different time points.There were 196 respondents in group 1, 55 in group 2, and 36 in group 3. Between groups 1 and 2, there was a statistically significant reduction in the respondents' levels of concern in every aspect of cOVH (p<.05). Between groups 2 and 3, there was no statistically significant change in respondents' levels of concern in any aspect of cOVH (p≥.21). There was a significant reduction in the number of complications encountered by veterinarians in group 3 (39/102, 38.2%) compared to those in group 2 (117/206, 56.8%) (p=.002).Employers should anticipate high levels of concern regarding all aspects of cOVHs in new graduates, and supervision during the first 6 months may be particularly useful.
Dystonic tics induced by deep brain stimulation of the posterior subthalamic area for essential tremor
Authors: Chandran Arjun S. , Joshi Stuti , Thorburn Megan , Stell Rick , Lind Christopher R. P. 
Published: April 2016

OBJECTIVE
The posterior subthalamic area (PSA) is a promising target of deep brain stimulation (DBS) for medication-refractory essential tremor (ET). This case series describes a novel adverse effect manifesting as dystonic tics in patients with ET undergoing DBS of the PSA.

METHODS
Six patients with ET received electrode implants for DBS of the dorsal and caudal zona incerta subregions of the PSA.

RESULTS
Five of the 6 patients developed dystonic tics soon after clinical programming. These tics were of varying severity and required reduction of the electrical stimulation amplitude. This reduction resolved tic occurrence without significantly affecting ET control. Dystonic tics were not observed in 39 additional patients who underwent DBS of the same brain regions for controlling non-ET movement disorders.

CONCLUSIONS
The pathophysiology of tic disorders is poorly understood and may involve the basal ganglia and related cortico-striato-thalamo-cortical circuits. This series is the first report of DBS-induced tics after stimulation of any brain target. Although the PSA has not previously been implicated in tic pathophysiology, it may be a candidate region for future studies.
Clinical utility and cost analysis of routine postoperative head CT in elective aneurysm clippings
Authors: Zygourakis Corinna C. , Winkler Ethan , Pitts Lawrence , Hannegan Lisa , Franc Benjamin , Lawton Michael T. 
Published: April 2016

OBJECTIVE
Postoperative head CT scanning is performed routinely at the authors' institution on all neurosurgical patients after elective aneurysm clippings. The goal of this study was to determine how often these scans influence medical management and to quantify the associated imaging costs.

METHODS
The authors reviewed the medical records and accounting database of 304 patients who underwent elective (i.e., nonruptured) aneurysm clipping performed by 1 surgeon (M.T.L.) from 2010 to 2014 at the University of California, San Francisco. Specifically, the total number of postoperative head CT scans, radiographic findings, and the effect of these studies on patient management were determined. The authors obtained the total hospital costs for these patients, including the cost of imaging studies, from the hospital accounting database.

RESULTS
Overall, postoperative CT findings influenced clinical management in 3.6% of cases; specifically, they led to permissive hypertension in 4 patients for possible ischemia, administration of mannitol for edema and high-flow oxygen for pneumocephalus in 2 patients each, seizure prophylaxis in 1 patient, Plavix readjustment in 1 patient, and return to the operating room for an asymptomatic epidural hematoma evacuation in 1 patient. When patients were stratified on the basis of postoperative neurological examination, findings on CT scans altered management in 1.1%, 4.8%, and 9.0% of patients with no new neurological deficits, a nonfocal examination, and focal deficits, respectively. The mean total hospital cost for treating patients who undergo elective aneurysm clipping was $72,227 (± $53,966) (all values are US dollars), and the cost of obtaining a noncontrast head CT scan was $292. Neurologically intact patients required 99 head CT scans, at a cost of $28,908, to obtain 1 head CT scan that influenced medical management. In contrast, patients with a focal neurological deficit required only 11 head CT scans, at a cost of $3212, to obtain 1 head CT scan that changed clinical management.

CONCLUSIONS
Although there are no clear guidelines, the large number and high cost of CT scans needed to treat neurologically intact elective aneurysm patients suggest that careful neurological monitoring may be more clinically useful and a better use of hospital resources than routine postoperative CT.
THE CASE FOR PSR J1614–2230 AS A NICER TARGET
Authors: Miller M. Coleman 
Published: April 2016

ABSTRACT
The Neutron star Interior Composition ExploreR (NICER) is expected to launch in 2017 and will gather X-ray data on neutron stars and other high-energy sources from a berth on the International Space Station. Its prime scientific goal is to measure the masses and radii of non-accreting neutron stars via fits to the energy-dependent waveforms produced by the rotation of hot spots on their surfaces. These measurements will provide valuable input to theoretical models of cold matter beyond nuclear density. Here we propose that PSR J1614−2230, despite its low count rate, is a promising source to observe with NICER. The reason is that XMM-Newton observations suggest that the fractional oscillation amplitude from PSR J1614−2230 could be high enough that this star cannot be very compact. We show that if we analyze 0.5 Ms of NICER data and 0.1 Ms of nearby off-source data and combine that analysis with the known mass of this star, we would find a robust lower limit to the radius with a statistical uncertainty of only

km. We also show that even if there is an unmodeled nonthermal component modulated at the pulsation frequency, good statistical fits could rule out significant biases. The low count rate will make reliable upper limits on the radius difficult, but the lower limit could rule out some equations of state that are currently being discussed. This analysis would require a good estimate of the non-source background, so Chandra observations of the vicinity of PSR J1614−2230 would be helpful.
Wafer-level packaging for ultra-thin glasses using hermetic room temperature welding technology
Authors: Lundén Heidi , Peltonen Antti , Määttänen Antti 
Published: April 2016

The aim of the study was to develop a hermetic package using ultra-thin glass wafers. A novel glass welding technology, with a minimal heat load, was used to construct the encapsulations.
Industry requirements of the miniaturization of the electronic components, for example in medical implants and consumer electronics and opto-electronics, challenge the conventional manufacturing technologies and package materials [1]. Low-cost glass interposers and packages have been research by GeorgiaTech at their PRC industry program. Glass packaging can offer even ten times affordable option than using silicon [2]. During the last few years, the advancements in the glass manufacturing technologies have enabled a cost effective production of the ultra-thin glass wafers and panels. Laborious glass grinding process from thick material to ultra-thin is no longer necessary since the fusion forming process can be used. Ultra-thin glass makes it possible to reduce the package size and weight [3]. Typically, glasses thickness of 300 μm or less are considered as ultra-thin material. However, even as thin as 25 μm glass is commercially available [4].
Several methods are used for glass joining including: anodic, fusion, and adhesive bonding [5]. During the recent years increasing number of laser based techniques are applied to glass packaging. Numerous studies have concentrated on frit bonding [6, 7]. Elementary study of the direct laser joining without any additive layers has been demonstrated by Miyamoto et al. [8]. Glass welding method has been further investigated in several researches [9, 10].
The package is constructed of three ultra-thin glass wafers: base and lid, thicknesses of 200 μm and spacer, thickness of 100 μm. Commercially available 6” borosilicate, D263T, wafers are used which were welded together by using novel laser welding technology. Welding is implemented on material interface without using any additive materials or coating layers. Glass surfaces are left untouched and optical quality is retained. Welding was performed on a wafer level and the single packages were cut after the final welding.
Hermeticity test was performed to ensure the welding quality. Radioisotope leak test with krypton 85 was performed at Oneida Research Services. The results showed an excellent hermeticity: leak rate less than 6,0×10–12 atmcm3/s Kr-85 was achieved. Limits set in the MIL-standard are easily reached. The study proves that novel glass welding technology can be applied to wafer-level packaging with ultra-thin glasses. Technique eliminates the need of additive materials, and due to the minimal heat load bending and warping of the material can be avoided. Also, glass offers effortless visual inspection through the entire lifetime of the device.
M-Series with Adaptive Patterning for High-Yield Fan-Out SIP
Authors: Bishop Craig , Jayaraman Suresh , Rogers Boyd , Scanlan Chris , Olson Tim 
Published: April 2016

Fan-Out Wafer Level Packaging (FOWLP) holds immediate promise for packaging semiconductor chips with higher interconnect density than the incumbent Wafer Level Chip Scale Packaging (WLCSP). FOWLP enables size and performance capabilities similar to WLCSP, while extending capabilities to include multi-device system-in-packages. FOWLP can support applications that integrate multiple heterogeneously processed die at lower cost than 2.5D silicon interposer technologies. Current industry challenges with die position yield after die placement and molding result in low-density design rules and the high-cost of accurate die placement. Efficiently handling die shift is essential for making FOWLP cost-competitive with other technologies such as FCCSP and QFN.
This presentation will provide an overview of Adaptive Patterning, a new technology for overcoming variability of die positions after placement and molding. In this process, an optical scanner is used to measure the true XY position and rotation of each die after panelization. The die measurements are then fed into a proprietary software engine that generates a unique pattern for each package. The resulting patterns are dispatched to a lithography system, which dynamically implements the unique patterns for all packages within a panel. For system-in-packages, this process offers a unique advantage over a fixed pattern: each die shift can be handled independently. With a fixed pattern, the design tolerances need to be large enough for all die to shift in opposing directions, otherwise yield loss in incurred. With Adaptive Patterning, vias and RDL features remain at minimum size and are matched to the measured die shift. The die-to-die interconnects are dynamically generated and account for the unique position of each die. Thus, Adaptive Patterning retains the same high-density design rules regardless of how many die are in a package.
Adaptive Patterning provides the capability to use high-throughput die placement to drive down cost, while enabling higher-density system-in-package interconnect. With this technology the industry can finally realize the cost, flexibility, and form factor benefits of FOWLP.
Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages
Authors: Adams Bernard , Choi Won Kyung , Na Duk Ju , Yong Andy , Yoon Seung Wook , Lee Jaesik , Ray Urmi , Radojcic Riko 
Published: April 2016

The market for portable and mobile data access devices connected to a virtual cloud access point is exploding and driving increased functional convergence as well as increased packaging complexity and sophistication. This is creating unprecedented demand for higher input/output (I/O) density, higher bandwidths and low power consumption in smaller package sizes. There are exciting interconnect technologies in wafer level packaging such as eWLB (embedded Wafer Level Ball Grid Array), 2.5D interposers, thin PoP (Package-on-Package) and TSV (Through Silicon Via) interposer solutions to meet these needs.
eWLB technologies with the ability to extend the package size beyond the area of the chip are leading the way to the next level of high density, thin packaging capability. eWLB provides a robust packaging platform supporting very dense interconnection and routing of multiple die in very reliable, low profile, low warpage 2.5D and 3D solutions. The use of these embedded eWLB packages in a side-by-side configuration to replace a stacked package configuration is critical to enable a more cost effective mobile market capability. Combining the analog or memory device with digital logic device in a semiconductor package can provide an optimum solution for achieving the best performance in thin, multiple-die integration aimed at very high performance.
One of the greatest challenges facing wafer level packaging at present is the availability of routing and interconnecting high I/O fine pitch area array. RDL (redistribution layer) allows signal and supply I/O's to be redistributed to a footprint larger than the chip footprint in eWLB . Required line widths and spacing of 2/2 μm for eWLB applications support the bump pitch of less than 40um. Finer line width and spacing are critical for further design flexibility as well as electrical performance improvement.
This paper highlights the rapidly moving trend towards eWLB packaging technologies with ultra fine 2/2um line width and line spacing and multi-layer RDL. A package design study, process development and optimization, and mechanical characterization will be discussed as well as test vehicle preparation. JEDEC component level reliability test results will also be presented.
Non-Conductive Film (NCF) Underfill: Materials, Performance, and Evolution to Next Generation Devices
Authors: Anzures Edgardo , Morganelli Paul , Morganelli Paul , Barr Robert , Calvert Jeffrey , Dhoble Avin , Fleming David , Kim Jong-Uk , Lei Herong , Grafe Jürgen , Haberland Julian 
Published: April 2016

As packaging technology continues to advance to smaller form factors, 3D chip stacking will become more of a requirement than an option and Non-Conductive Film (NCF) underfills will play a critical role in the assembly process. Capillary Underfills (CUF) have long been the standard method of protecting interconnected solder bumps from stress, moisture and contaminants. They are, however, becoming more problematic with the steady growth of fine pitch copper pillar interconnections. With CUF, there are difficulties related to cleaning flux residues. Handling thin die (&lt;100 μm) before bonding has become increasingly difficult and CUF does not offer support because it is applied after the bonding is completed. There are also bleed issues associated with CUF resins that limit the die spacings that are possible with new designs.
NCF underfills, applied as a film laminated to a wafer, offer significant advantages over CUF and other underfill technologies for fine pitch designs. Because NCF is applied via a lamination process to wafers prior to dicing, handling and dispensing of resins is eliminated from the assembly process. Additionally, the lamination of film materials allows for a precise, uniform placement of underfill. Since NCF is applied at the beginning of the assembly process, it is able to support thinned die after backgrinding. NCF's can be self-fluxing and the removal of flux residues is not necessary. Material flow can be precisely controlled during the lamination and bonding steps, thus allowing for tighter keep out zones and closer die spacings. There have been major advances in the development and mechanistic understanding of NCF technology over the past few years. A great deal of work was done in the first stages of the development which demonstrated the potential to achieve good interconnection and high reliability with low voiding on small test vehicles with larger pitch. The NCF approach has now evolved to multiple materials developed to accommodate varying design parameters.
This paper will present the development and test results of initial NCF technology applied to a base test vehicle with 1,000 I/O copper pillars and the evolution to the next generation NCF materials for high I/O die assembly (36,000 I/O's). The optimization of the parameters critical to the development of a robust assembly process will be addressed. Specific interactions between the film properties, thermal profile for joining, and the force/bump ratio will be discussed in relation to solder joint formation.
Laser Direct Patterning of Dry Etch BCB Adhesive Layers for Low Temperature Permanent Wafer-to-Wafer Bonding
Authors: Zoschke Kai , Kim J.-U. , Wegner M. , Gallagher M. , Barr R. , Calvert J. , Toepper M. , Lang K.-D. 
Published: April 2016

To enable advanced wafer level packaging approaches for devices like MEMS, image sensors or optical elements, wafer-to-wafer bonding processes using structured low temperature curable adhesives are required. A lot of Benzocyclobutene (BCB)-based wafer bonding works have been reported in the past showing a broad range of applications and good performance, but also some limitations such as long bond cycles and high cure temperature of 250 °C. In 2013 new process concepts were demonstrated [1], showing that wafer bond cycle time can be reduced to less than 10 min and a post bond batch cure at temperatures below 200 °C can be used to significantly shrink the overall cost of a BCB-based adhesive wafer bonding process.
In order to create a patterned BCB bond layer, photo structuring of CYCLOTENE ® 4000 Resin is one solution. However, due to the decreased flow capability of that material after exposure, high bond forces and extended bonding times during wafer bonding as well as nearly flat surfaces with low topography are required for void-free bonding. To overcome these limitations, an increased material flow capability during wafer bonding is required. In this context non-photo sensitive CYCLOTENE ® 3000 Resin is suitable, since it has excellent flow capability in non-cured state. However, non-cured CYCLOTENE ® 3000 Resin cannot be structured with standard dry etching processes using a photo resist layer as mask. In order to enable patterned adhesive bonding based on CYCLOTENE ® 3000 Resin, alternative structuring methods have to be evaluated. One method was presented in [1] which is transfer printing of CYCLOTENE ® 3000 Resin from a help wafer to topography features of the device wafer. Although very good results were obtained, the method is restricted to applications with significant topography to enable the transfer printing.
In this work we focus on a new structuring method for non-cured BCB layers formed from CYCLOTENE ® 3000 Resin. The layers were spin coated, baked and subsequently patterned using a 248 nm excimer laser stepper. The system features a 2.5× mask projection with a resulting exposure field of 6.5 × 6.5 mm2 and allows a direct ablation patterning of polymers. By using this method bond frame structures were patterned into 5 μm thick BCB layers at 200 mm silicon wafers. The wafers with the structured adhesive were bonded at 80 °C and 0.2 MPa for 5 minutes with 200 mm glass wafers. The bonded wafer stacks were subsequently post bond batch cured at 190 °C. Wafer dicing and shear tests of the bonded structures revealed excellent mechanical robustness of the BCB bond frames.
The paper will review the new BCB wafer bond processes for supporting short cycle times with special focus on the new patterning approach by laser ablation. Process flow description as well as systematical analysis of pattern reproducibility of the new structuring method is part of the discussion.