bluuebunny/crossref_metadata_2025_split huggingface dataset:
Cost Comparison of Panel Level and Wafer Level Fan-out Packaging
Authors: Lujan Amy 
Published: June 2019

In recent years, the possibility of panels replacing wafers in some fan-out applications has been a topic of interest. Questions of cost and yield continue to arise even as the industry appears to be full steam ahead. While large panels allow for more packages to be produced at once, the cost does not scale simply based on how many more packages can be generated from a panel over a wafer.
This analysis begins by breaking down the types of cost and will discuss how those types of cost are impacted (or not) by the shift from wafer to panel. Activity based cost modeling is used; this is a detailed, bottom-up approach that takes into account each type of cost for each activity in a process flow.
Two complete cost models were constructed for this analysis. A variety of package sizes are analyzed, and multiple panel sizes are included as well. For each set of activities in the fan-out process flow, there is an explanation of how the process changes with the move to panel, including assumptions related to throughput, equipment price, and materials. The cost reduction that may be achieved at each package and panel size will be presented for each processing segment.
The focus of this analysis is on the details of each segment of the process flow, but results for the total cost of various packages will also be presented. There is also a section of analysis related to the impact of yield on the competitiveness of panel processing.
30μm Thick Cu RDL in WLCSP
Authors: Amanlim Jacinta , Cao Kenny , Li Zhang , Tan K.H. 
Published: June 2019

In situations where a device may have an interconnect pad arrangement in wafer level packaging, an additional layer of lateral connections may be employed to rearrange the connections in a manner suitable for wafer level processing. This additional layer is known as a redistribution layer, or RDL, and fabricated from a thin layer of metal with dielectrics in between. An RDL is used for higher electrical performance and complex routing to meet electrical requirements.
As the importance of high power and power management in electronics products continue to rise, so also will the demands for power ICs to handle ever higher voltages without appreciably adding size and heat to the end product. Using thicker Cu metallization in an RDL is an ideal choice that accommodates high current density and lower resistance for high power applications.
Assembling multiple chips in multiple layers requires more electrical connections, which in turn requires both thinner lines within the RDL and an increase in the number of RDL layers. The RDL line width of WLCSP started at over 20μm, but has already been reduced to 10~15μm in HVM. Industry players are now working in R&D to develop 2μm wide and even smaller line/space (L/S) capability to meet the requirements of today's high-end applications.
In this study, we present the development of 20–30 μm thick plated Cu RDL for high power and high current density applications. Using a plated Cu process and photo-sensitive spin-on-dielectrics materials, thick Cu RDL was achieved with the AR 1:1 design rule and the reliability assessment was carried out with JEDEC reliability test conditions. A 2-layer Cu RDL (total 6-mask process with UBM) was developed and characterized for its component and board level reliability for 5×5/7×7mm, 0.35/0.4mm ball pitch WLCSP test vehicles.
Quick Prototyping Design for More than Moore era
Authors: Fujita Yoko , Koga Kazukani , Ohtani Shintaro , TsuTsui Daisuke 
Published: June 2019

[Background and Motivation]
System in Package (SiP) is pulling the evolution of technology instead of deep submicron of LSI. SiP assists coming AI/IoT/5G world. SiP has many implementation variations. When we examine the chip and package implementation technique for the target product, it's important task to find the optimal solution for the product considering trade-off between cost and performance. Compared with mass production products, it's important to optimize costs especially for small volume production products. Moreover, in terms of performance, compared to conventional packages, for high frequency products and SiP, since the margin becomes small and confirming system level electrical characteristics are necessary, in addition to conventional conceptual design and detail design, prototyping design is required to test its electrical characteristics while keeping lower cost.
[Technical callenge]
To do prototyping design at the early stage of product and find the optimum solution of the product, we created short turn-around time(TAT) iteration environment and distributed prototyping design.
Quick Prototyping, which is a short TAT iteration environment, is based on the LSI/Package/PCB integrated co-design environment, estimates the chip size from the signal number of product, performs LSI design prototyping, using package automatic net assignment and the substrate auto routing, proceeds package prototype design and then confirms electrical characteristics.
In the above, itfs possible to consider multiple implementation variations.
In the distribution of prototype design, we utilize the LPB format (IEC 63055/IEEE 2401), have eliminated the interface(I/F) barriers between companies and tools, and have developed an environment for design prototypes and checking their characteristics throughout the industry.
[Results and Conclusions]
In collaboration with Semiconductor vendor Socionext Inc., as the above benchmark, 3D Flip Chip-Chip Scale Package(FCCSP) (with memory package with Package on Package(PoP) method) and 3D Fan-Out Wafer Level Package(FOWLP) (similarly in PoP method) as samples, the prototype design was created out. By comparison of the electrical characteristics, the Self Inductance of the FOWLP becomes half or less than FCCSP, the power supply noise could be suppressed. The shielding effect of FOWLP reduced the influence of crosstalk. We confirmed that FOWLP has advantage of electrical characteristics. On the cost side, in the LSI implementation of the FOWLP side, only the function blocks requiring performance were replaced with the fine node by chip partitioning, we examined to suppress the increase in cost while maintaining the performance advantage of FOWLP.
With Quick Prototyping, cost and performance balance can be examined in the product review early stages, also by utilizing the LPB format for Quick Prototyping, from the negotiation stage with business partners, we can share the design data, focus on tuning the product itself and improve the competitive SiP products.
A PCB Sensor for Magnetic Materials
Authors: Dean Robert N. , Beckingham Lauren E. 
Published: June 2019

Printed circuit board (PCB) sensors are a sensor technology where the layout of traces on a PCB has been optimized so that the traces electromagnetically interact with the surrounding environment. These types of sensors can be manufactured at very low cost using standard commercially available low-cost printed circuit board fabrication. Exposed conductive electrodes on the circuit board are useful for measuring the electrical conductivity of the surrounding environment, and these sensors have been used in applications such as salinity measurement and dissolved ion content measurement of aqueous solutions. Insulated interdigitated electrode sensors are useful for capacitively analyzing the surrounding environment, and these sensors have been used to detect the presence of liquid water and to measure the moisture content of substances in physical contact with the sensor. Additionally, by measuring the complex impedance of the capacitive sensor over a wide frequency range, information concerning the chemical composition of the substance in contact with the sensor can be determined.
In addition to conducive and capacitive PCB sensors, the third type of PCB sensor would be an inductive sensor. Although it is challenging to realize 3D coils in PCB technology, planar inductors can be realized in a single Cu layer on a PCB, and insulated from the environment using a cover layer of polymeric solder mask. This type of electrode structure can inductively couple with magnetic materials in close proximity to the sensor. A variety of magnetic materials exist, including iron, nickel and cobalt. Additionally, many alloys of these elements are also magnetic. Of particular interest are corrosion products with magnetic properties, such as iron(III) oxide, Fe3O2, also known as common rust. A thin layer of iron(III) oxide powder deposited on the sensor's active area results in a measureable increase in the sensor's inductance. As such, an inductive PCB sensor could be a low-cost option for detecting the presence of some corrosion products in its operating environment.
Solder paste wicking in socketable BGAs
Authors: Gupte Omkar , Smet Vanessa , Murtagian Gregorio , Tummala Rao 
Published: June 2019

The trend of the electronics industry to miniaturize package design has caused the need to adopt BGA packages for a variety of applications. OEM microprocessors have conventionally used LGA designs press fitted into sockets for ease of reworkability. However, BGA packages, which have been widely used for surface mount (SMT) applications, face challenges when they are used in sockets. One of the major challenges faced is the formation of intermetallics between the bare solder ball and the gold paddle of the socket. To address these challenges, Georgia Tech is developing a universal solution for socketing and SMT applications by surface modification of solder spheres. In this new approach, the solder spheres have an outermost noble metal layer which prevents any damage to the BGA and doesn't react with the gold paddle, when placed in a socket. The surface coating would also collapse with the solder ball under specific conditions during reflow when used in SMT applications.
This paper focuses on the process of attaching these modified solder spheres on the package and subsequent assembly of the package on the board. We evaluated high and low melting solder pastes to attach the coated spheres to the package. A major challenge observed was the wicking of the solder paste to the entire surface of the solder sphere during reflow. This was addressed by studying the wetting characteristics of the solder paste on different metal surfaces and controlling the volume of solder paste required. Optimization of solder paste volume was done to control wicking and at the same time, achieve a strong and stable joint. Microstructure of the solder joint was analyzed to determine its effect on the joint stability. It was found that the amount of wicking is a strong function of the composition of the solder paste, the reflow time, and the material in surface with which the solder paste is in contact with. This work advances the assembly requirements of socketable BGAs.
Mechanical Ventilation Training During Graduate Medical Education: Perspectives and Review of the Literature
Authors: Keller Jonathan M. , Claar Dru , Ferreira Juliana Carvalho , Chu David C. , Hossain Tanzib , Carlos William Graham , Gold Jeffrey A. , Nonas Stephanie A. , Seam Nitin 
Published: June 2019

ABSTRACTBackgroundManagement of mechanical ventilation (MV) is an important and complex aspect of caring for critically ill patients. Management strategies and technical operation of the ventilator are key skills for physicians in training, as lack of expertise can lead to substantial patient harm.ObjectiveWe performed a narrative review of the literature describing MV education in graduate medical education (GME) and identified best practices for training and assessment methods.MethodsWe searched MEDLINE, PubMed, and Google Scholar for English-language, peer-reviewed articles describing MV education and assessment. We included articles from 2000 through July 2018 pertaining to MV education or training in GME.ResultsFifteen articles met inclusion criteria. Studies related to MV training in anesthesiology, emergency medicine, general surgery, and internal medicine residency programs, as well as subspecialty training in critical care medicine, pediatric critical care medicine, and pulmonary and critical care medicine. Nearly half of trainees assessed were dissatisfied with their MV education. Six studies evaluated educational interventions, all employing simulation as an educational strategy, although there was considerable heterogeneity in content. Most outcomes were assessed with multiple-choice knowledge testing; only 2 studies evaluated the care of actual patients after an educational intervention.ConclusionsThere is a paucity of information describing MV education in GME. The available literature demonstrates that trainees are generally dissatisfied with MV training. Best practices include establishing MV-specific learning objectives and incorporating simulation. Next research steps include developing competency standards and validity evidence for assessment tools that can be utilized across MV educational curricula.
Chemistry and deposition in the Model of Atmospheric composition at Global and Regional scales using Inversion Techniques for Trace gas Emissions (MAGRITTE v1.1) – Part 1: Chemical mechanism
Authors: Müller Jean-François , Stavrakou Trissevgeni , Peeters Jozef 
Published: June 2019

Abstract. A
new chemical mechanism for the oxidation of biogenic volatile organic
compounds (BVOCs) is presented and implemented in the Model of Atmospheric
composition at Global and Regional scales using Inversion Techniques for
Trace gas Emissions (MAGRITTE v1.1). With a total of 105 organic species and
over 265 gas-phase reactions, 69 photodissociations, and 7 heterogeneous
reactions, the mechanism treats the chemical degradation of isoprene – its
main focus – as well as acetaldehyde, acetone, methylbutenol, and the family
of monoterpenes. Regarding isoprene, the mechanism incorporates a
state-of-the-art representation of its oxidation scheme accounting for all
major advances put forward in recent theoretical and laboratory studies. The
recycling of OH radicals in isoprene oxidation through the
isomerization of Z-δ-hydroxyperoxy radicals is found to enhance
OH concentrations by up to 40 % over western Amazonia in the
boundary layer and by 10 %–15 % over the southeastern US and Siberia
in July. The model and its chemical mechanism are evaluated against the suite
of chemical measurements from the SEAC4RS (Studies of Emissions and
Atmospheric Composition, Clouds and Climate Coupling by Regional Surveys)
airborne campaign, demonstrating a good overall agreement for major isoprene
oxidation products, although the aerosol hydrolysis of tertiary and
non-tertiary nitrates remain poorly constrained. The comparisons for
methylnitrate indicate a very low nitrate yield (<3×10-4) in the
CH3O2+NO reaction. The oxidation of isoprene, acetone, and
acetaldehyde by OH is shown to be a substantial source of enols and
keto-enols, primarily through the photolysis of multifunctional carbonyls
generated in their oxidation schemes. Oxidation of those enols by OH
radicals constitutes a sizable source of carboxylic acids estimated at
9 Tg (HC(O)OH) yr−1 and 11 Tg(CH3C(O)OH) yr−1
or ∼20 % of their global identified source. The ozonolysis of
alkenes is found to be a smaller source of HC(O)OH
(6 Tg HC(O)OH yr−1) than previously estimated, due to several
factors including the strong deposition sink of hydroxymethyl hydroperoxide
(HMHP).
La traducción del árabe al español y el exequátur en materia de divorcio
Authors: El-Madkouri Maataoui Mohamed 
Published: June 2019

El objetivo de la presente investigación es explorar la tipología de los divorcios en el derecho de varios países musulmanes y la problemática de su traducción al español. El corpus analizado corresponde a textos legales y judiciales procedentes de textos jurídicos árabes, especialmente de Marruecos.
Se trata de textos concretos en los cuales se multiplican los términos para designar lo que en español se conoce como divorcio sin más. Esta multiplicación árabe de términos relativos al divorcio descansa sobre una conceptualización específica del mismo y de las implicaciones particulares de cada caso de ellos. Las asimetrías con respecto al derecho civil español son evidentes. Ello obliga al traductor, muy a menudo, a emprender una labor didáctica sobre conceptos y principios que trascienden su pericia conceptual y terminológica para trasvasar un texto jurídico de una lengua a otra. El calado cultural y tradicional es determinante, como es común en derecho, de estas especificaciones.
Tijd en rust wettelijk toegevoegd aan de gereedschapskist van het bestuur
Authors: Kleipool R.H. , Pouwer R.L. 
Published: June 2019

Tijd en rust wettelijk toegevoegd aan de gereedschapskist van het bestuur
De wetgever heeft een voorontwerp ter invoering van een bedenktijd voor bestuurders van de naamloze vennootschap gepubliceerd. Een bedenktijd geeft bestuurders gelegenheid in rust een goede belangenafweging te maken. De auteurs beschrijven hun positieve visie op het voorontwerp. Tevens komt een aantal knelpunten van de voorgestelde regeling aan bod.
Sex‐Modified Effects of Depression, Low Back Pain, and Comorbidities on Pain After Total Knee Arthroplasty for Osteoarthritis
Authors: Perruccio Anthony V. , Fitzpatrick Jessica , Power J. Denise , Gandhi Rajiv , Rampersaud Y. Raja , Mahomed Nizar N. , Davey J. Roderick , Syed Khalid , Veillette Christian , Badley Elizabeth M. 
Published: June 2019

ObjectiveThe influence of sex on post–total knee arthroplasty (TKA) outcomes has been variable in the literature. Though sex is often reported as an averaged effect, we undertook this study to investigate whether sex modified the influence of presurgery characteristics on post‐TKA knee pain.MethodsThis was a prospective study with data derived from 477 TKA osteoarthritis patients (279 women, 198 men). Questionnaires were completed presurgery and at 3 months postsurgery. The association between 3‐month post‐TKA knee pain and presurgery covariates (body mass index, comorbidity count, symptomatic joint count, low back pain, knee pain, and depressive symptoms) was assessed by linear regression. Sex‐specific effects were evaluated using interactions.ResultsWomen had significantly worse presurgery knee pain, joint count, and depressive symptoms, and worse postsurgery knee pain, than men. With simple covariate adjustment, no sex effect on pain was found. However, sex was found to moderate the effects of comorbidities (worse for women [P = 0.013]), presence of low back pain (worse for men [P = 0.003]), and depressive symptoms (worse for men [P < 0.001]) on postsurgery pain. Worse presurgery pain was associated with worse postsurgery pain similarly for women and men.ConclusionThe influence of some patient factors on early post‐TKA pain cannot be assumed to be the same for women and men; average effects may mask underlying associations. Results suggest a need to consider sex differences in understanding TKA outcomes, which may have important implications for prognostic tool development in TKA.
Relation of Patellofemoral Joint Alignment, Morphology, and Radiographic Osteoarthritis to Frequent Anterior Knee Pain: Data from the Multicenter Osteoarthritis Study
Authors: Macri Erin M. , Neogi Tuhina , Tolstykh Irina , Widjajahakim Rafael , Lewis Cora E. , Torner James C. , Nevitt Michael C. , Roux Michael , Stefanik Joshua J. 
Published: June 2019

ObjectivePatellofemoral (PF) alignment and trochlear morphology are associated with PF osteoarthritis (OA) and knee pain, but whether they are associated with localized anterior knee pain is unknown, which is believed to be a symptom specific to PF joint pathology. We therefore aimed to evaluate the relation of PF alignment and morphology, as well as PFOA and tibiofemoral OA, to anterior knee pain.MethodsThe Multicenter Osteoarthritis Study is a cohort study of individuals with, or at risk for, knee OA. We evaluated cross‐sectional associations of PF alignment, trochlear morphology, and PF and tibiofemoral radiographic OA, with localized anterior knee pain (defined with a pain map). We used 2 approaches: a within‐person knee‐matched evaluation of participants with unilateral anterior knee pain (conditional logistic regression), and a cohort approach comparing those with anterior knee pain to those without (binomial regression).ResultsWith the within‐person knee‐matched approach (n = 110; 64% women, mean age 70 years, body mass index [BMI] 30.9), PF alignment, morphology, and tibiofemoral OA were not associated with unilateral anterior knee pain. Radiographic PFOA was associated with pain, odds ratio 5.3 (95% confidence interval [95% CI] 1.6–18.3). Using the cohort approach (n = 1,818; 7% of knees with anterior knee pain, 59% women, mean age 68 years, BMI 30.4), results were similar: only PFOA was associated with pain, with a prevalence ratio of 2.2 (95% CI 1.4–3.4).ConclusionPF alignment and trochlear morphology were not associated with anterior knee pain in individuals with, or at risk for, knee OA. Radiographic PFOA, however, was associated with pain, suggesting that features of OA, more so than mechanical features, may contribute to localized symptoms.
High‐Throughput Growth of Microscale Gold Bicrystals for Single‐Grain‐Boundary Studies
Authors: Gan Lucia T. , Yang Rui , Traylor Rachel , Cai Wei , Nix William D. , Fan Jonathan A. 
Published: June 2019

AbstractThe study of grain boundaries is the foundation to understanding many of the intrinsic physical properties of bulk metals. Here, the preparation of microscale thin‐film gold bicrystals, using rapid melt growth, is presented as a model system for studies of single grain boundaries. This material platform utilizes standard fabrication tools and supports the high‐yield growth of thousands of bicrystals per wafer, each containing a grain boundary with a unique <111> tilt character. The crystal growth dynamics of the gold grains in each bicrystal are mediated by platinum gradients, which originate from the gold–platinum seeds responsible for gold crystal nucleation. This crystallization mechanism leads to a decoupling between crystal nucleation and crystal growth, and it ensures that the grain boundaries form at the middle of the gold microstructures and possess a uniform distribution of misorientation angles. It is envisioned that these bicrystals will enable the systematic study of the electrical, optical, chemical, thermal, and mechanical properties of individual grain boundary types.
ZnO Thin Film Flexible UV Photodetectors: Regulation on the ZnO/Au Interface by Piezo‐Phototronic Effect and Performance Outcomes
Authors: Duan Yuhan , Cong Mingyu , Jiang Dayong , Zhang Wei , Yang Xiaojiang , Shan Chuncai , Zhou Xuan , li Meng , Li Qian 
Published: June 2019

AbstractThe ZnO flexible ultraviolet photodetectors (UV PDs) with poly(ethylene terephthalate) (PET) substrate are manufactured successfully at room temperature, and the effect of strain on PDs performance are studied. When subjected to 0.2 tensile stress, the responsivity of PDs is increased by 20% and sensitivity is increased by 770%. This is due to the influence of piezo‐phototronic effect on the transport behavior of photogenerated carriers at the interface of ZnO/Au Schottky junction. The polarization charge generated by the piezoelectric element breaks the original thermodynamic equilibrium. As a consequence, the charge at the interface is being redistributed, and the Schottky barrier height (SBH) and depletion layer width change, thus regulating the interface characteristics. This effect has value for the optimization and regulation of the UV PDs performance. Furthermore, current study proves that the piezo‐phototronic effect not only exists in ZnO nanomaterials, but also has a significant piezo‐phototronic effect on high‐quality thin film ZnO materials. In addition, this study also provides an extension field for flexible UV PDs based on piezo‐phototronic effect of semiconductor materials.