bluuebunny/crossref_metadata_2025_split huggingface dataset:
A Pressure-Controlled Torsion-Type Check Microvalve
Authors: Hong Chien-Chong , Lee Sang-Mae , Ahn Chong H. , Nielsen Matthew , McManus Keith 
Published: November 2021

Abstract
In this work, a pressure controlled torsion-type check microvalve has been simulated, designed, fabricated and successfully characterized for a high pressure control. Structural and fluidic analysis for a check microvalve has been performed and compared with experimental results of the fabricated device. A nickel structure fabricated using UV-LIGA techniques has been adopted as a pressure-controlled torsion bar. The results obtained from simulations and measurements show an excellent accordance at low pressure. The device realized in this work has a high potential as a high pressure passive valve for small scale propulsion system.
MEMS, MOEMS and Optoelectronics
Authors: Gilleo Ken 
Published: November 2021

Abstract
Traditional MEMS (Micro-Electro-Mechanical Systems) devices have been with us for decades. A micromechanical motion sensor connected to the airbag electronics in your vehicle is always ready to send the instant message that can save your life. Sensing an abrupt change in motion indicating a crash, the MEMS accelerometer sends the command to fire the airbag. Today, multiple-axis motion-monitoring chips are on the market, so sensitive, that they can measure subtle hand motions. The ADI 202 will be demonstrated as part of this presentation. MEMS sensors are in wide use today but much more advanced activator type products are gaining market recognition as this technology advances.
MOEMS (MicroOptoElectroMechanical Systems), or optical MEMS, adds “light” or optics to the technology cluster to provide the most advanced nano-devices yet. Texas Instruments is a pioneer in the MOEMS field with their highly successful Digital Micromirror Device (DMD™) now used in the best digital projectors and in cinemas. The DMD has more moving parts than a Boeing 777 and the Space Shuttle combined. We will do a case study of the DMD technology and review three products including “Redtooth” fiberless optics wireless.
Optoelectronics, an “old-new” technology, is now the centerpiece of advanced communications especially for long-haul communications. A single optical fiber replaces over 4-million copper wires because of the unimaginable bandwidth resulting from the million-times higher frequency of light and the ability to multiplex hundreds of signals over a single fiber using Wave Division Multiplexing (WDM). But Internet links must be switched back and forth between electronic and photonic media. The reason is that routers and switches depend on electronics while transmission utilizes photonics. Many believe that MOEMS-based switches will solve the multiple conversion bottleneck allowing all-optical systems to smoothly handle traffic. So while MEMS, MOEMS and OE are separate, they all come together in fields like telecom. This paper will highlight these technologies and show how they will merge in an incredible future.
Low Temperature Eutectic Bonding for In-Plane Type Micro Thermoelectric Cooler
Authors: Yao Da-Jeng , Chen Gang , Kim Chang-Jin “CJ” 
Published: November 2021

Abstract
We report the fabrication of a micro thermoelectric (TE) cooler (μ-TEC), lithographically patterned and integrated with silicon micromachining technologies, with an emphasis on two low temperature eutectic bonding techniques used to connect p- and n-type TE microbeams. The result is a microscale cooling spot suspended only by microbridges made purely of TE material at the center of a silicon frame. With no additional material in contact with the cooling spot, thermal leakage is minimized — the critical requirement in making effective μ-TEC’s. Since TE materials degrade at high temperature (&gt; 400°C), connections of p-n microbeams are limited to only low temperature (∼250°C) bonding methods. The overall fabrication procedure has been designed such that most TE thin films can be used without the need to redesign the remaining process flow of the device as TE materials research continues to advance.
Laser Micromachining of MEMS Packaging Materials
Authors: Kancharla Vijay V. , Hendricks Kira K. , Chen Shaochen 
Published: November 2021

Abstract
Tools for microfabrication on planar silicon substrates have led to remarkable advances in miniaturization of MEMS silicon devices. Silicon however has a limited functionality in many MEMS applications. Applications in which there are requirements for electrically or thermally insulating substrates, low capacitance, resistance to corrosion, or hermetic sealing limit some capabilities of silicon as a MEMS material. The introduction of packaging materials such as ceramics, polymers, and glass in MEMS fabrication makes it easy to fabricate 3-D meso or large-scale devices for a wide range of applications at cheaper cost. The application of these materials helps in constructing complex multilayer MEMS structures, which is one of the limitations of traditional Silicon MEMS devices. In this work we investigate and report laser micromachining of MEMS packaging materials such as ceramics and polymers for non-silicon MEMS device fabrication. A review of and general discussion is also presented in regard to the role of lasers in fabricating non-silicon MEMS devices. The experimental results of microstucturing these materials, SEM micrographs, surface morphology after machining, and their applications are reported.
Micromachined Flexible Interconnect for Wafer Level Packaging
Authors: Joung Yeun-Ho , Allen Mark G. 
Published: November 2021

Abstract
Wafer Level Packaging (WLP) of microelectronic circuitry, in which critical package elements are formed on the silicon wafer prior to dicing, has several advantages over conventional packaging techniques, such as one-step testability of multiple chips on a silicon wafer prior to dicing, and the possibility of high input-output (I/O) density. One of the critical elements of WLP is the interconnect. Freely movable interconnects, which act like springs when thermally and mechanically loaded, can be used to relieve thermal and bonding-generated stresses, potentially resulting in improved testablility and reliability in WLP. In this work, flexible free-standing and no-underfill inteconnects were fabricated in a CMOS-compatible surface micromachining technology directly on a silicon wafer. The compliance of these interconnects up to 50 microns in the direction normal to the wafer was measured. Deflections and thermal expansions under mechanical-thermal stress were also simulated using finite element methods. Good agreement was achieved between the measured compliance and that predicted by the finite element analysis.
New Approach to Development of Packaging for MEMS Inertial Sensors
Authors: Pryputniewicz Ryszard J. , Marinis Thomas F. , Hanson David S. , Furlong Cosme 
Published: November 2021

Abstract
Development of MEMS inertial sensor packages for high performance applications cannot be accomplished by analysis alone. There are too many unknown material properties, process conditions, and assembly tolerances to make this feasible. Extensive performance evaluation of packaged sensors is also prohibitively expensive and time consuming. However, recent advances in the ACES methodology of micro-interferometric measurements coupled with analytical and computational analysis offer a considerable promise for effective optimization of the design of advanced sensor packages. Sub-micron displacements of sensors can be readily measured with nanometer accuracy over a range of environmental conditions. This greatly facilitates the validation and refinement of quantitative models of packages and complex material structures. This paper describes the new approach, based on optoelectronic laser interferometric microscope methodology, to development of packaging for MEMS inertial sensors and discusses preliminary results that have been obtained.
A Device for Fabricating Protein Chips Using Surface Acoustic Wave Atomizer and Electrostatic Deposition
Authors: Kim Joonwan , Yamagata Yutaka , Inoue Kozo , Higuchi Toshiro 
Published: November 2021

Abstract
To fabricate protein chips from solution, we propose an advanced system by utilizing the surface acoustic wave atomizer and electrostatic deposition. The system mainly consists of three components: the protein solution supply system, the piezo-SAW atomizer, and the electrostatic particle collector. Protein chips are successfully formed by the device and the particle diameter ranged from 0.2 to 1μm using BSA. The chip of luciferase from firefly was formed by the device and was dissolved in reaction mixture to show strong luminescence. Chips of Anti-mouse IgG was also formed and cross-linked and their activity as immuno globulin was verified by fluorescence method. By utilizing insulation mask, protein chips with desired shapes like rectangular or circular are formed with relatively uniform thickness. Though there are rooms for improvements in terms of deposition efficiency, the device proved to be very effective in forming biochemical active protein chips.
A Capillary Electrophoresis Platform With “On-Chip” Electrochemical Detection: Experimental and Computational Flow Studies
Authors: Roussel Thomas J. , Keynton Robert S. , Walsh Kevin M. , Crain Mark M. , Naber John F. , Jackson Douglas J. , Baldwin Richard P. 
Published: November 2021

Abstract
The purpose of this study was to compare experimental electrokinetic plug flow velocities to computational flow models of microfabricated capillaries. Electroosmotic flow studies of dichlorofluorescein and electrophoretic separation of dopamine and catechol in a microfabricated capillary electrophoresis (CE) system were performed both experimentally and computationally. A “balanced cross design” consisting of a bent 2 cm long injection channel and a straight 2 cm long separation channel was used. The geometry of the capillary was 65 μm wide and 20 μm deep. For the fluorescein study, separation voltages ranging between 0.25 kV and 1 kV were applied, while voltages ranging from 100 V to 550 V were used in the separation studies. Laser Induced Fluorescent (LIF) images were obtained for flow visualization and qualitative analysis in the electroosmotic flow studies, while electrochemical potentials were acquired using “on-chip” electrodes interfaced to a custom-designed power supply and electrochemical detection (ECD) circuit. Finite element models of the experimental device were generated and flows were simulated using commercially available software. For the electroosmotic flow studies, the computational results were found to be within ± 11% of the experimentally obtained values. Similarly, the results of the computational separations of catechol and dopamine predicted plug velocities that were within ± 7.6% of the experimentally determined values.
Constrained Layer Damping Treatments for Microstructures
Authors: Hsu Yi-Chu , Shen I. Y. 
Published: November 2021

Abstract
This paper presents a bulk micro-machining process to fabricate micro-constrained layer treatments (MCLT) on a microstructure to increase its damping. MCLT consists of a silicon base beam or plate, a viscoelastic photoresist layer, and an aluminum constraining layer. Silicon base beams and plates are fabricated from {100} wafer through EDP etch and BOE etch. A 4.5-μm thick photoresist AZ4620 is deposited on the silicon base beam as the viscoelastic layer. Finally, an aluminum layer is deposited through LPVD as the constraining layer. To evaluate damping performance of MCLT, silicon beams with and without MCLT are subjected to swept-sine excitations by PZT from 0 to 100 kHz. In addition, laser Doppler vibrometer and spectrum analyzer were used to measure frequency response functions (FRF) of the specimen. A finite element analysis identifies the resonance modes measured in FRF. Experimental results confirm that MCLT can increase damping of silicon beams by at least 40%. Significantly larger damping improvement is expected, when the fabrication process is refined.
Process Modeling of Projection Micro Stereo Lithography for Three-Dimensional MEMS
Authors: Sun Cheng , Fang Nicholas , Zhang Xiang 
Published: November 2021

Abstract
We present in this paper a high-resolution projection micro stereo lithography (PμSL) process by using a spatial light modulator as the dynamic mask. This unique technology provides a parallel fabrication of highly complex 3D microstructures for MEMS. Based on the understanding of underlying mechanism, the process model has been developed and verified by experiment. The UV doping effect has been examined as it can effectively reduce the curing depth without compromising the chemical property of the resin. Finally, the fabrication of complex 3D microstructures, such as matrix, micro-spring array, with the smallest feature of 10 μm has been reported.
High Temperature Supersonic Jet Facility for Aeroacoustic Studies
Authors: Greska Brenton J. , Krothapalli Anjaneyulu 
Published: November 2021

Abstract
This paper describes a newly built experimental facility at the Florida State University to develop innovative technologies for the noise suppression and mixing control of high-speed jets. This facility is capable of generating jet flows up to a maximum jet exit Mach number of about 2.5 at stagnation temperatures reaching up to 1500K. The facility can accommodate nozzles having an exit diameter of about 80 mm. At the maximum operating conditions, the jet can be run continuously for about 15 minutes. The jet exhausts into an anechoic room that measures 5.2 m (width) × 5.8 m (length) × 4 m (height). A sudden expansion (SUE) burner using Ethylene as its fuel is used to heat the high-pressure air. The instrumentation includes: High Resolution Infrared camera, stereoscopic Particle Image Velocimetry and Laser Speckle Displacement method for flow field measurements, high temperature unsteady pressure probes for the measurement of pressure fluctuations in the hydrodynamic field, and microphones with high speed data acquisition for far-field narrow band sound measurements.
ARL/PENN State Pump Test Loop
Authors: Hambric Stephen A. , Yocum Adam M. , Cawley Thomas , Willits Steven M. 
Published: November 2021

Abstract
A new pump test facility has been designed and built at the Applied Research Laboratory at Penn State University (ARL/PSU). The loop, which complements the many other hydroacoustic measurement facilities at ARL/PSU, can accommodate a wide range of inflow piping, operating conditions, and pump configurations and has been constructed of high quality components to ensure its longevity as a world-class test facility. Measurements of pump hydrodynamic and hydroacoustic performance, as well as measurements of the characteristics of the turbulent flow entering pumps and other devices may be made in the facility. Measurements of the hydroacoustic character of passive devices, such as control valves, are also possible in the loop. The pump loop has been designed to minimize background noise contamination of vibration and fluid acoustic pressure measurements. Loop background noise levels measured with various sources in the building operating (compressors, motors, and other machinery) are extremely low and show that the noise control measures are effective. Wide optical access for Laser Doppler Velocimetry (LDV) measurements allows for measuring space-time correlations of pipe flow turbulence. Sample measurements of turbulence spectra and space-time correlations downstream of a 90 degree elbow are shown, and are of excellent quality.
Experimental Investigations of an Electro-Dynamically Driven Thermoacoustic Cooler
Authors: Mongeau Luc , Alexander Aaron , Minner Brian , Paek In-Su , Braun James E. 
Published: November 2021

Abstract
Experimental investigations of an electro-dynamically thermoacoustic cooler prototype were performed. The prototype was designed to provide 140 W of cooling across a 22 °C temperature lift. Operation using a 55% helium-argon mixture at a mean pressure of 20 bar and a frequency near 180 Hz was targeted. The prototype used a tuned “moving magnet” electro-mechanical actuator. Initial investigations aimed at characterizing the electro-mechanical behavior and performance of the driver. The acoustic response of the system with no cooling elements was then investigated to validate the experimental procedures. The thermal performance of the complete system was then measured over a range of operating conditions, for varying gas mixtures. Detailed sound pressure and temperature measurements provided information from which the overall efficiency, capacity, and temperature lift of the cooling system were estimated, in addition to the heat exchange coefficients and performance of the heat exchangers. Net acoustic power inputs of up to 120 W were achieved with an electro-acoustic transduction efficiency varying between 20% and 50%, reaching values as high as 60% in a few cases. In comparison, the theoretical maximum driver efficiency was 65%. The measured cooling capacity varied greatly and peaked near 130 W for a temperature lift of 12°C. The acoustic pressure amplitudes were near 3% of the mean pressure in the stack region, and the heat rejected to a secondary fluid reached 250 W. The best relative coefficient of performance achieved was less than 3% of Carnot, based on the net input acoustic power. The best overall efficiency achieved was thus 1.2% of Carnot. While the acoustic power level exceeded the target value for the desired cooling load, the cooling power was well below the expected value, and the target temperature lifts and efficiencies were not achieved. This was generally attributed to “nuisance” heat loads, acoustic streaming effects, and migration of species within the inhomogeneous mixture. The non-dimensional heat exchanger performance in the thermoacoustic system was found to be slightly less than that in a steady uniform flow when the root-mean-square particle velocity is used for a velocity scale, and the stack end temperature is used in the calculation of the temperature lift. It was also found that this performance value is significantly better than that predicted by linearized boundary layer models often used in linear acoustic models.
Optimum Stiffener Design to Reduce Broadband Vibration and Sound Radiation
Authors: Lee Dongjai , Belegundu Ashok D. , Koopmann Gary H. 
Published: November 2021

Abstract
This paper presents a rib-stiffener pattern design method for reducing vibration energy and/or radiated acoustic power from a vibrating structure. Structural dynamics, acoustics and optimization are programmed in a unified code. To avoid difficulties in defining proper design variables such as the location, the number and the size of stiffeners to be attached on a structure, this paper adopts the idea of “topology optimization”, based on finite elements. This approach enables one to find an optimal rib-stiffener pattern by using a simple design variable, e.g., the density of finite elements. To illustrate this method, a rectangular plate with clamped edges is optimized to reduce the radiated sound power/kinetic energy and the results are compared to that the same plate but without rib-stiffeners.
A New Numerical Technique for the Unification of Propagation and Scattering Problems in Underwater Acoustics
Authors: Sidorovskaia Natalia A. 
Published: November 2021

Abstract
A new numerical algorithm for obtaining a normal mode solution of the Helmholtz equation for an arbitrary sound speed profile in the ocean is discussed. The new method represents the solution as a series expansion in terms of basis modal functions corresponding to the solution of a reference iso-velocity problem. The numerical optimization procedures that allow improving the computational performance of the code are considered. An important advantage of the presented algorithm is a straightforward transformation of the solution into spherical representation suitable for mapping an incident waveguide field into a scattered one to describe a scattering process from an elastic object in a waveguide. The mathematical formulation of the transformation is presented. The numerical model has already proved to be competitive with Navy standard propagation simulation tools.
Computation of Noise From Fully-Expanded Supersonic Jet Using Low-Dispersion Methodology
Authors: Baysal Oktay , Idres Moumen M. 
Published: November 2021

Abstract
A novel mathematical model and its solution are presented to simulate the generation and the propagation of supersonic jet noise. An objective in developing this model was to seek an approach that would be feasible in a design environment, where a number of consecutive simulations would be needed. Hence, a judicious compromise was afforded between the computational efficiency and the overall accuracy of the methodology in representing the underlying physics. The noise generation was modeled as axisymmetric or helical instabilities introduced in the upstream boundary. The propagation was simulated by solving the three-dimensional and linearized Euler equations in a very efficient way by a dispersion-relation-preserving scheme. The predicted relative values of the sound pressure level contours have successfully been compared with the experimental data and other computational approaches.
Reconstruction of Transient Acoustic Radiation From Impulsively Accelerated Objects
Authors: Bajwa Manjit S. , Wu Sean F. 
Published: November 2021

Abstract
The HELS method (Wu, 2000) is extended to reconstruction of transient acoustic radiation from an impulsively accelerated object. The temporal acoustic pressure field is reconstructed by taking an inverse Fourier transformation of the acoustic pressure in the frequency domain. The infinite integral is replaced by a contour integral and evaluated using the residue theory. The formulations thus derived are valid for a spherical surface with an arbitrary normal velocity distribution. These formulations are used to reconstruct the normal surface velocities and transient acoustic fields generated by explosively expanding sphere, impulsively accelerating sphere, and impulsively accelerating baffled sphere. Results show that satisfactory reconstruction can be obtained with relatively few measurements taken around the object under consideration.
Active Acoustic Control of Conical Bores Through Actuating Boundary Conditions
Authors: Farinholt Kevin M. , Leo Donald J. 
Published: November 2021

Abstract
This paper presents an investigation into control of sealed conical bores. Beginning with an impedance model of the enclosure, frequency domain and state-space models of the system are developed as functions of the geometric and mechanical properties of the cone. A discussion of coupling this acoustic model with the electrical and mechanical dynamics of a permanent magnet speaker are also presented. Using a sample geometry, the accuracy of this coupled model is validated against experimental results, indicating accuracy levels of 1.75% or lower in prediction of resonance frequencies. This paper concludes with a study on applying Linear Quadratic Regulator techniques to this system, relating trade-offs between average pressure and control voltages. The results of our simulations indicate that pressure reductions of 40.5% are attainable with average control voltages of 3.26 volts when subject to low level impulse disturbances, as applied to an example geometry.
Principles for Procedure System Management
Authors: Sturdivant Maggie , Carnes Earl 
Published: November 2021

Abstract
This paper provides a preview of a DOE Technical Standard “Principles for Procedure System Management” due to be released in the fall of 2001. Procedures are identified as causal factors in accidents, operating events, and lessons learned within the U.S. Department of Energy (DOE), the commercial nuclear industry, and other complex industries. While literature exists regarding the control, production, and use of procedures, DOE has not provided guidance on the collective elements and attributes of an effective procedure system. This paper describes a set of design control features that can systematically improve development and maintenance of procedures.