bluuebunny/crossref_metadata_2025_split huggingface dataset:
Technological Innovations in Urban and Peri-Urban Agriculture: Pathways to Sustainable Food Systems in Metropolises
Authors: Fei Shulang , Wu Ruiqin , Liu He , Yang Feifei , Wang Nan 
Published: February 2025

Metropolitan areas increasingly confront complex challenges related to food security, social inequality, environmental degradation, and resource scarcity, exacerbated by rapid urbanization, climate change, and the reliance on extended, fragile supply chains. Urban and peri-urban agriculture (UPA) is recognized as a promising approach to mitigate these issues. For example, it enhances food security and nutrition by strengthening local food supply systems, improves livelihoods by providing employment and income for local residents, and promotes environmental sustainability through the creation of greening spaces and reduction of food miles. However, the full potential of UPA remains constrained by various technological, economic, and social barriers, such as limited growing spaces, lack of land tenure security, low economic efficiency, and insufficient public awareness and acceptance. Given that the technological innovations are critical in overcoming these barriers and maximizing the positive impacts of UPA, this review provides a state-of-the-art overview of advanced technologies and tools applicable to UPA, aiming to inform how these innovations can be better enabled to enhance UPA’s contributions to sustainable urban food systems. The review begins by defining UPA, categorizing its various forms, and exploring its multifunctional roles within urban contexts. It then presents a thorough analysis of a range of UPA technologies that serve specific purposes, including productivity and product quality improvement, space utilization optimization, resource recycling, and land use management. Furthermore, the review evaluates the current challenges faced by these technologies throughout the stages of research and development (R&D), dissemination and extension, and application and commercialization, employing an analytical framework adapted from Technology Life Cycle theories. In conclusion, the review emphasizes the crucial roles that UPA and relevant technological innovations play in transforming food systems and urban environments. It proposes four key recommendations: (1) enhancing funding mechanisms and fostering interdisciplinary collaboration for UPA R&D, (2) strengthening UPA technology dissemination systems, (3) promoting economic feasibility and market integration within UPA business models, and (4) establishing supportive environments among all stakeholders in the innovation process. These targeted strategies are essential for scaling UPA technologies, thereby strengthening food security, environmental sustainability, and socio-economic resilience in metropolitan areas.
Otimização adesão ao tratamento medicamentoso da depressão na atenção básica: estratégias eficazes e fatores influenciadores
Authors: Rigo Eloisa , Machado Heloize Schultz , Rozin Leandro 
Published: February 2025

Em ambulatórios de atenção primária, a prevalência de sintomas depressivos acomete até 10% dos pacientes. Apesar das terapias eficazes, a adesão ao tratamento antidepressivo apresenta baixa adesão e alta taxa de abandono, contribuindo para a refratariedade ao tratamento, maior morbimortalidade e risco de suicídio. Objetivo: identificar estratégias e os fatores que influenciam na melhora da adesão ao tratamento medicamentoso da depressão na Atenção Básica. Metodologia: Trata-se de uma revisão integrativa da literatura através da base de dados "PubMed" com os seguintes descritores: "(major depressive disorder) AND (medication adherence) AND (depression)". Foram excluídos artigos que não tinham enfoque na adesão ao tratamento. Resultados e Discussão: Esta revisão revela que a qualidade das informações apresentadas na primeira consulta pode influenciar na otimização da adesão. Os profissionais devem explicar que o tratamento exige acompanhamento a longo prazo e adesão, bem como retratar os efeitos colaterais. Deve-se incluir parceiros e família no plano terapêutico, o que pode contribuir significativamente. Ademais, a abordagem interdisciplinar no cuidado demonstrou ser efetividade. A terapia cognitivo-comportamental em grupo (TCCG) é uma ferramenta eficaz que pode reduzir o senso de estigma dos pacientes, promove a adesão e alivia os sintomas. Antecipa-se que pacientes com sintomas graves possam se beneficiar mais dessas intervenções. Conclusão: A não adesão aos antidepressivos representa um significativo desafio na prática clínica contemporânea, comprometendo a eficácia dos tratamentos. Esta revisão revela que melhorar a adesão pode ser alcançado com estratégias como boa comunicação, envolvimento de familiares e abordagem interdisciplinar. Implementar essas estratégias é crucial para melhorar os resultados.
PENGARUH OPINION SHOPPING, DAN DEBT DEFAULT TERHADAP PENERIMAAN OPINI AUDIT GOING CONCERN
Authors: Munzir Munzir , Nurfatimah Uswatul Fajar , Nisak Kamila Maulidiya 
Published: February 2025

Penelitian ini bertujuan untuk menilai secara empiris pengaruh Opinion Shopping, dan Debt Default terhadap Penerimaan Opini Audit Going Concern. Penelitian ini berjenis penelitian kuantitatif. Penarikan hipotesis penelitian menggunakan basis teori Agensi dan teori atribusi, didukung oleh penelitian-penelitian sebelumnya yang mempunyai kesamaan variabel. Sampel Penelitian yaitu 11 Perusahaan Pertambangan yang terdaftar di Bursa Efek Indonesia. Jenis data yang digunakan adalah data sekunder hasil pengumpulan dokumen laporan keuangan. Menggunakan teknik statistik deskriptif dan Regresi Logistik berbantuan SPSS 25.0 untuk analisis data. Selain itu penelitian ini menggunakan uji kelayakan model regresi. Hasil penelitian menunjukkan bahwa secara parsial Debt Default berpengaruh positif terhadap Penerimaan Opini Audit Going Concern. Sedangkan Opinion Shopping secara parsial berpengaruh negatif terhadap Penerimaan Opini Audit Going Concern
Analisis Faktor-faktor yang mempengaruhi Kinerja Karyawan: Kompensasi, Motivasi Kerja, Lingkungan Kerja
Authors: Sanaba Hardiman F. , Andriyan Yoga , Munzir Munzir 
Published: February 2025

Sumber Daya Manusia (SDM) merupakan manusia yang dipekerjakan di sebuah organisasi sebagai penggerak, pemikir dan perencana untuk mencapai tujuan organisasi. Kinerja merupakan hasil fungsi pekerjaan atau kegiatan seseorang dalam suatu organisasi yang dipengaruhi oleh berbagai faktor untuk mencapai tujuan organisasi dalam periode waktu tertentu. Kinerja adalah keberhasilan personel, tim atau unit organisasi dalam mewujudkan sasaran strategic yang telah ditetapkan sebelumnya dengan perilaku yang diharapkan. Penilitian ini bertujuan untuk menganalisis dan mengidentifikasi kajian literatur atau literatur review yang menggunakan dua puluh artikel ilmiah yang bersumber dari Mendley dan Scholar Google. Penilitian ini menggunakan metode penilitian literature review dengan pendekatan desktiptif (descriptive literature review). Faktor-faktor yang mempengaruhi kinerja karyawan adalah kompensasi, motivasi kerja, dan lingkungan kerja. Hasil penilitian menemukan bahwa terdapat (1) kompensasi memiliki pengaruh terhadap kinerja karyawan, (2) motivasi kerja memiliki pengaruh terhadap kinerja karyawan dan (3), lingkungan kerja memiliki pengaruh terhadap kinerja karyawan. Selain itu, tujuan penulisan artikel ini guna membangun hipotesis pengaruh antar variabel untuk digunakan pada riset selanjutnya
SISTEM PAKAR DIAGNOSIS BALITA: FORWARD CHAINING DAN FUZZY MATCHING UNTUK VALIDASI GEJALA
Authors: Setiawan Iwan 
Published: February 2025

Mendiagnosis penyakit pada balita sering kali menjadi tantangan bagi tenaga kesehatan, terutama ketika gejala yang muncul, seperti demam, batuk, dan pilek, memiliki kemiripan. Kesulitan ini semakin kompleks dengan adanya variasi cara orang tua mendeskripsikan gejala, seperti menyebut "pilek" dengan istilah "flu ringan" atau "hidung tersumbat." Perbedaan semantik ini sering kali menyebabkan ketidakpastian yang memengaruhi akurasi diagnosis, terutama jika hanya mengandalkan metode konvensional. Penelitian ini menawarkan solusi berupa pengembangan sistem pakar yang memadukan metode Forward Chaining dan Fuzzy Matching untuk meningkatkan keakuratan diagnosis. Teknologi Natural Language Processing (NLP) digunakan untuk mengenali gejala dari deskripsi teks yang diberikan pengguna, sementara Fuzzy Matching dirancang agar sistem mampu memproses input dengan toleransi terhadap kesalahan kecil dalam penulisan. Tingkat kepercayaan diagnosis dihitung menggunakan Certainty Factor (CF), yang memberikan bobot berdasarkan kesesuaian gejala. Pengujian menunjukkan bahwa sistem ini memiliki akurasi hingga 91% dan waktu pemrosesan yang singkat, rata-rata kurang dari 1 detik. Sistem ini diharapkan dapat menjadi alat bantu yang bermanfaat bagi tenaga kesehatan, terutama di daerah dengan akses terbatas ke dokter spesialis, sehingga mempercepat pengambilan keputusan yang tepat untuk kesehatan balita
Photometric Stellar Parameters for 195,478 Kepler Input Catalog Stars
Authors: Zhang Bowen , Huang Yang , Beers Timothy C. , Xiao Kai , Liu Jifeng , Jia Lei , Han Henggeng , Li Zhirui , Zheng Chuanjie , Sun Yongkang , Shi Ruifeng , Gu Hongrui 
Published: February 2025

Abstract
The stellar atmospheric parameters and physical properties of stars in the Kepler Input Catalog (KIC) are of great significance for the study of exoplanets, stellar activity, and asteroseismology. However, despite extensive effort over the past decades, accurate spectroscopic estimates of these parameters are available for only about half of the stars in the full KIC. In our work, by training relationships between photometric colors and spectroscopic stellar parameters from Gaia DR3, the Kepler-INT Survey, Large Sky Area Multi-Object Fiber Spectroscopic Telescope DR10, and Galactic Evolution Experiment at Apache Point Observatory DR17, we have obtained atmospheric parameter estimates for over 195,000 stars, accounting for 97% of the total sample of KIC stars. We obtain 1σ uncertainties of 0.1 dex on metallicity [Fe/H], 100 K on effective temperature T
eff, and 0.2 dex on surface gravity log g. In addition, based on these atmospheric parameters, we estimated the ages, masses, radii, and surface gravities of these stars using the commonly adopted isochrone-fitting approach. External comparisons indicate that the resulting precision for turnoff stars is 20% in age; for dwarf stars, it is 0.07 M
⊙ in mass, 0.05 R
⊙ in radius, and 0.12 dex in surface gravity; and for giant stars, it is 0.14 M
⊙ in mass, 0.73 R
⊙ in radius, and 0.11 dex in surface gravity.
GECAM Observations of the Galactic Magnetar SGR J1935+2154 during the 2021 and 2022 Burst Active Episodes. I. Burst Catalog
Authors: Xie Sheng-Lun , Cai Ce , Yu Yun-Wei , Xiong Shao-Lin , Lin Lin , Zhao Yi , Zhang Shuang-Nan , Song Li-Ming , Wang Ping , Li Xiao-Bo , Xue Wang-Chen , Zhang Peng , Zheng Chao , Zhang Yan-Qiu , Liu Jia-Cong , Wang Chen-Wei , Tan Wen-Jun , Wang Yue , Yu Zheng-Hang , Feng Pei-Yi , Zhang Jin-Peng , Xiao Shuo , Zhao Hai-Sheng , Zhang Wen-Long , Zhang Yan-Ting , Huang Yue , Zhao Xiao-Yun , Ma Xiang , Zheng Shi-Jie , Li Xin-Qiao , Wen Xiang-Yang , Gong Ke , An Zheng-Hua , Zhang Da-Li , Yang Sheng , Liu Xiao-Jing , Zhang Fan 
Published: February 2025

Abstract
Magnetars are neutron stars with ultrahigh magnetic fields (~1014–1015 G). The magnetar SGR J1935+2154 is not only one of the most active magnetars detected so far, but also the unique confirmed source of fast radio bursts. The Gravitational Wave High-energy Electromagnetic Counterpart All-sky Monitor (GECAM) is dedicated to monitor gamma-ray transients all over the sky, including magnetar short bursts. Here we report the GECAM observations of the burst activity of SGR J1935+2154 from 2021 January to 2022 December, which results in a unique and valuable data set for this important magnetar. With a targeted search of GECAM data, 159 bursts from SGR J1935+2154 are detected by GECAM-B while 97 bursts are detected by GECAM-C, including the X-ray burst associated with a bright radio burst. We find that both the burst duration and the waiting time between two successive bursts follow lognormal distributions. The period of burst activity is 134 ± 20 days, thus the burst activity could be generally divided into four active episodes over these two years. Interestingly, the hardness ratio of X-ray bursts tends to be softer during these two years, especially during the active episode with radio bursts detected.
Fungal fairy rings: history, ecology, dynamics and engineering functions
Authors: Zotti Maurizio , Bonanomi Giuliano , Mazzoleni Stefano 
Published: February 2025

Fungal fairy rings (FFR) are fascinating natural phenomena that have intrigued people and scientists for centuries. These patterns, often represented by circular distributions of altered vegetation, are found in grasslands and forest habitats. Fairy rings occur when fungi grow radially in the soil, raising from a central point, progressively degrading organic matter and thus affecting vegetation. The observation of such spatial patterns allows mycologists to conduct an in-depth analysis of the role of fungi in ecosystems.
This review presents the current knowledge and scientific advancement of the studies of FFRs. An historical appraisal from the most representative pioneer studies until recent works is presented in different scientific fields, including microbiology, chemistry, botany and ecology. Based on a deep analysis of bibliographic data, we synopsised different aspects of FFRs: i) history of studies, ii) taxonomy, iii) ecology (environmental conditions and biogeography), iv) classification of vegetation patterns, v) spatial dynamics, vi) role as ecosystem engineer (impact on soil chemistry, plants and microbiota).
In conclusion, beside still open research areas requiring further investigation, a schematic functional model of fungal fairy rings is proposed, in which on one hand the dynamics of the fungal mycelium is explained by self-DNA accumulation and the build-up of autotoxicity. On the other hand, the effects of fungi on plants are related to the intermingled and differently spatially distributed effects of hydrophobicity, phytotoxicity and phytostimulation.
Synthesis of Highly Stable Near-Infrared FAPbI3 Perovskite doped with 5-AVA and its Applications in NIR Light-Emitting Diodes for Bioimaging
Authors: Din Nasrud , Saeed Fawad , Hussain Sajid , Sultan Dawood , Sellan Premkumar , Onwudiwe Damian Chinedu , Talaighil Razika Zair , Khan Qasim , Ashraf M. Zaman , Lei Wei 
Published: February 2025

The continuously increasing external quantum efficiencies of Perovskite light-emitting diodes (LEDs) have received significant interest in the scientific community. The need for monitoring and medical diagnostics has experienced a steady growth in recent years, primarily caused by older people and an increasing number of heart attacks, tumors, and cancer disorders among patients. The application of Perovskite near-infrared light-emitting diode (PeNIRLEDs) has exhibited considerable efficacy in bioimaging, particularly in the visualization and examination of blood arteries, blood clots, and tumors. PeNIRLEDs exhibit exciting potential in the field of blood vessel imaging because of their advantageous attributes, including improved depth penetration and less scattering in comparison to visible light. In this study we synthesized of FAPbI3 Perovskite doped with different concentrations of 5-Aminovaleric acid (5-AVA) 1-6 mg. The incorporation of 5-AVA as a dopant during the FAPbI3 Perovskite formation, it influences the FAPbI3 Perovskite’s structural and optical properties. While improve the FAPbI3 Perovskite’s stability, photoluminescence efficiency, and charge transport characteristics. We found resulting PL emission peak wavelength of 850 nm and bandwidth of 44 nm along with a calculated quantum yield of 75%.The incorporation of 5-AVA-modified FAPbI3 Perovskite into LEDs will show promising results, enhancing device efficiency, color purity, and stability. Making it suitable for various medical applications, including subcutaneous deep vein imaging, blood flow visualization, and tumor illumination.
Liquid Metal Jetting for High-Performance Computing Applications
Authors: Agarwal Sunny , Lazić Miloš 
Published: February 2025

Gallium-based liquid metals (LMs) are materials that possess some unique properties. Just like any other metals, they have high thermal conductivity and low interfacial resistance, but they are in a liquid phase at room temperature. In contrast to mercury alloys, gallium alloys are non-toxic. They don’t evaporate, and they can’t be inhaled. The viscosity of those alloys is very similar to water, but they are six times as dense as water. All those properties make gallium-based liquid metals very good candidates for thermal interface material (TIM) in electronics applications. On the other hand, the reaction and incompatibility of those alloys with some metals is one of the challenges for this type of TIM. The other challenge is that those materials are not just thermally, but also electrically conductive, and that is not a desirable property for TIM. A suitable barrier that will prevent any leakage of LMs and the best way to apply the appropriate volume of LM in high-volume production (HVP) would be one of the most important things for any application. A key challenge is applying the liquid metal consistently through a traditional dispensing method due to its property and behavior which involves high surface tension. Through advanced dispensing techniques like jetting technology, liquid metal can be applied reliably on a flat, uneven surface or in arrays of minuscule confined spaces or cavities. This paper highlights the dispense quality, weight repeatability from one substrate to another, and valve hardware stability. This paper also addresses the challenges faced during dispensing of liquid metal in high volume manufacturing, and how to achieve desired bondline thickness with jet dispensing for higher throughput and process reliability.
Investigation for the Influences of Factors Within the Semi-Additive Process (SAP) on Nanovoid Formation in the Cu-Cu Interface by STEM Analysis
Authors: Matsumoto Kanji , Yamamoto Hisamitsu 
Published: February 2025

Electroless copper deposition is widely used in the electronics industry. In recent years, electronic components tend to be densified as the performance of electronic devices increases. The densification of electronics components means the decreasing of conductor width and spaces formed as the circuit patterns and reducing the diameter of Blind Via Holes used as an interconnect between the circuit layers within the electronic substrates. If voids exist in reduced diameter BVHs, the reliability of electronics components could decrease. Thus, voids formed in the electrolytic Cu / electroless Cu interface and electroless Cu / inner layer Cu interface and the cause of the formation of voids have been the focus of attention in recent years. Although there are some studies regarding voids formation in the interfaces of electrolytic Cu / electro-less Cu / inner layer Cu for such this reason, factors relating to the formation of nanovoids in the interfaces are not clearly mentioned. Therefore, the purpose of this paper is investigation for various factors that could cause void formation in the interface. Experiments performed on actual substrates consisting of copper foil, electroless copper layer, electrolytic copper layer and glass epoxy resin are very practical and easy to understand. On the other hand, it will be hard to find out the root cause of void formation owing to too complicated processes for production of these substrates. We adopted a special method of experiment to prepare samples in order to investigate the effect of just one factor from many factors. This method will be included in the process for preparing actual substrates for the formation of voids. STEM-EDX was used to confirm whether voids exist in the interface or not and the area of electroless copper layer is identified from EDX Ni-mapping results. AES also was used for analysis on surface of inner layer copper. The TEM lamellae were prepared with FIB. The results obtained from these experiments clarify that the formation of voids was related to the presence of copper oxide on the inner layer copper.
Laser Assisted Bonding for Flip Chip Interconnection of Very Large Chips
Authors: Sarr Cheikh Samba , Danovitch David , Kanso Malak , Gagnon Pascale , Pion Marc-Olivier 
Published: February 2025

In recent years, laser-assisted bonding (LAB) has emerged as a promising means to address specific flip-chip assembly issues associated with conventional mass-reflow (MR) and thermo-compression bonding (TCB) processes, for example chip warpage reduction. However, studies have predominantly focussed on small to medium sized chips. For memory, processor, and interposer applications, chip sizes may be much larger. The ability to effectively distribute laser energy across such larger interconnection areas is practically unexplored. This paper investigates LAB behavior for a 25mm x 26mm silicon chip comprising Cu pillar/SAC solder interconnects, with a particular focus on the size of the optically generated homogeneous laser beam. A heat transfer study was first conducted to estimate the relationship between chip surface temperature, which can be measured and controlled during the LAB process, and actual joint temperature, the latter requiring a special thermocouple assembly module. The responses allowed the determination of an appropriate range of LAB profile parameters for assembly development. Assembly results reported revealed that beam size extension beyond the chip region is critical to achieving repeatable defect-free interconnection of such large chips. This relationship was additionally supported by thermal finite element modelling (FEM) that demonstrated that the impact of convective effects at the chip periphery on solder joint temperature distribution, and remediation of same by beam size enlargement, became increasingly important with increasing chip size. It was further demonstrated that, despite the larger beam size and its effect on substrate surface temperature, post assembly chip warpage was reduced by about 50% using LAB as compared to the MR process. Finally, microstructural comparisons between LAB and MR validated that initial intermetallic compound (IMC) formations are significantly reduced on these large chip assemblies, in line with previous studies on smaller chips.