bluuebunny/crossref_metadata_2025_split huggingface dataset:
MUSIC THERAPY - AN INNOVATION
Authors: Bohra Manish 
Published: February 2021

Music therapy is the only proven and rational form of ancient music method developed in the sequence of human development. The therapeutic and proven proven method of musical elements by professionals to achieve personal goals related to treatment is called music therapy. The fulfillment of physical, psychological, emotional, intellectual, logical and social or community needs within the purview of medical practice can be considered as the purpose of music therapy. Music is known as an element that contributes positively to the development of personality development, communication skills development, creativity and creativity development, expression and cognition abilities. Music from fetus to death affects the entire life cycle. It is a worldwide language that affects everyone in one way or another.
मानव विकास क्रम में विकसित प्राचीन संगीत पद्धति का तर्कपूर्ण एवं प्रयोग सिद्ध स्वरूप ही संगीत चिकित्सा है। उपचार संबंधी व्यक्तिगत लक्ष्यों की प्राप्ति हेतु पेशेवरों द्वारा सांगीतिक तत्वों का चिकित्सकीय, प्रमाण सिद्ध प्रयोग विधि एवं प्रक्रिया संगीत चिकित्सा कहलाती है। शारीरिक, मनोवैज्ञानिक, भावनात्मक, बौद्धिक, तार्किक एवं सामाजिक अथवा सामुदायिक आवश्यकताओं को चिकित्सकीय प्रविधि की परिधि में रहकर पूर्ण करना संगीत चिकित्सा का उद्देश्य माना जा सकता है। संगीत एक ऐसे तत्व के रूप में जाना जाता है जो व्यक्तित्व विकास, सम्प्रेषण कौशल विकास, रचनात्मकता एवं सृजनशीलता विकास, अभिव्यक्ति एवं अनुभूति परख योग्यताओं के विकास में सकारात्मक योगदान देता है। भ्रूण से मृत्युपर्यन्त संगीत संपूर्ण जीवन चक्र को प्रभावित करता है यह एक विश्वव्यापी भाषा है जो प्रत्येक को किसी न किसी रूप में प्रभावित करती है।
PELATIHAN PENINGKATAN INKLUSI KEUANGAN DAN PERLUASAN PASAR PRODUK BAGI PEREMPUAN PENGRAJIN KASUR KAPUK DI DESA SANDIK KABUPATEN LOMBOK BARAT
Authors: Chaidir Taufiq , Putri Ida Ayu , Ariani Gusti Ayu , Ismiwati Baiq 
Published: February 2021

Peningkatan inklusi keuangan dan perluasan pasar produk merupakan cara yang dapat dipergunakan oleh pemerintah dan masyarakat dalam mengatasai kemiskinan. Hal ini disebabkan karena dengan inklusi keuangan maka setiap orang dapat memiliki akses dan layanan penuh dari lembaga keuangan secara tepat waktu, nyaman, informatif, dan terjangkau biayanya dengan penghormatan penuh kepada harkat dan martabatnya. Sedangkan perluasan pasar produk yang dihasilkan pengusaha diharapkan dapat meningkatkan penjualan yang pada akhirnya dapat meningkatkan pendapatan, tabungan masyarakat, pertumbuhan ekonomi yang pada akhirnya dapat mengurangi jumlah penduduk miskin. Oleh karenanya tujuan dari pengabdian ini adalah meningkatkan inklusi keuangan dan perluasan pasar produk bagi perempuan pengrajin kasur kapuk Di Desa Sandik Kabupaten Lombok Barat. Pengabdian ini merupakan kelanjutan hasil pengabdian yang telah dilaksanakan pada tahun 2018 yang diperlukan oleh sasaran target. Metode yang digunakan dalam kegiatan ini pertama observasi,kedua memberikan penyuluhan terkait dengan peningkatan inklusi keuangan dan perluasan pasar produk ketiga, memberikan pendampingan untuk memperluas pasar produk. Hasil kegiatan, peserta bersedia menularkan pengetahuan yang diperolehnya pada penrgrajin yang lain diseputar tempat mereka tinggal, adanya keinginan dari peserta untuk membentuk kelompok usaha guna mempermudah aksesibilitas dalam memperoleh modal, bimbingan tekhnis dalm proses produksi,design produk dan pemasaran secara online.
PRINT AS THE CONTEXTUAL FACTOR OF MODERN AGE
Authors:   Institute of Journalism of Taras Shevchenko National University, Ukraine, Teremko Vasyl 
Published: February 2021

This article traces the transformations of individual, caused by informational interventions in his\her mental world, intensified by the development of print as a technological centre of the Industrial Era media system, followed the explosion of consumer psychology, replacing individuality by the “mass person” perplexed by “fashion epoch”. A humanistic ideal, self-sufficient, self-sustained individual appears in such worldview systems as a consumer. A set of individuals selected by specific criteria appears as the target audience, the mass consumer, chosen to buy everything from tastes and goods to ideologies, political doctrines, ways of life, fashion, government, friends, enemies and even war or peace.	The production of such consumers started with the phenomena of scaling and unification, intensified by the books-bestsellers, mass media, tabloids, glossy and glamorous magazines, entertainment television, pop music, blockbusters and TV series. Based on the investigation of individual and mass subconscious psychological mechanisms and impact techniques, taste and critical thinking was consistently destroyed, which drove to imposing absolute consumerism as continuously stimulated insatiability of needs, leading to the consumption loop, where requirements are impossible to satisfy. Intellectually simplified, spiritually exhausted media signals, aimed at the instinctively emotional spheres of individuals, steadily lowered the horizon of personal expectations and the thresholds of information accessibility, weakened critical thinking, blurred ethical filters, levelled tastes and transformed the audience into a mass. Furthermore, despite the specific differences, this trend has penetrated all social and individual spheres.	Under the pressure of aggressive reality and communication campaigns, a holistic, harmonious, self-aware, intentional personality lost its value for itself. The process, begun in the New Age, was a kind of denial of its foundations and prepared an individual for the transition to the information age.
VALUASI EKONOMI MATA AIR MUDAL, BEJIHARJO, KARANGMOJO, GUNUNGKIDUL, YOGYAKARTA DENGAN METODE REPLACEMENT COST
Authors: Putri Arista 
Published: February 2021

Mata Air Mudal merupakan mata air yang timbul dari aliran sungai bawah tanah yang berada di Desa Ngringin, Bejiharjo, Karangmojo, Gunungkidul. Mata air ini digunakan warga sekitar untuk mengairi sawah mereka, sehingga pada penelitian kali ini penulis menghitung nilai ekonomi dari Mata Air Mudal dengan metode biaya pengganti salah satunya dengan menghitung nilai ekonomi dari sawah yang di airi oleh Mata Air Mudal. Selain biaya pengganti dengan menghitung nilai ekonomi sawah, dihitung pula biaya pembangnan irigasi, serta biaya bak penampungan mata air dengan nilai akhir masing masing aspek sebesar Rp. 73.527.369,00, untuk nilai ekonomi persawahan, Rp. 138.213.648,000 untuk nilai ekonomi irigasi sawah, Rp. 194.233.836 untuk nilai ekonomi bak penampungan mata air mudal dengan nilai ekonomi total sebesar Rp. 405.971.853,00
Dialectics of ‘Inclusion and Exclusion’ in Nepal: A Review
Authors: Bhatta Chandra D. 
Published: February 2021

Nepal’s post 1990s political discourse has witnessed many issues and the most important ones, among them, are also related to inclusion and exclusion. Both of them have taken the centre stage for their own reasons. Yet, the debate itself is not going toward the right direction and there is more than one reason for that. A closer look of the discourse on the subject indicates that it certainly has not been much helpful to address problems coming out of it. In contrast, it has not only weakened the social fabric of society but also preparing grounds for the latent conflicts as well. If Nepal’s problems of inclusion and exclusion are to be resolved, there certainly is a need to revisit the debate itself. There are certainly problems in Nepali society as they are in others societies as well. Having said this, however, the crux of the matter is that the narrative that has been established in society over the years and their role in guiding the process is not free problem. Among many other factors, they do not necessarily take societal realities and its foundations into consideration.
Yield and Failure Analysis of FinFET Source to Drain Leakage in 12nm Technology
Authors: Beaudoin Felix , Kodali Satish , Deshpande Rohan , Zhao Wayne , Banghart Edmund , Lee Rinus , Mahalingam Thirukumaran , Yuksek Nuh , Yuan Lu , Tao Wang , Li Lillian , Perumalla Sushruth Goud , Arora Shweta , Rust Trejo 
Published: February 2021

Abstract
Fault localization using both dynamic laser stimulation and emission microscopy was used to localize the failing transistors within the failing scan chain latch on multiple samples. Nanoprobing was then performed and the source to drain leakage in N-type FinFETs was identified. After extensive detailed characterization, it was concluded that the N-type dopant signal was likely due to projections from the source/drain regions included in the TEM lamella. Datamining identified the scan chain fail to be occurring uniquely for a specific family of tools used during source/drain implant diffusion activation. This paper discusses the processes involved in yield delta datamining of FinFET and its advantages over failure characterization, fault localization, nanoprobing, and physical failure analysis.
Qualification and Selection Philosophy for the SuperCam IRS Photodiode on Perseverance Rover
Authors: Jacquinod Sophie , Reess Jean-Michel , Tuong Napoléon Nguyen , Parisot Jérôme , Chapron Frédéric , Kiryukhina Kateryna , Perez Guy , Bascoul Guillaume , Gilard Olivier , Mekki Julien , Heim Marina , Raynal Estelle , Hello Yann 
Published: February 2021

Abstract
The SuperCam instrument was selected by NASA in July 2014 and has been implemented on the Mars 2020 Perseverance rover. This instrumental suite gathers four different remote-sensing techniques including a very compact Infrared Spectrometer (IRS). For several reasons of costs and planning and after a risk mitigation phase, the use of full commercial-off-the-shelf photodiodes from TELEDYNE JUDSON J19 Series as detector for the IRS was decided. This paper describes the procurement, evaluation, and qualification philosophy of these photodiodes, providing information on the subsystems of the SuperCam instrument and the description of these photodiodes. Critical and fragile parts of the photodiode as the thermo electric cooler, have been particularly studied. In conclusion, the component was space qualified using the original use of the particle impact noise detection test applied for a mechanical screening purpose, with correlation between performance and fine leak, screening and the lot acceptance test processes.
Bottom Electrode Properties and Electrical Field Cycling Effects on HfOx based Resistive Switching Memory Device
Authors: Li J. , Kim Y. , Kong D. , Cheng K. , Seo S. -C. , Robinson C. , Saulnier N. , Robison R. R. , Varghese A. J. , Ahsan I. , Muralidhar R. , Ando T. , Narayanan V. 
Published: February 2021

Abstract
The continuously growing demands in high-density memories drive the rapid development of advanced memory technologies. In this work, we investigate the HfOx-based resistive switching memory (ReRAM) stack structure at nanoscale by high resolution TEM (HRTEM) and energy dispersive X-ray spectroscopy (EDX) before and after the forming process. Two identical ReRAM devices under different electrical test conditions are investigated. For the ReRAM device tested under a regular voltage bias, material redistribution and better bottom electrode contact are observed. In contrast, for the ReRAM device tested under an opposite voltage bias, different microstructure change occurs. Finite element simulations are performed to study the temperature distributions of the ReRAM cell with filaments formed at various locations relative to the bottom electrode. The applied electric field as well as the thermal heat are the driving forces for the microstructure and chemical modifications of the bottom electrode in ReRAM deceives.
Electrical Probing Role in 14nm SOI Microprocessor Failure Analysis
Authors: Song Zhigang , McGinnis Pat , Albert Dave , Hornicek Greg , Tenney Mike , Fischer Larry , Sylvestri John , Tran Phong , Le Chuck , Floyd Danielle , Lian Guoda , Boettcher Steve , Ali Malik 
Published: February 2021

Abstract
Failure analysis plays a very important role in semiconductor industry. Photon Emission Microscopy (PEM) has been extensively used in localization of fails in microelectronic devices. However, PEM emission site is not necessarily at the location of the defect. Thus, it has limitation for the success rate of the follow-up physical failure analysis focusing on the emission site. As semiconductor technology advanced in the 3D FinFET realm and feature size further shrank down, the invisible defects during SEM inspection are tremendously increased. It leads to the success rate further decreasing. To maintain good success rate of failure analysis for advanced 3D FinFET technology, electrical probing is necessary to be incorporated into the failure analysis flow. In this paper, first, the statistic results of PEM emission sites versus real defect locations from 102 modules of microprocessors manufactured by 14nm 3D FinFET technology was present. Then, we will present how to wisely design electrical probing plan after PEM analysis. The electrical probing plans are tailored to different scan chain and ATPG failures of microprocessors for improving failure analysis success rate without increasing too much turn-around time. Finally, two case studies have been described to demonstrate how the electrical probing results guide the follow-up physical failure analysis to find the defect.
Enhanced Failure Analysis (FA) of Organic Contamination Using Submicron Simultaneous IR and Raman Spectroscopy: Breakthrough Developments of Optical Photothermal IR (O-PTIR)
Authors: Jay Anderson D. , Kansiz Mustafa , Lo Michael , Dillon Eoghan , Marcott Curtis 
Published: February 2021

Abstract
Rapid identification of organic contamination in the semi and semi related industry is a major concern for research and manufacturing. Organic contamination can affect a system or subsystem’s performance and cause premature failure of the product. As an example, in February 2019 the Taiwan Semiconductor Manufacturing Company (TMSC), a major semiconductor manufacturer, reported that a photoresist it used included a specific element which was abnormally treated, creating a foreign polymer in the photoresist resulting in an estimated loss of $550M [1].
Using NI-PXI Test Platform in Soft Defect Localization of Temperature Dependent Failures
Authors: Deligente Jed Paolo , Sarip Saidaliah 
Published: February 2021

Abstract
Soft Defect Localization (SDL) method has been a common failure analysis technique used in fault isolation of temperature dependent failures, however proper signal conditioning and conversion of the monitored signal into a pass/fail signal are critical in acquiring an accurate defect location. This paper presents case studies where LabVIEW software using NI-PXI test platform was successfully implemented to effectively convert the failure mode into a pass/fail signal which provided a reliable SDL result.
Enabling EFA on Single Die
Authors: Schlangen Rudolf , Chien Chen Chih (Ronan) , Nemirow Christopher , Yang Eddy , Cheng Jiff , Lo William , Marks Howard , Leslie Neel , Sabbineni Prasad 
Published: February 2021

Abstract
Working on wafer-level has been the only way of performing electrical failure analysis (EFA) without the need for die-packaging. The introduction of Si-interposer based 2.5D packaging, with high bandwidth memory (HBM) stacks surrounding our GPU chip, drastically increasing packaging turn around times from approximately 3 days to 3-4 weeks. Having to wait more than 3 weeks for EFA and debug work of 1st Silicon chips is a significant risk for chip bring-up. To address these challenges, this paper presents different ways of reusing the existing wafer-level EFA tool for single die EFA, and introduces a concept for a novel and dedicated single die tool. Additionally, singulated die fixturing and support windows are designed to enable the usage of a 2.45 Numerical Aperture Solid Immersion Lens, and first results from a near reticle limited 16 nm Fin-FET GPU product are also presented.
LASRE: A Novel Approach to Large area Accelerated Segmentation for Reverse Engineering on SEM images
Authors: Wilson Ronald , Forte Domenic , Asadizanjani Navid , Woodard Damon L. 
Published: February 2021

Abstract
In the hardware assurance community, Reverse Engineering (RE) is considered a key tool and asset in ensuring the security and reliability of Integrated Circuits (IC). However, with the introduction of advanced node technologies, the application of RE to ICs is turning into a daunting task. This is amplified by the challenges introduced by the imaging modalities such as the Scanning Electron Microscope (SEM) used in acquiring images of ICs. One such challenge is the lack of understanding of the influence of noise in the imaging modality along with its detrimental effect on the quality of images and the overall time frame required for imaging the IC. In this paper, we characterize some aspects of the noise in the image along with its primary source. Furthermore, we use this understanding to propose a novel texture-based segmentation algorithm for SEM images called LASRE. The proposed approach is unsupervised, model-free, robust to the presence of noise and can be applied to all layers of the IC with consistent results. Finally, the results from a comparison study is reported, and the issues associated with the approach are discussed in detail. The approach consistently achieved over 86% accuracy in segmenting various layers in the IC.
Electrical Probing of 7nm SRAMS/SOC at Contact Layer
Authors: Saujauddin Noor Jehan , Niemi Tim , Lundquist Ted , Niu Baohua 
Published: February 2021

Abstract
For advanced node semiconductor process development, manufacturing, fault isolation and product failure analysis, nanoprobing is an indispensable technology. As the process technology node scales, transistors and materials used are more susceptible to electron beam damage and changes. As scanning electron microscope (SEM) energy decreases to minimize electron beam damage, imaging resolution degrades. Process scaling has not only affected patterning dimensions and pitch scaling, but also materials utilized in advanced nodes. The material used at the contact level has changed from tungsten (W) to cobalt (Co), in combination with ultra-low K dielectrics. These new materials tend to make sample preparation and probing increasingly more challenging. At advanced nodes with sub-20nm contacts, probe landing accuracy and probe-contact stability are important to maintain good electrical contact throughout measurement time. In this paper, we discuss nanoprobing results from a 7nm SRAM obtained from a commercially available leading edge 7nm SOC.
Application of B-Scan SAT Mode, an Acoustic Cross Section Technique to Analyze Packaged Components beyond Delamination
Authors: Rajaram Srinath , Barrientos Denise , Ahmad Nadia , Carpenter Robert , Barbian Eric 
Published: February 2021

Abstract
Failure Analysis labs involved in customer returns always face a greater challenge, demand from customer for a faster turnaround time to identify the root cause of the failure. Unfortunately, root cause identification in failure analysis is often performed incompletely or rushing into destructive techniques, leading to poor understanding of the failure mechanism and root-cause, customer dissatisfaction. Scanning Acoustic Tomography (SAT), also called Scanning Acoustic Microscope (SAM) has been adopted by several Failure Analysis labs because it provides reliable non-destructive imaging of package cracks and delamination. The SAM is a vital tool in the effort to analyze molded packages. This paper provides a review of non-destructive testing method used to evaluate Integrated Circuit (IC) package. The case studies discussed in this paper identifies different types of defects and the capabilities of B-Scan (cross-sectional tomography) method employed for defect detection beyond delamination.
Localization and Characterization of Defects for Advanced Packaging Using Novel EOTPR Probing Approach and Simulation
Authors: Zhang Chuan , Li Jane Y. , Aguada John , Elliott Jonathon , Rahimi Somayyeh , Schmidt Christian , Marks Howard , White Tom , Alton Jesse , Gibson Brett , Igarashi Martin 
Published: February 2021

Abstract
A typical workflow for advanced package failure analysis usually focuses around two key sequential steps: defect localization and defect characterization. Defect localization can be achieved using a number of complementary techniques, but electro optical terahertz pulse reflectometry (EOTPR) has emerged as a powerful solution. This paper shows how the EOTPR approach can be extended to provide solutions for the growing complexity of advanced packages. First, it demonstrates how localization of defects can be performed in traces without an external connection, through the use of an innovative cross-sectional probing with EOTPR. Then, the paper shows that EOTPR simulation can be used to extract the interface resistance, granting an alternative way of quantitative defect characterization using EOTPR without the destructive physical analysis. These novel approaches showed the great potential of EOTPR in failure analysis and reliability analysis of advanced packaging.
A Study on the Early Detection of Metal Line Bridge Defects Using Wafer Burn-in Stress
Authors: Min Kyunghwui , Kwon Hayoung , Lee Seihui , Hong Heeil , Yim Sungsoo , Kim Jonghoon , Lee Jung-Bae 
Published: February 2021

Abstract
As scaling-down of dynamic random access memory (DRAM) has been continued, the pitch of metal-line already reached sub-50nm where it is hard to define the soft bridge and normal one. Moreover, the metal bridge failure at system level cannot be corrected with in-situ system error-code correction (ECC) modules. In order to screen these failures in the wafer or/and package level electrical tests, high voltage stress methods are necessary. Therefore, accurate stress quantity decided by combination temperature, voltage and time, and effective stress methodologies are essential for high quality and reliability. For a mass production environment, a wafer level burn-in (WBI) can enable multiple word-lines simultaneously and consistently is appropriate. Moreover, we confirmed the actual voltage level on real cells in WBI and optimized stress parameters in terms of time and voltage. Finally, it was proven through the WBI evaluation for over 60k DRAM chips.
Influence of Dose Delivery of Low-Beam Energy Gallium on FinFET Devices
Authors: Wong Michael , Sidorov Oleg , Haimson Or , Goldman Roy , Donnet David , Tien David , Leslie Neel , Ahlgren Debbora 
Published: February 2021

Abstract
In a previous study, the authors introduced a novel technique of using low-beam energy Gallium Focused Ion Beam to expose a large area of Shallow Trench Isolation (STI) over a Dynamic Ring Oscillator (DRO) incurring virtually no change of its operating frequency. In this paper, the authors further investigate the influence of extended dose delivery of 5 kV Ga+ after the initial exposure of the STI over a DRO on modern 7 nm process. The motivation of this study is to understand the dynamics between the Ga+ ion interaction at lower beam energies on live and functional devices and the failure mechanism of the device from such interaction. The frequency of the DROs after the initial STI exposure at 5 kV exhibits &lt;1% increase. Additional dosage of lowkV exposure was performed over the exposed STI and its effects on the DRO frequency was monitored. Finally TEM analysis of the irradiated DROs will be analyzed to understand the failure mechanism of transistors.
Improving Amplifier for OBIRCH/TIVA Application
Authors: Morag Michael , Leslie Neel 
Published: February 2021

Abstract
OBIRCh(Optical Beam Induced Resistance Change) and TIVA (Thermal Induced Voltage Alteration) are widely used ElectricalFailure Analysis techniques for finding defects under static conditions. This paper will discuss the requirements for a good amplifier to be used for OBIRCh, and recent improvements that have been released to market from Thermo Fisher Scientific.