bluuebunny/crossref_metadata_2025_split huggingface dataset:
Evaluation of Microbial Fuel Cells with Graphite Plus MnO2 and MoS2 Paints As Oxygen Reduction Cathode Catalyst
Authors: Jiang Bolong , Muddemann Thorben , Kunz Ulrich , Bormann Hinnerk , Haupt Dennis René , Niedermeiser Michael , Schlaefer Ottmar , Sievers Michael 
Published: February 2020

For the improvement of microbial fuel cell (MFC) performance in real wastewater it is necessary to implement catalysts on the cathode. Graphite, MnO2 and MoS2 fulfill the requirements with respect to costs and activity and were evaluated in this work. These materials were prepared by dispersion of MnO2 and/or MoS2 and graphite in a solution of celluloid using butanone as solvent. The mixture is than painted on the surface of stainless steel cathode carriers. The individual maximum output power densities of MFCs were evaluated in dependence of time, see figure (left). Comparing with graphite plus MnO2 coating, the graphite plus MoS2 paint shows a lower power density but much higher long-term stability than graphite plus MnO2 coating. Therefore, the combination of different catalysts (MnO2 and MoS2) is necessary for further improvement of power density. The power density performance of MFCs with different MnO2 plus MoS2 proportions is shown in figure (right). The data suggested that the MFC with mixed catalysts with graphite plus MnO2 plus MoS2 proportion of 20:1:1 possessed the highest power density during experiments (125 mW/m2 at 5th day). The power density of a MFC with mixed catalysts with graphite plus MnO2 plus MoS2 proportion of 30:1:2 possessed the value of 85 mW/m2 at the beginning and descended rapidly after starting operation. By comparing the MFC with mixed catalysts with graphite plus MnO2 plus MoS2 in proportion of 30:2:1, with the power density of the MFC with graphite plus MnO2 plus MoS2in proportion of 20:1:1 it was shown, that the later one is the optimal mixing proportion in our experiments.
A RHE is also used in our experiments for measuring the potential of single electrodes. The data are shown in figure (right). It can be seen that the cathode potential of the cell descended significantly during the measurement, while the potential of the anode changed only slightly. These reveals clearly, that the cathode is the rate limiting electrode. Therefore, new forms of cathodes have to be further developed to improve the performance of MFC.

Figure 1
Using Data Science to Improve Battery Performance: How Data Analytics Can Help Drive Design and Use Decisions
Authors: Dawson-Elli Neal , Subramanian Venkat R. 
Published: February 2020

Batteries are complex electrochemical devices whose short-term and long-term operational lives are highly dependent on their construction, materials, and use cases. Models have been developed and used to improve the performance of batteries by providing different material design, model based control and model based battery management systems1.
There is a recent trend in data-science-based approaches for modeling different devices and processes2,3. In this talk, we will review different data science methods and approaches in the context of parameter estimation, optimal control and mechanism elucidation for lithium-ion batteries.
In particular, we will discuss opportunities and challenges in applying the same for battery models – for model reduction, data set training, online estimation and control. It has been demonstrated that using machine learning techniques can retain 99.9% of the accuracy of a complex model while improving solve time by four orders of magnitude, which can allow for the use of high accuracy models in a real-time control scenario3. We will be attempting to demonstrate that this is true for battery models as well, which typically have large cpu time requirements.
Real-time model-based control has demonstrated significant improvements in time remaining, state of charge, and state of health, even using simple equivalent circuit models4. By reducing the order and solve time of higher complexity models, we believe that better predictability is possible.

Acknowledgments

The authors thank the United States Department of Energy (DOE) for the financial support for this work though the Advanced Research Projects Agency – Energy (ARPA-E) award #DEAR0000275.

References

1. Y. Dai, and V. Srinivasan,. J. Electrochem. Soc., 163, A406 (2016).
2. D. A. C. Beck, J. M. Carothers, V. R. Subramanian, and J. Pfaendtner, “Data science: Accelerating innovation and discovery in chemical engineering,” AIChE J., vol. 62, no. 5, pp. 1402–1416, May 2016.
3. Blake R. Hough, author. Jim Pfaendtner, degree supervisor. 2016 Thesis (Ph. D.)--University of Washington,2016.
4. Williard, Nick, Wei He, and Michael Pecht. "Model Based Battery Management System for
Condition Based Maintenance." Technical Program for MFPT 2012, The Prognostics and
Health Management Solutions Conference - PHM: Driving Efficient Operations and
Maintenance, 2012
Ceramic Additive Manufacturing of Solid State Electrochemical Devices
Authors: Benavidez Angelica D , Cook Adam , Tsui Lok-kun , Evans Lindsey , Garzon Fernando H 
Published: February 2020

The additive manufacturing of electro-ceramics is a major technological challenge with many possible applications. The technology can prototype and produce in small volume production, custom dielectric, piezoelectric and solid state ionic devices. Sandia National Laboratories was the birthplace of modern, 3-D ceramic additive manufacturing. The newly developed manufacturing methods are considered to be the foundation of 3-D printing via particulate slurries and our spin off company Robocasting Enterprises, is commercially producing dense ceramic and composite parts. These parts are used in various applications including complex geometry catalyst supports and casting filters. This technique is based on the layer-by-layer deposition of highly loaded colloidal slurries that are extruded through a small nozzle. The rheology of the slurry is crucial in order to maintain the structural integrity of the part being built, as Robocasting does not rely on polymerization reactions or solidification to retain shape after extrusion. Since this process is essentially binderless, a dense ceramic part can typically be freeformed, dried, and sintered in less than 24 hours.
Although Robocasting is a highly useful technique, it has been optimized for ceramic and composite materials. More recently there has been some work on expanding this technology for use in printing electrode materials. Printing conductors and other structures for electrochemical and electronics using direct write technology gives the potential to reduce production time and reduce waste of expensive material. We have demonstrated that this direct write manufacturing technique can produce Multi-Chip Modules (MCM) by depositing silver and gold on Low Temperature Co-fired Ceramics (LTCC). We have also applied this additive manufacturing technique to our unique design of electrochemical gas sensors. These multi-component mixed potential sensors consist of solid electrodes and a porous electrolyte. In order to expand the versatility of this manufacturing method to be used in solid state ionic devices, slurries of solid electrolytes and electrode materials with specific rheological properties were developed. Another challenge was controlling the residual stress and shrinkage through the material properties of various components. These devices are capable of detecting NOx, hydrocarbons, and NH3 at concentrations on the order of parts per million. The additive manufacturing technique allows for the rapid prototyping of these devices and low volume production of custom devices optimized for specific applications.

Figure 1
Pulse Reverse Plating of Zn-Ni on Aluminum and Steel
Authors: Xu Jing , Hall Timothy D , Inman Maria , Taylor E. J. , Snyder Stephen 
Published: February 2020

Cadmium has been one of the top choices for corrosion resistant coatings in aerospace, electrical, and fastener industries due to its excellent corrosion resistance, lubricity, electrical conductivity, and an ability to withstand thermal and electrical shock. However, cadmium is a known carcinogen, and it is deposited from a cyanide plating bath, and cyanide waste treatment1 is very expensive. These environmental concerns and performance limitations mandate the need for alternatives to cadmium coatings. Numerous efforts have been made worldwide to develop alternate, non-cyanide baths for cadmium plating, based on sulfamate, fluoroborate and chloride.2,3,4 Therefore, Cd replacement alternatives are being investigated to satisfy mission critical performance standards. Of these replacements, Ni-Fluorocarbon (SAE AMS-2454), Zinc-Nickel (ASTM B841, AMS 2417), Aluminum (Mil-DTL-83488), Zn, and Tin-Zinc have been recently evaluated. Each of these potential Cd replacements have shown potential to replace Cd for specific applications but only alkaline Zn-Ni has shown the most promise due to its conductivity, corrosion resistance, low hydrogen embrittlement (LHE), and the lack of cyanide and borate in the electrolyte.
This paper will discuss ongoing efforts by Faraday to optimize the deposition conditions for an adherent LHE Zn-Ni alloy coating on aluminum and steel connector surfaces. We will present data on the performance of the alkaline ZnNi process using direct current baseline conditions, while also evaluating the potential to improve coating properties using pulse reverse plating parameters. Specifically, our focus is on improving adhesion of the coating to the substrate, reduction of hydrogen embrittlement challenges, characterization of the functional properties of the coatings, and development of a preliminary technology transition plan. The following material property tests may be evaluated over the course of the program: 1) visual examination (AMS 2460), 2) thickness (ASTM B487 / AMS 2460), 3) adhesion (ASTM B571), 4) hydrogen embrittlement (ASTM F519), 5) corrosion (ASTM B117). This work will help facilitate adoption of alkaline Zn-Ni plating processes as a functional Cd replace for coating DoD mission critical components like electrical connectors and back-shells.
Acknowledgement
This material is based upon work supported by an SBIR from the US Air Force under Grant No. FA8501-16-P-0047 References:
1 W. H. Safranek, Plat. Surf. Finish., 84(8), 45 (1997).
2 D. Altura, F. Mansfield and L. P. Streett, Plating, 61, 850 (Sept., 1974).
3 A. J. Boehm , Plat., Surf. Finish., 80, 52 (1970).
4 James A. Bates, Plat. Surf. Finish., 4, 36 (1994).
(Invited) Bringing III-Vs into CMOS: From Materials to Circuits
Authors: Czornomaz Lukas , Deshpande Veeresh Vidyadhar , O'Connor Eamon , Caimi Daniele , Sousa Marilyne , Fompeyrine Jean 
Published: February 2020

High-mobility channel materials such as InGaAs and SiGe alloys are considered to be the leading candidates for replacing strained Si in future low power/high performance logic circuits. However, the integration of InGaAs on Si and the co-integration of InGaAs devices with SiGe devices are extremely challenging. On the one hand, the large lattice mismatch (8 to 10%) and the potential formation of antiphase domains at the polar/non-polar III-V/Si crystalline interface typically hinder the integration of high quality InGaAs crystals on Si. On the other hand, InGaAs and SiGe require very different processing conditions in terms of thermal budgets, dry and wet chemistries, passivation schemes and contacting schemes which complexifies the realization of CMOS circuits.
Recently, tremendous progress were achieved as a result of innovation at the material and device levels. Latest technology developments yielded the first demonstration of InGaAs/SiGe CMOS inverters and dense SRAM arrays on Si, fabricated with InGaAs selective epitaxy and standard front end of line processes in a 2D co-planar configuration. This novel and scalable CMOS integration scheme enables InGaAs nFET fabrication in close proximity to SiGe pFETs (down to 25 nm spacing), resulting in 6T-SRAM arrays having a minimum cell size below 0.45 μm2. This scheme can be combined with any bulk Si or SOI-based planar or fin technology, and is compatible with standard large-area Si substrate.
Furthermore, progress on 3D Monolithic integration showed that this integration scheme not only an opportunity for further density scaling, but it also offers unique advantages for solving the integration of high mobility materials for 3D CMOS and stacking of functional layers on top of standard CMOS circuitry.
Electrolyzed Sulfuric Acid Application in Semiconductor Cleaning Processes: An Advanced Substitution of SPM Cleaning
Authors: Ahn Jin-hyun , Kim Pyung Dae , Hwang Seong Cheol , Seo Jinyoung , Lee Sungjin , Ogawa Yuichi , Ida Junichi , Sasaki Yuya , Nagai Tatsuo , Otsu Toru 
Published: February 2020

SPM cleaning, a mixture of Sulfuric Acid and Peroxide, is a commonly used cleaning method in the semicondutor industry. The main purpose of the SPM cleaning is remove unwanted metal and organic contamination by oxidation process. The removal rate of both metal and organic contamination depend on the density of peroxide. As the semiconductor technology node shrinks, processes require less amount of metal loss, while the removal of organic contamination is relatively maintained. It is impossible to meet the demand with the conventional SPM cleaning, in which the density of peroxide do not take part in improving the metal, polymer selectivity.
Instead of using conventional SPM cleaning, where peroxide produces Caro's acid taking the main part in the oxidation process, electrolytic Sulfuric Acid is introduced. Electrolytic sulfuric acid produces Persulfate ion, which is more powerful oxidizer compared to peroxide used in conventional SPM cleaning. We used the Kurita's “Green Sulfaceed KD”(GS-KD) Module to supply the electrolytic sulfuric acid into the DNS batch type FC-3100 system.
Electrolytic Sulfuric Acid, compared to conventional SPM Cleaning, showed improvement in the metal, organic removal selectivity. In this paper, cases of process integration challenges concerning the metal, organic removal selectivity are reviewed. In case of a metal residue removal process with metal disclosure, minimum removal is required, however excess metal removal results in contact disconnection. In case of a implant dosed photo resist residue stripping process with danger of metal disclosure, low peroxide SPM cleaning is required however it is insufficient to strip the photo resist residue. Using the Electrolytic Sulfuric Acid, it was possible to meet the requirements of the processes, removing the unneeded residues while maintaning the metal underlayers. The improvement in the removal selectivity became the key factor in overcoming the technical challenges in the processes.
(Invited) Challenges for Etch Technology and the Integration of New Channel Materials Beyond 7 nm
Authors: Ranjan Alok , Rastogi Vinayak , Ventzek Peter 
Published: February 2020

Even with the copious advances in logic device fabrication, integration of new channel materials would represent a significant advance in CMOS technology. [1] Successful integration of new channel materials (III-V’s, Ge and SiGe) pose significant challenges for etch technology. Dry (plasma) etch technology can be used to pattern channel materials after they are deposited using an epitaxial process [2]; alternatively channels maybe inserted into bounded (for example an oxide) recesses (for example silicon) fabricated using etch technologies already developed for FinFET and SAQP applications. Less appealing is the use of wet processes that have troublesome crystallographic orientation dependencies. Dry etch technology for most new channel material candidates is not new. [3] Still, with dry etch technology there is the ever-present worry of damage. [4-6] High precision etch technology commonly referred to as atomic later etching (ALE) is an emerging viable option for new channel material integration. [7-10] Some approaches employ non-mainstream techniques such as neutral beam technology [8] or complex precursors. [10] Recent developments reinforce that conventional plasma etch technologies developed using concurrent engineering methods can meet the requirements for 7 and 5 nm logic fabrication. [7,11] This presentation will show how advanced plasma etch technologies provide a path for logic manufacture beyond 7 nm with a realistic picture of the trade-offs that must be handled for the introduction of III-Vs, Ge or SiGe. All in all, etch technologies if successfully implemented for new channel material integration relies of leveraging surface chemistry mechanisms. The presentation will be rounded out with a discussion of how first-principles methods (e.g., DFT methods) can be used to gain insight into important plasma –surface interaction mechanisms.

S. Takagi et al., Japanese Journal of Applied Physics 54, 06FA01 (2015)

Chen et al,. Nanoscale Research Letters, 7, 431 (2012)

Plasma Etching of III–V Nitrides,” by R. Shul, in Processing of Wide Band Gap Semiconductors: Growth, Processing and Applications, 250 (2000), ed., S.J. Pearton

F.D. Auret et al., Physica B, 407, 1497 (2012)

Kasumandari et al., Appl. Phys. Lett., 103, 033511 (2013)

“Dry Etching of Semiconductors at the Nano-and Micro-Scale” by S.J. Pearton in Vistas in Nanofabrication, (2012)

A. Ranjan et al., J. Vac. Sci. Technol. A 34, 031304 (2016)

S.D. Park et al., Appl. Phys. Lett. 91, 013110 (2007);

C. T. Carver et al., ECS J. Sol. St. Sci. Tech., 4 N5005-N5009 (2015)

S. M. George, Chem. Rev., 110, 111 (2010)

S.D. Sherpa et al., J. Vac. Sci. Technol. A 35, 01A102 (2017)
Monolithic Integration of 2D Piezoelectric Semiconductors on Printed Electrodes for Stretchable Smart Skin
Authors: Wang Ruoxing , Wu Wenzhuo 
Published: February 2020

The seamless and adaptive interactions between functional devices and their environment (e.g. the human body) are critical for advancing emerging technologies, e.g. wearable devices, consumer electronics, and healthcare. Although non-electrical signals such as mechanical stimuli are inherent in these applications, electrical control of device operation dominates existing technologies. This scheme of operation not only requires a complex integration of heterogeneous components but also lacks a direct interface between the (opto)electronics and the working environment. Moreover, all existing technologies require a power source, which complicates the system design and limits operation schemes.
Stretchable electronic devices are particularly desirable for practical applications because of the high mechanical deformability and adaptability enabling their integration with three-dimensional biological systems. In this work, we demonstrate for the first time a monolithic integration of piezoelectric nanogenerator system with 3D printed electrodes as self-powered wearable devices for physiological sensing on human body. The stretchable electrodes were directly printed on soft substrates with designed patterns. Subsequently, two-dimensional ZnO nanosheets were selectively grown on electrodes without any decrease of electrode conductivity. ZnO nanosheets with controlled atomic thickness are more flexible compared with ZnO nanowires, which can generate distinguishable electrical signals under tiny mechanical deformation and sustainably perform non-invasive physiological functions, e.g. pulses detection, by harvesting power from human body. This research is expected to have a positive impact and immediate relevance to many societally pervasive areas, e.g. biomedical monitoring, consumer electronics, and human-machine interface.
(Invited) An Integrated Microbial Desalination Cell-Driven Capacitive Deionization System as an Electrochemical Means for Wastewater Treatment, Electricity Generation and Desalination
Authors: Hou Chia-Hung , Ma Chih-Yu 
Published: February 2020

Due to unstainable use of natural water resources, alternative water resources such as brackish water and seawater desalination have been an emerging solution. However, development of desalination capacity is limited due to the high energy requirements for removing salt ions from water. Currently, capacitive deionization technology (CDI), following the working principle of supercapacitors, has attracted considerable attention from academia, industry, and government agency. As compared to conventional desalination technologies, CDI has several advantages including low energy consumption, easy regeneration, high water recovery, and no secondary waste. In CDI, by applying an external electric filed between two parallel of nanoporous carbon electrodes (i.e., carbon aerogel, activated carbons, carbon nanotubes, and graphene), ions can be stored at the electrode/solution interface via electrical double layer (EDL) formation. Additionally, microbial desalination cell (MDC) is a new bioelectrochemical technology for seawater desalination with simultaneous electricity generation and wastewater treatment. Basically, a MDC reactor contains an anode chamber, a desalination chamber, and a cathode chamber. In MDC, microorganisms can oxidize organic waters in wastewater to harvest electric energy, and meanwhile, salt ions can be removed during the electricity generating process. In this study, we propose a hybrid electrochemical desalination system for seawater desalination by coupling CDI device with a MDC reactor. As a result, MDC produced electricity with open circuit voltage of 0.8 V and a current of 3 mA by using bacteria to degrade organic contaminants through anode bacterial oxidation and cathode reduction. In MDC, 91% removal of chemical oxygen demand (COD) in synthetic wastewater can be achieved, and the solution conductivity can be reduced from 17,000 µS/cm to about 200 µS/cm. More importantly, CDI device can be driven by electricity harvesting from the two MDCs in parallel, and as the downstream desalination process to further desalinate salt water. The results of this study can demonstrate the feasibility of the integrated electrochemical MDC-CDI system for simultaneous wastewater treatment, power production, and water desalination.
.
Hydrogen Isotope Separation By Combined Electrolysis Fuel Cell
Authors: Matsushima Hisayoshi , Ogawa Ryota , Ueda Mikito 
Published: February 2020

The heavy isotopes of hydrogen, deuterium (D) and tritium (T) are materially important in nuclear energy production. In current heavy-water nuclear fission reactors, D is used as a neutron-moderator. Similarly, in nuclear fusion reactors, which are expected to represent the next generation of nuclear power, the reaction of D and T is responsible for the energy production stage.
Many researchers have studied various isotope-separation methods, including water distillation, chemical exchange, water electrolysis and combined electrolysis catalytic exchange (CECE). The electrolysis method yields the most effective separation but the process consumes enormous amounts of electricity. This has led to a search for other methods that are more energetically efficient.
In an attempt to solve the above problem, we proposed a new concept of hydrogen separation system: the Combined Electrolysis Fuel Cell (CEFC) process [1]. Here, hydrogen and oxygen were produced by electrolysis and used for power generation by fuel cells. Less electricity was consumed by the separation process owing to the implementation of hydrogen energy recycling. More recent works have reported the hydrogen isotope effect in polymer electrolyte fuel cells (PEFCs) [2, 3].
We found that CEFC could reduce 20 % electric energy, comparing with the only electric separation process. Furthermore, CEFC showed the high separation factor (α ≃10) due to the synergistic effect of PEFC and water electrolysis. Here, we will discuss the separation efficiency and the calculation of the total energy consumption by CEFC in several electrolytic and FC conditions.
REFERENCES
[1] H. Matsushima et al., Energy, 30 (2005) 2413.
[2] R. Ogawa et al., Electrochemistry Communications, 70 (2016) 5.
[3] S. Shibuya et al., Journal of The Electrochemical Society, 163 (2016) F704