bluuebunny/crossref_metadata_2025_split huggingface dataset:
O MEDIADOR PROPOSTO DE LUIS ALBERTO WARAT NA SOCIEDADE CONTEMPORANEA
Authors: Martins Janete Rosa , Caciamani Bianca Regina , Meneguzzi Nelci Lurdes Gayeski 
Published: December 2020

O presente artigo tem como escopo tratar da mediação e suas especificidades, bem como o mediador proposto por Luis Alberto Warat. A metodologia utilizada é o método hipotético dedutivo que parte de um problema e apresenta as suas hipóteses, o método de pesquisa é o indireto, com base em leituras de obras do autor dentre outros. O modelo de mediador proposto por Luis Alberto Warat é o ideal para ser aplicado na mediação? Segundo Warat os mediadores das escolas formadoras fracassam, no sentido que ensinam aos mediadores técnicas, guias de formalidade e rituais para que ocorra um acordo, forma, negociadores, conciliadores. Para ser mediador é necessário ser um mestre, onde os discípulos devem ficar a vontade, onde o coração é o centro supremo do conhecimento. O mediador é um psicoterapeuta que ajuda as partes na terapia do reencontro mediado. Ademais o mediador proposto por Warat é aquele que busca no diálogo a autonomia, sensibilidade, reconhecimento e cultura de paz.
Hemiparesis resulting from an unusual C1 fracture: A case report and literature review
Authors: Yuh Sung-Joo , Wang Zhi , Boubez Ghassan , Shedid Daniel 
Published: December 2020

Background:
Jefferson fractures are burst fractures involving both the anterior and posterior arches of C1. They typically result from axial compression or hyperextension injuries. Most are stable, and neurological deficits are rare. They are often successfully treated with external immobilization, but require surgery (e.g., fusion/ stabilization).

Case Description:
An 89-year-old male presented with a left-sided hemiplegia following a trivial fall. The cervical computed tomography scan revealed a left-sided displaced comminuted C1 fracture involving the arch and lateral mass. The MR revealed posterior cord compression and focal myelomalacia. Six months following an emergent C1–C3 decompression with occiput to C4 instrumented fusion, the patient was neurologically intact and pain-free.

Conclusion:
An 89-year-old male presented with a left-sided hemiplegia due to a Type 3/4 C1 Jefferson fracture. Following posterior C1–C3 surgical decompression with C0–C4 instrumented fusion, the patient sustained a complete bilateral motor recovery.
DEFECT OF THE TRANSACTION’S TARGET AS A GENERAL LEGAL BASE OF INVALIDITY
Authors: Зайцева Наталья Викторовна 
Published: December 2020

В статье рассматриваются сделки, противоречащие по своему характеру нормативным актам и публичному порядку, проведен анализ правовых последствий выявления «незаконной» цели сделки с точки зрения различных правопорядков.
The main target of this article is a research of the deals with transactions that are contrary to law and public policy and analyzes the legal consequences of identifying the «illegal» purpose of the transaction from the point of view of various legal orders.
IMPACT OF FOREIGN DIRECT INVESTMENT ON HIGHER EDUCATION
Authors: Singh Kalpana , Awasthi Alka 
Published: December 2020

The purpose of this paper is to examine how Foreign Direct investment (FDI) can be leveraged to enhance its impact on Higher Education.
This paper attempts to discuss the possibilities of bringing quality, excellence and more opportunities in “Higher education” through the FDI route.
FOREIGN DIRECT INVESTMENT:Education sector is growing day by day and gaining lots of importance in the world and India as well. Education Industry is likely to grow by the Gross Enrolment Ratio (GER) by 2020. Foreign Direct Investment up to 100% is allowed in most of the sectors more significantly, Thus the role of private sector in higher education has significantly increased in the last decade & the growth of the this sector alone, estimates, to grow to US$ 70 billion by 2013 and US$ 115 billion by 2018. The study focuses on advantages of FDI in Education with reference to India particularly, and evaluates the advantages and disadvantages of going in for FDI.
Foreign Direct Investment has always been a matter of concern for India, when it comes to education sector 100% FDI is allowed by the Government but, besides its advantages, it has some limitations or disadvantages also. In this paper an attempt has been made by the authors to highlight the good and bad effects of FDI in Education Sector
Pengaruh Ketidakpuasan Konsumen Terhadap Perpindahan Merek Smartphone Di Kota Bima
Authors: Sari Puspita , Ismunandar Ismunandar 
Published: December 2020

Penelitian ini bertujuan Untuk mengetahui pengaruh Ketidakpuasan Konsumen terhadap Perpindahan Merk Smartphone Kota Bima. Jenis penelitian yang digunakan adalah asosiatif. Penelitian ini di lakukan pada Kota Bima yang sasarannya untuk konsumen pengguna Berbagai Type Smartphone. Teknik pengambilan sampel yang digunakan adalah metode purposive sampling dengan 96 responden. Teknik analisis data yang digunakan yaitu uji validitas, uji reliabilitas, uji asumsi klasik, regresi linear berganda, koefesien determinasi, koefesien korelasi, uji parsial (uji t) dan uji simultan (uji f). Berdasarkan Hasil penelitian menunjukan bahwa : variabel Ketidakpuasan konsumen terhadap Perpindahan Merk Smartphone Kota Bima
Influencia de la hipertensión intraabdominal en la mecánica respiratoria de pacientes adultos críticamente enfermos con ventilación mecánica invasiva
Authors: Vicente Antonela , Virgilio Sacha Alexis , Tocalini Pablo , Novo María Noel 
Published: December 2020

Objetivo: describirlas modificaciones en la mecánica respiratoria, las estrategias ventilatorias propuestas y el correcto posicionamiento de los pacientes adultos críticamente enfermos con HIA y SCA con requerimiento de VMI en UCI.
Fuentes de datos: la búsqueda bibliográfica fue realizada en Pubmed, Cochrane Library y Google Académico® sin restricción del lenguaje con fecha de publicación hasta el 31 de julio de 2019.
Selección de los estudios: pacientes adultos con requerimiento de VMI y diagnóstico de HIA y/o SCA que hayan realizado el análisis de monitoreo ventilatorio y posicionamiento del paciente. Se excluirán los estudios de laboratorio realizados en animales.
Extracción de datos: la búsqueda inicial identificó 681 estudios, de los cuales se incluyeron 30 artículos para el análisis de datos.
Síntesis de datos: los pacientes con requerimiento de VMI se debe permitir el aumento de las presiones en la vía aérea y utilización de PEEP elevada; sólo en casos específicos se podrían aplicar maniobras de reclutamiento y decúbito prono para mantener una ventilación alveolar adecuada. El posicionamiento en Trendelemburg invertido es de utilidad, ya que mejora la mecánica respiratoria y evita la compresión abdominal.
Conclusiones: las alteraciones de la mecánica respiratoria producen una disminución de la compliance torácica, volúmenes pulmonares y trastornos en la oxigenación. La estrategia ventilatoria debe contemplar Vt entre 6-8 ml/kg según peso corporal predicho, presión de trabajo menor a 14 cm H2O, presión meseta de 30 cm H2O+PIA/2 y niveles suficientes de PEEP para prevenir el colapso pulmonar a fin de espiración.
Ecological estimation of winter peas in the conditions of the southern part of the Rostov region
Authors: Ashiev A. R. , Skulova M. V. , Khabibullin K. N. 
Published: December 2020

The current paper has presented the study results on the ecological estimation of seed peas of different types of development. The purpose of our study was to assess the quantitative and qualitative indicators of seed peas varieties of different types of development in the southern part of the Rostov region. The trials were carried out on the experimental plots of the FSBSI “Agricultural Research Center “Donskoy” at the laboratory for legumes breeding and seed production. Autumn sowing was carried out in the second decade of October. Spring sowing was conducted in the third decade of March. The objects of the study were the variety ‘Legion’ sown in autumn and spring in comparison with the variety ‘Aksaysky Usatiy 5’, which was used as a standard variety in the trials. The statistical data were processed according to B. A. Dospekhov’s methodology (2012) using Excel with the STATISTICA 10 application. The variety ‘Legion’ sown in autumn ripened earlier in comparison with the standard variety ‘Aksaysky Usatiy 5’. Early ripening of winter peas than spring peas made it possible to evenly distribute the load on the harvesting equipment, since ripening of spring peas often coincided with ripening of winter grain crops, such as winter barley and winter wheat. The variety ‘Legion’ sown in winter exceeded the standard variety ‘Aksaysky Usatiy 5’ in such indicators as “plant height”, “number of beans”, “number of seeds”, “seed weight per plant” and “protein percentage”. The study results have shown that the conditions of the southern part of the Rostov region were favorable for the cultivation of winter peas. The winter peas ripened a decade earlier than spring peas, and seed productivity was 1.7–1.8 times larger.
Failure Analysis and Elimination of Galvanic Corrosion on Bondpads During Wafer Sawing
Authors: Hua Y. N. , Low E. C. , An L. H. , Redkar Shailesh 
Published: December 2020

Abstract
In our previous paper [1], discolored bondpads due to galvanic corrosion were studied. The results showed that the galvanic corrosion occurred in 0.8 ìm wafer fabrication (fab) process with cold Al alloy (Al-Si, 0.8 wt%-Cu, 0.5 wt%) metallization. Galvanic corrosion is also known as a two-metal corrosion and it could be due to either wafer fab process or assembly process. Our initial suspicion was that it was due to a DI water problem during wafer sawing at assembly process. After that, we did further failure analysis and investigation work on galvanic corrosion of bondpads and further found that galvanic corrosion might be due to longer rinsing time of DI water during wafer sawing. The rinsing time of DI water is related to the cutting time of wafer sawing. Therefore, some experiments of wafer sawing process were done by using different sizes of wafer (1/8 of wafer, a quadrant of wafer and whole of wafer) and different sawing speed (feed-rate). The results showed that if the cutting time was longer than 25 minutes, galvanic corrosion occurred on bondpads. However, if the cutting time was shorter than 25 minutes, galvanic corrosion was eliminated. Based on the experimental results, it is concluded that in order to prevent galvanic corrosion of bondpads, it is necessary to select higher feed-rate during wafer sawing process at assembly houses. In this paper, we will report the details of failure analysis and simulation experimental results, including the solution to eliminate galvanic corrosion of bondpads during wafer sawing at assembly houses.
Layout-Aware Diagnosis Leads to Efficient and Effective Physical Failure Analysis
Authors: Sharma Manish , Schwarz Sergej , Schmerberg Juergen , Yang Kathy , Tai Ting-Pu , Chen Yuan-Shih , Chuang Cheng-Yiing , Kuo Feng-Ming , Brennan Mike , Yeh James , Ma Alan 
Published: December 2020

Abstract
Logic diagnosis analyzes scan test failures and produces a list of potential defect locations and types. This information is often used as a starting point for a detailed physical failure analysis (PFA) process that locates the actual physical defect. One important criterion that dictates whether PFA can be performed on a certain die is the physical area of the die over which the potential defect locations reported by diagnosis are spread. While logic diagnosis works with a logic-level abstraction of the design, in this paper we describe the use of additional design layout information during diagnosis to lead to better localization of defects and reduce the area over which potential defect locations are spread. This directly results in more die becoming suitable for PFA. We demonstrate the effectiveness of such “layout-aware” diagnosis for PFA using an industrial case study in which several die from two wafers were diagnosed and 61% and 78% more die became suitable for PFA using layout-aware diagnosis.
Laser Focus Depth Adaptation for Decapsulation of Copper Wirebonded Devices
Authors: Kor H.B. , Liu Q. , Siah Y.W. , Gan C.L. 
Published: December 2020

Abstract
Although pre-laser decapsulation reduces the time to acid exposure for subsequent chemical decapsulation of copper wirebonded devices, it can result in severely damaged or broken copper wirebonds if carried out at a focused depth followed by chemical decapsulation. Thin quad flat packages (TQFPs) of dimensions 22 mm × 22 mm, with copper wirebonds were pre-laser decapped (Nd:YAG laser, 1064 nm) at three depths of focus, at focus, (z-0.5) mm and (z-1) mm. Reducing the laser focus depth by 1 mm, followed by subsequent chemical decapsulation, resulted in the least damage to copper wirebonds. Average percentage reduction in copper wirebond diameter after complete (laser and chemical) decapsulation is about 2.30%.
A Sample Preparation on Decapsulation Methodology for Effective Failure Analysis on Thin Small Leadless (TSLP) Flip Chip Package with Copper Pillar (CuP) Bump Interconnect Technology
Authors: Yen Gwee Hoon , Kay Ng Kiong 
Published: December 2020

Abstract
Today, failure analysis involving flip chip [1] with copper pillar bump packaging technologies would be the major challenges faced by analysts. Most often, handling on the chips after destructive chemical decapsulation is extremely critical as there are several failure analysis steps to be continued such as chip level fault localization, chip micro probing for fault isolation, parallel lapping [2, 3, 4] and passive voltage contrast. Therefore, quality of sample preparation is critical. This paper discussed and demonstrated a quick, reliable and cost effective methodology to decapsulate the thin small leadless (TSLP) flip chip package with copper pillar (CuP) bump interconnect technology.
Combinational Logic Analysis Using Laser Voltage Probing
Authors: Ravikumar Venkat Krishnan , Lua Winson , Xuan Seah Yi , Ranganathan Gopinath , Phoa Angeline 
Published: December 2020

Abstract
Laser Voltage Probing (LVP) using continuous-wave near infra-red lasers are popular for failure analysis, design and test debug. LVP waveforms provide information on the logic state of the circuitry. This paper aims to explain the waveforms observed from combinational circuitries and use it to rebuild the truth table.
Complex Waveform Analysis for Advanced CMOS ICs
Authors: Abuayob Eli , Nisenboim Evgeny , Raveh Amir , Niu Baohua , Tong Tom 
Published: December 2020

Abstract
Laser scanning microscope (LSM) based waveform acquisition is widely used in advanced CMOS IC design validation and debug application. Complex waveforms obtained from LSM probing on CMOS ICs are often difficult to fully comprehend without deep understanding of the complex physics involved even in planar CMOS. The introduction of 3-D Tri-Gate transistors since 2010 made this even more challenging. In this paper, we present both model based simulation and probing validations on the most advanced 3D Tri-Gate based CMOS ICs that give us a clear understanding of the nature of these complex waveforms.
CF4-Free Microwave Induced Plasma Decapsulation of Automotive Semiconductor Devices
Authors: Tang Jiaqi , Wang Jing , Anderson Gregory B. , Bruckmeier Johannes , Keller Claudia , Dela Cruz Genny V. , Beenakker Kees 
Published: December 2020

Abstract
Failure analysis of automotive semiconductor devices requires highly reliable techniques to guaranty the success of artifact-free decapsulation with high repeatability and reproducibility. With the introduction of new qualification standards, new mold compounds, and new packaging structures, advanced decapsulation tools are needed to enable failure analysis to achieve a high success rate. Microwave Induced Plasma (MIP) machine has been developed as an advanced decapsulation solution. The CF4-free MIP etching ensures artifact-free exposure of bond wires made of new materials, the die, passivation, bond pads, and original failure sites. The high mold compound etching rate, high etching selectivity of mold compound to wire/pad/passivation/die, and the fully automatic process are the unique features of MIP decapsulation. Comparisons are made between acid, conventional plasma with CF4, and CF4-free MIP decapsulation. Multiple case studies are discussed that address challenging automotive semiconductor device decapsulation, including bare copper wire, copper redistribution layer, exposed power copper metal, stitch bond on silver plated leadframe, complex mold compound, Bond-Over-Active-Circuit, eWLB, and localized decapsulation.
Advanced X-Ray Inspection Techniques for IC Reverse Engineering
Authors: LaVoy Rosanne M. , Babian Fred , Reid Andrew 
Published: December 2020

Abstract
The need for reverse engineering (for IP verification or for reproducibility) has reached unprecedented levels requiring not only the inspection of the circuitry but also the understanding of the packaging and interconnects. Achieving the best X-ray inspection for a particular application depends on an in-depth understanding of the X-ray system configuration, the sample configuration, and the sample preparation techniques available. This paper presents various case examples on the development of advanced X-ray inspection techniques for IC reverse engineering, along with information on the limitations of X-ray imaging, issues with 3D reconstruction, models for resolution configuration improvement, and advantages and disadvantages of advanced sample preparation techniques. It is observed that the novel X-ray inspection techniques, combined with appropriate sample prep techniques, provide the necessary resolution to achieve results necessary for current reverse engineering needs.
Narrow-Beam Argon Ion Milling of Ex Situ Lift-Out FIB Specimens Mounted on Various Carbon-Supported Grids
Authors: Campin M. J. , Bonifacio C. S. , Nowakowski P. , Fischione P. E. , Giannuzzi L. A. 
Published: December 2020

Abstract
The semiconductor industry recently has been investigating new specimen preparation methods that can improve throughput while maintaining quality. The result has been a combination of focused ion beam (FIB) preparation and ex situ lift-out (EXLO) techniques. Unfortunately, the carbon support on the EXLO grid presents problems if the lamella needs to be thinned once it is on the grid. In this paper, we show how low-energy (&lt; 1 keV), narrow-beam (&lt; 1 μm diameter) Ar ion milling can be used to thin specimens and remove gallium from EXLO FIB specimens mounted on various support grids.
Preserving Evidence for Root Cause Investigations with Halogen-Free Microwave Induced Plasma
Authors: Odegard C. , Burnett Andy , Tang J. , Wang J. 
Published: December 2020

Abstract
Accurate root cause determination of integrated circuit devices necessitates the preservation of evidence during failure analysis. Identifying the cause of systemic defects requires capturing physical evidence provided by very few customer returns. Each piece of physical evidence is valuable due to the scarcity of returns in most cases less than 1 ppm. Harvesting infrequent physical evidence requires that each attempt to decapsulate a fail unit has a high probability of retaining the material that caused the defect. A measured method that retains the critical evidence is the fastest way to solve a defect driven systemic failure mechanism because one gathers the evidence more efficiently. This paper presents two case studies of improved evidence gathering using halogen-free microwave induced plasma (MIP) decapsulation during the root cause investigations. This relatively new method of decapsulation enabled us to preserve evidence, including any changes to the metal and die surface structures along with the presence of contaminants or by-products of failure mechanisms.
Ultra-Thinning of Silicon for Backside Fault Isolation
Authors: Campin M. J. , Nowakowski P. , Fischione P. E. 
Published: December 2020

Abstract
The size of devices on state-of-the-art integrated circuits continues to decrease with each technology node, which drives the need to continually improve the resolution of electrical failure analysis techniques. Solid immersion lenses are commonly used in combination with infrared light to perform analysis from the backside of the device, but typically only have resolutions down to ~200 nm. Improving resolution beyond this requires the use of shorter wavelengths, which in turn requires a silicon thickness in the 2 to 5 µm range. Current ultra-thinning techniques allow consistent thinning to ~10 µm. Thinning beyond this, however, has proven challenging. In this work, we show how broad beam Ar ion milling can be used to locally thin a device’s backside silicon until the remaining silicon thickness is &lt; 5 µm.
Сарайські данги пізньоджучидського хана Мухамма
Authors: Zayonchkovskiy Yuriy 
Published: December 2020

Пропонована стаття має на меті публікацію та попередній аналіз основних типів сарайських дангів пізньоджучідского хана на ім'я Мухаммад. У наукових працях ці емісії присутні дуже слабко: з дев'яти наведених у статті монетних типів в наукових публікаціях було виявлено повноцінно представленим (із графічною реконструкцією штемпелів) лише один. Публікуються, впорядковані відопівдно до вказаного на них місця випуску, дев'ять типів піздньоджучідськіх срібних дангів із зазначенням імені та титулів хана Мухаммада на аверсі і позначенням на реверсі місця карбування як Сарай, Сарай ал-Джадіда, Сарай ал-Махруса. У статті наведені якісні фотозображення срібних монет (більшість з яких уперше вводиться в науковий обіг) з метрологією. Наводиться реконструкція і переклад монетних легенд, а також попередній аналіз емісій. До третьої групи з зазначенням місця карбування Сарай ал-Махруса були віднесені данги, легенда реверсу яких, на думку автора, ідентична за змістом, але виконана різними різниками штемпелів. Певні складнощі викликає прочитання слова в нижньому рядку. Порівняння з палеографією азакських дангів 793 р.х. дозволяє запропонувати прочитання нижнього слова як ал-Махруса та реконструювати легенду реверсу як “КАРБУВАННЯ / САРАЙ / ал-МAХРУСА”. Монети можуть бути датовані 822 – серединою 830-х рр. х. Місце випуску на дангах, що публікуються, вказано як Сарай (без епітета або з таким). Але один цей факт не дозволяє безапеляційно стверджувати, що ці данги карбувалися саме там. Стосовно до срібних емісій XІV століття доведено, що монети могли битися зовсім не там, де викарбовано на їх реверсах. Подібна ситуація, скоріше за все, мала місце і в XV столітті. На сьогоднішньому рівні знань не можна впевнено стверджувати хто ж був такий Мухаммад-хан, від імені якого карбувалися монети, які є предметом статі. Для визначення точних дат, фактичного місця карбування й уточнення емітента необхідними є комплексні дослідження нових нумізматичних джерел, активізувати які покликана запропонована стаття.