bluuebunny/crossref_metadata_2025_split huggingface dataset:
Organic Geochemistry and Microfossils of the Upper Jurassic and Lower Cretaceous Strata in the Lower Reaches of the Olenek River (Northeastern Framing of the Siberian Platform, Arctic Siberia)
Authors: Kashirtsev V.A. , Nikitenko B.L. , Peshchevitskaya E.B. , Fursenko E.A. , Shevchenko N.P. 
Published: December 2020

Abstract
—The organic-geochemistry data reveal two levels in the reference Upper Jurassic–Lower Cretaceous section of the lower reaches of the Olenek River: lower (Volgian–lower Boreal Berriasian (diasterene)) and upper (Boreal Berriasian–Valanginian (hopane)). The Volgian beds are composed of clays with abundant prasinophytes Leiosphaeridia and Tasmanites and various dinocyst assemblages and have the highest content of organic carbon (Corg), up to 9%. Isoprenoids, in particular, pristane and phytane, are highly predominant among aliphatic hydrocarbons; their content is more than three times higher than that of coeluting n-alkanes, which is typical of buried chlorophyll-containing plankton (dinocysts and prasinophytes). Sedimentological, biofacies, and paleoecological analyses show that the highly carbonaceous beds of the Buolkalakh Formation formed under oxygen deficit conditions. An integrated analysis demonstrated that the pristane/phytane ratio does not always reliably reflect the reducing or oxidizing conditions of organic-matter accumulation and diagenesis. The discrepancy between the geochemical identification of organic matter according to the pristane/phytane ratio and the biofacies and sedimentological data is due to the low catagenetic maturity of OM. The Volgian was marked by a significant transgression of the Anabar–Lena sea, which was gradually changed by a successive regression of its basin at the end of this stage and in the Boreal Berriasian. The Corg contents in the coastal and subcontinental sediments decreased. Diasterenes and 4-methyldiasterenes disappeared from the balance of biomarker molecules, and the portion of hopanoids increased. Aerobic environments prevailed in the subbottom waters. Earlier, three biomarker horizons were identified according to geochemical criteria in the synchronous sections of Anabar Bay (Laptev Sea coast): terpane, diasterene, and hopane ones. In the section of the Olenek basin, the upper two horizons are well identified by specific biomarkers, and the lower one is absent because of the sedimentation break. Stratigraphic analysis of the location of these geochemical levels in different parts (and bathymetric zones) of the Anabar–Lena basin shows their diachronous formation. According to all geological and geochemical criteria, the Volgian Stage and the lower beds of the Boreal Berriasian Stage of this basin have a high petroleum potential. In the axial zone of the basin and, especially, on the Laptev Sea shelf, there were probably favorable conditions for the generation and accumulation of hydrocarbons genetically related to the Upper Jurassic highly carbonaceous rocks.
Study of changes in macular thickness following uneventful cataract surgery
Authors: Nasreen Shaik , Sudha R 
Published: December 2020

Worldwide, cataract accounts 47.8%. Phacoemulsification cataract surgery had good results.Current study aimed to identify the macular thickness following uneventful phacoemulsification & small incision cataract surgery method (SICS) comparison with visual acuity. In total (n=50) patients, 50% undergone SICS for one eye with bag polymethacrylate intraocular lens implantation and 50% undergone phacoemulsification method in one eye with in bag acrylic type of foldable IOL. Postoperatively patients followed on day 7, week 2 and week 4 and upto 3 months. The complete ophthalmological examination and OCT of macula was done at follow-up. Subclinical macular oedema noted in one case at 1, 2 and 4 week follow-up, but it was reduced at 3 month. There was statistical (p&#60;0.05) significant difference observed in macular thickness between the preoperative & post operative 1 week, post-operative 2 week & post-operative 4 week followup in Phaco group. Eyes with SICS procedure also shown statistical (p&#60;0.05) significant difference as above pre and postoperative follow-ups without affecting the final visual outcome. Post operatively, there was increased macular thickness without affecting the final visual outcome following phacoemulsification procedure. Subclinical macular edema noted at 1 week and reduced at 3 month.
FIFTH REPORT OF THE COMMITTEE FOR ECUADORIAN RECORDS IN ORNITHOLOGY (CERO), WITH COMMENTS ON SOME PUBLISHED, UNDOCUMENTED RECORDS
Authors: Freile Juan , Olmstead Scott , Athanas Nick , Brinkhuizen Dusan , Navarrete Lelis , Nilsson Jonas , Sánchez-Nivicela Manuel , Solano-Ugalde Alejandro , Greenfield Paul 
Published: December 2020

Wepresent new distributional records of birds in Ecuador evaluated by the Committee for Ecuadorian Records in Ornithology (CERO) from November 2017 through June 2019. This report includes two species new to Ecuador (Pelecanoides garnotii, Conirostrum margaritae), five species with first documented country records (Thaumastura cora, Anous minutus, Setophaga pensylvanica, S. virens, Spiza americana), two species with first documented Galapagos records (Oceanodroma hornbyi, Egretta tricolor), remarkable range extensions for 15 species (Amazilia amazilia, Aramus guarauna, Vanellus chilensis, Attagis gayi, Anous stolidus, Sterna hirundo, Thalasseus elegans, T. sandvicensis, Eurypyga helias, Mycteria americana, Plegadis falcinellus, Gampsonyx swainsonii, Rosthramus sociabilis, Glaucidium peruanum, Thlypopsis sordida), new records of 16 rare species (Oressochen jubatus, Spatula cyanoptera, Podiceps major, Stercorarius longicaudus, Larus belcheri, Pelagodroma marina, Oceanodroma markhami, Egretta rufescens, Plegadis ridgwayi, Buteo swainsonii, Megascops koepckeae, Tyrannus albogularis, Setophaga castanea, Dolichonyx oryzivorus, Icterus chrysater, I. galbula) and additional records for 8 species. Finally, we invalidate previous records of Pyrilia pyrilia published in different sources, reject records of six species submitted to CERO, and discuss six previously published, undocumented records that might prove erroneous. CERO revises and updates the country bird list, which currently stands at 1696 species (1642 confirmed and documented; 54 undocumented).
Factores de crecimiento en las fintech peruanas: una caracterización en un estudio de caso múltiple
Authors: Pérez Chuquiruna Fanny , Benito Cardenas Rosa , Ramos Sánchez José 
Published: December 2020

Las fintech son un tipo de empresa emergente, emprendimiento o startup que posee modelos de negocio innovadores basados en la tecnología para atender necesidades financieras. En el Perú, las fintech poseen un alto crecimiento debido a la gran cantidad de usuarios insatisfechos por los servicios del sistema financiero tradicional; sin embargo, pese a su acelerado desarrollo, no se encuentran estudios empíricos que aborden el fenómeno del crecimiento en las fintech. Por tanto, este artículo pretende aportar conocimiento, caracterizando los factores internos y externos de crecimiento encontrados en la teoría y comparados en un contexto local. Para ello, se realizó un estudio de casos múltiple con ocho fintech peruanas que pertenecen a los segmentos con mayor crecimiento al 2019 en Lima Metropolitana. Los hallazgos identifican factores clave transversales a la etapa de crecimiento, así como otro grupo en el cual la relevancia sí dependerá de la etapa en la que se encuentren la compañía.
Racial Disparities in Access to and Utilization of Jail- and Community-Based Mental Health Treatment in 8 US Midwestern Jails in 2017
Authors: Hedden Bethany Joy , Comartin Erin , Hambrick Nanci , Kubiak Sheryl 
Published: December 2020

Objectives. To examine the dual disproportionality that individuals with serious mental illness and people of color (PoC) occupy in the criminal–legal system. Methods. This study follows a cohort of 623 individuals who screened positive for mental health issues at booking in 8 Midwestern jails in 2017. We followed individuals through the jails’ practices of jail-based mental health treatment, and we used Medicaid billing data to assess community-based behavioral health treatment engagement in the postyear period after jail release. The aim was to examine if an individual’s race/ethnicity was associated with their access to jail- and community-based mental health treatment. Results. We did not find any racial disparities in jail-based treatment, although 3 community-based outcomes significantly differed. Compared with PoC, White people had 1.9 times greater odds of receiving community-based mental health and substance use treatment and 4.5 times greater odds of receiving co-occurring disorder treatment. Conclusions. Barriers that individuals released from jail face adversely affect PoC, resulting in reduced access to treatment. Critical race theory can expose the assumptions and functions of systems of care and the possible reproduction of implicit bias in potential solutions.
Lethal Means Counseling, Distribution of Cable Locks, and Safe Firearm Storage Practices Among the Mississippi National Guard: A Factorial Randomized Controlled Trial, 2018–2020
Authors: Anestis Michael D. , Bryan Craig J. , Capron Daniel W. , Bryan AnnaBelle O. 
Published: December 2020

Objectives. To examine whether lethal means counseling and provision of cable locks prompt safe firearm storage relative to control among firearm-owning members of the Mississippi National Guard. Methods. This randomized controlled trial utilized a 2 × 2 factorial design (lethal means counseling vs control, provision of cable locks vs no cable locks). Follow-up assessments took place at 3 and 6 months after baseline. Data were collected (n = 232; 87.5% male; mean age = 35.01 years; 77.2% White) from February 2018 through July 2020. Results. Relative to control, lethal means counseling and provision of cable locks resulted in greater adoption of several safe storage methods over time. Lethal means counseling outperformed control (3 months: 55.0% vs 39.0%; odds ratio [OR] = 1.91). Cable locks outperformed control at 3 and 6 months on number of storage methods (1.41 vs 1.11; d = 0.29 and 1.34 vs 1.16; d = 0.15, respectively) and locking devices (59.8% vs 29.9%; OR = 3.49 and 58.4% vs 35.8%; OR = 2.52, respectively) Conclusions. Lethal means counseling and cable locks can result in sustained changes in firearm storage. Public Health Implications. The military may benefit from lethal means counseling, perhaps administering at point of entry. Trial Registration. Clinical Trials.gov identifier: NCT03375099.
Comparative Study of Sample Preparation Techniques for Backside Analysis
Authors: Perdu Philippe , Desplats Romain , Beaudoin Felix 
Published: December 2020

Abstract
This paper presents a comparative study of backside sample preparation techniques with applicability to conventional as well as flip chip package types. We will cover mechanical (grinding and milling tools), chemical (wet and dry chemistries) and other approaches such as laser ablation. Backside sample preparation is very challenging. The preparation process flow starts with decapsulation of the ceramic or plastic package, continues with the die paddle removal, silicon thinning and finishes with silicon polishing. The techniques involved include mechanical, chemical and other novel approaches for ceramic and plastic package. Today, only CNC milling can cover the whole process for almost any kind of packages. Nevertheless, photo ablation is a rising technology for package decapsulation. In addition, chemical wet etch can be used to perform silicon thinning and polishing. We will illustrate the complexity of the process through examples. The first one is a ceramic package where the main issue is the hardness of ceramic. The second one is a TSOP package where the main challenge is the chip scaled package. Both will be observed through the IR emission microscope to demonstrate the efficiency of the preparation.
Failure Analysis of MEMS Using Thermally-Induced Voltage Alteration
Authors: Walraven Jeremy A. , Cole Edward I. , Tangyunyong Paiboon 
Published: December 2020

Abstract
Electrical shorting in micro-electro-mechanical systems (MEMS) is a significant production and manufacturing concern. We present a new approach to localizing shorted MEMS devices using Thermally-Induced Voltage Alteration (TIVA) [1]. In TIVA, the shorted, thermally isolated MEMS device is very sensitive to thermal stimulus. The site of the MEMS short will respond as a thermocouple when heated. By monitoring the potential across the shorted MEMS device as a laser scans across the sample, an image showing the location of the thermocouple (short site) can be generated. The TIVA signal for thermally isolated MEMS devices is much higher than that observed for conventional IC interconnections. This results from the larger temperature gradients generated during laser scanning due to little or no substrate heat sinking. The capability to quickly localize shorted MEMS structures is demonstrated by several examples. Thermal modeling of heat distributions is presented and is consistent with the experimental results.
A Novel X-Ray Microtomography System with High Resolution and Throughput for Non-Destructive 3D Imaging of Advanced Packages
Authors: Scott David , Duewer Fred , Kamath Shashi , Lyon Alan , Trapp David , Wang Steve , Yun Wenbing 
Published: December 2020

Abstract
X-ray microscopy has the potential to solve many failure analysis problems associated with advanced package technologies because of its ability to non-destructively inspect advanced multi-layer package designs. In addition, x-ray imaging has the potential to perform fault isolation in 3D using well-established tomographic reconstruction methods. The ability to perform high-resolution, artifact free tomographic reconstructions will be critical to the Advanced Packaging Failure Analysis community. This article discusses the requirements for a high-resolution, three-dimensional tomographic imaging microscope and shows how these requirements pose a problem for conventional projection based x-ray microscopes, specifically the requirement to place the sample in near contact with the x-ray source. The article then discusses the results from the Micro-XCT, an x-ray tomographic imaging microscope designed by Xradia, Inc., whose unique design allows for the required 180 degrees of sample rotation while simultaneously maintaining resolutions as high as 1 micrometer.
Magnetic Current Imaging with Magnetic Tunnel Junction Sensors—Case Study and Analysis
Authors: Schrag Benaiah D. , Carter Matthew J. , Liu Xiaoyong , Hoftun Jan S. , Xiao Gang 
Published: December 2020

Abstract
We describe the use of magnetic tunnel junction (MTJ) sensors for the purposes of magnetic current imaging. First, a case study shows how magnetic and current density images generated using an MTJ sensor probe were used to isolate the root cause of failure in a newly-designed ASIC. We then give a brief introduction to the operation and construction of MTJ sensors. Finally, a full comparison is made between the three types of sensors which have been used for magnetic current imaging: giant magnetoresistive (GMR) sensors, superconducting quantum interference devices (SQUIDs), and magnetic tunnel junctions. These three technologies are quantitatively compared on the basis of spatial resolution, sensitivity, and geometry.
Packaging Material has Contributed to High Idd_Pd Failures in CMOS ICs
Authors: Chi Pun Meng , Eng Chew Gim , Sulaiman Nazita 
Published: December 2020

Abstract
An aggressive yield improvement program that was undertaken by the engineering teams has culminated in the works reported in this paper. The power down current (Idd_Pd) was one of the major failure modes recorded for CMOS ICs. In essence, any improvement made on the Idd_Pd test yield will result in substantial gain in terms of cost and production capacity. A taskforce to resolve high fallouts for the Idd_Pd was then formed back in the year 2004. This taskforce comprised of members from various engineering teams, for instance, Manufacturing, IC Design, Materials and Failure Analysis (FA). The length of investigation to resolve the complex high Idd_Pd failures had spanned over a period of a year. The team had devised a comprehensive sets of DOEs (Design of Experiments) which were conducted at various contract manufacturing facilities where the ICs were packaged. Results obtained from these DOEs had conclusively pointed to molded materials as the major factor contributing to high Idd_Pd yield loss. Armed with this vital information, FA had performed an indepth electrical diagnosis as well as physical analysis on the molded materials. The analysis results had confirmed contamination of the molding materials by conductive carbonized resin as the cause of high leakage current in ICs. Likewise, the material supplier had found minute contamination in the resin melt. In essence, Idd_Pds that were measured in the range of tens of microamps to thousands of microamps in ICs could be largely attributed to leakages caused by carbonized resin in the molded materials.
Floating Substrate Passive Voltage Contrast (FSPVC)
Authors: Jenkins Mark W. , Tangyunyong Paiboon , Cole Edward I. , Soden Jerry M. , Walraven Jeremy A. , Pimentel Alejandro A. 
Published: December 2020

Abstract
Light emission [1,2] and passive voltage contrast (PVC) [3,4] are common failure analysis tools that can quickly identify and localize gate oxide short sites. In the past, PVC was not used on electrically floating substrates or SOI (silicon-on-insulator) devices due to the conductive path needed to “bleed off” charge. In PVC, the SEM’s primary beam induces different equilibrium potentials on floating versus grounded (0 V) conductors, thus generating different secondary electron emission intensities for fault localization. Recently we obtained PVC signals on bulk silicon floating substrates and SOI devices. In this paper, we present details on identifying and validating gate shorts utilizing this Floating Substrate PVC (FSPVC) method.
A Novel Non-Destructive Approach to Deprocess the Sealing Cap from MEMS Device for Failure Analysis
Authors: Liu Hsien-Wen , Chiang King-Ting , Liu Tao-Chi , Chang Ming-Lun , Lin Jandel 
Published: December 2020

Abstract
Applications of Micro-Electro-Mechanical Systems (MEMS) sensors have developed rapidly in the last decade, increasing the need of Failure Analysis (FA) to characterize abnormalities and to identify failure modes of various types of MEMS devices. One of the greatest challenges is removal of the sealing cap from the MEMS device without any impact to the moveable sensing elements. A novel non-destructive technique has been successfully developed using KOH wet chemical etching followed by application of ex-situ hand sticking to deprocess the sealing cap from an accelerometer device. This new approach provides a quick and reliable way to remove the sealing cap from a MEMS device.
Electrical Failure and Damage Analysis of Multi-Layer Metal Films on Flexible Substrate during Cyclic Bending Deformation
Authors: Kim Byoung-Joon , Shin Hae-A-Seul , Choi In-Suk , Joo Young-Chang 
Published: December 2020

Abstract
The electrical resistance Cu film on flexible substrate was investigated in cyclic bending deformation. The electrical resistance of 1 µm thick Cu film on flexible substrate increased up to 120 % after 500,000 cycles in 1.1 % tensile bending strain. Crack and extrusion were observed due to the fatigue damage of metal film. Low bending strain did not cause any damage on metal film but higher bending strain resulted in severe electrical and mechanical damage. Thinner film showed higher fatigue resistance because of the better mechanical property of thin film. Cu film with NiCr under-layer showed poorer fatigue resistance in tensile bending mode. Ni capping layer did not improve the fatigue resistance of Cu film, but Al capping layer suppressed crack formation and lowered electrical resistance change. The NiCr under layer, Ni capping layer, and Al capping layer effect on electrical resistance change of Cu film was compared with Cu only sample.
A Method of Stress Reduction during Silicon Thinning
Authors: Mulholland Matthew M. , Wadell Robert P. 
Published: December 2020

Abstract
Post silicon validation techniques require backside sample preparation by silicon thinning techniques. The conventional fixture to this preparation on large die packages causes silicon to crack. A new “4-point bending” fixture was developed to reduce silicon bending strain during thinning to eliminate silicon cracking. This new fixture and technique improved remaining silicon thickness uniformity as well as process time.
Filtering and Emission Area Identification in the Time Resolved Imaging Data
Authors: Chef S. , Jacquir S. , Binczak S. , Sanchez K. , Perdu P. 
Published: December 2020

Abstract
Time Resolved Imaging (TRI) acquisitions allow precise timing analysis of emission spots. Up to date technologies deeply challenge their isolation by hiding the weak ones, under sizing or over sizing visually detectable emission spots and finally by jeopardizing timing resolution. We report on an algorithm based on 1 and 2D signal processing tools which automates the identification of emission sites and optimizes separation between noise and useful signal, even for weak spots surrounding strong emission areas. The application of the algorithm on several sets of data from different types of devices and their results are also discussed.
Development of Advanced Non Destructive Techniques for Failure Analysis of PCBs and PCBAs
Authors: Perraud Julien , Enouz-Vedrenne Shaïma , Clement Jean-Claude , Grivon Arnaud 
Published: December 2020

Abstract
The continuous miniaturization trends followed by a vast majority of electronic applications results in always denser PCBs (Printed Circuit Board) designs and PCBAs (Printed Circuit Board Assembly) with increasing solder joint densities. Current high-end designs feature high layer count sequential build-up PCBs with fine lines/spaces and numerous stacked filled microvias, as well as closely spaced BGA/QFN components with pitches down to 0.4mm. In recent years, several 3D packaging approaches have emerged to further increase system integration by enabling the stacking of several dies or packages. This has translated for example into the advent of highly integrated complex System in Package (SiP) modules, Package-on-Package (PoP) assemblies or chips embedded in PCBs [1]. From a failure analysis (FA) perspective, this deep technology evolution is setting extreme challenges for accurately locating a failure site, especially when destructive techniques are not desired. The few conventional non-destructive techniques like optical or x-ray inspection are now practically becoming useless for high density PCB designs. This paper reviews several advanced analysis techniques that could be used to overcome these limitations. It will be shown through several examples how three non-destructive methods usually dedicated to package analyses can be efficiently adapted to PCBs and PCBAs: • Scanning Acoustic Microscopy (SAM) • 3D X-ray Computed Tomography (CT) • Infrared Thermography A case study of a flex-rigid board FA is presented to show the efficiency of these three techniques over classical techniques. In this example, not only the defect localization has been possible, but also the defect characterization without using destructive analysis.