bluuebunny/crossref_metadata_2025_split huggingface dataset:
Aggressive vertebral hemangiomas in asymptomatic patients: A review
Authors: Santos Rayan Haquim Pinheiro , França Caio Nuto Leite , Guimarães Victor Dinelli , Prigenzi Cezar Kabbach Calaça , Fontoura Emilio Afonso França , Botelho Ricardo Vieira 
Published: December 2020

Background:Hemangioma is the most common benign tumor of the spine. Most patients are asymptomatic, but some lesions can become aggressive, leading to spinal compression. Here, we reviewed the natural history and treatment of aggressive hemangiomas in asymptomatic patients.Methods:An electronic review of the literature was performed regarding the diagnosis/treatment modalities for asymptomatic aggressive hemangiomas of the spine utilizing the Medline (PubMed) and Google Scholar databases.Results:We selected four articles describing the diagnosis/management of four cases of aggressive, asymptomatic hemangiomas in patients averaging 11.25 ± 2.36 years of age. Three of the four patients were females, and all were followed an average of 36.5 ± 25 months. Notably, two of four patients required emergency surgery.Conclusion:There is a paucity of the literature regarding the diagnosis and optimal therapeutic management of aggressive hemangiomas in asymptomatic patients, half of whom may present with acute neurological deterioration warranting emergency surgery.
ROLE OF THE QUALIFICATION OF JUDGES IN ENSURING THE AUTHORITY OF THE JUDICIAL POWER
Authors: Туманова Лидия Владимировна 
Published: December 2020

Статья посвящена вопросам формирования судейского корпуса и полномочиям квалификационных коллегий судей. Авторитет судебной власти обеспечивается личностью каждого судьи, поэтому так важен конкурсный отбор на судейские должности. Принцип независимости не означает отсутствие ответственности.
The article is devoted to the formation of the judiciary and the powers of the qualification collegiums of judges. The authority of the judiciary is ensured by the personality of each judge, which is why competitive selection for judicial positions is so important. The principle of independence does not mean lack of responsibility.
STUDI KUALITATIF WAJIB PAJAK ORANG PRIBADI PENGUSAHA TERTENTU DALAM MELAKUKAN PEMBAYARAN PAJAK PENGHASILAN (Studi Kasus Pada Pelaku Social Commerce)
Authors: Aryani R. Ayu Ida 
Published: December 2020

Tujuan penelitian ini adalah untuk mengetahui kondisi pengetahuan pelaku social commerce sebagai wajib pajak pengusaha tertentu dalam membayar pajak penghasilan atas usahanya. Penentuan perilaku agen social commerce ketika dihadapkan pada tantangan membayar pajak penghasilan, dan bagaimana kendala yang dihadapi oleh petugas pajak atas transaksi social commerce pengumpulan pajak. Penelitian ini merupakan penelitian kualitatif yang dilakukan dengan mewawancarai para pelaku perdagangan social. Hasil wawancara menunjukkan bahwa faktor utama pelaku social commerce tidak membayar pajak penghasilan adalah kurangnya informasi jika mereka wajib pajak dan diharuskan membayar pajak atas penghasilan yang diterima. Mereka perlu memiliki kriteria yang jelas tentang perpajakan perdagangan social, jangka waktu pembayaran, dan kepastian bahwa mereka tidak dirugikan. Berbagai kendala yang dihadapi KPP untuk keperluan perpajakan juga terjadi transaksi social commerce, seperti kesulitan melacak siapa yang bertransaksi social commerce, kesulitan menentukan objek pajak (hingga formal digital), transaksi tidak hanya di wilayah pabean Indonesia.
Focused Ion Beam Assisted Circuit Debug of a Video Graphics Chip
Authors: Fischer L.S. , Herschbein S.B. 
Published: December 2020

Abstract
Microchip circuit simulation modeling cannot always duplicate all of the independent variables found in a system level application. Sometimes, monitoring the logic states at multiple internal nodes when operating in the native environment is the only way of debugging a subtle design error. In this situation, Focused Ion Beam (FIB) technology was used to provide microprobe access points to deeply buried nets, allowing levels of real-time mapping not available by any other method. Data extraction was accomplished by probing the socketed chip on a rigidly mounted AT bus video card. The driver was a fully disassembled personal computer running a graphics intensive program. The close collaboration between failure analyst, applications engineering and the chip designers made this a truly unique experience.
A User-Friendly System for Fluorescent Microthermal Imaging and Light Emission Microscopy
Authors: Glacet J-Y. , Berne S. 
Published: December 2020

Abstract
The Fluorescent Microthermal Imaging (FMI) technique was developed as a new failure analysis tool for hot spot and leakage site localization in order to complement the Liquid Crystal and Light Emission Microscopy techniques. The goal of this work was to produce a user-friendly and automated FMI system which is simple to use by the laboratory personnel. The instrumentation was set up on a probe station. It involved a uv light source, a dark box, a motorized optical microscope, a slow scan cooled CCD camera, a temperature controller, electrical test equipment, and a PowerMacintosh computer with IPLab software for instrumentation control, image acquisition and image processing. Software extensions for IPLab were developed with Think C to add automated functions to the system using the GPIB-IEEE 488 bus. IPLab scripts were written to fully automate instrumentation control, image acquisition and processing. A study of EuTTA compound fluorescence intensity variation with temperature, exposure time, and uv excitation was performed in order to characterize the system. The FMI technique was then applied to hot spot identification on microelectronic devices and failure analysis. With a few simple modifications, the same system was also employed for Light Emission Microscopy.
FLOSPAT: Fault Localization by Sensitized Path Transformation
Authors: Heath M.W. , Maly W. 
Published: December 2020

Abstract
This paper describes a fault identification algorithm for combinational and full-scan sequential circuits called FLOSPAT - Fault Localization by Sensitized Path Transformation [1,2]. The goal of fault identification is to localize a fault to the fewest possible gates and to determine the Boolean functions realized by those gates. Instead of choosing a fault model, FLOSPAT uses fault-independent sensitized path tracing [3] to localize functional deviations. Sensitized path transformation is used to adaptively generate test vectors which improve the diagnostic resolution. The output of FLOSPAT is used for physical defect diagnosis by cross-referencing gate-level defect dictionaries generated by the contamination-defect-fault mapper CODEF [4,5,6].
A Study of Measurement Methods for Detecting Voiding and Delamination of Die Attach Materials in Power Semiconductor Devices
Authors: Smith L. , Kalkur T.S. 
Published: December 2020

Abstract
There are three basic methods used to detect voiding and delamination of die attach materials in semiconductor devices. (1)Electrical measurement of a temperature sensitive parameter (e.g. Vbe, Vgs) under pulsed power conditions is preferred by manufacturers because the data is easily and quickly obtainable during final electrical test; but electrical measurements are only sensitive to gross voiding or delamination. (2)X-ray analysis produces images which are generally accepted as proof of voiding; but X-ray is completely insensitive to delamination or degradation from thermal stress. (3)Use of Scanning Acoustic Microscopy (SAM) as a non-intrusive analysis tool is increasing in the semiconductor industry and provides accurate evidence of delamination in cases where the other two methods fail. The use of all three methods is recommended to maintain a reliable power product fabrication line at its peak of quality with respect to die attach coverage. This paper will compare and contrast the three methods during thermal shock stress in two manufacturer's power Insulated Gate Bipolar Transistor (IGBT) using a lead-tin solder die attach material.
Signature Analysis of Package Delamination Using Scanning Acoustic Microscope
Authors: Li S.X. , Lee K. , Hulog J. , Gannamani R. , Yin S. 
Published: December 2020

Abstract
Package delaminations are often associated with electrical and package reliability problems in IC devices. Delaminations caused by electrical-over-stress (EOS) and moisture expansion during reflow soldering have shown different delamination patterns. A Scanning Acoustic Microscope (SAM) can be used to detect package delaminations. Understanding these delamination signatures can help us quickly identify the failure cause at an early stage of the failure analysis.
Interconnect Failure Dependence on Crystallographic Structure
Authors: Field D.P. , Nucci J.A. , Keller R.R. 
Published: December 2020

Abstract
A wealth of literature has arisen in the past couple of decades regarding the phenomenon of electromigration. In addition, stress voiding has received considerable attention from the research community. Some of the work on the structural character of these phenomena has focussed on the roles of crystallographic texture and grain boundary structure. It is an experimental fact that the strength of the (111) fiber texture is an indication of interconnect reliability, the stronger the texture, the more reliable the interconnect. It is also presumed that grain boundary diffusivity is a controlling factor in electromigration behavior of polycrystalline lines. Undesirable grain boundary structure is likely a cause of failure in lines with a bamboo structure as well because they are often sites of stress concentration and local incompatibilities. The present study focuses upon electromigration failures in test structures of Al-Cu lines and stress voiding in Cu lines. Texture and grain boundary structure were measured directly on the specimens using electron back-scatter diffraction and orientation imaging. It is observed that a correlation exists between grain boundary structure and void formation in strongly textured polycrystalline lines. Results indicate that secondary orientation (not just the (111) fiber), and boundary structure may be of primary importance in optimizing interconnect microstructure.
Microthermal Imaging Based on the Transmission Change of a Thermochromic Dye Film
Authors: Ban Hiroshi , Komine Yukio , Takeda Tadao , Nakamura Shinji 
Published: December 2020

Abstract
We have developed a sensitive method for detecting hot spots in LSIs, which is called Dye Thermochromism Imaging (DTI). A key is a thermochromic dye film based on a leuco-dye/acid/modulator/polymer system. The blue color of this film reversibly fades at temperatures near room temperature: its transmittance at 610 nm changes at a logarithmic slope of 0.35/°C. A differential local brightness increase in the image indicates a hot spot when an LSI is biased with a supply voltage. We observed a hot spot in a low power SRAM at supply voltages between 0.9 and 2 V and power dissipations between 0.072 and 1 mW using a 10-bit/12-bit dual mode CCD. Comparing DTI with fluorescent microthermal imaging (FMI), we found that DTI has several advantages with regard to temperature sensitivity, reproducibility in repeated measurements, instrumental setup, and speed of measuring.
Embedded SRAM Bitmapping and Failure Analysis for Manufacturing Yield Improvement
Authors: Glacet Jean-Yves , Lee Fourmun 
Published: December 2020

Abstract
SRAM bitmapping and failure analysis have been used as a driver for continuous yield improvement during pre-qualification manufacturing of a microcontroller. The combination of the embedded SRAM electrical failure data and failure analysis results was used to generate a pareto of failure modes and failure mechanisms and establish a correlation between the two. Bitmap trend charts can be used as a manufacturing line monitoring tool to supplement traditional in-line inspection. Identification of manufacturing issues can be obtained from bit failure information and compared with in-line inspection results to quickly identify which specific process module is responsible for a significant yield loss.
Overcoming Environmentally Induced Probe Drift for Sub-300nm Fault Isolation
Authors: Waggoner Clint A. 
Published: December 2020

Abstract
This paper defines environmentally induced probe drift and elaborates on the problems and challenges associated with it as they relate to physical sub-micron fault isolation systems. Vibration, acoustical, and thermal disturbances are discussed. Probing hardware that can be affected by environmental conditions will be summarized. A comparison of the different approaches is presented with the “pros” and “cons” of each approach summarized. Optimal methods of managing probe drift are presented to give the reader a complete understanding of how environmentally induced probe drift may impact their own physical sub-micron fault isolation. Examples, images, and device data are presented when appropriate.
Design and Process Related Failure Detection With Reliability Testing Incorporating Varying Power Sequencing and Slew Rate
Authors: Kadathur Srinivasan R. , Spencer Dennis , Walker Andrew 
Published: December 2020

Abstract
The fact that most components on prototype motherboards are likely to be from the same, or nearly the same manufacturing lot, and hence do not show the same variation that may be seen between lots during mass production, magnifies the deficiencies in the design and test process with respect to design robustness against process and manufacturing variability. This article details the need for and the use of Slew Rate Control and Rail Ordering Control in conjunction with the use of the temperature and voltage testing beyond specification to ensure product robustness and detect design weakness. It is important to have the ability to test functionality at all bounds of the specification, including any gray areas, to reduce field failures. The test proposed in the article helps address this problem, saving valuable design and debug time and preventing potential future issues when leveraging the circuit on platforms with different power sequencing.
Complementary EBIC and SEM Analysis of ESD Induced Failures in PIN Photodiodes
Authors: Helfand Martin A. , Owens Mark , Chokshi Nehal 
Published: December 2020

Abstract
Solid-state semiconductor devices such as III-V based photodiodes can suffer damage from electro-static discharge (ESD) events. Electron beam induced current (EBIC) imaging techniques have been used successfully to characterize a wide range of failure modes in many different material systems. This article proposes a technique of superimposing the EBIC image with the secondary electron image which permits the correlation of the recombination center with defects and is a powerful tool to assist in the understanding of the root cause for failure. Further complementing the EBIC and SEM analysis with optical microscopy, DC and AC electrical characterization enhances the understanding of the location, nature and mode of failure. The creation of these defects is very localized and commonly occurs at pre-existing defect sites or along the periphery of the metal guard ring. This is characteristic of ESD-induced failure along with the localized heating and evaporation of material.
Study of MFM Application in Semiconductor Failure Analysis
Authors: Chen Way-Jam , Shiau Lily , Huang Ming-Ching , Chao Chia-Hsing 
Published: December 2020

Abstract
In this study we have investigated the magnetic field associated with a current flowing in a circuit using Magnetic Force Microscopy (MFM). The technique is able to identify the magnetic field associated with a current flow and has potential for failure analysis.
Study of Porous Organic Ultra Low K Materials After Treatment With Various Etching and Cleaning Plasma
Authors: Lu Dong , Lim Vanissa , Ramana Murthy B. , Kumar Rakesh , An Yan Du , Trigg Alastair D. , Yang Ping 
Published: December 2020

Abstract
In the selection of ultra low k materials, process compatibility is a very important factor. Plasma processing plays a critical role in enhanced interconnect integration. It is therefore important to study plasma interaction with the ultra low k materials and its effects on the structure and property of these materials. X-ray reflectivity (XRR) measurement can be used to measure film thickness, density and interface roughness, which are important parameters to check for after plasma treatments. In the current study, porous SiLK (p-SiLK) was treated with various plasmas, such as O2, O2/N2, H2/N2, CH2F2/Ar and CF4/O2. XRR results indicate that the density of the p-SiLK films remains unchanged after various plasma treatments. Surface roughening occurs during the plasma treatments, accompanied by the decrease in film thickness. Plasma-induced surface roughening was also observed using atomic force microscope (AFM). Such roughening is more severe for plasma treatments using oxygen-containing plasmas. FTIR analysis indicates that the chemical structure of the p-SiLK films is not significantly affected by plasma treatment. It is reasonable to conclude that oxidation of the surface plays a major role in the plasma-induced change in surface roughness and film thickness.
Optimizing Gas-Assisted FIB Processes: The Importance of Oft-Ignored Secondary Parameters
Authors: Rue C. , Herschbein S. , Scrudato C. , Fischer L. , Shore A. 
Published: December 2020

Abstract
The efficiency of Gas-Assisted Etching (GAE) and depositions performed using the Focused Ion Beam (FIB) technique is subject to numerous factors. Besides the wellknown primary parameters recommended by the FIB manufacturer (pixel spacing, dwell time, and gas pressures), certain secondary factors can also have a pronounced effect on the quality of these gas-assisted FIB operations. The position of the gas delivery nozzle during XeF2 mills on silicon is examined and was found to affect both the milling speed and the texture on the floor of the FIB trench. Limitations arising from the memory capacity of the FIB computer can also influence process times and trench quality. Exposing the FIB vacuum chamber to TMCTS during SiO2 depositions is found to temporarily impede the performance of subsequent tungsten depositions, especially following heavy or prolonged TMCTS exposure. A delay period may be required to achieve optimal tungsten depositions following TMCTS use. Finally, the focusing conditions of the ion beam are found to have a significant impact on the resistance of FIB-deposited metal films. This effect is attributed to partial milling of the deposition film due to the intense current density of the collimated ion beam. The resistances of metal depositions performed with intentionally defocused ion beams were found to be lower than those performed with focused beams.
Silicon Thinning using Ultra-Short Pulse Laser Ablation
Authors: Beaudoin F. , Perdu P. , DeNardi C. , Desplats R. , Lopez J. , Faucon M. 
Published: December 2020

Abstract
Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.
Failure Analysis of Functional Failures in a Designed for FA SRAM
Authors: Garteiz Gil 
Published: December 2020

Abstract
Designing devices for failure analisys (FA) is becoming increasingly critical as structure geometries and killer defects rapidly decrease in size. Naturally, devices that are designed for FA are much easier to analyze and have a higher FA success rate than those that are not. Several analyses of functional failures in a 0.18um CMOS SRAM are presented in this paper to demonstrate “Design For FA” usefulness and application. Physical analysis methodology is also discussed.
Chemical Delidding and Thin-Die Extraction of Flip-Chip Devices Using N-Methyl-2-Pyrrolidone
Authors: Agarwal Reena , Ramanujachar Kartik , Rusli Darwin , Wills Scott , Cowens Marvin , Stierman Roger 
Published: December 2020

Abstract
Chip access for flip-chip packages in high-performance microprocessors is performed by removing the lid then by extraction of the die from the package substrate. Residual stresses built in temperature cycled (TC) units result in a low success rate using conventional delidding techniques. A need has developed in failure analysis for stress-free removal of the materials surrounding a flip-chip device. This paper discusses a novel, cost effective, wet chemical process that has been developed for thin die and lid removal of flip-chip packaged units. The process uses n-methy-2-pyrrolidone (NMP) for epoxy-based lid attach and underfill materials. A reflux unit is designed to reduce the risk of fire and explosion when the sample is heated in the solvent to the desired temperature. The method of heating reduces the chance of thermal shock, which could fracture the sample due to rapid heating or cooling.
Noninvasive Acoustic Phonon Characterization of Dynamic MEMS
Authors: Wong W.K. , Palaniapan M. , Wong C.L. , Wang S.R. , Tay F.E.H. 
Published: December 2020

Abstract
This paper describes an acoustic phonon-based characterization technique as a novel tool for the characterization of dynamic microelectromechanical (MEMS) devices such as resonators, switches, micromirrors, accelerometers and gyroscopes. The technique intrinsically features non-invasive characterization due to the favorable transmission properties of acoustic phonons through device packaging and high throughput due to universal detectability from a single detection point, which facilitates high volume wafer and package level testing. The dependence of phonon generation on material properties yields information not obtained in existing electrical, optical and electron beam testing techniques such as contact tribology, energy dissipation, non-linear device behavior and device resonance modes. Preliminary case study results show that phonon-based characterization not only provides efficient, non-destructive testing (NDT) of MEMS functionality, but also insights into MEMS device lifecycle behavior.
Triangulating to a Defect’s Physical Coordinates Using Multiple Supply Pad IDDQs—Test Chip Results
Authors: Plusquellic Jim , Acharyya Dhruva , Tehranipoor Mohammad , Patel Chintan 
Published: December 2020

Abstract
Quiescent Signal Analysis (QSA) is an IDDQ method for detecting defects that is based on the analysis of multiple simultaneous measurements of supply port IDDQs. The nature of the information in the multiple IDDQs measurements also allows for the localization of the defect to physical coordinates in the chip. In previous work, we derived a hyperbola-based method from simulation experiments that is able to "triangulate" the position of the defect in the layout. In this paper, we evaluate the accuracy of this method using data collected from 12 chips fabricated in a 65 nm process.
Study on the Effect of FIB Electron Beam Assisted Platinum Deposition on TEM Sample Analysis
Authors: Hu Jianqiang , Zhou Jing , Li Ming , Gao Qiang , Niou Chorng , Chien Kary W.T. 
Published: December 2020

Abstract
Electron beam assisted platinum film deposition has been found to be an effective method to protect the sample surface for both FIB and TEM analysis. In this paper, the phenomena of electron beam assisted deposition of platinum will be reviewed The results suggest that a 45 nm thick residual Pt film can effectively protects (100) silicon from damage induced by ion beam assisted Pt deposition. A carbon based organic layer under the electron beam assisted Pt has been observed. The mechanism and results on exposed oxide thickness measurements will be discussed. It is suggested that a carbon glue cap be used as a protective layer or polysilicon be deposited in line before submitting the wafer for TEM sample preparation and observation.