bluuebunny/crossref_metadata_2025_split huggingface dataset:
New Thin Adhesive for High Density 2.5D Heterogeneous Device Integration with Cu-Cu Hybrid Bonding
Authors: Kayaba Yasuhisa , Nakamura Yuzo , Kamada Jun , Kohmura Kazuo 
Published: December 2019

Abstract
Heterogeneous integration of logic, memory, and sensor chips on interposers (2.5D) has attracted a lot of attention as a candidate for More-than-Moore technology. For the high performance 2.5D devices, high density integration of chips with narrow spacing and high density interconnections with small pitch bonding electrodes are a key technology. In the current bonding technology, solder micro-bumps (&gt;20 μm in diameter) and non-conductive adhesives have been adopted. There may be some limitations for high density device integration with these technologies because of the protrusion of adhesives around the chips, the thermal sliding at the bonding, and the limit of solder micro-bump minimization. Hybrid bonding with a small Cu electrode (&lt;10 μm in diameter) is a strong candidate for improving advanced device integration technology.
Our goal is to develop a new adhesive which gives no protrusion, no thermal sliding, no voids, and high electrical reliability. A spin coating thin adhesive was therefore developed. The new adhesive can be cured at 200 °C. The cured adhesive film has no tackiness and has an optically flat surface. The adhesive film can be temporarily bondable to SiO2 at room temperature. After 200 °C baking, a permanent bonding can be achieved, and there is no degradation of bonding strength and no voids even after 400 °C of baking. For the applicability to the chip-on-wafer process, the adhesive film/Si wafer can be cut into chips by blade dicing without any delamination and without any apparent particles. After bonding the adhesive/Si chip to a bare Si wafer at room temperature, the thermal sliding amount after the thermal compression process (250 °C, 10 min, 1 MPa) was less than 1 μm (under the detection limit) according to optical microscopic measurements. In addition, there was no protrusion of adhesive around the chip corner from SEM. A first trial result for hybrid bonding is also reported.
Energy and Eco-Sustainability using Pressure-less Silver Sintering for RF Power Electronics
Authors: Hueners Evan A. , Hueners Richard D. , O' Sullivan Anthony D. F. , Zin M. Redzuan 
Published: December 2019

Abstract
Energy & Eco-Sustainability using Pressureless Silver Sintering for RF Power Electronics
A virtually void free die attach was successfully achieved using a fixed but critical volume of Ag sinter paste by a process of pressureless sintering on a multi-axis cartesian style bonder, retro-fitted with with a high-speed jetting dispenser. While this process potentially offered an ideal combination of cost-effectiveness, control and speed, it required the development of additional software protocols to secure the level of performance demanded of the dispenser to meet exacting technical requirements. This proprietary adaptation we term “Fixed BLT” software, and over five test pieces we were consistently able to deliver a fixed height bond-line of circa 70% of bond height, translating as 50 um before sinter and 30 um after. In each case the result was a virtually bond free void secured in a timely, repeatable, commercially effective manner. The absence of voids was verified through industry standard non-destructive analysis utilizing confocal scanning acoustic microscopy (CSAM).
High Temperature and High Reliability Performance of Electrically Conductive Film Adhesives for RF Grounding Applications
Authors: Zhao Yuan , Katze Doug , Wood John , Tolla Bruno , Yun Howard 
Published: December 2019

Abstract
Over the past decade, electronic parts have become smaller, more complex and higher functioning. This is well-understood for many products within the consumer and handheld markets. Miniaturization, however, is also impacting sectors such as aerospace and automotive, pushing the limits of already harsh environments. As more power is driven through active devices, the integrity of materials used to provide the electrically conductive interfaces is becoming increasingly critical. For many applications, adhesive films have been the preferred material because they offer a variety of performance and operational advantages such high electrical and thermal conductivity, uniform bondlines, superior adhesion and low processing temperatures. Today, though, as miniaturization pushes power-density limits and devices are also being exposed to high operating temperatures, even traditionally robust adhesive films are challenged to cope with these conditions. In sectors such as aerospace where high reliability is essential, material capability must evolve to deliver on fail-safe performance expectations. This paper will compare the performance of an established and widely used electrically conductive film adhesive with that of a newly developed film designed to provide improved mechanical performance over a higher elevated temperature range.
Can Electrolytic Capacitors Meet the Demands of High Reliability Applications?
Authors: Caswell Greg 
Published: December 2019

Abstract
Electrolytic capacitors have long been identified as a weak link for long term high reliability applications. However, capacitor manufacturers have made significant improvements to the materials and manufacturing processes to enhance their reliability. This paper will discuss those changes, provide insight into the various failure mechanisms for electrolytic capacitors and describe appropriate accelerated tests to validate performance.
We will take a deeper dive into the methodologies utilized to improve capacitor performance, e.g. foil purity and electrolyte volume. We will also discuss, from a reliability perspective, the impact of changing to a higher temperature electrolyte (from ethylene glycol to DMF, DMA and GBL) and also changes in the bung material (from butyl to EPDM).
There are several environmental factors involved in the aging of electrolytic capacitors. Electrolyte loss due to drying out and leakage current due to oxide degradation are thermally related as is the self-heating associated with ripple current. The impact of the applied voltage level is also a driver as it can cause leakage current increases as well. All of these issues result in a capacitance decrease, an increase in ESR, and a change to the dissipation factor. Many other failure mechanisms associated with manufacturing will also be discussed.
Laser Etching of Gold Conductors for RF Applications
Authors: Edwards Stephanie , Persons Ryan , Feltham Steve , Howerton Jeff , Lott Geoffrey , Macko Daniel 
Published: December 2019

Abstract
Thick film customers who require fine line resolution for their circuitry typically utilize wet chemical etching as a means to reduce conductor's lines and spaces when fine line definition cannot be reliably attained with screen printing alone. Wet chemical etching typically has the means to reduce conductor line widths from a printed definition of 3 mil (75 μm) to as low as 1 mil (25 μm) lines and spaces. The process of performing this chemical etching is time consuming and costly when factoring in the necessary process limitations.
With the issues presented by wet chemical etching, thick film customers are presented with a high process cost, yield loss due to the imaging process, and costly wastewater/environmental treatment regulations. Therefore, laser etching will be presented as an alternative method to wet chemical etching for various thick film conductor products.
For many years, specialized gold formulations have been etched using typical wet chemical etching processes. Standard and less costly conductor alloys that typically would not be suitable for wet chemical etching will be explored, possibly opening the doors for a wide variety of different applications which would benefit from utilizing this laser etching method. By being able to utilize different conductor alloys (Ag, Cu, etc.), laser etching offers alternative solutions for some of these applications with the added benefit of improved cost and increased throughput. As an example, wet chemical processing of silver conductors has proven to be very challenging in some cases due to the metal form-factor and specialized glasses required. By having the option of laser ablating the silver, a potentially advantageous and cost-effective option would now be possible.
Taking into account that laser etching of thick film conductors on ceramic is a relatively new method, this paper will concentrate on some of the opportunities/advantages it can offer. It will illustrate the boundaries of laser etching and how it compares to wet chemical etching while determining/comparing the impact on several properties including adhesion, signal propagation, line definition, and other important defining characteristics of the fired film in the final application.
Laser Sintering of Aerosol Jet Printed Interconnects on Flexible Substrate
Authors: Alhendi Mohammed , Cestarollo Ludovico , Khinda Gurvinder S. , Weerawarne Darshana L. , Poliks Mark D. 
Published: December 2019

Abstract
Laser sintering of interconnects printed on flexible substrate with silver nanoparticle ink is studied as an alternative to convection oven sintering. Interconnects of 80 μm and 250 μm line width are printed using an aerosol jet printer and sintered using an 830 nm continuous wave laser. A conductivity that is 4.5× higher than that of an oven sintered interconnect is achieved at optimal laser power and sintering speed set using a full factorial statistical design.
Package Voltage Regulators: The Answer for Power Management Challenges
Authors: Meyer Joseph , Moghimi Reza , Sturcken Noah 
Published: December 2019

Abstract
The generational scaling of CMOS device geometries, as predicted by Moore's law, has significantly outpaced advances in CMOS package and power electronics technology. The conduction of power to a high-performance integrated circuit (IC) die typically requires close to 50% of package and IC I/O and is increasing with trends towards lower supply voltages and higher power density that occur in advanced CMOS nodes. The disparity in scaling of logic, package, and I/O technology has created a significant bottleneck that has become a dominant constraint on computational performance. By performing power conversion and voltage regulation in-package, this limitation can be mitigated. Integration of thin-film ferromagnetic inductors with CMOS technology enables single-chip power converters to be co-packaged with processors, high bandwidth memory (HBM), and/or other modules. This paper highlights the advantages of fully integrated package voltage regulators (PVRs), which include: reducing package I/O allocated for power, eliminating the need for upstream power-conversion stages, and improving transient response. These benefits substantially reduce the size, weight, and power of modern electronic systems.
COMBINING ADVANTAGES OF RHEOMETRY AND INLINE VISCOMETRY FOR IMPROVED VISCOSITY MODELING
Authors: Strobelt Jonas , Bauer Joerg , Dreissigacker Marc , Hoelck Ole , Braun Tanja , Becker Karl-Friedrich , Schneider-Ramelow Martin , Lang Klaus-Dieter 
Published: December 2019

Abstract
In microelectronic packaging, encapsulation by compression and transfer molding is a crucial process block to ensure device reliability. Material properties of encapsulants, highly filled systems of reactive epoxy molding compounds (EMC), strongly depend on process conditions in a complex manner and vary over time. Shear-thinning behavior, as well as time- and temperature-dependent conversion strongly impact the viscosity of the polymer melt. In all fields of application, such as automotive or IoT, demands towards miniaturization, lifetime and environmental conditions increase. Thus, detailed understanding of the complex material behavior is of vital importance.
Typically, shear-thinning behavior of polymer melts is characterized using a conventional rheometer in oscillation mode under varying shear-rates and temperatures. Limitations of this approach are, that measurements at process temperature typically cannot be performed due to the high reactivity of the encapsulant at these temperatures (e.g. 175 °C for transfer molding). Therefore extrapolation to the correct temperature range is required. Furthermore, measurements in oscillation mode cannot necessarily be transferred to real process conditions, where a continuous flow is present.
To overcome these limitations the inline viscometer can be used, a specially designed measurement tool for a transfer molding machine developed by Fico/Besi. The polymer melt is pressed through a narrow slit under known volumetric flow at process temperature. By measuring the pressure difference before and after the slit, the viscosity can be calculated.
In order to better understand and also predict material behavior, inline viscosimetry is combined with rheometer measurements. This allows to maintain the advantages of conventional rheometry regarding material consumption and large shear-rate measuring range. At the same time, the inline approach provides relevant data under process conditions. The synthesis of both approaches yields a correction of the rheometer measurements, ultimately improving viscosity modeling and being an improved basis for process simulation.
Thin-film based passive RFID sensor tag for detection of packaged food volatiles
Authors: Karuppuswami Saranraj , Mondal Saikat , Kumar Deepak , Kaur Amanpreet , Chahal Premjeet 
Published: December 2019

Abstract
In this paper, a near-field wireless thin-film coated RFID compatible sensor tag is presented for profiling packaged food volatiles at room temperature. The sensor tag consists of a thin-film coated interdigitated capacitor interrogated in two different configurations: (i) direct-wired configuration, and (ii) wireless configuration. Polyaniline (PANi) is chosen as the thin film to be coated on the interdigitated capacitor due to its specificity towards packaged food, detection of Ammonia. The sensitivity of the sensor is characterized at room temperature and at atmospheric pressure. In the direct-wired configuration, different concentration of Ammonia gas is introduced into an enclosed chamber and the conductivity across the film is measured. In the wireless configuration, an inductor is soldered across the interdigitated capacitor to form an inductor-capacitor (LC) resonant tank. The resonance frequency is wirelessly interrogated using an external pick-up coil (reader coil) and the frequency shift is monitored. The proposed sensor can detect as low as 3 ppm of Ammonia making it a highly sensitive sensor, and it can be easily adapted to monitor packaged food quality across the supply chain.
Reliability analysis of bonding wire based on stacked substrate packaging structure
Authors: Zhang Chi , Tan Yifan , Huang Zhizhao , Chen Cai , Kang Yong 
Published: December 2019

Abstract
The stacked substrate packaging technology is a new 3D power loop structure utilizing multiple layer DBC to achieve ultra-low parasitic for the fast switching SiC device. This structure has a different geometry on interconnection between chips and substrate contrasting to the conventional module design, which needs optimization on the interconnection for the reliability consideration of this new structure. Analytical models of different bonding wire shapes and DBC structures were developed to calculate the von-mise stress on each model under thermal cycling simulation. The simulation results show that the stress on bonding wire reaches minimum when welding point located at the center of the top DBC substrate and the stress decreases when DBC top copper layer thickness increases or ceramic layer thickness decreases. Moreover, bonding wires with smaller diameter, certain peak height and width show lower stress and strain. Furthermore, thermal cycling tests were done on samples with same geometries of analytical models, and the wire pull test results showed consistency with the stress calculation results which verifying the optimum wire shape and DBC structure for the stacked substrate packaging.
An evaluation of medication appropriateness in pregnant women with coexisting illness in a tertiary care hospital
Authors: Moe Htet Wai , Sharma Sushil , Sharma A. K. 
Published: December 2019

Aim:
Prescribing drugs during pregnancy needs careful consideration of benefit to the mother and risk to the fetus. Therefore, this study was conducted to evaluate the appropriateness of medications among pregnant women with coexisting illness in a tertiary care hospital, Western India.

Materials and Methods:
It was a hospital-based cross-sectional study conducted in the obstetrics and gynecology department of a tertiary care hospital. The study was conducted over a period of 12 months wherein data from 800 pregnant women suffering from any co-existing illness and being prescribed any medication apart from routine supplementation were analyzed. The Medication Appropriateness Index (MAI) was used to assess the appropriateness of medications. Higher MAI scores indicate more inappropriate prescribing.

Results:
Drugs which were most inappropriately prescribed with the highest average MAI scores were albendazole, itraconazole, injection amikacin, oxcarbazepine, warfarin, domperidone, propylthiouracil, and combiflam (ibuprofen + paracetamol). Diseases with the highest average MAI scores were anemia, Grave's disease, umbilical hernia, urinary tract infection, urticaria, allergic rhinitis, and preeclampsia. The MAI criteria which had the highest percentage of inappropriately prescribed medications were “cost of drugs,” “duration of therapy,” and “indication.”

Conclusion:
Potentially inappropriate prescribing was seen in the study with some of the common coexisting illness being treated with drugs which fared poorly on the MAI. The study has also highlighted areas in drug prescribing where scope for improvement exists. Further, it can act as a benchmark for comparison of future studies to evaluate medication appropriateness in pregnant women.
An evaluation of trigger tool method for adverse drug reaction monitoring at a tertiary care teaching hospital
Authors: Menat Urmila , Desai Chetna K. , Panchal Jigar R. , Shah Asha N. 
Published: December 2019

Objectives:
The objective of this study is to evaluate the trigger tool method (TTM) in detection, monitoring, and reporting of adverse drug reactions (ADRs) at Civil Hospital Ahmedabad, India.

Materials and Methods:
A prospective, single-center, observational cum intervention study was conducted in two phases in the Department of Medicine over 15 months. In phase I, preliminary trigger tool list (PTTL) comprising 55 triggers was evaluated by pharmacologist in terms of detection of ADR in 400 patients and then, modified trigger tool list (MTTL) was prepared. In Phase II, the TTM using MTTL was compared with the spontaneous method of ADR monitoring after educational interventions in resident doctors of the two units of medicine department.

Results:
Of the 55 triggers in PTTL, 34 triggers were observed in 327 patients, of which 19 triggers lead to the detection of 66 ADRs. The rate of ADEs was 16.5%/100 patients. Positive predictive value (PPV) of each trigger ranged from 0% to 100%. PPV for drug trigger, laboratory trigger, and PT was 14.4%, 4.5%, and 23.3%, respectively. Overall, PPV of PTTL was 19.27%. Sensitivity and specificity were 100% and 21.66%, respectively. MTTL consists of these 19 triggers. In Phase II, resident doctors reported 16 ADRs, using spontaneous method and 23 ADRs using MTTL. The rate of ADEs per 100 patients was 1.63 and 2.13, respectively, with these methods. A total of 105 ADRs were reported during both phases.

Conclusion:
TTM is an effective method of ADR reporting if it is utilized by a trained person. This method could be used as add-on method to spontaneous method to improve ADR reporting.
Development and validation of patient information leaflet for coronary heart disease patients
Authors: Vinay B. C. , Shastry C. S. , Kodangala Subramanyam , Mateti Uday Venkat , Bhat Krishna 
Published: December 2019

Background:
Patient information leaflets (PILs) are effectively used to improve the patient's knowledge about medications, disease, diet, and lifestyle modifications.

Aim:
This study aims to develop and evaluate PILs for coronary heart disease patients.

Materials and Methods:
Primary, secondary, and tertiary resources were used to develop PILs. The developed PILs were validated by four doctors, four academic pharmacists, and one dietician. PILs design and layout was prepared using barker able leaflet design (BALD) criteria. PILs readability was assessed using the Flesch Reading Ease test (FRE), Flesch–Kincaid Grade Level (FKGL), and user readability methods. User opinion on PILs content and design was obtained from patients.

Results:
The FRE and FKGL readability scores were 61.5 and 7.4, respectively. The BALD criteria scores for English, Kannada, and Malayalam PILs were 28, 27, and 26, respectively. The overall user testing readability means scores had significantly improved from 45 to 79.30. Nearly 82.55% of patients rated the PILs as good design and content.

Conclusion:
The developed leaflet met the standard criteria for easy reading and comprehension. The majority of the patients gave good opinion on the content and design of the PILs.
Laramide Uplift near the Ray and Resolution Porphyry Copper Deposits, Southeastern Arizona: Insights into Regional Shortening Style, Magnitude of Uplift, and Implications for Exploration
Authors: Favorito Daniel A. , Seedorff Eric 
Published: December 2019

AbstractThis study integrates new geologic mapping and structural analysis with previous work near Walnut Canyon and Telegraph Canyon to address the style and magnitude of shortening and the relationship between contractional structures and porphyry preservation and localization between the Ray and Resolution porphyry copper deposits. Cenozoic extensional structures were superimposed on earlier contractional structures formed during the Laramide orogeny, which dates from ~80 to 50 Ma. This superposition requires that Cenozoic normal faults be restored prior to analysis of Laramide contractional structures and their relationship to nearby porphyry copper deposits. Five distinct sets of normal faults within the study area progressively tilted the region 65° east. The amount of extension was 10.3 km or 276%. Using key constraints such as offset strata, cutoff angles between faults and various units, and Laramide fault geometries, the study area was structurally reconstructed and verified using 2-D kinematic modeling of reverse fault offset and related folding. Total shortening is 7.2 km or 98%. Laramide reverse faults are interpreted as thick-skinned basement-cored uplifts, because they restore to moderate angles, have related fault-propagation folds, and involve significant crystalline basement rock. The Telegraph Canyon reverse fault has at least 5.3 km of offset, and the Walnut Canyon reverse fault has 3.2 km. The preferred estimate of the total vertical uplift for the fault system is 5.2 km but could be several kilometers greater. The restored strike direction of these faults combined with mid-Cenozoic erosion surfaces throughout the region suggests that this fault system may be responsible for the Laramide uplift of the Tortilla Mountains and Black Hills. In addition, most major porphyry centers appear to have been intruded into the footwall of this large uplift, with local examples including Ray and Resolution, suggesting that topography generated from this uplift may have been critical to preservation of these ore systems. Though definitive crosscutting relationships do not exist in the immediate map area, geologic relationships in a broader area suggest that shortening here began after 74 Ma and, in the Ray area, had ended by ~69 Ma and that porphyry formation postdated reverse faulting by as much as 5 m.y. to as little as &lt;1 m.y.