bluuebunny/crossref_metadata_2025_split huggingface dataset:
Trace Fusing Current Simulation in the Redistribution Layer of Wafer Level Packages
Authors: Whitchurch Nathan , Ju JeongMin , Yoon JiYeon , Sohn EunSook , Park KyungRok 
Published: February 2025

This paper uses fusing current data measured from experiments to develop and validate a simulation method in Ansys Mechanical 2022 R1 finite element analysis (FEA) to study fusing current in redistribution layer (RDL) traces on a silicon die. Fusing current was evaluated for several similar trace designs for a range of trace cross-sectional areas and lengths on multiple thicknesses of silicon. Resistances in the experiment were measured by a four-point measurement technique and compared with the nominal resistance over the temperature range as predicted from literature material properties. Two models were created to demonstrate the simulation approach. First, a model was made to test the fusing current for several lengths and diameters of wire in still air. The model showed only slight (<5%) variation between measured fusing current and simulated fusing current. This simple scenario gives confidence that the simulation approach is valid. Using the combination of transient heating of the wire from a ramped electric current with convection and radiation, the heat balance of the system can reliably simulate fusing current across a wider variety of systems when the surrounding thermal system is included in the model. The second model was a representation of the Wafer Level Chip Scale Package (WLCSP) with RDL on silicon. The trace geometry and system were modeled, and current was ramped over time across the circuit until the melting point of copper was reached and the trace was considered to have melted and fused. Some variations were observed between measurement and simulation, with thicker silicon showing more capacity to absorb the heating of the trace than in real-world measurements. Overall, simulation aligned well with measurements, with simulation results being between 4 to 14% of the measured fusing current value. The simulation approach appears appropriate to generalize to additional electronics packaging scenarios. Note that dielectrics
High Performance mmWave Ribbon Bonding using 1x20 mil Gold Ribbon
Authors: Rasmussen David J. 
Published: February 2025

With the current trend to higher power and higher frequency used in mmWave (and microwave) applications there is a need to improve the performance of the interconnects. We all know that at higher frequency the skin effect of the interconnect is the primary mode. We have therefore been utilizing ribbon bonding for these interconnects where the skin area of a ribbon wire is much larger on a ribbon than a similar cross-sectional conductor area round wire. We have been using 0.5x2 for many of our small bond pad applications. For the higher power requirements, we have gone to 1x10 mil gold ribbon which represents an upper limit for most fine wire thermosonic wedge bonders on the market. Going to a larger ribbon does have significant advantage for even higher power use. I have developed a process with the help of Deweyl Tool and TPT Wire Bonders to utilize 1x20 mil gold ribbon which has significantly larger skin area (~42 mil^2) than the ~5.4mil equivalent round wire (~15.8 mil^2) or even 2x10 mil ribbons (24 mil^2). The benefits of a single 1x20 ribbon over two 1x10 mil ribbons is fewer points of failure, narrower bond pad requirements, and consistent loop shapes.
Substrate Warpage Study for Heterogeneous Packages
Authors: Jung Hoon , Miller Drake , Jung GookJin 
Published: February 2025

Warpage formation in semiconductor packages is generally known to occur from coefficient of thermal expansion (CTE) mismatches between multilayered materials with different properties. The different properties of each printed circuit board (PCB) layer will yield different expansion rates, which will lead to significant high warpage formation under the reflow temperature. The presence of significant warpage will further induce opened solder joint risks, solder joint collapse for flip chip ball grid arrays (FCBGAs) and so on. Package warpage is an important factor that impacts board assembly yield, delamination, solder joint fatigue reliability, and other thermal stress issues. Reducing warpage is a primary concern when trying to enhance the service life of a package. For years the IC industry has been driven by Moore’s Law assumption that the functionality that fits on a single die will double every 18 to 24 months. As minimum dimensions have shrunk from 14 to 10nm and now toward ~3nm, it could be assumed that die size should shrink accordingly. However, with network applications, this assumption has been disproven. For modern FCBGAs, the scale of die and package for networking applications are increasing dramatically. The metal heatsink not only provides thermal emission out of the package but also manages the warpage of a large FCBGA. A large (72 x 72 mm test vehicle) FCBGA is package level reliability (PLR) qualified with a rigid and heavier heat sink. However, when the package is mounted to a PCB, the BGA solder balls melt during reflow since they are not able to uphold the heavier package. This results in low standoff height and solder bridging because the balls flow and connect to adjacent ones. The deviation from Moore’s law and the addition of heatsinks to networking packages, along with other heterogeneously integrated technologies, have a significant impact on system-level warpage. Various package design strategies are discussed in this paper that can be included to control these new sources of warpage.
Ultra-High Density RDL on Glass Core Substrate for Heterogenous Integration
Authors: Takano Takamasa , Kuramochi Satoru , Tanaka Masaya 
Published: February 2025

As the industry moves toward high-performance computing (HPC) for huge data transmission with low power consumption. The requirements for advanced package (PKG) structures have become more challenging. The major engineering requirements for HPC application are high-density, high-speed data transmission, low loss, precision manufacturing with low-cost process. High pin counts need large area package with high mechanical stability and low warpage. The demand for high density and high-speed data transmission becomes strong need for leading edge semiconductor packaging. 2.5D and 3D heterogenous package realize this solution. On the 2.5D heterogenous package structure, high interconnect density with fine line wiring layers providing high speed transmission is required to-connect CPU chips or chiplet arrays and HBM chip stacks. Silicon interposers with through silicon vias (TSVs) have scaled to meet this demand, but face three major barriers: high electrical loss, package size and cost. On the other hand, glass has many properties that make it an ideal core material for advanced substrates such as ultra-low loss tangent, adjustable thermal expansion (CTE), mechanical stability and manufacturability with large panel formats. This paper presents the demonstration of Glass core substrate with fine line redistribution layers (RDL). Glass core substrate with fine pitch metalized through glass vias (TGV) and fabricate RDL with low loss dielectrics. In case of Glass core substrate, three TGV copper metalized processes were compared for process capability, -reliability and high-speed transmission characteristics. Copper metallization provides low resistance, high transmission rate and high-power density. The reliability test results show stable resistance data because of combination of double-sided polymer dielectrics. The double-sided polymer dielectrics providing stress buffer for glass and copper CTE differences. TGVs filled with Cu by three methods were demonstrated with large panel size format max 550x650mm.The ultra-high density RDL process using non-organic protective layer fabricated on the glass substrate. High aspect ratio Cu traces enable to minimum 3um pitch, high transmission rate and high reliability. We also compare high speed transmission characteristics with TGV and transmission trace with multi-layer RDL on panel level format. Finally, we compare the transmission characteristics using eye diagram for heterogenous integration application.
Pushing the Limits of Miniaturization in Microelectronic Packaging via the Application of Ultra-Thin Micro Dam Structures
Authors: Schirmer Patrick , Ringelstetter Severin , Tai Kian Chong , Azfar Muizzuddin 
Published: February 2025

The ever-increasing demand for miniaturization in semiconductor and microelectronic packaging is pushing the limits of what is feasible. On the design side, limitations such as space for keep-out zones (e.g. space for the fillet or the dispensing area of an underfill) and the potential flow of encapsulation compounds should not be overlooked in order to avoid contamination of surrounding components. In addition, optical barriers in sensors can often only be achieved using mold structures or by placing barriers (e.g. caps). It is generally preferred that these barriers are narrower and flatter, but this is often limited due to manufacturing reasons. With line widths of 100 μm and less combined with aspect ratios of above 5, DELO Industrial Adhesives, in cooperation with micro dispensing equipment manufacturer NSW Automation, has succeeded in developing a micro dam that creates new possibilities in the field of heterogeneous integration and optical packaging. High dispensing speeds and curing via UV light or heat also make the application process more flexible. Almost limitless designs of free-form structures are thus now possible and completely new package designs can be realized.
Ultra-Precise Dispensing in 3D Packaging: A Seamless Shift from R&D to Production
Authors: Szczotka Nina , Motyka Aleksandra , Chudzyńska Aleksandra , Łysień Mateusz , Perczyńska Aleksandra , Szczurek Anna , Witczak Łukasz , Kowalczewski Piotr , Wiatrowska Aneta 
Published: February 2025

Additive manufacturing (AM) opens up a world of possibilities for creating next-generation electronics. However, employing AM technologies in microfabrication presents its own unique set of challenges. The ongoing trend towards miniaturization necessitates the printing of ultra-thin, high-density conductive interconnections in 3D packages and heterogeneous systems. In the presentation, we will showcase how the innovative technology of Ultra-Precise Dispensing (UPD) effectively addresses these challenges, how this microfabrication process is already used in advanced R&D and prototyping projects, and our current approach towards the use of the UPD approach in large-scale manufacturing.
To compare the efficacy of three techniques in reducing etomidate-induced myoclonus - A randomised controlled trial
Authors: Rao Ridhi , Rajappa Geetha , Sandhya B K , Srinidhi H S , Pagadala Teja , Likitha S 
Published: February 2025

Background and Aims:
Etomidate is the preferred induction agent in haemodynamically unstable patients. Preventing etomidate-induced myoclonus (EIM) is important. The objective of this study was to compare the efficacy of three techniques of etomidate administration in preventing EIM.

Methods:
This randomised, controlled study included 296 patients. General anaesthesia (GA) was induced with etomidate as per the randomly allocated groups: control (C), priming (P), slow (S), and priming with slow injection (T). The incidence, time of onset, and grade of myoclonus were noted. The grade of pain on injection and the effect on various haemodynamic parameters were noted. The Kruskal-Wallis, Fisher’s exact, and Chi-square tests were used for statistical analysis. P < 0.05 was considered to be statistically significant.

Results:
The study shows that the incidence of myoclonus was highest amongst Group C (73.0%), followed by Group P (52.7%), Group S (48.6%), and Group T (37.8%) (P = 0.001). Priming with a slow technique was most effective in preventing EIM and lowering the intensity of myoclonus. The incidence of grade 3 myoclonus was 5 (6.76%) in Group T when compared to 39 (52.7%) in Group C (mean difference [MD] =36.96, 95% CI: 7.45, 55.94; P = 0.0001).

Conclusion:
We observed that the priming and slow injection techniques were similar in reducing the incidence of EIM. However, the combination of priming and slow technique was the most effective.
Primary intraosseous malignant peripheral nerve sheath tumor of clavicle: Report of a rare entity
Authors: Hegde Prateek , Janu Amit , Rekhi Bharat , Gulia Ashish , Puri Ajay 
Published: February 2025

Abstract
Malignant peripheral nerve sheath tumors (MPNST) are mesenchymal tumors that develop or differentiate from cells of the peripheral nerve sheath. Intraosseous MPNST is extremely uncommon and usually results from secondary invasion. A 17-year-old male presented with pain and swelling over the left collar bone. Imaging revealed an expansile lytic lesion involving the subarticular region of the clavicle with a cortical break and infiltration of the adjacent soft tissues. Biopsy findings were consistent with cellular nerve sheath tumor with significant atypia and mitoses, along with S100 protein immunopositivity indicative of MPNST. The patient was treated with neoadjuvant radiotherapy, followed by wide local excision. To the best of our knowledge, the present case constitutes the first case of a primary intraosseous MPNST involving the clavicle. The case is presented in view of its rarity and with relevant review.
Esophageal mixed or collision small cell-squamous cell carcinoma: Report of 6 cases and review of the literature
Authors: Sun Huajun , Shi Yanfen , Liang Dongni , Liu Juan , Xu Gang , Yang Xudan 
Published: February 2025

Abstract

Background:
Esophageal mixed neuroendocrine-nonneuroendocrine neoplasms (MiNENs) are now known as a neuroendocrine component mixed with a nonneuroendocrine component in a single neoplasm, one of which is in the form of mixed small cell-squamous cell carcinoma. Collision tumors have been excluded from the category of MiNENs, but difference between mixed and collision small cell-squamous cell carcinoma has never been reported.

Methods:
We collected six cases and reviewed 11 cases of mixed or collision small cell-squamous cell carcinoma (MCSSC); the data from 17 cases of MCSSC were analyzed to observe their clinicopathological features.

Results:
Most of the MCSSC patients were middle-aged and elderly, with more men than women, and most of the tumors occurred in the middle and lower esophagus. We found that in mixed cancers, the metastases were a mixture of squamous cell carcinoma and small cell carcinoma, whereas metastatic foci in collisional tumors showed simple cancer components; this phenomenon has never been reported before. Mixed cancers account for a higher proportion of small cell carcinomas, a higher pathological stage, and a worse prognosis than collisional cancers. PD-L1 (22C3) was negative in both squamous cell carcinoma and small cell carcinoma regions (<1%).

Conclusions:
Mixed and collisional small cell-squamous cell carcinomas are essentially distinct tumors. In the clinical diagnostic of MCSSC, the tumor should be clearly identified as mixed or collisional carcinoma to guide the clinical treatment and prognosis more accurately.
Association between TI-RADS ultrasound categories and BETHESDA cytology categories of thyroid lesions
Authors: Kumari Sonia , Suresh Turuvekere Narayanrao , Sakalecha Anil K. , Azeem Mohiyuddin S. M. 
Published: February 2025

Abstract

Background:
Ultrasound and cytology are the two major diagnostic modalities employed for the preoperative evaluation of thyroid lesions. Ultrasound thyroid imaging reporting and data systems (TI-RADS) have been proposed for risk stratification of thyroid nodules. The Bethesda system for reporting thyroid cytopathology (TBSRTC) by using six diagnostic categories with a stratified risk of malignancy (ROM) in each category is employed for unambiguous cytology reporting of thyroid lesions. Our objective is to study the association between TI-RADS ultrasound categories and Bethesda cytology categories in thyroid lesions and to find their diagnostic accuracy as compared with histopathological diagnosis wherever possible.

Methods:
This is a prospective observational study in which a total of 107 patients were studied. Thyroid ultrasound was scored according to TI-RADS classification. A pathologist screened ultrasound-guided FNAC smear, and reporting was done using the Bethesda system of reporting. The pathologist was blinded for the TI-RADS report.

Results:
Among all the 107 cases, the patients’ age ranged from 8 to 70 years with a mean age of 41.67 ± 14.41 years. The men: women ratio was 1:5. The sensitivity, specificity, positive predictive value (PPV), and negative predictive value (NPV) of TI-RADS were 50%, 95.24%, 88.89%, and 71.43%, respectively, with a diagnostic accuracy of 75.68%, while the sensitivity, specificity, positive predictive value (PPV), and negative predictive value (NPV) of Bethesda were 81.25%, 85.71%, 81. 25%, and 85.71%, respectively, as compared with the histopathological diagnosis. TI-RADS ultrasound categories and Bethesda cytology categories were correlated in 88% of cases.

Conclusions:
TI-RADS and TBSRTC classification systems are specific diagnostic modalities in thyroid lesions. They are correlated in the majority of cases.
Inactive Escherichia coli causing perianal abscess
Authors: Watwe Smita Anand , Das Nikunja Kumar , Chate Sadhana , Mukhida Sahjid 
Published: February 2025

Abstract

Escherichia coli is a common organism, and its several variants, like inactive, can cause severe human infection, which is difficult to identify in the microbiology laboratory. We present a perianal abscess case report in which we got nonlactose fermenting, nonmotile biochemically inactive bacterial growth. It was not identified by conventional biochemical methods. Final diagnosis of E. coli was done by the automated system and antibiotic treatment was suggested as per the antibiotic susceptibility testing by conventional as well as automated methods. It was found susceptible to amoxicillin–clavulanic acid, piperacillin–tazobactam, and meropenem. The patient was treated with piperacillin–tazobactam combination and get recovered. Inactive E. coli differs from typical E. coli based on motility testing and lactose fermentation. However, other biochemical test results are similar to typical E. coli.
Presentation Pattern and Management of Posner–Schlossman Syndrome: Experience from a Tertiary Health Facility in Sub-Saharan Africa
Authors: Sarimiye Tarela Frederick 
Published: February 2025

Abstract

Purpose:
The purpose of the study was to present the demographics, clinical profile and management of PSS at a tertiary hospital in sub-Saharan Africa.

Patients and Methods:
A review of the hospital files of consecutive patients diagnosed with Posner–Schlossman syndrome (PSS) between January 2017 and May 2022 was made. The data analysed included sociodemographic characteristics, clinical profile, time to intraocular pressure (IOP) control and inflammation resolution–recurrence of inflammation and factors associated with recurrence, secondary glaucoma and associated factors.

Results:
Fifteen eyes of 15 patients were analysed with a mean age of 34.67 ± 14.01 years. Eight (53.3%) patients’ ages ranged between 30 and 50 years, with common presenting symptoms being ocular ache 66.7% and blurry vision 53.3%. The mean IOP at presentation was 45.93 ± 8.88 mmHg, with a range of 28 mmHg and 62 mmHg. The mean duration for IOP control was achieved at 5.13 ± 4.0 days, on 2.53 ± 0.64 antiglaucoma medications. Anterior chamber inflammation at presentation was Trace (Grade 0.5) in 5 (33.3%) eyes and Grade 1 in 10 (66.7%) eyes, 14 eyes were placed on 0.1% dexamethasone and one eye was on 0.1% nepafenac as anti-inflammatory. Four (26.7%) eyes recorded PSS recurrence, three eyes once and the fourth eye recorded three episodes. Four (26.7%) eyes also developed secondary glaucoma of which three out of them were in the PSS recurrence subset.

Conclusion:
The findings showed that GSS is more common in our population’s third and fourth decades of life and the development of glaucoma is not uncommon.
Evaluation of an Ultrasonic Bone Scalpel Device for Atraumatic Bone Cuts in Orthognathic Surgery – A Clinical Study
Authors: Devi Vuyyuru Vidya , Ramanathan Manikandhan , Ponvel Keerthana , Parameswaran Anantanarayanan 
Published: February 2025

Abstract

Objectives:
This clinical study evaluates the feasibility and effectiveness of orthognathic osteotomy using an ultrasonic bone scalpel, focusing on operation time, postoperative soft-tissue edema, and nerve injury and recovery.

Materials and Methods:
The study involved 7 adult patients who underwent bilateral sagittal split osteotomy (BSSO) advancement or setback with or without Le Fort I orthognathic surgery, correction of skeletal malocclusions, normal hemoglobin levels, and an INR <1.5. Patients aged 16–22 years with a mean age of 19 years were included, and consent was obtained for equipment, photographic, and radiological data use. The study evaluated intraoperative parameters such as surgery duration, blood loss, cut precision, and nerve manipulation. Postoperative evaluations were conducted at the end of the 1st and 2nd months, assessing pain, edema, and paresthesia. Complications such as postoperative bleeding, edema, and soft-tissue damage were noted.

Results:
The average operating time was 248.5 min, with an average blood loss of 128.34 mL. Nerve manipulation was recorded during BSSO separation, with 42.85% encountering the nerve at 6 sites. The neurosensory disturbance was noted in 4 of 14 sites, and nerve function improved by 2 months postoperatively. Postoperative complications included oroantral fistula, postoperative bleeding, and a bad split during a BSSO osteotomy.

Conclusion:
Ultrasonic bone scalpel is a viable alternative for orthognathic osteotomies, reducing blood loss, operative time, and nerve injury, but proficiency is crucial to prevent complications.
On commutators of square-zero Hilbert space operators
Authors: Marcoux Laurent W. , Radjavi Heydar , Zhang Yuanhang 
Published: February 2025

Abstract
Let

$\mathcal H$

be a complex, separable Hilbert space, and set . When

$\dim \, \mathcal H$

is finite, we characterise the set and its norm-closure . In the infinite-dimensional setting, we characterise the intersection of with the set of biquasitriangular operators, and we exhibit an index obstruction to belonging to .
Оценка маркетинговой стратегии развития территории в муниципальном образовании город Краснодар
Authors: Яковлева М.А. , Булгаров М.А. 
Published: February 2025

Главной задачей городского маркетинга является социально-пространственная идентификация. Необходимо выявить отличительные качества муниципального образования, которые способны выделить территорию среди своих конкурентов, делая данный город уникальным. Важно такое позиционирование города, чтобы у целевых групп складывалось непротиворечивое представление о муниципалитете и доверие к нему. Маркетинговая стратегия позволяет укрепить конкурентные преимущества региона, а также повысить инвестиционную привлекательность территории.
The main task of urban marketing is socio-spatial identification. It is necessary to identify the distinctive qualities of a municipality that can distinguish the territory from its competitors, making this city unique. It is important to position the city so that target groups develop a consistent, trusting image of the municipality. The marketing strategy allows us to strengthen the competitive advantages of the region, as well as increase the investment attractiveness of the territory.