bluuebunny/crossref_metadata_2025_split huggingface dataset:
Combining Physiology and Transcriptome to Reveal Mechanisms of Hosta ‘Golden Cadet’ in Response to Alkali Stress
Authors: Sun Xiaogang , Zhu Chunyao , Li Baizhou , Ning Wei , Yin Jiahui 
Published: February 2025

As an ornamentally and medicinally worthy plant, Hosta plantaginea (Lam.) Aschers. has the adapted capacity to survive cold temperate monsoon climates in Northeastern China. However, its use is limited by the soil alkalization of urban gardens. Our pre-experiment found that Hosta ‘Golden Cadet’ has the potential to be alkali-tolerant. Hence, tissue-cultured seedlings of Hosta ‘Golden Cadet’ were used as experimental material. Its related growth, physiology, and transcripts were examined to reveal the molecular mechanism of Hosta plantaginea in response to alkali stress. The results show that the development of Hosta ‘Golden Cadet’ was affected by alkali stress. In comparison with the control, malondialdehyde (MDA) content increased by 4.28-fold at the 24th hour, superoxide dismutase (SOD) activity increased by 49% at the 6th hour, and peroxidase (POD) activity and soluble sugar (SS) content increased by 67% and 30% at the 12th hour, respectively. The RNA-seq analysis revealed that Hosta ‘Golden Cadet’ gene expressions at 0 h, 6 h, 12 h, 21 h and 48 h differed after 200 mmol/L NaHCO3 treatment. During 48 h under alkali stress, 2366 differentially expressed genes were found. The transcription factors MYB, AP2/ERF, and WRKY were activated in differentially expressed genes. The KEGG analysis found that phytohormone signaling pathways, starch and sucrose metabolism, and phenylpropane production were activated in Hosta ‘Golden Cadet’ in response to alkali stress. In summary, Hosta ‘Golden Cadet’ can reduce membrane damage by improving osmoregulation and antioxidant capacity, increase sucrose and starch metabolism, and regulate phenylpropane biosynthesis by activating transcription factors and inducing related phytohormone signaling, mitigating the effects of alkali toxicity. These findings guide an investigation into the mechanism of alkali tolerance in Hosta plants, screening alkali tolerance genes, and selecting and breeding novel alkali-tolerant Hosta plantaginea cultivars.
O uso da Inteligência Artificial no tratamento de pacientes com danos neurológicos severos: uma revisão integrativa de literatura
Authors: Damasceno Evelyn Ravena Rodrigues 
Published: February 2025

O artigo aborda o uso da inteligência artificial (IA) no tratamento de pacientes com danos neurológicos, com ênfase em diagnósticos mais precisos e tratamentos personalizadas par condições complexas. O objetivo é explorar como a IA contribui para aprimoramento o atendimento neurológico, desde o diagnostico até o acompanhamento de doenças como Alzheimer e Parkinson. A metodologia envolve uma revisão integrativa de literatura como seleção de artigos de 2019 a 2024 em base de dados como Scielo, PubMed e BVS, focando no impacto da IA na neurologia. No desenvolvimento, o estudo analisa os avanços da IA em identificar padrões complexos em dados clínicos e de imagem, apoiando diagnósticos mais rápidos e detalhados. Os resultados indicam que a IA auxilia médicos na interpretação de exames, permitindo tratamentos mais eficazes e personalizados. A pesquisa destaca ainda a relevância de ampliar estudos para integrar dados de variadas fontes e desenvolver tecnologias de IA acessíveis, aumentando seu uso em contextos com menos recursos.
Pemodelan Prediksi Umpan Pulverized Coal pada Sistem Rotary Kiln Pabrik Semen Berdasarkan Parameter Operasi & Kimia Berbasis Machine Learning
Authors: Maliki Riduwan 
Published: February 2025

Penelitian ini bertujuan untuk mengembangkan model prediksi umpan pulverized coal (PC) pada sistem rotary kiln di pabrik semen menggunakan algoritma machine learning. Model ini diharapkan dapat membantu operator Control Center Room (CCR) dalam mengoptimalkan konsumsi PC dan meningkatkan efisiensi produksi semen. Industri semen di Indonesia mengalami persaingan ketat dan tuntutan efisiensi operasional akibat kenaikan biaya energi. Konsumsi PC merupakan salah satu komponen biaya terbesar dalam produksi semen, dengan potensi optimasi yang signifikan. Penelitian ini berfokus pada tiga pertanyaan utama, yaitu 1.) membangun model prediksi umpan PC berbasis machine learning pada rotary kiln dengan memanfaatkan data parameter operasi, dan sifat kimia bahan baku dan produk; 2.) menentukan algoritma machine learning yang paling akurat dalam memprediksi nilai umpan PC pada rotary kiln; 3.) menentukan faktor apa yang paling signifikan dalam mempengaruhi nilai umpan PC pada rotary kiln. Penelitian ini diharapkan menghasilkan model prediksi PC yang akurat dan handal, serta mengidentifikasi faktor-faktor kunci yang mempengaruhi konsumsi PC. Hasil penelitian menunjukkan bahwa algoritma Gradient Boosting memberikan akurasi terbaik dengan nilai R-squared sebesar 0.976. Model yang dikembangkan mampu memprediksi nilai umpan yang lebih rendah dibandingkan dengan pengaturan manual oleh operator. Implikasi dari hasil ini adalah potensi penghematan penggunaan batubara dan pengurangan emisi CO2 dalam proses produksi semen.
Pemahaman Peer Group Sebagai Kader Kesehatan dalam Mengantisipasi Perilaku Remaja Merokok di Desa Bijiruyung Sempor Kebumen
Authors: Marsito Marsito , Fajar Agung Nugroho  , Muhammad As Ad  
Published: February 2025

ABSTRAK
Hasil Rakerda 2013 menunjukkan hasil bahwa remaja merokok usia 15-19 tahun.Peer group sebagai kader kesehatan remaja bisa menjadi model bimbingan teman sebaya untuk mengendalikan dan mendisiplinkan remaja berperilaku sehat tidak merokok Arif Rachman, 2015. Dengan kelompok sebaya remaja dalam wadah peer group bisa menjadi kegiatan yang positif dan bisa menjadi contoh yang lain. Tujuannya untuk melihat pemahaman peer group tentang informasi, pemahaman media pembelajaran rokok dan emosional pengendalian rokok. sebagai kader kesehatan dalam menglakukan antisipasi perilaku remaja merokok di Desa Bijiruyung Sempor Kebumen. Metode penelitian menggunakan diskreptif analitik pendekaatan evaluasional menggambarkan pemahaman remaja sebagai peer group sebagai fungsinya terkait dengan merokok. Sampelnya remaja yang tidak merokok dan mau menjadi sampel dalam penelitian ini yang berjumlah 49 orang. Dari hasil penelitian menunjukkan hasil informasi kader kesehatan remaja dikategorikan cukup ada 24 orang (49%), dan untuk pengendalian emosional rokok tergolong cukup 31 orang (63,3%). Hasil semua dikategorikan masih cukup baik informasi, media pembelajaran dan pengendlian emosional rokok bagi remaja hasilnya cukup. Hasil cukup ini menunjukkan bahwa remaja itu banyak pertimbangan dan pemikiran yang lebih jauh sehingga menunjukkan seperti hal tersebut. Hal ini remaja perlu di lakukan tindakan bimbingan dan arahan kaarena remaja lebih banyak bergaul dengan dunia luar yang menjadikan mudah terpengaruh. Oleh karena itu saran agar remaja perlu banyak dilakukan edukasi dan bimbingan baik melalui keluarga dan kelompok seperti peer group sebagai kader kesehatan remaja. Selain itu remaja perlu dilakukan pengabdian masyarakat agar remaja terpapar dan mengerti bahaya rokok.

Kata Kunci : peer grup, kader kesehatan, prilaku remaja merokok.
A Gambaran Persepsi Masyarakat Terhadap Vaksinasi Covid-19 Di Wilayah Kerja Puskesmas Harapan Raya
Authors: Halilintar Muhammad Anhsari , Erianti Susi , Mayang Sari Siska 
Published: February 2025

Abstrak
Pandemi COVID-19 telah mengancam kesehatan nyawa manusia terkhususnya bagi wilayah Kota Pekanbaru, sehingga program vaksinasi menjadi cara terakhir dan masih terus dilakukan dalam upaya penanggulangannya. Adanya stimulus terkait vaksinasi COVID-19, menimbulkan berbagai respon perilaku dan persepsi masyarakat, baik itu persepsi positif maupun persepsi negatif. Penelitian ini bertujuan untuk mengetahui gambaran persepsi masyarakat terhadap vaksin COVID-19 di Wilayah Kerja Puskesmas Harapan Raya. Metode penelitian adalah kuantitatif dengan desain deskriptif, untuk teknik sampling menggunakan aksidental pada 172 responden dengan instrument kuesioner. Analisa data pada penelitian ini adalah univariat. Hasil penelitian menunjukan 87 responden (50,6%), lebih dominan memiliki persepsi negatif, dengan berbagai alasan dan tingkat keraguan responden, (51,2%) responden masih meragukan vaksin jenis mati (inaktif) memiliki reaksi yang berat dibandingkan vaksin jenis lainnya, (43,0%) responden menjawab vaksin tidak bisa melawan lebih dari satu virus, dan (37,8%) responden meraguan vaksin COVID-19 melindungi seseorang dalam jangka waktu yang lama. (37,2%) responden menyatakan keraguan vaksin jauh lebih berat ketimbang risiko akibat seseorang tidak memilih divaksin COVID-19. Hal ini mengindikasikan bahwasanya masyarakat harus lebih aktif dalam memilah informasi yang baik, dengan adanya edukasi dari pemerintah yang terkait vaksinasi.
Pola Asuh Orang Tua Dengan Perilaku Merokok Dan Karangtaruna Remaja Desa Tanggeran
Authors: Marsito Marsito , Fajar Agung N  , Muhammad As Ad  
Published: February 2025

Persentase Jawa Tengah remaja umur ≥ 15tahun merokok menduduki peringkat 10 dengan presentase sebesar 28,72 persen tahun 2023. Pola asuh orang tua dengan remaja merokok dan kegiatan karang taruna ada hubungannya. Penelitian ini bertujuan untuk melihat pola asuh orangtua, merokok dan kagiatan karang taruna remaja di Desa Tanggeran. Sampelnya remaja berjumlah 403 orang. Penelitian menggunakan observasional dengan pendekatan cross sectional. Pengumpulan data dengan kuesioner pola asuh orang tua, remaja merokok, dan kegiatan karang taruna. Pengolahan data menggunakan Diskriptif Frequencies dan Chi-Square tests . Untuk hasilnya pola asuh menunjukkan keluarga melakukan dengan demokratis ada 236 orang (59.1%), remaja tidak merokok ada 304 orang (75.4%), dan kurang aktif ada 166 orang (41.2%). Untuk hubungan pola asuh dengan kegiatan merokok remaja ada hubungan dimana nilai p value = 0,000 ˂ α (0,05).dan Pola asuh dengan kegaitan remaja mengikuti karang taruna ada hubungan dimana nilai p value = 0,000 ˂ α (0,05).sehingga pola asuh orang tua mempengaruhi perilaku remaja merokok dan mengikuti kegaitan di luar rumah seperti karang taruna. Diharapkan bahwa orang tua harus aktif melakukan bimbingan dan monitoring aktifitas yang dilakukan oleh remaja.
Keywords: pola asuh remaja merokok
Transisi Peran Sebagai Ibu Dengan Kemampuan Merawat Bayi Pada Primipara
Authors: Sunaringtyas Widyasih Sunaringtyas , Lilik Setiawan  
Published: February 2025

Transisi peran pada primipara adalah suatu keadaan dimana seorang wanita mengalami perubahan terutama ketika dia memulai tahap persalinan, selanjutnya akan menjadi seorang ibu dan menerima anggota keluarga baru. Menjadi seorang ibu juga memerlukan persiapan dan kemampuan karena akan mempunyai tanggung jawab baru merawat anaknya dengan baik dan maksimal.Tujuan penelitian untuk mengalisis hubungan transisi peran dengan kemampuan merawat bayi pada primipara. Desain penelitian korelasional dengan pendekatan cross sectional. Populasi penelitian 25 responden dan jumlah sampel 25 responden, menggunakan teknik sampling total sampling. Variabel independen yaitu Transisi peran dan variabel dependennya kemampuan merawat bayi. Alat ukur yang digunakan adalah kuesioner pada setiap variabel. Analisis statistik menggunakan Spearman's rho dengan α < 0,05. Hasil penelitian didapatkan transisi peran optimal 92% dan kemampuan merawat bayi kurang 88%. Hasil uji statistik spearman rho p- value: 0,516 dengan r:0,136, artinya tidak ada hubungan antara transisi peran dengan kemampuan merawat bayi pada primipara. Kemampuan merawat bayi oleh ibu kurang mampu dilaksanakan terutama pada saat kemampuan merawat pada usia bayi satu bulan. Hal ini membutuhkan waktu untuk beradaptasi pada masa transisi peran sebagai ibu. Akan tetapi pada usia bayi lebih dari satu bulan ibu sudah mampu melakukan perawatan bayi sesuai dengan peran barunya. Untuk itu kemampuan merawat bayi diperlukan pengalaman yang diperoleh dari tenaga kesehatan dan orang terdekat agar dapat meningkatkan kemampuannya, terutama pada bulan bulan pertama masa transisi sebagai ibu.
Keywords: Transisi peran, Kemampuan, Bayi, Primipara
Printable Epoxy Paste for Varistor Applications
Authors: Krasco Nicholas , Czubarow Paul , Lu Zhixiang , Rothfuss Arianna , Copeland Scott , Barrete Tony , Sato Toshiyuki , Imai Kazunari 
Published: February 2025

Varistors are passive, two-terminal solid state semiconductor devices that are used to provide over-voltage or over-current protection to electrical and electronic circuits. Metal-oxide varistors (MOVs) are typically made up of a durable ceramic material, which protects them against sudden surges of high current or energy. However, there are some drawbacks of MOVs, such as having a short life span and a large dynamic resistance. NAMICS has developed a solvent-less epoxy paste that has shown non-linear properties and sustained reliability, very similar to that of an MOV. With NAMICS’s proprietary blend of epoxy and other additives, we were able to achieve low-voltage varistor values (< 16 V) with minimal leakage current, comparable to commercially available MOVs being sold today. Printed varistor epoxies have a chance to revolutionize the semiconductor industry by offering miniaturization of components and a solder-less, one-step curing process, all while maintaining the same properties that are offered by MOVs.
Low Warpage Liquid Compression Molded Underfill for Wafer Level Packaging
Authors: Ma Yijia , Nguyen Jimmy , Ha Rose , Hoshiyama Mark , Champagne Tim , Shim Kail , Peddi Raj 
Published: February 2025

As semiconductor chip design transforms to meet the increased functionality, performance, and miniaturization needs of applications such as 5G, high-performance computing (HPC) and autonomous vehicles, advances in packaging materials and technologies have become crucial to enable tighter pitches, higher interconnect density, and increased complexity of the new architectures. Liquid compression molded underfill (L-MUF) has drawn attention as a new wafer level packaging material for its capability to gap fill and over mold simultaneously under low pressure. This material capability has improved efficiency and sustainability of the process and enabled higher reliability of the final package. L-MUF material development challenges include achieving void free gap filling in fine pitch applications and maintaining low warpage during the packaging process. This paper presents analysis of L-MUF encapsulant materials that feature lower warpage compared to typical encapsulants, a high glass transition temperature, void free gap filling, and high reliability. The novel L-MUF materials are formulated with proprietary resin systems and ultra-fine fillers as key enablers for their unique material properties and application performance. The results demonstrate that L-MUF materials have the combination of good flowability and low warpage and have the potential to meet the growing demands of various wafer level packing applications.
Optimizing Flip Chip Packaging for High Density Bump via Mold Flow Simulation with Through-Holes
Authors: Chien Tzu Chieh , Lo Shih Kun , Li Zong Yuan , Hsieh Chia Tso , Kuo Yen Hua , Liu Hui Chung , Lai Lu Ming , Chen Kuang Hsiung 
Published: February 2025

Flip-chip packaging techniques have become essential for electrical components, particularly in fine-pitch packages where bump sizes are small and high density under the chip. These techniques enhance thermal performance and bump connections while addressing concerns about mold voids. However, the high bump density and limited pitch in flip-chip techniques will lead to potential defects, including mold voids. To efficiently reduce voids, incorporating an extra runner in the package for void venting is one effective solution. This study investigates the effects of through-hole size, molding resistance, and mold flow performance using an advanced methodology. This methodology considers govern equations such as the viscosity model, curing reaction, and Finite Element Method (FEM) analytical method, with a focus on the structure design to predict or evaluate defects occurring in molding process, particularly mold voids and the weld risk. One of the major challenges in this approach is controlling the distance and density of bump pitches on the substrate of bonded spheres while attached spheres to package. The results demonstrate that a through-hole size of 0.2mm exhibits better performance in terms of potential mold voids with 44 units per strip, and 68 units for a 0.3mm through-hole size. Melting behavior under chips for void venting was clearly observed in specific areas. Additionally, the filling percentage, influenced by flow status, can be used to predict the mold flow risk. Base on FEM analytical, structure modification, and recipe optimization, the risk areas or positions can be identified and mitigated during the substrate or layout process. The adoption of high-density bump technology has significantly advanced our packaging process, particularly as devices become smaller, especially in the case of safety devices where reliability and testing are subject to harsh conditions. Even packages with micro voids undergo rigorous testing procedures to ensure optimal performance and reliability.
Enhancing Signal Integrity in High-Performance Electronics through Advanced TGV Fabrication with LPKF’s LIDE Technology
Authors: Noack Richard , Ostholt Roman , Anspach Nils , Santos Rafael , Ambrosius Norbert 
Published: February 2025

This paper explores the innovative Laser Induced Deep Etching (LIDE) technology developed by LPKF, focusing on its application in fabricating Through-Glass Vias (TGVs) for high-performance electronics. LIDE technology presents a significant advancement in microstructuring glass, addressing the critical challenge of surface roughness in TGV sidewalls, which is essential for minimizing signal loss in high-frequency communication systems. The study delves into the LIDE process, which involves precise laser modification followed by wet chemical etching, producing high-aspect-ratio structures with exceptional smoothness and accuracy. The experimental results highlight the advantages of LIDE over traditional methods, including improved sidewall quality and reduced defects, leading to enhanced signal integrity and electrical performance. By optimizing parameters such as laser power and etching conditions, the research demonstrates the potential of LIDE to set new benchmarks in electronic packaging. LIDE’s compatibility with various glass types and its scalability for high-volume production make it a versatile and economical solution for modern microelectronic applications. This paper underscores the transformative impact of LIDE technology on the fabrication of TGVs, paving the way for advancements in 2.5D and 3D packaging, and contributing to the broader goals of reducing signal loss and improving system performance in high-frequency electronics.
Next Generation Phase Change Material for High Power Electronics
Authors: Mohanty Rita , Nguyen Tho Quang 
Published: February 2025

The demand to increase speed and performance of electronic devices while keeping the footprint small, has increased the power density of electronic devices beyond what we thought possible merely a decade back. Telecom/Datacom, Industrial, Automotive and Consumer electronics such as gaming console are pushing the package size to be greater than 70mm X 70mm and power density greater than 100W/cm2. Most electronic devices are running at high power with high frequency power cycles. This elevated power density and high frequency cycling causes the temperature to rise beyond the operating thresholds of the device. To achieve the functionality and reliability of these devices, proper thermal management must be employed. Research shows, use of Phase Change Material (PCM) in TIM 2 and TIM 1.5 applications is an interesting and effective technique in maintaining the temperature of advanced electronic devices to its desired target. Although PCM has been in the market for decades, the recent advancement in high power electronic is accelerating the development of next generation PCM as a desired solution to maintain electronic devices temperature. In this paper we will discuss some of the new developments in PCM with special focus on power electronics and Telecom/Datacom applications. Methods to characterize PCM and comparison of different PCM will also be discussed.
The Ideal Switch® with Advanced Glass Packaging
Authors: Shorey Aric , Baloun Jeff , Walker Mark 
Published: February 2025

There has been a lot of work done over the past decade showing the advantages of using glass-based packaging for many microelectronics applications. Much of this work has been motivated by advantages provided by the material properties of glass. As an insulator, packaging enables devices with low electrical loss relative to semiconducting materials, such as silicon, as the operational frequency increases. Furthermore, the manufacturing processes for glass substrates provide numerous other potential benefits. Some glasses, such as fused silica (FS) offer extremely low loss tangent making it well suited for high frequency applications to minimize electrical loss in the system. Other glass types, such as those used for Display applications, are alkali free, have a coefficient of thermal expansion (CTE) close to Si and are fabricated in both thin and large (e.g. panel) form factors. This provides excellent opportunities for process cost savings for large substrates and interposers, while also maintaining excellent electrical performance. With all of these potential advantages in enhanced microelectronic performance, there have been numerous efforts to establish the manufacture of glass-based devices, but supply chain readiness has hampered the development of a robust supply of these solutions. Menlo Microsystems has established a glass device based supply chain to enable the volume manufacture of the Ideal Switch® technology. Below we describe the device and discuss some of the work Menlo has done to transition into production and packaging of the glass Ideal Switch.
A Rare Case of Juvenile Systemic Sclerosis: Clinical Challenges and Management
Authors: Bano Areej , Verma Shalini , Bhatnagar Shrish 
Published: February 2025

Abstract
Scleroderma is “skleros” sclerosing or hardening of the “derma” skin. It includes both systemic and localized scleroderma (LS). Mostly, juvenile LS affects the skin, whereas juvenile systemic sclerosis (SSc) involves multiple organ systems. Localized type is the most common in juvenile populations (>95%), whereas SSc is associated with mortality and severe multiorgan morbidity. Here, we present a rare pediatric case of juvenile SSc exhibiting classical features of skin thickening, autoantibody positivity, and systemic involvement, emphasizing this condition’s rarity and clinical significance. Early recognition and multidisciplinary care are pivotal in improving outcomes, particularly in the pediatric population where systemic involvement can severely impact the quality of life and prognosis.