bluuebunny/crossref_metadata_2025_split huggingface dataset:
Automated Diagonal Slice and View Solution for 3D Device Structure Analysis
Authors: Lee Sang Hoon , Blackwood Jeff , Stone Stacey , Schmidt Michael , Williamson Mark , Kwon Woo Jun , Lee Sung Jae 
Published: December 2020

Abstract
The cross-sectional and planar analysis of current generation 3D device structures can be analyzed using a single Focused Ion Beam (FIB) mill. This is achieved using a diagonal milling technique that exposes a multilayer planar surface as well as the cross-section. this provides image data allowing for an efficient method to monitor the fabrication process and find device design errors. This process saves tremendous sample-to-data time, decreasing it from days to hours while still providing precise defect and structure data.
Application of Novel Low Current OBIRCH Amplifier and Nanoprobing to Identify Subtle Leakages in Advanced Node Technologies
Authors: Kodali Satish , Chen Liangshan , Wei Yuting , Schaeffer Tanya , Oh Chong Khiam 
Published: December 2020

Abstract
Optical beam induced resistance change (OBIRCH) is a very well-adapted technique for static fault isolation in the semiconductor industry. Novel low current OBIRCH amplifier is used to facilitate safe test condition requirements for advanced nodes. This paper shows the differences between the earlier and novel generation OBIRCH amplifiers. Ring oscillator high standby leakage samples are analyzed using the novel generation amplifier. High signal to noise ratio at applied low bias and current levels on device under test are shown on various samples. Further, a metric to demonstrate the SNR to device performance is also discussed. OBIRCH analysis is performed on all the three samples for nanoprobing of, and physical characterization on, the leakage. The resulting spots were calibrated and classified. It is noted that the calibration metric can be successfully used for the first time to estimate the relative threshold voltage of individual transistors in advanced process nodes.
High-Resolution Resistance Mapping in SEM
Authors: Moldovan Grigore , Joachimi Wolfgang , Boetsch Guillaume , Jatzkowski Jörg , Altman Frank 
Published: December 2020

Abstract
This work presents advanced resistance mapping techniques based on Scanning Electron Microscopy (SEM) with nanoprobing systems and the related embedded electronics. Focus is placed on recent advances to reduce noise and increase speed, such as integration of dedicated in situ electronics into the nanoprobing platform, as well as an important transition from current-sensitive to voltagesensitive amplification. We show that it is now possible to record resistance maps with a resistance sensitivity in the 10W range, even when the total resistance of the mapped structures is in the range of 100W. A reference structure is used to illustrate the improved performance, and a lowresistance failure case is presented as an example of analysis made possible by these developments.
Failure Analysis of SRAM DQ Fault Using BIST Pattern
Authors: Kim KeonIl , Lim Yoseop , Oh GhilGeun , Chung ShinYoung , Lee Brandon 
Published: December 2020

Abstract
SRAM failure analysis (FA) provides significant value to process improvement and yield enhancement. This paper introduces an innovative method to analyze the SRAM peripheral, particularly its input/output (DQ) failures, which is not easy to isolate the fault location. In this paper, SRAM Built-In Self-Test (BIST) logic is used to generate the vectors to toggle only DQ of SRAM and an optical fault isolation technique applies to isolate the fault location. Experimental results show that the proposed method is very effective to isolate timing fault and hard defect of SRAM DQ failures.
Case Studies on Application of Electro Optical Probing (EOP) - A Noninvasive Backside Localization Technique in Failure Analysis
Authors: Rajaram Srinath , Kabadi Rajesh , Barbian Eric 
Published: December 2020

Abstract
Given the challenges FA Engineers have in fault localization, top-side analysis is facing a major challenge with today’s advanced packaging and shrinking of die sizes. At wafer and die level it is relatively easy to probe with little or no sample preparation. Greater challenges occur after the die is packaged. The difficulty further lies in non-destructively analyzing the die. Another issue with failure analysis is accurately deprocessing the device for probe pad deposition. Techniques like Electro Optical Probing (EOP) or Laser Voltage Probing (LVP) acquire electrical signals on transistors and create an activity map of the circuitry. In failure analysis, it is applied to localize defects. This paper discusses integrating EOP techniques in traditional FA to localize failure in mixed signal ICs. Three case studies were presented in this paper to establish the technique to be effective, quick and easy to probe non-invasively with minimal backside sample preparation.
Submicron Simultaneous IR and Raman Spectroscopy (IR+Raman): Breakthrough Developments in Optical Photothermal IR (O-PTIR) Combined for Enhanced Failure Analysis
Authors: Anderson Jay , Kansiz Mustafa , Lo Michael , Marcott Curtis 
Published: December 2020

Abstract
Failure analysis of organics at the microscopic scale is an increasingly important requirement, with traditional analytical tools such as FTIR and Raman microscopy, having significant limitations in either spatial resolution or data quality. We introduce here a new method of obtaining Infrared microspectroscopic information, at the submicron level in reflection (far-field) mode, called Optical-Photothermal Infrared (O-PTIR) spectroscopy, that can also generate simultaneous Raman spectra, from the same spot, at the same time and with the same spatial resolution. This novel combination of these two correlative techniques can be considered to be complimentary and confirmatory, in which the IR confirms the Raman result and vice-versa, to yield more accurate and therefore more confident organic unknowns analysis.
Enhancing Point Defect Isolation by Using Ionizing Radiation
Authors: Martin Douglas J. , Gadlage Matthew J. , Leung Wai-Yat , Titus Jeffrey L. 
Published: December 2020

Abstract
An application-specific integrated circuit (ASIC) for a high reliability application is found to have a missing sidewall spacer in a single transistor. Manufacturer burn-in and standard component electrical tests do not capture this defect. The defect manifests after exposure to ionizing radiation. Photon emission microscopy (PEM), laser voltage imaging (LVI), and laserassisted device alteration (LADA) are used to isolate the failure site. At the failure site a focused ion beam (FIB) cross section indicates that a doubly doped drain (DDD) (N+) is likely present where a lightly doped drain (LDD) is designated. This defect leads to a failure mode that is consistent with hot-carrier injection in complementary metal-oxide semiconductor (CMOS) transistors. This paper presents the testability from a fault isolation aspect, shmoo plot characterization, and backside optical techniques to identify its spatial location. A discussion of the results includes why ionizing radiation allowed the defect’s capture and potential implications of using ionizing radiation as a viable failure analysis technique.
Application of Nanoprobing on Subtle Defects in the Embedded Non-Volatile Memory Device
Authors: Chen C. Q. , Ng P. T. , Neo S. P. , Tan P. K. , Quah A. C. T. , Zhu J. 
Published: December 2020

Abstract
Non-volatile memory is the most important memory device in IC chips. As a memory, embedded non-volatile memory (NVM) is a fundamental structure in many kinds of semiconductor devices. It is commonly used in the modern electrical appliance as a code or data memory. For different applications, there are different memory designs or IP, like ROM, OTP, Flash, MRAM, PCRAM etc. The physical mechanism of these NVMs are different, some are electron based, some are resistance based and fuse or anti-fused based. The experiment described in this paper is performed on an electron charge storage based NVM. That means a medium is employed to store electron charge to differentiate two statuses “0” and “1”. Floating Poly gate is this medium used as electron charge storage in this NVM. Since the storage medium is in floating condition, it cannot be accessed externally. The methods of performing direct analysis are limited for this kind of device, especially in the case of subtle defects or soft fail. As semiconductor devices scale, the defects become smaller and more subtle. Nanoprobing is usually the only way to find the defect location electrically before any further physical analysis. In this experiment, the single bit NVM fail was analyzed. Different PFA methods used during the analysis, failed to find the defect. Nanoprobing was employed to precisely isolate the defect.
Key word: nanoprobing, NVM, subtle defect, Poly-crystalline, floating gate
Root Cause Analysis of High Input Offset Voltage in Mixed-Signal Design Through Nanoprobing and Cadence Simulation
Authors: Wan Zhenni , Yin Weikai , Zang Yining , Karigerasi Madhukar , Kulkarni Saurabh , Chung Yap Wui , Yu Dian , Wang Naiyi , Wu Qindi 
Published: December 2020

Abstract
Root cause analysis of parametric failures in mixed-signal IC designs has been a challenging topic due to the marginality of failure modes. This work presents two case studies of offset voltage (Vos) failures which are commonly seen in mixed-signal IC designs. Nanoprobing combined with Cadence simulation becomes a powerful methodology in fault isolation. Large Vos is typically caused by the mismatch of electrical properties of the components on two balanced rails. In our first case, we present a case-study of nanoprobing combined with bench test and Cadence simulation to debug the root cause of a class-D amplifier voltage offset related yield loss from mixedsignal design sensitivity. Bench electrical measurements confirm the dependency of offset voltage (Vos) on boost voltage (VBST) and amplifier gain settings, which isolates the root cause from mismatch in amplifier gain resistors. The bench measurements match extremely well when an extra parasitic resistance is added to the input of the amplifier in the Cadence simulation. Kelvin 4 points nanoprobing on the amplifier input matching resistors confirmed a 40% mismatch as a result of both layout sensitivity and fabrication. This case highlights that the role of nanoprobing combined with Cadence simulation is not only valuable in physical failure root cause analysis but also in providing guidance to a potential process fix for current and future designs. In our second case, a decrease in offset voltage (Vos) is found through bench validation by reducing the supply voltage (VDD), suggesting a new mismatch mechanism related to the body-source bias. Nanoprobing of the input PMOS transistors clearly shows humps in the subthreshold region of IV characteristics, and the severity of humps increases with body-source bias. Vos derived from the nanoprobing results aligns well with the bench data, suggesting hump effect to be the root cause of Vos deviation. This study suggests that by combining Cadence simulation and nanoprobing in the failure analysis process of parametric failures, suspicious problematic devices can be identified more easily, greatly reducing the need for trial and error.
Nickel Flakes: Past, Present and Future
Authors: Turner Ken , Polito Kevin 
Published: December 2020

Abstract
Pure nickel lidded TO style packages are a common packaging type for active microelectronics with application in various fields including commercial, aerospace and defense. This paper will focus on the history of nickel flakes in the industry, current trends and failure analysis findings, and future considerations for this potential failure mechanism.
In 2004 Hi-Rel Laboratories became involved in an important nickel flake study which led to further inspections to document and evaluate nickel flakes in TO style lids from various customers and manufacturers. Through 2015 these inspections also assisted manufacturers to evaluate the effectiveness of their lid preparation and various cleaning methods for this package style, resulting in a substantial reduction in total number of nickel flakes greater than the specified critical dimension.
In 2019 investigations were rekindled after the discovery of a suspected nickel flake-induced failure in transistors from a manufacturer not involved in prior analyses. As part of the investigation, which included nickel flake inspection of 38 total transistors from 1992, 2010, 2011 and 2017 lot date codes, the components were subjected to various environmental conditions including vibration, mechanical shock, mild thermal cycling, ionized airflow and degaussing. It was discovered that degaussing alone greatly affected the adhesion of the nickel flakes to the internal surfaces, causing the majority of the flakes to break free. The methodology, findings and implications of this analysis will be discussed.
Targeted Silicon Ultra-Thinning by Contour Milling for Advanced Fault Isolation
Authors: Teo W. S. , Wei M.S. , Narang V. , Gan C. L. , Richardson C. , Liechty G. 
Published: December 2020

Abstract
In this paper, we present methods for targeted silicon thinning by contour milling to overcome challenges associated with thinning large devices to under 5 µm remaining silicon thickness. Implementation of these techniques are expected to improve the yield of ultra-thin sample preparation and thermal stability of the device through electrical failure analysis for subsequent physical failure analysis. Using a computer numerical controlled milling system, the natural device bow is exploited to thin a specified area of interest by stage tilting before 2D milling. To target a larger area of interests, contour maps are rigged to thin an area preferentially while remaining compatible with existing workflows. Electrical testing have found improved thermal stability of the locally thinned samples over globally thinned samples.
Середньовічний європейський денарій зі слов’янськими (?) рунами
Authors: Kuleshov Sergei 
Published: December 2020

У повідомленні розглянуто срібний західноєвропейський денарій з незвичними знаками на реверсі. На думку автора, ці знаки є рунами балтійських слов’ян. Зроблено припущення, що монета карбована ободритами в ХІ або ХІІ столітті. У повідомленні розглянуто срібний західноєвропейський денарій з незвичними знаками на реверсі. Камені з деякими аналогічними рунами на нашій монеті були знайдені в німецькій землі Мекленбург, яку з ранніх середніх віків населяло слов’янське плем’я ободритів (бодричів). Щодо ободритів, то, як зазначає у своїй монографії, присвяченій цьому племені, німецький вчений А. Пауль, знайдені під час археологічних розкопок в ободритській фортеці Добінмонети ХІ-ХІІ століть були місцевими наслідуваннями саксонських, данських, візантійських і арабських монет. Можна припустити, що наш денарій, виходячи з напису на реверсі, також було карбовано ободритами.
Po raz kolejny o «Skarbie»z czernijowa. «skarb pielgrzyma do ziemi świętej». Czy tylko fantazja?
Authors: Mariusz Mielczarek 
Published: December 2020

W literaturze numizmatycznej i archeologicznej powtarzana jest informacja, że w 1876 lub 1878 roku w „Czernijowie koło Stanisławowa” (obecnie Ivano-Frankovsk) miejscowy kapłan rozkopując okoliczne kurhany, znalazł „garnek z monetami”. W „dużym garnku” miały być monety „rzymskie, palestyńskie, arabskie i bizantyńskie”. Spośród nich Aleksander Czołowski (1865-1944) uratować miał 45 sztuk. Wśród 45 monet uratowanych przez dr. Czołowskiego miały być monety (zachowano pisownię jednej z pierwszych publikacji): „Aleksandra Janneusa (105-79), Heroda Agryppy (48-99), Augusta, Julii Augusty, Tyberyusza (14-37), Nerona (54-68), kolonii Askalonu, Antyocha II, kolonii Nicei, Konstantyna W., Walentynian, tudzież żydowskie, bizantyńskie i arabskie” Zespół z Czernijowa jest podobny do „skarbów” z Kniaziej Krynicy i ”z Galicji” traktowane są jako pewnego rodzaju ślad po kolekcjach numizmatycznych, zapewne stworzonych niedaleko od miejsca znalezienia „skarbów” Kluczem do oceny „skarbu pielgrzyma”, jest osoba Aleksandra Czołowskiego, postaci bez wątpienia niezwykle zasłużonej dla ratowania zabytków przeszłości. Przyjmując, że 45 monet kupionych przez A. Czołowskiego oddaje strukturę całego zespołu, który musiał być zdecydowanie większy, to bez wątpienia mógł on zostać zebrany na Bliskim Wschodzie. Wskazanie na Ziemię Świętą jest z pewnością prawidłowe, chociaż dopuścić można również pochodzenie monet z południowej Syrii. Jeśli zaś odnieść się do atrakcyjnego stwierdzenia, ze mamy do czynienia ze „skarbem pielgrzyma” warto zwrócić, że pierwsza wiadomość o monetach zebranych w Ziemi Świętej i wiezionych do Polski, to opis napadu na Mikołaja Krzysztofa Radziwiłła „Sierotkę” (1549-1616). W drugiej połowie tego stulecia pojawili się w Syrii i Ziemi Świętej polscy podróżnicy, którzy przybyli w te strony w celach naukowych.. W trakcie takich wypraw bez problemu można było zebrać zespół monet, które miały zostać znalezione w Czernijowie.
Фальшиві монети Сигізмунда ІІІ Вази з Хмельниччини
Authors: Bakalets O. 
Published: December 2020

На основі дослідження і аналізу скарбів монет кінця ХVІІ –початку ХVІІ ст., виявлених на території Південно-Західної Хмельниччини у 2010–2016 рр., у статті описані фальшиві соліди та гроші Сигізмунда ІІІ Вази (1587–1632). Здійснено спробу визначити можливі центри карбування фальшивих монет на Поділлі в досліджуваний період. З нумізматичної літератури та скарбового матеріалу нам відомо про фальшиві соліди, гроші, півтораки Речі Посполитої Сигізмунда ІІІ Вази (1587–1632), які трапляються у складі монетних скарбів і поодиноких знахідок на території Центральної та Східної Європи. Але окремі публікації про скарби на території Хмельниччини, у яких присутні ці фальшиві номінали, майже відсутні. Лише комплексне вивчення скарбових матеріалів дозволяє дослідникам дати об`єктивну оцінку ролі і обсягів фальшивої монети в загальній масі обігових грошей тієї чи іншої держави або конкретного регіону. Наявність фальшивих ризьких солідів, грошів Сигізмунда ІІІ в скарбах колишнього Подільського воєводства Речі Посполитої кінця ХVІ – початку ХVІІ ст., свідчать про їх популярність серед місцевого населення, а також про існування на Західному Поділлі центрів карбування цих підробок. На нашу думку, це могли бути міста Сатанів і Кам`янець-Подільський.
Portrait
Authors: Asad Talal , Boyarin Jonathan ,   Fadil Nadia, Agrama Hussein Ali , Schaefer Donovan O. , Abeysekara Ananda 
Published: December 2020

Autobiographical Reflections on Anthropology and Religion, Talal AsadFor Talal, Jonathan BoyarinOn Anthropology as Translation, Nadia FadilFriendship and Time in the Work of Talal Asad, Hussein Ali AgramaTalal Asad’s Challenge to Religious Studies, Donovan O. SchaeferFinding Talal Asad in and beyond Buddhist Studies: Agency and Race in Modern Pasts, Ananda Abeysekara
Environmentally Friendly Based Educative Game Development Training For Teachers Early Childhood Education Programs
Authors: Kusmiyati Kusmiyati , Sarmi Ni Nyoman 
Published: December 2020

This community service aims at developing Educative Game Tools (EGT) based environmentally friendly. This activity is motivated by the fact that many PAUD (Early Childhood Education) teachers are not PGPAUD graduates and even high school graduates. There is still a lack of understanding and skills of early childhood teachers in designing and making educational teaching aids environmentally friendly. Besides that, their motivation to design their own Educational Game Tools is still low. Based on the above problems, the solution offered is to provide training for PAUD teachers in Wonokromo village to understand, design, and create their own innovative and Educative Game Tools (EGT) based environmentally friendly. The program target is for PAUD teachers to know, understand the importance of EGT in PAUD learning and design creative and innovative EGT. The concept of EGT is oriented towards safe for children, environmentally friendly, and source of used materials that are quickly processed from the surrounding environment. As a result, all participants gained knowledge and skills in designing EGT to improve quality and professionalism as Early Childhood Education teachers.
¿Existen sinergias entre la política fiscal y la Agenda 2030? Un análisis para la Unión Europea con datos macro
Authors: Plaza Iniesta Rocio , Sánchez Fuentes Antonio Jesús 
Published: December 2020

MACRO
La Agenda 2030 para el Desarrollo Sostenible, aprobada en 2015 por la ONU, constituye un ejemplo exitoso sobre cómo un consenso político internacional respecto a logros deseables en el medio/largo plazo (herederos de los Objetivos de Desarrollo del Milenio) se puede concretar en unos objetivos concretos y cuantificables. En concreto, se fijan 17 Objetivos de Desarrollo Sostenible (ODS, en adelante) que incluyen asuntos tan relevantes como la sostenibilidad ambiental, la reducción de la pobreza y las desigualdades o una mayor eficiencia energética y productiva. Este trabajo aspira a estudiar la contribución de la fiscalidad de la Unión Europea a la consecución de dichos objetivos en el periodo 2005-2017.
Authors: Khasanah Nurun Ayati , Wari Fitria Edni , Adiesti Ferilia , Sulistyawati Wiwit 
Published: December 2020

INTRODUCTION: Perineal massage is an effective approach to promote labor with an intact perineum. During pregnancy, mothers are advised to perform perineal massage so that the integrity of the perineum is maintained, so that the labor process does not caused perineal rupture. This study was conducted to determine the relationship between knowledge, motivation and perineal massage of third trimester pregnant women. METHODOLOGY: The design of this study was analytic with a cross sectional design. Respondents of this study were 27 third trimester pregnant women with purposive sampling method conducted in March - May 2020. RESULTS: The results of statistical tests using the Fisher's Exact Test to analyze knowledge of perineal massage obtained a value (α = 0.009) which indicates that trimester pregnant women III who is well-informed performs perineal massage, while the results of the motivation test using the Fisher's Exact Test score (α = 0.019) that with positive motivation third trimester pregnant women perform perineal massage. DISCUSSION: Midwive as a health worker need to improve the services for pregnant women with health education about perineal massage.

Keywords: knowledge, motivation, pregnant women, perineal massage
Authors: Rahmawati Dian , Agustin Lia 
Published: December 2020

Introduction: Stunting is a failure of growth in toddlers due to chronic malnutrition so the child is too short at his age. Stunting can decrease the quality of human resources because the organs of the body, especially the brain, are not able to develop optimally. Knowledge and information about stunting is needed to support the nutrition of toddlers. The purpose of the study was to analyze whether the level of maternal education and the provision of information about stunting is related to stunting events. Methodology: This type of research is observational analytics with a case control approach. The study population is all toddlers aged 24-59 months in Bangkok Village Gurah District Kediri Regency in August 2020. With Purposive Sampling technique obtained 25 toddlers stunting as a case group and 25 toddlers not stunting as a control group. Dependent variables are stunting events, whereas independent variables are the level of maternal education and the provision of information about stunting. Stunting measurement based on TB/U (Z-score). Measurement of maternal education and stunting information with questionnaires and interviews.Data analyzed with Chi Square and Fisher Exact's Test Results: Statistically the level of maternal education is not related to stunting events (p=0.52) and the provision of information about stunting related to stunting events p=0.005 (OR=5.46; CI 95% 1.63 to 18.36). Discussion: The toddler's mother who received no information about stunting has a 5 times chance of her toddler experiencing stunting.
Keywords:stunting, maternal education level, stunting information