bluuebunny/crossref_metadata_2025_split huggingface dataset:
Early detection and instantaneous cause analysis of defects in interconnects by machine learning (ranking-CNN) of scattering parameter patterns
Authors: Kang Tae Yeob , Seo Donghwan , Park Yongchan , Min Joonki , Kim Taek-Soo 
Published: December 2019

Abstract
This paper presents a novel method not only to detect defects in interconnects early but also to determine the root causes instantaneously by using machine learning of scattering parameter(s-parameter) patterns. it is found out that defective interconnects have certain and unique s-parameter patterns. We modified the facial age estimating algorithm (ranking-CNN) to learn the s-parameter patterns according to the cause and severity of defects in interconnects. Utilizing the training datasets obtained from pristine, cracked and photodegraded ITO specimens, our algorithm returns information on the cause of the interconnect defect and the severity level with accuracies of 95.56% and 91.11% respectively.
Thermal Modeling and Experimental Analysis of High Power LED using POL-kw Packaging Technology
Authors: Kapusta Christopher , Yin Liang , Nagarkar Kaustubh , Walwaikar Anisha , Srihari Krishnaswami 
Published: December 2019

Abstract
In this paper, an “embedded chip” packaging platform using POL-kW packaging for use with High Power LED devices is presented. Prototype samples have been fabricated and tested. The authors will describe thermal modeling analysis as well as experimental results from the prototype samples. A thermal simulation model has been developed to look at the thermal properties and attributes of the POL-kW LED structure and will be compared to conventional AlN and IMS based LED packages. The process flow and fabrication details of a POL-kW LED package will be summarized to provide a better understanding of the technical and performance advantages. Initial results have shown that the presence of POL vias directly connected to the LED chip reduce the thermal path and, thereby, the thermal resistance of the package. Furthermore, the POL-kw LED package offers a thinner profile and smaller form factors which allows higher integration density.
A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization
Authors: Bhogaraju Sri Krishna , Mokhtari Omid , Pascucci Jacopo , Conti Fosca , Kotadia Hiren R , Elger Gordon 
Published: December 2019

Abstract
High temperature power electronics based on wide-bandgap semiconductors have prominent applications, such as automotive, aircrafts, space exploration, oil/gas extraction, electricity distribution. Die-attach bonding process is an essential process in the realization of high temperature power devices. Here Cu offers to be a promising alternative to Ag, especially because of thermal and mechanical properties on par with Ag and a cost advantage by being a factor 100 cheaper than Ag. With the aim to achieve a low-pressure Cu sintering process, a low cost wet chemical etching process is developed to selectively etch Zn from brass to create nano-porous surface modifications to enhance sinterability, enabling sintering with low bonding pressure of 1MPa and at temperatures below 300°C. However, high tendency of Cu to oxidize poses a major challenge in realizing stable interconnects. For this purpose, in this contribution, we present the use of polyethylene-glycol 600 as reducing binder in the formulation of the Cu sintering paste. Finally, we propose a multi-pronged approach based on three crucial factors: surface-modified substrates, nanostructured surface modifications on micro-scale Cu-alloy particles and use of a reducing binder in the Cu particle paste.
Characterization and Electrical Performance of Glass Diplexer Modules
Authors: Woychik Charles , Lauffer John , Pollard Scott , Parmar Raj , Gaige Michael , Wilson William , Carey James , Neely Matthew , Ling Feng , Chen Lijun 
Published: December 2019

Abstract
A process has been developed to manufacture a glass diplexer module using conventional laminate circuit board processes that have been adapted to handle glass substrates. Over the past few years we have evaluated both Cu plating and electrically conductive adhesives (ECAs) to produce a through glass via (TGV). From this work, it has been determined that Cu plating is a preferred process to form a robust TGV in a manufacturing environment. A Cu plated TGV nicely compliments our semi-additive plating (SAP) processes to produce fine line Cu circuitry on both sides of a glass substrate. In addition, we have successfully laminated an Ajinomoto Buildup Film (ABF) to both sides of a glass substrate having TGVs. The ABF completely filled the vias and also maintained uniform flatness on both sides. The resulting interposer was very flat and suitable for the next level of Cu plating using SAP. The ABF material was able to form high quality blind vias using laser drilling. A more comprehensive characterization of the glass diplexer modules will be presented, which will include X-sections of a double-sided Cu circuitry and Cu MIM (metal-insulator-metal) capacitors and inductors. In addition, the first set of electrical test data will be presented and compared with the modeling work done to date.
THERMAL VALIDATIONS OF ADDITIVE MANUFACTURED NON-METALLIC HEAT SPREADING DEVICE FOR HOT SPOT MITIGATION IN POWER MODULES
Authors: Whitt Reece , Huitink David 
Published: December 2019

Abstract
As energy demands and power electronics density scale concurrently, reliability of such devices is being challenged. Inadequate thermal management can cause system-wide failures due to thermal run-away, thermal expansion induced stresses, interconnect fractures and many more. Conventional techniques used to cool devices consist of heavy, metallic systems such as cold plates and large heat sinks, which can significantly reduce the overall system power density. Moreover, the manufacturing of such components is expensive and often requires custom-made cold plates for improved integration with the electronic system. Although used as a standard practice, these metallic thermal management systems have the potential to intensify electro-magnetic interference (EMI) when coupling with high frequency switching power electronics, and the material density increases the weight of the system, which is detrimental in mobile applications. Lastly, cold plates and heat sinks can create non-uniform cooling profiles in the electronics due to the insufficient management of hot-spots. To combat these drawbacks, a new heat spreader design has been proposed which reduces weight and EMI effects while eliminating hot-spots through localized fluid impingement. This current study describes the methodology and construction of the experimental test setup to characterize the performance of the heat spreading device compared to an off-the-shelf cold plate. Through infrared imagining, the viability of two heated test sections are evaluated in their ability to replicate power module temperature profiles during operation.
Semi-additive Process Based Cu Wirings with Ultra Smooth Electroless Cu Seed Layer and Important Factor for High Frequency Transmission Property
Authors: Toba Masaya , Nomoto Shuji , Komuro Nobuhito , Mitsukura Kazuyuki , Abe Shinichiro , Masuko Takashi , Kurafuchi Kazuhiko 
Published: December 2019

Abstract
Semiconductor packages for high performance devices with printed circuit boards having multi wiring layers such as FC-BGA have been attracting the attention in order to realize ultra-reliable and low latency communications in 5G networking. Cu wirings for the package are usually fabricated by via formation by laser for dielectric, desmear, electroless Cu seed formation, photoresist patterning, electrolytic Cu plating, resist stripping and seed layer etching. Though a desmear process can obtain enough adhesion between dielectric and Cu seed layer by anchoring effect to secure reliabilities, the interface between dielectric and Cu seed layer should be smooth to achieve low attenuation of electric signals at high frequencies. Here, instead of a desmear process, we applied an UV modification for the surface of dielectric in order to realize a smooth and high adhesive seed layer against dielectric. We obtained 0.8 kN/m of peel strength between dielectric and Cu seed layer in spite of surface roughness (Ra) of dielectric was 45 nm by nano-level anchoring effect at UV modified layer. Due to the smooth interface by UV modification, S21 value of microstrip line was 26 % improved compared to that assembled through desmear process at 60 GHz.
Understanding the Effects of Process Parameters to Compensate for Substrate Warpage in Chip on Flex (CoF) Assembly Using Conventional Reflow
Authors: Soman Varun , Venkatadri Vikram , Poliks Mark D. 
Published: December 2019

Abstract
Mounting rigid silicon (Si) die on a flex substrate presents a unique set of challenges. Substrate surface flatness and warpage of the flex substrate before and during thermal processing being two of the biggest issues. Various processes such as thermocompression bonding using anisotropic conductive films and thermosonic bonding using non-conductive adhesives have been shown to be effective for chip on flex (CoF) applications. However, these processes sacrifice process throughput and are less cost effective. Hence these methods may not be suitable for high volume manufacturing (HVM). For this reason, a process that is suitable for HVM and uses standard reflow processes and equipment is highly desirable. This works presents preliminary results for such a CoF process that uses a simple fixture and standard processes, materials and equipment. CoF process for Si die using two types of interconnects, solder balls or Cu pillars, was developed. Solder paste was stencil printed before pick and place of the Si die to offset the lack of flex substrate flatness and substrate warpage. The effect of stencil aperture diameter and placement force on process yield and stand-off height was studied. It was demonstrated that high yield can be obtained with a process that uses wider stencil aperture opening for both type of interconnects investigated. It was also observed that the placement force did not have any effect on process yield or stand-off height. The process can also be easily scaled up for HVM.
Reconfigurable mm Wave Flexible Packages with Ultra-thin Fan-Out Embedded Tunable Ceramic IPDs
Authors: Bhardwaj Shubhendu , Sayeed S K Yeahia Been , Camara Jose Solis , Vital Dieff , Raj P. M. 
Published: December 2019

Abstract
In this work, we show the use of tunable ceramic type integrated passive devices for mm-wave antenna applications. The specific illustrations are made using BST (barium strontium titanate) based capacitator, whose capacitances can be changed by electronically controlled permittivity of the BST material. BST capacitors with capacitance variation from 0.5 pF to 1 pF are designed (requiring a control voltage between 0 to 5 V) and using these capacitors, RF-components are designed. Specifically, we show a design of reconfigurable band-pass filter in 28 GHz band and reconfigurable phase-shifters in 28 GHz and 38 GHz mm Wave bands. We show that the electronic control provides enough phase-shift variation for ±90° beam-steering antennas covering the entire broadside scanning range in 28 GHz and 38 GHz bands. Furthermore, bandpass filter that is reconfigurable around 28 GHz band is designed to demonstrate full band reconfigurability to block undesired signals that enter the receiver chains for jamming applications.
Recent Advances in X-ray for Semicon Applications
Authors: Bryant Keith , Vaga Ragnar 
Published: December 2019

Abstract
Taking x-ray images goes back over 100 years. Since then, there have been numerous advances in x-ray technology and these have been increasingly applied in helping the manufacturing of electronic components and assemblies, as well as in their failure analysis.
Most recently, this has been rapidly driven by the reduction in device and feature size and the movement to using newer, lower density materials within the structures, such as copper wire replacing gold wire as the interconnection material of choice within components. Another driver for developments is the engineering of single 3D packages with multiple chips stacked vertically one on top of the other, which results in smaller and more efficient packaging of devices.
In order to meet these challenges and those in the future, there have been a number of recent key improvements to the vital components within x-ray systems.
The choice of available technologies, however, means selecting the tube/detector combination, which is optimum for a particular electronics inspection application, is no longer so clear-cut. For example, one configuration may provide certain benefits that are applicable for one area of electronics inspection, whilst being less valid for others. This paper will review the various x-ray tube and detector types that are available and explain the implications of these choices for electronics inspection in terms of what they provide for inspection regarding image resolution, magnification, tube power, detector pixel size and the effects of detector radiation damage, amongst others.
This paper will also look in detail at the capabilities of high end CT systems to inspect wafer bumps, copper pillars and TSV's, new designs are reducing key dimensions of all of these interconnections challenging x-ray systems to produce clear images.
Reliability of printed wire bonds
Authors: Marsan-Loyer C. , Sansregret C. 
Published: December 2019

Abstract
Additive manufacturing is an emerging domain with numerous potential applications. The concept of those new processes offers many advantages such as design flexibility, truly 3D packages and low cost for customization. The aerosol jet printing could enable wire bonding-like techniques that are unachievable with round wires today, combined with serious advantages for high frequency applications. However, this new field is starting off with many challenges to address, with the reliability as a focal point. The focus of this study is the reliability of printed wire bonds. Polyimide and silver inks were printed using an aerosol jet system (OPTOMEC Aerosol Jet ® HD Decathlon™). The results are focusing on the reliability of the adhesion of polyimide ink (UTD-PI-AJ) in an ethanol-based diluent and a silver ink, the HPS-108AE1 from Novacentrix, on different surface types: silicon oxide, pure aluminum and gold (ENIG). The adhesion is first addressed by a qualitative tape test at room temperature. The test samples are then put into an environmental chamber for a Deep Thermal Cycling (DTC) stress. The samples cycled 1000 times between −20°C and 85°C. They were inspected for physical defects at 250, 500 and 750 cycles. The visual inspection for defects focuses on cracks and delamination. The printed wire bonds were simulated by printing polyimide ink into a gold plated flat ceramic substrate (28 LCC from Kyocera) and then printing conductive silver ink from opposite pin leads. A layer of polyimide ink was then added on top of the printed lines. Crossover lines were finally printed on top of the last polyimide layer, again from opposite pin leads, creating an array of superimposed printed wire bonds. The reliability of printed wire bonds is tested through a Highly Accelerated Stress Test (HAST, 110°C, 85%RH, 264h) under bias. The samples were inspected at 66h, 132h and 198h for visual defects such as cracks, delamination and silver electro-migration. Cross-sections were performed on samples before and after HAST. All defects were characterized regarding of their time and condition or appearance and of their dimensions.
Existence and Uniqueness of Solutions to Singular p-Laplace Equations of Kirchhoff Type
Authors: Li Qingwei 
Published: December 2019

AbstractIn this paper, we study both the existence and uniqueness of nonnegative solutions for the nonlocal $p$-Laplace equation with singular term $$\begin{eqnarray}\left\{\begin{array}{@{}ll@{}}-B\Bigl(\frac{1}{p}\int _{\unicode[STIX]{x1D6FA}}|\unicode[STIX]{x1D6FB}u|^{p}\text{d}x\Bigr)\unicode[STIX]{x1D6E5}_{p}u=\frac{h(x)}{u^{\unicode[STIX]{x1D6FE}}}+k(x)u^{q},\quad & x\in \unicode[STIX]{x1D6FA},\\ u>0,\quad & x\in \unicode[STIX]{x1D6FA},\\ u=0,\quad & x\in \unicode[STIX]{x2202}\unicode[STIX]{x1D6FA},\end{array}\right.\end{eqnarray}$$ where $\unicode[STIX]{x1D6FA}\subset \mathbb{R}^{N}(N\geqslant 1)$ is a bounded domain with smooth boundary $\unicode[STIX]{x2202}\unicode[STIX]{x1D6FA}$, $h\in L^{1}(\unicode[STIX]{x1D6FA})$, $h>0$ almost everywhere in $\unicode[STIX]{x1D6FA}$, $k\in L^{\infty }(\unicode[STIX]{x1D6FA})$ is a non-negative function, $B:[0,+\infty )\rightarrow [m,+\infty )$ is continuous for some positive constant $m$, $p>1$, $0\leqslant q\leqslant p-1$, and $\unicode[STIX]{x1D6FE}>1$. A “compatibility condition” on the couple $(h(x),\unicode[STIX]{x1D6FE})$ will be given for the problem to admit at least one solution. To be a little more precise, it is shown that the problem admits at least one solution if and only if there exists a $u_{0}\in W_{0}^{1,p}(\unicode[STIX]{x1D6FA})$ such that $\int _{\unicode[STIX]{x1D6FA}}h(x)u_{0}^{1-\unicode[STIX]{x1D6FE}}\text{d}x<\infty$. When $k(x)\equiv 0$, the weak solution is unique.
Concordance, Crossing Changes, and Knots in Homology Spheres
Authors: Davis Christopher W. 
Published: December 2019

AbstractAny knot in $S^{3}$ can be reduced to a slice knot by crossing changes. Indeed, this slice knot can be taken to be the unknot. In this paper we study the question of when the same holds for knots in homology spheres. We show that a knot in a homology sphere is nullhomotopic in a smooth homology ball if and only if that knot is smoothly concordant to a knot that is homotopic to a smoothly slice knot. As a consequence, we prove that the equivalence relation on knots in homology spheres given by cobounding immersed annuli in a homology cobordism is generated by concordance in homology cobordisms together with homotopy in a homology sphere.
The Woke White Queen: Constance Hall and Mummy Blogging as a Case Study in Antiracialism
Authors: Vonk Lisa Anne 
Published: December 2019

Abstract
It is well-established that “mothering” and the figure of the “good mother” are tools in the oppression of women, particularly women of color. In this article, I use social media personality Constance Hall as a case study to explicate how the online “mummy celebrity” text perpetuates such oppression, despite attempts at cultivating a socially aware (“woke”) image. David Theo Goldberg’s notion of antiracialism is used to conceptualize Hall’s specific brand of activism, which relies on the fusion of liberal notions of equality, a rhetoric of “no judgment,” and charity work. I argue that the parenting practices put on display by Hall often reflect those endorsed by white, bourgeois institutions and that the normalization of surveillance that occurs as they are put on display may in fact be actively harmful to women of color. I find evidence of a continuation of the logic of “transnational intimacy” as laid out by Raka Shome, where the image of virtuous white mothers is used to further imperialist expansion. Ultimately, I conclude that being “woke” may draw the online “mummy personality” an audience but, in the case of Hall at least, truly challenging and confronting racism through actively dismantling systems that are psychologically and financially advantageous to the white mother remains unfulfilled.
When We Say Smart Asian Girl We Don’t Mean Smart (White) Girl: The Figure of the Asian Automaton and the Adolescent Artist in the Künstlerroman Genre
Authors: Yu Jessica 
Published: December 2019

Abstract
This article focuses on two figures, the Smart White Girl and the Asian Automaton in the filmic Künstlerromane, (500) Days of Summer, Lady Bird, and Juno. I argue that these films center around the artistic and moral development of their white, intelligent, and radical female protagonists (Smart White Girls) for which the figure of the model minority Asian family and/or female Asian nerd (Smart Asian Girls) act as foils. These taste-making rebels, lippy savants, and unruly girls are trying to free themselves from societal constraints in order to come of age. However, they must first overcome, deride, and reject what I call the figure of the Asian Automaton: censorious female Asian nerds or their conservative, silent, staring Asian families. My methodology&#x97;which fuses critique with a more personal approach to academic writing&#x97;allows me to discuss the problem of recognition and self-recognition for the Asian subject when watching these films.
Repensando o Direito Constitucional Comparado no Brasil
Authors: Meyer Emilio Peluso Neder 
Published: December 2019

O artigo reconstrói alguns dos avanços no campo do Direito Constitucional Comparado. Recorrendo à literatura recente, ele começa com uma definição do estado da arte da temática no Brasil. Segue-se uma advertência contra o predomínio de perspectivas que privilegiem o norte global. A relação entre comparativismo e judicialização indica as razões do renascimento da disciplina por meio de uma atividade mais proeminente de juízes e tribunais. Temas de perfil metodológico, como a diferença entre análise small-Ne large-N, metáforas adequadas, segmentação comparada e a reivindicação de transdisplinariedade, são discutidos com vistas a redirecionar o debate. O método de revisão da literatura é alargado com uma verificação de dois exemplos de uso equivocado do comparativismo: o voto da Ministra Rosa Weber no Habeas Corpus 152.752 e a discussão sobre atiradores de elite. Os resultados de pesquisa indicam a necessidade de repensar o Direito Constitucional Comparado da forma como é trabalhado no Brasil.
Geochemistry and Crystallization Conditions of Magmas Related to Porphyry Mo Mineralization in Northeastern China
Authors: Ouyang Hegen , Mao Jingwen , Hu Ruizhong 
Published: December 2019

AbstractTo better understand processes leading to porphyry Mo deposit formation, the metal content, volatile content, and crystallization conditions of melt inclusions from pre- and synmineralization intrusions in six porphyry(-skarn) Mo deposits of northeastern China (Aolunhua, Hashitu, Lanjiagou, Songbei, Wanbaoyuan, and Yangjiazhangzi) were investigated by means of laser ablation-inductively coupled plasma-mass spectrometry and electron microprobe analysis. The ore-forming silicate melts were one to four times more evolved than average granite with 1 to 7 ppm Mo. The ore-related intrusions crystallized predominantly at 760° to 690°C and 3.7 to 1.0 kbar, except for the one at Hashitu, which crystallized at 770° to 740°C and lower pressures (2.0–1.0 kbar). Fertile silicate melts at Hashitu contain up to 0.4 wt % F, 0.03 to 0.09 wt % Cl, 5.0 to 7.0 wt % H2O, 10 to 24 ppm Cs, and 200 to 500 ppm Rb, whereas those at Yangjiazhangzi and Wanbaoyuan contain less Cs (3–6 ppm and 5–7 ppm, respectively), less Rb (180–220 ppm and 200–240 ppm, respectively), and negligible F (&lt;0.15 wt %) but have similar Cl (0.03–0.05 wt %) and H2O (5.3–6.5 wt % and 4.0–5.2 wt %, respectively) contents. Calculated melt viscosities in fertile magmas (log η = 4.3–6.1 Pa s) are at the lower end of the values reported for felsic melts at the same temperature.Comparison between syn- and premineralization intrusions in individual deposits reveals that the ore-related intrusions were similarly evolved and had similar Mo contents and crystallization conditions as the nonmineralizing intrusions. The only difference is that the premineralization intrusions tend to occur as batholiths. The key to porphyry Mo mineralization lies in the focusing of fluid into and through a small rock volume on the top of the intrusion.For the studied porphyry Mo deposits, the mineralizing magmas are all Mo poor, indicating Mo enrichment is not required to form porphyry Mo deposits. Metal endowments in porphyry Mo deposits have no direct relationship with the composition and crystallization condition of mineralizing melts but are linked with the fluid flux released from the underlying magma chamber through a cupola.