bluuebunny/crossref_metadata_2025_split huggingface dataset:
Unique imaging appearance of neurosarcoidosis as a solitary cystic mass with mural enhancement
Authors: Bathla Girish , Kandemirli Sedat Giray , Gupta Sarika , Agarwal Amit 
Published: December 2020

Background:
Sarcoidosis is an idiopathic, granulomatous, and multi-system inflammatory disorder that can also involve the central nervous system in the form of meningeal, parenchymal, or cranial nerve involvement. Imaging findings can be non-specific and may overlap with other inflammatory, infectious and neoplastic processes, and posing diagnostic challenges. Parenchymal involvement in neurosarcoidosis (NS) predominantly manifests as either non-enhancing white matter lesions or as enhancing parenchymal granulomas. Granulomas usually manifest as multiple solid lesions with nodular enhancement.

Case Description:
A 72-year-old man presented with right-eye visual field changes with the non-contrast head computed tomography showing a large cystic lesion in the left frontoparietal lobe. Subsequent contrast-enhanced magnetic resonance imaging study revealed a large cystic mass with irregular rim enhancement and mural nodule concerning for glial neoplasm. Cyst decompression with biopsy and histopathological analysis revealed gliosis and prominent perivascular granulomatous inflammation with mixed picture of CD4 and CD8-positive cells suggestive of sarcoidosis. Further subsequent work-up showed mediastinal and cervical lymphadenopathy which on biopsy showed non-necrotizing granulomatous inflammation, consistent with sarcoidosis.

Conclusion:
Herein, we report unique imaging findings of a NS case manifesting as a solitary cystic intraparenchymal lesion with an enhancing nodular component, mimicking primary intra-cranial tumor. This appearance is highly atypical and rarely been reported earlier.
Amenazas a la infraestructura escolar pública contemporánea en Ecuador frente a calamidades. Caso: Unidades Educativas del Milenio
Authors: Vélez Verónica Lucía Arévalo 
Published: December 2020

El presente escrito tiene por objeto reflexionar sobre giros posibles que se podrían proponer post pandemia en los edificios escolares públicos contemporáneos del Ecuador a partir de la indagación del caso de estudio de las Unidades Educativas del Milenio (UEM), considerando que estos fueron una apuesta gubernamental que invirtió en el campo de la educación como uno de los puntos relevantes, subrayando el menester de que tanto los niños, como las niñas tengan equidad de acceso en las secciones educativas de primaria y secundaria; con la materialización de nueva infraestructura se mejoraría el nivel de escolaridad y ampliaría la cobertura a nivel educativo de lugares privados de esta formación. No obstante, con eventos inesperados como la COVID-19 y sismos ocurridos en el país, se rompen paradigmas; interpelando a qué mutaciones post pandemia podrían imaginarse en estas novedosas edificaciones y qué adaptaciones sugerirían, lo que posiblemente implicaría analizar nuevas variables, pudiendo a lo mejor ser adaptadas a una reconfiguración de la escuela.
PROPUESTA DE INTERVENCIÓN PSICO-COMUNICATIVA EN UN CONTEXTO DE EMERGENCIA SANITARIA DE UNA INSTITUCIÓN EDUCATIVA PÚBLICA
Authors: Suarez Luna Julio Cesar , Centurion Larrea Angel Johel 
Published: December 2020

El propósito fue elaborar una propuesta psico-comunicativa para modificar creencias irracionales o con tendencia irracional en los estudiantes del VII ciclo de una Institución Educativa de la región Lambayeque en un contexto de emergencia sanitaria por Covid-19, que conlleve a fortalecer la comunicación interna de la organización. La metodología sigue un enfoque mixto con un diseño transformativo secuencial que incluye desde lo cuantitativo, un acercamiento transaccional descriptivo y desde lo cualitativo, lo fenomenológico hasta configurar la propuesta. Las muestras fueron: no probabilística y por conveniencia constituida por 72 estudiantes y; autoseleccionada, por 7 voluntarios. Se utilizaron los métodos histórico lógico, el sistémico estructural, el análisis síntesis y también métodos prácticos con la aplicación del Test psicológico Regopina y el diseño de la propuesta, la misma que fue consolidada a partir de la interpretación de un estudio piloto utilizando la observación. Los resultados de la investigación indican que existen creencias irracionales o con tendencia irracional en los 6 factores evaluados; siendo la creencia C con niveles predominantes de Irracional 31% y 22% tendencia a irracional; asimismo que las categorías “liderazgo” y “compromiso social” de los estudiantes son esenciales para la dinámica de la comunicación interna. Se concluye que si se aplica la Propuesta Psico-Comunicativo centrada en los postulados de la Terapia Racional Emotiva Conductual y el Aprendizaje Servicio Solidario se modificarán significativamente las creencias con niveles irracionales y con tendencia irracional, y se favorece el liderazgo y el compromiso social de los estudiantes dentro de la comunicación interna de la institución.
LOCAL WISDOM OF NIAS TRADITION ORAHU
Authors: Bu’ulolo Boiolifu 
Published: December 2020

Orahu is a tradition of deliberation which is well known in the life system of the people of South Nias, especially in the areas of Maniamölö, Onolalu, To'ene and Mazinö. Orahu is carried out in every important activity in the community, for example discussing problems related to the village, death events, weddings, Fa'ulu and Mambu Ana'a parties (ceremony to increase social status or traditional parties) and others. Orahu to a large extent is called Orahua Mbanua, and is usually performed at Ewali Sawolo or Ewali Orahua (the courtyard in front of the house of the most influential nobleman or Balö Ji'ulu). The Orahua Mbanua was followed by the Si'ulu (nobles), Si'ila (traditional leaders) and Ono Mbanua (the whole community). This research was aimed at describing as well as revealing the local wisdoms of Orahu. This research applied qualitative descriptive method. The data in this study were collected using interview techniques and literature study. The research results shows that Orahu tradition emphasizes on the solidarity and wise decision taking which become a very important aspect in the life system of Nias people. It was in this open forum that all village problems were discussed, and decided how to handle them. In ancient times, Orahu was also used as a trial and for determining punishment for violators of village customs. Orahu is usually done at the bale (village meeting hall), but to a lesser extent, it can also be carried out at home.
PERAN BPK SEBAGAI LEMBAGA PENGAWAS EKSTERNAL PENGELOLAAN KEUANGAN NEGARA
Authors: Kaldera Nawang Xalma , Aulia Muthi , Faza Hani Adila 
Published: December 2020

Salah satu upaya untuk mewujudkan pemerintahan yang bersih dan bebas dari korupsi, kolusi, dan nepotisme (KKN) adalah dengan dibentuknya Badan Pemeriksa Keuangan sebagai lembaga pengawas yang independen. Artikel ini bertujuan untuk menjelaskan peran dan fungsi BPK terhadap keuangan negara, serta sumber dari kewenangan yang dimilikinya.
Penulis menggunakan metode penelitian yuridis normatif dengan studi kepustakaan. Hasil penelitian menunjukkan bahwa BPK melakukan fungsi pengawasannya secara represif dan eksternal, serta berperan besar dalam mendeteksi dan meminimalisir segala kelemahan yang terdapat dalam pengelolaan keuangan negara. BPK sebagai lembaga pengawas yang sumber kewenangannya berasal dari amanat UUD 1945 berfungsi untuk mengevaluasi pengelolaan keuangan negara dan mengurangi kerugian keuangan negara.
Faktor-Faktor Yang Mempengaruhi Keputusan Pembelian Air Mineral Dalam Kemasan Merek Dharma (Studi Kasus pada Konsumen CV. Bahana Tirta Alam Maritim di Kabupaten Sumbawa Besar)
Authors: Abdurrahman Abdurrahman 
Published: December 2020

Penelitian ini bertujuan untuk mengetahui: 1) pengaruh kualitas produk terhadap keputusan pembelian AMDK Merek Dharma. 2) pengaruh harga terhadap keputusan pembelian AMDK Merek Dharma. 3) pengaruh promosi terhadap keputusan pembelian AMDK Merek Dharma. 4) pengaruh kualitas produk, harga, dan promosi secara simultan terhadap keputusan pembelian AMDK Merek Dharma. Model yang digunakan dalam analisis data adalah uji instrumen penelitian, uji asumsi klasik, analisis regresi berganda, dan uji hipotesis. Alat analisis yang digunakan dalam penelitian ini adalah SPSS 16. Data yang digunakan yaitu data primer dan data skunder dengan pengambilan sampel secara purposive sampling. Hasil penelitian menunjukan bahwa 1) kualitas produk berpengaruh positif dan signifikan yang di tunjukan dengan nilai untuk variabel kualitas produk ialah sebesar 0.000 dimana nilai ini < 0,05. 2) Harga berpengaruh positif tetapi tidak signifikan yang ditunjukan dengan nilai untuk variabel harga ialah sebesar 0.820 dimana nilai ini > dari 0,05. 3) Promosi berpengaruh positif dan signifikan yang ditunjukan dengan nilai untuk variabel promosi ialah sebesar 0.005 dimana nilai ini < 0,05. Secara simultan kualitas produk, harga, dan promosi mempengaruhi keputusan pembelian sebesar 31,0%.
Analisis Pengaruh Kepercayaan Dan Keamanan Terhadap Keputusan Pembelian Barang Secara Online
Authors: Jefryansyah Jefryansyah , Muhajirin Muhajirin 
Published: December 2020

ABSTRACT
Seiring dengan kemajuan teknologi informasi, diikuti oleh semakin mudah dan murahnya akses dan paket internet, maka jumlah pengguna internet di Indonesia mengalami peningkatan yang sangat pesat. Perkembangan teknologi informasi ini membuat perubahan perilaku bertransaksi dikalangan masyarakat, yang dari dulunya offline menjadi bertransaksi secara online. Tujuan yang ingin di capai adalah untuk meningkatkan kepercayaan serta keamanan yang di berikan oleh situs jualan online agar minat beli dari konsumen itu sendri meningkat. Data yang digunakan adalah data primer. Sampel penelitian berjumlah 130 responden mahasiswa stie bima yang pernah berbelanja pada toko online. Alat analisis dalam penelitian ini menggunakan regresi linier berganda. Hasil penelitian ini menujukan bahwa kepercayaan berpengaruh positif dan signifikan terhadap keputusan pembelian barang secara online, keamanan berpengaruh positif dan signifikan terhadap keputusan pembelian barang secara online dan terdapat pengaruh positif dan signifikan kepercayaan dan keamanan terhadap keputusan pembelian barang secara online. Sehingga semakin tinggi kepercayaan konsumen, serta semakin tinggi tingkat keamanan yang di berikan, maka semakin tinggi pula keputusan pembelian barang secara online.

Keywords : trust, security, purchase decisions
Pengaruh Model Kooperatif Tipe Course Review Horay dalam Pembelajaran Tematik Terpadu di Sekolah Dasar
Authors: Budianti Indah , Reinita Reinita 
Published: December 2020

Penelitian ini bertujuan untuk mengetahui pengaruh model Kooperatif Tipe Course Review Horay (CRH) terhadap hasil belajar peserta didik dalam pembelajaran tematik terpadu di kelas V SDN Gugus V Kecamatan Sungai Tarab Kabupaten Tanah Datar . Penelitian ini merupakan penelitian kuantitatif dengan jenis penelitian eksperimen dan desain penelitian quasi eksperimen. Pengambilan data sampel dilakukan dengan teknik purposive sampling. Sampel penelitian ini berjumlah 40 orang dengan populasi sebanyak 74 orang. Instrumen yang digunakan dalam menggumpulkan data berupa tes objektif dengan bentuk pilihan ganda. Berdasarkan hasil analisis data menggunakan t-test, diperoleh thitung > ttabel yakni 2,84 > 1,72 pada taraf signifikan 0,05 yang berarti Ha diterima. Dengan demikian, terdapat pengaruh model Kooperatif Tipe Course Review Horay (CRH) dalam pembelajaran tematik terpadu di kelas V SDN Gugus V Kecamatan Sungai Tarab Kabupaten Tanah Datar.
A Comparative Study of Electron and Ion Beam Induced Charge Imaging Techniques in CMOS Failure Analysis
Authors: Chan D.S.H. , Kolachina S. , Ong V.K.S. , Phang J.C.H. , Osipowicz T. , Sanchez J.L. , Watt F. 
Published: December 2020

Abstract
The Ion Beam Induced Charge (IBIC) imaging technique is compared with the conventional Electron Beam Induced Current (EBIC) imaging. The IBIC images were found to be strongly dependent on the ion beam energy and ion beam induced degradation. EBIC images are influenced by overlying metal layers while in the case of IBIC, the choice of ion type and energy determine whether the overlying metal layers influence the IBIC image or not. Ion beam induced degradation, an undesirable feature, was found to be improving images in certain cases.
Characterization of Unfilled Tungsten Plugs on a 0.35μm CMOS Multilevel Metallization Process
Authors: Sur H. , Bothra S. , Strunk Y. , Hahn J. 
Published: December 2020

Abstract
An investigation into metallization/interconnect failures during the process development phase of an advanced 0.35μm CMOS ASIC process is presented. The corresponding electrical failure signature was electrical shorting on SRAM test arrays and subsequently functional/Iddq failures on product-like test vehicles. Advanced wafer-level failure analysis techniques and equipment were used to isolate and identify the leakage source as shorting of metal lines due to tungsten (W) residue which was originating from unfilled vias. Further cross-section analysis revealed that the failing vias were all exposed to the intermetal dielectric spin-on glass (SOG) material used for filling the narrow spaces between metal lines. The outgassing of the SOG in the exposed regions of the via prior to and during the tungsten plug deposition is believed to be the cause of the unfilled vias. This analysis facilitated further process development in eliminating the failure mechanism and since then no failures of this nature have been observed. The process integration approach used to eliminate the failure is discussed.
Pin-Point Transmission Electron Microscopic Analysis Applied to Off-Leakage Failures of a Bipolar Transistor in 0.5μm BiCMOS Devices
Authors: Okihara M. , Tanaka H. , Hirashita N. , Nakamura T. , Okada H. , Hijikata Y. , Shimoda K. 
Published: December 2020

Abstract
Pin-point (specific area) planar transmission electron microscopy (TEM) analysis has been improved to study process-induced defects in recent very large scale integrated (VLSI) devices. The specimens are prepared by a combination of marking failure sites with focused ion beam (FTB) equipment and planar TEM specimen preparation technique. This method provides not only planar observation of localized failures with an accurate observation with high positioning accuracy but also wide range of observable area which is feasible to carry out some application techniques associated with TEM. In particular, it is found to be a powerful method to identify the nature of crystalline defects which cause the failures. This work presents the detailed procedure and demonstrates its successful applicability via studying a leaky bipolar transistor in 0.5μm BiCMOS devices (one failure of more than 4500 transistors). The results clarify the presence of stacking faults, formed during epitaxial growth, between collector and emitter regions in the specific transistor with resistive collector-emitter leakage current.
Contactless Testing of Pulse Propagation in IC’s - A Comparison Between OBIC and Captive-Coupling Detection Techniques
Authors: Hempel K. , Sargsjan G. , Bergner H. 
Published: December 2020

Abstract
Internal IC probing has become an important tool for failure analysis and defect localization. Optical stimulation of logical transients enables the investigation of electrical pulse propagation through IC-regions which are not directly connected to an external input. The signal detection should be as directly as possible to avoid misinterpretation of experimental results, especially for time-resolved measurements. This paper describes the implementation of a capacitive coupling technique on a laser scanning microscope and on a needle prober. Results of static and time-resolved measurements are presented and compared to those obtained by OBIC measurements.
Electron-Beam Analysis of the Turn-On Speed of Grounded-Gate NMOS ESD Protection Transistors During Charged Device-Model Stress Pulses
Authors: Meneghesso G. , Zanoni E. , Luchies J.R.M. , Kuper F.G. , Mouthaan A.J. 
Published: December 2020

Abstract
A commercial Electron-beam measurement set-up has been applied to study triggering and turn-on of NMOS ESD protection transistors. Using this technique turn-on times in the sub halve nanosecond range could be determined for the first time. The measured transient behaviour could be described accurately using SPICE simulations. The measurements have been used to explain the CDM failure mode characteristics of the NMOS protection transistor.
Carbon Coating for Electron Beam Testing and Focus Ion Beam Reconfiguration
Authors: Perdu P. , Perez G. , Dupire M. , Benteo B. 
Published: December 2020

Abstract
To debug ASIC we likely use accurate tools such as an electron beam tester (Ebeam tester) and a Focused Ion Beam (FIB). Interactions between ions or electrons and the target device build charge up on its upper glassivation layer. This charge up could trigger several problems. With Ebeam testing, it sharply decreases voltage contrast during Image Fault Analysis and hide static voltage contrast. During ASIC reconfiguration with FIB, it could induce damages in the glassivation layer. Sample preparation is getting a key issue and we show how we can deal with it by optimizing carbon coating of the devices. Coating is done by an evaporator. For focused ion beam reconfiguration, we need a very thick coating. Otherwise the coating could be sputtered away due to imaging. This coating is use either to avoid charge-up on glassivated devices or as a sacrificial layer to avoid short circuits on unglassivated devices. For electron beam Testing, we need a very thin coating, we are now using an electrical characterization method with an insitu control system to obtain the right thin thickness. Carbon coating is a very cheap and useful method for sample preparation. It needs to be tuned according to the tool used.
AC Hot-Carrier Effects Characterization by Circuit Modification Using Focused Ion Beam
Authors: Yoo Yong-koo , Lee Chong-ha , Lee Jung-hwan 
Published: December 2020

Abstract
Focused Ion Beam (FIB) is used to modify a ring-oscillator circuit to enable the direct characterization of AC hot-carrier effects. Probe access to internal device nodes is necessary to find out the amount of individual device degradation resulting from AC hot-carrier stress. The circuit modification on an existing wafer by FIB enables the direct measurement of individual device in the circuit before and after AC hotcarrier stressing without resorting to new mask sets and silicon wafer processing for new hotcarrier reliability test circuits that can provide realistic stress voltage waveform. Small pads produced by FIB have small acceptable impact on the stress waveform of the circuit and they still allow accurate measurement of the internal device nodes. FIB’s ‘cut and paste’ technique is used to form these probe pads. Some suggestions are made for the proper FIB work in this paper. The results of AC hot-carrier tests with the circuit modified by FIB are also presented with some illustrative figures.
Local Electrical Thickness-Mapping of Thin Oxides with Conducting Atomic Force Microscopy
Authors: Olbrich Alexander , Ebersberger Bernd , Boit Christian 
Published: December 2020

Abstract
In this work, we introduce Conducting Atomic Force Microscopy (C-AFM) as a novel technique for the determination of the local effective electrical oxide thickness with a lateral resolution of a few nanometers and a thickness resolution in the sub ångström range. In this technique the conductive tip of an AFM, which is in mechanical contact with the bare oxide surface, is used as metal electrode to define a local MOS structure with nanometer lateral extension. Oxide thickness determination is done by fitting the local I-V curves to the well known Fowler Nordheim tunneling equation with a thickness sensitivity in the sub-ångström range. In addition, tunneling current images at constant applied voltage can be obtained simultaneously to the oxide surface topography. We present a scheme which allows the conversion of the tunneling current images into maps of the local electrical oxide thickness. Several examples demonstrate the versatile and far-reaching application of C-AFM to R&D and failure analysis
A Novel Technique for Detecting High Resistance Fault Using Electroplating
Authors: Wang H. S. , Chou J. H. , Hung H. C. , Lui H. H. , Yang W. H. , Sun L. C. , Lin C. J. 
Published: December 2020

Abstract
This paper will demonstrate a new copper (Cu) electroplating technique [1] for accurately isolating high resistance fault locations with resistance below K-order ohms. This phenomenon is achieved by having different electric field intensity leading to different copper deposition rate on the sample surface. From experiments, the interface between the thicker electroplated and thinner electroplated copper layer on the sample surface accurately indicates the high resistance fault location. Also, Optical Microscope (OM) and Focused Ion Beam (FIB) are used to inspect the localized fault site of the electroplated sample. Furthermore, this technique, Electro-Plating Localization Method (EPLM), can process several samples or the entire wafer at the same time. In addition, this technique can be applied in the fully open cases of test vehicles with logical circuit as voltage contrast localization method.
Detecting the 10 Angstroms That Change MEMS Performance
Authors: Schutte Erika , Martin Jack 
Published: December 2020

Abstract
An ellipsometry based measurement protocol was developed to evaluate changes to MEMS sensor surfaces which may occur during packaging using unpatterned test samples. This package-level technique has been used to measure the 0-20 Angstrom thin films that can form or deposit on die during the packaging process for a variety of packaging processing conditions. Correlations with device performance shows this to be a useful tool for packaged MEMS device and process characterization.
Investigation of Low-Energy Focused Ion Beam Milling for Scanning Capacitance Microscopy Sample Preparation
Authors: Fillmore David K. , Wang Shixin 
Published: December 2020

Abstract
Scanning capacitance microscopy (SCM) has become a valuable tool for failure analysis in integrated circuit manufacture. The ability to perform two-dimensional dopant distribution analysis on small, specific structures has been hampered, however, by the imprecision of current polishing techniques. Utilization of focused ion beam (FIB) milling instrumentation to perform precise cross sectioning of specific structures is preferable to manual polishing, although SCM data has not been forthcoming, due in part at least to the thicker amorphous silicon layer. This work examines the thickness of the amorphous silicon layers generated by various sample preparation methods, including conventional polishing, FIB milling, and low-energy FIB milling. In addition, this work provides SCM comparisons of the low energy FIB milling preparation procedure and conventional polishing.
Low-K Time Dependent Dielectric Breakdown Failure Analysis Utilizing SEM Image Comparison for Defect Isolation
Authors: Demarest J. , Chanda K. , Dunn D. , Wang Y. 
Published: December 2020

Abstract
This paper describes a case study of a back end of the line low-k time dependent dielectric breakdown failure analysis. Due to the extremely large size of the stressed test structure, isolation of the defect and root cause determination can be quite difficult. In this particular study the defect was determined to lie in an approximately 100 um2 area and top down SEM inspection did not indicate any obvious defect. In an effort to further isolate the defect, an image comparison analysis was performed to highlight the differences between the fail area and an assumed good area of the test structure. A local area within the failing region was identified and imaged in cross section via TEM. The source of contamination which caused the fail was identified and appropriate process actions were implemented to remove the defect mechanism.