bluuebunny/crossref_metadata_2025_split huggingface dataset:
3D IC/Stacked Device Fault Isolation Using 3D Magnetic Field Imaging
Authors: Orozco A. , Gagliolo N.E. , Rowlett C. , Wong E. , Moghe A. , Gaudestad J. , Talanov V. , Jeffers A. , Torkashvan K. , Wellstood F.C. , Dobritz Stephan , Boettcher Mathias , Cawthorne A.B. , Infante F. 
Published: December 2020

Abstract
The need to increase transistor packing density beyond Moore's Law and the need for expanding functionality, realestate management and faster connections has pushed the industry to develop complex 3D package technology which includes System-in-Package (SiP), wafer-level packaging, through-silicon-vias (TSV), stacked-die and flex packages. These stacks of microchips, metal layers and transistors have caused major challenges for existing Fault Isolation (FI) techniques and require novel non-destructive, true 3D Failure Localization techniques. We describe in this paper innovations in Magnetic Field Imaging for FI that allow current 3D mapping and extraction of geometrical information about current location for non-destructive fault isolation at every chip level in a 3D stack.
Near-Field Scanning Optical Microscopy for Through-Silicon Imaging and Fault Isolation of Integrated Circuits
Authors: Giridharagopal R. , Eiles T.M. , Niu B. 
Published: December 2020

Abstract
We present the first known images acquired using near-field scanning optical microscopy (NSOM) through backside silicon on functional integrated circuit samples with higher resolution than conventional fault isolation (FI) tools. NSOM offers the possibility of substantially-improved lateral resolution independent of excitation wavelength. Current FI techniques have challenged the resolution limits of conventional optics technology, even in the best solid immersion lens (SIL) to date. This poses a problem for future process technology nodes. This resolution barrier is a by-product of the diffraction limit. In Fourier terms, a conventional lens filters out highfrequency information and thus limits the resolution. In NSOM, by placing a tip with an aperture in extreme proximity to the surface it is possible to capture the near-field light that contains high-frequency information, thereby circumventing the diffraction limit. The tangible benefit is that the resolution is substantially improved. We show that NSOM can be used in backside subsurface imaging of silicon, mirroring the paradigm used in typical optical FI. We present optical reflectance data through ~100 nm of remaining backside Si on functional 22 nm CMOS IC parts with lateral resolution approaching 100 nm. We then discuss potential methods for using NSOM in practical backside fault isolation applications and for improving signal-to-noise ratio (SNR).
Visible Light LVP on Bulk Silicon Devices
Authors: Beutler Joshua , Hodges V. Carter , Clement J. Joseph , Stevens Jeffery , Cole Edward I. , Silverman Scott , Chivas Robert 
Published: December 2020

Abstract
Visible light laser voltage probing (LVP) for backside improved optical spatial resolution is demonstrated on ultrathinned bulk Si samples. A prototype system for data acquisition, a method to produce ultra-thinned bulk samples as well as LVP signal, imaging, and waveform acquisition are described on bulk Si devices. Spatial resolution and signal comparison with conventional, infrared LVP analysis is discussed.
Non-Destructive PCB Reverse Engineering Using X-Ray Micro Computed Tomography
Authors: Asadizanjani Navid , Shahbazmohamadi Sina , Tehranipoor Mark , Forte Domenic 
Published: December 2020

Abstract
Reverse engineering of electronics systems is performed for various reasons ranging from honest ones such as failure analysis, fault isolation, trustworthiness verification, obsolescence management, etc. to dishonest ones such as cloning, counterfeiting, identification of vulnerabilities, development of attacks, etc. Regardless of the goal, it is imperative that the research community understands the requirements, complexities, and limitations of reverse engineering. Until recently, the reverse engineering was considered as destructive, time consuming, and prohibitively expensive, thereby restricting its application to a few remote cases. However, the advents of advanced characterization and imaging tools and software have counteracted this point of view. In this paper, we show how X-ray micro-tomography imaging can be combined with advanced 3D image processing and analysis to facilitate the automation of reverse engineering, and thereby lowering the associated time and cost. In this paper, we demonstrate our proposed process on two different printed circuit boards (PCBs). The first PCB is a four-layer custom designed board while the latter is a more complex commercial system. Lessons learned from this effort can be used to both develop advanced countermeasures and establish a more efficient workflow for instances where reverse engineering is deemed necessary. Keywords: Printed circuit boards, non-destructive imaging, X-ray tomography, reverse engineering.
Plasma FIB DualBeam Delayering for Atomic Force NanoProbing of 14 nm FinFET Devices in an SRAM Array
Authors: Alvis Roger , Landin Trevan , Rue Chad , Carleson Peter , Sidorov Oleg , Erickson Andrew , Zumwalt Sean , Dixon-Warren Sinjin , Liu Wan-Yi , Chang Shih-Hsin , Chang Te-Fu , Yen Chia-Hsiang , Kuo Pau-Sheng , Chu Chih-Hsun 
Published: December 2020

Abstract
The result of applying normal xenon ion beam milling combined with patented DX chemistry to delayer state-of-theart commercial-grade 14nm finFETs has been demonstrated in a Helios Plasma FIB DualBeam™. AFM, Conductive-AFM and nano-probing with the Hyperion Atomic Force nanoProber™ were used to confirm the capability of the Helios PFIB DualBeam to delayer samples from metal-6 down to metal-0/local interconnect layer and in under two hours produce a sample that is compatible with the fault isolation, redetection, and characterization capabilities of the AFP. IV (current-voltage) curves were obtained from representative metal-0 contacts exposed by the PFIB+DX delayering process and no degradation to device parameters was uncovered in the experiments that were run. Compared to mechanically delayering samples, the many benefits of using the PFIB+DX process to delayer samples for nano-probing were conclusively demonstrated. Such benefits, include sitespecificity, precise control over the amount of material removed, &gt;100μm square DUT (device under test) area, nm-scale flatness over the DUT area, nm-scale topography between contacts and the surrounding ILD, uniform conductivity across the DUT area, all with no obvious detrimental effects on typical DC device parameters measured by nano-probing.
Power Spectrum Analysis
Authors: Tangyunyong Paiboon , Cole Edward I. , Loubriel Guillermo M. , Beutler Joshua , Udoni Darlene M. , Paskaleva Biliana S. , Buchheit Thomas E. 
Published: December 2020

Abstract
We present a new, non-destructive electrical technique, Power Spectrum Analysis (PSA). PSA as described here uses off-normal biasing, an unconventional way of powering microelectronics devices. PSA with off-normal biasing can be used to detect subtle differences between microelectronic devices. These differences, in many cases, cannot be detected by conventional electrical testing. In this paper, we highlight PSA applications related to aging and counterfeit detection.
Non-Destructive 3D Failure Analysis Work Flow for Electrical Failure Analysis in Complex 2.5D-Based Devices Combining 3D Magnetic Field Imaging and 3D X-Ray Microscopy
Authors: Orozco Antonio , Talanova Elena , Jeffers Alex , Rusli Florencia , Zee Bernice , Qiu Wen , ZulkifliAllen Gu Syahirah MD , Mora Juan Atkinson 
Published: December 2020

Abstract
Industry and market requirements keep imposing demands in terms of tighter transistor packing, die and component real estate management on the package, faster connections and expanding functionality. This has forced the semiconductor industry to look for novel packaging approaches to allow for 3D stacking of transistors (the so called “More than Moore”). This complex 3D geometry, with an abundance of opaque layers and interconnects, presents a great challenge for failure analysis (FA). Three-dimensional (3D) magnetic field imaging (MFI) has proven to be a natural, useful technique for non-destructively mapping 3D current paths in devices that allows for submicron vertical resolution. 3D X-ray microscopy (XRM) enables 3D tomographic imaging of advanced IC packages without the need to destroy the device. This is because it employs both geometric and optical image magnifications to achieve high spatial resolution. In this paper, we propose a fully nondestructive, 3D-capable workflow for FA comprising 3D MFI and 3D XRM. We present an application of this novel workflow to 3D defect localization in a complex 2.5D device combining high bandwidth memory (HBM) devices and an application specific integrated circuit (ASIC) unit on a Si interposer with a signal pin electrical short failure.
Advanced Non-Destructive Fault Isolation Techniques for PCB Substrates Using Magnetic Current Imaging and Terahertz Time Domain Reflectometry
Authors: Choi Daechul , Kim Yoonseong , Kim Jongyun , Kim Han 
Published: December 2020

Abstract
In this paper, we demonstrate cases for actual short and open failures in FCB (Flip Chip Bonding) substrates by using novel non-destructive techniques, known as SSM (Scanning Super-conducting Quantum Interference Device Microscopy) and Terahertz TDR (Time Domain Reflectometry) which is able to pinpoint failure locations. In addition, the defect location and accuracy is verified by a NIR (Near Infra-red) imaging system which is also one of the commonly used non-destructive failure analysis tools, and good agreement was made.
Automated Detection of Pin Defects on Counterfeit Microelectronics
Authors: Ghosh Pallabi , Forte Domenic , Woodard Damon L. , Chakraborty Rajat Subhra 
Published: December 2020

Abstract
Counterfeit electronics constitute a fast-growing threat to global supply chains as well as national security. With rapid globalization, the supply chain is growing more and more complex with components coming from a diverse set of suppliers. Counterfeiters are taking advantage of this complexity and replacing original parts with fake ones. Moreover, counterfeit integrated circuits (ICs) may contain circuit modifications that cause security breaches. Out of all types of counterfeit ICs, recycled and remarked ICs are the most common. Over the past few years, a plethora of counterfeit IC detection methods have been created; however, most of these methods are manual and require highly-skilled subject matter experts (SME). In this paper, an automated bent and corroded pin detection methodology using image processing is proposed to identify recycled ICs. Here, depth map of images acquired using an optical microscope are used to detect bent pins, and segmented side view pin images are used to detect corroded pins.
Time-Resolved Imaging of VLSI Circuits Using a Single-Point Single-Photon Detector and a Scanning Head
Authors: Stellari Franco , Song Peilin , Iwaki Yoshitaka , Kim Stanley , Villalobos Manuel 
Published: December 2020

Abstract
In this paper, we present the first prototype of a Scanning Time-Resolved Emission (STRE) system consisting of a high-sensitivity, low-noise, and low-jitter single-point Superconducting Single-Photon Detector (SSPD) combined with a specialized scanning head of a Laser Scanning Microscope (LSM). This idea was first proposed in late 2006 [1] but required the right combination of detector, customization, and collaboration with a tool vendor to get to fruition. It should be understood that this is still a prototype system under development and significant improvements in acquisition time, resolutions, and performance are expected in the near future. In this paper, we will also present the first preliminary results acquired using a test chip fabricated in 32 nm SOI.
Failure Analysis of FinFET Circuitry at GHz Speeds Using Voltage-Contrast and Stroboscopic Techniques on a Scanning Electron Microscope
Authors: Vickers James , Somani Seema , Freeman Blake , Carleson Pete , Tùma Lubomír , Unèovský Marek , Hlavenka Petr 
Published: December 2020

Abstract
We report on using the voltage-contrast mechanism of a scanning electron microscope to probe electrical waveforms on FinFET transistors that are located within active integrated circuits. The FinFET devices are accessed from the backside of the integrated circuit, enabling electrical activity on any transistor within a working device to be probed. We demonstrate gigahertz-bandwidth probing at 10-nm resolution using a stroboscopic pulsed electron source.
The Investigation of Oven Contamination and Corresponding Methodology
Authors: Hsieh W. F. , Lin Henry , Chen Vincent , Liu Jun , Ou Irene , Lou Y. S. 
Published: December 2020

Abstract
Contamination and particle reduction are critical to semiconductor process control. Lots of failure analysis had been focused on finding the root cause of the particle and contamination. The particle and contamination effect were also easily found in circuit probing (CP) process, and therefore induced yield loss and wafer scrap. In the first part of this paper, an oven contamination case was studied. The second part of this paper focus on oven contamination monitoring.
In the beginning, a die flying failure was papered at the stage of blue tape and die sawing. This event clearly indicated bad adhesion between die and plastic tape. This bad adhesion was suspected to be a particle/contamination layer formed on bad die surface. Three failure analysis (FA) approaches were performed to find out the root cause. The SEM/EDS result identified the main elements of big particle, but that is insufficient to identify the root cause. The OM/FTIR, however, showed the contamination may be related to polydimethylsiloxane (PDMS). The last failure analysis was the time of fly Secondary Ion Mass Spectrometer (TOF-SIMS), the result confirmed that there was a thin PDMS layer formed on the contaminated bad die surface. The high temperature CP process induced PDMS is believed to be the contamination root cause. In order to prevent the oven contamination event, a methodology based on contact angle and wettability of Si matrix sample was set up for regular monitor in oven operation. The details of contact angle test (CAT) sample preparation, measurement and analysis results were also discussed in this paper.
FLEXIBILIZAÇÃO DO CRITÉRIO DE HIPOSSUFICIENCIA NA CONCESSÃO DO BENEFÍCIO DE PRESTAÇÃO CONTINUADA (BPC-LOAS)
Authors: Ferreira Icaro , Reis Jacqueline 
Published: December 2020

A Constituição Federal de 1988, no intuito de proporcionar uma melhor condição de vida para as pessoas portadoras de deficiência e idosos de baixa renda, assegurou o direito ao recebimento de um salário mínimo mensal, oriundo do Benefício de Prestação Continuada (BPC), também conhecido pelo nome da lei que o regulamenta, LOAS. Diante disso, o presente trabalho tem como objetivo analisar o BPC e seus critérios de concessão, dando um especial enfoque na possibilidade de flexibilização do critério de hipossuficiência que tem gerado grande repercussão devido a discordâncias da doutrina e jurisprudência com o requisito objetivo previsto no art. 20, §3 da Lei 8.742/93. A abordagem foi realizada utilizando o método dedutivo e pesquisa bibliográfica com caráter descritivo qualitativo e demonstrou-se, através da apresentação de argumentos, o contexto histórico da assistência social, o benefício de prestação continuada e suas espécies e as quatro teses que defendem a flexibilização do critério de hipossuficiência econômica.
Authors: Tandi Dan , Syahrul Syahrul , Erika Kadek Ayu 
Published: December 2020

Introduction: Documentation of nursing care is written evidence of care provided by nurses to patients. Quality nursing care documentation as a reflection of the quality of nursing care. Objective: To find out the quality of documentation of nursing care about how to carry out documentation of nursing care and how to complete documentation of nursing care in hospitals. Method: Literature search was carried out with 4 databases namely PubMed, ProQuest, Wiley Online Library and Google Scholar with the keywords "nursing documentation", "quality", "completeness of documentation" and "nursing care". Articles that met the inclusion criteria are articles published between 2009 and 2019, full text, in English, quantitative. Results: 6 articles with the classification of the implementation of documentation of nursing care and completeness of documentation of nursing care. Conclusion: The quality of documentation of nursing care in hospitals is still low. Therefore, to improve the quality of documentation of nursing care, it is necessary to conduct training, develop awareness, direction, and control, ongoing control, improve organizational culture, change nursing documentation from paper-based to electronic, reduce the workload of nurses by adding nursing staff and policies incentives from hospital management.
Keywords: quality, documentation, nursing care
Process Evaluation and Experience Sharing on Utilizing Information Communication Technologies and Digital Games in a Large Community Family Health Event: Hong Kong Jockey Club SMART Family-Link Project
Authors: Sit Shirley M. M. , Lai Agnes Y. K. , Kwok Tai-on , Wong Hoi-wa , Wong Yiu-lun , Lam Eliza Y. W. , Chan Judy Y. W. , Kong Florence S. W. , Cham Kerin , Ng Charles K. K. , Yip Teresa , Tsui Terry S. Y. , Wong Chiu-man , Wong Bell C. L. , Tang Wai-yan , Yam Pui-wah , Chui Macy , Wan Alice , Kwok Yu-kwong , Lam Tai-hing 
Published: December 2020

Background: Information communication technologies (ICT) are increasingly used in health promotion, but integration is challenging and involves complex processes. Large community health promotion events are often held but the experiences and processes have rarely been evaluated and published. No reports have described and systematically evaluated an ICT-supported health promotion event using digital games.Objective: We evaluated the development and implementation of a large community family health promotion event with ICT integration to promote family happiness with collaboration between academia (The University of Hong Kong) and the social (family) service sector, and collected feedback from participants and social service workers.Methods: We (i) conducted a systematic process evaluation, (ii) administered an on-site questionnaire survey on participant satisfaction and feedback, and (iii) collected post-event qualitative feedback from social workers on using new technologies, digital game design and overall experiences.Results: Fourteen digital games were designed and run in booths at the event by 12 non-governmental social service organizations and academia. Four gaming technologies were utilized: chroma key (green screen), somatosensory (kinect and leap motion techniques), augmented reality and virtual reality. 1,365 participants joined the event, in which 1,257 from 454 families were recruited and pre-registered through 12 NGOs. About 39.3% were male and more than half (53.3%) were aged 18 years and above. About 3,487 game booth headcounts were recorded. Games using virtual reality, kinect motion and green screen technologies were most liked. The average game satisfaction score was high (4.5 out of 5). Social service workers reported positive experiences with using new technologies in health promotion, and interests in future collaborations involving more ICT.Conclusions: Our systematic evaluation showed successful integration of ICT components in the health promotion event. This event, most likely the first of its kind, served as a capacity building and knowledge transfer platform for interdisciplinary co-sharing and co-learning of new technologies. It provided a solid foundation for further academic and social service partnerships and should be a useful model for similar community events and their evaluation. Further development and integration of ICT for health promotion among social service organizations with comprehensive evaluation are warranted.
CONSORCIAÇÕES ALTERNATIVAS PARA A CULTIVAR TBIO LENOX (Triticum aestivum L.) EXCLUSIVO PARA PASTEJO
Authors: De Mello Facco José Nilton , Medianeira Machado Juliana , Lampert Batista Facco Fernanda , Silveira Diógenes , Kunz Anderson 
Published: December 2020

Com o intuito de ofertar forragem de forma precoce e por um maior período de tempo, recentemente foi lançada no mercado uma cultivar de trigo direcionada exclusivamente para pastejo. Dado o exposto, o presente estudo teve como objetivo avaliar as características agronômicas da cultivar TBIO Lenox (Triticum aestivum L.) exclusiva para pastejo em cultivo extreme ou consociado com outros sistemas forrageiros. O delineamento experimental utilizado foi o de blocos ao acaso com seis tratamentos e quatro repetições. Os tratamentos foram constituídos por sistemas forrageiros: trigo (Triticum aestivum L.) cv. TBIO Lenox, aveia preta (Avena strigosa L.) cv. BRS 139 Neblina e ervilhaca (Vicia sativa L.) cv. Comum em cultivo extreme ou consorciadas. Os dados foram submetidos a análise de variância, teste de Tukey à 5% de probabilidade de erro e análise de agrupamento entre os sistemas forrageiros. Com base nos resultados obtidos, foi possível identificar que a cultivar de trigo exclusiva para pastejo apresenta-se como uma boa alternativa forrageira com acrescemos na produção de forragem quando consorciada a leguminosa ou gramínea, sendo indicada em práticas de consorciações economicamente viáveis. Sistemas forrageiros consorciados possibilitaram maior disponibilidade de N aos sistemas forrageiras, destacando a consorciação de trigo com ervilhaca, indicada como estratégia na mitigação da utilização de adubação nitrogenada.
La República Aymara de Laureano Machaka
Authors: Portugal Pedro 
Published: December 2020

Abstract/short description:
The article tries to analyze an incident from the 1950s in Bolivia. In June 1956, an Aymara peasant and activist named Laureano Machaka with a group of followers announced the creation of Aymara Republic in the Camacho Province. This took place in a period of significant turmoil in Bolivia, when political infighting between right- and left-wing groups has led to total disorder in La Paz. The creation of the Aymara Republic can be related to the rise of the peasant and Aymara movements. The Republic's existence was cut short, as Laureano Machaka was killed later in the same year.
Short description written by Michał Gilewski
Rituales altiplánicos y cuzqueños en Atacama, acuerdos i tensiones: el caso de Turi
Authors: Aldunate del Solar Carlos 
Published: December 2020

Abstract/short description:
The archaeological sites of Pukara de Turi and Likan lie at the Atacama Desert in the Autofagasta province, Chile. In both of those sites limited traces of "Altiplano" and Cuzquean influences can be found. At first, only Altiplano influences were present. Only during 16th century Inca influences have appeared, which is evidenced by the presence of Inca kallankas structures.
Short description written by Michal Gilewski