bluuebunny/crossref_metadata_2025_split huggingface dataset:
Magnetic Emission Mapping for Passive Integrated Components Characterisation
Authors: Crépel O. , Bouttement Y. , Descamps P. , Goupil C. , Perdu P. , Desplats R. , Beaudoin F. , Guirardel M. 
Published: December 2020

Abstract
We developed a system and a method to characterize the magnetic field induced by circuit board and electronic component, especially integrated inductor, with magnetic sensors. The different magnetic sensors are presented and several applications using this method are discussed. Particularly, in several semiconductor applications (e.g. Mobile phone), active dies are integrated with passive components. To minimize magnetic disturbance, arbitrary margin distances are used. We present a system to characterize precisely the magnetic emission to insure that the margin is sufficient and to reduce the size of the printed circuit board.
Sample Preparation Techniques for Analysis and Debug of Circuits with Cu Inductors and Thick Organic Dielectric
Authors: Sutton Mauri , Kiefer Scott , Wilson Syd , Nair Manoj , Sanders Paul , Steele John , Paulson Wayne 
Published: December 2020

Abstract
This paper describes techniques to prepare integrated circuit (IC) samples, containing a Thick Organic Dielectric (TOD) over Cu inductors, for Scanning Electron Microscopy (SEM) or Focused Ion Beam (FIB) editing. Our technique utilizes mechanical polishing and UV laser ablation in lieu of chemical decapsulation and deprocessing.
Laser Interferometer Specimen Preparation of PCB Assembled Components at Second Level Interconnect for In-plane Shear Strain Measurements
Authors: Cunningham William J. 
Published: December 2020

Abstract
Preparing Laser Interferometer (Moiré) samples involves several steps that can be time consuming and labor intensive. This process requires diligence and discipline in order to create a successful sample. Previous Moiré sample preparation methods have yielded &lt;30% for component characterization. The sample preparation presented in this document has increased yield to approximately 90%. Improvements are the result of optimized tooling and a novel epoxy application technique. Prepared laser interferometer samples are used to subsequently reveal inplane strain and residual stresses present at the component of interest. Two applications that benefit from Moiré are as follows: 1) inelastic strains due to deflection or thermal cycling, and 2) elastic coefficient of thermal expansion effects resulting from high temperature cure to ambient temperature. In the first case, the inelastic strain is typical due to permanent residual deformation. In the second case, the thermal expansion effects are the result of growing and bending and then coming back to normal position. In this presentation both the ambient (inelastic) and the high temperature (elastic) sample preparation techniques will be covered in detail, thus providing the end user great success in capturing strain data.
A Novel Fault Isolation Technique for Identifying Deep Sub-Micron Defects
Authors: Bundhoo Fayik M. , Kasivisvanatha Soundaranathan 
Published: December 2020

Abstract
A novel failure analysis approach has been developed to isolate and characterize deep sub micron defects in P&lt;100&gt;- silicon lattice. This technique utilizes unique wet chemical deprocessing and side wall cleaning in conjunction with focused ion beam milling to isolate a single vertical failing DMOS source contact from a parallel array of 462K contacts covered with oxide dielectric and top metal layers. The two methods of analysis and root cause of crystalline lattice dislocation in a vertical DMOS transistor are discussed. TEM examination of implanted dopant interface was carried out in order to determine the nature and origin of lattice dislocations. A study1 indicates that lattice dislocations are generated by deep boron and arsenic implants that are not adequately annealed. In our analysis, these dislocations were observed as loop pairs causing low-level leakage that did not initially allow the part to fail. However, these silicon lattice dislocations do pose reliability issues.
Failure Analysis Case Study in 0.18μm Flash Memory Devices and Root Cause Identification
Authors: Chen Wen-Rong , Wu Mao-Sheng , Chu Chi-Ling 
Published: December 2020

Abstract
This report summarizes the analysis of 0.18µm Flash ROM technology qualification failure cases at Macronix. The cases include single cell read failures, erase/program function failures, and high temperature storage test failures. Electrical analysis, EMMI and physical check by chemical de-processing, parallel lapping, FIB, SEM, PVC and TEM techniques were employed to identify the failure mechanisms, root causes, and solutions. From this study, improvements were achieved in process defect density, test fault coverage and product reliability of the 0.18µm Flash ROM technology.
Mechanical and Electrical Characterization of an IC Bond Pad Stack Using a Novel In-Situ Methodology
Authors: Hartfield C.D. , Broz J.J. , Moore T.M. 
Published: December 2020

Abstract
The semiconductor industry’s efforts to integrate dielectrics into Si devices has driven characterization efforts to address the challenges presented by adoption of this new class of materials. Abundant literature exists on the considerations required for CMP process recommendations for successful fabrication, adhesion requirements for both fabrication and assembly, and considerations for interconnect structure to enable wire-bonding. There is also interest in understanding the wafer level test challenges presented by the low-K devices. In addition to the typical concerns about reaching the best compromise of good contact resistance (CRES) performance with a minimum amount of probe damage, low-K materials present an increased risk of compromising the dielectric or barrier layers beneath bond pads. For a better understanding of the dynamic contact phenomenon of probing and its effect on the integrated circuit (IC) metal stack, a specialized in-situ nanomanipulator tool was developed for simultaneous visualization of probing events with data recording of electrical and load measurements. This paper describes initial research with this new tool.
A Multi-Stage Approach to Fault Identification Using Fault Tuples
Authors: Desineni R. , Vogels T. J. , Dwarakanath K. N. , Zanon T. , Blanton R. D. , Maly W. 
Published: December 2020

Abstract
We present a generalized method to attack fault diagnosis at the logic level that aims at localizing and differentiating fault types. In particular, we present an application of this method that aids in distinguishing opens and two-line shorts. While past work has addressed distinction between shorts and opens, we present an algorithm to generate more test patterns to narrow down the diagnosis callout based on type or location. In general, we are not limited to a few fault models as our description of the logic misbehavior is built on fault tuples. This becomes important in the area of fault and defect characterization. Results based on logic validation and SPICE simulations of extracted netlists indicate the usefulness and efficiency of our approach.
The Microstructure Evolution of Corrosion Phenomenon on Aluminum Bond Pads
Authors: Luo Jian-Shing , Lo Hui-Min , Russell Jeremy D. 
Published: December 2020

Abstract
X-ray photoelectron spectroscopy (XPS) is a very popular tool for identification of the chemical state of fluorine contamination on aluminum (Al) bond pads. To date, as far as the authors are aware the detailed microstructures of fluorine corrosion on bond pads have not been reported. This paper reports the microstructure evolution of fluorine corrosion on bond pads in a plastic box under specific environment conditions by using transmission electron microscopy (TEM), optical microscopy, focused ion beam and scanning electron microscopy (SEM). The elemental distributions and chemical bonding were performed by using Gatan Image Filter/TEM, energy dispersive X-ray/Scanning TEM (STEM), Auger electron spectroscopy and XPS, respectively. On Al pads with 35 atomic %, fluorine residual, corrosion was observed after around 10 days of storage and became more severe with time. The corrosion layers consist of nano-crystalline and amorphous for both single and double-layer structures.
Studies on a Failure Analysis Flow of Surface Contamination, Corrosion, and Underetch on Microchip Al Bondpads in Wafer Fabrication
Authors: Younan Hua 
Published: December 2020

Abstract
A failure analysis flow is developed for surface contamination, corrosion and underetch on microchip Al bondpads and it is applied in wafer fabrication. SEM, EDX, Auger, FTIR, XPS and TOF-SIMS are used to identify the root causes. The results from carbon related contamination, galvanic corrosion, fluorine-induced corrosion, passivation underetch and Auger bondpad monitoring will be presented. The failure analysis flow will definitely help us to select suitable methods and tools for failure analysis of Al bondpad-related issues, identify rapidly possible root causes of the failures and find the eliminating solutions at both wafer fabrication and assembly houses.
Scanning Capacitance Microscopy Application for Bipolar and CMOS Doping Issues in Semiconductor Failure Analysis
Authors: Lin Coswin , Ou Homy , Chao Chia-Hsing , Lu Shey-Shi 
Published: December 2020

Abstract
Scanning Capacitance Microscopy (SCM) has been extensively used for identifying doping issues in semiconductor failure analysis. In this paper, the root causes of two recent problems -- bipolar beta loss and CMOS power leakage -- were verified using SCM images. Another localization method, layer-by-layer circuit repair with IROBIRCH detection, was also utilized to locate possible defects. The resulting failure mechanism for bipolar beta loss is illustrated with a schematic cross section, which shows the leakage path from the emitter to the base. In the case of CMOS power leakage, the abnormal implantation of the Pwell region was identified with the Plane view SCM image.
Analog Circuit Failure Analysis Using Time-Resolved Emission
Authors: Cain B.J. , Woods G.L. , Syed A. , Herlein R. , Nomura Toshihiro 
Published: December 2020

Abstract
Time-Resolved Emission (TRE) is a popular technique for non-invasive acquisition of time-domain waveforms from active nodes through the backside of an integrated circuit. [1] State-of-the art TRE systems offer high bandwidths (&gt; 5 GHz), excellent spatial resolution (0.25um), and complete visibility of all nodes on the chip. TRE waveforms are typically used for detecting incorrect signal levels, race conditions, and/or timing faults with resolution of a few ps. However, extracting the exact voltage behavior from a TRE waveform is usually difficult because dynamic photon emission is a highly nonlinear process. This has limited the perceived utility of TRE in diagnosing analog circuits. In this paper, we demonstrate extraction of voltage waveforms in passing and failing conditions from a small-swing, differential logic circuit. The voltage waveforms obtained were crucial in corroborating a theory for some failures inside an 0.18um ASIC.
A New Non Destructive Method to Screen for Corona/Breakdown of a Transformer Core
Authors: Molle Gary M 
Published: December 2020

Abstract
There is a problem with testing torroidal or encapsulated transformers for their DWV characteristics in that the core is normally inaccessible. For high voltage transformers, knowing whether or not the core is sufficiently insulated to prevent breakdown is crucial to the component reliability. If there is a lack of dielectric material between any winding set and the core, it is impossible to determine potential failure susceptibility by the normal DWV testing means. Using MILT- 27’s “Corona discharge” test circuits for this determination requires special equipment, “corona free” capacitors, and has other issues. I have developed a screening method using a Fluorescent Lamp Supply “drive box” with a sinusoidal output from 2 to 7KVpp at or above 25 KHz that will expose corona in transformers when directly back driven into the secondary windings. Transformers that do not have sufficient insulation between winding sets and windings to core can develop corona discharge which can be seen on an oscilloscope via a commercially available isolated current probe as high frequency spikes modulating the original sine wave, heard on an AM radio the same as lightning or static discharge, or cause complete collapse of the voltage at test voltages within seconds when tested up to the rated voltage of the particular winding set. A sample set of 80 transformers was tested, and a 30 percent failure rate was discovered.
Hot Electron Induced Fiber Optic Transistor Beta Degradation, Recovery, and Dynamics of Hydrogen Atoms at the Si-SiO2 Interface Layer
Authors: Seo Kuhn , Monarch Jim , Dunlap Brett 
Published: December 2020

Abstract
Hot electron induced beta degradation has been observed from fiber optic transistors after multiple parametric testing. Beta degradation originated from increasing base leakage current due to the multiple testing. Base leakage current increases were directly related to the hot electron phenomenon at Si-SiO2 interface layer. The hot electron effect broke down the trivalent silicon and its hydrogen compounds (SisH) at the interface layer, which created mobile interstitial hydrogen atoms (Hi) and trivalent silicon atoms Si* (interface trap charges) at the same time. Typically, the SisH forms during the post metallization anneal. This paper will outline the following topics: 1.) The generation of mobile hydrogen atoms and trap charges at the Si-SiO2 interface due to the hot electron phenomenon and its relationship to transistor beta degradation. 2.) A quantitative analysis of hydrogen atoms measured by Secondary Ion Mass Spectrometry (SIMS), and a direct relationship model between beta degradation and hydrogen profiles at the interface layer. 3.) Experimental result showing transistor beta recovery as well as the repopulation of the hydrogen atoms at the interface layer after low temperature annealing (150 °C to 200 °C bake).
Focused Ion Beam (FIB) Method for Reconditioning Worn Tungsten Atomic Force Probe (AFP) Tips
Authors: Mulder Randal E. , Subramanian Sam , Chrastecky Tony 
Published: December 2020

Abstract
Atomic force probing (AFP) uses very sharp tungsten tips (100nm in radius) which wear out rather quickly, even with the greater durability of tungsten as compared to silicon. This paper demonstrates how worn tips that no longer image and probe properly can be reconditioned using the focus ion beam (FIB) tool. The method works best for tips that are under approx. 750nm in diameter and are not bent. It works well for freshly manufactured tips that do not work properly due to mishandling or improper storage which allowed particulates/oxide to build up on the tip. The method also works well for fresh tips that have been worn down (or slightly bent) after several hours of scanning and probing. This method is straightforward and requires a minimal amount of time. Typically, four probe tips can be reconditioned in about 30 minutes on the FIB.
An Alternative to High-Temperature and Acid/Solvent-Based Methods for Removing Integrated Circuits from Ceramic or Other Problem Substrates
Authors: Nail Carl M. 
Published: December 2020

Abstract
Dice must often be removed from their packages and reassembled into more suitable packages for them to be tested in automated test equipment (ATE). Removing bare dice from their substrates using conventional methods poses risks for chemical, thermal, and/or mechanical damage. A new removal method is offered using metallography-based and parallel polishing-based techniques to remove the substrate while exposing the die to minimized risk for damage. This method has been tested and found to have a high success rate once the techniques are learned.
ІСТОРІОГРАФІЧНИЙ ОГЛЯД ЗАКОНОДАВЧОЇ БАЗИ ВИЩОЇ ПЕДАГОГІЧНОЇ ОСВІТИ В УКРАЇНІ (1930-2020 РР.)
Authors: Джагунова Олена 
Published: December 2020

У статті здійснюється спроба проаналізувати нормативно-правову базу вищої педагогічної освіти, починаючи з 1930 р. до сьогоднішніх днів. Визначено понятійно-катеґоріальний апарат обраної проблематики, що допоміг якісно висвітлити процес законотворчої діяльності органів влади у регулюванні освітньої діяльності закладів вищої педагогічної освіти в Україні. Зазначено, що за період 1930-2020 рр. відбулося ряд трансформацій та реформ у системі вищої педагогічної освіти. Наголошено, що хоча радянський період це період – тоталітарно-комуністичного режиму, який негативно чи навіть фатально позначився на населенні та території України, радянська система залишила ґрунтовну основу для підготовки педагогічних працівників у закладах вищої освіти на сучасному етапі розбудови національної системи освіти України.
ЕТНОГРАФІЧНІ ДОСЛІДЖЕННЯ МИКОЛИ БІЛЯШІВСЬКОГО НА ЧЕРКАЩИНІ
Authors: Опацький Ігор 
Published: December 2020

У статті на основі аналізу біографічних даних та наукової спадщини Миколи Федотовича Біляшівського проаналізовано внесок вченого у становлення музейної справи в Україні. Простежено формування інтересу М. Біляшівського до української минувшини та вивчення ним життя і побуту українців у різні історичні епохи. Зазначено, що перші наукові кроки М. Біляшівський здійснив під впливом професора В. Антоновича. Узагальнено етнографічні дослідження вченого на Черкащині, зокрема збір усноісторичного матеріалу серед жителів с. Пекарів про Тараса Шевченка.
ВИЛОНОВУВАННЯ АНТИРЕЛІГІЙНОЇ ПРОПАГАНДИ В ОНТОЛОГІЇ РАДЯНСЬКОГО (1917-1921 рр.)
Authors: Киридон Алла 
Published: December 2020

Основна ідея статті: антирелігійна та антицерковна політика унормовувалась та регламентувалась партійно-державним апаратом задля досягнення гомогенності та уніфікації суспільства. Сутнісно ця політика на інтерпретаційному, пропагандистському, діяльнісному рівнях відповідала онтології радянського. Основною метою дослідження є увиразнення ролі антирелігійної та антицерковної пропаганди в системі державно-церковних відносин 1917-1921 років та окреслення іманентних характеристик цих складників більшовицької влади в онтології радянського. Характер, зміст, форми і методи антирелігійної пропаганди, підпорядковуючись головній меті – витісненню релігії та церкви з усіх сфер суспільного буття, визначалися комуністичною партією з огляду на зміни соціально-економічної і політичної ситуації в країні. Фактично від початку 1920-х років маніфестування політичних цілей у галузі релігії та хаотичне втручання радянської адміністрації у церковні справи поступово трансформувалося у широкомасштабний наступ влади на релігію та церкву.
Caricature textuelle et visuelle française du XIXe siècle. Enjeux sémiologiques d’une analyse icono-textuelle
Authors: Guinand Cécile 
Published: December 2020

Cet article considère la caricature en tant que dispositif icono-verbal qui mobilise des codes culturels partagés. Il montre qu’au XIXe siècle, la caricature visuelle (ici Daumier et Gavarni) comme la caricature textuelle (ici Balzac, Baudelaire, Stendhal, Musset, Flaubert, Huysmans) sont pensées sur le modèle de la scène théâtrale qui joue des riches possibilités offertes par la combinatoire du texte et de l'image au cœur des mécanismes comiques.
En effet, invalidant le constat d'un primat de l’image sur le texte (position de Charles Baudelaire) ou inversement du texte sur l’image (position de Roland Barthes), cet article rappelle que le visuel et le textuel assument des rôles fluides et qu’ils se complètent. À ce titre, la consonance ou dissonance entre l'image et son titre/sa légende sont deux types de rapports qui concourent à la naissance du rire comme à la richesse sémantique de la caricature.
Cette vision d’un rire procédant avant tout de mécanismes formels pourrait tendre à faire croire que l'évaluation des systèmes de valeur mobilisés est superflue. L'important serait de comprendre et d'analyser, pas de juger. Contre une telle prétention, cet article soutient la nécessité d’ajouter à l'analyse formelle d'une œuvre dans son contexte historique un positionnement éthique face à ses implications idéologiques explicites et implicites.
A Novel Method to Estimate the Damage Severity Using Spatial Wavelets and Local Regularity Algorithm
Authors: Reddy Mallikarjuna , K Arun Kumar 
Published: December 2020

In the process of structural damage detection using continuous wavelet transform (CWT), the perturbation or damage is located by identifying the defects locally in the input signal data. In this work the damage identification procedure using continuous wavelet transform is developed. This method is studied numerically using a simple beam model. The influence of reduced spatial sampling using fundamental mode shape is investigated in detail. The method is also investigated to ascertain the smallest level of damage identified using strain energy mode shape data.
Probabilistic Elastic-plastic Fracture Mechanics Analysis of Propagation of Cracks in Pipes under Internal Pressure
Authors: Mechab Belaïd , Malika Medjahdi , Salem Mokadem , Boualem Serier 
Published: December 2020

This study presents a three dimensional finite element method analysis of semi-elliptical surface cracks in pipes under internal pressure load. In the elastic–plastic case, estimates of the J-integral are presented for various ratios including crack depth to pipe thickness (a/t) and strain hardening index in the (R-O) Ramberg-Osgood (n). Finally, failure probability is accessed by a statistical analysis for uncertainties in loads and material properties, and structural reliability and crack size. The Monte Carlo method is used to predict the distribution function of the mechanical response. According to the obtained results, we note that the stress variation and the crack size are important factors influencing on the distribution function of (J/Je).
Investigation of the effect of impact load on concrete-filled steel tube columns under fire
Authors: Golsoorat Pahlaviani Ali , Rousta Ali Mohammad , Beiranvand Peyman 
Published: December 2020

Concrete-filled steel tube (CFST) columns are increasingly used in the construction of high-rise buildings which require high strength and large working space especially at lower stories. As compared to reinforced concrete columns, existence of the exterior steel tube not only bears a portion of axial load but also most importantly provides confinement to the infill concrete.with the confinement provided by the steel tube, axial strength of the infill concrete can be largely enhanced.this paper presents the investigation effect of impact load on concrete-filled steel tube columns under fire by numerical simulations using ABAQUS software.the results indicate that the CFST sections with larger confinement factor ξ=1.23 behaved in a very ductile manner under lateral impact. And the sections with smaller confinement factor ξ=0.44 generally behaved in a brittle mechanism.