bluuebunny/crossref_metadata_2025_split huggingface dataset:
A Discussion of Dielectric Film Deformation by E-Beam Energy
Authors: Chen Yu-Xiu , Hsu Pei-Ning , Chung Yu-Min , Hsu Hsin-Cheng , Ku Huai-San , Yeh Chin-Chih , Lian Nan-Tzu , Yang Tahone , Chen Kuang-Chao , Lu Chih-Yuan 
Published: December 2020

Abstract
A recently developed technique known as Electron Beam Induced Resistance Change (EBIRCH) equipped with a scanning electron microscope (SEM) utilizes a constant electron beam (e-beam) voltage across or current through the defect of interest and amplifies its resistance variation. In this study, EBIRCH is applied for a 3D NAND structure device fault isolation but suffered from nearby dielectric film deformation. The characterization of such dielectric deformation and the possible mechanisms of e-beam induced damage are discussed. As well, a threshold condition to avoid from triggering the occurrence of dielectric damage is presented for shallow defect analysis in EBIRCH application.
Electron Beam Probing of Active Advanced FinFET Circuit with Fin Level Resolution
Authors: Tong T. , Ryu H.J. , Wang Y. , Chuang W.-H. , Huening J. , Joshi P. , Ma Z. 
Published: December 2020

Abstract
This paper shows for the first time chip level electron beam probing on fully functional 10nm and 14nm node FinFET chips with sub-fin level resolution using techniques developed in house. Three novel electron beam probing techniques were developed and used in the debug and fault isolation of advanced node semiconductor devices. These techniques were E-beam logic state imaging, electron-beam signal image mapping, and E-beam device perturbation. Two tools that can offer all three techniques were constructed and used in production. The techniques have been successfully applied to real case chip debug and fault isolation on advanced 10nm and 14nm FinFET on production tools developed in-house. Sub-fin level resolution was achieved for the first time.
Failure Analysis of Micro Defective Structure on a pnp Power Device
Authors: Krishnan Arul , Murugalogeswaran Permal 
Published: December 2020

Abstract
In this paper we introduce a physical analysis approach using focus ion beam (FIB) and scanning electron microscopy (SEM) to investigate a micro defective structure at active contact trench which caused a voltage breakdown of power device. In this case study, a lower probe current through FIB milling and a lower accelerating voltage in SEM imaging have been applied to identify the micro structure defect.
The Investigation of Fluorine Induced Novel Probe Marker Discoloration
Authors: Hsieh W.F. , Lin Henry , Chen Vincent , Ou Irene , Lou Y.S. 
Published: December 2020

Abstract
This paper describes the investigation of donut-shaped probe marker discolorations found on Al bondpads. Based on SEM/EDS, TEM/EELS, and Auger analysis, the corrosion product is a combination of aluminum, fluorine, and oxygen, implying that the discolorations are due to the presence of fluorine. Highly accelerated stress tests simulating one year of storage in air resulted in no new or worsening discolorations in the affected chips. In order to identify the exact cause of the fluorine-induced corrosion, the authors developed an automated inspection system that scans an entire wafer, recording and quantifying image contrast and brightness variations associated with discolorations. Dark field TEM images reveal thickness variations of up to 5 nm in the corrosion film, and EELS line scan data show the corresponding compositional distributions. The findings indicate that fluorine-containing gases used in upstream processes leave residues behind that are driven in to the Al bondpads by probe-tip forces and activated by the electric field generated during CP testing. The knowledge acquired has proven helpful in managing the problem.
Effective Method for Analyzing IGBT Leakage Failures Related to the Exposed Junction on the Die Sidewall
Authors: Dang Chi , Vo Thanh 
Published: December 2020

Abstract
An effective method is presented to locate certain failure sites on exposed junction of insulated-gate bipolar transistor (IGBT) devices. High emitter to collector leakage current, hereafter called ICESR, is an IGBT failure mode. The leakage current is typically related to the exposed P+/N+ junction on the die sidewall. Solder die attach residue bridging or silicon damage at this exposed P+/N+ junction are common causes of ICESR leakage. The die attach residue can be dislodged during decapsulation resulting in loss of failure information. A failure analysis flow will be described to precisely locate the ICESR leakage site without disturbing any possible die attach residue.
Finite-Element Modeling and Quantitative Measurement Using Scanning Microwave Microscopy to Characterize Dielectric Films
Authors: Rubin K. A. , Jolley W. , Yang Y. 
Published: December 2020

Abstract
Scanning Microwave Impedance Microscopy (sMIM) can be used to characterize dielectric thin films and to quantitatively discern film thickness differences. FEM modeling of the sMIM response provides understanding of how to connect the measured sMIM signals to the underlying properties of the dielectric film and its substrate. Modeling shows that sMIM can be used to characterize a range of dielectric film thicknesses spanning both low-k and medium-k dielectric constants. A model system consisting of SiO2 thin films of various thickness on silicon substrates is used to illustrate the technique experimentally.
GHz-SAM for Warped Samples using HiSA
Authors: D. Le C. Hollerith , Hoffrogge P. , Böckler M. 
Published: December 2020

Abstract
GHz-SAM using toneburst transducers is a method currently lacking the possibility to measure warped samples easily because large parts of such samples are out of focus due to the limited depth of focus of these types of transducers. This paper shows an approach to use the already established HiSA (High Speed Axis) method to overcome this disadvantage. Therefore warpage of the sample is measured by a white-light interferometer. The detected bow is parametrized and submitted in the control electronics of the HiSA. With this data the HiSA is enabled to keep the distance between sample and transducer precisely constant. This allows eliminating the influence of the warpage on the performance of this method and therefore highly increases the image quality.
Understanding Water Ingress in Scanning Acoustic Microscopy and a Method to Observe Defects that are Open to the Surface
Authors: Benak Adam , Devaney Roger 
Published: December 2020

Abstract
Scanning Acoustic Microscopy (SAM) is a very important tool in the evaluation of molded plastic electronic components. SAM is used to non-destructively determine the configuration and quality of components using ultrasonic sound waves and consequently is an important test step in the screening, Destructive Physical Analysis (DPA) or Failure Analysis (FA) of plastic components. SAM is performed in a water bath so if internal defects are open to the surface of the device they can fill with water and become invisible to SAM.
Automated Gas-Enhanced PFIB Surface Preparation Enabled Metrology and Statistical Analysis of 3D NAND Devices
Authors: Hakala Chris , Clarke James , Biedrzycki Mark , Price Kesley , Johnson Jamie , Mitchson Gavin 
Published: December 2020

Abstract
The development of vertical 3D NAND technology over the past 5 years has been accelerated by the parallel development of metrology techniques capable of characterizing these device stacks. Current trends point toward a continuous scaling of dimensions along the z-axis, involving a critical etch step with aspect ratios of ~50:1. These high aspect ratio process steps present both fabrication and metrology challenges where the channel holes can bend, bow, and pinch off throughout the stack. Work presented herein demonstrates the capability of an automated workflow developed using the Thermo Scientific™ Helios™ G4 HXe DualBeam™ platform. The workflow iteratively exposes desired layers within the NAND stack, collects high resolution SEM images, and performs metrology to enable statistical analysis of trends as a function of depth within the stack. Results will be presented from 3 sites in an automatically delayered 72-layer 3D NAND die. Automated SEM metrology was performed every 10 layers, capturing more than 6000 devices. Over 19000 measurements were made on imaged devices yielding assessment of statistically significant trends in the planar cell area, eccentricity, and position of the bits as a function of depth.
Stress Analysis of Damage in Active Circuitry beneath Redistribution Layer (RDL) Bonding Pad and Improvements for Reliability
Authors: Shih Chih-Ching , Hsiao Wei-Hao , Chan Leo , Chang Hsiao-Tien , Kuo Li-Kuang , Lin Ding-Jhang , Chao Yen-Hai , Lu Chih-Yuan 
Published: December 2020

Abstract
Redistribution layer (RDL) bonding pad over active circuitry is utilized to re-route the original bond pad to other location for wire bonding using RDL. The damages in the active circuitry beneath the RDL bond pad induced by stress from wire bonding and package must be evaluated for reliability in the product development. The experimental approach and test structures are proposed in this paper. Functional fail was detected in electrical test after reliability tests on packaged IC. The dielectric cracking initiated by wire bonding that corresponds to the functional fail is identified by physical failure analysis and Transmission-Electron-Microscopy (TEM) at a specific location beneath the RDL bond pad. Finite element simulations are used to analyze the wire bonding stress distribution and circuit-under-pad design effect. The predicted maximum stress for the dielectric cracking matches to the location observed in the physical failure analysis. Based on the experiment and the simulation data, design rules for the circuit routing beneath the RDL bond pad have been successfully developed that all product reliability tests pass later with extend bonding power. The results lead to significant improvements in the robustness of circuit routing structure beneath the RDL bond pad for dielectric cracking without modifications of the existing processes for the product.
Novel X-ray Microscopic Chemical Imaging for Rapid Non-Destructive Identification of Structural and Compositional Defects from Microbumps to FinFET
Authors: Lau S. H. , Stripe Benjamin , Lewis Sylvia , Yang Xiaolin , Yun Wenbing 
Published: December 2020

Abstract
New heterogeneous 3D integration schemes and continuing miniaturization of semiconductor packaging components, such as micropillars, are driving demand for substantive changes to conventional PFA (physical failure analysis). In particular, desired performance capabilities include the ability to nondestructively determine failures within seconds to minutes. New tools should be quantitative, have sufficient resolution to determine sub-micron sized defects and voids in TSVs at the wafer or package level. It should also measure thickness and their material composition of multilayer structures above the wafer surface, such as microbumps, or those below the surface including UBM and RDL. In this paper we are introducing a novel x-ray fluorescence microscope technique capable of solving the above applications in advanced packaging for PFA and process development. The same technique can also be applied in the front end metrology of new gate materials, 3D FinFET structures within test structures in patterned wafers. Characterization of sub nanoscopic changes (sensitivity of sub-angstrom) in film and dopants deposited in 3D structures will also be shown. With its high sensitivity for trace materials, contamination analysis of post hard mask residue, post metal etch residue especially in high aspect ratio structures is also possible.
LADA Synchronization for Symmetric and Asymmetric ATE Test Program Cycles
Authors: Karunanithi Arun Kumar , Caroselli Joseph , Christensen Jason , Espitia Michell 
Published: December 2020

Abstract
Laser Assisted Device Alteration (LADA) or Soft Defect Localization (SDL) is commonly used to root cause device marginality due to functional or structural failures. At a high level, LADA involves setting the device under test (DUT) at its marginal state and using focused near infra-red laser beams to perturb sensitive circuitry [1]. Scanning the focused laser beam over the die can be a long and time-consuming process. In this paper, two LADA cases are presented, which involve a parametric measurement failure while running a dynamic ATE test. Using LADA technique, these two cases were root caused. These two cases also explain how a parametric measurement-based LADA can be setup on ATE, as well as a synchronization method independent of vectors in a pattern. Synchronization was necessitated in the 2nd case due to the asymmetric test program loop, as well as the long test program cycle time. There are many factors which impact LADA turnaround time and it can take anywhere between few seconds to one day. The two major factors are the size of the Area of Interest (AOI) and test program cycle time. Test program cycle time influences the laser “dwell time” for LADA. Dwell time, in simple terms, is the total time the laser is parked at each pixel. The laser can also be synchronized with the test program cycle, keeping the two always in phase. This is explained in Case 2, where LADA synchronization was implemented, and the analysis was successfully completed in time, even though the test cycle time was very long.
A Manual Diagnosis Approach Using Targeted Fault Injection and Fault Simulation to Extend ATPG Diagnostic Resolution in Localizing Faults
Authors: Estores Rommel , Gucht Karo Vander 
Published: December 2020

Abstract
This paper discusses a creative manual diagnosis approach, a complementary technique that provides the possibility to extend Automatic Test Pattern Generation (ATPG) beyond its own limits. The authors will discuss this approach in detail using an actual case – a test coverage issue where user-generated ATPG patterns and the resulting ATPG diagnosis isolated the fault to a small part of the digital core. However, traditional fault localization techniques was unable to isolate the fault further. Using the defect candidates from ATPG diagnosis as a starting point, manual diagnosis through fault Injection and fault simulation was performed. Further fault localization was performed using the ‘not detected’ (ND) and/or ‘detected’ (DT) fault classes for each of the available patterns. The result has successfully deduced the defect candidates until the exact faulty net causing the electrical failure was identified. The ability of the FA lab to maximize the use of ATPG in combination with other tools/techniques to investigate failures in detail; is crucial in the fast root cause determination and, in case of a test coverage, aid in having effective test screen method implemented.
Site-Specific Low Angle Plasma FIB Milling for Cross-Sectional Electrical Characterization
Authors: Zhang Chuan , Li Jane Y. , Aguada John , Marks Howard 
Published: December 2020

Abstract
This paper introduces a novel sample preparation method using plasma focused ion-beam (pFIB) milling at low grazing angle. Efficient and high precision preparation of site-specific cross-sectional samples with minimal alternation of device parameters can be achieved with this method. It offers the capability of acquiring a range of electrical characteristic signals from specific sites on the cross-section of devices, including imaging of junctions, Fins in the FinFETs and electrical probing of interconnect metal traces.
Effects of Self-Identification as a Caregiver on Expectations of Public Stigma of Alzheimer’s Disease
Authors: Stites Shana D. , Largent Emily A. , Johnson Rebecca , Harkins Kristin , Karlawish Jason 
Published: December 2020

Background: As a result of caring for a person with dementia, caregivers of persons with Alzheimer’s disease (AD) may be uniquely aware of public stigma for persons with AD. Objective: The purpose of this study was to compare self-identified caregivers and non-caregivers’ expectations of public stigma experienced by persons living with dementia. Methods: Analysis of data from a survey of 910 adults (median age = 49 years) who read a vignette about a man with mild stage dementia. Multivariable ordered logistic regression was used to examine how AD caregiver status associated with responses on a modified Family Stigma in Alzheimer’s Disease Scale (FS-ADS). Results: 9%( n = 82) of respondents self-identified as a current or former primary caregiver of a person with AD, about the same as the national estimate of informal caregivers (8.8%). Compared to non-caregivers, AD caregivers were more likely to report stronger reactions on all seven domains of the FS-ADS (all p <  0.05). As compared to AD caregivers with less factual knowledge about caregiving, AD caregivers with more knowledge expected the person with dementia to experience less social distance ( p <  0.05). In addition, female AD caregivers reported fewer negative aesthetic attributions than male AD caregivers ( p <  0.05). Conclusion: Compared to non-caregivers, respondents who self-identified as an AD caregiver gave responses that suggest they perceived more stigma of dementia among members of the public. Their reactions were attenuated by AD knowledge and being female. The findings have key implications for interventions to reduce AD stigma.
Parental perspective: The role of prostheses and prosthetics services in adjusting to a child’s upper limb difference
Authors: Sims Tara , Donovan-Hall Maggie , Metcalf Cheryl 
Published: December 2020

BACKGROUND: The impact of paediatric upper limb difference may extend beyond the child themselves to their parents and other family members. Previous research has found that feelings of shock, numbness and loss are common amongst parents and that peer support can be a buffer against stress. OBJECTIVE: The current study aimed to explore the experiences of parents of children with limb difference, and the role of services and prosthetic devices in these experiences. METHODS: Nine parents of children with limb difference participated in either a group ([Formula: see text] 2) or individual ([Formula: see text] 7) interview. RESULTS: Analysis of the interview transcripts revealed four themes – ‘grief and guilt’, ‘prosthesis as a tool for parental adjustment’, ‘support’ and ‘fun and humour’. CONCLUSIONS: Parents may employ coping strategies to help them adjust to their child’s limb difference, including use of a prosthesis, accessing support from statutory services and peers, and use of fun and humour within the family.
Synthesis, physicochemical properties and antigypoxic activity of some S-derivatives of 4-alkyl-5-(((3-(pyridin-4-yl)-1H-1,2,4-triazol-5-yl)thio)methyl)-4H-1,2,4-triazole-3-thiol
Authors: Karpun E. O. , Parchenko V. V. 
Published: December 2020

Hypoxia is a discrepancy between the required energy of the cell in the mitochondrial oxidative phosphorylation system. The immediate cause of the deficiency is a decrease in the oxygen concentration in the mitochondria. Today there is a huge demand for the development of new anti-hypoxic drugs. t is known that 1,2,4-triazole compounds can have antimicrobial, anti-inflammatory, anti-hypoxic effects. Modification of the 1,2,4-triazole nucleus is a productive way to create original active molecules with a non-planar structure, for their binding to bio-target substrates. Derivatives of bis-1,2,4-triazoles may become potential compounds with anti-hypoxic action.
The aim of our work was to synthesize new S-derivatives of 4-alkyl-5-(((3-(pyridine-4-yl)-1Н-1,2,4-triazole-5-yl)thio)methyl)-4Н-1,2,4-triazole-3-thiols, to investigate their physicochemical parameters using modern complex physicochemical research methods and to conduct primary pharmacological screening for anti-hypoxic activity in models of acute hypoxia with hypertension.
The object of the study was the S-derivatives of 4-alkyl-5-(((3-(pyridine-4-yl)-1Н-1,2,4-triazole-5-yl)thio)methyl)-4Н-1,2,4-triazole-3-thiols. The structure of the synthesized compounds was confirmed by elemental analysis (CHNS), 1H NMR, the individuality of the molecules was proved by chromatographic mass spectral analysis. 1H NMR signals for substances are consistent with the proposed structure. The study of the anti-hypoxic activity of the got compounds of the series of S-substituted bis-1,2,4-triazoles was carried out on models of acute hypoxia with hypertension, where Mexidol (5%) 200 mg/kg as a reference drug.
New S-derivatives of 4-methyl-5-(((3-(pyridine-4-yl)-1Н-1,2,4-triazole-5-yl)thio)methyl)-4Н-1,2,4-triazole-3-thiols (I a) and 4-ethyl-5-(((3-(pyridine-4-yl)-1Н-1,2,4-triazole-5-yl)thio)methyl)-4Н-1,2,4-triazole-3-thiols (I b) with acyl-aryl, acyl-alkyl and alkyl substituents. We studied their spectral parameters, physicochemical properties in the conditions of GC/MS, elemental analysis, 1H NMR spectroscopy. According to the results of biological studies on the anti-hypoxic effect, it was found that 1-((4-ethyl-5-(((3-(pyridine-4-yl)-1H-1,2,4-triazole-5-yl)thio)methyl)-4H-1,2,4-triazole-3-yl)thio)propane-2-one is a compound that exceeds the anti-hypoxic activity of Mexidol and increases the lifespan of rats by 1.0% relative to the reference drug.
PENGARUH PENGGUNAAN LEMAK SAPI, MINYAK KELAPA DAN MINYAK KEDELAI DALAM PAKAN TERHADAP PERFORMA PRODUKSI AYAM PEDAGING
Authors: Mardhotillah A. B. A , Darmawan Hariyadi , Djunaidi I. H. , Hsia L. C. , Chen Y. C. 
Published: December 2020

This experiment was conducted to evaluate the effect of various fat sources and their combination (coconut oil and soybean oil) on growth performance of broiler. A total of 80 one-day old female 1-d-old Arbor Acres were randomly assigned into four groups (4 treatment) with 10 replicates (6 birds per pen) within 42 days. The experimental groups consisted of four treatment of diets: 1) a basal-diet containing beef oil (BO), 2) a basal diet containing coconut oil (CO), 3) a basal diet containing soybean oil (SO), and 4) a basal diet containing coconut oil and soybean oil (CO+SO) as were used. Performance data were obtained during the feeding period. The result was shown that using combination of medium chain fatty acid and unsaturated fatty acid (CO+SO) were increased growth performance demonstrated by highest bodyweight (59.62 g) compared with other treatments (P 0.05) throughout the experimental period (0-42 days). The lower group for feed conversion ratio was obtained in the diet containing beef oil (BO) compared with other groups (1.32; P 0.05). Feed consumption and bodyweight have significantly different (P 0.05) but not different for feed conversion ratio (P 0.05). It can be concluded that feeding combination CO+SO in the diet may improve the performance of broiler.Beef oil; broiler; coconut oil; growth performance; soybean oil