bluuebunny/crossref_metadata_2025_split huggingface dataset:
Nanostructure-based electrochemical sensor: glyphosate detection and the analysis of genetic changes in rye DNA
Authors: Gerbreders Vjaceslavs , Krasovska Marina , Mihailova Irena , Ogurcovs Andrejs , Sledevskis Eriks , Gerbreders Andrejs , Tamanis Edmunds , Kokina Inese , Plaksenkova Ilona 
Published: December 2019

Glyphosate, commonly known by its original trade name Roundup™, is the world’s most widely used herbicide. Glyphosate and it metabolites have profound negative environmental impact and long-term toxicity risk including cancerogenity, genotoxicity, endocrine disruption even at concentration levels too low to have a herbicidal effect. Therefore, the detection of these pollutants in low concentrations is an actual and important task.
To increase the sensitivity of the sensor, nanostructures were used.
To analyze the presence of glyphosate and its metabolites in rye juice, two groups of samples were selected. In the first case, glyphosate at different concentrations was added to the water for irrigation on the first day and then the samples were watered with pure water for 7 days. In the second case, rye was watered with pure water for all 8 days, and glyphosate was artificially added just before the measurement. The obtained samples were studied by the DPV employing nanostructured working electrode. To analyze changes in the DNA sequence, a PCR product obtained from samples of the first group was electrochemically studied. To confirm the results obtained, an electrophoresis method was also applied. The results indicate that the DPV signal obtained from samples with artificially added glyphosate has significant differences compared to the signal obtained from the juice of plants absorbing glyphosate in a natural way during growth. However, in both cases, CuO nanostructure based sensor detects the presence of glyphosate or its metabolites compared with the control sample. The experiment also found significant changes in the DNA caused by exposure with glyphosate during rye growth process of rye sprouts.
Formation and Eruption of a Mini-sigmoid Originating in Coronal Hole
Authors: Huang Z. W. , Cheng X. , Su Y. N. , Liu T. , Ding M. D. 
Published: December 2019

Abstract
In this paper, we study in detail the evolution of a mini-sigmiod originating in a cross-equatorial coronal hole, where the magnetic field is mostly open and seriously distinct from the closed background field above active-region sigmoids. The source region first appeared as a bipole, which subsequently experienced a rapid emergence followed by a long-term decay. Correspondingly, the coronal structure initially appeared as arc-like loops, then gradually sheared and transformed into continuously sigmoidal loops, mainly owing to flux cancellation near the polarity inversion line. The temperature of J-shaped and sigmoidal loops is estimated to be about 2.0 × 106 K, greater than that of the background coronal hole. Using the flux-rope insertion method, we further reconstruct the nonlinear force-free fields that well reproduces the transformation of the potential field into a sigmoidal field. The fact that the sheared and sigmoidal loops are mainly concentrated at around the high-Q region implies that the reconnection most likely takes place there to form the sigmoidal field and heat the plasma. Moreover, the twist of sigmoidal field lines is estimated to be around 0.8, less than the values derived for the sigmoids from active regions. However, the sigmoidal flux may quickly enter an unstable regime at the very low corona (<10 Mm) due to the open background field. The results suggest that the mini-sigmoid, at least the one in our study, has the same formation and eruption process as the large-scale one, but is significantly influenced by the overlying flux.
Gravitational Lens System PS J0147+4630 (Andromeda’s Parachute): Main Lensing Galaxy and Optical Variability of the Quasar Images
Authors: Goicoechea Luis J. , Shalyapin Vyacheslav N. 
Published: December 2019

Abstract
Because follow–up observations of quadruple gravitational lens systems are of extraordinary importance for astrophysics and cosmology, we present single-epoch optical spectra and r-band light curves of PS J0147+4630. This recently discovered system mainly consists of four images ABCD of a background quasar around a foreground galaxy G that acts as a gravitational lens. First, we use long-slit spectroscopic data in the Gemini Observatory Archive and a multi-component fitting to accurately resolve the spectra of A, D, and G. The spectral profile of G resembles that of an early-type galaxy at a redshift of 0.678 ± 0.001, which is about 20% higher than the previous estimate. Additionally, the stellar velocity dispersion is measured to ∼5% precision. Second, our early r-band monitoring with the Liverpool Telescope leads to accurate light curves of the four quasar images. Adopting time delays predicted by the lens model, the new lens redshift, and a standard cosmology, we report the detection of microlensing variations in C and D as large as ∼0.1 mag on timescales of a few hundred days. We also estimate an actual delay between A and B of a few days (B is leading), which demonstrates the big potential of optical monitoring campaigns of PS J0147+4630.
Metallicity Structure in the Milky Way Disk Revealed by Galactic H ii Regions
Authors: Wenger Trey V. , Balser Dana S. , Anderson L. D. , Bania T. M. 
Published: December 2019

Abstract
The metallicity structure of the Milky Way disk stems from the chemodynamical evolutionary history of the Galaxy. We use the National Radio Astronomy Observatory Karl G. Jansky Very Large Array to observe ∼8–10 GHz hydrogen radio recombination line and radio-continuum emission toward 82 Galactic H ii regions. We use these data to derive the electron temperatures and metallicities for these nebulae. Since collisionally excited lines from metals (e.g., oxygen, nitrogen) are the dominant cooling mechanism in H ii regions, the nebular metallicity can be inferred from the electron temperature. Including previous single-dish studies, there are now 167 nebulae with radio-determined electron temperature and either parallax or kinematic distance determinations. The interferometric electron temperatures are systematically 10% larger than those found in previous single-dish studies, likely due to incorrect data analysis strategies, optical depth effects, and/or the observation of different gas by the interferometer. By combining the interferometer and single-dish samples, we find an oxygen abundance gradient across the Milky Way disk with a slope of −0.052 ± 0.004 dex kpc−1. We also find significant azimuthal structure in the metallicity distribution. The slope of the oxygen gradient varies by a factor of ∼2 when Galactocentric azimuths near ∼30° are compared with those near ∼100°. This azimuthal structure is consistent with simulations of Galactic chemodynamical evolution influenced by spiral arms.
Eclipsing Binaries in the Open Cluster Ruprecht 147. II. Epic 219568666
Authors: Torres Guillermo , Vanderburg Andrew , Curtis Jason L. , Ciardi David , Kraus Adam L. , Rizzuto Aaron C. , Ireland Michael J. , Lund Michael B. , Christiansen Jessie L. , Beichman Charles A. 
Published: December 2019

Abstract
We report our spectroscopic monitoring of the detached, grazing, and slightly eccentric 12 day double-lined eclipsing binary EPIC 219568666 in the old nearby open cluster Ruprecht 147. This is the second eclipsing system to be analyzed in this cluster, following our earlier study of EPIC 219394517. Our analysis of the radial velocities combined with the light curve from the K2 mission yields absolute masses and radii for EPIC 219568666 of M
1 = 1.121 ± 0.013 M
☉ and R
1 = 1.1779 ± 0.0070 R
☉ for the F8 primary and M
2 = 0.7334 ± 0.0050 M
☉ and R
2 = 0.640 ± 0.017 R
☉ for the faint secondary. Comparison with current stellar evolution models calculated for the known metallicity of the cluster points to a primary star that is oversized, as is often seen in active M dwarfs, but this seems rather unlikely for a star of its mass and with a low level of activity. Instead, we suspect a subtle bias in the radius ratio inferred from the photometry, despite our best efforts to avoid it, which may be related to the presence of spots on one or both stars. The radius sum for the binary, which bypasses this possible problem, indicates an age of 2.76 ± 0.61 Gyr, which is in good agreement with a similar estimate from the binary in our earlier study.
The establishment of theOnthophagus anthracinus(Coleoptera: Scarabaeidae) species complex and the description of a new species
Authors: Arriaga-Jiménez Alfonsina , Escobar-Hernández Fernando , Rös Matthias , Kohlmann Bert 
Published: December 2019

AbstractTheOnthophagus anthracinusHarold, 1873 (Coleoptera: Scarabaeidae: Scarabaeinae: Onthophagini) species complex of theOnthophagus landoltiHarold, 1880 species group is established and analysed. Anew species,O. etlaensis, is described from this group.Onthophagus mextexusHowden and Cartwright, 1970 is considered a valid species andO. knulliHowden and Cartwright, 1963 is placed in synonymy withO. durangoensisBalthasar, 1939new synonymy. A key for theO. anthracinusspecies complex is presented along with photographs and illustrations of the main taxonomic differences. An update of theO.landoltispecies group is presented.
Infestation parameters of chewing lice (Phthiraptera: Amblycera and Ischnocera) on bald eagles,Haliaeetus leucocephalus(Accipitriformes: Accipitridae), in Manitoba, Canada
Authors: Lavallée Christie D. , Galloway Terry D. , Rochon Kateryn 
Published: December 2019

AbstractBald eagles (Haliaeetus leucocephalus(Linnaeus); Accipitriformes: Accipitridae) from 92 locations in Manitoba were examined for chewing lice (Phthiraptera: Amblycera and Ischnocera) from 1992 to 2017. Bald eagles were salvaged from rehabilitation hospitals and were examined using two methods, dry-ruffling (n= 107) and washing (n= 40). We collected 39 066 bald eagle lice of four genera and six species:Colpocephalum flavescens(De Haan),C. napiforme(Rudow),C. turbinatum(Denny) (Phthiraptera: Menoponidae) (total for allColpocephalumspecies = 18 082),Craspedorrhynchus halieti(Osborn) (Phthiraptera: Philopteridae) (n= 49),Degeeriella discocephalus(Burmeister) (Phthiraptera: Philopteridae) (n= 20 912), andKurodaia fulvofasciata(Piaget) (Phthiraptera: Menoponidae) (n= 23). Quantitative data were collected on all genera with the comparison of washed to dry-ruffled.Colpocephalum flavescensandD. discocephalusdominated the louse populations, with similar prevalence and mean intensity. Both genera had sex ratios near 1.0, and similar nymph-to-female ratios near 3:1. The dry-ruffling method was relatively inefficient, collecting 11% as many lice as the washing method. Total prevalence for dry-ruffled birds was 63%; total mean intensity was 103.5, but for washed birds, the prevalence was 93% with a mean intensity of 861.1. NoLaemobothrion vulturis(Fabricius) (Phthiraptera: Laemobothriidae) were found.
Designing Software Configurable Chips and SIPs using Chiplets and zGlue
Authors: Nasrullah Jawad , Luo Zhiquan , Taylor Greg 
Published: December 2019

Abstract
zGlue Smart Fabric, an active silicon interposer, enables rapid development of Systems in Package (SiPs) and Chips using chiplet stacking in a modular style and software programmability. zGlue Smart Fabric works with off-the-shelf chiplets in known good die and wafer level chip scale packages format without dictating a footprint constraint on chiplets. This is achieved by making a fine pitch copper pillar micro-bump array on the surface that can conform to the chiplet ball map using a programable connectivity and power array built into zGlue's fabric. Connection to RF and sensitive analog signals are handled in RDL. Programmability of zGlue bumps also enable some repair and reconfigurability after manufacturing. The design process with zGlue includes usage of a cloud-based software design tool called ChipBuilder. This tool performs most conventional SiP design functions but more importantly it is used for creating soft and hard routes among IOs. ChipBuilder starts with a data representation of zGlue's Smart Fabric. A growing library of chiplet data has been encoded into the tool and is made available to the users of ChipBuilder via the cloud. Users select chiplets, enter design, perform IO planning, and route the design. With this modular IC design style, zGlue can handle high mix devices that are expected with the growth of connected smart devices everywhere.
A Miniaturized Dual Band Antenna for Harmonic RFID Tag
Authors: Mondal Saikat , Karuppuswami Saranraj , Kumar Deepak , Kaur Amanpreet , Chahal Premjeet 
Published: December 2019

Abstract
A miniaturized antenna is required for a small form factor RFID tag. For harmonic RFID tag, the tag should be capable of receiving and transmitting at two different frequencies (fundamental and harmonic). Implementation of two different antennas for the operation would increase the footprint of the antenna. Hence, an optimized antenna structure is proposed, which will have a small form factor while maintaining a considerable gain. The dual band antenna would be capable of receiving at fundamental frequency and transmit information at harmonic frequency while maintaining small tag size. The dual band antenna has a miniaturized rectangular board dimension of 96.5 mm and 81 mm with resonance at 434 MHz at low frequency and 860 MHz to 1000 MHz at high frequency. The harmonic tag was designed with nonlinear transmission line and the dual band antenna. The harmonic RF tag would be useful for numerous RF applications where the single frequency tags will not be a good option such as underground object tagging, tag detection in an industrial set up with strong reflectors such a metal in the vicinity. In this paper, the design, fabrication and characterization of dual band harmonic RFID tag antenna is presented.
Low-Density Fan-Out Heterogeneous Integration of MEMS Tunable Capacitor and RF SOI Switch
Authors: Hadizadeh Rameen , Laitinen Anssi , Kuusniemi Niko , Blaschke Volker , Molinero David , O'Toole Eoin , Pinheiro Márcio 
Published: December 2019

Abstract
Using Low-Density Fan-Out (LDFO) packaging technology, a radio frequency (RF) microelectromechanical systems (MEMS) tunable capacitor array composed of electrostatically actuated beams on 180nm high-voltage CMOS silicon was heterogeneously integrated with a single-pole four-terminal (SP4T) RF switch on 180nm CMOS silicon-on-insulator (SOI). The primary objective of this study was to determine the manufacturability of this System-in-Package (SiP) design, which is proven at time zero through survival of the MEMS device based on acceptable MEMS performance metrics.
In addition, the RF SOI switch provides high-voltage electrostatic discharge (ESD) protection for the MEMS device. Capacitive MEMS structures are particularly sensitive to unpredictable electrostatic charging scenarios, such as handling after package assembly and printed circuit board (PCB) surface mount processing. Consequently, resistance to dielectric breakdown by means of robust ESD protection is a very desirable quality. Integrating the RF switch in close proximity with the MEMS device not only enables the ability to withstand charging scenarios in excess of 1kV (human body model), it mitigates the impact of parasitics on RF performance by minimizing interconnect lengths and complexity.
Solder Joint Interconnections in Automotive Electronics: Design-for-Reliability and Accelerated Testing
Authors: Suhir E. , Yi S. , Nicolics J. 
Published: December 2019

Abstract
Three practically important reliability-related questions for solder joint interconnections (SJIs) in automotive electronics, and particularly in its actuator and sensor electron devices, are addressed in this analysis:Could inelastic strains in the solder material be avoided by a rational physical design of the IC package, and, if not, could the sizes of the peripheral inelastic strain areas be predicted and minimized? It is clear that the low cycle fatigue lifetime is inversely proportional to the sizes of the inelastic zones and that the material's fatigue lifetime could be improved dramatically, if the induced strains remain within the elastic range. The Palmgren-Miner rule of linear accumulation of damages can be used, instead of Coffin-Manson relationships, in such a situation.Realizing that, because of the inevitable uncertainties, the difference between highly reliable and an insufficiently robust electronic products is “merely” in the levels of their never-zero probabilities of failure, could these probabilities be assessed, and could this be done at the design stage? A possibility of doing that is particularly critical for SJIs, the most vulnerable structural elements in the today's IC package designs. Reliability of an electronic material or a product cannot be assured, if it is not quantified, and, because of the inevitable and critical uncertainties, this should be done on the probabilistic basis.Should SJI accelerated testing based on costly, time- and labor-consuming and, because of temperature dependency of material properties, possibly even misleading temperature cycling, be replaced by a more physically meaningful, less expensive and more trustworthy accelerated test vehicle, and could low-temperature/random-vibrations bias be employed in this capacity? The rationale behind such a question has to do with the facts that the highest thermal stresses take place at the lowest temperature conditions, and that fatigue cracks, whether elastic or inelastic, propagate most rapidly, when the material experiences random vibrations. This technique has been already reduced to practice in an industrial lab two years ago.
The objective of the analysis is to shed light, by using analytical (“mathematical”) modeling, rather than widely spread computer simulation, on the mechanical behavior and the underlying physics of failure in the SJI. Future work should focus primarily on experimentations to confirm theoretical findings and recommendations.
Study to Lower Cu Pillar Flip-Chip Failure Rate
Authors: Rosario Bong , Holyoak Joseph , Haji-Rahim Mohsen , Lambird Gene , Wang Yong , Lyons Kendra , Johnson Todd , Makowenskyj Paul , Myers Brian , Pan Shannon 
Published: December 2019

Abstract
Cu pillar flip-chip die technology has proved reliable and is widely used in chip-to-package mobile module products. There was a time when customers considered 500ppm (Parts per million) an acceptable defect rate. Now, tier 1 customers expect a defect rate of less than 50ppm. This high customer expectation drove this in-depth research and problem solve. Our main work includes: 1) Mapping and analyzing initial defects. 2) Developing an effective way to detect a low defect rate. 3) 3D mechanical modeling that focuses on multiple failure interfaces and modes. 4) Simulating stress factors and their impacts. 5) Verifying hypothesis with assembly design of experiment (DOE) and ultimately improved yield.
Passive Die Alignment in Glass Embedded Fan-Out Packaging
Authors: Ostholt Roman , Santos Rafael , Ambrosius Norbert , Dunker Daniel , Delrue Jean-Pol 
Published: December 2019

Abstract
The objective of this paper is to demonstrate the feasibility of glass mounting substrates made by Laser Induced Deept Etching (LIDE) technology, which include newly developed passive die alignment structures. The aim of these structures is to compensate for potential die misalignments and die shift issues which become severe when moving to panel level fan-out packaging.
The passive alignment structures are located at two adjacent edges of the rectangular cavity and are created in the same process step as the open cavities. The filigree spring-like alignment structures benefit from being processed in a crack- and stress-free manner. Although the spring elements have a minimal dimension of less than 100 μm, these structures show an outstanding break strength while deformed when active dies are placed in the mounting cavity. Depending on the design, the spring elements can have a stroke of several tenths of micrometer which enable the compensation of rather large die displacements.
Here, we present examples for LIDE-processed mounting glass substrates with the described features. The performance of the proposed design and method was evaluated with a die accuracy study. Test dies with alignment marks were placed in the cavities and measured relatively to alignments marks on the mounting glass substrate. The Fan-Out packaging concept based on the research shown here combines several advantages: due to the relatively high Young's modulus of the glass, the reconstituted wafer shows less warpage than in the state-of-art; while the passive alignment structures reduce the die shift to a minimum (depending on dicing accuracies and through package vias for package-on-package or antenna-in-package application), and can be readily integrated.
Mechanical Modeling and Continuous Process Improvement
Authors: Harker Shane D. , Hernandez Mercedes T. , Lambird Gene 
Published: December 2019

Abstract
Short design cycles for integrated circuits and packages drive the need for efficient problem solving and rapid results. Improved mechanical modeling software and increased computing power have taken these computation-heavy tools and made them versatile enough to support main-stream, real-time production needs. The utility of these tools has been significantly improved by simplified work flows to create detailed geometries and complex assemblies, improved mesh generation algorithms, and solve time reduction. Mechanical modeling software has a wide range of application which traditionally has been focused on design of large structures. Despite their general applicability, these tools have not been optimized for microelectronics in terms of absolute dimensions, fine structure count, and range of scale from the smallest to the largest component. Finding solutions to these problems pays off in fewer design cycles and significant process yield improvements. This paper will show multiple examples of process-induced stress, driven by material properties and manufacturing. They have been created using a variety of FEM tools, including ANSYS and Abaqus.
Quasi-Half Loop Bond Wire Antennas for Emerging Wireless Communication and Radar Sensor Systems
Authors: Ndip Ivan , Le Thi Huyen , Schneider-Ramelow Martin , Lang Klaus-Dieter 
Published: December 2019

Abstract
Emerging wireless communication and radar sensing systems require large channel bandwidths to meet the requirements of some key applications. Antennas used for the development of these systems must be designed to enable these large bandwidths. In this work, we present the characteristics of a quasi-half loop bond wire antenna (QHL-BWA) which enable large bandwidths and high gains at mmWave frequencies. The antenna was modelled and simulated using Ansys HFSS. Test samples were designed and measured. Very good correlation was obtained between measurement and simulation results.