bluuebunny/crossref_metadata_2025_split huggingface dataset:
Are Fiscal Deficits Really Inflationary? An Investigation Into Ethiopia’s Experience
Authors: Alemu Minyahil 
Published: December 2020

Abstract
This study establishes long-run relations between budget deficits and inflation, while controlling for money supply owing to the justified links between deficits and money supply especially for developing countries. We employed time series data with temporal coverage of 1980-2018. Augmented Dickey Fuller has tested nonstationary for all series, but with all stationary at first difference. The Engle-Granger (1981) methodology for Cointegration tested long-run relation between budget deficits, money supply and inflation. Due to Laney and Willet (1983), the conventional least squares regression was adopted to estimate parameters of long-run equation. The results evidenced that fiscal deficits and money supply have been at the root of galloping inflation in Ethiopia. Besides, budget deficits have been the root cause of money supply growth in Ethiopia; while giving empirical support to the hypothesis that, governments of least developed countries resort to monetize large portion of their deficits. There is a need to reform the fiscal aspect of the government, if the mounting rate of deficits has to be lessened. Budgetary imbalances can be rectified through enhancement of domestic capital market and setting limits on central bank borrowing. Besides, it could be vital to expand the tax base as well as intensify efficiency of the existing tax system in the country.
Valuation of Start-Up Company Using Real and Financial Assets Rate of Return
Authors: Loebiantoro Ika Yanuarti , Listiawan Jeunifer Nia 
Published: December 2020

Abstract
The objective of this research is to analyse and describe the valuation of start-up company using the Discounted Cash Flow Analysis. There are several combination of discount rates, including combination of beta, risk free rate and market return. There are several market returns applied in the calculation of the discount rate, such as gold price, crude oil, property price index and IDX composite. The object of research is PT. XYZ, which is a start-up company engaged in the field of software (System & Mobile Application). The results showed that PT. XYZ is a start-up that has a systematic risk (Beta) of 5.1 point, which is lower than the average beta of hi-tech start-up companies. The fair value of PT. XYZ is Rp 3,729,416,128,911. Using a confidence level of 95%, the deviation of company’s value is between Rp102,726,286,407 and Rp7,356,105,971,415. It is concluded that valuing the start-up using real and financial asset return as a benchmark will provide high fair value. The reason is the return in those assets are lower because of lower risk. The lower rate of return will make the value of the start-up company higher. Therefore, investors will request the start-up company to provide higher value.
Towards Effective Music Therapy for Mental Health Care Using Machine Learning Tools: Human Affective Reasoning and Music Genres
Authors: Rahman Jessica Sharmin , Gedeon Tom , Caldwell Sabrina , Jones Richard , Jin Zi 
Published: December 2020

Abstract
Music has the ability to evoke different emotions in people, which is reflected in their physiological signals. Advances in affective computing have introduced computational methods to analyse these signals and understand the relationship between music and emotion in greater detail. We analyse Electrodermal Activity (EDA), Blood Volume Pulse (BVP), Skin Temperature (ST) and Pupil Dilation (PD) collected from 24 participants while they listen to 12 pieces from 3 different genres of music. A set of 34 features were extracted from each signal and 6 different feature selection methods were applied to identify useful features. Empirical analysis shows that a neural network (NN) with a set of features extracted from the physiological signals can achieve 99.2% accuracy in differentiating among the 3 music genres. The model also reaches 98.5% accuracy in classification based on participants’ subjective rating of emotion. The paper also identifies some useful features to improve accuracy of the classification models. Furthermore, we introduce a new technique called ’Gingerbread Animation’ to visualise the physiological signals we record as a video, and to make these signals more comprehensible to the human eye, and also appropriate for computer vision techniques such as Convolutional Neural Networks (CNNs). Our results overall provide a strong motivation to investigate the relationship between physiological signals and music, which can lead to improvements in music therapy for mental health care and musicogenic epilepsy reduction (our long term goal).
Controlled K-Fusion Frame for Hilbert Spaces
Authors: Assila Nadia , Kabbaj Samir , Moalige Brahim 
Published: December 2020

Abstract

K-fusion frames are a generalization of fusion frames in frame theory. In this paper, we extend the concept of controlled fusion frames to controlled K-fusion frames, and we develop some results on the controlled K-fusion frames for Hilbert spaces, which generalize some well known results of controlled fusion frame case. Also we discuss some characterizations of controlled Bessel K-fusion sequences and of controlled K-fusion frames. Further, we analyze stability conditions of controlled K-fusion frames under perturbation.
Impacts of the Transformation to Industry 4.0 in the Manufacturing Sector: The Case of the U.S.
Authors: Rojko Katarina , Erman Nuša , Jelovac Dejan 
Published: December 2020

Abstract

Background and purpose: The transformation to Industry 4.0 increases the number of robots installed within industries, which brings great shifts in industrial ecosystems. For this reason, our research goal was to analyze the key performance indicators to investigate the economic and social sustainability of the changes in production.

Methodology: The combination of official (World Bank, U.S. Bureau of Labor Statistics) and publicly available (Federal Reserve Economic Data, Industrial Federation of Robotics) data was used for statistical data processing, including comparison, correlation, cross-correlation and vector autoregression analysis, to present the past developments and also to predict future trends within the U.S. manufacturing sector.

Results: In contrast to robust industry robotization observed in the 2008–2018 period, the share of manufacturing output and employment declined. Nonetheless, the vector autoregression model forecast shows, that the U.S. manufacturing sector has arrived at a turning point, after which robotization can increase employment and labor productivity of workers, while also stimulating further growth of their education levels.

Conclusion: The transition to Industry 4.0 has a major impact on increasing demands for new knowledge and skills for increased productivity. Accordingly, forecasted growths of analyzed manufacturing indicators suggest that negative impacts of robotization in the recent past were only temporary, due to the entrance to the Industry 4.0 era. Nonetheless, additional policies to support sustainable industry development are required.
Synthesis and in vitro Antifungal Efficacy of Copper-silica Nanocomposites against Pathogenic Fungi of Rice
Authors: Thanh Hai Nguyen Thi , My Phuong Ton Nu , Luong Nguyen Viet , Toan Dao Khac , Hoa Tran Thai , Thu Thuy Nguyen Thi 
Published: December 2020

In this study, copper-silica nanocomposites were synthesized by using silica nanoparticles extracted from rice husks as carriers for copper nanoparticles. Copper-silica nanocomposites (Cu-silicaNPs) were synthesized by a simple and effectively chemical reduction process with hydrazine as a reducing agent. Cu-silica NPs were characterized by X-ray diffraction, scanning electron microscopy, transmission electron microscopy, high-resolution transmission microscopy, infrared spectroscopy and energy-dispersive X-ray spectroscopy. The average size of nanocomposite materials is about 20 nm. Cu-silica NPs products had a high inhibitory effect on Pyricularia oryzae and Rhizoctonia solani, causing rice blast and sheath blight.
A rare case of intramedullary schwannoma at conus medullaris: A case report with review of literature
Authors: Varshney Rahul , Bharadwaj Pranjal , Choudhary Ajay , Paliwal Purnima , Kaushik Kaviraj 
Published: December 2020

Background:
Intramedullary spinal schwannomas constitute only 0.3% of primary spine tumors. We could identify only 13 such cases involving the conus that were not associated with neurofibromatosis (NF). Here, we report a 70-year-old male without NF who was found to have a paraparesis due to a schwannoma of the thoracolumbar junction/conus (D11-L2).

Case Description:
A 70-year-old male presented with an L1-level paraparesis with urinary incontinence. The magnetic resonance showed an intramedullary mass of 85 × 10 mm extending from D11 to L2; it demonstrated significant patchy enhancement. The patient underwent a D12 and L1 laminectomy with gross total excision of the mass that proved to be a schwannoma. Three months postoperatively, he was able to ambulate with support, and regained sphincter function.

Conclusion:
Intramedullary schwannomas involving the conus/thoracolumbar junction are rare, and can be successfully excised resulting in good outcomes.
Two Unique Case Studies Performed With Photoemission Microscopy (PEM)
Authors: Shade G.F. 
Published: December 2020

Abstract
Two cases are presented where photoemission microscopy (PEM) quickly reduced the analysis time by providing qualitative evidence of the suspected failure mechanisms. In both cases, the failures were delaying product shipments and the PEM technique was a "last hope" approach where other proposals were either not successful, or were not available to the analysts. In case one, package residue caused a leakage path that was located and confirmed by PEM. The second case required the use of PEM to observe uniformity of current flow within a polysilicon region. This second analysis provided absolute evidence that the current flow was nonuniform which supported the suspected failure mechanism. It is believed that this is the first reported observation of these two emission mechanisms during a failure analysis.
Grains Observation Using FIB Anisotropic Etch Followed by AFM Imaging
Authors: Yamashita H. , Hata Y. 
Published: December 2020

Abstract
It is becoming more important to observe structures and failed sites in LSIs. An atomic force microscope (AFM) can obtain atomic scale topographic images on sample surfaces. To analyze failures in LSIs, several treatments for the AFM observation, such as wet etching and mechanical polishing for a crosssectional imaging, have been proposed so far. A good correlation of AFM images using FIB anisotropic etch with those acquired by conventional technique such as SIM and TEM has been demonstrated A crystallographic information about Al thin film is obtained by AFM using this technique.
Burn-in Failure Analysis of 0.5μm 1MB SRAM: Barrier Glue Layer Cracks and Tungsten Plug “Worm Holes”
Authors: Widener E. , Tatti S. , Schani P. , Crown S. , Dunnigan B. , Moss J. , Chan C.M. , Hamid N.H. , Soon F.Y. , Fitch J. , Deeters E. 
Published: December 2020

Abstract
A new 0.5 um 1 Megabit SRAM which employed a double metal, triple poly CMOS process with Tungsten plug metal to poly /silicon contacts was introduced. During burn-in of this product, high currents, apparently due to electrical overstress, were experienced. Electrical analysis showed abnormal supply current characteristics at high voltages. Failure analysis identified the sites of the high currents of the bum-in rejects and discovered cracks in the glue layer prior to Tungsten deposition as the root cause of the failure. The glue layer cracks allowed a reaction with the poly/silicon, causing opens at the bottom of contacts. These floating nodes caused high currents and often latch-up during burn-in. Designed experiments in the wafer fab identified an improved glue layer process, which has been implemented. The new process shows improvement in burn in performance as well as outgoing product quality.
Signature Analysis: Statistical Models and Their Application to FA
Authors: Lakshminarayan C.K. , Pabbisetty S. , Adams O. , Pires F. , Thomas M. , Han C.-P. 
Published: December 2020

Abstract
This paper deals with the basic concepts of Signature Analysis and the application of statistical models for its implementation. It develops a scheme for computing sample sizes when the failures are random. It also introduces statistical models that comprehend correlations among failures that fail due to the same failure mechanism. The idea of correlation is important because semiconductor chips are processed in batches. Also any risk assessment model should comprehend correlations over time. The statistical models developed will provide the required sample sizes for the Failure Analysis lab to state "We are A% confident that B% of future parts will fail due to the same signature." The paper provides tables and graphs for the evaluation of such a risk assessment. The implementation of Signature Analysis will achieve the dual objective of improved customer satisfaction and reduced cycle time. This paper will also highlight it's applicability as well as the essential elements that need to be in place for it to be effective. Different examples have been illustrated of how the concept is being used by Failure Analysis Operations (FA) and Customer Quality and Reliability Engineering groups.
A Case Study of Post De-tape Cleans on Mold Compound Adhesion
Authors: Saxon D. , Sims R. 
Published: December 2020

Abstract
Good adhesion of mold compounds to the die surfaces of plastic encapsulated integrated circuits is an important quality and reliability issue. A comparison was made of mold compound adhesion to the die surface under two new wafer cleaning methods after backgrind detape processes. The normal cleaning procedure was compared to a solvent-based clean and a water-based clean. Split lots were inspected using acoustic micro imaging (AMI) to measure the amount of delamination. Reliability studies were used to characterize the long term effect of the mold compound/die surface delamination.
Macro and Micro Thermal Model of an Elevated Temperature Dielectric Breakdown in Printed Circuit Boards
Authors: Stutzman R. , Sathe S. , Sammakia B. 
Published: December 2020

Abstract
A computational macro and micro thermal model of a printed circuit board dielectric breakdown due to local and global heating of the laminate material is presented in this paper. On a macro level, under certain conditions, the circuit board temperature can approach the glass transition temperature (Tg) due to electronic surface mounted components dissipating heat to the board surface. Under these conditions interfacial micro cracks or dielectric inhomogeneities can be aggravated to an extent where localized voltage breakdown can occur across copper planes within the board. The micro thermal modeling results demonstrate that even under relatively high defect resistance levels the localized temperature at the defect site can greatly exceed the Tg of the dielectric material resulting in carbonization and eventually catastrophic failure. A temperature profile at the defect site clearly shows the spike in the local temperature due to the low thermal conductivity properties of the dielectric material and the localized high current density. The thermal modeling was performed using Flotherm (trademark of Flomerics Limited) code.
Mechanism Study of Contact Corrosion in Unpatterned Metal Wafer
Authors: Chang C.-H. , Huang Y.-S. , Chang H.-W. 
Published: December 2020

Abstract
A new type metal corrosion, which occurred at contact hole of unpatterned metal wafer, is presented. This type of corrosion is strongly related to wafer queue time from metal sputtering to metal etching, it is thought to be due to chain reaction of chlorine from environmental results., fluorine from wafer edge and moisture desorbed by undermetal dielectric (ILD). Moreover, all corrosion sites accompany with poor metal stepcoverage that is caused by either large seams in W plug or rough ILD surface. Experimental results are presented which show the influence of water desorbed by different ILD materials, capability of water barrier with different barrier metal materials and post W etchback (WEB) thermal treatment on corrosion resistance. Mechanism are proposed to explain the formation of corrosion on unpatterned metal.
Experimental Figures for the Defect Coverage of IDDQ Vectors
Authors: Clemminck I. , Swerts U. , Darquennes M. , van Sas J. , Vanhaeverbeke S. 
Published: December 2020

Abstract
In IDDQ testing of CMOS ASICs (as in conventional voltage based testing) actual defect coverage, rather than modeled fault coverage figures are relevant to achieving product Q&R targets. This paper reports experimental data on the defect coverage of IDDQ vectors taken from several ASICs from different semiconductor suppliers. We present our generic IDDQ methodology that has been run on these ASICs, including automated IDDQ vector generation/grading and the high speed IDDQ monitor OCIMU. Data are presented on absolute IDDO defect coverage, as estimated from correlation with voltage based tests, on the relative defect coverage of pseudo-stuck-at and the toggle fault models, on the defect coverage of reduced IDDQ sets and on the pattern sensitivity Of IDDQ rejects. It is demonstrated that the pictures shown by modeled fault coverage and actual defect coverage can differ significantly and therefore, theoretical fault coverage figures are not the correct data to assure Q&R targets. We have measured very good IDDQ defect coverage on random logic, but we also show real life cases where IDDQ testing alone is inefficient in screening Q&R hazards.
Scanning Fluorescent Microthermal Imaging
Authors: Barton D. L. , Tangyunyong P. 
Published: December 2020

Abstract
We have developed scanning fluorescent microthermal imaging (SFMI), a new failure analysis technique. The fluorescent microthermal imaging (FMI) technique has been used for over a decade in its original form [1-2]. FMI normally relies on the use of a cooled, slow-scan CCD camera and a flood beam fluorescence pump source, usually an ultraviolet arc lamp. Interest in FMI has grown greatly over the past few years [3-9] due largely to its unique combination of high spatial and thermal resolution. In this paper, we demonstrate that the existing infrastructure found on a scanning laser microscope (SLM) is capable of acquiring the necessary images for SFMI using its scanned laser source and a point detector. The implications ofthis work are significant in that now high spatial and thermal resolution images can be made using an SLM without the need of additional, expensive hardware.
Application of Backside Photo and Thermal Emission Microscopy Techniques to Advanced Memory Devices
Authors: Lee S.-S. , Seo J.-S. , Cho N.-S. , Daniel S. 
Published: December 2020

Abstract
Both photo- and thermal emission analysis techniques are used from the backside of the die colocate defect sites. The technique is important in that process and package technologies have made front-side analysis difficult or impossible. Several test cases are documented. Intensity attenuation through the bulk of the silicon does not compromise the usefulness of the technique in most cases.
Temperature-Dependent Electronic Circuit Analogy for Predicting Wire Temperature as a Function of Current
Authors: Ditz M. J. 
Published: December 2020

Abstract
A model has been developed accurately predicting the temperature along a length of wire heated by passing a current through it. The wire is modeled as a transmission line with its thermal properties mapped onto the appropriate electronic analogs. A program describing the model circuit has been written in PSPICE such that time versus temperature curves can be generated for any wire given the material, diameter, length, and stressing current. The model has been dynamically temperature corrected, and its accuracy has been demonstrated for two types of fuses and one type of bond wire. This model is useful for predicting fusing conditions of fuse elements or bond wires, assessing the reliability of a material for given operating conditions (by knowing the temperature the material would attain), derating for design, and as a failure analysis tool by providing insight into an overstress condition in which a wire has melted open.
Characterization of Californium – 252 (252Cf) as a Laboratory Source of Radiation for Testing and Analysis of Semiconductor Devices
Authors: Plante J. , Allen E. , Lum G. 
Published: December 2020

Abstract
Bipolar silicon transistors were exposed to Californium (252Cf) radiation and neutron radiation obtained from nuclear facilities. The effect of the radiation on the transistors was measured by recording the transistor's electrical characteristic as a function of radiation fluence. Correlation between Californium (252Cf) -induced and neutron-induced damage and previously published data for proton-induced radiation damage was made. Finally, the effect ofthenna1 annealing on gain recovery was also investigated.
Dendritic Growth Failure of a Mesa Diode
Authors: Singh P. , Cozzolino V. , Galyon G. , Logan R. , Troccia K. , Hurd J. L. , Tsai P. 
Published: December 2020

Abstract
The time delayed failure of a mesa diode is explained on the basis of dendritic growth on the oxide passivated diode side walls. Lead dendrites nucleated at the p+ side Pb-Sn solder metallization and grew towards the n side metallization. The infinitesimal cross section area of the dendrites was not sufficient to allow them to directly affect the electrical behavior of the high voltage power diodes. However, the electric fields associated with the dendrites caused sharp band bending near the silicon-oxide interface leading to electron tunneling across the band gap at velocities high enough to cause impact ionization and ultimately the avalanche breakdown of the diode. Damage was confined to a narrow path on the diode side wall because of the limited influence of the electric field associated with the dendrite. The paper presents experimental details that led to the discovery of the dendrites. The observed failures are explained in the context of classical semiconductor physics and electrochemistry.
Through-Transmission Acoustic Inspection of Ball Grid Array (BGA) Packages
Authors: Moore T. M. , Hartfield C. D. 
Published: December 2020

Abstract
The application of through-transmission acoustic inspection to packaging strategies such as ball grid array (BGA) circumvents many of the problems encountered applying conventional pulse-echo inspection to BGAs. A unique feature of pulse-echo acoustic inspection is detection of delaminations in internal interfaces, which is based on the inversion of the pressure pulse (1800 phase shift) at the delamination. This article describes the advantages and applications of pulse-echo acoustic inspection and presents an experimental comparison of pulse-echo and through-transmission methods. It discusses the difficulties that BGA packages present to pulse-echo inspection, such as the complexity of the pulse overlap problem in pulse-echo inspection of the laminate, the problem of multiple echo signals overlapping in time is the possibility of interference effects, and that phase inversion cannot always be relied upon to assist in delamination detection. Practical considerations for through-transmission inspection are also covered.
Breakup Sequence of the TWA Flight 800 Airplane: How it was Determined That an Explosion of the Wing Center Section Fuel Tank Initiated the Breakup
Authors: Wildey James F. 
Published: December 2020

Abstract
A group composed of representatives from the National Transportation Safety Board and the investigation parties used fire and soot patterns, recovery positions of the pieces, witness marks, fracture directions, deformations, and stress analysis to document the breakup sequence of the TWA Flight 800 airplane and to determine that an explosion of the wing center section fuel tank initiated the accident.