bluuebunny/crossref_metadata_2025 huggingface dataset:
Active Filters and Hybrid Technology
Authors: Moran P. L.
Published: June 2007

The conditions under which the choice of circuit used for the active filter is important are discussed with relationship
to both the technology used and the application of the circuit. A number of common circuits are critically analysed
and compared with respect to these criteria.
A Rating Criterion for Film Resistors
Authors: Law H. T.
Published: June 2007

After experimental work has been carried out to determine the required constants, the resistor film temperature
may be calculated from its dimensions and power dissipation using an expression which takes account of, and makes
a reasonably good approximation for, the heat dissipated by lateral conduction. The arithmetic is simple and well
suited to rapid processing using a programmed electronic calculator.
Precision Thickfilm Active RC Filters
Authors: Müller E. , Gloger M. , Schmidt E. , Ulbrich W.
Published: June 2007

The application of hybrid thickfilm technology to the realization of precise active RC filters with passband
frequencies up to 3.5 kHz is described and it is shown that relatively expensive thin‐film technology can often
be replaced by the simpler thickfilm process.
Foil Circuits
Authors: Houska K. H.
Published: June 2007

Progress in integration of passive components is of essential importance for many applications along with the high
integration rate of semiconductors. A further asset in view of the integration of passive components, like the field
of peripheral circuits, is a new technology on the base of low‐cost plastic materials, called Sicufol®. With this
new technology it is possible to integrate capacitors, coils and NiCr‐resistors. Investigations shows that passive
components with very good properties can be produced. A summary of climatic tests carried out on NiCr‐resistors
with Cu‐contacts and capacitances are shown. HF‐applications and some low frequency applications (e.g. a simple
resistor network) show that conventional or hybrid components can be soldered on plastic foils using this technology.
Different Chip Interconnecting Techniques
Authors: Danielsson Hans
Published: June 2007

It is shown that in order to interconnect more than 25 I.C. chips (SSI and MSI) or to use LSI chips together with
other kind of chips, the chips must be tested before mounting. Then only TAB‐ or CC‐techniques can be used.
The advantages and disadvantages of the different techniques are discussed.
Quality and Reliability in Hybrid Circuits
Authors: Read R. F.
Published: June 2007

The quality and reliability of hybrid circuits is examined, with particular reference to the BS9000/CECC systems.
It is shown that the capability approval approach developed within the BS9000/CECC systems is appropriate to
hybrid circuits where only small quantities of each circuit are produced and the steps involved in obtaining
capability approval are discussed.
Properties of Nickel Films Prepared by R.F. Sputtering and Interdiffusion Analysis of Ta2N–Ni Films
Authors: Abdin S. , Huber A. , Morillot G. , Val C.
Published: June 2007

Ni film deposition by r.f. sputtering and etching conditions have been investigated. The contact resistance and
adhesion of this Ni layer deposited directly onto Ta2N films have also been studied in air and at elevated
temperatures. In this combination, the Ta2N/Ni interdiffusion analysis was carried out by the Secondary Ion
Mass Spectroscopy (SIMS).
Influence of Evaporation‐Deposition Geometry on Conductive Thin Films
Authors: Griessing J.
Published: June 2007

There is a striking dependence of the evaporation deposition geometry (i.e. angular distribution of the incident
vapor beam) on the properties of deposited conductive films. This paper discusses solderability, adhesion and
long‐term stability of adhesion of Ti‐Pd‐Au, Ti‐Au and Ti‐Cu films. In all cases the above properties were improved
by an evaporation deposition geometry with steep angles of the incident vapor beam.
A New Approach to the Topological Design of Hybrid Circuits
Authors: Ulbrich Walter , Van Der Leeden Rudolf
Published: June 2007

A computer‐aided topological hybrid layout‐design procedure is proposed, that yields the wanted principal routing
in the form of a geometrical planarization graph. A so‐called grid‐embedding of a circuit graph into the Euklidean
plane enables us to observe all except one of the various technological constraints. The real problem is reduced to
finding a proper arrangement of “nets” and “flocks” in the plane in order to meet the omitted cross‐capacity
constraint. The solution is accomplished by a constructive and implicit enumeration procedure, which is used within
an interactive man‐machine design process.
D.C. Sputtering Process: Its Characterization and its Problems When Applied to Tin‐Dioxide Thin‐Films
Authors: Sabnis Anant G.
Published: June 2007

This paper discusses the problems involved in obtaining reliable and reproducible thin films of Sb‐doped
SnO2 films by the d.c. sputtering process. An attempt to characterize the process is made by correlating the
deposition parameters with the factors that contribute to the conductivity of the SnO2 films. The areas of
concern are identified, and guidelines are offered for making the process and the film properties controllable.
Evaluation of Inhomogeneous Resistive Layers by a Four Point Method
Authors: Fodor György , Szilágyi Miklós , Zombory László
Published: June 2007

This paper describes the determination of the sheet resistance of a narrow strip located in a homogeneous resistive
layer of different resistivity. The application of the method for the evaluation of inhomogeneous layers used for
thermoprinter head production is discussed.
Preparation and Properties of Thick Film Resistors Containing Cadmium Glasses and Cadmium Oxide
Authors: Kužel R. , Broukal J.
Published: June 2007

The electrical properties of resistors comprising finely divided CdO and cadmium glass, were investigated. The
change in a temperature coefficient of resistance from about −500 ppm/℃ to +70 ppm/℃ was realized by addition
of a further component to the resistor paste. Differential thermal analysis, X‐ray diffraction analysis and scanning
electron microscopy were used for studying crystalline phases in glass containing CdO.
Generalized Theory of Electrical Conductivity and Current Noise for Discontinuous Metal Films Over aWide Range of Temperatures
Authors: Celasco M. , Masoero A. , Mazzetti P. , Stepanescu A.
Published: June 2007

A complete discussion with an extension to the high temperature range of the main results of a recent theory1 on
the electrical conduction and current noise in discontinuous metal films is given. In this theory the main conduction
mechanism is a direct‐tunnelling process of the electrons between metal islands within the insulator substrate. The
tunnelling electrons must overcome a potential barrier which is temperature dependent. The model assumes that
the electrons trapped in surface states can tunnel in the metal states giving rise to a double charge layer at the
interface. The current noise is generated by a modulation mechanism of the carrier direct tunnelling due to thermal
fluctuation of the potential barrier height, generated by a corresponding fluctuation of the surface charge.

Experimental results for the conductivity and current noise behaviour on Au film deposited on sapphire tube are
also given up to a temperature of about 950 K, and interpreted on the basis of the above theory.
Comparison of Enameled Steel Substrate Properties for Thick Film Use
Authors: Stein S. J. , Huang C. , Gelb A. S.
Published: June 2007

Porcelain enameled steels have had a long history of industrial, structural and related applications. Recent interest
in such materials has centered on electrical uses as a substrate for hybrid circuits, additive printed wiring, and
packaging. A study of some of the critical properties of available enameled steels was undertaken.

Five types of enameled steel substrates from three manufacturers were tested. The electrical properties studied
included dielectric constant, dissipation factor, voltage breakdown, surface and bulk insulation resistance. The
effect of humidity on the insulation resistance of the enamel coatings themselves was compared. The influence of
the thermal conductivity of the substrates was also examined.

The properties of a thick film resistor system was determined on the various enamel steel substrates. The
properties tested included resistivity and TCR firing sensitivity.

The effect of the type of substrate on the properties of a selection of thick film conductors was determined.
Conductivity and gold and aluminum wire bond strength were compared on the various substrates.

The dielectric properties of a multilayer/crossover dielectric thick film material were compared among 96%
alumina, soda‐lime glass and the various enameled steel substrates.

Many individual differences between the enameled steel substrates were found. However, all of the substrates
could be utilized to produce satisfactory thick film circuits when the proper choice of thick film materials was made.

Continuing changes, improvements and additional sources of supply are expected to overcome some of the
present shortcomings. These should enhance the use of such substrates for large area uses and lower cost applications.
Computer Aided Design of Adjustable Thin Film Resistors
Authors: Francois Marcel
Published: June 2007

A computer program has been developed, which calculates any adjustable thin film resistor from simple input
data (electrical, geometrical, positional, orientational), punched on “input cards”. The “output cards”, which
contain the coordinates, are fed to a numerically controlled draughting machine, which produces either an
intermediate ink‐on‐paper drawing or the final cut‐and‐strip artwork. Our CAD method proceeds in several steps,
offering all the permitted solutions and providing for designer′s options.
S.A.W. Technology for Resonator Structures
Authors: Sleeckx F. , Naten T. , van de Capelle A. , Vandewege J.
Published: June 2007

The different processing steps of S.A.W. technology are reviewed. Special attention is given to the technology
of the distributed feedback resonator.
Optimization of Thick Film Resistors for Low Drift
Authors: Björklund Gunnar , Linde Lars
Published: June 2007

In order to minimize drift in a thick film resistor both printing and trimming parameters have to be optimized
carefully.

With the aid of a linear theoretical model it is shown how the resistance drift in the bulk transition zone
and terminals of the resistor can be calculated for both trimmed and untrimmed resistors.

The theoretical results are used for optimization of laser trimmed high ohmic resistors. The experimental
results are in good agreement with the theoretical predictions and confirm that thick film resistors can be
optimized for low drift.
A ZnTe Thin Film Memory Device
Authors: Burgelman Marc
Published: June 2007

Thin ZnTe layers show memory switching characteristics. The electrical conduction in the non‐ohmic off‐state is
shown to be due to Poole–Frenkel emission. An electrothermal model is proposed to explain the off‐on transition;
this model is confirmed by experiments. The characteristics of metal–ZnTe–metal sandwich structure as a memory
device are investigated. The switching parameters are stable during a series of switching events, but the rather poor
write–erase lifetime (200 cycles) still constitutes a handicap for the operation as a device.
AVI Transponder
Authors: Kamata Shoichi , Kimura Yoshinori , Sakuragi Johji
Published: June 2007

A newly developed AVI transponder is to be used in Automatic Vehicle Identification (AVI) system, which provides
identification of moving vehicles passing by a certain location, as to its registration number, and classification etc. This
AVI system is characterized by the fact that it utilizes ceramic resonators in the composition of a transponder
identification code, and a single microwave carrier to convey an interrogation signal to, and a response signal from,
that transponder.

The transponder is a completely passive device free of any power supply, and operates as a “Reflector”. Overall
external dimensions of transponder are 7 × 10 × 1 cm with a weight of 150 grams, the unit is compact, light weight
and can be mounted easily on the vehicle, and is easy to carry.

All of the circuitry required for the transponder is provided in the form of microstrip lines utilizing MIC (Microwave
Integrated Circuit) technology on the PTFE‐glass fibre laminate substrate. The transponder circuitry, which consists
of printed antenna, microwave modem circuit and medium frequency circuit, is patterned on both surfaces of the single
substrate. In this paper, operation principle, circuitry and construction of the transponder will be described.
Thick Film Temperature Compensating Circuit for Semiconductor StrainGauges
Authors: Arima Hideo , Ikegami Akira , Tosaki Hiromi , Ai Mitsuo , Matsuoka Yoshitaka , Okayama Tsutomu
Published: June 2007

Thick film circuits were developed for temperature compensating of semiconductor strain gauges and for connecting
the gauges to amplifiers in electronic pressure and differential pressure transmitters. In each circuit, ten Au pads for
Al wire bonding and thirteen Ag/Pd pads for soldering must be fabricated on a small substrate. The results of the
research are shown below.

(1) The resistance values and the thermistor constants required for the thermistors are 0.9 ± 0.09 kilo‐ohm and
2500 ± 40 Kelvin, respectively. Those characteristics are realized by developing a paste composition composed of a
new spinel type oxide (Mn1.6Co0.8Ni0.35Ru0.25O4) RuO2 and glass.

(2) Accelerated life tests of the thick film thermistors reveal that the resistance drift rates of the thermistors are less
than ±0.02 %/year at 120°C.

(3) Life tests clarify that the wire bonding pads fabricated by using ESL 8882 Au paste keep more than 4 grams in
pull strength, and that the soldering pads fabricated by using Sumitomo CLP 495A Ag/Pd paste are more than 1
kilo‐gram in pull strength.

(4) The temperature dependence of zero shift and span shift in the pressure transmitter are suppresed within ±0.2%
between –40°C and 120°C by using the thick film circuit developed.
Hybrid Voltage Regulator for Automobiles
Authors: Sawamura Akihiro , Takahashi Tadashi , Denda Sei-Ichi
Published: June 2007

In the course of the development of hybrid voltage regulators for automobile use, increasing the reverse blocking
voltage with decreasing of saturation voltage for output power darlington transistors, the capability of monolithic IC
chip against surge pulses generated in cars, and an improvement of the pattern design of thick film in order to
withstand temperature cycling, have been important subjects. Power darlingtons have more than 150 V of reverse
voltage as well as large secondary breakdown capacity and less than 1.2 V of saturation voltage. A monolithic chip
having small saturation voltage and more than 500 mA of surge current capability, has been developed. A
neck‐shaped thick film pattern was developed to make soldering in a controlled manner. The problems in the earlier
stage with surge current and temperature cycling have been almost solved by these improvements.

In this paper the characteristics of the transistor and the monolithic chip the structure of the device and related
problems observed in temperature cycling are described.
Combination of Thick‐Film Dielectric/Thin Film Conductor for FinePattern Formation of Multi‐Layer Substrate
Authors: Tamura Takashi , Dohya Akihiro , Inoue Tatsuo
Published: June 2007

Presented in this paper is a realization of Multi‐Layer Substrate with 30 μm signal pattern width and 100 μm square
via holes on a 100 mm square ceramic substrate. To obtain this fine signal pattern width, a thin film technique, “GSP”
process, has been applied on a thick film dielectric layer. For the 100 μm square via holes through the thick film
dielectric, a new thick film technique, “DD” process, has been developed utilizing a photolithographic technique. This
paper describes the processes and the results obtained by the method.
The Anomalous Properties of Polysiloxane Films
Authors: Ryšanek Vladimír
Published: June 2007

An electron beam was used to create thin polysiloxane films from methylphenylsiloxane and the anomalous properties
of permittivity and temperature dependence, the resistivity dependence on humidity and the permittivity dependence
on pressure of air or argon, was examined. These anomalous properties can be potentially applicable to humidity
probes, pressure gauges and for miniature capacitors.
Process and Accelerated Aging Test of GANG Bonding for Gold‐PlatedTAB Outer Leads
Authors: Nitta M. , Tsuge T. , Hiki Y. , Kato R.
Published: June 2007

This paper presents the evaluation results of thermocompression GANG Bonding of gold‐plated TAB outer leads to
three kinds of metallized ceramic substrates. Gold‐Selective Plating (GSP) substrates for multi‐chip package, Thick
Film (TF) substrates for multi‐chip package and Single Chip Packages (SCP) which have a trimetal combination of
refractory metal (tungsten), Nickel and Gold.

The bonding parameters such as the bonding tool (thermode) temperature, pressure, bonding time and preheat
temperature were examined on each substrate to get optimum values. As the result, a relation between pull strength
and the lead deformation shows that the TAB leads should be bonded with 15–65 percent deformation, the recommended parameters are; the tool temperature of 380–430℃, the bonding pressure ranging from 35 to
45 kg/mm2, with the preheat temperature of 150℃ and the bonding time from 1.0 to 2.5 seconds.

The evaluation of initial bondability shows that TAB GANG Bonding has the capability of excellent bonding
strength; above 120 grams with standard deviation of less than 20 grams, and the necessity of OLB pads flatness; less
than ±12 μm for one ounce copper lead. The normal storage of the substrate and the lead does not affect the
bondability. And the results of accelerated aging test of 125℃, 150℃ and 175℃ for more than 8,000 hours show
that a lifetime of greater than 70 years at 65℃ operating temperature is predicted. The effective activation energy for
the pull strength degradation is 0.86–1.05 eV. This is in reasonable agreement with predictions for interdiffusion of
Cu–Au. And no significant degradation of the electric resistance was observed on the GSP samples.

The feasibility and the high reliability of the GANG Bonding for gold‐plated TAB outer leads were confirmed.
Thin Film Technology Used in Bell System Telecommunication Circuits
Authors: Worobey Walter
Published: June 2007

This paper describes the thin film technology used for telecommunication circuits in the Bell System. Vacuum
deposition and photolithography form the basis for the film processing steps. Nitrogen doped tantalum films are used
to form the very stable thin film resistors and capacitors. Laser trimming is used to obtain precision RC active filters.
Line widths down to 75 μm for conductors and 50 μm for resistors are readily achieved in production. The properties
of the various components used in thin film integrated circuits are described and examples of completed circuits used
in transmission, station, and switching systems are shown. Some key advantages of this technology are low cost due to
batch processing techniques, high packing density and high precision of passive components.
New Thick Film Functional Devices
Authors: Taketa Y. , Abe O. , Haradome M.
Published: June 2007

The development of thick‐film functional devices having oscillation, negative resistance, switching, memory and so on
has been needed.

New non‐volatile memory devices manufactured of Nb2O5‐based thick‐film have now been created. The thick‐film
devices have been prepared by using common thick‐film technology such as screen printing, drying and firing. The
characteristics and the operation of the devices are as follows:

When a dc voltage is applied to the devices, rapid resistance change, so called switching effect, occurs. The devices
have low resistance state. Even when the voltage is removed completely, the devices do not return to high resistance
state and keep low resistance state. However, when alternating voltage is impressed upon the devices, the low
resistance state goes to the high resistance state. The recovery time of the resistance state depends upon the frequency
of applied ac voltage. The higher frequency voltage that is applied, the sooner the recovery time becomes. The
threshold voltage exponentially increases with higher frequency of an applied ac voltage.

In addition to the memory effect, the Nb2O5‐based thick‐film devices have a switching and oscillation characteristic.
Low‐Value Nickel Resistors Electroless‐Plated on “IMST” Substratefor Power Hybrid ICs
Authors: Miura N. , Fuura Y. , Kazami A.
Published: June 2007

This paper describes a new resistor formation technique, characterized by the use of our unique hybrid IC substrate
(IMST substrate) and the electroless nickel plating on it.

The evaluation of various electroless nickel plating baths to deposit nickel alloy with a different composition for
each is included. The resistor properties of the nickel film from a selected bath are showed. The plating conditions
affecting the resistance are discussed. Finally, the application to the built‐in emitter resistors of the IMST audio power
hybrid IC is presented.
Thick Film Capacitor Materials of the Powder–Glass Binary Systems and Their Dielectric Properties
Authors: Ikegami Akira , Arima Hideo , Abe Katsuo
Published: June 2007

Descriptions are given of the fundamental dielectric properties of the thick film binary system, composed of dielectric powder and glass, in relation to the effect of bulk properties of the constituent electrode composition in preventing a decrease in breakdown voltage with time and the effect of glass passivation on the reliability of thick film capacitors.
The Influence of Air‐Abrasive Trimming on the Current Noise of Thick Film Resistors
Authors: Lai Ying-Nam , Chang Juinn-Jey
Published: June 2007

The purpose of this study was to investigate the effect of some air abrasive trim cuts on the current noise of thick film resistors. It was found that the current noise changed on trimming the resistors and that the percentage change in the current noise enabled important conclusions to be drawn. From these conclusions it was possible to specify optimum trim cuts for resistors for high power and high frequency thick film hybrid circuits.
Application‐Oriented Description of the Quality of Electronic Components (ppm Concept)
Authors: Junghans Wolfgang
Published: June 2007

Traditionally the production quality of components is described by “acceptable quality levels” (AQL). Agreements, referring to this principle, determine the acceptance or refusal of batches that have been sample tested. An acceptable quality of level is interpreted as a tolerated limit. In reality true values of quality must be better. An AQL value cannot define a real quality level. Furthermore, increasing requirements for component quality lead to low figures for the permissible amount of faulty devices in batches, and the method of sample testing becomes insufficient.

For these reasons it seems to be of major importance to establish a better standard for the definition of quality. The application oriented description of quality data offers a possible solution. A good exchange of experience between supplier and user, based on a close and quality loop, is necessary.

For contractual purposes AQL values remain important, but their meaning needs a new interpretation.
The Influence of Electrical Pulses on Thick Film (Du Pont 1421 Birox) Resistors
Authors: Kozlowski J. M. , Tancula M.
Published: June 2007

This paper presents data on the effect of electric pulses on thick film resistors made using Du Pont 1421 Birox resistor pastes.

Resistance changes during the application of the electric pulses were investigated. Two types of change were observed: reversible and irreversible (i.e. catastrophic).

In order to illustrate the causes of these changes, observations of the film on a scanning electron microscope were made. Microcracks were observed in the film, which were mostly responsible for the permanent resistance changes.
A Hybridized Monitor Receiver for Low Band FM
Authors: Brown Alan T.
Published: June 2007

Certain aspects of the design and implementation of a hybridized monitor receiver are discussed. The receiver is realized in thick film technology. Screened capacitors as well as an adjustable inter‐digitated thin film capacitor are employed in the design. Fine tuning of the crystal controlled local oscillator is achieved by abrasive trimming of monolithic chip capacitors. Modularization of the receiver lends itself towards simplified circuit construction and alignment.
Courses in Microelectronics at the Technical University, Budapest
Authors: Ambrózy A. , Tarnay K.
Published: June 2007

After a short introduction to the organization of the University and the Faculty of Electrical Engineering the structure of education is examined. Attention is paid to the obligatory courses as well as electives for the various groups specializing in microelectronics. Research areas listed include computer aided design, technology and tests; all are illustrated by many successful projects.
Reliability of LED′s; Are the Accelerated Ageing Tests Reliable?
Authors: Ferenczi George
Published: June 2007

The mechanisms, leading to light output degradation of LED′s were studied using a number of different techniques
e.g. deep level spectroscopy, electroluminescence, minority carrier life time measurements. Several processes were
revealed having different temperature and stress current dependence. Using these data extrapolations based on
accelerated ageing test results are reexamined.
Studies on the Percentage Variation of Resistance of Polymer Thick Film (PTF) Resistors
Authors: Fu Shen-Li , Liang Mong-Song , Shiramatsu Toyotaro , Wu Tien-Shou
Published: June 2007

The percentage variation of resistance of polymer thick film (PTF) resistors has been studied. Two different kinds of polymer resin, i.e., epoxy resin and polyimide resin, as well as four different kinds of carbon black are adopted in the preparations of PTF resistors. Among the four different kinds of carbon black, i.e., ε45, MA‐100, MA‐600 and HS‐500 (all trade names), HS‐500 shows the least variation with temperature changes. This can be attributed to the high structure property of HS‐500 carbon black. The variation will be lowered down with an increase in the loading fraction of carbon black in PTF resistors. Same tendency will be observed in both epoxy and polyimide resin PTF resistors. However, the variations are smaller in polyimide resin resistors than in epoxy resin resistors. The percentage variations of resistance of PTF resistors, after stored at 120℃ for 1000 hrs, or after 25 cycle thermal shock tests, or dipped in a 200℃ solder pot for three seconds, as well as the variations after the short term overload tests, have also been measured and studied. The variations are still smaller in polyimide resin PTF resistors. A possible explanation on this smaller variation in polyimide resin PTF resistor is also presented.
Investigations on Electronic Materials
Authors: Kormány T. , Pugnor E.
Published: June 2007

Electronics has been described as a materials oriented technology. In this sense a short review is given concerning: the connection of materials characterization to the design and processing of electronic components; the most important materials characterization methods used for electronic materials; the strategy of organizing a complete material characterization system for selected electronic components.
A Chronological List of References on Switched Capacitor Circuits
Authors: Vandewalle J.
Published: June 2007

A chronological list of 440 references on switched capacitor circuits is compiled. Such circuits have cut the cost of filters and signal processing devices for telecommunications, speech and consumer products because they can be easily integrated on a chip. The bibliography shows the explosion of interest since 1977 by IC designers, CAD developers and circuit and filter theorists and practitioners alike.

Very specialized publications as well as elementary papers and books have been included.
High Density Packaging Technology
Authors: Nishi Yusaku , Mizuno Kazuo
Published: June 2007

A chip and wire, high density packaging approach has resulted in a low cost, large scale, high density, multi‐chip package (MCP). The package includes 76 ICs, 1 resistor, and 34 capacitor chips on a 2 in × 3 in multilayer ceramic substrate (MLS) with 92 I/O leads. The package has a solder‐sealed, metal cover over the chip‐mount area, and a heat sink on the back side of the MLS.

The primary yield was found to be around 70%. The rest was reworked with no significant labour. The software as well as hardware to minimize the test/rework labour would be a key to success in chip and wire MCPs. Also, efforts were made to reduce the material cost and the assembly labour. The thick film MLS was replaced by the ceramic MLS. The wire bonding was automated. Overall efforts reduced package cost to 1.25 times the conventional DIP‐on‐PCB counterpart (7.5 in × 9.1 in). Estimating its effectiveness at a system level, the reduction in the number of boards, connectors and cables would give MCPs an advantage over their counterparts. The improvement in reliability would be another advantage

A comparison with other high density packaging technologies, chip carrier, and chip on tape, is also described.
Considerations in Formulation and Manufacturing of Thick Film Inks
Authors: Rose Adrian
Published: June 2007

This paper discusses considerations in formulation and manufacture of thick film inks. It deals with the components of thick film inks, their properties, functions, and manufacturing methods. The vehicle is defined and its components are discussed in terms of function, properties, and types. The various types of metals and their important properties are described and related to ink properties. Glass functions, types and properties are reviewed. Both vitreous and devitrifying glasses are examined. The usage of various types of oxides is discussed. Typical thick film inks are described. They include conductor, resistor, dielectric inks, and protective coatings. The types of components used are related to specific property requirements of each type of material. Ink manufacturing methods are described. Preparation of vehicle, metal powder, and glass frit is discussed. The process of incorporating these materials into an ink is detailed from initial mixing to final product. Testing, both in‐process and final Q.C., is briefly discussed. The important considerations in both formulation and manufacturing are identified.
Nichrome Thin Film Technology and its Application
Authors: Rölke Joachim
Published: June 2007

NiCr thin film resistors are widely used in the current resistor technology. Ranging from discrete resistors up to highest performance hybrid integrated circuits, vacuum deposited NiCr alloys cover extreme areas of application. Depending upon NiCr composition, process parameters, substrate and conductor materials, resistors with extremely low temperature coefficient of resistance (TCR) and high stability, low noise and distortion can be produced. NiCr resistors therefore offer particular advantages for applications with special demand for high stability as well as low TCR‐like selected circuits for measuring equipment, data processing, telecommunication, etc.
Parallel decrease of tissue factor surface exposure and increase of tissue factor microparticle release by the n-3 fatty acid docosahexaenoate in endothelial cells
Authors: Turco Serena Del , Basta Giuseppina , Lazzerini Guido , Evangelista Monica , Rainaldi Giuseppe , Tanganelli Piero , Camera Marina , Tremoli Elena , Caterina Raffaele De
Published: June 2007

Tissue factor (TF) is expressed on the endothelium in response to inflammatory mediators, giving endothelial cells a pro-thrombotic phenotype. Since fish-derived n-3 fatty acids (FA) have been associated with reduced incidence of myocardial infarction, we investigated the endothelial effects of the most abundant n-3 FA, docosahexaenoate (DHA), on TF expression. Human umbilical vein endothelial cells were pre-incubated with DHA (or stearate and arachidonate as controls) for 48–72 hours, and then stimulated with bacterial lipopolysaccharide (LPS) or tumor necrosis factor-α. Pre-incubation of endothelial cells with DHA (but not stearate or arachidonate) concentration-dependently reduced surface protein exposure, independent of TF mRNA or total protein expression regulation. Conversely, DHA treatment in conjunction with activating stimuli, induced the release of endothelial TF-exposing microparticles from endothelial cells,quantitatively accounting for the decreasedTF cell surface exposure. In conclusion,DHA treatment, with a time-course consistent with its incorporation in membrane phospholipids, increases the release of TF-exposing microparticles from endothelial cells, accounting for decreased endothelial cell TF surface exposure, thus potentially modifying the overall endothelial control of microparticle-related effects.
Intraoperative fresh-frozen plasma versus human albumin in craniofacial surgery − A pilot study comparing coagulation profiles in infants younger than 12 months
Authors: Machotta Andreas , Riess Hanno , Kerner Sabine , Ahlers Olaf , Haberl Hannes , Dörken Bernd , Kerner Thoralf , Hildebrandt Bert
Published: June 2007

The transfusion of fresh-frozen plasma (FFP) is suggested to minimize dilution coagulopathy when applied instead of colloids during paediatric craniofacial surgery (pCFS). We prospectively compared plasmatic haemostaseologic function between volume replacement with FFPs versus human albumin (HA) in a pilot study. Thirty infants with primary craniosynostosis were scheduled for pCFS. In 15 of those, FFPs were available from the identical donor as for packed red blood cells (pRBC), and were thus employed for intraoperative volume replacement. The remaining 15 infants were infused with HA-5% instead. Haemoglobin (Hb)-values, global coagulation parameters (activated partial thromboplastin time-aPTT; prothrombin time-PT), selected clotting factors (F) (VIII, XI, XIII), antithrombin-AT, fibrinolytic factors (fibrinogen; plasminogen; alpha2-antiplasmin-α2A), and activation parameters (thrombin-antithrombin-complex-TAT; plasmin-antiplasmin-complex-PAP; D-dimers) were assessed and compared between both groups after induction of anaesthesia, before transfusion of pRBC, and at the end of surgery. Patients and treatment characteristics were balanced between both groups. Prolongation of aPTT and decreases of PT, FXI, FXIII, AT3, and fibrinolytic factors were more pronounced in the HA-group. Increases in F VIII activity, activation parameters, and the course of Hb-values were similar among both groups. There was no difference regarding clinical endpoints (peri-/postoperative pRBC-transfusions, postoperative blood loss). In conclusion, the application of HA was associated with a more distinct dilution of procoagulant factors, AT3, and fibrinolytic factors than the use of FFPs. However, the course of activation markers suggested a similar extent of clotting and fibrinolytic activation with the use of both transfusion regimens, and there were no differences with regard to clinical endpoints.
Molecular characterization of human B domain-specific anti-factor VIII monoclonal antibodies generated in transgenic mice
Authors: Wootla Bharath , Tarrade Catherine , Schved Jean-François , Kaveri Srini , Granier Claude , Lavigne-Lissalde Géraldine , Lacroix-Desmazes Sébastien , Villard-Saussine Sylvie
Published: June 2007

The development of antibodies directed against factorVIII (FVIII) represents a major hurdle in the treatment of hemophilia A. Most anti-FVIII antibodies are identified through their ability to inhibit the FVIII procoagulant activity. Many of them, however, do not interfere with the functional properties of FVIII. Antibodies directed against the B domain belong to this latter category. Here, we characterized B domain-specific human monoclonal Abs (mAbs) at the molecular level. A series of human mAbs directed against FVIII was produced upon immunization of transgenic XenoMouse mice with human recombinant FVIII (rFVIII). Selection of the hybridoma with epitope specificity for the B domain was performed by differential recognition of full-length and B domain-deleted rFVIII. None of the anti-B domain mAbs demonstrated inhibitory activity against FVIII. Three of the mAbs recognized linear epitopes: mAb 25H3 bound to the 1014HIDGPSLLIEN1024 sequence; mAbs 8E3 and 22B6 shared the same epitope, composed of residues 1534KWNEANR1540. The corresponding soluble peptides inhibited the binding of their respective mAbs to FVIII. mAbs 8E3 and 22B6 displaced the binding of FVIII to vonWillebrand factor. Moreover, some of them (in particular mAbs 4G6 and 8E3) were able to compete for binding to the B domain with the anti-FVIII Abs from hemophilia A patients without inhibitor or with low Bethesda titers. Further investigation will allow to better characterize their clinical relevance.
Models for reaction mechanisms in haemostasis – Contributions from the study of prothrombin activation
Authors: Jackson Craig
Published: June 2007

A brief history of the development of the contemporary model for the mechanism of prothrombin activation is presented.The focus is on the advances in understanding structure-function relationships in the molecules that comprise “prothrombinase” that occurred primarily during the 1970s. A link between the “classical theory” of hemostasis and the conceptual development of activation complexes as the activators of the precursors of coagulation proteases is developed. It is argued that advances occurred when new ideas arose that could be tested and new technologies enabled more definitive experiments to be performed.
Post-Genocide Rwanda: The Changing Religious Landscape
Authors: Kubai Anne
Published: June 2007

This paper seeks to examine the proliferation of Pentecostal churches and the changing religious landscape of Rwanda. The horrific genocide of 1994, left the country's traditional mainline churches bloodied and the Christian faith seriously challenged. Unlike elsewhere in Africa, prior to the genocide, Pentecostal churches had not got a foot-hold in Rwanda, then referred to as the most Catholic country in Africa. In the aftermath, Rwanda has experienced a spontaneous growth of new churches imported by returnees from far and wide. Though the Catholic Church still retains its dominant position, there has been an upsurge of Protestants and the Rwandan religious landscape is changing considerably. This gospel explosion has been attributed to the enormous challenges of social-economic reconstruction of a fractured society, where reconciliation and healing are of utmost importance. By packaging their messages with hindsight of the disillusionment with the traditional churches and the spiritual as well as the material need to arise from the ashes of genocide and rebuild their lives, these churches have attracted thousands of Rwandans.
Performance management in the Baltic States and Russia: success against the odds?
Authors: Verheijen Tony , Dobrolyubova Yelena
Published: June 2007

This article analyses the public management reform process in Latvia, Lithuania and Russia, the only three post-Communist states that have sought to introduce comprehensive performance management systems in the public sector. The central premise of the article is that the introduction of such reforms can be successful even in public management systems that are not `advanced'. This contradicts the widely held notion that performance-based public management systems are not suitable for `developing' countries. The article concludes that if sufficient political support and a dedicated reform team in the civil service are present, and performance management systems are introduced in a step-by-step manner, significant improvement in the effectiveness and efficiency of public management systems can be achieved. The case of the two Baltic States studied in the article, which moved from being laggards in the EU accession process to among its best performing members, provides a strong argument that a more radical approach to public management reform can pay off, even in public management systems in development.
Marketization, globalization and administrative reform in China: a zigzag road to a promising future
Authors: Ngok Kinglun , Guobin Zhu
Published: June 2007

The Chinese administrative system has been periodically reformed since the early 1980s. This article mainly focuses on the reforms of the State Council, the central government of China, and then deals with the five main rounds of reform. It gives a full picture of the story of reform with its context and contents, the measures taken, the difficulties encountered and the challenges ahead. It is argued that administrative reform in China has been used to reorient the Communist state to an emerging market-oriented economy and to enhance the capacity of the government to regulate market forces and to respond to the significant impacts made by economic globalization. Given the authoritarian nature of the party-state polity of China, the authors argue that administrative reform in China has also been used as an alternative route to alleviate the crisis of governance resulting from rapid social change; however, its effects are constrained by the implications of politico-administrative apparatus. To build up a modern governing system suitable for a market economy, a proactive approach, including political or constitutional reform, should be put on the agenda.
The evolution of higher education rules: evidence for an ecology of law
Authors: van Witteloostuijn Arjen , de Jong Gjalt
Published: June 2007

Politicians have displayed a keen interest in the build-up of regulations and bureaucracies for quite some time now. A case in point is the Netherlands. The second Balkenende cabinet, though, vowed to downsize the number of rules as one of its main policy initiatives. Evaluating the success of such a policy requires the measurement of changes in rule volumes. Doing so is no easy task. Using higher education legislation as a case study, this article attempts to chart and explain developments in regulation volumes for the period 1986—2004. For the time being, there appears to be no evidence that rule levels are on the decline — in fact, the reverse is the case. We also provide evidence for a so-called ecology of law, suggesting that the rules-breed-rules mechanism is difficult to put to a halt.
Corporate management at top level of governments: the Canadian case
Authors: Bourgault Jacques
Published: June 2007

To coordinate action, reduce bureaucratic in-fighting and favour the efficient implementation of the governmental agenda, governments are tending to use more collaborative and holistic tools. In Canada, within the federal and provincial governments, relatively integrated corporate management tools have been established for senior civil servants and their work. On the basis of interviews and discussions, this article presents the three types of tools used (a senior personnel secretariat reporting to the head of government, an integrated organizational system and the development of a community culture), which provide: a framework for the development, orientation, integration and support for the most senior managers; strategic, coordination and learning meetings for the entire group; and individualized HRM tools. Despite obstacles to it, and its risks, all of those surveyed conclude that this model is considered, in the Canadian context, both effective and satisfactory.
Parametric Analysis for Modeling and Simulation of Stochastic Behavior in the Predator—Prey Pursuit Domain
Authors: Alcazar Javier A. , Garcia Ephrahim
Published: June 2007

Modeling and simulation are very useful tools when analyzing complex systems. Multipredator, multi-prey pursuit-evasion games, with stochastic vision, constitute an example of such a complex system. We present a careful parametric analysis for the multipredator—multiprey domain. Previous work on the predator—prey domain has mainly been focused on the strategies to intercept all prey, leaving out the analysis about how their parameters, which describe the capabilities of the predator—prey pursuit, would affect the time to intercept all prey. In this paper we use a fixed strategy proven to be effective in previous studies. In most predator—prey studies, most of the capabilities and parameters that describe the pursuit have been fixed (e.g. the number of predators and prey in the arena, their velocities and detection zones, among others). Assuming that some of the capabilities and parameters describing the prey are given, and that the parameters and capabilities of the predators could be designed, many questions arise. How would the different capabilities of the mobile robotic predator affect the probability to intercept all prey? How many mobile robotic predators would be required to guarantee a probability of intercept within a finite, and perhaps tactically useful, time period within a given region? It is proposed that stochastic modeling of predator—prey scenarios lend insight into such problems. A probabilistic approach to the predator—prey domain is thus shown. Parametric analysis for the pursuit-evasion game, Monte Carlo simulations and a significance test are presented. In the following simulations, the prey and predators have only local information provided by their detection and observance zones. These zones are modeled mathematically via a probabilistic model, and each predator and prey in the scenario has a probability of being detected based on distance. As a prey is geometrically closer to a predator, its probability of intercept increases.
Modeling and Simulation of a Fuzzy Supervisory Controller for an Industrial Boiler
Authors: Arriaga-de-Valle Enrique , Dieck-Assad Graciano
Published: June 2007

In this paper we compare and discuss the performance of a boiler evaporator system when the system is controlled by a traditional PID-type strategy and when the system is enhanced by using fuzzy logic blocks to provide set-points for the system. The strategy used in fuzzy logic controllers (FLCs) is called fuzzy supervisory control and it generates set-points for the conventional controllers. The boiler under test is a VU-60 industrial system that produces 180,000 pounds of steam per hour. The mathematical model of the plant is a scaled version model of that obtained for a thermoelectric unit. The new model simplifies the large-scale thermoelectric boiler model to an industrial small-scale type VU-60 boiler model based upon first principle mass and energy balance equations. The main change consists of representing only the behavior of the drum—evaporator system, having a partial model of the combustion process, with a simplified combustion control system and a three-element boiler feed-water controller. The control system for combustion and boiler feed-water receives a supervisory signal (or set-point tracking signal) that comes from the FLC to improve the performance of the overall control system. The behavior of the supervisory controller brings some advantages to the system performance, compared with the traditional control schemes. The comparison reflects fuel improvements from 2.5% to 6.5% depending upon the steam load ramp regime. The simulations are performed using the SIMULINK® shell running under the MATLAB ® platform.