bluuebunny/crossref_metadata_2025 huggingface dataset:
Enhancing Plasma-Sprayed LSCF Cathode Performance by Infiltration Method
Authors: Li Ying , Li Cheng-Xin , Zhang Shan-Lin , Yang Guan-Jun , Li Chang-Jiu
Published: August 2022

LSCF(La0.6Sr0.4Co0.2Fe0.8O3) with a perovskite structure has been widely studied as cathode materials for intermediate solid oxide fuel cell(SOFC). It has well-known excellent electrode performance due to its high ionic and electronic conductivity. However, application of LSCF cathode is likely to be limited by the surface catalytic properties and long term stability. Sr and Co may segregate from LSCF under cathode polarization, leading to increased resistance of the cathode. Oxygen hyper-stoichiometric La2NiO4+δ with a K2NiF4 structure possesses a higher catalytic properties, ionic conductivity and stability compared to LSCF cathode. However, the electrical conductivity of the La2NiO4+δ (76 S cm–1 at 800 °C ) in the IT range are lower than 100 S/cm, which is regarded as the minimum requirement in electrical conductivity for an SOFC cathode. Taking account of both the advantages and disadvantages of the two different cathode materials, and good chemical compatibility of those two cathode materials, it is possible to prepare a composite cathode by infiltrating a thin film of La2NiO4+ä on the porous LSCF to enhance the LSCF cathode performance. Therefore, in this study, the LSCF cathode was deposited by atmospheric plasma spray. The porous LSCF cathode was infiltrated by La2NiO4+δ. The microstructure was characterized by SEM and TEM. The effect of infiltration on the polarization of LSCF cathode was investigated.
High Velocity Oxygen Fuel Sprayed Insulation Coatings for Applications in High Power Electronics
Authors: Luth J. , Cichosz M. , Lehmann M. , Hartmann S. , Trenkle F.
Published: August 2022

Electrically insulating coatings featuring high dielectric strength, high electrical resistance and high thermal conductivity are essential for applications in high power electronics. The capability of HVOF-sprayed coatings for high power electronic components based on 20 different powders was investigated in this study. The powders used are aluminum oxide ceramics containing additives of chromium oxide, titanium oxide and magnesium oxide. Key result of this study is that both, pure alumina (Al2O3) and one class of spinel (Al2O3 - 28MgO) meet the requirements for electrical insulation. In order to reach high resistivity, the insulation coatings should be sealed subsequently. The amount of impurities, such as Na2O or Fe2O3 must be less than 0.1%.
Influence of Metal Bond Coat Thickness on Adhesion Strength of APS Ceramic Coatings
Authors: Barr John , Estrada Christopher , Victoria Nelson , White Bob , Harrison Jerome
Published: August 2022

This paper investigates the influence of metal bond coat (MBC) thickness on the adhesion strength of air plasma spray (APS) ceramic coatings for extreme service ball valve applications. The study was conducted using three different ceramic coatings (Cr2O3, Cr2O3-Al2O3, and TiO2) applied on three different substrates (Titanium G12, Inconel 625, and 2507 Duplex stainless steel) with varying thicknesses of MBC. Tests were performed for adhesion strength (ASTM C633), metallography (ASTM E1920), and percent porosity (ASTM E2109 Method B). The results showed that the adhesion strength of the ceramic coatings was not reduced until the MBC thickness exceeded 0.060 in. The failures observed were either cohesive in the ceramic, cohesive in the adhesive, or a combination of both. It was concluded that a recommended MBC thickness limit of 0.030 in. can be established based on the experimental data.
In-Situ Sensors Deposited by Laser Cladding
Authors: Zhang Yanli , Mack Daniel Emil , Mauer Georg , Vaßen Robert , Guillon Olivier
Published: August 2022

A new method for fabricating microsensors which can provide accurate real-time temperature monitoring of thermal barrier coatings on gas turbine engines was developed. A high temperature K-type thermocouple sensor for hostile environments was deposited using a coaxial pulsed laser cladding process with optimized process parameters giving minimal intrusive features to the substrate and afterwards embedded in typical ceramic layers. The dimensions of the cladded thermocouple were about one hundred microns in thickness and width. The thermal and electrical response of the cladded thermocouple was tested before and after embedding over temperatures ranging from ambient up to approximately 500 °C in a furnace with flowing argon as protective gas. The results were compared to that of a commercial standard K-type thermocouple, which indicate that laser cladding is a promising technology for manufacturing microsensors for in-situ monitoring in harsh operation environments.
Investigation of Oxidation Behavior and Evolvement of Grain Morphology of Fe-Cr-Al Alloy at 1200°C and 1300°C
Authors: Zhao Yan , Gao Yang
Published: August 2022

In this paper, the development of surface oxide scale and the evolvement of spallation mechanism of Fe-21Cr-5.6Al super alloy were investigated at 1200°C and 1300°C. The oxidation kinetic curves were obtained by isothermally measuring the weight gain of alloy oxidized with various time durations. The morphologies of oxide scale and grain structures were observed by SEM/EDX, and the phase structure was analyzed by XRD. The results show that the oxidation processes follow the parabolic law and the oxidation rate is higher at 1300°C than 1200°C. Though the FeCrAl alloy shows capabilities against oxidation even at a high temperature of 1300°C, the oxidation behavior and mechanism are distinct from those at moderate temperatures (<1000°C). Different morphologies and phase structure were found in oxide scales generated at different temperatures within the same time duration. Typical buckling was observed in the super alloy when it was subjected to 1200°C. Equiaixed grains with multiple voids were found near the alloy surface. At 1300°C, a flat and thicker oxide layer was formed. The grains were stretched vertically against the alloy and presented as coarse and compact near the interface. The vertically stretching of grain was triggered by fast element transportation inside the alloy. The differences in grain morphologies among the different test temperatures demonstrated that although the super alloy followed parabolic law at both test temperatures, the oxidation processes were different due to the evolvement of grain morphologies and oxide scale structures caused by exposure to high temperature.
Latest Developments at OBZ Innovation GmbH with Focus on Cold Spraying
Authors: Trenkle F. , Schmidt J. , Lehmann M. , Cichosz M. , Dresel I. , Hartmann S.
Published: August 2022

This paper deals with some of the latest developments and serial production applications at OBZ innovation GMBH. With three serial production cold gas systems and one for the R&D department, obz innovation gmbh is the leading supplier of cold sprayed coatings. The development of the well-known serial production process of a sinusoidal copper coating for hybrid cars is explained. Furthermore our ferritic chromium steel induction coating and our newly developed product, an immanent temperature limiting function for safety critical reasons, will be addressed. As an example for a current field of research currently examined at obz within a public funded project will be discussed insulating ceramics for power electronics with cold sprayed circuit paths for a potential use in fields like automotive and others. Last but not least, the latest product, “obz fingerprint” and “obz sensor” coatings that can be used against plagiarism and as a sensory element are presented for the first time.
Modular Coating for Flexible Gas Turbine Operation
Authors: Zimmermann J.R.A. , Schab J.C. , Stankowski A. , Grasso P.D. , Olliges S. , Leyens C.
Published: August 2022

With today’s continuously increasing demand for flexibility in heavy duty gas turbines operation, power plant owners are forced to change their operation regime from base load to cyclic operation. The required coating properties for the two regimes are contradicting and cannot be optimized with current MCrAlY systems. Furthermore, for each turbine component, as well as in individual part locations, the loading boundary conditions are differently weighted. For an overall optimized component protection it is therefore of interest to produce coatings with flexible and individually tailored properties. In this context, ALSTOM invested into the development of an Advanced Modular Coating Technology (AMCOTEC), which is based on several powder constituents and a new application method, allowing in-situ compositional changes. With this approach, coating properties, such as oxidation, corrosion, erosion resistance, cyclic lifetime etc. can be modularly adjusted for individual component types and areas. This also includes production of functionally graded coatings, without changing the chemistry of powder fractions.
Plasma Spray-Physical Vapor Deposition of La1-xSrxCoyFe1-yO3-δ Oxygen Transport Membranes on Porous Metallic Supports—Controlling Stress State and Phase Composition
Authors: Marcano D. , Mauer G. , Sohn Y.J. , Vaßen R. , Garcia J. , Serra J.
Published: August 2022

La0.58Sr0.4Co0.2Fe0.8O3-δ (LSCF), deposited on a metallic porous support by means of plasma spray-physical vapor deposition (PS-PVD) is a promising candidate for oxygen-permeation membranes. However, after O2 permeation tests, membranes show vertical cracks leading to leakage during these tests. In this work, a feature leading to crack formation has been identified. More specifically; Membrane residual stress changes during thermal loading have been found to be related to a phase transformation in the support. In order to improve the performance of the membranes, the metallic support has been optimized by applying an appropriate heat treatment. Additionally, it has been found that coatings deposited at lower oxygen partial pressures consist of 70% cubic and 26% rhombohedral perovskite phases. This increases the non-stoichiometry, which drives the formation of non-perovskite phases during annealing, affecting the membrane stability and the ionic conductivity. The amount of oxygen added during spraying can be used to suppress the cubic to tetragonal phase transformation.
Protecting Threaded Surfaces in Pump and Compressor Pipes Used in the Oil and Gas Industry
Authors: Baldaev L. , Mankovsky S. , Ishmukhametov D. , Rigin A.
Published: August 2022

The paper looks at the results of TSPC research to develop coating technology for threaded surfaces in pump and compressor pipes (PCP) used in the oil and gas industry.
Self-Healing Plasma Sprayed Ceramic Coatings
Authors: Ilhan Z. , Hornes A. , Sata N. , Freitag O. , Ansar A. , Schiller G. , Friedrich A. , Guski V. , Weber U. , Krebs A. , Schmauder S.
Published: August 2022

The current paper reports self-healing plasma sprayed Mgspinel (MgAl2O4) coatings. The coatings were used for electrical insulation in high temperature fuel cells. A range of potential self-healing additives consisting of SiC+X (where X was BaO, CaO, ZnO, Y2O3, GeO2, Ta2O5, V2O5) were characterized and SiC+Y2O3 was initially selected for coating development. Coatings of spinel with 20wt% additive were developed using vacuum plasma spraying (VPS) or atmospheric plasma spraying (APS). In the developed coatings, self-healing was demonstrated after heat treatment at 1050°C in air for 10 hour. Thermophysical and thermomechanical properties of self-healing coatings were determined and compared to spinel coatings. Lastly, a modelling technique is presented to simulate the effective elastic moduli of the coatings. Numerical results based on microstructural simulations showed good agreement with experimental data.
The Percarbonate Stripping System for Thermal Spray Coatings—A Success Story at Tinker Air Force Base
Authors: Sauer John P. , Sneed Justin , Fairbourn Dave
Published: August 2022

Stripping systems for thermal spray coatings tend to use many hazardous acids which require critical safety procedures and produce heavy volumes of environmentally unfriendly waste streams. A new technology, filed under application numbers 2009/0120804A1 and 2009/0229636A1, and additionally covered under U.S. patent numbers 8262870 and 8377324 has been created using a very safe and environmentally friendly percarbonate based chemical system with minimal DC rectified voltage. It was successfully qualified at Tinker Air Force Base and is currently in production use throughout the facility. It has safely stripped WCCo and CrC-NiCr coatings such as WCCo and CrC-NiCr from Ti 6-4 and IN718 substrates showing minimal stock loss in 48 hr exposure testing. Many lessons were learned during this qualification process which will be shared and documented. Both plasma and HVOF coatings can be stripped with this process in the pH 10-12 range. The system can also be combined with a refining system that purifies the waste water and condenses the coating sludge into a condensed volume, eliminating the tremendous volume of waste chemicals. Numerous case studies and actual stripping data will also be presented and discussed.
Thermally Sprayed Coatings as Corrosion Protection for Steel Structures—Influence of Manufacturing Processes on the Coatings Quality
Authors: Maghet Teodora , Wilhelm Thomas , Sallai Monica , Mährlein Jörg , Friedrich Susanne , Regenspurger Romy
Published: August 2022

To obtain the desired functionality and provide sustainability for steel structures, costly maintain and repair is needed. For use in particularly critical environments thermally sprayed coatings based on zinc/ aluminum in combination with a sealing supply many advantages. The subject of the ongoing research project is to deepen the knowledge about the influence of the thermal spray process, the spraying parameters, the manufacturing and especially the sealing process on the durability of sealed ZnAl-corrosion protective coatings. Verification is provided by state of the art testing methods to evaluate the coatings quality. The overall objective of the study is to provide recommendations on approaches and boundary conditions for manufacturing and sealing of thermally sprayed coatings for corrosion protection.
Ultraflex Coatings for Protection of Non-Line-of-Sight Surfaces
Authors: Kimball Douglas , Faust James
Published: August 2022

Kennametal’s UltraFlex surface treatments provide wear and corrosion resistant coatings in locations that are not easily protected by other methods such as weld overlay or thermal spray. The UltraFlex surface treatments are based on a powder metallurgy process where coatings are applied to substrates in a “green” state and then heated to fuse the coating into a dense, uniform, metallurgically bonded layer with almost no porosity. Unlike most weld or spraying processes, the process for applying UltraFlex does not require direct line-of-sight with the substrate, so components with very complex geometries, difficult to reach locations, or small IDs can be protected with a high-quality surface. UltraFlex coatings are available in multiple grades which are selected depending on the specific application environment. UltraFlex tungsten carbide grades have excellent abrasion and erosion resistance and cobalt alloy grades have excellent corrosion and high temperature resistance.
Use of Flame-Sprayed Coatings as Heating Elements for Polymer-Based Composite Structures
Authors: Lopera-Valle Adrián , McDonald André
Published: August 2022

In order to avoid ice accretion on structures that are exposed to cold environments, nickel-chromium-aluminum-yttrium (NiCrAlY) and nickel-20 wt.% chromium (Ni-20Cr) coatings have been deposited on fiber-reinforced polymer composite plates by using flame spraying. Electrical current was supplied to the coatings to increase the substrate temperature by way of Joule heating. The coatings were assessed under free and forced convection conditions at -25°C and 23°C. The electrical resistance of the coating was estimated at different temperatures. At ambient temperatures below 0°C, the temperature on the coating surface remained above 0°C for both the forced and free convection conditions. A nearly homogeneous temperature distribution over the coating surface was observed. The coating materials were found to be Ohmic and their resistance was weakly dependent on temperature. The results suggest that the coating systems may also be used in anti- and de- icing systems.
Wear and Corrosion Resistance of Fe-Based Coatings Reinforced by TiC Particles for Application in Hydraulic Systems
Authors: Bobzin K. , Öte M. , Linke T.F. , Malik K.M.
Published: August 2022

Thermally sprayed Fe-based coatings reinforced by TiC particles are a cost effective alternative to carbide coatings such as WC/CoCr, Cr3C2/NiCr and hard chrome coatings. They feature a good wear resistance and, with sufficient amount of alloying elements like Cr and Ni, also a high corrosion resistance. In hydraulic systems the piston is coated for protection against corrosion and wear. New water-based hydraulic fluids require an adaption of the coating system. In order to investigate the wear and corrosion resistance of Fe/TiC a novel powder consisting of a FeCr27Ni18Mo3 matrix and 34 wt.-% TiC was applied by HVOF and compared to reference samples made of WC/CoCr (HVAF) and hard chrome. Besides an in-depth coating characterization (metallographic analyses, EMPA), wear resistance was tested under reverse sliding in a water-based hydraulic fluid. Corrosion resistance was determined by polarization in application-oriented electrolytes (hydraulic fluid at 60 °C, artificial sea water at RT).
ISTFA 2007 Panel Discussion Session: “Test and Failure Analysis of Medical Devices” or “Everything You Ever Wanted to Know About Pacemakers”
Authors: Keim Martin , Woods Tom
Published: August 2022

The organizer and moderator of the ISTFA 2007 panel discussion on failure analysis and testing of medical devices provide a summary of the discussion topics and areas of focus.
You Can’t Afford to Be a “Moore-On”
Authors: Dellin Ted
Published: August 2022

This column reflects on the changes taking place in the semiconductor industry as it tries to live up to expectations for faster, better, cheaper ICs every two to three years in keeping with Moore's law.
Response to Counterfeit Integrated Circuit Components in the Supply Chain: Part I
Authors: Shade Gary F. , Wilson Brian
Published: August 2022

This article is the first of a two-part series on counterfeiting in the IC supply chain. The focus is primarily on semiconductor components that are not available directly from the manufacturer due to quantity or discontinued status. Part I discusses the factors contributing to the rise of such counterfeiting and some of the measures in place to deal with the growing problem. It presents and examines several counterfeit ICs found in the supply chain and describes procurement practices and failure analysis techniques that can help determine whether a product is counterfeit or authentic. Part II, scheduled for the February 2009 issue of EDFA, provides additional procurement and analysis options along with case studies showing how complex analysis can become and how misleading the evidence can seem. It also presents recommended methods for removing counterfeit components from the supply line.
Selective Dielectric Removal for Failure Analysis of Thin Films on Semiconductor Devices
Authors: Benz Jason , Bentley William , Myers Joseph
Published: August 2022

Thin film anomalies cause many device failures but they are often difficult to see. In this article, the authors explain how they found and identified an 8 to 10 nm film of tantalum causing pin shorts in a majority of ASIC modules from a particular lot. Initial attempts to delayer some of the failed modules resulted in the loss of the failure signal. It was then decided to use a focused ion beam to selectively mill through the interlayer dielectric. During milling, a secondary electron image revealed anomalous material between the fingers of a power transistor, which was subsequently identified as tantalum. Such defects, as the authors explain, are common in damascene processes when materials are not properly removed during etching.
Delivering Value
Authors: Lundquist Ted
Published: August 2022

At a Silicon Valley panel discussion on bringing new ICs to market, there was no mention by anyone onstage of a debug strategy, let alone its importance. This month’s guest columnist offers his insight on why that is and what should be done about it.
Magnetic Current Imaging in Failure Analysis
Authors: Orozco Antonio
Published: August 2022

Magnetic current imaging is a proven fault-isolation technique. Its unsurpassed sensitivity and resolution coupled with the fact that magnetic fields are unaffected by packaging and die materials make it a valuable FA tool for a wide variety of ICs and devices. This article reviews the basic measurement physics of magnetic current imaging, describes the general implementation, and presents several practical examples of its use.
Nondestructive 3-D X-Ray Microscopy
Authors: Goldberger Itzik
Published: August 2022

X-ray computed tomography is a noninvasive technique that can reveal the internal structure of objects in three dimensions with spatial resolution down to 50 nm. This article discusses the basic principles of this increasingly important imaging technology and presents examples of its use on various types of defects in semiconductor packages.
Experiences with Layout-Aware Diagnosis—A Case Study
Authors: Chang Yi-Jung , Pang Man-Ting , Brennan Mike , Man Albert , Keim Martin , Eide Geir , Benware Brady , Tai Ting-Pu
Published: August 2022

This case study compares the FA success rate and turn-around time of traditional logic-only and true layout-aware scan diagnosis. It discusses the basic process flow, identifies key success factors, and evaluates physical FA and diagnostic test results obtained from six dies randomly selected from a 9.8 M-gate, seven-metal-layer ASIC manufactured in 90 nm technology. As shown, layout-aware diagnosis reduces the defect search area on the die, in some cases, by an order of magnitude, providing the means to diagnosis-driven yield improvements.
Combining Refractive Solid Immersion Lens and Pulsed Laser-Induced Technique for Integrated Circuit Failure Analysis
Authors: Goh S.H. , Quah A.C.T. , Phang J.C.H. , Ravikumar V.K. , Phoa S.L. , Narang V. , Chin J.M. , Chua C.M.
Published: August 2022

The best spatial resolution that can be achieved with far-field optical fault localization techniques is around 20 times larger than the critical defect size at the 45 nm technology node. There is also a limit on the laser power that can be safely used on 45 nm devices, which further compromises fault localization precision. In this article, the authors explain how they overcome these limitations using pulsed laser-induced imaging techniques and a refractive solid immersion lens. Two case studies show how the combination of pulsed-laser scanning optical microscopy and a solid immersion lens improves localization precision and detection sensitivity.
Laser-Based Fault Isolation Techniques: Trends of the Last 10 Years
Authors: Aaron Falk R.
Published: August 2022

This column provides a ten-year retrospective on laser-based fault isolation techniques and the important role of laser signal injection microscopes.
Collaboration and Information Sharing Results in Improved Failure Analysis Tools, Techniques, and Outcomes
Authors: Mawer Andrew J. , Ng William , Jackson Michael D.
Published: August 2022

This column addresses the importance of information exchange among failure analysts and explains how it can be accomplished.
TSVs for Silicon Interposers
Authors: Jan Vardaman E.
Published: August 2022

This column explains that silicon interposers, considered an interim solution to full 3D integration, may turn out to be more than a stepping stone along the path toward 3D ICs.
G-19A Test Laboratory Standards
Authors: Sood Bhanu
Published: August 2022

This column reports on efforts by the SAE G-19A committee to develop an aerospace industry standard on practices to detect suspect counterfeit components, maximize the use of authentic parts, and ensure consistency across the supply chain for test techniques and requirements.
Innovative Assessment of Thermomechanical Stress Effects in Electronics Components and Assemblies
Authors: Hertl Michael , Weidmann Diane
Published: August 2022

Electronic components and assemblies are subjected to temperature variations at every stage of life, resulting in the buildup of internal stress. This article explains how such stress contributes to failures and introduces a measurement technique that allows users to visualize stress distributions and assess their effects on lifetime and reliability. Application examples illustrating the capabilities of the new topography and deformation measurement approach are also presented.
Laser Voltage Imaging: Setting a New Baseline for Circuit Analysis
Authors: Nicholson Roger , Lundquist Ted
Published: August 2022

Laser voltage imaging (LVI) enables the global visualization of on-chip circuit activity for the purpose of localizing defects. In a manner reminiscent of e-beam voltage contrast, it allows analysts to visually trace signals through circuit logic in order to see where faults occur. This article explains how laser voltage imaging works and how it is being used in semiconductor failure analysis. It also describes the types of applications for which LVI is not well suited.
ISTFA 2011 Wrap-Up
Authors: Walraven Jeremy A.
Published: August 2022

The 37th International Symposium for Testing and Failure Analysis (ISTFA 2011) was held in San Jose, Calif., November 13-17, 2011. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, User’s Group meetings, and equipment exposition.
ISTFA 2011 Panel Discussion: Finding the “Invisible Defect”
Authors: Holdford Becky
Published: August 2022

This article provides a summary of the ISTFA 2011 Panel Discussion, which centered on the challenge of finding ever-smaller defects in semiconductor devices.
Photon Emission: A Technique Supposed to Fade Is Dying Really Hard
Authors: Boit Christian
Published: August 2022

This column explains that, contrary to rumors, photon emission is alive and well and about to enrich FA even further if a few new approaches pan out.
A Review of the ISTFA 2012 Panel Discussion: Failure Analysis Challenges of 3Di Packaging
Authors: Vallett Dave
Published: August 2022

This article provides a summary of the ISTFA 2012 Panel Discussion on the FA challenges associated with 3D integrated packages.
Failure Analysis: What is the Problem?
Authors: Burgess Dave
Published: August 2022

One of the co-chairs of the Case Histories sessions at ISTFA 2012 provides a summary of three papers that demonstrate a solid understanding of the semiconductor FA process. The first paper describes the investigation of fractures in PCB traces, the second paper presents a method for analyzing defects due to implanter charging effects, and the third paper explains how analysts determined the cause of automatic test pattern generation failures concentrated in certain areas of the wafer.
EDFAS Celebrates Its 15th Anniversary
Authors: Walraven Jeremy
Published: August 2022

This column notes the 15th anniversary of the Electronic Device Failure Analysis Society (EDFAS). The columnist explains how he and his employer have benefitted from his involvement with EDFAS and participation in the annual ISTFA conference.
Comparison of Off-Axis Electron Holography and Junction Staining of TEM Sections for Dopant Anomaly Visualization
Authors: Subramanian Sam , Ly Khiem , Chrastechy Tony
Published: August 2022

Off-axis electron holography is a TEM-based imaging technique that reveals dopant anomalies and junction profiles in semiconductor devices. This article explains how the method works and how it is being used to visualize transistor source-drain regions, diffusion-related defects, and other features of interest in TEM samples. It also discusses related challenges and compares off-axis electron holography with other profiling techniques, particularly junction staining.
Tool Maintenance for Failure Analysis Labs
Authors: Higgins Jason , Daniels Lisa , Boyles Tom
Published: August 2022

In this article, the authors explain how they were able to reduce downtime and overall lab costs by setting up a tool maintenance program and adapting it over time. They provide examples of the type of preventive and corrective maintenance required to keep FA tools running at peak performance. They also discuss the importance of recognizing the need for outside help and knowing when to retire a tool.
EUFANET Workshop 2012 Report
Authors: Touzel Jérôme , Langer Eckhard , Zschech Ehrenfried
Published: August 2022

The third extended European Failure Analysis Network (EUFANET) workshop, “Smart FA for New Materials in Electronic Devices,” was held in Dresden, Germany, September 17-18, 2012. This article provides a summary of the event with highlights from presentations on flexible organic electronics, crystal defects in SiC, nanoprobing, and the capabilities of nano X-ray tomography.
Analysis of Electronic Devices with a Three-Dimensional Atom Probe
Authors: Mutas Sergej
Published: August 2022

This article discusses the basic procedures involved in atom probe tomography (APT) and demonstrates its use on complex material stacks. Although still a relatively new technique, APT has moved to the forefront of semiconductor failure analysis because it can provide 3D chemical composition of a wide range of materials on a near-atomic scale.
ISTFA 2013 Wrap-Up
Authors: Wang Zhiyong
Published: August 2022

The 39th International Symposium for Testing and Failure Analysis (ISTFA 2013) was held in San Jose, Calif., November 3-7, 2012. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, User’s Group meetings, and equipment exposition.
Yield-Oriented Logic Failure Characterization for FA Prioritization
Authors: Goh Szu Huat , Yeoh Boon Lian , You Guo Feng , Lam Jeffrey
Published: August 2022

This article describes a yield-driven approach for characterizing IC logic failures at the wafer level and presents several case studies to demonstrate its versatility and assess its value.
ISTFA 2014 Wrap-Up
Authors: Bodoh Dan
Published: August 2022

The 40th International Symposium for Testing and Failure Analysis (ISTFA 2014) was held November 8 to 14, 2014, at the George R. Brown Convention Center in Houston, Texas. “Exploring the Many Facets of Failure Analysis,” the theme of ISTFA 2014, emphasized the diverse nature of semiconductor failure analysis in the 21st century. The technical sessions, keynotes, and tutorials at ISTFA 2014 covered a wide range of topics from fault isolation and sample prep to extreme environment failures and the birth of the digital signal processor.
Evolution of FA Innovation as Revealed by ISTFA's Best Papers
Authors: Lundquist Ted
Published: August 2022

This column identifies promising new failure analysis technologies based on the papers published in recent ISTFA conferences. The purpose of the column is not to select the "best of the best," but rather to understand the technologies that have been developed and adopted to solve the ever-growing challenges in failure analysis.
A Through-Silicon Metrology Target for Solid Immersion Lenses, Part II: Other Applications
Authors: Lo William , Marks Howard
Published: August 2022

This is the second article in a two-part series that explains how to measure the performance of solid immersion lenses (SILs) used for backside imaging and analysis. In Part I, published in the February 2015 issue of EDFA, the authors describe how they modified a frontside metrology target and used it to evaluate a SIL in a backside imaging system, which prompted the development of an unmounted, backside-specific version of the through-silicon target. In Part II, they explain how these new targets, in addition to measuring resolution, are being used to determine the field of view as well as the line spread and edge response of backside imaging systems. They also discuss some of the challenges encountered when using the targets to characterize emission microscopy systems.
Thinning and Polishing Highly Warped Die: Part II; A Discussion of the Mechanical Limitations of Flattening a Curved Die in Preparation for Die Thinning
Authors: Martin Kirk A. , Weavers Nancy
Published: August 2022

This is the second article in a two-part series on how to properly thin curved and highly warped die. Part I, published in the August 2015 issue of EDFA, introduces the concept of contour machining, a CNC technique driven by thickness measurement data, and describes a multistep grinding and lapping process along with the results. Part II covers the mechanical, physical, and mounting variables associated with thinning and polishing, giving particular attention to mounting procedures and their effect on surface profiles and thickness variations.
Depositing Controlled, Matched Resistors for Circuit Edit of Analog Circuitry
Authors: Zachariasse Frank , Roberts Harry , van der Cruijsen Peter
Published: August 2022

During a silicon debug, it was found that the gain of a radio receiver circuit dropped dramatically at certain frequencies due to an imbalance in one of the signal paths. A metal fix was proposed, but consensus could not be reached on how to validate it because of the difficulty of the FIB edit required and the inherent uncertainty of the approach. In this article, the authors explain how they came up with an alternative approach that proved to be faster, more reliable, and easier to validate than the cut-and-join fix initially proposed. They describe each step of the analog circuit editing process, explaining how they deposit, characterize, and connect matched resistors using focused ion beam techniques.
Capacitors—The Helpers of Active Devices: A Failure Analyst's (Re)view
Authors: Jacob Peter
Published: August 2022

This article addresses the issue of capacitor failures, explaining how and why they occur and how to determine the cause. It describes the frequent but often overlooked reliability failure mechanisms of ceramic, foil, and electrolytic capacitors.
A Discussion of the Mechanical Limitations of Machinery Used For Sample-Preparation Processes
Authors: Martin Kirk A. , Weavers Nancy
Published: August 2022

Failure analysts use a variety of machines for sample preparation, many of which are mechanical in nature. This article discusses the factors that determine the accuracy, resolution, and repeatability of XY positioning systems, rotary stages, and multiaxis machines. It identifies critical machine parameters and explains how environmental effects, runout, and geometric inaccuracies contribute to uncertainty and positioning error. It also assesses the precision, accuracy, and repeatability required for backside thinning and delayering systems.
Soft-Error Susceptibility of FinFET SRAMs
Authors: Oates Anthony S. , Fang Yi-Pin
Published: August 2022

This article reviews recent work aimed at characterizing soft-error effects in SRAM circuits fabricated with bulk silicon FinFETs. Accelerated tests were conducted on 6T planar and FinFET-based SRAM cells by exposing them to high-energy neutrons and alpha particles. Based on test results and simulations, the authors show that soft-error rates are much lower in FinFET devices because the geometry of the fins limits charge collection.
High-Voltage Capacitor Failure on a Downhole Oilfield PCB
Authors: Bescup John
Published: August 2022

This article explains how the failure of a high-voltage capacitor led to the discovery of an unusual defect. Testing showed that the capacitor shorted due to silver migration, which investigators believe was facilitated by voids in the dielectric that had been present from the time of manufacture. Through some combination of time, electric potential, trapped humidity, and elevated operating temperature, plate material migrated into the voids, creating a short path that led to the failure. Using acoustic images as a guide, the failed capacitor was cross-sectioned, allowing investigators to examine the voids more closely and thereby confirm their theory.
2.5- and 3-D TSV Technology Applications and Failure Analysis Challenges
Authors: Cao Lihong
Published: August 2022

The semiconductor industry has followed Moore’s law in the last four decades. However, transistor performance improvement will be limited, and designers will not see doubling of frequency every two years. The need for increased performance and further miniaturization has driven the development of advanced packaging solutions, such as fan-in wafer-level chip-scale packaging, fan-out wafer-level packaging, wire-bonded stacked dice, and package-on-package. These technologies are used in mass production and provide significant benefits in form factor but may not give the desired improvement in die-to-die bandwidth. Recently, 3-D integrated circuits (ICs) that employ vertical through-silicon vias (TSVs) for connecting each die have been proposed. It is an alternative solution to existing package-on-package and system-in-package processes. This column addresses some of the challenges in implementing new TSV techniques.
Superconducting Single Photon Detector Enables Time-Resolved Emission Testing of Low Voltage Scaled ICs
Authors: Bahgat Shehata Andrea , Stellari Franco , Song Peilin
Published: August 2022

Advancements in photodetector technology are revitalizing time-resolved emission (TRE) techniques in semiconductor failure analysis. In this article, the authors explain how superconducting single-photon detectors improve the capabilities of TRE measurements as demonstrated on 14 nm FinFET technology and an inverter chain with power supply voltages down to 0.4 V.
Emerging Techniques For 2-D/2.5-D/3-D Package Failure Analysis: EOTPR, 3-D X-Ray, and Plasma FIB
Authors: Schmidt Christian , Alton Jesse , Igarashi Martin , Chan Lisa , Principe Edward
Published: August 2022

The complexity of sample preparation and deprocessing has risen exponentially with the emergence of 2.5-D and 3D packages. This article provides answers and insights on how to deal with the challenges of increasingly complex semiconductor packages. After identifying pressing issues and potential bottlenecks with state-of-the-art FA flows, the authors present two case studies demonstrating the capabilities of electro-optical terahertz pulse reflectometry (EOTPR), plasma FIB milling, and 3D X-ray imaging. The FA results confirm the potential of all three techniques and indicate that a fully nondestructive integration flow for 3D packages may be achievable with further development and optimization.
Training in an Era of Industry Consolidation and Automation
Authors: Henderson Christopher
Published: August 2022

This month’s guest columnist shares his thoughts on the effects of consolidation and automation in the semiconductor industry and the importance of training for failure analysts.
Bioprinting for Bone Tissue Engineering
Authors: Pan Chi Chun , Kim Carolyn , Li Jiannan , Lui Elaine , Salazar Brett , Goodman Stuart B. , Yang Yunzhi P.
Published: August 2022

Due to its layer-by-layer process, 3D printing enables the formation of complex geometries using multiple materials. Three-dimensional printing for bone tissue engineering is called bioprinting and refers to the use of material-transfer processes for patterning and assembling biologically relevant materials, molecules, cells, tissues, and biodegradable biomaterials with a prescribed organization to accomplish one or more biological functions. Currently, 3D bioprinting constructs can be classified into two categories: acellular and cellular. This article introduces and discusses these two approaches based on the suitable materials for these constructs and the fabrication processes used to manufacture them. The materials are grouped into polymers, metals, and hydrogels. The article also summarizes the commonly used 3D printing techniques for these materials, as well as cell types used for various applications. Lastly, current challenges in tissue engineering are discussed.
Additive Manufacturing of Titanium and Titanium Alloy Biomedical Devices
Authors: Sing S.L. , Huang S. , Yeong W.Y.
Published: August 2022

Additive manufacturing (AM), or three-dimensional (3D) printing, has been widely used for biomedical devices due to its higher freedom of design and its capability for mass customization. Additive manufacturing can be broadly classified into seven categories: binder jetting, directed energy deposition (DED), material extrusion, material jetting, powder-bed fusion (PBF), sheet lamination, and vat photopolymerization. Due to their capability for manufacturing high-quality parts that are fully dense, PBF and DED are the most widely used groups of AM techniques in processing metals directly. In this article, the processing of titanium and its alloys by PBF and DED is described, with a specific focus on their use in biomedical devices. The article then covers the density and mechanical properties of both commercially pure titanium and titanium-aluminum-vanadium alloy. Lastly, the challenges and potential of using new titanium-base materials are discussed.
Micro/Nanoscale Plotting of Biomaterials
Authors: Rajan Parthiban , Daniele Michael , Brown Ashley C.
Published: August 2022

Three-dimensional plotting of biomaterials (also known as bioprinting) has been a major milestone for scientists and engineers working in nanobiotechnology, nanoscience, and nanomedicine. It is typically classified into two major categories, depending on the plotting principle, as contact and noncontact techniques. This article focuses on the working principles of contact and noncontact printing methods along with their advantages, disadvantages, applications, and challenges. Contact printing methods include micro-plotter, pen printing, screen printing, nanoimprint printing, flexography printing, and gravure printing. Noncontact printing methods include extrusion printing, droplet printing, laser-based polymerization, and laser-based cell transfer. The wide variety of printable biomaterials, such as DNA, peptides, proteins, lipids, and cells, also are discussed.
LECTURE EXPERIMENTS IN THE STUDY OF ANTI-TURBULENT ADDITIVES FOR OIL
Authors: Birzul' Aleksei Nikolaevich , Pitilyak Dmitry Aleksandrovich
Published: August 2022

The article discusses the demonstration experiment technique and methodology in the topic of anti-turbulent additives of university discipline «Hydraulics», describes the experiments of varying complexity, that are necessary during giving the lecture. These experiments have practical impor-tance for the oil and gas industry and stimulate the environmental culture of students improving.
Foreword by the Editors of the Special Issue
Authors:   Institute of Polymer Materials and Technology, Kudaibergenov S.E. , Nuraje N. ,   Nazarbayev University
Published: August 2022

The editors, guest editors, and advisory board members of Bulletin of Karaganda University, Chemistry Series decided to dedicate this Special Issue to the 90th anniversary of Doctor of chemical sciences, Profes-sor, Academician of the National Academy of Sciences Esen Abikenovich Bekturov who has made an out-standing contribution to physical chemistry of polymers. In the frame of the Special Issue entitled: “Specialty Polymers in Oil Industry, Bio-, Nanotechnology and Medicine” colleagues from China, Czech Republic, Finland, Japan, Kazakhstan, Russia, Syria, UK, USA, and Uzbekistan share their research with readers of the journal.
Encapsulation of Isoniazid in Polylactide-Co-Glycolide Nanoparticles by Nanoprecipitation
Authors:   Karagandy University of the name of academician E.A. Buketov, Galiyeva A.R. , Tazhbayev Ye.M. ,   Karagandy University of the name of academician E.A. Buketov, Zhumagaliyeva T.S. ,   Karagandy University of the name of academician E.A. Buketov, Daribay A.Т. ,   Karagandy University of the name of academician E.A. Buketov
Published: August 2022

The use of polymeric materials as drug carriers has several advantages, such as prolongation of drug action and reduction of drug side effects. In this study, we consider the methods for the preparation of polylactide-co-glycolide (PLGA) polymeric nanoparticles with the anti-tuberculosis drug (ATD), isoniazid, by nanoprecipitation. Polymeric nanocarriers were obtained by varying individual parameters such as the nature of solvent and non-solvent, drug/polymer ratio, and stabilizer concentration. It was determined that the aver-age particle size depends on the type of non-solvent. When alcohols were used, the average size increased in the sequence: ethanol < isopropanol < isobutanol. The type of solvent is an important factor in the formation of nanoparticles and their final characteristics. With an increase in the drug/polymer ratio, the average size of nanoparticles also increased. The size of obtained nanoparticles varied from 93 to 869 nm. Thermogravi-metric and differential scanning calorimetry analyses were carried out to confirm the incorporation of the drug into the polymer matrix. In addition, polymer degradation and the degree of release of isoniazid from the polymeric matrix at different pH were studied. It was identified that the nanoprecipitation method can be used not only for hydrophobic but also for hydrophilic drugs.
Application of the Cu@PET Composite Track-Etched Membranes for Catalytic Removal of Cr(VI) Ions
Authors:   Institute of Nuclear Physics of the Republic of Kazakhstan, Mashentseva A.A. , Aimanova N.A. ,   Institute of Nuclear Physics of the Republic of Kazakhstan,   L.N. Gumilyov Eurasian National University, Parmanbek N. ,   Institute of Nuclear Physics of the Republic of Kazakhstan,   L.N. Gumilyov Eurasian National University, Altynbaeva L.Sh. ,   Institute of Nuclear Physics of the Republic of Kazakhstan,   L.N. Gumilyov Eurasian National University, Nurpeisova D.T. ,   L.N. Gumilyov Eurasian National University
Published: August 2022

This research examines the features of obtaining composite track-etched membranes based on copper microtubes using various compositions of a deposition solution and various types of reducing agents, such as formaldehyde (Cu_CHOH@PET), dimethylamine borane (Cu_DMAB@PET), glyoxylic acid (Cu_Gly@PET). The structure and composition of the membrane composites were studied by scanning elec-tron microscopy and X-ray phase analysis. It was shown that in the case of using dimethylamine borane as a reducing agent, the obtained composites consisted of copper(I) oxide (37.4 %) and copper(0) (62.6 %), in other cases single-component copper microtubes were obtained. The reduction reaction of chromium(VI) ions was used to evaluate the catalytic ability of prepared composites. It was found that the removal efficiency of chromium ions reached up to 95–97 % in the case of single-component composites; the presence of a cop-per(I) oxide phase in the structure of the Cu_DMAB@PET composites significantly reduced the activity of catalysts and under similar conditions, only 41% of the contaminant was removed from the reaction system. The degradation reaction of Cr(VI) was found to follow the Langmuir-Hinshelwood mechanism and a pseu-do-first-order kinetic model. The calculated value of the reaction rate constant ka for composites of the Cu_DMAB@PET composition (0.017 min–1) was more than 9 times less than that of composites obtained us-ing glyoxylic acid (0.156 min–1) and more than 15 times less than the ka value of Cu_CHOH@PET samples (0.249 min–1). Effect of temperatures on the catalytic ability of composites was studied in the temperature range of 10–38 °C. Some thermodynamic characteristics such as activation energy, enthalpy, and entropy of activation were calculated. It was found that the minimum value of the activation energy was obtained for the Cu_CHOH@PET samples.