bluuebunny/crossref_metadata_2025 huggingface dataset:
Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire Bonding Reliability
Authors: Chyan Oliver , Durai Kevin Antony Jesu , Kumaravel Dinesh Kumar , Alptekin John , Estridge Logan , Nair Shyam
Published: March 2024

Copper wire bonding, with its advantages of higher electrical conductivity and better mechanical strength, has replaced gold wire bonding as a proven cost-effective electrical interconnection solution for IC packaging for the past 15 years. Early development of Cu wire bonding required overcoming of several technical challenges including bond pad damage caused by copper’s hardness and brittleness relative to gold. A more chemistry related challenge of using Cu as bonding wire is its well-known reactivity with oxygen. Inert atmospheric envelope of forming gas surrounding bonding capillary was developed to prevent oxidation of Cu wire during electronic flame off to enable a strong bonding. Another more elusive materials-chemistry related reliability challenge, with a typical low ppm occurrence, has been the chloride-induced corrosion defects between the Cu wire and Al bond pad. The opportunistic low-level chloride contaminations can originate from various points of packaging manufacturing process flow and often render it un-trackable. In this talk, we present recent efforts to systematically control interfacial materials chemistry across Cu bonding wire, Cu/Al bimetallic contacts and CuxAly intermetallic compounds with the aim to eliminate corrosion defects and improve the overall bonding reliability. The current prevailing manufacturing solution is to utilize Pd-coated Cu bonding wire that can only partially mitigate the CuxAly intermetallic corrosion vulnerability. We utilized a real-time corrosion screening metrology to explore the underlying interfacial materials chemistry drives vigorous corrosion between Cu wire and Al bond pad when exposed to trace level of chloride contaminant. Combining with SEM, sensitive infrared spectroscopy and electrochemical characterization, our data show strategic surface modification on both Cu bonding wire and exposed CuxAly intermetallic can have a significant impact on reducing corrosion defect rates. The obtained mechanistic insights provide several new strategies enabled by a novel Cu-selective passivation coating technology to effectively mitigate Cu wire bonding corrosion defects. Implications on further improving overall Cu wire bonding reliability will be present based on these new approaches that have low-cost and packaging friendly advantages.
Study on Chemical Activity of Electroless Copper Plating
Authors: Chou I Hsuan , Lai Huei Ting , Chung Yan Wen , Huang Wen Hung , Huang Min Lung , Lin Yue Nung , Fang Jen Kuang
Published: March 2024

Electroless copper plating of insulating substrates typically requires the pre-deposition of Pd/Sn catalyst layer onto the surface to initiate the chemical reactions; Accordingly, it’s high-profile process to achieve efficient Pd/Sn cluster adhesion and good copper plating performance. This paper showed copper thickness and dimple hole depth of the electroless plating were affected by chemicals following different activation times. The composition, microstructure, size and roughness evolution were characterized using Transmission Electron Microscope (TEM). The structural studies revealed that copper particle size depends not only on the size and coverage of the Pd/Sn cluster, but also on the degree of activation of the chemicals. In order to make deposition copper more compact and uniform to decrease dimple hole depth, dummy boards are generally used to enhance the potion activity before electroless copper plating. This paper will provide chemical activity and plating efficiency relationship to avoid poor activity impact plating quality and process event.
Solder-less Fine Pitch Copper-to-Copper Bonding
Authors: Lay Nicholas , Rahim Kaysar
Published: March 2024

The industry has been looking to increase pitch scaling through various methods. One of these methods is an alternative to solid-state solder bonding. However, very few processes can compete with solder bonding’s fast speed, low cost, and flexibility. The approach with the biggest potential for connecting fine pitch interconnects in high-density semiconductor packaging is solder-less copper-to-copper direct bonding.

There are many benefits to using copper-to-copper direct bonding, including the ability to achieve ultra-fine-pitch (bump pitch 10 μm), higher reliability (both thermo-mechanically and better electromigration behavior), low resistance, as well as the lack of concern for solder hierarchy for multiple reflow. This copper-to-copper direct bonding technology enables a variety of 2.5D/3D advanced packaging architectures and is also suitable for multi-die stacking.

In this study, we report the investigation of a direct copper-to-copper bonding methodology and reliability of the bonded components. Our process differs from common hybrid bonding copper-to-copper techniques, in that it is designed for low volume highly complex products. This technology allows a die-to-die and die-to-wafer process using thermocompression bonding under a deoxidizing vapor flow for direct copper-to-copper bonding. The process does not require high temperature oven annealing and can be done in a normal atmospheric environment. The investigated bonding process is ideal for high power, high thermal, high density 3D stacking and high-speed digital communication applications.

We demonstrated the bonding procedure using a test vehicle with 40 μm diameter pillars and 80-μm bump pitch. We investigated the effects of bonding force and evaluated joint reliability. Interconnect/bond strength was determined through destructive shear testing and cross-sectional analysis. A scanning electron microscope was used to inspect and examine the bonded joint quality. Finally, completed assemblies were thermal cycled to evaluate degradation of joint strength under induced stress, and resistance measurements were performed to evaluate the electrical performance of the bonded copper joint.
A Comprehensive Study of Surface Finishes for High Frequency/High Speed Applications
Authors: Xu Frank , Bunce Martin , Watkowski Jim , Lifton Anna , Rangaraju Ragu Raj , Bumagat Rommel
Published: March 2024

The introduction of 5G/6G created growing demand for faster rates of data transfer and operation at higher frequencies, pushing signals to travel towards the outer edges of conductors. Therefore, the surface finish applied over the copper circuitry is now gaining more attention.

It has been previously shown that the low conductivity and magnetic properties of the Electroless Nickel (EN) layer negatively affect electrical signals as they travel along the conductor outer surfaces, leading to insertion losses. Subsequent studies show that reducing the EN thickness can offset some of the insertion losses observed, leading to a reduction in insertion losses. In more recent times “Nickel Free’ finishes, such as EPIG (Electroless Palladium - Immersion Gold, no EN) have been promoted as solutions to improving signal losses at higher frequency.

Exactly how much high frequency performance these new “nickel-free” finishes by the user has not yet been fully quantified, and what are the considerations or trade-off’s for solderjoint reliability with smaller diameter solder spheres when assembled using these newer surface finishes?

Comprehensive studies of signal loss, solderjoint reliability testing (ball shear, drop shock, electromigration) and other critical to quality performance data were undertaken for standard ENEPIG, Thinner EN ENEPIG’s, EPIG (no EN) as well Immersion Silver, OSP and a new Ag/Au surface finish.

All surface finishes were compared across the performance requirement matrix and a Quality Function Deployment was constructed to produce a data driven tool to align surface finish performance against design needs, allowing for optimal surface finish selection for each application.
Unlocking the True Power of Additive Manufacturing for EMI Shielding
Authors: Scheibel Markus G. , Kaiser Michael P. , Balasubramaniam Sutharsan , Chernobryvko Mykola , Köszegi Julia-Marie , Dreissigacker Marc , Adler Marius , Braun Tanja , Huang Chuan I "Eric" , Li Meng "Jason" , Thomas Muriel , Vollmann Franz
Published: March 2024

Miniaturization trends in electronic packaging led to reduced spacing of individual packages on the printed circuit boards and thus increased the overall electromagnetic interference (EMI) levels within a device. State-of-the-art conformal coatings as EMI shielding layers are typically applied via sputter technology and offer design limitations with respect to coating selectivity on individual positions of the overall package. Our new technology of additively Ag layer application via inkjet printing overcomes today’s design limitations and is key enabler for next generations packaging designs.

In this study, we compare the shielding effectiveness (S.E.) on specifically designed transmission line emitter samples coated with state-of-the-art sputtered conformal layers against silver coatings applied via inkjet printing of particle free metal organic decomposition inks to evaluate the new technology for its potential on package level shielding performance. Mechanical and electrical characterization of the silver coatings indicate appropriate tools to specify layer characteristics and ensure S.E. of 40 dB or higher at frequencies of 800 MHz and higher. The suitability of our well-tailored silver coatings to match typical S.E. requirements is shown with even much thinner layer thickness as compared to state-of-the-art coatings.
Study on the Manufacturability of XDFOI Package with Organic RDLs (XDFOI-O)
Authors: Chen Haijie , Bian Ziyao , Liu Tao , Xie Jielei , Wu Jingyu , Lin Yaojian , Lee Choon Heung
Published: March 2024

The concept of chiplet has been proposed in the post Moore era, while how to achieve the layout of multiple chips of different processes and sizes in the manufacturing process is a coming problem that needs to be considered. Different layouts may significantly affect the manufacturability during the packaging process. Prospective finite element analysis (FEA) can evaluate various layouts by optimizing the layout and increasing the placement of dummy chips as stiffeners, thereby selecting the best layout and combination method. In addition, the characteristic of chiplet packaging is that multiple chips may come from different sources, such as different foundries, processes, sizes, or even thicknesses. This really poses challenges to the subsequent flip chip and wafer thinning process for leveling the total package. It is necessary to confirm the evaluation of the impact of chips with different thicknesses and underfill coverage in the process, so as to ensure the consistency in processing and improve the yield of packages.
Reliable Solder Columns to Replace Solder Balls in Large 2.5D Heterogeneous Packages
Authors: Hart Martin
Published: March 2024

Solder balls are well suited for interconnecting normal sized ball grid array (BGA) components to printed

circuit boards (PCB). However, solder balls are prone to cracking (failure) caused by excessive stresses

inherently found in advanced packaging such as large-sized heterogeneous 2.5D packages where multiple

dies are placed side-by-side. The growth trend is to make larger and larger BGA processors exceeding

60x60mm in size for AI and data centers. A plethora of new processor substrate and interposer designs are

coming on line such as Chip-on-Wafer-on-Substrates (CoWoS). For that reason, more instances of solder

ball delamination and cracking on large-sized BGA packages are probable.

Solder columns were produced more than 50 years ago to reduce cracking in large ceramic packages,

especially for use in harsh environments found in aerospace and defense applications. However, such legacy

solder column technology is limited to Tin-Lead (SnPb) alloys. The challenge is to make Lead Free solder

columns that satisfy demand for RoHS compliance, while still providing adequate stress relief (compliancy)

for extending the operational life of large sized heterogeneous 2.5D processors for mission critical

applications.

This paper describes our ongoing work to innovate non-collapsible, compliant Lead-Free Braided Copper

Solder Columns to reduce strain caused by the Coefficient of Thermal Expansion (CTE) mismatch between

large BGA packages and FR4 PCBs. A braid, consisting of 16 fine copper alloy wires, serves as an

exoskeleton sleeve around a solder column to provide mechanical support as well as compliancy. This novel

solder column technology supports market trends to scale up the size of chip packaging while maintaining

reliability.

Our focus was to quickly characterize Lead-Free solder column core materials and braiding alloys by

employing “Fail-Fast” destructive accelerated mechanical bend testing in our lab. Since there is an ongoing

interest in Tin-Lead alloys, this paper also discusses data on Tin-Lead alloys for comparative purposes.
Impact of Cu Protrusion on Connection Resistance in Hybrid Bonding of Via-middle TSV Wafer
Authors: Watanabe Naoya , Yamamoto Hiroshi , Mitsui Takahiko
Published: March 2024

In this study, we investigated the impact of Cu protrusion on the connection resistance as detailed data

regarding the hybrid bonding of the via-middle through-silicon-via (TSV) wafer. After several Cu TSV

wafers and Cu electrode wafers with different amounts of Cu protrusion were prepared and bonded via a

surface-activated bonding method using ultrathin Si films, the connection resistance of bonded wafers (that

is, the sum of the TSV, Cu electrode, and interface resistances) was evaluated via four-terminal measurements.

The results demonstrate that the amount of Cu protrusion is a crucial parameter for the hybrid bonding of

via-middle TSV wafers with ultrathin Si films, and an electrical connection between the TSV and Cu

electrode can be achieved without heat treatment by adjusting the Cu protrusion.
Smart Metrology Control of Through Silicon Via Etching Process for High End Devices
Authors: Alliata Dario , Lynch Graham , Schöbitz Michael , Tang Chong Fei , Hammami Sabri , Ow Isaac
Published: March 2024

In this paper, we report on an innovative process characterization solution that aims to control the uniformity of the Through Silicon Via (TSV) etching process. The solution relies on measuring complementary geometric characteristics of the open Through-Silicon-VIA (TSV) that are key to establish a reliable vertical interconnection. When TSV are fabricated either in high-density matrix or in isolated locations, the solution presented here allows the non-destructive reliable measurement of top / bottom diameter, depth, and thickness of top hard mask layer with a combination of optical techniques. As example of use case, we present the result of the characterization of three different products hosting TSV with top diameter as small as 3 μm and aspect ratio up to 17:1. The new methodology is compared to the state of the art of metrology control solutions used in the semiconductor industry.
WLCSP Fully Protected Fan-In Reliability
Authors: Hackler Doug , Prack Ed
Published: March 2024

A strong supply chain requires higher performance and lower cost processes. DCA conventionally referred to as WLCSP has been used for low density devices, however for higher density devices reliability concerns have emerged. Six-side protected, aka “6S or fully protected”, CSP is a rapidly growing market. Fully protected CSP was first implemented with processes such as M-series utilizing FO. These processes require costly and complex die reconstitution, expensive tapes, molding, and other operations. These steps can be eliminated in a P-WLCSP process to provide the cost-effective high reliability 6S format needed for high-performance higher pin count and/or thin silicon chips. American Semiconductor’s Semiconductor-on-Polymer (SoP) 300mm SoP-TM, a P-WLCSP process, is an advanced packaging process optimized for protected CSP, fan-in, and chiplets. Protected FI process innovations can improve performance in power devices, RF switches, photonic IC (PIC), die stacking and thin board applications. The P-WLCSP process incorporates the best of DCA (simplicity) and FO (protection) while incorporating advanced manufacturing processes to lower cost and improve performance. This paper builds on the SoP-TM process release announced at the 2023 Device Packaging Conference earlier this year with the addition of reliability characterization beyond first silicon data for electrical test chips. Reliability data such as accelerated stress tests, die strength, operating lifetime and thermal testing are key areas of investigation for the new P-WLCSP technology that will be presented. The presentation will also include and update for ultra-thin device reliability test methods under consideration for new NIST standards.
Gold Coated Silver Bonding Wire and Its Consistent Reliability Performances
Authors: Murali Sarangapani , Mariyappan Dhayalan , Qing Tan Tze , Keong Loke Chee , Kumar Balasubramanian Senthil , Sungsig SS Kang
Published: March 2024

Thermal aging of gold coated silver bonded ball with aluminium bond pads exhibited a stable interface without Kirkendall voids until 4000h at 200°C for an un-molded device tested under vacuum. Ball and stitch pull remains in strength and remained constant until 4000 hours of aging. The growth of aluminides at the bond interface is about 4.5µm for 4000 hours of aging.

The electrical resistance of the bonded ball remains the same until 4000 hours at 175°C for an epoxy molded device, molded with 5 to 7 pH green epoxy molding compound containing low chlorine and sulfur. Interestingly, the bonded ball interface of epoxy molded device has sustained 480h on biased Highly Accelerated Stress Test (bHAST) at +20V bias, 130°C, 85%RH. The bonded ball interface is stable until 1000 hours on unbiased HAST (uHAST) at 130°C, 85% RH as well. Cross-sectional ovservations of the bonded balls revealed the presence of intermetallic phases at the bond interface. However, formation of Kirkendall voids or crack propagatioon due to galvanic corrosions are absent.
Optimizing Type 7 Solder Paster Formulation and Compatibility with Assembly Technology for Sub-75um System-in-Package Applications
Authors: Griffith Evan
Published: March 2024

For System-in-Package (SiP) assembly, solder paste printing remains the preferred solder application method of choice. However, as passive components (008004) and next-generation flip-chip components continue to shrink, smaller stencil openings are needed and these small stencil apertures still need to achieve consistent printing. In addition, as component standoff height continues to decrease for fine-pitch applications, the cleanability of the final SiP build becomes a concern; for many applications which require water-soluble pastes, pure DI water becomes difficult to use when the standoff height lessens. This paper will investigate important parameters from a materials supplier’s perspective for meeting the challenges of fine-feature solder paste printing and package assembly.

First, innovations in solder powder technology will be discussed which allow for consistent solder paste (Type 7) printing at 60um apertures. Next, the effect of stencil technology will be discussed. Many stencil manufacturers are approaching a manufacturing limit both with respect to stencil thinness and aperture size. This paper will discuss two common stencil manufacturing designs, laser-cut and electroform, and present findings on the effect these designs have on solder paste print consistency. Lastly, solder paste cleanability will be discussed; the results of a study investigating novel Type-7 solder pastes for use with semi-aqueous cleaning technology will be presented. Important process considerations with respect to stencil and package cleaning will also be discussed.
Al2O3-Coated Bonding Wire with Electrical Insulation & Promoted Adhesion
Authors: Park Soojae , Jeong Hwajin , Seo Sichun , Cho Chulhyung
Published: March 2024

Conventional bond wires composed of Au, Ag, & Cu don’t meet market demands for strong adhesion, electrical insulation, and corrosion passivation due to their conductive metallic surfaces. We propose a solution through the applications of a ceramic (Al2O3) coating at nanometer scales on these metal wires, thereby improving their adhesion to encapsulation, electrical insulation, and resistance to corrosion. We used ALD (Atomic Layer Deposition) methods to coat Au and Ag metal wires with diameters ranging from 18um to 48um (0.7mil~1.9mil) with Al2O3. Our paper details the innovative processes we used to incubate the idea of Al2O3 coating on conventional bond wires, focusing on wire bondability and dependability. Our findings demonstrate enhanced electrical insulation between crossing wires and increased reliability related to the wires’ adhesion to encapsulation.
Tata Memorial Centre Evidence Based Management of Colorectal cancer
Authors: Saklani Avanish , Kazi Mufaddal , Desouza Ashwin , Sharma Ankit , Engineer Reena , Krishnatry Rahul , Gudi Shivkumar , Ostwal Vikas , Ramaswamy Anant , Dhanwat Aditya , Bhargava Prabhat , Mehta Shaesta , Sundaram Sridhar , Kale Aditya , Goel Mahesh , Patkar Shraddha , Vartey Gurudutt , Kulkarni Suyash , Baheti Akshay , Ankathi Suman , Haria Purvi , Katdare Aparna , Choudhari Amit , Ramadwar Mukta , Menon Munita , Patil Prachi
Published: March 2024

This review article examines the evidence-based management of colorectal cancers, focusing on topics characterized by ongoing debates and evolving evidence. To contribute to the scientific discourse, we intentionally exclude subjects with established guidelines, concentrating instead on areas where the current understanding is dynamic. Our analysis encompasses a thorough exploration of critical themes, including the evidence surrounding complete mesocolic excision and D3 lymphadenectomy in colon cancers. Additionally, we delve into the evolving landscape of perioperative chemotherapy in both colon and rectal cancers, considering its nuanced role in the context of contemporary treatment strategies. Advancements in surgical techniques are a pivotal aspect of our discussion, with an emphasis on the utilization of minimally invasive approaches such as laparoscopy and robotic surgery in both colon and rectal cancers, including advanced rectal cases. Moving beyond conventional radical procedures, we scrutinize the feasibility and implications of endoscopic resections for small tumors, explore the paradigm of organ preservation in locally advanced rectal cancers, and assess the utility of total neoadjuvant therapy in the current treatment landscape. Our final segment reviews pivotal trials that have significantly influenced the management of colorectal liver and peritoneal metastasis.
Neurosonograms in very preterm neonates: Findings, risk factors, and association with neurodevelopmental outcome: A retrospective study
Authors: Kurup Shyam Kumar Sasidhara , Pournami Femitha , Prithvi Ajai Kumar , Kolisambeevi Arif Abdulsalam , Panackal Anila V. , Prabhakar Jyothi , Jain Naveen
Published: March 2024

Background:

Neurosonogram (NSG) is a widely used, noninvasive bedside investigation in neonatal intensive care. Yet, actual data on the proportions of abnormal findings, specific conclusions, and its ability to predict outcomes are sparse. We aimed to study these aspects in very preterm infants who are a high-risk group.

Materials and Methods:

This retrospective descriptive study aimed at analyzing reports of postnatal age-specific NSG reports done in very preterm neonates, and their associations with risk factors. Follow-up information prospectively recorded by the child development services was analyzed for the association of NSG abnormalities with neurodevelopmental impairment (NDI).

Results:

Clinical and radiological details of 323 very preterm neonates were analyzed. Abnormal NSG (defined as ≥Grade 3 intraventricular hemorrhage/≥Grade 2 periventricular leukomalacia/ventriculomegaly) was reported in 42 infants (13%) at or less than term postmenstrual age; 8% of babies at ≤2 weeks postnatal age; and 12% at 36–40 weeks. Choroid plexus cyst was the most common “other” findings. Gestational age <28 weeks, chorioamnionitis, extensive resuscitation, ventilation >24 h, and culture-proven sepsis were independent risk factors for abnormal NSG in the first 2 weeks of life. Of the babies followed up, 19.25% babies had NDI. The sensitivity of any abnormal NSG was only 16% and the specificity was 91% to predict NDI. The negative predictive value of abnormal NSG for NDI was 79.5%.

Conclusion:

In very preterm, any abnormal NSG (till term postmenstrual age) was reported in 13% of very preterm. The ability to predict NDI using abnormal NSG reports has a test accuracy of 73.8%.
Main issues in penetrating keratoplasty
Authors: Alió Jorge L. , Niazi Sana , Doroodgar Farideh , Barrio Jorge L. Alió Del , Hashemi Hassan , Javadi Mohammad Ali
Published: March 2024

This review explores contemporary challenges in penetrating keratoplasty (PK), focusing on technical intricacies, technological advancements, and strategies for preventing graft rejection. A systematic literature search from January 2018 to July 2023 was conducted across PubMed, Cochrane, Web of Science, Scopus, and EMBASE. The inclusion criteria comprised studies on PK and its comparison with other corneal pathologies, with emphasis on keratoconus (KC). Two independent reviewers screened studies, extracting relevant data. The review covers PK evolution, highlighting infra-red femtosecond lasers’ impact on graft shapes, minimizing astigmatism, and enhancing wound healing. Graft rejection, a primary complication, is examined, detailing risk factors and preventive measures. Preoperative considerations, diagnostic techniques for rejection, and PK in KC are discussed. Postoperative care’s significance, including intraocular pressure monitoring and steroid administration, is emphasized. The paper concludes with a comprehensive approach to prevent graft rejection, involving topical and systemic medications. An outlook on evolving monoclonal antibody research is presented. As the field progresses, personalized approaches and ongoing therapeutic exploration are expected to refine strategies, enhancing PK outcomes.
Safety Wearable for Miners
Authors: Ramya M , Puvaneswari G , Kalaivani R , Shesathri K
Published: March 2024

INTRODUCTION: Mining is the process of extraction of valuable minerals, ores and other non-renewable resources from the Earth’s surface. The mining industry is known for its hazardous and highly risky working environment.
OBJECTIVES: The mining industry is involved in the extraction of these geological materials, which is essential for the development of the country and its economy. However, this industry comes with its fair share of risks and dangers. Recent statistics show that around 100 miners fall victim to the harsh working conditions every year.
METHODS: Explosions due to Methane and coal dust followed by roof collapses, mine fires, gas outburst, blasting accidents, poisoning and suffocation are the major reasons out of these few of them causes deaths inside the mines.
RESULTS: Even though many precautions are suggested, and measures have been taken to improve the safety of the miners and to improve the work environment, but mines are still unpredictable, and accidents are also recorded then and there.
CONCLUSION: The existing safety technologies and measures have either failed to monitor multiple vital features that could lead to fatalities, or to provide adequate and appropriate rescue resources in time to help the miners in danger.
Visual Knowledge Graph Construction of Self-directed Learning Ability Driven by Interdisciplinary Projects
Authors: Kou Xiangying
Published: March 2024

INTRODUCTION: The application of interdisciplinary information technology is becoming more and more widespread, and the application of visual knowledge mapping in the process of students' independent learning is also becoming more and more important; therefore, in this context, takes the history discipline as a starting point to study the construction of visual knowledge mapping of students' independent learning ability under the drive of interdisciplinary projects.OBJECTIVES: To enrich the means of student independent learning aids in China's history discipline and enhance the modernization level of China's history discipline construction; to solve the problem that student independent learning ability under the drive of China's interdisciplinary projects can not be visualized and observed; to further improve China's distance education environment and to enhance the educational capacity of the history discipline.METHODS: Firstly, the relevant modeling uses a visual knowledge map. Secondly, the neural network model assesses students' independent learning ability in history learning. Finally, the convolutional neural network model is used to assess the efficiency of the knowledge map.RESULTS: The Sig and Tanh function models have better robustness, and the ReLU and PReLU functions have weaker interdisciplinary driving performance. However, the iterative Knownledge1 and Knownledge2 models have better robustness of the visualized knowledge graph.CONCLUSION: In studying history, the interdisciplinary, project-driven, and independent learning ability of students could be more vital, and our country should vigorously develop new information network technology to improve the status quo of history discipline education in China.
Performance Evaluation and Improvement of Deep Echo State Network Models in English Writing Assistance and Grammar Error Correctionn
Authors: Chen Dongyun
Published: March 2024

INTRODUCTION: The research on the performance evaluation model of English writing tutoring and grammar error correction is very necessary, which is not only conducive to the rational allocation of teachers' writing tutoring resources, but also more conducive to the timely and effective correction of students' grammatical errors.OBJCTIVES: Aiming at the problems of non-specific quantification, low precision, and low real-time performance evaluation methods for English writing grammar error correction in current methods.METHODS: This paper proposes a grammar error correction performance evaluation method based on deep echo state network with gold rush optimisation algorithm. Firstly, by analysing the process of English writing assistance and grammatical error correction, we extract the evaluation features of grammatical error correction type and construct the performance evaluation system; then, we improve the deep confidence network through the gold rush optimization algorithm and construct the grammatical error correction performance evaluation model; finally, we analyse it through simulation experiments.RESULTS: The results show that the proposed method improves the evaluation accuracy, robustness. The absolute value of the relative error of the evaluation value of the syntactic error correction performance of the method is controlled within the range of 0.02.CONCLUSION: The problems of non-specific quantification, low precision and low real-time performance of the application of English writing grammar error correction performance assessment methods are solved.
Research on Music Classification Technology Based on Integrated Deep Learning Methods
Authors: He Sujie , Li Yuxian
Published: March 2024

INTRODUCTION: Music classification techniques are of great importance in the current era of digitized music. With the dramatic increase in music data, effectively categorizing music has become a challenging task. Traditional music classification methods have some limitations, so this study aims to explore music classification techniques based on integrated deep-learning methods to improve classification accuracy and robustness.OBJECTIVES: The purpose of this study is to improve the performance of music classification by using an integrated deep learning approach that combines the advantages of different deep learning models. The author aims to explore the effectiveness of this approach in coping with the diversity and complexity of music and to compare its performance differences with traditional approaches.METHODS: The study employs several deep learning models including, but not limited to, Convolutional Neural Networks (CNN), Recurrent Neural Networks (RNN), and Long Short-Term Memory Networks (LSTM). These models were integrated into an overall framework to perform the final music classification by combining their predictions. The training dataset contains rich music samples covering different styles, genres and emotions.RESULTS: Experimental results show that music classification techniques based on integrated deep learning methods perform better in terms of classification accuracy and robustness compared to traditional methods. The advantages of integrating different deep learning models are fully utilized, enabling the system to better adapt to different types of music inputs.CONCLUSION: This study demonstrates the effectiveness of the integrated deep learning approach in music classification tasks and provides valuable insights for further improving music classification techniques. This approach not only improves the classification performance but also promises to be applied to other areas and promote the application of deep learning techniques in music analysis.
Spectral theory of the invariant Laplacian on the disk and the sphere – a complex analysis approach
Authors: Heins Michael , Moucha Annika , Roth Oliver
Published: March 2024

The central theme of this paper is the holomorphic spectral theory of the canonical Laplace operator of the complementof the “complexified unit circle”$\{(z,w) \in \widehat {{\mathbb C}}^2 \colon z \cdot w = 1\}$. We start by singling out a distinguished set of holomorphic eigenfunctions on the bidisk in terms of hypergeometric${}_2F_1$functions and prove that they provide a spectral decomposition of every holomorphic eigenfunction on the bidisk. As a second step, we identify the maximal domains of definition of these eigenfunctions and show that these maximal domains naturally determine the fine structure of the eigenspaces. Our main result gives an intrinsic classification of all closed Möbius invariant subspaces of eigenspaces of the canonical Laplacian of$\Omega $. Generalizing foundational prior work of Helgason and Rudin, this provides a unifying complex analytic framework for the real-analytic eigenvalue theories of both the hyperbolic and spherical Laplace operators on the open unit disk resp. the Riemann sphere and, in particular, shows how they are interrelated with one another.
Challenges in Mobilising Green Finance for Local Development
Authors: Jovović Jelena
Published: March 2024

The need for sustainable development and the transition toward a low-carbon economy has created a significant demand for green finance. To address this issue, this chapter aims to analyse green financing mechanisms in the context of local development through an extensive review of existing green policies and their impact on enhancing the local development process. The chapter reviews the existing literature on the topic and identifies the connection between green financing mechanisms and the role of the EU in their further development. Furthermore, the chapter also analyses successful green finance initiatives in the European Union. Lastly, it presents the main challenges in mobilising green funds and proposes means to solve them. The propositions aim to provide valuable insights and guidance for policymakers, financial institutions, and local leaders seeking to accelerate the transition to a low-carbon economy and attain sustainable development goals by 2040.
EU Cohesion Policy and the New Member States: Soft Power of EU Policies?
Authors: Hoffman István
Published: March 2024

Between 2004 and 2013, 13 new member states joined the European Union. Most of the regions of these new member states belonged to the less developed or transition regions, which is why EU cohesion policy played an important role in these countries. However, the EU cohesion policy regulation has been partially remodelled in the last two decades, compliance with EU rules have been an important part of EU regional development rules. Therefore, EU policy on regional development (cohesion) could also emphasise those policies that are based on Member States' competences (e.g. social policy, health policy, education policies etc.). Over the last ten years, the role of EU cohesion policy has crystallised in the area of the rule of law and the defence of EU values. The new provisions of Regulation (EU) 2021/1060 on the framework conditions, the general and specific objectives of the Recovery and Resilience Facility and the Council decisions based on these regulations have made it clear that the role of EU cohesion policy and EU funds has also grown in the area of governance. This chapter analyses this impact on the basis of an examination of legal regulations, policy documents and policy practises, in particular the analysis of the Hungarian case. To show the impact of these policies, a case study is added to the chapter: the impact of this funding on the Hungarian national and local authorities' accessible public transport projects.
Greek as an SAE language: Developing on the micro-orientation perspective
Authors: Bočková Loudová Kateřina
Published: March 2024

This paper considers the Greek language as a member of the Standard Average European (SAE) linguistic area as defined by Haspelmath (1998, 2001). After a brief presentation of the model, there follows a detailed analysis from this perspective of four selected features in Greek: relative clauses with relative pronouns, the “have”-perfect with a passive par- ticiple, participial passives, and negation. The approach applied focuses on specifics that concern standard and non-standard varieties, not only in the language system itself but also in its diachronic development. The results are then measured using Seiler’s (2019) classification of SAE features, with an eye to enriching the classification both empirically and theoretically.
Acciones cotidianas que contribuyen al ecocidio. Una aproximación exploratoria a la propuesta de Robert Agnew desde la teoría general de la frustración.
Authors: Puente Guerrero Patricia
Published: March 2024

El presente estudio emplea los datos de la Encuesta Social 2018: Hogares y Medio Ambiente en Andalucía para explorar la propuesta de Robert Agnew de aplicar los planteamientos de las principales teorías criminológicas al análisis de acciones cotidianas que contribuyen al ecocidio, entendido como la contaminación y la destrucción del medioambiente natural en formas que reducen su capacidad de sostener la vida. Más específicamente, se estudia la aplicabilidad de la teoría general de la frustración y, en particular, del concepto de frustración medioambiental, distinguiendo entre sus dimensiones objetiva y subjetiva. Los resultados apoyan parcialmente el planteamiento de Agnew. Se discuten las posibles razones y las implicaciones de estos hallazgos y se proponen futuros desarrollos de esta prometedora línea de investigación.
Respon pertumbuhan tanaman ubi jalar (Ipomea batatas L.) pada sistem pola tanam monokultur dan tumpangsari dengan tanaman jagung (Zea mays L.) di lahan PT. Koperasi Eiber Shuth Coklat Ransiki Kabupaten Manokwari Selatan
Authors: Muyan Yaved , Asjerem Fenny S. J. , Makhroji Lanang Ari
Published: March 2024

This research aimed to determine how sweet potato growth responds to a monoculture cropping system and intercropping with corn. This research was carried out for 4 months December 2021 to April 2022 on the land of PT. Eiber Shuth Coklat Ransiki (Cokran) Cooperative in South Manokwari Regency. This research conducted in Randomized Group Design consisting of two treatments of cropping patterns, namely monoculture and intercropping patterns. The variables observed were length of tendrils, number of leaves, number of branches, fresh weight and dry weight of sweet potato grown in two different cropping patterns. The results of the tabulated analysis showed that the number of leaves, number of branches, length of tendrils and dry weight of sweet potato plants cultivated in monoculture was better than in an intercropping pattern with corn. However, the fresh weight of sweet potato in the intercropping pattern with corn is higher compared to those from the monoculture.
Cryptanalysis of QARMAv2
Authors: Hadipour Hosein , Todo Yosuke
Published: March 2024

QARMAv2 is a general-purpose and hardware-oriented family of lightweight tweakable block ciphers (TBCs) introduced in ToSC 2023. QARMAv2, as a redesign of QARMAv1 with a longer tweak and tighter security margins, is also designed to be suitable for cryptographic memory protection and control flow integrity. The designers of QARMAv2 provided a relatively comprehensive security analysis in the design specification, e.g., some bounds for the number of attacked rounds in differential and boomerang analysis, together with some concrete impossible differential, zerocorrelation, and integral distinguishers. As one of the first third-party cryptanalysis of QARMAv2, Hadipour et al., [HGSE24] significantly improved the integral distinguishers of QARMAv2, and provided the longest concrete distinguishers of QARMAv2 up to now. However, they provided no key recovery attack based on their distinguishers. This paper delves into the cryptanalysis of QARMAv2 to enhance our understanding of its security. Given that the integral distinguishers of QARMAv2 are the longest concrete distinguishers for this cipher so far, we focus on integral attack. To this end, we first further improve the automatic tool introduced by Hadipour et al. [HSE23,HGSE24] for finding integral distinguishers of TBCs following the TWEAKEY framework. This new tool exploits the MixColumns property of QARMAv2 to find integral distinguishers more suitable for key recovery attacks. Then, we combine several techniques for integral key recovery attacks, e.g., Meet-in-the-middle and partial-sum techniques to build a fine-grained integral key recovery attack on QARMAv2. Notably, we demonstrate how to leverage the low data complexity of the integral distinguishers of QARMAv2 to reduce the memory complexity of the meet-in-the-middle technique. As a result, we successfully present the first concrete key recovery attacks on reduced-round versions of QARMAv2. This includes attacking 13 rounds of QARMAv2-64-128 with a single tweak block (T = 1), 14 rounds of QARMAv2-64-128 with two independent tweak blocks (T = 2), and 16 rounds of QARMAv2-128-256 with two independent tweak blocks (T = 2), all in an unbalanced setting. Our attacks do not compromise the claimed security of QARMAv2, but they shed more light on the cryptanalysis of this cipher.
Improved Search for Integral, Impossible Differential and Zero-Correlation Attacks
Authors: Hadipour Hosein , Gerhalter Simon , Sadeghi Sadegh , Eichlseder Maria
Published: March 2024

Integral, impossible-differential (ID), and zero-correlation (ZC) attacks are three of the most important attacks on block ciphers. However, manually finding these attacks can be a daunting task, which is why automated methods are becoming increasingly important. Most automatic tools regarding integral, ZC, and ID attacks have focused only on finding distinguishers rather than complete attacks. At EUROCRYPT 2023, Hadipour et al. proposed a generic and efficient constraint programming (CP) model based on satisfiability for finding ID, ZC, and integral distinguishers. This new model can be extended to a unified CP model for finding full key recovery attacks. However, it has limitations, including determining the contradiction location beforehand and a cell-wise model unsuitable for weakly aligned ciphers like Ascon and PRESENT. They also deferred developing a CP model for the partial-sum technique in key recovery as future work.In this paper, we enhance Hadipour et al.’s method in several ways. First, we remove the limitation of determining the contradiction location in advance. Second, we show how to extend the distinguisher model to a bit-wise model, considering the internal structure of S-boxes and keeping the model based on satisfiability. Third, we introduce a CP model for the partial-sum technique for the first time. To show the usefulness and versatility of our approach, we apply it to various designs, from strongly aligned ones like ForkSKINNY and QARMAv2 to weakly aligned ones such as Ascon and PRESENT, yielding significantly improved results. To mention a few of our results, we improve the integral distinguisher of QARMAv2-128 (resp. QARMAv2-64) by 7 (resp. 5) rounds, and the integral distinguisher of ForkSKINNY by 1 round, only thanks to our cell-wise distinguisher modelings. By using our new bit-wise modeling, our tool can find a group of 2155 5-round ID and ZC distinguishers for Ascon in only one run, taking a few minutes on a regular laptop. The new CP model for the partial-sum technique enhances integral attacks on all SKINNY variants, notably improving the best attack on SKINNY-n-n in the single-key setting by 1 round. We also enhance ID attacks on ForkSKINNY and provide the first analysis of this cipher in a limited reduced-round setting. Our methods are generic and applicable to other block ciphers.
Constructing Committing and Leakage-Resilient Authenticated Encryption
Authors: Struck Patrick , Weishäupl Maximiliane
Published: March 2024

The main goal of this work is to construct authenticated encryption (AE) hat is both committing and leakage-resilient. As a first approach for this we consider generic composition as a well-known method for constructing AE schemes. While the leakage resilience of generic composition schemes has already been analyzed by Barwell et al. (Asiacrypt’17), for committing security this is not the case. We fill this gap by providing a separate analysis of the generic composition paradigms with respect to committing security, giving both positive and negative results: By means of a concrete attack, we show that Encrypt-then-MAC is not committing. Furthermore, we prove that Encrypt-and-MAC is committing, given that the underlying schemes satisfy security notions we introduce for this purpose. We later prove these new notions achievable by providing schemes that satisfy them. MAC-then-Encrypt turns out to be more difficult due to the fact that the tag is not outputted alongside the ciphertext as it is done for the other two composition methods. Nevertheless, we give a detailed heuristic analysis of MAC-then-Encrypt with respect to committing security, leaving a definite result as an open task for future work. Our results, in combination with the fact that only Encrypt-then-MAC yields leakage-resilient AE schemes, show that one cannot obtain AE schemes that are both committing and leakage-resilient via generic composition. As a second approach for constructing committing and leakage-resilient AE, we develop a generic transformation that turns an arbitrary AE scheme into one that fulfills both properties. The transformation relies on a keyed function that is both binding, i.e., it is hard to find key-input pairs that result in the same output, and leakage-resilient pseudorandom.