bluuebunny/crossref_metadata_2025 huggingface dataset:
Playing Checkers with Machines—from Ajeeb to Chinook
Authors: Kidwell Peggy Aldrich
Published: October 2015

Chess-playing automata that also played checkers were built in Europe from the late eighteenth century. One of these, named Ajeeb, came to the United States, spending much of the time from 1885 into the 1930s in New York and taking occasional tours around the country. The advent of electronic computers in the mid-1940s encouraged attempts to play games using machines in both Britain and the United States. By the late twentieth century, a Canadian-written computer program, Chinook, had defeated world champion and mathematician Marion Tinsley. More recently, developers of Chinook announced that checkers could be played to a draw against any opening.
Misunderstanding the Mongols: Intercultural Communication in Three Thirteenth-Century Franciscan Travel Accounts
Authors: Montalbano Kathryn A.
Published: October 2015

This article shows how the travel accounts of three thirteenth-century Franciscanfriarsprovideawindowintointercultural communications of the medieval world. The three accounts were written by John of Plano Carpini (1245–47), William of Rubruck(1253–55), and John of Montecorvino (1289). Each of the friars traveled from Europe to the Mongol Empire. The article has two themes: first, how the friars’ encounters with new lands, peoples, and cultures prompted them to reconsider, but ultimately not recast, their vocational identities; second, how their participation in long-distance networks reinforced their assumptions about Christianity and human nature.
Sound Information: Sonification in the Age of Complex Data and Digital Audio
Authors: Supper Alexandra
Published: October 2015

In recent years, sonification—the auditory display of data—has received increasing media attention and been presented as a solution to the challenges posed by large, complex datasets. By analyzing the development of the sonification research community, this article shows that specific historical configurations have led the community to concentrate on technical solutions for the design of sonification technology rather than on analyzing and interpreting sonified data. Consequently, sonification still struggles for scientific acceptance and does not offer any ready-made solutions to the problems posed by complex data; indeed, it echoes, rather than solves, these problems.
The Politics of Sequence: Data Sharing and the Open Source Software Movement
Authors: Stevens Hallam
Published: October 2015

The Bermuda Principles (1996) have been celebrated as a landmark for data sharing and open science. However, the form that data sharing took in genomics was a result of specific technological practices. Biologists developed and adopted technologies of the nascent World Wide Web and Free and Open Source Software (FOSS) communities for sharing biological information. These technologies supported decentralized, collaborative, and nonproprietary modes of production in biology. Such technologies were appealing not merely because they were expedient for genomic work but because they also offered a way of promoting a particular form of genomic practice. As the genome sequencing centers scaled up their sharing efforts, a small group of computer-savvy biologists used these tools to promote the interests of the public genome sequencing effort. The agreements at Bermuda should be understood as part of this attempt to foster a particular form of genomic work.
Atlanta between the Wars: The Creation of the Georgia Department of Archives and History, 1918–1936
Authors: Trace Ciaran B.
Published: October 2015

Building on prior work that has examined the formation of southern archives and memory as a form of political endeavor, this article examines the life and early career of Georgia archivist Ruth Blair, first female director of the Georgia Department of Archives and History. Her life story is used as a lens through which to examine the contribution of southern women to the establishment of state archival agencies and in doing so looks at the role of women in the workplace in the first half of the twentieth century, specifically the entry of women into the information professions.
Antoine Monnier disciple de Baudelaire et de Méryon
Authors: Hubert Judd D.
Published: October 2015

Starving artist, poète maudit and engraver Antoine Monnier was born in Lyon in 1846. His “livre d’artiste” entitled Eaux-fortes et rêves creux: sonnets excentriques et poëmes étranges , illustrated with his etchings, appeared in 1873, a year before the publication of the first “livre de peintre”: Le Fleuve by Manet and Cros. A brief presentation of Eaux-fortes, Le Haschisch: contes en prose, sonnets et poëmes fantaisistes (1877) and Ève et ses incarnations: sonnets et eaux-fortes (1878) will show that the richness of Monnier’s work extends well beyond his debt to Baudelaire and Méryon and, as such, is worthy of further study. (In French)
Now You See It, Now You Don’t: Baudelaire’s Modernité
Authors: Newmark Kevin
Published: October 2015

The concept of modernity remains a crux for literary studies because it attempts to combine historical categories with principles of form. Modernity refers to a moment of change: change in history and change in aesthetic forms indissociable from it. This essay examines the privileged case of Baudelaire, where a reflection on modernity—“Le Peintre de la vie moderne”—is doubled by writings regularly taken as examples of modernity—especially Les Fleurs du Mal and Le Spleen de Paris . Is it possible to identify the formal element in Baudelaire’s writing that distinguishes it as “modern”? After juxtaposing the incompatible responses offered by Paul Valéry and Walter Benjamin, the essay considers “Le Thyrse” as a particular case in point. The reading discloses how only a radically “prosaic” element—though one equally at work in the verse and prose poetry—could prove adequate to a “modernity” at one and the same time poetic and historical.
Re-Orienting the fête galante in Mallarmé’s éventails
Authors: Edgington Erin E.
Published: October 2015

This article situates Mallarmé’s éventails within the fête galante tradition pioneered by Watteau and identifies a link between the neo-rococo and japoniste aesthetics in these poems. It begins by identifying the folding fan’s unique position at the boundary of the two styles within a discussion of Mallarmé’s fashion writing in La Dernière Mode . It moves on to consider in detail a number of the shorter, little-studied éventails of the Vers de circonstance focusing on the ways in which they engage with both aesthetics via neo-rococo textual imagery and japoniste paratextual imagery before concluding with a brief comparison of Mallarmé’s éventails with Verlaine’s Fêtes galantes that underlines the novelty of Mallarmé’s approach to the genre. Throughout, it references the rich visual tradition of the fête galante including some of Watteau’s painted works as well as some of the fans upon which Mallarmé inscribed his verse.
Réintroduction à la littérature fantastique : Enlightenment Philosophy, Object-Oriented Ontology, and the French Fantastic
Authors: Cropper Corry
Published: October 2015

Studies of the fantastic and attempts to define the fantastic as a genre have always presupposed a human-centered ontology. But the anthropocentric hierarchies of Enlightenment thought, embodied by the philosophy of Immanuel Kant, are precisely what the fantastic seeks to undermine. The fantastic posits a flat ontology where humans and objects stand on equal ground, where objects act, and where human subjects are frequently objectified. After tracing a line from Kant to Théophile Gautier through E. T. A. Hoffmann, this article considers other fantastic narratives by Mérimée and Maupassant to suggest how the fantastic undermines an Enlightenment human-centered worldview while theorizing the hidden life of things. This reading leads us to tentatively redefine the fantastic as a form of speculative realism, as a genre that takes the presence and perspective of objects seriously and that embeds this object-oriented ontology into the texts in ways that trouble the reader’s subject-centered consciousness.
The Romantic Myth of Jean-Gaspard Deburau
Authors: Nye Edward
Published: October 2015

Jean-Gaspard Deburau is renowned for being the greatest and most influential mime artist before Marcel Marceau (who himself was influenced by Deburau) in the twentieth century. Such was his standing in the 1830s and 1840s that a veritable myth was created around him, which has persisted ever since (for example, in the legendary French film Les Enfants du paradis ). The contemporary discourse on Deburau was, to some extent, a constructed discourse intended to turn him into a symbol of certain Romantic ideals. In order to understand the myth of Deburau and his theatre, Le Théâtre des Funambules, I summarize the qualities which contemporaries so admired in his Pierrot role, and then consider some of them in the light of four Romantic topoï: nostalgia for the Commedia dell’arte, the image of the working-class artist, of the Bohemian artist, and of the sick artist.
L’Affaire Lerouge : Nineteenth-Century Juries and the Violence of Authorship
Authors: Lee Susanna
Published: October 2015

This article examines the connection between legal judgment and authorship in Émile Gaboriau’s 1865 detective novel L’Affaire Lerouge , focusing on the figure of the jury as reader and writer of the accused. Demonstrating that the materiality of the word can be at once elusive and inexorable, as Madame Bovary had underscored, Lerouge expresses unspoken anxiety about narrative creation and about vulnerability to a human author—anxiety that fuses law to literature and realism to judgment. The novel consistently deploys the vocabulary of narrative creation, noting that the jury must decide between the prosecution’s thèse and the defense’s roman and casting narrative intent as inherently destructive. The article also examines nineteenth-century complaints that juries were unreliable and slow to convict—complaints that often centered on the jurors’ relationship to literature, describing them either as too fond of melodramatic literature and thus devoid of critical judgment, or as illiterate and thus too stupid to distinguish guilt from innocence.
Sex Education: Obscenity, Romanticism, and Creativity in Flaubert’s letters from the Voyage en Égypte and L’Éducation sentimentale
Authors: Rexer Raisa
Published: October 2015

This article re-examines the significance of the Orient in two texts by Flaubert, his letters from the Voyage en Égypte and the novel L’Éducation sentimentale . It argues that Flaubert’s confrontation with the Orient in his letters is structured by two intertwined preoccupations: sexual excess and creative failure. For Flaubert, the symbolic power that the Orient acquires over the course of his voyage lies in the pairing of these two preoccupations as they represent two possible principles of artistic production: obscenity and Romanticism. The Orient in turn becomes a privileged metaphorical space in L’Éducation sentimentale because the novel attempts to mediate the same tension between the creative potential of pornographic sexuality and the artistic disappointments of Romanticized sentiment, re-written on the historical scale of the Romantic generation. Reconsidered as an aesthetic principle in this way, the Orient offers us a new perspective on how Flaubert grappled with the nature of artistic inspiration and the artist’s relationship to society.
An investigation of the coefficient of variation using voltage clamps techniques
Authors: Khudhur Ahmed Mahmood , Abdalla Ahmed N , Zain Jasni Mohamad , Tao Hai
Published: October 2015

In recent years, it has been argued and experimentally shown that ion channel noise in neurons can have profound effects on the neuronâ€™s dynamical behavior. Most profoundly, ion channel noise was seen to be able to cause spontaneous firing and stochastic resonance. It has been recently found that a non-trivially persistent cross correlation takes place between the transmembrane voltage fluctuations and the component of open channel fluctuations attributed to gate multiplicity. This non-trivial phenomenon was found to play a major augmentative role for the elevation of excitability and spontaneous firing in the small size cell. In addition, the same phenomenon was found to significantly enhance the spike coherence. In this paper, statistics of the coefficient of variation, to be obtained from the colored stochastic Hodgkin-Huxley equations using voltage clamps techniqueswill be studied. The simulation result shows the coefficient of variation; enhance the agreement with the microscopeinthe case of the noisy currents.
Education premiums and skilled migration: Lessons for an educational policy
Authors: Tigau Camelia , Bolaños Guerra Bernardo
Published: October 2015

This paper examines the relationship between skills prices (wage premiums) and inequality in migrant sending countries (mainly from Latin America) and explores the implications for education policies. Most of the evidence is based on the case of Mexico, a Latin American country that is also an Organisation for Economic Co‑operation and Development (OECD) member. Despite the belief that Latin American countries tend to pay less for their skilled workers than developed countries, they invest a considerable amount of their Gross Domestic Product (GDP) in education and sometimes in scholarships abroad. Therefore, our main question is: Are skill prices really so proportionately low in Latin America?  Likewise, what are the impacts of skills prices on migration in Latin America, and Mexico in particular? And, what is the importance of “brain drain” in terms of the relationship between migration and education? We find that despite the enormous inequality in the region, skills prices are not low. Furthermore, high expenditures on education combined with low skills prices do not necessarily result in brain drain. Other factors, such as perceptions of insecurity and corruption, have a stronger effect on the migration of Mexican professionals. Likewise, although high skills prices may lead to economic development, they may also increase social inequality, leading to greater brain drain. Therefore, the expansion of higher education is recommendable even if it reduces salaries and wage premiums in the short term.
Butterflies (Lepidoptera: Papilionoidea) of grassland areas in the Pampa biome, southern Brazil
Authors: Dos Santos de Carvalho Ana Paula , Piovesan Geisa , Barros de Morais Ana Beatriz
Published: October 2015

The temperate and subtropical grassland ecosystems are among the most threatened ecosystems in the world due to habitat loss. This study aimed to make a list of butterfly species present in native grassland fields in the city of Santa Maria, southern Brazil. The sampling field effort was 225 h using entomological nets, from 2009 to 2011. In total, 117 species of butterflies were recorded, distributed in six families and 18 subfamilies. Nymphalidae was the richest family, with 56 species, while Lycaenidae was the least rich family, with six species. Twenty species constitute new records for Santa Maria; while six of those are new records for the Central Depression Region of Rio Grande do Sul. In the face of global and local threats, it is urgent to increase efforts to study the biology and ecology of the grassland communities in order to provide support to biological conservation.
Коммуникационное влияние на современные социальные изменения
Authors: Макаревич Эдуард Федорович
Published: October 2015

В статье анализируется феномен коммуникационной культуры, которая стала движущей силой социальных изменений. Рассматриваются особенности современной информационной среды, механизм коммуникационного влияния. 
13-й Международный научный семинар «Математические модели и моделирование в лазерно-плазменных процессах & передовых научных технологиях» (LPPM3-2015)
Authors: Мажукин Владимир Иванович
Published: October 2015

В статье сделан обзор работы 13-го Международного междисциплинарного научного семинара «Математические модели и моделирование в лазерно-плазменных процессах & Передовых научных технологиях» (LPPM3-2015), который состоялся с 30 мая по 6 июня 2015 г. в городе Петровац (Черногория).
Деятельность молодых волонтеров в современной России
Authors: Бурцев Сергей Петрович , Дворянцева Юлия Михайловна
Published: October 2015

В статье анализируется молодежное волонтерское движение в России; дается характеристика его участникам; описываются причины и побудительные мотивы вовлечения молодых людей в этот процесс, выявляются позитивные и негативные эффекты деятельности волонтеров.     
К вопросу о распространении христианства среди кочевых народов южнорусских степей в домонгольское время
Authors: Инков Александр Александрович
Published: October 2015

В статье рассматриваются отдельные аспекты распространения христианства среди кочевников южнорусской степи в XI — начале XIII в.
Дипломатические учебные заведения в России (исторический очерк)
Authors: Сидоров Иван Вадимович
Published: October 2015

В статье по разнообразным источникам прослеживается история специализированного дипломатического образования в России. При этом автор стремился выявить в этом процессе идейно-ценностные установки российской власти в отношении внешней политики страны и тех, кто ее осуществлял в разные эпохи, успехи и неудачи российского образования в целом.
Русская традиционная танцевальная культура: истоки и современность
Authors: Чистякова Анастасия Александровна
Published: October 2015

В статье анализируется тема возникновения русской традиционной танцевальной культуры, которая ведет отсчет от русского плясового фольклора. Отмечается, что традиционная народная пляска — это особая форма выражения чувств и сознания человека; способ национального самовыражения, коллективного творчества.
Семантика неопределенности в рассказе А. П. Чехова «Попрыгунья»
Authors: Ясинская Милена Борисовна
Published: October 2015

В статье анализируются способы выражения семантики неопределённости в тексте рассказа А. П. Чехова «Попрыгунья»;  определяется интенциональная направленность текста и восприятие его реципиентом. 
Международная междисциплинарная научно-практическая конференция «Роль факта и воображения в конструировании художественных и виртуальных миров шекспировской Англии»
Authors: Шустова Елена Алексеевна
Published: October 2015

В статье сделан обзор работы Международной междисциплинарной научно-практической конференции «Роль факта и воображения в конструировании художественных и виртуальных миров шекспировской Англии», которая проходила 25–26 июня 2015 г. в Московском гуманитарном университете.
Solano Constâncio e Soares Barbosa: embates gramaticais
Authors: Molina Márcia Antonia Guedes
Published: October 2015

RESUMO:

O último quartel do século XIX deu-se, no Brasil, o que Auroux (1989) chama de gramatização, ou seja, foram lançadas gramáticas feitas por brasileiros, umas filiadas aos preceitos das de inspiração filosófica, outras, das seguidoras do modelo Histórico-Comparativo. Essas duas maneiras de se conceberem os estudos gramaticais geravam polêmicas, como a havida entre Rui Barbosa e Ernesto Carneiro Ribeiro. Nosso objetivo neste trabalho foi analisar as provocações a Soares Barbosa, feitas por Solano Constâncio em sua gramática, em especial, na Etimologia. Ao final das análises, apoiadas na História das Ideias Linguísticas e na História Cultural, percebemos que as críticas deram-se, sobretudo, em virtude de suas filiações.

PALAVRAS-CHAVE:

Século XIX - Gramáticas - Francisco Solano Constâncio - Jerônimo Soares Barbosa – Embates
O verbo na tradição gramatical brasileira
Authors: Fávero Leonor Lopes
Published: October 2015

RESUMO:

O trabalho examina o verbo na produção gramatical brasileira do século XIX, à luz da História das Idéias Lingüísticas, lembrando que pesquisadores, apesar da dificuldade ou mesmo impossibilidade de uma partição rígida, reconhecem dois momentos na produção gramatical brasileira do século: um sob a égide da gramática geral e filosófica e outro, a partir de 1881, com a publicação da Gramática portuguesa de Júlio Ribeiro. Ao final do trabalho podemos dizer que as obras publicadas até 1881 foram marcadas exclusivamente pelos pressupostos da gramática geral e filosófica e , no caso de nosso objeto de análise – o verbo – predominantemente, pela utilização de critérios semânticos.

PALAVRAS-CHAVE:

Gramáticas - Século XIX - Verbo
Apresentação
Authors: Cavaliere Ricardo
Published: October 2015

.
Os advérbios de lugar no tesoro de covarrubias (1611)
Authors: Henríquez Salido Maria do Carmo
Published: October 2015

RESUMO:

Neste artigo apresenta-se uma nota biográfica sobre “o primeiro grande tesoureiro do idioma” e alguns dados da obra analisada (o objetivo primordial, as fontes, os múltiplos campos do saber e a ingente erudição). Comentam-se as confusões e dificuldades evidentes na história da lingüística, no que diz respeito a se uma mesma forma lingüística devia estar no inventário dos advérbios, no das preposições ou nas duas categorias, pois que sob o rótulo advérbio se incluem palavras difíceis de classificar. Estudam-se os advérbios de lugar, a partir das fontes conhecidas pelo autor (nomeadamente NEBRIJA): os advérbios demonstrativos (acá/ allá/ acullá...), de natureza referencial, e os advérbios de direção, que indicam o lugar onde alguém está, distribuídos em pares de antônimos (delante/ detrás...).

PALAVRAS-CHAVE:

historiografia lingüística; lexicografia; classes de palavras; advérbios
A “Grammatica Brasileira” do século XIX
Authors: Leite Marli Quadros
Published: October 2015

RESUMO:

O foco deste texto é o exame de uma gramática brasileira do século XIX, Grammatica brasileira ou arte de falar, conforme as regras de Manuel Borges Carneiro, de autor anônimo. Os objetivos da pesquisa são: i) verificar se a variedade brasileira da língua portuguesa é objeto de análise na obra; ii) investigar pistas que levem a seu provável autor. A busca pela resposta ao problema desta pesquisa funda-se em princípios da História das ideias linguísticas, tais como gramatização e horizonte de retrospecção (Auroux 1992, 2006, 2007), pelos quais verificaremos se Luís Maria da Silva Pinto, autor do Dicionário da língua brasileira (1832), é também o autor dessa gramática, cuja denominação refere o local de origem da obra, mas ela, em si, não traz dados linguísticos que caracterizam o português do Brasil.

PALAVRAS-CHAVE:

gramática brasileira, horizonte de retrospecção, gramatização, língua portuguesa, história das ideias linguísticas, historiografia linguística.
Olhares sobre a língua nacional no Brasil independente
Authors: Brito Regina Pires , Marcondes Carvalho Vasconcelos Maria Lucia
Published: October 2015

RESUMO:
A consciência da diversidade linguística no âmbito dos países lusófonos vem sendo debatida tanto por filólogos e linguistas quanto por vários escritores. No entanto, essa discussão encontra respaldo no pós-colonialismo, marcado, dentre outros fatores, pela preocupação, nas ex-colônias, com o uso da variedade transplantada pela metrópole europeia e com o estabelecimento da “identidade” da língua nacional. No Brasil, esse movimento fortaleceu-se com o Romantismo, com manifestações a respeito da necessidade de se afirmar a nossa brasilidade, referindo-se ao “idioma”, “dialeto” ou “língua brasileira”. Destaque-se que na segunda metade do século XIX, tendo a maioria das “colônias” da América se tornado república, há uma tomada de consciência sobre as condições de nação e sobre a necessidade de afirmação da variedade americana de sua língua européia. Neste artigo, recorrendo-se a dados históricos e historiográficos, recuperam-se dados do período em que se tem um embate entre a obediência às normas vindas de Portugal e o sentimento de nacionalidade do brasileiro, que já se manifestava linguisticamente com muitas particularidades.

PALAVRAS-CHAVE:
história da língua portuguesa, brasilidade, variação linguística, estudos lusófonos
A primeira descrição da língua portuguesa na Alemanha: o Hexaglotton (1762) de Ignaz Weitenauer (1709-1783)
Authors: Kemmler Rolf , Coelho Sónia , Fontes Susana
Published: October 2015

RESUMO:

O presente artigo oferece uma introdução às “Institutiones lusitanicæ”, que constituem uma das seis partes da gramática poliglota Hexaglotton alterum, docens linguas anglicam, germanicam, belgicam, latinam, lusitanicam, et syriacam, ut intra brevissimum tempus ope lexici libros explicare discas (1762) do jesuíta alemão Ignaz Weitenauer. Na brevidade de umas 28 páginas, o pequeno tratado metalinguístico visa apresentar o português como língua estrangeira a um público germanófono, sendo, com efeito, a primeira obra metalinguística dedicada ao português dentro daquele espaço linguístico.

PALAVRAS-CHAVE:

Historiografia linguística; Português como língua estrangeira; Ignaz Weitenauer; Companhia de Jesus; Língua portuguesa
The Self-as-Entertainment Personality Construct: Validation and Application in the Hospitality Context
Authors: Ko Dong-Woo , Kim Byung-Gook
Published: October 2015

We examined the validity and applicability of the self-as-entertainment (SAE) personality construct in the context of the hospitality industry. Participants were 309 employees at 4-star hotels in the southern region of China. Findings indicated that the 3 dimensions of the SAE construct
(environment, mind play, and self) showed acceptable measurement properties and a reasonable fit. SAE–environment had a positive and significant effect on hotel employees' organizational commitment; however, the relationships between organizational commitment and SAE–mind play
and between organizational commitment and SAE–self were not significant in this study. Further, SAE–environment and SAE–self were significantly and positively related to hotel employees' service orientation. Future researchers should extend our study to other locations to
reveal a more stable view of the SAE construct, and should also investigate the complex nature of hospitality employees' work environments.
Implementing Fringing Field Sensors in PCB Technology
Authors: Dean Robert , Rane Aditi , Stevens Colin , Baginski Michael , Hartzog Zane , Elton David
Published: October 2015

Interdigitated electrode structures are well suited for realizing capacitors where a significant percentage of the total capacitance in due to the out of plane fringing fields. An object that interferes with the fringing fields will then change the measurable capacitance between the electrodes. Therefore this configuration can be used as a sensor for the object that interferes with the fringing fields and is called a capacitive fringing field sensor. These types of sensors have been used in many applications, such as water detection, moisture content measurement and as proximity switches.

Printed circuit board (PCB) technology is particularly useful for realizing this type of sensor architecture. The interdigitated electrode structures can be patterned in the Cu cladding on one or both sides of the substrate. The solder mask coating can then be used to insulate the electrodes to prevent shorting in the presence of water or other conductive substances. The size and spacing of the electrode structures can be optimized to adjust the sensitivity of the sensor to the measurand of interest. The implementation of this type of sensor in PCB technology has several advantages when compared to traditional MEMS technologies. External electronics can readily be attached to the PCB substrate. Very large sensor panels can be manufactured easily and economically. Other types of MEMS sensors have been implemented in PCB technology in recent years. This sensor is compatible with those types of sensors and could be used to augment sensor suites implemented in PCB MEMS technology. Demonstration prototype fringing field sensors were implemented in PCB technology for measuring the mass of small quantities of water, for measuring soil moisture content and for use as capacitive touch switches.
PCBMEMS as a Flexible Path to Devices and Systems across Spatial Scales
Authors: Fries David P. , Ivanov Stanislav Z. , Broadbent Heather , Smith Matthew , Steimle George , Willoughby Ross
Published: October 2015

PCBMEMS, within rigid or flexible laminates is desirable for miniaturization of devices and systems and provide substantial flexibility in systems design. PCBMEMS is the combined insertion of mechanical, fluidic, optical and electronic functions into the PCB landscape, which permits a complex system on a board. This design, fabrication and construction approach allows lightweight, complex, and space efficient systems. PCBMEMS permits miniaturization to occur at two levels: at the micro scale with the embedding of microstructures in the substrate, and at the macro scale with the ability to flex the system across millimeter to centimeter lengths of real everyday objects. Using this path PCBMEMS can approach the creativity and complexity of natural made systems. The use of PCBMEMS can also provide a path toward ultra large systems with high resolution features. With the ability to provide from the very small to the very large, PCBMEMS has a unique place in systems development in that the same processing pathway can enable Microsystems and macro systems. Examples will be given where the technology has enabled devices, systems and packaging innovation across several spatial scales. Environmental, medical, portable, embedded, and sensor systems all can be realized using this design and fabrication toolbox. The approach is affordable and can be used from prototyping to production and even in educational efforts.
Electrolytic Solder Deposit for Next Generation Flip Chip Solder Bumping
Authors: Kenny Stephen , Lamprecht Sven , Matejat Kai , Roelfs Bernd
Published: October 2015

Electrolytic Solder Deposit for Current methods for the formation of pre-solder bumps for flip chip attachment use stencil printing techniques with an appropriate solder paste. The continuing trend towards increasing miniaturisation and the associated decrease in size of solder resist opening, SRO is causing production difficulties with the stencil printing process. Practical experience of production yields has shown that stencil printing will not be able to meet future requirements for solder bump pitch production below 0.15 mm for these applications.

This paper describes a novel approach to replace the stencil printing process by use of an electrolytic deposition of solder. In contrast to stencil printing, use of electrolytic deposition techniques allows production of solder bumps with a pitch below 0.15 mm and with a SRO below 80 μm.

Methods for production of electrolytic solder bumps based on pure tin as well as alloys of tin/copper and also tin/silver are shown and in particular a method to control the alloy concentration of electroplated tin/copper bumps. Test results with both alloy systems and also pure tin bumping are presented together with comparison of the advantages and disadvantages.

The general advantages of replacement of stencil printing by electrolytic deposition of solder bumps are shown and in particular the improvement of bump reliability and the potential to significantly decrease costs by yield improvement.
No Flow Underfill Process Development for Fine Pitch Flip Chip Silicon to Silicon Wafer Level Integration
Authors: Li Zhaozhi , Evans John L. , Houston Paul N. , Lewis Brian J. , Baldwin Daniel F. , Lee Sangil , Tessier Theodore G. , Stout Eugene A.
Published: October 2015

The industry has witnessed the adoption of flip chip for its low cost, small form factor, high performance and great I/O flexibility. As the Three Dimensional (3D) packaging technology moves to the forefront, the flip chip to wafer integration, which is also a silicon to silicon assembly, is gaining more and more popularity.

Most flip chip packages require underfill to overcome the CTE mismatch between the die and substrate. Although the flip chip to wafer assembly is a silicon to silicon integration, the underfill is necessary to overcome the Z-axis thermal expansion as well as the mechanical impact stresses that occur during shipping and handling. No flow underfill is of special interest for the wafer level flip chip assembly as it can dramatically reduce the process time as well as bring down the average package cost since there is a reduction in the number of process steps and the dispenser and cure oven that would be necessary for the standard capillary underfill process.

Chip floating and underfill outgassing are the most problematic issues that are associated with no flow underfill applications. The chip floating is normally associated with the size/thickness of the die and volume of the underfill dispensed. The outgassing of the no flow underfill is often induced by the reflow profile used to form the solder joint. In this paper, both issues will be addressed. A very thin, fine pitch flip chip and 2x2 Wafer Level CSP tiles are used to mimic the assembly process at the wafer level. A chip floating model will be developed in this application to understand the chip floating mechanism and define the optimal no flow underfill volume needed for the process. Different reflow profiles will be studied to reduce the underfill voiding as well as improve the processing yield.

The no flow assembly process developed in this paper will help the industry understand better the chip floating and voiding issues regarding the no flow underfill applications. A stable, high yield, fine pitch flip chip no flow underfill assembly process that will be developed will be a very promising wafer level assembly technique in terms of reducing the assembly cost and improving the throughput.
Stacking of Known Good Rebuilt Wafers without TSV - Applications to Memories and SiP
Authors: Val Christian , Couderc Pascal , Lartigues Pierre
Published: October 2015

The 3-D interconnection started at 3D PLUS in 1996 and led to the stacking of nearly all types of analogical and logical components, sensors, MEMS, etc for the Hi-Rel field (Space, Defence, Medical, Industrial).

This technology is extremely robust (−130°C +175°C, 40000g), and is fully qualified by all worldwide most important Space Agencies and for Defence applications.

A technological break started in 2002 ; It consisted in another 20 to 30 reduction factor of the weight and volume of these 3-D modules.The Z pitch is 100μm and the X Y size is given by the size of the larger die plus 100μm of polymer around it.

This is a stacked of Known Good Rebuilt Wafer of full wafer level technique.

The dice are received in wafers and following operations are carried out :- Pick, flip and place of the good dice on a “sticking skin”- Moulding of the whole of this « pseudo wafer » in order to obtain what we call a « Known Good Rebuilt Wafer (KGRW) ».

These two first steps are already developed by Infineon and mainly Freescale (RCP technique up to 300mm)- Stacking and gluing of KGRW 1, 2, 3…, n, by means of an adhesive film- Dicing of these stacked rebuilt wafers by techniques identical to the dicing of standard wafers- Metallization of the dicing streets with nickel + gold by electroless chemical plating identical to the UBM plating technique- Direct laser patterning by laser with our edge connection technique up to 100μm pitch. Below this pitch, the Thru Polymer Via (TPV) are made through the stacked wafers. The equivalent pitch will be 20μm. it can be noticed that the shielding can be made on the dicing street.- Electrical test at the stacked wafer level- Singulation of the 3D modules

This approach allows using standard dice without any modification.

It is multi sources and the stacking of the good rebuilt wafers allows to get an excellent yield.

A development agreement has been signed with a semiconductors manufacturer.

A development is in progress with the most worldwide important manufacturer of smart cards in order to integrate 5 levels of dice (including a MEMS) within a cavity of 550 μm inside the 800μm SIM card.

Other applications with MEMS will be presented:- “Abandoned Sensors” for Heath Monitoring of the aircraft structure developed during the European Program: “e-Cubes” ,- Gyroscope with 6 MEMS,- Micro camera for endoscopy…- Medical applications with an important development made for 3 major pacemaker manufacturers.

This « full wafer level » approach will allow to build System in Package (SiP) or “Abandoned Sensors” at very low costs, since the process uses mainly the steps of wafers building; the “panelization” allows to be in parallel processing from A to Z steps. Moreover, the use of Known Good Rebuilt Wafer like the RCP allows stacking Good wafer at the reverse what is impossible with the wafer to wafer approach.
Integration of Electrografted Layers for the Metallization of Deep TSVs
Authors: Truzzi Claudio , Raynal F. , Mevellec V. , Frederich N. , Suhr D. , Bispo I. , Couturier B.
Published: October 2015

Electrografting (eG) is a molecular engineering technology delivering high-quality films for Through Silicon Vias (TSVs). It generates surface-initiated conformal films which are thin, continuous, adherent and uniform. It is a wet-process technique, operated in standard plating tools, and is used on (semi)-conductive surfaces.

Chemical grafting (cG) is a similar technology, used to graft films on non-conductive surfaces. A wet deposition of insulator, barrier and copper seed layers inside deep TSVs using a combination of electrografting and chemical grafting techniques has already been demonstrated [1, 2].

Electrografting and chemical grafting formulations and processes have been developed and specifically tailored for TSV diameters ranging from 1 to 200 μm, covering a depth/diameter Aspect Ratio (AR) range from 2:1 to 20:1. Film thickness can be controlled to any value from 50nm to few microns, depending on the layer, with 5% 3ó in-wafer non-uniformity, providing a step coverage (bottom/top thickness ratio) value of up to 90%. Adhesion of all layers is measured using a 16-square scribe tape test method: all layers successfully pass the test.

The presentation will focus on film properties and show how TSV formed using these layers meet all key process requirements such as conformality, uniformity, adhesion, reliability and industrial compatibility for cost-effective high volume manufacturing of TSV wafers. A comprehensive set of film properties and reliability data characterized on blanket and pattern 200-mm Si wafers will be discussed. Integration schemes of electrografted layers within current 3D packaging process flows will be presented.
Localized Parylene-C Bonding for Micro Packaging and Cell Encapsulation using Reactive Multilayer Foils
Authors: Qiu Xiaotun , Welch David , Christen Jennifer Blain , Tang Rui , Zhu Jie , Oiler Jonathon , Yu Cunjiang , Wang Ziyu , Yu Hongyu
Published: October 2015

This abstract described a novel physiologically compatible wafer bonding technique for bio-microelectromechnical systems (bio-MEMS) packaging. Room temperature bonding was performed between Parylene-C and silicon wafers with a thin Parylene-C coating using reactive Ni/Al multilayer foils as localized heaters. Live NIH 3T3 mouse fibroblast cells were encapsulated in the package and they survived the bonding process owing to the localization of heating. A numerical model was developed to predict the temperature evolutions in the parylene layers, silicon wafer and the encapsulated liquid during the bonding process. The simulation results were in agreement with the cell encapsulation experiment revealing that localized heating occurred in this bonding approach. This study proved the feasibility of reactive multilayer foil bonding technique for broad applications in packaging bio-MEMS and microfluidic systems.
Processing of Lithographically Defined Apex Glass Structures with Smooth and Transparent Sidewalls
Authors: Tantawi Khalid H.M. , Oates Janeczka , Williams John D.
Published: October 2015

We demonstrate a process to improve the surface roughness and optical transparency of the sidewalls of structures made in ApexTM photosensitive glass. Improved sidewall roughness is achieved through a post- etch anneal that reflows the surface of the glass microstructure and reduces the size of roughened glass nodules on the HF etched surface. The same anneal process is equally suited for bonding between substrates as the surface of the glass is melted allowing the glass to reflow across the seam of the bond.

The process involves four basic steps: the glass sample is exposed to mid UV light to photo-activate metallic particles, followed by a two-stage baking process to allow for formation of metallic nanoclusters in the glass matrix. The amorphous glass is then etched in a diluted 3–4% (by volume) HF solution. Finally the glass structure undergoes a post-etch annealing processes at 630°C for 15 min to smoothen the etched surface and enhance the transparency of the glass sidewalls.

The surface roughness obtained was approximately 200  36 nm. The surface roughness prior to post etch annealing was over 1 μm with a standard deviation of 0.4 μm. Thermal loading was observed between structures of varying size at these temperatures. The improvement of transparency in the sidewalls renders the glass structures useful for micro-optical sensors. Future work will investigate the use of this process for the development of visible and near IR microspectrometer curvets.
The Use of Metallographic and SEM Analysis for Characterization of Sidewall Surfaces in MEMS Devices with DRIE Processing
Authors: Levine Lee , Dean Robert , Stevens Colin , Lawrence Samuel
Published: October 2015

The use of Bosch process Deep Reactive Ion Etch (DRIE) processing for manufacturing MEMS and MOEMS devices requiring high aspect ratio (depth/width) trenches has become commonplace. However, process conditions (etch rate, process parameters etc.) have a significant effect on the surface quality of the trench sidewalls. For many device types [1] (grates, waveguides) surface condition of the sidewall can have a large impact on the functionality of the device and therefore must be controlled to achieve performance requirements.

Optical microscopy techniques are not capable of the depth of focus and resolution necessary to adequately control processing within deep trenches where surface roughness of < 10nm may be required. Scanning Electron Microscopy (SEM) is capable of this resolution, but even SEM is incapable of determining surface roughness within the deep trenches. Metallographic techniques, mounting and polishing a sample to reveal a section view through the trench, along with SEM, to image and measure the surface roughness is a requirement.

An experiment was designed, using etch parameters to vary the DRIE recipe, and then cross sectioning and SEM imaging of the devices were performed. The purpose of the experiment was to quantify the effect of the DRIE recipe on the sidewall surface roughness within the trench, and to demonstrate the use of metallographic techniques with SEM to accomplish this goal.
A Parametrically Amplified MEMS Gyroscope
Authors: Gallacher Barry J. , Hu Z. X. , Burdess J. S. , Harish K. M.
Published: October 2015

The applicability of parametric amplification of either the primary and secondary vibration modes of a MEMS gyroscope, shown in Fig.1 is investigated experimentally in this paper. All control schemes have been implemented digitally onto a SHARC DSP development board. Parametric gains in excess of 80, which correspond to multiplication of the Q-factor by a factor of 80, are demonstrated experimentally for open-loop operation of the primary mode and are shown in Fig. 2. For open-loop operation it is shown that amplitude limiting nonlinearities become important as the vibration amplitude increases (see Figs.3) and that parametric amplification in excess of 80 can be only be achieved by further reducing the harmonic forcing amplitude.

In many applications it is desirable to have as high a Q-factor as possible. The rate gyroscope is one application were active control of the Q-factor is extremely pertinent. If applied to the primary mode then it permits reduced forcing levels and hence contamination from “feedthrough”. If applied to the sense mode then the Coriolis force is effectively amplified. Parametric amplification of the secondary mode of the gyroscope is a challenging problem but it has the potential to improve the performance of MEMS rate gyroscope but an order of magnitude.

In operation as a rate gyroscope it is important to maintain the amplitude of the primary mode of vibration at a constant level. For the case of a parametrically amplified primary mode the amplitude control circuit automatically adjusts the parametric excitation parameters to ensure the required parametric gain is achieved whilst at the same time reducing the amplitude of the harmonic forcing. In closed loop parametric amplification of the primary mode by a factor 20 have been demonstrated. Experimental results obtained from the amplified primary mode are shown in Fig.4.
Passive Device Integration from Silicon Technology
Authors: Liu Kai , Lee YongTaek , Kim HyunTai , Kim Gwang , Badakere Guruprasad , Lin Yaojian , Ahn Billy
Published: October 2015

Passive components are indispensible parts used in electronics circuits for various functions, such decoupling, biasing, resonating, filtering, matching, transforming, etc. These passive components can be made on chips, or in PCBs, or in SMDs. SOC (system-on-chip) solutions where all passives are implemented may be long-term goals, but suffer high cost and long development cycle times at the time being. Making passive components embedded inside laminate substrates is limited on passive density. SMD solutions are by far the most popular approaches in the industry, and may still be dominant for some times. Passive components consume 70%–80% area of an electric package in a SiP solution, and therefore it is a great deal to reduce the area of passive components, in order to reduce the size of entire package.

We have developed an IPD (integrated passive device) process from silicon technology to make these passive components of high-Q performance, preferably to be used in RF packages. Low-loss substrate material is used in this process, and thick Cu layer is used for high-Q inductors. From this process, we can make capacitors in 330pF/mm sq density, and the Q-factor is around 30–35 peak for a 3nH–5 nH inductor. Most importantly, the thin-film IPD process has better tolerance control than other commonly available ones, such as PCB and LTCC technologies, which may results in very repeatable electrical performance, and provides packages in high integration. For a passive function block, using BPF (band-pass-filter) as an example, an IPD filter is typically two times smaller in X-Y size and half thinner in Z-height. This makes such IPD very suitable to be integrated in a SiP package. Using some case studies (individual IPD and chip-scale-module-package), we will present how high integration can be achieved, and where are the right spots to use IPD approaches other than SAW, or SMD, or LTCC solutions for RF SiP applications.
RF System-in-Packages: History and Trend
Authors: Liu Kai , Ahn Billy , Strothmann Tom , Lee Yeong , Carson Flynn
Published: October 2015

In the last decade, people have seen tremendous increasing of data transmission speed and data storage capacity, which is mainly attributed to the Moore's law. However, this has little to do with RF devices and RF packages that are often used in the front-ends of wireless communication systems. Making components (e.g., width and spacing) smaller or closer does not necessarily help from RF perspectives, and as a result SoC (System on Chip) products for RF system do not really take off. The things that eventually make RF system evolution are from the concepts of System in Package, which may also include baseband chips and memory chips along with RF chips in a package. Substrate loss and metal loss are the key specifications to be considered for RF packaging. Several substrate technologies (e.g., laminate, LTCC, GaAs, glass, high-resistivity silicon, etc) that are typically used for RF packaging in the industry will be introduced. Some design challenges (e.g., impedance matching, minimizing coupling/cross-talk for high integration packages, etc) will be addressed. A trend for future RF packaging is drawn, based on successful examples of RF packaging in the industry.