bluuebunny/crossref_metadata_2025 huggingface dataset:
Applying the questionnaire-based Implicit Association Test to measure depression
Authors: Dentale Francesco , Stockner Mara , Marchetti Michela , Convertino Gianmarco , Mazzoni Giuliana
Published: August 2022

Tests derived from the implicit social cognition framework allow practitioners to control faking outcomes in clinical and forensic assessments. The questionnaire-based Implicit Association Test (qIAT) is a new assessment technique, based on reaction times in a categorization task of items taken from self-report measures.The aim of this study is (1) to apply the qIAT in measuring depression-related constructs and (2) to assess its vulnerability to faking.Using items derived from the BDI-II scale, two different versions of Depression-qIAT were created and tested for their psychometric properties in two studies (Study 1: 118 participants; Study 2: 71 participants). Internal consistency, convergent validity and criterion validity of the two versions were assessed, also comparing their proneness to faking with that of the BDI-II scale.Results show adequate (but non optimal) internal consistency for both versions of the Depression-qIAT, along with small/moderate correlations with self-report measures of depression, proving their convergent validity. Moreover, in the second study qIAT criterion validity is supported by its significant correlation (with a small/moderate effect size) with self-esteem, life satisfaction and positive affects measures.Finally, both studies demonstrate considerably lower vulnerability to faking in qIAT compared to the BDI-II. Implications for psychological assessment are discussed.
Vaccination intentions during COVID-19 emergency: Correlational research in Italy and Serbia
Authors: di Napoli Francesca
Published: August 2022

The present research illustrates the importance of vaccines and of vaccination intentions, considered as the closest predictor of behaviour in the matter of immunization, in the context of the global COVID-19 pandemic emergency. It analyses the relations between vaccination intentions, the tendency to believe in conspiracy theories, risk perception regarding vaccines, as well as the perception of risk communication in emergency during the pandemic, and trust and perceived change of trust in political and health institutions. Data has been collected from a sample of Italian participants (N = 324) and a sample of Serbian ones (N = 486) with the use of an online questionnaire. The results confirm the hypothesis that sees the concepts of trust, conspiracy ideology, quality of risk communication, and vaccine risk perception as an interconnected mediation pattern that determines intentions to get vaccinated against COVID-19, as well as against other diseases.
Revitalisasi pelaksanaan kegiatan juru pemantau jentik di era pandemi Covid-19 di Kampung Pelita Medika I Kampung Pelita Medika 1 di Kelurahan Meranti Pandak Kota Pekanbaru
Authors: Chandra Fifia , Handayani Handayani , Endriani Rita , Mahadi Andri , Eka P Pivi Yordani , Norlaili Riska , Ahmad Afandi , Bunaya Rizki
Published: August 2022

Pelita Medika 1 Village Meranti Pandak Village is an endemic area for dengue hemorrhagic fever (DHF). This is supported by environmental conditions and community behavior that is at risk for the occurrence of DHF. Therefore, since 2018 in the area, larval monitoring activities have been carried out. Since 2019 it has stopped until now. Therefore, it is necessary to revitalize the implementation of the larva monitoring activities, especially in the current era of the COVID-19 pandemic. Where the purpose of this revitalization is to refresh the knowledge and skills of jumantik cadres in the implementation of larva monitoring and motivate these cadres to commit to carrying out these activities regularly. This activity is carried out through counseling, training, demonstration, and role play methods. The learning media used are using power points for presentations, video playback of larva monitoring activities. This activity resulted in an increase in the knowledge and skills of the jumantik cadres in carrying out larva monitoring, as well as a declaration of commitment to reactivate larva monitoring activities with the 1 house 1 jumantik program.
Morphometrics of Adult Chinese Citrus Fly Bactrocera minax (Enderlein) (Diptera: Tephritidae) in Nepal
Authors: Adhikari D , Thapa R B , Joshi S L , Du J J
Published: August 2022

Morphometric study of adult Chinese citrus fly, Bactrocera minax (Enderlein) was carried out on May, 2020 at Sindhuli, Nepal. The mean body length of female recorded significantly higher, 14.29 ± 0.20 mm, than male, 12.52 ± 0.26 mm, with the mean difference of 1.77 mm (p = ≤ 0.001). Females had a wider body (3.90 ± 0.06 mm) compared to males (3.39 ± 0.05 mm) (p = ≤ 0.001) which differed significantly by 0.51 mm. Adult female possessed a wider wingspan, i.e. 23.51 ± 0.23 mm  significantly different than adult male, i.e. 22.80 ± 0.19 mm with the mean difference of 0.71 mm (p = ≤ 0.05). Similarly, the average wing length measured 8.82 ± 0.13mm in male and 9.05 ± 0.11 mm in female with the mean difference of 0.23 mm. The ovipositor length recorded 4.52 ± 0.12 mm. This information is useful to distinguish between Chinese citrus fly and other fruit fly species of citrus orchards and useful in planning of the suitable management options.
A Take-Home Message "Fall Armyworm Management in Asia and the Pacific Region"
Authors: GC Y D
Published: August 2022

A Take-Home Message "Fall Armyworm Management in Asia and the Pacific Region"- Y.D. GC
‘राइटर बाजे’ कथामा एकाकीपन {Loneliness in 'Writer Baje' Story}
Authors: खतिवडा Khatiwada लेखराज Lekhraj
Published: August 2022

प्रस्तुत अध्ययनकार्य अस्तित्ववादको एक उल्लेखनीय मान्यताका रूपमा रहेको एकाकीपनका आधारमा विश्वेश्वरप्रसादकोइरालाले रचना गरेको ‘राइटर बाजे’ कथाको विश्लेषणमा केन्द्रित छ र त्यसका लागि मुख्य रूपमा व्याख्यात्मक विधिअवलम्बन गरिएको छ । प्रत्येक मान्छेले आपूmलाई यस बिरानो संसारमा नितान्त एक्लै फालिएको अवस्थामा पाउँछ रयस संसारका ऊ एक पृथक् अस्तित्व लिएर मानिसहरूको भिडमा एक्लै बाँचिरहेको हुन्छ अनि एकाकीपनमा नै उसलाईआफ्नो अस्तित्वबोधसमेत हुन्छ भन्ने मान्यता अस्तित्ववादको रहेको छ । अस्तित्ववादको यस मान्यताको अभिव्यक्तिकोइरालाको प्रस्तुत कथामा निकै कुशल ढङ्गमा गरिएको छ । प्रस्तुत कथाकी नायिका भोटिनीले आफ्नो अस्तित्वकोस्वतन्त्रतालाई अक्षुण्ण राख्दै आफ्ना पालनकर्ता राइटर बाजेलाई पतिवरण गरेपछि नारीत्वको सार्थकता अनुभव गर्नुकासाथै एउटी छोरी जन्मेपछि मातृत्वको सार्थकतासमेत अनुभव गर्दै जीवनका पूर्ण सार्थकताको अनुभूति गरेकी भए पनिअचानक छोरीको मृत्यु भई पतिसमेत क्षयरोगका कारण मृत्युशøयामा छटपटाएपछि पतिको उपचारार्थ खर्च जुटाउनवेश्यासमेत बनेकी भए पनि पतिले संसार त्यागेर गएपछि कुष्ठरोग लिँदै एकाकीपनबोध गरेर जीवन बाँच्न बाध्य भएकोदेखाइएको छ । यसबारे खासै अध्ययन नभएकाले यो अध्ययन गरिएको हो । त्यसको अध्ययनका लागि पुस्तकालयीयकार्यद्वारा सामग्री सङ्कलन गरिएको छ र सामग्रीको विश्लेषण वर्णनात्मक, व्याख्यात्मक एवं विवेचनात्मक विधिमागरिएको छ । भोटिनीले एक्लै जीवनमा महŒवपूर्ण निर्णयहरू गर्दै ती निर्णयबाट उत्पन्न परिस्थितिप्रतिको उत्तरदायित्वएक्लै वहन गर्नुका साथै समग्र जीवन एकाकीपनबोध गर्दै बाँच्नुपरेको देखाई प्रस्तुत कथामा अस्तित्ववादको एक मूलभूतमान्यताका रूपमा रहेको एकाकीपनको अभिव्यक्ति निकै प्रभावकारी ढङ्गमा गरिएको छ भन्ने यस अध्ययनको निष्कर्षरहेको छ ।
{It examines the story 'Writer Baje' by Bishweshwar Prasad Koirala on the basis of loneliness, a belief characteristic of existentialism. In this research, the mainly explanatory method has been used. In this strange world, we find ourselves totally alone. In this world, we live alone in a crowd of people, each with their own existence. Simultaneously, existentialism argues that alone, we experience our own sense of existence. This idea of existentialisms expressed quite well in Koirala's story. Bhotini, the protagonist of this story, has discovered the importance of femininity after marrying the writer Baje and maintaining her independence of existence. She has also realized the significance of parenting with the birth of her daughter. She first understood the true meaning of life. Her daughter died unexpectedly, and her husband was also suffering from tuberculosis. She has been unable to raise funds for her husband's medical treatment since he became gravely ill. As a result, she has turned into a prostitute. She was left alone after her husband died. She is afflicted with leprosy. This study has been done as there are not many studies on it. For its study, the material has been collected through library work and the material has been analyzed in descriptive, explanatory, and critical methods. The study concludes that Bhotini makes important decisions in life alone, bearing responsibility for the circumstances arising from those decisions, and living a life of loneliness as a whole.}
अनुराधा : पहिचान र विद्रोह {Anuradha: Identity and Rebellion}
Authors: पन्त ‘प्रतीक्षा’ Panta 'Pratikshya' साधना sadhana
Published: August 2022

विजय मल्लको ‘अनुराधा’ उपन्यासमा पितृसत्तात्मक मूल्य–मान्यताभित्र नारीले झेल्नुपर्ने उत्पीडनको प्रस्तुति गर्नाका साथै सोही उत्पीडनका बिचबाट नायिका अनुराधाको विद्रोह अभिव्यक्त भएको छ । त्यसैले प्रस्तुत लेखमा आमूल नारीवादी सैद्धान्तिक मान्यताअन्तर्गत पहिचान र विद्रोहका आधारहरूको प्रस्तुति गर्दै पितृसत्तात्मक सामाजिक संरचनाभित्र नारीहरूले झेल्ने उत्पीडन तथा त्यसका विरुद्ध उनीहरूले चाहेको पहिचान तथा विद्रोह सम्बन्धी मान्यताको चर्चा गरिएको छ । उपर्युक्त सैद्धान्तिक मान्यताका आधारमा अनुराधा उपन्यासमा प्रयुक्त पितृसत्तात्मक मूल्यभित्र अभिव्यक्त पहिचान र विद्रोहको विश्लेषण गरिएको प्रस्तुत लेखमा मल्लले आफ्नो यस उपन्यासमा नारीउत्पीडन तथा पहिचान र विद्रोहको प्रस्तुतिका माध्यमबाट स्थापित पुरातन मूल्यमान्यतामा परिवर्तन हुनुपर्ने आशय व्यक्त गरेको निष्कर्ष निकालिएको छ ।
{Vijay Malla is a feminist novelist. His novel Anuradha is also analyzable from a feminist perspective. It is structured in a patriarchal social environment. In addition to presenting the oppression that women have to endure within the patriarchal values amid the same oppression, the heroine Anuradha has revolted against the oppression in search of her existence. Although this novel has been analyzed from other angles, it has not been done from a feminist angle. To fill this gap, the present article explores the contexts of identity and rebellion by collecting data from library work and making the feminist theoretical framework the basis of analysis. The data is analyzed in an explanatory and critical method. In this novel, it is concluded that there is a need to change the old values   established through the presentation of women's oppression and identity, and rebellion.}
भाषा र वाक् भाषिक सिद्धान्त साहित्य विश्लेषणको आधार {Language and Speech Theory: The Basis of Literary Analysis}
Authors: शर्मा Sharma सुकुम Sukum
Published: August 2022

ससुरका भाषासम्बन्धी मान्यता भाषा ( Langue ) र वाक् (Parole) का केन्द्रमा रही यस लेखमा साहित्यको अध्ययन, विश्लेषणको एक आधार वा पद्धति निर्माण गरिएको छ । ससुरको मान्यता सामाजिक पक्ष भाषा र वैयक्तिक प्रयोगबोली भन्ने रहेको छ । यस आधारमा रहेर साहित्य सिर्जना या चिन्तनका विश्लेषणका क्रममा सामाजिक पक्ष र  वैयक्तिक पक्षको खोजी गरिएको छ । यसमा भाषालाई सामाजिक पक्ष र बोली वैयक्तिक पक्षका आधारबाट भाषिक व्याख्या गर्दा बनाइएका मान्यता साहित्यका सन्दर्भमा प्रयोग गरी साहित्य सिर्जनाको दार्शनिक आधार र विश्लेषणको स्पष्ट खाका कोरिएको छ । भाषा समाजको आधारभित्र रहेर बोलीका रूपमा मूर्त हुन्छ भन्ने मान्यताबाट आन्तरिक र बाह्य संरचनाको चिन्तनगत परम्परा विकास भएको छ र यो मान्यता साहित्य सिर्जनामा पनि देखिन्छ भन्ने निष्कर्ष यस अध्ययनमा आएको छ । भाषा र वाकको यही सामाजिक र वैयक्तिक पक्षको आधारमा रहेर साहित्यको मूल्यबोधको मार्ग निर्धारण गर्दा साहित्यको आधार पनि समाजसँग जोडिएको हुन्छ र साहित्यिकता समाजको साझा पक्ष हो भने रचना बोली जस्तै वैयक्तिक पक्षमा अर्थिने गर्दछ भन्ने मान्यता यस लेखमा प्रस्तावना गरिएको छ । भाषा र बोलीको सम्बन्धगत मान्यतासँग साहित्यको समाज र व्यक्तिसँगको उत्तरदायित्वको अर्थ नै यस लेखमा खोजी गरिएको विशेषपक्ष हो । यस लेखमा नमुना पद्धतिबाट सामग्री चयन गरिएको छ र विश्लेषणमा गुणात्मक अध्ययन पद्धति अवलम्बन गरिएको छ । यस क्रममा आफर कृतिको साहित्यिकता र रचनागत पक्षको मूल्यबोध गर्दै यस मान्यताको व्यावहारिक प्रयोग पनि यस लेखमा प्रस्तुत छ ।
{This article does a comparative study and analysis of literature focusing on the ideas of Ferdinand de Saussure, langue and parole. Saussure believed that the social aspect waste language and that the language of personal use was parole. The process of analyzing literary creation or thought has explored the social and individual aspects. It identifies the social function of language and interprets dialect based on individual aspects in the context of literature. It emphasizes that language is an abstract expression of a society that exists within a dialect. A contemplative tradition has developed around language's internal and external structure in this context. This study concluded that this concept is also seen in the creation of literature. Language and speech play an important role in determining the value of literature. Thus, the basis of literature is also connected to society. If this literature is a common element of society, it implies the individual element, such as composition and speech. This article explains how this relationship is accomplished. In this article, it is the meaning of the responsibility of literature towards society and individuality along with the related beliefs of language and dialect that are explored. This article was accumulated using the sampling method. The analysis in this article has been conducted using a qualitative method. In this article, the value of the literary and creative side of the work called the text Aaphar is emphasized. The practical application of this belief is also discussed.}
High Stability, High Enthalpy APS Process Based on Combined Wall and Gas Stabilizations of Plasma (Part 1: Process and Coatings Introduction)
Authors: Mor Gianpaolo , Belashchenko Vladimir
Published: August 2022

The paper describes the major features of a recently developed high voltage – low current air plasma spray (APS) process and torch that is based on combined wall and gas stabilizations of plasma (C+Plasma). It is shown that the C+Plasma process is capable of efficiently generating stable plasmas without drifting or pulsing. Plasma gas selection includes N2, N2-H2, N2-Ar-H2, Ar-H2(He), etc. Availability of stable N2-H2 plasmas having enthalpies within 30-70 kJ/sl range offers a new level of APS efficiency and coating quality. The paper includes illustrations of the C+Plasma durability, stability and expanded operating window. The process capability is also illustrated by properties of the advanced MCrAlY bond coatings and dense segmented TBCs (thermal barrier coating).
Wear Behaviour of Conventional and Nanostructured Thin Films of Titanium Aluminium Nitride
Authors: Grewal Jasmaninder Singh , Sidhu Buta Singh , Prakash Satya
Published: August 2022

Titanium aluminium based nitride (Ti, Al)N coatings possess excellent tribological behaviour with respect to metal cutting and polymer forming contacts. In the present work TiAlN coatings were deposited by plasma spray process. Three coatings of TiAlN were deposited on AISI-347 grade boiler steel substrate out of which two were thin nano coatings deposited at different temperatures of 500°C and 200°C and one conventional coating was deposited by plasma spraying. The as sprayed coatings were characterized with relative to coating thickness, microhardness, porosity and microstructure. The optical microscopy (OM), the XRD analysis and field mission scanning electron microscope (FESEM with EDAX attachment) techniques have been used to identify various phases formed after coating deposited on the surface of the substrate. Subsequently the sliding wear behaviour of uncoated, PVD sprayed nanostructured thin TiAlN coatings deposited at 500°C and 200°C and plasma sprayed conventional coated AISI-347 grade boiler steel were investigated according to ASTM standard G99-03 using pin on disk wear test rig. Cumulative wear volume loss and coefficient of friction, μ were calculated for the coated as well as uncoated specimens for 10, 15 and 20 N normal loads at a constant sliding velocity of 1 m/sec. The worn out samples were analysed with SEM/EDAX. Wear rates in terms of volumetric loss (mm³/g) for uncoated and coated alloys were compared. The nanostructured TiAlN coatings deposited at 500°C and 200°C has shown minimum wear rate as compared to conventional TiAlN coating and uncoated AISI-347 grade boiler steel. Nanostructured TiAlN coatings were found to be successful in retaining surface contact with the substrate after the wear tests.
Reliability Concepts for Failure Analysts
Authors: Burgess David L.
Published: August 2022

The reliability of a component is the probability that it will perform its function under specified conditions for a specified length of time. Key considerations in defining and designing reliability tests are reviewed in this article, which also discusses the interpretation of test results.
Trends and Roadmap for Outsourcing and Services in the FA Industry
Authors: Villemain Michel
Published: August 2022

The market for semiconductor manufacturing equipment has consolidated rapidly over the last decade; where there were once hundreds of potential customers, there are now perhaps a dozen in the first tier. This transformation has been driven primarily by the dramatic growth in the cost and complexity of the manufacturing process and has caused a shift in the priorities that guide purchasing decisions—from technical performance to asset utilization. These changes are also reflected in the failure analysis (FA) lab, where rising tool costs and operator expertise requirements have made it increasingly difficult to justify the investment required to maintain a complete state-of-the-art capability. Outsourcing some FA activity has become increasingly attractive.
Laser-Induced Detection Sensitivity Enhancement with Laser Pulsing
Authors: Quah Alfred C.T. , Meng Chua Choon , Tan Soon Huat , Koh Lian Ser , Phang Jacob C.H. , Tan Tam Lyn , Gan Chee Lip
Published: August 2022

The use of a pulsed laser with a lock-in amplifier has been shown to increase the detection sensitivity of scanning optical microscopes by a factor of ten. In this article, the authors explain how they implement laser pulsing without a lock-in amplifier through software control. The detection sensitivity of their method, which is based on a digital signal integration algorithm, has been shown to be comparable to that achieved with a lock-in amplifier. Several case studies illustrate the effectiveness of the technique for locating various types of defects.
The Integrated Fabless Manufacturer
Authors: Street Alan
Published: August 2022

This column reflects on the emergence of integrated fabless manufacturers (IFMs) in the semiconductor industry and the effect it will have on failure analysis. In the IFM environment, FA will likely play the same roles, as in design debug, qualification, yield, and customer returns, but with new challenges and expectations as explained in this guest column.
Nondestructive Failure Localization—A Challenge for Sub-100 nm Structures
Authors: Zschech Ehrenfried
Published: August 2022

This column explains why transmission X-ray microscopy (TXM) and X-ray computed tomography (XCT) could become the methods of choice for defect localization in the coming years.
Distortion-Free Measurements of Analog Circuits by Time-Resolved Emission
Authors: Sarault Keith R. , Boon Gerben
Published: August 2022

Time-resolved emission (TRE) systems are used in many FA labs for internal timing analysis of digital ICs. In this article, the authors explain how they use TRE systems to diagnose analog circuit failures as well. The key to their success is the use of an asynchronous trigger on the emission detector, which eliminates measurement error due to nonlinear distortion. A case study of an analog amplifier failure caused by a polysilicon short demonstrates the effectiveness of their technique.
Advanced Flash Memory Analysis
Authors: Harber Keith , Subramanian Sam , Chrastecky Tony , Ly Kheim , Petri Charles
Published: August 2022

This article presents a case study involving flash memory bit failures characterized by threshold voltage changes due to positive gate disturb stress. An inconsistency in failing bit behavior, which was found to be dependent on the test mode, was explored to provide an electrical explanation for the failure. The underlying defect was isolated and subsequently identified by physical analysis.
Can Sisyphus Be Happy?
Authors: Perdu Philippe
Published: August 2022

This column reviews a survey of the top ISTFA contributors from 1999 to 2008 and the topics addressed in their papers.
Managing Safety in a Failure Analysis Laboratory
Authors: Keating Fergal
Published: August 2022

This article discusses the importance of failure analysis lab safety and presents best practices for setting up and maintaining an effective safety program. It explains how to identify hazards and assess risks associated with X-ray and laser radiation, liquid nitrogen, compressed gases, and soldering processes. It also discusses the use of personal protective equipment, the implementation of practical controls, key performance indicators, and safety standards and regulations.
ISTFA 2009 Panel Discussion: “The FA Engineer’s Career—Past, Present, and Future. What Does the Future Hold for a Career in This Field?”
Authors: Keim Martin
Published: August 2022

Summary of a panel discussion held at ISTFA 2009 to address the following questions. Where is failure analysis heading as a business? What career options are open to an engineer in this field? How do I demonstrate my value to management? Which skills and knowledge will be needed tomorrow? What can I do to find new employment? Should I start or continue my career in semiconductor failure analysis?
Focus on Innovation in Failure Analysis Technology
Authors: Vallett Dave
Published: August 2022

The EDFAS Board of Directors (BOD) has undertaken an initiative to help drive the development of failure analysis methods as leading-edge semiconductor technology approaches the sub-20 nm regime. To streamline efforts and leverage existing work, the BOD recently surveyed its constituency to gauge their opinions on the capability gaps identified by the Sematech councils. This article briefly discusses the methodology of the survey and provides a summary of the responses along with key findings.
What’s Been Happening with the IVAs?
Authors: Cole Edward I.
Published: August 2022

One of the pioneering developers of induced voltage alteration (IVA) measurement techniques assesses the current state of the technology, the impact of major advancements, and the potential for further improvements. The assessment pays particular attention to biasing approaches, phase-locked loop detection techniques, the effect of solid immersion lenses on spatial resolution, and the emergence of production-type sample preparation methods.
Understanding the Effects of Local Structures on TIVA Profiles Using Thermal Modeling and Simulation
Authors: Tangyunyong Paiboon , Cole Edward I.
Published: August 2022

Thermally-induced voltage alteration (TIVA) is a laser-based method for localizing interconnect defects in ICs. Its main limitation is that the laser must heat the defect and change its resistance sufficiently to produce a measurable voltage alteration. Anything that interferes with laser absorption or alters defect heating makes TIVA less effective. This article presents the results of a study on the effects of local structures on TIVA imaging. The authors selected a polysilicon-metal test structure as the focal point of their study, which entailed experimental investigation along with modeling and simulation. It was found that the TIVA profiles on this structure are strongly influenced by local geometry, particularly the variation of interlevel silicon dioxide thickness and the placement of polysilicon lines with respect to aluminum lines. Understanding such relationships is essential for locating defects using TIVA techniques.
Advanced Dynamic Laser-Stimulation Methods Using Lock-In and Mixed-Frequency Techniques
Authors: Brillert Christof , Qian Zhongling , Burmer Christian
Published: August 2022

A wide range of electrical faults are revealed through thermal laser stimulation (TLS). In principle, an electrical parameter, typically current or voltage, is monitored for changes caused by the heating effects of the laser. Most test setups are designed to limit the activity of the device in order to minimize the signal-to-noise ratio, but in some cases, the fault’s electrical footprint can only be detected when the device is stimulated in a dynamic way. This article describes the setup and implementation of various dynamic TLS methods and presents example applications demonstrating the advantages and limitations of each approach.
Site-Specific Analysis of Advanced Packaging Enabled by Focused Ion Beams
Authors: Young Richard J.
Published: August 2022

Packaging integration continues to increase in complexity, driving more samples into FA labs for development support and analysis. For many of the jobs, there is also a need for larger removal volumes, compounding the demand for tool time and throughput. Focused ion beam (FIB) and dual-beam FIB/SEM systems are helping to relieve the pressure with their ability to create site-specific cross sections and to facilitate gate-level circuit rewire and debug. This article reviews the impact of packaging trends on failure analysis along with recent improvements in FIB technology. It also presents examples that illustrate how these new FIB techniques are being applied to solve emerging packaging challenges.
ISTFA 2010: ISTFA 2010 Wrap-Up
Authors: Vanderlinde William
Published: August 2022

The 36th International Symposium for Testing and Failure Analysis (ISTFA 2010) was held in Dallas, Texas, November 14-18, 2010. This article gives a brief summary of the keynote presentation, technical program, panel discussions, tutorials, and User’s Group meetings.
Recent Advances in Acoustic Microimaging of Thin-Silicon Devices
Authors: Semmens Janet , Adams Tom
Published: August 2022

Acoustic microimaging has advanced over the past few years in response to the growing use of thinner silicon die and innovative packaging designs. This article reviews the basic principles of acoustic imaging technology and describes some of the applications made possible by improvements in spatial resolution, focal length, F-number, and water couplant temperature control. It also discusses common imaging challenges and explains how they can be resolved.
Commentary on Applications of EDS in Silicon IC Manufacturing and Failure Analysis
Authors: Li-Lung Lai
Published: August 2022

This article provides a practical overview of energy-dispersive spectroscopy (EDS) and its various uses in semiconductor device manufacturing and failure analysis. It explains how EDS techniques are typically implemented, compares and contrasts different methods, and discusses the factors that determine spatial and energy resolution, measurement depth, sensitivity, signal-to-noise ratio, and ease of use.
Variations on FIB in situ Lift-Out for TEM Sample Preparation
Authors: Hartfield Cheryl , Hammer Matt , Amador Gonzalo , Moore Tom
Published: August 2022

This article discusses the practice of FIB-based in situ lift-out, a sample preparation method that has proven particularly useful for failure analysis. It explains how samples are now being made for a wide range of TEM techniques, including holography, tomography, high-angle annular dark-field scanning, and electron energy-loss spectroscopy. In most cases, achieving optimal quality requires the use of alternate FIB milling angles, as in plan-view, sideways, and backside milling, all of which are discussed.
The Rise and Fall of New Failure Analysis Techniques
Authors: Zachariasse Frank
Published: August 2022

This column provides some thoughts on the cultivation of ideas and the conditions that must exist in a failure analysis laboratory to allow fledgling methods to become deeply rooted, flourishing techniques. As an example, the author recounts the introduction and subsequent development of resistive interconnect localization (RIL) is his lab.
The Failure Analysis Lab behind the Foundry Business
Authors: Chung Jones
Published: August 2022

This column explains what it takes to set up and run a successful foundry-based failure analysis laboratory.
Tin Whisker Risk Assessment for Space Systems
Authors: Mason Maribeth , Eng Genghmun , Leung Martin , Stupian Gary , Yeoh Terence
Published: August 2022

Tin whiskers are single-crystal filaments that can grow from tin-plated copper or nickel components. This article discusses the effect of plating thickness, composition, and grain size on tin whisker formation and explains how to assess damage potential based on microanalysis, whisker length distribution models, and metal vapor arc risk factors. The authors also present and analyze several examples of failures caused by tin whisker formation in space systems.
Failure Analysis Trends
Authors: Wagner Larry
Published: August 2022

Reflecting back on the past 45 years in semiconductor failure analysis, the columnist notes that the trend lines have deviated little over that time. He then goes on to point out the relatively few discontinuities, the latest of which, the emergence of the “invisible defect,” takes him back to the beginning of his journey.
Finding the Invisible Contaminants in CMOS Image Sensor Pixels: The DCS Technique
Authors: Domengie Florian , Morin Pierre , Bauza Daniel
Published: August 2022

This article discusses the basic principles of dark current spectroscopy (DCS), a measurement technique that can detect and identify low levels of metal contaminants in CMOS image sensors. An example is given in which DCS is used to determine the concentration of tungsten and gold contaminants in an image sensor and estimate the dark current generated by a single atom of each metal.
New Challenges in Testing and Failure Analysis for Microsystems-Enabled Photovoltaics Modules
Authors: Cruz-Campa Jose-Luis , Kim Bongsang , Jared Bradley , Okandan Murat , Nielson Gregory N. , Ballance Mark , Nordquist Chris , Sweatt William , Lentine Anthony
Published: August 2022

Engineers at Sandia National Laboratories have developed a technology that may bring down the cost and improve the efficiency of photovoltaic energy conversion. Here they explain how they manufacture photovoltaic modules containing as many as 100,000 silicon solar cells using conventional IC fabrication and PCB assembly techniques. They also explain how they estimate module efficiency based on the IV characteristics of individual cells and the detection of open and short circuits.
Industry Insights: Will the Machines Do All of Our Work as Well?
Authors: Henderson Chris
Published: August 2022

Automation may be responsible for the loss of many jobs, but it has been and is likely to remain more of a help than a threat to semiconductor failure analysts.
Fast Failure Isolation of Thermal Defects, Generally Shorts
Authors: Wadhwa Kannu , Schmidt Christian , Wagner Larry
Published: August 2022

The shrinking geometries in today’s 3-D integrated circuit (IC) designs generate an urgent need for a variety of tools to isolate failures on advanced semiconductor devices. There has been no single technique that adequately addresses all types of failures with the required fast cycle time. Complex failures that are not resolved by the faster global approaches are best addressed by probing technologies, where waveforms or voltages are measured from node to node. These approaches are time-consuming and usually require detailed understanding of the circuit operation. Global techniques that map the secondary effects of defects have been widely used for as many failures as possible. These secondary effects include thermal emission, photon emission, and circuit operation dependencies on localized heating or carrier generation at a defect site. Each technique addresses some segment of the failure mechanisms, but none is universally effective in itself. The use of thermal emission techniques has waned due to the issues of lower power supply voltages, which result in poor sensitivity for older techniques and decrease in minimum resolved feature sizes.
An Overview of LED Technology
Authors: Simard-Normandin Martine
Published: August 2022

This article describes the physical characteristics, operating principles, and key failure modes of light-emitting diodes (LEDs), focusing on phosphor-converted blue LEDs because of their relative importance. The explanations throughout the article are supported by graphics that reveal microscale features of interest as well as defects.
Dual-Lens Electron Holography for Junction Profiling and Strain Mapping on Semiconductor Devices
Authors: Wang Yun-Yu , Domenicucci Anthony , Bruley John
Published: August 2022

IBM engineers have developed a holographic imaging technique, called dual-lens electron holography, that provides high spatial resolution and field of view without compromising signal-to-noise ratio. This article reviews the basic principles of the new method and provides several examples of its use. The first few examples demonstrate the junction profiling capabilities of the new method which, in one case, helps to explain why shallow junction devices are made with raised source-drain regions. In the other examples, dual-lens holography is used for strain mapping, in one case, to study strain distributions in sigma-shaped SiGe devices, and in another, to provide evidence that stress memorization occurs in dislocations in the source-drain region of nFET devices.
A Review of the ISTFA 2013 Panel Discussion: Failure Analysis and Reliability Challenges in Photovoltaic Systems
Authors: Subramanian Sam , Keyes Ed
Published: August 2022

This article provides a summary of the ISTFA 2013 Panel Discussion on failure analysis and reliability challenges in photovoltaic systems.
Electromigration History and Failure Analysis
Authors: Burgess David
Published: August 2022

Electromigration is a wearout mechanism that contributes significantly to IC failures. This article discusses the causes and effects of this often overlooked failure mode and presents practical guidelines to help analysts determine whether or not electromigration is the cause of a particular failure. It also discusses the differences between aluminum and copper electromigration.
Failure Analysis: Why Mistakes Are Made and How to Avoid Making One
Authors: Burgess David
Published: August 2022

The tools of the trade in semiconductor failure analysis have advanced rapidly over the past few decades, bringing major improvements in imaging, deprocessing, and materials analysis. In contrast to the progress made in physical FA, little attention has been given to the failure analysis process itself. This article shows through case studies how simple oversights and misunderstandings can lead to costly mistakes. It also defines basic FA concepts and presents a failure analysis sequence, describing each step along with common pitfalls and best practices.
A Through-Silicon Metrology Target for Solid Immersion Lenses, Part I: Metrology Chip and Example
Authors: Lo William , Marks Howard
Published: August 2022

Metrology targets are an essential tool for evaluating the performance of imaging systems and maintaining their accuracy over time. Ideally, the pattern on the target is simple enough that the expected image is intuitive or, at least, easily simulated. Although many such targets exist for frontside imaging, until recently, few if any could be found for backside applications. In this article, the first of a two-part series, the authors explain how they addressed this gap by converting a readily available frontside target for backside use. The conversion process is described step by step in enough detail that it can be replicated in order to convert other frontside targets. Due to the success of the converted target, an unmounted, backside-specific version has subsequently been developed, the availability of which not only eliminates one of the more difficult steps in the original conversion process, but also provides additional benefits. Using one of these newer targets, the authors evaluated a backside imaging system consisting of a laser scanning microscope (LSM) and a solid immersion lens (SIL). The results are presented here along with the criteria used for the evaluation. Other applications of the new metrology target as well as its limitations are discussed in the May 2015 issue of EDFA.
A Summary of the ISTFA 2014 Panel Discussion: System-to-Component-Level Failure Analysis in the Space and Oil Industries
Authors: Beaudoin Felix , Grosjean David
Published: August 2022

Four panel members participated in the ISTFA 2014 Panel Discussion on the importance of correctly determining the cause of failure in electronic devices and systems designated for use in space, downhole drilling, and other such applications. Reliability of these components is critical because they cannot be easily replaced and malfunctions can be catastrophic. The panelists presented several methods for analyzing failures in integrated electrical systems and identifying the root cause.
Capacitor Failure and Helicopter Accident
Authors: Walbrou Frédéric
Published: August 2022

This article explains how safety investigators with the French Bureau of Enquiry and Analysis for Civil Aviation Safety (BEA) used chip-level recovery procedures to retrieve recorded flight data that helped them piece together the events that led up to helicopter accident that recently occurred in French Guyana. The recovered data along with eyewitness accounts and findings from an assortment of tests indicated that the failure of a capacitor filtering the output of a current generator inside the engine fuel automatic regulation system obliged the pilot to control fuel regulation manually. Although other factors were involved, as the article explains, the capacitor failure played a major role in the crash.
Automated High-Resolution Imaging of Very Large Fields of View (FOV)
Authors: Stellari Franco , Lin Chung-Ching , Song Peilin
Published: August 2022

Engineers at IBM’s Watson Research Center are contending with one of the most fundamental limitations of imaging technology: the tradeoff between spatial resolution and field of view. In this article, they explain how they created tool interfaces, control and automation software, and image analysis and stitching algorithms, enabling photon emission and laser scanning microscopes to produce high-resolution mosaic images of advanced processor cores and other large-area ICs. They describe some of the challenges they faced and explain how their technology can be used to create images based on reflected light, induced voltage, photon emission, and laser stimulation signatures. In one of the latest demonstrations, the technology was used to land and focus a SIL more than 4000 times, acquiring some 16,000 images that were composed into stitched mosaics of several hundred images each.
3-D Analysis of a Copper Flip-Chip Interconnection Using FIB-SEM Slice and View
Authors: Ito Mototaka , Kato Jun
Published: August 2022

A detailed analysis based on FIB etching and SEM image capture was conducted on a flip-chip solder joint deep inside a tablet PC. 3D views reconstructed from SEM images show what appears to be a copper pillar with a solder cap connected to a copper trace on the substrate. The investigators believe the joint was formed by thermal compression bonding with a preapplied underfill. The analysis also revealed the presence of voids and intermetallic compounds along with signs of filler entrapment.
Plasma FIB Provides Vital Delayering and Site-Specific Failure Analysis Capabilities for Larger-Scale Structures
Authors: Madala Surendra
Published: August 2022

Plasma focused ion beam (PFIB) systems can generate ion beams with much higher current and are therefore able to remove larger volumes of material at much faster rates while still maintaining precise control of the beam and its milling action. This article explains how the improved performance of PFIB is leading to new applications in delayering, deprocessing, and site-specific failure analysis.
ISTFA 2015 Wrap-up
Authors: Demarest James
Published: August 2022

The 41st International Symposium for Testing and Failure Analysis (ISTFA 2015) was held in Portland, Ore., November 1-5, 2015. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, User’s Group meetings, and equipment exposition.
The Process of Inventing a Patentable Item
Authors: Higgins Jason
Published: August 2022

This column discusses the effect of changes in the U.S. patent process and explains how they benefit failure analysts. He also relates one of his own experiences with filing for a patent based on an observation he and a colleague made in a semiconductor FA lab.
LVI and LVP Applications in In-Line Scan Chain Failure Analysis
Authors: Song Zhigang , Safran Laura
Published: August 2022

This article explains how the success rate of in-line scan chain logic macros can be nearly doubled for certain types of failures with the help of laser voltage imaging and laser voltage probing. The authors provide background information on LVI, LVP, and scan chain logic macros and show how they are used to diagnose skip test, clock-type, and soft single-latch failures.
Polymolecular Complexes of Chitosan with the Bombyx Mori Protein
Authors:   Institute of Polymer Chemistry and Physics, Avazova O.B. , Milushevа R.Yu. ,   Institute of Polymer Chemistry and Physics, Nurgaliev I.N. ,   Institute of Polymer Chemistry and Physics, Rashidova S.Sh. ,   Institute of Polymer Chemistry and Physics
Published: August 2022

The interaction of chitosan (ChS) and the Bombyx mori protein on different pH ranges was studied, and the fundamental possibility of obtaining complexes of ChS with the Bombyx mori protein was revealed. The for-mation of a polymolecular complex of protein with ChS in aqueous solutions was confirmed by the results of physico-chemical methods. It is shown that the ChS structure is characterized by a certain rigidity and ionogenicity. The results indicate the complexation of the pupae protein with ChS in 2% acetic acid in the range of pH = 4.8–6.7. The detected changes and shifts of the absorption bands in the IR spectra confirm the occurrence of the complex formation reaction between the molecules of ChS and protein at pH = 4.8–6.7, which is characterized by absorption bands in the IR spectra at 1641 cm–1, 1538 cm–1 and 1068 cm–1. Quan-tum-chemical DFT study of ChS complexes with amino acids (AAs) was carried out. The stability of com-plexes of ChS with AAs (ChS-AA) was shown except for the complex formed with histidine in the gas phase. The calculation results indicate the presence of a strong thermodynamic driving force in the complexation of ChS with AAs.
UPAYA PENANGGULANGAN PROSTITUSI DI KALANGAN SISWA
Authors: Eleanora Fransiska Novita , Putri Anggreany Haryani
Published: August 2022

Prostitusi yang semakin marak terjadi bukan hanya terjadi di kalangan orang dewasa saja, tetapi juga sudah meningkat kepada anak atau kalangan siswa, serta bertentangan nilai-nilai dan norma dalam masyarakat. Memberikan dampak yang tidak baik dalam aspek sosiologis, pendidikan, ekonomi, kesehatan dan penataan kota. Dan juga adanya upaya penanggulangan secara preventif, represif dan kuratif. Adapun tujuan dari kegiatan ini adalah untuk mengetahui dampak dan penanggulangan sehingga dapat terhindar dan tidak menjadi korban dari praktek prostitusi. Serta adanya perlindungan hukum bagi korban prostitusi seperti ganti rugi, juga rehabilitasi dan medis dan juga sosial. Metode dari kegiatan ini dilaksanakan dengan melalui tahapan yaitu a) penyuluhan oleh narasumber, b) sesi tanya jawab peserta kepada narasumber, c) evaluasi terkait materi kegaiatan yang sudah disampaikan. Adapun hasil dari kegiatan ini 1) sudah mengetahui dan memahami dampak dan penanggulangan dari prostitusi 2) mengerti aturan-aturan hukum dan sanksi yang berkaitan dengan prostitusi baik sebagai pelaku dan juga korban. Kegiatan dalam pengabdian masyarakat ini dapat dilaksanakan secara berkelanjutan bagi kalangan siswa dan siswi serta masyarakat.
Konsep Perlindungan Hukum Peradilan Bagi Anak Korban Kekerasan Dalam Rumah Tangga
Authors: Heriani Istiana , Megasari Indah Dewi , Septarina Muthia
Published: August 2022

The purpose of this study is first to find out how to protect legal protection for children who are victims of domestic violence. Second, to find out how the judicial mechanism is for victims of domestic violence. The research method is normative juridical, with a descriptive approach, namely the results obtained from this study are expected to provide an overview of legal protection for children as victims of domestic violence. The results of his research are legal protection for children as victims of domestic violence, namely the protection provided, including: providing legal assistance; confidentiality of the victim's identity; arrest of the offender with preliminary evidence; providing other assistance in the form of health services; rehabilitation efforts. The judicial mechanism for child victims of domestic violence is with the right handling and approach so that this problem can be handled properly, namely directed to the resolution of domestic violence crimes through restorative justice efforts to restore the rights of victims and relationships with the perpetrators.
Non-contrast–enhancing subdural empyema: illustrative case
Authors: Rebchuk Alexander D. , Chang Stephano J. , Griesdale Donald E. G. , Honey Christopher R.
Published: August 2022

BACKGROUND

Subdural empyema (SDE) is a life-threatening intracranial infection that, without timely surgical intervention and appropriate antibiotic treatment, is inevitably fatal. SDE is classically recognized on brain imaging as a subdural collection surrounded by a contrast-enhancing ring.

OBSERVATIONS

The authors describe the case of a 41-year-old male with clinical features consistent with SDE but without any contrast enhancement on multiple computed tomography scans obtained more than 48 hours apart. Given the high clinical suspicion for SDE, a craniotomy was performed that demonstrated frank pus that eventually grew Streptococcus pyogenes.

LESSONS

This case demonstrates that SDE may present without ring enhancement on contrast-enhanced imaging. In critically ill patients with a high clinical suspicion for SDE despite lack of contrast enhancement, we demonstrate that exploratory burr holes or craniotomy can provide diagnostic confirmation and source control.
On the construction of new nuclear power units in Ukraine
Authors:   Institute for Safety Problems of Nuclear Power Plants, NAS of Ukraine, Borysenko V. I. , Nosovskyi A. V.
Published: August 2022

The article provides information on the pace of construction and commissioning of nuclear power units at nuclear power plants in the world over the past 60 years. Nuclear energy is the most important factor in ensuring the energy independence of Ukraine. As of 2022, 80% of the entire fleet of Ukrainian nuclear power units (12 out of 15) have already been in operation for more than 30 years. In the world, this figure is 68%. Two power units with VVER-440 reactors have been in operation for more than 40 years, and by 2028 the number of power units at Ukrainian NPPs, that have been in operation for more than 40 years, will increase to 10. Therefore, the need and importance of introducing a program for the construction of new nuclear power units to ensure energy independence of Ukraine are obvious. The article discusses the most important characteristics of the modern AP1000 reactor unit, which is licensed in the USA, Canada and some other countries. Information is presented on the advantages of the AP1000 project over other modern reactor plants EPR-1750, APR-1400, VVER-1200, as well as issues that need to be paid special attention, when performing the relevant stages of work on the justification and implementation of the AP1000 technology in the nuclear power industry of Ukraine. For example, the installed capacity utilization factor of operating power units with EPR-1750, APR-1400, VVER-1200 is lower than for АР1000. When justifying the decision to choose AP1000, it is necessary to pay attention to the already known problematic issues of implementing Westinghouse technology. It is recommended to involve the institutes of the National Academy of Sciences of Ukraine in the work, related to the scientific and technical substantiation of the choice of promising nuclear installations for Ukrainian NPPs.