bluuebunny/crossref_metadata_2025 huggingface dataset:
Zynq SOC Low-Voltage and Temperature-Dependent L2 Cache Failure Diagnosis and Defect Localization Case Study
Authors: Bai Haonan , Lee Lan Yin , Jing Yang , Salinas Peter Floyd , Chua Kok Keng
Published: December 2020

Failure analysis and defect localization on 28nm All Programmable Zynq System-on-Chip (SoC) device is extremely challenging. While conventional FPGA, which only consists of the Programmable Logic, has greater ease and flexibility in pattern generation during fault isolation, the all programmable SoC device integrates a dual ARM Cortex-A9 cores with Programmable Logic (PL) in a single chip. The cache data access in-between processor and PL is more complex and test methodology has lesser degree of control on cache data flow and stack sequence. This paper introduced an advanced fault isolation test methodology combining Software Development Kit (SDK) with scan based diagnostic test for cache failures. It successfully pinpoint to failure locations with physical defects found. As conventional physical failure analysis approaches using SEM based passive voltage contrast could not observe any abnormalities, current imaging and nano-probing measurement using AFP played critical roles in detecting nano-ampere leakages prior subsequent TEM analysis. The findings were then feedback to the foundry for process improvement. Furthermore, a new screening methodology is innovated where an extreme low-voltage test at high temperature in Automatic Test to detect and eliminate the process marginal leakage failure.
Quantitative FIB-SEM 3D Tomography for Failure Analysis in Data Storage Industry
Authors: Li Zhi-Peng , Fang Jianxin , Wang Haifeng
Published: December 2020

Technology evolution in the data storage industry is driven by the continuous scaling down of devices and by an increasing complexity of the critical elements in the devices. Focused ion beam - scanning electron microscope (SEM) tomography can enable characterization of a device over its entire volume, while maintaining the resolution of the SEM. This study introduces the quantitative 3D tomography technique developed in the data storage industry to specifically address the industrial process development needs. In the detail section, the methodology of 3D reconstruction is introduced, key parameters are reviewed, and the steps for a successful 3D tomographic reconstruction are described. The study presents typical applications of 3D analysis for device design and process development to illustrate the benefits and unique learning opportunities. By reconstructing all slice-view 2D images quantitatively, 3D device structures and related 3D metrology data can be obtained.
Magnetic Head Shorting Failure Analysis
Authors: Hong Liang , Li Jia , Wang Haifeng
Published: December 2020

This paper provides an innovative root cause failure analysis method that combines multiple failure analysis (FA) techniques to narrow down and expose the shorting location and allow the material analysis of the shorting defect. It begins with a basic electrical testing to narrow down shorting metal layers, then utilizing mechanical lapping to expose over coat layers. This is followed by optical beam induced resistance change imaging to further narrow down the shorting location. Scanning electron microscopy and optical imaging are used together with focused ion beam milling to slice and view through the potential shorting area until the shorting defect is exposed. Finally, transmission electron microscopy (TEM) sample is prepared, and TEM analysis is carried out to pin point the root cause of the shorting. This method has been demonstrated successfully on Western Digital inter-metal layers shorting FA.
Combining Electron Beam Methods, EBIC and EBAC, with Traditional Approaches for Highly Effective Fault Isolation
Authors: Fredrickson Ryan , Kuebrich Tim , Le Andrew , Snider Derek , Winiarski Lucas
Published: December 2020

Fault isolation is an important initial component of the failure analysis investigation as it provides the first indicator of the defect physical location. The most broadly familiar fault isolation techniques include photoemission microscopy (PEM), optical beam induced resistance change (OBIRCH) and liquid crystal analysis (LCA). Each of these techniques has their own strengths but also drawbacks which can impede the analysis by either not providing a well isolated defect location or causing damage to the defect region. For some types of defects, photoemission and liquid crystal analysis may create local heating of the device which can distort the defect and mask the root cause of the failure. These techniques also rely on optical microscopy which has low resolution compared to the feature size of current technologies. In addition, each technique may not highlight the defect site itself; only pointing the analyst to the defective circuit within the sample. Electron Beam Induced Current (EBIC) and Electron Beam Absorbed Current (EBAC) microscopy provides solutions to these complications. In this paper we describe some very effective approaches by using these beam-based techniques in conjunction with traditional methods. As introduction, we have provided some interesting case studies whereby EBIC/EBAC have been used in conjunction with FIB circuit edits and scan diagnostic results to narrow the defect search areas. We focus the paper on some less common applications of cross sectional EBIC/EBAC as well as utilizing an AC coupled configuration to activate more subtle defect sites. We conclude with two examples where AC coupled cross-sectional EBIC is needed to highlight the cause of the failure.
Using Volume Scan Diagnosis and Data Mining in the Electrical Failure Analysis Flow for Production Yield Ramp
Authors: Shen Hao , Shen Lance , Xu Pierce , Yang Wu , Zhong Junna , Cheng Wu-Tung
Published: December 2020

Electrical failure analysis (EFA) is usually time consuming and expensive. It is a critical step bridging data failure analysis (DFA) and physical failure analysis (PFA). This paper presents experiments on using volume scan diagnosis as a component in building up an efficient EFA solution for digital circuits and discusses practical considerations in the production yield flow. It provides a brief review of the existing methods and the requirement to build an efficient flow, followed by a discussion on the proposed solution. The proposed solution can be used systematically in different stages of the production yield flow. The paper then shows industrial case studies and their results and benefits.
Accurate Defect Localization of Stacked Die Devices by Lock-in Thermography
Authors: Lin Ke-Ying , Tang Chih-Yi , Wang Yu Chi
Published: December 2020

The paper demonstrates the moving of lock-in thermography (LIT) spot location by adjusting the lock-in frequency from low to high. Accurate defect localization in stacked-die devices was decided by the fixed LIT spot location after the lock-in frequency was higher than a specific value depending on the depth of the defect in the IC. Physical failure analysis was performed based on LIT results, which provided clear physical defect modes of the stacked-die devices.
Evaluation on the Effectiveness of Removal VSON Package from FR4 Substrate Board
Authors: Yin Gan Sue
Published: December 2020

This paper is focused on the de-soldering process on VSON package which was mounted on FR4 substrate board after being subjected to environmental stress. Abnormalities were found at package level during Scanning Acoustic Microscopy (SAM) inspection which is considered to be one of the non-destructive failure analysis processes. Root cause finding involved the investigation of the de-soldering equipment which is suspected to be one of the culprits to contribute to the defect during de-soldering process.
A New Method to Authenticate Components and PCB Assemblies Using Fingerprint from X-Ray Images
Authors: Cardoso Bill
Published: December 2020

In this work, we introduce the use of the x-ray image as the unique fingerprint for an electronic component or printed circuit board assembly (PCBA). Unique features of the x-ray image include solder voids, cracks, part alignment, die attach porosity and voiding, die placement and alignment, and wire bonding diagram. These are just a few of the many features in the x-ray image that can be used in tandem to create a unique fingerprint for a single component or an entire PCBA. This technique can also be expanded to mechanical objects by utilizing other idiosyncratic features of the part - such as voids and porosity - to generate the x-ray image fingerprint.
A Latent Issue of Via Resistance: Mechanism and Solution
Authors: Qin Wentao , Donaldson Scott , Rogers Dan , Boukhanfra Lahcen , Thiefain Julien , Barrientos Denise , Grivna Gordy , Steinwall Jim , Chang George , Gambino Jeff
Published: December 2020

Many semiconductor products are manufactured with mature technologies involving the uses of aluminum (Al) lines and tungsten (W) vias. High resistances of the vias were sometimes observed only after electrical or thermal stress. A layer of Ti oxide was found on such a via. In the wafer processing, the post W chemical mechanical planarization (WCMP) cleaning left residual W oxide on the W plugs. Ti from the overlaying metal line spontaneously reduced the W oxide, through which Ti oxide formed. Compared with W oxide, the Ti oxide has a larger formation enthalpy, and the valence electrons of Ti are more tightly bound to the O ion cores. As a result, the Ti oxide is more resistive than the W oxide. Consequently, the die functioned well in the first test in the fab, but the via resistance increased significantly after a thermal stress, which led to device failure in the second test. The NH4OH concentration was therefore increased to more effectively remove residual W oxide, which solved the problem. The thermal stress had prevented the latent issue from becoming a more costly field failure.
Failure Analysis for Inter-Level Short in Nanometer Semiconductor Technologies
Authors: Song Zhigang
Published: December 2020

As semiconductor technology keeps scaling down, plus new structures of transistor and new materials introduction, not only are new failure mechanisms introduced, but also old classic failure mechanisms get evolved. The obvious example of failure mechanism evolution is short defect. In the previous technologies, although short defects can happen in different layers and appear in different forms, they always happens at intra-level. As semiconductor technology advanced into nanometer regime, short defect no longer only happened in intra-level, but also more and more often happened in interlevel. Failure analysis on the inter-level short defects is much more challenging because they are usually due to interaction of two processes, such as process variation in two process steps at the same location, and often hide in the bottom of tapered and dense patterns. The conventional PFA (Physical Failure Analysis) methodology often misses discovering the defect and then the defect will be removed by subsequent polishing. This paper has demonstrated some methods to tackle the challenges with three case studies of such inter-level short defects in nanometer semiconductor technologies.
Soft Single-Bit Failure on Power Fluctuation by Concurrent Operation
Authors: Ryu Keunchul , Nam Incheol , Kim Jinseon , Kim Daesun , Hwang Hongsun , Oh Taeyoung , Kim Jonghoon , Jang Seongjin
Published: December 2020

Reduced noise immunity due to dimensional shrinkage, lower operational voltages and increasing densities results in increased soft or random failures. In practice, noises are generated by complex operation of device. In Dynamic Random Access Memory (DRAM), failures by noise are regarded as either decrease in charge at cell capacitor or increase in systematic interferences. Simple equivalent circuit of One Transistor One Capacitor (1T1C) DRAM and theoretical approach in time-domain are provided for quantitative noise analysis related to sense amplifier circuitries. Results show that local voltage fluctuation reduces sensing margin to judge data-0 or data-1. This phenomenon is easily observed at 1T1C with high resistance because response of voltage generator is comparatively slow.
Ambient Temperature Thermally Induced Voltage Alteration for Identification of Defects in Superconducting Electronics
Authors: Jenkins Mark W. , Tangyunyong Paiboon , Missert Nancy A. , Pimentel Alejandro A. , Vernik Igor , Kirichhenko Alex , Mukhanov Oleg , Wynn Alex , Day Alexandra L. , Bolkhovsky Vladimir , Johnson Leonard
Published: December 2020

As research in superconducting electronics matures, it is necessary to have failure analysis techniques to identify parameters that impact yield and failure modes in the fabricated product. However, there has been significant skepticism regarding the ability of laser-based failure analysis techniques to detect defects at room temperature in superconducting electronics designed to operate at cryogenic temperatures. In this paper, we describe preliminary data showing the use of Thermally Induced Voltage Alteration (TIVA) [1] at ambient temperature to locate defects in known defective circuits fabricated using state-of-the-art techniques for superconducting electronics.
Effective Backside Circuit Edit Methods for CSP IC
Authors: Kim Y. J. , Yeo J. H. , Choi J. I. , Kim C. S. , Jeong M. M.
Published: December 2020

In the semiconductor chip manufacturing industry, a method of evaluating characteristics by applying a direct circuit edit at an already manufactured chip level is widely used in order to shorten the product development time and release the product to the market in a short time. [1] This is because, when the fab process is performed by modifying the mask to improve the characteristics as in the conventional method, it takes a lot of time and cost for feedback. Feedback of semiconductor characteristics through circuit edit can save 10-20 times in terms of cost and time. As the process becomes more complex and the pattern size becomes smaller, its benefits become even greater. However, when the chip level circuit edit is applied to the Chip Scale Package (CSP) IC, it is very difficult to apply a general method of the frontside circuit edit, so that the success rate of the circuit edit is lowered. In order to solve this problem, a circuit edit method in the backside direction of the chip has been attempted for many years. [2, 3] However, the backside circuit edit (BCE) has more difficulties than the frontside circuit edit. A typical issue is how to uniformly and precisely control and remove the backside Si of the circuit edit area. The following three points should be considered for this. First, the uniformity of the remaining silicon thickness should be high. Second, it is necessary to control the thickness of remaining silicon to an appropriate thickness in the process of removing backside silicon. Third, it is important not to damage the peripheral circuit during etching and deposition. In this paper, we propose a method to increase the backside circuit edit success rate of CSP IC using Al or Cu metal by controlling these three factors effectively.
Identification of Defective Fin by E-beam Induced Current in Advanced FinFET Device Failure Analysis
Authors: Wei Yuting , Zhang Chuan , Chen Liangshan , Khiam Oh Chong
Published: December 2020

E-beam induced current technique is a fault isolation technique based on SEM-based nanoprobers. Electron beam induced current (EBIC) can help failure analysts quickly identify the defective device with abnormal junction behavior from a relatively large area of interest. Using EBIC, defects can be pin-pointed down to individual Fin, which significantly enhanced the success rate. In this paper, two cases are used as examples to illustrate how this failure analysis (FA) methodology provides a powerful and efficient solution in localizing defective fins. In the first case, a local full bit-line fail was submitted for failure analysis. In the second case, a MOS capacitor parametric test structure designed to monitor gate oxide break down voltage that showed early break down behavior during in-line test. Failure analysis was requested to investigate the root-cause.
Successfully Look Up Table Distribution RAM Control Circuitry Fault Isolation with Different Test Methodologies and Conflict Results Analysis by Using Virtual IO and Integrated Logic Analyzer Debug Tools
Authors: Jingyao Huang , Jing Yang , Salinas Peter Floyd
Published: December 2020

This electrical fault isolation based on Xilinx 28nm all programmable device in a Distribution RAM (LUTRAM) functional block. The Look-Up-Table (LUT) was the major component to achieve the programmable chip versus the ASIC chip. In the device architecture, one 6-inputs-LUT (LUT6) memory can be configured as a 64bits distribution RAM (LUTRAM64) or two 32bits distribution RAMs (LUTRAM32). The Vivado design and debug tool brought up two powerful Intellectual Property (IP) Cores: Virtual Input/Output (VIO) and Integrated Logic Analyzer (ILA). This debug tool used Block RAM (BRAM) and fabric routing resources to store the full test results and achieved package level probe-less. [1] It can probe LUTRAM block input, output and Build-In Self-Test (BIST) interconnects. However the limitation was that the inner primitive functional block LUTRAM like memory cells, decoders, mode switchers, write/read controllers and so on were not able to probe. In this case study, the defect was not conventional failure inside the LUTRAM memory cell or stuck on Address/Data_in inputs. Moreover the test behavior with LUTRAM64 mode had conflicting results, which made the fault isolation even more challenge to narrow down from complex LUTRAM control circuitry to transistor level. Therefore different pattern test methodologies, pattern commonality analysis and hypothesis verification were wisely compiled together. In the end, the defect was successfully localized at the fault Isolation circuitry. It was fully matching with the failing mode and proving the fault isolation was correct. The physical defect analysis shown multiple layers metal fusing. The defect shorted the internal control output with the GND signal, which forced LUTRAM to setup as an invalid mode.
Characterizing Interlayer Sub-μm Features in Microelectronics Devices Using High-Resolution Scanning Probe-IR Spectroscopy and Imaging
Authors: Roy Anirban , Hu Qichi , Yang Honghua , De wolf Peter , King Sean W.
Published: December 2020

High resolution scanning probe microscopy techniques combined with infrared (IR) light sources offer unique solutions to combined chemical/mechanical/electrical characterization of defects in nanoscale dimensions. Previously, atomic force microscopy combined with infrared (AFM-IR) technology has demonstrated its capability to characterize nano-patterned metal/low-k dielectrics, nanoscale organic contaminants, and directed self-assembly of block co-polymers used for advanced micro/nanofabrications. In this paper, two complementary nanoscale chemical analysis techniques, photothermal AFM-IR and scattering type scanning near-field optical microscopy, are implemented to isolate and characterize microelectronic device cross-sections. It is observed that both techniques are able to detect patterned features with a half-pitch less than 15 nm.
Localization of Dielectric Breakdown Sites in 3D Through-Silicon Via (TSV) Interconnects by Laser Stimulation and Chip Deprocessing
Authors: Jacobs K. J. P. , Li Y. , De Wolf I. , Van Huylenbroeck S. , Beyne E.
Published: December 2020

We report and demonstrate a new methodology for the localization of dielectric breakdown sites in through-silicon via (TSV) structures. We apply a combination of optical beam induced resistance change (OBIRCH) and mechanical/chemical chip deprocessing techniques to localize nm-sized pinhole breakdown sites in a high aspect ratio 3x50 ìm TSV array. Thanks to the wavelength-selective absorption process in silicon, we can extract valuable defect depth localization info from our laser stimulation measurement. After chip deprocessing we inspect and localize the defect site in the dielectric liner using a scanning electron microscope (SEM). We confirm our results and analysis by cross-sectioning a TSV with a focused-ion beam (FIB).
ToF-SIMS, Time-of-Flight Secondary Ion Mass Spectroscopy for Counterfeit Detection of Electrical, Electronic, and Electromechanical (EEE) Parts
Authors: Simard-Normandin M. , Banks C. , Havercroft N. , Clark P. , Tallarek E.
Published: December 2020

This presentation demonstrates how Time-of-Flight Secondary Ion Mass Spectroscopy provides unique information to identify suspect counterfeit semiconductor devices. An example is shown where the epitaxial layers of a light emitting device (LED) do not match those of the exemplar.

Keywords: Secondary Ion Mass Spectroscopy, SIMS, counterfeit detection, LED, Light emitting diode.
Automated Multi-Level Circuit Net Trace for Hotspot Analysis
Authors: Goh S. H. , Susanto E. , Li Song , Yeoh B. L. , THor M. H. , Zhou D.
Published: December 2020

Post-fault isolation layout net trace and circuit analysis based on abnormal hotspots is a critical step because it directly impacts the outcome of failure analysis. In this work, we review current commercial net tracing solutions in terms of their strengths and drawbacks. As an enhancement, a new net methodology that enables automation and the capability to execute tracing beyond first-level transistors is introduced. This approach could potentially eliminate manual net tracing and significantly improves the overall failure analysis turnaround time.
Low Energy Xe+ PFIB Specimen Preparation for Cs-Corrected HRSTEM Imaging
Authors: Giannuzzi Lucille A. , Anzalone Paul A. , Rao Jiancun , Hoffman Tom , McKie Mike , Girgis Joseph , Kuwahara Takayuki , Ford Jamie , Yates Douglas M. , Stach Eric A.
Published: December 2020

Low energy (i.e., 5 keV, 3 keV) Xe+ plasma FIB methods were applied to Si ex situ lift out specimens. Cs-corrected STEM imaging reveals the Si dumbbell structure indicating excellent surface quality achieved during the low energy polishing steps.
Residual EG Oxide in FinFET Analyses and Its Impact to Yield, Product Performance, and Transistor Reliability
Authors: McGinnis Pat , Albert Dave , Song Zhigang , Oarethu Johns , Tran Phong , Sylvestri John , Hornicek Greg , Tenney Mike
Published: December 2020

This paper describes an electrical and physical failure analysis methodology leading to a unique defect called residual EG oxide (shortened to REGO); which manifested in 14nm SOI high performance FinFET technology. Theoretically a REGO defect can be present anywhere and on any multiple Fin transistor, or any type of device (low Vt, Regular Vt or High Vt). Because of the quantum nature of the FinFET and REGO occurrence being primarily limited to single Fins, this defect does not impact large transistors with multiple FINs; moreover, REGO was found to only impact 3 Fin or less transistors. Since REGO can be present on any multi-FIN transistor the potential does exist for the defect to escape test screening. Subsequently a reliability BTI (Bias Temperature Instability) stress experiment by nanoprobing at contact level was designed to assess REGO’s potential reliability impact. The BTI stress results indicate that the REGO defect would not result in any additional reliability or performance degradation beyond model expectations.
Transmission Electron Microscopy Sample Preparation By Design Based Recipe Writing in a DBFIB Part 2
Authors: Demarest J. , Austin B. , Arjavac J. , Breton M. , Bergendahl M. , Biedrzycki M. , Boye C. , Cilingiroglu B. , Gaudiello J. , Hager J. , Matham S. , Nguyen K. , Persala M. , Rizzolo M. , Shaar S. , Teehan S.
Published: December 2020

Demarest et al. concluded in their previous report that a ten times improvement in placement accuracy was required to enable automated transmission electron microscopy (TEM) sample preparation, and wafer alignment by GDS coordinates demonstrated a factor of two improvement in comparison to optical or scanning electron microscope based processes. This paper provides an additional update on this project. The study is about a GDS based process developed to simplify the complicated workflow for examining discrete electrical failures. The results of this study indicated that the recipe prototype developed on a test structure had a unique feature that consisted of an approximately 45nm by 200nm Cu line segment. Executing the prototype recipe on a wafer at the same process point fabricated 6 months after the original wafer yielded four identical successful samples of about 30nm sample thickness. This technique can thus be extended to large 2D arrays of small structures.
The Lorentz transformations by way of the wave equations
Authors: Pardy Miroslav
Published: December 2020

We prove here, by the rigorous mathematical procedure, that so-called Lorentzian time in the special theory of relativity is defined by the wave equation, where the wave of time is the form of matter and not the Bergson physiological process in S and S′.
Effects of PVC pipe leachates on the survival and reproduction of two micro-crustacean species Ceriodaphnia Cornuta and Daphnia Magna
Authors: Van Tai Nguyen , Thanh Son Dao
Published: December 2020

The occurrence and impacts of plastic are among the most concerns on the environment, ecosystems, and human health in recent years. Plastic products may contain harmful additives (e.g. phthalate, bisphenol) which can easily be leached out of the surface of the plastic materials and enter the environment causing negative effects on organisms in aquatic ecosystems. However, the toxicity of the leached plastic additives on aquatic organisms including micro-crustaceans have not been fully understood. Therefore, this study aims to evaluate the chronic effects of the leachate from the polyvinyl chloride (PVC) water pipes at the concentration of 0, 10 and 100 mg PVC/L on the survival and reproduction of two micro-crustacean species: Daphnia magna, and Ceriodaphnia cornuta. The results showed that the leachate from PVC pipes at the concentration of 100 mg/L did not adversely affect on survival and reproduction of D. magna, but reduced up to 50% of the survival rate and 60% of the reproduction of C. cornuta. The tropical micro-crustacean species C. cornuta was more vulnerable than the temperate one, D. magna. The results revealed the potential health risks of the PVC water pipes C. cornuta was recommended to be used as a model organism for the toxicological investigation and environmental assessment.
Authors: FITHRIANA NOORA , PS Vida Ursula
Published: December 2020

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Multimodality Imaging in Secondary Mitral Regurgitation
Authors: Sharma Harish , Liu Boyang , Mahmoud-Elsayed Hani , Myerson Saul G. , Steeds Richard P.
Published: December 2020

Secondary mitral regurgitation (sMR) is characterized by left ventricular (LV) dilatation or dysfunction, resulting in failure of mitral leaflet coaptation. sMR complicates up to 35% of ischaemic cardiomyopathies (1) and 57% of dilated cardiomyopathies (2). Due to the prevalence of coronary artery disease worldwide, ischaemic cardiomyopathy is the most frequently encountered cause of sMR in clinical practice. Although mortality from cardiovascular disease has gradually fallen in Western countries, severe sMR remains an independent predictor of mortality (3) and hospitalization for heart failure (4). The presence of even mild sMR following acute MI reduces long-term survival free of major adverse events (1). Such adverse outcomes worsen as the severity of sMR increases, due to a cycle in which LV remodeling begets sMR and vice versa. Current guidelines do not recommend invasive treatment of the sMR alone as a first-line approach, due to the paucity of evidence supporting improvement in clinical outcomes. Furthermore, a lack of international consensus on the thresholds that define severe sMR has resulted in confusion amongst clinicians determining whether intervention is warranted (5, 6). The recent Cardiovascular Outcomes Assessment of the MitraClip Percutaneous Therapy for Heart Failure Patients with Functional Mitral Regurgitation (COAPT) trial (7) assessing the effectiveness of transcatheter mitral valve repair is the first study to demonstrate mortality benefit from correction of sMR and has reignited interest in identifying patients who would benefit from mitral valve intervention. Multimodality imaging, including echocardiography and cardiovascular magnetic resonance (CMR), plays a key role in helping to diagnose, quantify, monitor, and risk stratify patients for surgical and transcatheter mitral valve interventions.
Faktor Gaya Hidup dan Perilaku Keuangan yang Mempengaruhi Pemilihan Tujuan Wisata ke Jepang
Authors: Wulansari Ajeng Septiana , Nugraheni Siwi
Published: December 2020

Berdasarkan data dari Japan National Tourism Organization (JNTO), jumlah wisatawan Indonesia yang berkunjung ke Jepang sepanjang tahun 2019 sebanyak 412.800 orang wisatawan, meningkat sebanyak 4% dibandingkan dengan tahun 2018 yaitu sebanyak 396.852. Peningkatan ini bisa didasari oleh banyak hal, beberapa diantaranya adalah gaya hidup yang disokong oleh tekhnologi informasi ini juga menyebabkan batas antar negara menjadi terlihat lebih samar, sehingga hiburan yang dipilih tak hanya terbatas di dalam negeri, nilai tukar mata uang Yen dan Rupiah, serta harga relative atau jumlah pengeluaran wisatawan asing di sebuah destinasi wisata. Variabel yang diteliti dikhususkan pada faktor Gaya hidup dalam penelitian ini diidentifikasi dengan Dimensi Pengukuran Gaya Hidup AIO yaitu Activities, Interest and Opinion. Sedangkan keputusan berkunjung akan dijabarkan menjadi dua dimensi yaitu push factor dan pull factor. Penelitian ini akan diuji mnggunakan Partial Least Square (PLS).
"Soft" and "Hard" Research Approaches to the Study, Measurement and Improvement of Medical Service Quality
Authors: Novatorov Eduard
Published: December 2020

The paper discusses "soft" and "hard" approaches to the study, measurement and improvement of medical services quality, presents the GAP model of medical service quality and its criteria. Drawing on two empirical studies, the author considers the technology and technique of two approaches to measure services quality - SERVQUAL and SQI - in context of medical services and offers valuable managerial recommendations.
The Algorithm for the Commercialization Process of Developments in Research Organizations
Authors: Karpycheva Svetlana
Published: December 2020

The article deals with the notion of "commercialization of technologies" and provides the interpretation of the term given by different scholars. The article examines the existing methods of commercialization of scientific developments. One of the main constraints to the technological entrepreneurship development is the wrongly chosen commercialization form of scientific developments. In addition, existing commercialization methods are not sufficiently effective. Therefore, the purpose of the paper is to provide a detailed examination of most commonly used methods of scientific developments commercializing and to develop an algorithm of action in the commercialization process to successfully launch a product on the market. Drawing on prior foreign and Russian studies of commercialization forms, we can identify 7 most commonly used forms of commercialization. The article describes each method in graphical and verbal format, compares various forms of commercialization of scientific developments in line with the factors critical for each model.
Factors Affecting the Competitiveness of Telecommunication Companies on the World Market
Authors: Chikhun Lyudmila , Tokareva Mariya
Published: December 2020

The development of information and communication technologies has contributed to the fact that the telecommunication industry has become one of the strategic sectors of the economy on which the functioning of other branches of the economy depends. Therefore, the objective of the study was to determine the factors that influence the competitiveness of telecommunications companies and shape the image of the future telecommunication sector as a whole. The article analyzes two theoretical approaches to the definition of competitiveness: static and dynamic. Due to the importance of the dynamic approach for determining the competitiveness for the telecommunication market, the main internal and external factors affecting telecommunication companies nowadays and having a significant effect in future were identified. External factors were determined using STEEPV-analysis. For internal factors, the following classification was proposed: technological, organizational and marketing innovations. Among the external factors, the digitalization of the economy and society becomes the most important for telecommunication companies, technological innovations are among the internal factors. The factors revealed during the research can be used for foresight of the telecommunications sector of Russia, the definition of scenario conditions for forecasting the development of information and communication technologies, the formation of a strategic policy of telecommunication companies.
Early Maladaptive Schemas as Predictors Symptomatology among Victims and Non-Victims of Dating Violence
Authors: Borges Jeane Lessinger , Dell'Aglio Débora Dalbosco
Published: December 2020

Este estudo investigou como os esquemas iniciais desadaptativos (EIDs) podem predizer o desenvolvimento de sintomas de depressão, ansiedade e estresse em uma aamostra alargada de adolescentes vítimas de violência no namoro. Um total de 525 adolescentes, de 14 a 19 anos de idade, oriundos da região metropolitana de Porto Alegre/RS, participaram no estudo. Os participantes foram divididos em dois grupos:  Grupo de adolescentes vítimas (n = 396 adolescentes, 60,4% do sexo feminino, M = 16,67 anos de idade, DP = 1,18 anos) e não-vítimas (n = 129 adolescentes, 52,7% do sexo feminino, M = 16,50 anos de idade, DP = 1,23 anos). O Questionário de Esquemas para Adolescentes-Forma Breve, o Inventário de Conflitos nas Relações de Namoro na Adolescência e a Escala de Depressão, Ansiedade e Estresse para Adolescentes foram aplicados. Os resultados indicaram maior sintomatologia de depressão, ansiedade e sintomas de estresse entre as vítimas, em comparação com as não vítimas, e entre as meninas vítimas, em comparação com os meninos vítimas. Vítimas de violência no namoro apresentaram significativamente escores mais altos nos EIDs de Abandono, Desconfiança/abuso, Arrogo/grandiosidade, Autossacrifício, Busca por Aprovação, Negativismo/pessimismo e em Padrões Inflexíveis, quando comparadas ao grupo de não-vítimas. Para o grupo de vítimas do sexo feminino, regressões múltiplas indicaram que os EIDs explicam a variância dos sintomas de depressão (36%), ansiedade (28%) e estresse (26%). Para os adolescentes do sexo masculino, os EIDs também explicam a variância dos sintomas de depressão (43%), ansiedade (38%) e estresse (39%). Os resultados são discutidos a partir dos pressupostos da Terapia dos Esquemas. Implicações para políticas públicas e práticas de intervenção são consideradas.
A Psicoterapia Infantil no Setting Clínico: Uma Revisão Sistemática de Literatura
Authors: Brito Rosa Angela Cortez , Montezuma Sarah , Melo Anna Karynne , Moreira Virginia
Published: December 2020

A psicoterapia destaca-se como modalidade de atendimento à criança. Ressalta-se a importância de discutir sobre a psicoterapia infantil, pelo aumento da procura por esse serviço. Com o objetivo de reconhecer como a psicoterapia infantil tem sido conceituada e exercida, foi realizada uma revisão sistemática nas bases de dados BVS, Science Direct e SAGE Pubs, no período entre 2008 e 2018. Dos estudos encontrados, 67 artigos atenderam aos critérios de inclusão. Constatou-se que a psicoterapia infantil vem se configurando como uma prática fundamental frente às demandas existentes, bem como um campo de produção científica e de práxis voltada às demandas em cada cultura. Verificou-se que as vivências infantis têm sido olhadas com mais cuidado e com uma compreensão mais abrangente nesse campo de atuação. Conclui-se que há abrangente discussão sobre os avanços da psicoterapia infantil, assim como a permanente necessidade de investigação e de aprimoramento.
Chagas Disease Screening Using Point-of-Care Testing in an At-Risk Obstetric Population
Authors: Zamora Lindsey E. , Palacio Federico , Kozlowski Debra S. , Doraivelu Kamini , Dude Carolynn M. , Jamieson Denise J. , Haddad Lisa B.
Published: December 2020

Congenital transmission is the most important mode of transmission of Chagas disease (CD) in non-endemic countries. Identifying CD in reproductive-aged women is essential to reduce the risk of transmitting the disease to their children and offer treatment to women and their children, which could cure the disease. We evaluated the use of point-of-care (POC) testing for CD in postpartum patients. In our patient population, 16.7% (23/138) tested positive by POC testing, but confirmatory testing was negative for all patients. Among those considered high risk, 30% declined participation. Our results suggest limited utility of the point-of-care test used in our study and identify an opportunity for improvement to broaden diagnostic testing options. Our study also highlights the need to develop strategies to increase subject participation in future research.
La cultura del autorretrato en su desarrollo histórico
Authors: Mena García Enrique
Published: December 2020

La introspección del propio yo en el autorretrato recoge variedad de significados y tipologías en el universo de las artes, un juego que en pintura lleva siglos realizándose. El retrato tuvo con la irrupción de la fotografía un revulsivo, pero con la llegada de la era digital el autorretrato se ha incrementado exponencialmente, adaptando el término inglés “selfie”. La presente investigación ofrece un análisis de este género, que desde la época clásica sienta las bases, a partir del mito de Narciso, de un cierto ego y vanidad ligados al autorretrato. Ya sea en pintura o fotografía, este género destaca por una idea de unión espiritual a modo de máscara que desvela en ocasiones lo emocional y transciende hacia la inmortalidad. Con la aparición de los teléfonos móviles, los avances en cámaras digitales y, en general, las nuevas tecnologías, el autorretrato obtiene aún mayor fuerza, pues estas últimas nos permiten detener el tiempo y autorreflejarnos como en un espejo, además de que el uso tan extendido de los nuevos soportes nos convierte en dominadores de la composición.
ROLE OF PHYSICAL EDUCATION IN INTELLECTUAL, MORAL, LABOR AND AESTHETIC EDUCATION
Authors: Afraimov A , Akramov A
Published: December 2020

The article presents opinions on the importance of education inensuring the continuity, role and continuity of the physicaleducation in mental, moral, labor and aestheticeducation. The questions of the transformation of aesthetic education intosocial and spiritual necessity and its impact on the effectiveness of qualityeducation.
A crônica no Brasil: um gênero em mutação
Authors: Magri Dirceu
Published: December 2020

RESUMO: Trata-se de reflexões sobre uma das principais características da crônica: sua capacidade de adaptação (mutação) ao longo do desenvolvimento dos periódicos. Reflete-se ainda, neste estudo, sobre a transferência cultural França-Brasil, destacando-se os jornais como arcabouço de tal transposição. Por fim, ressalta-se a presença de grandes autores no gênero, em que ora atuam como romancistas, ora como cronistas e, dentre eles, Machado de Assis como um dos esteios da crônica no Brasil.

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RÉSUMÉ: Il s'agit de réflexions sur l'une des principales caractéristiques de la chronique : sa capacité d'adaptation (mutation) tout au long de l'élaboration des périodiques. On réfléchit dans cette étude encore sur les transferts culturels France-Brésil, en particulier les journaux comme pivot de cette mise en œuvre. Enfin, on relève la présence de grands auteurs dans le genre, où ils jouent le rôle tantôt de romanciers, tantôt de chroniqueurs et, parmi eux, Machado de Assis comme l'un des piliers de la chronique au Brésil.
Interfaces de escritas coletivas em rede: um estudo de caso do jogo Chromaroma
Authors: Brandalise Isabella Von Mühlen , Camara Rogério
Published: December 2020

No presente artigo apresenta-se o resultado de reviso terica sobre sistemas coletivos contemporneos e pesquisa de visualizao de dados urbanos gerados colaborativamente. O objetivo foi analisar o comportamento emergente da produo de informao e as potencialidades narrativas de uma escrita coletiva em rede. A pesquisa foi iniciada a partir dos conceitos de cultura RAM, emergncia, relaes subjetivas no espao urbano, deriva e psicogeografia. Realizou-se ainda um estudo de caso do jogo digital e fsico Chromaroma, considerado representativo para o trabalho proposto, uma vez que os jogadores ressignificam a cidade e seu tradicional sistema de transporte a partir da experincia das partidas.
Tecnologias aplicadas a produção editorial de periódicos científicos: estudo de caso da revista Acta Amazonica | Technologies applied to the editorial production of scientific journals and a case study of the journal Acta Amazonica
Authors: Fernandes Tito Lívio do Nascimento , Falcão Franciane Da Silva
Published: December 2020

Periódicos científicos constituem a principal forma de comunicação acadêmica e são balizados por instituições indexadoras, provedoras e bibliotecas científicas. O cenário tecnológico no qual se encontram e a análise dos periódicos científicos brasileiros em melhor posição no ranking do Journal Citation Reports (JCR) são apresentados como parâmetro para a análise da revista Acta Amazonica, sob a ótica do processo de produção editorial e dando ênfase à mudança de suporte, de impresso para on-line e suas implicações. Esta avaliação apoia-se em dados a respeito da publicação online de 2004 a 2017 e nas implicações tecnológicas que interferiram na gestão editorial utilizada neste período de tempo. Estas informações podem colaborar para gerar diretrizes para o gerenciamento da produção dos periódicos científicos.*****Scientific periodicals are the main form of academic communication and are marked by indexing institutions, providers and scientific libraries. The correspondent technological scenario of theses journals and the analysis of the Brazilian scientific journals in the best position in the Journal Citation Reports (JCR) ranking are presented as parameters for the analysis of the scientific journal Acta Amazonica, under the optics of the editorial production process, with emphasis on moving from print to online support and its implications. This evaluation is based in online publication data from 2004 to 2017 and on the technological implications that interfered in the editorial management used in this period of time. This information can collaborate to generate guidelines for the management of the production of scientific journals.
Design da informação, modelos mentais e a gestão da inovação: articulações possíveis
Authors: Mineiro Érico Franco
Published: December 2020

Este artigo um ensaio acadmico, que tem como objetivo evidenciar potencialidades negligenciadas de integrao do design da informao gesto da inovao. Apresenta-se como base reviso bibliogrfica no mbito de trs campos: design da informao, cognio, e gesto da inovao. A reviso organizada de modo entrelaado, e seguida de discusso crtica. A perspectiva gerencial da inovao tecnolgica introduzida, e o design da informao discutido como uma atividade transversal em trs diferentes papis:(1) como atividade de apoio produo de sentido e reduo da assimetria de informaes, (2) como ferramenta para a triangulao de mtodos e resultados, e (3) como promotor da aprendizagem situada. Os efeitos do design da informao em diferentes tipos de modelos mentais de usurios e designers so discutidos em relao a estes papis. Requisitos, limitaes e potencialidades para os diferentes modos de integrao so evidenciados e discutidos.
The Altamira Collection and the history of the Dutch Revolt
Authors: Parker Geoffrey
Published: December 2020

La Colección Altamira, nombre con el que es conocido entre los historiadores modernistas el excepcional archivo atesorado durante siglos por los condes de Altamira, es uno de los fondos documentales más importantes para el estudio de la Monarquía Hispánica y en especial del reinado de Felipe II. La ruina de la Casa de Altamira provocó la dispersión de su archivo a partir de 1868, cuyos papeles fueron adquiridos por distintos compradores, entre los que se contaba Archer Milton Huntington, fundador de “The Hispanic Society of America”. El magnate adquirió la colección de libros y manuscritos del marqués de Jerez de los Caballeros, única en su género, y cuyos papeles en una gran parte eran de procedencia Altamira. The Library of the Hispanic Society of America conserva hoy una parte significativa del acervo documental Altamira que constituye, junto a los demás fondos repartidos por Europa, un repositorio documental de obligada consulta para los historiadores de la Revuelta de los Países Bajos.
ESTIMATION OF NITROUS OXIDE EMISSIONS FROM AGRICULTURAL SOILS IN VOIVODESHIPS IN POLAND
Authors: Jędrejek Anna
Published: December 2020

The purpose of this study was to estimate nitrogen oxide emissions from soils used for agricultural purposes by voivodships. Compared N2O emissions were estimated according to the recommended IPCC (tier 1) method with simulated emissions using the DNDC (tier 3) model. Analyses were done for crop rotation (winter rape, winter wheat, winter wheat, winter triticale) in four cropping systems. Moreover, simulated N2O emissions from winter rape and winter triticale cultivation showed lower emissions and constituted 1475% and 13-76% of IPCC estimated emissions, respectively. The use of the model also enabled the determination of factors, which have an impact on nitrous oxide emissions and define its regional differentiation. The analysis showed that with increasing initial soil organic content, emissions of N2O rise and decrease with increasing precipitation or carbon sequestration. Considering the requirements for reduction GHG emissions, improving the methodology used in estimating nitrous oxide emissions is of significant practical value.
Terror no Cone Sul: O fundamentalismo islâmico e o Caso Amia - 1994
Authors: Teles Paulo Roberto Alves
Published: December 2020

O presente artigo é fruto de investigações iniciais e tem como objetivo analisar o processo de formação do fundamentalismo islâmico contemporâneo e o atentado contra a Associação Mútua Israelita Argentina (AMIA) em Buenos Aires. Para isso, utilizamos como metodologia a análise historiográfica sobre o nascimento do fundamentalismo islâmico e os seus principais elementos ideológicos como também obras e reportagens que se debruçaram sobre o atentado contra a AMIA. O trabalho se dedica a retomar o debate acadêmico sobre o nascimento do fundamentalismo islâmico como uma ferramenta de ativismo político e nesse sentido, entende que o atentado promovido em Buenos Aires teria sido um desdobramento desse posicionamento ideológico. Soma-se a isso, os elementos antissemitas históricos presentes na Argentina, que reúne simultaneamente as maiores comunidades judaicas e árabes da América Latina. Corrupção, negligência e envolvimento de agentes do governo argentino também foram considerados nesse trabalho como aspectos potencializadores para esse traumático evento que ainda continua imerso a suspeitas e questionamentos. Palavras-chave: Extremismo; Fundamentalismo Islâmico; América Latina