bluuebunny/crossref_metadata_2025 huggingface dataset:
Makna Pendidikan Jasmani Bagi Siswa Ditinjau dari Aspek Tanggung Jawab
Authors: Karisman Vicki Ahmad , Wahyuni Desi Sri
Published: February 2022

Penelitian ini dilakukan untuk mengetahui makna pendidikan jasmani bagi siswa ditinjau dari aspek tanggung jawab di SMA Negeri 1 Pangalengan. Pendidikan jasmani menjadi tema dalam penelitian ini karena peranannya dalam pendidikan sangat penting. Perkembangan kurikulum menjadikan pendidikan karakter dilakukan secara lebih sistematis. Maka perlu adanya penelitian untuk mengetahui pelaksanaan hal tersebut.   Penelitian ini merupakan penelitian kuantitatif yang metodenya menggunakan metode survei. Data diperoleh dengan menggunakan angket langsung dan tertutup mengenai tanggung jawab melalui google form (digital) yang dibagikan kepada para responden yang dipilih menggunakan teknik Purposive Sampling yang yang berjumlah total 30 responden. Uji Validitas dilakukan dengan menggunakan analisis korelasi rumus Product Moment dari Pearson dengan hasil 25 butir instrumen yang valid. Sedangkan untuk mengetahui reliabilitasnya, data dianalisis menggunakan rumus koefisien alpha, kemudian hasilnya di bandingkan dengan tingkat keandalan koefisien korelasi. Berdasarkan analisis tersebut, instrumen penelitian ini dinyatakan reliabel untuk digunakan dalam pengumpulan data.  Hasil penelitian yang diperoleh menunjukkan bahwa skor rata-rata yang diperoleh oleh responden sebesar 85,3667. Secara keseluruhan, jawaban responden mengenai aspek tanggung jawab mendekati skor maksimal. Pendidikan jasmani mengajarkan aspek – aspek tanggung jawab yang paling tinggi adalah mengajarkan untuk berempati dengan presentase 27,1% dan yang paling rendah adalah mengajarkan untuk memiliki kesadaran atas tanggung jawabnya dengan presentase 23,7%. Berdasarkan hal tersebut dapat disimpulkan bahwa penerapan pendidikan pendidikan jasmani dapat memberi makna bagi siswa ditinjau dari aspek tanggung jawab.
REDUCTION OF EFFECT OF GROWTH STRESS PRESENCE USING ENDLESS SCREW DURING KILN DRYING AND STEAMING AND HEATING TREATMENT IN LOG BEFORE SAWING
Authors: MOYA RÓGER , TENORIO CAROLINA
Published: February 2022

The relaxation of growth stress in trees growing in fast-growth conditions, as plantation in tropical areas, affects lumber quality during of sawing or drying process. It was evaluated two pretreatments (heating and steaming application) before sawing process and endless screw use to maintain the boards pressed during drying ofDipteryx panamensisand Hieronyma alchorneoideswood with objective to reduce the effects of relaxation of growth stress. Theresults showed endless screw is used to maintain the boards pressed, the moisture content (MC) or drying rate did not vary. The use of endless screws with daily adjustment during drying produced a reduction of cup, check and split defects in lumber and this treatment is accompanied with a pre-treatment before sawing (heating or steaming treatment) decreased theincidence of drying defects. Then the use of both treatments is an opportunity to reduce theeffects of relaxation of growth stress on the quality of the wood of D. panamensisand H.alchorneoidesfrom fast-growth plantation conditions.
A Transiting, Temperate Mini-Neptune Orbiting the M Dwarf TOI-1759 Unveiled by TESS
Authors: Espinoza Néstor , Pallé Enric , Kemmer Jonas , Luque Rafael , Caballero José A. , Cifuentes Carlos , Herrero Enrique , Sánchez Béjar Víctor J. , Stock Stephan , Molaverdikhani Karan , Morello Giuseppe , Kossakowski Diana , Schlecker Martin , Amado Pedro J. , Bluhm Paz , Cortés-Contreras Miriam , Henning Thomas , Kreidberg Laura , Kürster Martin , Lafarga Marina , Lodieu Nicolas , Morales Juan Carlos , Oshagh Mahmoudreza , Passegger Vera M. , Pavlov Alexey , Quirrenbach Andreas , Reffert Sabine , Reiners Ansgar , Ribas Ignasi , Rodríguez Eloy , López Cristina Rodríguez , Schweitzer Andreas , Trifonov Trifon , Chaturvedi Priyanka , Dreizler Stefan , Jeffers Sandra V. , Kaminski Adrian , López-González María José , Lillo-Box Jorge , Montes David , Nowak Grzegorz , Pedraz Santos , Vanaverbeke Siegfried , Zapatero Osorio Maria R. , Zechmeister Mathias , Collins Karen A. , Girardin Eric , Guerra Pere , Naves Ramon , Crossfield Ian J. M. , Matthews Elisabeth C. , Howell Steve B. , Ciardi David R. , Gonzales Erica , Matson Rachel A. , Beichman Charles A. , Schlieder Joshua E. , Barclay Thomas , Vezie Michael , Villaseñor Jesus Noel , Daylan Tansu , Mireies Ismael , Dragomir Diana , Twicken Joseph D. , Jenkins Jon , Winn Joshua N. , Latham David , Ricker George , Seager Sara
Published: February 2022

We report the discovery and characterization of TOI-1759 b, a temperate (400 K) sub-Neptune-sized exoplanet orbiting the M dwarf TOI-1759 (TIC 408636441). TOI-1759 b was observed by TESS to transit in Sectors 16, 17, and 24, with only one transit observed per sector, creating an ambiguity regarding the orbital period of the planet candidate. Ground-based photometric observations, combined with radial-velocity measurements obtained with the CARMENES spectrograph, confirm an actual period of 18.85019 ± 0.00014 days. A joint analysis of all available photometry and radial velocities reveals a radius of 3.17 ± 0.10 R
⊕ and a mass of 10.8 ± 1.5 M
⊕. Combining this with the stellar properties derived for TOI-1759 (R
⋆ = 0.597 ± 0.015 R
⊙; M
⋆ = 0.606 ± 0.020 M
⊙; T
eff = 4065 ± 51 K), we compute a transmission spectroscopic metric (TSM) value of over 80 for the planet, making it a good target for transmission spectroscopy studies. TOI-1759 b is among the top five temperate, small exoplanets (T
eq < 500 K, R

p
< 4 R
⊕) with the highest TSM discovered to date. Two additional signals with periods of 80 days and >200 days seem to be present in our radial velocities. While our data suggest both could arise from stellar activity, the later signal’s source and periodicity are hard to pinpoint given the ∼200 days baseline of our radial-velocity campaign with CARMENES. Longer baseline radial-velocity campaigns should be performed in order to unveil the true nature of this long-period signal.
On Far-infrared and Submillimeter Circular Polarization
Authors: Draine B. T.
Published: February 2022

Interstellar dust grains are often aligned. If the grain alignment direction varies along the line of sight, the thermal emission becomes circularly polarized. In the diffuse interstellar medium, the circular polarization at far-infrared and submillimeter wavelengths is predicted to be very small, and probably unmeasurable. However, circular polarization may reach detectable levels in photodissociation regions viewed through molecular clouds, in infrared dark clouds, and in protoplanetary disks. Measurement of circular polarization could help constrain the structure of the magnetic field in infrared dark clouds, and may shed light on the mechanisms responsible for grain alignment in protoplanetary disks.
Ultraviolet Observations of Comet 96/P Machholz at Perihelion
Authors: Raymond J. C. , Giordano S. , Mancuso S. , Povich Matthew S. , Bemporad A.
Published: February 2022

Ultraviolet spectra of Comet 96/P Machholz were obtained during its 2002 perihelion with the UltraViolet Coronagraph Spectrometer instrument on board the SOHO satellite. Emission from H i, C ii, C iii, and O i is detected near the nucleus. The outgassing rate is in line with the value extrapolated from rates at larger distances from the Sun, and abundances of C and O are estimated. Reconstructed images show a nearly spherical cloud of H i Lyα emission and an ion tail seen in C iii. Radiation pressure on the hydrogen atoms produces a modest distortion of the shape of the Lyα cloud as seen from SOHO and Doppler shifts up to 30 km s−1 in the outer parts of the cloud. We estimate a ratio of C to H2O similar to what is observed in other comets, so low carbon abundance does not account for the anomalously low C2 and C3 ratios to NH2 observed at optical wavelengths.
Photospheric Prompt Emission From Long Gamma Ray Burst Simulations. II. Spectropolarimetry
Authors: Parsotan Tyler , Lazzati Davide
Published: February 2022

Although gamma ray bursts (GRBs) have been detected for many decades, the lack of knowledge regarding the radiation mechanism that produces the energetic flash of radiation, or prompt emission, from these events has prevented the full use of GRBs as probes of high-energy astrophysical processes. While there are multiple models that attempt to describe the prompt emission, each model can be tuned to account for observed GRB characteristics in the gamma and X-ray energy bands. One energy range that has not been fully explored for the purpose of prompt emission model comparison is that of the optical band, especially with regard to polarization. Here, we use an improved Monte Carlo radiation transfer code to calculate the expected photospheric optical and gamma-ray polarization signatures (Πopt and Π
γ
, respectively) from a set of two relativistic hydrodynamic long GRB simulations, which emulate a constant and variable jet. We find that time-resolved Πopt can be large (∼75%) while time-integrated Πopt can be smaller due to integration over the asymmetries in the GRB jet where optical photons originate; Π
γ
follows a similar evolution as Πopt with smaller polarization degrees. We also show that Πopt and Π
γ
agree well with observations in each energy range. Additionally, we make predictions for the expected polarization of GRBs based on their location within the Yonetoku relationship. While improvements can be made to our analyses and predictions, they exhibit the insight that global radiative transfer simulations of GRB jets can provide with respect to current and future observations.
What’s in a Name? Quantifying the Interplay between the Definition, Orientation, and Shape of Ultra-diffuse Galaxies Using the Romulus Simulations
Authors: Van Nest Jordan D. , Munshi F. , Wright A. C. , Tremmel M. , Brooks A. M. , Nagai D. , Quinn T.
Published: February 2022

We explore populations of ultra-diffuse galaxies (UDGs) in isolated, satellite, and cluster environments using the Romulus25 and Romulus C simulations, including how the populations vary with UDG definition and viewing orientation. Using a fiducial definition of UDGs, we find that isolated UDGs have notably larger semimajor (b/a) and smaller semiminor (c/a) axis ratios than their non-UDG counterparts, i.e., they are more oblate, or diskier. This is in line with previous results that adopted the same UDG definition and showed that isolated UDGs form via early, high-spin mergers. However, the choice of UDG definition can drastically affect what subsets of a dwarf population are classified as UDGs, changing the number of UDGs by up to ∼45% of the dwarf population. We also find that a galaxy’s classification as a UDG is dependent on its viewing orientation, and this dependence decreases as environmental density increases. Overall, we conclude that some definitions for UDGs used in the literature manage to isolate a specific formation mechanism for isolated dwarfs, while less restrictive definitions erase a link to the formation mechanism. Thus, how we define UDG populations must be considered if we want to understand the formation and evolution of UDGs.
The role of vigilance on a discrete-time predator-prey model
Authors: AlSharawi Ziyad , Pal Nikhil , Chattopadhyay Joydev
Published: February 2022

The change of behaviors of prey in the form of vigilance significantly affects the dynamics of a predator-prey system. In this paper, we consider a discrete-time predator-prey model, where the vigilance of prey acts as a trade-off between the safety and growth rate of the prey. Mathematical properties such as stability, permanence, both flip and Neimark-Sacker bifurcations of the model are investigated. Numerical simulations are carried out to illustrate the analytical findings and to explore the impact of prey vigilance on the dynamics of the system.
Existence and essential stability of Nash equilibria for biform games with Shapley allocation functions
Authors: Liu Chenwei ,   School of Mathematics and Statistics, Guizhou University, Guiyang, Guizhou 550025, China, Xiang Shuwen , Yang Yanlong ,   College of Mathematical and Information Science, Guiyang University, Guiyang, Guizhou 550005, China
Published: February 2022

We define the Shapley allocation function (SAF) based on the characteristic function on a set of strategy profiles composed of infinite strategies to establish an n-person biform game model. It is the extension of biform games with finite strategies and scalar strategies. We prove the existence of Nash equilibria for this biform game with SAF, provided that the characteristic function satisfies the linear and semicontinuous conditions. We investigate the essential stability of Nash equilibria for biform games when characteristic functions are perturbed. We identify a residual dense subclass of the biform games whose Nash equilibria are all essential and deduce the existence of essential components of the Nash equilibrium set by proving the connectivity of its minimal essential set.
The Hungarian State and Diasporic Intervention in the United States in the Early Twentieth Century
Authors: Poznan Kristina E.
Published: February 2022

Austria-Hungary’s leaders were highly interventionist in their response to trans-Atlantic migration, eager to maintain loyalty among their diaspora in America. This article explores the very active role that the Austro-Hungarian government—especially the Hungarian Prime Minister’s Office—played in overseeing migrant loyalty in the United States from 1902 until World War I, examining both its successes and the protests it inspired. Intervention followed migrants overseas: the government integrated itself into the migration bureaucracy and attempted to integrate the home government into migrants’ American lives through the press, churches, and cultural events. Several of Austria-Hungary’s efforts to maintain the loyalty of its migrating citizens backfired, sparking protest.
Repatriation or Redefection? Cold War Refugees as Contested Assets, 1955–1956
Authors: Mazurkiewicz Anna
Published: February 2022

The article examines the response of a united representation of Cold War era exiles (Assembly of Captive European Nations, ACEN) to the Moscow-inspired repatriation campaign of 1955. The article’s focus rests on the US-sponsored exile political activities carried under the aegis of the Free Europe Committee. The year 1955 serves as a particularly interesting moment when both key adversaries in the Cold War were engaged in programs using migration as a tool to advance their political goals. The issue of political exiles’ agency is signaled based on the Polish case in the context of American redefection programs and Washington’s response to the Soviet Bloc campaign to demoralize anti-communist escapees and induce their return.
Slovenske priseljenke v Trstu: vprašanje identitete ob ljudskem štetju 1910
Authors: Cergol Paradiž Ana , Testen Koren Petra
Published: February 2022

Članek analizira vlogo slovenskih služkinj, večinoma priseljenk iz slovenskega okoliškega bazena in bližnjih avstrijskih dežel, ob popisu prebivalstva leta 1910 v Trstu. Osredotoča se na njihovo avtonomno ravnanje glede na odvisni položaj znotraj gospodinjstev ter pritiske javnosti oz. slovenskih in italijanskih nacionalnih elit v mestu. Raziskava ob pomoči javnega diskurza, arhivskega gradiva in kvantitativne analize vzorca popisnih pol cenzusa sintetizira zlasti pomen podatkov, kot sta občevalni jezik in kraj izvora služkinj, in jih interpretativno umešča v kontekst (nacionalne) identitete.
ECG Generator for Educational Biomedical Engineering Laboratory
Authors: Aqil Mounaim , Jbari Atman
Published: February 2022

The aim of this work is to design and implement an ECG generator for didactic biomedical engineering laboratory. The proposed generator provides analog ECG signals using synthesized or experimental records. The technique used in this work consists to generate the desired ECG waveforms through the PWM outputs of an Arduino board and low-pass filter. To provide many educational functions in both analog instrumentation and digital processing, the generator supplies output voltages in asymmetric or differential mode. To allow the user to setup the ECG signal to be generated, a LabVIEW application has been implemented. Experimentations on proposed generator and results were accomplished using the NI USB 6009 acquisition module and NI MAX software.
Improved Semantic Representation Learning by Multiple Clustering for Image-Based 3D Model Retrieval
Authors: Chu Jinghui , Zhao Xiaoqian , Song Dan , Li Wenhui , Zhang Shenyuan , Li Xuanya , Liu An-An
Published: February 2022

Under the heavy management on the increasing 3D models, the topic of image-based 3D model retrieval which organizes unlabeled 3D models based on abundant knowledge learned from labeled 2D images has drawn attention. However, prior methods are limited in aligning semantically at corresponding categories of two domains due to the lack of label information in the 3D domain. To this end, this paper proposes an improved semantic representation learning by multiple clustering approach, which improves the reliability of pseudo labels for 3D models, so as to achieve class-level semantic alignment. Specifically, this paper first extracts features for 2D images and 3D models. Then it clusters combining the 3D features with the semantic information from multiple clustering on 3D model features to obtain more reliable target pseudo labels. Extensive experiments have shown that the proposed method has achieved the gain of 3.0%-205.0% averagely for popular retrieval metrics on the benchmark of monocular image-based 3D object retrieval (MI3DOR), and 1.3%-69.7% on another advanced benchmark, MI3DOR-2.
A Semantic Framework Supporting Multilayer Networks Analysis for Rare Diseases
Authors: Capuano Nicola , Foggia Pasquale , Greco Luca , Ritrovato Pierluigi
Published: February 2022

Understanding the role played by genetic variations in diseases, exploring genomic variants and discovering disease-associated loci are among the most pressing challenges of genomic medicine. A huge and ever-increasing amount of information is available to researchers to address these challenges. Unfortunately, it is stored in fragmented ontologies and databases, which use heterogeneous formats and poorly integrated schemas. To overcome these limitations, we propose a linked data approach, based on the formalism of multilayer networks, able to integrate and harmonize biomedical information from multiple sources into a single dense network covering different aspects on Neuroendocrine Neoplasms (NENs). The proposed integration schema consists of three interconnected layers representing, respectively, information on the disease, on the affected genes, on the related biological processes and molecular functions. An easy-to-use client-server application was also developed to browse and search for information on the model supporting multilayer network analysis.
Base temperature, cycle duration, and thermal constant for yacon culture
Authors: Sales Ramon Amaro de , Oliveira Evandro Chaves de , Xavier Alexandre Cândido , Oliveira Fábio Luiz de , Pezzopane José Eduardo Macedo , Silva Diego Mathias Natal da , Berilli Sávio da Silva
Published: February 2022

Yacon is a perennial herbaceous plant that naturally occurs in South America at altitudes ranging from 2,000 m to 3,100 m above sea level. The yacon culture has recently grown in popularity as it has high productive potential in mild climates and multiple benefits to human health. This study aimed to determine the lower and upper base temperatures, cycle duration, and thermal constant for the yacon culture, based on phenological data from field experiments that were carried out during three growing seasons (fall, winter, and spring) in 2013. The experiments were conducted in the municipality of Ibatiba in the state of Espírito Santo, Brazil, in a randomized block design with four replicates. The lower base temperature was determined using methods of the lowest standard deviation in days and degree-days, relative development, and variation coefficient in degree-days for two subperiods: emergence to maturation, and onset of tuberization to maturation. The upper base temperature was determined by the standard deviation and coefficient of variation methods, both in degrees-days. The relationship between meteorological elements and the onset of tuberization was also investigated. The lower base temperature values determined for yacon were 12.5ºC in the two subperiods studied with a base temperature above 34.0ºC. The productivity of these tuberous roots was higher in the fall because of the longer cycle, lower temperature, and lower photoperiod. In turn, a higher thermal sum was needed to initiate tuberization with the delay of planting.
Selection for grain size and sieve yield in F3 common bean genotypes using linear mixed models
Authors: Amaral Erisson Lubacheski do , Woyann Leomar Guilherme , Baretta Douglas Rodrigo , Gobatto Débora Regiane , Paula Giovanni Silva de , Kafer João Matheus , Amaral José Eduardo Lubacheski do , Finatto Taciane
Published: February 2022

Grain size is an essential trait in common bean breeding as it determines the acceptance of a new cultivar by producers, consumers, and the industry. The objectives of this study were to identify the ideal traits for selecting common bean lines in the F3 generation to obtain an adequate sieve yield and to identify the best lines for sieve yield by applying early generation selection. Two trials were conducted in two locations during the 2016/2017 crop season. These trials were composed of 300 F3 populations and two parents (used as checks). The experimental design used was an augmented block design without repetition for the treatments (lineages). After harvest, the grain yield, yield components, and sieve yield (SY) were evaluated. In conclusion, selection in the F3 generation can be performed for sieve yield, considering the traits SY12+13, SY14, and relative grain yield, as they present the highest values of heritability and greatest correlation between genotype and performance in the evaluated environments. Additionally, the lines selected to continue in the breeding program are composed of the 15 best lineages for traits SY12+13, SY14, and relative grain yield. Preference should be given to lines that excel in more than one of these traits.
Water absorption and storage tolerance of soybean seeds with contrasting seed coat characteristics
Authors: Abati Julia , Zucareli Claudemir , Brzezinski Cristian Rafael , Lopes Ivani de Oliveira Negrão , Krzyzanowski Francisco Carlos , Moraes Larissa Alexandra Cardoso , Henning Fernando Augusto
Published: February 2022

Seed coat characteristics may be related to seed quality and longevity, attracting the interest of breeding programs. This study aimed to evaluate the relationship between the water absorption parameters and storage tolerance of soybean seeds with contrasting seed coat characteristics. For this purpose, seeds of five soybean cultivars with different seed coat colors and lignin contents were used. Before storage, the seed coat lignin content, moisture content, water absorption rate in 11 hydration periods (1, 2, 3, 4, 5, 6, 7, 8, 24, 32, and 48 hours), hydration speed index, germination, viability, and seed vigor were determined. After six months of storage in a dry and cold chamber (at 11ºC and 54% relative humidity [RH]) and uncontrolled environment (at 25ºC and 71% RH), the seeds were evaluated for germination, viability, and vigor to quantify changes in their physiological quality during storage and relate them to the seeds water absorption parameters for the different cultivars. The seed coat lignin content is negatively correlated with the seeds water absorption parameters. Soybean cultivars have different storage tolerance levels. Seeds that absorb larger amounts of water have lower tolerance to deterioration related to temperature and relative humidity fluctuations that occur in storage under uncontrolled conditions, negatively affecting the physiological potential of seeds.
The Discovery of Chicken Foxp3 Demands Redefinition of Avian Regulatory T Cells
Authors: Burkhardt Nina B , Elleder Daniel , Schusser Benjamin , Krchlíková Veronika , Göbel Thomas W , Härtle Sonja , Kaspers Bernd
Published: February 2022

Since the publication of the first chicken genome sequence, we have encountered genes playing key roles in mammalian immunology, but being seemingly absent in birds. One of those was, until recently, Foxp3, the master transcription factor of regulatory T cells in mammals. Therefore, avian regulatory T cell research is still poorly standardized. In this study we identify a chicken ortholog of Foxp3. We prove sequence homology with known mammalian and sauropsid sequences, but also reveal differences in major domains. Expression profiling shows an association of Foxp3 and CD25 expression levels in CD4+CD25+ peripheral T cells and identifies a CD4−CD25+Foxp3high subset of thymic lymphocytes that likely represents yet undescribed avian regulatory T precursor cells. We conclude that Foxp3 is existent in chickens and that it shares certain functional characteristics with its mammalian ortholog. Nevertheless, pathways for regulatory T cell development and Foxp3 function are likely to differ between mammals and birds. The identification and characterization of chicken Foxp3 will help to define avian regulatory T cells and to analyze their functional properties and thereby advance the field of avian immunology.
Regulation of MHC Class I Expression in Lung Epithelial Cells during Inflammation
Authors: Mathé Justine , Benhammadi Mohamed , Kobayashi Koichi S , Brochu Sylvie , Perreault Claude
Published: February 2022

Lung infections are a perennial leading cause of death worldwide. The lung epithelium comprises three main cell types: alveolar type I (AT1), alveolar type II (AT2), and bronchiolar cells. Constitutively, these three cell types express extremely low amounts of surface MHC class I (MHC I) molecules, that is, <1% of levels found on medullary thymic epithelial cells (ECs). We report that inhalation of the TLR4 ligand LPS upregulates cell surface MHC I by ∼25-fold on the three subtypes of mouse lung ECs. This upregulation is dependent on Nlrc5, Stat1, and Stat2 and caused by a concerted production of the three IFN families. It is nevertheless hampered, particularly in AT1 cells, by the limited expression of genes instrumental in the peptide loading of MHC I molecules. Genes involved in production and response to cytokines and chemokines were selectively induced in AT1 cells. However, discrete gene subsets were selectively downregulated in AT2 or bronchiolar cells following LPS inhalation. Genes downregulated in AT2 cells were linked to cell differentiation and cell proliferation, and those repressed in bronchiolar cells were primarily involved in cilium function. Our study shows a delicate balance between the expression of transcripts maintaining lung epithelium integrity and transcripts involved in Ag presentation in primary lung ECs.
Eliminate Costly Component Out Of Pocket Defect Condition during Microelectronic Component Packaging/Shipping/Handling
Authors: Rochford Rich , Blanchette Craig
Published: February 2022

High value devices used in microwave modules and other microelectronic assemblies have become increasingly thin and susceptible to “Component Out Of Pocket” (COOP) conditions that can occur during packaging, shipping, and customer handling. This defect condition is especially problematic for automated assembly which strives to be touch-free and efficient with orderly device presentation.

COOP is a major contributor to “Cost Of Poor Quality” (COPQ) within the business. A funded study into COOP conditions was conducted and a dozen root causes were identified.

It was discovered that traditional “waffle packs” have mechanical issues related to flatness tolerances with respect to the waffle tray and lid. The addition of a standard clip further contributes to the issue, both of which are key root causes of the costly “Component Out Of Pocket” (COOP) condition.

A novel Lid-Clip System (LCS2) was engineered to compensate for those mechanical issues, bringing robust captivation and preservation of devices in waffle tray pockets. Static dissipative material for lid and clip was selected to provide unparalleled ESD Class 000 protection for high value devices with the lowest voltage susceptibility thresholds.
Burn-in-Testing (BIT) Challenge: to BIT or not to BIT?
Authors: Suhir E.
Published: February 2022

Burn-in testing (BIT) is a costly undertaking. Predictive modeling enables shading useful light on what and how should be tested, if at all. Three analytical (“mathematical”) predictive models recently suggested by the author are addressed in this mini-review: 1) A model based on the analysis of the infant mortality portion (IMP) of the bathtub curve (BTC) suggests that the non-random time derivative of the expected “statistical” failure rate (SFR) at the beginning of the IMP could be viewed as a suitable criterion (“figure of merit”) to answer the basic question of the BIT undertaking: “to BIT or not to BIT?” 2) A model based on the analysis of the random failure rate (RFR) of the mass-produced components that the manufactured product of interest is comprised of suggests that the above derivative is, in effect, the RFR variance of these components. 3) A model based on the use of the kinetic multi-parametric Boltzmann-Arrhenius-Zhurkov (BAZ) constitutive equation is employed to establish the BIT's adequate duration and level, if this kind of failure-oriented-accelerated-testing (FOAT) is found to be necessary. The theoretical findings are illustrated by calculated data. It is concluded that predictive modeling should always precede the actual BIT, that analytical modeling should always complement computer simulations and that future work should address the experimental validation and possible extension of the obtained results and recommendations.
State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding
Authors: Lau John H
Published: February 2022

In this study, the recent advances and trends of chiplet design and heterogeneous integration packaging will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, lateral interconnects, and examples of chiplet design and heterogeneous integration packaging. Also, emphasis is placed on the fundamental and examples of hybrid bonding.
High-Accuracy Pick-and-Place of Multiple Dies in Parallel Assisted by Capillary Self-Alignment
Authors: Brandstätter Birgit , Auer Benedikt , Klingler Hannes , Scherbaum Sabine
Published: February 2022

Self-assembly of components driven by liquid surface tension is an attractive complement and even alternative to traditional high-accuracy pick-and-place as it offers high accuracy despite inaccurate robotic part placement. While capillary self-alignment through liquid solder is the standard technology for flip-chip processes, this work presents self-alignment of dies on wetted receptors on a temporary carrier: Low-viscosity liquid is jetted on each receptor where the liquid is contained through generation of hydrophilic and hydrophobic sections on the temporary carrier by plasma treatment. Deterministic die feeding by low-accuracy pick-and-place is conducted for single dies, as well as for batches of three dies and nine dies optimizing the equipment for best throughput to achieve both high accuracy and high productivity. The industry-ready and fully automated chip-to-wafer pick-and-place process is implemented into a fan-out wafer-level packaging production flow proving that self-alignment is capable of easing the stringent requirement for robotic alignment capability for pick-and-place systems in fan-out packaging for the single die-level step in this production chain. The self-alignment process is optimized, and failure modes such as poor liquid confinement, surface contamination, or excess force are identified and eliminated. Post-bond accuracy of <3 μm @ 3 σ at each point of the die is reached for dies of 3.1 mm x 3.1 mm in size. Using parallel die handling, high speeds of around 10 000 units per hour are made possible.
Advanced Protected Fan-In WLCSP
Authors: Hackler Doug , Prack Ed
Published: February 2022

With the advent of bumped die new IC packages evolved: for low IO WLCSP (wafer level chip scale package), for high IO FC (flip chip) CBGA (ceramic ball grid array) and PBGA (plastic ball grid array). For low IO, protected CSP is an emerging and rapidly growing market. In 2020 the market exceeded $2B and is ramping to a forecast $2.5B by 2025.1 Initially WLCSP, also known as FI (fan in), packages were built on the wafer with no active side protection evolving to single sided protection from a package built on the wafer2 which transition to redistribution PSB (passivation stress buffer)3, PSBs were used on FC wafers for high IO BGA packages. These provided acceptable performance initially, however as devices became more complex and reliability requirements increased, these processes no longer provided the required reliability. To attain higher IO capability and better reliability performance evolved to CSP4 (non-WL) which allowed larger area for bump distribution and additional protection to the rest of the exposed die surfaces. Fully protected die CSP (without substrates or leadframes) was initially implemented with processes such as M-series utilizing a FO (fan out) process.5 To obtain higher reliability 6-sided die protection afforded by M-series type processes require die reconstitution, expensive tapes, molding, and other operations generally required in a FO process which can feasibly be eliminated in a WLCSP protected FI process. American Semiconductor's Semiconductor-on-Polymer™ (SoP™) 300mm FleX-TM WLCSP is an advanced packaging process optimized for protected fan-in. FleX-TM produces the thinnest and lowest cost protected FI the industry today. Protected FI process innovations can improve performance in power devices, RF switches, die stacking and thin board applications. This article includes background on the evolution of CSP and the comparison of SOTA (state of the art) FI processes including FleX-TM.
Structured glass substrates in wafer- and panel level packaging: Status and recent achievements.
Authors: Letz M. , Gotschke T. , Wagner F. , Heiss-Chouquet M. , Müller L. , Peuchert U. , Vanderpool D.
Published: February 2022

Glasses can be used as core substrate for panel- and/or wafer-level packaging to achieve heterogeneous integration of chiplets and integrated passives in increasingly complex packages. Glass has a large number of advantages: The stiffness of glass (i) allows manufacturing of highly accurate buildup layers. These buildup layers can have manufacturing precision of 1μm and below on large dies with sizes of 50mm x 50mm and more, needed for antenna in package (AiP) applications and high performance computing (HPC). Special glasses can be made with adjusted thermal expansion (CTE) (ii), either adjusted to silicon or with larger thermal expansion to allow packages with buildup layers of epoxy molds and metallization that see high thermal loads either during manufacturing or during operation. Glasses can also be optimized with very good dielectric properties (iii) and can be utilized in antenna-in-package applications. But most of all, economic glass structuring techniques (iv) which can provide millions of vias and thousands of cut-outs in a glass panel are important and are being developed. SCHOTTs Structured Glass Portfolio FLEXINITY® and related technologies provide an excellent starting point for highly sophisticated structured glass substrates required for Advanced Packaging. The biggest hurdle for a large-scale commercialization of glass panel packaging is industrial readiness along the whole process chain. This is needed, to bring glass panel packaging in applications like IC-packaging, RF-MEMS packaging and medical diagnostics or, in combination with cutouts for fan-out, embedding of active and passive components. In addition, metallization processes with good adhesion, excellent electrical properties and high geometric accuracy for glasses are an important step. In the current manuscript, we review the status and discuss our contribution towards achieving industrial readiness for glass in panel- and wafer-level packaging.
Reliability of Chiplets Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill
Authors: Chou Ricky Tsun-Sheng , Lau John H , Chen Gary Chang-Fu , Huang Jones Yu-Cheng , Yang Channing Cheng-Lin , Liu Hsing-Ning , Tseng Tzyy-Jang
Published: February 2022

In this study, the reliability of chiplets heterogeneous integration on a 2.3D hybrid substrate using solder joint and underfill is investigated. Emphasis is placed on the thermal cycling test and drop test of the structure. The test results are plotted into Weibull distributions, where the Weibull slope and characteristic life at median rank are presented. At 90% confidence, the true Weibull slope interval and the true characteristic life interval are also provided. A linear acceleration factor is adopted to map the solder joint reliability at test condition to the solder joint reliability at an operating condition. The failure location and failure mode of the chip/package assembly of the heterogeneous integration package are provided and discussed.
The Pivotal Role of Uniformity of Electrolytic Deposition Processes to Improve the Reliability of Advanced Packaging
Authors: Schmidt Ralf , Palm Jens , Knaup Jan M.
Published: February 2022

Heterogeneous integration is considered as the key technology to create large, complex System in Package (SiP) assemblies of separately manufactured, smaller components. Proper control of the uniformity of each process step constitutes one of the main challenges during integration of the different components into a higher-level assembly. In this context, processes that create thick layers by electrochemical deposition are especially susceptible to variations across the substrate. Such processes include copper pillar and bump as well as tin-silver applications. Insufficient coplanarity of electrolytic copper would result in significant reliability issues or evolution of stress in the package. Upcoming hybrid bump designs with features of different dimensions pose additional challenges to the electrolytic copper and tin-silver processes. Purposeful adjustment of differences between the heights of pillars of different diameters may be required after the copper process step in order to obtain the best uniformity for the complete stack with tin-silver on top. In addition to coplanarity, the electrolytic process should allow modification shape of the individual pillar or bump. In this context, a versatile copper electrodeposition process will be discussed that allows adjustment to a broad variety of uniformity parameters and combinations thereof. In combination with suitable tin-silver deposition processes, this process is expected to significantly improve the reliability of copper pillars and bumps for advanced packaging applications.
Thin film flexible circuits with embedded ASICs–Enabling technology for sophisticated medical applications
Authors: Kaiser A. , Matej P. , Hanka K. , Abel M. , Herbort C. , Lang R. , Pursche O. , Ruess K. , Keim U.
Published: February 2022

The requirements for thin film substrates have increased over the last years, as new materials, ongoing miniaturization and higher connectivity and complexity of circuit designs are arising. Especially the medical field, with its various application areas, drives the development of new technologies and new material combinations. Specifically, components for catheter or endoscope equipment are often difficult to realize, as limited space/cross section compete with the demand for higher functionality in the tip, and thus, requiring a higher number of connections to be routed out. One possibility to overcome this problem, is a local digitalization of the signals of the various sensors in the tip and doing a serial data transmission to the outside, reducing the required number of leads. To maintain a very small form factor, we have developed a technology that allows the direct integration of thinned ASIC chips into thin film flexible circuits. An example application, for the readout of catheter shape and positioning, was realized.

Our contribution will give an overview of the target application and describe the integration technology for the thinned dies together with the build-up of the thin film flexible circuits.
An Investigation into Thermomigration Failure of Flip Chip Solder Joint Interconnects used in High Reliability Applications
Authors: Morey Aimee M , Popelar Scott , Hook Julie
Published: February 2022

The experimental study described herein investigates thermomigration of both eutectic Sn/Pb and lead free Sn/Ag/Cu solder joints, with the additional focus on the development of an Arrhenius failure model of time-to- failure as a function of temperature. Flip chip test vehicles were assembled with daisy chain die, with and without underfill, attached to ceramic and organic package substrates, using standard reflow processes. Three different under bump metallurgy technologies were investigated: sputtered thin film Al/NiV/Cu, thick electroplated nickel, and thick electroplated copper (i.e., copper pillars). The test vehicles were subjected to unbiased high temperature storage (HTS) testing with temperatures ranging from 125°C to 200°C. Failure was determined from continuity testing at regular intervals until an open circuit or high resistivity was detected. The results demonstrate the robustness of Al/NiV/Cu UBM at temperatures less than 130°C, and of the thick electroplated UBM at temperatures of 150°C. Based on the HTS test results, and corresponding analyses, a thermomigration failure model was generated for eutectic Sn/Pb and lead free Sn/Ag/Cu solder alloys using an Arrhenius-like fit to the failure data.
Enhancing the Paste Release on 55μm pads with Water-Soluble Type 7 SAC305 Solder Paste for High Density SIP Application
Authors: Senthil Kumar B. , Rui Fen Zhang , Yam  , Huei Lip , HanWen Zhang , Sungsig Kang , Li-San Chan
Published: February 2022

The ultra-fine SAC305 solder is widely used as the lead-free solder composition for interconnection in advanced packaging based on its advantages such as good joint strength, thermo-mechanical fatigue behavior and creep resistance. Stencil printing remains the technology of choice for system-in-package (SiP) assembly because of its benefits such as economy of usage, ease of process control, flexibility of usage and fast and wide range of process window.

SiP involves the high-level integration of different components, Copper (Cu) pillar flip-chip dies and chips in one package to achieve multiple functions in one system. The need to accommodate ever increasing demand for reduced footprints requires the technology to constantly invent a range of Cu pillar 55μm diameter and smaller components. Many mobile communications SiP consist of 6 or more flip chips in a single package. Conventional flip-chip attach uses flux & Cu pillar solder cap for solder joint formation as it is challenging for solder paste to be printed on fine geometries below 70μm. Additional benefits of solder paste printing help eliminate non-wet Cu pillar defect rates and improve yield over conventional flux printing. Heraeus solder paste (AP series T7) makes use of ultra-fine spherical shape of solder powder to create strong metal coalesce for bonding during reflow process of Cu pillars mounting to substrates.

For example, the smallest passive component in use today is 008004 and Cu pillar diameter of 70um, which has a stencil opening of 125μm and 70μm respectively. Further reduction in Cu pillar flip-chip diameter of 55μm will require further reduction in stencil opening to 55μm, thus testing the limits of current type 7 pastes. Current solder pastes (AP series T7) can meet the consistency of printability when the stencil opening is 70μm or more. With smaller stencil opening, down to 55μm, the printing performance is less than desired. In this paper we describe the stencil printing application on the enhanced version of type 7 paste with a reinvented flux. The application tests were carried out using 55μm stencil opening. This paper will report the results of this application test.
Ultrasonic Wire Bond Outlier Classification
Authors: Seppänen Henri , Chua Siang Tat , Martinez Joel Elizondo , Villa Pedro
Published: February 2022

K&S developed and tested the Advanced Process Diagnostics (APD) algorithm to classify bonding outliers in ultrasonic wire bond production. APD is a software feature, part of Kulicke & Soffa wedge bonders to measure and analyze process signals and detect and classify bond outliers. APD helps bonder operators, production supervisors and process engineers to detect process deviations and fix the underlying root causes. APD measures bond signals, such as deformation, ultrasonic current and ultrasonic frequency. Bonds are automatically divided into subgroups based on bond order and process parameters and the signals within a subgroup are then normalized. For outlier classification, the features are extracted from the normalized signals and combined into failure class values. The failure classes, such as contamination, misaligned wire and unstable substrate, are calculated independently. Within the APD feature, a user can define limits for the failure class values and define bonder actions based on the severity of the detected outlier. We measured the detection rates for large wire Al bond failure classes and demonstrate how APD calculates failure class values from the signals. Additionally, we show how new signal features and failure classes can be defined to detect production specific or rare failure classes. Finally, we present outlier classification performance metrics against large production data sets.
Comprehensive Characterization of All Inorganic and Organic Components in Neutral Tin Plating Bath for Electronics Applications
Authors: Shalyt Eugene , Wang Jingjing , Parekh Vishal , Bai Chuannan , Liang Guang
Published: February 2022

Tin plating at neutral and near-neutral pH is the preferable process in the application of electronic components such as capacitors and resistors, where the chemically sensitive ceramic and glass portions can be damaged by highly acidic solutions (often used in semiconductor packaging processes). Stannous ions are not as stable at elevated pH due to oxidation and hydrolysis, and plating demands the use of a large number of additives making the process control very challenging. Various analytical techniques are developed for automatic and comprehensive characterization of all inorganic and organic bath components including simultaneous detection of conductive salt, anti-whisker and chelator by near-infrared (NIR) spectroscopy, brightener by potentiometric titration, stannous ions by electrochemical method, and the breakdown stannic ions by spectro-titration.
Copper Crystal Structures in Plated Microvias. Their Recrystallisation and a Means to Identify Joints at Risk of Premature Failure
Authors: Bernhard T. , Massey R. , Klaeden K. , Zarwell S. , Kempa S. , Steinhaeuser E. , Dieter S. , Brüning F.
Published: February 2022

Plated microvias are widely used within todays PCB industry as a means of achieving the high-density designs that are required in modern mobile devices, however, there has been growing concern regarding their long term reliability performance when stacked directly on top of each other.

Blind microvias (BMV) have a potentially complex metallurgical structure, with several interfaces located around the target pad - electroless Copper - electrolytic Copper joint. While field experience as shown that there are typically two major types of crystal structures formed across the BMV base, there has been little reported work investigating how or why such structures develop. In this paper, we review these two commonly observed microstructures within filled BMVs and offer proposals on how such structures are created. We subsequently describe a novel means to indicate if the microstructure of a BMV is likely to have a tendency for an early onset of failure.