bluuebunny/crossref_metadata_2025 huggingface dataset:
Low Temperature Curable PI/PBO for Advanced Packaging
Authors: Matsukawa Daisaku , Nakamura Tadamitsu , Enomoto Tetsuya , Yamazaki Noriyuki , Ohe Masayuki , Motobe Takeharu , Nishimura Masato
Published: September 2017

Photo-definable polyimides (PI) and polybenzoxazoles (PBO) have been widely used as dielectrics for re-distribution layers in wafer level chip size packages (WL-CSP). These materials can simplify the manufacturing process and ensure high reliability owing to their good mechanical properties and high thermal stability. For next generation electronic components fabricated by utilizing advanced packaging technologies such as 3D-stacking using TSV, package-on-package, fan-out WL-CSP etc., the most important requirements for dielectric materials are high lithographic performance, high adhesion to Cu RDL, high chemical resistance and low temperature curability. In this paper, we will report on our novel low temperature (<200C) curable PBO and PI. A novel alkaline positive tone PBO was developed by re-designing key components of the formulation to enhance lithographic performance, Cu adhesion and chemical resistance. It was found that the new PBO material showed higher lithographic performance than conventional PBOs due to its high dissolution contrast and which resulted in a resolution of 2micron (L/S) with a 7Î¼m cured thickness and 3micron (L/S) with a 15micron cured thickness, respectively. This material also produced strong Cu adhesion and high chemical resistance at curing temperatures <200C with no delamination from the Cu RDL being observed after a 168hr Pressure Cooker Test (PCT). Furthermore, the new formulation showed high TCT resistance due to its high elongation below 0C. In addition, a novel solvent negative tone PI was also developed by incorporating a cross-linker to accelerate low temperature curability as well a photo-initiator to improve lithographic properties. As a result, the novel PI when cured at 175C for 1hr showed high Cu adhesion after 168hr PCT as well as high film properties. The new PI also showed excellent lithographic properties with a resolution of 6micron (L/S). Furthermore, the low temperature curable PI and PBO materials were used as dielectrics to fabricate WL-CSPs for both chip and board level reliability testing. The test results indicated that both the novel PBO and PI showed excellent reliability after thermal cycling (TCT) due to the significant improvements made to Cu adhesion and chemical resistance. These materials are expected to be promising for next generation WLP applications. Details are described in the presentation.
Addressing Next Generation Packaging and IoT with Glass Solutions
Authors: Shorey Aric , Lu Rachel , Smith Gene
Published: September 2017

New requirements are emerging in electronics packaging. The ever-growing need for solutions for mobile communications and sensors that address the Internet of Things (IoT) provide interesting new challenges. RF applications strive to move to higher frequency bands, fan-out technology is being leveraged as an effective way to address interconnect demands, and there is a continuous search for more cost-effective solutions for difficult packaging challenges. Glass provides numerous opportunities to address these needs.

As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion helps optimize warp in glass core substrates, bonded stacks leveraging TGV and in carrier applications. Glass forming processes allow the potential to both form in panel format as well as at thicknesses as low as 100 um, giving opportunities to optimize or eliminate current manufacturing methods and address packaging challenges in a cost effective way.

We will provide the latest demonstrations of electrical, thermal and mechanical performance and reliability, describe areas where glass is being leveraged to achieve goals of next generation products and how properties of different glass types are leveraged by application.
Application of 3D PLUS WDoD technology for the manufacturing of electronic modules in implantable medical products
Authors: Couderc Pascal
Published: September 2017

3D PLUS has patented an innovative 3D technology based on the stacking of Know Good Rebuilt Wafers with only Know Good Dies, named WDoDTM.

The first 2D steps are those used by the manufacturers of Rebuilt Wafers with well-known eWLBTM technology:- Pick-Flip and Place of KGD from the die wafer on an thermal-release tape on a silicon carrier ( 300 or 200 mm diameter)- Compression molding with epoxy resin with silica fillers- Know Good Rebuilt Wafer grinding in order to decrease total thickness to 250 Âμm or less- Fan-out built-up with Redistribution layer process- This last step can be replaced by interconnection of the die to external sides by “flat” gold wires, in specific conditions

The next steps concern the WDoDTM process with edge connection.- gluing of first Know Good Rebuilt Wafer- sequential staking and gluing of Know Good Rebuilt Wafers- dicing of rebuilt and stacked wafers- plating of dicing streets with electroless process

All these steps can be collective at the wafer level.

Final laser patterning on the plated edges of each module is the final step before electrical test.

3D PLUS has designed with LINANOVA and manufactured two different electronic modules in the frame of a feasibility study of implantable products.

These developments were funded by one European project named MANPOWER for a first application dedicated for leadless pacemaker and by a French PIA project (INTENSE) dedicated to neurostimulation for severe conditions, particularly refractory heart failure.

Description of these modules is detailed: these modules have several layers including PCB layers including components which cannot be processed with fan out technology.

Layers only with bare dies are processed with fan out WLP technology eWLB based or with “falt” gold wires. Top and bottom sides of these modules can be also populated by additional components and allow the interconnexion with other sub-modules. They can also be solderballed in order to be reflow as a BGA components.
Manufacturability trade-offs of bare-die FCBGA package using thin or core-less substrate
Authors: Verma Ankita , Tabrez Baqar , Duong Lam , Wuest Martin
Published: September 2017

With the increasing demand for thinner packages and higher electrical & thermal performance requirement bare-die packaging is an inevitable trend that is growing. The assembly process for manufacturing of bare die in thin or core-less substrate FCBGA packages can be challenging especially considering the effects of substrate warpage during flip chip bonding and the excessive warpage of the flip chip package. We are evaluating the manufacturing risks during bare-die FCBGA package assembly to eliminate package warpage failures using experimental techniques and improve the functional performance of the flip chip package. Various substrate & under fill materials were tested for package warpage values for warpage-free control in the full range of temperature variation.

Die designs at 28nm and 40nm process nodes are extremely complex in order to achieve the highest electrical & thermal performance requirement. Die design constraints on advanced process nodes necessitate increased thermal dissipation requirements thereby requiring investigation of thermal solutions utilizing thermal interface materials (TIM) with heat-sink. The interaction of such thermal solutions with the bare die packages is evaluated using various trial and error for material selection, experimental and simulation techniques to improve the assembly process. This study also focuses on selection of thermal interface materials [TIMs] and heat sinks which have considerable impact on die integrity during package assembly and/or during process of removal for failure analysis.
Micromachined Interfaces for Metrology and Packaging Applications in the Submillimeter-Wave Band
Authors: Weikle Robert M. , Li H. , Arsenovic A. , Nadri S. , Xie L. , Bauwens M.F. , Alijabbari N. , Barker N. Scott , Lichtenberger A.W.
Published: September 2017

The continued emergence of new terahertz devices has created a need for improved approaches to packaging, integration, and measurement tools for diagnostics and characterization in this portion of the spectrum. Rectangular waveguide has for many years been the primary transmission medium for terahertz and submillimeter-wave systems operating from 300 GHz to 1 THz, with the UG-387 flange the most common interface for mating waveguide components over this frequency range. Alignment of UG-387 flanges is accomplished with pins and alignment holes that are placed around the flange perimeter and, under the standard MIL SPECS tolerances, misalignments of up to 6 mils (150 microns) are possible as a result of practical milling tolerances. With the emergence of vector network analyzers operating beyond 1 THz, such misalignment of waveguide mating flanges is not negligible and is recognized as a fundamental issue limiting calibration and measurement precision at frequencies greater than 300 GHz. In response to this issue, a number of new waveguide flange concepts have been investigated to reduce flange misalignment and the P1785 IEEE Standard was recently issued to recommend designs for waveguide interfaces at frequencies above 110 GHz. Among the new flange concepts being proposed is a modified UG-387 that utilizes tighter machining tolerances and the ring-centered flange where alignment is accomplished using a precision coupling ring that fits over raised bosses that are centered on each waveguide.

This paper discusses the new interface concepts that are being developed to address waveguide flange misalignment as well as emerging micromachined interconnects, calibration standards and heterogeneous integration methods that are being applied to implement low-loss and high-performance circuit architectures for the terahertz frequency range. Among the technologies that will be described are (1) design and characterization methods for the new ring-centered waveguide standard, (2) micromachined waveguide components and calibration standards for the terahertz band, (3) silicon-based micromachined probe structures for direct-contact interfacing and metrology, and (4) epitaxial transfer of III-V semiconductor material onto high-resistivity silicon to realize a low-loss platform for integration of terahertz components. Details of the processing methods used to realize these components as well as measurement techniques for assessing their performance will be described.
Technology Review of System in Package
Authors: Wase Yashashree S. , Li Feng
Published: September 2017

The Moore's law is approaching to an end at today's 14 nm technology and System in Package (SiP) is a promising solution for achieving denser electronics like mobile phones with small form factors. System in package is bringing together multiple ICs of various functionality stacked in 3D fashion. A fully functional system consisting of passive elements like resistor, capacitor, inductors, electromechanical elements, antenna, and ICs like sensors, can be integrated into a single package. To meet the requirements of the end product, system design characterization becomes very important for overall success in the development of system in package. Failure analysis and testing of the end product helps improve the product yield which is a point of concern for industries while designing system in package. But system in package has proven to be a viable solution for reduction in total cost and minimize time-to-market. Hence, system in package will continue to thrive and grow into mainstream technology despite of challenges faced during the development and production phase. In this paper, summary of system in package is presented with the perspective of reviewing the research carried out to overcome the challenges, cost issues, compatibility of different functional dice, quality and reliability issues.

This paper discusses the recent technological development of system in package modules and the limitations faced at various system levels while bringing multiple chips together to achieve fully functional package. This paper focuses on bridging the gap between the system integration by reviewing the research progress in the 3D IC and packaging using system in package. Some of the applications like portable electronics, automotive and wearable electronics, where the significance of system in package is more relevant are reviewed in this paper. The core challenges like thermal management, flip chip or wire bond interconnect that arise due to integration of different components and packages like package on package, package in package in the system in package are also discussed.
Development of Fan Out Package Platform for High Performance and RF Applications
Authors: Sharma Gaurav , Sharma Gaurav , Beece Adam , Shan Gao , Wieland Marcel
Published: September 2017

Over the last few years quite significant and well publicized advancements have been made in the IC industry in the potential adoption of fan out wafer level package platforms for both analog and digital applications. HD-FO platforms are likely to find significant adoption in the mobility, consumer application space as these have the capability to achieve sub-micron package routing density, high processor/memory and interconnect band width, very thin package height and small foot print area. Development of HD-FO package development reported in this work includes:Multiple advanced silicon technology nodesBroad range of package sizesSingle die, multi-die packagesDifferent package configurations that include with substrate, without substrate, organic and inorganic package redistribution layer optionsSystem in Package (SiP) for RF applications

An electrical simulation based lateral and vertical interconnect insertion loss comparison is being reported for high density fan out packages and silicon interposer with through silicon via (TSV). Multiple metal layers, interconnect widths, organic and inorganic redistribution layers are modelled. High density fan out package provides orders of magnitude less vertical interconnect loss in comparison to TSV. Least lateral interconnect insertion loss is demonstrated by organic interconnect based HDFO package. For RF applications HDFO package based inductors of 1.1nH and 3.3nH demonstrate ~ 3 X improvements in Qmax when compared to similar CMOS based inductors.

In addition to providing differentiating technology value propositions through the advanced HD-FO packaging platform collaborative ecosystem, customer centric business model and flexible supply chains are also being built to meet the business requirements for the integrated circuit customers. Finally, silicon/package co-design environment and RF enablement will ensure that customers realize the benefits of seamless product design, fast yield feedback and reduced time to market.
A Compact and Low Power Realization of a High Frequency Chaotic Oscillator
Authors: Harrison R. Chase , Rhea Benjamin K. , Werner Frank T. , Dean Robert N.
Published: September 2017

The desirable properties exhibited in some nonlinear dynamical systems have many potential uses. These properties include sensitivity to initial conditions, wide bandwidth, and long-term aperiodicity, which lend themselves to applications such as random number generation, communication and audio ranging systems. Chaotic systems can be realized in electronics by using inexpensive and readily available parts. Many of these systems have been verified in electronics using nonpermanent prototyping at very low frequencies; however, this restricts the range of potential applications. In particular, random number generation (RNG) benefits from an increase in operation frequency, since it is proportional to the amount of bits that can be produced per second. This work looks specifically at the nonlinear element in the chaotic system and evaluates its frequency limitations in electronics. In practice, many of nonlinearities are difficult to implement in high speed electronics. In addition to this restriction, the use of complex feedback paths and large inductors prevents the miniaturization that is desirable for implementing chaotic circuits in other electronic systems. By carefully analyzing the fundamental dynamics that govern the chaotic system, these problems can be addressed. Presented in this work is the design and realization of a high frequency chaotic oscillator that exhibits complex and rich dynamics while using a compact footprint and low power consumption.
Modeling Nonlinear MEMS Beams and the Chaotic Duffing Oscillator in SPICE
Authors: Beal Aubrey Nathan
Published: September 2017

Nonlinear MEMS beams have been modeled using SPICE. This allows for the complex dynamics of MEMS resonators to be observed parallel to their supporting electronics via circuit simulation. Silicon generally provides suitably linear parameters for use in MEMS. However, nonlinearities may arise due to issues such as amplitude-frequency (A-F) effect, large displacement of the proof mass, pull-in voltage, fatigue, material or electrical parameters, process variation, simplified beam modeling and nonlinear spring constants. By modeling these effects in SPICE, the design of electronics that automatically test, calibrate, report or even mitigate these effects is aided.

Single-crystal silicon is a highly linear material up until its failure, especially type <100>. High quality factor MEMS devices may, however, be affected by even small nonlinear terms in the material's Young's modulus. Geometric deformations may also occur due to decreases in cross-sectional area of beams in reaction to stretching and loading. Specifically, by including nonlinear geometric effects of MEMS beams and nonlinear terms in the Young's modulus of <100> and <110> silicon - nonlinear and chaotic oscillations are shown to arise via SPICE simulation.

Using this SPICE modeling method, electronic systems were designed to monitor the nonlinear parameters of MEMS beams that cause A-F effect and chaotic Duffing oscillations. Extracting parameters such as those from the oscillation's Poincare section may yield advantage in built-in self-test (BIST) applications. The features in these nonlinear oscillations extend parameters to monitor and potentially calibrate MEMS devices for reliability, stability and processing variation.
Super-persistent Currents in Chaotic Dirac Fermion Systems
Authors: Xu Hongya
Published: September 2017

Persistent currents (PCs), one of the most intriguing manifestations of the Aharonov-Bohm (AB) effect, are known to vanish for Schrödinger particles in the presence of random scatterings, e.g., due to classical chaos. But would this still be the case for Dirac fermions? Addressing this question is of significant value due to the tremendous recent interest in two-dimensional Dirac materials. We investigate relativistic quantum AB rings threaded by a magnetic flux and find that PCs are extremely robust. Even for highly asymmetric rings that host fully developed classical chaos, the amplitudes of PCs are of the same order of magnitude as those for integrable rings, henceforth the term superpersistent currents (SPCs). A striking finding is that the SPCs can be attributed to a robust type of relativistic quantum states, i.e., Dirac whispering gallery modes (WGMs) that carry large angular momenta and travel along the boundaries. We propose an experimental scheme using topological insulators to observe and characterize Dirac WGMs and SPCs, and speculate that these features can potentially be the base for a new class of relativistic qubit systems. Our discovery of WGMs in relativistic quantum systems is remarkable because, although WGMs are common in photonic systems, they are relatively rare in electronic systems.
The Effect of Processing Parameters on the Physical and Microwave Electrical Properties of Low Temperature Co-fired Ceramics
Authors: Walker Jim , Aguirre Jerry , Graddy Ed , Henry Jim
Published: September 2017

Low Temperature Co-fired Ceramics (LTCC) represent a multilayer electronic packaging technology with the ability to incorporate many electrical components such as conductive, resistive, and dielectric materials, into a single monolithic package. Example devices would include capacitors, inductors, resistors, antennae, transformers, hybrid circuits, etc. In general, the LTCC package consists of a glass/ceramic dielectric and compatible conductive inks (Au, Ag, etc.). The dielectrics and conductors are patterned/laminated to form the desired 3D structure and then co-fired to complete densification. The resulting monolithic block is mechanically robust with a high density of (often buried) electrical components. Typically, LTCC systems have found implementation in circuitry utilizing the RF and microwave frequency ranges. In general, the material design and processing parameters, and knowledge of how these affect the final mechanical and electrical properties of the LTCC package are needed for successful circuit design.

The electronic performance of an LTCC dielectric/conductor system (Ferro L8) was investigated as a function of processing parameters (peak fire temperature, temperature ramp rate, furnace air flow, etc.). Comparisons were also made between multiple manufacturing sites as the mentioned processing parameters vary slightly from site to site even with nominally identical set points due to differences in furnace design, fab layout, etc. Material properties of fired parts such as effective permittivity and electrical losses were measured both on bare dielectric using resonant cavity methods and on the dielectric/conductor system as a whole using microstrip transmission line methods to frequencies as high as 50 GHz. Correlations were made between electrical performance and models based on material properties. The effects of varied processing parameters and processing sites were also studied and used to help establish process understanding and improvement with respect to high frequency electrical performance. As an example, optimization of electrical performance could be achieved by adjusting the nominal furnace temperature set point at a specific site where losses were slightly high even with identical processing parameters to those at another manufacturing site.
Control of Tin Silver Electroplating Bath
Authors: Nguyen Vinh
Published: September 2017

Tin Silver alloy (Lead-free) is currently the material of choice for bumping in WLP technology. The deposition of this material is accomplished with a selective electroplating method. The SnAg plating solution consists of several key components such as Ag, Sn, Acid and Organic additives. The concentrations of each of these components must be carefully controlled because an out of spec concentration will affect the plating deposition rate, uniformity, shape and/or void occurrence within the solder bumps. This paper describes the method of analyses for each of the plating components in the SnAg plating solution and their effects on the bumps when they are out of the specified control limits. The data obtained for actual electroplating process will be shown.
True Random Source from Integratable Chaotic Circuits
Authors: Corron Ned , Milosavljevic Marko , Blakely Jon
Published: September 2017

In this talk, we describe a chaotic electronic circuit designed to realize a physical random number generator that is easily integrated. The small footprint of the circuit enables massive parallel realization to achieve high-speed, true-random bit sequences. The analog circuit can be fully characterized, and conjugacy to a symbolic shift proves the presence of chaos. The symbolic representation also provides a rigorous means to extract the maximum entropy from the chaotic device. Analysis of the circuit dynamics reveals critical tunings that yield special Markov properties, which are essential for removing correlations in the random sequences. Practically important is the presence of a sensitive circuit statistic that enables efficient feedback control to the Markov tuning. Numerical simulation and breadboard experimental results demonstrate the effectiveness of the proposed physical random number generator device.
A Rare Presentation of Cryptococcal Meningoencephalitis in an Immunocompetent Individual
Authors: Malhotra Ashwin , Rao Qin , Kelly Sean , Schwartz Danielle , Chow Robert
Published: September 2017

Cryptococcal meningoencephalitis is a leading of morbidity and mortality in immunocompromised individuals worldwide. However, there are few documented cases in immunocompetent patients. We present a rare case of disseminated Cryptococcus with progression to meningoencephalitis in an immunocompetent patient, with a possible atypical presentation. Magnetic resonance imaging of the brain and electroencephalogram to rule out brain metastasis were negative. Lumbar puncture resulted positive for Cryptococcus neoformans antigen at titers of 1:2048 and a detailed history later revealed occupational exposure to bird dander by cleaning floors and cages. Diagnosis is challenging, with delays often resulting in increased morbidity and mortality. Cerebrospinal fluid and serum Cryptococcus antigen play a key role in both diagnosis and determining treatment efficacy. Furthermore, current treatment guidelines are used for immunocompromised individuals. Due to the significant side effects of these medications, further research is needed to determine the optimal treatment duration for immunocompetent patients to minimize the need for unnecessary therapy.
Predicting land use change on a broad area: Dyna-CLUE model application to the Litorale Domizio-Agro Aversano (Campania, South Italy)
Authors: Pindozzi Stefania , Cervelli Elena , Recchi Pier Francesco , Capolupo Alessandra , Boccia Lorenzo
Published: September 2017

The long-standing awareness of the environmental impact of land-use change (LUC) has led scientific community to develop tools able to predict their amount and to evaluate their effect on environment, with the aim supporting policy makers in their planning activities. This paper proposes an implementation of the Dyna-CLUE (Dynamic Conversion of Land Use and its Effects) model applied to the Litorale Domizio-Agro Aversano, an area of Campania region, which needs interventions for environmental remediation. Future land use changes were simulated in two different scenarios developed under alternative strategies of land management: scenario 1 is a simple projection of the recent LUC trend, while scenario 2 hypothesises the introduction of no-food crops, such as poplar (Populus nigra L.) and giant reed (Arundo donax L.), in addition to a less impactful urban sprawl, which is one of the main issues in the study area. The overall duration of simulations was 13 years, subdivided into yearly time steps. CORINE land cover map of 2006 was used as baseline for land use change detection in the study area. Competition between different land use types is taken into account by setting the conversion elasticity, a parameter ranging from 0 to 1, according to their capital investment level. Location suitability for each land use type is based on logit model. Since no actual land use already exists for the alternative crops investigated in scenario 2, a suitability map realised through a spatial multicriteria decision analysis was used as a proxy for its land use pattern. The comparison of the land use in 2012 and scenario 1, evaluated through the application of Kappa statistics, showed a general tendency to expansion of built-up areas, with an increase of about 2400 ha (1.5% of the total surface), at the expense of agricultural land and those covered by natural vegetation. The comparison of the land use in 2012 and scenario 2 showed a less significant spread of built-up areas, affecting approximately 750 ha (0.5% of the total surface). Moreover, the introduction of alternative crops on about 10,000 ha, that is 6.8% of the total surface, would result in a significant decrease of arable land and a lower decrease of permanent crops, respectively equal to 6800 ha and 2900 ha. This work highlighted the importance and the potential of predicting land-use change models as valid tools supporting decisions, especially in those regions needing interventions aimed to environmental remediation, as in the case study examined in this paper.
Assessment of the territorial suitability for the creation of the greenways networks: methodological application in the Sicilian landscape context
Authors: Quattrone Marzia , Tomaselli Giovanna , Riguccio Lara , Russo Patrizia
Published: September 2017

The proposal to create greenways networks for the enhancement of more or less vast areas, is of great importance to territory planning. The paths, which are overlaid on pre-existing linear patterns, promote the development of endogenous resources and facilitate direct learning of the territory’s historical, cultural, environmental and landscaping assets. Rural areas can be strongly influenced by setting up a greenways network, as their use not only promotes the exchange of knowledge between users and inhabitants, but also encourages the enjoyment of various areas (agricultural landscapes, scattered cultural heritage, protected environments) that would otherwise be inaccessible due to their distance from the traditional routes. Altogether, this favours the introduction of economic activities based on their typical characteristics. This work identifies the appropriate road infrastructure, available in the former Province of Syracuse (East Sicily), for building greenways networks that will best contribute to the valorisation of their surrounding territory. This work assigns great importance to landscape features as factors of tourist and cultural attraction. We have used the multi-criteria analysis associated with GIS. We have weighed and mapped numerous indicators to define the territory’s infrastructural, landscape, cultural, and tourist resources, meaning those able to increase the use of the territory and/or that determine attractiveness for the population. The GIS analysis allowed us to develop numerous intermediate maps, whose information helped us to draw up the final map illustrating the suitability of the existing infrastructures that could be useful while planning of a greenway network. Such infrastructures could be the subject of specific plans or detailed projects aimed at enhancing the pre-existing resources of a rural territory. This study, although referring to a defined territory, is methodologically valid in a general sense and can be used in various contexts.
Potential biogas production from agricultural by-products in Sicily: a case study of citrus pulp and olive pomace
Authors: Valenti Francesca , Porto Simona , Cascone Giovanni , Arcidiacono Claudia
Published: September 2017

Renewable energy sources represent a suitable alternative to conventional fossil fuels, due to the possible advantages in terms of environmental impact reduction. Anaerobic digestion of biomasses could be considered an environmental friendly way to treat and revalorise large amounts of by-products from farming industries because it ensures both pollution control and energy recovery. Therefore, the objective of this study was to define a methodology for evaluating the potential biogas production available from citrus pulp and olive pomace, which are suitable agricultural by-products for biogas production. In the first phase of the study, the spatial distribution of both olive and citrus-producing areas was analysed in Sicily, a geographical area of the Mediterranean basin highly representative of these types of cultivation. Then, a GIS-based model, which had been previously defined and utilised to evaluate the amount of citrus pulp and olive pomace production, was applied to this case study. Based on the results obtained for the different provinces of Sicily, the province of Catania was chosen as the study area of this work since it showed the highest production of both citrus pulp and olive pomace. Therefore, a further analysis regarded the quantification of olive pomace and citrus pulp at municipal level. The results of this analysis showed that the total amount of available citrus pulp and olive pomace corresponded theoretically to about 11,102,469 Nm3/year biogas. Finally, the methodology adopted in this study made it possible to identify suitable areas for the development of new biogas plants by considering both the spatial distribution of the olive and citrus growing areas and the locations of the existing processing industries.
Some psychoanalytical meanings of the skin in the book of Job
Authors: Van der Zwan Pieter
Published: September 2017

Traditionally, there has been a tension between psychology and religion because of the Freudian critique of religion. This research intends to show that a deeper understanding of religion leading hopefully to an even deeper religiosity can be achieved by studying bodily features portrayed in a (religious) text from a psychoanalytic perspective. Just as any literary character can be ‘psychoanalysed’ to produce new perspectives on it and on the narrative as a whole, the personality of Job invites the postmodern reader to continue understanding this book on new levels. From this approach, it becomes clear that the protagonist struggles with boundaries and individuation because of his depressive tendencies experienced in issues with reality’s harsh touch, nakedness and distance. Intradisciplinary and/or interdisciplinary implications: Just as any literary character can be ‘psychoanalysed’ to produce new perspectives on it and on the narrative as a whole, the personality of Job invites the postmodern reader to continue understanding this book on new levels. From this approach, it becomes clear that the protagonist struggles with boundaries and individuation because of his depressive tendencies experienced in issues with reality’s harsh touch, nakedness and distance.
Care givers’ knowledge of integrating the Montessori; indigenous communicative teaching methods and Reggio Emilia in early child care education
Authors: Izuagba A.C. , Afurobi A.O. , Ifegbo P.C. , Opara J.M.
Published: September 2017

Studies have identified the mismatch between theory and practice as the main reason for gap between the intended and the achieved curriculum objectives. The early childcare education is no exception. Theories of child development emphasize that children learn best through play and self-discovery. Unfortunately, research results revealed that caregivers do not adhere to the prescribed pedagogy and since pedagogy stems from the theory of the nature of the learner and how he learns; it implies that failure to use the right pedagogy adversely affects the achievement of the objectives. The study therefore sought to identify caregivers’ knowledge of integrating Montessori, Indigenous Communicative Teaching and Reggio Emilia approaches in Early Childhood Care Education in Owerri Educational zone, Imo State, Nigeria. The study is a descriptive survey with the population comprising all caregivers in government approved pre-primary schools totalling 119, using a 39-item questionnaire and percentages as well as chi square for data analyses. Results showed that respondents were not knowledgeable. Recommendations include the need to monitor caregivers to ensure compliance to stipulated policy.Keywords: childcare education, caregivers
Relevance of music in social stability and security challenges in Nigeria
Authors: Ojukwu Ebele V.
Published: September 2017

In the wake of the current security challenges and social instability in Nigeria today, there is a great need to employ a broad range of measures in dealing with the situation. Since the social instability and insecurity in Nigeria seem to have resisted the police and military guns, a far-reaching solution must be sort to redress the current menace that is threatening the stability of Nigeria as a nation. Music is one of society’s weapons of offence and defence because it can be used to regulate human conduct. This paper explored the avenues of using music as a unifying force to institute lasting security and social stability that is devoid of ethnocentrism in a multi-ethnic country like Nigeria. This is hoped to be achieved through survey method and bibliography. A suggestion is made for music practitioners from various ethnic groups in Nigeria to produce music that possess universal appeal geared towards fostering peace and security in the country.Keywords: Music, Social stability, Security challenges Ethnocentrism and social control
Ura Yilan: The art and science of rain making among the Tiv of central Nigeria
Authors: Andrew Philips Adega
Published: September 2017

Rain is a natural phenomenon in which showers by means of natural causation down- pours water from the sky for the purpose of moisturing the earth, man, plants and animals for their sustenance. Without water, survival for man, plants and animals on earth will be a mirage. The fact that the Tiv are farmers who produce variety of crops implies that the Tivs necessarily need rain for their survival and for the crops and animals they rear. Thus, when the Tivs experience a dearth in rain, they employ the services of the yilan ura (rain maker) of the community for the purposes of ura yilan (rain making). The art and science of rain making among the Tiv is meant to avert catastrophe in the community for man, plants and animals. In making rain, the Tiv do not usurp or short change Aondo - the Supreme Being; but they do so conscious of the fact that Aondo has given them the arcane knowledge to tap into and control the natural resources of their environment for their benefit. Thus, the study is motivated by the factors responsible for ura yilan and the techniques employed by the Tiv to bring about rain and the derivable benefits there from. The study employed both the primary and secondary methods to collect data. Oral interviews were held with rain makers in selected parts of Tivland. In the secondary method, information was collected from books, journals, encyclopaedias, newspapers and magazines, etc. The study established that the Tiv, like other ethnic nationalities across the globe, make rain when circumstances demand. The Tiv therefore, make rain for different purposes including for productive, destructive/obstructive purposes as well as the detection of evil in the community. Ura yilan (rain making) among the Tiv was important in the sense that it procured bountiful harvest, regulated evil and cleansed Tiv society of defilement as well as bringing peace and happiness in the society. Expectedly, several taboos followed the making of rain among the Tiv; for instance, the genuine or yilan ura was prohibited from touching a corpse, never interacted with women observing their menstrual cycle and neither was he in the habit of collecting ingyato (consent fee) to cause the death of members of his community. In conclusion the study notes that although the art of rain making has drastically receded with the advent of western education and Christianity; where it becomes necessary for the Tiv to make rain, it should be for productive but not destructive ventures.
Introduction: The Persistence of Dwelling
Authors: Farred Grant , Lopez Alfred J.
Published: September 2017

Each of the essays collected here presents one or more flashpoints or crises in a history of 20th- and 21st-century dwelling.
The Bearded Ones: Dwelling in a History of Radicalism, Authenticity, and Neoliberalism
Authors: Cobb Russell
Published: September 2017

Beards are a sort of dwelling. Much like Heidegger's linguistic play with related etymologies of building and dwelling, beards are in a constant state of becoming, forever changing length, shape, and color. To the person—usually, but not always, a man—who grows a beard, the end product is always projected out into the future, like Heidegger’s concept of being. The beard is trimmed and groomed constantly; it is cultivated in a way that feels authentic to its wearer. But the same ontological problems that Heidegger applies to dwelling in a home also apply to beards. Long facial hair symbolizes wisdom in many cultures, but anyone who has grown a beard can attest to the existential dilemma of long facial hair. I didn’t recognize you with the beard, someone will say. Beards can serve as symbols of erudition, yes, but they are also masks for our social selves. The beard is, after all, is a curious appendage, as it is an extension of the self, but not the self per se. Herman Melville called beards “suburbs of the chin.” If, like Heidegger, we are to see being as not a fixed entity divorced from other beings, but a being-in-the-world, a set of relations among other beings, then beards are not simply static accessories or styles, but an example of the slippery nature of being itself.
Sketches Toward an Ontology of Non-Dwelling: Mara Salvatrucha 13, Radical Homelessness, and Postglobality
Authors: Ramos Anthony
Published: September 2017

In 1988, the California state legislature passed the California Street Terrorism Enforcement and Prevention Act (STEP), which allowed courts to “enhance” the sentences of offenders who have been proven to "promote, further, or assist in any criminal conduct by gang members." It bundled together criminality, policing, and incarceration in ways that drew upon the fears of the black/latino Others that were imminent in panics surrounding the “crack epidemic” and inner-city crime. Jumping to April 2016, the Salvadoran government has passed strikingly similar legislation, which centers on reclassifying gang-associated crimes as terroristic; in essence under their new laws gang affiliation is a terrorist. This, too, has been enacted in the midst of panic about gang violence and low-level warfare between gangs and the Salvadoran state. The adoption of US-style anti-gang approaches by the Salvadoran government is not new. In 2003, the right-wing government passed mano dura [“iron fist”] policies that sought to address increases in gang associate crime with zero-tolerance, tough-on-crime measures. Law enforcement received expanded leeway to target and arrest gang members, especially those from Mara Salvatrucha 13 (MS-13) and Barrio 18. Despite the lack of sustained reductions in violent crime, the mano durapolicies have remained and will only be exacerbated by the new legislation.
Fabricating Monstrosity: Secrets and Violence in the Lay of Graelent and Several Old French Fabliaux
Authors: Goyette Stefanie
Published: September 2017

Hidden knowledge in the Old French lays and fabliaux predominantly concerns the bodies, behaviors, and desires of women, who are portrayed as jealously guarding their secrets while men seek to discover them. In the twelfth-century Lai de Graelent and various Old French fabliaux from the twelfth through fourteenth centuries, women are marked with the trait of monstrosity, indicating the bodily site of hidden knowledge. The body itself thus becomes the secret, representing the material difference that supposedly produces epistemological difference, and these two registers are conflated as knowledge is sought by violating the body. This article connects the lays and fabliaux, which are rarely studied together, and argues that women in these tales can exploit perceptions of monstrosity to short-circuit the violence inherent to conventions that pose them as the ultimate object of knowledge.
Bank Lending and Interest- Rate Derivatives
Authors: Zhao Fang , Moser James
Published: September 2017

Using data that cover a full business cycle, this paper documents a direct relationship between interest-rate derivative usage by U.S. banks and growth in their commercial and industrial (C&I) loan portfolios. This positive association holds for interest-rate options contracts, forward contracts, and futures contracts. This result is consistent with the implication of Diamond’s model (1984) that predicts that a bank’s use of derivatives permits better management of systematic risk exposure, thereby lowering the cost of delegated monitoring, and generates net benefits of intermediation services. The paper’s sample consists of all FDIC-insured commercial banks between 1996 and 2004 having total assets greater than $300 million and having a portfolio of C&I loans. The main results remain after a robustness check.
The Impact of Information Communication and Technology Utilization on the Financial Performance of Microfinance Institutions in Rwanda Case Study: Reseau Interdiocesain De Microfinance (Rim) Ltd, Rwanda (2011 -2015)
Authors: Harelimana Jean Bosco
Published: September 2017

The study analyzed the impact of ICT utilization on the financial performance of microfinance institutions inRwanda with case study of Réseau Interdiocesain de microfinance (RIM) Ltd undertaken within 5 years (2011-2015). The study adopted the use of descriptive survey using both qualitative and quantitative methods for a totalsample size of 132. Purporsive and simple random simpling was used for this purpose. Primary and Secondary datawere collected and thene analyzed using SPSS version 16.00. The study found that ICT has been introduced and usedabout 5 years and above. The study found that ICT impact firstly on financial sustainability and profitability (65.8%),secondly on financial efficiency and productivity (23.7) and finally on portfolio quality (5.3%). ICT utilization havea high influence to the RIM Ltd.’s financial performance compared to the previous situation.The correlation results imply that ICT usage has a positive impact on financial sustainability and profitability as theymove in the same direction (R=0.502). The strength of the impact was found to be low due to the low investments inICT among microfinance institutions.
Employees Behaviour, Equity in Financial Compensation and Performance of Public Universities in Ghana
Authors: Frempong Evelyn Owusu , Dwomoh Gabriel
Published: September 2017

The main purpose of the study is to contribute to knowledge by assessing the moderating role equity in financialcompensation plays on the relationship between employees’ behavior and performance of state owned universities inGhana. The targeted population for the study was the 10 public universities established by an Act of Parliament andare recognized by the National Accreditation Board. Out of this, 7 public universities were selected usingconvenience sampling. The choice of this sampling method was based on accessibility and easy access toinformation to facilitate the research. In each of the sample, 15 employees’ mainly senior members both fromadministration and academic totalling 105 were randomly selected for the study. The main instrument used forcollection of primary data was questionnaires and interviews whilst review of selected public universities websites,published textbooks, journals and newsletters constitute the secondary data. The instrument used for the study wastested for its reliability and fitness and the result was positive with cronbach’s alpha value of 0.856. Analysis for thestudy was done using correlation and regression to test for the hypotheses developed. The results show that employees’behaviour has high positive relationship with performance of public universities with equity in financial compensationplaying a moderating role. The study therefore recommends the need for the Government of Ghana to continue with thefull implementation of its single spine pay policy since it will ensure fairness in the public sector wage which will inturn influence employees’ behaviour positively and performance of the sector as a whole.
A Bayes Inference for Step-Stress Accelerated Life Testing
Authors: Sha Naijun , Teng Hao Yang
Published: September 2017

In this article, we present a Bayesian analysis with convex tent priors for step-stress accelerated life testing (SSALT) using a proportional hazard (PH) model. As flexible as the cumulative exposure (CE) model in fitting step-stress data and its attractive mathematical properties, the PH model makes Bayesian inference much more accessible than the CE model. Two sampling methods through Markov chain Monte Carlo algorithms are employed for posterior inference of parameters. The performance of the methodology is investigated using both simulated and real data sets.