bluuebunny/crossref_metadata_2025 huggingface dataset:
The study of intestinal deсametoxin absorption in rats and its influence on blood cholinesterase activity in rabbits
Authors: Derkach Nataliya Nikolaevna , Shtrygol' Sergey Yur'yevich , Koyro Ol'ga Olegovna , Blazheevskiy Nikolay Evstakhievich
Published: October 2015

The possibility of (0.02 % solution) absorbtion was evaluated under the conditions of small intestine perfusion in situ in the experiments with albino rats. Decametoxin content was determined in the perfusate by kinetic enzymatic method using the reaction of exogenous cholinesterase inhibition. Decametoxin influence on the activity of endogenous cholinesterase of the rabbit blood plasma was also studied after the single oral administration of the drug at a dose of 6 ml/kg that corresponds to the dose of 1.2 mg/kg. It has been shown that decametoxin is almost not absorbed in rat intestine and does not influence on cholinesterase activity of the rabbit blood that substantiate the possibility of its usage in gastrointestinal infections.
The Interplay of Regulatory Fit and Construal Level in Influencing Behavioral Intention
Authors: Chen Huajiao , Zheng Quanquan , Zhang Jin , Wang Xiaomei
Published: October 2015

People experience regulatory fit when their strategy of how to achieve a goal accords with their regulatory orientation. It has been widely documented that regulatory fit could create value enhancement. We conducted 2 studies and our results showed that this was not the case when people
were functioning at a high construal level (HCL) rather than a low construal level (LCL). Specifically, we found that for the HCL group of participants the effects of regulatory fit on both consumption intention (Study 1) and environmental intention (Study 2) were mitigated. Depending on construal
level, the effect of fit versus nonfit on intention was mediated by processing fluency (Study 2). These results provided support for the proposal that an HCL helps people to distinguish objective information from subjective feelings, whereas an LCL is not implicated in making such a distinction.
Utilitarian Orientation, Long-Term Orientation, and Performance: Evidence from Chinese Millennial-generation Employees
Authors: Lin Ye , Li Yanping , Hou Xuanfang
Published: October 2015

Drawing on self-verification theory, our aim was to explore the main and interaction effects of utilitarian and long-term orientation on the Chinese millennial generation's in-role and extrarole performance. Participants (N = 208) were millennial-generation employees at 3 companies
in mainland China, who completed measures of utilitarian orientation, long-term orientation, in-role performance, and extrarole performance. The results showed that a utilitarian orientation positively predicted in-role and extrarole performance in the participants, and that a long-term orientation
significantly moderated this relationship. The theoretical and practical implications of these findings are discussed.
Adolescents' Participation in Sport Activities and Attachment to Parents and Peers
Authors: Sukys Saulius , Lisinskiene Ausra , Tilindiene Ilona
Published: October 2015

We examined the relationship between adolescents' participation in sport activities and their parent and peer attachment, using a quantitative cross-sectional design. Adolescents (1,348; 716 girls and 632 boys) aged 12 to 16 years completed a survey assessing parent and peer attachment
in terms of trust, communication, and alienation. Results showed that adolescents not participating in sport scored significantly lower than adolescent athletes on parent attachment, and that involvement in sport activities was important as a factor determining the quality of parent–adolescent
relationships. Conversely, adolescents' involvement in competitive sport had no effect on their peer attachment, which indicates that a close relationship with other sport participants does not predict greater peer attachment.
Measurements of CD34+/CD45-dim Stem Cells Predict Healing of Diabetic Neuropathic Wounds
Authors: Thom Stephen R. , Hampton Michelle , Troiano Michael A. , Mirza Ziad , Malay D. Scot , Shannon Steven , Jennato Nathan B. , Donohue Cornelius M. , Hoffstad Ole , Woltereck Diana , Yang Ming , Yu Kevin , Bhopale Veena M. , Kovtun Svitlana , Margolis David J.
Published: October 2015

Management of neuropathic foot ulcers in patients with diabetes (DFUs) has changed little over the past decade, and there is currently no objective method to gauge probability of successful healing. We hypothesized that studies of stem/progenitor cells (SPCs) in the early weeks of standard wound management could predict who will heal within 16 weeks. Blood and debrided wound margins were collected for 8 weeks from 100 patients undergoing weekly evaluations and treatment. SPC number and intracellular content of hypoxia-inducible factors (HIFs) were evaluated by flow cytometry and immunohistochemistry. More SPCs entered the bloodstream in the first 2 weeks of care in patients who healed (n = 37) than in those who did not (n = 63). Logistic regression demonstrated that the number of blood-borne SPCs and the cellular content of HIFs at study entry and the first-week follow-up visit predicted healing. Strong correlations were found among week-to-week assessments of blood-borne SPC HIF factors. We conclude that assays of SPCs during the first weeks of care in patients with DFUs can provide insight into how well wounds will respond and may aid with decisions on the use of adjunctive measures.
Associations Between Prediabetes, by Three Different Diagnostic Criteria, and Incident CVD Differ in South Asians and Europeans
Authors: Eastwood Sophie V. , Tillin Therese , Sattar Naveed , Forouhi Nita G. , Hughes Alun D. , Chaturvedi Nish
Published: October 2015

OBJECTIVE

We examined longitudinal associations between prediabetes and cardiovascular disease (CVD) (coronary heart disease [CHD] and stroke) in Europeans and South Asians.

RESEARCH DESIGN AND METHODS

This was a U.K. cohort study of 1,336 Europeans and 1,139 South Asians, aged 40–69 years at baseline (1988–1991). Assessment included blood pressure, blood tests, anthropometry, and questionnaires. Prediabetes was determined by OGTT or HbA1c, using either International Expert Committee (IEC) (HbA1c 6.0–6.5% [42–48 mmol/mol]) or American Diabetes Association (ADA) (HbA1c 5.7–6.5% [39–48 mmol/mol]) cut points. Incident CHD and stroke were established at 20 years from death certification, hospital admission, primary care record review, and participant report.

RESULTS

Compared with normoglycemic individuals, IEC-defined prediabetes was related to both CHD and CVD risk in Europeans but not South Asians (subhazard ratio for CHD 1.68 [95% CI 1.19, 2.38] vs. 1.00 [0.75, 1.33], ethnicity interaction P = 0.008, and for CVD 1.49 [1.08, 2.07] vs. 1.03 [0.78, 1.36], ethnicity interaction P = 0.04). Conversely, IEC-defined prediabetes was associated with stroke risk in South Asians but not Europeans (1.73 [1.03, 2.90] vs. 0.85 [0.44, 1.64], ethnicity interaction P = 0.11). Risks were adjusted for age, sex, smoking, total-to-HDL cholesterol ratio, waist-to-hip ratio, systolic blood pressure, and antihypertensive use. Associations were weaker for OGTT or ADA-defined prediabetes. Conversion from prediabetes to diabetes was greater in South Asians, but accounting for time to conversion did not account for these ethnic differences.

CONCLUSIONS

Associations between prediabetes and CVD differed by prediabetes diagnostic criterion, type of CVD, and ethnicity, with associations being present for overall CVD in Europeans but not South Asians. Substantiation of these findings and investigation of potential explanations are required.
Distribution of butterflies along a trekking corridor in the Khangchendzonga Biosphere Reserve, Sikkim, Eastern Himalayas
Authors: Chettri Nakul
Published: October 2015

Aim The aim of the research was to understand the distribution pattern of butterflies along attitudinal and disturbance gradients in a trekking corridor in Sikkim, India.Location Khangchendzonga Biosphere Reserve, West Sikkim, India.Material and Methods The study focused on two sets of data, one on inventory of species along the trekking corridor and the other on butterfly species and their numbers along the 19 permanent plots measuring 30x40m. Among the 19 plots, four each was laid in degraded forests (canopy cover <40%) and undisturbed forests (canopy cover >40%) within the warm temperate broadleaf forest (1780–2350 m), and five and six in degraded and undisturbed forest respectively in cool temperate sub-alpine forest (2350– 3600 m). The surveys were conducted thrice a season for two seasons. All individuals recorded from the 114 pseudo replicate plots (19 plots, 3 times a season for 2 seasons) and the casual observations were considered for preliminary analysis for dominant families.Key findings Among the 189 species recorded, Nymphalidae family was dominant (44%) followed by Lycanidae (19%) and the least number of species was recorded from Riodinidae (1%). Likewise, 69% of the species recorded were found to be ‘fairly common’, 16% ‘common’ and 11% rare. The highest number of species per transect was recorded from the disturbed condition (7.1±0.7 Standard Error) at warm temperate broadleaf forest (WTBF) followed by undisturbed condition (6.7±0.8) and the least was recorded at the undisturbed condition (4.1±0.5) of cool temperate subalpine forest (CTSF). Similarly, the butterfly species diversity, its richness and evenness significantly differed between the forest types i.e. WTBF and CTSF and showed negative correlation along altitudinal gradients.Conservation implications Study concludes that the human interventions and tourism enterprises are bringing subtle changes in butterfly habitat and may have major effects on some of the habitat specific species if they are not seriously considered in the management interventions.Conservation Science Vol.3(1) 2015: 1-10
What Makes a Leader: Identifying the Strengths of Canadian Physical Therapists
Authors: Chan Zachary , Bruxer Ashley , Lee Jonathan , Sims Katelin , Wainwright Matthew , Brooks Dina , Desveaux Laura
Published: October 2015

Purpose: To identify the personal strengths of Canadian physical therapists who hold leadership positions and compare them with the strengths of Canadian physical therapists who do not occupy positions of leadership. Methods: A quantitative, cross-sectional online survey was distributed to registered Canadian physical therapists. We used the Clifton StrengthsFinder to evaluate 34 characteristics and determine which characteristics described a participant's strengths. Population demographics and leadership strengths were described via frequency distributions and percentages; chi-square analyses and Fisher's exact tests were used to compare differences between groups. Results: Of 173 physical therapists who completed the survey, 108 occupied a position of leadership, and 65 did not. Those in the leader group had significantly more experience and achieved a higher level of education. Leaders most frequently exhibited the strengths of learner, achiever, responsibility, input, and strategic, whereas non-leaders most frequently displayed strengths of learner, achiever, input, relator, and harmony. Leaders were significantly more likely than non-leaders to possess the achiever strength. Gender, level of education, and years of experience did not significantly influence which strengths were present in the leadership profile. Conclusions: There is substantial overlap between leaders and non-leaders in terms of leadership profiles. Future research should investigate whether leadership strengths vary depending on the leadership position occupied and whether leadership development initiatives promote leadership strengths.
An Evidence-Based Case Study of Unilateral Shin Splints: Do Red Flags Function in Paediatric Osteosarcoma?
Authors: Rankin Anne
Published: October 2015

Physiotherapists use red flags to screen for serious pathology. Paediatric osteosarcoma is a rare disease, occurring predominantly in the area of the knee and shoulder, and it is not always included by physiotherapists on a differential diagnosis list. Traditional red flags do not always correspond to the initial signs and symptoms of osteosarcoma. Physiotherapists should routinely palpate along the length of the bone to detect a potential mass. The detection of a mass or symptoms that do not follow the expected course indicates the need for reassessment and possibly referral for further investigation.
The lawyer as fiduciary: Defining private law duties in public law relations
Authors: Woolley Alice
Published: October 2015

No one doubts that lawyers have fiduciary duties. Yet the justification for and scope of those duties is surprisingly unclear. Case law grounds fiduciary duties in the fiduciary’s exercise of discretionary authority. But discretionary authority is only an occasional – and sometimes ethically problematic – aspect of the lawyer’s role, not its defining feature. Further, case law has been neither clear nor consistent in defining the specific obligations that attach to the lawyer’s duty of fiduciary loyalty. Academic literature on fiduciary duties provides only a partial and somewhat unsatisfactory explanation for the lawyer’s fiduciary status when viewed in light of the normative foundations of the lawyer’s role and case law. Academic literature on the lawyer’s role is, however, also unsatisfactory insofar as, while it explains the lawyer’s duty of loyalty, it does not provide any means for analysing how breaches of that duty ought to be categorized in private law. The article attempts to reduce the confusion over the meaning and extent of the lawyer’s fiduciary obligations. It argues that the content of the lawyer’s fiduciary duties should be informed by the normative structure of fiduciary obligations and by the normative structure of the lawyer–client relationship. The lawyer–client relationship operates at the intersection of private obligation and public duty, and the scope and force of the lawyer’s fiduciary duties reflect that intersection. When understood in this way, the principle underlying the lawyer’s fiduciary status continues to emphasize discretion. It focuses, however, not on the lawyer’s exercise of discretion but rather on the lawyer’s provision of the advice and advocacy necessary for the client’s exercise of discretion. Analysed in light of these founding principles, lawyers ought to be held liable for fiduciary breach in three circumstances: (1) where they violate obligations to clients as a consequence of a conflict of interest or duty; (2) where they undercut the very nature of the representation they undertook to provide; and (3) where, through failing to provide information or providing the client with misinformation, they undermine the client’s ability to make decisions.
Boring Through History: An Environmental History of the Extent, Impact and Management of Marine Woodborers in a Global and Local Context, 500 BCE to 1930s CE
Authors: Rayes Courtney A. , Beattie James , Duggan Ian C.
Published: October 2015

While depictions of mariners fighting fearsome sea monsters or battling terrifying storms entertain us to this day, it is perhaps ironic that one of the main threats to commerce over the last millennium or more has come from a series of very small organisms whose history has been submerged in historical accounts. Despite their marked long-term and large-scale impacts on global marine infrastructure, shipping and economies, shipworms, pillbugs and gribbles - collectively referred to as marine woodborers - have received no substantial scholarly attention from environmental historians. This article first overviews their historical spread around the world, demonstrating, too, their disruption of global travel and trade, then traces past problems and management attempts in New Zealand from the arrival of the first humans, c.1300, to the 1930s. New Zealand presents a particularly rich study demonstrating the spread, impacts and management responses to marine woodborers. Until the more widespread and successful use from the 1900s of both ferro-concrete pilings and chromated copper arsenate (CCA) as a wood preservative, colonists in different parts of New Zealand unknowingly experimented with techniques which had failed elsewhere in the country. A longstanding inability to learn from past failures in nineteenth-century New Zealand demonstrates the lack of co-ordinated application of management techniques in the colony, and suggests both the fragmentation of colonial knowledge and the limitations of colonial science, as new ideas were introduced at a local level rather than nationally. Due to the overwhelming attention given to globalisation's role in spreading terrestrial plants and animals - and to a lesser extent aquatic freshwater fishes - an examination of the extent and response to marine woodborers provides significant new perspectives on the neglected subject of non-indigenous marine organisms.
'It is no use advising us! Command us and we will obey': Livestock Management, Soil Conservation and the State in Southern Rhodesia, c.1930-50
Authors: Mwatwara Wesley , Swart Sandra
Published: October 2015

This article examines state imposed centralisation and soil conservation policies as pursued by the Southern Rhodesian Department of Native Agriculture, and argues that these were at variance with the state's own veterinary policies. It argues that in the 1930s the state failed to deal with the contradictions caused by shifting and competing agendas between the Departments of Native Affairs, Native Development, Entomology and Veterinary Services. This was compounded by the implicit and enduring acceptance by officials that the problems were precipitated almost exclusively by 'primitive' African farming practices. This resulted in the state's resuscitating in the 1940s the ideology of livestock improvement first conceptualised in 1912 and introducing compulsory destocking from 1945. It concludes that these intrusive latter measures had a significant impact on the African rural socio-political and physical landscape in general and livestock management practices in particular.
LABORATORY SIMULATIONS OF WAVE ATTENUATION BY AN EMERGENT VEGETATION OF ARTIFICIAL PHRAGMITES AUSTRALIS: AN EXPERIMENTAL STUDY OF AN OPEN-CHANNEL WAVE FLUME
Authors: YIPING Li , ANIM Desmond Ofosu , WANG Ying , TANG Chunyang , DU Wei , LIXIAO Ni , YU Zhongbo , ACHARYA Kumud , CHEN Li
Published: October 2015

This paper presents a well-controlled laboratory experimental study to evaluate wave attenuation by artificial emergent plants (Phragmites australis) under different wave conditions and plant stem densities. Results showed substantial wave damping under investigated regular and irregular wave conditions and also the different rates of wave height and within canopy wave-induced flows as they travelled through the vegetated field under all tested conditions. The wave height decreased by 6%–25% at the insertion of the vegetation field and towards the downstream at a mean of 0.2 cm and 0.32 cm for regular and irregular waves respectively. The significant wave height along the vegetation field ranged from 0.89–1.76 cm and 0.8–1.28 cm with time mean height of 1.38 cm and 1.11 cm respectively for regular and irregular waves. This patterns as affected by plant density and also location from the leading edge of vegetation is investigated in the study. The wave energy attenuated by plant induced friction was predicted in terms of energy dissipation factor (fe) by Nielsen’s (1992) empirical model. Shear stress as a driving force of particle resuspension and the implication of the wave attenuation on near shore protection from erosion and sedimentation was discussed. The results and findings in this study will advance our understanding of wave attenuation by an emergent vegetation of Phragmites australis, in water system engineering like near shore and bank protection and restoration projects and also be employed for management purposes to reduce resuspension and erosion in shallow lakes.
L’expérience du dissemblable dans les atteintes somatiques… sévères . Suivi de : Rebonds sur la clinique de l’adolescence aux carrefours de la pédopsychiatrie de liaison par Emmanuelle Granier
Authors: Chaffel Boris , Attias Rebecca
Published: October 2015

Ce texte est une tentative de formalisation de l’accueil du transfert de certains adolescents au cours d’une hospitalisation en médecine somatique, par les équipes soignantes aux prises avec l’effroi. Il s’appuie sur le concept de dissemblance proposé par Georges Didi-Huberman, dont les ressorts sont analysés à partir de deux films – The Stepford Wives de Bryan Forbes et Le locataire , de Roman Polanski, en repérant un isomorphisme régional entre les expériences subjectives de déréalisation témoignées dans certaines cures et dans les atteintes somatiques sévères. La question de la variation individuelle en biologie, depuis celle de la monstruosité, nous permet ensuite de supposer un savoir spécifique aux équipes médicales, susceptible d’engendrer une certaine disposition à l’accueil du divers dans leur travail avec les adolescents.
S econd life, les enjeux d’une création
Authors: Roussille Clotilde
Published: October 2015

Les univers virtuels et plus particulièrement Second Life peuvent représenter pour leurs utilisateurs des espaces de projection, aire intermédiaire entre le subjectif et ce qui est objectivement perçu. Terrain de création et d’expérimentation, il permet à ses utilisateurs d’y exprimer une partie d’eux-mêmes à travers la construction d’avatar (double virtuel) et son évolution dans cette « seconde vie ». Ainsi, ces travaux de recherches s’interrogent sur la résonance que peut avoir l’utilisation des univers virtuels pour un sujet.
Le féminin à l’adolescence
Authors: Bentata Hervé
Published: October 2015

Si le passage adolescent comprend la nécessité d’accéder à sa féminité ou sa masculinité, dans cette phase difficile, les difficultés rencontrées ne sont pas les mêmes suivant les sexes. Les craintes et les souffrances névrotiques concernant le féminin entravent la vie sociale et affective de ces jeunes. Cette situation est parfois d’autant plus désolante que le machisme qui en découle affecte aussi la vie de leurs compagnes… Et si information et éducation sexuelles restent le plus souvent sans effet sur ce « complexe du féminin », une aide psychothérapique avertie peut être précieuse pour ces jeunes. Cependant, ces angoisses concernant le féminin ne renvoient pas toujours à des problématiques névrotiques mais concernent parfois de réels problèmes d’identité sexuelle, voire l’assise même de la personnalité des adolescents, laissant craindre de possibles évolutions psychotiques ou bien des problématiques dites « borderline ». Comme le montre l’analyse de la pièce de théâtre de Frank Wedekind L’éveil du printemps , dans de telles situations, des passages à l’acte suicidaire graves peuvent se produire. D’où l’importance clinique du repérage de ces jeunes à risque et leur accompagnement.
Une adolescence d’exception
Authors: Mansouri Malika
Published: October 2015

Penser les révoltes de ceux que l’on nomme indéfiniment « français d’origine étrangère » implique de questionner ce qui préside à l’être-ensemble actuel : le colonial et son cortège de violences réelles et symboliques, doublés d’un déni du collectif. Malgré tous les silences, le temps n’efface pas les « débris » d’histoires traumatiques qui façonnent une part importante du psychisme des humains. Les descendants du colonial, héritiers d’une situation d’exception, en savent quelque chose, dans l’intime, de ce que c’est que d’être en position de se sentir assujetti. Quelles solutions, dans le temps de l’adolescence, pour ces légataires de l’exception républicaine ?
Adolescents autistes pris en charge en hôpital de jour
Authors: Chocron Michael , Bancilhon Julien
Published: October 2015

Dans le cadre de la prise en charge de jeunes autistes sont inclus, depuis plusieurs années, deux dispositifs, l’un mixte, l’autre non, ayant pour but de fournir un lieu d’élaboration pour les questions tournant autour de la sexualité. L’article témoigne de cette expérience et des réflexions formulées à son propos. Il ne s’agit pas de groupe de parole mais de communication sur le thème de la sexualité, de la différence garçon-fille avec l’objectif de ne pas laisser ces questions être traitées uniquement dans le cadre familial. On peut noter l’utilisation de poupées sexuées, de représentations par le théâtre. Mais force est de constater avec les auteurs « que ce soit au nom d’une vie psychique qui serait restée bloquée dans la période infantile, ou au nom d’un âge mental prétendument trop bas pour accéder à une vie affective et sexuelle, que le débat est souvent maintenu dans une forme de puritanisme qui participe du cloisonnement des savoirs et d’un avancement à tout petits pas ».
Sexualité adolescente et prise en charge institutionnelle
Authors: Albertini Laetitia , Birnesser Juliette , Motteau Clara
Published: October 2015

Composante essentielle du difficile parcours de maturation/construction identitaire à l’adolescence, la dimension sexuelle reste pourtant aujourd’hui trop souvent mal comprise, voire mal « traitée » par les équipes médico-socio-éducatives en charge d’adolescents. Entre les deux extrêmes positions défensives que constituent la banalisation totale et l’interdiction arbitraire, quelles sont les possibles voies d’accompagnement ? Comment éviter les dangereux écueils de la complicité incestuelle et du déni/clivage ? Aux prises avec ces questions depuis la création de son Unité Soins Intégration Scolaire, c’est au jour le jour que l’équipe pluri-disciplinaire de psychothérapie institutionnelle de la Clinique de Saumery construit ses repères, et tente d’apporter matière à réflexion dans un contexte général par ailleurs fortement marqué par les polémiques entourant les enjeux sociétaux d’identité de genre.
Expérience de décentralisation de la Maison des adolescents… dans un collège de Saint-Denis
Authors: Stavroulakis Sophie , Talabard Léa
Published: October 2015

L’article présente l’expérience d’une enseignante de Casado faisant l’objet d’une participation aux opérations de prévention dans un collège de la ville de Saint-Denis. Les missions sont donc principalement d’accueillir des jeunes en difficulté scolaire (déscolarisation, problèmes de comportement, d’orientation…), de suivre leur scolarité en lien avec les collèges, d’animer des ateliers (aide aux devoirs, théâtre, conte), et enfin de mener des actions de prévention au sein des établissements scolaires. Cela s’opère par le biais de groupe de parole avec les collégiens avec la difficulté soulevée par les auteurs qu’ils doivent d’abord en passer par l’administration du collège. Des vignettes courtes illustrent l’expérience très riche.
Écrire pour dire ses émotions
Authors: Rizzi Alice Titia , Viardot Claire
Published: October 2015

Cet article s’intéresse à un groupe d’écriture thérapeutique centré sur les émotions, destiné à une population adolescente. C’est au sein du service d’hospitalisation de la Maison de Solenn que nous avons créé – selon le paradigme de l’expressive writing de James Pennebaker – cette médiation, dans le but d’inciter les patients à mettre en mots et en histoires leurs expériences souvent douloureuses à l’adolescence. Au fil des séances, ce travail d’élaboration engage le patient dans une véritable construction de sa narrativité émotionnelle, lui ouvrant le chemin vers une construction identitaire solide dans le processus de guérison future.
Le placement familial… : sa validation et ses attributions par rapport aux lois de protection de l’enfance
Authors: Aparecida Giorgetti Valente Janete
Published: October 2015

Cet article a pour objectif de contribuer à une réflexion sur le placement familial dans le contexte de l’actuelle législation brésilienne, afin de transformer en mesures concrètes son application. Sa réalisation s’appuie sur l’étude de trajectoires, suivies par différents professionnels qui travaillent ou ont travaillé dans des services existants et d’autres déjà fermés, dans le sud et le sud-est du pays. Il propose également de confronter le placement familial à certaines nécessités afin de le rendre opérationnel en tant que politique publique nationale.
L’image de l’enfant noir… dans les albums de littérature de jeunesse brésilienne
Authors: Barbosa Valéria
Published: October 2015

L’auteur présente un court extrait de sa recherche de thèse de doctorat en sciences de l’éducation qui porte sur l’image de l’enfant noir dans la littérature de jeunesse brésilienne. Elle met en avant six albums jugés représentatifs de cette littérature. L’auteur conclut que des progrès sensibles sont visibles dans ces albums, notamment en matière de représentations plus positives des enfants noirs.
3D Interconnect: The Challenges Ahead
Authors: Prior Brandon
Published: October 2015

3D package solutions now account for a significant portion (~20%) of all die area processed today. Most all of this is still assembled in standard package configurations (FBGA, SO, MicroSD, etc) using wirebond interconnect. This paper will look at the many current technologies that have been adopted to enable 3D, and understand what the next steps will be to enable true die to die interconnection in a cost effective manner.

Recent examples of various technologies from Fan-out WL-CSP, TSV for image sensors and MEMS, and other 3D concepts will be shown to highlight advantages and disadvantages of these emerging technologies. Prismark's roadmap for 3D adoption will be compared to previous new technology roadmaps to demonstrate the history of older technologies' ability to hang on to market share.
Migration to FC in the Wireless Application Space and Associated Challenges
Authors: Bezuk Steve
Published: October 2015

Summary: Expanding wireless application areas will continue to drive increased semiconductor demand. Consumer demand for increased features/ capability is driving mobile wireless prodcut demand - smaller, sleeker, more affordable devices. Innovative technology scaling is required to meet challenges of low cost, low power and smaller form factors. Co-design of architecture, design, silicon and packaging are required to solve issues with transition to flip chip due to: non-compliant interconnect (pb-free and Cu pillar); mechanically weak dielectrics in die; pressure to shrink package height and x,y dimensions; control co-planarity and high temperature warpage.
Optimal Thermal Management of Microelectronic Packages
Authors: Chiriac Victor
Published: October 2015

The increasing trend in power levels and associated densities leads to the need of design thermal optimization, at module and at system (module-board stack-up) levels. The microelectronics industry is facing multiple challenges as it tries to promote smaller, faster and cost-effective packages, yet trying to cope with potential thermal bottlenecks. The present study investigates a family of packages, whose thermal and electrical performances are far superior to the classic (standard) packages.

A 3-D conjugate numerical study was conducted to evaluate the thermal performance of Gallium Arsenic (GaAs) die packaged in Quad Flat No Lead (QFN) packages for various wireless and networking applications. Two different QFN packages are investigated: a standard package and a Power package (PQFN) with thicker leadframe and solder die attach. The thermal impact of die attach material, leadframe thickness, die pad size, and board structure is evaluated and provides valuable information for product designers.

Two powering scenarios are investigated: 1) one for standard operating parameters and 2) an alternative for extreme operating powering scenarios. Results indicate that the peak temperature reached on the die for 3x3 mm QFN under normal powering conditions is ~138.5°C (or 119°C/W junction-to-air thermal resistance), while for the extreme scenario, the junction temperature is ~186°C (or 125°C/W junction-to-air thermal resistance). The top Au metal layer has limited impact on lateral heat spreading.

Under extreme powering conditions, the PQFN package reaches a peak temperature of ~126°C (66°C/W thermal resistance). A ~32% reduction in peak temperature is achieved with the 5x5 PQFN package. The improvement is mainly due to the larger package size, high conductivity die attach material, thicker leadframe and more board thermal vias.

A parametric study shows that the increase in leadframe thickness from 0.2 mm (8 mils) to 0.5 mm (20 mils) in the QFN package leads to only 3% reduction in peak temperature. By comparison, the die attach material (conductive epoxy vs. solder) has significant impact on overall reduction in peak temperature (~12%).

Experimental measurements using Infrared (IR) Microscope are performed to validate the numerical results.
Through Silicon Via Technology: Cost effective Cu-TSV Interconnects by EMC3D and Technical Challenges with Cu-TSV
Authors: Siblerud Paul , Beica Rozalia , Kim Bioh , Young Erik
Published: October 2015

The development of IC technology is driven by the need to increase performance and functionality while reducing size, power and cost. The continuous pressure to meet those requirements has created innovative, small, cost-effective 3-D packaging technologies. 3-D packaging can offer significant advantages in performance, functionality and form factor for future technologies. Breakthrough in wafer level packaging using through silicon via technology has proven to be technologically beneficial. Integration of several key and challenging process steps with a high yield and low cost is key to the general adoption of the technology. This paper will outline the breakthroughs in cost associated with an iTSV or Via-Mid structure in a integrated process flow.

Key process technologies enabling 3-D chip:Via formationInsulator, barrier and seed depositionCopper filling (plating),CMPWafer thinningDie to Wafer/chip alignment, bonding and dicing

This presentation will investigate these techniques that require interdisciplinary coordination and integration that previously have not been practiced. We will review the current state of 3-D interconnects and the of a cost effective Via-first TSV integrated process.
Integration Aspects of the Implementation of Through Silicon Vias (TSV) for CMOS Image Sensors
Authors: Thomas Dave , Michailos Jean , Hotellier Nicolas , Metellus Gilles , Guyader Francois , Inard Alain , Buchanan Keith , Sanz Dorleta Cortaberria , Song Yiping , Wilby Tony
Published: October 2015

One of the first device types to benefit from TSV implementation is the CMOS image sensor, an image capture device designed to combine high image quality within a compact form-factor that can be mass produced at low cost. End markets include mobile phones, PDAs and gaming consoles.

STMicroelectronics is pioneering their production, based on ≤65nm CMOS technology, at its 300mm facility in Crolles. These sensors employ TSVs as part of a wafer level package allowing the camera module to be directly soldered to a phone PCB thereby saving cost, space and time to manufacture. SPTS's Versalis fxP system is being used to combine multiple TSV formation processes onto one platform including hard-mask deposition, hard-mask etching, TSV etching, partial PMD etching, dielectric liner deposition and spacer etching to define the area for the metal contact. All processes are carried out on a silicon wafer bonded to a glass carrier, through which the final device is illuminated.

We will present a TSV silicon etch process for 70 μm x 70 μm Vias in a thinned 300mm silicon wafer on glass carriers with an etch rate uniformity of ≤±1% and sidewall scalloping in the range 80–210 nm. We will show that this process can be conveniently mixed in production with the various oxide etches. A PECVD dielectric liner deposited at <200 °C having excellent coverage, thermal stability and adhesion combined with a breakdown voltage >8 MVcm−1 and leakage current <1E-7 Acm−2 will also be described. Process integration aspects will be discussed using high resolution SEMS to show the key material interfaces in critical areas such as feature corners and along sidewalls.

Furthermore the successful implementation of TSV technology on ST's CMOS image sensors will be demonstrated through a combination of electrical characteristics, parametric device data and overall device performance/reliability.
Fluidic Devices in PCB Technology
Authors: Nowottnick Mathias , Pagel Lienhard , Gassmann Stefan
Published: October 2015

Printed circuit boards (PCB) are widely used in electronics. They have the wiring and holding task for electronic devices. With the adding of more and more functionality to miniaturized devices the PCBs have to include more and more functionality. However, the usage of PCBs in fluidic applications is rare. Adding a fluidic functionality to a PCB will create intelligent fluidic systems at low cost. At the University of Rostock a special technology for creating fluidic systems in PCBs is developed. Low-Flow micro systems as well as High-Flow systems are feasible. The main advantage using PCBs is to create compact devices at low cost.

In this paper an overview is given over the devices made at the University of Rostock. This description include low flow devices like a thermopneumatical driven pump, a bimetal valve, a pressure sensor with force compensation, a bubble detector and static mixers. As well as a high flow device, the insufflator. The insufflator is a medical device where a flow rate of up to 45l/min has to be realized. This is a very good example for the high flow fluidic PCB technology where normal multi layer PCBs are used to hold the channels inside the PCB and connect pneumatic components electrically and pneumatically on the same substrate.

A short introduction to both technologies is given and the function of the devices is explained.
Integration of Electroactive Polymers in MEMS Ultrasonic Sensors
Authors: Kranz Michael , Whitley Michael , Sanchez Sharon , Allen Michael
Published: October 2015

The U.S. Army AMRDEC, Stanley Associates, and the Georgia Institute of Technology are developing spectrally sensitive acoustic emission sensors for the detection of various phenomena of interest in Army missiles and assets. Multiple systems would benefit from monitoring the acoustic spectrum and identifying signatures of interest. These would include monitoring sounds external to Unattended Ground Sensors, looking for specific sounds associated with machine failure in a condition-based maintenance scenario, and identifying items that are impacting each other. Potential device designs employ electroactive polymers to convert acoustic waves into electrical impulses.

Many electroactive polymers are, however, not compatible with standard MEMS processing, particularly at elevated temperatures. Piezoelectric films, such as PVDF, require stretching and poling processes to orient the crystal structure. Electret films also require poling to create a permanent polarization, plus discharge occurs at relatively low-temperatures. These types of films are difficult to integrate directly into MEMS devices because of these incompatible processes. The films are therefore added using post-fabrication bonding and assembly processes, thus reducing design flexibility and increasing cost. This paper will present techniques being developed to integrate electroactive polymers directly in MEMS sensors as opposed to performing post-fabrication assembly of electroactive films into sensor structures.
Underfill Induced Tensile Strain Ratcheting and its Effect on Flip Chip Solder Bump Fatigue
Authors: Hillman Craig D. , Schueller Randy , Caswell Greg
Published: October 2015

The effects of low Tg underfill material on the reliability of high-Pb first level interconnects were assessed through elastic-plastic finite element modeling and inspection of failure sites at the first-level interconnect. Temperature-dependent changes in specific underfill parameters (elastic modulus and coefficient of thermal expansion) induced a primary tensile stress within the solder bump. The presence and magnitude of this tensile stress were highly dependent upon the maximum and minimum temperature of exposure. Under certain specific thermal conditions, a form of tensile ratcheting was identified through finite element modeling.

The application of tensile stress was found to induce a change in degradation behavior and rates relative to the nominal shear stress state (see Figure). This effectively eliminated distance-to-neutral point as a predictor of first-level interconnects performance and required the development of new models to predict solder bump behavior. A discussion on this transformation in stress states and the potential influence on changes in part qualification procedures are provided.
ENEP – A Cost-Effective Alternative for High Reliability Soldering Applications
Authors: Ramos Gustavo , Oezkoek Mustafa , Lamprecht Sven , Roberts Hugh
Published: October 2015

Electroless nickel / immersion gold (ENIG) has been recognized within the electronics packaging industry as a reliable surface finish for soldering applications. Unlike surface finishes, such as OSP, immersion silver or immersion tin, which produce a Cu-Sn intermetallic upon soldering, the nickel layer of ENIG acts as a barrier to minimize copper dissolution during the soldering application. This function is especially important for assemblies that require multiple reflow steps. However, if not properly controlled, excessive corrosion of the nickel by the immersion gold step can also cause the well documented “black pad” effect, often resulting in solder joint reliability issues, including brittle fracture.

As an alternative to ENIG, an electroless pure palladium layer over the electroless nickel (ENEP) provides a solderable surface without the noted risk of damage to the underling nickel layer. By eliminating the corrosive attack of the gold bath, the final layer stack would be suitable for high reliability soldering involving both IC substrate and PWB applications. In addition, because of the current high price of gold, replacing it with a pure palladium deposit can offer measureable cost savings for the ENEP process in comparison to ENIG.

The paper summarizes an in-depth study of the effect on solder joint reliability caused by replacing the immersion gold by an electroless pure palladium layer. The study includes evaluations for both Pb-free (Sn-3.0Ag-0.5Cu) and eutectic SnPb (63Sn-37Pb) soldering applications. Results of investigations include: (1) cold ball pull testing to evaluate solder joint integrity, (2) SEM examinations of the underlying nickel surface, (3) IMC examinations to quantify nickel thickness degradation after multiple solder reflow cycles and (4) surface wetting through solder spread examinations. The paper discusses the relatively simple surface finish that, if proven effective in large-scale fabrication, may offer measureable performance and cost benefits in comparison to the more traditional ENIG finish.
Wafer Level Packaging Cost Modeling
Authors: Palesko Chet A.
Published: October 2015

Wafer level packaging is often the most cost effective approach to achieve miniaturization. However, if it is used for the wrong application, it can be very expensive. The significant difference in printed circuit board interconnect design rules and semiconductor interconnect design rules must be addressed in any type of packaging approach, and presents unique challenges for wafer level packaging. If miniaturization is not required, this translation of semiconductor design rules to PCB design rules is most easily accomplished in a traditional wire bond package. However, when the package size and the die size must be the same, the package IO count is limited. Fanout WLP is an option to overcome the WLP IO restriction, but still achieve cost effective miniaturization.

We will present the results of activity based cost and yield modeling of traditional wafer level packaging, fanout wafer level packaging, and flip chip packaging across a range of die sizes, package sizes, and defect densities. These results will show the most cost effective technology to match a variety of applications and package parameters.
Process Control for Wet Etching for Silicon Wafer Thinning
Authors: Mauer Laura , Itzkowitz Herman , Taddei John
Published: October 2015

Thin wafers have become a basic need for a wide variety of new microelectronic products. Thinner die are being required to fit into thinner packages. Wafers that have been thinned using a final wet etch process on the backside have less stress compared with standard mechanical backgrinding. Isotropic wet etching of silicon is typically done with a mixture of nitric and hydrofluoric acids along with the addition of chemicals to adjust for viscosity and surface wettability for single wafer spin processing. As the silicon is etched and incorporated in the etching solution the etch rate will decrease with time. This variation has been modeled. The focus of this paper is to compare the process control techniques for maintaining a consistent etch rate as a function of time and wafers processed. The models allow for either the time to be extended, chemicals to be replenished or a combination of these. Results will be presented including the cost of ownership for each scenario.
ALX Polymer for Wafer Level Packaging: Mechanical Property Evaluation After Multiple Lead-Free Solder Reflows
Authors: Eriguchi Takeshi , Wang Orson , Tsuruoka Kaori , Ishibashi Yuichiro , Zhang Yong
Published: October 2015

For bumping and wafer level packaging (WLP) applications, BCB and polyimide are the predominant spin-on dielectric materials used for re-passivation, redistribution, interlayer dielectric, and stress buffer layers. Each of these materials has their respective strengths and weaknesses. BCB has exceptionally low shrinkage on cure and moisture absorption, low curing temperature, and a low dielectric constant, but is a mechanically brittle material which limits its application in bump-on-polymer applications. Polyimides are superior mechanically to BCB and are utilized more in bump-on-polymer structures, but suffer from much higher shrinkage on cure and moisture absorption (which can lead to blistering if not carefully processed), have higher dielectric constants, and have much higher cure temperatures.

ALX spin-on polymer dielectric was developed to combine low shrinkage, low moisture absorption, low dielectric constant, and excellent mechanical and stress buffering properties with a cure temperature between 190C to 250C, depending on the application(1-3). Previous papers have reported the mechanical properties at 190C and the application of ALX in eutectic SnPb solder bump structures. The use of lead-free solder requires reflow temperatures up to 260C. Although ALX polymer is curable at less than 200C, the influence of lead-free solder reflow wasnft investigated. In this presentation we evaluate mechanical property changes of ALX Polymer films after different cure schedules and multiple reflows at lead-free solder temperatures. The impact of these parameters on WLP will be discussed.