bluuebunny/crossref_metadata_2025 huggingface dataset:
Assessing Utilization and Effectiveness in Public Participative and Volunteered Geographic Information Systems for Environmental Data
Authors: Moreno April , Osailan Sarah
Published: December 2018

Geographic Information Systems (GIS) can serve as a planning tool to promote community health at many levels, such as the policy, organizational and public levels. The Brownfields to Healthfields (B2H) program involves creating new opportunities to support community public health, including the development of park spaces and new hospital facilities. However, there was no existing portal for organizations to access a map of brownfields data to meet the required criteria of the organization in seeking a space for transformation to a “healthfield” or other public services facility. Since the various types of community and demographic data were scattered, it was necessary to combine the data in a web application available to all stakeholders. This paper discusses the utilization of a new concept of operation, which includes participative and volunteered approaches that are addressed to include the contribution of various stakeholder groups, and to further improve planning for public health.
E-Government Politics as a Networking Phenomenon
Authors: Kassen Maxat
Published: December 2018

Asking such a simple question as what e-government politics really is to policymakers, practitioners and other stakeholders in the sphere and all the more so in a cross-country and cross-institutional manner could be an extremely prolific undertaking since it allows to generate a myriad of unique stories and perspectives about this phenomenon. E-government is a universally well-known concept in public policy, public administration, political and economic sciences and beyond and related academic and professional literature is really rich with demonstrative cases that represent these narratives well from various viewpoints and fields. In this regard, the key purpose of the article is not to update a state-of-the-art in the sphere but rather an attempt to synthesize and systematize all available institutional perspectives on the development of this truly multidimensional networking phenomenon equally from stakeholder, cross-institutional and cross-country perspectives.
Practicing What We Teach, Practitioner Reflections
Authors: DiEnno Cara Marie , Taylor Sarah Plummer
Published: December 2018

While the impact of service-learning on students and to some extent on communities is well documented, little research addresses the direct impact on instructors. To fulfill the historic civic mission of education and contribute to civic health, a holistic understanding of impacts on all stakeholders will be necessary. This chapter presents the findings of interviews conducted with diverse service-learning practitioner types (higher education faculty members, K-12 teachers, and nonprofit instructors), institutions and years of experience. The findings demonstrate three categories of benefits that accrue to practitioners: pedagogical, personal and relational. Additionally, indirect impacts also contribute to practitioners' satisfaction. Many of these impacts map nicely onto the existing literature that describes the motivations that lead practitioners to undertake service-learning. The link then between motivations and actual benefits received leads to several salient recommendations that can support instructors and administrators wishing to advance engaged work at their institutions.
Post as Much and as Diversely as Possible
Authors: Maksuti Alem , Deželan Tomaž
Published: December 2018

The daily interaction between political parties and voters is a driving force in election campaigns and can influence their outcomes. The theory of campaign intensity holds that the timing of message delivery in an election campaign is a key component of the strategies used by political actors. However, this theory also warns political actors to be cautious about the timing of different types of messages sent during the election campaign. Our objective is to examine the intensity and types of messages Slovenian political actors communicated through Twitter during different stages in the 2014 national election campaign. Our study conducts a content analysis of 7,113 tweets posted during the last four weeks of the official election campaign. It includes 17 official accounts of Slovenian parties, party leaders, and influential party twitterians. The results indicated that the stage of the campaign and the differences between established and fringe political parties significantly influenced the intensity of Twitter communications during the study period. The results also revealed that the political actors tweeted different types of political messages (e.g., to inform and to persuade voters) during different stages of the campaign.
Influence of Social Networking Sites on Civic Participation in Higher Education Context
Authors: Ahrari Seyedali , Zaremohzzabieh Zeinab , Abu Samah Bahaman
Published: December 2018

This book chapter introduces the debate on youth civic participation specifically looking at the benefits in the higher educational context. This chapter promotes the recent level and character of using the social networking sites and their possibility to admit for the growth of higher education towards student civic participation. The chapter also reviews the recent studies on the civic uses of the social networking sites and argues the learning methods and consequences that could be practiced by learners and instructors when using the social networking sites for civic participation. Hence, the Bandura's social cognitive theory and cognitive engagement theory will be applied to create the framework for exploring the influence of civic efficacy and knowledge, access to civic information on the social networking sites, and civic interest on the association between the social networking sites and youth civic participation. It helps in recognizing the motivation that inspires the youth online civic participation actions in the higher educational settings.
From Street Protests to Facebook Campaigns
Authors: Rathnayake Chamil
Published: December 2018

This study examines effects of political cynicism and efficacy on online political engagement of Sri Lankan undergraduates. A survey was conducted among 155 Sri Lankan undergraduates that support the views of the Inter-University Student Federation (IUSF), an evidently anti-government student movement that claims to be dedicated to protecting free education in the country. Initial analysis showed that respondents were highly cynical (mean: 4.49 on a 1 to 5 scale). The study hypothesized that both political cynicism and efficacy exert a positive impact on online political engagement of respondents. The study also tested the effects of two moderators (extent of Facebook use, and the year of study). Results showed that political cynicism exerts a positive impact (standardized coefficient:.274, p:.000) on online political engagement, and this effect is positively moderated by the extent of Facebook use (standardized coefficient:.261, p:.000). Results also showed that internal political efficacy is not a significant predictor of the dependent variable.
Civic Engagement Through Social Media
Authors: Maxwell Sarah P. , Carboni Julia L.
Published: December 2018

Civic engagement through social media is a strategy employed by nonprofits typically using one-way targeted information dissemination to stakeholder groups. Improving the quality of communities and ameliorating social problems sustain nonprofit foundation missions, suggesting that two-way dialogic communication inspiring action is preferable for effective civic engagement over one-way communication. Using Facebook content analyses for three types of foundations—community, corporate, and independent grant making foundations—the authors employ a Relationship Management Theory (RMT) approach to assess effective civic engagement. RMT emphasizes the organization's dynamic interactions with stakeholder publics (Ledingham, 2003). The authors code posts according to whether they ask stakeholders to act (e.g. - asking users to respond to a question or share information). Using a quantitative modeling approach, they determine whether posts requesting stakeholder action are more likely to result in stakeholder engagement with posts. They examine type of post- status updates, external links, and multimedia- to determine whether type of post is also related to civic engagement. Facebook data for 300 randomly sampled high asset-foundations were accessed using a social media analytics program. Overall, the authors find that private and corporate foundations are more likely to use social media on average. However, community foundations are more likely to use social media as a call to action. This study informs foundations and the larger nonprofit community on how to apply such techniques to their own organizations for continuous improvement in supporting their missions and civic engagement goals. This study is also germane to other types of nonprofit and public organizations seeking to increase stakeholder engagement with social media platforms.
Imperfect Bipartisanship and Spanish Pluralism
Authors: Escolar Marta Pérez
Published: December 2018

The objective of this research is to find if the success of Podemos in the 2014 European Parliament Elections and its activity on Twitter agrees with the theoretical perspectives that Dahlgren (2011) and De Ugarte (2007) developed or if there is a new civic participation paradigm that determines the success of the current political communication strategies. In order to verify this proposal, this study not only has applied Dahlgren and De Ugarte's theories, but it has also developed a tweets sampling methodology that permits collection and analysis of information from Podemos' tweets from the 25th March 2014 to the 24th May 2014. The main conclusion of this research is that there is not a ‘new civic participation model', but there are some emerging social and collective trends that De Ugarte and Dahlgren did not consider in their approaches, but that offer a context for the development of a new concept of “politics”.
Designing a PhD Proposal in Mixed Method Research
Authors: wa Mungai Ndungi
Published: December 2018

This chapter reviews the challenges and advantages of writing a mixed method research (MMR) proposal. The argument put forward is that a mixed method approach overcomes the shortcomings of the commonly used qualitative and quantitative methods. A brief definition of a research proposal is followed by a discussion on the different interpretations of a mixed method and what makes mixed methods ideal in the proposal example that follows. A mixed method can be either one that utilizes qualitative and quantitative methods to different degrees or it can be regarded as a distinct method by itself. A mixed method is suitable where both different types of data can be collected, when the data adds value to what would be achieved using one approach and where cost also justifies it. A hypothetical case example where an application is being made to conduct an evaluation of an anti-truancy program is presented.
Community Empowerment Initiatives of Faith-Based NGOs
Authors: Chowdhury Shofiqur Rahman , Wahab Haris Abd
Published: December 2018

This chapter has been prepared for pursuing the first author's PhD study. It contains the basic components of a research proposal such as the background of the study, statement of the problem, research questions, objectives, scope, study significance, methodology, and the literature review including conceptual and theoretical framework, etc. The proposal found that the immediate response to humanitarian crisis, healthcare, the importance of values and cultural context in the operation area have made faith-based non-governmental organizations (FBNGOs) as a vital stakeholder in development. However, there is still a debate about the claim of having the advantage of FBNGOs in development intervention. Based on this proposal, the study is being conducted on an international FBNGO, working in Bangladesh, to investigate its community empowerment initiatives. The proposal could be a practical guideline for the academicians who are interested in studying the contribution of NGOs' in development discourse.
Community-Based Rehabilitation Program for Acid Assault Victims of Bangladesh
Authors: Islam Tahmina , Ah Siti Hajar Binti Abu Bakar
Published: December 2018

This chapter is a PhD research proposal of the first author based on qualitative research design. The study aims at exploring some community-based rehabilitation interventions for the acid victims (women) in Bangladesh. The proposal was submitted by the first author to pursue her PhD studies at the Department of Social Administration and Justice, Faculty of Arts and Social Sciences, University of Malaya, Malaysia. It contains major components of a research proposal that includes the background of the study, problem statement, research questions and objectives, literature review: conceptual and theoretical framework, the scope and significance of the study, and research methodology. This proposal also includes the work plan of the study. The proposal will be helpful to the students and readers who are interested in conducting research in this field.
Usage of Social Capital Among Migrant Workers for Their Livelihoods in Malaysia
Authors: Zaman Bushra , Hussain Rosila Bee Mohd
Published: December 2018

This chapter deliberates a PhD proposal of the first author based on a mixed method approach conducted at the Department of Anthropology and Sociology, Faculty of Arts and Social Sciences, University of Malaya, Malaysia. This proposal has been written with the requirement of a PhD proposal at the University of Malaya. This proposal includes the main components of a research proposal that includes the study background, literature review: conceptual and theoretical framework, research questions and objectives, statement of the research problem, significance of study, research methodology, and the time plan with the main tasks into a Gantt chart. This study will examine how social capital brings positive changes among the migrant workers' livelihoods. Here, social capital is a powerful tool that helps to make bridge through social networking, social trust, collective actions, sharing knowledge, and experiences in the livelihoods of the migrant workers. This chapter will be useful who are interested to conduct their study with a mixed method approach on this particular field.
Bioethanol Production From High Sugary Corn Genotypes by Decreasing Enzyme Consumption
Authors: Zabed Hossain
Published: December 2018

This is a PhD proposal defended in a 2012-2013 session at the Institute of Biological Sciences, Faculty of Science, University of Malaya, Malaysia. The proposal has been written in accordance with the requirements of the university under the sub-headings: background, problem statement, rationale, hypothesis and research questions, research objectives, literature review, methodology, scope, expected outcomes and concluding remarks, work schedule, and references. This proposal provides a comprehensive study on bioethanol production from corn. First, it discusses development and field experiments of high sugary genotypes (HSGs). Secondly, it provides a comparative evaluation of enzyme consumptions and ethanol production between normal and HSG corn genotypes. Finally, this proposal provides evaluation of the co-product quality for both groups of genotypes. The readers who are interested to conduct any further study on corn-based bioethanol would be benefited from this proposal.
Brazilian Solid Waste Policy (PNRS)
Authors: Júnior Hermes de Andrade
Published: December 2018

Brazil's national solid waste policy (PNRS) took nearly two decades to pass through legislative houses until it was approved as a law protecting the environment. During this period and after its approval, pro-environmental factors led to the right to transform and create protocols, agreements, and new companies in the sense of a reverse logistics or of a reversibility in the environmental effects of the supply chain. This chapter has aimed to present aspects of the Brazilian business reality in the process of implementation of the PNRS as a reflection on the perspective of product recycling and solid waste control and reverse logistics. The PNRS is in the phase of corporate expansion, taking stock of eight years since the creation of the law (2010). As some branches of Brazilian business activity have not yet had reverse logistics regulated, in the coming years there should be a much higher demand for this type of reverse business.
Compliance in Sustainability Reporting
Authors: Snezhko Svetlana , Coskun Ali
Published: December 2018

The research is aimed at assessing the benefits of compliance for corporate sustainability and sustainable development. The main achievement of the research is the outcome of the survey on companies' public reports to identify the trends and measure the progress achieved in disclosing information on compliance. There are both business and public drivers for disclosure of compliance information in non-financial reporting. Best practices in disclosing information on compliance by the company-leaders were revealed. There is a positive trend in the expansion of information on compliance in sustainability reports in recent years. Some problematic areas in reporting on compliance were identified. The outcomes of the research call for companies to disclose information on compliance in a more explicit way. The results may be valid for the improvement of corporate reporting practices.
Supply Chain Modernization
Authors: Gencer Yasin Galip
Published: December 2018

The global supply chain applications are evolving and changing globally. In order to increase success, some processes are now transferred to other firms. By such implementations, it is aimed to focus on the core business and to be successful. 3PL is the use of an external entity to perform some or all of the operations. The 4PL approach is a revolutionary approach to supply chain management. 3PL and 4PL activities are used for many purposes by multinational companies for increasing the productivity and efficiency and for decreasing the overall operational costs. Like all countries, Turkey also faces strategic organizational changes in terms of logistics activities. Modernization of logistic professes are widely examined in the literature. The scope of this chapter is the logistics modernization processes of Turkish companies, and it aims to inform about the modernization processes in Turkey by examining successful real-life examples.
Financial Flexibility and Corporate Investment
Authors: Erdoğan Seda Bilyay
Published: December 2018

This chapter investigates the impact of financial flexibility (FF) on investments, which constitutes the basis for sustainable corporate development. Using a large database of 1,205 firms from three emerging countries in Europe—Poland, Russia and Turkey—for the time period between 2000 and 2016. The authors provide evidence that financial flexibility, achieved through conservative leverage policies, enhances companies' investments and positively contribute to corporate sustainability. Moreover, as the number of years of low leverage kept by firms increase so does the impact of financial flexibility on corporate investment. Besides financial flexibility, internal cash generation capacity of firms, and sales growth also improve the investment capability of firms, improving corporate sustainability. The results support the hypothesis that financial flexibility enhances companies' investment capability, which is an extremely essential tool for firms to have in their businesses.
Regulatory Issues in Telehealth
Authors: Hardacre Alison , Wheeler Lachlan
Published: December 2018

Telehealth and digital health more broadly have become two of the fastest growing IT sectors in the world. They have the potential to transform lives everywhere, often before regulation has had the chance to catch up to everyday reality in healthcare. This chapter is grounded in clinical practice occurring at the time of writing and discusses at a high level regulatory issues in telehealth. This chapter argues that complexities regarding regulation over clinical applicability, patient identification, bandwidth, and funding mechanisms, as well as data storage, jurisdiction, and usage should not prevent uptake of telehealth and digital health given the clinical benefits of telehealth in countries such as Australia and internationally.
Empowering Cochlear Implant Users in Their Home Environment by eHealth Solutions
Authors: Vanpoucke Filiep , Philips Birgit , Smits Cas , Govaerts Paul J. , Doorn Inge , Stainsby Thomas
Published: December 2018

In the chapter, the authors address the prescient need to update accepted care models of cochlear implant (CI) fitting and long-term maintenance to better utilize self-care and tele-medicine possibilities, thus shifting the focus of CI maintenance to the recipient. There is a strong evidence base that such a move will better meet the needs of CI users, giving them greater control of and involvement in their hearing progress. Simultaneously, such an approach can better meet present shortcomings in the market acceptance and delivery of the benefit of cochlear implants, particularly in the elderly segment of the population, where device penetration of the market remains low (c. 7%). Such initiatives make it viable to reach many more users, as the present models are prohibitively expensive for such expansion. A case study of pilot software for CI maintenance based on tele-audiology is described with the inclusion of data collected from initial studies.
A Framework for Designing and Evaluating Internet Interventions to Improve Tinnitus Care
Authors: Beukes Eldré W. , Andersson Gerhard , Manchaiah Vinaya , Allen Peter M. , Baguley David M.
Published: December 2018

Tinnitus can be a debilitating hearing-related symptom. Access to evidence-based tinnitus interventions remain limited. Tele-audiology can assist by providing a clinically and cost-effective tinnitus management route. This chapter highlights how this is made possible by focusing on one form of tele-audiology, namely an internet-based intervention. Guidelines are provided for the development of such interventions. A framework outlining the various processes involved in evaluating newly developed interventions is also provided. The chapter closes by discussing factors that may facilitate or hamper the dissemination of new interventions into existing service delivery models. This well-defined outline for intervention development and evaluation can be applied and used to guide innovative intervention models by stakeholders.
Tele-Audiology and Security Management
Authors: Harvey Rick , Mueller Ingo
Published: December 2018

Security is a huge topic and not at all fun. It's hard to understand. It can be scary. It is always lurking. And poor security can bring down any system, regardless of how useful or important it is. Understanding the risks and vulnerabilities in systems and the motivations and methods of attackers is important in designing and operating secure and robust systems. This chapter aims to give a perspective on how to think about information technology (IT) security, how it applies to telehealth and audiology, and finally gives some recommendations about important considerations for tele-audiology systems that include devices, data housing, smartphone applications, and patient records.
Temporal distribution of rice sheath mite Steneotarsonemus spinki Smiley (Acari: Tarsonemidae) as influenced by the climatic parameters in the low-country wet zone of Sri Lanka
Authors: Chandrasena G. D. S. N. , Arachchi J. Ponnamperuma , Millawithanachchi M. C. , Rupasinghe M. G. , Coorey P. M. H. , Kumarathissa T. L. , Madurangani W. N. M.
Published: December 2018

The rice sheath mite (RSM; Steneotarsonemus spinki Smiley) is considered as the most destructive mite pest of rice (Oryza sativa L) in most of the rice-growing countries including Sri Lanka. Under heavy infestation of RSM, yield losses could reach up to 95%. Intermittent heavy showers negatively affects the RSM population while prolong dry periods influence positively on its population growth. However, no detailed studies have been done in Sri Lanka to elucidate the influence of weather conditions on population dynamics. This study was conducted in three different locations in the low country wet zone (LCWZ; elevation < 300m amsl; annual rainfall > 2,200mm) from 2013-2015 to examine the relationship between selected weather parameters and population dynamics of RSM. An experiment was laid out in a randomized complete block design in three replicates where crop was planted in 15-day intervals under pesticide-free condition. In weekly intervals, 25 leaf sheaths from 10 randomly selected plants from each plot were observed under microscope to count the number of mites. Climatic data were collected from respective meteorological units for the study period. The results revealed that, rainfall (r=-0.543) during the 2013/2014 Maha season at Bombuwala and RH (r=-0.86) during the 2013 Yala season at Labuduwa have a negative correlation with the RSM population, while temperature between 29 – 32 °C (r=0.794 and 0.902 at Bombuwala and Labuduwa, respectively, during the 2013 Yala season) and more sunshine hours with dry weather conditions affected favourably. Abundance of RSM-infested host plants in the previous season had a significant influence on its occurrence in new rice crop under favourable environment conditions.
“A Cross-Domain, System Planning Methodology”
Authors: ACITO Bill
Published: December 2018

Through several decades of electronic product design, three high-level design domains have emerged; IC (SoC) design, package (SiP) design and board (PCB/PWB) design. These three domains are separated and somewhat isolated, based on the EDA tools they use and by domain expertise. In many cases, the design tools come from 2 or 3 different EDA companies, leading to limited or no methods of sharing design data across the three domains.

This typically leads to an “over-the-wall” design approach, resulting in downstream layout complexities for the package and board design teams, requiring domain expertise (human in the loop) in these design domains. Typically, this high-level of complexity occurs because the package substrate and board form-factor are not planned and optimized in context of the IC(s). Thus, the automation of these layouts becomes nearly impossible and tremendous human interaction (domain expertise) is the only way to complete the designs cost-effectively. Moreover, this methodology directly impacts time-to-market and results in products that do not live up to cost or performance expectations.
Recess in the motherboard architectures for small form factor systems
Authors: Swettlen Tim , Landeros Juan , Mokler Scott , Caputo Antonio
Published: December 2018

This paper details an architecture that includes a recess in motherboard (RiMB) to enable increased packaging density of functional components for next generation mobile personal computing products. The recess depth, manufacturing methods, and SMT assembly data are included to provide the reader with a full overview of the manufacturing and assembly challenges.
Universal Connection Matrix: A Breadboard in a Package
Authors: Welsh Erik , Frantz Gene , Murtuza Masood
Published: December 2018

Process improvements driven by Moore's Law have created disparate processes for different best-in-class components, such as analog sensors, digital processors, RF electronics, and power electronics. Therefore, it becomes impossible to integrate all components of a system into a single System-on-Chip (SoC) giving rise to System-in-Package (SiP) devices which integrate multiple components together at the package level. However, traditional SiP devices are monolithic systems that have a fixed design and require a large investment to update or modify. To avoid the fixed nature of SiP devices and improve the ability to prototype with SiP technology, this paper presents the Universal Connection Matrix (UCM), a breadboard in a package.
Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration
Authors: Ko Cheng-Ta , Yang Henry , Lau John , Li Ming , Li Margie , Lin Curry , Lin JW , Chang Chieh-Lin , Pan Jhih-Yuan , Wu Hsing-Hui , Chen YH , Chen Tony , Xu Iris , Lo Penny , Fan Nelson , Kuah Eric , Li Zhang , Tan Kim Hwee , Lin Chia-Hung , Beica Rozalia , Lin Marc , Xi Cao , Lim Sze Pei , Lee NC , Tao Mian , Lo Jeffery , Lee Ricky
Published: December 2018

The design, materials, process, and fabrication of a heterogeneous integration of 4 chips by a FOPLP (fanout panel-level packaging) method are investigated in this study. Emphasis is placed on (a) the application of a dry-film EMC (epoxy molding compound) for molding the chips, and (b) the application of a special assembly process called Uni-SIP (uni-substrate-integrated-package) for fabricating the RDLs (redistribution layers) of the FOPLP. The ABF (Ajinomoto build-up film) is used as the dielectric of the RDLs and is built up by the SAP (semi-additive process). The electroless Cu is used to make the seed layer, the LDI (laser direct imaging) is used for opening the photoresist, and the PCB (printed circuit board) Cu plating is used for making the conductor wiring of the RDLs. The panel dimensions are 508mm × 508mm. The package dimensions of the FOPLP are 10mm × 10mm. The large chip size and the small chip sizes are, respectively 5mm × 5mm and 3mm × 3mm.
Fine Pitch(40μm) Integration Platform for Flexible Hybrid Electronics using Fan-Out Wafer-level Packaging
Authors: Hanna Amir , Alam Arsalan , Ezhilarasu G. , Iyer Subramanian S.
Published: December 2018

A flexible fan-out wafer-level packaging (FOWLP) process for heterogeneous integration of high performance dies in a flexible and biocompatible elastomeric package (FlexTrateTM) was used to assemble 625 dies with co-planarity and tilt <1μm, average die-shift of 3.28 μm with σ < 2.23 μm. Fine pitch interconnects (40μm pitch) were defined using a novel corrugated topography to mitigate the buckling phenomenon of metal films deposited on elastomeric substrates. Corrugated interconnects were then used to interconnect 200 dies, and then tested for cyclic mechanical bending reliability and have shown less than 7% change in resistance after bending down to 1 mm radius for 1,000 cycles.
Power cycle tests of high temperature Ag sinter die-attach on metalized ceramic substrate by using micro-heater SiC chip
Authors: Kim Dongjin , Nagao Shijo , Wakasugi Naoki , Yamamoto Yasuyuki , Suetake Aiji , Takemasa Tetsu , Suganuma Katsuaki
Published: December 2018

Next generation power semiconductors, e.g. SiC and GaN, are emerging for the further minimization and high current/voltage of power devices with high reliability covering wider operating environments than those based on Si. To implement high reliability operation, the key technology is the control of the temperature distribution in the module, and thermal stress caused by the heat generated by power loss. In the present study, we have developed SiC micro-heater chip with temperature probe to evaluate thermal characteristics of an assembled system of Ag sinter die-attach on metalized ceramic substrate (Cu/Si3N4/Cu) during the repetitive power cycling. The test specimens were fixed on a water cooling system, and steady-state heat resistance of the system was measured during the power cycling. For comparison, Pb-Sn, Sn-Cu-Ni-P, Sn-Ag-Sb-Cu solders were used as die-attach material bonded on the same metalized ceramic substrates. The maximum applied power exceeds 200 W with cycles of 2 seconds of heating and 5 seconds of cooling, and the test cycles was over 5000 cycles. The power cycle number dependence on the temperature swing and thermal resistance characteristics would be discussed, in connected with the power cycle testing for real power devices.
Molding Recipe Study for MUF Solder Crack Improvement
Authors: Chen Scott , Liang Leander , Hsu Pallas , Tsai Tim , Liang Mason , Shy Michael
Published: December 2018

In recent years, flip chip technology becomes more and more important with benefits of thin package profile, reduction of package outline, and excellent electrical and thermal performance by connection of copper pillar bumps (CuP) or C4 solder bumps. In order to fill the die gap to prevent voids problem, two encapsulated solutions could be applied: capillary underfill (CUF) and molded underfill (MUF). In general comparison, CUF means to dispense underfill first to fill in die gap then proceed over-molding afterward; and MUF is directly fill under and above die by mold compound. The advantages of MUF solution are low cost and high throughput, however, it will suffer other assembly issues such as solder extrusion and solder crack, and might result in potential function failure. To form these kinds of defects, we suspected that solder will plastically deform under thermal stress treatment, which comes from unbalance mold transfer pressure and material expansion stress during thermal process. In this article, we have tried to investigate the mechanism of solder crack through molding recipe DOE (Design of Experiment) and mold flow simulation. The test vehicle is 12 × 12 mm2 FCCSP, with 6 × 5 mm2 die size. The bump type is copper pillar bump and pitch/size are 126 um and 35 × 60 um2, respectively. The molding recipe has been evaluated by cross section, and it revealed that molding transfer time and molding temperature are directions toward improvement of solder crack issue.
Understanding Mold Compound Behavior on Flip Chip QFN Packages
Authors: Camenforte Ruby Ann M. , Colte Jason , Sumalinog Richard , Sanchez Sylvester , Williamson Jaimal
Published: December 2018

Overmolded Flip Chip Quad Flat No-lead (FCQFN) is a low cost flip chip on leadframe package where there is no need for underfill, and is compatible with Pb free or high Pb metallurgy. A robust leadframe design, quality solder joint formation and an excellent molding process are three factors needed to assemble a high performance FCQFN. It combines the best of both wirebonded QFN and wafer chip scale devices. For example, wafer chip scale has low resistance, but inadequate thermal performance (due to absence of thermal pad), whereas wirebonded QFN has good thermal performance (i.e., heat dissipated through conductive die attach material, through the pad and to the board) but higher resistance. Flip chip QFN combines both positive aspects – that is: low resistance and good thermals.

One of the common defects for molded packages across the semiconductor industry is the occurrence of mold voiding as this can potentially affect the performance of a device. This paper will discuss how mold voiding is mitigated by understanding the mold compound behavior on flip chip QFN packages. Taking for example the turbulent mold flow observed on flip chip QFN causing mold voids. Mold compound material itself has a great contribution to mold voids, hence defining the correct attributes of the mold compound is critical. Altering the mold compound property to decrease the mold compound rheology is a key factor. This dynamic interaction between mold compound and flip chip QFN package configuration is the basis for a series of design of experiments using a full factorial matrix. Key investigation points are establishing balance in mold compound chemistry allowing flow between bump pitch, as well as the mold compound rheology, where gelation time has to be properly computed to allow flow across the leadframe.

Understanding the flow-ability of mold compound for FCQFN, the speed of flow was optimized to check on its impact on mold voids. Mold airflow optimization is also needed to help fill in tighter bump spacing but vacuum-on time needs to be optimized as well.
FCCSP IMC Growth under Reliability Stress follow Automotive Criteria
Authors: Liu (Xenia) Wei-Wei , Weng Berdy , Li Jerry , Yeh CK
Published: December 2018

The kirkendall void had been a well-known issue for long term reliability of semiconductor interconnects, while even the KVs existing at the interfaces of Cu & Sn, it may still be able to pass the condition of un-bias long term reliability testing, especially for 2,000 cycles of temperature cycling test and 2,000hrs of high temperature storage. A large numbers of KVs was observed after 200cycles of temperature cycling test at the intermetallic Cu3Sn layer which locate between the intermetallic Cu6Sn5 & Cu layers. These kinds of voids will growth proportional with the aging time at initial stage, but slowing down attribute to the barrier layer of Cu3Sn & Cu interfaces. This paper compare various IMC thickness as a function of stress test, the Cu3Sn & Cu6Sn5 do affected seriously by heat, but Ni3Sn4 is not affected by heat or moisture.
The Effect of Nickel Oxidation Formed in the Interface of ENEPIG Structure for Flip Chip Technology
Authors: Chuang Chuan Lung , Shu Min-Fong , Tseng Yi-Hsiu
Published: December 2018

In flip chip assembly, the smaller solder ball is used in chip and substrate joint. This may have an adverse influence on the reliability of electronic products. Thus, the mechanical strength of solder joint is an important topic for the major reliability in electronic assembly technology. We found the intermetallic compound (IMC) crack issue for Electroless Ni(P) / Electroless Pd(P) / Immersion Au (ENEPIG) Interposer product. In this study, we analyzed the failure samples, for ENEPIG processes verified to find out the IMC crack root cause. The interposer pad structure for these samples was manufactured by ENEPIG process, in which the formation of the oxidation layer is affected by the duration that the sample is exposed on top of Ni bath. These samples print solder paste were performed multi-times reflow for ENEPIG and solder interfacial reaction observation to clarify the nickel oxidation influence on crack issue. These samples were observed and analyzed by Scanning Electron Microscope (SEM), Focused Ion Beam (FIB), Transmission Electron Microscope (TEM), and Energy-Dispersive X-ray Spectroscopy (EDX). The interface strength between ENEPIG and solder were tested by hot bump pull test (HBP), and also has the adhesion analysis. The results show that with the shorter exposure on top of nickel bath is no nickel oxidation formed and the interface has a higher pull strength, with a longer exposure on top of nickel bath had more nickel oxidation formed in the ENEPIG interface and also reveal lower pull strength. Therefore, the IMC crack was induced by the void at ENEPIG interface, which was the reaction of nickel oxidation and Au chemical, and the control of the exposure time on top of nickel bath can inhibit the oxidation formation to reduce the IMC crack risk.
Result of high accelerated stress test of organic substrates made by integrated dry process
Authors: Habu Tomoyuki , Endo Shinichi , Yabu Shintaro
Published: December 2018

The uses of the semiconductor increase by the development of Internet of Things. Miniaturization of the semiconductor wiring to bring speedup, electric power saving advances, and various technologies are developed. The new technology that applied a semiconductor production technology is waited eagerly for the production of the printed circuit board and semiconductor packaging. We presented new dry process “Integrated dry process” using Photodesmear technology and sputter seed process in IMAPS2016 Pasadena. After the micro via formation with the laser, the smear is effective to remove a smear remaining behind in the via bottom by Photodesmear. Furthermore, we improved adhesion between copper metal and epoxy resin in a sputtering seed together. We made the large experimental tool that Photodesmear could process an actually size of the print circuit board by static irradiation. And we proved that handling of panel size was technically possible. The connection reliability of the contact via is evaluated after electric copper plating by quick via peel examination. A cross section of the vias was made and, the residual smear removal properties of wet desmear processing and the Photodesmear processing were compared with the residual smear and the thin oxidation layer by observation of the connection interface. The interfacial surface state after the desmear processing was analyzed in X-ray probe analyzer. We produced the test vehicle using Photodesmear technology and a sputtering seed technology. I compared it with the same pattern sample produced by a process conventionally. In this paper, we report the result of the high accelerated temperature and humidity stress test.
System Co-Design Modeling Methodology of a High Speed (25Gbps) Multi-Rate 4-Channel Retimer: Simulation to Measurement Correlation
Authors: Tang Tony , Wray Bridger , Murugan Rajen
Published: December 2018

In this paper we detail the system (viz. silicon-package-pcb) electrical co-design of a 130nm BiCMOS high-speed (25Gbps) 4-channel multi-rate retimer, packaged in a small 6-mm × 6-mm FC BGA package, with integrated advanced signal conditioning circuitries. Electrical optimization of the silicon-package-pcb over the high speed channels, to achieve desired performance, was achieved through a coupled circuit-to-electromagnetic co-design modeling and simulation methodology. Key figure of merits for system electrical performance (viz. insertion loss, return loss, crosstalk/isolation, jitter, and power supply inductance and resistance parasitics, among others) are modeled and analyzed. Laboratory measurements on a retimer are presented that validate the integrity of the modeling methodology. Good correlation between modeling methodology and laboratory measurements is achieved.
A Systematic Approach to the Reliability Characterization of System in Package (SiP)
Authors: Dhandapani Karthikeyan , Roggeman Brian , Rae David
Published: December 2018

System-in-Package (SiP) solutions are gaining popularity across multiple market segments, dually reducing product design complexity for Original Equipment Manufacturers (OEMs) while increasing system performance and functionality. For SiP customers, product design complexity is reduced with the integration of electrical sub-system functionality into a module that can be designed into a product with relative ease. Further, logistical complexity is reduced, with the supplier carrying responsibility for the sub-system's quality and reliability. In addition, OEMs benefit from the performance, functionality and form factor improvements enabled by advanced SiP packaging and substrate technologies. With the increased responsibility of SiP solutions in mind, the authors addressed a systematic approach and methodology to understand the complexity of thermo-mechanical risk and challenges in SiP solutions. A modeling and characterization methodology was used to systematically identify and mitigate reliability risks for system-in-package SiP modules. Specifically, a combination of Shadow-Moire technique, digital image correlation (DIC), reliability testing and finite element (FE) models were used to demonstrate this upstream thermo-mechanical evaluation for SiP Solutions. Empirical warpage trends for the SiP module and solder joint fatigue failure trends were in close agreement with the model output based upon design and material factor inputs to the FE models.
Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175C
Authors: Geng Jie , Zhang Hongwen , Mutuku Francis , Lee Ning-Cheng
Published: December 2018

A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb, designated as Indalloy276, was developed targeting for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature range of 223 to 232°C, reflowable at profile with peak temperature 245°C and 255°C, with ambient temperature Yield Stress 60MPa, UTS 77 MPa, and ductility 28%, and a higher stress than both SAC305 and SACBSbN, the latter two alloys were used as controls. When tested at 140°C and 165°C, the die shear stress of 276 was comparable with SACBSbN but higher than SAC305, and the ductility was higher than both SACBSbN and SAC305, with SACBSbN exhibited distinct brittle behavior. When aged at 125°C and 175°C, the die shear strength of 276 was comparable or higher than both controls. When pretreated with a harsh condition, TST (−55°C/155°C) for 3000 cycles, the die shear strength of 276 was 8 times of that of SACBSbN and SAC305. When pre-conditioned at TCT (−40°C/175°C) for 3000 cycles, the die shear strength of 276 was 11 to 20 times of SACBSbN and SAC305, depending on the flux type used. Both 276 and SACBSbN are alloys based on SnAgCu, but reinforced with precipitate hardening and solution hardening, with the use of additives including Sb, Ni, and Bi. 276 exhibited a finer microstructure with less particles dispersed, while SACBSbN exhibited more particles with some blocky Ag3Sn plates or rods. 276 is rigid and ductile, while SACBSbN is rigid but brittle. Under the harsh test condition where ΔT was high, the dimension mismatch between parts and substrate became very significant due to CTE mismatch. This significant dimension mismatch would cause a brittle joint to crack quickly, as seen on SACBSbN. The challenge was more tolerable for a ductile joint, as shown by 276. Accordingly 276 showed a much better reliability than SACBSbN under harsh condition, including high testing temperature and large ΔT. Overall, to achieve high reliability under a wide service temperature environment, a balanced ductility and rigidity for solder alloy is critical for success.
Enhancements to Picosecond Acoustic Metrology for application in FO-WLP Process
Authors: Mehendale M. , Mair R. , Chen J. , Tan J. , Dai J. , Mukundhan P. , Kim C. , Kryman T.
Published: December 2018

Fan out wafer level packaging (FO-WLP) is one of the fastest growing advanced packaging segments due to its versatility for a wide variety of applications. It's compatibility with large scale, low cost, ultra-thin and high-density packages has made it very attractive. Cu redistribution layer and multiple metal under bump metallization stack play critical role in the FO-WLP process especially with shrinking line/space size and increasing density. We previously discussed the adaptation of PULSE™ technology, with the integration of a visible reflectometer and high resolution camera as a comprehensive in-line metrology tool for the advanced packaging applications. In this paper, we present results from some recent work on enhancements to the configuration for measurements of very thick, rough RDL films. The modifications provided significant improvement (9×) to throughput while maintaining gage capable repeatability. Cross-section SEM measurements on 1μm RDL structures were used to validate the extendibility of the technique.