bluuebunny/crossref_metadata_2025 huggingface dataset:
Error Analysis in Writing an English Narrative Composition
Authors: Kusumawardhani Paramita
Published: April 2016

The purpose of the research were to know the errors which have been made by the learners in their English narrative composition and it is also to know why they made the errors, to identify the errors made by the learners, to correct the errors, to improve the teaching quality which is appropriate with the curriculum and the syllabus and to get the data and the explanation about the difficulties in studying English especially in writing the English narrative composition. The method used in this research is descriptive method. Descriptive method means the method which tries to give thedata and the explanation about the recent symptoms. The data was taken from 20 students and it was taken by asking the learners to make the English narrative composition, classifying then analyzing the errors found in their composition.The errors that have been found in the compositions are 30 items or 15% for errors of selection, 25 items or 12, 5% for errors of ordering, 115 items or 57, 5% for errors of omission and 30 items or 15% for errors of addition. Some identifying, classifying, analyzing and correcting the errors have been done to correct the errors that have been found. It was done in order to minimize and avoid the same errors happen again in the learners’ English narrative composition.
Model Pembelajaran Kaiwa Tingkat Dasar sesuai dengan JF Standard
Authors: Astami Timur Sri
Published: April 2016

Speaking competence a productive skills. However, the associated with teaching materials in the books Minna no Nihongo 1 renshuu C are expected discrepancy that competence in conversations class. That is can’t be fulfilled when referring to competence in according with JF Standard. So in this qualitative research to compare between the two textbooks Minna no Nihongo 1 with Marugoto A1 katsudou. Because the basic level of speaking competence indicator is able to perform a simple conversation, slowly and repeated, replacing the phrase, giving a help, being able to ask questions about important issues, and using daily topics in the basic conversation. And that should be a concern the purpose of making the material isn’t  the same as conversation learning with sentence patterns or grammar learning basically. And than  the books Minna no  Nihongo 1 renshuu C, that’s  material noticed how communication targets to be achieved in each meeting.
A Journey of Growth of FDI (Foreign Direct Investment) in Indian Retailing
Authors: Kumar Prashant , Kavita -
Published: April 2016

Foreign Direct Investment (FDI) in retail has recently generated tremendous high spirits for a few and concern for others. It is supported that it will open floodgates for foreign retailers to speculate and can modification the retail landscape forever in India. FDI in retailing is much talked concerning subject by politician, media, trade specialist and industry experts. The Indian Retail market particularly the small Kirana store is not so well known by the actual means of FDI. The views given by politicians on the topic are terribly numerous and changes from party to party and person to person that has supplementary confusion in mind of those individuals. Retailing in Indiais the pillar of economy and accounts for about 22 percent of its GDP. The Indian retail sector is estimated to be US $500 billion and one of the top five retail markets in the world. India is the fastest growing retail markets in the world with 1.2 billion people.The Retail Business in India is presently at the point of inflection. As of 2008, speedy amendments with investments of US $ 25 billion were being planned by many Indian international firms within the next 5 years. The present study intends to explore the growth trends of FDI in Indian retail sector and also determine the SWOT (Strengths, weaknesses, opportunities and threats) analysis of Indian retail Industry.Int. J. Soc. Sci. Manage. Vol-3, issue-2: 129-134
Responses to ARUBA: a systematic review and critical analysis for the design of future arteriovenous malformation trials
Authors: Magro Elsa , Gentric Jean-Christophe , Darsaut Tim E. , Ziegler Daniela , MSI  , Bojanowski Michel W. , Raymond Jean
Published: April 2016

OBJECTIVE

The ARUBA study (A Randomized Trial of Unruptured Brain Arteriovenous Malformations [AVMs]) on unruptured brain AVMs has been the object of comments and editorials. In the present study the authors aim to systematically review critiques, discuss design issues, and propose a framework for future trials.

METHODS

The authors performed a systematic review of the French and English literature on the ARUBA study published between January 2006 and February 2015. The electronic search, including the Cochrane Library, MEDLINE (PubMed and Ovid), CINAHL, and EMBASE databases, was complemented by hand searching and cross-referencing. The comments were categorized as items related to the design, the conduct, and the analysis and interpretation of the trial.

RESULTS

Thirty-one articles or letters were identified. The pragmatic design, with heterogeneity of patients and lack of standardization of the treatment arm, were frequently stated concerns. The choice of outcome measures was repeatedly criticized. During the trial, low enrollment rates, selection bias, and premature interruption of enrollment were frequent comments. The short follow-up period, the lack of subgroup analyses, the lack of details on the results of the various treatments, and a contentious interpretation of results were noted at the analysis stage. A fundamental problem was the primary hypothesis testing conservative management. The authors believe that other trials are needed. Future trials could be pragmatic, test interventions stratified at the time of randomization, and look for long-term, hard clinical outcomes in a large number of patients.

CONCLUSIONS

In the authors' view, the ARUBA trial is a turning point in the history of brain AVM management; future trials should aim at integrating trial methodology and clinical care in the presence of uncertainty.
Antispasmodic activity of Symplocos paniculata is mediated through opening of ATP-dependent K+ channel
Authors: Janbaz Khalid Hussain , Akram Saba , Saqib Fatima , Khalid Mamoona
Published: April 2016

Symplocos paniculata is a medicinal plant used by native healers to manage gastrointestinal ailments. The crude methanolic extract of S. paniculata was screened pharmacologically both in vitro and in vivo for the validation of its therapeutic potential. It suppressed the spontaneous activity of isolated rabbit jejunum preparations and also caused inhibition of the low K+ (20 mM)- induced spastic contractions in isolated rabbit jejunum preparations in a manner comparable to cromakalim. The relaxant effect was found to be blocked following glibenclamide exposure of the isolated tissue preparations similar to cromakalim, suggesting that observed response was likely to be mediated through opening of ATP dependent K+ channels. Following oral administration to mice provided protection against castor oil-induced diarrhea in a manner similar to loperamide. The plant material was found safe in toxicity study up to oral dose of 8 g/kg in mice.  Hence, present study provides a scientific basis for the vernacular use of S. paniculata in gastro-intestinal system.

 
Artaud's Scream
Authors: Murphy Jay
Published: April 2016

In the later Artaud's perception of existence as perpetual cosmological combat, one of his principal weapons is the scream. His deployment of this scream matures in the 1946–8 radio recordings, especially in To Have Done with the Judgement of God, which he saw as a successful ‘mini-model’ of the Theatre of Cruelty. Though often viewed as an ultimate failure, Artaud's screams, allied within a range of other ecstatic practices, are far more successful than his typically psychoanalytic critics would concede. Inseparable from his projected ‘body without organs’, Artaud's scream attempts an unanswerable, unrepeatable gesture, moving beyond any engagement with an audience.
Pictorial Athleticism and Intensity inFrancis Bacon
Authors: Johnson David Benjamin
Published: April 2016

The concept of athleticism seems, at first glance, to be a minor component of Deleuze's analysis in Francis Bacon, appearing by name in the text only six times. In this article, I draw out the close link between athleticism and Deleuze's fundamental concept of intensity, arguing that this ostensibly minor term is in fact central to his account of the ‘clear and durable sensation’ produced by Bacon's painting. In tracing links between athleticism, Deleuze's aesthetic concept of ‘the fall’, and his reliance on and critique of Kant's theory of intensive magnitudes, I show that athleticism in Francis Bacon names the form of intensity proper to painting.
Les conflits de valeur dans les organisations duales au prisme des modèles identitaires
Authors: Gilson Adeline , Ndiaye Adama
Published: April 2016

Si la recherche a surtout privilégié l’analyse des caractéristiques singulières des organisations duales (Tuschman et O’Reilly, 1996), à savoir l’aptitude à intégrer simultanément les deux polarités d’une même tension, peu d’attention a été accordée aux conflits de valeur inhérents à leur fonctionnement. L’article s’interroge sur la place qu’occupent ces conflits de valeur dans les organisations duales afin de manager les paradoxes qui peuvent en résulter au prisme des modèles identitaires auxquels s’identifient les professionnels. Trois modèles sont mis en évidence : le modèle de « l’aide », focalisé sur la mission originelle, le modèle de « l’insertion/rentabilité », en conformité avec la nouvelle orientation stratégique de ces organisations et le modèle « hybride », associant les modèles précités. À partir de monographies comparées, nous mobilisons une méthodologie qualitative reposant sur une analyse multi-niveaux croisant l’individu, l’organisation et la dimension temporelle. D’une part, nous soulignons les points de convergence entre deux types d’organisations, l’entreprise sociale et solidaire et l’entreprise publique, qui sont caractéristiques de l’entreprise duale. D’autre part, nous mettons en évidence une tension patente symbolisée par un modèle hybride. Nos résultats confirment l’importance des conflits de valeur dans les organisations duales, l’existence de frontières perméables et mouvantes entre les modèles professionnels et une difficulté à trouver une consistance cognitive. Une opportunité pour les dirigeants de ces organisations de développer l’ambidextrie humaine, de redonner du sens ( sensegiving ) et de promouvoir une coopération élargie.
Comment allez-vous ? How are you doing? Как поживаешь ? extension de la validité de l’échelle positive de mesure du bien-être au travail (EPBET)
Authors: Biétry Franck , Creusier Jordane
Published: April 2016

L’objet de cet article est de tester les qualités métriques d’une échelle de mesure positive du bien-être au travail (EPBET) en dehors de son contexte national de création. Nos résultats révèlent que l’invariance structurelle est préservée quand les pays sont proches en termes de culture, de pouvoir d’achat et de stabilité des institutions politiques. Ainsi, l’EPBET mesure bien le même construit aux États-Unis et en France. En Ukraine en revanche, là où la culture nationale est plus collectiviste, le pouvoir d’achat plus limité, et les institutions politiques particulièrement instables au moment de l’enquête, une des dimensions – la relation aux temps sociaux – est plus difficile à distinguer. Cette conclusion confirme la thèse de la contingence du bien-être au travail. Une proposition d’explication de ces résultats est avancée à la lumière de la théorie de la comparaison sociale. Les résultats suggèrent également qu’au-delà d’une simple analyse confirmatoire, la vérification détaillée de l’invariance structurelle du construit constitue un préalable indispensable à toutes les études internationales consacrées au bien-être au travail.
Naissance d’une ville mondiale
Authors: Nijman Jan
Published: April 2016

Les villes mondiales sont des bases de départ dans l’organisation des marchés, des lieux de concentration du capital international et la destination de nombreux migrants. Centres de contrôle et de commandement, autour des secteurs de la finance, des transports, des services et des communications, elles accueillent les sièges internationaux de grands groupes. Pivot entre l’Amérique du Nord et l’Amérique du Sud, Miami dispose d’une économie politique stable. Comme Hong Kong, elle s’est développée avec l’arrivée des migrants et des capitaux étrangers, qui ont conduit à une identité hybride, un « capitalisme transculturel ». Comme Dublin, Miami a fondé sa croissance sur l’investissement étranger mais sans le même degré d’intervention publique. Connectée aux courants d’affaires mondiaux, y compris dans les industries culturelles, Miami reste atypique dans la mesure où ses fonctions de ville mondiale demeurent peu enracinées dans la région.
CONWIP versus POLCA: A comparative analysis in a high-mix, low-volume (HMLV) manufacturing environment
Authors: Frazee Todd , Standridge Charles
Published: April 2016

Purpose: Few studies comparing manufacturing control systems as they relate to high-mix, low-volume applications have been reported. This paper compares two strategies, constant work in process (CONWIP) and Paired-cell Overlapping Loops of Cards with Authorization (POLCA), for controlling work in process (WIP) in such a manufacturing environment. Characteristics of each control method are explained in regards to lead time impact and thus, why one may be advantageous over the other.Design/methodology/approach: An industrial system in the Photonics industry is studied. Discrete event simulation is used as the primary tool to compare performance of CONWIP and POLCA controls for the same WIP level with respect to lead time. Model verification and validation are accomplished by comparing historic data to simulation generated data including utilizations. Both deterministic and Poisson distributed order arrivals are considered. Findings: For the system considered in this case study, including order arrival patterns, a POLCA control can outperform a CONWIP parameter in terms of average lead time for a given level of WIP. At higher levels of WIP, the performance of POLCA and CONWIP is equivalent. Practical Implications: The POLCA control helps limit WIP in specific áreas of the system where the CONWIP control only limits the overall WIP in the system. Thus, POLCA can generate acceptably low lead times at lower levels of WIP for conditions equivalent to the HMLV manufacturing systems studied.Originality/value: The study compliments and extends previous studies of  CONWIP and POLCA performance to a HMLV manufacturing environment. It demonstrates the utility of discrete event simulation in that regard. It shows that proper inventory controls in bottleneck áreas of a system can reduce average lead time.
Optimization of a truck-drone in tandem delivery network using k-means and genetic algorithm
Authors: Mourelo Ferrandez Sergio , Harbison Timothy , Weber Troy , Sturges Robert , Rich Robert
Published: April 2016

Purpose: The purpose of this paper is to investigate the effectiveness of implementing unmanned aerial delivery vehicles in delivery networks. We investigate the notion of the reduced overall delivery time, energy, and costs for a truck-drone network by comparing the in-tandem system with a stand-alone delivery effort. The objectives are (1) to investigate the time, energy, and costs associated to a truck-drone delivery network compared to standalone truck or drone, (2) to propose an optimization algorithm that determines the optimal number of launch sites and locations given delivery requirements, and drones per truck, (3) to develop mathematical formulations for closed form estimations for the optimal number of launch locations, optimal total time, as well as the associated cost for the system.Design/methodology/approach: The design of the algorithm herein computes the minimal time of delivery utilizing K-means clustering to find launch locations, as well as a genetic algorithm to solve the truck route as a traveling salesmen problem (TSP). The optimal solution is determined by finding the minimum cost associated to the parabolic convex cost function. The optimal min-cost is determined by finding the most efficient launch locations using K-means algorithms to determine launch locations and a genetic algorithm to determine truck route between those launch locations.  Findings: Results show improvements with in-tandem delivery efforts as opposed to standalone systems. Further, multiple drones per truck are more optimal and contribute to savings in both energy and time. For this, we sampled various initialization variables to derive closed form mathematical solutions for the problem. Originality/value: Ultimately, this provides the necessary analysis of an integrated truck-drone delivery system which could be implemented by a company in order to maximize deliveries while minimizing time and energy. Closed-form mathematical solutions can be used as close estimators for final costs and time.
Performance Analysis of Pose Invariant Face Recognition Approaches in Unconstrained Environments
Authors: Beham M. Parisa , Roomi S. M. Mansoor , Alageshan J. , Kapileshwaran V.
Published: April 2016

Face recognition and authentication are two significant and dynamic research issues in computer vision applications. There are many factors that should be accounted for face recognition; among them pose variation is a major challenge which severely influence in the performance of face recognition. In order to improve the performance, several research methods have been developed to perform the face recognition process with pose invariant conditions in constrained and unconstrained environments. In this paper, the authors analyzed the performance of a popular texture descriptors viz., Local Binary Pattern, Local Derivative Pattern and Histograms of Oriented Gradients for pose invariant problem. State of the art preprocessing techniques such as Discrete Cosine Transform, Difference of Gaussian, Multi Scale Retinex and Gradient face have also been applied before feature extraction. In the recognition phase K- nearest neighbor classifier is used to accomplish the classification task. To evaluate the efficiency of pose invariant face recognition algorithm three publicly available databases viz. UMIST, ORL and LFW datasets have been used. The above said databases have very wide pose variations and it is proved that the state of the art method is efficient only in constrained situations.
Failure Detector of Perfect P Class for Synchronous Hierarchical Distributed Systems
Authors: Verma Anshul , Pattanaik K. K.
Published: April 2016

Present failure detection algorithms for distributed systems are designed to work in asynchronous or partially synchronous environment on mesh connected systems and maintain status of every other process. Several real time systems are not mesh connected and require working in strict synchronous environment. Use of current failure detection mechanisms in such systems would generate excess computation and communication overhead. This paper proposes a new failure detector of Perfect P class for real time hierarchical distributed systems working in synchronous environments. Strong completenessand strong accuracy properties of the new failure detector is evaluated.
Quality Credit Supervision Research Based on Minimum Dataset
Authors: Qian Qianyanhui , Liu Wenqi
Published: April 2016

As a social management and public service sector, it is convenient for the government to collect and use data, and hence business data become the origin of the big data of government. In order to improve the scientific level of government supervision and management, it is necessary to strengthen the scientific arrangement by using the existing service data. This paper takes a successful example of implementation of e-government, which is “basic quality and technical supervision and management information system” using by bureau of quality and technical supervision in Kunming. After obtaining the quality information from the original public database, this paper used the thinking model which combining the quality credit information and the minimum dataset, then choosing candidate factors with importance rating from minimum dataset by using R language and random forest algorithm. At last, forming and analyzing the minimum dataset of enterprise quality credit supervision through logical argument.
Dempster Shafer Structure-Fuzzy Number Based Uncertainty Modeling in Human Health Risk Assessment
Authors: Dutta Palash
Published: April 2016

In risk assessment, generally model parameters are affected by uncertainty arises due to vagueness, imprecision, lack of data, small sample sizes etc. Fuzzy set theory and Dempster-Shafer theory (In short DST) of evidence should be explored to handle this type of uncertainty. Representation of parameters of risk assessment models may be Dempster-Shafer structure (in short DSS) and fuzzy numbers. To deal with such situations, it is important to device new techniques. This paper presents two algorithms to combine Dempster-Shafer structure with generalized/normal fuzzy focal elements, generalized/normal fuzzy numbers within the same framework. Sampling technique for evidence theory and alpha-cut for fuzzy numbers are considered to execute the algorithms. Finally, results are obtained in the form of fuzzy numbers (normal/generalized) at different fractiles.
Making Space to Engage
Authors: Güldenpfennig Florian , Nunes Francisco , Ganglbauer Eva , Fitzpatrick Geraldine
Published: April 2016

Designing for older adults can be complex. Often, designers struggle to understand people who share a very different life context. At the same time, older adults can have difficulties imagining future technologies for themselves. This creates challenges for design processes bounded by time and outcome expectations. In this paper, the authors explore a long-term, loosely structured and open-ended research process where they provided participants with prototypes to use for as long as they wanted, and only as they wanted to. By working with their own relatives and friends and moving away from structured procedures and external agendas, the authors made space for both participants and designers for deep engagements with the artifacts and process. Participants were able to better understand technology and shape it to their needs. Researchers were better able to understand and iterate on the technology designs. The authors' findings suggest that this approach might be especially appropriate for designing for and with older adults.
Modeling and Evaluating Tutors' Function using Data Mining and Fuzzy Logic Techniques
Authors: Bendjebar Safia , Lafifi Yacine , Seridi Hamid
Published: April 2016

In e-learning systems, the tutors play many roles and carry out several tasks that differ from one system to another. The activity of tutoring is influenced by many factors. One factor among them is the assignment of the appropriate profile to the tutor. For this reason, the authors propose a new approach for modeling and evaluating the function of the tutors. This technique facilitates the classification among tutors for adapting tutoring to student's problems. The component of the proposed tutor model is a set of profiles which are responsible for representing the necessary information about each tutor. A fuzzy logic technique is used in order to define tutor's tutoring profile. Furthermore, the K nearest neighbor algorithm is used to offer much information for each new tutor based on the models of other similar tutors. This new approach has been tested by tutors from an Algerian University. The first results were very encouraging and sufficient. They indicate that the use of fuzzy logic technique is very useful and estimate the adaptation of the tutoring process according to tutors' skills.
Testing in-package DRAMs and DFX features in 3D high-bandwidth memory
Authors: Nelson Chris
Published: April 2016

A major form of 3D integration is incorporating memory die in the package along with the processor die. Higher-end applications incorporate DRAMs within the package in 3D or 2.5D configurations, to provide extremely high bandwidth and relatively large capacity. The added component cost and assembly and test process cost demand step-function yield improvement. This talk will focus on recent developments in DRAM System-In-Package (SiP) integration, outlining assembly process induced failure modes and risk mitigations. These DRAM products, including “High-Bandwidth Memories” (HBM) in “known good stacked die package form,” must be economically testable and efficiently debuggable, yet the interface between the SOC die and the DRAM is usually a buried interface. Testability and alignment with the back-end assembly and test processes are crucial planning activities for such products.
Cost Breakdown of 2.5D and 3D Packaging
Authors: Palesko Chet , Palesko Amy
Published: April 2016

2.5D and 3D packaging can provide significant size and performance advantages over other packaging technologies. However, these advantages usually come at a high price. Since 2.5D and 3D packaging costs are significant, today they are only used if no other option can meet the product requirements, and most of these applications are relatively low volume. Products such as high end FPGAs, high performance GPUs, and high bandwidth memory are great applications but none have volume requirements close to mobile phones or tablets. Without the benefit of volume production, the cost of 2.5D and 3D packaging could stay high for a long time.

In this paper, we will provide cost model results of a complete 2.5D and 3D manufacturing process. Each manufacturing activity will be included and the key cost drivers will be analyzed regarding future cost reductions. Expensive activities that are well down the learning curve (RDL creation, CMP, etc.) will probably not change much in the future. However, expensive activities that are new to this process (DRIE, temporary bond/debond, etc.) provide good opportunities for cost reduction. A variety of scenarios will be included to understand how design characteristics impact the cost. Understanding how and why the dominant cost components will change over time is critical to accurately predicting the future cost of 2.5D and 3D packaging.
Embedded RDL Enabled by Excimer Laser Ablation
Authors: Hichri Habib
Published: April 2016

The continuous trend of the miniaturization, increasing performance and mobility of electronic devices drive the requirements of the chip itself but also its package type. The current integration process based on photolithography will be reaching the limit to develop cost effective and innovative package designs that meet the market requirements. In support of this technology trend and to address the industry problems Excimer laser ablation has been adopted in the semiconductor packaging industry and is now available as disruptive patterning technology. The complementary technology offers the promise of further reductions in manufacturing costs as well as enhancements in chip or package performance. Excimer laser ablation is a direct etching process that uses the advantage of the Excimer laser source to emit high energy pulses at short wavelengths. The combination of the Excimer laser source and dedicated projection optics ensures the capability of high resolution imaging. With this type of patterning technology the industry gets access to materials that do not require photo patterning. The paper proposes a new process based on the front end of line dual damascene integration flow for building multilayer RDL for Advanced Packaging using Excimer laser ablation. The new process uses Excimer laser ablation as the critical method to integrate via and RDL traces in one patterning process step, followed by seed layer deposition, plating and standard planarization processes. In this presentation, we will explain in detail the new proposed integration flow and further demonstrate its technical robustness for the chip interconnect combined with its commercial benefits to users. We will also cover the capability of this Excimer laser process to extend the material selection to non-photo materials.
Process and Evaluation of High Reliability Reworkable Edge Bond Adhesives for Large Area BGA Applications
Authors: Bhattacharya Swapan , Xie Fei , Baldwin Daniel F. , Wu Han , Hodge Kelley , Ji Qing
Published: April 2016

Reworkable underfills and edge bond adhesives are finding increasing utility in high reliability and harsh environment applications. The ASICs and FPGAs often used in these systems typically require designs incorporating large BGAs and ceramic BGAs. For these high reliability and harsh environment applications, these packages typically require underfill or edge bond materials to achieve the needed thermal cycle, mechanical shock and vibration reliability. Moreover, these applications often incorporate high dollar value printed circuit boards (on the order of thousands or tens of thousands of dollars per PCB) hence the need to rework these assemblies and maintain the integrity of the PCB and high dollar value BGAs. This further complicates the underfill requirements with a reworkability component. Reworkable underfills introduce a number of process issues that can result in significant variability in reliability performance. In contrast, edge bond adhesives provide a high reliability solution with substantial benefits over underfills. One interesting question for the large area BGA applications of reworkable underfills and edge bond materials is the comparison of their reliability performance. This paper presents a study of reliability comparison between two robust selected reworkable underfill and edge bond adhesive in a test vehicle including 11mm, 13mm, and 27mm large area BGAs. Process development for those large area BGA applications was also conducted on the underfill process and edge bond process to determine optimum process conditions. For underfill processing, establishing an underfill process that minimizing/eliminates underfill voids is critical. For edge bond processing, establishing an edge bond that maximizes bond area without encapsulating the solder balls is key to achieving high reliability. In addition, this paper also presents a study of new high performance reworkable edge bond materials designed to improve the reliability of large area BGAs and ceramic BGAs assemblies while maintaining good reworkablity. Four edge bond materials (commercially available) were studied and compared for a test vehicles with 12mm BGAs. The reliability testing protocol included board level thermal cycling (−40 to 125°C), mechanical drop testing (2900 G), and random vibration testing (3 G, 10 – 1000 Hz).
Laser-based Package Singulation and Trenching for SiP
Authors: Mueller Dirk , Clark David , VanNunen Joris , Rea Ed , Haloui Hatim
Published: April 2016

Pulsed lasers are solving some packaging challenges for SiP applications. SiP devices designed for mobile devices with communication capability often have a need for EMI shielding. Nanosecond UV and picosecond green lasers are finding use in cutting these multi-compound packages as well as trench for exposing board contacts used for grounding. Mechanical cutting may not be an option if the perimeter of the package is not a simple rectangle. Water jet cutting may bear the risk of the package to fail to to water seeping in between the package layers during cutting. We will demonstrate how laser-based SiP package cutting and trenching can ameliorate both of those concerns and point toward limitations of laser-based processes.

Today's high power nanosecond UV lasers are capable of cutting 1mm thick packages at an effective cutting speed of more than 10mm/s. The resulting cut surface shows no charring or melting. The surface roughness allows for excellent adhesion of EMI shielding paint on the cut conformal compound. Since the laser beam can be controlled with a programmable scanner, arbitrary shapes can be cut just as easily as simple rectangles.

Difference ablation rates between polymer and copper allow the laser to trench the conformal coating and stop automatically when a metal layer is exposed. This self-terminating process leads to a precise exposure even when the conformal coating thickness differs from part to part.

For the utmost in surface quality picosecond lasers can be employed. Their shorter pulse duration allows for an even lower surface roughness and less thermal impact on the package. Using an ultrafast laser, such as a 10ps laser, has the additional advantage that the process scales in speed with increased laser power.

The excellent edge quality and possibility to cut random shapes allow laser-based processes to complement mechanical processes in high-end applications. We will present a full cost of ownership model that allows the designer to predict the exact singulation and trenching cost for a given package size.
High Speed Electroplating of 200um High Cu Bumps for Die Stacking Architectures
Authors: Hollman Richard
Published: April 2016

Recent advanced packaging architectures pose a number of challenges for metal deposition by electroplating, including shrinking RDL and pillar interconnects, via fills, and interconnect lines over topography. However, there is a class of die stacking designs which incorporate extremely tall Cu pillars, or
Current status and future prospects of panel level packaging
Authors: Kumar Santosh , Pizzagalli Amandine , Towne Dave , Buisson Thibault , Ivankovic Andrej , Beica Rozalia
Published: April 2016

Demand of lower cost with higher performances has driven the semiconductor industry to develop innovative solutions. One of the new approaches to reduce the overall cost is to switch from wafer to larger size panel format. The panel infrastructure has gained considerable interest from the semiconductor industry and is certainly a promising market due to its cost advantages and economy of scale benefits. Panel level manufacturing has the potential to leverage the knowledge and infrastructure of wafer level packaging as well as PCB / flat panel display / photovoltaic industries. We have identified six key packaging platforms which can be processed on larger surface (rectangular/square) such as FOWLP panel, organic interposer, glass panel interposer, hybrid interposer, embedded die as well as coreless substrate. Over the past years, it's become clear that some panel packages choices will be more suitable than others for successful commercial development. The equipment infrastructure within the advanced packaging supply chain today is mainly based on processing 300mm round wafers. However, to process larger surface, new equipment and optimized materials are required. The key question raised is when the panel industry will take off and how will it evolve? Are the supply chains ready to move to the panel scale manufacturing? What are the challenges / issues involved for the panel adoption to high volume manufacturing? This paper will try to answer these questions and discuss about the current status and future prospects of panel level packaging.
A study on warpage behavior of EMC in post-mold cure stage using Moldex3D
Authors: Chih-Chung Hsu , Vallury Srikar , Vallury Srikar , Lin Kai , Yang Anthony
Published: April 2016

Warpage and residual stress are the two most important factors affecting product yield rate and reliability in IC encapsulation process. This study presents the prediction of warpage in post-mold cure stage using a three-dimensional finite element approach coupled with linear viscoelastic material property. Furthermore, cure-induced volumetric shrinkage and thermal expansion mismatch are considered. The shrinkage of the EMC is described by Pressure-Volume-Temperature-Cure (PVTC) model, and Generalized Maxwell model; WLF relation is adopted to describe the viscoelastic behavior of EMC.

In order to obtain accurate numerical results, Cure-Time-Temperature superposition is considered. For verifying the numerical predictions of three dimensional simulations, the calculated results are compared with the available experimental data from literature.
A MEMS PPA Based Active Vibration Isolator - STUDENT AWARD 3RD PLACE $500
Authors: Li Chong , Elana C. Lavinia , Dean Robert N. , Flowers George T.
Published: April 2016

Several types of micro-devices are adversely affected by high frequency mechanical vibrations present in the operating environment. Examples include MEMS vibratory gyroscopes and resonators, and micro-optics. Various types of MEMS vibration isolators have been developed for use in the packaging of these vibration sensitive devices. Passive isolators consist of a spring-mass-damper MEMS device and usually have a very high mechanical quality factor, which makes them susceptible to ringing at the isolator's resonant frequency. Active isolators have been realized by using state sensing of the proof mass motion and feeding one or more of these states back through an actuator to adjust the frequency response of the isolator. For example, the technique known as skyhook damping uses velocity feedback to adjust, and typically increase, the damping of the isolator. Although these technique are doable, they require state sensing or state estimation, with feedback electronics to drive the actuator.

A simpler MEMS active vibration isolator architecture employs only a parallel plate actuator (PPA) with the MEMS spring-mass-damper structure. The PPA driven with a DC voltage, in its stable operating range, displaces the proof mass, which results in a change in the effective system spring constant due to the electrostatic spring softening effect. This results in a change in the resonant frequency and the quality factor of the isolator. However, due to the nonlinearities inherent in this type of device, the stable operating range is reduced as the PPA voltage is increased. Furthermore, even when the isolator is stable in steady-state, a sufficiently large transient response can also drive it into the unstable regime, resulting in the electrodes snapping into contact.

In this study, the PPA based active vibrator isolator is developed and its performance is evaluated. The characteristics of the transient instability are investigated and its stable range of operation is specified, for booth external disturbances and rapid application of the control voltage. This MEMS PPA based active vibration isolator can improve performance compared to passive isolators, while being much simpler than state feedback active isolators.
Emerging Flux Challenges for BGA Packages
Authors: Durham Maria , Mackie Andy , Chou Jason
Published: April 2016

The formation of a Ball Grid Array (BGA) solder joint is critical for a BGA package where typically a flux deposition process is used. Reflowing solder spheres to solderable pads on the bottom of substrates in standard BGA, FCBGA, CSP, and similar packages is considered to be a trivial step: a specialized BGA flux is usually pin-transferred onto the pads, followed by balldrop onto the substrate. However, with the increasing complexity and number of assembly processes taken prior to this final step, the formation of a reliable final joint is far from certain. In order to eliminate variability, many OSATs and ODMs use the so-called “two step” (double fluxing) approach, which is comprised of the non-value-added extra processes of prefluxing, reflowing, cleaning, and drying substrates immediately prior to the final flux-based ball-attach process.

This paper details the sequence of processes seen in typical FCBGA assembly, and examines the effects of each set of prior processes on the solderability of the final pad. The introduction of a “one-step” pin-transfer ball-attach flux is shown to be a means of reducing both process cost and time, and also reducing the risk of increased warpage in the finished package.

The paper also investigates the solderable surface and metallurgy of the substrate pad. The variety of new and emerging failure modes for the BGA process as well as the different testing methods for the materials will also be discussed.
Nonlinear dynamics induced anomalous Hall effect in topological insulators
Authors: Wang Guanglei , Xu Hongya , Lai Ying-Cheng
Published: April 2016

We uncover an alternative mechanism for anomalous Hall effect. In particular, we investigate the magnetisation dynamics of an insulating ferromagnet (FM) deposited on the surface of a three-dimensional topological insulator (TI), subject to an external voltage. The spin-polarised current on the TI surface induces a spin-transfer torque on the magnetisation of the top FM while its dynamics can change the transmission probability of the surface electrons through the exchange coupling and hence the current. We find a host of nonlinear dynamical behaviors including multistability, chaos, and phase synchronisation. Strikingly, a dynamics mediated Hall-like current can arise, which exhibits a nontrivial dependence on the channel conductance. We develop a physical understanding of the mechanism that leads to the anomalous Hall effect. The nonlinear dynamical origin of the effect stipulates that a rich variety of final states exist, implying that the associated Hall current can be controlled to yield desirable behaviors. The phenomenon can find applications in Dirac-material based spintronics.
A Matched Filter Developed for Chaotic Waveforms
Authors: Werner Frank T. , Rhea Benjamin K. , Beal Aubrey N. , Abell William E. , Bailey John P. , Harrison Remington C. , Dean Robert N. , Hamilton Michael C.
Published: April 2016

A matched filter developed for use in chaos-based communications systems is presented. A matched filter is the optimum filter for maximizing the signal-to-noise ratio of a received signal in the presence of additive Gaussian white noise (AGWN). Chaos-based communications systems encode information into a chaotic waveform using arbitrary small perturbations to control the trajectory of the chaotic oscillator. Chaotic waveforms are deterministic, are sensitive to initial conditions, have aperiodic long-term behavior, have a spread frequency spectrum, and are theoretically immune to interference. There has been great interest in using chaotic waveforms in communication applications. One reason for this interest is that the spread spectrum of a chaotic waveform gives the appearance of noise when observed over a prolonged period of time. This masks the waveform from anyone without prior knowledge of its presence. Another reason is that to retrieve the information encoded in the chaotic waveform, complete knowledge of the waveform must be known. This makes it difficult for anyone other than the intended recipient to decrypt the information.

Normally, implementing a matched filter for a chaotic waveform is difficult because such waveforms do not have a fixed basis function and have irregular timing. However, a unique chaotic oscillator has been developed that can be represented as an exact analytic solution. The waveform's solution can be written as a convolution of a symbol sequence and a fixed basis function. This fixed basis function makes it possible to derive a delay differential equation describing the matched filter.

In order to test the matched filter, an amplitude modulated communications system was developed. In the system, the oscillator's output is first amplitude modulated with 2.3GHz carrier before being transmitted. The receiver then demodulates the signal and applies it to the matched filter. Any encoded information can then be extracted from the output of the matched filter. The oscillator and matched filter were designed to operate at 1.8MHz. In both simulation and testing, the matched filter was able to detect the chaotic waveform in the presence of AWGN.
Si Photonics Deployment Using Cu Pillar Interconnect and Chip On Wafer Platform
Authors: Jimarez Miguel
Published: April 2016

We introduce a high-speed 4x25Gbps, MSA-compliant, QSFP transceiver built on a Silicon Photonics platform. The transceiver integrates high sensitivity receivers, CTLE, clock recovery, modulator drivers and BIST on a TSMC 28nm die connected to the photonic die thru a fine pitch (50um) Copper Pillar interface. A wafer-scale approach, Chip on Wafer, CoW, is used to assemble the electronic die and the light source on to the photonic die, so that the full optical path can be tested, at speed, in loopback configuration in wafer form, using a standard ATE solution. This presentation focuses on the CoW assembly development aspects of the transceiver. Wafer probe and bump, die processing services, CoW assembly and Back End of Line, BEOL, Test Services will be presented.
Innovated L/S less than 2/2μm Line Embedded 2.1D Organic Substrate Technology
Authors: Chen Yu-Hua
Published: April 2016

Current organic substrates are limited to lines/space of 10/10um and via size around 50um. However, the semiconductor with advance node needs fine line/space of 5/5 or 3/3 and even 2/2μm in the future. Si Interposer provides a high density interconnection with fine line and small via that cannot be matched by current laminate substrate technology. But the challenge of Si interposer is the high cost. We have developed an ultra-thin line embedded substrate for 2.1D/2.5D SiP application.

There are two types of approach to meet the requirement of line/space less than 2/2μm in the organic substrate. One is the conventional Semi-Additive Process (SAP) and another is laser embedded technology. The advantage of SAP is the good compatibility with current process but the problem is yield and reliability issue for narrow copper trace on the dielectric surface. From the current status, line/space of 5/5μm will be the process limitation of SAP and 2/2μm need to be further verified for HVM.

Another solution is line embedded (LE) technology with the different structure. LE technology is different from SAP includes ablation of trench by laser and panel plating with electroplating copper and then removing copper above dielectric surface for formation of Cu pattern. There are several advantages of laser embedded comparing to SAP. First, the laser embedded substrate provides a flat surface after formation of pattern which is helpful for covering a thinner solder mask with better uniformity of thickness. It can avoid the voids formation while filling molding compound. Second, the laser embedded substrate not only allows the design of pad-less via to reduce both package size and format but also can put more traces near these vias.

In this study, several key technologies of laser embedded are successfully integrated in the current substrate process. By the selection of the advanced dielectric film with a suitable design as a test vehicle to verify the feasibility of laser embedded technology with line/space of 5/5μm and 3/3μm design. However, the excimer laser ablated the pattern step-by-step and the throughput was much lower than lithography by exposure. The technology trend shows that the use of non-filler photo-sensitive dielectric (PID) by exposure/development to form trenches of signal paths is a good solution to increase throughput. L/S less than 2/2μm line embedded 2.1D organic substrate achievement by adopting innovated integration PID process will be further discussed.