bluuebunny/crossref_metadata_2025 huggingface dataset:
Digital Gender Gaps in Students’ Knowledge, Attitudes and Skills: An Integrative Data Analysis Across 32 Countries
Authors: Campos Diego , Scherer Ronny
Published: October 2022

The digital gender divide is one of the most critical issues in education today. Digital gender gaps can exist in students’ access to and use of ICT, attitudes toward technology, and digital knowledge and skills. However, previous research has primarily examined these divides in isolation and largely ignored their interdependencies. Using student data from the 2013 and 2018 International Computer and Information Literacy Study (ICILS), this study examines how these gaps are related. Specifically, we synthesize evidence on gender gaps in digital knowledge and skills, controlling for differences in ICT access and technology attitudes. In addition, we examine the role that technology attitudes play in the gender gap in digital knowledge and skills. Our findings suggest that (a) girls outperform boys in digital knowledge and skills (β = -0.11 to -0.29); (b) gender differences in attitudes toward technology partially explain gender differences in digital knowledge and skills; (c) the variability within and between countries in the gender gap in students' digital skills is partly explained by the type of digital skill and the country's socio-economic development and gender inequality. Overall, this research shows a relationship between the gender gaps in students’ digital knowledge and skills and the gender gaps in students’ attitudes toward technology. We conclude that the first- and second-level gender digital divides are connected.
The Costs and Environmental Justice Concerns of NIMBY in Solid Waste Disposal
Authors: Ho Phuong
Published: October 2022

Many recent US Congresses have proposed bills that allow state and local governments to restrict interjurisdictional waste shipments. Using data on intercounty waste flows in California and a random utility model of haulers' decisions about where to deposit waste from each county, this paper studies the economic costs of import bans and import taxes and the implications on the distribution of waste disposal by race (and ethnicity). I find NIMBY-motivated laws would reduce intercounty waste transport at substantial economic costs. Furthermore, a NIMBY law enacted in a county, despite reducing the county's imports, could increase total intercounty waste in the whole state, generating additional external costs of transportation. A universal import ban in all counties would reduce transboundary waste but it would lead to substitution of waste away from facilities near white residents and toward facilities near Hispanic residents, exacerbating distributional concerns.
STUDI LITERATUR :PENGARUH STIMULASI IBU TERHADAP PERKEMBANGAN MOTORIK KASAR BAYI UMUR 1-3 TAHUN
Authors: Mulyaningsih Sri , Djunaid Ulfiana
Published: October 2022

ABSTRACTMonitoring the development of infants is an important phase, because it determines the quality of health, well-being, learning and behavior in the future. This research aims to determine the effect of maternal stimulation on gross motoric development of infants aged 1-3 years. The research is literature study. The data used in this research are studies published in national and international online journals, search for research articles using Google Schoolar, Garuda Portal and PubMed with keywords, mother stimulation, baby gross motor skills, Mother’s Stimulation, Infant Motoric Development and obtained 981 articles then tested the feasibility and the remaining 6 full text articles were eligible and met the inclusion criteria. The results showed that of the six articles reviewed, it was stated that there was an effect of maternal stimulation on gross motor development of infants aged 1-3 years.ABSTRAKPemantauan tumbuh kembang balita merupakan fase yang penting, karena menentukan kualitas kesehatan, kesejahteraan, pembelajaran dan perilaku di masa mendatang. Penelitian ini bertujuan untuk mengetahui Pengaruh Stimulasi Ibu Terhadap Perkembangan Motorik Kasar Bayi Umur 1-3 Tahun. Jenis penelitian ini merupakan penelitian dengan menggunakan metode studi kepustakaan atau literatur review. Data yang digunakan dalam penelitian ini berasal dari hasil penelitian yang sudah dilakukan dan diterbitkan dalam jurnal online nasional dan internasional. pencarian jurnal penelitian yang dipublikasikan di internet menggunakan Google Schoolar, Portal Garuda dan PubMed dengan kata kunci, stimulasi ibu, motorik kasar bayi, Mother's Stimulation, Infant Motoric Development. diperoleh jurnal berjumlah 981 jurnal kemudian di uji kelayakan dan full teks tersisa 6 jurnal yang layak dan memenuhi kriteria inklusi.Hasil penelitian yang didapatkan bahwa dari keenam jurnal yang direview menyatakan bahwa terdapat Pengaruh Stimulasi Ibu Terhadap Perkembangan Motorik Kasar Bayi Umur 1-3 Tahun.
HUBUNGAN TINGKAT KECEMASAN DENGAN KEJADIAN PRAMENSTRUASI SINDROM PADA REMAJA PUTRI KELAS XI DI SMA NEGERI I DUNGALIYO
Authors: Zakaria Fatmah , Ali Rizky Nikmathul Husna , Hilamuhu Fendrawti
Published: October 2022

This research was conducted at SMA Negeri 1 Dungaliyo. objective of this research was to determine the relationship between the anxiety level with premenstrual syndrome in teenagers at SMA 1 Dungaliyo. The design used cross-sectional study was the total of 120 female students in grade XI of SMA 1 Dungaliyo, a sample of 92 female students used purposive sampling technique, data collected used a questionnaire with the analysis of Kendall Tau research. From the results of data analysis used correlation number of the Kendall Tau 0.478 with a significance of 0,000 (p value = 0,000 <0,05) then H0 is rejected and Ha is accepted. Thus it can be concluded that there is a significant relationship between the Anxiety Level and the Syndrome Premenstrual Event in SMA 1 Dungaliyo.Penelitian ini dilakukan di SMA Negeri 1 Dungaliyo. Tujuan penelitian ini untuk mengetahui Hubungan Tingkat Kecemasan dengan Kejadian Pramenstruasi Syndrom pada Remaja Putri SMA Negeri 1 Dungaliyo. Jenis penelitian cross sectional populasi seluruh siswi kelas XI SMA Negeri 1 Dungaliyo yang berjumlah 120 siswi, sampel sebanyak 92 siswi dengan menggunakan tehnik purposive sampling, data yang dikumpulkan menggunakan kuesioner dengan analisis penelitian Kendall Tau. Dari hasil analisa data yang menggunakan angka korelasi Kendall Tau sebesar 0,478 dengan signifikansi sebesar 0,000 (pvallue = 0,000 < 0,05) maka H0 ditolak dan Ha diterima. Dengan demikian dapat disimpulkan bahwa terdapat hubungan yang signifikan antara Tingkat Kecemasan dengan Kejadian Pramenstruasi Syndrom pada Remaja Putri SMA Negeri 1 Dungaliyo.
Praktek Personal Hygiene Menstruasi (Studi Kasus Santri Pesantren Al-Islam Gorontalo)
Authors: Boekoeose Lintje , Amalia Lia , Paris Rifka Reflinawati Hamzah , Mokodompis Yasir
Published: October 2022

One of the risk factors for the reproductive tract is poor menstrual hygiene. Where hygiene during menstruation such as changing sanitary napkins and cleaning the feminine area after urinating is often neglected by teenagers. Personal hygiene during menstruation is personal hygiene in an effort to maintain, maintain and improve hygiene and health for physical and psychological well-being through the implementation of hygiene measures performed during menstruation. The purpose of the study was to determine the factors that influence the practice of personal hygiene in female students. The study used an analytical survey method with a cross sectional study design. The population is all students of class VII and VIII as many as 160 people with the determination of the sample using purposive sampling technique obtained 115 respondents. Data analysis using Chi-Square test. The results of the Chi-Square test are the level of knowledge, p-value = 0.005 <0.05, attitude of young women p-value = 0.017 <0.05, source of information p-value = 0.024 <0.05, family support p-value = 0.029 < 0.05. So that these four factors indicate that there is an influence on the practice of menstrual personal hygiene at the Al-Islam Islamic Boarding School, Gorontalo Regency. Suggestions or recommendations for schools to add lessons and curriculum as well as counseling for students about personal hygiene during menstruation.Salah satu faktor risiko saluran reproduksi ialah hygiene menstruasi yang buruk. Dimana kebersihan saat menstruasi seperti mengganti pembalut dan membersihkan daerah kewanitaan setelah buang air kecil sering sekali diabaikan oleh remaja. Personal hygiene selama menstruasi adalah kebersihan perorangan dalam usaha memelihara, mempertahankan serta memperbaiki kebersihan dan kesehatan untuk kesejahteraan fisik maupun psikologis melalui implementasi tindakan hygiene yang dilakukan saat menstruasi. Tujuan penelitian untuk mengetahui faktor yang mempengaruhi praktek personal hygiene pada santriwati. Penelitian menggunakan metode survey analitik dengan rancangan cross sectional study. Populasi adalah seluruh santriwati kelas VII dan VIII sebanyak 160 orang dengan penentuan sampel menggunakan teknik purposive sampling didapatkan 115 responden. Analisis data menggunakan uji Chi-Square. Hasil Uji Chi-Square yaitu tingkat pengetahuan p-value = 0,005 < 0,05, sikap remaja putri p-value = 0,017 < 0,05, sumber informasi p-value = 0,024 < 0,05, dukungan keluarga p-value = 0,029 < 0,05. Sehingga empat faktor tersebut menunjukkan terdapat pengaruh terhadap praktek personal hygiene menstruasi di Pesantren Al-Islam Kabupaten Gorontalo. Saran atau rekomendasi bagi sekolah agar menambahkan pelajaran dan kurikulum serta penyuluhan bagi siswi tentang personal hygiene saat menstruasi.
Pemberdayaan Sosial Melalui Inovasi Produk UMKM Keripik Tempe Studi Kasus di Desa Permanu
Authors: Boboy Ivana Tri Mulyani , Priyandoko Gigih , Mustikawaty Octaviani , Raharja Ghaniy , Fauzi Muchamad Lukman , Rofiqoh Laily Ainur
Published: October 2022

Eksistensi olahan tempe masih menjadi favorit masyarakat sekitar. Khususnya untuk daerah Kota Malang sendiri menjadi salah satu sentra produksi olahan tempe salah satunya olahan tempe menjadi keripik. Banyak pelaku Usaha mikro kecil dan menengah khususnya pengusaha olahan keripik tempe mengalami berbagai masalah yaitu lemahnya akses terhadap permodalan, literasi digital masih lemah apalagi selama masa pandemi Covid-19 mengakibatkan kontraksi di sektor perekonomian sehingga mengalami daya saing UMKM. Pengabdian ini dilakukan di UMKM Keripik Tempe Sagu Surya Jaya ibu Windi, sebagai salah satu UMKM yang memproduksi keripik tempe di wilayah Desa Permanu, Kecamatan Pakisaji, Kabupaten Malang. Keripik tempe hasil produksi UMKM Keripik Tempe Surya Jaya merupakan salah satu keripik tempe yang menjadi favorit bagi warga sekitar desa tersebut, dan juga banyak dijadikan oleh- oleh bagi wisatawan yang berkunjung ke Malang. Hal yang kita dapat dalam penelitian UMKM ini diantaranya kurangnya lokasi dalam teknologi digital yaitu Google Maps yang dengan tujuan untuk orang maupun pelanggan untuk mencari lokasi rumah produksi keripik tempe ini. Selain itu juga kurangnya tanda pengenal dan juga desain produk kemasan berupa desain stiker maka dari itu kita tidak hanya membantu bagaimana cara pengolahannya saja tetapi kita juga membantu pembuatan lokasi google maps, papan pengenal, banner dan desain stiker untuk memajukan UMKM ini agar lebih maju, mudah dikenal, dan pelanggan serta untuk memperluas pemasarannya.
Torsades de pointes associated with remdesivir treatment for COVID-19 pneumonia
Authors: Fung Jollee ST , Levitan Mark , Landry Sarah , McIsaac Sarah
Published: October 2022

Background:

Prolonged QT interval (QTc) can be a serious adverse event from SARS-CoV-2 infection and associated treatment, including remdesivir.

Methods:

We present a case of a 55-year-old woman with COVID-19 pneumonia who was treated with remdesivir. The QTc on admission was 483 ms. After three doses of remdesivir, she had an episode of non-sustained ventricular tachycardia. Repeat QTc was significantly prolonged at 609 ms. She experienced a polymorphic ventricular tachycardic cardiac arrest the next morning, thought to be secondary to torsades de pointes.

Results:

Transthoracic echocardiogram showed normal biventricular function. Electrolytes were within normal limits. In the absence of other QTc-prolonging medications, remdesivir was thought to be inciting agent. Following discontinuation of remdesivir, the patient's QTc returned to baseline.

Conclusions:

There is a risk for cardiac events from QTc prolongation effects of SARS-CoV-2 infection and associated treatment. We recommend pharmacological profile review and cardiac monitoring for patients receiving remdesivir.
Electronics Failure Analysis Demonstrations using a Quantum Diamond Microscope
Authors: Kehayias P. , Levine E. V. , Rodarte A. , Walraven J. , Mounce A. M.
Published: October 2022

One approach for finding faults in integrated circuits (ICs) is magnetic imaging, where we map the magnetic fields emitted by internal currents in the device and use this knowledge to infer the current paths and fault locations. This gives us access to information about the IC internal properties without needing voltage probes, as the magnetic fields are unimpeded by opaque insulating and conducting layers. Magnetic imaging benefits from optimizing the spatial resolution and minimizing the standoff distance between the magnetic sensor and the circuit, motivating new experimental approaches that excel at these attributes. In this work, we apply the quantum diamond microscope (QDM) instrument to example failure analysis situations, building on our previous work using the QDM to interrogate the internal states of commercial ICs to achieve micrometer-scale spatial resolution and standoff distance.
Machine Learning Reinforced Acoustic Signal Analysis for Enhancing Non-Destructive Defect Localization and Reliable Identification
Authors: Brand Sebastian , Kögel Michael , Altmann Frank , Hollerith Christian , Gounet Pascal
Published: October 2022

The paper presents the approach of enhancing time-domain signal analysis using machine learning techniques for analyzing acoustic echo signals and the subsequent derivation of condition-related class assignments for failure analysis. The examples provided here include two types of flip-chips with defects intentionally induced by thermal stressing. Besides investigating the general applicability and the benefit of the approach the current study also investigated the applicability of different deep learning model-architectures and compared their performances, accuracies, and robustness with respect to external impacts such as noise, jitter or physical defocusing. For independent verification selected defects which have either been identified by an experienced operator or the ML algorithm or both, have been further analyzed and validated by FIB/SEM cross sectional analysis.
Automated Labeling Infrastructure for Failure Analysis
Authors: Mathá Natalia , Schekotihin Konstantin , Bergner Matthias , Cobârzan Doriana , Hudelist Marco
Published: October 2022

The development of intelligent assistants helping Failure Analysis (FA) engineers in their daily work is essential to any digitalization strategy. In particular, these systems must solve various computer vision or natural language processing problems to select the most critical information from heterogeneous data, like images or texts, and present it to the users. Modern artificial intelligence (AI) techniques approach these tasks with machine learning (ML) methods. The latter, however, require large volumes of training data to create models to solve the required problems. In most cases, enterprise clouds store vast volumes of data captured while applying various FA methods. Nevertheless, this data is useless for ML training algorithms since it is stored in forms that can only be interpreted by highly-trained specialists. In this paper, we present an approach to embedding an annotation process in the everyday routines of FA engineers. Its services can easily be embedded in existing software solutions to (i) capture and store the semantics of each data piece in machine-readable form, as well as (ii) provide predictions of ML models trained on previously annotated data to simplify the annotation task. Preliminary experiments of the built prototype show that the extension of an image editor used by FA engineers with the services provided by the infrastructure can significantly simplify and speed up the annotation process.
Cooling System for High Performance Device Analysis
Authors: Nonaka Hirotaka , Terada Hirotoshi , Shimase Akira , Suzuki Junya , Nakamura Akihiro
Published: October 2022

Certain device failures are especially difficult to analyze since they can only be reproduced under high speed and high power conditions, while also requiring the removal of standard heat dissipating packaging to get visual access to the chip. In addition to the challenge of heat generation density of devices increasing year by year, small hot spots in actual usage generate heat far in excess of the average, and heat dissipation performance needs to be more efficient and highly uniform. In addition, it is desirable to implement a cooling system that does not overly restrict the number and types of lenses that can be used, such as high and low magnification air gap lenses as well as a solid-immersion lens, which has been one of the challenges of existing systems. This paper reports on the development of a cooling system to address these challenges and to enable failure analysis on a device running at 200 W.
A Quick and Intuitive Approach of Handeling In-Amp Failures Towards Lower Cycle Time and Improving Failure Mechanism Confidence and Quality
Authors: Cajucom Khristopherson , Evangelista Arnulfo , Adrias Isovelle , Ordiales Ryan , Arnaiz Godofredo
Published: October 2022

The instrumentation amplifier products are high-volume runner products hence, also a high volume of returns are encountered at Failure Analysis Department. To solve each return would need a highly structured technique that requires extensive plot of results for the determination of proper failure mechanism. A perceptive approach that the Failure Analyst deal with in solving the different issues encountered is the compilation of failure data using commonality study of returns with summary that can easily be seen on a Measles chart. A compilation of complete list of historical analysis with circuit block layout designation, test methods, signature cases, microprobing and circuit analysis collaboration results are consolidated in one file to help guide the Analyst in determining the exact cause of failure, thus improving quality and turnaround time that translates to cycle time improvement of 56% CT days reduction hence creating value to the customer.
First Approach of Fault Isolation using Green Laser on 4H-SiC Power Device
Authors: Barbarino Pierpaolo , Anastasi Giuseppe , Astuto Massimiliano , Mello Domenico
Published: October 2022

In this work we have investigated the results obtained using fault isolation techniques such as EMMI, OBIRCH and OBIC on a Wide band gap power device and in particular a 4H-SiC. We used YLF laser and Green Laser and showed the differences in the resulting hot spots. In the selected point, FIB cross sectioning and EDS analysis was performed. Once that the defect was shown, the differences the fault isolation results were discussed.
Electrical Fault Isolation for Functional and Logic Hard Failures using Laser Voltage Imaging
Authors: Sun Kan , Karuppannan Silambarasan , Chong Soon Woei , You Guofeng , Lee Wilson C. H. , Endrinal Lesly
Published: October 2022

Hard functional and logic failures which are insensitive to temperature, voltage, or frequency have become increasingly difficult to debug in advanced technology nodes, especially when Photon Emission (PEM) analysis could not provide any leads and Dynamic Laser Stimulation (DLS) could not be used due to the nature of the failure (no pass/fail margin). Laser Voltage Imaging (LVI), which is an extension of the Laser Voltage Probing (LVP) technique, provides a visual map of active components that are toggling at a certain frequency. This technique is widely employed in scan chain debug due to its simplicity, efficiency, and accuracy. However, most of LVI applications in literature reviews only involve scan chain fault isolation. This paper will present alternative applications for LVI, apart from scan chain debug. One specific application is the debug of a broken signal path by sending a periodic signal as a stimulus to a GPIO pad and tracing the LVI signal through the path by frequency mapping. In this paper, the concept and methodology behind this fault isolation approach will be discussed in full detail. Furthermore, three case studies of different types of hard failures with different applications of LVI will also be presented: an IO functional failure, an ATPG (Automatic test pattern generation) SAF (Stuck At Fault) failure and a BSDL(Boundary scan description language) input interconnect failure, to illustrate how LVI could be deployed in fault isolation for those functional and logic hard failures.
Investigation of Thermal Laser Stimulation (TLS) Effects on 7nm FinFET Transistor Parameters
Authors: Oarethu Johns , Song Zhigang , McGinnis Pat , Wu Stephen , Tran Phong , Tenney Mike , Oldrey Richard
Published: October 2022

Thermal Laser Stimulation (TLS) is employed extensively in semiconductor device fault isolation techniques such as TIVA (Thermal Induced Voltage Alteration), OBIRCH (Optical Beam Induced Resistance Change), SDL (Soft Defect localization), CPA (Critical Parameter Analysis), LADA (Laser Assisted Device Alteration), and LVI (Laser Voltage Imaging), etc. To investigate the TLS effects on 7nm FinFET transistor parameters, several transistors of 7nm FinFET inline ET (Electrical Test) macros were tested while employing TLS of various energy values. The test was done in linear mode so that the joule heating caused by the electrical current would be minimized. The experimental results showed that both NFETs and PFETs experienced increased Ioff (Off current) and Sub_Vt_lin_slope (Subthreshold slope), and decreased Ion (On current) and Vt_lin (Threshold voltage) due to elevated temperature of the transistor from TLS. Higher laser power caused greater effects on transistor parameters. The temperature increase on a transistor by TLS depends on the amount of laser energy transferred to, absorbed by, and dispersed by the transistor area. Factors such as the efficient coupling of the SIL (Solid Immersion Lens) with the Silicon backside surface, the transistor size, and the local layout around the transistor will greatly affect the amount of heat delivered to a particular transistor, even while using the same laser power. Thus, setting the laser power for fault isolation with TLS should consider these factors. Our experimental results also showed that the alteration of transistor parameters under TLS was not permanent if the laser power was carefully selected. It should be noticed that during dynamic fault isolation, a transistor may be switching between off, linear mode, and/or saturation mode. The temperature increase on the transistor under TLS may be higher than anticipated due to joule heating if the transistor operation is not confined to the linear region only. Experiments on transistors operating in saturation mode under TLS can be the subject of future work. The results obtained from these experiments can still establish guidelines for laser power settings to be used in the related fault isolation techniques for devices manufactured at the 7nm node so as to achieve non-destructive fault isolation.
Investigation of the Growth Mechanics of Laser Assisted Copper Deposition for Circuit Edit Applications
Authors: DiBattista Michael , Furlong Jordan , Levesque Matthew , Harper Thomas , Ferri Christopher G.L. , Silverman Scott , Mulholland Matthew M. , Bakken Nathan
Published: October 2022

Reproducible laser-assisted metal deposition with copper hexafluoroacetylacetonate trimethylvinylsilane Cu(hfac) (TMVS) has been demonstrated on a range of relevant semiconductor insulating material surfaces including silicon dioxide (SiO2), crystalline silicon (c-Si), and organic package material such as polyimide and printed circuit board (PCB) FR- 4. A key to reliable and chemically efficient growth is a novel copper chemistry delivery methodology using direct precursor pulsing. The laser power conditions for deposition are strongly correlated to the substrate material, with increased power for the more thermally conductive samples (0.8 – 1.0 W) and significantly less for packaging materials (50 mW). The laser-assisted copper growth results and material properties are comparable to the published literature. Examples of circuit modifications using this methodology demonstrate its valuable role in the future of circuit edit.
Electrical Characterization of Circuit Edit Workflow using High and Low Energy FIB
Authors: Haimson Or , Goldman Roy , Wong Michael
Published: October 2022

The workflow of backside IC circuit edits using low and high ion-beam energy is investigated. The imaging capabilities using a high keV beam are superior to that of lower beam energy, even when using low beam currents, on typical ion beam microscopes. In this work, we will test the parametric shift of IC components following the use of 5 keV Gallium Focused Ion Beam (FIB) to expose Shallow Trench Isolation (STI), depositing a protective dielectric layer, and then switching to 30 keV FIB to perform device alteration. Electrical testing results show that the devices exhibit only a minor parametric shift. We present a case study, performing circuit edit on a 7 nm process node using the proposed workflow. Finally, we discuss the advantages of the proposed workflow.
Large Field of View and Artifact-Free Plan View TEM Specimen Preparation by Post-FIB Ar Milling
Authors: Bonifacio C.S. , Li R. , Nowakowski P. , Ray M.L. , Fischione P.E.
Published: October 2022

Semiconductor devices are decreasing in dimensions and currently comprise stacks of ultrathin layers as in a spin-transfer torque magnetoresistive random-access memory (STTMRAM) device. For successful characterization by transmission electron microscopy (TEM) for failure analysis and device development, an accurate and controllable thinning of TEM specimens for is desirable. In this work, we combine plan view Ga focused ion beam (FIB) and post-FIB Ar milling preparation to prepare TEM specimens from a STT-MRAM device. Post-FIB Ar milling technique as a final polishing step of plan view TEM specimens was shown to prevent exposure of the tunnel barrier layer that can be damaged by the Ga FIB beam. We discuss the plan view FIB preparation, post-FIB Ar milling step and image analysis of the TEM images.
New Approach in Physical Failure Analysis Based on 3D Reconstruction
Authors: Mello Domenico , Sciuto Giuseppe , Astuto Massimiliano , Santangelo M. Francesca , Stegmann Heiko , Cognigni Flavio , Rossi Marco
Published: October 2022

In this work we present a new approach in physical failure analysis. Fault isolation can be done using volume diagnosis techniques. But when studying the identified defect sites by Focused Ion Beam (FIB) cross-sectioning, correct interpretation of the cross-sectional views strongly relies on choosing an appropriate cutting strategy. However, volume diagnosis techniques do not provide any information on which cutting directions and settings to choose to avoid misinterpretation of the spatial evolution of the defects. The proposed approach is to acquire FIB-SEM tomographic datasets at the defect sites to unequivocally characterize the defects in three-dimensional visualizations, independent of particular cross-sectioning strategies. In this specific case we have applied the methodology at a microcontroller for automotive applications on which a couple of floating VIAS were found. Thanks to the complete information obtained with the tomography, the defect could be assigned to a specific class of etching tools, and the root cause thus be solved.
Automated TEM Lamella Preparation using Remote CAD to SEM Alignment
Authors: Shim Hyun Woo , Lee Taehun , Kwon Jonghan
Published: October 2022

Automated TEM lamella preparation using the remote CAD to SEM image alignment has been demonstrated for high volume failure analysis. The proposed method not only provides a secure means of using CAD design data during the lamella prep process, but offers an improved flexibility compared to conventional methods of processing CAD design file in a tool environment. The experiment showed that the new method is 3.1 times higher in throughput and requires 74 times less manhours, compared to manual process.
Defect Localization and Analysis of Compound Semiconductors using ECCI, CBED, and STEM-in-SEM for an All-In-Situ Workflow Using a FIB/SEM Microscope
Authors: Stokes Adam , Strakoš Libor , Landin Trevan
Published: October 2022

Complex failure analysis often requires the use of multiple characterization instruments. For example, a defect or failure may be localized using one tool, whereas the subsequent marking, precision targeting, and high-resolution analysis may require completely different instruments. As a result, the analysis workflows require sample and operator coordination between instruments and engineers, which leads to lower throughput and success rates. This paper describes a complete in-situ workflow for comprehensive failure analysis processes on a compound semiconductor using a state-of-the-art FIB/SEM system, incorporating electron channeling contrast imaging (ECCI) and a STEM-in-SEM detector used in unison with an insertable detector positioned underneath the sample to capture transmitted electron condensed beam electron diffraction (CBED) micrographs.
Building a Better Lab Space for High-Tech Imaging/Processing Tools
Authors: Herschbein Steven B. , Hartfield Cheryl , Wong Michael , Kevek Joshua W.
Published: October 2022

The design and construction of a well-executed laboratory space to house high resolution analytical imaging and processing tools can often be more complex and expensive than anticipated. Unlike their manufacturing counterparts, lab tools as a class have fewer built-in countermeasures to fend off operational degradation caused by external factors. A poorly optimized facility can result in significant underperformance of installed systems, thereby wasting the investment and jeopardizing the mission. Unfortunately, very few assigned laboratory spaces are ‘naturally’ perfect for the installation of new analytical equipment at the outset. It typically takes considerable work to engineer most locations so that the tools function as they should and live up to expectations. The magnitude of the challenge and its true cost and lead time often come as a huge surprise to failure analysis engineers tasked with wearing multiple ‘hats’ while navigating the capital approval process. Being caught off guard in this manner often results in considerable time delay, as well as over-budget or sub-par outcomes. In this paper we offer suggestions on how to revamp the typical capital cycle process for specifying, buying, and installing future laboratory tools. We furthermore aim to produce an abbreviated reference guide for tool owners on facility requirements needed to ensure optimal analytical system performance.
High-Resolution Conductivity Mapping with STEM EBIC
Authors: Hubbard William A , Chan Ho Leung , Regan B. C.
Published: October 2022

Modern electronic systems rely on components with nanometer-scale feature sizes in which failure can be initiated by atomic-scale electronic defects. These defects can precipitate dramatic structural changes at much larger length scales, entirely obscuring the origin of such an event. The transmission electron microscope (TEM) is among the few imaging systems for which atomic-resolution imaging is easily accessible, making it a workhorse tool for performing failure analysis on nanoscale systems. When equipped with spectroscopic attachments TEM excels at determining a sample’s structure and composition, but the physical manifestation of defects can often be extremely subtle compared to their effect on electronic structure. Scanning TEM electron beam-induced current (STEM EBIC) imaging generates contrast directly related to electronic structure as a complement the physical information provided by standard TEM techniques. Recent STEM EBIC advances have enabled access to a variety of new types of electronic and thermal contrast at high resolution, including conductivity mapping. Here we discuss the STEM EBIC conductivity contrast mechanism and demonstrate its ability to map electronic transport in both failed and pristine devices.
TEMautoReporting—Automation of Elemental Analysis and TEM Reporting with Graphical User Interface
Authors: Liao Yougui , Kari Tom , Sorensen Curt , Goodwin Rob , Williams Scott , Wilkin Robert , Gatzemeier Scott
Published: October 2022

Manual TEM analysis with elemental analysis through EELS or EDS has long been a major throughput bottleneck in physical failure analysis. The novel non-commercial technique presented in this paper is a historical and industry-first milestone of developments of combining elemental analysis and raw TEM data to automate data reporting. The approach uses a layered architecture in which “specific skills” are created on top of so-called "generic skills" (i.e., generic robot behaviors like cursor motions). With this skill-oriented robot programming approach, time and cost-efficient data production has been established with high accuracy, speed, and comprehension. The speed and productivity of images and maps, obtained from both collected raw data and jobs in the queue, cannot be achieved by manual operation, and the accuracy and comprehension cannot be practically obtained routinely on each job by human interaction because it is too time consuming.
A Methodical Failure Analysis Approach Using Thermomechanical Analysis in Reducing Recurring Failures on iButton Modules
Authors: Austral John Albert , Cruz Em Julius Dela , Garcia Ramon , Valiente Flordeliza
Published: October 2022

The iButton temperature logger is a robust and independent system that measures temperature and records the temperature data in a non-volatile memory section. Although iButtons are a relatively mature product, failures due to Battery Depletion and Battery-On-Reset (BOR) occur. Despite the implementation of major corrective actions to improve product reliability and robustness, customer failures due to Depleted Battery and BOR have not been fully eliminated. One recent quality issue involved a high failure rate on one iButton variant at the customer’s quality control before calibration, which prompted a thorough failure analysis to nail down the real cause of failure. This paper presents methodical failure analysis (FA) steps and processes that led to the identification of failure mechanisms. As a result, the real issue was detected leading to a more accurate corrective action and device reliability.
Systematic Failure Analysis Procedure for Major Assembly Defects in Clip Bond Surface Mount Devices
Authors: Tran Cuong
Published: October 2022

Failure to apply the proper systematic analysis procedure can result in loss of valuable evidence required to understand the root cause of package failures. For example, in the case of marginal current leakage fail, decapsulation from package front-side may result in loss of the electrical failure signal so that root cause of the leakage failure cannot be understood. In such case, a systematic backside fault isolation method can improve the success rate of isolating the defect. These electrical failures are often due to zero solder bond line thickness (BLT), or filler particle compression on the die, which are key assembly defects encountered in clip style surface mount packages (SMX). In this paper, the first case study is to determine the failure mechanism of an electrical short. A silicon micro-crack propagating through the junction at the dimple clip center, which is due to the ultra-thin solder BLT close to zero micron is found to be the root cause of failure. The second case presents the failure mechanism for a low leakage fail. The pointed tip of a silica filler particle compressed on the die surface leads to excessive leakage.
A Multi-Protocol Module To Provide An External Trigger For Dynamic Lock-In Thermography
Authors: Bienek Ray
Published: October 2022

Lock-in thermography (LIT) is a firmly established and powerful technique for IC defect localization. The standard approach is to detect and analyze the device temperature fluctuation between two bias conditions using an infrared thermal imaging camera and check for any anomalous heat response. For the most straightforward setup, these bias conditions would be achieved by the modulation of a supply voltage provided by the LIT system. This allows for synchronization to the internal camera frame rate. In addition to this method, the ability to provide an external trigger may be an option, as it is for the ELITE system by Thermo Fisher Scientific. This expands the LIT arena to failures that may only be observable by, for example, setting different register contents at a constant supply voltage. Though IC testers can be used to provide the stimulus and a trigger signal for these situations, often a simpler, more compact solution would be beneficial for the failure analyst. This paper presents such an alternative: the application of a low-cost, USB-based module which can emulate various communication protocols (for example, I2C, SPI) while providing a synchronized timing pulse to externally trigger the ELITE, thus facilitating dynamic LIT investigations. The efficacy of this solution is demonstrated by a case study in which dynamic LIT produced a single hot spot at the defect site that was undetected by the voltage modulation approach.
Analysis of Retention Failure by Bulk Trap in DRAM
Authors: Han Dongguk , Yang Hoonchang , Hwang Jinyeong , Kim Jinseon , Cho Kyoungrak , Nam Incheol , Kim Daesun , Lee Beomseop , Yim Sungsoo , Hong Heeil , Lee Jooyoung
Published: October 2022

DRAM is a type of memory that stores each bit of data in a capacitor cell, leakage current is a very important electrical parameter to retain data. Therefore, larger cell capacitance and smaller leakage current have been regarded as key factors in continuous shrinkage of DRAM. Generally, gate induced drain leakage (GIDL) and junction leakage of cell transistor (CTR) are well-known, but our approach is focused on retention failure by bulk trap. In order to electrically observe the influence of bulk trap, we used the adjacent gate of CTR to control electron migration. Results show that there are many failure cells due to bulk trap, and dimension shrinkage accelerates this failure. Consequently, balancing among electrical bias point and transistor manufacturing process should be carefully considered with bulk traps.
Studies and Applications of a New Delineation Method of Silicon Defects in Wafer Fabrication
Authors: Hua Younan , Xiaomin Li , Liao Lois , Liu Yuanyuan , Zhang Linhua
Published: October 2022

In wafer fabrication, silicon defects on the substrate directly affect the yield of the wafer. In this paper, we will study and discuss a chemical delayering and delineate method for silicon defects in wafer fabrication using Secco etch. It is well-known that during delayering process of wafer, the removal of polysilicon (Poly-Si) layer is very difficult, especially for the wide-layer polysilicon (Poly-Si) which is difficult to completely remove with HF acid solution. We introduce a chemical recipe to fast delayer polysilicon layer completely before delineating silicon defects on silicon substrate using Secco etch. Those skilled in the art could be experiment within half an hour to get analysis results. It saves time and improves operational efficiency. Moreover, based on the experimental results we think that it is possible to identify the root cause according to the shapes of silicon defects using Secco etch.
Analog Quiescent Current as Efficient Method for Accurate Fault Isolation in Complex Functional Failures
Authors: Merassi A.A. , Catanzaro E. , Passarella D. , Boglio A.
Published: October 2022

Analog fault localization for functional failures is usually a very complex task, especially because a deep knowledge of all the functionalities of the device is often required. In addition, when the part is analyzed in application conditions, the interpretation of the anomalous emissions in the failed part and its link to the failing elementary component is not so obvious. The adoption of the analog quiescent current (IDDa) allows to address directly the failing elementary component inside the suspected block.
Die-Level Micrometers-Deep Subsurface Imaging for Fault Isolation using Remote Bias Induced Electrostatic Force Microscopy
Authors: Strelcov Evgheni , You Lin , Obeng Yaw , Kopanski Joseph J.
Published: October 2022

In recent years, scanning probe microscopy (SPM) has drawn substantial attention for subsurface imaging, since the ultrasharp AFM tip (≈ 10 nm in radius) can deliver and detect, mechanical and electrical signals right above the material’s 3D volume with which it is directly interacting. Electrostatic force microscopy, or EFM, is one of the most common atomic force microscopy (AFM) variants for electrical property characterization. In this work, we demonstrate a method to significantly improve EFM’s subsurface imaging capability. Unlike conventional EFM, where an AC bias is applied to the cantilever, we applied two out of phase AC biases to adjacent subsurface lines and image the resulting cantilever response at the surface. The resulting remote bias induced EFM (RB-EFM) amplitude shows decent contrast of metal lines with a 2.4 μm spacing buried up to 4 μm beneath the surface. This novel method may resolve lines with a horizontal spacing of less than 130 nm at such depth and wider lines to at least 6 μm in depth. In addition, the results are compared with conventional EFM and KPFM that detects subsurface structure with two independent DC biases. A COMSOL simulation model has been developed that reproduces the essential features of the measurement and explains the improvement of subsurface imaging with RB-EFM compared to other electrostatic force imaging techniques. We show, that by biasing independent lines at a small delta in frequency from the cantilever resonance, multiple line traces can be differentiated in the RB-EFM image.
Newly Designed, Faster, and More Sensitive Scanning Capacitance Microscope for Failure Analysis
Authors: Zhang Haigang , Kocun Marta , Ohler Ben , Proksch Roger
Published: October 2022

A new scanning capacitance microscope, with an optimized, modern RF circuitry is described. The new design results in improved ease of use and sensitivity. We will discuss the design details and show application examples on semiconductor devices and ferroelectric materials.
An Introduction to the FIB as a Microchip Circuit Edit Tool
Authors: Herschbein Steven , Tan Shida , Livengood Richard , Wong Michael
Published: October 2022

This presentation introduces the practice of focused ion beam (FIB) chip editing and its power and versatility as a problem-solving tool. It begins with a review of the features and functions of FIB systems, the role of gas chemistry in milling, etching, and deposition, and the use of IR imaging for navigation and targeting. It goes on to identify challenges due to packaging materials, chip-package interactions, and other factors, and in each case, provide alternate approaches and procedures to circumvent potential problems. It also covers advanced practices and methods and assesses potential future advancements.
Failure Analysis Challenges for Chip Scale Packages (2022 Update)
Authors: Li Susan X.
Published: October 2022

This presentation provides an overview of chip-scale packages (CSPs) and the challenges they create for failure analysis. It begins with a review of stacked, multichip, and wafer-level packages, using images and illustrations to highlight complexities. It then presents examples of package-level failure mechanisms including various forms of cracking, inadvertent wire bond contact, and die-edge chipping. It likewise assesses die-level analysis challenges and provides practical solutions. The presentation also includes several case studies and describes new and emerging challenges.
Zirconia for Dental Implants
Authors: Gupta Saurabh
Published: October 2022

One of the most frequently cited advantages of ceramics in dentistry relates to aesthetics, and the same applies for dental implants. Zirconia has emerged as the material of choice for nonmetal implants. This article introduces the reader to zirconia as an implant material, its properties, manufacturing processes, and the particular surface modifications and treatments that have rendered its surfaces biologically compatible with peri-implant soft and hard tissues.
Laser-Induced Forward Transfer of Biomaterials
Authors: Sole-Gras Marc , Huang Yong , Chrisey Douglas B.
Published: October 2022

The use of 3D bioprinting techniques has contributed to the development of novel cellular patterns and constructs in vitro, ex vivo, and even in vivo. There are three main bioprinting techniques: inkjet printing, extrusion printing (also known as bioextrusion), laser-induced forward transfer (LIFT) printing, which is also known as modified LIFT printing, matrix-assisted pulsed-laser evaporation direct write, and laser-based printing (laser-assisted bioprinting, or biological laser printing). This article provides an overview of the LIFT process, including the LIFT process introduction, different implementations, jetting dynamics, printability phase diagrams, and printing process simulations. Additionally, materials involved during LIFT are introduced in terms of bioink materials and energy-absorbing layer materials. Also, the printing of single cells and 2D and 3D constructs is introduced, showcasing the current state of the art with the ultimate goal for tissue- and organ-printing applications.
Additive Manufacturing of Cobalt-Chromium Alloy Biomedical Devices
Authors: Bandyopadhyay Amit , Avila Jose D. , Mitra Indranath , Bose Susmita
Published: October 2022

This article discusses some of the additive manufacturing (AM) based fabrication of alloys and their respective mechanical, electrochemical, and in vivo performance. Firstly, it briefly discusses the three AM techniques that are most commonly used in the fabrication of metallic biomedical-based devices: binder jetting, powder-bed fusion, and directed-energy deposition. The article then characterizes the electrochemical properties of additive-manufactured/processed cobalt-chromium alloys. This is followed by sections providing an evaluation of the biological response to CoCr alloys in terms of the material and 3D printing fabrication. Discussion on the biological response as a function of direct cellular activity on the surface of CoCr alloys in static conditions (in vitro), in dynamic physiological conditions (in vivo), and in computer-simulated conditions (in silico) are further discussed in detail. Finally, the article provides information on the qualification and certification of AM-processed medical devices.
In Situ Bioprinting—Current Applications and Future Challenges
Authors: Fortunato Gabriele Maria , Bonatti Amedeo Franco , Micalizzi Simone , Chiesa Irene , Batoni Elisa , De Acutis Aurora , De Maria Carmelo , Vozzi Giovanni
Published: October 2022

Bioprinting has been advancing in the field of tissue engineering as the process for fabricating scaffolds, making use of additive manufacturing technologies. In situ bioprinting (also termed intraoperative bioprinting) is a promising solution to address the limitations of conventional bioprinting approaches. This article discusses the main approaches and technologies for in situ bioprinting. It provides a brief overview of the bioprinting pipeline, highlighting possible solutions to improve currently used approaches. Additionally, case studies of in situ bioprinting are provided and in situ bioprinting future perspectives are discussed.