bluuebunny/crossref_metadata_2025 huggingface dataset:
Using Outcome Measures in Daily Practice: Development and Evaluation of an Implementation Strategy for Physiotherapists in the Netherlands
Authors: Swinkels Raymond A.H.M. , Meerhoff Guus M. , Custers Jan W.H. , van Peppen Roland P.S. , Beurskens Anna J.H.M. , Wittink Harriet
Published: October 2015

Purpose: To describe the development of an educational programme for physiotherapists in the Netherlands, two toolkits of measurement instruments, and the evaluation of an implementation strategy. Method: The study used a controlled pre- and post-measurement design. A tailored educational programme for the use of outcome measures was developed that consisted of four training sessions and two toolkits of measurement instruments. Of 366 invited physiotherapists, 265 followed the educational programme (response rate 72.4%), and 235 randomly chosen control physiotherapists did not (28% response rate). The outcomes measured were participants' general attitude toward measurement instruments, their ability to choose measurement instruments, their use of measurement instruments, the applicability of the educational programme, and the changes in physiotherapy practice achieved as a result of the programme. Results: Consistent (not occasional) use of measurement instruments increased from 26% to 41% in the intervention group; in the control group, use remained almost the same (45% vs 48%). Difficulty in choosing an appropriate measurement instrument decreased from 3.5 to 2.7 on a 5-point Likert-type scale. Finally, 91% of respondents found the educational programme useful, and 82% reported that it changed their physiotherapy practice. Conclusions: The educational programme and toolkits were useful and had a positive effect on physiotherapists' ability to choose among many possible outcome measures.
Standardized Patients versus Volunteer Patients for Physical Therapy Students' Interviewing Practice: A Pilot Study
Authors: Murphy Sue , Imam Bita , MacIntyre Donna L.
Published: October 2015

Purpose: To compare the use of standardized patients (SPs) and volunteer patients (VPs) for physical therapy students' interviewing practice in terms of students' perception and overall costs. Methods: Students in the Master of Physical Therapy programme (n=80) at a Canadian university were divided into 20 groups of 4 and were randomly assigned to interview either an SP (10 groups) or a VP (10 groups). Students completed a survey about their perception of the usefulness of the activity and the ease and depth of information extraction. Survey responses as well as costs of the interview exercise were compared between SP and VP groups. Results: No statistically significant between-groups difference was found for the majority of survey items. The cost of using an SP was $148, versus $50 for a VP. Conclusions: Students' perceptions of the usefulness of the activity in helping them to develop their interview skills and of the ease and depth of extracting information were similar for both SPs and VPs. Because the cost of using an SP is about three times that of using a VP, using VPs seem to be a more cost-effective option.
Enhanced Patient-Centred Care: Physiotherapists' Perspectives on the Impact of International Clinical Internships on Canadian Practice
Authors: Mesaroli Giulia , Bourgeois Anne-Marie , McCurry Ellen , Condren Allison , Petropanagos Peter , Fraser Michelle , Nixon Stephanie A.
Published: October 2015

Purpose: To explore the perspectives of physiotherapists who participated in an international clinical internship (ICI) in low- or middle-income countries (LMICs) during their physiotherapy (PT) training in a Canadian PT programme regarding the ICI's impact on their PT practice in Canada. Methods: This qualitative descriptive study used in-depth semi-structured interviews. Data were organized using NVivo; inductive and deductive coding were used to analyze data and develop broader themes. Results: The 13 practising Canadian physiotherapists interviewed described three enhanced capacities: (1) critical reflection on culture, values and practice; (2) communication skills; and (3) creativity and resourcefulness. These capacities were perceived to transfer to Canadian practice by enhancing participants' ability to deliver patient-centred care, specifically through an enhanced understanding of patients' values and social determinants of health, regardless of the Canadian setting or patient population. Conclusions: For PT students considering an ICI, the study findings provide insight into the perceived impact of ICIs on Canadian practice. For PT academic programmes, the findings can guide decisions on the extent of investment in ICIs as learning opportunities that will enhance practice in Canada.
Characteristics of People with Hip or Knee Osteoarthritis Deemed Not Yet Ready for Total Joint Arthroplasty at Triage
Authors: MacIntyre Norma J. , Johnson Jenna , MacDonald Nicole , Pontarini Lauren , Ross Kaitlyn , Zubic Gorana , Majumdar Sampa Samanta
Published: October 2015

Purpose: To identify the characteristics of people with hip or knee osteoarthritis (OA) attending a regional triage centre for an initial consult who are deemed not yet ready for total joint arthroplasty (TJA). Methods: Initial consultation notes (n=482) were reviewed retrospectively. Predictive variables were derived from the literature a priori, and 14 of these variables were suitable for inclusion in stepwise multiple logistic regression analyses. Results: Of the 222 eligible people, 131 (59%) were deemed not yet ready for TJA. Five variables entered into the model ([Formula: see text]=133.19, p<0.001) for an overall success rate of 81.1%. Those deemed not yet ready for TJA were more likely to have knee OA (vs. hip OA; odds ratio [OR]=0.352, p=0.018), to have less severe OA (OR=0.246 for each category increase in severity, p<0.001), to use no gait aid (vs. cane; OR=0.390, p=0.033), and to have a higher Lower Extremity Functional Scale score (OR=1.050 for each 1-point increase, p=0.003) and better joint status as measured by the Knee Society Scale or Hip Harris Scale (OR=3.946 for each category increase, p=0.007). Conclusion: Considering these characteristics will help clinicians to identify individuals likely to require interventions other than TJA.
An Ocean of Locusts - The Perception and Control of Insect Pests in Prussian Brandenburg (1700-1850)
Authors: Sprenger Jana
Published: October 2015

Since the beginning of agrarian societies, coping with animal pests has been an important part of the interaction between humans and their environment. Analysing historical pest-related discourses reveals contemporary knowledge of special aspects of the natural world, the way of dealing with natural hazards, as well as societal changes in the valuation of nature. The eighteenth and early nineteenth centuries were characterised by substantial transformations in the confronting of animal pests. Important foundations leading to the later development of modern pest control were set in this time. The study examines the perception and distribution as well as the damage caused by and control of different insect pests in agriculture and forestry. It concentrates on Prussian Brandenburg in the northeast of today's Germany between 1700 and 1850. Handwritten administrative documents as well as printed silvicultural, agricultural and entomological literature serve as underlying sources. The analysis focuses on pine caterpillars in forestry and migratory locusts in agriculture. It also gives an overview of the perception of animal pests in general.
Bugs in the Garden: Tea Plantations and Environmental Constraints in Eastern India (Assam), 1840-1910
Authors: Dey Arnab
Published: October 2015

This article rethinks the relationship between the tea plantation economy and its built environment, ecological constraints and nature in fin de siècle Assam in eastern India. It does this by analysing the historical role of tea pests and climate that bedevilled the industry throughout this period. If labour remained the long-term concern for planters (and historians), it argues that these ecological factors induced a critical impact on the working and character of these estates that has largely been overlooked. Alongside labour, nature was an important ally and obstacle that had to be understood, ordered and disciplined. This article thus suggests that managing these estates was as much a biological and ecological challenge as an economic one.
Sulphureuine B, a drimane type sesquiterpenoid isolated from Laetiporus sulphureus induces apoptosis in glioma cells
Authors: Zhang Jing-Wei , Wen Gong-Ling , Zhang Lei , Duan Dong-Mei , Ren Zhong-Hai
Published: October 2015

A drimane type sesquiterpenoids, sulphureuine B was isolated from the edible mushroom Laetiporus sulphureus and its antiproliferative properties were investigated using U-87MG glioma cells. It was observed that sulphu-reuine B-induced apoptosis in U-87MG cells and the mechanisms involved are endoplasmic reticulum stress, mitochondrial and death receptor mediated pathways. Endoplasmic reticulum stress was identified from the results of enormous cytoplasmic vacuolation, CHOP elevation and caspase-12 cleavage. Further, we found that treatment of sulphureuine B-induced PERK, IRE1α, and ATF6α activations. In addition, sulphureuine B-induced Bcl-2 down-regulation, cleavage of PARP, and caspase-8 activation were also affected. All these experimental results clearly revealed that sulphureuine B-induced apoptosis mediated through endoplasmic reticulum stress, mitochondrial, and death receptor signaling pathways.

 
Le droit de la biodiversité
Authors: Beurier Jean-Pierre
Published: October 2015

Les découvertes récentes en biologie moléculaire et leurs applications en génie génétique ouvrent des voies nouvelles en médecine, en agroalimentaire ou en technologie des matériaux. Les travaux les plus récents montrent une perte importante de la biodiversité à notre époque, dont la cause est humaine. Afin de tirer profit des découvertes de la génétique, il convient de préserver la biodiversité, réserve naturelle de gènes. Cette préoccupation protectionniste est le fait des pays développés, alors que les pays en développement souhaitent avant tout tirer avantage de la vente d'espèces ou du contrôle de l'accès à celles-ci.

Le droit international de l'environnement n'était pas armé pour répondre à ce besoin nouveau. C'est pourquoi la Convention de Rio de 1 992 traite de la biodiversité. Elle entérine les thèses des pays en développement, instaurant une privatisation généralisée de l'accès à ces ressources nouvelles, dans le droit fil des résolutions sur la souveraineté des peuples sur leurs ressources naturelles.

Les ressources génétiques deviennent un produit commercial comme les autres. L'accès aux gènes est source de redevances ou d'un troc : liberté d'accès contre transfert de technologie. Dans la zone intertropicale, souvent l'accès aux espèces génétiquement intéressantes pose le problème de la protection du sol, du mode de vie et du savoir des populations autochtones qui ont parfois des rapports conflictuels avec l'Etat prétendant exercer sa souveraineté sur ce territoire.

La vision commerciale des ressources génétiques, la brevetabilité du vivant ont projeté la biodiversité sur le devant de la scène juridique internationale. Il n'est pas certain que le droit en vigueur soit le meilleur moyen d'assurer la protection de la biodiversité dont pourtant le monde de la recherche, unanime, s'accorde à penser qu'elle a une importance considérable pour la société de demain.
La responsabilité personnelle des directeurs techniques ayant dans leurs attributions des compétences en matière d'environnement
Authors: Steichen Pascale
Published: October 2015

De nombreuses entreprises tendent aujourd'hui à confier à un « responsable » la mission de gérer et de prévenir les risques d'atteinte à l'environnement. Cette nouvelle fonction n'est pas sans susciter un certain nombre d'interrogations au regard notamment des responsabilités susceptibles d'être imputées, de manière alternative ou cumulative, à l'entreprise elle-même, à son dirigeant, ou au délégué chargé des questions environnementales. Or, le flou artistique qui entoure cette nouvelle fonction ne sert ni les intérêts des salariés, ni ceux de l'environnement. Il semblerait bien que l'on assiste aujourd'hui à un double mouvement. Au plan pénal, on constate une extension de la responsabilité des délégués, quel que soit le secteur concerné, à partir du moment où les conditions traditionnelles de la délégation de pouvoir se trouvent réunies.

Dans le même temps, la responsabilité civile des préposés vis-à-vis de leur commettant se trouve considérablement limitée dans la mesure où la responsabilité du préposé ne semble plus pouvoir être engagée dès lors que celui-ci a agi dans le cadre de ses fonctions.
Bordes et Temeharo c/France - Une tentative pour faire protéger l'environnement par le Comité des droits de l'homme
Authors: Dommen Caroline
Published: October 2015

La décision du Comité des droits de l'homme des Nations unies, dans l'affaire Bordes et Temeharo c/ France en 1996, a mis en exergue certains obstacles juridiques auxquels peuvent se heurter des individus se plaignant qu'une dégradation de l'environnement viole du même coup des droits garantis par le Pacte international relatif aux droits civils et politiques. La principale difficulté est de prouver que les plaignants sont « victimes » (au sens du premier Protocole facultatif se rapportant au pacte) d'une violation de leurs droits. Pour cela, ils doivent démontrer qu'ils ont déjà subi des conséquences négatives ou que la menace de telles conséquences est bien réelle. Une des caractéristiques des problèmes environnementaux est la difficulté de mesurer leurs conséquences. Ainsi, le droit international de l'environnement est en train de se doter des moyens de tenir compte des effets incertains et à long terme des problèmes environnementaux. Les règles pour la protection des droits de l'homme doivent aussi évoluer dans ce sens.
Electrochemical behavior of polypyrrol/AuNP composites deposited by different electrochemical methods: sensing properties towards catechol
Authors: García-Hernández Celia , García-Cabezón Cristina , Medina-Plaza Cristina , Martín-Pedrosa Fernando , Blanco Yolanda , de Saja José Antonio , Rodríguez-Méndez María Luz
Published: October 2015

Two different methods were used to obtain polypyrrole/AuNP (Ppy/AuNP) composites. One through the electrooxidation of the pyrrole monomer in the presence of colloidal gold nanoparticles, referred to as trapping method (T), and the second one by electrodeposition of both components from one solution containing the monomer and a gold salt, referred to as cogeneration method (C). In both cases, electrodeposition was carried out through galvanostatic and potentiostatic methods and using platinum (Pt) or stainless steel (SS) as substrates. Scanning electron microscopy (SEM) demonstrated that in all cases gold nanoparticles of similar size were uniformly dispersed in the Ppy matrix. The amount of AuNPs incorporated in the Ppy films was higher when electropolymerization was carried out by chronopotentiometry (CP). Besides, cogeneration method allowed for the incorporation of a higher number of AuNPs than trapping. Impedance experiments demonstrated that the insertion of AuNPs increased the conductivity. As an electrochemical sensor, the Ppy/AuNp deposited on platinum exhibited a strong electrocatalytic activity towards the oxidation of catechol. The effect was higher in films obtained by CP than in films obtained by chronoamperometry (CA). The influence of the method used to introduce the AuNPs (trapping or cogeneration) was not so important. The limits of detection (LOD) were in the range from 10−5to 10−6mol/L. LODs attained using films deposited on platinum were lower due to a synergy between AuNPs and platinum that facilitates the electron transfer, improving the electrocatalytic properties. Such synergistic effects are not so pronounced on stainless steel, but acceptable LOD are attained with lower price sensors.
Effective ascorbate-free and photolatent click reactions in water using a photoreducible copper(II)-ethylenediamine precatalyst
Authors: Beniazza Redouane , Bayo Natalia , Molton Florian , Duboc Carole , Massip Stéphane , McClenaghan Nathan , Lastécouères Dominique , Vincent Jean-Marc
Published: October 2015

The search for copper catalysts able to perform effectively click reactions in water in the absence of sodium ascorbate is an active area of current research with strong potential for applications in bioconjugation. The water-soluble and photoreducible copper(II)–EDA (EDA = ethylenediamine) complex 1, which has two 4-benzoylbenzoates acting as both counterion and photosensitizer, has been synthesized and characterized by different techniques including single crystal X-ray diffraction. Highly efficient photoreduction was demonstrated when solutions of 1 in hydrogen atom donating solvents, such as THF or MeOH, were exposed to UVA radiation (350–400 nm) provided by a low pressure mercury lamp (type TLC = thin-layer chromatography, 365 nm), or by a 23 W fluorescent bulb, or by ambient/sunlight. In water, a much poorer hydrogen atom donating solvent, the photoreduction of 1 proved inefficient. Interestingly, EPR studies revealed that complex 1 could nonetheless be effectively photoreduced in water when alkynes were present in solution. The catalytic activity of 1 for click reactions involving a range of water-soluble alkynes and azides, in particular saccharides, was tested under various illumination conditions. Complex 1 was found to exhibit a photolatent character, the photogenerated copper(I) being very reactive. On irradiating aqueous reaction mixtures containing 1 mol % of 1 at 365 nm (TLC lamp) for 1 h, click reactions were shown to proceed to full conversion.
Stability of Audiometric Thresholds for Children with Hearing Aids Applying the American Academy of Audiology Pediatric Amplification Guideline: Implications for Safety
Authors: McCreery Ryan , Walker Elizabeth , Spratford Meredith , Kirby Benjamin , Oleson Jacob , Brennan Marc
Published: October 2015

Background:Children who wear hearing aids may be at risk for further damage to their hearing from overamplification. Previous research on amplification-induced hearing loss has included children using linear amplification or simulations of predicted threshold shifts based on
nonlinear amplification formulae. A relationship between threshold shifts and the use of nonlinear hearing aids in children has not been empirically verified.Purpose:The purpose of the study was to compare predicted threshold shifts from amplification to longitudinal behavioral thresholds
in a large group of children who wear hearing aids to determine the likelihood of amplification-induced hearing loss.Research Design:An accelerated longitudinal design was used to collect behavioral threshold and amplification data prospectively.Study Sample:Two-hundred and thirteen
children with mild-to-profound hearing loss who wore hearing aids were included in the analysis.Data Collection and Analysis:Behavioral audiometric thresholds, hearing aid outputs, and hearing aid use data were collected for each participant across four study visits. Individual ear-
and frequency-specific safety limits were derived based on the Modified Power Law to determine the level at which increased amplification could result in permanent threshold shifts. Behavioral thresholds were used to estimate which children would be above the safety limit at 500, 1000, 2000,
and 4000 Hz using thresholds in dB HL and then in dB SPL in the ear canal. Changes in thresholds across visits were compared for children who were above and below the safety limits.Results:Behavioral thresholds decreased across study visits for all children, regardless of whether their
amplification was above the safety limits. The magnitude of threshold change across time corresponded with changes in ear canal acoustics as measured by the real-ear-to-coupler difference.Conclusions:Predictions of threshold changes due to amplification for children with hearing loss
did not correspond with observed changes in threshold over across 2‐4 yr of monitoring amplification. Use of dB HL thresholds and predictions of hearing aid output to set the safety limit resulted in a larger number of children being classified as above the safety limit than when safety
limits were based on dB SPL thresholds and measured hearing aid output. Children above the safety limit for the dB SPL criteria tended to be fit above prescriptive targets. Additional research should seek to explain how the Modified Power Law predictions of threshold shift overestimated risk
for children who wear hearing aids.
Newly recognised lineages of perithecial ascomycetes: the new orders Conioscyphales and Pleurotheciales
Authors: Réblová M. , Seifert K.A. , Fournier J. , Štěpánek V.
Published: October 2015

Phylogenetic analyses of DNA sequences from nuclear ribosomal and protein-coding loci support the placement of several perithecial ascomycetes and dematiaceous hyphomycetes from freshwater and terrestrial environments in two monophyletic clades closely related to the Savoryellales.
One clade formed by five species of Conioscypha and a second clade containing several genera of uncertain taxonomic status centred on Pleurothecium, represent two distinct taxonomic groups at the ordinal systematic rank. They are proposed as new orders, the Conioscyphales
and Pleurotheciales. Several taxonomic novelties are introduced in the Pleurotheciales, i.e. two new genera (Adelosphaeria and Melanotrigonum), three novel species (A. catenata, M. ovale, Phaeoisaria fasciculata) and a new combination (Pleurotheciella
uniseptata). A new combination is proposed for Savoryella limnetica in Ascotaiwania s.str. based on molecular data and culture characters. A strongly supported lineage containing a new genus Plagiascoma, species of Bactrodesmiastrum and Ascotaiwania persoonii,
was identified as a sister to the Conioscyphales/Pleurotheciales/Savoryellales clade in our multilocus phylogeny. Together, they are nested in a monophyly in the Hypocreomycetidae, significantly supported by Bayesian inference and Maximum Likelihood analyses. Members of this
clade share a few morphological characters, such as the absence of stromatic tissue or clypeus, similar anatomies of the 2-layered ascomatal walls, thin-walled unitunicate asci with a distinct, non-amyloid apical annulus, symmetrical, transversely septate ascospores and holoblastic conidiogenesis.
They represent the only fungi in the Hypocreomycetidae with apically free, filiform to cylindrical, persistent or partially disintegrating paraphyses. The systematic placement of two other dematiaceous hyphomycetes was resolved based on DNA sequences; Phragmocephala stemphylioides
is a member of the Pleurotheciales and Triadelphia uniseptata is within the Savoryellales.
Comparative Genome Analysis Reveals Divergent Genome Size Evolution in a Carnivorous Plant Genus
Authors: Vu Giang T. H. , Schmutzer Thomas , Bull Fabian , Cao Hieu X. , Fuchs Jörg , Tran Trung D. , Jovtchev Gabriele , Pistrick Klaus , Stein Nils , Pecinka Ales , Neumann Pavel , Novak Petr , Macas Jiri , Dear Paul H. , Blattner Frank R. , Scholz Uwe , Schubert Ingo
Published: October 2015

The C‐value paradox remains incompletely resolved after >40 yr and is exemplified by 2,350‐fold variation in genome sizes of flowering plants. The carnivorous Lentibulariaceae genus Genlisea, displaying a 25‐fold range of genome sizes, is a promising subject to study mechanisms and consequences of evolutionary genome size variation. Applying genomic, phylogenetic, and cytogenetic approaches, we uncovered bidirectional genome size evolution within the genus Genlisea. The Genlisea nigrocaulis Steyerm. genome (86 Mbp) has probably shrunk by retroelement silencing and deletion‐biased double‐strand break (DSB) repair, from an ancestral size of 400 to 800 Mbp to become one of the smallest among flowering plants. The G. hispidula Stapf genome has expanded by whole‐genome duplication (WGD) and retrotransposition to 1550 Mbp. Genlisea hispidula became allotetraploid after the split from the G. nigrocaulis clade ∼29 Ma. Genlisea pygmaea A. St.‐Hil. (179 Mbp), a close relative of G. nigrocaulis, proved to be a recent (auto)tetraploid. Our analyses suggest a common ancestor of the genus Genlisea with an intermediate 1C value (400–800 Mbp) and subsequent rapid genome size evolution in opposite directions. Many abundant repeats of the larger genome are absent in the smaller, casting doubt on their functionality for the organism, while recurrent WGD seems to safeguard against the loss of essential elements in the face of genome shrinkage. We cannot identify any consistent differences in habitat or life strategy that correlate with genome size changes, raising the possibility that these changes may be selectively neutral.
THE EFFECT OF MANAGEMENT DECISION PROCESSES ON THE MANAGEMENT OF BRIDGES
Authors: JAMALI Amin , ADEY Bryan T.
Published: October 2015

It is necessary to execute interventions on bridges to ensure that they continue to provide an adequate level of service. It is necessary to inspect them to ensure that these interventions are timed appropriately. As there are negative impacts associated with both inspections and interventions, e.g. the impact on the owner due to the hours of labor and amounts of materials required to perform an inspection and execute an intervention, it is desirable to determine inspection and intervention strategies that minimize these negative impacts (i.e. the optimal management strategy). An important, however often overlooked, factor in determining optimal management strategies, is how management processes affect the determination of the optimal management strategy. In this article it is shown that it is not always possible to determine an optimal management strategy without explicitly taking into consideration management processes, how variations in management processes can be evaluated and that the significance of these variations is dependent on the values of the incurred impacts.
La constitution du lien social à l’adolescence
Authors: Grollier Michel
Published: October 2015

L’article se propose de reprendre les éléments théoriques tirés de l’enseignement de Freud et de Lacan pour définir comment se monte le lien social au moment de l’adolescence. Il passe par un double circuit, celui concernant l’être subjectif ou singulier lui-même et l’être social pris dans le discours ambiant créé par la société. La disparition ou l’affaissement de la figure paternelle et de la religion entraîne des modifications dans la construction du lien social qui passera par l’Internet, les jeux en ligne, l’usage du portable permettant la communication entre jeunes. Deux courtes vignettes illustrent certaines difficultés récentes à s’ancrer dans la vie de la cité.
Tenter la mort pour vivre et ne pas sombrer
Authors: Meyer Françoise L.
Published: October 2015

La réflexion s’appuie sur une clinique pratiquée en qualité de psychanalyste, dans une fonction de psychologue clinicienne au sein du cadre institutionnel d’un secteur de pédopsychiatrie de la Seine-Saint-Denis. Elle concerne certaines conduites à risque ou des pensées mortifères qui paraissent courantes au moment de l’adolescence. La position repérable de la demande de soin par le parent, en général la mère, souligne le caractère plus ou moins archaïque du symptôme. Celui-ci peut aussi prendre la forme d’un immobilisme physique, le passage à l’acte étant le mode d’expression typique de l’adolescent.
Dans les Maisons des adolescents, mixité et ouverture se dosent
Authors: Bronsard Guillaume , Bruneau Nathalie
Published: October 2015

Dans les Maisons des adolescents, mixité et ouverture sont partout présentes. De la volonté d’accueillir l’adolescent tel qu’il se présente, avec la pluralité et le polymorphisme des demandes ou des symptômes, aux réponses professionnelles internes nécessairement multiples ou dans le partenariat extérieur, jusqu’à leur gouvernance et leur mode de financement. Cette mixité et cette ouverture ne peuvent pour autant être décrétées, et considérées de fait et sans réserve comme favorables et utiles à la clinique. Outre le risque de s’installer dans un conformisme optimiste, mou et donc risqué face à l’adolescent, les trois catégories de réponses de ces institutions (l’accueil, la prise en charge et le partenariat) nécessitent des doses de mixité et d’ouverture très différentes, parfois quasi nulles. Mixité et ouverture doivent être régulées et contrôlées pour favoriser les actions thérapeutiques.
Mixité des Maisons des adolescents en Île-de-France
Authors: Benoit de Coignac Agathe , Cosseron Florent , Wiest Jeremie
Published: October 2015

L’article présente les originalités concernant le dispositif des treize mda d’Île-de-France. Notamment l’existence de Casado à Saint-Denis issu du secteur pédopsychiatrique, et Casita logé à l’intérieur même de l’hôpital Avicenne. Une question est posée, en conclusion, montrant les difficultés d’accueil des adolescents : « Comment soutenir la pratique de l’accueil du tout-venant , qui échappe aux protocoles convenus de la psychiatrie, sans nous laisser happer par l’idéologie actuelle à l’endroit de cette même psychiatrie : non plus une antipsychiatrie comme dans les années 1960-1970, mais la non-psychiatrie prônée par certaines idéologies actuelles, qui n’est que l’avatar du négationnisme politique général de ce début de siècle ? »
Entre liberté et contrainte… : une expérience singulière dans un hôpital de jour
Authors: Tourrès Dominique
Published: October 2015

Les adolescents reçus en hôpital de jour sont souvent contraints, du fait de l’exclusion des autres lieux sociaux, de venir à nous. Ils développent un mécanisme de défense prévalent qu’est le clivage. La ligne de clivage la plus utilisée est celle se trouvant entre le transfert institutionnel et le transfert singulier, se développant en psychothérapie et/ou en psychodrame psychanalytique individuel. Par le travail institutionnel, les mécanismes de clivage peuvent être réduits et grâce au psychodrame psychanalytique individuel et à la psychothérapie, les parties clivées peuvent être représentées. Les parties clivées, s’ignorant les unes les autres, permettent que se côtoient purs idéaux et destructivité. L’articulation du travail institutionnel, grâce à la circulation de la parole, permet une élaboration dans l’après-coup des parties clivées.
A New Wave of Innovation in Micro-Technology for Positioning, Navigation, and Timing (μPNT)
Authors: Shkel Andrei M.
Published: October 2015

Inertial Measurement Units (IMUs) have been the central elements of stand-alone navigation and flight control systems for a variety of platforms, including aircraft, missiles, and land and marine vehicles. Miniaturization of IMUs has always been desirable because smaller size and lower weight opens up opportunities to carry additional payload or fuel, and perhaps enable new applications. Current inertial systems, however, do not meet the performance, size, weight, and cost requirements associated with many emerging DoD applications, including those needed for personal navigation, unmanned air/underwater vehicles, and autonomous robotic platforms. This presentation will discuss the growing interest within the Microsystems Technology Office (MTO) of the Defense Advanced Research Projects Agency (DARPA) in the development of a miniature, self-sufficient navigation system that might be realized through deep integration of timing, inertial navigation units, and other non-inertial sensors. A new wave of innovation is underway bringing to life revolutionary ideas and technologies in micro-fabrication, packaging, ultra-low-power electronics, innovative algorithms, never-before-explored architectures, and exploitation of new integration paradigms.
A High Performance and Cost Effective Molded Array Package Substrate
Authors: Rogren Philip E. , Magni Pierangelo , Mazzola Maura , Shaw Mark , Graziosi Giovanni , Villa Claudio Maria
Published: October 2015

Ceramic engineer and manufacturing executive, Philip E. Rogren will explain why molded array packages such as QFNs promise significant cost advantages compared to competitive packaging techniques. He will also describe why there are significant limitations for array packaging techniques based on lead frames. Audiences will learn about the feature of lead frame based packages that is responsible for virtually all of these limitations: Every package terminal and die paddle is a portion of the continuous metal structure that is the lead frame. Every terminal and die paddle is connected to, and held in proper position by, otherwise useless metal projections extending out of the package site to supporting portions of the lead frame. This planer, unitary structure presents limitations in the design of packages, limiting lead counts to around 70 leads and impacting performance because of increased lead to lead parasitic. The structure also adds process steps and cost to the assembly operation. In this presentation Rogren will describe a novel MAP substrate that features print formed, discrete terminal structures and die paddles arrayed on a sacrificial steel substrate. This structure eliminates the disadvantages of the interconnected lead frame based technology. In addition, this manufacturing process substantially reduces the pollution-causing process steps and it eliminates non-recyclable waste.
The European 3D Technology Platform (e-CUBES)
Authors: Ramm Peter , Klumpp Armin , Weber Josef , Fritzsch Thomas , Taklo Maaike , Lietaer Nicolas , De Raedt Walter , Hilt Thierry , Couderc Pascal , Val Christian , Mathewson Alan , Razeeb Kafil M. , Stam Frank
Published: October 2015

The European 3D technology platform that has been established represents the ensemble of 3D integration technologies which were developed within the e-CUBES project [http://www.ecubes.org]. It became evident that the fabrication of e-CUBES with their need for high-level miniaturization can only be realized by system integration technologies which use the third dimension. The main objective is to provide 3D integration technologies which on the one hand increase the performance sufficiently and at the same time allow for low cost fabrication in order to achieve products with a large market potential.

The work was focussed on the requirements coming from application demonstrators. However, other requirements set by taking the visionary approach of developing strongly miniaturized micro/nano-systems were also a major task of the work.

Research and technological development was necessary in the following fields in order to achieve the objectives. Seven corresponding technologies were successfully developed building a European platform on 3D Integration. This is considered to be essential output of the e-CUBES project. These are in the 3D integration categoriesVertical System Integration (3D-SOC): Fraunhofer IZM-M's Through-Si Via (TSV) Technology (ICV-SLID) and SINTEF's Hollow Via & Gold Stud Bump Bonding (HoViGo),Chip Stacking (3D-WLP): IMEC / Fraunhofer IZM's Thin-Chip-Integration Technology (TCI/UTCS) and CEA-LETI's Via Belt Technology, and3D Assembly (3D-SIP): 3D-PLUS' High Performance Package-in-Package (HiPPiP) and Wireless Die-on-Die (WDoD) Technologies, as well as Tyndall's Submicron Wire Anisotropic Conductive Film Technology (SW-ACF).

Four optimized 3D integration technologies were successfully used in the development of three e-CUBES application demonstrators: Thin-Chip-Integration technology (TCI/UTCS) for Philips' Health & Fitness demonstrator, TSV technology ICV-SLID and HoViGo for Infineon's Automotive demonstrator (TPMS) and Package-in-Package technology HiPPiP for Thales' Aeronautic demonstrator.

The 3D integration technologies which form part of the established e-CUBES platform will be presented including key characteristics, critical dimensions, electrical parameters and adaptability to new applications.
Next Generation System in a Package Manufacturing by Embedded Chip Technologies
Authors: Boettcher Lars , Ostmann A. , Manessis D. , Karaszkiewicz S. , Reichl H.
Published: October 2015

The embedding of active and passive components offers a wide range of benefits and potentials. With the use of laminate based technology concepts, components can be moved from surface mount into the build-up layers of substrates by embedding and by that, the third dimension will be available for further layers or assemblies.

This paper will briefly discuss the necessary process steps of the embedded chip technology and more importantly it will focus on new efforts to actually use chip embedding concepts for the realization of standard-type industrial Quad Flat Packages with embedded chips (embedded chip QFN). Chips of 50 μm thickness, a pad pitch of 100 μm and pad size of 85 μm are die bonded to a copper substrate and subsequently embedded in RCC (Resin-Coated-Copper) layers by using vacuum lamination.

The resulting QFN packages are only 160 μm thick and provide standard pads at 400 μm pitch and a total number of 84 I/Os with dimensions of 10x10 mm2. All embedded chip QFN packages at prototype level are manufactured in 250x300 mm2 panels.

The present work will include QFN package reliability results after extensive testing of thermal cycling, temperature humidity, high temperature storage and pressure cooker test.

The investigation of new embedding material combinations is one task to provide a reliable package. The main focus here is on new materials that offer improved package stability and also the ability to embed dies of different thickness. Together with material suppliers improved resin formulations as well as the introduction of filler and glass fibers into the resin layers is currently realized and tested.

In order to realize a further miniaturization ultra fine pitch (UFP) and fine line (UFL) approaches will be presented. For a UFP approach the goal is to develop the laser via technology further towards their limits as well as the investigation of new concepts.

UFP requires the use of a semi additive patterning process. Here LDI processing is being used for all new generation chip embedded packages due to its potential for very fine copper patterning. Results on very fine L/S of 15–20μm will be shown based on the semi-additive processes on an ultra thin initial 1–2μm copper foil.

Finally different applications will be presented. In an industrial cooperation different power package developments are ongoing. Here single and multi chips modules are realized as well as multiple routing layers. The combination of power and logic is one of the main challenges here, due to the need of thick copper layers for the power part and the more fine pitch demands for the controller chips. Process developments and results will be discussed in detail.
Effect on Reliability of Bending Flexible Circuits
Authors: Dzarnoski John , Sun Kexia
Published: October 2015

There has been enormous worldwide effort to increase the volumetric efficiency of electronic packaging. Much of this effort has been driven by the telecommunications industry that has succeeded in reducing cell phone size while simultaneously increasing functionality. The hearing aid business has always had the need to use extremely small electronic packaging because hearing aids pack electronics into the ear canal. In recent years hearing aid microelectronic packaging has moved from ceramic hybrid based packaging to a flexible circuit based technology. Due to the size and shape of all types of hearing aids, flexible circuits need to be folding and bent to fit inside hearing aid cases. In order to reduce space, bends and folds are pushing conventional wisdom on the limits of mechanical integrity.

There is little published information regarding bendability of multilayer flexible circuits for class I medical device applications. This paper will examine bending and folding effects on a Polyimide/Adhesive/Copper/Polyimide/Copper/Adhesive/Polyimide structural stack-up on a test coupon and a HDI flexible circuit. A forming tool that controls every aspect of bend testing will be discussed. A variety of factors were investigated including bend angle, thickness of the circuit, bend radius, foil weight, copper materials, construction, and frequency of flexing. The circuit electrical resistance, microstructure and crack initiation were monitored during the process and will be examined. Failure mechanisms will be discussed as well as their impact on design.
Aerosol Jet® Printing of High Density, 3-D Interconnects for Multi-Chip Packaging
Authors: Renn Michael J. , King Bruce H. , O'Reilly Michael , Leal Jeff S. , Pangrle Suzette K.
Published: October 2015

Optomec's patented Aerosol Jet technology is a maskless, non-contact material deposition system used to enable 3-dimensional semiconductor packaging. This presentation highlights results of printing high density, 3-D interconnects on stacked die modules which incorporate video, communication and memory chips. Such packages are critical for meeting the increasing functional requirements of SmartPhones, personal entertainment, and other mobile devices. The Aerosol Jet system is used to deposit silver nanoparticle ink connections along the staircase sidewall of staggered multi-chip die stacks. High aspect ratio interconnects with 30-micron line width and greater than 10-micron line height are demonstrated at a pitch of 61-microns. After printing, the silver inks are cured at ~200°C for ~30 minutes, which gives interconnect resistances below one-Ohm (< 5 micron Ohm*cm). The stacks can include up to 8 die, with a total stack height below 1 mm. The printing system has a working distance of several mm which means that no Z-height adjustments are required for the interconnect printing. Multiplexed print nozzles are used to achieve production throughputs of greater than two interconnects per second per nozzle. Based on cost and functional advantages, the Aerosol Jet process is emerging as an effective alternative to traditional wire bond and through-silicon-via (TSV) technologies.
A Review of Wafer Coating Methods for 3D Packaging
Authors: Adamson Steven J. , Klocke James , De Sanctis Gareth
Published: October 2015

For many years, Front End of Line (FEOL) wafer fabrication, has used spin coating as the method of choice for photoresist application. Today, 3D packaging requires coatings applied to the non-active side of the wafer. Popular applications for back side coatings are, temporary adhesives to hold wafers to carriers during Through Silicon Via (TSV) fabrication, applying die / wafer bonding materials, and dielectric layers.

Spin coating of wafers can be used to apply a number of materials for backside coatings. Although this application method is quite fast, it has a number of drawbacks which include high material waste and its limitation to low viscosity materials. Wafer Backside Coating (WBC) adhesives applied prior to dicing poses some unique challenges due to their filler loadings, and therefore the formulations can be limited by the spinning process. Today, most companies using spin coating to apply WBC materials have to lower the viscosity of the fluid with solvents, which creates other problems.

Screen or stencil printing to apply WBC adhesives is a proven method and is currently in production at manufacturing sites. Screen printing gives good print uniformity, but requires a formulation that self-levels after printing. Stencil printing can be used with almost any formulation or filler loading, but is highly dependent on the tooling accuracy to maintain the coating thickness uniformity. Both methods are limited to coating thicknesses in the 25–100 micron range.

There exists a need for a wafer coating methodology that can overcome the aforementioned restrictions. The ability to apply materials of varying rheologies, with low material waste and yet provide high quality, uniform coatings is required.

This paper will review the current methods of applying WBC coatings. The authors will also present results from a newly developed spray coating process developed to process high viscosity fluids such as WBC coatings.
Characterization of Wafer Level Metal Thermo-Compression Bonding
Authors: Cakmak Erkan , Kim Bioh , Dragoi Viorel
Published: October 2015

The process of wafer-level bonding is being successfully used to form MEMS devices. Wafer level bonding may be realized by different methods such as thermo compression, transient liquid phase, anodic, glass frit, or polymer bonding. These methods have different requirements and the choice of wafer level bonding method is defined by the application type. Metal TCB has a wide variety of applications with materials of choice including Au, Cu and Al. 3D electrical connections are created by the use of Cu-Cu TCB; while CMOS MEMS devices may be realized by Al-Al TCB.

In this study the wafer level bonding process of Cu-Cu and Al-Al TCB are characterized. The effects and significance of various bonding process parameters and surface treatment methods are reported on the final bond interfaces integrity and strength. Analysis methods include SAM, SEM, AFM, and four point bending test.

Al-Al TCB samples were investigated on the interfacial adhesion energy and bond quality. IAE and bond quality were found to be positively correlated with bonding temperature. A bonding temperature of 500 °C or greater is necessary to obtain bond strengths of 8–10 J/m2. A positive relation between IAE and bonding temperature was observed for Cu-Cu TCB. IAE's of greater then 10 J/m2 were obtained on bonded samples that do not show a post bond residual seam on the bonding interface. An acid based pre treatment was shown to impact the surface properties of the initial metal surface hence affecting the IAE. Post bond annealing processes showed the most significant impact on the IAE of the Cu-Cu TCB system.

To obtain comparable IAE values the Al-Al TCB method requires a higher bonding temperature. However the Cu-Cu TCB is sensitive to the initial metal surface condition and requires surface treatment processes prior to bonding to obtain high quality bonding results.
Direct Cu Wet Seed on Barrier of TSV Wafer
Authors: Han Jianwen , Lin Xuan , Zhang Yun , Aby Joseph , Mourier Thierry
Published: October 2015

Through Silicon Vias (TSVs) promise to provide shorter interconnect length and higher electrical connection density with reduced signal delay and power consumption for both multichip interconnection and packaging. To achieve void free electrolytic TSV gapfill, continuous seed is critical. While the TSV dimension scales down and the aspect ratio increases, continuous Cu seed coverage is harder to achieve by conventional PVD process. Giving the conformal nature of electrochemical process, direct electrolytic Cu deposition on barrier is an alternative to enable continuous seed coverage.

The challenges for direct wet seed are: (1) the barrier layer, typically TiN and TaNx, is too resistive to achieve uniform thickness distribution by conventional copper plating processes. (2) the nucleation of copper on barrier oxides is difficult and the copper growth is dendritic.

Designed for direct seeding on barriers, a novel chemistry has been developed. This alkaline (pH 9~10) bath has been demonstrated with TSV wafers with different barriers including Ta, TaNx, Ti, TiN. The process has shown to provide high nucleation density (10Exp11~10Exp12 nuclei/cm2) and continuous seed coverage can be achieved between 10 and 25nm thickness on most barriers. The deposition takes place at very negative plating potential while the current efficiency is maintained at >90%. The strong polarization enables in-situ barrier oxide reduction for some barriers, and pretreatment becomes not necessary. Elimination of oxides along with high nucleation density significantly enhanced the bonding strength between copper and barriers. The wet seed on all barriers including Ta, TaNx, Ti, TiN has passed ASTM D3359 cross-cut tape test. Electrolytic TSV gapfill on the wet seed is demonstrated for patterned TiN barrier TSV wafer. Void-free fills are achieved for the features with dimensions between 20 and 200 microns.

In summary, the novel chemistry for direct copper wet seed deposition on barriers has been demonstrated to yield high nucleation density and uniform seed distribution with adequate adhesion, and the wet seed enables subsequent void free TSV gapfill.