bluuebunny/crossref_metadata_2025 huggingface dataset:
Three Long-period Transiting Giant Planets from TESS*
Authors: Brahm Rafael , Ulmer-Moll Solène , Hobson Melissa J. , Jordán Andrés , Henning Thomas , Trifonov Trifon , Jones Matías I. , Schlecker Martin , Espinoza Nestor , Rojas Felipe I. , Torres Pascal , Sarkis Paula , Tala Marcelo , Eberhardt Jan , Kossakowski Diana , Muñoz Diego J. , Hartman Joel D. , Boyle Gavin , Suc Vincent , Bouchy François , Deline Adrien , Chaverot Guillaume , Grieves Nolan , Lendl Monika , Suarez Olga , Guillot Tristan , Triaud Amaury H. M. J. , Crouzet Nicolas , Dransfield Georgina , Cloutier Ryan , Barkaoui Khalid , Schwarz Rick P. , Stockdale Chris , Harris Mallory , Mireles Ismael , Evans Phil , Mann Andrew W. , Ziegler Carl , Dragomir Diana , Villanueva Steven , Mordasini Christoph , Ricker George , Vanderspek Roland , Latham David W. , Seager Sara , Winn Joshua N. , Jenkins Jon M. , Vezie Michael , Youngblood Allison , Daylan Tansu , Collins Karen A. , Caldwell Douglas A. , Ciardi David R. , Palle Enric , Murgas Felipe
Published: May 2023

We report the discovery and orbital characterization of three new transiting warm giant planets. These systems were initially identified as presenting single-transit events in the light curves generated from the full-frame images of the Transiting Exoplanet Survey Satellite. Follow-up radial velocity measurements and additional light curves were used to determine the orbital periods and confirm the planetary nature of the candidates. The planets orbit slightly metal-rich late F- and early G-type stars. We find that TOI 4406b has a mass of M

P
= 0.30 ± 0.04 M
J, a radius of R

P
= 1.00 ± 0.02 R
J, and a low-eccentricity orbit (e = 0.15 ± 0.05) with a period of P = 30.08364 ±0.00005 days. TOI 2338b has a mass of M

P
= 5.98 ± 0.20 M
J, a radius of R

P
= 1.00 ± 0.01 R
J, and a highly eccentric orbit (e = 0.676 ± 0.002) with a period of P = 22.65398 ± 0.00002 days. Finally, TOI 2589b has a mass of M

P
= 3.50 ± 0.10 M
J, a radius of R

P
= 1.08 ± 0.03 R
J, and an eccentric orbit (e = 0.522 ± 0.006) with a period of P = 61.6277 ± 0.0002 days. TOI 4406b and TOI 2338b are enriched in metals compared to their host stars, while the structure of TOI 2589b is consistent with having similar metal enrichment to its host star.
Finite Element Study to Evaluate the Stress Around Mini-implant during Canine Retraction using Continuous and Interrupted Orthodontic Forces
Authors: Ghorab Hend , Ramadan Ahmed A. F. , Nadim Mohamed A. , Sharaf Tarek
Published: May 2023

Abstract:
Objectives: This work aimed to determine the stress distribution around a mini-implant during dynamic canine retraction utilizing continuous and intermittent orthodontic forces and a three-dimensional finite element model.
Materials and Methods: Establishing a three-dimensional finite element model of canine retraction. The model incorporates a mini-implant, alveolar bone, maxillary teeth, a closed coil spring, and an elastic chain. They were described as being homogeneous, isotropic, and linear elastic. Continuous and interrupted forces were approximated by a NiTi coil spring and an elastic chain, respectively. To retract the canine, a simulated orthodontic force of 1.5N, 2N, and 2.5N were loaded. ANSYS evaluated the value of the stress distribution around the mini-implant, canine, and bone interface (workbench 19).
Results indicated that there was no significant difference between the values of maximum stress around the miniscrew, canine, and bone under different orthodontic loads when a closed coil spring and an elastic chain were evaluated.
The Correlation of Glial Fibrillary Acid Protein Level to Cognitive Function Outcome in Acute Lacunar Ischemic Stroke Patient
Authors: Tugasworo Dodik , Agung Locoporta , Retnaningsih Retnaningsih , Husni Amin , Bintoro Aris Catur , Wati Arinta Puspita
Published: May 2023

ABSTRACT :
Introduction : Glial fibrillary acidic protein (GFAP) is a filamentous protein found in central nervous system astrocytes. Increased serum GFAP levels are caused by the process of astrogliosis after ischemic stroke and are associated with multisynaptic disorders so that they are at risk of causing cognitive disorders.
Objective: To analyze the correlation between GFAP levels and cognitive function output in acute lacunar ischemic stroke patients.
Research Methods : Analytical observational with prospective cohort approach. The subjects of this study were Acute lacunar ischemic stroke patients with mild to moderate NIHSS scores. Serum GFAP levels were taken at the onset of 48-72 hours of stroke. Cognitive function was measured using the Indonesian version of MoCA (MoCA Ina) test on the seventh and thirtieth day. Bivariate and multivariate analyzes were performed to assess the correlation between GFAP levels, cognitive functions and the confounding factors.
Results: There was a significant correlation between GFAP levels and the MoCA Ina scores on the seventh day (r= -0.32, p=0.044), the thirtieth day (r= -0.398, p=0.011), and improvement in MoCA Ina scores (r= -0.342, p = 0.031). There was a significant correlation between GFAP levels on the executive domain on the seventh day (p= 0.01) and thirtieth day (p= 0.005), visuospatial on seventh day (p= 0.004) and thirtieth day (p= 0.016), language on the thirtieth day (p = 0.005), and memory on thirtieth day (p= 0.001). There was no significant correlation between GFAP levels and improvements in attentional, memory, language, visuospatial, and executive domains.
Conclusion: There was a significant correlation between GFAP levels and MoCA Ina scores on the seventh, thirtieth day and the improvement of MoCA Ina scores. There was a significant correlation between GFAP levels with the executive, visuospatial, language, and memory domains.
Keywords: cognitive, GFAP, lacunar ischemic stroke, MoCA Ina
Fracture resistance of 3-unit monolithic ZrO2 ceramics FPDs with different preparation designs of the distal abutment - an in-vitro study
Authors: Hadzhigaev Viktor , Vlahova Angelina , Mitov Gergo , Zlatev Stefan
Published: May 2023

Introduction: Masticatory pressure increases in the distal areas of the dentition. This should be considered when restoring partially edentulous patients with a metal-free fixed partial denture (FPD). An alternative abutment preparation design can be used in order to increase the materials’ volume in the most fracture-prone “connector area” of an FPD. The increased size of the connection might positively influence the constructions’ mechanical durability, thereby increasing its success and survivability.

Aim: The aim of the present study was to investigate the influence of two preparation designs of the distal abutment on the fracture resistance of three-unit, monolithic, ZrO2 FPDs.

Materials and methods: 3D printed replicas of a partially edentulous mandibular segment and a ZrO2, milled in full-contour, three-unit FPDs were used for this investigation. Two experimental groups (n=10 ) were defined based on the preparation design of the distal abutment tooth – classical shoulder preparation 0.8 mm deep, and endocrown preparation with a 2-mm retention cavity. The bridge – mandibular segment replica assembly was done with relyXU200(3M ESPE, USA), light-cured for 10 seconds per side with D-light Duo (GC, Europe). After cementation the test specimens were subjected to loading in a universal testing machine Zwick (Zwick-Roell Group, Germany). Statistical analysis was performed using R and includes descriptive statistics, t-test for quantitative and chi-squared test for qualitative variables.

Results: The results showed no difference between the two studied groups in the maximum force required to fracture the test specimens [t=−1.8088 (17.39), p-value=0.087; P>0.05]. 95% of the fracture lines were located in the distal connector.

Conclusions: Within the limitations of this study, it can be concluded that both tested preparation designs show similar results in terms of the load required to fracture the test specimens. Furthermore, it is confirmed that the distal connector is the weakest area of an all-ceramic 3-unit FPD in the posterior area.
Social appearance anxiety and oral health-related quality of life in middle-aged adults with implant therapy
Authors: Kalyoncuoğlu Ülkü Tuğba , Samur Ergüven Sara
Published: May 2023

Introduction: The success of implant therapy is strongly related to the perceptions and expectations of the patients.

Aim: This study aimed to assess the level of social appearance anxiety and oral health-related quality of life in middle-aged adults with implant-supported fixed prostheses and compare with individuals who have tooth loss without any prosthetic rehabilitation or who have natural teeth.

Materials and methods: The participants (n=292) were divided into three groups: group 1, individuals with implant-supported fixed dental prostheses; group 2, individuals with tooth loss; and group 3, individuals with totally natural teeth. A questionnaire form including basic questions, Social Appearance Anxiety Scale (SAAS), and Oral Health Impact Profile-14 (OHIP-14) was distributed among patients.

Results: Group 2 showed a significantly higher level of SAAS and OHIP-14 scores compared with groups 1 and 3 (p<0.001). The SAAS scores were similar between groups 1 and 3, with no significant differences. The median OHIP-14 score was the lowest in group 3. For all groups, education was related to SAAS and OHIP-14 scores (p=0.037 and 0.002, respectively). The SAAS and OHIP-14 scores were significantly and positively related (p<0.001, r=0.501).

Conclusions: It was concluded that patients with tooth loss had higher levels of SAAS and OHIP-14 scores. Besides, the SAAS scores were similar for patients with implant-supported fixed prostheses and those with natural teeth. Middle-aged adults with higher educational levels tended to present better oral health-related quality of life and lower social appearance anxiety.
Evidence for metapopulation structure in seep-dwelling amphipods
Authors: Culver David C. , Feller Daniel J. , Burch Elizabeth
Published: May 2023

Twelve seepage springs in a 3 km2 area of the Goldmine Tract in the C&O Canal National Historical Park in Montgomery County, Maryland, USA were sampled in 1994–1995 and again in 2023 for three amphipod species: Stygobromus tenuis potomacus, Stygobromus pizzinii, and Crangonyx shoemakeri. During that time interval, there were 11 colonizations and 1 exinction. Three populations persisted. These results are consistent with the proposed metapopulation hypothesis of population structure.
L’adolescent : un temps d’« enfouissement »…
Authors: Bidaud Éric
Published: May 2023

Cet article propose de montrer les enjeux de l’adolescent qui se confine et fabrique avec méthode un lieu de réclusion volontaire, jusqu’à offrir la figure d’un enfouissement au limite de l’angoisse d’un en-terrement , le lieu d’une ascèse. Ce que ce texte tente de suivre ici est moins la description d’une courbe ascétique : les privations, l’isolement et les attaques du corps, que là où ça se passe, le lieu de l’ascèse, là où la maison familiale se défait, recouverte par un nouvel espace.
Entre le silence épidémique et le bruit des bulldozers. Le choléra au temps de l’Émergence économique en Côte d’Ivoire
Authors: Heyerdahl Leonardo W.
Published: May 2023

Lorsqu’en 2014 les premiers cas de choléra apparaissent dans un quartier de pêche d’Abidjan habité principalement par des étrangers, le système de surveillance et de notification épidémiologique se grippe. Cet article retrace l’histoire du silence épidémique, décrit sa pratique institutionnelle et son rôle dans la Côte d’Ivoire post-conflit. Loin d’être total, le silence épidémique est orienté. Il alterne avec des discours locaux qui visent à contester la légitimité de la présence des groupes affectés par la maladie. Cette économie de la parole entretient la reproduction du risque épidémique et sert un mouvement plus large de délogement des cadets sociaux du cœur d’Abidjan et de l’Émergence économique promise.
The Urgent Need for Authentic Leadership and Allyship in Health Care
Authors: Ducar Dallas
Published: May 2023

Authentic leadership is a core competency to creating a healing environment where all voices can be seen, heard, and affirmed. There is an unprecedented attack on LGBTQ+ individuals across state legislatures and executive branches, taking aim at identity and going so far as to make gender-affirming care a felony. Nurses are taught to be advocates and the most trusted profession in the United States and therefore are in a vital place to lend their voice, act, advocate, and educate

. [
J Contin Educ Nurs.
2023;54(5):201–203.]
New developments in fractional integral inequalities via convexity with applications
Authors: Karim Maimoona , Fahmi Aliya , Qaisar Shahid , Ullah Zafar , Qayyum Ather
Published: May 2023

The main objective of this article is to build up a new integral equality related to Riemann Liouville fractional (RLF) operator. Based on this integral equality, we show numerous new inequalities for differentiable convex as well as concave functions which are similar to celebrated Hermite-Hadamard and Simpson's integral inequalities. The present outcomes of this paper are a unification and generalization of the comparable results in the literature on Hermite-Hadamard and Simpson's integral inequalities. Furthermore as applications in numerical analysis, we find some means, q-digamma function and modified Bessel function type inequalities.
Energía y bienestar: una breve historia desde la perspectiva de los límites medioambientales
Authors: Brand-Correa Lina I.
Published: May 2023

Energía: vital y fatal. Vital pues cierta cantidad de energía se ha convertido en un aspecto indispensable para las sociedades y personas modernas. Fatal pues los sistemas energéticos han generado la mayor parte de las emisiones de gases efecto invernadero desde por lo menos la segunda mitad del siglo veinte. Por lo tanto, es indispensable analizar las cuestiones de energía desde el punto de vista de su uso buscando responder preguntas como ¿cuánta energía se requiere para mantener o mejorar niveles de bienestar humano?, ¿qué países han logrado alcanzar niveles altos de bienestar con niveles relativamente bajos de uso de la energía y cómo lo han logrado?, ¿qué impacto tiene nuestra comprensión del bienestar humano en cómo reflexionamos sobre la relación entre energía y bienestar? Este artículo tiene como objetivo presentar la historia del estudio de las relaciones energía-bienestar imperativa en la lucha por mitigar el cambio climático, desde una perspectiva de límites medioambientales.
Contribución al conocimiento de la subfamilia Polistinae (Hymenoptera: Vespidae) en la Reserva de la Biosfera del Manu, Madre de Dios, Perú
Authors: Amaru-Castelo Javier , Marquina-Montesinos Edgar , Bautista-Challco Benita , Quispe-Saenz Criss , Herrera-Huayhua Carolina Milagros , Colan-Rodríguez Renato
Published: May 2023

La subfamilia Polistinae (Hymenoptera: Vespidae) es un grupo común de la fauna neotropical, caracterizados en su mayoría por su comportamiento social. En Manu Learning Centre, dentro de la Reserva de Biosfera del Manu, se han colectado dichos organismos empleando trampas Malaise, de caída y bandejas amarillas durante los meses de mayo a diciembre del 2021. Se encontraron diecisiete especies de la subfamilia Polistinae, de las cuales catorce se reportan por primera vez para el departamento de Madre de Dios (Perú). El género mejor representado es Polybia Lepeletier, 1836, con 7 especies.
Mixed reaction gold as versatile plating solution for ENIG, ENEPIG and EPAG plating
Authors: Schafsteller Britta , Rosin Mario , Schlosser Timo , Ramos Gustavo
Published: May 2023

The surface finish on a printed circuit board (PCB) or substrate serves as surface protection and at the same time enables a variety of assembly techniques. Depending on which final finish is selected it allows for e.g. soldering connections or wire bonding by Al, Au or even Cu-wires. Surface finishes are typically characterized by different metal layers, including tin, nickel, palladium or gold. In this context the electroless or immersion plating of gold has a long history in the electronics industry. The gold plating represents a key step in different finish systems such as electroless nickel/immersion gold (ENIG), electroless nickel/electroless palladium/immersion gold (ENEPIG) and electroless palladium/autocatalytic gold (EPAG). ENIG, ENEPIG and EPAG finishes are characterized by their capabilities to be used as solderable and wire-bondable finish with specific benefits for ENEPIG and EPAG such as enhanced solder joint reliability and gold-wire bondability.

In this paper an overview is given on the different types of electroless gold plating electrolytes from fully immersion type and autocatalytic type to mixed reaction type gold electrolytes. The details of the various plating mechanisms are presented, and the different properties and capabilities of these electrolytes are compared and explained based on the respective mechanisms.

The presented study investigates the performance of a gold electrolyte of a mixed reaction type looking into the layer properties as well as the soldering and bonding capabilities. The results show that a mixed reaction gold electrolyte can be capable for versatile application- ENIG, ENEPIG and EPAG. The capability of the process was tested with respect to the solder wetting performance, solder joint reliability, wire bonding performance, corrosive attack to the nickel and thickness distribution. It can be shown that this gold process passes or exceeds all related industry standards and target requirements for ENIG, ENEPIG and EPAG final finishes.
Innovations in Soldering Materials and Optimization of Solder Paste Printing and Inspection Parameters for System-in-Package Assembly
Authors: Griffith Evan , Rowland Casey , Sbiroli David , Sjoberg Jonas
Published: May 2023

System-in-Package (SiP) assembly has become a popular solution for the challenges of continued

miniaturization in the semiconductor industry. The continued and expected growth of the semiconductor

industry in the coming years is driving more advanced assembly methods within System-in-Package and

advanced packaging in general, and more advanced semiconductor assembly materials are required to meet

those challenges such as solder paste specifically designed for SiP assembly, with fine solder powder and

specifically formulated flux vehicles.

Fine feature solder paste printing as an assembly method continues to be a challenge for SiP assembly.

Small stencil aperture designs have necessitated fine-powder solder pastes, with type 5, type 6, and type 7

being common, as well as there being a need for type 8 for future, more advanced designs. Additionally, as

more components are being packed into a SiP, solder paste rheology becomes an important characteristic to

consider. Printing transfer efficiency, stencil life, and resistance to slump, are other important paste

attributes to consider when evaluating solder paste for SiP assembly. While material properties are

important to consider, proper equipment setup for a certain paste formulation is also necessary to maximize

throughput and minimize assembly defects. The effects of solder paste printer parameters on fine-feature

printing performance will be discussed, such as print speed, separation speed, separation distance, and

stencil material.

This paper will first focus on common failure modes in SiP assembly, and the technology advancements in

both solder paste formulation and substrate design which help eliminate those failure modes. Then, this

paper will discuss how proper stencil printer setup can reduce assembly defects, and will highlight designs-of-experiment outlining which stencil printer parameters are statistically significant in improving process

yields of SiP assemblies with fine powder solder pastes, both with respect to pre-reflow inspection and

post-reflow component placement. This paper will also discuss the importance of solder paste inspection

with respect to assembly defects, and will highlight important parameters to optimize to accurately inspect

solder paste deposits below 90 microns.
Direct-Write Printed Wearable Metasurfaces
Authors: Kajenski Adria , Strack Guinevere , Khushrushahi Shahriar , Akyurtlu Alkim
Published: May 2023

Direct-write printing was utilized in fabricating a wearable metasurface for frequency filtering at 6 GHz.

Using radio frequency (RF) performance and sheet resistance, Rs as performance metrics, the printed

metasurfaces were subjected to wash cycle and longevity testing. The metasurface was printed on two

woven nylon industrial fabrics (70D (EX) and 200D (BW) thread masses) featuring a polyurethane (PU)

coating on one side. Two conductive inks, CM127-48 (Creative Materials) and PE876 (Dupont) were

printed on the fabrics and tested for Rs

, RF performance, wash cycle stability, and longevity. Rs values for

CM127-48 on EX and BW were similar (0.083±0.013 and 0.088±0.031 ohm/sq, respectively), while PE876

had higher Rs

, on BW than EX (0.080±0.015 and 0.35±0.06 ohm/s). RF performance revealed that S21

magnitudes were at least −30 dB for all four ink–fabric combinations, in agreement with simulations. Wash

cycle testing of PE876 on EX and BW revealed a comparable decrease in S21 magnitude for both fabrics.

However, BW samples exhibited minimal shifts in peak frequency. Longevity tests on the four ink–fabric

combinations demonstrated that S21 magnitudes were at least −29.5 dB, with the smallest change in

magnitude for the CM127-48–EX sample. Materials selection may be tailored for various design goals in

wearable electronics.
A Novel Analytical Method of Thallium Determination in Gold Electrodeposition
Authors: Saitta Patrick , Wang Jingjing , Shalyt Eugene
Published: May 2023

Thallium is used in both cyanide and sulfite-based gold plating bath solutions as an additive that modulates

how gold deposits on the target substrate. The level of Tl in the plating solutions has a large effect on the

properties of the gold being deposited, including its microstructure and hardness. Thus, especially in

commercial process applications, it is critical to be able to measure the Tl content of plating solutions

accurately, quickly, and facilely in order to ensure proper quality of the products being manufactured. The

cyclic voltametric behavior of Tl-containing gold plating bath solutions has been investigated, but

quantification of its Tl content is unsatisfactory, either expensive and time consuming, or not accurate in

complexed matrices. Here, we present a proprietary, electroanalytical method of Tl measurement that is fast

and gives excellent accuracy and sensitivity, even in the presence of common bath breakdown products.
State-of-the-Art and Outlooks for 2.3D IC Integration
Authors: Lau John H
Published: May 2023

The state-of-the-art and outlooks for 2.3D IC integration will be investigated in this study. Emphasis is placed

on the design, materials, process, advantages and disadvantages, challenges (opportunities), and examples of

2.3D IC integration for chiplet design and heterogeneous integration packaging. Also, some

recommendations of 2.3D IC integration will be presented.
A Hybrid Pressure-less Silver Sintering Technology for High-power Density Electronics
Authors: Zhao Yuan , Tolla Bruno , Katze Doug , Castaneda Glenda , Wood John , Wilson Jo-Anne , Brand David
Published: May 2023

Integration of smaller, higher-functioning devices and use of advanced high thermal chip structures present

thermal management challenges in the aerospace sector where reliability is the top priority and fail-safe

processes/materials are the standard. As power density increases rapidly, traditional die attaching technology

is becoming an increasingly limiting factor in microelectronics packaging for the next generation aerospace

and defense systems.

This paper introduces an advanced hybrid silver sintering technology, which incorporates ultra-high thermal

and electrical performance of silver sintering with high reliability and process friendly of epoxy-based die

attach technology. Unlike traditional silver sintering that requires high temperature and pressure, this hybrid

sintering paste can be processed without applying any pressures in temperature ranges that are normal in

microelectronics packaging processes. This paper presents results of an application study aimed at developing

this unique technology in the field of high-power density devices for aerospace applications.
An Organic Package Designer’s Guide to Transitioning to FOWLP and 2.5D Design
Authors: Acito Bill
Published: May 2023

Many package designers have many years of hands-on experience designing organic FR4/HDI build-up

BGA/LGA substrates. We’ve memorized the design guidelines and the substrate fabrication is well

understood. We know how to wield our design tools like precision scalpels to get the design completed on-time, on-specification and on budget. Whether it’s flipchip attach, wire bond or a stacked die combo the

design methodology is well understood.

Then management mentions that the next generation of designs are going to be “heterogeneously

integrated”, utilizing new integration platforms such as RDL-based fan-out wafer level and/or interposers.

Suddenly, people start mentioning things like “Assembly Design Kits”, “Stream-out”, “sign-off using

PDK’s”, multi-pass degassing, seal rings, assembly LVS and HBM stack routing. The suggestion is made

that new design tools might be needed – semiconductor P&R tools that only work on Linux and are all

TCL/TK script driven. We start doing some research online and attend a conference or two and listen to

some of the EDA tool vendors and you could easily arrive at a point where you start to think, “Am I

obsolete? Do I really need to learn to use silicon P&R tools? What is “assembly LVS”, multiple-pass

degassing and why do my metal planes need to be hatched and offset?”

For many of us, the shift in technology can be overwhelming. Do not despair; yes, there is new

terminology to understand and many new design techniques to be understood and mastered, as well as a

completely new design process and flow. The good news is that this can all be overcome without having to

learn silicon P&R design tools. This paper will discuss real-world experiences of organic package substrate

designers who have transitioned and mastered RDL-based FOWLP and 2.5D silicon and organic interposer

design, while still using (and preserving) the majority of their existing packaged design tools and skills.
A Novel Lead-Free Low-Temperature Solder Paste for Wafer-Level Package Application
Authors: Zhang Hongwen , Richmond Tyler , Harter Tybarius , Prado Diego , Geng Jie , Wang Huaguang
Published: May 2023

An In-containing low-temperature solder paste (DFLT) has been developed and successfully used in mobile

phone board-stacking application. It is now being tried for main-board application, targeting at using lower-temperature reflow profiles but delivering at least the comparable reliability to the mainstream SAC305. The

customized drop-shock packages and the daisy-chained WLP256 assemblies were reflowed under a variety

of reflow profiles, in which peak temperatures ranged from 200o

C up to 240o

C. SAC305 has been used as

the control leg reflowed under a traditional 240o

C peak temperature lead-free reflow profile. The joint

morphology changed with the reflow profiles. Under the 200o

C peak reflow, hybrid joints were formed in

which the mixing zone, dominated by DFLT, was present at the PCB side while the SAC305 ball at the chip

side maintained the original morphology. Increasing the reflow peak temperature led to the fully-merged

SAC305 ball with DFLT and, finally the formation of the homogeneous joint. Based on the reflow profile,

DFLT has shown the drop-shock performance (g-force>6000g) comparable to or substantially better than

SAC305, in which 220o

C peak reflow allows DFLT having the drop-shock performance more than 90%

better than SAC305. Temperature cycling test (TCT) has been done with the profile of -40 to 125o

C and 20

minutes dwelling time. Similar to drop-shock, depending on the reflow profiles DFLT has the TCT

performance outperforming SAC305. Reflow under a peak temperature of 210o

C results in best TCT

performance among all profiles. Although the reflow profiles impacts the performance ranking, the failure

modes remain the similar for all the assemblies in drop-shock and TCT, respectively.
Modeling the effect of bend radius on the performance of a conformal dual-band mm-wave patch antenna array
Authors: Umar Ashraf , Abdelatty Mohamed Y. , Obeidat Abdullah , Enakerakpo Emuobosan , Alhendi Mohammed , Poliks Mark. D.
Published: May 2023

There is growing interest in the use of additive manufacturing for the fabrication of RF devices due to fast prototyping capabilities

and the use of less material as opposed to traditional fabrication techniques. In addition to the previously mentioned advantages,

the aerosol jet printing method in particular allows for the conformal printing of RF components. This work models the effect of

the bend radius on the return loss and radiation pattern of a dual-band (28 GHz and 39 GHz) mm wave patch antenna array design

that will be aerosol jet printed. The antenna is modeled on a 5-mil thick flexible substrate (PET) and the simulation is run from 27

GHz to 40 GHz using HFSS. The return loss and radiation pattern results of the antenna are compared for various bend radii (0.25

in to 2 in) of the conformal surface the antenna is to be printed upon. Simulation results show a maximum frequency deviation of

about 400 MHz on the return loss for the low (28 GHz) frequency band of the antenna when it is bent from a bend radius of 0 in to

2 in.
Development of all new structure of Dicing Die Attach Film (DDAF) for Stealth Dicing and Cool Expansion processes
Authors: Iwaya Wataru , Sato Yosuke , Sakamoto Misaki , Yamagishi Masanori , Saiki Naoya
Published: May 2023

Mobile devices, including smart phones and tablets, are increasing in complexity and require ever greater

amounts of memory storage. In the past the challenge of higher memory densities and increase functionality

has been met through miniaturization of device features, but as we reach the physical limits of feature size,

packaging is being relied on more and more to achieve the necessary higher densities in memory and

additional device functionality. Thin dies reduce overall package height, however, to achieve high memory

densities in low profile packages the die attach material must have an even, thin bond line thickness. DAF

(Die Attach Film) is an excellent solution. LINTEC developed an all new DDAF (Dicing Die Attach Film)

with thinner DAF for CE (Cool Expansion) process. Conventional tape has a large area of exposed DAF

surface which creates the risk of wafer and / or equipment contamination if DAF flies off during the CE

process. We developed an all-new tape structure which is compatible with the SD (Stealth Dicing) and CE

processes. The structure consists of DAF, IB (Intermediate Basefilm), and dicing tape. The diameter of the

DAF and IB is close to the wafer diameter size to significantly reduce the risk of DAF separation and ejection

during CE. We considered IB to improve DAF separation and it was found that a thinner IB layer is a good

approach to separate DAF effectively. We can adjust adhesion between the DAF and the IB by changing the

material properties of the IB, as an effective means to control die-fly and pick-up.
Microstructural Characterization of Sn57Bi1Ag Solder Alloy Joints
Authors: Murali Sarangapani , Evonne Lim Yee Weon , Wan Lo Miew , Danila Bayaras Abito , Keong Loke Chee , Ting Lo Yee , Kumar Balasubramanian Senthil , Sungsig SS Kang
Published: May 2023

Sn57Bi1Ag alloy system meets the basic solderability requirements while reliability of solder is less known.

The presence of intermetallics that form at the solder-joint interface and in the bulk solder is the primary

reason to cause joint failure on simple loading. Furthermore, dissolution of soldered surface (copper, gold,

silver, nickel, etc.) into the solder during reflow alters the composition of the interface leading to the

formation of intermetallic phases.

The present paper addresses the characterization of low temperature Sn57Bi1Ag solder alloy, its joint

interface metallurgy and integrity. Generally, formation of intermetallic phases (Cu3Sn, Cu6Sn5, Ag3Sn,

AuSn2, Ni3Sn4, etc.) at the solder-pad interface is in the range of 0.3 to 1.0µm. On thermal ageing at 75°C

(0.55Tm), the intermetallic phases grow further up to 2.3µm, particularly CuSn and AuSn phases. In addition,

to distributed eutectic tin (Sn) and bismuth (Bi) phases, fine eutectic tin and bismuth phases and primary tin

(β-Sn) are also observed. Coarsening of Bi and Sn phases is noticed on thermal ageing (75°C and 100°C).

The rate of coarsening increases with the supply of thermal energy promoting Sn/Bi atomic diffusion and

movement of eutectic boundaries (grain boundaries). However, the Sn-Bi interface is stable without any

significant changes in eutectic structures and its morphologies. The mechanical drop test of the Sn57Bi1Ag

solder joint passed 120 drops, characteristic life corresponds to the number of drops for a failure of 63.2%.

Evaluated as per JESD22-B111 specification to a maximum peak acceleration of 1500G and half-sine shock

pulse duration of 0.5 milliseconds, soldered the alloy to copper OSP surface. The solder joint also passed

1200cycles evaluated at -40 to +125°C. Electrical connectivity of the solder joints soldered to ENIG plated

test boards is recorded continuously. Crystallographic orientation of Sn and Bi second phases is observed

using electron back scattered diffraction (EBSD) of thermal aged solder joints and are also presented in this

paper.
A New Look at Silicon Carbide
Authors: Muscolino Frank
Published: May 2023

Silicon Carbide, SiC is one of the most widely used materials that plays a critical role in industries such as:

aerospace, electronics, industrial furnaces and wear-resistant mechanical parts among others. Although SiC

is widely used in electronics and other high technology applications, the metallurgical, abrasive, and

refractory industries are dominate by volume.

It is only in the last five or six years that SiC has gained a new and important role in the semiconductor

industry. SiC has become a key material in the drive towards electrification. It’s unique physical

properties, wide band gap, especially, high temperature performance and “ease of manufacturability makes

it a key material going forward.

The physical properties that make SiC so unique also represent some serious problems to large scale

manufacturing of SiC diodes, transistors and modules. SiC is a very tough material, it has a Mohs hardness

rating of 9.5 approaching that of diamond.

Just as the semiconductor industry needed high quality defect free silicon wafers to move forward, so did

the SiC industry. High quality defect free wafers have just come into the market. They are 4 and six wafers

that will allow SiC. These boules can be “sliced” in wafers and run on a standard CMOS fabrication

process. Next comes the dicing of the wafers into devices. A diamond saw has to be run at a very slow rate

to a material almost as hard as the diamond itself. Die attach brings an interesting problem the devices are

generally rate at 200+ deg C and voltages >1000W. Standard epoxy and even Au/Si eutectic die attach has

issues has issues at these extreme operating conditions. Lastly, the epoxy molding compound has to be

capable of withstanding the harsh conditions and not breakdown.

These are all challenges that are being met today. This is a continuing story of how the semiconductor

industry adapts to ever changing requirements
Novel Temporary Bonding Film Adapted to Xenon Flash Lamp De-bonding System for FOWLP Application
Authors: Matsubara Hiroaki , Shibata Tomoaki , Akasu Yuta , Ogawa Saeko , Kuroda Ayaka , Sobue Shogo
Published: May 2023

Temporary bonding film (TBF) is one of the key materials for assembly process of fan out wafer level

package (FOWLP). In this paper, we have proposed a novel TBF and xenon flash lamp de-bonding system.

The TBF was mainly composed of cross-linkable and low-polarity polymers to meet the various requirement

for not only easy peeling-off after assembly but also stability against thermal and chemical environment

exposed in FOWLP process. In order to evaluate applicability of the developed material, die-first/face up test

wafer was assembled. As a result, it was found that the TBF has high stability and can be de-bonded by xenon

light irradiation. In addition, the die shift through assembly process was within the estimated range. These

results offer that the developed TBF is practically applicable for FOWLP assembly process.
Protected Wafer Level Chip Scale Packaging (P-WLCSP)
Authors: Hackler Doug , Prack PhD Ed
Published: May 2023

With the advent of bumped die, new IC packages evolved: for low IO WLCSP (wafer level chip scale

package), for high IO FC (flip chip), CBGA (ceramic ball grid array), and PBGA (plastic ball grid array).

For low IO, protected CSP is an emerging and rapidly growing market. In 2020 the market exceeded $2B and is ramping to a forecast $2.5B by 2025.1 Initially WLCSP, also known as FI (fan in), was built on the

wafer with no active side protection, evolving to single sided protection from a package built on the wafer3

,

which transitioned to redistribution PSB (passivation stress buffer)4

. PSBs were implemented in FC wafers

for high IO BGA packages. These provided acceptable performance initially, however as devices became

more complex and reliability requirements increased, these processes no longer provided the required

reliability. To attain higher IO capability and better reliability, performance evolved to CSP5

(non-WL)

which allowed larger area for bump distribution and additional protection to the rest of the exposed die

surfaces. An example of fully protected die CSP (without substrates or leadframes) encapsulated in mold

compound is M-series utilizing a FO (fan out) processes and eWLB.6,7 To obtain higher reliability 6-sided

die protection afforded by FO processes require die reconstitution, expensive tapes, molding, and other

operations which can feasibly be eliminated in a WLCSP protected FI process assuming full encapsulation

can be attained on the original device wafer. American Semiconductor’s Semiconductor-on-Polymer (SoP)

300mm SoP-TM, a P-WLCSP process, is an advanced packaging process optimized for protected fan-in.

SoP-TM produces the thinnest and lowest cost fully protected FI. Protected FI process innovations can

improve performance in power devices, RF switches, die stacking and thin board applications. This paper

includes background on the evolution of CSP, comparison of SOTA (state of the art) FI processes including

SoP-TM and builds on low-cost wafer level adaptive process works and reliability data presented on the new

SoP-TM process earlier this year.8,9 First article electrical reliability test data for P-WLCSP, adaptive

processing of micro-bump pads, and potential applications in hybrid modules will be shown.
Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance Reliability
Authors: Salunke Ashish , Alptekin John , Akula Kaushik , Jayakumar Subiksha , Kumar Shaurya , Chyan Oliver
Published: May 2023

Copper (Cu) is the metal of choice for the redistribution layer (RDL) to facilitate fast I/O communication in

an integrated circuit (IC). Cu can electrochemically migrate (ECM) between the array of electrodes under

bias, electrolyte, and moisture. IC packages fail miserably when exposed to various ion impurities and

moisture. Copper at the anode dissolves to form Cu+1, +2 ions. As the anodic dissolution continues, the

concentration of copper ion increases. These anions deposit on cathode leading to Cu dendrite formation. To

achieve the near zero ppb defectivity goal, elimination of (ECM) defects in packaged devices is critical. This

work discusses development of a novel Cu-selective passivation and a method to accelerate reliability testing.

A hydrophobic passivation with minimum stress to the IC package is proposed in this work. The new

passivation coating is thermally stable, strongly adheres to Cu, corrosion resistant, low cost and shows good

potential to prevent ECM defects. The coated packaged devices were tested by an accelerated PEG drop test

(PDT) to explore its ECM prevention capabilities.
Electroplated Aluminum Pillars for Ultrasonic Flip Chip Bonding
Authors: Braun S. , Cirulis I. , Liedtke J.E. , Hiller K. , Wiemer M. , Kuhn H.
Published: May 2023

Flip chip bonding is a widely used method in 3D integration. In this study, the use of electroplated Aluminum

as pillar structure for ultrasonic flip chip bonding is demonstrated for the first time. Al pillars were deposited

from a chloroaluminate ionic liquid on a 6 inch silicon wafer. The influences of ultrasonic bonding parameters

(bonding time, ultrasonic power and bonding force) were investigated at room temperature. Al pillar bonding

was performed successfully in less than 1 s. High bonding forces are recommended as more pillars get

mechanical contact to the substrate, thus, ultrasonic energy can be transferred to the interface causing

bonding.
Wine: looking ahead
Authors: Bordiga Matteo
Published: May 2023

Not available.
Effects of malolactic fermentation on colour stability and phenolic composition of Petit Verdot red wines
Authors: Izquierdo-Cañas Pedro Miguel , García-Romero Esteban , Mena-Morales Adela , Gómez-Alonso Sergio
Published: May 2023

In the present work we evaluate the effects of malolactic fermentation (MLF) on the colour parameters and polyphenolic composition of Petit Verdot red wines. MLF caused a significant decrease in colour intensity in wines, approximately 9%. In line with that, the results showed a decrease in the concentration of anthocyanins (acylated and non-acylated), but an increase of the pyranothocyannins concentration. MLF did not produce important variations on the content of hydroxycinnamic acids derivatives, stilbenes and flavonols. Regarding flavan-3-ols, MLF caused a decrease in monomers, total flavan-3-ols and percentage of galloylation, and an increase on the percentage of prodelphinidins. However, no effect over mean degree of polymerisation was observed. Thus, it is unlikely that these changes may affect the acceptability of wines by consumers.
Advances in post-fermented wine clarification by centrifugal technology
Authors: Costagli Giacomo , Rapilly Carole , Franzoso Marco , Sjoberg Mikael , Bonetti Luca , Ciman Gian Maria , Lonardi Francesco
Published: May 2023

Wine clarification processes are deeply determined by complex interaction of wine constituents and application of available technologies as well as use of fining agents. Among others, centrifuge is a consolidated technique applied for many separation duties in the winery. Important advances on improvement of the performance of centrifugal technology have beeen focused on gentle wine treatment, minimal dissolved oxygen and significant reduction of energy consumption helping to dispel old beliefs on a technique considered to be traditional. This paper reviews the development of technology and recent advances on centrifuge improvement and aims to show, through field experimental observation, the importance of removing a portion of particles responsible of haze in the light of very low level of dissolved oxygen and complementarity of alternative recent techniques of wine filtration like cross-flow microfiltration.
Prevalence and characteristics of obesity in patients with type-2 diabetes mellitus in primary care centers in Bahrain: A cross-sectional study
Authors: Alawainati Mahmood A. , Ayoob Zahra A. , AlQari Aala A. , Makhlooq Fatema , Naser Huda S. , Bukamal Fajer
Published: May 2023

BACKGROUND:

Obesity is a complex health problem characterized by abnormal and excessive body weight. Globally, the epidemic of obesity is escalating, and today, around one-third of the world’s adult population is overweight or obese. Obesity is a risk factor and a predictor of poor outcomes of diabetes. This study aimed to determine the prevalence and characteristics of obesity in adults with type-2 diabetes mellitus.

MATERIALS AND METHODS:

This study was conducted at five primary care centers in Bahrain. Obesity was assessed using body mass index, while glycemic control status was assessed using glycated hemoglobin (HbA1c). Informed consent was obtained from all participants. Means and standard deviation were computed for continuous variables, while categorical variables were presented as frequencies and percentages. Student’s t-test and Mann-WhitneyU test, as appropriate, were performed to determine statistical significance between two continuous variables. Chi-square or Fisher’s Exact test were used to test for statistical significance for categorical variables.

RESULTS:

A total of 732 participants were included; the mean age was 58.4 ± 11.3 years. Hypertension was the most prevalent comorbidity (63.5%), followed by hyperlipidemia (51.9%). Most participants (59.8%) had HbA1c levels of more than 7%, 20.9% had HbA1c levels between 7% and 8%, and 38.9% had HbA1c levels of more than 8%. Of the cohort, 47.5% were obese and 35.0% were overweight. Obesity was significantly higher in Bahraini patients and females (P < 0.001). Lower obesity rates were observed among patients who exercised regularly (P < 0.001) and patients who followed diet control measures (P = 0.039). In addition, we found higher obesity rates were found in patients with uncontrolled diabetes (P = 0.004), hypertension (P = 0.032), and hyperlipidemia (P = 0.048).

CONCLUSION:

Obesity is prevalent among type-2 diabetic patients and is associated with poor glycemic outcomes. Thus, more efforts should be taken by physicians to address obesity in diabetic patients as it negatively impacts their glycemic control.
Evaluation of the Effects of Differences in Metal Artifact Type and Location on Image Quality in Computed Tomography Scans
Authors: Lim Se-Won , Choi Woo-Keun , Kim Sungchul
Published: May 2023

Artifacts in computed tomography scans distort anatomical information and prevent an accurate diagnosis. Therefore, this study aims to determine the most effective method for reducing metal-induced artifacts by evaluating the effects of the metal artifact type and location, and the tube voltage on the image quality. Fe and Cu wires were inserted into a Virtual Water™ phantom at 6.5 and 11 cm distances from the center point (DPs). The contrast-to-noise ratios (CNRs) and signal-to-noise ratios (SNRs) were calculated to compare the images. The results reveal higher CNRs and SNRs when using standard and Smart metal artifact reduction (Smart MAR) algorithms for Cu and Fe insertions, respectively. The standard algorithm leads to a higher CNR and SNR for Fe and Cu at DPs of 6.5 and 11 cm, respectively. The Smart MAR algorithm provides effective outcomes at voltages of 100 and 120 kVp for wires located at 11 and 6.5 cm DP, respectively. The most effective imaging conditions for MAR is generated by the Smart MAR algorithm with a tube voltage for 100 kVp for Fe located at a DP of 11 cm. MAR can be improved by setting suitable tube voltage conditions according to the type and location of inserted metal.
Symptomatic giant thymolipoma in a child
Authors: Joseph Haritha Therese , Rathi Rohit Kumar , Goel Himanshu , Bal Sabyasachi
Published: May 2023

Thymolipomas are slow-growing benign tumors arising from the thymus. They are rare in children, are usually asymptomatic, and can attain enormous size at diagnosis. Contrast-enhanced computerized tomography (CECT) scan characterizes the thymolipomas as a fat-attenuating lesions in the anterior mediastinum. Surgical excision provides relief from symptoms and is the definitive management. We report a case of a symptomatic giant thymolipoma in a 5-year child to highlight issues in diagnosis and management.