bluuebunny/crossref_metadata_2025 huggingface dataset:
The Impact of Glass-to-Resin Ratio and Sample Construction on the CTE of a High Temperature Laminate
Authors: Kuczynski Joe , Bertling Silvio
Published: October 2015

The z-axis coefficient of thermal expansion (CTE) of a high-temperature laminate is dependent on sample construction. Reproducibility of the temperature-dependent CTE is significantly greater for thicker sample constructions. The CTE below Tg is independent of sample construction whereas the CTE above Tg depends on sample construction and increases with resin content. Temperature-dependent z-axis CTE is independent of heating rate but exhibited a marked dependence on the type of glass cloth used in the sample construction.
The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability
Authors: Pan Jianbiao , Le Minh-Nhat , Van Pham Cuong
Published: October 2015

This paper presents a systematic study on the effect of 120 KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding to pads over an organic substrate with gold metallizations. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequencies of 60 KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through the design of experimental methodology for four different cases: 25.4 μm wire at 60 kHz, 25.4 μm wire at 120 kHz, 17.8 μm wire at 60 kHz, and 17.8 μm wire at 120 kHz. The integrity of wire bonds was evaluated by six response variables. The optimized bonding process was selected according to the multiattribute utility theory. With the optimized bonding parameters developed on one metallization for each of the four cases, 8,100 bonds were made on five different metallizations. The samples were then divided into three groups. The first group was subjected to humidity at 85°C/85% RH for up to 1,000 h. The second group was subjected to thermal aging at 125°C for up to 1,000 h. The third group was subjected to temperature cycling from −55°C to +125°C with 1 h per cycle for up to 1,000 cycles. The bond integrity was evaluated through the wire pull and the ball shear tests immediately after bonding, and after each 150, 300, 500, and 1,000 h time interval in the reliability tests. Results show that 120 kHz frequency requires less ultrasonic power than 60 kHz when all other parameters are equal. The results also indicate that bonding at 120 kHz frequency is less sensitive to different metallizations than bonding at 60 kHz. All three reliability tests do not negatively affect the bond integrity of Au wire bonds on a variety of Au metallizations for both frequencies. Furthermore, as the reliability test time increases, both pull and shear strengths of Au wire bonds on Au pads increase.
Accelerated Tests for the Effects of Power Cycling on Tantalum Capacitors in a Humid Environment
Authors: Virkki J. , Raumonen P.
Published: October 2015

Power cycling may occur in electrical devices used in the field, and it may often take place in a humid environment with high temperature, further accelerating stress effects. This study focuses on testing the effects of power cycling; especially the effects of a single off period on surface mount tantalum capacitors in a humid environment. First, the effects of temperature and humidity on tantalum capacitors are introduced. Research was done by using the standard 85/85 test and new kind of power cycling tests that were developed based on the 85/85 test. These new tests were done in 85/85 conditions, with a single power off period of 70 h in the beginning of a test or in the middle of a test. Also, the moisture absorption of tantalum capacitors was examined. The moisture absorption results show that when the devices are off, they absorb moisture faster than when they are on. The accelerated test results suggest that humidity is absorbed during a high humidity/high temperature test, especially during the off period, and catastrophic failures occur when devices are turned on afterward. The new kind of reliability tests that were developed on the basis of the standard 85/85 test could be efficiently used for examining the effects of power cycling in a humid environment.
ZoneBOND Thin Wafer Support Process for Wafer Bonding Applications
Authors: McCutcheon Jeremy , Brown Robert , Dachsteiner JoElle
Published: October 2015

The ZoneBOND process has been developed as an alternative temporary bonding process that bonds at an acceptable temperature (usually less than 200°C), survives through higher-temperature processes, and then debonds at room temperature. The technology utilizes standard silicon or glass carriers and current thermoplastic adhesives developed by Brewer Science, Inc.
Tunability, Frequency, and Temperature Behavior of Cofired LTCC-Integrated Barium-Strontium-Titanate Shunt Capacitors up to 8 GHz
Authors: Rentsch Sven , Müller Jens , Hein Matthias
Published: October 2015

A new approach toward embedding barium-strontium-titanate (BST) patches into a commercial low temperature cofired ceramic (LTCC) is described, using a tape transfer technique. Pressure-assisted sintering is successfully employed to achieve flat multilayer multimaterial modules without internal cracks or delaminations. Apart from the description of the processing technology, the paper also presents a specific procedure of determining the microwave properties of embedded thick BST films, which is based on using the experimental evaluation of a shunt capacitor.

The permittivity of the embedded BST determined at room temperature is about 214 and remains constant at least from 100 MHz up to 8 GHz. In addition, the effects of temperature and bias voltages on the microwave properties of LTCC BST were studied systematically from 1 MHz up to 8 GHz. We observed a tuning of the permittivity by about −49%, either by raising the temperature from 21°C to 125°C, or by applying a bias electrical field of up to 10 V/μm. Additionally, breakdown voltages were investigated. The embedded BST withstands field strengths of more than 20 V/μm under laboratory conditions.
Aerosol Printing of High Resolution Films for LTCC-Multilayer Components
Authors: Ihle Martin , Partsch Uwe , Mosch Sindy , Goldberg Adrian
Published: October 2015

For the electronic packaging of sensor stable and cost-efficient fine line printing technologies on LTCC and high frequency laminates are needed. Especially common technologies like screen printing and thin film techniques are unsuitable for fine structures or too expensive. In addition, there is no direct write technology for 3D LTCC designs as well as for high reliability cofiring structures. Closing this gap, aerosol printing technology is used to print high resolution conductors on planar and nonplanar substrates.

Aerosol printing is a direct write noncontact printing technology of functional layers. After pneumatic atomization, the ink is transformed into 1–5 μm droplets. The resulting continuous aerosol stream is focused by a sheath gas in the printing head. Thus, the long standoff distance between the substrate and the deposition tip of max. 5 mm allows 3D printing on nonplanar substrates. With optimized inks and printing parameters, line widths of 10 μm are achievable. This paper will present applications for aerosol printed functional layers on LTCC. These are, for example, aerosol printed films embedded in cofired LTCC, fine line structures for high frequency applications, and the evaluation of printed 3D structures like LTCC stairways. Furthermore, the 90° contact of unconventional sensor designs will be presented.
Design, Fabrication, and Operation of a Nitrogen Monoxide Measurement Device Based on LTCC
Authors: Geiling Thomas , Welker Tilo , Ehrling Christiane , Müller Jens
Published: October 2015

We present a so-called micro total analytical system (μTAS) for the measurement of low nitrogen monoxide (NO) concentrations in gas flows. The measurement principle is based on the chemiluminescent reaction of NO with ozone (O3). The presented system scales down this measurement principle into the realm of microfluidics and microsensors. Low temperature cofired ceramics (LTCC) have proven to be the ideal technology for the realization of a μTAS, as they offer high chemical and thermal stability as well as high degree of freedom of design.

The system consists of four components: an ozone generator, an ozone concentration measurement via UV transmission, a chemiluminescent detection (CLD) chamber, and an exhaust gas treatment.

The ozone generator is a microplasma device in which ozone is produced by a dielectric barrier discharge (DBD) mechanism. From the generator, the ozone is fed into a chamber with an optical port, where the concentration is determined by UV transmission measurements. Then it is brought into contact with the NO-containing analyte gas inside the reaction chamber, where the chemiluminescent reaction occurs. The reaction chamber is outfitted with an optical port as well, so that the emitted radiation can be detected and analyzed with a photodiode. The gas mixture leaving the reaction chamber is fed through a platinum catalyst, in order to decompose leftover ozone and prevent buildup of hazardous concentrations in the surroundings of the device.

This paper presents the design of each component as well as the integrated system and gives detailed measurements of its operation.
Development of Silver Nanoparticle Ink for Printed Electronics
Authors: Wu Yiliang , Liu Ping , Wigglesworth Tony
Published: October 2015

Printable conductors with high conductivity are critical for low-cost printed electronics. From the view of printability, conductivity, and electrical stability, an ideal candidate would be a metal such as gold or silver derived from solution-deposited precursor compositions. We have been exploring the use of silver nanoparticles as the conductor precursor for printed electronics. This paper reviews our research in the development of alkylamine-stabilized silver nanoparticles that can be sintered at a low temperature (∼120°C) for high conductivity (>10,000 S/cm). Silver nanoparticle ink formulations based on these silver nanoparticles exhibit surface-energy independent printability, which enables the fabrication of high-performance top-contact transistor devices, and self-assembly characteristic when printed on hydrophilic substrates, which allows for large-area, defect-free source/drain arrays to be printed with a narrow and uniform channel length.
Electrical Performance of Cofired Alumina Substrates at High Temperatures
Authors: Chen Liang-Yu
Published: October 2015

A 96% polycrystalline alumina (Al2O3) based prototype packaging system with Au thick-film metallization successfully facilitated long term testing of high temperature SiC electronic devices for over 10,000 h at 500°C previously. However, the 96% Al2O3 chip-level packages of this prototype system were not fabricated via a commercial cofire process, which would be more suitable for large scale commercial production. The cofired alumina materials adopted by the packaging industry today usually contain several percent of glass constituents to allow cofiring processes at temperatures usually lower than the regular sintering temperature for alumina. In order to answer the question of whether cofired alumina substrates can provide a reasonable high temperature electrical performance comparable to regular 96% alumina sintered at 1700°C, this paper reports on the dielectric performance of a selected high temperature cofired ceramic (HTCC) alumina substrate and a low temperature cofired ceramic (LTCC) alumina (polycrystalline aluminum oxides with glass constituents) substrate from room temperature to 550°C at frequencies of 120 Hz, 1 KHz, 10 KHz, 100 KHz, and 1 MHz. Parallel-plate capacitive devices with dielectrics of these cofired alumina and precious metal electrodes were used for measurement of the dielectric properties of the cofired alumina materials in the temperature and frequency ranges. The capacitance and AC parallel conductance of these capacitive devices were directly measured by an AC impedance meter, and the dielectric constant and parallel AC conductivity of the dielectric were calculated from the capacitance and conductance measurement results. The temperature and frequency dependent dielectric constant, AC conductivity, and dissipation factor of selected LTCC and HTCC cofired alumina substrates are presented and compared with those of 96% alumina. Metallization schemes for cofired alumina for high temperature applications are discussed to address the packaging needs for low-power 500°C SiC electronics.
Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics
Authors: Mirgkizoudi M. , Liu C. , Conway P. P. , Riches S.
Published: October 2015

The performance of electronics in harsh environments is often affected by a combination of environmental factors. Qualification tests on such electronics are normally carried out by separate environmental tests such as temperature storage, temperature cycling and vibration tests. This approach may miss the effects of combined parameters, where for example, there may be degradation in a vibration environment that may be accelerated by temperature related effects on material properties.

This paper presents results from a study of the combined effects of temperature and vibration on wire bonded interconnections that are used in the production of high temperature electronic components. The study is focused on the testing of electronic components under the combination of temperature exposure up to 250°C and vibration loading with a frequency range between 500 Hz and 2,000 Hz and acceleration up to 20 Grms. The study covers aspects of wire bond connections and their failure mechanisms, where the effect of wire loop height and length under separate and combined vibration and temperature tests has been investigated. The study has also assessed the effect on packaged Silicon on Insulator (SOI) devices assembled into ceramic packages under representative combined temperature and vibration profiles. The work has shown that the combined effect of temperature and vibration has increased the susceptibility of wire bond interconnections to vibration-induced failures.
Tin Nanoparticle-Based Solder Paste for Low Temperature Processing
Authors: Diaz Alfredo J. , Ma David , Zinn Alfred , Quintero Pedro O.
Published: October 2015

Materials have shown a tendency to modify their bulk properties depending on powder particle size. Nanoparticles' coalescence temperature tends to decrease as particle size decreases. Taking advantage of this behavior, a nanoparticle-based solder paste has been developed as a proof-of-concept and is described in this paper for attaching electronic components at a lower processing temperature to avoid thermally induced damage and reduce energy consumption.

Tin nanoparticles were successfully synthesized via a wet chemistry route. The synthesis consists on the use tin (II) chloride dehydrated as the Sn precursor, 1,10-phenanthroline as the surfactant, and sodium borohydride as the reducing agent. A flux system was developed based on ethylene glycol. The solder paste based on the synthesized Sn nanoparticles showed good surface wetting, but not a sufficient metal volume to produce an attachment because the paste required high flux content, thus resulting in a poor metallic load paste. By using commercially procured Sn nanoparticles the results showed acceptable coalescence of the noncapped nanoparticles at temperatures as low as 200°C with a processing time of 20 min. A reduction in processing temperature of approximately 40°C has been found when comparing the developed solder paste with typical SAC lead-free solders. The mechanical and electrical properties of the resulting structure were characterized by means of lap-shear testing and a four-wire Kelvin test showing acceptable shear strength and electrical conductivity.
Wide Band Measurement of Dielectric Properties of Electronic Assembly Materials Inside an LTCC Fluidic Structure
Authors: Müller Jens
Published: October 2015

Assembly materials such as underfillers or glob top epoxies are typically not specified regarding their dielectric properties for frequencies higher than 1 MHz. However, their behavior should be known for a wider frequency range in order to implement the appropriate parameters for RF and microwave simulations and designs. Typical methods to measure permittivity and loss tangent are based on parallel plate capacitor measurement with an impedance or network analyzer (up to about 1 GHz), S-parameter measurement of filled waveguides, coaxial transmission lines, or resonance methods (e.g., split post resonator, slit cavity resonator, ring resonator, open resonator). Most of these methods require specific sophisticated sample preparation. The paper describes a novel method based on suspended or inverted microstrip evaluation in a 3D LTCC structure. Suspended and inverted microstrip lines have lower insertion losses than standard microstrip lines due to the air gap between the line and the ground plane (reduced dielectric losses). Low loss structures are necessary to be able to measure low loss dielectrics. Such suspended or inverted microstrip lines can be easily achieved in LTCC by implementing a cavity structure. Inlets and outlets allow for the cavity to be filled with fluids after an initial S-parameter measurement of line properties (i.e., impedance, insertion loss, phase velocity). Measuring is repeated once the assembly material is cured. The change in impedance, phase velocity, and insertion contains the information about the material under test. Its properties are derived by curve fitting methods with a 3D electromagnetic field simulator. It is also possible to implement line resonators instead of through lines. In the latter case, the resonant frequency shift and the quality factor contains the material information. The procedure is demonstrated on a multilayer LTCC substrate based on low loss DP 9k7 and a commercial underfill material.
Advanced Thermal Management Solutions on PCBs for High Power Applications
Authors: Langer Gregor , Leitgeb Markus , Nicolics Johann , Unger Michael , Hoschopf Hans , Wenzl Franz P.
Published: October 2015

With increasing power loss of electrical components, thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to rapid advances in semiconductor technology, particularly in the field of high-power components, the temperature distribution inside of a component is a critical parameter of long-term reliability and must be carefully considered during the design phase.

Two main drivers in the electronics industry are miniaturization and reliability. Whereas there is a continuous improvement concerning miniaturization of conductor tracks (i.e., lines and spaces have been reduced continuously over the past years), miniaturization of the circuit carrier itself, however, has mostly been limited to decreased layer counts and base material thickness. This can lead to significant component temperature increase and thence to accelerated system degradation.

Enhancement of the system reliability is directly connected to an efficient thermal management on the PCB level. There are several approaches that can be used to address this issue: optimization of the board design, use of base materials with advanced thermal performance, and use of innovative buildup concepts.

The paper provides a short overview about standard thermal solutions such as thick copper, thermal vias, plugged vias, or metal core based PCBs. Furthermore, attention will be focused on the development of copper filled thermal vias in thin board construction. In another approach, advanced thermal management solutions are presented at the board level, exploring different buildup concepts (e.g., cavities). Advantages of cavity solutions in the board are shown that not only decrease the thermal path leading from the high power component through the board to the heat sink, but also have an impact concerning the mechanical miniaturization of the entire system (reduction of z axis). Such buildups serve as a favorable packaging solution with promising thermal performance.

Moreover, using thermal simulations different setups are compared and a deeper insight into the thermally relevant geometry and material parameters is provided, allowing production efforts to be reduced and to offering optimized designs and board buildups.
A Control-Chart-Based Method for Solder Joint Crack Detection
Authors: Pan Jianbiao
Published: October 2015

Many researchers have used different failure criteria in published solder joint reliability studies. Since the reported time-to-failure would be different if different failure criteria were used, it would be difficult to compare the reported reliability life of solder joints from one study to another. The purpose of this study is to evaluate the effect of failure criteria on the reported thermal fatigue life and determine which failure criterion could detect failure sooner. First, the application of the control-chart-based method in a thermal cycling reliability study is described. The reported time-to-failure data were then compared based on four different failure criteria: a control-chart-based method, a 20% resistance increase from IPC-9701A, a resistance threshold of 500 Ω, and an infinite resistance. Over 3.5 GB resistance data measured by data loggers from a low-silver solder joint reliability study were analyzed. The results show that estimated time-to-failure based on the control-chart-based method is very similar to that when the IPC-9701A failure criterion is used. Both methods detected failure much earlier than the failure criterion of a resistance threshold of 500 Ω or an infinite resistance. A scientific explanation is made of why the 20% increase in IPC-9701A is a reasonable failure criterion and why the IPC-9701A and the control-chart-based method produced similar results. Three different stages in resistance change were identified: stable, crack, and open. The duration of the crack stage depends on the severity of the test conditions. It is recommend the control-chart-based method be used as the failure criterion because it not only monitors the average of resistance, but also monitors the dispersion of resistance in each thermal cycle over time.
Uniqueness and Challenges of Sintered Silver as a Bonded Interface Material
Authors: Wereszczak A. A. , Liang Z. , Ferber M. K. , Marlino L. D.
Published: October 2015

There are numerous attributes of sintered Ag as a bonded interface between die and substrate or even between substrate and heat sink in power devices. This is attested to by the relatively large number of studies devoted to it in recent years. Sintered Ag potentially has a high temperature capability, high electrical and thermal conductivities, a microstructure in equilibrium, predictable linear elastic response during thermal cycling, and apparently minimal or even nonexistent time-dependent pore coalescence and pore growth that exists with solders. But sintered Ag bonding is a relatively new technology and solid-state sintering science and its application can be unfamiliar to solder/bonding practitioners. There are at least five different aspects of sintered Ag bonding compared with solder bonding. Those are reviewed here based on the authors' experience with Ag sintering over the last several years. Sintered-Ag interconnect bonding is a solid-state process (i.e., no melting); its bond strength is affected by the topography of the mating surfaces; concurrent pressure application during processing can improve bond strength; issues associated with the paste's organic binder burnout and exhaust can arise depending on the interconnect size; and porosity is indigenous to its bulk microstructure, requiring its consideration and possible management. Increased understanding of these unique characteristics will help advance use of sintered-Ag technology and the exploitation of its attributes for fabricating more reliable, higher-temperature-capable, and more thermally conductive power electronic modules.
Manufacturability and Reliability Screening of Lower Melting Point, Pb-Free Alloys Containing Bismuth
Authors: Juarez Joseph M. , Snugovsky Polina , Kosiba Eva , Bagheri Zohreh , Suthakaran Subramaniam , Robinson Michael , Heebink Joel , Kennedy Jeffrey , Romansky Marianne
Published: October 2015

This paper explores the manufacturability and reliability of three Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies. The first alloy included in the study is a Sn-based alloy with 3.4%Ag and 4.8%Bi, which showed promising results in the National Center for Manufacturing Sciences and German Joint projects. The other two alloy variations have reduced Ag content, with and without Cu. BGA and leaded components were assembled on medium-complexity test vehicles using these alloys, as well as SAC305 and SnPb as baseline alloys, for comparison. Test vehicles were manufactured using two board materials, 170°C glass transition temperature (Tg) and 155°C Tg, with three surface finishes: ENIG, ENEPIG, and OSP. The accelerated temperature cycling (ATC) testing was done at −55°C to 125°C with 30-min dwells and 10°C/min ramps, for 3,000 cycles. Detailed microstructure examination before and after ATC testing is described, as is failure analysis. All three experimental alloys showed excellent performance in harsh-environment thermal cycling. Vibration testing at two G-force test conditions with resistance failure monitoring was performed on the daisy-chained components. A detailed description of the technique for the vibration testing using 2 G and 5 G harmonic dwells is provided. The lowest failure rate found at both the 2 G and 5 G levels was for the Cu-containing alloy known as Violet. These results provide data for further statistical analysis leading to the choice of proper combinations of the solder alloys, board materials, and surface finishes for high-reliability applications.
Electrical and Mechanical Investigations on Copper Circuit Paths Coated on Fiber-Reinforced Plastics by Atmospheric Plasma Technology
Authors: Schramm Rene , Reitberger Thomas , Franke Joerg
Published: October 2015

In previous investigations, the additive metallization of conductor paths on thermoplastic substrate materials using printing technologies (e.g., ink jet, Aerosol Jet) was analyzed. Major disadvantages of printing technologies are the two-step process chain divided in printing and sintering and the low current-carrying capacity of the generated structures. Accordingly, printed conductor paths are mainly used for sensor and control currents.

Plasmadust technology, based on a cold-active atmospheric plasma beam, offers the possibility of additive metallization of copper circuit paths on different substrate materials (e.g., thermoplastic, fiber-reinforced plastic, ceramic). During the process, nano- and microscale metal powder (particle size, 0.1–20 μm) is melted by a highly energetic nitrogen gas inside the plasma nozzle. Based on the kinetic and thermal energy of the nitrogen-metal compound, the circuit paths are generated on the substrate surface. Plasmadust technology is characterized by a one-step process chain, a very high coating speed (up to 50 m/min), and a high current-carrying capacity of the generated conductor structures. Hence, it is possible to transfer high currents for various purposes (e.g., illumination applications). In this study, copper circuit paths generated on fiber-reinforced substrate materials, using the Plasmadust technology, were investigated. First, the adhesion of the layers and the current-carrying capacity of the copper structures were analyzed. Second, the specimens were tested in two reliability studies: a temperature-humidity test (85°C/85% relative humidity) and a temperature-cycling test (−40°C/125°C). With the former, the influence of moisture absorption of the sandwich material (up to 7%) on the adhesion of the copper circuit paths was analyzed. With the latter, the substrate compound and the additive metallization was qualified during thermomechanical stress.
The meaning of ‘Thy will be done’: An investigation into prayer
Authors: Kroesbergen Hermen
Published: October 2015

This article investigates how we should understand the prayer ‘But thy will not mine be done’, using Wittgenstein’s ordinary language approach. The later Wittgenstein argued that philosophy’s task is to assemble reminders of how language is used in daily life for a particular purpose. This approach offers a way to understand how, despite what theologians have argued, ‘Thy will be done’ is neither making prayer useless, nor is it fundamental to all petitionary prayers. Firstly, the framework and method of Wittgenstein’s ordinary language will be explained. Secondly, reminders will be assembled for the purpose of showing that the prayer ‘Thy will be done’ does not need to make praying useless. Thirdly, the appropriate reminders to refute the statement that ‘Thy will be done’ is fundamental to all petitionary prayers will be presented. And, finally, these two sets of reminders will be connected to one another to provide a more truthful understanding of the prayer ‘Thy will be done’.
In Praise of Folly: A cursory review and appreciation five centuries later
Authors: Potgieter Raymond
Published: October 2015

Desiderius Erasmus was a humanist reformer concerned with reforming the civil and ecclesiastical structures of his society. In reformed circles, much attention is paid to his role in the Lutheran controversy. Despite this, his powerful influence continues to this day. Erasmus’ particular fool’s literature, Moriae Encomium (1509), revealed his humanist concerns for civil and ecclesial society as a whole. He employed folly as a rhetorical instrument in satirical manner, evoking readers’ amusement from numerous charges against the perceived multilayered social reality of the day. Five hundred years later the person of Folly may still perform this same task in Christian society. That was Erasmus’ point – the church is not to be seen as an island, it shares in the structures of society and is therefore still subject to its share of critical comments.‘Lof der Zotheid’: ‘n oorsig en evaluering vyf eeue later. Desiderius Erasmus was ’n humanis wat gepoog het om hom te beywer vir die hervorming van die burgerlike en kerklike strukture van sy tyd. In gereformeerde kringe word sy rol in die Lutherse twisgeskil beklemtoon. Sy verreikende invloed word steeds vandag gevoel. Erasmus se gekke-literatuur, Moriae Encomium (1509), het sy besorgdheid rakende die burgerlike en ekklesiastiese samelewing vanuit ’n humanistiese standpunt openbaar. Hy gebruik dwaasheid as retoriek en met behulp van satire vermaak hy die leser terwyl hy die veelvuldige lae van die sosiale realiteit van die dag ontbloot. Die personifikasie van die ‘gek’ of ‘dwaas’ is 500 jaar later steeds relevant vir hierdie rol in die Christelike samelewing. Erasmus was van mening dat die kerk nie as ’neiland beskou moet word nie. Dit maak deel uit van die samelewingstrukture en is daarom steeds aan kritiek onderworpe.
Rugged optical mirrors for Fourier-Transform Spectrometers operated in harsh environments
Authors: Feist D. G. , Arnold S. G. , Hase F. , Ponge D.
Published: October 2015

Abstract. The Total Carbon Column Observing Network (TCCON) and the Network for the Detection of Atmospheric Composition Change (NDACC) operate a number of Fourier-Transform Spectrometers (FTSs) that measure trace gases in the atmosphere by observing solar spectra. To guide the sunlight into the FTS, a solar tracker has to be placed outside. This device needs high-quality optical mirrors with good reflectivity in the near and mid infrared. More and more FTS stations are operated in remote locations with harsh environments. Optical mirrors are usually made for laboratory conditions and might not last very long there. At the MPI-BGC's TCCON site on Ascension Island, several mirrors from different optical manufacturers were destroyed within weeks. To continue operation, the MPI-BGC had to develop rugged mirrors that could sustain the harsh conditions for months or even years. While commercially available mirrors are typically made from a substrate coverered with a thin reflective coating, these rugged mirrors were made from stainless steel with no additional coating. Except for their lower reflectivity (which can easily be compensated for), their optical properties are comparable to existing mirrors. However, their rugged design makes them mostly immune to corrosion and scratching. Unlike most coated mirrors, they can also be cleaned easily.
Technical note: Dimensioning IRGA gas sampling system: laboratory and field experiments
Authors: Aubinet M. , Joly L. , Loustau D. , De Ligne A. , Chopin H. , Cousin J. , Chauvin N. , Decarpenterie T. , Gross P.
Published: October 2015

Abstract. Both laboratory and field experiments were carried out in order to define suitable configuration ranges for the gas sampling systems (GSS) of infrared gas analyzers (IRGA) used in eddy covariance measurements. In the laboratory, an original dynamic calibration bench was developed in order to test the frequency attenuation and pressure drop generated by filters. In the field, IRGAs equipped with different filters or different rain cups were installed and run and the real frequency response of the complete set-up was tested. The main results are that: – Filters may have a strong impact on the pressure drop in the GSS and this impact increases with flow rate. – On the contrary, no impact of the tested filters on cut off frequency was found, GSS with and without filters presenting similar cut off frequencies. – The main limiting factor of cut off frequency in the field was found to be the rain cup design. In addition, the impact of this design on pressure drop was also found noteworthy.
Quantifying the prediction accuracy of a 1-D SVAT model at a range of ecosystems in the USA and Australia: evidence towards its use as a tool to study Earth's system interactions
Authors: Petropoulos G. P. , North M. R. , Ireland G. , Srivastava P. K. , Rendall D. V.
Published: October 2015

Abstract. This paper describes the validation of the SimSphere SVAT (Soil–Vegetation–Atmosphere Transfer) model conducted at a range of US and Australian ecosystem types. Specific focus was given to examining the models' ability in predicting shortwave incoming solar radiation (Rg), net radiation (Rnet), latent heat (LE), sensible heat (H), air temperature at 1.3 m (Tair 1.3 m) and air temperature at 50 m (Tair 50 m). Model predictions were compared against corresponding in situ measurements acquired for a total of 72 selected days of the year 2011 obtained from eight sites belonging to the AmeriFlux (USA) and OzFlux (Australia) monitoring networks. Selected sites were representative of a variety of environmental, biome and climatic conditions, to allow for the inclusion of contrasting conditions in the model evaluation. Overall, results showed a good agreement between the model predictions and the in situ measurements, particularly so for the Rg, Rnet, Tair 1.3 m and Tair 50 m parameters. The simulated Rg parameter exhibited a root mean square deviation (RMSD) within 25 % of the observed fluxes for 58 of the 72 selected days, whereas an RMSD within ~ 24 % of the observed fluxes was reported for the Rnet parameter for all days of study (RMSD = 58.69 W m−2). A systematic underestimation of Rg and Rnet (mean bias error (MBE) = −19.48 and −16.46 W m−2) was also found. Simulations for the Tair 1.3 m and Tair 50 m showed good agreement with the in situ observations, exhibiting RMSDs of 3.23 and 3.77 °C (within ~ 15 and ~ 18 % of the observed) for all days of analysis, respectively. Comparable, yet slightly less satisfactory simulation accuracies were exhibited for the H and LE parameters (RMSDs = 38.47 and 55.06 W m−2, ~ 34 and ~ 28 % of the observed). Highest simulation accuracies were obtained for the open woodland savannah and mulga woodland sites for most of the compared parameters. The Nash–Sutcliffe efficiency index for all parameters ranges from 0.720 to 0.998, suggesting a very good model representation of the observations. To our knowledge, this study presents the most detailed evaluation of SimSphere done so far, and the first validation of it conducted in Australian ecosystem types. Findings are important and timely, given the expanding use of the model both as an educational and research tool today. This includes ongoing research by different space agencies examining its synergistic use with Earth observation data towards the development of global operational products.
Mapping of satellite Earth observations using moving window block kriging
Authors: Tadić J. M. , Qiu X. , Yadav V. , Michalak A. M.
Published: October 2015

Abstract. Global gridded maps (a.k.a. Level 3 products) of Earth system properties observed by satellites are central to understanding the spatiotemporal variability of these properties. They also typically serve either as inputs into biogeochemical models or as independent data for evaluating such models. Spatial binning is a common method for generating contiguous maps, but this approach results in a loss of information, especially when the measurement noise is low relative to the degree of spatiotemporal variability. Such "binned" fields typically also lack a quantitative measure of uncertainty. Geostatistical mapping has previously been shown to make higher spatiotemporal resolution maps possible, and also provides a measure uncertainty associated with the gridded products. This study proposes a flexible moving window block kriging method that can be used as a tool for creating high spatiotemporal resolution maps from satellite data. It relies only on the assumption that the observed physical quantity exhibits spatial correlation that can be inferred from the observations. The method has several innovations relative to previously applied methods: (1) it provides flexibility in the spatial resolution of the contiguous maps, (2) it is applicable for physical quantities with varying spatiotemporal coverage (i.e., density of measurements) by utilizing a more general and versatile data sampling approach, and (3) it provides rigorous assessments of the uncertainty associated with the gridded products. The method is demonstrated by creating Level 3 products from observations of column-integrated carbon dioxide (XCO2) from the GOSAT (Greenhouse Gases Observing Satellite) satellite, and solar induced fluorescence (SIF) from the GOME-2 (Global Ozone Monitoring Experiment-2) instrument.
The effect of the Dubai Metro on the value of residential and commercial properties
Authors: Mohammad Sara Ishaq , Graham Daniel J. , Melo Patricia C.
Published: October 2015

This paper analyzes the impact of the newly operated Dubai Metro on the sale transaction value of dwellings and commercial properties. The effect is estimated for properties within different catchment zones of a metro station using difference-in-differences and hedonic pricing methods on both repeated cross-sectional data and pseudo panel data. Our estimates show a positive effect of the metro on sale values of both residential and commercial properties, although the effect is stronger for commercial properties. The models also reveal that the effect of the metro on the value of dwellings and commercial properties is largest within 701 to 900 meters of a metro station and is about 13 percent and 76 percent, respectively.
Wealth Creators in the Banking Sector in UAE during 2010-2015 Period
Authors: Kumar Rajesh , K S Sujit
Published: October 2015

The returns of 20 actively traded banking stocks in UAE were analysed during the five and half year period 2010 to mid-2015.The performance of the stocks of banking firms was analysed in terms of yearly average returns, cumulative total returns and holding period returns. The stock prices were obtained from Abu Dhabi Stock Exchange and Dubai Financial Market websites.
Women Entrepreneurship: A Big Motivation
Authors: Balhara Shruti , Singh Ajmer
Published: October 2015

Women Entrepreneurship is gaining popularity in India and Entrepreneurship amongst Women has been a recent concern which started only after the 1970’s with the introduction of Women in India. Women Entrepreneurship is an important part of social and economic development of country. Women Empowerment is must for a modern developed economy through Women Entrepreneurship. This paper focuses on Women Entrepreneurship – Various Problems encountered by Women while setting up a new venture, To Study the factors which Motivates the Women to start their own venture, To Study the role of Government in the growth of Women Entrepreneurship. This Study also suggested some Supportive Measures for the development of Women while pursuing their business. 
Tissue Engineering of Nanosilver-embedded Peripheral Nerve Scaffold to Repair Nerve Defects under Contamination Conditions
Authors: Ding Tan , Yin Jun-Bin , Hao Hu-Ping , Zhu Chao , Zhang Ting , Lu Ya-Cheng , Wang Li-Ying , Wang Zhe , Li Yun-Qing
Published: October 2015

Introduction

We employed a nanosilver-collagen scaffold and tested its effects on inhibiting bacteria and facilitating nerve regeneration.

Methods

Based on our previous research, we prepared bionic scaffolds with different concentrations of nanosilver and examined their internal structures by scanning electron microscopy and energy dispersive spectroscopy. We implanted these scaffolds or autologous nerve grafts into rats to repair a 10-mm injury of the sciatic nerve.

Results

The 2 mg/ml group showed a >10 mm bacterial inhibition zone in all 3 types of bacterial culture dishes. At day 60 postsurgery, the 2 mg/ml group also showed the highest amplitude of evoked potential (AMP) and nerve conduction velocity (NCV). The regenerating nerves in the 2 mg/ml group were denser and more mature, and with thicker and well-arrayed myelin sheath.

Conclusions

These results demonstrate that nanosilver scaffolds (2 mg/ml group) were effective in inhibiting bacteria both in vitro and in vivo, and reduced the contamination-caused immune responses, which in turn promoted nerve regeneration and functional recovery.
When Curing a Pediatric Tumor is not Enough: The Case of a Psychiatric Disorder in a Woman Surviving Osteosarcoma
Authors: Meazza Cristina , Veneroni Laura , Podda Marta , Terenziani Monica , Luksch Roberto , Ferrari Andrea , Catania Serena , Schiavello Elisabetta , Giacon Barbara , Puma Nadia , Bergamaschi Luca , Roncari Luisa , Clerici Carlo Alfredo
Published: October 2015

Aims and background

We describe the case of a woman cured of osteosarcoma who took part in a mono-institutional study using different questionnaires to assess pediatric cancer survivors’ quality of life and behavioral features 12 years after completing her cancer treatment.

Results

The high levels of psychological distress and psychopathologic symptoms revealed by this patient prompted us to offer her specific and prolonged support at our institution, since she refused to seek the help of other psychiatric services. The woman revealed a dysfunctional social and family setting and a borderline personality disorder. She was hospitalized after attempting suicide. No psychological distress had previously come to light during her long follow-up for cancer.

Conclusions

Cancer survivors are at risk of psychological and behavioral problems, so they should be followed up over time. Questionnaires and standard scales are important, but not enough: the physician-patient relationship is crucial to bring out a patient's psychological issues and needs. This means that dedicated resources should be made available, whenever possible.
Hepatosplenic T-Cell Lymphoma with Coexistent Hepatitis B Infection: A Rare Clinicopathologic Entity
Authors: Siraj Fouzia , Dalal Varsha , Khan Afaq A. , Jain Deepali
Published: October 2015

Background

Hepatosplenic T-cell lymphoma (HSTL) is a rare extranodal and systemic lymphoma derived from cytotoxic T cells usually of γδ T cell receptor type. It is characterized by primary extranodal disease with typical sinusoidal infiltration of liver, spleen, and bone marrow by medium-sized lymphoid cells.

Case Report

A 29-year-old man, with no significant prior medical history, presented with fever and massive splenomegaly. A diagnosis of HSTL was established by histologic examination and immunohistochemistry. Staging workup demonstrated bone marrow involvement by lymphoma. In addition, the patient was found to have hepatitis B infection. The association of these 2 entities has been described rarely.

Conclusions

Hepatosplenic T-cell lymphoma is a distinct T cell lymphoma associated with an aggressive clinical course, a poor response to conventional treatment, and an exceedingly high mortality rate. An association of HSTL with hepatitis B as seen in the present case is exceedingly rare, with few cases reported in the literature.
Treatment of Bladder Urothelium Injury
Authors: Harris Neil
Published: October 2015

The management of patients with cystitis-related symptoms due to urinary tract infection, bladder pain syndrome (BPS) or radio/chemo-induced cystitis remains challenging. A component in the pathophysiology of these symptoms relates to the fact that the urothelium is a highly metabolically active structure and that alterations in this structure can give rise to a variety of symptoms.
NBI: Results Review
Authors: Racioppi Marco , D'Agostino Daniele , Ragonese Mauro , Di Gianfrancesco Luca , Bassi Pier Francesco
Published: October 2015

The narrow band imaging (NBI) is a new technology introduced to complement the traditional endoscopy in order to enhance the detection of nonmuscle-invasive bladder cancer and, consequently, to improve the management of the disease. In this review, we considered the most important studies about the use of NBI in the diagnosis and treatment of bladder cancer. Current results demonstrate a greater sensitivity in the diagnosis of bladder cancer and especially a better negative predictive value of cystoscopy enhanced by NBI technology than white light standard cystoscopy. Similarly, improving the performance of endoscopic resection, this new technology would have a positive therapeutic impact in order to decrease residual tumors and relapses. The validation of the results and diffusion of NBI in clinical practice may provide new perspectives in the management of nonmuscle-invasive bladder cancer.
Multilevel regulation op het terrein van de lucht-, zee- en binnenvaart
Authors: Kohll N.
Published: October 2015

Multilevel regulation op het terrein van de lucht-, zee- en binnenvaart

Dit artikel gaat over multilevel regulation in de luchtvaart-, zeevaart- en binnenvaartwetgeving. Multilevel regulation ontstaat doordat naast nationale overheden ook veel andere organisaties regelgeving tot stand brengen. Aan de hand van steeds een actueel dossiers uit elk van de drie genoemde wetgevingscomplexen, wordt in dit artikel beschreven hoe regelgeving op internationaal niveau tot stand komt, de regelgeving van de Europese Unie beïnvloedt en uiteindelijk doorwerkt in nationale regelgeving. Ook wordt beschreven hoe in elk van de genoemde wetgevingscomplexen de wisselwerking tussen deze niveaus in de praktijk werkt, hoe de onderlinge afstemming is vormgegeven en op welke wijze in Nederland steeds is voorzien in parlementaire betrokkenheid. Geconcludeerd wordt dat de invloed van de EU de laatste jaren steeds belangrijker lijkt te worden. Eindconclusie is dat er op dit moment geen redenen zijn om de huidige werkwijze bij de voorbereiding van uitvoerende besluitvorming in internationaal en EU-verband te veranderen.
Het Staatsblad
Authors: Borman T.C.
Published: October 2015

Het Staatsblad

Naar aanleiding van de pensionering van Sandra Slingerland, die bij het ministerie van Justitie 37 jaar lang verantwoordelijk was voor de uitgifte van het Staatsblad, worden in deze bijdrage enkele faits divers en petites histoires rond het Staatsblad behandeld. Ingegaan wordt op de historie van het uit 1813 daterende Staatsblad, inclusief de toepasselijke wetgeving. Verder wordt aandacht besteed aan voorvallen waarbij in het parlement het Staatsblad ter sprake kwam. Daarbij ging het onder meer over de toegankelijkheid, het formaat en de tijdige uitgifte van het Staatsblad.