bluuebunny/crossref_metadata_2025 huggingface dataset:
Organizational intelligence: a structuration view
Authors: Akgün Ali E. , Byrne John , Keskin Halit
Published: June 2007

Purpose

This paper aims to unify the fragmented views on organizational intelligence from the perspective of Giddens' structuration theory.

Design/methodology/approach

The paper used a case study of a firm, which is a small electronics manufacturing group located in the New England area of the northeast USA. Data were collected by observation, oral histories and through discussion and interviews with organization members.

Findings

It was observed that a structuration view of organization intelligence removes the individual/organization level intelligence dichotomy, and integrates the fragmented studies on the epistemology of intelligence, e.g. cognitive, behavioral and social/emotional.

Research limitations/implications

Propositions for further research are formulated. However, findings are derived on the basis of a substantive case study in a particular country. Further, research needs to expand this base to encompass other organizations in a wider range of countries across different cultures.

Practical implications

This paper helps managers to assess and to operationalize organizational intelligence.

Originality/value

This paper proposes a more comprehensive understanding of intelligence in organizations.
The guru's gusto: management fashion, performance and taste
Authors: ten Bos René , Heusinkveld Stefan
Published: June 2007

Purpose

The purpose of this paper is to assess the role of management gurus in a contemporary society.

Design/methodology/approach

To further understanding about the specific atmosphere favorable to the production and consumption of the guruesque ideas the paper draws on the work of Goffman and MacIntyre about the performance‐like quality of organizational life.

Findings

It is argued that the management guru is well at home in a social world in which presentation is a central theme. Hence, we portray the guru not as the messenger who brings indisputable truths to the managerial masses, but as a person who succeeds in presenting him or herself as a “tastemaker”.

Research limitations/implications

The concept of tastemaker is still in need of more development and therefore this paper suggests three lines of further research.

Practical implications

This paper may help managers, as important consumers of guruesque ideas, to better understand the management guru phenomenon and to reflect on their value in daily praxis.

Originality/value

The paper provides more insight into the, albeit contested, role of (dis)taste, an issue that received scant attention in discussions about management fashion and guruism.
From a “Grand Story” to Multiple Narratives? Studying an Organizational
Change Project
Authors: Aaltio‐Marjosola Iiris
Published: June 2007

The study has origins in paradoxical foundations: although the trends in
the theory of organizational change emphasize organizational uniqueness,
in a case study it was found that metacultural ideals about the rules,
order, hierarchy and predictability were privileged and had a remarkable
effect on organizational change. It is suggested that metalevel “Grand
Story”, hiding ideals about what is a “real” organization still exists
strongly in the societal memory, and especially in circumstances of
rapid change and financial problems of an enterprise this “Grand
Story” easily grasps the uniqueness of that organization.
Evaluation of the Reliability and Corrosivity of VOC‐free, No‐clean Fluxes
using Standard, Modified and Electrochemical Methods*
Authors: Ramirez C. , Lei K.‐S.
Published: June 2007

The reliability and corrosivity of two VOC ‐ free, no‐clean
fluxes (C and D) were assessed using traditional test method such as copper mirror and copper corrosion
tests. Modified surface insulation resistance (SIR) tests using coupons fluxed with various methods were
performed in 50°C/90%RH environmental conditions. Printed circuit boards and assemblies were fluxed
and exposed to a 50°C/90%RH chamber to assess long‐term reliability. To evaluate the corrosion rates
of copper and solder sheets in as‐ received liquid fluxes, electrochemical polarisation measurements were
employed. These showed that the corrosion rate of copper in flux D is 100 times higher than that in flux
C. These quantitative data agreed with the qualitative copper mirror test results, i,e, flux C passed and
flux D failed the test. However, both flux residues were found to corrode copper traces underneath the
solder mask and copper pads on the PCB after three weeks in a 50°C/90% RH environment chamber.
Large amounts of blue/green corrosion products were observed on the bare copper SIR coupons within
seven days when using either flux; and SIR values were below the required 108 ohms.
Based on the test results, neither flux was qualified for no‐clean processes because of the issues with
corrosion. The corrosiveness of the VOC‐ free, no‐ clean flux residue is believed to be due to the
activator packages used.
Contamination of Various Flux/Cleaning Combinations on SMT Assemblies: A Discussion of Different Analysis Methods
Authors: Grossmann G.
Published: June 2007

The contamination on
SMT assemblies caused by a number of flux/cleaning variation has been investigated, with several
analysis methods used to quantify the contamination. The results from analysis of test printed circuit
boards (PCBs) using anion separation, conductivity, ionic contamination measurement, visual and SEM
inspection, microsections and surface insulation resistance (SIR) methods were compared. The best
cleaning result was observed with the combination of water soluble (WS) solder cream and water
cleaning. The best measurement method for cleanliness of PCBs was considered to be
SIR measurement. For WS fluxes, the iconic contamination test offers effective measurement of the
amount of residues left on the PCBs.
The Mechanical Behaviour of Solders*
Authors: Plumbridge W.J.
Published: June 2007

An overview of the mechanical behaviour of common solder types is presented, with particular emphasis placed upon those properties relevant to the performance of soldered joints in service. The requirements for more sophisticated and complex information are highlighted in order to assist design for the increasingly arduous demands associated with miniaturisation.
Popcorning in Fully Populated and Perimeter Plastic Ball Grid Array Packages*
Authors: Munamarty R. , McCluskey P. , Pecht M. , Yip L.
Published: June 2007

Two types of Plastic ball Grid array packages, a
225‐lead full matrix array and a 256‐lead perimeter array, were subjected to 168 hours of moisture
preconditioning at 85°C and 30% relative humidity followed by simulated infra‐red reflow at
temperature ramp rates of 1°C/s and 0.67°C/s. The packages were subsequently examined for
delamination and cracking using scanning acoustic microscopy and environmental scanning electron
microscopy. At the higher ramp rate, delamination and cracking were observed in both package
types, originating in the die attach and propagating along the weakest interfaces. At the lower ramp
rate, a small amount of delamination was observed. This suggests that there is a critical ramp rate
below which popcorn cracking does not occur.
Electronic Interconnect Reliability Modelling *
Authors: Winter P.R. , Wallach E.R.
Published: June 2007

This paper describes work which has been conducted to estimate the magnitudes of thermal stresses developed in the solder joints of electronic components during service. Finite Element Analysis (FEA) has been employed to predict the level of stress and strain in computer simulations of joints and these predictions have been validated by experimental thermal cycling tests. Future work is outlined including the incorporation of microstructural features into the FEA models. The overall goal of this research is to predict the service lives of electronic components under various operating conditions, thus facilitating the introduction of novel components and materials.
Advantages of Protective Atmosphere Control for No‐Clean Solder
Pastes*
Authors: de Klein F.J.
Published: June 2007

Reflow soldering in a controlled O2 atmosphere will lead to practical benefits in the wetting
behaviour of solder pastes. The required O2 level and its control depend on the solder
paste used and the solderability of the materials to be joined. For a typical application with either
fine‐pitch technology, multiple soldering or low residue solder paste, a lack of O2 control
can cause soldering problems. Fine‐pitch solder pastes today still do not
show an optimum slump behaviour, which is absolutely necessary to avoid bridging between IC leads
and to reduce the formation of solder balls during reflow. Using a low O2 atmosphere to
reduce these defects can make a difference, but an improved slump behaviour through predrying of the
applied solder paste at 50°C or in a low pressure environment will be more effective. Spread of solder is in general better at lower O2 levels, but substantial improvements are only achieved if low residue pastes with low activation levels are reflowed. Even when the low residue paste is compatible with reflow in air, there is still a significant difference found
between 20 and 200 ppm O2. Reflow systems which show variations up to 500 ppm in
the preheat zones during loading, while maintaining 50ppm in the peak zone, will show non‐wetting or
dewetting when a 100 ppm O2 solder paste is used. The visual cleanliness of solder
joints is significantly improved at lower O2 levels because the flux residue will be
distributed differently over the solder joints. Bridging is initially determined by
the slump behaviour of the paste and the alignment of the paste pattern to the pads and the leads, but
when the paste of adjacent pads slumps together before reflow, the tendency for the solder to pull back
is influenced by the oxygen level. Wetting and spread of the solder on the lands are then an essential
factor. All the proven benefits of a low O2 level are not worth the money spent on nitrogen if the consumption necessary to obtain the properly controlled O2 level is very high. When solderability or the solder defect level not an issue the benefits may not
represent a value higher than the cost of the nitrogen consumed.
Screen Printing is a Science, not an Art
Authors: Mc Phail D.
Published: June 2007

In a production environment, the first process applied to a bare
printed circuit board is generally the application of solder paste. It has been reported that 60% of all
rework is attributable to poor quality solder paste deposition. If this process is not understood or the
incorrect selection of paste, screen/stencil or squeegee is used, then regardless of technical capabilities
of the printer, it will not be possible to achieve accurate and repeatable quality of work. This paper reports on the basics of solder paste deposition with mathematical formulas
and diagrams to support the correct selection of criteria. Most importantly, it is intended to assist in the
selection process and provide an understanding of the reasons for selecting a specific
solder/stencil/squeegee to be used in conjunction with the printer. Written and compiled from a
production (real world) view‐point, this paper recognises that it is certainly possible to use a
non‐standard process parameter, and still achieve ultra‐fine pitch print capability in laboratory or small
batch scenario. But primarily this paper is a guidance and recommendation to achieve excellent results,
with as large a process window as is possible for production purposes.
Reliability Evaluation of TSOP Solder Joints for PC Card Application
Authors: Seyyedi J. , lannuzzelli R. , Bukhari J.
Published: June 2007

As part of the portable product interconnects characterisation programme, the present investigation was conducted to determine the attachment integrity and long‐term reliability of Thin small Outline package (TSOP) solder joints. Accelerated thermal cycling combined with analytical modelling was used to evaluate the reliability for credit card sized DRAM memory cards. The measured solder joint fatigue lifetimes varied from 645 to 830 thermal cycles for TSOP‐II and I components, respectively. The modelling results corroborated the empirical findings. The solder joint thermal fatigue data were used to predict the card reliability under operating field conditions. The cards were found to be reliable for their intended use environment.
Intercomparison Results of a Gold Plated Nickel Solderability Reference Standard
Authors: Hunt C.
Published: June 2007

The development and characterisation of a prototype solderability reference standard based
on a gold‐plated nickel sample has been described previously. This material has now
been tested in an intercomparison with several European laboratories. The results presented here show
that a high degree of repeatability is achievable. These results substantiate earlier ones and confirm this
material's applicability as a solderability reference material.
Method for Paste Selection and Process Optimisation for Fine‐pitch SMT
Authors: Gagne D. , Quaglia M. , Shina S.G.
Published: June 2007

This paper outlines a
methodology of paste selection for fine‐pitch SMT using a sequential investigation process
including Design of Experiments (DoE) techniques. Several factors including SMT machine
parameters as well as environmental conditions were investigated as to their effect on the soldering
process. Materials and processes were selected for optimum performance. This resulted in the
development of a robust fine‐pitch SMT process for the Hewlett Packard (hp)
Medical Equipment Group in Andover, Massachusetts.
Effect of Substrate Preheating on Solderability
Performance as a Guideline for Assembly Process Development Part 1: Baseline
Analysis *
Authors: Vianco P.T. , Claghorn ** A.C.
Published: June 2007

A study was performed which investigated the wettability of 63Sn‐37Pb and 96.5Sn‐3.5Ag solders on
copper and gold ‐nickel plated Kovar ™ using a rosin ‐based, mildly
activated (RMA) flux, a water soluble organic acid flux (WS ),and a low
residue (LR) flux. The quantitative metric was the contact angle, θc, measured by the meniscometer /wetting balance technique. The first part of the
study (Part 1) examined wetting performance following continuous exposure to
25°C prior to testing. Then, a preheating step was introduced into the experimental
procedure after flux application, but preceding the actual wettability test in order to simulate a
factory reflow process; these results are presented in Part II of this study. Contact
angles for the 63Sn‐37Pb solder (215°C) on copper were
22±2° with the RMA flux, 12±5° for the WS flux, and
31±6° for the LR flux. Increasing the 63Sn‐37Pb solder temperature to
245°C improved wettability with the RMA and LR fluxes, but no change was observed
with the WS fulx. Theii 96.5Sn‐3.5Ag lead ‐free solder exhibited poorer
wettability on copper compared with the 63Sn‐37Pb alloy, with contact angles of
41±2° (RMA), 63±15°(WS) and
39±4°(LR). For the gold ‐nickel plated Kovar™
substrates, the 63Sn‐37Pb solder at 215° had contact angles of
15±3°, 35±6° and 29±6° for the RMA, WS and LR
fluxes, respectively. The values were reduced at the higher test temperature
(245°). The 96.5Sn‐3.5Ag solder also exhibited good wetting
performance on the gold ‐nickel plated Kovar™ specimens compared with
copper. Analysis of the interfacial tension parameters, γSF‐γSLand γLF ,exemplified the importance
of γLF as well as the condition of the surfaces (γSF ) on wettability performance. A so ‐called ‘combined
analysis’ of the 63Sn‐37Pb and 96.5Sn‐3.5Ag wettability data on
either copper or gold ‐ nickel plated Kovar™ substrates was used to predict the
solder temperature dependence of wettability for the three fluxes and two base materials.
Microstructural Modelling and Electronic Interconnect Reliability*
Authors: Winter P.R. , Wallach E.R.
Published: June 2007

Initial development of microstructurally accurate finite element models of the soldered joints of electronic surface mount components is described. These models allow for the presence of lead and tin‐rich phases and copper‐tin intermetallic layers within the joints. The effect of these features on the strain distributions within the joints is shown. These strain distributions can be used to predict fatigue lives. This is demonstrated for homogeneous solder joints for which excellent correlation was shown between predicted lives and those measured experimentally by thermal cycling of actual components.
Capillary Flow Solder Wettability Test*
Authors: Vianco P.T. , Rejent J.A.
Published: June 2007

A test procedure was developed to assess the capillary flow wettability of solders
inside a confined geometry. The test geometry comprised two parallel plates with a controlled
gap of constant thickness (0.008 cm, 0.018 cm, 0.025 cm and 0.038 cm). Capillary
flow was assessed by: (1) the meniscus or capillary rise of the solder within
the gap; (2) the extent of void formation in the gap; and (3)
the time dependence of the risen solder film. Tests were performed with the lead‐free
solders 95Sn‐5Sb, 96.5Sn‐3.5Ag, and 91.84Sn‐3.33Ag‐4.83Bi. The capillary rise of the lead‐free solders was less than that observed with the 63Sn‐37Pb control. Reducing the solder surface
tension and contact angle improved capillary flow. Void formation by the non lead solders
increased as the gap became smaller. The extent of voiding was determined primarily by the gap
size rather than the wettability parameters (contact angle or surface tension) of the
individual alloys.
Closed Loop Control of Atmospheres for Soldering
Authors: Saxena N. , Precious C. , Carr A. , Adams S.
Published: June 2007

Well designed stable reflow ovens and
wave machines can be operated at low rates of the inerting gas. One problem is that at the lowest
flow rate settings changes in room draughts and in external venting conditions can affect the
internal oxygen levels unless the flow rates are altered. The internal oxygen levels can drift or
suddenly alter. This generally means that the ovens are operated at higher flows than necessary
in order to ensure steady operations below some desired oxygen level without excessive operator
intervention. A closed‐loop control system using the output of internal oxygen meters
to vary the flow rates set by mass flow meters is one way to ensure steady operation. One such
system — NITRAPILOT™ control system—has been developed by BOC Gases as a stand
alone system that can be added to existing equipment. The results of small‐scale and
production level testing on this system are described in the present paper. Reduced flow rates
can be achieved for stable set point oxygen levels at critical locations. An equally significant
benefit, particularly when used in conjunction with data logging, is that the system assists in
statistical process control since it ensures, monitors and logs compliance with process recipes
without operator intervention.
Heated Gas Jet Reflow: An Alternative
Reflow Solder Assembly Process Technology*
Authors: Lichtenberg L.R. , Gillespie P.J.
Published: June 2007

A new product design required the addition of a second
layer of electronics to control a base module. This product was designed with significant
overhangs of heavy leads and components which presented a significant challenge to many
different solder assembly processes. Only the heated gas jet process was able to solder the
product successfully without damaging the printed wiring boards.

To answer the
challenge, a new machine was developed, combining dispensing of solder paste with hot gas jet
reflow technology. This provided a combination of capabilities resulting in a flexible process
which was significantly superior to alternative technologies.

Other soldering processes
such as laser, focused xenon lamp, robotic soldering iron, and focused IR soldering technologies
were evaluated. Each of these technologies causes some damage or defect to the assembly due to
the heat sinking aspect of the circuit assembled. These alternative processes would create
damage or defects to the assemblies by burning the laminate, delaminating the pads on the
printed wiring board, or not soldering the pads.

Proof of concept tests before machine
designs were initiated demonstrated the potential and capabilities of this technology for
automated assembly soldering. Testing indicated that the heated gas jet processing would
provide a means of soldering the assemblies at a controllable rate without damaging the circuit
boards.

While evaluating the machine ion its design phase, a designed experiment was
initiated to help understand the relationships between head temperature settings versus gas flow
rates, the measurable output was time to reflow.

The process meets all expectations in
terms of solder fillet appearance, volume, and overall visual quality while maintaining process
cycle time requirements.
Microstructurally Based Finite Element Simulation
on Solder Joint Behaviour*
Authors: Frear D.R. , Burchett S.N. , Neilsen M.K. , Stephens J.J.
Published: June 2007

The most commonly used solder for electrical
interconnects in electronic packages is the near eutectic 60Sn‐40Pb alloy. This alloy has
a number of processing advantages(suitable melting point of 183°C and good wetting
behaviour). However, under conditions of cyclic strain and temperature
(thermomechanical fatigue) the microstructure of this alloy undergoes a
heterogeneous coarsening and failure process that makes the prediction of solder joint lifetime
complex. A finite element simulation methodology to predict solder joint mechanical behaviour,
that includes microstructural evolution, has been developed. The mechanical constitutive
behaviour was incorporated into the time‐dependent internal state variable viscoplastic
model through experimental creep tests. The microstructural evolution is incorporated through a
series of mathematical relations that describe mass flow in a temperature/strain
environment. The model has been found to simulate observed thermomechanical fatigue
behaviour in solder joints.
The Development of High Speed Printing Solder
Pastes for Fine Pitch Applications*
Authors: Warwick M. , Harpley I.
Published: June 2007

‘Fine Pitch’
and ‘High speed printing’ are relative terms but many solder paste users see
capability in meeting these two requirements as their major goals for process improvements. Not
surprisingly, solder paste rheology governs both, and this paper describes how the complex
relationship between resins and solvent can lead to solder pastes with optimised performance.
Work on the physical behaviour of resin solutions and how this relates to solder paste rheology is
reported. These results are related to user experience on volume production processes.
Solder Reliability Solutions: A PC‐based Design‐for‐reliability Tool*
Authors: CIech J.‐P.
Published: June 2007

This paper presents a solder joint engineering reliability model — Solder Reliability Solutions** (SRS) — and its application to surface mount area‐array and chip‐scale assemblies. The model is validated by failure data from 33 accelerated thermal cycling tests, and test vehicles covering several generations of component, assembly and circuit board technologies and a variety of test conditions. The SRS model has been implemented as a PC‐based design‐for‐reliabilltytool that enables rapid assessment of assembly reliability in the early stages of product development.
Getting Ready for Lead‐free Solders*
Authors: Lee N.‐C.
Published: June 2007

This paper reviews the status of lead‐free solder development works. Some of the solder systems — Bi‐Sn,
Bi‐Sn‐Fe, ln‐Sn, Sn, Sn‐Ag, Sn‐Ag‐Zn,
Sn‐Ag‐Zn‐Cu, Sn‐Bi‐Ag, Sn‐Cu,
Sn‐Cu‐Ag, Sn‐In‐Ag, Sn‐Sb, Sn‐Zn and
Sn‐Zn‐ln — are discussed in more detail, while others are briefly commented
on. In general, compared with eutectic Sn‐Pb solder, all the lead‐free solder
alternatives investigated more or less exhibit some shortcomings, such as price, physical,
metallurgical or mechanical properties. Relatively, Sn‐ln‐containing systems
are more promising in terms of solder mechanical properties and soldering performance,
although the price of ln may be a concern. Eutectic Sn‐Ag solder doped with Zn, Cu or
Sb exhibits good mechanical strength and creep resistance, due to refined microstructure. The
Bi‐Sn systems doped with other elements may have a niche in the low temperature
soldering field. Eutectic Sn‐Cu has good potential due to its good fatigue resistance. The
eutectic Sn‐Zn system modified with ln and/or Ag may be promising in terms of
mechanical properties. Finding a lead‐free alternative for high temperature solders
presents the biggest challenge to the industry.
International textile and clothing research register
Authors: Stylios George K.
Published: June 2007

Examines the ninth published year of the ITCRR. Runs the whole gamut of textile innovation, research and testing, some of which investigates hitherto untouched aspects. Subjects discussed include cotton fabric processing, asbestos substitutes, textile adjuncts to cardiovascular surgery, wet textile processes, hand evaluation, nanotechnology, thermoplastic composites, robotic ironing, protective clothing (agricultural and industrial), ecological aspects of fibre properties – to name but a few! There would appear to be no limit to the future potential for textile applications.
International textile and clothing research register
Authors: Stylios George K.
Published: June 2007

Examines the tenth published year of the ITCRR. Runs the whole gamut of textile innovation, research and testing, some of which investigates hitherto untouched aspects. Subjects discussed include cotton fabric processing, asbestos substitutes, textile adjuncts to cardiovascular surgery, wet textile processes, hand evaluation, nanotechnology, thermoplastic composites, robotic ironing, protective clothing (agricultural and industrial), ecological aspects of fibre properties – to name but a few! There would appear to be no limit to the future potential for textile applications.
International textile and clothing research register
Authors: Stylios George K.
Published: June 2007

Examines the twelfth published year of the ITCRR. Runs the whole gamut of textile innovation, research and testing, some of which investigates hitherto untouched aspects. Subjects discussed include cotton fabric processing, asbestos substitutes, textile adjuncts to cardiovascular surgery, wet textile processes, hand evaluation, nanotechnology, thermoplastic composites, robotic ironing, protective clothing (agricultural and industrial), ecological aspects of fibre properties – to name but a few! There would appear to be no limit to the future potential for textile applications.
Investigating the development of digital patterns for customized apparel
Authors: Yang Yunchu , Zhang Weiyuan , Shan Cong
Published: June 2007

Purpose

The paper aims to provide an overview of the area of digital pattern developing for customized apparel.

Design/methodology/approach

The paper outlines several methods of digital pattern developing for customized apparel, and discusses the principles, characters and applications. Digital pattern developing process has two paths. One path develops apparel according to traditional 2D pattern‐making technology. There are three methods: parametric design, traditional grading technique, and pattern generating based on artificial intelligence (AI). Another path develops pattern through surface flattening directly from individual 3D apparel model.

Findings

For parametric method, it can improve greatly the efficiency of pattern design or pattern alteration. However, the development and application of parametric Computer‐Aided‐Design (CAD) systems in apparel industry are difficult, because apparel pattern has fewer laws in graphical structure. For grading technique, it is the most practical method because of its simple theory, with which pattern masters are familiar. But these methods require users with higher experience. Creating expert pattern system based on AI can reduce the experience requirements. Meanwhile, a great deal of experiments should be conducted for each garment with different style to create their knowledge databases. For 3D CAD technology, two methods of surface flattening have been outlined, namely geometry flattening and physical flattening. But many improvements should be done if the 3D CAD systems are applied in apparel mass customization.

Originality/value

The paper provides information of value to the future research on developing a practical made‐to‐measure apparel pattern system.
Investigating the positioning edge accuracy of sensors in textile and clothing manufacture
Authors: Nikolić Gojko , Čubrić Goran
Published: June 2007

Purpose

This paper seeks to pursue the research of different types of sensors suitable for positioning edge accuracy of textile material.

Design/methodology/approach

A measuring device is used to install different types of sensors on the slide holders and to change their interspace as well as the space between the sensors and textile fabric.

Findings

The new measuring equipment has been established.

Research limitations/implications

Only the results of woven fabric measurement are analyzed in this paper, while the results of knitted and nonwoven fabric measurement will be elaborated in the future papers.

Originality/value

The measuring equipment is original.
A smart sensor for compression measurement in automotive textiles
Authors: Drean Emilie , Schacher Laurence , Adolphe Dominique , Bauer François
Published: June 2007

Purpose

For size reasons, adapted sensors, able to measure intrinsic mechanical properties of fabrics, have not been developed yet. The study aims at developing a sensor that can be inserted within a specific textile, a “complex” fabric used as seat‐cover fabrics, and consisting of an assembly of three layers.

Design/methodology/approach

Piezoelectric polymer sensors containing polyvinylidene fluoride (PVDF) were chosen. A total of 20 “complex” were studied. A characterisation in compression was achieved, using the Kawabata Evaluation System. The best‐adapted measurement method using a PVDF sensor has been required. The method consists in analyzing the response under compressive stress of a PVDF disc using the resonant frequency of the material. A constraint series is applied to the fabric in the sensor area; the maximal phase at the sensor's resonant frequency is taken up for each one.

Findings

Phase variation is linear and differs according to the studied “complex”. A correlation study between Kawabata compression parameters and slopes did not show any relationship between slope values and compression properties when the surface fabrics of “complex” are compared, but a classification in “families” is possible when different foams are considered.

Research limitations/implications

Further studies should demonstrate whether these “smart” textiles could find applications in the automotive field, to measure accurately the mass of a passenger. The influence of the external parameters (vibrations, temperature variations) has to be checked, knowing that the sensor is not depending on moisture. To complete the study, the sensor has to be tested in a real situation, i.e. inserted in a car‐seat, in contact with a human body.

Originality/value

This study promises development of a sensor that can be inserted into a specific textile, a “complex” fabric used as a seat‐cover, consisting of an assembly of three layers.
Assessing the market valuation of e‐service initiatives
Authors: Lin Jiun‐Sheng Chris , Jang Woan‐Yuh , Chen Kuan‐Jiun
Published: June 2007

Purpose

This study aims to examine how e‐service initiatives affect a firm's market valuation. To provide further insight, paper also assesses the impact of technology acquisition mode, the firm's organizational position, industry characteristics, and service introduction strategy on firm value.

Design/methodology/approach

Using an event study methodology, we examined the market value of e‐service initiatives through their impact on stock returns‐investors' expectations of firm performance. Based on strategy and marketing theories, we also developed a conceptual framework to examine factors that influence firm performance and value.

Findings

Findings include positive abnormal returns accompanying e‐service announcements. Regression results also show market size and firm size have negative effects on valuation while firm experience has positive effects on firm value. Whereas pioneers and late entrants have an advantage over early entrants, firms acquiring needed technology through collaborative R&D or using diversification expansion strategies experience increased returns. Results are consistent across diverse industry types.

Research limitations/implications

Based on concepts derived from extant marketing strategy and technology management research, this research provides a new perspective for examining the performance implications of e‐services introduction by developing an integrated framework that identifies a comprehensive set of factors that shape the market valuation of e‐service initiatives. Future research can further evaluate the performance effects of e‐service initiatives on other dimensions of corporate performance as well as track the performance before and after announcements to give further insight into effective corporate strategies and long‐term investigation.

Practical implications

When firms initiate e‐services, technology acquisition mode, organizational position, industry characteristics, and service introduction strategies affect financial performance, and therefore, should be accounted for by managers. Recognizing value drivers and their varying effects on performance can provide managers with insights into developing e‐services.

Originality/value

This study presents a framework integrating various performance‐influencing forces at work when a firm initiates e‐services. This framework helps practitioners and researchers in clarifying the importance of e‐service initiatives and the fit of such services with performance‐affecting factors.
Self‐service technology and online financial service choice
Authors: Ding Xin , Verma Rohit , Iqbal Zafar
Published: June 2007

Purpose

The application of self‐service technology in transaction‐based e‐service (e.g. online financial services) creates a challenge for firms: what combination of features should they offer to satisfy needs from different customer segments? This paper seeks to address the above question by highlighting similarities and differences of consumer preferences among self‐service, hybrid service and professional service segments for online financial services.

Design/methodology/approach

This study employs a web‐based discrete choice experiment, in which 1,319 consumers were offered different account alternatives, which include features for self‐service and professional assistance, price per transaction, and promotion offers.

Findings

The results demonstrate that overall, consumer preferences for features of online financial services differ across segments. Moreover, with the variation in the strength of self‐reliance, interesting trends regarding the relative importance of features are observed. With the given customer segments, this study also identifies several demographic features with significant effects on the choice of service alternatives through a multinomial logistic model.

Originality/value

The authors believe that these results have both managerial and research implications for design and operations strategy formulation for online financial services.
New Service Opportunities in the E‐grocery Business
Authors: Småros Johanna , Holmström Jan , Kämäräinen Vesa
Published: June 2007

Currently, efforts in the e‐grocery business focus on improving the purchase transaction and physical distribution of goods. However, simply improving ordering and fulfillment does not make e‐grocery shopping a viable competitor to the current supermarket business model. To become a profitable growth business, the e‐grocers have to offer their customers more value. It is not enough to offer customers a range of physical products. A range of new meaningful services is also needed. This article investigates how such new, breakthrough services can be developed. A framework for systematically examining customer demand and identifying corresponding services is presented. The importance of the e‐grocer being able to offer the right mix of services to meet the customers' individual and changing needs is demonstrated. Concrete examples of both new services and a service mix are described.
Assessing Logistics Technology Adoption Time with Event History Analysis
Authors: Dadzie Kofi Q. , Lee Euehun , Dadzie Evelyn W.
Published: June 2007

This article addresses the issue of adoption timing in the diffusion of logistics technology. An event history analysis of warehouse automation technologies confirms the conceptual soundness of this relatively new procedure for predicting adoption of logistics technology. Implications for logistics technology research and managerial practice are presented.
Unlocking the Supply Chain to Build Competitive Advantage
Authors: Walker Brian , Bovet David , Martha Joseph
Published: June 2007

Customer demands on manufacturers and retailers are increasing relentlessly. Spurred by the Internet's “click it and get it” value proposition, a growing number of consumers and business buyers want customized products, convenient ordering, and rapid fulfillment. Delivering against these rising expectations is not easy, however. This is especially true for traditional or incumbent companies that have additional cultural obstacles to overcome. Companies have mastered the challenges of speed, convenience, and reliability and are gaining competitive advantage.
Supplier Base Management: Experiences from the UK and Germany
Authors: Lemke Fred , Goffin Keith , Szwejczewski Marek , Pfeiffer Rolf , Lohmüller Bertram
Published: June 2007

Streamlining the supplier base is a common approach in many US and UK manufacturing companies. However, is this approach being adopted in Germany as fast as it has in the UK? This paper describes research that answers this question and investigates how German companies are managing contacts with their suppliers. The research was conducted in two stages. First, a postal survey of German and UK manufacturers identified the supplier base trends. Second, a follow‐up telephone survey of a random sample of German plants investigated supplier management processes. The findings show that German manufacturers have not reduced their supplier base by as much as their UK counterparts. However, German manufacturers that have reduced their supplier base perceive significant benefits. Currently, many companies appear to have failed to recognize the potential of working with a reduced supplier base.
Process Reengineering in Port Operations: A Case Study
Authors: Paik Seung‐Kuk , Bagchi Prabir K.
Published: June 2007

In the age of globalization, seaports play a vital role in connecting national supply chains to the global marketplace. Improving port operations has become a priority for many countries. One of the ways to achieve this objective is process reengineering. This paper reviews the IT‐enabled reengineering process at Pusan Port, South Korea. The paper examines the issues and problems leading to process reengineering, the steps involved in the reengineering process, and major performance improvements. Lessons learned from the case have been highlighted for the benefit of port planners in developing countries. The case can thus form the baseline on which further adaptation can be made to suit their specific needs.
Supply Chain Metrics
Authors: Lambert Douglas M. , Pohlen Terrance L.
Published: June 2007

Most discussions and articles about supply chain metrics are, in actuality, about internal logistics performance measures. The lack of a widely accepted definition for supply chain management and the complexity associated with overlapping supply chains make the development of supply chain metrics difficult. Despite these problems, managers continue to pursue supply chain metrics as a means to increase their “line of sight” over areas they do not directly control, but have a direct impact on their company's performance. We provide a framework for developing supply chain metrics that translates performance into shareholder value. The framework focuses on managing the interfacing customer relationship management and supplier relationship management processes at each link in the supply chain. The translation of process improvements into supplier and customer profitability provides a method for developing metrics that identify opportunities for improved profitability and align objectives across all of the firms in the supply chain.
The Impact of Outsourcing on Inbound Logistics Flows
Authors: Svensson Göran
Published: June 2007

This research explores the linkage between firms' outsourcing activities and the occurrence of supply chain disruptions. It is based upon a two‐phase process utilizing methodological triangulation. Phase one applies qualitative methods that explore the overall environment of outsourcing and disruptions in supply chains in the automotive industry based upon a case study of a Swedish car manufacturer. Phase two applies quantitative methods to test the findings from phase one in a wider context in the automotive industry. The results indicate that there is a significant association between the outsourcing of internal activities and the occurrence of disruptions in firms' inbound logistics flows from subcontractors.
Recent Reforms in Customs Administrations
Authors: Haughton Michael A. , Desmeules Rémi
Published: June 2007

Positioned at the nexus of import/export flows, customs authorities represent a significant node in a firm's global supply chain network. In light of the traditional need for physical inspection of goods by customs authorities, the significance of this node is often viewed in terms of its potential disruption to the network flow. Customs reforms that aim to facilitate the international flow of goods (trade facilitation) are thus easily regarded as measures to reduce the supply chain inefficiencies of these disruptions. The readiness with which the resulting improvements can be envisioned and have been cited contrasts sharply with the limited research into the corresponding potential challenges involved in global logistics management. This paper's primary purpose is to deduce the nature of these challenges, not only for practice in the area of global logistics, but also for research in that area, an area in which the significance of customs authorities has received little treatment. Systematic qualitative analyses of existing and proposed reforms based on the trade facilitation philosophy provide the bases for the deductions.
Partnerships in UK Defense Procurement
Authors: Humphries Andrew S. , Wilding Richard
Published: June 2007

Since the 1998 Strategic Defense Review, the UK Government reversed its competition policy and now seeks to improve defense procurement relationships with industry through partnering. However, at a time when the defense industries are concentrating and globalizing and more and more of the large contracts are being managed under monopoly conditions, substantive relationship improvements are hard to find. The author's propose that a Transaction Cost Economics Market Failure model provides insights into solving the defense procurement problem by focusing the combination of supply chain factors, which result in successful partnerships within a sustained monopoly. The results of a pilot project justify the approach and suggest that the main program will both extend knowledge in an area that has received little attention by management researchers and also offer practical guidance to managers.
Supply Chain Management under the Threat of International Terrorism
Authors: Sheffi Yossi
Published: June 2007

On the morning of September 11th, 2001, the United States and the Western world entered into a new era ‐ one in which large scale terrorist acts are to be expected. The impacts of the new era will challenge supply chain managers to adjust relations with suppliers and customers, contend with transportation difficulties and amend inventory management strategies. This paper looks at the twin corporate challenges of (i) preparing to deal with the aftermath of terrorist attacks and (ii) operating under heightened security. The first challenge involves setting certain operational redundancies. The second means less reliable lead times and less certain demand scenarios. In addition, the paper looks at how companies should organize to meet those challenges efficiently and suggests a new public‐private partnership. While the paper is focused on the US, it has worldwide implications.
The Scope and Span of Supply Chain Management
Authors: Mejza Michael C. , Wisner Joel D.
Published: June 2007

Studies on supply chain management suggest that the scope of business processes being coordinated across supply chains is broad. However, little empirical evidence exists that corroborates such claims. In this study executives randomly selected from a diverse array of industries were surveyed to determine the scope of processes that are being integrated across organizational borders, the extent to which they are being jointly managed, and the span in terms of the number of tiers across which they are being managed. The results indicate that a large proportion of companies that practice supply chain management are attempting to integrate logistics, marketing, and operations‐oriented processes with those of other companies in their supply chains. Also, the span of a company's supply chain management efforts significantly relates to the extent to which it jointly manages business processes with other firms.
The Collaborative Supply Chain
Authors: Simatupang Togar M. , Sridharan R.
Published: June 2007

Intensive competition in the market place has forced companies to respond more quickly to customer needs through faster product development and shorter delivery time. Increasing customer awareness and preferences have led to an unprecedented explosion in product variety. End customers give credit only to companies that are able to deliver products with excellent quality, and on time. However, the demand of customers for product variety, especially in the case of short life‐cycle products such as food, apparel, toys, and computers, makes it difficult for manufacturers and retailers to predict which particular variety of the products the markets will accept. To be effective in matching demand with supply, manufacturers and retailers need to collaborate in the supply chain.
Logistics Organizations: Ideologies, Principles and Practice
Authors: Johannessen Stig , Solem Olav
Published: June 2007

The expanding focus on logistics management makes it necessary to rethink the concept of logistics organizations. In addition, there is a need for clarification of the relations between the practices of these organizations and the basic thinking that underlies their behavior. The paper presents a framework for understanding these relations by identifying certain teleological and ontological fundamentals of logistics organizational ideologies. We suggest certain principles and organizational practices that are underpinned by these ideologies. Furthermore, given the changes logistics organizations are experiencing today, we discuss how the changes are viewed within the various ideologies. We conclude that there is a need for improved ability to deal with change within logistics organizations, and that this can be achieved by adopting new theoretical and practical perspectives into the established ideologies of these organizations.
The Role of Customer Service in Trade Promotion Decisions
Authors: Daugherty Patricia J. , Kasulis Jack J. , Glenn Richey R.
Published: June 2007

Trade promotions have become an important instrument in accomplishing supply chain objectives. The extensive use of trade promotions does not appear likely to fade in the immediate future. Results of a recent survey of independent grocery retailers are presented. The research examines the importance of customer service in influencing which vendor's trade promotions are accepted. Customer service was found to be highly important in promotion selection decisions.