bluuebunny/crossref_metadata_2025 huggingface dataset:
Detecting a security breach and pinpointing its source
Authors: Huntley Dave
Published: January 2021

There are many rapidly emerging technologies to embed a “Root of Trust” (RoT) in silicon or in assembled packages and PCBs further down the supply chain. These all aim to provide an un-hackable proof of device identity and uncompromised firmware. Despite these efforts we can, and should, assume that bad actors will succeed to counterfeit devices, install malware, etc. So how do we detect and respond to these attacks in time before they cause too much harm? This is, of course, of particular concern for defense and aerospace applications.

We will discuss an initiative at SEMI to provide asset traceability through the supply chain. The intention is to detect counterfeits and security attacks quickly, track them back through the supply chain and identify the culprit. The threat of capture and penalties is expected to reduce the incentive for the bad actors in future.

The proposed SEMI standard will define the transactions and data required to record chain of custody for electronic assets as they flow through the supply chain. These transactions will be recorded on Hyperledger Fabric, a blockchain platform which offers an immutable transaction ledger, maintained within a distributed network of peer nodes. The ledger will not be public (like bitcoin), nor will it be private to one organization. Instead it will follow a consortium model and be permissioned to support flexible trust assumptions.

The SEMI standard will facilitate supply chain members to form one or more consortiums and host the Hyperledger nodes. This will enable the early detection and response to counterfeit and security threats to electronic assets that the supply chain members manufacture or distribute. The standard takes care not to expose any confidential technical or commercial information. However, Hyperledger offers the concepts of private data collections and channels to allow for the sharing of private data between specific members. This could become an enabler to realize the data sharing required to meet Smart Manufacturing 4.0 objectives.

There are a number of similar chain of custody ledger initiatives underway both in the commercial and standards arena. The hope is that the SEMI standard will encourage these systems to merge into an industry wide consortium with increased interoperability, performance, reliability and security.
Reliability Simulation of Cu/Polymer interface in Fan-out Wafer Level Packaging
Authors: Okada Yuji , Fujii Atsushi , Ono Kenta , Kariya Yoshiharu
Published: January 2021

In order to improve the performance and reliability of the package, the interlayer dielectric (Polymer) must not be delaminated and materials should not fracture due to thermal stresses during the operation or the manufacturing process. If the reliability of the package can be known in advance by simulation, it can be expected to greatly help in material selection and package design. Firstly, we created material-specific master curves (time–temperature superposition) by considering the measurement results of the Peel Test at the Cu/Polymer interface and the mechanical properties of polymer. The critical Energy Release Rate (𝒢𝒸) could be calculated by its master curve. Secondary, we calculated the Energy Release Rate (𝒢) from Finite Element Analysis (FEA) in the package model structure. Finally, delamination is judged by normalizing 𝒢/𝒢𝒸. This study has made it possible to simulate the delamination possibility of Cu/Polymer interface at arbitrary temperatures and displacement rates from basic material data and FEA analysis of the package model structure.
Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology
Authors: Nakamura Eiji , Aoki Toyohiro , Yamaguchi Ryota , Sekine Nobuhiro , Sueoka Kuniaki , Marushima Chinami , Yatsugi Kenichi , Yada Makoto , Hisada Takashi
Published: January 2021

We have previously developed a novel plating-free bumping process using Cu nanopaste and Injection Molded Solder (IMS) technology. In the present study, we investigated the further detail about the microstructural and mechanical properties of sintered Cu nanoparticles formed into a pillar shape. By analyzing cross-sections of Cu nanoparticle pillars sintered in various conditions, we clarified how the sintering conditions affect the microstructural features, including the size and numbers of Cu grains and voids inside sintered Cu nanoparticles. In addition, we conducted the shear testing for the obtained Cu pillars to evaluate relationships between the mechanical strength and the microstructural features. We found that the results of the shear testing were consistent with the microstructural features of the sintered Cu nanoparticles. Finally, we injected molten solder onto the Cu nanoparticle pillars to evaluate the overall feasibility of the developed process. It was confirmed that the molten solder injected by IMS process has good wettability against the sintered Cu nanoparticles, which resulted in the successful bump formation without solder missing. In addition, The IMC layer between the sintered Cu nanoparticles and injected solder was formed well. These results proved the quality of microbumps fabricated by the novel bumping process using Cu nanopaste and IMS.
Ultra-thin Flip-Chip Assembly for Heterogenous and Hybrid Integration
Authors: Hackler Douglas , Prack Edward
Published: January 2021

Flip-chip packaging of thin-die, in fact any packaging of thin-die, is one of today’s most significant challenges for die handling. Despite the difficulties presented as the thickness of chips continues to decrease, the wide range of applications they have enabled across multiple industries has led to increasing interest, as evidenced by the growth in the cumulative total number of publications on thin silicon based electronics, including Ultra-Thin Chips (UTCs), thinning of Silicon-on-Insulator, and wafer thinning. Smart devices including labels, loggers, wearables, implantable medical, and IoT are in demand. A key area of difficulty in the packaging of thin chips comes from removing the individual chips from dicing tape due to the adhesive nature of the tape and die cracking and edge chipping characteristic of thin die.

As the industry continues to embrace the benefits afforded by thin devices, two trends are being witnessed. Devices continue to grow larger in area and thinner in thickness. American Semiconductor’s automated production process for packaging and assembly of chips ≤35um in thickness will be presented. This includes details regarding needleless die eject, pick tip design for ultra-thin devices, ultra-thin flip-chip interconnects, thin-chip overcoat, process controls, and assembly on flexible circuit boards (FCB).
Parameter Optimization for Unstable Pin Bonding
Authors: Seppänen Henri
Published: January 2021

Plastic frame power modules with press-fitted or molded pins create challenging bonding conditions. Pin stability variations, from relatively stable to unstable within a single power module, makes it difficult to find process parameters that fit to all pins equally well. Also, tight space, full utilization of the pin surface for bonding and a large number of pins per module makes clamping solutions difficult or impractical. Therefore, we used process optimization to find optimal process parameters for the unstable pin bonds and active process control feature to reduce deformation variance in bonding. The study revealed the importance of the cleaning phase optimization for both sides of the pin stability variations. We found that ensuring a good cleaning phase, typically within first 10ms of the process on the unstable pins, significantly improved the quality of the bonds. Unstable pins tended to lift after bonding with traditional parameters, but demonstrated good shear strength with optimized parameters. Active process control ensured that all bonds reached optimal deformation, regardless of the pin stability. Generally, the best approach to reach good bond quality is to ensure an optimal bonding environment, including clean and stable bond pads. However, when it is not possible or practical to stabilize the bond pad, this study shows that carefully executed process optimization combined with the active process control can lead to robust bonding on unstable pins.
Plasma Surface Engineering: An Enabling Technology Designed to Clean and Protect Printed Circuit Boards
Authors: Pappas Daphne , Guist Sebastian , Ben Salem Dhia
Published: January 2021

Long term reliability and performance of printed circuit boards (PCBs) are strongly affected by the presence of surface contaminants from the manufacturing and assembly processes. Flux and solder residue, dust particles, oils and greases are often found on the assembled boards and can inhibit the successful application of conformal coatings that are used to protect the electronic components. Surface contaminants can cause coating delamination, dendritic growth, electromigration, corrosion and result in compromised coatings.

In the first part of this paper, the fundamental mechanism of plasma-induced removal of organic contaminants from PCBs will be presented. While vacuum based plasmas are considered the traditional solvent-free technology for surface cleaning, a new approach involving air plasma operating under atmospheric pressure conditions is gaining interest due to its adaptability for industrial inline processing. The low concentration of oxygen that is available in the plasma gas is effective in vaporizing organic contaminants leaving behind a clean surface.

Additionally, atmospheric plasma processes focusing on the development of functional nanocoatings on PCBs have been investigated. These plasma-enhanced chemical vapor deposition (PECVD) processes involve the delivery and vaporization of small volumes of solvent-free precursors that react with the plasma to form thin coatings on polymer substrates. Depending on the chemical structure of the precursor used, adhesion promoting, water repellant or electrical barrier coatings of 30–100nm thickness can be deposited. These protective functional coatings do not require any curing or special handling and no chemical waste is generated. The latest developments in atmospheric pressure PECVD for electronics protection will be presented in the second part of the paper. Besides the improvement of device performance and reliability, the application of PECVD has the potential to replace chemical substances such as primers known to have harmful impact on human health and the environment.
Advanced Low Df Dry film Build-up Material on Glass panel for 5G application
Authors: Kakutani Takenori , Guan Zhong , Suzuki Yuya , Ali Muhammad , Erdogan Serhat , Watanabe Atom , Kathaperumal Mohanalingam , Swaminathan Madhavan
Published: January 2021

This paper describes the demonstration of a low loss substrate (laminated glass) for high-frequency transmission using a dry film build-up material with low loss tangent (Df). This paper also evaluates filter characteristics and dielectric characteristics of the substrate in the mm-Wave band. The advanced low loss dry film build-up material was newly developed, and applicable to high frequency transmission. This material has a Df of 0.0025 at 10 GHz and also exhibits excellent adhesion and electrical reliability required for advanced dielectric materials. In addition, glass was used as a core material in this paper because of its excellent signal transmission characteristics compared to silicon wafers or organic substrates. To demonstrate the benefit of low loss materials for high frequency transmission, passive components for high frequency filter substrates were fabricated using - 6-inch square thin (0.2mm) glass panel with various build-up materials (Material A with a Df of 0.0025, and Material B with a Df 0.0042 at 10 GHz) laminated. Copper wiring patterns on the dielectric layers were fabricated by a semi-additive process (SAP). Circuit patterns with low pass filters and band pass filters were also fabricated. First, transmission characteristics and characteristic impedances were measured to check the electrical performance. The measured lowest transmission loss of < 1.43 dB at 39 GHz were achieved when Material A was applied as the build-up material. Second, biased-highly accelerated stress test (bHAST) was conducted to evaluate the reliability performance of the substrates with two build-up materials, Material A and a conventional material. The test condition was based on the JEDEC level 2 standard. The substrate with Material A retained good insulation properties over 300 hours of bHAST treatment, demonstrating its excellent insulating performance. In summary, Material A has been shown in this paper to exhibit reduced transmission loss in high-frequency filter substrates at millimeter wave frequencies.
Development of Dielectric Material Enabling Low Insertion Loss of Organic Substrates at Various Operational Temperatures
Authors: Hayashi Tatsushi , Lin Po Yu , Watanabe Ryoichi , Ichikawa Seiko
Published: January 2021

With IP traffic increasing by 10-fold over the last decade, together with limitation and cost increase due to shrinking semiconductor nodes have led to requiring technological breakthrough in the packaging of semiconductor devices especially those used in high performance computing (HPC).This increase in IP traffic has led to requirement for higher data speed transmission in these devices, and consequently packaging technologies that enable those solutions such as 2.5D packaging utilizing silicon interposers. Furthermore, in recent years, increasing number of dies are placed in a single package for these devices thereby making the size of silicon interposers larger. Thus, the design of organic substrates used in these devices, are also becoming ever complex often with multiple layers with long trace lengths for routing increased number of IOs and allowing for power and signal control management. In order to facilitate the high speed data transmission requirement with longer trace lengths, stable low insertion loss design of organic substrates are becoming significantly important even when devices are exposed at elevated humidity or higher temperatures due to surrounding environment or from dies heating. Additionally, as silicon interposers are increasing in size, preventing stress build-up, which can cause cracking between the interposer and the organic substrate, is also becoming paramount. These requirements have led to innovative materials to be developed to enable organic substrates to have these properties. In this paper, we present a new dielectric build-up material for use in advanced organic substrates, by combining newly developed original resin with existing formulation technology that meet these criteria of enabling lower insertion loss with design that reduces deterioration even at elevated humidity and temperature, and furthermore having high crack resistance during temperature cycle testing.
Cell Interconnections in Battery Packs Using Laser-assisted Ultrasonic Wire Bonding
Authors: Unger Andreas , Hunstig Matthias , Brökelmann Michael , Siepe Dirk , Hesse Hans J.
Published: January 2021

This paper presents the results of a series of bonding tests using a laser-assisted ultrasonic wire bonding process. Aluminium and copper wire, both 500 μm (20 mil) thick, were bonded to nickel-coated steel caps of type 21700 battery cells. Mechanical bond strength tests prove that laser-assisted wire bonding has significant advantages over room temperature wire bonding. For example, it can be used to reduce the process time with aluminium wire or to increase the bondability of copper wire on nickel-coated steel. The results show a direct relation between tool tip temperature and measured bond strength. The quality of the joints was effectively improved by heating the tool tip up to 430 °C. These advantages are the same as in classic thermosonic wire bonding, but without the major disadvantage of having to heat to whole package. The cell temperature was shown to remain safely below the critical 60 °C in any application.
An Oxide Wear Model of Ultrasonic Bonding
Authors: van Gogh Brandon , Benner Tioga , Seppaenen Henri , Tszeng Calvin , Sepehrband Panthea
Published: January 2021

A modeling approach is developed to better describe the relation between input electrical power and the physical reaction of the bonding system during ultrasonic bonding. The major distinction between this analysis and previously published works is to attempt to eliminate empirically driven correlations between the input power and the kinetics of the bonding process. Two models, a piezoelectric model and an ultrasonic bonding model, are combined in order to reach this goal. The piezoelectric model is used to calculate the desired forcing, amplitude, and frequency that is created by the piezoelectric transducer during the actual ultrasonic bonding process. For this process, a lumped parameter model, taken from literature, is used, that converts input current and voltage to velocity and position of the bonding tooltip, respectively. This model is then combined with an updated model of the relative amplitude between the bonding material and substrate as the ultrasonic bond is being formed. Our model differs from existing friction power models by utilizing the Archard Equation to account for the removal of the natural oxide film. The integrated model provides a relationship between the bond growth and the driving power. The analysis enables comparison between the transverse force on the bond tool and amplitude of the bond tool’s motion for different electrical input powers.
Evaluation of Emerging High Melting Point Lead-free Solder and Hybrid Sinter Paste as Attaching Material for Clip Bond Package
Authors: Le Fred Fuliang , van der Meulen Rinse , Leong Yoon Kheong , Balakrishnan Manoj , Guan Zunyu
Published: January 2021

High melting point (HMP) lead-free solder, hybrid sinter and transient liquidus phase sinter (TLPS) are the emerging lead-free alternatives for the potential replacement of high-lead solder. Lead-free solder is perfectly compatible with existing high-lead soldering processes for clip bond packages. The benefit of hybrid sinter is that it has much higher thermal and electrical conductivity than lead-free or high-lead solder. In this study, ten materials (including lead-free solders, hybrid sinter paste and TLPS) were first evaluated via die shear test. With the initial material screening, two lead-free solders (solder 1 and 2), two hybrid Ag sinter pastes (sinter i and ii) and one TLPS proceeded to internal sample assembly. For the lead-free solders, a process optimization with the aid of vacuum reflow was made to reduce void rate. Due to the slow and unbalanced inter-diffusion of Ag-Cu sintering than Ag-Ag sintering, optimizations to enhance the hybrid Ag sintering include Ag finishing for the die metallization and Ag plating for the clip and bond area of the leadframe. In 0-hour package electrical test, solder 1 and sinter i passed and were sent for reliability testing while solder 2, sinter ii and TLPS failed due to intermetallic compound (IMC) cracking, material bleeding and die cracking, respectively. In the reliability testing, a basic scheme of thermal cycling (TC) 1000 cycles, intermittent operating life (IOL) 750 hrs and highly accelerated temperature and humidity stress test (HAST) 96 hrs was defined for the early feasibility study. 1 of 75 sinter i units failed by TC 1000 cycles due to separation between silver sinter structure and die bottom metallization. Solder 1 passed the basic scheme without defects, and next the material workability and clip bond strength need to be improved to the equivalent level of high-lead solders.
Versatile TIM Solution with Chain Network Solder Composite
Authors: Mao Runsheng , Chen Sihai , Zito Elaina , Bedner David , Lee Ning-Cheng
Published: January 2021

A novel epoxy-based SAC solder paste TIM system has been developed with the use of non-volatile epoxy flux. Cu filler was added to the solder paste, with Cu volume % of metal ranged from 17 to 60 volume % of metal. Formation of semi-continuous high melting Cu chain network was achieved, with Cu particles bridged by the CuSn IMC. This chain network, at sufficient concentration, serves as skeleton and maintains the shape of the sandwiched solder paste layer, thus prevents further spread out at subsequent SMT reflow process, and also allowed formation of TIM joint even in the absence of solderable metallization on flip chip and packaging housing. This chain network hampered the flow of liquid solder, thus restrained the expansion of outgassing, and consequently resulted in low voiding. Existence of crevices was attributed to excessive oxide brought in by Cu particles, and appeared to increase with increasing Cu filler content. Presence of ductile solder within TIM joint promises high resistance against brittle cracking under stress. The Cu content could be further optimized between 17 and 33 volume % of metal to avoid flux bleeding and maintain good epoxy adhesion between TIM phase and parts. The 20°C thermal conductivity achieved was 6.1 W/mK, and could be up to about 13 W/mK with further epoxy flux optimization.
Selective laser sintering of glass-ceramic bonds using a defocused Nd:YAG laser
Authors: Murawski K. , Aristovich K. , Lancashire H.T.
Published: January 2021

Protecting miniature implantable electronics may require mm scale hermetic packages. Glass-ceramic bonding by selective laser sintering of glass sealing paste using a defocused Nd:YAG laser is presented. Glass sealing paste (FX11-036, Ferro) is screen printed onto alumina ceramic, clamped in contact with borosilicate glass, and laser treated while heating to 250°C. With the addition of defocusing and a heat source the glass paste reflowed and wetted both the alumina and coverslip surfaces, with an optimal effect between 10 mm and 15 mm defocusing. This method is promising to create electrically non-conductive hermetic seals at the mm scale.
Operational research as an instrument to address the critical gaps for effective treatment of tuberculosis in eastern Europe and central Asia
Authors: Korotych Oleksandr , Dadu Andrei , Yedilbayev Askar , Dara Masoud
Published: January 2021

Editorial
The battle of the tests: a Pyrrhic victory? A case note on the Supreme Court judgment in Peninsula Securities Ltd v. Dunnes Stores (Bangor) Ltd
Authors:   Partner, Herbert Smith Freehills LLP, London, Jephcott Mark , Kaufman Max ,   Senior Associate, Herbert Smith Freehills LLP, London, Gordon Ben ,   Trainee Solicitor, Herbert Smith Freehills LLP, London
Published: January 2021

In Peninsula Securities, the Supreme Court held that a restrictive covenant, granted in a lease to an anchor tenant of a shopping centre not to allow any retail unit in the centre to be leased to competing shops, does not engage the doctrine of restraint of trade. The question of its enforceability therefore hinges on whether the relevant covenant breaches competition law, and specifically whether it is anti-competitive by object or effect. This relatively straightforward conclusion of the Supreme Court in Peninsula Securities masks over 50 years of conflicting judgments and uncertainty in the area. Prior to Peninsula Securities, the majority decision of the House of Lords in Esso Petroleum v Harper's Garage gave rise to a ‘battle of the tests’: the majority opined that the doctrine of restraint of trade would only be engaged if the covenantor contracts to give up a freedom they already had (what has come to be known as the ‘pre-existing freedom test’; Lord Wilberforce, dissenting, formulated what came to be known as the ‘trading society test’ which is basically a rule of reason test. In Peninsula Securities, the Supreme Court clearly sided with the latter, but in reality neither test is likely to be considered in future challenges to an anchor tenancy restrictive covenant – the key question is whether it is anti-competitive, something which only the relevant facts of the case will determine.
Merger litigation: recent developments in the Competition Appeal Tribunal
Authors:   Barrister, St John's Chamber, Bristol, O'Regan Matthew
Published: January 2021

There has been a recent increase in merger litigation before the Competition Appeal Tribunal (CAT) against decisions of the Competition and Markets Authority, with 11 substantive judgments having been handed down by the CAT, the Court of Appeal and the Supreme Court since 2015. This article outlines the basis on which CMA merger decisions may be challenged before the CAT and considers the implications of recent judgments for merger investigations before the CMA in relation to jurisdictional and procedural issues, the substantive assessment of the effects of a merger on competition and the imposition of remedies where a merger has been found to substantially lessen competition.
Morally motivated protest in the face of orthodoxy – environmental crisis and dissent in Australian democracy
Authors:   Associate Professor of Law, La Trobe University, Bundoora, Australia, Rochford Francince
Published: January 2021

The circumstances in which civil disobedience is appropriate are, in most theories of justice, circumscribed and subject to preconditions. In his justification of the role of ‘ambivalent dissidents’, Habermas emphasizes the role of civil disobedience as a corrective to inadequacies in deliberative democracies. Other commentators have bolstered his commentary by exploring the conditions of social power that would justify civil disobedience in a deliberative democracy. This article continues such reflection on the conditions under which civil disobedience are justifiable in complex modern societies, building in particular, on the mass protests of Extinction Rebellion, and exploring the role of communicative freedom as a necessary precondition to the validity of civil disobedience. Manifestations of modern protest appear to inhibit speech: both progressive and conservative interests utilize strategies with potentially censoring effects. ‘No-platforming’, social media pile-ons and online shaming are deployed to effectuate ‘moral education’ in the face of orthodoxy, and defamation suits and other forms of strategic litigation are deployed to leverage existing forms of power. This article will reconsider Habermas' discursive will formation and the place of ‘no-saying’ and mass protest in an established democracy. Building upon the idea of ambivalent dissidents, the article will use the Australian experience to critique mass protest as dissent, and in particular to consider the conditions of environmental crisis justifying a suspension of discursive mediation of norms.
The strategy of Spain in the United Nations
Authors: Prokhorenko I. L.
Published: January 2021

The article explores potential, resources and strategy of Spain in the United Nations from the moment when the resolution of the socalled Spanish question was adopted and Spain joined this influential intergovernmental international organization in 1955 to the present date. The author focuses on key problems which directly deal with national interests of Spain, including: a dispute with the United Kingdom about the ownership of Gibraltar, perennial problem of the Western (Spanish) Sahara conflict management, the initiative and the UN programme Alliance of Civilizations, co-sponsored by Spain, Kosovo issue and the danger of internationalization of the political and institutional conflict in Catalonia, efforts by the Spanish central government to achieve sustainable development goals. By analyzing foreign policy resources of Spain, initiatives and activities of the country in the United Nations and its various specialized agencies over the years using the UN information materials, the author suggests that successful democratic transition and the country’s accession to the European Economic Community in 1986 strengthened the profile of Spain in the United Nations. However, the political and institutional transformations in the European Union, creation of political union of the Member-States and establishment and development of the EU Common Foreign and Security Policy mean that Spain may carry out its foreign policy in a ‘truncated’ form, taking into account the EU position as a special strategic partner of the UN and its expanded Observer status. The economic and foreign policy potential of this country weakening its competitive advantages under the influence of negative consequences of the global financial and economic crisis do not raise an issue about permanent membership of Spain in the UN Security Council. However, the ‘soft power’ resources based on its postimperial identity allow for a fairly high appreciation of possibilities of Spain with regard to monitoring, prevention and management of conflicts and crisis situations in developing countries of Asia, Africa and Latin America, providing international assistance for development and facilitating intercultural dialogue of the Western and non-Western civilazations.
SÍNDROME DE FATIGA POR COMPASIÓN EN EL PERSONAL OPERATIVO DEL ECU 911 DEL CANTÓN PORTOVIEJO
Authors: Cedeño-Meza Jorge Guillermo , Polit-Cadena Iván Roberto , Sala-Vélez Bárbara Dayana
Published: January 2021

Los operadores que tienen como labor fundamental socorrer o ayudar a los demás en momentos desagradables, están expuestos a sufrir algunas consecuencias que estarían muy relacionadas con las emociones y los recursos personales que tenga para poder sobrellevar las situaciones estresantes. Si bien es cierto, el trabajar en el servicio de emergencias te predispone a sufrir algún tipo de malestar psicológico, considerando que relacionarte directamente con las emergencias conlleva a desarrollar sentimientos de empatía y compasión que juegan un papel importante ya que al no ser regulados podría desencadenar en una disminución de respuesta, bienestar emocional y psicológico en los operadores, pudiendo así desarrollar el Síndrome de Fatiga por Compasión. Esta investigación mediante una extensa y profunda revisión bibliográfica pretende caracterizar el Síndrome de Fatiga por Compasión, además de medir los niveles de este a los operadores del ECU 911 mediante la aplicación del Test ProQOL identificando los síntomas asociados explorando las repercusiones psicológicas que genera el síndrome en las áreas laboral, familiar y social. Los resultados obtenidos describen que los operadores que laboran receptando las emergencias en el ECU 911 presentan un alto nivel con el 52% de fatiga por compasión.

Palabras claves: Síndrome, fatiga, compasión, empatía, operadores, estrés, problemas, salud.
MALTEADO Y VARIEDAD DE MAÍZ EN LAS CARACTERÍSTICAS FISICOQUÍMICAS Y SENSORIALES EN UNA BEBIDA REFRESCANTE
Authors: Moreira-Vera David , Ormaza-Loor Gema , Quiroz-Saltos Kevin
Published: January 2021

El objetivo de esta investigación fue determinar los efectos del malteado y las variedades de maíz sobre las características fisicoquímicas y sensoriales en una bebida refrescante. Se aplicó un diseño completamente al azar (DCA) en arreglo bifactorial A x B siendo el factor A tres variedades de maíz y el factor B la condición del maíz (malteado y sin maltear), obteniendo 6 tratamientos y se realizó tres repeticiones, resultando 18 unidades experimentales de 2000 ml de bebida refrescante. Las variables valoradas fueron: fisicoquímicas (pH, acidez, sólidos solubles y sólidos en suspensión) donde se detectaron diferencias significativas entre las bebidas con relación al pH, acidez y grados Brix, obteniéndose como mejores tratamientos al T1, T3 y T5, siendo éstas de condición malteado. En los análisis sensoriales (calidad general) realizado mediante la prueba de ordenamiento resultó como mejor tratamiento T5; En las pruebas microbiológicas realizadas a la bebida sobre Coliformes totales, Escherichia coli, mohos y levaduras reflejó ausencia.

Palabras clave: Maltear; maíz malteado, macerar; enzimas; bebida refrescante.
The Socio-hydrological Impacts of Oil Palm Plantations on Integrated Watershed Management:
Authors: Yazawa Taishi , Shimizu Yoshihisa
Published: January 2021

This paper aims to investigate the feasibility offlood management based onthe concept of Integrated Watershed Management (IWM) via a literature review and field surveys. The investigationfocused on the primary industry of oil palm plantations in Malaysia. Although the country is promoting the palm oil industry, the impact of oil palm plantations on the local environment has been relatively disregarded because of the benefits and opportunities, such as subsidies, jobs, and amenities,which the local companies/people can obtain. Effective flood management inoil palm plantations entails the local peoples’ understanding and participation in the management activities, such as removing fallen leaves and weeding an area. Theflood management strategiessuggested inthis research provide new insights into local flood management, which usually focuses on the hydrologic aspects, by promoting the integration of the actual-local environment and local people’s actions for their environment within the framework of IWM.
Implementation of Build Back Better (BBB) Framework in Achieving Sustainable Development Goals
Authors: Ayu Erlinna  , Suroso Djoko Santoso Abi , Dowon Kim
Published: January 2021

The occurrence of 7.5M earthquake and tsunami in Central Sulawesi in September 2018 resulted in2,045 fatalities and 67,310 damaged houses. In line with RIPBand SDGSs 11, the government has established a masterplan for rehabilitation and reconstruction of Central Sulawesi by adopting the build back better concept. This research triesto analyze the implementation of BBB framework which focuseson reducingthe risk ofhousing reconstruction in Duyu urban village, using the scale and index method. The result shows that the implementation of risk reduction fallsinto a moderate level although some indicators are still in the poor category. In accordance with SDGs, at least four key factorsrelated to disaster mitigation, specificallySDGs 11 –makingcities and human settlements inclusive, safe, resilient and sustainable -havebeen successfully achieved,which are: 11.5; 11.b1; 11.b2; and 11.c1. This result indicates that the Duyu housing reconstruction has gone through analysis and consideration ofrisk reduction practicesinvolvingfive variables by adopting the BBB framework in creating community resilience while achieving SDGs in Indonesia.
The Implementation of Urban Drainage Maintenance to Reduce Inundation Risk
Authors: Sari Wulan Nurindah , Atsushi Ichiki , Toshiyuki Shimizu , Dewanti
Published: January 2021

Coastal cities with low elevation and mild slopes tend to be more vulnerable to the threat of floods and inundations. Expansion of impermeable areas caused by land conversion greatly diminishes a city’s ability to cope with the threat. Urban drainage systems play a crucial role in controlling excess surface water and reducing the threat of flood and inundation. To maintain an urban drainage system within an optimumcondition and to reduce inundation risk, various types of drainage maintenance activities have been implemented in Tegal. This research was conducted in five inundationproneareas in Tegal to analyze the impact of those maintenance activities to urban drainage conditions andin reducing inundation. GIS and statistical analysis revealed that fromthe numerousurban drainage maintenance activities that have been performed, drainage sediment cleanuphas the most obvious impact on drainage conditions and in reducing inundation.
EXTENSÃO DA EVIDENCIAÇÃO DA RESPONSABILIDADE SOCIAL DE INSTITUIÇÕES DE ENSINO SUPERIOR FILANTRÓPICAS
Authors: Grigolo Jornada Francieli , Seibert Rosane Maria , Freire da Silva Raiziane Cássia
Published: January 2021

Este artigo tem como objetivo identificar a extensão da evidenciação voluntária de informações de responsabilidade social das Instituições de Ensino Superior Filantrópicas (IESFs) do Brasil, em suas páginas de Internet. O estudo foi feito a partir de uma lista de 80 indicadores previamente definidos, considerando o interesse dos stakeholders das IESFs. Foram observadas as páginas eletrônicas de Internet de 174 IESFs, definindo-se assim o índice de evidenciação de cada IESF. Os resultados indicam que na média as IESFs evidenciam apenas 25,29% dos indicadores, ou seja, em torno de 20 indicadores. A IESF que mais evidencia atingiu um índice de 51,25%, 41 indicadores e a que menos evidencia ficou com um índice de 5,00%, 4 indicadores. O desvio padrão foi de 10,00% demonstrando uma variação significativa na extensão de evidenciação das IESFs. Assim, confirma-se que as IESFs evidenciam poucas informações do interesse de seus stakeholders em suas páginas de Internet. Futuras pesquisas podem abranger outras IESFs que passaram a ter página de Internet, estruturada após a seleção dessa amostra. Por fim, esta pesquisa contribui com o conhecimento teórico e empírico sobre a evidenciação de responsabilidade social das IESFs e com os órgãos reguladores e fiscalizadores sobre evidenciação, que poderão estabelecer políticas de evidenciação para esse tipo de organização.
VARIAÇÃO DIACRÔNICA ENTRE JOVENS E IDOSOS EM UMA CIDADE PIAUIENSE
Authors: Nascimento Juscelino Francisco do , Santos Axel Brendon Leal dos
Published: January 2021

O objetivo deste artigo é apresentar alguns dados referentes à variação diacrônica na fala de jovens e de adultos, na cidade de Ipiranga do Piauí, e destacar como se dá a construção de sentido das expressões porra, caralho e foda na fala desses informantes. A metodologia empreendida neste trabalho se deu por meio de um estudo bibliográfico, com base, principalmente, em Calvet (2003), Labov (2008), Guérius (1956), Martellota (2018). Fizemos, ainda, uma pesquisa qualitativa, com a aplicação de um questionário, a fim de obter, dos participantes, informações acerca do uso das expressões supramencionadas, além extrair informações a respeito dos seus ambientes de interação e se esse também se enquadrava como um dos fatores responsáveis pela variação. Concluímos, assim, que a variação entre esses grupos intensifica o preconceito linguístico entre eles, em virtude da falta de conhecimento relacionado à variabilidade e à heterogeneidade da língua.
THE IMPACTS OF CLIMATE CHANGE ON ENERGY-WATER SYSTEMS AND ECONOMIC ANALYSIS
Authors: Javadinejad Safieh
Published: January 2021

In order to develop a valued decision-support system for climate alteration policy and planning, recognizing the regionally-specific features of the climate change, energy-water nexus, and the history of the current and possible future climate, water and energy supply systems is necessary. This paper presents an integrated climate change, water/energy modeling platform which allows tailored climate alteration and water-energy assessments. This modeling platform is established and described in details based on particular regional circumstances. The modeling platform involves linking three different models, including the climate change model from Coupled Model Intercomparison Project Phase 5 under the most severe scenario (Representative Concentration Pathways, Water Evaluation, and Planning system and the Long-range Energy Alternatives Planning system). This is to understand the impacts of climate variability (changes in temperature and precipitation) on water and electricity consumption in Zayandeh Rud River Basin (Central Iran) for the current (1971–2005) and future time period (2006–2040). Climate models have projected that the temperature will increase by 7 °C and precipitation will decrease by 44%, it is also proposed that electricity imports will rise during a severe dry scenario in the basin, while power generation will decrease around 8%.
PHYSICAL AND ENVIRONMENTAL EFFECTS OF GROUNDWATER TABLE RISING IN AJDABIYA, NORTHEAST LIBYA
Authors: Emhanna Saleh
Published: January 2021

The rising groundwater levels in Ajdabiya city have been considered one of the critical issues that the city suffered for years, where it is attributed to a lot of undesirable environmental and physical effects. Deterioration of infrastructure facilities led to health and economic consequences in different areas. The study aims to identify the causes of effects and feasible strategies to mitigate them. There are many causes that led to rising the groundwater level such as the leakage of domestic water pipeline and sewage network. It noted an absence of a rainwater drainage network and the adoption of only surface water for daily life usages. Furthermore, never ever the groundwater has been not exploited, which led to upward seepage more and more. Ten groundwater samples have been collected to conduct specific criteria which proved the mixing between the groundwater and sewage. Many projects can be adapted to maintain the groundwater upward seepage and manage the water supplies in the area using the conjunctive use of groundwater and surface water to optimize the water demand. The most important is avoiding all pollutants whether surface or/and subsurface by maintaining the sewage network and drainages. For a more comprehensive image, it is recommended to adopt geotechnical tools before suggesting the management plan
FORMATION EVALUATION FOR JERIBE FORMATION IN THE JARIA PIKA GAS FIELD
Authors: Abdulrahman Salam
Published: January 2021

The Jaria Pika Gas field is a domal anticlinal structure in the northeast of Iraq NW trending, about 3.6 km long and 1.9 km wide. The 55 m thick gas bearing Jeribe Formation is the main reservoir. This study intends to well log interpretation to determine the petrophysical properties of the Jeribe Formation in the Jaria Pika Gas Field. Total porosity, effect porosity, and secondary porosity have been calculated from neutron, density, and sonic logs. Porosity is fair to good in the Jeribe formation. From RHOB-NPHI and N/M cross plot, the Jeribe Formation is composed mainly of dolomite, limestone with nodules of anhydrite. The Fatha Formation contains considerable amounts of anhydrite layers, so it's represented the cap rocks for the Jeribe Reservoir which is recognized based on the reading of Gamma-ray log, Density log, Neutron log, and Sonic log. The Jaria Pika is considered as gas field as the Jeribe reservoir rocks are gas saturated ones.
What teachers know about the age development of a child's organism: questionnaire analysis
Authors:   Institute of Developmental Physiology of the Russian Academy of Sciences, Moscow, Russian Federation, Sonkin V.D. , Ivanov V.V. ,   Institute of Developmental Physiology of the Russian Academy of Sciences, Moscow, Russian Federation, Orlov K.V. ,   Institute of Developmental Physiology of the Russian Academy of Sciences, Moscow, Russian Federation
Published: January 2021

The paper presents the results of a study of more than 3.5 thousand teachers of kindergartens and three levels of school education using the method of questionnaire. The study was focused at teachers’ knowledge in the field of pedagogical physiology and physiology of development. No significant differences were revealed between teachers of different levels of education; there was no correlation between the level of knowledge and teachers’ experience or age. The subject area the teachers work in have a certain nfluence on the level of knowledge: biologists and the teachers of physical education give correct answers more often than other teachers. In general, the correct answers to the questionnaire were given by 50-60% of the respondents. The most difficult questions concerned the dynamics of growth and age-related periodization in the ontogeny. The results of the study may be used to develop the content and the structure of a training course for teachers’ additional education "Growth and development of a child"
Prevalence of Peptic Ulcer Disease among the Patients with Abdominal Pain at Tertiary Care Institute of Gujarat
Authors: Rahul Charpot  , Jaydeep M Gadhavi
Published: January 2021

Background: To establish the occurrence of peptic ulcer disease amid the Subjects with abdominal pain at tertiary care institute of Gujarat. Subjects and Methods: present research was performed at the Department of Surgery, tertiary care institute of Gujarat, for the period of one year in 200 patients with abdominal pain and diagnosed with peptic ulcer disease. Information was composed utilizing pre-designed questionnaire. Results:The majorities of participants was females, most were aged between 18 to 25 years. Around 97% had pain in the epigastric region. Gastric ulcers preponderate for 65% patients in current research, except refused during the later existence of the epoch, as the occurrence of duodenal ulcers stayed stable, however amplified rather the later phase. Conclusion: An extensive diversity of subjects with abdominal pain was documented amid the subjects. On the other hand, the socio-economic situation and educational levels of the Subjects with the illness were below par.
Ferritin as a Marker of Severe Dengue in Children
Authors: Sekhar Manchala Chandra
Published: January 2021

Background: The aim is to evaluate ferritin levels in fever caused by dengue virus and their association with the severity of infection with dengue virus in children. Subjects and Methods: It is a Prospective that was done for 1 year in the department of pediatrics. 56 reported cases with a history of dengue fever for clinical evaluation by positive IgG and IgM antibodies and positive NS1 antigen and were included in the sample. All 16-year-old subjects with clinical dengue suspicion presenting in the department of emergency. Results: Out of total of 56 children with mean age of the children were 11.5 years and SD 3.5 years, and 59% were male who were majority. Mean hospital stay duration was 5 3 days. Most of the patients in study discharged in 5-7 days of admission in hospital. The mean serum ferritin levels among cases with DHF were raised than those with DF with significant p-values of< 0.05 on Day 5 and 6 of illness. During Days 5, 6, and 7 after the onset of fever, the results for sensitivity were 83, 86, and 92 per cent respectively. Conclusion: The incidence of hyperferritinaemia in patients infected with dengue virus is suggestive of highly active use of ferritin level in serum is 1,200 ng/ml as a method for predicting progression to DHF starting on Day 4 of the disease and continuing to recover.
Proﬁle of Children Presenting with Epilepsy at a Tertiary Care Centre: A Hospital Based Cross Sectional Study
Authors: Suryavanshi Amol Ramrao , Bodhgire Sachin Bapurao , Phulari Shivaji Sangappa , Anerao Rahul Digambarrao
Published: January 2021

Background: Epilepsy is associated with significant mortality and morbidity. It is one of the common causes of childhood hospitalization. Regarding acute seizures episodes, there is limited data form the developing countries. This study aims to study the profile of children presenting with epilepsy at a Tertiary Care Centre. Subjects & Methods: This was a hospital based, prospective cross-sectional study conducted at the ‘epilepsy clinic’ of Paediatric department of a Tertiary Care Center. Total 260 children with epilepsy and having the age of 1 months to 12 years attending to the epilepsy clinic during the study period, were studied for clinical features, types, imaging studies, EEG, etc. Results: Most of the children (59.61%) affected with epilepsy were males. Majority of the cases (108) were in the age group 1 month to 1 year age. It was observed that, 185 cases (71.15%) were born through pre term delivery. It was found that 214 cases (82.31%) had abnormal EEG, 40 cases had abnormal CT scan and 46 cases had abnormal MRI. A significant number of children (60.38%) had generalized tonic clonic seizures. Conclusion: Epilepsy in children is a common indication for hospital admission. Evaluation of the type of seizure type with specific EEG findings and other related investigations helps in early and appropriate initiation of treatment. It is utmost important that the children with seizures should be on regular long term follow up and treatment, for better prognosis and disease outcome.