bluuebunny/crossref_metadata_2025 huggingface dataset:
Puentes con vigas pretensadas
Authors: Editorial Equipo
Published: November 2015

En este trabajo se describe uno de los tres puentes que Hidrocivil, S. A., ha construido.—previo concurso— en la región catalana; concretamente, el que salva el río Ripoll. Los otros dos no han sido objeto de descripción general por ser muy similares, en lo que a ejecución y concepción se refiere, con la única variante que presentan las características topográficas locales.
La empresa propuso ciertas variantes— que fueron aceptadas— en la prefabricación y métodos de construcción.
El interés de estas obras se centra en el empleo de vigas pretensadas, prefabricadas en taller por trozos, y solidarizados en el mismo mediante las operaciones de tesado de sesenta alambres de 7 mm de diámetro con que cuenta cada viga. Como en las juntas entre aquéllos se acentúan los esfuerzos cortantes, las extremidades de cada trozo van provistas de acartelamientos o diafragmas en los que, por tener gran superficie de contacto, se mejora por adherencia—la resistencia opuesta al referido esfuerzo.
Son también de interés los procedimientos constructivos empleados, que consisten, en síntesis, en levantar los soportes y apoyar en ellos una celosía de lanzamiento, provista de movimiento transversal, sobre la cual se han instalado dos puentes grúa que permiten llevar las vigas a su posición definitiva. Terminado el primer tramo se procede a hormigonar la losa del tablero, se corre la viga auxiliar de lanzamiento y se repiten las mismas operaciones en el nuevo tramo. En este caso no se requieren entramados provisionales.
Escuela en Düsseldorf, Alemania
Authors: Schneider-Esleben Paul
Published: November 2015

El conjunto consta de: un edificio principal con dos alas paralelas, de dos pisos, en los que están distribuidos los despachos y las aulas, y otro bloque, que alberga el gimnasio, servicios y dependencias anejas, unidos al ala E. por un paso cubierto con «elementos-sombrilla».
En la composición estética de este complejo, el color ha jugado un papel muy importante, combinándose los azules, naranjas, marrones y grises en vivo contraste. Los bancos, de preciosas formas, y las alegres fuentes, contribuyen, asimismo, a vivificar la rectangularidad del patio.
Teoría del hormigón armado tomando en consideración el esfuerzo cortante
Authors: López Jamar José Antonio , Tirado Cruz José Joaquín
Published: November 2015

Este artículo es un resumen, anticipo de la teoría original de los señores López Jamar y Tirado Cruz, sobre flexión compuesta de piezas de hormigón armado, tomando en consideración el esfuerzo cortante.
La pieza se asimila a una viga en celosía; la cabeza superior, constituida por la faja sin fisurar, trabaja a compresión excéntrica con esfuerzo cortante, lo mismo que las diagonales de hormigón entre fisuras. La cabeza inferior, constituida por la armadura longitudinal, y la otra serie de diagonales o montantes (que pueden no existir), trabajan prácticamente a tracción pura. Partiendo de una ley parabólica de tensiones normales longitudinales, se obtienen rigurosamente las de tensiones tangenciales y normales verticales de la faja no asurada. Asimismo, partiendo de una ley parabólica de las tensiones de los estribos, se hallan las leyes de tensiones «eficaces» del hormigón de la zona fisurada a lo largo de la sección transversal recta.
Estas leyes de tensiones permiten estudiar las resistencias parciales de las fajas fisuradas y sin fisurar, esta última mediante la resistencia intrínseca. Resulta así que el esfuerzo cortante es función principalmente de la deformación unitaria horizontal relativa de la fibra o nivel que alcanzan las fisuras.
Del estudio se deducen cuatro posibles formas de agotamiento: transversal simultáneo del hormigón y estribos, armadura longitudinal, fibra más comprimida y agotamiento superior de la pieza. El complicado sistema de ecuaciones resultante se resuelve electrónicamente, obteniéndose listados numéricos y gráficos para los diferentes casos y armaduras posibles, habiéndose efectuado una pri- mera comprobación mediante ensayos.
Yves Montand, Serge Reggiani, c’est nous… les Italiens ?
Authors: Mourlane Stéphane
Published: November 2015

Les itinéraires d’Yves Montand (Ivo Livi) et de Serge Reggiani s’inscrivent dans l’important courant migratoire en provenance d’Italie vers la France au cours des années 1920. Dans leurs singularités, ils éclairent, en particulier dans leur jeunesse, certains aspects généraux de cette migration. Leur carrière artistique, qui se déploie après la Seconde Guerre mondiale, témoigne d’un lien maintenu avec le pays d’origine selon des modes différenciés. Ils peuvent néanmoins être considérés tous les deux comme des vecteurs d’italianité en France à un moment où la mémoire de la migration tend à se diluer dans l’espace public.
Chanson et immigration portugaise en France : une musique du retour ?
Authors: Pereira Victor
Published: November 2015

Si la chanson française est, en partie, un « art de métèques » (Yves Borowice), force est de constater que rares sont les interprètes portugais ou d’origine portugaise, alors qu’autour de 1,2 million de Portugais ou de descendants de Portugais vivent en France. L’expérience des migrants portugais a été tardivement évoquée dans la chanson française. De plus, dans le champ musical, les Portugais et leurs descendants ont principalement investi une « scène à part » constituée par la musique folklorique et des chansons populaires interprétées en portugais. Cet article décrit comment la chanson française, interprétée par des chanteurs d’origine portugaise ou non, a évoqué les migrants portugais en France et quelles formes musicales ont développé et consommé une partie non négligeable des Portugais et de leurs descendants en France. Loin d’illustrer la soi-disant « intégration » des Portugais en France, ces chansons et ces pratiques musicales illustrent le fort attachement d’une partie de cette population au Portugal et alimentent l’idée du retour, réel ou fantasmé.
The Financial Development of Portuguese Entrepreneurial Businesses
Authors: Paiva Inna Sousa
Published: November 2015

Entrepreneurial firms commonly become family small businesses. This study aims to highlight the financial strategy underlying the development of smaller family companies. A brief introduction about the definition and role of the family business is followed by a review of the debate on the finance gap that puts constraints on the survival and long-term growth and prosperity of smaller privately companies. Evidence is drawn from a database of smaller firms with family owner-managers in Portugal, in order to determine their attitudes towards and experiences of venture capital and financing and other capital options. We conclude by discussing some tentative policy implications for regional development from the perspective of owner managers, service providers and policy-makers.
Transnational Acceleration of Local Startups
Authors: Carvalho Luís , Camacho Nuno , Amorim Gonçalo , Esperança José Paulo
Published: November 2015

This chapter explores the tenets and the practice of a transnational initiative to promote local entrepreneurial growth: the Building Global Innovators (BGI) model, a startup accelerator based in Lisbon (Portugal) and in Cambridge (Massachusetts, USA). We examine the pathways through which BGI's process and global network of experts helped two successful Portuguese technology startups grow and scale very quickly – Movvo and Veniam. We combine literatures from strategic management, marketing and economic geography to explore BGI's transnational acceleration model, which taps into global “pipelines” and distant entrepreneurial ecosystems, namely as a way to access the expertise, market opportunities and venture capital that is often unavailable in emergent and policy-sheltered local clusters. We discuss the relevance of such a transnational acceleration model for high-tech startups in peripheral economies.
Internationalization and Financial Performance
Authors: Teixeira Nuno , Rafael Bruno , Pardal Pedro
Published: November 2015

One of the main characteristics of current business environment is related to internationalization of companies and economies, where competitors from different countries with diverse cultures and production factors, easily clash for a position of supremacy in the markets. Thus, internationalization turned the management of organizations in a more complex act, increasing opportunities but also the risks of the business. As such, this paper aims to reflect on the main issues associated with companies' internationalization and the impact on their management process, in particular on financial performance. In addition, we intend to conduct a case study of a Portuguese company of information technology industry that through its internationalization strategy, managed in less than a decade, to increment the turnover from 10 million to 60 million euros, becoming one of the largest Portuguese groups in the sector and a worldwide success.
Entrepreneurial Tourism
Authors: Moreira António
Published: November 2015

The chapter presents an entrepreneurial perspective to rural tourism. It is based on the utilization of endogenous resources that exist within a rural region, and leads to a group of business opportunities related to tourism, craftwork, and agriculture, which are taken into account to define the strategic objectives for the ADRIMAG region. The chapter follows a qualitative approach to business opportunities. Through our analysis, it was possible to create, in a simple manner, a group of business opportunities based on the endogenous resources of the region. With this study, we expect to bring forth an entrepreneurial perspective that will sustainably foster tourism development within rural regions, but with high potential for tourism attraction.
Determinants of Self-Employment Entry
Authors: Simoes Nadia , Moreira Sandrina B. , Crespo Nuno
Published: November 2015

Self-employment is increasingly an attractive labor market option worldwide. In a European context, Portugal is well-known for displaying one of the highest rates of self-employment. This study explores the main determinants of the probability to enter into self-employment in Portugal. We present results from a binary logit model using individual data drawn from national-level statistics. Our findings suggest that individuals older than 35, males, married, low educated, individuals with previous experience, and heads of household are expected to enter self-employment. The empirical study also reveals important differences regarding households' compositions and dimensions, current and former unemployment levels, and at a regional level in Portuguese NUTS II.
How Spanish Universities are Promoting Entrepreneurship through Your Own Lines of Teaching and Research?
Authors: Gallardo-Vázquez Dolores , Pajuelo-Moreno M. Luisa
Published: November 2015

Two lines of research focus on this chapter: University Social Responsibility and entrepreneurship. Once Univesrities are aware of the importance of introducing socially responsible actions, we refer to the need of Universities to foster the creation of new business, establishing the best conditions for entrepreneurs. In this sense, we study what entrepreneurship means and how it is initiated. At the same time, we set the education on entrepreneurship and how gender differences condition the new creation of firms. Some examples of promoting entrepreneurship are discussed, from the initial actions until the maintaining and growing a company already created. Later, chapter concentrates on the particular case of Spanish Universities, offering a lot of actions for the promotion of entrepreneurship, like projects, awards, chairs, masters, conferences and meeting. It is also important to consider the support of public administration and the role of cluster. The chapter finishes with some considerations about spin off, as the result of entrepreneurship from the University.
The Region-of-Origin Effect
Authors: García-Gallego José Manuel , Chamorro‑Mera Antonio
Published: November 2015

The main objective of this chapter was to determine the variables that explain and moderate the intention to purchase regional a specific product, in particular, wine. Some of the selected variables were directly related to regional development. To achieve that goal, and based on the literature review, authors designed a structural model to study the ROO effect in the Spanish wine market. The model proposes direct and indirect effects of the following antecedent variables on the purchase intention: the region's image, the region's image as a producer in this product category, the perceived quality of the region's products, and consumer ethnocentrism. The results of this study contribute to guiding decision-making on the strategies to be implemented by regional public institutions in collaboration with the wine industry, both of them responsible of creating value for the region.
Social Innovation and Entrepreneurship
Authors: Carvalho João M. S.
Published: November 2015

This chapter provides a summarized and objective review over the relationships among innovation, social innovation, entrepreneurship, social entrepreneurship, new business models (NBM), and product (good, service, idea) value and sustainability (economic, social, ecological, and psychological). A study has been done in Porto region through interviews with 13 social innovators and entrepreneurs, in order to evaluate those relationship. The conceptual base for analysis is the theories developed by Jonker (2012) and Carvalho and Jonker (2015). It has been concluded that market-oriented social innovation has a crucial role in the development social entrepreneurship. Moreover, these NBM should be adjusted to population needs towards societal well-being, by combining creation of shared value, co-creation of value, and multiple value creation. Thus, the value set (social innovation) contributes to economic, social, ecological, and psychological sustainability, and consequently to human, social and territorial development.
Social Entrepreneurship and Social Innovation in Southeast Asia and its Role on Development
Authors: De Sousa Miguel Rocha , Docuyanan Mary Ann
Published: November 2015

This chapter provides five comprehensive cases of social entrepreneurship and innovation in Southeast Asia and its role on development. We start from a theoretical innovation model based on differential inclusions mathematical theory which is new to the innovation literature. Afterwards we cross-examine the theory with the empirical cases. Main conclusions refer that the differential inclusion model can eventually refer to a more general framework, but nevertheless the five cases are very relevant to specify the use of the model.
Cultural Barriers to Organizational Social Media Adoption
Authors: Manzoor Amir
Published: November 2015

Before they became a part of our social lives, most communication technologies were introduced with a business function in mind. Private individuals quickly adopted social media technology as an extension of their personal life. Due to this reason, many organizations are struggling to understand how this technology can benefit their mission, while many more worry that it will devastate productivity and security. Individuals who wield the power of expansive social media networks can significantly alter an organization's credibility and fiscal health. Organizations who harness the massive data warehouses behind these social media networks have the ability to significantly alter individual lives and society at large; for better or worse. However, barriers to organizational social media adoption are more cultural than technical. This chapter analyzes what cultural barriers are being raised against social media adoption and how can management re-align their understanding of social media to better utilize resources and take advantage of the opportunities this technology presents.
Design challenges in Interposer based 3-D Memory Logic Interface
Authors: Heinig Andy , Chaudhary Muhammad Waqas , Fischbach Robert , Dittrich Michael
Published: November 2015

Further improvements in system performance are often limited by the achievable bandwidth between processor and memory. In this paper we look at interposer-based and stacked solutions to integrate processor and 3D memory into a high performance system. The comparison is made for different technological decisions, design problems faced for choosing a certain 3D memory type from Wide IO/1–2, High bandwidth memory (HBM) and Hybrid Memory Cube (HMC). Logic die size, metal layers and material of interposer affected by routing requirements of memory systems are discussed.
Wafer Level 3D System Integration using a Novel 3D-RDL Technology
Authors: Ghannam Ayad , Magnani Alessandro , Bourrier David , Parra Thierry
Published: November 2015

A new wafer-level 3D system integration process that relies on a novel multi-level 3D redistribution layer technology (3D-RDL) to interconnect chips together as well as to the substrate was developed. The 3D-RDL technology is based on a single electroplating step that allows routing high density, auto-adaptive vertical copper interconnects (20 μm Line/Space “L/S”) at the edge of known-good dies as well as redistribution layer on top of the die and the substrate. Furthermore, this technology enables 3D interconnection of stacked dies using a single 3D-RDL layer. Additionally, high performance 3D inductive devices with small form factor can be integrated above-IC or above-substrate using the same 3D-RDL processing steps. These capabilities allow miniaturization and performance enhancement and make the technology ideal for various applications requiring functional heterogeneous system integration on a small footprint, such as systems for mobile and Internet-of-Things (IoT) applications, MEMS and Sensors.
Formulation Development for Bosch Etch Residue Removal: Effect of Solvent on Removal Efficiency
Authors: Peters Richard , Cao Yuanmei , Pollard Kim , Pfettscher Don , Phenis Mike
Published: November 2015

The Bosch etch process is a critical process step used to create through silicon vias (TSVs) for 3D integrated circuit manufacturing. During the Bosch etch, a fluoropolymer passivation layer is formed on the sidewall of TSVs to help achieve a vertical profile and to protect the exposed dielectric materials. The fluoropolymer residue on the sidewalls in the TSVs must be removed prior to subsequent process steps. The highly fluorinated character of the fluorocarbon polymer residue makes its complete removal challenging due to characteristics such as limited solubility in solvents and slow or no reactivity with components of common cleaning or strip solutions.

In this paper, the results of a study of solvents for developing formulations for removal of Bosch etch residue from TSVs are presented. The selection of components for an etch residue remover must take into consideration several key factors including removal efficiency, environmental-health-safety (EHS) guidelines, and material cost. The results demonstrate that the solvent selection has a dramatic impact on polymer removal efficiency, where poor solvent selection can lead to the formation of polymer balls inside the vias. The reported studies include cleaning results using a combination of polar solvents including protic and aprotic solvents, and amide and non-amide solvents. The cleaning performance is compared with a prediction using Hansen solubility parameters. Complete residue removal using TMAH-free and NMP-free formulations for TSV diameters down to 5 μm is demonstrated. Scanning electron microscopy, (SEM), energy-dispersive X-ray spectroscopy (EDS), and Auger electron spectroscopy (AES) were used to characterize the cleaning performance.
Solder electromigration behavior in Cu/electroless Ni–P plating/Sn–Cu based joint system at low current densities
Authors: Kadoguchi Takuya , Yamanaka Kimihiro , Nagao Shijo , Suganuma Katsuaki
Published: November 2015

Electromigration (EM) in solder joints has great influence on their reliability. Nevertheless, few reports have been published on the EM in solder joints with Ni–P barrier layers at lower current densities less than 10 kA/cm2. In the present study, EM in Cu/Ni–P/Sn–0.7Cu/Ni–P/Cu joints was investigated at 150 °C with current densities of 5.0 and 7.5 kA/cm2. The breakdown mode was open failure of the solder joint on the cathode. It was found that Ni in the Ni–P barrier layer diffused toward the anode, resulting in a thicker P-rich layer, which caused the cracks and the delamination of the P-rich layer. Additionally, the diffusion of Sn detached the solder from the Ni3SnP intermetallic compound on the cathode.
Additive Manufacturing Design and Fabrication of Ceramic Cylindrical Ion Trap Mass Analyzer Chips for Miniaturized Mass Spectrometer Smart-Devices
Authors: Roman Patrick , Chen Xudong , Jones W. Kinzy , Karbasi Ali , Newton C. Mike , Bates Travis , Denkins Jacob , Bhansali Shekhar
Published: November 2015

A chip based mass spectrometer technology promises to offer smart-device autonomous microsystem chemical analysis capability for sample determination and process monitoring for multiple applications in a small low power instrument package. This project focuses on the development of cylindrical ion trap mass analyzer chips fabricated using 3D Additive Manufacturing and planar Low Temperature Co-Fired Ceramic thick film processes toward the realization of a chip based mass spectrometer microsystem. The cylindrical ion trap (CIT) is a mass analyzer comprised of planar electrodes and operates by trapping and ejecting sample ions based on their mass in an RF field. Because of its simplicity CITs may be easily miniaturized and connected in tandem to achieve multiplexing. Additive manufacturing materials and methods enable enhanced trap miniaturization through micro machining and electrode patterning methods, fast and cost effective prototyping, batch fabrication, and material formulation flexibility. The current design incorporates three parallel ceramic plate metalized electrodes making up a singular trap geometry in a 10mm2 ceramic chip, forming a mass analyzer of reduced size, mass, and power, with enhanced material robustness for extended range use and in harsh environments. Unique processes have been developed to produce these devices which include conformal metallization layers, adhesion layers, ceramic paste formulations, sacrificial supporting materials, and co-firing methods. Additionally, 3D printing brings a unique design and fabrication capability enabling novel structures, material blending and heterogeneous integration. With true digital control, the designs are easily scalable and shape agnostic.
Advanced Manufacturing Technology for Fan-Out Wafer Level Packaging
Authors: Shelton Doug
Published: November 2015

Advanced process technology is required to develop and enable mass production of Fan-Out Wafer-Level Packaging (FOWLP) solutions for high-density 3D and 2.5D packaging. Canon has identified key challenges that must be solved for successful implementation of high-density integration technologies and has developed key technology for Canon Litho Systems to support the most challenging processes.

In this paper, Canon will present process optimization results for high-resolution patterning of wafers across large topography as well as solutions that enable litho systems to compensate for FOWLP grid error due to die placement errors.
Sol-gel doped-PZT thin films for integrated tunable capacitors
Authors: Benhadjala Warda , Le Rhun Gwenael , Dieppedale Christel , Sonnerat Florence , Guillaume Jennifer , Bonnard Clémence , Renaux Philippe , Sibuet Henri , Billard Christophe , Gardes Pascal , Poveda Patrick
Published: November 2015

Integrated metal-insulator-metal (MIM) capacitors using sol-gel PZT doped with lanthanum (La, PLZT), manganese (Mn, PMZT) and niobium (Nb, PNZT) were successfully processed and characterized for tunable applications. Dielectric properties of doped-PZT were investigated and compared to those of pure PZT. Wafer-level measurements were conducted with a particular attention on tunability evaluation under DC bias voltage. Tunability, leakage current density and breakdown voltage of pure PZT thin films were 77.6% (i.e. 4.5:1) at 10kHz/10V, 4.8.10−5 A/cm2 at 870kV and 37.5V (i.e. 1.63 MV/cm) respectively. The breakdown voltage increased by 25% with La doping and by 50% with Nb and Mn. The lowest leakage current were achieved by PNZT (7.0.10−7 A/cm2 at 870kV) while PMZT films exhibited an outstanding tunability reaching 88.8% (i.e. 8.9:1) at 100 kHz and 20V. Enhanced performances of the developed doped-PZT were compared to the state of the art. Results indicate that electrical properties of sol-gel doped-PZT achieved those of conventionally deposited materials. It is noteworthy that obtained PMZT tunability is among the highest ones reported in the literature for PZT-derived thin films but also for other piezoelectric materials.
Characterization of a New and Complete Lead-Free Thick Film Resistor System for the Hybrid Circuit Market
Authors: Skurski Michael A. , LaBranche Marc H.
Published: November 2015

The move to lead-free thick film technology, including resistors does not necessarily mean a move away from performance. There have been many recent developments in the area of lead-free glasses, thick film dielectrics, and conductor materials. However, the development of lead-free resistor materials has been slower to enter the market. This slower evolution is due, in part, to the need to develop a series of discrete compositions that are compatible with each other and cover a wide range of resistance values. There can be 8–10 individual members in such a series. The primary goal of this development was to achieve resistor performance on par with, or superior to an existing and popular premium lead based resistor system.

This paper describes a new series of lead-free thick film resistor compositions that cover a complete range of decade values from 1 Ohm/square to 10 MegOhms/square. Each member is compatible and blendable with adjacent members to cover all possible resistivity needs. This system provides excellent environmental stability of laser trimmed resistors, tight TCR gap control, a wide processing latitude, and minimal termination effects with a wide range of lead-free conductor metallurgies including Au, Ag, Ag/Pt, and Ag/Pd. In this paper, we report the results of a characterization study that includes 1000 hours of laser trim stability in 85°C/85%RH, thermal ageing at 150°C, room temperature ageing, and thermal cycle stability at −50°C +150°C. Electrical properties are presented and include Power Handling, Quan-tech Noise, and Electrostatic Discharge stability. In addition, this paper investigates and documents: resistor length effects, fire and refire sensitivity effects, thickness behavior, and the use of lead-free encapsulation.
Thermal Aging Behavior of Fine Pitch Palladium Coated Silver (PCS) Ball Bonds on Al Metallization
Authors: Xu Di Erick , Gomes Jimy , Mayer Michael , Lyn Rob , Persic John
Published: November 2015

The high price of Au has motivated many to look for alternative bonding wire materials in the field of microelectronics packaging. In the present study, the reliability performance of palladium coated silver (PCS) wire in high temperature storage test (HTST) is carried out using 18 μm diameter fine pitch PCS wire. Fine pitch ball bonds are made on Al metallization, with bonded ball diameter (BBD) of 32 ± 0.5 μm and ball height (BH) of 8 ± 0.5 μm. The aging temperature used in HTST is 170 °C and both shear and pull test are used to evaluate the aged ball bonds at regular time intervals. The shear force increases from 9.9 gf at 96 h to 12.5 gf at 192 h, and remains almost constant until 1344 h, and starts dropping gradually until 10.9 gf at 1848 h. The pad lift percentage recorded in pull test gradually drops from 90 % at 96 h to 20 % at 1008 h, and increases to 90 % at 1848 h. The chip side fractography after shear test indicates that the main failure modes are through pad at 96 h, through ball bond at 504 h, and half of both at 168 h, respectively. Cross-sectional images show that the thickness of the intermetallic compound (IMC) layer growth follows parabolic relationship and the rate constant is 0.10 ± 0.02 μm/h½. Gaps are observed along the periphery of the ball bond interface where no IMC is observed. The IMCs are located at the center of the ball bond interface, and the width is 16.0–19.3 μm at 96 h and 17.2–22.7 μm at 1344 h, respectively.
Simulation Methodology and Design Flow for Decoupling Optimization in Case of Design Reusing
Authors: Goral Benoit , Gautier Cyrille , Amédéo Alexandre
Published: November 2015

The following paper presents a simulation methodology for analyzing a power delivery network and optimizing the decoupling network of ball grid array integrated circuits like processors, or Field Programmable Gate Arrays. Simulation tools from commercial electronic computer aided design solution and the different models used for decoupling network design are presented and their efficiency demonstrated by correlating simulation results with measurement thanks to a dedicated hardware implementation on test vehicle. S parameters analysis of a particular plan equipped with SMA connectors on bare PCB and on the PCB associated with decoupling capacitors is realized allowing S12 parameter measurement. An integrated module of the commercial solution calculating mounted inductance of decoupling capacitors is also presented since it is a key element for decoupling optimization. Its performances are compared again with measurement by extraction of mounted inductance from S parameters. Design flow is then given for optimizing performances of a capacitor decoupling network in the specific case of reusing an electronic design. Surface occupied by decoupling components is highly reduced in a first place and its efficiency increased by reducing mounted inductance thanks to small rerouting operations. Performances of decoupling network are then analyzed in order to remove all unnecessary elements and reduce at the same time the space occupied by the decoupling network and the bill of material.
Leveraging Glass Properties for Advanced Packaging
Authors: Shorey A.B. , Lu Y.J. , Smith G.A.
Published: November 2015

Glass provides many opportunities for advanced packaging. The most obvious advantage is given by the material properties. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust the coefficient of thermal expansion gives advantages to manage warp in glass core substrates and bonded stacks for both through glass vias (TGV) and carrier applications. Glass also gives advantages for developing cost effective solutions. Glass forming processes allow the potential to form both in panel format as well as at thicknesses as low as 100 um, giving opportunities to optimize or eliminate current manufacturing methods.

As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and via/surface metallization. Of particular interest is the ability to leverage tool sets and processes for panel fabrication to enable cost structures desired by the industry. By utilizing the stiffness and adjustable CTE of glass substrates, as well as continuously reducing via size that can be made in a panel format, opportunities to manufacture glass TGV substrates in a panel format increase. We will provide an update on advancements in these areas as well as handling techniques to achieve desired process flows. We will also provide the latest demonstrations of electrical, thermal and mechanical reliability.
Copper wire bonding ready for industrial mass production
Authors: Brökelmann M. , Siepe D. , Hunstig M. , McKeown M. , Oftebro K.
Published: November 2015

Copper wire as a bonding material for the top side connection of power semiconductors is highly desired. One current drawback in heavy copper wire bonding is the relatively low lifetime of the consumables. The bonding tool wear mechanisms and the corresponding factors are investigated. To reduce wear, different approaches are tested in long-term bonding tests. Optimized bonding tool tip geometry and tool material are two of these factors. Optimized bonding parameters were investigated as well and show a significant improvement in bonding tool lifetime. Wear and lifetime of the cutter and the wire guide are also examined. Additionally, the impact of bonding tool wear on different aspects of bond quality is addressed. It is also shown how wear can be monitored by machine process data recording and how a derived signal correlates to the actual wear status. These major advances in heavy copper wire bonding now make it a robust, reliable and efficient interconnection technology.
Real-Time Observation of Interface Relative Motion during Ultrasonic Wedge-Wedge Bonding Process
Authors: Long Yangyang , Twiefel Jens , Roth Joscha , Wallaschek Jörg
Published: November 2015

As a predominant interconnection technique in microelectronic industry, ultrasonic wire bonding has been investigated for decades ever since its invention. Due to the extremely short process time, high operating frequency and ultrathin interfaces, many mechanisms are still unknown. One focus point of the research is the motion behaviors at the two interfaces – interface between wire & substrate (wire/substrate) and interface between wire & bonding tool (wire/tool). In this project, the motion behaviors at the two interfaces were observed by a high speed camera combined with an optical magnification system. The relative motion at the wire/substrate interface was recorded at maximum a frame rate of 350,515 fps which is approximately six times higher than the bonding frequency. The relative motion is caused by the vibration induced reciprocal motion and the plastic deformation induced material flow. The wire/tool interface was observed at lower frame rates due to the window size confinement. Through the observations, a relative motion was captured for the first time. This discovery indicates that the process parameters must be carefully controlled so that cratering as well as other damaging problems can be avoided.
Transient Liquid Phase Sintering Pastes as Solder Alternatives in High Temperature Applications
Authors: Shearer Catherine , Holcomb Ken
Published: November 2015

High operating temperature electronics are a growing market in the electronics industry. Most of the components and substrates necessary to support the production of these harsh environment devices are now available, but the interconnect materials for component, module and board level assembly are lagging in development. Currently the high operating temperature markets are being served by lead-bearing solders and expensive alloys such as gold-tin or gold-germanium. Lead has been banned from the majority of electronics applications in many areas of the world, but so far has been exempted in the high temperature solder applications due to the lack of an adequate replacement. Even without the impending regulatory restrictions, the melting temperature of the lead containing solders is marginal for the next generation of high operating temperature electronics.

Transient liquid phase (TLPS) sintering paste compositions are a new class of solder replacement materials that can be processed at typical reflow temperatures, but which do not remelt when subjected to subsequent thermal excursions. TLPS pastes combine solder alloy particles and reactive metal particles in proportions such that the solder ‘thermosets’ during a typical solder reflow cycle. This ‘thermosetting’ behavior results in a joint that does not remelt at the original reflow temperature, and thus enables the highly reliable electrical interconnect essential for high operating temperature applications.

TLPS pastes are similar to solders in many respects. The electrical, thermal and mechanical performance is similar to conventionally used tin-based solders. The TLPS pastes are stored and applied like solder pastes. The reflow cycles used to form the TLPS paste joints are also similar to those for forming solder joints. However, unlike solder, TLPS materials do not change shape during reflow or wet substrates beyond the deposition footprint. Also unlike solder, the metals within the bulk of the TLPS interconnect react with one another resulting in a stable interconnect with a thermally robust bonding structure to joining surfaces, even after subsequent thermal cycles. Though not a practical replacement for solder in common assembly operations, TLPS technology is an attractive solder alternative for specialty interconnect applications. In this paper, the nature and characteristics of TLPS pastes will be will be explored in comparison to solder paste materials commonly used in high operating temperature applications.
Application of transient liquid phase sintering (TLPS) interconnect material for high temperature Pb-free RoHS compliant MLCC lead attachment
Authors: McConnell John , Bultitude J. , Qazi J. , Magee J. , Shearer C. , Holcomb K.
Published: November 2015

Transient Liquid Phase Sintering is a process that provides high temperature Pb-free RoHS compliant interconnect solutions that exceed the high temperature capabilities of Pb-Sn solders. KEMET, working in collaboration with Ormet Circuits Inc. has successfully applied Ormet's TLPS technology to a line of Leaded Multi-layer Ceramic Capacitors (MLCC) components for high temperature applications. The material is Pb-free, RoHS compliant and able to withstand process and operating temperatures > 400°C while having initial processing temperatures of less than 300°C. Potential applications for TLPS are in the automotive, aerospace, oil, gas, and geothermal exploration industries where electronics are being exposed to higher operating temperatures and require robust interconnects capable of withstanding harsh environments.
A New In-line Laser-based Acoustic Technique for Pillar Bump Metrology
Authors: Murray Todd W. , Bakir Andrew , Stobbe David M. , Kotelyanskii Michael J. , Mair Robin A. , Mehendale Manjusha , Ru Xueping , Cohen Jonathan D. , Schulberg Michelle T. , Mukundhan Priya , Kryman Timothy J.
Published: November 2015

The drive to reduce the interconnect pitch and increase the number of connections for packaging in mobile devices has led to the development of copper pillar bumps. The key drivers for the adoption of copper pillars are improved performance, reduced form factor and lower cost. In this paper, we present a laser-based acoustic technique for the characterization of multi-layer pillars. This non-contact technique has a high sensitivity for materials characterization with micron-scale spatial resolution. Absorption of laser light causes excitation of elastic waves that propagate through the pillar and are reflected by the pillar walls, exciting vibrational modes in the structure. We have demonstrated that our approach is sensitive to the thicknesses of individual layers in bi-layer and tri-layer copper pillar stacks. Focused ion beam scanning electron microscopy (FIB SEM) has been used to optimize the model and to validate the accuracy of the technique.
Predicting Package Level Failure Modes in Multi Layered Packages
Authors: Sharon Gil , Caswell Greg , Blattau Nathan
Published: November 2015

Package technology is constantly improving in order to keep up with the advances in silicon technology. Multi layered packages exhibit several failure modes that can be predicted using modern software tools. This paper provides a methodology for creating a high-fidelity model of the interposer with all the conductor geometries. The two failure modes that are explored with this model are package warpage prediction due to actual copper imbalance and filled microvia delamination. Each layer can meshed based on the actual geometry in the layout design. Package warpage is caused by copper imbalance between the two sides of the interposer. The CTE mismatch between the two sides can bend the package to such a degree that it becomes impossible to assemble the solder interconnects. The filled microvias have copper structures that can delaminate from the copper traces in the conductor layers. The high-fidelity model provides the predictive tool to allow designers to adjust the layout before any manufacturing has taken place.
Multiphysics Modeling of Underfill Flow and Cure during Thermocompression Bonding
Authors: Oliver Mark , Elabbasi Nagi
Published: November 2015

We present a model of fillet formation and cure during thermocompression bonding with a non-conductive film. Process variables in the model include the position and temperature profiles applied to the silicon die and substrate by the bonding tool. The chemorheology of the underfill is accounted for in order to track the degree of cure of the material and its impact on dynamic viscosity. Simulation predictions of how the underfill chemorheology impacts the fillet shape and level of cure advance during the processes are presented.
A case of iatrogenic severe mitral regurgitation
Authors: D’Aloia Antonio , Piovanelli Barbara , Rovetta Riccardo , Bonadei Ivano , Vizzardi Enrico , Curnis Antonio , Metra Marco
Published: November 2015

Bromocriptine and cabergoline, ergot derived dopamine receptor agonists used to treat Parkinson’s disease and prolactinomas, have been associated with increased risk of cardiac valve disease. Here we present a case of iatrogenic symptomatic severe mitral regurgitation due to these drugs.
Intermittent vertebral flow in asymptomatic progression of aortic dissection
Authors: Correale Michele , Montrone Deodata , Di Martino Luigi , Di Biase Matteo , Brunetti Natale Daniele
Published: November 2015

Not available.
The portopulmonary hypertension: an overview from diagnosis to treatment
Authors: Salzano Andrea , Sirico Domenico , Golia Luisa , Faga Valentina , Flora Martina , Bossone Eduardo , Cittadini Antonio
Published: November 2015

Portopulmonary hypertension (POPH) refers to the condition of pulmonary arterial hypertension (PAH) in association with portal hypertension. Among patients with portal hypertension, reported incidence rates of POPH range from 2 to 10% and long-term prognosis in cases of- POPH is poor. Fundamental issues of management of POPH include identification of patients likely to benefit from liver transplantation (LTx) and treatment with specific pulmonary vasodilators before and after LTx. This review presents as an overview of the current knowledge on the epidemiology, diagnosis, treatment and prognosis of patients with portopulmonary hypertension.
Management strategies and choice of antithrombotic treatment in patients admitted with acute coronary syndrome - Executive summary for clinical practice
Authors: Uguccioni Massimo , Pugliese Francesco , De Luca Leonardo , Tubaro Marco , Ruggieri Maria Pia , Colivicchi Furio
Published: November 2015

Consensus Document of the Regional Chapters of the Italian National Association of Hospital Cardiologists (ANMCO) and of the Italian Society of Emergency Medicine (SIMEU)

This document has been developed by the Lazio regional chapters of two scientific associations, the Italian National Association of Hospital Cardiologists (ANMCO) and the Italian Society of Emergency Medicine (SIMEU), whose members are actively involved in the everyday management of Acute Coronary Syndromes (ACS). The document is aimed at providing a specific, practical, evidence-based guideline for the effective management of antithrombotic treatment (antiplatelet and anticoagulant) in the complex and ever changing scenario of ACS. The document employs a synthetic approach which considers two main issues: the actual operative context of treatment delivery and the general management strategy.
The GICR polls: a new instrument for Cardiovascular Prevention and Rehabilitation in Italy
Authors: Ambrosetti Marco , Faggiano Pompilio
Published: November 2015

During the year 2015 GICR-IACPR, a scientific society for Cardiovascular Prevention and Rehabilitation (CRP) in Italy, carried out several “Polls” based on its website, in order to know current attitudes of health operators involved in the management and care of cardiac patients. The Poll #1 focused on post revascularization residual myocardial ischemia, familial dyslipidemia, erectile dysfunction, sleep apnoea, and hyperuricaemia, all conditions being paradigmatic of well known situations of high cardiovascular risk and disability in the CRP setting. In the present report feasibility and results of the GICR Poll #1 are discussed.
Product Ranks of the 3 × 3 Determinant and Permanent
Authors: Ilten Nathan , Teitler Zach
Published: November 2015

We show that the product rank of the 3 × 3 determinant det3 is 5, and the product rank of the 3 × 3 permanent perm3 is . As a corollary, we obtain that the tensor rank of det3 is 5 and the tensor rank of perm3 is 4. We show moreover that the border product rank of permn is larger than n for any n ≥ 3.
Therapy of anorexia and Young’s early maladaptive schemas. Longitudinal study
Authors: Mącik Dorota , Sas Ewa
Published: November 2015

Background

Young’s early maladaptive schemas are defined as convictions about oneself acquired in childhood, formed by a child in response to deprivation of his or her basic needs, especially in the area of relationships. In the case of anorexia, the role of the family and relations is emphasized as crucial for the genesis of this disorder. The aim of the research was to investigate whether Young’s early maladaptive schemas change during the therapy, which would prognosticate higher treatment efficiency.

Participants and procedure

The study group included 30 women suffering from anorexia, starting their 6-week therapeutic program. The procedure included double measurement: during the administration and discharge. The respondents filled in the Young Schema Questionnaire in its short form (YSQ-S3) (twice), the Acceptance of Illness Scale (AIS) adapted by Juczyński (twice), and a demographic chart (once).

Results

The intensity of all schemas decreased after completion of the therapeutic program; the differences were mostly statistically significant. The composition of the most intense schemas did not change significantly: unrelenting standards and abandonment were the highest during both measurements. What changed were the interrelations between the schemas. They are also connected with the acceptance of the illness (the weaker they are, the greater the acceptance, and the stronger the relations) and with psychological well-being, especially during the post-therapy measurement.

Conclusions

The schemas seem to be significant from the perspective of understanding anorexia. They are susceptible to be changed by integrative therapies. Nevertheless, it seems that in order to achieve a durable change, schema therapy should be applied.