bluuebunny/crossref_metadata_2025 huggingface dataset:
Driving Adoption of Advanced IC Packaging in Automotive Applications
Authors: Ziadeh Bassam
Published: February 2024

For years automotive semiconductors, have been governed by small, low power Integrated Circuits (ICs) purpose built for specific functions. These Microcontroller Units (MCUs), deployed on the edge of the compute topology are typically low-power, low-performance parts. Built on legacy nodes (130nm+) on well-established packaging technology (often wirebond die on QFN-style packages), they demonstrated incremental improvements from a silicon and packaging perspective. With the adoption of software defined vehicles (SDV), the evolution of advanced driver assist systems (ADAS), and feature rich in-vehicle infotainment (IVI), the per vehicle compute power has grown exponentially per vehicle, colloquially, known as “data centers on wheels”. With this growth has come the need to adopt newer packaging techniques to improve system latency, bandwidth, compute power, and IP integration and reducing system footprint via 3D stacking – all fabricated on leading edge nodes.

Advanced packaging has seen tremendous growth and adoption in the data center and client ecosystems – the next hurdle is addressing the safety and reliability focused requirements of automotives; extended useful lifespan of 10yrs+, and weathering harsher environmental conditions of thermal extremes, vibration, and EMC, and mixed IP integration. This talk will address the areas of focus for adopting heterogenous integration and advanced automotive packaging for automotives such as, qualification and formulation of materials to minimize traditional packaging yield concerns, introduction of new thermal interface materials aligned with new liquid cooled ECUs and testing to ensure zero defects across chiplets and memory; with broader test coverage and the adoption of Known Good Die (KGD). Additionally, the talk will cover the importance of driving industry standardization regarding die-to-die communication protocols, form factors, power delivery, system integration, and qualifying/enveloping new failure modes from the current baseline AEC-Q100 requirements brought on by various 2.5D and 3D packaging.
Low Loss/Low CTE Semiconductor Carrier Packaging Thin Core Material
Authors: Ancharski Caleb
Published: February 2024

There is an ever-increasing need by semiconductor/packaging companies for the introduction of a low loss, ultra-low Coefficient of Thermal Expansion chip carrier packaging substrate core material that provides a cost-effective method for producing thin core build up with very dense core vias. This low loss, low CTE flip-chip substrate core is well suited to multi-layer, RF, and applications requiring a system-in-package approach. This paper discusses a novel substrate core material using a build-up film dielectric layer in conjunction with glass fiber weave. Key properties include low loss (Df<0.002), a CTE from 5 - 10 ppm/C, extremely high thermal reliability, and low modulus. An advantage of using glass fiber weave instead of Invar, for instance, is the extremely low CTE that can be achieved while still maintaining a non-conductive power or ground plane. Multilayer circuits using PTFE can suffer from extremely high lamination temperatures, high cost, and low overall yields due to the inability of the soft material to go through a desmear process. Substrate core materials have the primary benefit that they offer stability and increased reliability of many subsequent build-up microvia layers. As monolithic semiconductors are replaced by chiplets, there is a growing need to package many types of chiplets without losing the signal integrity performance of a monolithic semiconductor on a single IC package. An extremely low loss substrate core offers the potential benefit that unique chiplet packaging architectures can be designed with the lowest possible dielectric losses due to the multichip interconnect strategy.
Advanced Glass Carriers for Buildup Structure Warp Control and Wafer Ultra-thinning
Authors: Zhang Jay , Teng Andy , Yu Christina , Brueckner Julia
Published: February 2024

Tailorable CTE of glass carriers enables effective warp control of buildup structures such as fan-Out wafer level package and multi-layer laminates. Corning’s Advanced Packaging Carrier (APC) product family covers CTE from 4.9-12.6 ppm/C with fine granularity down to 0.2 ppm/C, and other glass types go down in CTE all the way to 0 ppm/C. We illustrate the benefits of having such CTE capabilities using several use cases.

Carrier supported wafer thinning down to single digit microns is another emerging need. In addition to CTE matching, such ultra-thinning requires the carrier and the associated temporary bonding method to deliver very low total thickness variation (TTV), typically a small fraction of the final wafer thickness. We will introduce Corning’s recently announced ultra-low-TTV (ULTTV) glass carriers as well as near-zero-TTV temporary bonding methods that enable ultra-thinning of wafers of various types.
Warpage and Reliability Study of Large Size XDFOI(TM) FO-MCM fcBGA
Authors: Yang Danfeng , Islam Nokibul , Xu Allen , Xu Coco , Lin Yaojian
Published: February 2024

XDFOI(TM) (x-Dimensional Fan-Out Integration) is a heterogeneous integration technology platform of JCET Group, which includes multiple advanced 2D/2.5D/3D chiplet and SiP (System-in-Package) integration solutions.

Since the semiconductor Si node advances beyond 14 nm, the soaring cost of design and manufacture has shifted attention to advanced heterogeneous integration strategies, such as System-on-Chip (SoC) and SiP. SoC benefits from the shorter interconnections, while SiP has the advantages on cost, sourcing, cycle time and reliability. As a key member of XDFOI(TM), FO multi-chip-module (FO-MCM) and its further integration with fcBGA, is a viable and flexible technique to meet the challenge of exponentially generated date and information of our society. Meanwhile, the size of XDFOI(TM) chips and related fcBGA packages gets larger and larger, corresponding warpage and reliability issues become more and more complicated and important.

In this paper, large size 2.5D FO-MCM chips (L * W ≥ 900 mm2), which were fabricated by chip-first process as S-in-1 FO types (S=2/3/4: the quantity of Si chiplets) with different Si thickness combination, together with raw Si chip (L * W) as 1-in-1 control type, were assembled with large size fcBGA (≥ 65x65 mm2) to study the impact of Si chiplet split and Si thickness on warpage. Furthermore, reliability (TC 500/1000 cycles, uHAST 96/192 hrs, and HTSL 500/1000 hrs) of these large size XDFOI(TM) fcBGA packages were also proceeded to investigate the corresponding warpage/reliability relationship.
Processing and Reliability Testing of a Copper Pressure Sinter Paste for use in High Power Module, Die Attach Applications
Authors: Payne Dean
Published: February 2024

Power electronics are evolving to meet the high demands of new and emerging applications such as e-mobility/vehicle electrification. Pressure sintered silver is fast becoming the material of choice for die attach due the favorable material properties and proven reliability. This paper will introduce a copper sinter paste that can achieve consistently high shear strengths ~40MPa when sintered with 15-20MPa of pressure. The impact of process conditions is examined, plus reliability testing. Aging tests at 250ᵒC for more than 1000 hours show an increase in shear strength compared to time zero. TCT of -40ᵒC to 175ᵒC was done for >3000 cycles, no delamination was observed and again the shear strength was shown to increase through TCT. Microstructure analysis of the sinter layer is compared at time zero and after 1000 and 2000 cycles of TCT.
OSAT Production Testing of 5G, Power Discretes & 3D packaged ICs
Authors: Pancholi Vineet
Published: February 2024

The presentation will be segmented into three. OSAT production testing challenges of three vital product families that are important to our semiconductor industry will be showcased in each segment. The first segment will describe the products and impacts to RF production testing of both Sub-8GHz carrier frequency range and the mmWave frequency range of operation. The second segment will explore emerging MOSFET technologies that enable faster switching rates and higher voltage and current topologies. The third segment will describe the challenges of production test content for 3D-stacked advanced packages.

5G RF has enabled mmWave carrier frequencies, small cell deployment, massive MIMO (Multiple In, Multiple Out), beam forming, and full duplex wireless transmission and reception operations. These features require new production test methodologies.

There is an astronomical rise in battery powered applications like toys, consumer goods, automotive and trains. Power path turn on/off with MOSFETs is in the critical path. The technology has advanced from the traditional Si to GaN and SiC based products that have a smaller size and allow for higher application efficiencies. Test specifications and limits are improving and production testing methods are evolving to account for these changes.

Advanced packaging has enabled the path to integrate chiplets within a single package. Heterogeneous Integration (HI) is a powerful design innovation that allows tighter integration and, in some cases, improved signal and power performance at the system level. Production test methodologies are being streamlined to make test a competitive advantage for our customers.
IMAPS 2022 Conference Qorvo SHIP-RF
Authors: Jones Ted
Published: February 2024

Presentation will describe the Department of Defense (DoD) State of the Art (SOTA) Heterogeneous Integrated Packaging (SHIP) RF

program which is developing and validating a sustainable and scalable model for access to SOTA microelectronics RF packaging of

customized DoD microelectronic devices produced using a standard commercial production flow. RF package platforms developed are

progressing from least complex to more complex throughout the course of the program. The SHIP-RF roadmap and status will be presented

and will include Qorvo’s SOTA capabilities that are being incrementally developed and deployed via the SHIP-RF Design Center

1. (DC) and the Assembly and Test Center (ATC).
Photo-Imageable Dielectrics Enabling Structured MEMS and 2.5D / 3D Bonding Systems
Authors: Danza David , Hayes Colin , Wang Kevin , Prokopowicz Greg , Berry Paul , Kondo Masaki , Gallagher Michael
Published: February 2024

DuPont has developed a new Photo-Imageable Dielectric (PID) to complement its existing permanent bonding materials. The CYCLOTENEâ?¢ family of dielectric materials are well known for use as a permanent dielectric and have seen significant use in commercial applications including BSI CMOS image sensors, integrated passive devices and as an optical bonding adhesive. For new applications, there is a desire to have a thermal stable material that can be patterned to eliminate the material from the metal joining region or from the light path.

We will demonstrate in this paper that the solvent developed PID as well as our existing aqueous developable PID are both capable of wafer to wafer bonding after photo imaging and development. In addition to bonding using a commercial wafer to wafer bonding tool, we have shown that wafer to wafer bonding is achievable using a two-stage vacuum laminator. Optimization of the curing process will be discussed to prevent any separation or reflow of the PID as well as achieving the maximum adhesion energy after full cure. Finally, we will show the use of the negative tone PID as a solder collar or polymer dam to enable high density flip chip bonding using 15?m Sn/Ag capped copper pillars with a 1:1.5 pitch to a and 18?m polymer openings with a 1:1.08 pitch in 10mm x 10mm dies as well as outline the process we will use to extend this approach to Cu-Cu hybrid bonding.
P-WLCSP: 6-Side Protected WLCSP
Authors: Hackler Doug , Prack Ed
Published: February 2024

The first silicon demonstration of 300mm P-WLCSP was introduced in 2021 at the 54th International Symposium on Microelectronics. This paper reports further developments and new test results for this low cost WLCSP approach to fully protected CSP. The paper briefly summarizes the evolution of protected CSP technology evolution as an introduction for a more extensive discussion of P-WLCSP.

With the advent of bumped die new IC packages evolved: for low IO WLCSP (wafer level chip scale package) and for high IO FC (flip chip) CBGA (ceramic ball grid array) and PBGA (plastic ball grid array). For low IO, protected CSP is an emerging and rapidly growing market. In 2020 the market exceeded $2B and is ramping to a forecast $2.5B by 2025.1 Initially WLCSP, also known as FI (fan in), packages were built on the wafer with no active side protection evolving to 1 sided protection from a package built on the wafer2 which transition to redistribution PSB (passivation stress buffer)3, PSBs were used on FC wafers for high IO BGA packages. These provided acceptable performance initially, however as devices became more complex and reliability requirements increased, these processes no longer provided the required reliability. To attain higher IO capability and better reliability performance evolved to CSP (non WF) which allowed larger area for bump distribution and additional protection to the rest of the exposed die surfaces. Fully protected die CSP (without substrates or leadframes) was initially implemented with processes such as M-series utilizing a FO (fan out) process.5 To obtain higher reliability 6-sided die protection afforded by M-series type processes require die reconstitution, expensive tapes, molding operations required in a FO process that can be eliminated in a WLCSP protected FI process. American Semiconductor’s Semiconductor-on-Polymerâ?¢ (SoPâ?¢) 300mm FleX-TM P-WLCSP is an advanced packaging process optimized for protected fan-in. P-WLSCP ultra-thin fully protected chips will be shown from a wafer level process. Process development progress and test results will be presented.
Improving Reliability of Fan -Out Wafer Level Package Through Doping of Lead-Free Solder Balls
Authors: Rieder B. , Hartner W. , Yuan W. , Haubner G. , Niessner M. , Altmann J. , Zhang B.
Published: February 2024

Embedded wafer level ball grid array (eWLB) or FO-WLP (Fan-out wafer-level packaging) is investigated as a package for MMICs (Monolithic Microwave Integrated Circuit) for automotive radar applications in the 77GHz range. Doping of Bi and/or Sb was applied to improve the resistance of lead-free SAC balls against thermal cycling stress. We have shown that by increasing the doping level the lifetime can be increased and determined the maximum doping level before extrinsic failure modes dominate.

It is well-known from the literature that doping of Bi and/or Sb improves the resistance of lead-free SAC balls against thermal cycling stress. It was shown that lifetime of FC-BGA package can be multiplied using Bi and/or Sb doping. The lifetime gain is achieved by reduced creepage of the hardened balls caused by the doping. This reduced creepage increases the risk of causing other failures than ball cracks in the eWLB package or the PCB during thermal cycling stress. We have tested robustness of 7x8,5 mm^2 eWLB packages against thermal cycling stress T = -40 to 125 °C using SAC-balls with different Bi-doping content from 0% to 2,5% Bi concentration. As could be expected the solder ball fatigue mode is delayed more and more increasing the Bi content. We found other failure modes than solder ball fatigue emerging at doping around 1%. The fatigue modes are shifted towards cupper lines on PCB or into the package. Cu line cracks can be overcome by switching the PCB layout from NSMD (non solder-mask defined) to SMD (solder-mask defined) solder pads. In general there is a lifetime penalty when switching from NSMD to SMD, but by avoiding the Cu line cracks this lifetime loss is overcompensated using SMD pads for optimum performance. As input for simulations we have characterized the doped solder material using specimens produced in glass columns. We have also tested the components on PCBs with different top layer laminate with different CTE and elastic modulus to assess the influence of the PCB properties on the lifetime. It is a trend in automotive radar systems to use stiffer laminates which are cheaper but have negative influence on component lifetime. Solder ball shear tests were also carried out to characterize the influence of ball doping on other board-level reliability beyond thermal cycling performance. As expected ball shear force is increased with increased doping level. At increased shear-force the shearing is still done through the solder ball and does not lead to different shear-mode. Finally drop-tests were done to check influence of doping on board-level reliability performance other than thermal-cycling performance.
Additively Manufactured Wireless Sensors for Rugged IoT, Structural Health Monitoring, Smart Agriculture and Smart Cities Applications
Authors: Tentzeris Manos M.
Published: February 2024

In this talk, inkjet-/3D-printed antennas, interconnects, ‘smart’ encapsulation and packages, RF electronics, microfluidics and sensors fabricated on glass, PET, paper and other flexible substrates are introduced as a system-level solution for ultra-low-cost mass production of Millimeter-Wave Modules for Communication, Energy Harvesting and Sensing applications. Prof. Tentzeris will touch up the state-of-the-art area of fully-integrated printable broadband wireless modules covering characterization of 3D printed materials up to E-band, novel printable ‘ramp’ interconnects and cavities for IC embedding as well as printable structures for self-diagnostic and anti-counterfeiting packages. The presented approach could potentially set the foundation for the truly convergent wireless sensor ad-hoc networks of the future with enhanced cognitive intelligence and ‘rugged’ packaging. Prof. Tentzeris will discuss issues concerning the power sources of ‘near-perpetual’ RF modules, including flexible miniaturized batteries as well as power-scavenging approaches involving thermal, EM, vibration and solar energy forms. The final step of the presentation will involve examples from shape-changing 4D-printed (origami) packages, reflectarrays and mmW wearable (e.g. biomonitoring) antennas and RF modules. Special attention will be paid on the integration of ultrabroadband (Gb/sec) inkjet-printed nanotechnology-based backscattering communication modules as well as miniaturized printable wireless (e.g.CNT) sensors for Internet of Things (IoT), 5G and smart agriculture/biomonitoring applications. It has to be noted that the talk will review and present challenges for inkjet-printed organic active and nonlinear devices as well as future directions in the area of environmentally-friendly (‘green’) RF electronics and ‘smart-skin’ conformal sensors.
Laser-Based Additive Nanomanufacturing: Rigid to Flexible Substrates
Authors: Ahmadi Zabihollah , Mahjouri-Samani Masoud
Published: February 2024

Current printed electronics manufacturing techniques, including inkjet and aerosol jet printing, use ink to produce electronics devices. The inks are formulated with pigments, additives, and solvents, which make the inks impure. Also, small changes in the composition of the inks will result in different chemical and physical properties, which might affect the printing process as well as the final performance of the device. In addition, the ink formulations are rather complex, with a limited source of functional materials for printing functional devices. Annealing during printing or post-processing for solvent removal is another challenge of these techniques, which limit printing on low temperature and biodegradable substrates. Herein, we present a novel additive nanomanufacturing (ANM) technique compatible with a wide range of substrates for dry printing and patterning of a variety of materials, including on different rigid and flexible substrates. Bending tests show good mechanical stability and electrical conductivity, confirming the potential of ANM technique for printing different materials for flexible hybrid electronics and sensors.
Historical overview of specific local government transformatory developments in South Africa
Authors: Tsatsire Israel , Taylor John D. , Raga Kishore , Nealer Eric
Published: February 2024

In hierdie artikel word die evolusie van plaaslike regering in Suid-Afrika sedert 1652 oorkoepelend beskou met ‘n spesifieke klem op veral plaaslike bestuur vanaf 1994 Suid-Afrika bestuur het, het dit spoedig nodig geblyk in die Kaapprovinsie. Nou ‘n nuwe politieke bestel dat die aard en omvang van die transformasie van plaaslike regering in terme van die verskillende bevolkingsgroepe en politieke ideologieë van die vorige politieke bestelle ondersoek en beskryf behoort te word. ‘n Aantal wetgewende voorskrifte aangaande transformasie in die land se plaaslike regeringstrukture word in die artikel aangespreek. Dit word onder andere aangevoer dat die grondwetlike en ander wetgewende behoeftes en voorskrifte asook die openbare diensleweringsagterstande die skuif na ontwikkelende plaaslike regering met uitgebreide openbare raadpleging en deelname bewerkstellig het.. Die historiese plek en rol van die vorige Swart plaaslike owerhede en die Indiër en Kleurling Bestuurskomitees onder die vorige Nasionale Party regering word ook onder die loep geneem. Laastens word daar ‘n opsomming verskaf aangaande die pre-interim, interim (1993 tot 1998) en finale fase (2000) van die herstrukturering van die Suid-Afrikaanse plaaslike regeringsfeer.
Appropriating commemoration: The University of Pretoria – 1960, 1980 and 2008
Authors: Strydom Bronwyn L.
Published: February 2024

Die herdenking van ‘n universiteit se geskiedenis is ‘n belangrike wyse om gewig en egtheid aan die inrigting se posisie te verleen. In die algemeen is die mees erkende inrigtings van hoër onderwys ook die oudstes, en die viering van ‘n universiteit se verlede is een manier om sy status as ‘n gerespekteerde inrigting te verhoog. Hierdie artikel oorweeg die herdenking van universiteitsgeskiedenis deur die Universiteit van Pretoria (UP) as ‘n gevallestudie te bestudeer. In 1960 het UP ‘n gedenkboek gepubliseer om die vyftigjaarherdenking van sy onafhanklikheid as die Transvaalse Universiteitskollege (TUK) in 1910 te vier. Twintig jaar later, in 1980, het die Universiteit weer ‘n jubileum gevier, met die herdenking van die TUK se universiteitswording van 1930. Die Universiteit se eeufees in 2008 het egter 1908 as die geboortejaar van die inrigting gereflekteer. In elk van hierdie gevalle is die verkose mylpaal betekenisvol as ‘n aanduiding van die prioriteite en belange van die Universiteit se heersende bestuur.
The Association between Intimate Partner Violence and Female Syrian Refugees’ Mental Health
Authors: Elbarazi Amani Safwat
Published: February 2024

Background:

Intimate partner violence (IPV) is one of the world’s most critical public health issues.

Aims:

The main aim of the study was (1) to examine the association between IPV and female Syrian refugees’ mental health. We also wanted: (2) to assess the prevalence of IPV and its subtypes – controlling, emotional, physical, and sexual violence – among female Syrian refugees, (3) to evaluate the association between childhood maltreatment and IPV, and (4) examine IPV and risky behaviors.

Settings and Design:

This study is a descriptive cross-sectional study. A clinician interviewed (n = 289) female Syrian refugees seeking therapy in Egypt.

Materials and Methods:

Female Syrian refugees completed the following assessments: WHO Multi-Country Study on Women’s Health and Domestic Violence Questionnaire, Beck Depression Inventory-II, Beck Anxiety Inventory (BAI), and Difficulties in Emotion Regulation Scale (DERS)-16.

Results:

Female Syrian refugees who had experienced IPV scored significantly higher on the BDI-II (U = 1799, P < 0.00), BAI (U = 2511.5, P < 0.00), and DERS (U = 1636, P < 0.00). In addition, 90.3% of them experienced psychological control, 91.3% emotional abuse, 39.4% physical violence, and 27% sexual violence by an intimate partner. Those who had experienced physical IPV were more likely to use substances (χ
2 = 5.8, P < 0.05), engage in binge eating (χ
2 = 17.5, P < 0.001), and have suicidal thoughts or behaviors (χ
2 = 5.1, P < 0.05).

Conclusions:

Female Syrian refugees with a history of IPV exhibited significantly worse mental health. There is an imperative need for mental health treatment and prevention strategies for female Syrian refugees.
Evaluation of the effectiveness of amlexanox in the treatment of erosive oral lichen planus: A clinical experience from a tertiary care center
Authors: Roy Saurabh , Chhaparwal Yogesh , Kumar Mathangi , Acharya Shruthi , Chhaparwal Shubha , Solomon Monica C
Published: February 2024

Abstract

Aim:

This comparative study evaluated the effectiveness and safety profile of topical amlexanox and triamcinolone for the management of erosive oral lichen planus (EOLP).

Materials and Methods:

This prospective, observational study included 21 patients diagnosed clinically and histopathologically with EOLP and categorized into two groups. Subjects in the two groups were prescribed topical amlexanox and triamcinolone, respectively, for 4 weeks. The area of the erosive lesion and burning sensation was measured at baseline, at the end of the first, 2second, and fourth week. These outcome measures were documented and statistically analyzed. The statistical analyses were performed using the IBM SPSS Statistics version 22. Analysis for age distribution was done by independent sample t test. Analysis of sex distribution was done by chi-square test. Variations within a single group for both the outcome parameters were calculated by Wilcoxon signed rank test. (P < 0.05 statistically significant).

Results:

A total of 30 erosive sites were evaluated in 21 patients over a 4-week duration. The most common site was the buccal mucosa in both groups (23 of 30; 76.67% of total lesions assessed), followed by the tongue (5 of 30; 16.67% of total lesions assessed), the palate (1 of 30; 3.33% of total sites assessed), and the maxillary attached gingiva (1 of 30; 3.33% of total sites assessed). Group 1 (amlexanox) was comprised of 11 subjects, whereas Group 2 (triamcinolone) was comprised of 10 subjects. Pre and posttreatment comparison revealed no statistically significant difference (P = 0.756; 0.512, respectively), for the area of the erosion and burning sensation. Intragroup analysis showed that in Groups 1 and 2, there was a statistically significant reduction in the measures posttreatment (P < 0.05).

Conclusions:

Amlexanox provides an earlier onset of pain relief in the treatment of EOLP, whereas providing a comparable reduction in the erosive area compared with triamcinolone. Topical amlexanox appears to be as effective as triamcinolone and is a promising alternative in the management of the erosive lichen planus with minimal adverse effects.
Barriers to using advanced and pharmacological behavior management techniques: A survey of pediatric dentists in Jeddah, Saudi Arabia
Authors: Felemban Osama , Sijini Ohoud , Baamer Ruba , Bukhari Zuhor , Baghlaf Khlood , Sait Amani , Almalik Manal
Published: February 2024

Abstract

Aim:

In this study, we assessed the use of advanced pharmacological behavior management techniques (BMTs) among pediatric dentists in Saudi Arabia and the barriers to their clinical application.

Materials and Methods:

This cross-sectional study used a self-administered electronic survey that targeted members of the Saudi Society of Pediatric Dentistry. The questionnaire included questions on five techniques of advanced and pharmacological behavior management recommended by the American Academy of Pediatric Dentistry. Descriptive statistics, frequency, Chi-square test, and Fisher’s exact test were used to present the outcomes and independent variables.

Results:

A total of 57 pediatric dentists completed the survey. Nitrous oxide (N2O) sedation, general anesthesia (GA), and protective stabilization were used regularly by pediatric dentists in 70.2%, 68.4%, and 56.1% of the participants, respectively. A few participants reported using oral (14.0%) or intravenous (IV) sedation (10.5%) regularly. The most common barriers to using these techniques were either dentists’ discomfort or the non-availability of the equipment/drugs.

Conclusions:

The most common method used by pediatric dentists was N2O inhalation sedation, followed by GA and protective stabilization. The participants’ use of pharmacological BMTs, including IV and oral sedation, was relatively low.
Procalcitonin-guided antimicrobial stewardship in critically ill patients with sepsis: A pre– post interventional study
Authors: Mathew Philip , Vargese Saritha Susan , Mathew Litha Mary , David Alice , Saji Joyal Alias , Varghese Ann Mariam
Published: February 2024

Aim:

Injudicious usage of antibiotics has led to the emergence of antibiotic resistance which is a major health-care problem in developing countries such as India. Our aim was to show how antibiotic therapy based on serial procalcitonin (PCT) assay can help in antibiotic de-escalation in septic patients.

Materials and Methods:

A pre–post interventional study was conducted among 300 septic patients admitted to an intensive care unit (ICU). All septic patients admitted 2 months before and 2 months after the introduction of monitoring of PCT were included and they were divided into Group P (with PCT monitoring) and Group C (without PCT monitoring). The proportion of patients for whom antimicrobials were de-escalated, the average time taken to de-escalate antimicrobials, and the average duration of ICU stay were compared. Proportions and averages with standard deviations were calculated to describe the data. A test of proportions was done to compare the proportion de-escalated and a Student’s t-test was done to compare the average duration of antibiotic therapy.

Results:

The proportion of patients in whom de-escalation of antimicrobials was done was 125 (83.33%) in Group P as compared to 92 (61.33%) in Group C. The time taken to de-escalate was 3.04 ± 0.83 days (95% confidence interval [CI] 2.89–3.18) in Group P compared to 4.7 ± 1.4 days (CI 4.41–4.98) in Group C. The duration of ICU stay was also less in Group P - 3.08 ± 0.91 days (CI 3.08–3.38) as compared to Group C - 5.16 ± 2.17 days (4.80–5.51).

Conclusion:

Serial PCT assay-based antimicrobial therapy helped to wean patients with sepsis off antimicrobials earlier thus reducing the duration of ICU stay.
Performance Investigation of HFR Full-bridge Inverter in Resonant Inductive Coupled Power Transfer System for an Electric Vehicle
Authors: Geetha P , Usha S
Published: February 2024

Inductive WPT of the resonant category is generally employed for medium and high-power transmission applications like electric vehicle charging due to it contributes excellent efficiency. The high-frequency resonant full-bridge inverter using series-series resonant topology is proposed. The design of the high-frequency resonant inverter is simulated and verified by MATLAB/SIMULINK software. The charging scheme which is available in the AC-DC as well as in the DC-DC converter should operate with the two steps to achieve a duty cycle-based voltage control and hysteresis current control. The resonant frequency of the proposed system has a frequency range of 65 kHz with a DC voltage of 12V. The simulation has been carried out successfully and transmitted a 5KW power load of constant current and voltage control. The Performance chart of with the existing method is carried out in terms of parameters and the efficiency can be achieved by 95%.
Características de los videos que favorecen el engagement de los divulgadores científicos en TikTok
Authors: Velarde-Camaqui Davis , Viehmann Cristina , Díaz Rosa , Valerio-Ureña Gabriel
Published: February 2024

Introducción: La divulgación científica busca involucrar al público en la ciencia y estimular la discusión sobre temas científicos. Esta práctica se ha extendido en los últimos años gracias al auge de las redes sociales. Entre estas redes, Tiktok se ha convertido en un medio para alfabetizar en temas de ciencia, particularmente ante una audiencia joven. Metodología: El objetivo de esta investigación fue describir las características que tiene el contenido que se asocia con el engagement en los divulgadores científicos de habla hispana a través de TikTok. Se analizaron los contenidos (videos) de 10 divulgadores que utilizan una cuenta de Tiktok para difundir sus contenidos. Se analizó el formato, tipo y contenido de 94 videos que compartieron dichos divulgadores entre agosto y diciembre de 2022.  Resultados: Se encontró que algunas de las características relacionadas con un mayor engagement fueron: la longitud del video (>60 segundos), el número de hashtags (entre 5 y 10), el uso de infografías animadas, la presentación de noticias, el apego a la misión declarada (típicamente divulgar ciencia) y el no hacer videos con fines publicitarios. Discusión: Aunque el estudio del engagement digital en las redes sociales no es nuevo, el caso particular de los divulgadores científicos en redes sociales es aún un campo novel. Conclusiones: Los resultados de este estudio pueden ser insumos importantes para ayudar a los divulgadores de ciencia a mejor su nivel de engagement.
Цифровые представления непрерывных наблюдаемых в квантовой механике
Authors: Ivanov Mikhail Gennadievich , Polushkin Aleksandr Yur'evich
Published: February 2024

Для симуляции квантовых систем на классических или квантовых компьютерах необходимо дискретизировать непрерывные квантовые наблюдаемые (например, координату и импульс или время и энергию). Рассмотрено представление непрерывных наблюдаемых в позиционных системах счисления как рядов по степеням основания системы счисления, умноженных на "цифры", каждая из которых по отдельности оказывается эрмитовым оператором с дискретным спектром. В работе исследуются полученные таким образом операторы цифр, коммутационные соотношения между ними и эффекты, оказываемые на решетки и представления выбором той или иной позиционной системы счисления. Естественным образом возникают перенормировки расходящихся сумм и интегралов.
CR‐M‐SpanBERT: Multiple embedding‐based DNN coreference resolution using self‐attention SpanBERT
Authors: Jung Joon‐young
Published: February 2024

This study introduces CR‐M‐SpanBERT, a coreference resolution (CR) model that utilizes multiple embedding‐based span bidirectional encoder representations from transformers, for antecedent recognition in natural language (NL) text. Information extraction studies aimed to extract knowledge from NL text autonomously and cost‐effectively. However, the extracted information may not represent knowledge accurately owing to the presence of ambiguous entities. Therefore, we propose a CR model that identifies mentions referring to the same entity in NL text. In the case of CR, it is necessary to understand both the syntax and semantics of the NL text simultaneously. Therefore, multiple embeddings are generated for CR, which can include syntactic and semantic information for each word. We evaluate the effectiveness of CR‐M‐SpanBERT by comparing it to a model that uses SpanBERT as the language model in CR studies. The results demonstrate that our proposed deep neural network model achieves high‐recognition accuracy for extracting antecedents from NL text. Additionally, it requires fewer epochs to achieve an average F1 accuracy greater than 75% compared with the conventional SpanBERT approach.
Dual‐scale BERT using multi‐trait representations for holistic and trait‐specific essay grading
Authors: Cho Minsoo , Huang Jin‐Xia , Kwon Oh‐Woog
Published: February 2024

As automated essay scoring (AES) has progressed from handcrafted techniques to deep learning, holistic scoring capabilities have merged. However, specific trait assessment remains a challenge because of the limited depth of earlier methods in modeling dual assessments for holistic and multi‐trait tasks. To overcome this challenge, we explore providing comprehensive feedback while modeling the interconnections between holistic and trait representations. We introduce the DualBERT‐Trans‐CNN model, which combines transformer‐based representations with a novel dual‐scale bidirectional encoder representations from transformers (BERT) encoding approach at the document‐level. By explicitly leveraging multi‐trait representations in a multi‐task learning (MTL) framework, our DualBERT‐Trans‐CNN emphasizes the interrelation between holistic and trait‐based score predictions, aiming for improved accuracy. For validation, we conducted extensive tests on the ASAP++ and TOEFL11 datasets. Against models of the same MTL setting, ours showed a 2.0% increase in its holistic score. Additionally, compared with single‐task learning (STL) models, ours demonstrated a 3.6% enhancement in average multi‐trait performance on the ASAP++ dataset.
The presence of microplastics affects Spiella japonica hatching performance and microbiota colonization
Authors: Zhang Tao , Chen Xinya , Sun Ke , Chen Jiyi , Chen Xinxin , Xu Jilin , Shi Huilai , Ping Hongling , He Jie , Li Bin , Yu Yebing , Li Lei , Sui Yanming
Published: February 2024

Microplastics (MPs) are a global concern regarding environmental pollution. This study evaluated the impacts of MPs with two sizes (5 µm and 0.5 µm) on hatching performance and microbiota of Sepiella japonica. The presence of MPs increased the hatching rate at some stages of the fertilization process and reduced the oxygen consumption rate at the gastrula stage. No size-dependent impact was observed. The 16S rRNA gene was sequenced to identify the flora. Clustering tags assessed species diversity in the samples with 97% similarity. Proteobacteria was the most abundant phylum in all three groups. MPs publicity appreciably modified flower structure. The most variable genera were Ralstonia, Methylophilus, and Pseudorhodoferax, which can furnish nutrients and modify the host’s immune response. MPs exposure appeared to enrich beneficial bacteria in this study. The presence of MPs with a size of 5µm played a greater role in this process, which is supported by presumptive functions. However, since the adsorption of suspended MPs on aquatic eggs can have cascading effects on specific life stages of oviparous animals, regular monitoring of microbial communities is necessary after juvenile S. japonica formation to prevent disease outbreaks.
Pengelolaan Akun Instagram Resmi Dinas Komunikasi dan Informatika Sebagai Media Pemberitaan Pemerintahan Kab. Madiun
Authors: Istighfarin Awit , Istikhomah Fajar
Published: February 2024

Dalam sebuah media pemberitaan berita sudah menjadi kebutuhan yang penting bagi masyarakat, hampir setiap lapisan masyarakat menginginkan informasi, berita bukan lagi menjadi konsumsi bagi kalangan tertentu saja, namun setiap elemen masyarakat membutuhkan berita dan media yag kini mudah di temukan adalah media online yang menggunakan jaringan internet sebagai akses utamanya. Internet adalah media online yang fleksibel, interaktif, dan dapat diakses secara global dari seluruh dunia. Fenomena media sosial ini ditangkap dengan baik oleh humas dalam suatu pemerintahan yang mempunyai tugas menyampaikan informasi tentang program, kebijakan, serta kegiatan pemerintah, baik yang sedang, sudah, ataupun yang akan dilaksanakan oleh pemerintah. Metode penelitian yang digunakan dalam penelitian ini adalah metode   penelitian   kualitatif, dilakukan   dengan pendekatan secara deskriptif agar memberikan gambaran situasi berdasarkan hasil data penelitian lapangan. Penelitian ini bermaksud untuk menganalisis Pengelolaan Akun Instagram Resmi Dinas Komunikasi dan Informatika Sebagai Media Pemberitaan Pemerintahan Kab. Madiun dengan mengacu pada penerapan manajemen komunikasi massa dengan menerapkan strategi STP (Segmentation, Tragetting, dan Positioning) pada akun instragram milik pemerintah kota.
Analisis Pesan Dakwah Ustadz Agam Fachrul di Media Sosial Tiktok
Authors: Lismawati Lismawati , Kusnadi Kusnadi , Assoburu Selvia
Published: February 2024

Penelitian ini dilaksanakan di media sosial aplikasi tiktok. Untuk objek penelitian yaitu akun tiktok ustadz Agam Fachrul @hiyung_Agam. Adapaun permasalah yang diangkat adalah 1) Bagaimana isi pesan dakwah ustadz Agam Fachrul 2) Bagaimana pesan melalui konten tiktok ustad Agam Fachrul. Penelitian ini bertujuan untuk mengetahui bagaimana dan seperti apa isi pesan dakwah ustadz Agam Fachrul, kemudian bagaimana pesan melalui konten tiktok ustadz Agam Fachrul. Penelitian ini menggunakan metode deskriptif kualitatif, adapun teknik pengumpulan datanya selama proses penelitian menggunakan metode observasi, dokumentasi, dan wawancara. Hasil dari penelitian ini menunjukkan bahwa ada berapa data temuan, data tersebut didapatkan hasil dari pengamatan pada konten-konten dakwah pada akun tiktok @hiyung_agam, bahwa terdapat 2 kategori pesan dakwah syariah, yaitu ibadah syariah dan syariah muamalah. Dalam penelitian ini pesan dakwah syariah yang dominan adalah pesan dakwah syariah muamalah lebih tepatnya sebagai upaya menjawab permasalahan yang sering terjadi antara manusia dengan sesamanya.
Culture Ethnographic Study of Cafe Consumers
Authors:   STIE PGRI Dewantara Jombang, Rofiah Chusnul , Titin Titin ,   Universitas Islam Lamongan
Published: February 2024

This research is motivated by changes in social habits, ideas and behavior in normal social interactions. Especially in terms of using technology. In cyberspace, people can create any identity or existence they choose, but in reality they feel lonely. This often happens in public places, especially cafes. This research focuses on the phenomenon of cafe consumer behavior who is more focused on gadgets than enjoying the company of colleagues, using a type of ethnographic research that involves description and analysis of linguistic patterns from certain groups of people who have similar cultures. Using a Simple Research Design Method with Triangulation Theory (Rofiah & Bungin, 2021). In the process of collecting data and for socialization, reflections will be captured when they are in a situation without communication. This research was conducted in cafes in Indonesia with certain considerations. This sampling approach aligns with the social dynamics of cafes as diners interact with others to find out their orders. The findings of this research are an Ethnographic Study of Cafe Consumer Culture in Indonesia that Cafe Culture, Focus on Gadgets, Perception, Motivation, Information, Addiction, Filling free time, Peers, Professional, Personal Reasons, Lifestyle, Likes hanging out, Groups.
The Influence of Customer Reviews, Seller Ratings, and Responsiveness on Shopee Purchase Interest with Trust as a Mediating Variable in the Fashion Product in Surabaya
Authors:   Universitas 17 Agustus 1945 Surabaya, Amelia Rizki , Cempena Ida Bagus ,   Universitas 17 Agustus 1945 Surabaya, Panjaitan Hotman ,   Universitas 17 Agustus 1945 Surabaya
Published: February 2024

Marketplace serves as a pivotal model in e-commerce, acting as an intermediary between buyers and sellers, exemplified by platforms such as Shopee, Lazada, Tokopedia, among others. Contrary to being a transactional entity, marketplaces facilitate online interactions between sellers and buyers. Meanwhile, e-commerce manifests as a form of online store, either in the form of a website or application owned by a brand, company, or home-based business. The objective of this study is to analyze the direct and indirect influences of customer reviews, seller ratings, and responsiveness on online purchase interests, with trust as a mediating variable in the context of fashion products. The population for this research consists of females aged 16-30 residing in Surabaya, who have not previously purchased products from the brand "femme." The sample comprises 100 respondents, and the data analysis employs the Partial Least Square (PLS) method.
How Did Businesses Deal with the Cybersecurity Risks and Challenges that Come with New Business Model of Remote Work, Role of a Risk Manager
Authors:   Information Security & Risk Officer, Morgan Stanley, New York, United States of America, Shetty Pranith
Published: February 2024

Businesses have always been finding ways to improve , gain a competitive edge in the markets, get more customer share as compared to their peers. In trying to achieve all these objectives, they have to come up with new business models and strategies. The COVID-19 pandemic, however, forced the businesses to adapt or fail, the new operation model of remote work was the only way out for, if not all then majority businesses. As a result, these firms did thrive, more startups showed up to the competition as well, economies jumped back and quickly recovered to normalcy. While moving away from previous business strategies and models in adopting the new remote work culture invites its owns set of challenges as well as cybersecurity risks. These risks can be tackled on a use case basis based on mitigating controls and measures that security staff members come up with, however, Risk managers are very well positioned in a firm to drive a strategic risk response while communicating these risks between engineers and accountable executives. Risk management now is no longer a tool that enterprises needed to gain profits its now an essential mechanism that aids in survival of businesses, Risk managers are now more in demand than ever, these roles enable comprehensive risk reporting to senior leadership helping them understand the holistic risk posture. This article provides insight into the various aspects of remote work culture, positives and risk, furthermore talks about the role of risk managers combined with techniques or methods that can help mitigate the risk identified.
Agile ways of Working
Authors:   Sr. Director – Application Architecture, Masterbrand Cabinets Inc, USA, Kulkarni Nilesh D
Published: February 2024

The document "Agile Ways of Working" provides a comprehensive overview of Agile methodologies in business. It focuses on how these practices enhance adaptability and innovation, highlighting the need for a balanced approach that merges operational stability with agile responses to market demands. The document underscores the significance of customer feedback in driving continuous improvement and the pivotal role of leadership in cultivating an Agile culture. It also explores the challenges and strategies of implementing Agile at scale, emphasizing the transformation of the entire business system for achieving a harmonious balance between efficiency and flexibility in innovation.
Optimizing GPU-Intensive Workloads with Converged Infrastructure
Authors:   NetApp, USA, Sagi Sriram
Published: February 2024

This research paper delves into the utilization of convergent infrastructure platforms to enhance the performance of applications that heavily depend on GPUs.