bluuebunny/crossref_metadata_2025 huggingface dataset:
Modernizing Scholarship for the Public Good: An Action Framework for Public Research Universities
Authors: Aurbach Elyse L. , Kennedy Haley , Redd Kacy , Bennett Jessica , Gobstein Howard
Published: November 2023

APLU’s Modernizing Scholarship for the Public Good Action Framework (2023) offers guidance to public research universities on ways that they can support scholars to advance public impact research, Cooperative Extension, civic science, community-engaged research, and other forms of public engagement, with particular attention to the ways that diversity, equity, inclusion, and justice are integral to this work. The Modernizing Scholarship for the Public Good initiative was led by Elyse Aurbach, the APLU Civic Science Fellow, and supported by the Rita Allen Foundation, the Kavli Foundation, the Burroughs Wellcome Fund, APLU’s FANR, and the University of Michigan. Supplementary materials, including the database of strategies, can be found here: https://osf.io/42753/wiki/home/.
Pre- and Post-Last Glacial Maximum Groundwater Recharge in a Glaciated Region
Authors: Noyes Chandler , McIntosh Jennifer , Dutka Nicholas , Tyne Rebecca , Lindsay Matthew , Ferguson Grant
Published: November 2023

Continental glaciations during the Pleistocene Epoch created complex systems of aquifers and aquitards across many northern regions of the Earth. Past measurements of δD and δ18O measurements show that tills have retained subglacial meltwater but the behaviour of intertill and buried valley aquifers in these regions is less clear. Here, we characterize groundwater ages in these aquifers in Saskatchewan, Canada. Groundwater ages in intertill aquifers are predominantly younger than ~10.3 ka, indicating that they primarily contain water recharged after the retreat of the Laurentide Ice Sheet. Buried valley aquifers contained waters with ages >38 ka in some locations, indicating that recharge occurred prior to the Last Glacial Maximum (LGM). These ages suggest the presence of flow systems with recharge taking place both before and after the LGM, deemphasizing the importance of that event in emplacing groundwater resources in intertill and buried valley aquifers.
THE IMPACT OF KOLs AND KOCs PERSONAL MEDIA ON SHOPPING INTENTION OF CONSUMERS
Authors: Nguyen Luan-Thanh
Published: November 2023

With the development of the digital era, such as e-commerce and social media platforms, the terms "KOLs" and "KOCs" are very popular and have brought a new breeze in marketing, enhanced the development of the commercial market, and helped businesses and customers connect through KOLs and KOCs. The study aimed to investigate the influence of KOLs and KOCs on the purchasing intent of consumers. Specifically, it examines the relationship between the perceived expertise, reliability, reputation, and perceived usefulness of KOLs and KOCs, and the purchasing intent of consumers.
A Wandering Mind is Not Always a Creative Mind: How Thought Dynamics Explain the Relationship between Mind Wandering and Creativity
Authors: de Rooij Alwin , Atef Ali , Faber Myrthe
Published: November 2023

A wandering mind is not always a creative mind. Anecdotes about ideas spontaneously entering awareness during walks, showers and other off-task activities are plenty. The science behind it, however, is still inconclusive. Creativity might result from how thought context—whether thoughts are on-task or off-task—relates to thought dynamics—the manner in which thoughts unfold. While spontaneity and free movement of thoughts in particular can be linked to creativity, little is known about their relationship with mind wandering. To explore this open scientific problem, study 1 (n = 85) surveyed creative professionals about a single idea they had earlier on the day. Spontaneity of thoughts positively correlated with creativity, whereas off-task thoughts or doing something else did not. Study 2 (n = 180) tested the conjectures in a student sample during an idea generation task. The results replicated the findings from study 1, and added that free movement of thoughts also predicts originality during idea generation. The results also showed that the found correlations are limited to individual, rather than domain-wide, creativity. In all studies, the correlations between thought dynamics and creativity were no different for when people engaged in on-task or off-task thought. Given that our findings suggest that a wandering mind is not always necessarily a creative mind, understanding the mind wandering-creativity link requires further research into the causes and characteristics of spontaneous and freely moving off-task thought. Herewith, this study contributes evidence for a new emerging perspective on the relationship between mind wandering and creativity.
New subject classification for bias-free calculation of university profile maps
Authors: Fuchs Joel Emanuel , Heinze Thomas
Published: November 2023

This paper presents a classification of teaching and research fields at universities that allows an unbiased calculation of disciplinary profiles using heat maps. This new classification and the disciplinary profiles derived from it are based on the Activity Index (AI), which can be converted by an appropriate transformation into an index with symmetric value range (RESP). Using public universities in Germany as an example, we show why both AI and RESP values are biased when data sets with many missing or zero values are used, how such a bias manifests itself, and how the new classification enables a bias-free calculation of disciplinary profiles.
Study on Mechanical Behavior of Coconut Fiber Composite as an Alternative Material for Mobile Phone Housing
Authors: Badri Muftil
Published: November 2023

Mobile phone is one of the most widely used electronic products. Housing is part of a very important component of mobile phone. Mobile phone housing refers to the outer housing of the device that encompasses its internal components. Mobile phone housing materials have been widely developed, such as polyester, polyurethane, carbon fiber, wood and leather. This paper proposes to conduct tensile tests and fabrication of mobile phone housing to determine the mechanical characteristics of coconut fiber composites as an alternative material for mobile phone product. Finite element simulation of drop test is then conducted to determine the impact robustness of a product. The investigation of tensile characteristics was carried out using variations in fiber direction. Vacuum assisted resin infusion is used as a method for manufacturing mobile phone housing product. Finite element simulation of mobile phone housing with various drop test positions was also conducted and the impact behaviour of coconut fiber composite housing materials was also obtained. It was shown that coconut fiber can be used as an alternative material for mobile phone housing. The design of the mobile phone housing also needs to be considered at the corner position of the housing because this is the location where the maximum impact stress occurs.
Analysis of the Braking System in the Gardapati Prototype Energy Saving Car
Authors: Davista Halim , Syafri Syafri , Huda Fablil , Anuar Kaspul
Published: November 2023

The braking system is one of the crucial components in a vehicle because braking is a vital safety feature of the vehicle. The braking system functions to reduce or slow down the speed and stop the vehicle, as well as to enable the possibility of parking the vehicle on a downward slope. The braking system under investigation is examined in the prototype vehicle called Gardapati, which employs a hydraulic brake system. Gardapati is a vehicle created by students from the University of Riau's Mechanical Engineering Department, affiliated with the UKM Selembayung, following the standard references provided by the Energy-Efficient Vehicle Competition organized by BPTI.

This final project will involve several calculations related to the braking system, following the specifications used in the Gardapati vehicle. First, calculations will determine the dynamic braking force required (Fb) when the vehicle is moving at a speed of 50 km/h with a distance of 20 meters, as well as the static braking force (Fb) required when the vehicle is on an incline of 11.2 degrees, adjusted to the requirements and regulations of the 2023 Energy-Efficient Vehicle Competition (KMHE). Then, the braking distance will be calculated for speeds of 30, 40, and 50 km/h on dry and wet asphalt road conditions.

From the calculation results and data analysis, it is found that the required dynamic braking force (Fb) is 510,76 N, and the static braking force (Fb) is 830,31 N. Meanwhile, the minimum braking distance is observed on dry asphalt road conditions at a speed of 30 km/h with a percentage error of 1,59 %, where the theoretical value is 5.67 m and the actual value is 5,76 m. On the other hand, the highest braking distance is observed on wet asphalt road conditions at a speed of 50 km/h with a percentage error of 7,39%, where the theoretical value is 14.47 m and the actual value is 15.54 m. Of the two road conditions, the largest percentage error occurs when testing the vehicle at speeds of 30, 40, and 50 km/h on wet asphalt conditions, amounting to 4,61%. With this level of percentage error, it can be concluded that the variation in the obtained data is relatively small, which is less than 10%.
Advances in High-Resolution Non-Destructive Defect Localization Based on Machine Learning Enhanced Signal Processing
Authors: Brand Sebastian , Kögel Michael , Grosse Christian , Altmann Frank , Hollerith Christian , Gounet Pascal
Published: November 2023

Non-destructive inspection and analysis techniques are crucial for quality assessment and defect analysis in various industries. They enable for screening and monitoring of parts and products without alteration or impact, facilitating the exploration of material interactions and defect formation. With increasing complexity in microelectronic technologies, high reliability, robustness and thus, successful failure analysis is essential. Machine learning (ML) approaches have been developed and evaluated for the analysis of acoustic echo signals and time-resolved thermal responses for assessing their ability for defect detection. In the present paper different ML architectures were evaluated, including 1D and 2D convolutional neural networks (CNNs) after transforming time-domain data into the spectra-land wavelet domains. Results showed that 2D CNN with wavelet domain representation performed best, however at the expense of additional computational effort. Furthermore, ML-based analysis was explored for lock-in thermography to detect and locate defects in the axial dimension based on thermal emissions. While promising, further research is needed to fully realize its potential.
Evaluation of Inductor for Solderability and Drop Damage Susceptibility
Authors: Marshall Mack , Huang Edward , Rajaraman Arun , Grosjean David
Published: November 2023

Lead-free solder joints tend to be more susceptible to brittle fracture, and thus susceptible to drop-damage. Drop testing of handheld ultrasound devices revealed broken solder joints on a large inductor component. Analysis of the cracks showed a dual intermetallic compound (IMC) layer of Ni3Sn4 (closest to the nickel) and (Ni,Cu)6Sn5, with the crack occurring in between the two layers. The inductor had a tinned nickel lead finish; the solder was SAC305 (a common lead-free solder comprising Sn, Ag, and Cu); and the printed circuit board (PCB) had a standard copper finish. The failure occurred very soon after manufacture and had not been enhanced by temperature cycling or aging, but it was not a time-zero failure: mechanical shocks from drops were required to propagate the crack through the joint fully. Strain measurements did not find any large strains after reflow and assembly, and no other components on the board showed cracking. There was no cracking observed at the PCB (Cu) side of the solder joint. The solution ultimately was to redesign the board, replacing the large single component with several smaller ones.
Intricacies in the Failure Analysis of Integrated Capacitors
Authors: Mahinay Christopher S. , Reyes Christian , Calanog Ricardo , Mendaros Raymond
Published: November 2023

Integrated capacitors use metal plates such as in Metal-Insulator-Metal (MIM) and Metal-Oxide-Metal (MOM) capacitors while Polysilicon and Silicon (Si) substrate for metal-oxide-semiconductor (MOS) capacitors. Three major challenges and solutions were discussed in this technical paper. First, the failure site localization of a subtle defect in the capacitor plates. To determine the specific location of the defect site, Electron Beam Induced Current (EBIC) analysis was performed while the part was biased using a nano-probe set-up under Scanning Electron Microscopy (SEM) environment. Second, Failure Mechanism contentions between Electrically Induced Physical Damage (EIPD) or Fabrication process defect particularly, for damage site that is not at the edge of the capacitor and without obvious manifestations of Fabrication process anomalies such as bulging, void, unetched material or shifts in the planarity of the die layers. To further understand the defect site, Scanning Transmission Electron Microscopy (STEM) coupled with Energy-Dispersive X-ray Spectroscopy (EDS) were utilized to obtain high magnification imaging and elemental area mapping. Third, misled conclusion to be an EIPD site manifested by burnt and reflowed metallization. The EIPD site was only a secondary effect of a capacitor dielectric breakdown. This has been uncovered after understanding the circuit connectivity, inspections of the capacitors connected to the EIPD site, fault isolation and further physical failure analysis were performed. As results of the Failure Analysis (FA), Customer and Analog Devices Incorporated (ADI) manufacturing hold lots were accurately dispositioned and related corrective actions were precisely identified and implemented.
Backside Analysis Strategy to Identify a Package Related Failure Mode at an Automotive Magnetic Sensor Device
Authors: Simon-Najasek M. , Naumann F. , Huebner S. , Lejoyeux M. , Altmann F. , Lindner A.
Published: November 2023

This paper presents a root cause analysis case study of defective Hall-effect sensor devices. The study identified a complex failure mode caused by chip-package interaction, which has a similar signature to discharging defects such as ESDFOS. However, the study revealed that the defect was induced by local mechanical force applied to IC structures due to the presence of large irregular-shaped filler particles within the mold compound. Extensive failure analysis work was conducted to identify the failure mode, including the development of a new backside analysis strategy to preserve the mold compound during IC defect localization and screening. A combination of different failure analysis techniques was used, including CMP delayering, PFIB trenching, SEM PVC imaging, and large area FIB cross-sectioning. The study found that the mold compound of the package caused thermos-mechanical strain onto the silica filler particle due to epoxy shrinkage during the molding process. Additionally, extra-large, irregularly shaped filler particles (called twin particles), located on top of the chip surface, can cause locally high compression stresses onto the IC layers, initiating cracks in the isolation layers under certain conditions forming a leakage path over the time. Thermo-mechanical finite element analysis was applied to verify the mechanical load condition for these large irregular-shaped filler particles. As a result, an additional polyimide layer was introduced onto the IC to mitigate the mechanical stress of mold compound particles to avoid this failure mode.
Benchmarking ResCav – A Resonant Cavity System Used to Detect Counterfeit Microelectronics
Authors: Nechiyil Aditya , Lee Robert , Chapman Gregg , McCue Jamin J.
Published: November 2023

Counterfeit integrated circuits (ICs) continue to persist in the supply chain causing early failure in electronics that unknowingly incorporate them. With counterfeiters becoming more adept at replicating ICs, the need for systems and processes to identify counterfeit ICs has been growing in recent years. In this paper, we benchmark the resonant cavity system (ResCav) by evaluating its ability to distinguish ICs with minor circuit variations. A baseline IC group along with 5 variant groups with changes made solely to their die were examined in this paper. Using a supervised machine learning algorithm, the system was able to distinguish every group of ICs amongst each other with an average weighted precision above 90% in every comparison scenario. The system’s ability to distinguish these subtle changes means that it would be suitable when used as a system for counterfeit detection, where the detection of minor deviations is pertinent. This could ultimately lead to the creation of a rapid, precise, and non-destructive system that can screen ICs for conformance.
Methods to Enhance Infrared Imaging for Defect Localization Using Lock-in Thermography
Authors: Sharma Anjanashree M.R. , Jacobs Kristof J.P. , De Wolf Ingrid
Published: November 2023

In this paper, we demonstrate three approaches to enhance the topographical contrast of infrared images obtained from lockin thermography (LIT). Infrared imaging, particularly LIT, is one of the extensively used techniques for failure analysis (FA) in the semiconductor industry. However, low-contrast topography images are obtained at room temperature from conventional LIT due to poor emissivity contrast in the devices and the limitation on the performance of the infrared camera. The gray-scale topographical contrast is improved by 85% when the device under test is heated from room temperature to 75°C, using a printed circuit board heater. Furthermore, a heat-assisted LIT approach is proposed and demonstrated at the die level on an electrically leaky silicon interposer sample. The topographical contrast and the signal intensity of the hotspot obtained are enhanced when compared to the classical LIT, which is performed at room temperature. Further, the dual LIT approach is developed to reduce the thermal budget of the heat-assisted approach. The hotspot amplitude and improved topography image are obtained from two consecutive lock-in measurements. In addition, the topography image from this technique is obtained by averaging several hundred frames from the camera for a period of ten minutes, which results in an image that is less susceptible to input noise levels. To increase the throughput of the FA process, quadrature lock-in thermography, a dual-purpose measurement technique is shown. A high-contrast topography image and the hotspot location are obtained from the same lock-in thermogram by performing trigonometric conditioning. The throughput from this approach is the same as the classical LIT technique.
Logical to Physical SRAM Bitmap Verification with Fault Localization
Authors: Maggiacomo Alexander , Pahari Rabindra , Schaefer Torsten , Billus Gregory , Shekar Suresh , Kodali Satish , Beaudoin Felix , Sinnott Aaron
Published: November 2023

Physical Failure Analysis (PFA) is essential for SRAM yield learning, especially in new technologies or FAB transfers. For this to be successful, physical coordinates for tested bitcell failures must be accurately calculated and verified. The timeline for this process can vary dramatically based on the extent and complexity of any issues. This paper details the successful use of fault localization on isolated, voltage sensitive failures to achieve confidence in verification of physical location prior to PFA.
Electron Beam Induced Resistance Change for Isolation of Wordline Shorts in 3D Replacement Gate NAND
Authors: Rich Chandler , Harlow Wayne , Muñoz Becky , Sandoval Regino , Davis J. Temo , Williams Scott
Published: November 2023

In this paper, we present a new application of electron beam induced resistance change (EBIRCH) as a means to spatially isolate wordline shorts in 3D replacement gate NAND for high-precision physical failure analysis (PFA).
Defect Isolation in Advanced Nodes Large Circuitry Structures using a Combination of FIB Circuit Edits and Passive Voltage Contrast
Authors: Rodder Michael Allen , Cha Gina , Tovar Gil , Chin Cheong Kah , Penley Christopher
Published: November 2023

In this paper, we discuss and showcase a 2-step defect isolation methodology by combining Focused Ion Beam “circuit editing” (FIB circuit edit) and Passive Voltage Contrast (PVC) imaging. The combo technique is an effective, robust, and time saving method for isolating defects in large area circuit structures for advanced nodes. The application of FIB circuit edits successfully enhanced the PVC efficiency in defect isolation. More importantly, the developed 2-step methodology improves failure analysis (FA) success rate and quality, and reduces FA turn-aroundtime (TAT).
Low-kV FIB Applications and Workflows for Advanced Circuit Edit
Authors: Yan Rongjin , Vaghayenegar Majid , Donnet David , Buxbaum Alex
Published: November 2023

Circuit edit (CE) workflows are well established for FIB energies of 30kV and above. The small spot size associated with such energies provides good milling acuity and imaging resolution needed for advanced CE applications. However, with the introduction of FinFET transistors and decreasing technology nodes, the dramatic reduction in STI to gate distance reduction poses some challenges to circuit editing at these high energies. These include transistor performance degradation due to Ga+ implantation as well as significant lateral scattering beyond the Node Access Hole (NAH) as defined by the pattern. In addition, the relatively fast milling speeds may not give enough control to the user to endpoint at the appropriate layer. In this paper, a group of FinFET transistors on a special test chip was edited with the Ga beam at different energies. Transistor performances were then characterized to evaluate any degradation. The resulting characterization revealed how the transistor performance was affected by the injected ion beams and provided a guideline for the low-kV circuit edit workflow. A novel low-kV FIB workflow was proposed to minimize the transistor damage and maintain the IC functionality after the CE process. The workflow was applied to a challenging CE problem on a 5nm FinFET device. This task included step by step backside delayering at 5kV, preparing the sample for the final circuit edit operation at Metal-1. Working at low landing energies (e.g. 5kV) lowers subsurface damage and reduces etching speed, but with trade offs including lower image resolution, milling acuity, sputtering yield and signal to noise ratio (SNR). However, the consequences of these effects can be mitigated by use of appropriate chemistries with closed loop delivery control and extremely low beam currents (≤1pA), in concert with double aperture beam shaping to minimize beam tails. On the 5nm FinFET device, we demonstrate good delayering control by optimization of beam currents, and gas delivery on the Centrios HX circuit edit system from Thermo Scientific.
Electron Beam Probing: The New Sheriff in Town for Security Analyzing of Sub- 7nm ICs - Exploring the Advantages of a Post-Photon Emission Technique
Authors: Varshney Nitin , Xi Chengjie , Khan Aslam A , Biswas Liton Kumar , Sorger Volker , Dalir Hamed , Asadizanjani Navid
Published: November 2023

The increasing demand for semiconductor chips and the outsourcing of chip fabrication have heightened vulnerability to hardware security threats. While optical probing has been used extensively for semi-invasive/non-invasive attacks, its resolution limits and obsolescence in advanced technologies have necessitated exploring other techniques. Electron-beam probing (EBP) has emerged as a powerful method, offering 20x better spatial resolution than optical probing, and applies to sub- 7nm flip-chips and advanced 3D architecture systems. However, the increased resolution of EBP also poses a threat to sensitive information on these advanced chips, calling for developing countermeasures to secure assets. By understanding the capability of EBP, the potential of using EBP to extract sensitive data such as encryption keys, soft IP, neural network parameters, and proprietary algorithms will be discussed. This paper delves into the principles behind EBP, its capabilities, challenges for this technique, and potential applications in failure analysis and potential attacks. It highlights the need for developing effective countermeasures to protect sensitive information on advanced node technologies.
2D and 3D Metrology and Failure Analysis for High Bandwidth Memory Package by Xe and Ar Plasma-FIB
Authors: Mullen Melissa , McClendon Mark , Stokes Adam , Gu Xiaoting , Carleson Pete
Published: November 2023

Continued advancements in the architecture of 3D packaging have increased the challenges in fault isolation and failure analysis (FA), often requiring complex correlative workflows and multiple inference-based methods before targeted root cause analysis (RCA) can be performed. Furthermore, 3D package components such as through-silicon-vias (TSVs) and micro-bumps require sub-surface structural characterization and metrology to aid in process monitoring and development throughout fabrication and integration. Package road-mapping has also called for increased die stacking with decreased pitch, TSV size, and die thickness, and thus requires increased accuracy and precision of various stateof- the-art analytical techniques in the near future. Physical failure analysis (PFA), process monitoring, and process development will therefore depend on reliable, high-resolution data directly measured at the region of interest (ROI) to meet the complexity and scaling challenges. This paper explores the successful application of plasma-FIB (PFIB)/SEM techniques in 2D and 3D regimes and introduces diagonal serial sectioning at package scales as a novel approach for PFA and metrology. Both 2D and 3D analysis will be demonstrated in a high bandwidth memory (HBM) package case-study which can be applied more broadly in 3D packaging.
“Full” Automatic TEM from Imaging to Metrology
Authors: Liu Yong , Carlton Christopher Earl , Zhang Qi
Published: November 2023

TEM automation is dedicated to providing high-volume, fast and precise TEM data to enable semiconductor manufacturers to develop and control fabrication processes. It automates TEM operation and measurement procedures, and minimizes the requirements of user training. Traditionally, recipes are required for each specific structure, and Automatic TEM Imaging and Metrology had individual recipes for each structure, respectively and separately. TEM professionals review structures and TEM images and manually assign imaging and metrology recipes one by one. After metrology, it is tedious to manually check mis-measurement of hundreds of TEM images and Critical Dimensions (CDs). In this study, An Intelligent TEM automation process was developed by machine learning process that could “fully” automatically conduct TEM Analysis from Imaging to Metrology starting right after TEM holder insertion without human intervention. It is not limited to automatically prepared TEM samples and also works for manually prepared samples. TEM Auto Metrology is carried out automatically right after Auto Imaging in the background. After that, Auto capturing of mis-measurements can be carried out automatically to catch problematic metrology images and CDs as an invaluable complement. As a result, the whole workflow was streamlined, with better efficiency and accuracy achieved.
Complete Compressed Sensing System For Scanning Probe Microscopy
Authors: Principe E.L. , Scammon K.M. , Kempshall B.W. , Hagen J.J.
Published: November 2023

An approach to overcome barriers to practical Compressed Sensing (CS) implementation in serial scanning electron microscopes (SEM) or scanning transmission electron microscopes (STEM) is presented which integrates scan generator hardware specifically developed for CS, a novel and generalized CS sparse sampling strategy, and an ultra-fast reconstruction method, to form a complete CS system for 2D or 3D scanning probe microscopy. The system is capable of producing a wide variety of highly random sparse sampling scan patterns with any fractional degree of sparsity from 0- 99.9% while not requiring fast beam blanking. Reconstructing a 2kx2k or 4kx4k image requires ~150-300ms. The ultra-fast reconstruction means it is possible to view a dynamic reduced raster reconstructed image based upon a fractional real-time dose. This CS platform provides a framework to explore a rich environment of use cases in CS electron microscopy that benefit from the combination of faster acquisition and reduced probe interaction.
Backside Fault Localization and Defect Physical Analysis of Degraded Power HEMT p-GaN Transistors Stressed in DC and AC Switching Modes
Authors: Ghizzo L. , Guibaud G. , De Nardi C. , Jamin F. , Chazal V. , Trémouilles D. , Monflier R. , Richardeau F. , Bascoul G. , González M.
Published: November 2023

This paper describes a backside approach methodology for sample preparation, fault localization and physical defect analysis on p-GaN power HEMT electrically stressed in DC voltage surge and AC switching mode. The paper will show that preparation must be adapted according to the defect position (metallurgy, dielectric layers, epitaxy, etc.) which depends on the type of stress applied. In our life-operation mode amplified electrical stress reliability study, the failure analysis will help us to reveal the weakest parts of the transistor design in relation to the type of applied stress. The failure analysis presented in this paper is composed of electrical characterization, defect localization with PEM and LIT, FIB Slice&View, TEM analysis and frontside conductive AFM after a deep HF.
A Correlative Study of Silicon Carbide Power Devices Using Atom Probe Tomography and Transmission Electron Microscopy
Authors: Cuduvally Ramya , Guerguis Bavley , Langelier Brian , Bassim Nabil D. , Cuduvally Ramya , Andrei Carmen M. , Casagrande Travis , Arcuri Gabriel A. , Langelier Brian , Bassim Nabil D. , Russell Stephen
Published: November 2023

Atom probe tomography is used to characterize the 3D Al dopant distribution within the gate diffusion region of a deconstructed SiC n-channel junction field effect transistor. The data reveals extensive inhomogeneities in the dopant distribution, which manifests as large Al clusters - some of which are ring-shaped and indicative of dopant segregation to lattice defects in the SiC. The presence of defects in the SiC is confirmed by transmission electron microscopy of an identical region. Factors that may impact the atom probe data quality and consequently complicate data interpretation are considered, and their severity evaluated. The possible origin of the lattice defects in the SiC and the corresponding implications for device performance and reliability are also discussed. Overall, the utility of atom probe tomography and correlative transmission electron microscopy for revealing potential failure mechanisms of next-generation semiconductor devices is demonstrated.
Detection and Localization of Undesired Quasi-Static Transitions in a Scan Flip-Flop
Authors: Merassi A.A. , Frascolla S. , Sacchi P. , Raimondi M. , Jossa A.
Published: November 2023

The aim of this work is to disclose about the difficulties of handling quasi-static transition failures and propose one possible strategy to detect and locate them in a failure analysis test environment with the most appropriate fault localization technique.
Efficient Technique In Decapsulating Mounted Device Using Aluminum Tape
Authors: Saputil John Michael , Pasating Vicente
Published: November 2023

In failure analysis, demounting and mounting is one of the steps in preparation for the electrical verification of the device. Performing decapsulation while the unit is mounted on the printed circuit board (PCB) is one of the solutions to limit the repeated demounting, mounting, and re-balling processes. However, it can cause inadvertent damage to the device and the PCB when the acids overflow, which could hinder further electrical verification of the unit. In this study, a new method of decapsulation using aluminum tape is used to protect the device and PCB during the decapsulation process. Results show that the use of aluminum tape is an effective method for decapsulating packaged units on PCB. It can prevent damages such as external lead detachment after demounting, ball pad oxidation, and recovery of device failure due to heat application.
Tomography of Electrical Data in Advanced-Node SRAMs
Authors: Johnson Gregory M. , Hitzel Frank
Published: November 2023

A commercially available 6T SRAM was examined with an AFM-in-SEM system. A conductive AFM measurement was taken using an AC bias on the backside of the sample with a linear amplifier on the data. Then using a cone-shaped, diamond AFM tip, subsequent scans were made over the field of view at increasingly higher downforce until areas of the chip were worn away. The results provide a survey of implants and structure milling from contact level through the wells of the device. An additional experiment was performed with EBAC.
ESD Challenges in Advanced CMOS Technologies—Designing Diode Based ESD Protection
Authors: Chen Shih-Hung
Published: November 2023

Presentation slides for the ISTFA 2023 Tutorial session “ESD Challenges in Advanced CMOS Technologies-Designing Diode Based ESD Protection.”
MOSFET Testing and Interpretation Overview
Authors: Albert Dave
Published: November 2023

Presentation slides for the ISTFA 2023 Tutorial session “MOSFET Testing and Interpretation Overview.”
A Practical Tutorial on ATE-Based Electrical Fault Isolation of Digital SoCs Using Photon Emission and Laser Voltage Imaging/Probing
Authors: Endrinal Lesly
Published: November 2023

Presentation slides for the ISTFA 2023 Tutorial session “A Practical Tutorial on ATE-Based Electrical Fault Isolation of Digital SoCs Using Photon Emission and Laser Voltage Imaging/Probing.”
Power Semiconductor Failure Analysis Tutorial
Authors: Johnson Greg , Rummel Andreas , Huang Chengliang , Mello Domenico , Hitzel Frank , Stegmann Heiko , Terada Hirotoshi , Byrnes John , Goswami Shubhodeep
Published: November 2023

Presentation slides for the ISTFA 2023 Tutorial session “Power Semiconductor Failure Analysis Tutorial.”
Machine Learning Based Data and Signal Analysis Methods for the Application in Failure Analysis (2023 Update)
Authors: Kögel Michael , Brand Sebastian , Altmann Frank
Published: November 2023

Presentation slides for the ISTFA 2023 Tutorial session “Machine Learning Based Data and Signal Analysis Methods for the Application in Failure Analysis (2023 Update).”
What Packages Are in Your Mobile Device?
Authors: Yancey Trevor
Published: November 2023

Presentation slides for the ISTFA 2023 Tutorial session “What Packages Are in Your Mobile Device?.”
Failure Analysis Challenges for Chip Scale Packages (2023 Update)
Authors: Li Susan X.
Published: November 2023

Presentation slides for the ISTFA 2023 Tutorial session “Failure Analysis Challenges for Chip Scale Packages (2023 Update).”
HUBUNGAN ANTARA KEMAMPUAN BERPIKIR KREATIF DENGAN KEMAMPUAN PEMECAHAN MASALAH FISIKA PESERTA DIDIK
Authors: L Jumriana , Lutfin Nursakinah Annisa , Mutmainna Mutmainna
Published: November 2023

Penelitian ini dilakukan dengan tujuan untuk mengetahui hubungan antara kemampuan berpikir kreatif dengan kemampuan pemecahan masalah fisika peserta didik. Sampel yang digunakan dalam penelitian ini adalah siswa kelas XI IPA SMAN 8 Enrekang dengan jumlah peserta didik 34 orang. Teknik pengumpulan data dalam penelitian ini dilakukan dengan tes dan angket. Teknik analisis data yang digunakan yaitu analisis korelasi yang terdiri dari analisis uji prasyarat dan uji hipotesis. Hasil penelitian di SMAN 8 Enrekang menunjukkan bahwa t hitung (13,194) > t tabel (2,037) dan nilai sig. (0,000) < (0,05) pada hasil data angket dan juga t hitung (5,615) > t tabel (2,037) dan nilai sig. (0,000) < (0,05) pada hasil data tes. Nilai korelasi pada data angket sebesar 0,919 dan nilai korelasi pada data tes sebesar 0,704. Kemampuan berpikir kreatif memberikan kontribusi sebesar 84,5% terhadap kemampuan pemecahan masalah pada peserta didik pada data angket dan 49,6% pada data tes. Sehingga dapat disimpulkan bahwa hubungan antara kemampuan berpikir kreatif terhadap kemampuan pemecahan masalah peserta didik bersifat positif dan signifikan dengan hubungan yang sangat kuat pada data angket dan hubungan yang kuat pada data tes.
PERAN ORANG TUA DALAM PEMBELAJARAN SAINS PADA ANAK USIA DINI
Authors: Salsabila Wardah Nibras , Fahmiah Nabilah , Aqila Dayang Nur , Mahardika I Ketut , Bektiarso Singgih
Published: November 2023

Tujuan kajian ini untuk mengetahui bagaimana keterlibatan orang tua dalam mengembangkan ilmu pengetahuan sains bagi anak melalui beberapa jurnal yang telah dianalisis dan diolah. Anak usia dini sebagai individu yang berada pada masa terpenting sepanjang sejarah hidupnya yaitu masa keemasan dan peka terhadap segala stimulus yang diterimanya. Orang tua berperan dalam memberikan stimulus pada anak agar dapat tumbuh dan berkembang sesuai dengan tahapan usianya. Salah satunya dengan pembelajaran sains yang dapat diberikan pada anak sedini mungkin untuk mengembangkan sikap ilmiah anak yang berguna dalam kehidupan selanjutnya. Orang tua dapat mengajak dan membiasakan anak bermain sains. Bermain sains dapat dilakukan dengan memanfaatkan lingkungan sekitarnya. segala benda yang ada di dekat anak, juga fenomena alam yang sering dialami dan dirasakan anak. Kegiatan sains dengan melakukan eksperimen menjadikan anak dapat berpikir logis, sistematis, dan kritis.
ANALISIS STANDAR DAN PEMANFAATAN SARANA DAN PRASARANA LABORATORIUM FISIKA TERHADAP PEMBELAJARAN PESERTA DIDIK DI SMA NEGERI 4 JEMBER
Authors: Novianti Rina Dian , Farhana Siti Silfi , Saragih Devi Fionita , Mauladhani Anisa Eka , Maula Adinda Nikmatul , Amindri Mariska Yudha , Nuraini Lailatul , Harijanto Alex
Published: November 2023

Laboratorium merupakan tempat dilakukannya percobaan, penyelidikan atau kegiatan ilmiah. Kelengkapan sarana dan prasarana laboratorium merupakan hal pokok yang harus dimiliki oleh sebiah laboratium untuk menunjang proses pembelajaran di Sekolah. Penelitian ini bertujuan untuk menyelidiki dan menganalisis standar dan pemanfaatan laboratorium terhadap pengalaman belajar siswa di SMAN 4 Jember. Metode yang digunakan adalah metode deskriptif dengan pendekatan kualitatif. Pengumpulan data menggunakan metode observasi, angket, dan wawancara. Hasil penelitian menunjukkan bahwa penggunaan analisis standar, fungsi dan pemanfaatan laboratorium di SMAN 4 Jember belum memeuhi standar, dikarenakan masih banyak hal yang masih perlu perhatian seperti perlengkapan praktikum dan penjadwalan praktikum agar kegiatan praktikum dapat berjalan lancar. Penelitian ini juga mengidentifikasi beberapa tantangan. Salah satunya adalah keterbatasan sumber daya dan fasilitas laboratorium di beberapa sekolah.
ANALISIS STANDARISASI LABORATORIUM FISIKA PADA ASPEK SARANA PRASARANA, DAN PENGAWASAN DI SMAN AMBULU
Authors: Putri Fidia Alhikmah , Solehah Mufidatus , Agustin Aulia Wulansari , Adelia Yesica Listian , Malihah Berlian Marsha , Almaidah Almaidah , Nuraini Lailatul
Published: November 2023

Penelitian ini dilakukan untuk mengetahui standarisasi laboratorium fisika pada aspek sarana praarana serta pengawasan yang ada di SMAN Ambulu. Penelitian ini merupakan penelitian deskriptif  kualitatif. Subyek yang menjadi sasaran penelitian ini adalah kepala laboratorium fisika, pengelola laboratorium fisika, guru mata pelajaran fisika, dan sarana prasarana laboratorium fisika di SMAN Ambulu. Teknik pengumpulan data yang digunakan yaitu observasi yang dilakukan secara langsung ke tempat, wawancara secara langsung kepada pihak sasaran penelitian, dan mengambil dokumentasi. Hasil penelitian yang didapatkan melalui data yaitu perabotan dengan presentase 100% dikategorikan sangat baik, peralatan dengan presentase 84,2% dikategorikan sangat baik, alat percobaan 64,6% dikategorikan cukup baik, media pendidikan 100% dikategorikan sangat baik, dan perlengkapan lain 86,9% dikategorikan sangat baik, sehingga diperoleh rata-rata 87,2% yang artinya sangat baik.
RANCANG BANGUN SISTEM TURBIN PEMBANGKIT LISTRIK TENAGA MIKROHIDRO PADA DAERAH IRIGASI SAWAH ALIRAN RENDAH
Authors: Abimanyu Yanuar , Sudarti Sudarti , Yushardi Yushardi
Published: November 2023

Penelitian ini dilakukan untuk mengetahui potensi dari  sumber energi terbarukan yang ada di indonesia. Sumber energi terbarukan di indonesia salah satunya adalah energi air, pemanfaatan energi air banyak sekali diterapkan pada konsep pembangkit listrik tenaga air (PLTA)  atau   pembangkit listrik tenaga mikrohidro ( PLTMH ). Selain untuk mengetahui potensi sumber energi terbarukan, penelitian ini bertujuan untuk mengkaji lebih lanjut mengenai karakteristik  pada rancangan sistem turbin. Rancangan sistem turbin yang digunakan pada PLTMH memiliki karakteristik tertentu tergantung daerah aliran yang dijadikan pembangunan pembangkit listrik tenaga mikrohidro. Bentuk  turbin sangat berpengaruh pada penghasilan energi listrik tenaga air, dikarenakan bentuk turbin akan menentukan hasil putaran pada sebuah generator. Karakteristik turbin yang cocok pada aliran irigasi sawah aliran rendah adalah turbin dengan jenis Crossflow, turbin crossflow merupakan turbin yang memiliki efisiensi yang baik untuk diterapkan pada aliran rendah seperti aliran irigasi sawah. Dalam penelitian ini digunakan metode kajian literatur sebagai komponen utama, dengan membandingkan literatur yang berkaitan dengan penelitian yang dilakukan. Setelah dilakukan kajian literatur akan dilakukan desain sederhana menggunakan sistem software untuk mengatur rancangan turbin yang sesuai. Dengan adanya rancang bangun sistem turbin diharapkan bisa memaksimalkan pemanfaatan terhadap sumber energi air sebagai energi terbarukan daerah kecil pada kawasan pertanian dan sungai.
PENGARUH MODEL PEMBELAJARAN CYCLE 7E DALAM PEMBELAJARAN FISIKA TERHADAP KECAKAPAN BERPIKIR RASIONAL PESERTA DIDIK
Authors: Kalsum Ummu , Lutfin Nursakinah Annisa , Adawiah Raudatul
Published: November 2023

Penelitian ini bertujuan untuk mengetahui pengaruh yang signifikan model pembelajaran tipe Cycle 7E dalam pembelajaran fisika terhadap kecakapan berpikir rasional peserta didik kelas XI SMA Negeri 2 Campalagian. Metode penelitian yang digunakan adalah eksperimen semu (quasi-experiment) dengan menggunakan desain pretest-posttest control group. Subjek penelitian adalah peserta didik kelas XI SMA Negeri 2 Campalagian. Kelompok kontrol menerima pembelajaran fisika dengan model pembelajaran konvensional, sedangkan kelompok eksperimen dengan model pembelajaran Cycle 7E. Data kecakapan berpikir rasional diukur dengan menggunakan instrumen tes yang terdiri dari soal pilihan ganda, data kemudian diolah dengan menggunakan analisis statistic deskriptif dan analisis inferensial. Hasil penelitian menunjukkan bahwa nilai rata-rata kecapakan berpikir rasional peserta didik pada kelas ekpserimen sebesar 77,33 yang berada pada kategori tinggi. Sementara kelas control memperoleh nilai rata-rata sebesar 48,67 yang berada pada kategori rendah. Hasil penelitain tersebut menunjukkan bahwa terdapat pengaruh yang signifikan kecakapan berpikir rasional peserta didik sebelum dan setelah diajar menggunakan model learning Cycle 7E pada kelas XI MIPA SMA Negeri 2 Campalagian.
Retrospective evaluation of the epidemic of influenza A (H1N1) in Ukraine from the point of pathology
Authors: Dibrovа J. V.
Published: November 2023

Based on the analysis of clinical records and pathological studies on the 140 who died during the flu epidemic in Ukraine A/H1N1/California/04/09 using data from the Epidemiological Monitoring of the situation at that time identified the most significant components of this experience to optimize the health and social events in similar circumstances.
PREVENTION OF CORRUPTION IN PUBLIC AUTHORITIES IN THE CONTEXT OF ECONOMIC SECURITY
Authors:   Chernihiv Polytechnic National University, KOSACH Irina
Published: November 2023

The article provides an analysis of the current state of legal regulation of state administration regarding the prevention of corruption in state authorities in the context of economic security under martial law. Thus, one of the most important tasks of state administration in preventing corruption in public authorities is that the state must provide “legal security” to all its citizens, and this may require the introduction of temporary restrictions on the actions of certain normative legal acts regulating the issue of preventing corruption. The introduction of martial law and the relaxation of anti-corruption legislation can also lead to an increase in the risk of corruption, as such a situation is often accompanied by aggravation of the socio-economic situation and an increase in the susceptibility of citizens to various types of illegal activities. Therefore, it is important to ensure effective control over the activities of state bodies that ensure security in the conditions of martial law, and to implement preventive measures to prevent corruption in these bodies. Electronic declaration is considered one of the important tools for preventing corruption in the public sector. It is also characterized as an “anti-corruption declaration”, based on the totality of all forms of legal consolidation and organizational support of universally binding rules of conduct in the totality of their interrelationships, through which prescriptions are objectified that determine the method of checking the integrity of authorized persons through the performance of duty from the declaration The priority of ensuring effective state administration in preventing corruption in order to preserve citizens’ trust in state institutions and maintain social stability is indicated. It is argued that one of the important components of the fight against corruption in Ukraine today is the declaration of the income of officials. The directions of state administration regarding the prevention of corruption in state authorities in the conditions of martial law have been determined.
INVESTMENT IN UKRAINE: MAIN TENDENCIES, PROBLEMS AND PROSPECTS OF ACTIVATION
Authors:   Natіonal Unіversіty “Zaporіzhzhіa Polytechnіc”, LOZA Svіtlana
Published: November 2023

Investment is the primary catalyst for the development of any country. Without appropriate investment, recovery and a prosperous future for Ukraine are impossible. Despite thorough studies of domestic and foreign investment trends, more attention should be paid to analyzing the impact of crisis phenomena on the dynamics and structure of investments. The search for the main directions of activation of investment processes in conditions of the acute need for financial resources for the recovery of Ukraine requires further elaboration. The article aims to study the main trends, risks, and prospects for activating investment processes in Ukraine. The article analyzed the dynamics and studied the most important factors influencing the leading socio-economic indicators of Ukraine for 1997-2020. The level of investment intensity in the economy of Ukraine for 1995-2020 was evaluated, which showed that only within five years ( 2004-2008) the intensity of investments exceeded the bar of 20%. Ukraine never recovered after the global financial crisis of 2008-2009. Peculiarities of the influence of unpredictable factors and crisis phenomena on the volume and structure of investment attraction from various sources of financing have been studied. A study of the dynamics of foreign direct investments for 1995-2020 was conducted. The main directions and prerequisites for the activation of investments in the economy of the country, which is actually in a state of war, as well as its post-war recovery, were outlined. It was established that for the full-scale attraction of investments from investment funds, private investors, and grant funds, the availability of available and reliable information about promising investment projects and possible benefits from their implementation is of utmost importance; practical tools of public administration; a transparent system of project verification and an effective system of monitoring their results with the possibility of information exchange; minimization of corruption risks; working out the mechanism of insurance of investment risks during the war.