bluuebunny/crossref_metadata_2025 huggingface dataset:
PASTORAL CARE BAGI JEMAAT DEWASA MUDA DENGAN GAMOPHOBIA MENUJU PERNIKAHAN KRISTEN
Authors: Cyntiawati Dian , Hermanto Yanto Paulus , Abraham Jessica Elizabeth
Published: February 2024

Today some young adults decide not to marry. Various reasons were put forward, including fear of being committed to their partner ‒how to interact with their partner's family – not to mention the matter of heredity. These things make young adults experience gamophobia and no longer care about married life. Gamophobia, if not overcome, will result in both physical and psychological disturbances to the young adults themselves. It can even impact the people around him, especially those closest to him. This study used a qualitative method by observing the phenomena experienced by young adults, then the researchers conducted interviews with informants who participated gamophobia. A study analysis was carried out through the literature and then the results were explained descriptively. It was found that a lack of understanding of marriage made young adults avoid it. Pastoral care in the youth community and religious counseling services play an essential role in helping young adults with gamophobia experience a full recovery. It is hoped that through these services, young adults will overcome fear and be ready to enter the marriage ladder. In the end, the church will thrive; and become a witness to the world through the life of its congregation.
Women And Work Choices In The Tourism Sector: A Form Of Women Empowerment
Authors: AYUNINGSASI A.A.K , SARASWATY Amrita Nugraheni , SAIENTISNA M.D.
Published: February 2024

The covid-19 pandemic profoundly influenced the Balinese economy and tourism industry, particularly in Canggu's growing economy. The general purpose of this research is to discover how Canggu women's career options have changed since the rapid development of tourism in recent years, as the effect of tourism downfall during and after the COVID-19 epidemic. The research objective is to analyze the internal and external elements that impact women's decision to enter the workforce. This study adopted a qualitative descriptive analysis based on the research purpose. Female Canggu Village Youth Organization members were explicitly chosen as informants for this study. The interview process findings and researchers' involvement in the field revealed that women's decision-making in Canggu Village was influenced by internal factors, such as education level and personality traits, and external factors, such as cultural customs and the influence of those closest to them. Despite the economic slowdown caused by the COVID-19 pandemic, women in Canggu Village are mainly confident that tourism will become the leading industry driving the Canggu Village economy. The findings of this study are likely to assist local governments, academics working on women's empowerment, gender equality, and sustainable tourist development, as well as other communities working to achieve sustainable development.
Impact Analysis of Marine Affairs Decentralization Policy on Fishermen's Socio-Economic Conditions in Alor Regency
Authors: ZAINUDIN Rahmad , PANDIE David B.W. , SAYRANI Laurensius P.
Published: February 2024

This study explains the impact of the demolition design on Alor fishermen's socio-economic conditions. This research was done in Alor, East Nusa Tenggara. This study focuses on the transition in managing government affairs in the budget sector from the District Government to the Provincial Government. The author uses Wolman's opinion in Faquet regarding repeal in the distribution of government affairs as an analytical tool. This theory classifies government affairs into two aspects: efficiency and governance management. This study is a qualitative study involving interviews, documentation, and observation. Miles and Huberman's data analysis approaches were employed to validate study outcomes. Based on economies of scale, the study reveals that the demolition design has no impact on the socio-economic conditions of Alor fishermen. Based on externalities (both positive and negative), the study shows that more negative impacts arise from the arrival of people outside the district (migrant fishermen) in terms of fishing because they dominate more in terms of supervision. In contrast, immigrant fishermen are less controlled and supervised strictly. Other dominance covers the market and areas in Alor Regency. The analysis shows that the provincial government has above-average economic (potential) and administrative capabilities for management quality. Human resources, infrastructure, and budget are still issues. The analysis shows that the provincial government has above-average economic (potential) and administrative capabilities for management quality. Human resources, infrastructure, and budget are still issues. Fortunately, the provincial government is still helped by the partnership system
How to Turn Jets into Cylinders near Supermassive Black Holes in 3D General Relativistic Magnetohydrodynamic Simulations
Authors: Rohoza Valeriia , Lalakos Aretaios , Paik Max , Chatterjee Koushik , Liska Matthew , Tchekhovskoy Alexander , Gottlieb Ore
Published: February 2024

Accreting supermassive black holes (SMBHs) produce highly magnetized relativistic jets that tend to collimate gradually as they propagate outward. However, recent radio interferometric observations of the 3C 84 galaxy reveal a stunning, cylindrical jet already at several hundred SMBH gravitational radii, r ≳ 350r
g. We explore how such extreme collimation emerges via a suite of 3D general relativistic magnetohydrodynamic simulations. We consider an SMBH surrounded by a magnetized torus immersed in a constant-density ambient medium that starts at the edge of the SMBH sphere of influence, chosen to be much larger than the SMBH gravitational radius, r
B = 103
r
g. We find that radiatively inefficient accretion flows (e.g., M87) produce winds that collimate the jets into parabolas near the black hole. After the disk winds stop collimating the jets at r ≲ r
B, they turn conical. Once outside r
B, the jets run into the ambient medium and form backflows that collimate the jets into cylinders some distance beyond r
B. Interestingly, for radiatively efficient accretion, as in 3C 84, the radiative cooling saps the energy out of the disk winds; at early times, they cannot efficiently collimate the jets, which skip the initial parabolic collimation stage, start out conical near the SMBH, and turn into cylinders already at r ≃ 300r
g, as observed in 3C 84. Over time, the jet power remains approximately constant, whereas the mass accretion rate increases; the winds grow in strength and start to collimate the jets, which become quasi-parabolic near the base, and the transition point to a nearly cylindrical jet profile moves outward while remaining inside r
B.
DNA barcoding aids in generating a preliminary checklist of the lichens and allied fungi of Calvert Island, British Columbia: Results from the 2018 Hakai Terrestrial BioBlitz
Authors: McMullin Richard , Simon Andrew , Brodo Irwin , Wickham Sara , Bell-Doyon Philip , Kuzmina Maria , Starzomski Brian
Published: February 2024

Bioblitzes are a tool for the rapid appraisal of biodiversity and are particularly useful in remote and understudied regions and for understudied taxa. Lichens are an example of an often overlooked group, despite being widespread in virtually all terrestrial ecosystems and having many important ecological functions.

We report the lichens and allied fungi collected during the 2018 terrestrial bioblitz conducted on Calvert Island on the Central Coast of British Columbia, Canada. We identified 449 specimens belonging to 189 species in 85 genera, increasing the total number of species known from Calvert Island to 194, and generated Internal Transcribed Spacer (ITS) sequences for 215 specimens from 121 species.Bryoria furcellata,Chaenothecopsis lecanactidisandC. nigripunctatawere collected for the first time in British Columbia. We also foundPseudocyphellaria rainierensis, which is listed as Special Concern on the federal Species at Risk Act, and other rarely reported species in British Columbia includingOpegrapha sphaerophoricola,Protomicarea limosa,Raesaenenia huuskoneniiandSarea difformis. We demonstrate that DNA barcoding improves the scope and accuracy of expert-led bioblitzes by facilitating the detection of cryptic species and allowing for consistent identification of chemically and morphologically overlapping taxa. Despite the spatial and temporal limitations of our study, the results highlight the value of intact forest ecosystems on the Central Coast of British Columbia for lichen biodiversity, education and conservation.
Pour une écologie sensible : renouer avec la terre sans se déconnecter du monde
Authors: Silva Castañeda Laura
Published: February 2024

En valorisant les sens, les affects et l’imagination, l’écologie sensible vise à déclencher, nourrir ou soutenir l’engagement écologiste. Au travers d’une enquête sociologique portant sur les ateliers de Travail qui relie, cet article explore sous quelles conditions la reconnexion à la terre peut contribuer à une dynamique plus large de changement social. Il révèle l’importance des modalités relationnelles qui y sont suscitées et valorisées, tout en pointant la nécessité d’articuler l’expérience intime à un positionnement politique allant dans le sens d’une écologie sensible radicale, émancipatrice et ouverte à l’altérité.
‪Young Sicilian People facing Covid-19: Experiences and Sensibilities in relation to their families in the context of isolation‪
Authors: Scribano Adrián , Polidori Alessandra , di Tomasso Lorenzo
Published: February 2024

Cet article fait référence à une recherche menée pendant le confinement italien de 2020 et la période suivante de mesures restrictives en 2021. L'objet de la recherche sont les jeunes siciliens qui vivaient chez eux avec leurs familles. La Sicile est représentative de la condition de la jeunesse italienne caractérisée par le chômage des jeunes et la difficulté de ceux-ci à rechercher un emploi stable pour accéder à l'indépendance économique mais aussi au logement. Il a été jugé intéressant d'analyser le vécu des jeunes à travers des entretiens qualitatifs via Skype pour comprendre leur vécu à la lumière de la sociologie du corps et des émotions. On s'est efforcé de comprendre et de caractériser les différentes manières de se rapporter aux familles d'origine et d'insérer son propre rythme personnel dans le rythme d'une famille. Les résultats mettent en évidence différents types de cohabitation qui restituent l'image d'une situation complexe de coexistence générationnelle caractérisée par la solidarité et l’individualisme.
Meditation, Compassionate Love, and Mental Health in Later Life
Authors: Lekhak Nirmala , Bhatta Tirth , Kahana Eva , Fernandes Cecilia , Snyder Joel S.
Published: February 2024

Purpose:

Understanding of the mechanisms by which meditation imparts beneficial effects on later-life mental health is limited. The current study assessed the role of compassionate love in mediating the relationship between meditation and mental health in later life.

Method:

Using data from a nationwide web-based survey (N= 1,861), we examined the indirect effects of meditation on depressive symptoms and anxiety via compassionate love.

Results:

Participants who practiced meditation (compared to those who did not) had significantly higher feelings of being loved (b= 0.11,p< 0.05); those who experienced more love had lower depressive symptoms (b= −2.10,p< 0.001) and anxiety (b= −0.99,p< 0.001). Meditation also had significant indirect effects (via compassionate love) on depressive symptoms (b= −0.23,p< 0.05) and anxiety (b= −0.11,p< 0.05).

Conclusion:

This study underscores the need for contemplative interventions that foster compassionate love to improve mental health in later life. [Journal of Gerontological Nursing, 50(3), 40–50.]
Innovative approaches to solar cell selection under complex intuitionistic fuzzy dynamic settings
Authors: Alghazzawi Dilshad , Liaqat Maryam , Alolaiyan Hanan , Khalifa Hamiden Abd El-Wahed , Alburaikan Alhanouf , Xin Qin , Shuaib Umer
Published: February 2024

The need to meet current energy demands while protecting the interests of future generations has driven people to adopt regulatory frameworks that promote the careful use of limited resources. Among these resources, the sun is an everlasting source of energy. Solar energy stands out as a prime example of a renewable and environmentally friendly energy source. An imperative requirement exists for precise and dependable decision-making methods for the selection of the most efficacious solar cell. We aimed to address this particular issue. The theory of complex intuitionistic fuzzy sets (CIFS) adeptly tackles ambiguity, encompassing complex problem formulations characterized by both intuitionistic uncertainty and periodicity. We introduced two aggregation operators: The complex intuitionistic fuzzy dynamic ordered weighted averaging (CIFDOWA) operator and the complex intuitionistic fuzzy dynamic ordered weighted geometric (CIFDOWG) operator. Noteworthy features of these operators were stated, and significant special cases were meticulously outlined. An updated score function was devised to address the deficiencies, identified in the current score function within the context of CIF knowledge. In addition, we devised a methodical strategy for managing multiple attribute decision-making (MADM) problems that involve CIF data by implementing the proposed operators. To demonstrate the efficacy of the formulated algorithm, we presented a numerical example involving the selection of solar cells together with a comparative analysis with several well-established methodologies.
Invisible Publications: A Study of Academic Productivity in the Web of Science Database
Authors: Schvirck Eliandro , Lievore Caroline , Rubbo Priscila , Herrera Cantorani José Roberto , Pilatti Luiz Alberto
Published: February 2024

The present study aims to outline the profile of uncited or rarely cited articles indexed in the Web of Science database between 2017 and 2021. We used stratified random sampling of 14,425 journals to extract our study sample of 373 journals. The dependent variable was defined as the number of citations, with independent variables being the JCR index, maturity, quartile, language of publication, and whether the research was funded. Descriptive statistics were used to characterize the sample according to field of research and variable. A negative binomial regression method was used to estimate which variables influence the number of citations received by articles in the sample. We found that of the 256,524 articles that make up the research corpus, 39,469 (15.39%) received no citations and 91,963 articles (35.85%) received up to four citations. The variables that positively influenced estimates of the number of citations were maturity (0.481), JCR index (0.159), and funding (0.020), while quartile (-0.170) and language (-1.032) had a negative influence on number of citations. We conclude that the pressures of academic productivism create a vicious cycle in which studies are referenced based on their ranking in the struggle for privileged editorial space, with articles in higher quartile journals being more prone to citation.
Comprehending farmers’ values in peri-urbanised Ağlasun, Burdur, Turkey: The case study of rose (Rosa x damascena) cultivation
Authors: Akgün Ebru
Published: February 2024

This paper illustrates the impact of peri-urbanisation on farmers’ values using the case study of rose cultivation in Ağlasun, Burdur, Turkey. Ağlasun is a village in south-western Turkey that has been undergoing social change with regards to peri-urbanisation. Within the scope of rose farming, the privatisation and globalisation of cultivation and the industry, alongside the rural gentrification of the village are assumed to have a significant impact on how farmers experience certain values: emotional connection to cultivation, family’s tradition of farming, and willingness to continue farming, as identified in the scope of this study. In order to investigate this connection between peri-urbanisation and farmers’ values that has not been well reported in the literature, this research adopts a qualitative methodology including interviews conducted with the rose farmers in Ağlasun in 2022. For this research, the following analyses are aimed; analysing the current status of farmers’ emotional connection to rose cultivation, family tradition of farming, and willingness to continue farming roses beyond 2022; and the relationship between such farmers’ values and the social change being brought about by peri-urbanisation in the village. The research findings suggest that emotional connection to cultivation and the farmers’ family tradition of farming are prevailing norms within the study group. A sizeable portion of the farmers are unwilling to continue farming due to the challenges linked to the peri-urbanisation of the village, whereas some are willing to continue, being motivated by emotional means. Ultimately, farmers’ emotional connection to cultivation, family tradition of farming, and willingness to continue farming roses are now being experienced differently due to the ongoing peri-urbanisation in the village.
The Subsidiarity Principle in the African Peace and Security Architecture (APSA): A case of diffusion by imitation of the European Union (EU)
Authors: Sousa Ricardo Real Pedrosa de
Published: February 2024

The Memorandum of Understanding between the African Union (AU) and the Regional Economic Communities (REC) and Regional Mechanisms (RM) signed in 2008 identifies subsidiarity as an ordering principle of the African Peace and Security Architecture (APSA). This was the first reference to the subsidiarity principle within the African context in a process of diffusion from the European context. Through process tracing and an analysis of hard and soft law documents of APSA this paper identifies that imitation was the mechanism of diffusion in 2008 in a process led by African agency and with Europe as a normative power. This result contributes to an investigation into the challenges that the APSA faces into becoming fully operational.
A Strategic Partnership EU-AU. A joint vision for a common security
Authors: Bernardino Luís Manuel Brás
Published: February 2024

In a global context of high complexity, the relationship between Europe and Africa has recently faced some security challenges. Although the EU-Africa or EU-AU summits seek to contribute to strengthening strategic cooperation between organisations, it has not been very successful. This article, based on a documentary analysis and the need to respond to the challenges of the future points to a need to have a joint vision of security problems and seek joint, integrated, and strategic solutions. The biggest challenge for the future of the EU-AU relationship will be to build a genuine strategic partnership and collaborate on a joint vision that contributes to improving the capacity for a joint response to emerging security problems affecting the Euro-African area.
Convex Relaxation for Solving Polynomial Programs through Quadratization Technique
Authors: Sinaga Lasker P. , Tulus Tulus , Herawati Elvina , Nasution Sawaluddin
Published: February 2024

In this paper, we study convex quadratic relaxation in polynomial programming. The goal is to solve polynomial programs through quadratic reformulation with the factorization method. The quadratization of monomials of degree more than two is carried out by replacing each pair of factors of the monomial with auxiliary variables. In this paper, each pair of factors of a monomial will be considered. The quadratic program obtained is convexified by using eigenvalues. As a result, the quadratic reformulation involving all factors of the monomial strengthens the information of the polynomial function but increases the dimensionality of the variables significantly. The next work is to develop a strategy to reduce the dimensions of the auxiliary variables.
The Effect of Earthquake Vibration on the Deformation of the Steel Structure of a Special Moment Frame System
Authors: Hadibroto Bambang , Barlian Edo , Jeumpa Kemala , Sarwa Sarwa , Irsya Muhammad Yafizham
Published: February 2024

Earthquakes cause deformations in structural elements which then lead to interstory drift and probability of collapse in building structures. Incremental Dynamic Analysis (IDA) will obtain a graph containing the Response Spectral Acceleration (RSA) value for the maximum interstory drift ratio, which will then be used to calculate the probability of collapse using the Fragility Curve. The structure is planned to be located in Biak city on hard soil conditions with a 16-story two-dimensional SRPMK building model. Various ground motions scaled to the design response spectrum of Biak city with 2 different methods were used. Based on the analysis conducted, the average interstory drift value for RSA scaling (T1) is 0.33 meters and RSA scaling (T1 = 0) is 0.2 meters, both of which occur on the first floor of the building structure. The largest RSA value obtained through IDA for the RSA scaling (T1) was 1.63 g and the RSA scaling (T1 = 0) was 1.89 g. Through the Fragility Curve, the probability of structural collapse at an RSA value of 1.63 g is 0.99 and at an RSA value of 1.89 g is 0.75.
Analysis DEM and Geological Observation Data for Study of the Potential Landslide National Street for Jantho - Lamno
Authors: Zainal Muzakir , Nabil Muhammad , Sugiyanto Didik , Muhni Akmal , Yanis Muhammad
Published: February 2024

Landslide is a natural disaster in Indonesia, especially in the Aceh province, with its geological complex, high rainfall, and topography. The high-intensity landslides have occurred in Jantho and Lamno, located in the Northern part of Aceh, with high development costs of road infrastructure. Therefore, it is necessary to map the potential of landslides along the Jantho – Lamno road as disaster mitigation in the future. The research uses a digital elevation model (DEM) that applies slope, aspect, hill shade, curvature, elevation and geological observation to study the landslide probability. The DEM analysis shows the distribution of terrain with varying elevations of 300 – 1,200 m.a.s.l and slope characteristics with 10 – 50 degrees variations. Apart from that, curvature and aspect analysis describe the direction of slope reduction, which is more dominant towards the side of public infrastructure. Analysis of the four data distributions shows that the south side area has a large landslide potential. On the other hand, slope data slices at four locations could interpret landslide potential well. Based on data processing, we conclude that comparing DEM and geological observations is considered effective as a fast and economical method of mapping landslide probability, especially in tropical areas and high topography that is difficult to access.
High-throughput Printing of Micro and Nanoscale Interconnects, and Passive and Active Electronics Elements for Heterogeneous Integration and Advanced Packaging Applications
Authors: Busnaina Ahmed
Published: February 2024

We introduce a new additive manufacturing technology for making electronics that is estimated to cost up to 100 times less than conventional semiconductor manufacturing. The technology significantly reduces the infrastructure and operating cost, power, water, chemical use, and reduces the materials used in fabrication by three orders of magnitude. This new technology enables allowing device designers the use of any organic or inorganic semiconducting, conductive, or insulating material on flexible or rigid substrates. The new technology is enabled by directed assembly-based nanoscale printing at room temperature and pressure and can print 1000 faster and 1000 smaller (down to 25 nm) structures than inkjet-based printing. The nanoscale printing platform enables the heterogeneous integration of interconnected circuit layers, printed electronics (passive and active electronics components), and sensors on flexible or rigid substrates. The directed assembly-based printing processes were specifically created to be scalable, environmentally sustainable, and enable precise and repeatable control of the assembly of various nanomaterials at very high rates. This allows the printing of passive and active components monolithically on an interposer platform along with interconnects for redistribution layers such that the total footprint can be within a few mm of the original IC footprint. The new technology has demonstrated the printing of several devices including transistors, inverters, diodes, displays, chemical, and biosensors, and interconnects using a variety of nanomaterials at the nano and microscale.
Solder Flux Evolution for Heterogeneous Integration
Authors: Griffith Evan
Published: February 2024

Advanced packaging techniques continue to evolve within the semiconductor industry. Within advanced packaging, heterogeneous integration has become a solution for those wishing to integrate distinct and complex dies into smaller packages. Many application trends are emerging to meet the challenges of heterogeneous integration which are causing the assembly process to become more intricate, with these trends requiring soldering material technology, especially that of solder flux, to be up to date and cutting-edge.

In this paper, three assembly processes that necessitate advanced solder flux will be discussed: flip-chip assembly, BGA ball-attach assembly, and assemblies which have advanced to necessitate fluxless component attach. First, flip-chip assembly methods will be discussed and how different assembly technologies, such as standard mass reflow, thermocompression bonding (TCB), and laser assisted bonding (LAB), require differently formulated fluxes. This paper will then discuss the ball grid array assembly process, first outlining common process steps which negatively affect the solderability of ball-grid array pads, such as flip-chip reflow and molding compound applications, then discuss advancements in ball-attach fluxes which help eliminate these extra process steps, or ‘prefluxing’ steps. Finally, this paper will then discuss assembly trends which have led to fluxless component attach, and will discuss materials designed for fluxless processes, such as formic acid reflow, and how these fluxless processes tie into flip-chip assembly.
Back End Commonality for Advanced Packaging: Large Form Factor Project
Authors: Wheeler Kirk , Anderson Steve , Harsha Chetan , Pharamond Antoine , Ross Neil , Ray Urmi
Published: February 2024

Address key gaps for advanced packages through complex assembly processes and provides flexibility for handling different body size package

• Enable new products and product segments not limited by current JEDEC body

sized

•Demonstrates the cost effectiveness of leveraging tool commonality

• Increase Backend operational efficiency

• Define large form factor product handling media that allows for flexibility and

higher density

• Ability to maximize footprint: # of packages in held in the “handling media”

• Minimize tooling changeover times

• Provide the same “outer design” for many different

package sizes/types, thereby minimizing NRE and Increased Tool Flexibility
Scaling Interconnect Densities Meeting the Growing Demand for Chiplet Integration
Authors: Davis Robin , Olson Tim
Published: February 2024

With the increasing demand for heterogenous chiplet integration, the demand for high density chip to chip interconnects grows equivalently. In 2022 there were two significant announcements on breakthroughs in chip integration. At the highest end is AMD’s v-cache, which utilizes hybrid bonding to make connections between cache and processor. Also introduced to industry, was Apple’s M1-Ultra processor which achieves advanced flip-chip pitch at 25µm x 35µm. Through teardowns it is apparent that the M1-Ultra is made up of two chips first embedded processors, a flip-chip bridge, and molded fanout technology. These silicon-based solutions are complex and costly, but they demonstrate the industry’s strong demand for high density interconnects.

This paper outlines an alternate approach to achieving high density die-to-die interconnects through purely organic wafer or panel level packaging (PLP) that can meet or exceed the density provided by a silicon bridge. Deca Technologies’ Gen 2 M-Series™ fan-out with Adaptive Pattering® provides 20µm pitch capability with 2µm line and space widths. This interconnect density can match or exceed that offered by a silicon bridge, while significantly reducing the cost and yield risk. A specific 10 die test vehicle build will be presented that demonstrates this capability.

This 20µm pitch is only the starting point as the technology will continue to scale. Through the new, MDX™ technology, capture pads are eliminated from all metal layers allowing unprecedented routing density increases on organic fan-out structures in combination with finer device interface pitch. While the details of this technology are still proprietary, a high-level overview will be provided.
Chiplets Integration: Simplifying the Landscape
Authors: Kelly Mike , Hiner Dave , Scott Geroge
Published: February 2024

Heterogenous integration and the use of chiplets are the logical outcome of several factors effecting the IC industry’s drive towards higher and higher performance, and to accomplish this at minimum total product cost. This drive to heterogenous solutions has created a new development cycle in the IC Packaging industry to get ready for these product needs.

The choice of which package to use for chiplet-based designs is driven by several important factors, most importantly, the type of die-to-die interface that is being used. This bus largely defines the physical structure such as line and space requirements, and the electrical performance which influences the type of materials used as dielectrics and design practices which must be enabled to permit a successfully product design.

There are a growing number of package configurations to accommodate these chiplet integrations, but in vast majority of real-world applications, there are only a handful of package types, with clear rationale guiding package selection.

This paper will examine the different approaches for heterogeneous packaging and try to simplify the IC packaging selection process, and provide guidance for real-world implimenations. Although there are many different trade names in the industry there are only a few basic categories, and once this is understood the package selection should seem much less daunting.
Assembly Solutions for Cost-Effective Heterogeneous Integration with Disparate Die Types
Authors: Farris Glenn
Published: February 2024

The semiconductor industry is driving to enable high volume integration of disparate die types via Heterogeneous Integration. These die can come from a range of wafer sizes fabricated in different technology nodes. This emerging package type creates new challenges regarding assembly efficiency and yield. Traditionally, flip-chip assembly process flows have utilized a single placement tool for the placement of the single die type onto the target substrate. For applications with multiple die types, a series of placement tools have been configured in a production line, with each tool dedicated to the placement of a specific die type. This paper and presentation explore the implications of this type of solution in the era of Heterogeneous Integration. Impacts on product yield, throughput, manufacturing efficiency, and overall cost of assembly will be explored for a broad range of Heterogeneous Integration die configurations. Based on a sensitivity analysis for the range of die types expected in these applications, a novel approach to optimization of overall assembly economics will be proposed. Appropriateness of this novel approach will be explored for a range of packaging solutions, including Flip Chip, 2.5D, 3D, and Fan-Out.
Micr -Transfer Printing for Efficient 3DHI of 100-300mm Wafers and Glass Panels
Authors: Conner Bob , Batchelor Bill , Gomez David
Published: February 2024

This paper presents an analysis of using micro-transfer printing (MTP) for three-dimensional heterogeneous integration (3DHI) of diverse components made using 100mm, 200mm and 300mm wafers with large area glass substrates. Techniques for achieving high throughput and high wafer and substrate utilization, despite their size mis-matches, are described in detail along with MTP’s pros and cons versus alternative wafer-to-wafer and die-to-wafer 3DHI technologies.

MTP, a massively parallel pick-and-place process, efficiently transfers large arrays of ultra-thin (<10 micron), small, diverse components (“x-chips”) from one or more source wafers to destination substrates. MTP enables disruptive 3DHI of compound semiconductors, including GaN, GaAs, InP, SiGe and emerging materials, silicon and passive components for wireless and optical communications, power management, sensor, photonics and other analog / mixed signal applications. Since the x-chips are ultra-thin and active side up, standard copper redistribution layer (RDL) technology may be readily used to interconnect the x-chips and destination die, resulting in very short path lengths and, hence, minimum parasitics.

ASM AMICRA and X Display Company supply R&D and production MTP manufacturing systems. More than twenty MTP systems are installed worldwide at X-FAB, Micross Components, Tyndall National Institute, Teledyne, the Naval Research Laboratory, the University of Illinois Urbana Champaign, the University of Ghent / imec, UPVfab and undisclosed leading manufacturers.
Novel IR Laser Debonding for Heterogeneous and 3D Integration
Authors: Uhrmann Thomas , Urban Peter , Wimplinger Markus , Povazay Boris , Bravin Julian , Thallner Bernd
Published: February 2024

Wafer carrier and thin wafer support during processing is key in 3D integration and advanced packaging processes. Today carrier technology can be divided based on the application and carrier wafer material. While for DRAM and other stacked memory applications silicon carriers are preferred, demanding special adhesive systems for mechanical debond, the adhesion is tuned to be high enough for processing but low enough for post process thin layer debonding. Which means the thin wafer thickness needs to be maintained typically thicker than 40µm in order to have a sufficient mechanical rigidity and support during debonding. On the other hand, UV based laser debonding decouples the adhesion during processing while the debonding is digitally triggered by UV laser irradiation and controlled destruction of engineered polymeric layer at the glass carrier surface. Despite this is the more universal debonding process, glass wafers are generally not suited for all process lines. To solve the above described difficulties, IR laser debonding has been developed enabling the combination of silicon as a carrier substrate as well as laser debonding through silicon. One solutions is in advanced packaging, where silicon can be seen as a replacement for glass wafers but still in combination with developed adhesive systems. The more impacting application, however, is the combination of IR laser release with fusion and hybrid bonding.
Advanced IC Substrates for Heterogeneous Integration
Authors: Leitgeb Markus , Mokkapati Venkata , Beica Rozalia
Published: February 2024

“The need for high performance and smarter devices with increased functionalities is driving the industry to develop new, innovative and advanced solutions. While scaling continues, the need for bringing in more functionalities into the package is driving the increased adoption of chiplets and heterogeneous integration. While various packaging platforms are being adopted, the requirements of the application will drive the adoption of the suitable platform. With the increase in high performance computing, the need for more advanced substrates has become more critical, from technology as well as supply chain availability. The current presentation will focus on market drivers, industry challenges and solutions that AT&S is bringing to the market to address next generation industry needs.”
RF Packaging and Design for Development of High Performance 5G mmWave Modules
Authors: Ndip Ivan , Le Thi Huyen , Murugesan Kavin , Maaß Uwe , Kaiser Michael , Schneider-Ramelow Martin
Published: February 2024

5G sub-6GHz networks have already been deployed in many regions around the world. However, the deployment of 5G mmWave networks is yet to meet expectations. This is partly because of the challenges associated with hardware development of 5G mmWave systems. One example of such a challenge is to overcome the severe degradation of signal-to-noise (SNR) ratio due to intra- and inter-system signal losses at mmWave frequencies. This deteriorates the signal quality, limits transmission distances and may lead to unreliable mobile communication.

In this work, we present RF packaging platforms and technologies as well as an approach for scalability of 5G RF frontend integrated circuits (ICs) and antennas which overcome intra- and inter-system losses. This leads to the development of high-performance and scalable 5G MIMO (multiple input multiple output) modules for reliable mobile communication at mmWave frequencies.

The platforms provide very short and low-loss signal paths with few geometrical discontinuities between the frontend ICs and antennas. This leads to significant reduction in signal reflections and attenuation, thus improving the matching efficiency of the antennas and the equivalent isotropic radiated power (EIRP) of the entire system. The platforms also enable antennas to be integrated on layers directly above the ICs, and thereby ensures scalability of the ICs and antennas in both lateral dimensions for 5G mmWave massive MIMO.

To demonstrate the functionality of our proposed packaging platforms, technologies and antennas, we performed in-depth RF designs, measurements and characterization of packaging materials, technologies and platforms as well as antennas for 5G mmWave applications.
Glass Package and Through Glass Via (TGV) for MEMS
Authors: Shorey Aric
Published: February 2024

Menlo Microsystems has introduced a glass-based MEMS switch that utilizes through glass via (TGV) technology. Created in the R&D labs at GE, these MEMS solutions combined with utilization of glass packaging, has enabled the creation of the highly reliable Ideal Switch™. It is the world’s smallest, most reliable, and efficient micro-mechanical switch that can be used for numerous applications, including power. Several advantages are gained by taking advantage of the low electrical loss of glass and hermetic TGV. The TGV technology enables >60% smaller package size relative to wirebond. Parasitics are reduced by >75% and devices have a wide operational bandwidth from DC to > 50 GHz. Devices can have dozens of switches in a small form factor that give reliable performance over billions of cycles. Leading up to the volume production of these devices, Menlo has helped drive the glass supply chain to an increased level of maturity. In this talk we will provide an overview of Menlo’s glass package for the Ideal Switch™ technology as well as discuss the growing maturity and emerging capabilities in the glass/TGV supply chain.
Hermetic Package for MEMS Mirror
Authors: Rotta Davide , Chiesa Marco , Serrano Aina , Del Sarto Marco , Maggi Luca , Maierna Amedeo , Bogoni Antonella
Published: February 2024

Applications for optical scanning and 3D sensing, mostly related to the consumer electronics and automotive markets, are becoming more and more demanding in terms of performance and power consumption. When using a MEMS based Laser Beam Scanning, enclosing the mirrors into a hermetic package helps to address these requirements.

Two MEMS mirrors with different sizes and performance have been selected for this study. A unique package, suitable for both mirrors, has been properly designed. The package is based on a ceramic chip carrier with a soldering ring on the top surface. A metal cap with a sintered optical window is attached to the ceramic substrate. The optical window is tilted with respect to the mirror to avoid spurious reflections. The MEMS mirrors have been integrated onto the ceramic substrate by standard die attach and wirebonding technologies. Hermetic sealing has been developed under nitrogen atmosphere to guarantee the MEMS stable operation against humidity and contaminants. Flux-less SnAgCu solder preforms have been selected as sealing material. The solder reflow profile has been optimized in order to obtain a uniform solder fillet at the sealing region while minimizing the thermal stress to the mirrors.

The hermeticity of the assemblies has been proved by fine and gross leak testing. The packages show a leak rate < 1.5 E-8 atm cc/s and pass the fine and gross leak test, defined accordingly to MIL-STD-883 TM 1014.18.
Novel Low Df Thermosetting Film and Photo Imageable Film
Authors: Koh Meiten
Published: February 2024

There are various demands for interlayer insulation film. One typical demand is to interlayer insulation film with low Df for substrate to decrease transmission loss, and another typical demand is to low warpage, fine via type photo imageable interlayer insulation film for RDL. We have developed two types of the novel interlayer insulation films, one was low Dk/Df thermosetting film and another was fine via type photo imageable film.

Epoxy based interlayer insulation film, which was mainly used for substrate, showed high transmission loss at mm wavelength due to its high Df, especially at high temperature. But it showed good processability and reliability due to its thermosetting property. PPE was known as low Df resin, but it had poor processability and reliability due to its thermoplastic property. Thus we have synthesized the novel curable PPE resin, and by using the resin, we have developed the novel thermosetting PPE based interlayer insulation film for substrate. It showed far lower Df and far lower transmission loss compared to the low Df type epoxy based interlayer insulation film.

We have developed the novel photo imageable interlayer insulation film for RDL. Ordinally photo imageable PI solution was used for RDL, but it showed high CTE, which caused warpage and reliability issue, high surface roughness, which required post processing process, and high curing temperature. We have used the novel epoxy acrylate and developed the novel photo imageable film, which showed low CTE, low surface roughness and low curing temperature.
Fine-Feature Additively Dry Printed Passive Wireless Sensor Tag
Authors: Ahmadi Zabihollah , Mahjouri-Samani Masoud , Dean Robert N.
Published: February 2024

Wireless passive sensors have many applications, from precision agriculture to structural health monitoring. A simple but useful wireless passive sensor tag consists of a planar inductor coupled with a planar interdigitated electrode capacitor, forming an inductor-capacitor (LC) loop. Either the planar inductor or the planar interdigitated electrode capacitor can be used as the sensor. For example, the inductor could be used for proximity detection with an external ferrous object, or the capacitor could be used to measure the relative humidity of the surrounding air. The planar inductor, however, is also used to inductively couple the sensor tag to a base station feedback oscillator. As a result, the LC loop on the sensor tag tunes the base station oscillator’s output frequency accordingly. In this work, the planar inductor and the planar interdigitated electrode capacitor were printed on a polyimide substrate using a novel laser-based additive nanomanufacturing (ANM) and dry printing technology. With this fabrication process, approximately 2 micron thick silver traces were printed to realize a 34 loop planar inductor and a 69 tooth interdigitated electrode capacitor, with a nominal trace and space width of 6 mils (152.4 microns). This recently developed laser-based ANM technique allows for much finer trace and space widths, as well as a much larger variety of electronic materials, to be printed, compared to more traditional ink-based printed electronics manufacturing techniques.
4D mmW/5G Metasurfaces and Wireless Sensors Combining Additive Manufacturing, Morphing and ML Technologies
Authors: Tentzeris M. M. , Hu K.
Published: February 2024

The paper will introduce fully printed 4D metasurfaces and wireless sensors operating up to 5G/mmW frequency range. Multiple morphing (shape-changing) approaches will be presented for massively scalable additively manufactured implementations , while modulation, signal redirection and energy harvesting features will be thoroughly covered in terms of integrability, flexibility and power consumption requirements. The talk will also refer to multiple reconfigurable intelligent surfaces (RIS) being enabled by newly reported fully printed planar lenses (Rotman, Van Atta, …) and dielectric reflectarrays enabling ultra long interrogation ranges when combined with “zero-power” backscattering interrogation techniques. Major challenges of flexible hybrid electronic implementations as well as ultra-low-power printable structures for self-diagnostic and anti-counterfeiting packages will be discussed in depth and numerous ML techniques will be comparatively evaluated for their optimization, calibration and on-demand reconfigurability. The paper will conclude with fully printable mmW/5G RF modules for wireless sensing applications spanning a wide range of fully passive tags to energy autonomous long-range RFID systems and low-cost miniaturized tags for orientation and rotational sensing for VR applications as well as environmental sensing and structural health monitoring.
SMART 3D Manufacturing of Printed Electronics
Authors: Newton C. Mike , Kulkarni Anand , Benoit Jason , Sassano Emily , Stoodt Kyle
Published: February 2024

Printed electronics has been around for many years, reaching back to screen printing of thick film hybrid microelectronics. As time went on new material technologies emerged and integrated with graphically based printing processes like gravure, ink jet and others. Additionally, 3d printing matured over time, again with new material technologies and printing processes to include fused deposition modeling (FDM). Born out of the desire to print engineering models the technology has evolved into the ability to print higher performance structures as the final product. The idea in creating a factory in a box for 3D printed electronics was enabled in creating the ability to print multimaterial with multiple printed processes that included additive and subtractive methods. This integration allowed for the ability to print electronics and the electronic packaging in the same system. The goal was the ability to achieve the green -button, meaning load a digital file, press the green button and the electronic device, module or product emerged. True digital to physical manufacturing. Missing in this process is the integration of machine learning, artificial intelligence and in situ monitoring of processes and materials and digital twin. This presentation will cover the industry evolution of SMART 3D Manufacturing of electronic products the enable distributed manufacturing at the point of use/need.