bluuebunny/crossref_metadata_2025 huggingface dataset:
Ultra-low Loss Build-up Film Dielectric for Advanced Packaging
Authors: Suzuki Yuya , Nosaka Mami , Nakada Kazutaka , Yoneda Kazuyoshi
Published: February 2025

This paper introduces a novel low-loss film dielectric material and describes the performance of the material. As the demand for faster, smaller, and more energy-efficient electronic devices continues to surge, the IC substrates must have the capability of meeting the stringent requirements, especially to support high speed signal transmissions. As the signal frequencies increase, the importance of reducing dielectric loss is getting more critical in enhancing the performance of IC substrates. However, achieving ultra-low loss characteristics in build-up dielectric materials remains a formidable technical challenge, hindered by the inherent limitations of traditional epoxy-based materials. This paper introduces a novel build-up dielectric material that addresses the technical limitation of the conventional materials. Leveraging advanced material design and process technology, the new dielectric film material offers ultra-low electrical loss characteristics with robust reliability performance and standard manufacturing processes compatibility. The unique material design bestows extremely stable electrical performance at higher temperatures. Signal transmission measurement demonstrated that the new material exhibited approximately 40% lower transmission loss compared to the conventional material. The superior characteristics make the dielectric material ideal for advanced packaging in high performance computing, telecommunications, and evolving automotive applications.
Using a Novel Co-Design Prototyping Approach for System-in-Package Devices
Authors: Monroe Matthew , Kumar Gokul , Locke Justin , Felton Keith
Published: February 2025

System technology co-design (STCO) is the critical process of optimizing the interface between integrated IC device(s), package, and printed circuit board (PCB) at the early stages of product design and development. STCO can avoid poor system planning which could otherwise impact cost, yield, and performance. This paper focuses on the challenges and opportunities of STCO for system-in-package (SiP) and multi-chip package (MCP) solutions, which use a combination of wire bond and flip-chip die as well as SMT (surface mount technology) passive components. A scalable methodology is presented that uses Xpedition Substrate Integrator, a software tool for single-die ASIC and 2.5/3D packaging that automates the optimization of the system-level netlist, to achieve robust floorplanning and connectivity efficiency for SiP co-design. Compared to manual methods, this specialized workflow on typical SiP designs reduced up to 10-14% decrease in net congestions, leading to improvements in form factor, cycle time, and performance.
Molded SiP Manufacturing with Integrated Shielding Layer for Optimized EMI Robustness
Authors: Becker Karl-Friedrich , Voges S. , Becker L. , Safak G. , Nallaweg O. , Müller F. , Tschoban Christian , Dreissigacker Marc , Younis M. A. , Maretzki R. , Wallrodt M. , Braun Tanja , Schneider-Ramelow Martin
Published: February 2025

The functional reliability of microelectronics packages in harsh environment use not only depends on interconnect integrity and thermomechanical robustness, also signal integrity can play an important role for package performance. For industrial/automotive use, the shielding of packages against electromagnetic interference is a key process tep that defines package performance in challenging environments. Within the project AdaPEdge, Fraunhofer IZM, TUB and MST are cooperating to manufacture highly integrated packages using Flip Chip technology and MAP molding technologies for package realization. To ensure optimized shielding of the packages, a test vehicle has been designed that allows the determination of shielding efficiency of molded packages without and with shielding layers created in different technological approaches. These technologies can be applied to single packages and to full MAP areas and include direct metallization on molding compounds, contactless dosing of a conductive layer and laser direct structuring.

As a result, the paper presents the manufacturing of Shielding Efficiency test samples in various technologies, the SE measurements over a wide frequency range for samples with varied shielding layer thickness. The measurements are validated using an analytical model developed in-house and there is good agreement between the measurement and the analytical model. Based on the analytical model, physical effects at the interface of material and in the material are separated and analyzed.

Comprised, packaging boundary conditions and design rules for define EMC-robust packages will be provided that allow an efficient manufacturing of functional SiP packages.
HPC Packaging Platform Including Compression Molding
Authors: Adler Marius , Becker Karl-Friedrich , Braun Tanja , Dreissigacker Marc , Hoelck Ole , Gaebler A. , Maass Uwe , Ndip Ivan , Zoschke K. , Schiffer Michael , Schneider-Ramelow Martin
Published: February 2025

Efficient high-performance computing (HPC), especially for applications in the field of artificial intelligence, requires the use of specialized computing and memory chips, short transmission paths and high packing densities. A key technology for HPC is therefore the integration of processors and memory stacks in a single System-in-Package (SiP) using silicon-based interposers.

Manufacturing concepts have been developed for such a package, each of which utilizes different process flows to build an HPC module. Following a holistic approach, the process flow is evaluated from the processing of the interposer with high density organic redistribution layers, compression molding and balling. Evaluation methods were defined for the individual process steps and criteria established to enable the selection of suitable process steps and combinations for an optimized package. The process flow options were realized and analyzed for a reference HPC module. An important parameter for all these process steps is warpage, since an exceeding warpage can make processing impossible. For compression molding, a key process step, the influence of different materials and process parameters on the warpage was therefore investigated.

The results of the process development are presented for the backend process flow with an emphasis on compression molding process step, an evaluation of the process variants is carried out according to the previously developed criteria and the most suitable variant of the process step for later production is selected on this basis.
Study of the Effect of Gravity Weight on Strip Warpage
Authors: Fortin Elizabeth , Whitchurch Nathan , Lin Wei , Sohn EunSook
Published: February 2025

Strip level warpage control is critical for the manufacturing and assembly of advanced packages. Unfortunately, it is very challenging to simulate strip level warpage accurately. One of the challenges is the strip gravity weight effect. In this paper, nonlinear simulations were performed using Ansys Workbench to observe the effect of gravity on strip warpage. The model consisted of the strip on top of a supporting surface, or table, to more closely resemble how the warpage was actually measured. To account for the gravity effect in simulations with various warpage shapes, contact conditions were included to capture the interactions between the strip and the supporting surface. Simulation results show the weight effect greatly reduced warpage on pre-mold strips, resulting in more accurate warpage simulation results when correlating to actual strip warpage measurement data. There was a significant difference in the weight effect at the chip-attach stage compared to the post-mold stage, with the post-mold stage showing less of a reduction in warpage. Other strip configurations and geometry effects were also studied in this paper, such as: strip size, number of blocks, a slot placed between blocks, and a cored vs. coreless substrate.
Prediction of an Industrial Framework for Semiconductor Fabrication and Experimental Validation OF 300 mm Wafer
Authors: Jeong Da-Woon , Cha Se-hyun , Kim Tae-Hyun , Gwak Wangyu , Choi Yangwook , An HyeongGeun , Lee Eun-Ho
Published: February 2025

In contemporary memory semiconductor manufacturing, optimizing recipes has emerged as a crucial strategy to align with RE100 commitments, bolster ESG ratings, and substantially reduce operational costs. The current landscape demands the development of low-power manufacturing recipes that not only curtail energy consumption but also trim operational expenses, thereby augmenting overall profitability. This underscores the critical necessity for meticulous recipe optimization to ensure both sustainability and economic viability in the industry.

In response to these challenges, there is an urgent need for a predictive framework capable of accurately forecasting optimal recipes. Such a framework is essential for facilitating the industry’s adaptation to dynamic technological environments and stringent environmental standards. By enabling proactive adjustments to manufacturing processes, this predictive approach ensures companies remain competitive while advancing comprehensive sustainability objectives.

To address these needs, this work introduces a predictive framework specifically tailored to forecast recipe steps for plasma processes in semiconductor manufacturing. The framework’s efficacy was empirically validated using measurements from 300mm wafers in semiconductor mass production equipment. Plasma behavior was meticulously modeled, with simulations meticulously aligning with particle-in-cell models and Electron Monte Carlo collision simulations. These validations, conducted across both bulk plasma and sheath regions, confirmed the framework’s reliability and accuracy.

Furthermore, the framework integrates a machine learning model to evaluate results under various recipe input conditions. This comprehensive approach not only enhances the understanding of plasma behavior but also facilitates the identification of optimal manufacturing conditions. Through meticulous recipe optimization, the framework minimizes undesirable effects such as backside chucking force and variations in thin film thickness, thereby improving overall manufacturing competitiveness and sustainability.

Despite the inherent challenges and limitations, the predictive framework showcased significant potential to revolutionize manufacturing processes in the semiconductor industry. Its high predictive power positions it as a valuable tool for enhancing operational efficiency, driving informed decision-making, and ultimately advancing sustainability goals within the semiconductor manufacturing sector.
High Performance and Cost-Effective Wafer Bumping Approach with Solder Paste Printing for Small LED Die
Authors: Zhang HanWen , Li Guo An "Andy" , Chiong Kung Chuan "Kenny" , Hsu Hui Kai "Vito" , Kumar B. Senthil , Lim Chze Min "Jason" , Lim Thiam Chye
Published: February 2025

The increasing trend of LEDs die size reduction driven by the demand for high-resolution displays and compact wearable devices, presents significant challenges for assembly packaging. Achieving sufficient paste volume and maintaining low void rate in the solder paste during the die mounting on the substrate process is crucial for high performance LED applications. This paper presents a novel approach to wafer bumping using solder paste printing process. It demonstrates the methods used to achieve good solder paste printing volume with low void rate via three reflow steps using different stencil designs. Sn/Cu alloy solder paste with T7 powder (2~11um) is used for the study. Solder paste bump height post-reflow process and the void rate in the solder paste were measured and analyzed with 3D AOI and X-ray, respectively. The study and methods used with Heraeus solder paste achieved good package reliability, function test passing 85°C/85% & 60°C/90% Wet High Temperature Operating Life (WHTOL) 1000 hours, and Powered Temperature Cycling (PTC) ON/OFF 1000 cycles, -40°C ~ 85°C Temperature Cycle Testing (TCT) 1000 cycles. The result from this study offers valuable insights and solutions for addressing the assembly challenges associated with small LED die sizes. It offers a good solution for achieving high-performance and cost-effective wafer bumping process for miniLED applications.
Development of High Density, Enhanced Reliability Wafer Level Packages
Authors: Sharma Gaurav , Su MengYao , Thukral Varun , Beddingfield Craig , Lakhera Nishant
Published: February 2025

Fan in and fan out wafer level packages are primarily used in the industry for applications in handheld consumer electronic products. The key benefits of wafer level package (WLP) are small form factor, reduced cost, improved electrical and thermal performance. WLP investigated in this study are directly surface mounted on PCB and have no intermediate substrate. Direct mount of package on PCB, leads to significant CTE mismatch between the package and board which stresses the package solder joint, leading to different failure modes like; cyclic fatigue induced solder joint cracking, package interconnect failure, silicon BEOL failure. Due to these reliability constraints WLP, are limited to relatively smaller sizes and less pin counts. This study investigates development of high pin count, high reliability WLP by ensuring chip package integration at all levels of interconnect; board to package, package to die and die BEOL.

Package development was done with DOE variables like, multi-layer package routing, dielectric materials, solder alloys. Tradeoffs between different DOE variables must be achieved for overall package reliability improvement. Excellent reliability, functional performance, and chip package integration was achieved for highly integrated fan in and fan out wafer level packages.
Enabling High-density Heterogeneous Integration using Wafer-scale Chiplet Reconstitution Technology
Authors: Victor Ashita , Bakir Muhannad S.
Published: February 2025

As the demand for high-performance computing continues to grow, the integration of more and more chiplets into a package has become increasingly necessary. In this paper, we present a wafer-scale chiplet reconstitution technology that leverages low-temperature silicon dioxide to encapsulate a dense array of chiplets. To achieve high-density integration and ensure complete oxide encapsulation, a study is carried out to determine the minimum chiplet-to-chiplet gap that is required for a specified thickness of the chiplet. The study shows that a minimum ratio of ~ 1:2 (chiplet height: chiplet gap) is required to fill the gaps between the adjacent chiplets. Based on this observation, a test structure is designed consisting of a dense array of 150 μm x 150 μm passive chiplets that are 12 μm-thick with a chiplet-to-chiplet gap of 40 μm. The designed chiplet tier is fully encapsulated with 18 μm-thick low-temperature silicon dioxide. In addition, a compact circuit model for preliminary analysis of digital die-to-die signaling of the chiplet reconstitution technology is presented. The latency and energy dissipation of this model are evaluated using SPICE simulations.
Panel-level Fan-out: Relationship Between Panel Size and Cost Reduction
Authors: Lujan Amy
Published: February 2025

Panel-level fan-out packaging is a growing segment of the packaging industry. Some analysts expect that 7% of fan-out packages will be built with panel-level fan-out technology by 2025. The key reason for designers to consider a change from wafer-level to panel-level fan-out is cost reduction. Most activities for fan-out packaging are batch activities performed on the entire wafer or panel at one time. The more die processed during batch activities, the greater opportunity for cost reduction.

Although this economic concept is simple, the reality of implementation is complicated. Handling wafer warpage and die shift can be a challenge even at the wafer level; these must be considered at the panel level as well. There are a few panel sizes available, and using the largest panel size for economic advantage may involve a trade-off with yield. New equipment or materials may be required, so capital expenditure should be considered as well.

It is one thing to recognize the potential cost advantage of producing more chips at once, but designers and fabricators must understand whether to expect a 5% or 50% cost reduction. This paper will analyze the cost of multiple designs built using wafer-level fan-out with a 300mm wafer, and panel-level fan-out using a 515x510mm panel and a 600x600mm panel. Key assumptions, such as package size and yield, will be tested to evaluate their impact on cost reduction. The goal of this paper is to analyze the cost reduction that can be reasonably expected when moving from wafer-level to panel-level fan-out.
Novel Approach Solder Paste Printing on 90μm Pitch Application
Authors: Kumar B. Senthil , Min Lim Chze (Jason) , Huei Yam Lip , Fen Zhang Rui , Olakkankal Edrina Risson , HanWen Zhang Rui , Sungsig SS Kang
Published: February 2025

Smaller components in system in a package (SiP) addresses the needs of miniaturization by using cutting edge technology in advanced packaging applications, which involves integration of passive components, flip-chips, integrated devices, etc. Increasing demands for a reduced footprint requires solder paste technology to constantly reinvent SAC305 solder paste. The Type-7 (<11μm) powders were processed by Welco™ technology and formulated into water soluble (WS) solder paste that provided consistent print volume and prints for stencil opening (≥55μm) and pitch (≥90μm).

Even though solder pastes can achieve the 90um pitch capability, other factors significantly contribute to printing defects such as substrate quality, printing parameter, printing accessory and equipment process capability limitation. The present paper discusses critical challenges contributing to printing defects in the 90μm pitch stencil printing application and provides a detailed explanation and control guidelines.
Thermal Optimization and Experimental Demonstration of a Silicon Carbide, Half-Bridge PowerModule
Authors: Moreno Gilberto , Major Joshua , Khan Faisal , Narumanchi Sreekant
Published: February 2025

This paper describes modeling and experimental work to design and demonstrate a silicon carbide (SiC), single-side-cooled power module. Two SiC metal-oxide-semiconductor field-effect transistors (MOSFET) were used for each switch position and packaged on a metalized ceramic substrate. Thermal modeling was first conducted to optimize the module packaging to minimize junction-to-fluid thermal resistance and device temperature variations. This procedure identified the optimal device placement and baseplate thickness to maximize thermal performance. A heat exchanger – incorporating impinging jets of water-ethylene glycol - was designed to cool the module’s baseplate to minimize thermal resistance and pumping power. The heat exchanger used relatively low fluid velocities (<1.5 m/s) to minimize erosion-corrosion effects and relatively large fluid channel sizes (≥1 mm) to prevent clogging. The power module concept was fabricated, and experiments were conducted to measure its thermal performance. Direct current was used to power the module devices, and junction temperatures were measured via device temperature-sensitive parameters. The experimental results were found to be in good agreement with model predictions (within 2%) and yielded junction-to-fluid thermal resistance values as low as about 15 mm2∙K/W at relatively low pumping power values. The results demonstrate the improved performance associated with jet impingement cooling and represent an improvement over existing channel-flow-type cold plates, which can enable improvements to power density and reliability.
An Open Chiplet Ecosystem for Constructing System-in-Package with Universal Chiplet Interconnect ExpressTM (UCIeTM)
Authors: Sharma Debendra Das , Liu Michael Mingliang
Published: February 2025

Chiplets connected on package, referred to as system-in-package (SiP), has become mainstream across the compute continuum. Universal Chiplet Interconnect expressTM (UCIeTM) is an open industry standard offering significant bandwidth, power-efficiency, and latency improvements over other interconnects. The entire industry has rallied behind UCIe and driving it forward to solve the challenges in computing while deploying UCIe for a wide range of usage models. UCIe is poised to enable innovations at the package level the way PCIe and CXL has driven innovation at the platform level.
Using FEM Simulation to Predict the Mechanical and Thermal Performance of FO-EB-T Package
Authors: Lin Shane Lin , Lin Vito , Shih Teny , Kang Andrew , Wang Y.P.
Published: February 2025

In order to solve the problems that high price and low process yield of single multi-functional large-size chip, homogeneous and heterogeneous integration has become the trend of modern high-end packaging technology due to faster signal transmission speed and also a benefit for space management. According to that, the development of chiplet advanced packaging technology is particularly important. During the chiplet packaging process, many structural mechanical warping problems may be encountered. In addition to the difficulty of the process, the accompanying challenges also have more severe thermal problems. Take server for example, The Thermal Design Power (TDP) of the server is increasing year by year. It can basically reach more than 500W per package. Above that, before the overall packaging is completed, the reliability issue and thermal problem must also be taken into consideration. So the selection and matching of packaging materials need to be carefully selected, including organic interposer, heat sink, adhesive, etc.

The Fan-Out Embedded Bridge with TSV (FO-EB-T) structure is taken to be the test vehicle in this paper. The assembly process of chiplet integration is firstly studied for wafer warpage in silicon bridge die with TSV connection process, pre-molding, u-pad, die bonding, underfill, molding process and C4 bump process. The glass carrier and organic compound candidates are predicted to make the wafer warpage within the criteria of each process and also show good alignment with experimental data. Simultaneously, the package warpage investigation is checked by the best combination of organic compound selection. Finally, the overall reliability and thermal performance is simulated through structure and material parametric simulation such as heat sink type and core type.

Overall, this paper proposes the simulation method to predict both in-process warpage and reliability stress performance and also take thermal performance into considered. Besides, the metrology of in-process warpage prediction will be explained which suffers the saddle shape warping performance. Above that, the FO-EB-T package development that can save the DOE and reduce the warpage and stress risk is been proposed.
Numerical Simulation on Stress on C4 Bump Distribution of Silicon Interposer
Authors: Chen Haijie , Bian Ziyao , Liu Tao , Zhao Qiang , Lin Yaojian , Xie Jielei
Published: February 2025

2.5D advanced packaging has become a major technological highlight in the development trend of semiconductor packaging from 2D to 3D. Various advanced CPUs/GPUs and high bandwidth memory (HBM) are integrated through 2.5D advanced packaging. The interconnection is achieved through the micro bumps of the chip and high-density BEOL layers on the frontside of the interposer, then by the through silicon vias (TSVs) connecting the upper and lower layers, and is finally soldered onto a traditional 2D packaging substrate through C4 (Controlled Collapsed Chip Connection) bumps. With the increasing demand for performance, 2.5D packaging requires more and more integrated chips with larger areas. There is a significant mismatch in the CTE (thermal expansion coefficient) between the silicon interposer and the substrate. Therefore, the effects will be significantly amplified, leading to reliability failure and even inability to proceed with the following packaging processes. Prospective finite element analysis (FEA) can be conducted on the shape and layout of C4 bumps to analyze their effect on mechanical stress buffering on the total package. Finally, based on these simulation results, the optimal combination is recommended so that the layout and shape of the C4 bumps can provide effective assistance for the overall stress buffering of the package.
Cause and Prevention of Large Void Formation in Flip Chip Solder Connections
Authors: Ramos J. Ramirez , Marinis T. , Hanson D.
Published: February 2025

X-ray inspection of large die bonded into ceramic packages revealed a high incidence of voids, whose size approached 20 percent of the solder volume. All voids appeared to form on the chip bond pads. Die attachment was performed on a high precision bonder with in-situ reflow under a formic acid atmosphere. The die were bumped with 98.2 tin / 1.8 silver weight percent solder on nickel coated copper pads. The cofired ceramic packages were metallized with electroless gold over nickel. Our investigation determined that the voids were initiated by formation of a gold-nickel-tin intermetallic compound that released hydrogen gas at the solder interface. This compound formed preferentially on the chip pads because after completing reflow, the bonder cooled the assembly by blowing nitrogen on it, which caused the chip to cool faster than the package because of its much lower thermal mass. The propensity for void formation was all but eliminated by reducing the peak reflow temperature, time above reflow, and making modifications to the bonder cooling system to reduce the temperature difference between the chip and its package.

We believe that after the voids nucleated at the solder-intermetallic interface, they continued to grow by release of hydrogen from the molten solder. Our calculations indicate that a concentration of 0.0048% hydrogen atoms in the solder is sufficient to grow voids of the size that we observed. Our hypothesis that release of dissolved hydrogen drives void growth was supported by a hydrogen degassing experiment that we conducted. As-received solder bumped chips were baked under high vacuum for several days, and then bonded to silicon chips with gold/ nickel metallized bond pads. X-ray inspection of these assemblies revealed no voids in contrast to the multiple voids observed in similar samples that were bonded without the hydrogen degassing step.
Predictive role of lactylation-related gene signature in the prognosis and immunotherapy response in bladder cancer
Authors: Liu Guoyuan , Hong Ting , Liu Xinyu , Lin Xuanhao , Yao Peixiu , Chen Xifeng , Zhang Yonghai , Sarica Kemal , Hong Xuwei
Published: February 2025

Objective: Lactylation is a type of chemical modification involving the introduction of lactyl groups to a molecule which can affect the interactions between tumor cells and their microenvironment. This study aims to evaluate the possible role of lactylation-related gene signature in the prediction of both prognosis and immunotherapy response in bladder cancer (BLCA). Methods: Lactylation-related genes were obtained from the published work and two subtypes (cluster A and B) were identified through unsupervised clustering. The differences including clinical features, differentially expressed genes (DEGs), pathways, and immune cell infiltration between these two clusters were thoroughly examined. Results: By utilizing the DEGs between the two clusters, a lactylation score was identified to predict the overall survival status and the response of BLCA patients receiving immunotherapy. Our results demonstrated that patients with a high lactylation score tended to have a worse survival period and increased immune cell infiltration level. Further analysis showed that high lactylation score may be associated with higher sensitivity to immune checkpoint inhibitor (ICI) treatment which is crucial in the identification of the suitable candidates for ICI therapy. Conclusions: Our results emphasize the possible predictive role of lactylation-related gene signature both in the survival rates of BLCA and its implications for treatment strategies.
Editorial Comment on “Lady Urologist and male patients with prostate cancer”
Authors: Costantini Elisabetta , Illiano Ester
Published: February 2025

As a member of the Editorial Board  and a pioneering woman in the world of urology, I would like to make some comments on the letter published in the present issue of Archivio Italiano di Urologia e Andrologia about Suzanne Koven's book published in 2021...
Evaluating the efficiency of energy use in cultivation of medicinal plants: a case study on garden thyme and peppermint employing life cycle assessment and support vector machine modeling
Authors: Tamhidi Farid , Almassi Morteza , Ghahderijani Mohammad , Bakhoda Hossein
Published: February 2025

This study utilized two questionnaires to assess energy consumption in farms and the energy yield from garden thyme and peppermint over multiple years. During face-to-face meetings with farmers, 55 questionnaires were completed. The Ecoinvent database was utilized to gather necessary information, and Simapro software was employed for LCA calculations. Additionally, the study utilized the SVM model to predict the energy output of garden thyme and peppermint. The findings revealed that electricity accounted for the highest energy consumption in thyme cultivation, representing 41% for garden thyme and 36% for peppermint of the total energy usage. Urea fertilizer played a significant role in energy consumption for both peppermint and garden thyme agriculture, comprising 34% of the total energy usage after electricity. Furthermore, the energy production to consumption ratio for five years of garden thyme and peppermint cultivation stood at approximately 2.2 and 2.17, respectively. The results demonstrated that the SVM model exhibited high accuracy and low error rates in estimating energy output for garden thyme and peppermint. The evaluation criteria for actual versus predicted data yielded an R2 value of 0.9796 and RMSE of 0.0367 for garden thyme, and an R2 value of 0.9765 and RMSE of 0.0081 for peppermint. These metrics indicate a strong performance in estimating output energy for both plants.
Pulmonary hypertension – Diagnosis and management
Authors: Jain Dikshant , Isser H. S.
Published: February 2025

Pulmonary hypertension is estimated to involve about 1% of the population. It presents with symptoms of exertional, breathlessness and occasional chest pain, fatigue, and pedal edema. it involves the obliteration of pulmonary micro circulation and decreased gaseous exchange leading to the classical symptoms. Routine Blood tests diagnose a failing right heart. ECG and 2D Echo show right sided hypertrophy along with signs of pulmonary hypertension. Management includes diuretics, calcium channel blockers for patients responsive to vasoreactivity test, endothelin receptor, antagonists, phosphodiesterase inhibitors, and prostacyclin analogues and receptor agonists. More research is in the pipeline to slow the progression of the disease and alter the course but concrete evidence is awaited.
Dermoscopic Findings in Patients with Hyperpigmented Lesions: A Study from a Tertiary Care Hospital
Authors: Grewal Lamya , Bhushan Himani , Goyal Parul , Narang Ranchit , Chhina Parneet Kaur , Gill Supreet Singh , Sood Anurag
Published: February 2025

Background:

Pigmentary disorders impair the quality of life of patients and impart significant psychological morbidity. Clinically, while most lesions are recognised diagnosing some can be difficult because of the overlapping clinical picture. Dermoscopy is a non-invasive methodology wherein by using a dermoscope a diagnosis can be arrived at by careful observation of the presenting features.

Objective:

The present study aims to evaluate the dermoscopic findings in patients with hyperpigmented lesions using a Dino-Lite Edge/AM7115 series dermoscope.

Materials and Methods:

A total of 100 patients having hyperpigmented skin lesions of any age or sex were included in the study. A detailed clinical/dermatological examination was carried out using a Dino-Lite edge/AM7115 series dermoscope, and all dermoscopic findings were recorded.

Results:

The mean age of the patients was 32.07 ± 9.08 years. There were 70% females and 30% males indicating a female predominance. The most common site of lesions was the centro-facial region, observed in 47% of cases. The background colour of pigmentation that was assessed by dermoscopy showed dark brown lesions in all the cases indicating a 100% preponderance. The morphological pattern assessment indicated that irregular pigments were the most common in 64% of the cases. Dark brown dots/globules were found in 100% of the cases. The predominant pattern of pigmentation observed was reticulated in 53% of cases. The follicular findings showed perifollicular sparing in 65% of cases, whereas telangiectasia was seen in 48% of the cases.

Conclusion:

The study offers information on dermoscopic findings in hyperpigmented lesions from a northern tertiary care facility. This study supports the findings of earlier research by recommending that non-invasive use of a dermoscope is essential for accurate diagnosis. Larger research in the future might help in reducing the number of needless biopsies when treating hyperpigmented patients.
THE USE OF SHOW AND TELL (S&T) STRATEGY IN TEACHING VOCABULARY FOR THE KINDERGARTEN TEACHERS
Authors: Aini Rizka Marlisa , Fadhilah Nurul , Amalina Zahria , Fahmi Said Miftahul , Andika Wiwi
Published: February 2025

This study focuses on enhancing the vocabulary mastery skills of kindergarten teachers by employing the Show and Tell (S&T) method. The research adopts a quantitative approach, specifically utilizing experimental research design. A total of 12 kindergarten teachers from TK Khalifah 3 Banda Aceh participated in this study. Data collection was conducted through pre-tests and post-tests, using multiple-choice questions designed to assess vocabulary mastery. The instruments measured specific indicators, including mastery of standard language, completion of gap sentences, identification of synonyms, and recognition of antonyms. The collected data were analyzed using the T-test formula to determine the effectiveness of the intervention. The findings reveal that the implementation of the Show and Tell (S&T) strategy significantly improved the vocabulary mastery of the teachers involved. This improvement is attributed to the interactive and engaging nature of the S&T method, which encourages teachers to participate actively and develop their language skills in a more meaningful and practical manner. The study concludes that the Show and Tell (S&T) strategy is an effective tool for enhancing vocabulary skills among kindergarten teachers, equipping them with the linguistic proficiency necessary for their teaching roles. This research highlights the importance of innovative teaching methods in professional development and underscores the potential of active learning strategies in improving language skills among educators. Further studies are recommended to explore the long-term impact of the S&T method and its applicability across different educational contexts.
Safe and Healthy Green Jobs
Authors: Albin Maria , Håkansta Carin , Bodin Theo , Wadensjö Eskil , Broberg Karin
Published: February 2025

The green transition builds on a change to fossil-free energy and to a circular economy. In a European context, the major policy initiative is the Green Deal. While this transition needs to be rapid, gains and losses of jobs need to be considered. This may have profound positive and negative effects for different occupational groups as greening of the jobs may both eliminate current risks (e.g. associated with fossil fuels), and introduce new ones. This article provides examples of such risks to occupational safety and health. It also discusse employment conditions and worker bargaining power in relation to the twin digital and green transition. In order to reduce negative effects of the green transition on the health and safety of workers, we suggest that there is an urgent need to establish strategies for Safe and Healthy Green Jobs. We proceed tosuggest steps towards such a Roadmap, and also indicate some key knowledge gaps.
 
Keywords
Green Deal, job gains and losses (eller Creative destruction?), occupational safety and health, circular economy, chemical health risks, twin transition, road-map for safe and healthy green jobs
Understanding Nursing Challenges and Adherence to Correct Practices to Enhance Patient Care: An Exploratory Study in Selected Institutes of Delhi, India
Authors: . Chandni
Published: February 2025

Exploring Nursing Challenges and Adherence to Correct Practices in Selected Institutes of Delhi, India. This study delves into the multifaceted challenges faced by nurses in healthcare settings and their adherence to correct practices to enhance patient care quality. Drawing on a mixed-method approach, the research investigates the factors contributing to nurses' inconsistent adherence to best practices despite possessing the necessary knowledge. Through semi-structured questionnaires, focused group discussions, and in-depth interviews, the study explores the experiences of nurses in selected institutes of Delhi, India. The literature review underscores the pervasive nature of work system failures and interruptions in hospital nursing, emphasizing the complexities of delivering uninterrupted care amidst systemic challenges. Additionally, the review highlights the importance of understanding missed nursing practices and their implications for patient outcomes, providing a foundation for the current study's exploration. Findings from the study reveal insights into nurses' motivations, roles, and responsibilities, shedding light on the challenges they face in their daily practice. Motivators such as the desire to assist others, impact on patients' lives, and career development opportunities emerge as key themes. The study also uncovers the diverse responsibilities of nurses, including patient care, assessment, coordination with other departments, and continuous professional development. By bridging the gap between literature and empirical evidence, this study contributes to a deeper understanding of nursing challenges and adherence to correct practices in the context of selected institutes in Delhi, India. The findings offer valuable insights for healthcare organizations, policymakers, and educators to support nurses in delivering optimal care and improving patient outcomes.
Использование искусственного интеллекта в инновациях
Authors: Пальмов С.В. , Веретина С.Д. , Сацкая А.А.
Published: February 2025

В последние годы искусственный интеллект (ИИ) стал ключевым драйвером инноваций в различных отраслях. Эта статья исследует влияние ИИ на процессы автоматизации, анализа данных и создания новых продуктов и услуг. Рассматриваются основные технологии, такие как машинное обучение, обработка естественного языка и компьютерное зрение, которые позволяют компаниям оптимизировать операции и повышать эффективность. Особое внимание уделяется применению ИИ в контексте цифровой трансформации, где он способствует индивидуализации клиентского опыта и разработке умных систем. Также обсуждаются вызовы и этические аспекты, связанные с внедрением технологии, включая вопросы безопасности данных и социальной ответственности.

In recent years, artificial intelligence (AI) has emerged as a pivotal driver of innovation across various industries. This paper examines the impact of AI on automation processes, data analysis, and the development of new products and services. It discusses core technologies such as machine learning, natural language processing, and computer vision, which enable companies to streamline operations and enhance efficiency. Special attention is given to the application of AI within the context of digital transformation, where it supports personalized customer experiences and the development of intelligent systems. Challenges and ethical considerations related to the implementation of AI, including data security and social responsibility, are also explored.
Реинжиниринг бизнес-процессов предприятий гостиничного и ресторанного бизнеса на основе конкурентных преимуществ, гибкости и инновации в условиях социально-экономических изменений
Authors: Филатов В.В. , Бузулуцкая М.В. , Першукова С.А. , Аванесова Д.Б.
Published: February 2025

В статье рассмотрены методологические аспекты реинжиниринга бизнес-процессов предприятий гостиничного и ресторанного бизнеса на основе конкурентных преимуществ, гибкости и инновации в современных условиях социально-экономических изменений. Показано, что конкурентное преимущество, гибкость и инновации – три ключевых аргумента, почему реинжиниринг бизнес-процессов может помочь компаниям адаптироваться к изменяющимся условиям рынка. Рассмотрены отраслевые кейсы (отель «Cosmopolitan», гостиница "Аэрополис", ресторан «Боярский»), система управления бизнес-процессами, ее основные элементы и предложены рекомендации по ее совершенствованию. Анализ систем управления бизнес-процессами показал, что она является сложным и многогранным механизмом, который требует постоянного внимания и совершенствования. В условиях современного рынка, где конкуренция между гостиницами становится все более острой, внедрение системы управления бизнес-процессами становится необходимым условием для успешного развития и процветания гостиницы. Внедрение системы управления бизнес-процессами позволяет оптимизировать работу всех отделов и служб, что приводит к более быстрому и качественному обслуживанию гостей. Это повышает удовлетворенность клиентов, которые готовы рекомендовать гостиницу своим знакомым, а также повторно останавливаться в ней.

The article examines the methodological aspects of business process reengineering in the hotel and restaurant business based on competitive advantages, flexibility and innovation in modern conditions of socio-economic change. It is shown that competitive advantage, flexibility and innovation are three key arguments why business process reengineering can help companies adapt to changing market conditions. Industry cases (Cosmopolitan Hotel, Aeropolis Hotel, Boyarsky restaurant), business process management system, its main elements are considered and recommendations for its improvement are proposed. An analysis of business process management systems has shown that it is a complex and multifaceted mechanism that requires constant attention and improvement. In today's market, where competition between hotels is becoming more acute, the introduction of a business process management system is becoming a prerequisite for the successful development and prosperity of the hotel. The implementation of a business process management system makes it possible to optimize the work of all departments and services, which leads to faster and better guest service. This increases customer satisfaction, who are willing to recommend the hotel to their friends, as well as to stay in it again.
Echocardiographic evaluation of subclinical ventricular dysfunction in polycystic ovary syndrome: the role of isovolumic acceleration and myocardial performance index
Authors: Oksen Dogac , Aslan Muzaffer , Yavuz Yunus Emre , Nas Necip
Published: February 2025

Aims: Polycystic ovary syndrome (PCOS) is a common endocrine disorder associated with increased cardiovascular risk and potential subclinical ventricular dysfunction. Isovolumic acceleration (IVA) is a novel echocardiographic parameter sensitive to myocardial contractility and less influenced by preload and afterload, making it a promising tool for early detection of cardiac dysfunction. This study aimed to assess the utility of IVA and other echocardiographic markers in identifying subclinical ventricular dysfunction in PCOS patients.
Methods: This cross-sectional study analyzed echocardiographic parameters of 59 PCOS patients and 60 age-and BMI-matched controls. Echocardiographic measurements included IVA, myocardial performance index (MPI), and additional indices of right and left ventricular function.
Results: PCOS patients exhibited significantly higher BMI and fasting glucose levels (p
Integrating Multimedia Tools to Enrich Interactions in Live Streaming for Language Learning
Authors: Tariq Eefa Binte
Published: February 2025

Purpose: According to the study, multimodal engagement may improve language learning in live-streamed contexts. These include text, speech, video, images, and stickers. The main goal is to examine how new technologies enable more interactive, real-time language instructor-student interactions by overcoming text-only communication in typical online classrooms.
Materials and Methods: One language instructor and nine students participated in a two-week field research project. In four live-streamed lessons, the teacher tested three English teaching methods using text, audio, video, photographs, and stickers. These multimodal channels allow students to engage in class discussions and provide constructive critique actively.
Findings: The study found that multimodal communication engaged students and provided quick feedback. The tools' effectiveness depended on group size, learning context, time of day, and instructors' and students' online identities.
Implications to Theory, Practice and Policy:  Online language education may benefit from real-time feedback and involvement via audio, video, text, etc. When creating courses, teachers must consider group size class time, and how students utilize resources.
Biotransformation of Dehydroepiandrosterone by Aspergillus Species and A Comparison of the Results with Previous Studies
Authors: Abdulghafoor Al-ani Raghda Mahmood
Published: February 2025

Steroids are widespread in nature, being found in animals, plants, fungi, and certain bacteria. Microbial transformation found wide applications in biotransformation of steroids in order to obtain stereoselective products. This work will explain how to incubate DHEA alongside Aspergillus glaucus MRC 200914 in order to understand the way of this fungus metabolizes the substrate. The main outcome of incubating DHEA with Aspergillus glaucus in this study was the production of several hydroxylated metabolites.
The Impact of STEM Activities on Students’ Knowledge and Project Development Skills
Authors: Abdul Rahman Teh Faradilla , Zakariah Zazaleena Binti , Anuar Nurhilyana Binti , Noh Zakiah Binti , Abdul Razak Nawal Binti
Published: February 2025

Science, Technology, Engineering, and Mathematics (STEM) education is increasingly recognized as vital in today’s rapidly evolving exploration among students in driving innovation and problem-solving across various fields. As interest in STEM grows, students are being engaged with numerous hands-on STEM activities to foster learning experiences, boosting knowledge and skill, cultivating critical thinking and creativity, and collaboration while enhancing their understanding and adaptability of STEM concepts. Hence, this study was conducted to identify the impact of STEM activities on students’ knowledge and project development skills. The study was carried out using the STEM Mentoring Program with five phases which involved 48 lower secondary school students from Dengkil district in Selangor aged between 13 to 17 years old. The respondents were chosen by using purposive sampling; to represent the lower secondary students’ population where age is the key criterion. A quantitative approach that consists of 17 items with 2 sections was used as the instrument in this study to determine the impact of STEM activities on students’ knowledge and project development skills. The result discovered that all items displayed a high mean score level. The majority of students have basic knowledge and are delighted to learn STEM. However, more effort needs to be placed on project development skills as some of the respondents are still standing at a novices’ stage in problem-solving techniques. It can be concluded that suitable STEM activities strengthen the level of knowledge and project development skills simultaneously affecting the enrolments in STEM courses for secondary school students.