bluuebunny/crossref_metadata_2025 huggingface dataset:
Synchronization of time-delay systems with impulsive delay via an average impulsive estimation approach
Authors: Li Biwen , Huang Qiaoping
Published: February 2024

We investigated synchronization of dynamic systems with mixed delays and delayed impulses. Using impulsive control method and the average impulsive interval approach, several Lyapunov sufficient conditions were given for ensuring synchronization in terms of impulsive perturbation and impulsive control, respectively. The derived conditions indicated that delays in continuous dynamical systems were flexible under impulsive perturbation and were not strictly dependent on the size of impulsive delays, and they may have a potential impact on synchronization of the considered system. In addition, applying the proposed concepts of average positive impulsive estimation and average impulsive estimation, we integrated the information in impulsive delay into the rate coefficient to eliminate the limitation of having the same threshold at each impulse point, while the impulsive delay maintained the synchronization effect. This was an improvement on the previous results obtained. Finally, we provided two numerical examples to illustrate the validity of our results.
Construção e validação do inventário de medida de saúde mental para teletrabalhadores
Authors: Ribeiro Beatriz Maria dos Santos Santiago , Dalri Rita de Cassia de Marchi Barcellos , Santos Sérgio Valverde Marques dos , Terra Fábio de Souza , Silva Ana Márcia Rodrigues da , Silva Luiz Almeida da , Robazzi Maria Lucia do Carmo Cruz
Published: February 2024

Objetivo: construir e validar um instrumento para mensuração da saúde mental de profissionais atuantes no teletrabalho. Métodos: estudo metodológico aplicado a 456 teletrabalhadores de diferentes áreas de trabalho e regiões do Brasil para o processo de validação. Os dados foram avaliados utilizando-se estatísticas descritivas, análise fatorial exploratória e a avaliação da consistência interna pelo Alfa de Cronbach. Resultados: o instrumento foi composto por 39 itens e a análise fatorial revelou a existência de seis fatores distribuídos nesses itens. Tais fatores explicam 59% da variância do construto, possuem índices de Alpha de Cronbach superiores a 0,75 e itens com cargas fatoriais superiores a 0,30 e são aspectos negativos do teletrabalho, aspectos positivos do teletrabalho, sobrecarga de trabalho, aspectos ergonômicos, gestão e comunicação no teletrabalho e consequências do teletrabalho Conclusões: o instrumento em questão recebeu avaliação positiva dos especialistas e validadores e os testes estatísticos realizados demonstraram propriedades psicométricas válidas; os seis fatores identificados apresentaram boas qualidades psicométricas e corroboram com os indicadores de saúde mental encontrados na literatura.
Hybrid Bonding for the Next Generation of High -Performance Devices
Authors: Mirkarimi Laura
Published: February 2024

The electronics industry continues to pursue optimal performance for the insatiable consumer demand of computation intensive products

like GPUs, CPUs and AI accelerators. While the monolithic system on chip approach promises exceptional performance, it is costly. The

advanced packaging industry has responded to the challenge with 2.5D and 3D integration solutions that bridge the performance gap with

heterogeneous integration. Hybrid bonding combined with chiplet architectures within 2.5D will enable the distribution of function and

nodes across a chips within a module, providing a path toward more flexible product introduction and innovation.

The design and manufacturing of chip-to chip-communication is complex and has some technology dependencies. One technology limitation

in realizing a monolithic performance with heterogeneous integration is solder interconnect scalability. Hybrid bonding is a revolutionary

platform technology that solves the interconnect scalability problem and delivers enhance performance compared to the conventional

Cu microbump.

The Direct Bond Interconnect (DBI®), more generally known as hybrid bonding, offers a performance boost that enables novel 3D architectures

via disaggregation and chiplet implementation, in spite Moore’s law slowing. The efficient interconnect between circuit functions at

the wafer, die and package level, will fuel semiconductor company roadmaps for decades. The performance advantages, ease of integration

of such a hybrid interconnect will be discussed in chip to wafer and chip to chip applications. The key areas of innovation anticipated to

proliferate the technology within the entire advanced packaging supply chain will be presented.
Heterogeneous Integration with 3D Packaging
Authors: Agarwal Rahul , Cheng Patrick , Shah Priyal , Wilkerson Brett , Swaminathan Raja , Wuu John
Published: February 2024

The next generation of competitive integrated devices demand increased device density, higher memory bandwidth, reduced global interconnects, increased energy efficiency (with higher performance), and a smaller footprint. With the slowdown in Moore’s law and the advancements in chiplet architectures, which are now recognized as fundamental to enabling the continued economically viable growth of power efficient computing, advanced packaging technologies and architectures are becoming more critical to enabling Moore’s Law’s next frontier through heterogeneous integration. In this presentation, we will cover the advanced package architectures being enabled by AMD to enable power, performance, area, and cost (PPAC) improvements as well as enable heterogeneous architectures. The direct Cu-Cu bonding technology used in AMD 3D V-Cache architecture will be detailed and compared to industry standard 3D architectures.
FOWLP Thermal Debonding: Easing Manufacturing Constraints
Authors: Sanchez Debbie Claire
Published: February 2024

Fan-out wafer level packaging enables System-in-package (SiP) and other forms of heterogenous integration. Multi-die configuration or passives for SiP alters the warpage profile of the wafer significantly.

Wafers with square-shaped dies typically have bowl or dome type deformations. Wafers with rectangular-shaped dies tend to be deformed in a parabolic shape. However, as the packaging advances to different and more sophisticated technologies, the different chip sizes in one wafer adds complexity to the base structure, which leads to an unpredictable warpage profile and a higher warpage magnitude.

Downstream equipment post wafer reconstruction needs to be able to handle this change in magnitude and profile since this could otherwise cause difficulties in high volume production and result in lower yield. The process step that requires the wafer to be placed onto chucks will result in vacuum failure and, if not modified to handle high warpage, the transport mechanism can result in wafer excursion and machine downtime. However, these modifications would require a costly redesign of the machine transport system, handling system, and end effectors. A less cost-intensive solution would be to ensure that the incoming wafer post reconstruction has minimum warpage.

Thermal debonding is the last process of the wafer reconstruction flow and it acts as launchpad for layer build-up. It is in this step that warpage is inevitable as the wafer is released from the carrier. Thus, it is essential to have a warpage level that is manageable by these succeeding processes.

This paper addresses the issue of warpage in Fan-out Wafer Level Packaging and presents a solution that lessens the warpage in the thermal debonding stage. The efficient processing of warped wafers is critical for the development of Fan-out and the transition to high volume manufacturing of these chips.
Addressing Challenges in Dual Sided SiP Thermal Budget
Authors: Zhang Hanwen
Published: February 2024

System-in-Package (SiP) has been adopted as the mainstream advanced packaging technology in many consumer applications including 5G smartphones, tablets, wireless earbuds, smart wearables, etc. Heterogeneous integration, smaller form factor, better electrical performance, lower cost of assembly and faster time to market are the key differentiators of SiP as compared to conventional packaging techniques.

In applications such as 5G mobile RF Front-End (RFFE) and Antenna-in-package (AiP) modules, dual sided SiP is the popular approach which brings even higher level of integration and smaller form factor. However thermal warpage control is a significant challenge during two times of solder reflow processes for the front and back sides of the package, especially if one side is with underfill and mold materials which have significant CTE mismatch to the substrate and dies, causing delamination failures and yield losses.

This study examines the novel solution of reducing thermal budget with the use of a low temperature solder paste material based on SnBiAg alloy in ultra-fine pitch Type 6 solder powders. It allows a minimal peak reflow temperature of only 170 °C that effectively reduces warpage of dual sided SiP substrates. Solder alloy and paste properties and solder joint microstructures are examined in detail for tests including fine-pitch printing and component soldering, thermal aging test on different substrate finishes, thermal cycling test and mechanical drop test for reliability performance.
Electrochemical Plating System Development of Nanotwinned Cu for Multiple WLP Features
Authors: Han Jianwen
Published: February 2024

We develop a series of electrochemical plating (ECP) baths and processes, generating nano-twinned Cu (nt-Cu) in wafer-level packaging (WLP) applications to fulfill the expanding market demand for copper-to-copper direct bonding and hybrid-bonding. This newly developed system shows a high density of nt-Cu (close to 100%), controllable grain size (0.10 to 1.0 micron), vertical columnar structure (through the full height), and minimal transition layer between Cu seed and nt-Cu initial position (dozens of nanometers). These systems have expansive operating windows which produce high-density nt-Cu films: from the inorganic electrolyte concentrations, including copper, acid and chloride, to the ECP current density, ECP current waveform, agitation speed and additive concentrations.

The new ECP system consists of one, two or three additives, depending on the applications, and we demonstrated that this sytem could fill multiple WLP features with a high density of nt-Cu and a flat surface. Unlike the features without recess, there exist more challenges for the components with PI-recess. The balance between conformal and bottom-up ECP must be well-controlled to achieve a flat surface without affecting the nt-Cu formation. To do so, we used two or three additives in the system, including the one that promotes bottom-up fill. Although having an additional additive in the electrolyte weakens the formation of nt-Cu to a certain level, we achieved the balance successfully by adjusting electrolyte compositions and ECP parameters for a series of WLP features.

The working window of ECP parameters for generating nt-Cu structure is relatively wide. To achieve a uniform and flat surface of a high density of nt-Cu for specific WLP features, the additive concentrations and plating current waveform should be well-controlled. They are more critical than other parameters for controlling the ECP nt-Cu performance. We evaluated numerous waveforms, such as constant current, multistep current, ramping current ECP and other waveforms to generate nt-Cu films. At the current stage, both within die (WID) and within feature (WIF) of ECP nt-Cu for WLP features tested can be as low as 5.00 % with high density, columnar orientation, and less transition layer nt-Cu.

Contrary to some published literature, our ECP process can produce nt-Cu films with Cu(111) orientation irrespective of the direction of the base substrate. Our ECP nt-Cu process does not appear to exhibit such substrate-dependent preference. We can generate high-density nt-Cu films using Cu (111) dominating seed layer and non-Cu (111) dominating substrates and even using stainless steel substrates.

This paper will attempt to discuss additive functions, the mechanism of the balance between conformal and bottom-up ECP process, agitation speed, plating current waveform, multi-bath plating, electrolyte compositions, and substrate influence.
NIST Advanced Manufacturing Technology (MfgTech) Roadmap
Authors: Ray Urmi
Published: February 2024

The iNEMI team has been entrusted with developing a comprehensive NIST Advanced Manufacturing Technology (MfgTech) Roadmap on the topic of 5G/6G mmWave Materials and Electrical Test Technology (5G/6G MAESTRO). The goal of this technology roadmap is to create in the U.S. a world-leading knowledge base and technical know-how in mmWave material selection, characterization and test – the first necessary foundation for the development and manufacturing of leading edge 5G and 6G products with the highest radio performance. This paper will provide an introduction to the roadmap creation, and provide a status, including highlights of the progress to date.
Validating Flip Chip Package Models Through Experimental Deflection Measurements
Authors: Cox Kevin , Krantz Jason , Borden Matt , Tonthat Steven
Published: February 2024

Tektronix Component Solutions is advancing its simulation capabilities to improve product reliability, reduce development costs, and speed up time-to-market. Developing a model that accurately predicts performance requires that it be validated through correlation to real-world results. In this work, a high-fidelity, multi-step, nonlinear finite element model was built including processing steps and thermal cycling to mirror the real environment of a flip chip package. Extensive materials characterization was performed to capture accurate time-and-temperature dependent (viscoelastic) properties of the underfill adhesive, stiffener ring adhesive, and substrate components. Model accuracy was established through three measurement techniques to characterize package deflections. The Thermo-Moiré technique was used to measure package warpages as a function of processing step and thermal loading. Optical Interferometry was used as a secondary approach to measure package warpage as a function of processing step. Lastly, Digital Image Correlation was performed on a cross-section of the package to characterize shear and through-thickness strains of critical solder bumps. The simulation produced excellent correlation with the various measurement techniques, and it was found that component pre-warpage (inherent to the substrate and stiffener ring) was a necessary variable to account for during simulation and measurement. With the excellent correlation provided by the models, Tektronix Component Solutions is now using these methods in combination with material strength testing to advance critical stress and survivability predictions in advanced packages.
Squaring Off with M-Series Fan-Out Technology
Authors: Sandstrom Cliff , San Jose Benedict , Olson Tim , Fang Jen-Kuang , Yang Ping-Feng , Feng-Huang Sheng , Shen Ping-Ching
Published: February 2024

Currently running at volumes in the millions of units per day on 300mm round format, Deca’s M-Series™ fan-out PLP technology and Adaptive Patterning® are being scaled up at ASE to 600 mm for production. The SEMI standard 600 mm square format pioneered by Deca, provides a 500% increase in usable area per panel providing cost-effective capacity growth as well as a powerful platform for high density integration of multi-die and chiplets in 2D, 2.5D and 3D structures.

Deca’s patented Adaptive Patterning® coupled with chip attach compensation modeling overcomes the yield challenges associated with scaling to 600 mm and mitigates the compounding risk associated with the growing number of dies in a package, which is of particular importance for chiplet designs.

The use of Laser Direct Imaging (LDI) overcomes the need for reticle stitching and eliminates this barrier for large package body sizes. In addition, 600mm allows for higher efficiency in terms of package count per format area over 300mm round, leading to less waste, thus a lower cost and a more environmentally friendly process.

Recent advancements in LDI have allowed the potential to scale the technology to ultra-high density 2µm line & space redistribution layers (RDL) and 5μm vias. Advancement in Adaptive Patterning have led to multi-die packaging solutions without the need for complicated embedded bridge chips. With these ultra-high-density tools at hand, a breakthrough in device interface pitch of 20µm area array for leading edge silicon nodes will be outlined.
Extending Moore’s Law with Integrated Photonics (and Packaging)
Authors: Harris Nicholas
Published: February 2024

The insatiable growth in computing needs, coupled with the end of Denard Scaling and the slowdown of Moore’s Law, is resulting in a major shift across the industry towards a chiplets-based product architecture. Solutions that enable the heterogeneous integration of disaggregated silicon at high data rates and low power are becoming increasingly important. Silicon photonics based interconnect solutions play a critical role in enabling this integration.
The Evolution of Moore’s Law Through Chipletized Architectures
Authors: Medrano Vic , Trinh Tony
Published: February 2024

Staying ahead of America’s adversaries requires control of the electromagnetic spectrum and therefore an evolution of the sensor processing chain. Agile, chip-scale, direct analog-to-digital solutions at the sensor edge are needed to overcome data bandwidth and latency limitations that are inherent with legacy EW and radar systems, and reduce design cycles, size, weight, power, and cost (SWaP-C). Heterogeneous, 2.5D integration is the next phase of Moore’s Law enabling a new approach to microelectronics based on chipletized architectures. The acceleration of deployable modular, high-performance microelectronics to the tactical edge is achieved by integrating the best silicon processing nodes for analog/digitization, processing, memory, and AI functionality on one chip.

Mercury is partnering with leading semiconductor providers to deliver to defense customers the only trusted, RF system-in-package (RFSiP) devices that utilize an ecosystem of advanced, die-level building blocks, called chiplets, at the speed of innovation and purpose-built for each mission. Through assembly of high-density chiplets on a silicon interposer, on-chip die-to-die interconnects enable efficient conversion between analog and digital signals, signal processing, high-speed IO, and power management while reducing system complexity and SWaP-C. The use of open standard die-to-die interfaces allows chiplets to be rapidly upgraded or modified to meet the intended use case. In this paper, Mercury explores how 2.5D integration of state-of-the-art chiplets on a silicon interposer solves next-generation EW and radar system data processing challenges.
Enabling Co-Design of 3D Heterogeneous Packages
Authors: Park John
Published: February 2024

The days of ‘throwing it over the wall’ are over. Heterogeneous Integration (HI) is ushering in a new era of electronic product design with collaboration at its core – one that lives or dies on seamless interaction between analog/digital IC teams and package design teams.

The use of advanced packaging technologies to combine smaller, discrete chiplets into one system-in-package (SiP) not only pushes the need for more advanced multi-die packaging, it makes packaging part and parcel of the process. And in doing so, it significantly reduces dependance on Moore’s Law at a time in which building an advanced monolithic system-on-chip (SoC) has become prohibitively expensive.

For many tech companies, Moore’s Law no longer represents the best technical nor economical path to designing a product. And for a great many of those companies, HI presents a solution – SiPs close to the SoC form factor but with far lower overall cost, greater yield and perhaps most importantly, faster time to market. While SiP as a packaging concept has been around for decades, the recent tsunami of designs that have adopted HI is truly a disruptive change.

This presentation will outline some potential solutions to the challenges design teams face when pivoting from monolithic IC design to 3D heterogenous package design.
High Speed Copper Plating Process for IC Substrate
Authors: Fleuriel Sean , Rodriguez Confesol , Feng Kesheng , Pan Linyu , Tshitenge Victoire Kayempi , Moon Robert , Cruz Dolores , Hander Jon
Published: February 2024

The integrated circuit (IC) substrate occupies an interesting place in electronic devices. They serve as the bridge between the integrated circuits and the PCB. In this connecting point, they must meet the requirements of both worlds. They must provide the high density of connections to match the IC chip, while at the same time be a stable and robust platform for the chip to reside on.

The IC substrate feature sizes and uniformity requirements are moving closer to what is required in the semi-conductor industry, except these substrates must be made at a scale, speed, and cost expected in the PCB industry.

In this paper, we present an acid copper electrolyte for plating 2 in 1 redistribution layers (RDL), with small vias and fine lines down to 10µm wide. The electrolytic process successfully plates these features, while maintaining a uniform surface across the panel. The 510 mm x 515 mm panel had less than 5% variation in Cu thickness.

The electrolyte was evaluated in a vertical continuous plating (VCP) style tool and a tool that plates panels at high speed. The standard VCP tool operated around 1.0 – 3.0 ASD, whereas the high-speed plater operated around 4.5 – 6.5 ASD. The obvious benefit of the high-speed tool was to reduce the plating time, but it also provided new degrees of control that are not available in VCPs. In either tool, the electrolyte performed well and produced uniform deposits that met the physical requirements that IC substrate applications demand.
Addressing Advanced IC Substrate Deformation and Pattern Distortion Using an Extremely Large Exposure Field Fine Fine-Resolution Lithography System
Authors: Chang John
Published: February 2024

The More than Moore era is upon us, as manufacturers increasingly turn to back-end advances to meet the next-generation device performance gains of today and tomorrow. In the advanced packaging space, heterogeneous integration combines multiple chips with different functionalities and from different silicon nodes inside one package, ranging in size from 75mm x 75mm to 175mm x 175mm. But as with any new technology, heterogeneous integration comes with its own set of unique challenges. For starters, package sizes are expected to grow significantly due to the number of components making up each integrated package. The problem: these significantly larger packages would typically require multiple exposure shots to complete the lithography steps for the package. Furthermore, the process of adding multiple redistribution layers (RDL) may cause stress to both the surface and inside of the substrate. Formation changes experienced by the panel, as a result of thermal, high-pressure and other fan-out processes, shift the design location from its nominal coordinates; this causes inaccurate overlay and low-overlay yield in the lithography process. And then there is the matter of tightening resolution requirements. RDL layers in advanced integrated circuit substrates (AICS) will require a resolution of 3µm and will eventually move toward a resolution of 1µm. To address these challenges, and better enable the heterogenous integration process, an extremely large exposure field, fine-resolution lithography solution was proposed to enable packages over 250mm x 250mm without the need for image stitching, while exceeding the overlay and critical dimension uniformity requirements for these packages. In this paper, a 515mm x 510mm Ajinomoto build-up film (ABF)+copper clad laminate (CCL) substrate is selected as the test vehicle. We will analyze the pattern distortion of an ABF+CCL substrate to understand the distribution of translation, rotation, scale, magnification, trap, orthogonality and other errors in the substrate, and then use an extremely large exposure field, fine-resolution lithography system to address the pattern distortion of the substrate. This demonstration will provide an analysis of panel distortion and detail how the extremely large exposure field, fine-resolution lithography solution addresses panel distortion to achieve an aggressive overlay number.
State of The Art (SOTA) Heterogeneous Intergrated Packaging (SHIP) Program
Authors: Crum Darren
Published: February 2024

The 2018 DoD National Defense Strategy (NDS) highlights Building a More Lethal Force through Modernization of Key Capabilities as one of the tenets in the strategic approach. Microelectronics has been highlighted as a key focus area for DoDs Modernization. To rapidly address the development of these technologies, the Trusted and Assured Microelectronics (T&AM) Program is executing the development of key technologies in accordance with a roadmap focusing on 6 different Technical Execution Areas (TEA).
Design and Analysis Challenges of 3D Multi-Chiplet Heterogenous Architectures
Authors: Park John
Published: February 2024

As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design and packaging teams are taking a close look at vertical stacking multiple chips and chiplets. This technology, called 3D-IC, promises many advantages over traditional single-die planar designs. Some are using the term ‘More-than-Moore’ to describe the potential of this new technology. Integration by stacking die and using advanced packaging technologies allows designers to cram more functionality into much smaller form factors, while improving performance and reducing costs.

Whether you are an ASIC designer or package designer, you can expect several new design and analysis challenges when transitioning from the world of single die architectures to the world of More-than-Moore.

This presentation will describe many of these new challenges facing design teams as they transition to the world of multi-chiplet 3D architectures, both on the die side and the packaging side of design. Additionally, novel solutions to many of these challenges will be presented.
Great expectations: Pres. PW Botha’s Rubicon speech of 1985
Authors: Giliomee Hermann
Published: February 2024

Die toespraak wat Pres. PW Botha op 15 Augustus 1985 voor die kongres van die Nasionale Party (NP) van Natal gehou het, word algemeen erken as een van die keerpunte in die geskiedenis van die NP-regering. Daar is verwag dat die president in sy toespraak verreikende hervormings sou aankondig, wat die regering in staat sou stel om die skaakmat in onderhandelings met swart leiers en internasionale isolasie te deurbreek. Botha se toespraak is egter wyd baie negatief ontvang. Vorige artikels beklemtoon sy persoonlikheid as `n verklaring of blameer die “onrealistiese verwagtings” wat RF (Pik) Botha, Minister van Buitelandse Sake, gewek het. Hierdie artikel probeer die gebeure rondom die toespraak verklaar deur die gebeure twee weke voor die toespraak te ontleed, bestaande interpretasies van pres. Botha se optrede te heroorweeg, en moontlikhede te ondersoek wat tot dusver nog nie oorweeg is nie.
Creating maps as historical evidence: Reconsidering settlement patterns and group relations in the Rustenburg-Pilanesberg Area before 1810
Authors: Morton Fred
Published: February 2024

Die aanlyn Landbougeografiese Inligtingsstelsel Sisteem – (bekend as AGIS) – sowel as die omvattende Atlas databasis, tesame met mondelinge oorlewering/tradisies en topokadastrale kaarte is in hierdie artikel gebruik om terrein- en grondkaarte te ontwikkel ten opsigte van sowat agt van die vyftien 18e eeuse nedersettings in die Rustenburg-Pilanesberg gebied. Hierdie kaarte demonstreer die belangrikheid van grond- en waterbronne in die keuse van waar landelike nedersettings eventueel gevestig is. Hierdie keuses wat gemaak is, wys dan ook noodwendig kontrasterende standpunte uit rakende tradisionele en bestaande sieninge oor vestigingspatrone en intergroepverhoudinge in die pre-mfecane periode. ‘n Oorsig van mondelinge oorleweringe en AGIS kaarte voorsien die nodige bewyse om die historiese vertolkings Parsons en Manson krities te debatteer. Hierdie vertolkings stel dit dat die nedersettings in die Rustenburg-Pilanesberg-gebied in ‘n toenemende konflik ingetrek is in die fase wat die mfecane voorafgegaan het. In die artikel word die standpunt gehuldig dat groepe in die Rustenburg-Pilanesberg-gebied hulle landboubedrywighede en veeteeltaktiwiteite sedert die 17e eeu geoptimaliseer het in ruimtes wat op ‘n skaflike afstand van mekaar was, en nie-defensief van aard was. Vir generasies is daar in vrede met mekaar geleef, alhoewel konflik onderling soms wel aan die orde van die dag was. Dit blyk uit hierdie vertolking dat die Rustenburg-Pilanesberg nedersettingsgroepe wel moeilike bure met mekaar kon wees, maar eweso was hulle in staat om langdurige ooreenkomste te sluit. Hierdie langdurige vrede het in duie gestort met invalle deur die Pedi gedurende die vroeg 1820’s. ‘n Analise van die kaarte wys ook uit dat toekomstige argeologiese navorsing gelyksoortige baat kan vind by die ondersoek van kleiner nedersettings soos dié van die Rustenburg-Pilanesberg gebied teenoor dié van mega-nedersettingsterreine soos Marathodi.
Southern Africa, regionalism and the SADC
Authors: Kirsten Johan F.
Published: February 2024

Suider-Afrika is `n belangrike streek in Afrika waar politieke en ekonomiese samewerking tussen state reeds dekades gelede `n aanvang geneem het. Dit was die geval selfs voor Uniewording in 1910, maar sedert die 1990`s het dit dramaties toegeneem. Die veranderde realiteit met betrekking tot regionalisme in Suider-Afrika het saamgeval met die beëindiging van Apartheid in Suid-Afrika en die gepaardgaande normalisering van internasionale verhoudinge in die streek. Dit is ook die geval dat die groei van regionalisme in Suider-Afrika en die positiewe ekonomiese en veiligheidsamewerking tussen die state van die streek wat daaruit gevloei het, direk verband hou met die beëindiging van die burgeroorloë in Mosambiek (1992) en Angola (2002) en die endemiese algemene konflik wat so kenmerkend van Afrika was in die tweede helfte van die twintigste eeu. Die “wedloop om Afrika” en die eksterne buitelandse koloniale belange wat daarmee saamgeval het, het natuurlik baie bygedra tot die gebrek aan eenheid in Afrika. Die Suider-Afrikaanse Ontwikkelingsgemeenskap (SAOG) het midde-in hierdie ontstuimige historiese omstandighede sy beslag as regionale organisasie in die sub-kontinent gekry. Veral sedert 1994 het politieke en ekonomiese interaksie skerp gegroei en het `n definitiewe regionale identiteit en bewussyn in Suider-Afrika begin ontwikkel. Regionalisme in Suider-Afrika word natuurlik spesifiek met die SAOG geassosieer as `n internasionale organisasie met `n tweeledige doel, naamlik die bevordering van ekonomiese integrasie en die versterking van regionale solidariteit , vrede en veiligheid in die streek. Die vraag is waar die SAOG in 2009 staan in die realisering van sy doelwitte en watter struikelblokke in die weg staan van sy suksesvolle funksionering.
Playing the Water Dance A guide to conducting and reporting interdisciplinary research in water resources management
Authors: Van Eeden Elize S.
Published: February 2024

No abstract available.
A historiography on past scientific research and references to environmental health concerns in the Merafong gold mining region of South Africa
Authors: Van Eeden Elize S. , Nealer Eric J. , Liefferink Mariette
Published: February 2024

Goudmynbedrywighede is sinoniem met die hoofstroom ekonomiese aktiwiteit in die Merafong Munisipale gebied. Die omgewing van Merafong (Carletonville), geleë in die verre westelike dele van die Gauteng Provinsie, is al vir dekades wetenskaplik nagevors en bepraat in konferensies, in regeringskantore, die parlement, op voetsoolvlak en in die media. Die geologies gevormde dolomiet (karst) kompartemente gevul met natuurlike ondergrondse water en gouddraende riwwe – het algaande geblyk nie net positief tot die Suid-Afrikaanse ekonomie te wees nie, maar uiteindelik negatief inwerkend op die omgewing te wees, menslike gesondheid te beïnvloed en selfs vrae te wek oor die haalbaarheid van plaaslike ekonomieë in die lang termyn. Navorsingsuitsette en individue se besorgde stemme oor tyd rakende die omgewing het nie noodwendig duidelik genoeg na vore gekom in resultate en verslae wat beskikbaar gemaak is nie. Waar dit wel duidelik en ondubbelsinnig was, is dit van Jan Publiek weerhou omdat navorsingsopdragte dikwels deur die goudmynbedryf (as synde die besoedelaar) of die Regering getaak is en as vertroulik hanteer is. Sommige navorsingsverslae sluit in amptelike dokumentasie aangaande radio-aktiewe besoedeling, ander gevaarlike afvalstowwe asook sediment neerslae se gevare in die fisiese en die mensveranderde omgewing. Hierdie artikel fokus hoofsaaklik op ‘n bepaalde faset van die Merafong-omgewing se navorsingshistoriografie binne die konteks van gesondheidsgerigte verslae en navorsingsverslae wat indirek op die kenmerke van die fisiese omgewing gesinspeel het as synde fasette wat impakte om eko-gesondheid in die breë sou kon hê. In vele opsigte kan die etiese aspek waarbinne navorsingsverslae onderneem word, bevraagteken word.
‘n Vergelykende internasionale perspektief op die historiese verloop en invloed van Uitkomsgebaseerde Onderwys (UGO) op Geskiedenis as skoolvak in Suid-Afrika (Deel Een)
Authors: Warnich Pieter , Van Eeden Elize S. , Meyer Lukas
Published: February 2024

Over the past decades many countries experimented with the OutcomesBased Education (OBE) model. OBE was often accepted as a curriculum alternative when international curriculum transformation took place in various parts of the world. One possible reason for adopting and phasing in an OBEapproach may be attributed to the fact that the traditional curriculum did not meet the demands of a post-modernist world. The twofold purpose of this article is firstly, to offer a synoptic international-historical perspective on the establishment and course of implementation of OBE in four of the foremost implementers thereof, namely the USA, England, Australia and New Zealand and secondly, to focus on the influence of OBE on the teaching and learning of History in these countries. In a follow-up article (as Part 2), the particular influence that these international OBE History curriculum frameworks had on the teaching and learning of History in South Africa, will be investigated. Furthermore the general impact that OBE had on History education in South Africa, will be examined. One of the main conclusions with respect to this article is that, to a great extent, patterns of parallel similarities exist regarding the origin, establishment and impact of the OBE-model in all the countries discussed. For example, the quality of traditional education curricula had been questioned in most of these countries when doubt manifested in the ruling parties about the ability of the country to hold its own within a globally competitive economy. To ensure economic superiority a more competent and well trained labour force was considered as indispensable. Education was considered the key to economic growth and it thus had to develop certain knowledge, competencies and skills in learners in order for them to be able to think and act in a creative and problem-solving manner. During the initial implementation phase of the OBEcurriculum there were also more visible similarities than differences among the above-mentioned countries. The idea of curriculum transformation was an acceptable education practice for most educators. Common implementation obstacles were also experienced by most educators. For example, the excessive emphasis on learning outcomes contributed to cumbrous, time consuming and complicated assessment practices. This greatly increased the workload of the educator who tried to implement the OBE-model despite a lack of both adequate in-service training and quality teaching and learning support material. Strong centralised government interference was another common denominator in most of the countries where OBE had been introduced and this posed a particular threat to the autonomy and future of History in the school curriculum.
Vlaandere en Suid-Afrika: Normalisering van politieke en kulturele betrekkinge sedert 1990
Authors: Terblanche Otto
Published: February 2024

Flanders, the northern, Dutch-speaking regional state of Belgium, traditionally regarded the preservation and strengthening of language and cultural ties with the Afrikaner as of the utmost importance. In this article the normalisation of political and cultural relations between Flanders and South Africa will be analysed in the period since 1990. The Flemish government would become more involved in developmental projects in South Africa regarding housing, health and education. The kinship between the Afrikaners and the Flemish people contributed greatly to the lively cultural interaction regarding congresses and visits by writers, poets and artists. Afrikaans books were promoted and Afrikaans was taught at various Flemish universities. There were also positive signs regarding governmental support for the Afrikaans language in Flanders.
“Help ons bou” – Die Daisyfield-inrigting en die impak van sendingwerk en godsdienstige bearbeiding in ‘n weeshuisomgewing in Rhodesië (1910 – 1948)
Authors: Hendrich Gustav
Published: February 2024

Since the founding of Rhodesia during the last decade of the nineteenth century, many Afrikaner immigrants settled in the country in search of a new life and job opportunities. As a result of the Anglo-Boer War (1899-1902), the devastating effect of natural diseases and to some extent due to subjugation by the British colonial authorities, the majority of these Afrikaners lived in a state of poverty. Subsequently, the prevalence of an increasing number of destitute or parentless children in need of care became a cause of grave concern to the Afrikaner community, especially the Dutch Reformed Church in Rhodesia. Through the initiative of and demand by several Dutch Reformed missionaries and clergy the ideal of educating orphans in a Christian Calvinist environment was realised when the Daisyfield orphanage (later located between Bulawayo and Gwelo) was established on the 30th of January 1911. Between 1910 and 1948 the orphanage gradually developed into a successful and efficacious institution for Afrikaner orphans, in spite of sometimes difficult financial and administrative circumstances. During its existence the institution became a symbol of courage and hardihood for the Afrikaner minority, as well as for the upholding of Afrikaner Christian and cultural values. Apart from focusing on the history of the Daisyfield institution, this article also seeks to address and discuss the inherent influence of the Dutch Reformed missionaries and clergy on the instilment of religious education in an orphan environment.
“Die verwesenliking van ’n Afrikanerdroom”: Die stigting van die Randse Afrikaanse Universiteit, 1955-1968
Authors: Klee Juan
Published: February 2024

This article focuses on several factors that contributed to the establishment of the Rand Afrikaans University (RAU). It is argued that the RAU was not primarily founded as a result of the increase in the number of Afrikaners on the Rand, much less to serve as a countermeasure against the University of the Witwatersrand (Wits). The Afrikaner’s quest for an Afrikaans Christian National tertiary institution resulted in the establishment of the RAU, although it was not the main motivation for its development. Research, as discussed in this article, shows that the RAU primarily was established for the Afrikaner to enable themselves to become powerful role-players in the industrial heartland of South Africa. This article also points out that with the establishment of the RAU various obstacles had to be overcome, of which the National Party (NP) was prominent. RAU’s development, in many ways, represents the realisation of an Afrikaner Dream to sustain an Afrikaans University in the heartland of Johannesburg as economic centre, and to support the empowering of Afrikaners to fill leading roles in the economic and other sectors.
A critical historical review on protagonist and proactive environmental activism towards addressing acid mine drainage and remediation needs in some Gauteng goldfields
Authors: Van Eeden Elize S.
Published: February 2024

Sedert 2006 is Jan Publiek toenemend meer bewus gemaak van degraderende omgewings en ontoeganklike omgewingsverslae aangaande die degraderende omgewingstatus van die eertydse Verre Wesrand-gebied. As goudmyngebied het die Verre WesRand vir baie jare internasionale aansien geniet, en is dit steeds ‘n streek wat nasionaal en plaaslik as onontbeerlik geag word vir die goudmynbedrywighede aldaar. Omgewingsverslae het egter die vermoede van omgewingsbesoedeling (asook die gevaar van sommige impakte op mens en omgewing) uitgewys. Vandaar dat omgewingsaktivisme in die verre Wesrand, veral onder leiding van die Federasie vir ‘n Volhoubare Omgewing (FSE), en onder direkte aanvoering van hoofdirekteur Mariette Liefferink, meer aktief betrokke geraak het. Leiding is vanaf veral 2007 geneem om gemeenskappe sowel as die regering bewus te maak van die goudmynbedryf se verwringde omgewingserfporsie aan huidige en toekomstige geslagte. Hierdie bewusmakende benaderingsvorm van leiding neem, het aanvanklik op ‘n protagonistiese wyse geskied. Enersyds is vereis dat die besoedelaarbetaal-beginsel gevolg moet word, wat inhou dat die besoedelaar ook ’n verantwoordelikheid teenoor die individuele gemeenskapslid het wat grond (en moontlik selfs gesondheid) moes inboet tot voordeel van goudmynontwikkeling. Verskeie redes bestaan vir die aanvaarding van ‘n proaktiewe omgewingsaktivistiese benadering tesame met ‘n protagonistiese ondertoon. Beide benaderings vorm deel van die bespreking. Steeds voortgesette omgewingsongeregtighede teen 2010 in die vorm van suur mynwater verspillings, bemoeilik hierdie tweeledige benadering in omgewingsaktivisme ten opsigte van die Verre Wesrand. Aktiewe prosesse tot remediëring vir die rekening van die goudmyne en ‘n ewe verantwoordelike regering blyk die vernaamste doelwit te wees in omgewingsaktivistiese bedrywighede rakende die Verre Wesrand. In hierdie opsig ondersteun die FSE die samewerking van meerdere kundigheid en rolspelers wat deurslaggewend is vir vooruitsigte op enige langtermyn sukses. Teen die agtergrond van omgewingsbesoedeling, en ingesluit ‘n proaktiewe benadering van hoe om dit te hanteer, het “asemteue” van ‘n “positiewe” omgewingsgerigtheid ook in akademiese kringe posgevat waaroor in die toekoms waarskynlik meer geskryf sal word, en waarby baanbrekerswerk ten opsigte van omgewingsaktivisme in die Verre Wesrand ‘n verbintenis in benadering mag vind. Of ‘n nog stewiger proaktiewe wending in omgewingsaktivisme die kalf van suur mynwater uit die spreekwoordelike put gaan trek, behoort die geskiedenis van die Verre Wesrand in jare vorentoe uit te wys.
Factors influencing the acceptance and use of a South African online bank
Authors: Gertze Lizandré , Petersen Fazlyn
Published: February 2024

Background: Online banking gained prominence during the coronavirus disease 2019 (COVID-19) pandemic as an alternative to traditional banking. However, limited studies have explored online banking acceptance in South Africa.Objectives: This study investigates the factors that influence online banking acceptance among South Africans in a context where use is limited.Method: Thematic content analysis examined 113 Google user reviews from South Africans using an exclusive online bank. Unified Theory of Acceptance and Use of Technology 3 (UTAUT3) was used as a theoretical framework, analysing factors such as performance expectancy (PE), effort expectancy (EE), facilitating conditions (FC), hedonic motivation (HM), price value (PV), trust, perceived risk (PR), habit, and social influence.Results: Seven UTAUT3 constructs influenced online banking acceptance and use in South Africa during the pandemic: PE, EE, FC, HM, PV, trust, and PR. The influence of habit and social influence was not evident.Conclusion: Understanding factors influencing online banking acceptance in South Africa is crucial for policymakers and institutions. Addressing information communication technology challenges can enhance accessibility and benefits, promoting financial inclusion, and empowerment.Contribution: This research fills the gap by examining online banking acceptance in South Africa. Findings inform interventions and policies to improve access and adoption. Practical implications extend to institutions and policymakers, fostering financial inclusion.
Body mass index’s effect on CRSwNP extends to pathological endotype and recurrence
Authors: Chen W , Bai Y , Fang P , Chen J , Wang X , Li Y , Luo X , Chen J , Xiao Z , Iyer R , Shan F , Yuan T , Wu M , Huang X , Fang D , Yang Q , Zhang Y
Published: February 2024

BACKGROUND: Elevated body mass index (BMI) has been recognized as an important contributor to corticosteroid insensitivity in chronic rhinosinusitis with nasal polyps (CRSwNP). We aimed to delineate the effects of elevated BMI on immunological endotype and recurrence in CRSwNP individuals. METHODOLOGYy: A total of 325 patients with CRSwNP undergoing FESS were recruited and stratified by BMI. H&E staining was employed for histological evaluation. Characteristics of inflammatory patterns were identified by immunohistochemical staining. The predictive factors for recurrence were determined and evaluated by multivariable logistic regression analysis and the receiver operating characteristic (ROC) curves across all subjects and by weight group. RESULTS: In all patients with CRSwNP, 26.15% subjects were classified as overweight/obese group across BMI categories and exhibited a higher symptom burden. The upregulated eosinophil/neutrophil-dominant cellular endotype and amplified type 2/ type 3 coexisting inflammation was present in overweight/obese compared to underweight/normal weight controls. Additionally, a higher recurrent proportion was shown in overweight/obese patients than that in underweight/normal weight cohorts. Multivariable logistic regression analysis identified BMI as an independent predictor for recurrence. The predictive capacity of each conventional parameter (tissue eosinophil and CLCs count, and blood eosinophil percentage) alone or in combination was poor in overweight/obese subjects. CONCLUSIONS: Overweight/obese CRSwNP stands for a unique phenotype and endotype. Conventional parameters predicting recurrence are compromised in overweight/obese CRSwNP, and there is an urgent need for novel biomarkers that predict recurrence for these patients.
Uvodnik – stoletnica maloazijske katastrofe
Authors: Kavčič Jerneja
Published: February 2024

Pričujoča številka je nastala ob obletnici dogodkov, ki so globoko zaznamovali moderno grško zgodovino in kulturo, to je stoti obletnici maloazijske katastrofe. Poimenovanje Grki danes uporabljajo za niz dogodkov, vključno z grško-turško vojno po koncu prve svetovne vojne, ki je sledila poskusu grške vojske, da bi dokončno uresničila »veliko idejo«; ali sanje Grkov, ki so obvladovale njihovo politično življenje tako rekoč od nastanka moderne grške države na začetku 19. st., da bi se namreč pod okriljem moderne grške države združila vsa ozemlja, ki so jih od antike dalje naseljevali Grki. To pa je vključevalo tudi obsežna področja Male Azije. Kljub prvotnim grškim uspehom je poskus naletel na nesrečen konec, strahovit poraz, ki so ga grški vojski zadali Turki, ena od posledic pa je bila tako imenovana izmenjava prebivalstva. V skladu z Lozansko pogodbo iz leta 1923 so namreč pravoslavno prebivalstvo iz Male Azije preselili v matično domovino (Grčijo), muslimanske prebivalce iz Grčije pa v Turčijo. Pričujoča številka torej sovpada s stoto obletnico tega sporazuma.