bluuebunny/crossref_metadata_2025 huggingface dataset:
Roda de Conversa Meninas do IFG – Campus Itumbiara
Authors: Franzão Juliana Moraes , Oliveira Luciene Correia Santos de , Costa Renistenes Eunice da , Figueredo Anna Cláudia de Oliveira
Published: December 2020

Este artigo apresenta um relato de experiência de um projeto de ensino realizado com meninas adolescentes, alunas do Instituto Federal de Goiás - Campus Itumbiara. A metodologia utilizada para realização dos grupos foi a roda de conversa, com o intuito de proporcionar um espaço de interação discussão sobre cuidados relacionados à saúde física e mental, temáticas de gênero, empoderamento feminino e diversos temas que envolvem o adolescer. Realizando essas rodas de conversa, colaboramos com os objetivos do Instituto Federal de Goiás em proporcionar educação pública, gratuita e de qualidade na formação técnica integrada ao nível médio, em uma proposta interdisciplinar que busca correlacionar conteúdos e disciplinas além de dialogar sobre temáticas de interesse do público adolescente.
Espaços alternativos de educação para o trabalho
Authors: Teixeira Ana Maria Freitas , Oliveira Ilzimar Gloria Ferreira
Published: December 2020

O texto tem como objetivo tratar da oferta de educação profissional pelo terceiro setor a partir de resultados de pesquisa realizada junto a duas Organizações não Governamentais (Ong’s) localizadas na periferia da cidade do Salvador, capital da Bahia. A reflexão proposta considera que paralelamente a existência de uma rede federal estruturada em torno dessa modalidade educativa que, inclusive, conta com reconhecimento e prestigio é possível identificar a existência de uma outra ‘rede’ que direciona sua oferta de formação para o trabalho à uma população jovem caracterizada pela situação de vulnerabilidade. Se por um lado o perfil dos jovens atendidos distingue essas duas redes, por outro lado a oferta de formação para o trabalho é um ponto de convergência entre elas, apesar de todas suas especificidades. Essas especificidades, no entanto, não impedem que esses dois universos se confrontem com a questão da formação e da prática pedagógica de seus docentes e instrutores quando se trata de lidar com as interfaces entre educação e trabalho em situações de aprendizagem que envolvem as juventudes. Para tratar desses aspectos foram realizadas entrevistas narrativas com os responsáveis pelos cursos oferecidos pelas Ong’s pesquisadas.
Identifying blue swimming crab (Portunus pelagicus) stocks with truss network analysis approach in Indonesian Fisheries Management Area 712
Authors: Afifah Nurhaya , Zairion Zairion , Maduppa Hawis H , Hakim Agus A , Wardiatno Yusli
Published: December 2020

Exploitation rate of the blue swimming crab (BSC) in Indonesian Fisheries Management Area (FMA) 712 is over-optimum level in 2016. Stocks concern in sustainable management is needed as an effort to maintain its availability. The objective of this study is to identify the stock unit of BSC based on Truss Network Analysis (TNA) of morphometric characters in FMA 712. The BSC was collect in five different locations, i.e. East Lampung, Lancang Island, Cirebon, Rembang, and Southern Madura. Measurements on TNA were carried out at 14 landmark points with 29 characters in carapace to analyze its morphometric characters. The cluster analysis showed that TNA method revealed two stocks units of BSC in FMA 712. The first stock was the BSC population of Southern Madura, and the other stock was the other four population. The longest Euclidean distance was found at Southern Madura indicating similarity level with other populations was low. The discriminant analysis demonstrated the different result. There were three group populations, which every population in one group were able to represent the other population, namely Lancang Island-Cirebon, East Lampung-Rembang, and Southern Madura. Regarding to this study, it is recommended to manage BSC in Southern Madura separately.
Evaluation of Cross-Section and Wing Length in Free Vibration Analysis of Aircraft Wings
Authors: EVRAN Savaş , KURT Mustafa , KURT Arzu
Published: December 2020

This study presents the numerical free vibration analysis of aircraft wings created using different airfoil cross sections such as NACA 0009, NACA 2424, and NACA 4415. Aircraft wings were made of different lengths. Numerical frequency analyses were conducted Taguchi L9 orthogonal array with two control factors including three levels and so nine numerical modal analyses were performed. Airfoil cross sections and lengths of aircraft wings were used as the first and the second control factors. To detect the control factors with optimal levels, analysis of signal-to-noise (S/N) ratio was employed. In addition, analysis of variance (ANOVA) at the 95 % confidence level was implemented to carry out percent contributions of airfoil cross sections and lengths of aircraft wings on free vibration. As can be summarized from this study, the maximum free vibration behavior was obtained using aircraft wings profiled NACA 2424 wing lengths with 5 in meter. Also, the most dominant control factors were found to be airfoil type with 85.21 % effect and wing length with 12.87 % effect, according to ANOVA.
Franco Perrelli (2020). Kaj Munk e i suoi doppi
Authors: Ciaravolo Massimo
Published: December 2020

Review of Perrelli, F. (2020). Kaj Munk e i suoi doppi. Bari: Edizioni di Pagina, 330 pp.
Horos from Naxos with Pupillary apotimema
Authors: Savo Maria Barbara
Published: December 2020

The horos was reported to Hiller von Gaertringer in June 1930 by Franz Gabriel Welter, engaged in excavations during the 1920s in the areas of Hyria and Livadi (Naxos). The document is remarkable for the definition of the concept of apotimema, the estimated value of properties given as security for the lease of property of a subject protected by the eponymous archon (orphans, widows and epikleroi). In this specific case, we have a pupillary apotimema: lands and the house, with the tiled roof, valued and placed as apotimema for the goods capitalised by the epitropos of Epiphron’s children. The capital loaned is 3,500 drachmas and the children would have obtained 400 drachmas as annual interest. Among the land pledged to guarantee the sum, the possessions in the localities of Elaious and Melanes are also mentioned, the latter’s toponym still in use for the village that is located in the north-central area of the island of Nassia.
Memorial from Delphi for Archon of Pella
Authors: Pizzoli Lorenzo
Published: December 2020

The Delphic monument dedicated to Archon, general of Alexander, bears three inscriptions. The epigram b (prior to 333 B.C.) celebrates Archon’s victories in the Pythian and Isthmic agons. The decree c (333-332 B.C.) grants Archon and his family a series of privileges. The epigram a, following Archon’s death (321 B.C.), serves as a dedication of the statues of Archon’s family members, now lost. The inscriptions confirm what is already known from ancient historiography (his association with Alexander), and provide otherwise unknown information (family ties, his participation in pan-Hellenic games, relations with the city of Delphi).
A Brief History of the Theory and Practice of Computational Literary Criticism (1963-2020)
Authors: Beausang Chris
Published: December 2020

This paper will construct a history of computational literary criticism (CLS) which has engaged statistical methods by providing an historical account of the journal articles as well as other publications which have advanced the field to the most significant extent since 1963. This paper divides the history of CLS into three distinct epochs, within each of which the methods and theories CLS scholars utilise undergo significant qualitative transformation. The decisive factor in each of these epochs is CLS’ relationship to traditional literary criticism. Partly as a result of this, CLS scholarship initially cleaves to organic theories of literary style and adopts a highly polemicised opposition to then-regnant post-structuralist theories of authorship.
Digital Public History Inside and Outside the Box
Authors: Salvatori Enrica
Published: December 2020

The relationship between history and information technology is long and troubled. Many projects have opened and closed, many pioneering initiatives have achieved success and attention, but often they have not ‘taught’ or left a fruitful legacy. These experiments, studies and conferences have built a rich basis for the relationship between the disciplines, but the difficult connection needs to be further explored. Although no digital history research centres exist in Italy nowadays, it is possible to look at several Italian projects in order to discuss the strange position of the digital issue within public history conferences, the place of history in the large digital humanities environment and finally the definition itself of digital history.
CAUSES AND EFFECTS OF THE PROTAGONIST’S WORRY IN DANIELLE STEEL’S NOVEL FAMILY TIES
Authors: Ikhsan Muhammad , Ekalestari Susi
Published: December 2020

This research analyses the causes and effects of the protagonist’s worry in Danielle Steel’s novel Family Ties,  a story of woman, Annie Ferguson, who must become a mother in her bachelorette. She always worries about the future of her sister’s children. This research applied the theory of worry proposed by Graham (2006), who said that worry is “prominent feature of most anxiety-based disorders including generalized anxiety disorder, specific phobias obsessive-compulsive disorder, panic disorder, and post-traumatic stress disorder“. The research is completed by using descriptive qualitative method in which the finding is presented in the form of description. The data of this study is obtained from the novel Family Ties by Danielle Steel.  The analysis finds that the dominant causes of the protagonist’s worry come from her nephews’ life which affects her life negatively. The effects of her worry will be a lesson for human life because every human being certainly has worry feeling in their life in certain situations.
Poseer (¿y leer?) libros de civilidad en el siglo XVIII: un análisis a través de las bibliotecas privadas
Authors: Bolufer Peruga Mónica
Published: December 2020

Este artículo explora la presencia en las bibliotecas privadas españolas del siglo XVIII de la literatura de urbanidad, considerada en un sentido amplio, que incluye no solo los manuales de civilidad propiamente dichos, sino también ensayos, periódicos, obras de educación, filosofía moral, medicina, ficción o viajes en las que la reflexión sobre las costumbres y las pautas de vida civilizadas constituyó un eje importante. Aunque poseer libros no equivale a leerlos, el análisis de una veintena de inventarios y catálogos, complementados en ciertos casos con notas y recomendaciones de lectura, proporciona ciertos indicios sobre el papel que la civilidad ocupó en las preocupaciones de hombres y mujeres de la época (desde eruditos a nobles, gentes de letras y ciencias, artistas, funcionarios y comerciantes) y sobre la circulación europea de los modelos civiles.
Requirements for the Content of Spiritual and Moral Education: Classical Approach
Authors: Solovtsova Irina Afanasyevna
Published: December 2020

The paper aims to reveal peculiarities of spiritual and moral education conditioned by its essential characteristics and associated with specificity of the modern sociocultural and educational situation. Relying on the classical approach, the author identifies value foundations of spiritual and moral education, describes principles for choosing the content of spiritual and moral education in accordance with requirements of the standards. Scientific originality of the study involves identifying peculiarities of spiritual and moral education conditioned by its value and meaningful nature and represented through its content. The conducted research allows concluding that spiritual and moral education includes two aspects - external (cultural phenomena students get acquainted with) and internal (values students should adopt). The research findings are as follows: the author ascertains the basic principles and requirements for choosing the content of spiritual and moral education (value-based orientation, conformity to nature, cultural conformity, dialogism).
Ebelik Öğrencilerinin Premenstrual Sendrom Yaşama Sıklığı İle Algıladıkları Stres Düzeyi Arasındaki İlişkinin Belirlenmesi
Authors: ÇEVİK Ayseren , ALAN Sultan
Published: December 2020

Amaç: Bu çalışma, ebelik öğrencilerinin premenstrual sendrom yaşama sıklığı ile algıladıkları stres düzeyi arasındaki ilişkiyi belirlemek amacıyla yapılmıştır.Yöntem: Çalışma, 17-21 Şubat 2020 tarihleri arasında, Çukurova Üniversitesi Sağlık Bilimleri Fakültesi Ebelik Bölümü’nde 2., 3. ve 4. sınıfta öğrenim gören 151 öğrenci ile yapılmıştır. Veriler, araştırmacılar tarafından literatür doğrultusunda hazırlanan 20 soruluk tanıtıcı bilgi formu, Premenstrual Sendrom Ölçeği ve Algılanan Stres Ölçeği ile toplanmıştır. Veri analizinde, SPSS 22 paket programı kullanılmıştır.Bulgular: Çalışmaya katılan ebelik öğrencilerinin %76,2’sinin PMS yaşadığı belirlenmiştir. Öğrencilerin en sık yaşadığı semptom depresif semptomlar olurken, en seyrek yaşadığı semptom ise ağrı semptomları olmuştur. Öğrencilerin Algılanan Stres Ölçeği toplam puan ortalamasının 34,19±5,87 olduğu belirlenmiştir. Premenstrual sendrom yaşama sıklığı ile algılanan stres düzeyi arasındaki ilişkiyi belirlemek amacıyla yapılan korelasyon analizi sonucunda, premenstrual sendrom yaşama sıklığı ile algılanan stres düzeyi arasında pozitif yönlü bir ilişki bulunmuştur. Sonuç ve Öneriler: Ebelik öğrencilerinin premenstrual sendrom yaşama sıklığı arttıkça algıladıkları stres düzeyleri artmaktadır. Öğrencilerin bu dönem daha rahat geçirebilmesi için; duş alma, sıcak uygulama, zihni rahatlatıcı teknikler, sosyal destek ve aktivite, dinlenme, sağlıklı beslenme, egzersiz vb. gibi uygulamalar önerilmektedir.
Deficiencia de hierro en mujeres universitarias en edad reproductiva en la Facultad de Medicina, Uruguay
Authors: Grille Sofía , Lorenzo Mariana , Acosta Soledad , Acosta Nadia , Correa Sharon , Corral Mercedes , Quintanilla Cinthya , Ragone Romina , Guillermo Cecilia
Published: December 2020

Introducción: Los trastornos del metabolismo del hierro son condiciones patológicas muy frecuentes. La deficiencia de hierro, con o sin anemia, se estima que afecta a más de 2 billones de personas.

El objetivo de este estudio fue determinar la prevalencia de deficiencia de hierro y anemia y los factores predisponentes en un grupo de mujeres premenopáusicas, estudiantes universitarias de la Facultad de Medicina de la Universidad de la República en Uruguay.

Métodos: Se realizó un estudio observacional de corte transversal donde se incluyeron mujeres en edad reproductiva estudiantes universitarias de la Facultad de Medicina. Se les realizó una entrevista con el objetivo de recabar los datos clínicos y se registró el volumen menstrual mensual a través de un pictograma. Se realizó un hemograma y se determinaron los niveles de ferritina.

Resultados: Se incluyeron 196 mujeres de 18 a 37 años. La prevalencia de ferropenia fue 8.7% (n=17) y la prevalencia de anemia fue de 2.1% (n=4). La presencia de ferropenia se asoció a un menor consumo de carne roja (p=0.024), a un mayor volumen menstrual (p=0.018) y a una mayor frecuencia de sangrado uterino anormal (p=0,019).

Conclusión: Este estudio pone de manifiesto la frecuencia elevada de deficiencia de hierro en mujeres sanas en relación con sangrado uterino anormal y bajo consumo de carne roja, lo que plantea la necesidad de implementar programas que promuevan medidas educativas a fin de promover la consulta precoz y evitar la anemia y ferropenia en estas mujeres en edad reproductiva.
El principio del fin: Las vacunas contra Sars-Cov-2
Authors: Pizzi Hugo Luis
Published: December 2020

Editorial Revista de la Facultad Ciencias Médicas de Córdoba 77 (4) 2020.
Sustainability model of Vietnamese women entrepreneurship
Authors: AISDL
Published: December 2020

The purpose of this research was to propose a sustainability model of Vietnamese women entrepreneurs. The study addresses questions concerning factors that trigger decisions by Vietnamese women to start a business or transition from employee to ownership status; identifies obstacles encountered because of societal prejudice and government policies; and examines the factors associated with business success. To investigate these research questions, a mixed methods approach was adopted. For the qualitative phase of the study, 30 Vietnamese women entrepreneurs were interviewed. Thematic analysis performed on interview data revealed that Vietnamese women entrepreneurs face social prejudice regarding their business expertise, that the Vietnamese government is not effectively communicating its support to these women, and that its policies are too vague.
Strategi Memasuki Pasar Internasional
Authors: Agustin Devi Aprilina
Published: December 2020

Memasuki pasar internasional memiliki macam-macam strategi dalam menerapkan strategi tersebut terdapat kelebihan dan kekurangannya
A Psychological Account of the Unique Decline in Anti-Gay Attitudes
Authors: Kumar Victor , Kodipady Aditi , Young Liane
Published: December 2020

Anti-gay attitudes have declined in the U.S. The magnitude, speed, and demographic scope of this change have been impressive especially in comparison with prejudice against other marginalized groups. We develop a philosophically-informed psychological account of the unique decline in anti-gay bias in the context of important cultural and political conditions. We highlight two key psychological mechanisms: interpersonal connection and social category classification. First, many people have discovered that a close friend, family member, or admired individual is gay, motivating them to identify the harm and discrimination faced by the individual they know, and catalyzing moral consistency reasoning such that they generalize this interpersonal insight to strangers. Second, many people have taken an essentialist stance toward social categories, including sexual orientation, leading them to infer that being gay is genetically determined and not subject to free choice or moral responsibility, nor mutable and worth attempting to change. We contrast this with the relationship between essentialism and attitudes toward women and people of color, and provide an account of the difference. This psychological account has implications for the future decline of anti-gay attitudes, in the U.S. and other countries, along with the nascent decline of anti-trans attitudes.
Teacher's Perception of Continuous Assessment System at Basic Level
Authors: Rai Chandra Badana
Published: December 2020

The continuous assessment system (CAS) has been recognized as an integral part of everyday classroom instruction at the basic level of education. This study aims to explore the teachers' perceptions towards continuous assessment systems at the basic level. It was designed in a qualitative model and using a semi-structured interview schedule. For Participants, six basic level school teachers were selected purposely from three selected schools in Kathmandu district. The interviews covered socio-demographic data, perceptions towards CAS, teaching styles, and personal experience using CAS, and challenges towards using CAS. An inductive analysis was used to allow for the patterns and themes to emerge. The finding of the study showed that most of the teachers were positive and only a few had negative perceptions towards the CAS along with its tools like portfolio, project work, and homework. Lack of CAS training for teachers, insufficient materials, resources, and infrastructures also seems to be a great challenge to the teachers. This study revealed the necessity to conduct CAS training to the basic level teachers and provide sufficient materials for the effective use of CAS at the basic level.
Maps Showing Sinixt Territory, 1811–46
Authors: Hart E. Richard
Published: December 2020

It is increasingly important to identify the aboriginal boundaries between the time of first European contact and British sovereignty. A number of maps bearing on the location of the Sinixt Tribe’s aboriginal territory of the Arrow Lakes Tribe (sn’ʕay’ckstx or Sinixt) were drafted between 1811 (date of first contact) and 1846 (date of regional sovereignty as a result of the Treaty of Oregon). These maps demonstrate that European interlopers into Sinixt territory during that period gradually became more and more aware of the extent of Sinixt territory, influence, and trading capacity until 1846, when Sinixt territory was very well known in Canada, the United States, and Europe.
The Use of Near-Field Scanning Optical Microscopy for Failure Analysis of ULSI Circuits
Authors: Cramer R.M. , Balk L.J. , Chin R. , Boylan R. , Kämmer S.B. , Reineke F.J. , Utlaut M.
Published: December 2020

As minimum feature sizes decrease for ultra large scale integration, deleterious effects of smallest defects become increasingly important. In order to detect, measure and analyze these defects in buried structures, complementary techniques to those presently used must be developed and explored. Conventional optical microscopy techniques such as UV, confocal and laser scanning are approaching their fundamental limits of resolution. The near-field scanning optical microscope (NSOM) offers sufficiently high spatial resolution (50 nm), and an excellent signal-to-noise ratio to image buried structures inside optically transparent media. In order to investigate defects in layers below the surface of completed devices, we have developed a special sample preparation technique and have demonstrated optical resolution at the 50 nm level. In addition, we have explored the interaction in the image formation of a mixture of near and far field contributions. We show how useful buried layer information may be obtained via NSOM and demonstrate the present limitations of the technique. We compare our results to those obtained by conventional optical microscopy techniques.
Contamination Diagnosis Using Contamination-Defect-Fault (CDF) Simulation
Authors: Khare J. , Maly W.
Published: December 2020

This paper describes a simulation-based approach to contamination diagnosis. The methodology is based on the contamination-defect fault (CDF) simulator CODEF. CODEF is able to derive circuit-level faults resulting from contamination deposited on an IC cell during fabrication by simulating the manufacturing process flow. The application of CODEF in contamination diagnosis is illustrated with several examples.
Failure Analysis From Back Side of Die
Authors: Wu N.M. , Weaver K. , Lin J.H.
Published: December 2020

With increasing complexity of circuit layout on the die and special packages in which the die are flipped over, failure analysis on the die front side, sometimes, can not solve the problems or is not possible by opening the front side of the package to expose the die front side. This paper discusses fault isolation techniques and procedures used on the back side of the die. The two major back side techniques, back side emission microscopy and back side OBIC (Optical Beam Induced Current), are introduced and applied to solve real problems in failure analysis. A back side decapsulation technique and procedure are also introduced. Last, several examples are given. The results indicated that the success in finding root cause of failure is greatly increased when these techniques are used in addition to the traditional front side analysis approaches.
Temperature Profiling with Highest Spatial and Temperature Resolution by Means of Scanning Thermal Microscopy (SThM)
Authors: Fiege G. M. , Cramer R. M. , Balk L. , Reineke F.
Published: December 2020

As smallest feature sizes approach the 150 nm regime, the spatial resolution of a temperature measurement technique must be within the same range in order to resolve temperature distributions of single structures. In this work we present a system which has the capability to measure millikelvin temperature distributions while enabling a spatial resolution in the nanometer regime. The probe consists of a bent platinum wire which acts as a resistive probe. The probe is scanned over the sample in an SFM contact mode. The probe resistance changes caused by variations in the sample surface temperature are measured and recorded simultaneously with the topography data, thus producing two-dimensional temperature profiles. We have achieved a temperature resolution of 50 mK and a spatial resolution of less than 500 nm on passivated samples.
A Simple, Cost Effective, and Very Sensitive Alternative for Photon Emission Spectroscopy
Authors: Rasras M. , De Wolf I. , Groeseneken G. , Maes H. E. , Vanhaeverbeke S. , De Pauw P.
Published: December 2020

A new, simple and cost effective photo emission microscope (PEM) for continuous wavelength measurement is proposed (SPEMMI: Spectroscopic Photo Emission Microscope). The new system uses only one sensitive detector (GENIII-NIR) for both conventional failure detection and spectral analysis. The spectrometer and the mechanical parts, used to build up the SPEMMI, are presented. Also the required calibration procedures are discussed. To demonstrate the functionality of the new system, spectra of hot carriers in a saturated NMOS transistor and of a diode in forward and reverse biased conditions are discussed. In addition, the application of SPEMMI for determination of failures that occur in industrial IoDQ-failed VLSI chips is illustrated.
A Selected Area Planar TEM (SAPTEM) Sample Preparation Procedure for Failure Analysis of Integrated Circuits
Authors: Subramanian S. , Schani P. , Widener E. , Liston P. , Moss J. , Soorholtz V.
Published: December 2020

A selected area planar TEM (SAPTEM) sample preparation technique for failure analysis of integrated circuits using a transmission electron microscope has been developed. The technique employs a combination of mechanical grinding, selective wet/dry chemical etching (if required) and a two step focused ion beam IIFIB) milling. The mechanical grinding steps include: (a) a backside grind to achieve a die thickness less than 30 µm, (b) the support half ring glue, and (c) a cross-section grind from one side to reach less than 35 pm to the failing site. A selective wet or dry chemical etch is applied before, between,, or after FIB thinning depending on the nature of problem and device components. The FIB milling steps involve: (is) a high ion current cross-sectional cut to reach as close as 5-8 µm to the area of interest (b) a final planar thinning with the ion beam parallel to the surface of the die. The plan view procedure offers unique geometric advantage over the cross-section method for failure analysis of problems that are limited to silicon or certain layers of the device. Iln the cross-sectional approach, a thin section (thickness less than 250 µm) of a device is available for failure analysis, whereas in the planar procedure a 20 µm2 area of any layer (thickness less than 250 µm) of the device is available. The above advantage has been successfully exploited to identify and solve the following prablems in fast static random access memories (FSRAM): (i) random gateoxide rupture that resulted in single bit failures, (ii) random dislocations from the buried contact trenching that caused single bit failures and general silicon defectivity (e.g. implant damage and spacer edge defects), and (iii) interracial reactions.
Basic Physics in Color-Coded EOS Metallization Failures (Differentiating between EOS and ESD)
Authors: Henry Leo G. , Mazur J.H.
Published: December 2020

The task of differentiating precisely between EOS and ESD failures continues to be a challenging one for Failure Analysis Engineers. Electrical OverStress (EOS) failures on the die surface (burnt/fused metallization) of an IC can be characterized mainly by the discoloration at the site of the failures. This is in direct contrast to the lack of discoloration characteristic of ESD failures, which occur almost exclusively below the die surface (oxide and junction failures). To aid in this distinction, this paper attempts to present the underlying physics behind the discoloration produced in the EOS failures. For the EOS failures, the metal fuses due to the longer pulse widths (sec to msec), while for the ESD failures, the silicon melts because of the shorter pulse widths (< < 500 nsec) and higher energy. After EOS, the aluminum surface becomes dark and rough and the oxide in the surrounding area becomes deformed and distorted, resulting in the discoloration observed in the light microscope. This EOS discoloration could be due to one or more of the following: 1) morphological and structural changes at the metal/glass interface and the glass itself; 2) changes in the thickness and scattering behavior of the glass and metal in the failed areas.
A Hermetic Package Internal Water Vapor Paradox: Nonconforming Product That Does Not Fail
Authors: Lowry Robert K.
Published: December 2020

Corrosion in hermetically sealed electronic devices is a well-known failure mechanism that can occur when moisture in a sealed cavity condenses and destroys metallization by chemical or galvanic action. Early military standards imposed a 5000 part per million by volume (ppmv) limit on internal water vapor (IWV) in hermetic parts measured by mass spectrometry. In a recent product lot IWV non-conformance, 15 of 37 product lots and 56 of 369 units were nonconforming, with IWV ranging from 5000 to 32,000 ppmv. Root cause was outgassing from a non-robust die adhesive. Functionality of non-conforming units was investigated. Of 149 units selected from non-conforming product lots and lifetested under both static and 17.7V bias conditions at 2°C (assuring condensate in non-conforming units) for 2000 hours, none failed functionally. Subsequent analysis of 27 of these units found 17 exceeding 5000 ppmv IWV with one unit as high as 90,000 ppmv IWV. Despite the certainty of condensate internally during life tests, all units maintained functionality. Units were further investigated by internal visual inspection, glass integrity testing of die passivation, and SIMS analysis of internal surfaces for ionic impurities. The units passed all inspections and were free of any ionic impurities detectable to the few ppm level by SIMS. IWV is clearly a necessary precursor to, but not a sufficient condition for, corrosion failure. This paper discusses these results and proposes an alternative IWV criterion for product assurance.
Investigations of Leakage Paths in Sub-0.35μm DRAM Products Using Advanced Focused Ion Beam Techniques
Authors: Lorenz H. , Engel C.
Published: December 2020

Due to the continuously decreasing cell size of DRAMs and concomitantly diminishing thickness of some insulating layers new failure mechanisms appear which until now had no significance for the cell function. For example high resistance leakage paths between closely spaced conductors can lead to retention problems. These are hard to detect by electrical characterization in a memory tester because the involved currents are in the range of pA. To analyze these failures we exploit the very sensitive passive voltage contrast of the Focused Ion Beam Microscope (FIB). The voltage contrast can further be enhanced by in-situ FIB preparations to obtain detailed information about the failure mechanism. The first part of this paper describes a method to detect a leakage path between a borderless contact on n-diffusion and an adjacent floating gate by passive voltage contrast achieved after FIB circuit modification. In the second part we will demonstrate the localization of a DRAM trench dielectric breakdown. In this case the FIB passive voltage contrast technique is not limited to the localization of the failing trench. We can also obtain the depth of the leakage path by selective insitu etching with XeF2 stopped immediately after a voltage contrast change.
Application of EMS Analysis to Failure in Cell Area of Memory Device
Authors: Nukumizu T. , Sato J. , Furuya H. , Namba H. , Kikuch T.
Published: December 2020

EMS analysis is widely used in the failure analysis of the semiconductor. Moreover, the availability is widely evaluated. However, EMS analysis is not often used for the defect (1 Bit failure, Word Line failure, Bit Line failure, etc.) in the cell area in the memory device, because information on Fail Bit Map can be facilitated. Recently, make minutely advancing, and it is impossible to detect the defective cause only by Fail Bit Map information. We found the effectiveness as follows by the use of EMS analysis for a defective sample with Fail Bit Map information to solve such a problem. It leads to shortening analysis TAT because a defective part can be specified. Moreover, because the SHORT/OPEN mode can be divided, it is useful for the presumption of a defective mode. Furthermore, it is effective also to the confirmation of the presence of the redundancy and the confirmation of Fail Bit Map. Thus, because the application of EMS analysis for the defect in the cell area of the memory device is very effective to detect a defective cause, I want to recommend it by all means.
FIB Micro-Surgery on Flip-Chips from the Backside
Authors: Lee Raymond , Antoniou Nicholas
Published: December 2020

The increasing use of flip-chip packaging is challenging the ability of conventional Focused Ion Beam (FIB) systems to perform even the most basic device modification and debug work. The inability to access the front side of the circuit has severely reduced the usefulness of traditional micro-surgery. Advancements in FIB technology and its application now allow access to the circuitry from the backside through the bulk silicon. In order to overcome the problem of imaging through thick silicon, a microscope with Infra Red (IR) capability has been integrated into the FIB system. Navigation can now be achieved using the IR microscope in conjunction with CAD. The integration of a laser interferometer stage enables blind navigation and milling with sub-micron accuracy. To optimize the process, some sample preparation is recommended. Thinning the sample to a thickness of about 100 µm to 200 µm is ideal. Once the sample is thinned, it is then dated in the FIB and the area of interest is identified using the IR microscope. A large hole is milled using the FIB to remove most of the silicon covering the area of interest. At this point the application is very similar to more traditional FIB usage since there is a small amount of silicon to be removed in order to expose a node, cut it or reconnect it. The main differences from front-side applications are that the material being milled is conductive silicon (instead of dielectric) and its feature-less and therefore invisible to a scanned ion beam. In this paper we discuss in detail the method of back-side micro-surgery and its electron device performance. Failure Analysis (FA) is another area that has been severely limited by flip-chip packaging. Localized thinning of the bulk silicon using FIB technology offers access to diagnosing failures in flip-chip assembled parts.
Quantitative E-beam Probe for Valid High-Speed Measurements
Authors: Salling C. T.
Published: December 2020

This paper presents the results of a study to assess the timing measurement capabilities of e-beam probes and how they compare to mechanical probes in terms of sampling time, accuracy, and repeatability. Analysis of the data indicates that the transient response of mechanical probes is prone to overshoot and ringing, which contributes significantly to measurement error and uncertainty. E-beam probes, on the other hand, are subject to charging effects and interference which, as the authors show, can be effectively eliminated, facilitating high-speed timing measurements accurate to within a few picoseconds.
Sample Preparation for Backside Failure Analysis Using Infrared Photoemission Microscopy
Authors: Trigg Alastair , Loh Peak Yong
Published: December 2020

For conventional photoemission microscopy the silicon is thinned to a few tens of micrometres for backside imaging since silicon is opaque in the visble part of the spectrum. However, at wavelengths greater than approximately 1050 nm, most silicon is effectively transparent. Hence, the use of an infrared photoemission microscope (IRPEM) operating at wavelengths of 1100 to 2500 nm, usually eliminates the need for thinning, except where the silicon is heavily doped. However, the plastic encapsulation of packaged devices must be removed and the die surface polished. A polishing system has been evaluated and optimised for this purpose. Surface roughness (Ra) of 1 nm or better was obtained. Representative applications are shown and discussed.
Selective Au-Etching on Aged GaAs-Based Devices
Authors: Vanzi M. , Bonfiglio A. , Salaris P. , Deplano P. , Trogu E.F. , Serpe A. , Salmini G. , De Palo R.
Published: December 2020

A specific problem in failure analysis of InGaAs/ AlGaAs laser diodes asked for a deprocessing tool able to selectively etch gold from a Ti/Pt/Au triple metal layer. Attempts made by the usual I2/KI etch confirmed the damage that it causes to the crystal stack, and non-uniform attack of gold. A new etch, indicated as Epta-Methyl-bis-diodine, has been successfully employed. Careful time control and detailed characterization of the complex metallization pattern of the devices allowed not only to properly expose the Pt layer, but also to preserve the overall electrical connection, thus maintaining the capability of both measuring the electrical characteristics at low current injection and collecting the EBIC signal from the etched device.
Evacuated FM08 Fuses Carry a Sustained Arc in a Bus over 75 VDC
Authors: Leidecker H. , Slonaker J.
Published: December 2020

The FM08 style fuse is specified to interrupt an overcurrent of up to 300 A in a bus of up to 125 VDC, but this applies only when its barrel is filled with air. When placed into a space-grade vacuum, the FM08 style fuse exhausts its air within a year. Then, the probability of an enduring arc is high for all ratings when the bus is above 75 VDC, and the overcurrent is large. The arc endures until something else interrupts the current. The fuse can violently eject metal vapor or other material during the sustained arcing. The evacuated FM08 does not develop a sustained arc when interrupted in a bus of 38 VDC or less, at least when there is little inductance in the circuit. This is consistent with its successful use in many spacecraft having buses in the range 24 to 36 volts.
Reliability Test Results for Pt FIB Interconnect Structures
Authors: Zaragoza Michael
Published: December 2020

The reliability of FIB deposited Pt structures is assessed through lifetesting of product die and through stress testing of via-intensive test structures. Data is also presented for Pt resistance monitors collected over a 21 month period aimed at assessing the stability of the FIB deposition process. Two product types were subjected to HTOL and HTSS conditions at 125°C followed by temperature cycling. The test structures were stressed at different combinations of temperature ranging from 100°C to 140°C and with currents up to 5 mA. Neither product type experienced any FIB related failures whereas the test structure saw 70% fallout due to degradation of the Pt material within the vias. Temperature cycling did not precipitate any failures. The Pt resistance monitor data showed that film resistance increases with film thickness indicating the incorporation of organic byproducts from the deposition process.
Focused Ion Beam Induced Effects on MOS Transistor Parameters
Authors: Campbell Ann N. , Tangyunyong Paiboon , Jessing Jeffrey R. , Hembree Charles E. , Fleetwood Daniel M. , Swanson Scot E. , Soden Jerry M. , Antoniou Nicholas , Vanderlinde William E. , Abramo Marsha T.
Published: December 2020

We report on recent studies of the effects of 50 keV focused ion beam (FIB) exposure on MOS transistors. We demonstrate that the changes in transistor parameters (such as threshold voltage, Vt) are essentially the same for exposure to a Ga+ ion beam at 30 and 50 keV under the same exposure conditions. We characterize the effects of FIB exposure on test transistors fabricated in both 0.5 μm and 0.225 μm technologies from two different vendors. We report on the effectiveness of overlying metal layers in screening MOS transistors from FIB-induced damage and examine the importance of ion dose rate and the physical dimensions of the exposed area.
Relay Failures Specific to Space Applications
Authors: Teverovsky Alexander
Published: December 2020

Low-pressure conditions, as experienced in space applications, are considered benign for many electronic components. However, for switching devices the probability of failure may be significantly greater than at normal atmospheric pressure due to arcing-at-break processes. This study was stimulated by a relay failure in a 60-V power bus in a spacecraft module, and it was intended to analyze failure modes and the probability of their occurring under lowpressure conditions. The effects of gas pressure, power bus voltage, and load current on arc duration and probability of arc flashover have been investigated. It was shown that arc duration mostly depends on switching power and gas pressure, significantly increasing when power is rising and pressure is decreasing. Failure analysis indicated two major mechanisms in low-pressure conditions: (1) contact damage (excessive erosion and/or microwelding) and (2) arc flashover to a grounded case and/or grounded coil post. For a relay operating in a vacuum, the effect of leak rate on the time to failure at low-pressure conditions is discussed.
Characterization of Gold Embrittlement in Solder Joints
Authors: Bunis Carl B.
Published: December 2020

Mechanical strength, integrity, and reliability of solder connections used in the microelectronics industry are important factors in overall quality and reliability of the finished product. In most cases tin (Sn) rich solders are attached to a base metal plated with nickel (Ni) and then with gold (Au). Formation of AuSn4 intermetallics in the solder may result in loss of more than 80% of the initial impact toughness, resulting in loss of reliability of the connection. Gold (Au) embrittlement is a major concern in tin/lead (Sn/Pb) soldering or any other joining process with Au and Sn as major constituents. Noncompliance to Au plating-thickness specifications by vendors or insufficient Sn wicking of Au surfaces can result in embrittled joints and unreliable parts.
Die Backside FIB Preparation for Identification and Characterization of Metal Voids
Authors: Campbell Ann N. , Filter William F. , Antoniou Nicholas
Published: December 2020

Both the increased complexity of integrated circuits, resulting in six or more levels of integration, and the increasing use of flip-chip packaging have driven the development of integrated circuit (IC) failure analysis tools that can be applied to the backside of the chip. Among these new approaches are focused ion beam (FIB) tools and processes for performing chip edits/repairs from the die backside. This paper describes the use of backside FIB for a failure analysis application rather than for chip repair. Specifically, we used FIB technology to prepare an IC for inspection of voided metal interconnects (“lines”) and vias. Conventional FIB milling was combined with a superenhanced gas assisted milling process that uses XeF2 for rapid removal of large volumes of bulk silicon. This combined approach allowed removal of the TiW underlayer from a large number of M1 lines simultaneously, enabling rapid localization and plan view imaging of voids in lines and vias with backscattered electron (BSE) imaging in a scanning electron microscope (SEM). Sequential cross sections of individual voided vias enabled us to develop a 3D reconstruction of these voids. This information clarified how the voids were formed, helping us identify the IC process steps that needed to be changed.
Identification of Subtle Isb Failure Mechanisms
Authors: Wang N. , Zou R. , Wu J. , Daniel S. , Stevenson W.
Published: December 2020

Reliability of low standby current (Isb) CMOS circuits is impacted by extremely small non-fault resistive defects which, without compromising logic functionality or timing specifications, cause Isb currents well in excess of device specifications. A primary cause of high Isb, identified through failure analysis, is due to Crystal Originated Pits (COPs) defects, whereat thin oxide is more prone to electrical breakdown.
BGA and Advanced Package Wire to Wire Bonding for Backside Emission Microscopy
Authors: Colvin Jim B.
Published: December 2020

A new method of preparation will be shown which allows traditional fixturing such as test heads and probe stations to be utilized in a normal test mode. No inverted boards cabled to a tester are needed since the die remains in its original package and is polished and rebonded to a new package carrier with the polished side facing upward. A simple pin reassignment is all that is needed to correct the reverse wire sequence after wire to wire bonding or wire to frame bonding in the new package frame. The resulting orientation eliminates many of the problems of backside microscopy since the resulting package orientation is now frontside. The low profile as a result of this technique allows short working distance objectives such as immersion lenses to be used across the die surface. Test equipment can be used in conjunction with analytical tools such as the emission microscope or focused ion beam due to the upright orientation of the polished backside silicon. The relationship between silicon thickness and transmission for various wavelengths of light will be shown. This preparation technique is applicable to advanced packaging methods and has the potential to become part of future assembly processes.
Measurement of Interfacial Adhesion and its Degradation in Multi-Layer Packages, Devices, and Blanket Films Using the Laser Spallation Technique
Authors: Gupta Vijay , Hernandez Robert , Dias Rajen , Atluri Vasudeva , Raiser George , Mello Mike , Skoglund Lars , Zimmerman Paul
Published: December 2020

A laser spallation technique to measure the tensile strength of thin film interfaces is introduced. In this technique, a laser-generated stress wave of nanosecond duration in the substrate spalls off (completely removes) a coating deposited on the substrate’s front surface. The threshold laser energy is converted into the tensile stress (strength) at the failure site (usually the interface) by using an optical interferometer. Because of the ultra-short duration of the stress wave loading, all plastic deformation processes that usually accompany the coating decohesion event are suppressed such that the measured value can be regarded as fundamental or intrinsic to the material system (including the defects, if any). Application of this technique to test planar as well geometrically heterogeneous interfaces in IC’s, substrates, and packages is demonstrated. The technique is used to quantify the degrading effects of moisture and in-situ temperature rise on the tensile strength of a polyimide/Si3N4/Si interface system whose strength was systematically degraded by exposing the samples to controlled humidity (50-70% RH) conditions for varying duration (12-96 hrs) and temperatures (30°C-150°C). These measurements of strength degradation can now be used to predict device reliability from a fundamental standpoint in conjunction with simulations capable of predicting time-dependent stress concentrations, moisture accumulation, and temperature rise at critical interfaces during processing and service environment in actual systems.
New FIB-Supported Approach for Wire-Bondpad Characterization
Authors: Jacob Peter , Nicoletti Giovanni
Published: December 2020

Bond pad characterization is usually performed by mechanical cross-sectioning as well as pull and shear tests. However, since all these methods apply mechanical forces to the bond pad, artifacts may result. Focused Ion Beam (FIB) characterization is a mechanically stress-free characterization method, which allows more accurate conclusions regarding the intermetallic behaviour of the bonding area. Some new approaches presented here show how to improve the FIB characterization procedure and to combine it with classical characterization methods.