(Invited) Unseeded Growth of Poly-Crystalline Ge with (111) Surface Orientation on Insulator by Pulsed Green Laser Annealing
Authors: Horita Masahiro , Takao Toru , Nieda Yoshiaki , Ishikawa Yasuaki , Sasaki Nobuo , Uraoka Yukiharu 
Published: February 2020

Thin-film transistors (TFTs) with a high channel mobility for both electrons and holes are required for the three-dimension large scale integrations or system-on-panels. Lower temperature process is more favorable for TFT fabrication because the application of plastic substrate to system-on-panels is expected to add the flexibility function. Germanium (Ge) has higher hole and electron mobilities than Si, suggesting that large-grain poly-crystalline or single-crystalline Ge thin films lead to high channel mobility TFTs. This paper describes unseeded growth of poly-crystalline Ge with well-oriented large-size grains on insulator from amorphous Ge by scanning pulsed green laser annealing. In experimental, a 50-nm-thick amorphous Ge layer was deposited on a Si substrate with a 50-nm-thick SiO2 film. The Ge layer was patterned to narrow stripes of 2-µm-width. Then a capping layer of 650-nm-thick SiO2 was deposited. For this processed template, a scanning pulse green laser annealing was performed. Q-switch Nd:YAG laser beam with the following properties was used for annealing; a Gaussian line beam of 70 x 1400 µm2 at a laser wavelength of 532 nm, a pulse frequency of 7.5 kHz, a scanning velocity of 150 µm/s, and energy densities from 0.5 to 0.7 J/cm2. The Ge stripes were crystallized by a single scanning, where the beam was scanned perpendicular to the longitudinal direction of the beam. The Ge stripes crystallized at the optimum energy of 0.56 J/cm2 by the scanning pulsed laser annealing was characterized by electron back scattering diffraction patterns (EBSD). The EBSD mapping of normal direction to the sample surface indicates that the crystallized Ge film has (111) surface orientation in the 600 µm-long stripe. The (111) Ge crystal begins within only 2 µm after the starting point of the laser scanning. It was observed that the crystal orientation was recovered to (111) even if the prior part of crystalized Ge film was rotated from (111) surface. In the mapping of rolling direction, which corresponds to the laser scanning direction, two types of grains are dominant. One shows (101) and the other shows (112) for the laser scanning direction. From the normal direction and rolling direction images of EBSD, the Ge stripes were crystallized with the grains of 2 µm wide and ~10 µm long. The maximum grain length of 20 µm was also observed. Raman scattering was measured to evaluate the crystalline quality of the (111) surface-oriented Ge stripes. The full-width at half-maximum of 2.35 cm-1 shows good crystal quality of the film, which is smaller than the values of 3.2-3.3 cm-1 for the single crystalline Ge film obtained by lateral liquid-phase epitaxy from a Si seed. For laser fluence dependence, Ge stripes were not crystallized when the fluence was smaller than 0.56 J/cm2, and Ge stripes show non-oriented crystal with a long grain boundary in the center of stripe width when the fluence was larger than 0.67 J/cm2. Simulation analyses of thermal diffusion reveal the crystallization process. The pulse laser irradiation heats the Ge stripe and melts it. Simultaneously the underlying Si in the outside region of the Ge stripe patterns absorbs the laser energy and is also heated up. During the cooling period after each pulse a temperature gradient between the edge and the center is produced in the molten Ge stripe, because of suppression of cooling at the edge. Then the temperature at the center of the Ge stripe drops below the solid point first rather than the center. Crystal growth occurs from the center to the edges, resulting that random nucleation at the edge is suppressed and crystal growth proceeds with controlled orientation in the Ge stripe. This crystallization method is promising to realize high-mobility (111) Ge TFTs and easily extended to the glass or plastic substrate by making amorphous Si layer, which works as a laser absorbing layer, and SiO2, which works as a heat insulating layer, on the substrate.