bluuebunny/crossref_metadata_2025 huggingface dataset:
Negative-tone Photo-definable Polyimide with High Thermal Stability and Thick Film Processability
Authors: Araki Hitoshi , Kaneki Takayuki , Shoji Yu , Hibino Chika
Published: March 2024

High voltage power semiconductor requires higher polyimide insulation properties. We have designed a polyimide with high thermal stability, high light transparency and alkali dissolvable polyimide that is capable of passivating thick layer of polyimide with large topographys. A novel negavitve-tone photo-definable polyimide was formulated with cross linking reagent that can easily decompose during cure and a photo-initiator that initiates well during lithography. Our novel Negative photo sensitive polyimide, PSPI-1, has a patternable capability up to 16 mm thickness on silicon with 350 mj/cm2. PSPI-1 showed higher patternability than of the conventional polyimide. The cured film showed excellent properties as follows: 310C glass transition temperature (Tg), 500C 5% weight loss temperature, 40% elongation, no short observation during bias-HAST (130C. 96%, 100hr, 100V 15/30 mm line & space) and good adhesion to Si and Cu substrates. These results indicated a possibility for this novel PSPI-1 to be applicable for passivating power semiconductor.
High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications
Authors: Chernobryvko Mykola , Kaiser Michael P. , Murugesan Kavin Senthil , Kuylenstierna Dan , Köszegi Julia-Marie , Gernhardt Robert , Braun Tanja , Ndip Ivan , Schneider-Ramelow Martin
Published: March 2024

In this paper, a planar spiral resonator operating

at 13 GHz is investigated. The resonator was fabricated using

fan-out wafer level packaging (FoWLP) technology. The field

analysis highlights the importance of via fence. Two thick film resistors suppress an undesired resonance in proximity of

targeted one. The measurements demonstrate a very good correlation in comparison with full-wave simulations. The

measured Q-factor defined based on analysis of feedback

oscillatory system is about 48. The proposed configuration is

suitable for voltage-controlled oscillators (VCOs) with a

resonator realized in package.
Partial Discharge Characterization of Ceramic Power Electronics Circuit Carriers Assisted by Machine Learning
Authors: Drechsel Johannes , Barth Henry , Rebenklau Lars
Published: March 2024

This paper presents an approach for transferring knowledge about partial discharges in polymer insulators to ceramic insulators with the aid of machine learning. It is shown how various machine-learnable features can be generated from partial discharge measurement data and processed in varying artificial neural networks for classification. It is found that polymer-

based partial discharges can be classified using this

method. In addition, the Long Short-Term Memory based artificial neural network enables partial discharge cause finding

and thus fault detection in ceramic power electronics substrates.
Testing of Electromigration Resistance of Copper and Silver Thick Films
Authors: Hlina Jiri , Reboun Jan , Simonovsky Marek , Hamacek Ales
Published: March 2024

This paper is focused on the electromigration

resistance of copper and silver thick films. Electromigration was tested by water drop test. Four common conductive thick film

pastes were used for testing – silver paste with low platinum

content, and two silver pastes with different content of

palladium and copper paste. Electromigration was tested under voltage of 6 and 12 V and time to shortcut was measured. Results

of testing including the comparison of electromigration

resistance depending on thick film paste type and different electrode spacing are described in this paper.
Flip-Chip Interconnects Based on Single Metal-Coated Polymer Spheres
Authors: Huynh Van Long , Aasmundtveit Knut E. , Nguyen Hoang-Vu
Published: March 2024

In microelectronics packaging, minimizing thermomechanical

stresses is crucial to achieve high reliability. This

paper presents a novel approach for flip-chip interconnects,

utilizing individual metal-coated polymer spheres at a low bonding

temperature. The method involves selectively depositing individual

conductive particles onto a polydimethylsiloxane (PDMS) carrier

and then transferring the particles to electrical pads on substrate

using Ag sintering followed by die placement and introducing

underfill material. The deposition process achieved a high yield of 98.8% on the PDMS carrier, while the transferring process

resulted in well-defined ink dots with a yield of 96.2%. The sintered Ag formed good bonds between the particles and electrical pads,

leading to moderate interconnect resistance (as low as 0.57 Ω). This work has demonstrated the feasibility of interconnects based

on a single metal-coated polymer sphere with low thermomechanical

stress induced, thanks to the low bonding temperature (140 °C) and pressure (0.1 MPa) as well as the mechanical

compliance of polymer particles.
Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic Packages
Authors: Klengel Sandy , Klengel Robert , Stephan Tino
Published: March 2024

In micro- and power electronics reliability

limiting mechanical and (electro-) chemical processes are increasingly caused by the complex structure of the systems, the

material compositions and often heterogeneous mixtures of metals, polymers, and ceramics. Additionally, this causes challenging requirements for microstructural analyses and

reliability characterization of materials, interfaces, components,

and systems. Standardized metallographic routines are not

suitable for high resolution analyses of corrosion products and

mechanically sensitive systems. Focused ion beam preparation is limited in terms of dimension of the cross sectioned area.

Therefore, we developed new preparation concepts by complete water- and suspension free preparation methods using laser and

broad ion beam techniques. Two case studies for analyses of power electronic systems potted by inorganic materials and

embedded SiC dies show the great potential of these methods for following microstructural analyses.
Interconnect Stress Testing as a Tool for Assessment of Reliability of Modern PCBs
Authors: Koscielski Marek , Glinski Krzysztof , Ostaszewski Dariusz , Oklej Jan , Klej Tomasz , Cholaj Aneta , Steplewski Wojciech , Galinski Stefan , Borecki Janusz
Published: March 2024

The of miniaturization can be seen in electronics for some time already. The pinout of active components grows

enabling them to have additional functions. The trend in usage of System in a Package (SiP) solutions is also

evident thus routing of the active and passive elements became also challenging. To overcome this challenge boards with High Density Interconnection (HDI) where not only through hole, but also different kinds of microvias e.g. blind, buried, stacked, staggered via are used. The standard procedure to test reliability of boards and assemblies is very resource-hungry especially in time and money, as the tests have to be carried out in

climatic chambers which lasts for weeks, followed by additional destructive testing like cross-sections. On the other hand IST (Interconnect Stress Testing) is a quick test, that enables to have assessment of the used technology especially the quality of the through holes of all types. Although the coupons are destroyed during

the test, it is not necessary to test the manufactured circuits. This saves both materials and time. The technology

optimizations and the key findings will be presented within the paper.
Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application
Authors: Kotadia Hiren R. , Ahuir-Torres Juan Ignacio , Bhogaraju Sri Krishna , West Geoff , Elger Gordon
Published: March 2024

There has been a significant rise in interest from academic and industry communities on copper nano and

micro-particles-based sinter pastes for harsh environment die attach. However, sintering these particles is a complex process which is affected by many parameters, such as (i) particles size, shape, and distribution, (ii) sintering temperature, pressure, environment, and (iii) organic compounds used for the paste formulation. In literature, various research groups demonstrated that sintered copper

layer can achieve good electrical conductivity and high strength. In our previous research [1, 2], we explained that

microscale etched flakes are also capable of shear strength >30Mpa while sintering with 10 MPa bonding pressure at 275°C for just 1 minute with negligible paste cost (in comparison to silver paste). However, very limited knowledge exists on literature about corrosion behaviour in sintered copper

interconnects. This, from experience in the industry with

silver sintering has proven to be critical to applications. For

examples in high power LED headlamp applications, minor

exposure to residual Sulphur emerging from vulcanized

rubber seals has been observed to cause corrosion in silver sintered interconnects. Therefore, corrosion and its impact on

performance and reliability must be considered, especially for

safety critical applications. For this reason, we have studied the relationship between copper sintered samples and

corresponding corrosion behaviours and compared again to pure copper (conventionally produced). The corrosion resistance of the samples in salt water was assessed via various electrochemical analysis techniques and correlated with

sintered microstructure. Sample produced better corrosion

resistance when fabricated with higher density (less porosity). However, in case of the microscale copper flakes-based

interconnects, a pitting behaviour was observed. The sintered copper paste samples showed to be nobler than commercial

copper. In addition, copper oxide and its role in accelerating/preventing oxidation is also studied.
Thermal Design of Stacked Power Modules for Electric Drive Applications
Authors: Li Jianfeng , Du Yuekang , Wang Xingzhi , Liu Liangjie , Pang Yong , Liu Feixiang
Published: March 2024

This paper reports the thermal design of a stacked arrangement inserting four IGBT modules between five heat sinks to achieve good cooling performance while enabling them

to be installed into the limited space. Such stacked four IGBT modules can be used for a variable voltage converter (VVC), a three-phase motor inverter (M-INV) and a three-phase generator inverter (G-INV) of one electric control system in one

electric vehicle or hybrid electric vehicle. Work presented in this

paper are the thermally related structure design and thermalelectric

and computational fluid dynamics coupled simulation,

while the prototyping and thermal test of the stacked arrangement are still ongoing. The simulation results indicate that the stacked arrangement can be designed into a compact 121 mm × 94.7 mm × 90.8 mm structure while achieving the

maximum virtual junction temperature below 150°C under the

coolant feed temperature of 70°C, flow rate of 10 L/min and pressure drop of 0.16 bar for the VVC delivering 150 kW, the M-INV delivering 100 kW and the G-INV delivering 50 kW. If validated with the ongoing work, the stacked arrangement can

be employed to increase power density and improve electrical and thermal performance of the power modules in the electric control systems with multiple converters/inverters.
MEMS Mirror in Hermetic Package for Enhanced Performances
Authors: Maggi Luca , Del Sarto Marco , Maierna Amedeo , Shaw Mark , Carminati Roberto , Mendicino Gianluca , Rotta Davide , Chiesa Marco , Rodrigo Aina Serrano , Bogoni Antonella
Published: March 2024

Ceramic substrate coupled to metal lid has been selected for realizing hermetic package for MEMS mirror. The component passed the fine and gross leak tests and show good

performance with improved Q-factor.
Integration of Multi-Lithography Technologies for the Fabrication of Flexible Optical Link
Authors: Mistry Akash , Nieweglowski Krzysztof , Bock Karlheinz
Published: March 2024

The advancement in demand for high bandwidth energy-efficient communication in the data centre and edge cloud servers needs a viable optical interconnection solution to cope with the demands. Therefore, the presented study

describes the concept of flexible multi-mode waveguides (MMWGs) as an optical link for co-packaged optics. It evaluates three

lithography technologies; UV-lithography, 2 photon polymerization

direct laser writing process (2PP-DLW), and nano-imprint

lithography (NIL) for the fabrication of flexible MM-WGs. The UV-lithography and 2PP-DLW process were evaluated for the fabrication of MM-WGs and micro-mirrors, respectively, for the master pattern of the NIL stamp. The NIL evaluates the

imprinting of the MM-WGs with micro-mirrors at either end on the flexible and transparent PEN substrates with a low-loss OrmoClad lower cladding layer. There are five different crosssections from 10x10 μm2 to 50x50 μm2 of MM-WGs with micromirrors

were imprinted. Additionally, it presents the importance of integrating multi-lithography technologies to fabricate flexible

optical links where a 2PP-DLW process shows the best results for printing μm-scale optical components. On the other side, UV-lithography with SU-8 gives the foremost definition of the master for the polymeric MM-WGs. Furthermore, NIL offers the industrial mass-production option alongside prototyping.
Effect of Surface Microstructure on Joints Using Nanoporous Cu Sheet for Power Devices
Authors: Nishikawa Hiroshi , Park Byungho , Saito Mikiko , Mizuno Jun
Published: March 2024

Wide-bandgap (WBG) semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) are being

developed as promising replacements for Si-based semiconductors. The operating temperature of SiC

semiconductor is expected to be much higher. The replacement

of soldering with new bonding process has been needed for WBG semiconductor devices. We have proposed a solid-state bonding process using nanoporous metal sheet, as a die-attach bonding method for WBG semiconductor devices. In this study, the bonding process using nanoporous Cu sheet as an insert

metal was investigated to achieve a Cu disk/Cu disk bonding without solvent and flux. The shear strength of the joint using nanoporous Cu sheet at 350 and 300°C in formic acid

atmosphere exceeded the shear strength of conventional Pb–5Sn solder joints which was approximately 18 MPa.
From MEMS Strip to MEMS Unit: a Comprehensive Simulation Approach to Warpage
Authors: Ratti Andrea , Simoncini Daniele , Adolfo Annabel , Del Sarto Marco , Gritti Alex , Fedeli Patrick , Maggi Luca , Napolitano Teresa , Shaw Mark Andrew , Talledo Jefferson
Published: March 2024

The paper suggests a simulation flow methodology

suitable for MEMS package designers that can help R&D teams to develop industrially feasible products by achieving consistent

warpage prediction results, both at unit and strip levels. Striplevel-

wise, one of the most important findings of this activity is

the direct impact of raw material selection. Unit-level-wise, it allows checking a priori and in different conditions (inside the socket or mounted on a PCB for example) stress distribution on

different elements of the assembled MEMS unit.
Adhesion Copper/Molding Compound: Modeling and Characterization
Authors: Rovitto Marco , Zalaffi Samuele , Passagrilli Carlo , Villa Claudio Maria , Andena Luca , Mariani Stefano
Published: March 2024

Delamination at the resin-copper interface is fully

characterized during operative conditions by adopting a

combined experimental and numerical approach. Peeling and four-point bending fracture tests are used along with cohesive zone models to reach this purpose. The promising findings are beneficial to analyze the crack propagation at the interface during package-oriented reliability tests, and may therefore be

employed to enhance these interfaces in microelectronic plastic packages.
An Innovative Conformal Electronically Scanned Array Antenna for full 360° Steerability in the Ka-band
Authors: Uhlig Peter , Friedrich Aline , Krengel Markus , Simon Winfried , Litschke Oliver
Published: March 2024

A novel approach to constructing an

omnidirectional 5G/6G Ka-band Tx/Rx frontend module using

an Active Electronically Steerable Array (AESA) will be

presented. The 5G standard includes a number of mmWave

frequency bands that provide the bandwidth for high data rates. However, up to now 5G still transmits primarily in the sub-6 GHz frequency range. Small cells like micro or pico cells operated in the mmWave range are capable to increase network

capacity in densely populated areas. Efficient beam-based

communications using directional antenna arrays can overcome the limitations imposed by propagation loss at high frequencies.

These and a number of further requirements have been taken into account in the design of the antenna module presented here,

making it a fundamental component for the cellular infra—

structure of future 5G/6G mmWave networks. The dualpolarised module is using 2 x 96 elements to scan 360° in azimuth and ±45° in elevation. The operation frequency range is 24.25 GHz to 29.5 GHz, covering n258, n257, and n261 3GPP bands. Additionally, the module is capable to control up to four beams

simultaneously.
An Experimental Investigation of a Flexible Sintered Silver Joint for Micro-Joining Based on a Design of Experiments
Authors: Vivet Laurent , Benabou Lahouari , Simon Olivier
Published: March 2024

The increasing electrification of vehicles requires

the use of ever higher voltages and electrical power. The thermal stresses to which the assembly joints of electronic chips are subjected are becoming increasingly severe. As a result, thermal

stresses acting on the electronic assembly, and particularly on

the electrical interconnections, are becoming increasingly

severe. The objective of this study is to create, characterize and optimize the structure and properties of a porous silver sintered joint using the design of experiments (DoE) method. Joints

consisting of a porous network of silver particles are obtained, showing remarkable flexibility allowing for thermal stresses accommodation and having sufficient tensile strength to ensure a correct bonding of the components. Depending on the selected levels for the sintering process parameters, the microscopy analysis shows a transition of the mode of rupture from the silver layer to the intermetallic compounds forming at the interface with the substrate.
Hybrid Lithography Fabrication of Single Mode Optics for Signal Redistribution and Coupling
Authors: Weyers David , Nieweglowski Krzysztof , Bock Karlheinz
Published: March 2024

This paper describes advances in hybrid-lithography process, combining UV-lithography for planar, single mode redistribution

layer (RDL) and 2-photon- polymerization direct-laserwriting

(2PP-DLW) for micro-mirrors inside RDL-opening. Improvements

to multi-layer direct patterning of OrmoCore/-Clad

material system using UV- ithography and need for broadband

UV-LED source are presented. Near square core cross sections and smooth sidewalls are achieved. Openings in full stack with

steep sidewalls without residual layer are patterned. To optimize 2PP-DLW-process processing window for both OrmoComp and IP-DIP is thoroughly characterized. Roughness measurements

prove feasibility even of coarsely printed structure as reflective μ-mirror for 1550 nm wavelength. Finally these results are

applied to periscope probe for wafer-level-testing of edge emitting lasers and proof of concept is shown. Outlook to further research

on UV-lithography of multi-layer waveguide stack and alignment with μ-mirror printing is given.
Research of Chip Placement Accuracy for Fan-Out WLP using A Novel Self-Assembly Stage
Authors: Yamada Tadatomo , Takano Ken , Menjo Toshiaki , Takyu Shinya
Published: March 2024

This paper discusses the alignment accuracy after

self-assembly using a novel self- assembly method with a uniquely developed porous stage. In a preceding paper, we have introduced our process that combines tape expansion technology and self-assembly technology. By using this process and machine device, it is possible to significantly improve the throughput of pick and place process for FO-WLP.

Furthermore, it is indicated that our self-assembly method using the porous chuck stage enables achievement of high precision chip alignment and high throughput. In this study, two factors are evaluated to clarify the impact on the chip accuracy after self-assembly; 1) the influence of chip position before self-assembly, 2) the relationship between stage size of self-assembly area and chip size. As a result of evaluation, if the chip size is the same as the porous stage size, the alignment

accuracy after self-assembly is within 5 μm or less even with

varied chip positions before self-assembly. On the other hand,

when the porous stage size and chip size are different, the chip position before self-assembly has an impact on the alignment accuracy after self-assembly. Based on the results obtained in this study, further development of machine device and process will be pursued to improve the alignment accuracy after selfassembly.
20 μm Copper Micro-Bump Bonding Through a Silver Metallization for Advanced Packaging Under a Low Pressure Condition
Authors: Zhang Zheng , Hsieh Ming-Chun , Suetake Aiji , Yoshida Hiroshi , Okumuara Rieko , Kagami Noriko , Okamoto Kazamasa , Chen Chuantong , Hashizume Kei , Hasegawa Norihiko , Yoshida Ryuji , Homma Hidekazu , Suganuma Katsuaki
Published: March 2024

In this work, we proposed a copper (Cu) microbump

bonding strategy by using a silver (Ag) metallization layer

as an interconnect bridge. Si chips with 20 μm Cu-Ag bumps

were bonded under a low pressure (0.4 MPa) and atmospheric

conditions at 250 °C. By investigating the surface morphology

evolution of the Cu-Ag bump, it is found that severe surface

deformation caused by Ag abnormal grain growth and hillock generation plays a critical role in the Cu-Ag bump bonding, which facilitates the approach and bonding of top and bottom Ag surface of the bump structure. Moreover, this bonding strategy is expected to be particularly advantageous for finepitch interconnect applications. It not only mitigates the severe bonding condition requirements that are used in thermal

compression bonding and hybrid bonding, but also provides higher quality bonding structures for advanced packaging.
Ceramic Embedding of SiC-Semiconductor Using Cofiring Technology
Authors: Ziesche Steffen , Reinhardt Kathrin , Varghese Jobin , Manhica Birgit , Schletz Andreas
Published: March 2024

The presented work demonstrates our current state in

embedding of SiC power electronic dies using Ceramic Multilayer Technology. The novelty of the approach presented includes the cofiring of a semiconductor element with ceramic base material, which demands for a reduced sintering temperature of ceramics (using LTCC or ULTCC based ceramics) in combination with an

increased temperature stability of the semiconductor.
Chrysis fuscipennis or Chrysis angolensis? An answer with new synonymies, a new combination and species resurrected (Hymenoptera, Chrysididae)
Authors: Rosa Paolo
Published: March 2024

All species of the Chrysis angolensis group were synonymised with C. angolensis Radoszkovsky, 1881, excluding Chrysis diademata Mocsáry, 1889, endemic of the Philippines. However, after the study of type materials, four species are herein resurrected: Chrysis callaina Gribodo, 1884 stat. reviv., C. erratica Abeille de Perrin and du Buysson in du Buysson, 1887 stat. reviv., C. mossulensis Abeille de Perrin and du Buysson in du Buysson, 1887 stat. reviv., C. sulcifera Bischoff, 1910 stat. reviv. New synonymies are proposed for the following taxa: C. szalayana Mocsáry, 1912 n. syn. and C. ukerewensis Mocsáry, 1914, n. syn. of C. callaina Gribodo, 1884; Chrysis janthina Smith, 1874 n. syn. of C. brachyceras Bischoff, 1910. The new combination Praestochrysis brachyceras (Bischoff, 1910) n. comb. is proposed. Chrysis fuscipennis Brullé, 1846, the name in use for the oldest taxon described in the angolensis group, was replaced with Chrysis angolensis Radoszkovsky, 1881 because primary junior homonym of C. fuscipennis Dahlbom, 1829. However, Chrysis angolensis is here regarded as nomen dubium, C. fuscipennis Dahlbom, 1829 as nomen oblitum, because no longer in use as a valid name after 1899, and C. fuscipennis Brullé as nomen protectum, thus making the name C. fuscipennis Brullé, 1846 stat. reviv. available and restored.
Resilience in uniform: A review of Apartheid’s black military contribution
Authors: Moalamedi Mpho
Published: March 2024

No abstract available.
As Milky as It Can Get; Chyluria: A Case Report and Review of Literature
Authors: Mahapatra Debasish , Jha Vijoy Kumar , Nair Nithya
Published: March 2024

Filariasis is an important public health problem in India. Extralymphatic manifestation of filariasis includes chyluria or passage of intestinal lymph or chyle into urine imparting a milky-white color, is an important manifestation of renal involvement. A young woman residing in a filaria endemic region, presented with persistent chyluria of 3-month duration. She did not have any features of nephrotic or nephritic syndrome or features of connective tissue disease. After routine hematological, biochemical, serological, and urinalysis, nephrotic range proteinuria and lipiduria were confirmed, and kidney biopsy was performed. Kidney biopsy showed an elongated parasitic sheathed structure with multiple basophilic nuclei spread along the length of the tail, suggestive of microfilaria, in capillaries of a single glomerulus; immunofluorescence was negative for immunoglobulin (Ig) A, IgM, IgG, C3, C1q, kappa, and lambda. She was given antifilarial drug and chyluria promptly subsided. The complex evaluation and management of chyluria have been discussed.
A local-global conjugacy question arising from arithmetic dynamics
Authors: Goksel Vefa
Published: March 2024

In his earlier work, the author introduced a group theory question that arises in the study of iterated Galois groups of post-critically finite quadratic polynomials. In this paper, we prove the first non-trivial results on this question.
Singular Yamabe-type problems with an asymptotically flat metric
Authors: Bao Jiguang , Li Yimei , Wang Kun
Published: March 2024

In this paper, we study the asymptotic symmetry and local behavior of positive solutions at infinity to the equation

-L_{g}u = |x|^{\tau}u^{\frac{n+2+2\tau}{n-2}}

outside a bounded set in

\mathbb{R}^{n}

, where

n\geq 3

,

-2<\tau<0

, and

L_{g}

is the conformal Laplacian with asymptotically flat Riemannian metric

g

. We prove that the solution, at

\infty

, either converges to a fundamental solution of the Laplace operator on the Euclidean space, or is asymptotically close to a Fowler-type solution defined on

\mathbb{R}^{n}\setminus \{0\}

.
New hexachordal theorems in metric spaces with a probability measure
Authors: Andreatta Moreno , Guichaoua Corentin , Juillet Nicolas
Published: March 2024

The hexachordal theorem is an intriguing combinatorial property of the sets in

\Z/12\Z

, discovered and popularized by the musicologist Milton Babbitt (1916–2011). It has been given several explanations and partial generalizations. Here we enhance how this phenomenon can be understood by giving both a geometrical and a probabilistic perspective.
Niekonstytucyjność tzw. aborcji eugenicznej (embriopatologicznej). Schemat argumentacji Trybunału Konstytucyjnego w sprawie K 1/20
Authors: Łącki  , Wróblewski
Published: March 2024

The text aims at reconstructing the structure of the arguments of the Polish Constitutional Tribunal in the judgment of 22 October 2020, in which the so-called eugenic grounds for termination of pregnancy were held unconstitutional. The assumption of the presented considerations is the recognition that this judgment amounts to be a possible and natural development of jurisprudence regarding the disputed constitutional issue. The authors argue that the essential structural elements of the Tribunal’s reasoning (i.e. its two-stage nature consisting in examining the constitutional subjectivity of the nasciturus and carrying out the proportionality test) do not raise objections in the light of the method of resolving the constitutional problem adopted by the Constitutional Tribunal. In turn, the partial conclusions of these argumentation stages (i.e. recognition of the subjectivity of the nasciturus on the basis of Article 38 of the Constitution regulating the legal protection of life, as well as the recognition that the challenged regulation does not meet the proportionality test) are based on the existing doctrinal stipulations, and even more so on the existing jurisprudence of the Tribunal. The judgment is largely of an application nature in relation to the fundamental findings of the Constitutional Tribunal’s ruling of 28 May 1997, but these findings are embedded in other constitutional categories: the life of a nasciturus is not only recognized as a “constitutional value” detached from the subject, but as a good an entity who entitled to the constitutional right to legal protection of life. In turn, the decisions of the ordinary legislator as to the intensity and type of this protection must meet the requirements of proportionality test, taking into account the constitutional importance of the right to legal protection of life and its close connection with the protection of human dignity.
A Study on Factor Decomposition of Consumption Inequality in South Korea
Authors:   The Korean-Japanese Economics & Management Association, Kang Woo-Jin
Published: March 2024

Purpose: This study examines the determinants of household consumption expenditure and quantifies their contribution to within group inequality by gender of household head in South Korea.
Research design, data, and methodology: This study first decomposes total inequality into within and between inequality by gender of household head. It also examines the association between a vector of household demographic and socioeconomic characteristics and household consumption expenditure in an attempt to identify how much inequality can be attributed to each of explanatory factors. This study empirically draws upon the recent national representative dataset, Survey of Household Finance and Living Conditions (SFLC) 2 021 c ollected b y Korea Statistical Office.
Results: According to the present study, inequality in 2021 in South Korea was found to be mainly dominated by inequality within population sub groups. Examining the determinants of household consumption inequality, it shows that factors and their conributions are different between male and female headed households. For instance, whilst the type of job occupation of a head appears to have a large impact on inequality within male headed households, it is found to have marginal contribution compared to within female headed households (25.2% vs. 7.4%). In case of household demography, it is observed as the second largest factor increasing within inequality among female headed households (31.2%) whereas its contribution to inequality within inequality among male group was relatively small (18.6%).
Implications: Our study suggests that target specific investigation and deep structural understanding need to be made on the different characteristics of within inequality as reflected by the different role of factors and their contributions. Amongst, the different inequality impact of higher education might reflect that the expansion of higher education had a relatively lower impact on the living stand of female group than that of its counterpart, male group. Finally, the discriminatory barriers (e.g. job occupation) against female may reduce within inequality, it could widen total inequality, worsening distribution between male and female groups.
The Effects of ESG Management on Agency Costs: A Data Analysis of the KOSDAQ Market
Authors:   The Korean-Japanese Economics & Management Association, Oh Hee-Hwa
Published: March 2024

Purpose: The purpose of this study is to verify the effect of a company’s ESG management on agency costs. For this purpose, the dependent variables used in this study were the asset turnover variable representing the level of effort of the manager, the entertainment cost ratio representing the private consumption of the manager, the sales and management cost ratio, and the surplus cash flow ratio. If the company’s agency cost expenditure is affected by the influence of the company’s ESG management, the importance of the company’s ESG management is proved.
Research design, data, and methodology: As a result of the verification, it was confirmed that a company’s ESG management activities had a positive effect on the company’s asset turnover rate. These results indicate that the company’s active ESG management activities contribute to increasing the company’s asset turnover rate by properly controlling the discretion of the manager. Second, some valid results were derived from the result of selecting the entertainment cost ratio as a substitute for agent cost. On the other hand, significant results were not found in the sales cost, management cost, and surplus cash flow model.
Results: This research results are as follows. First, service orientation of salespeople was found to have a positive effect on customer’s economic value. Second, it was found that the customer orientation and service orientation of the salespeople had a positive effect on the psychological value, and sales orientation was found to have a negative effect on the psychological value. Third, it was found that economic value and psychological value had a positive effect on customer satisfaction.
Implications: In conclusion, it was partially confirmed that the KOSDAQ market is playing a positive role in the company’s management performance by properly controlling agent costs through ESG management activities. These results will serve as a basis for improving the company’s management performance by establishing a mechanism that can reduce agent costs within the company, and it is also believed that it will serve as a basis for policymakers to come up with a plan for the natural establishment of such a control system within the company.
ORGANIZATION OF ENTERPRISE EQUITIE’S ACCOUNTING IN THE MODERN CONDITIONS
Authors:   Pavlo Tychyna Uman State Pedagogical University, Berzhanir Inna
Published: March 2024

In the current conditions of development of the national economy, the issues of accounting and analysis of equity are of particular relevance, because its presence makes it possible to function effectively to business entities of all forms of ownership. The rational organization of accounting of equity is intended to provide for the peculiarities of formation of equity depending on the organizational and legal form of the enterprise, timely completion of tasks for its planning, control, management and provision of full legal and impartial information about equity at the minimum cost of means and labor.
THE ORETICAL AND PRACTICAL ASPECTS OF UKRAINIAN INSURANCE SYSTEM’S INCLUSIVE DEVELOPMENT IN THE CONTEXT OF EUROPEAN INTEGRATION
Authors:   Pavlo Tychyna Uman State Pedagogical University, Chvertko Liudmyla
Published: March 2024

A distinctive feature of a modern, highly developed society is the formation of an inclusive environment in all spheres of human activity. An inclusive environment provides free access to the benefits of civilization, and inclusion is rightly considered an effective tool for achieving sustainable economic growth.
NET INCOME RESERVES ASSESSMENT FOR THE UKRAINIAN INDUSTRY INVESTMENT AND INNOVATION POTENTIAL FORMATION
Authors:   Pavlo Tychyna Uman State Pedagogical University, Slatvinskyi Maksym , Biloshkurskyi Mykola ,   Pavlo Tychyna Uman State Pedagogical University
Published: March 2024

Regardless of the specifics of business, in market conditions, the result of financial efficiency of any enterprise is to obtain the maximum possible level of profit, taking into account the minimum level of costs incurred for the production and sale of products (goods, works, services), as well as the minimum use of production resources in compliance with the main goals of sustainable development. Guided by the objective criteria for the formation of financial efficiency, we consider profit maximisation as a prerequisite for intensifying investment and innovation activities, which is especially important for ensuring the sustainable development of an enterprise in a competitive environment
Partition Problems and a Pattern of Vertical Sums
Authors: Krinsky Eunice , Raianu Serban , Wittmond Alexander
Published: March 2024

We give a possible explanation for the mystery of a missing number in the statement of a problem that asks for the non-negative integers to be partitioned into three subsets. Based on a pattern of sums of certain elements in the three sets, we find a more standard solution to the problem, using only congruence modulo five. We also show that the original statement plays a special role among all statements that satisfy the same pattern of the sums.
Dilated Floor Functions That Commute Sometimes
Authors: Kulhanek Travis , McDonough Joseph , Ponomarenko Vadim
Published: March 2024

We explore the dilated floor function fa(x)= ⌊ax⌋ and its commutativity with functions of the same form. A previous paper found all a and b such that fa and fb commute for all real x. In this paper, we determine all x for which the functions commute for a particular choice of a and b. We calculate the proportion of the number line on which the functions commute. We determine bounds for how far away the functions can get from commuting. We solve this fully for integer a, b and partially for real a, b.
Presentations of Diagram Categories
Authors: Hu Mengwei
Published: March 2024

We describe the planar rook category, the rook category, the rook-Brauer category, and the Motzkin category in terms of generators and relations. We show that the morphism spaces of these categories have linear bases given by planar rook diagrams, rook diagrams, rook-Brauer diagrams, and Motzkin diagrams.
Semicomplete Arithmetic Sequences, Division of Hypercubes, and the Pell Constant
Authors: Hoelscher Zachary
Published: March 2024

In this paper we produce a few continuations of our previous work on partitions into fractions. Specifically, we study strictly increasing sequences of positive integers such that there are partitions for all natural numbers less than the floor of the sum of the first j terms divided by j, where j is greater than two. We also require that all summands be distinct terms drawn from this series of fractions. We call such sequences “semicomplete”. We find that there are only three semicomplete arithmetic sequences. We also study sequences that give the maximum number of pieces that an M dimensional hypercube can be cut into using N – 1 hyperplanes. We find that these are semicomplete in one, two, three, and four dimensions. As an aside, we use one of our generating functions to produce what appears to be a new identity for the Pell constant, a number which is closely connected to the density of solutions to the negative Pell equation.
Limiting Spectral Distributions of Families of Block Matrix Ensembles
Authors: Dunn Teresa , Fleischmann Henry , Jackson Faye , Khunger Simran , Miller Steven , Reifenberg Luke , Shashkov Alexander , Willis Stephen
Published: March 2024

We introduce a new matrix operation on a pair of matrices, sw(A,X), and discuss its implications on the limiting spectral distribution. In a special case, the resultant ensemble converges almost surely to the Rayleigh distribution. In proving this, we provide a novel combinatorial proof that the random matrix ensemble of circulant Hankel matrices converges almost surely to the Rayleigh distribution, using the method of moments.
Optimal Tilings of Bipartite Graphs Using Self-Assembling DNA
Authors: Redmon Eric , Mena Miles , Vesta Megan , Renzyl Cortes Alvi , Gernes Lauren , Merheb Simon , Soto Nick , Stimpert Chandler , Harsy Amanda
Published: March 2024

Motivated by the recent advancements in nanotechnology and the discovery of new laboratory techniques using the Watson-Crick complementary properties of DNA strands, formal graph theory has recently become useful in the study of self-assembling DNA complexes. Construction methods based on graph theory have resulted in significantly increased efficiency. We present the results of applying graph theoretical and linear algebra techniques for constructing crossed-prism graphs, crown graphs, book graphs, stacked book graphs, and helm graphs, along with kite, cricket, and moth graphs. In particular, we explore various design strategies for these graph families in two sets of laboratory constraints.
Generalizing the German Tank Problem
Authors: Anthony Lee  , Steven Miller
Published: March 2024

The German Tank Problem dates back to World War II when the Allies used a statistical approach to estimate the number of enemy tanks produced or on the field from observed serial numbers after battles. Assuming that the tanks are labeled consecutively starting from 1, if we observe k tanks from a total of N tanks with the maximum observed tank being m, then the best estimate for N is m(1 + 1/k) - 1. We refer to an estimate as "best" when the estimate is closest to the actual number of tanks. We explore many generalizations; first, we looked at the discrete and continuous one-dimensional case. We attempted to improve the original formula by using different estimators such as the second largest and Lth largest tank, and applied motivation from portfolio theory by seeing if a weighted average of different estimators would produce less variance; however, the original formula, using the largest tank proved to be the best; the continuous case was similar. Then, we looked at the discrete and continuous square and circle variants where we pick pairs instead of points, which were more complex as we dealt with problems in geometry and number theory, such as dealing with curvature issues in the circle, and the problem that not every number is representable as a sum of two squares. In some cases, when we could not derive precise formulas, we derived approximate formulas. For the discrete and continuous square, we tested various statistics, but found that the largest observed component of our pairs is the best statistic to look at; the scaling factor for both cases is (2k+1)/2k. For the circle we used  motivation from the equation of a circle; for the continuous case, we looked at the square root of X2+Y2 and for the discrete case, we looked at X2+Y2 and took a square root at the end to estimate for r. Interestingly, the scaling factors, a number, generally a little greater than 1, that we multiplied to scale up to get our estimation, were different for the cases. Lastly, we generalized the problem into L-dimensional squares and circles. The discrete and continuous square proved to be similar to the two-dimensional square problem. However, for the Lth dimensional circle, we had to use formulas for the volume of the L-ball, and had to approximate the number of lattice points inside it. The discrete circle formula was particularly interesting, as there was no L dependence in the formula.
On Prime Labelings of Uniform Cycle Snake Graphs
Authors: Bedi Agam , Ollis Matt , Ramesh Samiksha
Published: March 2024

A prime labeling of a graph of order n is an assignment of the integers 1, 2, ... , n to the vertices such that each pair of adjacent vertices has coprime labels. For positive integers m, k, q with k  ≥  3 and 1  ≤  q   ≤ ⌊k/2⌋ , the uniform cycle snake graph Cmk,q is constructed by taking a path with m edges and replacing each edge by a k-cycle by identifying two vertices at distance q in the cycle with the vertices of the original path edge. We construct prime labelings for Cmk,q for many pairs (k,q) and, in each case, all m. These include: all cases with k  ≤   9 or k = 11; all cases with q = 2 when k ≡ 3 (mod 4); all cases with q = 3 when k has the form 2a − 1, 3a + 1 or 3b + 3 for all a and all odd b; all cases with q = 4 when k is even; and all cases with q = k/2 when q is a prime congruent to 1 (mod 3).
The Impact of the Low Quality of Teachers on the Learning Process Results of School Accreditation in Manggarai Regency Indonesia
Authors: Tapung Marianus
Published: March 2024

In 2021, Manggarai Regency had 20 schools targeted for BAN S/M NTT accreditation. This accreditation process evaluates school services based on key components such as the quality of graduates, the learning process, teacher quality, and school management, utilizing 36 core assessment points. Our research centers on understanding the intricate relationship between teacher quality components and the learning process. Employing a cross-analysis and a concise descriptive approach, we identified both positive and negative impacts within each component, either directly or indirectly. Utilizing a descriptive-qualitative method, we scrutinized accreditation results documents and conducted cross-cutting analyses to discern these impacts. Our findings revealed a significant connection between the components of teacher quality and the learning process. Specifically, the subpar performance of teachers in points 22 and 21 directly influenced the students' activeness, ability, and skills during the learning process (as evident in points 12 and 15). The primary objective of this research is to delve into this relationship between accreditation components and offer strategic solutions to address the identified negative impacts. In adhering to the research objectives, we maintain brevity in presenting the methods and results, prioritizing a focused exploration of the relationship between teacher quality components and the learning process.
ANALYSIS OF THE EFFECT OF PRELIMINARY AND CYCLIC PLASTIC DEFORMATION ON THE CHEMICAL-THERMAL TREATMENT OF STRUCTURAL STEELS
Authors:   Belarusian National Technical University, KONSTANTINOV Valerij M. , LESHOK Vladislav A. ,   Belarusian National Technical University, SHTEMPEL Oleg P. ,   Euphrosyne Polotskaya State University of Polotsk
Published: March 2024

The subject of the study was thermodiffusion nitrided and silicified layers on steels obtained after plastic deformation. The influence of preliminary plastic deformation on the low-temperature nitriding process and cyclic plastic deformation on the high-temperature silicification process is studied. The results obtained are of interest for accelerating the production processes of chemical-thermal treatment of steels. It is established that preliminary surface plastic deformation contributes to the intensification of the process of ion-plasma nitriding of structural steel. The presence of high-temperature cyclic plastic deformation ensures the intensification of diffusion processes during the resorption of the diffusion silicified layer on structural steel.