bluuebunny/crossref_metadata_2025 huggingface dataset:
Landslide Mapping from the Cylcone Seroja in Kupang City Using Remote Sensing
Authors: Kati Meyendris Walu , Eluama Meirliany Anjelina Leonora , Ngana Frederika Rambu
Published: February 2024

On April 2-4, 2021, severe cyclone Seroja occurred in Kupang City, resulting in a landslide hazard. Landslide disaster management is essential for disaster mitigation. However, the susceptibility landslide map for the cyclone Seroja in Kupang City has not yet been done. In this paper, we map landslide locations using remote sensing. We used free remote sensing data. The data are Landsat 8 imagery, Digital Elevation Model (DEM), and rainfall. To create a landslide map in Kupang City, we overlaid three maps. Those are landcover, slope and rainfall maps. We created a landcover map using the Landsat 8 imagery. The landcover types were classified using the Supervised Classification method of Support Vector Machines (SVM) in the QGIS software. Each land cover type was determined based on training sites taken in the field using GPS. DEM was used to create a slope map. We used the accumulative rainfall data for three days to map the rainfall. For data validation, we took GPS points from the landslide locations. The study result shows a landslide map in Kupang City after cyclone Seroja. This work informs that remote sensing can be used to determine the location of landslides in inaccessible areas. Remote sensing can also be used to map landslide areas with a limited budget and limited data.
Review of the Physical Properties of CLC Lightweight Concrete Using the Addition of Red Sand from Labuhan Batu Selatan
Authors: Tampubolon Grecy Kristina , Harahap Mukti Hamjah , Putra Winsyah
Published: February 2024

This research aims to review the physical properties of Lightweight Cellular Concrete (CLC) bricks with the addition of Labuhan Batu Selatan red sand. CLC bricks have the advantage of being lightweight and larger in size, which can expedite the construction process. CLC bricks are made by adding air bubbles/foaming agents to the mortar mix as an expander to produce lightweight bricks with a lower material composition. It is crucial for the air bubbles to maintain their shape during the mortar curing process without causing any chemical reactions. In this study, lightweight bricks were made by experimenting with various combinations of red sand and river sand, with variations of 0% red sand and 100% red sand, using the Cellular Lightweight Concrete (CLC) method. The research method employed was experimental, testing the physical properties of CLC lightweight bricks, specifically density and compressive strength, in accordance with the SNI 03-6825-2002 standard. As a result, with the addition of red sand in the production of CLC lightweight bricks, the density falls within the lightweight brick category, but it does not significantly improve the compressive strength of the lightweight bricks. This is because the CaCO3 (calcium carbonate) content in the CLC lightweight brick mix has the highest intensity, causing the bricks to become brittle. Therefore, this research suggests paying more attention to the mixing and blending processes of the materials to achieve a more uniform distribution.
Advanced Bronchoscopic Diagnostic Techniques in Lung Cancer
Authors: Park Dongil
Published: February 2024

The increasing incidence of incidental pulmonary nodules necessitates effective biopsy techniques for accurate diagnosis and treatment planning. This paper reviews the widely used advanced bronchoscopic techniques, such as radial endobronchial ultrasound-guided transbronchial lung biopsy, electromagnetic navigation bronchoscopy, and the cutting-edge robotic-assisted bronchoscopy. In addition, the cryobiopsy technique, which can enhance diagnostic yield by combination with conventional biopsy tools, is described for application to peripheral pulmonary lesions and mediastinal lesions, respectively.
Granzyme F: Exhaustion Marker and Modulator of Chimeric Antigen Receptor T Cell–Mediated Cytotoxicity
Authors: Hay Zachary L Z , Kim Dale D , Cimons Jennifer M , Knapp Jennifer R , Kohler M Eric , Quansah Mary , Zúñiga Tiffany M , Camp Faye A , Fujita Mayumi , Wang Xiao-Jing , O’Connor Brian P , Slansky Jill E
Published: February 2024

Granzymes are a family of proteases used by CD8 T cells to mediate cytotoxicity and other less-defined activities. The substrate and mechanism of action of many granzymes are unknown, although they diverge among the family members. In this study, we show that mouse CD8+ tumor-infiltrating lymphocytes (TILs) express a unique array of granzymes relative to CD8 T cells outside the tumor microenvironment in multiple tumor models. Granzyme F was one of the most highly upregulated genes in TILs and was exclusively detected in PD1/TIM3 double-positive CD8 TILs. To determine the function of granzyme F and to improve the cytotoxic response to leukemia, we constructed chimeric Ag receptor T cells to overexpress a single granzyme, granzyme F or the better-characterized granzyme A or B. Using these doubly recombinant T cells, we demonstrated that granzyme F expression improved T cell–mediated cytotoxicity against target leukemia cells and induced a form of cell death other than chimeric Ag receptor T cells expressing only endogenous granzymes or exogenous granzyme A or B. However, increasing expression of granzyme F also had a detrimental impact on the viability of the host T cells, decreasing their persistence in circulation in vivo. These results suggest a unique role for granzyme F as a marker of terminally differentiated CD8 T cells with increased cytotoxicity, but also increased self-directed cytotoxicity, suggesting a potential mechanism for the end of the terminal exhaustion pathway.
Advanced Packaging: Enabling Moore’s Law’s Next Frontier Through Heterogeneous Integration
Authors: Swaminathan Raja
Published: February 2024

With chiplet architectures becoming mainstream, and recognized as fundamental to enabling the continued economically viable growth

of power efficient computing, advanced packaging technologies and architectures are becoming more critical to enabling Moore’s Law’s

next frontier through heterogeneous integration. In this tutorial, we will cover the advanced package architectures being enabled by

AMD to enable PPAC (power, performance, area and cost) improvements as well as enable heterogeneous architectures. The direct Cu-

Cu bonding technology used in AMD’s 3D VCache architecture will be detailed and compared to industry standard 3D architectures for

PPAC benefits. Other technologies that are being enabled to advance high performance computing architectures will also be previewed.
Liquid Metal Embedded Elastomers (LMEEs) as TIM1 with Highly Reliable & Extremely Low Thermal Resistance Performance
Authors: Kazem Navid , Singh Vivek , Marzolf Phil , Gelorme Jeff , Majidi Carmel
Published: February 2024

Thermal management issues in the semiconductor industry are driven by a sharp increase in power densities, and have created ever-growing concerns over the last decade. To resolve this concern, many attempts are being investigated in device packaging to extract the heat generated away and maintain the functionality of the device. Inside the package thermal interface materials (TIM1) play an important role in transferring the heat efficiently. Design of an optimum material for TIM1 has been an ongoing challenge due to problems associated with interfacial contact thermal resistance, optimized distribution of TIM over the die surface, pump-out and delamination. To accommodate some of these concerns, we introduce a TIM that has liquid metal embedded in elastomeric matrix (LMEE). This material has stretchable and adhesive properties to accommodate large deformation in the semiconductor packages and has shown superior reliability performance.

To address these growing thermal challenges, I will highlight performance of LMEEs as a TIM1 by making packaged microprocessors (TTV) and measuring Junction-to-Case thermal resistance (Rjc) at T0 and after HAST, Thermal Shock, Bake and reflow (5x) reliability tests. We show that Liquid Metal Embedded Elastomers (LMEE) material architecture for TIM1 can achieve Rjc < 7 C.mm2/W and maintain this thermal performance under reliability tests. Our current efforts are involved in formulating polymers with enhanced rheological and mechanical properties to demonstrate thermal performances approaching that of liquid metals.
Influence of Rigid Carrier Substrates & its Release Layer on Ultra Fine Pitch chip last FO-WLPs
Authors: Matsuura Yoshinori , Dutta Vivek B.
Published: February 2024

In recent years the leading-edge product enablers in Wireless Connectivity for WiFi & Bluetooth, Wearable HD Modules, Artificial Intelligence (AI), Application Processors etc. require ultra-high density chip packaging device using heterogenous integration to constructing the SiP modules. In order to meet their requirements, fan-out chip last WLP – having its redistribution layer (RDL) constructed first – is definitely the solution of choice to assemble devices in such advanced packaging platforms. This approach further eliminates known good die (KGD) loss risk, resulting in higher assembly yield and lower cost.

Rigid carrier substrate and the release layer placed on top of it influences the process yield of fan-out chip last WLP. It gets more challenging when ultra-fine pitch redistribution layers (RDL) are required. This paper focuses on the influence of release layer on quality of narrow line & space RDL, as well as on the separation force during debonding. It further describes an optimized solution through HRDP® (High Resolution Debondable Panel) technology, which is the most compatible carrier to fabricate the leading-edge fan-out chip last process. The HRDP® carrier is offered in various dimensions and thicknesses as round wafers and square/rectangular panels with glass or silicon to match customer requirements. This is made of 100% inorganic material, which helps to improve interfacial stresses and facilitates debonding. During processing, this inorganic release layer (IRL) demonstrates higher chemical resistance and heat resistance than alternative technology such as the laser lift-off (LLO) type carrier.
Advanced Test Technologies for Heterogeneous & 2.5D/3D Packaging
Authors: Hutner Marc , Butler Ken
Published: February 2024

Automotive, AI/ML and 5G markets are demanding increasing levels of integration with respect to memory and compute density. To meet the demand for high-performance products in mission-critical, high-bandwidth applications, the semiconductor industry must look for innovative technologies to continue scaling beyond the silicon manufacturing processes. This is often referred to as “More than Moore”, and one of the most promising methods is heterogenous integration of multiple dies inside the same package (System in Package, or SiP). These dies are typically referred to as chiplets and their interfaces are optimized to operate within a multi-die package for both power, drive strength, interface mechanics and ESD protection.

Heterogeneous packages at manufacturing test are faced with quality and reliability challenges due to the accessibility and visibility of traditional test approaches. Dies are assembled over the silicon interposer using very small micro-bumps which may suffer from latent defects such as voids or cracks, potentially posing a reliability risk to the assembled product. On organic substrates, rare resistive shorts, known as bridging shorts, can cause signal integrity and performance degradation. These types of latent defects, although rare, could cause a system failure over time if not screened out during final test or detected during in-field operation.

To address these challenges, proteanTecs and Advantest have deployed a joint solution at manufacturing test. proteanTecs provides a monitoring solution for heterogeneous packaging based on chip telemetry, combining deep data with machine learning algorithms. proteanTecs’ patent-protected solution is comprised of small-footprint, digital-only agents for monitoring the performance of the parallel interface. These agents (monitoring IP) are designed for analytics. The fact that they have a small footprint, allows them to be placed next to each pin inside the parallel die-to-die (D2D) PHY, to achieve 100% coverage and with no impact on the signal behavior, quality, or timing. proteanTecs’ data analytics platform then trains models that are deployed at test or in the field.

To achieve the highest levels of performance, proteanTecs has partnered with Advantest on the ACS Edge™ for real-time decision-making. ACS Edge™ is a high-performance, highly secure edge compute and analytics solution that enables ultra-fast algorithmic AI decision-making with millisecond latencies during test execution. It connects to the user’s test equipment via a private, high-speed encrypted link and uses the advanced container hub to run the user’s protected applications while protecting and keeping secure the user’s data and analytics. Another key piece of the ACS ecosystem is the ACS Solution Store which provides ease of access to ACS real-time data infrastructure solutions.

In this paper, we will provide details for the integrated solution and silicon results. We will highlight how the solution provides new levels of visibility for real-time adaptive testing.
Thin and Ultra-thin Sidewall Protected P-WLCSP
Authors: Hackler Doug , Prack Ed
Published: February 2024

Diversity in packaging for a strong supply chain requires higher performance and lower cost processes for new manufacturers. Six-side protected, aka “6S or fully protected”, CSP is an emerging and rapidly growing market. Fully protected CSP (without substrates or lead-frames) was first implemented with processes such as M-series and eWLB. These processes require costly and complex die reconstitution, expensive tapes, molding, and other operations most common to FO to obtain 6-side die protection. These steps can be eliminated in a wafer level process to provide high-performance low-cost P-WLCSP to enable new CSP manufacturing capability, Fan-In and Chiplets. American Semiconductor’s Semiconductor-on-Polymer (SoP) 300mm SoP-TM, a P-WLCSP process, is an advanced packaging process optimized for protected CSP, fan-in, and chiplets. Protected FI process innovations can improve performance in power devices, RF switches, photonic IC (PIC), die stacking, and thin board applications. This paper builds on the SoP-TM process development provided at the IMAPS Symposium earlier this year with the addition of first silicon data for electrical test chips. SoP-TM test chip features include 10um silicon thickness, metal interconnect and micro-bumps, smooth silicon sidewalls and 6-side polyimide encasement. Reliability data and testing is a key area of investigation for thin-device technology. Ultra-thin device reliability test methods under consideration for new NIST standards will be presented. Mechanical, high temperature and high humidity reliability for SoP-TM test chips, Chip-on-Flex (COF) and Flip Chip using the new test methods will be presented.
Using M-Series with Adaptive Patterning to shrink PCB systems into System-In-Packages
Authors: Locke Justin , Davis Robin
Published: February 2024

Traditional system-level design typically includes several Integrated Circuits (IC’s) that get individually packaged and implemented onto a Printed Circuit Board (PCB). This PCB includes the required support circuitry for the IC’s to complete the full system design. This architecture creates a system that is far larger and more power intensive than a single package. It also suffers from greater bandwidth and signal integrity limitations.

To counter these shortcomings, many companies are migrating away from PCB to System-in-Package (SiP) designs. In a SiP design, these chips are integrated into a single package along with all the supporting passive devices. The die of the package may be configured through vertical stacking or lateral interconnects to improve design density. For semiconductor companies that design both the IC’s and the system-level PCB, there is an emerging trend in which the existing PCB designs are reused and re-purposed to generate a new SiP design. This allows for companies to leverage known-good design data to create a smaller form factor, higher density package, while requiring fewer engineering design hours.

While the prominent solution for SiP designs has been laminate substrates, as the demand for further density scaling and heterogeneous integration grows, advanced packaging technologies are being leveraged. Using a fan-out RDL based solution can accommodate increased interconnect density and reduced layer count as compared to a laminate substrate. Deca’s Adaptive Patterning® technology ensures companies are able to manufacture fan-out wafer-level packages (FOWLP) with the highest possible yield.

This paper details the benefits of migrating from PCB to package level integration as well as how utilizing Adaptive Patterning® technology further benefits this migration with increased density and performance as compared to traditional packaging technology
Solutions for Low Cost, Near Hermetic Air Cavity Packages
Authors: Lynch Karen , Zyriek Don
Published: February 2024

The introduction of 5G networks includes both Macro Cell and Multiple-input, Multiple-output (MIMO) systems. Unique plastic air cavity solutions are available for both system types that address the continuous need for cost reduction while meeting high-frequency requirements. For today’s Air Cavity applications, expensive hermetic packaging is no longer required. Near hermetic, low-cost plastic packaging is replacing expensive ceramic packages and thus providing customers with reduced costs and faster time to market.

In the Macro Cell space GaN Power Amplifiers (PA) are ramping to high volume production in 5G networks. The use of a Plastic air cavity package along with a copper flange vs a CPC flange provides the lower costs than ceramic packages while delivering better performance compared to an overmolded solution. RJR provides the package sidewall that attaches to the flange. A lid composed of low-cost LCP (Liquid Crystal Polymer) attaches to the sidewall to complete the package assembly.

Today’s Plastic air cavity, medium power package solutions can meet the requirements of Multiple-input, Multiple-output (MIMO) antenna arrays used in the 5G network, to be able to deliver high data rates to multiple users in dense urban areas. The package solution consists of a matrix lid panel that is attached to a populated PCB substrate.

The packages described above are enabled with RJR proprietary B-stage epoxy. The use of the proper B-stage epoxy delivers a near-hermetic solution. The package assembly is completed by using a defined process technique that specifies time, temperature and pressure, that can utilize RJR’s Isothermal Seal Machines.

This paper will provide insight on the plastic air cavity packages available for 5G applications along with reliability data and information on multi chip laminate solutions with a matrix air cavity lid that aids in lower assembly costs.
Reliability Investigations in Printed Electronic Assemblies
Authors: Dasgupta Abhijit , Zhao Beihan
Published: February 2024

Aerosol-Jet Printing (AJP) technology is a popular additive manufacturing method for achieving complex net geometry with micron-level accuracy. This opens up new possibilities in fabrication of electronic assemblies in 3D curvilinear form factors.

Therefore, it is vital to understand not only the performance of AJP printed electronics, but also their reliability under different kinds of life-cycle operational and environmental

stresses.

Electrochemical migration (ECM) under temperature-humidity-bias (THB) conditions can lead to dendritic growth, which can cause dielectric breakdown, leakage current, and

unexpected short circuit. ECM propensity and life prediction models for THB conditions were studied for AJP printed coupons based on silver-nanoparticle (AgNP) inks.

Cyclic thermo-mechanical fatigue was studied under accelerated temperature cycling testing and modeling. Failures were found to occur mostly at interconnect transition regions due to stress concentrations caused by sudden transitions in local architecture.

Drop/Shock failures for extreme accelerations were studied using a high-G drop tower.

Deformations were characterized using high-speed photography and transient finite element modeling was used to study high strain-rate failures.

Acknowledgments: Jason Fleischer from the Laboratory for Physical Sciences, Harvey Tseng and Jian Yu from the Army Research Lab
Domestic Advanced Packaging for Hi-Rel Microelectronics: The Future is Now
Authors: Adams Jeremy
Published: February 2024

Growing interest in and proliferation of heterogeneously integrated microsystems for enhanced performance of modules and microsystems. Recent years have seen significant adoption of these technologies in commercial applications, driven by major

fabless device companies and 1 1st -tier vertically integrated foundries & OSATs. 67% of semiconductor wafer production at > 40nm node (Mario Morales, IDC presentation at 2022 WLPS) → integration of legacy and leading edge device technologies to produce microsystems.
Market & Technology Trends for the Fanout and 2.5D/3D Packaging Technology
Authors: Kumar Santosh
Published: February 2024

The industry is seeking alternatives to design and manufacture the latest Systems on Chips (SoCs) using System in Package (SiP) and chiplet-based approaches by leveraging Advanced Packaging to mix both the latest and mature nodes. In this regard, fan-out & 2.5D/3D packaging has emerged as the key technology choice for the heterogeneous integration. Fan-out packaging is growing at > 15% CAGR to reach ~ $3.4B by 2026. Key applications driving the fan-out are mobile, HPC, networking and automotive. Core-FO is expected to see slow growth and remain flat as many device requirements can be fulfilled by fan-in WLCSP and more reliable FCCSP configurations. HD-FO is mainly driven by application processor for high end phones and the growth will remain healthy. UHD-FO (Ultra High Density), such as FoCoS & InFO-OS, is expected to gain more traction in networking and HPC applications. With rise of the need for heterogeneous integration, 3D stacked packaging is coming at the forefront of advanced packaging arena as Moore’s law slows down due to increased cost of Si transistor scaling. 3D stacked packages are expected to grow at ~24% CAGR reaching $7.4B revenue by 2026. 3D stacked packages include SoC (System on Chip), active interposer packages such as Foveros and Co- EMIB, 3D NAND, 3DS, HBM, and Stacked CIS packages.
Evidence-Based Guideline for the Treatment of Smoking Cessation Provided by the National Health Insurance Service in Korea
Authors: Lee Cheol Min , Seo Yoo-Bin , Paek Yu-Jin , Lee Eon Sook , Kang Hye Seon , Kim Soo Young , Roh Sungwon , Park Dong Won , An Yoo Suk , Jo Sang-Ho ,   The Guideline Development Group for Developing the Korean Clinical Practice Guideline for Tobacco Cessation
Published: February 2024

Although major countries, such as South Korea, have developed and disseminated national smoking cessation guidelines, these efforts have been limited to developing individual societies or specialized institution-based recommendations. Therefore, evidence-based clinical guidelines are essential for developing smoking cessation interventions and promoting effective smoking cessation treatments. This guideline targets frontline clinical practitioners involved in a smoking cessation treatment support program implemented in 2015 with the support of the National Health Insurance Service. The Guideline Development Group of 10 multidisciplinary smoking cessation experts employed the Grading of Recommendations Assessment, Development, and Evaluation (GRADE)-ADOLOPMENT approach to review recent domestic and international research and guidelines and to determine evidence levels using the GRADE methodology. The guideline panel formulated six strong recommendations and one conditional recommendation regarding pharmacotherapy choices among general and special populations (mental disorders and chronic obstructive lung disease [COPD]). Strong recommendations favor varenicline rather than a nicotine patch or bupropion, using varenicline even if they are not ready to quit, using extended pharmacotherapy (>12 weeks) rather than standard treatment (8–12 weeks), or using pharmacotherapy for individuals with mental disorders or COPD. The conditional recommendation suggests combining varenicline with a nicotine patch instead of using varenicline alone. Aligned with the Korean Society of Medicine’s clinical guideline development process, this is South Korea’s first domestic smoking cessation treatment guideline that follows standardized guidelines. Primarily focusing on pharmacotherapy, it can serve as a foundation for comprehensive future smoking cessation clinical guidelines, encompassing broader treatment topics beyond medications.
Social capital in voluntary savings organisations in South Africa in historical perspective
Authors: Verhoef Grietjie
Published: February 2024

Informele spaarorganisasies het histories ‘n belangrike ondersteuningsrol gespeel in veral die swart gemeenskappe van Suid-Afrika. ‘n Wêreldwye verskynsel van roterende spaar- en kredietorganisasies het ontstaan om in die daaglikse kredietbehoeftes van mense buite die banksektor te voorsien. Die behoeftes was beide monetêr en sosiaal. Hierdie studie ondersoek die voorgesette rol van stokvelle in die moderne Suid-Afrikaanse omgewing. Die studie wys dat netwerkverbindings onderling sosiale kapitaal skep op grond waarvan mense in hulle behoeftes aan krediet, lewensonderhoud en persoonlike ondersteuning in tye van nood en behoeftigheid, voorsien. Vertroue, wedersydse kommunikasie en ondersteuning, word beskryf as sosiale kapitaal. Die stokvelorganisasies verteenwoordig die manifestasie van die voortgesette belangrikheid van dié soort sosiale organisasie in die lewens van mense in alle sosiale strata. Stokvelle het deur die geskiedenis deur onderlinge besparing sosiale sekuriteit geskep en beskikbaar gemaak aan mense wat nie toegang tot normale bronne van krediet gehad het nie. Die navorsing in hierdie studie wys egter uit dat daardie sosiale kapitaal steeds in die modern samelewing die grondslag gebly het vir groepsbesparing en kredietverlening.
“Allowed such a state of freedom”: Women and gender relations in the Afrikaner community before enfranchisement in 1930
Authors: Giliomee Hermann
Published: February 2024

Hierdie artikel argumenteer dat Afrikanervroue gedurende die eerste twee eeue van die nedersetting aansienlik meer regte geniet het onder die RomeinsHollandse reg as wat die geval was met vroue wat onder die Engelse regte sorteer het. Hul posisie is verder onderskraag deur die stelsel van ras-gebaseerde slawerny, toenemende segregasie in die kerk, en die belangrike funksies wat die boervrou op die plaas gespeel het. Afrikaanse vroue kon nie stem nie en ook nie ampte in die politieke stelsel of kerk beklee nie, maar hulle het hul stempel op die samelewing afgedruk. Hulle het ‘n leidende rol gespeel in die besluit van talle grensboere om die kolonie te verlaat. Onder die vroue wat die Groot Trek meegemaak het, het vurige anti-imperialistiese sentimente ontwikkel, wat uiting gevind het in sterk ondersteuning vir die Transvaalse opstand in 1880- 81 en die Bittereinder-fase van die Suid-Afrikaanse Oorlog. Van die laaste kwart van die negentiende eeu is die sterk posisie van die Afrikaanse vrou ondergrawe deur verreikende veranderings in die erfreg, verstedeliking, wat haar rol dikwels tot die huis beperk het, en die toenemende invloed van sowel Viktoriaanse as nasionalistiese opvattinge oor die ondergeskikte rol wat die vrou behoort te speel. Afrikaanse vroue het eers laat op die stemreg aangedring omdat hulle dit as hul prioriteit beskou het om die eerste gesin en die gemeenskap se belange te bevorder. In die eerste 250 jaar van blanke vestiging aan die Kaap het hulle `n deurslaggewende rol gespeel in die ontwikkeling van daardie eienskappe wat vandag as kenmerkend van die Afrikaner-identiteit beskou word: godsdienstigheid, `n bepaalde vorm van huislike lewe en die kultuur van die plaas- en landelike lewe.
The degree one Laguerre–Pólya class and the shuffle-word-embedding conjecture
Authors: Pascoe James E. , Woerdeman Hugo J.
Published: February 2024

We discuss the class of functions, which are well approximated on compacta by the geometric mean of the eigenvalues of a unital (completely) positive map into a matrix algebra or more generally a type
$II_1$
factor, using the notion of a Fuglede–Kadison determinant. In two variables, the two classes are the same, but in three or more noncommuting variables, there are generally functions arising from type
$II_1$
von Neumann algebras, due to the recently established failure of the Connes embedding conjecture. The question of whether or not approximability holds for scalar inputs is shown to be equivalent to a restricted form of the Connes embedding conjecture, the so-called shuffle-word-embedding conjecture.
Transformer‐based reranking for improving Korean morphological analysis systems
Authors: Ryu Jihee , Lim Soojong , Kwon Oh‐Woog , Na Seung‐Hoon
Published: February 2024

This study introduces a new approach in Korean morphological analysis combining dictionary‐based techniques with Transformer‐based deep learning models. The key innovation is the use of a BERT‐based reranking system, significantly enhancing the accuracy of traditional morphological analysis. The method generates multiple suboptimal paths, then employs BERT models for reranking, leveraging their advanced language comprehension. Results show remarkable performance improvements, with the first‐stage reranking achieving over 20% improvement in error reduction rate compared with existing models. The second stage, using another BERT variant, further increases this improvement to over 30%. This indicates a significant leap in accuracy, validating the effectiveness of merging dictionary‐based analysis with contemporary deep learning. The study suggests future exploration in refined integrations of dictionary and deep learning methods as well as using probabilistic models for enhanced morphological analysis. This hybrid approach sets a new benchmark in the field and offers insights for similar challenges in language processing applications.
Los micro importadores habituales y la incidencia en el pago de impuestos de la Aduana en Manta
Authors: Naranjo Ávila Cristopher Leonardo , Mera Plaza Carmen Liliana
Published: February 2024

El comercio internacional es un componente vital de la economía global, y los micro importadores desempeñan un papel importante en este panorama. El objetivo general de este estudio es analizar la incidencia de los micro importadores habituales en el pago de impuestos de la Aduana en Manta, Ecuador. Para llevar a cabo este estudio, se empleó una metodología mixta que combinó el análisis cuantitativo de registros aduaneros con el análisis cualitativo de entrevistas. Se utilizó un diseño descriptivo-correlacional para examinar la incidencia en el pago de impuestos por parte de los micro importadores. La muestra incluyó a 50 participantes seleccionados mediante un muestreo estratificado. Durante el proceso de investigación, se aplicaron técnicas estadísticas y de análisis de contenido temático. Los resultados obtenidos en este estudio arrojan luz sobre la complejidad del comercio internacional en el contexto de los micro importadores en Manta. Destacan la importancia de la adaptabilidad y la gestión estratégica como herramientas clave para abordar las tendencias y desafíos emergentes en este mercado altamente dinámico. Además, los resultados resaltan la necesidad de políticas que equilibren el riesgo y el crecimiento, así como la relevancia de una logística eficiente y políticas fiscales facilitadoras que puedan respaldar a los micro importadores. En última instancia, este estudio concluye enfatizando la interconexión de diversas variables comerciales y abogando por un enfoque holístico en la formulación de estrategias y regulaciones. Estos hallazgos proporcionan una visión completa de la situación de los micro importadores en Manta y ofrecen orientación valiosa para el desarrollo de políticas y estrategias comerciales efectivas en el contexto del comercio internacional y las operaciones aduaneras.
Bloqueo auriculoventricular de tercer grado: caso clínico
Authors: Loaiza Fernanda , Morgado María , Yambay Xavier
Published: February 2024

El bloqueo auriculoventricular (BAV) es un trastorno eléctrico cardíaco caracterizado por una conducción alterada de las aurículas a los ventrículos. Este artículo tiene por objetivo reportar el caso clínico de una paciente con BAV de tercer grado sintomático y realizar una revisión de la literatura de los factores de riesgo, diagnóstico y tratamiento.  La metodología aplicada fue un estudio observacional, descriptivo, retrospectivo. Se realizó una búsqueda bibliográfica en: Google Académico, PubMed, Science Direct y en Scielo de estudios de los últimos cinco años en español e inglés. Se seleccionaron 36 publicaciones. Los factores de riesgo más frecuentes fueron: hipertensión, edad avanzada, sexo masculino, bradicardia marcada, etc.  El diagnóstico se basa en el electrocardiograma para determinar el BAV, el ecocardiograma transtorácico. El tratamiento requiere de la implantación de un marcapasos (MP) definitivo, concluyendo que es importante monitorizar periódicamente el funcionamiento del MP implantado para prevenir complicaciones.
Paciente cardiaco con asistolia: un reporte de caso
Authors: Luna Magaly , Morgado María , Pogyo Gloria
Published: February 2024

La asistolia, o paro cardíaco, es el cese del corazón de una persona en este momento, el tiempo es muy importante, se debe actuar de inmediato y prescribir el tratamiento adecuado. La asistolia es causada por enfermedades y condiciones que pueden ser específicas del corazón (enfermedad coronaria) o no cardíacas (trauma, hemorragia, asfixia e intoxicación). El objetivo es determinar el manejo de pacientes con asistolia para introducir aspectos nuevos o educativos de la enfermedad. La metodología que se utilizó un método descriptivo retrospectivo con una técnica de recolección de historia clínica que revisó antecedentes patológicos, antecedentes personales, signos y síntomas, causa de la asistolia y tratamiento dado al paciente. Los resultados con base en la revisión de la historia clínica del paciente con asistolia, se encontró que se trataba de una parálisis de funciones sistémicas causada por cambios en el músculo cardíaco, por lo que se realizaron maniobras para reanimar el corazón., pero en el segundo episodio no lo supero, la asistolia continua y el paciente muere. Las conclusiones que este estudio proporcionó todas las bases legales para la recopilación de datos, la identidad preservada en todos los reclamos, respaldado por la verificación científica Scopus, Pubmed para la discusión relevante. Eventualmente, se concluyó que solo una de cada 100 personas que sufren de asistolia morirá.
Actes de la journée scientifique du Collectif des Professeurs Titulaires et Professeurs de Madagascar (CPTPM)
Authors:   University of Toamasina, Rakotomavo Andriamparany
Published: February 2024

Cher(e)s lecteur(rice)s de REVUT Scientific Journal, C’est un plaisir de vous présenter ce numéro 5 de RSJ, lequel consiste en une compilation sous forme d’Actes de la journée scientifique du Collectif des Professeurs Titulaires et Professeurs de Madagascar (CPTPM), qui s’est tenue à Ivato Antananarivo, le 30 août 2023. Axées sur la thématique globale fédératrice « Innovation & Recherche », les communications présentées dans le présent document accordent une importance particulière aux innovations apportées par la Science en matière de gouvernance environnementale, technologies, éducation, management d’entreprise, biomédecine et nutrition humaine. De nouvelles pistes de développement et de réflexion ont ainsi été tracées par les scientifiques du CPTPM, grâce à la recherche qu’ils ont entreprise au sein de leur institution respective. Quoique parfois « peu vulgarisables auprès d’un public profane » au stade où elles sont en ce moment, ces orientations peuvent d’ores et déjà, à quelques adaptations près, servir d’outils de prise de décisions de base pour les gouvernants et les politiques. Parallèlement à cela, les vulgarisateurs et acteurs de développement sont invités à contribuer à la reformulation des résultats de recherche pour une meilleure employabilité et assimilation pratique de ces derniers dans le processus de développement. Espérant que les résumés et slides des 10 communications compilées dans ce numéro contribueront à l’avancée de la Science et de la société, je vous donne rendez-vous au prochain numéro de RSJ, lequel sera, cette fois-ci, consacré à la publication des résultats saillants des recherches entreprises par les Scientifiques membres du Conseil des Professeurs de l’Université de Toamasina au cours de l’année 2023.
Socio-demographic factors of fashion purchase. A case of apparel consumption among kenyan university students
Authors: Kimemia Millicent Wamuyu
Published: February 2024

There has been a rapid growth of global fashion industry. Kenya like other developing nations is fighting for a slice of this growth and positioning itself as a competitive contributor to the same. In this regard, both the fashion marketers and the academia are becoming increasingly interested in variables of fashion consumption. This paper investigated the relationship between the socio-demographic characteristics of university students and apparel purchase. Demographic characteristics of students such as age, gender, marital status and religion play a key role in students’ apparel fashion consumption decision making.  Targeting 4 public and 16 private universities, this study sampled 7 universities and 534 students. However, 503 questionnaires were completed hence used. Using a questionnaire to collect data, a chi square tested the null hypothesis; Socio-demographic characteristics of university students have no relationship with their apparel consumption. Results showed that there was no significant relationship between age and fashion need conceptualization (x2 = 7.905, df =5, p-value = 0.162) among university students.  There was no significant relationship between students’ gender and evaluation of all information before making an apparel purchase (p-value = 0.066) though females were more likely to conceptualize a need before buying new clothes than males. The study revealed that there was a significant relationship between marital status of students and evaluation between possible alternatives (p-value =0.043). Religion of the students had no significant relationship with any stage of fashion consumption. Summatively, the study results showed that demographic characteristics of respondents had no significant relationship with apparel fashion consumption decision making among university students (chi-square = 15.000, df = 12 and p-value = 0.241).
Startups and Artificial Intelligence
Authors: Rios-Campos Carlos , Zambrano Erick Orlando Guerrero , Vargas Daniel Jesús Castro , Merino Luis Alfredo Abanto , Vallejos Patricia Abigail Alejandría , Alcantara Irene Marely Ballena , Rubio Deciderio Enrique Diaz , Rodriguez Daniel Samillan , Tomanguilla Jhony Huaman , Calderón Edilbrando Vega
Published: February 2024

The general objective of the research was to determine the advances related to the startups and artificial intelligence. The specific objectives of the research are to identify the most successful startups that use artificial intelligence and the countries that invest the most in startups. Methodology, in this research, 53 documents have been selected, carried out in the period 2018 - 2024; including: scientific articles, review articles and information from websites of recognized organizations. Results, the number of startups is increasing rapidly on various continents and is applied in various economic sectors. Artificial Intelligence is having a significant impact on various human activities around the world. The current concern is the ethical use of AI, which is why various governments and international organizations are establishing recommendations and limitations for corporations that carry out such research. The startups that are currently emerging have artificial intelligence as their main component, due to the great advantages it offers. The United States, China and the United Kingdom are leading investment in startups worldwide. Conclusions, about the general objective of the research, to determine the advances related to the startups and artificial intelligence. The number of startups is increasing rapidly on various continents and is applied in various economic sectors. The current concern is the ethical use of AI. The startups that are currently emerging have artificial intelligence as their main component, due to the great advantages it offers. About the first specific objectives of the research, to identify the most successful startups that use artificial intelligence. On all five continents, there are several startups that use artificial intelligence and seek to provide technological solutions in the various fields of human activity. About the second specific objectives of the research, the countries that invest the most in startups. The United States, China and the United Kingdom are leading investment in startups worldwide.
Impacto del confinamiento 2020 en estudiantes de una universidad pública en México
Authors: Domínguez Teresa de Jesús Pomposa Luna , Campos Dinorah Arely Escudero , Velázquez Itzel Natalia Lendechy , Hernández Luz María Gutiérrez
Published: February 2024

Estudio exploratorio, descriptivo, transversal, realizado a 93 estudiantes universitarios en el rango de edad de 18 a 57 años, que cursaban la carrera de Pedagogía-Xalapa México del Sistema de Enseñanza Abierta de la Universidad Veracruzana (UV). El objetivo del estudio fue identificar cómo vivieron los estudiantes el confinamiento derivado del COVID-19, a través de un cuestionario aplicado por medios digitales, dividido en tres áreas en relación a sus vivencias durante la pandemia: salud física, salud emocional y aspecto académico. Los resultados mostraron que los estudiantes presentaron en su salud física malestares como dolor de cabeza y cansancio principalmente, en el aspecto emocional mayoritariamente mostraron ansiedad, insomnio e irritabilidad; en situaciones académicas, la mayoría reportó haber tomado todas sus materias y estar en contacto con sus docentes, las clases en línea no eran dinámicas y los docentes asignaban muchas tareas. Son pocos los estudiantes que no tomaron materias por enfermedad o falta de dispositivos electrónicos, y más de la mitad de los estudiantes entrevistados no se les facilitó el aprendizaje en la modalidad virtual.
Analisis Tingkat Kesehatan Bank
Authors: Rahayu Riski , Ruma Zainal , Anwar Anwar , Sahabuddin Romansyah , Paramaswary Annisa
Published: February 2024

This research aims to determine the health level of PT. Bank Muamalat Indonesia Tbk which uses the RGEC (Risk Profile, Good Corporate Governance, Earnings and Capital) method. The research object is PT. Bank Muamalat Indonesia Tbk. The type of research used is quantitative descriptive research. The type of sample used is the financial report of PT. Bank Muamalat Indonesia Tbk from 2018 to 2022, while the type of data used is secondary data. The results of this research show that the health level of PT. Bank Muamalat Indonesia Tbk., in the period 2018 to 2022 as a whole is in the Healthy predicate with the risk profile aspect being in a Very Healthy condition with a final composite score of 90%, then the good corporate governance aspect is in a Healthy Enough condition with the final composite value was 68%, in the earning aspect it was in an Unhealthy condition with a final composite value of 40%, and finally in the capital aspect it was in a Very Healthy condition with a final composite value of 100%. Thus, assessing the health level of PT. Bank Muamalat Indonesia Tbk., it can be said that PT. Bank Muamalat Indonesia Tbk., was classified in the "HEALTHY" category for the last 5 years with a final composite score of 71.33%.
The Impact of Digital Technology Use on Child Development: A Comprehensive Literature Review
Authors:   Physical Therapist Neighborhood Physical Therapy PCBrooklyn, NY, USA, Baladaniya Maheshkumar , Korat Arpan Shaileshbhai ,   State University of New York - BuffaloStudent - School of Engineering and Applied Sciences Buffalo, NY, USA
Published: February 2024

In recent years, the pervasive presence of digital screen media has become an integral part of children’s lives. The increasing accessibility of smartphones, tablets, and televisions has raised concerns about their potential effects on child devel- opment. This comprehensive literature review aims to explore the multifaceted relationship between digital screen media and various aspects of child development. We examine findings from several studies that shed light on cognitive development, social interactions, language acquisition, and the impact of screen time on children aged two and younger. Effects of the digital technology on the children depends on the various factors. Those factors include the socioeconomic status of the family, ecological environment, child attributes, interaction with various type of digital platform, content of the digital media and many others. It is evident that all of those factors are not associated with the experimental groups at the same time. So, there are many points which are missing in the findings from the previous studies and we cannot eliminate every gap because there would be number of permutations are present which cover various factors. There are certain things which are negatively impacting the child development and should be avoided whereas with the precaution and on the moderate level if feeded to children then the cognitive development would increase significantly in the children on the linguistic bases as well as on the cognitive bases.
First observations of Eucera (Cubitalia) breviceps (Friese, 1911) in Italy and France, with updated information on the distribution and ecology of the species (Hymenoptera: Anthophila: Apidae)
Authors: Aubert Matthieu , Bonifacino Marco , Genoud David , Leclercq Vincent , Schatz Bertrand
Published: February 2024

Eucera (Cubitalia) breviceps (FRIESE, 1911), hitherto only known from Turkey and Syria, was discovered in the southern part of Massif Central (France), in the “Grands Causses” area, a few years ago. It has been found to be distributed throughout it, also present in the French Alps and Italy (Valle d’Aosta, Abruzzo) as well as in southwestern Bulgaria and northern Greece. Our article presents the corresponding data, originated from field work and examination of material in collections, and gives new data for Turkey from material in the collection of the Oberösterreichisches Landesmuseum, Linz (Austria). Several ecological traits of E. breviceps are discussed. We especially highlight the close association between E. breviceps and the plant genus Onosma L. (Boraginaceae), based on literature and our field observations. Both their ecological requirements and their interactions illustrate the complexity of such relationships and their potential vulnerability in the context of global change. Through this remarkable example of an oligolectic interaction, we aim to promote a better consideration of pollinators, notably bees, and pollinator networks in conservation biology.
O Ecce Homo como linguagem ao infinito
Authors: Dutra de Azeredo Vânia
Published: February 2024

Neste artigo, apresentaremos a narrativa de Ecce Homo como suspensão da morte através da palavra, mediante o resgate do sentido das narrativas para os gregos da antiguidade. Aplicaremos ao livro de Nietzsche a leitura de Foucault em “A linguagem ao infinito”, mostrando que nele, Nietzsche escreve um ensaio para, em todos os tempos, ser escutado com os olhos, atingindo por meio dos escritos a imortalidade enquanto ligada ao nome do autor e desligada do eu.