(Invited) A Nonvolatile SRAM Based on Ferroelectric HfO2 capacitor for IoT Power Management
Authors: Kobayashi Masaharu , Ueyama Nozomu , Hiramoto Toshiro 
Published: February 2020

A nonvolatile SRAM has been designed and fabricated by integrating with ferroelectric HfO2 capacitors, and its store/recall operation before/after power-off have been experimentally demonstrated. Excellent ferroelectricity and memory characteristics have been obtained in sub-10nm-thick ferroelectric HfO2 capacitor. The NVSRAM with ferroelectric HfO2 capacitor can be a candidate for cost-effective, normally-off and ultralow power embedded memory solution for IoT power management.

Introduction

IoT edge devices have been playing key roles as sensor node device. The number of IoT edge devices is predicted to be trillions or even more, and then obviously the device must operate at ultralow power in the order of 1mW or less [1]. IoT edge device operates in an intermittent mode where the switching times of a transistor per second is very small in average. Then the power consumption is dominated by standby leakage current especially in high capacity memory such as SRAM. Therefore it is very important to suppress leakage current of a memory cell. One possible approach is to turn off power supply for memory cells. To do so, state information must be stored and recalled, before and after power-off, so that latency and power overhead are mitigated. This is so called normally-off computing and low power nonvolatile memory needs to be integrated to SRAM, which turns out to be nonvolatile SRAM (NVSRAM) [2-4]. There are several architectures for NVSRAM. Ferroelectric NVSRAM has an advantage of low voltage and low power operation [4]. However, conventional ferroelectric material has several issues in CMOS compatibility and scaling. Recently, ferroelectricity has been discovered in HfO2 thin film which is already used in CMOS process as a high-k dielectric [5-7]. Ferroelectric HfO2 opens new paths for ferroelectric-based low power devices including NVSRAM. In this paper, NVSRAM is designed and fabricated by integrating ferroelectric HfO2 in our university lab. We focus on functional device implementation as a proof-of-concept for normally-off computing and IoT power management.

Device Operation and Design Consideration

In this work, among several ferroelectric NVSRAM architectures [4,8-11], we chose 6T-2C NVSRAM architectures (Fig.1) [4] because of its simple structure, operation principle, and above all its simple process integration with ferroelectric HfO2 capacitor. NVSRAM cell is made of 6T SRAM cell and two ferroelectric capacitors at the SRAM nodes. Bottom electrodes of ferroelectric capacitors are connected to plate line (PL). NVSRAM operates just as normal SRAM with PL is VDD/2. It only needs to flip ferroelectric polarization during store operation before power-off, which mitigates reliability requirement of ferroelectric capacitors. One of the most critical operations is recall. The nodes have opposite polarizations and thus different capacitances. The recall operation makes use of this capacitance imbalance to regenerate node voltages. Capacitor size and voltage ramp rate need to be carefully chosen. We confirmed recall operation in our NVSRAM design by SPICE simulation which was calibrated by our MOSFET and MIM capacitor.

Experiments and Discussions

NVSRAM was fabricated by following process flow. First SRAM was fabricated by conventional SOI CMOS process. After contact formation, bottom TiN/Ti electrode was deposited by sputtering. Then HfO2 doped with Zr was deposited by ALD system, followed by top TiN electrode deposition by sputtering. MIMS capacitor was formed by simple subtractive etching process. Lastly, RTA was performed to crystalize the HfO2 film. Fig. 2 shows the cross sectional TEM image of the ferroelectric HfO2 capacitor, where we confirmed uniformly crystallized 9nm-thick HfO2 thin film. PV characteristics of the MIM capacitor integrated on SRAM cell does not show any degradation as shown in Fig. 3. We also confirmed sufficient capacitance difference for each polarization state. From retention measurement, more than 1 year retention is estimated. Measured endurance cycle was 1x108 which is close to requirement for IoT power management, 1x109. NVSRAM cell shows no difference in static SRAM butterfly curve from reference SRAM cell on the same chip. Fig. 4 shows the measured waveform of the entire NVSRAM operation. First, data was written in normal SRAM mode, and then store operation was performed before power-off. After arbitrary sleep time, recall operation was performed and the written data was verified. We confirmed correct store and recall operation in NVSRAM and demonstrated nonvolatile functionality with ferroelectric HfO2 capacitors.

Summary

We experimentally demonstrated the nonvolatile functionality of the NVSRAM integrated with ferroelectric HfO2 capacitor fabricated in the university lab. NVSRAM will enable normally-off computing for IoT power management at low cost. In this work, we focused on demonstrating essential store/recall operations. Design optimization for high density and high speed operation using relevant CMOS technology will be our future work.

Figure 1