bluuebunny/crossref_metadata_2025 huggingface dataset:
Creating Development Archives Ethically from an Over-Developed Country
Authors: Glassford Sarah , Marshall Dominique , Trainor Chris , Dutil Eve , Webster David
Published: January 2025

Development archives, like all archives, are an expression of power. Furthermore, archives in over-developed countries tend to prioritize the records of government institutions and of influential men deemed to be “important.” At the same time, nongovernmental organizations in “donor” countries are able and expected to generate archival records related to development projects overseas. Conflict and storage issues in less developed countries can leave these Northern NGO archives in possession of materials not available in “recipient” countries. This paper examines the work of “archival rescue” in Canada. The process of digitization and description is also a process of archival creation, with implications inherent in the subsequent posting of these records online.
Circumventing the Nation: How to Develop a Postcolonial Archive on Public Health in India
Authors: Sarcar Aprajita
Published: January 2025

Historiography on late colonial public health governance in India has detailed the imprints of transnational funders, namely the Rockfeller Foundation and later, the Ford foundation on funding, research, and knowledge production around national programmes and personnel in India. The National Archives in India, is significantly thin on subjects like demography, reproductive policies and birth control technologies. Scholars have to necessarily rely on transnational repositories. This paper will analyze some of the ethical dilemmas of using these transnational sources. I suggest we seek municipal counterparts and decenter the nation. Juxtaposing the transnational with the local archival trail opens up new conversations about networks that emerged within overlapping funding priorities.
Expertise économique et reconfigurations disciplinaires dans la décolonisation
Authors: Irace Thomas
Published: January 2025

Si le rôle important des sciences économiques est souvent évoqué par les historien·nes du développement, l’apport de l’histoire de la pensée économique à cette littérature est resté surprenamment limité. Cet article propose une piste d’explication par les pratiques archivistiques : le recours aux archives des bureaucraties (post-)coloniales nationales européennes (relativement peu utilisées par rapport à celles de chercheurs et de chercheuses individuel·les ou d’organisations internationales) pourrait permettre de mieux comprendre les enjeux de l’expertise dans la décolonisation et, en bout de chaîne, l’émergence de l’économie du développement comme forme de savoir spécifique dans ces pays. L’exemple proposé est celui de la Mission d’assistance économique créée en 1955 au sein du ministère de la France d’Outre-mer, et de sa transformation en 1958 en un bureau d’études – la Sedes – qui fut l’un des principaux acteurs français du déploiement d’économistes au Sud dans les décennies suivantes.
Le Congrès culturel de La Havane (1968) : point de bascule de l’engagement français envers la révolution cubaine
Authors: Pedemonte Rafael
Published: January 2025

Grâce à des sources primaires inédites (fonds privés, archives diplomatiques, entretiens), cet article s’interroge sur un moment clé de l’engagement des intellectuels français envers le projet révolutionnaire castriste : le Congrès culturel de La Havane (CCH) de janvier 1968, un colloque international qui rassemble environ 500 invités étrangers, dont près de 80 Français. L’orientation « tiers-mondiste » de la révolution cubaine et ses prises de distance à l’égard de l’URSS séduisent la plupart des Français, qui voient en Cuba l’émergence d’un modèle révolutionnaire non dogmatique axé sur la solidarité Sud-Sud, et la liberté de pensée et de création. De retour en France, beaucoup de participants du CCH mettent en œuvre des initiatives de soutien envers la révolution cubaine, mais les événements de Mai 1968 et l’appui de Fidel Castro à l’intervention militaire en Tchécoslovaquie (août 1968) essoufflent cet élan militant, entravant les projets de solidarité envers Cuba.
Fintech for Small Business
Authors: Bhutta Aamir Inam , Sarwar Khadija , Sheikh Muhammad Fayyaz , Sultan Jahanzaib
Published: January 2025

This chapter focuses on the impact, opportunity, and challenges that Fintech has brought to SMBs, which are essential players in global economies but have always struggled to secure conventional funds. The development of Fintech has served up such innovations as mobile payments, online lending, cloud-based accounting, and crowdfunding that can reduce such costs of transactions, access to credit, and financial management for SMBs. The chapter covers Fintech success stories like Square, M-Pesa, and Alipay. It looks into more potential advantages of the Fintech movement, both in the short and long run, including the potential for cost reductions and further encroachment of artificial intelligence into the domain of financial decision-making. It also addresses issues of data privacy, fraud control, and the need for digitization competence. The paper concludes with specific recommendations based on the findings for improvements in SMBs and provides suggestions for researchers and policymakers.
The Effect of Market Power on Stability and Financial Performance of Islamic and Conventional Banks in Pakistan
Authors: Awan Muhammad Ayub , Rashid Abdul , Chohan Muhammad Ali , Butt Shamaila , Mazlan Ain Naadia Binti
Published: January 2025

The aim of the study is to explore the impact of market power on the financial stability and financial performance of Islamic banks and their counterparts. In our study the five conventional and five Islamic banks are selected from Pakistan for the period of 2007 to 2016 using Panel data. We have used different techniques to analyze the effect of market power on stability and financial performance. The findings reveal that efficiency of Islamic bank does not depend on the stability. Market share is statistically significant for both Islamic and their counterparts, therefore greater market share leads to increase the financial stability. The asset growth is statistically insignificant in case of both Islamic and their counterparts, therefore asset growth does not have any impact on financial stability. The interest rate spread is statistically significant with conventional banks. The policy makers of the conventional banking sector should work on a tradeoff among the financial performance and financial stability.
Human Resource Entrepreneurship: Bridging the Gap Between Human Capital and Organizational Innovation: A Documentary Retrieval
Authors: Dissanayake Dinusha , Wedagedara Shalika
Published: January 2025

Human Resource Entrepreneurship (HRE) is an emerging field that integrates human resource management (HRM) with entrepreneurial activities to foster innovation and competitive advantage within organizations. This documentary retrieval explores the concept of HRE, its theoretical foundations the role of HRM in entrepreneurship, the need of human resource entrepreneurship to face the economic crisis in Sri Lanka and Challenges to apply the concept of Human resource entrepreneurship. Through a comprehensive literature review, researchers examine how HRE contributes to organizational success by leveraging human capital to drive entrepreneurial initiatives. The article also provides the recommendations to apply the concept of Human Resource entrepreneurship in organizational context.
The Impact of Emotional Intelligence on Work-Life Balance and Employee Behavior: A Case Study of Production Employees at Selected manufacturing company in Colombo District
Authors: Dias P. , Rebecca E.
Published: January 2025

The purpose of this study was to identify the impact of Emotional Intelligence on Work-Life Balance and Employee Behavior of Production Employees at Selected manufacturing company in Colombo District. A standardized questionnaire was employed to gather primary data from a sample of 248 production employees, utilizing convenience sampling for the selection of participants. Correlation analysis and simple regression analysis were used to measure relationships and to test the advanced hypotheses of the study by using Statistical Package for Social Sciences (SPSS 26). Furthermore, employee behavior suggests a mediating and moderating relationship between EI and work-life balance. As a moderator, employee behavior can influence the strength or direction of the relationship between emotional intelligence and work-life balance. As a mediator Employee behavior can help explain the relationship between emotional intelligence and work-life balance, providing insight into how certain factors influence employee actions. Thus, the paper presents a mediation model that depicts the relationships of these variables. It builds an integrated model that will help theorists and researchers expand the literature on work-related well-being and assist organizations in designing their HR policies and practices. The results indicate that emotional intelligence has significant direct effects on employee work- life balance. While there is an insignificant impact of employee behavior as a mediator on the relationship between emotional intelligence and work-life balance. Management can take necessary actions to enhance the EI of their employees so that it will help them to have a proper work-life balance. Management needs to focus on the level of EI of their employees to enrich work-life balance to achieve higher level of productivity, commitment, and involvement.
Message from the Editor Emeritus
Authors: Banagala Upali
Published: January 2025

No abstract available
To research or not: The psychology of research engagement and avoidance
Authors: Hanwella D. R. C.
Published: January 2025

Research is driven by a confluence of personal, societal, technological, and institutional motivations. This article looks at the psychology behind why individuals are drawn to or deterred from research pursuits. In the historical context, intrinsic motivations such as personal aspirations and the innate human curiosity to unravel mysteries are recognised factors. Societal expectations, underscored by the allure of recognition and the drive to address global challenges, further fuel research endeavours. Technological innovations act as catalysts, opening uncharted territories for exploration. Institutional incentives, while motivating, come with their share of pressures, influencing an individual's research activities. However, potential deterrents like the fear of failure, competition for funding, and impostor syndrome can hinder research aspirations. In understanding these dynamics, recommendations are given for institutions and policymakers to foster a supportive and thriving research environment. By addressing both the motivations and deterrents, a forward momentum can be achieved in the domain of research.
Laboratory evaluation of insecticides for the control of Delia planipalpis (Diptera: Anthomyiidae), a nascent pest of broccoli (Brassicaceae) in Mexico
Authors: Lasa Rodrigo , Córdova-García Guadalupe , Williams Trevor
Published: January 2025

The radish fly, Delia planipalpis Linnaeus (Diptera: Anthomyiidae), is an emerging pest of broccoli and brassicaceous crops (Brassicaceae). The fly oviposits close to the stem of broccoli plants, and larvae feed within the stem and then pupate in the soil. Due to D. planipalpis’s recent appearance as a pest, no insecticides are registered for its management in Mexico. This study evaluated the efficacy of 13 synthetic and biological insecticides against different developmental stages through laboratory bioassays. Neonicotinoid-based products were highly toxic to the larvae, especially when applied via root irrigation, with thiamethoxam, clothianidin, and imidacloprid showing systemic activity. Thiamethoxam- and spinetoram-based products were also effective when applied to the stem oviposition site as a spray. A clothianidin-based product demonstrated moderate ovicidal activity, and bifenthrin had moderate residual activity against adult flies. A pyriproxyfen-based product effectively suppressed adult emergence. Products based on spirotetramat, neem (Meliaceae), and Tagetes (marigold) (Asteraceae) extracts and the microbial insecticide Bacillus thuringiensis var. israelensis (Bacillaceae) were ineffective against this pest. Spinosad and Sterneinema feltiae (Rhabditida: Steinernematidae) were not highly effective but could be used together with other control strategies in organic production. Neonicotinoids, spinetoram, and pyriproxyfen are promising options to validate in field trials for the management of D. planipalpis in broccoli.
3D Packaging from Edge to the Datacenter: An Imperative for the Next Decade
Authors: Trivedi Vaibhav
Published: January 2025

As Moore’s law become increasingly challenging to achieve for front-end transistor scaling, back-end packaging processes are becoming critical than ever before. As the scaling continues beyond 7 nm and recent delays announced by Intel on 7 nm product line, it is evident that cost of scaling is becoming very significant especially at larger die sizes. Top IDMs such as Intel, TSMC, and Samsung continue to search for advanced back-end solution to bridge the gap between front-end and back-end interconnect advancement. 3D packaging is a high-end heterogeneous solution platform that can significantly increase performance of the “chip stack” compare to discrete solutions. The growth of 3D packaging technologies primarily driven by the giants such as Intel and TSMC has opened new equipment eco-system such as hybrid bonding that is a revolutionary leap in back-end IC packaging industry. This presentation will cover recent products and markets targeted with 3D packaging solutions and provide an extensive overview of supply chain eco-system with projected market forecast. It will also shed light on key players and status of their current 3D packaging platforms and products with potential challenges and promises that it provides.
A Low Tg Bonding Material for Use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes
Authors: Southard Arthur , Cartaya Rachel , Bai Dongshun , Massey John
Published: January 2025

The advanced packaging industry is projected to accelerate with the market as demand for newer technologies continues to increase. To meet the increasing needs of high-performance chips for a variety of applications, more techniques are being developed with temporary wafer bonding solutions. These solutions need to address the difficulties of harsher downstream processing conditions as well as ease the cleanability after these processes. Temporary bonding provides a method for many wafer-level packaging wafer and substrate applications such as heterogeneous integration with the use of fan-out wafer-level-packaging (FOWLP). Heterogeneous integration is the stacking of multiple chips in order to improve devices to adapt to the need for high connectivity and artificial intelligence. The smaller interconnect allows for increased capacity, smaller footprint, and opens the door to newer packaging designs. Temporary bonding material provides a layer for stability and platform for heterogeneous assembly to occur. Temporary wafer bonding is a critical technology that continues to enable the use of ultrathin substrates for use in wafer-level packaging. The use of a temporary carrier enables the control of thinned substrates that can no longer self-support during downstream, backside processing. Current backside processing involves the use of aggressive thermal processes that can be in excess of 300°C. As packaging technologies move to larger diameter substrates, wafer warpage, stress from CTE-mismatched materials and adhesion issues after thermal processing have become obstacles. Thinned wafers can sustain damage when the bonding material has high stress and lower survivability at the higher temperatures. Therefore, a simple yet effective temporary bonding process that uses a bonding material that can survive all the backside processes with lower stress and lower warpage is highly desired. In this paper, we will introduce a newly developed temporary bonding material. This material has a thermal stability above 300°C and has very good adhesion to various substrates. It can be debonded after backside processing by using a thermal slide process or it can be laser released when used in conjunction with a laser release layer. After debonding, residual bonding material left on the device wafer can be easily cleaned with common industrial solvents. Substrates bonded using this material demonstrate lower overall wafer warpage with good film uniformity for downstream processing.
Design of Subsystem Module Package for Power Distribution Network
Authors: Lim HoJeong
Published: January 2025

The application processor (AP) in mobile devices requires a faster computing process and higher graphics acceleration for 3D and pixel density display in a small form factor. Hence, the power distribution network (PDN) between the power management integrated circuit (PMIC) and the system AP has become more important.

Furthermore, the mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system’s configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and enable a smaller form factor.

Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of form factor package should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor’s value and placement strategy for a low impedance profile with associated cost benefits.

This paper will focus on both the static case that addresses the current*resistance (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for PDN. Second, it will compare the performance of double-sided component placement (DSCP) mother boards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (Decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.
Advanced Materials for Automotive SiP Applications
Authors: Araujo Ken
Published: January 2025

Today’s automobiles contain numerous electronic systems use in the powertrain for both gas and electric, sensors for safety, infotainment and ADAS. To meet the demand of these demanding applications, the market is moving towards advanced packaging solutions. One solution is System in Package (SiP) technology that combines multiple advanced packaging technologies to create a customized solution with higher performance while controlling cost.

Next generation SiP packages for automotive applications require increase power demand and better thermal performance to meet the demand for higher levels of integration through smaller package size with increased functionality. This presentation will introduce the latest developments for pressure-less sintering die attach materials to meet the high thermal demands, liquid compression molding (LCM) for encapsulant for fan-in and fan-out wafer-level packages (FIWLP & FOWLP) with excellent flow for fine gap filling and low warpage and board level underfills to ensure high reliability on final assembly through temperature cycling, environmental testing and drop testing to meet stringent automotive standards.
Heterogeneous Integration, Dielets and Chiplets – Why the Hype?
Authors: Iyer Subramanian S.
Published: January 2025

Heterogeneous Integration, Dielets and Chiplets – Why the Hype?

• If Moore’s law has enabled

miniaturization, why have chips

gotten larger ?

– More complex problems

– More cores @ higher clock speeds

– More cache memory

• Main memory capacity and access

limits performance

• Power density challenges - more

”dark” silicon

• I/Os take up more space and

power as system size increases
Reliability Simulation with the Finite Element Analysis (FEA) of Redistribution Layer in Fan-out Wafer Level Packaging
Authors: Okada Yuji
Published: January 2025

Abstract not available for Reliability Simulation with the Finite Element Analysis (FEA) of Redistribution Layer in Fan-out Wafer Level Packaging
An Embedded Planar-Foil Capacitor Material, FPGA Based Interposer, Aimed at Improving System Performance and Reduce Board Size for Space Based Electronics
Authors: Hunter Don , Bolotin Gary , Lias Malcolm , Cheng Ben
Published: January 2025

An Embedded Planar-Foil Capacitor Material FPGA Interposer Aimed at Improving System Performance and Reduce Board Size for Space Based Electronics.

This paper presents our work to date in developing, and testing embedded planar-foil capacitor based interposer meant to be used together with high density components such as Field Programmable Gate Arrays (FPGAs) and Application Specific Integrated Circuits (ASICs). These devices typically have a large number of I/O pins and power pins. The high speed enabled by these devices requires a large number of discrete bypass capacitors as close as possible to the power pins. These capacitors take up a considerable amount of the board area on the application circuit board. Our interposer replaces these components freeing up space of traditional bypass capacitors for other circuitry.

Our interposer was focused on the needs of Micro Semi’s RTG4. We developed the interposer using COTS embedded foil capacitors. We developed designs for Oak Mitsui, 3M and TDK foils. The three different designs were simulated using power distribution techniques, constructed and tested. Our simulations showed that our implementation of placing the capacitive foil based “Interposer” placed directly under the FPGA customized the capacitance to the FPGA banks, and resulted in improved horizontal and vertical interconnect inductances. The use of the interposer results in an overall reduction in our Printed Wiring Board (PWB) area.

This work was developed under NASA’s Europa Lander Technology Maturation Task entitled “Ultra Low Temperature Electronics” and ColdTech technology effort entitled “Cold Survivable Motor Controller” which is aimed at increasing science return by reducing the SWaP of motor control and avionics.
Advanced Double Side SiPwith Thermal Enhance Solutions for 5G Mobile Application
Authors: Tsai Wen-Jung (Mike)
Published: January 2025

From the 5G mobile connection of

system architecture evolution, there

are more and more frequency bands will

require high data rate communication,

low latency, and massive connectivity

for network data transmission. The

components combined into Smartphone of

Radio Frequency (RF) and Front-End

Module (FEM) to get small form factor

requirement and high speed data quality as well as get more space for additional battery area.

The following paper will discuss the

high integration and high thermal

solutions for new System in Package

(SiP) technology and challenges including double side assembly

technology. The high integration of

double side SiP module can shrink

package size and enhance the system

power performance comparing with

traditional single side SiP module.

Especially, low cost is also one of the benefits. This platform will use

double side SMT process technology and double side molding to shrink the

overall package size. The calculation

of package size can be shrunk around

50% area from 8 x 6mm to 6 x 4mm. For

the thermal enhance performance, will

also proceed simulation and

measurement with the thermal material

for bottom side IC (ex. GaAs) to get thermal dissipation to larger thermal pad and molding process with high thermal epoxy molding compound (EMC) to verify thermal performance. By utilizing the double side SiP module which can provide a unique opportunity

to address small form factor for low

cost approach, good power consumption

performance, and time-to-market as

major requirements for SiP platforms.

The characterization data collection

and analysis will utilize simulation

methodology and shadow moire

measurement correction for warpage and thermal performance comparison. Also,

will proceed the JEDEC standard

reliability testing (including Temperature Cycle Test, High Temperature Storage Test, unbias HAST)

results for double side SiP structure

verification. Finally, this paper will find out the suitable advancd SiP solutions and feasibility data for

future 5G mobile devices application.
Glass Interposers Using Cu-plated Through Glass Vias (TGVs)
Authors: Woychik Charles , Borski Justin , Nead Robert
Published: January 2025

For the next generation of 3D-IC applications, glass offers many desirable properties that make it an ideal interposer. In order to realize these applications, it becomes necessary to be able to deposit a Cu layer on both surfaces as well as in the glass via. In this paper we will present results of interposers that have fine line circuitry on both sides of the glass and have through glass vias (TGVs). One major challenge is how to create a TGV using either electrically conductive adhesives (ECAs) or Cu plating methods to achieve a high conductivity and reliable via connection. Most work to date uses ECA materials to fill the TGV, however, many of these ECA materials have limitations in that they cannot withstand temperatures in excess of 400Â°C, are not hermetic and do not have the electrical properties of bulk Cu. In the first phase of our work, we have evaluated different commercially available ECA materials to fill the glass vias. A major challenge in using these materials is how to effectively fill the vias. Our test vehicle has a TGV with dimensions of 50um diameter and a 300um thickness on 2” x 2”glass substrate. A positive pressure screen printing process was used to fill the vias. These ECA materials exhibited a very high viscosity, due to the high Cu metal filler content, which made them very difficult to fill. Different pressures, squeegee speeds, and standoff conditions were evaluated to arrive at an optimized process to effectively fill the glass vias. A tilted X-ray inspection approach was used to characterize the yield for ECA hole fill. A DOE of different sintering conditions was conducted to determine how to maximize the electrically conductivity of the paste. From this work we will show the impact of sintering conditions on electrical conductivity and hermeticity. In parallel, we have developed a process to Cu plate a TGV. In this approach, a dry deposition process was used to produce a conductive seed layer in the via having a diameter of 100um and a total substrate thickness of 300um. We proceeded to use a Cu electroplating process to plate up a conformal Cu layer in the glass via. In this work we have pattern plated circuitry on both surfaces along with the via to produce a glass interposer. Future work on the next generation of TGV plating will use a Cu bottom up fill process that is currently being used for plating smaller dimension visas in a Si-interposer. In this work, smaller diameter vias, 20um diameter and less, can be Cu-plated using existing bottom up fill chemistry employed in the semiconductor industry. Difference concepts that are being considered will be presented along with their applications space.
Applications of Novel High-Speed In-line Automatic X-ray Inspection in High-Volume Manufacturing
Authors: Chen Frank
Published: January 2025

As leading suppliers adopt more-than-

Moore schemes to increase functional

integration and achieve higher computing speeds, manufacturers face increasing challenges in monitoring and controlling precise, fine-pitch bonding processes. Traditional sampling inspection and statistical process control fail to detect

defects with assignable causes in these complex parts with thousands of finely-spaced solder joints. Newer package

structures often incorporate purchased silicon devices which increase the cost of

scrap. Reliability requirements for

applications such as autonomous

vehicles dramatically reduce the market

tolerance for defective parts. To meet these challenges, SVXR developed a new

high-speed in-line automatic inspection

technology which combines a unique X-

ray system architecture with artificial intelligence data analytics. This

presentation provides an overview of the

capabilities of the technology as well as

proven applications in challenging production environments. It details the steps required to correlate high-speed

inspection results to traditional failure

analysis techniques using high-volume

manufacturing application examples. The talk covers best practices in

implementation and shares successful

deployments of continuous monitoring

techniques in production.
Prototyping IoT Modules and Assembling by Additive Manufacturing
Authors: Fujita Yoko , Watt Steven
Published: January 2025

IoT / M2M is spreading rapidly.

Since IoT module products requires a great variety, flexibility is required in function, size, shape, and quantity.

In addition, because the product life cycle of IoT modules is shorter, a mechanism to create a prototype quickly from product ideas is required.

Furthermore, implementation that assumes a three-dimensional usage environment such as a wearable device is required.

On this background, the Trillion Node Engine Project was launched as a research and development of industry-academia collaboration of the Japanese government, and research and development were promoted.

In September 2019, as the result of this project, a compact platform for sensor modules for IoT was made public.

(Technical challenge)

1.In board design, one board was divided into the divided substrate module such as CPU, USB, Bluetooth, sensor, battery.

In addition, the bus is shared so that these can be combined and installed, the assembly is simplified.

2.At the board design, a three-dimensional interference check was developed in consideration of the implementation of multiple modules.

3.At the board design, by management the connection of multiple modules design data, electrical connection check was developed.

4.In order to create prototype by additive manufacturing in a short period of time, we have prepared a design library so that data can be output directly from design data to a 3D printer that performs resin formation and circuit formation, and then prototype can be created and verified.

(Results and Conclusion)

An electronic module board of 2cm size called Leaf was created, and an IoT module prototype was create by combining these board.

By focusing on the design of necessary parts such as new sensors required for IoT products,

the design period was shortened, and design cost was reduced.

In addition, since the printer output can be performed directly from the design data,

it cannot be necessary to create a mask for the substrate, which was necessary in the past, thus it can reduce manufacturing costs.

In addition, since verification assuming 3D implementation is performed during the design, creation including the product case is also performed at the same time. The manufacturing of prototype can be realized in one day. Itâ€™s hard by the conventional PCB based manufacturing.

Since the developed platform including circuit data and PCB design data is open to the public, anyone can easily create the prototype required in the IoT world.
Micro-features in Glass using Laser Induced Deep Etching for Device Packaging
Authors: Delrue Jean-Pol , Santos Rafael , Ambrosius Norbert , Ostholt Roman , Schmidt Stephan
Published: January 2025

Due to its economical limitations, the growing number of

today’s advanced packaging schemes still relies on a

limited number of materials such as Epoxy Molding

Compounds and other polymer substrates. Glass

substrates with high quality and high aspect-ratio

features such as Through Glass Vias (TGV), cavities,

Integrated Passive Devices, MEMS, and others, produced using Laser Induced Deep Etching (LIDE),

maintain all the excellent properties of glass and can,

therefore, be once more considered to be used in advanced packaging.

LIDE is a two-step manufacturing technology for the

formation of particularly deep features (aspect ratio of 1:10 or higher) in most alumino-boro silicate glasses.

LIDE can process glass in standard wafers formats and

panel sizes up to 20”” x 20”” with an initial glass thickness up to nearly 1 mm and is compatible with

panel level packing process flows. This technology process microfeatures in glass with high throughput

while maintaining a very high positional accuracy of +/-

5 micron (Cpk 1.33). Furthermore, these microfeatures

exhibit high break strength and excellent quality, free of

microcracks, chipping and thermally induced stress.

Supported by detailed critical figures, the authors propose the re-evaluation of the utilization of LIDE-

processed glass as a constitutional material for

advanced packaging applications. Due to its very high processing speed, through glass vias (TGVs) manufactured by LIDE demonstrate a very attractive

cost model for advanced packaging applications.

Alternatively, a series of LIDE modifications along a tool path allows glass dicing and cutting of microfeatures

with high cutting speed (>=100 mm/s). This enables an

easy integration of passive devices such capacitors and

inductors in the glass package material. Further, examples of glass capping wafers, open and closed

cavities will also be described demonstrating that this technology can passively reduce the die shift during die

position and transfer molding to less than 4 micron, without the need for additional equipment or processing steps. The examples of applications presented here

demonstrate that Laser Induced Deep Etching is a solution which enables glass technology for

microelectronics at very low cost, while being highly versatile and adaptable to emerging technologies.
The Use of Artificial Intelligence in Orthodontic Treatment Planning: A Systematic Review and Meta-analysis
Authors: Ingle Navin Anand , Alabsi Nisrin Fouad , Al-Hashimi Hashim , Albuolayan Nada Ahmed , Alburidy Faey , Alanazi Fatimah , Alhammad Arwa Tawfiq
Published: January 2025

Orthodontic treatment planning has traditionally relied on manual assessments, which can be time-consuming and prone to errors. The integration of artificial intelligence (AI) has the potential to revolutionise this process, enhancing accuracy and efficiency. A systematic review and meta-analysis were conducted to evaluate the use of AI in orthodontic treatment planning. Seven databases were searched, and studies were selected based on predetermined criteria. Bias evaluation was performed using the QUADAS-AI tool. The meta-analysis revealed a significant overall effect in favour of AI-based methods in determining cephalometric landmarks (pooled mean difference [MD]: 2.85, 95% confidence interval [CI]: 1.48, 4.22) and teeth segmentation (pooled MD: 2.89, 95% CI: 1.53, 4.26). Substantial heterogeneity was observed in both analyses, indicating significant differences between studies. However, the overall results suggest that AI-based methods demonstrate superior accuracy in orthodontic and dental imaging assessments. This systematic review and meta-analysis provide evidence for the potential of AI in enhancing the accuracy and efficiency of orthodontic treatment planning. The results highlight the benefits of AI in improving the speed and accuracy of orthodontic and dental procedures, as well as its potential to augment human capabilities in orthodontic and dental imaging assessments. Further research is needed to develop and refine AI-based systems for specific applications.
Tissue inhibitor of metalloproteinase-1 and fibroscan as predictors for nonalcoholic fatty liver disease in chronic kidney disease patients attending Assiut University Hospitals
Authors: Mostafa Mohammad H. , Tony Effat A.E. , Ashmawy Ahmed M. , Mahmoud Amal A. , Othman Marwa A. , Kamel Yossra M.M.
Published: January 2025

Background

Nonalcoholic fatty liver disease (NAFLD) and chronic kidney disease (CKD) share mechanistic pathways related to metabolic dysfunction. The aim of this study was assessing prevalence of nonalcoholic liver disease among patients with CKD. in addition to, determine the relationship between the severity of fatty liver in nonalcoholic liver disease assessed by liver enzymes and tissue inhibitor of metalloproteinase-1 (TIMP-1).

Patients and methods

The current study enrolled a total of 80 patients with different stages of CKD. It was conducted in the period between March 2020 and March 2021. All patients were subjected to thorough medical history, clinical examination, baseline laboratory data, ultrasound, fibroscan, and also, the level of TIMP-1 was assessed.

Results

A total of 15 (18.8%) patients with CKD had NAFLD while the other 65 (81.2%) patients did not have NAFLD. Patients with NAFLD had significantly higher BMI and TIMP-1. There was a positive correlation between the grade of NAFLD as detected by fibroscan and the stage of CKD. Also, the NAFLD group had a significant difference as regard liver stiffness where the majority (84.6%) of patients without NAFLD had f0 and the majority (73.3%) of those with NAFLD had f1. Predictors for the development of NAFLD among patients with CKD were; TIMP-1, estimated glomerular filtration rate, and degree of fibrosis. TIMP-I at cutoff point greater than 21, has 97.2% accuracy for prediction of NAFLD in patients with CKD while f1 degree of fibroscan has 89.7% accuracy for prediction of NAFLD in patients with CKD.

Conclusion

Patients with CKD are vulnerable to develop NAFLD. Early detection of those patients may help in improving their outcomes. Also, TIMP-1 is considered as a novel biomarker for early diagnosis of NAFLD in patients with CKD. fibroscan is considered an available, cheap, and noninvasive method for assessment of NAFLD severity.
Depression, anxiety, and low quality of sleep among Egyptian hemodialysis patients: a single-center study
Authors: Gawad Mohammed Abdel , Hosny Mohamed , Ayoub Mohamed , Elnahrawy Radwa Saeed , Soultan Mona , Yasser Mahmoud , Mahdy Eman
Published: January 2025

Background

Chronic kidney disease (CKD) significantly impairs the quality of life (QoL) of patients, with hemodialysis (HD) being the predominant kidney replacement therapy (KRT) worldwide. HD patients frequently suffer from various complications, including psychological disorders such as depression, anxiety, and sleep disturbances, which profoundly affect their quality of life. This study aimed to investigate the prevalence of depression, anxiety, and low quality of sleep among Egyptian hemodialysis patients.

Patients and methods

A cross-sectional study was conducted at Abu-Qir Specialty Hospital, Alexandria, Egypt, involving 61 HD patients. Data were collected through individual interviews using validated Arabic versions of the Patient Health Questionnaire depression scale (PHQ-9), Generalized Anxiety Disorder (GAD-7) score, and Pittsburgh Sleep Quality Index (PSQI). Demographic, clinical, and laboratory data were also obtained.

Results

The prevalence of depression, anxiety, and sleep disturbances among HD patients was found to be 67.21%, 50.82%, and 100%, respectively. Multivariate regression analysis revealed that poor sleep quality (P=0.01) and anxiety (P<0.01) were significantly associated with depression. Anxiety was significantly associated with depression (P<0.01) and hemoglobin level (P=0.03). Poor sleep quality was predominantly influenced by depression (P=0.02).

Conclusion

The study highlights the high prevalence of psychological disorders and sleep disturbances among HD patients in Egypt, emphasizing the need for integrated care models. Routine screening and comprehensive management of these conditions are essential to improve quality of life and clinical outcomes. Further research is needed to explore underlying mechanisms and develop effective interventions tailored to HD patients’ unique challenges.
A Study of Symptomatic Umbilical Remnants in Children with Evaluation of the Role of Ultrasound as a Diagnostic Modality
Authors: Meshram Rohit Bhashkar , Pokharkar Ashitosh D. , Lakshmilekiya S. , Solanki Ravi Shankar , Gupta Amit , Yadav Partap Singh , Choudhury Subhasis Roy , Chadha Rajiv
Published: January 2025

ABSTRACT

Aims:

The aim of this study was to study the presentation and management of children with symptomatic “umbilical remnants” (SUmR) and the efficacy of ultrasound (US) in diagnosis and predicting a need for surgery.

Materials and Methods:

This study included 65 children aged 2 months–12 years with clinical findings suggestive of umbilical remnants (UmR): umbilical granuloma (UG); umbilical polyp or prolapsing mucosa, periumbilical inflammation/mass, or persistent umbilical discharge. Investigations included US and bacteriological culture-sensitivity tests of umbilical discharge. UG and umbilical polyps were excised. Minilaparotomy was performed for other SUmR and UG/umbilical polyps where US suggested intra-abdominal pathology. The excised UmR tissue underwent histopathologic examination (HPE) for final diagnosis.

Results:

There were 40 males and 25 females, with a median age of 6 months. The three groups after final diagnosis were (i) UG (n = 38), (ii) vitellointestinal (VI) remnants (n = 21), umbilical polyp (n = 17), patent VI duct (PVID) (n = 3), and umbilical cyst (n = 1), and (iii) urachal remnants (UR) (n = 6), urachal cysts (n = 3) and patent urachus (n = 3). Forty-nine UG/umbilical polyps underwent simple excision. Sixteen (24.6%) patients underwent minilaparotomy, and in seven, US findings correlated with operative findings. US was false positive for intra-abdominal pathology in six cases (UG = 3; umbilical polyp = 3) and false negative in PVID (n = 3). UG and umbilical polyps were differentiated only by HPE. There were no complications or recurrence. On grouping by presentation, US as a diagnostic modality in UG/umbilical polyp had a specificity of 85% with a diagnostic accuracy of 89.09%. In UR, the figures were sensitivity 100%, specificity 0%, positive predictive value (PPV) 100%, negative predictive value (NPV) 0%, and diagnostic accuracy 100%. For VID remnants excluding umbilical polyps, the sensitivity was 25%, specificity 0%, PPV 100%, NPV 0%, and diagnostic accuracy 25%. Overall, the sensitivity of abdominopelvic US as a diagnostic modality in SUmR was 70%, specificity 89%, PPV 53%, and NPV 94% with overall diagnostic accuracy of 84%.

Conclusions:

SUmR is most commonly UG or umbilical polyp and could not be differentiated on clinical grounds alone. In suspected urachal anomalies/UR, US is an effective diagnostic modality. Overall, however, US has relatively low sensitivity and a low PPV and should be regarded as an accessory rather than a very effective diagnostic modality in SUmR. One-stage excision of SUmR is safe and effective. HPE of the excised SUmR is essential for the final diagnosis.
Navigating the Pediatric Inguinal Hernia Repair Conundrum: Occult Bilaterality of Patent Processus Vaginalis as an Indication for Laparoscopy
Authors: Kamesh Siva , Sinha Arvind , Rathod Kirtikumar J , Pathak Manish , Jadhav Avinash , Saxena Rahul , Nayak Shubhalaxmi
Published: January 2025

ABSTRACT

Introduction:

Bilateral inguinal hernia is universally accepted as an indication to repair a pediatric inguinal hernia through the laparoscopic route. However, there is often a debate regarding whether laparoscopic inguinal hernia repair (LIHR) has a role in the management of unilateral inguinal hernia. The aim of the study was to ascertain the incidence of contralateral patent processus vaginalis (PPV) in patients undergoing LIHR.

Materials and Methods:

A retrospective review of the electronic medical records of cases of inguinal hernia who underwent laparoscopic hernia repair in the department during the period from September 2016 to August 2023. Parameters studied included age, gender, side of the hernia, incidence of contralateral PPV, recurrence rates, and complications. As per the protocol, all patients who had an occult bilaterality discovered intraoperatively were repaired in the same sitting after the repair of the presenting side. A review of the literature was also done to find the rationale behind laparoscopic pediatric inguinal hernia repair.

Results:

A total of 255 patients were included in the study. The mean age was 45.2 months and varied from 0 months to 192 months. Ligation of the sac was performed after division or without division, depending on the preference of the operating surgeon. The follow-up varied from 3 months to 7 years (mean 3.8 years). Ten (4.08%) patients had bilateral inguinal hernia at diagnosis, with left-side inguinal hernia in 95 (38.77%) and right-sided hernia in 150 (61.22%). Out of the 245 patients with unilateral inguinal hernia, a contralateral PPV was found in 48 (19.5%) patients. We had a total of seven recurrences in the cohort (2.7%), none of which were seen on the contralateral side, which was closed during the primary procedure itself. All of them occurred in patients aged between 1 and 3 years of age. Of the seven children who had recurrence, two patients had large inguinoscrotal swellings at presentation, and two patients had spinal dysraphism (repaired earlier) along with an inguinal hernia.

Conclusion:

Our results show that out of our cohort of 245 patients with unilateral inguinal hernia, approximately one-fifth of the patients have PPV on the contralateral side. This can be very well repaired in the same sitting via laparoscopy without increasing the morbidity and preventing metachronous hernia on the contralateral side.
Testicular Gangrene without Bowel Ischemia: A Rare Presentation of Neonatal Strangulated Inguinal Hernia
Authors: Jacob Mariya , John Viju
Published: January 2025

ABSTRACT

Inguinal neonatal hernias are common, but testicular gangrene without bowel involvement is rare. We report such a case of strangulated hernia where the bowel loop was healthy and viable but the testes was gangrenous. This case highlights testicular vascular compromise in neonatal strangulated inguinal hernias, even without bowel involvement.
A cross sectional study on minimum dietary diversity and nutritional status among the Children aged 6-23 months in the urban field practice area of Osmania Medical College, Hyderabad, Telangana
Authors: Jayakumar Karthikeyan , Vijayasree L. , Kiranmai B.
Published: January 2025

Background:

As part of infant and young child feeding (IYCF) practices, the World Health Organization (WHO) developed the Minimum dietary diversity (MDD) score to assess nutritional diversity among children aged 6–23 months. MDD was one of the 17 IYCF indicators. Insufficient diversity in diets can lead to poor nutritional status as a result of deficiencies in both macro- and micronutrients.

Objective:

To calculate MDD score in children between 6 and 23 months and to determine the association between MDD and nutritional status among study subjects.

Materials and Methods:

A cross-sectional study was carried out among 320 children of age 6–23 months. Children were selected using simple random sampling. Data were collected from the informant/mother using questionnaire.

Results:

Minimum Dietary Diversity score was 0.5906. A statistically significant association was found between absence of MDD and underweight, stunting, and wasting. The association between absence of MDD and severe acute malnutrition was not statistically significant.

Conclusion:

MDD was an important IYCF indicator and there was a significant association between MDD and nutritional status.