bluuebunny/crossref_metadata_2025 huggingface dataset:
Room Temperature Recovery in Rolled Polycrystalline Copper after many Years
Authors: Tarasiuk Jacek , Bacroix Brigitte , Wierzbanowski Krzysztof , Wroński Sebastian , Gerber P.
Published: April 2012

Eight years ago recrystallization of OFE (oxygen-free electronic) copper was examined in detail using various techniques. In 2008 exactly the same material was measured using EBSD microscopy. The deformed state and fully recrystallized state have been analyzed and compared with data obtained eight years ago. The stored energy (SE) estimated by Image Quality (IQ) analysis was compared in these two cases. A significant amount of recovery took place in the sample, but only in some texture components. Some others present more or less the same SE as eight years ago. The textures of recrystallized samples were compared. We observed that the difference in SE distribution between the two deformed state has an influence on the final textures after recrystallization. Our study confirms the hypothesis that if a grain (orientation) has distinctly lower SE than other orientations - it has the highest growth preference (threshold hypothesis). Such grains (orientations) are dominant in the recrystallization texture.
Study of Recovery and Recrystallisation in Folded BCC, FCC and HCP Sheet Samples
Authors: Ubhi Harvinder Singh , Jiang Hui
Published: April 2012

Microstructural changes due to isothermal heat treatment in the bent regions of cold folded nickel alloy (Ni200), mild steel, and Titanium (Ti6-4) sheet samples, followed by the EBSD (electron back-scattered diffraction) technique are reported. Large strain gradients that vary from being tensile to compressive exist in the bent regions and have been used to study their influence on recovery and recystallisation processes. Isothermal heat treatment at 600°C in the Ni200 and steel sheets results in recrystallisation process to start in regions with the highest strains and progresses towards the centre of folded regions. Grain growth was observed to be dependent on both the sign of the strain and its level. Generally larger grain sizes were associated with tensile strains in both Ni200 and steel. Abnormal grain growth occurred after prolonged heat treatment in the Ni200 sample in regions with low levels of tensile strains found in the middle of the sheet thickness. Although complete recrystallisation was not observed in the steel sample significantly large grains formed in regions with low strain levels. Only recovery processes were observed in the Ti6-4 samples. Some twinning was also observed in Ti6-4 that was confined in the regions with compressive strains. Crystallographic textural changes were observed during this study and will be reported in future publications.
Determining the No-Recrystallization Conditions for Industrial Hot Strip Rolling of Steels Using Laboratory Simulations
Authors: Poliak Evgueni I.
Published: April 2012

Avoiding recrystallization of austenite in hot strip rolling of steels is highly important for enhancing mechanical properties of hot rolled products. The present work focuses on computation of incubation time tinc for static recrystallization using laboratory hot deformation data and on extrapolation the results to industrial conditions. The computations are done based on application of critical conditions for initiation of dynamic recrystallization to the static case. No-recrystallization temperature in hot strip rolling is determined by setting tinc equal to interpass time. Simulations allow for prediction of the onset of austenite static recrystallization after individual rolling passes during industrial hot rolling and evaluation of the effects of strip thickness, rolling speeds, etc.
Modeling the Flow Curve of Hot Deformed Austenite
Authors: Jonas John J. , Quelennec Xavier , Jiang Lan
Published: April 2012

A 0.02%C plain carbon and a 0.22%C TRIP steel were tested in compression in the temperature range 900°C to 1150°C and strain rate range 0.05s-1 to 1s-1. Thirty-two experimental flow curves were obtained in this way. The critical conditions for the initiation of dynamic recrystallization were determined by the double differentiation method. Using a dislocation density model to describe the austenite flow stress, the work hardening parameters r and h were derived and are used to model the flow curve in the absence of dynamic recrystallization. The latter was employed to calculate the fractional softening attributable to dynamic recrystallization. The kinetics of dynamic recrystallization are then described using Avrami kinetics. Finally, the dependences of the Avrami and work hardening parameters on Z, the Zener-Hollomon parameter, are used to model compression flow curves at strain rates an order of magnitude greater than the ones employed in the tests.
Grain Boundary Triple Line Tension in Copper
Authors: Zhao Bing Bing , Shvindlerman Lasar S. , Gottstein Günter
Published: April 2012

The current study introduces a thermodynamically correct approach which allows a direct precise measurement of the grain boundary triple line tension. The experimental technique utilizes the measurement of the surface topography of a crystal in the vicinity of a triple junction and grain boundary groove on thin wires by atomic force microscopy. The grain boundary triple line tension of a random triple line was measured to be in the order of 10-9J/m.
Mesoscopic Simulations of Recrystallization and Grain Growth in a Fe-0.374%C-21.64%Mn Alloy
Authors: Barrales-Mora L.A. , Lü Ya Ping , Molodov Dmitri A. , Gottstein Günter
Published: April 2012

A cellular automaton and a vertex model were used, respectively, for the simulation of recrystallization and grain growth in a Fe-0.374%C-21.64%Mn alloy. The results of the recrystallization simulations revealed that the preferential nucleation during the annealing of the rolled sheet occurs at shear bands, which is corroborated by experimental observations. Subsequently, grain growth simulations were carried out with a 2D vertex model. The model used experimental data as input for its validation in this specific steel. The simulations showed a good agreement with the experimental results.
Globularization of Two-Phase Titanium Alloy during Deformation at 600 and 800°C
Authors: Zherebtsov Sergey V. , Murzinova Maria A. , Salishchev Gennady A.
Published: April 2012

Microstructure evolution and mechanical behavior of alpha/beta Ti-6Al-4V titanium alloy with initial α-colony microstructure during uniaxial compression at 600 and 800°C to a height strain of 70% were studied. It was shown that decrease in deformation temperature considerably influences on the kinetics of globularization of a lamellar microstructure. At the lower temperature stages of strengthening and softening extend that associates with inhibition of globularization. Deformation at 600°C is also associated with a smaller fraction of high-angle boundaries during deformation, smaller fraction of globular grains, increased contribution of shear deformation and more intensive rotation of α-lamellae towards the metal flow direction. In contrast to 800°C, the rate of thinning of α-lamellae at the lower temperature is noticeably higher. The results obtained are related to the change of the type of dislocation slip in α-lamellae due to inhibition of dynamic recovery with decreasing deformation temperature.
Spatially Inhomogeneous Recrystallization in Ferritic Stainless Steels
Authors: Lefebvre Guillaume , Shahandeh Sina , Sinclair Chad W. , Militzer Matthias , Mithieux Jean Denis , Laigo Johanne
Published: April 2012

The kinetics of static recrystallization in cold rolled ferritic stainless steel sheet tends to slow drastically over the last 10-20% of recrystallization. This has its origins in both the microstructure (deformed grain shape, precipitates) and in the local deformation texture. In this work we have sought to provide a physical explanation for the slow last stages of recrystallization through a texture dependent JMAK model which is informed by the microstructure of the partially recrystallized microstructure. The geometrical assumptions made in developing this JMAK model have been compared to phase field simulations using experimental observations as the source of their starting configuration.
Texture Control in Steel and Aluminium Alloys by Rolling and Recrystallization in Non-Conventional Sheet Manufacturing
Authors: Kestens Leo , Sidor Jurij J. , Petrov Roumen H. , Nguyen Minh Tuan
Published: April 2012

The sheet manufacturing process, which involves various solid-state transformations such as phase transformations, plastic deformation and thermally activated recovery processes, determines the texture of steel and aluminium sheet. The conventional process of flat rolling and annealing only offers limited degrees of freedom to modify the texture of the final product. After annealing a {111} recrystallization fibre in BCC alloys and a cube dominated recrystallization texture in FCC metals is commonly obtained. Many applications, however, require other texture components than the ones achievable by conventional processing. In the present paper it is shown that by asymmetric rolling of a Si-alloyed ultra-low carbon steel a texture can be obtained with increased intensity on the {001} fibre, which is of interest for magnetic applications. Also in aluminium alloys the strong cube annealing texture can be drastically modified by the process of asymmetric rolling. It is argued that by observing the proper rolling and annealing conditions a recrystallization texture with improved normal and planar anisotropy of the mechanical properties may be produced.
Structural Changes in a 9%Cr Creep Resistant Steel during Creep Test
Authors: Dudko Valeriy , Belyakov Andrey , Skorobogatykh Vladimir , Schenkova Izabella , Kaibyshev Rustam
Published: April 2012

Structural changes in a 9%Cr martensitic steel after 1%, 4% creep and creep rupture test at 650°C and stress of 118 MPa were examined. Heat treatment provided the formation of tempered martensite lath structure (TMLS) in the steel. The precipitations of second phase particles along block and lath boundaries provide effective stabilization of the TMSL under annealing/aging condition. This structure hardly changed under creep conditions in grip portion of crept sample. Significant coarsening of both the second phase particles and the martensite laths takes place in neck portion. In addition, the latter ones lose their original morphology and are replaced by large strain-induced subgrains. It should be noted that the increase of subgrain size is in almost direct proportion to the particle growth during the creep to 4% strain. The rapid growth of martesite laths followed by their evolution to deformation subgrains takes place within the tertiary creep regime.
Formation of Texture in AZ80 during High Temperature Compression Deformation
Authors: Kim Jinuk , Okayasu Kazuto , Fukutomi Hiroshi
Published: April 2012

Formation behavior of texture during high temperature compression of AZ80 is investigated on the specimens produced from the extruded bar and rolled plate. Special attention is paid on the formation of (0001) (compression plane) texture. Before deformation, (0001) is distributed frequently parallel to the compression plane in the specimen produced from the rolled plates, while (0001) is frequently normal to the compression plane in the specimen produced from the extruded bar. The deformation is performed at temperatures and strain rates ranging from 673K to 723K and 1.0×10-4s-1 to 5.0×10-2s-1, respectively. It is found that fiber textures are formed by the deformation and the main component of the texture varies depending on the deformation conditions. The sharpness of (0001) texture after deformation in the specimen produced from extruded bar is much weaker than that in the specimen produced from rolled plate. It is concluded that the growth of (0001) grains during deformation is the basic process for the (0001) texture evolution.
Magnetically Affected Texture and Microstructure Evolution during Grain Growth in Zirconium
Authors: Molodov Dmitri A. , Bozzolo Nathalie
Published: April 2012

The effect of a magnetic field on texture and microstructure development in cold rolled (80%) commercially pure zirconium (Zr701) was investigated. X-ray diffraction and EBSD measurements were utilized for the texture and microstructure characterization. The results revealed that a magnetic field promotes grain growth in the investigated material. During annealings at 550°C this is particularly apparent from the faster development of specific (0/180, 35, 30) texture components and the bigger mean grain size after magnetic annealing. The magnetic annealing at 700°C resulted in an asymmetry of the two major texture components. This is due to a magnetic driving force for grain growth arising from the anisotropic magnetic susceptibility of zirconium. During annealing at 700°C the abnormal grain growth occurred. This behavior is attributed to the higher mobility of grain boundaries between grains misoriented by 30° around [000. The magnetic field essentially enhanced the observed abnormal grain growth.
Annealing Phenomena in Cu/Ni Composite Electrodeposit
Authors: Kim K.H. , Kang D.H. , Park Yong Bum
Published: April 2012

Cu/Ni composite electrodeposit was fabricated by electroplating nickel on the both sides of an electroplated copper sheet. In order to lower interfacial stresses between copper and nickel, the microstructure of nickel was controlled to consist of grains with a mean size of 15 nanometers. The different parts of the composite electrodeposit underwent different evolution of textures and microstructures during annealing. In the Cu electrodeposit, the as-deposited texture characterized by a relatively high <100>//ND and twin components transformed to be diffuse due to grain growth during annealing above 300°C. This is attributed to a large number of twins conducting the as-deposited microstructure. On the other hand, in the Ni electrodeposit, grain growth that takes place during annealing above 250°C corresponds to abnormal grain growth in terms of the scale change of the grain size. This grain growth also transformed the as-deposited texture of strong <100>//ND into a diffuse texture. In the interface between copper and nickel, the atomic diffusion was generated by excessive vacancies resulting from the grain growth during the annealing of nanostructured Ni electrodeposit. An 'interface texture' began to developed in the previous Cu region above 500°C, and the microtexture development was similar to the growth texture of the annealed Ni electrodeposit.
The Evolution of Structure and Mechanical Properties of Fe-Mn-V-Ti-0,1C Low-Carbon Steel Subjected to Severe Plastic Deformation and Subsequent Annealing
Authors: Zakharova Galina G. , Astafurova Elena G. , Naydenkin Evgeny V. , Raab Georgy I. , Dobatkin Sergey V.
Published: April 2012

The present work deals with the evolution of mechanical properties and structure of low-carbon Fe-1,12Mn-0,08V-0,07Ti-0,1C (wt.%) steel after severe plastic deformation (SPD) and high-temperature annealing. Steel in initial ferritic-pearlitic state was deformed by equal channel angular pressing (ECAP) at T=200°C and high pressure torsion (HPT) at room temperature. The evolution of ultrafine grained structure and its thermal stability were investigated after annealing at 400-700°C for 1 hour. The results shown that SPD leads to formation of structure with an average size of (sub-) grain of 260 nm after ECAP and 90 nm after HPT. Ultrafine grained structures produced by SPD reveal a high thermal stability up to 500°C after ECAP and 400°C after HPT. At higher annealing temperatures a growth of structural elements and a decrease in microhardness were observed.
All-Wet, Metal-Compatible High-Dose-Implanted Photoresist Strip
Authors: Totir George G. , Khojasteh Mahmoud , Nunes Ronald , Cooper Emanuel I. , Kern Matthew , van Berkel Kim , Payne Makonnen , Dellaguardia Ronald , To Bang , Maurer Siegfried
Published: April 2012

An all-wet process based on a novel chemistry has been developed to enable the removal of high-dose implanted photoresist in the presence of exposed metal layers and other materials typical of advanced gate stacks.
Comparisons of Various Physical Cleaning
Authors: Bae Sang Won , Kang Dae Hyuk , Lee Hyo San , Lee Kun Tack , Koh Yong Sun
Published: April 2012

Physical cleaning uses the physical force for particle removing process and the physical force can be represented by PRE(%) and pattern damage. Using the damage proving pattern, which was composed with conductive material for electrical detection, the damage of physical cleaning was quantitatively analyzed. And pattern damage was calculated with a form of damage density and plotted with pattern CD. Using PRE(%) and three parameters, which were derived in the damage density plot, the comparison of various physical cleaning was performed..
Thermomechanical Resist Removal-Cleaning System Using Cryogenic Micro-Slush Jet
Authors: Ishimoto Jun , Tan Daisuke , Ohtake Hiroto , Samukawa Seiji
Published: April 2012

The fundamental characteristics of the resist removal-cleaning system using cryogenic micro-solid nitrogen spray flow were investigated by a new type of integrated measurement technique. The present system utilizes the micro-solid nitrogen (SN2) which consists of the fine solid nitrogen particle produced by the high-speed collision of subcooled liquid nitrogen and the cryogenic gaseous helium (cryogen). According to present study, the effect of ultra-high heat flux cooling on the resist removal performance due to the rapid thermal contraction of resist material is clarified in detail. Furthermore, the effect of ultrasonic atomization of micro-solid nitrogen on ultra-clean performance of the wafer is newly founded.
Development of a Novel Advanced Spray Technology Based on Investigation of Droplet Energy and Pattern Damage
Authors: Tanaka T. , Sato M. , Kobayashi M. , Shirakawa H.
Published: April 2012

A novel advanced spray technology, in which droplet size and velocity are accurately and tightly controlled, has been developed to realize the damage-free cleaning for next generation device manufacturing. The influence of droplet characteristics on pattern collapse/damage was quantitatively investigated using this technology. It was shown that the amount of damage was correlated to the droplet energy density on the wafer. The mechanism of pattern damage generated by the conventional dual fluid spray was revealed by the damage threshold curve, which was obtained from the theoretical consideration. Finally higher particle removal efficiency without any pattern damage was achieved by controlling the distribution of effective droplets for cleaning.
Comparison of Gold Particle Removal from Fused Silica and Thermal Oxide Surfaces in Dilute Ammonium Hydroxide Solutions
Authors: Pandit Viraj , Keswani Manish , Siddiqui Shariq , Raghavan Srini
Published: April 2012

Removal of gold particles (40 nm and 100 nm) from fused silica and thermal oxide surfaces in dilute ammonium hydroxide solutions has been investigated. The particle removal efficiency (PRE) from fused silica surface has been found to be a strong function of ammonium hydroxide concentration and bath temperature. PRE increases from 0 to 85 % with increase in bath temperature from 30 to 80 °C for ammonium hydroxide concentration of 1 %. Addition of megasonic energy to the ammonium hydroxide bath at 30 °C has also shown to improve the PRE significantly. In the case of thermal oxide, the removal of gold particles is much easier compared to that from fused silica. Even for cleaning at 30 °C, the PRE for oxide surface increases from 10 to 90 % with increase in ammonium hydroxide concentration from 0 % to 4 %. Atomic force microscopy measurements reveal that an adhesion force of 10 mN/m exists between fused silica and gold particles in 4 % ammonium hydroxide solution as opposed to only repulsive force in the case of thermal oxide.
Characterization of Low-k Dielectric Etch Residue on the Sidewall by Chemical Force Microscope
Authors: Kim Tae Gon , Le Quoc Toan , Suhard Samuel , Lux Marcel , Vereecke Guy , Claes Martine , Struyf Herbert , De Gendt Stefan , Mertens Paul W. , Heyns Marc M.
Published: April 2012

Atomic force microscope (AFM) with inclined sample measurement and hydrophobic functionalized AFM probe was used to visualize the sidewall of low-k pattern and allowed to characterize the hydrophobic characteristics on the sidewall after low-k etch. To functionalized the AFM probe, 1H,1H,2H,2H-Perfluorodecyltrichlorosilane (FDTS) as a hydrophobic film was coated on an AFM probe. Because of the magnitude of the phobic-phobic interaction force and the tip forced to make a phase shift. Using this technique the visualization and characterization of the etch residue on the low-k sidewall can be successfully performed. It is shown that the investigation toward an effective chemical clean for the etch residue removal could be applicable.
Modification of Post-Etch Residues by UV for Wet Removal
Authors: Le Quoc Toan , Drieskens F. , Conard T. , Lux M. , de Marneffe J.F. , Struyf H. , Vereecke G.
Published: April 2012

In back-end of line processing, the polymer deposited on the dielectric sidewalls during the etch must be removed prior to subsequent processing steps to achieve high adhesion and good coverage of materials deposited in the etched features [1,. Typically, this is done by a combination of short plasma treatment and diluted wet clean, or by wet cleans alone. On the one hand, for porous dielectric stacks, a mild plasma treatment that preserves the integrity of the low-k dielectrics would not be sufficient to efficiently remove this residue. Furthermore, aqueous cleaning solutions is not efficient to achieve a complete removal without etching the underlying layer. Hence appropriate wet clean chemistries are needed to dissolve/decompose these polymers without etching the dielectric. On the other hand, analytical techniques available for direct characterization of sidewall polymer are limited. For a fast screening of potential chemistries capable of dissolving/removing polymer residues generated during the low-k etch, a fluoropolymer deposited on a blanket, checkerboard low-k substrate was used as a model polymer. In our recent study [, using X-ray photoelectron spectroscopy (XPS), it was shown that the polymer was composed of CF, CF2, and CF3 groups. This model polymer was found to be very similar to the polymer residue generated during the etch of the low-k stack using similar plasma. The present study mainly focused on the effect of UV treatment and the concentration of active component in wet clean solution on the structure change of the polymer and the enhancement of polymer removal.
ESH Friendly Solvent for Stripping Positive and Negative Photoresists in 3D-Wafer Level Packaging and 3D-Stacked IC Applications
Authors: Suhard Samuel , Claes Martine , Civale Yann , Nolmans Philip , Sabuncuoglu Tezcan Deniz , Travaly Youssef
Published: April 2012

NMP is a commonly used solvent for removing positive photoresist in 3D applications, especially in electroplating and (micro-) bumping. However, the negative photoresists are more and more preferred in these applications. Unfortunately, NMP is inefficient for negative photoresist and it is not considered in Europe as an ESH solvent anymore. In this paper a comparative study was carried out in order to identify a solvent that is ESH friendly and a one-size-fits-all solution for stripping negative-tone and thick positive-tone photoresist (2-22 μm) for (micro-) bumping, electroplating and TSV etch applications. The study was performed at tool level.
S-Passivation of the Ge Gate Stack Using (NH4)2S
Authors: Sioncke Sonja , Fleischmann Claudia , Lin Dennis , Vrancken Evi , Caymax Matty , Meuris Marc , Temst Kristiaan , Vantomme André , Müller Matthias , Kolbe Michael , Beckhoff Burkhard
Published: April 2012

The last decennia, a lot of effort has been made to introduce new channel materials in a Si process flow. High mobility materials such as Ge need a good gate stack passivation in order to ensure optimal MOSFET operation. Several routes for passivating the Ge gate stack have been explored in the last years. We present here the S-passivation of the Ge gate stack: (NH4)2S is used to create a S-terminated Ge surface. In this paper the S-treatment is discussed. The S-terminated Ge surface is not chemically passive but can still react with air. After gate oxide deposition, the Ge-S bonds are preserved and an adequate passivation is found for pMOS operation.
TiN Metal Hardmask Etch Residue Removal on Advanced Porous Low-k and Cu Device with Corner Rounding Scheme
Authors: Cui Hua , Claes Martine , Suhard Samuel
Published: April 2012

A novel wet cleaning formulation approach was developed with a TiN etch rate of more than 30 Å/min at room temperature and more than 100 Å/min at 50°C. The chemicals are compatible with Cu and low-k materials, and are suitable for Cu dual damascene interconnect 28 nm and smaller technology node applications. The chemicals offer a route to in situ controlled TiN pullback or even complete removal of the TiN mask during the cleaning process in single wafer tool applications. The chemicals do not contain NH4OH or TMAH and so are very user-friendly.
Indirect Ultra-Pure Water Metals Analysis by Extended Ion Exchange on a Silica Surface
Authors: Shive Larry W. , Liang Hai He , Grabbe Alexis , Kweskin Sasha
Published: April 2012

Water purity is not taken for granted in the Semiconductor Industry. Ultra high purity water (UPW) is analyzed continuously in-line for particles and resistivity. Routine samples are automatically taken for total organic carbon (TOC), boron, silica and dissolved oxygen. Less routine analyses, such as metals, are done off-line. Metal content of UPW water is well below the detection limits of ICP-MS even with a pre-concentration step. As a result, metals content may vary in the water without being detected. These variations may affect device performance and yield while the root cause may go undetected.
Concentration of Three Organic Compounds Influencing each other on Silicon Surface
Authors: Habuka Hitoshi , Naito Tatsuhito , Kawahara Norihiro
Published: April 2012

The surface concentrations of organic compounds in a three-component (isopropanol-diethylphthalate-octanol) system were in situ measured using a quartz crystal microbalance. Additionally, the surface concentrations were calculated on the basis of the rate theory, to show that the surface concentration of organic compound was influenced by the other organic compounds. The net situation of airborne organic contamination may change, even when the total amount of organic compounds adsorbed on silicon surface seems to be in a steady state.
Environmentally Benign In-Line Cleaning Solutions for Immersion Lithography Tools
Authors: Chen Tian Niu , Korzenski Michael B. , Bilodeau Steve , Zhang Peng , Hogan Todd , van Berkel Kim , Mirth George , Mih Rebecca , Hoekerd Kornel , Jansen Bauke , Vangheluwe Rik , Schuh Nadja
Published: April 2012

A pH neutral formulation 3x to perform the in-line cleaning of resists/topcoats contaminated immersion assembly efficiently and effectively has been developed. It is environmentally benign with no halides, no individual component having a flash point above 38°C or known to cause cancer, birth defects or other reproductive harm.
Novel Texture Etch Chemistry for Transparent Conducting Oxides Used in Photovoltaic Cells
Authors: Verhaverbeke Steven , Gouk Roman , Leschkies Kurtis , Visser Robert
Published: April 2012

In thin film photovoltaic silicon stacks, the sun facing contact needs to be transparent and textured. Typically transparent metal oxides are used for this purpose. When using sputtered ZnO as the transparent conducting contact typically an acid etch is used to texture etch the surface. This texturing enables light trapping in the cell and greatly enhances the photoresponse. Traditionally dilute HCl has been used for this purpose. In this paper we present the work on a novel etchant for this purpose consisting of HNO3 and Acetic Acid. This greatly enhances the texturing and hence the light trapping in the cell.
Study on Al2O3 Film in Anhydrous HF Vapor
Authors: Ritala Heini , Tuohiniemi Mikko
Published: April 2012

HF vapor etching using thin Al2O3film as etch stop material was studied. It was found that behavior of Al2O3film in HF vapor can not be predicted from the blanket film studies only but it is important to use samples that resemble closely real process conditions instead. Resistivity of Al2O3against HF vapor depends on whether a SiO2was etched on top of it or not. Other affecting factors are the thickness of the Al2O3film, HF vapor process, stress of the oxide on top of it as well as topography under it. Even very thin 3 nm Al2O3film resist HF vapor if no SiO2film is etched on top of it and etch process is slow enough.
Elucidation of an Isopropyl Alcohol (IPA) Adsorption Phenomenon on a Wafer Surface for Achieving an Ultra-Clean and IPA-Saving Drying Process in the Batch Cleaning System
Authors: Hagimoto Yoshiya , Tetsuka Tomoki , Iwamoto Hayato , Hyakutake Hironobu , Tanaka Hiroshi
Published: April 2012

Displacing the water remaining on a wafer surface by using condensed IPA improves the effectiveness of IPA-based drying techniques. Although this drying technology has been used for years, recent device technologies have needed extremely high-performance drying processes. We characterized an IPA adsorption phenomenon on a wafer surface by using the batch cleaning system and determined the appropriate drying conditions. Our results revealed that the IPA supply rate had a great influence on watermark formation. This can be prevented by increasing the IPA supply rate because the rapid increase of IPA concentration in the remaining water on wafer surface suppresses the dissolution of silicon into water. Through both understanding of an IPA adsorption on a wafer surface and control of the drying condition, an ultra-clean and IPA-saving drying process with a watermark-free performance for future device technologies can be achieved.
High Temperature SPM Process Study for Stripping of Implanted Photoresist
Authors: Yeh Matt , Hsu Fan Yi , Lin Shun Wu , Liao Ducky , Houyang Eric , Yang T.J. , Ku Scott , Yang C.M.
Published: April 2012

Advanced device is more sensitive to material loss and dopant fluctuation, that might strongly influence device performance. Conventional dry ash process for implanted photoresist strip can not meet the requirement of material loss minimization of advanced device. Full wet process for resist strip was first successfully demonstrated at 22nm structure wafer to gain 50% silicon loss reduction. Besides, full wet process also demonstrated defect cleaning performance was even better than conventional approach. This work focused on mechanism study of Si3N4 and SiO2 film loss induced by high temperature SPM process.
Scanning Probe Microscopy Imaging before and after Atomic Layer Oxide Deposition on a Compound Semiconductor Surface
Authors: Melitz W. , Clemens J.B. , Shen J. , Chagarov E.A. , Lee S. , Lee J.S. , Royer J.E. , Holland M. , Bentley S. , McIntyre D. , Thayne I. , Droopad R. , Kummel A.C.
Published: April 2012

The megasonic cleaning efficiency is evaluated as a function of the angle of incidence of acoustic waves on a Si wafer. Acoustic Schlichting streaming alone is not able to remove nanoparticles smaller than 400 nm. It is shown that oscillating or collapsing behavior of bubbles are responsible for removing nanoparticles smaller than 400 nm during a cleaning process with ultrasound. Optimal particle removal efficiency is obtained around the angle of acoustic transmission of the silicon wafer.
Study of Controlled Oxygen Diffusion Approaches for Advanced Photoresist Strip
Authors: Luo Shi Jian , Escorcia Orlando , Mattson David , Waldfried Carlo , Roh Dong Wan , Berry III Ivan
Published: April 2012

Two alternative plasma strip processes were developed to meet the photoresist (PR) removal requirements of future technology nodes. Compared to traditional oxidizing chemistries, the new plasma strip approaches showed significantly lower silicon oxidation and substrate loss, while achieving good residue removal capabilities. Plasma strip-induced dopant loss and profile changes were also evaluated for gate-first and gate-last high-k/metal gate applications.
Sero-survey of Hepatitis B surface antigen amongst pregnant women attending Infectious Disease Hospital Bayara, Bauchi State, Nigeria
Authors: Ndako James A. , Echeonwu Georgebest ON. , Nwankiti Obinna O. , Onovoh Emamuzou M. , Jah Alloysius U. , Shidali Nathaniel N. , Ikani Patrick A.
Published: April 2012

Hepatitis B virus (HBV) continues to cause serious health problems in developing countries. Neonatal infection with HBV, which is often acquired during delivery, carries a high risk resulting in persistent infection. This research aims to detect the prevalence of Hepatitis B surface Antigen (HBsAg) among pregnant women in our location of study. One hundred and eighty (180) sera samples were screened among pregnant women aged 13-49, using standard enzyme-linked immunosorbent assay (ELISA) method. Structured questionnaire were administered to the subjects to obtain demographic and other relevant data. Overall result showed that 31 (17.2%) were found to be positive for HBsAg among the total subjects screened. The highest prevalence was found among those aged 20-29 with 11 (6.1%) seropositivity (x2=7.902; P=0.048). Considering occupational distribution of volunteer subjects, a high prevalence of 12 (6.7%); P<0.05 was recorded among house wives, which shows a measure of significance compared to other women screened. Furthermore, based on various risk factors subjects with history of surgery and use of unsterilized sharp instruments recorded 15 (8.3%) prevalence (P=0.233; P>0.05). How ever, women in their second trimester of pregnancy recorded a higher prevalence of 23 (12.8%):(P=0.080; P<0.05). This study therefore emphasizes the public health importance of HBV among pregnant women and equally suggests that children born to women with Hepatitis B Virus, be closely monitored for infection beyond the one and the half years of age, this also calls for a proper enlightenment on the dangers posed by the virus, while a well designed vaccination schedule is advocated among the general population.
Non-Invasive Ventilation in Acute Respiratory Failure in Children
Authors: Abadesso Clara , Nunes Pedro , Silvestre Catarina , Matias Ester , Loureiro Helena , Almeida Helena
Published: April 2012

The aim of this paper is to assess the clinical efficacy of non-invasive ventilation (NIV) in avoiding endotracheal intubation (ETI), to demonstrate clinical and gasometric improvement and to identify predictive risk factors associated with NIV failure. An observational prospective clinical study was carried out. Included Patients with acute respiratory disease (ARD) treated with NIV, from November 2006 to January 2010 in a Pediatric Intensive Care Unit (PICU). NIV was used in 151 patients with acute respiratory failure (ARF). Patients were divided in two groups: NIV success and NIV failure, if ETI was required. Mean age was 7.2±20.3 months (median: 1 min: 0,3 max.: 156). Main diagnoses were bronchiolitis in 102 (67.5%), and pneumonia in 44 (29%) patients. There was a significant improvement in respiratory rate (RR), heart rate (HR), pH, and pCO2 at 2, 6, 12 and 24 hours after NIV onset (P<0.05) in both groups. Improvement in pulse oximetric saturation/ fraction of inspired oxygen (SpO2/FiO2) was verified at 2, 4, 6, 12 and 24 hours after NIV onset in the success group (P<0.001). In the failure group, significant SpO2/FiO2 improvement was only observed in the first 4 hours. NIV failure occurred in 34 patients (22.5%). Risk factors for NIV failure were apnea, prematurity, pneumonia, and bacterial co-infection (P<0.05). Independent risk factors for NIV failure were apneia (P<0.001; odds ratio 15.8; 95% confidence interval: 3.42-71.4) and pneumonia (P<0.001, odds ratio 31.25; 95% confidence interval: 8.33-111.11). There were no major complications related with NIV. In conclusion this study demonstrates the efficacy of NIV as a form of respiratory support for children and infants with ARF, preventing clinical deterioration and avoiding ETI in most of the patients. Risk factors for failure were related with immaturity and severe infection.
Collision Tumor in form of Primary Adenocarcinoma and Neuroendocrine Carcinoma of the Duodenum
Authors: Peng Lan , Schwarz Roderich E.
Published: April 2012

Collision tumor is a rare phenomenon characterized by coexistence of completely distinct and independent tumors at the same body location. Collision tumors have been reported in different sites. However, they are extremely uncommon in the duodenum. We report the case of a 52-year old man with a collision tumor in the third portion of the duodenum with two distinct tumors of primary adenocarcinoma and neuroendocrine carcinoma, and both tumors coexisting within a single metastatic lymph node. Immunohistochemistry studies were performed to conclude that this was a case of collision cancer. To the best of our knowledge, this is the first collision tumor case reported to date at this location, and the first report of lymph node with a collision metastasis from a collision tumor. Such tumor is very rare and may thus provide diagnostic challenges. This report also provides a review of other cases on duodenal collision tumors.
Ground subsidence geo-hazards induced by rapid urbanization: implications from InSAR observation and geological analysis
Authors: Chen F. , Lin H. , Zhang Y. , Lu Z.
Published: April 2012

Abstract. Due to the convenient transportation and construction, cities are prone to be situated in areas with flat terrain and unstable sediments, resulting in the concurrence of ground subsidence and urbanization. Here the interaction between geology, anthropogenic processes and ground subsidence geo-hazards were investigated in the Greater Pearl River Delta region of China. Geological evidences and 2006–2010 persistent scatterer data indicate that anthropogenic activities are dominant, although the distribution of river system and Quaternary sediments are also highly related to significant displacements (primarily at a rate of −15 to 15 mm a−1). The surface displacements derived by synthetic aperture radar interferometry suggest that the urbanization rhythm has to be routinely monitored. Considering analogous urbanization modes, particularly in developing countries, ground subsidence monitoring together with the analysis of its driving force are critical for geo-hazards early-warning, city planning as well as sustainable urbanization.
Interpretation of Consent Decrees and Microsoft v. United States I: Making Law in the Shadow of Negotiation
Authors: Anderson Lloyd C.
Published: April 2012

People negotiate agreements "in the shadow of the law," whether in the private ordering of affairs such as drafting contracts or in the public forum of settling lawsuits.[1] A reverse phenomenon, however, has gone largely unnoticed: judges occasionally declare law in the shadow of negotiated settlements. In interpreting the terms of a consent decree[2] when the parties themselves cannot agree on what obligations such terms impose, the judge may determine that both the words and the parties' own intentions are so ambiguous that the words must be interpreted in light of the substantive law that gave rise to the plaintiffs' claim. This writer has previously contended that the meaning of an ambiguous term should be determined, in part, "by reference to the constitutional or statutory rights sought to be vindicated in the litigation." Even if the law is somewhat uncertain, part of the judge's interpretive effort should be to determine which interpretation "will best serve the policies of the relevant law."[3] It appears that the federal courts, at least, have adopted this position.[4]
The DMCA and Researchers' First Amendment Rights
Authors: McCall Amy E.
Published: April 2012

The Digital Millennium Copyright Act, or DMCA, was enacted by Congress in October of 1998.1 Section 1201(a)(1) of the Act, known as the "anti-circumvention" provision, states that "[n]o person shall circumvent a technological measure that effectively controls access to a [digital] work protected under this title.".2 Sections 1201(a)(2) and 1201(b) combine to form the "anti-trafficking" provisions, which provide that no one shall distribute technology that can accomplish this circumvention.3 Congress constructed a two-year delay in implementation of these provisions, thus, on October 28, 2000, circumvention of effective technological controls became punishable by both civil and criminal actions.4 Unfortunately, the presence of these provisions, along with courts refusal to recognize traditional copyright privileges and defenses in this area of "paracopyright,"5 chills programmers' speech.
Drafting Intellectual Property Joint Venture Agreements with an Eye Toward Termination
Authors: Taylor Jackie
Published: April 2012

When joint venture ("JV") parents come together with a business idea, they expect to develop the resulting intellectual property ("IP") to the benefit of all parents. The joint venture agreement ("JVA") is crucial to the formation and operation of the IP JV. Careful drafting will account for the parties’ expectations regarding the parents’ and the JV’s IP. However, the parties should realize that the JVA is also crucial to the termination of the JV. The JV parents must accept the reality that all JVs must come to an end, and some JVs will come to an end sooner than one of the parties might have wished. Therefore, parties to the JVA should devise a plan for termination in advance.
High Tech Hunks of Steel: Fixed-Site Amusement Rides and Safety Under State Regulation
Authors: Kingsley Jennifer
Published: April 2012

Tomorrow is the big day! Little Bobby Missoula is going to turn ten tomorrow and his parents have promised to take him to Outlandish Adventures, an amusement park that Bobby has seen advertised on television. As Bobby drifts off to sleep, he begins to dream about the fun that he will have on his birthday. He dreams about the smell of cotton candy and the yells of carnies soliciting people in to play their games, but most of all, he dreams about the Lightning Bolt - the tallest, fastest, and scariest roller coaster that little Bobby has ever seen. In his dream, the Lightning Bolt whips Bobby around sharp angles, through upside down loops so close to water that Bobby’s hair and face get wet, down vertical descents at speeds over 100 miles per hour, and finally to an abrupt stop where Bobby rushes to the end of the line to do it all over again.
Just When U Thought it was All Over, Gator's Kin Pops Up and Slides Out of Dangerous IP Waters (for the Most Part): A Review of Two Online Pop-Up Advertisers and 4 Internet Law Decisions
Authors: Cody Jason Allen
Published: April 2012

This Article follows on the heels of an article I recently wrote that focuses on the online advertising activities of The Gator Corporation and legal implications of the preliminary injunction issued in that case.4 I previously concluded that Gator’s pop-up advertising scheme did not violate copyright law,5 but that it did violate trademark law, based in large on survey results showing significant consumer confusion at that point in time.6 To remove consumer confusion, I recommended that Gator: (1) notify Internet users more prominently about downloading Gator software; (2) remind consumers that they authorized pop-up ads to appear; (3) adequately display its trademarks in its pop-up ads; and (4) disclaim affiliation with URLs that have not authorized its ads.7
The Fine Line between Security and Liberty: The "Secret" Court Struggle to Determine the Path of Foreign Intelligence Surveillance in the Wake of September 11th
Authors: Bungard Jessica M.
Published: April 2012

The structure of the United States federal court system can be considered common knowledge: the Supreme Court sits atop a pyramid of lower circuit courts and trial courts, all of which are, for the most part, open to the public. Until 2002, most Americans were unaware of the existence of a "secret" court whose sole duty is to review and approve applications authorizing foreign intelligence surveillance conducted by the Executive Branch. The year 2002 was an unprecedented year for the Foreign Intelligence Surveillance Court ("FISC"),3 and the statute that created it, the Foreign Intelligence Surveillance Act of 1978 ("FISA").4 For the first time in FISA's twenty-three year history, FISC denied an application for electronic surveillance and the Foreign Intelligence Surveillance Court of Review ("Court of Review") was convened to hear its first appeal.5
What's in Your Bottle?: Shire US Inc. v. Barr Laboratories Inc. and Its Effect on Prescription Drug Trade Dress Protection in the Third Circuit
Authors: Pile Aaron M.
Published: April 2012

The pharmaceutical industry may have lost its ability to differentiate prescription drug tablets from generic imitations in light of the Third Circuit’s decision in Shire US Inc. v. Barr Laboratories Inc.1 Traditional trade dress jurisprudence has long recognized a cause of action whereby a national brand-name manufacturer can sue to protect its product’s identity from a generically manufactured facsimile. Such an action normally arises when a generic manufacturer copies the appearance of a brand-name product, thereby gaining instant product recognition based on the brand-name manufacturer’s established marketing and accumulated goodwill.2 Trademark common law and the Lanham Act protect brand-name manufacturers from such unfair trade practices.3 Over-the-counter drugs are packaged in containers bearing manufacturers’ names and markings, enabling consumers to differentiate between, for example, Ecotrin™ aspirin and generic CVS store brand aspirin.4 When a generic manufacturer’s label is sufficiently similar to that of an established product, the Lanham Act dictates that the generic manufacturer must cease selling its product.5 Even when products, i.e., tablets, are physically identical, packaging labels serve as sufficient identification of their source.
Doe v. Ashcroft and Its Place in the Judicial Trend: How the Courts Have Advanced Civil Liberties in Step with Advances in Technology
Authors: Glasgow Craig M.
Published: April 2012

As many jurists and scholars have noted, the United States has a long-standing history of encroaching upon the civil liberties of its citizens, especially during times of war or conflict.2 For instance, during the Civil War, President Lincoln unilaterally suspended the writ of habeas corpus in response to increased violence and the threat of Southern succession.3 During World War I, Postmaster General Albert Burleson used the Espionage Act to suspend mailing privileges for certain “non-mailable” materials, such as newspapers and other dissident publications critical of the war effort.4
Who's Walking the Plank?: The Recording Industry's Fight to Stop Music Piracy
Authors: Dye James
Published: April 2012

The advent of the Internet has forever changed the way people interact, communicate, and share information. The World Wide Web allows Internet users to send a letter in a matter of seconds, to instantly find out the latest sports scores and stock prices, or to learn of breaking world news. The Internet even allows people to have realtime conversations with other Internet users anywhere around the world. The Internet has also provided users a medium through which they can engage in any number of illicit acts. One of the more popular illicit acts, engaged in by millions of Internet users, involves trading music files across file sharing networks. Users accomplish this file sharing, or pirating, by copying the music from a compact disc onto their computers and uploading a file of the copied music onto a network created by software such as Kazaa or Napster. An infinite number of other users can then access this network, providing them an instant ability to copy the file of that song to their own computers.