bluuebunny/crossref_metadata_2025 huggingface dataset:
Une esthétique post-média
Authors: Manovich Lev
Published: September 2017

(1) La crise du médium qui a touché le monde de l’art s’explique par l’efflorescence de pratiques artistiques et par l’irruption des médias dans la sphère de l’art (photographie et cinéma, puis télévision et vidéo). La logique et les techniques de la culture de masse venaient faire effraction dans la logique plus aristocratique de l’art traditionnel. (2) Une autre déferlante devait venir porter l’estocade : les technologies numériques qui révolutionnaient les conditions de production et de réception des biens culturels. L’idée d’une œuvre multimédia, déclinable sur divers supports, usant d’outils d’édition ou de remixage s’imposait. (3) Une esthétique post-média peut donc s’ébaucher, fondée sur de nouvelles catégories, importées des technologies numériques (mais prises au sens large) : l’organisation de données, l’expérience-utilisateur, le design d’informations, le logiciel, l’utilisateur… (4) Cet utilisateur doit s’appréhender d’abord en fonction de son comportement informationnel : i. e. ses tactiques informationnelles du quotidien consistant à organiser, filtrer et interagir avec de l’information (bien au-delà de la seule sphère d’Internet). Notre comportement informationnel a changé, et il nous prédispose à une nouvelle forme de réception esthétique. (5) Depuis cinquante ans, un glissement s’est opéré dans le champ de la critique : l’intérêt est passé de l’auteur vers le lecteur idéal, pour finir sur le lecteur effectif. Pour comprendre ce dernier, à l’ère du post-Internet, il faut prendre en compte un nouvel élément : le logiciel. En intégrant le logiciel au modèle théorique de {l’émetteur, message, récepteur via un canal et un code}, on peut mettre en avant son poids majeur dans les opérations de création et de réception.Ces bases d’une esthétique post-média sont plus en phase avec nos vies et nos technologies actuelles, mais bien sûr elles présentent un biais : elles sont incapables de rendre compte de la dimension affective de la réception esthétique.
Le « lâcher-prise » : mutations numériques des gestes architecturaux
Authors: Bourbonnais Sébastien
Published: September 2017

Les technologies numériques ont entraîné des transformations dans les pratiques architecturales, principalement en ouvrant un nouveau milieu d’exploration à la conception. Il est d’ailleurs possible de repérer chez certains architectes une mutation des gestes de conception qui leur offre une « prise » nouvelle sur les projets-objets. L’apprentissage de cette préhension numérique s’est fait graduellement, par paliers : ses premiers moments peuvent être considérés à partir de l’action initiale de lâcher prise. À la différence du laisser-aller ou du laisser-faire par la machine, le lâcher-prise comprend le moment de reprise, c’est-à-dire le moment où les architectes intègrent la forme simulée à leurs propres préoccupations.Les expérimentations du lâcher-prise déstabilisent les rythmes et les gestes de conception obligeant ainsi à une série de réajustements afin d’être pleinement insérés dans les pratiques. Cette adoption des technologies numériques ne s’est pas faite d’un coup, et surtout elle a entraîné des résultats formels souvent en deçà des attentes initiales. Pour aborder cette production singulière, on tentera de déplacer l’attention des qualités spatiales des édifices projetés vers les expériences technologiques, en soulevant les nouveaux rapports qui ont été introduits entre les architectes et les logiciels.Comme dans toutes les explorations, le nouveau milieu trouve ses limites et perd de sa nouveauté par vagues successives, et par conséquent attire moins l’attention. Cette diminution de l’attention est certainement l’un des problèmes majeurs qui montrent les limites de la sensibilité du lâcher-prise. Il n’en reste pas moins qu’à l’instar de l’expression forgée par Jean-Luc Nancy, « la prise d’un lâcher », qu’il emploie pour saisir le moment initial de la peinture dans la grotte, le lâcher-prise décrit à sa façon l’un des rapports singuliers et originaux qu’offrent les mutations numériques des gestes et des milieux architecturaux.
Pré-médium
Authors: Sergent Daphné Le
Published: September 2017

Supposez qu’un article puisse se dévoiler à l’instar d’un dessin, traversé par les lignes de dialogue entre deux interlocuteurs plutôt que se présentant comme le développement argumenté d'une thèse ou l'analyse fine d'un périmètre. Les lignes ici semblent s’étirer d’une façon pointilliste, rebondissent entre deux points de vue, et dressent peu à peu l’image d’une intuition intellectuelle. Au fil des pages de cet essai, les lignes s’allongent, elles viennent par là dissiper le flou de cette intuition pour épouser le contour de certaines idées, faire émerger des îlots de pensée et, dans ce tressage au début incertain, engagent la compréhension de ce qui n’était qu’un « ressenti noétique ».
Dossier génétique de « submersion de la peine » de Mohammed Dib (Formulaires, Le Seuil, 1970)
Authors: Resztak Karolina
Published: September 2017

Le présent article se propose de retracer une genèse possible du poème «  submersion de la peine  » du recueil Formulaires de Mohammed Dib. Les aléas du dossier génétique épousent ceux du ton du poème qui évolue du lyrisme initial vers la métaphysique en semblant embrasser au passage une inspiration picturale venue des œuvres de Claude Lorrain.
Enacting Divides
Authors: Dimitrova Ina
Published: September 2017

Th? paper aims to explore the current state of a particular instance of patient activism in Bulgaria through tracing the sociotechnical network architecture of the assisted reproductive technologies. It argues that in the local context this is the patient activism, which could be assessed as successful or, in ANT's terms, it has forged heterogeneous alliances, able to sustain themselves, proliferate and enroll new protagonists. Based on interviews with patients and activists, on media representations, and online discussions, this research tries to trace the local heterogeneous arrays of protagonists and show how ARTs network successfully stabilizes and gains power.
Ontology Cohesion and Coupling Metrics
Authors: Kumar Sandeep , Baliyan Niyati , Sukalikar Shriya
Published: September 2017

Cohesion and coupling metrics for a modular ontology provide an insight into the efficiency of the modularization technique employed. Most of such metrics are either syntax based or do not account for ontology hierarchy. The authors propose cohesion and coupling metrics with continuous scale of measurement for modular ontology via deducing the degree of dependence among ontology components, thereby, handling structural aspects of ontology. The proposed metrics further handle the subtle differences between the type of links. The metrics have been analytically validated using well-established frameworks and the experimental results compared with the existing works, in terms of their cohesion and coupling values as well as the features of ontologies that they can measure. The proposed metrics are unambiguous and can be applied to any type of ontology in order to facilitate the assessment of the quality of an ontology or a partition thereof.
Sarcastic Sentiment Detection Based on Types of Sarcasm Occurring in Twitter Data
Authors: Bharti Santosh Kumar , Pradhan Ramkrushna , Babu Korra Sathya , Jena Sanjay Kumar
Published: September 2017

In Natural Language Processing (NLP), sarcasm analysis in the text is considered as the most challenging task. It has been broadly researched in recent years. The property of sarcasm that makes it harder to detect is the gap between the literal and its intended meaning. It is a particular kind of sentiment which is capable of flipping the entire sense of a text. Sarcasm is often expressed verbally through the use of high pitch with heavy tonal stress. The other clues of sarcasm are the usage of various gestures such as gently sloping of eyes, hands movements, shaking heads, etc. However, the appearances of these clues for sarcasm are absent in textual data which makes the detection of sarcasm dependent upon several other factors. In this article, six algorithms were proposed to analyze the sarcasm in tweets of Twitter. These algorithms are based on the possible occurrences of sarcasm in tweets. Finally, the experimental results of the proposed algorithms were compared with some of the existing state-of-the-art.
Semantic Extension of Query for the Linked Data
Authors: Li Pu , Jiang Yuncheng , Wang Ju , Yin Zhilei
Published: September 2017

With the advent of Big Data Era, users prefer to get knowledge rather than pages from Web. Linked Data, a new form of knowledge representation and publishing described by RDF, can provide a more precise and comprehensible semantic structure to satisfy the aforementioned requirement. Further, the SPARQL query language for RDF is the foundation of many current researches about Linked Data querying. However, these SPARQL-based methods cannot fully express the semantics of the query, so they cannot unleash the potential of Linked Data. To fill this gap, this paper designs a new querying method which extends the SPARQL pattern. Firstly, the authors present some new semantic properties for predicates in RDF triples and design a Semantic Matrix for Predicates (SMP). They then establish a well-defined framework for the notion of Semantically-Extended Query Model for the Linked Data (SEQMLD). Moreover, the authors propose some novel algorithms for executing queries by integrating semantic extension into SPARQL pattern. Lastly, experimental results show that the authors' proposal has a good generality and performs better than some of the most representative similarity search methods.
Evaluation of Handle Rotational Feeling in Fishing Reel by Coordinate Measurement and Gear Transmission Error Measurement
Authors: Inoue Tetsuo , Kurokawa Syuhei
Published: September 2017

This report discusses how a transmission error curve is derived by a coordinate measuring machine, and the result by a coordinate measuring machine is compared with the result by a transmission error measuring machine. A vibration based on a gear pair engagement in fishing reel occurs when a handle of the reel rotates. When this vibration is large, an angler feels uncomfortable. In author’s previous reports, it is known that a rotational feeling depends on the transmission error curve. The result indicates that the rotational feeling can be improved if the accuracy of a tooth flank is improved. In order to reduce the transmission error, the error should be measured in high accuracy. In this research, a measurement method for evaluating the rotational feeling was reported using a face gear pair via a coordinate measuring machine and a transmission error measuring machine. As a result, it was confirmed that the result of measurement by the coordinate measuring machine agrees very well with the result of measurement by the transmission error measuring machine.
Corrosion Behavior of Low Carbon Steel in Bioethanol Fuel Blends
Authors: Thangavelu S.K. , Ezhumalai Pushparaj
Published: September 2017

Bioethanol is a clean and sustainable fuel; on the contrary, the addition of bioethanol to gasoline normally creates corrosion on automobile fuel system materials. In this study, corrosion characteristics of low carbon steel normally encountered in gasoline engine fuel system with bioethanol fuel was investigated. Static immersion tests in different fuel blends E0 (gasoline), E10 and E85 were carried out at room temperature for 1320 h. The mechanical, physical and chemical properties of low carbon steel before and after immersion tests were investigated. Moreover, the physical and chemical properties of fuel blends before and after immersion tests were investigated. The results revealed that the usage of E10 blend is considered feasible for gasoline engines in terms of materials compatibility compared to E85.
Dilution and C Content Estimation of Stellite 6 Fabricated on a 1050 Steel Substrate by Laser Cladding
Authors: Kusmoko Alain , Dunne Druce , Li Hui Jun
Published: September 2017

Stellite 6 was fabricated by laser cladding on a 1050 steel (MS) substrate with laser powers of 1 kW (MS-1) and 1.8 kW (MS-1.8). The chemical compositions and microstructures of the coatings were analysed by X-Ray Fluoroscense, optical microscopy and scanning electron microscopy. The microhardness of the coatings was examined and the wear mechanism of the coatings was evaluated using a ball-on-plate wear testing machine. The results indicated less cracking and pore development for Stellite 6 coatings applied to the 1050 steel substrate with the lower laser power (MS-1). Moreover, the Stellite coating for MS-1 was significantly harder than that obtained for MS-1.8. The wear test results showed that the weight loss for MS-1 was much lower than for MS-1.8. The evaluations of dilution and calculation of carbon content indicated that MS-1 has lower dilution and higher coating C content than MS-1.8. It is concluded that the lower hardness of the coating for MS-1.8, substantially reduced the wear resistance of the Stellite 6 coating and the lower hardness of the coating for MS-1.8 was due to higher level of dilution and lower coating C content. The coating-substrate couple must be considered in assessing the likely performance of the coating under service conditions.
Stopping Power and Range of Cesium-137 Gamma Rays in Gallium Arsenide Field Effect Transistor (GaAsFET)
Authors: Abdul Amir Haider F.
Published: September 2017

In this paper, the defect generated in the interaction of gamma ray resulting from cesium ion (Cs-137) and GaAs as a main portion of gallium arsenide field effect transistor (GaAsFET) is simulated using SRIM (Stopping and Range of Ions in Matter). The induced defects are in the form of vacancies, defect clusters and dislocations. Besides, the defect is found influencing the kinetic processes that occur both inside and outside the cascade volume. The radiation tolerance between the conventional scale and nanoscale thickness of GaAs layer is also being compared. From the findings, it is observed that when the thickness of GaAs layer is scaled down, defect that induced by the energy deposition of gamma radiation is significantly lesser. This means that nanoscale GaAs layer features improved radiation robustness towards the deposition of energetic ions.
Predicting Strain Reduction Factor for Concrete-Filled FRP Tube Columns Incorporating Interface Gap and Prestress
Authors: Vincent Thomas , Ozbakkaloglu Togay
Published: September 2017

This paper reports the findings from an analytical study into the influence of fiber reinforced polymer (FRP)-to-concrete interface gap and prestressed FRP tubes on strain reduction factor (kε) for concrete-filled FRP tube (CFFT) columns. A database that consists of a total of 45 aramid FRP- (AFRP) confined normal-and high-strength concrete (NSC and HSC) specimens with circular cross-sections is presented. All specimens were cylinders with a 152 mm diameter and 305 mm height, and their unconfined concrete strengths ranged from approximately 45 to 110 MPa. Analyses of the experimental databases that consisted of 22 specimens manufactured with FRP-to-concrete interface gap and a further 23 specimens prepared with lateral prestress is presented and discussed. Based on close examination of the hoop strain development on the FRP confining shell, expressions to predict strain reduction factors (kε) are proposed. The comparison of the proposed model predictions with the experimental test results of specimens prepared with an interface gap or prestressed FRP tubes shows good agreement.
Influence of Yield Strength of Ti-Alloy Liner on Crater Diameter Formed by Shaped Charge Jet Penetration
Authors: Guo Jian , He Yong , Xiao Qiang Qiang , Huang Zheng Xiang , Tan Ya Ping
Published: September 2017

In order to study influence of yield strength of liner on aperture diameter when liner material has high strength, the initial aperture and final aperture diameter were analyzed by considering yield strength of liner material. The relationship of aperture diameter with liner strength changing was obtained. The experiments using Ti alloy liner with different yield strength penetrated into concrete were performed. The results shown that, the average aperture diameter of Ti alloy liner which the yield strength is 785MPa is about 1.16 times bigger than that of copper liner which the yield strength is 870MPa. It has good agreement with theoretic analysis. With liner strength increasing, the aperture diameter decreased, and this increasing is more significant with jet velocity decreasing. With respecting to the high-density copper liner, the influence of yield strength on aperture diameter is more sensitive for low-density Ti alloy liner.
Ultra-Thin, Fine-Pitch Step Stencils For Miniature Component Assembly
Authors: Vallabhajosyula Phani
Published: September 2017

Mixed technology applications for Flip-Chip (FC) / SMT require special step stencil designs where flux is printed first for the FC and SMD paste printed next with a second stencil that has a relief pocket etched or formed in the FC area. Step stencils are used when varying stencil thicknesses are required to print into cavities or on elevated surfaces or to provide relief for certain features on a board. In the early days of SMT assembly, Step Stencils were used to reduce the stencil thickness for 25 mil pitch leaded device apertures. Thick metal stencils that have both relief-etch pockets and reservoir step pockets are very useful for paste reservoir printing. However as SMT requirements became more complex and consequently more demanding so did the requirements for complex Step Stencils. Electroform Step-Up Stencils for ceramic BGA's and RF Shields are a good solution to achieve additional solder paste height on the pads of these components as well as providing exceptional paste transfer for smaller components like uBGAs and 0201s. As the components are getting smaller, for example 0201m, or as the available real estate for component placement on a board is getting smaller – finer is the aperture size and pitch on the stencils. Aggressive distances from step wall to aperture are also required. Ultra-thin stencils with thicknesses in the order of 40um with steps of 13um are used to obtain desired print volume. These applications and the associated stencil design to achieve a solution will be discussed in detail in this paper. Various print experiments will be conducted and print quality will be determined by visual inspection and 3D measurement of the paste deposit to understand the volume transfer efficiency.
What is driving the 3D TSV technologies business: Market update and technical trends
Authors: Kumar Santosh , Buisson Thibault
Published: September 2017

Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CIS, MEMS, sensors, and RF filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around 2.1 million wafers in 2021, expanding at an 18% CAGR. The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.

CIS still commanded more than 80% share of TSV market wafer volume in 2015, although this will decrease to around 56% by 2021. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors. However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 38% of CIS production by 2021. The presentation will explain the market's dynamics and give an overview of all segments and key markets of the TSV based 3D/2.5D IC packaging.
FOWLP Technology as an Wafer Level System in Packaging (SiP) Solution
Authors: Kang Lewis(In Soo)
Published: September 2017

The market of Connectivity, Internet of Things (IoT), Wearable and Smart industrial applications leads Fan Out Wafer Level Package (FOWLP) technologies to a promising solution to overcome the limitation of conventional wafer level package, flip chip package and wire bonding package in terms of the solution of low cost, high performance and smaller form factor packaging. Moreover, FOWLP technology can be extended to system-in-package (SiP) area, such as multi chip 2D package and 3D stack package types. nepes Corporation has developed several advanced package platforms such as single, multi dies and 2D, 3D packaging by using FOWLP and embedding technologies. To fulfill SiP (system-in-package) with FOWLP, several dies and components have been embedded into one package which offers 40~90 % of volumetric shrink compared to the current module system with the flexibility of product design for end users. 3D package technology of PoP (Package on Package) structure will be introduced for communication module and system control application.
Advanced Wireless Sensor Nodes - MSFC
Authors: Varnavas Kosta
Published: September 2017

IMAPS Device Packaging Conference 2017 Engineered Micro Systems & Devices Track Advanced Wireless Sensor Nodes - MSFC Abstract Kosta Varnavas NASA / Marshall Space Flight Center NASA field center Marshall Space Flight Center (Huntsville, AL), has invested in advanced wireless sensor technology development. Developments for a wireless microcontroller back-end were primarily focused on the commercial Synapse Wireless family of devices. These devices have many useful features for NASA applications, good characteristics and the ability to be programmed Over-The-Air (OTA). The effort has focused on two widely used sensor types, mechanical strain gauges and thermal sensors. Mechanical strain gauges are used extensively in NASA structural testing and even on vehicle instrumentation systems. Additionally, thermal monitoring with many types of sensors is extensively used. These thermal sensors include thermocouples of all types, resistive temperature devices (RTDs), diodes and other thermal sensor types. The wireless thermal board will accommodate all of these types of sensor inputs to an analog front end. The analog front end on each of the sensors interfaces to the Synapse wireless microcontroller, based on the Atmel Atmega128 device. Once the analog sensor output data is digitized by the onboard analog to digital converter (A/D), the data is available for analysis, computation or transmission. Various hardware features allow custom embedded software to manage battery power to enhance battery life. This technology development fits nicely into using numerous additional sensor front ends, including some of the low-cost printed circuit board capacitive moisture content sensors currently being developed at Auburn University.
Laser Debonding for 2.5D, 3D and Emerging Advanced Packaging Solutions
Authors: Uhrmann T. , Brandl Elisabeth , Uhrmann Thomas , Eibelhuber Martin , Wiesbauer Harald , Bravin Julian , Wimplinger Markus , Lindner Paul
Published: September 2017

In recent years temporary bonding has evolved to a widely used process technology as it is an enabling process for many products relyinnovel solutions are typically assessed on two key criteria which are a broad process window and cost effectiveness. Thus in this paper these criteria will be discussed in more detail for the case of UV laser debonding with respect to wafer level packaging.

By temporary bonding the thin or to be thinned device wafer is bonded to a carrier wafer by an adhesive interlayer to provide sufficient mechanical support which is crucial for many downstream processes. In the past several different technologies have been studied and implemented. A major differentiation factor between the offered solutions is the debonding method, including separation processes at room or elevated temperatures.

Nowadays a particular focus is on UV laser debonding as it offers several advantages, as the debonding process can be performed at room temperature with fast process times and force free separation. Furthermore crosslinking adhesive materials with high temperature stability can be used. This can be achieved due to the high intensity UV light provided by an excimer laser system which is absorbed by the polymer close to the carrier surface and breaks the chemical bonds. The low debonding temperature in combination with high temperature stability of the adhesives leads to a broad process window for the temporary bonded stack. In addition transparent adhesive materials can be used in combination with the glass carrier to support better visibility of alignment marks within the bond interface.

However, for industrial requirement besides the technical advantages the most critical parameters are ease of implementation, throughput and costs.

In this paper we will review integration principles for advanced packaging as well as new devices that utilize temporary bonding. Special focus will also be put on upcoming demands for future device concepts. A short discussion will discuss temporary bonding methods and materials, benefits and drawbacks of each one. In the following laser debonding will be discussed as a focus topic for next generation packaging process technology.

Laser debonding is already being applied in volume for couple of technologies, focussing on different wavelengths. We will focus on a newly developed technology, using UV solid state laser technology. Here, we will discuss all relevant process parameter, critical process steps along with reliability of different laser debonding material systems.
The Influence of Intermetallic Compounds, (IMC), on High Speed Shear Testing with a Specific Interest in Electroless Palladium / Autocatalytic Gold
Authors: Nichols Richard John
Published: September 2017

Increasing IO counts have led to ever increasing solder performance expectations. A predominant measure of solder joint integrity is gained through HSS testing. This article will statistically evaluate the solderability of final finishes after substrate and IMC ageing. Lead free solder balls will be used in this exercise to simulate lead free production. The finishes selected are: Immersion tin, Organic Surface Protection (OSP), Electroless Nickel/ Immersion Gold (ENIG), Electroless Nickel /Electroless Palladium and Immersion Gold (ENEPIG) and Electroless Palladium / semi Autocatalytic Gold (EPAG).

Where necessary, the adaptions of the final finishes will be included for testing. An example of this is ENEPIG with thin nickel. This is a measure to enable high frequency and or improve flexibility.

For the purpose of the paper, the evaluation will endeavor to relate HSS performance and physical and chemical characteristics of the related deposit layer. To ensure that a comparative analysis is possible, an “as received” (ASR) population will be used as a base line.

This fully data driven evaluation will aim to increase the understanding of key indicators that can ensure good quality soldering performance. In the field, there are assertions that the IMC is a good indicator of the solder joint integrity. However this is usually as far as this particular statement is taken. A key question that is still outstanding is what particular attribute of the IMC is important for solder joint reliability. The shape and size of the IMC is often cited as crucial to quality assurance. Such indicators may be valid but this study will couple this kind of observation with elemental quantification (EDX), high resolution microscopy and finally mechanical failure techniques.

A comprehensive test plan will be executed to more fully understand the role of IMC formation in terms of solder joint reliability, (SJR).
Silicon Wafer Integrated Fan-out Technology
Authors: Zwenger Curtis , Scott George , Huemoeller Ron , Do WonChul , Lee WonGeol , Yi JiHun
Published: September 2017

The tremendous growth in the mobile handset, tablet, and networking markets has been fueled by consumer demand for increased mobility, functionality, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integration of IC devices, resulting in the need for more complex and sophisticated packaging techniques. A variety of advanced IC interconnect technologies are addressing this growing need. These include Through Silicon Via (TSV), Chip-on Chip (CoC), and Package-on-Package (PoP) approaches. In particular, emerging Wafer Level Fan-Out (WLFO) technology provides unique and innovative extensions into the 3D packaging realm. Traditional WLFO technologies are limited in design rules and 3D integration capabilities due to the processes and equipment used for circuit patterning. For more aggressive designs, TSV processes must be incorporated, which often times exceed the cost budget and design requirements needed for the device. Consequently, a gap exists between the design capabilities of WLFO and TSV that needs to be addressed. A new, innovative fan-out structure called Silicon Wafer Integrated Fan-out Technology (SWIFT™) packaging incorporates conventional WLFO processes with leading-edge thin film patterning techniques to bridge the gap between TSV and traditional WLFO packages. The SWIFT methodology is designed to provide increased I/O and circuit density within a reduced footprint and profile for single and multi-die applications. The improved design capability of the technology is due, in part, to the fine feature capabilities associated with this new, innovative wafer-level packaging technique. The fine feature capabilities can allow much more aggressive design rules to be applied compared to competing WLFO and laminate-based technologies. In addition, the unique characteristics of the SWIFT process enable the creation of innovative 3D structures that address the need for IC integration in emerging mobile and networking applications. This paper will review the development of the SWIFT technology and its extension into unique 3D structures. In addition, the advantages of SWIFT designs will be reviewed in comparison to current competing packaging technologies. Process information, material characterization, and design simulation data will be presented to show how the SWIFT process is poised to provide robust, reliable, and low-cost 3D packaging solutions for advanced mobile and networking products. SWIFT is a trademark of Amkor Technology, Inc.
Advanced 3D eWLB-SiP (embedded Wafer Level Ball Grid Array – System in Package) Technology
Authors: Yoon Seung Wook
Published: September 2017

FO-WLP (Fan-Out Wafer Level Packaging) has been established as one of the most versatile packaging technologies in the recent past and is already accounting for a market value of over 1 billion USD due to its unique advantages. The technology combines high performance, increased functionality with a high potential for heterogeneous integration and reduce the total form factor as well as cost-effectiveness.

The emerging of advanced of silicon node technology down to 10 nanometer (nm) in support of higher performance, bandwidth and better power efficiency in mobile products pushes the boundaries of emerging packaging technologies to smaller form-factor packaging designs with finer line/spacing as well as improved thermal electrical/performance and integration of SiP or 3D capabilities. Advanced eWLB FO-WLP technology provides a versatile platform for the semiconductor industry's technology evolution from single or multi-die 2D package designs to 2.5D interposers and 3D System-in-Package (SiP) configurations.

This paper reports developments that extend multi-die and 3D SiP applications with eWLB technology, including ultra thin devices or/and with an interposer substrate attachment. Test vehicles have been designed and fabricated to demonstrate and characterize integrated packaging solutions for network, mobile products including IoT and wearable electronics. The test vehicles have ranged from ~30mm2 to large sizes up to ~230mm2 and 0.4mm ball pitch. Assembly process details including 3D vertical interconnect, laser ablation, RDL processes and mechanical reliability characterizations are to be discussed with component and board level reliability results. In addition, warpage behavior and the PoP stacking process will also be presented. Innovative structure optimization that provides dual advantages of both height reduction and enhanced package reliability are reported. To enable higher interconnection density and signal routing, packages with multiple redistribution layers (RDL) and fine line/width spacing are fabricated and implemented on the eWLB platform. Successful reliability and electrical characterization results on multi-die and 3D eWLB-SiP configurations are reported as an enabling technology for highly integrated, miniaturized, low profile and cost effective solutions.
Integration of MEMS in Fan-Out Wafer-Level Packaging Technology based System-in-Package (WLSiP)
Authors: Kroehnert Steffen , Cardoso André , Kroehnert Steffen , Pinto Raquel , Fernandes Elisabete , Barros Isabel
Published: September 2017

The Internet of Things/ Everything (IoT/E) will require billions of single or multiple MEMS/Sensors integrated in modules together with other functional building blocks like processor, memory, connectivity, built-in security, power management, energy harvesting, and battery charging. The success of IoT/E will also depend on the selection of the right Packaging Technology. The winner will be the one achieving the following key targets: best electrical and thermal system performance, miniaturization by dense system integration, effective MEMS/Sensors fusion into the systems, manufacturability in high volume at low cost. MEMS/Sensors packaging in low cost molded packages on large manufacturing formats has always been a challenge, whether because of the parameter drift of the sensors caused by the packaging itself or, as in many cases, the molded packaging technology is not compatible to the way MEMS/Sensors are working. Wafer-Level Packaging (WLP), namely Fan-Out WLP (FOWLP) technologies such as eWLB, WLFO, RCP, M-Series and InFO are showing good potential to meet those requirements and offer the envisioned system solutions. FOWLP will grow with CAGR between 50–80% until 2020, forecasted by the leading market research companies in this field. System integration solutions (WLSiP and WL3D) will dominate FOWLP volumes in the future compared to current single die FOWLP packages for mobile communication. The base technology is available and has proven maturity in high volume production, but for dense system integration of MEMS/Sensors, additional advanced building blocks need to be developed and qualified to extend the technology platform. The status and most recent developments on NANIUM's WLFO technology, which is based on Infineon's/Intel's eWLB technology, aiming to overcome the current limits for MEMS/Sensors integration, will be presented in this paper. This will cover the processing of Keep-Out Zones (KOZ) for MEMS/Sensors access to environment in molded wafer-level packages, mold stress relief on dies for MEMS/Sensors die decoupling from internal package stress, thin-film shielding using PVD seed layer as functional layer, and heterogeneous dielectrics stacking, in which different dielectric materials fulfill different functions in the package, including the ability to integrate Microfluidic.
Thermomechanical Modeling of Sintered Silver – A Fracture Mechanics-Based Approach
Authors: Paret Paul , DeVoto Douglas , Narumanchi Sreekant
Published: September 2017

Sintered-silver has proven to be a promising candidate for use as a die-attach and substrate-attach material in automotive power electronics components. It holds promise of greater reliability than lead-based solders – especially for higher temperatures (> 200°C). Accurate predictive lifetime models of sintered silver need to be developed and its failure mechanisms thoroughly characterized before it can be deployed as a die-attach or substrate-attach material in wide-bandgap device-based packages. We present a finite-element-method (FEM) modeling methodology which can offer greater accuracy in predicting the failure of sintered silver under accelerated thermal cycling. A fracture-mechanics-based approach is adopted in the FEM model and J-integral/thermal cycle values are computed. In this paper, we outline the procedures for obtaining J-integral/cycle values in a computational model and report on the possible advantage of using these values as modeling parameters in a predictive lifetime model.
Soil depth modelling using terrain analysis and satellite imagery: the case study of Qeshlaq mountainous watershed (Kurdistan, Iran)
Authors: Zahedi Salahudin , Shahedi Kaka , Habibnejad Rawshan Mahmod , Solimani Karim , Dadkhah Kourosh
Published: September 2017

Soil depth is a major soil characteristic, which is commonly used in distributed hydrological modelling in order to present watershed subsurface attributes. This study aims at developing a statistical model for predicting the spatial pattern of soil depth over the mountainous watershed from environmental variables derived from a digital elevation model (DEM) and remote sensing data. Among the explanatory variables used in the models, seven are derived from a 10 m resolution DEM, namely specific catchment area, wetness index, aspect, slope, plan curvature, elevation and sediment transport index. Three variables landuse, NDVI and pca1 are derived from Landsat8 imagery, and are used for predicting soil depth by the models. Soil attributes, soil moisture, topographic curvature, training samples for each landuse and major vegetation types are considered at 429 profiles within four subwatersheds. Random forests (RF), support vector machine (SVM) and artificial neural network (ANN) are used to predict soil depth using the explanatory variables. The models are run using 336 data points in the calibration dataset with all 31 explanatory variables, and soil depth as the response of the models. Mean decrease permutation accuracy is performed on Variable selection. Testing dataset is done with the model soil depth values at testing locations (93 points) using different efficiency criteria. Prediction error is computed for both the calibration and testing datasets. Results show that the variables landuse, specific surface area, slope, pca1, NDVI and aspect are the most important explanatory variables in predicting soil depth. RF and SVM models are appropriate for the mountainous watershed areas that have been limited in the depth of the soil and ANN model is more suitable for watershed with the fields of agricultural and deep soil depth.
A review of rice field ostracods (Crustacea) with a checklist of species
Authors: Smith Robin J. , Zhai Dayou , Savatenalinton Suktonthip , Kamiya Takahiro , Yu Na
Published: September 2017

Ostracods are very common in rice fields and they can have a significant influence on the rice field ecosystem. They can reach very high densities, often higher than other meiofauna, and their activities can have both positive and negative effects on rice harvests. They directly affect nutrient recycling through excretion, and indirectly by physically disturbing the soil and releasing minerals, thus improving rice growth. On the other hand, ostracods grazing on nitrogen-fixing cyanobacteria potentially reduce rice yields. Rice is a primary staple food for over half of the world’s population, and therefore ostracods can have a significant impact on human food supply. The origin of the rice field ostracod fauna is poorly known, but many rice field ostracods are considered invasive, especially in southern Europe, and from rice fields they have the potential to spread to surrounding natural habitats. Despite their invasive potential and ecological effects on the rice field ecosystem, very little is known about the diversity, ecology and impacts of rice field ostracods in many rice-producing countries. One hundred and ninety-two named ostracod species/subspecies have been reported from rice fields in 26 countries and states worldwide in the published literature; for over three-quarters of rice-producing countries, no data are readily available, and for most of the countries that have available data, diversity is clearly under-reported. Most species that have been documented from rice fields belong to the Cyprididae (78%), a family that makes up approximately 43% of the 2500+ non-marine ostracod species. A further six families (Candonidae, Darwinulidae, Entocytheridae, Ilyocyprididae, Limnocytheridae and Notodromadidae) form the remainder of rice field ostracods. Twenty-two percent of the species reported from rice fields are sexually reproducing, 18% have mixed reproduction, but are mostly asexual, and for 60% males are unknown, and are probably entirely asexually reproducing species. This review and checklist of rice field ostracods are presented to facilitate further research on this group in rice field habitats, research that is crucial for food security in many regions.
Granular Cell Tumor of Cecum: A Common Tumor in a Rare Site with Diagnostic Challenge
Authors: Rajagopal Meyyappa Devan , Gochhait Debasis , Shanmugan Dasarathan , Barwad Adarsh Wamanrao
Published: September 2017

Granular cell tumor (GCT) also known as Abrikossoff's tumor is a benign neoplasm that is usually seen in the fourth to sixth decades of life with slight female preponderance. It is most frequently seen in the oral cavity, skin, and subcutaneous tissue. Gastrointestinal tract involvement is uncommon, in which esophagus is the most commonly affected site. There are case reports of GCT in stomach, appendix, colon and rectum. In this article, we report a case of GCT involving cecum. The cell of origin in GCT is controversial. There are various pools of thoughts regarding its histogenesis, the details of which are reviewed in this article with emphasis on the diagnostic difficulties encountered in this tumor.
Test Cases for OBD-II Scan Tools and I/M Test Equipment
Authors:   Vehicle E E System Diagnostic Standards Committee
Published: September 2017

To define test cases for the OBD-II interface on external test equipment (such as an OBD-II Scan Tool, Inspection/Maintenance Tester, etc.) which can be used to verify compliance with the applicable standards such as SAE J1978 and SAE J1979 for Passenger Cars, Light-Duty Trucks, and Medium-Duty Vehicles and Engines (OBD II).
Domestic violence in Chimamanda Ngozi Adichie’s Purple Hibiscus
Authors: Nutsukpo Margaret Fafa
Published: September 2017

Gender-based violence is an issue that has become a part of modern society, cutting across cultures, race, ethnicity and status. In Adichie’s Purple Hibiscus, gender-based violence manifests in the form of domestic violence, projected through the Eugene Achike family around whom the story, set in the eastern part of Nigeria, revolves. Clearly, the domination of women is the most fundamental form of female subjugation in the African society. This is largely due to cultural influences for, the patriarchal culture, inherent in the African society, encourages prejudices against women, and accepts the battery of wives (and, by extension, children) by husbands as normal. Domestic violence is therefore a regular feature in many African homes, a situation which is portrayed by Adichie in her debut novel, Purple Hibiscus, as she advocates change in the attitude of society to this anomaly. The success of her advocacy is the focus of this article.
Impact of published articles on trade liberalization from 1980-2015: a bibliometric study
Authors: Muhammad Murtala , Ale Ebrahim Nader , Kafilah Gold Lola , Ahmed Abubakar
Published: September 2017

In this research, the viable impact of scholarly research on trade liberalisation by a bibliometric approach from 1980-2015 is examined. The paper analysed 886 academic articles extracted from the ISI Web of Science Core Collection database. Trade liberalisation research is notably interdisciplinary, with articles principally in journals for economics, international relations, and planning development. This study found that the field became evidently viable with more than ten articles per year from 1990 – 2015. The proportion of articles with at least one citation from 1980 – 2015 is 56.43%. The top 100 articles have a minimum of 25 citations. Given this, this study created a citation matrix trend to determine two decade’s total citation per year. The data are statistically analysed. Furthermore, the study produced a cloud map showing the Web of Science research categories. Based on the results of this study, insight into citation forecast for future research to advance knowledge on trade liberalisation is provided.Keywords: Article word count, citation matrix, publication trends, trade liberalisation, Web of Science
Burial rites for Ken Saro-Wiwa and the Ogoni Nine: implications for modern society
Authors: Saale Lazarus Baribiae
Published: September 2017

This study examined the burial rites given to the ‘Ogoni Nine’ activists from the Niger Delta region of Nigeria. The study adopted the anthropological, philosophical and sociological approaches. Findings from the study revealed that the ‘Ogoni Nine’ include Ken Saro-Wiwa, Saturday Dobee, Nordu Eawo, Daniel Gbooko, Paul Levera, Felix Nuate, Baribor Bera, Barinem Kobel and John Kpuine who were executed by hanging by the military government of General Sani Abacha in 1995. These were Ogoni heroes who fought and died for the Ogoni struggle for survival in Nigeria. The Ogoni were not happy with both the multi-national oil company (Shell – SPDC) and the Federal Government of Nigeria of the careless, tormenting and humiliating ways the corpses of these heroes were handled at death and buried at the Port Harcourt cemetery outside Ogoni land. In Ogoni tradition, the type of burial given to these activists was meant for those who died a bad death and not for heroes such as the Ogoni nine who died in the struggle for survival of their people. Important aspects of the rites accorded, good death at burial were denied them. Traditional burial was organised for these Ogoni heroes by their people to retrieve, transform and purify their bodies and souls from the abode of evil forces. In the Ogoni traditional religion, it is a taboo and a thing that attracts bad omen to society of the living if the heads of their heroes are buried outside or left at the war front away from home. This belief and practices amongst others informed the Ogonis’ demand for a monument that will stand in memories of them to be constructed in Ogoni land.
Benefits derived from recreation and sport leisure that motivate participation
Authors: Anaza Emeka
Published: September 2017

Using the constraints-effects mitigation model, this study explored the benefits of recreation and sport leisure activities that motivate women’s participation. While there are numerous studies that have investigated factors that motivate women’s leisure participation and leisure constraints in Europe and the United States, there are less empirical studies conducted in sub-Saharan Africa. A lack of comparable studies limits our understanding of leisure participation in Africa, but more importantly mandates further investigations within an African context. Applying a phenomenological qualitative approach, nineteen women were studied. The findings showed that Nigerian women are motivated to participate in recreation and sport leisure activities by health-related and social interaction benefits.Keywords: Recreation, Sport, Leisure, Activities, Women, Nigeria