bluuebunny/crossref_metadata_2025 huggingface dataset:
Infrared Emission Spectroscopy as a Reliability Tool
Authors: Kim Q. , Kayali S.
Published: December 2020

In this paper, we report on a non-destructive technique, based on IR emission spectroscopy, for measuring the temperature of a hot spot in the gate channel of a GaAs metal/semiconductor field effect transistor (MESFET). A submicron-size He-Ne laser provides the local excitation of the gate channel and the emitted photons are collected by a spectrophotometer. Given the state of our experimental test system, we estimate a spectral resolution of approximately 0.1 Angstroms and a spatial resolution of approximately 0.9 μm, which is up to 100 times finer spatial resolution than can be obtained using the best available passive IR systems. The temperature resolution (<0.02 K/μm in our case) is dependent upon the spectrometer used and can be further improved. This novel technique can be used to estimate device lifetimes for critical applications and measure the channel temperature of devices under actual operating conditions. Another potential use is cost-effective prescreening for determining the 'hot spot' channel temperature of devices under normal operating conditions, which can further improve device design, yield enhancement, and reliable operation. Results are shown for both a powered and unpowered MESFET, demonstrating the strength of our infrared emission spectroscopy technique as a reliability tool.
Investigation on the Corrosion of Cu Metallization in the Focused Ion Beam System due to a low I2 Background
Authors: Bender H. J. , Jin S. , Vervoort I. , Lantasov Y.
Published: December 2020

The corrosion effect of an I2 background during focused ion beam (FIB) analysis of Cu-metallization structures is investigated. In-situ Cu corrosion in the FIB system can occur even if the I2 gas has not been used anymore in the last 24 h before the loading of the Cu sample in the system including several vents and pump-downs of the chamber in that period. Hence the I2 can have a long-term memory effect and is not compatible with FIB analysis or modification of devices with Cu metallization. Compositional and structural analysis shows that the reaction product is CuI.
Temperature Measurement on Micromachined IR Bolometers Using an Infrared Microscope
Authors: Trigg A.D. , Sridhar U. , Lee H.S. , Karunasiri G.
Published: December 2020

Thermal properties are critical to the performance of micromachined silicon bolometers. In order to verify thermal models of the device, a means of measuring the local temperature distribution over the element is required, as it is heated by passing current through a thin film titanium meander. Because of the very low thermal mass of the membrane a non-contact method of temperature measurement is needed. Most conventional thermal imaging systems operate in the wavelength range 5-15 μm and offer poor spatial resolution but in this work an infrared microscope, operating at shorter wavelengths, was used. The microscope comprises an objective lens which focuses radiation onto a cooled (77K) cadmium mercury telluride focal plane array sensitive over the range 800 nm to 2500nm. For this application a bandpass filter centered at 2150 nm was used. Good agreement was obtained between finite element modeling of the temperature distribution, using ANSYS, and the measured data.
FMECA Modeling - A New Approach
Authors: Bot Yizhak
Published: December 2020

FMECA tools must be included into the designers tools suite in order to support the new vision for a concurrent engineering environment. To support this new vision we introduce a major enhancement to the Failure Mode Effects and Criticality Analysis (FMECA) to provide a more accurate, simpler, accessible and frequently used computerized analysis tool. We introduce new terminology to enhance the well-known standards, while assuring their full support. Using the new terminology, functional trees become very similar to the project trees and can be drawn as block diagrams, e.g. the time spent on constructing the functional trees is reduced by factors.
Advanced Statistical Tools for Improving Yield and Reliability
Authors: Kittler Richard C.
Published: December 2020

Analysis of manufacturing data as a tool for failure analysts often meets with roadblocks due to the complex non-linear behaviors of the relationships between failure rates and explanatory variables drawn from process history. The current work describes how the use of a comprehensive engineering database and data mining technology over-comes some of these difficulties and enables new classes of problems to be solved. The characteristics of the database design necessary for adequate data coverage and unit traceability are discussed. Data mining technology is explained and contrasted with traditional statistical approaches as well as those of expert systems, neural nets, and signature analysis. Data mining is applied to a number of common problem scenarios. Finally, future trends in data mining technology relevant to failure analysis are discussed.
Failure Analysis of Autoclave-Stressed SRAMs with Aluminum Fuses
Authors: Moss Jamey , Subramanian Sam , Soorholtz Vince , Thomas Michael , Gerber Mark , Chan C. M.
Published: December 2020

Several hundred units were subjected to autoclave stress as part of the qualification of a new fast static RAM. Many units failed after autoclave stress, and these parts recovered after conventional depotting using nitric acid and a hot plate. Based on the recovery of the units, the failures were determined to be fuse-related because the nitric acid cleared the fuse cavities during depotting. Chemical analysis after thermally extracting the die from the package revealed an antimony-rich material in failing fuse cavities. Source of the antimony was linked to antimony trioxide added to the plastic package as a fire retardant. However, it was unclear whether the antimony-rich material caused the failure or if it was an artifact of thermal depotting. A new approach that did not thermally or chemically alter the fuse cavities was employed to identify the failing fuses. This approach used a combination of back-side grinding, dimpling, and back-side microprobing. The antimony-rich material found in the fuse cavity was confirmed using SEM and TEM-based EDS analysis, and it is believed to be a major contributing factor to fuse failures. However, it is unclear whether the short was caused by the antimony-rich material or by a reaction between that material and residual aluminum (oxide) left in the fuse cavity after the laser blows.
New Techniques for Logic Fault Diagnosis with a Case Study on the 440BX Chipset
Authors: Venkataraman Srikanth , Drummonds Scott B.
Published: December 2020

Logic fault diagnosis or fault isolation is the process of analyzing failing random logic portions of a chip to isolate the cause of failure. Fault diagnosis or fault isolation (FI) plays an important role in multiple applications at different stages of design and manufacturing. Most currently deployed FI techniques for random logic fault isolation include physical techniques with limited automated diagnosis followed by e-beam and/or laser voltage probing (LVP) on packaged parts. This paper will present the methodology and FI results obtained by executing automated scan based diagnosis on a chipset product (440BX). The logic diagnosis techniques used are presented along with simulation and Failure Analysis (FA) results
Visualization of Local Gate Depletion in PMOSFETs Using Unique Backside Etching and Selective Etching Technique
Authors: Nishida Akio , Sekiguchi Tomoko , Yamanaka Toshiaki , Yamada Renichi , Nakamura Kuniyasu , Tomimatsu Satoshi , Umemura K. , Kakibayashi Hiroshi , Yoshida Yasuko , Funayama Kohta , Ikeda Shuji
Published: December 2020

A novel backside-analysis technique has been developed to identify the locations of failing transistors in manufactured LSIs. Local gate doping depletion in p+ salicide gates of PMOSFETs, which reduces drain current, was visualized for the first time. Our method consists of backside etching and subsequent selective wet etching of the gate electrode. Si substrate material was removed with a highly selective Si etchant without damaging the gate-oxide film. After the gate-oxide film removal, a locally depleted gate was selectively etched using the same etchant. Since the etching rates of nondoped Si and n+ Si are much higher than that of p+ Si for the etchant, the depleted p+ gates were well defined. Through TEM observation, we found that a large grain lay on an active channel region of a PMOSFET. This led us to attribute the gate depletion to the difference in the impurity diffusion between large and small grains. This demonstration confirmed that our technique should be quite useful for identifying failing transistor locations in manufactured memory and logic LSIs.
Advanced Micro-Surgery Techniques and Material Parasitics for Debug of Flip-Chip Microprocessor
Authors: Livengood Rick H. , Winer Paul , Giacobbe John A. , Stinson Jason , Finnegan John D.
Published: December 2020

Silicon microsurgery, also known as on-silicon circuit editing, has evolved into a critical capability for the ramp-up of a new microprocessor or complex integrated circuit (IC) from tapeout to production. The ability to perform edits directly on a packaged device serves two major purposes during a product’s ramp. The first is to perform in-situ verification of logic and timing related design changes, and the second is to provide engineering samples to enable further debug for system and tester level validation. In both cases, sample generation using silicon microsurgery technology can be performed in a fraction of the time it would take to tapeout a new mask layer and generate samples through the fabrication process. Silicon microsurgery techniques are also employed to assist with failure analysis. For this application, these techniques are applied to help isolate a stuck-at fault or open on a failing node. This is done by bi-passing the failure point, through signal rerouting or by performing isolation cuts to further localize the defect. This paper will review several advanced siliconmicrosurgery edit applications and supporting technologies, microsurgery RC material properties, and finally some results from 0.25 and 0.18 micron technologies.
Laser Voltage Probe (LVP): A Novel Optical Probing Technology for Flip-Chip Packaged Microprocessors
Authors: Yee Wai Mun , Paniccia Mario , Eiles Travis , Rao Valluri
Published: December 2020

A novel optical probing technique to measure voltage waveforms from flip-chip packaged complementary metal-oxide-semiconductor (CMOS) integrated circuits (IC) is described. This infrared (IR) laser based technique allows signal waveform acquisition and high frequency timing measurement directly from active PN junctions through the silicon backside substrate on IC’s mounted in flip-chip, stand-alone, or multi-chip module packages as well as wire-bond packages on which the chip backside is accessible. The technique significantly improves silicon debug & failure analysis (FA) through-put time (TPT) as compared to backside electron-beam (E-beam) probing because of the elimination of backside trenching and probe hole generation operations.
Application of Single Contact Optical Beam Induced Currents (SCOBIC) for Backside Failure Analysis
Authors: Palaniappan M. , Chin J.M. , Phang J.C.H. , Chan D.S.H. , Soh C.E. , Gilfeather G.
Published: December 2020

The Single Contact Optical Beam Induced Currents (SCOBIC) is a new failure analysis technique, which allows the imaging of junctions by a single connection to the substrate or power pin of an integrated circuit. Modern packaging technologies and multi-layer metallizations has increased the need for backside IC failure analysis. In this paper, the SCOBIC technique is used to image junctions from the die backside. The implementation of backside SCOBIC system is discussed. Application of the SCOBIC technique from both the frontside and backside of CMOS and NMOS devices are presented.
A Focused Ion Beam Technique to Electrically Contact the Deep Trench Capacitor of a Single Active Memory Cell in the Sub 0.25µm Technology Regime
Authors: Zimmermann Gunnar , Johnston Mark , Christ Rolf
Published: December 2020

Focused ion beam (FIB) techniques are continuously improved to meet the demands of shrinking device dimensions and new technologies. We developed a simultaneous milling and deposition FIB technique to provide electrical contact to small buried targets in semiconductors. This method is applied to directly connect the deep trench (DT) capacitor of a DRAM single cell in deep submicron technology. By carefully adjusting the deposition parameters (scanned area < (0.3 µm)2, beam current < 20 pA) we are able to influence diameter, depth and Pt fill properties of the hole to meet the very restricted requirements for successful DT connection (hole diameter < 200 nm at DT level). Electrical measurements are performed on DRAM single cells after connecting buried plate (n-band), p-well, wordline, bitline and DT. The probe pads were Pt, deposited with ion beam assistance, on top of highly insulating SiOx, deposited with electron beam assistance by using a dualbeam FIB. The read and write conditions of an active memory cell are studied. The presented method increases the capabilities to localize and characterize trench related failure mechanisms.
Humidity-Bias Driven Shorts in Multilayer Circuits: A Case Study in Failure Analysis
Authors: Jen Hei-Ruey Harry , D’Urso Gerald S. , Andrews Harold
Published: December 2020

When a failure analysis (FA) involves a multiple layer structure separated by a polymeric material such as Benzocyclobutene (BCB), in a plastic package, it becomes a very challenging task to find out where the failure site is and how it failed. This is due to the fact that the chemical de-processing procedure removes BCB as well as the plastic molding compound. This paper outlines the studies carried out to determine the failure site and the root cause of the failure mechanism in a multilayer circuit and the steps taken to fix the problems. The methodology and results of this study are applicable to many other types of circuits.
Passivation Cracks in a Four-Level Metal Low-K Dielectric Backend Process
Authors: Olewine Michael C. , DiGregorio John F. , Colovos Gus J. , Saiz Kevin F. , Sun Hongjiang
Published: December 2020

Mechanical stress problems in integrated circuit devices are becoming more severe as the number of metal interconnect levels increases and new materials such as low-k dielectrics are introduced. We studied dielectric cracking in a four-level Al-Cu interconnect structure that uses hydrogen silsesquioxane (HSQ), a low dielectric constant (low-k) material. The cracks extended down through the passivation layers to the HSQ layer. For the first time we report on passivation dielectric cracks directly related to the level of residual fluorine in a plasma enhanced chemical vapor deposition (PECVD) reactor. It is shown that a silicon nitride pre-coat deposition removes fluorine (F) from the reactor ambient and prevents the dielectric cracks.
pn Junction Delineation in Si Devices Using Scanning Capacitance Spectroscopy
Authors: Edwards Hal
Published: December 2020

The scanning capacitance microscope is a carrier-sensitive imaging tool based upon the well-known scanning-probe microscope (SCM). Scanning capacitance spectroscopy (SCS) is useful to utilize an SCM to delineate pn junctions in Si devices. This article reports the applications of SCS to Si devices such as CMOS and BiCMOS. SCS is shown to resolve device features on the 10 nm scale for several technologies. Ongoing work includes verifying the reproducibility of SCS measurements and using physical modeling to support the empirical assignment of depletion region width and electrical pn junction position from SCS data. Another technology area where two-dimensional pn junction data is useful is in CMOS device isolation.
Contactless Voltage and Current Contrast Imaging with Scanning Force Microscope Based Test Systems
Authors: Mertin W. , Bae S.-W. , Behnke U. , Weber R. , Kubalek E.
Published: December 2020

Significant improvements in the performance of modern integrated circuits (ICs) require also an increase of the performance of the used circuit internal test techniques regarding bandwidth, spatial resolution, and sensitivity. Due to its outstanding lateral and vertical spatial resolution in the nanometer regime scanning force microscopy (SFM) based on scanning probe microscopes is well suited for the investigation of very small structures. Furthermore it has been demonstrated that with SFM also electric signals can be contactless tested. This feature can be used for a circuit internal failure analysis of ICs. In this paper principles, examples, and the state-of-the-art of voltage and current measurement based on SFM will be presented.
Transparent Heat Spreader for Backside Optical Analysis of High Power GHz-Scale Microprocessors
Authors: Eiles Travis M. , Hunt Dean , Chi David
Published: December 2020

Optical probing using the Schlumberger IDS-2000 and other infrared-based analysis techniques have proved to be critical in the debug and analysis of flip-chip-packaged microprocessors. During probing, processors are operating with test patterns that generate a large amount of power. This article demonstrates a method for dissipating the generated heat based on a diamond window-based transparent heat spreader. This method controls the microprocessor temperature to a high degree of stability, and reduces thermal gradients across the die. Waveform results are excellent, and the transparent heat spreader provides a path for optical probing to be applied to the entire range of integrated circuit applications. The discussion covers cooling system requirements, and standard configuration specifications, and shows how the transparent heat spreader technique is effective for probing high power microprocessors.
Application of Near IR, Phase-Contrast Imaging to Backside Failure Isolation and Analysis
Authors: Falk R. Aaron , Budiarto Edward W.
Published: December 2020

The move towards flip-chip type packaging has produced significant obstacles for failure analysis. One such obstacle is the breakdown of traditional techniques for failure isolation via thermal mapping, typically used to isolate short circuits and leakage paths. This paper describes the application of near infrared (IR) phase-contrast techniques to allow highly sensitive, ~ 10mK, thermal mapping for backside failure analysis.
Current Image Atomic Force Microscopy (CI-AFM) Combined with Atomic Force Probing (AFP) for Location and Characterization of Advanced Technology Node
Authors: Tong Tom X. , Erickson A. N.
Published: December 2020

Many of the standard techniques of Failure Analysis (FA) are breaking down or becoming less useful as feature sizes drop below 100nm. The tenth micron milestone appears to be a fundamental limitation to many common techniques. Use of Current Image-Atomic Force Microscopy (CI-AFM) combined with Atomic Force Probing (AFP) brings about a combination of technologies, which allow for extension of FA below the nano-scale.
A Comparison of Lock-in Thermography and Magnetic Current Imaging for Localizing Buried Short-Circuits
Authors: Vallett David P.
Published: December 2020

The relative effectiveness of lock-in thermography and magnetic current imaging for identifying defects in packaged ICs was studied by directly comparing results on the same three devices. One known (in-lab fabricated) and two unknown (field return) defects were studied in organic flip-chip and wirebond configurations. Both methods succeeded in identifying the defective area but significant differences were observed in the qualitative nature of the signals, XY localization resolution, and sensitivity. Depth estimates were obtained where possible which aided in localization.
Laser Voltage Imaging: New Perspective Using Second Harmonic Detection on Submicron Technology
Authors: Celi Guillaume , Dudit Sylvain , Parrassin Thierry , Vallet Michel , Perdu Philippe , Reverdy Antoine , Lewis Dean
Published: December 2020

The Laser Voltage Imaging (LVI) technique [1], introduced in 2009, appears as a very promising approach for Failure Analysis application which allows mapping frequencies through the backside of integrated circuits. In this paper, we propose a new range of application based on the study of the LVI second harmonic for signal degradation analysis. After a theoretical study of the impact of signal degradation on the second harmonic, we will demonstrate the interest of this new approach on two case studies on ultimate technology (28nm). This technique is a new approach of failure analysis that maps timing degradation and duty cycle degradation. In order to confirm the degradations we will use the LVP Technique. The last part is two real case studies on which this LVI second harmonic technique was used to find the root cause of a 28nm process issue.
Non-Destructive Open Fault Isolation in Flip-Chip Devices with Space-Domain Reflectometry
Authors: Qiu W. , Wei M.S. , Gaudestad J. , Talanov V.V.
Published: December 2020

Space-domain reflectometry (SDR) utilizing scanning superconducting quantum interference device (SQUID) microscopy is a newly developed non-destructive failure analysis (FA) technique for open fault isolation. Unlike the conventional open fault isolation method, time-domain reflectometry (TDR), scanning SQUID SDR provides a truly two-dimensional physical image of device under test with spatial resolution down to 30 μm [1]. In this paper, the SQUID SDR technique is used to isolate dead open faults in flip-chip devices. The experimental results demonstrate the capability of SDR in open fault detection
Failure Analysis of Bit Line to SNC Leakage Fail in 2x nm DRAM Using Nano-Probing Technique
Authors: Won Jaeho , Kim Jundong , Kim Jina , Shin Jihye , Kim Jihoon , Lee Kyungrim , Yoon Miae , Lee Jonghak , Lee Jaeyoon , Suh Weonjoon , Kim Hyeonsoo
Published: December 2020

Leakage current from bit line to SNC (Storage Node Contact) is one of the most critical issues in DRAM operation. Such failure becomes more difficult to visualize as the device shrinks. In this study, bit line to SNC leakage fail was analyzed using nano-probing tool in 2xnm DRAM technology.
Failure Analysis Strategies for Multistacked Memory Devices with TSV Interconnects
Authors: Altmann Frank , Grosse Christian , Naumann Falk , Beyersdorfer Jens , Veches Tony
Published: December 2020

In this paper we will demonstrate new approaches for failure analysis of memory devices with multiple stacked dies and TSV interconnects. Therefore, TSV specific failure modes are studied on daisy chain test samples. Two analysis flows for defect localization implementing Electron Beam Induced Current (EBAC) imaging and Lock-in-Thermography (LIT) as well as adapted Focused Ion Beam (FIB) preparation and defect characterization by electron microscopy will be discussed. The most challenging failure mode is an electrical short at the TSV sidewall isolation with sub-micrometer dimensions. It is shown that the leakage path to a certain TSV within the stack can firstly be located by applying LIT to a metallographic cross section and secondly pinpointing by FIB/SEM cross-sectioning. In order to evaluate the potential of non-destructive determination of the lateral defect position, as well as the defect depth from only one LIT measurement, 2D thermal simulations of TSV stacks with artificial leakages are performed calculating the phase shift values per die level.
Visible Laser Probing (VLP) with GaP Solid Immersion Lens Demonstrating 110 nm Resolution in Common Laser Probing Applications
Authors: Eiles Travis , Pardy Patrick
Published: December 2020

This paper demonstrates a breakthrough method of visible laser probing (VLP), including an optimized 577 nm laser microscope, visible-sensitive detector, and an ultimate-resolution gallium phosphide-based solid immersion lens on the 10 nm node, showing a 110 nm resolution. This is 2x better than what is achieved with the standard suite of probing systems using typical infrared (IR) wavelengths today. Since VLP provides a spot diameter reduction of 0.5x over IR methods, it is reasonable, based simply on geometry, to project that VLP using the 577 nm laser will meet the industry needs for laser probing for both the 10 nm and 7 nm process nodes. Based on its high level of optimization, including high resolution and specialized solid immersion lens, it is highly likely that this VLP technology will be one of the last optically-based fault isolation methods successfully used.
Electron Beam Induced Resistance Change for Device Characterization and Defect Localization
Authors: Johnson Gregory M. , D’Aleo Christopher , Xu Ziyan , Kwon Unoh , Berman Harvey , Feng Yi , Darling Scott , Yates Brian , Wang Yun , Kagerer Markus , Newton Robert
Published: December 2020

Semiconductor Test Site structures were analyzed using an EBIRCH (Electron Beam Induced Resistance CHange) system. Localization of a RX (active area) to PC (gate) short was achieved with resolution that surpassed that of OBIRCH (Optical Beam Induced Resistance CHange). A voltage breakdown test structure at Metal 1 was stressed in the system, giving isolation to the specific contact. A five-fin diode macro was examined, and it is believed that the electrically active diffusions were imaged as individual fins from Metal 1. A series of ring oscillator devices were examined in steady state condition, and careful consideration of the image supports a hypothesis that Seebeck effect, from heating material interfaces in an EBIRCH system, is the reason for the “dipoles” reported in earlier literature.
ATPG Testing and Diagnosis Implementation in Failure Analysis for a Fast and Efficient Iterative ATPG Diagnosis and Fault Isolation
Authors: Barbian Eric , Estores Rommel
Published: December 2020

This paper will present a practical implementation of ATPG testing and diagnosis in Failure Analysis resulting in a fast and efficient iterative ATPG diagnosis and fault isolation. On this implementation, a compact test HW instead of an ATE is used for cost-effective ATPG testing and characterization capability. The advantages of this implementation are combined with ATPG tools to make it possible to achieve a faster and more efficient implementation of iterative ATPG diagnosis, Dynamic Analysis by Laser Stimulation (DALS) analysis or similar techniques. The requirements needed in order to implement ATPG testing and diagnosis in FA lab will be discussed. Success in determining root cause, especially on the complex analysis cases is determined by the complimentary combination of various fault isolation techniques. Knowledge of the fundamentals of these techniques combined with creative thinking process of the analyst leads to the approaches and solutions that maximize the combined advantages of these techniques.
Precision Xe Plasma FIB Delayering for Physical Failure Analysis of Sub-20 nm Microprocessor Devices
Authors: Zudhistira D. , Viswanathan V. , Narang V. , Chin J.M. , Sharang S. , Novotny K. , Oboňa J. Vincen
Published: December 2020

Deprocessing is an essential step in the physical failure analysis of ICs. Typically, this is accomplished by techniques such as wet chemical methods, RIE, and mechanical manual polishing. Manual polishing suffers from highly non-uniform delayering particularly for sub 20nm technologies due to aggressive back-end-of-line scaling and porous ultra low-k dielectric films. Recently gas assisted Xe plasma FIB has demonstrated uniform delayering of the metal and dielectric layers, achieving a planar surface of heterogeneous materials. In this paper, the successful application of this technique to delayer sub-20 nm microprocessor chips with real defects to root cause the failure is presented.
Re-Packaging Solution of Bare Dice From Customer Packages To Open-Cavity Ceramic Packages
Authors: Mendaros Raymond G. , Mazon Bernardino D. , Capito Eugene , Soriano Romeo S.
Published: December 2020

The advent of bare die form in the semiconductor industry driven by the high-performance multichip modules’ (MCM) requirement posed electrical access and testing challenges on customer returned units (CRUs) for failure analysis (FA). In this technical literature, the developed die extraction processes and re-packaging solution on molded MCM and flex package types were discussed.
A FORMAÇÃO DE PROFESSORES PARA AS (CON)VIVÊNCIAS EM SOCIEDADE
Authors: Prestes da Silveira Dieison , Da Costa Dias Scheffer Denise
Published: December 2020

A formação de professores é uma temática que necessita de constantes debates e provocações dentro do campo do saber, visto que permeia o processo formativo crítico e reflexivo dos sujeitos para as (con)vivências em sociedade. Diante da necessidade de ampliar as discussões envolvendo a formação de professores, o presente artigo busca analisar o processo formativo de docentes, atentando para o processo de ensino e aprendizagem, bem como o papel dos educadores para a construção de momentos críticos e reflexivos, visando o processo de emancipação social dos escolares.  Em se tratando de metodologia, pode-se dizer que esta pesquisa apresenta uma abordagem do tipo qualitativa, tendo por base estudos em referenciais bibliográficos. A formação de professores deve permitir a construção de saberes, vivências e experiências e, sempre que necessário, o professor deve dinamizar o processo de ensino e aprendizagem, atentando para a pluralidade de identidades presentes dentro dos ambientes educacionais. Percebe-se, portanto, a importância do debate envolvendo a formação de professores, visando a construção de sujeitos críticos, autônomos e reflexivos e que saibam atuar com responsabilidade no meio sociocultural.
Pengembangan Buku Ajar Fisika Berbasis Kotekstual pada Materi Medan Magnetik Siswa Kelas XII SMA Negeri 2 Muara Beliti
Authors: Aryansi Dela , Yolanda Yaspin
Published: December 2020

Penelitian ini bertujuan mengembangan buku ajar fisika Berbasis Kontekstual Materi Medan Magnetik pada Siswa Kelas XII SMA Negeri 2 Muara Beliti. Metode penelitian dalam penelitian ini yaitu Research and Developmen, sedangkan model pengembangan  yang digunakan adalah ADDIE dengan 5 tahapan Analyze, design, devlopment, inplementation dan evaluation. Populasi dalam penelitian ini adalah kelas XII IPA 3 dengan 28 orang siswa. Teknik pengambilan sampling menggunakan porposive sampling yang menggunakan 6 orang sampel. Teknik pengumpulan data dalam penelitian ini menggunakan wawacara, observasi, soal tes diagnosis, angket validasi ahli, angket respon guru, angket respon siswa dan buku ajar Fisika Berbasis Kontekstual. Hasil analisis data angket validasi dengan 3 ahli validator yaitu hasil validasi materi dosen fisika 42, hasil validasi materi guru fisika dengan skor 46. Hasil validasi ahli bahasa mendapatkan skor sebesar 18, hasil validasi ahli media mendapatkan skor sebesar 35, sehingga skor akhir yang didapatkan setelah validasi sebesar 35 dengan katagori sangat baik, hasil angket respon 6 siswa diperoleh skor sebesar 3,7 dengan katagori sangat setuju dan hasil angket respon guru dan siswa mendapat skor sebesar 3,6 dengan katagori sangat setuju. hasil nilai uji kompetensi untuk menunjang kepraktisan memperoleh nilai uji kompetensi yang didapat rata-rata 80,3% tuntas mencapai ≥ 75. Sehingga dapat dikatakan bahwa Buku Ajar Fisika Berbasis Kontekstual Materi Medan Magnetik pada Siswa Kelas XII SMA Negeri 2 Muara Beliti Telah Valid Dan Praktis.
AYDIN KADIOĞLU ZEYBEĞİNİN KEMANA UYARLANMASI
Authors: GÜLÜM Ozan
Published: December 2020

Araştırmanın amacı, Aydın Kadıoğlu Zeybeğinin geleneksel davul-zurna icralarında bulunan karakteristiği yansıtıcı bir keman uyarlamasını ortaya koymak; bu uyarlamanın nasıl yapılacağına ilişkin gerekli adımları belirlemek; Aydın Kadıoğlu Zeybeği geleneksel davul-zurna icra karakteristiği ve uluslararası keman çalma tekniklerini bir arada kullanırken karşılaşılabilecek sorunlara çözüm önerileri geliştirmek; Aydın Kadıoğlu Zeybeğinin geleneksel üç davul-zurna icrasının detaylı notasyonunu ve bu notasyonun analizini yaparak kayıt altına almaktır. Nitel bir araştırma olan bu çalışmada betimsel araştırma yöntemlerinden genel tarama modeli benimsenmiştir. Ayrıca keman uyarlamasının geleneksel icralarda görülen karakteristik müzikal unsurları ne düzeyde yansıttığının tespitine yönelik 5’li likert tipine uygun bir görüşme formu hazırlanmıştır. Araştırma sonucunda, Aydın Kadıoğlu Zeybeği üç davul-zurna icrasında 9/2’lik bileşik usulün 3+2+2+2 diziliminin kullanıldığı; icraların ana zurna, dem zurna ve davul olmak üzere üç partiden oluştuğu; ezginin neveser makamına geçki bulunan nikriz makamı ile oluştuğu tespit edilirken; karakteristik öğelerin dem ses, çarpma, çift çarpma, vibrato, glissando, ritardando, accelerando ve üçleme olduğu belirlenmiştir. Keman uyarlamasının müzikal analizinde nikriz makam seslerinin kullanıldığı; sağ elde detache, legato, staccato ve ricochet yay teknikleri kullanıldığı; sol elde çift tel çalma, pizzicato, glissando, çarpma, çift çarpma, trill, aksan ve flajöle kullanıldığı ve I-II-III-IV.konumlar kullanıldığı tespit edilmiştir. Alan uzmanlarının görüşleri neticesinde Aydın Kadıoğlu Zeybeği keman uyarlamasının, araştırma kapsamında belirlenen karakteristik öğeler doğrultusunda, geleneksel icralardaki karakteristiği yansıttığı tespit edilmiştir.
PERSEPSI PEGAWAI TERHADAP KEHADIRAN CALO LAYANAN ADMINISTRASI PADA DINAS KEPENDUDUKAN DAN CATATAN SIPIL KABUPATEN BIMA
Authors: Jafar M.Ulfatul Akbar , Rachman M. Taufik , Iswanto Dedy
Published: December 2020

Public interest in the community is the main target in public service providers. Officials of the Office of Population and Civil Registry as a bureaucrat at the regional level are required to be able to handle the constraints faced in the government's promoted development efforts. Officials of the Office of Population and Civil Registration must be able to carry out its first function is to provide services to the community well, deft, effective and efficient. Another problem that often arises is the discipline of employees in providing services this proved many employees who come not on time, start the service not on time, rest not in time, and employees also home before the time to go home. This also greatly affects the service because if the shortage of employees then the counter service that will be opened also a little, so that the impact of many people who are not served. The purpose of this research are; 1) To know Employee Perception Against Attendance of Administration Service Bureau at Department of Population and Civil Regent of Bima Regency; 2) To know the Factors that may affect the Presence of Calo Administration Services At the Department of Population and Civil Registration Bima District.This research uses qualitative approach method with technique of determination of informant use Purposive sampling, meaning intentionally intake technique. Methods of data collection ie observation, interview (Interview) and documentation. Data type is qualitative data and sourced from secondary and primary data with data analysis technique Data Reduction, Data Presentation (Data Display), and Conclusion drawing / verification.The result of research shows that: The distance of the Office of Population and Civil Registry of Bima Regency is far and there is no public transportation passing through it. So that has a private vehicle that many do service in the Department of Population and Civil Registry Bima District, for people living in remote areas usually take care of services, especially the service of birth certificate by handing someone close to his relationship with bureaucracy or brokers even if they have to pay more. The presence of brokers is difficult to separate from public services. But now their existence began to decrease, because the government increasingly simplify the process of document management and licensing.)
ANALISIS KEMAMPUAN KOMUNIKASI MATEMATIS SISWA DITINJAU DARI GAYA BELAJAR
Authors: Riyadi Muhammad , Pujiastuti Heni
Published: December 2020

Tujuan penelitian ini adalah untuk mengetahui kemampuan komunikasi matematis siswa ditinjau dari gaya belajarnya. Metode penelitian yang digunakan ialah metode penelitian deskriptif. Data dikumpulkan melalui tes dan observasi. Subjek penelitian ini sebanyak 30 orang siswa dari SMK Kesehatan Husada Pratama, dengan masing-masing gaya belajar terdapat 10 subjek. Hasil penelitian menunjukkan bahwa kemampuan komunikasi matematis siswa dengan gaya belajar visual berada pada kategori kemampuan rendah, kemampuan komunikasi matematis siswa dengan gaya belajar auditori berada pada kategori kemampuan sedang, dan kemampuan komunikasi matematis siswa dengan gaya belajar kinestetik berada pada kategori kemampuan sedang. Pada hasil juga menunjukkan bahwa rerata total skor siswa dengan gaya belajar kinestetik lebih baik 1,9 dari siswa dengan gaya belajar auditori, dan lebih baik 4,3 dari siswa dengan gaya belajar visual. Hal ini menunjukkan bahwa kemampuan komunikasi matematis siswa SMK Kesehatan Husada Pratama berada pada kategori sedang, dan gaya belajar kinestetik lebih baik daripada gaya belajar visual ataupun auditori.
VISUAL ESSAY: The Auteur and The Personal Comic: A Reconstruction of Online Identities
Authors: Frederick Gideon K
Published: December 2020

When comic artist creates a personal comic, whose identities portrayed in the comic? Himself or his reconstructed image? More so, when the comic is published in social media, many viewers presumed that the comic is a mirror of the auteur life itself. This is where the constructed identities and real identities is reconstructed: negotiated, blurred between fiction and non-fiction.
Pengujian Geser Limestone Untuk Menghitung Angka Keamanan Terhadap Kelongsoran Di Utama Mandala Pura Uluwatu
Authors: Ramia I Nyoman , Arya I Wayan , Wiraga I Wayan , I G A G Suryanegara I G A G
Published: December 2020

The shear strength value is one of the important points in calculation of slope stability. One way to obtain the shear strength value is to do a direct shear test in laboratory. Like the cliff reinforcement study at Utama Mandala Uluwatu temple which is currently experiencing crack, it is necessary to test the shear strength of the limestone material at the cliff of the temple . There is no limestone testing equipment in the laboratory of the Civil Engineering Department, so that innovation is needed on the existing sliding test equipment. In this study innovation was carried out on how to test the soil shear strength so that it could be used to test the limestone shear strength. The test is done by moving two limestone surface that have been formed based on the mold tool which shape is circle. The shear strength slope at Uluwatu temple, which is currently experiencing crack in dry condition is . The shear strength value is used for calculating slope stability at Uluwatu Temple which is currently experiencing crack wich . The calculation used is curved slope stability by only calculate the life load and dead load. From the calculation of the stability of the slope, the safety factor is 1.15.
Penentuan Prioritas Perbaikan Gedung Menggunakan Metode Ahp Dari Sudut Pandang Tenant
Authors: Santosa Stefanus , Rochadi Mochammad Tri , Suroso Suroso , Mawardi Mawardi , Suwarto Suwarto
Published: December 2020

Bangunan mall adalah pusat perbelanjaan yang secara arsitektur berupa bangunan tertutup dengan suhu yang diatur dan memiliki jalur yang teratur. Infrastruktur bangunan mall terdiri dari beberapa tenant yang menawarkan berbagai macam kebutuhan masyarakat serta adanya atrium dalam mall yang berfungsi sebagai tempat pameran. Tujuan dari penelitian ini adalah mengetahui urutan prioritas dan kondisi bangunan mall, yang berguna sebagai acuan dalam kegiatan perbaikan yang berimbas pada kepuasan tenant. Permasalahan kepuasan tenant dapat diakibatkan dari berbagai faktor salah satunya, yaitu terkait fasilitas, perbaikan gedung dan penanganannya yang dikhawatirkan dapat mempengaruhi produktivitas. Data primer pada penelitian ini diperoleh dengan cara pengamatan langsung di lokasi penelitian, dan menyebarkan form kuisioner kepada responden yang terkait. Data sekunder diperoleh dari data penelitian terdahulu, peraturan yang berlaku, dan pedoman bangunan gedung. Penelitian ini menggunakan metode Analytical Hierarchy Process (AHP), untuk menentukan bobot komponen yang diperoleh dari hasil penilaian kepentingan komponen bangunan, oleh masing-masing responden. Hasil analisis menunjukkan bahwa faktor pertimbangan utama perbaikan gedung peringkat pertama adalah faktor kenyamanan dengan nilai prioritas 21,299%, peringkat kedua faktor keselamatan dengan nilai prioritas 18,343%, peringkat ketiga faktor dana/ biaya yang terbatas dengan nilai prioritas 16,192%. Berdasarkan model hierarki yang telah disusun, maka dapat ditemukan Model Prioritas Pengambilan Keputusan Perbaikan Gedung khususnya Mall dengan mempertimbangkan faktor kenyamanan, kesehatan, keselamatan, kemudahan akses, dana/ biaya yang terbatas, petugas yang terbatas, dan waktu yang terbatas (deadline).
Water footprint assessment for citizens in Ho Chi Minh city
Authors: Thanh Canh Truong , Thi Nguyen Thuy-Trang , Le Anh Hoang
Published: December 2020

The research conducted a survey of the water consumption in Ho Chi Minh City through the consumption of products from agriculture, industry and domestic. The research identified green water, blue water and grey water footprints in consuming products. Then personal water footprints were calculated and evaluated. The results showed that the average personal water footprint in district 3 was 1556 m3/year (77.15% for agriculture, 15.59% for industry and 7.26% for domestic), district 10 was 1587 m3/year (77.58% for agriculture, 15.17% for industry and 7.25% domestic), Nha Be district is 1681 m3/year (80.48% for agriculture, 12.97% for industry and 6.55% for domestic) and Binh Chanh district was 1744 m3/year (81.57% for agriculture, 11.88% for industry and 6.55% for domestic). In the individual components of the water footprint, water footprints in consuming agricultural products accounted for the major percentage and determined the personal water footprint. The results showed that the individual water footprints in countryside areas were higher than those in urban areas. Depending on the amount and forms of each individual's consumption, their eating habit and daily activities, and the sexes, the personal water footprints were different. The perception and behavior of individuals' water consumption also significantly influenced the overall personal water footprints.
Features of smart learning at high school
Authors: Adzhemov A. S. , Manonina I. V. , Shestakov V. V.
Published: December 2020

Infocommunication technologies are increasingly intruding into the learning process, including higher education. The widespread access to omnifarious information resources from various telecommunication devices — computers, tablets, smartphones — taking into account the relatively high coverage of the territory with wireless communications, provides the necessary conditions for creating individual learning opportunities based on objective indicators of learning material and mastering the required skills and abilities. You must take into account already existing experience and established tradition, the ability to perceive new and prepared to use a variety of modern ICT solutions to educational institutions, not only students, but also their teachers as well as the willingness of the relevant learning and teaching materials. To implement this, it is necessary to form not only educational-methodical materials, but also an adequate control and measuring environment, which allows obtaining objective assessments characterizing the process of studying the discipline and the quality of mastering the material. For this purpose, the authors propose to create a model of an intellectual lecture-presentation with a built-in testing subsystem, in which there is a possibility of a step-by-step study of the educational material with the fixation of the quality of mastering the material in the form of certain indicators. Such indicators may include: the time spent on each element (slide) of the course, taking into account the number of reference to this element; the dynamics of answers to test questions — an indicator reflecting the speed of mastering the educational material; the number of correct and incorrect answers, as well as the number of missed questions when performing tests — an indicator reflecting the volume of assimilation of educational material, etc. The analysis of the collected quantitative indicators allows you to determine the dynamics of the study of the course and build an individual trajectory of the student’s learning, as well as develop appropriate recommendations for studying the course, which may appear after any slide, which is determined by the result of the analysis of the time and test results. Moreover, these recommendations can be both advisory and directive, compulsory. Thus, the created model of intellectual lecture-presentation allows you to form an objective “electronic educational portrait” of a student, taking into account his individual characteristics, interests and abilities, which makes it possible to study and assimilate not only formal knowledge, but also support the desire to learn new things.
Alman Yeraltı Edebiyatında Türkiyeli Yazarlar
Authors: DEMİR Fethi
Published: December 2020

21. yüzyılın başat edebiyat eğilimlerinden/tarzlarından biri olan Yeraltı edebiyatı özü itibariyle her türlü illegal ve gayriahlaki davranışın ve edimin kendine yer bulduğu, cinselliğin, şiddetin, müptezelliğin, anarşist ve köktenci bir yaklaşımla kotarıldığı; üslup bakımından ise argonun, küfrün, jargonun egemen olduğu bir edebiyattır. Tüm dünyada olduğu gibi Almanya’da da Yeraltı edebiyatı, özellikle Türkiyeli göçmen yazarların katkılarıyla son dönemlerde yaygınlık kazanmıştır. Almanya’da Yeraltı edebiyatı, esas olarak Nazi dönemindeki uygulamaların neticesinde gelişir. Dönemin koşulları; muhalif yazarlar açsından yeraltına çekilmek, hem içerik hem üslup hem de yayımlanma teknikleri bakımından “illegalleşmek” gibi Yeraltı edebiyatının temel kriterlerini kullanmayı zorunlu kılar. Her ne kadar Nazi rejiminin 1945’te yıkılmasıyla fiili anlamda gerekliliği ortadan kalksa da Yeraltı edebiyatı, bir tür ve eğilim olarak varlığını sürdürür. İşte Almanya’daki Yeraltı edebiyatı, yansımaları günümüze kadar süren bu ana izlek etrafında çeşitlenir ve genişler. Bu bağlamda yazarların odaklandığı bazı konular dikkat çekmektedir. Bunlar; 1960’lı yılların devrimci romantik ikliminden doğan Beat kuşağının öncülüğünü yaptığı anarşist tavrın edebiyata yansımaları, 1990’da iki Almanya’nın birleşmesiyle ortaya çıkan problemler ile işsizlik, ötekileştirme, ayrımcılık, ırkçı saldırıların yarattığı sorunlardır. Bu bağlamda Yeraltı edebiyatı tarzında eser veren Türk yazarların sayısının azımsanmayacak bir yekûna tekabül ettiğini söylemek gerekir. Çünkü üçüncü hatta dördüncü kuşağını oluşturan yaklaşık 10 milyonluk bir nüfusa sahip Türkiyelilerin hâlâ muhatap olmaktan kurtulamadıkları önyargılar, şiddete varan ırkçı saldırılar, ekonomik ve sosyopsikolojik sorunlar devam etmektedir. Nihayetinde bu makûs talihi tersine çevirmek için edebiyata sarılan yazarların; müesses nizamı sarsması, günlük dili yapısöküme uğratması, argoyu, küfrü ve cinselliği sansürsüzce kullanması, rap kültürden beslenmesi, edebi türleri amorflaştıran deneyselliklere meyletmesi kaçınılmazdır. Aşağılayıcı bir sıfat olarak kullanılan Kanak terimini itirazın ve isyanın alfabesi olarak yeniden üreten ve pejoratif anlamından uzaklaştırarak olumlu bir kimlik tanımına dönüştüren yazarların yolu Yeraltı edebiyatının paftalarıyla çakışmak zorundadır. Bu bağlamda Feridun Zaimoğlu’nun açtığı kanaldan gelerek sadece Türkiyelilerin değil; tüm göçmenlerin, ötekileştirilenlerin, kaybedenlerin, müptezellerin, iflah olmaz muhaliflerin çığlığına dönüşen Yeraltı edebiyatı; Deniz Utlu, Mutlu Ergün, Selim Özdoğan, Dilek Güngör ve Lütfiye Güzel gibi yazarların eserlerinde varlığını sürdürmeye devam etmektedir.