Thin Film Deposition Techniques: A Comprehensive Review
Authors: Toma Fatema Tuz Zohora , Rahman Md. Sharifur , Hussain Kazi Md. Amjad , Ahmed Syed 
Published: November 2024

Objective: This article presents a comprehensive review of thin film preparation techniques, focusing on their theoretical foundations, practical applications, and recent advancements in the field of materials science. Methods: The review begins with thermal evaporation, a widely used method praised for its simplicity and effectiveness in producing high - purity films. This technique relies on the principle of thermal vaporization, where materials are heated to evaporate and subsequently condense on a substrate. Next, sputtering is discussed for its versatility in depositing various materials, providing excellent film adhesion and uniformity. This technique is vital for applications in magnetic materials and photovoltaics, with an emphasis on the role of process parameters in achieving desired film characteristics. The article continues with chemical vapor deposition (CVD) and its low - pressure variant, Low - Pressure chemical vapor deposition (LPCVD). These methods are recognized for creating conformal coatings with precise thickness control, essential in integrated circuit manufacturing. The review highlights the gas - phase reactions and surface kinetics that drive these deposition processes. Plasma - enhanced chemical vapor deposition (PECVD) is examined for its advantages in depositing films at lower temperatures compared to traditional CVD. This method utilizes plasma to enhance chemical reactions, allowing for the deposition of a wide variety of materials on temperature - sensitive substrates, including dielectrics and semiconductors. Molecular beam epitaxy (MBE) is highlighted for its atomic - level precision in film deposition, critical for nanotechnology applications. The mechanisms of MBE are discussed, emphasizing its importance in producing high - quality semiconductor materials and multilayer structures. The review also covers atomic layer deposition (ALD), known for its capability to deposit films with atomic - scale control, making it essential for fabricating high - k dielectrics and quantum dots. The article elaborates on the sequential self - limiting reactions that characterize ALD processes. Additionally, chemical bath deposition (CBD) is introduced as a cost - effective method for depositing metal chalcogenides and oxides, particularly in solar cell applications. The principles of CBD are discussed, including how supersaturation in solution facilitates uniform film growth. Results: Thin films are pivotal in various technological domains, including electronics, optoelectronics, energy conversion, and sensor technologies. Given their significance, a thorough understanding of the different deposition methods is essential for developing high - performance materials and devices. Conclusion: In summary, the article addresses the future prospects of thin film deposition techniques, emphasizing the need for ongoing research to enhance film quality, optimize processes, and expand the range of applicable materials. This review serves as a valuable resource for researchers and practitioners, providing insights into the diverse methodologies available for thin film preparation and their implications for advancing technology in various fields. The synthesis of these techniques illustrates the dynamic landscape of thin film technology, underlining its critical role in future innovations.