bluuebunny/crossref_metadata_2025 huggingface dataset:
Shape Control of a FRP Airfoil Structure Using SMA-Actuators and Optical Fiber Sensors
Authors: Ruotsalainen Pasi , Kroneld Petter , Nevala Kalervo , Brander Timo , Lindroos Tomi , Sippola Merja
Published: March 2009

The aim of this work was to design a control system for the shape memory alloy (SMA)
actuator operated airfoil (a cross section of wind turbine blade). Design of SMA control is focused
on the reliable operation of the SMA actuators. The actuator should follow the targeted shape
accurately and without too much delay. Another objective is to avoid overheating which is the most
critical damage to the structure. SMA actuator shape control is in principle possible to do with any
position control method, but the specific properties of the SMA actuators, like the hysteresis, the
first cycle effect and the long term changes, need to be taken into account.
In this work, a wing profile prototype was measured using optical fiber sensors and traditional
strain gauges. Also, external laser sensors were used to measure displacements of upper/lower
surface and trailing edge. Shape change was obtained by embedding SMA wire actuators into fiber
reinforced polymer (FRP) composite structure. SMA actuators were laminated in such way that
bending of trailing edge is always downwards. Actuators are activated with Joule heating and the
temperature is measured with integrated thermocouples and optical fiber temperature sensors.
As a result, this work gave information about the usability of optical fibers sensors in active FRP
composite structures. Measurements also give information about the efficiency of SMA actuators in
shape control of relatively stiff FRP structures.
Rotor Crack Detection Using Active Magnetic Bearings
Authors: Sawicki Jerzy T.
Published: March 2009

Well-established procedures exist to monitor and diagnose fairly severe problems with
rotating machinery but little progress has been made in developing techniques to detect subtle
changes in machine condition for both improved diagnostics, and to develop prognostic procedures
for determining remaining service life. Of all machine faults, crack initiated problems present
probably the most significant safety and loss hazard in modern turbomachinery, including aircraft
engines and power generation units. Different approaches are used to model, detect, and localize
crack-induced damage in rotating structures. This paper presents novel application of active
magnetic bearings (AMBs) for on-line rotor crack detection. AMB-actuators provide convenient
means to apply a broad spectrum of known dynamic forces and monitor responses in a rotor-bearing
system, which facilitates more sensitive and precise diagnostics. The paper presents theoretical
modeling and description of the experimental facility for proof-of-concept testing.
Test Stand for Analysis of Fatigue Crack Propagation under Bending with Torsion
Authors: Gasiak Grzegorz , Robak Grzegorz
Published: March 2009

The paper presents a test stand for measurements of fatigue crack propagation. The stand
includes a fatigue machine MZGS–100 and a device for registration of the crack length. The test
stand is equipped with a stereoscopic microscope with fluent magnification of 7× – 67.5×. The
microscope can be applied for observation of fatigue crack development. The microscope is also
equipped with a digital camera, which enables continuous observation of fatigue crack development
on the computer monitor and it is not necessary to stop the machine. The test results obtained at this
stand can be used for determination of fatigue life and fatigue crack propagation rate.
Trace Metallic Contamination Analysis on Wafer Edge and Bevel by TXRF and VPD-TXRF
Authors: Takahara Hikari , Tsugane Ken
Published: March 2009

In the semiconductor industry, the edge exclusion of processed wafers is decreasing to accommodate more integrated circuits. With this trend, there is a higher risk of detrimental contamination at the wafer edge and bevel making the monitoring for metallic contamination in these areas critical. Cross contamination from the edge and bevel can occur at many processing steps. For example, metals can spread from the wafer edge, bevel and backside to the wafer’s surface in a wet cleans process. In immersion lithography, the water drop that is scanned across the wafer could transport contamination from the edge and deposit it across the wafer surface. Contamination on wafer edge and bevel can have many origins; handling systems in every process tool, reaction products in etching, and residuals of new materials in high-k for CVD and PVD, for example. To know what metallic contamination is present, and to investigate the causes are essential for wafer edge control.
Surface Potential Difference Imaging Applied to Wet Clean Monitoring
Authors: Danel Adrien , Sage S. , Roure M.C. , Peters D. , Hawthorne Jeff , Spicer R.
Published: March 2009

The monitoring and optimization of wet clean and surface preparation processes is a major challenge in the microelectronics industry [1, 2]. Today, the main methods used in clean rooms are visual inspection by light scattering (principally applied to particle detection) and metallic contamination detection by Total-reflection X-Ray Fluorescence (TXRF). These methods, despite good sensitivity and recent progress [3, 4] are not sufficient, especially considering non-visual defects not measurable by light scattering, nor TXRF due to their chemical nature or to their size and location (TXRF is not applicable to light elements – with Z < 11 – and is typically a 1 cm resolution tool, with 1 to 2 cm edge exclusion). Non-vibrating Surface Potential Difference Imaging (SPDI), introduced in 2005 under the name of ChemetriQ® is an in-line, non-contact, non-destructive inspection technique based on the imaging of surface Work Function (WF) lateral non-uniformities [5]. Recent studies show very promising results for SPDI: high sensitivity to traces of metals on Si wafers with native oxide [6]; fast imaging capabilities of unpatterned or patterned wafers with sensitivity to chemical residues and charge [7, 8]. In this work, the ChemetriQ method is evaluated for in-line control of wet clean processes. The variation of SPDI data from various contaminants is compared to intra- and inter-wafer variations related to the cleaning and measurement conditions. Note that all wafer maps are presented with the notch oriented at 6:00.
Impact of Metal-Ion Contaminated Silica Particles on Gate Oxide Integrity
Authors: Rink Ingrid , Wali Faisal , Knotter D. Martin
Published: March 2009

The impact of metal-ion contamination (present on wafer surface before oxidation) on gate oxide integrity (GOI) is well known in literature, which is not the case for clean silica particles [1, 2]. However, it is known that particles present in ultra-pure water (UPW) decrease the random yield in semiconductor manufacturing [3]. The presence of silica in UPW is common knowledge. UPW has also a certain content of metal ions, which can be attached to silica. That means, when a wafer is in contact with UPW metal ion can directly and/or in form of a silica-metal conglomerate be attached to the wafer surface. That means, it is not known in which form metal-ion contamination will deteriorate GOI the most. In order to receive more clarity in this field a short-loop study was set up, where we want distinguish between the impacts of
- low metal ion contamination (Calcium),
- clean silica particles (330nm) contamination,
- silica particles with metal-ion core (330nm) contamination, and
- metal-ion contamination at similar concentration as the metal-ion core of the particles on GOI (uniform and none uniform distribution).
Low Temperature Pre-Epi Treatment: Critical Parameters to Control Interface Contamination
Authors: Loo Roger , Hikavyy Andriy , Leys Frederik E. , Wada Masayuki , Sano Kenichi , De Vos Brecht , Pacco Antoine , Bargallo Gonzalez Mireia , Simoen Eddy , Verheyen Peter , Vanherle Wendy , Caymax Matty
Published: March 2009

Several device concepts have been further evaluated after the successful implementation of epitaxial Si, SiGe and/or Si:C layers. Most of the next device generations will put limitations on the thermal budget of the deposition processes without making concessions on the epitaxial layer quality. In this work we address the impact of ex-situ wet chemical cleans and in-situ pre-epi bake steps, which are required to obtain oxide free Si surfaces for epitaxial growth. The combination of defect measurements, Secondary Ion Mass Spectroscopy, photoluminescence, lifetime measurements, and electrical diode characterization gives a very complete overview of the performance of low-temperature pre-epi cleaning methods. Contamination at the epi/substrate interface cannot be avoided if the pre-epi bake temperature is too low. This interface contamination is traceable by the photoluminescence and lifetime measurements. It may affect device characteristics by enhanced leakage currents and eventually by yield issues due to SiGe layer relaxation or other defect generation. A comparison of state of the art 200 mm and 300 mm process equipment indicates that for the same thermal budgets the lowest contamination levels are obtained for the 300 mm equipments.
Defects of Silicon Substrates Caused by Electro-Static Discharge in Single Wafer Cleaning Process
Authors: Hagimoto Yoshiya , Iwamoto Hayato , Honbe Yasushi , Fukunaga Takuro , Abe Hitoshi
Published: March 2009

While batch wafer cleaning processes have been conventionally used in the semiconductor manufacturing for many years, the use of single wafer cleaning processes in the manufacturing has recently become increasingly widespread. Single wafer cleaning processes have the advantages of reducing particle and metal contamination, however, electric charge or electrostatic discharge phenomena occurring in these processes causes serious problems such as device destruction through insulation failure and circuit disconnection [1,2]. Well-known examples are the breakdown of the ultra-thin gate oxide and the dissolution of Cu wiring due to charging-up damage in de-ionized water rinsing, which occur during the single wafer wet cleaning process in semiconductor manufacturing. We investigated the problem of wafer defects caused by electrostatic discharge and characterized them using transmission electron microscope (TEM) and energy dispersive X-ray (EDX) analyses.
Effect of Wet Treatment on Stability of Spin-On Dielectrics for STI Gap-Filling in Nanoscale Memory
Authors: Kim Gyu Hyun , Park Soon Young , Pyo Seung Seok , Han Ji Hye , Kim Jung Nam , Oh Kee Joon , Ryu Choon Kun , Choi Yong Soo , Kwak Noh Jung , Park Sung Ki
Published: March 2009

As a design rule of memory devices is scaled down to sub-100 nm, shallow trench isolation (STI) technology is faced with gap-filling problem in case of CVD oxide and O3-TEOS oxide processes. To overcome the gap-filling problem, a perhydropolysilazane (PHPS) based spin-on dielectric (SOD) has been implemented for nanoscale devices because of self-planarization and excellent gap-filling property [1]. However, the stability of the SOD has been concerned about because it has relatively softer and more porous than conventional HDP oxide. In this paper, we report the effect of wet oxidant treatment on the stability of the SOD for STI gap-filling.
Etch Rate Study of Germanium, GaAs and InGaAs: A Challenge in Semiconductor Processing
Authors: Sioncke Sonja , Brunco David P. , Meuris Marc , Uwamahoro Olivier , Van Steenbergen Jan , Vrancken Evi , Heyns Marc M.
Published: March 2009

The Si transistor has dominated the semiconductor industry for decades. However, to fulfill the demands of Moore’s law, the Si transistor has been pushed to its physical limits. Introducing new materials with higher intrinsic carrier mobility is one way to solve this problem. Ge, GaAs and InGaAs are known for their high mobilities and are therefore suitable candidates for replacing Si as a channel material. However, introduction of new materials raises new issues. For Si processing, several steps such as cleaning, etching and stripping are based on wet treatments. The knowledge of etch rates of the semiconductor material is of great importance. In this paper, etch rates of Ge, GaAs and InGaAs in several chemical solutions are studied. A comparison of the etch rates is made between the materials.
Photoresist Adhesion during Wet Etch on Single Wafer Tool
Authors: Garnier Philippe , Pernet B. , Gomez Y. , Duluard C. , Torres Alphonse , Barge David , Gatefait M. , Lévy Didier
Published: March 2009

Integrating multiple gate oxides on a same die requires a proper definition of their respective active area (fig. 1). First the thick gate oxide is grown, and covered by some photoresist. Then a wet etch removes this oxide on the die areas where the resist has been developed. Finally, after resist stripping and surface cleaning, the thin gate oxide is grown. The interaction between the thick oxide surface, the resist and the etchant makes the wet etch challenging. This paper deals with some characterizations and solutions to improve this process.
Co-Solvent Effect on the HF/CO2 Dry Etching of Sacrificial Oxides
Authors: Bae Jae Hyun , Jung Jae Mok , Lim Kwon Taek
Published: March 2009

In this work, we studied HF/scCO2 dry etching processes with various co-solvents for the purpose of reducing the residues. The effect of co-solvent on etch rate and selectivity was also investigated.
Steam-Injected SPM Process for All-Wet Stripping of Implanted Photoresist
Authors: DeKraker David , Pasker Blake , Butterbaugh Jeffery W. , Christenson Kurt K. , Wagener Thomas J.
Published: March 2009

Photoresist stripping in IC manufacturing has become more challenging as the number of photoresist levels has increased while at the same time allowable material loss and surface damage has decreased. Heavily implanted photoresist is especially challenging due to the dehydrogenated, amorphous carbon layer that forms on the surface [1]. To facilitate implanted photoresist removal, this layer can be attacked by physical processes such as ion bombardment as part of the common dry ashing approach. However, these physical approaches can lead to surface damage and increased material loss. Another approach is to increase the reactivity of the sulfuric acid – hydrogen peroxide mixture (SPM), so that it can penetrate and dissolve the amorphous carbon layer and achieve complete photoresist removal.
Stripping of Ion Implanted Photoresist by CO2 Cryogenic Pre-Treatment Followed by Wet Cleaning
Authors: Malhouitre Stéphane , Vos Rita , Banerjee Souvik , Cheng Paul , Bearda Twan , Mertens Paul W.
Published: March 2009

In FEOL processing, doping of active areas like source, drain, and extensions (NMOS and PMOS) is done by ion implantation. Un-doped regions are covered with photoresist to protect them from implantation. Ion implantation modifies the surface of the photoresist to generate a dehydrogenated amorphous carbon layer, the crust [1]. When the implant conditions are more aggressive (higher implant energy and implant dose), the hard crust becomes more and more challenging to be removed [2]. Conventionally, a plasma ashing process followed by a wet cleaning, typically SPM (Sulfuric acid/Hydrogen peroxide mixture) chemistry, can remove the implanted photoresist, but usually leads to damage and strong oxidation of the underlying semiconductor material and hence result in material or dopant loss. As the technology node migrates beyond 45nm, the photoresist removal process should also be compatible with novel materials such as high-k dielectric and metal-gate used in advanced gate stack integration. For these reasons, it is desirable to eliminate the plasma ash and SPM clean chemistry. Wet only PR removal process is studied using new chemistries like solvents that are compatible with the other FEOL process steps, however, the photoresist removal using solvents only still showed lower removal efficiency than conventional processes. It has been demonstrated that the CO2 cryogenic pre-treatment can improve the ion implanted photoresist stripping efficiency of the wet cleaning processes [3], and can also enhance the photoresist removal efficiency by the solvents.
Removal of Nano-Particles by Aerosol Spray: Effect of Droplet Size and Velocity on Cleaning Performance
Authors: Xu K. , Pichler S. , Wostyn Kurt , Cado G. , Springer C. , Gale Glenn W. , Dalmer Michael , Mertens Paul W. , Bearda Twan , Gaulhofer E. , Podlesnik D.
Published: March 2009

As the dimensions of the structures of integrated circuits shrink, the influence of particles on device yield becomes increasingly important. According to the cleaning requirements of the International Technology Roadmap for Semiconductors (ITRS) in 2007, particles of 32 nm and larger are believed to be detrimental to devices and thus have to be removed. To remove nano-particles with minimal substrate loss and no damage requires very dilute chemistries and sufficiently gentle physical forces in a cleaning process. In this work the performance of an aerosol spray based cleaning technique is evaluated with regard to the removal efficiency of nano-particles as well as substrate loss and structural damage.
Design and Development of Novel Remover for Cu/Porous Low-k Interconnects
Authors: Suzuki Tomoko , Otake Atsushi , Aoki Tomoko
Published: March 2009

At 32nm and below the integration of extreme low-k dielectrics (ELK) with a permittivity of 2.2 or lower will require considerable process optimization at etch and clean to maintain critical dimension (CD) and effective k. Of equal concern is the impact on yield and reliability of lateral Cu etch or incomplete removal of copper oxides (CuOx) during post etch residue (PER) cleaning. These are not new issues but the challenges of solving them in the presence of ELK’s are considerable not least in relation to the question of selectivity towards “damaged low k” interfaces, often described as densified or C depleted layers.
Characterization of Post Etch Residues Depending on Resist Removal Processes after Aluminum Etch
Authors: Heidenblut Maria , Sturm D. , Lechner Alfred , Faupel Franz
Published: March 2009

The subject of this report is the characterization of plasma etch residues after a metal etch process with Cl2/BCl3 etch gases. One of the interactive factors in the removability of the residues is the photo-mask removal process (DSQ). Depending on the DSQ process the molecular structure of the residues will differ. For our findings, we used laser spectroscopy and Fourier-transformed infrared spectroscopy to obtain information about the degree of the cross-linking of the molecular structure of residues in a post-metal etch cleaning process. The post-etch cleaning is important for removing residues remaining after the metal structuring process. The main goal is to use emission spectroscopy for studying the compounds of the dry-etch related residues. Finally, it was shown that small variations in wafer treatment directly after dry-etching results in different solubilities of residues in HDA (hydroxylamine) based solutions. [1]
High Aspect Ratio Contact Clean Study in 58nm Flash Device
Authors: Yu Pi Chun , Chen Cheng Kuen , Lin Jin Lang , Wu Chih Ning , Matsuo Hiroshi
Published: March 2009

In the conventional wet cleaning process of contact holes landing on the Si substrate and WSi metal gate, the ILD BPTEOS bowing and CD enlargement were often found by using dilute HF solution. With the device design rule decreasing, the CD size control and cleaning efficiency enhancement are highly demanded. In this work, the high aspect-ratio contact (AR~10) cleaning in single wafer (SW) tool was demonstrated in 58nm flash device. With the facilitation of nano-spray function to enhance particle removal efficiency (PRE), AM1 cleaning in SW tool can achieve the low contact resistance and tighten Rc distribution with less ILD film damage and lower CD enlargement. The parameter dependency of SW tool, including chemical injection method, nozzle swinging effect and nano-spray function, on contact resistance was also investigated. Compared to AM1 cleaning in bench tool, AM1 process in SW tool performs the larger process window for less ILD film damage at higher temperature and concentration.
Process Dependence on Defectivity Count on Copper and Dielectric Surfaces in Post-Copper CMP Cleaning
Authors: Daviot Jerome , Vaes Jan
Published: March 2009

At critical dimensions of 65nm and lower, the tolerances for yield impacting “killer” particle defects become ever tighter and this is especially true for Cu PCMP cleaning. This is a critical step in reducing wafer defectivity and metal contamination directly impacting yield and reliability. A successful candidate must exhibit a number of additional attributes not least of which are compatibility to Cu while selectively removing copper oxides (CuOx), and be fully compatible with porous ULK and barrier materials. Conventionally PCMP cleans typically require two different acidic or alkaline solutions containing a surfactant to drive particle removal and surface metal preparation; however this is not without its limitations e.g. crack propagation, water absorption, low-k wetting, water marks and galvanic corrosion. It would be advantageous if Cu PCMP could be performed with a single neutral pH cleaning solution. The paper will present results of work conducted on a neutral, single step Cu Post CMP (PCMP) cleaning solution, EKC PCMP5510™, and will discuss the influences of different process parameters in optimising defect removal from Cu and Ultra Low-K (ULK) dielectric surfaces (K=2.5) thus highlighting the fundamental differences in cleaning either surface.
Cleaning Technique Using High-Speed Steam-Water Mixed Spray
Authors: Watanabe Masao , Sanada Toshiyuki , Hayashida Atsushi , Isago Yoichi
Published: March 2009

A novel cleaning technique using steam-water mixed spray is proposed. Relatively low-pressure super-purified steam (0.1 MPa - 0.2 MPa) is mixed with super-purified water in a nozzle, and then sprayed on a silicon wafer surface, which is located at approximately 10 mm from the nozzle. The most striking result of this proposed technique is that we are able to clean a wafer surface, i.e., to eliminate fine particles, without using any chemicals.
Pattern Collapse and Particle Removal Forces of Interest to Semiconductor Fabrication Process
Authors: Kim Tae Gon , Wostyn Kurt , Park Jin Goo , Mertens Paul W. , Busnaina Ahmed A.
Published: March 2009

The removal of particles from silicon wafers without pattern damage during fabrication process is extremely important for increasing the yield. Various physically assisted cleaning techniques such as megasonic cleaning, jet spray cleaning, and laser shock wave cleaning (LSC) have been introduced. However, most of tools show pattern damage [1]. One of the main challenges in next generation cleaning process is the particle removal without the pattern damage. As the feature size continues to decrease, the patterns are so fragile that it is hard to remove particles less than 50 nm without pattern damages. To accomplish the effective cleaning performance without the damage, the collapse force of pattern and removal force of particle should be known quantitatively. In this paper, pattern collapse forces were measured for different gate stack patterns by lateral force microscope (LFM) [2]. The particle removal mechanism of LSC was studied to find the relationship between measured collapse forces and particle removal force by LSC which has a known applied force. Finally, particle contaminated pattern wafers were cleaned by LSC with optimized process parameters to verify the relationship and to achieve the best particle removal performance without the pattern damage.
Particle Retention Mechanism of Filter in High Temperature Chemical
Authors: Nagafuchi Takuya , Chiba Koji , Funahashi Isamu , Inukai Minako , Yamada Hiroaki , Umezawa Kaori , Tomita Hiroshi
Published: March 2009

Recently, the control of particles measured in the tens of nanometers has become indispensable for manufacturing semiconductor devices. In sulfuric acid - hydrogen peroxide mixture (SPM) processes, it is increasingly important to reduce particles on the wafer. A batch type re-circulation bath has been generally used with a fluoroplastic filter built into the equipment. The pore size of the filter used has gradually become smaller. The particle levels on the wafer have decreased after the filter was changed from a 100nm rating to a 30nm rating.
Improving Process Control for Copper Electroplating through Filter Membrane Optimization
Authors: Wu Ai Wen , Cornner Gregg , Prabhaker Vinay
Published: March 2009

To achieve uniform copper plating on the surface of the wafer consistently in a production lot, a particle-free plating solution must be presented to the wafer under uniform pressure, uniform flow and at the proper formulation. This is accomplished by recirculating large volumes of the plating solution past the surface of the wafer. It is important that the chemistry of the solution remains uniform during the copper plating process to ensure repeatable performance. To maintain a low particle level, the fluid is filtered in a recirculated mode at a high flow rate. The filter must have low pressure drop, good particle retention and high throughput to result in low wafer defects and high system uptime. In addition, the proper filter must be selected so that it doesn’t absorb or remove desirable components like additives as it removes contamination from the solution.
Case Study of Microelectrostatic Motor
Authors: Bagdonas Vytautas , Ostasevicius Vytautas
Published: March 2009

This article describes a sub-millimeter micromotor, one of achievements of MEMS (microelectromechanical systems) science that is driven by electrostatic force. A simplified analytical dynamical model for microelectrostatic motor is presented. The model involves formulas for calculation of non-fringing electrostatic field forces for any rotor and stator pole combination, for any number of poles. Both tangent and normal forces are derived. The article shows how to increase torque created by tangential force and how to decrease friction created by normal component. The model is useful for development of motor control system and further motor analysis. The analytical model is quantitatively compared to finite element model (FEM) created using Ansys and Matlab software. By changing the number of poles in both models, the ripple of the motor torque is researched using both methods.
Introductory Analysis of the Bearingless Induction Motor
Authors: Gosiewski Zdzisław , Falkowski Krzysztof , Zokowski Marius
Published: March 2009

The design and introductory calculations of a bearingless induction motor is presented in the paper.
Advantages of bearingless motors are: the lack of a mechanical contact between the journal and the
bush, small additional losses, no need of lubricants, no tear and wear, the shaft is shorter, they have
low cost of production due to smaller number of wires on the stator, etc
Modelling of Magnetic Fields with the Finite Element Method in Machine Diagnostic Systems
Authors: Łagodziński Jakub
Published: March 2009

Two issues are discussed in the paper. The first one concerns the FEM modelling of the magnetic field enclosing the permanent magnet – reed switch system. The system works as the motion detection device of the hydraulic servoactuator distributor to improve the helicopter steering reliability and flight safety. The second one describes optimization of the active magnetic bearing (AMB) design with the FEM. The optimization has two goals: weight reduction and bearing load capacity. The bearing is applied to active vibration control of helicopter flexible tail rotor shaft.
Three Phase AC-Line Converter for the Flywheel Energy Storage System
Authors: Penczek Adam , Mondzik Andrzej , Siostrzonek Tomasz
Published: March 2009

he paper presents a three-phase rectifier with sinusoidal source current which enables energy to be fed back to the AC supply network. It has been used in a flywheel energy storage system. The principle of operation and control methods of the three-phase rectifier are discussed. The experimental setup employing a DSP controller co-operating with CPLD device is described. Results of experimental investigation for both the steady and transient states are presented in the concluding section.
Tubular Linear Actuator as a Part of Mechatronic System
Authors: Tomczuk Bronisław , Waindok Andrzej
Published: March 2009

Electromagnetic tubular linear actuators are very important in mechatronic systems. The new construction of the linear actuator is presented in the paper. Many calculations with magnetic field analysis have been carried out for the new construction of the object. It was a five-phase permanent magnet tubular linear actuator. The static and dynamic parameters of the actuator have been calculated and measured, as well. A good correlation between the results validates the mathematical modeling of the actuator.
Comparison the Accuracy of the Extrapolation Methods of the Time Phase Coincidence in Synchronization of Power Generating Units
Authors: Niklas Piotr , Grono Andrzej , Dąbkowski Mariusz , Redlarski Grzegorz , Śliwiński Marcin
Published: March 2009

The main goal of this article is to compare the accuracy of the extrapolations time phase coincidence for the selected methods. In the comparing analysis selected the method using calculable function, polynomial function and linear function. The general idea of synchronization proceed in electrical power system is presented. The most important work conditions during realization of this proceed are mentioned. The most important is the realization of phase condition. Incorrect realization of the phase condition may causes numerous consequences, from power impact and current compensatory impact till loose of synchronous work. For this reason known methods of extrapolation of the time phase coincidence are recalled and their pros and cons are described. Next a new non-linear method of extrapolation of the time phase coinci¬dence realized by calculable function is presented. Then the comparison analysis of the selected methods is made. As the comparative criterion the time phase error is taken. The methods were tested for different parameters concerning frequency difference of voltages synchronizing power objects. One of the testing data set obtained from the mathematical model of the control speed angle unit for water plant with long pipes and large difference water levels. This gives the rigorous testing conditions because of the dynamic changing frequency difference. The values of the numerous tests done on the testing device showed that the new method results in better performance parameters. The paper includes the most important results of the comparative tests. Conclusions and final summary are made.
Control Efficiency Analysis of Linear Oscillating Mechatronic Device
Authors: Senulis Audrius , Guseinovienė Eleonora , Cirtautas Viktoras , Jankūnas Valdas , Urmonienė Lionė
Published: March 2009

This paper deals with the control efficiency analysis of the linear oscillating mechatronic device (linear oscillating synchronous motor–compressor). These mechatronic devices can be controlled by using thyristor control [1, 4], square-wave voltage [2, 3], ect. There is analyzed the case, when square-wave voltage pulses’ frequency is changed and so the piston stroke duration time is reduced. The control of piston stroke changes the energetic parameters of the mechatronic device. This type of controlling has one disadvantage – it needs a DC voltage source. The pulsating voltage control is based on thyristor control system and does not have the previously mentioned disadvantage, because uses the AC voltage source, but both control ways have influence to the energetic parameters due to higher harmonics. The analysis of the chosen mechatronic device (open-loop tests) is based on comparing the modeling and experimental results with respect to power losses, simplicity of the control, power factor and disturbances to the supply system.
These results are important for the optimal design of the drive with oscillating synchronous pulsating current motors and the selection of control type for the different type of load.
Controller Design for a Rubbing Rotor
Authors: Ginzinger Lucas , Zander Roland , Ulbrich Heinz
Published: March 2009

A new approach to control a rubbing rotor by applying an active auxiliary bearing is developed. The auxiliary bearing is attached to the foundation via two unidirectional actuators. The control force is applied indirectly using the active auxiliary bearing only in case of rubbing. A framework for the development of a feedback controller for an active auxiliary bearing is presented. The theory of a robust two-phase control strategy which guarantees a smooth transition from free rotor motion to the state of full annular rub is presented. A simulation environment for the elastic rotor and the auxiliary bearing including the non-smooth nonlinear dynamics of the rubbing contact is used to develop the feedback controller. Experimental studies have been carried out at a rotor test rig. Various experiments show the outstanding success of the strategy. In case of rubbing, the contact forces are reduced up to 90%.
Model-Based Control of SMA Actuators with a Recurrent Neural Network in the Shape Control of an Airfoil
Authors: Ahola Jari , Makkonen Tomi , Nevala Kalervo , Lindroos Tomi , Isto Pekka
Published: March 2009

This paper describes the development of a neural network control for shape memory alloy (SMA) actuators as well as the control tests. Precise control of SMA actuators that are integrated in the composite structure is difficult because of the hysteretic behaviour of SMA and time delays in the control system. The weakness of the static model of SMA is that it does not take into account the actuator dynamics.
The NARMA-L2 neural network model enables us to solve the inverse dynamic model of the nonlinear discrete-time dynamical system. In this study the NARMA-L2 model of the airfoil (a cross section of wind turbine blade) was created using Matlab Simulink software and neural networks. Data for network training was measured from the specimen.
The performance of the constituted NARMA-L2 controller was tested in control tests. According to the control tests the NARMA-L2 controller is well suited for controlling embedded SMA actuators. The constituted controller enabled fast and stable actuation in step responses and it was also able to compensate for changes in cooling conditions.
Control Algorithm for Four-Wheeled Robot Motionfor Monit oring Problems
Authors: Mukhina Maryna P.
Published: March 2009

Monitoring and surveillance by means of mobile robots are of great importance in a number of
various applications. The level of technology and science development is high enough to use
robotic vehicle for monitoring in dangerous or hard-to-reach areas, for continuous surveillance of
large industrial objects, in military purposes.
The main problems in this area are navigation and control of vehicle. The majority of articles are
dedicated to problems of motion control of wheeled mobile robots with two or three wheels [1-2].
As to four-wheeled mobile robots its kinematics and dynamics are considered in [3].
Finite Element Modeling and Simulation of Squeezed-Film Effects in a Vibrating MEMS Structure
Authors: Dauksevicius Rolanas , Ostasevicius Vytautas , Gaidys Rimvydas
Published: March 2009

This paper presents results of numerical analysis of dynamics of a microstructure under the influence of air damping, which is modeled by linearized compressible Reynolds equation. Developed finite element model accounts for air rarefaction and is valid in a wide pressure range. Simulation results indicate that the influence of air damping may result not only in a pronounced dissipative effect but also in natural frequency shift due to system stiffening caused by air compression. This phenomenon is observed under combination of particular values of system and excitation parameters
Identification of Discrete Mass-Stiffness Models for Dynamic Analysis of Rotors
Authors: Muszyńska Agnieszka , Jones David I.G.
Published: March 2009

Application of the transformation of experimentally-obtained compliance into dynamic stiffness for the identification of discrete rotor model parameters is described. Simple examples are examined to illustrate the fact that a fully satisfactory discrete model can or cannot be achieved.
Low-Cycle Fatigue Simulation and Life-Time Prediction of High Stressed Structures
Authors: Temis J.M. , Azmetov Kh.Kh. , Zuzina V.M.
Published: March 2009

The problem of mathematical simulation of the origin and evolution of low-cycle fatigue cracks is
quite actually for many high-loaded machines and units of power industry, aerospace engines, oil
and gas pipelines and other structures operating under repeated loading. Successful prediction of
low-cycle resource depends on solution of several interrelated problems: creation and development
of structure model (loads, boundary conditions, materials model) that will adequately describe all
aspects stress-strain history in the structures paths; creation plasticity and creep models adequate to
the processes taking place during sing-alternating elastic-plastic deformation; the creation of
lifetime fatigue failure rate criteria; and development of effective numerical simulation technique.
Simulation of the Dynamic Behaviors of the C Axis Drive by the Turning Center
Authors: Křepela J. , Singule Vladislav
Published: March 2009

The paper describes the mathematical model for C axis of the multifunction turning center with worm gear. Talks about the mathematical model with multi-body mass dynamic system. The drive works in the positional feedback and his mathematical model is specified for detection of the dynamical behaviors of the C axis. The turning center is designed for a heavy roughing forged piece from high carbon steels by the power of main motor 71kW. The C axis must be designed as accurate angle position axis and with big dynamic stability of regulation by step or pulse loading. The C axis drive is constructed with help of a hydraulic connected up the worm gearing on a spindle. The driven side of the worm gear is created two dual worms with own servomotors. Worm wheel is solved as one part with two gears. Servomotors are controlled with the mode speed/torque coupling (MASTER-SLAVE), which guarantees the constant torque prestressing between the servomotors. The difference of a torques guarantees leaning of both worm teeth on opposite tooth faces of both gears of the worm wheel. In the dynamic model are involved the friction on the worm gears, torsion stiffness located with help of the FEM and moment of inertia for all parts. 3D models of the C axis is designed in the program ProEngineer. From complete 3D model of the C axis are transfered individual parts to the FEM in surroundings Ansys as volume parts. In this paper is main output influence of the diference between the 3D and 2D for calculation of the stiffness in the contact of the worm gear on the whole dynamic system of the C axis. The value of the torsion stiffness by more situation of the load on the worm gear is used subsequently to the multi-body mass system of the C axis drive and to the eigen frequencies analyses. Results of this paper will be sensitivity check of the changing torsion stiffness on the worm gear by the loading changing on the resulted position accuracy on the C axis. Next review is, if the control modul MASTER-SLAVE is partially this problem of the difference between values of stiffness from 2D or 3D model or also stiffness non-linearity eliminated.
Some Problems of a Diagnosis of Turbine Engine Bearings Using FAM-C Method
Authors: Gębura Andrzej , Tokarski Tomasz
Published: March 2009

Diagnostic FDM-A method [2] based on a measurement of frequency modulation of a pulsation component as well as FAM-C method based on a measurement of a alternating current’s frequency have been developed in Air Force Institute of Technology. These methods provide to define a level of a sub-assembly’s abrasive wear and its localization during normal work of a power unit. It is possible to define numerous parameters of bearings and their kinematics pairs as well as a rotor assembly. They are: a level of a bearing rolling friction, smoothness of a bearing cage’s motion, a quantity of a radial clearance. It also provides to detect resonances in elements as well as observe a shape and a relative height of characteristic patterns, from which it is possible to calculate, among others, a quantity of a mechanical quality factor of a kinematics pair – it is possible to define an operating time reserve of the kinematics pair to resonance.
Study of Free Vibration of Ladder Frames Reinforced with Plate
Authors: Aryassov Gennadi , Petritshenko Andres
Published: March 2009

The aim of this paper is to develop a simplified method for analysis of free vibration of floor system consisting of continuous steel plate and steel frame in plane to reinforce it. The study of such orthotropic system is of practical interest and aimed at small businesses, which are not able to obtain expensive programs for performing such calculations.
AMB Construction Optimization Tool
Authors: Piłat Adam
Published: March 2009

The aim of this paper is to present a new interdisciplinary methodology and software tools realized and configured for the analysis and optimization of the heteropolar radial Active Magnetic Bearing (AMB) construction. Due to several possible AMB configurations for the particular application, the designer needs to be supported by modelling and simulation tools at the decision stage. The designed software model of AMB accelerates the prototype design and minimizes its initial costs. In this paper the proposed solution and software environment are discussed together with its advantages and disadvantages. The analytical calculations of the AMB stator geometry are used as a starting point for the optimization procedure. The geometry constraints along with the AMB operational parameters are formulated. The AMB stator is characterized by many dimensions defining the magnetic field path, which are the pole width, the pole height, the stator radiuses: the external, internal and the rotor side. The coils are represented by closed shapes located at the pole sides. In the coil area a current density is defined and used in the optimization process. The AMB performance and parameters strongly depend on the air gap size which could be selected manually or fitted automatically due to the rotor size and weight. The electromagnetic force generated by the proposed stator geometry depends on the rotor-bearing air gap. For the proposed parametric description of the AMB geometry the choice of optimization strategy is studied to satisfy the selected quality criterion. To simplify calculations a quarter of the AMB construction is under consideration. The designed construction variants and examples of optimization are presented.
An FPGA Implementation of the Robust Controller for the Active Magnetic Bearing System
Authors: Kulesza Zbigniew , Gosiewski Zdzisław
Published: March 2009

The article presents the project design flow that leads to the implementation of the robust controller law in the FPGA chip. The designed robust FPGA controller is going to be used in the heteropolar active magnetic bearing system. The hardware and software architectures of the designed controller are presented. The hardware consists of the market available Spartan-3 Development Board and two specially designed A/D and D/A converters boards. The software architecture is made of several VHDL entities that are translated into the target FPGA chip. The results of the experimental preliminary tests show that the dynamic properties of the designed controller are very good and the authors hope that the dynamic performance, especially the stability of the whole active magnetic bearing system, will improve.
Selection of a Constitutive Model Used for Prediction of Behaviour of Ring Material Expanded by Pulse Electromagnetic Field
Authors: Panowicz Robert , Janiszewski Jacek
Published: March 2009

Selection of a constitutive model from commonly used ones, which in the best way describes dynamic behaviour of material during electromagnetic expanding ring test, is our primary goal in this work. Five more popular constitutive models are examined, i.e., Johnson-Cook, Steinberg-Guinan, Zerilli-Armstrong, MTS, and Preston-Tonks-Wallace model. As a criterion of the selection, qualitative/quantitative agreement of the numerical results with analogous data obtained from experiment presented in the work was taken [1]. It was found that the numerical results obtained by using Steinberg-Guinan or Preston-Tonks-Wallace model gave the best agreement with experimental data.
Synthesis of Vibrator with Air or Water Flow Excitation
Authors: Viba Janis , Shtals Lauris , Vilkajs Atis , Kovals Edgars
Published: March 2009

In the daily life and in using technologies people interact with continuous medium like air or water. In present article a motion of the vibrator with constant air or water flow excitation is observed. In the first part of the article a motion of the vibrator with constant air or water flow velocity excitation is investigated. The main idea is to find optimal control law for variation of additional area of vibrating object within certain limits. The criterion of optimization is the time required to move object from initial position to end position. For the solution of high-speed problem the maximum principle is used. It is shown that optimal control action is on boundaries of area limits. Examples of synthesis of real mechatronic systems are given.
The “Screwdriver” Technology of the Model Building for Simulating of the Processes in the Mechatronic Objects
Authors: Uzunov Oleksandr V.
Published: March 2009

Considered here are the questions of the simplification of the building process of the computer models. Suggested here is the “screwdriver” technology of the model building. The technology is based on the application of the set of the symbols of the typical elements and their models. The models of the object are built by the assembling of the element models in correspondence with the object structure. The application of the technology is illustrated on the example.
Design of In-Pipe Modular Robotic Systems
Authors: Tătar Mihai Olimpiu , Mândru Dan
Published: March 2009

In this paper, we proposed two wheeled-type in-pipe modular robotic systems. These modular systems are composed of driving modules (which use mechanisms with articulated elements) and passive modules. The first module (driving module) generates the traction force. The passive module is necessary to carry the control electronic equipment and for the transport of the needed equipment for realization of the in-pipe inspection. The joint disposed (universal join) by the two modules of the robot offers the capacity of orientation of this one.