num_pages: 888
description: A new collection of authoritative contributions on the state of the art of electrochemical depositionSince the last edition of Modern Electroplating was published over a quarter century ago, electrochemical deposition has evolved into a mature science, with many new and potential applications. To address these developments, Modern Electroplating, Fourth Edition presents an entirely new collection of contributions on a wide range of cutting-edge topics, from electrodeposition of semiconductors to environmental considerations.Geared to experienced deposition practitioners and novices alike, the new edition provides clear, thorough, up-to-date explanations of the principles and applications of highly relevant deposition techniques. It not only replaces the Third Edition, a very useful resource on electroplating processes, but, in addition, highlights the transition in the electronics industry from physical to electrochemical methods, especially with regard to next-generation technologies such as copper interconnect. Coverage includes: * Electrodeposition of various metals and metal alloys* Electrodeposition of semiconductors and electrodeposition on nonconductors* Electrodeposition of conductive polymers* Electroless deposition of various metals and alloys* Preparation procedures for deposition* Manufacturing technologies, monitoring, testing, and control* Deposition and the environment
language: English
title: Modern Electroplating
titlecomplete: Modern Electroplating (The ECS Series of Texts and Monographs)
ratings_count: 6
publisher: Wiley-Interscience