num_pages: 221
description: Practitioner Gaynor focuses on the practical as he describes this design method for complex wireless devices, combining solid information on RF components with state-of-the art packaging strategies. He covers the basic background and history of system-in-package (SiP) RF design, the addresses SiP substrate options, assembly processes, advanced packing techniques, system architecture issues and concerns, RF design and simulation, and advanced RF design techniques. He closes with a case study and thoughts on the field's future, which includes printable transistors and passives, new die interconnects, die-within-laminates, and high-power device packaging. Annotation ©2007 Book News, Inc., Portland, OR (booknews.com)
language: English
title: System-in-Package RF Design and Applications
titlecomplete: System-in-Package RF Design and Applications
publisher: Artech House