description: Packaging has often been a secondary consideration to silicon device fabrication and has received less attention than its contribution to overall device performance, reliability, and cost should warrant. The situation is changing as packaging limitations begin to impose restrictions on device and system designs. Included here are the basics of polymer science and engineering for microelectronics packaging, mathematical treatments and simulations of processes, materials guides, methods of product reliability and quality assurance, and descriptions of equipment, tooling, and facilities options. Annotation copyright Book News, Inc. Portland, Or.
language: English
title: Plastic Packaging of Microelectronic Devices
titlecomplete: Plastic Packaging of Microelectronic Devices
publisher: Van Nostrand Reinhold