num_pages: 204
description: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal &amp; mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development.Main areas covered 
language: English
title: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
titlecomplete: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
publisher: Springer