num_pages: 301
description: Failure analysis and reliability improvement are linked for improvement of microcircuits packaging by these technical papers. Design factors such as oxide reliability, electromigration and die metallization are considered in testing, and analytic approaches to improved reliability.
language: English
title: Proceedings of the 1997 6th International Symposium on the Physical & Failure Analysis of Integrated Circuits: 21-25 July, 1997, Raffles City Convention Centre, Singapore
titlecomplete: Proceedings of the 1997 6th International Symposium on the Physical & Failure Analysis of Integrated Circuits: 21-25 July, 1997, Raffles City Convention Centre, Singapore
publisher: IEEE