description: Proceedings of the November 1997 symposium. Twelve papers relate to the use of computer simulations to solve complex packaging problems related to thermo/mechanical problems. Topics include improving electronic packaging manufacturing through product and process-driven analysis; thermo-mechanical an
language: English
title: CAE - CAD & Thermal Management Issues in Electronic Systems: Proceedings, Asme International Mechanical Engineering Congress & Exposition, Dallas, Tx. 1997
titlecomplete: CAE - CAD & Thermal Management Issues in Electronic Systems: Proceedings, Asme International Mechanical Engineering Congress & Exposition, Dallas, Tx. 1997 (Eep Htd Series Volumes 23 and 356)
publisher: Amer Society of Mechanical