num_pages: 590
description: Provides an up-to-date assessment of chemically amplified resist materials chemistry and process considerations. Reports novel chemistry for single layer 193nm lithographic applications. Discusses new approaches to silicon-containing resists and multilevel processes. Explores the design oflow-dielectric polymer materials for microelectronic applications.
language: English
title: Microelectronics Technology: Polymers for Advanced Imaging and Packaging
titlecomplete: Microelectronics Technology: Polymers for Advanced Imaging and Packaging (ACS Symposium Series, No. 614)
publisher: American Chemical Society