num_pages: 260
description: Answers questions frequently asked by thermal and packaging engineers. Providing problem-solving analyses, this title covers theoretical, numerical, and experimental analyses, includes descriptions of 12 air cooling enhancement techniques, and discusses the limiting roles of heat transfer, fluid flow, and thermal coupling in electronic enclosures.
language: English
title: Air Cooling Technology for Electronic Equipment
titlecomplete: Air Cooling Technology for Electronic Equipment
publisher: CRC Press