num_pages: 209
description: Aimed at integrated circuit designers, solid state component designers and packaging and manufacturing engineers, these proceedings cover such subjects failure analysis technologies; process and device; packaging and metallization; dielectrics; and reliability of specialist devices.
language: English
title: Proceedings of the 1999 7th International Symposium on the Physical & Failure Analysis of Integrated Circuits
titlecomplete: Proceedings of the 1999 7th International Symposium on the Physical & Failure Analysis of Integrated Circuits
publisher: IEEE