num_pages: 372
description: In these proceedings from the workshop held in September 2005, contributors describe their work on stress-induced phenomena in on-chip metal interconnects and solder joints. General topics include the physical properties and reliability of metal interconnects and barriers, mechanical properties and reliability of low-k and ultra low-k materials, th
language: English
title: Stress-Induced Phenomena in Metallization: Eighth International Workshop on Stress-Induced Phenomena in Metallization
titlecomplete: Stress-Induced Phenomena in Metallization: Eighth International Workshop on Stress-Induced Phenomena in Metallization (AIP Conference Proceedings / Materials Physics and Applicati)
publisher: American Institute of Physics