num_pages: 386
description: The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
language: English
title: Solder Joint Technology: Materials, Properties, and Reliability
titlecomplete: Solder Joint Technology: Materials, Properties, and Reliability (Springer Series in Materials Science, 92)
publisher: Springer