Patent claim: An electrical signal computing module capable of accommodating printed circuit board comprising a main case body 1 including a bottom case 11 having an external right side board 111 and an external left side board 112 wherein the external right side board 111 has a first external flow hole 1111 and a second external flow hole 1112 an internal board set 12 being disposed within the bottom case 11 and further including a front right side board 121 fixing to the external right side board 111 and having a front side flow hole 1211 wherein air flows in sequence through the second external flow hole 1112 and the front side flow hole 1211 into the main case body 1 a front middle board 122 having a front middle flow hole 1221 a rear right side board 123 fixing to the external right side board 111 and having a plurality of rear right side flow holes 1231 wherein the rear right side flow holes 1231 are formed by the first external flow hole 1111 a rear middle board 124 and a rear left side board 125 fixing to the external left side board 112 a transmission circuit board 13 being disposed within the bottom case 11 and having a plurality of transmission flow holes 131 wherein a first accommodating area 21 is formed by the transmission circuit board 13 the front right side board 121 and the front middle board 122 a second accommodating area 22 is formed by the transmission circuit board 13 the front middle board 122 and the external left side board 112 a third accommodating area 23 is formed by the transmission circuit board 13 therear right side board 123 and the rear middle board 124 a forth accommodating area 24 is formed by the transmission circuit board 13 the rear middle board 124 and the rear left side board 125 wherein the air flows in sequence through the first external flow hole 1111 and the rear right side flow holes 1231 into the third accommodating area 23 wherein the air flows from the third accommodating area 23 through the transmission flow holes 131 into the first accommodating area 21 wherein the air flows from the second accommodating area 22 through the front middle flow hole 1221 into the first accommodating area 21 a first main circuit board module 14 being disposed in the first accommodating area 21 connecting to the transmission circuit board 13 and further having a plurality of lower blowers 141 a first side heat leading tunnel 142 a second side heat leading tunnel 143 a first main processor 144 a second main processor 145 a side heat flow hole 146 and a plurality of memory devices 147 wherein the lower blowers 141 are disposed in front of the first main circuit board module 14 and draw the air out of the first accommodating area 21 the first side heat leading tunnel 142 is disposed on right side of the first main circuit board module 14 and close to the side heat flow hole 146 the second side heat leading tunnel 143 is disposed on left side of the first main circuit board module 14 the first main processor 144 is disposed on the first main circuit board module 14 and close to the transmission circuit board 13 the second main processor 145 is disposed on the first main circuit board module 14 and close to the first side heat leading tunnel 142 the side heat flow hole 146 is disposed on right side of the first main circuit board module 14 the memory devices 147 flank the second main processor 145 wherein the lower blowers 141 draw the air out of the first accommodating area 21 so the air from external of the bottom case 11 flows in sequence through the front side flow hole 1211 and the side heat flow hole 146 into the firstaccommodating area 21 and the second main processor 145 and a second main circuit board module 15 being disposed in the first accommodating area 21 and being above the first main circuit board module 14 also connecting to the transmission circuit board 13 wherein the second main circuit board module 15 has a plurality of upper blowers 151 the upper blowers 151 are disposed in front of the second main circuit board module 15 and draw the air out of the first accommodating area 21 wherein the lower blowers 141 and the upper blowers 151 draw the air out of the first accommodating area 21 so the air in the third accommodating area 23 flows into the first accommodating area 21 and the air in the forth accommodating area 24 flows into the second accommodating area 22 wherein the air on the first main circuit board module 14 flows through the first main processor 144 the memory devices 147 and the second main processor 145 the lower blowers 141 then draw the air out of the first accommodating area 21 wherein the air in the second accommodating area 22 flows through the front middle flow hole 1221 into the second main circuit board module 15 the upper blowers 151 then draw the air out of the first accommodating area 21.

Related passage: Next FIG.10 shows a schematic horizontal planar configuration corresponding to the section of one CTL module 10 seen from above ofthe basic chassis 100.Further the arrow marks show representative flow and a flow amount of the cooling air to be described later.The front part 1 has the HDD modules 30 and the rear part 2 has the CTL module 1 10 and the two left and right power source modules 40.Two fans 43 as a fan unit 42 are provided in a row in a backandforth direction on the rear side of the power source module 40.Ventilation holes 96 are provided at the illustrated positions in each partition plate 95 between the CTL module 10 and the power source module 40.An area 114 in which a block 150 is disposed above such components as ICs on the substrate is provided in the CTL module 10.