baber/WOPTO huggingface dataset:
Patent TW-201524813-A (TW)
Title: Vehicle assistance system and vehicle assistance method
Inventor: LEE HOU-HSIEN
IPC: B60W30/16
Filed: 2013-12-27
Abstract: A vehicle assistance method includes obtaining a number of continuous images which are captured by a camera during a period between detecting an operation on an input unit and detecting an operation on a wheel in response to user operation on the input unit; creating 3D models corresponding to the obtained images; determining a turning direction of the vehicle according to the user operation on the input unit and determining whether or not one or more movable objects are after the turning direction of the vehicle; determining the movement speeds of the movable objects when one or more movable objects are after the turning direction of the vehicle; determining a largest turning angle of the vehicle according to the movement speeds of the movable objects; and controlling a driving unit to drive a limiting unit to limit the turning angle of the vehicle to be less than the determined largest turning angle of the vehicle.
Patent TW-201525989-A (TW)
Title: Automatic speech input system and method thereof
Inventor: KUO YAN-MIN
IPC: G10L17/22
Filed: 2013-12-27
Abstract: An automatic speech input system and method thereof are disclosed. The automatic speech input system includes a receiver element and a speech recognition device. The receiver element gets the speech. The speech recognition device includes a recorder element and a speech detection element. The recorder element stores the digital signal data based on the speech. The speech detection element detects the amplitude and the spectrum of the speech every unit time based on the digital signal data to determine at least one interrupt position of the speech and the punctuation mark in the interrupt position.
Patent TW-201501952-A (TW)
Title: Microcontact printing with high relief stamps in a roll-to-roll process
Inventor: PEKUROVSKY MIKHAIL LEONIDOVICH
IPC: B41F17/00
Filed: 2013-12-30
Abstract: A method includes unwinding a web material from a support and providing an elastomeric stamp, wherein the stamp includes a base surface and an arrangement of pattern elements extending away from the base surface, and wherein each pattern element has a stamping surface with a lateral dimension of less than about 5 microns and a height with respect to the base surface, and wherein an aspect ratio of the height to the lateral dimension is at least 1.5. The stamping surfaces of the pattern elements are inked with an ink composition including a functionalizing molecule, wherein the functionalizing molecule includes a functional group selected to bind to said substrate material. The stamping surface of the pattern elements is contacted with a major surface of the web material for a print time sufficient to bind the functional group with the web material to form a self-assembled monolayer (SAM) of the functionalizing material on the major surface of the web material according to the arrangement of pattern elements on the stamping surface.
Patent TW-201418130-A (TW)
Title: Methods for using non-contact dancer mechanisms and web isolation apparatuses
Inventor: CHANG CHESTER HANN HUEI
IPC: C03B35/24
Filed: 2010-12-07
Abstract: A non-contact dancer mechanism for conveying a web of brittle material includes a guide rail and a variable position web support plenum adjustably positioned on the guide rail. The variable position web support plenum may include an arcuate outer surface with a plurality of fluid vents for emitting a fluid to support the web of brittle material over and spaced apart from the arcuate outer surface thereby preventing mechanical contact and damage to the web of brittle material. A support plenum counterbalance may be mechanically coupled to the variable position web support plenum, wherein the support plenum counterbalance supports at least a portion of the weight of the variable position web support plenum on the guide rail. Apparatuses incorporating the non-contact dancer mechanism and methods for using the non-contact dancer mechanism for handling continuous webs of brittle material are also disclosed.
Patent TW-201527684-A (TW)
Title: Panel lamp
Inventor: YU CHIN-CHU
IPC: F21Y101/02
Filed: 2014-01-03
Abstract: A panel lamp includes a lamp housing, a plurality of first punched holes, a plurality of second punched holes, a plurality of first protruding bent portions, a plurality of second protruding bent portions, a light source module, and a lampshade. The lamp housing includes a first side plate and a second side plate opposite to the first side plate. The first and second side plates respectively include a first folded portion and a second folded portion. Each first protruding bent portion is adjacent to each first punched holes, and the first protruding bent portions and first folded portion form a first fixing mechanism. Each second protruding bent portion is adjacent to each second punched holes, and the second protruding bent portions and second folded portion form a second fixing mechanism. The light source module is disposed in the lamp housing. The lampshade includes a first edge and a second edge opposite to the first edge. The first and second edges are respectively held by the first and second fixing mechanisms and are fixed to the lamp housing.
Patent TW-201436293-A (TW)
Title: Method of packaging a light-emitting diode and light-emitting diode packaging structure
Inventor: LIN CHIH-CHIA
IPC: H01L33/48
Filed: 2014-01-17
Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). A carrier having a first side and a second opposite the first side is provided. The carrier includes a plurality of conductive interconnect elements. An integrated circuit (IC) die is bonded to the first side of the carrier. A packaging material having light-reflective properties is molded over the first and second sides of the carrier such that the IC die is sealed by the packaging material. A portion of the packaging material is molded into a reflective cap structure. A light-emitting diode (LED) is bonded to the second side of the carrier. Sidewalls of the reflective cap structure circumferentially surround the LED. The LED and the IC die are electrically coupled together through the conductive interconnect elements in the carrier. A lens is then formed over the LED.
Patent TW-201442111-A (TW)
Title: Silicon dry etching method
Inventor: KIKUCHI AKIOU
IPC: H01L21/3065
Filed: 2014-01-29
Abstract: This dry etching method, whereby a silicon layer to be processed is etched in a processing chamber, supplies an etching gas including iodine heptafluoride from a supply source at a supply pressure within a pressure range of 66kPa - 0.5MPa, introduces the etching gas which is retained in said pressure range into a processing chamber wherein the pressure has been reduced below the supply pressure, and etches the silicon layer. With this dry etching method, the etching gas is adiabatically expanded and the silicon etched under mild pressure conditions, thereby eliminating concerns about device load or device cost increases, and in-plane distribution uniformity of etching quantity is satisfactory.
Patent TW-201437402-A (TW)
Title: Deposition apparatus with gas supply and method for depositing material
Inventor: ZILBAUER THOMAS WERNER
IPC: C23C14/34
Filed: 2014-02-17
Abstract: An apparatus for depositing a material on a substrate (310) is described. The apparatus includes a vacuum chamber (300); a substrate receiving portion (305) in the vacuum chamber for receiving the substrate during deposition of the material; a target support (320) configured to hold a target (330) during deposition of the material on the substrate (305); a plasma generating device in the vacuum chamber (300) for generating a plasma between the substrate receiving portion (305) and the target support (320); and a first gas inlet (360) for providing a supersonic stream of a gas (365), wherein the gas inlet is directed towards the substrate receiving portion (305). Further, a method for depositing a material on a substrate (310) in a vacuum chamber (300) is described. The method includes forming a plasma between the substrate (310) and a target (330); releasing particles (335) from the target (330) using the plasma; and directing a supersonic stream of gas (365) towards the substrate surface, on which the material is to be deposited.
Patent TW-201444568-A (TW)
Title: Oxidized protein hydrolase activity enhancing agent
Inventor: YAGI MASAYUKI
IPC: A61K36/49
Filed: 2014-02-18
Abstract: To provide a novel activity enhancing agent for oxidized protein hydrolase. This oxidized protein hydrolase activity enhancing agent is characterized by containing the extract of at least one type of plant selected from a group comprising water chestnut, stevia, rosemary, thyme, chrysanthemum, savory, wormwood, chestnut, spearmint, marjoram, peppermint, lemon balm, allspice, perilla, basil, and caraway.
Patent TW-201436612-A (TW)
Title: Techniques for establishing access to a local wireless network
Inventor: CANPOLAT NECATI
IPC: H04W48/02
Filed: 2014-02-26
Abstract: An apparatus includes a memory to store subscription data for access to a network, the subscription data including at least terms and conditions information for the network; circuitry linked to the memory; and a connection component for execution on the circuitry to identify an access point connected to the network and automatically forward at least a portion of the subscription data to the identified access point in an association message. Other embodiments are disclosed and claimed.
Patent TW-201537154-A (TW)
Title: Gas density meter with pointer display and digital display for signal output
Inventor: Zhou rong-bang
IPC: G01L19/00
Filed: 2014-03-20
Abstract: The present invention discloses a gas density meter with pointer display and digital display for signal output, which comprises a housing connected at least with one electrical box at the outer peripheral edge, a pressure measuring device accommodated in the housing, an indicating device, and a pressure switch device. The indicating device is electrically connected with the electrical box and the pressure switch device. Through the combination of the above devices, the pressure measuring device measures a pipeline connected therewith so as to acquire the information of gas density in the pipe, and according to the variation of the gas density, the indicating device is driven to allow a user to identify the gas density in the pipe through the presentation of a mechanical pointer, and an encoding signal is outputted by the indicating device via the electrical box. During implementation, a user can use the pressure switch device to selectively adjust the high and low pressure limits. When the pressure switch is triggered by the indicating device, the corresponding high and low pressure signals are outputted to the indicating device via the electrical box. As such, a remote control device is electrically connected to the electrical box to acquire the encoding signal containing the gas density information and the high-low pressure signals.
Patent TW-201500181-A (TW)
Title: Method for producing flexible copper-clad laminated plate
Inventor: MATSUSHITA YUJI
IPC: B29C65/02
Filed: 2014-03-27
Abstract: This invention provides a flexible copper-clad laminated plate having excellent flexibility by an easy mean of using a pair of heat press rolls. The present invention provides a method for producing the flexible copper-covering laminated plate, which comprises a step of thermal compression bonding for thermally compression-bonding a copper foil (A) and a laminate (B) of polyimide films etc., with heating press rollers; and a step of reheating. The polyimide layers of the laminate (B) are composed of multiple polyimide layers having a thermoplastic polyimide layer (ii) as an adhesive layer. The laminating temperature of the step of thermal compression bonding T1 is the glass transition temperature of the thermoplastic polyimide layer (ii) or higher, and the heating temperature of the step of reheating T2 is set to be T1 or higher, whereby the diffraction intensity (I) of the (200) surface measured by X-ray diffraction along the thickness direction for the copper foil (A) after the step of thermal compression bonding, and the diffraction intensity (I0) of the (200) surface measured by X-ray for micro copper powders satisfy the formula: I/I0 >100.
Patent TW-201514157-A (TW)
Title: Cyclopropanamine compound and use thereof
Inventor: TOMITA NAOKI
IPC: A61P25/28
Filed: 2014-04-03
Abstract: The present invention provides a compound having a lysine specific demethylase 1 inhibitory action, and useful as a medicament such as a prophylactic or therapeutic agent for schizophrenia, Alzheimer's disease, Parkinson's disease or Huntington's disease, and the like. The present invention relates to a compound represented by the formula wherein A is a hydrocarbon group optionally having substituent(s), or a heterocyclic group optionally having substituent(s); B is a benzene ring optionally having further substituent(s); R1, R2 and R3 are each independently a hydrogen atom, a hydrocarbon group optionally having substituent(s), or a heterocyclic group optionally having substituent(s); A and R1 are optionally bonded to each other to form, together with the adjacent nitrogen atom, a cyclic group optionally having substituent(s); and R2 and R3 are optionally bonded to each other to form, together with the adjacent nitrogen atom, a cyclic group optionally having substituent(s), or a salt thereof.
Patent TW-201540346-A (TW)
Title: Method of making baby weight stuffed toy
Inventor: CHEN CHIA-EN
IPC: A63H9/00
Filed: 2014-04-16
Abstract: By put the plastics pellet or metal pellet into stuffed toy, to make the baby weight stuffed toy.
Patent TW-201446090-A (TW)
Title: Apparatus and methods related to conformal coating implemented with surface mount devices
Inventor: LOBIANCO ANTHONY JAMES
IPC: H05K9/00
Filed: 2014-04-16
Abstract: Disclosed are apparatus and methods related to conformal coating of radio-frequency (RF) modules. In some embodiments, a module can include an overmold formed over an RF component mounted on a packaging substrate. The overmold can also cover a surface-mount device (SMD) such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD). The module can further include a conductive layer formed over the overmold and configured to provide RF shielding functionality for the module. The conductive layer can be electrically connected to a ground plane of the packaging substrate through the SMD. An opening can be formed in the overmold over the SMD; and the conductive layer can conform to the opening to electrically connect the conductive layer with an upper surface of the SMD and thereby facilitate the grounding connection.
Patent TW-201436453-A (TW)
Title: Bias current control method and driving circuit for operational amplifier
Inventor: HUNG WEI-HSIANG
IPC: H03F1/32
Filed: 2010-12-27
Abstract: A bias current control method for an operational amplifier is disclosed. The bias current control method includes receiving a load input signal and determining signal period length of the load input signal to generate a determination signal, wherein the load input signal is utilized for controlling the operational amplifier to charge and discharge a load, and generating a bias modulation signal to the operational amplifier according to the determination signal.
Patent TW-201546408-A (TW)
Title: Air purification device with sterilization
Inventor: DUH FENG-CHYI
IPC: F24F3/16
Filed: 2014-06-03
Abstract: This invention brings up an idea: an air purification device with function of sterilization, which constructed by an air purification unit; an ultraviolet (UV) sterilization unit; and an air circulation unit. The air purification unit is mainly installed with the plate of titanium dioxide, which is able to accelerate the photocatalyst reaction via UV light illumination. It can not only eliminate the smell in the closed space but also decompose the organic compounds in air into the carbon dioxide. With the functions of air circulation and air purification, this invention is good for promoting the air quality.
Patent TW-201546337-A (TW)
Title: Electroplating baths of silver and tin alloys
Inventor: FOYET ADOLPHE
IPC: C25D3/56
Filed: 2014-06-05
Abstract: Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.
Patent TW-201513462-A (TW)
Title: Imaging antenna and related techniques
Inventor: LARUSSI AMEDEO
IPC: H01Q21/00
Filed: 2014-06-20
Abstract: An antenna array includes a plurality of antenna elements. The antenna elements include layers of dielectric material; an antenna inlaid in a top layer of the dielectric material so a surface of the antenna is substantially parallel to an outer surface of the top layer of dielectric material; and a conductive balun, coupled to the antenna, and embedded in one or more layers of the dielectric material. The antenna array is operative to receive signals from V to W frequency band transmissions generated by a heat source.
Patent TW-201517026-A (TW)
Title: Jitter buffer control, audio decoder, method and computer program
Inventor: REUSCHL STEFAN
IPC: H04J3/06
Filed: 2014-06-20
Abstract: A jitter buffer control for controlling a provision of a decoded audio content on the basis of an input audio content is configured to select a frame-based time scaling or a sample-based time scaling in a signal-adaptive manner. An audio decoder uses such a jitter buffer control.
Patent TW-201500278-A (TW)
Title: Silicon carbide powder
Inventor: HASE KAZUHITO
IPC: C01B31/36
Filed: 2014-06-24
Abstract: The present invention relates to a silicon carbide powder, which aims to provide good results in view of reactivity of carbon and silicon, the free carbon (FC) amount and the production yield of silicon carbide powder. In a mixture composed of a silicon source, a carbon source and a catalyst, the silicon source is methyl silicate, when the mixture accounts for 100wt%, the weight percent of the carbon source is 33wt% or more and 39wt% or less, the weight percent of the silicon source is 55 wt% or more and 62 wt% or less, and the weight percent of the catalyst is 3wt% or more and 10wt% or less. Preferably, the catalyst may use maleic acid.
Patent TW-201511091-A (TW)
Title: Substrate processing apparatus
Inventor: FUKUSHIMA KOHEI
IPC: H01L21/205
Filed: 2014-06-30
Abstract: A substrate processing apparatus includes: a processing vessel configured to be vacuumed; a holding unit configured to hold a plurality of substrates and to be inserted into or separated from the processing vessel; a gas supply unit configured to supply gas into the processing vessel; a plasma generation box partitioned and formed by a plasma partition wall; an inductively coupled electrode located at an outer sidewall of the plasma generation box along its length direction; a high frequency power supply connected to the inductively coupled electrode through a feed line; and a ground electrode located outside the plasma generation box and between the processing vessel and the inductively coupled electrode and arranged in the vicinity of the outer sidewall of the plasma generation box or at least partially in contact with the outer sidewall.
Patent TW-201516206-A (TW)
Title: Wear-resistant multi-ply woven fabric
Inventor: NINOMIYA YUKI
IPC: D03D15/58
Filed: 2014-07-10
Abstract: The present invention resolves the problems of prior art and provides a wear-resistant cloth which has high wear resistance and exhibits sliding properties for a long period even under a higher load than before. A wear-resistant multi-ply woven fabric comprising a sliding woven fabric and a base woven fabric, wherein: the sliding woven fabric is a woven fabric comprising a polytetrafluoroethylene fiber (A); the base woven fabric is a woven fabric which consists of a fiber (B) that exhibits a creep ratio lower than that of the polytetrafluoroethylene fiber under a load of 20% of the breaking strength in a standard state; and the sliding woven fabric and the base woven fabric are interconnected with each other by interlacing their respective warps and/or wefts with each other.
Patent TW-201517245-A (TW)
Title: Semiconductor micro-analysis chip and method of manufacturing the same
Inventor: MIKI HIROKO
IPC: G01N33/48
Filed: 2014-07-30
Abstract: One of embodiments is a semiconductor micro- analysis chip for detecting particles in a sample liquid. The chip comprises a semiconductor substrate, a first flow channel provided on the semiconductor substrate to allow the sample liquid to flow therein, a second flow channel provided at a different position from the first flow channel of the semiconductor substrate to allow the sample liquid or an electrolyte solution to flow therein, a contact portion where a portion of the first flow channel and a portion of the second flow channel abut each other or intersect one another with a partition being arranged between the flow channels, and a fine hole provided on the partition of the contact portion to allow the particles to pass therethrough.
Patent TW-201509684-A (TW)
Title: Mold release film
Inventor: NAKAO YOHSUKE
IPC: B32B7/06
Filed: 2014-08-04
Abstract: The purpose of the present invention is to provide a mold release film which is suitable for the production of a flexible circuit board, and which is capable of suppressing the formation of wrinkles, while maintaining mold releasability. The present invention provides a mold release film which is suitable for the production of a flexible circuit board, and which has the front surface and the back surface that have been subjected to surface roughening. The ten-point average roughness (Rz) of the front surface is from 4 [mu]m to 20 [mu]m (inclusive), and a mold release layer that constitutes the back surface has a thickness of 35 [mu]m or more (excluding the cases where the ten-point average roughness (Rz) of the front surface is from 4 [mu]m to 5 [mu]m (inclusive) and the mold release layer that constitutes the back surface has a thickness of from 35 [mu]m to 36 [mu]m (inclusive)).
Patent TW-201518106-A (TW)
Title: System with panels and the lamination method there of
Inventor: HO KWAN-SIN
IPC: H05K13/04
Filed: 2014-08-04
Abstract: An lamination method of the system with panels includes providing a display panel having a first laminating surface, which includes a display region and a non-display region, and two adjacent edges of the first laminating surface forming a first angle; providing a touch panel, which has a second laminating surface facing the first laminating surface; disposing an adhesive layerbetween the first laminating surface and the second laminating surface such that the adhesive layer is attaching both to the display panel and to the touch panel, the adhesive layer covering the display region completely, and an edge of the adhesive layer forming an avoiding region, which is exposing portion of the first laminating surface and located in the non-display region.