baber/WOPTO huggingface dataset:
Patent JP-S57142025-A (JP)
Title: Sweep signal generator
Inventor: TANAKA NORIYO
IPC: H03L7/099
Filed: 1981-02-27
Abstract: PURPOSE:To attenuate a power level of a frequency band desired to be removed, by sweeping the band with a waveform signal having steep rise and fall instantaneously. CONSTITUTION:A trigger pulse generator 8 consists of a mixer 8a, a reference oscillator 8b and a low-pass filter 8c, and a signal in 125-155MHz intermediate frequencies outputted from a frequency mixer 5 is applied to one input of the mixer 8a, and a reference frequency corresponding to a frequency f0 (e.g., 138MHz) among this intermediate frequency band signal is applied to another input for mixing. This mixed output is applied to the low-pass filter 8c having 500kHz cutoff frequency to generate a trigger pulse at a time location before the generated time location of the frequency f0 by 0.5mus. After this trigger pulse is converted into a rectangular wave signal, 1mus in width having steep rise and fall at a wave signal generator, the pulse is applied to a local oscillator 4 to instantaneously change the oscillated frequency.
Patent JP-H07234179-A (JP)
Title: Preparation of sample for infrared analysis
Inventor: HATANO HIROKO
IPC: G01N21/35
Filed: 1994-02-24
Abstract: PURPOSE:To clearly acquire a weak infrared ray peak and the infrared ray peak of a thick sample, a non-transmission type sample etc., by holding a small solid material with a sheet-shaped window material which has an improved light transmission property and can be formed easily and applying pressure to each window frame. CONSTITUTION:For example a small solid organic sample 11 is held between. For example, KBr plates 3a and 3b, which window materials which have improved light transmission property and can be formed easily. Then, the KBr plates 3a and 3b hold the sample 11 with two mirror surface plates 2a and 2b which are approximately 7-10mm thick and then pressure is applied by hand pressing so that the total thickness of the sample 11 and the KBr plates 3a and 3b becomes for example approximately 200mum. After that, the mirror surface plates 2a and 2b are removed to obtain a sample 11' for an infrared analysis, which became thin after being held by the KBr plates 3'a and 3'b and became thin due to applied pressure. The sample 11' is formed in one piece with KBr plates 3'a and 3'b by the applied pressure and hence the sample thickness becomes thin so that the occupation area increases, infrared analysis sensitivity and S/N ratio improve, and the power loss of the small sample 11 can be prevented.
Patent JP-H10219155-A (JP)
Title: Composition and method for peeling coating film
Inventor: KAWAKAMI IKUO
IPC: C09D9/00
Filed: 1997-02-10
Abstract: PROBLEM TO BE SOLVED: To peel the coating film from a substrate without fail without adversely affecting the substrate. SOLUTION: A substrate is immersed in a composition substantially free from a chlorine-containing solvent and comprising 1-95wt.% ethylene glycol diether or propylene glycol dieter of the formula: R<1> O-Xn -R<2> (wherein R<1> and R<2> are each a 1-12C alkyl; X is an ethylene oxide group or a propylene oxide group; and n is 1-10), 5-50wt.% nitric acid and the balance of water, rinsed with an aqueous solution containing ethylene glycol dither or propylene glycol dither and is subjected to physical force such as air blow to remove the coating film from the substrate.
Patent JP-S60174076-A (JP)
Title: Dc brushless supersonic motor
Inventor: FURUYA YOUJI
IPC: H02N2/12
Filed: 1984-02-17
Abstract: PURPOSE:To improve the durability and the starting power by coupling a DC brushless motor with a vibration piece type supersonic motor. CONSTITUTION:A solenoid 2 for a supersonic vibrator is held at the left of a case 1 in such a manner that a solenoid shaft 3 secured to the end of the solenoid 2 is engaged through a stopper 4 with the case 1. A Langevin type supersonic vibrator 5 is disposed at the right of the solenoid 2, and a vibrator 9 is secured to the right side. A vibration piece 10 is stood around the vibrator 9. The vibration piece 10 is contacted with the ends of inner and outer rotors 14, 15. The rotor 15 is formed of a magnet. A DC brushless motor B is composed of the rotor 15, an electromagnetic unit C and a Hall element 23. The vibration piece type supersonic motor A is composed of the vibrator 5, the vibrator 9, the piece 10 and the rotors 14, 15.
Patent JP-H08222406-A (JP)
Title: Thermistor device
Inventor: TAKAHATA HARUO
IPC: H01C1/026
Filed: 1995-02-15
Abstract: PURPOSE: To provide a thermistor device wherein a thermistor element is airtightly contained for protecting an electronic component from a harmful atmosphere represented by a reducing gas such as chlorine gas and hydrogen sulfide gas. CONSTITUTION: The title device is comprised of an insulating tubular case 14 having open ends, an upper metallic terminal board 12 and a lower metallic terminal board 13 which are arranged and fixed in an open part of both ends and close the open part and a plate-like thermistor element 11 wherein electrodes 11a, 11b are formed in both main surfaces. The thermistor element 11 is arranged and contained inside the tubular case 14 and the electrodes 11a, 11b of the thermistor element 11 are in electrical contact with the upper metallic terminal board 12 ad the lower metallic terminal board 13, respectively.
Patent JP-S61187047-A (JP)
Title: Logical circuit simulation system
Inventor: HARA HIROTAKA
IPC: G06F19/00
Filed: 1985-02-14
Abstract: PURPOSE:To detect an improper presumption in an early stage to prevent unnecessary reverse simulation by inserting forward simulation to check the matching to the state of another output terminal in the process of reverse simulation if required. CONSTITUTION:When reverse simulation is started, input terminals of unit circuit are classified, and input terminals of unit circuits of wrong output signals are defined as F-state terminals. In case the input signal value estimated by reverse simulation is connected to the input terminal of another unit circuit different from that of forward simulation, the processing is performed as follows; in case that the value of forward simulation is correct with respect to the output of a unit circuit 10 though the output of a unit circuit 11 is not an output SBC of forward simulation but is an output SDC, the input terminal is held at a value B for forward simulation by check of the unit circuit 10 though it is estimated by reverse simulation of the unit circuit 11 that the input B is D.
Patent JP-H09223685-A (JP)
Title: Plasma processing apparatus and plasma processing method
Inventor: NAGAYAMA TETSUJI
IPC: H01L21/3065
Filed: 1996-02-14
Abstract: PROBLEM TO BE SOLVED: To control an exhaust rate in a substrate surface to be processed by providing an exhaust hole at least at any one location on a vertical extention line on a principal surface of the substrate. SOLUTION: A substrate 1 to be processed is placed on a substrate stage 2 serving also as a lower electrode, and a counter electrode 4 is disposed parallely to the substrate 1. A space between the substrate 1 and the counter electrode 4 is a plasma production area, toward which gas introduction holes 5 are disposed in a ring shape to constitute a parallel flat plate type plasma etching apparatus. Thereupon, an exhaust hole 6 is formed in the center of the counter electrode 4, through which exhaust hole 6 there is exhausted exhaust gas containing a reaction product produced from the center of the substrate 1. Herein, a distance between the exhaust hole 6 and the substrate 1 is set to be within the length of a diameter of the substrate 1. Hereby, a highly uniform plasma processing is achieved.
Patent JP-H03232531-A (JP)
Title: Catalyst for purification of exhaust gas
Inventor: KANESAKA HIROYUKI
IPC: B01D53/94
Filed: 1990-02-08
Abstract: PURPOSE:To form a durable catalyst by laminating a first layer contg. Pt or Pd and a second layer contg. a powdery mixture of Rh black powder of <=1,000Angstrom  particle size with metal oxide powder on a honeycomb carrier. CONSTITUTION:A first layer contg. Pt and/or Pd and a second layer contg. a powdery mixture of Rh black powder of <=1,000Angstrom particle size with metal oxide powder are laminated on a honeycomb carrier made of activated alumina based on gamma-alumina, etc., to form a catalyst for purification of exhaust gas. Activated alumina based on gamma-alumina, ZrO2 or a mixture of the oxide of a rare earth element with activated alumina is suitable for use as the metal oxide in the second layer. Since the interaction between Rh and alumina in the resulting catalyst is weak even after repeated use, the formation of a solid soln. of Rh in alumina is prevented and the deterioration of the catalytic performance is inhibited.
Patent JP-S60172897-A (JP)
Title: Transmission path error detection/compensation circuit in differential encoder/decoder of color tv signal
Inventor: CHIYOU FUJIO
IPC: H04N11/04
Filed: 1984-02-17
Abstract: PURPOSE:To eliminate color blurring caused by a phase jump of a subcarrier signal on a reproduction screen by replacing a digitally decoded output of a horizontal scanning line having errors with that of one line two scanning lines before of said line as it is. CONSTITUTION:In an error detection circuit 6 a parity calculated from a digital decoded output in a differential decoding circuit 4 is compared with that in a transmission path frame transmitted from a differential encoding circuit 2 through a transmission path 3. When the presence of a transmission path is judged, a switch 8 is switched to the side as shown in the dotted line, an output of two-line memory 7 is selected as an input of a D/A convertor 5, and a digitally decoded output of a horizontal scanning line having errors are replaced with that of one line two line before of the line having errors as it is. At the same time, switches 9 and 11 are switched to the side as the dotted line shows, and an output of the D/A convertor 5 is operated so that a jump between a phase of a subcarrier signal of the horizontal scanning line, which is replaced with the digitally decoded output before two scanning lines by a delay circuit 10 having a certain delay period, and a subcarrier signal of the scanning line just before said lines will not occur.
Patent JP-S62184555-A (JP)
Title: Interface connection system
Inventor: KIKUCHI NOBUYUKI
IPC: G06F13/12
Filed: 1986-02-10
Abstract: PURPOSE:To reduce the number of times of signal transfer between a channel and an I/O in a transfer sequence time, by performing a data transfer between the channel and a channel side adaptor with a burst mode, and between the I/O and an I/O side adaptor with a multiplex mode. CONSTITUTION:A function which performs a block transfer between the channel and the channel side adaptor with the burst mode is provided at a channel side adaptor 4, and the function which performs a transfer corresponding to a transfer request at an I/O side between the I/O and the I/O side adaptor, at an I/O side adaptor 6, and data buffers 12..., etc., corresponding to each of I/Os 7-0-7-m connected to the control of the I/O side adaptor, within the adaptor 4 (or adaptor 6). By constituting a system in such a way, it is possible to perform the data transfer with each of I/Os 7-0-7-m recognized from a channel 2 with the burst mode. In such a way, the number of times of signal transfer between the channel and the I/O in the sequence of the data transfer time can be reduced, and it is possible to increase the throughput of the system.
Patent JP-H01204499-A (JP)
Title: Ground connecting structure for plastic cover
Inventor: KUROKI KATSUNORI
IPC: H01R4/64
Filed: 1988-02-10
Abstract: PURPOSE:To electrically integrate a coating face with a body device by engaging fixedly terminal fitting with the terminal mounting lug of a surface to be coated, forming a conductive coating film on the surface to be coated, and further connecting the fittings by leads to the ground potential member of the device. CONSTITUTION:A lug 12 for mounting a terminal is provided on a plastic cover 11 covering a body of a device 10. After a terminal fitting 13 having a mounting hole 13a is engaged fixedly with the lug 12, the surface of the cover 11 to be coated including the stationary part of the fitting 13 is coated with conductive paint thereby to form a conductive coating film 14. Further, the fittings 13 are connected by a lead wire 15 to a grounding member 16 of the device 10. Thus, the coating face is electrically integrated with the device.
Patent JP-H07217510-A (JP)
Title: Air cleaner made of synthetic resin
Inventor: TOYOZUMI HIDEYUKI
IPC: F02M35/024
Filed: 1994-01-31
Abstract: PURPOSE:To eliminate directionality in a filter element mounting direction by forming one side of rectangular element packing into bulged shape toward the center in correspondence with the flexure of the lower face of a synthetic resin body at the clamping time so as to maintain airtightness, and forming one opposed side also into the same shape. CONSTITUTION:A rectangular filter element 20 is mounted to a casing formed of a body and a cover made of synthetic resin. In packing 23, one rear side 23d is bulged toward the center so as to correspond to the bulge generated by the clamping of the body lower face, thus preventing air leak at that part. One opposed side 24c is also formed into the same shape so as to eliminate the longitudinal directionality of a filter element 20.
Patent JP-H07235758-A (JP)
Title: Circuit substrate
Inventor: KOBARI KAZUMI
IPC: H05K3/46
Filed: 1994-02-25
Abstract: PURPOSE:To provide a circuit substrate capable of reducing the size by preventing deviation in the position of surface mount. parts until cream solder is hardened and by omitting through-holes. CONSTITUTION:A substrate 1 is formed, the surface of which is formed with a connecting pattern connected to a signal line pad 10 and a signal line pad 10 connected to a lead wire 215 of a surface mounting part 20 and the inner layer of which is formed with inner layer conductive patterns 11 and 12; lead wire inserting recesses 22 and 23 are formed in this substrate; and the position of the surface mounting part 20 is determined by inserting the lead wires 21V and 21G of the surface mounting parts 20 to the lead wire inserting recesses 22 and 23. And the through-holes are omitted by directly connecting inner layer conductive pattern 11 or 12 exposed to the bottom of lead inserting recesses 22 and 23, thereby miniaturizing a circuit substrate.
Patent JP-S61191566-A (JP)
Title: Manufacture of cubic boron nitirde sintered body
Inventor: JIYOFUREI JIYON DEEBISU
IPC: C04B35/58
Filed: 1986-02-10
Abstract: A sintered cubic boron nitride body is produced by mixing a mass of cubic boron nitride particles with a salt-like nitride or a mixture of such nitrides and subjecting the mixture to elevated temperature and pressure conditions at which the cubic boron nitride is crystallographically stable. The nitride or nitrides in the mixture are present in an amount of no more than 2 mole percent of the mixture. The sintered body thus produced may be crushed to a mass of smaller bodies or particles. The strength of these bodies or particles may be increased by subjecting them, or the sintered body before crushing, to a heat treatment at a temperature of 1000 DEG C to 1300 DEG C for 5 to 60 minutes.
Patent JP-H08221709-A (JP)
Title: Thin film head for perpendicular magnetic recording and magnetic disk device
Inventor: TSUCHIYA TOSHIO
IPC: G11B5/31
Filed: 1995-02-16
Abstract: PURPOSE: To obtain a thin magnetic head for a high density recording having a low inductance, high efficiency of reproduction and high reliability and to obtain a magnetic disk device. CONSTITUTION: A main magnetic pole 6 is supported by a magnetic body 7 and bonded to the face of a magnetic body on a signal coil magnetic substrate 1 having a thin film formed, to increase magnetic joining area. Auxiliary magnetic poles 4 are erected from the coil substrate 1 and to come close to the main magnetic pole 6 side as coming close to an opposed recording medium to form a return pass having low magnetic resistance and to form an auxiliary magnetic pole having a low inductance structure. The objective thin magnetic head having high efficiency of reproduction and stable characteristics is obtd.
Patent JP-H02206129-A (JP)
Title: Formation of mos type field-effect transistor
Inventor: NAMITA HIROMITSU
IPC: H01L29/78
Filed: 1989-02-06
Abstract: PURPOSE:To prevent a hot electron from being generated by a method wherein impurities whose segregation coefficient in silicon is smaller than 1 are introduced into a source and a drain and, after that, a polysilicon film or an amorphous silicon film is melted and recrystallized by using an opening part as a seed crystal. CONSTITUTION:A gate electrode 6 is formed, via a gate oxide film 5, directly above an opening part on an island-shaped polysilicon film 4 or an island-shaped amorphous silicon film which has been deposited, so as to include the opening part, on a silicon oxide film 2 having the opening part formed on a single-crystal semiconductor film 1. After that, impurities whose segregation coefficient in silicon is smaller than 1 are implanted into a source region and a drain region; the polysilicon film 4 is melted and recrystallized by using the opening part of the silicon oxide film, i.e., the single-crystal semiconductor film at a lowermost layer, as a seed crystal. During this process, when a seed crystal part 3 is formed inside symmetrical regions as viewed from the source and the drain, a concentration gradient can be made symmetrical with reference to the channel. Thereby, it is possible to restrain a hot electron from being generated.
Patent JP-H07233616-A (JP)
Title: Steel floor panel
Inventor: KOBAYASHI TOKUZO
IPC: E04F15/06
Filed: 1994-02-25
Abstract: PURPOSE:To facilitate an appearance inspection and prevent a lateral drift between members in the connecting structure of steel floor panels. CONSTITUTION:This steel floor panel is overlapped with a top plate 1 and a bottom plate 2 made of a steel plate and pressure-fastened, and engage-molded notch step sections are provided at the contact section of the plates 1, 2. Engage- molded notch step sections 4, 6 are provided at the contact section of a flange 3. Engage-molded notch step sections 7 are provided at a contact section near a support pole 5 provided on the inner face of either one of the plates 1, 2.
Patent JP-S59154070-A (JP)
Title: Manufacture of semiconductor memory device
Inventor: NAGAKUBO YOSHIHIDE
IPC: H01L29/788
Filed: 1983-02-22
Abstract: PURPOSE:To contrive the reduction of the write voltage by increasing the capacitance between the first and second gate electrodes by a method wherein a part of an electrode material pattern serving as the first gate electrode is selectively etched in the direction of the film thickness, thus forming an uneven part and increasing the surface area of said pattern. CONSTITUTION:The first thermal oxide film 14 is formed on the surface of an element region 13 by thermal oxidation. Next, after forming a phosphorus doped polycrystalline Si film over the entire surface, it is patterned by photoetching technique, resulting in the formation of a polycrystalline Si pattern 15. Then, a resist pattern 16 is formed by a photoetching method, thereafter the uneven part 17 is formed by selectively etching a part of said pattern 15 about 3,000Angstrom  in the direction of the film thickness with the former pattern as a mask. After removing the resist pattern 16, the second thermal oxide film 18 is formed by performing the treatment of thermal oxidation. A phosphorus doped polycrystalline Si film is deposited, and afterwards the second gate electrode 22 is formed by reactive ion etching.
Patent JP-H11234189-A (JP)
Title: Information transmitter and information receiver
Inventor: AKIYAMA KOICHIRO
IPC: H04H20/00
Filed: 1998-02-10
Abstract: PROBLEM TO BE SOLVED: To effectively utilize a portable information receiver at the time of a disaster, etc., by selectively receiving from a third party information useful for a receiving person in addition to normal information addressed to an individual and judging whether the information is reliable or not so as to output when it is found useful and reliable. SOLUTION: A signal inputted from a signal receiving part 1 is sent to a signal selecting part 2 to analyze its contents. Selected information DB7 is retrieved based on the analysis and only a signal judged necessary is sent to an information authenticating part 3, which authenticates a caller based on the signal and the open key of the caller. The signature of the caller is decoded by the open key so as to allow it to match the hash value of an information main body. If data obtained by decoding the signature completely matches with the hash value of the information main body, the signature is judged to be correct to ensure the authentication of data. In this case, the information main body and information on the caller are sent to a display part 4 to be displayed.
Patent JP-2000228006-A (JP)
Title: Joined body using bonding pad and bump and magnetic head device
Inventor: YAMAGUCHI MASAKI
IPC: G11B5/49
Filed: 1999-02-05
Abstract: PROBLEM TO BE SOLVED: To lessen the quantity of the deposition of Au of the bonding pad in the solder joint part and to prevent the deterioration of the joining strength of the solder joint part by setting the thickness of an Au layer in such a manner that the Au content in the solder joint part between a bonding pad having the Au layer on its surface and a bump attains a specific value or below in a state of joining the bonding and the bump. SOLUTION: The bonding pad 12 has a Cu layer 12a, Ni layer 12b and the Au layer 12c on the surface of a base film 11a constituting a flexible substrate 11. A wiring material 13 has the copper bump 13c laminated with a solder layer 13b. When the solder layer 13d is pressed to the bonding pad 12 and the wiring material 13 and the flexible substrate 11 are heated, the solder layer 13d melts and forms the solder joint part. When the thickness of the Au layer 12c is below 0.7 μm, the content of the Au in the solder joint part is confined to <=9 wt.%. As a result, the deposition of the compound of Au and Sn in the solder joint part is suppressed and the joining strength of the solder joint part may be enhanced.
Patent JP-S63198225-A (JP)
Title: Manufacture of resin-coated lamp
Inventor: NAITO YUTAKA
IPC: H01J9/20
Filed: 1987-02-12
Abstract: PURPOSE:To unify the contraction and secure the adherence to a lamp face by heating a thermal contraction tube inserted with a straight tube lamp while suspending it vertically. CONSTITUTION:A fluorescent lamp 2 is inserted into a thermal contraction tube 1, the lower end A of the thermal contraction tube 1 is closed by a fastener 3, a suspending hole 4 provided at the upper end B is suspended from a suspending metal 7 on an endless chain 6 running in a heating furnace 5 at a constant speed, and the thermal contraction tube 1 is transferred through the heating furnace 5. According to this method, the thermal contraction tube 1 is vertically subpended while being applied with no force other than in the axial direction, uniformly heated by the heating furnace 5 constituted of a heat radiation furnace, a hot air circulation furnace or the like, uniformly contracted so as to adhere to the outer face of the lamp 2, both ends A, B are formed into a nearly conical shape, and the removing work of the end face is facilitated.