Patent TW-202030819-A (TW)
Title: Electronic component mounting device capable of mounting a plurality of electronic components on a substrate with mounting variations reduced
Inventor: ISHII MASAAKI
IPC: H05K13/04
Filed: 2019-12-09
Abstract: The present invention relates to an electronic component mounting device. The object of the present invention is to provide an electronic component mounting device capable of mounting a plurality of electronic components on a substrate regardless of uneven thickness and reducing mounting unevenness. The solution of the present invention is an electronic component mounting device, which is configured to mount a first electronic component and a second electronic component on a substrate. The electronic component mounting device includes a base core directly or indirectly facing a surface of the substrate where the electronic components are not mounted; a first pressurizing core directly or indirectly facing the first electronic component; a second pressurizing core directly or indirectly facing the second electronic component; a cover member having a first end part for pressing second end parts of the first pressurizing core and the second pressurizing core while contacting the second end part of the first pressurizing core and the second end part of the second pressurizing core; and a movement control part having a pressing member for pressing an end part of the cover member and configured to move the base core, the first pressurizing core and the second pressurizing core for distance control while contacting a second end part of the cover member. By the movement control part causing close approach among the base core, the first pressurizing core and the second pressurizing core, the first pressurizing core and the base core simultaneously apply pressure to the first electronic component, and the second pressurizing core and the base core simultaneously apply pressure to the second electronic component. With regard to the approach to or the moving away from the base core, the first pressurizing core and the second pressurizing core move independently of each other. The position of the first end part of the first pressurizing core when the first pressurizing core presses the first electronic component and the position of the first end part of the second pressurizing core when the second pressurizing core presses the second electronic component can differ by a difference between the thickness of the first electronic component and the thickness of the second electronic component. The base core is further provided with: a rotating body arranged on at least one of the second end part of the first pressurizing core, the second end part a the second pressurizing core, and a position where the pressing member faces the cover member, and configured to be movable to release excess pressure of the first pressurizing core and the second pressurizing core. When the first end part of the first pressurizing core and the first end part of the second pressurizing core are at different positions due to thickness difference between the first electronic component and the second electronic component, the rotating body tilts the cover member, such that the tilted cover member can offset the difference between the position of first end part of the first pressurizing core and the position of the first end part of the second pressurizing core, making the pressure exerted by the first pressurizing core and the pressure exerted by the second pressurizing core substantially the same.