baber/WOPTO huggingface dataset:
Patent JP-H06138262-A (JP)
Title: Timepiece lighting system
Inventor: SHIRAI TOSHIAKI
IPC: G04C21/16
Filed: 1992-10-29
Abstract: PURPOSE:To reduce power consumption and to enhance visual effects by illuminating a time face using a lighting element of low illuminance while setting an alarm or while it is dark, and illuminating the face using a lighting element of high illuminance while the alarm is on or while the timepiece is controlled by hand. CONSTITUTION:When it becomes dark as external illumination is turned off, a light-emitting diode 1 is turned on by means of CaS 5 and Tr 1 to illuminate a translucent panel 4 from one side. The translucent panel 4 guides light to illuminate a dial plate 3 from its back. Even while an alarm setting switch SW1 is on, the light-emitting diode 1 is turned on to illuminate the dial plate so as to indicate alarm setting until the alarm hour comes. At the alarm hour, an alarm switch SW 2 is on to give an alarm and to turn on an incandescent lamp 2 of high illuminance so as to illuminate the dial plate 3 via the translucent panel 4 until the SW 2 is off. Thus the light-emitting diode 1 is turned on while it is dark and while alarm setting is indicated, and the lamp 2 is turned on while the alarm is given, so as to enable power savings and enhancement of visual effects.
Patent JP-H06140574-A (JP)
Title: Semiconductor integrated circuit device
Inventor: SUZUKI TAKAAKI
IPC: H03K19/00
Filed: 1992-10-29
Abstract: PURPOSE:To prevent a leak current and reduce power consumption, by providing an on/off means for turning on and off a current path in accordance with a logical state of an output signal from a signal generating circuit. CONSTITUTION:A resistor R10, a voltage step-down circuit 30, and two MOS transistors T15 and T16 constitute a current path 31 between a given power- supply pad 29 and a given low voltage power line VSS. Through the current path 31, a leak current ILEAK flows from the pad 29 to the low voltage line VSS while the MOS transistors other than those in the voltage step-down circuit 30 are both turned on so that a voltage V1 in proportion to an applied voltage VCC and lower than the voltage VCC, which is applied to the pad 29, is generated at a node N1 between two MOS transistors T15 and T16. Moreover, the voltage V1 can be desirably adjusted by connecting each gate of a rather large number of sequential transistors that are previously incorporated in the voltage step- down circuit 30.
Patent JP-H04165758-A (JP)
Title: Method and device for processing image
Inventor: SHIBAZAKI SOHEI
IPC: H04N1/387
Filed: 1990-10-29
Abstract: PURPOSE:To continuously print out the contents of a long original on long printing paper by dividing the long original by a prescribed length, and successively executing image reading, image processing and printing operation in respective continuous areas. CONSTITUTION:An image only in the initial prescribed length area is read out from the long original 53 by a scanner 50 and stored. Then a range to be applied to necessary image processing such as coloring edition is specified in the initial area by a digitizer 64, the image processing is executed and the processed image is printed out on printing paper 26. Then, the 2nd prescricibed area of the original 53 is read out, its image is processed and the processed image is printed out in the 2nd area continued to the 1st area. Thus, the contents of the long original 53 can be continuously printed our while successively continuing said operation in respective areas of the original 53.
Patent JP-H04268039-A (JP)
Title: Aluminum alloy and its cast product and produ- cing method
Inventor: CHIA MINGU IEN
IPC: F02B41/00
Filed: 1991-11-07
Abstract: PURPOSE: To provide an aluminum alloy for casting having physical properties so as to withstand the use at high temp. of about 204 to 316°C.  
     CONSTITUTION: This alloy is the one having a compsn. contg. 7.0 to 13.0% Cu, 0.4 to 1.2% Mn, 0.21 to 0.4% V, 0.31 to 0.70% Zr, <0.6% Si, <0.8% Fe, <0.2% Zn, <0.1% Mg, <0.2% Ni, and the balance Al and having ≥228×10 6 Pa tensile strength, ≥159×10 6 Pa tensile yield strength and 69×10 9 Pa tensile elastic modules as high temp. physical properties particularly at 260°C. By the alloy, for example, a piston for an internal combustion engine can be cast. 
     COPYRIGHT: (C)1992,JPO
Patent JP-2000084185-A (JP)
Title: Game machine
Inventor: OZEKI MITSURU
IPC: A63F7/02
Filed: 1999-10-13
Abstract: PROBLEM TO BE SOLVED: To provide a game machine such as a PACHINKO machine that prevents unfair actions and offers real and various display functions to satisfy players' expectations. SOLUTION: The MPU 31 of a game board control device 30 senses states of the PACHINKO machine through various sensors, and controls lamps on the separate circuit board such as a bonus indication lamp 17A, a play action lamp 17B, etc., and a bonus action drive part 14B, a ball hitting motor 26, etc. The MPU 31 sends display commands to a display unit 50 according to play states. The sub-CPU 54 of the display unit 50 accesses to a display ROM 56 based on the display commands input, reads display control data, and outputs the data to an LCD panel driver 52 to display various graphics on a LCD panel 16.
Patent JP-H11120340-A (JP)
Title: Image processor
Inventor: AOYAMA NORIYUKI
IPC: G06T1/60
Filed: 1997-10-08
Abstract: PROBLEM TO BE SOLVED: To obtain an image processor capable of performing plural different image processings at high speed. SOLUTION: An image development processing of image data is performed by using memory 11 by a CPU 10 and a font processing, a graphic processing are performed by using memory 12 by an accelerator 13. Respective processings are simultaneously performed after a processing instruction and the image data is passed to the accelerator 13 before the processings by the CPU 10. When respective processings are completed, pieces of the image data after the processings are simultaneously read from the memory 11, 12 by the CPU 10. Respective pieces of the read image data are synthesized as one image after the processings by transmitting it to an OR circuit 18. In addition, a bus is properly switched by controlling bus switching circuits 14, 15 according to time before the processings, during the processings and after the processings by the CPU 10.  The plural different image processings are performed at high speed by the above described operation.
Patent JP-H01132724-A (JP)
Title: Apparatus for melting chip of non-ferrous metal
Inventor: KUSAKA KAZUO
IPC: C22B9/16
Filed: 1987-11-17
Abstract: PURPOSE:To rapidly disperse and melt chip into base molten metal and to prevent oxidation of both in the title apparatus by introducing the base molten metal from side face of an eddy chamber along the inner face, discharging from bottom face and constituting as enclosing the chip of Al, etc., supplied at center part of this eddy chamber into the eddy. CONSTITUTION:The material for base molten metal charged 8 in the base molten metal melting/holding chamber 1 is heated and melted with burner 6 to produce the base molten metal 3. Then, the base molten metal 3 is circulated 4 to the chamber 1 through flow passage 2b, eddy chamber 9 in chip melting chamber 2, communicating tube 4a. Then, in the eddy chamber 9, the base molten metal 3 is introduced (a) to tangent line direction of the chamber 9 and discharged from center of the bottom face of the chamber 9 to develop the eddy of the base molten metal 3 in the chamber 9. Successively, the Al chip is continuously charged from the upper part of the chamber 9 through a charging device 7 and guide 7a. Then, the charged chip is enclosed in the eddy and quickly dispersed in the base molten metal 3 and melted. Successively, the molten Al is supplied 4 into the chamber 1 accompanied with the base molten metal 3 through passage 2c surrounding submerged burner 5 and the communicating tube 4a, and discharged to out of the system.
Patent JP-H05152608-A (JP)
Title: Optical element and optical bus, and optical interprocessor coupled network using them
Inventor: BABA SHINICHI
IPC: H04B10/54
Filed: 1991-11-07
Abstract: PURPOSE:To obtain an optical interprocessor coupled network capable of high-speed connective switching, by providing a substrate, a light emitting element provided therein, and a concentric- type light receiving element surrounding it. CONSTITUTION:A light receiving element 53 surrounds the periphery of a light emitting and transmitting element 52 in the central part of a semiconductor substrate 51, and the light receiving element 53 converts an incident light from its bottom surface into the electrical signal to emit a light from the top surface of the light emitting and transmitting element 52. The central part comprises a multilayer structure, and therein, has an active layer 54, and the upper and lower layers 55a, 55b thereof are controlled to perform light emitting and receiving functions. The concentric-type light receiving element 53 having a multilayer photodiode structure too can be provided with an electrode in its uppermost layer, and has the wide light receiving range for 100mum in each direction, and a diffracted light having a wide emitting angle is emitted from an outgoing port. Therefore, by constituting an optical bus using the device comprising the light emitting/receiving elements arrayed in the form of a matrix and making an inter-substrate transferring frequency high using an integration and increasing the number of inter-substrate wirings to increase the number of connective substrates, the highly dense configuration of a coupled network is made possible.
Patent JP-H05129892-A (JP)
Title: Filter device
Inventor: OKI MITSUHARU
IPC: H03H17/06
Filed: 1991-11-07
Abstract: PURPOSE:To quicken the arithmetic operation processing speed by reducing the circuit scale. CONSTITUTION:Input data are fed to a selector 3 via a variable delay circuit 2 and the output is fed to a multiplier input terminal of multiplier adders 7, 8, 9 via data hold circuits 4, 5, 6. Moreover, a single control circuit 10 forms sequentially arithmetic operation instructions a0, a1, a2 which multiply coefficients c0, c1, c2 respectively with data from the multiplier input terminal and add the data from an addition input terminal and give the result in common to an arithmetic operation instruction input terminal of the multiplier adders 7, 8, 9. The output at the output terminal of the multiplier adders 7, 8, 9 is fed respectively to the adder input terminal of the multiplier adders 7, 8, 9 through registers 11, 12, 13 with a clear function to form a loop. Furthermore, the output of the output terminal of the multiplier adders 7, 8, 9 is fed to a parallel serial conversion circuit 14 and the converted output data are extracted at a data output terminal 15.
Patent JP-2001108613-A (JP)
Title: Device for remotely measuring amount of atmospheric gas
Inventor: ARAKI NOBUHIRO
IPC: G01J3/26
Filed: 1999-10-14
Abstract: PROBLEM TO BE SOLVED: To provide a device for remotely measuring the amount of atmospheric gas that can exclude the deterioration of a measuring device due to the deterioration of a drive part and can increase measurement speed in addition to high resolution in the constant monitoring of the mount of atmospheric gas using the spectral system by etalon. SOLUTION: By utilizing the fact that the maximum transmission wavelength also changes when the incidence angle of measurement light entering etalon differs, and installing the measuring device so that the maximum transmission wavelength after transmitting through etalon becomes the absorption wavelength and the window wavelength region of an observation gas for the incidence angle from different slits 3 and 4 to fixed etalon 7, and measuring each intensity of a spectrum image using an array-type photo detector 11 or a simple substance element since the intensity of at least two spectrum images being condensed by a condensation optical element 9 becomes the absorption wavelength of the observation gas and the wavelength intensity of the window wavelength region, the amount of gas can be measured according to the differential intensity and the intensity of the window band region, thus eliminating the need for wavelength scanning using a drive part.
Patent JP-S63146472-A (JP)
Inventor: BAABARA ARAN CHIYAPERU
IPC: H01L29/267
Filed: 1987-11-20
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S63146141-A (JP)
Title: Memory card
Inventor: IIMURA HIROSHI
IPC: G06K17/00
Filed: 1986-12-10
Abstract: PURPOSE:To detect error when a memory card having a form other than a designated form is connected to a higher device, by outputting the form of the memory card itself onto a data bus by the control signal from the higher device side to allow the higher device to recognize it. CONSTITUTION:The form of a memory card 2 itself is outputted onto a data bus 6 by the control signal from the higher device side to allow the higher device to recognize the form of the memory card 2 itself. Thus, error that a memory card other than the memory card designated by the higher device or the memory card having the hardware form required for normal operation on the constitution of hardware of the higher device side is connected is detected in the higher device side. Further, it is easy that the higher device uses memory cards different in form by the same connector.
Patent JP-H04165319-A (JP)
Title: High variable power lens for compact camera comprehending wide angle
Inventor: ITO TAKAYUKI
IPC: G02B15/167
Filed: 1990-10-30
Abstract: PURPOSE:To achieve the increase of an angle and the increase of a variable power as a curvature of field and a distortion curve aberration are sufficiently corrected by specifying constitution of first - third lens groups. CONSTITUTION:A second lens group comprises, in order, from the object side a 2a-th lens group having a negative focus distance, a 2b-th lens group having a positive focus distance, and a 2m-th lens located between the 2a-th and 2b-th lens groups and having a convex surface pointed to the field side and a positive focus distance, the 2m-th lens satisfying formulas I and II. In the formulas I and II, fs is the focus distance on the short focus side of a whole system, f2m is the focus distance of the 2m-th lens, and r2m is the curvature of radius on the field side of the 2m-th lens. This constitution simultaneously achieves the increase of an angle and the increase of a variable power as a curvature of field and a distortion curve aberration are corrected and achieves reduction of the size of a front lens diameter.
Patent JP-H05209375-A (JP)
Title: Dyeing of cellulose-based fiber material
Inventor: IMADA KUNIHIKO
IPC: D06P3/66
Filed: 1992-10-30
Abstract: PURPOSE:To carry out fast exhaustion dyeing of a cellulose-based fiber without using an acid scavenger within a range of weak acid to neutral by using a reactive dye having an S-triazinyl group as the reactive group. CONSTITUTION:Fast exhaustion dyeing of a cellulose-based fiber material is carried out at a pH of the dye bath within a range of weakly acid to neutral and at 100 to 140 deg.C without adding an acid scavenger to the dye bath by using a reactive dye having one or more groups represented by the formula [R is a pyridine derivative (except nicotinic acid and its alkaline metal salts) group bonded to a carbon atom of S-triazinyl group] and also having a hydrophilic group.
Patent JP-H05123063-A (JP)
Title: Laying of mulching
Inventor: OHASHI AKIRA
IPC: A01G13/00
Filed: 1991-11-08
Abstract: PURPOSE:To stably prevent the scattering of soil and growth of weed over a long period and to effect the growth of tree and flower in excellent state by using a specific durable mulching material resistant to degradation and scattering. CONSTITUTION:A granular porous ceramic material is produced by granulating a mixture of (A) a clay mineral as an aggregate (preferably by-product of silica sand produced from mountain sand, etc.), (B) carbon, wood flour, diatomaceous earth and/or starch as a foaming assistant and (C) bentonite and/or sodium silicate as a sintering material and sintering the granulated mixture at 700-1100 deg.C. The porous material is placed on the desired area of soil to a thickness effective for suppressing the sprouting of weeds, preferably 30-50mm.
Patent JP-H09131578-A (JP)
Title: Removing method of coating material on coating jig or hanger
Inventor: YOSHINO YASUO
IPC: B08B7/00
Filed: 1995-11-10
Abstract: PROBLEM TO BE SOLVED: To remove a coating material stuck to an undesired part such as a coating jig, a hanger in coating work at a low cost in a short time by cooling the member to be stuck such as coating jig or the hanger, on which the coating material is stuck, applying impact to the cooled coating material to break it and peeling the coating material from the member to be stuck with coating material. SOLUTION: The member 10 to be stuck, such as the coating jig, the hanger composed a metallic material, on which the coating material 20 is stuck, is housed in a cooling vessel and cooled by liquid carbon dioxide, liquid nitrogen or the like. The cooling temp. depends on the material of the member 10 to be stuck and the coating material, and is controlled to 0-170 deg.C. The adhesive strength between the member 10 to be stuck and the coating material 20 is reduced because of the difference of the shrinkage due to cooling between the member 10 to be stuck and the coating material 20, and the coating material 20 is hardened and degraded to be made fragile. Then, the coating material 20 is stripped off from the member 10 to be stuck by taking out the cooled member 10 to be stuck and the coating material 20 from the cooling vessel and applying the impact F to the coating material 20.
Patent JP-H11134431-A (JP)
Title: Device for reading equal grade stamp of packed product
Inventor: SHINDO TOSHIHARU
IPC: G06K7/12
Filed: 1997-10-24
Abstract: PROBLEM TO BE SOLVED: To automatically read an equal grade stamp with satisfactory precision from the equal grade chart of the corrugated carton of a farm product. SOLUTION: An equal grade display part is printed on a side face 10a of a corrugated carton 10 in which farm products are packed. An outer frame 41 and an equal grade chart 42 are painted red, while picture reference mark 43 is painted black, and equal grade stamps 5 and 5' are also painted black. The side face 10a of the corrugated carton 10 carried by a conveyer is irradiated with a red illuminating light in the same color as the equal grade chart 42 by an illuminating device, and the side face 10a is image picked-up by a CCD camera. Then, the picture of the picture reference mark 43 and the pictures of the equal grade stamps 5 and 5' are extracted from the picture data. The positions of the equal grade stamps 5 and 5' for the equal grade chart 42 are determined from the position of the picture reference mark 43.
Patent JP-2000108690-A (JP)
Title: Mount structure of power unit
Inventor: UCHIYAMA TAKAYUKI
IPC: B60K17/06
Filed: 1998-09-30
Abstract: PROBLEM TO BE SOLVED: To improve the insertability of a mount-side mounting bolt by providing an unit-side guide surface part increased in diameter toward the upper part on a unit-side bracket and providing a mount-side guide body consisting of a straight shaft part, a conical part under it and a lower end spherical part on the mount-side mounting bolt. SOLUTION: A unit-side guide surface part 56 formed in a reverse conical surface form gradually increased in diameter toward the upper part is provided on the upper side of the unit-side mounting hole 34 of a unit-side bracket 26. A mount-side guide body 58 is provided on the lower side of a male screw part 36 in a mount-side mounting bolt 32. The mount-side guide body 58 is formed of a straight shaft part 60 having a diameter slightly smaller than the male screw part 36, a conical part 62 gradually reduced in diameter from the straight shaft part 60 toward the lower part, and a spherical part 64 on the lower end of the conical part 62. According to this, the insert allowable range S for inserting the mount-side mounting bolt 32 to a unit-side mounting hole 34 is extended. Thus, the insertability of the mount-side mounting bolt 32 to the unit-side mount hole 34 is improved.
Patent JP-S63245988-A (JP)
Inventor: WATANABE TAKASHI
IPC: H01B3/30
Filed: 1987-11-20
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H01133676-A (JP)
Title: Plasma cutting method
Inventor: HOSHINO TADASHI
IPC: B23K10/00
Filed: 1987-11-20
Abstract: PURPOSE:To improve cutting capacity of a plasma torch by providing an after gas nozzle in the rear in the preceeding direction of the plasma torch and blowing off dross attached to the lower part of a cutting plane by a high-speed flow of after gas. CONSTITUTION:The after gas nozzle 28 is fitted to the plasma torch 10 by a fitting base 24 so as to be located backward slightly from a plasma arc 12 in the rear in the proceeding direction of the torch. At the time of cutting by the plasma torch 10, the after gas in accordance with material of a material 14 to be cut is allowed to flow at a high speed from the after gas nozzle 28 and while blowing off the dross attached to the lower surface of the cutting part, the plasma torch 10 is proceeded to cut the material 14 to be cut. By this method, recombination on the cutting part by the dross is eliminated and the cutting capacity of the plasma torch 10 can be enhanced.
Patent JP-H01135030-A (JP)
Title: Compound semiconductor device
Inventor: UEDA KAZUYOSHI
IPC: H01L29/06
Filed: 1987-11-20
Abstract: PURPOSE:To prevent the quality of the title capacitor device from being deteriorated upon soldering the device to a packaging substrate by providing a metal layer or an insulating film on the surface of a conductive layer of a via hole so as to cover the whole surface of the same therewith, the insulating film or the metal layer being incompatible with a soldering material. CONSTITUTION:A via hole 1a is provided such that it has an opening with its cross section tapered from the back side of a GaAs substrate 1 corresponding to a source upper electrode layer 6 and makes contact, in its top surface, with the source upper electrode layer 6. An inner conductive layer 9a and a back electrode layer 9 both gold-plated are formed respectively on the inside surface of the via hole 1a and the back surface of the GaAs substrate 1. Thereupon, the back electrode layer 9 is electrically connected to the source upper electrode layer 6 on the surface through the inner conductive layer 9a on the via hole 1a. Finally, a TiN film 10 is formed as a metal layer incompatible with a soldering material, on the inner conductive layer 9a of the via hole 1a. As a metal layer incompatible with a soldering material Ti or any insulating film such as SiO2, SiN films, instead thereof may be employed.
Patent JP-H05136252-A (JP)
Title: Semiconductor manufacturing device
Inventor: KOKUBU TAKASHI
IPC: H01L21/683
Filed: 1991-11-08
Abstract: PURPOSE:To fix different-sized wafers without changing a wafer presser ring so as to match a wafer size by turning said wafer presser ring to a length- variable arm. CONSTITUTION:A wafer 2 is mounted on a stage 4 which is dent-shaped toward its central part and the wafer 2 is pressed and fixed with an arm which changes the length from above. More specifically, to fix a 6 inch wafer, an arm 5 is arranged to change the length proper to press the 6 inch wafer where the outer peripheral part of the wafer is vertically pressed with the stage 4 and the arm 5. On the other hand, when it is necessary to fix a 5 inch wafer, the arm 5 is arranged to change its length proper to press the 5 inch wafer. At that time, since the arm 5 is slanted to align with the dent of the stage 4, this construction prevents the arm 5 from coming into contact with the stage 4 even if the arm 5 extends its length and presses the outer periphery of the wafer 2 vertically with the stage 4 and the arm 5.