baber/WOPTO huggingface dataset:
Patent JP-H06128027-A (JP)
Title: Ceramic composition for multilayer substrate
Inventor: SUNAHARA HIROBUMI
IPC: C04B35/195
Filed: 1992-10-14
Abstract: PURPOSE:To provide a ceramic composition for multilayer substrate, sinterable at a relatively low temperature, having small thermal expansion coefficient and dielectric constant and capable of decreasing the temperature-dependency of the dielectric capacitance of a capacitor formed in a multilayer substrate by a circuit pattern. CONSTITUTION:The objective composition is produced by adding <=20 pts.wt. of TiO2 as a subsidiary component to 100 pts.wt. of a cordierite-B2O3-SiO2 main component material composed of 40-85wt.% of cordierite, 10-40wt.% of B2O3 and 5-50wt.% of SiO2 and further adding <=10 pts.wt. (based on 100 pts.wt. of the main component material) of a subsidiary ceramic additive obtained by adding <=17wt.% of Bi2O3 and <=10wt.% of PbO to xBaO-yTiO2-zNdO3/2 (2.5<=x<=15; 52.5<=y<=70; 15<=z<=45; x+y+z=100).
Patent JP-2001125652-A (JP)
Title: Power-saving device
Inventor: USUI FUKATAKE
IPC: H02J3/00
Filed: 1999-10-25
Abstract: PROBLEM TO BE SOLVED: To prevent a surge voltage from being generated when the setting of a dropping voltage is switched. SOLUTION: When an operation knob of a manual changeover switch 24 is operated and rotated as shown by C, the left end parts of contact parts 40a and 40b provided at both ends of a movable contact piece 40 leave contacts 44a and 44b and the right end parts move to come into contact with contacts 46a and 46b with slight delay. During this period, contact parts 42a and 42b provided at both ends of a movable contact piece 42 are in contact with contacts 52a and 52b. The movable contact piece 40 is in contact with neither the contacts 44a and 44b nor contacts 46a and 46b momentarily in a switching operation process, but the movable contact piece 42 is electrically connected to the contacts 52a and 52b in the period and control coils 20 and 22 are held in an electrified state.  At this time, spark generation in the switching of the movable contact piece 40 is suppressed to generate a surge current from being generated, and stable power-saving effect can be obtained.
Patent JP-H03165400-A (JP)
Title: Non-volatile semiconductor integrated circuit
Inventor: NAGAI YOSHIKAZU
IPC: G11C17/00
Filed: 1989-11-24
Abstract: PURPOSE:To enlarge a level margin and to transfer data without missing a data load latch by providing a complementary MOS transfer gate between the data load latch and a memory cell array. CONSTITUTION:When a gate TGi is turned to an ON state, for the potentials of a bit line BLi and an input/output node NODEi, the levels are determined according to the program of a memory cell with a ground potential or a power supply voltage Vdd level as an arrival level. Namely, for the CMOS transfer gate TGi, the precharge arrival level to be transmitted to the line BLi is permitted until the voltage Vdd. When the NODEi of a flip-flop FFi is discharged on the side of the line BLi, the discharge arrival level is permitted until the ground potential. Thus, the level margin for the page data load latch to normally latch logic 1 data and logic 0 data is enlarged and the data can be transferred without fail.
Patent JP-H01146238-A (JP)
Title: Electron beam device
Inventor: MATSUZAKA TAKASHI
IPC: H01J37/141
Filed: 1987-12-02
Abstract: PURPOSE:To obtain an excellent operating characteristic and possibly control the projection magnification of electron beam easily by providing an auxiliary lens linking to a reduction lens between an irradiation optical system which projects the formation image on a sample, and controlling the reduction lens responding to the operation of the auxiliary lens. CONSTITUTION:The focal distance fc of an auxiliary lens 3 is made to have the relation fc>L to the interval L between the auxiliary lens 3 and aperture 1. As a result, the auxiliary lens 3 forms a virtual image of the aperture 1 at the electron gun side from the aperture position. Consequently, the aperture image formed at the virtual image point 4 is made as an object point, and controlled to form the image at the object point 5 of an object lens. In such a way, the projection magnification of the formation image of the aperture 1 can be converted while keeping the operational condition of the object lens constant. Furthermore, by setting the magnification of the auxiliary lens 3 adequately, the reduction lens 2 is made into a lens of short focus, the focal distance of the reduction lens 2 may be converted a little to the variation of the focal distance of the auxiliary lens 3, and the controlling property is improved.
Patent JP-H02148884-A (JP)
Title: Electronic component mounting land and formation thereof
Inventor: SATO SATOYUKI
IPC: H05K3/34
Filed: 1988-11-30
Abstract: PURPOSE:To correct deviation in soldering by providing recessed grooves 2 in an opposing pattern to each other at the central part of a conductor film in an electronic component mounting land comprising a pair of conductor films which are formed in a facing pattern on an insulating substrate. CONSTITUTION:Solder paste is applied on an electronic component mounting land 6. The amount of the paste applied on a recess part 2 is larger than the amount of the paste applied on an edge part 3 of three electronic component mounting land 6. Soldering is performed in a reflow furnace. The power of the solder paste 4 for attracting an electronic component 5 owing to surface tension at the recess part 2 of the electronic component mounting land 6 is stronger than the solder paste 4 which is applied on the edge part 3 of the electronic component mounting land 6. As a result, even if the electronic component 5 is mounted on the slightly deviated part on the edge part 3 of the electronic component mounting land 6, the electronic component 5 is attracted with the solder paste 4 applied on the recess part 2 of the electronic component mounting land 6 by the adhesion of the solder paste. The position of the component is automatically corrected.
Patent JP-H06318687-A (JP)
Title: Forming method for soi wafer
Inventor: AAMETSUTO BINDARU
IPC: H01L21/76
Filed: 1993-11-10
Abstract: PURPOSE: To form a thin silicon mesa on an SOI wafer by performing the wet etching of a device layer with an orientation (100) until it reaches an insulation substrate and performing the polishing stop of a nitride layer at the bottom of an opening by a low-temperature CVD treatment. CONSTITUTION: A device layer 200 that is directed in the orientation of <100> for forming a thin silicon mesa on an insulator uses KOH as an etching liquid and is etched to an oxide layer 110 through the opening of a temporary nitride layer 300. Then, a polishing opening with a sloped side wall by (111) surface of the device layer 200 that functions as an etching stop in side direction is formed. After the temporary nitride layer 300 is eliminated, a polishing stop nitride layer 355 with a controlled thickness is laminated on the bottom and the side surface of the opening. After that, a set of polishing stops for defining the thickness of the mesa of the device layer 200 remains at the bottom of the opening, thus polishing the silicon device layer 200.
Patent JP-H03162978-A (JP)
Title: Heat-sensitive type printing controller
Inventor: KAWAGISHI TOSHIYUKI
IPC: B41J5/30
Filed: 1989-11-22
Abstract: PURPOSE:To conduct an optimum printing control correspondingly to various types of heat sensitive paper by a method wherein a corresponding control table is read from an external memory means, and a printing means is controlled in accordance with the control data of the control table and the detection result of a detection means. CONSTITUTION:A detection means 31 detects a temperature of a printing head of a printing means 5 on which heat sensitive paper is set and sends the detection result to a CPU 7. On the basis of the detection result (e.g. information of 70 deg.C) of the detection means 31 sent from the CPU 7, a printing control means 14 reads the data of an 18 count conduction time corresponding to a temperature of 70 deg.C in a control table TB stored in a RAM group area and heats the printing means 5 for the 18 counts. In this control, the printing means 5 can make printing in an optimum state onto heat sensitive paper. In this manner, a printing control corresponding to various types of heat sensitive paper can be performed without the need for providing various types of control tables.
Patent JP-2000126080-A (JP)
Title: Toilet seat load weighing device
Inventor: KAWAMOTO YASUHIRO
IPC: A47K13/24
Filed: 1998-10-26
Abstract: PROBLEM TO BE SOLVED: To perform a precise weighing by providing a base, a load detecting means and a cover between a Western-style toilet and a sanitary flushing seat, measuring the total load quantity including the sanitary flushing seat, and subtracting the weight of the sanitary flushing seat from it to measure the weight. SOLUTION: A load detecting means 5 is provided between a base 1 and a cover 3, and a signal processing circuit 6 for processing the detection signal from a load detecting means 5 is built in a seat 7. When a person sits on the seat 7 and raises the feet, the weight of the person and the weight of the seat 7 are entirely added to the cover 3, and the right total value of the weight and the seat 7 can be detected by the load detecting means 5 provided between it and the base 1. Since the load with no person seated is equal to the weight of the seat 7, it is subtracted from the load with the person seated, whereby the weight of the person can be precisely measured.
Patent JP-H11124384-A (JP)
Title: Production of 3-cephem compound
Inventor: KAMEYAMA YUTAKA
IPC: A61P31/04
Filed: 1997-10-17
Abstract: PROBLEM TO BE SOLVED: To produce 3-halogenomethylcephem with industrial advantage that is useful as a starting substance for synthesis of 3-thiomethyl-cephem as an intermediate for antibiotic substance typified by cefazolin or cefatriaxon. SOLUTION: 7-Amino-3-halogenomethylcephem of formula I (X<1> is a halogen; R<1> is a benzyl bearing an electron-donative group on the phenyl ring or diphenylmethyl which may bear electron-donative group(s) on the phenyl group) is deprotected on the protected carboxyl group in the 4-position with a phenol derivative to give 3-halogenomethylcephem of formula II. This compound is reacted with a thiol of formula: R<2> S-M [R<2> is a (substituted) nitrogen-containing aromatic heterocyclic ring; M is H, alkali metal, alkaline earth metal] to give 3-thiomethylcephem of formula III.
Patent JP-H06146209-A (JP)
Title: Finish method of surface of resin pavement
Inventor: OZAKI MASAYOSHI
IPC: E01C13/00
Filed: 1992-11-13
Abstract: PURPOSE:To improve slide prevention property by applying thioxotropy polyurethane material which contains minute hollow balls which have specific diameter as the surface layer material on the surface of resin pavement which has recessed and projection sections of specific height or does not have them and exposing the hollow balls on the surface. CONSTITUTION:Polyurethane resin is applied by the predetermined thickness to cover the surface of concrete road, and recessed and projection finish having the height of 1 to 3mm is applied as required to prepare the surface of resin pavement. Next, silica like ultra minute particles is added on polyurethane resin to give thioxotropy. Then, minute hollow balls having particles diameter of 1mm or less such as alumina silicate are blended. This is applied on the surface of resin pavement to expose minute hollow balls on the surface. Consequently, it is possible to improve slide characteristics at the time of lubrication, maintain the surface recessed and projection pattern in the shape close to the original shape, and give soft feeling and durability.
Patent JP-H05117802-A (JP)
Title: High strength steel sheet for chassis
Inventor: YAMAZAKI KAZUMASA
IPC: C22C38/16
Filed: 1991-10-24
Abstract: PURPOSE:To provide a steel sheet for a chassis having excellent corrosion resistance and excellent fatigue strength of a weld zone. CONSTITUTION:This high strength steel sheet for a chassis consists of, by weight, 0.005-0.20% C, 0.005-1.0% Si, 0.1-2.5% Mn, 0.050-0.10% P, 0.001-0.010% S, 0.005-0.1% Al, 0.0005-0.0100% N, 0.10-0.50% Cu, 0.01-0.05% Nb, 0.1-0.50% Mo and the balance Fe with inevitable impurities. Since corrosion resistance is ensured by Cu, P and Mo and the softening of a weld heat-affected zone can be prevented by Nb and Mo, the thickness of chassis parts can be reduced.
Patent JP-H09129688-A (JP)
Title: Terminal connection structure of test board
Inventor: HIROFUJI MASAYUKI
IPC: G01R31/26
Filed: 1995-10-27
Abstract: PROBLEM TO BE SOLVED: To provide a terminal connection structure of a test board which reduces a weight and a volume of the test board, and which is easy to mount it to a test head. SOLUTION: A plurality of pin cards 1 are radially and vertically provided in a test head. A move pedestal 2 is connected to an upper end of the pin card 1 so as to be lifted up and down. A plurality of terminals 3 are fitted on to the move pedestal 2. A press-up block 4 has an arm 4A which is abutted from below the move pedestal 2. A board press 8 is guided by a mounting pin 7 and pivoted, whereby a test board 6 is mounted on a test head. The test board 6 is fixed to the test head with a detent screw 9. By driving a cylinder 5, the plurality of move pedestals 2 are collectively pressed up by the press-up block 4 and the plurality of terminals 3 are connected to the test board 6.
Patent JP-H11146537-A (JP)
Title: Grommet
Inventor: FUJISAWA ATSUSHI
IPC: H01B17/58
Filed: 1997-11-06
Abstract: PROBLEM TO BE SOLVED: To provide a grommet which simply realizes engagement to a through- hole and also assures sure sealing of the through-hole by reducing in size the engaging portion to the through-hole. SOLUTION: In a grommet which is integrally molded by the elastomer injection molding, with a wire harness laid through insertion into a through-hole formed on the glass panel and is mounted so as to close the through-hole on the glass panel, a rod portion 20 which is making flat the lower surface of the entire part and a column portion 30 which is projected toward the lower side from the internal position leaving a certain flat surface at the circumference of the lower surface of the end portion of the rod portion 20 and is being provided with an elastic projection continuous to the circumference direction at the side surface are provided, the molding is conducted to internally accommodate the predetermined length portion of wire harness within the rod portion 20 and a column portion 30,  the column portion 30 is pushed into the through- hole of the glass panel and the elastic projections 31a, 31b at the side surface of the column portion 30 are placed in close contact with the internal circumference of the through-hole and the entire part of lower surface is bonded to the glass panel surface with a bonding agent.
Patent JP-2001127261-A (JP)
Title: Ferroelectric memory
Inventor: HASEGAWA KAZUMASA
IPC: H01L21/8242
Filed: 1999-10-26
Abstract: PROBLEM TO BE SOLVED: To improve remaining polarization of a ferroelectrics capacitor by reducing the remaining stress present in a ferroelectrics thin film constituting the ferrolectrics capacitor. SOLUTION: A void is provided at a semiconductor substrate at the lower part of a ferroelectrics capacitor.
Patent JP-H08161538-A (JP)
Title: Automatic ticket vending machine
Inventor: KITAGUCHI MASANORI
IPC: H04B10/11
Filed: 1994-12-07
Abstract: PURPOSE: To provide the automatic ticket vending machine which is reducible in size since there is no wiring for control signals between a control part and respective processing units and free from the mixture of a noise signal with respect to the control signals, etc. CONSTITUTION: The control signals are sent and received between a control part 6 which is fixed to a housing 3 and controls respective processing units 12-k and the respective processing units 12-k which are constituted movably in the front-rear directions about the housing 3 and perform the series of processes of an automatic ticket vending machine such as the management of money and the issue of train tickets by a light signal converter 21-k which is connected electrically to the control part 6 and fixed to the housing 3 and a light signal converter 22-k which is fixed to each processing unit 12-k and electrically connected by using light signals.
Patent JP-H01144750-A (JP)
Title: Loop-back testing system for bearer dividing transmission
Inventor: FUNAE HIDEAKI
IPC: H04L69/40
Filed: 1987-11-30
Abstract: PURPOSE:To easily decide which point of plural channels a trouble is generated in by deciding the loop-back point of the channel with a loop-back code, which is detected from the respective channels, executing loop-back connection and executing a loop-back test. CONSTITUTION:For a station 21 (22) to request the loop-back test, the loop-back code is inserted in each designating channel by a loop-back code sending circuit 4 (14) and sent to a facing station 22 (21). In the facing station, when the loop- back code is detected from received data in each channel, which position the loop-back point is constituted in is decided per channel and the loop-back connection is executed. Then, a loop-back confirming signal is returned and a loop- back is established. By the establishment of the loop-back, the loop-back test is executed and the generating spot and cause of the trouble, etc., are retrieved. Thus, the decision of the trouble generating spot is made easy and the retrieving time of the trouble causes can be shortened.
Patent JP-H01145030-A (JP)
Title: Cooker
Inventor: KUROKI YOSHIHIRO
IPC: A47J43/046
Filed: 1987-11-30
Abstract: PURPOSE: To eliminate lumps in a short time even if a material to be cooked includes margarine, soft flour, etc., and make an efficient whipping by providing the inside bottom of a container with a rotary body and installing ribs erect near the rotary body. CONSTITUTION: In a cooker for whipping crepe materials including eggs, soft flour, margarine, etc., a removable container 12 is mounted on a main body 11 and a shaft 13 is held at the bottom of the container 12 and a rotary body 14 is fixed to the shaft 13. At the inside bottom section of the container 12, a plurality of ribs 18 are installed erect near the rotary body 14. Even if a material to be processed is crepe materials including margarine and flour, the material collides against the ribs 18 to be finely ground and a part of the material changes its direction after colliding against the ribs 18 to be caught in the rotary body 14 and the rest of the material circulates along the ribs 18 and then the two parts collide against each other. In this manner, the material to be processed is whipped efficiently and sufficiently.
Patent JP-H04179134-A (JP)
Title: Semiconductor chip with electrode
Inventor: OIDA MASAHIRO
IPC: H01L21/60
Filed: 1990-11-08
Abstract: PURPOSE:To improve the reliability of connection of a semiconductor chip by a method wherein in the semiconductor chip, metallic powder is applied on the pad of the electrode of the chip. CONSTITUTION:A semiconductor chip with a photoresist protective film 4 formed at a desired position thereon is prepared so that an Al electrode part 3 is constituted on a silicon substrate 1 having an SiO2 film 2. Au powder, which is cleaned with such an organic solvent as a trichloroethylene or the like and is used as metallic powder 8 for adhesion use, is previously arranged on a pad on the Al electrode and the powder is thermally fixed by pressure on the Al pad by an iron, whereby the semiconductor chip having an Au electrode pad is obtained. Thereby, the highly reliable semiconductor chip with the electrode for COB use can be obtained.
Patent JP-H04179181-A (JP)
Title: Manufacture of semiconductor laser device
Inventor: YURI MASAAKI
IPC: H01S5/00
Filed: 1990-11-08
Abstract: PURPOSE:To control an etching process accurately in depth so as to form a ridge uniform in shape and excellent in reproducibility by a method wherein a depletion layer is controlled in thickness by a reverse bias voltage. CONSTITUTION:A silicon nitride film 7 is formed on a part of the surface of a semiconductor surface which serves as a ridge region, an ohmic electrode 8 covered with the silicon nitride film 7 is formed on the peripheral part of the semiconductor, and an ohmic electrode 9 is provided onto all the rear of the semiconductor. Then, a current is made to flow between the ohmic electrode 8 at a positive potential and an electrolytic solution electrode 13 at a negative potential while the surface of the semiconductor is kept in contact with an electrolytic solution 10. At this point, a reverse bias voltage is applied between the ohmic electrodes 8 and 9 by another direct current voltage power supply. By this setup, a depletion layer is formed in the interface of a P-type AlGaAs layer 5 with an AlGaAs active layer 4. Elements such as Ga, Al and as constituting the surface of the semiconductor are dissolved as positive ions into an electrolytic solution by an electric field induced between the semiconductor and the electrolytic solution, so that etching proceeds. When the surface is etched to the depletion layer, positive charge is not supplied form the inside of the semiconductor, and etching is completed.
Patent JP-2001093679-A (JP)
Title: Electricity relay switch device capable of automatically lighting auxiliary lamp during lamp failure
Inventor: KUZUU MIKIO
IPC: H05B37/03
Filed: 1999-09-20
Abstract: PROBLEM TO BE SOLVED: To provide a relay switch device for automatically lighting an auxiliary lamp, when a lamp is out of order. SOLUTION: When a lamp will not light due to troubles, a sensor measures the flow of electricity, brightness of the lamp or heat. If the sensor and judge it to be a failure, electricity is fed to an auxiliary lamp to be lighted by combining the sensor and a microcomputer.
Patent JP-H03165979-A (JP)
Title: Method and device for laser beam machining
Inventor: IGARASHI TAKASHI
IPC: B23K26/064
Filed: 1989-11-27
Abstract: PURPOSE:To shorten the piercing time and to improve operability in passing through a piercing hole on a work by a laser beam by detecting the sudden change of frequency of a piercing sound generated on the inside of a laser beam nozzle by a sound sensor. CONSTITUTION:The sudden change of frequency generated at the time of passing through the piercing hole 31 by the laser beam LB on the work W positioned on a work table 11 is detected and a piercing hole passing through completion signal is outputted to an I/O unit 55. Further, the signal is transferred to a detection amplifier 53 and an ON signal is given to a laser beam oscillator 3 from an NC device 57 and in order to cut the work W by the laser beam LB, a microphone 49 for detecting the sound is provided on the inside of the laser beam nozzle 27 provided at the lower part of a machining head assembly body 13. The microphone 49 is connected to the detection amplifier 53 and the detection amplifier 53 and the laser beam oscillator 3 are connected by a signal cable 51 via the NC device 57, by which the change of frequency of the sound in the laser beam nozzle 27 can be detected regardless of material and thickness of the work W.