baber/WOPTO huggingface dataset:
Patent JP-H07300616-A (JP)
Title: Safety structure of refractory for gas blowing
Inventor: OUCHI TATSUYA
IPC: B22D1/00
Filed: 1994-04-28
Abstract: PURPOSE:To provide the structural body of a refractory for gas blowing having the simple assembly and enabling guarantee of the safety and the high durability by preventing the leakage of molten steel caused by the erosion of a brick in using. CONSTITUTION:The safety structure 10 of the refractory for gas blowing is obtd. by forming an upper gas permeable body 1 composed of the high refractorines gas permeable body at the part brought into contact with the molten steel in the upper surface and arranging an intermediate gas permeable body 3 of a dense quality refractory forming many slit-like through-holes and having high eroding resistance or a filter composed of low m.p. material, etc., at the lower part of the permeable body. By using this structure, the clogging of the through-holes and the melting of the filter by the molten steel occurs during operating, the gas blowing surface is closed and the back pressure is risen caused by the obstruction of gas flow and thus, the exchanging time of the porous plug for gas blowing can be informed and also, the porous plug can be used to the limit of the capacity thereof.
Patent JP-S59219041-A (JP)
Title: Power supply on/off system in data communication system
Inventor: NAKADA YUKIO
IPC: H04B10/80
Filed: 1983-05-27
Abstract: PURPOSE:To reduce the power consumption of a repeater by turning on a power supply of the repeater only when the terminal device is operated in the communication using an optical beam. CONSTITUTION:The power supply of a repeater 1 is turned on when the power supply of one terminal among plural terminal devices is turned on. While a terminal device transmits a data, the repeater 1 continues operation and a power supply section 8 of the repeater 1 is turned off when a prescribed time is elapsed while the power supply of all the terminal devices is turned off and no lighting is conducted from the terminal devices, thereby reducing the power consumption. Since no lighting is conducted when a transmission data is not obtained from the terminal even if the power supply of the terminal remains turned on, the power supply section 8 is turned off, but since the terminal detects no light detection from the repeater 1 immediately and light emitting is conducted, the power supply of the repeater 1 is turned on again.
Patent JP-2000284642-A (JP)
Title: Image forming device
Inventor: IMAIZUMI SHOJI
IPC: B41J2/525
Filed: 1999-03-31
Abstract: PROBLEM TO BE SOLVED: To shorten a copying time in an image forming device by which resist correction processing is performed. SOLUTION: A resist pattern detection sensor 324 detects a resist pattern formed on an endless belt and a resist correction part 406 arithmetically calculates a resist correction value. Based on the arithmetically calculated resist correction value, resist correction is performed to image data in an image processing circuit 205 so as to prevent the resist deviation of an image. A control CPU 400 controls to set timing that the resist correction value is updated in the midst of warming-up detected based on output from a fixing temperature sensor S6, just before a preheat mode detected by a timer, in the midst of a paper depleted state detected by a paper emptiness sensor S5, or when toner detected by a toner emptiness sensor S7 is supplied.
Patent JP-S5428005-A (JP)
Title: Correcting method of imbalance of fan having hollow shaft
Inventor: HAGIWARA NORIAKI
IPC: F04D29/04
Filed: 1977-08-03
Abstract: PURPOSE: To correct imbalance of a hollow rotational axis of fan, by setting balance rings to the shaft. 
     COPYRIGHT: (C)1979,JPO&Japio
Patent JP-H09276818-A (JP)
Title: Method for treating fly ash
Inventor: ITO ICHIRO
IPC: B09B3/00
Filed: 1996-04-15
Abstract: PROBLEM TO BE SOLVED: To conduct proper chemical treatment of fly ash by demonstrating the effect of heavy metal elution prevention of a heavy metal fixing agent stably, surely, and maximally. SOLUTION: The quantity of water for kneading is 30-60wt.% of fly ash. The chemical structure of the reaction product from a heavy metal fixing agent, heavy metals, etc., in the kneaded mixture depend on the quantity of the water; since the greater the quantity of water is, the less soluble the reaction product is, the elution of heavy metals can be prevented more strictly. The heavy metals are fixed effectively by the heavy metal fixing agent, and the elution of the heavy metals can be prevented surely with reduced consumption of the agent.
Patent JP-H04303906-A (JP)
Title: Transformer for high-brightness discharge-lamp triggering use
Inventor: MATSUI ATSUSHI
IPC: H01F27/32
Filed: 1991-03-30
Abstract: PURPOSE:To enhance dielectric breakdown strength by an interlayer winding operation, to surely inject and fill an insulating resin into a part between layers and to ensure a high-degree dielectric breakdown strength collectively with the interlayer winding operation. CONSTITUTION:Windings 51, 52 are constituted in such a way that a coil layer which has been wound in an aligned manner so as to be continued from one end side to the other end side in the axial direction on a bobbin part 531 between protruding pieces 532 and 533 is stacked via an insulating layer 54. The protruding piece 532 is provided with a slit 552. The slit 552 is formed so as to reach a position at the inner side by  h from the outermost circumferential face of the winding 52.
Patent JP-S61251964-A (JP)
Title: Graphic modifying device
Inventor: SHIBATA YUKIHIKO
IPC: G05B19/4093
Filed: 1985-04-30
Abstract: PURPOSE:To reduce the time and labor of numerically controlled programming by storing previously graphic information and a tolerance in a graphic information means and a tolerance information means, respectively, responding modifying information from an input means, modifying the graphic information on the basis of the tolerance and outputting a CAD drawing in light of the tolerance. CONSTITUTION:The graphic information and the tolerance suitable to said information are previously stored in a graphic information memory device 203 and a tolerance information memory device 207, respectively. Input devices 201 and a cursor 202 are used to activate a graphic modifying device 206. At this time an operator indicates a line to which he would like to add a tolerance and the reference point of graphic modification. When the value of the tolerance is inputted through a keyboard 201, the tolerance is outputted to an arithmetic unit 204 from the memory device 207, and is displayed on a display device 205. Simultaneously the graphic modification considering the tolerance is executed, and the CAD drawing for a numerically controlled program can be obtained. Thus the programing time can be shortened.
Patent JP-H10275980-A (JP)
Title: Manufacture of multilayer wiring board and multilayer wiring board
Inventor: TAKAHASHI TORU
IPC: H05K3/46
Filed: 1997-03-28
Abstract: PROBLEM TO BE SOLVED: To enhance the adhesion of a plated conductor layer to an interlayer insulating layer, by a method wherein a laser beam irradiates a prescribed place on the interlayer insulating layer, one part of the interlayer insulating layer is selectively decomposed thermally to form via holes and thereafter, a sandblast treatment is performed on the entire surface of a substrate, a plating treatment is performed to make the conductive layer adhere to the surface of the substrate and the conductive layer is formed into a wiring pattern. SOLUTION: Wiring patterns 2 are formed on a substrate 1, an interlayer insulating layer 3 is formed on these patterns 2, a high output laser beam selectively irradiates an arbitrary place on the layer 3 to thermally decompose, evaporate and voltatilize partially the layer 3 and via holes 4 are formed. Smears 5 formed on the bottoms and peripheral parts of the via holes 4 by this irradiation are removed by performing a sandblast treatment on the entire surface of the substrate.  This sandblast treatment is effective also to the removal of an inorganic fiber, which is exposed when the layer 3 is formed of an interlayer insulating composition containing the inorganic fiber and the via holes are formed, the surface of the layer 3 and the surfaces of the sidewalls of the via holes are roughened, the adhesive strength of a conductive layer can be increased in a plating treatment and the conductive layer, which is excellent in adhesion, can be formed.
Patent JP-H01267222-A (JP)
Title: Device with feed resumption means for image forming
Inventor: MURAMATSU HIDEO
IPC: B65H1/04
Filed: 1988-04-15
Abstract: PURPOSE:To contrive an reduction in process time by housing a form on which No.1 image has been copied, in a feed resumption tray which automatically set the dimension of the form at the time of multi-hand feeding mode and feed resumption mode, and thereby letting the feed of the form be resumed in order to form No.2 image in a copying machine enabling hand feeding by multi-mode. CONSTITUTION:A bundle of forms is rested on a movable guide 159 which both a lever 158 and a pick-up roller 157 elevated, multi-hand feeding mode is set up with the lever 158 pressed down so that double-side copying is actuated. All forms have No.1 image printed by an image forming section 102 so as to be housed in a feed resumption tray 58 once with a copied surface kept upward. The feed resumption tray 58 allows a form 81 which is fed in, to be automatically positioned at the center of the tray so as to be housed in by means of the combined action of contact detecting sensors 381 and 382 and side control plates 62 and 63. After No.1 copy has been completed, the feed of the form is resumed again for No.2 copying. This constitution thereby makes it possible to contrive an reduction in process time.
Patent JP-H08258007-A (JP)
Title: Chips discharger in rectangular two-sided wood planing machine
Inventor: KAWASAKI TOMOHIKO
IPC: B27G3/00
Filed: 1995-03-27
Abstract: PURPOSE: To discharge certainly chips outside a body without accumulating chips generated in cutting with a vertical planer barrel in a hood even without any dust collector. CONSTITUTION: When a material 27 is cut with a vertical planer barrel 10 by positioning a discharge opening 24a of a hood 24 which discharges chips 28 within a range of an upper surface 6a of a fixed table 6, since the upper surface 6a of the fixed table 6 is taken as a reference, scattered chips 28 are discharged directly outside a machine from the hood discharge opening 24a through an inside of the hood 24. When a height of the material 27 is higher than that of the hood discharge opening 24a, chips 28, cut with an upper side of a vertical planer edge 9 hit against an inclined surface 24b of the hood 24, are reflected downward under their own, and guided to be discharged to the hood discharge opening 24a by wind force of the vertical planer barrel 10.
Patent JP-2000286582-A (JP)
Title: Cooling device and electronic equipment
Inventor: YAZAWA KAZUAKI
IPC: G06F1/20
Filed: 1999-03-31
Abstract: PROBLEM TO BE SOLVED: To effectively cool a heat generating part that electronic equipment has. SOLUTION: A cooling device is provided with a closed space 3a that is connected to an electrical heating element 2 at a specific point, while a heat radiation means 7 is connected to a point that differs from the prescribed point, a rotary member 4 that is arranged at the closed space 3a rotatably and has a position close to the prescribed point, and a medium that is filled into the closed space 3a for adhering to a surface 4a of the rotary member 4 and at the same time is coagulated by cooling using the heat radiation means 7, while subliming through the heat from the electrical heating element 2.
Patent JP-S63260130-A (JP)
Title: Wafer treatment apparatus
Inventor: YAMAGAMI TAKASHI
IPC: H01L21/027
Filed: 1987-04-17
Abstract: PURPOSE:To make an apparatus compact and to improve the reliability and the yield rote of semiconductor elements, by providing a diaphragm, which covers an exhaust port and constitutes an exhausting flow path along the entire outer surface of a wafer at the lower side of the wafer, and uniformly dispersing negative pressure at the lower side of the diaphragm at the time of exhaustion. CONSTITUTION:A wafer 2 is sucked with vacuum on a spin chuck 3. Resist is dropped through a resist dropping nozzle 6. The wafer 2 is rotated at a high speed with a motor 4. The resist dropped on the wafer 2 is radially expanded uniformly along the direction of the radius of the wafer with eccentric force. At this time, gas in an applying cup 1 is exhausted through an exhaust port 1d. Negative pressure, which is yielded at the time of exhaustion, is uniformly dispersed at the lower side of the diaphragm 11. The exhaustion of the inside of the treating cup 1 is carried out through an exhaust flow path, which s formed along the entire outer surface of the wafer with the dispersed negative pressure. The exhausting speed in the treating cup is made uniform in this way, and the flow rate of exhaustion can be reduced. As a result, the apparatus is made compact and the reliability and the yield rate o+ semiconductor elements are improved.
Patent JP-2000282281-A (JP)
Title: Manufacture of gas diffusion electrode
Inventor: FURUYA CHOICHI
IPC: C25B11/03
Filed: 1999-03-31
Abstract: PROBLEM TO BE SOLVED: To provide a gas diffusion electrode improved in strength, electric conductivity, and electrode performance by the conventional means of hot press. SOLUTION: When a reaction layer material 1 for gaseous diffusion electrode is subjected to hot press at a temperature not lower than the melting point of polytetrafluoroethylene by the use of a press jig 2, a high-pressure press part 3 and a low-pressure press part 4 are formed in the reaction layer by using an uneven press jig 2 having a projected part 5 and a recessed part 6, respectively. When using a smooth press jig as the press jig 2, a mesh-like nickel lath material can be substituted for the projected part 5 and the recessed part 2. Further, it is preferable that, at the time of performing hot press, a stainless steel foil as a hard metal foil 7 is interposed between the reaction layer material 1 and the press jig 2 to control pressure distribution and form a variety of pressure distribution in the reaction layer.
Patent JP-H02274872-A (JP)
Title: Evaporator for ion plating
Inventor: IGUCHI MASAO
IPC: C23C14/32
Filed: 1989-04-14
Abstract: PURPOSE:To form a film deposited by evaporation at large amounts which is excellent in adhesive property by arranging a focusing coil for surrounding a vapor transfer route reaching a substrate from a crucible and arranging a focusing coil having small diameter around the outside layer of a hollow cathode and also providing a magnet to the undeposited surface side of the substrate. CONSTITUTION:In a vapor deposition device for ion plating, a focusing coil 8 is provided which surrounds a vapor transfer route reaching a substrate 1 from a crucible 3. A focusing coil 10 having diameter not larger than 1/2 of diameter of the abovementioned focusing coil 8 is arranged around the outside layer 7 to 1 of an HCD gun 4 utilized as a hollow cathode. The influencing force of a magnetic field exerted from an inclination is made smaller than a magnetic field exerted on the vapor transfer route. The injection direction of plasma beams 9 is decided for the surface of an evaporation source in the crucible 3. Furthermore, a coil or a magnet 11 which generates the lines of magnetic force parallel to the surface deposited by evaporation is provided to the undeposited surface of the substrate 1. The material deposited by evaporation is uniformly stuck.
Patent JP-2000282710-A (JP)
Title: Vibration control structure for tower structure
Inventor: KIMOTO KOICHIRO
IPC: F16F7/12
Filed: 1999-03-31
Abstract: PROBLEM TO BE SOLVED: To alleviate bending deformation in an axial direction of an entire tower and to prevent destruction and collapse of the tower by deforming an energy absorbing member against a tensile force and compression in the tower body to which a stress is applied in the largest extent, before destruction of a reinforced concrete of the tower body. SOLUTION: A sheath pipe 3 is built in a form of a skeleton at a predetermined location, together with reinforcing bars, and concrete as an RC skeleton 5 is placed. Thereafter, PC steel wires 4 are inserted into the sheath pipe 3, and they are strained, followed by filling grout 6 having viscoelasticity, particularly cement asphalt, into a portion between the sheath pipe 3 and the PC steel wires 4. A stress applied to the skeleton 5 at the time of an earthquake, i.e., compressive and tensile energy applied to one end and the other end of the skeleton 5 is absorbed in the axial direction of the grout 6, and by constituting the grout 6 between the PC wires 4 and the sheath pipe 3 of a viscoelastic body, energy caused by shear deformation of the PC steel wires 4 and the skeleton 5 can be absorbed by the grout.
Patent JP-H09255350-A (JP)
Title: Cutter device for glass plate
Inventor: BANDO SHIGERU
IPC: C03B33/027
Filed: 1996-03-22
Abstract: PROBLEM TO BE SOLVED: To provide a cutter device for a glass plate capable of eliminating the need for rotating cutters around the axis orthogonal with the cutting line forming surface of the glass plate at every forward movement and backward movement, eliminating the misalignment, etc., of the cutters at every forward movement and backward movement and forming the many glass plates at a high speed. SOLUTION: The cutter device 1 for the glass plates includes a stage 3 on which the glass plates 2 are placed, the cutter head 9 which has the cutter wheels for forming the plural cutting lines 5 and 6 in X- and Y directions on the glass plate 2 placed on this stage 3 and a moving device 10 which moves the cutter head device 9 back and forth rectilinearly in the X direction and Y direction on the glass plate 2.  The cutter head device 9 has a vertical moving device which lowers the cutter wheel disposed to orient the cutting edges in the X- and Y directions during the forward movement to press the cutter wheel to the glass plate 2 and rises the remaining cutter wheel disposed to orient the cutting edges in the X and Y directions during the backward movement B to release the contact with the glass plate 2 at the time of the forward movement A, and moves the respective cutter wheels vertically reverse at the time of the backward movement B.
Patent JP-S58210060-A (JP)
Title: 2-oxoazetidine derivative, its preparation and use
Inventor: OCHIAI MICHIHIKO
IPC: A61K31/495
Filed: 1982-05-31
Abstract: NEW MATERIAL:The 1-sulfo-2-oxoazetidine derivative of formula I [R1 is amino which may be acylated or protected; X is H or methoxy; R4 is sulfamoyl, group of formula -S-Y-Z (Y is alkylene or alkenylene; Z is lower alkanoyloxy, etc.), etc.], its salt or ester. EXAMPLE:(3R,4R)-4-[(Aminoethyl)thio]-3-[{[(2-amino-4-thiazolyl) (1-carboxy-1-methylethoxy)imono]acetyl}amino]-2-azetidinone-1-sulfonic acid. USE:Antibacterial agent and beta-lactamase-inhibiting agent. PROCESS:The compound of formula I can be prepared by the sulfonation reaction of 2-oxoazetidine derivative of formula II (R2 is acylated or protected amino), optionally followed by the removal of the protecting groups.
Patent JP-S59218754-A (JP)
Title: Method for forming bump of chip carrier
Inventor: SAKAMURA TOSHIHIRO
IPC: H05K3/34
Filed: 1983-05-26
Abstract: PURPOSE:To equalize the heights of bumps and the top surfaces of the bumps to the same plane by providing hole group having the prescribed volume at the position corresponding to the pad arranging position, placing a metal mask having a surface which is not wetted with solder, and filling solder paste. CONSTITUTION:An oxidized film to cover the entire surface is formed, a metal mask 18 which is not wetted with solder at all is accurately positioned and placed on the back surface of a chip substrate via pin holes 21 and the pins 20 of positioning jig 19. Solder molten to pad 7a on the chip substrate directly under pattern holes 14 can be readily draped. When solder paste 13 is coated on the mask 18, the paste 13 is fully filled in the hole 14. The substrate 1, the jig 19 and the mask 18 are heated by heating means such as an electric furnace, solder in the paste 13 is melted, and cooled. The solder is fusion-bonded to the pads 7a on the substrate 1, solidified to substantially spherical state to form a bump 8.
Patent JP-S58211205-A (JP)
Title: Sequence control device
Inventor: YODA KENICHI
IPC: G05B19/048
Filed: 1982-05-31
Abstract: PURPOSE:To change easily a unit, by constituting so that a memory unit and a control unit which are constituted separately can be attached and detached freely by a connector. CONSTITUTION:A memory unit 9 is constituted of a 1 chip CPU3' in which each memory and a CPU are contained. Also, as for a control unit 10, an inputting circuit 7 and an outputting circuit are formed as one body. These unit 9 and unit 10 are formed separately, and each of them can be attached and detached freely by connectors 11a, 11b. Accordingly, they can be changed easily by replacing the unit to be changed 9 or 10 only.
Patent JP-H05261884-A (JP)
Title: Electronic composing device
IPC: B41B27/00
Filed: 1992-03-19
Abstract: PURPOSE:To easily specify casting of a character group into a complicated formed region. CONSTITUTION:Shapes of a casting region CR of a character and a casting prohibited region PR thereof are respectively specified with a digitiser on a block copy BC. A region fetch arithmetic unit fetches a part wherein casting is not prohibited in the casting region CR as a castable region FR. The composing device casts a group of characters into the castable region FR.
Patent JP-H05262833-A (JP)
Title: Polyol containing dispersed polymer, its production, and production of polyurethane
IPC: C08L71/02
Filed: 1992-03-19
Abstract: PURPOSE:To obtain a polyurethane elastomer having excellent surface slipperiness and reduced stickiness. CONSTITUTION:The title polyol is obtained by polymerizing a vinyl monomer and an acrylate containing an organic group selected among stearyl, lauryl, polysiloxane and perfluoroalkyl in PTMG of a molecular weight of about 1000. A polyurethane is produced by reacting this polyol with PTMG, MDI and butadiene.
Patent JP-S5427762-A (JP)
Title: Detection circuit for variation in frequency
Inventor: IMAMURA TAKAYUKI
IPC: H03B1/00
Filed: 1977-08-03
Abstract: PURPOSE: To obtain a miniature and lightweight frequency variation detection circuit through MIC implementation. 
     COPYRIGHT: (C)1979,JPO&Japio
Patent JP-S63260237-A (JP)
Title: Transmission method for loop type network
Inventor: KATSUHARA JIRO
Filed: 1987-04-16
Abstract: PURPOSE:To improve the utilizing efficiency of a transmission line by dividing a station into plural groups and using an exclusive token for each group. CONSTITUTION:Groups using different protocols, that is, a 1st group (stations A-D) and 2nd group (stations a-d) use different tokens. Moreover, a token control station 8 is connected to a transmission line 2 by a drop cable 3, the token of both the groups is relayed and the timing sending both the tokens to the transmission line 2 is controlled. Thus, the transmission timing of the stations A-D and a-d of both the groups, that is, the occupied time of the transmission line 2 is controlled so as to be made alternate.