Patent GB-1111398-A (GB)
Title: Polymeric stannoic acid products
IPC: C07F7/22
Filed: 1966-01-21
Abstract: The invention comprises a polymeric condensation product containing at least two repeated groups of one of the structures <FORM:1111398/C3/1> where R and R1 are hydrocarbyl, R2 is hydrogen or methyl, R3 is hydrogen or hydrocarbyl, m is 0 or a positive integer, and q is an integer of at least 1, the radicals R2 in Formula (1) being the same or different when q is 2 or more. The products containing repeated groups of structure (1), (2) or (3) may be prepared from equimolar amounts of a hydrocarbyl stannoic acid and, respectively, a hydroxyalkanoic acid having from 2 to 10 carbon atoms, such as glycollic acid, a hydrocarbyl mercapto acetate or a hydrocarbyl - b  - mercapto propionate, and a monoalkyl ester of an alkanedioic acid having from 2 to 10 carbon atoms.  A compound of formulae <FORM:1111398/C3/2> where R is hydrocarbyl and R4 as shown, may be prepared by reacting 1 mole of stannoic acid, RSnOOHs where R may be alkyl or phenyl, with 2 to 2.5 moles of a compound having a formula such as HS(CH2)qCOOR1, corresponding to the formula of the product.  Specified compounds are: an alkanoic acid of from 2 to 18 carbon atoms, an alkenoic acid of from 3 to 18 carbon, benzoic acid, an o -hydroxyalkanoic acid of from 2 to 10 carbon atoms, glycollic acid, a hydrocarbyl mercaptoalkanoate, a monoalkyl ester of an alkenedioic acid having 4 carbon atoms in the alkenedioic acid group, a monoalkyl ester of an alkanedioic acid having from 2 to 10 carbon atoms in the alkanedioic acid group.  The product may be added as a stabilizer against the action of heat and/or light to a resin in an amount of 0.01 to 10% by weight, e.g. vinyl chloride polymer or copolymer.  Additional stabilizers such as a sulphur-containing compound (0.01 to 10% by weight of the resin) and a stabilizing metal salt (0.01 to 10%), and other compounds, such as a phenolic antioxidant (0.1 to 5%), an epoxy compound (0.1 to 5%), an organic phosphite (0.01 to 10%) or an ester or phosphate plasticizer may be added to the composition.ALSO:The invention comprises a polymeric condensation product containing at least two repeated groups of one of the structures <FORM:1111398/C2/1> where R and R1 are hydrocarbyl, R2 is hydrogen or methyl, R3 is hydrogen or hydrocarbyl, m is O or a positive integer, and q is an integer of at least 1, the radicals R2 in Formula (1) being the same or different when q is 2 or more. The products containing repeated groups of structure (1), (2) or (3) may be prepared from equimolar amounts of an hydrocarbyl stannoic acid and, respectively, an hydroxyalkanoic acid having from 2 to 10 carbon atoms, such as glycollic acid, an hydrocarbyl mercapto acetate or an hydrocarbyl-b -mercapto propionate, and a monoalkyl ester of an alkanedioic acid having from 2 to 10 carbon atoms.  A compound of formulae <FORM:1111398/C2/2> where R is hydrocarbyl and R4 as shown, may be prepared by reacting 1 mole of stannoic acid, RSnOOH (where R may be alkyl or phenyl) with 2 to 2.5 moles of a compound having a formula such as HS(CH2)qCOOR1, corresponding to the formula of the product.  Specified compounds are: an alkanoic acid of from 2 to 18 carbon atoms, an alkenoic acid of from 3 to 18 carbon atoms, benzoic acid, an o -hydroxy-alkanoic acid of from 2 to 10 carbon atoms, glycollic acid, an hydrocarbyl mercaptoalkanoate, a monoalkyl ester of an alkenedioic acid having 4 carbon atoms in the alkenedioic acid group, a monoalkyl ester of an alkanedioic acid having from 2 to 10 carbon atoms in the alkanedioic acid group.  The product may be added as a stabilizer against the action of heat and/or light to a resin to form a composition containing 0.01% to 10% by weight of the resin of the stabilizer. Halogen-containing vinyl or vinylidene resins are specified. Additional stabilizers such as a sulphur-containing compound (0.01 to 10% by weight of the resin) and a stabilizing metal salt (0.01 to 10%), and other compounds, such as a phenolic antioxidant (0.1 to 5% by weight), an epoxy compound (0.1 to 5%) and an organic phosphite (0.01 to 10%), may be added to the composition.