baber/WOPTO huggingface dataset:
Patent JP-H10317792-A (JP)
Title: Open and close support device for gate for vehicle
Inventor: NAKANO TATSUYA
IPC: B60J5/10
Filed: 1997-05-14
Abstract: PROBLEM TO BE SOLVED: To reduce worker's operation force required when a worker opens and closes a tail gate provided in an opening part for loading and unloading cargo in a rear part of a vehicle body by opening and closing the tail gate by a motor which incorporates a deceleration mechanism and can rotate forward and backward in such a manner that it can rise and fall. SOLUTION: An opening part 12 is closed by an upper springing door and a lower tail gate 14 so as to open it. A lower fringe part of the tail gate 14 is assembled on a lower fringe part of the opening part 12 so as to turn in the vertical direction. One end of a first link 22 is connected with an output shaft of a motor, and one end of a second link 23 is connected with the other end of the first link 22 and the other end thereof is connected with an outer surface of a side wall part of an inner panel of a vehicle body 11 so as to turn them. By rotating the motor, both links 22, 23 protrude linearly to turn the tail gate 14 downward and put it down so as to open a lower part of the opening part 12. When the motor is rotated in the reverse direction, the tail gate 14 turns and rises to close the lower part of the opening part 12.  Consequently, it is possible to reduce load for a worker.
Patent JP-S5551381-A (JP)
Title: Buried position measuring device for underground cable
Inventor: IGARASHI KENICHI
IPC: G01V3/08
Filed: 1978-10-12
Abstract: PURPOSE: To obtain the correct buried position of the underground cable by calculating the size of the undersired magnetic field caused by the return circuit current flowing another calbe in the same route and then giving correction to the calculated value.  
     CONSTITUTION: The position measuring current is flown to the core of the cable to be measured among plural pieces of calbes which are buried underground in parallel. The ground magnetic field is measured by search coil 1 of buried position measuring device 12, and then the point right above the buried position plus the buried depth are obtained including the error to deliver signal α. At the same time, return circuit current measuring device 15 measures the return circuit current flowing another cable via pickup coil 7 to deliver signal β. Furthermore, inter-cable space measuring device 16 delivers signal γ showing the result of measurement. The prescribed operation is given to these signals α, β and γ via operator 17 to obtain signal δ. With this signal δ, the correct buried position can be obtained with correction given to the error caused by the return circuit current. 
     COPYRIGHT: (C)1980,JPO&Japio
Patent JP-H08316134-A (JP)
Title: Exposing method
Inventor: OTA KAZUYA
IPC: H01L21/027
Filed: 1995-05-24
Abstract: PURPOSE: To perform alignment highly accurately by a die-by-die method by using an alignment sensor having a specified capture range. CONSTITUTION: The X coordinate of a search alignment mark GMX of the X axis on a wafer 6 and the Y coordinates of search alignment marks GMY1 and GMY2 of a Y axis are measured. The results of the measurements are processed, and the approximate arranging coordinates of shot regions ES1-ES21 on the wafer 6 are computed. Then, the alignment sensor of a TTR method and a two-luminous-flux interference method having the specified capture range is used from the shot region ES11 closest to the center of the arrangement of all search alignment marks, and the alignment and exposure of light in a die-by-die method are started. In the shot region to be exposed next time, the deviating amount of the positions of the reticle and the wafer is contained in the capture range with respect to the initial amount of deviation.
Patent JP-S613294-A (JP)
Inventor: TAZAKI HIROSHI
IPC: B65B11/00
Filed: 1984-06-18
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H0418976-A (JP)
Title: Evaporating and thickening device for waste photographic processing liquid
Inventor: KUREMATSU MASAYUKI
IPC: C02F1/04
Filed: 1990-05-15
Abstract: PURPOSE:To improve the evaporation rate by a pressure reduction and to reduce the size and cost of the device by the shortened route up to a condensing section by providing a heating section of a heat pump for heating and thickening a waste liquid continuously from the inside of a concd. liquid to a liquid surface or from the liquid surface into the concd. liquid. CONSTITUTION:The heating section (condenser) 6 of the heat pump 1 is used as a heat source for heating and evaporating the waste liquid by making effective use of the blowing-out force of the water by a water circulating pump 14 as a pressure reducing means and using this water after cooling the water by the refrigerant of the heat pump 1 to execute the evaporating and heating not only under the liquid surface but also under the liquid surface, by which the upward movement of the evaporating steam is expedited and the evaporation effect is greatly improved. The evaporated steam is cooled and condensed in a cooling section 7 and accumulates in the form of water drops in the bottom 8C of the steam condensing section 8. The condensed water is discharged through a valve 18 into a container 16 by the pressure reducing means. The container 16 is provided with an overflow port and the overflowing water by the condensed water is admitted by a pipe 36 into a condensed water tank 35 and is thereby recovered. The waste water is made into sludge on progression of the evaporating and thickening. The sludge is discharged from the lower part of a column 9.
Patent JP-S61283119-A (JP)
Title: Forming method for contacting hole
Inventor: YAGISHITA YUICHIRO
IPC: H01L21/28
Filed: 1985-06-07
Abstract: PURPOSE:To improve the moisture resistance and the reliability of a device by accumulating an insulating coating film with a smooth slope in a contacting hole, thereby reducing the improper step coverage in the formation of a wiring layer. CONSTITUTION:A contacting hole 3 is opened at an insulating film 2. Then, an insulating coating film is formed, for example, by coating SOG (Spin On Glass). The entire surface is reactively ion etched (RIE) without using a resist in this state. As a result, the SOG films on the bottom and the insulating film of the hole are removed to form the hole having a smooth slope on the side of the hole. An aluminum wiring layer is deposited on the hole formed in this manner to equalize the thickness of the wiring layer at sharp etch of the step, thereby obtaining a preferable contact of the step coverage.
Patent JP-S5249252-A (JP)
Title: Method for coting powder coating compounds
Inventor: TSUNODA MINORU
IPC: B05D7/22
Filed: 1975-10-16
Abstract: PURPOSE: To coat articles with a powder coating compound without the use of an expensive electrostatic coating apparatus or danger of dust explosion by coating a hollow article into which a coating gun is inserted, then by pulling the gun out of the article to cool and clean with compressed air. 
     COPYRIGHT: (C)1977,JPO&Japio
Patent JP-H02302414-A (JP)
Title: Production of rubber-modified thermoplastic resin
Inventor: NAKAGAWA TOMOJI
IPC: C08F287/00
Filed: 1989-05-18
Abstract: PURPOSE:To obtain the subject resin having excellent tinting, low-temperature impact strength, etc., by subjecting an aromatic vinyl compound monomer, (meth)acrylic acid ester and vinyl cyanide compound to graft copolymerization in the presence of a specific hydrogenated block copolymer. CONSTITUTION:30 to 100wt.% aromatic vinyl compound monomer and/or (meth) acrylic acid ester and 70 to 0wt.% vinyl cyanide compound are subjected to graft polymerization in the presence of a hydrogenated block copolymer which is a block copolymer comprising (A) (i) a polymer block of vinyl aromatic compound and (B) a random copolymer block of the component (i) and (ii) a conjugated diene or a block copolymer prepared by bonding (C) a polymer block consisting essentially of the component (i) to the block copolymer, has the weight ratio of the component (i) and the component (ii) of (5-50)/(95-50), 3 to 40wt.% total amounts of the component (i) of the blocks A and C in the whole copolymer, 15 to 80wt.% vinyl bond content of the part of the component (ii) of the block B and >=90wt.% saturated double bond of the component (ii).
Patent JP-H10297795-A (JP)
Title: Image processing device
Inventor: YAMADA HIROSHI
IPC: G03G21/00
Filed: 1997-04-28
Abstract: PROBLEM TO BE SOLVED: To omit labor of complicated removing work performed repeatedly by preventing failure to take a left paper by informing a user where a user is easy to fail to take out the paper in removing the paper at the time of jam. SOLUTION: As a jam condition is set by occurrence of paper jam, positions of left papers are displayed in a display mode in accordance with the number of taking out failures of paper in every left positions in an image processing device. For example, it is displayed by lighting/flashing in accordance with the number of taking out failures, in different colors in accordance with the failure numbers, in different sizes in accordance with the failure numbers, or in different patterns in accordance with the frequency of failure.
Patent JP-S5750580-A (JP)
Title: Manufacture of plastic ball containing metallic ball
Inventor: SAKAI KIYOSHI
IPC: B05D7/14
Filed: 1980-09-09
Abstract: PURPOSE: To form a synthetic resin layer around a metallic ball without eccentricity with a simple method by putting a heated metallic ball in powdered synthetic resin material and rolling it.  
     CONSTITUTION: Powdered synthetic resin material is put in a container of proper shape and size to a depth similar to the diameter of a metallic ball to be used and the container is shaken. A metallic ball heated to a highr temperature than melting point of the synthetic resin material is put in the container. By rolling the ball in the container, the synthtic resin material which is in contat with the metallic ball is sticks to the ball. Thus, a plastic ball coated in uniform thickness is obtained. 
     COPYRIGHT: (C)1982,JPO&Japio
Patent JP-S63291300-A (JP)
Title: Ram automatic inspection circuit
Inventor: SATO FUMIHIKO
IPC: G11C29/12
Filed: 1987-05-21
Abstract: PURPOSE:To execute functional inspection of RAM incorporated in a logical integrated circuit by the use of one input terminal, that is, without inputting various data by adding a ring oscillator and binary counter to the circuit. CONSTITUTION:An RAM automatic inspection circuit is composed of the ring oscillator ROSC which automatically produces data inputted to the RAM and binary counters BC1, BC2 and a comparation circuit COM which compares the input/output data of the RAM. Besides, a terminal which controls the ROSC is provided. The clock CLK produced by the ROSC is inputted to the binary counter BC1 and one part of the output data of this binary counter is supplied as the data of the RAM through a selection circuit COM and the other output data are supplied as address data of the RAM. Then the input/output data of the memory including the RAM is compared by the comparation circuit COM and according to the result of this comparation, the ring oscillator ROSC is controlled. Thus these operation can be adapted for a high integration circuit and the functional inspection of the RAM can be effectively executed.
Patent JP-S5458381-A (JP)
Title: Manufacture for semiconductor device
Inventor: MAEDA YOSHIHIRO
IPC: H01L21/316
Filed: 1977-10-19
Abstract: PURPOSE: To establish the separation band small in the leakage current, by eliminating the lamination deficiency, point deficiency and dislocation caused on the impurity layer with ion injection prior to the selective oxidation.  
     CONSTITUTION: SiO 2  2 and Si 3 N 4  and 3 are superimposed on the n type Si substrate. The n type ion injection layer 9 is formed by providing the resist mask 4. Next, the film 3 is etched from the mask 4, the resist is removed, SiO 2  6 is formed with selective oxidation with mask 3, constituting the element separation band. After that, deficiency is removed by high temperature treatment under N 2  atmosphere. With this method, the separation zone between element excellent and less in leakage can be formed 
     COPYRIGHT: (C)1979,JPO&Japio
Patent JP-S619116-A (JP)
Inventor: SEYA MINORU
IPC: H02H3/02
Filed: 1984-06-20
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S61284826-A (JP)
Title: Magnetic recording medium
Inventor: SHINOHARA KOICHI
IPC: G11B5/73
Filed: 1985-06-10
Abstract: PURPOSE:To reproduce signals with at a low error rate even if digital record and reproduction are executed at high-recording density by using a high-polymer film which has the surfaces different in the size of the surface projections formed of the pulverous particles and in which the inorg. pulverous particles forming the larger surface projections have no resin film and disposing a thin ferromagnetic metallic film on the surface of such film on the side having the smaller projections. CONSTITUTION:The PE terepthalate film 5 is different in the roughness of the surfaces formed of the pulverous particles 6, 7 and particularly the pulverous particles 7 contributing to the formation of the larger surface projections are required to be of, for example, spherical ZnO and to be projected in the state having no resin films. Such film is obtd. by subjecting the film which is obtd. by extruding polyesters respectively separately contg. pulverous particulate SiO26 and ZnO7 having different diameters by a co-extrusion and stretching the extruded film to etching on the plane inclusive of the ZnO7 to expose the plane inclusive of the ZnO7. The thin ferromagnetic metallic film 8 is a Co-Ni-O film and is obtd. by a diagonal vapor deposition method.
Patent JP-S63291376-A (JP)
Title: Earth for communication
Inventor: NAKAI TAKASHI
IPC: H01R43/00
Filed: 1987-05-22
Abstract: PURPOSE:To improve the electric conductivity around an earth bar due to the water absorbing property, reduce the earth resistance, prevent the corrosion of the earth bar, and improve the workability by burying a high-absorption polymer containing water around the earth bar. CONSTITUTION:An earth bar 1 is inserted into the ground 4, and a high-water absorption polymer 3 to form the earth. A polyacrylate material, a maleic anhydride material, and a polyethylene oxide material, which have the absorption rate of 100 or more and are not corroded, are used for this polymer 3. The polymer 3 is formed into fibers, tapes, or powder. These materials of the polymer 3 have a good hydrophilic property, wet the surrounding of the earth, have good adhesion due to gelatinization, and can be easily generated by merely being mixed with water. The earth resistance is thereby reduced for a long time, corrosion is prevented, and the workability is improved.
Patent JP-H09310965-A (JP)
Title: Show case
Inventor: WAKINISHI HIROSHI
IPC: F25D23/02
Filed: 1996-05-21
Abstract: PROBLEM TO BE SOLVED: To enable a show case having openings at a front surface and at both right and left sides of a storing chamber to be adapted for all conditions of mounting. SOLUTION: Each of three openings formed at a front surface and at both right and left sides is provided with a door, respectively, by a hollow section 26 where supporting plates 25 are inserted into both right and left corners of a front surface; front supporting columns 28 having grooves 27 into which gaskets 24 are inserted at both right and left corners of a rear surface; and a rear supporting column 29 having a groove section 27 into which the gasket 24 is inserted at one side surface thereof. Accordingly, it is possible to take out an item from three directions and it can be adapted for all mounting conditions.
Patent JP-S5915975-A (JP)
Inventor: TADA SHIYOUEI
IPC: G09B11/10
Filed: 1982-07-19
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S6019085-A (JP)
Inventor: MATSUMOTO TOSHIYUKI
IPC: B07C5/36
Filed: 1983-07-12
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S6474320-A (JP)
Title: Crossed type roller bearing
Inventor: MITSUSHIERU OREN
IPC: F16C33/58
Filed: 1988-05-23
Abstract: PURPOSE: To prevent the occurrence of jamming and wearing of rollers by making an angle formed between tow raceways of an outer ring smaller than 90 degree so as to achieve, between the crown region of each roller and the raceway against which the crown region bears, a contact distributed along a segment of a circle substantially centered on the axis of the bearing. CONSTITUTION: A crown region 11 of each of rollers 9a, 9b contacts, along a portion of a circumference, raceways 3, 4 disposed at a certain distance from a common circular edge portion 8 between raceways 6, 7 on an outer ring 2. As a consequence, the contact between the crown region 11 and the raceways 3, 4, 6, 7 occurs along a line but not at a point. Thus, abrasion caused by a contact pressure and a slip is remarkably reduced. Further, since the contact portion is along a circumferential direction with respect to an axis of a bearing, i.e., since it is likely to take a position inclined between two rings 1 and 2, the contact portion is distributed along a desired direction in respect to the guide of the rollers 9a, 9b, thus high precision and smoothness are obtained without idling occurring even after a long period of time of use.
Patent JP-S5749276-A (JP)
Title: Manufacture of semiconductor pressure sensor
Inventor: OONO KATSUHIRO
IPC: H01L29/84
Filed: 1980-09-09
Abstract: PURPOSE:To contrive mass production, by a method wherein a wafer provided with diaphragms and a wafer to be a base are welded on heating under a vacuum, sandwiching BSG, in order to form vacuum chambers before being divided into chips. CONSTITUTION:The back surface of an Si wafer in which a pressure-sensitive component has been diffused is etched in order to provide a plurality of diaphragms. Separatey therefrom, impalpable powder of BSG is applied to one surface of an Si wafer 4 having an arbitrary thickness and heated at 850-900 deg.C to form a glass layer 5 having a thickness of less than 10mu. The wafer surface on the diaphragm recess side and the wafer surface on the glass layer side are piled one upon another and heated to more than the transition temperature of glass in an oven under a vacuum more than 10<-3>mm.Hg in order to join them together so that vacuum chambers 6 are formed inside the diaphragm. Then, the wafer surface on the diaphragm side is metallized with electrodes 3, and the joined wafer is divided into chips by means of dicing at positions 7. Then, bonding of lead wires and packaging are performed. By said constitution, it is possible to mass-produce a highly reliable device.
Patent JP-S5460364-A (JP)
Title: Manufacture of polyolefin resion foam
Inventor: WATANABE SEISABUROU
IPC: B29C48/395
Filed: 1977-10-21
Abstract: PURPOSE: To manufacture a low-density non-crosslinked polyolefin foam having uniform closed cells and improved foam molding stability, by adding small amounts of a saturated fatty acid ester and a fatty acid (amide) to a base resin.  
     CONSTITUTION: (A) A non-crosslinked polyolefin resin is incorporated with (B) 5W60 wt.% of a volatile organic blowing agent, e.g. dichlorotetrafluoroethane, etc. having a boiling point of -42W25°C under ordinary pressure, (C) 0.05W10 wt.% of an ester of a 12W22C saturated fatty acid with a polyol, (D) 0.005W3 wt.% preferably 0.15W2wt.% of a fatty acid and/or fatty acid amide, e.g. stearic acid amide, etc., and (E) 5 wt.% or less of a finely powdered compound having a higher melting point than that of the base resin at high temperature and pressure, then extruded and foamed in a low-pressure zone.  
     EFFECT: Uniform closed. cells can be obtained without reducing the cell dimensions considerably even in the presence of a high-melting compound tends to make cells small. 
     COPYRIGHT: (C)1979,JPO&Japio
Patent JP-S5649800-A (JP)
Title: Grease composition for brake or clutch
Inventor: ISHIHARA MASATOSHI
IPC: C10N20/04
Filed: 1979-09-29
Abstract: PURPOSE:To provide the titled compsn. for automobile, which exhibits excellent lubrication and rust-inhibiting performance, consisting of a base oil such as polyoxyalkylene triol, a thickener such as lithium 12-hydroxystearate, a rust inhibitor composed of a specified Ca salt and other additives. CONSTITUTION:The base oil is composed of (A) a polyoxyalkylene triol (I) having an average MW of 200-6,000 (wherein K is 1-5; m and n are 2-5; X and Y are positive integers, provided that either one of X and Y is zero, when the residue expressed by the formula II is identical with the formula III) alone, or (B) composed of the component (A) in admixture with at least one member selected from a polyoxyalkylene monoalkyl ether, having an average MW of 300-27,000 expressed by the formula IV (wherein K, m, n, x, y have the meaning as set forth above) and a polyoxyalkylene diol having an average MW of 200-6,000 and expressed by the formula V (wherein l is 2-5; m, n, x, y have the meaning as set forth above). The grease compsn. is composed of (A) or (B) with a thickener composed of lithium 12-hydroxystearate, a rust inhibitor composed of a calcium salt of a sulfonic acid, an antioxidant and an antioxidizing aid.
Patent JP-S62283939-A (JP)
Inventor: JIYOOJI KONSUTANTEIN BURITASU
IPC: C07C67/00
Filed: 1987-05-25
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H0425079-A (JP)
Title: Optical semiconductor build-up chip
Inventor: TASHIRO YOSHIHARU
IPC: H01L31/12
Filed: 1990-05-16
Abstract: PURPOSE:To reduce optical crosstalk by building up a semiconductor light emitting element array and a semiconductor light receiving element array so as to face each other by means of bumps made of In material, permitting the bumps to fix the positions of the light emitting element and the light receiving element and to supply electricity to the light receiving element or the light emitting element and permitting the bumps to have the prescribed thickness. CONSTITUTION:Indium bumps 5 and 6 are formed on both light emitting and receiving element chips, one bump is made of indium, having a diameter of 50mum and a thickness of 2.5mum and the bumps are arranged surrounding the elements. For aligning the light emitting element 3 and the light receiving element 4 formed on each chip surface facing each other, light having a wavelength of 1mum is used to permeate a substrate (GaAs substrate). The space between the chips is approximately 2mum, deviation is 2mum or less and the widening of the bumps caused by the press-contact of the bumps is 2mum or less after the build-up. The used In can be brought into press-contact at the room temperature and since heat is not added as fusing, etc., the device characteristics are not affected by the heat. When the space between the arrays is narrow as 5mum or less, the bumps do not short by the leakage of the melted bumps. The optical crosstalk of the semiconductor build-up chip does not cause troubles to a lens in practical use.