baber/WOPTO huggingface dataset:
Patent JP-H02176393-A (JP)
Title: Waste heat recovery equipment
Inventor: KINOSHITA TOMOHIRO
IPC: F27D17/00
Filed: 1988-12-27
Abstract: PURPOSE:To improve a thermal efficiency by collection as well as waste heat recovery of heat recovery medium, which are effected by a condensor, by a method wherein the outlet port of a water feeding device, which communicates with a separated water reservoir formed below a moisture separator, is made to communicated with the inlet port of feed water of a heat recovery device. CONSTITUTION:High-temperature exhaust gas, containing moisture, arrives at a heat recovery device 3 and heat exchange is effected in the recovery device 3 between the exhaust gas and feed water. The exhaust gas is cooled by a condensor 5 to a temperature lower than a saturating temperature further and the moisture in the exhaust gas becomes water drips. The exhaust gas, containing the water drips, arrives at a moisture separator 6 to remove the water drips while the water drips are sent into a feed water processor 9. Then, the water drips are deacidified to regulate the quality thereof in pH value and the like so as to be capable of being utilized for feed water for a boiler and, thereafter, are sent into the heat recovery device 3 as feed water, then, feed water flows through the heat recovery device 3 to retrieve the heat of the exhaust gas. According to this method, waste heat recovery may be effected by low-temperature feed water and the thermal efficiency of the title device may be improved. Further, efficient collection of the water drips can be effected by the condensor and the moisture separater.
Patent JP-2001148760-A (JP)
Title: Sheet transfer device
Inventor: YAMAUCHI AKITO
IPC: B65H3/06
Filed: 1999-11-19
Abstract: PROBLEM TO BE SOLVED: To effectively prevent the variation of the speed of a sheet. SOLUTION: This device is equipped with a handling means 1 which has a feed member 1a arranged rotatably and a separation member 1b arranged in contact with the feed member 1a and handles and sends out stacked sheets S one by one, an image processing means 2 which faces the sent-out sheets S and conducts image processing between the sheets S, a transport means 3 which has a transport member 3a arranged rotatably and passes and transports the sheet S sent out of the handling means 1 to the image processing means 2, a driving means 4 which drives the feed member 1a and transfer member 3a to rotate, and a switch means 5 which switches on/off the transmission of the driving force from the driving means 4 to the feed member 1a.  The switch means 5 transmits the driving force from the driving means 4 to the feed member 1a until the sent-out sheet S passes through the handling means 1 and halts the transmission of the driving force after the sent-out sheet S passes through the handling means 1.
Patent JP-2000151038-A (JP)
Title: Printed circuit board structure
Inventor: TANAKA MASAO
IPC: H05K1/14
Filed: 1998-11-05
Abstract: PROBLEM TO BE SOLVED: To obtain a printed circuit board structure which can prevent undesirable separation or cracking of printed circuit boards, disconnection or peeling off of a copper foil pattern caused by cracking when the printed circuit boards are divided. SOLUTION: As illustrated, when a copper foil pattern having signal lines formed therein is provided on one surface (b) (signal line) of each printed circuit board, a solid pattern is provided on the other rear side (a) (solid pattern surface) with the copper foil not being etched. As a result, it can be avoided that the printed circuit boards are undesirably separated or cracked when divided.
Patent JP-H04203048-A (JP)
Title: Wall member
Inventor: CHIBA FUMIHIKO
IPC: E04B2/96
Filed: 1990-11-30
Abstract: PURPOSE:To enable a curved wall surface to be easily composed by fitting a plurality of face bars on each one surface or both the surfaces of truss-shaped framework bodies, and by bending aggregates for forming the framework bodies. CONSTITUTION:Aggregates are combined with each other, and arbitrary-wall-- surface-shaped framework bodies A are formed, and on each one surface of the truss-shaped framework bodies A, a plurality of face bars 14 are fitted. Then, a wall surface with each one side vertical-member 10 and other side vertical members 11 curved in the longitudinal direction and curved in the vertical direction, is set. Besides, horizontal members 12 are curved, and the wall curved in the horizontal direction is set, and is erected between a floor side building structural-body 5 and a roof side building structural-body 6. As a result, the wall surface curved two-dimensionally and three-dimensionally can be easily formed.
Patent JP-H03190234-A (JP)
Title: Manufacture of semiconductor device
Inventor: OTA RYUSUKE
IPC: H01L21/3205
Filed: 1989-12-20
Abstract: PURPOSE:To bore a fine contact hole, and to form a wigging electrode, in which no disconnection is generated, by forming a metallic film for forming the contact hole onto a substrate in approximately the same thickness as an insulating film without removing an etching mask, applying a resist up to flattened thickness and ashing and removing the resist until the metallic film is exposed. CONSTITUTION:An insulating film 2 and an etching mask 2 are laminated successively onto a metallic film 1 as a lower layer, a contact hole 4 is bored to the insulating film 2, and a metallic film 5 for shaping the contact hole is formed onto a substrate in approximately the same thickness as the insulating film 2 without taking off the etching mask 3. A resist 6 is applied up to flattened thickness, and removed through ashing until the metallic film 5 is exposed. The exposed metallic film 5, the resist 6 remaining in the contact hole and the etching mask 3 are taken off. A metallic film 7 as an upper layer is formed onto the insulating layer 2 and the metallic film 5 remaining in the contact hole 4. Accordingly, the fine contact hole 4 is bored in the sufficiently thick insulating film 2, and the metallic wiring film 7 in which no disconnection is generated can be formed.
Patent JP-H04204026-A (JP)
Title: Touch sensor
Inventor: KAMIYANAGI KATSUMICHI
IPC: G01L1/18
Filed: 1990-11-30
Abstract: PURPOSE:To sufficiently protect a pressure sensing part and a sensor cell itself by covering from an upper part of the sensing part with a surface member of rubber, arranging a metallic flexible foil on the sensing part, coating a resin sheet over the metallic foil and further applying a silicone grease. CONSTITUTION:A resin sheet 5 covers the whole sensor from above a pressure sensing part 2, with a relatively flexible metallic foil intervened. A silicone grease 7 is applied to a part of the sheet 5 corresponding to the upper part of the pressure sensing part 2. A surface member 8 of rubber is further provided to cover tone sheet 5 from above the grease 7. In the touch sensor of this constitution, the friction force between an object can be enhanced by the member 8, and at the same time, the shock on the sensor cell 1 and the pressure sensing part 2 can be buffed. Moreover, the sliding property is gained between the member 8 and the sheet 5 by the grease 7. The presence of the foil 6 can sufficiently restrain the sheet 1 from being broken or the pressure sensing part 2 itself from being detached from the cell 1.
Patent JP-H04204590-A (JP)
Title: On-vehicle navigational device
Inventor: TSUCHIYA MANABU
IPC: G08G1/0969
Filed: 1990-11-30
Abstract: PURPOSE:To display present positions of all vehicles on a properly scaled map by providing a device grasping the present position information of a self-vehicle and other vehicles and automatically calculating the center position and scale factor so that all vehicles can be displayed in the display range. CONSTITUTION:Present positions of a self-vehicle and other vehicles are inputted into a display range setting device 3, and the distance component (x4-x2) in the east- west direction between position coordinates P2(x2, y2), P4(x4, y4) of vehicles most apart in the east-west direction and the distance component (y1-y4) in the north-south direction between position coordinates P1(x1, y1), P4(x4, y4) of vehicles most apart in the north-south direction among the position coordinates P0(x0, y0) of the self-vehicle and position coordinates P1(x1, y1) P2(x2, y2) P3(x3, y3), P4(x4, y4) of the other vehicles are calculated respectively. The coordinates of the display center position are set to (x4+x2)/2, (y1+y4)/2, and the lowest scale factor among the scale factors which can include the distance components (x4-x2), (y1-y4) is selected and set for the display scale. The display center position and scale factor set by the device 3 are applied to a display control device 9 and also outputted to a display device 8 together with the necessary map data read out from a map data memory device 7, and the present positions all vehicles are displayed.
Patent JP-H04308283-A (JP)
Title: Method of dyeing polyamide base body
Inventor: RARII SHII KERII
IPC: D06P1/58
Filed: 1991-12-13
Abstract: PURPOSE: To provide a method for dyeing a polyamide substrate comprising first printing the polyamide substrate in a predetermined pattern by using a printing paste containing an acid-type dye and an anionic resist followed by coating or blotch printing the resultant substrate with a fiber-reactive dye and then steaming, alternatively, first coating or blotch printing the polyamide substrate with the fiber-reactive dye, to effect multicolor dyeing with fine distinct color patterns. CONSTITUTION: This method for dyeing a polyamide substrate comprises the following process: the polyamide substrate (in the form of a polyamide carpet) is first printed with a printing paste as a combination of an anionic resist compound (pref. a sulfonated condensate of a phenol or naphthol and on aldehyde) with an acid-type dye (e.g. an acid dye, direct dye) in a predetermined pattern followed by coating or blotch printing the resultant substrate with a fiber- reactive dye (e.g. of vinyl sulfone type) and then steaming to fix the dyes, alternatively first coated or blotch printed with the fiber-reactive dye to effect multicolor dyeing of the polyamide substrate with fine distinct color patterns with no blurring or mixing of the colors between the printed and nonprinted portions of the substrate.
Patent JP-H08155358-A (JP)
Title: Automatic coating method and device therefor in concrete pole
Inventor: TSUJI KATSUMI
IPC: B05B3/18
Filed: 1994-12-06
Abstract: PURPOSE: To mechanize coating operation, to eliminate inhalation of thinner by automating the operation, to improve the work efficiency without injuring the operator's health, to make the working environment more pleasant and good for the health because a paint is not scattered about and to conduct uniform and good coating. CONSTITUTION: A surface-polished concrete pole 1 is placed on a rotating device 2 arranged respectively on the bottom end 1a and tip 1b of the pole in the longitudinal direction of the pole, the bottom end is made flush with the tip, a coating box 16 free to move vertically above the rotating device is lowered to cover the full length of the pole 1, and the pole 1 is rotated by the rotating device. A paint is sprayed from a spray nozzle 26 fixed to a trolley 18 moving in the longitudinal direction in the coating box 16 to coat the pole.
Patent JP-H10168024-A (JP)
Title: Purification of acetic acid
Inventor: MIURA HIROYUKI
IPC: C07C51/12
Filed: 1996-12-11
Abstract: PROBLEM TO BE SOLVED: To efficiently obtain acetic acid useful in petrochemical industry and organic chemical industry by a simple method by introducing ozone into a distillation column and distilling acetic acid containing impurities while bringing ozone into contact with the acetic acid. SOLUTION: In the method for purifying acetic acid containing organic halides (n-butyl iodide, etc.) obtained by a carbonylation reaction of one or more selected from among methanol, methyl acetate and methyl ether and carbon monoxide in the presence of a catalyst containing a metal of the group VIII (e.g. rhodium catalyst in 200-1,000ppm in a reaction solution), 5-20wt.% of methyl iodide in the reaction solution and water at 150-250 deg.C under 2-30a atmospheric pressure, >= about 1ppm of ozone based on the weight of the acetic acid to be treated is introduced into a distillation column and the acetic acid is distilled while bringing ozone into contact with the acetic acid containing impurities in an ordinary retention time to give high-purity acetic acid useful as a fundamental chemical.
Patent JP-H02175358-A (JP)
Title: Washer fluid for vehicle
Inventor: TAMADA SACHIKO
IPC: B60S1/46
Filed: 1988-12-27
Abstract: PURPOSE:To introduce aroma into a car compartment without providing aromatic in the car compartment by mixing a detergent mixed in a solvent and a material containing volatile component and emitting aroma into a washer fluid. CONSTITUTION:A tank 2 in which washer fluid is reserved is provided in the engine compartment 1 of a motor car, and the washer fluid in the tank 2 is sprayed on a frontshield 3 from an injection nozzle 4 provided in front of the frontshield 3. The washer fluid is formed by mixing a detergent mixed in a solvent and a material containing volatile component and emitting aroma into the washer fluid. When the washer fluid is sprayed, a blower 6 ventilating the interior of the motor car is operated in fresh air inlet mode at the same time, the fresh air together with aromatic component emitted from the washer fluid is sucked into a car compartment through an air supply and exhaust port 7.
Patent JP-H01170530-A (JP)
Title: Construction for press die
Inventor: ENOMOTO TAKEYASU
IPC: B21D28/24
Filed: 1987-12-25
Abstract: PURPOSE:To improve operation efficiency by holding a punch elastically on a press base through an elastic member and, on one hand, providing a supporting member which supports the punch deforming at the lower part at a prescribed height. CONSTITUTION:In an aperture work W0 having an aperture 16, an aperture edge flange 17 standing on the circumferential edge of the aperture 16 is formed. In this case, the aperture 16 is agreed with each of an upper and a lower formed hole 14, 15, the work W0 is held between the upper die 10 and the lower one 11, the upper and the lower die 10, 11 are descended against a return spring 20 to press the work W0 against the upper surface 12 of the punch 8. In this time, an urethane spring 24 has special properties maintaining standardization against the pressing force required for raising and forming the aperture edge flange. The urethane spring 24 is free from contraction deformation and the punch 8 is held elastically at an upper place higher by alpha than a step part 23. Therefore, if the work W0 is descended down to the bottom dead center, both upper and lower die 10, 11 form the aperture edge flange 17 standing along the circumferential surface 13 of the punch 8.
Patent JP-H11163280-A (JP)
Title: Method for simulating ferroelectric
Inventor: TAKEO MASATO
IPC: G06F19/00
Filed: 1997-12-02
Abstract: PROBLEM TO BE SOLVED: To enable to accurately perform a ferroelectric simulation, by calculating polarization inversion amount per unit time by subtracting product of the polarization inversion amount and a second polarization inversion speed factor from product of non inversion polarization amount and first polarization inversion speed factor. SOLUTION: First, rectangular wave pulse of pulse voltage is applied to a ferroelectric capacitor and a curve of variation with time of polarization amount is obtained by measurement (Pa1). Also, polarization inversion amount per unit time when rectangular wave pulse of pulse voltage is applied to the ferroelectric capacitor is integrated with time to obtain a curve of variation with time according to the ferroelectric simulation (Pa2). These operations are repeated with changing variables until the difference between the curve of variation with time of polarization amount according to the measurement and that according to the ferroelectric simulation reaches the specified value or smaller. Then a ferroelectric simulation is performed to calculate polarization inversion amount per unit time corresponding to the voltage applied to the ferroelectric capacitor.
Patent JP-H04198835-A (JP)
Title: Four-wheel test bench apparatus
Inventor: YAMAMICHI YUJI
IPC: G01M17/00
Filed: 1990-11-29
Abstract: PURPOSE:To execute the test corresponding to a road surface state of every kind by driving a tire rotating contact roller by a three-phase winding type induction electromotor and connecting a voltage regulator to the electromotor on the primary side thereof and connecting a variable resistor and the winding resistor of a permanent magnet iron core thereto on the secondary side thereof. CONSTITUTION:The test of the characteristics to different road surfaces is executed by adjusting the slide of the max. torque point by adjusting a variable resistor 8 on a secondary side. Further, the torque/slide characteristics of a three-phase winding type induction electromotor 6 can be made flat by a winding resistor 10 and are made similar to the coefficient of friction/slide characteristics at the time when a road surface is in an ice surface state to make it possible to execute a good test. Further, since the magnitude of the max. torque of the electromotor 6 can be adjusted by the voltage regulator provided on a primary side, a test can be executed corresponding to a road surface state of every kind by one electromotor 6 without using a slide element.
Patent JP-2000164309-A (JP)
Title: Semiconductor device holding socket used for high- temperature operation test of semiconductor device
Inventor: MIYAMOTO NAOKI
IPC: G01R31/26
Filed: 1998-11-20
Abstract: PROBLEM TO BE SOLVED: To improve the efficiency of the fitting/removing work of a semiconductor device in a semiconductor device holding socket used for the high-temperature operation test of the semiconductor device. SOLUTION: This semiconductor device holding socket is provided with a depression section 6 which is movable against a main body section 2 storing a semiconductor device 8 and having connector terminals 12 and is kept at the depressing state depressing the semiconductor device 8 and the depression released state separated from the semiconductor device 8. The depression section 6 is fitted to the main body section 2 rotatably by a hinge including a rotary shaft 4, and it is connected to the main body section 2 by a connecting member 20 made of a two-way shape memory alloy. End sections 20a, 20b of the connecting member 20 are fixed to the main body section 2 and the depression section 6, and an intermediate section 20c surrounds the rotary shaft 4.  The connecting member 20 applies force to the depression section 6 to keep it at the depressed state at a high measurement temperature and to keep it at the depression released state at the ordinary temperature. When the depression section 6 is kept at the depressed state, semiconductor device input/output terminals 9 are depressed to the connector terminals 12, exposed in a recess 10.
Patent JP-2000154356-A (JP)
Title: Adhesive member, wiring board having adhesive member disposed thereon for loading semiconductor, and semiconductor device using the same
Inventor: SHIMADA YASUSHI
IPC: C09J7/02
Filed: 1998-11-24
Abstract: PROBLEM TO BE SOLVED: To provide an adhesive member having good heat resistance and moisture resistance required, when a semiconductor chip having a large thermal expansion coefficient between the semiconductor chip and a wiring substrate is loaded, especially an adhesive member having excellent storability at room temperature, etc. SOLUTION: This adhesive member has adhesive layers on the both surfaces. Therein, the adhesive layer on one side (surface A) has a flow distance of 100-1,000 μm, when it is stored for 1-30 days in an atmosphere at 25 deg.C and a RH of 50%, and has an adhesive strength of 300-3,000 N/m, when adhered to a polyimide film and then cured. The adhesive layer on the opposite side (surface B) has a flow distance of 50-1,000 μm, when stored for 1-90 days in an atmosphere having a temperature of 25 deg.C and a RH of 50%, and has an adhesive strength of 300-3,000 N/m, when adhered to a polyimide film and then cured. A substrate for loading a semiconductor is prepared by adhering the surface A side of the adhesive member to the semiconductor 6-loading surface of a wiring board.  The semiconductor device is made to be a semiconductor device prepared by adhering the semiconductor chip 6 to the wiring substrate through the adhesive member.
Patent JP-H11163495-A (JP)
Title: Mounting structure of flat package-type ic
Inventor: HARA TAKESHI
IPC: H05K1/18
Filed: 1997-12-02
Abstract: PROBLEM TO BE SOLVED: To provide a mounting structure, capable of spreading an injected peeling agent smoothly into all the rear adhesive part of a flat package-type IC attach bonded on a board, an peeling the package-type IC easily from the board only by melting solder between a leg part and a surface pattern using a blower. SOLUTION: A flat package-type IC 4 is mounted on a face 3 of a board 2 using an adhesive 1. An air ventilating and also peeling agent injecting hole 7 is drilled from a rear face 5 of the board 2 to a bonding rear face 6 of the flat package-type IC 4 at a mounted position of the flat package-type IC 4 on the board 2. A total of five holes 7 at a center and at each diagonal surrounding lines are drilled full from the rear face 5 of the board 2 to the bonded rear face 6 of the flat package-type IC 4.
Patent JP-H01180791-A (JP)
Title: Ion beam machine
Inventor: IWASAKI KOJI
IPC: H01L21/82
Filed: 1987-12-29
Abstract: PURPOSE:To reduce the working time by providing a secondary electron spectroscope to discriminate secondary electron energy generated by ion beam irradiation and enabling to carry out up to a motion analysis from machining. CONSTITUTION:Etching by a convergent ion beam 22 is utilized to provide a hole on a passivation film 55. Gas molecules 57 are then supplied from a gas gun 31 and adsorbed on the IC sample 53 surface to form a metal film selectively on the ion irradiation region. After machining, the current density of the ion beam 22 is lowered and the secondary electron 49 energy is discriminated and electric potential on the sample surface to be machined is measured. By this method, a signal is inputted from a pattern generator of the outside and up to the operational analysis from machining can be carried out and the working time can be reduced.
Patent JP-2000155039-A (JP)
Title: Measuring device
Inventor: YOSHINO YASUHIRO
IPC: G01D9/00
Filed: 1998-11-24
Abstract: PROBLEM TO BE SOLVED: To provide a measuring device allowing measured data to be read out even when it fails. SOLUTION: A measuring device storing measured data in an external medium 6 is improved to obtain this measuring device. The measuring device is provided with a memory card 11 temporarily storing the measured data, a measured data memory circuit 13 storing the measured data in the memory card 11, and a measured data reading circuit 14 reading out the measured data from the memory card 11 and storing the measured data in the external medium 6.