baber/WOPTO huggingface dataset:
Patent TW-516182-B (TW)
Title: Manufacturing method of dual damascene structure
Inventor: CHEN CHAO-CHENG
IPC: H01L21/768
Filed: 2002-01-23
Granted: 2003-01-01
Abstract: A manufacturing method of dual damascene structure is provided. First, a first etch stop layer, a first dielectric layer, a second etch stop layer, a second dielectric layer and a hard mask layer are sequentially formed. Then, a contact hole is formed in the mask layer, second dielectric layer, second etch stop layer and first dielectric layer till exposing the first etch stop layer surface that corresponds to the conductive region. Second, a sacrificial protection layer is used to completely fill the contact hole. Then the etching recipe with etch selectivity between the mask layer and sacrificial protection layer smaller than one is chosen to selectively etch the mask layer and sacrificial protection layer till etching the sacrificial protection layer to a predetermined depth. Finally, the etching recipe with etch selectivity ratio between the mask layer and sacrificial protection layer larger than one is chosen to selectively etch the mask layer, second dielectric layer and sacrificial protection layer till exposing the second etch stop layer to form a trench. The sacrificial protection layer is removed to construct a dual damascene structure. An I-line photo resistor is used as the sacrificial layer, which can eliminate the conventional void issue, exactly prevent punch-through of the bottom etch stop layer and thus increase product yield.
Patent TW-563235-B (TW)
Title: Method of modulating surface mount technology solder volume to optimize reliability and fine pitch yield
Inventor: BLISH RICHARD C II
IPC: H05K3/12
Filed: 2002-03-28
Granted: 2003-11-21
Abstract: In a method of forming connectors on a substrate (202), a first patterning layer (200), being made up of mesh screen (204) and resist (206) to define a plurality of openings (208, 210, 212, 214) therein, is provided on the surface of the substrate (202), and the openings are filled with solder paste (280). A second patterning layer, also made up of a mesh screen (252) and resist (254) to define a plurality of openings (256, 258, 260, 262) therein, is provided over the first patterning layer (200), with the openings of the second patterning layer (250) communicating with respective openings of the first patterning layer. The communicating openings form passages (270, 274, 276, 278) through the patterning structure (272), with some of the passages being of different volume from others. After filling of the openings of the second patterning layer (250) with solder paste (280), the patterning layers (200, 250) are removed, leaving bodies of solder paste which vary in volume in accordance with the different volumes of the passages (270, 274, 276, 278).
Patent TW-569496-B (TW)
Title: Electrical contact and electrical connection device using same
Inventor: SAKAMOTO KATSUHIKO
IPC: H01R12/52
Filed: 2002-05-15
Granted: 2004-01-01
Abstract: Contacts are formed by a metal injection molding method using metallic fine particle powder as the material therefor. The contacts have a substantially rectangular base portion and an elastic arm that extends obliquely upward from one end of an upper surface of the base portion, supported in a cantilever fashion. The portion where the arm is attached to the base, that is, a fixed end portion, has a comparatively large rectangular cross section. The vertical and horizontal dimensions of the cross section gradually decrease toward the distal end portion of the arm. An electrical contact point portion is formed at the distal end portion of the arm.
Patent TW-544934-B (TW)
Title: A vertically aligned mode liquid crystal display
Inventor: JUN SAHNG-IK
IPC: G02F1/1337
Filed: 2002-06-19
Granted: 2003-08-01
Abstract: A plurality of gate lines and a plurality of data lines intersecting each other are formed on a first insulating substrate and a plurality of pixel electrode having a plurality of first cutouts are formed on the respective pixel areas defined by the data lines and the gate lines. A thin film transistor is connected to each pixel electrode. A reference electrode having a plurality of second cutouts is formed on a second substrate opposite the first substrate. The first cutouts and the second cutouts in the adjacent two pixel areas opposite each other with respect to one data line have an inversion symmetry with respect to the data line.
Patent TW-I248434-B (TW)
Title: Unsymmetrical cyclic diamine compound
Inventor: KODAMA TATSUHIKO
IPC: A61K31/506
Filed: 2002-06-28
Granted: 2006-02-01
Abstract: A cyclic diamine compound of formula (1): wherein A is (CH2)n, (CH2)n-CH=CH, CO-(CH2)n or CO-(CH2)n-CH=CH, in which n is a number of 0 to 3; Z represents a formula (2) or (3): in which R1, R2, R4, R5 and R6 are individually a hydrogen atom, alkyl group, alkoxy group, halogen atom or nitro group; R3 is a hydrogen atom, alkyl group, alkoxy group, halogen atom, nitro group, naphthyl group, or phenyl group which may be substituted by 1 to 3 substituents selected from the group consisting of alkyl groups, alkoxy groups, halogen atoms, a nitro group and a phenyl group; and X and Y are individually CH or a nitrogen atom; and m is 1 or 2; an acid-addition salt thereof, or a hydrate thereof, and a medicine containing such a compound.
Patent TW-554161-B (TW)
Title: Heater control system with combination modular and daisy chained connectivity and optimum allocation of functions between base unit and local controller modules
Inventor: HAUSCHULZ DANA S
IPC: F28F27/00
Filed: 2002-07-02
Granted: 2003-09-21
Abstract: A heater control system that utilizes electronic temperature control at each of a number of interconnected heaters is provided for monitoring and operating heaters within a narrow temperature range. In one embodiment, a heater control system is provided that is adapted for controlling a number of heaters positioned on pipe and components of a piping system from a remote location. The heater control system includes satellite controllers mounted on each heater connected daisy chain fashion and includes a monitoring station with a user interface for allowing a user to monitor and to remotely control the operating status or temperature of each heater in the heater control system. To satisfy the user's space requirements, the size of each controller is maintained at a small form factor and a single cord is used to provide power and communications lines to and between the controllers. Each controller integrates power supply and control with electronic temperature control to minimize the use of mechanical switching and to increase the accuracy of temperature control. The temperature set point is adjustable at each controller and, in one embodiment, the temperature set point is remotely adjustable from a remote monitoring station. The operating status of each controller is displayed on the exterior of the controller's housing and in one embodiment, the operating status, such as temperature, is displayed at a base station for each line of controllers and heaters and on a user interface monitor at a monitoring station.
Patent TW-591237-B (TW)
Title: Semiconductor wafer and testing method for the same
Inventor: LIN YUEH-LUNG
IPC: G01R31/28
Filed: 2002-07-31
Granted: 2004-06-11
Abstract: A semiconductor wafer includes a plurality of areas and an array of dice disposed within each of the areas. The feature of the present invention is that at least two fiducial marks are disposed in each of the areas. The present invention further provides a method of testing a sawed semiconductor wafer.
Patent TW-569225-B (TW)
Title: Semiconductor memory device
Inventor: KURODA NAOKI
IPC: G11C7/22
Filed: 2002-09-04
Granted: 2004-01-01
Abstract: A port A of the path including a first transistor of a memory cell to be accessed, a first bit line pair, a first column selection switch and a data line pair interleaves with a port B of the path including a second transistor of the memory cell to be accessed, a second bit line pair, a second column selection switch and the data line pair in two cycles of a clock. A read amplifier amplifies data transferred from a bit line pair to the data line pair and outputs the resultant data to an input/output buffer in one cycle of the clock. The input/output buffer outputs the data received from the read amplifier to the outside in one cycle of the clock.
Patent TW-I224255-B (TW)
Title: Power-saving method and power-saving circuit for changing electronic apparatus with non-power-saving processor into power saving
Inventor: CHEN JIAN-JUNG
IPC: G06F1/32
Filed: 2002-10-24
Granted: 2004-11-21
Abstract: The present invention relates to a power-saving method that changes electronic apparatus with non-power-saving processor into power saving. In the step (a), a power switch device is provided to maintain the power on/off for the non-power-saving processor during the clock period based on the clock signal of the power-saving apparatus. In the step (b), the power-saving apparatus generates the periodic first clock signal and the periodic second signal such that the power switch device turns off power supply for the non-power-saving processor in the first clock signal and the power switch device turns on power supply for the non-power-saving processor in the second clock signal. In the step (c), both time periods in the first clock signal and the second clock signal of the step (b) are determined so as to have a total average current lower than a predetermined value.
Patent TW-567597-B (TW)
Title: Packaging substrate and process for improving wire sweep
Inventor: LIU WEI-CHI
IPC: H01L23/28
Filed: 2002-10-25
Granted: 2003-12-21
Abstract: The present invention provides a packaging substrate and process to improve wire sweep, wherein the surface of the said packaging substrate at least comprises a chip-bonding area and plural metal pads for bonding wires. The said metal pads for bonding wires are arranged in the periphery area outside the chip-bonding area, and form a metal pad region for bonding wires, so as to reduce the impact of the mold flow in the following encapsulation process to the plural metal bonding wires formed in the wire-bonding process after a chip is pasted onto the chip-bonding region, thereby the wire short problem is improved, which is caused by wire sweep to shift and mutually contact the bonding wires in the semiconductor packaging process. Thus, the yield rate, productivity and reliability of the semiconductor package product are enhanced.
Patent TW-I279083-B (TW)
Title: Semiconductor integrated circuit apparatus
Inventor: MIZUNO HIROYUKI
IPC: H01L21/82
Filed: 2002-10-29
Granted: 2007-04-11
Abstract: A kind of semiconductor integrated circuit apparatus is disclosed in the present invention. The invented semiconductor integrated circuit apparatus is provided with the followings: the first circuit block BLK1; the second circuit block BLK2; and the change circuit MIO1, which is connected to the first circuit block and the second circuit block. The first circuit block has the first mode for supplying power source voltage and the second mode for terminating the supply of power source voltage. The change circuit has the function of suppressing the flow of punch-through current by fixing the electric potential of input node of the second circuit block at any one operation-voltage when the first circuit is in the second mode. When connecting the circuit clock, the connection circuits (MIO1 to MIO4) are used in common.
Patent TW-I273403-B (TW)
Title: Display control device, image display device, and control method of data transmission
Inventor: MIURA SUSUMU
IPC: G02F1/133
Filed: 2002-11-18
Granted: 2007-02-11
Abstract: The decoder includes the first storage and the second storage. The dynamic control data is supplied to the first storage from the computer via the data bus. The static control data is supplied to the second storage from the computer via the data bus. The word processor reads out the dynamic control data or static control data from the address in the storage assigned by the address signal. The static data read out from the first storage and the second storage is transmitted to the register assigned by the address signal within the plurality of registers.
Patent TW-I241684-B (TW)
Title: Manufacturing method of semiconductor wafer
Inventor: KOMA YUTAKA
IPC: H01L21/301
Filed: 2002-12-02
Granted: 2005-10-11
Abstract: A kind of method for manufacturing semiconductor wafer is disclosed in the present invention. The main subject of the invention is to sufficiently increase anti-breaking strength of semiconductor wafer in the case of manufacturing thin type semiconductor wafer having a thickness smaller than 150 mum. In the manufacturing method of the invented semiconductor wafer, a cut groove 9 is formed on the semiconductor wafer W surface with its depth at least equal to the semiconductor wafer thickness. Then, the protection member T is stuck on the on the semiconductor wafer W surface formed with a cut groove 9 so as to place the protection member T on the chuck table of the polishing apparatus in a face down manner. Additionally, the backside of semiconductor wafer W is ground to expose the cut groove 9. Under the condition of forming individual semiconductor chip separated due to exposing the cut groove 9, by performing a dry etching process onto the semiconductor wafer backside, the ground oblique layer generated on the backside due to grinding and the cut oblique layer generated due to cutting are removed.
Patent TW-I224900-B (TW)
Title: Light-sending apparatus
Inventor: OHSAWA KATSUICHI
IPC: H04B1/04
Filed: 2002-12-05
Granted: 2004-12-01
Abstract: The purpose of this invention is to prevent LED from irradiating incessantly while the input terminal is set high for meeting some requirements, for instance software, so as to keep the batteries of some devices such as PDA, cellular phone and the likes away from running out as well as the LED from being destroyed. For this reason, prior to a light-sending driving circuit 23 used for driving light-sending LED 8, a high-pass filter 21 is installed in order to pass the high-frequency part of a light-sending input signal which is formed from the pulse waveform, and a binary circuit 22 is also set up to transfer the output signal of said high-pass filter 21 into binary scale so as to return to a pulse waveform.
Patent TW-I221192-B (TW)
Title: Semiconductor device downsizing its built-in driver
Inventor: MIURA MANABU
IPC: H01L21/66
Filed: 2002-12-19
Granted: 2004-09-21
Abstract: A semiconductor device includes a first pad, a second pad, a first buffer and a second buffer. The first pad is connected to another semiconductor device in a multi-chip package, and the second pad makes a probing connection in a wafer test. The first buffer drives the another semiconductor device connected to the first pad. The second buffer, being driven by the first buffer, drives a load capacitance of a tester connected to the second pad with the driving power greater than the driving power of the first buffer, and has its active/inactive state controlled by a control signal. The semiconductor device can provide the driving power necessary for the wafer test, and drive the another semiconductor device with preventing generation of drive noise and suppressing current consumption in the normal operation of the multi-chip package.
Patent TW-I222230-B (TW)
Title: Magnetic memory
Inventor: SAITO YOSHIAKI
IPC: G11C11/14
Filed: 2003-01-02
Granted: 2004-10-11
Abstract: The present invention relates to a magnetic memory, which provides a magnetoresistance effect element (C) having a magnetic recording layer; and a first wiring (BL, WL) extending in a first direction on or below the magnetoresistance effect element; by passing a current through the first wiring to generate a magnetic field for recording information in the magnetic recording layer, a covering layer (SM) is provided on at least one of both sides of the first wiring, the covering layer being made of magnetic material, and the covering layer having an uniaxial anisotropy in the first direction along which a magnetization of the covering layer occurs easily.
Patent TW-I240029-B (TW)
Title: Drum type washing machine
Inventor: MINAYOSHI HIROKO
IPC: D06F25/00
Filed: 2003-02-24
Granted: 2005-09-21
Abstract: A drum type washing machine includes rotating drum having a rotating axis in a substantially horizontal direction and sustained rotatably in a tub. The washing machine further includes a motor for driving the rotating drum, a water supplying means for supplying water into the tub, and a controlling means for washing, rinsing and liquid-extracting by controlling workings of the motor. The controlling means of the washing machine washes a laundry by pouring detergent bubbles in the washing process.
Patent TW-I379693-B (TW)
Title: Calicheamicin derivative-carrier conjugates
Inventor: ARTHUR KUNZ
IPC: A61K41/00
Filed: 2003-05-02
Granted: 2012-12-21
Abstract: Cytotoxic drug derivative / antibody conjugates, compositions comprising the conjugates and uses of the conjugates are described. Monomeric calicheamicin derivative / anti-CD22 antibody conjugates, compositions comprising the conjugates and uses of the conjugates are also described.
Patent TW-I231644-B (TW)
Title: Application of low-temperature solid-state type thermo-electric power converter
Inventor: CHEN WEN-BIN
IPC: F24J3/00
Filed: 2003-06-12
Granted: 2005-04-21
Abstract: The present invention relates to the application of a low-temperature solid-state type thermo-electric power converter and is mainly to provide an application method of power converter working at a low temperature. In the present invention, the waste heat generated by man-made or natural environment is applied to, due to the temperature change, cause the lattices of a material having a specific crystal lattice structure to generate strains along the polarization axis direction. As a result, anisotropic displacement between the positive charge center and the negative charge center, which form a covalent bond ion in a lattice, generates a potential difference and, therefore, a current. Thus, under a heat source environment completely, thermal power can be converted into electrical power continuously to allow any electric appliance or equipment generally applied for generating waste heat to convert the waste heat into electric power for power reproduction and saving. Besides, to a greater size and scale, the low-temperature solid-state type thermo-electric power converter can be used to replace any conventional electro-mechanical power generator applied in a thermal power, cogeneration, terrestrial heat power, or solar power environment.
Patent TW-I221215-B (TW)
Title: Method for diagnosing data errors on optical disc
Inventor: CHEN MAX
IPC: G06F11/08
Filed: 2003-09-16
Granted: 2004-09-21
Abstract: A method for diagnosing data errors on an optical disc is disclosed so that the damage situation of the diagnosed disc can be quickly obtained. In the embodiment, a plurality of data blocks are selected, while each one the selected data blocks is checked to determine whether the checked one is damaged or not. Thereafter, a damage ratio between the quantities of the damage data blocks and all the selected data blocks is calculated, and the damage situation of the diagnosed disc is obtained according to the damage ratio.
Patent TW-I303013-B (TW)
Title: Anti-reflective compositions comprising triazine compounds
Inventor: ENOMOTO TOMOYUKI
IPC: G03F7/00
Filed: 2003-09-29
Granted: 2008-11-11
Abstract: The present invention relates to an anti-reflective coating composition characterized by comprising a resin made from triazine compounds having at least two nitrogen atoms substituted a hydroxymethyl group and/or an alkoxymethyl group, and a light absorbing compound and/or a light absorbing resin. The present invention offers an anti-reflective coating composition for the anti-reflective coating having high light absorption property of the light used for the lithography process in the preparation of semiconductor device, showing high reflective light preventing effect, being used at thinner film thickness more than before, and having greater dry etching rate in comparison to photoresist layer.
Patent TW-I243118-B (TW)
Title: On vehicle display and light-guiding plate
Inventor: KUSHIDA KAZUMITSU
IPC: G02B6/00
Filed: 2003-11-06
Granted: 2005-11-11
Abstract: Regardless of the physique and riding posture of the driver in a car, this invention provides an on vehicle display and light-guiding plate with superior visibility, without blocking the front view. A transparent light-guiding plate 100 which can see through the other side from the principal plane of one side, is provided in such a manner that it inclines rearwards and in front of the driver's front view, wherein the principle plane 104a of one side opposes the drivers, with an incident end at a lower end, and a reflected end 102 at a top end. A radiating body is provided at the incident end of the light-guiding plate 100. The distance from the incident end to the reflected end is long in relation to the plate thickness. The reflected end 102 of the light-guiding plate 100 may also includes plural faces with various inclining angles, or being subjected to grinding. The principle plane 104a of one side of the light-guiding plate 100 is formed with grooves 101 along directions normal to the light-guiding direction.
Patent TW-I227206-B (TW)
Title: Degassing device for hot pipe filler
Inventor: SHIU CHANG-JIE
IPC: B65B55/00
Filed: 2003-11-13
Granted: 2005-02-01
Abstract: A degassing device for a hot pipe filler includes a degassing head, a tightening block, and a driver for driving the tightening block relative to the degassing head. The degassing head includes a compression opening formed on a bottom face, and a plurality of washers located inside the compression opening, in which the inside diameter of the washer is smaller than the outside diameter of a hot pipe. The tightening block has an insertion opening for the insertion and positioning of the hot pipe. Thus, when the tightening block drives one end of a hot pipe to expand on the washers and squeeze into the compression opening, the compressed washers, after being deformed, compress on the outer surface of the hot pipe and form a gastight effect.
Patent TW-I243417-B (TW)
Title: Method for manufacturing device isolation film of semiconductor device
Inventor: JUNG JONG-GOO
IPC: H01L21/762
Filed: 2003-12-24
Granted: 2005-11-11
Abstract: The present invention discloses method for manufacturing device isolation film wherein a high selectivity slurry containing MxPyOz is used for polishing nitride film to prevent the generation of moat. In accordance with the method, a pad oxide film and a pad nitride film formed on a semiconductor substrate and the semiconductor substrate are etched to form a trench. A liner nitride film and an oxide film for device isolation film filling the trench are formed on the entire surface. The oxide film for device isolation film is first etched using a low selectivity slurry, and further etched using a high selectivity slurry to expose the liner nitride film. The liner nitride film is polished using a high selectivity slurry containing MxPyOz and the pad nitride film is then removed.
Patent TW-I237222-B (TW)
Title: Optoelectronic device and manufacturing method thereof
Inventor: HIRAYAMA HIROSHI
IPC: H05B33/00
Filed: 2004-02-18
Granted: 2005-08-01
Abstract: The invention targets at shrinking the wiring area (e.g. frame edge). The optoelectronic device provides the optoelectronic component 60 installed on the pixel area 12 of the substrate 10, the pixel electrode 70, the common electrode 72, the wirings 44, 46 and 48 electrically connected with the pixel electrodes 70, the conductive part 74 in connection with the common electrode 72, the common wirings 30, 32 and 34 in connection with the wirings 44, 46 and 48 that are less than the number of the wirings 44, 46 and 48, and the edge wiring 22 formed inside the divided end area 18 from side area of the pixel area 12 installed by using the straight line L passing the external side of the pixel area 12 and electrically connected to the conductive part 74.