Patent GB-1093124-A (GB)
Title: Field-effect transistor switches
Inventor: THOMAS PHILIP ROBINSON
IPC: H03K17/687
Filed: 1963-07-26
Abstract: 1,093,124. Field effect transistors. TEXAS INSTRUMENTS Ltd. July 27, 1964 [July 26, 19631, No. 29818/63. Heading H1K. [Also in Division H3] A switch comprises three interconnected field effect transistors, the source of the first being connected to an input terminal and its drain connected to the sources of the second and third transistors. The drains of the second and third transistors are connected respectively to an input and common terminal, the gates of the first and second transistors connected to a first control terminal and the gate of the third to a second control terminal. In a typical embodiment (Fig. 8) the transistors are formed in a single P-type silicon wafer by a sequence of masking and diffusion steps. The resulting structure consists of N-type regions 21, 22 with P-type islands 23, 24 respectively formed within them. These islands are bridged by the N-type gate regions 25, 26, 27 of the three transistors. The wafer face is covered with a protective oxide layer through holes in which ohmic source contact 32 and drain contacts 33, 34 are made, and a T-shaped metal layer over the oxide contacts the drain region of one transistor and the source regions of the others at 29, 30, 31 respectively through holes in the oxide. The gates of transistors A and B are interconnected via metal layer 35 and gate of transistor C connected to metal layer 40. In another form of device the transistors are formed at the extremities of a T-shaped P-type region in the face of an N-type wafer (Fig. 1, not shown) which forms a gate common to all three transistors Further independent N-type gates are diffused into the surface of the P region. In a modification of this (Fig. 5, not shown) the part of the wafer carrying the cross of the T is isolated for the part carrying its tail by a diffused P region extending right through the wafer and interconnections are made between the independent gates and adjacent parts of the N-type wafer material. In another arrangement, Fig. 11, induced channel field effect transistors are used. In this, N region 51 formed at the surface of a low resistivity P wafer, forms and interconnects the drain of transistor A and the sources of transistors B and C. The channels are N-type layers induced at the surface of the P-type wafer material which separates the N region from further N regions 52, 53, 54 to which source contact 62 and drain contacts 63, 64 are connected. The gates 59, 60, 61 are mounted over the respective channels on the protective oxide layer. Interconnected induced channel transistors of annular configuration may alternatively be used. In other arrangements suitably interconnected field-effect transistors are formed by diffusion into separate monocrystalline semiconductor islands insulated by an oxide layer from a polycrystalline substrate. The basis for these arrangements is made by forming mesas on the surface of a monocrystalline wafer, coating the surface with oxide and epitaxially depositing polycrystalline semi-conductor material over the oxide. Material is then removed from the back face of the wafer down to the back of the mesas which then form the islands.