baber/WOPTO huggingface dataset:
Patent JP-H0855919-A (JP)
Title: Ferroelectric memory element
Inventor: OGIMOTO YASUSHI
IPC: H01L21/8247
Filed: 1994-08-12
Abstract: PURPOSE:To provide a structually stable ferroelectric memory element that uses a fluoride ferroelectric. CONSTITUTION:A buffer layer 2 is formed between a fluoride ferroelectric 3, which is indicated by BaMF4 [M indicates the element consisting of Mg, Zn, Mn, Fe, Co and Ni], and a semiconductor single crystal substrate 1. As a buffer layer 2, a fluoride insulator layer, which is indicated by (AxB1-x)F2 (0<=x<=1) [A and B indicate the element of alkaline earth metal group consisting of Ca, Sr, Ba and Mg], or a fluoride insulator layer, consisting of two layers indicated by (AxB1-x)F2/CyD1-y)F2, (0<=x<=1) and (0<=y<=1) [A, B, C and D indicate the element of alkalkne earth metal group consisting of Ca, Sr, Ba and Mg], is used. Also, the fluoride insulator layer, indicated by AF3 [A is the element selected from the rare-earth metal group consisting of La, Nd, Ce and Er], is also used as an orientational buffer layer.
Patent JP-2001023402-A (JP)
Title: Lighting system
Inventor: SUGIHARA HIROSHI
IPC: F21Y101/00
Filed: 1999-07-05
Abstract: PROBLEM TO BE SOLVED: To reduce the number of power source cables and part items so as to narrow a power source cable housing part by connecting a light emitting unit to an optional position of the power source cable via a connector. SOLUTION: A light emitting unit 20 is constructed of an LED unit 21 and a connector 22, and in the LED unit 21, an RGB-LED 31, a resistor 31, and a coupling pin 33 are arranged on a base board 30. The LED unit 21 is installed in the connector 22 with the coupling pin 33 inserted into a connection part 43 of the connector 22. In installation of the connector 22 consisting of upper and lower units 41, 42 to an optional position in the power source cable 12, their connection parts cut an outer coating of the power source cable 12 and brought into contact with a core copper wire when the upper and lower units 41, 42 are fitted together. The power source cable 12 is constructed of three power supply cables to red, green, blue constituting the RGB-LED 31 and a single grounding wire, and the LEDs of the same color emit light with the same luminance.  Therefore, arrangement of respective power source cables to respective line light sources is not required.
Patent JP-H1035006-A (JP)
Title: Image forming apparatus
Inventor: NOMIYAMA TAKASHI
IPC: B41J2/455
Filed: 1996-07-19
Abstract: PROBLEM TO BE SOLVED: To detect a shift of an irradiating position of an optical beam on a photosensitive body drum with high accuracy by a method wherein a position of at least one of a light source, an optical means and an image forming body is controlled based on a position error signal corresponding to a shift quantity shifted from a reference position by detecting the irradiating position of an optical beam on an image forming body. SOLUTION: A focus lens position control section 11A supplies a driving voltage which is based on the input of a position error signal in a direction X from a reference position to a horizontal movement stage 12B, then a focus lens 3 is moved in a main scanning direction and an irradiating position in the main scanning direction of a laser beam for detection emitted on a photosensitive drum 5 is corrected. Also, a focus lens position control section 11B supplies a driving voltage which is based on the input of a position error signal in a direction Y to a vertical movement stage 12A, then the irradiating position of the laser beam for detection in the sub-scanning direction is corrected. As a result, it is possible to detect a shift of the irradiating position of the optical beam emitted from the light source with high accuracy.
Patent JP-S6167827-A (JP)
Title: Liquid crystal element
Inventor: KATAGIRI KAZUHARU
IPC: G02F1/133
Filed: 1984-09-12
Abstract: PURPOSE:To attain rapid response, formation of high density picture elements and display on a large area by sealing specific liquid crystal components between a pair of substrates and providing one surfaces of the substrates with an effect for orientating the molecular axes of liquid crystal contacted with an interference to one direction with priority. CONSTITUTION:The surfaces of substrates 11, 11' contacted with the liquid crystal at their interference are provided with an effect for arraying the molecular axes of liquid crystal with priority in one direction by using liquid crystal components containing a liquid crystal generating phase transfer from an isotropic phase to a Ch phase, an SmA phase and chiral smectic phases such as SmC*, SmH*, SmF*, SmJ*, SmK*, SmI*, and SmG* in the temperature reducing process and a liquid crystal generating phase transfer from the isotropic phase to the Ch phase and a crystal phase or from the isotropic phase to the Ch phase, the SmA phase and the crystal phase in the temperature reducing process to form a monodomain arraying liquid crystal molecules 13 in one direction. Consequently, both liquid crystal working characteristic and monodomain property of the liquid crystal layer can be obtained and long stability of orientation can be improved. Thus, the liquid crystal element can be used for a display element requiring rapid response, formation of high density picture element and a large display area or an optical shutter.
Patent JP-S6433953-A (JP)
Title: Semiconductor package
Inventor: KOBAYASHI KAZUYUKI
IPC: H01L23/48
Filed: 1987-07-29
Abstract: PURPOSE:To stabilize the operation of a semiconductor element to be mounted even in high speed operation, by forming a part or all of the leads of a semiconductor package having the leads, on which the semiconductor element is mounted, with resistors. CONSTITUTION:A semiconductor element 2 is mounted on a semiconductor package having leads. In this package, a part or all of the leads 5 and 6 are formed with resistors. For example, the semiconductor package is constituted with the following parts in correspondence with the semiconductor element 2: a package base 1; lead conductor films 3-1-3-4; bonding wires 4-1-4-3; resistor leads 5-1-5-2, conductive leads 6-1-6-4; and pads 7. In this way, ringing in output waveforms in high speed operation can be effectively suppressed. Termination of transmitting paths is performed in the vicinity of the semiconductor package, and mismatch due to reflection is prevented. The number of external resistors is decreased, while the number of parts is also decreased. Therefore, economy is enhanced, and the packaging density can be increased.
Patent JP-S6249766-A (JP)
Title: Thermal head
Inventor: SHIMOOOSAWA HIROYUKI
IPC: B41J2/355
Filed: 1985-08-29
Abstract: PURPOSE:To perform recording of one line quantity under an optionally divided condition, by connecting the parallel outputs of a shift register with the ENB (power supplying time controlling signal) input controlling gate of each driving element. CONSTITUTION:Picture signals of one line quantity are inputted from a PiX input terminal 3 and transferred to the 1st shift register 5 of driving elements 40a-40x by means of a PcK (transfer clock) signal inputted from a PcK input terminal 4. When the number of the ICs of the driving elements is 32 and quartered driving is performed, SELs (select signal) which are to be inputted to the SEL input terminals 32 of the first eight ICs are made to be turned on. After the storage is completed, an ENB signal which is inputted from an ENB input terminal 1 and controls a power supplying time is outputted and recording of 1/4 line is performed in the first place. Then an ESL signal is inputted to the 2nd shift register 43 from an ESL input terminal 41 so that the SELs which are to be inputted to the SEL input terminals 32 of the next eight driving elements can be turned on.
Patent JP-2000350496-A (JP)
Title: Volatile remote operation method with two directly coupled stepping motors
Inventor: TOMITA MINORU
IPC: H02P8/40
Filed: 1999-06-02
Abstract: PROBLEM TO BE SOLVED: To obtain a simple volatile remote operation method that does not require external power supplies or electronic control circuits, and converts various mechanical displacement to an electrical signal by one stepping motor for directly controlling the other. SOLUTION: The stator coil windings of stepping motors 1 and 2 are connected directly to each other by an electric wire, and the rotation of a rotor 4 of the stepping motor 2 is controlled merely by electromotive force that is generated when a rotor 3 of the stepping motor 1 is rotated by external force.
Patent JP-S6254674-A (JP)
Title: Method for removing burr in cut part of steel material
Inventor: ITAGAKI MASAMI
IPC: B24C1/00
Filed: 1985-08-30
Abstract: PURPOSE:To remove efficiently and reliably burrs in the cut part of steel material by jetting in high pressure mixed liquid consisting of grinding material and its carrier liquid. CONSTITUTION:Each jetting nozzle 3 is opposed to each claw part in the cross section 2 of a steel plank 1 moving on a production line. High pressure mixed liquid consisting of grinding material and water is jetted from the jetting nozzle 3 to burrs caused by cutting the steel plank 1, being interlocked with the stop of the steel plank 1, whereby burrs are removed efficiently and reliably.
Patent JP-S5980079-A (JP)
Title: Wiretap preventing device of catv terminal device
Inventor: NISHIBORI ISAO
IPC: H04N7/16
Filed: 1982-10-30
Abstract: PURPOSE:To ensure a fair operation of a system, by providing an address data check bit part and performing a visual-aural control of a TV channel with an output signal defined as OK/NG. CONSTITUTION:At a terminal the received polling data is compared with an address set by itself through a comparator 4d. If the coincidence is obtained with this comparison, the data is fetched among the following down-data to be used for visual-aural permission/inhibition. In this case, an address part 6 delivers an address signal added with a check bit, and this signal is checked at a check bit checking part 7. Then a switch SW3 is turned on with OK. While the part 7 checks a redundant bit of address and detects NG if the part 6 is remodeled. Then the SW3 is turned off. Therefore a visual-aural inhibition mode is set to give no actuation to a PLL unit 3. Thus the pictures are disturbed and cannot be viewed.
Patent JP-H0240833-A (JP)
Title: Manufacture of fluorescent screen for cathode-ray tube
Inventor: HIGUCHI TOKUMASA
IPC: H01J9/22
Filed: 1988-07-29
Abstract: PURPOSE:To improve the smoothness of the face plate of a cathode-ray tube by transferring a transfer material consisting of phosphor layer of specified ratio of phosphor to solid resin component of an organic binder in which the phosphor is dispersed on the face plate of the cathode-ray tube and then baking the phosphor layer. CONSTITUTION:A transfer material 7 consisting of phosphor layer 5 of 100/60-100/5 in the ratio of phosphor to acrylic resin binder in which the phosphor is dispersed is used. Or a transfer material 7 consisting of phosphor layer 5 of 100/40-100/5 in the ratio of phosphor to polyvinyl butylar resin binder in which the phosphor is dispersed is used. The phosphor layer 5 is transferred on the face plate 8 of a cathode-ray tube and then baked. Thereby the smoothness of the face plate 8 can be improved.
Patent JP-S5894928-A (JP)
Title: Electrode for spark erosion
Inventor: INOUE KIYOSHI
IPC: B23H1/04
Filed: 1981-11-27
Abstract: PURPOSE:To heighten the effect of cooling on a spark erosion electrode through heat pipe action, by providing a cavity in the electrode so that protrusions and recesses are made on the inside surface of the electrode at the side of its processing surface and by sealing up a working medium in the cavity and providing radiating fins outside the non-processing surface of the electrode. CONSTITUTION:A cavity 3 is provided in electrode 1 for spark erosion. A protruded and recessed evaporating section 4 such as porous protrusions is provided on the inside of the electrode 1 facing the cavity 3, at the side of the processing surface of the electrode. To provide the evaporating section 4, a dendrite plating layer is deposited by electrical or chemical plating or the like. a working medium 6 such as water for transferring heat is sealed up in the cavity 3 so that the pressure therein is reduced. Radiating fins 5 are provided outside the non-processing surface of the electrode 1. Heat generated due to the spark erosion is transferred in the electrode 1 by heat pipe action and emanates from the radiating fins 5.Therefore, the temperature of the processing part falls so that the processing capacity is improved.
Patent JP-H1135659-A (JP)
Title: Resin composition, prepreg and printed wiring base board and production of these
Inventor: KAWAKITA YOSHIHIRO
IPC: H05K3/00
Filed: 1997-07-16
Abstract: PROBLEM TO BE SOLVED: To obtain the subject composition, for a sealer and an insulation layer of a printed wiring base board having low hygroscopicity and low permittivity, which is required along with progress of the mounting technique such as packaging of semiconductor and COB. SOLUTION: The resin composition for electric insulation is obtained by including (A) a naphthol-modified glycidyl ether-type or biphenyl group- containing glycidyl ether-type epoxy resin and (B) a curing agent having the same chemical structure as the resin except that the glycidyl ether group of the resin is replaced for hydroxyl group. The prepreg is obtained by impregnating in a substrate a thermosetting resin composition containing a glycidyl ether- type epoxy resin and a curing agent having the same chemical structure as the resin except that the glycidyl ether group of the resin is replaced for hydroxyl group, followed by drying. The thermosetting resin composition is used as an insulation layer for printed wiring base board.
Patent JP-H0274900-A (JP)
Title: Electropolishing method for decontamination
Inventor: ROOBERUTO UEEBAA
IPC: C25F3/16
Filed: 1989-07-24
Abstract: PURPOSE: To reduce the radiation load onto the human body and, at the same time, to reduce the technical and economical expenses by using a deionized material enriched with an electrolyte which can be reprocessed with a water treating device in a facility to guarantee the conductivity for electrolytic polishing. CONSTITUTION: A deionized material containing added boric acid is used in place of an electrolytic solution (in many cases, dilute sulfuric acid). Since the conductivity obtained with the boric acid is lower than that obtained with sulfuric acid, the flow of an electric current, accordingly, the polishing amount per unit time becomes smaller. In order to suppress the efficiency drop, the deionized material enriched with boric acid supplied to a sponge electrode is heated before the material is introduced to the electrode. Therefore, the absorbing process of an liquid caused by an inevitable leakage which increases the radiation load to the human body and is expensive can be omitted. In addition, the electrolytic solution after decontamination can be reprocessed with a water treating device in a facility.
Patent JP-S6171961-A (JP)
Title: Two-side processing machine for disc
Inventor: TAKADA JOICHI
IPC: B24B21/04
Filed: 1984-09-12
Abstract: PURPOSE:To automate works and remove the dust produced under processing by allowing a tape-shaped processing element to contact each of the sides of a disc while it is pinched and rotated round a horizontal axis, thereby accomplishing simultaneous two-sided processing, and by permitting a tape- shaped cleaning element to contact said two surfaces. CONSTITUTION:In a printed rotating device 22, a disc 5 is pinched by No.1 pinching means 27 and No.2 pinching means 38 on its two sides, and tape-shaped processing elements 53A, 53B are put in contact with these surfaces 5a, 5b of the disc 5 while it is rotating round a horizontal shaft 21. These processing elements 53A, 53B are pressed by pressure rings 59A, 59B to perform two-sided processing simultaneously. This will eliminate turnover work by human labor or any device to enable automation with simple construction. Further, contact of tape-shaped cleaning elements with the processed two faces will provide well removal of the dust produced on the faces under processing.
Patent JP-H0746329-A (JP)
Title: Interphone
Inventor: MATSUDA MITSUHIRO
IPC: H04M1/02
Filed: 1993-08-02
Abstract: PURPOSE:To surely restore a call state to a waiting state. CONSTITUTION:A call detecting circuit 14 detects visitor's call operation and a call start control circuit 15 turns melody ICs 16, 17 to operating states and supplies power supply voltage to a power ampilfier 19. During the output of the melody, a transistor(TR) Q2 in a call tone detecting circuit 24 is turned on and the circuit 15 outputs melody independently of visitor's calling operation. At the end of melody output, the TR Q2 is turned off and the circuit 15 stops melody ICs 16, 17 and the impression of power supply voltage to the amplifier 19. Consequently a waiting state can be accurately restored from the calling state.
Patent JP-H0239544-A (JP)
Title: Die-bonding method for semiconductor chip
Inventor: HASHIMOTO TOMOAKI
IPC: H01L21/52
Filed: 1988-07-29
Abstract: PURPOSE:To make gaps between semiconductor chips smaller by forming space parts at the lower parts of the sides of the semiconductor chips so that the next semiconductor chips adjoin, when the semiconductor chips are adjoined and die-bonded on a substrate one by one. CONSTITUTION:Thermosetting resin 3a is applied only to a region of a substrate 2 where a semiconductor chip 1a is die-bonded. The thermosetting resin 3a is not applied to the lower side of the chip side that adjoins a semiconductor chip 1b and a space part 3c is formed. Then, the semiconductor chip 1a is mounted on the substrate 2. After that, the thermosetting resin 3a is hardened with heat and the semiconductor chip 1a is die-bonded on the substrate 2. Next, thermosetting resin 3b is applied only to a region of the substrate 2 where a semiconductor chip 1b is die-bonded. The thermosetting resin 3b is not applied to the part adjoining to the semiconductor chip 1a, and the semiconductor chip 1b is adjoined to the semiconductor chip 1a and mounted on the substrate 2. On this occasion, the thermosetting resin 3b flowing on the side of the semiconductor chip 1a enters the space part 3c. Then, the whole region where the thermosetting resin 3b has been applied is heated to harden the resin 3b, and the semiconductor chip 1b is die-bonded on the substrate 2.
Patent JP-H0357265-A (JP)
Title: Manufacture of semiconductor device
Inventor: SHIMODA KOICHI
IPC: H01L29/47
Filed: 1989-07-26
Abstract: PURPOSE:To improve the operating speed of a transistor by forming a second polycrystalline silicon film on a nitride film make it an outer base region. CONSTITUTION:An oxide film 105, a P-type crystalline silicon film containing N-type impurity and a nitride film 110 are sequentially laminated on a P-type substrate 101, and selectively etched to increase the pattern width of the film 110 larger than that of the film 105. Further, an N-type crystalline silicon film 102 is formed on the substrate 101, anisotropically etched to allow the film 102 to remain only under the film 110, and covered with the film 105. Then, N-type impurity is diffused in a predetermined region of the surface of the substrate 101 to form a guard ring region 116 and an inner base region 114. The region 114 is opened, and a diffused layer 106 is formed in the opening. An emitter electrode 124, a Schottky barrier diode electrode 125 and a collector electrode 122 are formed on predetermined regions. Thus, a base area can be easily miniaturized, a base.collector junction capacity can be reduced, and the operating speed of a transistor is improved.
Patent JP-H0536803-A (JP)
Title: Semiconductor device and measuring method of its characteristics
Inventor: KABASAWA MASAYA
IPC: H01L21/66
Filed: 1991-07-31
Abstract: PURPOSE:To directly measure the resistance component of the memory cell such as a high resistance load type SRAM and the like. CONSTITUTION:In the title semiconductor device, a memory cell array 1 and the power feeding system of a circumferential circuit 2 are separated and the voltage fed from pads 3 and 5 is fed to the memory cell array 1 only. The current flowing between the pad 3 and the pad 5, dedicated to a memory cell, is measured by the voltage applied to pads 3 and 5 dedicated to the memory cell. As a result, the resistance value of high resistance, having high resistance load type SRAM in a semiconductor device, can be measured directly, the formation of a test pattern in a test element group is unnecessitated, and a piece of wafer can be efficiently used. Also, the measurement of high resistance can be conducted in a stable manner, and reliability can be improved.
Patent JP-H0860281-A (JP)
Title: Ductile aluminum alloy having high rigidity and high heat resistance
Inventor: SAGA MAKOTO
IPC: C22C21/02
Filed: 1994-08-15
Abstract: PURPOSE: To provide high rigidity and high strength at high temp. by specifying a composition and performing precipitation strengthening and intermetallic compound dispersion strengthening. CONSTITUTION: This alloy has a composition consisting of, by weight ratio, 8.0-14.0% Si, 1.5-4.0% Cu, 1.0-2.0% Mg, 0.3-0.8% Fe, 0.5-1.5% Ni, 0.04-0.2% Ti, and the balance Al with inevitable impurities. Further, it is preferable to incorporate 0.1-0.7% Mn, 0.1-0.3% Zn, and 0.05-0.5% V. In this alloy, precipitation strengthening by Cu and Mg, dispersion strengthening by the formation of intermetallic compounds of Al and Fe and Al and Ni, and further recovery and recrystallization inhibiting effect can be attained, and a proof stress of >=230N/mm<2> and an elasticity not lower than GPa at 200 deg.C can be obtained by means of solution heat treatment at (solidus temp. -5 deg.C) to solidus temp. -25 deg.C) and aging treatment at 160-240 deg.C for 5-30hr.
Patent JP-H04355301-A (JP)
Title: Circular map scale
Inventor: RAFUAERU SANTSU BURUGOSU
IPC: G01B3/00
Filed: 1991-07-31
Abstract: PURPOSE: To easily and accurately measure the distance between the point where a user is positioned and a target spot with a scale for map. CONSTITUTION: A body is formed of a flexible transparent material integrally in thin plate structure of a circular part 1 and a rectangular part 2 which connects with the circular part 1 and has a magnifying lens 3, and the circular part 1 is provided with a scale consisting of several circumferential lines. Then the center of a circumferential line is aligned with the position where the user is positioned on the map by auxiliarily using the lens 3 and the distance from there to the target spot is measured.
Patent JP-H10165178-A (JP)
Title: Dna encoding variable region of anti-fas antibody and anti-fas antibody
Inventor: SHIBATA MASAO
IPC: C12P21/02
Filed: 1997-07-01
Abstract: PROBLEM TO BE SOLVED: To obtain the subject new DNA consisting of a DNA containing specific base sequences encoding a variable region of a heavy chain of an anti- Fas antibody, and used for producing an antibody useful for the treatment and diagnosis of an autoimmune disease by inducing the apoptosis of autoantibody producing cells, etc. SOLUTION: This DNA encoding a variable region of an anti-Fas antibody is a new DNA containing base sequences expressed by formulae I to III, and used for the production of the anti-Fas monoclonal antibody useful for the treatment, diagnosis, etc., of an autoimmune disease by inducing the apoptosis of autoantibody producing cells remaining in a living body for removing these cells. The DNA is obtained by culturing a hybridoma CH-11 (FERM P-15708) producing the anti-Fas monoclonal antibody in a medium, preparing mRNA from the cells by a usual method, synthesizing a single-stranded cDNA by using the mRNA as a mold, and amplifying the cDNA by a PCR method using primers encoding the parts of the variable regions of heavy and light chains of the monoclonal antibody.