baber/WOPTO huggingface dataset:
Patent TW-I238095-B (TW)
Title: Method for soldering two substrates and solder joints formed therein
Inventor: CHEN SINN-WEN
IPC: B23K35/34
Filed: 2004-04-29
Granted: 2005-08-21
Abstract: This invention forms an indium or indium alloy layer on top of a Sn based lead-free solder. The indium or indium alloy layer can be formed by various methods, such as plating., deposition, printing, dipping, etc. The indium containing layer melts during the soldering process, wets the substrate, and forms a sound solder joint. Since the melting temperature of indium is 156.6 DEG C, even lower than that of the eutectic Sn-Pb which is at 183 DEG C, so the soldering process can be carried at a temperature lower than the conventional soldering process. During the soldering process, the indium reacts with the Sn based Pb-free solder alloy. Since the eutectic temperature of Sn-In is at 120 DEG C, during the short time of the soldering process, the surface of the In deposited Pb-free solder remains as the liquid phase and have a good wetting with the substrates, while a In gradient is formed in the In deposited Pb-free solder.
Patent TW-I253165-B (TW)
Title: Semiconductor device with protection circuit
Inventor: HONJO ATSUSHI
IPC: H01L23/60
Filed: 2004-06-29
Granted: 2006-04-11
Abstract: A semiconductor device having a protection circuit is provided for protecting a semiconductor integrated circuit from the electrostatic discharge. The protection circuit includes a detecting circuit for detecting an ESD event, a trigger circuit for generating a trigger signal in response to an output of the detecting circuit, and a thyristor unit. The thyristor unit has a PNP transistor and a NPN transistor, and works based on the trigger signal from the trigger circuit. The emitter of the PNP transistor is connected to a first terminal of the semiconductor device, and the emitter of the NPN transistor is connected to the second terminal of the semiconductor device and the base of the PNP transistor. The protection circuit further includes a switching element connected between the PNP and the NPN transistors, and controlled by the output of the detecting circuit.
Patent TW-I243730-B (TW)
Title: Method for making hand tool blade
Inventor: TSAI YUNG-TSUEN
IPC: B23K1/008
Filed: 2004-08-20
Granted: 2005-11-21
Abstract: A method for making hand tool blade, implemented in where the blade is a composite structure. The blade includes a cutting portion for cutting purpose, and a base connected to the cutting portion and assembled to the hand tool. A meltable material provided between a connecting interface of the cutting potion and the base, where the meltable material is melted after being subject to heat treatment so as to connect the cutting portion to the base thereby enhancing the bonding force between the cutting portion and the base thereby preventing detachment of the blade after assembly.
Patent TW-I238756-B (TW)
Title: A ratchet mechanism for wrench
Inventor: HUANG RUEI-LUNG
IPC: B25B13/46
Filed: 2004-08-31
Granted: 2005-09-01
Abstract: A ratchet mechanism comprises a handle and a ratchet head. The ratchet head has an inner ratchet teeth ring, two or more pawl-blocks, and a switch lever. The switch lever is used to select catching-direction of the pawl-blocks, each of which has catching teeth on both sides. The pawl-blocks are pivoted on their pivot pins that are arranged at unequal-angled position with respect to each other around the center of the ratchet head such that each of the pawl-block will engage with the inner ratcheting teeth ring by different extent. When the handle turns reversely till one of the pawl-blocks gets engaged with the ratchet teeth completely, then the wrench can be turn forward. Since the pawl-blocks are arranged at unequal-angled position, the angle that the wrench needs to turn backward in order that any one of the pawl-block get engaged completely with the inner ratchet teeth ring become significantly small. This design provides a better pawl force and more operation angle choice.
Patent TW-I278691-B (TW)
Title: Power source circuit
Inventor: YAMAMOTO RYUJI
IPC: H02M3/07
Filed: 2004-09-03
Granted: 2007-04-11
Abstract: This invention provides a power source circuit which produces a DC voltage and an AC voltage to be applied to two ends of a capacitor for obtaining an AC output voltage which is shifted in response to the DC voltage, so that the output voltage is quickly stabilized at the time of the starting of the operation of the power source circuit. A DC voltage is applied to the two ends of capacitor (200) during a given period of time after the operation of the power source is started, and a DC voltage is applied to one end of the capacitor (200) and an AC voltage is applied to another end of the capacitor (200) after the above given period of time is over.
Patent TW-I241661-B (TW)
Title: Semiconductor device and manufacturing method therefor
Inventor: NAGAI KENICHI
IPC: H01L29/423
Filed: 2004-09-13
Granted: 2005-10-11
Abstract: A semiconductor device has a silicon substrate (1), an n-type well region (2) formed in the silicon substrate (1), first and second source/drain regions (8, 18) constructed of a p-type diffusion layer formed on the n-type well region (2), a gate insulator (4) formed in a region located between the first source/drain region (8) and the second source/drain region (18) and a polysilicon (5) formed on the gate insulator (4). The semiconductor device has oxygen-rich layers (9, 19) for blocking a silicide reaction, which layers (9, 19) are formed in an uppermost portion of the silicon substrate (1) on the side of the polysilicon (5), and has an oxygen-rich layer (29) for blocking the silicide reaction, which layer (29) is formed in an upper portion of the polysilicon (5).
Patent TW-I286352-B (TW)
Title: Method of separating semiconductor wafer, and separating apparatus using the same
Inventor: MIYAMOTO SABURO
IPC: H01L21/683
Filed: 2004-09-20
Granted: 2007-09-01
Abstract: With respect to a work obtained by joining a semiconductor wafer and a supporting member to each other via a both-faced adhesive sheet having heating separability, the surface of the supporting member is suction-held at a suction stage and is heated, thereby making the adhesive strength of an adhesive layer almost disappear. A Bernoulli chuck is moved close from the back side of the semiconductor wafer to separate the semiconductor wafer in a non-contact manner and to suspension-hold the semiconductor wafer in a state where the semiconductor wafer floats in the air.
Patent TW-I266497-B (TW)
Title: Device and method of defining symbol timing window for capturing signal
Inventor: DENG JUINN-HORNG
IPC: H04J11/00
Filed: 2004-11-15
Granted: 2006-11-11
Abstract: A device and method of defining symbol timing window for capture signal is provided for an UWB receiver, the characteristic is that a predetermined time T delayed from the start point of a zero-padded prefix is set up to be a start point of a symbol timing window. According to the symbol timing window, a serial of symbol signals are received and each of received symbol signals includes a prefix signal, a received data signal and a guard signal in which the time of the prefix signal is set to T1-T, the time of guard signal is set to T2+T, and T <= T1-T2. In addition, the received data signal and the guard signal are captured, then add the guard signal to the received data signal for output of the sum of the received data signal and the guard signal.
Patent TW-I247387-B (TW)
Title: Method of forming a reduced active area in a phase change memory structure
Inventor: LAI LI-SHYUE
IPC: H01L21/00
Filed: 2004-11-17
Granted: 2006-01-11
Abstract: A phase change memory structure and method for forming the same, the method including providing a substrate comprising a conductive area; forming a spacer having a partially exposed side wall region at an upper portion of the spacer defining a phase change memory element contact area; and, wherein the spacer bottom portion partially overlaps the conductive area. Both these two methods can reduce active area of a phase change memory element, therefore, reducing a required phase changing electrical current.
Patent TW-I365460-B (TW)
Inventor: SHIROISHI ISAO
IPC: G06F3/033
Filed: 2004-11-26
Granted: 2012-06-01
Abstract: A transparent conductive laminate consisting of a transparent polymer substrate, an uneven cured resin layer formed on at least one side of the substrate and a transparent conductive layer formed on the cured resin layer directly or through another layer. The cured resin layer contains fine particles A having an average primary particle diameter of 0.5 to 5 µm and super fine particles C having an average primary particle diameter of 100 nm or less made of a metal oxide and/or a metal fluoride. The above transparent conductive laminate does not cause the deterioration of visibility by sparkling even when a transparent touch panel is mounted on a high-definition display and can prevent "Newton rings" which occurs between two transparent electrode substrates constituting the transparent touch panel.
Patent TW-I266728-B (TW)
Title: Magnetic wrapping band
Inventor: HUANG CHIOU-TIAN
IPC: B65B13/18
Filed: 2005-01-14
Granted: 2006-11-21
Abstract: The present invention relates to a magnetic wrapping band comprising a head portion, a band extending from the head portion and a magnetic iron on the wrapping band. After an object is wrapped by the wrapping tape, the magnetic iron is then employed to position it to a predetermined position. If the object to be wrapped is magnetic, it can be more easily wrapped by the magnetic wrapping tape. In addition, since the magnetic iron can fix the object to be wrapped to a predetermined position, this improves the applicability of the magnetic wrapping band.
Patent TW-I245454-B (TW)
Title: Low sidelobes dual band and broadband flat endfire antenna
Inventor: CHENG SHIH-CHIEH
IPC: H01Q5/28
Filed: 2005-02-02
Granted: 2005-12-11
Abstract: A low sidelobes dual band and broadband flat endfire antenna includes a substrate, a first radiator, a second radiator, two refraction portion, and a conductive element. The substrate has a side surface, a first surface, and a second surface. The first radiator is disposed on the first surface that has a first oblique portion, a first concave portion, and a first electrically connecting portion is disposed opposite to the first concave portion. The second radiator is disposed on the second surface that has a second oblique portion, a second concave portion, and a second electrically connecting portion is disposed opposite to the second concave portion. The second oblique portion is disposed opposite to the first oblique portion to form an angle. The refraction portions are disposed on both of the side surfaces. The conductive element has a conductive body and a grounded conductor electrically connected to the first conductivity portion and the second conductivity portion, respectively.
Patent TW-I271369-B (TW)
Title: Clean magazine
Inventor: CHEN JEN-CHUAN
Filed: 2005-02-03
Granted: 2007-01-21
Abstract: A clean magazine, which is suitable for containing a plurality of semiconductor devices to perform a cleaning process, is provided. Wherein, each semiconductor devices has a cleaning surface. The clean magazine comprises a body and a plurality of flow-guiding plates, wherein the body has at least an open containing space. The flow-guiding plates are disposed in parallel in the containing space and divide the containing space into a plurality of containing slot for containing the semiconductor devices. In addition, the distance from the center portion of each flow-guiding plate to the corresponding cleaning surface is smaller than the distance from the outer portion of each flow-guiding plate to the corresponding cleaning surface. The clean magazine provides superior cleaning effect to the semiconductor devices.
Patent TW-I275150-B (TW)
Title: Embedded chip package structure
Inventor: HSU SHIH-PING
IPC: H01L21/60
Filed: 2005-05-12
Granted: 2007-03-01
Abstract: An embedded chip package structure is proposed. The embedded chip package structure includes a supporting board with at least one of the protruding section, a semiconductor chip formed on the protruding section of the supporting board, a resist layer formed on the supporting board and the semiconductor chip, and a circuit layer formed on the resist layer. The circuit layer is electrically connected to the electrode pads of semiconductor chip via a plurality of conducting structures, and thus the semiconductor chip can electrically extend outside. By varying the thickness of the protruding section, the resist layer and the supporting board, the warp of the package structure because of temperature change is controlled during the fabricated process.
Patent TW-I250555-B (TW)
Title: Substrate and method of fabricating the same
Inventor: TU CHAO-CHEN
IPC: H01L21/02
Filed: 2005-05-24
Granted: 2006-03-01
Abstract: A substrate comprising a dielectric layer and at least one conductive piece is provided. The dielectric layer comprises a first surface and a second surface. The first surface is opposite to the second surface. The conductive piece comprising a first bump, a second bump and a metal layer sandwiched in between them is arranged inside the dielectric layer. A patterned first and second circuit layer may be further arranged on the first and second surface of the dielectric layer respectively. The first circuit layer is electrically connected to the second circuit layer through the solid conductive piece, to improve the reliability of the substrate.
Patent TW-I385242-B (TW)
Title: Flame-retardants
Inventor: PAUQUET JEAN-ROCH
IPC: D04H1/413
Filed: 2005-05-24
Granted: 2013-02-11
Abstract: Organic polymer compositions can be made flame-retardant by addition of selected organic phosphate and other components, such as known flame-retardants or conventional additives for further improvements, e.g. in flame retardancy or light stability.
Patent TW-I268589-B (TW)
Title: Electronic apparatus with thermal module
Inventor: YANG CHIH-AN
IPC: H01L23/34
Filed: 2005-06-03
Granted: 2006-12-11
Abstract: The present invention provides an electronic apparatus comprising a package, a circuit board, a thermal dissipating module and a thermal transmitting module. The package comprises a substrate, a heat source and a plurality of electric terminals to electrically connect to the circuit board The heat source and the electric terminals are disposed on a surface of the substrate facing to the circuit board, the heat source is located between the substrate and the circuit board The thermal transmitting module according to the present invention passes through the electric connection structure between the package and the circuit board and connects the heat source of the package with the thermal dissipating module. Thus, the thermal transmitting module enhances the thermal dissipating efficiency for the heat source of the package and improves the reliability of the electronic apparatus.
Patent TW-I266593-B (TW)
Title: Loop-type heat-dissipating module
Inventor: LIU TAY-JIAN
IPC: H05K7/20
Filed: 2005-07-08
Granted: 2006-11-11
Abstract: A loop-type heat-dissipating module is disclosed, which includes a heat transfer loop and a fixing cover attached to the loop. The loop includes, in serials, an evaporator, an outgoing duct for transferring vapor, a condenser and an incoming duct for transferring condensate. The cover includes a fixing plate for securing the evaporator of the loop, and an air-guiding member extending from one end of the fixing plate for receiving the condenser of the loop. Thus, all parts of the module are incorporated together to form a thin and compact profile, which can satisfy the cooling requirements of thin-type electronic devices and facilitate the mounting or dismounting of the module to or from the electronic devices.
Patent TW-I259030-B (TW)
Title: Dimming control circuit for light-emitting diodes
Inventor: LEE RONG-CHIN
IPC: H05B37/02
Filed: 2005-07-19
Granted: 2006-07-21
Abstract: A dimming control circuit generates a dimming control signal for determining brightness of at least one light-emitting diode. The dimming control signal has a plurality of bright-dark cycles, each of which consists of a bright phase and a dark phase. The bright phase starts with an adaptive rising portion. The adaptive rising portion restricts the brightness of the at least one light-emitting diode to increase gradually from zero.
Patent TW-I288733-B (TW)
Title: Plastic packing box
Inventor: HO CHIN-SHU
IPC: B65D6/02
Filed: 2005-08-18
Granted: 2007-10-21
Abstract: A plastic packing box including a first plastic piece and a second plastic piece is provided. The second plastic piece has a faying section and a containing capacity section, wherein the containing capacity section is composed of a portion of the second plastic piece. The faying section is suitable for fitting the first plastic piece. When the faying section fits the first plastic piece, the containing capacity section and the first plastic piece surround a space in order to put in a solid object. The containing capacity section includes a lateral area and a top area, wherein the lateral area is connected between the top area and the faying section. The second plastic piece has a first continuous slit pattern located on a common boundary of the lateral area and the top area, and has a second continuous slit pattern located on a common boundary of the lateral area and the faying section. When the first continuous slit pattern and the second continuous slit pattern are destroyed, the top area separates from the lateral area, and the lateral area separates from the faying section.
Patent TW-I283121-B (TW)
Title: Encryption and decryption method depending to modules
Inventor: HUANG JR-YUAN
IPC: H04L9/32
Filed: 2005-10-04
Granted: 2007-06-21
Abstract: A module dependent encrypted and decrypted method comprises the steps of inputting a password, each character of the password is mapped to a corresponding character through a first module. All the corresponding character is arranged to have a first data stream. The data stream is inputted into a random function to derive a second data stream. Some of the characters in the second data stream are used to arranged as a third data stream. The third data stream is mapped to get a fourth data stream through a second module. The fourth and first data stream are operated through a conversion function so as to get an output data stream. The output data steam and third data stream are stored in a database.
Patent TW-I404388-B (TW)
Title: Medium access control layer architecture for supporting enhanced uplink
Inventor: STEPHEN E TERRY
IPC: H04W28/04
Filed: 2005-05-02
Granted: 2013-08-01
Abstract: A medium access control (MAC) layer architecture and functionality for supporting enhanced uplink (EU). A MAC entity for EU, (i.e., a MAC-e entity), is incorporated into a wireless transmit/receive unit (WTRU), a Node-B and a radio network controller (RNC). The WTRU MAC-e handles hybrid-automatic repeat request (H-ARQ) transmissions and retransmissions, priority handling, MAC-e multiplexing, and transport format combination (TFC) selection. The Node-B MAC-e entity handles H-ARQ transmissions and retransmissions, E-DCH scheduling and MAC-e de-multiplexing. The RNC MAC-e entity provides in-sequence delivery and handles combining of data from different Node-Bs.
Patent TW-I289665-B (TW)
Title: Detecting device for heat pipes
Inventor: LIU TAY-JIAN
IPC: G01N25/18
Filed: 2006-01-13
Granted: 2007-11-11
Abstract: A detecting device for heat pipes includes an immovable portion and a movable portion. The immovable portion has heating member for providing heat to a heat pipe needing to be detected. The movable portion is removably attached to the immovable portion. At least a receiver configuration for receiving the heat pipe is defined between the immovable and movable portions. Two positioning flanges are located between the immovable and movable portions, for preventing the immovable and movable portions from deviating from each other. In use, the heat pipe thermally close contacts an inner face of the receiver configuration, via at least a temperature sensor attached to the inner face of the receiver configuration, performance of the heat pipe can be detected.
Patent TW-I281871-B (TW)
Title: Stepped deceleration magnetic control system for exercising device
Inventor: JOU MING-FU
IPC: A63B21/005
Filed: 2006-03-15
Granted: 2007-06-01
Abstract: The present invention provides a stepped deceleration magnetic control system for an exercising device, comprising a flywheel having an internal circumference to which a plurality of magnetic conductors having magnetic conductivity is mounted; a magnetic control assembly arranged in the flywheel and comprising two magnetic control pieces that are opposite to each other and are rotatable and that cause magnetic interaction with the magnetic conductors; and a driving piece arranged between the magnetic control pieces for pushing and effectively abutting against the magnetic pieces to do sideway swinging so that the magnetic control pieces may respectively assume different distance from the magnetic conductors to provide different magnetic damping results thereby realizing speed adjustment in a multiple step manner.
Patent TW-I290451-B (TW)
Title: Improvement structure for tapped hole contact spring
Inventor: YEH WU-SHEN
IPC: H05K7/12
Filed: 2006-04-06
Granted: 2007-11-21
Abstract: The present invention provides an improvement structure of a tapped hole contact spring that is utilized to tightly connect the tapped holes with different bore diameters to assemble the hard disk driver to the casing. The center of the main body of the tapped hole contact spring is bent toward a side to form an inclined angle together with the main body so as to dispose a connection strip. A contact portion is protruded from the top of the connection strip toward the same bent side of the strip. A plurality of elastic contact strips slightly/outwardly protruded are extended to the tip of the top from the bottom of the contact portion and have an end connected to the tip to prop the internal wall of the tapped hole. The present invention utilizes the elastic deformation of the elastic spring to incorporate with the tapped holes having different bore diameters, thereby achieving the goal of tight connection with the tapped hole.
Patent TW-I286203-B (TW)
Title: Single phonetic symbol retrieval method for electronic device and apparatus thereof
Inventor: TSAI DUNG-SHENG
IPC: G06F17/30
Filed: 2006-08-17
Granted: 2007-09-01
Abstract: A single phonetic symbol retrieval method for electronic device having an input method database comprises the following steps: (A) inputting the phonetic symbols of a plurality of characters; (B) retrieving the input method database for at least one index data having the same first phonetic symbols as the characters; and (C) displaying the retrieval result of the index data. Since there is no need to input the complete phonetic symbols but only the first phonetic symbol of each character of an index data for retrieving the index data, not only the retrieval efficiency is improved but also the retrieval time is shortened.
Patent TW-I405319-B (TW)
Title: Stacked integrated circuit chip assembly
Inventor: VOS CHAD A
IPC: H01L23/12
Filed: 2006-10-13
Granted: 2013-08-11
Abstract: A stacked arrangement of integrated circuit chips are bonded to a lead frame. Two side-by-side integrated circuit chips have bottom contact pads bonded to a lead frame structure having contact terminals. The two side-by-side integrated circuits have top contact pads bonded to an overlying integrated circuit chip. A low profile integrated circuit assembly is achieved without using bond wires or preforms, and which is well adapted for SO-8 packages.