baber/WOPTO huggingface dataset:
Patent TW-202102571-A (TW)
Title: Composition for forming organic film, patterning process, and polymer
Inventor: KORI DAISUKE
IPC: C08G61/02
Filed: 2020-05-14
Abstract: A composition for forming an organic film contains a polymer having a partial structure shown by the following general formula (1A) or (1B), and an organic solvent, where Ar 1 
and Ar 2 
represent a benzene ring or naphthalene ring which optionally have a substituent; X represents a single bond or a methylene group; a broken line represents a bonding arm; R represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; and W 1 
represents a hydroxyl group, an alkyloxy group having 1 to 10 carbon atoms, or an organic group having at least one aromatic ring optionally having a substituent. Thus, this invention provides: a composition for forming an organic film, the composition containing a polymer with high carbon content and thermosetting property as to enable high etching resistance and excellent twisting resistance; a patterning process using the composition; and a polymer suitable for the composition for forming an organic film.   或
Patent TW-202103663-A (TW)
Title: Absorbent article
Inventor: SHIRAKAWA TAKASHI
IPC: A61F13/49
Filed: 2020-05-25
Abstract: The absorbent article of the present invention is equipped with an absorbent main body (10) including a top sheet (2), an absorber (4), and a leakproof sheet (3). The absorbent main body (10) has a pair of side flap portions (SF, SF) extending from the absorber (4) and a waist flap portion (WF). An exterior sheet (5) is arranged on the non-skin facing surface side of the absorbent main body (10). The exterior sheet (5) has a ridge-and-furrow shape (5A) in which ridges (51) and furrows (52) alternate, extending in the longitudinal direction (X) or the width direction (Y). In the absorbent article, the region where the ridge-and-furrow shape (5A) is formed in the exterior sheet (5) overlaps with elastic members (65) for forming leg gathers in the side flap portions (SF) or with an elastic member (67) for forming a waist gather in the waist flap portion (WF).
Patent TW-202145673-A (TW)
Inventor: YEN WEI-TING
IPC: H01M10/42
Filed: 2020-05-28
Abstract: 一種智慧電池裝置包括一儲能單元、一溫度感測單元、一儲存單元，及一處理單元。處理單元計算儲能單元的一內阻值，用以得到對應於內阻值的一第一增量；偵測對電池裝置進行充電的的一充電電壓，用以得到對應於充電電壓的一第二增量。處理單元偵測儲能單元的一放電電流，用以得到對應於放電電流的一第三增量。處理單元更讀取儲存單元中的一充放次數，用以得到對應於充放次數的一第四增量；讀取來自溫度感測單元的一溫度，用以得到對應於溫度的一第五增量。處理單元依據第一、第二、第三、第四、第五增量的一乘積值，判斷電池裝置的膨脹率。
Patent TW-202039216-A (TW)
Title: Composite preform, composite container, composite preform, plastic member, and method for producing composite container
Inventor: MIYAWAKI TAKUMA
IPC: B65D1/02
Filed: 2015-12-08
Abstract: A composite container according to the present invention includes: a container body which is made of a plastic material; and a plastic member disposed on the outer surface of the container body, wherein the container body and the plastic member are integrally inflated by means of blow molding, and wherein the plastic member includes a colored layer and/or a print layer where a print is made.
Patent TW-202111067-A (TW)
Title: Adhesive composition improving packaging reliability and not causing residual adhesive contamination
Inventor: HOU MENG
IPC: C09J133/02
Filed: 2020-06-22
Abstract: The present invention relates to an adhesive composition. The present invention provides an adhesive composition which prevents an increase in adhesion over time, has an excellent peelability and an operability. When being used in the manufacturing process of a semiconductor device, the adhesive composition can improve packaging reliability, and does not cause residual adhesive contamination. In the adhesive composition of the present invention, the rate of change y of the adhesive force calculated by the following formula (1) is 200% or less, preferably 150% or less, y=Fb/Fa (1). In formula (1), y represents a rate of change in the adhesive force; Fa represents the adhesive force of the adhesive composition at room temperature; Fb represents the adhesive force after the adhesive composition is heated at 100 to 180 DEG C, preferably 120 to 150 DEG C for 3 to 60 minutes, preferably 5 to 30 minutes.
Patent TW-202115010-A (TW)
Title: A substituted tetrahydroisoquinoline derivative as a d1 positive allosteric modulator
Inventor: ATES ALI
IPC: A61K31/4725
Filed: 2020-06-30
Abstract: The present invention relates to compound according to formula (I), 
which is a positive allosteric modulator of D1 and accordingly of benefit as pharmaceutical agent for the treatment of diseases in which D1 receptors play a role.
Patent TW-202115930-A (TW)
Title: Lid material for light-emitting device, method for manufacturing lid material, and light-emitting device
Inventor: MURAKAMI TATSUYA
IPC: H01L33/52
Filed: 2020-07-09
Abstract: A light-emitting device (10) houses an LED chip (13) in a cavity (111) of a ceramic package (11) and seals an opening of the cavity (111) with a crystal lid (12). A lid material (20) before being sealed is obtained by using the crystal lid (12) as a lid body and forming a first metallization film (41) on a sealing surface of the crystal lid (12). The first metallization film (41) includes: a first metal layer (411) that is formed directly on the crystal lid (12); and an alloy layer (43) that contains a brazing material (Au-Sn) on the first metal layer (411). The first metal layer (411) has a single-layer structure that is formed from a Ti film having a film thickness of 20-700 nm.
Patent TW-202204132-A (TW)
Title: Automatic material changing mechanism of 3d printer
Inventor: CHEN CHIH-WEN
IPC: B33Y40/00
Filed: 2020-07-15
Abstract: The present invention provides an automatic material changing mechanism of 3D printer, comprising an extruder unit containing an extruder outlet, a driving mechanism that correspondingly connects and transmits itself to a loading unit. The loading unit has multiple loading holes that correspond to the extruder outlet and a transmission route is formed between the adjacent loading holes. The driving mechanism transmits the loading unit along the transmission route to make the loading holes correspond to the extruder outlet. A feeding unit corresponds to the extruder outlet and the loading holes of the extruder outlet, which pushes material towards the extruder outlet. Thereby, the present invention is a modular plugin setting, which can apply to Fused Deposition Modeling, FDM 3D printer and does not need to change the platform design of 3D printer. It can automatically change material based on color or material during the process of printing without having the process of stopping, returning material or other processes. It can increase the efficiency of 3D printing and providing the continuity of the junction of changing material, which can increase the quality and accuracy of 3D printing products.
Patent TW-202117131-A (TW)
Title: Surface modified cellulose fiber
Inventor: BALLET WIM
IPC: C08J5/06
Filed: 2020-07-17
Abstract: A process for producing surface modified bleached chemical pulp fiber comprising fluidizing the bleached chemical pulp fiber and contacting the fluidized bleached chemical pulp fiber with an aerosol of a surface modifying composition comprising a surface modifying compound
Patent TW-202123240-A (TW)
Title: Semiconductor memory device, semiconductor memory system and method of driving the same
Inventor: KIM TAE-HO
IPC: G11C29/42
Filed: 2020-08-03
Abstract: A semiconductor memory device includes a resistive change memory device including a control circuit block and a plurality of memory decks electrically connected with the control circuit block. The semiconductor memory device includes a pattern generation block, a position correction block and a position determination block. The pattern generation block receives a row address, a column address and a deck selection signal to generate a plurality of pattern generation signals to select a plurality of memory cells in the memory deck in various patterns. The position correction block receives a temporary code for classifying the memory cells into a temporary near cell region and a temporary far cell region and for reflecting a position of the memory deck in the temporary code to output a correction code. The position determination block is configured to generate first to third reset signals to reset a near cell region, a middle cell region and a far cell region based on the pattern generation signals and the correction code.
Patent TW-202110861-A (TW)
Title: Novel silylcyclodisilazane compound and method for manufacturing silicon-containing thin film using the same
Inventor: JANG SE-JIN
IPC: C23C16/30
Filed: 2020-08-14
Abstract: Provided is a novel silylcyclodisilazane compound, a composition for depositing a silicon-containing thin film containing the same, and a method for manufacturing the silicon-containing thin film using the same, and since the silylcyclodisilazane compound of the present invention has high reactivity, thermal stability and high volatility, it can be used as a silicon-containing precursor, thereby manufacturing a high-quality silicon-containing thin film by various deposition methods.
Patent TW-202116416-A (TW)
Title: Catalyst for use in esterification reaction and synthesis method thereof
Inventor: HSIEH CHIA-WEI
IPC: B01J32/00
Filed: 2020-08-18
Abstract: A catalyst for use in an esterification reaction includes a polar solvent, a plurality of carriers, and a plurality of metal coordination polymers. The carriers are dispersed in the polar solvent and include metal hydroxide, metal oxide, metal chloride, metal nitride, metal sulfide, silicon oxide, or a combination thereof. The metal coordination polymers include titanate hydrolysate, aluminate hydrolysate, zirconate hydrolysate or a combination thereof. Some metal coordination polymers are attached to these carriers to form a plurality of particles. The average particle size of these particles is in a range of 10nm to 1µm. Other metal coordination polymers are dispersed in the polar solvent.
Patent TW-202213285-A (TW)
Inventor: CHEN YOU-GANG
IPC: G01F23/60
Filed: 2020-09-16
Abstract: 一種淹水警示方法，適用於偵測場域，淹水警示方法包含：以攝像機拍攝偵測場域以取得關聯於偵測場域的原始影像，其中原始影像包含預設偵測區域，以處理器對原始影像執行影像處理程序以取得處理後影像，且將預設偵測區域重疊於處理後影像，以處理器計算處理後影像的積水區域與預設偵測區域重疊的比例值，以處理器判斷比例值是否落入警示值域，以及當判斷比例值落入警示值域時，以處理器輸出警示通知。
Patent TW-202212246-A (TW)
Title: Rod fixing structure includes a main body, a fixing module, and an engaging module
Inventor: CHIEN CHIH-YANG
IPC: F16B7/18
Filed: 2020-09-16
Abstract: The present invention provides a rod fixing structure, which is a fixing structure accommodated in a telescopic rod. A second rod and a third rod are linked through the rod fixing structure. The structure includes a main body disposed at one end of the second rod, a fixing module accommodated in the main body, and an engaging module having a first engaging unit and a second engaging unit. When the first rod moves in the second rod, the engaging module is moved upward by the first rod to push the fixing module and release the connection between the third rod and the second rod. When the first rod continues to move upward in the second rod, the pushed fixing module rebounds and returns to its original position. At this time, the engaging module of the first rod is engaged with the fixing module of the second rod so as to link the second rod to move upward.
Patent TW-202111772-A (TW)
Title: Substrate processing method, substrate processing apparatus and a computer-readable storage medium
Inventor: Noda yasuaki
IPC: H01L21/027
Filed: 2017-02-20
Abstract: A processing method in one embodiment includes: a step that takes an image of the end face of a reference substrate, whose warp amount is known, over the whole periphery thereof using a camera to obtain shape data of the end face of the reference wafer over the whole periphery of the reference wafer; a step that takes an image of the end face of a wafer over the whole periphery thereof using a camera to obtain shape data of the end face of the wafer over the whole periphery of the wafer; a step that calculates warp amount of the wafer based on the obtained shape data; a step that forms a resist film on a surface of the wafer; a step that determines the supply position from which an organic solvent is to be supplied to a peripheral portion of the resist film and dissolves the peripheral portion by the solvent supplied from the supply position to remove the same from the wafer.
Patent TW-202122435-A (TW)
Title: Thickener with fine grain structure with improved usability
Inventor: BONG HYO-JIN
IPC: C08F220/58
Filed: 2020-09-24
Abstract: The present invention relates to a microparticle-structured thickener having improved sensation of use. Even when swelling in an aqueous phase, the thickener according to the present invention shows the advantage of retaining the form of particles as well as appearing transparent and being high in stability because the particles disperse homogeneously.
Patent TW-202128773-A (TW)
Title: Anti-human trop-2 antibody and application thereof
Inventor: WANG SHUANG
IPC: C07K16/30
Filed: 2020-10-12
Abstract: The present invention provides an antibody binding a human tumor-associated calcium signal sensor 2 (Trop-2) protein or fragments thereof, and use of the antibody or fragments thereof in preventing or treating diseases. The antibody or fragments thereof of the present invention can effectively bind to the human Trop-2 protein, and have internalization activity, and the internalization activity is enhanced after ADC drug labeling, and the in vivo efficacy and safety of a mouse model are not lower than those of a control antibody.
Patent TW-202122496-A (TW)
Title: Rapid hydrosilylation cure composition
Inventor: CUMMINGS MICHELLE
IPC: B29C35/02
Filed: 2020-11-09
Abstract: A composition contains a blend of linear and resinous alkenyl functionalized polyorganosiloxanes, a blend of linear and resinous silyl hydride functionalized polyorganosiloxanes, and a hydrosilylation catalyst where the linear silyl hydride functionalized polyorganosiloxanes has a ratio of D/D<SP>H</SP> that is greater than 2.0 and less than 14, the molar and the ratio of silyl hydride hydrogens to the sum of terminal alkenyl functionality on the alkenyl functionalized polyorganosiloxane is 1.2-2.2.
Patent TW-202218788-A (TW)
Inventor: LAI I-CHUN
IPC: B23K26/36
Filed: 2020-11-13
Abstract: A porous structure includes a plurality of structure layers stacked on each other, wherein a single structure layer includes a plurality of structure bars arranged at intervals and a plurality of holes are formed between the plurality of structure layers. The manufacturing method is to provide a powder pile composed of a plurality of powders, and set the reality rate of the porous structure, and then scan the powder pile according to the target information with a laser to sinter the plurality of powders to form the porous structure. Moreover, the target information contains multiple parameters, so the user only needs to input the parameters of the target information to make the laser to produce the porous structure, without drawing a picture of the porous structure in the computer.
Patent TW-202132282-A (TW)
Title: Matrix metalloproteinase (mmp) inhibitors and methods of use thereof
Inventor: YANG WENJIN
IPC: A61P1/16
Filed: 2020-11-16
Abstract: Hydantoin based compounds useful as inhibitors of matrix metalloproteinases (MMPs), particularly macrophage elastase (MMP-12) are described. Also described are related compositions and methods of using the compounds to inhibit MMP-12 and treat diseases mediated by MMP-12, such as asthma, chronic obstructive pulmonary disease (COPD), emphysema, acute lung injury, idiopathic pulmonary fibrosis (IPF), sarcoidosis, systemic sclerosis, liver fibrosis, nonalcoholic steatohepatitis (NASH), arthritis, cancer, heart disease, inflammatory bowel disease (IBD), acute kidney injury (AKI), chronic kidney disease (CKD), Alport syndrome, and nephritis.
Patent TW-202137558-A (TW)
Title: Gate spacing in integrated circuit structures
Inventor: BOUCHE GUILLAUME
IPC: H01L29/43
Filed: 2020-12-03
Abstract: Discussed herein is gate spacing in integrated circuit (IC) structures, as well as related methods and components. For example, in some embodiments, an IC structure may include: a first gate metal having a longitudinal axis; a second gate metal, wherein the longitudinal axis of the first gate metal is aligned with a longitudinal axis of the second gate metal; a first dielectric material continuously around the first gate metal; and a second dielectric material continuously around the second gate metal, wherein the first dielectric material and the second dielectric material are present between the first gate metal and the second gate metal.
Patent TW-202223554-A (TW)
Inventor: WU YU-JUNG
IPC: H01L21/68
Filed: 2020-12-11
Abstract: 一種具自我對準定位之晶片移載方法，包含：載晶座成型步驟、液體添加步驟、晶片搬運步驟、承載基板搬移步驟及晶片轉移步驟。並且，一種具自我對準定位之晶片移載設備，包含：承載基板、液體添加裝置、晶片搬運裝置、承載基板搬移裝置及晶片轉移裝置。於承載基板的承載面形成複數個分隔溝槽，該承載面具有親水性，該分隔溝槽具有疏水性，複數個該分隔溝槽形成複數個載晶座。液體聚集於複數個該載晶座。晶片受該液體之表面自由能而被定位及被承載於各個該載晶座。對於該承載基板施加電磁波而使液體受熱蒸發，各個該晶片脫離各個該載晶座而至接收基板的接收面。
Patent TW-202228782-A (TW)
Title: Composition for weight loss
Inventor: CHOU PING-JUNG
IPC: A61K47/32
Filed: 2020-12-15
Abstract: Composition for weight loss is configured to increase the satiety by the water swelling characteristics of swelling agent and water-soluble fiber after eating. Further, the swelling agent and the water-soluble fiber have the characteristics of not being absorbed by the body at all, which can help users to defecate. In this way, the composition for weight loss of the present invention can effectively reduce weight without affecting endocrine.
Patent TW-202122781-A (TW)
Title: Spectroscopic assembly and apparatus
Inventor: HRUSKA CURTIS R
IPC: G01N21/25
Filed: 2017-04-05
Abstract: A spectroscopic assembly may include a spectrometer. The spectrometer may include an illumination source to generate a light to illuminate a sample. The spectrometer may include a sensor to obtain a spectroscopic measurement based on light, reflected by the sample, from the light illuminating the sample. The spectroscopic assembly may include a light pipe to transfer the light reflected from the sample. The light pipe may include a first opening to receive the spectrometer. The light pipe may include a second opening to receive the sample, such that the sample is enclosed by the light pipe and a base surface when the sample is received at the second opening. The light pipe may be associated with aligning the illumination source and the sensor with the sample.
Patent TW-202222742-A (TW)
Title: Method for quickly producing organic fertilizer from organic waste including a solid-liquid separation step, a foreign matter removal step, a modification step, a pulverization step, a dehydration step, a pretreatment step and a reaction step
Inventor: Zhang yong-qi
IPC: C05F11/08
Filed: 2020-12-14
Abstract: A method for quickly producing organic fertilizer from organic wastes, which includes: a solid-liquid separation step, a foreign matter removal step, a modification step, a pulverization step, a dehydration step, a pretreatment step and a reaction step; wherein the modification step is to adjust the properties of organic waste by using auxiliary materials; the pulverization step and the dehydration step are to pulverize the solid organic waste into small-particle organic waste scraps; the pretreatment step is to add microorganisms and/or enzymes to the organic waste scraps and perform preheating and pre-mixing with the waste heat generated in the reaction step; the reaction step is to gradually heat up the materials to a completion temperature by several preset temperature-raising operation intervals according to the type of organic wastes, and then maintain for a preset time length to gradually dry the materials to form organic fertilizer. The method of the present invention can quickly produce organic fertilizer from organic wastes within a few hours, which is better than the conventional composting method.
Patent TW-202126760-A (TW)
Title: Curable composition and organic el display device
Inventor: TOMITA YUSUKE
IPC: C09K3/10
Filed: 2020-12-16
Abstract: The present invention provides a curable composition, which is a curable composition used in the sealing of an organic EL element, and contains a cationic polymerizable compound and a polymerization initiator. The cationic polymerizable compound includes at least one of a compound A represented by the general formula (1) and a compound B represented by the general formula (2). 
(In the general formula (1), R 1 
represents an alkyl group with carbon numbers of 8 or more; in addition, in the general formula (2), R 2 
represents an alkyl group with carbon numbers of 8 or more)
Patent TW-202133585-A (TW)
Title: Methods and apparatus for sequence design based on subsampling
Inventor: YANG WEI
IPC: H04L5/00
Filed: 2020-12-18
Abstract: The present diselosure relates to methods and deviees for wireless eommunieation. Aspeets of the present diselosure ean determine a matrix or Hadamard matrix assoeiated with signal transmission, the matrix or Hadamard matrix ineluding M rows and M eolumns. Also, aspeets of the present diselosure ean determine a sampling funetion for generating a set of sequenees from the matrix or Hadamard matrix. Aspeets of the present diselosure ean also generate the set of sequenees by sampling one of a set of rows or a set of eolumns based on the determined sampling funetion. Aspeets of the present diselosure ean also transmit a signal derived based on at least one sequenee of the set of sequenees.
Patent TW-202136219-A (TW)
Title: Trpml modulators
Inventor: FORTANET JORGE GARCIA
IPC: A61P21/00
Filed: 2020-12-18
Abstract: The present invention provides compounds, pharmaceutically acceptable compositions thereof, and methods of using the same.
Patent TW-202141707-A (TW)
Inventor: Yeh Shu-Shen
IPC: H01L23/498
Filed: 2021-01-08
Abstract: A method for forming a chip package structure is provided. The method includes disposing a first chip structure and a second chip structure over a wiring substrate. The first chip structure is spaced apart from the second chip structure by a gap. The method includes disposing a ring structure over the wiring substrate. The ring structure has a first opening, the first chip structure and the second chip structure are in the first opening, the first opening has a first inner wall, the first inner wall has a first recess, and the gap extends toward the first recess.
Patent TW-202127570-A (TW)
Inventor: DAUGHERTY JOHN
IPC: H01L21/677
Filed: 2016-10-17
Abstract: A wafer transport assembly includes first and second wafer transport modules, and a buffer module coupled between the first and second wafer transport modules. The first and second wafer transport modules and the buffer module are aligned in a single directional axis. The buffer module includes a first buffer stack positioned at a first lateral end of the buffer module, and a second buffer stack positioned at a second lateral end of the buffer module. The first lateral end of the buffer module defines a first side protrusion nested between the first and second wafer transport modules and first and second process modules. The second lateral end of the buffer module defines a second side protrusion that is nested between the first and second wafer transport modules and third and fourth process modules. The first and second wafer transport modules and the buffer module define a continuous controlled environment.