baber/WOPTO huggingface dataset:
Patent TW-367282-B (TW)
Title: Vacuum laminating device and vacuum laminating method
Inventor: OGAWA AKIHIKO
IPC: H05K3/02
Filed: 1998-05-12
Granted: 1999-08-21
Abstract: A kind of vacuum laminating device which is to install the film body on opposite faces of the upper and lower plates; the frame is mounted on the lower plate and forms the forming space when the upper and lower plates approach each other; the film body is fixed on the heating device with specific flexibility and stiffness; a flow path for circulating the refrigerant on the upper plate; the forming material for the volume not being reduced for the forming space; then separate the film body and used it for compression and heating with heating device and employ the mold at the cavity to cool the forming material.
Patent TW-528764-B (TW)
Title: Polymerisation process
Inventor: LALANNE-MAGNE CLAUDINE VIVIANE
IPC: C08F210/06
Filed: 1998-06-26
Granted: 2003-04-21
Abstract: The present invention relates to a continuous gas fluidised bed process for the polymerisation of olefin monomer(s) wherein the recycled gaseous stream withdrawn from the reactor is divided into two streams (A and B) and that (a) a first stream (A) having been cooled to a temperature at which liquid condenses out is then reintroduced directly into the fluidised bed in the reactor in such a way that, at any time, said condensed liquid is continuously introduced into said bed at a minimum rate of 10 liters of liquid per cubic meter of fluidised bed material per hour, and (b) a second stream (B), which by-passes the above cooling/condensing step, is passed through an exchanger and is then reintroduced into the reactor. The continuous introduction of a liquid into the reactor reduces or even eliminates fouling problems which can encountered in conventional gas phase olefin polymerisation processes.
Patent TW-422989-B (TW)
Title: Sense amplifier for flash memories
Inventor: TEDROW KERRY D
IPC: G11C11/56
Filed: 1998-07-23
Granted: 2001-02-21
Abstract: A sense amplifier for a nonvolatile writeable memory is described. The sense amplifier has a preamplifier coupled to receive a signal from a cell of the nonvolatile writeable memory. The preamplifier uses a grounded-gate p-channel metal-oxide semiconductor input stage. A differential input latch is coupled to the preamplifier output. The differential input latch uses a pair of cross-coupled inverters. A logic device is coupled to the differential input latch output and provides the sense amplifier output signal. The logic device reduces the offset in the differential input latch and provides an output indicative of one of a number of states or voltage levels of the cell.
Patent TW-388968-B (TW)
Title: Improved laser fuse links and methods therefor
Inventor: WEIGAND PETER
IPC: H01L21/8242
Filed: 1998-09-11
Granted: 2000-05-01
Abstract: A dynamic random access memory integrated circuit implemented on a silicon substrate. The dynamic random access memory integrated circuit includes a main memory array having main memory array elments, and a redundant memory array coupled to the main memory array. The reducndant memory array includes redundant memory array elements, each of the redundant memory array elements being configured to replace a defective one of the main memory array elements. The dynamic random access memory integrated circuit includes a plurality of laser fuse links (202, 204, 206, and 208) coupled to the redundant memory array. A first laser fuse link of the plurality of laser fuse links is configured to be modified by a laser beam during fabrication of the dynamic random access memory intergrated circuit to set a value of an address fuse for a first one of the redundant memory array elements. The dynamic random access memory integrated circuit also includes a plurality of shielding portions (402, 404, 406, and 408) underlying the laser fuse links. The shielding portions are configured to substantially minimize laser-induced damage from the laser beam to a first area underlying the shielding portion when the first laser fuse link is set with the laser beam.
Patent TW-366441-B (TW)
Title: Mask image scanning and exposure system and the method
Inventor: LIN CHIN-HSIANG
IPC: G03F9/00
Filed: 1999-01-15
Granted: 1999-08-11
Abstract: A mask image scanning and exposure system and the method, including a supporting device for supporting machining elements, a source of exposure radioactive light beams, an input control for transmitting dynamic mask, with a plurality of matrices having a plurality of actuator lines in vertical arrangement and penetrable and impenetrable binary image pixel units as the actuator lines, in which the dynamic mask has upper surface and lower surface; the connection control system for supplying scanning pixel control signals to the actuator line on the dynamic mask, for forming the scanning pattern in the penetrable and impenetrable areas. The light beam is projected directly onto the upper surface of the mask and onto the machining element through the slit of the diaphragm. The light beam passes the penetrable areas and the mask projects a pattern onto the supporting device where the machining element is located.
Patent TW-419620-B (TW)
Title: Numerical control device
Inventor: KURAKAKE MITSUO
IPC: G05B19/4093
Filed: 1999-03-08
Granted: 2001-01-21
Abstract: A numerical control device is composed of a numerical control portion and a display control portion. An operating system executable in semiconductor memory and software for display control are stored inside a ROM of the display control portion. A machine operation portion composed of a keyboard and a machine operation panel is connected to the display control portion, and communication between the machine operation portion and the numerical control device is performed in real-time. User created software is stored in a non-volatile memory through a communication port with a data I/O device and the stored software is executed. A display device and machine operation portion can be arranged close together to improve the operability even if the numerical control portion and the display control portion are separated.
Patent TW-429592-B (TW)
Title: Manufacturing method for semiconductor device
Inventor: KITANO MAKOTO
IPC: G01R31/26
Filed: 1999-03-17
Granted: 2001-04-11
Abstract: The present invention provides an electronic characteristic inspection procedure on a process for manufacturing the semiconductor device, so as to conduct an overall inspection with a large area on the electrode pad of the inspected object. By using the same number as the inspected object conductor in the inspection object range of the inspected object, it can push the inspection structure of electrically independent bumps onto the inspected object for performing an electronic characteristic inspection.
Patent TW-476928-B (TW)
Title: Liquid crystal device and projection display device using same
Inventor: OGAWA YASUNORI
IPC: G02F1/13
Filed: 1999-06-15
Granted: 2002-02-21
Abstract: To raise the contrast of the display image. The liquid crystal device of the present invention comprises a plurality of pixels arranged in a matrix, each pixel having an opening to allow passage of light, and an array of micro-lenses arranged in a matrix that divides the illumination light into a plurality of partial light beams and converges the light beams to a light incidence plane of the pixels. The center of each micro-lens of the micro-lens array is obliquely allocated on the center axis of each pixel, so that the proportion of light exiting from the opening of each pixel substantially parallel to a clear viewing direction is larger compared to the proportion of light parallel to the other directions.
Patent TW-410324-B (TW)
Title: A co-processor with programmable voice decompression engine
Inventor: JENG TIAN-YAU
Filed: 1999-06-17
Granted: 2000-11-01
Abstract: In order to solve the cost issue and complex operation process resulted from using 16-bits digital processor to run voice decompression algorithm, we propose the co-processor with programmable voice decompression engine. The invention is only using 8-bits microprocessor to achieve the purpose for voice compression. This structure not only does not affect the quality of voice but reduces the cost.
Patent TW-432570-B (TW)
Title: Method and apparatus for inspecting an object
Inventor: TAN CHIN HIANG
IPC: G01N21/88
Filed: 1999-08-20
Granted: 2001-05-01
Abstract: An inspection apparatus is provided for inspecting semiconductor devices arranged on a carrier tray. The apparatus includes a top surface and mark (TSM) inspection station (4), first pick and place means (2) for transporting the devices between the carrier tray and the TSM inspection station, a solder ball (SB) inspection station (9) and means (6, 7) associated with the SB station for clamping the carrier tray relative to a datum. The apparatus also includes a movable platform (8) for translating the SB inspection station relative to the carrier tray, a bottom surface (BS) inspection station (11) and second pick and place means (12) for transporting the devices between the carrier tray and the BS inspection station.
Patent TW-448354-B (TW)
Title: Method and apparatus employing an invalid symbol security jam for communications network security
Inventor: SOKOL MICHAEL A
IPC: H04L12/24
Filed: 1999-09-20
Granted: 2001-08-01
Abstract: A security device for use in communications network devices, such as multi-port repeaters, in local area networks to prevent eavesdropping by overwriting the data with an invalid symbol in the data communication packets transmitted to all unintended transceivers connected to the communications network device. Confidential or user sensitive information is not conveyed to the unintended transceivers since the invalid symbol is defined independent of the data. The invalid symbol unambiguously informs the unintended transceivers that the data in the data packet is invalid.
Patent TW-503254-B (TW)
Title: Flame-retardant adhesive film and flat cable
Inventor: KUMAKURA MASAYUKI
IPC: C09J7/29
Filed: 1999-09-28
Granted: 2002-09-21
Abstract: This invention provides a flame-retardant adhesive film containing a non-halogen-based flame retardant to achieve good electrical insulation property, adhesion and flame retardancy. An insulating substrate film 1 is installed with a flame-retardant interlayer 2 with a flame-retardant adhesive layer 3 formed on top; the flame-retardant interlayer 2 has higher flame retardancy than the flame-retardant adhesive layer 3; the flame-retardant adhesive layer 3 contains a nitrogen-containing organic flame retardant, and the flame-retardant interlayer 2 contains a non-halogen-based flame retardant with better flame retardancy than the nitrogen-containing organic flame retardant.
Patent TW-432476-B (TW)
Title: A silicon carbide deposition for use as a barrier layer and an etch stop
Inventor: RATHI SUDHA
IPC: G03F7/11
Filed: 1999-09-29
Granted: 2001-05-01
Abstract: The present invention generally provides an improved process for depositing silicon carbide, using a silane-based material with certain process parameters, onto an electronic device, such as a semiconductor, that is useful for forming a suitable barrier layer, an etch stop, and a passivation layer for IC applications. As a barrier layer, in the preferred embodiment, the particular silicon carbide material is used to reduce the diffusion of copper and may also used to minimize the contribution of the barrier layer to the capacitive coupling between interconnect lines. It may also be used as an etch stop, for instance, below an intermetal dielectric (IMD) and especially if the IMD is a low k, silane-based IMD. In another embodiment, it may be used to provide a passivation layer, resistant to moisture and other adverse ambient conditions. Each of these aspects may be used in a dual damascene structure.
Patent TW-522157-B (TW)
Title: Imide containing polymers made by bulk polymerization
Inventor: BECKER KEVIN H
IPC: C08G73/10
Filed: 1999-10-15
Granted: 2003-03-01
Abstract: Disclosed is a method of making an imide-containing polymer by bulk or melt polymerizing monomers. A mixture is formed of (1) a cyclic compound that contains an anhydride group and a second group which is an anhydride, a carboxylic acid, or an ester and (2) a diamine in an amount stoichiometric ∓5 mole % of stoichiometric with the amount of cyclic compound. An end capper may also be included in the mixture to control the molecular weight but no solvent is used. A polyimidesiloxane can be made by using a siloxane-containing diamine. The mixture is heated to a temperature above the Tg or Tm of the polymer but below its degradation temperature.
Patent TW-418098-B (TW)
Title: Expandable stent and method for manufacturing same
Inventor: MA ZHI-YUNG
IPC: A61F2/958
Filed: 1999-11-17
Granted: 2001-01-11
Abstract: An expandable stent is disclosed which is implantable within a blood vessel or other body lumen for maintaining lumen patency. The stent comprises a plurality of interconnected stent modules. Each of the stent modules includes first and second segments which are joined together by first and second connectors located on diametrically opposite sides of the module. The first and second segments are formed in a sinusoidal pattern and are movable between flattened and expanded configurations. The stent modules are coupled along a common longitudinal axis with interconnection elements extending between the connectors of adjacent modules. This arrangement results in a stent having optimal longitudinal flexibility as well as radial stability. The modules may be fabricated in an automated manufacturing method using inexpensive equipment from an even number of wire strands of substantially equal length. In an alternative embodiment of the invention graft material may be clamped between wire wall sections of the stent for delivering drugs to the site of a target lesion.
Patent TW-432722-B (TW)
Title: A method for forming three dimensional poly-silicon layer on semiconductor chip
Inventor: LIU CHEN-CHIN
IPC: H01L29/786
Filed: 1999-11-26
Granted: 2001-05-01
Abstract: A method for forming a three-dimensional poly-silicon layer on a semiconductor chip and further increasing the surface area of the ONO dielectric layers thereupon is provided in the present invention. The semiconductor chip includes a substrate, a first poly-silicon layer with an approximately square cross section provided on the predetermined region of the surface of the substrate, and a sacrificial layer provided over the first poly-silicon layer. The method first forms a dielectric layer with a thickness higher than the top of the sacrificial layer on the surface of the semiconductor chip. A CMP process is then conducted to completely remove the dielectric layer on the sacrificial layer, and horizontally removes the dielectric layer on the surface of the substrate downwards to a predetermined thickness. Thereafter, the sacrificial layer is completely removed such that a hole is constituted by the top surface of the first poly-silicon layer and the adjacent surrounding dielectric layer. A second poly-silicon layer is formed on a specific region of the surface of the first poly-silicon layer to fill up the hole such that the second poly-silicon layer can electrically connect the first poly-silicon layer. This completes the fabrication of the three dimensional poly-silicon layer and increases the contact area between the ONO dielectric layer and control gate subsequently formed upon the three dimensional poly-silicon layer.
Patent TW-460774-B (TW)
Title: Data carrier with obscured power consumption
Inventor: THURINGER PETER
IPC: B42D15/10
Filed: 1999-12-02
Granted: 2001-10-21
Abstract: In order to prevent the retrieval of data via the measurement of the power consumption in a data carrier provided with a data processing device, it is proposed to connect a load circuit to the power supply of the data carrier so as to influence the power consumption of the data carrier at least during security-relevant operations of the data processing device.
Patent TW-I249234-B (TW)
Title: Windowed non-ceramic package having embedded frame
Inventor: LI ZONG-FU
IPC: H01L31/0203
Filed: 1999-12-20
Granted: 2006-02-11
Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.
Patent TW-464693-B (TW)
Title: Apparatus for producing reduced iron and method for drying pellet applied to the apparatus
Inventor: KAMIKAWA SUSUMU
IPC: C21B13/10
Filed: 1999-12-20
Granted: 2001-11-21
Abstract: This invection is to provide a reduced iron producing apparatus, in which good efficient and stable drying in a dryer can be executed and good qualitied reduced iron can stably be produced, and a pellet drying method applied to the apparatus. This reduced iron producing apparatus is provided with a pellet granulating machine 6 for granulating the pellet by mixing coal as a reducing agent and iron ore of an iron oxide, the dryer 7 for drying the granulated pellet, a round-shaped rotary hearth type reduction furnace 1 for reducing the dried pellet in the high temperature atmosphere, a first heat exchanger 9 for heat-exchanging exhaust warm gas discharged from the reduction furnace 1 and the air for combustion supplied into the reduction furnace 1 and coolers 8 and 10 for cooling the exhaust warm gas. A second heat exchanger 20 for heating the air for drying at the outlet side of the first heat exchanger 9 is disposed. The air for drying, heated with the second heat exchanger 20, is supplied into the dryer 7 to dry the pellet with the air for drying carrying little moisture.
Patent TW-437026-B (TW)
Title: Ball-grid-array semiconductor device and manufacturing method therefor
Inventor: ABE MASAAKI
IPC: H01L23/495
Filed: 1999-12-17
Granted: 2001-05-28
Abstract: There is provided a ball-grid-array semiconductor device. The semiconductor device has a semiconductor element sealed with a resin material. In addition, a lead frame is connected to the semiconductor element in the resin material. The lead frame is provided with terminal portions that protrude through the surface of the resin material.
Patent TW-464844-B (TW)
Title: Decoding apparatus, data reproduction apparatus, and decoding method
Inventor: MIMACHI NOBUMASA
IPC: H03M5/14
Filed: 2000-01-15
Granted: 2001-11-21
Abstract: A decoding apparatus and data reproduction apparatus which can perform correction of 1T and 2T which inherently cannot exist as EFM signals, reduce processing of an error correction circuit, and improve the playability. Provision is made of an EFM block containing a correction portion for detecting an edge of an RF signal converted to a binary format by the PLL asymmetry correction circuit for NRZ conversion, using a clock generated in the digital PLL circuit for synchronization, detecting 1T and 2T (T is a channel clock period), which inherently cannot exist as EFM signals in format, generated at the time of synchronization, correcting the detected 1T and 2T signals to 0 or 3T in accordance with predetermined conditions to remove the 1T and 2T from the RF signal, and modulating the RF signal from which the 1T and 2T have been removed by EFM and a demodulation circuit for demodulating by EFM a signal after modulation by EFM.
Patent TW-494068-B (TW)
Title: Dry transfer product and process for producing
Inventor: DE BASTIANI NORMAN P
IPC: C09J7/02
Filed: 2000-01-28
Granted: 2002-07-11
Abstract: Conventional methods of manufacture of transfer decalcomanias utilizing traditional solvent evaporative ink and adhesive technology are replaced by the present process utilizing ultraviolet (U.V.) cure inks and adhesive technology to produce a better product in a simpler, less costly manufacturing operation. A dry transfer product comprising a carrier sheet, a coating applied to said sheet, an ink composition capable to form desired indicia and which is being received by said coating in a solvent-free carrier, and which has been cured by the application of ultraviolet (U.V.) energy to fix the desired indicia in place, and a U.V. curable pressure sensitive adhesive not requiring solvent for application is applied to said U.V. cured indicia.
Patent TW-483027-B (TW)
Title: Semiconductor device and method of making same
Inventor: YOSHITAKA HIKARU
IPC: H01L21/768
Filed: 2000-03-08
Granted: 2002-04-11
Abstract: A hard mask 105 constituted by SiCN is formed on a fluorocarbon film 103. This can enhance the binding characteristic between the fluorocarbon film 103 and the hard mask 105 over the prior art, and can retard scaling. Furthermore, compared with the prior art, the hard mask 105 formed from SiCN allows more choices in terms of etching rate ratios. Besides, when compared with those formed from SiN or SIC, the dielectric constant thereof can be made smaller.
Patent TW-477857-B (TW)
Title: Motor, window covering, weight suspension system and window-blind system
Inventor: CIUCA ZAZU
IPC: E06B9/322
Filed: 2000-03-16
Granted: 2002-03-01
Abstract: Disclosed is a spring motor and control for use especially with window blinds. The motor comprises a storage drum having a first axis, an output drum mounted for rotation about a second axis parallel to and spaced from the first axis. A spring member is connected to and between the storage drum and the output drum to form a spring motor. The spring motor has laterally extending, spaced apart drum supports on opposite sides of the drums to support them for rotation. A coupled drive is connected to the storage and output drum whereby rotation of one of the drums in a first direction about its axis effects rotation of the other of the drums about its axis and in an opposite direction to cause winding and unwinding of the spring member between the drums. A drive actuator is connected to the coupled drive to effect rotation of the drums, and an adjustable friction member is engageable with one of the coupled drive and the drive actuator to adjustably alter the force necessary to effect movement of the coupled drive.
Patent TW-448576-B (TW)
Title: V-shape flash memory and its manufacturing
Inventor: LI JENG-HUNG
IPC: H01L27/115
Filed: 2000-03-21
Granted: 2001-08-01
Abstract: A V-type flash memory and its manufacture method are disclosed. Form a buried source on the substrate and then make a V-shape groove to expose the buried source. Form a V-shape word-line stacked gate in the V-shape groove and on the substrate beside the V-shape groove. Then form common drains on the two sides of the V-shape word-line stacked gate. Connect the common drain to the bit-line via contact plug.
Patent TW-444219-B (TW)
Title: Thermal overload tripping device for circuit breaker
Inventor: KUBOYAMA KATSUNORI
IPC: H01H73/22
Filed: 2000-03-27
Granted: 2001-07-01
Abstract: To ensure a high positional accuracy between bimetals and shifters and reliable tripping operation characteristics by installing simple adjustment components onto the bimetals during product assembly. The present invention provides a thermal overload tripping device for a circuit breaker comprising bimetals 3U, 3V, 3W as overload and phase-interruption detection means, with the differential shifter mechanism operating to release a latch receiver 11 linked to an opening and closing mechanism section 10 in order to open a main-circuit contact shoe, with the differential shifter mechanism consisting of a first and a second shifters 5I, 5II and an operating lever 5III, and with arm section 5a, 5b projected from the first and second shifters, respectively, being opposed to a tip portion of each of the bimetals, wherein an adapter (a rectangular frame) is installed on the tip portion of a corresponding one of the bimetals for each phase, the adapter having outside dimensions corresponding to the interval between the corresponding arm sections of the first and second shifters, and wherein in a bimetal assembly position, the adapter is placed and fixed at a position at which its opposite ends abut on tip portions of the corresponding arm sections of the shifters in tight contact.