Patent SG-11201806717Y-A (SG)
Title: Integrated circuit modules and smart cards incorporating the same
Inventor: NG ENG SENG
IPC: H05K7/02
Filed: 2018-02-15
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property M Th 0 111111 11 111 11111 0 11 110 1 0 01 11111 11111 11111 11111 111 0 11 11110 1111 0 11 1111 Organization --- -- International Bureau (10) International Publication Number (43) International Publication Date ....0\"- WO 2019/045642 Al 07 March 2019 (07.03.2019) WIP0 I PCT (51) (21) (22) (25) Filing Language: (26) (30) (71) (72) International Patent Classification: OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, GOOK 19/077 (2006.01) HO5K 7/02 (2006.01) SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. International Application Number: PCT/SG2018/050074 (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, International Filing Date: 15 February 2018 (15.02.2018) GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, English TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, 1E, IS, IT, LT, LU, LV, Publication Language: English MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, Priority Data: TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, PCT/SG2017/050423 KM, ML, MR, NE, SN, TD, TG). 28 August 2017 (28.08.2017) SG Declarations under Rule 4.17: Applicant: SMARTFLEX TECHNOLOGY PTE LTD — [SG/SG]; 27 Ubi Road 4, #04-01, Singapore 408618 (SG). of inventorship (Rule 4.17(iv)) Inventors: NG, Eng Seng; 24 Paya Lebar Street, Singapore Published: — 535980 (SG). PANG, Sze Yong; Blk 133 Simei Street 1, with international search report (Art. 21(3)) — in black and white; the international application as filed #08-154, Singapore 520133 (SG). HENG, Cheng Kim; Blk contained color or greyscale and is available for download 704 Tampines Street 71, #09-50, Singapore 520704 (SG). from PATENTSCOPE Agent: AMICA LAW LLC; 30 Raffles Place, #14-01 Chevron House, Singapore 048622 (SG). (74) = Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, (81) = — = — = = = = Title: INTEGRATED CIRCUIT MODULES AND SMART CARDS INCORPORATING THE SAME 7 Z -30a ,Figure 3D e , 33 • (54) = = = = _ 22 32 31a 132 22 = _ = 22b 22a 22a 22b 21 21 i i 1111111111111iik, ' ' A A Il NI , re kin 71 . (57) © single -...... c :: by Il module t ) 25b t 25a e I Figure 3C : Embodiments of the invention provide an integrated chip (IC) module having contact pads which are accessible by -bond holes and module-side antenna contact pads which are accessible by multi-bond holes. Each multi-bond hole is apportioned an encapsulation into adjoining bonding channels for separately receiving wire bond(s) and antenna-connecting element. Each el e establishment ,., bonding -side antenna contact pad is apportioned by the encapsulation into adjoining but electrically connected bonding areas to allow of electrical connection of both wire bond(s) and antenna-connecting element to an IC chip. The first and the second area are partitioned from each other, by the encapsulant, without requiring a presence of substrate therebetween.