baber/WOPTO huggingface dataset:
Patent TW-202011008-A (TW)
Inventor: WANG JEN-SHUN
IPC: G01N19/10
Filed: 2018-09-03
Abstract: An underground fluid extraction measurement system includes an extraction device, an electric meter unit and a control unit. When the extraction device is in a working state, the extraction device extracts an underground fluid in a fluid extracting area. The electric meter unit measures a total power consumption of the extraction device in the working state. The control unit converts the total power consumption of the extraction device into a total extraction volume.
Patent TW-201913870-A (TW)
Inventor: SUZUKI KATSUHIKO
IPC: H01L21/68
Filed: 2018-09-07
Abstract: The present invention relates to a method for processing a wafer, and an object of the invention is to provide a method for processing a wafer which can be subjected to a calibration process by a sealing material containing carbon black coated on a surface of the wafer. The solution is a method for processing a wafer having a plurality of bump electrodes formed in respective ranges on surfaces by a plurality of intersected projected dicing lines. The method includes: a cutting groove forming process for forming a cutting groove corresponding to a depth of a completed thickness of a device wafer from a surface side of the wafer along the projected dicing lines; a sealing process, after performing the cutting groove forming process, capable of sealing a surface of the wafer containing the cutting groove by the sealing material; a grinding and cutting process, after performing the sealing process, capable of grinding and cutting the wafer from the back side of the wafer to a completed thickness of the device wafer, so that the sealing material in the cutting groove is exposed; a calibration process, after performing the grinding and cutting process, a surface side of the wafer is photographed to detect an alignment mark from the surface side of the wafer through the sealing material by an infrared imaging means, then the projected dicing lines are identified according to the alignment mark; a partition process, after performing the calibration process, a laser beam having an absorptive wavelength for the sealing material is irradiated from the surface side of the wafer along the projected dicing lines, and then the respective device wafer is divided by the ablation processing to be surrounded by a surface and 4 side surfaces by the sealing material.
Patent TW-202010627-A (TW)
Inventor: Huang qiu-feng
IPC: B32B3/30
Filed: 2018-09-12
Abstract: 本發明提出一種黏貼膜，包括膜片、位於所述膜片一側的可撓性基層及貫穿所述膜片與所述可撓性基層的穿孔；所述可撓性基層相背於所述膜片的一側開設有多條溝槽；所述可撓性基層包括第一區域與第二區域，所述穿孔位於所述第一區域內，所述第一區域內的所述溝槽的平均間距小於所述第二區域內的所述溝槽的平均間距。該黏貼膜排氣效果好，貼合效果佳。
Patent TW-201915696-A (TW)
Title: Touch circuit
Inventor: Lu ji-huan
IPC: G06F3/044
Filed: 2018-10-01
Abstract: The present invention provides a touch circuit, which comprises a detection circuit and an emulation circuit. The detection circuit detects a detection signal; the emulation circuit includes a reference load and receives a signal. The emulation circuit generates an emulation signal according to the reference load and the signal. The touch circuit outputs a touch signal according to the detection signal and the emulation signal.
Patent TW-201923112-A (TW)
Title: Copper manganese sputtering target
Inventor: FERRASSE STEPHANE
IPC: B21C23/12
Filed: 2018-10-05
Abstract: A method of forming a high strength copper alloy. The method comprises heating a copper material including from about 2 wt. % to about 20 wt. % manganese by weight of the copper material to a temperature above 400 DEG C, allowing the copper material to cool to a temperature from about 325 DEG C to about 350 DEG C to form a cooled copper material, and extruding the cooled copper material with equal channel angular extrusion to form a cooled copper manganese alloy.
Patent TW-201929399-A (TW)
Title: Direct current-direct current converter
Inventor: ZHAO CHEN
IPC: H02M3/335
Filed: 2018-10-24
Abstract: A direct current-direct current converter is provided. In the direct current-direct current converter, a switched capacitor converter and a switch converter are cascaded. In view of the feature that the switched capacitor converter includes multiple switch groups, the switch converter is configured to share any one of the switch groups of the switched capacitor converter, which can effectively reduce the number of circuit components and increase utilization of the circuit components. In addition, the share of the switch group brings no negative effects on operation of the switched capacitor converter, thus the DC-DC converter achieves an adjustable smoothing output voltage and an adjustable gain.
Patent TW-201919433-A (TW)
Title: Base station, user equipment, and method for early data transmission
Inventor: LIN YI-TING
IPC: H04W72/02
Filed: 2018-10-25
Abstract: Embodiments relate to a method for early data transmission in a random access procedure. The method includes: a base station broadcasting system information; the base station receiving a random access request message which is transmitted by a user equipment via a random access channel resource dedicated for early transmission; the base station determining a size limitation of an up-link data; the base station transmitting a random access response message carrying the size limitation of the up-link data to the user equipment; and the base station receiving an RRC (Radio Resource Control) request message carrying early up-link data from the user equipment.
Patent TW-201922708-A (TW)
Title: Pyridine and pyrimidine carboxylate herbicides and methods of use thereof
Inventor: BELL JARED
IPC: C07D213/69
Filed: 2018-10-26
Abstract: Provided herein are pyridine and pyrimidine carboxylates and their derivatives, and compositions and methods of use thereof as herbicides.
Patent TW-201922916-A (TW)
Title: Reinforcing resin composition and electronic component device
Inventor: YAHAGI TAKESHI
IPC: C08L63/02
Filed: 2018-11-09
Abstract: This invention provides a reinforcing resin composition including an epoxy compound and a curing agent, and including 25 mass % or more and 100 mass% or less of bisphenol E epoxy resin with respect to the total amount of the epoxy compound as the epoxy resin compound.
Patent TW-202024864-A (TW)
Inventor: HSU Fu-Song
IPC: G06F16/00
Filed: 2018-12-24
Abstract: A motion tracking system includes a first image capturing module, a computing module and a database. The first image capturing module captures a full body motion of an object to obtain a depth image. The database provides a plurality of training samples, wherein the training samples includes a plurality of depth feature information related to joint of the object. The computing module receives the depth image, performs an association operation and a prediction for the depth image to obtain a plurality of first joint positions of the object. The computing module projects the first joint positions to a three dimension space to generate a three-dimension skeleton of the object. The depth image includes an image that limbs of the object are not shaded or an image that a part of limbs of the object are not shaded and the other part of limbs of the object are shaded.
Patent TW-201933156-A (TW)
Title: Method and apparatus of emulation techniques for enhanced FPGA validation
Inventor: CASTLE MICHAEL
IPC: G06F17/50
Filed: 2018-12-26
Abstract: A method for modeling a field-programmable gate array (FPGA) for an emulator includes performing a validation process on an FPGA design to determine whether an FPGA emulator is able to emulate at least one component in the FPGA design; responsive to the FPGA emulator being unable to emulate the at least one component in the FPGA design, modifying the FPGA design by replacing the at least one component with at least one replacement component; executing a first simulation of the FPGA design to generate a first output; executing a second simulation of the modified FPGA design to generate a second output; and determining, with reference to the first output and the second output, that the FPGA design and the modified FPGA design are functionally equivalent.
Patent TW-202027141-A (TW)
Title: Trench power transistor and manufacturing method of the same for enhancing voltage durability of device and providing with low conduction resistance
Inventor: LI PO-HSIEN
IPC: H01L21/28
Filed: 2019-01-11
Abstract: The present invention provides a manufacturing method of trench power transistor, which is mainly characterized in using twice etching and further using a deposition process of insulation layer to form the gate trench structure. Thus, during the high-temperature heat treatment, by the protection of the nitride layer, the present invention may prevent other insulation layers from further oxidation and may remove the nitride layer in the following process, so as to prevent the forming of nitride in the gate trench causing influence to the device characteristics by the interaction due to contact or too close between nitride and gate electrode. The present invention further provides a trench power transistor made by the manufacturing method of the present invention.
Patent TW-202030692-A (TW)
Title: Book-entry central government bond checkout auto-verification system capable of improving system efficiency and simplifying business processes
Inventor: Li yi-jun
IPC: G06Q20/38
Filed: 2019-01-31
Abstract: A book-entry central government bond checkout auto-verification system includes a processing unit, a bond trading unit, a transceiver unit, a storage unit, a verification unit and a modification unit. The processing unit is configured to perform operations and controls of the book-entry central government bond checkout auto-verification system. The bond trading unit is connected to the processing unit to produce bond transaction data. The transceiver unit is connected to the processing unit to transmit bond transaction data and receive bond transaction status. The storage unit is connected to the processing unit to store bond transaction data and bond transaction status. The verification unit is connected to the processing unit to query and compare all bond transaction data and bond transaction statuses of the transaction date stored in the storage unit, and export abnormal bond transaction data. The modification unit is connected to the processing unit and configured to modify the abnormal bond transaction data of the transaction date. In addition, the modification unit is configured to update and store the modified bond transaction data in the storage unit. Therefore, the invention can determine whether there is any outstanding bond transaction by checking and comparing bond transaction statuses of the transaction date and notify the bond transfer branch for further processing in real time, so as to improve system efficiency and simplify business processes.
Patent TW-201936497-A (TW)
Title: Aerobic organism treatment device and method for operating same
Inventor: FUKASE TETSUROU
IPC: B01D65/02
Filed: 2019-02-01
Abstract: An aerobic organism treatment device 1 has: a reaction tank (tank body) 2; a water-permeable plate 3 arranged horizontally at the bottom of the reaction tank 2; a large-diameter particle layer 4 formed on the upper side of the water-permeable plate 3; a small-diameter particle layer 5 formed on the upper side of the large-diameter particle layer 4; an oxygen dissolution film module 6 disposed on the upper side of the small-diameter particle layer 4; a receiving chamber 7 formed on the lower side of the water-permeable plate 3; a raw water dispersion tube 8 that supplies raw water into the receiving chamber 7; an air-diffusing tube 9 arranged so as to diffuse air inside the receiving chamber 7; etc. The average particle diameter of activated carbon in a fluidized bed F is set at 0.2-1.2 mm, and LV is set at 30 m/hr or less.
Patent TW-201939774-A (TW)
Title: Bonded substrate, elastic surface wave element, elastic surface wave element device, and method for manufacturing bonded substrate
Inventor: KURIMOTO Kouhei
IPC: H01L41/04
Filed: 2019-02-15
Abstract: This bonded substrate has a crystal substrate which is cut at an angle intersecting the crystal X axis, and a piezoelectric substrate laminated on the crystal substrate, wherein: the cut angle of the crystal substrate is preferably an angle within the range of 85-95 degrees of the crystal X axis; the elastic surface wave propagation direction of the crystal substrate preferably forms an angle of 15-50 degrees with the crystal Y-axis; lithium niobate or lithium tantalate is preferably used for the piezoelectric substrate; and the thickness h of the piezoelectric substrate is preferably a factor of 0.02-0.11 of the wavelength [lambda] of the elastic surface wave.
Patent TW-202011865-A (TW)
Title: Shock cushioning backpack
Inventor: CHEN JING
IPC: A45C13/00
Filed: 2019-02-26
Abstract: This invention discloses a shock absorption and cushioning backpack. A buffer spring is connected between the shoulder strap and the backpack. Weight of the backpack is transmitted to the shoulder strap through the buffer spring. The buffer spring can absorb the impact on the shoulder and back of the user caused by the ups and downs of the backpack, thus reduce the loading and protect the back and shoulders of the person.
Patent TW-202004863-A (TW)
Title: Semiconductor device structure and method for forming the same
Inventor: HUANG YU-LIEN
IPC: H01L21/302
Filed: 2019-03-14
Abstract: Embodiments disclosed herein relate generally to methods for forming recesses in epitaxial source/drain regions for forming conductive features. In some embodiments, the recesses are formed in a two-step etching process including an anisotropic etch to form a vertical opening and an isotropic etch to expand an end portion of the vertical opening laterally and vertically. The recesses can have increased contact area between the source/drain region and the conductive feature, and can enable reduced resistance therebetween.
Patent TW-202005003-A (TW)
Inventor: JUNG JAE-MIN
IPC: H01L23/367
Filed: 2019-03-19
Abstract: A film package includes a film substrate, a first semiconductor chip on a first surface of the film substrate, a second semiconductor chip on the first surface of the film substrate, and a first conductive film on the first surface of the film substrate. The first conductive film covers the first semiconductor chip and the second semiconductor chip and includes a slit(s) or a notch(es). The slit(s) or notch(es) is/are disposed in a bridge region between the first semiconductor chip and the second semiconductor chip, in a plan view of the package.
Patent TW-202028947-A (TW)
Inventor: CHANG YAW-GUANG
IPC: G06F3/041
Filed: 2019-04-17
Abstract: The present invention provides an in-cell touch panel sensing system and a sensing method. The in-cell touch panel sensing system comprises sensing arrays. Each sensing array comprises: sensor plates; a first multiplexer (MUX), a first analog-to-digital converter (ADC), a second MUX, a second ADC, a third MUX, a third ADC, a fourth MUX, and a fourth ADC. The first MUX is coupled to a first row of the sensor plates and a first column of the sensor plates. The first ADC is coupled to the first MUX. The second MUX is coupled to a second row of the sensor plates and a second column of the sensor plates. The third MUX is coupled to a third row of the sensor plates and a third column of the sensor plates. The fourth MUX is coupled to a fourth row of the sensor plates and a fourth column of the sensor plates.
Patent TW-201947804-A (TW)
Title: Battery material stacking device
Inventor: YAMASHITA MANABU
IPC: B65H5/02
Filed: 2019-05-15
Abstract: The purpose of the present invention is to provide a battery material stacking device capable of quickly and continuously stacking sheet-like workpieces pertaining to a battery material. The device is provided with: a conveyance mechanism 1 for conveying workpieces W in a predetermined direction; a rotary body 2 disposed below the conveyance mechanism 1 and rotating about a predetermined rotation axis; multiple holding parts 4 disposed on a peripheral part of the rotary body 2 and respectively holding the workpieces W; and a stacking table 3 where the workpieces W are stacked together. Each of the holding parts 4 holds one surface of each workpiece W conveyed thereto with the other surface being supported by the conveyance mechanism 1, conveys the workpiece W upside down by rotating with rotation of the rotary body 2, and stacks the workpiece W with the other surface facing the stacking table 3.
Patent TW-202003598-A (TW)
Inventor: MOROZUMI KAZUMASA
IPC: G03F7/004
Filed: 2019-05-20
Abstract: Provided is a photosensitive transfer material comprising a temporary support and a photosensitive resin layer that includes a polymer having a glass transition temperature of 90 DEG C or lower and including a structural unit having an acid group protected by an acid-decomposable group, a photoacid generator, and a benzotriazole compound. Provided also is the application of the photosensitive transfer material.
Patent TW-202015726-A (TW)
Inventor: DIDONATO MICHAEL
IPC: A61P35/00
Filed: 2019-05-28
Abstract: 本文提供了特異性結合ENTPD2(例如人ENTPD2蛋白)的抗體或其抗原結合片段，例如單株抗體或其抗原結合片段，以及使用該等抗體或抗原結合片段之方法。本發明還涉及組合療法，該組合療法包含抗人ENTPD2抗體或其抗原結合片段和至少一種另外的治療劑，以及使用該等組合療法之方法。
Patent TW-202001234-A (TW)
Title: Inspection device and method for wafer
Inventor: NISHIHATA HIRONOBU
IPC: H01L21/66
Filed: 2019-06-13
Abstract: A wafer inspection device (D) according to the present invention is characterized by comprising: a laser inspection device (1) which includes a light source (11) for emitting laser light to a wafer, a detector (12) for detecting secondary light, and a laser inspection unit (15) for inspecting the wafer on the basis of the intensity of the secondary light; and an image inspection device (2) which includes an image acquisition device (21) for acquiring an observation image of the surface of the wafer, an image acquisition control unit (23) for controlling the image acquisition device, and an image inspection unit (24) for inspecting the wafer on the basis of the observation image, wherein the laser inspection unit (15) specifies a defective part included in the wafer, and the image inspection device (2) determines an inspection condition regarding the inspection of the wafer on the basis of the information pertaining to the defective part specified by the laser inspection unit (15).
Patent TW-202013601-A (TW)
Title: Semiconductor device and semiconductor device manufacturing method
Inventor: KAWASHIMA HIROYUKI
IPC: H01L21/30
Filed: 2019-06-21
Abstract: A semiconductor device according to one embodiment of the present disclosure is provided with: a first substrate having a first bonding section; and a second substrate having a second bonding section which is bonded to the first bonding section. The first substrate further includes a first multilayer wiring layer which is electrically connected to the first bonding section via a first insulating layer and in which one surface of a first wiring formed on a side closest to the bonding surface with respect to the second substrate faces the first insulating layer, and the other surface opposite to the one surface is in contact with a second insulating layer having a dielectric constant lower than that of the first insulating layer.
Patent TW-202100967-A (TW)
Title: Unlimited multiplexing testing system for press type switch
Inventor: TSAI CHENG-YI
IPC: G01M7/08
Filed: 2019-06-21
Abstract: The present invention discloses an unlimited multiplexing testing system for press type switch, comprising: a main board, a plurality of supporting bases, a testing and controlling module, a first interface unit, a button punching module, and a host computer. Particularly, this novel unlimited multiplexing testing system is able to apply at least one button punching test to a great quantity of mechanical switch components, keyboards or computer mice, thereby completing a life cycle test, a loading test or an endurance test. On the other hand, this 
unlimited multiplexing testing system can also be adopted to achieve any one of foregoing three kinds of tests on the mechanical switch components, keyboards and computer mice, simultaneously.
Patent TW-202012482-A (TW)
Title: Radiation curable composition
Inventor: CAPPELLE STEVEN
IPC: C08G18/67
Filed: 2019-07-08
Abstract: The present invention provides a radiation curable composition comprising a hydroxyl functional urethane (meth)acrylate compound (A) having an hydroxyl value between 10 and 80 mg KOH/g and which is the reaction product of a hydroxyl functional (meth)acrylate compound (A1) obtained from the reaction a or b: a. at least one diepoxy functional compound (A11a) with a (meth)acrylate compound (A11b) comprising at least one (meth)acrylate group and one carboxylic acid functional group or b. a carboxylic acid functional compound (A12a) comprising two carboxylic acid groups with an epoxy (meth)acrylate compound (A12b) comprising one glycidyl group and at least one (meth)acrylate group, with a diisocyanate functional compound (A3), and optionally a compound (A2) different of compound (A1) comprising two hydroxyl groups. Such composition is useful for example for dual curable compositions or for thick pigmented systems.
Patent TW-202105634-A (TW)
Title: Electronic structure and manufacturing method thereof
Inventor: CHANG WEN-YUAN
IPC: H01L23/528
Filed: 2019-07-26
Abstract: An electronic structure including a substrate, a circuit board, a plurality of conductive structures and a plurality of supporting structures is provided. The substrate has a plurality of first connection pads. The circuit board is disposed on the substrate and has a plurality of second connection pads. The conductive structures are respectively connected to the first connection pads, and are respectively connected to the second connection pads. The supporting structures are respectively connected to at least one of the first connecting pads or the second connection pads, wherein the supporting structures and the conductive structures are electrically insulated from each other, and the structural strength of the supporting structures is greater than the structural strength of the conductive structures. In addition, a manufacturing method thereof is also provided.
Patent TW-202014540-A (TW)
Title: Hard coating and member coated with hard coating
Inventor: WANG MEI
IPC: B82Y30/00
Filed: 2019-07-29
Abstract: In the present invention, two types of nanolayer alternating layers 38, 40, in which an A-layer 32 as a single-composition layer of one of an A-composition (AlCrSi [alpha] nitride), a B-composition (AlTiSi [beta] nitride), and a C-composition (AlCr(SiC) [gamma] nitride), and two of an A-composition, a B-composition, and a C-composition nanolayer layer (nanolayer A layer 32n, nanolayer B-layer 34n, nanolayer C-layer 36n) are alternately layered, are alternately layered in a predetermined film thickness, whereby such characteristics as excellent durability even in cutting of a titanium alloy, for example, are obtained, and excellent wear resistance, toughness, lubricity, and welding resistance are obtained. Cracking or separation of the hard coating is thereby suppressed by high toughness in cutting of titanium alloy, as well as carbon steel, stainless steel, cast iron, and alloy steel, for example, and various other materials to be cut, or in high-speed machining, dry machining, and other harsh machining conditions, and an increase in service life of a tool can be realized.
Patent TW-202013832-A (TW)
Inventor: Wang rui-qin
IPC: H01R13/639
Filed: 2019-08-20
Abstract: 一種插座連接器，其安裝在一電路板且包括承載有端子的絕緣本體、金屬殼體以及遮蔽罩。端子具有安裝在電路板的第一接腳，金屬殼體具有安裝在電路板的第二接腳。遮蔽罩將第一接腳遮蔽於其內，遮蔽罩與金屬殼體之一設置有彼此接觸的搭接部，搭接部鄰近第二接腳以減小接地路徑。一種線纜連接器，其包括本體、導電部、扁平線纜、按壓板、金屬板及一對扣持件。扣持件包括連接部、自連接部向前依序延伸的按壓部與扣持部。連接部為平板狀且是自金屬板一體彎折而形成，使得扣持件結構簡單，有利於線纜連接器的小型化。
Patent TW-202105432-A (TW)
Inventor: LIU PENG
IPC: H01J9/02
Filed: 2019-08-20
Abstract: 本發明涉及一種奈米碳管場發射體的製備方法，包括以下步驟：提供一奈米碳管陣列；熱處理所述奈米碳管陣列形成石墨化的奈米碳管陣列；提供一陰極基底，在該陰極基底的表面形成導電粘結劑層；將所述石墨化的奈米碳管陣列的一端與所述導電粘結劑層接觸，並固化所述導電粘結劑層，使該石墨化的奈米碳管陣列固定在所述陰極基底上。另外，本發明還涉及一種奈米碳管場發射體。