baber/WOPTO huggingface dataset:
Patent TW-200514468-A (TW)
Title: Color conversion layer and light-emitting device
Inventor: EIDA MITSURU
IPC: H01L27/32
Filed: 2004-09-27
Abstract: The present invention provides a color conversion layer which is capable of efficiently converting lights from a light-emitting body into lights including those having longer wavelengths. The color conversion layer further has less deterioration and has long life. The color conversion layer comprises a phosphor having a function to convert a light emitted from a light-emitting body into a light having a longer wavelength, and has a haze value (turbidity) of 50-95%. Since this color conversion layer can perform color conversion of lights efficiently, the color conversion layer can be made thinner, thereby improving the workability in patterning and the like.
Patent TW-200520245-A (TW)
Title: Semiconductor image pickup device capable of sensing light over wider range
Inventor: HIROTSU FUSAYOSHI
IPC: H04N5/355
Filed: 2004-10-18
Abstract: A semiconductor image pickup device's pixel circuits each include a photodetection element, and first and second current mirror circuits provided as current generation circuit. The photodetection element generates at a node a photocurrent corresponding to a quantity of light received. The first current mirror circuit passes first and second currents corresponding to the photocurrent to an internal node and an output node, respectively. The second current mirror circuit is connected to generate a fourth current corresponding to a third current passing through the internal node and also allow a differential current between the second and fourth currents to flow through the output node. Each pixel circuit has its internal node electrically connected by a resistance component, which implements an inter-pixel connect, to the internal node of at least one of adjacent pixel circuits. An output current will be a current corresponding to a relative difference between the photocurrent of the pixel circuit of interest and the third current corresponding to an average quantity of light received at adjacent pixels. Thus a high precision, miniaturized semiconductor image pickup device can be provided that can detect bright and dark portions in sufficient contrast even if there is a large brightness distribution within a single field of view.
Patent TW-200518265-A (TW)
Title: Copper damascene structure and semiconductor device including the structure and method of fabricating the same
Inventor: WU ZHEN-CHENG
IPC: H01L23/48
Filed: 2004-10-29
Abstract: A semiconductor substrate has a first copper layer, on which an etch stop layer and a dielectric layer are successively formed. A second copper layer penetrates the dielectric layer and the etch stop layer to electrically connect to the first metal layer. The etch stop layer has a dielectric constant smaller than 3.5, and the dielectric layer has a dielectric constant smaller than 3.0.
Patent TW-200614934-A (TW)
Title: Supporting buffer structure of shoes
Inventor: RUAN YI-JIE
IPC: A43B13/18
Filed: 2004-11-02
Abstract: This invention relates to a supporting buffer structure of shoes. It mainly sets an elastomer at the end of sole board. Wherein, the elastomer is an arc shaped hollow supporting structure. The middle region bulges into hollow shape. The bottom sticks to the base of the shoe sole. The balance base is placed to equally distribute the weight of the foot movement with arc shape curve attached to the elastomer surface. The elastomer receives the weight as a buffer to absorb shocks for a shoe sole with comfort and stability.
Patent TW-200618199-A (TW)
Title: Circuit board and process thereof
Inventor: LEE I-TSENG
IPC: H01L23/02
Filed: 2004-11-26
Abstract: A circuit board essentially comprises a first laminate layer, at least a first plating through hole, at least a second laminate layer, a medium dielectric layer and at least a second plating through hole is disclosed. The first laminate layer has at least three first circuit layers and at least two first dielectric layers. The first circuit layers and first dielectric layers are laminated alternately and any adjacent two of the first circuit layers has one of the first dielectric layers between them. The first plating through hole passes through the first laminate layer. The second laminate layer is laminated above the first laminate layer. The medium dielectric layer is laminated between the first laminate layer and the second laminate layer. The second plating through hole passes through the first laminate layer, the medium dielectric layer and the second laminate layer. The space used for the plating through holes can be saved. Consequently, the layout density of the circuit board can be increased and the manufacturing cost can be reduced.
Patent TW-200620159-A (TW)
Title: Interpolation method for reconstructing pixel color information of color digital image
Inventor: LIAW MING-JIUN
IPC: G06T5/00
Filed: 2004-12-03
Abstract: An interpolation method for reconstructing pixel color information of color digital image includes steps of comparing an absolute value of a difference value of gradient values along two directions of a pixel of color data to be reconstructed with a predetermined critical value; determining the minimum change of partial image data at the pixel in the digital image to be along a first direction, a second direction or a undetermined direction; selecting a corresponding interpolation computation in accordance with the selection result; reconstructing lost color information of the pixel; converting two gradient values into an effective gradient value to replace the two gradient values for subsequent judgments and computations; and if the determination is not conclusive, replacing the original two gradient values with the gradient values of another two directions to resume the aforementioned steps.
Patent TW-200620586-A (TW)
Title: Chip package structure
Inventor: LIU JUN-CHENG
Filed: 2004-12-09
Abstract: A chip package structure is provided, and the chip package structure comprises a package substrate, a chip, a heat spreader, and a molding compound. Additionally, the chip is disposed on the surface of the package substrate, and the chip and the package substrate are electrically connected. Further, the heat spreader is disposed on the surface of the package substrate, and the heat spreader comprises a coating layer, a top portion and a support portion connected to the periphery of the top portion. The top portion is above the chip, and the coating layer is only disposed on the surface of the top portion far away form the chip. Furthermore, the support portion is contact with the package substrate. Moreover, the molding compound is disposed on the surface of the package substrate and enveloped the chip and the support portion of the heat spreader exposing the coating layer thereof. As mentioned above, the reliability of the chip package structure is better.
Patent TW-200527723-A (TW)
Title: Semiconductor light emitting element
Inventor: MARUTA HIDEAKI
IPC: H01L33/20
Filed: 2004-12-24
Abstract: The refractive index of materials for forming a light emitting element, including a group III nitride based compound semiconductor is higher than that of air, so that in a conventional semiconductor light emitting element in which the light emitted by an active layer should be emitted into the air, the incident angle from a semiconductor layer into the air has to be equal to or smaller than a critical angle, or the total reflection occurs, in which no light is emitted into the air, when the incident angle exceeds the critical angle. The semiconductor light emitting element of this invention is provided so solve the aforementioned problem, which comprises a substrate, and at least a first semiconductor layer, an active layer and a second semiconductor layer in order on the substrate, wherein the second semiconductor layer has a polarity different from that of the first semiconductor layer, and the sum of areas of the first semiconductor layer, the active layer and the second semiconductor layer on the side the side surface of the active layer is exposed is 5% or more with respective to the area of the exposed upper surface on the second semiconductor layer.
Patent TW-200622431-A (TW)
Title: Backlight module heat dissipation design
Inventor: LIN KUN-WEI
IPC: F21V29/505
Filed: 2004-12-29
Abstract: A backlight module heat dissipation design is provided. Plural parallel protruded rib parts are installed on a reflection bottom plate. The top of each rib part has a first vent hole through the whole rib part and can be close to a pipe type light source. Plural second vent holes are made on the edge of the reflection bottom plate and the outside of the reflection bottom plate has a light shield to cover the second vent holes. A protrudent edge part in which there is a trench linking the internal space of the backlight module is made on the frame of the backlight module. The trench bottom has a through hole cross the protrudent edge part to form a flow channel penetrating the backlight module. Through the first, second and third vent holes, the cooling air can flow the inside and outside of the backlight module and avoid hole opening formed shadow area influencing the display performance of the LCD panel.
Patent TW-200621451-A (TW)
Title: A grabbing finger device
Inventor: FANG CHIH-HSING
IPC: B25J15/10
Filed: 2004-12-31
Abstract: A finger device for grabbing is disclosed. The finger device can be mounted on an arm of a robot for grabbing objects. The finger device includes multiple base units, and a driving string. Each base unit includes a main body, a first axis mounted on the main body, a second axis mounted on the main body, an elastic member and a binding member. The binding member is used for connecting the neighboring main bodies for continuous motion. Moreover, the positions of the project of the first axis, the second axis, and the binding member on the same side surface of the main body are not located on the same straight line. The elastic member also connects the neighboring main bodies for changing or recovering the relative positions of the main bodies. As the driving string is pulled, the resulted force will change the relative positions of the main bodies to bend the finger device.
Patent TW-200623991-A (TW)
Title: Ground noise suppression method
Inventor: HUANG WEN-HSIUNG
Filed: 2004-12-31
Abstract: The present invention relates to a ground noise suppression method, which is applied to a power loop disposed on a circuit board to alleviate ground noise so as to improve the influence of electromagnetic interference. The power loop at least includes a switch driver and a plurality of passive components. The method of the present invention includes steps of first connecting the ground pins of the plural passive components to a ground pin of the switch driver through a power ground (Power Gnd) on an outer layer of the circuit board; suppressing a loop path of the power loop by contacting the ground pin of the switch driver and a digital ground (Digital Gnd) on an inner layer of the circuit board. Therefore, the power loop directly suppresses radiation generated by a signal electric field, masks the signal with uncorrelated interference frequency and prevent power noise from bouncing to improve the influence of electromagnetic interference on surrounding electronic components.
Patent TW-200533062-A (TW)
Title: Audio device
Inventor: TAKAHATA KOJI
IPC: H04R5/04
Filed: 2005-01-14
Abstract: Provided is an audio device of which a sound signal switching means capable of preventing buzz sound can be miniaturized, and the time constant of time constant section for switching control can be varied so that switching can be conducted more smoothly, wherein a sound signal selection means (12) is provided between a sound input source and a sound output means, the sound signal selection means (12) having a plurality of switches SW1a"-SW2b' for transferring the sound signal to the one with different output levels. When transferring the sound signal to one with a different output level, the sound signals before and after transferring are coexisted, and the sound signal is transferred in the meantime. The time constant section (8) for transferring control is constituted with a SCF built-in an IC, and the time constant τ thereof is adjustably controlled by a clock signal Folk which is obtained by demultiplying the reference signal generated at VCO (6) with a variable frequency demultiplication ratio.
Patent TW-200627953-A (TW)
Title: Video-stream adaptive media broadcasting control method and system based on mobile device
Inventor: CHUANG HSIAO-CHIANG
IPC: H04N7/12
Filed: 2005-01-31
Abstract: A video-stream adaptive media broadcasting control method and system based on a mobile device mainly includes-: an initial value adjustment part and a frame-rate adjustment part, using the data amount of the initial values in the buffer together with the variation of the adjusted frame rate to determine the broadcasting speed. This type of adaptive media broadcasting control method and system solves the problem of loss in video quality caused by overflow or underflow of buffer, and also provides a video-stream user with a smooth broadcasting process without affecting the capacity of a mobile communication system.
Patent TW-200541090-A (TW)
Title: Semiconductor relay apparatus and wiring board fabrication method
Inventor: TOMIOKA TAIZO
IPC: H01L31/12
Filed: 2005-02-15
Abstract: Three chips, i.e., an LED, photovoltaic IC, and MOS-FET, are mounted on a silicon substrate having two projections arranged substantially parallel to each other. Each projection has a side surface formed by an inclined surface including a curve having an inflection point. The LED is mounted on an LED mounting electrode formed between the two projections, and connected, by a gold wire, to an LED connecting electrode formed between the projections. The photovoltaic IC is placed on the upper surfaces of the projections so as to oppose the LED, and connected via gold bumps.
Patent TW-200539558-A (TW)
Title: Mapping a plurality of sensors to respective zones in a fan control system
Inventor: MARANDO EILEEN M
IPC: F04B49/10
Filed: 2005-02-22
Abstract: A fan control system in which a sensor selection block having a number of sensor inputs may be combined with an autofan block having a number of zone inputs, where the number of sensor inputs is greater than the number of zone inputs. Each one of the sensor inputs of the sensor selection block may have a corresponding sensor parameter input. The sensor selection block may be configured to map a subset of the sensor inputs with corresponding sensor parameter inputs to the autofan block. Each zone input and corresponding zone parameter input of the autofan block may receive a corresponding one of the subset of the sensor inputs with corresponding sensor parameter inputs, respectively. The autofan block may have a number of pulse width modulated (PWM) outputs that may be calculated according to the autofan block zone inputs and zone parameter inputs.
Patent TW-200535406-A (TW)
Title: Pressure sensor
Inventor: GAJDECZKO BOGUSLAW F
IPC: H01H35/34
Filed: 2005-03-28
Abstract: A pressure gauge includes a diaphragm having a substantially rigid outer portion and a displaceable inner portion that displaces in response to a pressure difference between first and second sides of the diaphragm. The pressure gauge further includes a sensor located proximate to the diaphragm and adapted to sense the displacement of the diaphragm inner portion. The pressure gauge further includes a monitor and control system coupled to the sensor (wired or wireless), and adapted to determine the pressure difference from the displacement of the diaphragm. The sensor and the monitor and control system can be implemented with one or more optical sensing designs, capacitive sensing designs, or other devices used to measure sub-micron displacements. For low pressure applications, such as lithography applications, the diaphragm is sensitive to pressure changes in a range of approximately 0.1 to 0.5 inches of water. The diaphragm and sensor have a relatively high bandwidth and can thus be implemented in relatively high speed applications. The invention can be implemented in, for example, lithography proximity sensing equipment and lithography topographical mapping equipment.
Patent TW-200534986-A (TW)
Title: Method and apparatus for forming an article of manufacture and an article of manufacture made by a new and novel process
Inventor: WYCECH JOSEPH S
IPC: B29C44/34
Filed: 2005-03-30
Abstract: A method 10 to selectively produce an article of manufacture 20 having desirable properties and which may replace many "ceramic based" articles. Particularly, the article of manufacture 20 is made by selectively combining an epoxy structural foam material 110 with a catalyst 111 and a drying agent 200. The mixed material is then selectively dispensed within a mold 16 and allowed to harden in order to form the article of manufacture 20. Alternate formulations may be utilized.
Patent TW-200600527-A (TW)
Title: Hole-transporting polymer
Inventor: NAKAYA TADAO
IPC: H05B33/22
Filed: 2005-04-19
Abstract: This invention provides a hole-transporting material for organic EL device with sufficient hole-transporting ability, heat resistance, and longevity. The provided hole-transporting polymer comprises polyimide shown in the following formula (1). Formula (1): In formula (1), "X" represents a group having benzene ring, "R1" represents a biphenyl group, and "R2" represents a phenyl group.
Patent TW-200609292-A (TW)
Title: High strength bimodal polyethylene compositions
Inventor: KWALK TAE HOON
Filed: 2005-05-12
Abstract: Disclosed are various compositions, including but not limited to a high strength bimodal polyethylene composition having a density of 0.940 g/cc or more, the composition comprising a high molecular weight polyethylene component having a higher weight average molecular weight (MwHMW) and a low molecular weight polyethylene component having a lower weight average molecular weight (MwLMW), wherein: the ratio of the higher weight average molecular weight to the lower weight average molecular weight (MwHMW:MwLMW) is 30 or more; and the composition qualifies as a PE 100 material such that in accordance with ISO 1167 a pipe formed from the composition that is subjected to internal pipe resistance has an extrapolated stress of 10 MPa or more when the internal pipe resistance curve is extrapolated to 50 or 100 years in accordance with ISO 9080:2003(E).
Patent TW-200641615-A (TW)
Title: Identification system of a hot-plug peripheral device and the method thereof
Inventor: WANG ZHEN
IPC: G06F13/10
Filed: 2005-05-25
Abstract: The invention provides an identification system and method of a hot-plug peripheral device, which are applied to a server that executes an operation system. The server has slots that can connect to peripheral devices. First, an interrupt response unit that connects one of the slots is installed. When a peripheral device connects to or departs from the slot, the interrupt response unit sends out an interrupt signal. The interrupt signal is used to monitor the peripheral device status. A scan program is executed to identify the peripheral device according to the monitoring result.
Patent TW-200602606-A (TW)
Title: Built-in refrigerator
Inventor: KINOSHITA KATSUNORI
IPC: F25D23/10
Filed: 2005-06-14
Abstract: The present invention is to provide a built-in refrigerator for miniaturizing the whole constitution by reducing ventilation resistance of a cooling air for cooling a compressor. The built-in refrigerator 1 of the invention is stored in kitchen furniture 2, and is constituted so that a fan device 9 is arranged in a rear surface part of a machine room 7, and the compressor 8 is arranged in front of the fan device 9 in the machine room 7, and outside air is sucked in from a front opening part 14a, and is introduced up to the fan device 9, and an air flow passage 14 is arranged in a lower part of a body 4 for introducing and exhausting the cooling air blown upon the compressor 8 up to the front opening part 14a by the fan device 9.
Patent TW-200612729-A (TW)
Title: Image processing apparatus
Inventor: FURUKAWA NAOHIRO
Filed: 2005-06-24
Abstract: The goal of this invention is to provide an image processing apparatus. It can fully utilize both the merits of convenience and visibility of paper and a merit of multifunctional a calculator. Further, via trial and error, it can edit images in an efficient manner of operation even if by using of paper medium without requiring taking in all of images in advance. The image processing apparatus comprises an image pickup part, an image editing part, an operation input part, an image storage part, and an image display part. The image pickup part electrically takes in an image on paper by use of an optical sensor. The image editing part executes image editions, such as clipping of partial images and scaling-up and scaling-down of images. The operation input part accepts operator's instructions related to such image processing. The image storage part stores images. The image display part displays the images stored in the image storage part. The image pickup part and image display part are integrated with each other to form an image pickup/display part. By means of implementing an image display function on a transparent planer surface, it arranges plural optical sensors in a plane. Further, it allows the user to have an operational feeling that does not recognize the difference between the paper and the electronic medium. Eventually, it meets the human intuition.
Patent TW-200625526-A (TW)
Title: A copper conductor
Inventor: LANE MICHAEL
Filed: 2005-07-04
Abstract: A conducting material comprising: a conducting core region comprising copper and from 0.001 atomic percent to 0.6 atomic percent of one or more metals selected from iridium, osmium and rhenium; and an interfacial region. The interfacial region comprises at least 80 atomic percent or greater of the one or more metals. The invention is also directed to a method of making a conducting material comprising: providing an underlayer; contacting the underlayer with a seed layer, the seed layer comprising copper and one or more metals selected from iridium, osmium and rhenium; depositing a conducting layer comprising copper on the seed layer, and annealing the conducting layer at a temperature sufficient to cause grain growth in the conducting layer, yet minimize the migration of the one or more alloy metals from the seed layer to the conducting layer. The method further comprises polishing the conducting layer to provide a polished copper surface material, and annealing the polished copper surface material at a temperature to cause migration of the one or more metals from the seed layer to the polished surface to provide an interfacial region in contact with a copper conductor core region. The interfacial region and the copper conductor core region comprise the one or more metals.
Patent TW-200626409-A (TW)
Title: Motorcycle
Inventor: HAYASHI HIDEKI
IPC: B62J35/00
Filed: 2005-07-08
Abstract: To improve design flexibility and enable the increase of capacity of a fuel tank by securing sufficient space capable of freely being utilized in a vehicle body cover in front than a leg through space. In a motorcycle, the leg though space which is disposed between a seat for riding and a steering handlebar, and an approximate U-shape in a side view is formed on the vehicle body cover, a rear cushion extending to the fore-and-aft direction is provided between the vehicle body frame and a swing arm of which front end part is swingably supported on the vehicle body frame or power units, and a rear wheel is supported on the rear end part, and a storage box covering the rear cushion from the above is disposed under the seat for riding. The fuel tank 78 is disposed at the rear side of the storage box 74 where a hanging part 74a hanging down so as to be disposed on both sides of the rear cushion 44 is provided at the lower parts of the both sides.