baber/WOPTO huggingface dataset:
Patent TW-201810815-A (TW)
Title: Connector assembly and connector assembly mounted structure
Inventor: URANO TETSU
IPC: H01R12/70
Filed: 2017-03-22
Abstract: A connector assembly includes a first connector and a second connector, the first connector having a first contact and a mounting portion together with a projecting portion which passes through a through-hole of a connector holding plate to project on a side of a second face of the connector holding plate along a fitting direction when the first connector is mounted on a first face of the connector holding plate through the mounting portion, the second connector having a second contact and a second contact holding portion which has a first connector receiving portion extending along the fitting direction and an abutment portion formed at an end of the second contact holding portion on a side of the first connector and configured to be abutted against the second face of the connector holding plate.
Patent TW-201815464-A (TW)
Title: Adsorbent, method for producing same, method for removing carbon dioxide, device for removing carbon dioxide, and air conditioner
Inventor: SHIMAZAKI TOSHIKATSU
IPC: C01F17/235
Filed: 2017-05-16
Abstract: A method for producing an adsorbent that is used for the purpose of removing carbon dioxide from a gas to be processed containing the carbon dioxide. This method for producing an adsorbent comprises a firing step wherein a starting material containing at least one cerium salt selected from the group consisting of carbonate salts of cerium and hydrogen carbonate salts of cerium is fired.
Patent TW-201811745-A (TW)
Title: Method for manufacturing polymethine compound
Inventor: MIYAZAKI KATSUAKI
IPC: C09B23/00
Filed: 2017-05-25
Abstract: The present invention provides a method for manufacturing polymethine compound which efficiently produces polymethine compounds with better yield than conventional techniques by effectively suppressing formation of by-products. A method for manufacturing a compound represented by the following formula (1) comprises a step (II) of adding a base to a mixture (M2) containing a compound represented by the following formula (2), a compound represented by the following formula (3), and a compound represented by the following formula (4), while reacting the compound represented by the following formula (2) with the compound represented by the following formula (4).
Patent TW-201826476-A (TW)
Title: Manufacturing method of package structure
Inventor: HSU HUNG-HSIN
IPC: H01L23/28
Filed: 2017-05-31
Abstract: The invention provides a manufacturing method of a package structure. First, a substrate is provided. A conductive layer is formed on the substrate. A conductive frame is formed on the conductive layer. The conductive frame is connected to the conductive layer. A chip is placed on the conductive layer. The conductive frame surrounds the chip. An insulation encapsulation is formed to encapsulate the chip, wherein the insulation encapsulation exposes an active surface of the chip. A redistribution layer is formed on the active surface of the chip. The redistribution layer extending extends from the active surface to the insulation encapsulation.
Patent TW-201816890-A (TW)
Title: Heat treatment apparatus
Inventor: ITO YOSHIO
IPC: H01L21/324
Filed: 2017-06-02
Abstract: An atmosphere of ammonia that absorbs infrared light in a wavelength band overlapping with the measurement wavelength band of a radiation thermometer is formed in a chamber in which a semiconductor wafer is thermally treated. A filter that selectively transmits infrared light having a wavelength not overlapping with the absorption wavelength band of ammonia is installed between an optical lens system and a detector of the radiation thermometer to avoid influence of the infrared light absorption by ammonia. A conversion table corresponding to the installed filter is selected from a plurality of conversion tables representing a correlation between energy of infrared light incident on the radiation thermometer and temperature of a black body, and is used at the radiation thermometer. Accordingly, the temperature of the semiconductor wafer can be accurately measured in the atmosphere of ammonia.
Patent TW-201742783-A (TW)
Title: Pedal
Inventor: KIM YOO CHUL
IPC: B62M3/08
Filed: 2017-06-05
Abstract: The pedal of the present invention includes: a connection shaft coupled to a crank rod of pedal exercise equipment; a pedal body rotatably connected to connection shaft; a plurality of brake pads provided at each other on the front surface and the rear surface; and inclination control plates respectively positioned at the front side and the rear side of the pedal body, and having brake mounting grooves which are formed on one side surface thereof and into which the brake pads are inserted and fixed, a hinge screw through hole formed in the center thereof, and coupling screw through holes formed penetrating both the right and left end portions of the hinge screw through hole long in the vertical direction, wherein a hinge screw is screw-coupled in the hinge screw coupling hole and the hinge screw through hole of inclination control plate and a coupling screw hole is screw-coupled in the coupling screw coupling hole of pedal body and the coupling screw through hole of inclination control plate such that both the right and left side end portions of inclination control plate can move in the vertical direction with respect to the hinge screw.
Patent TW-201811670-A (TW)
Title: Oligosilane production method
Inventor: NOMURA KIYOSHI
IPC: C01B33/04
Filed: 2017-06-09
Abstract: The purpose of the present invention is to provide an oligosilane production method with which a target oligosilane can be selectively produced. By using not only a monosilane, but also an oligosilane with a smaller number of silicon atoms than the target oligosilane or conversely an oligosilane with a larger number of silicon atoms than the target oligosilane as a starting material, it is possible to improve the selectivity of the target oligosilane and efficiently produce the oligosilane.
Patent TW-201801543-A (TW)
Title: Method and apparatus for enhancing microphone signals transmitted from an earpiece of a headset
Inventor: HSU CHAO-LING
IPC: G10L21/02
Filed: 2017-06-13
Abstract: A method and an apparatus for enhancing microphone signals transmitted from an earpiece of a headset are provided. The method comprising: receiving a first signal and a second signal from an in-ear microphone and an outside microphone, respectively, wherein the in-ear microphone is positioned at a proximal side of the earpiece with respect to an ear canal of a user, and the outside microphone is positioned at a distal side of the earpiece with respect to the ear canal; and digitally filtering out in-ear noise from the first signal using the second signal as a reference to thereby produce a de-noised signal.
Patent TW-201800618-A (TW)
Title: Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides
Inventor: POKHREL RAVI
IPC: H05K3/32
Filed: 2017-06-23
Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
Patent TW-201806829-A (TW)
Title: Container and package
Inventor: SATO ISAMU
IPC: B65D43/08
Filed: 2017-07-07
Abstract: This invention provides a container and package that can prevent stored metal from being deformed. One of the modes of this invention is providing a container. The container comprises: a bottomed cylindrical container body having a side wall portion and a bottom wall portion; a cap having a plate portion which covers an opening portion of the container body and a side portion which covers at least a part of the outer surface of the container body; and a plate-shaped inner plug portion being disposed inside the cap. The outer surface of the container body comprises threads. The side portion of the cap comprises two or more thread grooves on the inner surface. The cap is configured as being screwed with the container body by screwing the thread grooves with the threads, and has a plurality of stop portions disposed on the outer surface. The thread grooves have the same number of grooves as the number of the stop portions. The inner plug portion is kept inside the cap by embedding each of the stop portions into each of the thread grooves.
Patent TW-201904199-A (TW)
Title: Level shifter
Inventor: WU JUN
IPC: H03K19/0175
Filed: 2017-07-14
Abstract: The present invention discloses a level shifter including: a bias voltage providing circuit, a level shifting circuit and an output switching circuit. The level shifting circuit includes a high level shifting unit and a low level shifting unit. When the high level shifting unit is in a cut-off state, the high level shifting unit further receives a first bias voltage so as to have the high level shifting unit be in a partial cut-off state and thereby increase the response speed of the high level shifting unit. When the low level shifting unit is in a cut-off state, the low level shifting unit further receives a second bias voltage so as to have the low level shifting unit be in a partial cut-off state and thereby increase the response speed of the low level shifting unit. The level shifter of the present invention has a higher response speed.
Patent TW-201908570-A (TW)
Title: Method of using caissons and piles to construct underwater foundation capable of achieving beneficial effects of saving the construction cost and reducing the engineering risk
Inventor: Zheng can-feng
IPC: E02D27/20
Filed: 2017-07-21
Abstract: The present invention provides a method of using caissons and piles to construct an underwater foundation, and its caisson structure. The caisson includes a box bottom, a plurality of pre-penetration areas disposed at the box bottom, and a plurality of compartments formed to respectively surround each of the pre-penetration areas, wherein each of the pre-penetration areas is subjected to a structural weakening process such that each of the pre-penetration areas is easily broken to make the inside and the outside of the caisson in communication with each other. Each of the pre-penetration areas allows the pile to pass through and can be inserted by the same, and the box bottom and each of the compartments are provided with the effect of reducing seawater infiltration during operation. By utilizing the caisson capable of being manufactured onshore and provided with water-blocking effect, and adopting the field-casting pile, the present invention is advantageous in having lower construction cost than the currently used steel-base pile construction at sea, and the two features can be separately utilized and complemented to achieve beneficial effects of saving the construction cost and reducing the engineering risk.
Patent TW-201837229-A (TW)
Title: Separated type susceptor adapted for a single wafer
Inventor: Ji wen-ming
IPC: H01L21/683
Filed: 2017-07-25
Abstract: This invention provides a separated type susceptor adapted for a single wafer, and the susceptor comprising: a first portion, including a main portion and a groove portion extending along the thickness of the main portion; a second portion including a plane portion, the shape and size of the plane portion being the same as their of the grove portion, the plane portion embedded in the groove portion and the upper surface of the plane portion aligned with the upper surface of the main portion adjacent to the outside of the groove portion while the second portion matched with the first portion. Via the structure of the separate type susceptor, the demand of transferring a wafer can be reached without holes or lift pins. Simultaneously, the assembled susceptor has circular plate shape so that it is advantage for uniforming the temperature of a wafer, improving nano topography on the wafer's upper surface, and decreasing the deposition on the back of the wafer.
Patent TW-201825632-A (TW)
Title: Curable resin composition, image display device and manufacturing method of image display device
Inventor: MIYAMOTO YUKI
IPC: C09J133/08
Filed: 2017-08-24
Abstract: A curable resin composition is provided which contains a photo initiator, a monomer component and a colorant, wherein the photo initiator contains a photo radical polymerization initiator, or a photo radical polymerization initiator and a photobase generator, and the monomer component includes a monomer having one radical polymerizable group and a silanol group and/or alkoxysilyl group. Further, a curable resin composition is provided which contains a photo initiator, a monomer component, a colorant, and a compound having a silanol group and/or alkoxysilyl group, wherein the photo initiator contains a photo radical polymerization initiator, or a photo radical polymerization initiator and photobase generator, and the monomer component includes a monomer having one radical polymerizable group.
Patent TW-201819839-A (TW)
Title: Heat radiation structural member with good comprehensive property and preparation process thereof
Inventor: Lin jin-dong
IPC: F28D17/00
Filed: 2017-08-28
Abstract: Provided is a heat radiation structural member with good comprehensive property. The heat radiation structural member comprises an A board, a B board, a capillary function layer, and cooling liquid, a plurality of copper columns located on the inner surface of the A board and abutted against the A board are welded on the inner surface of the A board at the external surface of the A board through a welding mode, the B board and the A board are assembled in a sealing manner, the B board is provided with grooves matched with the copper columns of the A board, the plurality of copper columns of the A board are abutted against the inner surfaces of the grooves of the B board, and the inner surface of the B board and the abutted plurality of copper columns are welded through the external surface of the B board. The preparation process thereof includes: (1) welding the copper columns on the A board; (2) preparing the capillary function layer; (3) assembling the B board and the A board; (4) welding peripheries of the B board and the A board in a sealing manner to form a cavity structure; and (5) injecting the cooling liquid, performing vacuum pumping, and sealing a cooling liquid pipeline. According to the heat radiation structural member, the preparation is simple, the machining time is greatly reduced, the hardness of the integral heat radiation member is good, the anti-compression and anti-knock properties are excellent, the surface flatness is good, and the glossiness is good.
Patent TW-201800355-A (TW)
Title: Low Tg glass gasket for hermetic sealing applications
Inventor: KOVAL SHARI ELIZABETH
IPC: C03C8/24
Filed: 2013-02-26
Abstract: A glass-coated gasket comprises a gasket main body defining an inner hole and having a first contact surface and a second contact surface opposite the first contact surface, and a glass layer formed over at least a portion of one of the first contact surface and the second contact surface. The glass layer comprises a low melting temperature glass. A hermetic package comprises a substrate/glass-coated gasket/substrate structure that can be sealed using a thermo-compressive sealing step.
Patent TW-201826675-A (TW)
Title: Dc-dc converters
Inventor: HALLIKAINEN SAMULI ANTTI
IPC: H02M3/156
Filed: 2017-09-13
Abstract: A voltage reducing circuit 102 comprises a power switch circuit portion 105 comprising a high-side 128 and low-side 130 field-effect-transistors connected at a switch node 138. The power switch circuit portion has an on-state wherein the high-side transistor is enabled and the low-side transistor is disabled and, vice versa, an off-state. An energy storage circuit portion 106 comprising an inductor 132 connected to the switch node is arranged to provide an output voltage 136. A drive circuit portion 104 receives a pulse width modulated control signal and outputs pulse width modulated (PWM) drive signals. A slew rate control circuit portion 150 comprises one or more slew rate control field-effect-transistors 1600-160n-1 arranged in parallel. A controller connected 170 is arranged to control which of the one or more slew rate control field-effect-transistors is enabled. A power field-effect transistor 162 is connected between the one or more slew rate control field-effect-transistors and the switch node.
Patent TW-201817761-A (TW)
Title: Sealing agent for organic electroluminescent display element
Inventor: WATANABE YASUO
IPC: H01L51/50
Filed: 2017-09-15
Abstract: The purpose of the invention is to provide a sealing agent for organic electroluminescent display elements that has excellent low-outgassing properties, discoloration preventability, coatability, and adhesion to substrates. This invention is a sealing agent for organic electroluminescent display elements, the sealing agent comprising a cationically polymerizable compound and a cationic polymerization initiator, wherein: the sealing agent for organic electroluminescent display elements comprises from 50 parts by weight to 80 parts by weight of a cycloalkene oxide-type alicyclic epoxy compound per 100 parts by weight of said cationically polymerizable compound; and the viscosity measured with an E-type viscometer under the condition of 25 DEG C at 20 rpm is 400 mPa·s or less.
Patent TW-201916680-A (TW)
Title: Dynamic panoramic image synchronization system and method thereof
Inventor: CHEN I-WEN
IPC: H04N13/00
Filed: 2017-09-21
Abstract: A dynamic panoramic image synchronization system and method thereof are disclosed in present invention. The dynamic panoramic image synchronization system includes a first image capturing module, at least one second image capturing module and an image processing module. At first, a plurality of synchronization signals are generated by a synchronization signal generating unit from the first image capturing module at a plurality of capturing timings in a time interval, then a first image data is captured by the first image capturing module at each of capturing timings. When the second image capturing module receives the plurality of synchronization signal signals, the second image capturing module captures at least one second image data at each of capturing timings. Image processing module receives the first image data and the second image data via each of capturing timings, then base on the first image data and the second image data at each of capturing timings to form a plurality of panoramic image data, to form a dynamic panoramic image in the time interval.
Patent TW-201826575-A (TW)
Title: Light emitting device and method for manufacturing light emitting device
Inventor: ISHIKAWA TETSUYA
IPC: H01L33/62
Filed: 2017-09-28
Abstract: A light emitting device includes a resin molding, first and second leads, and a light emitting element. The resin molding includes a front surface defining an opening, and a lower surface adjacent to the front surface. The first and second leads each includes an outer lead portion and an inner lead portion. The outer lead portion protrudes from the lower surface of the resin molding, and includes a bent portion bent along the lower surface. A surface on an inner side of the bent portion including a first recessed section. The inner lead portion includes an embedded portion embedded in the resin molding, and an exposed portion exposed in the opening. A surface of the embedded portion opposite from the surface where the first recessed section is provided includes a second recessed with a part of the resin molding being positioned in the second recessed section.
Patent TW-201916784-A (TW)
Title: Chassis heat dissipation structure
Inventor: LIN YUAN-YI
IPC: H05K7/20
Filed: 2017-09-29
Abstract: A chassis heat dissipation structure includes a chassis main body. The chassis main body has a chassis support, a thermal module and at least one heat conduction unit. At least one server mainframe is disposed on the chassis support. The thermal module has at least one heat dissipation unit and multiple fan units. The heat dissipation unit is disposed between the fan units and the server mainframe. The heat conduction unit has at least one first end and one second end. The first end is in contact with a heat generation module of the server mainframe. The second end is in contact with the heat dissipation unit. The heat conduction unit serves to conduct the heat of the heat generation module to the heat dissipation unit. The fan units serve to carry away the heat of the heat dissipation unit to dissipate the heat.
Patent TW-201915475-A (TW)
Title: A method for molecule detection
Inventor: WANG YING-CHENG
IPC: G01N21/65
Filed: 2017-09-30
Abstract: The invention relates to a molecule detection method, the method includes following steps: providing a molecule carrier, wherein the molecule carrier comprises a flexible substrate and a metal layer on the flexible substrate, wherein the flexible substrate comprises a first base and a patterned first bulges located on a surface of the first base, the patterned first bulges comprises a number of strip shaped bulges or bumps to form a net having a number of first holes, and the metal layer is located on the patterned first bulges; attach the surface of the metal layer away from the flexible substrate to the sample to be tested and the analyte molecule is formed on the surface of the metal layer; use a detector to detect the molecules.
Patent TW-201917619-A (TW)
Title: Method and apparatus for analyzing malware
Inventor: PAN CHIEN-CHUAN
IPC: G06F21/56
Filed: 2017-10-17
Abstract: Evolved method and apparatus for analyzing malware are provided. In the analyzing method, a virtualized operation system (OS) is simulated to obtain information of function behaviors and system behaviors, and the function behaviors is compared with the system behaviors to find out a new hiding method and technique of malware. Then, the virtualized OS is emulated to obtain information of function virtual memory and physical memory, and the information of function virtual memory and physical memory is analyzed to find out a new API calling method and technique. In addition, a malware database is established to evolve the analyzing apparatus and further find a new malware.
Patent TW-201917895-A (TW)
Title: Semiconductor device
Inventor: HSIN YUE-MING
IPC: H01L29/78
Filed: 2017-10-24
Abstract: A semiconductor device is provided. The semiconductor device includes a source, a drain, a composite channel structure and a gate structure. The source has a first conductive type. The drain has a second conductive type. The composite channel structure is located between the source and the drain along a first direction. The composite channel structure includes a first channel structure and a second channel structure. The first channel structure is located between the source and the second channel structure, and has a first bandgap. The second channel structure is located between the first channel structure and the drain, and has a second bandgap. The first bandgap is less than the second bandgap. The gate structure is abutted with the composite channel structure along a second direction. The first direction is intersected with the second direction.