baber/WOPTO huggingface dataset:
Patent JP-2005520714-A (JP)
IPC: G02C13/00
Filed: 2003-03-20
Abstract: A gripper ( 1 ) for contact lenses comprises a gripper head ( 10 ) which has a bearing surface ( 100 ) for a contact lens (CL) and in which one or more openings ( 101, 102 ) are provided through which an underpressure can be applied in order to suck the contact lens (CL) against the bearing surface ( 100 ), and through which an overpressure can be applied in order to release the contact lens (CL) from the bearing surface ( 100 ). Channels ( 103 ) are provided in the bearing surface ( 100 ) and connect a plurality of openings ( 101, 102 ) to one another.
Patent JP-2005521618-A (JP)
Title: ヘキサフルオロヒ酸リチウムの製造方法
IPC: C01G28/00
Filed: 2002-03-28
Abstract: 【課題】有毒物質を用いずヘキサフルオロヒ酸リチウム（ＬｉＡｓＦ ６ ）を製造する簡便な方法を提供する。 【解決手段】高純度で乾燥した分析試薬のＬｉＯＨ、Ｌｉ ２ Ｏ、ＬｉＮＯ ３ またはＬｉ ２ ＣＯ ３ のようなリチウム塩は等モルの三酸化砒素と混合され、電気炉で注意深く２５０〜４００℃の温度範囲で連続的に４時間加熱される。得られた中間製品は６から９倍の分子量の弗化アンモニウム（分析試薬）と混合され、マッフル炉で１５０〜３００℃の温度範囲で注意深く４時間連続で加熱されＬｉＡｓＦ ６ を得る。
Patent JP-2005521748-A (JP)
Title: バイオマスおよびオレフィンからのレブリン酸エステルおよびギ酸エステルの製造
IPC: C10L1/08
Filed: 2003-04-01
Abstract: 本発明は、バイオマスおよびオレフィンからのレブリン酸エステルおよびギ酸エステルの混合物の製造方法、ならびにそれから調製される組成物に関する。本発明はまた、これらエステルの混合物のガソリン燃料、ディーゼル燃料、および生物燃料用の燃料添加物としての使用法にも関する。
Patent JP-2005523522-A (JP)
Title: アプリケーション共用セキュリティ
IPC: G06F21/12
Filed: 2003-04-22
Abstract: アプリケーション共用を容易にするための方法、装置およびコンピュータ読取り可能な媒体。データ処理ネットワーク（１００）は、ＬＡＮ（４２および４４）を含む、複数の個別のネットワークを含む。本発明は、通信リンク（４８、５２、５６）を介してコンピュータ（１０）に接続されるゲートウェイサーバ（５８）をさらに開示する。操作中、ユーザは、第１のコンピュータ上で操作する複数のアプリケーションの内の少なくとも１つを選択し、少なくとも１つの第２のコンピュータと共用する。第２のコンピュータを操作するユーザが複数の権限のない操作の内の少なくとも１つを実行することを防止するための複数のセキュリティ手段の内の少なくとも１つを選択する。次に、ユーザは、第１のコンピュータ上でアプリケーション共用を開始し、第２のコンピュータを操作するユーザは、第１のコンピュータ上で実行するアプリケーションにアクセスする、または見ることができるが、第１のコンピュータ上でいかなる権限のない操作も実行することができない。
Patent JP-2005523664-A (JP)
IPC: H04H60/33
Filed: 2003-04-14
Abstract: The invention is related to a method and a system of providing a service associated with a media stream for user equipment The system comprises a server connected to a communication network for providing the service using the radio interface of the communication network. The system further comprises a broadcast system for providing the media stream. Associating data for associating the media stream with the service is transmitted from the system to the user equipment. The associating data is received, and the system is configured to provide the user equipment with the service by using the associating data.
Patent JP-2005194122-A (JP)
Title: Reaction-retarded quick lime and its production method
Inventor: KASE KAZUO
IPC: B09C1/08
Filed: 2004-01-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a reaction-retarded quick lime capable of suppressing scattering; and its production method.  <P>SOLUTION: An organic solvent, e.g. methanol 2, is added to a particulate matter of reaction-retarded quick lime 1 to convert the particulate matter into a granular matter. In another way, an organic solvent, e.g. methanol 2, is added to a particulate matter of reaction-retarded quick lime 1 to bond the particulates of the matter to each other by a capillary phenomenon caused by the evaporation of the methanol 2, thus converting the particulate matter into a granular matter. The organic solvent added to the particulate matter may be ethanol without being limited to methanol.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005203453-A (JP)
Title: Method for manufacturing semiconductor device
Inventor: NONOYAMA SHIGERU
IPC: H01L21/56
Filed: 2004-01-14
Abstract: <P>PROBLEM TO BE SOLVED: To prevent scattering of the edge material of a semiconductor carrier when the semiconductor carrier is cut in a step for manufacturing of a semiconductor device.  <P>SOLUTION: The method for manufacturing a semiconductor device includes a bonding step wherein a semiconductor device 6 is mounted and bonded to a segment 4d that is cut out as a plurality of piece substrates 4a in a semiconductor carrier 4, a sealing step wherein a sealing resin 7 is injected into a clearance between the semiconductor carrier 4 and the respective semiconductor devices 6, an electrode formation step wherein a bump electrode 8 is formed in a plurality of external connection terminals 3 on the backside of the segment 4d, an adhesion step wherein the upper surface of the semiconductor device 6 is adhered to the surface of a reference member 9, and a cutting step to cut out a plurality of piece substrates 4a. The sealing resin 7 used in the sealing step is used to form a projecting part 14 made of sealing resin in parts excluding the segment 4d in the semiconductor carrier 4, and the projecting part 14 made of sealing resin is adhered to the surface of the reference member 9 during adhesion step.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005198954-A (JP)
Title: Frame assembly line apparatus for game machine, conveying device for game machine, and conveying stand for frame assembly
Inventor: TOYAMA YASUHIRO
IPC: A63F7/02
Filed: 2004-01-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide frame assembly line apparatus for a game machine which can suppress burden to a worker to a minimum, and also, can increase the working efficiency, can smoothly perform the conveying of a conveying stand for a frame assembly and a conveying stand for the game machine, and in addition, does not require a frequent maintenance; and to provide a conveying device for the game machine, and the conveying stand for the frame assembly.  <P>SOLUTION: The frame assembly line apparatus 41 is equipped with the conveying stand 31 which supports the frame base 12 of a pachinko game machine 10, and a line body 42 which conveys the conveying stand 31 while supporting it. The line main body 42 can support the conveying stand 31 under a backward tilted state wherein the conveying stand 31 is tilted to the rear side. Also, the line body 42 is equipped with a lower roller 74 which supports the bottom plate section 40 of the conveying stand 31, and an upper roller 50 which supports the upper section of the conveying stand 31. Both of the rollers 50 and 74 roll when the conveying stand 31 is conveyed.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005209713-A (JP)
Title: Semiconductor device and manufacture method thereof
Inventor: SUZUKI ZENZO
IPC: H01L21/66
Filed: 2004-01-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device that enhances pattern precision and can evaluate a pattern precisely.  <P>SOLUTION: The manufacturing method of the semiconductor device includes a process for forming a conductive film on the surface of a semiconductor substrate, and a patterning process for forming the functional pattern of the conductive film by patterning the conductive film. Further, the method includes a process, where a mask pattern used for the patterning process includes a dummy pattern formed so that the pattern precision of the functional pattern of the conductive film can be maintained, and a pad connected to at least one of the dummy patterns provided at a position close to the functional pattern in the dummy patterns, and the resistance of the dummy pattern connected to the pad is measured using the pad formed in the patterning process; and a pattern evaluation process for determining whether the resistance is within a prescribed range.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004134814-A (JP)
Title: Manufacturing method of circuit substrate having three-dimensional surface mounting array of semiconductor chip and device
Inventor: KLEDZIK KENNETH
IPC: H05K13/04
Filed: 2004-01-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide an effective and cost-effective manufacturing process and a device making use of the result of a new development to make it possible to position a chip by a three-dimensional array on a printed circuit substrate.  <P>SOLUTION: This method makes use of a unique chip carrier. It employs a manufacturing process of a plurality of processes that automate the surface mounting of a semiconductor chip and achieve the three-dimensional array of a chip. It includes a process of imparting solder to a plurality of chip carriers simultaneously, a process of positioning a chip carrier having a chip on a printed circuit substrate and a process of connecting all the elements eternally after making a chip and a carrier constituted as a three-dimensional array pass a single reflow oven and completing a single reflow process.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004253374-A (JP)
Title: Electron microscope
Inventor: HAYASHIBARA MITSUO
IPC: H01J37/16
Filed: 2004-01-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electron microscope, saving space, having portability, requiring shorter starting time, and thus reducing psychological burden to the user.  <P>SOLUTION: The electron microscope comprises an electron source, a vacuum pump, a sample holder and an electron beam detector which are mounted on a vacuum container, and also comprises an electron lens for controlling the orbit of electron beams, a display for displaying an image based on a signal obtained by the electron beam detector, and a control power source. The vacuum container, the electron source, the vacuum pump, the electron beam detector, the electron lens and the control power source are integrally provided on the rear surface side of the display. A sample is placed into or taken out through a portion provided under the display. Such ubiquitous design can solve existing problems and achieve an electron microscope having less psychological burden to the user.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2005159254-A (JP)
Title: Method of manufacturing laminated ceramic electronic component
Inventor: WATANABE YASUO
IPC: H01G13/00
Filed: 2004-01-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated ceramic electronic component such as a laminated ceramic capacitor which has few structural defects and an improved high-temperature accelerated lifetime.  <P>SOLUTION: The method of manufacturing the laminated ceramic electronic component comprises a firing step of firing a laminate in which a paste for dielectric layers and a paste for internal electrodes containing a base metal are alternately arranged to form a plurality of layers, a first annealing step of annealing the fired laminate at a temperature T1 between 600°C and 900°C, and a second annealing step of annealing the first-annealing-finished laminate at a temperature T2 between 900°C and 1,200C (where, 900°C is excluded).  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005211972-A (JP)
Title: Hot forging apparatus and hot-forging method
Inventor: MAI SHIGEKI
IPC: B21J13/02
Filed: 2004-01-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a hot forging apparatus and a hot forging method excellent in prolongation of the service life of a die etc.  <P>SOLUTION: The hot forging apparatus has an prolonged service life of the die by reducing the quantity of heat transfer from a work to the die during the interval since forming the work till transporting or removing the work. The hot forging apparatus is provided with: a punch and the die 11; a knock-out pin 12 combined with the die 11 and shiftable axially; and a knock-out pin driving means 13 for shifting the knock-out pin 12 in the direction pushing out the work W subjected to hot forging with the punch, the die 11 and the knock-out pin 12, from the die 11, wherein the knock-out pin driving means 13 is provided with a mechanism pushing out the work W subjected to the hot forging, while dividing the work W into a plurality of steps. That is, the quantity of heat transfer from the work W to the die 11 can be reduced while holding the work W in the die 11 by pushing out the work W with the knock-out pin 12 so as to be divided into the plurality of steps.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005219537-A (JP)
Title: Tire for passenger car
Inventor: SUZUKI TOSHIAKI
IPC: B60C9/18
Filed: 2004-02-03
Abstract: <P>PROBLEM TO BE SOLVED: To suppress reduction of comfortable riding property and operation stability to a low degree while exhibiting excellent rolling resistance performance in use of a tire with high internal pressure.  <P>SOLUTION: In the normal internal pressure state, tread ground-contact width TW is made to 0.55-0.65 times the nominal width of the tire and width BW of a belt ply 7A of the maximum width is made larger than 1.0 time and 1.2 times or less the tread ground-contact width TW. In a state of internal pressure of 300 kPa, a camber amount Ca, i.e., a tire radial distance from a tire equator point Cp on a tread surface 2S to a tread ground-contact end Te is made 0.045-0.070 times the tread ground-contact width TW.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005220379-A (JP)
Title: Method for producing non-heat treated high strength thick steel plate excellent in toughness at extra-large heat input weld heat-affected zone
Inventor: UEDA KEIJI
IPC: C22C38/58
Filed: 2004-02-03
Abstract: <P>PROBLEM TO BE SOLVED: To produce a high strength thick steel plate excellent in toughness at an extra-large heat input weld heat-affected zone, which has ≥590 MPa tensile strength, ≤80% low yield ratio and excellent HAZ toughness even in an extra-large heat input welding of >400 KJ/cm, in a non-heat treatment.  <P>SOLUTION: A steel block having the composition containing 0.05-0.13% C, and the suitable contents of Si, Mn, P, S and Al and further, 0.005-0.030% Ti, 0.0030-0.0070% N, 0.0005-0.0050% Ca, 0.0010-0.0030% O and 0.35-0.44% carbon equivalent Ceq and satisfying 0.2-0.8 ACR, is heated into the range of 1000-1300°C, and after applying hot-rolling at not lower than Ar<SB>3</SB>transformation point to the rolling-finish temperature, accelerating cooling treatment is applied till ≤600°C at 1-20°C/s average cooling speed. In this way, the thick steel plate having ≥590 MPa TS, ≤80% YR and showing the excellent HAZ toughness even in the case of such welding heat affected part of the extra-large heat input welding as to exceed 400 KJ/cm welding heat input, can be obtained with the non-heat treatment.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005223853-A (JP)
Title: Acoustic system
Inventor: KATO HIROAKI
IPC: H04R1/32
Filed: 2004-02-09
Abstract: <P>PROBLEM TO BE SOLVED: To obtain an acoustic system for enabling the audience who needs explanations, to listen to the explanations while feeling the original atmosphere of a Noh, kabuki performance, or the like.  <P>SOLUTION: With regard to an acoustic system 10 which is installed in a theater having an audience fields comprised of a plurality of seats, the acoustic system comprises: a modulator 12 for modulating a carrier of an ultrasonic band with an audible sound signal; and a radiator 14 for radiating a modulated signal from the modulator 12 to a sonic wave arrival area that is set in a part of seats of the audience field, as an ultra-directional sonic wave to enable an audible sound to reach only said seats via the ultra-directional sonic wave.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005227386-A (JP)
Title: Pop-up stroboscope
Inventor: YAMADA TOSHIAKI
IPC: G03B15/05
Filed: 2004-02-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide a pop-up stroboscope capable of effectively preventing the vignetting of strobe light and excellent in housing operability.  <P>SOLUTION: The pop-up stroboscope is equipped with; a slide member supported to advance/retreat between an advance position where it comes close to a subject and a retreat position where it retreats therefrom on a camera main body; a light emitting part unit supported to turn to a housing position where it is housed in the camera main body and a projecting position where it projects from the camera main body on the slide member; and a housing guide mechanism giving moving component force in a retreat position direction to the light emitting part unit and the slide member in accordance with the turning of the light emitting part unit from the projecting position to the housing position when the slide member exists at the advance position.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004262240-A (JP)
Title: Laminate of resin and metal
Inventor: UEMAE MASAKI
IPC: B32B15/08
Filed: 2004-02-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide a laminate of an aromatic liquid crystal polyester resin and a metal which is excellent in strength and dimensional stability and does not curl independently of its shape and size.  <P>SOLUTION: The resin-metal laminate comprises a metal layer and an aromatic liquid crystal polyester resin layer formed on one surface of the metal layer by coating. The resin layer contains at least an aromatic liquid crystal polyester resin and a short fiber-shaped inorganic filler dispersed therein.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2005228994-A (JP)
Title: Laser device and method for oscillating laser
Inventor: ITO TADASHI
IPC: B82B1/00
Filed: 2004-02-13
Abstract: <P>PROBLEM TO BE SOLVED: To realize a laser device capable of realizing a laser oscillation using an efficient emission phenomenon.  <P>SOLUTION: The laser device for initiating the laser oscillation with the use of a semiconductor quantum dot comprises a laser member 11 on which the semiconductor quantum dot is formed, a resonator 14 for resonating the beam generated at the laser member 11; and a pump laser 15 for irradiating an excitation beam having an energy corresponding to a two-photon resonance exciation to the laser member 11, so as to form an excitonic molecule state to the semiconductor quantum dot with the two-photon resonance exciation.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005235799-A (JP)
Title: Method for manufacturing epitaxial wafer for semiconductor light-emitting device
Inventor: KONNO TAIICHIRO
IPC: H01L21/205
Filed: 2004-02-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an epitaxial wafer for a semiconductor light-emitting device that can be manufactured with improved reproducibility so that no thyristor characteristic does not appear in the semiconductor light-emitting device, having a direct transition high-concentration semiconductor uppermost layer using Zn as an additive between a window layer of a metal oxide and a second conductivity-type cladding layer.  <P>SOLUTION: When successively laminating an emission section 10 in which an active layer 4 is sandwiched by a first cladding layer 3 and a second one 5, a contact layer 6 using Zn as an additive to a substrate 1, and a window layer 7 of the metal oxide on it, the supply of an additive raw material and a group III raw material is stopped while maintaining the formation temperature of the contact layer 6 after the formation of the contact layer 6 is completed, or the supply of the addition raw material and the group III raw material is stopped at the growth temperature or lower of the emission section 10 and at the formation temperature or higher of the contact layer 6, and a cooling process is performed after a time section for supplying only the group V raw material for 10 minutes or longer. Then, an ITO film 7 that is the window layer of the metal oxide is formed on the contact layer 6.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005236784-A (JP)
Title: Pll circuit
Inventor: OBA YASUO
IPC: H03L7/07
Filed: 2004-02-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a PLL circuit that is reduced in characteristic variation and temperature dependency with respect to a plurality of input signals, wherein the cost reduction is attained when handling a plurality of frequencies.  <P>SOLUTION: A PLL circuit part 102 for entering a reference frequency signal stabilizes the frequency of a voltage controlled oscillator 7. A control voltage being the same as a frequency control voltage of the voltage controlled oscillator 7 is entered to a voltage controlled oscillator 3 with the same configuration as that of the voltage controlled oscillator 7 to construct a PLL circuit part 100. In the PLL circuit part 102, variable frequency dividers 10 and 8 are provided for a reference frequency signal and an output of the voltage controlled oscillator 7. Self-running frequencies of the voltage controlled oscillators 3 and 7 are switched in accordance with an input signal to the PLL circuit part 100, and also, frequency division ratios of the variable frequency dividers 10 and 8 are switched. This constructs a PLL circuit with reduced temperature dependency and variation dependency with respect to a plurality of input signals and reference frequency signal sources.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005241412-A (JP)
Title: Testing device of automobile
Inventor: NAKAMURA ISAO
IPC: G01M17/007
Filed: 2004-02-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a testing device concurrently serving as a shock testing device and as a chassis dynamometer.  <P>SOLUTION: When used as the shock test device (b), a cam block 4 for a front wheel and a cam block 5 for a rear wheel are mounted on a drum 1 for the front wheel and a drum 2 for the rear wheel, respectively having a desired phase relation, and a clutch 10 is set in the power transmission state and a motor 7 is rotated. When used as the chassis dynamometer (c), the clutch 10 is set in the power transmission cut-off state, and the cam block 5 for the rear wheel is dismounted from the drum 2 for the rear wheel. Then, while performing automatic operation of a test car by a control device 17, the current of the motor 7 is measured and controlled, to thereby measure and control the torque, working between the drum 2 for the rear wheel and the rear wheel (driving wheel) of the test car.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005244812-A (JP)
Title: Terminal information management system
Inventor: SHIRAISHI HONAMI
IPC: H04M11/00
Filed: 2004-02-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a terminal information management system in which a compound terminal device acquires and registers terminal information stored in a terminal information storage device.  <P>SOLUTION: A terminal information management system 1 includes: internal terminal devices 6, 7 which are communicable with each other; terminal information management servers 3-5; and a compound machine 8. Each of the terminal information management servers 3-5 includes: a storage section for storing terminal information related to the internal terminal devices 6, 7, and the compound machine 8 includes: an input operating section wherein designation information for designating terminal information stored in the terminal information management servers 3-5 is inputted or terminal designation information for designating the internal terminal devices 6, 7 to register acquired terminal information is inputted by operation by an operator; and a CPU wherein terminal information stored in the terminal information management servers 3-5 is acquired based on the designation information or terminal information acquired from the terminal information management servers 3-5 is registered in the designated internal terminal devices 6, 7 based on the terminal designation information.  <P>COPYRIGHT: (C)2005,JPO&NCIPI