baber/WOPTO huggingface dataset:
Patent TW-200734138-A (TW)
Title: A hammer tool capable of storing tool shaft and screwdriver bits set inside the handle
Inventor: Lin ming-xuan
IPC: B25D1/00
Filed: 2006-03-08
Abstract: This invention relates to a hammer tool with handles capable of storing tool shaft and screwdriver bits holder set inside, including a main body unit, a screwdriver bits holder that can be stored in the inside space of the main body unit, a tool shaft that can be inserted and held in the screwdriver bits holder, and a plurality of first screwdriver bits set which can be inserted on the bits holder or one of which can be attached to the tool shaft, and a plurality of second driver bits set that can be inserted on the bits holder. By this design, the tool can be used as a normal hammer; or when the screwdriver bits holder is taken out of the main body, the tool shaft can be attached with any of the first screwdriver bits set for driving various screws.
Patent TW-200729521-A (TW)
Title: Lateral photodetectors with transparent electrodes
Inventor: PAN DONG
IPC: H01L31/0224
Filed: 2006-03-10
Abstract: A photodetector includes a substrate and a layer of Ge formed on the substrate. A plurality of n-type doped regions and a plurality of p-type doped regions are formed in Ge region. These doped regions formed an alternating pattern. Electrodes are formed on n-type doped regions and on the p-type doped regions. The utilization of transparent electrodes increases the sensitivity of the photodetector without impacting speed.
Patent TW-200735288-A (TW)
Title: A package structure with enhancing layer and manufaturing the same
Inventor: CHEN HUI-PIN
IPC: H01L23/00
Filed: 2006-03-15
Abstract: A package structure with enhancing layer including a leadframe having a plurality of lead tips; a chip having a plurality of bonding pads, a plurality of bumps adopted to interconnect lead tips and bonding pads; and an enhancing layer covering over lead tips and bumps. The materials of enhancing layer comprise copper (Cu), and the melting point of enhancing layer is greater than those of lead(Pb) and tin(Sb) metal bulk, and is formed by electric plating method.
Patent TW-200644288-A (TW)
Title: Free standing substrate, method for manufacturing the same, and semiconductor light emitting element
Inventor: UEDA KAZUMASA
IPC: H01L21/205
Filed: 2006-03-20
Abstract: The invention provides a free standing substrate, method for manufacturing the same, and a semiconductor light emitting element. The free standing substrate contains a semiconductor layer and inorganic particles. The inorganic particles are contained in the semiconductor layer. The method for making the free standing substrate contains the following process steps (a) - (c) in a sequential order. (a) the step of deploying inorganic particles on a substrate; (b)the step of growing the semiconductor layer; and (c) the step of separating the semiconductor layer and the substrate. In another aspect the method for making the free standing substrate contains the following process steps in a sequential order. (a) the step of growing a buffer layer on a substrate; (b)the step of deploying inorganic particles on the buffer layer; (c) growing a semiconductor layer; and (d) separating the semiconductor layer and the substrate. The semiconductor light emitting element contains the above free standing substrate, a conductive layer, a light emitting layer, and electrodes.
Patent TW-200708924-A (TW)
Title: Electronic lock system and method of use thereof
Inventor: CHIU SHYH-CHANG
IPC: E05B63/14
Filed: 2006-05-03
Abstract: In an electronic lock system, a lock includes a lock housing with an integral female USB connector, a lock mechanism supported by the lock housing, and a storage supported by the lock housing and operative for storing a first, predetermined electronic image. A key includes a key housing, an imaging system supported by the key housing and operative for determining a second electronic image of nonoptical features of a body part in contact with the key, and a male USB connector supported by the key housing and interfaced with the imaging system for passage of or permitting access to the second electronic image. A computational unit is provided and is operative for comparing the first and second electronic images when the male and female USB connectors are mated and for causing the lock mechanism to move to its open or closed position as a function of the comparison.
Patent TW-200717998-A (TW)
Title: Method and apparatus for estimating the step-size of an adaptive equalizer
Inventor: PIETRASKI PHILIP J
IPC: H03D1/04
Filed: 2005-10-21
Abstract: A step-size estimator for controlling the step-size of an adaptive equalizer incorporated in a transceiver, (e.g., a wireless transmit/receive unit (WTRU)). The step-size estimator updates at least one adaptive equalizer tap used by the adaptive equalizer based on an apparent speed of a channel established between the transceiver and another transceiver. The step-size estimator includes a speed estimator, a signal-to-noise ratio (SNR) averager and a step-size mapping unit. The speed estimator is used to estimate the apparent speed of the channel, (i.e., the observed and/or measured rate of change of the channel impulse response). The SNR averager generates a common pilot channel (CPICH) SNR estimate. The step-size mapping unit uses the speed estimate and the CPICH SNR estimate to generate a step-size parameter, μ, and a filter taps leakage factor parameter, α, used by the adaptive equalizer to update the filter tap coefficient.
Patent TW-200743370-A (TW)
Title: Flicker frequency detection method and device
Inventor: CHO CHIA-CHUAN
IPC: H04N5/21
Filed: 2006-05-10
Abstract: A flicker frequency detection method includes defining a plurality of adjacent sensing sections of the same size on a display panel based on an M Hz frequency, an N Hz frequency and the panel resolution, calculating a reference average signal measured by a first sensing section, calculating a first average signal measured by an (n+1)th sensing section, calculating a second average signal measured by an (m+1)th sensing section, calculating a first difference value between the first and reference average signals, calculating a second difference value between the second and reference average signals, determining a relationship between the first and second difference values, and outputting corresponding signals based on the relationship between the first and second difference values. The ratio between the area covered by the first through mth sensing sections and that covered by the first through nth sensing sections is proportional to the ratio between M and N.
Patent TW-200701237-A (TW)
Title: Reference scheme for a non-volatile semiconductor memory device
Inventor: REDAELLI MARCO
IPC: G11C16/10
Filed: 2006-05-12
Abstract: A non-volatile semiconductor memory device is provided comprising a memory area and a circuitry area. The memory area includes a plurality of memory cells and a set of array reference cells that are programmable to have a threshold voltage corresponding to an erased or a programmed state of a memory cell. In the circuitry area, additional main reference cells are provided, which are configured to also have a threshold voltage corresponding to an erased or programmed state of a memory cell. The main reference cells are used for setting of said array reference cells and said array reference cells are provided as a reference for reading or writing a state of said memory cells. A method is also provided for setting array reference cells in a non-volatile semiconductor memory device to a predefined threshold voltage.
Patent TW-200709390-A (TW)
Title: Power interconnect structure for balanced bitline capacitance in a memory array
Inventor: AKAOGI TAKAO
IPC: H01L27/04
Filed: 2006-07-03
Abstract: According to one exemplary embodiment, a semiconductor die includes a memory core array (302) situated over a substrate, where the memory core array (302) includes a number ofbitlines (306a,306b,306c), where the bitlines (306a,306b,306c) can be situated in a first interconnect metal layer in the semiconductor die. The semiconductor die further includes an interconnect structure (307) situated over the memory core array (302), where the interconnect structure (307) is situated in a second interconnect metal layer in the semiconductor die and situated over each of the bitlines (306a,306b,306c). The interconnect structure (307) can include at least one interconnect line (310,312), which can form an angle (318) with respect to the bitlines (306a,306b,306c) that can be greater than 0.0 degrees and less than or equal to 90.0 degrees. The interconnect structure (307) can form one of a number of capacitances with each of the bitlines (306a,306b,306c), where each of the capacitances can be substantially equal in value to each other of the capacitances.
Patent TW-200805603-A (TW)
Title: Chip package and manufacturing method threrof
Inventor: CHEN YA-CHI
IPC: H01L23/48
Filed: 2006-07-05
Abstract: A chip package including a chip, a leadframe, first bonding wires, second bonding wires, and third bonding wires is provided. The chip has an active surface, first bonding pads, and second bonding pads. The first bonding pads and the second bonding pads are disposed on the active surface. The chip is fixed under the leadframe. The leadframe includes inner leads and bus bars. The inner leads and the bus bars are located over the chip, and the bus bars are located between the inner leads and the corresponding first bonding pads. The first bonding pads are respectively connected to the bus bars by the first bonding wires. The bus bars are respectively connected to a portion of the inner leads by the second bonding wires. The second pads are respectively connected to the other portion of the inner leads by the third bonding wires. The possibility of the bonding wires collapsing can be reduced in the said chip package.
Patent TW-200803952-A (TW)
Title: Automatically separated machine for feathers
Inventor: CHANG MING-KUN
IPC: A63B45/00
Filed: 2006-07-07
Abstract: The feathers of the badminton are formed by processing goose feathers via the pressing mold. Therefore, the shape and size are fixed. The feathers after being processed will stack up. Therefore, the separation of each feather is necessary. But the weight of the feather is quit light. Each feather will attract each other by the influence of the static electricity and is not easy to be separated. And at the same time the feather is quite fragile by itself and is easy to be destroyed. Therefore, only the means of manpower separation could be adopted to pick and separate one by one. The characteristics of this invention comprises: one, the special feather shape fitting board which is convenient for storing the feathers; two, the circular feather grasping apparatus which attracts the feathers by utilizing the vacuum pressure to make it be separated from the whole pile of feathers; three, utilizing a vacuum air limiting ring to cut the vacuum air and make the feathers be separated automatically. Therefore, an automatically separated machine for feathers is invented to separate the feathers automatically.
Patent TW-200728732-A (TW)
Title: Probe card assembly with an interchangeable probe insert
Inventor: ELDRIDGE BENJAMIN N
IPC: G01R1/073
Filed: 2006-07-07
Abstract: A probe card assembly can include an insert holder configured to hold a probe insert, which can include probes disposed in a particular configuration for probing a device to be tested. The probe card assembly can provide an electrical interface to a tester that can control testing of the device, and while attached to the probe card assembly, the insert holder can hold the probe insert such that the probe insert is electrically connected to electrical paths within the probe card assembly that are part of the interface to the tester. The insert holder can be detached from the probe card assembly. The probe insert of the probe card assembly can be replaced by detaching the insert holder, replacing the probe insert with a new probe insert, and then reattaching the insert holder to the probe card assembly. The probe insert and holder can be integrally formed and comprise a single structure that can be detached from a probe card assembly and replaced with a different probe insert and holder.
Patent TW-200706551-A (TW)
Title: Layered sheets and processes for producing the same
Inventor: HIROSE JUNJI
IPC: C08G18/00
Filed: 2006-07-12
Abstract: A process for extremely easily producing a layered sheet which has a holding surface having high surface precision; a process for extremely easily producing a layered sheewhich has a holding surface having high surface precision and which has the excellent property of absorptively holding a material to be ground; a layered sheet which has a holding surface having surface precision and has the excellent property of absorptively holding a material to be ground and a process for producing the layered sheet; and a layere sheet which has the excellent property of absorptively holding a material to be ground and has excellent durability. The layered sheets each comprises a base sheet and a polyurethane foam layer.
Patent TW-200722772-A (TW)
Title: System-on-a-chip pipeline tester and method
Inventor: HUBSCHER RONALD A
IPC: G01R31/28
Filed: 2006-07-24
Abstract: A pipeline tester is disclosed that is capable of testing systems-on-a-chip (SOCs) or Devices Under Test (DUTs) in pipeline fashion. The tester provides faster, more economical testing of such SOCs and DUTs, which are loaded sequentially into the tester. A plurality of underlying test stations are disposed in the tester. Above the test stations are disposed corresponding test fixtures which are configured to receive moveable test beds therein. The test beds are mechanically and electrically connected to the underlying test stations. Loaded within each test bed is an SOC or DUT. One or more electrical or electronic tests are performed on each SOC or DUT while the SOC or DUT is loaded in a test bed positioned above a test station. Once the test has been completed, the test bed is moved to another test station, where another electrical or electronic test is performed. Electrical or electronic testsmaybe performed in parallel on different DUTs or SOCs loaded into different test beds.
Patent TW-200720197-A (TW)
Title: System and method of slurry treatment
Inventor: WISMER MICHAEL W
IPC: C02F1/42
Filed: 2006-07-27
Abstract: Wastewater streams from semiconductor processing operations are treated to reduce the concentration therein of one or more metal species to a satisfactory level. The disclosed systems and technique utilize complexing ion exchange media to treat the wastewater streams having a significant concentration of oxidizing species.
Patent TW-200712119-A (TW)
Title: Cold-shrink article and method of making cold-shrink article
Inventor: BANDYOPADHYAY PRADIP KUMAR
IPC: C08L27/12
Filed: 2006-07-28
Abstract: An elastomeric composition that includes a fluorelastomer and an epichlorohydrin. The elastomeric composition can be formed into cold-shrink articles that are resistant to tearing at elevated temperatures.
Patent TW-200712055-A (TW)
Title: Storage stable solutions of optical brighteners
Inventor: FARRAR JOHN MARTIN
IPC: C07D251/68
Filed: 2006-08-02
Abstract: The instant invention relates to storage stable solutions of optical brighteners based on certain salt forms of anilino-substituted bistriazinyl derivatives of 4,4'-diaminostilbene-2,2'-disulphonic acid which do not need extra solubilising additives.
Patent TW-200720395-A (TW)
Title: Pressure-sensitive adhesive label for hard disk drive, and hard disk drive using the pressure-sensitive adhesive label for hard disk drive
Inventor: NONAKA TAKAHIRO
IPC: C09J7/02
Filed: 2006-09-18
Abstract: The pressure-sensitive adhesive label for a hard disk drive is a pressure-sensitive adhesive label for adhering to a package outer surface of a hard disk drive, having a substrate, an information display portion forming face formed on one side of the substrate and a pressure-sensitive adhesive layer formed on other side of the substrate, and is characterized in that as the pressure-sensitive adhesive layer, the surface has a conductive pressure-sensitive adhesive layer utilized as a pressure-sensitive adhesive surface, a conductive layer is formed on the face at the substrate side in the conductive pressure-sensitive adhesive layer, and an electric resistance value in a two-dimensional direction on the surface of the conductive pressure-sensitive adhesive layer is 5Ω or less.
Patent TW-200721723-A (TW)
Title: System and method for providing 3-dimensional joint interleaver and circulation transmissions
Inventor: CHEN JENG-HONG
IPC: H04B7/04
Filed: 2006-10-03
Abstract: System performance in wireless communication is improved by increasing diversity in time, space and frequency. Information to be transmitted is processed by a convolution encoder to produce encoded bits. The encoded bits are interleaved and mapped to subcarriers. Symbols are created from the subcarriers and the symbols are transmitted so as to increase diversity in time, space and frequency. Circulation transmission in addition to interleaving is used to increase diversity. For example, circulation transmission can be symbol based or subcarrier based.
Patent TW-200726986-A (TW)
Title: Carrier rack and method of manufacturing same
Inventor: KANEKO SHUICHI
IPC: G01R31/26
Filed: 2006-10-25
Abstract: The invention is a carrier rack using the fluke of a fixture or screw to connect two pieces of side plates and a piece of top plate to the main shelf. By the above method to assemble the shelf with compared to weld for assembly, the carrier shelf has little slant to improve the scale accuracy. Due to using fluke of a fixture or screw to assemble with compared to welding, this method can be simplified for normal operation.
Patent TW-200733883-A (TW)
Title: Nematicidal compositions and methods
Inventor: SCHWARZ MICHAEL R
IPC: A01N43/00
Filed: 2006-11-01
Abstract: A nematicidal composition includes (a) at least one carbamate and (b) at least one neonicotinoid and/or chloronicotinyle. In one exemplary embodiment, the carbamate can be an oxime carbamate, such as thiodicarb and the neonicotinoid can be a nitroguanidine. In one specific embodiment, the nitroguanidine includes imidacloprid and/or clothianidin. An exemplary method of the invention includes applying a composition of the invention to either soil or a plant (e.g., seeds or foliarly) to combat nematode damage and/or increase crop yield.
Patent TW-200709309-A (TW)
Title: Semiconductor device and manufacturing method thereof
Inventor: KUWABARA HIDEAKI
IPC: H01L21/762
Filed: 2003-12-23
Abstract: A technique for manufacturing a low-cost, small volume, and highly integrated semiconductor device is provided. A characteristic of the present invention is that a semiconductor element formed by using a semiconductor thin film is transferred over a semiconductor element formed by using a semiconductor substrate by a transfer technique in order to manufacture a semiconductor device. Compared with the conventional manufacturing method, mass production of semiconductor devices with lower cost and higher throughput can be realized, and production cost per semiconductor device can be reduced.
Patent TW-200739170-A (TW)
Title: Image capture lens and image capture apparatus
Inventor: TAMURA MASAKI
IPC: G02B13/18
Filed: 2006-11-29
Abstract: A compact imaging lens (1) includes, in following order from the object side, a first lens (G1) made of glass which has a meniscus shape with a convex surface facing the object and has positive refractive power, an aperture stop (S), a second lens (G2) made of glass which has a meniscus shape with a convex surface facing an image side and has negative refractive power, and a third lens (G3) made of resin which has a convex surface facing the object side and has positive refractive power. The image capture (1) lens satisfies following inequalities (1) and (2): (1) f2/f < -3.5, and (2) f3/f > 3.5, where f: focal length of the entire imaging lens; f2: focal length of the second lens (G2); and f3: focal length of the third lens (G3).
Patent TW-200825855-A (TW)
Title: A method and system for converting text image into character code are provided for mobile communication device
Inventor: WANG CHIA-YU
IPC: G06V30/142
Filed: 2006-12-06
Abstract: A method and system for converting text image into character code are provided for mobile communication device. Text images captured by a mobile communication device are wirelessly transmitted to a server for converting the text images into character codes, and then the character codes are transmitted back to the mobile communication device. The method includes the steps of capturing a digital text image from a mobile communication device, transmitting the digital text image to a server through a wireless communication network, extracting text regions from the text image, identifying the text regions and converting the text in the text regions into character codes, transmitting the character codes to the mobile communication device by the server, and displaying the character codes in the mobile communication device, so as to solve an inconvenient problem of inputting large amount of character codes for mobile communication devices.
Patent TW-200825822-A (TW)
Title: Method of checking graphics of part
Inventor: YEH JIA-MING
IPC: G06F17/50
Filed: 2006-12-07
Abstract: A method of checking parts graphics of a circuit diagram is provided. A pre-established first parts graphics data is arranged on the circuit diagram. Then, a layout software reads a second parts graphics data of International Graphics Exchange Specification (IGES) file. A computer compares the second parts graphics data with the first parts graphics data of a same parts number. When the first parts graphics data does not accord with the second parts graphics data, a modify message is generated for relevant persons to make a check, thereby improving the efficiency of checking the parts graphics data.
Patent TW-200825927-A (TW)
Title: Program communication method
Inventor: LI CHEN
IPC: G06F9/54
Filed: 2006-12-07
Abstract: A program communication method, which is in order to carry on the data communication between a first program and a second program through the driver of the operating system. When the driver starts to perform the initialization, it will open a self-defining data structure in the driver, and the first program and the second program will read or write the data parameter of the self-defining data structure so as to carry on the data communication between the first program and the second program. This invention has realized the communication between different programs whether the programs lie in the same session, therefore, overcomes the defect of carrying on the communication through the sharing memory in the prior art.
Patent TW-200744173-A (TW)
Title: Semiconductor device and its manufacturing method
Inventor: MIZUSAWA AIKO
IPC: H01L23/28
Filed: 2006-12-14
Abstract: A semiconductor device includes a semiconductor substrate and low dielectric film wiring line laminated structure portions which are provided in regions on the semiconductor substrate except a peripheral portion thereof. Each of the laminated structure portions has a laminated structure of low dielectric films and a plurality of wiring lines. An insulating film is provided on an upper side of the laminated structure portion. Connection pad portions for electrodes are arranged on the insulating film to be electrically connected to the connection pad portions of uppermost wiring lines of the laminated structure portion. Bump electrodes for external connection are provided on the connection pad portions for the electrodes. A sealing film is provided on the insulating film and on the peripheral portion of the semiconductor substrate. Side surfaces of the laminated structure portions are covered with the insulating film or the sealing film.