baber/WOPTO huggingface dataset:
Patent JP-2001272918-A (JP)
Title: Display device and method for manufacturing the same as well as corona discharge device
Inventor: OSHIMA YOSHIHIRO
IPC: B32B7/02
Filed: 2000-08-17
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a display device capable of easily forming solder electrodes on a film for the display device formed with a protective film having high water repellency and the display device manufactured by this method. SOLUTION: A prescribed region 1a of the film 1 for the display device having a function film including a conductive film and constituting an antireflection film or the like and the protective film containing fluorine formed on the upper layer thereof is subjected to a corona discharge treatment 23, etc., by which the fluorine on the surface of the protective film is removed. Next, the film for the display device is stuck to the display panel surface and the electrodes are formed on the film for the display device so as to be electrically connected to the conductive film by a method of using a solder iron impressed with ultrasonic waves by low melting solder or the like. The electrodes and the conductive material fixed to grounding potential, etc., are connected to each other by a conductive tape, by which the electrodes are wired so as to be fixed to the prescribed potential.
Patent JP-2002059083-A (JP)
Title: Apparatus for segregating crushed empty can
Inventor: SATO YOICHI
IPC: B03C1/14
Filed: 2000-08-18
Abstract: PROBLEM TO BE SOLVED: To increase the added value of empty cans by recovering aluminum chips of high purity from the empty cans. SOLUTION: This apparatus for segregating crushed empty cans has a raw material chip introduction part 10 for introducing the chips CM of the crushed empty cans, magnetic selection part 12 for separating the chips CM introduced from the part 10 into magnetic chips CS and non-magnetic chips CK, and a first and a second aluminum chip selection parts 14 and 16 for selecting or segregating aluminum chips CA from the non-magnetic chips CK segregated by the part 12. The aluminum chips CA scattered at the terminal part of a belt conveyer 40 in the first aluminum chip selection part 14 fall on a segregation adjustment plate 60, bound, are brought down while bounding on the inclined surface route 66 of the second aluminum chip selection part 16, and pass through the suction port 70 of each step part 69 installed in the route 66.  In this way, the aluminum chips CA can hardly be sucked to the side of a buffer chamber 88 in each suction port 70. Most of the chips CA reach the lower end of the route 66.
Patent JP-2001119037-A (JP)
Title: Semiconductor device
Inventor: YAMAZAKI SHUNPEI
IPC: H01L29/786
Filed: 2000-08-21
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device having improved characteristics and reliability. SOLUTION: This semiconductor device is provided with an insulation substrate, a semiconductor film containing a region that is formed at the upper portion of the insulation substrate and has added P-type or N-type impurities, a gate insulation film that is formed in contact with the semiconductor film, a gate electrode where a side surface formed in contact with the gate insulation film is into a tapered shape, an interlayer insulation film formed at the upper portion of the gate electrode, and wiring that is formed on the interlayer insulation film and is connected to a region, where the P-type or N-type impurities have been added.
Patent JP-2002059715-A (JP)
Title: Pneumatic radial tire
Inventor: YAMASHITA SHOICHI
IPC: B60C13/00
Filed: 2000-08-23
Abstract: PROBLEM TO BE SOLVED: To provide a pneumatic radial tire improved in stability and controllability by increasing rigidity of a side wall part of a tire without spoiling rolling resistance and durable longevity and without complicating a manufacturing method. SOLUTION: A circumferential direction cord reinforcing layer 8 formed in specified width in the diametrical direction by spirally winding one to a plural number of inextensional fiber cords in the tire circumferential direction around a belt type body buried in covered rubber is arranged at least at one point of a region toward the outside in the diametrical direction of the bead part from the inside in the diametrical direction of an end part in the axial direction of the belt layer on the pneumatic radial tire furnished with a carcass layer, a side wall part, the belt layer, the tread part, an inner liner, a bead filler, etc.
Patent JP-2002060898-A (JP)
Title: High strength steel sheet for automotive room structural parts, and its manufacturing method
Inventor: HIWATARI SHUNJI
IPC: B60R21/02
Filed: 2000-08-23
Abstract: PROBLEM TO BE SOLVED: To provide a high strength steel sheet which is used for automotive room structural parts and hardly causes stretch-flange rupture at press working and can suppress the deformation of the room at collision and also to provide its manufacturing method. SOLUTION: The steel sheet has a composition consisting of, by weight, 0.05-0.17% C, 0.5-1.5% Si, 0.8-2.4% Mn, <=0.02% P, <=0.004% S, 0.01-0.1% Al, <=0.006% N, 0.0005-0.004% Ca and the balance Fe with inevitable impurities and has a structure containing >=30% ferrite by volume fraction, >=10% bainite by volume fraction and <6%, in total, of martensite and austenite by volume fraction. In the steel sheet: average grain size of ferrite is <=22 μm; the volume fraction of carbides of >=0.1 μm circle-equivalent radius is <=0.1%;, stretch-flange formability is >=80% by bore expanding ratio; upper yield stress at 500/s strain rate is >=1.5 times the quasi-static tensile strength; and strength is >=490 MPa.
Patent JP-2002075515-A (JP)
Title: Terminal metal and joint connector
Inventor: IBARAKI MASATO
IPC: H01R13/115
Filed: 2000-08-24
Abstract: PROBLEM TO BE SOLVED: To enhance reliability for electric connection. SOLUTION: This terminal metal 20 is provided integrally with a terminal connection part 23 having a pair of elastic contact pieces 28, and a tab part 24 projected from the elastic connection 23. The tab part 24 is inserted between the paired elastic contact pieces 28 of the terminal metal 20 positioned in an upper stage to bring the upper and lower terminal metals 20 into conductive connection. A guide groove 17 is provided in an insertion direction of the terminal metal 20 in a partitioning wall 15 for partitioning cavities 12 therebetween, and a posture of the terminal metal 20 is stabilized by the insertion of the tab part 24 into the guide groove 17 when the metal 20 is inserted into the cavity 12.
Patent JP-2002062486-A (JP)
Title: Low-temperature in-liquid observation device
Inventor: KOBAYASHI KENGO
IPC: G02B23/24
Filed: 2000-08-21
Abstract: PROBLEM TO BE SOLVED: To provide a low-temperature in-liquid observation device which is capable of retaining heat over the entire part within the device at a specified temperature. SOLUTION: The low-temperature in-liquid observation device having a camera case 30 which houses a camera unit 19 for projecting the inside of a tank stored with a cryogenic liquid on the front and houses a control circuit board 21 on the rear side, an inner case 31 covering the camera case 30 and an outer case 33 which covers this inner case 3 through a vacuum thermally insulating layer 32 is arranged with sheet-like heaters 60 on the outer side of the camera case 30 by dividing the heaters to a plurality in the axial direction of the camera case 30 and winding the same. The respective heaters 60 are provided with temperature detecting means 61 by each of the heaters. The control circuit board 21 described above is provided with relays 46 for on - off control of the respective heaters 60 by the detected temp. of each temp. detecting means 61.
Patent JP-2002066338-A (JP)
Title: Carrier for purification of internal combustion engine exhaust gas, exhaust gas purification device using the same carrier, preparation process of the same carrier and manufacturing method of the same device
Inventor: ITO HIDETOSHI
IPC: F01N3/02
Filed: 2000-08-25
Abstract: PROBLEM TO BE SOLVED: To provide a catalyst layer formation process by which catalyst layers for removing gaseous pollutant component can uniformly be formed on a carrier having a DPF(diesel particulate filter) structure, and the amount of a catalyst component of each of the catalyst layers can easily be controlled. SOLUTION: The preparation process of this carrier provided with catalyst layers involves allowing a slurry obtained by mixing a catalyst component with a fluid medium such as liquid, to flow into a carriers 1' provided with no catalyst layer, from the side on which each of the catalyst layers is to be placed, i.e., the inlet side or outlet side of the carrier 1', wherein the method for allowing the slurry to flow into the carrier 1' comprises allowing the surface of one end of the carrier 1' to face the slurry and in that state, sucking the slurry from the other end side, or forcedly introducing the slurry into the carrier 1' by compressing the slurry from the supply side, or the like means, and also, the fluid medium can be made to pass through the pores of each of a plurality of carrier walls 11 of the carrier 1'.
Patent JP-2002077112-A (JP)
Title: Wireless communication system and method
Inventor: ATSUIZUMI TAKAHIRO
IPC: H04W88/02
Filed: 2000-08-28
Abstract: PROBLEM TO BE SOLVED: To enable data to be communicated through a proper format corresponding to the condition of the communication channels when data are communicated on wireless communication channels. SOLUTION: A wireless communication system is equipped with a data server 13, wireless portable terminals 18, and a public network 15 which connects the data server 13 and the wireless portable terminals together, including a wireless communication network related to the wireless portable terminals 18. When data such as an image which is recorded by a printer 19 connected to a wireless communication terminal are down-loaded from the data server 13, the communication condition of the wireless portable terminal 18 with a wireless communication network is judged through the portable terminal 18, the format of data which are down-loaded is selected out of a plurality of formats and set, corresponding to the judgment result, and the data server 13 is informed as to the set format of the data.  The data are converted in accordance with the set format by the data server 13, and the converted data are sent to the wireless portable terminal.
Patent JP-2002075934-A (JP)
Title: Pad for polishing, and apparatus and method for polishing
Inventor: SHIMAGAKI MASAAKI
IPC: B24B37/20
Filed: 2000-08-29
Abstract: PROBLEM TO BE SOLVED: To reduce adhesive property of dust and scratch on a surface of an object which is polished, manage planarization, and remove defects such as micro concavity and convexity of semiconductor wafer itself before processing the concavity and convexity with a simple polishing method. SOLUTION: Mixing natural fiber and/or its modified fiber with matrix resin causes no dust adhesion nor scratch trading off each other up to now, can greatly harden the polishing pad itself and dramatically increase the bending degree of elasticity comparing to the pad made by prior technology to realize very good planarization characteristic. Further mixing natural fiber and/or its modified fiber improves wetted surface of the polishing pad and reduce adhesive property of dust and scratch on the surface of the object which is polished.
Patent JP-2002076443-A (JP)
Title: Reflection cup for led chip
Inventor: TANDA YUICHIRO
IPC: H01L33/60
Filed: 2000-08-29
Abstract: PROBLEM TO BE SOLVED: To solve the problem of a reflection cup releasing from a sealing resin due to weak adhesion of the cup with an Ag paste and the resin. SOLUTION: An LED chip 2 is mounted on an electrode pad 4 of an upper surface of a circuit board 1 having an insulating, and fixed by the Ag paste 5 so that a circumference of the chip 2 is surrounded by a reflection surface 3a of a thermoplastic resin reflection cup 3A. The upper surface is resin-sealed by the sealing resin having light transmission properties so as to cover the upper surface with a semispherical lens 7a. The shape of the surface 3a of the cup 3A is a substantially inverted conical shape of a substantially curved shape, and constituted so that the emitting light of the chip 2 is reflected on the surface 3a, condensed upward and condensed to the lens 7a. A thin reflection film is formed on the reflection surface to improve reflection efficiency. The resin cup has strong adhesion to the paste and the resin, does not release but has excellent reliability.  Its productivity is excellent by plastic molding, and its cost can be reduced. Its electrical short-circuiting, is improved.
Patent JP-2002075937-A (JP)
Title: Method for processing semiconductor wafer
Inventor: YAMAMOTO MASAYUKI
IPC: B24B37/30
Filed: 2000-08-30
Abstract: PROBLEM TO BE SOLVED: To provide a method for thinning a semiconductor wafer whereby the occurrence of damage and warpage can be suppressed in a step of thinning a semiconductor wafer using a protective tape, and conveyance to a subsequent step is possible. SOLUTION: The method for processing the semiconductor wafer is characterized by including the step of bonding a support wafer with a double-faced adhesive sheet on the surface of the semiconductor wafer having a pattern formed thereon, and the step of thinning the back of the semiconductor wafer while the support wafer is fixed.
Patent JP-2002067019-A (JP)
Title: Mold release film for manufacture of ceramic sheet
Inventor: HOSHIO ATSUSHI
IPC: B32B27/36
Filed: 2000-08-30
Abstract: PROBLEM TO BE SOLVED: To provide a mold release film for manufacturing a ceramic sheet wherein the release property of the ceramic sheet, and the adhesion durability between a mold release layer and a base material film are excellent, and in addition, static electrification at release is small, especially in the manufacture of the ceramic sheet having a thin layer. SOLUTION: The mold release layer, of which the major component is a hardening type silicone resin, is provided on at least one surface of a polyester film, and an antistatic layer is provided on the other surface for the polyester film. In such a mold release film for manufacturing the ceramic sheet, the absolute value of a dynamic hardness difference between the surface of a ceramic sheet layer and that of the mold release layer is 20 gf/μm2 or lower when the ceramic sheet layer is laminated on the surface of the mold release layer. Also, the rub-off value of the mold release layer is 10 or lower.
Patent JP-2002074282-A (JP)
Title: Multi-card reader
Inventor: HAYATO MANABU
IPC: B42D15/10
Filed: 2000-08-31
Abstract: PROBLEM TO BE SOLVED: To provide a compact multi-card reader capable of reading a magnetic card and an IC card. SOLUTION: A card reader casing 11 is provided with a magnetic card insertion slot 11a extended in a preliminarily decided direction and an IC card insertion slot 11b extended in a preliminarily decided direction and formed in parallel with the magnetic card insertion slot. A magnetic head part 32 goes through the IC card insertion slot in a direction vertical to the preliminarily decided direction so as to face the magnetic card insertion slot. The magnetic head part is energized upward in a vertical direction by spring members 41 and 42 so that the IC card insertion slot can be prevented from being opened. When button parts 51 and 52 arranged at a card reader casing are depressed, the magnetic head part is moved downward in the vertical direction against the energizing force of the spring members so that the IC card insertion slot can be opened.
Patent JP-2002081622-A (JP)
Title: Thermal decomposition furnace
Inventor: WATABE RYOJI
IPC: F23G7/04
Filed: 2000-08-31
Abstract: PROBLEM TO BE SOLVED: To obtain a thermal decomposition furnace in which waste liquids such as oils and waste oils are continuously combustion-treated in a primary combustion furnace, and the generated toxic exhaust gas is positively thermally decomposed in a secondary combustion furnace. SOLUTION: A primary combustion furnace 2 for incineration treatment of waste liquid is inclined to form a slope for running the liquid. The waste liquid is burned, while the liquid supplied in the furnace 2 is running in the furnace 2. Unburned waste liquid flows out of a waste-liquid discharge port 14, and circulates to a storage tank 12 through a waste-liquid tank 15. Exhaust gas generated by the combustion is thermally decomposed in the secondary combustion furnace 3. The furnace 3 is formed zigzag to set an exhaust-gas residence time long in the furnace 3. Thus, the exhaust gas is positively thermally decomposed to discharge only the non-smoking detoxicated clean air.
Patent JP-2002075666-A (JP)
Title: Lighting fixtures
Inventor: NISHIURA KOJI
IPC: H05B41/40
Filed: 2000-08-31
Abstract: PROBLEM TO BE SOLVED: To provide a lighting equipment which can change a set point of a light output at the time of a lighting of an all light and a lighting of a stepping dimmer, according to a user's liking and a using environment. SOLUTION: The lighting fixture is constituted of a fixture block A and a wireless transmitter B. The fixture block A is equipped with a fluorescent lamp 1, a lighting circuit section 3 which carries out high-frequency lighting of the fluorescent lamp 1, the memory 8 which memorizes the set point of the light output of the fluorescent lamp 1 at the time of the lighting of the stepping dimmer, and a control circuit section 5 which controls an optical output of a fluorescent lamp 1 to the set point stored in a memory 8, by changing and the output of the lighting circuit section 3. Since the control circuit section 5 is rewrites the set point of the light output stored in the memory 8 according to an operation signal transmitted by the wireless signal from the wireless transmitter B, the light output at the time of the lighting of the stepping dimmer can be set to a desired light output.
Patent JP-2002067137-A (JP)
Title: Vacuum forming apparatus
Inventor: MIURA TAKAYUKI
IPC: B29C51/16
Filed: 2000-09-04
Abstract: PROBLEM TO BE SOLVED: To provide a vacuum forming apparatus constituted so as to more easily perform the adjustment for returning the deformation of an object to be molded to the original shape. SOLUTION: In the vacuum forming apparatus for performing the vacuum forming of an object 1 to be molded between at least two molds 2 and 3, the deformation of the object 1 to be molded is corrected by the difference pressure between the molds 2 and 3 so that a constant volume of preset air corresponding to the deformation quantity of the object 1 to be molded softened under heating is drawn in the molds 2 and 3.
Patent JP-2002093141-A (JP)
Title: Portable equipment
Inventor: INUI TETSUYA
IPC: G11B33/12
Filed: 2000-09-07
Abstract: PROBLEM TO BE SOLVED: To make portable equipment for audio, etc., thinner. SOLUTION: Circuit boards 19a and 19b are made thinner at some parts (coupling substrate 20) than at other parts and components which determine the thickness of a feed motor 12, etc., are arranged so as to overlap them with the parts 20 of the boards which are made thinner. When flexible substrates are used as the coupling substrates, the thickness can be made specially less. Further, a multi-layered printed board may be used and formed in a single layer or a less number of layers at the part than at other parts.
Patent JP-2002093854-A (JP)
Title: Flip-chip bonding structure, and manufacturing method thereof
Inventor: TAKEI MASAHIKO
IPC: H05K3/34
Filed: 2000-09-11
Abstract: PROBLEM TO BE SOLVED: To provide an anisotropic conductive film type flip-chip bonding structure where of low cost, and there is no restriction on its usable semiconductor chip, and its each bump and its each electrode can be connected with high reliability and surely by a low connective resistance. SOLUTION: In the flip-chip bonding structure, on each circuit-board electrode 21 of a circuit board 2, each leveled solder bump 22b is formed to connect each solder bump 22b and each semiconductor-chip electrode 11 of a semiconductor chip 1 by an anisotropic conductive film 3. Each leveled solder bump 22b is formed to be molded with a leveling member the upper portion of each solder layer through plating, etc. This solder bump 22b is formed readily, and variations in the space between each semiconductor-chip electrode 11 and it is reduced, and its effective opposite area to each semiconductor-chip electrode 11 is enlarged, to increase the number of conductive particles 31 interposed between both.
Patent JP-2002086899-A (JP)
Title: Recording medium and method for recording
Inventor: HAGA KATSUHIKO
IPC: B41M5/50
Filed: 2000-09-14
Abstract: PROBLEM TO BE SOLVED: To provide an ink jet recording medium not having possibility of contaminating a rear surface or an end of standardsize paper even when the standard-size paper is recorded so as not to bring about an unnecessary margin from on end to another end of the standard-size paper and a method for ink jet recording. SOLUTION: The ink jet recording medium comprises a flexible sheet having same length as a length or more of the standard-size paper 21 wider to form an ink receiving part than a width of the paper 21 at right and left ends, the ink receiving parts 22 and 22' made of high ink absorption layers and provided at right and left ends of the sheet on a guide sheet 23 so that the paper 21 is releasably adhered to the sheet 23 with an adhesive.
Patent JP-2002093729-A (JP)
Title: Semiconductor wafer diffusion device and method of manufacturing semiconductor device
Inventor: SAKASHITA TAKESHI
IPC: H01L21/22
Filed: 2000-09-14
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor wafer diffusion device and a method of manufacturing a semiconductor device, with which entrainment of the atmosphere into a diffusion furnace can be prevented, when a semiconductor wafer is inserted into the furnace. SOLUTION: The semiconductor wafer diffusion device is equipped with a diffusion furnace 1, for performing diffusion treatment or oxidation treatment of a semiconductor wafer 5, gas inlet port 3 provided at an end of the diffusion furnace for introducing an inert gas into the diffusion furnace, insertion port 14 provided at the other end of the diffusion furnace for inserting a board 7 on which a plurality of semiconductor wafers are arranged and placed, a shutter 13 for opening/closing this insertion port, and wings 20 provided on this shutter and a heater 9 disposed around the diffusion furnace. The wings 20 change a part of the flows of the inert gas flowing out from the insertion port, by covering the insertion port like a curtain, when the shutter 13 is opened and the board 7 is inserted from the insertion port 14.
Patent JP-2002091916-A (JP)
Title: System for notifying illegal access
Inventor: TOYODA ISAMU
IPC: G06F21/55
Filed: 2000-09-18
Abstract: PROBLEM TO BE SOLVED: To reliably notify a manager of illegal access. SOLUTION: This illegal access notification system is provided with a detecting means 6 for detecting the illegal access when the illegal access is made to a server 1, a recognizing means 8 for recognizing server management sides 3 and 4 accessing the server 1, and a notifying means 7 for notifying the management sides 3 and 4 recognized by the means 8 of illegal access information showing that the illegal access is made, when the means 6 detects the illegal access.