baber/WOPTO huggingface dataset:
Patent JP-2007167445-A (JP)
Title: Ultrasonic probe
Inventor: AOKI MINORU
IPC: A61B8/00
Filed: 2005-12-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide an ultrasonic probe preventing easy failure of a piezoelectric vibrator and having high reliability and favorable acoustic characteristics.  <P>SOLUTION: This ultrasonic probe is provided with the piezoelectric vibrator 10 having an earth electrode 13 and a signal electrode 12 in the back, an acoustic matching layer 30 disposed in the front face side of the piezoelectric vibrator 10, a backing material 40 disposed in the back face side of the piezoelectric vibrator 10, and a flexible substrate 50 interposed between the piezoelectric vibrator 10 and the backing material 40, covering the back face whole body of the piezoelectric vibrator 10 and having an earth wiring layer 512 and a signal wiring layer 514; and the earth wiring layer 512 and the signal wiring layer 514 are exposed from a surface facing the piezoelectric vibrator 10 of the flexible substrate 50 and electrically connected to the earth electrode 13 and the signal electrode 12 via the exposed surface 512a of the earth wiring layer 512 and the exposed surface 514a of the signal wiring layer 514.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007222697-A (JP)
Title: Decomposition/removal method for volatile organic compound
Inventor: EINAGA HISAHIRO
IPC: B01J29/16
Filed: 2005-12-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a treatment method for a volatile organic compound capable of efficiently oxidizing/decomposing the volatile organic compound in a gas by ozone at not only a high temperature also a low temperature near room temperature to be converted to carbon dioxide and carbon monoxide and suppressing production of an organic bi-product.  <P>SOLUTION: In the method for decomposing/removing the volatile organic compound in the presence of a catalyst by ozone, a hydrophobic zeolite-manganese oxide composite oxide catalyst is used as the catalyst.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006516259-A (JP)
Title: Ｗｎｔシグナル伝達の抑制によって癌を治療するための方法
IPC: A01N61/00
Filed: 2003-10-03
Abstract: 本発明は、Wntタンパク質を過剰発現する癌細胞の増殖を抑制する方法に関する。本方法は、細胞を、Wntタンパク質とFrizzled受容体との結合を抑制する作用物質と接触させることを含む。
Patent JP-2006513677-A (JP)
Title: 移動通信システムにおける下り制御チャネルの割り当て方法
IPC: H04B1/707
Filed: 2004-05-14
Abstract: 本発明は、ＣＤＭＡ（Ｃｏｄｅ  Ｄｉｖｉｓｉｏｎ  Ｍｕｌｔｉｐｌｅ  Ａｃｃｅｓｓ）移動通信システムにおける下り制御チャネルの構造及びその運用方法に関する。特に、物理的共有チャネルを制御チャネルに使用する場合に適した下り制御チャネル構造及びこれを利用した時間−符号分割方法を提案する。このために、本発明は、物理的共有チャネルをシグナリング情報を伝送するための制御チャネルとして使用するシステムにおいて、単位チャネルを利用して１つの共有チャネルが時間単位の直交コードとシンボル単位の直交コードにより分割される下り制御チャネル構造を提供する。
Patent JP-2007184327-A (JP)
Title: Semiconductor device and method of fabricating same
Inventor: HOSHINO TAKASHI
IPC: H01L29/12
Filed: 2006-01-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide an easy-to-fabricate semiconductor device in which low loss can be achieved while ensuring high breakdown voltage, and to provide a method of fabricating the semiconductor device.  <P>SOLUTION: An SBD 10 as a semiconductor device includes: a substrate 11 composed of semiconductor; an n-type layer 12 formed on the substrate 11; an anode electrode 14 arranged on the n-type layer 12; and a p-type region 13 connected with the anode electrode 14 and projecting to the n-type layer 12. In the boundary region to the n-type layer 12, the p-type region 13 includes a low impurity region 13A having a conductivity type closer to p-type than a high impurity region 13B in the p-type region 13 adjacent to the boundary region.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007184414-A (JP)
Title: Semiconductor device, substrate for mounting the same, and electronic equipment
Inventor: NANO MASANORI
IPC: H01L23/12
Filed: 2006-01-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a substrate for mounting a semiconductor device capable of preventing generation of disconnection such as a wire lead and wiring without causing the exfoliation of IC chips, even if it is subject to thermal shock such as thermal cycling, and to provide the semiconductor device and an electronic equipment using it.  <P>SOLUTION: The substrate 10 for mounting the semiconductor device is the substrate for mounting IC chips and is provided with a substrate chassis 11. The substrate chassis 11 has a mounting surface 11a, and a die pattern 12 is formed in the central part of the mounting surface 11a. Outside the die pattern 12, through-conductors 14 and 14 are respectively penetrated and formed in the substrate thickness direction. A first terminal 13 and a second terminal 15 are connected to each through-conductor 14, and each first terminal 13 is extended to the periphery of the mounting surface 11a and is electrically connected with the IC chips. Each second terminal 15 is formed in the surface opposite to the mounting surface 11a.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006244686-A (JP)
Title: Optical information recording medium
Inventor: UMEZAWA TOMOKAZU
IPC: G11B7/24
Filed: 2006-01-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide an optical information recording medium having a plurality of recording layers and exhibiting satisfactory recording characteristics.  <P>SOLUTION: The optical information recording medium comprising a pair of facing substrates and at least two layers of recording layers formed between the pair of substrates is characterized in that a dye protection layer is formed adjacently to a laser-beam-incident side of at least one recording layer of the recording layers and the refractive index (n<SB>1</SB>) of the at least one recording layer and the refractive index (n<SB>2</SB>) of the dye protection layer adjacent to the recording layer satisfy following expression (1). Expression (1): n<SB>1</SB>-0.8<n<SB>2</SB><n<SB>1</SB>+0.5.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2007187499-A (JP)
Title: Length measuring instrument
Inventor: TAKAHASHI AKIRA
IPC: G01B9/02
Filed: 2006-01-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide a length measuring instrument enabling reduction in errors in a measured length value due to a change in a refractive index of air.  <P>SOLUTION: This length measuring instrument is equipped with a laser interference length measuring instrument for separating laser light 12 outputted from a laser light source 9 into reference light B and length measurement light A to measure the length of an object under inspection by using interference between the reference light B and the measurement light A. An etalon 10 is disposed in the vicinity of an optical path of the reference light B, with the etalon 10 entered by laser light C and having the same optical path length as that of the optical path of the reference light B. A change in the optical path length L2 of the reference light B is corrected by an optical path length L3 of the etalon 10.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007189390-A (JP)
Title: Surface acoustic wave filter device, and branching filter
Inventor: TANIGUCHI NORIO
IPC: H03H9/64
Filed: 2006-01-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide a surface acoustic wave filter device which has superior electric power resistance and can be made more compact.  <P>SOLUTION: A transversely coupled resonator type surface acoustic wave filter device 1 is constituted by the facts that connecting one-end sides of N (N: an integer not less than 2) first transversely coupled resonator type SAW filters 6 and 7 are connected to an unbalanced signal terminal 3 in parallel, M (M: an integer not less than 1) second transversely coupled resonator type SAW filters 8 are cascaded to the first transversely coupled resonator type SAW filters 6 and 7, and a second transversely coupled resonator type SAW filter 8 is connected to first and second balanced signal terminals 4 and 5, where N>M.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007189474-A (JP)
Title: Semiconductor device
Inventor: IDE HIROSHI
IPC: H01L21/822
Filed: 2006-01-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can be supplied with an analog input signal higher than an operating source voltage.  <P>SOLUTION: A static protective circuit corresponding to the analog input signal generated with a first source voltage is provided at an external terminal to which the analog input signal is supplied. A voltage dividing resistance divides the analog input signal passed through the static protective circuit into a voltage corresponding to a second source voltage lower than the first source voltage. The semiconductor device is provided with a first unidirectional element which supplies a current from an input terminal of an input circuit to the second source voltage and a second unidirectional element which supplies a current from a ground potential of the circuit to the input terminal of the first input circuit.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007186074-A (JP)
Title: Saddle clamp
Inventor: MARUI SHINJI
IPC: B62J1/08
Filed: 2006-01-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a saddle clamp 4 to be placed on a clamp placing surface 11 on the crest part of a pedestal 10 at the top of a seat post in such a condition as pinching a saddle rail 5 and to be fastened by a bolt 40 to the surface 11 in the placed condition as described, capable of precluding the occurrence of an erroneously set condition in which the upper 2 and lower clamps 3 are dislocated along the saddle rail 5 from the proper positions.  <P>SOLUTION: The arrangement includes the lower clamp 3 placed on the clamp placing surface 11 and the upper clamp 2 laid over the lower 3 in such a fashion as pinching the saddle rail 5 from above and below, in which the mating parts of the upper 2 and lower clamps 3 are furnished with an engaging part and a part to be engaged to establish mutual engagement when the clamps 2 and 3 are laid one over the other in such a fashion as pinching the saddle rail 5, and in the condition that the engaging part and the part to be engaged are engaged with each other, the clamps 2 and 3 are hindered from making relative movement in the longitudinal direction of the saddle rail 5 from their proper positions.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007189152-A (JP)
Title: Characteristic impedance adjusting method of dielectric multilayer substrate structure and wiring pattern
Inventor: IRIE ISAO
IPC: H05K3/46
Filed: 2006-01-16
Abstract: <P>PROBLEM TO BE SOLVED: To enable to specify a high characteristic impedance even when it undergoes the restriction of a layer constitution of a substrate and a board thickness.  <P>SOLUTION: A GND layer 14 nearest a forming layer of a wiring pattern 16 is cut off along with the formation route lower portion of the wiring pattern B (a cut-off portion extends the layer of a prepreg 15), a signal layer 12 left one more away is cut off along with the formation route lower portion of the wiring pattern 16, and a GND layer 17 is formed in this portion. Since the signal layer 12 and the GND layer 17 are used as an identical layer, they are divided by extension of the prepregs 11. This structure realizes the pattern with high impedance, strength, and rating.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007193098-A (JP)
Title: Content reproducing system and method, mobile information terminal, and network server
Inventor: SAKITANI JUN
IPC: G10K15/02
Filed: 2006-01-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a content reproducing system in which, even when a user is not conscious of whether a desired content is stored in a mobile terminal or whether it is downloaded via network, the content can be reproduced.  <P>SOLUTION: A music list creating means 123 creates the list of a content data stored in a user data storing section 131. The user selects an arbitrary content from the list stored in the music list storing section 111 by a selecting means 114. A storing place determination means 115 determines whether the selected content is stored in the music data storing section 112. When it is determined that it is not stored in the music data storing section 112, the music reproducing means 113 acquires content data of the content selected from the user data storing section 131 via a network server 120 and reproduces the content data.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006224665-A (JP)
Title: Printer
Inventor: WAKAI YOICHI
IPC: B41J29/38
Filed: 2006-01-20
Abstract: <P>PROBLEM TO BE SOLVED: To make it easy to control a recording medium of backup leading in a printer enabling a backup of image data recorded in a memory card and the like.  <P>SOLUTION: The printer 100 performs the backup of image data from the memory card 300 to an external storage 200 if the memory card 300 in which image data has been stored is inserted into a memory card slot 150 while media 400 capable of performing a writing in the external storage 200. After the backup is finished, an index sheet 500 on which the backed-up image has been arranged in the shape of index is printed.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2007196775-A (JP)
Title: Gas generator
Inventor: YAMAZAKI MASAYUKI
IPC: B60R21/26
Filed: 2006-01-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a gas generator allowing easy adjustment of its operating performance and assuring a less dispersion in the performance.  <P>SOLUTION: A gas generating agent molding 7 to make combustion for generating the gas and an igniting means (sheet-form heat emitting body 36) to ignite and burn the gas generating agent molding 7 are installed inside a housing 3 having a gas exhaust hole 11. The gas generating agent molding 7 has a combustion starting end face 40, taking such a condition that the end face 40 and the heat emitting body 36 as igniting means are contacting.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007197238-A (JP)
Title: Apparatus for storing/supplying hydrogen
Inventor: NIKAIDO MINORU
IPC: H01M8/06
Filed: 2006-01-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide an apparatus for storing/supplying hydrogen stably keeping the temperature of a catalyst.  <P>SOLUTION: The apparatus 1 for storing/supplying hydrogen is equipped with a preheater 3 for introducing and gasifying a liquid or solid organic compound S, which releases or absorbs hydrogen H<SB>2</SB>in the presence of a catalyst C, alone or along with hydrogen H<SB>2</SB>, a reactor 5 which is adjacent to the preheater 3 through a ventilation plate 6 and charged fluidizably with a granular or powdery catalyst C, a heat exchanger 10 installed in the reactor 5 with a space, a feed-in passage 11 and a feed-out passage 12 for feeding a heat medium R into and out from the heat exchanger 10, an introducing passage 7 for introducing the solid or liquid organic compound S into the preheater 3, and a discharging passage 9 for discharging a reaction product from the reactor 5. The catalyst C is kept at a temperature for activating a hydrogen release or an absorption reaction by exchanging heat with the heat medium R in stirring the catalyst C in the reactor 5 by the gas flow of the organic compound S from the preheater 3. Preferably, a waste heat recovering apparatus 40 is installed on the feed-out passage 12 of the heat medium R.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007200700-A (JP)
Title: Fuel cell and its manufacturing method
Inventor: SUGIURA SEIJI
IPC: H01M8/24
Filed: 2006-01-26
Abstract: <P>PROBLEM TO BE SOLVED: To effectively simplify a structure of a seal member fitted on a separator, secure a desired sealing property with a simple and economical structure, and also, enable to improve workability.  <P>SOLUTION: The fuel cell 10 has electrolyte membrane-electrode structures 12 and separator units alternatively laminated. The separator units 14 are equipped with first and second separators 16, 18, and also, the first and the second separators 16, 18 are jointed in one body by a seal member 62. The first and the second separators 16, 18 have cooling medium flow channels 54 formed on their mutually overlapped surface, doing without seal members to seal the cooling medium flow channels 54.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006208387-A (JP)
Title: Information technology (it) device positioning system
Inventor: LARSON THANE M
IPC: G01S13/74
Filed: 2006-01-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a system or a method for locating a device within a data center.  <P>SOLUTION: An information technology (IT) device positioning system (100) used in the data center (102) is provided with a plurality of wireless transponders (104) distributed at a plurality of locations in the data center (102), and a controller (106) coupled to the plurality of wireless transponders (104). The controller (106) is adapted so as to use trigonometric survey and operate the transponders (104), to identify and detect the positions in three-dimensional coordinates with respect to information technology devices (108) having wireless tags and disposed in the data center (102).  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2007203303-A (JP)
Title: Shape control method in cold rolling
Inventor: AIZAWA ATSUSHI
IPC: B21B37/00
Filed: 2006-01-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a shape control method capable of manufacturing a rolled material having excellent shape accuracy by calculating an adequate work roll crown amount corresponding to an extensive rolling condition, and imparting the amount in a work roll to supplement insufficiency of the capacity of a shape control means.  <P>SOLUTION: An expression model for expressing the difference in the elongation percentage to a center of the plate width is prepared in advance for a plurality of parts with different distances from a plate end with the rolling load, the control amount of a shape control means, the material crown amount, the pre-rolling shape and the work roll crown amount as variables. The maximum values and the minimum value in a predicted range of the rolling load, the material crown amount and the pre-rolling shape, and the maximum value and the minimum value in a specification range of the shape control means are substituted in the expression model for each table section of the plate thickness, the plate width, and the material. The adequate work roll crown amount is calculated so as to obtain the target difference in the elongation percentage in the specification range of the shape control means in the predicted range of the rolling load, the material crown amount, and the pre-rolling shape, and given to the work roll.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007207906-A (JP)
Title: Semiconductor integrated circuit and method for manufacturing the same
Inventor: CHIGIRA TAKASHI
IPC: H01L21/822
Filed: 2006-01-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit in which in a multi-chip mounting for forming an SiP, semiconductor chips can be connected to one another at a low cost and by a method having favorable production efficiency without degrading performance, and to provide a method for manufacturing the semiconductor integrated circuit.  <P>SOLUTION: A recess 13 for forming a side face pad is formed on a dicing line 11. Thereafter, an anti-diffusion layer 14 is formed without affecting an element characteristic of the semiconductor integrated circuit. The recess 13 is embedded with a conductor material 15. Upon separation as a chip in a dicing process, a pad is formed on the side face of the chip. The semiconductor integrated circuit chips thus formed are adjacent to one another and the conductor material 15 of the side face pad is heated and dissolved for jointing.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007208117-A (JP)
Title: Manufacturing method of semiconductor device, method and apparatus for chemical mechanical polishing
Inventor: YOSHIDA HIDEAKI
IPC: B24B37/013
Filed: 2006-02-03
Abstract: <P>PROBLEM TO BE SOLVED: To propose a manufacturing method of a semiconductor device having small variations in the height of a gate electrode within a substrate surface, and to propose a chemical mechanical polishing method and a chemical mechanical polishing apparatus.  <P>SOLUTION: A silicide layer 8 is formed at the upper portion of a gate electrode 4 formed on an element formation region on a semiconductor substrate 1, a protective film 9 is formed so that the entire semiconductor device is covered, the protective film 9 is polished until the silicide layer 8 is exposed at the upper portion of the gate electrode 4, the entire gate electrode 4 is silicified to form a silicide gate electrode, an interlayer insulating film 10 is formed entirely including the upper portion of the silicide gate electrode, and the thickness of the interlayer insulating film 10 is adjusted and the interlayer insulating film 10 is flattened. The amount of polishing is reduced when accessing to the silicide layer on the gate electrode, thus reducing variations in the height of a finishing gate electrode in a substrate surface.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007214337-A (JP)
Title: Wire bonding method and semiconductor device
Inventor: KAWAKAMI HIROSHI
IPC: H01L21/60
Filed: 2006-02-09
Abstract: <P>PROBLEM TO BE SOLVED: To permit the formation of a bonding wire connecting a long wiring distance with a low loop height, so that the wire will not be contacted with a chip angle upon bonding it by pressure at a second bonding point, and a distance becomes short as much as possible between the chip and the second bonding point.  <P>SOLUTION: When a capillary has arrived at the highest point, the capillary is moved so that the bonding wire is provided with bending habit from a first bond point toward the second bond point, and is provided with a camber (D) whose radius of convex curvature is 0.5 mm-3.0 mm, above a part (C) having the bending habit toward the second bond point, while a part positioned above a chip angle after forming a loop is provided with a bending part (E) toward the second bond point with a bending angle of more than 15 degrees.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007213383-A (JP)
Title: Information storage medium and manufacturing method thereof
Inventor: KATAHIRA TADAO
IPC: G06K19/077
Filed: 2006-02-10
Abstract: <P>PROBLEM TO BE SOLVED: To improve the reliability of an information storage medium having a structure in which sheet-like substrates are closely fitted to both sides of a part including an IC chip and a planar antenna.  <P>SOLUTION: As the sheet-like substrates, a two-layer sheet 1a and a two-layer sheet 1b consisting of a first polymer material containing a copolymer consisting of at least either of a metal salt of metacrylic acid and a metal salt of acrylic acid and ethylene, and a second polymer material such as polyester are used. The sheets are disposed with the layer of the first polymer material toward the IC chip 2 and the antenna 3, and thermally fused. According to this, the adhesion strength of the IC chip 2 and antenna 3 to the substrates and the adhesion strength at the interface between the substrates can be improved to ensure the reliability.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007216699-A (JP)
Title: Caster turning regulation member, device therefor, and method therefor
Inventor: HOTTA MICHIHIRO
IPC: B60B33/00
Filed: 2006-02-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a caster turning regulation member with a simple configuration, a low cost and versatility, since it is separately provided from the caster.  <P>SOLUTION: The turning regulation member 40 for the caster 20 integrally forms: a locking part 41 hung to a foot (structure member) 27 of a square pipe, a round pipe or the like for mounting a turnable caster 20; a hole-shaped positioning part 43, for example, for engaging with a stepped screw (engagement member) 42 provided on the foot to position; and a plate-like regulation part 44, for example, enabling the caster to run only in a fixed direction by regulating the turning of the caster. A regulating projection part which contacts with the caster 20 and regulates the turning may be projectingly formed on the regulation part 44 in a semispherical shape, for example.  <P>COPYRIGHT: (C)2007,JPO&INPIT