baber/WOPTO huggingface dataset:
Patent JP-2013243052-A (JP)
Title: Light source module
Inventor: KATO MASAAKI
IPC: F21S2/00
Filed: 2012-05-21
Abstract: PROBLEM TO BE SOLVED: To provide a light source module using LEDs (light-emitting diodes) as a light source, which can attain more uniform light intensity.SOLUTION: A light beam with a large angle from an optical axis among the light beams from the LED devices 22 is reflected with a light-incident surface 25 of a light guide plate 24, and part of the light beams (f), (g) among the light beams are entered to phosphor dots 23. Then, phosphor particulates included in the phosphor dot 23 are to emit light by being excited by incident light beams, and the light beams (h), (i) with a small angle from the optical axis among the light beams are incident into the light guide plate 24. Thus, incident spots into the light guide plate 24 can be reduced by approximately doubling the number of light-emitting points while making use of the phosphor dots 23 as a light-emitting point, and a ripple generation zone 28 wherein ripples of incident light intensity generated at a light-incident surface 25 side of the light guide plate 24 are generated can be reduced. Consequently, a dead space generated at a light-incident surface 4 side of the light guide plate 24 can be lessened, and more uniform light intensity can be obtained.
Patent JP-2013242465-A (JP)
Title: Acoustic feature quantity calculation device and method, specific situation model database preparation device, specific element sound model database preparation device, situation estimation device, call propriety notification device and program
Inventor: IMOTO KEISUKE
IPC: G10L15/10
Filed: 2012-05-22
Abstract: PROBLEM TO BE SOLVED: To provide an acoustic feature quantity calculation technique capable of extracting broader periodicity.SOLUTION: An acoustic feature quantity calculation device 1 comprises: a frame division part 12 for dividing an input acoustic signal into frames of a predetermined time length; and a time periodicity calculation part 1310. In the time periodicity calculation part 1310, regarding M as a predetermined positive integer, p(n) as an index indicating a size of n-th sample of each frame after smoothing, pas an average value of indices indicating sizes of n-th sample of frames after smoothing, a value defined by an expression below is calculated and the calculated value is regarded as time periodicity of each frame.
Patent JP-2013243288-A (JP)
Title: Manufacturing method of semiconductor device
Inventor: TAZAWA TSUYOSHI
IPC: H01L23/31
Filed: 2012-05-22
Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which accomplishes the reduction of the number of steps and high productivity, prevents the occurrence of voids, and achieves high reliability.SOLUTION: In a manufacturing method of a semiconductor device, a semiconductor chip having a connection terminal is joined to a substrate having a connection terminal. The manufacturing method of the semiconductor device includes: a temporary fixture step of temporarily fixing the semiconductor chip onto the substrate through an adhesive for a semiconductor sealing material; and an overmolding step of resin-sealing the semiconductor chip on the substrate. In the overmolding step, the joining between the connection terminal of the semiconductor chip and the connection terminal of the substrate and hardening of the adhesive for the semiconductor sealing material are concurrently conducted.
Patent JP-2013244209-A (JP)
Title: Pachinko game machine
Inventor: KUBO KEITA
IPC: A63F7/02
Filed: 2012-05-25
Abstract: PROBLEM TO BE SOLVED: To prevent a shooting rail of a shooting device provided in an upper part of a game region from being clogged with balls.SOLUTION: After a game ball B held in a shooting position in a first state by a ball holding member 25, is shot by a shooting hammer 30, a movable shooting rail 5 is displaced to a second state by a rotation drive force of a drive motor 17, and naturally drops and discharges the game ball B on the movable shooting rail 15 toward a lower game region 4, thereby reliably preventing the movable shooting rail 15 from being clogged with the balls even if a foul ball or a return ball is generated.
Patent JP-2012213187-A (JP)
Title: Adaptive bit allocation for variable bandwidth multi-carrier communication
Inventor: MARCOS TZANNES
IPC: H04L27/26
Filed: 2012-05-28
Abstract: PROBLEM TO BE SOLVED: To improve a bit loading scheme as one technique for allocating bits among carriers of a multi-carrier signal.SOLUTION: Data is distributed among channels of an asynchronous data subscriber loop (ADSL) communications system in accordance with an adaptive algorithm which from time to time measures a signal to noise ratio of various channels and finds a margin for each channel dependent on achievement (where possible) of a given bit error rate and a desired data transmission rate. The margin distribution is achieved by augmenting a constellation signal to noise ratio to enhance computational efficiency and allow redetermination of bit allocation tables during transmission as necessary. Pairs of bit allocation tables are maintained at a transmitter and a receiver and one table of each pair at the transmitter and receiver is updated while the other pair is in use for controlling communication.
Patent JP-2013244953-A (JP)
Title: Clip for roof molding
Inventor: FUKUMURA KENICHIRO
IPC: B60R13/04
Filed: 2012-05-30
Abstract: PROBLEM TO BE SOLVED: To provide a clip for a roof molding enabling assured fixture without looseness of a molding flange.SOLUTION: A clip for a roof molding, which is to attach the roof molding to a channel formed in a roof of a vehicle by the intermediary of a molding flange formed by folding back a width-directional end part of the roof molding, includes a base part placed on a bottom of the channel, a flange engaging element erected from the base part and engaged with the molding flange, and a resilient element erected from the base part, abutting on the molding flange engaged with the flange engaging element and urging the molding flange toward engaging claws of the flange engaging element. Since the molding flange is pressed and held by the engaging claws of the flange engaging element and the resilient element, assured fixture is enabled without looseness of the molding flange.
Patent JP-2013250061-A (JP)
Title: Element analyzer
Inventor: YAMADA TAKEHIRO
IPC: G01N31/12
Filed: 2012-05-30
Abstract: PROBLEM TO BE SOLVED: To simultaneously and highly accurately analyze a plurality of elements contained in a sample by using a single sample.SOLUTION: A first extraction mode for heating a heating furnace 1 at an oxygen extraction optimum temperature Tto extract oxygen contained in a sample as a gas component and a second extraction mode for heating the heating furnace 1 at a nitrogen extraction optimum temperature Thigher than the oxygen extraction optimum temperature Tto extract nitrogen contained in the sample as a gas component are combined and executed.
Patent JP-2013249916-A (JP)
Title: Active vibration isolator
Inventor: KASHIWA MUNETAKA
IPC: F16F15/02
Filed: 2012-06-01
Abstract: PROBLEM TO BE SOLVED: To provide an active vibration isolator that exhibits maximally-high vibration insulation performance.SOLUTION: An active vibration isolator comprises: a filter 8 having high-pass filter characteristics for removing a low-frequency component containing an error component of an output signal of a load cell 5 as a power measuring part; a compensator 9 for compensating the low-frequency component removed by the filter 8 on the basis of the acceleration of a body 2 to be supported; and a controller (controller 10, an operator 11 and a gain 12) for creating a drive control signal of an actuator 4 on the basis of an output signal of the filter 8 and an output signal of the compensator 9.
Patent JP-2013251466-A (JP)
Title: Semiconductor device, method for controlling the same, and method for evaluating the same
Inventor: TAKEI MANABU
IPC: H01L29/78
Filed: 2012-06-01
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing on-voltage and improving reliability, and to provide a method for controlling a semiconductor device, and a method for evaluating the same.SOLUTION: A front surface of a semiconductor substrate is provided with a MOS structure of a trench gate type composed of a gate trench 4, a gate insulating film 5, and a gate electrode 6 and a dummy trench gate structure composed of a dummy trench 14, a dummy gate insulating film 15, and a dummy gate electrode 16. When a wafer is inspected, a DC power supply 21 is connected between an emitter pad E and a dummy gate pad DG connecting the dummy gate electrode 16 to apply voltage. This allows for evaluation of a withstand voltage of the dummy gate insulating film 15. Alternatively, the dummy gate electrode 16 and an emitter electrode 7 are connected via a diode, and the dummy gate electrode 16 and the gate electrode 6 are connected via a resistor. This allows for constant keeping of the dummy gate electrode at positive potential when IGBT is on.
Patent JP-2013254046-A (JP)
Title: Image forming apparatus
Inventor: MUKAI TAKASHI
IPC: G03G15/20
Filed: 2012-06-06
Abstract: PROBLEM TO BE SOLVED: To provide an image forming apparatus capable of preventing generation of an unfixed part due to skew of a sheet.SOLUTION: An image forming apparatus includes: conveying means 10 for conveying a sheet-like recording medium; transfer means 40 for transferring a toner image based on image information to the recording medium; and fixing means 60 for determining a fixation effective range in a direction orthogonal to the conveyance direction of the recording medium on the basis of a skew state of the recording medium, and fixing the toner image within the fixation effective range on the recording medium.
Patent JP-2013252219-A (JP)
Title: Pinball game machine
Inventor: NAKAZONO TAKESHI
IPC: A63F7/02
Filed: 2012-06-06
Abstract: PROBLEM TO BE SOLVED: To provide a pinball game machine capable of regulating fraudulent practice by a game ball with operation wire.SOLUTION: A pinball game machine 10 has a cut part 84 which is placed near a shot ball supply hole 45 in a shot ball supply device 40 and a pair of blade parts 84A, 84B are placed in an almost V-shape, and is provided with a fraudulence preventive member 80 in which operation wire W1 advances toward an end part of the cut part 84 and is cut by the pair of blade parts 84A, 84B or cut into by the pair of blade parts and captured when balls are shot by the shooting device 60 in the state that the operation wire W1 of a game ball B1 with operation wire for fraudulent practice is through the shot ball supply hole 45. The fraudulence preventive member 80 is formed by bending one sheet metal 90 at a first bending line L1, and the cut part 84 is formed by edges of a first flat panel part 93 and a second flat panel part 94 positioned on both sides of the first bending line L1 being placed in an almost V-shape as the pair of blade parts 84A, 84B.
Patent JP-2012209565-A (JP)
Title: Method of manufacturing light-emitting device, backlight, and liquid crystal display device
Inventor: ISHII TSUTOMU
IPC: H01L33/50
Filed: 2012-06-06
Abstract: PROBLEM TO BE SOLVED: To provide a light-emitting device with improved quality and characteristics, when an emission type semiconductor element and a plurality of phosphors with different luminescent colors are combined and used.SOLUTION: A light-emitting device 1 has an emission type semiconductor element such as a light emitting diode 2 as a light source. Light emitted from the light emitting diode 2 is converted to visible light in a light emitting part 8 having a plurality of phosphors 9 with different luminescent colors and discharged. The plurality of phosphors 9 satisfies at least one condition selected from the following condition 1 and condition 2. Condition 1: when the average particle diameter of one kind of the phosphor among the plurality of phosphors 9 is defined as D1 (μm), the specific gravity thereof is defined as w1 (g/mm), the average particle diameter of the other one kind of the phosphor is defined as D2 (μm), and the specific gravity thereof is defined as w2 (g/mm), the plurality of phosphors 9 satisfy the condition expressed by the formula: -0.2<{(D1)×w1}-{(D2)×w2}<0.2. Condition 2: the plurality of phosphors 9 are combined and integrated by an inorganic binder.
Patent JP-2013252480-A (JP)
Title: Characteristic determination method of object to be treated and stirring/defoaming device
Inventor: SAKATA TETSUYA
IPC: B01F29/90
Filed: 2012-06-06
Abstract: PROBLEM TO BE SOLVED: To provide a characteristic determination method of an object to be treated, which can easily perform proper operation setting, and to provide a stirring/defoaming device.SOLUTION: A stirring/defoaming device comprises: a table configured rotatably around a revolution axial line; a container which is constituted to accommodate an object to be treated, is rotatable around the rotation axial line by being set on a table, and revolves around a revolution axial line of the table; a rotating drive unit for rotating the container; a detection part 21 for detecting the number of revolutions of the container; and a determination part 22 for determining a characteristic of the object to be treated which is accommodated in the container, based on a magnitude of a time change amount of the number of revolutions which is detected by the detection part 21.
Patent JP-2013254910-A (JP)
Title: Flexible printed wiring board and manufacturing method of the same
Inventor: OKA YOSHIO
IPC: H05K3/46
Filed: 2012-06-08
Abstract: PROBLEM TO BE SOLVED: To provide a flexible printed wiring board which inhibits the increase of a contact resistance of a blind via against bending, and to provide a manufacturing method of the flexible printed wiring board.SOLUTION: A flexible printed wiring board includes: a base material 30; a first conductive pattern; a second conductive pattern; and a conductor 40 connecting the first conductive pattern with the second conductive pattern. The first conductive pattern includes a first land part 11 and the second conductive pattern includes a second land part 21 provided at the opposite side of the first land part 11 sandwiching the substrate 30 therebetween. The conductor 40 is formed by a conductive paste, fills a via hole 33 which penetrates through the first land part 11 and the base material 30 and reaches the second land part 21, and is formed so as to cover at least a part of a surface of the first land part 11. A thickness of the conductor 40 on a center axis Ca of the via hole 33 is smaller than the sum of a thickness of the base material 30 and the thickness of the first land part 11.
Patent JP-2012182842-A (JP)
Title: Reverse link initial power setting
Inventor: NELSON GEORGE RHODNII JR
IPC: H04W52/50
Filed: 2012-06-11
Abstract: PROBLEM TO BE SOLVED: To improve use efficiency of network resources at a wireless communication system.SOLUTION: A reference signal including pilot information is transmitted from a base station to one or multiple field units over a pilot channel. A message is also transmitted to the field units over a paging channel to indicate an effective radiated power level at which the reference signal is transmitted over the pilot channel. Based on a received power level of the reference signal at a field unit and the effective radiated power level of the reference signal, a forward path loss is estimated at the field unit for the forward link between the base station and field unit. Assuming the path loss in the reverse link is approximately the same as the estimated forward link path loss, the field unit can transmit a reply message in the reverse link so that the base station generally receives a message at the desired power level.
Patent JP-2012170158-A (JP)
Title: Image processing device and image forming apparatus including the same, program, and recording medium
Inventor: NAKAYAMA HIROMICHI
IPC: H04N1/387
Filed: 2012-06-12
Abstract: PROBLEM TO BE SOLVED: To provide an image processing device that maintains visibility of images even though a processing time required for displaying an image is shortened by reducing the amount of data.SOLUTION: An image processing device includes: a composition part 303 that interpolates thinned image data, merges the interpolated image data with area separation data to create composite data, and allocates color or gradation to the area separation data for every area attribute; and a control part 5 that causes a display part 4 to output the composite data. The composition part 203 allocates black or the darkest gradation when the area attribute is a character edge area, and allocates color or gradation of the image data when the area attribute is not a character edge area.
Patent JP-2013257479-A (JP)
Title: Image forming apparatus
Inventor: YAMAMOTO HIRANAGA
IPC: H04N1/00
Filed: 2012-06-14
Abstract: PROBLEM TO BE SOLVED: To provide an image forming apparatus which is capable of improving the operation rate of the apparatus while reducing waste of paper sheets.SOLUTION: An image forming apparatus 1 comprises: an operation part 43; a mode setting part 52 which, on the basis of a selection by a user via the operation part, sets either a first output mode in which image formation is performed in a state in which a plurality of paper sheets are present in a paper sheet conveyance path 32 or a second output mode in which image formation is performed in a state in which a single paper sheet is present in the paper sheet conveyance path; and an image formation part 13 which performs image formation on paper sheets on the basis of the setting by the mode setting part. The mode setting part sets the second output mode when a paper sheet of a specific type is selected or a specific paper sheet feeding part is selected.
Patent JP-2013146786-A (JP)
Title: Molding die for core for attaching heat exchanger fin, and method of manufacturing the core
Inventor: HUANG TSUNG-HSIEN
IPC: B21K1/30
Filed: 2012-06-15
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing an inexpensive core, and a molding die for a core for attaching heat exchanger fins used therefor.SOLUTION: An aluminum billet 10 cut into a prescribed length is obtained. The aluminum billet 10 is set into the molding groove 11 of a lower die 1 which is formed into a cylindrical shape, in which a plurality of teeth grooves formed in the longitudinal direction of the inner wall and arranged in the circumferential direction are formed, and which has a sealed surface at the bottom. The aluminum billet 10 is pressed with the press drift 21 of an upper die 2. The deformed aluminum billet 10 is taken out from the molding groove 11 of the lower die 1. In this way, a core for attaching heat exchanger fin having a plurality of protruded teeth on the outer wall is formed.
Patent JP-2014004496-A (JP)
Title: Production method of reactive agglomerated particle, production method of cathode active substance for lithium-ion battery, production method of lithium-ion battery, and production apparatus of reactive agglomerated particle
Inventor: DOTANI AKIRA
IPC: H01M4/525
Filed: 2012-06-21
Abstract: PROBLEM TO BE SOLVED: To provide a production method in which a metallic agglomerated particle, that is expected to have high performance as a cathode active substance and has small particle size and a narrow particle size distribution, can be mass-produced in a small-sized facility.SOLUTION: A whirling current is generated in a reaction processor 10 as a liquid current and additional liquids A, B, each of which contains an inorganic substance to be added, are injected in a reaction field in the reaction processor 10 at the center position parted from the inside surface of the reaction processor 10 to perform reaction processing. The liquid in the reaction processor is circulated and a return liquid of the circulation liquid is injected into the reaction processor to generate the whirling current.
Patent JP-2014006980-A (JP)
Title: Cordless wiring board device and method for manufacturing the same
Inventor: TOKIHISA NORIYASU
IPC: H01B13/00
Filed: 2012-06-21
Abstract: PROBLEM TO BE SOLVED: To provide a cordless wiring board device capable of forming a required number of wiring single wires in a predetermined wiring state, connecting connectors respectively to both ends of the wiring single wires, inserting the wiring single wires into a synthetic resin substrate member and forming the substrate member in accordance with the wiring state of the wiring single wires.SOLUTION: Since it is not necessary to conventionally bundle a plurality of harnesses or form the bundled harnesses in accordance with a wiring state, a specified wiring structure is easily manufactured, and as a result, working efficiency can be easily improved. Further, since the board device is a synthetic resin molded product, it can be assembled into a vehicle etc., by one-touch, and efficiency of assembling work can also be improved.
Patent JP-2014007299-A (JP)
Title: Superposing apparatus and superposing method
Inventor: KATSURAGAWA JUNICHI
IPC: H01L21/02
Filed: 2012-06-25
Abstract: PROBLEM TO BE SOLVED: To improve the accuracy of alignment between a wafer and a support plate in a superposing apparatus.SOLUTION: The superposing apparatus according to the present invention is configured such that: the center positions of a substrate and a support which are held by a center position detecting unit 3 are detected; the substrate and the support are conveyed from the center position detecting unit 3 to a superposing unit 6; and then the substrate and the support are superposed on each other in the superposing unit 6 so that the detected center positions of the substrate and the support overlap.
Patent JP-2014004552-A (JP)
Title: Method for forming multiple-layered coating film and coated product
Inventor: YOKOTA GEN
IPC: B05D1/36
Filed: 2012-06-26
Abstract: PROBLEM TO BE SOLVED: To provide a multiple-layered coating film having a superior coating film appearance and resistance to chipping.SOLUTION: This method for forming a multiple-layered coating film comprises the sequential steps of: obtaining an electrodeposition film by applying an electrodeposition paint on a steel sheet and heating and curing the paint; applying a specific aqueous first base coat paint (X), a specific aqueous second base coat paint (Y) and a clear coat paint (Z) on the electrodeposition film one by one to form a first base coat coating film, a second base coat coating film and a clear coat coating film; and heating these three coating films to simultaneously cure these three coating films. The first base coat coating film and the second base coat coating film have a specific film thickness after being cured. The multiple-layered coating film having a superior coating film appearance and resistance to chipping can be formed by the method.
Patent JP-2013016167-A (JP)
Title: Weather data selection along aircraft orbit
Inventor: ANA ISABEL DEL AMO BLANCO
IPC: G06F17/30
Filed: 2012-06-28
Abstract: PROBLEM TO BE SOLVED: To calculate reduced data provided to an FMS by processing a large amount of weather data.SOLUTION: A method (100) for selecting weather data for usage in at least one among flight management systems (FMS) of aircrafts and ground stations includes the steps of: selecting a reduced set of a weather data point (110); transmitting the reduced set to at least one among the FMSs and the ground stations (112); and taking an aircraft orbit into consideration when determining what data point should be included in the reduced set (106).