baber/WOPTO huggingface dataset:
Patent JP-H01145131-A (JP)
Title: Fixing of fittings
Inventor: SAITO MITSUO
IPC: B29K105/04
Filed: 1987-11-17
Abstract: PURPOSE:To insert and fix a fitting without producing looseness by molding the fitting to a base having a foamed resin layer in its inside through a covering member during expansion molding of the foamed resin layer. CONSTITUTION:A mounting hole 1c and others are trimmed in a instrument panel material in which a primary foamed resin layer is formed in the inner face of its skin 1a. Then, after a switch box 2 is covered with a covering member 3 made of comparatively flexible material consisting of baggy polyethylene, polypropylene or the like, it is inserted into the mounting hole 1c of the panel material, and a cap 7 to be inserted in the connector part 2b of the switch box and a flexible printed wiring board 8 are set and clamped in a mold. Then, a foaming resin solution is injected into the panel material, foamed and solidified to form a secondary foamed resin layer 1d. The expanding pressure of resin is applied all over the surface of the switch box 2 through the covering member 3 and the switch box 2 is molded in the resin layer 1d without producing looseness.
Patent JP-H05126361-A (JP)
Title: Air conditioning unit
Inventor: KITAZUMI MOTOI
IPC: F24F13/20
Filed: 1991-11-05
Abstract: PURPOSE:To provide an air conditioning unit which has the degree of freedom of the installation position with respect to an air conditioning unit, and in which maintenance/checking work of a control box part included in the air conditioning unit is made easy. CONSTITUTION:A front panel 26 removably mounted on an air conditioning unit part or a side panel 25 removably mounted on the side of the air conditioning unit part is removed, whereby maintenance and checking of a control b6x 4 mounted in the air conditioning unit part located on the side of the side panel 25 are ensured.
Patent JP-S63139526-A (JP)
Inventor: ISHINO FUMIOKI
IPC: A47L15/46
Filed: 1986-12-02
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H03150641-A (JP)
Title: Simulation system for plural microprocessor systems
Inventor: SHINDO TAKEFUMI
IPC: G06F15/16
Filed: 1989-11-08
Abstract: PURPOSE:To simulate plural MPSs microprocessor system by using the parallel execution technique to simultaneously execute plural MPSs and the exclusive access technique for areas shared among plural programs to realize data transmission and reception among MPSs at the time of simultaneous execution. CONSTITUTION:Since plural job control functions of a general computer OS can execute programs as jobs in parallel, plural MPS simulators 11 and 12 are executed as jobs to execute plural MPS simulators 11a and 12a in parallel. Since the data control function of the general computer OS can support the exclusive control access of areas shared among plural simultaneously executed programs, shared area access parts 11b2b and 12b2b are arranged in input/output models of input/output simulator 11b and 12b constituting MPS simulators 11 and 12 and declaration of shared areas and shared area access procedures are provided. Thus, data is transmitted and received between plural MPS simulators 11 and 12.
Patent JP-2001104151-A (JP)
Title: Shower curtain
Inventor: SATO SHIGEKO
IPC: A47H23/02
Filed: 1999-10-12
Abstract: PROBLEM TO BE SOLVED: To prevent mold from growing by not using a thread for a curtain fabric, lengthen a period until cleaning or the like of the curtain fabric is carried out, reduce so-called running cost and facilitate needle detection by detecting only a needle in a needle detection process. SOLUTION: The periphery of a curtain fabric 2 made of a synthetic fiber such as polyester is fused by high frequency processing or ultrasonic processing. The upper portion of the curtain fabric 2 is folded double and welded by high frequency processing. Rings 4 to suspend a shower curtain are made of a synthetic resin, since a thread is not used growth of mold is prevented and the length of time until it is cleaned can be prolonged. As the rings 4 are made of a synthetic resin, a false detection can be prevented in needle detection process.
Patent JP-H04161673-A (JP)
Title: Vibration proofing structure of bathroom unit
Inventor: HARADA EIJI
IPC: E04F15/00
Filed: 1990-10-26
Abstract: PURPOSE:To prevent rolling of a bathroom unit by installing a vibration proofing rubber on the lower surface of a floor pan forming the bottom part of the bathroom unit, and by providing a sideway slip regulating body to regulate slipping in the sideway direction of the vibration proofing body. CONSTITUTION:A support leg body 22 is provided suspensively on the lower surface of a floor pan 6 forming the bottom part of a bathroom unit, and the bathroom unit is supported on a floor board F of a building body with a specified space. Thereby, the support leg part 22 is constituted of an expansive height adjusting part 24 and a vibration proofing part 25. Furthermore, a rolling regulating body 31 is formed by way of integrally forming a bottom wall 31a formed slightly larger in diameter than the lower surface diameter of a vibration proofing rubber 30 and a peripheral wall 31b formed by way of raising it immediately upward from the peripheral edge of the bottom wall 31a. Thereafter, an installation plate 29 is installed on the lower surface of a head part 28a of an adjustment bolt 28, the vibration proofing rubber 30 is installed on the lower surface of the installation plate 29, the rolling regulating body 31 is installed on the lower part of the vibration proofing rubber 30 and a plate body 32 for adhesion is installed on the lower surface of the regulating body 31 to constitute the vibration proofing part 25.
Patent JP-H03149845-A (JP)
Title: Semiconductor device
Inventor: UCHIBORI SHINJI
IPC: H01L21/66
Filed: 1989-11-07
Abstract: PURPOSE:To enable voltage to be applied to all semiconductor devices in wafer state without using a number of probe needles simultaneously and to enable inspection of electrical characteristics of individual semiconductor device independently by connecting the power supply terminal of each semiconductor device to a common power supply wire through a fuse. CONSTITUTION:In a semiconductor device in wafer state, power supply terminals 4 and 8 of each semiconductor device are connected to common power supply wires 5 and 6 through a fuse 1. For example, a first-layer wiring VSS wire 6 and a second-layer wiring VDD wire 5 are formed on a scribe line as a common power supply wire. Then, the common VDD wire 5, the second-layer wire, and a spare VDD terminal 3 within the semiconductor device which is formed simultaneously are connected and the spare VDD terminal 3 and the VDD terminal 4 are connected to a fuse element 1 through a contact 2. On the other hand, the common VSS wire 6 of the first-layer wiring is connected to a spare VSS terminal 7 within the semiconductor device which is formed simultaneously with the second-layer wiring through a contact 9, and then the spare VSS terminal 7 and the VSS terminal 8 are connected to the fuse element 1 through the contact 2.
Patent JP-H03152814-A (JP)
Title: Sheet switch structure
Inventor: SHIBAZAKI MASAHIKO
IPC: H01H13/04
Filed: 1989-11-07
Abstract: PURPOSE:To simplify a sheet switch structure to facilitate the manufacture even if the switch number is increased and reduce its cost by making a sheet switch structure used for general electric apparatuses into a structure having a rubber switch under a sheet. CONSTITUTION:A plurality of rubber switches 3 are thrown into a frame 2, and a printed board 4 is screwed and fixed to the frame 2. The switches 3 are also fixed in the same manner, and a sheet 1 is finally stuck to the frame 2. Thus, by pushing the sheet 1, the switch 3 is pushed and inputted. The advantage of this structure is that the manufacture is easy as the switch 3 is an integrated product even if the number of the switches 3 are large, and the sheet 1 is flexible as it is formed of vinyl chloride and the like and can be fixed to the frame 2 by a double adhesive tape 5. Metals or ABS resins are used for the frame 2, and silicon rubber and the like are used for the rubber.
Patent JP-H04161827-A (JP)
Title: Detecting apparatus for load on vehicle
Inventor: KIDA MAKOTO
IPC: G01G19/10
Filed: 1990-10-26
Abstract: PURPOSE:To detect a load which acts on each wheel accurately by performing operation in consideration of the change in pressure receiving area of an air spring which is changed with the height of a vehicle based on the height of the vehicle and the inner pressure of the air spring. CONSTITUTION:A CPU 33 receives the detected signals from vehicle-height sensors 12-16 and pressure sensors 21-24 and operates the pressure receiving area of each air spring based on the map of the relation between the vehicle height and the pressure-receiving area of the air spring which are stored in a ROM 32. Then, the CPU 33 operates a load acting on each wheel based on the data of the pressure received area and the weight data expressing the weight beneath the spring of each wheel stored in the ROM 32.
Patent JP-2001109843-A (JP)
Title: Method and device for character recognition
Inventor: AOKI KATSUHIKO
IPC: G06F19/00
Filed: 1999-10-12
Abstract: PROBLEM TO BE SOLVED: To perform character recognition corresponding to a cell structure by properly recognizing the cell structure from a document format which has one item represented by more than one cell and one set of data represented by more than one cell. SOLUTION: A character recognition system performs cell extraction for extracting the minimum unit of an area encircled with ruled lines, etc., as a cell from image data obtained by reading an image out of a document, etc., specifies item rows and data rows by arraying respective cells in the row and column directions and also generates table cell structure data showing the structure of the respective cells, the relation between cells, etc., and performs a recognizing process for the cells according to the table cell structure data.
Patent JP-S63142680-A (JP)
Title: Semiconductor memory device and its manufacture
Inventor: NARAHARA MITSUMASA
IPC: H01L27/10
Filed: 1986-12-05
Abstract: PURPOSE:To realize a minute structure and the high integration both in the vertical and the horizontal directions of a semiconductor substrate by a method wherein a floating gate which is overlapped with a second gate is formed, via a device-isolation insulating film, on a side wall of a groove on the semicon ductor substrate. CONSTITUTION:A first N-type diffused layer 2 and an insulator layer 3 are formed on a P-type silicon substrate 1; grooves are made on this substrate 1; a floating gate 5, an insulator layer 7 covering said floating gate 5, a second gate 8 and the like are formed in each groove. On the P-type semiconductor substrate 1 situated at the bottom of the groove is formed a second N-type diffused layer 6 which, together with the first diffused layer 2, functions as a source or a drain for a MOS transistor of this semiconductor memory device. If one of the gates 8 is selected and one each of the first diffused layers 2 and the second diffused layers 6 is selected, only one semiconductor memory device can be selected. Accordingly, it is possible to obtain a semiconductor memory device whose integration is high and which is constructed minutely both in the vertical and the horizontal directions.
Patent JP-H08148969-A (JP)
Title: Integration circuit
Inventor: YANAGIBASHI TAKEYUKI
IPC: H03H11/04
Filed: 1994-11-24
Abstract: PURPOSE: To provide sufficient integration time without increasing circuit area. CONSTITUTION: By the change of a voltage applied to an input terminal In, the potential of the emitter of transistors 11 and 12 is changed. Thus, either one of the trarasistors 11 and 12 is turned to an ON state and the other is turned to an OFF state. At the time of the ON state, the transistors 11 and 12 respectively perform an amplification operation and perform discharging to a capacitance 2. For instance, when the transistor 12 is in the ON state, the transistor 12 makes a current for which the current made to flow to a base is amplified flow to the collector of the transistor 12. The base current of the transistor 12 is the charging current of the capacitance 2 and is 1/ (the current amplification factor of a collector current).  That is, the base current of the transistor 12 is made smaller than the charging current of the capacitance 2 at the time of directly connecting a resistor and the capacitance 2 and sufficient charging time is secured. The potential corresponding to the charging conditions of the capacitance 2 is outputted from an output terminal Out.
Patent JP-H1189732-A (JP)
Title: Device for transferring eggs
Inventor: SUZUKI HIROYUKI
IPC: A47J43/28
Filed: 1997-09-16
Abstract: PROBLEM TO BE SOLVED: To provide a device for transferring eggs to a tray for easily simultaneously transferring all eggs contained in a package in a short time. SOLUTION: A member 2 with circular holes 2-1 and semicircular holes 2-2 is inserted into a main body 1 with circular holes 1-1 for inserting eggs and a handle. A drawing metal fitting 3 is assembled on the member 2, a spring 4 is inserted in a back section of the metal fitting 3, and a lid is mounted thereon.
Patent JP-H10130409-A (JP)
Title: Production of polyolefin sheet
Inventor: NAKAMURA MASANORI
IPC: B32B27/32
Filed: 1996-10-31
Abstract: PROBLEM TO BE SOLVED: To obtain a polyolefin sheet having high strengths and high adhesion even to a highly polar resin such as an epoxy resin by orienting a sheet made from a polyolefin, coating the oriented sheet with a solution of a peroxide and a polymerizable monomer and heat-treating the coated sheet. SOLUTION: The peroxide used is e.g. di-tert-butyl peroxide, and the polymerizable monomer used is e.g. trimethylolpropane triacrylate. The coated solution is heat-treated to form a graft layer of the polymerizable monomer on the surface. The polyolefin resin is a high-density polyethylene. It is desirable that the mixing ratio of the peroxide to the polymerizable monomer is in the range of 10:90 to 90:10. It is desirable the coated sheet is heat-treated at a temperature in the range of 130-150 deg.C for 3-24hr. It may also be possible to add vinyltriethoxysilane or the like as a crosslinking accelerator.
Patent JP-H10132113-A (JP)
Title: Regulating valve
Inventor: OTANI HIDEO
IPC: F16K17/00
Filed: 1996-10-31
Abstract: PROBLEM TO BE SOLVED: To facilitate regulating work for disassembly, reassembly or the like by forming a plurality of seat rings integrally in a regulating valve with a plug which blocks a flow passage between the upstream and the downstream by bringing a plurality of seat rings disposed on the identical axial line into contact with each other. SOLUTION: When a diaphragm operating device comes into action, a gap is generated between the first plug 10 and the first seat ring 51a, and the second plug 11 and the second seat ring 51b respectively, upward and downward flowing-out direction changing chambers 8, 9 and a fluid flowing-in opening are communicated with each other to generate a flow passage. Fluid from the fluid flowing-in opening 2 in the upstream is flown out from a fluid flowing- out opening 3 in the downstream side. The first and second seat rings components 51a, 51b are jointed integrally by a cylindrical jointing part 51c to form a seat ring 51. A jointing part 51c is formed with a large-diameter hole 51d, and both upper and lower ends of the seat ring 51 are formed with male threaded parts 51e, 51f for screwing the seat ring 51.
Patent JP-H01184285-A (JP)
Title: Method for polishing aluminum or aluminum alloy
Inventor: ISA SEIDO MAHOMONDO
IPC: C23G1/12
Filed: 1988-11-18
Abstract: PURPOSE: To easily execute chemical polishing to Al or an Al alloy at a low cost by cleaning Al or an Al alloy, thereafter immersing it into an aq. soln. contg. phosphoric acid, nitric acid and sodium sulfate and next executing washing by deionized water.  
     CONSTITUTION: The material to be polished composed of Al or an Al alloy is cleaned by alkalescent soln. of a halogenated organic compound or the like and is purified. Next, the material to be polished is washed at a room temp. and is thereafter immersed into an aq. soln. This aq. soln. contains about 588 to 940ml/l phosphoric acid, about 73 to 118ml/l nitric acid and about 88 to 142g/l sodium sulfate. Furthermore, the immersion is executed preferably at about 80 to 90°C for about 1 to 2min. After that, the material to be polished is taken out from the aq. soln. of a polishing bath and is rinsed for about 1 to 2min by deionized water heated at about 49 to 54°C. In this way, the Al or Al alloy having a smooth plane can be obtd. 
     COPYRIGHT: (C)1989,JPO
Patent JP-H10202761-A (JP)
Title: Toric surface cast
Inventor: GUPTA AMITAVA
IPC: B29D11/00
Filed: 1997-10-08
Abstract: PROBLEM TO BE SOLVED: To minimize the necessary number of molds by a method wherein a toric layer is attached to the concave spherically curved surface of an optical preform having range spherical degrees and additional degrees for myopia. SOLUTION: An optical preform 10 has a required concave spherical curve 20. A toric layer 30 is cast in the concave spherical curve 20, which is designed in advance, on the optical preform 10. Further, the optical preform 10 has a convex spherical curve 40, which is designed in advance, on the front convex surface 50. The optical preform 10 has a large number of predetermined front fundamental curves 40, which realize all the necessary spherical degrees by being combined one or five back concave spherical curves 20. Furthermore, the front convex surface 40 of the optical preform 10 changes, for example, 48 times from +5.50D to -6.00D so as to realize 48 different range spherical degrees.
Patent JP-H10132677-A (JP)
Title: Pressure sensor
Inventor: INOUE TOMOHIRO
IPC: G01L9/00
Filed: 1996-10-31
Abstract: PROBLEM TO BE SOLVED: To obtain a pressure sensor in which a pressure sensor chip is not detached from an electrical connecting means even if it is subjected to vibration while decreasing the number of components, by providing the pressure sensor chip with bump parts to provide the electrical connecting means. SOLUTION: The pressure sensor detects pressure variation from the flexure of a diaphragm 1b based on the difference between a pressure and the atmospheric pressure being introduced, respectively, through a pressure introduction hole 2a and an atmosphere introduction port 5a to the opposite sides of the diaphragm 1b. A pressure sensor chip 1 is provided, on the opposite sides of the diaphragm 1b, with bump parts 1c formed through bump bonding of a metallic material, e.g. solder, thus providing means 10 for connecting the pressure sensor chip 1 electrically with the outside. Since the electrical connecting means 10 comprises the bump parts 1c and requires no terminal plate, the number of components can be decreased. Since the bump bonding is strong mechanically, it is not removed from the pressure sensor chip 1 when it is subjected to vibration.
Patent JP-H09185849-A (JP)
Title: Optical disk, master disk for optical disk and production of master disk for optical disk
Inventor: TAKEMOTO HIROYUKI
IPC: G11B7/004
Filed: 1996-10-31
Abstract: PROBLEM TO BE SOLVED: To ease the control of asymmetry of every pit and to stabilize a reproduced signal level by specifying the difference in laser beams per unit area in the recessed parts respectively corresponding to the shortest pit and long pits in the formation of the recessed parts of a resist layer to a specific value. SOLUTION: The resist layer 2 is deposited and formed on a glass substrate 1. The recessed parts 3 for grooves and the recessed parts 5 for pits are formed by exposure of the laser beam 4 on the resist layer 2. The formation of the recessed parts for the pits in the resist layer 2 is executed by varying the exposure of the laser beam per unit area in the recessed parts corresponding to the shortest pit (2T) and the recessed parts corresponding to the long pits (5T to 8T). The difference in the exposure is specified to approximately 5%.
Patent JP-H01136857-A (JP)
Title: Preventing device for load falling of lorry
Inventor: TSUKAMOTO KATSUAKI
IPC: B60T8/66
Filed: 1987-11-19
Abstract: PURPOSE:To enable traveling without causing load falling even when a road surface condition is varied by comparing the optimum vehicle speed obtained from the road surface condition, the type of load, and a heaping ratio, etc., with the present vehicle speed and reducing the present vehicle speed to the optimum vehicle speed when the present vehicle speed is higher. CONSTITUTION:When a vehicle with a fully loaded load-carrying platform comes to a rugged ground, a microwave transmitter/receiver 2 installed in the front thereof detects the road surface condition and sends data to a comparing circuit 5. The comparing circuit 5 ranks the sent-in data and a road-surface condition which is previously set inside and outputs the result to a judging circuit 8. Thereupon, the judging circuit compares a traveling vehicle speed reference value with a reference value data read in a reference value memory circuit 10 and a vehicle speed data from a vehicle speed detector 9, based on the data from the comparing circuit and a data from a load classifying condition setter 11. When the present vehicle speed is higher than the reference value, a control signal is outputted sending oil pressure to a brake cylinder to reduce the vehicle speed to the reference value while, at the same time, outputting an alarm signal to notify a driver.
Patent JP-H09134158-A (JP)
Title: Character processing method and processor
Inventor: YOSHIDA TOSHIKUNI
IPC: G09G5/24
Filed: 1995-11-09
Abstract: PROBLEM TO BE SOLVED: To output a character having a good balance by determining the outline of the character based on points where respective parts are arranged. SOLUTION: The scaling ratio of the frame of a stroke in which two coordinate values are made both ends is calculated (ST4). Original points of middle parts arrangements are subjected to a scaling processing by using the calculated stroke scaling ratio (ST5). Next, a coordinate string constituting the outline of the character is read out from a font storage memory and an outline point assigend with hint information is subjected to the scaling processing by using the stroke scaling ratio and moreover is subjected to a rounding processing in accordance with the hint information assigned to the outline point (ST6). Then, the outline point assigned with another hint information is similarly subjected to the scaling processing and the hint processing (ST7).  The intrinsic scaling ratio of the hint section of the outline in which outline points assigned with these two information is calculated (ST8). Thereafter, remaining outline points between these two points are subjected to the scaling processings in a scaling calculating part (ST9).
Patent JP-H08151230-A (JP)
Title: Bonding glass composition for electronic part
Inventor: KASHIWA YASUSUKE
IPC: C03C8/04
Filed: 1994-11-25
Abstract: PURPOSE: To provide a bonding glass composition for electronic part, having high glass transition point, low working temperature and low abnormal expansion coefficient and utilizable also for the bonding of electronic part required to have especially high accuracy. CONSTITUTION: This bonding glass composition for electronic part contains (A) silicon dioxide (SiO2 ), (B) barium oxide (BaO) and/or strontium oxide (SrO), (C) boron oxide (B2 O3 ) and (D) zinc oxide (ZnO) and/or cadmium oxide (CdO). The sum of the contents of barium oxide (BaO) and strontium oxide (SrO) is 20-60wt.%, the content of boron oxide (B2 O3 ) is 15-35wt.% and the sum of zinc oxide (ZnO) and cadmium oxide (CdO) is 15-35wt.%.