baber/WOPTO huggingface dataset:
Patent JP-2000128512-A (JP)
Title: Production of tetrafluorohydrazine
Inventor: TAKAGI TOSHIYUKI
IPC: C01B21/083
Filed: 1998-10-16
Abstract: PROBLEM TO BE SOLVED: To synthesize tetrafluorohydrazine in a good yield without being accompanied by any toxicity and any environmental pollution by subjecting trifluoronitrogen to thermal reaction in the presence of an iron catalyst in contact with the trifluoronitrogen, in the production process. SOLUTION: This production process can be performed either by batch or flow method and comprises filling a closed reaction vessel having a stop valve, with an iron catalyst and trifluoronitrogen and then heating them, wherein: as the iron catalyst, an easily handleable iron catalyst is added in a ratio of normally >=0.15 mol or desirably 0.15-1.5 mol of the catalyst per mol of trifluoronitrogen, and used in the form of powder, fine pieces, metal gauze, or the like, without any special limitation; and as the reaction conditions, the reaction temperature is normally 50-500 deg.C, or desirably 200-400 deg.C and the reaction time or contact time, although it depends on the reaction temperature, is normally several seconds to one hundred hours, or desirably 0.01-10 hr.  Further, in this reaction, optionally, an solvent unreactive to the iron catalyst and trifluoronitrogen can be used, however, the reaction proceeds even in the absence of such a solvent. Thus, by appropriately selecting the reaction conditions, the objective tetrafluorohydrazine can be produced in >=80% good yield.
Patent JP-S63142216-A (JP)
Inventor: HANNAPPEL JOACHIM
IPC: G01R1/44
Filed: 1987-11-25
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H10142447-A (JP)
Title: Optical ferrule and optical connector
Inventor: ASANO KENICHIRO
IPC: G02B6/36
Filed: 1996-11-07
Abstract: PROBLEM TO BE SOLVED: To provide an optical ferrule which is capable of ensuring the sufficient grating length in order to realize the width of a required cutoff wavelength and is capable of surely obtaining an objective optical characteristic by a grating part of an internally fixed optical fiber. SOLUTION: The optical ferrule 20 is provided with a body 21, through which a microhole 27 internally fixing the grating part 28 formed at the end tip of the optical fiber 25 is passed, and a ferrule hold 22 fixed to one end part in the extending direction of the microhole 27 of the body 21. An extending part 23, which extends along the extending projecting part 24 protruding toward the outside of the body 21 along the extending direction of the microhole 27 from the ferrule hold 22, is projectingly provided on the body 21 in the dimensional range where the extending part 23 is not protruded from the extended projecting part 24 and the microhole 27 is extended and passed through the extending part 23, and the grating length is extended.
Patent JP-S62153814-A (JP)
Title: Optical switch
Inventor: IMAMURA KEIICHI
IPC: G02B26/08
Filed: 1985-12-26
Abstract: PURPOSE:To output light, which is supplied to one of 4 ports, from three other ports selectively by providing coaxially the first and second switch members, where five ports are arranged at equal intervals on a circle, freely relatively rotatably and connecting specific ports with optical fibers. CONSTITUTION:The first switch member A where the first-fifth ports to which optical fibers are connected are arranged in order at equal intervals on a circle and the second switch member B provided with the sixth-tenth ports facing the first-fifth ports respectively are coaxially provided freely relatively rotatably. The sixth-eighth ports and tenth ports are connected by an optical fiber respectively, and the optical fiber connected to the fourth port is introduced to the ninth port.
Patent JP-H09139454-A (JP)
Title: Lead cutting device for semiconductor device
Inventor: MAEDA MASAHITO
IPC: H01L23/50
Filed: 1995-11-14
Abstract: PROBLEM TO BE SOLVED: To give the flexibility corresponding to the type of device by a method wherein a punch unit is moved in lateral direction against a pedestal, the lead part of a semiconductor device is supported at the moved position, and a molding work is conducted on the lead part using a punch. SOLUTION: On the base part 4 of a punch unit 6, a die, which supports the tip side of the lead part 1a of a semiconductor device 1 supported by a pedestal 2, and a punch part 6a housing a punch 5 to be used for molding processing conducted on a plurality of lead parts 1a, are provided. The base part 4 is shifted by a control part 14 to the optimum position where the lead can be cut by operating a driving motor 12 and by driving a a screw 13, and the tip part of the lead 1a of a semiconductor device 1 is supported by a die 3. Then, the punch part 6a is brought down to the position where the lead can be cut, and the lead is collectively cut by the punch 5 and the die 3. As a result, this lead cutting device can be used for semiconductor devices having different sizes.
Patent JP-2000134828-A (JP)
Title: Power distribution system capable of re-closing circuit breaker through power line from remote site
Inventor: ROBERT JOHN CLAREY
IPC: H02J13/00
Filed: 1999-10-19
Abstract: PROBLEM TO BE SOLVED: To provide a power distribution system for dwelling or commercial use, capable of re-closing a circuit breaker through power line communication from a remote site. SOLUTION: A circuit breaker includes a re-closing means 47 for re-closing a contact 17 in response to a re-closing signal. The re-closing means 47 is connected on the upstream side of the contact of the circuit breaker, therefore it is possible to energize the re-closing means, even if the circuit breaker is tripped by plugging a remote reset signal generator 53 to a receptacle 59 of a branch circuit 9, whose circuit breaker is not in a tripped condition and transmitting a reset signal to the re-closing means of the tripped circuit breaker.
Patent JP-H08152347-A (JP)
Title: Electromagnetic flowmeter
Inventor: NAKAMURA SATORU
IPC: G01F1/60
Filed: 1994-11-30
Abstract: PURPOSE: To measure the flow rate with high response upon abrupt fluctuation while suppressing the error by executing an output processing at a period determined by a sampling timer in a transmitting section and setting a newly inputted flow rate detection value as a reference flow rate value when a flow rate detection value received from an A/D converter comes within a predetermined range. CONSTITUTION: An A/D converter 4 at a transmitting section 2 converts an analog signal, detected at a period determined by a sampling timer 6, into a digital value which is then fed to a CPU 3. When an inputted flow rate detection value comes within a predetermined range of a preset reference flow rate value, a processing section sets newly inputted flow rate detection value as a reference flow rate value. When the predetermined range is exceeded, the reference flow rate value is sustained at a previous value for a predetermined period and upon elapse of the predetermined period, it is replaced by a flow rate detection value at the moment of time.  A flow rate output value measured during previous output processing period is added with a value obtained by multiplying the difference between the reference flow rate value and the output value by a predetermined damping coefficient lower than 1 to produce a new flow rate value.
Patent JP-H03158024-A (JP)
Title: Error counter
Inventor: OUCHI NOBUAKI
IPC: H04B17/00
Filed: 1989-11-16
Abstract: PURPOSE:To apply the counter to the measurement of various error rates by counting number of a measured unit time causing a ripple carry from a 1st counter with a 2nd counter, counting the number of measured unit time within the measured time with a 3rd counter and calculating the error rate with an error rate calculation section. CONSTITUTION:When a ripple carry is outputted from a terminal RC by a count of an error bit by a 1st counter 1, the carry is fed to an enable terminal EN of the 1st, 2nd counters 1, 2, the count of the 1st counter 1 is stopped and the 2nd counter 2 counts a measuring unit time signal. Moreover, a 3rd counter 3 is cleared at the start of measurement and the measured time is represented in the inside of the counter by counting the measuring unit time signal. Thus, the 3rd counter 3 counts the measuring unit time number in the measured time and the 2nd counter 2 obtains the measuring unit time representing an error. Thus, the error rate is obtained by the error rate calculation section 4.
Patent JP-S63151110-A (JP)
Inventor: JIYON JIEIMUZU FURAI
IPC: H03K17/66
Filed: 1987-11-26
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-2001114187-A (JP)
Title: Towing cable expanding device of underwater sailing body
Inventor: UEDA EIJI
IPC: G01S7/52
Filed: 1999-10-19
Abstract: PROBLEM TO BE SOLVED: To provide a towing cable expanding device of an underwater sailing body capable of surely connecting and storing a towing cable and a towing body in the rear part of a small underwater sailing body during non-use without any influence on the movement of the underwater sailing body and surely expanding the same at the time of use. SOLUTION: This towing cable expanding device includes a storing device 12 for storing the towing cable and the towing body, a support rod 14 extended to the rear of the underwater sailing body, and a connecting device 16 for connecting the support rod and the storing device to be separable. The storing device has an axial recessed part 12a in which the support rod is fitted in the outer peripheral part of the front. The connecting device 16 has a belt 17 for fastening the support rod and the outer peripheral part of the front of the storing device together with the support rod fitted to the storing device, and a fussion wire 18 for connecting both ends of the belt in the tensile state. The fussion wire is fused by application of an electric current to separate both ends of the belt, thereby opening the belt outward by elasticity to separate the storing device from the support rod.
Patent JP-H06114547-A (JP)
Title: Soldering device
Inventor: ABE KOICHI
IPC: G02B19/00
Filed: 1992-10-07
Abstract: PURPOSE:To solder a fine part with a light spot by using the soldering device consisting of a light sources and plural lenses which successively condense the light from a light source to form the light spot and solder the fine spot with this light spot. CONSTITUTION:The distance Y between the points O where the light is condensed by a first convex lens is determined by equation I, the distance ao between the points O where the light is condensed by a second convex lens 3 and a second convex lens 2 is determined by equation II and the distance b0 between the points 0' where the light is condensed by the second convex lens 3 and the second convex lens 3 is determined by equation III when the focal lengths of the first to third convex lenses 2 to 4 are designated as f1 to f3, the distance between the first and second convex lenses 2 and 3 is designated as (d) and the distance between the second and third convex lenses 3 and 4 as d1. The reduction magnification b0/a0 of the second convex lens 3 is then calculated. The distance a'o between the points O' where the light is condensed by the third convex lens 4 and the second convex lens 3 is determined by equation IV and the distance b'o between points P condensed by the third convex lens 4 and the third convex lens 4 is determined by equation V. A filament diameter Fd is determined by equation VI.
Patent JP-H01139196-A (JP)
Title: Ejector structure in water treating device
Inventor: YOKOTA KAZUAKI
IPC: C02F3/20
Filed: 1987-11-24
Abstract: PURPOSE:To easily inject water having a high content of dissolved oxygen from a nozzle by forcing compressed air into the water from an appropriate position of an ejector hose connected to a pump. CONSTITUTION:The ejector hose 1 is connected to the delivery port of the pump 6. A valve 7 is provided to the hose 1 in the vicinity of the delivery port of the pump 6. A compressor 8 is connected to the valve 7, the compressor 8 is operated, hence a trace amt. of compressed air is forced into the water in the hose 1 through the valve 7, and the oxygen is forcibly moved in the hose 1 by the agitating action. As a result, the water having a high content of dissolved oxygen is obtained, and injected into treated water W from the nozzle 3 at the tip of the hose to aerate the treated water.
Patent JP-H06153216-A (JP)
Title: Color burst signal eliminating circuit
Inventor: OTAWARA MASAYUKI
IPC: H04N9/64
Filed: 1992-11-06
Abstract: PURPOSE:To obtain the color burst signal elimination circuit making the accuracy when a white/black video signal with a color burst signal superimposed thereon is subject to pedestal clamp equal to that for a conventional color video signal in a color television receiver or the like. CONSTITUTION:An input video signal 1 by a 1st clamp circuit 3 and a luminance signal (Y) from a comb-line filter 2 by a 2nd clamp circuit 4 are respectively subject to peak clamp and the clamped signal is respectively inputted to a changeover circuit 5. The switching of the said changeover circuit 5 is controlled by using a pedestal clamp pulse S1 whose phase is coincident with a phase of a back porch. The changeover circuit is thrown to the position of the 2nd clamp circuit (b) for a period when the said pulse is applied and keeps the position of the 2nd clamp circuit (a) for other periods. As the result of the changeover, a burst signal is eliminated from the obtained synthesis signal.
Patent JP-H09137921-A (JP)
Title: Low-nox gas burner
Inventor: OUKI TAKETOSHI
IPC: F23D14/74
Filed: 1995-11-15
Abstract: PROBLEM TO BE SOLVED: To realize excellent low-NOx combustion producing a reduced amount of CO, while suppressing occurrence of a flashback. SOLUTION: Gas burner having a construction wherein a plurality of burner bodies 5 each having a main burner port 8 in a main burner port forming surface 7 of a top part are juxtaposed in a burner case 3, with air-flow spaces 4 provided between, and a lean mixture gas being leaner than a mixture gas supplied to the burner bodies 5 is supplied to the air-flow spaces 4 between these burner bodies 5. In the respective upper parts of the air-flow spaces 4 between the burner bodies 5, sub-burner port plates 11 each having a large number of sub-burner ports 12 in a sub-burner port forming surface are provided.  The height of the sub-burner port forming surface of the sub-burner port plate 11 is set to be lower than the main burner port forming surface 7 of the burner body 5, while the opposite end parts in the longitudinal direction thereof are held by a retainer plate 20 fitted to the upper part of the burner case 3 and a heat-resistant packing 22 is interposed between this retainer plate 20 and the sub-burner port forming surface of the sub-burner port plate 11.
Patent JP-S62145924-A (JP)
Inventor: KARURO MOGABUERO BURUNO
IPC: H03L7/06
Filed: 1986-12-15
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-2001118936-A (JP)
Title: Semiconductor memory
Inventor: TSUJI ATSUSHI
IPC: H01L21/8244
Filed: 1999-10-19
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor memory by which crossing wiring can be formed readily on a flip flop with a large margin. SOLUTION: A crossing wiring is made consisting of steps in which, on a flip flop, a source/drain region between a first word transistor WTr1 and a first driver transistor DTr1 is connected via a first groove wiring W2 to a source/drain region of a first load transistor LTr1, which is on the opposite side of a second load transistor LTr2, a source/drain region between a second word transistor WTr2 and a second driver transistor DTr2 is connected via a second groove wiring W5 to a source/drain region of the second load transistor, which is on the opposite side of the first load transistor, via wirings (W9, W10) formed on an upper layer such as a first gate electrode, a second gate electrode G2 is connected to the second groove wiring W5, and a third gate electrode G3 is connected to the first groove wiring W2.
Patent JP-2000124290-A (JP)
Title: Wafer carrier and semiconductor manufacture device
Inventor: SERIKAWA KOICHI
IPC: B65G49/07
Filed: 1998-10-19
Abstract: PROBLEM TO BE SOLVED: To realize a wafer carrier which can lessen damages of on a wafer by detecting the wafer in which has a flaw due to contact with a robot hand within a wafer cassette. SOLUTION: A plurality of wafers 3 are stored in rows in the vertical direction inside a wafer cassette. When a wafer 3b is carried into the wafer cassette out of the plural wafers 3, a wafer 3c causes dislocation with the passage of the rear of a robot hand 2 which makes contact with the wafer 3c, caused by the dislocation on standing of the stop position of the robot hand 2, the distortion of the wafer cassette, or the like. A reflection type sensor 1 detects the projecting section out of the carriage reference line of the wafer 3c, and the detection signal of the refection photosensor 1 is sent to a robot control unit 6. The robot control unit 6 having received the detection signal, forcibly stops the action of the robot hand 2, and also sends a signal to a buzzer 7, and the buzzer 7 issues an alarm.
Patent JP-H01138787-A (JP)
Title: Flexible wiring substrate
Inventor: HARA KOJI
IPC: C08K3/22
Filed: 1987-11-25
Abstract: PURPOSE:To improve a wiring substrate of this design in an adhesive property to a metal thin film without deteriorating properties such as a heat resistant property and others by a method wherein a flexible wiring substrate composed of a mental thin film and aromatic polyimide layer is provided, where the polyimide layer contains an inorganic fine powder. CONSTITUTION:A metal thin film can be formed of metals such as, for example, Cu, Al, Ag, Au, Pt, Ni, Fe, Mo, or the like, and it is desirable that an inorganic fine powder is a composite oxide which contains at least two elements selected from a group that comprises Li, Al, Si, Ca, Ti, Cr, Mn, Fe, Co, Mg, Pb, Cu, Ni, Zn, Sb, and Ba so as to improve an adhesive property to a metal thin film and an electrically insulating property. And, an aromatic polyimide layer containing an inorganic fine powder is formed in such a way that a coating solution is provided, which is composed of a solution of aromatic polyimide or aromatic polyimide precursor and an inorganic fine powder which is dispersed into the solution, applied onto the metal thin film, and heated so as to remove the solvent. Moreover, an amount of an inorganic fine powder contained in the aromatic polyimide layer is usually 0.01-5.0% by weight depending on kinds of an inorganic fine powder and aromatic polyimide.
Patent JP-H11190924-A (JP)
Title: Image forming device
Inventor: KOBU MAKOTO
IPC: B41J29/00
Filed: 1998-10-19
Abstract: PROBLEM TO BE SOLVED: To compose image forming devices of various kinds of systems with a small expense and small space. SOLUTION: The image forming part 21 of the image forming device is composed such that an image forming main body part 111 including an image forming means and a carrying part 112 including a recording-medium carrying means are separable from each other. The image forming main body part 111 can store an image forming means of a different image-forming system. In the case a plurality of image forming parts 21 are used, the carrying part 112 of each image forming part is detached, and a common carrying unit is attached, thereby improving the ability to carry recording paper and preventing degradation in image quality.
Patent JP-H03158763-A (JP)
Title: Structure of acceleration sensor
Inventor: ASANO YASUHIRO
IPC: G01P15/11
Filed: 1989-11-17
Abstract: PURPOSE:To prevent an output signal from varying even if an external magnetic field is applied and to enable accurate acceleration detection by constituting a magnetic circuit in a weight, reducing the magnetic flux leakage at a fine gap part and supplying magnetic flux density to a Hall IC. CONSTITUTION:The acceleration sensor is fixed to the base 14 of the body of an automobile with a screw. The weight 5 fixed to a spring 1 receives acceleration by the vibration of the automobile body to vibrate. The magnetic circuit is constituted in the weight 5 by using a ferromagnetic body including a permanent magnet 3, the fine gap, etc. The weight 5 incorporates a U-shaped yoke 4 and the rectangular permanent magnet 3 is fixed to the end part of the yoke 4; and the Hall IC 7' is fixed to a printed board 8 protruding from the side of a frame body 6 at the fine gap between both ends of the yoke 4 and the Hall IC 7' is arranged in the fine gap and placed in the specific magnetic flux density. Its variation quantity is converted electromagnetically by the Hall IC 7' while made correspond to the acceleration and then led out as output electric power.
Patent JP-H07124260-A (JP)
Title: Manufacture of catheter and balloon
Inventor: WATABE TAMISHIGE
IPC: A61M25/00
Filed: 1993-11-02
Abstract: PURPOSE:To ensure easy insertion into a blood vessel and properly and safely inflate a balloon even at a curved occlusion section for the expansion thereof. CONSTITUTION:This catheter has an insertion section 1 with a contrast medium feed passage 5 where a laser fiber 9 is inserted, and a balloon 2 attached to the forward end of the section l. A balloon 2 is internally provided with a heat generation tube 21 communicated and jointed to the passage 5 for feeding a contrast medium from the peripheral end section into the balloon 2 approximately over the entire length thereof. In this case, the tube 21 is heated with a laser beam transmitted via the fiber 9. The forward, end of the fiber 9 has a tapered-off form 9a where the laser beam is irradiated peripherally. The section 9a is inserted in the tube 21 approximately over the entire length thereof.
Patent JP-H04169248-A (JP)
Title: Thermal head
Inventor: ITO MASAYUKI
IPC: B41J2/335
Filed: 1990-11-02
Abstract: PURPOSE:To simplify structure of a thermal head and manufacturing process therefor, and to achieve high-speed printing at low costs with less consumption of electricity without impairing the printing efficiency by a method wherein an insulating substrate is constructed of a copper-plated printed circuit board made of heat-resistant resin, and a heat-radiating layer formed of copper foil of the insulating substrate is covered by lamination with a heat- accumulating layer made of polyimide resin. CONSTITUTION:A copper-plated heat-resistant printed circuit board is used as an insulating substrate 1. Copper foil formed over the substrate 1 is stretched under a heat-generating resistance body 2 in the direction of main scanning, and a heat-radiating layer 11 only is formed with patterning applied thereon. A heat-accumulating layer 7 is formed all over the heat-radiating layer 11, and the heat-generating resistance body 2, individual wiring electrodes 4, common electrodes 6, and control elements connecting electrodes 5 are formed on the heat-accumulating layer 7. Then patterning is applied simultaneously to the common electrodes 6, and the control elements connecting electrodes 5 and after this, patterning is also applied to the individual wiring electrodes 4 and the heat-generating resistance body 2. Then protection is applied to the heat-generating resistance body 2, the common electrodes 6, and a part of the individual wiring electrodes 4, and thereby a thermal head substrate is made up. The heat-accumulating layer 7 is formed of polyimide resin which contains siloxane linkage in 0.11(mm<2>/sec) of thermal diffusivity.