baber/WOPTO huggingface dataset:
Patent TW-I272437-B (TW)
Title: Liquid crystal display device
Inventor: OGISHIMA KIYOSHI
IPC: G02F1/1343
Filed: 2003-08-29
Granted: 2007-02-01
Abstract: The liquid crystal display device of this invention includes a first substrate, a second substrate, and a vertical alignment type liquid crystal layer including liquid crystal molecules having negative dielectric anisotropy disposed between the two substrates. In each of a plurality of picture-element regions, the liquid crystal layer has a plurality of liquid crystal regions different in the direction in which liquid crystal molecules tilt upon application of a voltage. At least one of the first and second substrates has a light-shield layer overlapping at least part of boundary region defined as regions separating the plurality of liquid crystal regions from each other. The part of the boundary region overlapping the light-shield layer is a region permitting liquid crystal molecules surrounding the region to tilt so that the ends of the liquid crystal molecules closer to the substrate having the light-shield layer go away from the region upon application of a voltage.
Patent TW-I228561-B (TW)
Title: Quakeproof and typhoon-proof building
Inventor: PENG DA-SHIUNG
IPC: E02D31/08
Filed: 2003-09-03
Granted: 2005-03-01
Abstract: Disclosed is a quakeproof and typhoon-proof building, comprising a foundation layer, a plurality of shock-absorbing pads, a building structure and a plurality of tilt-prevention devices. The shock-absorbing pads are mounted on the foundation layer and each shock-absorbing pad is comprised of flexible material in combination with rigid material. The building structure has a bottom layer and a structure layer formed on the bottom layer. The bottom layer is formed with pre-cast iron-bar reinforced cement boards arranged on the shock-absorbing pads. Each tilt-prevention device comprises a steel cable connected between the structure layer and the foundation layer to have the structure layer constrained by the steel cable and to reduce an external force thereon by the flexibility of the steel cable.
Patent TW-I227333-B (TW)
Title: In-situ detection of thin-metal interface using optical interference via a dynamically updated reference
Inventor: AMARTUR SUNDAR
IPC: H01L21/304
Filed: 2003-09-23
Granted: 2005-02-01
Abstract: An invention for detecting an endpoint during a chemical mechanical polishing (CMP) process is provided. A reflected spectrum data sample is received that corresponds to a plurality of spectrums of light reflected from an illuminated portion of the surface of a wafer. The reflected spectrum data sample is normalized using a normalization reference comprising a first reflected spectrum data sample obtained earlier during the CMP process. In addition, the normalization reference is updated during the process using a second reflected spectrum data sample obtained earlier during the CMP process. The second reflected spectrum data sample is obtained after the first reflected spectrum data sample. In this manner, an endpoint is determined based on optical interference occurring in the reflected spectrum data.
Patent TW-I231022-B (TW)
Title: Method for fabricating solder bump
Inventor: HUANG MIN-LUNG
IPC: H01L23/48
Filed: 2003-09-26
Granted: 2005-04-11
Abstract: A method for fabricating a solder bump. A passivation layer is coated on a chip where a bump pad formed on the chip is substantially exposed. An under bump metallurgy (UBM) layer is formed on the passivation layer and the bump pad. Thereafter, a photoresist pattern layer is formed on the UBM layer, which has an opening to expose the UBM layer over the bump pad, and then the opening is filled with a first conductive layer. After the photoresist pattern layer is removed, a first reflow process is performed on the first conductive layer to transfer to a first solder bump. A second conductive layer is formed on the surface of the first solder bump by plating and then a second reflow process is performed on the second conductive layer to transfer to a second solder bump.
Patent TW-I230904-B (TW)
Title: Light guide module having an embedded LED
Inventor: JU JI-CHIUN
IPC: G02B6/00
Filed: 2003-11-10
Granted: 2005-04-11
Abstract: The present invention relates to a light-guide module of optical mouse, in which an LED die is embedded within a light-guide input of a light-guide unit. The light-guide unit has an internal parabolic surface. The light emitted by the LED die is reflected from the parabolic surface for being uniformly guided to the light-guide output.
Patent TW-I227798-B (TW)
Title: Apparatus and methods for remakeable connections to optical waveguides
Inventor: FEGER CLAUDIUS
IPC: G02B6/02
Filed: 2003-11-27
Granted: 2005-02-11
Abstract: A single-mode optical waveguide with a core surrounded by a cladding consisting of an inner soft layer and an outer harder layer is described. The outer layer has a grating structure on its inner surface whose spatial frequency is the same as that of the guided mode. The thickness of the inner cladding is sufficient to keep the grating outside the mode field in undeformed regions of the waveguide so that normally no out-coupling of the light results. Connections are made by crossing two such waveguides at an angle and pressing them together. This results in deformation of the two waveguides such that the gratings are brought into proximity with the cores. Light is coupled out of one waveguide and into the other in the deformed region resulting in a self-aligning optical connection. The out-coupled light propagates normal to the waveguide axis so errors in the crossing angle cause little change in efficiency. Because the cladding system is sufficiently resilient to recover after deformation, the connection is remakeable.
Patent TW-I241201-B (TW)
Title: Protector for indwelling needle having wings
Inventor: SUZUKI HIROTO
IPC: A61M5/32
Filed: 2003-12-01
Granted: 2005-10-11
Abstract: A protector for an indwelling needle having wings, where the operation to receive the indwelling needle having wings in a protector body is simple and a hollow needle can be reliably received in the body. A pair of slits (7a, 7b) that are parallel to each other is formed in an outer tube (2) for receiving an indwelling needle (5) having wings that are wing elements (6) exposed in the received state. The slits (7a, 7b) are cut so as to be longer than a hollow needle (5b) and guide the wing elements (6) in a receiving direction so that the elements are held at the base end portions of the slits. Projection elements (8a) projecting in directions intersecting each of the slits (7a, 7b) and elastically swingable to inside the outer tube (2) are provided in the protector. Side edges on one side of the projection elements (8a), in contact with the wing elements (6) moving in a receiving direction along the slits (7a, 7b) are inclined edges inclined to a direction diagonally intersecting the slits (7a, 7b). Side edges on the other side of the projection elements (8a), in contact with the wing elements (6) positioned at the base end portions of the slits (7a, 7b) are engagement edges engaging with the wing elements (6) so as to prevent the wing elements (6) from moving in an escape direction.
Patent TW-I269276-B (TW)
Title: Compact disc drive
Inventor: LIN YU-MIN
IPC: G11B7/00
Filed: 2003-12-01
Granted: 2006-12-21
Abstract: The present invention provides a compact disc drive, which comprises a first chassis, a first rotation device mounted on the first chassis, a first displacement device, a second displacement device, a second rotation device, a first driving device, and a first sensing device; wherein, when pushing a disc into the compact disc drive, the first bump on the first displacement device and the second bump on the second displacement will position the disc in-between; then, the disc will be against the first bump and the second bump, and the first displacement device and the second displacement device will be retracted simultaneously in opposite direction; and, when the first displacement device triggers the first sensing device, the first driving device will drive the second driving device rotating to feed the disc into the compact disc drive.
Patent TW-I246205-B (TW)
Title: Light emitting device with micro reflectors
Inventor: HSIEH MING-HSUN
IPC: H01L33/00
Filed: 2003-12-04
Granted: 2005-12-21
Abstract: The present invention provides a light emitting device with micro reflectors, in which the device has a micro reflector, and the micro reflector is used to reflect the light from the light emitting layer to the micro reflector, and guide the light out, so as to improve the light emitting efficiency of the light emitting device.
Patent TW-I244189-B (TW)
Title: Arrangement of bonding wires in a semiconductor chip package
Inventor: HSIEH JENNY
IPC: H01L23/49
Filed: 2004-01-02
Granted: 2005-11-21
Abstract: Arrangement of bonding wires in a semiconductor chip package. At least one signal bonding wire connects a chip and a package substrate. At least two power bonding wires surround the signal bonding wire and connect the chip and the package substrate.
Patent TW-I243388-B (TW)
Title: Structure and method for a multi-electrode capacitor
Inventor: JOW UEI-MING
IPC: H01G17/00
Filed: 2004-01-16
Granted: 2005-11-11
Abstract: The present invention relates a structure and method of manufacturing for multi-electrode capacitor, which includes a plurality of metal laminates coupled plus other edge-coupled effect to form a structure of multi-electrode capacitor. From the structure and method of multi-electrode capacitor, the invention can achieve the biggest capacitance got in smallest area electrodes, and applied to high frequency modules and system in the future development.
Patent TW-I245828-B (TW)
Title: Energy-dissipative support device
Inventor: TSAI CHUNG-SHING
IPC: E04C3/02
Filed: 2004-02-02
Granted: 2005-12-21
Abstract: The present invention relates to an energy-dissipative support device, wherein a single board is cut to form a bracing force-taking member, which is located at a central position and serves as the primary part, two side stabilizing pieces arranged on opposite sides, and two clamping pieces arranged on upper and lower sides of the bracing force-taking member. The clamping pieces are fixed to the side stabilizing pieces by welding or bolts with a gap for energy dissipation and vibration reduction is kept between the primary part and each side stabilization piece. Thus, a support construction material for energy dissipation can be formed without any material waste of a single board.
Patent TW-I361814-B (TW)
Title: Plastic bonding method
Inventor: WATANABE TATSUFUMI
IPC: C08J5/12
Filed: 2004-03-05
Granted: 2012-04-11
Abstract: To provide a method of bonding two materials directly with each other, at least one of which is made of a plastic material, which method is applicable to bonding two materials, with no need to use any bonding agent and without allowing the materials to be exposed to high temperature and/or high pressures. In this method in which a first member made of a plastic material and a second member are bonded together, one surface of the first member to be bonded with the second member is irradiated with energy rays having a quantity of energies not lower than 4 eV, followed by directly bonding the first and second members together without any bonding agent being used.
Patent TW-I276677-B (TW)
Title: Process for production of etching or cleaning fluids
Inventor: SUYAMA MAKOTO
IPC: C11D7/08
Filed: 2004-03-12
Granted: 2007-03-21
Abstract: The invention relates lo a method for producing an etching or cleaning solution comprising (1) at least one member selected from the group consisting of fluoride salts and bifluoride salts formed from at least one member selected from the group consisting of ammonia, hydroxylamines, aliphatic amines, aromatic amines, aliphatic quaternary ammoniums and aromatic quaternary ammoniums with hydrofluoric acid; (2) at least one heteroatom-containing organic solvent; and (3) water, the method comprising the steps of: step 1: mixing an aqueous hydrofluoric acid solution with at least one heteroatom-containing organic solvent, and step 2: mixing the mixture obtained in step 1 with at least one member selected from the group consisting of ammonia, hydroxylamines, aliphatic amines, aromatic amines, aliphatic quaternary ammoniums, aromatic quaternary ammoniums, and fluorides thereof.
Patent TW-I255091-B (TW)
Title: Voltage detecting circuit
Inventor: CHANG SHIH-HSIEN
IPC: H02J7/04
Filed: 2004-04-08
Granted: 2006-05-11
Abstract: A voltage detecting circuit is disclosed. The voltage detecting circuit is applied to use in a power adapter. The voltage detecting circuit includes an impedance adapter for receiving a high impedance voltage signal and transforming into a low impedance voltage signal; a storage device electrically coupled to the impedance adapter for receiving the low impedance voltage signal; a current source electrically coupled to the storage device for providing the storage device with a way for discharging electricity; and a comparator electrically coupled to the current source having a reference voltage value for receiving the voltage signal of the storage device for mapping with the reference voltage value and generating a control signal according to the mapping result for controlling the power adapter.
Patent TW-I248053-B (TW)
Title: Dot matrix type display device and information equipment employing the same
Inventor: SEKI SHUICHI
IPC: H01L51/50
Filed: 2004-04-20
Granted: 2006-01-21
Abstract: The present invention provides a dot matrix type display device that consists of multiple self light-emitting elements in which a display burning phenomenon can be prevented from occurring. In accordance with the dot matrix type display device, the multiple self light-emitting elements are arranged in a dot matrix form and at least a part of the display area can display icons, pictures, characters, and so on. Then, by means of a successive shifter and other devices, each display origin of the icons, pictures, and characters can be shifted by at least one point to display.
Patent TW-I232600-B (TW)
Title: Assembly method for surface mounting optoelectronic device
Inventor: SUN GOLD-CHEN
IPC: H01L33/00
Filed: 2004-05-07
Granted: 2005-05-11
Abstract: An assembly method for LED is applied to enhance light-emitting efficiency of surface mounting optoelectronic device. A LED is mounted on a substrate to electrically connect to conductive layers of the substrate. A PPA bulk is covered over the LED chip and the substrate. A reflective layer and a protective layer are deposited on the PPA bulk to make the LED emit light effectively. An opening being cut on reflective and protective layer serves as an emitting surface for LED chip.
Patent TW-I267485-B (TW)
Title: Garbage bin pedal structure
Inventor: LIN TSUNG-YOU
IPC: B65F1/16
Filed: 2004-06-11
Granted: 2006-12-01
Abstract: This invention provides a garbage bin pedal structure, including: a base; a bin body provided on the base; a lid provided above the bin body; a pedal member provided to the bin body; a link rod mechanism arranged between the lid and the pedal member, wherein the pedal member includes a pedal portion and a link portion, a pivot portion formed between the pedal portion and the link portion. The pivot portion is pivoted to opposing sides of the bin body to expose the pedal portion that can be activated by stepping the pedal to pivot. The link portion is located within the bin body and connected to the link rod mechanism. The link rod mechanism is of a design that does not expose from the bin body to eliminate the need of forming additional notches, so as to improve the overall strength of the bin body. In addition, the arm of force application of the pedal portion is greater than that of the link portion, such that it requires a lower force application on the pedal portion thereby providing effort-saving effect.
Patent TW-I280190-B (TW)
Title: Forming method of the metallic slab for electronic device shell and its structure thereof
Inventor: CHUANG YING-HUI
IPC: B32B15/08
Filed: 2004-06-29
Granted: 2007-05-01
Abstract: A forming method of the metallic slab for electronic device shell and its structure, which primarily coats a layer of adhesive onto a metallic substrate which is then subject to baking, followed by directly utilizing a heated mirror roller to laminate a film layer composed of the PVC layer, the adhesive layer, the printing layer, and polyester layer onto the adhesive for binding, and forms by subsequent cooling, such that the film layer and the metallic layer possesses excellent air-tightness in between. By means of direct rolling-press forming process method, waste water and environment pollutions generated from the surface treatment of substrate can be effectively avoided, and the materials of PVC layer and polyester layer of the film layer can maintain high smoothness and erosion resistance for the surface of metallic substrate in order that both artistic and protection efficacies can be possessed.
Patent TW-I287933-B (TW)
Title: Procedure for establishment of links between stations connected to a telecommunication network
Inventor: BLASCO CLARET JORGE VICENTE
IPC: H04L12/56
Filed: 2004-07-02
Granted: 2007-10-01
Abstract: It is characterized by the assignment of a local transmission identifier to each link and a decoding of the information based on the local identifier of the assigned link and on the unequivocal identifier sent by the transmitter in its transmission period. It permits multiple links to be established between stations of a telecommunications network, in a way that is unicast (towards a single recipient) or multicast (towards multiple recipients) independently of the type of network or system used in the communication. It is applicable to telecommunication systems which apply an addressing system for the connection of stations and displays the advantages of minimizing the data overload due to the headers, facilitating the establishment of connections between two or more stations and making the addressing of the packets within the same network more flexible.
Patent TW-I261919-B (TW)
Title: Method of manufacturing a non-volatile memory device
Inventor: LI YI-HUNG
IPC: H01L27/115
Filed: 2004-07-29
Granted: 2006-09-11
Abstract: A method of manufacturing a non-volatile memory device is disclosed. A substrate having a memory cell area and a periphery circuit area is provided. The memory cell area has some memory cell structures. Each of the memory cell structures comprises a lower dielectric layer, an electron-trapping layer an upper dielectric layer and a control gate. The periphery circuit area has some gate structures. Each of the gate structures comprises a gate dielectric layer and a gate. Then, a protection layer is formed on the substrate and covering the memory cell structures and the gate structures. Next, an inter layer dielectric is formed on the substrate. Furthermore, removing portion of the inter layer dielectric and the protection layer. And, a spacer is formed on the sidewalls of the gate structure in the periphery circuit area. Because the protection layer is formed on the memory cell area, the control gates and the electron trapping layer can avoid the damages from the UV light and the plasma.
Patent TW-I236174-B (TW)
Title: Organic-inorganic light emitting diode structure
Inventor: CHEN HSUEH-SHIH
IPC: H01L51/00
Filed: 2004-08-16
Granted: 2005-07-11
Abstract: The present invention provides an organic-inorganic light emitting diode structure, comprising a substrate, a first electrode on the substrate, an organic-inorganic emitting layer on the first electrode and a second electrode on the organic-inorganic emitting layer. The organic-inorganic emitting layer comprises plurality of organic-inorganic quantum dots dispersing in a polymer. The organic-inorganic quantum dot comprises a ZnX (X is selected from the group consisting of S, Se, Te and combinations thereof) quantum dot and an organic material covering the ZnX quantum dot surface.
Patent TW-I270740-B (TW)
Title: Image pick-up device, white balance control method
Inventor: YUYAMA MASAMI
IPC: G03B7/00
Filed: 2004-08-26
Granted: 2007-01-11
Abstract: The electronic camera of the invention includes a first and a second gain controller circuits 21, 22, in addition to having a gain memory 38. The gain memory 38 comprises a first gain table and a second gain table, which memorize respectively the gains to be set in the red color (R) element amplifier 21a and the blue color (B) element amplifier 21c of the first gain controller circuit 21, and the red color (R) element amplifier 22a and the blue color (B) element amplifier 22c of the second gain controller circuit 22. Furthermore, the gains stored in the second gain table are set sequentially in the second gain controller circuit 22 and the white detection is executed, and based on the results of the white detection, the gains which should be set in the first gain controller circuit 21 are selected from the first gain table and set in the first gain controller circuit 21.
Patent TW-I243879-B (TW)
Title: Aseismatic support platform
Inventor: HUANG JR-HUNG
IPC: F16F9/00
Filed: 2004-09-03
Granted: 2005-11-21
Abstract: The present invention relates to an aseismatic support unit, and more particularly to an aseismatic support unit capable of being easily and fitly in-situ assembled to become an aseismatic system. The aseismatic support unit is mounted between a base and a loaded article, comprising a lower support member, an upper support member and a plurality of aseismatic units mounted therebetween. Each of the aseismatic units includes a lower carry member having an upward carry surface, an upper carry member having a downward carry surface and a support roller mounted therebetween. When an earthquake happens, shakes are transmitted from the base. Then, the aseismatic support unit of the present invention diminishes the extent of the shakes of the load article placed over the upper support member and thus prevent the loaded article from overturn and damage caused by the earthquake.
Patent TW-I234430-B (TW)
Title: Chip carrier
Inventor: CHAN BENSON
IPC: G02B6/42
Filed: 2001-03-22
Granted: 2005-06-11
Abstract: A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.
Patent TW-I246563-B (TW)
Title: Snap-on clip
Inventor: HSIAO SHUN-YUAN
IPC: F16B1/00
Filed: 2004-10-22
Granted: 2006-01-01
Abstract: The present invention relates to a snap-on clip comprising at least a first inward-inclined extension tab and a second extension tab respectively formed on one side of a lying U-shaped abutting board and a fixing board of the clip, and at least a pair of downward extending bent sections formed on an edge of the abutting board on opposite sides of the first extension tab. The present invention can be used as an interface element between recessing-and-raising coupling between front and rear enclosure members, which can be used in applications where space is insufficient and fastening that cannot be realized due to material property and can be removed and made is commonly modularized manner, whereby the present invention can be modularized for mass production and can be commonly employed in a variety of different devices and features precise fastening and free of influence by size constraints and deformations thus achieving simple structure and easy usage and installation.