baber/WOPTO huggingface dataset:
Patent JP-2004075703-A (JP)
Title: Method of preparing metal colloidal solution and metal colloidal solution
Inventor: ONO AYAKO
IPC: B01J13/00
Filed: 2002-08-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of preparing a metal colloidal solution which can produce a metal colloid having a large particle diameter and a high metal concentration by controlling the particle diameter of metal colloidal particles.  <P>SOLUTION: The method of preparing the metal colloidal solution comprises performing the reduction of a metallic compound in a raw material metal colloidal solution containing a polymeric pigment dispersing agent.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004073908-A (JP)
Title: Method for adjusting rainwater infiltration in waste disposal plant
Inventor: KOTANI KATSUMI
IPC: B09B1/00
Filed: 2002-08-09
Abstract: <P>PROBLEM TO BE SOLVED: To easily adjust the amount of permeation of rainwater by regulating the area ratio of cover soil surfaces after a final treatment where the rainwater permeates.  <P>SOLUTION: In a waste disposal plant 10, the final cover soil 16 of a gradient inclining increasingly toward the peripheral edge from the center of the disposal plant 10 is applied on the upper surface of the wastes 14 completed of the landfill and the top of the cover soil 16 is covered with liner sheets 20. A plurality of slits or small bores 22 are opened at a prescribed aperture ratio at the liner sheets 20 to allow part of the rainfall pouring on the liner sheets 20 through the slits or small bores 22 to penetrate the inside of the wastes 14 through the cover soil 16.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004078369-A (JP)
Title: Site status monitoring method, site status monitoring device, control program therefor, and recording medium storing the control program
Inventor: HONDA SEIICHI
IPC: G06F3/0482
Filed: 2002-08-12
Abstract: <P>PROBLEM TO BE SOLVED: To eliminate the confusion and troublesomeness of a monitoring operation by preventing specific errors (minor errors) from being displayed.  <P>SOLUTION: A local/remote monitoring terminal 32 comprises a display means graphically displaying sites (sites A to D) dispersed on a network and equipment installed in the sites on a monitor screen, a collecting means collecting information showing the operating states of equipment installed in the sites, and an attribute change means changing the display attributes of the graphics of the sites displayed on the monitor screen when the collected information indicates an error and graphics corresponding to the information among the graphics of the installed equipment in the sites to specified attributes intended to give a warning to an operator and not changing the attributes when the error is a specified minor error.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004077684-A (JP)
Title: Method and device for manufacturing phase difference film
Inventor: HOSOI MASAHIRO
IPC: B29L7/00
Filed: 2002-08-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a phase difference film which is superior in heat resistance, surface properties, and optical characteristics and is relatively thin and satisfies optical properties.  <P>SOLUTION: The method of manufacturing a phase difference film comprises a preheating stage, a stretching stage, a cooling stage, a heat treatment stage in order, and a high polymer film is stretched between narrow span rolls in the stretching stage, and the high polymer film is subjected to heat treatment between rolls having different peripheral velocities in the heat treatment stage.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004079944-A (JP)
Title: Semiconductor device and its manufacturing mold
Inventor: SASAHARA RYOICHI
IPC: H01L23/50
Filed: 2002-08-22
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a semiconductor device comprising a semiconductor element 1, a lead frame 2 performing electrical connection with the outside while mounting the semiconductor element 1, and a member 3 for connecting the semiconductor element 1 and the lead frame 2 electrically in which the lead frame 2 is resin sealed and a groove 22 is made around the electrical connection area 21 being connected with the electrical connection member 3 of the lead frame 2.  <P>SOLUTION: An inexpensive semiconductor device in which electrical connection can be made stably on a lead frame while preventing generation of bur in the electrical connection area, and its manufacturing mold are obtained.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004088249-A (JP)
Title: Antenna structure and communication device with the same
Inventor: ISHIHARA TAKASHI
IPC: H01Q5/00
Filed: 2002-08-23
Abstract: <P>PROBLEM TO BE SOLVED: To perform downsizing and thinning an antenna while suppressing reduction in antenna efficiency.  <P>SOLUTION: An antenna structure 1 includes an antenna body 2 in which a fed radiation electrode 5 and a non-fed radiation electrode 6 for generating a double resonance state are formed on a dielectric substrate 4, and a substrate 3 for mounting the antenna body 2 thereon. A ground electrode 10 is formed on the substrate 3 by avoiding a ground-electrodeless portion 11. The ground-electrodeless portion 11 is formed on at least a portion of a mounting area A of the antenna body 2 and at a portion sticked out of and away from the mounting area A of the antenna body 2 consecutively the portion. Grounding ends 5a, 6a of the fed radiation electrode 5 and the non-fed radiation electrode 6 formed on the substrate 4 are connected to the ground electrode 10 via grounding line patterns 13, 14 formed on the ground-electrodeless portion 11 being outside the mounting area A of the antenna body 2.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004087622-A (JP)
Title: Pigment sensitized solar cell
Inventor: FUKUYA NOBUHIRO
IPC: H01G9/20
Filed: 2002-08-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a pigment sensitized solar cell in which the photoelectric transduction performance is not lowered by short-circuit.  <P>SOLUTION: In the pigment sensitized solar cell successively laminating an electrode layer, a photoelectric transduction layer which adsorbs pigments on a porous semiconductor layer formed on the electrode layer, a carrier transportation layer and a counter electrode, an electrode layer portion to which the electrode layer and the photoelectric transduction layer not in contact is covered with a short-circuit proofing layer composed of a high-resistance semiconductor or insulating material.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004088281-A (JP)
Title: Recording/reproducing apparatus, digital data storing device, and data storage system
Inventor: TSURUFUSA HIDEO
IPC: G06F12/00
Filed: 2002-08-26
Abstract: <P>PROBLEM TO BE SOLVED: To solve the problem wherein programs desired not to be erased are stored during using of a recording/reproducing apparatus and an area available to newly record contents is reduced.  <P>SOLUTION: The recording/reproducing apparatus includes contents recording means for recording digital data input from an external unit, an external storage data selecting means for selecting part of the digital data recorded in the recording means is stored in a digital data storage unit, and a communication means for communicating with the digital data storage unit. The digital data selected by the data selecting means is output toward the digital data storage unit.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2003115909-A (JP)
Title: Mobile phone
Inventor: KOBAYASHI TAKASHI
IPC: H04W84/10
Filed: 2002-08-26
Abstract: PROBLEM TO BE SOLVED: To provide a mobile phone used for an information processing system capable of solving problems of facility investment, serving articles widely spread, services or the like and receiving their costs. SOLUTION: The mobile phone of this invention includes; an insertion section to which an IC card having a memory is inserted; a transmission means for transmitting purchase request information to an external device; a reception means for receiving response information sent from the external device; and a write means for writing the response information received by the reception means to the memory of the IC card.
Patent JP-2004087908-A (JP)
Title: Nitride semiconductor light-emitting element, method for manufacturing the same, and optical device mounting the same
Inventor: TSUDA YUZO
IPC: H01S5/323
Filed: 2002-08-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a nitride semiconductor light-emitting element which improves emission efficiency and has low threshold current density.  <P>SOLUTION: The nitride semiconductor light-emitting element is provided with a light guide layer 14 of n-type GaN, a light-emitting layer 15 and a carrier block layer 16 of p-type AlGaN. The light-emitting layer 15 has a structure, wherein a barrier layer 30a, a well layer 31, a barrier layer 30b, a well layer 31, a barrier layer 30b, a well layer 31 and a barrier layer 30c are stacked in this order. The well layer 31 is an InGaN layer, without being doped with impurities. At least the barrier layer 30b sandwiched between the well layers 31 includes an InGaN layer 33b, having an In composition ratio different from that of the well layer 31 and includes a GaN layer 32b, with the InGaN layer 33b in contact with one well layer 31 and the GaN layer 32b in contact with the other well layer 31.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004088948-A (JP)
Title: Switching method for transistor in ac servo controller
Inventor: SATO KAZUO
IPC: H02P27/06
Filed: 2002-08-28
Abstract: <P>PROBLEM TO BE SOLVED: To solve the problem in a motor current controlled by an AC servo controller that, due to synchronization by a carrier frequency and on-delay for short-circuit prevention, there occurs slow response, waveform distortion, the generation of torque ripples, increased loss and the like.  <P>SOLUTION: If all the power transistors are turned off to establish a standby state, and then a current command or current feedback is changed, switching is carried out by a time supposed to be required with the time of change taken as a starting point. Thereby a current is passed through, and thereafter, all the power transistors are turned off to establish the standby state. Or, if the power transistors are kept on for a certain period of time and then turned off to establish the standby state, all the power transistors are forcedly kept off for a certain period of time, to establish the standby state. If a three-phase AC motor is driven, periods of time for turning on the power transistors are overlapped with respect to two phases wherein the current is passed through in the same direction. Therefore, correction is made by the periods of time, and then switching is carried out.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004086016-A (JP)
Title: Image processor and paper feeding control method therefor
Inventor: WATANABE TAKESHI
IPC: B65H3/44
Filed: 2002-08-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image processor and a paper feeding control method therefor which enable an unprinted accumulated document not to stay in an image processor by forcibly discharging an image even when all paper feed trays are placed in an automatic paper feeding inhibition state.  <P>SOLUTION: When an image is inputted to the image processor 1, an image processing part 7 processes the image and the processed image is accumulated in a main storage device 3; and it is judged whether the image is printed on recording paper in a specified paper feed tray and when the accumulated image is not printed on the recording paper in the specified paper feed tray, it is confirmed whether there is a paper feed tray which is permitted to automatically feed paper. When all the paper feed trays are inhibited from automatically feeding paper, at least one paper feed tracy to be permitted to automatically feed paper is selected and the image processing part 7 performs a process of enlarging or reducing the image according to the size and direction of recording paper stored in the selected paper feed tray, prints the image on recording paper stored in the selected paper feed tracy, and deletes the image accumulated in the main storage device 3.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004096277-A (JP)
Title: Route tracing method in mobile ip network
Inventor: SEGUCHI YOSHIYUKI
IPC: H04W80/04
Filed: 2002-08-30
Abstract: <P>PROBLEM TO BE SOLVED: To trace a route including a virtual route in a mobile IP network system.  <P>SOLUTION: A CN1 sends a trace packet to an MN5, and an HA2 receives the trace packet via routers 11r, 12r, capsulates the packet and sends it to an FA3, as a virtual route is formed between the HA2 and the FA3. The FA3 decapsulates the capsulated packet and sends it from a router 31r to the MN5. The HA2 sends a separate trace packet for tracing the virtual route, HA2-12r-13r-FA3, from the trace packet sent from the CN1, thereby tracing the virtual route. Thus, the route tracing including the virtual route is possible, using the trace packet sent from the CN1 and the trace packet for the virtual route sent from the HA2.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004095318-A (JP)
Title: Process of manufacture of plasma display panel
Inventor: SEKI KAZUNORI
IPC: H01J11/24
Filed: 2002-08-30
Abstract: <P>PROBLEM TO BE SOLVED: To improve contrast at the bright part by increasing the area of black part in the non-discharge region in the panel.  <P>SOLUTION: After a black color first partition wall layer 26 having a prescribed pattern shape is formed on a substrate, a white color second partition wall 27 is formed so as to cover the first partition wall layer 26. Then, by removing the region parallel to the substrate out of the second partition wall layer 27, the surface of the first partition wall layer 26 is exposed, and thereby, the partition walls are formed.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004095844-A (JP)
Title: Wafer dicing/bonding sheet, and manufacturing method of semiconductor device
Inventor: SUGINO TAKASHI
IPC: H01L21/58
Filed: 2002-08-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a wafer dicing/bonding sheet for transferring an adhesive layer where a die bond layer of excellent storage modulus is formed for smooth pasting to a semiconductor wafer and pick-up operation of an IC chip onto the rear surface of the IC chip.  <P>SOLUTION: The wafer dicing/bonding sheet has a first and second adhesive layers 2 and 3 laminated sequentially on a base material 1. The minimum value of storage modulus of the second adhesive layer 3 is 10<SP>8</SP>pa or higher at -50 to 150°C after curing. The method for manufacturing a semiconductor device includes the following processes. A semiconductor wafer is pasted to the second adhesive layer 3 of the wafer dicing/bonding sheet. The semiconductor wafer is diced to provide an IC chip. The second adhesive layer 3 and the first adhesive layer 2 are tightly fitted and left on the rear surface of the IC chip, and peeled from the base material. The IC chip is press-fitted under heat on a die pad through the first adhesive layer.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004094631-A (JP)
Title: Operation support device for plant equipment
Inventor: FUJIYAMA KAZUNARI
IPC: G05B23/02
Filed: 2002-08-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a device for forecasting risks and associated costs regarding damage, performance deterioration and breakdown of equipment comprising plant, and selecting and directing the optimum operation method by comparing gain from the operation with the risks and the associated costs.  <P>SOLUTION: An operation support device for this plant equipment is constituted with an event simulation means 6 for calculating, based on a failure statistics database in which an event tree for the plant equipment and degree of unreliability on the failure phenomenon are associated and stored in advance, the degree of unreliability corresponding to parameter for the operation in accordance with the event tree for the plant equipment, a risk and associated cost calculation means 7 for calculating the risks and the associated costs with accumulated amount of the product of the degree of the unreliability and a recovery cost for the failure in accordance with the event tree, an operation method decision means 8 for deciding if conditions for the operation are appropriate from comparison between the risks and the associated costs and the gain to be projected from continuing the operation, and an operation method directive means 9 in which the operation method directs the designated conditions for the operation to the plant equipment in accordance with the operation method decided by a designated means.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004092314-A (JP)
Title: Power window drive controller
Inventor: MORIYA HIROSHI
IPC: E05F15/16
Filed: 2002-09-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide a power window drive controller capable of suppressing erroneous determination in relation to a rotation sensor when window glass is frozen and stuck.  <P>SOLUTION: The power window drive controller 100 comprises a motor 140, the rotation sensor 200 and a microcomputer 160 for controlling the motor 140 by an open command signal and a close command signal from an operation switch 120 by detecting the position of the window glass on the basis of a rotation signal outputted from the sensor 200. The microcomputer 160 makes the determination of an abnormality of the sensor 200 according to whether the rotation signal is outputted or not. When an output of the rotation signal becomes nil after the rotation signal is outputted while the first open command signal is inputted after an IG switch is switched from an off state to an on state, or while the first open command signal is inputted after the close command signal is inputted from the switch 120, the determination of the abnormality of the sensor 200 is invalidated.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004094842-A (JP)
Title: Support method and its system
Inventor: MATSUMOTO RYOSUKE
IPC: G06F13/00
Filed: 2002-09-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a support method and its system allowing a viewer viewing a homepage of a homepage manager to easily support the homepage manager.  <P>SOLUTION: The support method allowing the viewer viewing the homepage to support the homepage manager of the predetermined homepage using a computer system comprises a first step of setting up a predetermined column in the homepage of the homepage manager, a second step of selecting the predetermined column set up in the first stage, and a third step of transmitting an e-mail of a predetermined article name to the homepage manager when the predetermined column is selected in the second step.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004098329-A (JP)
Title: Print head
Inventor: HASEGAWA TOMOAKI
IPC: B41J2/455
Filed: 2002-09-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide a print head in which high strength of a housing is realized.  <P>SOLUTION: In the print head 16 where an array of light emitting elements 40 and an optical component 44 for irradiating a photosensitive body with a line beam formed by condensing light emitted from the light emitting elements 40 are provided in a housing 50 made by bending a sheet of plate material and supported, at the opposite end parts thereof, by a frame 38, the housing 50 comprises a holding part 54 being fixed with the light emitting elements 40, a fixing part 53 extending from the holding part 54 to the frame 38 side and being supported by the frame 38, and a standing plate part 56 extending from the holding part 54 to the side opposite the frame 38 side and being fixed with the optical component 44 wherein the height H is set such that the direction of primary vibration of the housing 50 is perpendicular to the direction of the depth of focus of the optical component 44.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004101002-A (JP)
Title: Water heater
Inventor: SETOGUCHI TAKAYUKI
IPC: F24H1/00
Filed: 2002-09-06
Abstract: <P>PROBLEM TO BE SOLVED: To improve COP of a heat pump while improving heating capacity of the heat pump in a water heater having the heat pump.  <P>SOLUTION: A heat pump water heater 1 has an heat accumulator 7, first and second heat accumulating circuits 9 and 11 and a hot water supply circuit 13. The heat accumulator 7 has first and second heat accumulating units 37 and 39. The first heat accumulating unit 37 is filled with a first heat accumulating material being a high melting point heat accumulating material, and is provided with a first heat accumulating heat transfer pipe 41a and a first hot water appearing heat transfer pipe 43. The second heat accumulating unit 39 is filled with a second heat accumulating material being a low melting point heat accumulating material, and is provided with a first heat accumulating heat transfer pipe 41b, a second heat accumulating heat transfer pipe 47 and a second hot water appearing heat transfer pipe 49. The second heat accumulating circuit 11 is provided with a heat exchanger 51 for exchanging heat between a second refrigerant flowing out of the second heat accumulating heat transfer pipe 47 and tap water before flowing in the second hot water appearing heat transfer pipe 49.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2003133406-A (JP)
Title: Wafer cushion used for transporting wafer
Inventor: NYSETH DAVID L
IPC: B65D85/86
Filed: 2002-09-06
Abstract: PROBLEM TO BE SOLVED: To provide a device for safely storing and transporting semiconductor wafers. SOLUTION: A device for storing and transporting a semiconductor wafer W is equipped with a carrier 16 whose top and bottom are open, and a top cover 17 and a bottom cover 18 which are flexible and used for covering the open top and bottom of the carrier 16, respectively. A wafer engaging member is provided to the top cover 17 and the bottom cover 18, respectively, and the wafer W is supported as suspended between the wafer engaging members.
Patent JP-2004104364-A (JP)
Title: Beam forming method for reception array antenna
Inventor: KIN EIKO
IPC: H04B7/10
Filed: 2002-09-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a beam forming method for a reception array antenna capable of suppressing strong interference and applicable even to a communication system employing a stratosphere platform, a satellite communication system, or a ground mobile communication system or the like.  <P>SOLUTION: The beam forming method of the reception array antenna generates a data sequence orthogonal to a reference data sequence included in a desired communication signal received by an array antenna, obtains a weight coefficient with respect to each fixed beam of the array antenna, obtains a ratio of the weight coefficient calculated from an orthogonal data sequence with respect to the weight coefficient calculated from a copy of the reference data sequence included in the desired communication signal, and obtains a cross product between each fixed beam output and the weight coefficient calculated from the copy of the reference data sequence included in the desired communication signal on the basis of the ratio. Further, a complex weight of the desired communication signal is set to zero when the ratio of the complex weights is equal to or greater than a threshold value, and the length of the reference data sequence is adjusted depending on the performance required for interference suppression.  <P>COPYRIGHT: (C)2004,JPO