baber/WOPTO huggingface dataset:
Patent TW-415116-B (TW)
Title: Light-emitting diode (LED) capable of brightening illumination and the method of fabrication
Inventor: JUANG FENG-RU
IPC: H01L33/00
Filed: 1999-07-02
Granted: 2000-12-11
Abstract: The invention relates to a LED capable of brightening illumination and fabrication method therefor, particularly applicable to the direct-bandgap III-V compound LED with GaAs substrate. It primarily utilizes the chip mounting technique and chemical etching or mechanical polishing to remove the GaAs substrate after completing the mounting of the LED epilayer on a conducting substrate. The conducting substrate can replace the function of the GaAs substrate. Hence, when the four sides of the p-n junction of LED emit light, the light source incident to the conducting substrate can be further propagated to the other areas of the epilayer of the LED to penetrate them through the reflection of the bonding reflection layer. Thereby the emitting light intensity absorbed by the GaAs substrate of LED can be lowered and the illumination of light source emitted by LED is significantly enhanced.
Patent TW-410417-B (TW)
Title: Formation of buried electrode in deep trench
Inventor: WEI HUNG-JI
IPC: H01L21/70
Filed: 1999-07-13
Granted: 2000-11-01
Abstract: This invention relates to a method of fabricating a buried electrode in a deep trench. First, a pad oxide layer, a silicon nitride layer and a PSG layer are successively deposited on a substrate. A portion of the PSG, the silicon nitride layer and the pad oxide layer are removed by the first photo mask layer, and the substrate is over etched to the first depth. The first photo-resist layer on the PSG layer is removed, and then using the PSG layer as a hard mask, the trench is etched to the second depth. The PSG layer on the silicon nitride layer is removed. An amorphous silicon layer is deposited on the silicon nitride layer and within the trench, and the second photo-resist layer is coated on the amorphous silicon layer. A bottom electrode is then defined by removing a portion of the second photo-resist layer, etching the amorphous silicon layer on the silicon nitride layer and a portion of the trench, and removing the remained second photo-resist layer. The third depth is formed between the pad oxide layer and the bottom electrode is formed. After removing the second photo-resist layer, a further step is to deposit a HSG layer on the amorphous silicon layer as the bottom electrode. A silicon nitride-silicon oxide (NO) layer and an amorphous silicon layer are formed on the silicon nitride layer and within the trench. By removing a portion of the amorphous layer upon the NO layer to form the top electrode. The forth depth is formed between the pad oxide layer and the top electrode. The NO layer on the silicon nitride layer and within the trench is etched and a collar oxide layer is formed.
Patent TW-541420-B (TW)
Title: Horizontal electroelution apparatus
Inventor: LI SHUEI-YUAN
IPC: G01N27/447
Filed: 1999-07-30
Granted: 2003-07-11
Abstract: The invention relates to an electroelution apparatus. The electroelution apparatus is used in a tank having a positive electrode and a negative electrode. The tank receivers buffer solution. The electroelution apparatus comprises a first groove, a second groove and a leakage prohibiting portion. The first groove has an open end and receives an agarose gel with DNA. The second groove connects to the first grove and receives the buffer solution. The leakage prohibiting portion connects to the second groove and is used to prohibit the buffer solution in the second groove from leaking out. The power supply is applied to the positive electrode and the negative electrode, then DNA can be separated from the agarose gel to the buffer solution in the second groove. Using the electroelution apparatus of the invention, will make the method for separating DNA easier to apply. The density of DNA is higher, the loss of DNA is low, and the yield is high. The reaction time of the invention is faster and the effectiveness for separating DNA can be improved.
Patent TW-548470-B (TW)
Title: Substrate for electro-optical device, electro-optical device, electronic machine, and projection type display device
Inventor: NAKAMURA JUNICHI
IPC: G09G3/36
Filed: 1999-08-03
Granted: 2003-08-21
Abstract: The substrate for the invented electro-optical device is provided with the followings: the signal electrode; the first sampling and holding circuit, which is electrically conducted with the signal electrode; the second sampling and holding circuit, which is electrically conducted with the signal electrode; the pixel driving circuit; and the pixel electrode, which is electrically conducted with the pixel electrode. In the case that the signal of the (N+1)th image is applied to the signal electrode, the pixel driving circuit supplies a voltage of the first assigned period to the pixel electrode according to the N th image signal stored in the first sampling and holding circuit; and the signal of the (N+1)th image is stored by the second sampling and holding circuit within the first assigned period. In the case that the signal of the (N+2)th image is applied to the signal electrode, the pixel driving circuit supplies a voltage of the second assigned period to the pixel electrode according to the (N+1)th image signal stored in the second sampling and holding circuit; and the signal of the (N+2)th image is stored by the first sampling and holding circuit within the second assigned period, in which N is a natural number.
Patent TW-431076-B (TW)
Title: Method and system for detecting loss of signal in wavelength division multiplexed systems
Inventor: ANTONIADES NEOPHYTOS
IPC: H04B10/275
Filed: 1999-08-26
Granted: 2001-04-21
Abstract: A method and system for unambiguously detecting fiber cuts in an optical network regardless of the number of EDFAs that are located between the fiber cut and the monitor point. In accordance with our invention, the power of a marker wavelength is compared to the power of a nearby spectral region. Where the comparison indicates that the power ratio is approximately equal to unity a flag is raised indicating that there is fiber cut. Where the comparison indicates that the power ratio is much greater than unity the flag is not raised. The monitoring point includes circuitry for detecting the ratio between the marker wavelength and the nearby spectral band and for indicating when there is a fiber cut.
Patent TW-425602-B (TW)
Title: Method for monitoring the alignment of overlay layers in exposure machine
Inventor: JENG KUEN-BI
IPC: H01L21/027
Filed: 1999-09-06
Granted: 2001-03-11
Abstract: A method for monitoring the alignment of overlay in exposure machine is suitable for a wafer, which comprises the steps of: forming a photoresist on the surface of the wafer; providing a mask having a larger frame pattern and a smaller box pattern; performing a first exposure to the photoresist, wherein the amount of exposure is approximately between the critical value required for developing the photoresist and half of the critical value; horizontally moving the mask to shift the box mask to the original position of the frame mask, so as to performing the alignment of overlay; performing a second exposure to the photoresist, wherein the amount of exposure is approximately between the critical value required for developing the photoresist and half of the critical value; developing the photoresist to transfer the frame pattern and the box pattern to the surface of the photoresist thereby forming a overlay pattern, wherein the repeated exposed portion is removed by developing, and symmetrical openings are formed between the inner side of a position corresponding to the frame pattern and the outer side of a position corresponding to the box pattern; measuring the dimensions of the symmetrical openings and determining the differences, so as to monitor the stability of the alignment of overlay in an exposure machine.
Patent TW-425363-B (TW)
Title: Method and apparatus for bundling layered material
Inventor: GOLIGHTLY RALPH WAYNE
IPC: B29D30/48
Filed: 1999-11-10
Granted: 2001-03-11
Abstract: A method and apparatus for bundling layered material comprises an anvil for receiving multiple units of bundled material, and a plurality of blades for compressing a tying material onto the bundled material. An apparatus of the invention is illustrated for use in a specific method of simultaneously stapling the end wire of a plurality of tire beads.
Patent TW-494549-B (TW)
Title: Semiconductor package having plural chips
Inventor: LUO SHIAU-YU
IPC: H01L23/12
Filed: 1999-12-13
Granted: 2002-07-11
Abstract: A semiconductor package having plural chips is disclosed, wherein a core layer having upper and lower surfaces are bonded with an upper layer comprising the first conductive trace and the lower layer comprising the second conductive trace to form a substrate, so that the upper layer has the first chip bonding region for the first chip to be bonded on it, and a second chip disposition nest is formed on the lower layer to be connected to the lower surface of the core layer, so that the second chip can be directly bonded onto the lower surface of the core layer and is received in the second chip disposition nest; the first chip and the second chip are connected to the first conductive trace and the second conductive trace respectively, and the first chip and the second chip are wrapped by the first encapsulant and the second encapsulant respectively; plural solder balls are implanted on the second conductive trace. Dispose the first chip and the second chip on the upper and lower side of the substrate, so that the flexibility of circuit routing is raised to increase the circuit density, and the electronic performance is promoted to reduce the generation of electronic noise or crosstalk interference. Furthermore, since the second chip is received in the second chip disposition nest, the overall height of the semiconductor package will not increase due to the chips bonding on the upper and lower sides of the substrate.
Patent TW-514763-B (TW)
Title: High desity optical recording disc
Inventor: HUANG DE-RUEI
IPC: G11B7/24
Filed: 2000-02-09
Granted: 2002-12-21
Abstract: The high destiny optical disc of this invention comprises a substrate, a dye layer, a reflective layer and adhesive layer. The substrate has a spiral groove which groove depth is about 150 nm to 250 nm, groove width about 150 nm to 300 nm, land width about 200 nm to 300 nm. The dye layer is mixed by cyanine (Ia) and cyanine (Ib). A cyanine dye (I) for using in high destiny optical disc recording medium, having the following structure: wherein R= formala X<SP>-</SP>=anion.
Patent TW-591119-B (TW)
Title: Oxidative etchant solution for copper and copper alloys
Inventor: SCHEMENAUR JOHN
IPC: H05K3/46
Filed: 2000-03-10
Granted: 2004-06-11
Abstract: Metal surfaces, particularly copper surfaces, which are oxidatively micro-etched to increase surface area, are provided acid-resistance by exposure to a thiazole compound and/or a thiocarbamide compound. The thiazole compound and/or thiocarbamide compound may be provided either in the oxidative micro-etching solution or provided in a post-micro-etching solution.
Patent TW-473639-B (TW)
Title: Liquid crystal display apparatus
Inventor: ISHIHARA SHINGO
IPC: H01L51/05
Filed: 2000-03-01
Granted: 2002-01-21
Abstract: The present invention relates to liquid crystal display apparatus, particularly, to active matrix liquid crystal display apparatus or IC (integrated circuit) cards. A thin film transistor is provided wherein the semiconductor channel region is patterned. Gate electrodes (102), gate insulating film (103), source electrodes (104), and drain electrodes (105) are formed on a glass substrate (101). A patterned insulating film is formed thereon, and a part of the film in the region (110) on the gate electrode is removed. An organic semiconductor film is formed thereon by vapor deposition. The organic semiconductor film (107) in the region (110), where the patterned insulating film is removed, becomes a channel region, and is separated from the organic semiconductor film (108) on the patterned insulating film (106). Therefore, the organic semiconductor channel region is patterned to have the same size as the gate electrode. In accordance with the present invention, a thin film transistor, wherein the semiconductor channel region is patterned, becomes available.
Patent TW-449947-B (TW)
Title: Connection structure of flexible circuit board
Inventor: KAJINUMA SHUJI
IPC: H01R13/621
Filed: 2000-03-13
Granted: 2001-08-11
Abstract: The present invention provides a connection structure of flexible circuit board that realizes the mutual connection of a flexible circuit board having a grounding face with the other circuit board and has high connection reliability as well as comparatively simple constitution. For the connection structure of flexible circuit board stated above, a conductive supporting board 150, which is fixed to a fitting end part 130 and is connected with the grounding face of the flexible circuit board 190, is installed at the fitting end part 130 of a flexible circuit board 190. The flexible circuit board 190 is accepted by the conductive supporting board 150 and the board-mounted connector 20 of an opposite side to the conductive supporting board 150, and is fixed to the board-mounted connector 20 by a screw means 105. By using the screw means 105, the conductive supporting board 150 is pressed to a grounding means 70, which is installed at the board-mounted connector 20.
Patent TW-I228527-B (TW)
Title: Fire-resistant polycarbonate resin composition
Inventor: IJI MASATOSHI
IPC: C08L83/04
Filed: 2000-04-20
Granted: 2005-03-01
Abstract: This invention is a flame resistant polycarbonate resin composition characterized by blending 0.01-2 weight parts of a silicone compound (B) wherein a main chain has a branch structure and having an aromatic group in an organic substituent, 0.01-2 weight parts of an alkali metal salt of an aromatic sulfonic acid (C) represented by the following general formula 1 (hereafter, referred to as general formula 1), and 0.05-5 weight parts of a fiber-forming fluorine-containing polymer (D), relative to 100 parts of a polycarbonate resin (A): general formula 1: Am-R-(SO3M)n (wherein, R is a phenyl group, naphthyl group, or a phenyl group or naphthyl group substituted by A, where A is at least one type of substituent chosen from a group comprising a halogen atom, alkyl group, aryl group,, vinyl group, alkoxy group, ammo group, methyl ester group and ethyl ester group, and M is an alkali metal. Also, when R is phenyl, m and n are respectively the integers 0-5 and 1-2 (m+n <= 6), and when R is naphthyl, m and n are respectively the integers 0-7 and 1-2 (m+n <= 8)). The polycarbonate resin composition of this invention possesses superior flame resistance without losing shock resistance and moldability, and as it does not contain halogen fire retardants manufactured from chlorine and bromine compounds, there is no concern about generation of gases containing halogen from the fire retardant during combustion.
Patent TW-440505-B (TW)
Title: Method for producing plate material
Inventor: JUANG SHENG-CHIUAN
IPC: B27N3/00
Filed: 2000-05-11
Granted: 2001-06-16
Abstract: The present invention relates to a method for producing a plate material, which comprises mounting a preformed wood crumb into an upper mold and a lower mold; performing a first stage thermoforming with a gap between the periphery of the upper and lower molds where a portion of the wood crumb is squeezed out from the gap to form a wrapping layer and wrap around the periphery of the upper mold; opening the mold while the synthesized layer formed by the compressed wood crumb is adhered on the upper mold; mounting a wrapped plate on the lower mold; performing a second thermoforming to form a wrapped plate on the bottom of the synthetic layer so that the upper and lower molds are tightly sealed and cutting off the wrapping layer; opening the mold while the synthetic layer stays in the lower mold; mounting a wrapped plate on the upper mold to perform a thermoforming, thereby achieving a rapid and accurate way of producing a plate according to the present invention.
Patent TW-464896-B (TW)
Title: Method of manufacturing a field emitting display
Inventor: JENG HUANG-JUNG
IPC: H01L21/00
Filed: 2000-08-03
Granted: 2001-11-21
Abstract: The present invention relates to a method of manufacturing a field emitting display, especially to a method of manufacturing a field emitting display constituted mainly by a carbon nanotube. Such method can cooperate with different manners of manipulation such as two-electrode field emitting array and three-electrode field emitting array to produce a field emitting display and provide stable control for the process of producing a carbon nanotube field emitting array by using thin film transistor technique. It is also possible to provide a method capable of producing a carbon nanotube with collimating feature.
Patent TW-555784-B (TW)
Title: Polyoxytetramethylene glycol and process for producing the same
Inventor: KODAMA TAMOTSU
IPC: C08K3/24
Filed: 2000-08-19
Granted: 2003-10-01
Abstract: Disclosed is an improved high heat resistance and low viscosity polyoxytetramethylene glycol (PTMG) having the following characteristics (1) to (4): (1) a number average molecular weight from 500 to 3000; (2) a molecular weight distribution of 1.8 or less in terms of the Mw/Mn ratio; (3) 2 to 5% by weight of the PTMG molecules having a molecular weight of at least six times large that the number average molecular weight of all PTMG molecules; and (4) a heteropolyacid content from 10 to 900 ppb by weight.
Patent TW-493112-B (TW)
Title: Device for electrically connecting an electrical power source and an electronic circuit of a timepiece
Inventor: KRONER WOLFGANG
IPC: G04C10/00
Filed: 2000-08-31
Granted: 2002-07-01
Abstract: An electronic device is described, for a timepiece of electronic or electromechanical type, comprising a source of electrical power (4), such as a battery, an electronic circuit (3) and an electrical connector tongue (5) effecting an electrical connection between the source of electrical power and the electronic circuit. The electrical connector tongue (5) has first and second openings (55, 56) cooperating with a pair of fixing pins (25, 26) fixed to a support (2) of the said device, and further comprises a section (57) formed between the said openings (55, 56) and adapted to deform in an elastic manner so as to alter the spacing between the openings (55, 56) and allow engagement and retention of the electrical connector tongue (5) on the fixing pins (25, 26).
Patent TW-472282-B (TW)
Title: A device for analyzing injection flow and method for the same
Inventor: NAKAHIGASHI HISAKAZU
IPC: G01N35/08
Filed: 2000-11-15
Granted: 2002-01-11
Abstract: This invention relates to deletion of analysis discrepancy due to trial solution itself impurities, especially, to a device for analyzing injection flow and method for the same whose analysis operations are not complex but easy to calculate and deal with. The device for analyzing injection flow according to the invention comprises a first flow unit for making trial solution flow, a first physical value measurement apparatus for measuring physical value of the solution in the above mentioned first flow unit, a second flow unit for having the trial solution added with trial solution for inspection, and a second physical value measurement apparatus for measuring physical value of the solution in the above mentioned second flow unit.
Patent TW-492141-B (TW)
Title: Method of manufacturing semiconductor device
Inventor: MAEDA SHIGENOBU
IPC: H01L21/762
Filed: 2000-12-14
Granted: 2002-06-21
Abstract: Obtained is a method of manufacturing a semiconductor device which can take a body contact while electrically isolating an NMOS transistor and a PMOS transistor from each other through a complete isolation. First of all, element isolating films (7a to 7c) of a partial isolation type are formed in a first main surface of a silicon layer (3). Next, a PMOS transistor, an NMOS transistor, a multilayer wiring structure, a spiral inductor (20) and a pad (22) are formed, respectively. Then, a support substrate (23) is formed over the whole surface. Thereafter, a silicon substrate (1) and a BOX layer (2) are removed to expose a second main surface of the silicon layer (3). Subsequently, element isolating films (27a to 27d) connected to the element isolating films (7a and 7b) are formed on the second main surface side of the silicon layer (3). Consequently, a complete isolation can be obtained.
Patent TW-593692-B (TW)
Title: Fe-Ni alloy material used for shadow mask having improved formability of through-holes by etching
Inventor: HATANO TAKATSUGU
IPC: H01J29/07
Filed: 2001-01-03
Granted: 2004-06-21
Abstract: In the production of a shadow mask, the through-holes for passing an electron beam are formed by etching of the Fe-Ni alloy. The variation in diameter of apertures is prevented by dispersing 1500 or more of precipitates and inclusions from 50 nm to 1000 nm in diameter on the surface of said material per mm<2>. The Fe-Ni alloy of from 34 to 38% of Ni, from 0.2 to 0.5% of Mn, from 15 to 40 ppm of S, from 20 to 500 ppm of Cu., the balance being Fe and unavoidable and incidental impurities with the proviso of 0.10% or less of C, 0.30% or less of Si, 0.30% or less of Al, and 0.005% or less of P.
Patent TW-593891-B (TW)
Title: Hermetic compressor assembly
Inventor: CLENDENIN HARRY BURNS
IPC: F04B41/00
Filed: 2001-01-05
Granted: 2004-06-21
Abstract: A foot plate for mounting a compressor includes a mounting plate, a pair of upwardly extending flanges, a pair of downwardly extending flanges and an upwardly extending mounting flange. The mounting flange is utilized to secure a compressor by being attached to the shell of the compressor. When tandem compressor assemblies are used, the pair of upwardly extending flange provide clearance for a pair of rails which interconnect the tandem compressors without having to modify the foot plates. In one embodiment, the foot plates are welded or brazed to the rails. In another embodiment, a set of grommets position the foot plate on the rail and the foot plate is bolted to the rail. In another embodiment, a set of grommets position and secure the foot plate to the rail.
Patent TW-508891-B (TW)
Title: Stator iron core of electric motor, manufacturing method thereof, electric motor, and compresor
Inventor: MASUMOTO KOUJI
IPC: H02K1/16
Filed: 2001-02-13
Granted: 2002-11-01
Abstract: The present invention aims to provide a stator iron core of an electric motor which can eliminate the reduction of efficiency, vibration or noise of the electric motor by decreasing stress generated at a bottom portion of a slot on manufacturing or integrating the electric motor. Plural magnetic pole segments, each having a back yoke portion and a teeth portion projected from the back yoke portion, are connected so as to be bendable via a connection portion provided to the back yoke portion. After winding the coil wire, a stator iron core of the electric motor is circularly formed by bending the connection portion of the plural magnetic pole segments. In the stator iron core, the bottom portion of the slot constituted by the back yoke portion and the teeth portion is made to have a curved line after the stator iron core is circularly formed.
Patent TW-505544-B (TW)
Title: Device for spraying coating product and rotating spray element for such a device
Inventor: PRUS ERIC
IPC: B05B3/10
Filed: 2001-02-20
Granted: 2002-10-11
Abstract: This device comprises a rotating spray element, such as a bowl, and drive means, such as a rotor, adapted to drive said element in rotation. It further comprises means for magnetic coupling between the rotating element and the drive means. An air-gap is formed between the coupling means which advantageously include at least one magnet associated with a looping annulus. The magnet may be fitted on the rotor and/or on the bowl.