baber/WOPTO huggingface dataset:
Patent TW-327699-B (TW)
Title: The etching technology for trench with tilt and round corner
Inventor: CHEN JAU-CHERNG
IPC: H01L21/76
Filed: 1997-03-11
Granted: 1998-03-01
Abstract: An etching method for forming trench with tilt and round corner on silicon wafer. In which, the silicon wafer has semiconductor substrate, and formed oxide on substrate, and a nitride on oxide. The method includes: - Define the pattern of oxide and nitride; - Proceed 1st etching according to the pattern of oxide and nitride on substrate, in which, the 1st etching is operated under the 1st set of processing parameters; - Proceed 2nd etching on substrate, in which, the 2nd etching is operated under the 2nd set of processing parameters; And the RF parameter of 2nd set parameters is lower than that of the 1st set parameters, and the processing pressure parameter of 2nd set parameters is higher than that of 1st set parameters; - Proceed 3rd etching on substrate, in which, the 3rd etching is operated under 3rd set of processing parameters. The RF parameter of 3rd set parameters is lower than that of the 2nd set parameters; and the processing pressure parameter of 3rd set parameters is higher than that of the 2nd set parameters.
Patent TW-508240-B (TW)
Title: Process for improving the taste picture of solid formulations
Inventor: SCHWARZ EUGEN
IPC: A61K33/08
Filed: 1997-04-30
Granted: 2002-11-01
Abstract: The invention relates to a method of improving the flavour profile of solid formulations which comprise one or more active substances. Process for improving the taste picture of solid formulations that contain one or more active ingredients, characterized in that a composition that contains one or more active ingredients and that can be obtained by co-spray drying by at least one polyol or carbohydrate being dissolved in water and at least one active ingredient being dissolved or suspended in a solvent and the aqueous mixture that is obtained being atomized in a stream or air at a temperature of 120 to 300 DEG C, or that can be obtained by fluidized-bed granulation by at least one polyol or carbohydrate being dissolved in water and at least one active ingredient being dissolved or suspended in a solvent and the aqueous mixture that is obtained being swirled in a stream or air at a temperature of 40 to 120 DEG C, is prepared in a solid dosage form by means of compressing.
Patent TW-328930-B (TW)
Title: Portable apparatus for using bicycles as a type of watercraft
Inventor: ROBERTO SIVIERO
IPC: B63B35/73
Filed: 1997-05-28
Granted: 1998-04-01
Abstract: A portable apparatus for using bicycles as a type of water craft in addition to using them as a type of land craft comprising two oblong inflatable floats (12,14) with a size sufficient for maintaining a bicycle (16), the apparatus per se and the rider afloat, means for rapidly securing the bicycle (16) to the floats laid parallel and means for connecting, by a flexible shaft (124), a clutch unit (20), placed in contact with the rear wheel (18) of the bicycle, with a propulsion unit (22) and propeller (134), fixed by means of a rotation joint to the front wheel (19) of the bicycle, it being thus possible, by rotating the rear wheel of the bicycle using the ordinary pedals (27) and handle bar (28) to determine both forward movement and change of direction of the watercraft so created.
Patent TW-331543-B (TW)
Title: Folded information leaflet
Inventor: HERBERT QUICK
IPC: G09B29/04
Filed: 1997-06-30
Granted: 1998-05-11
Abstract: A folded information or advertisement leaflet comprises rectangular areas formed by longitudinal and lateral folding tracks of which at least two rectangular areas are able to form covers at the outer part when the information or advertisement leaflet is folded. It is characterized in that additional stiffening parts are set to the long and/or short edges of the outer part covers when the leaflet is folded . The stiffening parts are a part of the single basic sheet and are to be folded on and combined to the outer part covers.
Patent TW-446692-B (TW)
Title: Ceramic joint body and process for manufacturing the same
Inventor: KATO SHIGEKI
IPC: C04B37/00
Filed: 1997-07-30
Granted: 2001-07-21
Abstract: A joint body containing a ceramic member composed of a main body and a disclike projection projected therefrom and a ceramic cylindrical body. The disclike projection is inserted inside the cylindrical body, and a relative density of the disclike projection is higher than that of the cylindrical body. The cylindrical body is composed of a straight portion not contacted with the projection and having a uniform inside diameter, a diameter-expanded portion in contact with the projection and having the largest inner diameter, and a tapered connecting portion bridging the straight portion and diameter-expanded portion. A difference between the inner diameter of the straight portion and that of the diameter-expanded portion is 0.05 mm to 0.6 mm.
Patent TW-356510-B (TW)
Title: Cold air circulation cooling device
Inventor: SHIBATA KOSUKE
IPC: F25D17/02
Filed: 1997-12-09
Granted: 1999-04-21
Abstract: A kind of coolant circulation cooling device, it is suitable for using in freezer, frozen grocery placing box that are cooled by the circulation of air, the said freezer, frozen grocery placing box have a compartment for grocery storage and a coolant pipe, the said coolant circulation cooling device comprises: a coolant circulation system, in which salt water circulates; a coolant pipe, to connect through the said coolant circulation system, that can blow the circulated air that has been exchanged with salt water heat inside the coolant pipe toward the grocery storage zone; and a suction inlet, to connect through the coolant pipe, to suck in the circulated air from the grocery storage zone, then to guide it to the said coolant pipe; its comprises is: inside the coolant pipe toward the cooled salt water discharged from the coolant circulated ventilation, to enable the direct exchange between the salt water and the circulation ventilation.
Patent TW-356602-B (TW)
Title: Application-specific integrated semiconductor product with dummy-elements as well as logic element and method to the design of application-specific integrated semiconductor basically no change of design is necessary for processing of memory unit for semiconductor product
Inventor: LUDWIG CHRISTOPH
IPC: H01L27/06
Filed: 1997-12-23
Granted: 1999-04-21
Abstract: A kind of application-specific integrated semiconductor product (1), it characterized in: is at least designated with memory unit (31, 3b, 3c, 3d) and dummy elements (14), wherein memory unit contains many memory cells (11), memory cells are separately having at least one memory capacitor (12).
Patent TW-533331-B (TW)
Title: Method of developing a photoresist pattern and a developing apparatus
Inventor: TANAKA YASUHARU
IPC: G01N27/06
Filed: 1998-04-16
Granted: 2003-05-21
Abstract: To provide a method of developing a photoresist pattern by a photoresist agent which will not worsen the developing accuracy and controllability of the developed image, and will improve the utilization efficiency of the developing liquid. A method of developing photoresist films formed on a plurality of substrates utilizes a circulated developing fluid to sequentially develop the photoresist films. It has the following characteristics: measuring the conductivity and the absorbance of the developing fluid during performing each developing, calculating the pH value from the measured value; and maintaining the pH value in a predetermined range.
Patent TW-419797-B (TW)
Title: Substrate used for carrying semiconductor device, the fabrication method and the semiconductor apparatus
Inventor: FUKUTOMI NAOKI
IPC: H01L23/24
Filed: 1998-04-30
Granted: 2001-01-21
Abstract: This invention discloses a semiconductor apparatus with a recessed portion used for carrying semiconductor device, in which the semiconductor apparatus is highly reliable, able to be miniaturized and produced with less cost. The copper wire (12) used for forming the disposed wire, the shielding layer (11) of nickel alloy and the copper foil (10) used as a carrying layer are undergone with the pulling process to form the disposed wire body, which is connected with the resin substrate (14, 15) at the same time. The extruded portion (13a) of a compressing mold is used to press and form the disposed wire (2) that is embedded into the surface of the substrate. A series of steps with height difference is installed in between the inner connection terminal portion and the external connection terminal portion that is connected with the external connection terminal (5), in which the inner connection terminal portion is connected with semiconductor device (1) on two end portions of the constituted disposed wire (2). Therefore, the recessed portion can be formed at the center portion of this substrate to receive semiconductor device (1).
Patent TW-384438-B (TW)
Title: Control apparatus and control method
Inventor: KAZUYUKI ASANO
IPC: H01L21/677
Filed: 1998-05-04
Granted: 2000-03-11
Abstract: A control apparatus comprises a plurality of process units operating in accordance with parameters, a storing section for storing parameters relevant to processings by the process units, a touch screen for setting predetermined parameters for the process units, and a parameter administration section. The parameter administration section sends corresponding one of the stored parameters to one of the process units in reply to a request issued thereby, transfers the set parameter to the process unit, and rewrites the parameters stored in the storing section to the parameters set by the setting section.
Patent TW-419533-B (TW)
Title: Ion exchange membrane bipolar electrolyzer
Inventor: IACOPETTI LUCIANO
IPC: C25B15/08
Filed: 1998-06-03
Granted: 2001-01-21
Abstract: The present invention discloses a new design of elements for ion exchange membrane electrolyzers for the electrolysis of brine to produce chlorine, hydrogen and caustic soda. This new design solves the problems affecting prior art, by both minimizing the electrolyte concentration and temperature gradients, and the pressure fluctuation resorting to components which are easy to be installed and may be obtained through automated production cycles.
Patent TW-424312-B (TW)
Title: Module for IC cards, method for making a module for IC cards, hybrid integrated circuit module and method for making same
Inventor: SAKAMOTO NORIAKI
IPC: G06K19/077
Filed: 1998-09-11
Granted: 2001-03-01
Abstract: The objective of the present invention is to improve high pressure resistant characteristics and moisture resistance by making an insulating substrate for IC card integrally molded with a first supporting member and a thermoplastic resin, to be injected thereby covering the back face of the substrate. A first supporting member 1 is preliminarily molded, and a hybrid integrated circuit substrate 2 is placed thereon, and the first supporting member 1 on which the hybrid integrated circuit substrate 2 is placed is arranged in a mold, and molded with thermoplastic resin 3 again. The injected high- temperature thermoplastic resin 3 comes into contact with the first supporting member 1, and the surface of the contact part is melted. Therefore, full mold covering the back face of the substrate can be attained. Also, epoxy potting is applied to the leading part of a semiconductor chip and a coil.
Patent TW-443998-B (TW)
Title: A continuous process for the preparation of aromatic amines
Inventor: BECKHAUS HEIKO
IPC: C07C209/36
Filed: 1998-09-25
Granted: 2001-07-01
Abstract: A continuous process for the preparation of aromatic di- and/or polyamines by catalytic hydrogenation of the corresponding aromatic di- and/or polynitro compounds with hydrogen, characterised in that, in a reactor with a catalytic fixed bed or trickle bed at a pressure between 5 and 100 bar and a reaction temperature from 100 to 220 DEG C, (a) the aromatic di- and/or polynitro compounds, optionally in the presence of a solvent, are introduced into a product stream comprising essentially recycled hydrogenated product, water and hydrogen, and (b) a part of the product stream is removed continuously from the reactor system.
Patent TW-494362-B (TW)
Title: System of program objects and program components with external interface
Inventor: HOSTYN TOM FRANS MAURITS
IPC: G06F9/445
Filed: 1998-10-17
Granted: 2002-07-11
Abstract: The present invention relates to a system of program objects and program components and communication between program objects and program components. The present invention provides a program component with an external or send interface which enables message passing communication between a program component and different program objects. When a program component is loaded, the send interface of the program component is automatically exported to the send interface of the host object. This means that the send interface of the object is modified to contain the send interface of the program component. Therefore it is possible to communicate by message passing between program components of a program object and other program objects.
Patent TW-374837-B (TW)
Title: A quick-coupling device for coupling a tube to a rigid element, the device having an anti-extraction ring and an integrity indicator
Inventor: CAMBOT-COURRAU YVES
IPC: F16L37/091
Filed: 1998-12-08
Granted: 1999-11-21
Abstract: The invention relates to a quick-coupling device for coupling a tube to a rigid element (50) having a bore, the device comprising a tubular insert (1) having means (7) enabling it to be anchored in the bore of the rigid element (50), declutchable tube retaining means (11), and a slide (13) mounted to move in translation in the tubular insert (1) to declutch the retaining means (11) when it is pushed into the tubular insert (1). The declutching slide (13) posses a rear portion which projects outside the tubular insert (1) and which presents a shoulder surface (23) situated facing an end surface (24) of the tubular insert (1) and co-operating with said end surface to define a groove in which a removable intermediate ring (25) is received to oppose pushing in of the declutching slide (13).
Patent TW-450842-B (TW)
Title: Process for the recovery of medicinal substances from preparations, their initial products or waste
Inventor: WOLF HANS-WERNER
IPC: B09B3/00
Filed: 1998-12-31
Granted: 2001-08-21
Abstract: In a process for recovering medicinal substances or active substances from preparations, their initial products or waste, especially in the form of flat-shaped starting material, containing adhesively equipped film and active substance-containing material, the starting material is provided in area sizes of preferably between 5 and 50 cm<SP>2</SP>; starting material with basic active substance is placed into an aqueous extraction liquor with a pH range of between 7 and 1, and starting material with acidic active substance is placed into an aqueous extraction liquor with a pH range of between 7 and 13; the extraction liquor is then allowed to take effect until the carrier sheet is detached from the laminate or the active substance is detached from the carrier sheet under formation of an active substance-containing solution; and the extracted material substance or active substance is isolated from the active substance-containing solution by means of precipitation.
Patent TW-425685-B (TW)
Title: A vertical connector based packaging solution for integrated circuits
Inventor: HOLMAN THOMAS J
IPC: H05K7/02
Filed: 1999-01-04
Granted: 2001-03-11
Abstract: An assembly featuring a substrate and a plurality of components. The plurality of components are packaged to be connected in a vertical orientation to the substrate. These components include (i) a vertical chip-scale package (CSP), (ii) an integrated circuit die and (iii) an interconnect. Including a plurality of connection leads, the vertical CSP contains the die which is generally situated along a vertical plane. The interconnect, capable of transferring information between the plurality of connection leads and the integrated circuit die, includes a first segment generally perpendicular to the vertical plane and connected to at least one connection lead. The interconnect further includes a second segment generally in parallel to the vertical plane and connected to the integrated circuit die.
Patent TW-415037-B (TW)
Title: Fused semiconductor device
Inventor: IDO YASUHIRO
IPC: H01L27/10
Filed: 1999-02-01
Granted: 2000-12-11
Abstract: The semiconductor device has an insulating layer (13) made of BPSG formed over a semiconductor substrate (11) having a silicon oxide layer (12) thereon. The insulating layer (13) separates from a metal fuse (15a) by a silicon oxide layer (14) which does not contain phosphor, with a similar silicon oxide layer (16) overlying the fuse (15a).
Patent TW-411412-B (TW)
Title: Memory access control device and its operation
Inventor: CHEN JIA-SHIN
IPC: G06F12/08
Filed: 1999-03-02
Granted: 2000-11-11
Abstract: A memory access control device and its operation are described for a central process unit (CPU) to control the memory access. This device contains a CPU interface circuit and a memory control circuit. When the CPU interface circuit receives the fetch request sent by CPU, it immediately sends the corresponding internal fetch request to the memory control circuit, which sends control command to the memory to fetch the data. The fetch process is interrupted if a store or write command is received. This invention thus reduces the delay time during successive fetches.
Patent TW-447158-B (TW)
Title: Contact retention system
Inventor: TARABOULOS MARK
IPC: H01M2/10
Filed: 1999-08-20
Granted: 2001-07-21
Abstract: A contact retention system for a housing for a battery cell is described which comprises a springy L-shaped retention member, a battery housing with a wall and a floor, with a catchment on both the wall and the floor, and contacts disposed between the base of the L-shaped retention member and the floor of the housing. The vertex of the L-shaped retention member is pushed toward the corner of the wall and the floor of the housing, and the ends of the L are restrained by the catchments. Any force exerted on the upper portion of the L-shaped retention member, pushing the upper portion toward the wall, causes the base of the L-shaped retention member to push the contacts toward the floor of the housing. The battery cells themselves provide the force on the upper portion of the L-shaped retention member. The contact system provides low-cost, easily manufacturable way to secure push-in contacts to a battery housing.
Patent TW-448541-B (TW)
Title: Method of manufacturing an electron tunnel oxide (ETOX)
Inventor: YANG YU-HAO
IPC: H01L29/423
Filed: 1999-03-30
Granted: 2001-08-01
Abstract: A method of manufacturing an electron tunnel oxide (ETOX) flash memory device having an improved coupling efficiency includes sequentially forming a tunnel oxide, a floating gate, a dielectric layer, and a control gate on a substrate, where the tunnel oxide and the bottom of the floating gate are formed to be narrower than the top of the floating gate, the dielectric and the control gate.
Patent TW-394810-B (TW)
Title: Pipe for opening tape hole
Inventor: YATAYA YOSHIKAZU
IPC: E21C37/26
Filed: 1999-06-09
Granted: 2000-06-21
Abstract: This is a pipe for hole cutting in milling opening, which allows drills to be strongly inserted and fixed. A round steel pipe is 30-50 mm in the outside diameter, and less than 10 mm in thickness, with male screw thread on one end in specified length. It is better to weld a drill in the front end of the pipe body.
Patent TW-439227-B (TW)
Title: Method for fabricating CMOS device
Inventor: LEE JONG-WOOK
IPC: H01L21/84
Filed: 1999-06-25
Granted: 2001-06-07
Abstract: Disclosed is a method for fabricating CMOS device using a SOI substrate, and more particularly the method for fabricating CMOS device capable of improving mobility of electron and hole. The present invention provides a method for fabricating CMOS device comprising the steps of: providing an SOI substrate having a stacking structure of a base layer, a buried oxide layer and a semiconductor layer, wherein the SOI substrate is divided into a first region where a PMOS is formed later and a second region where an NMOS is formed later; forming first field oxide films to be contacted with the buried oxide layer by applying a thermal oxidation to a selected portion of the semiconductor layer being disposed in the first region of the SOI substrate; forming trenches with a depth to be contacted with the buried oxide layer in a selected portion of the semiconductor layer being disposed in the second region of the SOI substrate and then forming second field oxide films by filling the trenches with an insulting layer; and forming the PMOS in the portion of the semiconductor layer being defined by those first field oxide films, and the NMOS in the portion of the semiconductor layer being defined by those second oxide films.
Patent TW-444224-B (TW)
Title: Electron gun and display device provided with an electron gun
Inventor: AARNINK WILHELMUS ALBERTUS MAR
IPC: H01J29/48
Filed: 1999-08-31
Granted: 2001-07-01
Abstract: It is possible to reduce the stray emission in an electron gun comprising a main lens system with one or more intermediate electrodes (42, 43, 44), between the focus electrode (41) and the anode electrode (45). If at least one of the apertures of the main lens system following the focus electrode has apertures which are smaller than those of the focus electrode, a reduction of stray emission is realized. The optimal stray emission situation can be found by designing all the apertures of the main lens system. In order to manufacture an electron gun according to the invention, it is advantageous to have an outside reference system for gun mounting, because it will no longer be possible to center the electrodes on pins through the apertures.
Patent TW-570809-B (TW)
Title: External application composition
Inventor: ABE KOJI
IPC: A61K8/81
Filed: 1999-08-31
Granted: 2004-01-11
Abstract: An external application composition comprising: (A) at least one carboxyvinyl polymer selected from the group consisting of carboxyvinyl polymers and alkyl-modified carboxyvinyl polymers; and (B) gellan gum.
Patent TW-429489-B (TW)
Title: Wire structure and wire bonding method of stacked chip
Inventor: TSAI YU-FANG
IPC: H01L21/60
Filed: 1999-08-31
Granted: 2001-04-11
Abstract: The present invention relates to a wire structure of stacked chip. The stacked chip includes a substrate, a lower chip and an upper chip. The wire of the upper chip has two bends formed at positions around the second solder pad to enforce the over-lengthened structure of the wire and move away the wire of the lower chip. The wire bonding method of the upper chip in the present stacked chip primarily uses a capillary opening to weld an end of the wire to the first solder pad, and extend the wire upward for a first distance. The capillary opening further bends the wire toward a direction away from the second solder pad to form a first bend. The capillary opening further extends the wire upward for a second distance. The capillary opening further downwardly bends the wire toward an inclined direction under the second solder pad to form a second bend. The capillary opening extends the wire upward and further extends the wire toward a direction away from the second solder pad to form a third distance. The capillary opening further extends the wire upward to form a third bend and properly extends the wire to form a fourth distance. Furthermore, the end of the wire is pulled toward an inclined direction above the second solder pad, so that the distance between the two ends of the wire reaches a predefined value. Moreover, the end of the wire is moved to the second solder pad for being welded. Therefore, the wire is connected to the first solder pad and the second solder pad, and the second bend and the third bend of the wire form a structure supporting point for the second pad.