baber/WOPTO huggingface dataset:
Patent TW-I255713-B (TW)
Title: Method for treating meibomian gland disease
Inventor: PFLUGFELDER STEPHEN C
IPC: A61P27/02
Filed: 1999-05-25
Granted: 2006-06-01
Abstract: A method for treating a patient having meibomian gland disease, ocular irritation associated with delayed tear clearance, or recurrent corneal epithelial erosion, is disclosed. Preferably, the method concerns treatment of a patient with topical tetracycline, a derivative or analogues of tetracycline, or a chemically modified tetracycline (CMT). Oral administration of a CMT is also disclosed as part of the method for treating meibomian gland disease, ocular irritation associated with delayed tear clearance, or recurrent corneal epithelial erosion.
Patent TW-396256-B (TW)
Title: Modular surface mount manifold assemblies
Inventor: EIDSMORE PAUL G
IPC: F16K27/00
Filed: 1999-05-18
Granted: 2000-07-01
Abstract: A modular manifold system is provided for interconnecting fluid components of a fluid system in a reduced area. The system is comprised of a one or more bridge fittings having an internal fluid passageway which has an inlet end in fluid communicating with an outlet port of a first fluid component, and an outlet end in fluid communication with an inlet port of a second fluid component. The bridge fittings may be mounted within a channel of a backing plate for structural support. An optional locator plate may be utilized which is mounted within a channel of a backing plate for structural support. An optional locator plate may be utilized which is mounted over the ends of the bridge fittings in order to align the inlet and outlet ports of the fluid components with the inlet and outlet ends of the bridge fittings. The bridge fittings may also be mounted to the locator plate in multiple layers where bridge fittings of one layer may be in fluid communication with bridge fittings of another layer. The invention may further comprise seals provided in a recess between the fluid ports and the mating bridge fittings ends.
Patent TW-432281-B (TW)
Title: Method and system for reducing processor workload by using memory-remapping technique
Inventor: HOU JIAN-TSZ
IPC: G06F3/06
Filed: 1999-05-19
Granted: 2001-05-01
Abstract: A data processing system with an enhanced system controller supporting memory-remapping function.  The system controller has an access control circuit, a page/remapping management circuit and an open/remapped address table.  The open/remapped address table is used to store mapping tables for indicating the mapping relation of memory segments and addresses dedicated to peripheral devices.  The page/remapping management circuit should maintain and use the mapping tables in various operating mode.  In addition, the page/remapping management circuit can redirect access requests to proper memory segments according to the mapping table corresponding to the current operating mode.  Therefore, peripheral devices can effectively access and process the data stored in various memory segments by the change of the operating modes, not by physical data transfer.
Patent TW-393383-B (TW)
Title: Punching holes for metallic casting housing
Inventor: LIN YUNG-SHIANG
IPC: B24C7/00
Filed: 1999-05-26
Granted: 2000-06-11
Abstract: This invention provides a hole punching method of metallic casting housing. To give a slightly raised boss to the surface onto which a hole is set to be punched. A blind hole feature will be prearranged slightly into the surface to be machined. The surface to be machined is aligned with the metallic end surface and, simultaneously, the blind hole can be formed into a through hole. In comparison with the conventional punching or drilling methods, the new method will improve the removal of burr from housing. Efficiency and formability of shapes will also be improved with this new method.
Patent TW-453118-B (TW)
Title: Graphic decoding device and a graphic encoding device
Inventor: KURODA SHINICHI
IPC: H04N21/654
Filed: 1999-07-20
Granted: 2001-09-01
Abstract: This invention discloses an image decoding device. After applying inverse orthogonal transformation on a selected data unit, the device performs de-compression process on compressed image data. This image decoding device is equipped with functions to detect erroneous data units (department 4 for detecting erroneous data units). After image signals in frequency domain and threshold limit value are provided, the data in the data unit are examined for possible errors based on the image signals in frequency domain and the threshold limit value. The corresponding error detection conditions for the data in the data unit are then obtained.
Patent TW-I239335-B (TW)
Title: Bismuth Lewis base adducts and methods of synthesis of the same
Inventor: BAUM THOMAS H
IPC: H01L21/316
Filed: 1999-09-22
Granted: 2005-09-11
Abstract: Anhydrous mononuclear Lewis base adducted tris (beta-diketonato) bismuth complexes, useful as precursors for chemical vapor deposition of bismuth, for producing Bi-containing films of significantly improved stoichiometry, morphology and functional character, as compared to films obtained from dinuclear tris (beta-diketonato) bismuth complexes of the prior art.
Patent TW-465120-B (TW)
Title: Method of fabricating film for solar cells
Inventor: NIKI SHIGERU
IPC: H01L31/04
Filed: 1999-10-08
Granted: 2001-11-21
Abstract: A method of fabricating Cu Α (InxGa1-x) β (SeyS1-y) γ films for solar cells includes forming an electrode on a substrate and supplying the substrate ad electrode with Cu, In, Ga, Se, and S to form a Cu Α (InxGa1-x) β (SeyS1-y) γ film. Simultaneously with the supplying of Cu, In, Ga, Se and S, the substrate is supplied with water vapor or a gas that contains a hydroxyl group.
Patent TW-423997-B (TW)
Title: Friction charge apparatus
Inventor: MAEHATA HIDEHIKO
IPC: B03C7/06
Filed: 1999-11-02
Granted: 2001-03-01
Abstract: This invention is related to a friction charge apparatus (30) for frictionally charging various shattered plastic pieces (1). Friction auxiliary material (52) is housed in the stirring container (31). The particles of the friction auxiliary material (52) are made larger than the plastic pieces (1). A plurality of discharge part wire materials (47) arranged in parallel along the transverse section of a stirring container (31) at a predetermined interval are provided to a discharge port (34) formed to the end part of the stirring container (31). The interval between the discharge part wire materials (47) is set so as to be made larger than the plastic pieces (1) but smaller than the particles of the friction auxiliary material (52).
Patent TW-424002-B (TW)
Title: A cleaning method after finishing polishing process of Cu interconnection
Inventor: CHEN YING-HO
IPC: B08B7/00
Filed: 1999-12-28
Granted: 2001-03-01
Abstract: The present invention relates to a cleaning method to remove both residual polishing slurry and Cu metal impurities after chemical mechanical polishing (CMP) for Cu interconnection. This method is to use a solution containing tetra methyl ammonium hydroxide (TMAH) to remove the above-mentioned residual polishing slurry, and then an organic acid with Cu inhibitor is used to remove the above-mentioned Cu impurities. According to the present invention of cleaning method, both residual polishing slurry and Cu metal impurities are effectively removed and the corrosion of Cu interconnects is prevented.
Patent TW-536794-B (TW)
Title: Wiring board and its manufacturing method, semiconductor apparatus and its manufacturing method, and circuit board
Inventor: NARIZUKA YASUMORI
IPC: H01L23/485
Filed: 2000-01-18
Granted: 2003-06-11
Abstract: An inexpensive high-density wiring-board with high connection reliability, semiconductor apparatus and manufacturing method for making the same are provided in the present invention. The invented wiring board has the followings: the substrate, which has electrodes and openings in the coated insulation layer to expose the electrodes; the wiring connected with the electrodes, in which the wiring is formed by closely stacking Ti layer or Cr layer on the insulation layer, and closely stacking Cu layer on Ti layer or Cr layer; the protection film covering the wiring, in which holes for tin soldering connection are opened on the protection film; and the soldering tin, which is carried in the holes opened on the protection film for tin soldering connection so as to diffuse and making alloy the Cu layer of the wiring and to reach Cr layer or Ti layer for connection and forming external connection.
Patent TW-484056-B (TW)
Title: Semiconductor device simulating apparatus and semiconductor test program debugging apparatus using it
Inventor: FUKUSHIMA KIYOSHI
IPC: G01R31/30
Filed: 2000-03-14
Granted: 2002-04-21
Abstract: Herein disclosed is a semiconductor device simulation apparatus which is set the various parameters to be used for measuring a current value and a voltage value that varies depending on the internal resistance of a DUT, and simulates a current value or a voltage value that varies depending on an internal resistance of a DUT in accordance with various parameters and a prescribed test signal when receiving the test signal. Also disclosed is a semiconductor test program debugging apparatus using such a semiconductor device simulating apparatus.
Patent TW-I249401-B (TW)
Title: Agent for improving ketosis
Inventor: ODAKA HIROYUKI
IPC: A61K31/00
Filed: 2000-04-10
Granted: 2006-02-21
Abstract: An agent for improving ketosis which comprises an insulin sensitizer, which has an excellent action and low toxicity.
Patent TW-452951-B (TW)
Title: Electronic component to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same
Inventor: YATSUDA HIROMI
IPC: H05K3/34
Filed: 2000-05-31
Granted: 2001-09-01
Abstract: Substrate 10 has bumps 28, 30, 32 34 and a substrate 20 has openings 36, 38, 40, 42 at positions in which bumps 28, 30, 32, 34 confront respectively. The substrates 10 and 22 are put together by fusing a sealing wall 26 formed on the substrate 22, to hermetically seal an electronic device lying on the substrate 10 therein. Gas that may be generated upon fusing of the sealing wall 26 can be effectively removed through the openings 36, 38, 40, 42 in the substrate 22.
Patent TW-444368-B (TW)
Title: Manufacturing method for wafer level semiconductor package
Inventor: LIN JIUN-HUNG
IPC: H01L23/28
Filed: 2000-06-02
Granted: 2001-07-01
Abstract: A manufacturing method for wafer level semiconductor package includes the following steps: using a wider slicing knife to carve on the active surface of a wafer along the slicing lines of the wafer to form a plurality of groove-like notch; encapsulating the wafer with encapsulation plastic material and filling in the groove-like notch; polishing the back side surface of the wafer until exposing the positioning lines formed by the encapsulation plastic material; and, by the positioning lines formed by the encapsulation plastic material, slicing the wafer from the back side into dies. According to the manufacturing method for wafer level semiconductor package in the present invention, during the slicing process, it can have correct positioning points for precisely and fast positioning and the edges of the produced dies are also packaged so as to get a better moisture isolation effect.
Patent TW-495436-B (TW)
Title: Clad plate of interposer formation for semiconductor device, interposer for semiconductor device, and their manufacturing methods
Inventor: SAIJO KINJI
IPC: H01L23/31
Filed: 2000-06-09
Granted: 2002-07-21
Abstract: The present invention relates to a clad plate for forming an interposer for a semiconductor device which can be manufactured at a low cost and has good characteristics, an interposer for a semiconductor device, and methods of manufacturing them. Copper foil materials (19, 24, 33) of conductive layers (10, 17, 18) and nickel plating (20, 21) of etching stopper layers (11, 12) are laminated and pressed to form a clad plate (34) for forming an interposer for a semiconductor device. The clad plate (34) is selectively etched to form columnar conductors (17), and an insulating layer (13) is formed on the copper foil material of a wiring layer (10). A bump (18) for connection of a semiconductor chip and the wiring layer (10) are formed on a side opposite to the side on which the columnar conductor (17) is formed. Thus, an interposer for a semiconductor device is manufactured.
Patent TW-I253952-B (TW)
Title: Method for preparing chemical solutions
Inventor: FUKUIZUMI MASATAKA
IPC: C01C1/16
Filed: 2000-06-29
Granted: 2006-05-01
Abstract: A chemical solution preparation apparatus for preparing a chemical solution from chemical gas of an industrial chemical grade. A dissolution unit dissolves the chemical gas in pure water, which is contained in a tank. A gas discharge control unit controls the amount of chemical gas discharged from the dissolution unit. A liquid discharge discharges a predetermined amount of the chemical solution from the tank. At least one of the gas discharge control unit and the liquid discharge control unit are operated at substantially the same time as the dissolution unit.
Patent TW-469622-B (TW)
Title: Semiconductor device with ESD protection
Inventor: KOOMEN JOANNES JOSEPH MARIA
IPC: H01L21/331
Filed: 2000-07-04
Granted: 2001-12-21
Abstract: The invention relates to a bipolar ESD protection comprising a protection transistor with a short-circuited base emitter (18, 19). Due to the snap-back effect, the transistor can switch from the normal high-ohmic condition to a low-ohmic condition in the case of ESD. To improve the protection performance, the protection structure is provided with a trigger element comprising a second transistor (26, 27, 28) with a lower breakdown voltage. The base (26) and the emitter (28) of the second transistor are connected to the base of the protection transistor. To increase the current carrying capability of the protection device, the trigger transistor is designed so as to be a vertical transistor.
Patent TW-506900-B (TW)
Title: Heat-resistant cushion material for forming press
Inventor: TAKEUCHI TETSUO
IPC: H05K3/02
Filed: 2000-09-01
Granted: 2002-10-21
Abstract: To provide a cushion material for a forming press wherein the areal weight and thickness nay be adjusted as required by the products. One or more base layers of a multi-weave fabric strucrture and one or sore fiber layers are piled one on another with the layers joined together by joining means. The order of layering as well as the areal weight or thickness may be determined as desired.
Patent TW-472168-B (TW)
Title: Rear projection screen and display device using birefringent optical film for asymmetric light scattering
Inventor: ALLEN RICHARD C
IPC: G03B21/62
Filed: 2000-09-02
Granted: 2002-01-11
Abstract: A dispersing element for a rear projection screen assembly is sensitive to the polarization of the light passing through the element. In particular, the element disperses light having a first polarization differently from light having a second polarization orthogonal to the first polarization. The dispersing element may be aligned with a polarization axis neither parallel nor perpendicular to the polarization of the light passing through the element. The dispersing element may also be employed with a polarizer to remove unwanted light that propagates through the dispersing element. The dispersing element may also be rotatably mounted relative to a polarized light source so as to vary the angle between the polarization axis of the element and the polarization direction of the light.
Patent TW-477738-B (TW)
Title: Hand-held hydraulic pressing apparatus
Inventor: FRENKEN EGBERT
IPC: F15B15/02
Filed: 2000-09-14
Granted: 2002-03-01
Abstract: Hand-held hydraulic pressing apparatus (1) with a hydraulic cylinder (8) in which a hydraulically actuated piston can be displaced to carry out a pressing or cutting operation, with a piston head (5) and a piston shank (16), the piston shank (16) being connected to a tool carrier (10), and the tool carrier (10) being part of an interchangeable apparatus head (9), characterized in that an interchangeable apparatus head (9) has in each case a piston shank (16) with a return spring (22).
Patent TW-493070-B (TW)
Title: Fluorescent particle imaging device
Inventor: YABUSAKI KATSUMI
IPC: G01N21/64
Filed: 2000-09-16
Granted: 2002-07-01
Abstract: The present invention provides a fluorescent particle imaging device capable of reducing the effect of background light to take the photo of fluorescent particle. The structure of the present invention is an imaging container (3) for containing the fluorescent particles dyed with a fluorescent dye collectively at the bottom. If the container contains a substance having a high transmittance to the exciting light such as a blood platelet derivative or a diluted red blood cell derivative, a mirror (20) is removed from the optical path, and only the portion near the bottom of the container are irradiated from a side with the exciting light. Even if the solution in the container contains a fluorescent dye, the fluorescence is prevented from acting as disturbing light. If the container contains a substance having a low transmittance to the exciting light such as a high-concentration red blood cell derivative, the mirror (20) is placed in the optical path, and the bottom of the container is irradiated from below. In this case, since the transmittance is low, the exciting light reaches only the portion near the bottom, and fluorescence acting as background light is hardly produced. Even if the transmittance to the exciting light is different, illumination corresponding to the transmittance can be selected, and therefore the fluorescent particles can be counted correctly.
Patent TW-459334-B (TW)
Title: Method for fabricating capacitors of semiconductor device
Inventor: LEE KEE-JEUNG
IPC: H01L21/8242
Filed: 2000-11-07
Granted: 2001-10-11
Abstract: A kind of method for fabricating capacitors of semiconductor device includes the followings. A bottom electrode layer is formed on the semiconductor base layer, which is formed by the diverse structure that is required in the fabricating process of semiconductor device. An amorphous TaON thin film is deposited on the bottom electrode layer. A low-temperature heating process and a high-temperature heating process are conducted onto the deposited amorphous TaON thin film to form a TaON dielectric layer. In addition, an upper electrode layer is formed on the TaON dielectric layer. Because the TaON thin film is used as a dielectric layer, it is capable of achieving an improvement target of assuring the capacitance value, which is required in semiconductor device, and the electric character.
Patent TW-493218-B (TW)
Title: Ventilating method and ventilating system for semiconductor manufacturing apparatuses
Inventor: KOMIYAMA KIYOSHI
IPC: H01L21/02
Filed: 2000-12-18
Granted: 2002-07-01
Abstract: A semiconductor manufacturing apparatus ventilating system can reduce energy consumption with respect to air-conditioning and a power spent for transporting air in a clean room by minimizing an amount of circulating air in a clean room. The clean room air, which is supplied to the clean room, is introduced into an air circulating system including the semiconductor manufacturing apparatus. The air circulating system is separated from an atmosphere in the clean room. The clean room air in the air circulating system is circulated within the air circulating system.
Patent TW-490678-B (TW)
Title: Input/output line structure of a semiconductor memory device
Inventor: JOO JAE-HOON
IPC: H01L27/108
Filed: 2000-12-29
Granted: 2002-06-11
Abstract: A semiconductor memory device including a plurality of memory blocks, and a plurality of input/output lines associated with the memory blocks, is disclosed. The input/output lines are divided into at least a first group and a second group. A first parts of the input/output lines of the first group are arranged between adjacent memory blocks while first parts of the input/output lines of the second group are arranged on circuit blocks around the adjacent memory blocks, and second parts of the input/output lines of the first group are arranged on the circuits blocks around the memory blocks while second parts of the input/output lines of the second group are arranged between the adjacent memory blocks.
Patent TW-I232287-B (TW)
Title: System and method for measuring absolute optical distance and planar angle relative to optic sensor assembly means for a shaft assembly
Inventor: MARTINEZ STEVEN D
IPC: G01B11/00
Filed: 2001-03-08
Granted: 2005-05-11
Abstract: A contactless precision, optical distance and angle measurement method and system optically measuring the position of a moveable object (S), the bending of the object (S), the torque applied to the object (S) and the object's rotational velocity. The present invention includes a plurality of optical sensors (111,11n) placed around and adjacent to the moveable object (S) which transmit optical signals to a surface (35) of the object (S) and receives the optic signals when predefined marker means (33n) are sensed. The received optic signals are then processed by non-linear estimation techniques known to those of skill in the art to obtain the desired information.
Patent TW-544328-B (TW)
Title: Electronic equipment, recording medium and method for generating images or sound
Inventor: KOMATA NOBUHIRO
IPC: G10L21/045
Filed: 2001-01-10
Granted: 2003-08-01
Abstract: Electronic equipment includes a processing apparatus that performs high-speed playback processing depending on an output of a switch pushed by a user of the electronic equipment. The processing apparatus changes the playback speed to a speed that depends on an output value of the switch. A recording medium is used which has a program that changes the playback speed depending on the output value of the switch. A method of generating images and sound senses the pushing pressure applied by a user to a switch by a pressure-sensitive unit to generate a pressure-sensing signal, determines a playback speed according to a pressure-sensing signal, and performs variable-speed playback at the determined playback speed.
Patent TW-I227244-B (TW)
Title: Resins curable with actinic energy ray, process for the production thereof, and photocurable and thermo setting resin composition
Inventor: NISHIKUBO TADATOMI
IPC: C08F299/02
Filed: 2001-03-28
Granted: 2005-02-01
Abstract: A photo curable and thermo setting resin composition comprising (A) a resin curable with actinic radiation, which has one or more structures represented by the general formula (1), (B) a polymerization initiator, (C) a diluent, and (D) a polyfunctional oxetane compound. The resin curable with actinic radiation can be produced by reacting (a) a polyfunctional oxetane compound with (b) an unsaturated monocarboxylic acid to form a modified oxetane resin (aíª) and then reacting the primary hydroxyl groups of the modified oxetane resin (a') with (c) a polybasic acid anhydride. (In the general formula, R1 is hydrogen or C1-6 alkyl; R2, R3 and R4 are each hydrogen, C1-6 alkyl, aryl, aralkyl, cyano, fluoro, or furyl; and X is a polybasic acid anhydride residue.)
Patent TW-I238883-B (TW)
Title: Vertical dryer and method of drying product in a vertical dryer
Inventor: CLARK DOUGLAS
IPC: F26B21/04
Filed: 2001-04-04
Granted: 2005-09-01
Abstract: An improved vertical dryer (10) is provided having a plurality of individual dryer decks (12-18) including alternating fan and heater decks (14, 16), an air circulation assembly (11), and an upright, common plenum chamber (26) in communication with the decks (12-18). The assembly (11) is operable to create a continuous drying air stream which passes upwardly in countercurrent flow relationship to product on the decks (12-18). Also, the assembly (11) serves to pass the drying air stream into, through and out of the plenum (26) at the level of each heater deck (16); in the plenum (26), the air stream velocity is decreased, causing particulate fines to fall out of the stream for collection. The use of the common plenum (26) also allows independent control of the decks (12-18) in terms of air flows therethrough and recirculation characteristics.