baber/WOPTO huggingface dataset:
Patent JP-S63142644-A (JP)
Title: Film carrier for semiconductor device
Inventor: OKABE NORIO
IPC: H01L21/60
Filed: 1986-12-04
Abstract: PURPOSE:To prevent a whisker of a lead frame from occurring and to keep the good soldering adaptability even after many hours by a method wherein a first Sn-plated layer is formed on the surface of a conductor film, on this layer a thin Pb-plated layer is then formed and, additionally, a second thin Sn-plated layer is formed on this layer. CONSTITUTION:A lead 5 is composed of the following three: a first Sn-plated layer 9 used to achieve an Au-Sn eutectic bonding process of an Au bump 14 on an electrode 13 at an IC chip 12 to the surface of a sheet of copper leaf 8 glued onto a film; a thin Pb-plated layer 10 formed on the layer 9; a second thin Sn-plated layer 11 formed on the layer 10. The thickness of the first Sn- plated layer 9 is not specified, but it is preferable that the thickness is about 0.3-0.8mum. The thickness of the Pb-plated layer 10 is preferably to be less than one-tenth the thickness of the first Sn-plated layer 9. It is preferable that the thickness of the second Sn-plated layer 11 is 0.01-0.05mum. The first Sn- plated layer 9, the Pb-plated layer 10 covering this layer and the second Sn- plated layer 11 covering this layer may be formed either on the whole or on a part of the lead 5, respectively.
Patent JP-H01132111-A (JP)
Title: Through type capacitor
Inventor: KUROKUZUHARA MAMORU
IPC: H01G4/005
Filed: 1987-11-18
Abstract: PURPOSE:To obtain a compact through type capacitor which is simple in structure with a small number of parts, easy to connect externally, and has a good cost performance by providing on two central electrodes flat terminal portions which are bent outwardly away from each other above a dielectric and then so bent that they extend parallel to each other. CONSTITUTION:A through type capacitor comprises a dielectric 1 whose peripheral and internal surfaces of its throughhole are coated with a conductive film, two central electrodes 3 inserted into the throughhole, flat electrodes 2 connected to the peripheral conductive film of the dielectric 1, and plastic external cases 4, 5, whose inner space is divided into upper and lower parts by the flat electrodes 2 respectively surrounded by the dielectric 1 and the central electrodes 3 and filled with a solidified insulating resin 6. The two central electrodes 3 have portions 31 which extend under the dielectric 1 and is partially inserted into the throughhole formed with a cylindrical metal plate, and have flat terminal portions 32 which are so bent that they separate outwardly from each other above the dielectric and then so bent that they extend upwardly parallel to each other, the bent portions 33 being reinforced by portions 34 projecting at right angle relative to the parallel portions.
Patent JP-H10134722-A (JP)
Title: Gas discharging type display device
Inventor: MATSUZAKI EIJI
IPC: H01J11/28
Filed: 1996-10-31
Abstract: PROBLEM TO BE SOLVED: To reduce the number of bus electrodes for X and Y electrodes so as to achieve a high opening ratio while saving a space by alternately arraying each pair of X and Y electrodes of display electrode cell arrays, interposing the bus electrode between the Y electrodes, and connecting the bus electrode to a display electrode. SOLUTION: A Y electrode 62 of a display electrode cell array is adjacent to a Y electrode 62 of an adjacent display electrode cell array, and an X electrode 62 is adjacent to the display electrode cell array adjacently to an X electrode 61 of an adjacent display electrode cell array. That is, the plurality of display electrode cell arrays are arrayed in the order of the X electrode, the X electrode, the Y electrode, the Y electrode, the X electrode and the X electrode. A bus electrode 72 is interposed between the Y electrodes 51 of the display electrode cell arrays, and is connected to the display electrode 62 on a barrier rib 111. In this case, the display electrodes common to the display electrode cell array are connected via a branch portion 720 of the bus electrode 72. Furthermore, the Y electrodes 62 of the display electrode cell arrays are separated from each other in a position where a substrate is brought into contact with a discharging space.
Patent JP-H07197921-A (JP)
Title: Light-weight c-shaped steel lip stopper metal fitting
Inventor: TANABE KATSUMI
IPC: F16B35/04
Filed: 1993-10-13
Abstract: PURPOSE:To enhance workability and convenience by arranging a metal fitting for connecting and fixing a lip of a light-weight C-shaped steel to a cleat piece, dispensing with welding work of flat steel or a steel plate to the lip so as to prevent simultaneous turning of a bolt. CONSTITUTION:In order to a fix a lateral light-weight C-shaped steel 7 to a vertical light-weight C-shaped steel 6, a cleat piece 4 is positioned in the vertical light-weight C-shaped steel 6, followed by welding and fixing, and then, the lateral light-weight C-shaped steel 7 is mounted thereon. A lip stopper metal fitting 1 is inserted into a lip 8 of the lateral light-weight C-shaped steel 7, thus tightening the cleat piece 4 and the light-weight C-shaped steel 7 by means of a bolt 2. The lip stopper metal fitting 1 is bent at 45 deg. in a position where the lip 8 is pressed, so as to be smoothly inserted with ease. Furthermore, a special bolt is secured to the lip stopper metal fitting 1, and a knob 3 is disposed at the tip of the bolt. Consequently, it is possible to dispense with welding work of the lip 8 of the lightweight C-shaped steel 7, and prevent driven turning of the bolt 2.
Patent JP-H03149890-A (JP)
Title: Ceramic circuit board
Inventor: TANAKA MICHINORI
IPC: B32B15/04
Filed: 1989-11-06
Abstract: PURPOSE:To obtain a board for circuit enabling high density mounting excellent in thermal conductivity and having small thermal expansion coefficient by clothing one side or both sides of a plate consisting of a complex, wherein a perforated body obtained by molding ceramic powder is impregnated with resin and fixed, with a metal foil. CONSTITUTION:Ceramic powder is molded into the plate or columnar shaped for being impregnated with liquid resin while deaerating this compact followed by being cut into the plate shape of the desired thickness by mechanical processing. Then, a metal foil is piled on one side or both sides of the plate to be pressed by heating, further hardening resin by heating for obtaining a board for a one side or both side circuit.
Patent JP-H06139701-A (JP)
Title: Optical disk reproducing device
Inventor: SASAKI TSUKASA
IPC: G11B7/005
Filed: 1992-10-28
Abstract: PURPOSE:To prevent the sound of a CD from being interrupted with vibrations by providing a space difference between a write address and a read address. CONSTITUTION:The condition of t2=2t1 is set for processing time t1=W1 to write the read data of a CD3 in a memory and write time t2=W2. The write address is preceded to the read address, the margin of address difference vr 1 is provided, and read is enabled for the time of t2-t1. When any error is detected at time (2), write is stopped and restarted at time (3) after returning to a position just before the error is detected. Address changes are shown by a curve W2, and a margin vr 2 is provided. Namely, even when out-of-servo is generated during reproduction by vibrations or the like, the sound is not interrupted and the continuity can be guaranteed by restarting the write by performing the returning operation while the write address written at n-times speed as high as normal speed is preceding to the read address to be read at the normal speed.
Patent JP-S62147591-A (JP)
Inventor: MORI HAJIME
IPC: G07F13/06
Filed: 1985-12-23
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H09107112-A (JP)
Title: Semiconductor device and its manufacture
Inventor: ONO TOSHIAKI
IPC: H01L29/80
Filed: 1995-10-11
Abstract: PROBLEM TO BE SOLVED: To simplify the process by providing an isolated gate ohmic layer on the step between the source ohmic layer and the gate ohmic layer on an integrated semiconductor device, which is formed by forming a burried source layer and a buried gate layer on a semiconductor substrate. SOLUTION: On both sides of an N<+> silicon substrate 6, SiO2 films 10 and 11 are formed by heat curing, and a selectively hole making pattern 12 which has stripe holes 13 and 14 is formed. P<+> gate buried layers 15 and 16 are formed on the N<+> 8 layer of a substrate 7 by performing heat diffusion on the pattern 12. The SiO2 film is removed from the whole plane, and an epitaxial layer 17 is formed on the gate burying layers 15 and 16. Then, N<+> ohmic diffusion layers 51 and 52 are formed on the both sides. On both sides of the substrate 7, SiO2 films 53 and 54 are formed by heat oxidation, the epitaxial layer 17 is etched so as to provide selectively hole making patterns 55 and 56 and a step 57 is formed. Then, SiO2 layers 75-77 which cover the step 57 are formed. Thus, the process is simplified and the cost is reduced.
Patent JP-H05112332-A (JP)
Title: Heating roll device to form heat-bonded part for packaging container
Inventor: MIYAGAWA TATSUYA
IPC: B31B50/64
Filed: 1991-10-09
Abstract: PURPOSE:To provide a heating roll device to form a heat-bonded part for packaging containers, which requires less power consumption by heating the heating roll to a specified temperature efficiently in a short period of time; has an excellent temperature controllability; and gives less thermal influence to the bearing, etc., of the driving shaft. CONSTITUTION:A driving shaft 1 is penetrated through a heating roll 21 while placing a gap 27, and the heating roll 21 is supported by the driving shaft 1 at both ends. A heating body 41 which is made of an electric resistor, is arranged in the gap 27 to be away from the driving shaft 1, and is brought into contact at least with an area to correspond with a force piston 25, on the inner side peripheral surface of a roll main body 24 of the heating roll 21.
Patent JP-2001105961-A (JP)
Title: Drainage pump vehicle and draining method by drainage pump vehicle
Inventor: AOKI TETSUO
IPC: B60P3/00
Filed: 1999-10-13
Abstract: PROBLEM TO BE SOLVED: To provide a drainage pump vehicle capable of increasing a drainage capability by making a drainage quantity larger than the value determined by the maximum output of a self-traveling engine. SOLUTION: A first vehicle 8 mounted with a self-traveling engine E and a second vehicle 9 capable of being towed by the vehicle 8 are provided, and power generating sets 4 are mounted on both vehicles 8, 9 respectively. A pump operating engine E1 is mounted on the second vehicle 9, the output of the engine E operated in the stop state of the first vehicle 8 is fed to a power extracting device 10, and the power generating unit 4 of the first vehicle 8 is driven by the output of the power extracting device 10. A submerged pump 2 having a motor 3 driven by the electric power fed from the power generating unit 4 is mounted on the first vehicle 8, the power generating unit 4 of the second vehicle 9 is driven by the output of the engine E1, and a submerged pump 2 having a motor 3 driven by the electric power fed from this power generating unit 4 is mounted on the second vehicle 9.
Patent JP-H03151703-A (JP)
Title: Antenna system
Inventor: CHIBA ISAMU
IPC: H01Q21/06
Filed: 1989-11-08
Abstract: PURPOSE:To obtain an antenna with an excellent axial ratio by using a sequential subarray comprising M sets of circularly polarized wave element antennas as one subarray, varying a feeding point depending on each subarray, and forming sequential subarrays. CONSTITUTION:2M<-1> sets of circularly polarized element antennas E are used as one set, the m-th circularly polarized element antenna in one set is arranged while being turned by (m-1)X(360/2M)<0> and its exciting phase is shifted by (m-1)X(360/2M)<0> and plural subarrays S are arranged and the circularly polarized wave element antenna in the n-th sets of subarray is turned by (n-1)X360/2M)<0> equally, and the exciting phase is shifted by (n-1)X(360/2M)<0>. The effect on the antenna system due to the dispersion in the axial ratio for each antenna and the error of the exciting phase shift is remarkably reduced.
Patent JP-H07193715-A (JP)
Title: Method and apparatus for cascading ntural scene picture
Inventor: UIRIAMU EI FUASU
IPC: H04N1/407
Filed: 1994-10-31
Abstract: PURPOSE: To improve processing time and quality of an image processed by a cascade processing element. CONSTITUTION: Data from an information generator and distributor 106 is transmitted to respective correction module buses 110, 120, 130 of plural signals by an information channel 108. A signal required for an operation is transmitted to an exposure processor 112, a color balance processor 122, a contrast processor 132 and information is similarly returned to the channel 108 as necessary by the respective correction processing buses. The signal is calculated for respective tone reproduction curve(TRC) generators 114, 124, 134 by using the data supplied by the channel 108 and the TRC indicating a necessary change of image determined by the each processor is generated by the respective processors 112, 122, 132.  The TRC is transmitted to a TRC coupling device 140, the TRC is coupled to form a single lookup table and a result is stored in a TRC controller 150 by the respective TRC generators 114, 124, 134.
Patent JP-H07138143-A (JP)
Title: Releasable skin protective agent
Inventor: NAKAMURA SHINICHI
IPC: A61K8/00
Filed: 1993-11-19
Abstract: PURPOSE:To provide a skin protective agent excellent in adhesiveness to the skin, with little strained feel, free from a sense of incompatibility in terms of appearance, and easily releasable in a filmy form after use. CONSTITUTION:The objective skin protective agent can be obtained by incorporating (A) 100 pts.wt. of polyvinyl alcohol as film-forming substance with (B) 50-180 pts.wt. of at least one kind of compound, as softener, selected from polyhydric alcohols and ethanolamines and (C) 30-55 pts.wt. of amorphous life silica as luster-proofing agent.
Patent JP-2000119846-A (JP)
Title: Manufacture of thin film
Inventor: OHASHI KAZUNORI
IPC: G02B1/10
Filed: 1998-10-13
Abstract: PROBLEM TO BE SOLVED: To manufacture an anti-fogging film which is durable in anti-fogging effect and without deteriorating the optical property, and an anti-staining film which is excellent in durability and without deteriorating the reflection preventive effect. SOLUTION: A thin film manufacturing method includes a process in which a first target mainly consisting of titanium and a second target consisting mainly of silicon are installed in a vacuum chamber, a first sputtering process in which a substance of either of the first target or the second target is deposited on a substrate by a sputtering method, a second sputtering method in which a substance of the other target of the first target or the second target is deposited on the substrate and a mixture film forming process in which the substance deposited on the substrate is oxidized to form a thin film of the mixture consisting mainly of silicon oxide and titanium oxide after the first and second sputtering processes are completed.
Patent JP-S62151997-A (JP)
Inventor: GODA YUICHI
IPC: G07F11/18
Filed: 1985-12-25
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H01134173-A (JP)
Title: Absorption heat pump device
Inventor: TANAKA TAKAO
IPC: F25B15/00
Filed: 1987-11-18
Abstract: PURPOSE: To obtain fluid to be heated having a higher temperature level than a conventional one from the absorber of a second absorption heat pump by a structure wherein cooling water is fed from the condenser of the second absorption heat pump to that of the first absorption heat pump. CONSTITUTION: A pipe 36 on the cooling water outlet side of the condenser C2 for a second absorption heat pump 2 is coupled through a pipe 41 with a pipe 29 on the cooling water inlet side of the condenser C1 for a first absorption heat pump 1. Consequently, saturation temperature and steam pressure in the condenser C1 are higher than those of the condenser C2 and the suction fluid in the generator G2 of the second absorption heat pump 2 is concentrated more than,that in the generator G1 of the first absorption heat pump. When saturation steam pressure and temperature in the evaporator E2 and absorber A2 of a following heat pump are set equal to those of a conventional one, fluid to be heated having a higher temperature level than a conventional one can be obtained.
Patent JP-2000125331-A (JP)
Title: Phs (registered trademark)system, its phs terminal and selection method of base station by the phs system awaiting its call
Inventor: TOKUDA TAKEYUKI
IPC: H04W60/00
Filed: 1998-10-13
Abstract: PROBLEM TO BE SOLVED: To obtain a PHS system or the like in which a call loss due to concentration of a communication load onto a specific base station is reduced. SOLUTION: This PHS system consists of a prescribed PHS terminal (PS) and plural base stations (CS1-CS4) that can communicate with the PS, and the PS selects at random a base station from the call of which the PS awaits among base stations whose reception electric field strength is more than a specified strength and the control cannel of which the PS can acquire. Furthermore, plural kinds of different electric field strength values are set in advance for the specified value of the reception electric field strength and any of them is automatically selected, based on the distribution of the electric field strength of the base stations at a current point of time. Through the configuration above, number of call losses due to the concentration of communication load onto a specific base station is decreased, and the generation of call loss can easily suppressed by extending a new base station in an area of the base station that is highly selected.
Patent JP-2000121279-A (JP)
Title: Multi-plate type heat exchanger
Inventor: ISHIKAWA MITSURU
IPC: F28F3/04
Filed: 1998-10-13
Abstract: PROBLEM TO BE SOLVED: To obtain proper values of a dimension of a recessed groove of a plate-shaped body composing a multi-plate type heat exchanger and an interval thereof from the adjacent plate-shaped body. SOLUTION: In a multi-plate type heat exchanger 20 made up of a plurality of elements laminated, concaves and convexes are each made up of a concave groove 3a and a protruded stripe 2a and the recessed groove 3a is formed into an equi-two dimensional curvature groove in the shape of the cross section thereof which makes the element 10 have two plate-shaped bodies 1 and 1 mutually laminated by shifting the pitch of each concave and convex of the two plate-shaped bodies 1 and 1 by 1/2.  Then the depth of the recessed groove 3a is represented by Sht, the pitch Wpt and an interval between adjacent two plate-shaped bodies 1 and 1 demarcating a path 21 between the elements 10 (interval between groove bottoms), the dimensions meet the requirement of 0.8 mm<Wpt<1.6 mm, preferably Wht=1.2 mm or so, 4.8 mm<Wpt<6.8 mm, preferably Wpt=5.8 mm or so and 2.9 mm<Ppt<4.9 mm, preferably Ppt=4.0 mm-4.5 mm.
Patent JP-H05129370-A (JP)
Title: Chip component mounting structure
Inventor: TANAKA KEISUKE
IPC: H01L21/60
Filed: 1991-11-07
Abstract: PURPOSE:To fix correctly a flip-chip component, which is provided with connection terminal parts on its bottom, on connection lands on a ceramic substrate in a high-density surface packaging by a method wherein projected bumps are formed on the connection terminal parts on the flip-chip component and the component is connected to the connection lands on the ceramic substrate in such a way that the point parts of the bumps are inserted into through holes. CONSTITUTION:Projected bumps 3 are formed on connection terminal parts 2 by a wire bonder. Through holes 6, in which the point parts of the bumps 3 are fitted in the centers of connection lands 5 formed in such a way as to weld to the terminal parts 2 under the bottom of a flip-chip component 1, are provided in a ceramic substrate 4, such as a hybrid IC. A solder paste 7 is printed and applied on the lands 5 on the substrate 4 using a printed mask, the point parts of the bumps 3 are made to insert into the holes 6 provided in the lands 5 as guides to place the component 1 on the lands and the component 1 is reflowed and is welded to the connection lands 5 on the ceramic substrate.
Patent JP-H05131388-A (JP)
Title: Wrist device for industrial robot
Inventor: OZAWA FUSAAKI
IPC: B25J17/02
Filed: 1991-11-07
Abstract: PURPOSE:To provide a mechanism suitable for passing through power cables, signal cables, air pipes, etc, for end effecter mounted on its top, while maintaining compactness and lightweight of a wrist part as well as high-speed and high-accuracy of operation, in a wrist mechanism of an industrial robot. CONSTITUTION:In a wrist device, speed reducers 51 and 61 for driving an inner easing 5 and a top casing 6 which are rotated around a swing axis E and a rotating axis F crossed with each other, respectively, bevel gears 54, 64, and 65 which are a means for power transmission, and a cylindrical shaft 66 are separated by a partition 71 from No. 1 to No. 4 spaces 70, 60, 50, and 40 which form a continuous passage free from any obstruction.
Patent JP-S62148807-A (JP)
Title: Bend inspecting system for material body
Inventor: UESONO YOICHI
IPC: G01B21/24
Filed: 1985-12-24
Abstract: PURPOSE:To inspect a bend along the longitudinal direction of a material body to be inspected with good accuracy under noncontact state by calculating a relative deviation of the axes centers between the reference measuring position and the object measuring position with arithmetic operation and detecting a degree of the bend from the comparison operational result. CONSTITUTION:The reference measuring position A is set on an entrance nozzle part 11 and a cross-sectional central point O1 is calculated from output data of a displacement sensor at the reference measuring position A and virtual center line along the whole length area of a fuel assembly 1 through the central point is set. Next, a cross-sectional central point O2 of the fuel assembly 1 at the object measuring position B is similarly calculated. Here, the relative deviation in the cross-sectional directions of the respective central points O1 and O2 of a solid line and a dotted line in the cross-section of the fuel assembly 1 at the reference measuring position A and the object measuring position B indicates the quantity S of bend of the object measuring position B with respect to the reference measuring position A of the fuel assembly 1. As to the quantity S of bend, the bending direction of the central point O2 with respect to O1 and the size of the quantity of bend are calculated by vector synthesis of a relative deviation component with the virtual center line calculated for every each facing surface and from an algebric average of the scalar quantity by arithmetic operation respectively.