baber/WOPTO huggingface dataset:
Patent TW-508705-B (TW)
Title: Wiring substrate and fabricating method thereof
Inventor: IIJIMA ASAO
IPC: H01L25/065
Filed: 2000-04-25
Granted: 2002-11-01
Abstract: A first insulating film having openings is formed on a base made of, for example, copper. Wiring films made of a metallized film at lower portions are formed on the first insulating film. A second insulating film is formed thereon except for a certain portion, and then the base is selectively etched to expose the back surfaces of the wiring films. The wiring films and terminals such as ball electrodes are formed by electroplating. The base is connected to the wiring films to form a ground and/or power source line. In order to make it possible to mount an LSI chip on each main surface of the wiring substrate and to layer one another a plurality of wiring substrates each having the LSI chip mounted thereto, the wiring substrate is constructed such that the wiring films are formed on one side of the insulating resin film having openings and two kinds of metal bumps that are connected to the wiring films through the openings and are different in height from each other are formed on the other side.
Patent TW-429191-B (TW)
Title: Method for manufacturing heat sinks
Inventor: LI JEN-JI
IPC: B23K20/12
Filed: 2000-06-03
Granted: 2001-04-11
Abstract: Disclosed is a method for manufacturing heat sinks, comprising the steps of: extruding aluminum or aluminum alloy into a heat sink body; slitting plurality of slits on the heat sink body; providing a copper disc-shape plate body, and clamping the plate body and the heat sink body to the head clamping disc and the tail end magnetic chuck of a machine bed, in such a manner that the base faces of the plate body and the heat sink body face each other; rotating the head clamping disc in a high speed to drive the plate body to rotate along with the head clamping disc in a high speed; activating the hydraulic cylinder of the machine bed , such that the push rod of the hydraulic cylinder pushes the tail magnetic chuck and moves the heat sink body on the chuck to move towards the plate body until the base face of the heat sink body comes into contact with the plate body, where the head clamping disc of the machine bed stops rotation when the base face of the heat sink body melts into an appropriate state, whereby the push rod of the hydraulic cylinder further pushes the tail magnetic chuck subjecting the base faces of the plate body and the heat sink body maintain an appropriate pressure therebetween, whereby the plate body is tightly joined to the base face of the heat sink body upon cooling.
Patent TW-463531-B (TW)
Title: Electron density measurement and plasma process control system using plasma induced changes in the frequency of a microwave oscillator
Inventor: VERDEYEN JOSEPH T
IPC: G01N22/00
Filed: 2000-07-20
Granted: 2001-11-11
Abstract: A method and system for measuring at least one of a plasma density and an electron density (e.g., in a range of 10<SP>10</SP> to 10<SP>12</SP> cm<SP>-3</SP>). Measurement of at least one of the plasma density and the electron density enables plasma-assisted processes, such as depositions or etches, to be controlled using a feedback control. Both the measurement method and system generate a control voltage that in turn controls the plasma generator to maintain at least one of the plasma density and the electron density at a pre-selected value.
Patent TW-454310-B (TW)
Title: Semiconductor device
Inventor: MATSUSHIMA HIRONORI
IPC: H01L23/498
Filed: 2000-07-21
Granted: 2001-09-11
Abstract: In the present semiconductor device, signal lines of the first signal layer are led to the lower multi-layer portion via through holes selected under certain conditions so that the crosstalk noise does not become a problem even when the second signal layer is superposed on the first signal layer without providing a plane layer therebetween. In addition, a ground plane is provided in the region of the first signal layer lacking signal lines so that the second signal layer is sandwiched by the planes to form a strip structure even without the provision of a separate plane layer between the first signal layer and the second signal layer. Thus, the number of layers required for the multi-layer substrate can be reduced by eliminating this one unnecessary plane layer.
Patent TW-418087-B (TW)
Title: Bio-sandwich retina cutting device
Inventor: LIN BO-GANG
IPC: A61F9/007
Filed: 1997-11-14
Granted: 2001-01-11
Abstract: Bio-sandwich retina cutting device includes a main body and a ring knife set which includes a temperature control. The main body includes an ON/OFF power switch, a button which sets the temperature of the ring knife set, and a display which can show the set temperature and the real temperature. There are a heat generating resistance and a temperature detector inside the ring knife set. The front of the ring is connected with a disposable ring knife head for the adhesion of the cut bio-film part.
Patent TW-480852-B (TW)
Title: Separated channel card architecture of code division multiplex access system
Inventor: WU KUANG-SHR
IPC: H04J13/00
Filed: 2000-09-13
Granted: 2002-03-21
Abstract: A separated channel card architecture of code division multiple access system includes: a wired network interface module, a controller of a wired network control console, a master channel card, a middle frequency module receiving master channel card, a radio frequency module, a receiving channel card, a random access card, a clock module and a cell controller. The master channel card design is responsible for the control of transmitting signal, and the channel card is responsible for receiving the signals. The data of the receiving terminal and transmitting terminal are processed separately to clearly guide the data flow direction for thereby simplifying the data transmission flow to reduce the interference in signal transmission and make the hardware design easy.
Patent TW-440674-B (TW)
Title: Control system of a motor air valve, and control circuit board and the valve itself
Inventor: SHIMIZU KANJI
IPC: F24F11/76
Filed: 2000-09-14
Granted: 2001-06-16
Abstract: This invention is related to the control system of a motor air valve, and the control circuit board and the valve itself. This invention is capable of reducing lead timer, cost, and allows effectively control of the control system and the control device of the motor air valve. Disclosed is a control system for a networked motor air valve, comprising: a plurality of motor air valve, including a motor for opening and closing a driven air valve, a mechanism for detecting the degree which the air valve is open, and a motor control circuit; a temperature sensor, for detecting temperature of a room 3 and for transmitting the sensed temperature to the motor control circuit; a main computer 12 for monitoring the sensed temperature data from the motor control circuit; and a communication bus 11, connected to the main computer and the motor control circuit board. The motor control circuit board of the motor air valve includes an input port, a CPU, and an output port.
Patent TW-456081-B (TW)
Title: Semiconductor laser diode with non-light-absorbing window layer and method of manufacturing same
Inventor: CHIU CHIEN-CHIA
IPC: H01S3/0943
Filed: 2000-09-29
Granted: 2001-09-21
Abstract: A semiconductor laser diode according to the invention includes successively growing on the surface of the substrate an n type cladding layer and a quantum well active layer, etching the grown layers through a mask to produce the desired window area, and filling the window area by growing a p type cladding layer in a metal organic chemical vapor deposition (MOCVD) reaction chamber after removing the mask. Thus, the energy gap of the laser light emitted area around the facet of a semiconductor laser device is larger than that of the quantum well, and catastrophic optical damage (COD) is avoided during high power output operation. The MOCVD re-grow is used in this invention to make the control of the window layer region more accurate without adding HCl in the process.
Patent TW-502200-B (TW)
Title: Cross-shape layout of Chinese stroke labels with lyric
Inventor: SHIAU SHYUE-CHIN
IPC: G06F3/01
Filed: 2000-10-02
Granted: 2002-09-11
Abstract: A layout of five stroke shapes for inputting Chinese characters in a device is disclosed. The layout is cross-shaped with relative positions of the five strokes being helpful to users knowledgeable in Chinese writing. Further, the layout arrangement is accompanied with a lyric which helps users remember and memorize the locations of the five strokes on the keypad. The relative locations of the five strokes are: Pie at the left of the cross, Dian at the right, Heng at the top, Zhe at the bottom, and Shu at the center. The lyric describes the shapes of the strokes and the relative locations of the strokes in the Cross-shaped configuration. For example, the lyric may be ""left slash, right gash, upper over, lower turn with one down in the middle."" The lyric may have a tune to become a song and may be burned in a ROM of a device, such as a mobile phone.
Patent TW-455969-B (TW)
Title: One-step method of forming semiconductor stacked package
Inventor: WANG HSING-SENG
IPC: H01L21/60
Filed: 2000-11-07
Granted: 2001-09-21
Abstract: There is provided a method for applying one reflow process to complete a stacked package after stacking a plurality of semiconductor package devices. After mounting solder balls or spreading solder paste on the upper surface of the chip carrying substrate of the semiconductor package device, a plurality of semiconductor package devices are aligned and stacked, and one reflow step performed so that the substrates of various layers can be electrically and physically connected. If the semiconductor package device is an ultra-thin device, only the upper surface of the substrate of the topmost semiconductor package device and the lower surface of the substrate of the bottommost semiconductor package device are mounted with solder balls or spread with solder paste, and a reflow step can be performed to apply the solder material through the substrates of various layers, thereby completing the electrical connection for the substrates of various layers. This one-step method of forming semiconductor stacked package can simultaneously satisfy the requirements of high package density, simple manufacturing process, and low cost.
Patent TW-542946-B (TW)
Title: Improvements to acquisition and replay system for direct-to-digital holography and holovision
Inventor: THOMAS CLARENCE E
IPC: G03H1/02
Filed: 2001-03-09
Granted: 2003-07-21
Abstract: Improvements to the acquisition and replay systems for direct-to-digital holography and holovision are described. A method of recording an off-axis hologram includes: splitting a laser beam into an object beam and a reference beam; reflecting the reference beam from a reference beam mirror; reflecting the object beam from an illumination beamsplitter; passing the object beam through an objective lens; reflecting the object beam from an object; focusing the reference beam and the object beam at a focal plane of a digital recorder to form an off-axis hologram; digitally recording the off-axis hologram; and transforming the off-axis hologram in accordance with a Fourier transform to obtain a set of results. A method of writing an off-axis hologram includes: passing a laser beam through a spatial light modulator; and focusing the laser beam at a focal plane of a photorefractive crystal to impose a holographic diffraction grating pattern on the photorefractive crystal. A method of replaying an off-axis hologram includes: illuminating a photorefractive crystal having a holographic diffraction grating with a replay beam.
Patent TW-573113-B (TW)
Title: Continuous process and apparatus for the drying and gel formation of solvent-containing gel-forming polymers
Inventor: GEHRMANN DIETRICH
IPC: C08J3/12
Filed: 2001-01-11
Granted: 2004-01-21
Abstract: Solvent containing polymers, especially polysaccharide derivatives, e.g. hot aqueous cellulose ether suspensions, are dried by flash cooling at 0.1-800 hPa. Independent claims are included for: (1) a process in which polymer containing 1-65 %, preferably 10-40 %, solids at a pressure of 6000 hPa and a temperature of 20-100[deg]C, preferably 30-95[deg]C is introduced into an evaporation zone (1) where the pressure is 0.1-800 hPa, preferably 40-200 hPa. The polymer is cooled to 29-60[deg]C and the solvent released by stirrers (8). The solid is removed by a screw feeder to a drier (2) where the solvent content is reduced to  5 %wt; and (2) equipment comprises an evaporator vessel (3) with a stirrer (8), vapor removal (5) and vacuum plant (13). The bottom flights (10) of the stirrer are  5 mm above the exit leading to a screw conveyor.
Patent TW-479283-B (TW)
Title: Method to reduce gate resistance and source/drain leak junction
Inventor: WU BING-CHANG
IPC: H01L21/28
Filed: 2001-02-08
Granted: 2002-03-11
Abstract: This invention provides a method to reduce gate resistance and source/drain leaky junction, especially, in a self-aligned silicide (salicide) process, using a two-step metal layer deposition to form metal silicide at gate and source/drain to reduce the gate resistance and defects at the source/drain producing leaky junction. The method of the present invention uses a two-step metal layer deposition method. A semiconductor substrate is provides having metal oxide semiconductor transistor and shallow trench isolation layer formed. The metal oxide semiconductor transistor contains at least source electrode, drain electrode, gate electrode and spacer formed on the side wall of the gate electrode. An oxide layer is formed on a first metal layer, which is partly etched to expose the first metal layer. The first metal layer at the gate electrode is removed and the rest of the oxide layer is removed. A second metal layer is deposited on the first metal layer and the gate electrode. The salicide process is completed after two rapid thermal processes.
Patent TW-517493-B (TW)
Title: Audio/video processing device
Inventor: PENG MING HSIANG
IPC: H04N5/14
Filed: 2001-03-01
Granted: 2003-01-11
Abstract: The present invention relates to an audio/video processing device, which is to configure the slots of changeable memory storage devices in the main body of audio/video processing device; wherein the slots are connected to the digital signal processor (DSP), and the digital signal processor can use the memory storage device or insertion identification pins of the slots to recognize the level change, so as to determine and confirm the type of memory storage device and whether the device has been inserted into the slots of digital audio/video processing device. After the digital signal processor recognizes the type of audio/video data (such as data formats in MP3, MPEG, JPEG), the compression format will be decoded, and through the digital/audio converter (AV D/A Convert & Amp) for sound and image, and the amplifying process, and further outputting to various audio/video device for use; thus, the device can use different formats of audio/video data.
Patent TW-498329-B (TW)
Title: Semiconductor memory device
Inventor: SAWADA SEIJI
IPC: G11C7/22
Filed: 2001-03-06
Granted: 2002-08-11
Abstract: An internal signal RAS generated in accordance with command input and indicating activation of a row is delayed in accordance with a clock signal int. CLKI, and thereby a sense amplifier activating signal is issued. A time from activation of a word line by a signal WLT to activation of a sense amplifier can be longer than that in a normal case so that a minute leak from a bit line can be detected.
Patent TW-588019-B (TW)
Title: Method for treatment of waste water by contacting activated sludge with sarcosine compounds
Inventor: IDE TOSHIO
IPC: C02F3/12
Filed: 2001-03-21
Granted: 2004-05-21
Abstract: The purpose of the present invention is to provide a treating method of waste water which enables forming activated sludge which allows excellent sedimentation and satisfactory treated water quality and reducing the amount of excess sludge generation. Sarcosine compounds are brought into contact with the activated sludge.
Patent TW-494523-B (TW)
Title: Processing device
Inventor: HAYASHI YOSHINOBU
IPC: H01L21/00
Filed: 2001-04-04
Granted: 2002-07-11
Abstract: The processing device of the present invention includes: a transfer part (4) having a container disposed therein for performing taking out therefrom of a not-yet-processed object and loading therein the already-processed object; processing parts (11 through 18) for performing the predetermined processing on the object; and a plurality of conveying units (21, 22) conveying the object between a first position for delivery of the object with the container disposed in the transfer part and a second position for delivery of the object with the processing part, and each of the plurality of conveying units can move between the first position and second position; a moving path of the conveying units includes a plurality of paths each along an arrangement of the processing parts; and each of the conveying units can solely perform delivery of the object with the processing part on both sides or the transfer part.
Patent TW-486790-B (TW)
Title: Semiconductor packaging device having a pad guiding gap
Inventor: HUNG JIN-YUAN
IPC: H01L23/02
Filed: 2001-04-12
Granted: 2002-05-11
Abstract: A semiconductor packaging device having a window pad comprises: a semiconductor chip; an encapsulant which forms a package of the semiconductor chip by flowing melting molding resin; a window pad for mounting the semiconductor chip, which has a upper surface and an opposite bottom surface, wherein at least one through hole is set up at the center of the window pad to form an inner frame of the window pad, and by taking the inner frame of the window pad as a starting point, many guiding gaps are set up on the bottom surface of the window pad and those guiding gaps flow outward to the outer edge of the window pad along the sealing resin; many pins; and a plurality of gold wires that electrically connects the chip and the pins. Many guiding gaps following the direction of the resin flows are set up on the bottom surface of the window pad of the semiconductor packaging device in order to lower the possibility in that voids resulted from the turbulence while the resin molding flows through the window pad. Meanwhile, the guiding gap is simultaneously etched while manufacturing of the window pad so that the overall cost of the packaging device will not be increased.
Patent TW-470830-B (TW)
Title: A method and a die for manufacturing a V-block of a metal belt type continuous transmission
Inventor: WAKUI HIROSHI
IPC: F16G5/16
Filed: 2001-04-13
Granted: 2002-01-01
Abstract: A method for manufacturing a V-block of a metal belt type continuous transmission is provided. The V-block is formed by punching a V-block press material with a main punch and a counter punch. The V-block press material has a sectional view including an outer portion of about uniform width and a tapered inner portion with a slant gently inclined toward an innermost end of the material from a place distant from a rocking edge by a predetermined distance inward. The main punch and the counter punch have front shapes of the substantially same as that of the V-block, and either punch facing the rocking edge has a slant starting at a place corresponding to the rocking edge and extending inward rising gradually.
Patent TW-592764-B (TW)
Title: Electronic device
Inventor: YAMAZAKI KOUICHI
IPC: G11B31/02
Filed: 2001-04-30
Granted: 2004-06-21
Abstract: An electronic device having a circuit board, a shielding plate disposed thereon and a three-terminal regulator is provided with a heat sink positioned on the outer side of the circuit board and connected to the three-terminal regulator. The heat of three-terminal regulator is radiated from the heat sink, thus making it possible to prevent heating of the shielding plate. In this way, electronic device elements that do not stand up very well to heat, such as an optical pickup unit, can be placed directly on shielding plate, so that the heat of three-terminal regulator is efficiently dissipated and the size of the electronic devices may be reduced.
Patent TW-563350-B (TW)
Title: Color image processing apparatus executing moving-average processing for noise reduction in color image signals
Inventor: KUBO SHINYA
IPC: G06T5/00
Filed: 2001-08-08
Granted: 2003-11-21
Abstract: The color image processing apparatus of the present invention selects, on the basis of a moving average number n of pixels calculated by a predetermined numerical formula with respect to any notable pixel i, n number of reference pixels j located before and after the notable pixel i, and calculates an absolute value of a difference between an output of respective of the selected reference pixels j and that of the notable pixel i. Then, a moving average processing is executed by using only some reference pixels j of which the absolute value of the difference between each of their output levels and the output level of the notable pixel i is smaller than a threshold value.
Patent TW-492885-B (TW)
Title: Load device for exercise machine
Inventor: JANG JENG-SHAN
IPC: A63B21/00
Filed: 2001-08-13
Granted: 2002-07-01
Abstract: The present invention provides a load device for an exercise machine, which comprises a body; a force application unit, a force receiving unit, a magnetic powder clutch, and a control unit. The force application unit comprises a driving motor and a first transmission component driven by the motor. The force receiving unit comprises a rotation shaft and a second transmission component driving the rotation shaft upon receiving a force from a user. The magnetic powder clutch comprises a driving part, a driven part rotationally housed in the driving part, a specified amount of magnetic powder located between the driving part and the driven part, and an electromagnetic coil located on the outside of the driving part. The driving part is connected to the first transmission component and rotates. The driven part is connected to the rotation shaft and rotates simultaneously therewith. Upon receiving a power, the electromagnetic coil transmits a torque from the driving motor to the rotation shaft so that the rotation shaft has an opposite load torque when it rotates upon receiving a force from a user.
Patent TW-521545-B (TW)
Title: Method and system for a lumped-distributed balun
Inventor: DAO ANDY
IPC: H03H7/42
Filed: 2001-09-14
Granted: 2003-02-21
Abstract: Systems to provide and methods to design a printed lumped-distributed balun are presented. A lumped-distributed balun includes a single-ended port, a first differential port, a second differential port, a first phase shifter circuit, and a second phase shifter circuit. The first phase shifter circuit includes a first inductor and a first capacitor. The first inductor is coupled to the single-ended port and the first differential port. The first capacitor is coupled to the first differential port and is adapted to be coupled to ground potential. At least one of the first inductor and the first capacitor is implemented as a transmission line structure, such as microstrip. The second phase shifter circuit includes a second inductor and a second capacitor. The second inductor is coupled to the second differential port and is adapted to be coupled to ground potential. The second capacitor is coupled to the single-ended port and the second differential port. At least one of the second inductor and the second capacitor is implemented as a lumped element.