baber/WOPTO huggingface dataset:
Patent TW-423043-B (TW)
Title: A chemical mechanical polishing apparatus and a polishing cloth for a chemical mechanical polishing apparatus
Inventor: KATO NOBUHIRO
IPC: B24B53/017
Filed: 1997-10-23
Granted: 2001-02-21
Abstract: The present invention provides a CMP apparatus for minimizing the deterioration of the polishing performance and allows easy detection of the its useful operational limit. The CMP apparatus for polishing of the semiconductor substrate is provided with a dresser for removing abrasive grains which have fallen onto the polishing cloth. A particle remover is provided for easily removing abrasive grains at approximately the same time or at a different time as the dressing process. The polishing cloth includes a use limit indicator formed in a concavity of the cloth. Upon the exposure of the use limit indicator, the limit of the polishing cloth can be easily detected.
Patent TW-432908-B (TW)
Title: Switch cabinet
Inventor: NICOLAI WALTER
IPC: H02B1/01
Filed: 1997-11-18
Granted: 2001-05-01
Abstract: This invention relates to a switch cabinet with a frame, which has horizontal and vertical frame profiles, whereby the horizontal profiles construct a bottom frame and a cover frame, whereby in the corner ranges of the bottom- and cover frames the vertical frame profiles can be fixed, and whereby the vertical frame profiles are symmetrical to the virtual cross sectional diagonals, which extend through the vertical exterior edges of the frame. A great variability can be realized for mounting the assemblies in the interior space of the switch cabinet, so that the vertical frame profiles facing the interior space of the cabinet are provided with an open internal receiver, which is formed from two interior walls and extends in the longitudinal direction of the profile, and that in the internal receiver the vertical montage rails can be inserted, and that on the interior walls a profile side is connected respectively, the profile side is vertical to the outside of the frame, and that the interior walls, the montage rails and the profile sides are provided with a series of fastening adapters that are brought into the partition rasters.
Patent TW-404031-B (TW)
Title: System, apparatus, and method for connecting a semiconductor chip to a three-dimensional leadframe
Inventor: TEST HOWARD R
IPC: B23K20/00
Filed: 1998-03-05
Granted: 2000-09-01
Abstract: A system (270, 370) for connecting a semiconductor chip (22, 322) to a leadframe (12), the system (270, 370) includes a three-dimensional leadframe (12) and a bonding support mechanism (202, 302, 402). The leadframe (12) may include a first lead (32, 132, 332, 432) having a first base portion (144), a first lead tip (42, 142, 342, 442), and a first longitudinal axis (305); a second lead (30, 130, 330, 430) having a second base portion (140, 321), a second lead tip (36, 136, 336, 436), and a second longitudinal axis. The first lead (32, 132, 332, 432) and second lead (30, 130, 330, 430) formed substantially adjacent to each other, and the second lead (30, 130, 330, 430) having a stepped portion (38,  138, 338, 438) such that the lead tips (42, 142, 342, 442, 36, 136, 336, 436) of the first lead (132, 332, 432) and second lead (130, 330, 430) are separated in a Z-direction (52) and in a Y-direction (52). The bonding support mechanism (202, 302) for holding the three-dimensional leadframe (12) may include a support body (215, 315), a trough (203, 303) formed on the support body (215, 315). The trough (203, 303) may have a first surface (204,304) at a first elevation, where the first surface (204, 304) is for supporting the second lead tip (36, 136, 336). A second surface (206, 306) may be formed on the support body (215, 315) at a second elevation and substantially adjacent to the first surface (204, 304). The second surface (206, 306) is for supporting the first lead tip (42, 142, 342). The first elevation and second elevation may be displaced from each other. The bonding support mechanism (202, 302) may have an angled surface (210, 310) for accommodating a stepped portion (38, 138, 338, 438) of the second lead (30, 130, 330) and may have additional support surfaces (376, 319).
Patent TW-397670-B (TW)
Title: Manufacturing method for QQ Eggs
Inventor: WANG CHI-SHIANG
IPC: A23L15/00
Filed: 1998-01-07
Granted: 2000-07-11
Abstract: This is a manufacturing method of QQ Egg. Fresh eggs is soaked in a vessel containing solution of 30 degree salinity for 15 days to set the egg yolk. The eggs later are taken out and placed into an aqueous solution containing 1000g sodium hydroxide + 50g tea powder + 20g liquorice powder + 30g Japanese star anise + 30g pepper for a 4-day soaking so that the egg white may gradually absorb this solution and become setting before being steamed/cooked to totally setting and vacuum-packaged. After this process, the egg yolk possess a salty flavor and its surrounding egg white is chewy with a tea fragrance resulting in an excellent texture.
Patent TW-365012-B (TW)
Title: Leak circuit breaker
Inventor: IKEHARI YOUJI
IPC: H01H71/40
Filed: 1998-01-23
Granted: 1999-07-21
Abstract: A kind of leak circuit breaker which is provided by the same shape size composed of signal electrode as for two electrodes. The leak circuit breaker is a type of two electrodes and two components inserted into a framework which is made of synthetic resin and all the mechanism are modularized such as the over-current breaker apparatus, the current leak breaker apparatus, the open/close mechanism, and the breaker rod portions.
Patent TW-360745-B (TW)
Title: Water cooling structure for two cycle engine with exhaust control valve
Inventor: SUZUKI MAKOTO
IPC: F01N13/08
Filed: 1998-01-26
Granted: 1999-06-11
Abstract: To provide a water jacket which can cool a bearing part of an exhaust open/close valve efficiently while keeping inside an exhaust cylinder at a high temperature, in a two cycle engine equipped with the exhaust switch valve in an exhaust cylinder. An exhaust cylinder 3 is provided integrally with a cylinder block 1 and a bearing part for supporting an exhaust open/close valve 9 is projected by provided in both end parts of the exhaust cylinder 3 and a bearing cooling part 10 is provided in the bearing part. A C-shaped bearing water jacket 13 is provided on one the of bearing parts 7 and a water passage 11 from a divided flow part 4a of a cylinder block water jacket 4 is communicated with its lower end. A C-shape bearing water jacket and a water passage are provided on the other bearing and upper ends of both bearing water jackets are communicated by a communicating path 15. Cooling water goes out of a converging point through the divided flow part 4a, the bearing water jacket 13 and the communicating path 15. 16 represents an inner ring hole and projected part of a sand core for the bearing cooling part 10 passes the hole and supported at outside.
Patent TW-473863-B (TW)
Title: Wafer processing apparatus, wafer processing method, and SOI wafer fabrication method
Inventor: SAKAGUCHI KIYOFUMI
IPC: H01L21/02
Filed: 1998-02-03
Granted: 2002-01-21
Abstract: A wafer is supported while being rotated by four wafer rotating rods having grooves. The wafer rotating rods are rotated by a driving force transmitted from a motor installed outside a wafer processing bath. An ultrasonic bath is arranged below the wafer processing bath, and ultrasonic waves generated by an ultrasonic source are transmitted to the wafer processing bath. The ultrasonic waves are efficiently transmitted to the wafer because the wafer is supported only by the wafer rotating rods.
Patent TW-386167-B (TW)
Title: optical fiber cable
Inventor: ISHIKAWA HIROKI
IPC: G02B6/44
Filed: 1998-05-29
Granted: 2000-04-01
Abstract: An optical fiber cable is constituted by a cylindrical spacer having on its surface helical grooves reversing their direction at a given pitch in which a stack of ribbon optical fibers is received. In the optical fiber cable, the reverse angle <phi> of the groove is 210 DEG <=<phi><=330DEG; the groove has a size to contain a virtual circle therein whose diameter D is represented by equation of D = (w<2>+(N*T)<2>)<1/2> where W is the width of the ribbon optical fiber, T is the thickness of the ribbon optical fiber, and N is the number of the ribbon optical fibers stacked in a groove; the angle <theta> formed between each of side walls of the groove and a line connecting the center of the bottom of the groove and the center of the spacer varies periodically; and the angle <theta> of the side wall on the inner side of the curvature of the center of the groove increases continuously and monotonously at least over the part extending from a position distant from a helical portion between adjacent reverse portions at approximately 90 DEG in a circumferential direction to the next reverse portion.
Patent TW-375746-B (TW)
Title: Motor coil for time piece
Inventor: BETTELINI MARCO
IPC: H02K3/52
Filed: 1998-06-30
Granted: 1999-12-01
Abstract: The coil (1) of the motor includes a coil body carrying two flanges (7, 8). Made in one piece with one of the flanges (8), a plate (10) covers a lug (4) of the core. This plate (10) acts as anchoring point for the output wire (11, 12) of a wire winding (9) by incrustation of the end zone (13, 14) of each of said wires in the plate. Prior to reaching the end zones (13, 14), a hole (16, 17) arranged perpendicular to the wires and ending in this channel, being made both in the plate and in the lug.
Patent TW-434171-B (TW)
Title: Device for connecting a discharge and return tube to a bung connection of a container for liquids and the like
Inventor: LEIFFLS JOACHIM
IPC: B67D7/34
Filed: 1998-08-04
Granted: 2001-05-16
Abstract: Device for connecting a discharge and return tube to a bung connection of a container for liquids and the like, said connection being embodied with inner screw thread, which device comprises: a cylindrical insert with screw thread arranged on the cylinder outer wall and coacting with the bung, in addition to a bottom provided with at least two openings, a tube connecting bung for placing with the lower surface on this bottom and provided with passages for the discharge and return tube aligned with these openings, and a clamping piece for fixing the connecting bung in the cylindrical insert via connecting means, wherein there are arranged lugs placed in a determined pattern and recesses receiving these lugs, wherein the clamping piece is connected non-slidably in axial direction to the bung but freely rotatable relative thereto, and wherein the connecting means in the insert are arranged at a distance from the bottom in order to form a chamber, the recesses are placed above the chamber in the insert and the lugs lie on a downward extended part of the clamping piece and at a distance below the connecting means, whereby the tube to be connected onto the container remains free of tension.
Patent TW-382817-B (TW)
Title: Semiconductor device and method of fabricating same
Inventor: NISHIMURA TADASHI
IPC: H01L23/485
Filed: 1998-07-23
Granted: 2000-02-21
Abstract: To provide a semiconductor device for CSP(chip size package) mounting, wherein the radiation damage of <alpha>-ray is avoided, as well as provides a high resistance to stress. On a semiconductor substrate 101 an embedded oxide film 107 is formed, and on the embedded oxide film 107 an MOS transistor comprising an SOI(silicon-on-insulator) structure is formed. The MOS transistor comprises source/drain regions 120a and 120b formed on a semiconductor layer 120 and a gate electrode 110. On a interlayer insulating film 108, an aluminum pad 103 connected to either of the source/drain region 120a or 120b, and a silicon nitride film 104 for opening the upper part of an aluminum pad 103 are formed. A titanium layer 105 and a nickel layer 106 are bridged between the aluminum pad 103 and the silicon nitride film 104, with a solder bump 11 provided at the nickel layer 106.
Patent TW-414981-B (TW)
Title: Bending and forming method of fabricating exposed leadframes for semiconductor devices
Inventor: CARTER JR BUFORD H
IPC: H01L23/495
Filed: 1998-08-14
Granted: 2000-12-11
Abstract: The invention relates to a single piece leadframe that can be used in current semiconductor device production. The leadframe has a plurality of segments in a horizontal plane, a chip mount pad in a different horizontal plane, and another plurality of segments connecting said chip mount pad with said leadframe. The latter plurality of segments has a geometry designed so as to tolerate bending and stretching beyond the limit of simple elongation based upon the inherent material characteristics. The chip mount pad of said leadframe provides direct thermal contact to an external heat conductor or heat sink by being designed so as to extend through the encapsulating package. The exposed chip pad can also be used electrically as a ground connection.
Patent TW-412666-B (TW)
Title: Image forming apparatus
Inventor: NISHIMURA SHIGEKI
IPC: G03G15/08
Filed: 1998-11-04
Granted: 2000-11-21
Abstract: To accurately control the image density with limited numbers of sensors. A long tape-shaped patch is formed in the axial direction of the photo-sensor based on the difference (contrast potential) of the charged potential from BCR3 and development bias without ROS4. The toner correction value computing portion 22 computes the correction value of toner supply based on the density of the tape patch detected by the density sensor 6. With this correction value, it corrects the indicating amount of toner supply according to the image amount. The toner detecting portion 23 detects the condition that the toner supply device 51 becomes empty due to the density change of tape patch. The impressed voltage of BCR3 and the development bias are corrected in accordance with the consumption quantity of photo-sensor 1, charged power and environment conditions, etc.
Patent TW-434755-B (TW)
Title: Method for making semiconductors
Inventor: HYODO HARUO
IPC: H01L21/56
Filed: 1998-11-05
Granted: 2001-05-16
Abstract: The present invention provides a method for making semiconductors, which is able to increase the efficient area rate in installation and decrease the manufacturing cost. The method comprises preparing a common substrate 30 having at least an island 33 and wire terminal 34; performing die mounting for the semiconductor chip 39 and wire connecting on the common substrate 30; then, supplying resin 52 to encapsulate all semiconductor chips; leveling the bent surface of the resin 52 to have a flat surface by processing; and cutting the resin 52 and the common substrate 30 at the same time for separating individual semiconductor device.
Patent TW-388073-B (TW)
Title: Liquid phase deposition method for growing titanium oxide on GaAs substrate
Inventor: LI MING-KUEI
IPC: H01L21/208
Filed: 1998-12-31
Granted: 2000-04-21
Abstract: A liquid phase deposition method for growing titanium oxide on GaAs substrate is disclosed, H2TiF6 solution is added with HNO3 or H3BO3 to grow titanium oxide thin film on the GaAs. The resultant refractive index is around 2.5. The growth rate can be easily controlled by the concentration of HNO3. Other advantages are such as low manufacturing cost and having low growing temperature. This method not only meets the requirement of mass production but also eliminates the drawbacks of other methods with high-cost apparatus or high-temperature process. Therefore, this method has enough potential in the semiconductor manufacturing process; for example, it can be applied to the memory with high dielectric constant. In addition, because the titanium oxide is with special photoelectric feature, it can be applied to photoelectric compound semiconductor devices, such as wave-guide, photo filter and anti-reflecting coating. From the above mentioned, using liquid phase deposition method to grow titanium oxide on GaAs is practical and valuable.
Patent TW-403984-B (TW)
Title: Apparatus for testing the reliability of integrated circuit and sieving out bad products
Inventor: LIOU SHING-MING
IPC: H01L21/66
Filed: 1999-03-01
Granted: 2000-09-01
Abstract: An apparatus for testing the reliability of integrated circuit and sieving out bad products, which includes signal generation board, connection card, main board, signal transmission board, multiple daughter boards and multiple socket cards (the sockets whereon are used to allocate or insert integrated circuit). After the signal generation board generates test signals, the signals then flow into the main board and the signal transmission board via the connection card, after that, the signals flow into the multiple daughter boards through some electronic circuits on the main board and the signal transmission board, finally, the test signals flow into the integrated circuits for testing on the multiple socket cards after the signals pass through some electronic circuits on the multiple daughter boards.
Patent TW-410397-B (TW)
Title: Gas ring used in etching apparatus
Inventor: LAN SHR-TUNG
IPC: H01L21/3065
Filed: 1999-03-30
Granted: 2000-11-01
Abstract: A gas ring used in an etching apparatus is provided. The gas ring includes a ring body on the bottom of a reacting chamber: a gas ring groove at the bottom surface of the ring body and recessed in the ring body facing downward, and a un-rectangular turned angle at the connection between the groove margin and the bottom surface of the ring body; a plurality of gas holes through from the upper surface of the ring body to the gas ring groove; two gas ring seals on the bottom surface of the ring body and at outside surface and inside surface of the gas ring groove respectively; and an insulating layer over the whole surface of the ring body. The gas ring can prevent erosion from etching gas and reducing reaction chamber damage.
Patent TW-434992-B (TW)
Title: Current source apparatus with temperature compensation function
Inventor: HORNG JAW-JUINN
IPC: H01L29/66
Filed: 1999-07-16
Granted: 2001-05-16
Abstract: A kind of current source apparatus having temperature compensation function can be used for any fabricating process that includes CMOS, BJT, HBT, GaAs, ..., and so on. By using simple devices, such as Schottky diode, resistor, and depletion type FET transistor, to match the special symmetrical-circuit structure, the compensation of temperature variation can be performed in order to decrease the influence of temperature on current such that the product yield of total fabricating process is improved.
Patent TW-594879-B (TW)
Title: Process for optimizing mechanical strength of nanoporous silica
Inventor: WU HUI-JUNG
IPC: C01B33/152
Filed: 1999-08-17
Granted: 2004-06-21
Abstract: A process for forming a nanoporous dielectric coating on a substrate. The process includes forming a substantially uniform alkoxysilane gel composition on a surface of a substrate, which alkoxysilane gel composition comprises a combination of at least one alkoxysilane, an organic solvent composition, water, and an optional base catalyst; heating the substrate for a sufficient time and at a sufficient temperature in an organic solvent vapor atmosphere to thereby condense the gel composition; and then curing the gel composition to form a nanoporous dielectric coating having high mechanical strength on the substrate.
Patent TW-463066-B (TW)
Title: Fiber optic cabinet and tray
Inventor: REITMEIER WADE P
IPC: G02B6/44
Filed: 1999-09-09
Granted: 2001-11-11
Abstract: A fiber optic cabinet has internal aligned guides on opposite sides of an axis opening. A splice tray has a planar tray base with a tray axis orthogonal to the base. The base has a peripheral edge sized for opposite portions of the peripheral edge to be slidably engaged with opposing ones of the aligned cabinet guides. The tray base is slidably received within the aligned guides regardless of a rotational position of the tray base about the tray axis. A fiber pathway guide is carried on the tray base for receiving a wound amount of optical fiber on the guide as the tray base is rotated about the tray axis.
Patent TW-419386-B (TW)
Title: Improved respiratory suction catheter apparatus
Inventor: CRUMP CHET M
IPC: A61M16/04
Filed: 1999-12-15
Granted: 2001-01-21
Abstract: An improved respiratory suction apparatus catheter includes a manifold for attachment to the distal hub of an endotracheal tube to form a respiration circuit, a catheter tube which is displaceable through the manifold and into the endotracheal tube to suction secretions from the tube and lungs, and a valve mechanism disposed adjacent the respiration circuit to minimize the draw of air from the respiration circuit of a patient while the catheter tube is being cleaned. In a preferred embodiment of the invention, the catheter tube is cleaned more thoroughly than in the prior art while simultaneously drawing little or no air from the patient's respiration circuit.
Patent TW-434885-B (TW)
Title: Trench-capacitor with isolation-collar and its corresponding manufacturing method
Inventor: HEINECK LARS-PETER
IPC: H01L27/108
Filed: 1999-09-22
Granted: 2001-05-16
Abstract: This invention relates to a trench-capacitor, especially for application in a semiconductor memory-cell, said capacitor includes: a trench (100), which is formed in a substrate (10); a region, which is provided in the substrate (10) as a first capacitor-plate; an isolation-collar (110), which is formed in the upper region of the collar (100); a dielectric layer (60) on the trench-wall as the capacitor-dielectric; a conductive filling-material (50), which is filled in the trench (100) as a 2nd capacitor-plate; wherein at least one part of the dielectric layer (60) surrounds the isolation-collar (110). This invention also relates to a manufacturing method of said trench-capacitor.
Patent TW-434061-B (TW)
Title: Furnace for melting aluminum block and holding the melt
Inventor: OKADA TAMIO
IPC: F27D1/00
Filed: 1999-10-20
Granted: 2001-05-16
Abstract: A furnace for melting and holding aluminum blocks, comprising an aluminum block preheating tower, a melting crucible furnace for receiving aluminum blocks supplied from the preheating tower while being disposed directly below the preheating tower, and a holding crucible furnace for continuously receiving molten metal supplied from the first furnace while being juxtaposed to the first furnace, characterized by being constructed such that combustion exhaust gas used in the first furnace can be supplied as an ascending air current into the preheating tower for heat exchanging with the aluminum blocks, whereby continuous molten metal melting and energy saving being attained.
Patent TW-429573-B (TW)
Title: Method for improving the copper metal processing
Inventor: CHEN SHENG-SHIUNG
IPC: H01L23/50
Filed: 1999-11-05
Granted: 2001-04-11
Abstract: The present invention discloses a manufacturing method for alleviating the insufficient adhesion problem between the copper wire and the barrier, which comprises: providing a silicon substrate having a combination of the integrated circuit devices; using a damascene structure and copper processing to form the copper on the combination of integrated circuit device for being used as the interconnect; next, depositing a dielectric passivation on the copper wire and forming the first photoresist on the dielectric passivation; then, using the first photoresist as the mask to form the position of wire bonding with dry etching; then, using the rapid thermal annealing process to form rugged copper oxide metal with mushroom-shaped surface on the surface of the copper wires; then, injecting the reduction gas for reducing the rugged oxide metal to rugged copper metal; and, depositing a barrier on the semiconductor substrate; depositing an aluminum metal layer on the barrier; next, forming a second photoresist to define the pattern of wire bonding package; and finally, etching the wire bonding pattern.