baber/WOPTO huggingface dataset:
Patent TW-472376-B (TW)
Title: Base board structure for integrated circuit package and the manufacturing method of the same
Inventor: HE MENG-NAN
IPC: H01L23/492
Filed: 2000-11-16
Granted: 2002-01-11
Abstract: The present invention relates to the base board used for integrated circuit package and its manufacturing method, in which the base board is used to connect with the circuit board and is provided with multiple metal sheets mutually arranged in order. Each metal sheet is also provided with the first surface and the second surface. These multiple metal sheets are encapsulated by an encapsulation body to form the base board, in which the first surfaces and the second surfaces of these multiple metal sheets are exposed from the encapsulation body to form signal input terminals used for connecting with the integrated circuit, and to form signal output terminals used for connecting with the circuit board. Thus, the signal output terminals formed by the metal sheets can be smoothly and electrically connected with the circuit board. In addition, it is capable of decreasing signal transmission length between integrated circuit and circuit board effectively so as to have better signal transmission.
Patent TW-466805-B (TW)
Title: IC card connector
Inventor: NISHIOKA TORU
IPC: G06K17/00
Filed: 2000-12-13
Granted: 2001-12-01
Abstract: The subject of the present invention is to provide a kind of IC card connector that has the IC card connector structure with a mechanism for ejecting an IC card. When an IC card is inserted, a locking member is used to truly hold a slide member in an IC card inserted position. In addition, when the IC card is ejected, the slide member is operated to eject the IC card. The solving means of the present invention is described in the following. The IC card connector includes a slide member 7, which is capable of sliding in a direction in which an IC card 3 loaded in and unloaded from a housing is inserted and ejected; a return spring 5, which pushes and compels the slide member 7 in the direction in which the IC card 3 is ejected; and a locking member 6, which holds the slide member 7 in the position where the IC card 3 is loaded against pushing and compelling force of the return spring. The locking member 6 is supported with the capability of turning. The anchoring part 6b, which can be engaged in and disengaged from the slide member 7, and a turning operation part 6c, which makes the anchoring part 6b turn in a departing direction from the status of latching with the slide member 7, abut the slide member 7 and link the action of IC card insertion direction for the slide member 7 to make the anchoring part 6b latch at the slide member 7. Additionally, the pressed operation part 6d, which links the action of turning operation part 6c to make the slide member 7 press in the IC card eject direction, is formed.
Patent TW-475972-B (TW)
Title: Cylinder head for an internal combustion engine
Inventor: KOMATSUDA TAKASHI
IPC: F02F1/00
Filed: 2001-02-09
Granted: 2002-02-11
Abstract: In a cylinder head 1 of an internal combustion engine, communicating passageways 17, 18, 17', 18' for coolant are provided between combustion chambers 3 and pass-through holes 21 to 28 at positions which overlap straight lines L1, L2 connecting centers C2, C3 of the exhaust port openings 6a, 7a with centers C5 to C8 of the pass-through holes 25 to 28 and straight lines L3, L4 connecting centers C9, C10 of the intake port openings 4a, 5a with centers C11 to C14 of pass-through holes 21 to 24 when a mating surface 2 of the cylinder head 1 with the cylinder block is viewed from the bottom. When peripheries of the exhaust port openings 6a, 7a and intake port openings 4a, 5a thermally expand, the suppression of thermal expansion by the bolts at fastening portions is alleviated by the communicating passageways 17, 18, 17', 18'.
Patent TW-478207-B (TW)
Title: Bonding materials
Inventor: SAKAIRI MIKIO
IPC: H05K3/32
Filed: 2001-02-19
Granted: 2002-03-01
Abstract: The subject of the present invention provides a bonding material with excellent bonding capability, electrical connection and insulation. The bonding material is to bond with a pair of components to be connected on the surfaces formed with a plurality of electrodes. Even external high voltage or high current is applied between the opposite electrodes of each connected components, there is no short circuit between the adjacent electrodes. The solution is that the metal ion capturing agent grains 8 added in the bonding material 5 of the invention is composed of bismuth group ion exchange agent or the ethylene trioxide composite, in which the grains have the average diameter smaller than the conductive grains 7. Thus, with the bonding material 5 in the invention for bonding the connection components 20, 30, the adjacent electrodes 2, 4 will not have short circuits even though an external high voltage is applied on the opposite electrodes 2, 4.
Patent TW-480676-B (TW)
Title: Manufacturing method of flash memory cell
Inventor: LIN CHI-HUEI
IPC: H01L27/115
Filed: 2001-03-28
Granted: 2002-03-21
Abstract: There is provided a manufacturing method of flash memory cell, which comprises: forming an active area on the surface of a semiconductor substrate, and sequentially forming a conductive layer and a buffer layer in the active area; removing part of the buffer layer, defining a first opening and forming a buffer sidewall in the opening; removing the conductive layer below the first opening to form a second opening, wherein a contact sidewall layer, a source area and a contact plug are sequentially formed; removing the buffer sidewall layer to provide a third opening; forming oxide layers on the surface of the conductive layer in the opening and on the top of the contact plug, respectively; filling another buffer sidewall layer in the third opening; removing the remained buffer layer to provide a fourth opening; removing the conductive layer at the bottom of the fourth opening, and retaining the partially formed floating gate below the oxide layer; and forming a control gate and a control gate sidewall layer on the sidewall of the fourth opening.
Patent TW-496835-B (TW)
Title: Push-button steering wheel lock
Inventor: MEEKMA GLENN
IPC: B60R25/02
Filed: 2001-03-30
Granted: 2002-08-01
Abstract: A push-button steering wheel lock for attachment to an automobile steering wheel is provided having a housing and a push-button assembly disposed in the housing. The assembly is positioned in either a locked position for securing the steering wheel lock to the steering wheel or an unlocked position. In the locked position, the push-button lock assembly engages a rod slideably disposed in the housing to prevent movement of the rod with respect to the housing. The push-button assembly also includes two levers, one each on either side of the assembly to engage two surfaces within the housing to retain the push- button assembly in the locked position and also to retain the push-button assembly in the housing.
Patent TW-I259430-B (TW)
Title: Liquid crystal display device
Inventor: OOWAKI YOSHIO
IPC: G09G3/36
Filed: 2001-04-23
Granted: 2006-08-01
Abstract: In a liquid crystal display device comprising a liquid crystal display element, a plurality of driving circuits being provided for the liquid crystal display element at least one of which has at least one output terminal being not connected to any signal lines of the liquid crystal element, and a display control device transmitting display data including that corresponding to the at least one output terminal (i.e. an ineffective display datum) to the plurality of driving circuits, the present invention transmits another datum being transmitted either prior to or subsequently to the ineffective display datum which corresponds to another output line being connected to one of signal lines of the liquid crystal element to the at least one of the plurality of driving circuits instead of the ineffective display datum and reduces transmission frequency of a bus line of the liquid crystal display device.
Patent TW-490826-B (TW)
Title: Semiconductor package device and its manufacture method
Inventor: KE JIUN-JI
IPC: H01L23/498
Filed: 2001-05-02
Granted: 2002-06-11
Abstract: This invention provides a semiconductor package device, which consists of: a leadframe containing a first surface and a second surface and containing a chip support and a plural number of leads, the leads being separated from the chip support with an adequate distance, the leads consisting of inner leads, outer leads and middle parts between the inner leads and the outer leads, an adequate distance being provided between individually aligned leads, and a protruding part being formed by the two sides of the middle parts to make the distance between the individually aligned middle parts smaller than that of the individual leads; a molding compound to encapsulate the first surface of the of the leadframe, the middle parts of the leads and the second surface of the leadframe so that a receiving space is formed on the first surface to carry the chip support and inner leads and also to bond chip; a semiconductor chip placed on the chip support and carried by the first surface of the leadframe; a plural number of solder wiring connecting the semiconductor chip and the inner leads to electrically link the chip with the leadframe; and a cap part to cover the opening of the receiving space. Because the middle parts of the leads form a protruding part towards the both sides, the seams within the middle parts are reduced and the flow rate of the sealing resin is reduced during the resin sealing process. Therefore, the area on the leads and the possibility of resin flash are decreased. Meanwhile, the modified leadframe is improved without increasing its size and the manufacturing steps, thereby simplifying the manufacturing process and reducing the manufacturing cost.
Patent TW-514870-B (TW)
Title: A magnetic disk drive and the control method thereof
Inventor: SHIMOKOSHI MASAYOSHI
IPC: G11B5/55
Filed: 2001-05-16
Granted: 2002-12-21
Abstract: The present invention relates to a type of magnetic disk drive and, in particular, a positioning technology for magnetic head of high track density. Also, the position information of the magnetic head is provided in the data area for increasing the positioning precision. The magnetic disk drive has the function to provide a specific number of cycles in the data area to limit the movement of the magnetic head within the radius of the disk and can, detect the reproduction signals so to obtain position information of the magnetic head while performing such function. Positioning control of the magnetic head can also be carried out in the data area when it is not necessary to generate position signals of the magnetic head in accordance with the number of cycles of the stored sample signal produced by the servo data area. Therefore, data recording density can be increased, high-precision magnetic head position control can be achieved, and reliability of the magnetic disk drive can be improved.
Patent TW-511453-B (TW)
Title: EMI preventing device and its manufacturing method
Inventor: HU SHIANG-CHI
IPC: H05K9/00
Filed: 2001-05-21
Granted: 2002-11-21
Abstract: There are provided an EMI (electromagnetic interference) preventing device and its manufacturing method. At first, a printed circuit board with completed layout and a plurality of electronic devices is provided. Based on the electronic device layout pattern to be shielded, a frame prototype is drew, so as to define a corresponding mold to mold a metal frame. The metal frame is also defined with a plurality of openings corresponding to the number of electronic devices to be shielded, so as to receive the electronic devices and weld the metal frame to the printed circuit board. Finally, a metal foil is adhered on the opening of the metal frame, so as to form a plurality of shielding spaces for blocking the electromagnetic radiation, thereby constructing an EMI preventing device. The metal frame is manufactured and shaped entirely based on the proportion of the circuit layout pattern on the printed circuit board, so as to complete assembly by one time without combining and connecting. Furthermore, it is able to perform the operation of local circuit repairing by simply removing the metal foil.
Patent TW-I228720-B (TW)
Title: Method for sensing data stored in a ferroelectric random access memory device
Inventor: CHOI MUN-KYU
IPC: G11C11/22
Filed: 2001-06-15
Granted: 2005-03-01
Abstract: A ferroelectric random access memory device of the present invention includes an access transistor having a gate connected to a word line and a current path connected between a bit line and an internal cell node a ferroelectric capacitor connected between the internal cell node and a plate line, and a reference voltage generator having a linear paraelectrics capacitor for generating a reference voltage. According to the method for sensing data stored in the ferroelectric capacitor, first, the word line is activated so as to connect the ferroelectric capacitor to the bit line. Then, the plate line is activated and simultaneously the reference capacitor is connected to a complementary bit line. After a voltage difference between the bit line and the complementary bit line is detected, the reference capacitor is insulated from the complementary bit line.
Patent TW-502416-B (TW)
Title: Semiconductor chip package structure
Inventor: TSENG KUO-CHAN
IPC: H01L23/34
Filed: 2001-07-27
Granted: 2002-09-11
Abstract: This invention provides a semiconductor chip package structure, which includes a substrate, a semiconductor chip, a heat dissipation plate and molding compound. The semiconductor is attached onto the surface of the substrate. The heat dissipation plate possesses an exposed portion and a inner connection portion, in which the inner connection portion extends from the periphery of the exposed portion and has at least one lock-in opening to allow the heat dissipation plate locking in to an ejection pin corresponding to a molding equipment. The molding compound encapsulates the semiconductor chip and the inner connection portion of the heat dissipation plate, while the exposed portion of the heat dissipation plate protrudes out of the molding compound to achieve a goal for fast heat dissipation.
Patent TW-525187-B (TW)
Title: High-speed synchronous semiconductor memory having multi-stage pipeline structure and operating method
Inventor: KWON KOOK-HWAN
IPC: G11C11/413
Filed: 2001-08-20
Granted: 2003-03-21
Abstract: In order to reduce a cycle time and enable a high-speed operation in a semiconductor memory, the memory is constructed having a multi-pipeline structure. The multi-pipeline structure, for instance, includes a three-stage pipeline, in which an additional data register is introduced between a sense amplifier and a main data line. The remaining memory structure can be configured in a manner comparable to that of a conventional two-stage pipeline semiconductor memory.
Patent TW-507095-B (TW)
Title: Manufacturing method of ODF liquid crystal panel
Inventor: LIOU LOUIS
IPC: G02F1/1335
Filed: 2001-09-03
Granted: 2002-10-21
Abstract: There is provided a manufacturing method of ODF (one drop fill) liquid crystal panel. In the method, frame adhesive and black matrix are separated by gap or photo spacer. Therefore, in performing UV curing step, UV light is not shielded by the black matrix so that the frame adhesive can be fully cured so as to prevent the liquid crystal from being contaminated by the frame adhesive molecules that are not fully cured, thereby increasing the efficiency of the liquid crystal.
Patent TW-529102-B (TW)
Title: Liquid processing apparatus
Inventor: AOKI MASAYA
IPC: B08B3/02
Filed: 2001-09-05
Granted: 2003-04-21
Abstract: Cleaning processing unit (SCR) 21a according to one embodiment of liquid processing apparatus of the present invention, comprises a spin plate 41 for holding a substrate G supported on supporting pins 42 by means of holding pins 43, a motor 47 for rotating a spin plate 41 in a manner to permit the substrate G to make a planar rotation, a process cup 60 consists of an upper cup 61 capable of moving in the vertical direction which is arranged to surround the edge of the substrate G and a fixed under cup 62, and a buffer room 63 formed with the process cup 60. An air stream and/or a mist produced by the rotation of the substrate G are stayed within the buffer room 63, with the result that it is possible to prevent the air stream and/or the mist from hoisting and diffusing toward the substrate G.
Patent TW-552751-B (TW)
Title: Semiconductor laser device and method of manufacturing the same
Inventor: GEN-EI KOICHI
IPC: G11B7/1275
Filed: 2001-09-07
Granted: 2003-09-11
Abstract: The present invention provides a semiconductor laser device and method of manufacturing the same. The semiconductor laser chip has an emission facet for emitting a laser beam. A sub-mount has a first surface and at least one second surface vertical to the first surface. The semiconductor laser chip is provided on the first surface of the sub-mount. The second surface arranged in parallel to the emission facet of the semiconductor laser chip is inclined at an angle of 3 to 30 degrees. The inclined second surface reflects the reflection light of a sub-beam diffracted from a main beam emitted by the semiconductor laser chip.
Patent TW-499347-B (TW)
Title: Arrangement for polishing disk-like objects
Inventor: EBNER KATRIN
IPC: B24B41/06
Filed: 2001-09-19
Granted: 2002-08-21
Abstract: A polish head (3) for chemical mechanical polishing comprises a backing film (5) made of silicone on a rigid support element (6, 7), preferably consisting of amorphous ceramic. The silicone backing film (5) is fabricated by molding, thereby enabling an appropriate cross-sectional shape for specific polishing needs. The invention provides a uniform polishing of a semiconductor wafer (4).
Patent TW-532009-B (TW)
Title: Memory device and memory access limiting method
Inventor: OKAUE TAKUMI
IPC: G06F21/60
Filed: 2001-09-24
Granted: 2003-05-11
Abstract: The invention discloses a memory device and memory access limiting method, which targets at enhancing the confidentiality of data recorded in memory. Upon powering on the memory device of the invention, load data of designated area 14 of memory 12 in memory device 10 to register 22. When initial status testing part 26 detects that the loaded data of register 22 is initial value, gate G2 and G3 will be conducted to access the designated area 14 and memory area 15. While writing access code from external part to the designated area 14, an access limiting status will be formed. While writing code in consistent with access code to register 25 from external part, the access to memory area 15 is feasible as a result of consistent output check of comparison circuit 24 enabling to conducting gate G1. It is not possible to conduct access if no consistent code with access code is written to register 25 from external part.
Patent TW-518782-B (TW)
Title: Lithium polymer secondary battery and its production method
Inventor: SADA TSUTOMU
IPC: H01M10/05
Filed: 2001-09-27
Granted: 2003-01-21
Abstract: A lithium polymer secondary battery comprises a negative electrode, a positive electrode and a polymer electrolyte layer arranged between the electrodes, which has the feature that the battery has been subjected to a heat treatment at a temperature of 40 to 60 DEG C after the assembly thereof. The polymer battery is freed of or is reduced in the adverse effect of a residual monomer and initiator on the performance of the battery. The polymer electrolyte is formed by cross-linking polymerization of a precursor monomer for an ion conducting polymer in a nonaqueous electrolyte, and the residual monomer and initiator contained therein is consumed by the heat treatment.
Patent TW-483834-B (TW)
Title: Method and device for fabricating ink jet nozzle of ink jet printing device
Inventor: KANG HUNG-CHOU
IPC: B41J2/16
Filed: 2000-01-03
Granted: 2002-04-21
Abstract: This invention is related to a method and device for fabricating the ink jet nozzle of ink jet printing device, having a micro-controlling device with a plurality of ink jet nozzles, the micro-controlling device being formed thereon with the first film layer with a plurality of ink chambers and ink passages. The ink passages are formed with a plurality of support posts thereon. The first film layer is coated with a layer of liquid medium. A photo sensitive, high molecular film is provided above the first film layer, the photo sensitive, high molecular film being photo-etched (by photo-exposure) with ink jetting holes at locations corresponding to the ink chambers of the first film layer. The micro-controlling device is connected to a signal input device.
Patent TW-512227-B (TW)
Title: Method and apparatus for substrate surface inspection using spectral profiling techniques
Inventor: HUNTER REGINALD
IPC: G01N21/95
Filed: 2001-10-05
Granted: 2002-12-01
Abstract: The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. In one aspect, a light source is used in conjunction with an optical receiving device, such as a spectrometer, to illuminate and inspect a substrate for various optical signatures. In one embodiment, spectral data collected from a given substrate is used to generate a spectral signature. The spectral signature represents the intensity distribution of the color constituents of a substrate surface. This color signature may then be compared to a reference color signature to determine characteristics such as the substrate type, thickness, conformity, substrate surface uniformity, and residual materials in processing.
Patent TW-520471-B (TW)
Title: Dual FPD and thin client
Inventor: SALLAM HUSSEIN
IPC: G06F1/16
Filed: 2001-10-15
Granted: 2003-02-11
Abstract: The invention is essentially a flat panel display, preferably for use with wearable computers, which utilizes a display which is separate from the CPU, which can perform as a static flat panel display when connected to or in communication with the computer, but can also function as a thin client PDA when independent from the computer to which it was originally connected. The device will look and function as a flat panel display and include integral activation means either through stylus, touch panel, integrated pointing device, voice, or other activation means. This activation means will be available whether the device is functioning as a display or as a thin client PDA. The device will be small enough to be worn, carried or otherwise supported by the user, but can be utilized independently as a PDA to perform data input, calendars and scheduling, memo inputting and other thin client functions, and will run a thin client operating system such as Windows (R) CE or Palm (R) OS. The enclosure itself will contain hardware sufficient to support display functions as well as a thin client motherboard. It will also contain either a wired or wireless communication bus for communicating data to the computer from which it was disconnected. Additionally, it will possess a standard or proprietary video input plug for displaying output from the underlying computer.