baber/WOPTO huggingface dataset:
Patent JP-2013254803-A (JP)
Title: Method for manufacturing circuit board, circuit board, and power semiconductor device
Inventor: SEKIYA TAKU
IPC: H05K3/44
Filed: 2012-06-06
Abstract: PROBLEM TO BE SOLVED: To obtain a circuit board and a power semiconductor device allowing for high density mounting and capable of providing high reliability even when they operate at a high temperature.SOLUTION: A method for manufacturing a circuit board includes the steps of: forming a first circuit pattern (8A, 5A, 3, 5B, 8B) on a first insulating layer 2 formed on one surface of a heat sink 1 by thermal spraying (c, e, g); forming a second insulating layer 6 by thermal spraying so as to cross a part 3 of the first circuit pattern (f); and forming a second circuit pattern 7 by thermal spraying so as to cross the first circuit pattern via the second insulating layer 6 (g). In the step of forming the second insulating layer 6 (f), thickness (t6) of a portion sandwiched between the first circuit pattern 3 and the second circuit pattern 7 in the insulating layer 6 is adjusted to be not more than 300 μm.
Patent JP-2013224005-A (JP)
Title: Gas barrier film and method of manufacturing the same
Inventor: ASUKA MASAHIRO
IPC: B32B9/00
Filed: 2012-06-06
Abstract: PROBLEM TO BE SOLVED: To provide a gas barrier film excellent in a gas barrier property, transparency and flexibility.SOLUTION: In a gas barrier film, a gas barrier layer containing the oxynitride shown by a general formula (1) ZnSnON(in the formula, a is 2.1-15, b is 0.5-22, and c is 0.05-1.1) is integrated into the laminate in one surface of a transparent film. According to such a gas barrier film, bending and rounding can be made, and a photovoltaic module, the liquid crystal display panel, and the organic EL display panel etc. can be installed along a curved surface.
Patent JP-2013253730-A (JP)
Title: Air conditioner
Inventor: ARIGA TORU
IPC: F24F11/02
Filed: 2012-06-06
Abstract: PROBLEM TO BE SOLVED: To provide an air conditioner which can restart heating operation in a state that a heating capacity is sufficiently exercised when the heating operation, which is stopped due to an extreme decrease in an outside air temperature, is restarted.SOLUTION: An air conditioner 1 includes an outdoor unit 10 and an indoor unit 30. The outdoor unit 10 includes an outdoor heat exchanger 16, a compressor 11, an outdoor blower 15, a temperature detector 23 for detecting a temperature of the outdoor heat exchanger 16, and a temperature detector 27 for detecting an outside air temperature. The indoor unit 30 includes an indoor heat exchanger 33 and an indoor blower 32. The air conditioner 1 has a heating operation mode which becomes a standby state by stopping the heating operation when the outside air temperature reaches a temperature lower than a first predetermined temperature which is previously set during the heating operation, and then restarts the heating operation after executing defrosting operation when the outside air temperature reaches a temperature higher than a second predetermined temperature, which is previously set and is higher than the first predetermined temperature.
Patent JP-2013258536-A (JP)
Title: Method for controlling device system, device system, and program
Inventor: SUMIYA KOICHIRO
IPC: H04N5/00
Filed: 2012-06-12
Abstract: PROBLEM TO BE SOLVED: To improve accuracy of remote control operations of all devices included in a device system.SOLUTION: When receiving an operation command from a remote controller B corresponding to a device B or from a remote controller C corresponding to a device C, a device A sends the operation command to the device B or the device C via a network NT. The device B or the device C operates on the basis of the operation command sent from the device A. If it receives the same operation command a plurality of times, the device B or the device C discards the second and subsequent operation commands received in a prescribed unit time after the first operation command is received.
Patent JP-2013258268-A (JP)
Title: Substrate mounting table and substrate processing apparatus
Inventor: NAGAI TSUTOMU
IPC: H01L21/683
Filed: 2012-06-12
Abstract: PROBLEM TO BE SOLVED: To provide a substrate mounting table and a substrate processing apparatus by which tendency of a temperature profile for each substrate mounting table can be made uniform.SOLUTION: A substrate processing apparatus includes a processing container and a substrate mounting table. The processing container defines a processing space. The substrate mounting table has a base and an electrostatic chuck, and is arranged in the processing space. The base has a channel for coolant formed therein. The electrostatic chuck is provided on an upper face of the base with an adhesive layer formed by curing a liquid adhesive interposed therebetween, and has an electrode provided therein. On the upper face of the base, a first adhesive area bonded to the electrostatic chuck is formed with the adhesive layer interposed therebetween. A central part of the first adhesive area is depressed as compared with an end part of the first adhesive area.
Patent JP-2012229808-A (JP)
Title: Fastener and other assembly
Inventor: RUDDUCK DICKORY
IPC: F16B21/07
Filed: 2012-06-14
Abstract: PROBLEM TO BE SOLVED: To improve fasteners, fastening systems and fastener assemblies.SOLUTION: In a releasable fastening system 150 which has a pin 152 with a locking cavity 163, the pin 152 is intended for insertion in an aperture 154. A locking means 158, 160 engages the locking cavity 163 of the pin 152 when the pin 152 is received in the aperture 154. The fastening system 150 also includes unlocking means 162 which includes material adapted to contract when activated. When a material contracts, engagement means 158 included in the locking means 158, 160, disengage the locking cavity 154.
Patent JP-2014003046-A (JP)
Title: Ion implantation method
Inventor: TAKAHAMA TAKASHI
IPC: H01L21/265
Filed: 2012-06-15
Abstract: PROBLEM TO BE SOLVED: To provide a method for obtaining a sufficient aluminum ion beam amount, in ion implantation using a vaporizer.SOLUTION: When vaporizing AlF(aluminum fluoride) temporarily and then reheating, AlFsolidified in an outlet area is introduced, as vapor, into an ionization chamber, and then it is ionized and drawn out as an aluminum ion beam increased sufficiently when compared with prior art. When vaporizing the AlF(aluminum fluoride), it is vaporized temporarily and cooled. Consequently, the AlFcan be introduced into an ionization chamber under controllable state, and an aluminum ion beam can be drawn out.
Patent JP-2014000577-A (JP)
Title: Solder iron tip recycling method and recyclable solder iron tip
Inventor: MAEDA SHIGEKI
IPC: C23C26/00
Filed: 2012-06-15
Abstract: PROBLEM TO BE SOLVED: To provide a recycling method for recycling a conventionally disposable solder iron tip for making effective use of resources, protecting environment, and cutting soldering operation cost, and a recyclable tip.SOLUTION: If an iron plated layer 12 covering a surface of a solder iron tip 10 is worn and a dent 20 is formed, then the solder iron tip 10 is recovered, and a pure-iron sedimentary layer 21 is built up in the dent 20 of the iron plated layer 12 of the recovered solder iron tip 10 to fill in the dent 20 in a state in which the iron plated layer 12 that is before a bottom of the dent 20 reaches copper of a base material 11 and the copper is exposed remains. A spark hardening method with pure iron arranged on an anode 31 and the solder iron tip 10 arranged on a cathode 32 can be used for a process of filling the dent 20 with the pure-iron sedimentary layer 35. At this time, the pure iron at a purity of about 99.999% is preferably used on the anode 31. This recycling method can be applied to the recycled solder iron tip 10 one more time or a plurality of more times.
Patent JP-2014002092-A (JP)
Title: Semiconductor testing device and semiconductor test method
Inventor: ICHIKAWA HIROAKI
IPC: G01R31/26
Filed: 2012-06-20
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor testing device and semiconductor test method which can electrically detect with high accuracy a very small or thin void that is generated in a solder bonding portion under a semiconductor chip.SOLUTION: Switches SW2 and SW3 are turned on to pass high power current Ip through an IGBT 30, thereby making the IGBT 30 generate heat. Before and after it, switches SW1 and SW4 are turned on to pass a very small measurement current Im through the IGBT 30, thereby measuring threshold voltages VGE (th) at those times. A control unit 50 estimates junction temperatures corresponding to the threshold voltages VGE (th) that are measured before and after the heat generation and, if a difference between the junction temperatures before and after the heat generation is equal to or larger than a fixed value, determines there is a void. In this case, pulse energization is performed to the power current Ip so as to suppress the lateral diffusion of the generated heat, and the measurement current Im (collector current Ic) is set to be 1/10000 or less of a rated current so as to pass current through only a cell that is generating the heat, thereby allowing the void to be detected with high accuracy.
Patent JP-2014000295-A (JP)
Title: Trypanosoma removal material, and trypanosoma removal device and method of producing blood preparation using the same
Inventor: INOUE SATORU
IPC: A61M1/36
Filed: 2012-06-20
Abstract: PROBLEM TO BE SOLVED: To provide a Trypanosoma removal material capable of removing Trypanosoma from blood and blood preparations.SOLUTION: A Trypanosoma removal material for removing Trypanosoma from blood and blood preparations has a porous structure and includes particles formed from cellulose or its derivative.
Patent JP-2014002316-A (JP)
Title: Photosensitive resin composition, method for producing cured film, cured film, organic el display device and liquid crystal display device
Inventor: YAMAZAKI KENTA
IPC: H01L21/027
Filed: 2012-06-20
Abstract: PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high sensitivity and excellent insulating property and storage stability.SOLUTION: The photosensitive resin composition comprises: (A) a polymer component including a polymer satisfying at least one of the following conditions (1) and (2); (B) an ionic photo-acid generator; (C) a compound expressed by general formula (S) (in the formula, Rrepresents a group having at least one nitrogen atom, A represents a divalent linking group, and Rrepresents an organic group); a solvent; and an alkoxysilane compound. The conditions are: (1) a polymer having (a1) a structural unit having a group in which an acid group is protected by an acid decomposable group, and (a2) a structural unit having a crosslinking group; and (2) a polymer having (a1) a structural unit having a group in which an acid group is protected by an acid decomposable group, and a polymer having (a2) a structural unit having a crosslinking group.
Patent JP-2014004006-A (JP)
Title: Safety belt usage state confirmation system and safety belt usage state confirmation method
Inventor: YAMADA TORU
IPC: A62B35/00
Filed: 2012-06-21
Abstract: PROBLEM TO BE SOLVED: To provide a safety belt usage state confirmation system and a safety belt usage state confirmation method of reliably confirming that a safety belt is used on site.SOLUTION: A hook 101 is provided with the hook 101 and a sensor 103 which detects a contact with an attaching part 2. Without a user WP performing a special operation, a sensor 103 automatically detects the contact if the user WP actually attaches a hook 101 to an attaching part 2, and the sensor 103 does not detect the contact if the user WP does not attach the hook 101 to the attaching part 2. By this arrangement, a control unit 6 can easily detect the attachment of the hook 101 based on the information acquired by a hook attachment information acquisition part 30. In a case where the user WP has entered a dangerous area WS, but the hook 101 is not attached to the attaching part 2, a warning unit 5 issues a warning, thereby confirming the usage state of the safety belt 100.
Patent JP-2014007091-A (JP)
Title: Straight tube type led lamp
Inventor: AKIYAMA RUTSUKO
IPC: F21S2/00
Filed: 2012-06-26
Abstract: PROBLEM TO BE SOLVED: To provide a luminaire which can change a light irradiation direction to an arbitrary direction and can securely be fixed at a necessary rotational position and in which a stably usable long-life LED light emission body is built.SOLUTION: A straight tube type LED lamp includes a first base member 8 joined to an end of a light emission part body 2 and a second base member 9 having a metal terminal 23 inserted into the socket of a luminaire, and the first base member 8 includes energizing means 12 of energizing the second base member 9 in a fitting insertion direction. The first base member 8 and second base member 9 are engaged with and disengaged from each other by moving straight by a predetermined distance parallel with an axis of rotation, and the first base member 8 is rotatable when the second base member 9 is moved to extend the length of the straight tube type LED lamp.
Patent JP-2014011639-A (JP)
Title: Imaging device
Inventor: TORII SATORU
IPC: G03B19/07
Filed: 2012-06-29
Abstract: PROBLEM TO BE SOLVED: To predict a photographed image acquirable in photographing in accordance with a photographing condition before photographing in advance and display it.SOLUTION: An imaging device according to the present invention sets a photographing condition for photographing by imaging means (S401), calculates subject information including the position and shape of a subject on the basis of an image captured by the imaging means (S403), creates a preview image obtained by predicting an image acquired in imaging in accordance with the photographing condition from the photographing condition and the subject information (S404), and displays the preview image.
Patent JP-2014010349-A (JP)
Title: Image forming apparatus
Inventor: YONEMOTO SATORU
IPC: G03G15/01
Filed: 2012-06-29
Abstract: PROBLEM TO BE SOLVED: To prevent sagging of a transfer belt which is hung on a plurality of rollers without enlarging an apparatus.SOLUTION: An image forming apparatus 1 includes: an intermediate transfer belt 125, a plurality of developing units 128 and a primary transfer roller 126, a moving mechanism 52 for moving the intermediate transfer belt 125 and a cam member 57 provided on a rotational shaft 5211 included in the moving mechanism 52, rotating with the rotational shaft 5211 having an eccentricity, and having a shape switching between an intermediate transfer belt pressing state or a not pressing state according to the amount of rotation of the rotational shaft 5211.
Patent JP-2014008949-A (JP)
Title: Front pillar for vehicle
Inventor: UEMURA YUSUKE
IPC: B62D25/04
Filed: 2012-07-03
Abstract: PROBLEM TO BE SOLVED: To provide a front pillar for a vehicle which easily deals with specification changes and achieves high versatility.SOLUTION: A front pillar for a vehicle 100 comprises: a pillar outer 108; a second pillar inner 120; and a pillar trim 114. The pillar outer 108 and the second pillar inner 120 respectively include flanges 108a and 120a, which are joined to each other, in one-side ends at the windshield 104 side. The pillar trim 114 includes an upper rib 116 contacting with a surface of the flange. The second pillar inner 120 includes the flange 120a joined to the flange 108a, and the flange 120a includes a first protruding part 122 which protrudes.
Patent JP-2013057659-A (JP)
Title: Module for monitoring at least one characteristic physical amount of state of contact guide member
Inventor: PASCAL DESBIOLLES
IPC: F16C19/52
Filed: 2012-07-03
Abstract: PROBLEM TO BE SOLVED: To provide means for enabling the monitoring of a contact guide member at the minimum energy cost preferably without external cable connection and without remodeling a bearing box or a linear guide device in large.SOLUTION: A module 10 monitors at least one of characteristic physical amounts of the state of a bearing 80 housed in a bearing box 72. The module 10 includes at least one state sensor and an electric circuit. The at least one state sensor supplies an electrical signal for measuring the physical amounts. The electrical circuit includes a power-saving circuit which, connected to the state sensor, is connected to a reference circuit of the state sensor, a feeder circuit for a monitoring device and a displacement sensor 58 of a guide member 80. The power-saving circuit resumes the operation of the reference circuit when a characteristic physical amount of the operation of the guide member 80 measured by the displacement sensor 58 exceeds a prescribed threshold over a prescribed time.
Patent JP-2014013508-A (JP)
Title: Electronic equipment
Inventor: KINOSHITA HIROAKI
IPC: H05K5/02
Filed: 2012-07-04
Abstract: PROBLEM TO BE SOLVED: To provide a notebook-sized personal computer which can be made thinner.SOLUTION: In a notebook-sized person computer in which a body casing and a display casing are connected by a hinge device 4 which revolves around a vertical axis V and rotates around a horizontal axis H, and cables C1 to C6 for connecting the main body to a display pass through the inside of the hinge device 4, the wiring paths of the cables C1 to C6 that pass through paths in parallel with the vertical axis V and away from the vertical axis V and paths overlapped with the horizontal axis H toward the vertical axis V are disposed, and a cover for covering the cables C1 to C6 overlapped with the horizontal axis H is disposed in the display casing such that it is not necessary to dispose the cover for covering the cables C1 to C6 at the hinge device 4 side, and that it is possible to make thinner the notebook-sized personal computer.
Patent JP-2014014529-A (JP)
Title: Drum type dryer
Inventor: KAWAMURA KEIZO
IPC: D06F58/28
Filed: 2012-07-10
Abstract: PROBLEM TO BE SOLVED: To provide a drum type dryer appropriately blowing air in accordance with the degree of dryness of clothing, and realizing an improvement of drying finish and a reduction of power consumption.SOLUTION: The drum type dryer includes: an outer tub 20, the interior of which serves as a drying chamber during drying operation; a rotary drum 29 rotatably disposed in the outer tub 20 and housing clothing 30; a motor 36 for driving the rotary drum 29; a blowing port 11 for blowing warm air to the rotary drum 29; a dryer 6 having heating means 62 and blowing means 61. The drum type dryer blows dry air 12 while rotating the rotary drum 29 during drying, and turns up the direction of wind to blow to the clothing 30 as the drying time passes.
Patent JP-2014022378-A (JP)
Title: Imprint device and method of manufacturing article using the same
Inventor: YAMASHITA TAKASHI
IPC: B29C59/02
Filed: 2012-07-12
Abstract: PROBLEM TO BE SOLVED: To provide an imprint device that enhances overlay accuracy in an imprint process and is advantageous in easiness.SOLUTION: An imprint device 1 deforms the outer peripheral shape of an existent pattern area 27 formed on a substrate 2, and forms a pattern of resin 3 on the deformed existent pattern area 27. The imprint device 1 has holding means 20 which has a contact face 40 to be brought into contact with the back surface of the substrate 2 and adsorbs the substrate 2 to the contact face 40 to hold the substrate 2, supply means 44 for supplying non-polarity gas to the gap between the back surface of the existent pattern area 27 of the substrate 2 and the contact face 40, and deforming means 10 for deforming the existent pattern area 27 under the state that adsorption force acts on the back surface of the existent pattern area 27 and the non-polarity gas is interposed between the back surface of the existent pattern area 27 and the contact face 40.
Patent JP-2012195618-A (JP)
Title: Gallium nitride semiconductor element
Inventor: ZHU TINGGANG
IPC: H01L29/47
Filed: 2012-07-17
Abstract: PROBLEM TO BE SOLVED: To provide a high-power gallium nitride Schottky diode element.SOLUTION: A gallium nitride-based semiconductor Schottky diode manufactured from an n+ doped GaN diode having a thickness of 1-6 μm is provided on a sapphire substrate. An n- doped GaN diode is provided on the n+ doped GaN diode patterned in a plurality of slender fingers, a metal layer is provided on the n- doped GaN layer to form Schottky junction between the n- GaN layer and the metal layer. A layer thickness, a length and a width of the slender finger are optimized so as to obtain an element having a breakdown voltage in excess of 500 V, a current capacity in excess of 1 ampere and a forward voltage of less than 3 V.
Patent JP-2014022595-A (JP)
Title: Method of manufacturing semiconductor device and adhesive for flip-chip mounting
Inventor: WAKIOKA SAYAKA
IPC: H01L21/60
Filed: 2012-07-19
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which can achieve high reliability in a short time by suppressing voids, and to provide an adhesive for flip-chip mounting for use in the method of manufacturing a semiconductor device.SOLUTION: The method of manufacturing a semiconductor device includes step 1 for aligning a semiconductor chip, in which a bump electrode having a solder tip is formed, on a substrate via an adhesive, and step 2 for fusion bonding the bump electrode of the semiconductor chip and the electrode of the substrate by heating the semiconductor chip to a temperature of solder melting point or higher. The adhesive has an activation energy ΔE of 100 kJ/mol or less obtained by differential scanning colorimetry and Ozawa method, and the time to reach 80% reaction rate is 4-20 sec at 260°C, 2-10 sec at 280°C, and 1-8 sec at 300°C.
Patent JP-2014022640-A (JP)
Title: Wiring board, method of manufacturing the same, electronic apparatus, and method of manufacturing the same
Inventor: FUKUMORI HIROMASA
IPC: H01L23/12
Filed: 2012-07-20
Abstract: PROBLEM TO BE SOLVED: To suppress a change in characteristic impedance at a joint part between substrates.SOLUTION: A wiring board includes: a substrate; an insulating part formed on the substrate and having a through hole; an electrode formed on the substrate and provided in the through hole; and a conductive part joined to the electrode and provided in the through hole. The through hole expands toward a direction away from the substrate. The conductive part covers the entire upper surface of the electrode and expands toward a direction away from the substrate.
Patent JP-2013082605-A (JP)
Title: Method of manufacturing optical fiber base material and method of manufacturing optical fiber
Inventor: OZEKI NOBUO
IPC: C03B37/018
Filed: 2012-07-24
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical fiber base material capable of manufacturing a highly reliable optical fiber, and a method of manufacturing the optical fiber using it.SOLUTION: The method of manufacturing an optical fiber base material is for manufacturing the optical fiber base material 15P using an inside mounting method, and includes a step of rotating and heating a glass tube 15G chucked at two positions and supplying a gas into a through-hole H of the glass tube 15G. In the step, the glass tube 15G is warped so that the center axis 15C between respective chucked portions of the glass tube 15G has a shape in which a catenary curve is reversed in the vertical direction.