baber/WOPTO huggingface dataset:
Patent JP-H11115097-A (JP)
Title: Multi-layer metal-coated material and metal coating method using it
Inventor: URAWA SHOTARO
IPC: B32B27/38
Filed: 1997-10-14
Abstract: PROBLEM TO BE SOLVED: To improve resistance to salt water and resistance to cathode release properties, and enable corrosion prevention of outer surface, weld, or damaged coated parts, joint parts of lining tubes, or damaged parts of lining by forming a multi-layer metal-coated material composed of an epoxy resin layer, a specified adhesion layer, and a heat-shrinkable layer. SOLUTION: A multi-layer metal-coated material is composed of an epoxy resin layer, an adhesion layer, and a heat-shrinkable layer, where the epoxy resin layer composed of 100 pts.wt. epoxy resin composition having glass transition point of 60 deg.C or more and 5-150 pts.wt. mica, and/or the adhesion layer composed of 100 pts.wt. adhesive composition and 5-50 pts.wt. mica are used. The adhesives, for example, a composition composed of 5 wt.% or more terpolymer of ethylene-acrylic ester-maleic anhydride and 95 wt.% or less ethylene polymer. Polymer composing the heat-shrinkable layer is high-density, medium, or low-density polyethylene, polypropylene, ethylene-α-olefin copolymer, or the like is preferable.
Patent JP-S62140742-A (JP)
Title: Division processing device for machining region in automatic machine
Inventor: HIRATA SHIGETO
IPC: B23Q15/00
Filed: 1985-12-13
Abstract: PURPOSE:To enable a device to flexibly correspond to FMS or the like, by dividing a region, decided to correspond to a tool kind of rough, intermediate, finish, etc. on the basis of a decision reference, by the setting reference to be filed with an assignment machining division region. CONSTITUTION:A CPU1, which decides in decision parts 81-84 a plurality of machining division regions corresponding to a tool kind of rough, intermediate, finish, etc. by a decision reference 71 through an input process data and a command from a keyboard 2 with picture, divides the decided region by a setting region 72 in machining division processing parts 91-94. While the machining method, particularly assigned by an external input, for instance, a region of center machining and thread cutting or the like is divided by assigned machining division processing parts 95a, 95b. These divided region data are filed in a region data memory 32 for every tool. In this way, a device can flexibly further practically correspond to FMS or the like.
Patent JP-H02128449-A (JP)
Title: Manufacture of semiconductor device
Inventor: TERADA TOSHIYUKI
IPC: H01L23/522
Filed: 1988-11-08
Abstract: PURPOSE:To form uniformly connecting holes, to hold almost constantly an interlayer insulating distance and to contrive the speedup of a device by a method wherein a dummy pattern is provided on a wiring non-formation region and the step difference of a base layer is relaxed. CONSTITUTION:An insulating film 2 is formed on the surface of a semiinsulative GaAs substrate 1 and a layer wiring 3 is formed on the upper part of the film 2. Then, a resist 4 is applied on the substrate surface, is exposed and developed in a pattern larger than that of the wiring 3 to obtain a resist pattern 4 for flattening use and this pattern is cured. Then, a resist 5 for connecting hole formation use is applied. At this time, the heights up to the surfaces of the resist 4 and the wiring 3 are nearly the same height and the film thickness of the resist 5 becomes uniform. An exposure and a developing are performed on the resist 5 to obtain connecting holes (W1 and W2), whose aperture dimensions are almost equal. Then, an upper layer wiring 6 is formed and the resists 4 and 5 are removed to obtain an air bridge wiring structure.
Patent JP-H11113820-A (JP)
Title: Suction tool for floor
Inventor: OCHI HIDEKI
IPC: A47L9/24
Filed: 1997-10-14
Abstract: PROBLEM TO BE SOLVED: To prevent a connecting tube from directly touching a joint pipe and prevent the damage of an opening edge part of the joint tube by forming notched parts extending continuously to the openings, when the suction tool for a floor is collided with a wall, etc., in cleaning so that a force is applied in the direction for bending the connecting tube and the joint tube. SOLUTION: This suction tool is so constituted that a recessed groove 2 is formed in the outer circumference of a connecting tube 1 connected to the suction tool main body, openings 4 are formed in a joint tube 3 attached to the connecting tube 1, and a stopper member 5 is inserted from the openings 4 so that the connecting tube 1 and the joint tube 3 are prevented from being slipped off. In this case, notched parts 6 continued to the openings 4 are formed inside the front or rear parts of the openings of the joint tube 3 respectively.
Patent JP-H09125784-A (JP)
Title: Storage house
Inventor: SEKIGUCHI TAKASHI
IPC: F25D23/02
Filed: 1995-10-27
Abstract: PROBLEM TO BE SOLVED: To prevent mischiefs from being done to a handle device and a receiving metal fixture. SOLUTION: A storage house is provided with a storage house main body 1 provided with an opening, a door 4 fitted to the storage house main body freely to be turned, a handle device 9 provided with a handle 9b, which can be turned, and a receiving metal fixture 12 for receiving a claw part 9d of the handle. The door can be turned between the sealing position for sealing the opening part of the storage house main body and the opening position for opening the opening part. The handle device is fitted to a front surface of the door, and when the door is positioned at the sealing position, the claw part of the handle can be fitted in the receiving metal fixture 12 by operating the handle.  When the claw part of the handle is fitted in the receiving metal fixture 12, a cover member 11 covers the handle device and the receiving metal fixture 12, and while the cover member is locked by a lock device.
Patent JP-H02126685-A (JP)
Title: Solid-state image sensor
Inventor: NAKAMURA KENZO
IPC: H01L31/02
Filed: 1988-11-07
Abstract: PURPOSE:To reduce a drop in a yield due to dust particles or the like which are mixed and to sharply reduce a cost by a method wherein a conductive connection part of a solid-state image sensor and a patterned conductive connection part of a sheet material are connected directly by a conductive connection means such as a conductive adhesive, gold, a solder or the like. CONSTITUTION:A conductive material 6 is patterned on a sheet material 4 composed of a transparent material such as a plastic sheet, a glass sheet or the like; a conductive connection part 2 and a conductive connection part of a solid-state image sensor 3 are connected directly by a conductive connection means 5 such as a conductive adhesive, gold, a solder or the like. The solid-state image sensor which has been sealed in this manner may be connected, as required, to a substrate into which other electronic circuits have been assembled, such as a printed-circuit board 1, by a soldering operation by using the conductive adhesive; it may be assembled into another package by a means such as the soldering operation or the like.
Patent JP-H09128297-A (JP)
Title: Address converting circuit
Inventor: YAMAZAKI TAKUMI
IPC: G06F12/10
Filed: 1995-10-27
Abstract: PROBLEM TO BE SOLVED: To increase the hit rate of address conversion by providing >=2 address conversion buffers, and switching and using them. SOLUTION: At missing segment/page generation time, its logical address is held in a missing page address holding register 7 and a switching signal 112 is outputted to selecting circuits 41 and 42 which select the outputs of the address converting buffers 31 and 32. Consequently, the processing of an OS, etc., which makes segment/page information effective is performed by using the address converting buffer 32. When the processing of this OS, etc., ends and the execution of a series of programs is restarted, the logical address is sent out again to refers to the address converting buffer 31. At this time, the comparison output 109 outputted from the comparing circuit 8 becomes coincident, the switching signal 112 changes and the subsequent program execution is carried on by using the address converting buffer 31.
Patent JP-2000108528-A (JP)
Title: Thermal transfer image receiving sheet
Inventor: KAWAI SATORU
IPC: B32B27/00
Filed: 1998-10-02
Abstract: PROBLEM TO BE SOLVED: To provide a thermal transfer image receiving sheet having good conveyability of a thermal transfer printer, high printing sensitivity and excellent image quality adapted to stereoscopic processing a bag-like state or the like after printing and capable of easily recognizing whether it is a design intending as a package or not and preventing a curl after imaging. SOLUTION: In the thermal transfer image receiving sheet 1, a base material A and a base material B are releasably laminated. Both the materials are laminated with a pressure sensitive adhesive layer 3, a pressure sensitive adhesive layer or an adhesive layer of a dry lamination. In either the former or the latter, after a thermal transfer image is formed, both the materials can be released. When the material A1 is transparent and the sheet is stuck to a sheet having a hue and a sense of quality very similar to those of the printing sheet, the hue and the sense of quality similar to those of the printing sheet can be incorporated in a non-printed part, and a printed matter for a package design having almost no difference from an actual package printed matter is obtained.
Patent JP-H03143207-A (JP)
Title: Method of flotation construction of submarine cable
Inventor: INADA SHIGERU
IPC: G02B6/50
Filed: 1989-10-27
Abstract: PURPOSE:To save lobor by guiding and pulling a floated cable by a remotely steerable unmanned boat. CONSTITUTION:An unmanned boat 1 is used as a boat for guiding and pulling a cable A floated by a buoyancy body E and maintaining a specified shape so that the cable A is not bent extremely by a wind and a tidal current. The unmanned boat 1 is steered remotely from the upper section of a laying boat B. The number of revolution (propulsive force) of a pump 2 and the direction, etc., of a jet nozzle 3 are included in the content of the steering of the unmanned boat 1. These remote steering is conducted by each single unmanned boat 1 by converting the frequency of wireless electric waves at every unmanned boat 1. Accordingly, labor is saved, cost is reduced and a submarine cable can be laid at low cost.
Patent JP-H09122728-A (JP)
Title: Automatic operating device for acceptance/delivery of slab
Inventor: CHIBA YUKIHIRO
IPC: B65G57/03
Filed: 1995-10-27
Abstract: PROBLEM TO BE SOLVED: To automatically adjust deviation of centering and camber of piled-up slabs. SOLUTION: Two laser range finders 21, 22 for scanning for measuring distances to respective end parts on both sides of an accepted slab and the laser range finder 23 for displacement for measuring the distance to the top part of the accepted slab are provided on a device for automatically operating acceptance/delivery of slab. By a centering deviation calculating means, centering deviation value is calculated based on distance data and scanning angle data obtained with the laser range finders 21, 22 for scanning. By a camber calculating means, the camber in the respective end parts of the uppermost slab is calculated based on the distance data and scanning angle data obtained from the laser range finders 21, 22 for scanning. By a roll control signal forming means, control signal of roll for moving the accepted slab is formed so as to reduce the deviation value of centering.  By a lift control signal forming means, the control signal of a lift for lifting the accepted slab is formed by executing correction of camber to delivery height.
Patent JP-H03141702-A (JP)
Title: Radio equipment
Inventor: YAMASHITA KOJI
IPC: H04B5/00
Filed: 1989-10-26
Abstract: PURPOSE:To prevent antenna efficiency from being lowered by making a flexible printed circuit board on which a conductor pattern is formed cylindrical, using the loop-shaped conductor pattern as a loop antenna. CONSTITUTION:On one side of a printed circuit board 1a, a conductor 2a is formed. On the other side, a conductor pattern 3 for circuit connection is formed and circuit parts 4 are packaged. In the state of mounting the circuit board 1a and parts 4, the flexible printed circuit board is cylindrically bent and an end part is connected. Thus, the conductor 2a on an outer surface becomes the loop antenna. Accordingly, a magnetic field B to be generated by a current flowing to the loop antenna 2a is passed through the inside of the circuit board 1a like an arrow. However, since the conductor 2a, parts 4 and pattern 3 are arranged close, the influence of the magnetic field upon the parts 4 or pattern 3 is small. Accordingly, mutual interference between the antenna 2a and the pattern 3 or the parts 4 is reduced and the antenna efficiency can be prevented from being lowered.
Patent JP-H03142795-A (JP)
Title: Write processing method for reloadable non-volatile memory
Inventor: SHIBATA KOICHI
IPC: G11C29/04
Filed: 1989-10-27
Abstract: PURPOSE:To effectively utilize the memory area of a reloadable non-volatile memory over the whole area by reading out data, which are written into the memory area to be reloaded, and executing a parity check. CONSTITUTION:The initial data are written while being divided into units, which are determined in advance, and a parity bit is added. When the data in the arbitrary memory area are reloaded after writing the initial data, the data written into the memory area are read out and the parity check is executed. When the life of the memory area is not exhausted, the parity check is made correct without fail and when the life is exhausted, however, the parity check is not made correct frequently. For the memory area where the parity check is not correct, it is judged that the life is exhausted, and the memory area is disabled. The reloading data are written into the idle memory area as an alternative area. Thus, the reloadable non-volatile memory can be efficiently used.
Patent JP-H06112273-A (JP)
Title: Mounting method for electronic component
Inventor: SOTODANI TAKASHI
IPC: H01L21/321
Filed: 1992-09-25
Abstract: PURPOSE:To provide the mounting method, of an electronic component, wherein its mounting process is simple, it is suitable for diversified small-quantity production and it does not damage the electronic component in a mounting operation. CONSTITUTION:A thermoset conductive liquid 25 is discharged from a nozzle 23, and each uncured bump 4 us formed on each electrode 2 for an IC chip 1. The uncured bump 4 is positioned on each land 8 on a wiring board 7, and the IC chip 1 is placed on the wiring board 7. The wiring board 7 is heated, the bump 4 is hardened and the electrode 2 for the IC chip 1 is bonded to the land 8 on the wiring board 7.
Patent JP-S63135409-A (JP)
Title: Production of dispersion of core-shell particle
Inventor: MAATEIN BUOOGERU
IPC: C09D7/12
Filed: 1987-11-06
Abstract: An aqueous dispersion of water-insoluble core-shell particles is prepared by emulsion polymerization for use as an opacifying agent in coatings. The particles have interior cores which are swollen with nonaqueous solvent. The polymeric exterior shells have a glass transition temperature greater than about 50 DEG C in the presence of the nonaqueous solvent. The partition coefficient for the nonaqueous solvent between the interior core polymer phase and the exterior shell polymer phase is at least about 1.25. Coatings compositions formulated using the core-shell particles show increased opacity, as single light scattering microvoids are formed in individual particles when the solvent evaporates and the core collapses inside the rigid exterior shell. Opacity develops even when aqueous coatings containing the particles are dried under high humidity conditions.
Patent JP-H07132684-A (JP)
Title: Thermal transfer material
Inventor: TANAKA MITSUGI
IPC: B41M5/52
Filed: 1993-11-10
Abstract: PURPOSE:To obtain high transfer density and adequate preservative stability by stacking a color donating material with a color layer containing a color expressed by a specific formula on a support on an image receiving material with an image receiving layer containing an active hydrogen compound on the support. CONSTITUTION:A thermal transfer material consists of a color donating material with a color layer containing a color expressed by formula 1 on a support, and an image receiving material with a receptive layer containing an active hydrogen compound on the support. In the formula I which expresses the color contained in the color layer of the color donating material, A is the main part of the color; B is a signal bond or divalent linkage group; X is formula II or III (R1, R2 are hydrogen atom or a substituent; R3 is an alkyl group; Y is -O-or -N(R4); R4 is hydrogen atom or an alkyl group). The color donating material is stacked on the image receiving material and a thermal energy is given to these in compliance with image information from whatever surface. Consequently, it is possible to transfer the color of the color layer of the color donating material to the image receiving material depending on the amount of a thermal energy.
Patent JP-H09139510-A (JP)
Title: Semiconductor device and its manufacture
Inventor: TAKAHASHI TETSUO
IPC: H01L29/76
Filed: 1995-10-27
Abstract: PROBLEM TO BE SOLVED: To simplify a gate control circuit and obtain excellent ON- characteristic. SOLUTION: A pin diode is constituted of a P<+> collector region 1, an N-type buffer region 3, an N<-> region 5 and an N<+> cathode region 7. Trenches 9 penetrating the N<+> cathode region 7 from the surface of the N<+> cathode region 7 and reaching the N<-> region 5 are formed. An insulating film 11 is formed along the inner wall surface of the trench 9. A gate electrode layer 13 facing the side wall of the N<+> cathode region 7 via the insulating film 11 is formed. A cathode electrode 17 electrically connected with the cathode region 7 is formed. An anode electrode 19 electrically connected with the P<+> collector region 1 is formed. The cathode region 7 is formed on the whole surface between the parallel trenches 9.
Patent JP-H06108966-A (JP)
Title: Pump
Inventor: UEHARA MASAFUMI
IPC: F04B9/02
Filed: 1992-09-28
Abstract: PURPOSE:To reduce the vibration of a plunger so as to stand continuous driving for many hours by controlling the piston motion of the plunger by a spring with one end thereof fixed to a cross head and with the other end thereof fixed to a cross head bearing part. CONSTITUTION:Liquid is fed by the piston motion of a plunger 6 jointed to a cross head 3 through a cam follower 2 in contact with the peripheral edge part of a deformed cam 1. In this case, mechanism for controlling the piston motion of the plunger 6 by a spring 7 with one end thereof fixed to the cross head 3 and with the other end thereof fixed to a cross head bearing part 4 is provided between the cross head bearing parts 4 for supporting the cross head 3 at least at two places. The torsion and micro vibration of the plunger 6 with a system of converting rotary motion into piston motion are thereby reduced so as to stand continuous driving for many hours.
Patent JP-H06131016-A (JP)
Title: Communication system
Inventor: YAJIMA TOMOYOSHI
IPC: G05B19/05
Filed: 1992-10-20
Abstract: PURPOSE:To improve the work efficiency by allowing the system to have a resuming function by which a continuous execution at the time of generation of an instantaneous stop can be executed smoothly, so that data at the time of generation of the instantaneous stop can be retained. CONSTITUTION:The system is constituted so that a PC 4 and an ICU 11 take a handshake in a software, and can execute simultaneously a continuous execution by adding an execution step stack area storage part 20 and a continuous execution switch 19 to the PC 4, and adding a device memory copy part 17 for copying a device memory part 6 of an execution step stack area storage part 18 to the ICU 11.
Patent JP-H01122443-A (JP)
Title: Preparation of ink jet head substrate
Inventor: SATO HIROYUKI
IPC: B41J2/05
Filed: 1987-11-07
Abstract: PURPOSE:To prevent the corrosion of a conductor layer, by a simple process wherein an ink jet head substrate is immersed in a triazine solution and forming a passivation part to the conductor layer exposed through the pinhole formed to a protective layer. CONSTITUTION:An under coat layer 2, a heat generating resistor layer 3 and a conductor layer 4 are formed to a glass substrate 1 to form a heat generating part 5 and a protective layer 6 is laminated to the heat generating part 5 and the conductor layer 4 to form an ink jet head substrate. This substrate is immersed in a triazine solution to allow the triazine solution to reach the exposed conductor layer 4 through the pinhole 12 formed to the protective layer 6 and a passivation part 20 is formed to the surface of the conductor layer 4 by chemical reaction. By the above mentioned method, the treatment of the pinhole formed to the protective layer can be performed by simple work and, even when ink is invaded from the pinhole, the conductor layer is not corroded and the cost of a product can be reduced.
Patent JP-H06132622-A (JP)
Title: Forming method for twisted multilayer interconnections of semiconductor device or the like
Inventor: NAKADA KENSUKE
IPC: H05K1/02
Filed: 1992-10-20
Abstract: PURPOSE:To enhance wiring density by twisting interconnections of upper and lower layers via in-line or concentrated holes. CONSTITUTION:A left interconnection A of an upper wiring layer 2 is connected with a central interconnection A of a lower wiring layer 3 via holes 1 provided between right ends and the left ends of the central interconnection A. Further, the central interconnection A is connected with the left interconnection A via holes 1 provided between the right lower ends and a left lower end of the right interconnection A. Similarly, a left interconnection B the wiring layer 3 is connected with a central interconnection B of the wiring layer 2, and the central interconnection B 2 is connected with a right interconnection B of the wiring layer 3 via the holes 1 provided at predetermined positions of the interconnections. In this case, the wiring layers 2, 3 are twisted between the upper and lower layers.
Patent JP-H04154419-A (JP)
Title: Suspension rigidity controller
Inventor: MIICHI YOSHIAKI
IPC: B60G17/027
Filed: 1990-10-18
Abstract: PURPOSE:To control occurrence of handle vibration so as to enable comfortable handle operation by controlling suspension rigidity in a handle vibration reduction control section so that handle vibration may be reduced when handle vibration exceeds its tolerance. CONSTITUTION:A suspension bush 1 provided with a rigidity adjusting device as a suspension rigidity adjusting means is controlled by a controller 11 as a control means. On the other hand, a steering angle sensor 12b and an acceleration sensor (handle vibration sensor) 12i as a handle vibration detection means which detects the condition of handle vibration of vehicle are provided. A suspension rigidity adjusting means 1 is controlled by a handle vibration reduction control section 11f so that longitudinal rigidity or lateral rigidity of suspension is adjusted so as to suppress handle vibration when handle vibration exceeds its tolerance. That is, the longitudinal rigidity of suspension is mostly adjusted in the region where handle vibration is strong, and lateral rigidity of suspension is mostly adjusted in the region where vibration is weak.