baber/WOPTO huggingface dataset:
Patent JP-H0761379-A (JP)
Title: Posture control device for working vehicle
Inventor: KAWAMURA YOSHIHIRO
IPC: A01D67/00
Filed: 1993-08-26
Abstract: PURPOSE:To eliminate a need for an operation to regulate a setter to set a target inclination angle and to improve operability, in a posture control device to effect automatic control so that the right and left inclination angles of a machine body are adjusted to a target value by elevating both or one of right and left crawler running devices based on the machine body. CONSTITUTION:A posture control device 30 is provided with an automatic control means, a manual control means, and a target inclination angle updating means. When manual control by a manual operation switch 31 is completed, the target inclination angle updating means is caused to replace a automatically controlled target inclination angle with the inclination angle of a machine body detected by an inclination sensor 33 when manual control is completed.
Patent JP-S5998742-A (JP)
Inventor: IKEFUCHI IWAO
IPC: B02C2/04
Filed: 1982-11-29
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H0658545-A (JP)
Title: Cooking device
Inventor: TAKADA SHUICHI
IPC: F24C15/00
Filed: 1992-08-07
Abstract: PURPOSE:To provide a cooking device capable of easily grasping which heating part is related to an error code displayed upon the detection of a trouble without substantially increasing a manufacturing cost. CONSTITUTION:When a trouble is generated in a large thermal power kitchen range, a middle thermal power kitchen range and a grill which are a plurality of heating means, a trouble display control part sequentially displays the cause of the trouble of the troubled heating means with an error code, flashes the segment of an LED 7 corresponding to the error code and lights the segment of the LED corresponding to other troubled heatring means.
Patent JP-H1052848-A (JP)
Title: Apparatus and method for preparing plastic sheet
Inventor: ISHITOBI HIROTAKA
IPC: B29C48/305
Filed: 1996-08-09
Abstract: PROBLEM TO BE SOLVED: To prevent deteriorated polymer generated from the inside of a nozzle from sticking on a sheet-like article extruded from the nozzle by applying a composite film of a nickel-phosphorous alloy and a fluororesin on an extrusion liq. contacting part of the nozzle in manufacturing of a plastic sheet. SOLUTION: A composite film 3 of a nickel-phosphorous alloy and a fluororesin is applied on the whole face of an extrusion liq. contacting part of a nozzle. For this purpose, the surface of an article to be treated is cleaned by shot blast wherein steel balls collide with the surface at high speed. Then, electrolessly plating wherein electrons discharged by oxidation of a reducing agent change metal ions into a metal film to form a rigid and porous nickel- phosphorous alloy film is performed. Then, heat treatment is performed to obtain higher surface hardness. Then, this film is impregnated with the fluororesin and heat treatment is performed e.g. at 300-400 deg.C for calcining the fluororesin.
Patent JP-H0878285-A (JP)
Title: Variable capacitor
Inventor: BABA HIROYUKI
IPC: H01G4/40
Filed: 1994-09-05
Abstract: PURPOSE: To increase the capacitance variation rate by forming a piezoelectric bias part integrally on the outside of of a capacitor part, forming first and second electrodes on both major surfaces of a piezoelectric material layer at the piezoelectric bias part, and then applying a bias voltage between both electrodes. CONSTITUTION: A capacitor part 22 comprises a rectangular prism sintered dielectric ceramic 24 in which inner electrodes 25 to 28 are stacked through dielectric layers. A piezoelectric bias part 23 integrated with the capacitor part 22 on the outside comprises a layer 32 composed only of piezoelectric ceramic and an electrode 33 formed on the outer surface of the layer 32 where the electrodes 31, 33 are facing each other through the layer 32. When a voltage is applied between the electrodes 31, 33, the layer 32 expands and contracts to apply a strain to the sintered ceramic 24 and thereby the dielectric layer between the electrodes 25 to 28 is distorted thus varying the capacitance. The capacitance can be varied continuously by varying the bias voltage.
Patent JP-S6094859-A (JP)
Inventor: HAINTSU RAIBAA
IPC: B60T13/12
Filed: 1984-10-11
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H0760443-A (JP)
Title: Arc sensor
Inventor: MUKAI YASUSHI
IPC: B23K9/073
Filed: 1993-08-26
Abstract: PURPOSE:To make an arc welder applicable to welding conditions in a wide area by expelling effects of succeeding current after short circuit and satisfactorily obtaining effective detecting data in short arc welding in which short circuits are frequently occurred. CONSTITUTION:The arc sensor is provided with a welding current detecting means 1, short circuit judging means 2, welding current compensating means 3 and arc sensor main body circuit 4. By estimating a succeeding current after short circuit superimposing welding current during arc period after short circuit period effected by short circuit from short circuit current when a short circuit is occurred during arc welding, actually detected welding current is compensated and a signal is made. Thus, arc sensor output which is not effected by short circuit is obtained except during integrating even when a short circuit is occurred in every rotation of rotating arcs.
Patent JP-H0493151-A (JP)
Title: Detection method for defective of pipe joint class and device thereof
Inventor: FUJINAMI MASAYUKI
IPC: B23Q17/24
Filed: 1990-08-09
Abstract: PURPOSE:To surely detect the defective that no screw is formed at the specified part without relaying on a mand hand, by irradiating a screw forming part with the light for inspection while aligning the pipe joints after thread cutting in order in a constant direction, and deciding the presence of a screw from the reflection light thereof. CONSTITUTION:A means 14 aligning/feeding an elbow M in a constant direction is composed by a passage 11 and guide walls 12, 13, etc., and a plate like movable stopper 15 which stops the elbow M once with the passage 11 being closed on each detection motion is provided on the way of the passage 11. The 1st and 2nd layer type displacement sensors 16, 17 which radiate a laser light L to the forming part of a screw N of the both sides opening end internal faces of the elbow M at stopping time once, are provided, and an optical detection means 18 discriminating the presence of N with the reflected light of the laser light being caught, further detecting those of non-alignment, is composed. The presence of the screw N and the alignment/nonalignment of the elbow M are discriminated, with the laser type displacement sensors 16, 17 detecting only the reflection light heading for a constant direction when the screw N is formed.
Patent JP-S6270711-A (JP)
Title: Angle-of-inclination detector
Inventor: KIYONO SATOSHI
IPC: G01C9/20
Filed: 1985-09-25
Abstract: PURPOSE:To make it possible to detect a wide range of an angle of inclination with high accuracy, by detecting the relative change of the angle of inclination between a vessel, which is equipped with a liquid always holding a consant shape to a gravity direction at the central part of the surface thereof, and the central part of the liquid surface. CONSTITUTION:A vessel 1 receives a liquid 5 such as mercury always holding a constant shape to a gravity direction at the central part 6 of the surface thereof. The irradiation part 2 fixed to the vessel 1 irradiates the central part 6 of the liquid surface with light. The light receiving part 3 fixed to the vessel 1 detects the reflecting state such as the reflecting direction and angle of reflection of reflected light relatively changing corresponding to the change of the incident state such as the incident direction and incident angle of light to the central part of the liquid surface accompanied by the inclination state of the vessel 1. By this method, the direction and angle of inclination of the article to be detected having the vessel 1 mounted thereto, that is, the angle of inclination around two orthogonal axes on a horizontal plane can be detected.
Patent JP-H0494046-A (JP)
Title: Flat plane type image display device and its manufacture
Inventor: NAKAMURA NAOHITO
IPC: H01J29/04
Filed: 1990-08-10
Abstract: PURPOSE:To form a phosphor of specified color on a position corresponding to the position of each of electron sources by baking and bonding the phosphor having a resist mixed therewith onto a face/plate through irradiation of the phosphor with light transmitted through a light-transmissive electron source substrate. CONSTITUTION:A phosphor having a photo-setting resist mixed therewith is applied on a face/plate 10, thereafter a glass substrate 1 formed with electron-source patterns, a modulation electrode 6 and the face/plate 10 are respectively fixed to a positioning jig and the output light 19 of a lamp 13 is radiated onto the phosphor coat from the reverse face of the glass substrate 1. The phosphor applied on the inner face of the face/plate 10 is bonded on the upper parts of the face/plate approximately vertical respectively to electron emission elements 17 corresponding respectively to the upper parts as a result of setting the resist, and each of the phosphor-bonded parts corresponds to a position against which each of accelerated electrons collides. At this time, light passing through about the same orbit as the electron has can not be prevented from its progress because the modulation electrode 6 has electron passage holes though there is the modulation electrode 6 between the glass substrate 1 and the face/plate 10.
Patent JP-H11148551-A (JP)
Title: Shift control method for motor-driven transmission device
Inventor: OTA ATSURO
IPC: F16H63/18
Filed: 1998-07-10
Abstract: PROBLEM TO BE SOLVED: To establish a shift control method for motor-driven transmission device excellent in operativemess. SOLUTION: A shifting shaft is rotated by a drive motor, and a sleeve is moved upon a main shaft through a shift fork and shift drum interlocking with the shifting shaft and is meshed with the intended gear. In this shift control method for a motor-driven transmission device, when the sleeve is moved to the contacting position with the gear, the motor is controlled under PWM control with a duty ratio of 70% for 20 ms as the initial period, and thereafter, a 50% duty ratio PWM control and a 70% duty ratio PWM control are repetitively conducted at 10-ms intervals.
Patent JP-H0631520-A (JP)
Title: End mill
Inventor: TOYODA SUSUMU
IPC: B23C5/20
Filed: 1992-07-16
Abstract: PURPOSE:To improve cutting edge chipping resistance by performing cutting edge processing of a cutting edge portion not more than 1mm from the edge in the axial direction and not more than 1mm from the edge in the radial direction. CONSTITUTION:Cutting edge processing of a cutting edge portion of a pin point end mill that does not perform rounding and/or chamfering of an edge portion where a peripheral cutting edge 2 and a bottom cutting edge 3 of an end mill on which a plural number of twisted cutting edges are formed on the periphery of a tool body is performed not more than 1mm from the edge in the axial direction (the peripheral cutting edge 2) and not more than 1mm from the edge in the radial direction (the bottom cutting edge 3). Further the peripheral cutting edge 2 and the bottom cutting edge 3 are coated in a thickness of 0.2 to 20mu of one layer or multilayer of twi or more layers of a hard substance of one kind or two kinds or more selected from among a carbide, a nitrogen, an oxide and a boride of Al, Si No 4a, 5a, and 6a group transition metal in the periodic table, among a boron carbide, a hard boron nitride, hard carbon and also among a group composed of a solid solution or a mixture of these substances.
Patent JP-H01196213-A (JP)
Title: Transplanting unit for seedlings
Inventor: FUJIMOTO SEIGO
IPC: A01C11/02
Filed: 1988-08-26
Abstract: PURPOSE:To improve transplanting efficiency by arranging the seedlings to be transplanted in a tape at a prescribed pitch, feeding them with a nipper in order, cutting them individually and transplanting with another nipper synchronously with the cutter. CONSTITUTION:A plurality of seedlings are arranged in a tape continuously at a prescribed pitch and held with tapes 10a on both sides to prepare a tape of seedlings. The tape is wound around the drum and set to the table in the transplanter. The transplanter is driven, a seedling feeder equipped with a plurality of teeth 14 is used to sent the tape of seedlings to the seedling nipper corresponding to the seedling pitch, and the tape 10a is cut off between the top seedling and the next with the cutter 15. Synchronously with the cutter 15, the transplanting nipper holds and transplants the top seedling P.
Patent JP-H0555619-A (JP)
Title: Semiconductor photodetector
Inventor: KUWAZUKA HARUHIKO
IPC: H01L31/10
Filed: 1991-08-23
Abstract: PURPOSE:To simultaneously realize high speed response and high quantum efficiency by cutting either a first layer or a second layer of a compound semiconductor slantly with respect to a compound semiconductor light absorbing layer to make it a light incident surface. CONSTITUTION:An n<->-type InGaAs light absorbing layer 22 and an n<->-type InP window layer 23 are epitaxially grown on an n<->-type InP substrate 21. P-type impurities are doped from a surface of the n<->-type InP window layer 23, and a p<+>-type diffusion region 24 is formed to reach the light absorbing layer 22. An SiN passivation film 27 is formed on a surface of a semiconductor, and an opening is formed on a part where an electrode is to be formed. A p-side electrode 25 is formed on the p<+>-type diffusion region 24 via the openings, and an n-side electrode 26 is formed on a side of the n-type InP layer 23 and the n-type InGaAs optical absorbing layer 22. The semiconductor substrate 21 has a surface 100 and a direction 110 in a lateral direction. A surface 111 is exposed by anisotropically etching the side of the substrate 21. The surfaces 100 and 111 intersect with each other at an angle of approximately 54.7 deg..
Patent JP-2001044184-A (JP)
Title: Semiconductor substrate heater
Inventor: MIWA SHIRO
IPC: H01L21/31
Filed: 1999-07-27
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor substrate heater which can reduce the amount of degasification, and can heat a semiconductor in a short time, and can efficiently irradiate the whole face of the substrate with thermoelectrons using a simple structure, and moreover is superior in controllability. SOLUTION: A semiconductor substrate heater, which accommodates a substrate within its vacuum camber, and heats the substrate with an electron beam thereby treating the substrate, is equipped with an electron beam filament connected to a pair of electrode terminals 8 and a shield plate 4, connected to one hand of the pair of electrode terminals and covering the electron beam filament 3, and the shield plate 4 is provided with an opening 5 which can apply electron beams over substantially the whole substrate heating face, counterposed to the substrate 7 to be heated.
Patent JP-H0493219-A (JP)
Title: Jointly molded parts
Inventor: KAWAMATA TADAHIRO
IPC: B29C45/26
Filed: 1990-08-09
Abstract: PURPOSE:To make alignment of parts by a parts feeder unnecessary by reducing a number of molds, by a method wherein a leg projected to the undersurface of a corner part of an outer frame is formed of a matter constituted of a jointly molded parts where a plurality of parts connected with the outer frame are molded integrally with the outer frame and a bearing part of the leg is formed on the top of the outer frame on a corresponding position. CONSTITUTION:A leg 8 is provided on the undersurface of four corner parts of an outer frame 1 by integral molding and a bearing pad part 9 is formed on the top of the corner part of the outer frame 1. Gates 2, 3 are detached by cutting off them with a cutter to take out parts 4, 5, 6, 7 from the jointly molded parts A. Several sheets of jointly molded parts are piled up vertically, piled up matter of which is incased. Since the leg 8 is fitted in and supported by the bearing pad part 9 of the top of a corner part of the jointly molded parts A of a subordinate position, the leg can be incased without having positional deviation. Even at the time of taking out of the same, taking out operations are performed smooth without being caught on the other matter.
Patent JP-H0660016-A (JP)
Title: System for controlling access request to shared resource
Inventor: SUDO KIYOSHI
IPC: G06F15/16
Filed: 1992-08-10
Abstract: PURPOSE:To enable a low-speed device to obtain a right to make access without fail even if the access priority of a high-speed device is set fixedly high as to the access request control system in a system having the shared resources. CONSTITUTION:When a specific device 1 obtains the right to make access once and starts for making access to the shared resource 4, the device continues to output an in-access signal unless other devices 2 and 3 output access requests to carry on the access without outputting a request signal, and resets the in- access signal when the devices 2 or 3 makes an access request; when access is required again, a request signal is outputted and after the device 2 between other devices 2 and 3 finishes access, the device 3 imparts the right to make access preferentially to the device 2, thereby performing request control so that access is equal.
Patent JP-H1140650-A (JP)
Title: Wafer-detecting device equipped with wafer-aligning device
Inventor: TANIYAMA YASUSHI
IPC: H01L21/68
Filed: 1997-07-22
Abstract: PROBLEM TO BE SOLVED: To align wafers, and to simplify the whole constitution, even when a wafer sensor cannot be inserted between wafers. SOLUTION: A first wafer sensor device S1 is arranged on the one side face of a column so as to be movable back and forth for a wafer carrier, and a second wafer sensor device S2 is arranged on the other side face, so as to be selectively stoppable at a middle position Q2 and a forward edge position Q3 for the wafer carrier. Also, an aligning board 44 of a wafer-aligning device T is arranged between the first wafer sensor device S1 and the second wafer sensor device S2 so as to be selectively stoppable at each first and second middle position Q4 and Q5 and a forward edge position Q6 . The wafer-aligning device T is constituted so as to be movable back and forth independently of each first and second wafer sensor device S1 and S2 .
Patent JP-H0762731-A (JP)
Title: Joining method of pillar and beam
Inventor: SUEOKA KAZUHISA
IPC: E04B1/16
Filed: 1993-08-27
Abstract: PURPOSE:To prevent a stress center distance from being shortened at forming a lap joint. CONSTITUTION:Pillar main forcements 11a fixedly provided along the inside of a pillar formwork projecting from a pillar 11 at longest up to the slab face of an upper storey are inserted into belt reinforcements 14b of a previously assembled reinforcement 14 formed into the same sized square sleeve as the pillar main reinforcements 11a of a hollow precast pillar 11, so as to form a lap joint out of the pillar main reinforcements 11a and vertical reinforcements 14a. Concrete is placed in a panel zone, semi-precast concrete beams 12, 13, and the pillar 11, and the hollow precast pillar 18 of the upper storey is built in the upper half of the previously assembled reinforcement 14 so as to form a lap joint. In this way, the pillar main reinforcements 11a of the pillar 11 and the vertical reinforcements 14a of the previously assembled reinforcement 14 are arranged on the side of the same square sleeve, and hence the stress center distance is prevented from being shortened at forming a lap joint.
Patent JP-S6457660-A (JP)
Title: Solid-state image sensing device
Inventor: HENMI KAZUHIRO
IPC: H01L31/02
Filed: 1987-08-28
Abstract: PURPOSE:To make small in size a microminiature camera and an endoscope and the like by a method wherein the lead wire picked out from a substrate is arranged on the electrode pad of a solid-state image sensor, and to make it possible to mount the solid-state image of small type by pinching said lead wire with the solid-state image sensor and optical glass. CONSTITUTION:In the solid-state image sensor module composed of a solid-state image sensor 1, optical glass 2 and a substrate 4, the lead wire 9 picked out from the substrate 4 is arranged on the electrode pad of the solid-state image sensor 1, and the lead wire 9 is pinched by the solid-state image sensor 1 and the optical glass 2. Then, the solid-state image sensor 1 and the optical glass 2 are coupled using a transparent bonding agent 11. For example, the solid-state image sensor module is composed of the solid-state image sensor 1, the optical glass 2, and the flexible printed substrate 4, and the lead wire 9 and led out from the flexible printed substrate 4, on which a chip part 10 is mounted, is adhered in a pinching manner between the solid-state image sensor 1 and the optical glass 2 by a transparent bonding agent 11 so as to obtain electric connection with the solid-state image sensor 1.
Patent JP-H0260357-A (JP)
Title: Transfer telephone device
Inventor: KOMURO MAKOTO
IPC: H04M3/42
Filed: 1988-08-26
Abstract: PURPOSE:To retransfer a call to a telephone set in another place by receiving a DTMF signal of dial data of the retransfer destination by a DTMF signal reception unit at the time of sending this DTMF signal from a calling subscriber in accordance with a voice guidance. CONSTITUTION:When a call comes to a terminating line wire 7, a line wire interface unit 1a sends incoming data to a CPU 6 and the voice guidance indicating that the call is being transferred is sent from an audio guidance output unit 3 to the line wire 7. When the transfer destination is busy, a guidance indicating this busy state is sent from the unit 3. When the calling subscriber desires to retransfer the call to another transfer destination, the dial of the retransfer destination is sent with the DTMF signal. This dial data is received by a DTMF signal reception unit 4 and is sent to the line wire. A voice guidance about the dial number for confirmation is sent from the unit 3 to the calling subscriber. When the second transfer destination responds, a transfer unit 2 connects the line wire 7 and an originating line wire 8 by the control of the CPU 6.
Patent JP-2001044492-A (JP)
Title: Visible light emitting material
Inventor: NISHIMOTO KEIJI
IPC: H01L33/48
Filed: 1999-07-28
Abstract: PROBLEM TO BE SOLVED: To provide a visible light emitting material that can easily control light emission wavelength. SOLUTION: Vacuum and electron beam deposition is used for forming an SiO2 film. At this time, when SiO2 material is evaporated for forming the film while the SiO2 material is left as is,the need for introducing oxygen for oxidization is eliminated, thus preventing oxidization of an a-Si: H film In this manner, a-Si: H and SiO2 films 12 and 13 each formed by repeating with desired thickness several tens of times, for example, for forming a multilayer film. At this time, the light emission center of a defect is formed in the SiO2, and the light emission centers of an interface and the a-Si: H are formed respectively.