Patent SG-11201906904Y-A (SG)
Title: Removal of process effluents
Inventor: RANDHAWA RUBINDER S
IPC: H01L21/687
Filed: 2018-02-06
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 09 August 2018 (09.08.2018) WIP0 I PCT omit VIII °nolo How loon mo lio iflo oimIE (10) International Publication Number WO 2018/145070 Al (51) International Patent Classification: H01L 21/67 (2006.01) HOlL 21/687 (2006.01) H01L 21/02 (2006.01) (21) International Application Number: PCT/US2018/017014 (22) International Filing Date: 06 February 2018 (06.02.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/455,425 06 February 2017 (06.02.2017) US 62/518,297 12 June 2017 (12.06.2017) US (71) Applicant: PLANAR SEMICONDUCTOR, INC. [US/US]; 1759 South Main Street, Suite 120, Milpitas, Cal- ifornia 95035 (US). (72) Inventors: RANDHAWA, Rubinder S.; 3263 Cranbrook Place, Dublin, California 94568 (US). CHRISTOV, Har- ry; 390 Darryl Drive, Campbell, California 95008 (US). (74) Agent: SCHEER, Bradley W. et al.; Schwegman Lund- Published: berg & Woessner, P.A., P.O. Box 2938, Minneapolis, Min- nesota 55402 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: — of inventorship (Rule 4.17(iv)) — with international search report (Art. 21(3)) (54) Title: REMOVAL OF PROCESS EFFLUENTS W O 20 18/ 145 07 0 Al (57) : Various embodiments comprise apparatuses and related method for cleaning and drying a substrate. In one embodiment, an appa- ratus includes a vertical substrate holder to hold and rotate the substrate at various speeds. An inner shield and outer shield, when in a closed posi- tion, surround the vertical substrate holder during operation of the apparatus. Each of the shields can operate independently in at least one of rotational speed and direction from the other shield. A front-side and back-side spray jet are arranged to spray at least one fluid onto both sides of the substrate and edges of the substrate substantially concurrently. A gas flow, combined with a high rotational-speed of the shields and substrate, assists in drying the substrate. At least one turbine disk is coupled in proximity to at least one of the shields to remove excess amounts of fluid. Additional apparatuses and methods of forming the apparatuses are disclosed. FIG. 6