baber/WOPTO huggingface dataset:
Patent TW-564476-B (TW)
Title: Method for fabricating a monolithic chip including pH, temperature and photo intensity multi-sensors and a readout circuit
Inventor: HSIUNG STEPHEN S K
IPC: H01L21/00
Filed: 2002-10-21
Granted: 2003-12-01
Abstract: A method for fabricating a monolithic chip including multi-sensors that can detect pH, temperature, photo intensity simultaneously and a readout circuit. As such, beside the multi-sensors, the readout circuit also has a reduced chip area at low cost because selection switches are used to sequentially read pH, temperature and photo intensity detecting values, wherein the readout is completed within a clock cycle. The entire structure is fabricated with the standard 0.5 mum CMOS IC, double poly double metal (DPDM), n-well technology and allows the integration of the on-chip signal conditioning circuitry. The chip fabricated by the method can not only sense the pH, temperature, photo values but also apply the extended gate field effect transistor (EGFET) on the temperature and light compensation to produce realistic pH values.
Patent TW-569422-B (TW)
Title: Flash memory and method for manufacturing thereof
Inventor: HUNG CHIH-WEI
IPC: H01L27/00
Filed: 2002-11-05
Granted: 2004-01-01
Abstract: A flash memory, including a substrate, two tunnel oxide layers, two floating gates, a plurality of first oxide layers, two dielectric layers, two controlling gates, a plurality of second oxide layers, a third oxide layer, and an erasing gate. In this case, the substrate has at least two drains and a source that is located between the drains. The tunnel oxide layers are formed on the substrate between each drain and the source. Each of the floating gates is formed on each of the tunnel oxide layers. The first oxide layers are formed aside the floating gates, respectively. Each of the dielectric layers is formed on each of the floating gates, and each of the controlling gates is formed on each of the dielectric layers. The second oxide layers are respectively formed on surfaces of the controlling gates, wherein a lateral width of each second oxide layer is larger than that of each first oxide layer. The third oxide layer is formed on the source, and the erasing gate is formed on the third oxide layer and located between the floating gates. Furthermore, this invention also discloses a method for manufacturing the memory.
Patent TW-591933-B (TW)
Title: Image-reading device
Inventor: TAKEI AKIRA
IPC: G03B27/62
Filed: 2003-01-10
Granted: 2004-06-11
Abstract: An image-reading device is provided, which has small mounting area and can obtain a good image. Said image-reading device includes a contact-glass 300, which is arranged vertically; a belt 505, which is arranged rotatably along the contact-glass 300 and carries the front end of a photograph until to a reading-basis position T; a 1st attraction section 531, which let the pressure in the 1st attraction-duct 532 become negative by means of the 1st attraction-fan 503 and the photograph is attached from several gas-absorbing holes formed on the belt 505. With respect to the contact-glass 300, the photograph is kept at a given distance and adsorbed on the belt 505 at the reading position, from the photograph the carriage is moved upwards along the contact-glass and the image is read. Because the contact-glass 300 is arranged nearly vertically, the mounting area is small, and the distance between the photograph and the contact-glass 300 is large, whereas the Newton-ring cannot occurs.
Patent TW-I314463-B (TW)
Title: Device for mixing medical fluids, and method for enabling such mixing
Inventor: CLAES WALLEN
IPC: A61J1/05
Filed: 2003-03-21
Granted: 2009-09-11
Abstract: A device and method for mixing medical fluids is disclosed. The device has an inlet port, an injection port, an outlet port, a first duct between the injection port and the inlet port, and a second duct between the inlet port and the outlet port. The injection port is sealed by a fluid-proof membrane which can be penetrated by an injection needle. The device further includes at least a first portion made of a first material and a second portion made of a second, substantially more resilient material, wherein the inlet port and the injection port are included in the first portion and the outlet port is included in the second portion, and the first and second portions are attached to each other by means of a combined friction coupling and snap connection.
Patent TW-I268729-B (TW)
Title: Protected organic electronic devices and methods for making the same
Inventor: BROWN JULIA J
IPC: H05B33/00
Filed: 2003-04-11
Granted: 2006-12-11
Abstract: An organic electronic device structure and a method of making the same. According to a first aspect of the invention, an organic electronic device structure is provided, which comprises: (a) a substrate layer; (b) an organic electronic region disposed over the substrate layer; (c) an adhesive layer disposed over the organic electronic device; and (d) a barrier layer disposed over the adhesive layer. According to a second aspect of the present invention, an organic electronic device structure is provided, which comprises: (a) a substrate layer; (b) an organic electronic region disposed over the substrate layer; (c) a barrier layer disposed over the organic electronic region; (d) an adhesive layer disposed over the substrate layer and over the barrier layer; and (e) an additional layer disposed over the adhesive layer. According to yet another aspect of the invention, a method for providing an organic electronic device structure of provided. The method comprises: (1) providing a first region comprising (a) a substrate layer and (b) an organic electronic region provided over the substrate layer; (2) providing a second region comprising at least one additional layer; and (3) adhering the first region to the second region using a pressure sensitive adhesive layer. In many preferred embodiments, the organic electronic device region is an OLED region.
Patent TW-I289317-B (TW)
Title: Image display device
Inventor: TAKENAKA SHIGEO
IPC: H01J9/18
Filed: 2003-06-03
Granted: 2007-11-01
Abstract: The image display device of the present invention includes: a first substrate including an image display surface having a plurality of fluorescent layers corresponding to respective pixels; a second substrate including a plurality of electron sources for exciting the respective fluorescent layers; and a plurality of independent spacers arranged between the first substrate and the second substrate. Each of the spacers (30a, 30b) has its center (SC) positioned apart from the straight line connecting the pixel center of the two adjacent fluorescent layers.
Patent TW-I221960-B (TW)
Title: Test method of command cache memory
Inventor: LIU WIN-HARN
IPC: G06F11/263
Filed: 2003-06-03
Granted: 2004-10-11
Abstract: A test method of command cache memory directly writes executable machine code into the memory to generate test functions. Therefore, while testing, the code quantity of the machine code is variable and controllable. The method comprises the following steps: first allocating a segment of memory space and then writing the executable machine code into the memory space; next treating the executable machine code as test functions to execute the test; evaluating the execution results and finally releasing the memory space.
Patent TW-I252324-B (TW)
Title: Method and system for determining the speed and distance of a mobile unit
Inventor: CUFFARO ANGELO
IPC: G01S19/25
Filed: 2003-06-24
Granted: 2006-04-01
Abstract: Apparatus and methods are disclosed for estimating the position and velocity of mobile wireless transmit/receive units (WTRUs) in a wireless communication system. Network stations use directional communication beams to divide service area into sectors to provide communication services to the WTRUs. A WTRU saves pertinent information such as sector ID, received power and time of reception of the several received signals. The collected information is sent to the network, where it is used to estimate the WTRUs position, speed and direction of travel, which information can then be used to improve radio resource management.
Patent TW-I223727-B (TW)
Title: Direct deposition waveguide mirror
Inventor: DOI YUTAKA
IPC: G02B6/43
Filed: 2003-06-30
Granted: 2004-11-11
Abstract: Waveguides formed via direct deposition of reflective material on isolated surfaces of the waveguides rather than on every surface of the waveguides are described. It is contemplated that direct deposition facilitates deposition on isolated surfaces. Deposition only on isolated surfaces reduces costs and risks. Cost is reduced by reducing the amount of reflective material required. Risk of metal particles plugging the waveguide reduced both by the decrease in amount of reflective material used, and in the method of depositing it.
Patent TW-I233659-B (TW)
Title: Method of forming isolation film of semiconductor device
Inventor: LEE SUNG-HOON
IPC: H01L21/762
Filed: 2003-07-03
Granted: 2005-06-01
Abstract: Disclosed is a method of forming the isolation film in the semiconductor device. The method comprises the steps of sequentially forming a pad oxide film and a pad nitride film on a silicon substrate, forming a photoresist pattern through which an isolation region is opened, on the pad nitride film, etching the pad nitride film and the pad oxide film using the photoresist pattern as an etch mask, thus exposing the silicon substrate of the isolation region, implementing an electrochemical etch process to form porous silicon in the silicon substrate of the exposed isolation region, removing the photoresist pattern, and implementing a thermal oxidization process to oxidize porous silicon, thereby forming an oxide film in the isolation region.
Patent TW-I236706-B (TW)
Title: Process for vertically patterning substrates in semiconductor process technology by means of inconformal deposition
Inventor: HECHT THOMAS
IPC: H01L21/3065
Filed: 2003-07-04
Granted: 2005-07-21
Abstract: On a substrate (1), typically a semiconductor substrate where its surface has been patterned in a non-flat manner, a deposition method is used to provide a covering layer (3) on the processed surface (2) vertical with or inclined to the substrate surface (101). The covering layer (3) is patterned in a direction vertical to the substrate surface (101) through the use of at least one processing amount of forward material and/or through the use of temporarily limited deposition method so as to form a function layer or mask by the following procedure step.
Patent TW-I222831-B (TW)
Title: Video playback system to generate both progressive and interlace video signals
Inventor: LIN TZU-PING
IPC: H04N5/93
Filed: 2003-07-09
Granted: 2004-10-21
Abstract: A video playback system includes a main picture processor, an interlace generation module and a video encoding module. The main picture processor produces corresponding main picture signals based on video signals from a memory. The main picture signals are converted to progressive signal stream through a predetermined video signals processing. The interlace generation module receives the progressive signal stream, retrieves the even portion and the odd portion of the progressive video signals alternately, and generates a set of interlace signal stream. The video encoding module receives both the progressive signal stream and the interlace signal stream, and generates a set of progressive video signals and a set of interlace video signals to corresponding video display apparatuses. Thereupon, the video playback system can simultaneously provide both the progressive video signals and interlace video signals to the video display apparatuses.
Patent TW-I223897-B (TW)
Title: MOS transistor having reduced source/drain extension sheet resistance
Inventor: CHIEN CHIN-CHENG
IPC: H01L29/78
Filed: 2003-08-07
Granted: 2004-11-11
Abstract: The present invention provides a novel MOS transistor structure. The MOS transistor according to one preferred embodiment includes a gate electrode formed on a semiconductor substrate, and a gate-insulating layer formed between the gate electrode and the semiconductor substrate. A spacer is formed on each sidewall of the gate electrode. A lightly doped source/drain extension is formed under the spacer with a raised epitaxial layer interposed between the spacer and the semiconductor substrate. The epitaxial layer, which is part of the lightly doped source/drain extension, has a lattice constant that is greater than the lattice constant of silicon crystal. A heavily doped source/drain region is formed in the semiconductor substrate next to the edge of the spacer. A silicide layer is formed on the heavily doped source/drain region.
Patent TW-I232937-B (TW)
Title: Acceleration sensor
Inventor: TANAKA HIROSHI
IPC: G01P15/09
Filed: 2003-08-14
Granted: 2005-05-21
Abstract: There are provided a piezoelectric vibrator 2 capable of producing a charge depending on stress applied thereon, and a weight 1. Multiple pairs of detection electrodes 3a and 3b and 4a and 4b are provided on front and back surfaces of the piezoelectric vibrator 2. The detection electrodes 3a and 4a are connected in parallel and the detection electrodes 3b and 4b are connected in parallel so that the detection electrodes define electrostatic capacities Cd1 and Cd2 connected in parallel. This arrangement doubles the charge sensitivity while the voltage sensitivity is maintained.
Patent TW-I249485-B (TW)
Title: Freight container for a freight truck
Inventor: CHEN CHENG-CHANG
IPC: B62D33/04
Filed: 2003-08-13
Granted: 2006-02-21
Abstract: A freight container for a freight truck includes a parent container and plural baby containers combined in the parent container and possible to be adjusted in its dimensions for receiving freight and pulled out of the parent container in case of the truck stopping. The parent container is fixed with a chassis and the baby containers are movably combined with the parent container.
Patent TW-I239606-B (TW)
Title: Heat spreader and semiconductor device and package using the same
Inventor: TACHIBANA TAKESHI
IPC: H01L23/373
Filed: 2003-11-06
Granted: 2005-09-11
Abstract: A semiconductor device and package has a heat spreader directly disposed on the reverse surface of the semiconductor device. This heat spreader includes a diamond layer or a layer containing diamond and ceramics such as silicon carbide and aluminum nitride. The heat spreader is directly formed on a substrate for the semiconductor device. In particular, the heat spreader is composed of a diamond layer and one or two metal or ceramic members, which are bonded to the diamond layer with one or two polymer adhesive layers. This diamond layer has a fiber structure across the thickness or a microcrystalline structure. Cilia are formed on a surface of the diamond layer facing the one or two metal or ceramic members.
Patent TW-I223428-B (TW)
Title: Frame attaching process
Inventor: TSENG NENG-YU
IPC: H05K3/36
Filed: 2003-11-13
Granted: 2004-11-01
Abstract: A frame attaching process is provided. The frame attaching process is suitable for attaching a transmission substrate to an active surface of a chip by a frame, wherein the active surface of the chip has a functional area. In the frame attaching process, the frame can be preformed on the attaching surface of the transmission substrate or on the active surface of the chip. Then, the attaching surface of the transmission substrate is attached to the active surface of the chip by the frame under a negative pressure, and the frame is surrounded the functional area. Finally, the frame is solidified. Therefore, the frame attaching process can reduce the probability that the frame cracks, and the frame attaching process improves the yield factor of the process.
Patent TW-I232794-B (TW)
Title: Damping device for pneumatic tool
Inventor: JUO JUNG-TSUEN
IPC: B25C1/04
Filed: 2003-12-15
Granted: 2005-05-21
Abstract: Disclosed is a damping device for pneumatic tool, including: a body, the body having a hollow sleeve to form a receiving chamber in the hollow sleeve, the body being provided with an air inlet in communication with the receiving chamber for the entry of pressurized air, the receiving chamber being provided with a hammer set capable of linear and reciprocal movement along an axial direction; a piston set provided at an end of the hammer set facing the receiving chamber, the position set comprising a piston dividing the receiving chamber into first and second air chambers, while a through hole communicating between the two air chambers whereby upon impact, the hammering set is acted upon by a recoil force and moves towards the second air chamber such that an excellent damping effect is achieved upon compressing the air in the second air chamber by the piston.
Patent TW-I275901-B (TW)
Title: Perfluoropolyether liquid pellicle and methods of cleaning masks using perfluoropolyether liquid
Inventor: CUMMINGS KEVIN
IPC: G03F1/82
Filed: 2004-01-14
Granted: 2007-03-11
Abstract: A patterning device, for example a mask, for use in a photolithographic apparatus includes a blank layer, a layer of patterned opaque material on a surface of the blank layer and a pellicle of perfluoropolyether (PFPE) liquid that covers the surface. A method of manufacturing a patterning device includes providing a patterning device having a blank layer and a patterned layer of opaque material on a surface of the blank layer, applying PFPE liquid to the surface that covers the surface to form a PFPE liquid layer, and removing at least a portion of the PFPE liquid layer. A method of cleaning a patterning device for use in photolithographic projection apparatus, the patterning device including a blank layer and a patterned layer of opaque material on a surface of the blank layer, the method including applying PFPE liquid to the surface of the blank layer that covers the surface to form a PFPE liquid layer and removing at least a portion of the PFPE liquid layer.
Patent TW-I247298-B (TW)
Title: Compatible optical pickup and light output amount detecting method performed in the compatible optical pickup
Inventor: LIM JI-HWAN
IPC: G11B7/1263
Filed: 2004-01-29
Granted: 2006-01-11
Abstract: Here are a compatible optical pickup, including first and second light sources for emitting lights with different wavelengths and first and second photodetectors for detecting an information signal and/or an error signal, and a method of detecting the amount of output light using the compatible optical pickup. The first photodetector monitors the amount of light output from the second light source, and the second photodetector monitors the amount of light output from the first light source. Since the first and second photodetectors are used to detect a signal for use in monitoring the amount of light output from each of the second and first light sources, no extra front photodetectors are required. Thus, the number of optical component parts included in the optical pickup can be reduced, thereby lowering the manufacturing costs for the optical pickup. Also, there is no need to secure a space in a base where a front photodetector is to be installed, so the base is simplified. Thus, inferior moldings are reduced, and the durability of a mold can be prolonged.
Patent TW-I237860-B (TW)
Title: Integrated chip structure for wire bonding and flip chip assembly package and fabrication process thereof
Inventor: TSAI MON-CHIN
IPC: H01L21/48
Filed: 2004-02-13
Granted: 2005-08-11
Abstract: A fabrication process of integrated chip structure for wire bonding and flip chip assembly package mainly comprises the following steps. First, a chip having a plurality of chip pads and a passivation layer exposing the chip pads is provided. Next, an under bump metallurgy layer having an aluminum layer, a nickel-vanadium layer and a copper layer is formed on each of the chip pads. Then, a portion of the copper layer and the nickel-vanadium layer formed above some of the chip pads is removed so as to leave the aluminum layer remained above some of the chip pads. Next, a plurality of openings are defined by a photo-resist layer and expose the copper layer, the nickel-vanadium layer and the aluminum layer. Then, a solder material is filled into the openings to form a plurality of solder bumps. Finally, a reflow process is performed to have the solder bumps secured to the copper layer of the under bump metallurgy layer. In addition, this invention also provides an integrated chip structure for wire bonding and flip chip assembly package which is formed by the fabrication process as mentioned above.
Patent TW-I282428-B (TW)
Title: LCD system and its pixel array inspection circuit
Inventor: HO YUNG-YUAN
IPC: G01R31/01
Filed: 2004-02-19
Granted: 2007-06-11
Abstract: A pixel array inspection circuit, which is suited the pixel array of the reflected-type liquid crystal device panel comprises a horizontal checking module and a vertical checking module. The horizontal checking module has a choosing terminal, a plurality of horizontal data input terminal, a plurality of horizontal checking signal terminal and a plurality of horizontal signal output terminal. The horizontal checking module sends the signal of the horizontal checking terminal or the plurality of horizontal data input terminal in accordance with the choosing signal received by choosing terminal. The vertical checking module has the choosing terminal, a plurality of vertical data input terminal, a plurality of vertical checking signal terminal and a plurality of vertical signal output terminal. The vertical checking module sends the signal of the vertical checking terminal or the plurality of vertical data input terminal in accordance with the choosing signal received by choosing terminal.
Patent TW-I247973-B (TW)
Title: Lithographic manufacturing method, lithographic projection apparatus, computer-readable medium comprising software program, and robotics system
Inventor: VAN DER SANDE JORIS JAN
IPC: H01L21/027
Filed: 2004-02-19
Granted: 2006-01-21
Abstract: The invention relates to a device manufacturing method comprising the steps of: providing a radiation beam using a radiation system; projecting the radiation beam onto a substrate of radiation sensitive material; specifying a trajectory comprising a position and/or an orientation as a function of time to be followed by the substrate relative to the radiation beam, wherein the trajectory is a mathematical smooth function up to at least the third order which connects a first state and a second state, wherein both the first state and the second state comprise boundary values for at least the position and/or the orientation and for first and second derivatives of the position and/or orientation. Furthermore, the invention relates to a lithographic apparatus arranged for performing the method, and a software program arranged for performing the method. The invention also relates to a robotics system arranged for specifying a trajectory to be followed between two elements of the system.