baber/WOPTO huggingface dataset:
Patent JP-2011119640-A (JP)
Title: Semiconductor device, and method of manufacturing the same
Inventor: KUBOTA YOSHITAKA
IPC: H01L27/06
Filed: 2010-05-19
Abstract: <P>PROBLEM TO BE SOLVED: To improve performance of a transistor and to improve characteristics of an anti-fuse constituted of a transistor after breakdown of a gate insulating film.  <P>SOLUTION: An nMOS transistor acting as an anti-fuse element 190 is provided with an N-type channel region 112a. Although a typical nMOS transistor 194 is provided with an N-type extension region 120 and a P-type pocket region 122, the anti-fuse element 190 is not provided with the extension region or the pocket region.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010209107-A (JP)
Title: Improved process for preparation of oxidized phospholipid
Inventor: HALPERIN GIDEON
IPC: C07F9/10
Filed: 2010-05-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide novel synthetic routes, which are highly applicable to industrial preparation of therapeutically beneficial oxidized phospholipids.  <P>SOLUTION: A reacting mixture which comprises compounds having a glycerolic backbone and one or more oxidized moieties attached to the glycerolic backbone through an ether bond is produced by reacting a compound having the glycerolic backbone and one or more free hydroxyl groups with a compound having one or more oxidized moieties. Particularly, disclosed are methods of introducing phosphorous-containing moieties such as phosphate moieties to compounds having glycerolic backbone.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011025226-A (JP)
Title: Wet dust collector
Inventor: KAWAI SHINJI
IPC: B01D47/02
Filed: 2010-05-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a wet dust collector which overcomes various problems due to the generation of bubbles while it is prepared at low cost and is compact and lightweight.  <P>SOLUTION: The wet dust collector is provided with a vessel to store water, an exhaust unit to cover the upper surface opening of the vessel, a suction pipe which is fixed at the exhaust unit, suspended within the vessel and opened under the water surface, a suction force generator to make the suction pipe generate suction force, a tubular body which is arranged in order to form a conduit on the outer periphery of the suction pipe, of which the lower end opening is extended to more outward than the lower end opening of the suction pipe and which is provided with an overflow on the water surface, and a shield plate which is fixed to the tubular body above the exhaust port. A bubble capturing means is further arranged between the overflow installed at the tubular body and the water surface within the vessel. It is further preferable that the shield plate is composed of the curvature inner surface opened downward.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011222928-A (JP)
Title: Wiring board and probe card
Inventor: HAYAMIZU TAKESHI
IPC: G01R1/073
Filed: 2010-05-28
Abstract: PROBLEM TO BE SOLVED: To provide a high-reliability wiring board which permits surface wirings and surface via conductors to be connected surely even for surface wirings in reduced size and is capable of element inspection at higher speed and of high-speed inspection owing to reduced stray capacitance.SOLUTION: The wiring board comprises an insulating base 1 composed of a plurality of ceramic insulation layers 1a which are laminated on top of another, external electrodes 2 formed on underside of the insulating base 1, and internal wirings 3 including via conductors connected to the external electrodes 2 and led out to the top face of the insulating base 1. In the wiring board, surface via conductors 3a whose top faces are exposed to the top face of the insulating base 1 penetrating through an uppermost insulating layer 1a of the internal wirings 3 are disposed in radial directions from the center of a wiring substrate 4 as viewed from above. Should the surface via conductors 3a be displaced, because there exist portions extending in a direction opposite the displacement direction, sure connections with the surface via conductors 3a can be expected even for a surface wiring 5 in reduced size, and a stray capacitance of the surface wiring 5 can be reduced.
Patent JP-2011248777-A (JP)
Title: Information processor
Inventor: OGURA YOSHIHIRO
IPC: G06F21/10
Filed: 2010-05-28
Abstract: PROBLEM TO BE SOLVED: To provide an information processor that can easily transfer a license for installed software to another apparatus without a license key and user's burden among apparatuses of which licenses for software are managed with a license management system, and automatically return the license to a desired apparatus after the licence transfer.SOLUTION: An information processor comprises: means for downloading install data of software corresponding to a prescribed function from outside to install it; means for obtaining a license file from outside to activate the function; means for managing existence of a license for the function regardless of existence of the license file; means for transferring a license among apparatuses and updating existence of the license for the function; and means for returning the transferred license to a prescribed apparatus according to a specified automatic return condition.
Patent JP-2011252807-A (JP)
Title: Heat treatment abnormality detection method and rolling bearing
Inventor: KOMATA HIROKI
IPC: F16C33/32
Filed: 2010-06-02
Abstract: PROBLEM TO BE SOLVED: To provide a method which is applicable to members with various different shapes, hardening conditions, or the like, and can detect a heat treatment abnormality of a steel member to which high frequency hardening is performed without destroying the steel member, and to provide a high performance rolling bearing in which heat treatment quality of a bearing member is assured.SOLUTION: When a smoothing curve satisfies all of the following conditions A-C, it is determined that there is no heat treatment abnormality in a test material. Condition A: the smoothing curve has the maximum peak at a depth position deeper than that of a reflected wave which results from a self-hardened tissue and whose intensity is the lowest, and the intensity of the reflected wave of the maximum peak is the highest except at a part which results from a non-self-hardened tissue and results from surface scattering. Condition B: the intensity of the reflected wave which results from the self-hardened tissue and whose intensity is the lowest is equal to or less than a first predetermined threshold. Condition C: the intensity of the reflected wave whose intensity is the highest is equal to or more than a second predetermined threshold except at a part which results from the non-self-hardened tissue and results from the surface scattering.
Patent JP-2011014133-A (JP)
Title: Method for clustering sample using mean shift procedure
Inventor: TUZEL CUNEYT ONCEL
IPC: G06N20/10
Filed: 2010-06-03
Abstract: PROBLEM TO BE SOLVED: To provide a weakly supervised kernel mean shift procedure where the inherent structure of samples is determined from constraints that specify pairs of samples that must be located in the same cluster or different clusters.SOLUTION: A method clusters samples using a mean shift procedure includes a step of determining a kernel matrix from the samples in a first dimension; a step of determining a constraint matrix and a scaling matrix from a constraint set; and a step of projecting the kernel matrix to a feature space, having a second dimension using the constraint matrix and clusters the samples, according to the kernel matrix projected to the feature space having the second dimension.
Patent JP-2011254917-A (JP)
Title: Buckle
Inventor: KAWAGUCHI MANABU
IPC: A44B11/25
Filed: 2010-06-07
Abstract: PROBLEM TO BE SOLVED: To provide a buckle permitting a wobble in a thickness direction of the buckle to be reduced.SOLUTION: The buckle includes a male member 2 having a pair of flexible arms 22 having portions to be locked, and a female member having a storage portion 3 having a pair of cylinder side walls facing each other and formed into a flat cylinder and having a locking portions locking to the portions to be locked which the arms 22 inserted into the storage portion have formed in the storage portion. In a condition where the portions to be locked and the locking portions locks with each other, the distance between the inner surface in each of the cylinder side walls and the outer surface in the arms 22 is shorter than in the other areas at the tip and base end in each of the arms 22.
Patent JP-2011255914-A (JP)
Title: Method for regenerating decrepit fire cistern
Inventor: HAYASHI SHINICHIRO
IPC: A62C99/00
Filed: 2010-06-08
Abstract: PROBLEM TO BE SOLVED: To prevent water leakage from a decrepit fire cistern, and to provide a collapse preventing means.SOLUTION: A method for regenerating the decrepit fire cistern includes steps for draining the inside of the decrepit fire cistern, stretching a permeable sheet in the form of a bag along the bottom and walls of the fire cistern, and spraying a resin solution over the permeable sheet, thereby converting the permeable sheet into an impermeable sheet. The permeable sheet which can be carried in from a narrow manhole is processed into a bag form in the tank or the permeable sheet is carried in after being processed, and a resin solution such as urethane is sprayed over the permeable sheet to convert it into the impermeable sheet. After the permeable sheet is converted into the impermeable sheet, unit members are stacked in the tank from the bottom to a ceiling, thereby preventing the collapse of a top. The collapse of the top in the worst case can be prevented by arranging blocks in the fire cistern.
Patent JP-2012004288-A (JP)
Title: Electronic device
Inventor: NOMURA TAKUMI
IPC: H01L23/28
Filed: 2010-06-16
Abstract: PROBLEM TO BE SOLVED: To prevent, as much as possible, peeling of mold resin without interposing primer between a circuit board and the mold resin in an electronic device with a half-mold structure where the circuit board equipped with electronic components on one face and a heat sink on the other face is sealed by the mold resin and the heat sink is exposed from the mold resin on the other face of the circuit board.SOLUTION: A ratio V1/V2 of a volume V1 of an overlapping portion of a mold resin 40 and a volume V2 of an overlapping portion of a heat sink 30 is 2.6 or smaller and 3.7 or greater when the overlapping portion of the mold resin 40 is a portion of the mold resin 40 located in an area onto which a circuit board 10 is projected in an overlapping direction of the circuit board 10 and the mold resin 40, and the overlapping portion of the heat sink 30 is a portion of the heat sink 30 located in an area onto which the circuit board 10 is projected in an overlapping direction of the circuit board 10 and the heat sink 30.
Patent JP-2012003502-A (JP)
Title: Electronic apparatus and image processing method
Inventor: TANABE KENICHI
IPC: G06T1/00
Filed: 2010-06-16
Abstract: PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of providing a user with a dynamic image including an unexpected static image with a high viewing effect.SOLUTION: According to an embodiment, indexing means generates index information showing an attribute for each of a plurality of static images. First reproducing means reproduces a first dynamic image using the plurality of static images. First image selecting means selects a first static image from the plurality of static images. Image extracting means extracts a group of static images including the static image associated with the first static image on the basis of the index information. Second reproducing means reproduces a second dynamic image using the group of static images in place of the first dynamic image.
Patent JP-2012000072-A (JP)
Title: Novel antifibrin antibody
Inventor: MATSUMURA YASUHIRO
IPC: C12P21/02
Filed: 2010-06-18
Abstract: PROBLEM TO BE SOLVED: To provide a novel antibody binding with fibrin and not binding with fibrinogen, and a use thereof.SOLUTION: There is disclosed an antibody or an antigen-binding fragment thereof, comprising H strand CDR1, H strand CDR2, H strand CDR3, L strand CDR1, L strand CDR2, L strand CDR3, wherein these CDRs include an amino acid sequence composed of a specific sequence or an amino acid sequence containing one or several conservative amino acid substitutions in the amino acid sequence. The antibody characteristically binds with human fibrin and murine fibrin.
Patent JP-2012001260-A (JP)
Title: Sealing method
Inventor: ONO FUTOSHI
IPC: B42D11/00
Filed: 2010-06-18
Abstract: PROBLEM TO BE SOLVED: To provide a printing, feeding and sealing apparatus of a roll-like sealing tape which has a function as an address or an invoice by printing information on a sealed object on a tape and further has a function as a sealing tape for a corrugated cardboard or the like.SOLUTION: The printing and sealing apparatus 1 includes: a tape 2 wound in a roll shape; a printing apparatus 4 for printing the tape 2; and a sealing apparatus 6 for sealing the corrugated cardboard D with the tape 2, and the upper face of the corrugated cardboard D sent by a conveyer 7 is sealed with the sealing apparatus 6. Information on an address is printed on the tape 2, and the tape 2 serves as an address label.
Patent JP-2012004050-A (JP)
Title: Emergency illumination fixture
Inventor: MATSUZAKI JUN
IPC: F21V29/00
Filed: 2010-06-18
Abstract: PROBLEM TO BE SOLVED: To provide an emergency illumination fixture capable of maintaining heat dissipation characteristics and of achieving downsizing and weight reduction of a device and improvement of an external design.SOLUTION: The emergency illumination fixture includes: LEDs 1a; an LED substrate 2 on which the LEDs 1a are mounted; a chargeable emergency power supply 3; a charging part 4 to charge the emergency power supply 3 by power supply from a commercial power supply AC; a lighting part 5 to light on the LEDs 1a with the emergency power supply 3 as an input in the case of blackout of the commercial power supply AC; a power supply substrate 6 on which the charging part 4 and the lighting part 5 are mounted; a thermal bonding member to mutually thermal-bond the LED substrate 2 and the power supply substrate 6; and a fixture body 8 of which the lower face is opened, and which houses the LED substrate 2, the power supply substrate 6, and the emergency power supply 3 inside. The LED substrate 2 is installed so as to cover an opening of the fixture body 8, the charging part 4 is positioned upward against the LED substrate 2, and the lighting part 5 and the emergency power supply 3 are positioned upward against the charging part 4.
Patent JP-2012007984-A (JP)
Title: Manufacturing method of sensor chip with built-in piezo-resistive element and the sensor chip
Inventor: MASUMOTO NAOMI
IPC: G01L5/16
Filed: 2010-06-24
Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a sensor chip with a built-in piezo-resistive element, which allows easy and low-cost manufacturing and promotes downsizing and thinning.SOLUTION: On an interposer 1, an IC2 is connected to a recess thereof and a plurality of sensor parts 4 having a piezo-resistive element arranged approximately at the center of a top surface is connected at the same time. A transmission body 5 to cause the piezo-resistive element generate compressive or tensile stress and an external force receiving plate 6 having an area greater than a top surface area of the transmission body 5 are arranged for each of the plurality of sensor parts 4. A fixing and buffering resin 7 is then filled between the external force receiving plate 6, sensor part 4, and a collective substrate 1. Finally, a collective substrate body 8 is divided into an individual piece to produce a plurality of sensor chips 10. The resin 7 fixes the external force receiving plate 6 to the sensor part 4 and the collective substrate 1 to integrate the sensor chip 10, and functions as a buffer with its elastic force to absorb and weaken the external force received by the external force receiving plate 6.
Patent JP-2012009594-A (JP)
Title: Semiconductor device
Inventor: BITO YASUNORI
IPC: H01L21/8248
Filed: 2010-06-24
Abstract: PROBLEM TO BE SOLVED: To stably provide a semiconductor device in which a hetero junction bipolar transistor (HBT) and a field-effect transistor (FET) are formed on the same substrate, collector resistance of the HBT is reduced and thereby properties of the HBT is improved, and etching precision of a gate recess of the FET is excellent and thereby on-resistance of the FET is low.SOLUTION: The semiconductor device comprises an HBT 101A and FETs 101B, 101C. The HBT 101A includes a multilayer sub-collector layer provided with a plurality of laminated semiconductor layers 14-16 and a collector electrode 28 formed on an overhang of a collector layer 17 in the sub-collector layer. In the FET 101B, FET 101C, at least one semiconductor layer 14 on the semiconductor substrate 1 side among the plurality of semiconductor layers forming the sub-collector layer of the HBT 101A also serves as at least a partial cap layer. Total film thickness of the HBT sub-collector layer is 500 nm or more, and total film thickness of the FET cap layer is 50 nm or more and 300 nm or less.
Patent JP-2012015169-A (JP)
Title: R-t-b-based rare earth permanent magnet, motor, automobile, power generator and wind force power generator
Inventor: NAKAJIMA KENICHIRO
IPC: H01F1/08
Filed: 2010-06-29
Abstract: PROBLEM TO BE SOLVED: To provide an R-T-B-based rare earth permanent magnet capable of attaining high coercive force (Hcj) without increasing a Dy concentration in R-T-B-based alloy, and capable of suppressing deterioration of a magnetization intensity (Br) caused by addition of Dy and attaining excellent magnetic properties.SOLUTION: An R-T-B-based rare earth permanent magnet consists of a sinter body including a main phase mainly containing RFeB and a grain boundary phase containing more R than the main phase, where R denotes rare earth elements including Nd as an essential element. The sinter body includes Ga as an essential element. The grain boundary phase includes a first grain boundary phase, a second grain boundary phase and a third grain boundary phase which are different from one another in total atom concentration of the rare earth elements. The third grain boundary phase is lower than the first grain boundary phase and the second grain boundary phase in total atom concentration of the rare earth elements, and higher than the first grain boundary phase and the second grain boundary phase in atom concentration of Fe.
Patent JP-2011014228-A (JP)
Title: Ultimate magnetic random access memory-based ternary cam
Inventor: JAVERLIAC VIRGILE
IPC: G11C15/02
Filed: 2010-07-01
Abstract: PROBLEM TO BE SOLVED: To provide an ultimate magnetic random access memory-based ternary CAM.SOLUTION: A magnetic random access memory-based ternary content addressable memory cell includes: first and second magnetic tunnel junctions respectively connected to first and second straps extending on each side of the first and second magnetic tunnel junctions; first and second selection transistors respectively connected to one end of the first and second straps; first and second current lines; and a conductive line electrically connecting in series the first and second magnetic tunnel junctions at their ends opposite the ones connecting the first and second straps. The cell has a smaller size and advantageously usable in memory devices having a high cell density array.
Patent JP-2012014033-A (JP)
Title: Electronic keyboard instrument and program
Inventor: MIWA AKIHIRO
IPC: G10H1/00
Filed: 2010-07-02
Abstract: PROBLEM TO BE SOLVED: To enable a parameter value to be specified with a high resolution exceeding the number of white keys in an electronic keyboard instrument in which parameter values are specified according to operation of white keys by making various parameter values correspond to the white keys.SOLUTION: By pressing a white key 50-k, a corresponding parameter value (an address corresponding to an auxiliary line 64 of waveform data 70) is specified. By pressing an adjacent white key 50-(k-1) or 50-(k+1) while pressing the white key 50-k, a specified parameter value (address) is increased or decreased at a unit of a prescribed coarse movement amount Mc.
Patent JP-2012019253-A (JP)
Title: Analog signal buffer and image reading device
Inventor: KONNO YOSHIO
IPC: H04N1/028
Filed: 2010-07-06
Abstract: PROBLEM TO BE SOLVED: To provide an analog signal buffer which blocks overcurrent to an AFE and reverse current to a CCD, and to provide an image reading device provided with the analog signal buffer.SOLUTION: The provided analog signal buffer is connected between a photoelectric conversion element for conversion to an analog signal and an analog signal processing circuit for converting the analog signal to a digital signal, and is equipped with circuit means for blocking the reverse current from being induced within the analog signal buffer when the output power from the photoelectric conversion element is lowered.
Patent JP-2011192954-A (JP)
Title: Semiconductor wafer and method of manufacturing semiconductor device
Inventor: ITO HIRONORI
IPC: H01L21/301
Filed: 2010-07-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor wafer and a method of manufacturing a semiconductor device, which suppress a damage to a blade for dividing a semiconductor wafer having a compound semiconductor layer into a plurality of chips, and also susrpress a decrease in yield during division of the semiconductor wafer.  <P>SOLUTION: The method of manufacturing the semiconductor device includes the steps of: preparing the semiconductor wafer 1 including a silicon substrate and a laminate having the compound semiconductor layer having a higher hardness than the silicon substrate; etching the laminate until the silicon substrate is exposed to form trench regions 21 in a grid, each trench region including a plurality of stripe grooves extending in parallel to each other; filling the groove with a material having a lower hardness than the compound semiconductor layer; forming the semiconductor device 22 in an element arrangement region surrounded with the trench regions 21; and dividing the semiconductor wafer 1 into the plurality of chips in units of semiconductor devices 22 by dicing using a blade at a dicing line 300 which is defined within the trench region 21.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010220266-A (JP)
Title: Antenna device
Inventor: SHIBATA OSAMU
IPC: H01Q21/08
Filed: 2010-07-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide an antenna device which can be miniaturized while ensuring a sufficient gain to a front direction.  <P>SOLUTION: An antenna device includes patch antenna elements 1A, 1B arrayed parallel at an element interval D. Each patch antenna element 1A (1B) is an element formed by providing electrodes 3A, 4A (3B, 4B) on front surface 2Aa (2Ba) and back surface 2Ab (2Bb) which face each other of a dielectric substrate 2A (2B), respectively. The patch antenna element 1A is then used as a feeding element and the patch antenna element 1B is used as a parasitic element. Thus, a phase or an amplitude of a radio wave from a side of the patch antenna element 1B is adjusted by a reactance circuit 5 and the element interval D is appropriately set, so that a gain to a front direction of the patch antenna element 1A is increased and a radio wave in a back direction is suppressed, thereby improving an F/B ratio.  <P>COPYRIGHT: (C)2010,JPO&INPIT