baber/WOPTO huggingface dataset:
Patent JP-H0917980-A (JP)
Title: Word line structure of semiconductor memory
Inventor: YANA TAKAKO
IPC: H01L21/8242
Filed: 1996-07-01
Abstract: PROBLEM TO BE SOLVED: To introduce an earth voltage strapping line, a word line tapping, and a diode in the reverse direction of a word line without increasing the chip area, by constituting the pair of first and second word lines, and arranging reverse diodes and well bias tappings alternately. SOLUTION: A diode in the reverse direction of the first word line (FIRST WORD LINE) is arranged at the left, and a diode in the reverse direction of the second word line (SECOND WORD LINE) is arranged at the right. Moreover, a well bias tapping is provided, making use of a p-type active region (ACTIVE REGION), in the earth voltage strapping line at the right of the first word line. Thereupon, a well bias tapping is provided in the earth voltage strapping line at the left of the second word line. Hereby, the earth voltage strapping line, etc., can be introduced without increasing chip area.
Patent JP-H05264828-A (JP)
Title: Low-refractive index optical fiber
IPC: G01D5/26
Filed: 1992-06-29
Abstract: PURPOSE: To obtain an optical fiber having a cladding layer of a low refractive index to be used for an evanescent type sensor, etc. CONSTITUTION: This optical fiber is composed of a central fiber core 20 having a first refractive index and a fiber cladding layer 30 having a second refractive index smaller than the first refractive index. The cladding layer 30 is composed of plural tubular structural bodies 40 and the refractive index of the cladding layer 30 is lowered by air existing in the tubes of the tubular structural bodies 40 and the parts between the tubes. Even if bar-shaped bodies are used in place of the tubes, the refractive index may be lowered by air therebetween.
Patent JP-S6231204-A (JP)
Title: Glass antenna
Inventor: TORIYAMA HARUHIKO
IPC: H01P5/10
Filed: 1985-08-02
Abstract: PURPOSE:To obtain characteristics similar to that of a rod antenna without forming projections by forming a pair of dipole antenna elements, the 2nd shielding lead wire holding a center lead wire between the lead wire itself and the 1st shielding lead wire and balance/unbalance converting elements branched on the way of both the shielding lead wires on the surface of glass as a pattern. CONSTITUTION:The whole dipole antenna pattern 12 is formed on the surface of the glass 10 by vapor deposition or the like. An antenna part 16 is vertically formed. A leading part 22 consists of a parallel lead wire 24 connected to the antenna elements 18, 20 and the shielding lead wire 26. The lead wire 24 is connected to the center line 28 of a coaxial feeder 14 and the lead wire 26 is connected the shielding wire 30 of the feeder 14. The shielding lead wire 32 is formed so as to hold the lead wire 24 and the lead wore is connected to the shielding wire 30. The lead wires 32, 24, 26 have a structure planing the coaxial feeder 14. The balance/unbalance conversion elements 34, 36 are upwards/downwards branched on the way of the lead wire 32 and arranged in parallel with the lead wires 32, 26. In said constitution, no projection can be attained and utility as the transmitting/receiving antenna can be attained by properly fixing the length l1 of the antenna part 16, the length l2 of the elements 34, 36 and the values of shown length l3-l5 respectively.
Patent JP-H1117085-A (JP)
Title: Cooling device for electronic part
Inventor: ISHIHARA SATOSHI
IPC: H01L23/427
Filed: 1997-06-27
Abstract: PROBLEM TO BE SOLVED: To provide a cooling device for such an electronic part as an insulated gate bipolar transistor(IGBT) module requiring forced cooling for its large heat generation amount, which can efficiently the electronic part with a good heat exchange. SOLUTION: One end open end 33a of a cold plate 33 of pipes with a multitude of holes having an electronic part mounted on its outer surface is sealed, the other open end 33b thereof is open to an lower part of an elongated cylinder member 25, and a radiating plate 37 of pipes with a multitude of holes arranged in zigzag is disposed on a side of the cylinder member 25 opposed to the projection direction of the cold plate 33. Both ends 37b and 37b of the radiating plate 37 are open to an upper part of the cylinder member 25, the plate 37 and cylinder 25 are accommodated within casings 21 and 23 of rectangular sectional shapes whose upper and lower ends are closed, and the cold plate 33 is projected from a side wall of the casing 23.
Patent JP-S5875220-A (JP)
Title: Temperature controller
Inventor: MIYAZAKI YOSHIROU
IPC: G05D23/12
Filed: 1981-10-28
Abstract: PURPOSE:To improve the heat conduction between a substrate and a contact plate, by forming a thin and wide liquid film which has no change due to the expansion of a container at a place between the substrate and the contact plate. CONSTITUTION:When the heating value of a device 1 increases, a working fluid 10 within a container 7 is heated. As a result, the pressure increases within the container 7, and therefore a bellows 8 forming the container 7 expands. Then a contact plate 9' has a contact with a heat sink 6 by the expansion of the bellows 8 when the pressure within the container 7 increases up to a certain level. Thus the heat transmitted to a substrate 2' from the device 1 is transmitted to a projected part 16 of the plate 9' put into the grooves 17 and 18 from a projected part 15 through a liquid film formed in a gap 19 of the fluid 10 within the grooves 17 and 18. The heat heats up the plate 9' and is discharged to outside through the heat sink 6 that has a contact with the plate 9'.
Patent JP-S6231133-A (JP)
Title: Semiconductor device
Inventor: YAKIDA HIDEKI
IPC: H01L23/64
Filed: 1985-08-02
Abstract: PURPOSE:To remove parasitic inductance by a method wherein the wiring electrode of a semiconductor integrated circuit substrate and wiring electrode formed on the surface of a dielectric are made face each other via an air gap, the wiring electrode is directly connected with a metal bump so as to dispense with the electrode on the back of the substrate. CONSTITUTION:The main surface of a semiconductor integrated circuit substrate 1 and main surface of the wiring and electrode formed on the surface of a dielectric 10 are mounted facing each other. A transmission line 2 on the substrate 1, transmission lines 11 and 12 for the electrode and dielectric 10, and electrode 13 are directly connected with metal bumps 201-206. Thus, the electrode on the bake side of the substrate 1 is dispensed with, thereby removing parasitic inductance due to the bonding wire.
Patent JP-H0724186-A (JP)
Title: Washing machine
Inventor: OE KATSUMI
IPC: D06F39/12
Filed: 1993-07-12
Abstract: PURPOSE:To simplify the removal of a rear cover for covering a rear part of the upper face plate of the washing machine. CONSTITUTION:A rear cover 10 for covering a rear part 8 of the upper face plate is constituted so that it is installed by slide-engagement, and the removal of the rear cover 10 can be simplified. Also, a valve opening 17 which an inlet part 15 of an electromagnetic water supply valve 14 passes through at the time of installing the rear cover 10 is formed in the rear cover 10, and the valve opening 17 has dimensions allowing a slide. Accordingly, after the rear cover 10 is installed, as for the valve opening 17, the part which is not occupied by the inlet part 15 is generated, it is necessary to cover this part, and a valve opening cover 18 is provided. Also, at the time of screwing and coupling a box nut 22 of a water supply hose 21 to the inlet part 15 in order to install the water supply hose 21 to a water supply valve 14, the valve opening cover 18 is fixed simultaneously. In this case, it is unnecessary to fix specially the valve opening cover 18, thereby simplifying the structure.
Patent JP-H04316636-A (JP)
Title: Glass cloth for printing circuit substrate and printing circuit substrate
Inventor: KATAYAMA YOSHIHIKO
IPC: H05K1/03
Filed: 1991-04-15
Abstract: PURPOSE:To obtain a printing circuit substrate with hardly any dimensional change and glass fiber woven fabrics for the printing circuit substrate. CONSTITUTION:Glass fiber woven fabrics are prepared by using E glass fiber yarns and weaving the yarns so as to provide 105-120% count of the yarns picked into weft yarns based on that of warp yarns and the total weft yarn count per unit length (the number of the weft yarns picked per unit length Xweft yarn count) of 75-100% based on the total warp yarn count (the number of the warp yarns set up per unit length X warp yarn count), e.g. the warp yarns at 75 ECG and 39 yarns/25mm density and the weft yarns at 67 ECG and 33 yarns/25mm density. The resultant glass fiber woven fabrics are dipped in an epoxy resin varnish and dried to afford sheets of prepreg, which are then hot-pressed and laminate molded to provide a printing circuit substrate.
Patent JP-S5872911-A (JP)
Title: Optical fiber connecting method
Inventor: EDAHIRO TAKAO
IPC: G02B6/38
Filed: 1981-10-27
Abstract: PURPOSE:To connect optical fibers with a small loss, by immersing the end part of one optical fiber in a liquid, which etches a dopant containing quartz glass faster than a quartz glass, and immersing the end part of the other optical fiber in a liquid, which etches the dopant containing quartz glass slower than the quartz glass, and butting both end faces. CONSTITUTION:An optical fiber where an SiO2 containing a GeO2 is used for a core 12 and an SiO2 which does not contain a dopant is used for a clad 11 is immersed in an HF liquid and is etched to obtain an end face 14 where the core 12 is recessed. Meanwhile, a liquid where the HF liquid is added to NH4F is used as the etching liquid to an end face 13 where the core 12 projects. Both optical fiber end faces 13 and 14 are butted. Thus, it is unnecessary to connect them while monitoring the intensity of light, and optical fibers are connected with a small loss.
Patent JP-H10573-A (JP)
Title: Bulb attaching/detaching device
Inventor: IWATA KATSUMI
IPC: B25B27/14
Filed: 1996-06-10
Abstract: PROBLEM TO BE SOLVED: To prevent broken pieces of a bulb from being scattered in the surroundings even in the case of breaking the bulb in its replacement by providing a protection cover which covers the bottom opening part of a lamp shade and protects a bulb. SOLUTION: Before attaching/detaching a mercury lamp 44, the mercury lamp 44 is covered with a protection cover 2 in a space between a lamp shade 41 and the protection cover so the attaching/detaching operation can be executed in such state that the protection cover 2 is held to be locked with the lamp shade 41 by a lock member 22. If the mercury lamp 44 is broken in the attaching/detaching operation, this constitution can eliminate any possibility of the broken pieces of glass from being fallen in the outside, eliminate any anxiety of being injured, and provide extremely high safety. The attaching/ detaching operation of the mercury lamp 44 can be executed with the lamp shade 41 locked with the protection cover 2 so that the attaching/detaching operation can be easily performed.
Patent JP-H0338507-A (JP)
Title: Production of powder for cosmetic covered with collagen
Inventor: MIYATA TERUO
IPC: A61K8/96
Filed: 1989-07-05
Abstract: PURPOSE:To obtain excellent powder for cosmetic having excellent dispersibility with a slight irritation by covering the surface of powder for cosmetic with collagen with suspending the powder for cosmetic in a solution of collagen, drying and subjecting to heat treatment to make the collagen insoluble. CONSTITUTION:Powder of water-soluble collagen (e.g. atherocollagen) and/or collagen derivative is dissolved so as to be 0.01-10wt.% concentration and 1-50wt.% pigment (e.g. TiO2, talc or nylon powder) is added, then mixed with stirring, thus covered powder is received and dried, then subjected to heat treatment at 60-150 deg.C to make the collagen insoluble, thus uniform particles are obtained by pulverizer. Resultant covered pigment gives cosmetic having excellent adhering property to skin, extensibility and durability of make-up, etc., without separation of collagen as covering agent even in mixing to water-based cosmetic.
Patent JP-H0926176-A (JP)
Title: Treating system and device-production method using the same
Inventor: HASEGAWA TAKAYUKI
IPC: F24F7/06
Filed: 1995-07-07
Abstract: PROBLEM TO BE SOLVED: To curtail equipment costs and a running cost by monitoring the operating condition of treating devices to adjust the condition of a clean room locally according to the results of the monitoring. SOLUTION: Particle detectors 9a-9c measure the cleanness of a clean room 2 by counting foreign particles such as dirt or dust in air. A main controller monitors the operating condition of an exposer 3, a coater developer 4, measured vales of the particle detectors 9a-9c and the like to control the ventilation capacities of fan filter units 7a-7e, cooling capacities of cooling coils 8a-8e and the operation sequence of treating devices (e.g. thermal treatment devices, sputtering devices, CVD devices, epitaxial devices, diffusers, annealing devices and inspecting instruments). This enables managing of the condition of a necessary location at a necessary timing extensively at a high level.
Patent JP-S5963098-A (JP)
Title: Semiconductor storage device
Inventor: YONEMURA HIROICHI
IPC: G11C29/42
Filed: 1982-09-30
Abstract: PURPOSE:To make it unnecessary to provide an external circuit, by providing parity bit generating and checking circuits in one chip of a memory. CONSTITUTION:Input data DI1-DIN applied to input data buffers DIB1-DIBN are written in designated addresses of memory cell arrays MCA1-MCAN after level conversion and are sent to a parity generating circuit PG, and a parity bit PA is generated on the basis of logics of respective bits. The parity bit PA is written in the same designated addresses of memory cell arrays MCA1-MCAN through a write amplifier WAP. In case of data read, output data DO1-DON and the parity bit PA of designated addresses are read out from respective memory cell arrays, and output data DO1-DON are sent to a parity checking circuit PC, and the parity bit PA is sent to the parity check circuit PC also. The parity checking circuit PC generates a parity bit PA' on a basis of logics of respective bits of output data DO1-DON and detects whether this parity bit PA' coincides with the parity bit PA or not. If they do not coincide with each other, an error signal ES is outputted to the outside of the chip.
Patent JP-H1019314-A (JP)
Title: Apparatus and method for measuring heat storage material packing factor, and apparatus and method for controlling heat storage material packing factor
Inventor: CHO NOBUAKI
IPC: F24F5/00
Filed: 1996-07-02
Abstract: PROBLEM TO BE SOLVED: To measure an accurate packing factor of a heat storage material with a simplified structure without interrupting conveyance of a mixed fluid even to a large capacity heat conveyance system by providing means for calculating the heat storage material packing factor in the mixed fluid from a measured value by weigh measurement means. SOLUTION: An apparatus is connected with an existing piping 12 through flexible joints 13, 13 of a measuring piping 11, and an end of the existing piping 12 in contact with the flexible joints 13, 13 are supported on support points 14, 14. An IPF measuring piping 11 in itself is supported with first and second weight meters 15a, 15b disposed at opposite ends of the IPF measuring piping 11 below the same for measurement of weights thereof. Hereby, even in a large capacity heat conveyance system a heat storage material is accurately measured with a simplified structure without interrupting conveyance of a mixed fluid.
Patent JP-H0522924-A (JP)
Title: Plane motor apparatus
Inventor: KOBARIKAWA YASUSHI
IPC: H02K41/02
Filed: 1991-07-12
Abstract: PURPOSE:To provide a plane motor apparatus being small-sized and suitable for realizing ultraprecise accuracy in a plane motor, which can drive an object- mounting stage member with high accuracy in a comparatively wide plane. CONSTITUTION:A plane motor apparatus for moving a stage member 3, which is used for mounting an object, in a predetermined plane relatively to a supporting member 1 being a reference has a combination of a plurality of permanent magnets 6, 7, 8 at attached to one of the stage member and supporting member and generating magnetic flux in the direction almost perpendicular to the predetermined plane with a yoke 5 combining these permanent magnets and also has a plurality of sets of coils 9, 10, 11 attached to the other of the stage member and supporting member and arranged in the manner of engaging with the magnetic flux, each of the plurality of sets of coils has a plurality of coils arranged in the direction perpendicularly intersecting to the direction of working of a force, when a current flows through the coils, and combinations in respective sets of coils include the coils, and body of permanent magnets arranged in the manner of facing the plurality of coils.
Patent JP-S6152907-A (JP)
Title: Method and apparatus for cold rolling of metallic strip having high degree of surface luster and shape
Inventor: SUZUKI MAKOTO
IPC: B21B1/28
Filed: 1984-08-21
Abstract: PURPOSE:To improve efficiency of production by arranging the first and second reversing mills of large diameter work rolls and small diameter work rolls in series and providing take-up reels in front side of the first rolling mill and rear side of the second rolling mill. CONSTITUTION:The first reversing mill 1 provided with large diameter work rolls 13 and the second reversing mill 2 provided with small diameter work rolls 14 are provided in series. A pay-off reel 3 is provided in front side of the rolling mill 1 and at the same time, a tension reel 4 is placed back side of the rolling mill 2 and reversing rolling is performed. After making high speed rolling to an intermediate pass by the first rolling mill 1, the tandem rolling is made by rolling mills 1, 2. Finally, the low speed rolling is made by the rolling mill 2 of small diameter rolls 14 circulating low viscosity oil. By this way, the strips having high surface luster and good form are produced at high efficiency.
Patent JP-H1022671-A (JP)
Title: Shielding mechanism for circuit board
Inventor: INUBUSHI TOSHIYA
IPC: H05K9/00
Filed: 1996-07-02
Abstract: PROBLEM TO BE SOLVED: To provide a shielding mechanism for circuit board which has easily handled shielding maternal that are installed in a space between an earth pattern on the circuit board and a wall of a shielding case. SOLUTION: In a space between an earth pattern formed on a board 16 and a wall of a shielding case 13a, 13b, deformable conductive small projections 21 are installed. When the conductive small projections 21 deform, the conduction between the earth pattern and the shielding case can be surely established. Unlike conductive rubber and a springy metallic piece, this shielding material can be handled easily when assembling the board in the shielding case.
Patent JP-H093499-A (JP)
Title: Production of colored particle-containing detergent having high bulk density
Inventor: ABE SEIJI
IPC: C11D3/40
Filed: 1995-06-14
Abstract: PURPOSE: To obtain a high bulk density detergent containing colored particles having beautiful appearance, excellent in fluidity, having safety such as prevention of drinking by mistake, providing a standard of blend of an enzyme, a beaching agent, etc., by visual observation by an extremely simple method. CONSTITUTION: Detergent particles having >=0.5g/cc bulk density on a belt conveyor are partially colored by using 0.0001-1wt.% of a coloring matter to produce the objective colored particle-containing detergent having high bulk density.
Patent JP-H0835877-A (JP)
Title: Weighing device for conveyor
Inventor: TORII TOMOHIRO
IPC: G01G11/00
Filed: 1994-07-25
Abstract: PURPOSE:To provide a weighing device for a conveyor capable of accurately measuring the amount of objects transported on a rollerless conveyor with a simple structure. CONSTITUTION:An inner gutter 10a is supported at three points so as to be hung down with three support rods 14 from an outer gutter 20. On the outer gutter 20, three fixing staages 23 are formed correspondingly to the positions of the support rods 14. On each fixing stage 23, a load cell 24 of disk shape having a through hole in the center is placed and fixed with a nut 25 screwed on the support rod 14. Therefore the load on the inner gutter 10 is shared by the three support rods 14 and is individually measured with each load cell 24.
Patent JP-S5696567-A (JP)
Title: Telephone system of call tone identification on charging time band
Inventor: ITAKURA TERUO
IPC: H04M3/42
Filed: 1979-12-28
Abstract: PURPOSE:To reject the confusion to charging rate of subscribers and to enable the identification of time band, by changing the call tone depending on the charging rate time band. CONSTITUTION:When a telephone set 1 is connected to an outgoing register 2 with off-hook, a call tone is fed to a telephone set 1. In this case, a call tone generating circuit 3 produces 4 types of tones, and one of them is selected 5 based on the time band information from a charging pulse generating circuit 4 and fed to a register 2. Further, after confirming the call tone, dialing makes the telephone set 1 to be connected to the trunk 6 where the charging pulse with charging rate in matching with the said time band is fed.
Patent JP-S5797273-A (JP)
Title: Longitudinal line pin cushion compensation circuit
Inventor: TSUDA HIDETOSHI
IPC: H04N3/22
Filed: 1980-12-08
Abstract: PURPOSE:To prevent screen change accompanied with audio change, by superimposing a current which changes in synchronizing with the audio signal level change on a vertical winding of a longitudinal pin cushion compensation transformer. CONSTITUTION:In a longitudinal pin cushion compensating line of a block C, a transistor circuit Q4 11 , R2-R6, C7 are added as a variable impedance element in parallel with a bias resistor R1, and the bias current of a longitudinal line pin cushion correcting transformer T1 is changed in synchronizing with the load change of an audio output circuit E. The bias current of said T1 is the sum of collector current of a transistor Q4, and a current flowing to the resistor R2.
Patent JP-H0222839-A (JP)
Title: Manufacture of dielectric-separating substrate
Inventor: MIYAJIMA MOTOMORI
IPC: H01L21/762
Filed: 1988-07-12
Abstract: PURPOSE:To obtain a dielectric-separating substrate whose cost is low and whose bonding strength is high without depositing thick polysilicon used to fill a separating groove or without executing a flattening treatment by a method wherein the separating groove of a desired pattern is formed in a semiconductor substrate. CONSTITUTION:A film to be used as an etching mask is formed on a semiconductor substrate 1; after that, this mask material is etched to be a desired pattern. After that, separating grooves V are formed by using a KOH solution or the like. Then, the mask material is removed; a buried diffusion layer 2 and a thermal oxide film 3 are formed one after another. Polysilicon 4 is deposited by using a CVD method; a thermal oxide film 5 is formed on the surface. Then, the thermal oxide film 5 formed in protruding parts is removed; the polysilicon 4 is etched by making use of the thermal oxide film 5 left in recessed parts as a mask; a support substrate 6 and the semiconductor substrate 1 are bonded. Then, after this bonding operation has been completed, a bonded face of the semiconductor substrate 1 is polished from the reverse side; the substrate is made thin until the pattern is exposed; a dielectric-separating substrate can be obtained.