baber/WOPTO huggingface dataset:
Patent JP-2012256767-A (JP)
Title: Forced-air cooling semiconductor cooling device
Inventor: RI KYOTA
IPC: H01L23/467
Filed: 2011-06-10
Abstract: PROBLEM TO BE SOLVED: To provide a forced-air cooling semiconductor cooling device capable of downsizing and weight-saving an electric power conversion apparatus by enhancing cooling performance and downsizing the cooling device.SOLUTION: Semiconductor elements 3,4,5 having same calorific power are mounted on coolers 7,8,9, each coolers are arranged at intervals so as not to mutually exchange heat, and they are housed in a same air channel. Base plates of each coolers are configured that thickness thereof gets sequentially thicker from the cooler at an air intake side toward the cooler at an exhaust side, parts except the thickness of the base plate are the same. Temperature gradient of the coolers can be reduced by individually mounting the semiconductor elements on the coolers, to sufficiently utilize heat treatment capacities of the coolers. A temperature of the semiconductor element is uniformly controlled by adjusting the thicknesses of the base plates of the coolers based on rise of temperature of cooling air, to improve the margin of the temperature in the maximum use temperature condition of the semiconductor element and to downsize and weight-save a semiconductor cooling device.
Patent JP-2012256573-A (JP)
Title: Connector connection structure
Inventor: ASADA JUN
IPC: H01R13/621
Filed: 2011-06-10
Abstract: PROBLEM TO BE SOLVED: To provide a connector connection structure in which the burden of the connection work is reduced.SOLUTION: The connection structure of a connector includes a cylindrical section 50 in which a second terminal 70 is disposed inside and which can receive a first terminal 36, and a cable connection 51 formed on the peripheral surface of the cylindrical section 50 and connected with a cable. A guide receiving part which can receive a guide and is supported by the guide is formed in the cable connection 51.
Patent JP-2013000256-A (JP)
Title: Pinball game machine
Inventor: TANAKA HIDEJI
IPC: A63F7/02
Filed: 2011-06-15
Abstract: PROBLEM TO BE SOLVED: To provide a pinball game machine increasing or decreasing a shooting force of a game ball by a front-rear directional operation of a player.SOLUTION: This pinball game machine includes: a base body 3; a cover 4 supported to the base body 3 movably in the cross direction and pressedly operated from the front by the player; a cover spring 6 for biasing the cover 4 forward; a transmission gear body 8 that is supported to the base body 3 to rotate about a main rotation axis C1 in a direction of increasing the shooting force and in a direction of decreasing the shooting force, and that has a circular transmission gear part 83; an adjustment gear body 9 that is supported to the base body 3 rotatably about an adjustment rotation axis C2, has an adjusting gear part 92 to be engaged with the transmission gear part 83, and transmits the rotation of the transmission gear body 8 to a volume 2; and an operation transmission mechanism 12 that is provided between the transmission gear body 8 and the cover 4, in conjunction with the movement towards the rear of the cover 4, rotates the transmission gear body 8 in the direction of increasing the shooting force, and, in conjunction with the movement towards the front of the cover 4, rotates the transmission gear body 8 in the direction of decreasing the shooting force.
Patent JP-2013004671-A (JP)
Title: Coil element and micro transformer
Inventor: KATO FUMIHITO
IPC: H01F17/00
Filed: 2011-06-15
Abstract: PROBLEM TO BE SOLVED: To provide a coil element which is minute and has high accuracy.SOLUTION: A coil element 1a at the primary side and a coil element 1b at a secondary side comprise a board 100, core portions 20a, 20b formed of triangular-prism semiconductors, insulating films 30a, 30b covering at least side surfaces of the core portions 20a, 20b, and conductive patterns 40a, 40b provided so as to spirally go around the side surfaces of the core portions 20a, 20b through the insulating films 30a, 30b. Both the ends of the conductive pattern 40a of the coil element 1a are drawn out on the upper surface of the board 100, and serve as electrodes 50a, 50c. Likewise, both the ends of the conductive pattern 40b are drawn out on the upper surface of the board 100 and serve as electrodes 50b, 50d. Accordingly, there can be constructed a micro transformer in which an AC signal input to the electrodes 50a, 50c is subjected to voltage transformation in accordance with the number of coil turns of the coil elements 1a, 1b, and output from the electrodes 50b, 50d.
Patent JP-2013000382-A (JP)
Title: Slot machine
Inventor: ASAI TAKAMITSU
IPC: A63F5/04
Filed: 2011-06-17
Abstract: PROBLEM TO BE SOLVED: To obtain a slot machine for setting a chance for granting privilege to a player corresponding to acquisition of a winning combination determination result corresponding to special winning combination determination in a carry-over game period of special winning combination determination information.SOLUTION: A specific winning combination is set, where the specific winning combination is overlappingly determined in a non-carry-over game period when the special winning combination determination information is not carried over, and is determined with the same probability as a probability determined overlappingly with the special winning combination in the non-carry-over game period in the carry-over game period when the special winning combination determination information is carried over. Information for indicating whether a period is the carry-over game period and specific winning combination determination information for indicating that the specific winning combination is determined are transmitted from a main control means side to a sub-control means side. In privilege grant determination means of the sub-control means, privilege grant to the player is determined with reception of the special winning combination determination information during the carry-over game period as an opportunity.
Patent JP-2013001518-A (JP)
Title: Post-processing device and image forming system
Inventor: KIKUCHI TOMONORI
IPC: B65H31/34
Filed: 2011-06-17
Abstract: PROBLEM TO BE SOLVED: To improve the alignment accuracy of paper sheets by controlling defective alignment caused by the presence of a tab while satisfying a request for executing the alignment operation of paper sheet ends which aims at the predetermined ridge corresponding to the tab side.SOLUTION: A fore end alignment part (a first alignment part) is capable of selecting the abutting position on fore ends of paper sheets along the paper sheet width direction CD. In this case, a post-processing control unit selects a non-tab area in an area constituted of paper sheet ridges on the fore end side of the paper sheets P stacked in an intermediate stacker 40 based on the information on the tab position, and performs the selection and alignment control for executing the paper sheet alignment operation by the fore end alignment part which aims at the selected non-tab area.
Patent JP-2013000999-A (JP)
Title: Method for manufacturing hot-pressed molding
Inventor: OKADA TAKAYASU
IPC: B29C43/18
Filed: 2011-06-17
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing hot-pressed molding, by which a prepreg is easy to handle when the prepreg is set in a hot press die, and the prepreg hardly cause wrinkle, and the prepreg has excellent shape followup ability in hot pressing.SOLUTION: The hot pressed molding is obtained by: forming a prepreg in a semi-cured state by carrying out an impregnation process of impregnating a porous base material made of a foam or fiber having a continuous air bubble structure with a bifunctional to trifunctional isocyanate compound and a heating process of blowing superheated steam of 170°C or higher to the base material after the impregnation with the bifunctional to trifunctional isocyanate compound and heating the bifunctional to trifunctional isocyanate compound in the base material; arranging a skin material on one surface or both surfaces of the prepreg and setting the prepreg in the hot press die and carrying out hot pressing.
Patent JP-2013005629-A (JP)
Title: Electrical connection box
Inventor: ITO KATSUYA
IPC: B60R16/02
Filed: 2011-06-17
Abstract: PROBLEM TO BE SOLVED: To suppress breakage of a case 11 of an electrical connection box and degradation of waterproof property of the case 11.SOLUTION: A case 11 comprises: a notch part formed by notching the case 11 downward from an upper edge; and a corner-cut part 20 formed by cutting away a boundary portion between the upper edge of the case 11 and a side edge of the case 11 forming the notch part. A closing cover 23 for closing the notch part is mounted to the case 11, and a closing part 28 which comes into contact with the corner-cut part 20 is formed at a position corresponding to the corner-cut part 20 in a state where the notch part is covered by the closing cover 23. A packing 33 is disposed between the case 11 and the cover 13 which is in close contact with both the case 11 and the cover 13, and the packing 33 is in close contact with a mating face between the closing part 28 and the case 11.
Patent JP-2013001057-A (JP)
Title: Liquid ejecting device
Inventor: KATSURAGI KOJI
IPC: C09D11/00
Filed: 2011-06-21
Abstract: PROBLEM TO BE SOLVED: To provide a liquid ejecting device capable of forming a curl-free image on any printed matter, irrespective of an image area.SOLUTION: There is provided the liquid ejecting device that has oil-based recording ink which has at least a colorant dispersed in carboxyl group-containing resin or microcapsuled with carboxyl group-containing resin, and contains an oil component and water-based recording ink which has at least a colorant dispersed in carboxyl group-containing resin or microcapsuled with carboxyl group-containing resin, and contains surfactant and foam suppressor in the same device, and selects and ejects one of the oil-based recording ink and water-based recording ink according to image area, the liquid ejecting device ejecting the oil-based recording ink when the image area is 30% or larger of the total area of a recording medium or the water-based recording ink when the image area is less than 30%.
Patent JP-2012013696-A (JP)
Title: Filming device and filming method
Inventor: IM YU-HEON
IPC: G01B9/04
Filed: 2011-06-24
Abstract: PROBLEM TO BE SOLVED: To provide a filming device and a filming method obtaining a three-dimensional outline video having color information and also obtaining a planar clear video having the color information and deeper depth on the premises that filming action is not increased.SOLUTION: The filming device scanning a measured object includes: a light source; a first spectroscope; a microscopic objective lens set; a second spectroscope; a monochrome video sensing device, and a video sensing device. In this case: the light source is for emitting an irradiation optical beam; the first spectroscope is for reflecting the irradiation optical beam; the microscopic objective lens set is arranged above the measured object and includes a reflection reference surface; the second spectroscope is arranged above the first spectroscope, divides the machining optical beam into a first sub-optical beam and a second sub-optical beam; the monochrome video sensing device is arranged in a proceeding passage of the first sub-optical beam; and the video sensing device is arranged in the proceeding passage of the second sub-optical beam.
Patent JP-2012023036-A (JP)
Title: Gic mirror and source-collector module having tin vapor lpp target system
Inventor: LEVESQUE RICHARD
IPC: H05G2/00
Filed: 2011-06-24
Abstract: PROBLEM TO BE SOLVED: To provide a source-collector module for generating laser-produced plasma radiating EUV.SOLUTION: A source-collector module (SOCOMO) 100 for generating laser-produced plasma (LPP) radiating EUV includes a grazing-incidence collector (GIC) mirror MG having an incident end 3 and an emission end 5 and disposed in relation to an LPP 24. The LPP 24 is formed using an LPP target system including a light source part and a target part. A pulse laser beam from the light source part irradiates vapor Sn from a Sn vapor source of the target part. The GIC mirror MG is disposed in relation to the LPP 24, receives the EUV at the incident end 3, and focuses the received EUV on an intermediate focus IF adjacent to the emission end 5. For increasing an amount of the EUV supplied to the intermediate focus IF, a radiation collection enhancement device may be used. Moreover, an EUV lithography system employing the SOCOMO is also disclosed.
Patent JP-2013010410-A (JP)
Title: Front vehicle body structure
Inventor: MATSUOKA SEIHIKO
IPC: B62D25/02
Filed: 2011-06-29
Abstract: PROBLEM TO BE SOLVED: To provide a front vehicle body structure, which can reduce the number of components and prevent intrusion of water.SOLUTION: The front vehicle body structure 10 includes a left side extension 21 for closing a left end of a cowl box 15, and a left dashboard side member 22 which is provided in the left side extension. The left side extension is formed in an approximate hook shape from an extension side wall part 82 and an extension upward-bent part 83. In the dashboard side member, a first side horizontal part 91, a side ridge-line part 93 continuously provided ahead of the first side horizontal part 91, and a sidewall part 92 directed downward from a front end of the side ridge-line part 93 are overhung. The side ridge-line part 93 has a first protruded piece 105 which is protruded upward at an inner end on the inside in a breadth-of-vehicle direction.
Patent JP-2013010998-A (JP)
Title: Method for manufacturing aluminum alloy blank for press forming, and method for manufacturing aluminum alloy press formed product using the blank
Inventor: YATSUNO MOTONOBU
IPC: B21D19/08
Filed: 2011-06-30
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing an aluminum alloy blank for press forming having formability, high surface quality, and high hem bendability, for improving the age hardenability by coating/baking and the degree of freedom in design, and also to provide a method for manufacturing a press formed product using the same.SOLUTION: The method for manufacturing an aluminum alloy blank for press forming made of an age-hardened Al-Mg-Si-based aluminum alloy includes a heating process at a heating temperature of 200°C or higher and 300°C or lower, and a subsequent cooling process to a temperature of 100°C or lower, in which there is formed a partial restoration treatment part of an arbitrary region X of a blank region A obtained by projecting an inner region than a punch shoulder part present as a bending part between a punch top part and a vertical wall part of the punch to a plane vertical to a press direction. In the heating process, the temperature rise rate from 100°C to an end-point temperature is set to 5°C/s or more, and a holding time at the end-point temperature is 20 s or less, and in the cooling process, the cooling rate to 100°C or lower is set to 5°C/s or more.
Patent JP-2013010888-A (JP)
Title: Semiconductor substrate detergent composition
Inventor: OTSUKA SATOSHI
IPC: H01L21/304
Filed: 2011-06-30
Abstract: PROBLEM TO BE SOLVED: To provide a prewashing agent composition which can solve a problem with conventional preliminary washing (prewashing) techniques for a compound semiconductor substrate, such as insufficient detergency, and is improved in washing stamina properties in repeated use.SOLUTION: The detergent composition includes hydrocarbon, glycol ether, a non-ionic surfactant, and an ethanol amine having a branched carbon chain. According to this, the prewashing agent composition can be provided which can be suitably used to remove dirt such as wax, abrasive or particles (foreign matter such as grinding dust) adhered to a semiconductor substrate after grinding treatment, particularly, to a substrate called a compound semiconductor such as GaAs, sapphire or SiC.
Patent JP-2013011329-A (JP)
Title: Pipe joint
Inventor: KITAMURA YUSUKE
IPC: F16L37/12
Filed: 2011-06-30
Abstract: PROBLEM TO BE SOLVED: To provide a pipe joint stably maintaining a connection state with a pipe and easily connecting the pipe.SOLUTION: This pipe joint 10 connects a substantially rectangular pipe 20 having an annular groove part 21 for preventing coming-off. The pipe joint 10 comprises: a coming-off prevention member 120 formed in a substantially rectangular shape corresponding to the shape of the pipe 20 and fitted to a groove part 21 of the pipe 20; and a joint body 110 having a socket 111 for inserting the pipe 20 mounted with the coming-off prevention member 120 and an engaged part 112 engaged with the coming-off prevention member 120. The coming-off prevention member 120 includes a mounting part 121 abutting on an outer surface of the groove part 21 and an elastic deformation part 122 protruding and separated from an outer surface of the groove part 21 and elastically deformable in an inner direction. The mounting part 121 and the elastic deformation part 122 are arranged side by side on the same side of the coming-off prevention member 120.
Patent JP-2013016579-A (JP)
Title: Peeling apparatus, peeling system, peeling method, program, and computer storage medium
Inventor: SOMA YASUTAKA
IPC: H01L21/683
Filed: 2011-07-01
Abstract: PROBLEM TO BE SOLVED: To properly and efficiently perform a peeling process of a support substrate and a processed substrate.SOLUTION: A peeling apparatus 12 has: a first holding part 50 holding a processed wafer W through a dicing tape P; a second holding part 51 holding a surface of a dicing frame F at the outer side of the dicing tape P; a third holding part 52 holding a support wafer S; and a moving mechanism 90 holding an outer peripheral part of the third holding part 52 and moving the third holding part 52 in the vertical direction so that the support wafer S held by the third holding part 52 is continuously peeled from the processed wafer W, held by the first holding part 50, from the outer peripheral part side toward the center part thereof.
Patent JP-2013013635-A (JP)
Title: Game machine
Inventor: OGURA TOSHIO
IPC: A63F7/02
Filed: 2011-07-06
Abstract: PROBLEM TO BE SOLVED: To provide a game machine that can prevent a player from continuing disadvantageous play after termination of a specific game state without noticing the termination.SOLUTION: A CPU 120A of a presentation controlling microcomputer 120 announces a left-hand shooting instruction based on reception of a variable display starting command and announces that a game ball should be shot onto a left play area 2A to the player till variable display of ornament symbols is executed three times from the shift to a normal game state after termination of a time reduction state in which a right-hand shooting instruction is announced. If a player-waiting demonstration specifying command which is transmitted when 20 seconds elapse without start of the variable display of special symbols after termination of the time reduction state is received, the left-hand shooting instruction is announced with the demonstration presentation even if the variable display starting command is not received.
Patent JP-2013019549-A (JP)
Title: Cooling device, and electronic apparatus and electric vehicle equipped with the same
Inventor: MIYAKE SHUNJI
IPC: F28D15/06
Filed: 2011-07-07
Abstract: PROBLEM TO BE SOLVED: To provide a cooling device suppressing the deterioration of the cooling performance, which can supply a quantity of working fluid required for cooling, even when heat generated in a semiconductor-switching element in an inverter circuit of an electronic apparatus and an electronic vehicle is increased and the quantity of the working fluid required for cooling is increased.SOLUTION: The cooling device 3 circulates the working fluid 11 to cool it by phase change between a liquid phase and a vapor phase. The device includes a heat receiving part 4, a radiator 5, a radiation path 6, and a return path 7. A backflow valve 16 and a liquid reservoir 17 are provided on the return path 7. A large quantity of the working fluid 11 can be reserved, and thereby the cooling device 3 suppressing the deterioration of the cooling performance can be obtained which can supply the working fluid 11 to the heat receiving part 4, even when heat generated in the semiconductor-switching element 9 is increased and the quantity of the working fluid 11 required for cooling is increased.
Patent JP-2013021118-A (JP)
Title: Wafer transportation container protection case
Inventor: YAMANAKA YASUSHI
IPC: B65D85/86
Filed: 2011-07-11
Abstract: PROBLEM TO BE SOLVED: To provide a wafer transportation container protection case which can be transported without exposing a wafer transportation container to the open air and in and from which the wafer transportation container can be easily stored and taken.SOLUTION: According to an embodiment, there is provided an FOUP protection case 100 as a wafer transportation container protection case which contains a FOUP 400 as a wafer transportation container and is transported by a load-type transportation device. The FOUP protection case 100 comprises: a bottom plate 1 loaded onto a load-type transportation device; a vibration-free member 2 provided on the bottom plate 1; a lower case 4 which is in the shape of a box with an open ceiling, supported by the bottom plate 1 via the vibration-free member 2, and contains the wafer transportation container loaded onto the lower case 4; and an upper case 5 which includes a grip 51 and seals the lower case 4 by being fit into the lower case 4 from above.
Patent JP-2013021163-A (JP)
Title: Die bonder and bonding material supply method of die bonder
Inventor: Fukaya kota
IPC: H01L21/52
Filed: 2011-07-12
Abstract: PROBLEM TO BE SOLVED: To suppress generation of voids and to stably supply a fixed amount of solder at all times by removing an oxide film formed on a surface of linear solder in atmospheric air.SOLUTION: In a method of connecting a semiconductor chip using a die bonder which, in the state of maintaining a sample in an atmosphere cut off from the outside air, supplies a prescribed amount of solder to a prescribed position on the sample, molds the solder supplied to the prescribed position on the sample, and loads the semiconductor chip onto the molded solder, for a bonding material of the die bonder, the prescribed amount of solder is supplied to the prescribed position on the sample by sending out the prescribed amount of linear solder, generating plasma in an atmospheric pressure, treating a surface of the sent-out linear solder with the generated plasma, guiding the linear solder whose surface is treated with the plasma to the prescribed position on the sample without exposing it to the outside air, and supplying it onto the sample.