baber/WOPTO huggingface dataset:
Patent TW-201410626-A (TW)
Title: Bushing assembly comprising a distribution manifold
Inventor: SIMON PHILIPPE
IPC: C03B37/085
Filed: 2013-05-29
Abstract: The present invention concerns a bushing assembly comprising: (a) a liquid glass feeding unit arranged upstream of, and in fluid communication with, (b) a first and second tip plate assemblies (1A, 1B) extending along a longitudinal direction, arranged side by side, and each surrounded by side walls and end walls and, the first and second tip plate assemblies being separated from one another by a stiffening rib structure (21) extending along said longitudinal direction, characterized in that, the feeding unit comprises a glass distribution manifold (2), which defines two separate fluid communication paths to the first and second tip plate assemblies (1A, 1B), and in that, the stiffening rib structure (21) forms an integral part of the floor of the manifold (2).
Patent TW-201409086-A (TW)
Title: Method for forming microlenses
Inventor: WANG TING-HAO FRANK
IPC: G02B3/00
Filed: 2013-05-30
Abstract: Methods for forming microlenses on a semiconductor substrate are provided. An inductively coupled plasma etch process using a process gas that includes a mixture of CF4 and CHF3 can be used to modify the lens shape of a plurality of microlens object located on a semiconductor substrate to meet microlens specifications in terms of curvature, height, length, shape, and/or distance between adjacent microlens objects on the substrate. The inductively coupled plasma process can be performed in an inductively coupled plasma processing apparatus that includes a grounded Faraday shield to prevent any capacitive coupling during the plasma etching process to reduce sputtering of the microlens surface.
Patent TW-201402704-A (TW)
Title: Coloring composition, color filter and display device
Inventor: YOSHIZAWA HIDEYUKI
IPC: C09B47/24
Filed: 2013-05-31
Abstract: The object of the present invention is to provide a coloring composition capable of forming a chromatic layer which represents excellent contrast when using xanthene-series compound as a coloring agent. The coloring composition includes a coloring agent(A) containing the xanthene-series compound, a binder resin(B) and a cross-linking agent, and is characterized in further including at least one kind compound(D) selected from a group comprising a phthalocyanine-series compound represents by formula (2) as below, an anthraquinone-series compound, a triaryl methane-series compound, an azomethine-series compound, a porphyrin-series compound, C.I. solvent blue 70 and C.I. solvent blue 38; and the xanthene-series compound contains at least one kind selected from SO3H and -SO3- as substituents. (in formula (2), R21 to R36 each independently represent hydrogen atom, saturated aliphatic hydrocarbon group, phenyl group, -OH, -COOH, -SO3H, -(SO3)-(NR101R102R103R37)+, -SO3Mb or -SO2NHR38; at least one of the R21 to R36 is -(SO3)-(NR101R102R103R37)+; R37 and R38 each independently represent C1 to C10 saturated aliphatic hydrocarbon group; R101 to R103 each independently represent hydrogen atom or C1 to C10 saturated aliphatic hydrocarbon group; Mb represents sodium atom or potassium atom; M represents metal atom).
Patent TW-201448069-A (TW)
Title: Fine pitch arrangement structure of pillar bumps on chip
Inventor: TAI KUO-JUI
IPC: H01L21/60
Filed: 2013-06-06
Abstract: Disclosed is a fine pitch arrangement structure of pillar bumps on chip, comprising a chip, an insulating layer and at least two pillar bumps. Bonding pads of the chip are arranged along a X-axis. Openings of the insulating layer have a first aspect ratio. Pillar bumps are bonded onto the bonding pads and each has a pillar body and a solder layer. Each pillar body has a plurality of symmetrical height-cushioning lumps disposed to cover on the insulating layer. The pillar bodies have a bump width reduced along the X-axis so as to have a second aspect ratio at least more than 1.5 times of the first aspect ratio and to partially expose the bonding pads and to make the central points of the pillar bodies be vertically aligned with the central points of the openings of the insulating layer.
Patent TW-201410285-A (TW)
Title: Microneedle sheet
Inventor: KOMINAMI KAZUYA
IPC: A61K9/70
Filed: 2013-06-11
Abstract: A microneedle sheet according to an embodiment comprises a plurality of microneedles which are formed upon a sheet approximately along a primary face of the sheet. The microneedles stand up from the primary face by the sheet being bent, and when standing up, the microneedles penetrate the skin.
Patent TW-201501117-A (TW)
Title: Singing scoring system for multiple microphones and method thereof
Inventor: CHEN HSIN-HUNG
IPC: G10H1/36
Filed: 2013-06-21
Abstract: A singing scoring system for multiple microphones and method thereof is disclosed. By connecting data bus to audio integrated circuit (IC) for simultaneously reading inputing audios from multiple microphones, and scoring the inputting audios to form scoring results and displaying the scoring results. The mechanism is help to improve the objectivity of singing scoring.
Patent TW-201411194-A (TW)
Title: Low Z-height projection system for projecting structured light for 3D imaging
Inventor: DAVIDSON IAIN
IPC: G02B27/22
Filed: 2013-07-02
Abstract: A low Z-height projection system includes a display panel for displaying a grating pattern that has gratings extended in a first direction. A projection lens system is also included and projects the grating pattern displayed on the display panel onto a surface. The projection lens system is a truncated circular lens system that has a first lens width in the first direction and a second lens width in a second direction. The first lens width is less than the second lens width. The first and second directions are orthogonal.
Patent TW-201413801-A (TW)
Title: Innovative top-coat approach for advanced device on-wafer particle performance
Inventor: SUN JENNIFER Y
IPC: H01L21/288
Filed: 2013-07-24
Abstract: To manufacture a coating for an article for a semiconductor processing chamber, the coating is applied to the article by a method including applying a sol-gel coating of Y2O3 over the article, and curing the sol-gel coating on the article by heating the article with the sol-gel coating and exposing the article with the sol-gel coating to plasma in a semiconductor manufacturing chamber.
Patent TW-201418380-A (TW)
Title: Two-pack type curable coating agent
Inventor: KIGUCHI MASAO
IPC: C09D133/00
Filed: 2013-07-30
Abstract: The present invention provides a two-pack type curable coating agent which is capable of forming a coating layer that has excellent transparency, hardness, scratch resistance, oil wiping-off properties and tensile elongation. A two-pack type curable coating agent of the present invention is characterized by containing: a base material which contains 100 parts by weight of an acrylic polymer that comprises a photopolymerizable group and a hydroxyl group in side chains and has a hydroxyl number of 30-350 mgKOH/g and a weight average molecular weight (Mw) of 5,000-200,000, 0.3-35 parts by weight of a silane coupling agent, 0.3-35 parts by weight of a polyether polyol, 3-70 parts by weight of a polylactone polyol and 6-500 parts by weight of a photopolymerizable polyfunctional compound that comprises two or more photopolymerizable groups in each molecule; and 3-100 parts by weight of a curing agent which contains a polyisocyanate.
Patent TW-201507294-A (TW)
Title: Electrical connector
Inventor: GAO SHENG-PIN
IPC: H01R13/6581
Filed: 2013-08-08
Abstract: An electrical connector includes an insulative housing, a magnetic module, and a flexible conductive sheet. The magnetic module includes a left magnetic module and a right magnetic module. The flexible is disposed between the left magnetic module and the right magnetic module for filtering electromagnetic interference therebetween. The shielding sheet is used a flexible conductive sheet to decrease manufacture cost.
Patent TW-201431779-A (TW)
Title: Mixed sulphate containing lithium-manganese-metal phosphate
Inventor: TRAN NICOLAS
IPC: H01M4/1397
Filed: 2013-08-14
Abstract: The present invention relates to a sulphate containing mixed Lithium-manganese iron phosphate of formula LixFeyMn1-yM1-(y+z)(PO4)u(SO4)v wherein M is a metal selected from the group Co, Ni, Al, Mg, Sn, Pb, Nb, B, Cu, Cr, Mo, Ru, V, Ga, Ca, Sr, Ba, Ti, Zr, Cd and mixtures thereof and wherein 0.9 ≤ x ≤ 1.5, 0 ≤ y < 1, and 0, 5 ≤ (y+z) ≤ 1 and 0.0 < u ≤ 1, 0 and 0 < v ≤ 0, 25, a process for producing it as well as its use as cathode material in a secondary lithium-ion battery.
Patent TW-201509276-A (TW)
Title: Server
Inventor: LI MING-GANG
IPC: G06F1/16
Filed: 2013-08-16
Abstract: A server includes a case, an empty tray, three mother board trays and three mother board modules. The case has a first space and second space. The first space and the second space have a first storage zone and a second storage zone respectively. The empty tray and three mother board trays dispose in two first storage zones and two second storage zones respectively. Three mother board modules dispose on three mother board trays. Every mother board module includes a mother board and a central processing unit.
Patent TW-201516896-A (TW)
Title: System and method for optimized cutting of materials
Inventor: CHANG CHIH-KUANG
IPC: G06Q10/04
Filed: 2013-08-20
Abstract: The present application provides a system for optimized cutting of materials. The system includes a plurality of function modules that loads a cutting plate and an object outline, abstracts straight lines that compose the object outline, produces a point cloud of the object outline according to the straight lines, and computes a maximum box in the cutting plate. The system produces a triangular mesh using the point cloud, computes total areas S of all triangles in the triangular mesh, and computes a number of the object outlines which can be cut using the cutting plate according to the total areas S, and outputs an arrange of the object outline in the cutting plate.
Patent TW-201510881-A (TW)
Title: Data transmission method and data transmission system
Inventor: CHUNG HSING-LUNG
IPC: G06F13/38
Filed: 2013-09-10
Abstract: A data transmission method and a data transmission system are provided. The data transmission system includes a first electrical device and a second electrical device. The first electrical device obtains a first image, and determines if a first object in the first images changes from a first state to a second state. If the first object changes from the first state to the second state, the first electrical device selects a file. If the second electrical device determines that a second object in a second image obtained by the second electrical device changes from the second state to the first state, the second electrical transmits a request transmission packet to the first electrical device. The first electrical device transmits the selected file to the second electrical device according to the request transmission packet. Accordingly, a file is easily transmitted between multiple electrical devices.
Patent TW-201515118-A (TW)
Title: Method for manufacturing communication chip card substrate
Inventor: CHEN HE-XU
IPC: H01L23/14
Filed: 2013-10-01
Abstract: A method for manufacturing a communication chip card substrate includes a double side adhering step, a punching step, a copper foil pressing step, an image transferring step, a black lacquer layer forming step, a plating step, and a surface packaging step. The double side adhering step is to form an adhesive layer on an upper surface and a lower surface of a glass fiber substrate respectively. The black lacquer layer forming step is to form a black lacquer layer on an edge of an image-transfer-completed structure. The plating step is to form a plating layer on a metal layer pattern surface. The surface packaging step is to form a compression molding material on the lower surface of the glass fiber substrate, for bonding the compression molding material with the glass fiber substrate by the adhesive layer. Thereby, adhesiveness between the glass fiber substrate, the compression molding material and a hot melt film can be improved, so as to avoid detachment during subsequent chip packaging or after long term use, in order to improve overall life cycle and reliability, and reduce plating cost as well.
Patent TW-201416387-A (TW)
Title: Thermosetting composition with photo-aligning characteristic, cured film, color filter, liquid crystal display element, solid imaging element and optical device
Inventor: OKAMOTO YUKI
IPC: C08G69/44
Filed: 2013-10-18
Abstract: The invention provides a material after a cured film is formed showing planarity, high solvent resistance, excellent photo-aligning characteristic with respect to polymerizable liquid crystal, sufficient heat resistance and high transparency, and being solvable by glycol-based solvent, ketone-based solvent or lactate-based solvent applicable for fabricating an overcoat of a color filter when the cured film is formed. The invention relates to a thermosetting composition with photo-aligning characteristic including a polymer (A) with photo-aligning characteristic and a polyesteramide acid (B) and application of the thermosetting compositions.
Patent TW-201432776-A (TW)
Title: TCCT match circuit for plasma etch chambers
Inventor: Long mao-lin
IPC: H01L21/67
Filed: 2013-10-22
Abstract: A match circuit includes the following: a power input circuit coupled to an RF source; an inner coil input circuit coupled between the power input circuit and an input terminal of an inner coil, the inner coil input circuit including an inductor and a capacitor coupled in series to the inductor, the inductor connecting to the power input circuit, and the capacitor connecting to the input terminal of the inner coil, a first node being defined between the power input circuit and the inner coil input circuit; an inner coil output circuit coupled between an output terminal of the inner coil and ground, the inner coil output circuit defining a direct pass-through connection to ground; an outer coil input circuit coupled between the first node and an input terminal of an outer coil; and an outer coil output circuit coupled between an output terminal of the outer coil and ground.
Patent TW-201440189-A (TW)
Title: Bump-equipped electronic component and method for manufacturing bump-equipped electronic component
Inventor: OBU ISAO
IPC: H01L21/768
Filed: 2013-11-08
Abstract: The purpose of the present invention is to provide a bump-equipped electronic component and a method for manufacturing a bump-equipped electronic component. The bump-equipped electronic component and the method for manufacturing the bump-equipped electronic component are used for preventing changes in characteristics of semiconductor chips and failure of a connection between a semiconductor substrate and a mounting substrate. The bump-equipped electronic component includes a circuit substrate (1) and first and second bumps (B1, B2) which are disposed on a principal surface of the circuit substrate (1) and have different cross-sectional areas in a direction parallel or substantially parallel to the principal surface. Furthermore, one (B1) of the first and second bumps (B1, B2) having a smaller cross-sectional area includes a height adjustment layer (5) disposed in a direction perpendicular or substantially perpendicular to the principal surface.
Patent TW-201421567-A (TW)
Title: Substrate etching method
Inventor: Li cheng-qiang
IPC: H01L21/306
Filed: 2013-11-21
Abstract: Provided is a substrate etching method, comprising the following steps: inputting an etching gas of a mixture of chlorine and a chloride gas into a reaction chamber; applying an excitation power to the reaction chamber, so as to enable the etching gas to form a plasma; and applying a bias power to a substrate to be processed, so as to enable the plasma to etch the substrate to be processed. The substrate etching method can reduce or even avoid needles formed at the bottom of a gallium nitride (GaN) slot, thereby improving the process quality.
Patent TW-201433040-A (TW)
Title: Wireless power transmitting device, power supply control method of wireless power transmitting device, and manufacturing method of wireless power transmitting device
Inventor: HATANAKA TAKEZO
IPC: H02J7/00
Filed: 2013-11-26
Abstract: Disclosed is a power supply control method of a wireless power transmitting device 1 which utilizes a power supply module 2 having a power supply coil 21 and a power supply resonator 22 to change the magnetic field of a power reception module 3 having a power reception resonator 32 and a power reception coil 31 to supply power. This method restricts the driving frequency of the power supplied to the power supply module 2 to a value that will not become the resonance frequency of the power supply module 2 and the power reception module 3, afterwards element values (e.g. capacitance, inductance, and mutual inductance, etc) of the circuit elements constituting the power supply module 2 and the power reception module 3 are taken as parameters, and then these parameters are changed to determine the input resistance Zin of the wireless power transmitting device 1 to thereby adjust the power to be supplied.
Patent TW-201522241-A (TW)
Title: Molybdenum-contained wastewater treatment method and molybdenum recovery method
Inventor: CHANG CHIEN-KUEI
IPC: B01J20/34
Filed: 2013-12-09
Abstract: A treatment method includes: adding a Mo-adsorbent in a Mo-contained wastewater; mixing the Mo-contained wastewater and the Mo-adsorbent which absorbs Mo ions; separating the Mo-adsorbent from the wastewater to obtain a used Mo-adsorbent and a treated wastewater; and discharging the treated wastewater and retaining the used Mo-adsorbent. A recovery method includes: adding a Mo-desorbent in a used Mo-absorbent; mixing the Mo-desorbent and the used Mo-adsorbent to separate Mo irons from the used Mo-adsorbent so as to obtain a Mo-contained liquid and a recovered Mo-adsorbent; separating the recovered Mo-adsorbent from the Mo-contained liquid; discharging the Mo-contained liquid to remain the recovered Mo-adsorbent.
Patent TW-201515185-A (TW)
Title: Multi-die stack structure
Inventor: LIANG ZER
IPC: H01L23/52
Filed: 2013-12-16
Abstract: A multi-die stack structure including N dies (N ≥ 2) stacked vertically is described. Each die includes N die-specific input pads, wherein a specific pad among the N pads is for the input of the die. The specific pad of each die above the bottom die is electrically connected with a different pad of the bottom die other than the specific pad of the bottom die, via at least one TSV and, when not being in the die neighboring to the bottom die, also via a different pad of each underlying die above the bottom die. The specific pad of the bottom die is electrically connected with at least one pad of the overlying die(s) that is not the specific pad of any overlying die and not any pad electrically connected with the specific pad of any overlying die.
Patent TW-201426922-A (TW)
Title: Back-to-back stacked integrated circuit assembly and method of making
Inventor: STUBER MICHAEL A
IPC: H01L23/12
Filed: 2013-12-20
Abstract: An integrated circuit assembly includes a first substrate and a second substrate, with active layers formed on the first surfaces of each substrate, and with the second surfaces of each substrate coupled together. A method of fabricating an integrated circuit assembly includes forming active layers on the first surfaces of each of two substrates, and coupling the second surfaces of the substrates together.
Patent TW-201439542-A (TW)
Title: Inertial device, method, and storage medium
Inventor: MATSUSHITA YUSUKE
IPC: G01P15/16
Filed: 2014-01-29
Abstract: An inertial device is disclosed that includes an inertial sensor unit configured to generate an output representing motion of a target holding the inertial device; a storage unit configured to store factors which are associated with different outputs to be generated by the inertial sensor unit, respectively; a generation unit configured to generate a waveform which represents variation of velocity of the inertial device in a predetermined period by using one of the factors corresponding to the output generated by the inertial sensor unit; a combination unit configured to combine the waveform with one or more previous waveforms which have been generated by the generation unit; and an estimation unit configured to estimate a position where the inertial device is currently located using a velocity obtained from the combined waveform.
Patent TW-201447916-A (TW)
Title: Sub-block decoding in 3D memory
Inventor: HA CHANG-WAN
IPC: G11C5/06
Filed: 2014-02-21
Abstract: Some embodiments relate to apparatuses and methods associated with blocks of memory cells. The blocks of memory cells may include two or more sub-blocks of memory cells. Sub-blocks may comprise a vertical string of memory cells including a source select transistor and a drain select transistor. An apparatus may include two or more drain select lines, of which a first drain select line is coupled to a drain select transistor in a first sub-block of a first block and to a drain select transistor in a first sub-block of a second block. A second drain select line in the apparatus may be coupled to a drain select transistor in a second sub-block of the first block and to a drain select transistor in a second sub-block of the second block. Other apparatuses and methods are described.
Patent TW-201446520-A (TW)
Title: Laminate and device including substrate produced using the laminate
Inventor: JEONG HYE-WON
IPC: B32B27/34
Filed: 2014-04-09
Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a first polyimide resin layer between a carrier substrate and a second polyimide resin layer, wherein the first polyimide resin layer has a coefficient of thermal expansion(CTE) equal to or lower than the CTE of the second polyimide-based resin layer at a temperature of 100 to 200 DEG C, and the adhesive strength of the first resin layer to the second resin layer decreases when a physical stimulus causing no chemical changes in the first resin layer is applied to the laminate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.
Patent TW-201506155-A (TW)
Title: Fermented malt beverage
Inventor: MARUHASHI TAICHI
IPC: C12G3/08
Filed: 2014-04-10
Abstract: A fermented malt beverage produced by fermenting malt with yeast, said fermented malt beverage being characterized by meeting both the following requirements (A) and (B): (A) the bitterness unit is 30 to 45 BU as measured by a method described in "the BCOJ beer analysis method, section 8.15: Bitterness unit"; and (B) the total content of sugars comprising glucose, sucrose, maltose, isomaltose and a trisaccharide is 0.9 to 3.0 w/v%. The fermented malt beverage according to the present invention has both bitterness and sweetness in a good balance and can provide a novel taste for articles of taste.