Patent TW-202236421-A (TW)
Title: Substrate processing system and transfer method including a vacuum transfer module, a plasma processing module connected to the vacuum transfer module, and a controller
Inventor: AMIKURA NORIHIKO
IPC: H01L21/3065
Filed: 2022-02-08
Abstract: A substrate processing system according to an embodiment of the present invention includes a vacuum transfer module, a plasma processing module connected to the vacuum transfer module, and a controller. The vacuum transfer module includes a vacuum transfer chamber and a transfer manipulator arranged in the vacuum transfer chamber. The plasma processing module includes a plasma processing chamber; a carrying platform, which is arranged in the plasma processing chamber and has a substrate supporting surface and a ring supporting surface; a first ring arranged on the ring supporting surface of the carrying platform; a second ring arranged on the first ring in a manner of surrounding the substrate on the substrate supporting surface of the carrying platform, and having an inner diameter smaller than that of the first ring; a plurality of first supporting pins, which are arranged below the ring supporting surface; a plurality of second supporting pins, which are arranged below the substrate supporting surface; a first actuator configured to move the plurality of first supporting pins relative to the carrying platform in the longitudinal direction; and a second actuator configured to move the plurality of second support pins relative to the carrying platform in the longitudinal direction. The controller is configured to selectively execute the following two modes, that is, a simultaneous transfer mode in which the transfer manipulator simultaneously transfers the first ring and the second ring, and a separate transfer mode in which the transfer manipulator transfers the second ring independently. The simultaneous transfer mode includes the following steps: raising the plurality of first supporting pins in such a way that the first ring and the second ring are lifted together by the plurality of first supporting pins; and transferring the first ring and the second ring together between the plurality of first supporting pins and the transfer manipulator in a state where the plurality of first supporting pins have been raised. The separate transfer mode includes the following steps: raising the plurality of first supporting pins in such a way that the first ring and the second ring are lifted together by the plurality of first supporting pins; raising the plurality of second supporting pins in such a way that a transfer jig is supported by the plurality of second supporting pins at a height lower than the height of the second ring; in the state where the second ring is supported by the transfer jig and the first ring is supported by the plurality of first supporting pins, lowering the plurality of second supporting pins to a position lower than the height of the transfer jig; and transferring the transfer jig and the second ring together between the plurality of second supporting pins and the transfer manipulator in a state where the plurality of second supporting pins have been raised.