baber/WOPTO huggingface dataset:
Patent TW-553920-B (TW)
Title: Dielectric composition for multi-layers ceramics capacitor
Inventor: SAWASAKI AKIRA
IPC: C04B35/486
Filed: 2002-01-31
Granted: 2003-09-21
Abstract: A dielectric composition for a multi-layer ceramic capacitor will not become a semiconductor during a reduction sintering process and has a high dielectric constant. The composition is a Ti-Ba-based composition of the following formula: (Bal-x-y-zCaxYyYbz)n(Til-a-b-c-dZraMnbNbcMOd)O3+delta, in which 0 < x < 0.15, 0 < y+z < 0.02, 0.25 < y/z < 4.00, 0 < a < 0.35, 0 < b < 0.05, 0 < c+d < 0.01, 1.0 < c/d < 9.0, 1.0 < n < 1.05, delta is the deviation of a combined oxygen atom. The composition is characterized in that the barium molecular group contains a tiny amount of yttrium and ytterbium, and the titanium molecular group contains a tiny amount of molybdenum and niobium. During the sintering process, a specific amount of a copper silicone oxide is used as a sintering agent.
Patent TW-541754-B (TW)
Title: Solid polymer electrolyte fuel cell assembly, fuel cell stack, and method of operating cell assembly
Inventor: SUGIURA SEIJI
IPC: H01M8/10
Filed: 2002-03-05
Granted: 2003-07-11
Abstract: A cell assembly (10) is formed by stacking a first unit cell (14) and a second unit cell (16) to each other. The first unit cell (14) includes a first unified body (18), and the second unit cell (16) includes a second unified body (20). In the cell assembly (10), the first and second unit cells (14, 16) have structures different from each other.
Patent TW-535271-B (TW)
Title: Semiconductor device and method of manufacturing the same
Inventor: MIYAKI YOSHINORI
IPC: H01L23/495
Filed: 2002-03-21
Granted: 2003-06-01
Abstract: The purpose of the present invention is to improve the reflow characteristic and realize leadlessness, which comprises: a cross die pad 1g which supports a semiconductor chip 2 and in which an area of the region joined to the semiconductor chip 2 is smaller than that of the rear surface 2b of the semiconductor chip 2; wires 4 connected to pads 2a of the semiconductor chip 2; a plurality of inner leads 1b which are arranged around the semiconductor chip 2 and in which a silver plating layer 1a is formed at a wire bonding area 1j; molding part 3 for resin sealing the semiconductor chip 2; a plurality of outer leads 1c exposed from the molding part 3 and in which a lead-free metallic layer 1m is formed on a installation surface 11, in which the flat surface size of the molding part 3 is formed to be equal to or less than 28 mm x 28 mm and the thickness thereof is formed to be 1.4 mm or less, and thereby it is possible to improve the reflow characteristic and realize leadlessness.
Patent TW-533145-B (TW)
Title: Bicycle hub axle having a dynamo thereon
Inventor: NISHIMOTO NAOHIRO
IPC: B62J6/12
Filed: 2002-04-10
Granted: 2003-05-21
Abstract: A bicycle dynamo hub axle assembly that includes an axle having opposite ends, a smaller diameter portion located at one of said opposite ends, and a larger diameter portion, an electricity generating device disposed on the larger diameter portion of the axle, a bearing race disposed on the larger diameter portion, an electric wire extending from the electricity generating device, through one of the grooves and through the bearing race, a spacer disposed on the larger diameter portion, and a lock nut disposed on the smaller diameter portion for securing the bearing race and the spacer in position. The smaller diameter portion has a smaller diameter than the larger diameter portion and the larger diameter portion has at least two grooves defined therein. The large diameter portion also includes a stepped portion extending radially outwardly therefrom. The spacer has an opening defined therethrough, and has at least one tongue extending inwardly into the opening. The tongue is received in one of the grooves, thereby preventing the spacer from rotating.
Patent TW-571585-B (TW)
Title: The correction method of image data and the image signal processing apparatus
Inventor: TERATANI MASATO
IPC: H04N5/335
Filed: 2002-05-10
Granted: 2004-01-11
Abstract: Decision reference value setup circuit 13 detected the maximum level Hmax and minimum level Hmin of the periphery pixels arrayed around the observation pixel, and set up a first decision reference value Hw from the maximum level Hmax plus offset OS and a second decision reference value Hb from the minimum level Hmin subtract offset OS. The detection circuit 14 compared the image data Y(P0) level of the observation pixel with the first decision reference value Hw and the second decision reference value Hb, decided that the observation pixel is a defective pixel when the image data Y(P0) level of the observation pixel is larger than the first decision reference value Hw or lower than the second decision reference value Hb, and then built up a detection output. The correction circuit 16 replied the built up of detection output, and exported the correction data Y'(P0) replacing the image data Y(P0).
Patent TW-I283012-B (TW)
Title: Sandwich photoresist structure in photolithographic process
Inventor: LIN BENJAMIN SZU-MIN
IPC: H01L21/311
Filed: 2002-07-11
Granted: 2007-06-21
Abstract: A photolithographic process that involves building a sandwich photoresist structure. A first photoresist layer is formed over a substrate. An anti-reflection layer is formed over the first photoresist layer. A second photoresist layer is formed over the anti-reflection layer. A first photo-exposure is conducted and the exposed second photoresist layer is developed to pattern the second photoresist layer and the anti-reflection layer. Using the second photoresist layer and the anti-reflection layer as a mask, a second photo-exposure and a second photoresist development are conducted to pattern the first photoresist layer.
Patent TW-581891-B (TW)
Title: Light guide for use with backlit display
Inventor: WHITNEY LELAND RAY
IPC: G02F1/13357
Filed: 2002-07-12
Granted: 2004-04-01
Abstract: A light guide including a light guide body having a light re-directing side positioned opposite from a light output side. A plurality of elongate prisms are located adjacent the light output side of the light guide body. The prisms extend side-by-side relative to one another along lengths. The prisms include upper edges defining heights of the prisms. The upper edges extend along the lengths of the prisms. Each upper edge includes a plurality of edge segments having different magnitudes of slope. The light guide also includes a plurality of light extraction structures located adjacent the light re-directing side of the light guide body for reflecting light toward the light output side. The light extraction structures include elongated projections each having a plateau segment and first and second facets. The elongated projections are separated by lands that are recessed relative to the plateau segments. The first and second facets extend from the plateau segments to the lands.
Patent TW-I242162-B (TW)
Title: Finger-operated cursor input device
Inventor: SU YU-QUAN
IPC: G06F3/033
Filed: 2002-08-13
Granted: 2005-10-21
Abstract: This invention relates to a finger-operated cursor input device having an image location detection device. User's hand is positioned within the range where the image location detection device is able to capture images. When moving hand horizontally, the image location detection device is able to capture the changes in horizontal position of its image, so as to generate a corresponding computer cursor movement signal. When moving the finger tip upwards and downwards, the image location detection device is able to capture the changes in vertical position of its image, so as to generate a keystroke signal. The above device eliminates the use of a physical mouse or keyboards that will occupy a greater space in use.
Patent TW-557556-B (TW)
Title: Window-type multi-chip semiconductor package
Inventor: TSENG WEI-CHENG
IPC: H01L25/065
Filed: 2002-09-10
Granted: 2003-10-11
Abstract: A window-type multi-chip semiconductor package is provided, in which at least a first chip and a second chip are mounted on a surface of a substrate formed with an opening and at least a third chip is stacked on the first and second chips, in a manner that a plurality of bonding wires formed through the opening are used to electrically interconnect the chips and to electrically connect the chips to the substrate. The chips are encapsulated by a first encapsulant formed on the surface of the substrate, and a second encapsulant is formed on an opposed surface of the substrate and fills into the opening for encapsulating the bonding wires. With the chips being mounted on the same surface of the substrate, conductive components such as bond pads formed on the chips are arranged toward the same direction and thereby facilitate shortening of the bonding wires, so as to enhance electrical transmission and performances for the chips and the semiconductor package.
Patent TW-I224304-B (TW)
Title: Semiconductor device equipped with transfer circuit for cascade connection
Inventor: KUMAGAI MASAO
IPC: G09G3/20
Filed: 2002-10-21
Granted: 2004-11-21
Abstract: A transfer circuit 25 includes two sets of an input circuit 52A and an output circuit 53B, which allows bidirectional transfer. The input circuit 52A decomposes external input data signals DI11A and DI12A to signals on lines L11 to L14 in synchronism with a clock signal CLK in order to reduce the frequency thereof. The output circuit 53B composes the decomposed signals in synchronism with the clock signal CLK to regenerate the original signals and output them as external output data signals DO11B and DO12B. Signals on either the lines L11 to L14 or L21 to L24 are selected by a multiplexer 57 to provide to a main body circuit.
Patent TW-569395-B (TW)
Title: Method of forming a stacked-gate cell structure and its NAND-type flash memory array
Inventor: WU CHING-YUAN
IPC: H01L21/8239
Filed: 2002-10-30
Granted: 2004-01-01
Abstract: A stacked-gate cell structure having a tapered floating-gate layer and a laterally graded source/drain diffusion profile is implemented to form NAND cell strings over a self-aligned STI structure having a high coupling ratio. The paired string select lines and the paired ground select lines being formed over one-side tapered floating-gate layers are simultaneously defined by a spacer formation technique and are therefore scalable. Each of common-source conductive bus lines is formed over a first flat bed between a pair of sidewall dielectric spacers being formed over sidewalls of the paired ground select lines. A plurality of planarized conductive islands are formed over common-drain diffusion regions between another pair of sidewall dielectric spacers being formed over sidewalls of the paired string select lines and are patterned simultaneously with a plurality of metal bit-lines by using a masking photoresist step.
Patent TW-I269497-B (TW)
Title: Circuit component connector, its connection structure, and gasket
Inventor: MATSUMOTO SHUZO
IPC: H01R13/52
Filed: 2002-11-05
Granted: 2006-12-21
Abstract: This structure comprises an elastic holder (10) for storing coin-type button battery (2) and connection terminals (20) arrayed in the outer periphery of the bottom section of the elastic holder (10). The elastic holder (10) is molded into an insulating nearly closed-end cylinder to integrally mold its bottom with the connection terminals (20). Each connection terminal (20) is constituted of an insulating elastic rubber (21) molded with the bottom section of the elastic holder (10) and conductive fine wires (22) buried side by side in the elastic rubber (21) to direct in the thickness direction of the bottom section of the elastic holder (10) and to contact the negative pole (3) and the positive pole (4) of the button battery (2). Therefore, a reduction in the number of components, simplification and speed-up of assembly, and an improvement in assembly efficiency are attained, so that even the action of oscillation or impact causes no malfunction.
Patent TW-585761-B (TW)
Title: Method for making an absorbent article with elastic cuff areas and expandable substrates
Inventor: ROESSLER THOMAS HAROLD
IPC: A61F13/15
Filed: 2002-12-05
Granted: 2004-05-01
Abstract: The present invention provides a method of achieving selectively elasticized zones on nonwoven web substrates, such as may be suitable for the waistbands of disposable absorbent pant garments, cuffs on sleeves of medical garments, or the like. A web, or webs, of nonwoven material which make up the substrate for the elasticized area are provided to be inherently extendable in the transverse, or lateral, direction of the material web at the time the elastic material is affixed to the substrate. If the elastic material is affixed in an untensioned state, a flat waistband without gathering of the substrate may be had for a very efficient seal against the skin of the wearer. If the elastic material is affixed to the substrate in a tensioned state, a waist band with gathering of the substrate may be had to allow for two-stage expansion via the gathers and the expansion of the substrate.
Patent TW-I233547-B (TW)
Title: Debugging structure for operation platform application program of portable digital product and the method thereof
Inventor: FRAYER NICOLAS
IPC: G06F11/26
Filed: 2002-12-31
Granted: 2005-06-01
Abstract: The present invention provides a debugging structure for operation platform application program of portable digital product and the method thereof. The method comprises using a data transmission interface connection to connect the portable digital product with a computer to form an information transmission loop; transmitting an address from the computer to the portable digital product; next, using a debugging mechanism in the portable digital product to receive the address, and obtaining the value of the address in the portable digital product; and finally, sending back the value of the address by the debugging mechanism through theinformation transmission interface to the computer, and displaying the same on the computer.
Patent TW-I291346-B (TW)
Title: Hygiene product
Inventor: KASHIWAGI MASAHIRO
IPC: B65D75/38
Filed: 2003-01-08
Granted: 2007-12-21
Abstract: The present invention provides a hygiene product of sanitary napkin and packaged sheet folded and packaged with said packaging sheet, which can be opened without externally exposing pressure sensitive adhesive layers of the wing portions so that the pressure sensitive adhesive layer will not come into contact with hand or clothes: the pressure sensitive adhesive layers 31 outside folded using wing portions 29 of the sanitary napkin 20 are covered with the release sheet 50. A packaging sheet 40, and the sanitary napkin 20 are folded together; the inside face of the packaging sheet 40 is bonded to the exterior of the release sheet 50 through a bonding part 73a. Therefore, as the fold releases, the release sheet 50 can remain covered with pressure sensitive adhesive layers 31 to prevent accidental hand touch of the pressure sensitive adhesive layers 31.
Patent TW-I280969-B (TW)
Title: Non-reactive ink vehicle formulation
Inventor: ROLLY LUANNE J
IPC: C09D11/00
Filed: 2003-01-16
Granted: 2007-05-11
Abstract: The present invention is drawn to ink-vehicle compositions and systems adapted for use in low dye load ink compositions, contain no salts, and provide low orifice plate puddling. Specifically, a non-reactive ink-vehicle for low dye-load ink-jet inks can comprise an effective amount of water; from 1% to 3% by weight of a 1,5-pentanediol co-solvent; from 7.5% to 15% by weight of a trimethylol-propane co-solvent; and from 5% to 8% by weight of a third co-solvent, with the proviso that the ink-vehicle comprise at least 20% by weight of total co-solvent. Alternatively, a non-reactive ink-vehicle for low dye-load ink-jet inks can comprise an effective amount of water; from 1% to 3% by weight of 10 a 1,5-pentanediol co-solvent; from 7.5% to 15% by weight of a trimethylol propane co-solvent; and from 0.05% to 0.25% of a buffer consisting essentially of 2-amino-2-(hydroxymethyl)-1,3-propanediol. These ink-jet ink vehicles can be used in swappable ink-jet pen systems having a common service station.
Patent TW-I226293-B (TW)
Title: Train provided with energy absorbing structure between vehicles
Inventor: TAGUCHI MAKOTO
IPC: B61D15/06
Filed: 2003-02-07
Granted: 2005-01-11
Abstract: A train energy absorbing structure absorbs energy of the entire train by relaxing compression between vehicles at the end part of the train and enhancing compression between vehicles in the central part of the train. A plurality of vehicles (A1-A12) is coupled through couplers (B1-B11) and energy absorbing structures (S12-S42, S82-S122) are provided between respective vehicles. An average compression load being determined by dividing energy absorption of the energy absorbing structures (S12-S42, S82-S122) by the maximum compression thereof is set lower between vehicles in the central part of the train than between vehicles on the outerside (closer to the end part).
Patent TW-I237113-B (TW)
Title: Measuring apparatus, purity controller, and mixing ratio controller for insulative fluid
Inventor: YAMAGISHI JUNICHI
IPC: H01L21/306
Filed: 2003-03-21
Granted: 2005-08-01
Abstract: A measuring apparatus correctly measures the purity, mixing ratio, and the like of an insulative (nonconductive) fluid such as ultrapure water flowing through a passage. The apparatus includes first to third sensors (19, 21, 23) to detect capacitance changes on the passage (1a) covered with an insulating resin pipe, a memory (41) to store reference capacitance changes, and a controller (35) to compare the detected capacitance changes with the store reference capacitance changes, measure a purity of the insulative fluid flowing through the passage, and control the purity of the insulative fluid.
Patent TW-594449-B (TW)
Title: Spacing device for image processing systems
Inventor: LIU DEAN
IPC: G03G15/08
Filed: 2003-05-07
Granted: 2004-06-21
Abstract: A spacing device for image processing system to maintain a development gap between an image-receiving member and a developer roller thereby facilitating efficient development and consistently maintaining high image quality and methods for manufacturing and using the same. The spacing device comprises one or more spacing members that have preselected lengths and that are configured to be coupled with, and extend from, an image-receiving module and/or a developer cartridge of an image processing system. When the image processing system is properly assembled, a predetermined development gap is formed between an image-receiving member of the imaging-receiving module and a developer roller of the developer cartridge, and the spacing members are disposed substantially between, and contact with, the imaging-receiving module and the developer cartridge. The spacing members, being formed from a substantially rigid material, are configured to maintain the predetermined development gap.
Patent TW-559617-B (TW)
Title: Method for removing arsenic from water
Inventor: LEE MAO-SUNG
IPC: C02F1/44
Filed: 2003-05-07
Granted: 2003-11-01
Abstract: A method for the removal of arsenic from water is disclosed, including mixing an arsenic containing water with a water soluble sulfide or a metal salt aqueous solution at a predetermined pH in a reactor having a fluidized bed of carriers, so that arsenic sulfides or metal arsenate crystallize out on the carriers and that a processed water with a reduced amount of arsenic is obtained; separating the processed water from the reactor; and removing the granules resulting from the crystallization from the reactor and supplementing new carriers to the reactor periodically.
Patent TW-I231024-B (TW)
Title: Wafer level chip scale package with redistribution wires by wire bonding and method for manufacturing the same
Inventor: JENG SHR-JIE
IPC: H01L23/49
Filed: 2003-05-08
Granted: 2005-04-11
Abstract: A wafer level chip scale package with redistribution wires by wire bonding comprises a chip, a plurality of redistribution wires formed by wire-bonding and at least a dielectric upholder. The chip has a bottom surface and an active surface with a plurality of bonding pads. Each redistribution wire has a connecting end, at least a bonding node and a rising tip. The connecting ends are bonded on the bonding pads. The bonding nodes are disposed on the active surface. The rising tips are raising away the active surface of the chip and supported by the dielectric upholder. Thus it is to replace a redistribution layer, a stress buffer layer, a plurality of bumps and an IC carrier.
Patent TW-I221081-B (TW)
Title: Heat dissipating fins of heat sink and manufacturing method thereof
Inventor: CHIEN CHAO-NAN
IPC: H01L23/367
Filed: 2003-07-04
Granted: 2004-09-11
Abstract: A heat-dissipating fin of a heat sink for improving thermal conduction is disclosed. The heat sink has a base plate and a plurality of heat-dissipating fins. The base plate includes a first surface contacting with a heat source, and a second surface having a plurality of groove orderly formed on the second surface. The heat-dissipating fin of the heat sink has the feature that the thickness of the heat-dissipating fin is not uniform, and the thickness of a bottom surface of the heat-dissipating fin facing the groove is greater than the other portions of the heat-dissipating fin.
Patent TW-I276365-B (TW)
Title: Sealing plate for electroluminescent device, manufacturing method thereof, and multiple paring mother glass plates thereof
Inventor: YOSHII TETSURO
IPC: H05B33/14
Filed: 2003-07-11
Granted: 2007-03-11
Abstract: The present invention aims not only to provide a sealing plate for electroluminescent (EL) device and multiple paring mother glass plates of the sealing plate that can effectively prevent water or oxygen from penetrating into the EL device and extend the EL device's service time, but also to provide a sealing plate for top-end emitting EL device, a manufacturing method of the sealing plate, and multiple paring mother glass plates of the sealing plate that can restrain the deterioration of the EL layer laminated film and, at the same time, thoroughly capture the lights emitted from the light-emitting layer. Each of two EL devices (100, 100a) is equipped with a plate-shaped transparent substrate, an organic EL layer lamination, and a sealing plate where, in order to assign a peripheral projection stripe on the periphery of the sealing plate, the center of the sealing plate is processed to be concave. For the sealing plate (30) of the EL device (100), the maximum concave-convex difference on the top surface of its projection stripe (31) is less than 10 mum. For the sealing plate (30a) of the EL device (100a), a glass thin plate (311) made of alkali-free glass and having an etched opening at its center, is equipped on the top surface of its peripheral projection stripe (31a) where the size of the glass thin plate (311) is 5.0 cm between corners and 0.1 mm in thickness, and the size of the etched opening is 4.5 cm between corners. Also, an element sieve (50), hold by an open rim (312) protruding inwards from the inner side (313) of the peripheral projection stripe (31a), is installed on the inner side (313) of the peripheral projection stripe (31a).
Patent TW-I223287-B (TW)
Title: Transformer and multi-tube system applying the same
Inventor: CHIEN CHENG-HSIEN
IPC: H05B41/282
Filed: 2003-07-25
Granted: 2004-11-01
Abstract: A transformer applied in multi-tube system is disclosed, which comprises: first and second winding frames which are both empty tubular posts, the second winding frame being parallel to the first winding frame; a first coil wound on the first winding frame; even numbers of second coils having about the same number of windings, and wound on the second winding frame; and an iron core set installed in the vacancy of the first and the second winding frames. The present invention also discloses a multi-tube system.