baber/WOPTO huggingface dataset:
Patent TW-201121025-A (TW)
Title: Multi-chip package and method of providing die-to-die interconnects in same
Inventor: BRAUNISCH HENNING
IPC: H01L21/60
Filed: 2010-03-29
Abstract: A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).
Patent TW-201139833-A (TW)
Title: Device and method for controlling an electric rolling shutter
Inventor: HSU MING-YUAN
IPC: E05C17/58
Filed: 2010-05-13
Abstract: The present invention provides a device for controlling an electric rolling shutter. The device is connected to a motor, which controls the electric rolling shutter. The device includes a setting module operable to set a login password; a login module operable to receive the login password from an electronic device, establish a wireless connection between the electronic device and the device, and provide a user interface to the electronic device, the user interface including multiple function icons to control the motor; and a motor control module operable to control the motor in response to receiving a function corresponding to a selected function icon, thereby controlling the electric rolling shutter. A related method is also disclosed.
Patent TW-201041059-A (TW)
Title: Fabrication method of leadframe and semiconductor package
Inventor: LIN CHI-CHIH
IPC: H01L21/60
Filed: 2007-01-26
Abstract: A fabrication method of a leadframe and a semiconductor package is applied to fabricate the package with the lead frame. The fabrication method includes: performing a surface treatment on a substrate; electroplating a plurality of metal-stacked layers on the surface of the substrate, wherein the top of the metal-stacked layer is a bonding surface and the bottom of the metal-stacked layer is a welding surface; performing a chip bonding step; forming a molding compound on the substrate; removing the substrate and performing a dicing step to form a plurality of semiconductor packages. The fabrication method of a semiconductor package also includes that forming a plurality of cavities on the substrate surface, electroplating the metal-stacked layer on the cavities, and then performing the chip bonding step, forming the molding compound on the substrate; remove the substrate and performing the dicing step. Using the foregoing steps can prevent the overflow situation without using any tape.
Patent TW-201143607-A (TW)
Title: Foldable pet carrying box
Inventor: Zhang rui-yang
IPC: A01K1/00
Filed: 2010-06-07
Abstract: Disclosed is a foldable pet carrying box, and in particular a pet carrying box that is composed of a foldable inverted-U-shaped top plate and a foldable U-shaped bottom plate that intersect each other in a crossing form, in which the inverted-U-shaped top plate has two side portions having undersurfaces that are bent inward to form two wing boards for coupling in order to couple to two corresponding side edges of the U-shaped bottom plate. The U-shaped bottom plate has two end portions corresponding to front and rear openings of the inverted-U-shaped top plate and provided with a front door panel and a rear door panel for closing the front and rear openings of the inverted-U-shaped top plate. The three edges, namely left, right, and top edges, of the front and rear openings of the inverted-U-shaped top plate and the front and rear door panels are provided with curved folding lines having opening facing outward in order to be folded to form curved slope faces corresponding to each other for the purposes of improving structural strength of the box. Mateable male and female buttons are provided on the corresponding curved slope faces to allow the inverted-U-shaped plate and the bottom plate to be fixed to each other to form a box. Since the inverted-U-shaped top plate and the U-shaped bottom plate can be detached and folded, the volume is small and less amount of space is occupied.
Patent TW-201114722-A (TW)
Title: Concrete composition using blast-furnace slag composition
Inventor: YONEZAWA TOSHIO
IPC: C04B28/08
Filed: 2010-06-09
Abstract: To provide a concrete composition, while suppressing the exhaust amount of carbon dioxide, which can secure satisfactory applicability in a state where the reduction in the fluidity and the reduction in an air amount with the lapse of time in a prepared concrete composition are suppressed, further can suppress the drying shrinkage of the obtained hardened body, and can make the required strength appear in the obtained hardened body. The blast-furnace slag composition at least comprises a binder, water, fine aggregate, coarse aggregate and an admixture. As the binder, the following blast-furnace slag composition is used, and also, the mass ratio of the water/the blast furnace slag composition is adjusted to 30 to 60%. Per 100 pts.mass of the mixture including a blast furnace slag composition comprising blast-furnace slag fine powder whose fineness is 3,000 to 13,000 cm2/g by 80 to 95 mass and gypsum by 5 to 20 mass% (total 100 mass%), an alkali activator is added in a ratio of 0.5 to 1.5 pts.mass or 5 to 45 pts.mass.
Patent TW-201145005-A (TW)
Title: Power saving apparatus and power saving method thereof
Inventor: LEE YU-LUNG
IPC: G06F1/32
Filed: 2010-06-09
Abstract: A power saving apparatus is disclosed. The power saving apparatus includes a power source controller for detecting an operation state of a host and outputting a control signal according to the signal transmission condition, and a power socket for communicating with the power source controller and switching the power supply according to the control signal. When the host operates in non-working mode, the power socket stops the power supply to a peripheral for saving the power consumption of the peripheral.
Patent TW-201111276-A (TW)
Title: Process for the preparation of LiFePO4-carbon composites
Inventor: SCHRODLE SIMON
IPC: C01B25/45
Filed: 2010-06-24
Abstract: The present invention relates to a process for the preparation of particles comprising at least one compound according to general formula (I) M1aM2bM3cOoNnFf (I) wherein M1, M2, M3 O, N, F, a, b, c, o, n and f have the following meanings: M1 at least one alkaline metal, M2 at least one transition metal in oxidation state +2, M3 at least one non-metal chosen form S, Se, P, As, Si, Ge and/or B, O oxygen, N nitrogen, F fluorine, a 0.8-4.2, b 0.8-1.9, c 0.8-2.2, o 1.0-8.4, n 0-2.0 and f 0-2.0, wherein a, b, c, o, n and f are chosen to ensure electroneutrality of the compound according to general formula (I), and carbon, comprising at least the following steps: (A) providing an essentially aqueous mixture comprising at least one compound comprising M1, at least one compound comprising M2 having at least partially an oxidation state higher than +2, optionally at least one compound comprising M3, at least one compound comprising N, if present, and/or at least one compound comprising F, if present, at least one polysaccharide comprising glucose having a molecular weight M of at least 50000 g/mol as carbon precursor and at least one reducing agent, (B) drying the mixture provided in step (A), in order to obtain a solid particle and (C) calcining the solid particle obtained from step (B) at a temperature of 300 to 950 DEG C.
Patent TW-201114588-A (TW)
Title: Copper foil for printed wiring board
Inventor: FURUSAWA HIDEKI
IPC: B32B15/08
Filed: 2010-06-29
Abstract: Disclosed is a copper foil for printed wiring boards, which has both excellent adhesion to an insulating substrate and excellent etching properties and is suitable for the formation of fine pitches. The copper foil for printed wiring boards comprises a copper foil base material and a coating layer that covers at least a part of the surface of the copper foil base material. The coating layer is composed of an intermediate layer comprising a metal alone or an alloy and a Cr layer laminated on the surface of the copper foil base material in this order. The coating layer contains Cr in an amount of 18 to 180 [μ]g/dm2, has a value calculated in accordance with the following formula: ∫h(x)dx/(∫f(x)dx + ∫g(x)dx + ∫h(x)dx + ∫i(x)dx + ∫j(x)dx + ∫k(x)dx) of 10% or less and a value calculated in accordance with the following formula: ∫f2(x)dx/(∫f(x)dx + ∫g(x)dx + ∫h(x)dx + ∫i(x)dx + ∫j(x)dx + ∫k(x)dx) of 20% or more in a zone [0, 1.0], and also has a value calculated in accordance with the following formula: ?f1(x)dx/∫f2(x)dx of 0.1 to 1.0 inclusive in a zone [1.0, 2.5] wherein f1(x) represents the atomic concentration (%) of metal chromium, f2(x) represents the atomic concentration (%) of chromium oxide, f(x) represents the total atomic concentration (%) of chromium (wherein f(x) = f1(x)+ f2(x), g(x) represents the atomic concentration (%) of nickel, h(x) represents the atomic concentration (%) of copper, i(x) represents the atomic concentration (%) of oxygen, j(x) represents the atomic concentration (%) of carbon, and k(x) represents the total atomic concentration of other metals as measured by means of the depth direction analysis from the surface by XPS in the direction of depth (x: expressed in "nm")).
Patent TW-201204215-A (TW)
Title: Method for manufacturing muti-layer printed circuit board
Inventor: Chen ye-ning
IPC: H05K3/46
Filed: 2010-07-02
Abstract: A method for manufacturing a multi-layer printed circuit board comprises the following steps: providing a first copper clad laminate; etching the first copper clad laminate to form at least one group of concentric copper annular protrusions, which includes a first copper annular protrusion and a second copper annular protrusion around the first copper annular protrusion, a center of the first copper annular protrusion being defined as an initial center; providing a second copper clad laminate and an adhesive layer and laminating the first copper clad laminate, the adhesive layer and the second copper clad layer to form a multi-layer substrate; forming a through hole in the multi-layer substrate about the initial center; obtaining a bias error of the through hole biased the initial center; determining the inflation and shrink rate of the multi-layer substrate according to the bias error and obtaining the location of forming plated through holes.
Patent TW-201110132-A (TW)
Title: Bad column management with bit information in non-volatile memory systems
Inventor: LI YAN
IPC: G11C29/04
Filed: 2010-07-06
Abstract: Column based defect management techniques are presented. Each column of the memory has an associated isolation latch or register whose value indicates whether the column is defective, but in addition to this information, for columns marked as defective, additional information is used to indicate whether the column as a whole is to be treated as defective, or whether just individual bits of the column are defective. The defective elements can then be re-mapped to a redundant element at either the appropriate bit or column level based on the data. When a column is bad, but only on the bit level, the good bits can still be used for data, although this may be done at a penalty of under programming for some bits, as is described further below. A self contained Built In Self Test (BIST) flow constructed to collect the bit information through a set of column tests is also described. Based on this information, the bad bits can be extracted and re-grouped into bytes by the controller or on the memory to more efficiently use the column redundancy area.
Patent TW-201208200-A (TW)
Title: Connector, backlight module and assembling method thereof, display and assembling method thereof
Inventor: HUANG YUNG-SHENG
IPC: G02F1/13357
Filed: 2010-08-05
Abstract: A connector, backlight module and assembling method thereof and display and assembling method thereof are provided. The backlight module includes a light box, multiple connectors, multiple lamps and a circuit board. The connectors are disposed at opposite sides in the light box. Each connector has a flexible conductive portion and an insulating portion, wherein the flexible conductive portion is inserted in the insulating portion. The insulating portion has multiple first openings. The lamps are disposed in the light box, wherein each of two ends of each lamp is a first conductive terminal. The circuit board is disposed under the light box and has multiple second conductive terminals. The first conductive terminals and second conductive terminals pass through the first openings such that the lamps and the circuit board are electrically connected through the flexible conductive portion.
Patent TW-201208736-A (TW)
Title: Upper limb training device
Inventor: CHEN DAR-ZEN
IPC: A63B23/12
Filed: 2010-08-16
Abstract: An upper limb training device is disclosed. The upper limb training device comprises at least one first shaft, at least one second shaft, at least one third shaft, at least one first elastic element and at least one second elastic element. The at least one second shaft is pivoted to the at least one first shaft by a first revolution element; the at least one third shaft is pivoted to the at least one second shaft by a second revolution element; the two ends of the at least one first elastic element is connected separately to the at least one first shaft and the at least one third shaft for providing a resistance that the at least one first shaft and the at least one second shaft rotate correspondingly around the at least one third shaft; the two ends of the at least one second elastic element is connected separately to the at least one first shaft and the at least one third shaft for providing a resistance that the at least one first shaft rotates correspondingly around the at least one second shaft; wherein the first revolution element is disposed between the points of the at least one first shaft connected to the at least one first elastic element and the at least one second elastic element separately.
Patent TW-201209277-A (TW)
Title: Apparatus for converting ocean wave energy into electric power with electromagnetic induction
Inventor: LEE HSIEN-HUA
IPC: F03B13/14
Filed: 2010-08-31
Abstract: Apparatus for converting ocean wave energy into electric power with electromagnetic comprises a pontoon and a plurality of electromagnetic induction groups. The electromagnetic induction groups are disposed on a upper surface of the pontoon and each of the electromagnetic induction groups includes a rod, a hollow cylindrical tube, a coil, at least one magnet, a first spring, a second spring, a first lid and a second lid. The hollow cylindrical tube is combined to the rod. The coil is winded around the hollow cylindrical tube. The magnet, the first spring, the second spring, the first lid and the second lid are disposed into the hollow cylindrical tube and the magnet is located between the first spring and the second spring. The first lid is located at the lateral of the first spring and the second lid is located at the lateral of the second spring.
Patent TW-201129858-A (TW)
Title: Semiconductor element substrate
Inventor: ISOGAI YUKIE
IPC: C08G61/00
Filed: 2010-09-28
Abstract: Disclosed is a semiconductor element substrate that comprises a resin film that is formed from a radiation-sensitive resin composition which contains a polymer having a monomer unit that has a structure wherein a cyclic olefin and a cyclic imide skeleton having a substituent of a specific structure at a nitrogen atom have one carbon-carbon bond in common, a crosslinking agent and a radiation-sensitive compound. The semiconductor element substrate is characterized in that the resin film is formed so as to be in contact with the surface of a semiconductor element that is mounted on the semiconductor element substrate or a semiconductor layer that is contained in the semiconductor element.
Patent TW-201214958-A (TW)
Title: Antenna module
Inventor: Wu wei-yang
IPC: H03H7/40
Filed: 2010-09-28
Abstract: An antenna module includes an antenna, a tunable matching circuit, a power detector and a control unit. The antenna comprises a feeding point. The tunable matching circuit, electrically connected between the antenna and the power detector and configured to provide a loading impedance, comprises a plurality of tunable impedance elements connected to each other and electrically connected to the feeding point as well. The power detector is electrically connected between the tunable matching circuit and a power amplifier and configured to detect a power indicator. The control unit, electrically connected to the tunable matching circuit and the power detector, is configured to read the power indicator and RSSI so as to generate a control signal for the tunable matching circuit, which consistently changes the loading impedance to achieve impedance matching.
Patent TW-201133587-A (TW)
Title: Silicon carbide substrate manufacturing method and silicon carbide substrate
Inventor: NISHIGUCHI TARO
IPC: H01L29/78
Filed: 2010-09-29
Abstract: Disclosed is a silicon carbide substrate manufacturing method provided with: a step in which a base substrate (10) comprising silicon carbide and an SiC substrate (20) comprising single-crystal silicon carbide are prepared; a step in which an Si film (30) comprising silicon is formed on a principal surface of the base substrate (10); a step in which a layered substrate is fabricated by placing the SiC substrate (20) on top of the Si film (30) so as to make contact therewith; and a step in which the base substrate (10) and the SiC substrate (20) are joined by heating the layered substrate, thereby converting at least the region of the Si film (30) in contact with the base substrate (10) and the region in contact with the SiC substrate (20) into silicon carbide.
Patent TW-201216706-A (TW)
Title: Projection apparatus
Inventor: KUO CHIA-CHUN
IPC: G09G5/10
Filed: 2010-10-06
Abstract: A projection apparatus including an illumination unit, a brightness detection circuit, a signal conversion circuit, and a control unit is provided. The illumination unit generates a light source according to a plurality of driving signals and provides a temperature sensing signal according to the temperature of the light source. The brightness detection circuit generates a plurality of brightness sensing signals. The signal conversion circuit converts the temperature sensing signal and the brightness sensing signals into temperature information and a plurality of brightness information. The control unit comprises a setting table for storing a predetermined temperature information and a plurality of predetermined brightness information, and the control unit adjusts the driving signals in order to identify the converted temperature information and the converted brightness information conform to the stored information in the setting table.
Patent TW-201142462-A (TW)
Title: Visual presenter
Inventor: KATO TETSURO
IPC: H04N5/225
Filed: 2010-10-26
Abstract: A visual presenter includes a base, a support column mounted on the base and a video camera head mounted on a distal end of the support column. The support column includes a first support column and a second support column. The first support column is mounted on a right or left corner of a front of the base so as to be pivotable in a right-left direction relative to the base. The second support column is mounted on a distal end of the first support column so as to be pivotable in the right-left direction relative to the base. The video camera head is mounted on the distal end of the second support column so as to be pivotable in the right-left direction.
Patent TW-201219937-A (TW)
Title: Liguid crystal display panel and manufacturing method thereof
Inventor: CHEN YING-JEN
IPC: G02F1/1343
Filed: 2010-11-09
Abstract: A liquid crystal display and a manufacturing method thereof are provided. The liquid crystal display panel includes a liquid crystal layer, a thin film transistor substrate and a color filter substrate. The thin film transistor substrate and the color filter substrate are disposed on opposite sides of the liquid crystal layer. The thin film transistor substrate and the color filter substrate include a first electrode and a second electrode, respectively. The first electrode includes a plurality of first branch substrates and a plurality of first branch slits. The first branch substrates and the first branch slits are complementary. The second electrode includes a plurality of second branch substrates and a plurality of second branch slits. The second branch substrates and the second branch slits are complementary. At least a portion of the first branch substrates or first branch slits is corresponded to at least a portion of the second branch substrates or second branch slits.
Patent TW-201221260-A (TW)
Title: Method for optimization of laser process parameters and laser machining apparatus for the same
Inventor: LI CHUN-HAO
IPC: C03B33/09
Filed: 2010-11-17
Abstract: A method of optimizing the laser process parameters for a Q-switched laser including: experimenting the candidate range of the laser parameters values (hereafter be shorted as candidate ranges), herein the laser parameters include depth-of-focus, q-switch frequency, and laser power; experimenting the optimized parameters selected from an upper bound, a lower bound and a median of the candidate ranges; updating the candidate ranges with the bisection method according the optimized parameters; and repeating the previous step until the distance from the median to the upper or the lower bound is fitted to the smallest resolution of the laser parameters which could be set. A method of optimizing the laser parameters for a pulsed laser and a laser machining apparatus for automatic optimization of laser process parameters are also provided.
Patent TW-201221173-A (TW)
Title: Drug administration system for target therapy and operation method thereof
Inventor: Ma yun-hua
IPC: A61K41/00
Filed: 2010-11-26
Abstract: The present invention provides a drug administration system for target therapy and an operation method thereof. The drug administration system for target therapy according to the present invention comprises a plurality of magnetic particles serving as medicine carrier, a magnetic field generation device and an ultrasonic device. The magnetic field generation device generates a magnetic field to guide the magnetic particles to a target site, while the ultrasonic device forces the magnetic particles to exhibit a suspended condition to increase reaction area and prompt local medicine reactivity so as to achieve the greatest therapeutic effect with less dosage of medicine as the medicine lingers locally.
Patent TW-201137968-A (TW)
Title: Method of manufacturing semiconductor device
Inventor: UDA SHUICHIRO
IPC: H01L21/3065
Filed: 2010-11-30
Abstract: To provide a method of manufacturing a semiconductor device, in which a hole such as a deep hole can be formed in a substrate in a good shape with a high etching speed and a high selection ratio using a photoresist film formed on the substrate as a mask. The method of manufacturing the semiconductor device includes: an installation step of installing the substrate 101 where a photoresist film 102 with an opening 103 is formed in an etching chamber; a first etching step of etching the substrate 101 installed in the etching chamber using a gas containing SiF4and O2 through the photoresist film 102 as a mask; and a second etching step of forming the hole 107 in the substrate 101 by etching the substrate 101 using a gas containing SF6, O2 and HBr right after the first etching step.