baber/WOPTO huggingface dataset:
Patent TW-201401391-A (TW)
Title: Semiconductor device and methods for forming the same
Inventor: LIN JING-CHENG
IPC: H01L21/60
Filed: 2013-06-07
Abstract: A system and method for stacking semiconductor devices in three dimensions is provided. In an embodiment two or more semiconductor dies are attached to a carrier and encapsulated. Connections of the two or more semiconductor dies are exposed, and the two or more semiconductor dies may be thinned to form connections on an opposite side. Additional semiconductor dies may then be placed in either an offset or overhanging position.
Patent TW-201342429-A (TW)
Title: Exposure apparatus, exposure method, and device manufacturing method
Inventor: EBIHARA AKIMITSU
IPC: G03F7/20
Filed: 2004-06-18
Abstract: A hydrostatic pad (32) and a hydrostatic pad (34) hold a wafer (W) and a table (TB) on which the wafer is mounted. The hydrostatic pad (32) maintains the distance between the bearing surface and the wafer (W) in the direction of the optical axis of a projection optical system (PL) at a predetermined value. Further, since the hydrostatic pads, unlike static gas bearings, utilize the static pressure of incompressible fluid (liquid) between the bearing surface and a support object (substrate), the rigidity of the bearing is high and the distance between the bearing surface and the substrate is maintained stable and constant. In addition, liquid (e. g. , pure water) is higher in viscosity than gas (e. g. , air), and is superior in vibration damping compared to gas.; Accordingly, pattern transfer on a wafer (substrate) substantially free from defocus can be achieved, without necessarily having to arrange a focal position detection system.
Patent TW-201409623-A (TW)
Title: Semiconductor package and method of fabricating the same
Inventor: KIM JONG-KOOK
IPC: H01L23/12
Filed: 2013-07-09
Abstract: Provided are a semiconductor package and a method of fabricating the same. The package substrate includes a hole, which may be used to form a mold layer without any void. The mold layer may be partially removed to expose a lower conductive pattern. Accordingly, it is possible to improve routability of solder balls.
Patent TW-201504718-A (TW)
Title: Optoelectronic device
Inventor: LEE TZUNG-YING
IPC: G02F1/1343
Filed: 2013-07-16
Abstract: An optoelectronic device including a first substrate, a second substrate disposed opposite to the first substrate, a display medium disposed between the first substrate and the second substrate, first driving electrodes disposed between the display medium and the first substrate, second driving electrodes disposed between the display medium and the first substrate, common electrodes disposed between the display medium and the second substrate and adjusting electrodes disposed between the display medium and the second substrate is provided. The first driving electrodes and the second driving electrodes are disposed alternately. The common electrodes and the adjusting electrodes are disposed alternately. The common electrodes is electrically insulated from the adjusting electrodes, the first driving electrodes and the second driving electrodes. Normal projections of one of the first driving electrodes, one of the adjusting electrodes and one of the second driving electrodes on the second substrate are arranged between the two adjacent common electrodes sequentially.
Patent TW-201411670-A (TW)
Title: Photoelectric conversion layer composition and photoelectric conversion element
Inventor: FUKUI KAZUHISA
IPC: H01L31/04
Filed: 2013-07-26
Abstract: Provided is a composition that can form a photoelectric conversion layer having superior adhesion to a substrate without requiring a sintering step. The composition is configured from at least a semiconductor (for example, titanium oxide particles) and an ionic polymer (for example, a fluororesin having a sulfo group, or the like) and the fraction of the ionic polymer is 0.1-30 parts by weight for every 1 part by weight of the semiconductor. The composition may further contain a dye (sensitizing dye). A photoelectric conversion layer can be formed without sintering a semiconductor by means of the composition coating a conductive substrate.
Patent TW-201428179-A (TW)
Title: A wind turbine system
Inventor: HASHIMOTO TAKASHI
IPC: F03D1/00
Filed: 2013-07-29
Abstract: A wind turbine system includes a tower, a nacelle which is supported on the tower (10), a plurality of blades (40-42) which are rotatably supported to the nacelle (20) via a hub (30), and a generator (22) which generates electricity by rotating the blades (40-42), wherein in case the tower (10) shifts from vertical direction, the wind turbine system is controlled so that a force with an opposite direction to the tower (10) shifting direction is added by wind.
Patent TW-201418573-A (TW)
Title: CFRP resistive sheet heating
Inventor: CLEMENS CHRISTIAN
IPC: F03D1/00
Filed: 2013-08-06
Abstract: The invention relates to a rotor blade (1) of a wind power installation (100) comprising a heating device (33) for heating the rotor blade (1), arranged in the rotor blade (100) in the area of its rotor blade surface, wherein the heating device (33) has electrically conductive heating wires (2), and the heating wires (2) run in a sinusoidal, wave-like and/or zigzag-shaped way, with an amplitude, defining a sinusoidal amplitude, wave height or respectively spike height, and a wavelength defining a period length, wavelength or respectively a distance between spikes, wherein the amplitude and/or wavelength varies along the heating wires (2) in order to be able to adjust the specific areal heating performance of the heating device (33) for each section.
Patent TW-201511220-A (TW)
Title: LED package structure and a method for manufacturing the same
Inventor: LIN HOU-TE
IPC: H01L33/48
Filed: 2013-08-27
Abstract: A light emitting diode (LED) package structure includes a basic board, a LED chip, and a Zener diode. Both of the LED chip and the Zener diode are disposed on the basic board. The basic board includes an upper surface and a bottom surface opposite to the upper surface. A notch is disposed on the upper surface, and faces to the bottom surface. The LED chip is set on the upper surface of the basic board. The Zener diode is disposed in the notch. A reflection surface is formed in the notch, and lays over the Zener diode. The invention also provide a manufacture method of the LED package structure.
Patent TW-201511552-A (TW)
Title: Camera module and assembling method for same
Inventor: CHEN SHIN-WEN
IPC: H04N5/225
Filed: 2013-09-05
Abstract: The present disclosure relates to a camera module. The camera module includes a substrate, an image sensor electrically connected to the substrate, a lens holder, a lens module received in the lens holder, a transit board, and an anisotropic conductive film (ACF) positioned between the substrate and the transit board. The image sensor includes a sensing surface facing toward the lens module and a number of side surfaces connected to the sensing surface. The lens holder is connected to the substrate and covers the image sensor therein. The transit board and the substrate are electrically and mechanically connected to each other by the ACF. Adhesives are distributed at intersections between the side surfaces, the adhesives connect the side surfaces to the substrate.
Patent TW-201510927-A (TW)
Title: Preloaded dispatching system of passenger vehicle and method thereof
Inventor: Wu jian-zhang
IPC: G06Q50/30
Filed: 2013-09-12
Abstract: The present invention relates to a preloaded dispatching system of passenger vehicle and its method mainly applied to a predetermined assigned instant trip times of the passenger vehicle. The system comprises at least an on-board unit and a vehicle dispatching system. The vehicle dispatching system sends a competition message having riding information regarding passengers who requires a ride to the on-board units of all vehicles carrying passengers on the way. The on-board unit replies the competition message to the vehicle dispatching system, and the vehicle dispatching system selects one of the on-board units of vehicles carrying passengers on the way as a dispatched on-board unit. The dispatched on-board unit sends the dispatching message of predetermined assigned instant trip times after the passengers in the vehicle have arrived on the destination.
Patent TW-201420355-A (TW)
Title: Laminated body, method for separating laminated body, and method for evaluating release layer
Inventor: TAKASE SHINJI
IPC: B32B7/04
Filed: 2013-09-26
Abstract: is laminate (1) is obtained by sequentially laminating, in the following order, a substrate (11), an adhesive layer (14), a separation layer (16) that changes in properties by absorbing light, and a support plate (12). The optical density of the separation layer (16) is set to a value from 0.2 to 1.0 (inclusive). The present invention also comprises: a method for separating the laminate (1), which comprises a step for evaluating the optical density of the separation layer (16); and a method for evaluating a separation layer.
Patent TW-201415036-A (TW)
Title: Compressible pin assembly having frictionlessly connected contact elements
Inventor: CHUI KA-NG
IPC: G01R1/067
Filed: 2013-10-02
Abstract: A compressible contact pin. The contact pin includes a first contact element and a second contact element. A compressible member is coupled between the first contact element and the second contact element to compress when one or more external forces are applied between the first contact element and the second contact element. In addition, the compressible member maintains a separation distance between the first and the second contact elements when no external forces are applied. A deformable conductor is electrically coupled between the first contact element and the second contact element. The deformable conductor maintains the electrical coupling between the first contact element and the second contact element by deforming when the one or more external forces are applied between the first contact element and the second contact element.
Patent TW-201514147-A (TW)
Title: FPR1 antagonist derivatives and use thereof
Inventor: HWANG TSONG-LONG
IPC: C07D209/20
Filed: 2013-10-09
Abstract: Binding of fomyl peptide receptor 1 (FPR1) by N-formyl peptides can induce neutrophil activation and may represent a new therapeutic target in either sterile or septic inflammation. In present application, a series of new dipeptide derivatives as shown general formula (I) is provided. Of these, each of RK and RT is one selected from a group consisting of hydrogen atom, hydroxyl group, C1-C4alkyl, C1-C4alkoxyl and glycin-nitrile amide group; each of RM and RS is one selected from a group consisting of hydrogen atom, hydroxyl group, pyridinyl group, phenyl group, pyridinyl group, C1-C4alkoxyl substitute on the ester group, and a hydroxyl group, halogen group, C1-C4 alkoxyl group, C1-C4 alkyl group substitute on the aromatic ring of benzoyl group. Additionally, the configurations of two amino acids are S and R configurations, respectively.
Patent TW-201520937-A (TW)
Title: Portable device with dynamic merchandise warning module
Inventor: SHU WEN-CHIANG
IPC: G06Q30/06
Filed: 2013-11-19
Abstract: A portable communication device comprises a control unit, a display coupled to the control unit; a merchandise warning module couple to the control unit.
Patent TW-201520973-A (TW)
Title: A method and apparatus for building a three dimension model
Inventor: HUANG SZU-HAO
IPC: G06T17/00
Filed: 2013-11-20
Abstract: The invention relates to a method for building a three dimension model of a physical object. First, depth data of a plurality of images is converted into a plurality of 3D point cloud data. Then, motion parameters of a camera in a location for gathering present image related to another location for gathering previous image is calculated according to the 3D point cloud data. A registration energy value is calculated when the 3D point cloud data of the present image is orientated to that of the previous image according to corresponding motion parameters for the camera gathering the present image. Next, motion parameters are varied to minimize the registration energy value. Then, a camera path is determined according to the motion parameters that minimize the registration energy value. A 3D image of the physical object is built according to the camera path.
Patent TW-201521529-A (TW)
Title: Mounting apparatus for SMT component
Inventor: TIEN CHUN-YUAN
IPC: H05K3/32
Filed: 2013-11-21
Abstract: A mounting apparatus includes an insulating base, two opposite resilient metal plates, and two metal welding portions. The resilient metal plates are mounted to the top of the base, for sandwiching and electrically connected to a SMT component. Bottoms of the resilient metal plates extend into the base. The metal welding portions are mounted to the bottom of the base. Tops of the metal welding portions extend into the base, and are respectively connected to the resilient metal plates.
Patent TW-201521660-A (TW)
Title: Universal joystick device
Inventor: LIN MING-YUAN
IPC: A61B1/00
Filed: 2013-12-03
Abstract: The present invention relates to a universal joystick device, which comprises a fixing base and a joystick penetratingly disposed in the fixing base. The joystick is pivotally connected to the fixing base via a dual-pivot assembly disposed in the fixing base. Furthermore, a direction control plate is connected to a bottom end of the joystick. The direction control plate has four cable fixing parts at the periphery. Each cable fixing part has a fixing hole with an axial direction perpendicular to the axial direction of the joystick. Accordingly, the joystick can drive the direction control plate to perform swinging respectively along an X-axis and a Y-axis through the dual-pivot-axle assembly.
Patent TW-201520164-A (TW)
Title: A method of making nanoscale microstructure
Inventor: JIN YUAN-HAO
IPC: C01B31/02
Filed: 2013-12-06
Abstract: The invention relates to a method of making nanoscale microstructure. The method includes following steps: providing a carbon nanotube structure; suspending the carbon nanotube structure, and setting a pre-coated layer on the surface of carbon nanotube structure to obtain a carbon nanotube compound structure, and a thickness of the pre-coated layer being about 2nm~10nm; transferring the carbon nanotube compound structure onto a surface of a substrate, and attaching the carbon nanotube structure on the surface of the substrate by treating the carbon nanotube compound structure with a solvent; removing the carbon nanotube structure by annealing the carbon nanotube compound structure under a temperature of 500 DEG C ~700 DEG C in air. The pre-coated layer is melted, forming a number of microstructures on the substrate by shrinking the melting pre-coated layer, and the number of microstructures are spaced from each other.
Patent TW-201439236-A (TW)
Title: Antimicrobial and antiviral composition, and method of producing the same
Inventor: LI DING
IPC: B01J21/06
Filed: 2013-12-10
Abstract: An antimicrobial and antiviral composition, a method of producing the same, and the like are provided, which are capable of exhibiting excellent antimicrobial and antiviral properties for a long time through various uses. The antimicrobial and antiviral material includes cuprous oxide particles and a silica-coating layer on at least one part of the surface of the cuprous oxide particles, in which the content of the silica-coating layer is 5 to 20 parts by mass based on 100 parts by mass of the cuprous oxide particles, and the BET specific surface area of the cuprous oxide particles coated with silica is 5 to 100 m<SP>2</SP>/g.
Patent TW-201526760-A (TW)
Title: Structure enhancement method for bearing plate
Inventor: YANG CHUN-YING
IPC: H05K7/14
Filed: 2013-12-17
Abstract: A structure enhancement method for bearing plate includes forming a semi-shearing structure in the bearing plate. The bearing plate has a bearing surface. The semi-shearing structure is over the bearing surface. Then, respectively form a long convex hull at the opposite two first sides and opposite two sides of the semi-shearing structure. The two long convex hulls are over the bearing surface. Then, level down the semi-shearing structure and two long convex hulls at the same time, and let the bearing surface become a flat.
Patent TW-201526131-A (TW)
Title: Image critical dimension measurement calibration method and system
Inventor: CAI ZONG-LONG
IPC: H01L21/66
Filed: 2013-12-24
Abstract: Disclosed is an image critical dimension measurement calibration method. Preset pitch dimension value existing in an image is used as standard to carry out calibration for critical dimension measurement value of target pattern image to be measured or corrected existing in the same image or calculation of critical dimension for dimension of the target image so as to exclude distortion problem of critical dimension measurement result caused by error from a measurement machine per se (such as power-magnifying error) in measurement process; in addition, the invention also simultaneously provides a system for carrying out the image critical dimension measurement calibration method.
Patent TW-201511213-A (TW)
Title: Semiconductor device and method of manufacturing the same
Inventor: KAWASAKI KAZUSHIGE
IPC: H01L25/04
Filed: 2013-12-26
Abstract: According to one embodiment, a semiconductor device includes a metal plate, a plurality of semiconductor chips, an insulation layer, a wiring layer, external connection terminals and a sealing resin portion. The metal plate includes a first surface and the plurality of semiconductor chips are laminated on a second surface of the metal plate. The insulation layer and the wiring layer are provided on the semiconductor chips. The external connection terminals are provided on the insulation layer and the wiring layer. The sealing resin portion seals the plurality of semiconductor chips while exposing the first surface of the metal plate. At least one pair of opposing outer peripheral surfaces of the metal plate are covered with the sealing resin portion.
Patent TW-201439184-A (TW)
Title: Fine resist pattern-forming composition and pattern forming method using the same
Inventor: YAMAMOTO KAZUMA
IPC: C08L39/02
Filed: 2014-02-25
Abstract: To provide a composition which can form a fine negative photoresist pattern which does not have problems of surface roughness, bridge defects, lack of resolution, etc., and to provide a pattern forming method using same. Given a negative resist pattern formed using a chemically amplified resist composition, this fine pattern-forming composition is used to make a pattern finer by being applied to the negative resist pattern to thicken the resist pattern. This composition contains a solvent, and a polymer mixture or polymer including an amino group in the repeating unit, and further either contains a specific amount of acid, or exhibits a specific pH. Further, the polymer mixture contains multiple polymers having a 3 or greater HSP distance determined from the Hansen solubility parameters. This composition is coated onto a negative photoresist pattern obtained by developing with an organic solvent developer and is heated, thereby forming a fine pattern.
Patent TW-201533025-A (TW)
Title: Method for preparing piperidine with various substituents
Inventor: SHIH KAE-SHYANG
IPC: C07D211/02
Filed: 2014-02-27
Abstract: The present invention is related to a method for preparing a formula 1, formula 1 formula 2 comprising: hydrogenating a formula 2, wherein the R is COOR1 or R2-OH, wherein the R1 is CnH2n+1, the R2 is CnH2n and n=1-6.
Patent TW-201505656-A (TW)
Title: Antibiotic conjugates directly linked with steroid drugs
Inventor: CHOW KEN
IPC: A61K31/573
Filed: 2014-03-10
Abstract: The present invention describes novel single drug entities, formed by direct linkage of an antibiotic to a steroidal drug. Upon topical application to the eye, the conjugate would undergo enzymatic and/or hydrolytic cleavage to release the individual drugs. The antibiotic is coupled directly to the steroid drug.
Patent TW-201537718-A (TW)
Title: Chip structure with coaxial multi-core TSV amd method for manufacturing the same
Inventor: CHOU CHIEN-WEI
IPC: H01L21/58
Filed: 2014-03-24
Abstract: Disclosed is a chip structure with coaxial multi-core TSV. Disposed on an active surface of a semiconductor base are a plurality of surface conductor layers. And, disposed on an back surface of the semiconductor base are a plurality of backside conductor layers. An axial post and a coaxial hollow pipe are disposed in a through hole penetrating through the semiconductor base. Both are insulated by specific insulation layers and the coaxial hollow pipe is fully covered. Each of the two extruded ends of the axial post is respectively connected with a connecting pad. The length of the coaxial hollow pipe is smaller than the one of the axial post, so that the upper and lower connecting pads are insulated from the coaxial hollow pipe and its connected circuit patterns. Accordingly, multiple signals can be used through a same TSV without the issue of current leakage so as to reduce TSV disposition amount.
Patent TW-201538824-A (TW)
Title: Centrifugal pretension pre-stressed concrete foundation pile having exhaust function and construction method thereof
Inventor: LI SHENG-NAN
IPC: E02D5/24
Filed: 2014-04-07
Abstract: A centrifugal pretension pre-stressed concrete foundation pile having exhaust function and its construction method comprise a top cover having a cover body and a through hole passing through the cover body, a surrounding wall downwardly extended from the periphery of the cover body and incorporating with the cover body to define a containing space, a partition disposed in the containing space and having a plate body and a piercing hole penetrating the plate body, and a movable tube passing through the through hole and the piercing hole to penetrate the top cover and the partition. The partition divides the containing space into an upper containing portion between the top cover and the partition and a lower containing portion located below the upper containing portion. While burying the pre-stressed concrete foundation pile, concrete slurry would fill in the lower containing portion to exhaust air from the movable tube to ensure so that the pre-stressed concrete foundation pile can be stably buried at the designed depth.
Patent TW-201539415-A (TW)
Title: Pixel driving circuit
Inventor: LIU LI-WEI
IPC: G09G3/3233
Filed: 2014-04-09
Abstract: A pixel driving circuit includes a Light Emitting Diode (LED), a data writing unit, a first transistor, a second transistor, a first compensation unit and a second compensation unit. The gate of the first transistor is electrically coupled to the data writing unit for determining the current flow of the LED. The first compensation unit is electrically coupled to the first transistor for providing a path of current flow from the gate of the first transistor to a first voltage source at initial period and a path of current flow from the gate of the first transistor to a second voltage source. The second compensation unit includes a first capacitor electrically coupled to the gate of the first transistor for voltage coupling and providing a differential voltage that equals to the LED to the gate of the first transistor. The second transistor is electrically coupled between the first voltage source and a second voltage source for enabling or disabling the current flow between the first voltage source and the second voltage source.