Patent EP-3244215-A1 (EP)
Inventor: ALEKSEEV ALEXANDR MIHAYLOVICH
IPC: G01Q30/20
Filed: 2015-07-10
Abstract: The scanning probe microscope combined with a device for modifying the surface of an object relates to measuring devices, particularly devices for monitoring objects using probes after nano-cutting and for investigating the structures of macro and micro-carriers under low temperature conditions. 
       The object of the invention  is to expand the functional capabilities of the scanning probe microscope combined with a device for modification of the object surface. 
       Technical result of the invention  is increased image quality. 
     The essence of the invention is resumed like that: a scanning probe microscope combined with a device for modification of the object surface comprising a foundation 1, onto which a punch module 2 with a punch 3 having a first cutting edge 4 and an adjacent first surface 5, said punch module 2 having a first drive 8 at a first X-axis point and a second drive 9 at a second Y-axis point, also comprising a platform 10 installed on the foundation 1, movable along a third Z-axis point and coupled with a third drive 11 at the third Z-axis point, said point being orthogonal to the plane of XY axes points, also comprising a piezo-scanner 15 movable along the X,Y and Z axes points with a holder 16 with an object carrier 17 containing an object 18, said piezo-scanner 15 fastened to the platform 10, and the punch 3 arranged so as to be able to interact with the object 18, also comprising a probe unit 25 with a probe holder 26 to which a probe 27 is fastened, said probe unit 25 fastened to the platform 10 and movable along the first X-axis point and coupled with a fourth drive 30 at the first X-axis point, while the probe 27 is able to interact with the object 18, said microscope includes a first module for mechanical action 35, fastened to the platform 10 so as to be able to interact with the punch 3. There are following options of arrangement of its components: 
• option 1 - the first module for mechanical action is installed so as to be able to interact with the first cutting edge of the punch; 
• option 2 - the first module for mechanical action is installed so as to be able to interact with the first surface of the punch; 
• option 3 - the first module for mechanical action is installed so as to be able to interact with the first cutting edge and the first surface of the punch; 
• option 4 - at least one second module for mechanical action is introduced, said module installed on the platform so as to be able to interact with an object module; 
• option 5 - the second module for mechanical action is installed so as to be able to interact with the object; 
• option 6 - the second module for mechanical action is installed so as to be able to interact with the object carrier; 
• option 7 - the second module for mechanical action is made of flexible material and installed so as to be able to interact with the piezo-scanner; 
• option 8 - the first module for mechanical action includes a first heating unit; 
• option 9 - the first module for mechanical action includes a first piezo-module; 
• option 10 - the first module for mechanical action includes a second cutting edge; 
• option 11 - the first module for mechanical action includes a sharpened point; 
• option 12 - the first module for mechanical action includes an area having a rough surface; 
• option 13 - the second module for mechanical action includes a second heating unit. 
• option 14 - the second module for mechanical action includes a second piezo-module. 
• option 15 - it is introduced a piezo unit fastened to the probe unit, onto which a probe holder is installed. 
• option 16 - the piezo-unit is arranged so as to be able to move along the first X-axis point and the third Z-axis point. 
• option 17 - the piezo-unit is arranged so as to be able to move along the first X-axis point and the second Y-axis point. 
• option 18 - the piezo-unit is arranged so as to be able to move along the first X-axis point, the second Y-axis point and the third Z-axis point. 
• option 19 - the foundation with all components is placed in a cryo chamber. 
     Such arrangement improves a quality of the image quality and expands the functionality of the device.