baber/WOPTO huggingface dataset:
Patent JP-2011089857-A (JP)
Title: Testing device, adjustment method, board for calibration, adjusting device, and program
Inventor: HABU MASAHIRO
IPC: G01R31/28
Filed: 2009-10-21
Abstract: <P>PROBLEM TO BE SOLVED: To solve the problem wherein mount work time of a board for calibration, and expenses, and the like of a board for calibration increase and hence test costs rise.  <P>SOLUTION: A testing device for testing a device to be tested includes a plurality of terminal groups each including a plurality of drivers that partially include a common driver where a reference phase of a signal to be output is common to that of other drivers and supply a signal to the device to be tested, an intragroup adjustment section for mutually bringing closer respective reference phases of a plurality of drivers that the terminal group includes for each of the plurality of terminal groups, and an intergroup adjustment section for bringing closer the respective reference phases of a plurality of drivers among a plurality of terminal groups, based on a difference in the reference phases among common drivers that the plurality of terminal groups include each.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010132880-A (JP)
Title: Resin composition, reflector and light-emitting device
Inventor: MATSUMI YASUO
IPC: H01L33/60
Filed: 2009-10-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a resin composition suitable as a material of a reflector having high reflectance and having high heat resistance sufficiently prevented from the occurrence of abnormality in appearance even if processed under high temperature.  <P>SOLUTION: A titanium oxide filler is used which satisfies the formulae (I) and (II): A≥0.1 and A/B<SP>2</SP>≤25, respectively, wherein A (wt.%) is the content of aluminum contained in the titanium oxide filler in terms of the content of aluminum oxide; and B (μm) is the volume average particle size of the titanium oxide filler. The titanium oxide filler is blended with a liquid crystal polyester to form the resin composition.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011088259-A (JP)
Title: Cutting blade and cutter
Inventor: NAGAZOE TORU
IPC: B23D21/08
Filed: 2009-10-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a cutting blade and a cutter capable of cutting a pipe-shaped material to be cut so that a cutting surface may be a substantially completely flat surface and saving resources by reducing cutting man-hours and reducing portions to be abandoned in a cutting process.  <P>SOLUTION: This cutting blade 1 includes two circular-shaped end faces 5a and 5b. When the cutting blade 1 is viewed from a side surface, that is, a direction perpendicular to a line for connecting the end face 5a and the end face 5b, the end face 5a and the end face 5b are the flat surfaces parallel to each other. In a region held by the end face 5a and the end face 5b, an inclined surface 6a is provided so that thickness close to a center part 21 of a substrate 2 may be thicker from an outer peripheral end 20a of the end face 5a toward the center part 21 of the substrate 2, while an inclined surface 6b is provided so that thickness close to the center part 21 of the substrate 2 may be thicker from an outer peripheral end 20b of the end face 5b toward the center part 21 of the substrate 2.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010028144-A (JP)
Title: Semiconductor apparatus and method for manufacturing the same
Inventor: WATANABE KENICHI
IPC: H01L23/52
Filed: 2009-11-02
Abstract: <P>PROBLEM TO BE SOLVED: To prevent stress from tiltingly concentrating to a connecting hole when the inside stress is generated in a pad region, to avoid wiring function deterioration caused by the stress concentration, and to reduce a dishing amount and an erosion amount in CMP when lattice shape wiring is rendered to be an object surface of CMP.  <P>SOLUTION: Filling density of first connecting holes formed on a low permittivity insulating membrane in the pad region is higher than filling density of second connecting holes in a device region. Over the low permittivity insulating membrane in the pad region is formed the lattice shape wiring to electrically connect the device region with outside. The lattice shape wiring is formed by forming a lattice shape wiring groove pattern on a low permittivity insulating membrane formed again over the low permittivity insulating membrane in the pad region, and embedding wiring material in the wiring groove pattern. The first connecting hole and the lattice shape wiring are formed by the Dual Damascene method.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011098513-A (JP)
Title: Mold and method for molding elastic roller
Inventor: NAKAOKA KENGO
IPC: B29C33/58
Filed: 2009-11-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a mold for molding an elastic roller, which maintains good peelability on demolding over a long period.  <P>SOLUTION: The elastic roller molding mold includes a mother mold 2 with an upper-end opening, a lower-end opening and a cylindrical inner space, a first piece 3 attached to the upper-end opening of the mother mold 2 and holding the upper end of a core material 8 arranged in the inner space of the mother mold 2, and a second piece 4 attached to the lower-end opening of the mother mold 2 and holding the lower end of the core material 8. When the first piece 3 is attached to the upper-end opening of the mother mold 2, a first clearance 7a and a first contact surface 6a are formed sequentially in the circumferential direction of the mother mold 2 between the first piece 3 and the mother mold 2. When the second piece 4 is attached to the lower-end opening of the mother mold 2, a second clearance 7b and a second contact surface 6b are formed sequentially in the circumferential direction of the mother mold 2 between the second piece 4 and the mother mold 2. The mold has release films at least on surfaces constituting the inner space, the first clearance and the second clearance.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011099264-A (JP)
Title: Casing pulling-out apparatus
Inventor: TAKAYAMA KIMIO
IPC: E02D9/02
Filed: 2009-11-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a casing pulling-out apparatus capable of safely pulling out a casing while avoiding the action of an excessive bending load on a hydraulic cylinder even when the casing is firmly stuck into a pile hole.  <P>SOLUTION: The casing pulling-out apparatus includes a level horizontal frame 10 located directly above the casing 102 buried underground with the upper part projected from the ground surface G, and connectable to a crane; cylindrical vertical frames 19 extended downward at both right and left ends of the horizontal frame; bases 21 having cylindrical guide parts 22 fitted in a vertically slidable manner to the vertical frames 19 on both right and left end sides of the horizontal frame 10 while the lower ends of the bases 21 are installed on the ground surface G; hydraulic cylinders 31 with the upper ends connected in a swingable manner to the horizontal frame 10 on both right and left end sides of the horizontal frame 10 and with the lower ends connected to the bases 21 to vertically drive the horizontal frame 10 and the vertical frames 19 with respect to the bases 21 by expansion; and hanging implements 61 held to the horizontal frame 10 and connectable to the upper end of the casing projected from the ground surface G.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011108428-A (JP)
Title: Lighting system
Inventor: HAMA KATSUNORI
IPC: F21V33/00
Filed: 2009-11-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a lighting system, for illuminating a use area on the desk of each seated user, and capable of both saving power and improving efficiency of a user's work or study, in one provided for a desk system installed at an office or the like premised on personal lighting not using a ceiling luminaire for brightening a whole room.  <P>SOLUTION: A support stand frame 3 is vertically attached at a rear part of a using area of the desk 1, where task lighting 4 illuminating downward is mounted in a middle position and ambient lighting 5 is mounted in an upper position of the support stand frame. Further, a panel lighting 6 emitting plane light is almost perpendicularly mounted at a lower part of the support stand frame, and each lighting is enabled to be independently dimmed. Light sources adjustable in illuminance and color temperature are used for the task lighting, the ambient lighting and the panel lighting.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011108814-A (JP)
Title: Method of bonding surface mounting electronic component, and electronic device
Inventor: MATSUMOTO IKUTOSHI
IPC: H05K3/34
Filed: 2009-11-17
Abstract: <P>PROBLEM TO BE SOLVED: To prevent solder from leaking from a through hole for heat dissipation.  <P>SOLUTION: A method of bonding an electronic component 12 with an electrode 12a for heat dissipation to a printed wiring board 14 where the through hole 16 for heat dissipation is formed includes the processes of: applying cream solder to a through-hole outer region excluding the through hole for heat dissipation and its periphery, the printed wiring board including a pad 14a for heat dissipation on its first surface 14c, and the through hole for heat dissipation being formed, as a hole portion penetrating the printed wiring board, from an upper surface of the pad for heat dissipation to a second surface 14d opposed to the first surface 14c; applying an adhesive 20 for reflow to the through-hole region; and mounting the electronic component on the printed wiring board with the electrode for heat dissipation positioned at the pad for heat dissipation, soldering the electronic component to the printed wiring board by a reflow of the cream solder, and curing the adhesive for reflow.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011107444-A (JP)
Title: Optical element module and method for manufacturing the same
Inventor: OZAWA ATSUSHI
IPC: G02B6/42
Filed: 2009-11-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide an optical element module that does not cause detachment or breakage of an optical fiber during deformation of a casing due to a change in use environmental temperature.  <P>SOLUTION: The optical element module includes: the casing which is a box type body with rising sidewalls from the bottom surface and on which at least one opening is formed on the sidewalls; an optical element arranged inside the casing; and the optical fiber which is optically connected to the optical element and inputs/outputs light with outside of the casing through the opening, the optical fiber being coupled and fixed by the optical fiber fixing part of the optical element and the opening. The optical fiber is constituted of: a first straight line with a predetermined length from the optical fiber fixing part to the sidewall direction of the casing; a second straight line with a predetermined length from the casing opening to inside of the casing at a position not on the same straight line as the first straight line; and connections including at least one curved portion connecting the first straight line and the second straight line.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011109030-A (JP)
Title: Method of manufacturing optical semiconductor integrated element
Inventor: TOMABECHI SHUICHI
IPC: G02B6/13
Filed: 2009-11-20
Abstract: <P>PROBLEM TO BE SOLVED: To improve the yield when an optical semiconductor integrated circuit is manufactured, which has element portions including a semiconductor layer containing Al and As, butt-joined to an optical waveguide portion having an oblique optical waveguide.  <P>SOLUTION: A method of manufacturing the optical semiconductor integrated element includes the process of: growing a first semiconductor laminate structure for forming the oblique optical waveguide 54 above a semiconductor substrate; forming a mask 13 for butt-joint growth on the first semiconductor laminate structure; removing the first semiconductor laminate structure using a mask 13 as an etching mask; and subjecting a second semiconductor laminate structure including a second semiconductor layer containing Al and As to butt-joint growth using the mask 13, the mask 13 having a plane shape such that a plurality of rectangular parts 13A to 13G defined only with straight lines parallel with a light propagation direction and straight lines orthogonal thereto are joined along a region forming the oblique optical waveguide 54.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011110142-A (JP)
Title: Pachinko game system and pachinko machine
Inventor: OURA MUTSUYUKI
IPC: A63F7/02
Filed: 2009-11-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a Pachinko machine preventing various fraudulent maneuvers on nails and generators on a play area by inserting foreign matter into a game ball outlet by setting a guide member to directly guide game balls put out of a pay-out device into a game ball feeding tray to eliminate the game ball outlet present on a Pachinko machine body side for discharging game balls into the game ball feeding tray.  <P>SOLUTION: The Pachinko machine 1 in the Pachinko game system including a card ball-dispenser 31 includes the game ball guide member 38 coupled to a prize ball pay-out device 17 and penetrating the front/rear of the card inserting ball dispenser 31 to project from the rear side to the front side of the Pachinko machine 1. The game ball guide member 38 directly guides game balls paid out of the prize ball pay-out device 17 from the rear side to the front side of the Pachinko machine1 to be discharged from the prize ball pay-out device 17 into an upper tray 7.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011113249-A (JP)
Title: Portable electronic equipment
Inventor: EBIHARA MUNETAKE
IPC: G06K19/07
Filed: 2009-11-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide portable electronic equipment capable of adjusting the thickness of a terminal by a simple constitution.  <P>SOLUTION: A memory card 1 includes: a casing formed in a card shape so as to be foldable; the terminal 3 where a card-side terminal 7 electrically connectable to the terminal of the connection section of equipment to be connected is formed; and an electronic circuit that is formed in the casing and can make information communicated with external electronic equipment by the card-side terminal 7 of the terminal 3. The thickness of the terminal 3 is formed to be smaller than a thickness adapted to the connection section of equipment to be connected, and is made to be a thickness adapted to the connection section of the equipment to be connected by folding the casing and overlapping a plurality of portions.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011110647-A (JP)
Title: Stapler with staple needle removing punch
Inventor: MAEDA KATSUMI
IPC: B25C5/02
Filed: 2009-11-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a stapler with a staple needle removing punch, usable for multipurpose use.  <P>SOLUTION: Among an upper cover 2 and a lower cover 3 vertically turnable with a connecting shaft 14 as a fulcrum, the upper cover 2 includes a moving part 25 for longitudinally sliding with a needle holder 4 for storing a staple needle 5, a needle pushing piece 6 and a needle pushing-out plate 9, a stopper 22 interlocking with this part, and a punch blade 16 projected on an under surface of the needle holder 4. The lower cover 3 includes a needle bending groove 13, a punch hole 17 and a paper stopper 21 integral with a switching lever 19. The paper stopper 21 is positioned in front of the punch hole 17 by the switching lever 19 when fastening the stapler, and the moving part 25 is moved backward by abutting on the moving part 25 by moving backward by the switching lever 19 when extracting a punch, and the stopper 22 integral with the paper stopper is moved to a position for prohibiting stapler fastening operation.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011111542-A (JP)
Title: Water-based coating composition
Inventor: TAKAHASHI HIROKO
IPC: C09D133/14
Filed: 2009-11-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a water-based coating composition having an excellent anticorrosion property, adhesion, yellowing resistance at high temperatures, and blocking resistance during storage.  <P>SOLUTION: The water-based coating composition includes a copolymer obtained from (A) methyl methacrylate; (B) a carboxy-containing monomer represented by chemical formula (1): CH<SB>2</SB>=C(R1)COOCH<SB>2</SB>CH<SB>2</SB>OOC(R2)COOH (wherein, R1 represents H or CH<SB>3</SB>; and R2 represents 1-10C aliphatic or cycloaliphatic); and (C) other monomers. The water-based coating composition comprises the copolymer containing, based on 100 pts.wt. of (A), 1-40 pts.wt. of (B), and 0-35 pts.wt. of (C) as an essential component.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011110001-A (JP)
Title: Method for producing container-packaged processed food of baked boiled rice
Inventor: WATANABE SATOE
IPC: A23L7/10
Filed: 2009-11-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for producing a container-packaged processed food of baked boiled rice, having a texture with proper hardness without softening the rice even in sauce.  <P>SOLUTION: The method for producing the container-packaged processed food of the baked boiled rice includes heat-treating washed rice or wash-free rice as it is with water to provide a heat-treated rice having 55-65% of a water content, quickly cooling the heat-treated rice in the water so as to have a material temperature of ≤45°C, mixing the cooled rice with the sauce at ≥70°C, packaging the mixed rice in the container, and baking the packaged rice.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011119878-A (JP)
Title: Image processor, and image processing method
Inventor: FUJIMOTO YASUNARI
IPC: B41J2/485
Filed: 2009-12-01
Abstract: <P>PROBLEM TO BE SOLVED: To suppress deterioration of image quality to occur because of thinning non-edge parts of characters/line drawing at a uniform thinning rate without depending on the color and size of the characters/line drawing.  <P>SOLUTION: The thinning rate for thinning data of the non-edge parts of characters/line drawing is set according to the color and size of the characters/line drawing. Thus, since it becomes possible to set the thinning rate optimal to the color and size of the characters/line drawing, a high quality image with sufficient density of the non-edge parts can be obtained without depending on the color and size of the characters/line drawing.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011118082-A (JP)
Title: Electrooptic device and electronic equipment
Inventor: YAMADA TADASHI
IPC: G09F9/00
Filed: 2009-12-02
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electrooptic device and electronic equipment which are downsized by bending.  <P>SOLUTION: An electrooptic device 100 is equipped with: a substrate 1 having flexibility; and an electrooptic panel 10 which is provided on the substrate 1 and has a light emission region 9 as an element region having a plurality of electrooptic elements and a circuit region 6 including at least one part of the drive circuit driving the electrooptic element. A bending region B1 having a wiring 40 connecting the electrooptic element and the drive circuit is provided between the light emission region 9 and the circuit region 6.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010157709-A (JP)
Title: Printed wiring board and method for manufacturing the same
Inventor: NAGATA HIROYASU
IPC: H05K3/46
Filed: 2009-12-02
Abstract: <P>PROBLEM TO BE SOLVED: To provide a printed wiring board of high quality and a method for manufacturing the same.  <P>SOLUTION: A chip capacitor 20 is mounted on an adhesive sheet based upon an alignment mark formed on the adhesive sheet. Based upon the alignment mark of the adhesive sheet and an alignment mark 112b formed on a rigid base 100, the rigid base 100 is mounted on the adhesive sheet, and the chip capacitor 20 is put in an opening 100a formed in the rigid base 100, and fixed using a filling resin 100b. Then resin insulating layers 131 and 132 are respectively formed on both principal surfaces of the rigid base 100, and a through hole 140 is formed after that. Conductor patterns 113 and 114 are respectively formed on the resin insulating layers 131 and 132, via conductors 121 and 122 are respectively formed in the resin insulating layers 131 and 132, and a through hole conductor 141 is formed to connect the conductor patterns 113 and 114 to each other.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010221696-A (JP)
Title: Method for manufacturing inkjet head
Inventor: KIM JAE-SUNG
IPC: B41J2/16
Filed: 2009-12-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an inkjet head capable of reducing crosstalk by separating each piezo electric element which forms a drive portion.  <P>SOLUTION: The method for manufacturing an inkjet head in which a plurality of chambers for receiving inks is formed includes steps of: forming separation grooves at one side of a piezo electric element so that one side of the piezo electric element is divided corresponding to positions of chambers; forming alignment grooves so that the other side of the piezo electric element is divided corresponding to the positions of the separation grooves; arranging the piezo electric element at one side of the inkjet head in which the chambers are formed so that the alignment grooves are arranged corresponding to the positions of the chambers; joining one side of the piezo electric element to one side of the inkjet head; and separating the piezo electric element so that the separation grooves are exposed.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011121400-A (JP)
Title: Front part vehicle body structure for automobile
Inventor: ANDO YASUYUKI
IPC: B62D25/10
Filed: 2009-12-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide a front part vehicle body structure for an automobile capable of enlarging a deformation area of an engine hood at collision with a pedestrian.  <P>SOLUTION: The front part vehicle body structure 1 for the automobile includes the engine hood 2 openably/closably mounted to a vehicle body; a striker 32 provided on a front part of the engine hood and engaging the engine hood with the vehicle body; and a latch 30 provided at a vehicle body side and engageable with the striker 32. The striker 32 includes a mounting part 32a for mounting the striker 32 to the engine hood 2; and an engagement part 32d engaged with the latch 30 in order to engage the engine hood 2 with the vehicle body side. The mounting part of the striker 32 is provided at a rear position in a vehicle body longitudinal direction than the latch 30 so as to allow deformation of the engine hood 2 at the front side than the mounting part.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011122017-A (JP)
Title: Backfill grouting material
Inventor: IRIDE TAKUMI
IPC: C09K17/12
Filed: 2009-12-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a two-pack type backfill grouting material by which shrinkage of a consolidated body is prevented and long-term strength and dimensional stability of the consolidated body is high and of which bleeding of a liquid A is suppressed.  <P>SOLUTION: The two-pack type backfill grouting material comprises: a liquid A containing a curing material, a thickening solid-liquid separation suppressing material, a hardening retarder, and water; and a liquid B comprising sodium silicate. The composition ratio of the thickening solid-liquid separation suppressing material is obtained by mixing 35-500 mass% of particle size-regulated powders of raw sludge incinerated ash with bentonite.  <P>COPYRIGHT: (C)2011,JPO&INPIT