baber/WOPTO huggingface dataset:
Patent JP-2017149915-A (JP)
Title: Fixing structure of exothermic member and heater
Inventor: MASUI NOBUTOSHI
IPC: C09J7/00
Filed: 2016-02-26
Abstract: PROBLEM TO BE SOLVED: To provide a fixing structure of a heater line suitable when arranging the heater line in a center of a narrow location, excellent in uniformity of fixing strength and temperature distribution and capable of being obtained by a simple method and a heater using the fixing structure.SOLUTION: A heater line is covered by holding a double sided adhesive member at a holding line along a length direction of the heater line when the heater line is arranged and fixed on the double sided adhesive member and an area where adhesive surfaces of the double sided adhesive member are laminated each other on both sides of the heater line.SELECTED DRAWING: Figure 2
Patent JP-2017155789-A (JP)
Title: Transmission case
Inventor: OKUBO MITSUHIDE
IPC: F16D65/00
Filed: 2016-02-29
Abstract: PROBLEM TO BE SOLVED: To provide a transmission case which can reduce a drag loss in a brake.SOLUTION: A circumferential face 121 surrounding a periphery of an output shaft 42 is formed at a transmission case 101 (second case 103), and spline grooves 122 for spline-fitting a brake plate 123 are formed at a portion in which a brake B1 at the circumferential face 121 is arranged while being aligned in a peripheral direction. A spline groove 122A being one of the spline grooves 122 has an oil discharge hole 125, and oil (lubricant) which is supplied to the brake B1 portion is discharged toward an oil pan 126 which opposes a vertical direction from below with respect to the oil discharge hole 125 via the oil discharge hole 125.SELECTED DRAWING: Figure 2
Patent JP-2017154203-A (JP)
Title: Outlet opening/closing apparatus of rotary main spindle
Inventor: TANIMURA MITSUNORI
IPC: F16N29/00
Filed: 2016-03-01
Abstract: PROBLEM TO BE SOLVED: To provide an outlet opening/closing apparatus of a rotary main spindle, capable of preventing an outlet from becoming an entry port of foreign objects such as chips even when the outlet is turned upward accompanying rotation of the main spindle.SOLUTION: In an initial rotation state where a main spindle 3 starts rotation from a vertical posture, a shutter 21 rotates around the axis of the main spindle 3 with respect to the main spindle 3 through engagement of a rear engaging part 25 with an engaging projection 22. Thus, a front through-hole 26 is shifted from the opening of an outlet passage 10 moved relatively upward due to the rotation, and the opening of an outlet passage 10 moved relatively upward is closed. Further, in the rotated state of the main spindle 3, the shutter 21 is rotated integrally with the main spindle 3 through disengagement of the rear engaging part 25 from the engaging projection 22, and thus a state where the opening of the outlet passage 10 moved relatively upward is closed is maintained.SELECTED DRAWING: Figure 6
Patent JP-2017156561-A (JP)
Title: Image forming apparatus
Inventor: HABA KAZUKI
IPC: G03G15/20
Filed: 2016-03-02
Abstract: PROBLEM TO BE SOLVED: To provide an image forming apparatus that can prevent blocking and achieve noise reduction and energy saving.SOLUTION: There is provided an image forming apparatus comprising: cooling means that directly or indirectly cools a recording medium carrying an image; and control means that controls the cooling means, where the control means controls cooling performance on the basis of the total amount of the image carried on the recording medium.SELECTED DRAWING: Figure 7
Patent JP-2016105330-A (JP)
Title: Control controller and programming method of the same
Inventor: HARA NAOKI
IPC: G05B19/05
Filed: 2016-03-04
Abstract: PROBLEM TO BE SOLVED: To provide a control controller 10 for describing by a ladder program and executing a sequence of loop control comprising input processing, control arithmetic processing, and output processing.SOLUTION: A control controller 10 includes a sequence processor 1, an arithmetic processor 2, and a memory 3. The memory 3 includes a ladder program 4 and a loop control program 6. The ladder program 4 is composed of a combination of instructions and operands. The sequence processor 1 sequentially reads the ladder program 4. If an instruction of the ladder program 4 is a sequence instruction, the sequence processor 1 executes the sequence instruction. If an instruction of the ladder program 4 is a loop instruction, the sequence processor outputs loop instruction information and also transfers an execution right to the arithmetic processor 2. The arithmetic processor 2 executes the loop control program. The loop instruction includes an operand for the loop instruction that can define at least input processing, control arithmetic processing, and output processing.SELECTED DRAWING: Figure 1
Patent JP-2017163260-A (JP)
Title: Imaging control device
Inventor: HOSOKAWA JUNICHI
IPC: H04N5/355
Filed: 2016-03-08
Abstract: PROBLEM TO BE SOLVED: To achieve high-sensitivity while suppressing deterioration of a SNR.SOLUTION: According to an embodiment, an imaging control device includes a liner/non-liner conversion circuit, a non-liner digital gain circuit, a luminance calculation circuit, and a sensitivity control part. The liner/non-liner conversion circuit forms a first non-liner pixel signal with more bit numbers than a second liner pixel signal by applying a liner/non-liner conversion of a 1:1 input output to the second liner pixel signal on the basis of a first liner pixel signal formed by an analog pixel part. The non-liner digital gain circuit multiples a non-liner digital gain to the first non-liner pixel signal, and thereby acquires a second non-liner pixel signal. The luminance calculation circuit calculates a luminance on the basis of the second non-liner pixel signal. The sensitivity control part controls an imaging sensitivity by controlling at least non-liner digital gain on the basis of the luminance.SELECTED DRAWING: Figure 1
Patent JP-2016165998-A (JP)
Title: Tail rotor device of helicopter
Inventor: MARTIN STUCKI
IPC: B64C27/82
Filed: 2016-03-08
Abstract: PROBLEM TO BE SOLVED: To reduce the power consumption of a main rotor.SOLUTION: A tail rotor device 2 attachable to a tail boom of a helicopter includes a sheathing member 20 that forms an air flow channel 200 with a channel depth T running in the direction of a channel axis A. The channel axis is perpendicular to a longitudinal axis L and an inner circumference side channel diameter 202, and a tail rotor 21 with plural rotor blades 210 can be rotatably installed in the air flow channel. In the sheathing member, its channel depth tapers from the front towards the back in a counter-longitudinal direction, and its objective is to improve forward flight characteristics during operation and to reduce the power consumption of a main rotor. This is achieved by that the selected variable channel depth is always less than one fourth of the inner circumference side channel diameter and a ratio between the variable channel depth of the sheathing member in the direction of the longitudinal axis and the inner circumference side channel diameter of the sheathing member has a value between 20.5% and 14%.SELECTED DRAWING: Figure 4b
Patent JP-2016200582-A (JP)
Title: Method and system for x-rays scanning
Inventor: WANG JIAN
IPC: G01N23/04
Filed: 2016-03-08
Abstract: PROBLEM TO BE SOLVED: To provide a method and a system for x-rays scanning.SOLUTION: The method includes: collecting background data when x-rays are not applied (step 301); collecting air data when x-rays are applied and a detection path has no objects scanned (step 302); scanning an object and collecting original scanning data (step 303); and pre-processing the original scanning data on the basis of the background data and the air data and acquiring scanning image data (step 304). The background data and the air data are measured and the scanning data is processed when a stationary object is scanned with x-rays, so that a problem of noise caused by mechanical vibrations is solved and the measurement accuracy can be increased.SELECTED DRAWING: Figure 3
Patent JP-2016177282-A (JP)
Title: Linerless label and manufacturing method thereof, cutting apparatus, and thermal recording device
Inventor: ODA YASUFUMI
IPC: B65H35/07
Filed: 2016-03-10
Abstract: PROBLEM TO BE SOLVED: To provide a linerless label having excellent adhesiveness, reducing accumulation of an adhesive on cutter blades when cutting, and capable of suppressing jamming and printing blur.SOLUTION: The linerless label includes a release layer over one surface of a support, and an adhesive layer over another surface of the support. When the linerless label is cut with an apparatus including a mechanism in which an upper blade of cutter blades is immobilized and a lower blade of the cutter blades is configured to move upward, in a manner that the lower blade is inserted into the linerless label from a side of the linerless label at which the adhesive layer is provided, a cutter load voltage during a cutter operation performed after the linerless label is cut five thousand times repeatedly has a difference of less than or equal to 2.0 V from the cutter load voltage during cutting of a label support, which is the linerless label before treated to have adhesiveness.SELECTED DRAWING: Figure 1A
Patent JP-2017161054-A (JP)
Title: Multistage transmission
Inventor: OKABE TADASHI
IPC: F16H1/06
Filed: 2016-03-11
Abstract: PROBLEM TO BE SOLVED: To provide a multistage transmission whose structure is simple and whose assembly is easy, and which can be reliably operated.SOLUTION: A first case 11 includes a plurality of division plates 11d to 11i, each having first and second cutouts 11j and 11k. A first shaft 15 is held by the first cutout 11j of the plurality of division plates, and a second shaft 16 is held by the second cutout 11k of the plurality of division plates. A first two-stage gear 21 is provided in the first shaft 15 and has a second gear 21a meshed with a first gear 18 which is rotationally driven and a third gear 21b. A second two-stage gear 22 is provided in the second shaft 16 and has a fourth gear 22a meshed with the third gear 21b and fifth gear 22b. The first gear 18 and the second gear 21a are disposed between the division plate 11d and the division plate 11e, and the third gear 21b and the forth gear 22a are disposed between the division plate 11e and the division plate 11f.SELECTED DRAWING: Figure 3
Patent JP-2017166325-A (JP)
Title: Wind power generating method at multistage vertical axis wind turbine
Inventor: SUZUKI MASAHIKO
IPC: H02P9/06
Filed: 2016-03-14
Abstract: PROBLEM TO BE SOLVED: To provide a wind power generating method capable of performing efficient power generation while preventing stall of rotors in advance even under low wind speed.SOLUTION: Power generation is repeated by rotation of all rotors in such a way that a first rotor 2A of lower stage rotors in upper and lower several stages having several blades 7 is always connected to a vertical main shaft 14 cooperatively related to a power generator 4, a second rotor 2B of the upper stage is connected to it through a clutch 15. When the first and second rotors are being rotated at a speed less than a predetermined average wind speed, the clutch 15 is disconnected to cause the second rotor to rotate in idling and in turn when this rotor is accelerated to reach to a rotating specified peripheral speed, the clutch is connected again to cause the first rotor to be increased in its rotating speed by the second rotor rotated in idling.SELECTED DRAWING: Figure 1
Patent JP-2017166747-A (JP)
Title: Movable table cooling device and movable table cooling system
Inventor: OIKAWA TAKESHI
IPC: F25B9/00
Filed: 2016-03-16
Abstract: PROBLEM TO BE SOLVED: To provide a cooling device suitable to cool a movable table for holding an object in a vacuum vessel.SOLUTION: A cooling device 10 comprises a compressor 16, a cold head 18, and a circulation cooling device 14. The compressor 16 is shared by the cold head 18 and the circulative cooling device 14. The circulation cooling device 14 comprises a low-temperature gas circulation line 22 thermally connected to a cooling part 18d of the cold head 18, and a room-temperature gas circulation line 24 arranged so as not to be thermally connected to the cooling part 18d of the cold head 18.SELECTED DRAWING: Figure 1
Patent JP-2017168667-A (JP)
Title: Semiconductor device
Inventor: SUZUKI TAKUMA
IPC: H01L29/12
Filed: 2016-03-16
Abstract: PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device.SOLUTION: A semiconductor device according to an embodiment includes a first electrode, a second electrode, a first silicon carbide region of p-type provided between the first electrode and the second electrode, a second silicon carbide region of n-type provided between the first electrode and the first silicon carbide region, a third silicon carbide region provided between the first electrode and the first silicon carbide region and containing n-type impurities different from the n-type impurities included in the second silicon carbide region, a fourth silicon carbide region of n-type provided between the first silicon carbide region and the second electrode, and a third electrode provided to the first silicon carbide region, the second silicon carbide region, and the fourth silicon carbide region through an insulating film.SELECTED DRAWING: Figure 1
Patent JP-2017169428-A (JP)
Title: Independent operation detector and independent operation detection method
Inventor: LUNG CHIENRU
IPC: H02J3/38
Filed: 2016-03-18
Abstract: PROBLEM TO BE SOLVED: To provide an independent operation detector and an independent operation detection method capable of detecting independent operation simultaneously at high speed, regardless of the connection polarity of commercial system power supply and a distributed power supply, when independent operation state occurs during system interconnection operation of a large number of distributed power supplies.SOLUTION: An independent operation detector includes an output current control section for updating a reactive current command value so that the output current of an inverter follows an output current command value, when the phase angle (θ) of a commercial system voltage (e) is in a range of 90 N° ±Δφ (N is an odd number, Δφ≤φ(threshold)), a first frequency measurement section for measuring the frequency of commercial system voltage between u-w, and a second frequency measurement section for measuring the frequency of commercial system voltage between w-u. The independent operation detector detects whether or not independent operation is occurring, based on the current values of respective commercial system frequencies measured in the first and second frequency measurement sections while shifting by half cycle, and the values from 1 system period before to n (n≥2) system periods before.SELECTED DRAWING: Figure 2
Patent JP-2017174864-A (JP)
Title: Methods for evaluating and manufacturing epitaxial wafer
Inventor: KIMURA AKIHIRO
IPC: H01L21/66
Filed: 2016-03-18
Abstract: PROBLEM TO BE SOLVED: To provide a method for evaluating an epitaxial wafer (EP wafer) capable of accurately and easily evaluating a defect and contamination of an epitaxial layer (EP layer) of the EP wafer.SOLUTION: A method for evaluating an EP wafer in which an EP layer is grown on a growth wafer composed of a single crystal silicon includes the steps of: preparing a plurality of EP wafers which include a single crystal silicon substrate and EP layers having a conductivity type different from the substrate and in which the EP layers differ in thickness as an investigation EP wafer; performing photoluminescence (PL) measurement from a surface of the investigation EP wafer; calculating a thickness A of the EP layer in which dopant concentration indicating the same conductivity type as the detected single crystal silicon substrate is not more than 5% of the dopant concentration calculated from a resistivity of the single crystal silicon substrate; growing the EP layer to be evaluated on the growth wafer at a thickness of not less than A; and evaluating the EP layer to be evaluated by subjecting the EP layer to be evaluated to PL measurement.SELECTED DRAWING: Figure 1
Patent JP-2017171463-A (JP)
Title: Cut transport method of raw material and facility of the same
Inventor: MATSUMIYA TAKEO
IPC: C21B5/00
Filed: 2016-03-24
Abstract: PROBLEM TO BE SOLVED: To provide a cut transport method of a raw material capable of minimizing the cost for facilities to transport raw materials to a raw material storage tank on the secondary side by accurately cutting them from the primary side.SOLUTION: In a cutting transport method of raw materials for cutting raw materials via feeders 2,3 from each raw material storage tank of a primary side raw material storage tank group 1 comprising a plurality of raw material storage tanks, and for transporting the cut raw materials to a secondary side raw material storage tank 5 by way of an assembly belt conveyer 4 having a single path, weights of raw materials cut out of every raw material storage tank are measured in a vicinity area on the outlet side of the assembly belt conveyer, and the raw material transport speed (t/h) in each raw material storage tank is obtained from the measured weights. When the obtained raw material transport speed (t/h) of each raw material storage tank and a preset target transport speed (t/h) of each raw material storage tank have a difference, raw material cutting amount is controlled so that the transport speed may be coincident with the preset target transport speed with respect to a rae material storage tank having the difference.SELECTED DRAWING: Figure 1
Patent JP-2016157957-A (JP)
Title: Manufacturing method for semiconductor device
Inventor: YAMAZAKI SHUNPEI
IPC: H01L29/786
Filed: 2016-03-28
Abstract: PROBLEM TO BE SOLVED: To provide a reliable semiconductor device including a thin film transistor with the stable electric characteristics.SOLUTION: In a manufacturing method for a semiconductor device including a thin film transistor whose semiconductor layer including a channel formation region is an oxide semiconductor film, an oxide insulating film to serve as a protective film is formed in contact with the oxide semiconductor layer and then heat treatment (heat treatment for dehydration or dehydrogenation) for reducing moisture as the impurities is performed. This can reduce the impurities such as moisture existing in a source electrode layer, a drain electrode layer, a gate insulating layer, and the oxide semiconductor film and moreover at the boundary between the oxide semiconductor film and a film above or below and in contact with the oxide semiconductor film.SELECTED DRAWING: Figure 1
Patent JP-2017179768-A (JP)
Title: Folding tool for water cutoff part
Inventor: NAKAMURA TOSHIAKI
IPC: E04D15/04
Filed: 2016-03-29
Abstract: PROBLEM TO BE SOLVED: To provide a folding tool for a water cutoff part capable of appropriately folding up an edge part of a folded plate, even at a location with a parapet, etc.SOLUTION: A folding tool 1 for a water cutoff part includes a body part 2, a handle part 3 for operating the body part 2, and a ratchet part 4 connecting the handle part 3 with the body part 2. The body part 2 includes a flat plate part 21, a standing plate part 22, and a tip member 23. With the body part 2, the lower plate part 23b forms a lower part positioned below an edge part of the folding plate, the flat plate part 21 forms an upper part positioned above the edge part of the folding plate, and the vertical part 23c of the edge member 23 forms a connecting part connecting the lower part with the upper part.SELECTED DRAWING: Figure 3
Patent JP-2017183400-A (JP)
Title: Schottky barrier diode
Inventor: FUKUI TATSUYA
IPC: H01L21/329
Filed: 2016-03-29
Abstract: PROBLEM TO BE SOLVED: To provide a Schottky barrier diode capable of improving reverse surge tolerance without increasing a forward voltage V.SOLUTION: A Schottky barrier diode 100 comprises: a first semiconductor layer 110 of a first conductivity type; a second semiconductor layer 120 of the first conductivity type which is formed on the first semiconductor layer 110 and of which the impurity concentration is lower than that of the first semiconductor layer 110; a barrier metal layer 130 which is formed in a predetermined region of a surface on the second semiconductor layer 120; and a guard ring 140 of a second conductivity type which is formed on the surface of the second semiconductor layer 120 in such a manner that an outer peripheral part of the barrier metal layer 130 is included in a planar view. The impurity concentration of the second semiconductor layer 120 in a region where the guard ring 140 is formed is higher than the impurity concentration of the second semiconductor layer 120 in an active region.SELECTED DRAWING: Figure 1
Patent JP-2017182367-A (JP)
Title: Information display system and information display program
Inventor: Sugata shigehiko
IPC: G06F3/0482
Filed: 2016-03-30
Abstract: PROBLEM TO BE SOLVED: To provide a technique capable of easily finding a piece of desired information from a plurality of information having a similar character string.SOLUTION: An information display system includes: a list display part that displays a plurality of character strings representing each information in an information list; and a scroll part that automatically scrolling the plural character strings having similar character strings in the plural pieces of information as the display object while associating with each other in a character order direction.SELECTED DRAWING: Figure 3
Patent JP-2017179864-A (JP)
Title: Dual-structure casing and ground anchor installation method using the same
Inventor: ODAKA YASUSHI
IPC: E21D20/00
Filed: 2016-03-30
Abstract: PROBLEM TO BE SOLVED: To enable efficient use of a device used inside a casing in a plurality of casings having different outer diameters.SOLUTION: A dual-structure casing 10 includes an outer casing 12, an inner pipe 14 installed inside the outer casing 12, and a pair of sealing members 16A, 16B for sealing a gap C between the outer casing 12 and the inner pipe 14. In other words, an inner diameter of the dual-structure casing 10 has been reduced to an inner diameter of the inner pipe 14 from an inner diameter of the outer casing 12, by installing the inner pipe 14 inside the outer casing 12. As such, a device assumed to be used in a casing having an inner diameter approximately the same as the inner diameter of the inner pipe 14 may be used even inside the dual-structure casing 10. The configuration enables the device used inside the casing to be used efficiently in a plurality of casings having different outer diameters.SELECTED DRAWING: Figure 1
Patent JP-2017183516-A (JP)
Title: Wafer processing apparatus, wafer processing method and program recording medium
Inventor: NAKAMURA KAZUKI
IPC: H01L21/304
Filed: 2016-03-30
Abstract: PROBLEM TO BE SOLVED: To provide a method and apparatus for implementing edge over scan without reducing cleaning efficiency of a wafer.SOLUTION: A wafer processing method includes: a wafer holding and rotating step for horizontally holding a wafer and rotating the wafer around a rotation axis (AX) passing a center of the wafer when performing brush cleaning of a principal surface of the wafer; a brush abutting step for making brushes (30, 300, 310, 320 and 330) close to the wafer, thereby forming an abutment region where the brushes are abutted with the principal surface; a first moving step for moving the brushes from the center of the wafer to an outer periphery in a wafer radial direction while maintaining an abutment state; a brush deforming step for deforming the brushes in such a manner that a length of the abutment region where the brushes are abutted with the principal surface, in the wafer radial direction is decreased, while maintaining the abutment state; and a second moving step for moving the brushes from the center of the wafer to the outer periphery in the wafer radial direction after the brush deforming step.SELECTED DRAWING: Figure 4