baber/WOPTO huggingface dataset:
Patent TW-463423-B (TW)
Title: Memory card adapter
Inventor: SHEN HUNG-RU
IPC: H01R31/06
Filed: 2001-01-30
Granted: 2001-11-11
Abstract: A memory card adapter which is to integrate four kinds of memory card adapters, such as compact flush card, multi-media card, secure digital card and smart media card, into a single memory card adapter. Because the differences for the specification and I/O pin positions of those four memory cards as compact flush memory card, multi-media card, secure digital card and smart media card, allocating the pin connector of the compact flush card, the pins of multi-media card, the secure digital card and the smart media card at the different locations of the same memory card adapter and using the printed circuit board to integrate the circuits connecting with I/O pins of the memory cards with the external terminals so that the memory card adapter can be compatible with those four kinds of memory cards.
Patent TW-461966-B (TW)
Title: X-ray spectroscopic analyzer having sample surface observation mechanism
Inventor: KOJIMA SHINJIROU
IPC: G01N23/223
Filed: 2001-03-06
Granted: 2001-11-01
Abstract: An X-ray spectroscopic analyzer having a mechanism for observing a sample surface, for analyzing a sample 3 by irradiating X-ray 4 thereupon within a chamber 2, comprises: a viewer apparatus 11 for letting the sample to be viewed; and an illumination means 31 for illuminating a surface of the sample 3, by irradiating an illuminating light B upon the surface of the sample 3 obliquely, while suppressing an incidence of a reflecting light of the illuminating light B upon the viewer apparatus 11. With such the construction, a shape of a contaminated portion, a residue or the like, upon the sample surface, can be clearly observed under dark field on the viewer apparatus 11, while keeping the sample 3 set within the X-ray spectroscopic analyzer 1.
Patent TW-I227026-B (TW)
Title: Method to operate an integrated memory
Inventor: ESTERL ROBERT
IPC: G11C11/22
Filed: 2001-04-06
Granted: 2005-01-21
Abstract: A method to operate an integrated memory is described, which has memory-cells (MC0; MC255) with respectively a selection-transistor (T0, T255) and a memory-capacitor (C0, C255) with ferroelectric memory-effect. The memory includes a plate-line (PL), which is connected through a row-circuit of said selection-transistor (T0) and said memory-capacitor (C0) of respective memory-cells (MC0) with one of the column-lines (BLt). A memory-access is carried out according to the so-called ""Pulsed Plate Concept"". The time progress is controlled so that in an access-cycle the memory-capacitor (C0) of the selectable memory-cell (MC0) is charged and discharged to an equal amount. So, the decrease or damage, caused by the source-drain-leakage current of the non-activated selection-transistors, of the information stored in the memory-cells can be prevented.
Patent TW-591337-B (TW)
Title: Positive photoresist composition
Inventor: SASAKI TOMOYA
IPC: G03F7/039
Filed: 2001-04-06
Granted: 2004-06-11
Abstract: Provided is a positive photoresist composition for use in the production of a semiconductor device, which ensures high resolution, reduced edge roughness of a line pattern and a small number of development defects. The positive photoresist composition comprises a resin having a specific silicon-containing group on the side chain, the solubility of which resin in an alkali developer increases under the action of an acid.
Patent TW-507208-B (TW)
Title: Voltage clamping detection circuit for non-versatile memory word line
Inventor: JIANG SHENG-SHIANG
IPC: G11C7/00
Filed: 2001-05-16
Granted: 2002-10-21
Abstract: The invention provides a voltage clamping detection circuit for non-versatile memory word line that detects the voltage overshoot of word line and provides a control signal. The circuit can lower the word line voltage by the control signal indicating the voltage clamping unit of word line once a word line voltage overshoot is detected such that the sense amplifier is prevented from incorrect output. A dummy memory cell block is used for tracking the cell current of the memory unit. The data of the cell detected by the sense amplifier is further processed through a comparison unit where an output control signal is provided. The circuit of the invention is advantaged for its cell current tracking such that modifying the detection circuit due to varied process factors is unnecessary.
Patent TW-507349-B (TW)
Title: Flexible printed circuit board, integrated circuit chip mounting flexible printed circuit board, display apparatus incorporating, integrated circuit chip mounted structure, bonding method of integrated circuit chip mounting flexible printed circuit board
Inventor: TAKAO NAOKI
IPC: H05K1/18
Filed: 2001-07-05
Granted: 2002-10-21
Abstract: An IC chip mounting FPC board of the present invention is provided with (1) a mounting region in a substantially quadrangular shape for mounting an IC chip, and (2) a plurality of inner-leads provided along each side of the mounting region, for being connected with the bumps of the IC chip so that the IC chip is mounted and bonded in the mounting region, in which the inner-leads is provided so as to have substantial equality between (a) a sum of areas of superimposing regions of the inner-leads provided on one of facing two sides, and (b) a sum of areas of superimposing regions of the inner-leads provided on the other of the facing two sides. Because this substantially equalizes the pressures applied on the respective inner-leads during the mounting of the IC chip, preventing the bonding pressure of the mounting from being unbalance, it is possible to provide an IC chip mounting FPC board having a high bonding reliability.
Patent TW-530196-B (TW)
Title: Method for assuring the perspective relation of an object on a screen
Inventor: LIN KUANG-SHIN
IPC: G06F1/00
Filed: 2001-08-10
Granted: 2003-05-01
Abstract: The disclosed method for assuring the perspective relation of an object on a screen in accordance with the present invention includes the steps of: first setting a pixel value of a screen; next, calculating the maximum object perspective relation value capable of being displayed by the screen; assuring that the motion status of an object is dynamic; finally, calculating the object perspective relation value of the object, so as to assure the perspective position of the object on the screen. Therefore, the present invention can automatically control the dynamic perspective relation of a motion object on the screen without making and editing the definition document of the perspective relation, thereby reducing the internal storage space occupied by the excessive data, increasing the working efficiency and saving the working cost.
Patent TW-515119-B (TW)
Title: Organic electronic device, method of producing the same, and method of operating the same
Inventor: OGAWA KAZUFUMI
IPC: H01L27/32
Filed: 2001-08-10
Granted: 2002-12-21
Abstract: An organic electronic device is provided that utilizes a conductive organic thin film having a conductive network in the channel region. The conductive network comprises an organic molecular group made up of organic molecules each having a light-responsive group or a polar group bonded together by conjugated bonds. Thus, high integration and high-speed response is made possible. In addition, a method of producing a functional organic thin film fixed to a specified portion of a substrate surface by covalent bonds is provided. This method comprises preliminarily treating the substrate by performing an active hydrogen exposure treatment on the specified portion (or an active hydrogen removing treatment on the portion other than the specified portion) and reacting the active hydrogens of the specified portion with organic molecules. Thus, a high precision functional organic thin film, even one formed to the micron pattern level, can be provided.
Patent TW-511250-B (TW)
Title: Manufacture method of stacked gate flash memory
Inventor: HSIEH CHIA-TA
IPC: H01L21/8242
Filed: 2001-08-21
Granted: 2002-11-21
Abstract: A manufacture method of stacked gate flash memory comprises the following steps. First, provide a substrate and sequentially deposit first and second deposition layers. Second, make a first fillister on the first, second deposition layer and substrate deep to the substrate. Third, fill the first fillister with the first insulated layer. Then remove the second deposition layer and expose the sidewall of the first insulated layer. Forth, etch the first deposition layer and the first insulated layer and make a ladder type sidewall on the first insulated layer. Then remove the first deposition layer to form the second fillister exposing the substrate. Form a second insulated layer on the exposed substrate. Fifth, deposit a first gate layer and etch back the first gate layer to let the first gate layer remain in the second fillister and form a hollow and a tip on the center of the first gate layer and side respectively. Then etch the first insulated layer to expose the tip of the first gate layer. Finally, form a third insulated layer on the first gate layer surface and deposit a second gate layer to fill in the second fillister.
Patent TW-511253-B (TW)
Title: Manufacture method and structure of ROM identification code
Inventor: WEN WEN-YING
IPC: H01L21/8246
Filed: 2001-08-24
Granted: 2002-11-21
Abstract: Manufacture method and structure of ROM identification code is provided. Implant read-only memory code into the channel region between the bit-line and the part under the word-line of the substrate. There is a field oxide layer for labeling on a designated area of the substrate. Add a layer which material is different to the label layer of the oxide layer. The label layer has a set of label code to form a identification code structure. The identification code can be clearly distinguished.
Patent TW-586032-B (TW)
Title: Optical device having wavelength selectivity
Inventor: TOYOSHIMA TAKAYUKI
IPC: G02B6/34
Filed: 2001-09-04
Granted: 2004-05-01
Abstract: This invention discloses an optical element with wavelength selectivity which can be fabricated easily at low cost. The disclosed optical element includes a light guiding panel (22) having two opposed end surfaces (22a, 22b), and multi-film filters (23) formed on at least one of the two opposed end surfaces of the light guiding panel. The multi-film filter includes alternately stacked high refractive index dielectric layers and low refractive index dielectric layers, and has a film thickness changing continuously at different positions of the end surface of the light guiding panel. The central wavelength of the transmitted light of the multi-film filter changes at different positions of the end surface of the light guiding panel. When incident mixed light coming from each lens through the light guiding panel enters the multi-film filter, the mixed light is decomposed into several rays having different central wave lengths by the multi-film filters having different thicknesses.
Patent TW-496811-B (TW)
Title: Polishing apparatus and method with a refreshing polishing belt and loadable housing
Inventor: TALIEH HOMAYOUN
IPC: B24B37/04
Filed: 2001-10-05
Granted: 2002-08-01
Abstract: The present invention is directed to methods and apparatus for polishing a surface of a semiconductor wafer using a pad or belt moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad or belt provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad or belt as die pad or belt moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having novel wafer loading and unloading methods.
Patent TW-I224249-B (TW)
Title: Personal digital assistant member having keyboard input function and mobile phone function
Inventor: LAI CHENG-SHING
IPC: G06F1/16
Filed: 2001-10-05
Granted: 2004-11-21
Abstract: The present invention provides a personal digital assistant member that includes a personal digital assistant having a socket and accessories having a support object, a keyboard and a covering device. The keyboard provides convenience for the user to input massive data, and the covering device even contains CCITT key to provide the mobile phone function. The personal digital assistant uses the socket to connect with the support frame of the accessory so as to make personal digital assistant have transmission of signal input/output with the CCITT key and input device.
Patent TW-I293320-B (TW)
Inventor: TAKANO NOZOMU
IPC: C08K13/02
Filed: 2001-10-12
Granted: 2008-02-11
Abstract: An incombustible resin composition in which a silicone oligomer, a metal hydrate and a resin material are contained as essential components, the metal hydrate is 20% by weight or more in the total solids of the resin composition is provided.
Patent TW-531855-B (TW)
Title: Downward chip-cavity packaging process
Inventor: JENG JAU-CHIN
IPC: H01L23/043
Filed: 2001-12-31
Granted: 2003-05-11
Abstract: A kind of downward chip-cavity packaging process is disclosed in the present invention and includes the followings. A substrate that has an insulation core layer and a conductive layer is provided. A through hole is formed inside the substrate. A sticky tape is adhered to cover the conductive layer surface. A chip, which has an active surface and a backside, is stuck to the sticky tape in the through hole, in which plural bonding pads are provided on the active surface, and backside of the chip is stuck to the tape. A patterned dielectric layer is formed and is used to fill in the through hole and covers part of the sticky tape, the active surface, the pads and the insulation core layer. The patterned dielectric layer has plural openings such that parts of the openings expose the bonding pads and parts of the openings are through holes. A metal layer is electroplated in the openings to cover the patterned dielectric layer. The sticky tap is removed. The metal layer and the conductive layer are patterned. A patterned solder mask layer is formed to cover the surfaces of the metal layer and the conductive layer. The patterned solder mask layer is provided with plural openings to expose part of the conductive layer. A ball-mounting process is then conducted to electrically connect plural soldering balls with the conductive layer.
Patent TW-548608-B (TW)
Title: Automatic high frequency radio wave detection system
Inventor: HU YU-MIN
IPC: G08B5/00
Filed: 2002-02-06
Granted: 2003-08-21
Abstract: The automatic high frequency radio wave detection system of the invention has the detection subsystem installed at each detection point for conducting wireless bi-directional transmission along with monitoring host system so that the detection subsystem searches the abnormal radio signal in a preset range and keeps detecting and analyzing after locking and intercepting the signal until the abnormal radio signal is verified as a wireless image signal instead of other wave signals. Therefore, the ASK/FSK wireless bi-directional receiver of the detection subsystem transmits an alarm signal back to the monitoring host system. After the monitoring host system receives the signal transmitted from any detection subsystem via the ASK/FSK wireless bi-directional receiver, it will send out an alarm signal to inform the monitoring personnel and display the location and frequency of the wave signal through the display interface of the monitoring host system in favor of the countermeasure at the first moment.
Patent TW-I282206-B (TW)
Title: Method of controlling solenoid actuator
Inventor: EHARA TAKAYUKI
IPC: H02P25/06
Filed: 2002-02-19
Granted: 2007-06-01
Abstract: When a solenoid drive current I is controlled toward a certain target current value IT, overshoot and undershoot relative to the target current value are repeated such that the current settles down to the target current value. The solenoid drive current is so controlled as to settle down to the target current value after the current is swung up and down. As a result, the attracting force settles down to the midway point of the variation between the attracting force characteristics in the current-increasing direction and the current-reducing direction, respectively, of the solenoid actuator. The hysteresis characteristics can be canceled out.
Patent TW-539768-B (TW)
Title: Aqueous surface treatment agent for plated metal sheet, surface treated metal sheet and process for production thereof
Inventor: YOSHIDA KENGO
IPC: C23C30/00
Filed: 2002-02-21
Granted: 2003-07-01
Abstract: There is provided an aqueous surface treatment agent characterized by comprising an acrylic-based resin, water and 5-35 wt% of colloidal silica in terms of solid weight, wherein the acrylic-based resin is a polymer obtained by polymerization reaction of, in terms of solid weight, (a) 15-76 wt% of a (math)acrylate unsaturated monomer represented by the following general formula (I): where R1 is hydrogen or methyl and R2 is a linear or branched alkyl of 1-8 carbons, (b) 2-10 wt% of an alpha,beta-ethylenic unsaturated monomer with a carboxyl group in the molecule, (c) 2-10 wt% of an alpha,beta-ethylenic unsaturated monomer with a hydroxyl group in the molecule, (d) 10-30 wt% of styrene, (e) 10-30 wt% of acrylonitrile and (f) 0-10 wt% of an unsaturated monomer which is polymerizable with these monomers, and the polymer having a glass transition temperature of 0-30 DEG C. There are also provided surface-treated metal materials obtained using the treatment agent and a process for their production.
Patent TW-593782-B (TW)
Title: Phosphorized copper anode for electroplating
Inventor: YAJIMA KENJI
IPC: C22C9/00
Filed: 2002-03-13
Granted: 2004-06-21
Abstract: This invention discloses a phosphorized copper anode for electroplating which does not adhere onto the electroplating surface of the cathode and can form in grains, especially, the phosphorized copper anode for electroplating using electroplating to form copper wiring in a semiconductor device. A phosphorized copper anode used for electroplating, according to the invention, includes 20-80 ppm of phosphorus; between 0.1 and less than 2 ppm of oxygen, and the balance being high purity copper having a purity of 99.9999% by mass or higher, in which the average grain size of the copper anode after recrystallization is in the range between about 10 and 50 mum.
Patent TW-552667-B (TW)
Title: Semiconductor device
Inventor: NISHIZAWA HIROTAKA
IPC: H01L25/18
Filed: 2001-03-02
Granted: 2003-09-11
Abstract: A chip mounting method is proposed, which facilitates the testing of semiconductor chips when a plurality of semiconductor chips are sealed in a single resin sealing body. This method also applies to a variety of MCPs and system LSIs. In a single package, one signal output terminal of the first semiconductor chip and a first external terminal of the semiconductor device are internally connected independently. One signal input terminal of the second semiconductor chip and a second external terminal of the semiconductor device are internally connected independently. The first and second external terminals of the semiconductor device are connected outside the semiconductor device to complete the connection between the signal output terminal and the signal input terminal.
Patent TW-534845-B (TW)
Title: Improved powder metallurgy process
Inventor: WANG JENN-SHING
IPC: C04B35/638
Filed: 2002-03-28
Granted: 2003-06-01
Abstract: The present invention relates to an improved powder metallurgy process comprising: mixing a ceramic powder with shape formation enhancing agent, such as a binder, a filler or lubricant; performing a shape forming operation, such as molding or extruding or forging or injecting or scraping, to form the mixture into a blank capable of absorbing microwave; heating the blank in a microwave for de-greasing; placing the de-greased semi-product in a sintering furnace to be sintered; and cooling the sintered product to obtain a product. The improvement comprises in performing the de-greasing process for the blank, the blank is placed in a microwave oven and power and time of microwave is adjusted for de-greasing by heating. During the de-greasing process, smoking caused by de-greasing can be directly observed through a view window, together with a suitable temperature control. Furthermore, a semi-product subjected to microwave de-greasing or a de-greased blank can be directly heated by microwave to a sintering temperature, followed by placing the semi-product or blank into a sintering furnace at the sintering temperature or directly sintering by microwave, thereby reducing the time and energy of gradual heating.
Patent TW-550973-B (TW)
Title: Organic electricro luminescence display panel
Inventor: FUJITA YOSHIFUMI
IPC: H05B33/02
Filed: 2002-04-22
Granted: 2003-09-01
Abstract: The insulation which is formed between a second electrodes formed on an organic electricro luminescence (hereinafter called ""EL"") and the second electrode and the first electrode can be assured, and when thin film is use to encapsulate the organic EL elements, then the organic EL film that assists in light-emitting can be surely encapsulated. The organic EL display panel is to form a plurality of parallel strip-shaped first electrodes onto a color filter 2. On the color filter 2, in addition to keeping area for forming for forming a plurality of organic EL elements 5 onto the pre-determined positions on the first electrodes 3, the remainder portions form parallel strip-shaped insulation wall 4 that is perpendicular to the first electrodes 3. An organic EL layer 6 is formed on the first electrodes 3 and the wall 4, and a second electrode 7 is formed on the organic EL layer 6. The wall 4 is composed of two inverted conical-shaped protrusions 4a, 4b which are formed of photoresist and which are parallel to the second electrode 7, and is composed of a conical-shaped insulation layer 8 that is formed on its outer side.
Patent TW-569407-B (TW)
Title: Wafer-level package with bump and method for manufacturing the same
Inventor: TAO SU
IPC: H01L31/075
Filed: 2002-05-17
Granted: 2004-01-01
Abstract: A wafer-level package with bump comprises a first chip, a second chip and a bump ring. The first chip has a semiconductor device, a bonding pad ring surrounding the semiconductor device, and a plurality of bonding pads disposed outside the bonding pad ring and electrically connected to the semiconductor device for electrically connecting to an external circuit. The second chip has a bonding pad ring corresponding to the bonding pad ring of the first chip. The bump ring is disposed between the bonding pad ring of the first chip and the bonding pad ring of the second chip for bonding the first and the second chips so as to form a hermetical cavity.
Patent TW-574736-B (TW)
Title: Method of manufacturing semiconductor integrated circuit device
Inventor: FUJIWARA TSUYOSHI
IPC: H01L21/84
Filed: 2002-05-24
Granted: 2004-02-01
Abstract: A kind of manufacturing method of semiconductor integrated circuit device is provided in the present invention. The purpose of the present invention is to improve the chemical stability of a silicon nitride film. After an insulating film formed by a silicon nitride film is subjected to plasma CVD film depositing treatment, introduction of a silane gas is stopped and the film is subjected to plasma discharging for a predetermined interval while a nitrogen gas and an ammonia gas are introduced. After that, the plasma discharging is stopped. Thus, the non-reacted formation material on the silicon nitride film can be nitrified; and a disadvantage caused by the non-reacted formation material can be prevented.