Patent AU-2010345325-B2 (AU)
Title: Composite material, high-frequency circuit substrate made therefrom and making method thereof
Inventor: SU MINGSHE
IPC: C08K5/03
Filed: 2010-07-14
Granted: 2013-09-26
Abstract: (12) J (10) E 0*64i (43) WO202/0676A 2012 * 1 P] 19 H (19.01.2012) PCT WO 2012/006776 Al (51) 0U #&IO : (81) If(V 4 tL % H05K1/00 (2006.01) C09J163/02 (2006.01) f~jP): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, (21) 5%$W ': PCT/CN2010/075 149 CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, Fl, GB, (22) 5I4f 2010 T 7 A9 14 H (14.07.2010) GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, (25) :c LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, (26) .4c PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, (71) $1A (NT )N n, Pf h I"' t N ): )- SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, 4YR4 k (GUANGDONG SHENGYI SCI. VN, ZA, ZM, ZW0 TECH CO., LTD) [CN/CN]; d SWAKMt'tJ (84) MZ (Rt T hg' , - - gTXfAt Ex INL TLR WTR 91 5 5, Guang- tP): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, dong 523000 (CN)0 NA, SD, SL, SZ, TZ, UG, ZM, ZW), rk A (AM, AZ, (72) A A; A BY, KG, KZ, MD, RU, TJ, TM), rk VII (AL, AT, BE, (75) 1 f A/4 A ('fY24#N ): [ft (SU, Mingshe) BG, CH, CY, CZ, DE, DK, EE, ES, Fl, FR, GB, GR, HR, [CN/CN]; t' d1dJ t N HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, JL RF YE I M YE R 96 Y 5 <, Guangdong 523000 PT, RO, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, (CN). CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)o (74) 1W (COMIPS INTELLECTUAL PROPERTY OFFICE); 307 r, Guangdong 518027 (CN)o (54) Title: COMPOSITE MATERIAL AND HIGH FREQUENCY CIRCUIT SUBSTRATE MANUFACTURED WITH THE COMPOSITE MATERIAL AND THE MANUFACTURING METHOD THEREOF (57) Abstract: A composite material, a high frequency circuit substrate manufactured with the composite material and the manu facturing method thereof are provided. The composite material includes a thermosetting mixture, glass fiber cloth, powder filler, flame retardant and an initiator for curing, wherein, the thermosetting mixture consists of at least one of a vinyl liquid resin with polar functional groups and a molecular weight of less than 10, 000, and a polyphenylene ether resin with a molecular weight of less than 5, 000 and an unsaturated double bond at the end of a molecule. The high-frequency circuit substrate manufactured with the composite material comprises a plurality of layers of prepregs which are overlapped with each other and are made of the com posite material, and copper foils which are respectively pressed at both sides of the prepregs. The composite material ensures that the prepregs can be made easily and has high adhesion force with the copper foils, and the high-frequency circuit substrate made of the composite material has low dielectric constant and dielectric loss tangent, good heat resistance and convenient process oper ation, so the composite material is suitable for making circuit substrates of high-frequency electronic equipment. Zj(5 7) #+, MML$1 ' n$WJN -A.hq~ tP*_ M AwkM~~tL RiA$$St t 0tR : A[±t ti Th AL t -ir~u$##ia~ 1000 ~T k[±rA41qfVJRt~ -#$## /'IT+ 5000 n S4,T o~mo Lt~p~ %A7fltT~~ H~f1 JRh & t'iftS±#