baber/WOPTO huggingface dataset:
Patent TW-201034902-A (TW)
Title: Structure of link lever for bicycle brake
Inventor: NICHOLAS R GINSTER
IPC: B62L3/02
Filed: 2009-03-16
Abstract: The invention mainly provides a structure of link lever for bicycle brake disposed on a predetermined portion of the external diameter edge of a wheel rim and comprising an arm rack set having a first arm rack and a second arm rack capable of mutually pivoted and capable of performing a predetermined swing motion, wherein ends of the extending portions of the first arm rack and the second arm rack at two sides of the wheel rim are respectively provided with a brake pad; a braking set installed to the second arm rack and having a cable wire; and a link lever set having a first link lever, wherein one end of the first link lever is pivotally disposed to the second arm rack, and another end of the first link lever is connected to the cable wire and controlled by the cable wire to produce rotation and swing, and a second link lever, wherein one end of the second link lever is pivotally connected to a middle section portion of the first link lever, and another end of the second link lever is pivotally connected to the first arm rack. The first link lever is controlled by the cable wire to produce an upward rotation and swing motion. The second link lever then is linked to synchronously and upwardly displace. The first arm rack is driven to produce the swing by taking the pivot point as a center so that the lateral extending portion of the first arm rack approaches toward the side of the wheel ram to reduce the distance between the brake pads to be in contact with two sides of the wheel ram, thereby producing a braking effect.
Patent TW-201036128-A (TW)
Title: Chip having bump and package having the same
Inventor: YANG KUO-PIN
IPC: H01L23/488
Filed: 2009-03-25
Abstract: The present invention relates to a chip having bump and a package having the same. The chip includes a chip body, at least one via, a passivation layer, a under ball metal layer and at least one bump. The via penetrates through the chip body, and is exposed to a surface of the chip body. The passivation layer is disposed on the surface of the chip body, and has at least one opening. The opening exposes the via. The under ball metal layer is disposed in the opening of the passivation layer, and connects the via. The bump is disposed on the under ball metal layer. The bump includes a first metal layer, a second metal layer and a third metal layer. The first metal layer is disposed on the under ball metal layer. The second metal layer is disposed on the first metal layer. The third metal layer is disposed on the second metal layer. Whereby, the bump can connect two chips, thus the chip is stackable, so that the density of a product is increased, and the size of the product is reduced.
Patent TW-201006601-A (TW)
Title: Sliding member for a guide structure in a machine tool
Inventor: FUKUZAWA SATORU
IPC: B23Q1/26
Filed: 2009-03-26
Abstract: Provided is a slide member for a guide structure, wherein lubricant can be replenished quickly from the periphery or old lubricant is replaced quickly by new lubricant when lubricant is deficient at a part between a guide surface and a guided surface in the guide structure of a machine tool which come into sliding contact under existence of lubricant. A method for producing such slide member by a small number of production steps is also provided. A guide structure of a machine tool comprises a guide surface (3) on the side of a saddle (15) for guiding a table (16), i.e., a supporting table of a workpiece; a surface (4) to be guided in sliding contact with the guide surface (3); and lubricant (O) interposed between the guide surface (3) and the guided surface. A sheetlike slide member (1) forms the guide surface (3) and/or the surface (4). The slide member (1) is formed of a sheet material principally comprising PTFE, a plurality of protrusions having a height of 350-650 [mu]m are provided on the lubricant holding surface, and a plurality of smooth surfaces for sliding which are protruding by 25-500 [mu]m are provided by polishing the tops of the protrusions. The four directions of the protrusions are opened and a network of lubricant channel is formed, and lubricant can be held movably on the lubricant holding surface.
Patent TW-200944384-A (TW)
Title: Feed slot protective coating
Inventor: BHOWMIK SIDDHARTHA
IPC: B41J2/14
Filed: 2009-03-31
Abstract: An apparatus and method provide a protective coating (60) that extends within a feed slot (40) and is limited so as to not extend into a firing chamber (47).
Patent TW-201037746-A (TW)
Title: Electronic device and it's key module
Inventor: YE JIA-YONG
IPC: H01H11/00
Filed: 2009-04-03
Abstract: A kind of electronic device is disclosed. The electronic device includes a housing and a key module mounted on the housing. The key module includes a plurality of keys and an elastic arm connected with the keys. The housing defines a plurality of openings for receiving the keys. The elastic arm is fixed in the housing. The key module can be produced and mounted as a single element, thus the corresponding cost is low.
Patent TW-200949465-A (TW)
Title: Stage system calibration method, stage system and lithographic apparatus comprising such stage system
Inventor: BUTLER HANS
IPC: G03F9/00
Filed: 2009-04-03
Abstract: A calibration method to calibrate an encoder position measurement system of a stage, the encoder position measurement system including an encoder grid and at least two sensor heads cooperating with the encoder grid, each sensor head providing a sensor head output signal showing a position sensitivity in a horizontal and a vertical direction, the method including (a) moving the stage such that the sensor heads are moved with respect to the encoder grid, or vice versa; (b) during the moving, measuring the position of the stage with respect to the encoder grid by the two sensor heads; (c) determining a vertical position data map from the sensor head output signals of the dual sensor heads; (d) calculating a horizontal position data map from the vertical position data map; and (e) calibrating the encoder position measurement system applying the calculated horizontal position data map.
Patent TW-201037575-A (TW)
Title: Touch input device
Inventor: HSIEH MING-TA
IPC: G06F3/041
Filed: 2009-04-13
Abstract: A touch input device includes a substrate, plural sensor conductive layers and plural first switch units. The substrate has an upper surface. The sensor conductive layers are all disposed on the upper surface and arranged in column-row order. The first switch units are disposed on the substrate and electrically connected to the sensor conductive layers. With the first switch units, the sensor conductive layers in the same column are able to be communicated with each other electrically, and the sensor conductive layers in the same row are able to be communicated with each other electrically.
Patent TW-201038634-A (TW)
Title: Structure made by fortified resin polymer (FRP)
Inventor: HSIAO KUO-HUA
IPC: C08L67/06
Filed: 2009-04-16
Abstract: A structure made by a fortified resin polymer (FRP), the fortified resin polymer (FRP) is obtained by compounding a composite material of glass fiber and an unsaturated polyester resin. Thereby, the structure thus produced can reach a tensile strength of at least 100 Mpa and the structure has features of small thermal expansion efficient, high tensile strength, corrosion resistance, wear resistance, light weight and anti-UV and so on because of the FRP material.
Patent TW-200948406-A (TW)
Title: Needle unit comprising a rotatable piercing means
Inventor: KAENEL CELINE
IPC: A61M5/162
Filed: 2009-05-12
Abstract: The invention relates to a needle unit, comprising a fastening section, by way of which the needle unit can be attached to a product container, and a piercing means, by way of which a closure of the product container can be pierced as the needle unit is attached to the product container, wherein the fastening section can be rotated relative to the piercing means.
Patent TW-201041311-A (TW)
Title: Oscillation circuit, timing device, and electronic system utilizing the same
Inventor: JEN MING
IPC: G04G3/00
Filed: 2009-05-14
Abstract: An oscillation circuit includes a first transistor, a second transistor, a current source, a first inverter, and an impedance unit. The first transistor includes a first source receiving a first operation voltage, a first drain, and a first gate coupled to the first drain. The second transistor includes a second source receiving the first operation voltage, a second drain, and a second gate coupled to the first gate. The current source coupled between the first drain and a grounding voltage. The first inverter generates an oscillation signal and includes a first input terminal, a first output terminal, and a first power terminal coupled to the second drain. The impedance unit is coupled between the first input terminal and the first output terminal.
Patent TW-201013980-A (TW)
Title: Light-emitting chip and light-emitting apparatus having such a light-emitting chip
Inventor: TONHOFER FREDERIC
IPC: F21K99/00
Filed: 2009-05-20
Abstract: A light-emitting chip comprises at least one semiconductor structure (12) which emits light when a voltage is applied and which comprises at least one bond area (28, 24c), and also a support substrate (32) which carries the semiconductor structure (12). On at least one face area (34, 36) projecting over the semiconductor structure (12), the support substrate (32) carries a contact layer (38, 40) which is electrically conductively connected to the bond area (28, 24c) of the semiconductor structure (12). In addition, a light-emitting apparatus (56; 62; 64; 72; 86; 90; 92; 132) is specified with at least one semiconductor structure (12) which emits light when a voltage is applied and which comprises at least one bond area (28, 24c), and with at least one connection device (58, 60; 68, 70; 82) which can be connected to a voltage source and which is electrically conductively connected to the bond area (28, 24c) of the semiconductor structure (12). At least one light-emitting chip (10, 10') according to one of claims 1 to 10 is provided, wherein the connection device (58, 60; 68, 70; 82) is electrically conductively connected to the contact layer (38, 40) of the light-emitting chip (10, 10').
Patent TW-201044248-A (TW)
Title: System and method for changing and scrolling pages
Inventor: CHEN WEI-YUAN
IPC: G06F3/048
Filed: 2009-06-02
Abstract: The present invention provides a system and method for changing and scrolling pages. The system include a interface generating module, a cursor detecting module, a page changing module, and a page scrolling module. The interface generating module generates a page controller interface, wherein the page controller interface includes a pull down menu, a changing page key and a scrolling page key. The cursor detecting module detects a cursor displayed on a current page in time, and determines whether the cursor is within the page controller interface. The page changing module changes the current page to the destination page when a page number of the pull down menu is selected, and changes the current page to forward or backward when the changing page key is clicked in a left or right direction. The page scrolling module scrolls page up or down when the scrolling page key is clicked in a up or down direction.
Patent TW-201104874-A (TW)
Title: Digital X ray detecting panel and method for manufacturing the same
Inventor: SHU FANG-AN
IPC: H01L31/00
Filed: 2009-07-28
Abstract: A digital X ray detecting panel includes a light wavelength transforming layer and a photo electric detecting plate. The light wavelength transforming layer is configured for transforming X ray into visible light. The photo electric detecting plate is disposed under the light wavelength transforming layer. The photo electric detecting plate includes a substrate and a number of photo electric detecting units. The photo electric detecting units are disposed on the substrate and arranged in an array. Each of the photo electric detecting units includes a thin film transistor and a photo electric diode electrically connected to the thin film transistor. The thin film transistor has an oxide semiconductor layer. The digital X ray detecting panel can prevent a photocurrent in the thin film transistor, thereby improving detecting accuracy of the digital X ray detecting panel. A method for manufacturing the digital X ray detecting panel is also provided.
Patent TW-201013993-A (TW)
Title: Optoelectronic semiconductor chip and method for its manufacture
Inventor: LUTGEN STEPHAN
IPC: H01L33/00
Filed: 2009-07-29
Abstract: An optoelectronic semiconductor chip (1) is described, it includes a non-planar growth-layer (2), which contains at least one first nitride compound semiconductor material; an active area (5), which contains at least one second nitride compound semiconductor material and is arranged on the growth-layer (2); and a cover-layer (7), which is arranged on the active area (5), where the growth-layer (2) has structure elements (4) on a growth-surface (3) that faces the active area (5).
Patent TW-201018544-A (TW)
Title: Polishing method and apparatus
Inventor: TAKAHASHI TARO
IPC: B24B21/00
Filed: 2009-07-29
Abstract: The present invention relates to polishing methods and apparatuses for polishing and flattening a polishing target (substrate) such as semiconductor wafer. The polishing method presses the substrate of polishing target against a polishing surface on a rotating polishing table and polishes it. During the polishing of the substrate, an eddy current sensor provided in the polishing table scans a polished surface of the substrate along with the rotation of the polishing table, and an output of the eddy current sensor obtained by scanning the polished surface of the substrate is monitored, so as to detect damages of the substrate from variation of the output of the eddy current sensor. Moreover, an output of an end point detecting sensor obtained by scanning the polished surface of the substrate is monitored, so as to detect a polishing end point from variation of the output of the end point detecting sensor. After the polishing end point being detected, an output of a sensor different from the end point detecting sensor is monitored, so as to perform a residual film monitoring for detecting a film remaining on a part of the substrate.
Patent TW-201010790-A (TW)
Title: Exhaust gas-processing method and exhaust gas-processing apparatus
Inventor: KAWABATA HIROFUMI
IPC: B01D53/34
Filed: 2009-08-26
Abstract: An exhaust gas-processing method of the present invention includes sequentially introducing an exhaust gas from a semiconductor production apparatus to a combustion-based detoxifying device, a dust collector, and two-step gas-cleaning device, so as to process the exhaust gas, wherein the two-step gas-cleaning device is comprised of a first gas-cleaning device and a second gas-cleaning device, and gas cleaning is performed in the first gas-cleaning device that uses water as a cleaning solution and subsequently in the second gas-cleaning device that uses an alkaline aqueous solution as a cleaning solution.
Patent TW-201109560-A (TW)
Title: Supporting device
Inventor: JIANG BIN
IPC: H05K7/14
Filed: 2009-09-11
Abstract: A supporting device includes a fixing subassembly, a pivoting part, and a supporting part. The fixing subassembly defines a receiving portion and a plurality of grooves. The two ends of the pivoting part are pivotally connected to the fixing subassembly and the supporting part. One end of the supporting part is slidablely disposed in the grooves. An angle is formed between the pivoting part and the supporting part. When the supporting part is disposed in the different grooves, the angle between the pivoting part and the supporting part is changed. At the same time, the angle between the fixing subassembly and the supporting part is also changed. So that the user can adjust the angle of view as they want.
Patent TW-201110271-A (TW)
Title: Semiconductor device
Inventor: MATSUMOTO CHIKAKO
IPC: H01L21/822
Filed: 2009-09-22
Abstract: To easily detect in a semiconductor device whether a voltage within the specifications of the semiconductor device is obtained. The semiconductor device includes a detecting circuit that detects an output voltage of an inner circuit of the semiconductor device and judges whether the output voltage is within or out of the specifications of the semiconductor device. A signal for determining whether an output voltage is within or out of the specifications is transmitted from the detecting circuit to a digital circuit, and the digital circuit performs or stops circuit operation in accordance with the signal.
Patent TW-201111151-A (TW)
Title: Mold
Inventor: HUANG CHIEN-FENG
IPC: B29C45/26
Filed: 2009-09-30
Abstract: A mold includes a male die, a female die, a male mold core, a female mold core and an ejecting structure. The male die is opposite to the female die. The male mold core is received in the male die. The female mold core is received in the female die and is adapted for cooperating with the male mold core thereby forming a cavity for molding components. The ejecting structure includes a lower board, an ejector pin, a holding board and a displacement restrictor. The holding board is opposite to the lower board, and defined a receiving hole along the axis of the male mold core. The displacement restrictor is fixed in the receiving hole of the holding board, and defines a restricting hole along the axis of the male mold core. The ejector pin includes an ejector pole and an ejector block cooperated with each other. The ejector pole is fixed at the lower board, the ejector block is adapted for moving along the axis of the male mold core in the restricting hole and ejecting the male mold core according to a driving force of the lower board and the ejector pole.
Patent TW-201022947-A (TW)
Title: Bus-handling device and method
Inventor: FLACHS VICTOR
IPC: G06F1/24
Filed: 2009-10-07
Abstract: A processor, comprising a processing unit having an active state and a sleep state in which at least one of its sub-sections is inactive and a communication port adapted to receive signals from external units over a bus, which is configured to be not fully operative when the processor is in the sleep state. The processor additionally includes a bus monitoring unit configured to stall the bus responsive to identifying transmissions on the bus directed to the communication port, while the processing unit is in the sleep state and to indicate to the communication port that a transmission started while it was in the sleep state. A method for handling a bus is also disclosed herein.
Patent TW-201113352-A (TW)
Title: Phosphors, fabricating method thereof, and light emitting device employing the same
Inventor: WANG SHIAN-JY
IPC: C09K11/81
Filed: 2009-10-12
Abstract: The invention provides a phosphor composed of (M1-xREx)9M'(PO4)7 or M9(M'1-yRE'y) (PO4)7, wherein M is Mg, Ca, Sr, Ba, Zn or combinations thereof; M' is Sc, Y, La, Gd, Al, Ga, In or combinations thereof; RE is Pr, Nd, Eu, Gd, Tb, Ce, Dy, Yb, Er, Sc, Mn, Zn or combinations thereof; RE' is Pr, Nd, Gd, Tb, Ce, Dy, Yb, Er, Bi or combinations thereof; 0.001 ≤ x ≤ 0.8, and 0.001 ≤ y < 1.0. Under excitation, this phosphor of the invention emits visible light and may be collocated with other phosphors to provide a white light illumination device.
Patent TW-201030098-A (TW)
Title: Rubber composition and polyamide laminate
Inventor: OKUSHITA HIROSHI
IPC: C08G69/40
Filed: 2009-10-20
Abstract: Disclosed is a rubber composition used as a material for a cross-linked rubber for a laminate of polyether polyamide elastomer and the rubber. The rubber composition includes 35-80 parts by mass of silica (B), 0.5-10 parts by mass of a plasticizer having a prescribed structure (C), and 0.1-3 parts by mass of a cross-linking agent (D) with respect to 100 parts by mass of a natural rubber and/or a diene series synthetic rubber (A); the polyamide laminate is formed by laminating a polyether polyamide elastomer obtained by polymerizing a prescribed material and a cross-linked rubber obtained from the rubber composition; and the polyamide laminate, with a high interlayer adhesive force between the polyamide elastomer and the cross-linked rubber, and the material for the cross-linked rubber are provided.
Patent TW-201115776-A (TW)
Title: Method for manufacturing light-emitting diode chip
Inventor: SU YAN-KUIN
IPC: H01L33/00
Filed: 2009-10-20
Abstract: A method for manufacturing a light-emitting diode (LED) chip is described. The method includes the following steps. A substrate including a first surface and a second surface on two opposite sides is provided. A plurality of scribe lines are formed in the first surface of the substrate by laser, wherein the scribe lines includes a laser residue. The laser residue is removed. An illuminant epitaxial structure is formed on the first surface of the substrate outside the scribe lines. The illuminant epitaxial structure includes a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer. A transparent conductive layer is formed on the second conductivity semiconductor layer. A first electrode and a second electrode are respectively formed on the first conductivity type semiconductor layer and the second conductivity type semiconductor layer. An external force is applied on the second surface of the substrate to divide the substrate along the scribe lines, so as to form a plurality of light-emitting diode chips.
Patent TW-201039388-A (TW)
Title: Method for fabricating patterns on a wafer through an exposure process
Inventor: YANG HYUN-JO
IPC: H01L21/308
Filed: 2009-10-22
Abstract: A method for forming patterns on a wafer includes forming a fence having a sloped face in an edge portion of the wafer. The sloped face is direct to an inside of the wafer. A first photoresist layer is formed which extends to cover the fence on the wafer. First photoresist patterns are formed by performing a first exposure and development on the first photoresist layer. An etch process is performed using the first photoresist patterns and the fence as an etch mask. The fence is formed by selectively exposing a negative resist using a light shielding blade, and at this time, the first photoresist layer is formed including a positive resist.
Patent TW-201117358-A (TW)
Title: Electronic device and fabrication method thereof and memory device
Inventor: LIN CHIH-HAO
IPC: H01L23/52
Filed: 2009-11-03
Abstract: The embodiment provides an electronic device and fabrication method thereof and a memory device. The electronic device includes a substrate. A trench is formed in the substrate. A diffusion region formed in a portion of the substrate adjacent the trench. A conductive structure is disposed in the trench. The conductive structure includes a conductive layer having a recess covers a bottom of the trench. The diffusion region is exposed from the recess. A conductive plug fills the recess, covering sidewalls of the diffusion region. A barrier layer is disposed between the conductive plug and the conductive layer.
Patent TW-201025465-A (TW)
Title: Method for encapsulating an electronic device
Inventor: ELLINGER JAN
IPC: H01L21/56
Filed: 2009-11-04
Abstract: The present invention concerns a method for encapsulating an electronic device to against permeate, which uses a pressure-sensitive adhesive based on butylene block polymers, in particular isobutylene block polymers and applies the pressure-sensitive adhesive on and/or around the domains to be encapsuled of the electronic device.