baber/WOPTO huggingface dataset:
Patent JP-2005022023-A (JP)
Title: Cutting tool made of surface coated cubic boron nitride group sintered material with hard coating layer exhibiting excellent chipping resistance in heavy cutting
Inventor: NAKAMURA KEIJI
IPC: C23C14/06
Filed: 2003-07-01
Abstract: <P>PROBLEM TO BE SOLVED: To provide a cutting tool made of a surface coated cubic boron nitride group sintered material with a hard coating layer exhibiting excellent chipping resistance in heavy cutting.  <P>SOLUTION: This cutting tool made of the surface coated cubic boron nitride group sintered material is formed by physical vapor deposition of the hard coating layer comprising a compound nitride of Ti, Al and Ce, in the average layer thickness of 0.5-10 μm on the surface. The hard coating layer has a component concentration distribution structure wherein Al maximum content points and Al minimum content points exist in alternate repetition at prescribed spaces along a layer thickness direction, and the content rates of Ti and Al continuously change from the Al maximum content point to the Al minimum content point and from the Al minimum content point to the Al maximum content point. Further, the Al maximum content points satisfy a specific composition formula respectively, and the spacing of the adjacent Al maximum content points and Al minimum content points is 0.01-0.1 μm.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005026972-A (JP)
Title: Monolithic high frequency amplifier
Inventor: YAMANAKA KOJI
IPC: H03F3/193
Filed: 2003-07-01
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a monolithic high frequency amplifier which compensates the variations of threshold voltages resulting from process variations without mounting a bias circuit having a complicated configuration.  <P>SOLUTION: The monolithic high frequency amplifier is so constituted that a transistor 7 exclusively for DC operation which is manufactured by a device process system different from that for a high frequency transistor 3 gives a constant current bias to the high frequency transistor 3. Thus, the effect of compensating the variations of the threshold voltages resulting from process variations is taken without mounting the bias circuit having a complicated configuration.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005024440-A (JP)
Title: Noncontact temperature detecting apparatus
Inventor: ISHIKAWA CHUJI
IPC: G01J5/04
Filed: 2003-07-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a noncontact temperature detecting apparatus capable of acquiring correct temperatures even in the case that stains adhere to a section on which infrared rays are incident.  <P>SOLUTION: The noncontact temperature detecting apparatus is constituted so as to correctly detect the temperature of a first measurement surface 9 detected by a first noncontact temperature sensor 3 by a noncontact temperature sensor 11. The temperature detecting apparatus corrects temperatures detected by a second noncontact temperature sensor 4 on the basis of deviations of temperatures detected by the sensors 3 and 11. The second noncontact temperature sensor 4 detects the temperature of a second measurement surface 10 to be measured.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005022725-A (JP)
Title: Inner bag for can container
Inventor: HARA TAKUMA
IPC: B65D33/36
Filed: 2003-07-04
Abstract: <P>PROBLEM TO BE SOLVED: To make it possible to push out a bag body from a mouthpiece and to fix a discharge opening on the mouthpiece as to an inside bag the discharge opening of whose body stored in a can container such as a drum can air-tightly closed with a top panel and sealed with a cap is formed to protrude from the mouthpiece.  <P>SOLUTION: This inner bag comprises a small diameter part formed on the lower outside of a discharge opening, a tubular body fitted rotatively on the small diameter part, a catching nail protruding at the bottom end of the discharge opening for supporting the tubular body, a spiral thread formed on the outside of the tubular body to be screwed on or unscrewed from the mouthpiece, and a bag body folded long and slender whose opening part is fixed on the discharge opening. The outer diameter of the discharge opening, the cap and the folded bag body is smaller than the inner diameter of the mouthpiece.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004091478-A (JP)
Title: Ovicide to egg of noxious insect in clothing and ovicidal method to the egg of noxious insect in clothing
Inventor: MATSUBARA AKIMASA
IPC: A01N31/14
Filed: 2003-07-08
Abstract: <P>PROBLEM TO BE SOLVED: To obtain an ovicide having excellent ovicidal effect on eggs of noxious insects in clothing, to provide an ovicidal method, and to obtain a thermally-transpiring aqueous insecticide of liquid absorption type.  <P>SOLUTION: The ovicide to the eggs of the noxious insects in the clothing contains one, two or more kinds of glycol etheres selected from the group consisting of propylene glycol monopropyl ether, propylene glycol monobutyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether, dipropylene glycol dimethyl ether, ethylene glycol monoisobutyl ether, diethylene glycol monoisobutyl ether, diethylene glycol dibutyl ether, diethylene glycol dimethyl ether, and triethylene glycol dimethyl ether.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2005033887-A (JP)
Title: Operation inspection system for digital protection relay device
Inventor: HORIIKE MASASHI
IPC: H02H3/05
Filed: 2003-07-10
Abstract: <P>PROBLEM TO BE SOLVED: To allow simple operation confirmation by shortening a non-protected time of a protection relay device.  <P>SOLUTION: A trip signal is set at a DO circuit (S3). An answer signal to the trip signal is taken in a DI circuit (S4 and S10), for operation inspection of on/off of the DO circuit, DI circuit, and a trip circuit (S5 and S11). The operation inspection is completed before a breaker acts and after the operation of an auxiliary relay of the trip circuit, to allow the auxiliary relay to reset. The operation inspection includes taking an output signal of the DO circuit as it is as the answer signal to the DI circuit, to complete confirmation of inspection operation before the operation of the auxiliary relay.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005037450-A (JP)
Title: Ferrule and linked ferrule
Inventor: OSHIMA TAKESHI
IPC: G02B6/42
Filed: 2003-07-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a ferrule which is composed of both of synthetic resin and metal for the sake of lower cost and is capable of preventing the breaking of attached optical fiber cable.  <P>SOLUTION: The ferrule 1 is attached to the terminal of the optical fiber cable 7, is stored in a housing and constitutes an optical connector. The optical fiber cable 7 is provided with an optical fiber 8 and a sheath part 6. The ferrule 1 is provided with a fiber fixing part 20 made of sheet metal, an optical connection part 21 and a flange member 22. The fiber fixing part 20 is formed tubularly, is caulked with the optical fiber cable 7 and is fixed. The optical connection part 21 is formed tubularly and is fixed with the fiber fixing part 20. The flange member 22 is formed annularly and is attached to the outside of the fiber fixing part 20. The flange member 22 is provided with a protrusion 34 which protrudes from the edge 23a of the fiber fixing part 20 in the direction parting from the optical connection part 21. A recess 35 is formed on the protrusion 34.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005038024-A (JP)
Title: Network service retrieval method
Inventor: IMAI TATSUYA
IPC: G06F17/30
Filed: 2003-07-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a network service retrieval method capable of dividing and transmitting a retrieval condition within a restriction range of a data length, combining retrieved results shown in response to the divided retrieval conditions, and thereby enabling the retrieval of a detailed network service independent of the restriction range of the data length.  <P>SOLUTION: In this network service retrieval method, the first retrieval condition for retrieving a desired service provided through a network is divided so as not to become longer than a prescribed data length, to thereby generate a plurality of second retrieval conditions, and while restoring the first retrieval condition from the plurality of second retrieval conditions, the retrieved results in response to the second retrieval conditions received from the network are synthesized following a logic operation designated by the first retrieval condition, to thereby acquire a retrieval result in response to the first retrieval condition.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005038095-A (JP)
Title: Generation method for reputation information in community, system, reputation evaluation device, common board for communication, and program for the same
Inventor: TAKAHASHI HIROYUKI
IPC: G06Q40/02
Filed: 2003-07-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a function that helps transaction or credit rating in the absence of transaction between participants or the absence of a third party institution for credit rating.  <P>SOLUTION: A reputation information generation method in a community comprises steps of asking a participant to input evaluations of other participants obtained by communication with other participants as evaluation data, accumulating the evaluation data, sending them to terminals of other participants having communicated with the first participant, evaluating the reputation of the first participant according to such accumulated evaluation data, referring to a common board for communication via a communication control part if the evaluation data do not reach a data amount necessary for evaluation, and if any participants have reputation data on other participants, disclosing the reputation data provided that the holder participants approve requests for reputation data disclosure.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005043940-A (JP)
Title: Computer system
Inventor: FUJITA HIROBUMI
IPC: G06F12/00
Filed: 2003-07-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a computer system, in which when dividing a computer system composed of a plurality of computing nodes to a plurality of computer systems without stopping the operation, the data and operating state retained by an operating system on the computer system before dividing to a computing node that is to be each computing system after division; and a computing node therefor.  <P>SOLUTION: A duplicate of the data and operating state retained by the operating system is created on all computing nodes to be divided. Each computing node includes a data copy execution means 300, a copy object address table 400, and a copy object address table management means 500, and copies the data written to the own computing node also to the other computing nodes.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005020681-A (JP)
Title: Apparatus for correcting output of image sensor
Inventor: SHINOZUKA NORIYUKI
IPC: H04N5/335
Filed: 2003-06-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide an apparatus for correcting the output of an image sensor capable of easily and quickly obtaining the gain correction value without the need for provision of a CPU with high arithmetic processing capability at all.  <P>SOLUTION: The apparatus for correcting the output of the image sensor for using an offset correction value and the gain correction value stored in advance in a correction memory to apply offset correction and gain correction to an output of each pixel outputted from the image sensor thereby eliminating the variations in the output of each pixel uses the memory wherein the result of dividing a target value of the gain correction by an output of each pixel onto which light with a prescribed luminous quantity is made incident as a table form in advance and obtains the gain correction value from a result of division of a value read in response to an address of each pixel from the memory.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005063990-A (JP)
Title: Semiconductor manufacturing equipment
Inventor: NATSUHARA MASUHIRO
IPC: H01L21/31
Filed: 2003-08-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide semiconductor manufacturing equipment which is reduced in entire volume, suppresses occurrence of particles, and prevents any damages to a wafer due to falling thereof when mounting and demounting it.  <P>SOLUTION: A wafer holder is supported by an electrode for supplying power to an electric circuit formed inside or on the surface of the wafer holder, resulting in eliminating any member for supporting the wafer holder and hence reducing the volume of a container. Since there are a few components, the occurrence of particles is suppressed. The electrode is fixed to a base, and lift pins are set and fixed in the container of the semiconductor manufacturing equipment. By driving the base up and down, the wafer holder is driven up and down, allowing the lift pins to project on the top face of the wafer holder and to retreat under the top face of the wafer holder to mount and demount the wafer, resulting in preventing the falling of the wafer when mounting and demounting it.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005064607-A (JP)
Title: Communication terminal
Inventor: TAKAGI TOMOHITO
IPC: H04N1/32
Filed: 2003-08-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a communication terminal capable of issuing a communication certificate on each occasion when making transmission to a destination.  <P>SOLUTION: A communication certificate setting column is provided to a one-touch / abbreviation registration table 5a, the communication certificate is set to a destination to which the communication certificate is desirably issued, a one-touch key is operated to start one-touch dial transmission, when the transmission is finished (steps ST 21 to ST 23), the one-touch / abbreviation registration table 5a is referenced (steps ST 24, ST 25), when the communication certificate is set to the setting column corresponding to the operated one-touch key, the communication certificate is printed (step ST 26). When no setting is made to the communication certificate setting column, no communication certificate is printed.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005069720-A (JP)
Title: Method for quantifying target substance and probe carrier used therein
Inventor: YAMAMOTO NOBUKO
IPC: C12Q1/68
Filed: 2003-08-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for simply quantifying a plurality of target substances in a solution at the same time.  <P>SOLUTION: This method for quantifying the target substances has a process for preparing a probe carrier wherein probes capable of being specifically bonded to the target substances are bonded to a carrier at a known position, a process for bringing the carrier into contact with the solution to bond the target substances to the probes and a process for measuring the amounts of the target substances bonded to the probes. The probe carrier has the probes bonded to the target substances, of which the respective amounts are more than those of the target substances in the solution, fixed thereto.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005030323-A (JP)
Title: Valve drive device
Inventor: TSUZUKI KATSUYA
IPC: H02K33/16
Filed: 2003-07-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide a valve drive device capable of consistently opening/closing a valve.  <P>SOLUTION: The valve drive device comprises a core 22 with an electromagnetic coil 21 wound therearound, a stator 20 having a yoke 23 on the outer side thereof and three magnetic pole pieces 24, 25 and 26 substantially on the same line, a rotor 30 which is advanced/retracted parallel to the line to connect the magnetic pole pieces and provided with a magnetizing member having two magnetizing surfaces of different polarity, a valve 11 connected to the rotor, and guide members 43, 45 and 53 which are brought into slidable contact with the side surface of the rotor to guide advancement/retraction of the rotor. In the valve drive device, a slide member 46 is provided on at least one of the side surface of the rotor and the guide surfaces of the guide members which are brought into slidable contact with each other.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005039100-A (JP)
Title: Circuit component for highly thermally conductive light emitting device, and high heat dissipation module
Inventor: BABA DAIZO
IPC: H01L23/36
Filed: 2003-07-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a circuit component for highly thermally conductive light emitting device capable of satisfactorily obtaining high thermal conductivity, and of raising light emission efficiency by uniformly reflecting light emitted from a light emitting device.  <P>SOLUTION: A structure 3 is constructed by laminating and integrating at least two or more of metal bodies 1 through an insulating layer 2. A recessed part 15 is formed so as to stride the at least two or more of the metal bodies 1 of the structure 3. The light emitting device 4 is mounted on a bottom surface 16 of the recessed part 15. A reflection surface 8 is formed on an inside surface 17 of the recessed part 15. The metal bodies 1 are employed as a circuit 5.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005038274-A (JP)
Title: Shipping slip issuing system
Inventor: MIYAHARA SHUNJI
IPC: G06Q50/10
Filed: 2003-07-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a shipping slip issuing system for issuing a shipping slip for shipping a purchased commodity, which can easily rapidly form the shipping slip.  <P>SOLUTION: When a tour customer purchases a commodity in a souvenir shop and presents a name card 100, information for destinations recorded in the name card 100 by a two-dimensional code is read by a two-dimensional code scanner 22, and a destination list is displayed on a screen of a display device of a terminal 21. When the tour customer selects one or a plurality of desired destinations from the destination list, a shipping slip with each destination selected by the tour customer printed thereon is issued by a printer 23. The souvenir shop delivers the commodity to each destination with the shipping slip stuck thereto.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005045023-A (JP)
Title: Manufacturing method of semiconductor device and manufacturing device for semiconductor
Inventor: KUROSAWA TETSUYA
IPC: H01L21/52
Filed: 2003-07-22
Abstract: <P>PROBLEM TO BE SOLVED: To suppress chipping generated upon dicing of an especially thinned semiconductor wafer and to reduce the failure generating rate of a semiconductor device through the processes from dicing to bonding.  <P>SOLUTION: A semiconductor manufacturing device 11 is equipped with a pickup unit 12 for picking up an individualized semiconductor element from a semiconductor wafer 16, a film bonding unit 13 for bonding an individualized element bonding film to the rear surface of the semiconductor element in accordance with the configuration of the element, and an element bonding unit 14 for bonding the semiconductor element onto a substrate for forming the semiconductor device.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004068016-A (JP)
Title: Method for manufacturing foamed polypropylene resin particle, and formed polypropylene resin particle
Inventor: SASAKI HIDEHIRO
IPC: C08J9/18
Filed: 2003-07-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide foamed polypropylene resin particles which is heat-molded under a lower steam pressure than that required for heat-molding of conventional propylene resin particles, and formed into a foamed molding having a sufficient rigidity and a heat resistance.  <P>SOLUTION: In a method for manufacturing foamed particles, a core layer is formed of a polypropylene resin, and an outer layer is formed of a polypropylene resin. The relation between the polypropylene resin melting point of the outer layer and that of the core layer meets a particular formula. The multilayer particles to be foamed having an outer layer thickness of ≤30 μm are impregnated with a foaming agent, and the multilayer resin particles impregnated with the foaming agent in a heat-softened state are foamed.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2005050682-A (JP)
Title: Shield structure of jack
Inventor: WATANABE KENICHI
IPC: H01R13/648
Filed: 2003-07-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a shield structure of a jack capable of conducting jamming electric power leaking into a ground line of a grounding terminal or the like of the jack to a shassis of a nearest part with a simple structure, capable of lowering a level of the jamming electric power.  <P>SOLUTION: On the shield structure of the jack, structured so that a lateral printed base board 3 is arranged on an upper side of the chassis located at the inside of a rear panel 2 at the back side of the chassis 1, and a lower face of the jack 4 mounted to the inside of the rear panel contacts a front face of the printed board, the jamming electric power leaking into the jack is shielded by soldering a grounding terminal 4a of the jack on a ground pattern 5 formed on a back face of the base board, forming a semispheric protuberant part 6 protruding toward the back face of the base board at the neighboring area of the grounding terminal of the jack on the chassis, adhering a conductive gasket 7 arranged between an upper face of the protuberant part 6 and the ground pattern to the back face of the base board, forming a screw-fixing position of the rear panel and the jack at a position of fixing the gasket to the base board, and by guiding the jamming electric power leaking into the ground line of the grounding terminal or the like of the jack from the ground terminal to the chassis through the ground pattern and the conductive gasket.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005051112-A (JP)
Title: High frequency semiconductor device
Inventor: YAMAMOTO MAKOTO
IPC: H01L23/06
Filed: 2003-07-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a high frequency semiconductor device capable of stably transmitting a signal also in millimeter waves without causing resonance.  <P>SOLUTION: A semiconductor device 3 is mounted on the surface of a dielectric substrate 4. A recessed cover 1 is disposed on the dielectric substrate 4 to cover the semiconductor device 3. The recessed cover 1 is made of conductive ceramics.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005047473-A (JP)
Title: Suspension device
Inventor: MORI SHUNSUKE
IPC: B60G17/027
Filed: 2003-07-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a suspension device capable of excellently avoiding inclination of a vehicle body.  <P>SOLUTION: Check valves 70FL, 70FR, 70 RL and 70RR to prevent the flow in the direction opposite to the oil discharging direction are provided on oil discharge branch passages 16FL, 16FR, 16RL and 16RR, respectively. When an engine 8 is stopped, an F/S valve 33 is opened, an oil discharge side pilot non-return valve 22 is closed. When a flow control valve 5 (5FL, 5FR, 5RL and 5RR) is in an oil discharge state (oil discharge position), the check valves 70FL, 70FR, 70 RL and 70RR regulate the flow of oil, and no oil flow into a cylinder 2 from oil discharge front and rear side passages 17 and 18. Therefore, the inclination of a vehicle body is small even when occupants get on or get off or cargoes are loaded/unloaded while the engine is stopped.  <P>COPYRIGHT: (C)2005,JPO&NCIPI