baber/WOPTO huggingface dataset:
Patent TW-438719-B (TW)
Title: Flexible graphite sheet with decreased anisotropy
Inventor: MERCURI ROBERT ANGELO
IPC: F16J15/34
Filed: 1998-06-08
Granted: 2001-06-07
Abstract: Flexible graphite sheet is made by compressing a mixture of relatively large particles of intercalated, exfoliated, expanded natural graphite with smaller particles of intercalated, exfoliated expanded, expanded particles of natural graphite. The resulting sheet of flexible graphite exhibits increased electrical conductivity through the thickness (""c"" direction) of the sheet and improved sealability perpendicular to the ""c""direction.
Patent TW-411271-B (TW)
Title: Apparatus for readily dispensing moisture sensing tape, moisture sensing readily-dispensable tape for diapers, and associated methods
Inventor: AI-SABAH SABAH NASER
IPC: A61F13/42
Filed: 1998-07-14
Granted: 2000-11-11
Abstract: A moisture sensing tape dispensing apparatus, moisture sensing readily dispensable tape, and associated methods are provided. The apparatus preferably includes a tape dispensing container, a continuous strip of light-weight, moisture sending tape positioned within the dispensing container, and a tape separator connected to the dispensing container for separating the continuous strip of moisture sensing tape into pieces thereof to be used in association with sensing moisture from a diaper. The moisture sensing readily-dispensable tape for diapers preferably  has an elongate strip of material having two major surfaces. A color changing material is associated with the strip of material and responsive to the sensing of moisture for changing the color of at least a portion of the strip. A pressure-sensitive adhesive material is formed on only one of the two major surfaces thereof in an alternating spaced-apart pattern for adhesively attaching the tape to at least one surface of a diaper.
Patent TW-371322-B (TW)
Title: A prober board, and a probing method and a probing apparatus
Inventor: KOBAYASHI SHIGETAKA
IPC: H01L21/66
Filed: 1998-07-16
Granted: 1999-10-01
Abstract: It is the object of the present invention to provide a plate-like prober that can cope with a tiny pitch and that ensures a superior connection. A prober board, for an electrical connection between a testing machine and a conductive pad on a test object, comprises: an insulating substrate, having a linear expansion coefficient that is equal to or smaller than five times a linear expansion coefficient of the test object; and a conductive probe portion, formed on the insulating substrate and having a pitch l that is substantially the same as or slightly smaller than a pitch l' of the conductive pad. During the testing, only the prober board is heated to compensate for a difference in the pitches of the conductive pad and of the probe portion, and positioning is performed by using the difference between their linear expansion coefficients.
Patent TW-389873-B (TW)
Title: Software installation and testing for a build-to-order computer system
Inventor: AMBERG RICHARD D
IPC: G06F9/445
Filed: 1998-07-27
Granted: 2000-05-11
Abstract: A method for installing and/or testing software for a build-to-order computer system having a plurality of components includes plurality of elements. The computer system has an associated step sequence. The step sequence includes a plurality of steps where each step includes at least one command and step is associated with a respective component descriptor. A component descriptor corresponds to a respective component of the computer system. The method includes accessing a command within the step sequence; creating a file including a start of execution indication; executing the command; deleting the file including the start of execution indication when the command completes execution; and repeating the accessing, creating, executing and deleting for the plurality of steps.
Patent TW-410351-B (TW)
Title: Enclosed switchgear and disconnection section bushing
Inventor: OSHIRO TAKASHI
IPC: H02B11/00
Filed: 1998-08-29
Granted: 2000-11-01
Abstract: The present invention provides a small-sized and light disconnection section bushing with an excellent withstanding voltage and enough strength to resist external force, and an enclosed switch gear having the disconnection section bushing. The disconnection section bushing comprises: a connecting conductor 14 for supporting its base, and an insulation cylinder 10 for covering the peripheral of the connecting conductor 14; a fastening flange 8 arranged on the edge of an opening side of the insulation cylinder 10. On the edge of the fastening flange 8, there is a bent portion 8a curved toward the bottom surface of the insulation tube 14 from the viewpoint of the sectional axis.
Patent TW-424365-B (TW)
Title: Transmission system with improved reconstruction of missing parts
Inventor: RAPELI JUHA
IPC: G10L11/00
Filed: 1998-09-19
Granted: 2001-03-01
Abstract: In a transmission system a signal to be transmitted by a first node (2) is applied to an encoder (8) and is transmitted by a transmitter (10) to a second node (6). In the second node (6) the signal from the transmission medium (4) is received by the receiver (12) and passed to a selector (18), directly and via an interpolator (14). By delaying the decoding of the signal in the case transmission errors occur, which lead to missing frames, it becomes possible to complete the missing frames by interpolation.
Patent TW-424050-B (TW)
Title: High-temperature broad-band microwave composite material
Inventor: HOU TIEN-I
IPC: B32B18/00
Filed: 1998-10-23
Granted: 2001-03-01
Abstract: The present invention relates to a high-temperature broad-band microwave composite material of a sandwich structure, in which the skin layers are made of a composite material of a fiber-reinforced plastic material, the middle layer is made of ceramic hollow balls coated with a plastic material. The production process thereof comprises forming the inner skin layer, forming the outer skin layer, forming the middle layer, and integrally hardening the material. The characteristic of the present invention comprises that the middle layer uses ceramic hollow balls to replace a conventional honeycomb plate where the thickness of the middle layer is easily adjustable while avoiding the defect where the honeycomb plate is easy to be squeezed and deformed in a curve structure.
Patent TW-455972-B (TW)
Title: Defect analysis method and process control method
Inventor: MUGIBAYASHI TOSHIAKI
IPC: G01N21/956
Filed: 1998-12-10
Granted: 2001-09-21
Abstract: The present invention relates to a kind of defect analysis method that can quantitatively control the effects of defect quantity for a process itself on the product yield. The solving means of this invention is briefly described in the following. After the existence of new defects caused by performing the predetermined process onto the chip units and whether they are bad or not are judged by using an electric tester, plural chips on the wafer are classified into four groups: (1) having no new defect, good product; (2) having no new defect, bad product; (3) having new defect, good product; (4) having new defect, bad product. Based on the classification results, the followings are to be found out: conjecturing the number of new bad chips for the quantity of bad chips caused only by the new defect of predetermined process; deducing the fatal rate of the ratio for making chip become bad due to the new defect of predetermined process; and deducing the number of bad chips of process for the number of chips that become bad due to the predetermined process.
Patent TW-390056-B (TW)
Title: Method of manufacturing high density electrical connector and positioning the terminals thereof and product thereof
Inventor: LI MING-WU
IPC: H01R12/50
Filed: 1998-12-24
Granted: 2000-05-11
Abstract: The present invention relates to a method of manufacturing a high density electrical connector and a method of positioning the terminals of such a connector and a product thereof, particularly to a high density electrical connector having a larger amount of terminals and capable of transmitting a large amount of data to different electric devices. The terminals of the electrical connector, after an injection molding technique directly mounted in the mold and through two injection molding, are tightly connected to the insulation part of the electrical connector, in which the semi-product after a first injection molding has an appropriate channel and vent hole for assisting the structure of the second injection molding. Furthermore, the semi-product from the first injection molding can directly position the terminals at an accurate position, and allow the terminals that are not positioned to be re-adjusted before performing the second injection molding. This method can increase the correct positioning of the terminals after injection molding, and increase the yield of molding for the insulation part thereby increasing the production performance.
Patent TW-401482-B (TW)
Title: Internal combustion engine with improved output power
Inventor: MEYER SIEGFNIED
IPC: F02B1/14
Filed: 1998-12-31
Granted: 2000-08-11
Abstract: The present invention relates to an improved internal combustion engine structure for increasing output power, which comprises a cylinder, a piston, at least one crank and an output shaft. The invention is characterized by configuring the output shaft at the lower rim of crank and a cam or an eccentric bearing equipped on the outer surface of the output shaft. Therefore, when the piston passes the top dead center of internal combustion engine and moves downward, the eccentric effect of crank can be employed to push the piston upward and keep the best compression ratio in the cylinder; then, the cylinder is ignited to get the power. Therefore, the invention can not only prevent the flaw caused by the necessity to ignite before reaching the top dead center in the conventional internal combustion engine, but also save the fuel and reduce the air pollution.
Patent TW-425543-B (TW)
Title: Data reproduction method and device, data scrambling method, data recording method and device, recorded data reproduction device and the verification method thereof, and semiconductor chip
Inventor: KAWAMAE OSAMU
IPC: H04N5/781
Filed: 1999-04-12
Granted: 2001-03-11
Abstract: When reproducing scrambled data in a recordable medium, it is necessary to determine the specific recording medium from where the reproduction signal is sent before descrambling. It is also necessary to determine whether the data is allowed for or prohibited from reproduction before respective controls can be made. These requirements can be accomplished based on the devices and methods described as follows: a recorded data reproduction device has a first reproduction process mean for data reproduction, a first verification mean that can verify the first reproduction process mean and the second reproduction process mean to follow, and a second approval mean corresponding to the first approval mean for the verification of the second reproduction process mean. Then, by means of various verification means of the first and the second verification l means, many verification means can be derived. Each of the derived verification means can be used for descrambling its respective verification.
Patent TW-486491-B (TW)
Title: Process for the polymerisation of conjugated diolefins (dines) with catalysts based on cobalt compounds in the presence of vinylaromatic solvents
Inventor: WINDISCH HEIKE
IPC: C08F36/04
Filed: 1999-07-05
Granted: 2002-05-11
Abstract: Conjugated diolefins, optionally in combination with other unsaturated compounds which may be copolymerised with the diolefins, are polymerised by performing the polymerisation of the diolefins in the presence of catalysts based on cobalt compound, organoaluminium compounds and modifiers in the presence of aromatic vinyl compounds at temperatures of -30 DEG C to +80 DEG C. By means of the process according to the invention, it is possible straightforwardly to produce solutions of polydiolefins, such as polybutadiene, having different 1, 2 unit contents in aromatic vinyl compound, which solutions may then, for example, be further processed to yield ABS or HIPS.
Patent TW-557212-B (TW)
Title: Farnesyl protein transferase inhibitors for treating arthropathies
Inventor: END DAVID WILLIAM
IPC: A61K31/4709
Filed: 1999-07-05
Granted: 2003-10-11
Abstract: The present invention is concerned with the finding that farnesyl protein transferase inhibitors are useful for preparing a pharmaceutical composition for treating arthropathies such as rheumatoid arthritis, osteoarthritis, juvenile arthritis, and gout.
Patent TW-502007-B (TW)
Title: Apparatus and method for recycling
Inventor: BELOT DOMINIQUE
IPC: B08B3/14
Filed: 1999-07-16
Granted: 2002-09-11
Abstract: Provided is a recycling apparatus and method. The apparatus is connected to a semiconductor cleaning apparatus engaged in cleaning semiconductor substrates with an ammonia-containing cleaning solution. The recycling apparatus recovers ammonia from a waste solution discharged from the cleaning apparatus and purifies the waste solution for re-use of the recovered ammonia in the cleaning apparatus. The recycling apparatus features a solids removal means for removing solids from the waste solution, a rectification column for rectifying the waste solution from which the solids have been removed, the column yielding concentrated aqueous ammonia at the column top, a first pipework for feeding the waste solution discharged from the semiconductor cleaning apparatus to the solids removal means, a second pipework for feeding from the solids removal means the waste solution from which the solids have been removed to the rectification column, and a third pipework for removing from the rectification column and feeding to the cleaning apparatus the concentrated aqueous ammonia. The invention enables ammonia that has already been used for cleaning during semiconductor device fabrication to be re-used for that same purpose.
Patent TW-416121-B (TW)
Title: Method for manufacturing a metal plate on a semiconductor chip
Inventor: HUNG TZ-IAN
IPC: H01L21/762
Filed: 1999-08-18
Granted: 2000-12-21
Abstract: The present invention provides a method for manufacturing a metal plate on a semiconductor chip. The semiconductor chip includes a first dielectric layer and a metal conductor having a substantially rectangular cross section and formed on the first dielectric layer. The gap between the first dielectric layer and the second dielectric layer forms a recessed slot, and two curved angles are formed between the spacers of the two conductors and the bottom of the recessed slot. The method of the present invention first uniformly forms a second dielectric layer on the first dielectric layer and the two conductors. Next, a plurality of metal plates arranged in a matrix form are formed on the surface of the second dielectric layer. Then, a passivation layer is formed on the surface of the semiconductor chip for protecting the circuit in the semiconductor chip, wherein the maximum height of a third dielectric layer formed on each conductor is lower than the minimum height of the third dielectric layer on the recessed slot, and the third dielectric layer formed on the each metal plate has a flat surface.
Patent TW-554156-B (TW)
Title: Cooling device
Inventor: TAKACHI KEN
IPC: F25B9/00
Filed: 1999-08-19
Granted: 2003-09-21
Abstract: The object of the present invention is to provide a cooling device capable of eliminating various problems such as poor economy and cool air pulsation. The cooling device of the present invention comprises a compressor and an expansion machine connected to a crankshaft or crankshafts interlocked with each other. The expansion energy of compressed air from the expansion machine is utilized as an energy to compress fresh air by the compressor so a to reduce a running cost. A plurality of expansion machines is operated at a specified phase difference so as to reduce the pulsation of the cool air. An air dryer is installed in a pipe for introducing air into the expansion machine so as to dehumidify air before expansion. The crank equipment of the compressor and expansion machine are desirably those provided with a planetary gear mechanism.
Patent TW-457517-B (TW)
Title: Semiconductor device and method of making there of
Inventor: TAKAGI MARIKO
IPC: H01L27/092
Filed: 1999-09-23
Granted: 2001-10-01
Abstract: The present invention relates to a gate insulating film, which is difficult to form, for preventing itself from being penetrated by boron ions without reducing the driving force of a transistor. The gate insulating film 14 of the present invention is a nitride oxide film formed by adding nitrogen atoms. Oxygen atoms are bonded to the Si-N binding of the second adjacent atom in the nitrogen oxide film, which are located at the inner side of the nitrogen oxide film which is at least as thick as one atom on the interface between the silicon substrate 11 and the nitrogen oxide film.
Patent TW-590777-B (TW)
Title: Anhydrous topical skin preparations
Inventor: BURNETT KATHERINE M
IPC: A61P31/04
Filed: 2000-01-21
Granted: 2004-06-11
Abstract: The present invention provides anhydrous compositions for topical delivery of a medicament comprising (A) a penetration enhancer/solvent selected from the group consisting of alcohol, propylene glycol, or a combination thereof; (B) a humectant/solvent selected from the group consisting of polyethylene glycol, glycerin, sorbitol, xylitol, or any combination of any of the foregoing; and (C) an anhydrous vehicle. In an alternate embodiment, the present invention provides anhydrous compositions for topical delivery of a medicament which comprise (A) a penetration enhancer/solvent selected from the group consisting of alcohol, propylene glycol, or a combination thereof; (B) a humectant/solvent selected from the group consisting of polyethylene glycol, glycerin, sorbitol, xylitol or any combination of any of the foregoing; (C) an anhydrous vehicle; and (D) a medicament. Also provided are methods for topically delivering a medicament to an animal, such as a mammal or a human patient, in need of the medicament by topically administering to the animal the compositions of the present invention.
Patent TW-475915-B (TW)
Title: Pinch and pull open reclosable bag and zipper therefor
Inventor: JOHNSON JAMES R
IPC: B65D65/26
Filed: 1999-12-09
Granted: 2002-02-11
Abstract: A recloseable package is disclosed having a front wall and a rear wall. A thermoplastic zipper male base member is disposed at a top end of the first wall and a thermoplastic zipper female base member is disposed at a top end of the second wall. The base member each have a profile which extends transversely across the walls. The profiles are each disposed between a product side web and a consumer side web. A heat resistant barrier is provided on facing surfaces of the male and female product side webs, extending from product side longitudinal edges of the base members toward the associated profiles. The male and female base members are heat sealed to the first and second walls, respectively, opposite to the heat resistant barriers which are resistant to heat sealing to each other. The facing surfaces of the consumer side webs may likewise have heat resistant barrier layers in which case the package is sealed above the consumer side webs. Alternatively, the facing surfaces of the consumer side webs may be provided with peel seal layers which fuse together when the consumer side webs are heat sealed to the bag walls, thereby forming a top seal for the package. A zipper for use in the disclosed package is also disclosed.
Patent TW-524815-B (TW)
Title: Use of heterogeneous catalysts in processes for producing polyamides
Inventor: MOHRSCHLADT RALF
IPC: C08G69/18
Filed: 2000-01-06
Granted: 2003-03-21
Abstract: Described is the use of metal oxides as heterogeneous catalysts in a process for producing polyamides by polymerization of lactams and optionally further polyamide-forming monomers wherein the metal oxides are used in a form which permits mechanical removal from the reaction mixture and are removed from the reaction mixture during or after the polymerization, to reduce the extractables content of the polyamide obtained.
Patent TW-484099-B (TW)
Title: Method and apparatus for efficient invocation of Java methods from native code
Inventor: BLANDY GEOFFREY OWEN
IPC: G06F9/45
Filed: 2000-02-29
Granted: 2002-04-21
Abstract: A method and apparatus in a data processing system for executing a Java method from native code. A method is examined prior to first execution of the method to identify a presence of selected parameters from a set of parameters for the method. A bitmask is created to describe the selected parameters. The set of parameters is copied to a frame using the mask. Further, a new return bytecode is used to handle a return to a native calling method. Method block location is handled using identifying information about the method.
Patent TW-526139-B (TW)
Title: Fully integrated thermal inkjet printhead having multiple ink feed holes per nozzle
Inventor: KAWAMURA NAOTO A
IPC: B41J2/05
Filed: 2000-03-02
Granted: 2003-04-01
Abstract: Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers (24, 40-50), including ink ejection elements (24, 62), are formed on a top surface of a silicon substrate (20). The various layers are etched to provide conductive leads (25) to the ink ejection elements (24, 62). At least one ink feed hole (26, 66, 67) is formed through the thin film layers for each ink ejection chamber (30). In one embodiment, there are more ink feed holes (26, 66, 67) than ink ejection chambers (30), so that more than one ink feed hole provides ink to each ink ejection chamber. A trench (36) is etched in the bottom surface of the substrate (20) so that ink (38) can flow into the trench and into each ink ejection chamber (30) through the ink feed holes (26, 66, 67) formed in the thin film layers. An orifice layer (28) is formed on the top surface of the thin film layers to define the nozzles (34) and ink ejection chambers (24, 62).
Patent TW-527562-B (TW)
Title: Random signal generator and method for generating a random signal
Inventor: VOGTS RICHARD DR
IPC: H03K3/84
Filed: 2000-03-07
Granted: 2003-04-11
Abstract: The invention relates to a random signal generator (1) having at least two functional groups (2a, 2b, 2c) which each comprise a random sequence generator (3a, 3b, 3c), an exclusive-or gate (4a, 4b, 4c) and a memory element (5a, 5b, 5c). The exclusive-or gate (4a, 4b, 4c) of each functional group (2a, 2b, 2c) is in each case connected with one of its inputs (6a, 6b, 6c) to a random sequence signal output (7a, 7b, 7c) of the random sequence generator (3a, 3b, 3c) of the functional group (2a, 2b, 2c) and with its other input (8a, 8b, 8c) to a data output (9a, 9b, 9c) of the memory element (5a, 5b, 5c) of the functional group (2a, 2b, 2c). The output (10a, 10b, 10c) of the exclusive-or gate (4a, 4b, 4c) of each functional group (2a, 2b, 2c) is in each case connected to a data input (11a, 11b, 11c) of the memory element (5a, 5b, 5c) of the functional group (2a, 2b, 2c). The memory elements (5a, 5b, 5c) of the functional groups (2a, 2b, 2c) are interconnected via data lines (13) for the shifting of their memory contents.
Patent TW-508807-B (TW)
Title: Modified gate conductor processing for poly length control in high density drams
Inventor: DIVAKARUNI RAMACHANDRA
IPC: H01L21/28
Filed: 2000-03-20
Granted: 2002-11-01
Abstract: A semiconductor device includes a semiconductor substrate having an oxide layer thereon. A gate conductor is provided on the oxide layer, the gate conductor including a layer of polysilicon on the oxide layer, a tungsten silicide layer on the polysilicon layer, and a nitride cap layer on the tungsten silicide layer. The polysilicon layer has a length greater than length of the silicide layer and the nitride layer. Dielectric spacers on the gate conductor overlay the nitride cap layer and the tungsten silicide layer to provide a sidewall substantially flush with the polysilicon layer. Exposed polysilicon on the polysilicon layer is oxidized.