baber/WOPTO huggingface dataset:
Patent JP-2009079034-A (JP)
Title: New niacin controlled-release-type preparation
Inventor: CHOI YOUN WOONG
IPC: A61K9/20
Filed: 2008-07-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a new niacin controlled-release-type preparation having the advantage of a water-soluble matrix, not only with separate controlled-release systems acting in the stomach and the intestine but also maintaining a given matrix form until the point of completing its own leaching, thus enabling niacin's controlled release to be conducted very sophisticatedly, and to provide a method for producing the preparation.  <P>SOLUTION: The new niacin controlled-release-type preparation comprises niacin, hydroxypropyl methyl cellulose and a carboxyvinyl polymer, wherein the weight ratio of the hydroxypropyl methyl cellulose to the carboxyvinyl polymer stands at a specific value.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2010027239-A (JP)
Title: Connector device and stacked device
Inventor: KAJIO KATSUHIRO
IPC: H01R13/42
Filed: 2008-07-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a connector device and a stack device in which electric contact between power collection member and a spring-shaped contact portion is maintained in a proper condition for a long period of time.  <P>SOLUTION: A connector device 1 has a housing 2 to which a wire 7 formed of an insulating material is fitted, and a conductive terminal 6 formed of a conductive material, held in the housing 2, and electrically connected to the wire 7. Each conductive terminal 6 is provided with a spring-shaped contact portion 61 for electrically contacting a power collecting member 80. The housing 2 has a collapse-preventing protrusion 42, provided between the spring-shaped contact portion 61 and the power collection member 80 which suppresses collapsing of the spring-shaped contact portion 61.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010028930-A (JP)
Title: Solder joint structure and power supply apparatus
Inventor: SHIMIZU YOSHIFUMI
IPC: H05K3/34
Filed: 2008-07-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a solder joint structure which sucks molten solder up to a predetermined height.  <P>SOLUTION: A good heat collection portion provided at the distal end 23a of the leg terminal 23 of a connection member (bus bar 20A) which is jointed to a substrate by flow soldering collects heat of molten solder in a solder tank well. A heat conduction limiting section (through-holes 23b) provided at positions between the good heat collection portion and the component mounting portion (a large capacity portion) 21 at such a height as the solder is sucked up limits heat conduction from the good heat collection portion to the component mounting portion 21.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010023171-A (JP)
Title: Driving machine for staples
Inventor: SEKIGUCHI NORIMITSU
IPC: B25C5/06
Filed: 2008-07-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a driving machine for staples capable of guiding staples s certainly while the front of its nose part 2 is left open.  <P>SOLUTION: The driving machine for the staples s is structured so that a driver 8 to be driven by a striking mechanism installed inside the machine body is guided slidably to a nozzle 6 in the nose part 2 formed in the lower part of the machine body, staples s formed by bending parallel legs 13 from the two ends of a crown part are fed to the nozzle 6 from a staple guide 4 of the magazine 3 formed in the rear of the nose part 2, and each staple s is driven by the driver 8 downward from the nose part 2. In the driving machine for the staples s, an inside guide 14 to guide the inner side faces of the two legs 13 in the driving direction is installed under the back of the legs 13 of the staple s fed to the nozzle 6 in a position mating with a portion between the two legs 13.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010026254-A (JP)
Title: Positive resist composition and resist pattern forming method
Inventor: SHIMIZU HIROAKI
IPC: C07C309/04
Filed: 2008-07-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a positive resist composition and a resist pattern forming method, forming a resist pattern of a good shape.  <P>SOLUTION: The positive resist composition contains: resin component (A) having at least one constitutional unit (a0) selected from a group of a constitutional unit of a specified structure having a tertiary carbon at a side chain and a constitutional unit of a specified structure having an acid dissociating dissolution inhibitory group at a side chain; and an acid generating agent (B1) formed of chemical compound expressed by a specified structure.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010022958-A (JP)
Title: Photolysis method
Inventor: YANAGISAWA IPPEI
IPC: C02F1/72
Filed: 2008-07-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a photolysis method which uses a photocatalyst and has high decomposability.  <P>SOLUTION: The photolysis method has a process of photolyzing a material to be decomposed by irradiating the photocatalyst, immersed in an aqueous solution containing an oxidant and a material to be decomposed, with light. The photocatalyst contains titanium dioxide and pH of the aqueous solution is 6 or more. The oxidant contains 10 to 50 wt.ppm of ozone, 5 to 30 wt.ppm of oxygen, and 200 to 25,000 wt.ppm of hydrogen peroxide, each based on the aqueous solution.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010026320-A (JP)
Title: Image forming apparatus
Inventor: WATANABE KEISUKE
IPC: G03G15/00
Filed: 2008-07-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image forming apparatus which can suppress center precedence of a recording medium.  <P>SOLUTION: The body casing 2 of a printer 1 is provided with a conveying belt 9 for conveying paper 100 and a first guide member 24 which is arranged on the upstream side in the conveying direction of the paper 100 with respect to the conveying belt 9. A cover 51 is provided with a pressing member 31 which is arranged on the upstream side in the conveying direction of the conveying belt 9 when the cover 51 is in an approached position. Since the pressing member 31 only presses the central region 100A of the paper 100 in the width direction which is orthogonal to the conveying direction, the pressed central region 100A is pushed to a first guide member 24 which is arranged while facing the pressing member 31. Thus, since resistance occurs only in the central region 100A in the paper 100 which is conveyed toward the conveying belt 9, the central region 100A is not conveyed before both end sections 100B in the width direction and the center precedence in the paper 100 can be suppressed.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009114842-A (JP)
Title: Dual bypass for diaphragm type flush cleaner
Inventor: WILSON JOHN R
IPC: E03D3/06
Filed: 2008-07-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a diaphragm type flush valve having a small count of components and easy for maintenance and assembling.  <P>SOLUTION: The diaphragm 116 includes at least two bypasses orifices 206. Each bypass orifice 206 in the diaphragm 116 has a bypass associated therewith. Each bypass including a passage penetrating therethrough, allows communication of the inlet chamber below the diaphragm 116 with the control chamber above the diaphragm 116. The diaphragm 116 also integrates the function of locating and providing a sealing means to the flush valve system's auxiliary valve mechanism.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2010031937-A (JP)
Title: Transmission
Inventor: MAMADA TAKAAKI
IPC: F16H61/34
Filed: 2008-07-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a transmission which can level the operation forces of forward/backward stages.  <P>SOLUTION: The transmission includes a boss section 130 as a first contacting section arranged at transmission case side, and an inner lever 30 for the forward stage as a second contacting section which is arranged at shift select shaft side and can be brought into contact with the boss section 130 at the time of shift operation. In a forward stage shift operation, a projecting section 131 of the boss section 130 and a projecting section 31 of the inner lever 30 for the forward stage are contacted with each other and at the time of backward stage shift operation when the shift select shaft is rotated by a predetermined angle from the forward stage, the projecting section 131 of the boss section 130 and a recessed section 32 of the inner lever 30 for the forward stage are engaged mutually, and furthermore a recessed section 132 of the boss section 130 and the projecting section 31 of the inner lever 30 for the forward stage are engaged mutually.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010033392-A (JP)
Title: Bilingual corpus creation system and bilingual corpus creation method
Inventor: YAMAGUCHI TOMOHARU
IPC: G06F17/28
Filed: 2008-07-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a system capable of efficiently collecting a large amount of bilingual text data used for a statistic machine translation system.  <P>SOLUTION: In a bilingual corpus creation system, a translation target database 4 stores text data to be translated, and a server 1 publishes a webpage that displays the text data extracted from the translation target database 4 and an input box for receiving an input of a translation sentence to the text data on the Internet. The server 1 reads the translation sentence written in the input box from a terminal connected to the Internet for the published webpage to store the translation sentence in a translation sentence database 5, determines the correctness of the translation sentence when a fixed amount of the translation sentence is stored, and stores the translation sentence determined to be correct as text data of a bilingual corpus.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010034457-A (JP)
Title: Organic transistor
Inventor: NAKATSUKA MASAKATSU
IPC: H01L51/30
Filed: 2008-07-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide an organic transistor having high mobility, a large current on/off ratio, and excellent storage stability.  <P>SOLUTION: The organic transistor has an organic semiconductor layer. The organic semiconductor layer contains at least one compound expressed by a general formula 1. In the formula, X<SB>1</SB>-X<SB>8</SB>independently express a hydrogen atom, a halogen atom, a straight chain, branched, or annular alkyl group, a straight chain, branched, or annular alkoxy group, or a substituted or unsubstituted aryl group. A ring A expresses a substituted or unsubstituted thienobenzothiophene ring or a substituted or unsubstituted naphththiophene ring. A ring B expresses a substituted or unsubstituted benzene ring, a substituted or unsubstituted naphthalene ring, a substituted or unsubstituted thiophen ring, a substituted or unsubstituted benzo[b] thiophen ring, a substituted or unsubstituted thienothiophene ring, a substituted or unsubstituted thienobenzothiophene ring, or a substituted or unsubstituted naphtothienothiophene ring.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010031207-A (JP)
Title: Copolymerized polyester resin composition and biaxially oriented film made of this
Inventor: ITO HIROMICHI
IPC: C08K5/13
Filed: 2008-07-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a novel copolymerized polyester resin composition having the excellent size stability with respect to temperature and humidity, and capable of obtaining a molded product with a preferable light resistance.  <P>SOLUTION: The copolymerized polyester resin composition is made of a 2-4C alkylene glycol, and an aromatic dicarboxylic acid component represented by formulae (I): HO(O)C-R<SP>2</SP>-OR<SP>1</SP>O-R<SP>2</SP>-C(O)OH, wherein R<SP>1</SP>is a 2-10C alkylene group and R<SP>2</SP>is a 2,6-naphthalenediyl group, and (II): HO(O)C-R<SP>3</SP>-C(O)OH, wherein R<SP>3</SP>is a phenylene group or a naphthalenediyl group. Based on the resin composition mass, 0.5-10 mass% of a benzotriazole ultraviolet absorber and 0.05-2.0 mass% of a hindered phenol antioxidant, or 0.5-10 mass% of a benzotriazole ultraviolet absorber having a hindered phenol group are included in a copolymerized polyester with the copolymerization rate of the aromatic dicarboxylic acid component represented by formula (I) being 5-80 mol% based on the total acid component.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010036949-A (JP)
Title: Lid placing apparatus for food container
Inventor: HIGASHIMOTO KOICHI
IPC: B65B7/28
Filed: 2008-08-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide an apparatus for efficiently placing a lid on a food container.  <P>SOLUTION: This lid placing apparatus for a food container, which places on a plastic container body 1 filled with a food a plastic lid 2 with a protrusive peripheral wall 2b on the peripheral edge of a top panel part 2a, includes a lid laminating part 5 for laminating the lids 2 in a multi-stage condition on a predetermined position of a table 3 formed with a drop hole 6 at the front of the part 5. A pusher 7 for pushing out the lowermost lid 2 of the part 5 to the hole 6 side along the top face 3a of the table 3 is provided at the back of the part 5. The tip end side of the hole 6 includes a lid receiving part 8 for receiving the tip end side of the lid 2 protruding along the top face 3a and for holding the lid 2 at the entrance of the hole 6 with the pusher 7. A lid pushing down means 9 is provided above the hole 6 for pushing down the lid 2 held at the entrance of the hole 6 and for placing the lid on the body 1 where a content is filled and which is moving exactly underneath the lid 2.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009076879-A (JP)
Title: Semiconductor device
Inventor: YAMAZAKI SHUNPEI
IPC: H01L21/336
Filed: 2008-08-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device having an SOI structure capable of improving performance and reducing power consumption, and having a semiconductor element which is highly integrated and exhibits high performance.  <P>SOLUTION: The semiconductor device includes a plurality of field-effect transistors which are respectively stacked with a planarization layer interposed therebetween over a substrate having an insulating surface, in which semiconductor layers in the plurality of field-effect transistors are separated from semiconductor substrates. The semiconductor layers are bonded to an insulating layer formed over the substrate having an insulating surface or an insulating layer formed over the planarization layer respectively.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009016855-A (JP)
Title: Image sensor and active matrix type display device integrated with image sensor
Inventor: ZHANG HONGYONG
IPC: H04N5/335
Filed: 2008-08-20
Abstract: <P>PROBLEM TO BE SOLVED: To manufacture an active matrix type display device integrated with an image sensor at a low cost without complicating a process.  <P>SOLUTION: An image sensor in which a TFT and a light receiving part are laminated is formed in a light receiving matrix 111. A TFT and a pixel electrode 312 are arranged on a display matrix 121, to form an electrode layer 308 functioning as a black matrix. A lower electrode 208 of the light receiving part is formed of the same start layer as for the shielding layer 308. Terminals 606, 603, 601 for fixing the potential of an upper electrode 212 are formed of the same start layers as for a signal line 306, the electrode layer 308, and a pixel electrode 606 respectively. Since the potentials of the terminals 606, 603, 601 are fixed, they function as shield electrodes on the side of the light receiving part as well.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2010046867-A (JP)
Title: Inkjet image forming apparatus
Inventor: TAKENAWA KANAKO
IPC: B41M5/00
Filed: 2008-08-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide an inkjet image forming apparatus suppressing the occurrence of offset even when performing high-speed image formation.  <P>SOLUTION: The inkjet image forming apparatus includes: conveyance means (a conveyance belt 1, a driving roller 2, a driven roller 3) of conveying a recording medium 5; an inkjet head 4 of ejecting an inkjet recording liquid to the recording medium 5 conveyed by the conveyance means; and discharge rollers 6, 7 of discharging the recording medium 5 on which the printing is performed with the inkjet recording liquid, wherein a recording liquid prepared by dispersing colored particles containing a charge controller into an aqueous medium is used as the inkjet recording liquid. The inkjet image forming apparatus further includes electric field applying means (electrodes 11, 13) which are disposed downstream from the inkjet head 4 in the conveyance direction of the recording medium 5 and include a means of applying an electric field of the same polarity as the charge of the colored particles from the printing surface side to the recording medium 5 after printing and/or a means of applying an electric field of a polarity different from the charge of the colored particles from the opposite side of the printing surface to the recording medium 5 after the printing.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010050361-A (JP)
Title: Structure for mounting lsi package, and electronic apparatus
Inventor: TAKATSUKA KUMIKO
IPC: H01L23/29
Filed: 2008-08-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a structure having high heat resistance and simultaneously suppressing the stress relaxation of solder connections and the disconnection of a substrate pattern due to fillet cracks.  <P>SOLUTION: A structure for mounting an LSI package includes: a substrate 3 having circuit wiring; a semiconductor element mounted on the substrate 3; a first resin 4 filled between the substrate 3 and the semiconductor element and having a high heat resistance cycle; a second resin 5 applied so as to surround the side face of the semiconductor element and the periphery of the first resin 4 and capable of suppressing the occurrence of cracks; and a third resin 3 applied on the second resin so as not to be brought into contact with the substrate and having high shock resistance.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009010412-A (JP)
Title: Chemical vapor deposition method
Inventor: NOMURA HIDEJI
IPC: H01L21/318
Filed: 2008-08-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a chemical vapor deposition method capable of preventing incorporation of impurities into a thin film to be formed, and using a heating element.  <P>SOLUTION: A material gas supplied into a treatment vessel 1 by a gas supply system 2 is decomposed or activated on a surface of the heating element 3 kept at high temperature around 1,500-1,900°C by an energy supply mechanism 30, and a thin film is formed on a surface of a substrate 9. The heating element 3 is a wire of a high-melting-point metal such as tungsten, and mounted in the treatment vessel 1 after a high-temperature treatment keeping it at a temperature about 2,000-3,000°C above the temperature in the thin-film formation in a vacuum condition about 1×10<SP>-6</SP>-1 Pa for 5 min or more. Heavy metals incorporated in formation or the like of the heating element 3 are previously discharged by the high-temperature treatment, and the incorporation into the thin film falls below 1×10<SP>17</SP>atoms/cc.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2010052744-A (JP)
Title: Sorter and carrier for tablet feeding machine
Inventor: LEE JEONG-WOO
IPC: B65B1/32
Filed: 2008-08-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a sorter and carrier which is applied to a tablet feeding machine, and is for detecting feeding a broken tablet into a vial into which feeding of the tablets has been completed, and for detecting existence of abnormality of the number of feeding of the tablets.  <P>SOLUTION: The sorter and carrier includes a first weight measuring device 10 for measuring weight of an empty vial EB, first vial moving means 20 for moving the empty vial EB before measuring the weight on the first weight measuring device 10 and at the same time, moving successively an empty vial whose weight measurement has been already completed on a tablet feeding line 8B, a second weight measuring device 30 for measuring the weight of a tablet feeding vial FB into which feeding of the tablets has been completed, second vial moving means 40 for moving the tablet feeding vial FB before measuring the weight on the second weight measuring device 30 and at the same time, moving successively the tablet feeding vial FB whose weight has been measured on an extraction determining line 8C, a reject cylinder 50 for throwing the tablet feeding vial FB which is determined abnormal into a collecting container 51, holding means 60 for holding the vial, and reciprocating means 70 for moving straightly back and forth the holding means 60.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009206472-A (JP)
Title: Method of manufacturing semiconductor device, semiconductor device, electronic apparatus, semiconductor manufacturing apparatus, and storage medium
Inventor: MATSUMOTO KENJI
IPC: C23C16/18
Filed: 2008-08-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which can deposit a barrier film on an exposed face of an insulating interlayer where a concave portion on a substrate is formed, form a barrier film that is favorable in step coating performance in the case of forming copper wiring electrically connected with metal wiring on the lower layer side in the concave portion, and suppress an increase of wiring resistance.  <P>SOLUTION: An oxide film on a surface of copper wiring 13 on the lower layer side exposed at the bottom face of a concave portion 21 which is formed at an insulating interlayer is reduced or etched, and the oxygen of the surface of the copper wiring 13 is removed. After that, an organic metallic compound including manganese but not including oxygen is supplied, and accordingly, a manganese oxide 25 serving as a self-forming barrier film is selectively generated at a portion including oxygen of side walls of the concave portion 21 and surfaces of the insulating interlayer, and at the same time, the manganese oxide 25 is not generated on the surface of the copper wiring 13, and then copper is embedded in the concave portion.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2010056210-A (JP)
Title: Method of manufacturing semiconductor light emitting element
Inventor: OBA YASUO
IPC: H01L33/32
Filed: 2008-08-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor light emitting element which has high productivity, high efficiency, and a short wavelength by suppressing damage to crystal upon peeling a sapphire substrate.  <P>SOLUTION: The method of manufacturing the semiconductor light emitting element which has an n-type semiconductor layer, a p-type semiconductor layer, and a light emitting portion provided between the n-type semiconductor layer and p-type semiconductor layer. A buffer layer made of crystalline Al<SB>x</SB>Ga<SB>1-x</SB>N (0.8≤x≤1) and a GaN layer are laminated on a first substrate made of c-plane sapphire, and the n-type semiconductor layer, light emitting portion, and p-type semiconductor layer are laminated on the GaN layer, which is irradiated with laser light having a wavelength shorter, that is, having energy greater, than the forbidden band gap of GaN through the first substrate and buffer layer from the side of the first substrate, thereby peeling the first substrate.  <P>COPYRIGHT: (C)2010,JPO&INPIT