baber/WOPTO huggingface dataset:
Patent JP-2010183745-A (JP)
Title: Short-circuit protector
Inventor: NAKANISHI KOICHI
IPC: H02H3/36
Filed: 2009-02-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide a short-circuit protector capable of protecting power transmission lines against short-circuit without requiring installation of an expensive transformer for gauge.  <P>SOLUTION: The short circuit protector 10 includes: a short circuit fault determining circuit 12 for detecting the presence or absence of a short-circuit fault in first and second power transmission lines 2<SB>1</SB>, 2<SB>2</SB>branched from a bus line 1 receiving a power supplied via R-, S-, and T-phase power cables 7<SB>R</SB>, 7<SB>S</SB>, 7<SB>T</SB>, based on each of short circuit currents I<SB>FR1</SB>, I<SB>FS1</SB>, I<SB>FT1</SB>and I<SB>FR2</SB>, I<SB>FS2</SB>, I<SB>FT2</SB>of each of phases which are input from current transformers 4<SB>1R</SB>, 4<SB>1S</SB>, 4<SB>1T</SB>and 4<SB>2R</SB>, 4<SB>2S</SB>, 4<SB>2T</SB>installed on each of the phases of the first and second power transmission lines 2<SB>1</SB>, 2<SB>2</SB>and R-, S-, and T-phase sheath currents I<SB>RS</SB>, I<SB>SS</SB>, I<SB>TS</SB>of the R-, S-, and T-phase power cables 7<SB>R</SB>, 7<SB>S</SB>, 7<SB>T</SB>; and a fault line identifying circuit 13 for identifying a fault line having the short circuit fault.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010181816-A (JP)
Title: Image forming apparatus, method for determining frequency of updating maximum available power, and program for determining frequency of updating maximum available power
Inventor: KAMEKURA TAKAHIRO
IPC: H04N1/00
Filed: 2009-02-09
Abstract: <P>PROBLEM TO BE SOLVED: To stably supply power to target equipment by determining the frequency of updating maximum available power for the equipment, to set optimum updating frequency for the equipment.  <P>SOLUTION: The maximum available power is updated (S501), an evaluated value of the frequency of updating the maximum available power Eth_all is acquired by processing for determining the frequency of updating the maximum available power by an evaluation expression Eth_all=Σ(Thn×Kthn) (n=1, 2, 3, ...) (S502), and the frequency of updating the maximum available power Eth_new is determined by an evaluation expression Eth_new=Eth_all×Keth+Ceth from the evaluated value of the frequency of updating the maximum available power Eth_all, wherein a determination coefficient of the frequency of updating the evaluation expression is Keth and a determination offset constant of the updating frequency is Ceth (S503). Thereafter, the frequency of updating the maximum available power Eth_new is stored in a nonvolatile RAM 24 (S504).  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010186813-A (JP)
Title: Structure for mounting electronic component package and mounting method using the same
Inventor: ODA KINYA
IPC: H01L23/32
Filed: 2009-02-10
Abstract: <P>PROBLEM TO BE SOLVED: To solve the trouble problem caused by an unbalance of heat conduction when performing an electronic component packaging of a surface mount method such as BGA and/or LGA where electrode parts are arranged on the lower surface of the package and soldered to further apply for the packaging of larger electronic component packagings.  <P>SOLUTION: A structure is formed as that through-holes are provided at the position corresponding to electrodes of the package and pads of a sheet substrate sandwiched between an electronic component package and a printed-circuit board. The structure filling in a solder paste to the through-holes and sandwiching between the electronic component package and the printed-circuit board fast and uniformly conducts the heat to uniformly heat the unheated solder, satisfactorily solder-bonding. This provides a new packaging method of the electronic component packaging.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010185630-A (JP)
Title: Heat treatment device for plasma display panel
Inventor: MORITA MASATAKA
IPC: F27B9/38
Filed: 2009-02-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a heat treatment device for a plasma display panel capable of preventing the unevenness of baking in the baking and solidifying of a precursor material of a component formed on a glass substrate.  <P>SOLUTION: The heat treatment device for the plasma display panel includes a glass substrate support plate 23 for loading a glass substrate constituting a plasma display panel which is used to charge the glass substrate to the heat treatment device. The glass substrate support plate 23 includes a glass substrate support plate base 23a and glass substrate support plate split pieces 23b combined and fitted thereto to thereby integrate surfaces for loading the glass substrate in a flat state. The loading and separation of the glass substrate to the support plate 23 are performed by moving up and down the split pieces 23b by a push-up mechanism.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010186372-A (JP)
Title: Particle behavior analysis device and program
Inventor: HIROOKA NOBUYUKI
IPC: G06F19/00
Filed: 2009-02-13
Abstract: <P>PROBLEM TO BE SOLVED: To reduce the calculation load of an interaction force between particles and the boundary of the movement of particles in a particle behavior analysis device.  <P>SOLUTION: Each wall face being the object of contact determination is recognized as an analysis object, and each of them is distributed in association with the determined positions of a force matrix. For example, the force matrix of four lines and four columns is used for calculating 32 particles by 16 pieces of processors (nodes #0 to #15) in parallel. Each two of eight walls are distributed to the processors. The node #3 shares walls #0 and #1, and the node #7 shares the walls #2 and #3, and the node #11 shares the walls #4 and #5, and the node #15 shares the walls #6 and #7. The eight walls are clearly distributed to the determined positions of the force matrix of four lines and four columns, and analysis following a force division method is performed. Even when the surface shape becomes complicated, segments or circular-arcs specifying the walls configuring the object surface are numbered, and distributed in association with the force matrix, so that the interaction calculation of particles and the object surface can be reduced.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010187264-A (JP)
Title: Capacitor microphone apparatus
Inventor: SATO AKIYOSHI
IPC: H04R3/00
Filed: 2009-02-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a capacitor microphone apparatus which is hardly affected by external noise.  <P>SOLUTION: A bias voltage +Vcc is applied between a power supply terminal 30 and a ground. A bias resistor 32, a microphone element 34 and a bias resistor 36 are connected in series between the power supply terminal 30 and the ground. Resistance values of the bias resistors 32, 36 are each set to high resistance values from 100 GΩ to 100 TΩ. Signals of a back plate 34a and a diaphragm 34b of the microphone element 34 are passed through signal lines 45, 46 and impedance-converted by impedance converters 38, 40, respectively. Output signals of the impedance converters 38, 40 are input through a balanced signal line 42 to an arithmetic circuit 44. The arithmetic circuit 44 adds both the signals after inverting one of the signals. A microphone signal is output from the arithmetic circuit 44.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010193654-A (JP)
Title: Lead wire connecting structure
Inventor: AOYAMA TAKASHI
IPC: H01R4/72
Filed: 2009-02-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a lead wire connecting structure that has a high sealability and a high reliability.  <P>SOLUTION: A lead wire connecting structure includes: a plurality of lead wires 2; a substrate 3 to which the lead wires 2 are connected; a separator component 5; and a heat shrinkable tube 141. The separator component 5 has a comb tooth part wall 9 formed higher than the diameter of the lead wires 2, and holds the lead wires 2 while separating them apart. The heat shrinkable tube 141 has an adhesive layer 140 on the inside and coats a connecting portion 4 between the lead wires 2 and the substrate 3 and the separator component 5. The lead wire connecting structure is so configured that the connecting portion 4 and the separator component 5 may be sealed when the heat shrinkable tube 141 shrinks and the adhesive layer 140 is melt-cured.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010193914-A (JP)
Title: Game machine
Inventor: YOSHIDA TORU
IPC: A63F7/02
Filed: 2009-02-20
Abstract: <P>PROBLEM TO BE SOLVED: To increase excitement and enjoyment of a game by causing a player to keep a hope for a varied probability state even after an opened time increase state is finished.  <P>SOLUTION: An administrative CPU executes a lottery for the shift to a specific mode during a specific mode onset period after the shift to the normal mode made with the end of the variation shortening state. In the lottery for the shift to the specific mode, winning is made easier to earn when the probability for winning the lottery is 'high' than that when it is 'low'. As a result, even in the shift to the normal mode to be made with the end of the variation shortening state, the player is made to have a hope for winning the lottery for the shift to the specific mode at least during the specific mode onset period, thereby the player is made to continuously keep a hope for the varied probability state. When the lottery for the shift to the specific mode is won, the player is made to continuously keep a hope for the varied probability state during the specific mode shifted by the winning. Therefore, the player is made to continuously keep a hope for the varied probability state after the variation shortening state is finished.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010193920-A (JP)
Title: Method for manufacturing seat pad for vehicle
Inventor: ISHIGURO TOMOYUKI
IPC: A47C7/30
Filed: 2009-02-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a seat pad for a vehicle by which manufacturing cost can be reduced by simplifying manufacturing processes.  <P>SOLUTION: A mold 4 in which an article to be molded comprising a fiber sheet covering a cushion material 3 is placed, is clamped and heated by heaters 5. Polyester fiber present in the outer peripheral part of the article to be molded is gradually fused when the temperature of the heated mold 4 reaches to the melting point of a low-melting fiber material. The heating step is completed after the predetermined time lapses, wherein the mold 4 is cooled to solidify the polyester fiber which remains melted, and thereby the cushion material 3 is prevented from being damaged. The manufacturing processes are simplified, and the manufacturing cost can be reduced by molding the seat pad for the vehicle by heating while covering the cushion material 3.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010199148-A (JP)
Title: Semiconductor sensor device and method of manufacturing thereof, package and method of manufacturing thereof, module and method of manufacturing thereof, and electronic device
Inventor: YAMAMOTO SATOSHI
IPC: G01L9/00
Filed: 2009-02-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor sensor device which has high connection reliability without the use of an underfill material and has a repairable configuration, for lower cost and reduced load on environment.  <P>SOLUTION: The semiconductor sensor device 1 includes a semiconductor sensor chip 11 equipped at least with a sensor circuit formed on a first substrate 21; a first conductive part 23 connected electrically to the sensor circuit; and a first rewiring layer 25 electrically connected to the first conductive part, as well as, a semiconductor chip 12, equipped at least with a process circuit which is formed on a second substrate 31 to process an electrical signal from the sensor circuit; a second conductive part 33 electrically connected to the process circuit and a second rewiring layer 35 electrically connected to the second conductive part. In the semiconductor sensor device, the first rewiring layer and the second rewiring layer are electrically connected via a conductive connection member 13, and the thickness of the first rewiring layer and/or the second rewiring layer is 8-20 μm.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010195277-A (JP)
Title: Tire temperature control device and tire temperature control method
Inventor: JONES MICHAEL
IPC: B60T8/00
Filed: 2009-02-26
Abstract: <P>PROBLEM TO BE SOLVED: To generate an adequate braking force against frequent braking of a vehicle.  <P>SOLUTION: The tire temperature control device includes a temperature detecting section detecting the temperature of a ground contact surface of a tire, a camber angle adjustment condition determination processing means determining whether a camber angle adjustment condition is approved or not depending on the fact that the temperature of the ground contact surface of the tire is not less than a set temperature or not, and a camber angle adjustment processing means adjusting a camber angle when the camber angle adjustment condition is approved. When the temperature of the ground surface of the tire is not less than the set temperature, the camber angle is adjusted, thereby, a rise in the temperature of the ground contact surface over the set temperature and a reduction in a friction coefficient can be prevented. Thus, even when the braking of the vehicle is performed frequently, the adequate braking force can be generated.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009164623-A (JP)
Title: Lithographic apparatus and device manufacturing method
Inventor: STREEFKERK BOB
IPC: G03F7/20
Filed: 2009-02-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a means for alleviating the problem concerning the presence of a dipping liquid in a lithographic projection apparatus.  <P>SOLUTION: In the lithographic projection apparatus, a liquid supplying system supplies the dipping liquid between the last element of the projection apparatus and a substrate. An active drying station is provided to actively remove the remained dipping liquid from the exposed substrate W or other objects. The active drying station is equipped with a gas stream forming means or a dipping liquid dissolving liquid supplying means for dissolving the dipping liquid.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2010198524-A (JP)
Title: Impedance matching device
Inventor: OMAE SHUJI
IPC: H05H1/46
Filed: 2009-02-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide an impedance matching device including a function of predicting service life of a mechanism part of a variable impedance element.  <P>SOLUTION: The impedance matching device includes: a target value detecting means for detecting a numerical value, as a target value, including information on the minimum value of output torque of motors 7a and 7b, which is needed to keep a residual deviation present between a target position and the present position of operation shafts of variable impedance elements 3 and 4 within an allowable value; memories 31 and 32 for storing the number of accumulated days from a reference time to the day when the target value is detected together with the detected target value; and first and second service life estimating parts 34 and 35 using the target value and the number of accumulated days stored in the memories 31 and 32 to estimate the number of accumulated days from the reference time to the day when the mechanism part of the variable impedance elements reaches the end of the service life by a method of least squares.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010205506-A (JP)
Title: El element
Inventor: KAIZUKA TOMOYOSHI
IPC: H01L51/50
Filed: 2009-03-02
Abstract: <P>PROBLEM TO BE SOLVED: To provide an optical sheet pasting material for improvement of light-extraction efficiency for an EL element, with improved light-extraction efficiency as well as lowered visibility of defects of an optical sheet surface, and with easy-to-peel-off performance, that is, a rework property between a pasting layer and a translucent substrate after pasting.  <P>SOLUTION: In the EL element provided with a translucent substrate, and a light-emitting layer fitted on one face of the translucent substrate and pinched by an anode and a cathode, a lens group is fitted to the surface of the translucent substrate, to be structured by pasting an optical sheet having a structure with a plurality of unit lenses arranged in two dimensions to the other face of the translucent substrate through the pasting layer.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010205874-A (JP)
Title: Semiconductor device, electro-optical device and electronic apparatus
Inventor: YASUKAWA MASAHIRO
IPC: G02F1/1345
Filed: 2009-03-03
Abstract: <P>PROBLEM TO BE SOLVED: To improve deterioration in characteristics of a transistor based on generation of a parasitic transistor, in a semiconductor device.  <P>SOLUTION: This semiconductor device includes a first transistor (400) and a second transistor on a substrate (10). The first transistor (400) includes a first semiconductor layer (410) and a first gate electrode (430). The first semiconductor layer (410) longitudinally formed along a predetermined direction includes a first channel region (410c) including a body part (410c1) wherein an impurity region of first concentration is formed by implanting a predetermined kind of ions, and an edge part (410c2) which is provided along the part extending in the predetermined direction out of the edge part of the body part, and wherein an impurity region of second concentration higher than the first concentration is formed. The first gate electrode (430) is arranged facing the first channel region (410c). The second transistor includes a second semiconductor layer (1a), containing a second channel region (1a') which has the same conductive type as the first channel region and wherein an impurity region of the third concentration higher than the first concentration is formed, and a second gate electrode (3a) arranged facing the second channel region.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010205539-A (JP)
Title: Electron microscope
Inventor: HOSOKAWA FUMIO
IPC: H01J37/09
Filed: 2009-03-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electron microscope which is easy in aberration correction even at the time of high magnification observation.  <P>SOLUTION: The electron microscope is provided with a spherical aberration correction device 14, a transmission lens system 15 which is installed between the spherical aberration correction device 14 and an objective lens 17, an aperture diaphragm 13 which is installed movably with respect to the optical axis 2 at the front stage of the spherical aberration correction device 14, and an aperture angle diaphragm 16 which is movably installed with respect to the optical axis 2 at the main face or its vicinity of the transmission lens system 15 and adjusts the aperture angle of electron beams.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010206751-A (JP)
Title: Moving image compression coding device
Inventor: SHIGETA YOSHINORI
IPC: H04N19/19
Filed: 2009-03-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a moving image compression coding device that improves compression rate while maintaining the high image quality.  <P>SOLUTION: A compression coding device includes: a skin color detection portion 10; a QP value selecting portion 1; a difference data orthogonal conversion portion 20; a quantization portion 4; a compression coding portion 30; and a rate control portion 8. The QP value is switched depending on whether or not MB is of skin color. The compression rate is made low if MB is of skin color and made high, if MB is of not skin color. This allows the compression coding device to not only carry out compression coding by maintaining the high image quality of MB of the skin color where deterioration of the image is easily recognized but also make small the amount of data generated after carrying out compression coding of MB other than the skin color where the deterioration of the image is so difficult as to be recognized.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010211309-A (JP)
Title: Quality information collection analysis system
Inventor: OKUBO HIDETOSHI
IPC: G06Q50/00
Filed: 2009-03-06
Abstract: <P>PROBLEM TO BE SOLVED: To quickly investigate the cause of a defect in a production process.  <P>SOLUTION: A quality information collection analysis system includes: at least one assembly installation having at least one assembly machine which assembles a component; at least one inspection device which inspects the assembly having the components assembled by the assembly machine; and a quality collection analysis device which manages the quality information of the assembly. The assembly device has an assembly device production time output means which outputs the assembly time of the assembly. The inspection device has an inspection information output means which outputs the inspection result of the assembly. The quality collection analysis device has: an assembly device production time input means which inputs the assembly time output by the assembly device production time output means; an inspection information input means which inputs the inspection information output by the inspection information output means; a storage part which stores the information on the components; and an analysis means which analyzes defect causes using the assembly time and the inspection result.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010208994-A (JP)
Title: Pest-controlling agent and method for controlling insect pest using composite insect pest control agent using bidens plant and insect pest control method
Inventor: NAGAMATSU YUKIKO
IPC: A01N65/12
Filed: 2009-03-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide an insect pest-repellent agent which can be used to an insect pest which damages a shoot, the insect pest-repellent agent using an extract obtained from a plant raw material as an active component, wherein the plant raw material is derived from natural resources, is easily available since the resources in nature are relatively abundant, and is highly safe for human body.  <P>SOLUTION: An extract is extracted from the bidens plant, and an insect pest control agent which can be used to an insect pest which damages a shoot is derived by using the extract as an active component.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010207778-A (JP)
Title: Disinfectant addition treatment method for water
Inventor: HAYAKAWA HIDEO
IPC: C02F1/50
Filed: 2009-03-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide a disinfectant addition treatment method for water which makes bubbles of hydrogen and oxygen generated by electrolysis fine to nano bubbles and maintains a disinfectant effect for a long time.  <P>SOLUTION: AC power supply is made to turn on electricity by a pair of AC electrodes and one ground electrode in water to be treated to carry out electrolysis, FM modulation in the fluctuation range of ±3 to 5 kHz is applied focusing on about 5 to 100 kHz of oscillation frequencies of alternating current, and an apparatus having a random signal generator built-in produces a changing part of sudden increasing or decreasing of frequency while gradual changing of increasing or decreasing of frequency, so that electric field interference is generated, shock wave is generated and bubbles of hydrogen and oxygen generated by electrolysis are made to be fine to nano bubbles.  <P>COPYRIGHT: (C)2010,JPO&INPIT