Patent EP-1901351-A1 (EP)
Inventor: METZKE MICHAEL
IPC: H01L23/36
Filed: 2006-11-16
Abstract: Metallic heat-conducting foil comprises a metal alloy with a melting point of 20-100[deg] C, as a sole or main component; and one or more layers (where at least one of the layer is composed wholly or partly of a low-melting metal alloy, whose melting point is 20-100[deg] C). Metallic heat-conducting foil comprises a metal alloy with a melting point of 20-100[deg] C, as a sole or main component; and one or more layers (where at least one of the layer is composed wholly or partly of a low-melting metal alloy, whose melting point is 20-100[deg] C), where the other metals are suspended in the low-melting metal alloy that is rolled out to form a foil and/or is or can be brought in contact in a different manner with the metal alloy; the metal alloy that is present in the obtained metallic heat-conducting foil is melted during the application and the melting is carried out by supplying external heat and/or dissipation heat of the electric- and/or electronic components and/or assemblies that are brought in contact; an optimal arrangement is carried out at the layer by temporarily, completely or partially melting the metallic heat-conducting foil; the heat conduction is produced between these layers and that after the melting of the low-melting metal alloy that is contained in the metallic heat-conducting foil, other metals that are suspended in it or brought in contact with it in a different manner, form an alloy with this metal alloy; a new alloy is developed, which has a qualitatively and/or quantitatively different composition than the original alloy and thus possesses other physical and/or chemical properties, and that as the sole or main component of the metallic heat-conducting foil, all metal alloys with a melting point of 20-100[deg] C can be used, which is valid for other binary, ternary and other alloys of the metals such as gallium, indium, bismuth and tin and/or that metals are suspended or brought in contact in a different manner with the metal alloy and these metals form an alloy with the metal alloy after the melting of the metal alloy and thus change the qualitative and/or quantitative composition of this alloy; the process takes place during the application of the heat-conducting foil and/or that metals are suspended or brought in contact in a different manner with the metal alloy at 20-100[deg] C and these metals do not form an alloy with the metal alloy after the melting of the metal alloy and thus do not change the qualitative and/or quantitative composition of the alloy; the unalloyed components cause the formation of a pasty consistency of the melt, which develops after the melting of the heat-conducting foil that is composed wholly or as its main ingredient from a low-melting alloy and/or the metal to be alloyed that is brought in contact with the heat-conducting foil during its application for the purpose of formation of the alloy is or can be a component of an electronic unit or assembly, on which the heat-conducting foil is applied, where this forms an alloy with the metal at the surface of the component, which is brought in contact and on which the metallic heat-conducting foil is applied, and the so-developed heat-conducting layer has a higher melting point than the low-melting metal alloy, which is the sole or main component of the heat-conducting foil.