Patent SG-11201906818R-A (SG)
Title: Interconnect structure for electrical connecting a pair of microwave transmission lines formed on a pair of spaced structure members
Inventor: TRULLI SUSAN
IPC: H01L23/66
Filed: 2018-01-22
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 02 August 2018 (02.08.2018) WIP0 I PCT omit VIII °nolo olomoimilmuno oimIE (10) International Publication Number WO 2018/140345 Al (51) International Patent Classification: H01P 5/02 (2006.01) HO1L 23/00 (2006.01) HO1P 11/00 (2006.01) H01L 23/66 (2006.01) H05K 1/14 (2006.01) HO1P 1/04 (2006.01) (21) International Application Number: PCT/US2018/014653 (22) International Filing Date: 22 January 2018 (22.01.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 15/415,367 25 January 2017 (25.01.2017) US (71) Applicant: RAYTHEON COMPANY [US/US]; 870 Winter Street, Waltham, MA 02451-1449 (US). (72) Inventors: TRULLI, Susan, C.; 52 Middle Street, Lexing- ton, MA 02421 (US). LAIGHTON, Christopher, M.; 397 Sargent Road, Boxborough, MA 01719 (US). HARPER, Elicia, K.; 34 Tremont Street, Unit 4, Chelsea, MA 02150 (US). (74) Agent: MOFFORD, Donald, F. et al.; Daly, Crowley, Mofford & Durkee, LLP, 354A Turnpike St., Suite 301A, Canton, MA 02021 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, (54) Title: INTERCONNECT STRUCTURE FOR ELECTRICAL CONNECTING A PAIR OF MICROWAVE TRANSMISSION = LINES FORMED ON A PAIR OF SPACED STRUCTURE MEMBERS 75a 10 FIG. 10A O 00 O C (57) : A structure having pair of structure members separated by a gap and an interconnect structure member disposed in the gap. The interconnect structure member includes: a fill-structure having opposing sides in direct contact with the opposing sides of the first structure member and the second structure member; and, an interconnecting microwave transmission line disposed on the fill- structure electrically interconnecting the microwave transmission line of the first structure member to the second member structure. An electrically conductive member is disposed over a signal line of, and electrically connected to the ground conductor the interconnecting microwave transmission. [Continued on next page] WO 2018/140345 Al MIDEDIMOMOIDEIREEMOMMHOIIMOMODEVOIMIE SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: as to applicant's entitlement to apply for and be granted a patent (Rule 4.17(11)) as to the applicant's entitlement to claim the priority of the earlier application (Rule 4.17(iii)) Published: — with international search report (Art. 21(3))