baber/WOPTO huggingface dataset:
Patent JP-H10236623-A (JP)
Title: Conveyor for conveying spherical vegetables
Inventor: MATSUBARA KAZUAKI
IPC: B65G15/42
Filed: 1997-03-04
Abstract: PROBLEM TO BE SOLVED: To perform a smooth operation in a post process by conveying spherical vegetables, supported stably and fitted closely, and preventing them from being collapsed or their leaves from showing the tendency of opening during the transportation. SOLUTION: A conveyor for conveying spherical vegetables is structured so that spherical vegetables are held by a vegetable holding part 19 installed on a conveying surface and fed to a processing device side. In order to form the vegetable holding part 19 in this case, multiple vegetable receiving protruded bodies 20 are arranged distributedly on the conveying surface around a vertical axis core Q so that the spherical vegetables can be fitted closely, the vegetable receiving protruded bodies 20 are formed hollow by an elastic member, and the both side surfaces 23 facing toward around the vertical axis core Q of the vegetable receiving protruded bodies 20 are opened.
Patent JP-S60194044-A (JP)
Title: Sintered material for ornamental member
Inventor: KASAI MASAMI
IPC: C22C32/00
Filed: 1984-03-13
Abstract: PURPOSE:To obtain the titled golden sintered material having superior wear resistance and high corrosion resistance by specifying a composition consisting of TaC, TiC, WC, NbC, Ni, Co, Cu and Au. CONSTITUTION:This sintered material for an ornamental member has a composition consisting of, by weight, 10-77% TaC, 1-5% one or more among TiC, WC and NbC, 1-5% Ni and/or Co, 1-5% Cu and the balance Au. The sintered material assuming a gold color has high hardness, superior wear resistance and high corrosion resistance, and it is suitable for use as the material of an ornamental member such as a watchcase. Powders of said components are blended in a prescribed ratio and mixed in a wet ball mill. The mixture is dried, mixed with a binder such as paraffin, press-molded, and sintered to obtain said sintered material.
Patent JP-H04269464-A (JP)
Title: Sodium-sulfur battery and manufacture thereof
Inventor: TSUNO NOBUO
IPC: H01M10/39
Filed: 1991-02-22
Abstract: PURPOSE:To provide a sodium-sulfur battery improved in corrosion resistance and having an anode chamber without peeling from the surface and a method of manufacturing the same. CONSTITUTION:In a method of manufacturing a sodium-sulfur battery in which an anode chamber and a cathode chamber are partitioned an formed by a solid electrolyte having alkali ion conductivity, a molten sulfur compound is received in the anode chamber, and a molten sodium is received in the cathode chamber, a corrosion-proof film having a chromium concentration higher than the chromium concentration in a metal forming the anode chamber is formed in at least a part making contact with the molten sulfur compound of the inner surface of the metal vessel forming the anode chamber, and the metal vessel having the corrosion-proof film is thermally treated, whereby an alloy layer in which the chromium concentration is continuously reduced in the depth direction from the surface of a high chromium concentration to the chromium concentration in the metal constituting the anode chamber.
Patent JP-S55140375-A (JP)
Title: Mask production
Inventor: KAWADA YOSHIAKI
IPC: H04N5/64
Filed: 1979-04-19
Abstract: PURPOSE:To produce a small amount of many kinds of device advantageously by changing the mask diameter of a mask, which is molded by one kind of mask metallic mold, to make it possible to use this mask for many kinds of device commonly. CONSTITUTION:Front mask 2 is molded by vacuum shaping by one metallic mold. The CRT of l1 inches can be used for this case, however, the part of frame 3 is stamped out with l2 inches, so that it can be used for the CRT of l2 inches. In case of actual development from a device of l1 inches to a device of l2 inches, change can be performed simply by changing the front mask and the deflection-system block.
Patent JP-H10246846-A (JP)
Title: Optical element mounting substrate
Inventor: HIROSE MASAKI
IPC: H05K1/00
Filed: 1997-03-04
Abstract: PROBLEM TO BE SOLVED: To easily obtain the dimensional accuracy of a substrate and metallized wirings and the absolute positional accuracy between this substrate and the metallized wirings by applying the metallized wirings on projecting parts. SOLUTION: Ruggedness is formed on the substrate 1 in such a manner that optical element mounting part and wiring patterns are formed as the projecting parts. The element mounting surface is inclined to have a prescribed angle. The metallized wirings 2 are applied on the projecting parts. For example, an angle of 8 deg. is set between a semiconductor laser (LD) and a photodiode(PD) for monitoring its exciting light in a light emitting module. At the time of inclining the element material surfaces, the substrate 1 is formed to a parallelepiped shape, by which the level formation of the flank at the time of die bonding of the PD to the flank and the wire bonding of the PD to the flank metallization is made possible and the easier assembly work is ensured.
Patent JP-H03249900-A (JP)
Title: Remote controller
Inventor: MIKAMI YUICHI
IPC: H04B3/54
Filed: 1990-02-27
Abstract: PURPOSE:To selectively operate desired electronic apparatuses placed in different rooms by converting an optical signal an electric signal, adding a discriminating signal thereto and transmitting it through an indoor wiring. CONSTITUTION:In a transmitting/receiving equipment 2, data transmitted optically by a first photoelectric converting means 11 is received, an electric signal corresponding thereto is outputted, and it is added to a prescribed discriminating signal set by a discriminating signal generating means 15 by an adding means 14, modulated by a modulating means 16 and outputted to an indoor wiring 5. On the other head, in a transmitting/receiving equipment 3, the signal transmitted through the indoor wiring 5 is demodulated by a demodulating means 22, the discriminating signal contained in the signal is discriminated by a discriminating means 25, and in accordance with a result of discrimination, data demodulated by a demodulating means 27 is converted optically, and for instance, it is made incident on an electronic apparatus, etc. In such way, the remote control of the electronic apparatuses, etc., placed in indifferent rooms can be executed.
Patent JP-H05197020-A (JP)
Title: Ohp device
Inventor: FUJIWARA HIDETOSHI
IPC: G03B21/132
Filed: 1992-01-22
Abstract: PURPOSE:To provide a photograph setting case for an OHP by which automatic feed and accurate positioning can be performed, where photographs can be freely exchanged, and which is excellent in handleability by using the photograph setting case for an OHP in a cartridge system. CONSTITUTION:The photograph setting case 5-for the OHP which is formed in the cartridge system provided with a sliding part 4 for feeding so that the automatic feed can be performed by carrying means 2 and 3, and a tray 6 on which the photograph setting case is placed to be carried are used, then they are constructed so that the automatic feed of photographic film and the automatic positioning thereof in the case of projection are performed by using the means 2 and 3. Therefore, the automatic positioning and the automatic feed of the photograph can be performed by the means 2 and 3, the photographic film is prevented from being erroneously set, and trouble at the time of setting the film is saved, then the handleability is improved.
Patent JP-S60195801-A (JP)
Inventor: SATOU AKIHISA
IPC: F21V3/00
Filed: 1984-03-16
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H02227208-A (JP)
Title: Transferring device of tray
Inventor: KUSANO KUNIO
IPC: B28B3/20
Filed: 1989-02-28
Abstract: PURPOSE:To make it possible to accurately transfer a formed body and consequently obtain a transferring device of tray, which is easily installed and handled, by a method wherein positioning means are provided at the lower part of a mold and, at the same time, a conveyor is provided beneath the positioning means. CONSTITUTION:Positioning rolls 5 are provided on the rear side surfaces of an extruder 1 and of a mold 2 so as to position a tray 4 to the extruder 1 and the mold 2 by respectively engaging the positioning rolls 5 with the peak parts 4a of the tray 4, which is carried on driving rolls 3. The extruder 1 and the mold 2 are arranged so as to nearly lie on a straight line along the carrying direction of the driving rolls 3 in order to mount the tray 4 on the driving rolls 3. next, by adjusting the heights of the leg parts 5b, the rollers 5a are engaged with the peak part 4a of the tray 4. As a result, the horizontal shifting of the tray 4 is suppressed by the rollers 5a, resulting in realizing the state the peak part 2a of the mold 2 coincides with the peak part 4a of the tray 4. After that, a formed body 6 is extruded from the mold 2 by putting the extruder 1 into actuation and, at the same time, the tray 4 is transferred with the driving rolls 3.
Patent JP-S61209744-A (JP)
Title: Molding sand for centrifugal casting
Inventor: SAEKI YUKIO
IPC: B22C1/00
Filed: 1985-03-14
Abstract: PURPOSE:To prevent the stripe pattern and sand floating on the surface of a casting mold by adjusting respectively the average grain size and standard deviation of the grain size distribution of sand within specific ranges and using a binder composed of a novolak or resol type phenolic resin or a resin mixture composed of both resins which have respectively average mol.wt. in specific ranges. CONSTITUTION:The average grain size of the grain size distribution of the molding sand is adjusted to >=70mum and <=350mum in a sand mold method of a centrifugal casting method. The standard deviation of the grain size distribution is adjusted to <=50% average grain size. The binder to be used is the novolak type phonolic resin or resol type phenolic resin or the resin mixture composed of both resins. The stripe pattern and sand floating on the surface of the casting mold are eliminated when the average mol.wt. of the respective resins are adjusted 250-600.
Patent JP-S63218296-A (JP)
Title: Process for preventing activated sludge from bulking
Inventor: FUJINO SEIJI
IPC: C02F3/12
Filed: 1987-03-04
Abstract: PURPOSE:To prevent activated sludge from bulking, by adding a water-soluble polymer prepd. by the reaction of dialkylamine and occasionally ammonia with epihalohydrin to waste water contg. activated sludge which has caused bulking. CONSTITUTION:0.05-25pts.wt. (basing on 100pts.wt. dry solid in activated sludge) of a water-soluble cationic polymer prepd. by the reaction of dialkylamine and occasionally ammonia (<= equimolar amt. to dialkylamine) with epihalohydrin, is added to activated sludge to be bulked or having been already bulked by the Hyphomycetes of type 0041, or to waste water contg. said sludge. As the result, the activated sludge is prevented specifically from bulking due to the Hyphomycetes of type 0041. Further, the increase of SVI (sludge volume index) of the activated sludge is retarded in a short time, the concn. of the activated sludge is held at a high level, and the reducing effect for BOD is enhanced remarkably.
Patent JP-H05245687-A (JP)
Title: Flux cored solder wire
Inventor: YOKOI SHIGEMI
IPC: B23K35/14
Filed: 1992-03-06
Abstract: PURPOSE:To exhibit an effect of preventing splashing by forming a flux clad layer on a core material consisting of a solder alloy and further, coating this layer with a solder alloy having the m.p. near the m.p. of the flux. CONSTITUTION:The solder alloy 1 is formed as a core material. The flux 2 clad layer is axially formed in this core material 1 part. Further, the outer periphery is coated with the solder alloy 4 having the m.p. near the m.p. of the flux 2 to form the flux cored wire. Any solder alloys which are generally used are usable as the solder alloy 1. Generally used fluxes are usable for the flux 2 as well. The solder alloy 4 of the outer periphery is the solder alloy having about 50 to 150 deg.C m.p. As a result, the good wettability of the solder is obtd.
Patent JP-2000251936-A (JP)
Title: Polymer electrolyte battery
Inventor: SUGIYAMA HIROSHI
IPC: H01M10/058
Filed: 1999-02-26
Abstract: PROBLEM TO BE SOLVED: To obtain a battery with high load characteristics and a long cycle life by using a polybutylene telephthalate nonwoven fabric having thickness and porosity within a specified range as a holder of a polymer electrolyte layer, and holding a gel-like polymer electrolyte in it. SOLUTION: As the holder of the polymer electrolyte layer of a polymer electrolyte battery, a polybutylene telephthalate nonwoven fabric is used, and the thickness of the nonwoven fabric is limited to 15-150 μm, preferably to 20-100 μm, and the porosity is limited to 30-85 volume percent, preferably to 50-80 volume percent. To prepare the polymer electrolyte, an electrolyte containing monomer or prepolymer capable of polymerizing by active light or heat is contained in the holder made of the polybutylene telephthalate nonwoven fabric, the monomer or the prepolymer is polymerized by irradiating the active light or heating, and converted in gel to form a gelled polymer electrolyte layer.
Patent JP-H11250333-A (JP)
Title: Automatic vending machine
Inventor: KURA KAORU
IPC: G07F9/10
Filed: 1998-03-02
Abstract: PROBLEM TO BE SOLVED: To improve an air guiding path so that the cooling performance of a refrigerating machine can be fully demonstrated by securing the amount of wind of cooled air that cools a conditioning unit of the refrigerating machine mounted on the automatic vending machine without constrained by condition of an installment place of a location destination. SOLUTION: In this automatic vending machine in which commodity storage rack 6 and a cooler 7 are provided inside commodity storage 5 of a body case 1 with a front door equipped with supporting legs 4 on the bottom surface of a base table 1a, a condensing unit 9 of a refrigeration is installed in a machine room 8 formed on the bottom side of the body case, and a condenser 9b and a compressor 9a of the conditioning unit are cooled by introducing outside air to the machine room by a fan 9c, an air absorption hole 2b leading to the machine room is opened on the front door 2, an exhaust hole 1b is opened on a rear side of the machine room, an exhaust hole 1c opened to a lower side is further opened on the base table bottom side of the body case, and a cooled exhaust guided into the machine room is released outside the machine through the exhaust holes 1b and 1c.
Patent JP-S51126779-A (JP)
Title: Fine pattern processing method
Inventor: KACHI TADAO
IPC: H01L21/3205
Filed: 1975-04-25
Abstract: PURPOSE: To solve the problem of paracitic capacitance increase or defective pinholes etc. in a fine pattern process without adding photo-resist process lines for the elimination of unnecessary patterns. 
     COPYRIGHT: (C)1976,JPO&Japio
Patent JP-H06264799-A (JP)
Title: Idle engine speed control device of internal combustion engine
Inventor: IOCHI ATSUSHI
IPC: F02D45/00
Filed: 1993-03-11
Abstract: PURPOSE:To prevent rise of idle engine speed due to a supplementary air flow rate by an FICD valve becoming excessive in the case when a variable capacity type compressor is used and others. CONSTITUTION:At the time of idle driving, idle engine speed is controlled by feedback control of an AAC valve (step 3), and when a compressor for an air conditioner works, in principle, an FICD valve is switched ON (step 9). In the case when an actual external load is small against a fixed supplementary air flow rate of the FICD valve, as real engine speed Ne excessively rises, when the state of more than judgement value continues for more than ten seconds (step 4), the FICD valve is switched OFF (steps 7, 10). In the same way, when a feedback control value against the AAC valve becomes less than ten % for more than a specified period of time (step 5), the FICD valve is switched OFF, too.
Patent JP-H09246003-A (JP)
Title: Wire wound resistor
Inventor: MATSUMURA KAZUTOSHI
IPC: H01C1/034
Filed: 1996-03-07
Abstract: PROBLEM TO BE SOLVED: To reduce thermal deterioration of a resistance wire when a transient instantaneous rush current flows, by forming an insulating coating which covers the resistance wire and contains at least nearly spherical thin segments. SOLUTION: A resistance wire 12 is wound around a bobbin 11 constituted of ceramic or glass. Metal caps 13 are installed on both ends of the bobbin 11 and electrically connected with the resistance wire 12. Lead wires 11 are connected with the caps 13. Insulating coating 15 is formed to cover the bobbin 11, the resistance wire 12 and the caps 13. The insulating coating 15 is composed of particles, glass fibers and glass fine segments. The size of the glass fine segment is smaller than the interval between the adjacent resistance wires 12, and the shape is at least nearly spherical.  Thereby air gaps hardly exist between the resistance wire and the insulating coating and between the resistance wire and sealing agent, and heat dissipation is improved, so that a wire wound resitor wherein the resistance wire is hard to be thermally deteriorated when a transient instantaneous rush current flows can be obtained.
Patent JP-S61208839-A (JP)
Title: Testing method for tensile strength of semiconductor wire
Inventor: SUGAWA MANABU
IPC: H01L21/66
Filed: 1985-03-13
Abstract: PURPOSE:To effectively test the tensile strength of a wire of a semiconductor device by securing the wire through an adhesive to a bonding pad or a lead frame. CONSTITUTION:A resin seal is opened, and a wire 3 removed from a lead frame 1 is secured through an adhesive 6. A testing method of the tensile strength of a semiconductor wire is performed by securing the lead frame or the bonding pad of a semiconductor device through the adhesive to effectively perform the test of the tensile strength of the wire. The bonding force of the bonded portion of opposite side can be accurately tested by securing either one of the lead frame and the bonding pad. The tensile fracture test of the wire itself can be effectively performed by securing the both of the two.
Patent JP-S58170990-A (JP)
Inventor: ATSUTA TOSHIO
IPC: F16L9/02
Filed: 1982-03-30
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H09247400-A (JP)
Title: Storing system of still picture data
Inventor: KANBE TAKAHIRO
IPC: H04N19/00
Filed: 1996-03-07
Abstract: PROBLEM TO BE SOLVED: To reproduce an original beautiful still picture even at the time of deleting a message by storing the still picture and the message separately from each other. SOLUTION: The still picture is inputted by one frame from a picture source through and input part 7 and compressed to by stored in a memory 2 as a still picture file. Nest a message to fit to the still picture is inputted by means of a keyboard 3 to directly write it on VRAM 5 through HOST-BUS 8. At the time of this writing, a still picture behind a part on which the message is written is cur off in a block by CPU 1 to store it in the memory 2 buy way of HOST-BUS 8. Then when the position of the message is OK, the position and the content of the message is registered in the application area of data compressed just before. At this time, the application of JPEG is utilized.
Patent JP-H02230800-A (JP)
Title: Structure for fixing a small apparatus in a shelf
Inventor: UCHIUMI HIROSHI
IPC: H05K7/18
Filed: 1989-03-03
Abstract: PURPOSE:To obtain a shelf capable of surely accommodating a small apparatus and simply drawing out the apparatus only by removing screws exposed on the front surface by a method wherein two kinds of rails are combined with each other. CONSTITUTION:First rails 3 are fixed, along the depth direction, on the right and the left regions of the bottom part of a power supply apparatus 2 accommodated in a shelf 1. The first rail 3 constituted of a mold member having a U-shaped section composed of three walls 3a, 3b, 3c which mutually intersect at right angles. On a rack plate 5 of the shelf, second rails 4 are fixed, along the depth direction, at a position corresponding with the above-mentioned first rail 3. The second rail 4 constituted of a mold member having a U-shaped section composed of three walls 4a, 4b, 4c which mutually intersect at right angles. When the power supply apparatus is accommodated in the shelf 1 constituted in the above manner, the first rails 3 fixed to the power supply apparatus 2 is firstly engaged with the second rails 4 fixed to the shelf 1, and the power supply apparatus 2 may be gradually pushed into the shelf 2.
Patent JP-H02230609-A (JP)
Title: Conductive paper
Inventor: ITO OSAMU
IPC: H01B5/16
Filed: 1989-03-03
Abstract: PURPOSE:To obtain a conductive paper by arranging multiple contact points between conductive fibers adjacent to each other in a conductive layer, and forming multiple connecting passage for conducting the static electricity. CONSTITUTION:A conductive layer 3 is formed by combinating multiple stainless fibers 4 and a paper 2 in the surface 2a of the paper 2. Multiple contact points are formed between stainless fibers adjacent to each other to raise the connectability in a wide range between the stainless fibers, and the conductivity is improved. With this structure, a conductive layer can be formed with a small quantity of the stainless fiber. The fine shielding effect of the static electricity discharge can be sufficiently obtained with 2-8g/m<2> of the stainless fiber quantity in the conductive layer 3, and the surface resistance value 10<3>ohm/square can be obtained with 4g/m<2> of the stainless fiber quantity. Ni plated carbon fiber or the like which never rust and deteriorate can be used as a conductive fiber.
Patent JP-S63218180-A (JP)
Inventor: ISHIZAKI KEISUKE
IPC: H01R43/06
Filed: 1987-03-06
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H05251484-A (JP)
Title: Manufacture of semiconductor device and manufacture jig
Inventor: SEI FUMIHIRO
IPC: H01L23/50
Filed: 1992-03-09
Abstract: PURPOSE:To see that paste-form adhesive material does not turn into a through hole even if dice fixation is performed with paste-form adhesive material to a die-stage part which has a through hole. CONSTITUTION:The manufacture of a semiconductor device, which has the process of performing the dice fixation, using a paste-form adhesive material 14, to the die stage part 10 of a lead frame wherein a through hole 11 is provided in the die stage part 10 on which to mount a semiconductor chip 15, is so constituted as to perform dice fixation by blocking the through hole 11 with a projecting plate 12 serving as a plug so that the paste-form adhesive material may not jut out of the through hole 11 of the die stage part 10 when applying the paste-form adhesive material 14 on the die-stage part 10.
Patent JP-H04268796-A (JP)
Title: Flexible printed circuit board
Inventor: MAEZAWA HIDEKI
IPC: C08G59/40
Filed: 1991-02-23
Abstract: PURPOSE:To enable a flexible printed circuit board to be enhanced in thermal resistance, chemical resistance, and adhesion by a method wherein epoxy group- containing acrylic rubber compounded together with thermosetting resin are crosslinked with isocyanuric acid, tetraethylammonium bromide, and phthalic anhydride. CONSTITUTION:Thermosetting resin, acrylic rubber which contains over two epoxy groups in each molecule, isocyanuric acid, tetraethylammonium bromide, and phthalic anhydride are integral at components. Adhesive agent composition is composed of 100 parts by weight of acrylic rubber compounded with 0.2-1.5 parts by weight of isocyanuric acid, 0.6-3.0 parts by weight of tertraethylammonium bromide, and 0.1-2.0 parts by weight of phthalic anhydride, and a synthetic resin film is bonded to a metal foil with the adhesive agent concerned. If the adhesive agent is out of this range of composition, it deteriorates in stability and delays in crosslink speed.