baber/WOPTO huggingface dataset:
Patent JP-2001218890-A (JP)
Title: Game facility capable of coping with fraudulent payout
Inventor: OYA TAKATOSHI
IPC: G07F7/12
Filed: 2000-02-09
Abstract: PROBLEM TO BE SOLVED: To provide game facilities capable of coping with fraudulent payout of medals in which medals of a specified quantity or more are not discharged when the medals are fraudulently payed our for restricting damage on the medals by fraudulent operation. SOLUTION: A medal quantity sensor 5b is provided on a medal hopper 5a, and a supply restricting circuit 2 is provided to output a signal to a medal supply line 7 for stopping sending medals to the medal hopper 5a unless a signal indicating that discharge of medals is generated in a game machine 5 as a result of a game is outputted when the medal quanitty sensor 5b is off.
Patent JP-2001229736-A (JP)
Title: Transparent conductive film, transparent conductive sheet and touch panel
Inventor: OTANI TOSHIYUKI
IPC: G06F3/041
Filed: 2000-02-10
Abstract: PROBLEM TO BE SOLVED: To provide a transparent conductive film or transparent conductive sheet superior in durability for pen-input when used for a touch panel, particularly the transparent conductive film being nondestructive even with 100,000-time sliding test at the load of 5.0 N by using a pen (tip shape: 0.8 mmR) made of polyacetal, and a touch panel using these. SOLUTION: The transparent conductive film is made by laminating a hardened material layer with a hardening resin as the major component and a transparent conductive film in this sequence on a transparent plastic film base material, and dynamic friction coefficient of this transparent conductive film surface is 0.1 to 10.
Patent JP-2001224220-A (JP)
Title: Driving unit for cutting blade for tea plucking machine
Inventor: ABE TETSUYA
IPC: A01D46/04
Filed: 2000-02-10
Abstract: PROBLEM TO BE SOLVED: To provide the subject driving unit having such a scheme that a hydraulic motor is applied as driving source for a tea reaping device so as to obviate any unfavorableness supposed to result. SOLUTION: This driving unit mounted on a tea twigs/leaves reaping device with cutting blades 12 designed to face on the top surface of a tea ridge A has such a scheme that the cutting blades 12 are designed to be driven by a hydraulic motor M and a flywheel 20 is furnished so as to act on the output shaft 21 of the hydraulic motor M, and even in case the cutting blades 12 are overloaded, torque can stably be maintained by the aid of the inertia of the flywheel 20, thus a tea plucking work can smoothly be done without cutting blade driving halt.
Patent JP-2001221593-A (JP)
Title: Heat exchanger
Inventor: KATO SOICHI
IPC: F28F1/02
Filed: 2000-02-14
Abstract: PROBLEM TO BE SOLVED: To suppress the alkali-side corrosion of a tube caused by hydrogen embrittlement by reducing the generation of hydrogen even when a heat exchanger medium shifts to an alkali side. SOLUTION: The generation of hydrogen is reduced by suppressing the occurrence of corrosion reactions in alkali by cladding one side of a core material 18 which becomes a heat exchanger medium flowing passage side in a brazing sheet 17 forming the tube 4 with a corrosion-resistant layer 20 containing 2-10% zinc so that the hydrogen overvoltage may fall within the range of 580-740 mV when measured under a voltage.
Patent JP-2001226761-A (JP)
Title: Oxidation resistant film structure for niobium type heat resistant material and method of its deposition
Inventor: KASAMA AKIO
IPC: C23C14/34
Filed: 2000-02-15
Abstract: PROBLEM TO BE SOLVED: To provide an oxidation resistant film structure for a niobium type heat resistant material, capable of standing long use under an ultrahigh- temperature oxidizing atmosphere and hardly causing cracking and peeling even under a severe heat cycle, and a method of its deposition. SOLUTION: A diffusion preventive layer composed of niobium nitride or/and niobium boride is deposited onto the surface of a base material composed of niobium type heat resistant material. Then an oxidation resistant layer composed of silicides of one or more elements among Nb, Cr and Mo is further deposited onto the above surface. Moreover, the deposition of the diffusion preventive layer is performed by the ion implantation of N or/and B ions or by the vapor deposition of Nb simultaneously with the ion implantation; and the deposition of the oxidation resistant layer is performed by ion plating, sputter deposition or vacuum deposition.
Patent JP-2001226643-A (JP)
Title: Ultraviolet hardening-type adhesive composition for optical recording medium, and optical recording medium
Inventor: SHOJI TOSHIHIRO
IPC: G11B7/24024
Filed: 2000-02-16
Abstract: PROBLEM TO BE SOLVED: To provide an ultraviolet hardening-type adhesive composition exhibiting excellent anticorrosion and adhesion performance even in an endurance test at a high-humidity/temperature in a lamination-type optical recording medium where a translucent membrane and/or a reflection coating are/is made of silver or a metal and/or alloy both composed mainly of silver, and to provide an optical recording medium applied with the composition. SOLUTION: A monomer and/or an oligomer both having carboxyl group is/are included in the ultraviolet hardening-type adhesive composition.
Patent JP-2001230390-A (JP)
Title: Semiconductor non-volatile memory device and manufacturing method therefor
Inventor: SUGIHARA TAKESHI
IPC: H01L21/8247
Filed: 2000-02-17
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor non-volatile memory device and its manufacturing method which has a high break through margin at a source-drain electrode part for implanted ions and a high piling property (surface flattening property) of a side wall material into a trench in a field oxide film and an upper trench layer of both the source-drain electrode par and a source part. SOLUTION: A semiconductor non-volatile memory device has a semiconductor substrate on which surface has a concave pattern, a field oxide film formed inside the concave pattern and a first insulating layer, a floating gate electrode layer, a second insulating layer and a controlling gate electrode layer being laminated on semiconductor substrate surface. The semiconductor non-volatile memory device has a feature of having the floating gate electrode layer formed adjacent to the field oxide film, the field oxide film having a trench inside and a side wall material deposited on the whole surface of the semiconductor substrate including the trench and made etching back afterwards and the width W of the bottom of the trench being two times of t, when a distance from the lowest point of the side wall material existing in the trench to both the terminals of the trench bottom is given as t.
Patent JP-2001225465-A (JP)
Title: Ink jet recording head
Inventor: SHIMADA KATSUTO
IPC: B41J2/055
Filed: 2000-02-18
Abstract: PROBLEM TO BE SOLVED: To provide an ink jet recording head in which pressure generating chambers can be arranged at high density. SOLUTION: The ink jet recording head 50 comprises a substrate 10 where at least one and the other side faces are composed of single crystal silicon, and a groove 15 made in one side face of the substrate 10. A first recess 11 communicating with the groove 15 is made in the other side face of the substrate 10 on one side of the groove 15, and a second recess 12 communicating with the groove 15 is made in the other side face of the substrate 10 on the other side of the groove 15. A first diaphragm 13a covers the first recess 11 to form a first pressure generating chamber 21 and a second diaphragm 13b covers the second recess 12 to form a second pressure generating chamber 22.  A first piezoelectric element 23 is fixed to cause pressure variation in the first pressure generating chamber 21 and a second piezoelectric element 24 is fixed to cause pressure variation in the second pressure generating chamber 22.
Patent JP-2001238365-A (JP)
Title: Secondary cell charging control circuit
Inventor: KIHARA HIDEYUKI
IPC: H01M10/44
Filed: 2000-02-21
Abstract: PROBLEM TO BE SOLVED: To realize a secondary cell charging control circuit, capable of freely setting a charging current by the control by a high voltage switch in a battery pack. SOLUTION: A switch circuit 2 is connected to a secondary cell 3 in the battery pack 19. The circuit 2 is connected to the output of an AC-DC converter 1 in an adapter power source 18. The output of a clock signal generator 6 variable at a duty factor by a duty factor variable terminal 4 is connected to the input terminal 16P of a level shifter 16. Thus, a on/off of the switch circuit 2 is controlled by the output signal of the shifter 16. The drain of a high breakdown voltage P-channel MOS transistor 9 of a reset circuit 17 is connected to the drain of an N-channel MOS transistor 11.
Patent JP-2001238422-A (JP)
Title: Motor
Inventor: KAWAI TOSHIYUKI
IPC: H02K21/24
Filed: 2000-02-21
Abstract: PROBLEM TO BE SOLVED: To provide a motor, in which positional shift of a rotor is minimized by a permanent magnet, while minimizing the occupation space and the bearing housing can be reinforced. SOLUTION: The motor 1 comprises a rotor body part 52, facing a stator 40 secured to a frame 10 in the axial direction, a plastic bearing housing 20 having a thick tubular part 22 secured to the bottom wall 11 of the frame 10 and a thin tubular part 21 substantially concentric to the thick tubular part 22, a journal bearing 35 for rotatably supporting a rotary shaft 51 integral with the rotor body part 52 fitted in the thin and thick tubular part 21, 22 of the bearing housing 20, and an annular permanent magnet 30 fitted over the outer circumference of the thin tubular part 21 at a position proximate to a yoke part 70 integral with the rotor body part 52 in order to suppress positional shift thereof.
Patent JP-2001232324-A (JP)
Title: Method and device for pyrolyzing dioxins in ash
Inventor: KITANO MAKOTO
IPC: A62D101/22
Filed: 2000-02-21
Abstract: PROBLEM TO BE SOLVED: To pyrolyze dioxins by heating ash and suppress re-synthesis of dioxins. SOLUTION: An electrical heater 43 is provided at the outside of a pyrolysis furnace 13 in order to indirectly heat ash 10, wherein the ash 10 charged from the side of an ash charging port 14 is transported to the side of an ash discharging part 15. A combustion gas 24, which is generated at a hot air generating furnace 22 and contains oxygen in an concentration of <=16% is introduced into the pyrolysis furnace 13 through a combustion gas supplying line 27. On the other hand, a gas discharge line 29 having a suction blower 28 is connected to a gas discharge port 21 provided at the other side of the pyrolysis furnace 13 so that an inner gas is withdrawn. Further, a cooling device 30 is provided in order to rapidly cool the heat-treated ash 10a discharged from the pyrolysis furnace 13 by using water 35.  The ash 10 recovered by a bag filter 6 is charged into the pyrolysis furnace 13 through which the combustion gas 24 is continuously passed and the ash 10 is heated to 450 deg.C, and the heat-treated ash 10a is cooled in the presence of water 35 at the cooling device 30.
Patent JP-2001236553-A (JP)
Title: Coin processor
Inventor: OKA HIDEYUKI
IPC: G07F9/00
Filed: 2000-02-21
Abstract: PROBLEM TO BE SOLVED: To inexpensively provide a coin processor capable of preventing a mischief by returning inserted coins as they are when returning procedure is performed right afte throwing a coin simple in structure and high in reliability. SOLUTION: In order to solve the problem, the coins, which are to be returned by return operation as they are, are limited to one kind, 500-yen coin, further, the number of coins capable of being held is limited to two coins, and the coin holding mechanism of a holding part 15 is operated by making a pine 16a enter/leave a passage. With such a simple method, the device is simplified by simplifying a holding structure, and costs can be reduced. Further, by locating a coin passing sensor 25 for detecting a coin canceled in holding is passed through the passage located on the downstream side of the holding part 15, coin clogging or the like is speedily detected and reliability can be improved.
Patent JP-2001233255-A (JP)
Title: Van type body for truck
Inventor: HIRAISHI TAKESHI
IPC: B62D33/04
Filed: 2000-02-21
Abstract: PROBLEM TO BE SOLVED: To provide a van type body solving problems such as increase in a manufacturing cost due to use of a large panel and inconvenience in handling and allowing reduction in assembly man-hours and improvement of versatility. SOLUTION: This van type body for a truck is constructed of a plurality of split type heat/sound insulating panels 10-13 constituting respective face bodies of the van type body, a rear door panel 14, and a skeletal frame constructed of a corner rail 1 and a side rail 2 for slidably mounting the side parts of the split panels. A toothed receiving groove is formed on the each skeletal frame side for mounting each of the panels to the skeletal frame, and the tip part of a panel fixing toothed frame can be mounted in this groove. A cap nut for fixing an intersection part of the respective panels to the corner rail 2 is fastened so as to be fixed via an angle cove by means of a bolt.
Patent JP-2000336002-A (JP)
Title: Spraying method for agrochemical composition
Inventor: SEKIGUCHI MIKIO
IPC: A01N33/18
Filed: 2000-02-23
Abstract: PROBLEM TO BE SOLVED: To provide a method or spraying an agrochemical, capable of simply, effectively and safely exterminating harmful organisms in the soil, by solely spraying an active ingredient of the agrochemical having a specific solubility in water, or spraying as an agrochemical composition comprising formulation of the above active ingredient of the agrochemical and an adjuvant, through an irrigation tube laid on the surface of the soil or in the soil. SOLUTION: This method for spraying an agrochemical comprises solely spraying an active ingredient of the agrochemical which has a solubility in water of <=50 wt.% (the weight of the active ingredient dissolved in 1 kg of the water is not more than 1 kg at 25 deg.C) and preferably has a boiling point of >=40 deg.C and a vapor pressure of >=0.5 mmHg/20 deg.C (for example, chloropicrin, and a mixture of 1,3-dichloropropene and 1,2-dichloropropane), or spraying as an agrochemical composition which comprises formulation of the above active ingredient of the agrochemical and an adjuvant (for example, an organic solvent, water, a carrier and a surfactant) and is preferably prepared into an emulsion, an emulsion in water (EW), an aqueous emulsion and a solid emulsion, through an irrigation tube laid on the surface of the soil or in the soil.
Patent JP-2001236489-A (JP)
Title: Ic magnetic card and ic magnetic card terminal
Inventor: MAEOKA ATSUSHI
IPC: B42D15/10
Filed: 2000-02-18
Abstract: PROBLEM TO BE SOLVED: To solve the problem where plural cards have to be held for each use and the risk when it is lost is very high, since a conventional magnetic card has small storage capacity. SOLUTION: This IC magnetic card, equipped with an IC chip and a magnetic stripe, has plural magnetic card functions by storing the IC chip with pieces of information recorded on plural magnetic cards before and transferring information to the magnetic stripe, as needed. This IC magnetic card terminal reads and writes the IC magnetic card. Furthermore, an IC magnetic card and an IC magnetic card terminal which can erase information on the magnetic card after use are provided to reduce the risk in case of losing.
Patent JP-2001237014-A (JP)
Title: Terminal metal fitting
Inventor: FUJII MASAYASU
IPC: H01R13/11
Filed: 2000-02-24
Abstract: PROBLEM TO BE SOLVED: To improve the strength of strength of both bottom wall and elastic contact piece. SOLUTION: Because a piece 19 to regulate an excessive bending is erected with anteverted posture from the bottom wall 11 to a lapel part 17 side, the distance Sb from the lapel part 17 of elastic contact piece 14 to the contact position to the piece 19 to regulate the excessive bending can be made smaller, while securing long length Sa from the lapel part 17 at the bottom wall 11 to the piece 19 to regulate the excessive bending.
Patent JP-2000261292-A (JP)
Title: Method and architecture for processing digital feedback control signal
Inventor: ROBERT B SUTASUZEUSUKII
IPC: H03H17/02
Filed: 2000-02-24
Abstract: PROBLEM TO BE SOLVED: To obtain a system and a method which use parallel routes, which process the separated parts of a signal, to generate a feedback control signal. SOLUTION: This method practically doubles the operation speed of a feedback circuit by arranging two processing routes 101 and 102. When two routes are used, each route is operated at an about half of the data transfer speed of an incoming data signal 516. This method is also useful for processing in an application where a plurality of modes are used. For example, three modes of FIR bypass 201, acquisition 202, and data tracking 203 are desired when this method is used for a read channel 514 of a disk drive 500. Switch among three modes of a system 200 provided in the read channel of the disk drive 500 is easily realized, and this method and a support structure can be adapted to many kinds of feedback circuits.
Patent JP-2000252390-A (JP)
Title: Semiconductor device and its manufacture
Inventor: CARTER BUFORD H JR
IPC: H01L23/31
Filed: 2000-02-25
Abstract: PROBLEM TO BE SOLVED: To form a passage for scattering thermal energy from a chip and to be advantageous for soldering by forming a shape of a foil to scatter the energy from the chip. SOLUTION: A semiconductor device has a body of a capsule sealing material 101 around an IC chip 102. The material is a thermosetting material containing an epoxy used in the step of transfer molding a semiconductor as a base. A molding material forms an overall flat lower surface 103 and an overall flat upper surface 104. The molded plastic 101 is projected from the surface 103 and intruded into the overall protrusion 106 and recess 107. The protrusion 106 and recess 107 are formed in the same plastic molding step used for sealing a capsule of the device. A foil 108 is brought into contact with a contour of a lower half surface of the mold to form the protrusion 106 and the recess 107 by a pressure applied to a molding compound.
Patent JP-2001244741-A (JP)
Title: Voltage-controlled oscillator
Inventor: HASHIMOTO KOJI
IPC: H01P7/08
Filed: 2000-02-29
Abstract: PROBLEM TO BE SOLVED: To provide a voltage-controlled oscillator that is used for small-sized portable units, having a high C/N and a small size. SOLUTION: A line 6 thinner than a strip line resonator 2 is used to interconnect the desired position of the strip line resonator 2, provided on a front side of a multi-layered board 1 and whose one end is connected to ground and an emitter resistor 7 of an oscillation transistor(TR) 8, and a capacitor 11 interconnects the other end of the strip line resonator with the base of the oscillation TR to bring an emitter 9 to have a high impedance.
Patent JP-2001241230-A (JP)
Title: Data communication subsystem and data communication method
Inventor: KOYAMA MASAKI
IPC: G06F21/34
Filed: 2000-02-29
Abstract: PROBLEM TO BE SOLVED: To provide a data communication subsystem and a data communication method preventing the transmission and reception of data by successful impersonating to the subject of others when data are transmitted and received through a user between a data transmitter and a data receiver. SOLUTION: The data communication subsystem has an input section 10 for inputting the personal information of a user, a storage section 11, in which previously registered registration information is stored, a collating section 12 collating personal information and registration information, and a decision section 13 deciding whether or not the transmission of stored data is permitted on the basis of an output from the collating section 12, and has the data transmitter 1 transmitting data when the decision section 13 outputs a transmission enabling signal and the data receiver 100 receiving data through the user by the contact of the user, on which the data transmitter 1 is mounted.
Patent JP-2000314600-A (JP)
Title: Heat exchanger
Inventor: KOBAYASHI MASAHIRO
IPC: F28F1/32
Filed: 2000-02-29
Abstract: PROBLEM TO BE SOLVED: To make distribution of the flow of air passing through a slit uniform by setting the width of the slit formed in a heat transfer fin, the width of the heat transfer fin, and (the number of rows of the slits formed in the heat trans fer fin)/(the numbers of rows of the heat transfer fins) so that a specific expres sion is satisfied. SOLUTION: In an array of slits, slits 51 and 52 and slits 55 and 56 are arranged at the front and rear parts of a heat-transfer pipe 4, respectively. The slits 52 and 55 are formed, and they are made longer than the slits 51 and 56. Also, the slits 51 and 52 and the slits 55 and 56 are mutually arranged in different lengths in an adjacent vertical direction at the front and rear positions of the heat-transfer pipe 4, and are also mutually arranged in different lengths in an adjacent horizontal direction. Regarding the width and interval of the slits, in the case the number of fins per row of fins is 6 or fewer, the relationship of an expression is constituted to satisfy the following expression, where Ws, Wf, and N indicate slot width, fin width of one row, and the number of rows of the slits formed in the heat transfer fin/the number of heat transfer fins, respectively.
Patent JP-2001244204-A (JP)
Title: Semiconductor treating device
Inventor: FURUKAWA NAGAKI
IPC: H01L21/205
Filed: 2000-02-29
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor treating device which can form a uniform film on a wafer by equally sending a gas material to the surface of the wafer. SOLUTION: This semiconductor treating device is provided with a reaction chamber 11, a support 16 which is set up in the chamber 11 to support the wafer 15, gas introducing pipes 19a-19d through which gases are introduced into the chamber 11, and an exhaust pipe 21 through which gases are exhausted from the chamber 11. In the chamber 11, a flow straightening plate 14 which divides one kind of gas or a mixed gas to a gas mixing chamber 13 and a treatment chamber 12 after the gas is branched into a plurality of systems and has a plurality of gas passing holes 14a is set up.
Patent JP-2001244304-A (JP)
Title: Substrate for mounting semiconductor and manufacturing method therefor
Inventor: INOUE FUMIO
IPC: H05K1/03
Filed: 2000-02-25
Abstract: PROBLEM TO BE SOLVED: To provide a substrate for mounting a semiconductor suitable for a small semiconductor package which is superior in miniaturization, densification, and reliability by preventing the package from cracking, and to provide an efficient method for manufacturing the substrate for mounting the semiconductor. SOLUTION: A substrate for mounting a semiconductor consisting of a flexible isolation base material and a wiring conductor, is characterized by that the base material has low moisture permeability.
Patent JP-2001247688-A (JP)
Title: Heat-shrinkable polymer film
Inventor: SUGIURA KATSUHIKO
IPC: B29C61/02
Filed: 2000-03-03
Abstract: PROBLEM TO BE SOLVED: To provide a heat-shrinkable polyester film having an excellent low temperature heat shrinkability, temperature dependence of the heat shrinkage indicating a mild and gentle curve, and excellent flexibility and transparency. SOLUTION: The heat-shrinkable polyester film comprises molding a compound of (a) a non-crystalline polyethylene terephthalate of 95-50 pts.wt. with (b) a copolymerized polyester ether of 5-50 pts.wt., (b) the copoymerized polyester ether comprising a dicarboxylic acid component composing of terephthalic acid and isophathalic acid as principal components, and a diol component composing of tetramethylene grlycol and polytetramethylene oxide glycol as principal components, 3-30 mol% of the whole dicarboxylic acid component constituting the copolymerzied polyester ether being the isophathalic acid, and further 1-30 wt.% of the whole weight of the copolymerized polyester ether being a polytetramethylene oxide segment.