baber/WOPTO huggingface dataset:
Patent JP-S5959207-A (JP)
Title: Permselective membrane and preparation thereof
Inventor: YOSHIOKA NORIAKI
IPC: B01D71/26
Filed: 1982-09-25
Abstract: PURPOSE:To enhance the water permeability of a membrane comprising an ethylene/vinyl copolymer fixed to a water pervious substrate, by forming voids each directly contacting with a dense layer at the upper end thereof in a porous layer. CONSTITUTION:21.0pts.wt. ethylene/vinyl alcohol copolymer containing 20% ethylene is dissolved in 79.0pts.wt. isopropyl alcohol-water (a volume ratio of 6:4) to prepare a film forming solution. This solution is applied to one surface of a polyester nonwoven fabric substrate and, after the back surface thereof is contacted with a water surface for 10sec at 2 deg.C, the whole is immersed in water to coagulate the copolymer. The obtained membrane consists of a porous layer 3 integrally fixed to a water pervious substrate 6 and a dense layer 1 formed on the surface thereof and voids 4 each extending to a membrane direction are formed in the porous layer 3. When pure water is passed through this membrane at 25 deg.C under a pressure of 2.0kg/cm<2>, a water permeating speed is 14.8m<3>/m<2>. day and the removal ratio of PEG with an M.W. of 20,000 is 30%.
Patent JP-H077120-A (JP)
Title: Mounting structure for semiconductor device, mounting board and semiconductor device
Inventor: ARAI KATSUO
IPC: H05K1/18
Filed: 1993-06-14
Abstract: PURPOSE:To avoid projection of a semiconductor device from a mounting board by forming a receiving recess in a mounting board body, inserting a semiconductor device therein, and connecting the outer leads of the semiconductor device electrically and mechanically with contacts formed around the opening of the recess. CONSTITUTION:A semiconductor device 15 is inserted into a receiving hole 24 made in a mounting board 22 with the end face side thereof, from which a group of outer leads 8 of a package 4 projects, directing upward. Consequently, each outer lead 8 of the semiconductor device 15 is connected, on the lower face side thereof, with a solder cream placed on each land 25 formed around the opening of the receiving hole 24 made in the upper face of the mounting board 22. When the solder cream is fused by reflow soldering and eventually solidified, each outer lead 8 is connected electrically and mechanically with the land 25 through a solder bump layer 27. This structure allows mounting of the semiconductor device 15 onto the mounting board 22 without projecting the device 15 from the upper face of the board 22 thus realizing reduction of overall height.
Patent JP-S6412217-A (JP)
Title: Angle measuring sensor
Inventor: FUKUMURO MASAHARU
IPC: G01C9/10
Filed: 1987-07-03
Abstract: PURPOSE:To achieve accurate measurement, by utilizing a change in a thin film electric resistance with the turning of a conductive ball between electrodes according to a surface angle of an object to be measured. CONSTITUTION:An electrode 8 is bent on a substrate 3 within a casing 2 in a circular arc to the perimeter thereof to arrange a rotatable conductive ball 14 and the ball 14 turns between a pair of electrodes 8 according to an angle with the perimeter of the casing 2 abutting the surface of an object to be measured. With such an arrangement, a thin film electric resistance is caused and a resistance value R per unit angle is determined by the formula I to measure an angle of a surface, thereby enabling accurate measurement. In the formula I, D1 represents thin film electric value at one side of casing, D2 thin film electric resistance value at other sides of casing and D3 angle between one side and other sides of casing.
Patent JP-S6059082-A (JP)
Inventor: DEEBITSUDO TEII KABUIRU
IPC: C23F13/00
Filed: 1984-08-10
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-2000069571-A (JP)
Title: Method and system for safe and sure remote payment of article purchased and/or service received through mobile radio telephone system, and the mobile radio telephone system
Inventor: CAPITANT ARNAUD
IPC: G06Q20/00
Filed: 1999-06-15
Abstract: PROBLEM TO BE SOLVED: To provide the method and system for safe and sure remote payment of articles purchased and/or service received by using a mobile radio telephone system and to provide the mobile radio telephone system. SOLUTION: The method includes a step 62 where a management center 6 and/or a payment server 4 and/or a control center identify a purchasing person 2. The purchasing person 2 pays remotely articles purchased and/or a service received from a supplier 7 by using a mobile radio telephone system 1 safely and surely.
Patent JP-H0454990-A (JP)
Title: Electric shaver
Inventor: KAMEOKA HIROYUKI
IPC: B26B19/04
Filed: 1990-06-26
Abstract: PURPOSE:To prevent the deformation of an outer cutting edge without injuring comfortable shaving, by providing a locking means whereby the movement of an inner cutting edge is locked together with the off-control of a power switch. CONSTITUTION:In the front surface of a main body 1, a switch handle 5 for a power switch is provided and is vertically slidable. When the switch handle 5 is lowered downward, an electric source is off, and when raised upward, is on. One end of a link 6 supported by a pin 15 is connected to the inside of the switch handle, and the other end of the link 6 is connected to one end of a locking rod 7. On the other hand, an engagement groove 33 with which the other end of the locking rod 7 is engaged is formed on the undersurface of a base 30 for an inner cutting edge 3. When the electric source is off by lowering the switch handle, the locking rod 7 shifted upward by the link 6 is engaged with the engagement groove 33, and the movement of the inner cutting edge 3 is stopped. For that reason, even if outer force is applied to an outer cutting edge 2, the deformation of the outer cutting edge 2 does not occurs since the inside of the outer cutting edge 2 becomes in the state of being supported by the inner cutting edge 3 locked.
Patent JP-H10339535-A (JP)
Title: Air-tight device for tightly closed container
Inventor: NAKAI TETSUSHI
IPC: F25D7/00
Filed: 1997-06-09
Abstract: PROBLEM TO BE SOLVED: To simplify a structure, by a method wherein either a main body of a container or a lid is provided with a working fluid control means for pushing a packing member arranged at a position corresponding to a circumference of an opening against either the lid or the main body of the container and for releasing this pushing operation. SOLUTION: This container is constructed such that a main body 3 of the container having an opening 2 and a lid 4 for closing the opening 2 are air-tightly sealed from each other. In this case, the lid 4 is arranged in such a way that it can be moved toward the main body 3 of the container when a pressure in the closed container 1 is reduced, either the main body 3 of the container or the lid 4 is provided with a packing member 10 at a position corresponding to a circumference of the opening 2, and further there is provided an operating fluid control means for pushing the packing member 10 toward either the lid 4 or the main body 3 of the container and releasing this pushing operation.  Further, the packing member 10 is stored in a packing groove 11 formed in either the main body 3 of the container or the lid 4, an operating fluid line 13 for the operating fluid control means is connected to the packing groove 11, and the operating fluid control means is provided with a pressure adjusting means 20 such as a release valve or the like.
Patent JP-H05185277-A (JP)
Title: Soldering paste
Inventor: INON DEGANI
IPC: B23K35/36
Filed: 1992-06-26
Abstract: PURPOSE: To provide a solder paste effectively useful in applications such as surface mounting of components on printed circuit boards, and in which, after soldering, the residue from the flux is either removable by water cleaning or requires no cleaning at all. CONSTITUTION: This soldering method is the one in which a solder paste is printed on at least either a 1st or 2nd object, the 1st and 2nd objects are made close, and the paste is heated to a reflowing temp., and the paste is composed of (a) a solder, (b) a removing agent for metallic oxide, (c) a low temp. component which is essentially evaporated at the reflowing temp. or below and is not essentially evaporated at a room temp., (d) a high temp. component preventing the reoxidation of the solder and having a high temp. component having <1 Torr vapor pressure at 180 deg.C and (e) a rheological properties promoter enabling the printing.
Patent JP-S6325617-A (JP)
Title: Observing device
Inventor: INOUE TAMOTSU
IPC: G02B27/02
Filed: 1986-07-18
Abstract: PURPOSE:To accurately and easily observe a liquid substance to be observed in a transparent case simultaneously from its upper and lower sides by oppositely arranging a mirror and a convex lens on a frame and using its intermedium space as an observing area. CONSTITUTION:The concave mirror 12 and the convex lens 13 are oppositely arranged on the frame 11 and intermedium space is used as an observing area and irradiated by a light source 14. A test tube storing the liquid substance to be observed is set up on the observing area, the upper state of the substance to be observed is expanded and observed through the lens 13 and the lower state is expanded and observed through the mirror 12 and the lens 13. Thereby, the upper and lower sides of the liquid substance in the transparent case can be simultaneously, accurately and easily observed.
Patent JP-S5690947-A (JP)
Title: Spring copper alloy for electric machinary
Inventor: SATOU TAKEHIKO
IPC: C22C9/00
Filed: 1979-12-26
Abstract: PURPOSE: To inhibit the crystal grains of a Cu alloy contg. Ni and Sn from coarsening and prevent surface roughening phenomena in bending by adding a small amount of B to the alloy.  
     CONSTITUTION: This spring Cu alloy for an electric machinary is obtd. by adding 0.02W1.0wt% B to a Cu alloy contg. 5W20wt% Ni and 1W8wt% Sn. By adding b, a stable intermetallic compound of B is uniformly dispersed in the alloy to prevent the crystal grains from coarsening even at a relatively high final solid sonl. treatment temp. or a relatively high final annealing temp. at which the crystal grains tend to coarsen. Accordingly, surface roughening phenomena such as creases and orange peel effect do not occur in bending. 
     COPYRIGHT: (C)1981,JPO&Japio
Patent JP-2000357206-A (JP)
Title: Method for processing line drawing and recording medium where line drawing processing program is recorded
Inventor: OHARA SHUICHI
IPC: G06T9/20
Filed: 1999-06-15
Abstract: PROBLEM TO BE SOLVED: To improve picture quality without spoiling the shape of linearity and to improve the certainty of character recognition by averaging images by using the directivity of a line part area extracted by using a local feature difference. SOLUTION: A line drawing detecting process part 13 makes a square numeral array operate as an image filter on image data 2 including a line drawing and detect the line drawing while making pixels in the area of the square numeral array and pixels of the image of the filter area part of the image data 2 including the line drawing correspond to each other. Denoting the number of line drawing extraction filters as N and the numbers of the filters as n (n=1 to N), the density mean An or density standard deviation Bn of a pixel group corresponding to an area of a numeral '1' is calculated as to all line drawing extraction filters (n) for object pixels of the image data 2 and the density mean Cn or density standard deviation Dn of the pixel group of the whole filter area is calculated (S1, 2). The ratio An/Cn or Bn/Dn is calculated and used to determine an image feature direction and an image direction index (S3, 4).
Patent JP-H05323483-A (JP)
Title: Supplying mechanism for sheet body
Inventor: MUNAKATA YASUHIRO
IPC: B65H3/22
Filed: 1992-05-18
Abstract: PURPOSE:To surely supply a sheet body, especially a photosensitive sheet body of an X-ray radiographing equipment for a medical use from a supplying cartridge. CONSTITUTION:A supplying cartridge 34 enclosing a sheet body A in layer built is attached to an under part of a main body 1 of a photographing device in freely attachably and detachably, a supplying body 325 moving back and forth is arranged to the main body 1 side confronted with the supplying cartridge 34 and an arm 331 is provided projectingly to the supplying body 325 rotatably upward and downward, and, at the same time, the arm 331 is energized to an under part, the rear end of the sheet body at highest order of the sheet body A enclosed in the supplying cartridge 34 is hooked with a hooking piece 333 attached to the top end of the arm so as to send out one by one with a high speed cycle to an upper part of a photographing part 5.
Patent JP-H0217614-A (JP)
Title: Electrode-treatment of chip component
Inventor: TSUJIMOTO YUKIO
IPC: H01G13/00
Filed: 1988-07-06
Abstract: PURPOSE:To reduce the surface area of a component by cooling a low-melting point metal film when it merely passes the surface of a high-frequency induction coil by performing high-frequency heating and fluxing of a low-melting point metal film at the outermost layer of an electrode of chip component retaining the low-melting point metal film at the outermost layer, having the high-melting point metal film as a ground layer at a power supply by high-frequency induction treating. CONSTITUTION:When producing a chip component 7 such as a chip resistor which is one type of electronic components, a high-frequency induction coil 17 is wound in spiral, a cylindrical gap part 18 is provided, and the component 7 can pass through it. A current of 2kW max. with a high frequency of 13 to 15MHz is allowed to flow through this coil 17 and the component 7 is closed within a state where an air of 10l/min flows at the central part. With this component 7 as a polygonal chip resistor, the lowermost layer of the construction of the electrode part is Ag-Pd, the middle layer is Ni, and the outermost layer is a low-melting point metal plating film having an electrical plating with a specified thickness. Then, by closing the component 7 within the coil 17 for approximately 10 seconds and performing treating, the surface is turned into a fluxing smoothing state by high-frequency induction heating.
Patent JP-H0518840-A (JP)
Title: Differential pressure sensor
Inventor: TAMURA MORIO
IPC: G01L7/08
Filed: 1991-07-09
Abstract: PURPOSE:To provide a hermetic seal mechanism which achieves a high-pressure sealing at a same member as a diaphragm distortion-producing portion and at the same time enable the number of portions to be sealed to be reduced and the manufacture to be eased extremely, and obtain a differential pressure sensor with a highly reliable structure. CONSTITUTION:In a distortion-producing portion 4a of a diaphragm 4 which is formed by a metal plate, an insulation film is formed on one surface and then a protection film is provided on this insulation film, thus providing a distortion gauge film and a wiring film. Then, a title item is so constituted that a fluid pressure is guided to each surface of front and rear surfaces of the diaphragm 4 and a pressure detection signal which is generated at the wiring film is taken out by a wiring which is lead out through a hermetic seal structure which is formed at a non-distortion-producing portion 4b of the diaphragm 4.
Patent JP-H09330987-A (JP)
Title: Manufacture of semiconductor device
Inventor: YAMANE TETSUYA
IPC: H01L29/792
Filed: 1996-06-07
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method by which a semiconductor device which is provided with a gate electrode having a stacked structure composed of a first conductor layer, an insulating film, and a second conductor layer can be manufactured and the widths of the layers can be made even. SOLUTION: A semiconductor device manufacturing method includes a process (a) in which a first conductor layer 12, an insulating film 13, and a second conductor layer 14 are successively formed on a gate oxide film 11 formed on a semiconductor substrate 10, a process (b) in which a resist material 15 is formed on the second conductor layer 14, a process (c) in which the second conductor layer 14 and the insulating film 13 are successively patterned by using the resist material 15 as an etching mask, and a process (d) in which the first conductor layer 12 is patterned by using the material 15 as an etching mask. The side wall protective film 20 which is formed on the side walls of the second conductor layer 14 and insulating film 13 at the time of patterning the film 13 in the process (c) is removed between the processes (c) and (d).
Patent JP-H0217640-A (JP)
Title: Semiconductor device
Inventor: MURANAKA KIYOHIKO
IPC: H01L21/312
Filed: 1988-07-05
Abstract: PURPOSE:To improve the adhesion of a protective film and a substrate and enable improving the thermal stress resistance by compounding a two-layer surface protective film from silicon polyimide containing silicon and polyimide not containing silicon. CONSTITUTION:When polyimide is used as a protective film, silicon is added to polyimide to improve the adhesion with a substrate. This increases the adhesion, however silicon makes the film harder, therefore, the resin stress by thermal stress damages the protective film to decrease the characteristic and lower the moisture resistance level. Polyimide not containing silicon is very soft and thermal stress resistant but less adhesive, therefore, a film made of this material is liable to peel off and of a lower moisture resistance level. To improve the adhesion of the protective film and the substrate, silicon polyimide 4 is formed first and then polyimide 5 not containing silicon is formed thereon to improve the thermal stress resistance.
Patent JP-H0333632-A (JP)
Title: Apparatus for analyzing connection characteristic
Inventor: YOKOTA YUKO
IPC: G06F17/50
Filed: 1989-06-30
Abstract: PURPOSE:To reduce a calculation time and the use quantity of a memory and to achieve the enhancement of the efficiency of planning and the stabilization of a solution by calculating a partial characteristic represented by a transfer function matrix from the characteristic data of the constitutional element of a partial structure. CONSTITUTION:Transfer function operating means 52a, 52b calculate the transfer function matrice of a constitutional element from the characteristic data obtained by actually measuring or analyzing the characteristics such as vibration or the like of a structure. Coordinates conversion means 54a, 54b apply angle conversion to the transfer function matrice obtained by the means 52a, 52b on the basis of the coordinates positional relation determined based on coordinates conversion data to calculate the transfer matrice in a coordinates system after connection. A connection means 55 connects said transmission function matrice according to the connection condition determined based on connection definition data to form the transmission function matrix of a connection body after connection. By this method, a solution can be calculated as a symmetric matrix and, since the degree of freedom before coordinates conversion and that after coordinates conversion are not present in an equation in a mixed state, a calculation time and the use quantity of a memory are reduced and a solution is also stabilized.
Patent JP-S5977151-A (JP)
Title: Driving device for automobile
Inventor: KUBO MASANORI
IPC: B60K17/08
Filed: 1983-09-14
Abstract: PURPOSE:To miniaturize a driving device, by installing a hydraulic type torque converter and an auxiliary speed change gears consisting of an underdrive gear having a reduction part ratio of more than 1 and an overdrive gear having the reduction gear ratio of less than 1 in a crankshaft coaxially. CONSTITUTION:A crankshaft 2 of an engine 1 is connected to a hydraulic type torque converter 3. An auxiliary speed change gear 11 is provided with an underdrive gear 12 and an overdrive gear 13 installed coaxially in the crankshaft 2. The underdrive gear 12 is provided with each of first and second planetary gears 15 and 16, and an intermediate shaft 40 extending to the center of the auxiliary speed change gear 11 is being disposed coaxially with an input shaft 16, transmitting the power out of the underdirve gear 12 to the overdrive gear 13. The overdrive gear 13 is provided with planetary gears 41. A ring gear 44 is equivalent to an output of the overdrive gear 13 and at its outside, an output gear 53 is formed. A one-way clutch 54 controls the connection between a carrier 45 and this output gear 53.
Patent JP-S5799092-A (JP)
Title: Chrominance signal circuit for pal color television receiver
Inventor: HOSOYA NOBUKAZU
IPC: H04N9/70
Filed: 1981-10-20
Abstract: PURPOSE:To normalize the switching phase of a PAL switch automatically with PLL color synchronization, by including an ID(identifying)function in a PLL synchronization operation. CONSTITUTION:If the frequency and phase of chrominance subcarrier wave generated from a voltage controlled oscillator 9 is shifted by a color killer signal generating circuit 17, a sweeper circuit 15 makes sween operation, and on the other hand, when the frequency and phase of chrominance subcarrier wave is within a prescribed range, the circuit 15 is fixed to a halt state to lock color synchronization PLL. That is, if the switching of PAL switch 20 is not normal, the sweeper circuit 15 continues sweep operation with the output of the circuit 17 and picks up one trigger pulse P3 to a flip-flop 21 during this period. The switching mode of the PAL switch 20 after pickup of one pulse is opposite to the switching mode before. Thus, the color burst demodulation output of an R-Y demodulator 8 is increased to lock the PLL color synchronization.
Patent JP-2000003679-A (JP)
Title: Cathode ray tube using heater insulating film of low residual quantity of impurity for cathode of electron gun, and method for determining residual quantity of impurity in heater insulating film
Inventor: EZAWA MASAYOSHI
IPC: G01N23/22
Filed: 1998-06-16
Abstract: PROBLEM TO BE SOLVED: To provide a cathode ray tube using a heater insulating film of a low impurity residual quantity for an electron gun cathode, and selectively using a good heater by determining the impurity residual quantity in a coating insulating film, using a relatively simple determining method of the residual quantity of impurity in the heater wire coating insulating film, in manufacturing the heater used for the electron gun cathode. SOLUTION: This cathode ray tube is provided with a fluorescent screen formed on an inside surface of a faceplate of a panel part, a deflection coil set around a funnel part, and an electron gun contained in a neck part. A heater 25 of an electron gun cathode 13 is formed by winding a rhenium-tungsten heater wire 26 around a molybdenum core wire, and coating an alumina insulating film 27 on them, thereafter by melting and removing the molybdenum core wire. Then, a residual quantity of the molybdenum in the alumina insulating film 27 is determined, to use the heater 25 having the molybdenum residual quantity <=7000 ppm in the alumina insulating film 27, according to the determined result.