baber/WOPTO huggingface dataset:
Patent JP-2000314567-A (JP)
Title: Compressor for cryogenic refrigerator
Inventor: FUJIWARA KENJI
IPC: F25B9/00
Filed: 1999-04-30
Abstract: PROBLEM TO BE SOLVED: To save energy by efficiently cooling coolant gas and freezer oil according to their thermal capacities. SOLUTION: A heat exchanger 11 comprises a plurality of small fans 12, 12, 13 and 13. The upper fans 12 and 12 are dedicated to a piping 16 for freezer oil, while the lower fans 13 and 13 are allocated to a piping 15 for high-pressure helium gas. As a result, it is possible to set the performance of individual fans 12 and 13, so as to obtain the minimum airflow necessary for sufficiently cooling the freezer oil or the helium gas and efficiently cool the high-pressure helium gas and the freezer oil, according to their heat capacities to realize energy saving. In addition, the lower fans 13 and 13 having lower cooling performance are allocated to the piping 14 for the high-pressure helium gas having lower thermal capacity. In this way, the high-pressure helium gas and the freezer oil are further cooled efficiently.
Patent JP-H01294414-A (JP)
Title: Method and apparatus for fluidized bed cleaning
Inventor: OTANI HISAMICHI
IPC: B65B55/24
Filed: 1988-05-20
Abstract: PURPOSE:To provide a uniform cleaning characteristics to remove dirt and oil as well as electrostatic contamination, by immersing the material to be washed in a fluidized bed consisting of liquid and pulverized substances and delivering a jet of liquid to the material therein for cleaning by a liquid injection means. CONSTITUTION:A main tank 2 is previously filled with pulverized substances consisting of silicious sand at intervals. The material W to be washed is immersed in a fluidized bed by operating a lift cylinder 14. The lower and inner surfaces of the material W in the fluidized bed are washed by the collision of cleaning material with the pulverized substances caused by delivering a jet of liquid from a diffusion plate 3, while the upper surface thereof and the side and upper surfaces thereof less exposed to such jet are effectively washed with the cleaning agent delivered from an injection pipe 5 and the pulverized substances in the fluidized bed. The material W, after being washed in a fluidized bed tank 1, is moved upwards by operating the lift cylinder 14, placed on a guide member 21 for a finish washing pat 19 by a suitable means and exposed to the clear water injected in every direction by a high pressure water injection pipe 20.
Patent JP-S61284549-A (JP)
Title: Desulfurizing method
Inventor: SATO KEIICHI
IPC: C22C33/04
Filed: 1985-06-10
Abstract: PURPOSE:To drastically decrease the amt. of the high-carbon ferronickel to be stuck to a ladle by the temp. decrease of a molten metal by desulfurizing simultaneously the high-carbon ferronickel by a desulfurizing material in the stage of receiving the same into the ladle thereby reducing the time till casting. CONSTITUTION:The desulfurizing material such as CaC2 A is added to the melt of the high-carbon ferronickel tapped from a producing furnace 2 such as electric furnace at the same instant when the melt is received by a spout 3 into the ladle 1. The molten metal is stirred by a stirrer 5 to convert the S contained in the ferronickel to CaS and to desulfurize the molten metal by the exothermic reaction. The molten metal is successively transferred to a casting site by a crane 4 and is cast as a high-carbon ferronickel ingot by a casting machine 6. The shorter time till casting is required by executing the desulfurization treatment in the stage of tapping the molten metal into the ladle, by which the temp. drop of the molten in the ladle is decreased and the amt. of the high-carbon ferronickel to be stuck to the inside of the ladle is considerably decreased. The production cost of the ingot is reduced by the reduced cost for the retreatment thereof.
Patent JP-S63288884-A (JP)
Inventor: YAMAMOTO TOMOICHIRO
IPC: B66B5/02
Filed: 1987-05-21
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S62279071-A (JP)
Title: Sliding nozzle device
Inventor: NISHIMURA TAKAHIRO
IPC: B22D41/40
Filed: 1986-05-28
Abstract: PURPOSE:To make exclusive bearing loading device unnecessary and secure the bearing between both plates by providing on a sliding metal frame the mechanism performing the setting and release of the bearing in the space between the plate supported on the sliding metal frame and the plate sliding therewith. CONSTITUTION:When a sliding metal frame 3 is moved in the right direction by a driving device, the inclined face 22 of a flange part 21 is slipped into the lower face of a cotter 16 and the level of the locking point of the inclined face 22 to the cotter 16 is ascended. A bearing holder 14 is ascended against the energizing force of a compression coil spring 10 via the cotter 16 and the elastic resiliency of the spring 10 loads the action force in the direction pushing a pressing block 13 down to the lower part. Since the block 13 is engaged with the hook 25 fitted to a fixed metal frame 1 it energizes an opening and closing metal frame 2 in the fixed metal frame 1 direction, energizing the sliding metal frame 3 supported by the opening and closing metal frame 2 to the fixed metal frame 1 side. In this way a bearing is loaded on the sliding face of be tween the lower part plate 7 integrated to the sliding metal frame 3 and the upper part fixed plate 6.
Patent JP-H05326626-A (JP)
Title: Mounting method of semiconductor chip
Inventor: ABE YOSHIFUMI
IPC: H01L21/60
Filed: 1992-05-18
Abstract: PURPOSE:To protect a bump electrode against stress breakdown by connecting the bump electrode and an electrode pattern through carbonization of cured thermally fusible adhesive. CONSTITUTION:Bump electrodes 2 on a semiconductor chip 1 are applied with thermally fusible adhesive 7 and then aligned thus temporarily securing the bump electrode 2 and an electrode pattern 4. They are then thermally fused from below a glass board 3 this choking the gap between the bump electrode 2 and the electrode pattern 4 with fused adhesive 7. The adhesive 7 is subsequently cooled and cured thus securing the semiconductor chip 1 onto the glass board 3. It is then irradiated with YAG laser 5 beam and carbonized thus connecting the bump electrode 2 and the electrode pattern 4 electrically. This method fills the gap between the semiconductor chip 1 and the glass board 3 compactly with sealing material, i.e., the thermally fusible adhesive 7, and protects the bump electrode against stress breakdown.
Patent JP-H05320787-A (JP)
Title: Production of aluminum alloy composite
Inventor: NAKAMURA SUKEHIDE
IPC: C22C47/08
Filed: 1992-05-18
Abstract: PURPOSE:To enable sufficient compounding and to attain required hardness by heating a preform by titania fiber to transform it into rutile type titania fiber and impregnating it with the molten metal of aluminum. CONSTITUTION:Titania fiber is compacted into a preform substance C by press- grinding, which is baked at about 900 deg.C for 1hr (d). In this way, it is transformed into a titania fiber perform having a rutile type crystalline structure. Next, this preform is immersed into the molten metal of an aluminum alloy, and pressurizing is executed. Industrially, it is executed by a die casting machine or a squeeze casting machine. After that, this aluminum alloy composite is again subjected to heat treatment to bring about a solid phase reaction, by which its hardness Hv is regulated to about 300 to 850. This heat treatment is executed at 535 deg.C, and the longer the heating time becomes, the more the hardness increases.
Patent JP-H09306934-A (JP)
Title: Manufacture of chip semiconductor device
Inventor: MIZUNO HIDEKI
IPC: H01L21/56
Filed: 1996-05-20
Abstract: PROBLEM TO BE SOLVED: To greatly reduce the size and wt. of a chip semiconductor device by forming recesses into the surface of a substrate, mounting semiconductor elements in the recesses and cutting off the substrate. SOLUTION: The manufacturing process comprises the steps of mounting semiconductor elements 6 in recesses 4 of a substrate 1, bonding these elements 6 to upper pattern electrodes 2 with wires 7, injecting a sealing liq. resin 8 into the recesses 4, hardening the resin 8 by heat or light, and cutting the substrate 1 along lines passing the substrate portions between the adjacent recesses 4 into chip semiconductor devices 9. This needs no parent lid and the semiconductor elements 6 in the recesses 4 of the substrate 1 are sealed with the liq. resin 8. This eliminates the need for examining the thickness and material of the substrate with taking account of the thermal stress of the entire substrate 1.
Patent JP-S5826990-A (JP)
Title: Condenser
Inventor: FUJIKAWA TAKUJI
IPC: F28B11/00
Filed: 1981-08-11
Abstract: PURPOSE:To improve the performance of a condenser without increasing the heat transmitting area thereof by a method wherein a cooling water flow amount distribution is regulated so that the temperature rise of the cooling water in each cooling tube of the condenser is uniformed. CONSTITUTION:A cooling water flow amount limiting sleeve 12 or an orifice plate 14 is provided for limiting the amount of cooling water flowed into a cooling tube, in which the temperature rise of the cooling water is small, so as to uniform the temperature rises of the cooling water in respective cooling tubes of a condenser. For this purpose, thermometers such as a multitude of thermocouples or the like are arranged at the outlet sides of respective cooling tubes to measure the outlet temperature distribution of the cooling water and the temperature rise distribution of the cooling water is obtained beforehand. In accordance with the result of the temperature rise distribution measurement, the flow amount limiting sleeves 12 are attached to the inlet sides of respective cooling tubes in which the temperature rises of the cooling water are small to limit the flow amounts of the cooling water, therefore, the performance of the condenser may be improved without increasing the heat transmitting area of the condenser.
Patent JP-S5749532-A (JP)
Title: Manufacture of bottle made of saturated polyester
Inventor: KUSHIDA HIDEO
IPC: B29C49/64
Filed: 1980-09-09
Abstract: PURPOSE:To improve the surface hardness and gas barrier property of the bottle by applying thermosetting synthetic resin at least to the outer surface of the bulge part and the wall part of the parison and blow molding after heating the applied layer to semihardened state. CONSTITUTION:The parison 1 is formed from saturated polyester material and coating material composed of thermosetting synthetic resin, urea type polymer etc. is applied on the outer surface of the bulge part and wall part and the covered layer 2 of 10-150mu thickness is formed. Next, the parison 3 of which said covered layer 2 is heated to the extent of semihardened state is realized, then it is set in the mold 4 for forming the bottle bulge and the bottle 5 is obtained by biaxially stretching the parison 3. Further, by heat treatment of the bottle 5 at 50-90 deg.C, 5-60min the synthetic resin covered layer 2 composing the outside face of the bulge wall part of the bottle 5 is perfectly hardened and the aimed bottle made of saturated polyester is obtained.
Patent JP-S615323-A (JP)
Title: Ac load power controller
Inventor: BANDOU TOSHIROU
IPC: H05B39/08
Filed: 1984-06-18
Abstract: PURPOSE:To always keep the load power at a fixed level according to the variation of the power supply voltage for an AC load power controller of an exposure lamp, etc., by using the data which is sampled synchronously with the conduction phase angle of a load to perform the control. CONSTITUTION:The electric signal corresponding to the impressed voltage or current of a load detected by a transformer 25 is converted into a digital signal by an A/D converter. A microcomputer performs alternately the sampling of the signal supplied from the transformer 25 and the arithmetic with the data obtained from said sampling during a conduction period of half cycle of an AC power supply waveform. Thus the data is obtained and undergoes an arithemtic. Based on the result of said arithmetic and the control target value, the conduction phase of the load is set. Then switching means 21 and 22 are controlled with the timing corresponding to the electric signal which is synchronous with said conduction phase and AC power supply waveform.
Patent JP-H07335682-A (JP)
Title: Semiconductor device and its manufacture
Inventor: TAKAHASHI YUKIO
IPC: H01L21/60
Filed: 1994-06-07
Abstract: PURPOSE:To provide the fine pitch of bonding pads, to further expedite low loop bonding, to increase pins and to reduce in thickness a package by ball bonding inner leads and stitch bonding them to the electrodes of a semiconductor chip. CONSTITUTION:The semiconductor device comprises a semiconductor chip 2 and frame inner leads 5 connected to the electrodes 3 of the chip 2 via wires 6 by a nail head wire bonding type for stitch bonding after ball bonding. The chip 2 is resin-sealed in the type in which parts of the leads 5 are externally drawn. In such a semiconductor device, the leads 5 are bonded, the electrodes 3 of the chip 2 are stitch bonded, and the electrodes 3 of the chip 2 are connected to the leads 5 via the wires 6.
Patent JP-S617045-A (JP)
Title: Casting mold for producing clad ingot
Inventor: KAWARADA AKIRA
IPC: B22D19/16
Filed: 1984-06-20
Abstract: PURPOSE:To clad a core material and cladding metal at an optional cladding ratio by providing a partition wall moving in a casting mold so that the casting space in the mold to be poured therein with a molten metal for insert casting can be set optionally. CONSTITUTION:The casting mold for producing a clad ingot is constituted by providing the partition wall 2 of which the peripheral edges is in contact with the inside wall surface of the mold 1 and which is movable in the direction attaching or detaching to or from the core material 7 into the mold 1. The material 7 is disposed in such mold 1 and the molten metal consisting of the components different from the components of the material 7 is poured into the optional casting space formed by the movable partition wall 2, by which the material 7 is insert-cast. The material 7 and the cladding metal are thus clad at the prescribed cladding ratio.
Patent JP-H01295936-A (JP)
Title: Device for cleaning inside of sewerage
Inventor: KAGAWA YASUHIRO
IPC: E03F9/00
Filed: 1988-05-24
Abstract: PURPOSE:To improve cleaning efficiency, by installing a scoop grille for big masses of litters at the front end of a vehicle travelling in a sewerage, and by sorting out big masses of litters and leaving them on the grille while sucking and discharging small masses of litters or dirt that passed through the grille. CONSTITUTION:A scoop grille 10 for big masses of litters is provided at the front end of a vehicle body 2 travelling in a sewerage 1 for scooping of litters in the sewerage 1. While big basses of litters remain on the scoop grille 10, small masses of litters or dirt, passing through the grille 10, are guided by an inclined guide member 7 for accumulated substances and sucked and discharged by a suction pipe 6. When big masses of litters are built up on the grille 10 in too much quantity, the vehicle body 2 is stopped and a grill-swinging drive member 12 is driven, and the grille 10 is swung so that big masses of litters on the grille 10 are thrown into a litter storage 3, and the litters are stored therein.
Patent JP-S5647803-A (JP)
Title: Feedback control circuit
Inventor: KIMURA TAKASHI
IPC: G05B11/36
Filed: 1979-09-27
Abstract: PURPOSE: To make it possible to reduce the influence of resonance, by increasing electrically a damping coefficient of the driving system.  
     CONSTITUTION: The driving system is affected by resonance such as motor, load and coupling. The more a damping coefficient is, the less the influence of resonance is reduced. A signal which increases the damping coefficient electrically is generated by detecting speed of load, acceleration and speed of the motor, and inputting said signals into the feedback circuit 17 consisting of the resistance operational unit, and it is fed back to the input side of the driving system. In this case, it is executed through the high-pass filter 16 which makes the mechanical resonance frequency the cut-off frequency, taking into consideration that the mechanical system is not vibrated. Since the damping coefficient can be controlled electrically, the maintenance property and reliability are elevated. 
     COPYRIGHT: (C)1981,JPO&Japio
Patent JP-H01293485-A (JP)
Title: Picture recognizing device
Inventor: OSAKI EIJI
IPC: G06T7/40
Filed: 1988-05-23
Abstract: PURPOSE:To surely grasp an object part by Fourier-transforming picture data after adding the picture data through an adding and compressing means either directly or in one direction, calculating a power spectrum, comparing this calculated value with a reference value, and recognizing a picture. CONSTITUTION:After input picture data are added through an adding and compressing means 11 either directly or in one direction, the input picture data are Fourier-transformed, the power spectrum is calculated, and a decision means 13 compares this calculated value with the reference value and recognizes the picture. Thus, since the picture data are handled in a spatial frequency area, the object part can be surely grasped even when there is almost no density difference between an object substance and the object part. Further, since the picture data are processed after the picture data are added either directly or in one direction, approximately constant high-speed processing accordant with the data quantity can be realized.
Patent JP-H0419748-A (JP)
Title: Image forming layer
Inventor: MAEMOTO KAZUO
IPC: G03F7/039
Filed: 1990-05-15
Abstract: PURPOSE:To make this image forming layer high sensitive and also to prevent the damage at an image part at the time of the development by introducing a structural component having a specific carboxylic acid (salt) and a structural component having the UV absorption in a specific wavelength or above into the same polymer. CONSTITUTION:The structural component having a carboxylic group represented by formula I and the structural component having the UV absorption in >=320nm are incorporated in the same polymer. In formula I, X represents sulfur, oxygen, a single bond, C is equal to W or N-W, W represents oxygen, sulfur, U represents aryl group which may have a substituted group, alkyl group, H atom, Y represents alkylene which may have a substituted group, arylene, aralkylene, a divalent heterocyclic ring, T represents hydrogen atom, alkali metal, alkaline earth metal and formula II. In formula II, R<1>-R<3> represent hydrogen atom, alkyl group which may have a substituted group, aryl group. Also R<1>-R<3> may form a ring by bonding. K and l are 0 or 1 and in the case of K=0, X is C=W. Thus the image forming layer is high sensitive and the image part is hardly damaged.
Patent JP-S615492-A (JP)
Title: Memory device
Inventor: MITSUMOTO KINYA
IPC: G11C11/41
Filed: 1984-06-20
Abstract: PURPOSE:To attain simultaneously the reduction in power consumption of a memory device and its speed-up by activating memory cells of bistable circuit only when active and passive loads for comprising said circuits together with two sets of switching elements are not selected or selected. CONSTITUTION:Memory cells of bistable circuit are constituted of two sets of npn bipolar transistors Q1 and Q2 for forming a cross-linking switching element and a load, which is formed by pnp bipolar transistors Q3 and Q4 connected to a word line W2 and resistances R1 and R2 connected to a word line W1. The resistances R1 and R2 and the transistors Q3 and Q4 serve as a load at the time of selection of the memory cell and at the time of non-selection of said cell, respectively. Accordingly an action speed at selection is sped up, and a holding current at nonselection is reduced; therefore the reaction in power consumption of the memory device and its speed-up can be obtained simultaneously.
Patent JP-S5249084-A (JP)
Title: In-plant type weld craking testing apparatus
Inventor: MATSUI SHIGETOMO
IPC: G01N19/04
Filed: 1975-10-16
Abstract: PURPOSE: To make possible the arbitrary adjustment of loading speed and loading time and the simultaneous multiple measurements of plural samples, by providing a load adjustment means having a worm wheel and load adjusting bar and a constant load holding means having a spring composition body. 
     COPYRIGHT: (C)1977,JPO&Japio
Patent JP-S5827358-A (JP)
Title: Bipolar type writable rom
Inventor: SUGIURA JIYUN
IPC: G11C17/08
Filed: 1981-08-12
Abstract: PURPOSE:To perform a small memory capable of writing with a low current by forming a memory cell in a bipolar transistor structure and breaking the insulation by a high voltage applied to the oxide film of a high resistance semiconductor layer connected to the emitter region of the transistor. CONSTITUTION:An epitaxial layer 2 grown on an Si substrate 1 is isolated via an isolation diffused region 3 to memory cells. The memory cell has an N-P-N bipolar transistor including an emitter region 4, a base region 5 and collector regions 2, 6, and one end of a high resistance polysilicon layer 7 is connected to the emitter region. A low resistance polysilicon wire 9 is formed in the state partly overlapped directly on the region 4 through an SiO2 film 8 thinly grown on the surface of the layer 7. The film 8 between the layers 7 and 9 existing on the overlapped region is the surface oxidized film of the polysilion with sufficiently low withstand voltage and is capable of readily breaking the insulation at the writing time.
Patent JP-H10320337-A (JP)
Title: Distributed data management method
Inventor: INOHARA SHIGEKAZU
IPC: G06F13/00
Filed: 1997-05-15
Abstract: PROBLEM TO BE SOLVED: To select a communication line that performs fast communication and to shorten the time from sending a request to a client until the request is met by using the communication history of other server which has a possibility of having needed data and requesting a selected server to send the needed data from the other server. SOLUTION: When a client 204 sends a request 120 that includes a uniform resource locator(URL) to a server 205 and requests acquisition of URL content, a request processing part 101 retrieves a home page cache 104 returns the URL content with answerback to the client 204. Also, if the URL content does not exist in the cache 104, the server 205 refers to an access strategic table 105 which maintains a communication history, decides a server 205', 205",... to which the request should be sent and transfers a request 120 according to a request 122. The server 205 sends URL content that is acquired through an answer 123 from the server to which the request 120 is sent as answer 121 to the client 204.