baber/WOPTO huggingface dataset:
Patent TW-510158-B (TW)
Title: Heat dissipation structure for semiconductor device
Inventor: HUANG JIAN-PING
IPC: H01L23/433
Filed: 1999-05-14
Granted: 2002-11-11
Abstract: A heat dissipation structure for semiconductor device is disclosed, which is formed of a heat dissipation body made by thermal conductive metal. The heat dissipation body has an external surface exposed from the semiconductor device to wrap the surface of molding compound of the semiconductor chip. Plural continuous recessed parts with increased depth are formed outward from the edge of the external surface, so that the continuous recessed parts with increased depth can effectively reduce the flowing rate for the encapsulating resin of the package body to enter the recessed parts, so as to prevent flashing on the external surface of the heat dissipation body, and to provide a longer path to increase the difficulty for the invasion of moisture, which relieves the delamination problem of semiconductor devices due to the invasion of moisture, and increases the reliability of semiconductor device.
Patent TW-419891-B (TW)
Title: Asynchronous sensing differential logic (ASDL) circuit
Inventor: KONG BAI-SUN
IPC: H03K19/096
Filed: 1999-06-10
Granted: 2001-01-21
Abstract: An asynchronous sensing differential logic circuit using a charge-recycling technique includes a control block carrying out a logical operation on a request signal from a preceding stage and a request signal for a succeeding stage, and outputting a first or second input enable signal and a first or second clock signal, a functional block carrying out an operation on an input data according to the first or second input enable signals and the first or second clock signals from the control block, and outputting a first or second output enable signal and an output data, and a latch block triggered by an acknowledge signal from the succeeding stage, and outputting a request signal for the succeeding stage and a final output data by carrying out an operation on  the first or second output enable signals and the output data from the functional block.
Patent TW-462972-B (TW)
Title: Fluorine-containing copolymer molding material
Inventor: FUNAKI ATSUSHI
IPC: C08F6/00
Filed: 1999-06-15
Granted: 2001-11-11
Abstract: A molding material consisting of a fluorine-containing copolymer, which has a metal elution index η of at most 10 as the total amount in ng of metals of Na, Mg, Cu, Cr, Ni, K, Ca and Fe per 1 g of the molding material, as obtained by elution analysis of the molding material with nitric acid.
Patent TW-408414-B (TW)
Title: Manufacture of chip scale package
Inventor: LIOU HUNG-MIN
IPC: H01L21/60
Filed: 1999-06-17
Granted: 2000-10-11
Abstract: This invention provides a kind of manufacture method of chip scale package. The wafer comprises a plurality of block. Each block comprises integrated circuits inside it, at least one bonding pad on its surface used to electrically connect the integrated circuits and the first passivation layer on the surface except the bonding pad to protect the integrated circuits. The manufacture method is to proceed a bonding process toward the wafer so that bump is formed by several metal balls with predetermined height. Then subsequently form a second passivation layer and a sacrificed layer on the passivation layer. And proceed a wafer grinding process toward the wafer to grind the top portion of each bumps to cut the top region of each bumps to the same level as the surface of the sacrificed layer. Finally, proceed a dicing process toward the wafer, to cut the blocks of said wafer into individual chip scale packages.
Patent TW-407079-B (TW)
Title: Method for die casting a magnesium alloy and die casting articles
Inventor: KUBOTA KOHEI
IPC: B22D21/04
Filed: 1999-08-03
Granted: 2000-10-01
Abstract: The present invention can achieve each required conditions for thin-wall product using cool-chamber die casting machine, such as injection conditions, metal molding conditions, melting conditions of magnesium alloy, molten metal temperature of magnesium alloy at the gates of cool-chamber die casting machine, and the temperature difference between the molten metal temperature in the warming pot and the molten metal temperature at the gates, and the coating condition on the inner side of the metal mold cavity. The method can be applied to magnesium thin-wall die casting which is not appropriate for the conventional method that the method uses the cool-chamber die casting machine with high injection capacity for high quality thin-wall die casting product; in particular, even for the large area product like the case of notebook PC, the method is able to produce such kind of product having the minimum thickness under 1.5 mm, preferably under1.2mm which is very difficult for prior art.
Patent TW-499527-B (TW)
Title: Manufacture of strengthened paper
Inventor: WARING IAN MA
IPC: D21H21/10
Filed: 1999-08-09
Granted: 2002-08-21
Abstract: A process for making paper on a paper-making machine comprising providing a cellulosic thin stock suspension, flocculating the suspension by adding an aqueous solution of a polymeric retention aid selected from natural and synthetic polymer and thereby forming a flocculated suspension, shearing the flocculated suspension, reflocculating the sheared suspension by adding an aqueous reflocculating suspension, draining the reflocculated suspension through a wire to form a sheet, and drying the sheet, characterised in that substantially fully cooked starch is added to the suspension after the shearing and before the draining.
Patent TW-495553-B (TW)
Title: Method for preparing diamond-like carbon film by cathode arc evaporation (CAE)
Inventor: WANG DA-YUNG
IPC: C23C14/00
Filed: 1999-08-27
Granted: 2002-07-21
Abstract: The present invention relates to a method for preparing diamond-like carbon film by cathode arc evaporation (CAE), which comprises using the high ion energy of a CAE metal ion to excite a hydrocarbon gas in a vacuum chamber for a pyrolysis reaction to deposit a diamond-like carbon film having a high rigidity and a high lubricative property. The diamond-like carbon film according to the present invention contains metal components and has a good toughness. Moreover, prior to the deposition of the diamond-like film, a same metal arc source can be used in a CAE process to deposit one or more layers of metal, metal nitride or metal carbide interlayer to strengthen the adhesion of the diamond-like carbon film, followed by introducing a hydrocarbon gas to generate a pyrolysis reaction with the plasma of the metal arc source to deposit the diamond-like carbon film.
Patent TW-455827-B (TW)
Title: Digital enunciator, process and communication system employing same
Inventor: YIN NING
IPC: G08B3/10
Filed: 2000-03-04
Granted: 2001-09-21
Abstract: A receiver in a communication system is coupled to a transmission channel for receiving communication signals transmitted over a transmission channel. The receiver includes signal receiving electronics for receiving communication signals directed to the receiver. The receiver also includes a controller, responsive to the receipt of a communication signal by the signal receiving electronics, to provide an enunciator enable signal, and a clock signal generator for generating a clock signal. The receiver further includes an enunciator coupled to the clock signal generator, for producing an electronic sound signal. The enunciator includes a volume control module for receiving a first periodic signal and providing a volume control signal. The enunciator also includes a divider for receiving the clock signal and providing a corresponding output signal having a frequency corresponding to the frequency of the clock signal frequency divided by a divider value. The enunciator further includes a tone control module coupled to the divider, for providing a tone control signal having a specified frequency and overtone pattern, and a modulator for modulating the third periodic signal by rile second periodic signal to provide an electronic sound signal.
Patent TW-429515-B (TW)
Title: Manufacturing method for forming shallow trench isolation structure
Inventor: SHR SHIUE-HAU
IPC: H01L21/76
Filed: 1999-10-22
Granted: 2001-04-11
Abstract: A manufacturing method for forming a shallow trench isolation structure in the semiconductor device process which includes the following steps: first, providing a semiconductor substrate which is of conductive type; then, depositing a silicon oxide layer on the semiconductor substrate; forming a photoresist layer with a plurality of patterns on the silicon oxide layer and conducting pattern etching on the silicon oxide layer until exposing the semiconductor substrate to form a plurality of block-type silicon oxide layer and forming a gap region between two neighboring block-type silicon oxide layer; finally, depositing the conductive layer into the gap region to complete the shallow trench isolation process of the semiconductor transistor.
Patent TW-588483-B (TW)
Title: Sharpened, oriented contact tip structures
Inventor: ELDRIDGE BENJAMIN N
IPC: H01R12/55
Filed: 1999-11-09
Granted: 2004-05-21
Abstract: An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.
Patent TW-462204-B (TW)
Title: Resonant bending wave panel-form loudspeaker and method of operating the same
Inventor: AZIMA HENRY
IPC: H04R1/00
Filed: 1999-12-03
Granted: 2001-11-01
Abstract: A resonant bending wave panel-form loudspeaker comprising a panel and a vibration exciter mounted to the panel to apply bending wave vibration thereto, characterised in that the loudspeaker is adapted to be mounted to a wall or the like surface and by a vibration exciter arranged for driving contact with the wall or the like surface. From another aspect the invention is a method of operating a panel-form resonant bending wave loudspeaker to enhance low frequency performance, characterised by arranging the loudspeaker adjacent to a junction between at least two room boundaries to form a resonant air cavity between the panel and the said room boundaries.
Patent TW-438949-B (TW)
Title: Pipe structure and method of manufacture
Inventor: SIFERD ROGER LEE
IPC: B29C48/18
Filed: 2000-02-18
Granted: 2001-06-07
Abstract: A pipe section formed of a polymeric material which has a substantially constant thickness throughout, the terminal edge of the female connection having a reinforcement structre which regidifies the end of the female connection and prevents deformation, the pipe section preferably having a fared end, and the reinforcement structure preferably being a semicircular channel formed at the end of the pipe section by a mandrel after initial extrusion of the pipe section, along with a method and apparatus for forming the pipe section, a pipe assembly including such pipe section, and a method of forming the pipe assembly.
Patent TW-418296-B (TW)
Title: A low-pressure apparatus for carrying out steps in the manufacture of a device, a method of manufacturing a device making use of such an apparatus, and a pressure control valve
Inventor: VAN DE KERKHOF ANTONIUS MARINU
IPC: F16L55/00
Filed: 2000-03-03
Granted: 2001-01-11
Abstract: A low-pressure apparatus for carrying out steps in the manufacture of a device, in particular, but not exclusively, a semiconductor device, which steps are performed under a prescribed pressure, the apparatus comprising: a reactor chamber (1) for accommodating a body (2), a gas supply pipe (4) for introducing a process gas flow, which gas supply pipe (4) is connected to the reactor chamber (1), an exhaust pump (5) for evacuation, which exhaust pump (5) is connected to the reactor chamber (1) through an exhaust pipe (6), a pressure control valve (9) for adjusting a valve opening, which pressure control valve (9) is provided on the exhaust pipe (6), the pressure control valve (9) comprising a flow channel (10), a first flow-through element (11) and a second flow-through element (12), which first flow-through element (11) and second flow-through element (12), are arranged behind each other in the flow channel (10) in the direction (13) of the gas flow and border respectively a first flow-through opening and a second flow-through opening, at least one of the first flow-through element (11) and the second flow-through element (12) being movable substantially transversely to the direction (13) of the gas flow in order to establish a desired overlap between the first flow-through opening, the flow-through opening and create a common opening referred to as the valve opening, the flow-through opening at least being provided with a first opening portion bordered by two first edges, which mutually taper into a pointed end, whereby the movable flow-through element at least is adjustable in a position in which the valve opening exclusively comprises only the pointed end of the first opening portion, a pressure sensor (7) for monitoring the pressure inside the reactor chamber (1), and control means (8) for controlling the valve opening of the pressure control valve (9) in dependence on the monitored pressure relative to the prescribed pressure as a target.
Patent TW-I286153-B (TW)
Title: Flame resistant, graft polymer-modified polycarbonate moulding compositions
Inventor: ECKEL THOMAS
IPC: C08F279/02
Filed: 2000-03-15
Granted: 2007-09-01
Abstract: This invention relates to flame resistant graft polymer-modified polycarbonate moulding compositions containing phosphorus compounds and specially prepared fluorinated polyolefins, which compositions exhibit excellent flame retardancy and very good mechanical properties such as notched impact strength, elongation at break and very good stress cracking behaviour.
Patent TW-472506-B (TW)
Title: Lamp ignitor for starting conventional HID lamps and for starting and restarting HID lamps with hot restrike capability
Inventor: FLORY ISAAC L IV
IPC: H05B41/04
Filed: 2000-03-29
Granted: 2002-01-11
Abstract: An ignitor is provided to predictably and reliably start a conventional HID lamp, or to start or restart an HID lamp having a hot strike capability such as a high pressure xenon HPS lamp or similar lamp. The ignitor is configured to prevent the premature triggering of a semiconductor switch in a hot restrike circuit due to unwanted high voltage pulses generated by a conventional HID lamp starter circuit in the ignitor. An ignitor is provided that can be used with lag-type ballasts. Another ignitor is provided that can be used with a lead-type ballast which generates a DC bias across the ballast capacitor.
Patent TW-526588-B (TW)
Title: Semiconductor device and method for manufacturing the same
Inventor: IGUCHI MANABU
IPC: H01L23/52
Filed: 2000-03-29
Granted: 2003-04-01
Abstract: A semiconductor device and a method for manufacturing like are provided in which wiring capacitance between adjacent wirings can be effectively reduced in a wiring structure having a dummy wiring required for planarization of an interlayer dielectric. In the semiconductor device of the present invention, a distance being approximately twice as large as a width of the wiring constituting a first wiring and a second wiring is kept between one side edge of the dummy wiring and a side edge of the first wiring as well as between another side edge of the dummy wiring and a side edge of the second wiring.
Patent TW-508360-B (TW)
Title: Method for the preparation of polyamic acid and polyimide useful for adhesives
Inventor: KWEON JEONG-MIN
IPC: C08G73/00
Filed: 2000-05-03
Granted: 2002-11-01
Abstract: Disclosed is a method for preparing polyamic acid and polyimide. Being suitable for use in adhesives or adhesive tapes for electronic parts, the polymers have such three-dimensional molecular structures that a significant improvement can be brought about in solvent solubilization, thermal resistance, mechanical properties, and adhesive properties onto various substrate. The polyamic acid is prepared by reacting at least one tetracarboxylic dianhydride, at least one aromatic diamine, at least one diamine with a siloxane structure, represented bye the following general formula I, and at least one polyamino compound represented by the following general formula II or III. The polyamic acid is converted into polyimide through thermal or chemical imidization.
Patent TW-466581-B (TW)
Title: Antireflective hard mask composition
Inventor: PAVELCHEK EDWARD K
IPC: H01L21/027
Filed: 2000-06-09
Granted: 2001-12-01
Abstract: New organic-based radiation absorbing compositions are provided that are suitable for use as an antireflective coating composition (""ARC"") for an overcoated photoresist. These compositions also serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectively from an undercoated dielectric layer.
Patent TW-539877-B (TW)
Title: Dispersion compensating fiber
Inventor: BERKEY GEORGE EDWARD
IPC: G02B6/036
Filed: 2000-06-12
Granted: 2003-07-01
Abstract: Disclosed is a dispersion compensating optical fiber that includes a core surrounded by a cladding layer of refractive index nCL. The core includes at least three radially adjacent regions, a central core region, a moat region having a refractive index nM that is sufficiently lower than nCL such that DeltaM <= -0.4%, and a ring region. As the ring region exhibits sufficiently high refractive index at a sufficiently long distance from the outer edge of the moat region, the fiber can exhibit low values of negative dispersion slope at low values of negative dispersion and yet exhibit good bending loss. This ring region is also capable of imparting to the fiber a relatively high cutoff wavelength, so that the present invention is particularly well suited for use in L-band systems. A particularly suitable fiber has an index profile in which that part of the ring region at the transition between the moat and the ring region has a refractive index such that its delta value is close to zero. Also disclosed is a method of forming the fiber of the present invention.
Patent TW-534808-B (TW)
Title: Device for servo-control of a dental handpiece employing ultrasound vibration
Inventor: CAPET XAVIER
IPC: A61C1/00
Filed: 2000-07-04
Granted: 2003-06-01
Abstract: The present invention relates to a device for servo-control of a dental handpiece employing ultrasounds. This device is characterized in that it comprises a work circuit which comprises an impedance in parallel between its output terminals, and a control circuit which is constituted by an intensity transformer whose primary is arranged in series in the work circuit and whose secondary forms, with a capacitor and a resistor which are associated therewith, an RLC circuit of which the voltage at the terminals of the resistor is sent to the input of said supply, the control circuit comprising means for varying the value of the capacitor and/or that of the self-induction coil of the secondary of the transformer.
Patent TW-466804-B (TW)
Title: Electrical discharge of a plug
Inventor: BERNSTEIN ELLIOT
IPC: H01R24/62
Filed: 2000-07-19
Granted: 2001-12-01
Abstract: A connector is provided with grounding contacts electrically connected to the host device's ground. The grounding contacts are positioned in the insertion path of a plug that is connected to a cable. The grounding contacts momentarily electrically contact the electrical contacts on the plug to discharge electrostatic charges in the cable to ground. A jack behind the grounding contacts in the housing receives the inserted plug. The jack includes jack contacts that are intended for making electrical contact with the plug contacts when the plug is fully inserted. Electrical connection between the plug contacts and the grounding contacts established as the plug is first inserted in the connector is broken prior to the electrical connection between the plug contacts and the jack contacts being established.
Patent TW-518599-B (TW)
Title: Semiconductor memory cell having more than two stable states
Inventor: HANNUM DAVID P
IPC: G11C15/04
Filed: 2000-08-24
Granted: 2003-01-21
Abstract: A three state, dual port CAM cell (100) responsive to three combinations, i.e., 0,0 and 1,0 and 0,1, of two binary inputs (146, 148) includes a pair of latches (106, 108), each having a pair of inverters (180, 184) connected in a regenerative feedback circuit. For the 0,0 combination, a driver (198) and FET (200) disable the second inverter (184) in such a way that output terminals (110, 112) of the latches supply 0,0 to a pair of data lines (120, 122). For the 1,0 combination, both inverters of both latches are enabled, causing the latches to supply the data lines with 1,0. For the 0,1 combination, the second inverter is disabled in such a way that the output terminals of the latches supply the data lines with 0,1.
Patent TW-452871-B (TW)
Title: Manufacturing method for increasing the current driving capability of high-power semiconductor device
Inventor: HUANG LIN-JUNG
IPC: H01L21/28
Filed: 2000-09-21
Granted: 2001-09-01
Abstract: The present invention discloses a method for manufacturing high-power semiconductor device by using the gate cap layer and the spacer. A gate is formed on an epitaxial silicon layer having a first electrical characteristic. A cap layer is provided above the gate. Then, a substrate area is formed in the epitaxial silicon layer and at two sides of the gate. In the extended direction of the substrate area, there are a plurality of source areas arranged in a mutual interlaced manner and a isolation region with a heavily doped center. Next, a dielectric layer is formed on the gate and part of the epitaxial silicon layer. Finally, part of the dielectric layer is removed until exposing the surface of the cap layer of the gate and part of the surface of the epitaxial silicon layer, thereby forming a spacer on the two sides of the gate.
Patent TW-I242485-B (TW)
Title: Process for reducing volume of plastic
Inventor: CHEN CHING-SHI
IPC: B29B17/00
Filed: 2000-10-31
Granted: 2005-11-01
Abstract: This invention provides a process for reducing volume of plastic, where waste foaming plastic is crumbled into foaming plastic fragments of predetermined sizes and then placed into a die. The die is provided with a predetermined number of apertures at predetermined locations. Hot air heated to a predetermined temperature is then blown into the foaming plastic fragments in the die so as to turn the surfaces of the foaming plastic fragments into molten states. A predetermined pressure is then applied to compress the foaming plastic fragments, such that the surfaces in molten sates would fuse to each other. A recycled foaming plate is then obtained after cooling. This invention helps reduce the volume of plastic fragments and effectively process the same with a simple and easy process without the need to adding boding agent. This invention is highly economical efficient and industrially applicable.