baber/WOPTO huggingface dataset:
Patent JP-2009215528-A (JP)
Title: Pressure-sensitive adhesive composition for optical films, pressure-sensitive adhesive optical film and image display
Inventor: TOYAMA YUSUKE
IPC: C09J11/06
Filed: 2008-06-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive composition for optical films which can form a pressure-sensitive adhesive layer that can prevent light leakage caused by stress associated with dimensional change of a component such as an optical film, has reworkability such that it can be easily peeled from the component, and has satisfactory processability such that it can be processed without pressure-sensitive adhesive stain or dropout after it is formed on the optical film, and to provide a pressure-sensitive adhesive optical film produced using the composition.  <P>SOLUTION: The pressure-sensitive adhesive composition includes, as monomer units, (a) 34 to 94% by weight of an alkyl(meth)acrylate, (b) 5 to 35% by weight of an aromatic ring-containing (meth)acrylate, and (c) 0.01 to 0.5% by weight of an amino group-containing (meth)acrylate, and further includes (d) 0.05 to 3% by weight of a carboxyl group-containing (meth)acrylate and/or (e) 0.05 to 2% by weight of a hydroxy group-containing (meth)acrylate, and has a (meth)acrylic polymer with a weight average molecular weight of 1,600,000 to 3,000,000 as determined by gel permeation chromatography; and has crosslinking agents including 0.01 to 5 parts by weight of an isocyanate crosslinking agent and 0.01 to 2 parts by weight of a silane coupling agent, based on 100 parts by weight of the (meth)acrylic polymer.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009292444-A (JP)
Title: Slip joint
Inventor: YANAGAWA HISASHI
IPC: B60R22/24
Filed: 2008-06-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a slip joint eliminating the need for load design with friction resistance taken into consideration, in the design of a pre-tensioner and a force limiter.  <P>SOLUTION: The slip joint is provided with a guide member 1B for slidably guiding a webbing W drawn out from a retractor as a webbing winding/pull-out mechanism in a webbing winding/pull-out direction; and a rotation motor 1C for giving assist force for assisting the webbing W guided by the guide member 1B. Friction resistance generated between the webbing W and the guide member 1B is thereby reduced, and smooth winding/pull-out of the webbing W, especially smooth winding in emergency is performed.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009298653-A (JP)
Title: Carbon material originated from plant-based biomass and manufacturing method of the material
Inventor: KUMAGAI SEIJI
IPC: C01B31/02
Filed: 2008-06-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a material which is prepared from a plant-based biomass and has good compression resistance, hardness and an injection property, for example a carbon material having a light weight and high strength or a carbon composite material having a light weight and high strength, and a manufacturing method of the material.  <P>SOLUTION: The carbon material having a light weight and high strength originated from a vegetable-based biomass is manufactured by pulverizing the vegetable-based biomass into 1-50 μm, heating and compressing up to 150°C at a pressure of 20-500 MPa in vacuum or an inert atmosphere, performing only heating at a temperature higher than 150°C and up to 250-300°C in vacuum or an inert atmosphere, compression-molding at a pressure of 20-500 MPa for a constant time of 1-30 minutes when reached the temperature in an inert atmosphere, and firing the obtained molded precursor at 500-1,500°C in vacuum or an inert atmosphere. Also the carbon composite material having a light weight and high strength is manufactured by pulverizing a fiber material into an aspect ratio of 1-100, mixing with the pulverized vegetable-based biomass, performing the same method as above against the mixture to obtain a molded precursor, and performing the firing. The material can be manufactured by an injection-molding other than the above compression-molding.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009009127-A (JP)
Title: Lithographic apparatus using telecentric control to fill pupil and method for maufacturing device
Inventor: BASELMANS JOHANNES JACOBUS MAT
IPC: G03F7/20
Filed: 2008-06-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a measuring method fit for a lithographic apparatus equipped with a reflective patterning device.  <P>SOLUTION: The method for measuring aberrations present in a lithographic apparatus includes the steps of modulating radiation beams by a reflexible patterning device, projecting the radiation beams by a projection system, detecting the projected radiation beams by sensors, and measuring aberrations from interferences made by the detected radiation beams. The radiation beams are inclined away from the optical axis of the projection system before entering the projection system.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008270226-A (JP)
Title: Round shape electric connector
Inventor: TSURUMI MASAHIKO
IPC: H01R13/652
Filed: 2008-06-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a round shape electric connector capable of obtaining a stable grounding structure of a ground lug and a shell without removing the surface treatment of the shell beforehand.  <P>SOLUTION: The round shape electric connector is composed of a required number of contacts, an insulator to hold and fix the contact, a shell arranged so as to cover this insulator, and a ground lug 10 of a structure to contact the shell and one piece of contact. The ground lug 10 is provided with an elastic member 14 which has a contact means (fixing means) with the one piece of contact and has elasticity bent in shell direction. As the contact means, the ground lug is made in nearly cylindrical shape having elasticity so as to cover the one piece of contact. It is desirable that at least one or more corner parts 18, 20 are provided on the free end side of the elastic member 14 and at least one or more bent parts 16 are provided in the vicinity of the free end side.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009302362-A (JP)
Title: Solenoid
Inventor: INOGUCHI TETSUNORI
IPC: H01F7/08
Filed: 2008-06-16
Abstract: <P>PROBLEM TO BE SOLVED: To reduce the heat generation and power consumption of a coil by reducing a current value in holding a mover at a second position below that in starting to move the mover from a first position to a second position.  <P>SOLUTION: A solenoid includes a coil 21 excited by applying current, a magnetized body member 22 forming a magnetic circuit, a mover 23 moved by a magnetic flux flowing in the magnetized body member 22, and a control circuit 12 for controlling a current applied to the coil 21, and is configured such that the mover 23 is moved from a first position to a second position and then held at the second position when the coil 21 is applied with a current in a predetermined direction. The control circuit 12 controls an applied current at a first current value when starting to move the mover 23 from the first position to the second position, and controls the applied current at a second current value smaller than the first current value when holding the mover 23 at the second position.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009302410-A (JP)
Title: Method of manufacturing semiconductor wafer
Inventor: HASHII TOMOHIRO
IPC: B24B37/10
Filed: 2008-06-16
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a semiconductor wafer inexpensively by reducing the margin of the semiconductor wafer and the kerf loss of a semiconductor material.  <P>SOLUTION: The method of manufacturing the semiconductor wafer includes: a slicing step of cutting out a semiconductor wafer in a thin disc shape from a crystalline ingot; and a fixed abrasive grain grinding step of speedily and simultaneously machining both surfaces of the semiconductor wafer from rough grinding to finish grinding. Further, the manufacturing method includes: a chemical treatment step of simultaneously relaxing a machining strain on the surface and end face of the semiconductor wafer subjected to the fixed abrasive grain polishing process and performing finish chamfering for forming the end face of the semiconductor wafer in a prescribed chamfering shape; and a one-sided finish polishing step of performing finish polishing of the surface where an etching liquid has been dripped from the semiconductor wafer subjected to the chemical treatment process.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010000635-A (JP)
Title: Base for water transfer paper
Inventor: OKAWA MAKOTO
IPC: D21H19/10
Filed: 2008-06-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a base for water transfer paper which improves rapid passage of a moisture, while upgrading a texture, and eliminates absorption irregularities of an undercoat layer due to the thickness unevenness, with the suppression of the thickness unevenness of a pigment coated layer, and can make available a high-definition printing pattern by forming the flat undercoat layer.  <P>SOLUTION: This base 8 for water transfer paper has a substrate 1, the pigment coated layer 2 composed mainly of a pigment and an adhesive applied to one surface of the substrate 1. In addition, the undercoat layer 3, a top coat layer 4, a printed layer 5 and an overcoat layer 6, are formed, in that order, on the pigment coated layer 2. The substrate 1 has a basis weight of 80 to 170 g/m<SP>2</SP>and is dried by a Yankee dryer. Further, for the raw material pulp constituting the substrate 1, a hardwood pulp kraft pulp (LKP) is used as a principal raw material, and also, the raw material pulp contains not less than 90% of the fiber with a weight-average fiber length of 0.5 to 1.0 mm and the fiber length of not more than 1.5 mm. The texture index of the substrate 1 is 50 to 80.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010003921-A (JP)
Title: Method of manufacturing semiconductor optical element
Inventor: NOMAGUCHI TOSHIO
IPC: H01S5/22
Filed: 2008-06-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor optical element capable of preventing an active layer from being damaged during a manufacturing process of the semiconductor optical element.  <P>SOLUTION: This method of manufacturing a semiconductor optical element includes: a first process of forming a silicon oxide film 13 having predetermined film stress and a predetermined thickness on a substrate 11; a second process of forming a stripe-like groove 17 on the silicon oxide film 13 by etching the silicon oxide film 13 until a surface 11a of the substrate 11 is exposed by using a resist 15 formed on the silicon oxide film 13 after the first process; and a third process of growing a semiconductor laminate 19 including an active layer 23 in the groove 17 after the second process.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010002148-A (JP)
Title: Method of controlling linkage of air conditioning facility and ict equipment
Inventor: WARATANI SHISEI
IPC: F24F11/02
Filed: 2008-06-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of controlling the linkage of air conditioning facility and ICT equipment when a failure of the air conditioning facility or a power failure occurs in an information communication machine room.  <P>SOLUTION: For example, when the failure occurs in an air conditioner 5-1 (S1203), operation retry is immediately performed by the predetermined number of times (S1204). During this period, a shared load is not immediately changed though the transmission of an operation signal to an integrated control device 7 is interrupted. When the operation is restored within a prescribed time (for example, four minutes) by the retry (S1205), the transmission of the operation signal is restarted (S1206). On the other hand, when an operation restoring signal is not received within the prescribed time after the interruption of the operation signal from an air conditioner side, the integrated control device 7 operates the optimum data processing burden share to processing servers excluding a zone Z1 (S1104), and instructs the data processing of the shared load redistributed to each processing server (S1105).  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010002154-A (JP)
Title: Warming device
Inventor: ODA KEIZO
IPC: A47G9/06
Filed: 2008-06-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a warming device having electromagnetic wave shielding performance and capable of shortening a current-carrying time with respect to a heating element such as an electrical blanket by the heat retaining performance.  <P>SOLUTION: The warming device is provided with the heating element 300 generating heat by current-carrying and with a heat storage sheet 100 superposed on the heating element 300 and used. The heat storage sheet 100 has a bag body and water-containing gel sealed in the bag body. Since the heat storage sheet 100 is arranged, even if current-carrying to the heating element 300 is stopped, since warmth is maintained for a predetermined time, warming can be performed without being affected by electromagnetic waves and the current-carrying time can be shortened.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009000534-A (JP)
Title: Apparatus for measuring biological impedance
Inventor: CHA KI CHUL
IPC: A61B5/05
Filed: 2008-06-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide an apparatus for measuring biological impedance.  <P>SOLUTION: This invention is related to the apparatus for measuring the biological impedance and is embodied so as to apply a current to the human body of a person to be measured to measure the biological impedance formed in the human body by the current and to simultaneously photograph an outline image formed around the human body by light with which the human body is irradiated and analyze human body periphery information from the photographed outline image of the human body. Thus, the human body periphery information such as the periphery of the waist and the periphery of the hips of the person to be measured is obtained together with the biological information of the person to be measured such as body components, and the accurate state of the human body is recognized.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2010011562-A (JP)
Title: Outdoor-type power cable terminal and waterproof treatment method
Inventor: KOBAYASHI SHOZO
IPC: H02G15/02
Filed: 2008-06-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide an outdoor-type power cable terminal which can keep waterproofness by absorbing displacement between a terminal and a corrosion-proof layer of a power cable, and a waterproof treatment method.  <P>SOLUTION: The outdoor-type power cable terminal 1 is arranged by penetrating a terminal end connecting part of the power cable 2, and includes: a terminal 3 of the silicone-rubber made power cable having a first inlet end 11 for making a conductor shaft 15 of the power cable 2 pass therethrough, and a second inlet end 11B for making an external semiconductor layer 23 of the power cable 2 pass therethrough; and a waterproofing tube 30 which covers a portion from the second inlet end 11B to the end 29 of the corrosion-proof layer 18 of the power cable 2.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010008557-A (JP)
Title: Image display medium
Inventor: TAKEUCHI SHIGEKI
IPC: G02F1/167
Filed: 2008-06-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image display medium capable of forming clear image by low driving voltage and having satisfactory image holding characteristics.  <P>SOLUTION: In this image display medium 1, at least two kinds of particulates for display are sandwiched between at least a display substrate 11 and a rear surface substrate 12 to apply an electric field between electrodes, a display substrate side and a rear surface substrate side are covered with an insulation layer 14, and energy of a surface of the insulation layer is 5-20 mN/m.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010009830-A (JP)
Title: Photoelectric conversion element and its manufacturing method as well as solar cell
Inventor: MIWA HIDEYA
IPC: H01L31/04
Filed: 2008-06-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a photoelectric conversion element with high conversion efficiency and excellent in durability and its manufacturing method, as well as a solar cell using the photoelectric conversion element.  <P>SOLUTION: In the manufacturing method of the photoelectric conversion element of a dye-sensitized type, made up of an electrode layer, a semiconductor electrode sequentially formed of semiconductor layers each carrying dyes, and an electrolyte layer on a substrate, the dyes are aromatic amine compounds, and carried on the semiconductor layer and formed at 40°C or more and 100°C or less.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010009841-A (JP)
Title: Cylindrical sealed battery
Inventor: NITTA YASUHIRO
IPC: H01M2/34
Filed: 2008-06-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a cylindrical sealed battery in which a group of electrodes are prevented from deforming in a pressure bonding process, and at the same time isolation is surely made between a lead line and an inner surface of a groove of a battery case to avoid occurrence of short circuit so as to improve reliability.  <P>SOLUTION: A cylindrical sealed battery 1 includes: a battery case 2; a group of electrodes 3 comprising a cathode 10, an anode 11 and a separator 12; a lead line 4; a sealing tap plate 5; a gasket 6; an insulating ring 7; an insulating plate 8; and an electrolyte. The insulating ring 7 also includes: a ring-shaped planar portion 13 having an outer diameter such as to contact with an inner circumferential surface of the battery case 2; a cylindrical fuselage portion 14 rising from a face of the planar surface portion 13 to the sealing tap plate 5 perpendicularly to the face; a tubular flexing portion extending from an end of the fuselage portion 14 on the sealing tap side toward the sealing tap plate 5 and having its diameter being decreased when departing from the fuselage portion 14.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010011617-A (JP)
Title: Switching regulator and semiconductor apparatus including the same
Inventor: NISHIDA JUNJI
IPC: H02M3/155
Filed: 2008-06-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a switching regulator which sets the load current value correctly at the time of switching between PWM control and VFM control without using a resistor for detecting the output current, and to provide a semiconductor device equipped with the switching regulator.  <P>SOLUTION: The current value of an output current iout at the time of switching from PWM control to VFM control can be set by setting the first current value i1 of a high-side current detection circuit 11, the current value of the output current iout at the time of switching from VFM control to PWM control can be set by setting the second current value i2 of the high-side current detection circuit 11 and the third current value i3 of a low-side current detection circuit 12, and the load current value can be set correctly at the time of switching between PWM control and VFM control without using a resistor for detecting the output current.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010007379-A (JP)
Title: Foundation floor slab made of precast concrete, and method of mounting the same
Inventor: ENDO TAKAAKI
IPC: E02D27/01
Filed: 2008-06-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a foundation floor slab made of precast concrete, which bears a structure of a heavier load than a conventional floor slab bears, at the same time effectively prevents settlement of the structure to the possible extent, and facilitates manufacturing and mounting thereof, and to provide a method of mounting the foundation floor slab.  <P>SOLUTION: In mounting the foundation floor slab, a floor slab body 1a of the foundation floor slab 1 made of precast concrete is formed into a laterally long columnar shape, and a bottom surface 1e of the body is formed of two inclined surfaces 1f, 1f into a V-shape, so as to be inclined at 45 degrees from a lengthwise center to both side surfaces. Further the floor slab has overhanging pieces 1b formed at both edges of the floor slab body 1a in a manner protruding in a direction that crosses the floor slab body. Then a bottom surface 1j of each overhanging piece 1b is formed into an inclined surface 1k inclined at 45 degrees toward the floor slab body. Herein the foundation floor slabs 1 made of precast concrete are arranged side by side on foundation ground, and end faces of the overhanging pieces adjacent to each other are butted against each other, followed by connecting the overhanging pieces butted against each other, to each other in one body by a connecting means. Thereafter a space portion defined between the mutually adjacent foundation floor slabs is filled with infilling crushed stones, and then rolling is carried out.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010010105-A (JP)
Title: Forming mold for packed battery, and method of manufacturing packed battery
Inventor: KAKU GO
IPC: H01M2/10
Filed: 2008-06-30
Abstract: <P>PROBLEM TO BE SOLVED: To manufacture a packed battery without forming synthetic resin in two processes, making sure of short-circuit prevention during temporary fixation.  <P>SOLUTION: A forming mold for the packed battery has a forming chamber 2 to form an exterior resin forming portion 21 which covers an insulated lead board 13A portion of core pack 20 of the battery temporary fixed, arranged by insulating from an exterior can 11A, the insulated lead board 13A having a potential difference against an exterior can 11A and being attached to a perimeter side of the exterior can 11A. The forming chamber 2 is provided with a pressed temporary fixation portion 3, of which an opposed face facing the insulated lead board 13A is arranged to move in a direction away from the insulated lead board 13A. The pressed temporary fixation portion 3 is connected to the mold body so that it makes a reciprocating move back and forth, and also connected to a drive mechanism. The drive mechanism is so arranged that before setting the battery core pack 20 into the forming chamber 2, the pressed temporary fixation portion 3 is located at a retreat position, and when the battery core pack 20 is set inside of the forming chamber 2, the pressed temporary fixation portion 3 moves forward to temporarily fix the core pack 20.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010010635-A (JP)
Title: Electromagnetic noise control member and electromagnetic noise control method
Inventor: MASAI MIGAKU
IPC: H05K9/00
Filed: 2008-06-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electromagnetic noise control member which can attain a wide band in electromagnetic noise countermeasures.  <P>SOLUTION: An electromagnetic noise control sheet 100 includes a magnetic thin film 1 which is made of a magnetic material such as a Co-based amorphous film or an Fe-based metallic film. The magnetic thin film 1 has three regions 11, 12, 11. The regions 11, 11 are formed over the full width along an easy magnetization axis shown by arrows X in the drawing. In the region 12 arranged therebetween, a plurality of slits W having an equal width are formed at intervals of an equal spacing in the direction of the easy magnetization axis, and narrow width parts 12a are provided at intervals of an equal spacing. That is, a width d11 of the region 11 along the easy magnetization axis of the magnetic thin film 1 is larger than a width d12 of the region 12 along the easy magnetization axis of the magnetic thin film 1. In other words, the magnetic thin film 1 has a plurality of regions 11, 12 having different widths along the easy magnetization axis.  <P>COPYRIGHT: (C)2010,JPO&INPIT