baber/WOPTO huggingface dataset:
Patent JP-2007074314-A (JP)
Title: Multicast lsp tunnel method and system
Inventor: YASUKAWA MASANAGA
IPC: H04L45/16
Filed: 2005-09-06
Abstract: <P>PROBLEM TO BE SOLVED: To enable multicast MPLS forwarding of high reliability, by securing a band by using P2MP RSVP-TE in a backbone area and quickly detouring by fast rerouting.  <P>SOLUTION: P2MP RSVP-TE and LDP are extended, and a P2MP TE LSP is disposed in a backbone area network, and a LDP Multicast LSP is disposed in a peripheral sub-area, and an Explicit Null label is given as a label of the P2MP TE LSP, and a tunnel to the P2MP TE LSP is set.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007073387-A (JP)
Title: Electronic equipment
Inventor: KATO MAMORU
IPC: H01M2/10
Filed: 2005-09-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide electronic equipment capable of preventing position slippage between a battery housing component and a printed board, and easily mounting the battery housing component and the printed board on a housing.  <P>SOLUTION: The battery housing component 31 and the printed board 32 are fit to a frame 11 of the housing of the electronic equipment 1. Positioning holes 33, 34 for positioning the battery housing component 31 and the printed board 32 by making coincide their positions are installed in the battery housing component 31 and the printed board 32. A supporting part 35 for supporting the battery housing component 31 and the printed board 32 is installed in the frame 11, and a cylindrical boss part 37 fitting to the positioning holes 33, 34 is installed in the supporting part 35. The boss part 37 is fit to the positioning holes 33, 34, a screw 38 is screwed with the boss part 37, and the battery housing component 31 and the printed board 32 are interposed between a head part 39 of the screw 38 and the supporting part 35.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007072282-A (JP)
Title: Image forming apparatus
Inventor: SHIGETA SEIICHI
IPC: G03G15/16
Filed: 2005-09-08
Abstract: <P>PROBLEM TO BE SOLVED: To correspond to a case when calibration of a sensor reading a color shift compensation pattern is not carried out correctly due to having the reading based on one part of transfer material.  <P>SOLUTION: The calibration (Vsg adjustment) of the pattern sensor is carried out (S102 to 104) before compensation for color shift is executed after reading correction pattern. As a result of this adjustment, service lives of a light emitting element and a transfer belt are checked (S105) based on light emitting element current value to be set and texture of the transfer belt is read under a reading condition after the adjustment and whether or not the calibration is correct is checked (S106 to 109). According to the result of checking the correctness of the calibration in each sensor in a configuration in which each sensor is attached to a central part and both end parts in a scanning direction of the transfer belt, only a compensating action which can be carried out correctly is executed making a read value of a normal acting sensor effective. When execution is not carried out, a compensating action is omitted and transition is made to a next job without repeating the same action.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007073873-A (JP)
Title: Semiconductor element
Inventor: UDAGAWA TAKASHI
IPC: H01L21/338
Filed: 2005-09-09
Abstract: <P>PROBLEM TO BE SOLVED: To make the characteristics of an element excellent by enabling a group III nitride semiconductor layer to be an excellent crystal layer in providing the group III nitride semiconductor layer using a silicon single crystal as substrate.  <P>SOLUTION: In the semiconductor element 10 provided with a layer consisting of the group III nitride semiconductor layer on the substrate 101 made of a silicon single crystal, a group IV element film 102 consisting of a silicon carbide germanium (compositional formula Si<SB>1-X</SB>Ge<SB>X</SB>C: 0<X<1) of a cubic system is provided on one surface of the substrate 101, and a joining layer 103 consisting of the group III nitride semiconductor layer is provided so that it is joined to the element film 102.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007077186-A (JP)
Title: Thermoplastic elastomer composition for vacuum forming and laminate
Inventor: TOMINAGA TAKESHI
IPC: C08L23/10
Filed: 2005-09-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide a thermoplastic elastomer composition having good decorative pattern-retaining property before and after vacuum forming under high temperature.  <P>SOLUTION: The thermoplastic elastomer composition comprises: (A) 5-94 wt.% olefin thermoplastic elastomer obtained by carrying out dynamic heat treatment of a composition containing (a1) a polypropylene resin, (a2) an ethylene-α-olefin copolymer rubber and (a3) an organic peroxide, wherein when total amount of the components (a1) and (a2) is defined as 100 wt.%, the content of the component (a1) is 5-95 wt.% and the content of the component (a2) is 95-5 wt.% and the content of the component (a3) per 100 pts.wt. total amount of the components (a1) and (a2) is 0.001-5 pts.wt.; (B) 1-90 wt.% specific polypropylene resin; and (C) 5-94 wt.% specific ethylene-α-olefin copolymer resin.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007079766-A (JP)
Title: Composite document retrieval system, composite document retrieval method and program
Inventor: TAKACHIO KATSUHIKO
IPC: G06F17/30
Filed: 2005-09-13
Abstract: <P>PROBLEM TO BE SOLVED: To retrieve a composite document matching a retrieval request from a user while using an index formed with element documents constituting each composite document as a unit.  <P>SOLUTION: A full text index storage part 12 stores the index formed with element documents constituting each composite document as a unit. An extraction part 160 extracts a plurality of character strings connected by a logic symbol from a retrieval word designated by the retrieval request from the user. A full text retrieval engine 17 retrieves element documents containing each of the plurality of extracted character strings using the index stored in the full text retrieval index storage part 12. A component evaluation mechanism 18 specifies composite documents containing the element documents retrieved by the full text retrieval engine 17, based on component relevant information, and acquires a composite document satisfying a logic condition shown by the logic symbol of the specified composite documents as a retrieval result to the retrieval request.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007078971-A (JP)
Title: Semiconducting resin composition, conductive member, and image forming apparatus
Inventor: OMORI KENJI
IPC: C08L77/00
Filed: 2005-09-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconducting resin composition that can be improved in wear resistance, flexure durability and dimensional stability and to provide a conductive member and an image forming apparatus.  <P>SOLUTION: The semiconducting composition comprises an amide resin containing a flake-like filler subjected to an organizing treatment. The content of the flake-like filler is 0.1 to 5.0 pts.mass with respect to 100 pts.mass of the amide resin. The flake-like filler has a thickness of 0.001 μm to 0.1 μm and the maximum length of 0.01 μm to 10.00 μm.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007085744-A (JP)
Title: Measuring apparatus and method of surface plasmon resonance
Inventor: HARADA TOMOKO
IPC: G01N21/27
Filed: 2005-09-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a measuring apparatus of surface plasmon resonance capable of measuring surface plasmon resonance while specifying the accurate occurring position thereof, capable of knowing the correlation of the fine structure of localized surface plasmon with the surface structure of a sample and simple in its structure and low in cost, and a measuring method of the surface plasmon resonance.  <P>SOLUTION: Light is thrown on the back of the surface to be measured of the sample 1 such as a metal thin film or the like under a total reflection condition from an exciting light source 6 and the reflected light from the back of the surface to be measured is detected by a detector 7. When surface plasmon is subjected to resonance excitation by regulating the incident angle or wavelength of the incident light, the intensity of the reflected light becomes minimum and an enhanced evanescent wave 9 is generated by the absorption of the incident light. A probe 21 is brought into contact with the enhanced evanescent wave 9 to detect reflected light modulated by this contact and the surface plasmon resonance at the contact position is measured on the basis of the position dissolving power corresponding to the diameter of the probe. The surface to be measured is scanned by an atomic force microscope to efficiently and accurately know the correlation of the fine structure of surface plasmon with the surface structure of the sample.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007086474-A (JP)
Title: Image display device and wiring board
Inventor: TAKASUGI CHIKATOMO
IPC: G02F1/1345
Filed: 2005-09-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide resistances between respective wires which are uniform or continuously vary and to reduce a wiring region width.  <P>SOLUTION: In the image display device which has a plurality of wires 5a to 5d formed on a substrate in parallel to connect two of an external connection terminal, a driving IC, and a display part, the plurality of wires 5a to 5d have a plurality of conductor layers M1 and M2 formed on different planes and contact hole conductors TH electrically connecting the plurality of conductor layers M1 and M2, and adjacent wires are formed so that conductor layers formed on mutually different planes are adjacent to each other.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007090449-A (JP)
Title: Part assembling method and assembling apparatus for workpiece
Inventor: MATSUMOTO KEIJI
IPC: H05B6/10
Filed: 2005-09-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a part assembling method and assembling apparatus for a workpiece, properly assembling a part to a hole part of a work in every workpiece, and flexibly coping with the case where one workpiece has a plurality of part assembling positions.  <P>SOLUTION: This part assembling method for a workpiece includes: a process of heating the hole part Wa in a workpiece having the hole part Wa to which a part N is assembled by a heating means 2; and a process of inserting the part N in the heated hole part Wa and assembling it.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007092587-A (JP)
Title: Leakage diagnostic system of evaporated fuel processing system
Inventor: ISHII HIRONARI
IPC: F02M25/08
Filed: 2005-09-28
Abstract: <P>PROBLEM TO BE SOLVED: To prevent an erroneous diagnosis by detecting whether or not vapor such as having influence on diagnostic accuracy is generated in a fuel tank before diagnosing leakage by setting specific monitoring time before diagnosing the leakage.  <P>SOLUTION: This leakage diagnostic system of an evaporated fuel processing system 100 has a gas pressure detecting means 14 for detecting gas pressure of a purge passage 13, an engine suspension state detecting means 20 for detecting an engine suspension state, a means 30 for diagnosing the leakage of the evaporated fuel processing system 100 by closing a first valve 8 and a second valve 7 after stopping an engine, a time setting means 30 for setting the specific monitoring time before diagnosing the leakage, an arithmetic operation means 30 for arithmetically operating a pressure change in detecting gas pressure in preset time, and a determining means 30 for determining whether or not to permit a diagnosis of the leakage on the basis of an arithmetic operation value.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007096892-A (JP)
Title: Photoelectric sensor
Inventor: MURAKAMI HIROKI
IPC: H01H35/00
Filed: 2005-09-29
Abstract: <P>PROBLEM TO BE SOLVED: To reduce operations required for switching specific functions when the specific functions have a plurality of options.  <P>SOLUTION: This photoelectric sensor 100 has five options of a fine mode, a turbo mode, a super turbo mode, a ultra turbo mode and a high speed mode as operation modes and switches one operation mode to the other operation mode by operating an operation mode selector switch 22 which is a slide type two contact switch. For example, the ultra turbo mode with the maximum sensitivity is set to one contact of the switch 22 at a plant shipment stage and other operation modes selected using an operation mode selection picture are associated with the other contact.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007091172-A (JP)
Title: Fitting structure for glass run
Inventor: MOCHIDA TAKAAKI
IPC: B60J5/04
Filed: 2005-09-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a fitting structure for a glass run capable of certainly preventing position deviation of the glass run by a simple constitution even in any door type vehicle.  <P>SOLUTION: A fitting hole 13 is bored on a mounting wall part 11a of an inner panel 11 and an engagement member 14 provided with a base part 14b, a leg part 14a, engagement claws 14c, 14d and an engagement surface 14e perpendicular to a longitudinal direction of the glass run is inserted to the fitting hole 13. A glass run stopper 16 provided with an engagement surface 16e opposed in parallel to the engagement surface 14e is provided on a bottom wall part 15a of the glass run 15 and movement in the longitudinal direction of the glass run 15 is restricted by engagement of the engagement surfaces 14e and 16e.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007104388-A (JP)
Title: Diversity antenna and its arrangement method
Inventor: YUZA MASAAKI
IPC: H01Q21/20
Filed: 2005-10-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide a diversity antenna which is connected to a radio terminal device and capable of coping with its high-speed movement, and to provide a method of arranging the same.  <P>SOLUTION: The diversity antenna 110 is connected to a radio terminal device 100 that is mounted on a mobile to make communications with a radio base station 200. The diversity antenna 110 is provided to the mobile and equipped with two or more diversity antenna elements 101 to 104 that are arranged in the traveling direction of the mobile. Provided that the maximum traveling speed of the mobile is represented by Smax(m/sec), a sending/receiving interval time from the time that the radio terminal device 100 starts to transmit signals to the radio base station 200, to the other time that the radio base station 200 starts to transmit signals to the radio terminal device 100 responding to transmissions from the radio terminal device 100 is defined as Trx(sec), and the maximum space of the diversity antenna elements 101 to 104 denotes Lmax(m); the diversity antenna and its arrangement method are set up so as to satisfy formula, Lmax≥Smax×Trx.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006108106-A (JP)
Title: Pressure tripping device for circuit breaker
Inventor: OH KI-HWAN
IPC: H01H73/36
Filed: 2005-10-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a pressure tripping device for a circuit breaker which reduces tripping time.  <P>SOLUTION: This pressure tripping device comprises a plurality of phase separation monopole breaking units 110 sealing and housing movable contacts 113 and fixed contacts 112 in the insulated case 111, provided with arc gas discharge holes 114 and connected to mutually interlock, a main circuit switching mechanism 120 connected with one of the monopole breaking units and connecting or separating a movable contact and a fixed contact of the monopole breaking unit, a tripping bar 130 connected with the main circuit switching mechanism, a gas pressure shooter 140 arranged facing the tripping bar and perpendicularly movable between a position pressing the tripping bar to rotate and a position separating from the tripping bar, and a projected wall part projected on an outside surface of the case of the monopole breaking unit, movably supporting the gas pressure shooter, and forming a gas pressure storage space part communicating with the arc gas discharge holes.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006196868-A (JP)
Title: Heat dissipation structure of intelligent power module, display module provided with it, and method of installing heat dissipation portion of intelligent power module
Inventor: JEONG KWANG-JIN
IPC: H05K7/20
Filed: 2005-10-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an intelligent power module which has improved heat dissipation characteristics, a display module having it, and a method of installing a heat dissipation portion of an intelligent power module.  <P>SOLUTION: A heat dissipation structure of an intelligent power module comprises a chassis base 11 on which a drive circuit board 40 is positioned, an intelligent power module 70 which is positioned at one side of the drive circuit board 40 and has multiple circuit elements 74, a first heat dissipation portion 173 which is positioned so as to be in surface contact with one surface of the intelligent power module 70 and dissipates heat generated by operation of the circuit elements 74, and a second heat dissipation portion 76 which is positioned so that one side is in contact with the first heat dissipation portion 173 and the other side is in contact with a surface of the chassis base 11.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2007110014-A (JP)
Title: Sheet peeler and peeling method
Inventor: KIMURA KOJI
IPC: H01L21/683
Filed: 2005-10-17
Abstract: <P>PROBLEM TO BE SOLVED: To effectively display the performance to cost for a few sheet objects to be peeled off by extremely simplifying the apparatus structure, and to allow the sheet to be stripped by a simple operation.  <P>SOLUTION: The sheet peeling apparatus 10 for peeling a protective sheet S pasted to the surface of a semiconductor wafer W integrated with a ring frame RF comprises a wafer holder 21 for holding the semiconductor wafer W, a ring frame mount 20 for mounting the ring frame RF, and a means 12 for feeding out a peeling tape T. The apparatus moves the peeling tape T fed out by the feeding means 12 so as to roll up the protective sheet S with the tape T pasted to the outside of the protective sheet S, thus peeling the protective sheet S off the wafer W.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007111630-A (JP)
Title: Collecting method and recovery method of dioxins in solution
Inventor: KIKUCHI TORU
IPC: B01J20/34
Filed: 2005-10-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method which can collect dioxins evenly and highly efficiently, extract the collected dioxins efficiently in a short time with a small energy charge, and regenerate a scavenger at the same time.  <P>SOLUTION: Dioxins are collected and recovered through a process P1 for adding a cyclodextrin polymers prepared by adding amorphous silicic acid etc., to an aqueous solution 1 containing dioxins, a process P2 for separating a mixture yielded by the process P1 into the cyclodextrin polymers 2 and an aqueous solution by filtration etc. to obtain a solution 3 clear of dioxins, and a process P3 for performing agitation treatment of the filtrate with a solution containing organic solvents such as methanol to separate the filtrate into a solution 4 containing dioxins and cyclodextrin polymers 10 from which dioxins have been dissociated.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2007112001-A (JP)
Title: Liquid ejection head
Inventor: KUDO KIYOMITSU
IPC: B41J2/05
Filed: 2005-10-20
Abstract: <P>PROBLEM TO BE SOLVED: To improve reliability in an action of ejecting a liquid by enabling adequate absorption of pressure variation due to a pressure wave generated in the ejection of the liquid.  <P>SOLUTION: This liquid jet head comprises an ejection nozzle 14 for ejecting ink, an ink chamber 13 communicating with the ejection nozzle 14, a heater 12 provided to the ink chamber 13, a common liquid channel 24 communicating with the plurality of ink chambers 13, and a dumper section 10 which communicates with the common liquid channel 24 but does not communicate with the atmospheric air. The dumper section 10 comprises a dumper fluid channel 18 communicating with the common liquid channel 24, a dumper chamber 19 communicating with the dumper fluid channel 18 and having a fluid channel cross sectional area greater than that of the dumper fluid channel 18, and a dumper control fluid channel 20 in which one end communicates with the dumper chamber 19, the other end is closed and the fluid channel cross sectional area is smaller than that of the dumper chamber 19.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006128689-A (JP)
Title: Water-based slurry composition for chemical mechanical planarization
Inventor: LEE SANG-ICK
IPC: B24B37/00
Filed: 2005-10-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a water-based slurry composition having excellent planarization performance that can be used for chemical mechanical planarization (CMP) for a layer formed in a manufacturing process of a semiconductor device.  <P>SOLUTION: This water-based slurry composition for chemical mechanical planarization (CMP) comprises (1) metal oxide abrasive powder with 0.5 to 10 weight%, (2) a primary polyacrylic acid of 1 million to 3 million weight average molecular weight or combination with its dielectric, and a secondary polyacrylic acid of 2 million to 8 million weight average molecular weight with 0.1 to 5 weight%, where the weight average molecular weight of the primary polyacrylic acid or its dielectric is more than 0.5 million smaller than that of the secondary polyacrylic acid or its dielectric, and (3) a basic neutralizer with 0.1 to 2 weight%, where the primary and secondary polyacrylic acids or their dielectrics interact with the abrasive powder and form a complex of 100 to 5,000 nm size.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2007123460-A (JP)
Title: Method of depositing application film and its apparatus
Inventor: TERADA SHOICHI
IPC: B05D3/12
Filed: 2005-10-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of depositing an application film capable of flattening the application film uniformly and highly precisely without passing a high load process such as chemical mechanical polishing, and also to provide its apparatus.  <P>SOLUTION: The depositing method deposits an application film on the surface of a semiconductor wafer W by supplying an application solution to the wafer, that is a substrate to be processed, having the irregular surface. In the method, solvent gas is injected toward the surface of the wafer from a solvent gas supply nozzle 10 while placing the wafer, on which the application film of the application solution is formed under the atmosphere of the solvent gas in a processing chamber 6, and the wafer and the solvent gas supply nozzle are moved relatively in parallel to flatten the application film of the application solution.  <P>COPYRIGHT: (C)2007,JPO&INPIT