baber/WOPTO huggingface dataset:
Patent TW-200305684-A (TW)
Title: Pulse generator with an integrated rotor angle sensor
Inventor: TOMOKAZU SAKAMOTO
IPC: G01P3/488
Filed: 2003-04-11
Abstract: To provide a pulse generator with an integrated rotor angle sensor which is less likely to be influenced by magnetic noise and less likely to suffer from a malfunction. A pulse generator 10 with an integrated rotor angle sensor which includes a rotational angle detecting multipole ring magnet 15, a pulse generating magnet 16, a rotational angle detecting magnetoelectric conversion element 17 and a pulse generating magnetoelectric conversion element 18 is configured such that the pulse generating magnet 16 is secured in a spaced relationship by a predetermined distance from the rotational angle detecting multipole ring magnet 15 secured to an outer periphery of a rotor 14 in a direction of an axis of rotation of the rotor such that one of the magnetic poles of the pulse generating magnet 16 is positioned on the near side to the axis of rotation of the rotor 14 and the other one of the magnetic poles of the pulse generating magnet 16 is positioned on the remote side from the axis of rotation of the rotor, and the magnetic bias magnet 13 is mounted on the opposite side of the pulse generating magnetoelectric conversion element 18 to the pulse generating magnet 16.
Patent TW-200402943-A (TW)
Title: Abnormal case handling for acknowledged mode transmission and unacknowledged mode transmission
Inventor: JIANG SAM SHAW-SHIANG
IPC: H04W28/04
Filed: 2003-05-02
Abstract: Whenever the Receiver of this invention receives an AMD PDU or a UMD PDU with its "Length Indicator" having an invalid or a reserved value, the Receiver discards such a PDU and treats it as never been received. The Receiver may report its receiving status accordingly if a report is required. This invention avoids invoking unnecessary RLC reset procedures and reduces the chance of losing HFN synchronization during AM or UM data transmissions.
Patent TW-200419629-A (TW)
Title: A wafer start plan scheduling method for an IC foundry
Inventor: WU KAN
IPC: G06Q10/08
Filed: 2003-06-09
Abstract: A wafer start plan scheduling method for an IC foundry. First, daily reasonable WIP is determined for a bottleneck equipment. Then, daily wafer start quantity is determined according to an overall capacity limit and an MPS target requirement of the IC foundry and the daily reasonable WIP of the bottleneck equipment. Afterward, a critical ratio is calculated for each of a plurality of lots, and to schedule the lots according to the corresponding critical ratio and the daily wafer start quantity, so as to generate the wafer start plan for the IC foundry. Finally, the wafer start plan is adjusted according to a production limit of each lot.
Patent TW-200402748-A (TW)
Title: Composite insulator for fuse cutout
Inventor: ALMGREN VICTOR
IPC: H01H31/02
Filed: 2003-06-16
Abstract: The present invention relates to an insulator for an electrical fuse cutout comprising: a composite body with a connector, a housing wherein the composite body is located.
Patent TW-200500845-A (TW)
Title: Application program management system and method
Inventor: YANG LI-YAN
IPC: G06F11/30
Filed: 2003-06-17
Abstract: There is provided an application program management system suitable for a computer system, which includes a first processor and a second processor. The first processor is provided to execute an application program. The second processor includes a monitor module for monitoring the execution status of the application program. When the execution status of the application program is abnormal, the monitoring module enables the computer system to re-boot and use the first processor to restart the application program.
Patent TW-200501536-A (TW)
Title: External power supply structure of tool
Inventor: Zhang ren-tang
IPC: H02M1/10
Filed: 2003-06-20
Abstract: The invention relates to an external power supply structure of tool, in which a power structure is installed in an enclosure, a first swappable assembly structure is formed on the enclosure and a second swappable assembly structure is formed on an external tool element. As such, the external tool element can be assembled on the enclosure by means of a swapping method and the power structure supplies power to the external tool element. In addition, the external tool element can be separated from the enclosure by virtue of the swappable assembly structure. Furthermore, by means of replacement of different type of external tool element such as fan, flash light, etc., the invention enables the power supply structure and external tool element to be formed as the swappable pattern so that the power supply structure can be adapted with the use of all sorts of external tool elements to increase the operational convenience.
Patent TW-200503217-A (TW)
Title: Wafer structure and bumping process
Inventor: HUANG MIN-LUNG
IPC: H01L23/485
Filed: 2003-07-10
Abstract: A wafer structure at least includes: a wafer having a plurality of bonding pad, a first protecting layer and a second protecting layer, wherein the bonding pads is set on the active surface, the first protecting layer is exposing the bonding pads, the second protecting layer is set on the first protecting layer and exposing the bonding pads; a adhesion layer is set on the bonding pads, and a part of adhesion layer is extension to the first protecting layer surface and covered by the second protecting layer; a barrier layer and a wettable layer are set on the adhesion layer sequentially; and a plurality of bump are set on the wettable layer.
Patent TW-200501904-A (TW)
Title: Bed
Inventor: HARASHIMA TOORU
IPC: A47C19/04
Filed: 2003-07-10
Abstract: A bed mainly comprises a frame adapted to support a mattress and provided with a base frame, a first movable portion, and a second movable portion. The first movable portion is able to elevate upwardly in relation to the second movable portion while the second movable portion is able to longitudinal-inclinably connected with the base frame and the first movable portion. The bed is further formed with a driving device to reciprocally change the usage states of the bed as below: a horizontally flat state in which the base frame, the first movable portion, and the second movable portion are stated in the same horizontal level; and an adjustable backrest state in which the first movable portion is elevated upwardly and kept a desired distance in relation to the second movable portion while the second movable portion is inclined upwardly in relation to the base frame.
Patent TW-200410964-A (TW)
Title: 5-thiaepothilones and 15-disubstituted epothilones
Inventor: HOEFLE GERHARD
IPC: C07D493/04
Filed: 2003-07-14
Abstract: The invention relates to 5-thiaepothilones and 15-disubstituted epothilones according to formula I: With the following meanings: X≥C=O or >S=O R1=C1~6 alkyl or C2~6 alkenyl R2=H or C1~6 alkyl Y-Z≥C=C or C-O-C< (epoxide ring) R3=H, C1~6 alkyl or C2~6 alkenyl R4=bicycloaryl, bicycloheteroaryl or -C(R5)=CH- R6; where R5=H or CH3 and R6=aryl or heteroaryl X not being >C=O if R3=H.
Patent TW-200503202-A (TW)
Title: Stacked semiconductor package and fabrication method thereof
Inventor: PU HAN-PING
IPC: H01L23/28
Filed: 2003-07-15
Abstract: A stacked semiconductor package and a fabrication method thereof are provided. A pre-solder layer is formed on an active surface of a first chip, and a plurality of bumps are formed on an active surface of a second chip. The first chip is mounted and wire-bonded to a chip carrier. The second chip is mounted in a flip-chip manner on and electrically connected to the first chip by the bumps. An underfill layer is formed between the first chip and the second chip. An encapsulation body encapsulates the first chip, second chip, and a portion of the chip carrier. The above semiconductor package and its fabrication method can enhance the adhesion between the first chip and the second chip.
Patent TW-200402819-A (TW)
Title: Method and apparatus for quantitative quality inspection of substrate such as wafer
Inventor: KUBO KEISHI
IPC: H01L21/66
Filed: 2003-07-16
Abstract: A method for a quantitative evaluation of a substrate such as wafer defines a number of sequential first regions so that each of the first regions overlaps the adjacent region A surface data (e.g., thickness data) in each of the first regions is used to determine a normal vector representing a surface configuration (e.g., thickness variation) of the first region. Then, an angular difference between the normal vectors is determined for each combination of adjacent two first regions. Subsequently, the determined angular difference is compared with a reference to evaluate a quality of a second region including at least one of the first regions, e.g., chip region, strip-like region and/or the entire of the wafer.
Patent TW-200504972-A (TW)
Title: Multi-row wire bonding structure for high frequency integrated circuit
Inventor: LEE SHENG-YUAN
IPC: H01L23/66
Filed: 2003-07-22
Abstract: The present invention provides a multi-row wire bonding structure for high frequency integrated circuit, which includes a first electronic device, a second electronic device, a chip pad, and multiple metal lead; wherein the first electronic device is attached on the second electronic device by the chip pad, and the overlap of the first electronic device, the chip pad and the second electronic device is formed as a step. The surface of the first electronic device opposite to the chip pad is configured with the wire bonding pad at the periphery, and the coplanar wire bonding pad surrounding the wire bonding pad. The portion of the chip pad facing and exposing in the whole circle to the outside of the first electronic device is formed as a wire-like wire-bonding pad. The periphery of the second electronic device facing the chip pad and exposing in whole circle to the outside of the chip pad is configured with a plurality of pins at the positions opposite to the wire bonding pad and the coplanar wire bonding pad. The metal leads are divided into signal leads and grounding leads, and are at least divided into the first row and the second row according to the positions on the wire bonding pad and the coplanar wire bonding pad. The first row is near the wire-like wire bonding pad, but not the second row. The signal leads are electrically connected to the wire bonding pad and one of the pins opposite to the wire bonding pad, and the grounding leads on the first row are electrically connected with the wire-like wire bonding pad.
Patent TW-200416625-A (TW)
Title: System and method of gamut mapping image data
Inventor: MAURER RON P
IPC: H04N1/60
Filed: 2003-09-05
Abstract: A system and method of gamut mapping/clipping is described. The system and method applies to original image data color values in an original color space that have been transformed to obtain an original luminance value having an associated luminance/chrominance base color space and original chrominance values. The original luminance value is processed to obtain a processed color value having a processed luminance value and the original chrominance value having a processed luminance value and the original chrominance values. According to the system and method, the processed color value is mapped back into the original color gamut by selecting a target color value on a luminance axis. A different target color value is selectable for each of a plurality of color values of the image data. A mapped color value is them determined by linearly projecting from the processed color value towards the target color value. The mapped color value is located at the intersection of the gamut boundary of the original color space and the projection.
Patent TW-200511605-A (TW)
Title: Light emitting device with heat absorption layer
Inventor: HSIEH MIN-HSUN
IPC: H01L33/00
Filed: 2003-09-12
Abstract: A manufacturing method of a light emitting device with heat absorption layer is provided. The method comprises the following steps, (1) forming an epitaxial light-emitting stack layer on the first substrate, (2) forming an ohmic electrode on the light-emitting stack layer, (3) adhering the ohmic electrode and temporary substrate by a joint material, (4) removing the first substrate and then forming an ohmic contact layer on the contact surface of the light-emitting stack layer after removing the first substrate, (5) forming a reflection layer on the ohmic contact layer, (6) forming a heat absorption layer on the reflection layer, and (7) removing the temporary substrate.
Patent TW-200409003-A (TW)
Title: Self-managing computing system
Inventor: HELLERSTEIN JOSEPH L
IPC: G06F9/445
Filed: 2003-09-17
Abstract: A method, computer program product and data processing system for constructing a self-managing distributed computing system comprised of "autonomic elements" is disclosed. An autonomic element provides a set of services, and may provide them to other autonomic elements. Relationships between autonomic elements include the providing and consuming of such services. These relationships are "late bound," in the sense that they can be made during the operation of the system rather than when parts of the system are implemented or deployed. They are dynamic, in the sense that relationships can begin, end, and change over time. They are negotiated, in the sense that they are arrived at by a process of mutual communication between the elements that establish the relationship.
Patent TW-200414427-A (TW)
Title: Integrated circuit capacitor structure
Inventor: AHN JEONG-HOON
IPC: H01L21/822
Filed: 2003-10-14
Abstract: Embodiments of the invention include a MIM capacitor that has a high capacitance that can be manufactured without the problems that affected the prior art. Such a capacitor includes an upper electrode, a lower electrode, and a dielectric layer that is intermediate the upper and the lower electrodes. A first voltage can be applied to the upper electrode, is located in the same level as or in a lower level than the lower electrode.
Patent TW-200514678-A (TW)
Title: Apparatus for compression molding articles made of plastics
Inventor: PUCCI FABRIZIO
IPC: B29C31/06
Filed: 2003-10-22
Abstract: An apparatus for compression molding of articles made of plastics, comprising: molding means (1); feeding means for feeding doses(D) of plastic material, which are provided with removal elements (7) for removing in succession said doses from an extruder (8) and transferring the doses (D) onto said molding means (1); and conditioning means for conditioning temperature of said doses during transfer thereof from said extruder to said molding means.
Patent TW-200423295-A (TW)
Title: Method of detaching a thin film at moderate temperature after co-implantation
Inventor: CAYREFOURCQ IAN
IPC: H01L21/762
Filed: 2003-11-04
Abstract: A method of detaching a thin film from a source substrate comprises the following steps: implanting ions or gaseous species in the source substrate so as to form therein a buried zone weakened by the presence of defects; splitting in the weakened zone leading to the detachment of the thin film from the source substrate. Two species are implanted of which one is adapted to form defects and the other is adapted to occupy those defects, the detachment being made at a temperature lower than that for which detachment could be obtained with solely the dose of the first species.
Patent TW-200519277-A (TW)
Title: A multi-functional fixing element
Inventor: HUANG NAI-REN
IPC: E04C5/12
Filed: 2003-12-15
Abstract: A multi-functional fixing element includes a fixing seat fixed on walls, a moving seat slidably provided inside the fixing seat, and a locking unit able to fix the moving seat. A base set on the fixing seat, two ear parts extending out from the base, a guiding groove set between the two ear parts allowing the moving seat for sliding inside, a joint part on top of the moving seat to adhere and fix the thin board, an against part extending from the joint part in the middle to strut and limit the side rim of the thin board. Thus, the fixing element can be used in fixing various kinds of assembled panels in different areas, such as external wall, raised floor, and ceiling.
Patent TW-200420000-A (TW)
Title: Television broadcast content distributing system using virtual local area networks
Inventor: SHIN AKIHIRO
IPC: H04N21/6371
Filed: 2003-12-17
Abstract: In a television broadcast content distributing system, a plurality of television broadcast content distributing servers generate television broadcast contents, and a plurality of television broadcast content receiving terminals receive the television broadcast contents. Also, a first channel allocating switch is connected to the television broadcast content distributing servers to allocate channels to the television broadcast content distributing servers, respectively. On the other hand, a plurality of second channel allocating switches are provided. Each of the second allocating switches is connected to one or more of the television broadcast content receiving terminals, to thereby allocate one or more of the channels to the one or more of the television broadcast content receiving terminals. Further, a plurality of virtual local area networks (VLANs) are provided. Each of the VLANs is arranged in correspondence with one of the channels between outputs of the first channel allocating switch and inputs of the second channel allocating switches.
Patent TW-200521764-A (TW)
Title: System and method for rebate management
Inventor: MA WEN-ZHEN
Filed: 2003-12-19
Abstract: A system for rebate management includes a number of client computers, a number of reseller servers, a provider server, and a database. Each of the plurality of client computers provides an interface for users to input and maintain data. The provider server receives and processes the data from the client computers and the reseller servers, and transmits processed results to the client computers and the reseller servers. The database stores information on rebate standard and deadline, purchase order, rebate order and so on. Each of the reseller servers receives and transmits data. A related method is also disclosed.
Patent TW-200501163-A (TW)
Title: Semiconductor memory device capable of accessing data in continuous burst mode regardless of location of accessed data
Inventor: AHN JIN-HONG
IPC: G11C11/4063
Filed: 2003-12-24
Abstract: There is provided a semiconductor memory device and a method for driving the same, which is capable of accessing data in a continuous burst mode regardless of locations of accessed data. The semiconductor memory device includes: a first bank including a first word line corresponding to a first row address; and a second bank including a second word line corresponding to a second row address, wherein the second row address is consecutive to the first row address. The method for driving a semiconductor memory device includes the steps of: receiving a first row address corresponding to a command; activating a word line of a first bank corresponding to the first row address; activating a word line of a second bank corresponding to a second row address, in which the second row address is consecutive to the first row address; sequentially accessing the predetermined number of data among the N data in a plurality of unit cells corresponding to the word line of the first bank; and sequentially accessing the remaining data in a plurality of unit cells corresponding to a word line of the second bank.
Patent TW-200523795-A (TW)
Title: AV assembly base and the related devices
Inventor: WANG CHIH-LING
IPC: G06F7/00
Filed: 2004-01-07
Abstract: AV assembly base and the related devices comprising of an USB connector that connects the USB devices, an OTG controller that is coupled with USB connector to access the USB devices, a random access memory that is coupled with the OTG controller, an AV codec engine that is coupled with the OTG controller, and connectors of PC peripheral devices that is coupled with the OTG controller to link the PC peripheral devices and through which the OTG can access the PC peripheral devices. When the OTG controller reads the compressed AV file and temporarily saves the file to the random access memory through the USB devices, the AV codec engine decodes and outputs the compressed AV data to respond the first external command. When the AV assembly base receives the AV data from externals, the AV codec engine encodes and compresses the AV data, and saves to the random access memory to respond the second external command. While the AV assembly base and the USB devices finishing the connecting initialization procedure, the AV assembly base checks the file tables in the USB devices to correspondingly generate the AV file structure in the random access memory.
Patent TW-200416005-A (TW)
Title: Waterproof footwear
Inventor: WIENER ROBERT J
IPC: A43B7/12
Filed: 2003-11-15
Abstract: Waterproof footwear and methods for making the same. The footwear includes a laminate upper having at least a waterproof, water vapor permeable functional layer and an outer layer stitched to a strobel board to form a closed upper. A waterproof gasket material is adhered to the inner surface of the bottom of the closed upper.
Patent TW-200501983-A (TW)
Title: Uses of anti-insulin-like growth factor I receptor antibodies
Inventor: COHEN BRUCE DAVID
IPC: A61K39/395
Filed: 2004-02-12
Abstract: The present invention relates to a therapeutic method comprising administering anti-IGF-IR antibodies, particularly human anti-IGF-IR antibodies to a subject for the treatment of certain disorders preferably in conjunction with administration of another therapeutic agent. The invention further relates to pharmaceutical compositions comprising these antibodies and methods of using the antibodies and compositions thereof for treatment.
Patent TW-200527313-A (TW)
Title: Switch device and method thereof
Inventor: CHEN CHING-CHANG
Filed: 2004-02-13
Abstract: A switch device and method is provided. The switch device at least includes a sensor for detecting a signal from a mobile phone to active the switch. The switch further includes an infrared (IR) detector for detecting an IR signal from the mobile phone to active the switch device. Or further includes a card reader for reading a user identity card, such as a SIM card, a PIN card, an optical card, a magnetic card or an IC card to active the switch device. The switch can automatically detect the signal form a mobile phone or read the SIM card to activate the switch device. The switch device can be provided as a switch of personal computer, office machine, cash register, door lock, safe case, electronic lock and so on. Moreover, the user information, identity information or a password can also be input by the mobile phone to the switch, particularly when the switch is used by a variety of users. Thus, the check, recognition and recording of the identity of the user of the switch can be easily controlled. The switch can be provided to household, office, factory or a market, and the management of these places are more efficiency and safe.