Patent SG-11201407029X-A (SG)
Title: Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate
Inventor: IWANO TOMOHIRO
IPC: C09K3/14
Filed: 2013-03-26
Abstract: (i2) mwu ft iz s-5 iv x m £ titz s issaj n d9) mm IHMMi _ (41) SI5S4>!H B 2013^11 £ 28 0(28.11.2013) W j\"^| PCT (10) WO 2013/175856 A1 (51) H01L 21/304 (2006.01) B24B 37/00 (2012.01) (21) (22) (25) g|@ttii0>Wi§: (26) @(8&M©Wl§: (30) fiBfcftf '— 1 £: 2012-116859 2012 ^ 5 .E 22 0(22.05.2012) JP (71) tiJSIA: 0lIlbJ$^^£tt(HITACHI CHEMICAL COMPANY, LTD.) [JP/JP]; T 1006606 — Tl 9§2-^ Tokyo (JP). (72) Sir £;¥(I\VAN() Tomohiro); T 3178555 0 ililTjflBTEIT 1 @ 3 # 1 Sil'fbjS it K l±_l^ Ibaraki (JP). M Ck ft (MINAMI Hisataka); T 3178555 0 ±L rfT M. WE3 T @ 1 3# 1 0 Ibaraki (JP). |55I#. = )$• ?IJ BJ (AKUTSU Toshiaki); T 3178555 1S|0 — iimicB:eaTg 1 3# 1 oaibjSttagstt = Ibaraki (JP). H llgf f] (FUJISAKI Koji); T ^ 1858601 Tl 280 = #±fe tta$tt0Sgftf + 1*1 = Tokyo (JP). (74) 5? fit, ^(HASEGAWAYoshikiet al.); T 1000005 Kifvlft^FftEEl I*&CD fa — T @ 1 # 1-^*LO>fa MY PLAZA e» 9® Tokyo (JP). (8i) Jt^ia (^ro&i^psy > £-ca>ajia>@faffi IS ^ pj f I): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) *!£H (asrofci^isy > ±T(Dmm(Dfcm% IInlfb): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), n. — V 7 (AM, AZ, BY, KG, KZ, RU, TJ, TM), 3 — • V / ^ (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). C09K 3/14 (2006.01) PCT/JP2013/058782 2013 ^ 3 M 26 0(26.03.2013) 0*IS 0*IS (54) Title: SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLISHING METHOD, AND SUBSTRATE (54)fg0jco:g^ : 'J — „ EJF!l;$-t? V V , ffigljflu [02] PVA O o oo i> i-H cn i-H o CJ o & o o °o cb;°o o 0 o o o o (57) Abstract: A polishing solution containing abrasive grains, an additive, and water. Said abrasive grains contain a hydroxide of a tetravalent metal, and an aqueous dispersion containing said abrasive grains in the amount of 1.0 mass% exhibits an absorbance of at least 1.00 but less than 1.50 with respect to light having a wavelength of 400 nm. Furthermore, centrifuging the aqueous dispersion containing the abrasive grains in the amount of 1.0 mass% for 50 minutes at a centrifugal acceleration of 1.59 10 x 5 G yields a liquid phase with non-volatile a content of at least 300 ppm. (57)®$: , mm*. a O, 1 • 0H*%lcS6Lf=7k#tfejfclcfc^Ts®:S4 0 0 nmO)3fclcttLT®3fcJt1 • OOJsLtl. 5 0*iS£-5-*3ta>-efcy > R-o, 1 . OH*%lcIH38Lf=7K^«cjft SJS'fciOiiJS 1 . 5 9 x 1 0 Gt-5 5 0 0 p pmJsLta>jfcffl£-5-*. h £ (O T? <fc h •> EJfJS;1£o WO 2013/175856 A11 lllll llllllll II llllll III lllll lllll lllll III III III lllll llll llll lllll lllll lllll lllllll llll llll - (^$^21^(3))