baber/WOPTO huggingface dataset:
Patent TW-418135-B (TW)
Title: Method and apparatus for semi-molten metal injection molding
Inventor: SAKAMOTO KAZUO
IPC: C22C1/02
Filed: 1999-07-03
Granted: 2001-01-11
Abstract: In a semi-molten metal injection molding method of producing a thin molded product by injecting a semi-molten metal M of a magnesium alloy, in a semi-melting state, into a cavity of a mold through a product gate, characterized in that it is made possible to obtain a high-quality thin molded product by maintaining satisfactory fluidity of the semi-molten metal M. A grain size of the solid fraction in the melt M is set to not more than 0.13 times the average thickness of the product portion of the thin molded product and a molten metal velocity at the product gate is set to not less than 30 m/s and, moreover, a solid fraction Fs(%) of the semi-molten metal M and a grain size D (mu m) of the solid phase of the semi-molten metal M are set so as to define the relationship Fs * D <=1500. In this method, a thin product is molded by injecting a semi-molten molten metal into a mold cavity with narrow space corresponding to thickness in the thin product. The melt is in a solid-liquid mixture state at a temperature not higher than the liquidus temperature of metal or alloy. The diameter of solid grains in the melt is set to not more than 0.13 times the average thickness of the product portion corresponding to the cavity. The solid grains having diameters larger than 0.13 times the average thickness causes the melt to significantly reduce in fluidity, thus making the molded product porous. The grains in the melt to be injected can be easily decreased by employing shorter cycle time for molding. Therefore, the thin product having high quality can easily be molded by such a simple injection molding method. The term ""thin product"" used in this specification is defined as a molded article whose thickness is not more than 1.5 mm in 50% or more of the product portion area, or a molded article wherein the volume of the product portion in mm<3> divided by the surface area (in mm<2>) on both sides in the direction of thickness is not more than 0.75.
Patent TW-578364-B (TW)
Title: Semiconductor amplifier circuit and system
Inventor: HAYASHI JOJI
IPC: H03F3/62
Filed: 1999-07-07
Granted: 2004-03-01
Abstract: The purpose of the present invention is to provide a semiconductor amplifier circuit having a cascade amplifier in which a negative characteristic of an output conductance is improved at least in a particular frequency band. The semiconductor amplifier 1 includes a cascade amplifier 500 having a transistor 101 and a transistor 102 which are cascaded, and an improvement means for improving the dropping of output conductance GOUT of the cascade amplifier 500 at least in a particular frequency band.
Patent TW-486586-B (TW)
Title: Liquid crystal display device and method for producing the same
Inventor: MIYACHI KOICHI
IPC: G02F1/1333
Filed: 1999-07-22
Granted: 2002-05-11
Abstract: A liquid crystal display device includes a first substrate; a second substrate; and a liquid crystal layer interposed between the first substrate and the second substrate and having liquid crystal molecules therein. The first substrate includes a first electrode facing the liquid crystal layer. The second substrate includes a second electrode facing the liquid crystal layer. The first electrode, the second electrode, and a region of the liquid crystal layer supplied with a voltage by the first electrode and the second electrode define a pixel region which is a unit for display. The pixel region includes a plurality of sub pixel regions, in each of which the liquid crystal molecules are aligned in an axial symmetrical manner. At least one of the first electrode and the second electrode includes a plurality of openings, which are regularly arranged, in the pixel region. The at least one of the first electrode and the second electrode having the openings include a plurality of polygonal sub electrode regions, each of which has at least a part of the plurality of openings at least one of at corners and along and overlapping sides thereof. The plurality of sub pixel electrodes are defined by the sub electrode regions.
Patent TW-440441-B (TW)
Title: Flexible sheet with a strip-like mounting element, method of forming a strip-like mounting element in situ of a side of a flexible sheet, roller blind assembly
Inventor: WELFONDER KONRAD
IPC: E06B9/46
Filed: 1999-08-03
Granted: 2001-06-16
Abstract: A method of forming a strip-like mounting element in situ on a side of a flexible, preferably fabric, sheet comprising the steps of providing a thermoplastic, preferably a hot-melt adhesive, in a heated state in a longitudinally-extending undercut groove of a longitudinally-elongate receiving member, and pressing the side of the sheet against the thermoplastic in a longitudinally-extending opening in the groove, whereby one side of the thermoplastic adheres to the sheet and an opposite side of the thermoplastic is removably positioned in the groove of the receiving member.
Patent TW-430853-B (TW)
Title: Toroidal filament for plasma generation
Inventor: CHEN JIONG
IPC: C23C14/48
Filed: 1999-08-07
Granted: 2001-04-21
Abstract: A tilament (18) for an ion implanter ion source or plasma shower is provided comprising first and second legs (20a, 20b) and a thermally emissive central portion (40) having ends connected, respectively, to the first and second legs. Preferably, the legs (20a, 20b) are constructed from tantalum (Ta), and the thermally emissive portion (40) is constructed of tungsten (W). The thermally emissive portion is coiled substantially along the entire length thereof and formed in the shape of a generally closed loop, such as a toroid. The toroid is comprised of two toroid halves (40a, 40b) coiled in opposite directions. The toroid halves are constructed of a plurality of filament strands (42, 44, 46) twisted together along substantially the entire length thereof. The coils of the toroid are capable of establishing closed loop magnetic field lines (B) therein when electrical current flows through the thermally emissive portion. The closed loop magnetic field lines (B) confine electrons (E) emitted from the surface of the thermally emissive portion within the confines of the coils.
Patent TW-446600-B (TW)
Title: Method and apparatus for processing workpieces and assembling and disassembling of structural units
Inventor: WIEMERS KARL-HEINZ
IPC: B23Q3/00
Filed: 1999-08-11
Granted: 2001-07-21
Abstract: A method and an apparatus for performing mechanical operations on a workpiece secured on a mounted on a first member for movement relative to a second member in at least one of three orthogonal directions at a precision in the mu m range. Selectively energizable magnets are provided between the first and second members cause the first member to assume a floating state relative to the second member and to provide such movement. The second member is provided with a chamber for receiving the first member and is provided with openings for the controlled flow of pressurized fluid to augment the action of the magnets.
Patent TW-417027-B (TW)
Title: Dispersion compensation fiber
Inventor: KASHIWADA TOMONORI
IPC: G02B6/036
Filed: 1999-09-17
Granted: 2001-01-01
Abstract: The invention relates a dispersion compensation fiber, which is used to transmit the signal light of 1.5 mu m or 1.6 mu m wavelength band. Because the dispersion shift fiber which has the zero dispersion wavelength at 1.5 mu m of the wavelength band, and at the same time it constitutes the light transmission route. This optical fiber is provided to improve the overall transmission charateristics of the transmission route, efficiently compensate light dispersion, and make it possible to achieve a miniaturized structure. It is equipped to put the dispersion of the shift fiber under sufficient compensation, and to improve the entire dispersion slope of the light transmission route. The said dispersion compensation fiber contains the three clads structure of the first clad, the second clad, and the third clad which is sequentially installed in the outer peripheral of the core. Due to the proportional bending rate differences and the optimization of their outer diameters in their respective regions, and under the condition that the dispersion shift fiber being compensated, to realize the light transmission system with the good entire dispersion slope.
Patent TW-426569-B (TW)
Title: Connection method for nickel titanium alloy glasses parts
Inventor: NAKANISHI EIICHI
IPC: B23K11/20
Filed: 1999-11-26
Granted: 2001-03-21
Abstract: The present invention is to provide a connection method for nickel-titanium alloy glasses parts, which can firmly and reliably connect the super elastic nickel-titanium alloy glasses parts (Ni-Ti alloy parts for short) and other glasses parts made of a resistance-weldable or resistance-brazeable titanium material (skeleton members for short). The method of this invention is a connection method for nickel-titanium alloy glasses parts, comprises following steps: preparing Ni-Ti alloy parts 6, joint piece 2, and skeleton members 7, which the joint piece 2, and the skeleton members 7 are made of the same or different resistance-weldable or resistance-brazeable titanium material, and Ni-Ti alloy parts 6, joint piece 2, and skeleton members 7 are all connected together to construct the glasses frame, and the joint piece 2 has bore with wall surrounded at one end and a weldable joint portion 5 at the other end remote from the bore 4; inserting the end part of the Ni-Ti alloy parts 6 into the bore 4 of the joint piece 2; shrinking the wall of the bore 4 tightly onto the end part of the NI-Ti alloy parts 6 to connect to each other; and welding the joint portion 5 of the joint piece 2 to the skeleton members 7.
Patent TW-I230657-B (TW)
Title: Methods for manufacturing a cured resin impregnated substrate and a laminate
Inventor: OLSON LARRY D
IPC: B05D1/18
Filed: 2000-07-11
Granted: 2005-04-11
Abstract: A method for manufacturing a cured resin impregnated substrate comprising placing a substrate into a impregnation zone including a solvent containing curable resin to produce a resin impregnated substrate and at least partially curing the resin impregnated substrate to produce a cured resin impregnated substrate, wherein the number of voids in the cured resin impregnated substrate are reduced by processing the substrate in at least one processing step that reduces the number of voids in the cured resin impregnated substrate product.
Patent TW-449778-B (TW)
Title: Method for manufacturing memory device and logic device on the same chip
Inventor: JIAN SHAN-JIE
IPC: H01L21/00
Filed: 2000-02-15
Granted: 2001-08-11
Abstract: This invention is about the method for manufacturing memory device and logic device on the same chip, in which memory device has the first gate structure on the first region of the chip and the logic device has the second gate structure on the second region of the chip. At first, the first dielectric layer, a polysilicon layer, the first metal silicide layer and a hard mask layer are sequentially formed on the first region and the second region at the same time. Then, the first gate structure of memory device is defined on the first region. After that, the second dielectric layer is formed to cover the first gate structure, while the second gate structure of logic device is not defined yet at this moment. The hard mask layer and the first metal silicide layer on the second region are removed and the olysilicon layer is reserved. Then, the second gate structure of logic device is defined. After that, the lightly doped drain, source/drain and the second metal silicide layer of the logic device are manufactured.
Patent TW-447031-B (TW)
Title: A method for planarizing a shallow trench isolation
Inventor: JANG SYUN-MING
IPC: H01L21/304
Filed: 2000-03-03
Granted: 2001-07-21
Abstract: The present invention discloses a method for planarizing a shallow trench isolation in which the dishing and the erosion phenomena occurred in the prior art can be alleviated for obtaining a uniform step height. The method disclosed by the present invention is that high planarity slurry is used to perform a chemical mechanical polishing for planarizing the surface of the oxide layer before the silicon nitride mask layer (or ""polishing stop layer"" shown in the prior art) is exposed. Thereafter, (1) the redundant oxide layer can be removed by etching, or alternatively (2) using a highly selective slurry to perform a polishing until the mask layer is exposed.
Patent TW-442274-B (TW)
Title: First aid adhesive plaster
Inventor: MURATA HISAAKI
IPC: A61K9/70
Filed: 2000-03-24
Granted: 2001-06-23
Abstract: A first aid adhesive plaster comprising a pad on an upper surface of which an ointment is laid, an adhesive sheet of rectangular and an ointment protect cover formed to be a blister having a dome section by making its central portion project upwardly to form a gentle arc. The pad is covered with the blister by applying the ointment protect cover onto the adhesive sheet separably while leaving a gap between the ointment on the pad and an undersurface of the blister.
Patent TW-466495-B (TW)
Title: Charge pump circuit
Inventor: NGUYEN TAM
IPC: H02M3/07
Filed: 2000-04-26
Granted: 2001-12-01
Abstract: A charge pump circuit is provided which includes a plurality of successively coupled charge pump stages. Each of these successively coupled charge pump stages receives at least one input signals and at least one clock input signals, and in accordance therewith, conveys at least one output signal. Significantly, at least one output signal of a prior charge pump stage is substantially equal to at least one input signal of a next adjacent charge pump stage, so that the prior adjacent charge pump stage will be effectively shut off, so that reverse current flow can be prevented through the charge pump circuit.
Patent TW-471240-B (TW)
Title: Organic electroluminescent display device
Inventor: EIDA MITSURU
IPC: H01L27/32
Filed: 2000-03-30
Granted: 2002-01-01
Abstract: The purpose of the present invention is to provide an organic electroluminescent display device with large area of light-emitting pixel, and the manufacturing method to obtain the organic electroluminescent display device efficiently. An organic electroluminescent display device is disclosed, wherein the bottom electrode, organic electroluminescent medium and opposing electrode of the electrically connected bus wiring layer is sequentially formed on the supporting substrate, and the bottom electrode and the opposing electrode is disposed as XY-matrix like at the same time, the bus wiring layer and the bottom wiring layer are disposed on different surfaces, and the bus wiring layer and the bottom electrode are electrically connected on the non-electroluminescent portion, dispose the electrical insulation layer between the bus wiring layer and the bottom electrode except the electrical connection portion at the same time.
Patent TW-442912-B (TW)
Title: Metal barrier layer of integrated circuit and the manufacturing method of the same
Inventor: LIN JIUN-CHENG
IPC: H01L21/768
Filed: 2000-04-14
Granted: 2001-06-23
Abstract: The present invention reveals a metal barrier layer of integrated circuit and the manufacturing method of the same. The metal barrier layer is mainly used in the copper interconnect process, which is a composite layer structure formed of WN/WSiN/W. At the same time, the present invention also provides the manufacturing method of metal barrier layer to fabricate a metal barrier layer with good blocking capability and quality.
Patent TW-465009-B (TW)
Title: Engaging and disengaging means for wafer carrier cover member
Inventor: SAEKI HIROAKI
IPC: H01L21/50
Filed: 2000-06-28
Granted: 2001-11-21
Abstract: An engaging and disengaging device for a wafer carrier cover member of the invention includes a cover maintaining plate which, relative to a wafer carrier cover member provided with locking means having keyholes exposed on the outside, can perform relative advancing or retracting movements on the side of the keyholes; a driving portion for performing the advancing or retracting movements of the cover maintaining plate; and key elements which can rotatably project towards the cover member side of the cover maintaining plate and which are disposed in the keyholes opposite to the directions of the advancing and retracting movements. The locking means are locked or unlocked through rotation of the key elements in the keyholes. In a locked state, the key elements are insertable into and disengageable from the keyholes. In an unlocked state, the key elements are retained in the keyholes and cannot disengage from the keyholes, thereby enabling the cover maintaining plate to be in a cover maintaining state. A cover inspecting means is mounted on the cover maintaining plate to detect whether or not the cover maintaining plate is in the cover maintaining state.
Patent TW-516362-B (TW)
Title: System
Inventor: TEUNISSE ANTONIUS GERARDUS COR
IPC: H01R13/658
Filed: 2000-06-28
Granted: 2003-01-01
Abstract: A system (1) is provided which comprises a housing (2) and an electric cable (3), which housing (2) has an EMC shielding wall (4) with an edge (5). The wall (4) is provided with a recess (7) which borders the edge (5). The electric cable (3) is electrically connected to the EMC shielding wall (4) of the housing (2) at the recess (7) via contacting means (8). Means (9, 10) are provided substantially at the same recess (7) for absorbing any mechanical pull loads on the electric cable (3). Thus a compact, reliable, and safe EMC shielding system (1) is provided.
Patent TW-449850-B (TW)
Title: Method of reducing the photo loading effect
Inventor: LIN JR-BIN
IPC: H01L21/66
Filed: 2000-07-10
Granted: 2001-08-11
Abstract: A method of reducing the photo loading effect is disclosed, which comprises the following steps: providing a photomask having test key gate pattern and dummy pattern wherein the dummy pattern is located on both sides of the test key gate pattern in a shape of long-stripe parallel to the test key gate pattern. And proceeding the microlithography process to the wafer by this photomask. The dummy pattern will not transfer to the wafer.
Patent TW-556249-B (TW)
Title: Graded composition diffusion barriers for chip wiring applications
Inventor: UZOH CYPRIAN E
IPC: C23C14/34
Filed: 2000-08-15
Granted: 2003-10-01
Abstract: A barrier film for a semiconductor device structure. The barrier film includes a compound including nitrogen and at least one of titanium or tantalum, nitrogen in a concentration that varies within the barrier film, and oxygen in a concentration that varies within the barrier film.
Patent TW-462937-B (TW)
Title: Pallet
Inventor: HIGASHIDA YOSHIO
IPC: B65D19/26
Filed: 2000-09-28
Granted: 2001-11-11
Abstract: A pallet made from metal material, plastic material is combination of the above material is characterized in that it comprises 4 pieces of corner elements (2), each of which is formed from a forming material extending upward; 4 pieces of top outer frame (3), which is champed at the top portion and fixed between a pair of front and rear and a pair of left and right corner elements (2); and a plurality of top deck boards (4), which are clamps between front and rear or left and right top outer frame (3) and fixed at the frame (3). By doing so, there provides a face to face doings on all sides in-expensively. Also, the length and width of the pallet can afford demand for any altitude of pallet, and doesn't expend additional cost, that is to say, the design can be done in free way.
Patent TW-490769-B (TW)
Title: Silicon boat with protective film, its manufacture method, and silicon wafer heat-treated using silicon boat
Inventor: KOBAYASHI NORIHIRO
IPC: H01L21/673
Filed: 2001-02-09
Granted: 2002-06-11
Abstract: This invention provides a silicon boat for supporting a silicon wafer during a heat treatment of the wafer, in which a protective film consisting of a thermal oxide film is directly formed on a surface of the boat. A silicon boat is left in argon, hydrogen or a mixed gas of argon and hydrogen within a temperature range of 1000 DEG C or higher for 10 minutes or more to remove a native oxide film on the surface of the boat and then subjected to a heat treatment in an atmosphere containing oxygen to grow a protective film consisting of an oxide film on the surface of the boat. By using this silicon boat, silicon wafers are subjected to a heat treatment in an atmosphere consisting of argon or a mixed gas of argon and hydrogen. Thus, there are provided a boat for heat treatment of wafer and a method for heat treatment, of wafer, in which metal contamination is not caused in the wafer, and falling off of the protective film, damage of the wafer surface and generation of particles are prevented.
Patent TW-494624-B (TW)
Title: Driving circuit of speaker
Inventor: MAEJIMA YOSHIMICHI
IPC: H04R3/00
Filed: 2001-03-06
Granted: 2002-07-11
Abstract: The purpose of the present invention is to avoid adverse effect on sound quality even when level of audio signal is raised. In a speaker driving circuit, strengthening methods 3, 4, 5 for enhancing the ultra-low range and a high-pass filter 11 are installed. The means in the invention is to install the switching methods 10, 12, 14, and 16 such that the high-pass filter 11 is removed from an audio signal circuit when an audio signal supplied to a speaker 9 is below a medium level, and the high-pass filter 11 is inserted in the audio signal circuit when an audio signal supplied to the speaker 9 is above the medium level.
Patent TW-543007-B (TW)
Title: Laminated chip-card and its production method
Inventor: HEINEMANN ERIK
IPC: B42D15/10
Filed: 2001-04-17
Granted: 2003-07-21
Abstract: The chip-card is laminated from at least two layers (1, 2) with paper and oil as carrier-material, where a layer carries the semiconductor-chip (6) and the 2nd layer has terminal-contacts (3) and conductor-tracks or external connection-areas (4). The contacts of the semiconductor-chip are conductively connected with the terminal-contacts (3) of the 2nd layer. The chip-modules to produce the chip-cards are not necessary. The carrier-material with ICs and contacts in endless roll-format can be laminated as in the paper-production process.
Patent TW-I299662-B (TW)
Title: Compositions for modulating alpha adrenergic receptor activity
Inventor: KEN CHOW
IPC: A61P1/00
Filed: 2001-04-13
Granted: 2008-08-11
Abstract: Methods and compositions for the treatment of pain using this area derivatives. Particularly disclosed are new compositions for the treatment of chronic pain, and methods for their use.
Patent TW-515161-B (TW)
Title: Method and apparatus in a CDMA communication system
Inventor: TERASAWA DAISUKE
IPC: H04J13/00
Filed: 2001-07-09
Granted: 2002-12-21
Abstract: A novel and improved method and apparatus, in a WCDMA communication system (100), for informing a mobile station (101) of a downlink data frame time offset by determining the downlink data frame time offset, and transmitting the downlink data frame time offset via an Active Set Update message transmitted from a cell (102 or 103) to mobile station (101). Once an Active Set Update message is received, the data frame time offset information is provided to a timing block (201) which may determine data frame boundary of each downlink signal. Timing block (201) may then adjust the PN sequence timing corresponding to the downlink signal associated with the data frame time offset such that corresponding data symbols in each data frame are correctly soft combined in a combiner (210).