baber/WOPTO huggingface dataset:
Patent JP-S6091656-A (JP)
Title: Manufacture of semiconductor device
Inventor: HATADA KENZOU
IPC: H01L21/60
Filed: 1983-10-25
Abstract: PURPOSE:To transfer and join a metallic projection into an electrode leading-out region efficiently and positively by forming an organic thin-film for bonding on the electrode leading-out regin in a semiconductor element or the metallic projection formed on a substrate. CONSTITUTION:Electrode leading-out regions 3 in Al are formed on an Si substrate 2 to which an element 1 is shaped, a thin-film 4 consisting of polyimide group resin, etc. having adhesive properties more or less at the normal temperature or at several 100 deg.C is applied, and windows 5 for pushing in protruding electrodes are formed. Metallic projections 8 are formed on a glass plate 7 through Pt or Mo films, which have excellent plating properties and can be peeled and transferred easily. The element 1 is sucked and fixed to a tool 9, and the metallic projections corresponding to the electrode leading-out regions 3 are positioned and pressed 10, and transfered and joined on the regions 3 through the resin film 4. The temperature of the tool is kept properly, and the metallic projections can be transferred and joined on the leading-out regions efficiently and positively under pressure by low pressure.
Patent JP-H0642207-A (JP)
Title: Bathroom
Inventor: KAWAMURA KEIZO
IPC: E04H1/12
Filed: 1992-07-27
Abstract: PURPOSE:To make it possible to easily take a bath and defecate without necessity that an aged or a sick person stands up, by providing a transferable carrier base near a bathtub in a bathroom and providing a toilet seat under the cover of the upper face of carrier base. CONSTITUTION:A carrier base 3 is transferably set near the bathtub 1 in a washing corner 2. A cover 41 which can be freely opened or closed is fitted on the carier base 3 and a toilet seat 4 is set under the cover 41. When an aged or sick person takes a bath, he sits down on the carier base 3 and turns himself around his waist to put his feet into the bathtub and then raises his waist to sink the whole body in the tub. In this way, he can easily take a bath without necessity that he rises from his bed. If necessary, he can get in the bathtub 1 after he has defecated in the toilet bowl 4 by opening the cover 41 on the carrier base 3 to easily settle after defecation.
Patent JP-H06224175-A (JP)
Title: Caf2 etching method
Inventor: MONTE EI DAGURASU
IPC: H01L21/306
Filed: 1993-08-11
Abstract: PURPOSE: To provide a method for smoothly etching a CaE2 surface by a controlled etching speed. CONSTITUTION: This method includes a process for expositing a CaF2 surface 12 to an atmospheric chemical seed 16, a process for exciting the CaF2 surface and/or the chemical seed 16 by optical excitation allowing a reaction between the surface 12 and the seed 16 and forming a reaction product of the CaF2 / atmospheric chemical seed and a process for removing the seed 16 and the CaF2 /atmospheric chemical seed reaction product from the surface 12.
Patent JP-2001027824-A (JP)
Title: Production of toner
Inventor: ITABASHI HITOSHI
IPC: G03G9/087
Filed: 1999-07-14
Abstract: PROBLEM TO BE SOLVED: To control the shape of amorphous toner particles while retaining the particle size distribution and to produce a toner excellent in transferability. SOLUTION: When colored particles containing at least a colorant and a bonding resin are made spherical to produce the objective toner, the colored particles are made spherical by successively carrying out (a) a step for dispersing the colored particles in a medium in which the colored particles are insoluble, (b) a step for absorbing a softener in the colored particles in the medium and (c) a step for removing the softener from the colored particles. The bonding resin has a molecular weight distribution having one or more maximum values in its gel permeation chromatogram, the peak molecular weight on the lowest molecular weight side is 4,000-10,000 and the amount of a component having a molecular weight of <=1,000 is <=3 wt.%.
Patent JP-H1136888-A (JP)
Title: Intake air cooling system of compressor in natural gas burning combined cycle power generation facilities
Inventor: YOSHIDA TATSUO
IPC: F02C7/22
Filed: 1997-07-25
Abstract: PROBLEM TO BE SOLVED: To provide an intake air cooling system which can miniaturize an intake air cooler by lessening a line for medium and prevent the line for medium from breaking in an LNG vaporizer. SOLUTION: This system sends a medium which is used as a hot heat source for a liquefied natural gas vaporizer 7 to an intake air cooler 3 and to cool intake air to a compressor 2 in a gas turbine 1. The liquefied natural gas vaporizer 7 has a line 8 which goes almost straight in a body 10 and in constructed so that the medium can flow in the line 8 smoothly. As the medium, a mixture of water and one or two alcohols selected from up to dihydric alcohol is used to prevent freezing due to a rapid change in volume around a freezing point and damage of the line.
Patent JP-H1144478-A (JP)
Title: Refrigerator
Inventor: KUMAKURA HIDEO
IPC: F25D17/08
Filed: 1997-07-25
Abstract: PROBLEM TO BE SOLVED: To secure necessary heat radiation capacity of a condenser inside a machine room widening the space of the machine room and improving the containing space factor of the condenser. SOLUTION: In a refrigerator formed with a freezing compartment 2 at the lowest row of it, a vegetable compartment 3 at the upper row of the lowest through a thermally insulated partition wall and machine rooms 17 on the back surface and at the bottom part of a refrigerator, a compressor 19 inside the machine room 17 and a cooler 11 arranged to the back part of a freezer compartment 2 are arranged one on top of the other, the part of the ceiling of the machine room 17 is placed inside a plane of the projection of the thickness of the thermally insulated partition wall and a space region 17a accommodating the condenser is provided on the side part or at the upper part of the compressor 19.
Patent JP-H1145151-A (JP)
Title: Mouse with fine-movement adjusting function
Inventor: ARAKI YASUMASA
IPC: G06F3/0354
Filed: 1997-07-25
Abstract: PROBLEM TO BE SOLVED: To finely adjust the position of a mouse pointer with accuracy and ease without increasing the operation burden on a user by providing an adjustment part which is exposed and arranged on the top surface side of a main body case and finely adjust the mouse pointer movement quantity of a rolling body. SOLUTION: A 2nd ball 18 as a 2nd rolling body is stored in a main body case 12 on the top surface side and comes into point contact with a 1st ball 16 and part of it is exposed in the top surface of the case 12. This exposed part 18a is, for example, an about 1/4 upper part of the ball 18. Further, the exposed position of the ball 18 is preferably a position that the thumb reaches when the case 12 is held in the palm, etc., i.e., where the thumb comes into contact with the exposed part 18a of the ball 18 without regripping the case 12. The 2nd ball 18 which can be rotated with the thumb comes into contact with the 1st ball 16 and the rotation of the ball 18 is transmitted to finely adjust the ball 16.
Patent JP-S6260284-A (JP)
Title: Semiconductor laser element
Inventor: TOKUDA YASUKI
IPC: H01S5/00
Filed: 1985-09-10
Abstract: PURPOSE:To obtain an ideal semiconductor laser which has a small beam spreading angle, excellent temperature characteristics, high external quantum efficiency and a low threshold current by a method wherein a semiconductor super-lattice, whose energy gap is equivalent to the energy gap of the semiconductor composing the super- lattice and whose refractive index is smaller than the refractive index of the semiconductor composing the super-lattice, is employed as an active layer. CONSTITUTION:A semiconductor super-lattice active layer 8 made of AlAs/GaAs is composed of a laminated structure of AlAs barrier layers 9 with a thickness of 11.2Angstrom  and GaAs well layers 10 with a thickness of 56Angstrom . A sufficiently thin (generally less than 50Angstrom ) barrier layer thickness is employed in the semiconductor super-lattice in order to realize sufficient coupling between the wells. Concerning to the energy gap, the AlAs/GaAs super-lattice active layer 8 corresponds to AlxGa1-xAs (wherein X=0.11) and, concerning to the refractive index, the AlAs/GaAs super-lattice active layer 8 corresponds to AlyGa1-yAs (wherein Y=0.17). Therefore, the energy gap difference between cladding layers 3 and 5 and the active layer 8 is the same as the difference of the conventional examples. However, on the other hand, the refractive index difference is smaller compared to the difference of the conventional examples.
Patent JP-H0734965-A (JP)
Title: Joining structure of valve seat
Inventor: ADACHI SHUHEI
IPC: F01L3/22
Filed: 1993-07-20
Abstract: PURPOSE:To prevent the breakage of a valve seat owing to a thermal stress by devising the joining structure of the valve seat, in a cylinder head having a valve seat part formed of a different material. CONSTITUTION:In a cylinder head having a valve seat part formed of a different material, a valve seat material 1 and a cylinder head body 2 are welded to each other through an insert material 3a. Intermediate layers 31 and 32 of an intermetal compound or a solid solution deposited such that the component thereof is gradually changed are formed between the valve seat material 1 and the insert material 3a and between the cylinder head body 2 and the insert material 3a.
Patent JP-2000049171-A (JP)
Title: Manufacture of electronic package by simultaneously curing adhesive and encapsulant
Inventor: DOMINIC CHRISTOPHER J
IPC: H01L21/58
Filed: 1999-07-14
Abstract: PROBLEM TO BE SOLVED: To save the time and energy at the time of manufacturing an electronic package by omitting one process by imparting a temperature which is sufficient to allow an adhesive and an encapsulant to cure simultaneously to an obtained assembly for a period of time which is sufficient to allow the adhesive and encapsulant to cure. SOLUTION: An adhesive-applied surface area exists in an area where a chip and active parts and terminal mounted on a substrate do not exist and the chip is brought into contact with the substrate by applying pressure and heat which are sufficient to stick the chip to the substrate with an adhesive. When the chip is stuck to the substrate, it does not matter even when an adhesive-free gap is formed between the chip and substrate. Then the chip is wire-bonded to the substrate and an encapsulant having a chemical curing property and a curing profile adaptive to the adhesive is put around the chip so that the encapsulant may fill up the gap produced in the preceding process. Then a temperature which is sufficient to allow the adhesive and encapsulant to cure is imparted to the obtained assembly for a period of time which is sufficient to allow the adhesive and encapsulant to cure.
Patent JP-H0617630-A (JP)
Title: Variable valve timing lift mechanism
Inventor: HIRANO TOMIYASU
IPC: F01L13/00
Filed: 1992-07-03
Abstract: PURPOSE:To change the opening/closing timing of a valve or the lift amount by using a compact and simple structure in a direct-striking valve system where no locker arm is used. CONSTITUTION:A direct-striking type valve lifter 10 consisting of an end wall and a side wall is formed in a divided manner into an outer lifter 11 which consists of the circumferential edge part of the end wall and the side wall and is reciprocated by a high speed cam 2, and an inner lifter 12 which is reciprocated by a low speed cam 3 and opens/closes a valve 33, and the outer lifter 11 and the inner lifter 12 are arranged in a relatively slidable manner to each other. In the low speed range of the internal combustion engine, the outer lifter 11 is separated from the inner lifter 12, while in the high speed range, a switching mechanism to connect these two lifters to each other. The switching mechanism consists of first, second, and third cylinder holes 15,16,17 formed in the outer lifter 11 and the inner lifter 12, and first, second and third pins 18, 19, 20 inserted into these cylinder holes in a stable and slidable manner, or the like.
Patent JP-S6091706-A (JP)
Title: Amplifier circuit
Inventor: KAMIMURA TAKUZOU
IPC: H03G5/02
Filed: 1983-10-25
Abstract: PURPOSE:To attain stable input impedance and simplified circuit constitution by providing a buffer circuit and a bias circuit to a signal input section, connecting directly one or >=2 filter circuits and amplifiers to the output of the buffer circuit so as to provide a bias from said bias circuit to the amplifiers. CONSTITUTION:A non-inverting input terminal (+) of a differential amplifier 8 is connected directly to an output of the buffer circuit 42 provided to the signal input section and a bias is given to the differential amplifier 8 from the bias circuit 44 via the buffer circuit 42. The bias circuit 44 consists of resistors 50, 52 and 54 and diodes 60, 62. Then the buffer circuit 42 acts like a conventional buffer circuit in terms of AC, while it functions as a stabilized bias circuit to the differential amplifier 8 in terms of DC through the direct coupling of the differential amplifier 8, thereby increasing the input impedance and stabilizing the bias input.
Patent JP-S6183682-A (JP)
Inventor: ANDO MASAYASU
IPC: C04B35/64
Filed: 1984-09-27
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H0364875-A (JP)
Title: Clip lead for semiconductor ic module
Inventor: TSUJI TETSURO
IPC: H05K3/36
Filed: 1989-08-02
Abstract: PURPOSE:To connect two semiconductor IC modules each other through a clip lead by fitting a lead in the shape of a circular ring into a throughhole of a wiring substrate for a semiconductor IC module to be electrically connected to the semiconductor IC module. CONSTITUTION:In order to connect two semiconductor IC modules 1 and 17 by a clip lead 11, a lead 12 in the shape of a circular ring is made to penetrate a side edge part throughhole of the semiconductor IC module 1 and a side edge part throughhole of the semiconductor IC module 17 for extension. This connection is so performed that the tip engaging parts 14a, 15a of the respective engaging pieces 14, 14 in the shape of a circular arc in an opened state are inserted through the side edge part throughholes of both semiconductor IC modules 1, 17 to make the respective engaging pieces 14, 15 in the shape of a circular arc to penetrate both throughholes followed by closing these engaging pieces 14, 15 in the shape of a circular arc for making the tip engaging parts 14a, 15a each other engaged. Thereby, the semiconductor IC module 17 for extension is connected to the semiconductor IC module 1 through the clip leads 11.
Patent JP-S6093732-A (JP)
Inventor: ATOBE HIDEYUKI
IPC: H01H50/08
Filed: 1983-10-28
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H1129779-A (JP)
Title: Generation of electricity utilizing gasification of waste plastic and ash melting
Inventor: KAJIHATA YOSHITAKA
IPC: F22G1/16
Filed: 1997-07-09
Abstract: PROBLEM TO BE SOLVED: To provide a method for generating electricity which can enhance power generation efficiency by heating a low-temp. steam utilizing sensible heat possessed by a high-temperature combustion gas produced as a result of combustion of a gasification/cleaned gas obtained in gasification/melting of waste plastics, and then feeding superheated high-temp. steam into a steam turbine. SOLUTION: Burned ash from an incinerator 10 for wastes, together with waste plastics, is fed into an apparatus 18 for waste plastic gasification/ash melting, where the waste plastics are partially burned at a high temp. above the ash melting point to conduct gasification, whereby dioxins contained in the burned ash is decomposed. Melt-treated molten slag is obtained so as not to cause elution of heavy metals, and corrosive components (such as HCl) are removed from the gas obtained by the gasification. The gasified/cleaned gas is burned to provide a high-temp. combustion gas. The sensible heat possessed by the high-temp. combustion gas is utilized to superheat steam generated from a boiler 12 provided downstream of the incinerator and to drive a steam turbine 24. Thus, electricity is generated.
Patent JP-S5998329-A (JP)
Title: Optical information processing device
Inventor: OSHIMA MASAHIRO
IPC: G11B7/1359
Filed: 1983-10-28
Abstract: PURPOSE:To form an isotropic spot by a simple optical system by providing a beam converting prism in an optical system leading a beam from a semiconductor laser element to an information recording medium. CONSTITUTION:A beam having an expansion angle, emitted from one end face of a semiconductor laser element 1 passes through a coupled lens 2, a prism 7 and an objective 3, and forms a spot 5 on a disk 4. When angles at e<-2> in the horizontal direction and the vertical direction of an emitted light distribution in a distant view field image of the beam from the laser element 1 are denoted thetaH and thetaV, and a hemihedral angle made by the laser 1 and the lens 2 is denoted as theta, a numerical aperture of the lens 2 is selected so as to satisfy theta<thetaH<=thetaV, the prism 7 is formed so as to satisfy a prescribed condition, and the horizontal direction of expansion of the beam is expanded and made to coincide with expansion in the vertical direction, by which an isotropic spot is obtained by a simple optical system.
Patent JP-H1129197-A (JP)
Title: Housing structure of measuring instrument
Inventor: KOBAYASHI KENJI
IPC: B67D7/06
Filed: 1997-07-10
Abstract: PROBLEM TO BE SOLVED: To provide a housing structure which prevents rainwater from penetrating into an upper case to prevent damage of electronic instruments housed in the inside, and can be easily inspected and maintained. SOLUTION: In a housing structure of a measuring machine constituted of a lower case 2 in which a measuring instrument is housed, a support 3 provided on the lower case 2, and the upper case 4 installed on the support to contain a refueled volume indicator 12, an opening is formed at the underface of the upper case 4 and a base plate 8 covering the opening of the underface of the upper case 4 is provided on the support 3. One end of the base plate 8 and one lower end of the upper case 4 are connected to each other by a hinge 13 and the other end of the base plate 8 and the other lower end of the upper case 4 are fixed together with bolts 14.
Patent JP-H0864655-A (JP)
Title: Method and apparatus for replacing substrate
Inventor: TANIGUCHI SATOSHI
IPC: B65G49/07
Filed: 1994-08-25
Abstract: PURPOSE: To shorten the processing tact by shortening the time required for replacing a substrate through a simple structure for replacing the substrate using a single hand. CONSTITUTION: A hand 30a holding an unprocessed substrate 20 is advanced into a chamber 11 where the unprocessed substrate 20 is delivered to a supporting pin 12. The processed substrate 20 is supported temporarily by a traversal p in 13 and received by the hand 30a which is then retracted to the outside of the chamber 11 to carrying the processed substrate 20 to the outside of the chamber 11. Consequently, the unprocessed substrate 20 can be transferred from the preceding process to the front of the chamber 11 by means of the hand 30a before a processed substrate 20 can be carried out and the processed substrate 20 can be transferred to the next process by means of the hand 30a after the unprocessed substrate 20 is carried in before the processing is ended.
Patent JP-2001027093-A (JP)
Title: Replacement method for decrepit pipe by non-cut and cover
Inventor: KIMURA NOBUHIKO
IPC: E21D9/06
Filed: 1999-07-15
Abstract: PROBLEM TO BE SOLVED: To efficiently and surely provide a replacement method for a decrepit pipe by non-cut and cover without impairing the decrepit pipe buried in the ground for a long period of time. SOLUTION: This replacement method of a decrepit pipe by non-cut and cover is so constituted that a PC steel material 3 is inserted into a decrepit pipe 1 from a starting shaft A or an arrival shaft B and is strained so as to reach the nearly central part in the decrepit pipe, the inside of the decrepit pipe 1 is filled with mortar or concrete to fix the PC steel material 3, a new pipe 2 is contacted with the end face of the decrepit pipe 1 in the starting shaft A, a forced jack 5 is installed backward of the new pipe 2, one end of the PC steel material 3 filled with mortar or concrete to fix in the arrival shaft B is fixed to a pull-out jack 8 provided to a traction device, the pull-out of the decrepit 1 with the extension of the pull-out jack 8 and the pull-out of the new pipe 2 by forcing the new pipe with the extension of the forced jack 5 are simultaneously executed.
Patent JP-2001025389-A (JP)
Title: Tsa7005 gene
Inventor: OGAWARA TAKESHI
IPC: A61K48/00
Filed: 1999-07-15
Abstract: PROBLEM TO BE SOLVED: To obtain a new TSA7005 gene which consists of a polynucleotide coding for a polypeptide having a specific amino acid sequence, has homology to Reg protein, and is specific to the pancreas, the small intestine, the large intestine, and the testis as a pancreatic β-cell growth activating factor and a blood sugar-lowering factor. SOLUTION: This is a new TSA7005 gene which contains a polynucleotide coding for a polypeptide having the amino acid sequence represented by the formula, a strand complementary to the polynucleotide, or a polynucleotide having a homology at 95% or more to the polynucleotide coding for the polypeptide having the amino acid sequence represented by the formula, has a homology to Reg protein, is specific to the pancreas, the small intestine, the large intestine, the testis, and so on as a pancreatic β-cell growth activating factor or a blood sugar-lowering factor, and is used for producing a protein useful for treating diabetes and so on.  This gene is obtained by preparing a cDNA library from mRNA isolated from a human pancreatic tissue, or the like, according to the conventional method, followed by screening the obtained library using a probe consisting of its partial sequence or an antibody.
Patent JP-H1143313-A (JP)
Title: Production of oxide superconductor
Inventor: TEI KIYOKUKOU
IPC: H01B13/00
Filed: 1997-07-28
Abstract: PROBLEM TO BE SOLVED: To enable reduction of reaction temperature and pressure in production of oxide superconductor by using a halide of an element constituting an oxide superconductor as a part or all of a raw material of the element and synthesizing the oxide superconductor. SOLUTION: This oxide superconductor such as YBaCuO-based oxide superconductor is prepared by mixing oxide raw materials at a prescribed molar ratio, subjecting the oxide raw materials to heat treatment at a temperature of 900-1,000 deg.C for about 24-100 hr in oxygen atmosphere, pulverizing and mixing the mixture, molding the mixture under pressure to afford pellets and sintering the pellets at high temperature under high pressure. For example, when a halogen copper such as CuI is used as a copper raw material, CuI is decomposed to Cu single substance having high chemical activity and I and is actively reacted with other constituent elements constituting oxide superconductor and treated under ordinary sintering conditions comprising 100 Pa (1 atom) to 1 M Pa pressure and 800-900 deg.C temperature to provide the objective superconductor.  The halide which can be used includes a halogen-barium compound such as BaI2 , a halogen-yttrium compound such as YI3 and other halide includes bromide such as CuBr.