baber/WOPTO huggingface dataset:
Patent JP-S54112134-A (JP)
Title: Logical operation circuit
Inventor: SAKAO TAKASHI
IPC: G06F7/38
Filed: 1978-02-22
Abstract: PURPOSE: To make is possible to simplify the constitution of a series-parallel logical operation circuit on a ripple carry system, by making use of a carry input even at the time of logical operation execution.  
     CONSTITUTION: In figure (a) as the constitution example of a unit cell executing ADD and AND operations, operation output 0 with operation control input CAND made "0" at an ADD operation time becomes the addition result among operation inputs A and B, and carry input Ci, and carry output CO becomes the addition carry among A and B, and Ci. At operation output 0, the AND output between operation inputs A and B appears and at carry output CO, "1" appears. The truth table of this circuit is shown in figure (b) and in the figure of circuit (a), a half adder NOR gate uses three-input gate 21 and its operation control input is connected, to that ADD and AND operation circuits can both be obtained. 
     COPYRIGHT: (C)1979,JPO&Japio
Patent JP-H08219496-A (JP)
Title: Outdoor device of air conditioner
Inventor: KAWADA HIROYUKI
IPC: F24F5/00
Filed: 1995-02-08
Abstract: PURPOSE: To provide an outdoor device of an air conditioner in which a reactor- fixing strength is improved without reducing a workability for fixing the reactor and thermal radiation effect. CONSTITUTION: A partition plate 2 for parting a compressor chamber and a heat exchanger chamber is provided with an opening 2a. At least one of upper and lower portions of the opening 2a is provided with an insertion hole and in turn a first screw hole corresponding to the insertion hole, inner upper and lower portions of the first screw hole are provided with a second screw hole. There is provided a heat radiation plate 7 having a pair of guide portions 7a at one surface between the first and the second screw holes and it is slidably held by a guide part 7a.  With such an arrangement, a reactor 6 having a fixing plate 6a provided with a through-pass hole corresponding to the second screw hole is fixed to the heat radiation plate 7 with a screw, it is threadably engaged with the first screw hole through the insertion hole and then the heat radiation plate 7 having the reactor 6 fixed thereto is fixed to the partition plate 2.
Patent JP-S62180173-A (JP)
Title: Shaft sealing device
Inventor: SUGIMOTO OSAMU
IPC: F16J15/34
Filed: 1986-02-03
Abstract: PURPOSE:To obtain a shaft sealing device requiring easy assembly and removal and giving good sealing performance by so fitting a case for housing a seal ring to a seal case as to be freely detachable. CONSTITUTION:A seal case 10 is placed between a seal casing 9 and a rotary shaft 1 and fitted with cases 17A and 17B for housing a seal ring 12 in slide contact with the flange 13 of the rotary shaft 1. And the cases 17A and 17B are bolt 18 fixed to the seal case 10 to permit the detaching thereof. When a shaft sealing device is assembled, therefore, it is possible to mount the cases 17A and 17B first on the seal case 10 and then fix a whole to the seal casing 9, thereby simplifying assembly work very much. Also, the machining of the slide surface of the seal ring 12 may be carried out after the mounting thereof to the cases 17A and 17B, thereby enabling the improvement of assembly precision and sealing quality.
Patent JP-H0542362-A (JP)
Title: Dip soldering device for electronic parts
Inventor: FUJIE KENZO
IPC: H01R43/02
Filed: 1991-02-13
Abstract: PURPOSE:To quickly and surely execute solder coating to both sides of electronic parts. CONSTITUTION:A clamp conveyor 31 on which clamp jigs 32 to laterally clamp electronic parts 40 are mounted continuously is provided. The clamp jig 32 has an opening 33 which penetrates and clamps the electronic parts 40 and can oscillate freely in the direction orthogonally crossed to the carrier direction of the clamp conveyor 31. An upstream solder tank 27 and a downstream solder tank 28 are provided respectively on both sides of the clamp conveyor 31. At the neighborhood of the upstream side of the downstream solder tank 28 is provided a clamp position adjusting device to adjust the clamp position of the electronic part 40 with the opening 33 of the clamp jig 32 opened.
Patent JP-H11200672-A (JP)
Title: Lock handle device with inner side emergency opening function
Inventor: SUGIMOTO NAOYUKI
IPC: E05B1/00
Filed: 1998-01-16
Abstract: PROBLEM TO BE SOLVED: To provide a lock handle device with inner side emergency opening function which separates a shaft of an inner side handle unit from a shaft of an outer side handle unit and can operate the inner side handle unit independently. SOLUTION: A through hole 6 in the radial direction is provided in a connection cylinder 7 fixed on a rear end part of a shaft 8 of an outer side handle unit 4, and a receive hole 13 in which the connection cylinder 7 is fitted is provided in a front end part of a shaft 12 of an inner side handle unit 9. A lock shaft 11 is fitted in the shaft 12 of the inner side handle unit 9 so as to travel in the forward and backward directions, and the lock shaft 11 is advanced and energized by a spring member 19. A hard ball 5 is fitted in the through hole 6 of the connection cylinder 7, and a part of the hard ball 5 is engaged with a receive groove 13a on an inner face of the receive hole 13 when it comes into contact with a peripheral face of a front end part 11a of the lock shaft 11.  On the other hand, the part of the hard ball 5 is forced to escape from the receive groove 13a when it comes into contact with a peripheral face of a small diameter part 11b, and a clamp member 14 is connected with the shaft 12 of the inner side handle unit 9.
Patent JP-H11201016-A (JP)
Title: Swash plate hydraulic rotating machine, and manufacture of swash plate used in it
Inventor: TAKEUCHI YOSHINORI
IPC: F04B1/16
Filed: 1998-01-16
Abstract: PROBLEM TO BE SOLVED: To stably form a sliding surface with excellent abrasion resistance even if machining error occurs when providing the sliding surface of a swash plate with surface finish. SOLUTION: When a swash plate 21 is manufactured, first a swash base material is formed as a base material of the swash plate 21 by providing cutting machining for a plate material made with high-carbon chrome bearing steel or others. Next, by providing heat treatment such as quenching and tempering treatments for the swash base material of the swash plate 21, the surface of the swash base material is formed as a hardening layer. Finally, by providing surface finish such as cutting machining for the surface of the swash base material, a sliding surface 21A of the swash plate 21 is formed flat. Thus, the sliding surface 21A of the swash plate 21 is formed in Vickers hardness, for example, about Hv600-750.
Patent JP-H01196373-A (JP)
Title: Image forming apparatus
Inventor: DAI KAZUYOSHI
IPC: B41J13/22
Filed: 1988-01-30
Abstract: PURPOSE:To form a picture image with high accuracy in overlapping, by braking a recording medium into a tensive state, while the end of the recording medium is held by a gripper to be wound around a platen drum. CONSTITUTION:During the paper feeding, a driving roller 40a of a pair of resisting rollers 40 is rotated until the end of a paper P is held by a gripper 19. The paper P is successively wound around a platen drum 22 as the drum 22 rotates. However, since the medium part of the paper P after a distance (f) is pulled out between the driving roller 40a and a subordinate roller 40b which are in the stopped and pressed state, the paper P is braked into a tensive condition. Accordingly, the paper P can be brought into tight contact with respect to the platen drum 22 before a thermal head 21 applies pressure thereto. Therefore, the paper P can be in tight contact with the platen drum 22 from the printing time of a first color in the same manner as at the printing time of a second color and thereafter. Thus, a picture image can be formed with high accuracy in overlapping.
Patent JP-H10217806-A (JP)
Title: Variable cylinder engine controller
Inventor: UMEHANA TOYOICHI
IPC: B60W10/00
Filed: 1997-02-03
Abstract: PROBLEM TO BE SOLVED: To prevent a shock in a return to a whole cylinder operation by performing a cylinder reducing operation in a speed reduction operation time, determining a downshift based on an idling action of a one-way clutch, and performing a return to the whole cylinder operation when the downshift is carried out. SOLUTION: In a speed reducing inertial operation time, a fuel cut is carried out in all the cylinders, however, a fuel cut in the whole cylinders is stopped at a comparatively high vehicle speed, and a shift to a cylinder reducing operation is carried out, and then, a return to the whole cylinder operation is carried out at further lower vehicle speed. This return is carried out when a switch from the second speed range to the first speed range is carried out during a speed reducing insertial drive in a D range. That is, it is determined at first whether the inertia drive is carried out or not by means of an accelerator opening sensor 102, for example, and a shift to a partial cylinder operation is carried out.  In this process, on the basis of a downshift signal to the first speed range, values of the accelerator opening sensor 102 and the vehicle speed sensor 242 are stored in a ROM 304 for transmission control. Then, a command for the whole cylinder operation is given after the predetermined time from output of the downshift signal. In this way, a shock accompanying a return to the whole cylinder operation can be avoided.
Patent JP-H09190269-A (JP)
Title: Manufacture of coordinate input board and manufacturing device
Inventor: ICHIKAWA KEIJI
IPC: G06F3/03
Filed: 1996-01-11
Abstract: PROBLEM TO BE SOLVED: To provide a manufacture method of a large coordinate input board where the connection process of the insulating conductor terminal of the coordinate input board and substrate connection part for terminal connection can be automated. SOLUTION: A terminal connection area 18 and a terminal connection part convergence device 19 where poles are arranged at the same pitch as the substrate connection part for terminal connection in a longitudinal direction are arranged at the outer periphery of wiring poles 12 arranged at the outer periphery of an insulating substrate 11. A frame-like wire fixing device 21 is engaged with the area 18, and an insulated conductor 13 is hardened on the insulating substrate 11 and the wire fixing device 21 in a prescribed pattern from above the wiring insulating substrate 11 by applying adhesive 14 through the poles 12 and 12A.  A different wire fixing device 21A is installed and fixed from above the fixing device 21 and a folding part 15 is removed from the poles 12 and 21A in a state where it is arrayed at the same pitch as the substrate connection part for terminal connection while the folding part 15 of the insulated conductor 13 is held and fixed with the wire fixing devices 21 and 21A. Then, the folding part 15 is connected to the substrate connection part for terminal connection so as to manufacture the coordinate input board.
Patent JP-H04259229-A (JP)
Title: Method of mounting of hybrid integrated circuit
Inventor: KOBAYASHI JUNKO
IPC: H05K13/04
Filed: 1991-02-14
Abstract: PURPOSE:To align protruding bumps of a chip element with a wiring pattern on a circuit board highly accurately regardless of the light transmissivity of the circuit board and even if a pitch between the bumps is small. CONSTITUTION:In order to mount a chip element 1 having protruding electrodes (microbumps) 3 on a circuit board 4 which has a wiring pattern 5 and an insulating film 9 around the pattern 5 on its main surface, a means 11 which monitors a distance between the chip element 1 and the circuit board 4 surface to align the chip element to be mounted is provided and, if necessary, the position is further corrected by ultrasonic wave 12. As the insulating film is provided around the connection parts between the protruding electrodes of the chip element such as a semiconductor chip and the wiring pattern, adjacent bumps are protected from mutual contact easily when the chip element is mounted on the circuit board.
Patent JP-H09201043-A (JP)
Title: Power supply
Inventor: ASAYAMA ATSUSHI
IPC: H02M1/42
Filed: 1996-01-12
Abstract: PROBLEM TO BE SOLVED: To reduce the losses and sizes of the components of a power supply by controlling the value of an electric current flowing through a switching element to a constant value by shortening the switching-on width of the switching element only during the period of the phase before and after the peak value of an input voltage and, during the period of the other phase, controlling a rectified voltage to a constant value. SOLUTION: A power supply is provided with a current detecting circuit 101, an error amplifier circuit 102, a triangular wave oscillating circuit 103, and a reference voltage source VREF2 so that the unit can limit the peak value of an electric current flowing to a transistor Q1 in such a phase that VS becomes the highest by limiting the on-time of a transistor Q1. In other words, only during the period of the phase before and after the peak value of an input voltage, the current flowing to the transistor Q1 is controlled to a constant value by shortening the switching-on width of the transistor Q1 and, during the other period, a rectified voltage is controlled to a constant value. Therefore, the losses and sizes of the components of the power supply can be reduced by reducing the peak value of the electric current flowing to the transistor Q1 without reducing the total control power.
Patent JP-H11219512-A (JP)
Title: Magnetic recording medium
Inventor: KITAORI NORIYUKI
IPC: G11B5/70
Filed: 1998-02-02
Abstract: PROBLEM TO BE SOLVED: To obtain a satisfactory traveling stability and a satisfactory output weveform by providing a coating layer at least including a magnetic layer on the surface of one side of a base film and a back coating layer on the opposite surface and making the sum of the coating layer of the magnetic layer side and the back coating layer that is, the total thickness of all coatings equal to or thinner than that of the base film. SOLUTION: A magnetic layer as an uppermost layer including ferromagnetic powder and a binder is provided on a base film. Moreover, an intermediate layer at least including magnetic powder and/or non-magnetic powder and a binder may be provided between the base film and the magnetic layer. Furthermore, a back coating layer is provided on the back of the film. Then, when the thickness of all coating layers existing on the surface on which the magnetic layer of the base film of the magnetic layer side is provided, is defined as DM, the thickness of the back coating layer is defined as DB, the thickness of the base film is defined DF, this magnetic medium is made to satisfy the relation of (DM+DB)×1.1>=DF. When the magnetic madium does not satisfy this relation, a satisfactory traveling stability and a satisfactory output waveform are not obtained.
Patent JP-H07229142-A (JP)
Title: Cutting device for temporary ground anchor
Inventor: MOCHIDA SATORU
IPC: E02D5/80
Filed: 1994-02-18
Abstract: PURPOSE:To efficiently heat a tension material in the case of cutting the tension material of a temporary ground anchor by heating. CONSTITUTION:A cutting device for a temporary ground anchor comprises tension materials 8 of plural carbon fiber reinforced plastic rods and fixers 9 which are connected to the forward ends of the tension members and fixed in the excavated hole in the underground, and is adapted to cut the tension member 8 of the temporary ground anchor 7 recovered after use, from the fixer 9, with the fixer 9 left behind. The cutting device further comprises a heat transmitter 21 in which an insert hole where all tension members 8 are inserted is bored, and by which a partial section of the tension member 8 is surrounded, and a heating unit 3 which is inserted in the heat transmitter 2 near the insert hole 21 and connected to an electric wire 4 connected to a power supply. The heating unit is caused to generate heat by an electric current flowing through the electric wire 4, thereby heating the tension members 8. Thus, the plural tension members 8 are heated efficiently.
Patent JP-H10206080-A (JP)
Title: Joint part structure of heat exchanger
Inventor: TANAKA HIROSHI
IPC: F28F9/26
Filed: 1997-01-20
Abstract: PROBLEM TO BE SOLVED: To improve a space efficient in installation to the utmost by interposing a first gasket between a binding member and a tank wall and a second gasket between a head part of a tying member which is inserted through the binding member to be tied in a screw hole and the binding member. SOLUTION: A first gasket 6 is interposed between a binding part 5 and a tank wall 2a while a second gasket 9 between a head part 7a of a tying member 7 and the binding member 5. As a result, the sealing of the portion as mentioned above is almost completed thereby removing fear of leakage completely in substance. Therefore, this achieves a saving of space efficiently without causing a failure such as leakage. There is no problem in the tying work of the tying member 5 as compared with the conventional structure. Rather, structurally, this not only eliminates the need for fitting members thus far provided on the side of a tank to curtail the number of parts thereby achieving not only a reduction in cost but also a lowering of the weight.
Patent JP-H07229123-A (JP)
Title: Safety device of snow melting machine
Inventor: KAMO YOSHIAKI
IPC: E01H5/10
Filed: 1994-02-18
Abstract: PURPOSE:To prevent an accident by quickly extinguishing a burner when the aged or the children tumble over a part of a snow melting chamber by accident during a snow melting work. CONSTITUTION:In a snow melting machine so constructed that a burner chamber E, a snow melting chamber C and a pump chamber D are formed in a box- shaped snow melting tank 2 having an upper lid 1 pivoted on one upper side thereof, a secure hand 3 elongated in the lateral direction is provided on a part of the forward side of the back of the upper lid 1 that is positioned in the snow melting chamber C. During snow melting work with the upper lid 1 opened, when the secure hand 3 is grasped and the upper lid 1 is turned in the closing direction, a burner B is extinguished automatically.
Patent JP-H05218632-A (JP)
Title: Soldering method of flexible printed-circuit board
Inventor: TAKAHASHI SHINICHIRO
IPC: H05K1/00
Filed: 1992-02-06
Abstract: PURPOSE:To prevent the PET of a board from being softened by a method wherein a solder is applied only to a lead and a land which are not shut off by means of a heat-insulating holder and a soldering operation is performed by a total soldering method. CONSTITUTION:In order to solder a lead 7 to a land 9 with reference to a polyethylene terephthalate-based flexible printed circuit board (PET-based FPC) 1 wherein an electronic component is inserted into the surface 4a of a board 4 and the lead 7 connected to the electronic component is passed through, and assembled to, an insertion hole Ra, a heat-insulating holder 2 is assembled to the side of the rear 4b of the board 4 in such a way that a pin 10 is inserted into a holder mounting hole 5. All parts other than a part where a solder 22 is applied to the lead 7 and the land 9 are shut off by means of the heat- insulating holder 2. Thereby, even when a solder at 250 deg.C is sprayed to the side of the FPC 1, the FPC 1 can be kept at 220 deg.C or lower and it is possible to prevent the FET of the board 4 from being softened.
Patent JP-S60165752-A (JP)
Title: Semiconductor integrated circuit
Inventor: MIZUKAMI TAKESHI
IPC: H01L27/088
Filed: 1984-02-08
Abstract: PURPOSE:To stabilize the operation of a circuit in an IC which includes a differential amplifier by adjacently forming two differential signal lines of the amplifier in parallel, and providing two wirings shortcircuted by a low resistor at both outsides, thereby reducing a noise generated at the signal lines. CONSTITUTION:A thick field SiO2 film 5 is formed on the periphery of an Si substrate 7, a low resistance diffused region 3 is formed on the surface layer of the substrate 7 surrounded by the film 5, an insulating film is coated on the region 3, and two differential signal lines 8R, 8L are adjacently coated in parallel on the film. Then, contacting holes 4 are opened at both ends of the region 3, metal wiring layers 2R, 2L for connecting a constant-voltage source are buried in the holes, and the lines 8R, 8L are surrounded. Then, signal lines 1R, 1L are mounted on the film 5, and the entire surface including them is coated with a protective film 6. Thus, even if the potentials of the lines 1R, 1L are abruptly varied, the variations are shielded by the layers 2R, 2L, and the differential value of the lines 8R, 8L does not alter.
Patent JP-S54113759-A (JP)
Title: Wear detecting body of brake-pad
Inventor: MORIYA MICHIROU
IPC: F16D66/02
Filed: 1978-02-24
Abstract: PURPOSE: To ensure low cost, by detecting the wear of a brake-pad by a laminar body also filling the role of a pad keep plate in place of conventional probes.  
     CONSTITUTION: The desired wear detecting body 10 is shaped in such a manner that arms 12, 12' are formed to both sides of a rectangular main body 11, a connecting piece 13 to a lower portion and tubs 14, 14' to both sides of the connecting piece 13 respectively by punching a spring steel plate, and the blank is bent as shown in the figure along chain lines. When a brake lining 32 in a disc brake, to which the detecting body 10 is installed, wears, a back metal 31 fixing and supporting the lining 32 gradually approaches to a disc D and the connection of the arms 12, 12' to the back metal 31 is disconnected, the detecting body 10 is released by the elasticity of the arms. Thus, the detecting body 10 shakes and abnormal sounds are generated, and the reaching of the pad to the limit of wear is informed. 
     COPYRIGHT: (C)1979,JPO&Japio
Patent JP-H10223749-A (JP)
Title: Semiconductor device and its manufacture
Inventor: WADA TOSHIO
IPC: H01L21/76
Filed: 1997-02-04
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device, wherein the device can be enhanced in degree of integration by remarkably reducing insulation/isolation width in a MOS integrated circuit. SOLUTION: A field shielding structure is selectively formed on a P<+> -type silicon substrate 101, P<-> -type epitaxial layers 107 and 108 are formed in an active region demarcated with the field shielding structure, and the gate structure of a MOS transistor is provided to the P<-> -type epitaxial layers 107 and 108. N-type regions 128 and 129 serving as the drain/source regions of the MOS transistor are stopped from extending to the surface of the silicon substrate 101 getting over the thicknesses of the P<-> -type epitaxial layers 107 and 108 by the presence of the silicon substrate 101 whose surface is very high in impurity concentration, so that the regions 128 and 129 are restrained from reaching under the field shielding structure. Therefore, MOS transistors are effectively insulated and isolated from each other by a field shielding structure, so that a semiconductor device of this constitution can be markedly lessened in insulating isolation width.
Patent JP-H09215149-A (JP)
Title: Method for removing extruded resin on cable insulating material
Inventor: SHINAGAWA NOBUYUKI
IPC: B29C47/08
Filed: 1996-02-07
Abstract: PROBLEM TO BE SOLVED: To prevent an extruded resin on a cable insulating material from being left unscraped. SOLUTION: An extruded resin 21 on a cable insulating material 13 is roughly scraped in such a manner that a thin layer 21a remains. A part of the thin layer 21a of the extruded resin is scraped off to expose a part of a cable conductor. Making sure of the boundary between the exposed part 13a of the cable insulating material and the thin layer 21a of the extruded resin, belt-shaped, parallel ray is emitted to scrape the thin layer 21a of the extruded resin to such a direction that the exposed part 13a of the cable insulating material is expanded.