Patent TW-200907596-A (TW)
Title: Projecting exposure method, alignment method, and projecting exposure apparatus
Inventor: KOTANI ICHIYO
IPC: G03F9/02
Filed: 2008-05-02
Abstract: The present invention provides projecting exposure method and exposure apparatus, wherein the exposure method includes the driving platform, the location signal output mechanism, the standard mark inspection mechanism, and the projection exposure apparatus for location determination mechanism to project pattern and image onto exposure substrate; the exposure substrate has at least nine exposure regions provided for pattern and image projection and at least nine inspection regions provided for inspection substrate to be deformed; the standard mark for the exposure substrate presents at least nine standard locations of the exposure regions and also at least nine standard locations of the inspection regions, which includes the following steps: (1) exposure substrate location control step: after the exposure substrate is used as substrate and loaded on platform, sequentially moving the loading platform through the driving platform to position on at least four inspection locations of the exposure substrate; (2) storage step for exposure substrate location: retrieving each location of exposure substrate inspection on loading platform and storing them; (3) calculation step for standard mark position: based on the exposure substrate inspection location, using the standard mark inspection mechanism to inspect the standard mark on exposure region, and then based on inspection result and loading position to calculate the standard mark position of the exposure substrate; (4) calculation step for error parameter value in whole region: according to the standard mark position of the exposure substrate for the whole exposure substrate, using the least square method to calculate all error parameters in the whole region which is characterized by the error with the displacement of the exposure substrate standard mark; (5) calculation step for error parameter value in inspection region: based on at least two locations of the exposure substrate standard mark in each inspection region to calculate all error parameters in inspection region which is characterized by the error with the displacement of the exposure substrate standard mark; (6) calculation step of the linear relationship for error parameter value in inspection region: based on error parameter value in each inspection region, using the least square method to calculate the linear relationship of the error parameter valve in inspection region; (7) calculation step for differential linear relationship: calculating at least first differential value upon the error parameter value of the inspection region between two neighboring inspection regions; and based on the differential value, using the least square method to calculate the differential linear relationship; (8) calculation step for weighted coefficient: based on error parameter value in each inspection region, linear relationship on error parameter value in each inspection region, and accumulated summation of the ranks of differential method with the differential linear relationship to calculate error information of the error parameter values in inspection region. Therefore, according to error information of the error parameter values in inspection region to calculate weighted coefficients, the coefficients indicates: linear relationship according to the error parameter value in inspection region, error of the linear relationship in differential method, and the proportion and magnitude not based on these errors; (9) determination step for exposure substrate location: based on the standard mark location, the whole error parameter values, and the weighted coefficients of the exposure substrate to calculate the target location ready for positioning with loading platform, and to position the loading platform on the targeted location.