baber/WOPTO huggingface dataset:
Patent TW-I288765-B (TW)
Title: Method of preparing inflatable biodegradable poly-microspheres
Inventor: WU YI-FAN
IPC: C08J9/16
Filed: 2004-08-04
Granted: 2007-10-21
Abstract: The present invention relates to a method of preparing inflatable biodegradable poly-microspheres, wherein the microspheres can be made of various kinds of biodegradable polymers. The method of the invention comprises: solving the biodegradable polymers with a specific solvent; mixing the polymers with foaming agents to inflate the them; pouring in the solution containing the biodegradable polymers with foaming agents after well mixture into a solution of non-biodegradable polymer solvent, wherein the solution contains one or two kinds of surfactant; after that, solidifying the surfaces of the poly-microspheres; then diffusing the solvent in the microspheres to the non-solvent by the force of mixing; thus, the microspheres can be formed into a stable solid state in the non-solvent solution. Furthermore, by controlling the mixing process, the microspheres can also be formed into inflatable microspheres with different diameters.
Patent TW-I246031-B (TW)
Title: System and method for synthesizing multi-exposed image
Inventor: LIN TSUNG-WEI
IPC: H04N5/335
Filed: 2004-09-17
Granted: 2005-12-21
Abstract: The present invention provides a system for synthesizing a multi-exposed image, which comprises an image detection unit and an image synthesis unit; wherein, the image detection unit is used to detect the labeled portion of the low dynamic scope image, in which the low dynamic scope image is an image on the same scene with different exposure time; and, the image synthesis unit is used to configure the exposure history data for the low dynamic scope image based on the labeled portion, and proceed the image synthesis for the low dynamic scope image referring to the exposure history data to form the high dynamic scope image.
Patent TW-I238418-B (TW)
Title: Slide cover and electronic device having slide cover
Inventor: YANAGISAWA MITINOBU
IPC: G03B17/02
Filed: 2004-10-01
Granted: 2005-08-21
Abstract: A slide cover (30) comprises a cover outer plate (70), a structural member (80) fixed to the back surface of the cover outer plate, a holding member (90) movably positioned in a space between the cover outer plate and the structural member, and a toggle means (100) installed between the holding member and the cover outer plate or structural member. The holding member is provided with two parallel racks (82a, 82b), and guides (81) extending in the same direction as the racks at opposite ends. The holding means comprises a holding plate (91), an even number of pinion gears (92a, 92b) rotatably supported by the holding plate and meshing with each other, and a guide body (93) supported by the holding plate in a position where the even number of pinion gears are held therebetween. Those of the even number of pinion gears which are positioned at opposite ends mesh with the racks. The guide body is slidably engaged by the guide, and the direction in which the toggle means urges the holding member is reversed at a substantially intermediate position in the range of movement of the holding member.
Patent TW-I257272-B (TW)
Title: System and method of increasing soldering property of printed circuit boards in surface mount technology
Inventor: FEI YAO-CHI
IPC: H05K3/00
Filed: 2004-11-02
Granted: 2006-06-21
Abstract: The present invention relates to a system and method of increasing soldering property of printed circuit boards in surface mount technology, which has the capability of improving the soldering property of electronic components in surface mount technology (SMT), which enhances the soldering property by setting printed circuit boards on a delivery system (or setting electric current-carrying carrier on a delivery belt); in coordination with atmospheric low-temperature plasma system, removing the carbonaceous organic substances of the PCB soldering pad so as to improve the soldering property; then passing the printed circuit boards through a SMT production line; and mounting electronic components on the printed circuit boards, and especially the yield soldering points in leadless process can be improved thereby. The present invention is especially suitable for products having small contacts on electronic components and communication products used under high frequency and for future trends.
Patent TW-I267590-B (TW)
Title: Linear guide device
Inventor: XU WEI
IPC: F16C43/06
Filed: 2004-12-03
Granted: 2006-12-01
Abstract: A linear guide device has a guide rail (12), a slider body (15), an end cap (16), a large number of rolling bodies (18), and separators (22). The slider body (15) has a slider side rolling body raceway surface opposed to a rail side rolling body raceway surface (13) formed on the guide rail (12). The end cap (16) has a rolling body direction switching path (21) communicating with a rolling body load rolling path (19) formed between both rolling body raceway surfaces of the guide rail (12) and the slider body (15) and also communicating with a rolling body return path (20) formed in a penetrating manner in the slider body (15), along the longitudinal direction of the guide rail (12). In conjunction with relative linear movement of a slider (14) constituted of the slider body (15) and the end cap (16), the rolling bodies (18) roll in the rolling body load rolling path (19), the rolling body return path (20), and a rolling body direction switching path (21). The separators (22) are arranged between every two adjacent rolling bodies (18). The end cap (16) has a through hole (25) for assembling the rolling bodies (18) and the separators (22) from the outside of the slider (14) into the rolling body return path (19) and also has a cap member (26) removably fitted in the through hole (25). The cap member (26) forms part of the rolling body direction switching path (21).
Patent TW-I262459-B (TW)
Title: LED sign and method manufacturing the same
Inventor: LIN YUAN
IPC: G09F13/20
Filed: 2004-12-31
Granted: 2006-09-21
Abstract: The present invention relates to a LED sign and a method manufacturing the same. The method comprises steps of: directly bonding a plurality of selected LED bare chips in form of a predetermined font or displaying pattern arrangement on a circuit board by a die attaching process; baking the bonded circuit board and conducting the wire bonding process on each chip; after a glue dispensing process and a baking process forming a displaying circuit board bonded with the LED bare chips; using the circuit board bonded with the LED bare chips to be directly assembled with a transparent panel or a diffuser panel set with the function of a panel to obtain a chip-bonded sign after a testing process.
Patent TW-I261298-B (TW)
Title: Composite optical destructive electrode for high contrast electroluminescent devices
Inventor: ZHU FURONG
IPC: G02B1/10
Filed: 2005-03-08
Granted: 2006-09-01
Abstract: The present invention in one embodiment introduces a composite optical destructive layer into the electroluminescent device which reduces the reflection of ambient light from the device. The composite optical destructive layer is advantageously made of materials already found in the manufacturing process of the electroluminescent device and also by manufacturing processes inherent in the manufacture of the device. More particularly, the composite optical destructive layer is made from a variant of a parent material used to form one of the electrodes of the electroluminescent device. The variant material differs from the parent material in that the variant material is oxygen deficient. This oxygen deficiency in the variant material causes the variant material to have a change in refractive index from that of the parent material. The composite optical destructive layer that is made from the variant material is then able to absorb incident ambient light as well as reflected ambient light from the electroluminescent device.
Patent TW-I281007-B (TW)
Title: Bicycle disc brake pad
Inventor: IWAI TORU
IPC: B62L1/10
Filed: 2005-03-25
Granted: 2007-05-11
Abstract: To minimize loss of disk rotor life while warning of friction member wear through sound in bicycle disk brake pads. The disk brake pad 76 is a pad in which a friction member 78 is joined to a back plate 77, wherein the friction member 78 comprises a friction sign part 60 and friction brake part 61 made of the same components, the friction sign part 60 has a laminated structure on the back plate 77 side, and the proportion of hard components in the components of the friction sign part 60 is higher than the proportion of hard components in the components of the friction brake part 61.
Patent TW-I283720-B (TW)
Title: Device of blinking for highly anti-pressure solar energy
Inventor: YE NIAN-SHIUAN
IPC: E01F9/04
Filed: 2005-03-29
Granted: 2007-07-11
Abstract: The invention concerns a kind of device of blinking for highly anti-pressure solar energy that includes a protection base, a chilled cat's eye button reflector, a solar energy electric control device and a light resource body. The protection base includes a first container and a second container having an up-opening, and the up-surface of the chilled cat's eye button reflector can be formed an arc-shaped convex be set in the second container of the protection base and extending out of said up-opening, furthermore the solar energy electric control device can be set in the first container of the protection base, by electrically connecting the light resource body to the solar energy electric control device, such that the light resource can be provided to the chilled cat's eye button reflector for a durable device of blinking for highly anti-pressure solar energy.
Patent TW-I257135-B (TW)
Title: Thermally enhanced three dimension package and method for manufacturing the same
Inventor: CHENG MING-HSIANG
IPC: H01L21/56
Filed: 2005-03-29
Granted: 2006-06-21
Abstract: A thermally enhanced three dimension (3D) package is disclosed, which includes a heat sink having an opening and a stiffener ring inside the opening. The stiffener ring has a first surface and a second surface. A first substrate of a first chip package is deposed inside the opening and secured to the first surface of the stiffener ring. A second substrate of a second chip package is secured to the second surface of the stiffener ring. The first substrate is connected to the second substrate through a plurality of solder balls. The heat generated in the first chip package and the second chip package is dissipated by the heat sink. The first chip package and the second chip package are fixed by the stiffener ring to eliminate a warpage of the first chip package and the second chip package. Accordingly, it can assure the electrical transmission of the product.
Patent TW-I285395-B (TW)
Title: Method of repairing flip chip package
Inventor: CHEN CHIH-HSING
IPC: H01L21/02
Filed: 2005-04-29
Granted: 2007-08-11
Abstract: A method of repairing a flip chip package includes following steps. First, the flip chip package including at least a chip and a substrate is provided. The chip has several metal bumps, and the substrate has several pads corresponding to the metal bumps. The first part of the metal bumps is welded with the corresponding pads, and the second part of the metal bumps is separated from the corresponding pads. Then, the flip chip package is soaked in a flux. Next, the flip chip package is reflowed, so as to weld the second parts of the metal bumps with the corresponding pads.
Patent TW-I259518-B (TW)
Title: Method for forming leadless semiconductor packages
Inventor: PARK SANG-BAE
IPC: H01L21/02
Filed: 2005-06-20
Granted: 2006-08-01
Abstract: The present invention includes providing a leadframe including a metal layer formed on an upper surface of the leadframe and a plurality of units in an array arrangement, in which each unit includes a die pad, a plurality of leads, and a plurality of outer dambars, adhering a die to the die pad, forming a plurality of conductive wires to electrically connect bond pads of the die with bond regions of the leads, forming an encapsulation covering the leadframe, forming a patterned photoresist layer on a lower surface of the leadframe to expose a plurality of interval regions and the outer dambars, performing an etching process to expose the metal layer located in the interval regions and the outer dambars, cutting off the metal layer located in the interval regions by a half cutting process, and performing a singulation process to singulate the units.
Patent TW-I277188-B (TW)
Title: Semiconductor package, its manufacturing process and semiconductor device
Inventor: INAO HISAHO
IPC: H01L27/14
Filed: 2005-07-19
Granted: 2007-03-21
Abstract: To provide a highly reliable semiconductor package by suppressing the falling of mold material on the inside of a dam bar, and also to provide its manufacturing process and a semiconductor device. The manufacturing process of a semiconductor package comprises a step of punching out a part of the lead side region 13c of a molding 13 and a dam bar 20c using a receiving table 30 and a punch 31. The receiving table 30 includes: an outer-side face at a position set back from the side face of the upper section 13a of molding as much as possible; and an inner-side face close to the side face of the lower section 13b of molding. Upper surface of the receiving table 30 has a width Wa narrower than the overhang portion of the upper section 13a of molding. Front end region Ra of the lead side region 13c located directly under the overhang portion of the upper section 13a of molding has an inclining surface Fa1 inclining internally downward.
Patent TW-I272189-B (TW)
Title: Method of fabricating through hole and nozzle plate of ink jet printhead device
Inventor: LEE CHEE-SHUEN
Filed: 2005-07-21
Granted: 2007-02-01
Abstract: A method of fabricating a through hole of an ink jet printhead device is disclosed, wherein the printhead device may be a printhead chip or a nozzle plate. In this disclosure, the method of fabricating a through hole of an ink jet printhead chip is to coat a surface of the ink jet printhead chip with a photosensitive material layer. An exposure process is performed to the photosensitive material layer for defining a pattern. A development process is then performed to the exposed photosensitive material layer for forming a photosensitive material pattern. Thereafter, the surface of the ink jet printhead chip coated with the photosensitive material pattern is etched to form a through hole by means of inductively coupled plasma and utilizing the photosensitive material pattern as a mask, wherein the angle between the surface opposite to the etched surface of the ink jet printhead chip and an inner surface of the through hole is an obtuse angle. The method of fabricating a through hole of a nozzle plate is the same as the abovementioned method.
Patent TW-I258242-B (TW)
Title: A metal-plate antenna integrated with a shielding metal case
Inventor: SU CHIH-MING
IPC: H01Q1/00
Filed: 2005-08-02
Granted: 2006-07-11
Abstract: The present invention is related to a metal-plate antenna integrated with a shielding metal case. The antenna comprises a ground plane, a shielding metal case with a rectangular notch electrically connected to the said ground plane, and a radiating patch comprising a feeding point placed in the said notch parallel to the said ground plane electrically connected to an edge of the said rectangular notch and surrounded by the said shielding metal case. The proposed invention is capable of providing a bandwidth for UMTS (1920 to 2170 MHz) operation, suitable for mobile phone applications.
Patent TW-I269603-B (TW)
Title: Method of using an improved capacitive microphone in a tactile manner and architecture used thereby
Inventor: JOU JIN-TSAI
IPC: H04R7/02
Filed: 2005-08-02
Granted: 2006-12-21
Abstract: The present invention proposes a plurality of methods and architectures of improving conventional capacitive microphones so that the sound signals may be captured by tactile means, thereby significantly decreasing the exterior noise and the effect caused by low frequency echo. The method of the present invention comprises a step for shortening the diameter of the permeable aperture on the casing of the microphone and decreasing the charge of the electrostatic film in the microphone, which may reduce the sensitivity of conventional capacitive microphones. The architecture of the present invention is implemented by covering a plastic film on the conventional capacitive microphones for sealing the penetration aperture on the casing of the conventional capacitive microphone, or drilling an extra penetration aperture or forming a buffering zone thereon. The method and the architecture aforementioned may also be used together with a filtering magnification means or element so as to filter out the low frequency noise and provide a gain progressively increased according to the frequency for the electric signals output by the microphone, thereby further producing a better frequency response.
Patent TW-I267225-B (TW)
Title: Method of sensing power of a fuel cell and the application thereof
Inventor: TUNG CHUN-CHIN
IPC: H01M8/04
Filed: 2005-08-24
Granted: 2006-11-21
Abstract: The present invention relates to a power sensing method of a fuel cell and the application thereof. The method of sensing power of a fuel cell includes the following steps. Initially, a fuel cell is provided and electrically connected to a main control circuit, which contains voltage/current determining means and storing means. A changing rate of a transient voltage is calculated. In a transient state where the voltage changes from an initial voltage to a stable voltage after the fuel cell starts to provide power to the load, voltage values of a first reference time and a second reference time are recorded and the main control circuit utilizes the voltage/current determining means to calculate the changing rate of the voltage with respect to the time. Then the changing rate of the transient voltage is checked. The main control circuit compares the changing rate of the transient voltage stored in the storing means with the relationship between the output voltage and the output current of the fuel cell in a specific operating temperature to obtain the stable voltage value and the stable current value of a steady state fuel cell. Whether the output power of the fuel cell satisfies a predetermined output value is checked. The main control circuit calculates the power of the steady state according to the stable voltage value and the stable current value obtained from the previous step and determines whether the output power of the fuel cell satisfies a predetermined output value.
Patent TW-I263487-B (TW)
Title: Wireless device for monitoring physiological parameters
Inventor: CHIEN CHAO-HENG
IPC: H04B1/38
Filed: 2005-10-14
Granted: 2006-10-11
Abstract: The invention relates to a wireless device for monitoring physiological parameters, especially to a wireless device for monitoring physiological parameters which device measuring physiological parameters of a person under test. The device includes sleeve-tube with an inner surface, the inner surface having at least a connecting element for fixing the sleeve-tube to the participant's shoulder and upper arm; an IC on the inner surface, including multiple sensor modules, a data processing module; and a wireless module and a power supply. The wireless device for monitoring physiological parameters of this invention may wirelessly transmit the physiological parameters of the person to a monitor far away, for medical treatment staff to efficiently monitor of a patients' condition and to perform proper treatment on time.
Patent TW-I289955-B (TW)
Title: Electrical power connector
Inventor: DAILY CHRISTOPHER
IPC: H01R13/46
Filed: 2005-12-13
Granted: 2007-11-11
Abstract: Electrical connectors can include thermally conductive material in regions proximate contacts residing therein to sink heat away from the contacts. The thermally-conductive materials can be provided in the housing structure of the connectors. The thermally-conductive material can also be provided as a thermally-conductive member distinct from the housing.
Patent TW-I278938-B (TW)
Title: Method for forming transistor of semiconductor device
Inventor: KIM JAE-SOO
IPC: H01L21/30
Filed: 2006-01-06
Granted: 2007-04-11
Abstract: A method for forming a transistor of a semiconductor device includes forming a spacer oxide film having a uniform thickness i at a high speed. The method includes forming a plurality of gate stacks on a semiconductor substrate; and forming a spacer oxide film on a plurality of the gate stacks by alternately supplying trimethyl aluminum in a gaseous state and tris-(tert-alkoxy)-silanol in a gaseous state to the semiconductor substrate.
Patent TW-I280937-B (TW)
Title: Automatic power on/off device for a machine frame and trolleys of a LCD aging chamber
Inventor: CHEN LIANG-JAU
IPC: B65G43/10
Filed: 2006-01-16
Granted: 2007-05-11
Abstract: An automatic power on/off device for a machine frame and trolleys of a LCD aging chamber comprises: a plurality of trolleys, a machine frame, wherein the respective trolleys are provided at the back thereof with a support plate having at least a male plug and a retaining member, and the front end of said at least male plug is coupled to a bus power member. Furthermore, another support plate is arranged in the machine frame for mounting at least a female socket and a connection member, wherein the back of said at least female socket is connected to a power line, so as to assemble the respective male plugs of trolleys and the respective female sockets of machine frame together in an awl-shaped fitting manner, and by using the connection member of machine frame, the retaining members of trolleys can be positioned, respectively, thereby enabling the respective male plugs of the support plate of trolleys to couple automatically to the respective female sockets of machine frame, in such a manner that the power on/off of the trolleys and the machine frame can be achieved. Further, as one trolley operates for a predetermined process in the machine frame, other trolleys can advancedly have a pre-processing at different work stations and load or unload materials, so that the trolleys can have a circulating interchange with one another, thus enhancing the production efficiency of LCD aging chamber.
Patent TW-I406498-B (TW)
Title: Piezoelectric vibrator, surface-mounting type piezoelectric vibrator, oscillator, electronic apparatus and wave clock
IPC: H03B5/32
Filed: 2006-02-07
Granted: 2013-08-21
Abstract: A piezoelectric vibrator has an airtight terminal including leads each having a plane portion. A vibrating piece includes a first part having a preselected thickness and a second part having a thickness smaller than the preselected thickness. The plane portion of each of the leads is connected to the second part of the vibrating piece. A case covers a periphery of the vibrating piece and is sealed on an outer circumference of the airtight terminal.
Patent TW-I282256-B (TW)
Title: Anti-reversely-bending low-profile resilient plate having soldering stabilization section
Inventor: CHEN WEI-CHENG
IPC: H05K1/02
Filed: 2006-03-01
Granted: 2007-06-01
Abstract: The present invention provides an anti-reversely-bending low-profile resilient plate that has a soldering stabilization section. The resilient plate is soldered to a circuit board by means of surface mounting technology and has a construction comprising: a soldering section soldered to the circuit board, a bent section formed by bending and extending in an opposite direction from one end of the soldering section, a resilient arm extending from an end of the bent section that is opposite to the portion extending from the soldering section and forms an obtuse angle with the bent section; and a soldering stabilization section extending from one of two opposite side edges of the bent section toward the soldering section to be soldered to the circuit board with the soldering section.