Patent GB-317551-A (GB)
Title: Improvements in and connected with machines for making cup wafers, wafer biscuits and the like
IPC: A21B5/02
Filed: 1928-05-25
Abstract: 317,551. Bates, J. H. May 25, 1928. Making wafer biscuits.-A machine for making and trimming cup wafers and the like is provided with a reciprocating tray which receives the wafers from the cooking portion of the machine and positions them under a trimming device which reciprocates at right angles to the tray. As shown in Fig. 1, the cup wafers are removed from the cooking portion of the machine by swinging arms 2 and fingers which engage the wafers as described in Specification 264,839, and are deposited in holes in a tray 4 which is reciprocated along guides 5. The tray 4 is positioned, at one end of its stroke, beneath the tubular trimming cutters 10 which pass through holes in a plate 61 whereby the cutters are kept clean. The cutters are reciprocated by connecting rods 17 on a crank 16, the shaft 15 of which is driven from the shaft 59 through bevels 60 and a spring actuated segmental key clutch 14 the tappet 31 of which contacts at times with the arm 32 of a bell crank lever pivoted at 33. The tray 4 is reciprocated by a bell crank 20 connected to the tray by a link 22 and oscillated by a rod 18 which is pivoted on the pin 19 which connects the rods 17 to the cutter frame. The operation of the clutch 14, and consequently of the trimming mechanism, is controlled by a tappet 40 on a cam 41 on the cooking part of the machine. The tappet 40 swings a lever 38 pivoted at 39, and through the compound rod 36, 37 and bell crank 34, removes the arm 32 from the tappet 31 and allows the spring actuating the key 30 to render the clutch operative. The tray 4 then moves to position the wafers beneath the cutters 10 which are moved down to effect the trimming. A spring on the lever 32 returns the lever into the path of the tappet and the key 30 is again rendered inoperative. The tray 4 contacts at each end of its stroke with downturned ends 8 of sliding bars 7 which are connected to a pivoted scraper 9 which is thus swung down, as the tray is positioned under the cutters, to remove debris from the tray on its return stroke. The trimmed wafers drop through the openings in the tray 4 on to a discharge shoot 24. The lever 20 has an upper part 20<x> pivoted to the lever at 21<x> and controlled by a spring 58. The tray is arrested by the parts 8 of the rods 7 before the lever 20 finishes its swing, so that the spring 58 is tensioned and holds the tray in position. The wafer removing and depositing means 2 are operated by a clutch 43 similar to the clutch 14. The segmental key 44 has a tappet 45 which is controlled by a bell crank 46 pivoted at 47 and connected to a rod 48 having a downturned hooked portion at its free end which is pulled by a tappet 49 on a cam 50 on the cooking part of the machine. When the rod 48 is pulled, the crank 46 is removed from the tappet 45 and the key 44 becomes operative and the wafer removing means 2 also operate. The lever 51 is used for stopping the removing and trimming means. When the lever 51 is pulled, the rod 53 swings a lever 54<x> having a lever 55 on its shaft. The lever 55 is connected by a chain 56 to the rod 48, so that by pulling the lever 51 the rod 48 is raised out of the path of the tappet 49 and the crank 46 retains the key 44 inoperative. At the same time, the rod 54 is raised and the parts of the compound rod 36. 37 are raised into angular relationship and the clutch 14 is thrown out of action.