Patent SG-11201909469W-A (SG)
Title: Chemical-mechanical processing slurry and methods
Inventor: TIAN LU
IPC: C09K3/14
Filed: 2018-04-12
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 18 October 2018 (18.10.2018) W I PO I PCT omit VIII °nolo mu 010 IH voimiflo oimIE (10) International Publication Number WO 2018/191454 Al (51) International Patent Classification: CO9G 1/02 (2006.01) HOlL 21/306 (2006.01) C09K 3/14 (2006.01) (21) International Application Number: PCT/US2018/027234 (22) International Filing Date: 12 April 2018 (12.04.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/485,441 14 April 2017 (14.04.2017) US (71) Applicant: CABOT MICROELECTRONICS CORPO- RATION [US/US]; 870 North Commons Drive, Aurora, Illinois 60504 (US). (72) Inventors: TIAN, Lu; Cabot Microelectronics Corpora- tion, 870 North Commons Drive, Aurora, Illinois 60504 (US). ZHANG, Ke; Cabot Microelectronics Corporation, 870 North Commons Drive, Aurora, Illinois 60504 (US). HAERLE, Andrew; Cabot Microelectronics Corporation, 870 North Commons Drive, Aurora, Illinois 60504 (US). LAU, Hon Wu; Cabot Microelectronics Corporation, 870 North Commons Drive, Aurora, Illinois 60504 (US). (74) Agent: OMHOLT, Thomas; Cabot Microelectronics Cor- poration, 870 North Commons Drive, Aurora, Illinois 60504 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, (54) Title: CHEMICAL-MECHANICAL PROCESSING SLURRY AND METHODS ME 100nm 5/912016 X 30,000 2.00kV SEI GB_HIGH WD 7.8mm 13:49:52 cr Figure 2 (57) : Described are chemical mechanical processing (CMP) compositions and related methods, including compositions and © methods for polishing nickel-containing substrate surfaces such as nickel phosphorus (NiP) surfaces for hard disk applications, wherein f'1 the compositions contain highly irregular-shaped fused silica abrasive particles. o [Continued on next page] WO 2018/191454 Al MIDEDIMOMOIDIONDEIDIOMOHHOIDEINDOHEMOVOIMIE MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: as to applicant's entitlement to apply for and be granted a patent (Rule 4.17(11)) Published: with international search report (Art. 21(3)) before the expiration of the time limit for amending the claims and to be republished in the event of receipt of amendments (Rule 48.2(h))