baber/WOPTO huggingface dataset:
Patent TW-200827158-A (TW)
Title: Method and apparatus for scrim embedment into wet processed panels
Inventor: MILLER DAVID P
IPC: B32B13/02
Filed: 2007-09-20
Abstract: A method of producing a paperless gypsum/fiber board from a mixture including reinforcing material particles, calcined gypsum and water. A headbox feeds the mixture into a panel forming area (forming pond) over the upper surface of a continuous forming fabric to form a panel mat. Also, a reinforcing mesh is fed over a transverse member, located over a portion of the forming fabric, and into the forming pond to embed the mesh in the mixture. At least a portion of a downstream end of the transverse member is under a downstream portion of the headbox or downstream of the headbox. Then the panel mat is pressed, the calcined gypsum of the pressed panel mat is rehydrated, and the resulting board is dried.
Patent TW-200917614-A (TW)
Title: Grid-tied power system of HCPV
Inventor: YAN ZI-ZHONG
IPC: H02J5/00
Filed: 2007-10-04
Abstract: Disclosed is a grid-tied power system of HCPV, which has a total volume of power generation of 100 kWp. The invention is able to supply power and reduce electricity expenses and has an apparatus that is capable of delivering power in a reverse direction to the power station. Upon adding the HCPV power generating apparatus into the electricity network system of the power station, this invention is found to be capable of retaining the current volume of the power station. Moreover, the trend of current volume is found to be moderate; therefore, the system will not encounter problems such as under voltage, over voltage, or voltage overload. In addition, by means of DC/AC inverter used in the present invention, an automatic break from the city power is activated upon encountering a failure or breakdown of the city power so that the power supply can be interrupted. Hence, the present invention is able to prevent island effect from occurring in order to help the domestic solar power industry in further development.
Patent TW-200916008-A (TW)
Title: Fastening device of helmet visor lens
Inventor: Li de-long
IPC: A42B1/06
Filed: 2007-10-08
Abstract: The present invention provides a kind of fastening device of helmet visor lens, which includes: a helmet shell, with its both sides having one concave respectively, and inner of which has two spiral holes and two through holes with a slot on the outside of the concave; two lens association seats relying on the bolts to be fixed inside the concave of the helmet shell, while its inside end has a shaft stick and passes through the hole of helmet shell; a slide seat, fixed in the helmet shell slot and includes an elastic slot seat which has upper and lower locating holes on the end of slide seat; a combination seat, placed in the interior of the helmet shell which has an engage hole and a pillar, while the pillar hole is aligned with a through hole of helmet shell to provide the shaft stick for passing through; a knob, which is set in the outside of helmet shell with a rod inside to use the rod pass through the elastic slot and fix the end of the association seat; a torsion spring which is disposed on the end of the combination seat and the other end is fixed on the slide seat; and a visor lens, disposed inside the helmet shell, with the both sides having suiting holes respectively and providing the shaft stick for insertion. One side of setting hole has a penetrating hole relying on a spiral part connecting with the combination seat, and the penetrate hole can set the position straight to the other hole of helmet. Through turning, the knob can make the rod slip along the elastic slot and set the positions straight in upper and lower setting holes and through the combination seat to drive the visor lens to shift up and down, enabling the visor lens to draw back or stretch out; and the other through hole of the helmet shell can set the penetrate hole with position straight to the visor lens, and can assemble and disassemble of bolts part which can assemble or separate the visor lens with combination seat, and make the visor lens of the suit hole connect to or separate from lens combination seat and shaft stick, thereby achieving a quick and convenient effect for assembling and disassembling.
Patent TW-200917220-A (TW)
Title: Light source driving circuit for back light module
Inventor: LAN YU-CHIN
IPC: G09G3/36
Filed: 2007-10-15
Abstract: A light source driving circuit for a back light module is provided, wherein each driving unit includes a reference resistor, a transistor, a bias resistor and a shunt regulator, wherein the transistor is coupled between a LEDs string and the reference resistor, and the bias resistor is coupled between an operation voltage and a control terminal of the transistor. The shunt regulator is coupled between the control terminal of the transistor and a common terminal, and a reference pin of the regulator is coupled to a common node between the reference resistor and the transistor.
Patent TW-200829089-A (TW)
Title: Quartz guard ring
Inventor: LARSON DEAN J
IPC: H05H1/46
Filed: 2007-10-16
Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper electrode, a backing member attachable to an upper surface of the upper electrode, and an outer ring. The outer ring surrounds an outer surface of the backing member and is located above the upper surface of the upper electrode.
Patent TW-200835026-A (TW)
Title: Lithium ion electrochemical cells
Inventor: GORDON-SMITH TOBIAS
IPC: H01M4/134
Filed: 2007-10-24
Abstract: A lithium ion electrochemical cell comprises a positive electrode, a negative electrode and a non-aqueous electrolyte. The negative electrode comprises a powder of a mesoporous material capable of froming a lithium insertion alloy in contact with a support, the powder being chemically deposited from a liquid crystal phase.
Patent TW-200827793-A (TW)
Title: Method of manufacturing laminate of optical film
Inventor: KUMAGAI DAISUKE
IPC: G02B5/30
Filed: 2007-11-02
Abstract: A method of manufacturing an optical film laminate, in which a part of a first optical film, which film having a rectangular shape and having an optical orientation axis, is laminated on a part of a second film, which film having a rectangular shape and having an optical orientation axis, in such a manner to orient both the orientation axes at a given angle to each other, thereby producing an intermediate laminate product, and the intermediate laminate product is cut into optical film laminates each having the first and second optical films laminated together, said method being characterized in that it comprises: cutting any one of the first optical film and the second optical film along a cutting line that is parallel to or concordant with any one of the sides of a contour of the optical film laminate, thereby producing a cut piece; and laminating the cut piece onto the opposite optical film, thereby producing the intermediate laminate product.
Patent TW-200901505-A (TW)
Title: Light emitting device and method for manufacturing the same
Inventor: FUSHIMI HIROSHI
IPC: H01L33/62
Filed: 2007-11-08
Abstract: A light emitting device wherein an upper and lower electrode type light emitting diode is used as a light source, a large current is permitted to flow to the light emitting diode, and dissipation of heat generated at the time of such current flow or shrinkage of a metal member due to thermal stress caused by such heat are taken into account. A method for manufacturing such light emitting device is also provided. The light emitting device is composed of at least a package having a plurality of package electrodes separated from each other; the upper and lower electrode type light emitting diode, which has a light emitting layer between a p-type semiconductor layer and an n-type semiconductor layer, an upper portion electrode on the uppermost layer and a lower electrode on the lowermost layer by bonding it on one of the package electrode; and a conductive connecting member for connecting the upper electrode of the light emitting diode with the other package electrode. Bonding between the one package electrode with the lower electrode, bonding between the upper electrode with the conductive connecting member and bonding between the conductive connecting member with the other package electrode are performed by using a solder.
Patent TW-200828021-A (TW)
Title: Embedded memory and multi-media accelerator and method of operating same
Inventor: PATEL MUKESH K
IPC: G06F13/14
Filed: 2007-11-19
Abstract: A memory device incorporating a multi-media accelerator and an embedded memory, wherein the memory device operates as a standard stand-alone memory when the multi-media accelerator is not enabled. The memory device includes a memory interface that is compatible with multiple types of memory controllers, thereby enabling multiple types of external devices to interact with the multi-media accelerator and access the embedded memory. The embedded memory can be shared between external devices and multi-media devices.
Patent TW-200834811-A (TW)
Title: Method of manufacturing semiconductor device
Inventor: KANEMOTO KEI
IPC: H01L21/336
Filed: 2007-11-29
Abstract: A method of manufacturing a semiconductor device includes the steps of forming an oxide film on a surface layer section of an entire surface of a semiconductor substrate, forming a window section by selectively removing the oxide film from an active surface side of the semiconductor substrate, the window section exposing a substrate semiconductor layer forming the semiconductor substrate, forming a first semiconductor layer having an etching selection ratio higher than an etching selection ratio of the substrate semiconductor layer so as to cover the substrate semiconductor layer exposed in the window section, forming a second semiconductor layer having an etching selection ratio higher than the etching selection ratio of the first semiconductor layer so as to cover the first semiconductor layer, forming a pair of support member holes for exposing the substrate semiconductor layer opened by removing the second semiconductor layer and the first semiconductor layer inside a pair of areas positioned on both sides of an element area section adjacently to the element area section formed using a part of the second semiconductor layer, forming a support member on the active surface side of the semiconductor substrate so as to cover the element area section and to fill at least a part of each of the support member holes, forming an end-exposed surface exposing at least a part of an end of the first semiconductor layer below the support member by etching the second semiconductor layer and the first semiconductor layer using the support member as a mask, forming a substrate semiconductor layer exposed surface by removing at least a part of the oxide film to expose the substrate semiconductor layer after forming the end-exposed surface, removing the first semiconductor layer below the support member by wet etching, filling a hollow section obtained by the wet etching with an oxide film using thermal oxidation, exposing the second semiconductor layer by removing the support member from at least above the element area section, and providing a semiconductor device to the second semiconductor layer.
Patent TW-200922712-A (TW)
Title: Die transmission mechanism for computer press machine
Inventor: Lin xi-wen
IPC: B21D28/20
Filed: 2007-11-29
Abstract: The present invention generally provides a die transmission mechanism for a computer press machine, which generally includes: an upper transmission device, which uses a driving motor to provide power for making an upper transmission module and an upper rotation module rotating simultaneously; a lower transmission device, which uses a driving motor to provide power for making a lower transmission module and a lower rotation module rotating simultaneously; a lifting module, which is installed at one side of each of the upper and lower rotation modules to drive each of the upper and lower rotation modules to effectively displace up and down in a leverage manner; and a guiding sleeve device and a die seat device, which are respectively mounted below the upper and lower transmission modules for receiving the transmission of the upper and lower transmission modules to simultaneously rotate therewith. After the lifting modules of the upper and lower sides respectively carry out upwards and downward movement to st the position of the guiding sleeve device and the die seat device, the upper and lower transmission modules respectively drives the upper and lower rotation modules and the guiding sleeve device and the die seat device to effect synchronous rotation so as to allow hole punching operations in various directions to be carried out on a plate.
Patent TW-200930213-A (TW)
Title: Housing of foldable electronic device
Inventor: TANG ZI-MING
IPC: H05K5/00
Filed: 2007-12-31
Abstract: The present invention relates to a housing of foldable electronic device. The housing includes a first cover and a second cover. The first cover has a first latching portion. The second cover has a fixing portion, a handle, a latching member connecting to the handle, and an elastic member connecting to the latching member. The latching member has a second latching portion configured for engaging with the first latching portion. The handle is able to drive the latching member rotate relative to a central axis of the fixing portion along a first direction. The elastic member is able to drive the latching member rotate relative to a central axis of the fixing portion along a second direction opposite to the first direction.
Patent TW-200932075-A (TW)
Title: Method for surface-mounting component(s) on a flexible printed circuit
Inventor: SU WEN-YANN
IPC: H05K3/00
Filed: 2008-01-08
Abstract: Disclosed is a method for surface-mounting component(s) on a flexible printed circuit (FPC). The FPC has a plurality of bonding pads and a plurality of terminals coated with a low-temperature soldering layer by electroplating. By reflowing, at least one SMD (Surface Mount Device) is disposed on the bonding pads of the FPC. Before reflowing, a heat-absorbent depressor is placed on the FPC, which pressing region includes the terminals except the SMD and the bonding pads of the FPC. By means of the placement of the heat-absorbent depressor, the reflowing peak temperature of the terminals is lower than the one of the bonding pads when reflowing. Accordingly, the low-temperature soldering layer will not be melted to keep a uniform film thickness after reflowing.
Patent TW-200931910-A (TW)
Title: A NIC and method of booting of the remote device
Inventor: LIU WEI
IPC: H04L29/06
Filed: 2008-01-09
Abstract: A NIC and method of booting of the remote device, the NIC can connect to the server via internet. The client receives a plurality of booting image data that boot the client. The connection device comprise of a virtual disk control module, a network storage device, a network communication module. The virtual disk control module utilizes to create a virtual disk and connect to a remote disk of the server. The network storage device utilizes to receive a booting data form the server. The network communication module utilizes to build the connection to the server. When the client booting, the NIC can create the virtual disk for booting.
Patent TW-200931598-A (TW)
Title: Structure and manufacturing method of ultra-thin body transistor and dynamic random access memory with ultra-thin body transistor
Inventor: CHEN PAULO
IPC: H01L27/108
Filed: 2008-01-10
Abstract: Structures and manufacturing methods of ultra-thin body transistor and DRAM with ultra-thin body transistor are disclosed. The DRAM includes a plurality of ultra-thin body transistor and a deep buried connection area. Each transistor has a drain area, a source area and a gate area, which forms in the active area of the substrate. The drain area and the source area are formed along a side of the gate area, and the source area is over the drain area. The source area is in a halo implant area. The drain area of each transistor is connected together by the deep buried connection area, and forms a bit line.
Patent TW-200931392-A (TW)
Title: Audio playback system
Inventor: LIU HSIANG-CHUNG
IPC: G06F3/16
Filed: 2008-01-14
Abstract: This invention discloses an audio playback system which is characterized in that a sensing unit is used to track an azimuth of a receiving end, and a control unit controls sound beam output direction of a sound beam output unit according to the azimuth of the receiving end. Therefore, at the receiving end, no headset is required to listen to the sound, and other people will not be disturbed.
Patent TW-200918388-A (TW)
Title: Scooter type vehicle
Inventor: YAMAMOTO YOSHIAKI
IPC: B62J17/06
Filed: 2008-01-24
Abstract: To provide a scooter type vehicle, in which a so-called smart key system is further improved in convenience. The scooter type vehicle comprises an authentication circuit 52, which communicates with a card key 51 to authenticate a legal owner, and a start switch 53, which starts up the authentication circuit 52. A cover 4 includes an upright wall surface SF extending upwardly of a footboard 11 and an upper top surface TF extending toward the front of a vehicle from an upper edge of the upright wall surface SF. The start switch 53 is arranged on the upper top surface TF.
Patent TW-200936797-A (TW)
Title: Carbon nanotube film structure and method for making the same
Inventor: WANG XUE-SHEN
IPC: C01B31/02
Filed: 2008-02-29
Abstract: The present invention relates to a carbon nanotube film structure. The carbon nanotube film structure includes at least one carbon nanotube film. The carbon nanotube film includes a number of super-long carbon nanotubes. The super-long carbon nanotubes are parallel to the surface of the carbon nanotube film. The super-long carbon nanotubes are parallel to each other. The present invention also relates to a method for making the above-described carbon nanotube film structure.
Patent TW-200939560-A (TW)
Title: An antenna having multiple dielectric material
Inventor: FANG CHIEN-HSING
IPC: H01Q1/38
Filed: 2008-03-05
Abstract: An antenna having multiple dielectric materials is provided. The substrate of the antenna comprises a frame and at least one dielectric material unit. The frame has plural hollow spatial units. Each dielectric material unit is embedded into one of the spatial units. Based on the antenna circuit, a variety of dielectric material units are properly embedded into the spatial units so as to control the dielectric property of the antenna substrate. Therefore, the antenna is able to provide the same frequency response as antennas using a single dielectric material, but with smaller size. The bandwidth design for the antenna is therefore more flexible.
Patent TW-200939688-A (TW)
Title: For making friends in internet and a method for the same
Inventor: CHI HAN-YA
IPC: H04L12/16
Filed: 2008-03-10
Abstract: The present invention relates to a system for making friends in internet and a method for the same. The friends-making system in internet will hold a matching party in internet at a certain time aperiodically or termly, and the men and women members who take part in the party must conform to the predetermined conditions set by the matching party. The making-friends system in internet will register the members who take part in the party and conform to the conditions. When the time to make friends is coming, the members can enter the making-friends system in internet by wireless devices or wire devices, and then they can chat and communicate with each other by video in internet. After this time is over, the making-friends system will replace the present member with the next member, and such process will be repeated until all the members experience the chat. When the party is finished, the member can choose the right person, and then the making-friends system will pick out the members who selected each other. Finally, the matching module informs the members. At this time, both sides of the members can get their individual information by the making-friends system in internet or can communicate with each other further by writing, speaking, or video, thus they can communicate with each other well.
Patent TW-200914721-A (TW)
Title: Engine
Inventor: MINE YUTAKA
IPC: F02F1/10
Filed: 2008-03-21
Abstract: To downsize an engine. In a water-cooled, one-cylinder engine formed with a water jacket 21 along the whole circumference between a cylinder bore wall 27 and a cylinder body outer wall 28, a bolt through-hole 24 for inserting a through bolt 5 which couples a cylinder body 3 with a cylinder head 4 is formed in the cylinder body outer wall 28. Parts of areas around the bolt through-holes 24 are extruded into a water jacket 21 and make projections 32A to 32D. Areas on the cylinder bore wall 27 that face the projections 32A to 32D are cut in an axial direction to make thin wall portions 33A to 33D. Thereby, it is possible to downsize an engine without lowering the engine capacity.
Patent TW-200941005-A (TW)
Title: Electrical testing device for USB ports
Inventor: LEI TAO
IPC: G06F11/28
Filed: 2008-03-21
Abstract: An electrical testing device for USB ports is provided. The electrical testing device includes a current detection unit, a voltage detection unit, and a current control unit. The electrical testing device is electrically connected between a USB port to be tested and a load device. The current detection unit and the voltage detection unit detect output current and output voltage of the USB port to be tested respectively. The current control unit controls the magnitude of the output current. Accordingly, the electrical testing device enables a hardware testing environment in which the power-supplying capacity of USB ports is tested.
Patent TW-200941857-A (TW)
Title: Connector
Inventor: ZHANG JACK
Filed: 2008-03-31
Abstract: The invention discloses a connector including a body and a circuit board. The body includes an accommodating space and a housing. The circuit board is disposed in the accommodating space. There is a grounding circuit area is formed on part of the circuit board. Part of the circuit board extrudes out of the housing. The housing is electrically connected to the grounding circuit area.
Patent TW-200943661-A (TW)
Title: Embedded communication equipment enclosure
Inventor: XU ZHI-YONG
IPC: H02G3/08
Filed: 2008-04-03
Abstract: This invention relates to an embedded communication equipment enclosure for housing and supporting communication equipment and communication cables, comprising: an enclosure body; cable connecting member provided within said enclosure body to connect communication cables, where an input cable from the exterior of the enclosure body is connected via the cable connecting member to the distribution cables to be brought out of the enclosure body; and a first door, which is connected with the enclosure body for opening and closing the front part of the enclosure body, said first door comprising a second door embedded therein used for checking the cable connecting member; wherein said cable connecting member is arranged to correspond to said second door in such a manner that the cable connecting member is exposed to outside when the second door is opened. With the embedded communication equipment enclosure, a two-stage operating interface is achieved, so that communication devices and cables housed in the embedded communication enclosure will not be undesirably influenced during the frequent jump-wiring or maintenance.