baber/WOPTO huggingface dataset:
Patent JP-H10190304-A (JP)
Title: Dielectric filter
Inventor: KITAMUKAI RYUJI
IPC: H01P1/20
Filed: 1996-12-27
Abstract: PROBLEM TO BE SOLVED: To easily connect a conductor pattern for an inductor. SOLUTION: This filter obtains an LC parallel resonance circuit by the inductance and inter-line capacity of the conductor pattern for the inductor formed on the front and back surfaces of a dielectric substrate 10. In this case, the end parts of the circulating conductor patterns 11, 12, 13 and 14 on the front and back surfaces of the dielectric substrate 10 of the filter are pulled out to the end face of the substrate 10 and connected by the conductor pattern formed on the end face.
Patent JP-H05177525-A (JP)
Title: Work holding device
Inventor: TAKAHASHI MITSUAKI
IPC: B24B13/00
Filed: 1991-12-27
Abstract: PURPOSE:To provide applicability to a versatile processing machine by furnishing a function to rotate a work being held. CONSTITUTION:The stator 105 of an ultrasonic motor 107 is fixed in a work supporting shaft 103 which holds a work 101. A rotor 104 is installed rotatably within the work supporting shaft 103, and the rotor 106 of the motor 107 is abutted on the stator 105 by the rotor 104. A supporting member 102 on which the work 101 is loaded, is mounted on the rotor 104, and processing is conducted. According to this constitution where the work 101 can be rotated forcedly by the ultrasonic motor 107 in the work supporting shaft 103, it is applicable to a versatile processing machine.
Patent JP-H06197019-A (JP)
Title: Digital oscilloscope
Inventor: TAWARA AKIHIRO
IPC: H03M1/12
Filed: 1992-12-25
Abstract: PURPOSE:To facilitate broad band processing by dividing a signal into a signal system ADD-converting a DC and low frequency component and a signal system ADD-converting a high frequency component and adding digitally converted data. CONSTITUTION:The input signal is separated into an AC signal system passing through a high pass filter 13 and requiring a broad band and a DC signal system exclusively for a DC and a low frequency signal passing through a low pass filter 14. Thus, AC coupling amplifiers are enough for amplifiers 3, 4, 10. An AC signal sampled by a sample-and-hold circuit 5 is amplified by an amplifier 6 and converted into digital data by an A/D converter 7 and the data are stored in a waveform memory 8 on one hand, and the DC signal is ADD-converted by an A/D converter 16 and the result is fed in a waveform memory 17. The A/D conversion data in the DC system are interpolated via an interpolation device 18 and the result is added digitally and transferred to a display memory and displayed as a waveform. A trigger signal path is formed similarly and the AC signal and the DC signal are added analogically at the input of a trigger comparator 11.
Patent JP-H06204352-A (JP)
Title: Semiconductor ceramic package board and lid
Inventor: KIMURA YUKIHIRO
IPC: H01L23/10
Filed: 1992-12-25
Abstract: PURPOSE:To provide a package base and a lid which are unlimited in shape, wherein a package is relaxed in thermal stress caused by thermal expansion difference between the base and the lid when the package is sealed up by soldering, a meniscus failure caused by an improper amount of solder is eliminated, and troubles such as imperfect airtightness, cracks, and the like are eliminated. CONSTITUTION:A ring-shaped metallized layer 3 is provided onto the upside of a package base 1, and a ring-shaped metal projection 5 smaller in width than the metallized layer 3 is provided onto the upside of the metallized layer 3. Furthermore, the package base 1 is formed of material such as ceramic low in thermal expansion, and the metal projection 5 may be formed of material such as copper. Conversely, a similar metal projection may be provided to a package lid.
Patent JP-2000234383-A (JP)
Title: Column-beam junction and h-steel for column
Inventor: KANEKO ETSUZO
IPC: E04B1/30
Filed: 1999-12-17
Abstract: PROBLEM TO BE SOLVED: To provide a structure of a column-beam junction capable of sharply simplifying the structure of the junction, easy to construct, clear dynamically and having high reliability and to provide an H-steel for a column used for the column-beam junction. SOLUTION: An H-steel having the relation between the thickness t1 of a web 1b and the thickness t2 of a flange 1a as 1.1<=(t1/t2)<=2.0 is used for a column steel frame 1 made of a steel frame or steel encased reinforced concrete. The end section of a steel frame beam 2 on the strong axis side is directly connected to the flange 1a of the column steel frame 1 by welding like before. The thickness of the web 1b of the column steel frame 1 is set sufficiently thick, thus the end section of a steel frame beam 3 on the weak axis side is directly connected to the web 1b of the column steel frame 1 by welding.
Patent JP-H05183747-A (JP)
Title: Picture processor
Inventor: TAMURA YUTAKA
IPC: H04N1/409
Filed: 1991-12-27
Abstract: PURPOSE:To prevent a line break phenomenon from occurring at the time of reproducing an original picture by dots. CONSTITUTION:The RGB signal of the original picture 2 is contour-emphasized in USM circuit 10 and inputted to a dot signal generating circuit 30 and an edge signal generating circuit 40. The dot signal generating circuit 30 makes picture signals Y to Bk-IMA into dots by the timing of a clock signal CL1 and outputs dot signals DOT 1-10 to a synthesizing circuit 11 in accordance with a first output start signal ENST. But, output start time is delayed for time being necessary for processing dot-conversion from time when the signal ENST is received. In the meanwhile, the edge signal generating circuit 40 generates contour signals BE and WE from the picture signals by the timing of the clock signal CL2 whose frequency is higher than that of the signal CL1 and outputs the contour signals in accordance with the second output start signal ENSTD which is delayed for the above time as against the signal ENST. The dot signals DOT 1-10 and the contour signals BE and WE are synthesized in the synthesizing circuit 11 so that exposure signals EX 1-10 are generated.
Patent JP-H10171483-A (JP)
Title: Karaoke device enabling designation of key
Inventor: YOSHIOKA TERUO
IPC: G10H1/44
Filed: 1996-12-13
Abstract: PROBLEM TO BE SOLVED: To enable singing in the proper key from the beginning by designating a key number as well when designating any piece of music through a remote controller. SOLUTION: Operation is enabled by both a main body and a remote controller and in the waiting state of central sound at 6 deg. degrees, at this device, a customer inputs his own key number continuously to the designation of a piece of music as conventional. The music play of back is started in the key of customer from the beginning. Besides, it is also available to provide a microphone with a key up/down operate switch for further easily using it. In the case of real key designation, two digits exceeding the number of digits required for designating any piece of music are allocated to a key designate number or after any piece of music is designated, the key designation is identified by another code such as # or *.  Concerning the part where the customer does not remember its key number, it is judged and corrected by the part of introduction in the piece of music so that the device is used by conventional operation.
Patent JP-H11196004-A (JP)
Title: Encoder, decoder, transmission device, reception device, telephone set and transmission and reception system
Inventor: NAGUMO AKIYOSHI
IPC: H04M1/68
Filed: 1997-12-26
Abstract: PROBLEM TO BE SOLVED: To secure secrecy and flexibility of communication and also to transmit probable information. SOLUTION: An encoding part 2 of a transmitting part 1 generates and transmits a two-dimensional table (search space), and a decoding part 8 of a receiving part 5 searches the two-dimensional table for acquiring transmitting information. Thus, it becomes possible to secure flexibility for search algorithm of the receiving side, to use the hardware suitable to a terminal, and also to use probable information.
Patent JP-H07237822-A (JP)
Title: Yarn end knotting device
Inventor: KAIDO SEIJI
IPC: B65H69/04
Filed: 1992-12-28
Abstract: PURPOSE:To automatically and efficiently make a knot at the end of a yarn by combining devices to fix the end of the yarn, to hold the yarn at the base side, to entangle the middle of the yarn in a looped manner and to pull off the looped portion of the yarn. CONSTITUTION:To make a knot at the end of a yarn by using a yarn end knotting device 1, the end of the yarn is previously held in the holddown tool 16 of a yarn end fixing device 2 and the base of the yarn is passed under the billed portion at the looper 40 of a looping device 4. First, a yarn end push plate 11 is lowered to push the end of the yarn against a yarn end placement table 10 and a balance lever 30 is inclined to shift a holding device 3 upward. That is, the middle of the yarn is bent along the billed portion. Second, the looper 40 is turned one round to entangle the yarn around the billed portion in a looped manner. Finally, an air chuck 50 for a pull-off device 5 is moved forward, locks 50a are closed at the most forward end to clamp the arched portion of the yarn and then the air chuck 50 is moved backward to pull off the looped portion to form a knot.
Patent JP-H06204176-A (JP)
Title: Controlling method for plasma processor
Inventor: YOSHIZAKO YUJI
IPC: H01L21/3065
Filed: 1992-12-28
Abstract: PURPOSE:To minimize the capacity of a microwave generation source by shifting stubs by the amount that it gets in resonance condition on the side of a plasma generation chamber from a microwave automatic matching device so as to start up plasma, and starting automatic matching operation after the plasma is started up. CONSTITUTION:In the condition that microwaves are outputted from a microwave generation source 2, the quantity of inserted stubs in an impedance converter 2 is changed variously Thereupon, the microwaves having returned, reflecting in a plasma generation chamber (load) 7, reflects at the place of a stub again, and advances to load side. For this reason, if the quantity of inserted stubs is set to a certain value, the section between a microwave automatic matching device 6 and load 7 gets in resonance condition or condition close to it, that is, the electric field inside the plasma generation chamber 7 becomes strong. Hereby, the impedance between the microwave generation source 2 and load can be matched. Moreover, plasma can be started up easily.
Patent JP-H06204113-A (JP)
Title: Projection aligner and manufacture of semiconductor device using same
Inventor: SHIOZAWA TAKANAGA
IPC: G03F7/20
Filed: 1992-12-28
Abstract: PURPOSE:To obtain a projection aligner, in which the quantity of exposing light onto a wafer surface is controlled appropriately and a semiconductor device with high degree of accumulation is obtained when an operation means determines the exposure light quantity onto a substrate surface by using the variation information of transmittance and the measuring result of integrated light quantity from an integrated light quantity detector. CONSTITUTION:When luminous flux from a light source 1 is applied to a pattern on an applied surface by a lighting system and the pattern is projected onto a substrate 14 surface for exposure by means of a projection optical system 13, the lighting system is equipped, between the light source 1 and lighted surface, with a light-dividing member 8 for dividing incident light flux into two fluxes and for guiding one flux to the applied surface side and the other flux to a detector 9. Also, the lighting system has an operation means 19 storing the variation information of transmittance of the optical system 13 from the light-dividing member 8 to the substrate 14. Further, the operation means 19 determines the quantity of exposing light onto the substrate 14 surface by using the variation information of transmittance and the measuring result from the detector 9.
Patent JP-H05170775-A (JP)
Title: Trisubstituted silylalkyl-1,2,4-triazole and imidazolephenylborane derivative
Inventor: TSUZE EICHI TSUANGU
IPC: C07F7/10
Filed: 1991-12-16
Abstract: PURPOSE: To provide the subject new compd. useful as an agricultural fungicide for controlling plant disease and causing no damage to crops.  
     CONSTITUTION: The compd. is a compd. represented by formula I [where (n) is 1 or 2; R is stylyl or a group. of formula II (Y 1  is a 1-6C alkyl, fluoro, etc.; Y 2  is H, a 1-6C alkyl, etc.); R 1  and R 2  are each a 1-4C alkyl, 3-6C cycloalkyl, etc.; R 3  and R 4  are each a group of formula III (Y 3  and Y 4  are Y 1 ; (m) is 0 or 1); X is N or CH; R 5  is H or a 1-4C alkyl; and when X is N, R 5  is H], for example (1-bis-(4-chlorophenyl)methylsilyl-1H,1,2,4-triazole)-diphenylmethylborane. The compd. is obtained by allowing a compd. represented by formula IV (R 6  and R 7  are H or a lower alkyl) to react with a compd. represented by the formula; R 1 'MgZ (R 1 ' is an alkyl, haloalkyl, etc.; Z is Cl or Br) at 15-80°C, and the resultant is allowed to react with a compd. represented by formula V at 20-35°C. 
     COPYRIGHT: (C)1993,JPO
Patent JP-H06199190-A (JP)
Title: Weather strip
Inventor: YOSHIOKA SHIN
IPC: B60R13/06
Filed: 1992-12-28
Abstract: PURPOSE:To provide an open car type weather strip by which raindrops do not drop to the door glass side when rain falls on a top stack. CONSTITUTION:In a lateral directional weather strip 40 installed along the upper peripheral end of open car type front glass 10, on both left and right sides of an upper frame 20 extending left and right along the upper peripheral end of the front glass 10 as well as in a part extending to an upper rear end surface of a front pillar 50, the tip of a front sealing part 42 is displaced gradually as a position proceeds to an outer surface of the front pillar 50 from the left and right ends of the body upper frame 20, and an interval between the upper frame 20 and the tip of the front sealing part 42 is made large gradually, and a root front part of the front sealing part 42 is projected (44), and an upward opening groove 45 is formed.
Patent JP-2000182004-A (JP)
Title: History information storage device and equipment with the same
Inventor: KUBOTA MICHITAKA
IPC: G04F10/00
Filed: 1998-12-18
Abstract: PROBLEM TO BE SOLVED: To rationally set guarantee period by counting use time of equipment. SOLUTION: A history information storage device 20 which is installed on the equipment 10 and stores history information on the equipment 10 is provided with a counter 24 to measure the use time UT which is a time during the equipment 10 is operated and a storage part 21 which stores the history information on the equipment 10 and simultaneously stores the use time UT which is counted by the counter 24.
Patent JP-H11170438-A (JP)
Title: Manufacture of embossed decorative sheet having wiping appearance, and transfer material
Inventor: SHIGETA HIROYASU
IPC: B32B27/00
Filed: 1997-12-10
Abstract: PROBLEM TO BE SOLVED: To improve chemical resistance and weatherability by transferring, to a decorative sheet, a transfer material composed by sequentially forming, on a base sheet, an embossed layer, a topcoat and peeling layer, a vessel pattern layer, a transparent layer, and an adhering layer. SOLUTION: An embossed decorative sheet having wiping appearance is formed by transferring a transfer material 1, where an embossed layer 3, a topcoat and peeling layer 4, a vessel pattern layer 5, a transparent layer 6, and an adhering layer 7 are sequentially formed on a base sheet 2, to the decorative sheet. The peeling layer 4 is used for peeling the peeling layer 4 from the base sheet 2 at the time of transferring the transfer material 1 to the decorative sheet surface, and improving physical properties such as chemical resistance, weatherability, or the like of the decorative sheet surface after the transferring. The transparent layer 6 also improves physical properties such as chemical resistance, weatherability, or the like of the decorative sheet surface after the transferring.  A thermosetting resin, an electromagnetic radiation hardening resin, or the like is used for the transparent layer 6. Thereby, chemical resistance and weatherability of the embossed decorative sheet having wiping appearance can be improved.
Patent JP-2000235879-A (JP)
Title: Mounting structure of electrical connector on circuit board
Inventor: SUZUKI AKIO
IPC: H01R13/648
Filed: 1999-12-21
Abstract: PROBLEM TO BE SOLVED: To provide a mounting structure of an electrical connector on a circuit board for strengthening its mounting on the circuit board. SOLUTION: In this mounting structure, contacts 25 are implanted in a housing 21 made of an insulating material, an outer plate member 22 made by stamping and bending a metal plate is fastened to at least a part of an outer surface of the housing 21 of an electrical connector mounted on a circuit board, and leg parts 33, 34, 35 for fixing the connector to the circuit board or grounding are provided extendedly from the outer plate member. The leg parts include an insertion leg part 34 to be inserted into a mounting hole formed in the circuit board and a surface contacting leg part 35 extending in a direction normal to the extending direction of the insertion leg part 34 and coming into contact with an upper surface of the circuit board.
Patent JP-H11174880-A (JP)
Title: Fixing device
Inventor: YODA KANEO
IPC: G03G15/20
Filed: 1997-12-12
Abstract: PROBLEM TO BE SOLVED: To provide a fixing device not causing fixing unevenness over a whole sheet. SOLUTION: The fixing device is provided with a heating roller 50 having a heat source inside and first/second pressure rollers 60 and 70 coming into press-contact with the heating roller. Then, the heating roller and the first/ second pressure rollers are constituted to satisfy Hr1>=1.5, Hr2<=0.7, when the respective hardnesses of the heating roller and the first/second pressure rollers are defined as Hh, Hp1 and Hp2, the hardness ratio of the heating roller to the first pressure roller is defined as Hr1=Hh/Hp1 and the hardness ratio of the heating roller to the second pressure roller is defined as Hr2=Hh/Hp2.
Patent JP-H11257315-A (JP)
Title: Pin penetrated into base body, manufacture of pin and fastening tool equipped with pin
Inventor: OLVERA GILBERT
IPC: B21H1/18
Filed: 1998-12-21
Abstract: PROBLEM TO BE SOLVED: To provide a steel pin axially penetrated into a base body, a steel washer used together with the pin and a fastening tool equipped with the steel pin and the steel washer. SOLUTION: A steel pin 100 is formed of a carbon steel wire including carbon in the range of a carbon content of about AIST C 1038 steel to a carbon content of about AISI C 1065 steel and having a predetermined length having an initial diameter. Preferably, the carbon steel wire is an AISI C 1065 steel wire. The steel pin 100 is equipped with a head 110, a taper shank 120, an end part 130 and a transition region 140.
Patent JP-H11170924-A (JP)
Title: Bracket mounting method and press molding die
Inventor: TSUJIMURA TERUO
IPC: B29K105/06
Filed: 1997-12-15
Abstract: PROBLEM TO BE SOLVED: To mount a bracket firmly on the back face of the interior trim material of a vehicle or the like where an air unpermeable plastic film is attached onto its back face. SOLUTION: An interior trim material web 1 where an air unpermeable plastic film 4 is attached onto the back face of a synthetic-resin-impregnated base material 1A is press-molded and/or vacuum-molded. Needle holes 12 are formed at a bracket mounted part 15, and synthetic resin 17 impregnated into the base material 1A is effused to the back face from the needle holes 12, by which the surface of the air unpermeable plastic film 4 is covered with the synthetic resin 17, and a bracket 16 is bonded to the bracket mounted part 15 with adhesive to make the adhesive invade the inside of an interior trim material 14 through the needle holes 12.
Patent JP-2001185643-A (JP)
Title: Package substrate for mounting area array and semiconductor device using it
Inventor: UNNO HIROSHI
IPC: H01L23/12
Filed: 1999-12-22
Abstract: PROBLEM TO BE SOLVED: To provide a package substrate for mounting an area array and a semiconductor device employing it in which a stress a stress due to difference in the coefficient of thermal expansion between the package substrate and a mother board can be reduced without causing such a problem as increase in the diameter of a solder ball, increase in the number of mounting steps, or lowering of connection reliability between the package substrate and a mother board. SOLUTION: A ceramic substrate having a coefficient of thermal expansion of 2∼4 ppm and a ceramic substrate having a coefficient of thermal expansion of 10∼l6 ppm sandwich a high temperature heat resistant film having a coefficient of thermal expansion of 5-50 ppm and a Young's modulus of 10∼2000 kgf/mm2 so that an electrode for mounting a semiconductor element and an electrode for bonding a mother board can be conducted in the package substrate.
Patent JP-2001180948-A (JP)
Title: Press-forming machine for glass product
Inventor: HIROTA SHINICHIRO
IPC: C03B11/12
Filed: 1999-12-22
Abstract: PROBLEM TO BE SOLVED: To prevent decentering and inclination of a forming die supported with a mother die in a press-forming machine by controlling a buckling of the mother die in minimum. SOLUTION: A press-forming machine 10 of the present invention comprises a pair of forming dies 16 of which forming faces are arranged to oppose each other, a pair of mother dies supporting each forming die and heat-changeable with each, and a pair of die supports for supporting a mother die so that the above forming faces of the pair of forming dies can come into contact with and leave each other. The die supports 18 are provided with several support portions 20 on the opposing face side to mother dies so that an amount of contacting area with the above mother die can be not more than 1/5 of the area of the above opposing face.  The buckling of the mother die is controlled in minimum by means of bringing a mother die into contact with the die supports 18 at the several support portions with little contact area while a load bearing at pressing is assured and consequently by controlling the temperature difference between upper and lower part of the mother die in minimum.
Patent JP-2000187060-A (JP)
Title: Test device for electronic parts
Inventor: SAITO NOBORU
IPC: G01R31/26
Filed: 1998-12-22
Abstract: PROBLEM TO BE SOLVED: To prevent damage to electronic parts and test at a precise temperature by suppressing self-heating of electronic parts during the test. SOLUTION: The test device for electronic parts performs testing by pressing a plurality of terminals of electronic parts to be tested to a contact pin 51 on a test head in a state that the parts are mounted on a test tray. The device is provided with a pressure base 34 capable of approaching, separating and moving for the contact pin 51, a pressure block 31 integrally or separately provided and brought into contact with the electronic parts to be tested from an opposite face of the contact pin 51 to press them, and a heat absorbing and radiating body 38 provided on the pressure block 31.