baber/WOPTO huggingface dataset:
Patent TW-202229578-A (TW)
Title: An anodization treatment structure on carbon steel surface and the method of manufacturing the same
Inventor: CHEN CHIEN-CHON
IPC: C21D8/02
Filed: 2021-01-06
Abstract: The invention relates to an anodization on carbon steel surface. The invention used two mass-produced industrial technologies including thermal spray and anodization methods to modify carbon steel surface of anodization. First, use plasma spray method to spray a layer of aluminum film with a thickness of several hundred on the surface of carbon steel, and then use anodization method to produce an anodic film on the surface of aluminum film. The film can effectively improve the properties of the carbon steel surface, for example, hardness resistance to voltages, coloring, and excellent corrosion resistance.
Patent TW-202138493-A (TW)
Title: Coating composition containing fluorine polymer
Inventor: TANAKA YOSHITO
IPC: C09D127/00
Filed: 2021-01-08
Abstract: One purpose of the present disclosure is to provide a coating composition which is able to be used for fluorine polymer coating, and which contains a specific fluorine polymer that is dissolved therein at a high concentration. The present disclosure is a coating composition which contains a fluorine polymer and an aprotic solvent, wherein the fluorine polymer contains, as a main component, a monomer unit that is represented by formula (1) (wherein each of R1 to R4 independently represents a fluorine atom, a fluoroalkyl group or a fluoroalkoxy group), and the concentration of the fluorine polymer is 20% by mass or more relative to the total mass of the coating composition.
Patent TW-202228293-A (TW)
Title: Wafer structure
Inventor: MOU HAO-JAN
IPC: H01L29/78
Filed: 2021-01-11
Abstract: A wafer structure is disclosed and includes a chip substrate and at least one printing chip. The chip substrate is a silicon substrate, which is manufactured by a semiconductor process. The at least one printing chip is formed on the chip substrate by a semiconductor process, and is divided into the at least one printing chip. The printing chip include a plurality of ink drop generators. The plurality of ink drop generators are formed on the chip substrate by a semiconductor process. Each of the ink drop generators include a thermal barrier layer, a heating resistance layer, a conductive layer, a protective layer, a barrier layer, an ink supply chamber and a nozzle hole.
Patent TW-202138168-A (TW)
Title: Automated mechanical shaping of composite materials
Inventor: HOLLIS RICHARD
IPC: B29C70/28
Filed: 2021-01-14
Abstract: Disclosed herein are fully automated methods for shaping a composite material.
Patent TW-202137323-A (TW)
Title: Substrate processing method and substrate processing system
Inventor: HAMA YASUTAKA
IPC: H02N13/00
Filed: 2021-01-15
Abstract: A method of processing a substrate includes: (a) placing the substrate on an electrostatic chuck, and applying a direct current voltage to the electrostatic chuck to hold the substrate on the electrostatic chuck by suction; (b) supplying a high frequency power to an electrode to generate plasma of an inert gas; (c) stopping the application of the direct current voltage to the electrostatic chuck; and (d) gradually decreasing the high frequency power supplied to the electrode to 0 W.
Patent TW-202130567-A (TW)
Title: Pusher capable of shortening the displacement space occupied by the pusher
Inventor: WU SHAN-DA
IPC: H01L21/677
Filed: 2018-01-24
Abstract: A pusher of the present invention includes: a push frame, wherein the push frame is provided with a first force applying arm and a second force applying arm, the first force applying arm and the second force applying arm are arranged in an intersectional manner, and they can be linked with each other through a pivoting member pivotally arranged at the intersection part; one end of the first force applying arm is pivotally arranged on a first slide base, and the other end is pivoted with one end of a first force resisting arm; one end of the second force applying arm is pivotally arranged on a second slide base, and the other end is pivoted with one end of a second force resisting arm; the first slide base and the second slide base can be displaced toward or away from each other; including a first carrier and a second carrier, and the first carrier is provided to accommodate the first slide base and the second slide base, the bottom of the first carrier corresponds to the second carrier, and is fixedly arranged on it; the first carrier can be displaced relative to the second carrier; thereby shortening the displacement space occupied by the pusher.
Patent TW-202202329-A (TW)
Inventor: SLOTS ANTONIE
IPC: B29D30/24
Filed: 2021-02-18
Abstract: The invention relates to an applicator roll, a tire component servicer and a method for applying a strip to a drum. The applicator roll comprises an outer ring that is rotatable about a rotation axis and that defines a retaining surface, wherein the applicator roll is provided with suction openings for retaining the strip to the retaining surface, wherein the applicator roll comprises a follower that is rotatable inside the outer ring to follow a part of the strip on the retaining surface, wherein the follower defines a chamber that extends in the circumferential direction over a retaining arc along the outer ring, wherein the follower is rotatable about the rotation axis independently of the outer ring to a first retaining position on the outer ring in which the chamber is arranged in air communication with one or more suction openings within said retaining arc.
Patent TW-202233060-A (TW)
Inventor: LIN CHING-CHIUAN
IPC: A01K47/06
Filed: 2021-02-24
Abstract: The present invention is directed to a beehive, which comprises: a housing, a cover, a solar panel, a heating device, a cooling device, a door, and a temperature-controlling device. The housing is deposited with an air opening on a side wall thereof, and the air opening is communicated with an inner space of the housing. The heating device is electrically connected to the solar panel. The cooling device is electrically connected to the solar panel. The door is movably positioned on the air opening of the housing. The temperature-controlling device is electrically connected to the solar panel, the heating device, and the cooling device and comprises a control interface for setting the temperature range. The temperature-controlling device further comprises at least one detector in the inner space of the housing for detecting a temperature of the inner space of the housing.
Patent TW-202235806-A (TW)
Inventor: YOUNG JIEH-SHIAN
IPC: G01C9/00
Filed: 2021-03-11
Abstract: A toe and chamber angles inspection apparatus which comprises an object fastened frame, a computation device, and a display device. The object fastened frame is utilized to carry the computation device and fasten the object. The computation device is used to acquire the sensing data from inertial sensor and calculate those data to obtain the values of toe and chamber angles. The display device will display the evaluated results from the computation device. An algorithm for the toe and chamber angles inspection is also proposed. During this inspection, the x-axis of the apparatus is not necessary to align precisely.
Patent TW-202202484-A (TW)
Inventor: LEE GI-BACK
IPC: H01L51/50
Filed: 2021-03-26
Abstract: The present application provides a heterocyclic compound capable of significantly enhancing lifetime, efficiency, electrochemical stability and thermal stability of an organic light emitting device, and an organic light emitting device containing the heterocyclic compound in an organic material layer.
Patent TW-202212640-A (TW)
Inventor: Hou feng-yan
IPC: C25D5/42
Filed: 2021-04-22
Abstract: In example implementations, a method for coloring an alloy is provided. The method includes anodizing a substrate in an anodizing bath comprising phosphoric acid, at a constant temperature and a constant voltage for a first time period to develop an anodizing layer that includes a barrier layer, reducing the constant voltage applied to the anodizing bath for a second time period to change a thickness of the barrier layer and change a width of pores in the anodizing layer, plating the substrate in a plating bath at a first current that is increased over a third time period in accordance with a current profile of the plating bath, and plating the substrate in the plating bath at a second current for a fourth time period.
Patent TW-202242782-A (TW)
Title: Method of using mobile power supply to achieve marketing purpose wherein the mobile power supply is provided with a battery unit, a control unit, a storage unit and a display unit
Inventor: LIN BANG-CANG
IPC: G06Q50/06
Filed: 2021-04-26
Abstract: A method of using a mobile power supply to achieve marketing purpose includes: building a power swap station for allowing a consumer to swap a mobile power supply, wherein the mobile power supply is provided with a battery unit, a control unit, a storage unit and a display unit. When the mobile power supply is connected to the power swap station, the power swap station is configured to charge the battery unit. The control unit stores advertisement information in the storage unit via a file transmission means and plays the advertisement information on the display unit via a media playing means.
Patent TW-202237773-A (TW)
Inventor: OGAWA SHINJI
IPC: C09J11/08
Filed: 2021-04-27
Abstract: An object of the invention is to provide an adhesive tape that suppresses adhesive residue.
        An adhesive tape of the invention comprises: a base material 10 having a base fabric 1 formed from a warp and a weft, a first laminate layer 2 formed on a first surface 1A of the base fabric, a second laminate layer 3 formed on a second surface 1B of the base fabric, and an adhesive layer 6 formed as the outermost layer on the side of the base material 10 on which the first laminate layer 2 is formed, wherein depressions and protrusions 2B produced by the warp and the weft are formed on the opposite surface of the first laminate layer from the base fabric.
Patent TW-202202261-A (TW)
Title: Laser beam processing device
Inventor: TAKAHASHI TEIJI
IPC: B23K26/064
Filed: 2021-05-05
Abstract: The present invention provides a laser beam processing device 1, comprising: a laser oscillator 4 which outputs a pulse laser beam 5; a galvano scanner 13X,13Y which has a galvano mirror 11X, 11Y, deflects the pulse laser beam 5 by reflection of the pulse laser beam 5 at the galvano mirror 11X, 11Y, and rotates the galvano mirror 11X, 11Y with the control in accordance with a position instruction 29a; a fθ lens 15, wherein the fθ lens 15 is a lens which has an incident region onto which the pulse laser beam 5 deflected in the galvano scanner 13X,13Y is incident, and collects the pulse laser beam 5 incident on the incident region; a lens temperature measuring part 9 which measures the temperature of the lens by detecting the infrared ray radiated from the incident region, and determines temperature information of the lens; and a galvano instruction converting part 6, wherein the galvano instruction converting part 6 is a correcting part which corrects the position instruction 29 based on the temperature information.
Patent TW-202246765-A (TW)
Title: Method for performing visual inspection on an object
Inventor: CHIANG HUNG-WEI
IPC: G01N21/90
Filed: 2021-05-21
Abstract: The present invention relates to a method for performing visual inspection on an object. The method includes the following steps: an image capturing unit faces an inspection area; an object to be inspected is placed in the inspection area, wherein the object has an outer surface facing the image capturing unit and a shielded surface opposite to the outer surface so that the shielded surface is shielded from the image capturing unit by the outer surface; the image capturing unit captures an image of the object to be inspected, wherein the image includes an outer surface image and a shielded surface image reflected by a reflection mirror; and a processing unit performs visual inspection after receiving the outer surface image and the shielded surface image.
Patent TW-202220126-A (TW)
Inventor: GORBACHOV OLEKSANDR
IPC: H01L23/367
Filed: 2021-06-03
Abstract: A cooling structure for a silicon-on-insulator (SOI) metal-oxide-semiconductor field-effect transistor (MOSFET) includes a plurality of semiconductor strips separated from each other by isolation trenches, each of the semiconductor strips extending away from a transistor P-well disposed on top of a buried oxide (BOX) layer formed in a semiconductor substrate and having first and second ends, the second end being farther than the first end from the transistor P-well. Applying a voltage to the plurality of semiconductor strips may generate, in at least one of the strips, a first area having a reduced temperature closer to the first end than to the second end of the strip and a second area having an increased temperature closer to the second end than to the first end of the strip. The first and second areas may be generated by the Peltier effect.
Patent TW-202147862-A (TW)
Inventor: MASNADI-SHIRAZA ALIREZA
IPC: H04R1/20
Filed: 2021-06-11
Abstract: Systems and methods include a plurality of audio input components configured to generate a plurality of audio input signals, and a logic device configured to receive the plurality of audio input signals, determine whether the plurality of audio signals comprise target audio associated with an audio source, estimate a relative location of the audio source with respect to the plurality of audio input components based on the plurality of audio signals and a determination of whether the plurality of audio signals comprise the target audio, and process the plurality of audio signals to generate an audio output signal by enhancing the target audio based on the estimated relative location. The logic device is further configured to use relative transfer-based covariance to construct directional covariance matrix aligned across frequency bands and find a direction that minimizes beam power subject to distortionless criteria.
Patent TW-202301958-A (TW)
Title: Method for assembling heat dissipation device and heat dissipation device
Inventor: ZHAO JIAN-BIN
IPC: H05K7/20
Filed: 2021-06-18
Abstract: A method for assembling heat dissipating device includes loading a metal platform on a positioning jig, the positioning jig includes a working plane, the working plane is recessed with a positioning groove, the metal platform is filled into the positioning groove for positioning, and the upper surface is exposed; The glue is cured at room temperature on the upper surface of the metal platform. The heat sink is stacked on the working plane of the positioning fixture. The heat sink includes a heat sink and a plurality of heat sink fins. The heat sink has a first surface and a second surface opposite to each other. The second surface is in contact with the upper surface of the metal platform. Pressure is applied to the radiator and the positioning jig. The radiator and the positioning jig are detached, and the heat-conducting adhesive is cured at room temperature and fixed on it between the upper surface and the second surface.
Patent TW-202301182-A (TW)
Title: Method for determining wire regions of a circuit
Inventor: HSU SHENG-CHIH
IPC: G06T7/11
Filed: 2021-06-29
Abstract: Provided is a method for determining wire regions of a circuit, including the following steps: acquiring an original image including a plurality of strip-shaped regions; processing the original image to obtain a first processing image including a plurality of line segments; dividing the line segments into a plurality of groups respectively corresponding to the strip-shaped regions in the original image; generating a second processing image including a plurality of complete lines and respectively corresponding to the groups; extending the complete lines to generate a third processing image including a plurality of extension lines; and determining a rectangular region according to the strip-shaped regions in the original image corresponding to each of the extension lines in the third processing image.
Patent TW-202303125-A (TW)
Inventor: CHEN KUAN-HUNG
IPC: C12Q1/70
Filed: 2021-07-02
Abstract: 一種表面增强拉曼散射的檢測基板，包括基板、多個柱狀結構與多個目標待測物連接物質。柱狀結構設置在基板上。柱狀結構具有拉曼活性表面。柱狀結構的上視圖案的最大長度與相鄰兩個柱狀結構之間的間隙的比值範圍為0.2至0.4。目標待測物連接物質設置在柱狀結構上。
Patent TW-202303211-A (TW)
Title: Optical image capturing system
Inventor: CHANG YEONG-MING
IPC: G02B9/64
Filed: 2021-07-07
Abstract: The invention discloses a seven-piece optical lens for capturing image and a seven-piece optical module for capturing image. In order from an object side to an image side, the optical lens along the optical axis comprises a first lens with refractive power; a second lens with refractive power; a third lens with refractive power; a fourth lens with refractive power; a fifth lens with refractive power; a sixth lens with refractive power; and a seventh lens with refractive power;and at least one of the image-side surface and object-side surface of each of the seven lens elements is aspheric. The optical lens can increase aperture value and improve the imagining quality for use in compact cameras.
Patent TW-202217624-A (TW)
Inventor: PIKE JIMMY D
IPC: G06F15/163
Filed: 2021-07-08
Abstract: 一種分散式安全通信系統包括一第一系統控制處理器(SCP)子系統，該第一SCP子系統經由一網路耦合至第二及第三SCP子系統。該第一SCP子系統識別該第二SCP子系統，利用一第一私鑰簽署一第一SCP鑑認通信以提供一第一簽署之SCP鑑認通信，該第一SCP子系統將該第一簽署之SCP鑑認通信傳輸至該第二SCP子系統。該第一SCP子系統自該第二SCP子系統接收一第二簽署之SCP鑑認通信，使用與該第二SCP子系統相關聯之一第二公鑰來鑑認該第二簽署之SCP鑑認通信，且作為回應，與該第二SCP子系統建立一第一安全通信通道。該第一SCP子系統接著自該第二SCP子系統接收對該第三SCP子系統之一鑑認之一證明，且作為回應，無需傳輸簽署之SCP鑑認通信即可與該第三SCP子系統建立一第二安全通信通道。
Patent TW-202304266-A (TW)
Title: Offset position compensation system and compensation method thereof for predicting deformation error of circuit board by using nonlinear model including an image measuring unit, an operation processing unit and a processing unit
Inventor: CAI JIA-HONG
IPC: H05K3/00
Filed: 2021-07-12
Abstract: This invention provides an offset position compensation system and a compensation method thereof for predicting a deformation error of a circuit board by using a nonlinear model. The system includes an image measuring unit, an operation processing unit and a processing unit. The method includes: measuring original positions of four sample points in local areas of the circuit board by using the image measuring unit, and storing the original positions; then, setting a plurality of power values by the operation processing unit by virtue of the nonlinear model, respectively calculating a plurality of predicted positions, corresponding to the power values, of the sample points, and calculating average errors of absolute values between each of the predicted positions of the sample points and each of the corresponding original positions; and by taking the power value corresponding to the minimum average error of the absolute values as an optimized power value, predicting an offset position by the processing unit so that the deformed circuit board is processed on an accurate position.
Patent TW-202305226-A (TW)
Title: Partition assembly that is easy to assemble, store and carry including a plurality of columns, a plurality of connecting pipes, a plurality of flexible elements, a plurality of first cross bars, a plurality of second cross bars and a plurality of curtains
Inventor: CHEN BO-CANG
IPC: E04B2/74
Filed: 2021-07-22
Abstract: A partition assembly that is easy to assemble, store and carry includes a plurality of columns, a plurality of connecting pipes, a plurality of flexible elements, a plurality of first cross bars, a plurality of second cross bars and a plurality of curtains. Each column is composed of an upper column and a lower column. Each connecting pipe has an upper end and a lower end. The lower end is correspondingly embedded in the top end of the lower column, and the upper end is correspondingly embedded in the bottom end of the upper column. After each flexible element is pressed by one end of the connecting pipe, two clamping parts are clamped on the periphery of the lower column and further clamped into the top end of the lower column, and both ends of each flexible element are exposed. Each first cross bar is arranged between two adjacent columns along a first direction, and each second cross bar is arranged between two adjacent columns along a second direction. The curtains are detachably hung on the first and second cross bars.
Patent TW-202305851-A (TW)
Title: Keycap structure and method of fabricating the same
Inventor: CHANG SHENG-FAN
IPC: G06F3/02
Filed: 2021-07-26
Abstract: A key cap structure includes a key cap, a first material patterned layer and a diamond-like carbon-containing patterned layer. The first material patterned layer is disposed over the key cap, in which the first material patterned layer has a first opening through the first material patterned layer. The diamond-like carbon-containing patterned layer is disposed over the first material patterned layer, in which the diamond-like carbon-containing patterned layer has a second opening through the diamond-like carbon patterned layer, and the second opening is substantially aligned with the first opening.
Patent TW-202213115-A (TW)
Inventor: PITIGOI-ARON RADU
IPC: G06F13/38
Filed: 2021-08-03
Abstract: 描述了用於串列匯流排上的錯誤訊號傳遞的系統、方法和裝置。一種裝置包括匯流排介面、相位差分解碼器和處理器。匯流排介面被配置為將裝置耦合到串列匯流排。相位差分解碼器被配置為從符號序列中的符號對之間的轉變中解碼資料，該符號序列從串列匯流排被接收，每個符號表示串列匯流排的訊號傳遞狀態。處理器被配置為：在串列匯流排的兩個線的訊號傳遞狀態中偵測錯誤訊號傳遞窗口的指示符，錯誤訊號傳遞窗口的指示符對應於被禁止的符號組合或控制訊號傳遞的延遲；並且當在符號序列中或在錯誤訊號傳遞窗口的指示符的時序中偵測到錯誤時，在錯誤訊號傳遞窗口期間經由匯流排介面發信號通知錯誤。
Patent TW-202214065-A (TW)
Title: Method for manufacturing substrate with built-in components, and substrate with built-in components
Inventor: IZAWA HIROYUKI
IPC: H05K3/46
Filed: 2021-08-06
Abstract: This method for manufacturing a substrate with built-in components comprises: a step for providing an intermediate member 2 having an electronic component 10 with a first electrode 11 provided on a first surface 13 thereof, and a first electrically conductive layer 20 provided on the first surface 13 of the electronic component 10 so as to cover the first electrode 11; and a step for forming a first insulating resin layer 40 on the first surface 3 of the intermediate member 2. The first electrically conductive layer 20 comprises: a first curable adhesive layer 23 composed of a curable adhesive layer 22 including electrically conductive particles 21 and a cured adhesive composition; and a first metal foil layer 24 disposed on a surface of the first curable adhesive layer 23 on the side opposite the electronic component 10. The electrically conductive particles 21 of the first curable adhesive layer 23 electrically connect the first electrode 11 of the electronic component 10 with the first metal foil layer 24.