baber/WOPTO huggingface dataset:
Patent TW-201639055-A (TW)
Title: Substrate processing apparatus and method for detecting abnormality of substrate
Inventor: KOMATSU MITSUNORI
IPC: H01L21/66
Filed: 2016-04-15
Abstract: A substrate processing apparatus having a detecting unit that can detect an abnormality of a substrate such as a crack of the substrate or chipping of the substrate is disclosed. The substrate processing apparatus includes a polishing unit 3A-3D configured to polish a substrate, a cleaning unit 73, 74 configured to clean the polished substrate, a substrate abnormality detection unit 40 configured to detect an abnormality of the substrate, and a substrate transporting mechanism 6, 12, 77 configured to transport the substrate in the order of the polishing unit 3A-3D, the substrate abnormality detection unit 40, and the cleaning unit 73, 74. The substrate abnormality detection unit 40 includes an imaging device 42 configured to image the substrate, and an output monitoring unit 45 configured to determine a status of the substrate by comparing a signal obtained from the imaging device 42 with a predetermined threshold.
Patent TW-201704557-A (TW)
Title: Production method for stainless steel containing member
Inventor: FUJITA HIROSHI
IPC: C25F3/16
Filed: 2016-04-19
Abstract: There is provided a production method for a stainless steel containing member, including the steps of: blasting a surface of a hollow starting member having a long side direction and a short side direction, the surface being composed of stainless steel; and electropolishing the surface having been blasted, in the step of electropolishing, the starting member being immersed in an electropolishing solution with the long side direction of the starting member being inclined relative to a horizontal direction.
Patent TW-201703363-A (TW)
Title: Latch for electrical connector
Inventor: PHILLIPS MICHAEL JOHN
IPC: H01R13/629
Filed: 2016-05-11
Abstract: A latch (16) for securing a connector to a device comprises a body (46) including a hub (50), an actuator (48) extending from the hub, a latch pin (52) extending from the hub, and a return spring (64). The latch pin is configured to be moved between a latched position wherein the connector is secured to the device, and an unlatched position wherein the connector is separable from the device. The actuator is configured such that movement of the actuator moves the latch pin between the latched position and the unlatched position, and the return spring is configured to bias the latch pin to the latched position. The hub, the actuator, the latch pin and the return spring are integrally formed such that the body is a single, unitary body.
Patent TW-201700415-A (TW)
Title: Tension control in glass manufacturing apparatuses
Inventor: ABURADA TOMOHIRO
IPC: C03B17/04
Filed: 2016-05-18
Abstract: A method of manufacturing a glass ribbon is provided. The method includes providing a first pull roll device located in a draw zone of the glass manufacturing apparatus. The first pull roll device draws a glass ribbon from a forming device. A second pull roll device located in a catenary zone of the glass manufacturing apparatus is provided downstream from the first pull roll device. The second pull roll device isolates tension of the glass ribbon in the draw zone from a free loop of the glass ribbon that is downstream of the catenary zone.
Patent TW-201743165-A (TW)
Title: Interaction method and system in mixed reality free from VR glasses and visual angle constraints and can be popular in life and more realistic
Inventor: LU YI CHIH
IPC: G06F3/01
Filed: 2016-06-04
Abstract: An interaction method of a mixed reality is implemented by an interactive system and comprises a display interface for presenting an object in a physical space from a visual angle, an image capture module for capturing a scene as a dynamic reality image, and a processor. The processor identifies the dynamic reality image according to a number of primary target objects that are predefined and contain different view angles and when a primary object that matches the primary target object appears on the dynamic reality image, at least one virtual image associated with the primary target object and predefined is called up and the virtual image is displayed on the display interface. In this way, the present invention can present a virtual reality in an arbitrary physical space without the use of VR glasses and without the limitation of the angular position, and the virtual image can also be changed according to the real image, so that the virtual reality can be popular in everyday life, and the virtual effect will be more realistic.
Patent TW-201708073-A (TW)
Title: Oral care implement package
Inventor: MOSKOVICH ROBERT
IPC: B65D75/36
Filed: 2016-06-21
Abstract: A package for an oral care implement such as one or more toothbrushes can include a transparent or translucent front panel having a flat surface at a consumer-facing side of the package. The package can further include a transparent or translucent back panel attached to the front panel, the back panel having a contoured surface, as well as text and/or graphics on the front panel, wherein the package is configured to be displayed with the front panel of the package facing a viewing location. The front panel can further include an opening tab defined by a tab line, a flap defined, at least in part, by the tab line, and an opening cavity in the back panel that is positioned behind the flap.
Patent TW-201705789-A (TW)
Title: Method and device in a cellular communications system
Inventor: BERGLJUNG CHRISTIAN
IPC: H04L27/26
Filed: 2009-06-04
Abstract: The present invention relates to the area of wireless communication, and especially to a method and an arrangement for transmission output power control in a cellular telecommunications network. An improved transmission output power control is achieved by adapting a pre-defined power mask to a signal transmission characteristic of the signal transmission and applying the adapted power mask to a sub-frame or an OFDM symbol. The present invention could be implemented in a network node such as an eNodeB or in a user equipment.
Patent TW-201714245-A (TW)
Title: Position correcting device and electronic component conveying device equipped with same
Inventor: TAKAMATSU HAJIME
IPC: H01L21/68
Filed: 2016-08-03
Abstract: Provided are a position correcting device and an electronic component conveying device equipped with the same that can shorten the time required to correct the position of an electronic component without increasing the physical stress acting on the electronic component. A position correcting device 1, which is installed in an electronic component conveying device 2, is provided with: a motor 15 that causes a rotating shaft 16 to rotate clockwise or anticlockwise; and a hole part 11 that is formed in a base 14 which is rotated about the rotating shaft by the motor 15, that is wider than an electronic component 4 and that accommodates the electronic component 4. The hole part 11 is formed at a position that is deviated from the rotating shaft 16, is rotatingly moved through one lap by the motor 15 and guides the electronic component 4 inside thereof to a prescribed position by using the edge of the hole part 11.
Patent TW-201806159-A (TW)
Title: Semiconductor device and manufacturing method thereof
Inventor: LIOU EN-CHIUAN
IPC: H01L21/336
Filed: 2016-08-15
Abstract: A semiconductor device includes a semiconductor substrate, an isolation structure, and a spacer. The semiconductor substrate includes at least one fin structure. The isolation structure is partly disposed in the fin structure and partly disposed above the fin structure. The fin structure includes a first fin and a second fin elongated in the same direction. A part of the isolation structure is disposed between the first fin and the second fin in the direction where the first fin and the second fin are elongated. The spacer is disposed on sidewalls of the isolation structure on the fin structure. The isolation structure in the present invention is partly disposed in the fin structure and partly disposed above the fin structure. The negative influence of a gate structure formed on the isolation structure and sinking into the isolation structure on the isolation performance of the isolation structure may be avoided accordingly.
Patent TW-201730883-A (TW)
Title: Single-poly nonvolatile memory cells
Inventor: CHOI KWANG-IL
IPC: G11C11/407
Filed: 2016-08-31
Abstract: A single-poly nonvolatile memory cell includes a coupling capacitor, a cell transistor and a selection transistor. The cell transistor has a floating gate, a first source, and a first drain. The floating gate is coupled to an array control gate/source line through the coupling capacitor. The first source is coupled to the array control gate/source line. The selection transistor has a selection gate, a second source, and a second drain. The selection gate is coupled to a word line. The second source is coupled to the first drain. The second drain is coupled to a bit line.
Patent TW-201739829-A (TW)
Title: Resin composition and product made therefrom
Inventor: Hu zhi-long
IPC: H05K1/03
Filed: 2016-09-06
Abstract: Provided is a resin composition, comprising epoxy resin, oxydianiline type benzoxazine resin, styrene-maleic anhydride resin and tetra-phenol resin. The resin composition may be baked for producing products such as prepregs, resin films, resin-coated coppers, laminates and printed circuit boards, which satisfy one or more or all of desirable properties such as higher dimensional stability after a reflow process, better thermal resistance after horizontal black oxide process, low dielectric constant, low dissipation factor, high thermal resistance and flame retardancy.
Patent TW-201723808-A (TW)
Title: Modifying behaviour of a data processing unit
Inventor: WALTERS Karel Hubertus Gerardus
IPC: G06F9/30
Filed: 2016-09-12
Abstract: An apparatus is provided comprising rewritable storage circuitry to store at least one mapping between at least one instruction identifier and a behaviour modification. Selection circuitry selects, from the rewritable storage circuitry, a selected mapping having an instruction identifier that identifies a received instruction. The received instruction causes a data processing unit to perform a default behaviour. Control circuitry causes the data processing unit to behave in accordance with the default behaviour modified by the behaviour modification.
Patent TW-201814232-A (TW)
Title: Flat plate type heat pipe loop capable of effectively increasing the speed of heat conduction
Inventor: Chen qi-liang
IPC: F28D15/04
Filed: 2016-09-23
Abstract: The present invention relates to a flat plate type heat pipe loop, which comprises two plate bodies of upper cover and lower cover, and a ring groove formed between the two plate bodies. There is at least one support column arranged in the ring groove for supporting the plate bodies to avoid becoming recessed. The plate body of upper cover, except the support column, exhibits an empty slot channel , and a metal powder sintering layer and a metal mesh are arranged on the empty slot channel of the plate body of lower cover, while there is a working fluid arranged in the ring groove. When in use, a heat source is placed near the plate bodies, so that the working fluid in this place is heated to evaporate into gas, and the working fluid in other places of the heat pipe loop is still of liquid. Therefore, there exist a temperature difference and a pressure difference inside the heat pipe loop device, so as to further drive the gas to go around and move in the loop along the ring groove. When going around and moving, the gas dissipates heat to various places of the plate bodies, and is cooled into a liquid that flows back to the evaporation place near the heat source and finally returns to the evaporation place via a capillary structure channel. Because the heat dissipation of the working fluid is much faster than the heat conduction of the material itself, the speed of heat conduction can be effectively increased.
Patent TW-201738391-A (TW)
Title: Bonding wire for semiconductor devices
Inventor: ODA DAIZO
IPC: C22C5/02
Filed: 2016-09-23
Abstract: The objective of the present invention is to provide a bonding wire for semiconductor devices, which is mainly composed of Ag and achieves a sufficient and stable bonding strength at a ball joint, and which prevents the occurrence of neck damage even in a low loop, while having good leaning characteristics and a good FAB shape. In order to achieve the above-mentioned objective, a bonding wire for semiconductor devices according to the present invention is characterized by containing one or more elements selected from among Be, B, P, Ca, Y, La and Ce in an amount of 0.031-0.180% by atom in total and additionally containing one or more elements selected from among In, Ga and Cd in an amount of 0.05-5.00% by atom in total, with the balance made up of Ag and unavoidable impurities. Consequently, this bonding wire for semiconductor devices is able to ensure a bonding strength at a ball joint by forming a sufficient intermetallic compound layer at the bonding interface of a ball, while preventing the occurrence of neck damage even in a low loop and having good leaning characteristics and a good FAB shape.
Patent TW-201730670-A (TW)
Title: Resist composition
Inventor: LEWIS SCOTT
IPC: G03F7/004
Filed: 2016-09-29
Abstract: The present invention relates to resist compositions, in particular to photoresists that can be used in photolithography, especially in the fabrication of integrated circuits and derivative products. The resist compositions of the invention include an anti-scattering component which has a significant amount of empty space, and thus fewer scattering centers, such that radiation-scattering events are more limited during exposure. Such anti-scattering effects can lead to improved resolutions by reducing the usual proximity effects associated with lithographic techniques, allowing the production of smaller, higher resolution microchips. Furthermore, certain embodiments involve anti-scattering components which are directly linked to the resist components, which can improve the overall lithographic chemistry to provide benefits both in terms of resolution and resist sensitivity.
Patent TW-201814864-A (TW)
Title: Package structure and its fabrication method
Inventor: HSU SHIH-PING
IPC: H01L23/28
Filed: 2016-10-14
Abstract: This disclosure provides a package structure and its fabrication method. The package structure includes: a conductive pattern layer having a bump region and a wiring region, the bump region including a plurality of conductive bumps and a first dielectric material surrounding the plurality of conductive bumps, the wiring region including a plurality of first conductive wires and a second dielectric material covering and surrounding the plurality of first conductive wires; a circuit device disposed on the bump region and having a plurality of connecting terminals corresponding to the plurality of conductive bumps; an insulating block formed on the second dielectric material and surrounding a bottom edge of the circuit device; and a third dielectric material covering the circuit device and the wiring region.
Patent TW-201725631-A (TW)
Title: Package structure, fan-out package structure and method of the same
Inventor: HWANG CHIEN-LING
IPC: H01L23/522
Filed: 2016-10-14
Abstract: A package structure includes a spiral coil, a redistribution layer (RDL) and a molding material. The molding material fills gaps of the spiral coil. The spiral coil is connected to the RDL. A fan-out package structure includes a spiral coil, an RDL and a die. The spiral coil has a depth-to-width ratio greater than about 2. The RDL is connected to the spiral coil. The die is coupled to the spiral coil through the RDL. A semiconductor packaging method includes: providing a carrier; adhering a spiral coil on the carrier; adhering a die on the carrier; dispensing a molding material on the carrier to fill gaps between the spiral coil and the die; and disposing a redistribution layer (RDL) over the carrier so as to connect the spiral coil with the die.
Patent TW-201728676-A (TW)
Title: High modulus thermoplastic polyurethane
Inventor: LU QIWEI
IPC: C08G18/66
Filed: 2016-11-04
Abstract: A non-reinforced thermoplastic polyurethane composition having a high flexural modulus comprises 5% to 25% of a hydroxyl-functional polyol intermediate having a weight average molecular weight of 250 to 3000 and 75% to 95% hard segment comprising an unbranched, unsubstituted, straight chain diol and an aromatic isocyanate.
Patent TW-201714310-A (TW)
Title: Semiconductor device and manufacturing method thereof
Inventor: YAMAZAKI SHUNPEI
IPC: H01L29/78
Filed: 2010-08-23
Abstract: It is an object to provide a semiconductor device with less power consumption as a semiconductor device including a thin film transistor using an oxide semiconductor layer. It is an object to provide a semiconductor device with high reliability as a semiconductor device including a thin film transistor using an oxide semiconductor layer. In the semiconductor device, a gate electrode layer (a gate wiring layer) intersects with a wiring layer which is electrically connected to a source electrode layer or a drain electrode layer with an insulating layer which covers the oxide semiconductor layer of the thin film transistor and a gate insulating layer interposed therebetween. Accordingly, the parasitic capacitance formed by a stacked-layer structure of the gate electrode layer, the gate insulating layer, and the source or drain electrode layer can be reduced, so that low power consumption of the semiconductor device can be realized.
Patent TW-201817975-A (TW)
Title: Series fan with support frame
Inventor: CHANG BOR-HAW
IPC: F04D29/64
Filed: 2016-11-14
Abstract: A series fan with support frame includes a first fan, a second fan and a hollow support frame. The support frame has a first receiving space, a second receiving space, an inlet, an outlet and an inclined passage in communication between the first and second receiving spaces. The first and second receiving spaces are respectively positioned in the support frame in adjacency to the inlet and the outlet. The first and second fans are respectively correspondingly received in the first and second receiving spaces. A first virtual central line of the first fan and a second virtual central line of the second fan intersect each other in the inclined passage.
Patent TW-201820218-A (TW)
Title: Integrated management system and method for goods transportation resources comprising a plurality of transportation demand side devices, a plurality of transportation server side devices and a cloud storage device
Inventor: Lin zhen-hua
IPC: G06Q10/08
Filed: 2016-11-25
Abstract: This invention provides an integrated management system for goods transportation resources, which comprises a plurality of transportation demand side devices, a plurality of transportation server side devices and a cloud storage device. The transportation demand side devices are provided with a plurality of transportation demand side data. The transportation server side devices are provided with a plurality of transportation server side data. The cloud storage device is connected with the transportation demand side devices and the transportation server side devices through the internet so as to store the transportation demand side data and the transportation server side data. Therefore, the integrated management system and method for goods transportation resources provided by this invention integrates relevant data such as the transportation demand side data and the transportation server side data for supply to an information demander, so that the effects of reducing waste and shortage of transportation resources, reducing transportation cost and keeping transportation quality can be achieved, and the effects of saving the time of a transportation demand side, lowering the working complex degree and the real-time control and management difficulty for internal information of a transportation service provider and actively providing transportation state information for the transportation demand side in real time are also achieved.
Patent TW-201732913-A (TW)
Title: Substrate cleaning method
Inventor: SAITO YUKIMASA
IPC: H01L21/304
Filed: 2016-11-25
Abstract: This substrate cleaning method cleans a substrate to be processed by blasting thereon, from a nozzle part, a gas cluster generated by supplying a gas for cluster generation to the nozzle part, while moving the nozzle part and rotating the substrate to be processed in a chamber. The method comprises: a step for removing initial particles on the substrate to be processed by a first cleaning process executed with a prescribed condition; and a step for performing, at least once on the substrate to be processed, a second cleaning process executed with a cleaning condition which is shorter in time than that of the first cleaning process.
Patent TW-201821403-A (TW)
Title: Sulfoxide compound and method of producing benzothiophene derivatives using the same
Inventor: WU MING-JUNG
IPC: C07C317/22
Filed: 2016-12-01
Abstract: A sulfoxide compound and method of producing benzothiophene derivatives using the same are provided. The sulfoxide compound is represented by chemical formula (I), wherein R1 and R2 are independently benzoyl, C1-C6 alkyl with linear chain or side chain, acyl, silyl, or C3-C6 alkenyl; and X is halogen atom. The said sulfoxide compound reacts with acetylene, and then the synthesis efficiency of benzothiophene derivatives can be effectively increased.
Patent TW-201739958-A (TW)
Title: Surface-treated copper foil for printed circuit board, copper-clad laminate for printed circuit board, and printed circuit board
Inventor: SAITO TAKAHIRO
IPC: C23C26/00
Filed: 2016-12-08
Abstract: A surface-treated copper foil that is for a printed circuit board and that has a silane coupling agent layer on a surface on which roughened particles have been formed. The average height of the roughened particles on the silane-coupling-agent-layer surface is 0.05 [mu]m or more but less than 0.5 [mu]m, and the BET surface area ratio of the silane-coupling-agent-layer surface is 1.2 or higher.
Patent TW-201736535-A (TW)
Title: Novel compositions and use thereof for modification of substrate surfaces
Inventor: LIN GUANYANG
IPC: B05D3/00
Filed: 2016-12-09
Abstract: The present invention relates to non aqueous, graftable coating composition comprised of a homogenous solution of a polymer and a spin casting organic solvent, where the composition does not contain acidic compounds, coloring particles, pigments or dyes, and the polymer has a linear polymer chain structure which is comprised of repeat units derived from monomers containing a single polymerizable olefinic carbon double bond, and the polymer contains at least one triarylmethyl chalcogenide containing moiety which is selected from the group consisting of repeat units having structure (I) an end chain group unit of structure (II) and mixtures thereof, and the polymer does not contain any repeat units or end groups containing water ionizable groups, ionic groups, free thiol groups, or free hydroxy groups. The invention also relates to using this novel coating composition to form a grafted polymer film on a substrate.
Patent TW-201722967-A (TW)
Title: Heterocyclic compounds and their use in preventing or treating bacterial infections
Inventor: BRIAS JULIE
IPC: A61K31/439
Filed: 2016-12-22
Abstract: The present invention relates to heterocyclic compounds, their process of preparation, pharmaceutical compositions comprising these compounds and use thereof, optionally in combination with other antibacterial agents and/or beta-lactam compounds, for the prevention or treatment of bacterial infections. The present invention also relates to the use of these compounds as [beta]-lactamase inhibitors and/or as antibacterial agents.