Patent GB-774749-A (GB)
Title: Improvements in condensates of the dicarbamate of diethylene glycol with formaldehyde and materials coated therewith
IPC: C08G12/20
Filed: 1955-06-06
Abstract: A water-soluble high molecular weight condensate of 2-3.5 mol. of formaldehyde and 1 mol. of the dicarbamate of diethylene glycol has a viscosity at a concentration of 60 per cent in water at 25 DEG  C. of from 2 to 25 poises.  Condensation may take place in the presence of 1 to 2.5 mol. of methyl alcohol.  The dicarbamate is added to a 37 per cent solution of formaldehyde and heated, water being stripped off by distillation, acid added to reduce the pH to 2.3 to 3.5, the solution being heated to condense the resin and then partially or completely neutralized with alkali, e.g. ammonia, caustic soda or caustic potash.  The condensates may be used in coating compositions which are cured at 180 DEG  to 350 DEG  F., preferably in the presence of an acid catalyst of which many are specified, examples being sulphonic acid, and salts of hydroxy aliphatic amines and toluene sulphonic acids.  The compositions may also contain surface-active agents (non ionic, anionic or cationic), e.g. higher fatty acids and alcohols, lauryl alcohol sulphate and lauryl pyridinium chloride, volatile non-aqueous solvents, e.g. ethanol, propanol, isopropanol and t-butanol, plasticizers, e.g. the monoalkyl ethers of ethylene glycol in which the alkyl group is methyl, ethyl, propyl, butyl or isobutyl, additional thermosetting resins, e.g. phenol formaldehyde, urea formaldehyde, melamine formaldehyde, alkyds and vinyl or acrylic resins, dyes and pigments.  In the examples, the dicarbamate of diethylene glycol is heated with formaldehyde (1) in the presence of sulphuric acid, and cured in the presence of a polyethylene oxide derivative of octyl phenol at 250 DEG  F. as a coating on chipboard; (2) in the presence of sulphuric acid; (3) in the presence of phosphoric acid, being cured in the presence of a polyethylene oxide derivative of octyl phenol and p-toluene sulphonic acid as a coating on chipboard; (4) in the presence of sulphuric acid; (5) in the presence of sulphuric acid, being cured in the presence of a polyethylene oxide derivative of octyl phenol on synthetic fabrics at 300 DEG  F.  The coating compositions may be applied to many substrates, e.g. nylon, rayon, Orlon, Dacron, cellulose acetate, polyacrylonitrile, paper, metal, glass, leather, cardboard, chipboard, strawboard, wood felt, Cellophane, vinyl resins, asphalt and linoleum.  ("Orlon," "Dacron" and "Cellophane" are Registered Trade Marks.)ALSO:Fabrics are coated with an aqueous solution of a condensate of the dicarbamate of diethylene glycol with formaldehyde (see Group IV(a)).  The fabrics may be composed of nylon, acrylonitrile, linear aromatic polyester, cellulose acetate, rayon, cotton, silk, wool or casein or of glass or other mineral fibres.  The compositions are dried and hardened in situ at 180 DEG to 350 DEG F., if desired in the presence of an acid catalyst, of which many are specified, examples being sulphuric acid, acid salts of hydroxy aliphatic amines and toluene sulphonic acids. Surface-active agents (non-ionic, anionic or cationic), e.g. higher fatty acids and alcohols, lauryl alcohol sulphate and lauryl pyridinium chloride, volatile non-aqueous solvents, e.g. ethanol, propanol, iso-propanol and t-butanol, plasticizers, e.g. the monoalkyl ethers of ethylene glycol in which the alkyl group is methyl, ethyl, propyl, butyl or isobutyl, additional thermosetting resins, e.g. phenol-formaldehyde, ureaformaldehyde, melamine-formaldehyde, alkyds and vinyl or acrylic resins, dyes and pigments may also be present in the compositions.  In Example 5, a composition comprising an aqueous dispersion of the condensate, a polyethylene oxide derivative of an octyl phenol and sulphuric acid is applied to polyamide, polyester, polyacrylonitrile and cellulose acetate fabrics, the fabrics being dried in air and then cured at 300 DEG F.  The compositions may be used for stiffening and rendering the treated materials more resistant to heat.