baber/WOPTO huggingface dataset:
Patent TW-540161-B (TW)
Title: Transparent electrode substrate
Inventor: WEI MAO-KUO
IPC: G02B3/00
Filed: 2001-12-31
Granted: 2003-07-01
Abstract: The present invention provides a transparent electrode substrate including a transparent substrate and a transparent anode. The first surface of the transparent has a plurality of quasi-micro-lenses, wherein the maximum distance from the edge of each quasi-micro-lens to the first surface is about 100 mum. The transparent anode is formed on a second surface of the transparent substrate opposite to the first surface. In addition, the present invention also provides another transparent electrode substrate which includes a transparent substrate, a transparent film and a transparent anode, wherein the transparent film is formed on the first surface of the transparent substrate. The first surface of the transparent film has a plurality of quasi-micro-lenses. The maximum distance from the edge of each quasi-micro-lens to the first surface is about 100 mum. The transparent anode is formed on a second surface of the transparent substrate opposite to the first surface.
Patent TW-577048-B (TW)
Title: Calibrating method for objective lens speed sensor of optical pickup head
Inventor: WU CHIH-CHUNG
IPC: G11B7/09
Filed: 2001-12-31
Granted: 2004-02-21
Abstract: There is provided a calibrating method for objective lens speed sensor of optical pickup head, which includes the steps of: providing a calibrated compact disk drive, wherein the objective lens speed sensor of the calibrated compact disk outputs a standard voltage signal after the optical pickup head of the calibrated compact disk drive suddenly stops from a constant speed movement; making the optical pickup head of a compact disk drive to be calibrated suddenly stop from the constant speed movement, and obtaining a voltage signal from the objective lens speed sensor of the compact disk drive to be calibrated; and adjusting the voltage signal outputted from the objective lens speed sensor of the compact disk drive to be calibrated so that the voltage signal is equal to the standard voltage signal.
Patent TW-I222766-B (TW)
Title: Power supply system and electronical mechanism
Inventor: SHIOYA MASAHARU
IPC: H01M8/00
Filed: 2002-01-15
Granted: 2004-10-21
Abstract: A power supply system is disclosed for supplying the electric power to the external device, characterized in that the power generation portion is comprised which can be engaged/disengaged with the fuel pack portion is which the fuel is packed the electric power is generated by using the fuel supplied by the fuel pack potion.
Patent TW-546537-B (TW)
Title: Method for generating physical photographs and its product
Inventor: WANG TZUEN-YI
IPC: G03C7/00
Filed: 2002-01-28
Granted: 2003-08-11
Abstract: The present invention relates to a method for generating physical photographs, which is characterized in comprising: dividing the space image data of the to-be-tested object outline into plural space pixels; associating one layer to each space pixel based on its reference coordinate position; rendering the color information of each space pixel to the corresponding position of the corresponding transparent substrate; and finally, sequentially stacking each of the rendered transparent substrates to generate a physical photograph corresponding to the to-be-tested object outline. Therefore, the generated physical photograph is provided with not only three-dimensional effect but also plentiful colors.
Patent TW-594225-B (TW)
Title: Manufacturing method of light guiding micro structure
Inventor: TSAI RUEI-LUNG
IPC: G02F1/1335
Filed: 2002-04-23
Granted: 2004-06-21
Abstract: There is provided a manufacturing method of light guiding micro structure. The method comprises first electroplating a thin metal layer on a substrate, coating a photoresist layer on the thin metal layer, and making the photoresist layer form the most of plural openings extended downward to the thin metal layer by carving, so as to electroplate a metal layer with low melting point on the thin metal layer at the bottom of each opening; removing the photoresist layer and softening the top of each metal layer by heating to respectively form a deformed structure, and electroplating a metal layer on the top of the deformed structure; after separating the metal layer from the deformed structure, taking the metal layer as a master for being placed in a mold device, and producing a light guiding plate by injection molding, wherein the light guiding plate is formed with a light guiding micro structure corresponding to the micro structure of the metal layer.
Patent TW-I232148-B (TW)
Title: Method for planarization of a semiconductor structure
Inventor: HOLLATZ MARK
IPC: H01L21/3105
Filed: 2002-04-26
Granted: 2005-05-11
Abstract: The invention relates to a method for the planarization of a semiconductor structure comprising a substrate (1), in which several sub-structures (STI; AA; AA'; AA"";) are provided. Said sub-structures (STI; AA; AA'; AA"",) have a first sub-structure (AA') with planar regions (PS) and first trench regions (DT). A layer to be planarized is applied over the semiconductor structure, said layer having appropriate recesses above the first trench regions (DT) of the first sub-structure (AA'). The method comprises the following steps: pre-planarization of the layer to be planarized by an etching step, using a pre-planarization mask, then subsequent planarization of the layer to be planarized by a chemical-mechanical polishing step. According to the invention, a first region (B1) is formed on the layer to be planarized above the first sub-structure (AA') by means of the pre-planarization mask, said region having a predetermined grid of masked and unmasked sections (M1; O1) are arranged in such a way that they respectively cover both first trench regions (DT) and planar regions (PS), and a supporting structure for the chemical-mechanical polishing step, which corresponds with the masked sections (M1) of the grid, is created by the etching step, using the pre-planarization mask.
Patent TW-546487-B (TW)
Title: Ceramics optical part and manufacture method of the same
Inventor: HASEGAWA MASATO
IPC: G02F1/03
Filed: 2002-05-13
Granted: 2003-08-11
Abstract: Optical part use for infrared, looking for a material that can cut off the light of visible light to near infrared such as noise, and enhanced the transmissivity of the far infrared. If in ZnS, ZnS or Ge ceramics including one or more than 2 kinds of additive enable cut off the light of visible light to near infrared, then we can obtain an optical part material that can cut off partial or overall of the light of visible light to near infrared, and the far infrared light has good transmissivity. Because of the light of visible light to near infrared will not form noise, therefore the purpose of the material can provide for an optical part such as window material or lens material use in a high function infrared device.
Patent TW-571495-B (TW)
Title: Synchronous rectifier device
Inventor: HUANG JIA-SHIUNG
IPC: H02M3/335
Filed: 2002-07-04
Granted: 2004-01-11
Abstract: The present invention relates to a synchronous rectifier device, which comprises: an input unit to output a processing signal corresponding to an AC input voltage; a control unit electrically connected to the input unit; and an output unit. The control circuit has a pulse timing control circuit. The control unit can generate first and second driving control signal through the pulse timing control circuit. When the first driving control signal is converted from the first state into the second state, the pulse timing control circuit maintains the second driving control signal in the second state and converts the same into the second state after the first pulse period. Alternatively, when the second driving control signal is converted from the first state into the second state, the pulse timing control circuit maintains the first driving control signal in the second state and converts the same into the first state after the second pulse period. The output unit is electrically connected to the input unit and the control unit, and has the first and second switch control circuits. The first and second switch control circuits can be maintained in the turn-on state or turn-off state corresponding to the first and second driving control signals, and convert the processing signal into a filter output signal without the cross conduction phenomenon. By using the method of the present invention, the problem in that the filter output signal has the cross conduction after rectification can be solved. Also, when the other synchronous rectifier devices are connected in parallel, the reverse current that flows from the output end can be avoided, while the power transmission efficiency is not affected.
Patent TW-I258164-B (TW)
Title: Semiconductor package with heat-dissipating structure
Inventor: WANG JIN-FA
IPC: H01L21/00
Filed: 2002-08-29
Granted: 2006-07-11
Abstract: A semiconductor package with a heat-dissipating structure is proposed, wherein the heat-dissipating structure is disposed on a substrate mounted with a chip thereon. The heat-dissipating structure is composed of a first heat sink and a second heat sink. The first heat sink includes a chip attach portion and a plurality of extending portions connected to the chip attach portion, and is mounted on the substrate in a manner that the chip attach portion is attached to the chip and the extending portions are attached to the substrate. The second heat sink includes a base portion and a plurality of supporting portions connected to the base portion, wherein the base portion is elevated above the first heat sink by means of the supporting portions, and the supporting portions are attached to the extending portions for positioning the second heat sink on the substrate. An encapsulant is formed to encapsulate the chip and the heat-dissipating structure, with the base portion of the second heat sink being exposed to outside of the encapsulant. The above structural arrangement allows heat generated from the chip to be dissipated through the first and second heat sinks to outside of the semiconductor package, such that heat dissipating efficiency can be effectively improved.
Patent TW-I241811-B (TW)
Title: Software call control agent
Inventor: RAMACHANDRAN NAVINDRA
IPC: H04M3/493
Filed: 2002-09-27
Granted: 2005-10-11
Abstract: The present disclosure describes a method comprising establishing a connection between a software communication channel and a media server, wherein the software communication channel is presented to the server as a media stream; transmitting to the media server a call object including a media handle; attaching a media application to the media handle; and establishing a connection between the media application and the software communication channel. The disclosure further describes an apparatus comprising a computing platform including a private branch exchange (PBX); a media server installed on the computing platform; and software operative with the computing platform and the media server to establish a connection between a software communication channel and a media server, wherein the software communication channel is presented to the server as a media stream, transmit to the media server a call object including a media handle, attach a media application to the media handle; and establish a connection between the media application and the software communication channel.
Patent TW-548531-B (TW)
Title: Test head positioning apparatus
Inventor: MUELLER CHRISTIAN
IPC: G01R31/28
Filed: 2002-10-03
Granted: 2003-08-21
Abstract: A positioning apparatus for positioning a test head for resting electronic components is provided. The positioning apparatus includes an outer cylinder and a support coupled to the outer cylinder for supporting the test head. The positioning apparatus also includes a piston arranged within said outer cylinder such that the piston and the outer cylinder define a fluid compartment within the outer cylinder. The positioning apparatus also includes a pressure regulator for maintaining a pressure within the fluid compartment such that the test head may be suspended in a substantially weightless position, the substantially weightless position being adjustable in a vertical direction. The positioning apparatus also includes a lifting device for raising and lowering the outer cylinder. The lifting device includes a threaded drive mechanism coupled to the piston. The positioning apparatus also includes a drive apparatus for operating the threaded drive mechanism to move the test head to a predetermined position.
Patent TW-I281479-B (TW)
Title: Process for preparing branched aromatic polycarbonates
Inventor: BRACK HANS-PETER
IPC: C08G64/14
Filed: 2002-11-25
Granted: 2007-05-21
Abstract: A process for the production of a branched aromatic polycarbonate that includes adding a branching agent to a polycarbonate oligomer, and producing a branched aromatic polycarbonate having a melt index ratio greater than an aromatic polycarbonate produced from the polycarbonate oligomer without the addition of the branching agent. The branching agent has the formula (I): AGy, wherein A is a C1-20 polymethylene, C2-20 alkylene or alkylidene, C5-36 cycloalkylene or cycloalkylidene, C6-36 arylene or alkylarylene, or C6-36 arylalkylene, wherein G is a monovalent C6-C30 hydrocarbon having at least one hydroxyl group bonded directly to an aromatic or cycloaliphatic ring and y is an integer greater than 2, and wherein each G may be the same or different.
Patent TW-I228686-B (TW)
Title: Organic light-emitting display device
Inventor: ISHIHARA SHINGO
IPC: H01L27/32
Filed: 2002-12-03
Granted: 2005-03-01
Abstract: A scanning line, a signal line, a first current supply line, and a second current supply line are formed on a glass substrate, a first electrode is formed on the wiring layer comprising the above members, an organic layer comprising a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer is formed on the first electrode, a second electrode is formed as cathode on the electron injection layer, the first electrode as anode is connected to a plus terminal of a power source through the driving devices and the first current supply line, whereas the second electrode as cathode is connected to a minus terminal of the power source, and is connected to the second current supply line in the display region of each pixel, with a contact hole serving as a feeding point, whereby wiring resistance due to the second electrode is reduced, and variations in the brightness of a panel is reduced.
Patent TW-589594-B (TW)
Title: Electroluminescence display device and method for making same
Inventor: NISHIKAWA RYUJI
IPC: H05B33/10
Filed: 2003-02-25
Granted: 2004-06-01
Abstract: This invention provides an electroluminescence display device that increases the effective light emission area of the EL elements, and the brightness, while the life of the EL elements is extended. An undulating surface is formed on a planarized insulation film 20. An undulating surface is formed on an anode 22 to correspond with the undulating surface of the planarized insulation film 20. A hole transporting layer 23, a light emission layer 24, electron transporting layer 25 and cathodes 26 are formed on the anode 22 by vacuum depositing process. On the surface of each of the hole transporting layer 23, light emission layer 24, electron transporting layer 25 and cathodes 26 is formed an undulation corresponding with the undulation of the surface of the anodes. As a result the effective light emission area SI of the light emission layer 24 is enlarged in comparison with that SO of conventional EL elements.
Patent TW-592866-B (TW)
Title: Method of calibrating marking in laser marking system
Inventor: KIM BYOUNG-HWAN
IPC: H01L23/544
Filed: 2003-04-23
Granted: 2004-06-21
Abstract: In a method for calibrating marking in a laser marking system including a laser marker performing marking while observing chips contained in cells of a tray using a plurality of vision cameras, and a post-vision camera detecting a marking error (a) each chip is assigned to be observed to a corresponding vision camera, (b) a coordinate of the vision camera and a coordinate of the laser marker are matched, (c) a predetermined first symbol is marked on a chip or at a position corresponding vision camera, and one point of the first symbol is taught as a reference point, (d) the first symbol and the reference point of the chip are observed using the corresponding vision camera and a second symbol is marked on the chip with respect to the reference point, (e) the second symbol on a selected chip is observed and one point of the second symbol is taught as a comparison point, and (f) a position of the comparison point is detected from the reference point on the chip and the marking error in each cell is calculated.
Patent TW-I224339-B (TW)
Title: Semiconductor memory device reduced in power consumption during burn-in test
Inventor: KAWAGOE TOMOYA
IPC: G11C11/408
Filed: 2003-06-24
Granted: 2004-11-21
Abstract: At the time of burn-in test, substrate voltages of transistors in a sense amplifier are switched by a PMOS substrate voltage generating portion and an NMOS substrate voltage generating portion. Specifically, the substrate voltage of a P channel MOS transistor is increased during the test than in a normal operation, whereas the substrate voltage of an N channel MOS transistor is decreased during the test than in the normal operation. Consequently, the threshold voltages of the P channel and N channel MOS transistors can be increased upon the test. Leakage currents in the turned-off states can be reduced, and thus, power consumption during the burn-in test can be decreased.
Patent TW-I238790-B (TW)
Title: Two-wheeler and rear arm for the two-wheeler
Inventor: FUKUDA HIROMI
IPC: B62J11/19
Filed: 2003-07-31
Granted: 2005-09-01
Abstract: To provide a rear arm for two-wheelers to enable easily providing wiring from a battery provided outside the rear arm to a control unit provided inside the rear arm without the provision of a through-hole on the rear arm, having a larger inner diameter than an outer diameter of a coupler when wiring is to be provided from the battery to the control unit. A rear arm 3 being pivotally supported at a front end side thereof to a main frame of a two-wheeler 1, in which a rear wheel is driven by a rotating electrical machine 7, and mounting the rotating electrical machine 7 on a rear end side thereof, the front end side of the rear arm 3 being divided into a plurality of constituent members, and a notch being provided at the divided portion on the constituent member to form an opening for passage therethrough of a wiring for electric connection of an electric power source provided on a side of the main frame and the rotating electrical machine 7.
Patent TW-I224234-B (TW)
Title: Pixel structure and fabricating method thereof
Inventor: CHIANG CHIH-HUNG
IPC: G02F1/1362
Filed: 2003-08-12
Granted: 2004-11-21
Abstract: A pixel structure and a fabricating method thereof are described. The method comprises forming a conductive layer when forming a data line and a source/drain. The conductive layer has a coupling part and a connecting part. The coupling part is used as an upper electrode of a pixel storage capacitor, and the connecting part connects the coupling part and the drain. Thereafter, a contact opening is defined on the connecting part, and a pixel electrode formed subsequently can be electrically connected to the connecting part through the contact opening. Thus, the pixel electrode, the conductive layer (includes the coupling part) and the drain are electrically connection each other. Since the contact opening is not formed on the pixel storage capacitor, the leakage of the pixel storage capacitor will not occur when the etching process of the contact opening etches away the gate insulating layer.
Patent TW-I222321-B (TW)
Title: Analog-to-digital converter for image sensor
Inventor: YUN YOUNG-HWAN
IPC: H03M1/12
Filed: 2003-08-21
Granted: 2004-10-11
Abstract: An analog-to-digital converter for image sensor, comprising a signal processing circuit, for generating a digital word corresponding to incident light. Where the circuit comprises an analog integrated circuit having a first input terminal receiving a first analog signal during a first active period of a first switching signal, and a second input terminal receiving a time varying reference signal. The circuit further comprises an inverter circuit inverting and amplifying an output of the analog integrated circuit according to an activated enable signal, and an output circuit generating the digital word. During a second active period of the first switching signal, the first input terminal is coupled to a data line for receiving a second analog signal corresponding to image charges of an image input element. The enable signal is deactivated between end points of the first and second active periods of the first switching signal.
Patent TW-I231844-B (TW)
Title: Ball nut with hided reflow holes
Inventor: WANG JAU-PENG
IPC: F16H25/22
Filed: 2003-11-10
Granted: 2005-05-01
Abstract: The present invention relates to a ball nut which includes the rolling groove and the recirculation block and recirculation holes. The characteristic of the ball nut is that the recirculation hole of ball nut was made by the electric discharge, and it doesn't penetrate the ball nut. Therefore, the present invention can reach the effect of seal up and reduce the noise passing through outside of the ball nut.
Patent TW-I241930-B (TW)
Title: Intermittent feeding mechanism for article forming device
Inventor: LI YUAN-SHI
IPC: B21D22/00
Filed: 2003-12-17
Granted: 2005-10-21
Abstract: An intermittent feeding mechanism for an article forming device includes a driving arm driven by a reciprocation mechanism of the article forming device; an intermittent return mechanism capable of performing intermittent stop and contracting operations; a material transport swinging pitman arm capable of performing a non-linking up-lifting operation by the driving arm and an intermittent down pressing operation by linking with the intermittent return mechanism; and a feeding unit receiving an one-way transmission from the material transport swinging pitman arm. Through the intermittent pulling and holding of the intermittent return mechanism and the non-linking up-lifting operation of the driving arm, the material transport swinging pitman arm does not operate synchronously with the reciprocation mechanism and performs an intermittent pivotal swinging operations, while achieving an objective of material feeding by an intermittent rotation of the press wheel.
Patent TW-I266403-B (TW)
Title: Method for fabricating semiconductor package substrate with opening penetrating therethrough
Inventor: CHEN BIN-YANG
IPC: H01L23/52
Filed: 2003-12-31
Granted: 2006-11-11
Abstract: A method for fabricating a semiconductor package substrate with an opening penetrating therethrough is proposed, wherein an inner substrate formed with a plurality of penetrating holes is provided, and at least a penetrating opening is formed therein by a drill pin. After a plating through hole is formed in the penetrating hole and a patterned circuit layer is formed on a prescribed surface of the inner substrate by a patterned process, a solder mask is formed on the patterned circuit layer. By the arrangement, it can prevent alignment errors of the drill pin and a shaping machine in the process of fabricating a substrate via forming the penetrating opening before the patterned circuit layer.