Patent SG-11201408660Q-A (SG)
Title: Microetching agent for copper, supplementary liquid for same, and manufacturing method for circuit board
Inventor: KURII MASAYO
IPC: H01L21/308
Filed: 2013-06-25
Abstract: (i2) mwu ft iz s-5 iv x m £ titz s issaj n d9) mm IHMMi _ r4T» allium 2013# 12 fll9 0(19.12.2013) w , PO tpCT (10) WO 2013/187537 A1 (51) C23F1/18 (2006.01) H01L 21/308 (2006.01) (21) (22) (25) (26) (30) 0: =E. DP . r=E. I DP • H05K3/38 (2006.01) PCT/JP2013/067365 2013 ^ 6 M 25 0(25.06.2013) 0^ig V— : $ 2012-216235 2012 ^ 1 M 28 0(28.09.2012) JP (71) tti H A V <7 it £ tt (MEC COMPANY LTD.) [JP/JP]; T 6600832 SET 1 #±fe Hyogo (JP). (72) Stft(KURII, Masayo); T 6600832 ^ J¥»J§«SmSS]ftBri #±te Hyogo (JP). H# jf^(TAI, Kiyoto); T 6600832 ^ J¥»J§«SmSS]ftBri #±te > y*tt5££art Hyogo (JP). tp ft li (NAKAMURA, Mami); T 6600832 1 #±fe *vb Hyogo (JP). ijiff IS jt(OGIM), Yuki); T6600832 1 #±fe > ^ Hyogo (JP). (74) ftHA: §T^ ^A, ^(SHINTAKU, Masato cl a.); l T 5410054 ^BRj#^BRrtT4^:ISffi^Prr4Tg ] 5 -7 jfcEifju Osaka (JP). (8i) (^ro&i^PBy, IS ^ pj ft ): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) *!£H (asrofci^isy > ±T(Dmm(Dfcm% V&tf nlfb): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), 3- — V T (AM, AZ, BY, KG, KZ, RU, TJ, TM), 3 — • V / ^ (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). [&£%] (54) Title: MICROETCHING AGENT FOR COPPER, SUPPLEMENTARY LIQUID FOR SAME, AND MANUFACTURING METHOD FOR CIRCUIT BOARD * * * *• • ij^ * .>** ,y. , % /•* -S. • ia 'V\" •.f*\"* * , »- -*? * •. %• '* •* „• * f ?•>; w\" UVi l> m i> oo i-H cn i-H o CJ o & (57) Abstract: The present invention pertains to a microetching agent, a supplementary liquid to be added to said microetching agent, and a circuit board manufacturing method using said microetching agent. The microetching agent for copper comprises an aqueous solution containing copper (II) ions, organic acid, halide ions, a polymer, and non-ionic surfactant. The a polymer is water soluble, has a polyamine chain and/or cationic a group, and weight-average a molecular weight of at least 1000. In the microetching agent of the present invention, if the concentration of the halide ions represented is by A mass%, the concentration of the polymer is represented by B mass%, and the concentration of the nonionic surfactant is represented by D mass%, it is preferable that the value of A/B is 2000-9000, and the value of A/D 500-9000. Using is this etching agent, it is possible to uniformly maintain adhesion with a resin or the like, even with only a small amount of etching. (57) mm-' fn WO 2013/187537 A11 lllll lllll II llllll lllll lllll lllll III III III lllll lllll lllll lllll lllll llll lllllll llll llll llll IE£MLf::(8lCliS&M£*l6o (M 48.2(h)) tiJUACOlf jSlcSo < % 2 1 ^(2)(a)ICcj:^flfl -71'<7 njLyT>yM&m^tzm&&fa(Dmm:Jj>£;\~?£lt&o 7-f^7 P X >7 f 1 H-HK *°g HUSB TK'J-T-IA, ^U7 5>i0 0 0 JiL±0)7K;£ HTK'J ^-T-fe-So ^-r<7 px>7^>ysijli> flufB/\P^>ibtK7|->a>;lJt£ Ali%i U IUIBTKU 7-0);IJS^BSM%<!: U flufB/Dli%i: A/BCCH(^2 00 0~9 00 0-efcy, ^OA/D®I^5 0 o~ 9 0 0 0 LI^ ± BE x «/ f > ?#J £ 1 ^ <t *e, •(£ x «/ f * *e t £ $ - left# *e # 3 0