baber/WOPTO huggingface dataset:
Patent JP-2000325735-A (JP)
Title: Adsorption body for plasma treatment and apparatus and method for decomposition of hazardous substance using the adsorption body
Inventor: KAWAMURA KEISUKE
IPC: B01D53/32
Filed: 1999-10-06
Abstract: PROBLEM TO BE SOLVED: To efficiently treat hazardous substance by plasma by a method wherein for an adsorbent which adsorbs the hazardous substance, and decomposes the adsorbed substance by plasma treatment, an intensive dielectric is arranged inside the adsorbent. SOLUTION: A plasma treating adsorption body 100 is an adsorbent which adsorbs hazardous substance, and decomposes the adsorbed substance by plasma treatment, and formed by arranging a ferroelectric body 102 inside the porous adsorbent 101. In this case a dielectric constant of the ferroelectric body 102 is 1-20. When plasma treatment of the hazardous substance is carried out, the adsorbent 100 is filled in a plasma treating container, and the hazardous substance is adsorbed in a pore of the adsorbent 101 part. Thereafter, plasma treatment is carried out in a state wherein the hazardous substance is adsorbed inside the adsorbent 101 as it is. Then, an electric field can be applied selectively to a surface of the absorbent 101 and in its inner macro pore by optimizing an electrostatic capacity of a void generated in the adsorbent 100.
Patent JP-H01128430-A (JP)
Title: Manufacture of semiconductor device
Inventor: TOKI MASAHIKO
IPC: H01L21/28
Filed: 1987-11-13
Abstract: PURPOSE:To prevent damage to GaAs and form a gate electrode where its Schottky barrier is high in view of the situation of gate electrode materials, by removing a natural oxidation film by H2 plasma at the surface of a GaAs layer and further, depositing WSix by using a CVD device on the GaAs layer, thereby causing a WSix film to grow on the WSix film with a sputter or a vapor growth process. CONSTITUTION:A natural oxidation film 35 is formed at the surface of a GaAs layer 32 on a GaAs substrate. And the natural oxidation film is removed by H2 plasma at a plasma reaction chamber. Then, H2 is introduced in the plasma generating chamber and WF6 as well as Si2H6 are introduced in a plasma reaction chamber. In such a case, a substrate temperature is set up so that it will be within a range from a room temperature to about 200 deg.C. In this way, the natural oxidation film 15 is removed and an ECR-CVD process allows a WSix film 36 having the film thickness about 1000Angstrom  to grow on the surface of the GaAs layer 32 which is clean and is not damaged yet. As the natural oxidation film 37 exists on the WSix film 36, its film is removed by wet-etching. Further, a sputter or an ordinary CVD process allows WSix film 38 to grow to a desired film thickness on the cleaned WSix film 36. This approach lessens the variation of an interface structure and improves not only Schottky characteristics but also the reliability of a GaAs-IC.
Patent JP-H09128931-A (JP)
Title: Disk cartridge
Inventor: KISHIDA KOJI
IPC: G11B23/033
Filed: 1995-11-02
Abstract: PROBLEM TO BE SOLVED: To provide a disk cartridge having a guide plate suppressing the free end part of a shutter from rising up and in which the structure of a metallic mold is simple and whose cost is reduced. SOLUTION: This cartridge houses a disk shaped recording medium 5 freely rotatably in the cartridge case 2 formed by halves 3, 4 made of synthetic resin and is provided with a shutter 8 opening and closing an opening for head 6 and an opening for spindle 7 and is a disk cartridge in which the shutter 8 whose sectional area is a U-shape is freely slidable attached along the one side edge of the cartridge case 2 in a state in which it is put across the one side edge. In this case, the guide plate 14 suppressing the free end part of the shutter 8 from rising up in a thickness direction is integrally formed in the thickness direction on at least one side of the half 3 so that other parts of the half 3 are not overlapped with the plate.
Patent JP-S62145756-A (JP)
Title: Copper wirings for bonding
Inventor: YAMAZAKI SHINSUKE
IPC: C22C9/00
Filed: 1985-12-20
Abstract: PURPOSE:To obtain copper wirings for bonding to be applied to a conventional gold wire bonder as it is by using high purity copper having specific semisoftening temperature as the copper wirings for bonding. CONSTITUTION:High purity copper having 140 deg.C or lower of semisoftening temperature and 99.9wt% or higher is used as copper wirings for bonding. According this copper wirings, an Si chip can be bonded without crack. This bonding is executed at approx. 300 deg.C or lower, and we a ball at the end of the copper wirings is pressed to an electrode on the chip, the ball is collapsed to be work hardened. If the degree of the hardening is small, a load to the chip is small to cause no crack to occur. Thus, softening is proceeded simultaneously upon work hardening so that the material to be readily softened has smaller degree of hardening in case that the ball is collapsed. Accordingly, the lower the semisoftening temperature is, the less the load to the chip is applied. The copper wirings have almost the same mechanical properties such as tensile strength, rupture elongation of working material and heat treated material and workability as the existing copper wirings.
Patent JP-2001105541-A (JP)
Title: Abrasion resistant decorative material
Inventor: SUGITA SHIGEKI
IPC: B27M3/00
Filed: 1999-10-06
Abstract: PROBLEM TO BE SOLVED: To solve a problem in which when a protective layer is formed on the surface of a decorative material by using a resin incorporated with rigid inorganic particles, the surface is roughened to deteriorate the feel of the surface. SOLUTION: A printing sheet 2 is manufactured by forming a solid printing layer 17a and a pattern layer 17 on a base layer 11 such as paper and a plastic sheet by printing, etc., a protective layer 12 of an uncured ionizing radiation curable resin 13a containing rigid high density particles 14, rigid middle density particles 15, and rigid low density particles 16 is formed on the pattern layer 17, the particles 14 are distributed on the lower side of the protective layer 12, the particles 15 are distributed in the intermediate, and the particles 16 are distributed on the surface side. Next, the resin 13a is cured by irradiating ionizing radiation 19 from above the protective layer 12, and an abrasion resistant decorative material 1 having the protective layer of the cured ionizing radiation curable resin 13b is manufactured.
Patent JP-2001109069-A (JP)
Title: Projector and illuminance spot adjusting method therefor
Inventor: TERAHIRA HIROKAZU
IPC: G02F1/13
Filed: 1999-10-06
Abstract: PROBLEM TO BE SOLVED: To easily eliminate illuminance spots on a projected image. SOLUTION: The projected image F is obtained by guiding light emitted from a light source 21 through plural optical elements and projecting the light on a screen S through liquid crystal panels LCr, LCg and LCb. In the case the illuminance spots are formed on the projected image F, antireflection coating is partly applied on a lens 37 so as to correspond to the low illuminance part. Then, the light transmittivity of the coated part becomes higher than that of other parts, then, the illuminance at the low illuminance part of the projected image F is increased, and then, the occurrence of the illuminance spots is suppressed.
Patent JP-H04160314-A (JP)
Title: Self-standing underwater staff device
Inventor: HAMADA KENJI
IPC: G01C13/00
Filed: 1990-10-24
Abstract: PURPOSE:To save labor and power and to measure the height while reducing influences of the large depth, waves and tidal currents by making movable a measuring board functioning also as a weight which is connected to a floating staff of a predetermined length an upper part of which is projectable from water by buoyance. CONSTITUTION:The height of the smoothed top of a riprap mound B onto which a caisson A is mounted is measured. At this time, a measuring board 4 for measuring the smoothed surface is suspended by a winch 18 and moved to an aimed measuring position by a ship 17. A floating staff 1 coupled to the measuring board 4 by means of a rope 3 which is little influenced by the resistance of tidal currents is moved afloat by the thrust of a propeller 5 and the manipulation of a horizontal wing 11 and a vertical plate 12. When the measuring board 4 is descended at the measuring position, the staff 1 is drawn by the weight of the board 4 and stands by itself at right angles. The propeller 5 is directed at all times in the direction of the tide by the vertical plate 12 and a swivel 15. Even when the staff 1 is moved by the tide, the sensor detects the motion and the propeller 5 automatically holds the perpendicularity of the staff 1 and rope 3. A scale 6 of the staff 1 is read by a level 7. Accordingly, the top height can be measured.
Patent JP-H08145043-A (JP)
Title: Ball joint
Inventor: MIYAKE NORIO
IPC: F16C11/06
Filed: 1994-11-21
Abstract: PURPOSE: To enhance the pulling strength and the rigidity by caulking a ball housing so as to continuously curve the housing along the external shape of the ball, and further, by caulking the housing in a part around an opening in a substantially comical shape having an steep angle. CONSTITUTION: A ball 12 provided at one end of a rod 11, is previously covered with a ball seat 13, and is inserted in a housing 10 having an inner diameter slightly larger than that of the ball 2. The housing 10 caulks a wall surface 15 having been in a cylindrical shape, along the ball 12 when the ball 12 is inserted in the housing 10 so that the wall surface 5 depicts a three-dimensional continuous curved surface, and further, a part of the housing 10 around an opening 17 is caulked in a substantially conical shape having a steep angle so as to form a forced caulking part 18.  In the caulking part composed of the continuous wall surface 15, the radius of curvature of the outer surface 19 of the ball seat is made to be substantially coincide with that of the inner spherical surface 21 of the housing by restraining spring-back thereof, and accordingly, the pressure of the ball 12 is received by the housing 10 in its entirety, extending from the inner cylindrical surface 20 to the inner spherical surface 21, thereby it is possible to prevent stress concentration from deviating.
Patent JP-H03146103-A (JP)
Title: Device for supplying fluid of high viscosity
Inventor: NODA ICHIRO
IPC: B01D29/96
Filed: 1989-11-02
Abstract: PURPOSE:To supply muddy matters evenly into a receiver box by causing muddy matters having been diffused in a diffuser to flow downwardly through a chute, by moving the diffuser from one side of the receiver box to the other side thereof during the diffusion. CONSTITUTION:In an intermittent type horizontal vacuum filter for use in concentration or dehydration of sludge, etc., a diffuser 4 for supplying muddy matters is provided on one side of a receiver box 3 of a square shape for receiving muddy matters. One end of a chute 11 for supplying the muddy matters from the diffuser 4 is positioned in the receiver box 3 for receiving muddy matters, and the diffuser 4 is movable forwardly and backwardly along the other side of the box 3. As a result, the muddy matters can evenly be supplied into the box 3.
Patent JP-H03147841-A (JP)
Title: Stainless steel-resin laminate sheet and product utilizing it
Inventor: IZUMI MASAKI
IPC: B32B15/08
Filed: 1989-11-03
Abstract: PURPOSE:To obtain stainless steel-resin laminate sheet, which can be easily and strongly adhered to base made of synthetic resin or the like by a method wherein first adhesive layer, which is applied to stainless steel, is made of hot-melt adhesive containing graft copolymer of polyolefin-based polymer and unsaturated aliphatic carboxylic acid or its anhydride. CONSTITUTION:The stainless steel-resin laminate sheet 11 concerned is produced by coating one side of thin stainless steel sheet 12 with first hot-melt adhesive layer 13 and further the first hot-melt adhesive layer 13 with second hot-melt adhesive layer 14. The first adhesive layer 13 is made of hot-melt adhesive resin, which is the graft copolymer of polyolefin-based polymer and unsaturated aliphatic carboxylic acid or its anhydride or the mixture of said graft copolymer and polyolefin-based polymer. Said adhesive has so strong adhesion to stainless steel material as to realize practically enough adhesive bonding with the stainless steel sheet 12. In addition, the second adhesive layer 14 is to improve the adhesion between the laminate sheet and base, to which said laminate sheet is to be bonded.
Patent JP-2001070177-A (JP)
Title: Receiving implement for cooking within fish broiling grill of gas cooking stove
Inventor: KOMIYA FUMIYO
IPC: A47J37/06
Filed: 1999-09-01
Abstract: PROBLEM TO BE SOLVED: To lessen the labor for washing after use by using a bendable heat resistant sheet, alternately repeating valley folding and peak folding of the sheet at specified widths to form the sheet to a folding screen tatami mat and turning up both sides of the valley folding to peak folding to create side wall parts. SOLUTION: The heat resistant sheet having a thickness of 10 to 50 μm is used for a main body 7. The width of nearly the same size as the transverse width of a water receiving tray is adopted and with this width as a short side, the longitudinal direction of the vertical side is cut off as desired. The short side cut ports 4 are subjected to repetition of valley fording and peak folding in parallel thereto at the specified width 5 from the cut ports 4 on the short side to form the folding screen tatami mat, by which the valley parts 2 and peak parts 2 are formed. The size of the specified folding width 5 of this time is preferably nearly the same as the height of the water receiving tray and is adequately about 10 to 40 mm.  The points entering the inner side by nearly the same size as the folding width 5 along the valley folds from the end of the valley folds made at this time are determined as turn-back points 6. When the peak folding is repeated therefrom to the ends of the valley folding on the outer side, the valley folds are made diagonally up to the ends of the peak folds on both sides from the turn-back points 6 and the side wall parts 3 rise.
Patent JP-H07117307-A (JP)
Title: Method for adjusting mounting position of thermal line head in thermal line printer
Inventor: SUZUKI MINORU
IPC: B41J25/34
Filed: 1993-10-22
Abstract: PURPOSE:To set a diameter of a platen roller to be small by adjusting a mounting position of a thermal line head to a head support on the basis of a density or thickness of lines printed on a heat-sensitive paper. CONSTITUTION:A controlling device 314 is activated to carry out a heat- generating operation by a thermal line head 154 all over the length of the line head all at once. The above operation in the batch mode is repeated. Mounting screws 212 are tightly fastened when a printed line becomes thickest and densest to truely fix the thermal line head 154 to a head support 156. When the thermal line head 154 is tightly fixed to the head support 156 as above, a heat-generating position X of the thermal line head 154 is surely set at a position where the thermal line head is in touch or out of touch with a platen roller while the head support 156 separated from a mounting instrument 300 is incorporated in tone thermal line printer.
Patent JP-H06230167-A (JP)
Title: Method for replacing nozzle penetrating cover of pressure vessel of nuclear reactor
Inventor: YAAKOPU RUSU
IPC: G21C13/036
Filed: 1993-10-22
Abstract: PURPOSE: To make mounting with no generation of stresses by removing a nozzle, which is welded directly to the cover of a nuclear reactor pressure vessel and guides a control rod, without causing deformation of the cover structure substantially. CONSTITUTION: A drilling is made from inside the cover of a pressure vessel, and a welded nozzle 3 is drawn out and removed. A new nozzle is inserted into a through hole, and a sleeve furnished extendedly onto the nozzle is led until the sleeve comes into contact with the inside of the cover 2, and a welding seam 5 is formed between the sleeve and cover 2.
Patent JP-H11195842-A (JP)
Title: Soldering of optical component to board
Inventor: JOYCE WILLIAM BAXTER
IPC: H01S5/02375
Filed: 1998-10-09
Abstract: PROBLEM TO BE SOLVED: To provide a method and a structure in which especially a component to be soldered to a board is positioned precisely regarding the soldering of the component to the board in optoelectronics. SOLUTION: A structure is composed of a base member 13 and of a material block 12 which is soldered to the base material 13. The block 12 contains a center line which is extended between a first surface and a second surface. In addition, the structure is composed of an optical component 10 which is attached to the third surface of the block 12. A pair of stop members 21 are provided at the base member 13, and they come into contact with the block 12 on a surface other than the third surface.
Patent JP-H07121167-A (JP)
Title: Electronic musical instrument
Inventor: KOKITO SHINICHIRO
IPC: G10H1/053
Filed: 1993-10-22
Abstract: PURPOSE:To provide the electronic musical instrument which can sound plural timbres at the same time with one key pressed while allocating different timbres to an upper and a lower key area. CONSTITUTION:When a split switch and a layer switch are both set ON, a CPU 2 allocates timbre information, stored in an UM register and an LM register, to the upper key area and timbre information, stored in the LM register and an LS register, to the lower key area. Consequently, while the different timbres are allocated to the upper and lower key areas, the timbres can be sounded at the same time with one key pressed.
Patent JP-S63139402-A (JP)
Title: Chip type delay element
Inventor: HIROSE ATSUKO
IPC: H03H7/30
Filed: 1986-12-02
Abstract: PURPOSE:To be low in an actually loading height, small and to facilitate a delaying time adjustment by making a conducting chip substrate into an earth electrode, forming a desired snacked delaying line pattern on a insulating layer formed at a conductive chip substrate and providing further a pat at both terminals of a delay line pattern and a bending part. CONSTITUTION:On the whole surface of the surface of a conductive chip substrate 11, an insulating layer 12 composed of the oxide film formed, and a snaked delay line pattern 13 having a desired long line length is formed on the insulating layer 12. A terminal pat 14 is formed at both terminals of the delay line pattern 133 so that a chip type delay element can be serially connected through a terminal line 16 to a signal line 22 of a circuit substrate 20. Further, an intermediate pat 15 is formed at respective bending parts of the delay line pattern 13, and through a short-circuit line 17, the mutual section of a selected intermediate pat 15 or the selected intermediate pat 15 and the terminal pat 14 are short-circuited. Consequently, the conductive chip substrate 11 can be miniaturized. After actually loading onto the circuit substrate 20, through the short-circuit line 17, the mutual section between the selected intermediate pat 15 or the selected intermediate pat 15 and the terminal pat 14 are short- circuited, and the delaying time can be easily adjusted.
Patent JP-S63141187-A (JP)
Title: Adaptive two-dimensional digital filter circuit
Inventor: TANAKA YUTAKA
IPC: G06T5/20
Filed: 1986-12-03
Abstract: PURPOSE:To simplify a circuit scale by changing arbitrarily the switching of a band limit frequency with a real time. CONSTITUTION:A digital component signal Din inputted to an input terminal 11 is inputted to a first part filter 12 in order to limit the band in a horizontal direction, sub-set data are generated and written into an intermediate memory 13. The intermediate memory 13 has the capacity for two fields, writes in a horizontal direction the sub-set data sampled in a horizontal direction, reads them in a vertical direction and converts the result in a scanning direction. The sub-set data read from the intermediate memory 13 are inputted to a second part filter 14 in order to control the band in the vertical direction, decimated cyclicly in the direction vertical to input data and the sub-set data in the vertical direction are generated. Thus, the sub-set data generated in the horizontal direction and vertical direction are written into a two-dimensional memory 15 which can be accessed with a real time.
Patent JP-2000116937-A (JP)
Title: Game device, information recording medium, and experience value giving method
Inventor: YOSHIOKA KAZUHIKO
IPC: A63F13/58
Filed: 1998-10-12
Abstract: PROBLEM TO BE SOLVED: To enable the experience value on a character to be managed by applying a preset experience value set article to a desired character during a game and giving the preset experience value to the desired character. SOLUTION: Whether all growing items are assigned to a hit point(HP) or assigned dispersed to 'HP', 'magic point(MP)', 'offense power', 'defence power', 'quickness', 'cleverness', etc., is judged (S601). When all is judged to be assigned to the HP experience value by CPU, an experience value of a growing item is given to the MP experience value of a current master for addition calculation (S602). When the HP experience value after the addition is judged by an HP experience value to have reached a new level according to an HP experience value corresponding table, leveling-up treatment is carried out (S603, S604).
Patent JP-2000069830-A (JP)
Title: Lapping device of lawn mower
Inventor: MIZUTANI MAKOTO
IPC: A01D34/46
Filed: 1998-09-02
Abstract: PROBLEM TO BE SOLVED: To enable to efficiently apply a polishing agent to the fitting part of a reel blade with a fixed blade in the polishing work of a lawn mower and lower scattering of the polishing agent to workers and surroundings during the polishing work. SOLUTION: A lapping guide is installed to a main body cowling 4 so as to cover a reel blade and a fixed blade exposed on the bottom surface of the main body cowling 4. A punched hole is made on the lapping guide to apply a polishing agent to a fitting part of the reel blade with the fixed blade.
Patent JP-H09134376-A (JP)
Title: Lsi design system
Inventor: KURAMOTO MITSUO
IPC: G06F17/50
Filed: 1995-11-07
Abstract: PROBLEM TO BE SOLVED: To reduce a repetition operation by a designer conventionally required for LSI design based upon a state transition graphic form and to shorten design time. SOLUTION: Respective states and transition lines belonging to a range specified by an input object selecting module 103 are specified altogether as an information definition target. Since it is unnecessary to define information such as a transition condition, the priority of transition and the description of operation while specifying a state or a transition line to be an object for defining the information at each time of definition, processing for defining the information can be efficiently executed. Since a priority generating module 108 automatically sets up the transition priority of arranged transition lines in accordance with the arrangement order of the transition lines, manual transition priority defining processing is made unnecessary. Consequently the repetition operation of a designer can be sharply reduced and the design time can be shortened.