baber/WOPTO huggingface dataset:
Patent JP-H05277660-A (JP)
Title: Method for continuously casting clad steel sheet by twin rolls
IPC: B22D11/06
Filed: 1992-04-02
Abstract: PURPOSE:To provide a continuous casting method preventing the mixture of molten metals at upper and lower layers in a molten metal pouring basin part, in the casting method for continuously producing a clad steel sheet by twin rolls. CONSTITUTION:By arranging magnetic poles 6a at the outside in both end surfaces of side weirs 2 arranged at both surfaces of twin rolls 1, a boundary layer is formed by a static magnetic field zone 7 in the molten metal pouring basin part 3. Then, the molten metal for forming the outer layer solidified shell 8a at the upper layer of the boundary layer and the molten metal for forming the inner layer solidified shell 8b at the lower layer are poured and the solidified shells at the inner and the outer layers are integratively composed at the roll kiss 10 point or the front or the rear parts thereof to produce the clad steel sheet. By this method, the mixture of the molten metals at the upper and the lower layers in the molten metal pouring basin parts can be prevented and therefore, this method is applied to the production of the clad steel sheet using the material having different densities too and the clad steel sheet having extremely clear boundary of the inner and the outer layers is obtd.
Patent JP-2000299356-A (JP)
Title: Structure and method for mounting bga-type semiconductor package
Inventor: YASUDA MASAO
IPC: H01L21/56
Filed: 1999-04-15
Abstract: PROBLEM TO BE SOLVED: To improve service life of a connection part, and to easily repair failure, when the failure is detected, by partially including a reinforcing resin in the gap between a BGA(ball grid array)-type semiconductor package and a mounting substrate. SOLUTION: BGA-type semiconductor packages 1 are electrically connected to a mounting substrate 2, a reinforcing resin 4 is partially provided at four corners of the gap between the BGA-type semiconductor packages 1 and the mounting substrate 2, and the reinforcing resin 4 is used for reinforcing a bump connection part 3 for electrically connecting the BGA-type packages 1 to the mounting substrate 2. Then, the coefficient of thermal expansion of the bump connection part 3 is allowed to made to match with that of the reinforcing resin 4, thus improving the life of the connection part and easily repairing failure, when a failure is found.
Patent JP-H10300111-A (JP)
Title: Floor heater
Inventor: KAJI YOSHIAKI
IPC: F24D19/02
Filed: 1997-04-25
Abstract: PROBLEM TO BE SOLVED: To provide a rectangular heated area comprising heating portions connected with each other by making floor heating panels neighboring to each other joined by a dovetail joint in both a lateral direction and a longitudinal direction even when the direction of the floor heating panels neighboring in the longitudinal direction are reversed. SOLUTION: In this device, a groove is formed on entire end surfaces of four sides of a floor heating panel A. Two floor heating panels A are arranged in parallel in longitudinal direction while making non-heating portions (b) directed in an opposite direction. The floor heating panels A which are arranged in the above manner are then arranged in a lateral direction. Joint members 11 are disposed between the side faces of the floor heating panels A neighboring in a longitudinal direction as well as between floor heating panels A neighboring in a lateral direction. These joint members 11 are fitted into recesses so as to make neighboring floor heating panels abut with each other.
Patent JP-H02299841-A (JP)
Title: Metallic extensible polypropylene film with improved metallic breakage resistance
Inventor: ERUDORITSUJI MIRUFUOODO MAUNTO
IPC: B32B15/08
Filed: 1990-04-24
Abstract: PURPOSE: To obtain a multilayered polypropylene film enhanced in metal fracture resistance by simultaneously extruding a polypropylene homopolymer core layer and a skin layer with a specific thickness comprising an ethylene/propylene copolymer or the like to form the skin layer on one surface of the core layer. CONSTITUTION: A multilayered film structure is obtained by simultaneously extruding a polypropylene homopolymer core layer and a skin layer with a thickness of about 2 gauge or less comprising an ethylene/propylene copolymer or an ethylene/propylene/butene-1(EPB) terpolymer to form the skin layer on one surface of the core layer. Next, a film support is biaxially stretched and the skin layer is subjected to flame or corona discharge treatment and metal coating is applied to the treated skin layer. The polypropylene homopolymer used in the core layer of the film has a polymeric structure comprising 80-100% isotactic unit and containing a series of asymmetric atoms arranged on a polymer chain in the same form at a regular interval. The EP copolymer of the skin layer consists of about 0.5-10 wt.% ethylene and about 99.5-90 wt.% propylene.
Patent JP-H07319102-A (JP)
Title: Silver halide photographic sensitive material
Inventor: ONODERA SHOJI
IPC: G03C1/30
Filed: 1994-05-23
Abstract: PURPOSE:To provide the photosensitive material superior in stagnation stability of a coating solution and rapid in progress of hardening reaction and almost free from postreaction after coating and any fluctuation of photographic performance even in storage for a long period. CONSTITUTION:The photosensitive material having at least two hydrophilic colloidal layers on a support contains formalin in a coating solution for forming at least one of these layers and a 1,3-dihydroxybenzene derivative in the coating solution for forming the other layer.
Patent JP-S61265825-A (JP)
Title: Back-surface treating apparatus for semiconductor substrate
Inventor: SUZUKI YOSHIAKI
IPC: H01L21/26
Filed: 1985-05-20
Abstract: PURPOSE:To obtain a back-surface treating apparatus for a semiconductor substrate, in which a surface active layer is not contaminated, by converging light from a light source so that a plurality of focal points are formed on the back surface of the semiconductor substrate. CONSTITUTION:A light converging device 10 is provided between an infrared-ray lamp 4 and a semiconductor substrate 1. Light emitted from the infrared-ray lamp 4 becomes parallel light becomes through a convex lens 7 and converged by converging lenses 8. Many focal points of the convergent lenses 8 are all formed on a back surface 6 of the semiconductor substrate. The inside of a quartz chamber 3 is a vacuum or filled with an inactive gas. Formation of a reactive product on the surface of the silicon substrate is prevented. The silicon substrate is kept at a very high cleanliness. In this way, a strain field caused by thermal strain, which is yielded between the focal points at a high temperature part and a low temperature part in the vicinity of the focal points, is introduced in the back surface of the semiconductor substrate in the vicinity of the focal points, and gettering is carried out.
Patent JP-S5632428-A (JP)
Title: Production of alpha-diketone
Inventor: HIDAKA SETSUO
IPC: C07C45/28
Filed: 1979-08-27
Abstract: PURPOSE: To vapor-phase catalytic oxidation of a ketone bearing a methylene group adjacent to the carbonyl with oxygen is conducted in the presence of a catalyst of tricobalt tetroxide to produce an α-diketone used as an intermediate of imidazole in high selectivity.  
     CONSTITUTION: The reactor is filled with a catalyst of tricobalt tetroxide and a gas of ketone bearing a methylene group adjacent to the carbonyl and oxygen are introduced into the reactor at a space rate of 300W5,000hr -1 . The resultant reaction mixture is absorbed in water or organic solvent and they are subjected to distillation in accordance with usual process to give an α-diketone such as diacetyl. The tricobalt tetroxide catalyst is prepared by adding aqueous ammonium carbonate to aqueous cobalt nitrate, filtering and washing the resultant cobalt carbonate precipitation, followed by drying and calcination. 
     COPYRIGHT: (C)1981,JPO&Japio
Patent JP-S5633725-A (JP)
Title: Connecting system for external unit
Inventor: ITOU YOSHITAKA
IPC: G06F13/12
Filed: 1979-08-27
Abstract: PURPOSE: To facilitate an easy formation of the central control unit into LSI, by securing an interface in terms of the hardware with connection of the external control unit and even trough the input and output interfaces are limited to three buses.  
     CONSTITUTION: When the central control unit 1 executes the instruction which means the contents of the data bus transmission/reception circuit 101, the address of the external control unit is supplied to the address bus transmission/reception circuit 102 via the address bus 3. And the command is supplied to the control part 103 via the control bus 4 to transmit the contents of the circuit 101. Here the address of the external control unit received at the circuit 102 is detected by the unit number collating circuit 116 to be indentical to the address of the self-unit. And thus the control part 103 transfers the data of the input circuit 111 to the circuit 101 via the AND circuit 106 and the OR circuit 108, and then transmits the contents onto the data bus 2. And at the same time, the transmission signal is sent to the control bus 4 to inform it to the unit 1. Receiving this information, the unit 1 stores the data on the bus 2 into the designated register to complete the working. 
     COPYRIGHT: (C)1981,JPO&Japio
Patent JP-H07329292-A (JP)
Title: Ink jet recording head
Inventor: MORIKOSHI KOUJI
IPC: B41J2/14
Filed: 1995-04-10
Abstract: PURPOSE:To efficiently discharge ink droplets despite the deforming state of a vibrating plate. CONSTITUTION:The central point C1 of a piezoelectric vibrator 12 is deviated by DELTAd from the center C2 of the length L of the effective displacing area of a vibrating plate 6 to a nozzle opening 2 side to be brought into contact with the plate 6, and hence the displacement of the vibrator 12 for contracting a pressure generating chamber 4 is effectively transmitted to ink near the opening 2.
Patent JP-H10297037-A (JP)
Title: Dot printer
Inventor: KUSHIMA KOKI
IPC: B41J11/62
Filed: 1997-04-25
Abstract: PROBLEM TO BE SOLVED: To protect a ribbon separator against damage by bending the ribbon separator in such a direction as the forward end thereof recedes from a print sheet while ensuring a specified distance between the forward end of the ribbon separator and the front force of the print head thereby enhancing the rigidity of the ribbon separator. SOLUTION: A ribbon separator 1 is fixed to a print head 2 and the forward end 9 of the ribbon separator 1 is bent in the direction receding from a print sheet 6 while ensuring a specified distance 4 between the forward end 9 of the ribbon separator 1 and the front face of the print head 2 in order to facilitate loading of an ink ribbon 3 and further bent 7 reversely toward the print sheet 6 side at a position closer to the root side than the first bending position thus forming a protrusion 10 extending in the breadthwise direction of the print sheet 6. According to the arrangement, rigidity of the ribbon separator 1 is enhanced and the print sheet 6 is prevented from being caught at the forward end 9 of the ribbon separator 1 when the print sheet 6 is removed in the direction of an arrow 8.
Patent JP-S60252463-A (JP)
Title: Preparation of indole
Inventor: IMANARI MAKOTO
IPC: B01J27/138
Filed: 1984-05-29
Abstract: PURPOSE:In reacting an aniline with ethylene glycol, to obtain the titled compound useful as a raw material for amino acids such as tryptophan, etc. in high yield without using a carrier gas, by using a catalyst containing a specific compound as a catalyst. CONSTITUTION:An aniline is reacted with ethylene glycol in a ratio of preferably 1mol aniline to 0.01-5mol, preferably 0.05-2mol ethylene glycol, by the use of a catalyst containing cadmium bromide as a catalyst, to give the aimed compound. Cadmium bromide or a combination of cadmium bromide and another compound is directly used as the catalyst, or supported on a carrier and used. The reaction can be carried out in any of gaseous phase, liquid phase, and gas- liquid mixed phase. For example, in the case of the liquid reaction, an amount of the catalyst used is preferably 0.001-0.1mol based on 1mol aniline.
Patent JP-S599071-A (JP)
Inventor: KAARU FUOSUTAA JIYONSON
IPC: B41J5/00
Filed: 1983-06-20
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H06320257-A (JP)
Title: Refractory block for reducing inclusion of molten steel and method for reducing inclusion
Inventor: HIRASHIRO TADASHI
IPC: B22D11/112
Filed: 1993-05-11
Abstract: PURPOSE:To efficiently adsorb the inclusion with the simple operation by dipping the refractory blocks having a plurality of projections to absorb the inclusion in the molten steel in the tundish or floating the refractory blocks on the molten steel in the tundish. CONSTITUTION:The refractory block is the refractory block 20 of the tetrapot shape having a plurality of projections, providing the stability and the straightening effect when the molten steel is filled in the tundish 2. In addition, the material is of Ca base which is excellent in the adsorption of the inclusion. From the viewpoint of more effective adsorption of the inclusion, the filling range is the molten steel falling range 9 to supply the molten steel from the ladle 1 to the tundish 2, and the floating range is the range 10 to float and separate the inclusion which is the floating part of the inclusion and the molten steel supplying range 11. In order to prevent the out-flow of the refractory blocks in the transverse direction when the blocks are packed in the vertical direction, only the upper part of the upper gate 5 is made the lattice gate 22 or the communicating hole 23 is provided to prevent the out-flow in the transverse direction.
Patent JP-2000299375-A (JP)
Title: Manufacturing method for semiconductor device
Inventor: MATSUO MAKOTO
IPC: H01L23/52
Filed: 1999-04-16
Abstract: PROBLEM TO BE SOLVED: To eliminate a residue after patterning of a gate electrode or a wiring patterning and reduce variations in gate wiring resistance, when the gate wiring is formed in a scanned state over and across a trench isolation. SOLUTION: After a silicon film is formed, arsenic ions 17 or silicon is implanted into the silicon film to modulate a dent of a silicon film, corresponding to a dent 9 of an embedded oxide film for insulation isolation previously. Then, when a metal silicide film formation step and a heat treatment step for reducing resistance are carried out, remaining metal silicide is not generated at a position corresponding to the dent after the patterning of gate electrode or gate wiring. As a result, layer resistance of the gate wiring can be made a normal low valve.
Patent JP-H07140697-A (JP)
Title: Electrophotographic toner
Inventor: SHIMIZU YOSHITAKE
IPC: G03G9/08
Filed: 1992-04-28
Abstract: PURPOSE:To obtain an electrophotographic toner attaining tight melt sticking to a fixing sheet even in ultrahigh-speed copying, excellent in anti-offsetting property, having stable fluidity and electrostatic chargeability and ensuring little spent toner in a two-component system. CONSTITUTION:In an electrophotographic toner consisting of toner particles contg. at least a bonding resin and a releasing agent and of an additive, a propylene-olefin copolymer is used as the releasing agent and fine hydrophobic silica particles having <=13nm average particle diameter of primary particles are used as the additive.
Patent JP-S5233788-A (JP)
Title: Signal identification apparatus in ae signal position detection appara tus
Inventor: IGARASHI MIYUKI
IPC: G01N29/14
Filed: 1975-09-10
Abstract: PURPOSE: To detect true defect position at high accuracy by using the attenuation in amplitude of AE signals according to a fixed relation formula when they propagate within an object being measured. 
     COPYRIGHT: (C)1977,JPO&Japio
Patent JP-S5812064-A (JP)
Title: Picture character train editing device
Inventor: OOMACHI TAKAO
IPC: G06F17/24
Filed: 1981-07-13
Abstract: PURPOSE:To easily perform replacement, addition and deletion of characters, by cutting out character trains of a picture signal, and extracting an address of  diagonal lines of a rectangular surrounding the trains, forming an address table  and correcting the table according to editing processing. CONSTITUTION:A picture signal (a) of a character train read out with a scanner is stored in a picture memory 1 and a picture signal of additional characters is stored in an auxiliary memory 2. The character train signal read out from the memories 1 and 2 is cut out to an arbitrary length, the addresses of diagonal lines surrounding each character train to be cut out are picked up and stored in an address table memory 4. An editing processing section 5 performs correction such as replacement of order of the addresses in the memory 4, deletion, and addition with an instruction signal (f) externally and inputs the address table as the result of correction to an output processing section 6. The processing section 6 replaces rows of the character train according to the output location instruction (i), and when the split between characters is required, the section 6 given an instruction to an inter-character separation section 8 and receives the address of the characters to be separated, forms an output location address table, stores it in a memory 7 and outputs an output signal (n) based on the storage.
Patent JP-H02288275-A (JP)
Title: Superconducting coil device
Inventor: KANO SEIJI
IPC: H01L39/04
Filed: 1989-04-27
Abstract: PURPOSE:To obtain a superconducting coil device in which stress is not almost generated at a load supporting material even if it is thermally contracted by engaging the material with an outer tank coupling rod in a slidable structure in a direction in contact with the rod. CONSTITUTION:In a device, load transmission fittings 8 are inserted newly as a load supporting material between a first load supporting material 7a and an outer tank coupling rod 6, the fittings 8 are clamped to the material 7a, and formed to slide to the rod 8 in the longitudinal direction of the device. When the central interval of the rods 6 of the longitudinal direction of the device is L, a gap provided between the fitting 8 and the rod 6 is l and the thermal shrinkage of a stainless steel material, aluminum material from an ambient temperature to liquid refrigerant temperature is 3/10000, l becomes l=3/1000XLX1/2. The gap l is provided in advance between the fittings 8 and the rod 6 to lower the temperature of the fittings 8 and to slide it toward the center of the gap l. Accordingly, a stress to be generated at the supporting material due to thermal shrinkage can be suppressed.
Patent JP-2000308051-A (JP)
Title: Signal compressor, recording and reproducing device, and method for removing noise
Inventor: ETO TORU
IPC: H04N19/196
Filed: 1999-04-16
Abstract: PROBLEM TO BE SOLVED: To enable an AV(audio and/or video) server provided with a compressor which can compress AV signals at a variable compression rate to reduce the rate of noise in compressed AV signals over all compression rates of the compressor. SOLUTION: In the input port 2 of an AV server 1, a low-pass filter 2A which performs band restriction on inputted AV signals and has a variable cut-off frequency, a compressing means 2B which compresses the AV signals band-restricted by means of the filter 2A at a variable compression rate, and a control means 2D which raises or lowers the cut-off frequency in accordance with the level of the compression rate of the compressing means 2P are provided.
Patent JP-H06298551-A (JP)
Title: Sealing structure
Inventor: SATO HIROYUKI
IPC: H01L23/10
Filed: 1993-04-13
Abstract: PURPOSE:To enable low-pressure sealing bond of copper, to simplify a process, to prevent environmental pollution and to lighten a member by specifying materials of both metals to be sealed and using lead-based glass as sealing glass. CONSTITUTION:Doughnut low-melting sealing glass 3 having a hole 3a composed of lead (Pb0)-based glass having <=700 deg.C sealing temperature is set on a hole 1a of a base plate 1 of a first metal constituted of any of copper, nickel, metal plated with nickel and a nickel alloy having plural holes 1a to seal a lead pin 2 and the lead pin 2 of a second metal made of any of the same material as that of the first metal is set on the hole 3a. Al is laid as a bonding pad for wire bonding of gold, etc., for electrically connecting the lead pin 2 to another part in the interior of the base plate 1 on the top of the lead pin 2. Airtight sealing is carried out by taking advantage of thermal expansion of both the metals in an atmosphere of N2 containing <=1.0ppm oxygen at 500 deg.C for 20 minutes.
Patent JP-S5335832-A (JP)
Title: Water-turbine casing
Inventor: SHINOHARA MORIMICHI
IPC: F03B11/02
Filed: 1976-09-16
Abstract: PURPOSE: To carry out easily and correctly the manufacture, by means of forming shell plate connected with two at least to the same diameter, in the waterturbine casing having plural shell plates manufactured with steel plate. 
     COPYRIGHT: (C)1978,JPO&Japio
Patent JP-S5734568-A (JP)
Title: Key input device
Inventor: TAKEDA HIROAKI
IPC: G03G15/00
Filed: 1980-08-11
Abstract: PURPOSE:To prevent a number of copying from wrong setting, by executing setting of the same number independent of the input order of set keys in setting a number of sheets of copying. CONSTITUTION:A key 1 for setting a continuous copy number to 10, keys for setting figures of the first order of a continuous copy number, a copy start key 5, and indicators 7-11 are installed on an operation panel. A signal sent from each key is provided to a muCPU10 to execute copy action control, number indication, etc. in accordance with the input. In setting a copy number, setting of the same number can be made irrespective of the input order of the keys 1, 2.
Patent JP-H04337667-A (JP)
Title: Solid-state image sensing element
Inventor: FUJII KOICHI
IPC: H01L27/14
Filed: 1991-05-15
Abstract: PURPOSE:To prevent a false signal such as a smear, etc., from being generated by forming a light shielding film with an opening in a photoelectric conversion region which is formed through an insulation film on a semiconductor substrate with a black dyeing layer. CONSTITUTION:A P well 202 is formed on an n-type semiconductor substrate 101 and an n-type photoelectric conversion region 103, an n-type electric charge transfer region 104, and a P<+>-type channel stopper 105 are formed within a surface region of a P well 102. An electric charge transfer electrode 107 is located on a semiconductor substrate through a silicon oxide film 106 and further a light shielding film 109 which is formed by a black dyeing layer with an opening in the photoelectric conversion region 103 through a layer insulating film 108 is located on it. This black dyeing layer is formed by forming the layer insulating film 108, coating casein which is a layer to be dyed, then performing its patterning to have an opening with a desired size at a light- reception part, and then dyeing the casein with a black dye. The light shielding film 109 using this black dyeing layer prevents reflection of light and eliminate trouble due to reflected light.