baber/WOPTO huggingface dataset:
Patent TW-456133-B (TW)
Title: Method and system for interfacing a wireless communication device with an accessory
Inventor: BLOW ANTHONY T
IPC: H04M1/72406
Filed: 1999-04-09
Granted: 2001-09-21
Abstract: A method and system for interfacing a wireless communication device (100) with an external accessory (102). The system includes an attach detector (110) for detecting an attachment of the wireless communication device and the external accessory (102). In response to the attachment detection, a controller (108) downloads accessory interface software from the external accessory (102) to the wireless communication device (100). Thereafter, the wireless communication device interfaces with the external accessory according to instructions in the accessory interface software. As a result, the non-volatile memory size requirements for the mobile station (100) are reduced due to the accessory specific interface software being stored in the external accessory (102) itself for dynamic upload to the mobile station only when it is required.
Patent TW-434065-B (TW)
Title: Process for making an indium-tin-oxide shaped body
Inventor: STENGER BERND
IPC: C23C14/34
Filed: 1999-05-13
Granted: 2001-05-16
Abstract: A process for making an indium-tin-oxide shaped body, comprising: (a) filling an indium-tin-oxide powder into a first flexible mold, the indium-tin-oxide powder having a specific BET surface of at most 3 m<SP>2</SP>/g with a mean primary particle size of 0.03 mu m to 1.0 mu m and/or having a density of at least 40% of theoretical density after cold pressing at a pressure of 100 MPa and/or the indium-tin-oxide powder being made by reacting at least two reaction partners comprising a molten indium-tin-metal alloy as a first reaction partner and oxygen as a second reaction partner in a plasma arc in a plasma chamber provided with an inlet opening for the reaction partners and an outlet with a gas-supply device to obtain a material, and quenching the material at the outlet opening of the plasma chamber with a gas stream which cools the material at a cooling rate of 10<SP>5</SP> K/s to 10<SP>8</SP> K/s to +50 DEG C to +400 DEG C; (b) cold pressing the indium-tin-oxide powder at a minimum pressure of 100 MPa; (c) placing the cold compact released from the first mold in a ceramic powder in a second mold, the ceramic powder having a maximum particle diameter of 250 mu m, and a melting point and a sintering temperature higher than +800 DEG C, the melting point of the second mold being higher than 800 DEG C and the second mold being ductile under the conditions of a hot isostatic pressing; (d) sealing the second mold in a gastight manner; and (e) subjecting the wetted cold compact to hot isostatic pressing at a minimum temperature of +800 DEG C and a minimum pressure of 20 MPa.
Patent TW-507134-B (TW)
Title: Digital-analog converter
Inventor: KOYANAGI YUKIO
IPC: G06G7/186
Filed: 1999-06-16
Granted: 2002-10-21
Abstract: It is an object of the present invention to provide a digital-analog converter that can obtain an output waveform with less distortion without increasing the operating speed of parts. A D/A converter comprises a D/A converter 10, four voltage holding sections 11-1 to 11-4, four step function waveform generating sections 12-1 to 12-4, a voltage synthesis section 14, two integration processing sections 16, 18, and a timing control section 20. Each voltage holding section holds a voltage corresponding to each sequentially input four digital data, and each step function waveform generating section generates a step function waveform having a voltage level corresponding to the held voltage. The voltage synthesis section 14 synthesizes the step function waveforms generated by each step function waveform generating section. Then, the two integration processing sections 16, 18 each integrate twice the synthesized waveform to generate a continuous analog voltage that joins input digital data together.
Patent TW-425706-B (TW)
Title: Dynamic random access memory with capacitor and its fabrication method
Inventor: JENG SHIANG-YUAN
IPC: H01L27/108
Filed: 1999-08-12
Granted: 2001-03-11
Abstract: This invention provides the fabrication method of dynamic random access memory that has simple geometry pattern active region, self-aligned crown-shaped capacitor and, bit line and polysilicon plug formed at the same time. First, a semiconductor substrate having active regions is provided, in which plural insulation regions are used to isolate from the other active regions. Gate and inter connection are formed individually on semiconductor substrate and insulation region, additionally, the corresponding source region and drain region are formed on substrate. A silicon nitride layer is deposited on substrate to protect the insulation layer stated above from etching damage. After forming an opening in the insulation layer to expose substrate, the silicon nitride layer is stripped to remain cylinder insulation material on the gate. A polysilicon layer is deposited to connect the exposed source and drain regions, in which the second silicon nitride layer is deposited on this polysilicon layer. A mask layer is used to etch the second silicon nitride layer and the polysilicon layer until the cylinder insulation material so as to form a bit line. This polysilicon layer is made to remain in between cylinder insulation materials such that plural polysilicon flattop plugs connected with the source/drain regions are formed, in which the polysilicon flattop plug located below the bit line constitutes the bit line contact. A mask layer is used to etch the second insulation layer to form plural contact openings so as to expose the polysilicon flattop plug on both sides of bit line. After that, crown-shaped capacitor is formed at the contact opening stated above.
Patent TW-498123-B (TW)
Title: Process and apparatus for making papermaking belt
Inventor: AMPULSKI ROBERT STANLEY
IPC: D21F11/00
Filed: 1999-08-13
Granted: 2002-08-11
Abstract: A process and an apparatus for making a papermaking belt are provided, the belt comprising a reinforcing structure and a resinous framework joined together. The preferred continuous process comprises the steps of depositing a flowable resinous material onto a patterned molding surface; continuously moving the molding surface and the reinforcing structure at a transport velocity such that at least a portion of the reinforcing structure is in a face-to-face relationship with a portion of the molding surface, transferring the flowable resinous material from the molding surface onto the reinforcing structure; causing the flowable resinous material and the reinforcing structure to join together; and solidifying the resinous material thereby forming the resinous framework joined to the reinforcing structure. The apparatus comprises a molding member leaving a patterned molding surface comprising a plurality of molding pockets to carry a flowable resinous material therein; a means for depositing the flowable resinous material into the molding pockets of the molding surface; a means for moving the reinforcing structure in a predetermined direction; a means for moving the molding member in a predetermined direction such that the flowable resinous material is transferred from the molding pockets onto the reinforcing structure.
Patent TW-557438-B (TW)
Title: Device for maintaining contents of basic input output system (BIOS) chip and method thereof
Inventor: TANG JR-CHIAN
IPC: G06F9/44
Filed: 1999-09-28
Granted: 2003-10-11
Abstract: The present invention relates to a device for maintaining contents of basic input output system (BIOS) chip and a method thereof. Particularly the present invention is a technology to be applied for detecting and updating contents of BIOS chip when power-on is inaccessible due to BIOS damage. In accordance with the technology, the maintaining device stores all the data required for updating the BIOS chip and, when computer power-on is inaccessible, can be connected with the computer to form a data transmission path. By means of the data transmission path, not only all the power, address, and data buses required by the computer can be provided but also, at the same time, the updated contents of the BIOS chip can be obtained and debugged. When any error or overtime is found in the contents of the BIOS chip, updating will be carried out on the BIOS chip based on the updated data. Thus, research and development efficiency can be improved and fabrication cost can be lowered.
Patent TW-411286-B (TW)
Title: Air sander
Inventor: SHIMADA HIROSUKE
IPC: B24B23/00
Filed: 1999-11-04
Granted: 2000-11-11
Abstract: This invention is to provide a air sander which can freely switch over into, a condition in which powder dust generated during air sander operation is suctioned by itself, a condition in which it is suctioned by utilizing a suction force of the other suction source, and a condition in which air sander is used as a sander merely. This air sander rotates a polishing member 15 by supplying air from an air source through an introduction port 2 and driving a built-in air motor and exhausts exhaust air from the air motor through an exhaust port 3. In this air sander, a port for sucking dust 4 is integrally formed in an air sander main body, a flow passage 20 communicating the port for sucking dust 4 with the exhaust port 3 is integrally formed in the main body, and a muffler 19 communicating and shutting off the flow passage is detachably provided in the exhaust port.
Patent TW-457198-B (TW)
Title: Bicycle dropout frame member and bicycle dropout
Inventor: OCKENDEN LYNN MARIE
IPC: B62K27/00
Filed: 1999-12-13
Granted: 2001-10-01
Abstract: An improved bicycle dropout frame member for simultaneously mounting a plurality of accessories such as panniers, baskets, trailer hitch and trailer, luggage carrier, wheel fender, etc. to a bicycle frame is disclosed. The improved bicycle dropout may include one or more mounting studs or slots for releasably receiving accessory support legs. The central body may also include a bore or a slot for receiving a towing hitch apparatus to enable a rider to tow a trailer behind the bicycle incorporating the improved bicycle dropout frame member of the present invention.
Patent TW-451354-B (TW)
Title: Coating, discharge means, and coating method
Inventor: MUKAI KIICHIRO
IPC: B05C11/08
Filed: 1999-12-28
Granted: 2001-08-21
Abstract: The present invention provides a coater, a discharge means, and a coating method which form a continuous film such as a resist. A coater 20 which forms a continuous film on the surface of a substrate 21 is equipped with a holding table 22 for holding the substrate 21, a driving motor 25 for rotating/driving the holding table 22, a storage chamber 27 for storing a coating liquid, and a discharge means 26 having a plurality of orifices 33 for injecting the coating liquid stored in the storage chamber 27 to the place facing the substrate 21.
Patent TW-453047-B (TW)
Title: Fast adaptive differential pulse code modulation system
Inventor: LIAU DUNG-TSAI
IPC: H03M7/00
Filed: 2000-01-20
Granted: 2001-09-01
Abstract: The present invention relates to a kind of fast adaptive differential pulse code modulation system that mainly adopts comparator and the continuously approaching method in addition to the use of look-up table, such as quantized table, quantized selection table and quantized reference table, to perform the encoding and decoding of voice signal. As a result, it is capable of saving the computation time and reducing the memory capacity required for storing voice. In addition, during the encoding of voice signal, the most efficient compression of voice signal can be obtained without the loss of fidelity when it is broadcasted. Furthermore, when performing the operation of continuously approaching method, a single comparator is used to perform the comparison between the input value and the previous value of the continuously approaching method. Therefore, only simple hardware circuit is required to complete the pulse code modulation.
Patent TW-441054-B (TW)
Title: Semiconductor packaging technology
Inventor: JOU LI-KUEN
IPC: H01L23/28
Filed: 2000-02-21
Granted: 2001-06-16
Abstract: The present invention relates to a semiconductor packaging technology which is a special packaging process and mold formation technology for the formation of pre-mold dam on PCB or BGA substrate. A pad piece and a mold plate are used by the present invention, wherein the pad piece has a through hole connected with the gate, and there is a bump whose size is less than the through hole, so that a circular mold cavity can be formed between the through hole and the bump when the pad piece and mold plate overlap and cover the substrate, the formation of pre-mold dam can be done and frame-like surrounded on the substrate after glue instilling and filling. Thereby the glue overflow and insubstantial filling phenomenon can be effectively avoided, so that the pre-mold dam structure and the quality of substrate circuit structure can be promoted, and the yield rate and the reliability of the packaging product can be enhanced; at the same time, the formation operation of the pre-mold dam is included in the whole chip packaging process, which forms an upstream-downstream relationship with the installation and wire-bonding operation to thereby can be simplified and integrated together, so it is more convenient for fast and massive packaging formation to increase the productivity and reduce the production cost.
Patent TW-436853-B (TW)
Title: Cold cathode lamp tube
Inventor: CHEN SHIOU-WEN
IPC: H01J61/35
Filed: 2000-03-16
Granted: 2001-05-28
Abstract: The present invention relates to a cold cathode lamp tube, which is constituted by forming a lamp with a substantial D-type body, coating an UV reflection thin film which can reflect UV material on the inner wall of the lamp, coating a visible light reflection layer on the exterior wall other than the exit-light face of the lamp, and coating a fluorescent dose inside the UV reflection thin film except the exit-light face, so that the light can transmit through the exit-light face completely, and the intrinsic and damage loss of the tube is reduced to enhance the light-emitting performance. Furthermore, the light-emitting area is increased by lengthening the parallel section of the lamp at the same time, which increases the output performance of the photo energy.
Patent TW-461845-B (TW)
Title: Abrasive tools for grinding electronic components
Inventor: MATSUMOTO DEAN SABURO
IPC: B24D3/00
Filed: 2000-05-04
Granted: 2001-11-01
Abstract: Abrasive tools containing high concentrations of hollow filler materials in a resin bond are suitable for polishing and backgrinding of hard materials, such as ceramic wafers and components requiring a controlled amount of surface defects. These highly porous abrasive tools comprise fine grit abrasive grain, such as diamond abrasive, along with the hollow filler material and resin bond.
Patent TW-468214-B (TW)
Title: A gate structure on semiconductor wafer surface
Inventor: KUO CHIEN-LI
IPC: H01L21/28
Filed: 2000-05-17
Granted: 2001-12-11
Abstract: The invention provides a gate structure used on a semiconductor wafer. The semiconductor wafer comprises a substrate, wherein the gate structure is formed on a predetermined region of the surface of the substrate. The gate structure comprises a dielectric layer, a conductive layer, a silicide layer, a buffer layer, an anti-reflection layer and an insulating layer located on the surface of the substrate in sequence. The buffer layer is used to reduce the stress of the silicide layer to avoid the peeling of the silicide layer and the anti-reflection layer and to prevent the silicide layer from forming oxide by reacting with the anti-reflection layer containing oxygen.
Patent TW-476811-B (TW)
Title: Plasma process device
Inventor: HIRAYAMA MASAKI
IPC: H01L21/302
Filed: 2000-05-19
Granted: 2002-02-21
Abstract: A plasma process device capable of forming homogeneous plasma and coping with a large size substrate less costly can be obtained. The plasma process device includes a processing chamber, microwave guiding means, a shower plate and a reaction gas supply passage. The microwave guiding means guides a microwave into the processing chamber. The shower plate has a gas inlet hole to supply to the processing chamber a reaction gas attaining a plasma state by the microwave, and a lower surface facing the processing chamber and an upper surface positioned on the opposite side of the lower surface. The reaction gas supply passage is positioned on the upper surface of the shower plate and supplies the reaction gas to the gas inlet hole. A wall surface of the reaction gas supply passage includes an upper surface of the shower plate and a conductor wall surface opposing the upper surface.
Patent TW-448522-B (TW)
Title: Structure body of semiconductor chips with stacked connection in a flip chip manner and its manufacturing method
Inventor: TANG WEI-SEN
IPC: H01L21/60
Filed: 2000-06-03
Granted: 2001-08-01
Abstract: This invention is about the structure body of semiconductor chips with stacked connection in a flip chip manner and its manufacturing method. In this invention, a coating layer is laid on the active surface of the first semiconductor chip. Solder pads on the active surface are exposed by etching and a flash-stop structure is formed at the outside of preset chip accepting region on the active surface. Then, the second semiconductor chip is bonded to the chip accepting-region of the first semiconductor chip through the use of solder bump so as to make the first semiconductor chip form an electric connection relationship with the second semiconductor chip. After that, a glue-finning manner is used to make underfill material fill in the gap between the first semiconductor chip and the second semiconductor chip so as to complete the flip chip connection between the first semiconductor chip and the second semiconductor chip. Because this flash-stop structure is formed outside the projection area of the second semiconductor chip, when performing the filling operation of the underfill material, the underfill material will be stopped by flash-stop structure and will not flash to the active surface part of the first semiconductor chip located outside this flash-stop structure so as to protect the bonding pads on the active surface part located outside this flash-stop structure from contamination.
Patent TW-558792-B (TW)
Title: Process for manufacturing semiconductor device
Inventor: KAWANO HIROYUKI
IPC: H01L21/76
Filed: 2000-06-08
Granted: 2003-10-21
Abstract: A process for manufacturing a semiconductor device comprising the steps of: depositing a polish-stopper film on a semiconductor substrate, applying a photoresist on the polish-stopper film and removing the photoresist from a region for forming a device isolation region to form an opening; dry etching using the photoresist as an etching mask to form a trench of a predetermined depth in the semiconductor substrate; removing the photoresist; forming a first insulating film and a second insulating film in sequence to bury the trench, the second insulating film being capable of being etched by the same etching step as that for the first insulating film and having an etching rate greater than that of the first insulating film; polishing the first and second insulating films by CMP method until a surface of the polish-stopper film is exposed; removing the polish-stopper film; and removing the first and second insulating films projected from a surface of the semiconductor substrate by etching using the same etchant, thereby to form a device isolation region in the trench.
Patent TW-538059-B (TW)
Title: Catalyst components for the polymerization of olefins and catalysts therefrom obtained
Inventor: SACCHETTI MARIO
IPC: C08F10/00
Filed: 2000-06-15
Granted: 2003-06-21
Abstract: The invention relates to catalyst components, suitable for the preparation of homopolymers and copolymers of ethylene having a broad molecular weight distribution (MWD), which comprise Ti, Mg, Cl, and are characterized by the following properties: surface area, determined by BET method, of lower than 100 m<2>/g, a total porosity, measured by the mercury method, of higher than 0.25 cm<3>/g, a pore radius distribution such that at least 45% of the total porosity is due to pores with radius up to 0.1 mum.
Patent TW-554194-B (TW)
Title: Flat display device
Inventor: TSUKAMOTO TAKAYOSHI
IPC: G09F9/00
Filed: 2000-06-26
Granted: 2003-09-21
Abstract: The present invention provides a flat display device, which will not generate deformation by the screwing force of the male screw even if there is a gap from the dimensional tolerance between the container on the display panel and the case, and the female screw 26 on the container 22 can constitute the deformation toward the inner side of the case 25. Due to the screwing force on the male screw 27 screwed and fixed with the female screw 26 on the container side 22, the sidewall 25a of the case accommodating the display 11 and the sidewall 24 of the container 22 will not generate too much deformation.
Patent TW-480776-B (TW)
Title: Flat dual frequency band antennas for wireless communicators
Inventor: RUTKOWSKI KIM
IPC: H01Q5/00
Filed: 2000-06-27
Granted: 2002-03-21
Abstract: A dual frequency band antenna includes a dielectric substrate having opposite first and second surfaces and a meandering conductive trace disposed on a surface of the dielectric substrate. The meandering conductive trace includes first and second meandering segments that are configured to electrically couple with each other such that the antenna resonates within two separate and distinct frequency bands. At least one of the first and second meandering segments has a portion with an increased width compared with the width of the conductive trace.
Patent TW-448251-B (TW)
Title: Method for weaving warp reinforced fabric and device thereof
Inventor: WANG JIN-NIAN
IPC: D04B21/00
Filed: 2000-08-25
Granted: 2001-08-01
Abstract: A method and a device for weaving a warp reinforced fabric are characterized in using a positioning input and device. The device comprises a weaving yarn for providing a yarn necessary for forming interlocking of a fabric structure; a guide for controlling the weaving operation of the weaving yarn; a needle for timely weaving the yarn into a loop in cooperation with the movement of the guide, and joining the loops into a shape. The invented method uses a positioning guide needle to fix the input position and path of the reinforcing yarn strand, thereby avoiding a collision caused by the movements of the reinforcing yarn strand and the machine elements, or missing yarn. Furthermore, a weaving yarn is used to hold or position the reinforcing yarn strand.
Patent TW-462914-B (TW)
Title: In-mold decoration injection molding for insulation of electromagnetic interference
Inventor: SHIU JR-REN
IPC: B29C45/00
Filed: 2000-12-11
Granted: 2001-11-11
Abstract: This invention provides the in-mold decoration injection molding for insulation of electromagnetic interference. A metal resin for insulation of electromagnetic interference is coated to form an insulation layer after decoration step of the in-mold decoration injection molding. The pre-formed coated insulation layer is cut, trimmed to fit the size of the mold cavity according to the pre-formed appearance requirements. The pre-formed coated trimmed piece is placed and secured inside of the injection mold and hot melt resin is injected from the printed side of the pre-formed piece using an injection molding machine. The hot melt resin solidifies and adheres to the pre-formed piece. The finished article is then removed from the injection molding mold. Electronic products manufactured by above-mentioned procedures are capable of shielding off electromagnetic waves by the insulation layer to prevent effects of electromagnetic interference.