baber/WOPTO huggingface dataset:
Patent JP-H05156326-A (JP)
Title: Production of fine silver powder
Inventor: HIDAKA TOSHIO
IPC: B22F9/30
Filed: 1991-12-09
Abstract: PURPOSE:To easily and inexpensively produce a fine silver powder having a small primary particle diameter and a large specific surface and low in agglomeratability by thermally decomposing silver acetate in vacuum or in a nonoxidizing atmosphere under specified conditions. CONSTITUTION:Anhydrous silver acetate obtained by the reaction between silver nitrate and sodium acetate is thermally decomposed at 160 to 300 deg.C at the heating rate of 0.5 to 20 deg.C/min in the vacuum at <=30mmHg or in a nonoxidizing atmosphere. In this case, 100-200,000ppm of palladium is preferably incorporated into the silver acetate by adding the palladium salt into the sodium acetate being produced to occlude the palladium into the crystal. A silver powder having 30-1000nm primary particle diameter, 0.5-20m<2>/g specific surface and <5000nm aggregated particle diameter is obtained in this way. The fine silver powder is used as such, or the powder with the impurities reduced by cleaning, disintegration, vapor-phase reduction, etc., is used.
Patent JP-2000152540-A (JP)
Title: Outer rotor dynamo-electric machine
Inventor: NAGATA KOJI
IPC: H02K1/27
Filed: 1998-11-16
Abstract: PROBLEM TO BE SOLVED: To perform effective control without performing weakish field control, by providing a dynamo-electric machine with a position regulating member which regulates the position in radical direction of a permanent magnet, in the peculiar position geared to the centrifugal force working on the permanent magnet, accompanying the rotation of a rotor. SOLUTION: A plurality of holes 16d where taper parts whose aperture dimensions decrease gradually as they go to the center in radial direction are made are made at equal intervals in circumferential direction at a permanent magnet positioning piece 16b. A permanent magnet 17 is set in each hole 16d. On the other hand, at the inside periphery of a cylinder 16a, a recess 16e is made in each position corresponding to the permanent magnet 17. Moreover, each recess 16e is provided with a taper part whose aperture dimension decreases gradually at it goes to the centrifugal side in radial direction. Then, a rubber plate 20 being an elastic member is set in each recess 16e, and it abuts on all face of the peripheral face of the permanent magnet 17 and presses this peripheral face equally, and regulates the position in centrifugal direction of the permanent magnet 17.  That is, the rubber member 20 functions as a position regulating member, in the position in the radial direction of the permanent magnet 17.
Patent JP-H07172316-A (JP)
Title: Automatic releasing device for electric-pneumatic combined coupler
Inventor: KANAI HIROSHI
IPC: B61G7/00
Filed: 1993-12-22
Abstract: PURPOSE:To facilitate installation even 10 a vehicle having a small outfitting space by cutting off electrification between an electric passage and an electric connection part by an electric passage making/cutting means based on an electric signal outputted in accordance with displacement of an opening/closing valve for cutting off communication between an air passage and an air connection part. CONSTITUTION:When a position of an operation switch 70 is changed to 'release', a position of a three-position solenoid valve 42 is changed, a ball valve 28 is displaced from 'open' to 'close' to cut off a main air pipe 22, a release switch 36 is turned on to output a 'close' signal to be inputted to a relay board 62, and a main electric passage 60a is cut off. When the position of the operation switch 70 is changed to 'release', an auxiliary electric passage 60b is cut off, and further, after the main air pipe 22 and the main electric passage 60a are cut off, a position of a two-position solenoid valve 52 is changed in compliance with a command of a control unit to feed pressure air to a lock-release cylinder 16. Since the lock release cylinder 16 drives to release a lock mechanism because of pressure air feed, coupling by a mechanical coupling part 10 is released.
Patent JP-H08188908-A (JP)
Title: Sporting glove
Inventor: WATANABE HISASHI
IPC: A63B71/14
Filed: 1994-12-27
Abstract: PURPOSE: To obtain a sporting glove facilitating hand motion, improved in air permeability, and helping protect the hand through absorbing the mechanical shock subject to the hand. CONSTITUTION: This sporting glove is made up of finger flap pads 3a, 3b, 3c each sewn X so as to cover the range from the finger tip to the 2nd joint of the finger and allow the lower portion to rise, the chief flap pad 4 located under the risen portion 3d and sewn Y so as to cover the range from the 2nd joint of the finger to the 3rd joint and the vamp C and allow the lower portion to rise, and such a sub-flap pad 5 that only the vamp C portion under the risen portion 4a of the chief flap pad 4 is sewn.
Patent JP-H08181352-A (JP)
Title: Light receiving and emitting device and manufacture thereof
Inventor: YANAKA MASUMI
IPC: H01L31/12
Filed: 1994-12-27
Abstract: PURPOSE: To embody a light receiving and emitting device having a large light receiving sensitivity by turning a side diffusion distance, which is a projected length of a side junction surface when the side junction surface is projected on the surface of a board as for the depth of a PN junction from the front surface of the board up to an opposed junction surface into an area which is larger by specific times. CONSTITUTION: A junction surface 31 between a p-type semiconductor area 19 and an n-type semiconductor area of a light receiving and emitting device 29 forms a side junction surface 31b from an opposed junction surface 31a which is opposed to a light emitting window area up to the surface of a p-type area formed board 11a. A side diffusion distance Xs, which is a projected length of a side junction surface when the side junction surface 31b is projected on the surface of the board 11a, is arranged to be an area enlarged by 1.3 times and over than a vertical diffusion distance Xj, which is a PN junction depth from the surface of the board 11a up to the opposed junction surface 31a. This construction makes it possible to embody a light receiving and emitting device having a light receiving sensitivity.
Patent JP-H06175669-A (JP)
Title: Noise controller
Inventor: SAKO KAZUYA
IPC: F01N1/06
Filed: 1992-12-04
Abstract: PURPOSE:To improve an information transfer method to a main processing part for generating various information expressing the operational condition of a noise source. CONSTITUTION:This noise controller outputting the cancel sound with a an opposite phase and equal sound pressure to the noise is provided with a pulse shaping circuit 100 eliminating the influence of the changes in a DC level and a pulse wave height depending on the number of revolution of an engine from an engine pulse, a reference signal forming circuit 200 forming a reference signal imitating the noise making the engine pulse be a basic signal, the main processing part 300 forming a compensation signal for forming a cancel sound so that an error signal becomes minimum using the reference signal and changing a processing amount according to the number of revolution of the engine, a correction control part 400 correcting the reference signal basing on the error signal and adjusting the tone of a remaining sound and a malfunction prevention circuit 500 interrupting the operation when the number of revolution of the engine becomes a prescribed value or above.
Patent JP-H05160254-A (JP)
Title: Semiconductor device and production thereof
Inventor: MORITA SHIGERU
IPC: H01L21/3205
Filed: 1991-12-10
Abstract: PURPOSE:To prevent the deterioration of a threshold voltage, eliminate etching liquid residue and prevent wiring short circuits by providing a first groove on a first conducting layer, providing a second groove which communicates with the first groove and has a smaller diameter than the first groove in a semiconductor substrate and providing a second insulating film on the first and the second grooves. CONSTITUTION:A polycrystalline silicon layer 25 is provided with a first groove 27, and a silicon substrate 21 is provided with a second groove 29 which communicates with the first groove 27 and that has a smaller width than the width of the groove 27. A buried insulating film 32a is provided in the first and second grooves 27 and 29. Therefore, the edge 39a of a channel area 39 formed on the silicon substrate 21 under gate electrode wiring 34a is formed at a position in response to the side plane 27a of the first groove 27. Thus, the edge 39a in the channel area 39 is separated from the side plane 32d of the buried insulating film 32a in the groove 29. Therefore, when a voltage is applied to a gate electrode, electric field concentration on the side plane 32d is prevented and threshold voltage deterioration is prevented.
Patent JP-2001140038-A (JP)
Title: Backing hardening type hot dip galvanized steel sheet excellent in surface property and producing method therefor
Inventor: HASEGAWA KOHEI
IPC: C22C38/00
Filed: 1999-11-16
Abstract: PROBLEM TO BE SOLVED: To produce a BH steel sheet capable of inexpensively producing an automotive outer board free from defect in the adhesion of plating, defect in alloying and defect in surface quality caused by linear unevenness and excellent in surface properties and to provide a method for producing the same. SOLUTION: This baking and hardening type hot dip galvanized steel sheet has a composition containing, by weight, 0.0010 to 0.0025% C, <=0.02% Si, 0.10 to 0.40% Mn, 0.04 to 0.08% P, 0.003 to 0.02% Si, 0.02 to 0.1% SolAl, 0.003 to 0.02% Nb, also, <=93/12C and <=0.0020% N, and the balance substantially Fe with inevitable impurities. The steel having the above components is subjected to continuous casting to make into a slab, thereafter, this slab is subjected to hot rolling the cold rolling, the temperature is raises at the average of 20 deg.C/sec and held to 800 to 870 deg.C, and the same is cooled to <=600 deg.C at 5 to 20 deg.C/sec, is applied with hot dip galvanizing, is thereafter held under heating at 450 to 580 deg.C by using an induction heating furnace, is subsequently cooled to <=100 deg.C and is thereafter subjected to skinpass rolling of 1.0 to 2.0%.
Patent JP-H05167776-A (JP)
Title: Original reader
Inventor: ICHIHARA YOSHIYUKI
IPC: H04N1/028
Filed: 1991-12-10
Abstract: PURPOSE:To obtain a small sized reader which obtains a signal without crosstalk even in the case of high speed reading. CONSTITUTION:A multi-layer printed circuit board whose inner layer is provided with a ground plate 23 is adopted for a printed circuit board 2 for the original reader, at least one color wire pattern 21 and an impedance conversion circuit 3 are arranged to other side to provide a margin between the wiring patterns 21 and a ground pattern 22 is provided among the wiring patterns 21.
Patent JP-H10169048-A (JP)
Title: Adjusting support structure for building panel
Inventor: CHIBA SHUNKAI
IPC: E04B2/90
Filed: 1996-12-06
Abstract: PROBLEM TO BE SOLVED: To provide an adjusting support structure where an one time welding work on the spot is enough, and the position adjusting work of a building panel can be easily, quickly and lightly carried out. SOLUTION: In a building panel adjusting support structure, a building panel A is supported on a supporting member such as a floor beam after vertical and horizontal positional adjustments. The above adjusting support structure is provided with a vertical adjusting mechanism having a vertically movable screw body 4 provided on a support body 1 protrusively provided from the building panel A inward and moreover with a horizontal adjusting mechanism having at least a pair of screw members 8, 9 which push the screw body 4 from at least one horizontal direction of a rectangular and parallel directions to a panel face in a state where the lower end of the screw body 4 is mounted on the supporting member for varying the horizontal position of the screw body 4, and moreover receive a portion opposite to the pushed portion of the screw body 4 to sandwichedly fix the screw body 4,  and a fixing member 10 which horizontally screwedly pierces the screw members 8, 9 and suports them, and is fixed to the support member.
Patent JP-H01168857-A (JP)
Title: Formation of titanium nitride film
Inventor: KIUCHI MASATO
IPC: C23C14/24
Filed: 1987-12-23
Abstract: PURPOSE:To form the title TiN film contg. Ti2N crystal and having excellent adhesive strength and hardness by specifying the Ti vapor-deposition rate, accelerating voltage for N, and N input in the formation of the hard TiN film on the surface of a steel member by vacuum deposition. CONSTITUTION:The inside of a vacuum vessel 11 is evacuated from an exhaust port 10, and gaseous N is supplied at a low pressure from a gas inlet 8. The gaseous N2 particle is formed into positive ion by an electron shower from an electron radiation source 7, and the ion is accelerated by the accelerating voltage 6 impressed with a negative voltage of 1-80kV and projected on a substrate 1 to be treated. The Ti in a crucible 4 is heated by an electron-beam gun 3, vaporized, and deposited on the substrate 1. In this case, the Ti vapor deposition rate is controlled to 0.1-200Angstrom /sec and the irradiation amt. of N ion to 1X10<12>-1X10<15> ion/mm<2>.sec, the ions consisting of 20-100% gaseous N2 and 0-80% inert gas are clustered, and the cluster is projected on the substrate.
Patent JP-H02172169-A (JP)
Title: Power supply box
Inventor: OGAWA HIROSHI
IPC: H01R13/641
Filed: 1988-12-23
Abstract: PURPOSE:To prevent drawing off by mistake an outlet of a connection device while the power is on, by lighting up the appropriate lamp for the outlet on the basis of sensing output given by a sensing means. CONSTITUTION:The cable plug 4a of a device 3a concerned is still inserted into an outlet 2a and connected, and the power supply for the device 3a is put on. The power is supplied and current flows through a resistor 6a, and the voltage generated on the ends is sensed by a voltage sensor circuit 7a. A lamp driver 8a lights up an indication lamp 5a in response to the sensing signal given by the sensor circuit 7a. While the power supply for the device 3a is on, the indication lamp 5a is kept lit. If the power is shut, sensing by the sensor circuit 7a is disengaged, and the indication lamp 5a will go out. This applies alike to other devices 3b-3d inserted to other outlets 2b-2d, when indication lamps 5b-5d will light/go out, respectively.
Patent JP-H06340500-A (JP)
Title: Recrystallization method by irradiation with neutral particle beam
Inventor: ASAKAWA TOSHIBUMI
IPC: C30B30/00
Filed: 1991-11-15
Abstract: PURPOSE:To form a single crystal film by irradiating an amorphous thin film with the beam of a low-energy inert gas, low-activity neutral atom or neutral atom at a specified temp. from the direction vertical to plural different closest- packed crystal faces. CONSTITUTION:A silane is decomposed to deposit amorphous Si 2 on a quartz substrate 1 by plasma CVD. The substrate 1 is then heated by a heater 7 and kept at a temp. where the amorphous Si 2 is not crystallized. An inert gas such as Ar is introduced into an ion source 3 from a duct 4 to form an ion beam by an electron beam in the source, the ion beam is collided with a reflex plate 5 at an incident angle of 45 deg., reflected twice, discharged as a neutral Ar atom current and projected on the amorphous Si 2 face of the substrate 1 through a collimator 6. The amorphous Si 2 is irradiated from the direction vertical to >=2 different closest-packed crystal faces, hence the Si is crystallized, and a single crystal film having a specified crystal orientation is obtained.
Patent JP-H10170428-A (JP)
Title: Disk substrate inspecting device
Inventor: NAKAYAMA HIROSHI
IPC: G01N21/88
Filed: 1996-12-06
Abstract: PROBLEM TO BE SOLVED: To provide a disk substrate inspecting device wherein, with a simple configuration, double refraction of a disk substrate is measured without a movable part. SOLUTION: The light having transmitted a disk substrate 4 is divided into two with a non-polarizing beam splitter 5. The light having transmitted the non-polarizing beam splitter 5 is separated into two linear polarized light with the first analyzer 6, and the light having transmitted the first analyzer 6 is detected with the first photo-detector 7 while the light reflected on the first analyzer 6 is detected with the second photo-detector 8. In addition, the light reflected on the non-polarizing beam splitter 5 is divided into two linear polarized light with the second analyzer 8 while the light having transmitted the second analyzer 9 is detected with the third photo-detector 10, and the light reflected on the second analyzer 9 is detected with the fourth photo-detector 11.  Based on the light quantity detected with the first - fourth photo-detectors 7, 8, 10, and 11, double refraction of the disk substrate 4 is obtained.
Patent JP-H03186889-A (JP)
Title: Slide housing system liquid crystal display device
Inventor: FUJIWARA TOSHIHARU
IPC: B60R11/02
Filed: 1989-12-15
Abstract: PURPOSE:To reasonably reduce the number of operating times by displaying a video on a liquid crystal display unit when a turning detection switch detects a state that the liquid crystal display unit is turned. CONSTITUTION:In a state where the liquid crystal display unit 2 is horizontal, that is, when it is not folded at a turning fulcrum 6, an abutting presser 16 abuts on a regulation part 17 formed by folding the bottom plate of the slide unit and the contact of the turning detection switch SW1 is allowed to contact. In such a state, the video does not appear on a liquid crystal screen 5 yet. When the liquid crystal unit is turned next, the abutting presser 16 is separated from the regulation part 17 and the contact of the switch SW1 is separated. At the time of detecting the turning of the liquid crystal display unit, the video is displayed on the liquid crystal screen 5. Thus, the necessary number of operating times in the case of starting the display of the video in a state where the display unit 2 is allowed to protrude from the device main body 1 or in the case of housing the display unit 2 in a state where it is recovered from the folded state to the horizontal state in the equipment main body 1 is reasonably reduced.
Patent JP-H04196260-A (JP)
Title: Semiconductor package
Inventor: OGATA TOSHIICHI
IPC: H01L23/50
Filed: 1990-11-27
Abstract: PURPOSE:To prevent the gap between an inner lead and an outer lead after the caulking step from being made by specifying the spring constant of the inner lead to be smaller than that of the outer lead. CONSTITUTION:An inner lead 2 is provided with a groove 2a or a hole so as to specify the spring constant of the inner lead 2 to be almost the same as that of an outer lead 1a or smaller in the inner lead side. Accordingly, the returning amounts of the deformation after removing the caulking load of the outer lead 1a and the inner lead 2 are equal with each other or that of the inner lead 2 side exceeds another so that the spring force on the inner lead 2 side may constantly press upon the pipe inner wall of the outer lead 1a. Through these procedures, the gap between the inner lead 2 and the outer lead 1a can be prevented from being made.
Patent JP-H06177942-A (JP)
Title: Communication use lsi
Inventor: SASAKI SEI
IPC: H04L69/40
Filed: 1992-12-08
Abstract: PURPOSE:To improve reliability by making communication control ports in duplicate and selecting either of the communication control ports as required. CONSTITUTION:The communication use LSI is operated by a register section 12, a transmission reception buffer 14, a transmitter/-receiver 16, a modem control section 18, and a signal line changeover section 20 usually. A microprocessor 24 monitors the register section 12 during the operation. When a fault of the LSI is recognized by a fault of the LSI depending on a content of a status register of the register section 12, the microprocessor 24 sends a port switching command to a changeover control logic section 22 and sends a selected address to a control logic section 11. Thus, the logic section 11 selects a register section 13, a transmission reception buffer 15, a transmitter/receiver 17 and a modem control section 19. The changeover control logic section 22 receives a selection signal from the logic section 11 and connects the signal line changeover section 21 to a modem 25 via a port changeover section 23.
Patent JP-H02172241-A (JP)
Title: Molding die for resin-sealed semiconductor
Inventor: FUKUSHIMA JIRO
IPC: H01L21/56
Filed: 1988-12-23
Abstract: PURPOSE:To improve operativity and prevent defective product from being produced by separating a lower die into two and providing an air venting portion between them. CONSTITUTION:A lower die constructing a molding die is structured by two pieces, 2a, 2b, and an air venting portion 8 is provided between them. Accordingly, even if a resin burr 9 is produced on the air venting portion 8, it causes no problem as it is not on a leadframe 7, and since it can be peeled off when a completed frame is taken out, no problem is caused as regards a product. This eliminates removal of resin burrs at the air venting portion, while improving product reliability.
Patent JP-H02172296-A (JP)
Title: Flip chip mounting method
Inventor: INOUE NAOAKI
IPC: H05K3/34
Filed: 1988-12-23
Abstract: PURPOSE:To improve productivity by a method wherein a thick film thinner than the height of solder bumps is formed on the solder bump forming surface of an electric parts, and solder bump reflow is performed at the time of mount ing, while the electric parts is pressed against a substrate by using a weight. CONSTITUTION:A thick film 4a whose thickness, i.e., the height is larger than the height of solder bumps is formed on the surface of the solder bump forming side of an electric parts 1. At the time of mounting, reflow of the solder bumps 3 is performed while the electric parts 1 is pressed against a substrate 2 by using a weight. In this manner, at the time of reflow of the solder bumps, the electric parts 1 is surely made to descend by the weight 5, until the lower sur face of the thick film 4a abuts on the upper surface of the substrate 2. As a result, even if the height of the solder bumps 3 is not uniform, all of the solder bumps 3 surely come into contact with a conductor pattern 2a of the substrate 2, when the height of the thick film 4a is set so as to be smaller than the height of the lowest solder bump. Thereby productivity is improved.
Patent JP-H10133344-A (JP)
Title: Method for processing silver halide color photographic sensitive material
Inventor: KUZE SATORU
IPC: G03C7/407
Filed: 1997-11-28
Abstract: PROBLEM TO BE SOLVED: To restrain bleach fog in spite of being processable at high speed with low replenishing and to enhance processing stability and to enable both of continuous processing for a long time processing of a small lot. SOLUTION: The imaewise exposed silver halide color photographic sensitive material is color developed and, immediately after that, subjected to bleach processing followed by processing in a processing bath having a fixing power in the total processing time of <=3min 45sec for both bleaching and fixing treatments at a temperature of 20-45 deg.C. The color development processing solution contains a compound represented by the general formula: (R1 )(R2 )>N-OH, where each of R1 and R2 is an alkyl or alkenyl or aryl group or an H atom but both of R1 and R2 are not H atoms at the same time and each may combine with each other to form a ring.