Patent SG-11201908962T-A (SG)
Title: Optical assembly and method of forming the same
Inventor: LIM TECK GUAN
IPC: G02B6/36
Filed: 2018-03-28
Abstract: 100 106 FIG. 1A 110a 108 114a 00 00 O C (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 04 October 2018 (04.10.2018) WI P01 PC T o n °nolo o o!OHIIIIIOilIIII111111 0IIIIII (10) International Publication Number WO 2018/182516 Al (51) International Patent Classification: GO2B 6/42 (2006.01) GO2B 6/36 (2006.01) (21) International Application Number: PCT/SG2018/050144 (22) International Filing Date: 28 March 2018 (28.03.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 10201702567P 29 March 2017 (29.03.2017) SG (71) Applicant: AGENCY FOR SCIENCE, TECHNOLO- GY AND RESEARCH [SG/SG]; 1 Fusionopolis Way, #20-10 Connexis North Tower, Singapore 138632 (SG). (72) Inventor: LIM, Teck Guan; c/o Industry Development, Institute of Microelectronics, 2 Fusionopolis Way, Innovis Tower, #08-02, Singapore 138634 (SG). (74) Agent: VIERING, JENTSCHURA & PARTNER LLP; P.O. Box 1088, Rochor Post Office, Rochor Road, Singa- pore 911833 (SG). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, (54) Title: OPTICAL ASSEMBLY AND METHOD OF FORMING THE SAME 102 104a (57) : Various embodiments may provide an optical assembly. The optical assembly may include a substrate with a first and a second grooves, and a photonic integrated circuit chip with a coupling waveguide, a first and a second grooves. The optical assembly may further include a first and a second cylindrical rods held by the respective grooves of the substrate and the photonic integrated circuit chip. A portion of the first rod and a portion of the second rod define a vertical offset between the photonic integrated circuit chip and the substrate to align the coupling waveguide with an optical fiber. [Continued on next page] WO 2018/182516 Al MIDEDIM011111 1111E111 IIDI0ME10111011111111101111111111111111111 TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: with international search report (Art. 21(3)) in black and white; the international application as filed contained color or greyscale and is available for download from PATENTSCOPE