baber/WOPTO huggingface dataset:
Patent TW-I246525-B (TW)
Title: Hybrid onium salt
Inventor: ISHIHARA MASAMI
IPC: G03F7/039
Filed: 2002-10-31
Granted: 2006-01-01
Abstract: The present invention provides a hybrid onium salt of formula [1] containing iodium salt and sulfonium salt in one molecule, and a cationic photopolymerization initiator or an acid generator containing said hybrid onium salt. The said hybrid onium salt is useful as cationic photopolymerization initiator and acid generator for chemically amplifying resist, etc., [wherein, R1-R3 each independently represents halogen, alkyl group, haloalkyl group, aryl group, alkoxyl group, aryloxy group, alkylthio group, arylthio group, or amino group optionally having substituent, Q1 represents a bond, oxygen atom, sulfur atom or lower alkylene chain, T1 represents an alkylen e group or an arylene group optionally having substituent selected from halogen, alkyl group, haloalkyl group, aryl group, alkoxyl group, aryloxy group, alkylthio group, arylthio group and amino group optionally having substituent, R4 represents an alkyl group, an alkenyl group, an aryl group or an arakyl group optionally having substituent selected from halogen, alkyl group, haloalkyl group, aryl group, alkoxyl group, aryloxy group, alkylthio group, arylthio group and amino group optionally having substituent, or the group of formula [2], (wherein, R5 to R7 each independently represents alkyl group, haloalkyl group, aryl group, alkoxyl group, aryloxy group, alkylthio group, arylthio group or an amino group optionally having substituent, Q2 represents a bond, oxygen atom, sulfur atom or lower alkylene chain, T2 represents an alkylene group or an arylene group optionally having substituent selected from halogen, alkyl group, haloalkyl group, aryl group, alkoxyl group, aryloxy group, alkylthio group, arylthio group and an amino group optionally having substituent, A3 represents a counter ion, m represents an integer of 0 to 4, two n each independently represents an integer of 0 to 5), A1 and A2 each independently represents a counter ion, m and n are the same meanings as above described].
Patent TW-I271014-B (TW)
Title: Soft-grip wire stripper
Inventor: HARTRANFT BRUCE W
IPC: B25B7/16
Filed: 2003-01-08
Granted: 2007-01-11
Abstract: A wire stripper has a pair of elongated frames pivotably joined together by a pivot pin and defining handles and jaws. The handles are covered by sleeves which include thumb wells which cover the ends of the pivot pin. A mechanical interlock is provided between the handles and the sleeves. The sleeves have slots for receiving the handles. The slots are offset so the front and rear surfaces of opposite sleeves are coplanar. The sleeves have a core and cushion grip overmolded on the core. A molding projection on the core allows precise placement of the core in a mold during formation of the cushion grip. A spring biases the frames to an open position. A locking member can be set by a sliding motion toward the handle end to hold the handles in a closed position. A curved shoulder on the edge of a handle wipes across a screw hole opening in the opposite jaw to provide a screw cutting function with a slicing action.
Patent TW-I264064-B (TW)
Title: Alloying method, and wiring forming method, display device forming method, and image display unit fabricating method
Inventor: TOMODA KATSUHIRO
IPC: H01L33/40
Filed: 2003-01-13
Granted: 2006-10-11
Abstract: This invention provides an alloying method, and a wiring forming method, a display device forming method, and an image display unit fabricating method. The alloying method includes the steps of forming a metal layer on a semiconductor having been transferred to a material having a low thermal conductivity, and alloying an interface between the semiconductor and the metal layer by irradiating the interface with a laser beam having a wavelength absorbable in at least one of the semiconductor and the metal layer. The irradiation energy of the laser beam is set in a range of 20 to 100 mJ/cm<2>. The material having a low thermal conductivity is a resin or amorphous silicon. According to the alloying method using laser irradiation, since the entire semiconductor is not heated and only a necessary portion is locally heated, the necessary portion can be readily alloyed to be converted into an ohmic contact without exerting adverse effect on characteristics of the semiconductor device. In the case of previously transferring a semiconductor to a material having a low thermal conductivity, for example, into a resin, and irradiating an interface between the semiconductor and an electrode with a laser beam, the interface between the semiconductor and the electrode can be alloyed at a low temperature, to lower the irradiation energy of the laser beam.
Patent TW-I275537-B (TW)
Title: Blister pack device
Inventor: BENKTZON MARIA
IPC: A61J7/00
Filed: 2003-02-13
Granted: 2007-03-11
Abstract: The present invention relates to a blister pack device for storing and dispensing a dosage unit, comprising a container having an opening for receiving a blister pack. The container is provided with a dispensing means for ejecting a dosage unit from a blister of the blister pack, the dispensing means comprises a lever arm pivotally mounted on the container and a cavity in the container for receiving an ejected dosage unit wherein the lever arm has a first open position allowing the blister pack to be positioned under the arm and a second lowered position for ejecting the dosage unit from the blister into the cavity.
Patent TW-I236200-B (TW)
Title: Long wavelength VCSEL bottom mirror
Inventor: KWON HO-KI
IPC: H01S5/183
Filed: 2003-02-21
Granted: 2005-07-11
Abstract: A vertical cavity surface emitting laser having an InP substrate and a lower mirror stack comprised of a plurality of alternating layers of AlPSb and GaPSb over the InP substrate. An InP spacer is over the lower mirror stack. An active region is over the InP spacer, and a tunnel junction is over the active region. Then a top mirror structure comprised of a low-temperature formed first GaAs buffer layer, a high-temperature formed second GaAs seed layer, an insulating structure having an opening, and a GaAs/Al(Ga)As mirror stack that is grown by lateral epitaxial overgrowth.
Patent TW-I293621-B (TW)
Title: Method for removing ammonia from a gas comprising hydrogen cyanide, ammonia and water
Inventor: TAE HOON KIM
IPC: C01C1/12
Filed: 2003-04-30
Granted: 2008-02-21
Abstract: A method for removing ammonia from a gas comprising HCN, ammonia and water, by first contacting the gas with aqueous ammonium phosphate to remove ammonia from the gas, and then passing the resulting ammonium phosphate solution through an electrolyzer to convert oxalates and formates into hydrogen and carbon dioxide.
Patent TW-I266267-B (TW)
Title: Display device
Inventor: MIKAMI YOSHIRO
IPC: G02F1/1345
Filed: 2003-04-30
Granted: 2006-11-11
Abstract: The present invention provides a display device having a solar cell and a power buffer for keeping the stored electric power, a display system which has a low-power drive mode, self-contained power and no need for recharging or power wiring. The display system includes a solar cell (1) using a thin-film semiconductor, a power storage element (2) for temporarily storing the produced power, a driving circuit (4), a matrix display unit (8), a display rewrite instruction unit (9) for inputting screen rewrite and a control circuit (7). It starts rewriting a display when power sufficient to rewrite an image screen is stored in the solar cell (1). A display mode is controlled in accordance with the power produced by the solar cell (1), so that it can display even when the power generation is low, and self-contained power is allowed even if the storage element (2) has a small capacity. Thus, the display device having remarkable portability and no limited battery life can be obtained.
Patent TW-588579-B (TW)
Title: Electronic machine and use method thereof
Inventor: KATO SHIGEYUKI
IPC: H05K1/14
Filed: 2003-05-19
Granted: 2004-05-21
Abstract: It is an object of the present invention to seek for a circuit substrate which can be used among different kinds of machines, so as to reduce the cost. The present invention is to install, responding to a desired model, input, power supply, output/communication functional module substrates 25 on a basic substrate 23a having a common wiring bus. A CPU of the input module can distinguish each module substrate, and control steps of the responding are carried out. Through such a manner, the module substrate 25 can be applied to a plurality of models.
Patent TW-I220546-B (TW)
Title: Fixture for bending test
Inventor: WU JENG-DA
IPC: H01L21/66
Filed: 2003-06-10
Granted: 2004-08-21
Abstract: A fixture is used for the reliability test of a semiconductor package. The semiconductor package is mounted on a testing board. The testing board has two pair of opposite sides. The fixture has two supporting devices and a clamp. The supporting devices clamp the one of the pairs of the sides. The clamp clamps the other pair of the sides, and is connected to a testing head of an exterior universal testing machine, thereby allowing the testing board to repeatedly deform in positive and negative directions.
Patent TW-I237291-B (TW)
Title: Semiconductor device
Inventor: MORIWAKI SHOHEI
IPC: H01L23/498
Filed: 2003-06-17
Granted: 2005-08-01
Abstract: A semiconductor device includes a semiconductor package, a substrate provided under the semiconductor package, a metal substrate provided on the semiconductor package, and a fixing member positioning the semiconductor package and the metal substrate on the substrate. The substrate is provided with a hole passing though the substrate. A portion of the fixing member is inserted into the hole and a tip of the fixing member contacts a fourth terminal. Semiconductor package has a first main surface, a second main surface provided opposite to the first main surface, and a first terminal provided at the first main surface.
Patent TW-I276254-B (TW)
Title: Card adapter for connecting flexible printed circuit
Inventor: TANAKA MASANOBU
IPC: G06K17/00
Filed: 2003-06-26
Granted: 2007-03-11
Abstract: The invention provides a flexible printed circuit (FPC), which can be easily installed inside case and installs the lock component of the card adapter capable of locking the installed FPC to prevent from loosening. The terminal component 4 of card adapter of the invention forms the card contact part 4b in touch with card components (no figure) on one side and forms the FPC contact part 5b capable of contacting with FPC11 on the other side. Further install the lock component 7 that can press the FPC11 inserted from the FPC insertion part 2b to connect to the FPC contact part 5b for loosening protection. Therefore, the invention can truly protect FPC11 from loosening from case 2.
Patent TW-I223450-B (TW)
Title: Semiconductor device
Inventor: CHANG YAO-WEN
IPC: H01L29/772
Filed: 2003-07-23
Granted: 2004-11-01
Abstract: The invented semiconductor device contains the followings: a substrate having a well region; the drain diffusion region and the source diffusion region disposed in the well region; the gate insulation layer disposed on the surface of the well region; the gate disposed on the gate insulation layer; the base body contact diffusion region disposed in the well region; and the insulation trench. The conduction type of the base body contact diffusion region is opposite to that of the well region. The invented semiconductor device can be treated as the device that is composed of a metal oxide semiconductor (MOS) transistor, a junction diode and a resistor, which is connected electrically to the MOS transistor and the junction diode. The junction diode can be composed of the base body contact diffusion region and the well region; and the resistor is the intrinsic resistor of the well region.
Patent TW-583104-B (TW)
Title: Method for increasing thermal print quality
Inventor: SUN MING-JYH
IPC: B41J2/36
Filed: 2003-07-30
Granted: 2004-04-11
Abstract: A method for printing a pixel of a gray level x on a paper by a printer. The printer includes a thermal print head and a color type and the thermal print head includes a heater for heating the color type to print pixels from the gray level 1 to the gray level m-1 on the paper. The method includes: if x is not greater than a value n, heating the color type in x times and distributing the heating initiative times of x times between the time point 0 and the time point (m*(n-1)/n) averagely for printing the pixel of the gray level x on the paper; and if x is greater than a value n, heating the color type in x times and distributing the heating initiative time of n times between the time point 0 and the time point (m*(n-1)/n) averagely and distributing the heating initiative time of x-n times behind the time point of the heating initiative time of the n times.
Patent TW-593704-B (TW)
Title: Annealing-induced extensive solid-state amorphization in a metallic film
Inventor: JU JIN
IPC: C22F1/00
Filed: 2003-08-04
Granted: 2004-06-21
Abstract: An amorphous thin film alloy based on chemical elements with high glass forming ability is disclosed. The alloy is deposited as a thin film from a source of substantially the same chemical composition. Within the deposited thin film, amorphization is induced extensively up to decades of micrometers in size during controlled annealing. Such controllable extensive amorphization throughout the thin film is useful to regulate the proportion of amorphous phase to crystalline phase, establish the structure/property relationships and thus tailor specific properties.
Patent TW-I231889-B (TW)
Title: Photomask for simultaneously forming bump openings and peripheral gap on a wafer
Inventor: YU JUI-I
IPC: G03F1/14
Filed: 2003-08-12
Granted: 2005-05-01
Abstract: A photomask for simultaneously forming bump openings and peripheral gap on a wafer comprises a light-previous layer and a mask pattern layer. The mask pattern layer includes an opaque region and a transparent region so as to define an annular pattern of the mask pattern layer for simultaneously forming a peripheral gap on a light-sensitive layer on a wafer during exposure and development of a plurality of bump openings. The peripheral gap is formed on perimeters of the wafer after exposure and development for electrode contact of bump plating. Thus the photomask has a benefit to be a universal tool in plating process and printing process of bumping.
Patent TW-I246131-B (TW)
Title: Mounting method and mounting structure of semiconductor device, optoelectronic device, manufacturing method of optoelectronic device and electronic machine
Inventor: YAMADA KAZUYUKI
IPC: H05K3/32
Filed: 2003-08-12
Granted: 2005-12-21
Abstract: The subject of the present invention is to provide new mounting method and mounting structure of semiconductor device, optoelectronic device, manufacturing method of optoelectronic device and electronic machine capable of increasing the reliability of conducting bonding portion even if the numbers of wiring terminals and the electrodes are increased and the pitch is narrowed. The solving means is described as follows. Wiring terminals are formed on the wiring board, and electrodes are formed on the semiconductor device, in which the width of the wiring terminal is formed to be smaller than that of the electrode. When mounting semiconductor device on the wiring board, the wiring terminal is made to bite into the electrode through the use of adding pressure; and the best biting amount of the wiring terminal is in the range of 1 mum to 5 mum.
Patent TW-I232799-B (TW)
Title: Apparatus for closing a hinged molded part
Inventor: KALEMBA JACEK
IPC: B29C45/00
Filed: 2003-08-19
Granted: 2005-05-21
Abstract: An apparatus and method for folding a hinged molded part in a molding machine. As a part-removal apparatus, preferably a swing arm mechanism, grips one of the lid portion or the base portion of the molded part and moves the molded part away from the mold, a deflector connected to a portion of the mold engages the other portion of the part and initially folds the part at the hinge. The deflector further folds the part as the mold closes. The portions of the part are pushed together and latched in one embodiment by the swing arm mechanism that grips and moves the molded part against the deflector, and in another embodiment by a closing actuator operated separately from the swing arm mechanism.
Patent TW-I257860-B (TW)
Title: Disposable wearing article
Inventor: OTSUBO TOSHIFUMI
IPC: A61F13/49
Filed: 2003-08-26
Granted: 2006-07-11
Abstract: The invention provides a disposable wearing article capable of preventing a poor contact sensation caused by the article wrinkles and without leaving platemarks on the wearer's skin due to the wrinkles. An article (1A) comprises a base sheet (2) with the first and second ends (15, 16), trunk elastic members (17) extending around the trunk and contractibly mounted on the first end (15), the second end (16) being folded back toward the inner surface of the first end (15), the front end region (18) of the second end (16) being fixed to the first end to cove the elastic members (17). In the article (1A), the first and second ends (15, 16) have opposite side edges (19, 20) and central regions (21, 22), and the first and second ends (15, 16) are fixed to each other in the opposite side regions (19, 20) of these ends (15, 16), while the first and second ends (15, 16) are isolated from each other in the central regions (21, 22) of these ends (15, 16).
Patent TW-I247561-B (TW)
Title: Surface mounted electrical components and method for mounting and retaining same
Inventor: BELOPOLSKY YAKOV
IPC: H05K3/24
Filed: 2003-09-16
Granted: 2006-01-11
Abstract: Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. Electronic assemblies including circuit boards and electrical components mounted thereto are also described. In one of the electronic assembly embodiments, materials originally associated with a mounted electrical component migrate into solder paste coupling the electrical component to the circuit board.
Patent TW-I277517-B (TW)
Title: Liquid jetting device
Inventor: NISHI YASUO
IPC: B41J2/06
Filed: 2003-09-23
Granted: 2007-04-01
Abstract: The present invention relates a liquid jetting device, which is a liquid jetting device (20) for jetting charged droplets of solution onto a base material, characterized by comprising a liquid jetting head having a nozzle (21) having a tip part inside diameter of 30 mum or less for jetting the droplets from the tip part, a solution feed means (29) for feeding the solution into the nozzle (21), a jetting voltage application means (25) for applying a jetting voltage to the solution in the nozzle (21), and a projected meniscus forming means (40) for forming the state of the solution in the nozzle (21) projected from the tip part of the nozzle.
Patent TW-I266218-B (TW)
Title: Interface control circuit and related method thereof
Inventor: CHANG HUI-HUANG
IPC: G06F3/00
Filed: 2003-10-08
Granted: 2006-11-11
Abstract: An general interface control circuit for outputting or inputting a predetermined number of data includes at least a control table for providing a predetermined sequence, a predetermined number of I/O pins, predetermined cycles for outputting/inputting the predetermined number of data. The interface control circuit further includes a timing control unit electrically connected to the control table for outputting/inputting the predetermined number of data through the predetermined number of I/O pins during the predetermined cycles.
Patent TW-590815-B (TW)
Title: Method of treating a chamber
Inventor: LIU CHUN-LIANG
IPC: B08B7/00
Filed: 2003-10-20
Granted: 2004-06-11
Abstract: A method of treating a chamber is described, and the method is capable of treating carbon residues and silicon residues in the chamber. Oxygen is imported into the chamber to perform oxygen plasma treating process, and the process make the carbon residues become carbon dioxide and the silicon residues become silicon dioxide. Since the produced carbon dioxide can be exhaust out of the chamber, and the produced silicon dioxide can adhere to the wall of the chamber, it can avoid a subsequent etch process suffering the contamination from the carbon residues and the silicon residues.
Patent TW-I318255-B (TW)
Title: Air channel dryer fabric
Inventor: JOSEF MICHAEL J
IPC: D21F1/00
Filed: 2003-10-29
Granted: 2009-12-11
Abstract: A papermaker's fabric includes first and second layers of cross-machine-direction (CD) yarns and a plurality of machine-direction (MD) yarns interwoven therewith and arranged in groups each having a first, two second, and two third MD yarns. The first MD yarn binds with two CD yarns of the first layer and with two CD yarns of the second layer. The second MD yarns bind with only one CD yarn of the first layer and floats over at least two consecutive CD yarns of the second layer. The third MD yarns bind with only one CD yarn of the first layer and floats over at least two consecutive CD yarns of the second layer. The second MD yarns are offset from the third MD yarns in a direction parallel to the MD yarns. The first MD yarn is between the two second MD yarns which are between the third MD yarns so as to form a continuous air channel.
Patent TW-I232472-B (TW)
Title: Metal-insulator-metal (MIM) capacitor and fabrication method for making the same
Inventor: GAU JING-HORNG
IPC: H01G4/00
Filed: 2003-11-24
Granted: 2005-05-11
Abstract: A metal-insulator-metal (MIM) capacitor includes a first metal plate; a first capacitor dielectric layer disposed on the first metal plate and a second metal plate stacked on the first capacitor dielectric layer. The first metal plate, the first capacitor dielectric layer, and the second metal plate constitute a lower capacitor. A second capacitor dielectric layer is disposed on the second metal plate. A third metal plate is stacked on the second capacitor dielectric layer. The second metal plate, the second capacitor dielectric layer, and the third metal plate constitute an upper capacitor. The first metal plate and the third metal plate are electrically connected to a first terminal of the MIM capacitor, while the second metal plate is electrically connected to a second terminal of the MIM capacitor.
Patent TW-I235054-B (TW)
Title: Absorbent article with longitudinally compressed grooves
Inventor: MIYAMA TAKUYA
IPC: A61F13/53
Filed: 2003-12-01
Granted: 2005-07-01
Abstract: To prevent the backward transfer of menstrual blood with a middle portion of the central region of an absorbent article closely pressed against the perineum. A longitudinally central region 20 is formed between internal compressed grooves 11, 11 located at the surface of a sanitary napkin 1 at the side contacting the skin. Outside thereof, are formed front and rear external compressed grooves 15, 15 and 16, 16. The middle central region 20B is broad and has no external compressed grooves at the outside. By tightening forces from the thigh, compressive forces F3, F3 and F4, F4 are applied to parts before and after the middle central region 20B to raise the middle central region 20B into a close contact with the perineum.
Patent TW-I240568-B (TW)
Title: Image composite device, electronic camera and image composite method
Inventor: IMAMURA KEIICHI
IPC: H04N5/232
Filed: 2003-12-08
Granted: 2005-09-21
Abstract: An image composite device is disclosed which comprises of: the optical lens system and the CCD for pickup the image of the object; the calendar data storage unit for storing the calendar data having different formats; the key input unit provided with keys for selecting any format from the calendar data stored in the storage unit; and the control unit for composing the calendar data having the selected format and the image data produced by image pick up.