Patent SG-185817-A1 (SG)
Title: Electronic component mounting apparatus and method
Inventor: HOJO KOJI
Filed: 2011-06-02
Abstract: Search fnternational and Nata)nal Pcrlate "tiviTn.,vOptions NewsHome IP Services PATENTSCOPE1. (W02011152479) ELECTRONIC PACKAGING DEVICE AND METHOD/ PCT Biblic. Data Full Text National Phase Notices DocumentsLatest bibliographic data on file with the International BureauPermaLinkn,Pub. No.: WO/2011/152479Publication Date: 08 12 2011Chapter 2 Demand Filed: 31.01 2012IPC: 1-1051( 3/34 (2006.01), HOW 21/60 International Application No.: PCT/JP20111062664 International Filing Date: 02.06.2011/(2006.01) a Ptiatt000ca,ea lame.* reeeeee.0 0000 0.0.0000.00200040. 0 000 00,00 000,000 ttra. 000.1000,01.004000600,trtetU teat *)U0 t„00000.0,0Yoe : dun outil (28) de connexion qui est entraine dans le sens du rapprochement /dear rapport a un substrat (42) et qui utilise une thermo-compression pour connecter deslectroniques (31) au substrat (41) ; une graduation lineaire (61) et une tete (62) ê graduation lineaire quYdetectent la position de l'outil (28) de connexion dans le sens du rapprochement / dereloigne,aient par rapport au substrat (42) ; et une unite (50) de commande. L'unite (50) de commande : deternre qu'un film (44) de soudure entre relectrode du composant electronique (31) et relectrode du subsyat (42) a eta thermocolle lorsque l'outil (28) de connexion s'est approche du substrat (42) seulement a orfe distance prescrite dune position de reference tout en chauffant le composant electronique (31) ; et mf3intient la position de l'outil (28) de connexion par rapport au substrat (28) dans le sens du/approchement / de reloignement dans ces circonstances. La quanta de la connexion est ainsi amelioree/ dans un dispositif de conditionnement electronique qui joint des composants electroniques a des substrats/ via un metal de jonction en vue d'un thermocollage.(JA) alN(42)eInfirrillzWTMt4L,ET, ±fifig,(31)-g6(42)11-1(}EXtL*>-7=-(>—ili(28)L.* >-3-tc,-,"•;/—A,(28)coa*(42L040AtifIl (Dttinter,69:177.5----A,(61), 2) L, VMS (5 0) , MOS (so) It 6Z +14 iSi'p (31) ViettstP;*:,-5"-*-(›V\Y—/i.(28)/)cge*ft Rh\ (8PhSinatttluta4R(42)(zia-iotzta, z±sa(31)ottEkg45(42)o-eatieoramitAit-s&(44)75%ralLtz-±*Illa, to3;10*.i-V-4>9%.V—A,(28)0)a4N(42)1:54-9"WAN4051P:EV-V4 fla CA-Lizot-D-C, cA%'r7Lt-r6I'AeR11-L-C+glig eglEeeMetWa.÷% natz.ISL yr, 4-.Z:r 5--ç-7 Designated AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ,States: DE, DK, DM, DO, DZ, EC, EE, EG, ES, El, GB, GD, GE, GH, GM, GT, HN, HE, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.African Regional Intellectual Property Org. (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZVV)Eurasian Patent Organization (EAPO) (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, Fl, FR, GB, GR, HR, HU, 1E, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)African Intellectual Property Organization (OAPI) (BF, BJ, CF, CG, Cl, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).Publication Language: Japanese (JA)Filing Language: Japanese (JA)Provided is an electronic component mounting apparatus including a bonding tool (28) for thermally bonding an electronic component (31) onto a substrate (42), the bonding tool to be driven in a direction getting close to and away from the substrate (42), a linear scale (61) and a linear scale head (62) for detecting the position of the bonding tool (28) in the direction getting close to and away from the substrate (42), and a control unit (50), in which the control unit (50) is configured to hold the position of the bonding tool (28) in the direction getting close to and away from the substrate (42) based on the determination that a solder film (44) between an electrode of the electronic component (31) and an electrode of the substrate (42) is thermally fused when the bonding tool (28) gets close to the substrate (42) by a predetermined distance from a reference position while heating the electronic component (31). The thus configured electronic component mounting apparatus for bonding the electronic component and the substrate with thermally fusible bond metal offers an improvement in the bonding quality.Figure 1