baber/WOPTO huggingface dataset:
Patent TW-202101954-A (TW)
Title: Call system with simulated reply and method thereof including a character image capture device, a character image display device, a voice database, a notification keyword database, an interactive voice response device, and a processing device
Inventor: HWU SHIOW-LIN
IPC: G06Q50/30
Filed: 2019-06-28
Abstract: The present invention relates to a call system with simulated reply and a method thereof. The call system includes a character image capture device, a character image display device, a voice database, a notification keyword database, an interactive voice response device, and a processing device. When a user (such as an elderly person) uses the present invention to make a call, at least one voice information file pre-stored by his relatives can be played, and when the user speaks a specific keyword, an emergency notification can be issued immediately.
Patent TW-202025427-A (TW)
Inventor: ISHIHARA TAKASHI
IPC: H01L23/528
Filed: 2019-08-21
Abstract: An apparatus includes: a first substrate comprising a first channel that includes a first plurality of doped regions on the first substrate; a second substrate comprising a second channel that includes a second plurality of doped regions in the second substrate, wherein: the doped regions of the second substrate are electrically and/or physically separate from those of the first substrate, and the second channel is aligned colinearly with the first channel; and a conductive structure extending across the first substrate and the second substrate and electrically connecting matching doped regions of the first channel and the second channel.
Patent TW-202027502-A (TW)
Title: Reduced window size for bilateral filter
Inventor: ZHANG LI
IPC: H04N19/80
Filed: 2019-08-21
Abstract: A method for video bitstream processing includes determining, by a processor, that a reconstructed representation of a current sample of video data is to be subject to a bilateral filter defined by one or more parameters based, at least in part, on a weighted sum of a subset of sample intensity differences between a first window covering a current sample and a second window covering a neighboring sample, wherein multiple sample intensity differences are assigned a same weight; and applying the bilateral filter defined by the one or more parameters to the reconstructed representation of the current sample of the video data.
Patent TW-202011701-A (TW)
Inventor: SHABRA AYMAN
IPC: H03M1/66
Filed: 2019-09-03
Abstract: 本發明提供的DAC具有低失真，可用於高動態範圍（HDR）、極高動態範圍（EHDR）和其它的合適應用。一些實施例涉及一種DAC，該DAC被配置為經由強加路徑和感測路徑耦接至放大器。例如，DAC經由強加路徑向放大器提供輸出電流，以及，DAC經由感測路徑感測放大器的輸入電壓。因此，可以減少或消除強加路徑和/或感測路徑中來自寄生阻抗的諸如諧波失真和/或增益偏移的失真。一些實施例涉及一種DAC，其包括參考電壓產生器，被配置為補償DAC的阻抗變化，諸如因半導體工藝變化造成的。因此，可以減少或消除因DAC的阻抗變化造成的DAC輸出中的失真。
Patent TW-202013409-A (TW)
Title: Touch sensor and wiring device
Inventor: MAESHIMA MASAYUKI
IPC: H01H36/00
Filed: 2019-09-10
Abstract: The present disclosure addresses the problem of providing: a touch sensor which has improved detection accuracy of touch operations; and a wiring apparatus. A touch sensor according to the present invention is provided with a substrate (30), a sensor electrode (31) and a first ground electrode (32). The substrate (30) comprises a first layer (L1) and a second layer (L2). The sensor electrode (31) is formed in the first layer (L1). The first ground electrode (32) is formed in the second layer (L2) such that at least a part thereof overlaps with the sensor electrode (31) in the thickness direction of the substrate (30); and a parasitic capacitance is formed between the first ground electrode (32) and the sensor electrode (31). At least one of the sensor electrode (31) and the first ground electrode (32) comprises a plurality of through holes (320) which are formed within a region where the sensor electrode (31) and the first ground electrode (32) overlap with each other in the thickness direction of the substrate (30).
Patent TW-202037607-A (TW)
Title: Single-domain antibodies against cd33 and constructs thereof
Inventor: Zhang ya-feng
IPC: A61P35/00
Filed: 2019-09-10
Abstract: The present application provides single-domain antibodies targeting CD33 and constructs thereof, including chimeric receptors, immune effector cell engagers and immunoconjugates. Further provided are engineered immune cells (such as T cells) comprising an anti-CD33 chimeric receptor and optionally a second chimeric receptor targeting a second antigen or epitope. Pharmaceutical compositions, kits and methods of treating cancer are also provided.
Patent TW-202036923-A (TW)
Title: Dye-sensitized photovoltaic cells
Inventor: CHITTIBABU KETHINNI
IPC: H01L31/0216
Filed: 2019-09-20
Abstract: Provided herein are improvements to dye-sensitized photovoltaic cells that enhance the ability of those cells to operate in normal room lighting conditions. These improvements include printable, non-corrosive, nonporous hole blocking layer formulations that improve the performance of dye-sensitized photovoltaic cells under 1 sun and indoor light irradiation conditions. Also provided herein are highly stable electrolyte formulations for use in dye-sensitized photovoltaic cells. These electrolytes use high boiling solvents, and provide unexpectedly superior results compared to prior art acetonitrile-based electrolytes. Also provided herein are chemically polymerizable formulations for depositing thin composite catalytic layers for redox electrolyte-based dye-sensitized photovoltaic cells. The formulations allow R2R printing (involves coating, fast chemical polymerization, rinsing of catalytic materials with methanol) composite catalyst layers on the cathode.  In situ  chemical polymerization process forms very uniform thin films, which is essential for achieving uniform performance from every cell in serially connected photovoltaic module.
Patent TW-202118912-A (TW)
Title: Carbon fiber sheet material, prepreg, molded body, method of producing carbon fiber sheet material, method of producing prepreg and method of producing molded body
Inventor: KONDO TORU
IPC: D01F9/12
Filed: 2019-09-27
Abstract: A carbon fiber sheet material of the present invention includes a plurality of carbon fibers and a binder that binds the carbon fibers, wherein the carbon fibers includes first carbon fibers that are virgin carbon fibers and second carbon fibers that are recycled carbon fibers. When an average length of the first carbon fibers is LVCF [mm] and an average length of the second carbon fibers is LRCF [mm], it is preferred that a relationship of 1.1 ≤ LVCF/LRCF ≤ 30 is satisfied.
Patent TW-202114788-A (TW)
Title: Ultrasonic probe and manufacturing method thereof
Inventor: JIANG FU-SHENG
IPC: B06B1/02
Filed: 2019-10-03
Abstract: An ultrasonic probe includes a Micromachined Ultrasonic Transducer (MUT) substrate, a conductive adhesive, a circuit board and an acoustic transmission medium. The MUT substrate has an emitting surface. The conductive adhesive surrounds an area on the emitting surface and has a first recess corresponding to the area. The circuit board has an opening, the circuit board is disposed on the conductive adhesive and the opening corresponds to the area, and the circuit board has a second recess. The acoustic transmission medium is formed within the first recess and the second recess.
Patent TW-202018373-A (TW)
Title: Grating plate device
Inventor: LIN CHIH-HSIUNG
IPC: G09F19/12
Filed: 2019-10-16
Abstract: A grating plate device includes a light transmitting substrate, a plurality of first diffraction gratings, and a plurality of second diffraction gratings. The light transmitting substrate includes a first surface and a second surface that are opposite to each other, where the first surface has a first imaging area and a second imaging area. The plurality of first diffraction gratings is disposed on the first imaging area of the first surface and parallel to each other, and each of the first diffraction gratings includes two first grating lines parallel to each other and a first slit between the two first grating lines. The plurality of second diffraction gratings is disposed on the second imaging area of the first surface and parallel to each other, each of the second diffraction gratings includes two second grating lines parallel to each other and a second slit between the two second grating lines, and the first diffraction gratings are not parallel to the second diffraction gratings or a width of the first slit is different from a width of the second slit.
Patent TW-202025345-A (TW)
Inventor: LIANTO PRAYUDI
IPC: H01L23/29
Filed: 2019-10-24
Abstract: 本案揭示了用於在基板上產生精細間距圖案化的方法和設備。在載體或無載體的基板上完成基板的翹曲校正。藉由將基板的溫度升高到第一溫度且保持為第一溫度以及將無載體的基板冷卻到第二溫度來對此基板執行第一翹曲校正製程。接著執行進一步晶圓級封裝處理，諸如在基板上的聚合物層中形成通孔。隨後藉由將基板的溫度升高到第三溫度且保持為第三溫度以及將此基板冷卻到第四溫度來對此基板執行第二翹曲校正製程。隨著基板的翹曲減小，可以用2/2μm l/s精細間距圖案化來在基板上形成再分佈層。
Patent TW-202119508-A (TW)
Title: High heat dissipation stacked semiconductor package structure and packing method of the same
Inventor: WU PO-HSUN
IPC: H01L21/60
Filed: 2019-11-12
Abstract: The present invention relates to a high heat dissipation stacked semiconductor package structure and a packaging method for the same. The stacked semiconductor package structure has a chip set and a top chip stacked on the chip set with a underfill encompassing the chip set and the top chip to enhance the strength of the package structure. A heat dissipation layer is formed on the top chip. An encapsulation encompass the heat dissipation layer, but then the heat dissipation layer is exposed and coplanar with the encapsulation in a horizontal axis. The encapsulation is coplanar with the underfill in a vertical axis. Therefore, the top chip is protected by the heat dissipation layer and is not broken when grinding the encapsulation. The heat dissipation layer can enhance the heat dissipation effect of the integrated stacked semiconductor package structure.
Patent TW-202025995-A (TW)
Title: Bioactive phosphate glasses
Inventor: FU QIANG
IPC: A61K9/22
Filed: 2019-11-20
Abstract: The disclosure relates to bioactive glasses for use in biomedical applications. In particular, the glasses described herein are phosphate glasses that show fast filling rates of dentin tubules and have advantageous release rates of metal ions, which provide advantages in antibacterial applications and wound healing.
Patent TW-202107525-A (TW)
Title: Apparatus for measuring a fluid flow through a pipe of a semiconductor manufacturing device
Inventor: MEKIAS KADER
IPC: H01L21/66
Filed: 2019-12-02
Abstract: The invention relates to an apparatus (100) for measuring a fluid flow through a pipe (101), of a semiconductor manufacturing device (300), in particular a coater or a bonder, comprising a sealing structure (103) which is arranged in the pipe (101), a flow structure (105) having a fluid inlet (107) which is arranged upstream of the sealing structure (103) and a fluid outlet (109) which is arranged downstream of the sealing structure (103), a first chamber (123) which is arranged in the pipe (101) upstream of the sealing structure (103), and a second chamber (125) which is arranged in the pipe (101) downstream of the sealing structure (103), and a measuring device (111), wherein the measuring device (111) is adapted to measure a first fluid pressure in the first chamber (123) and a second fluid pressure in the second chamber (125), wherein the measuring device (111) is configured to determine the fluid flow based on the first and second fluid pressure.
Patent TW-202044198-A (TW)
Title: Image processing method and apparatus, electronic device, and computer readable storage medium
Inventor: SONG TAO
IPC: G06T7/33
Filed: 2019-12-17
Abstract: Disclosed by embodiments of the present disclosure are an image processing method and apparatus, an electronic device, and a computer readable storage medium, wherein the method comprises: acquiring an image to be registered and a reference image used for registration; inputting the image to be registered and the reference image into a preset neural network model, the preset neural network model being trained on the basis of mutual information loss between the image to be registered and the preset reference image; on the basis of the preset neural network model, registering the image to be registered to the reference image, and acquiring a registration result, which may increase the accuracy and real-time performance of image registration.
Patent TW-202018161-A (TW)
Title: Elevating device group for floor board
Inventor: Yang qing-zhong
IPC: E04F15/024
Filed: 2018-11-07
Abstract: An elevating device group for floor boards mainly includes a supporting seat, and a bearing surface is arranged on the top surface thereof; a bearing groove is concavely arranged on the bearing surface for installing a positioning plate, which can perform 360-degree rotating activity, and the positioning plate is provided with a plurality of positioning holes; these positioning holes can be inserted by the positioning pieces, by which the user can, according to the shape of the floor board and the angle between the floors to be spliced, insert the positioning pieces correspondingly in the positioning holes between adjacent floor boards, so that the invention has the functions of water supply and drainage and the bottom for pipeline configuration in addition to positioning floor boards, not only being an environmentally friendly green building material, but also being suitable for various floor boards of various shapes and splicing angles and various indoor and outdoor places.
Patent TW-202127113-A (TW)
Inventor: CHEN HUANG-MING
IPC: G09G3/32
Filed: 2020-01-07
Abstract: 本揭露係提供一種空間光調製器，包括:面板及面板驅動器。面板包括超高像素密度背板及液晶層，其中超高像素密度背板包括具備至少4000PPI的像素陣列，液晶層包括具備第一優質因子值的超高優質因子液晶材料。面板驅動器連接至面板，用於執行面板快速驅動設計來驅動面板。
Patent TW-202111704-A (TW)
Title: Semiconductor memory device
Inventor: ODE HIROYUKI
IPC: G11C11/4063
Filed: 2020-01-08
Abstract: According to one embodiment, a semiconductor memory device includes: a first and a second wirings; a third wiring disposed between them; a first phase change layer disposed between the first and the third wirings; a first conducting layer disposed on a first wiring side surface of the first phase change layer; a second conducting layer disposed on a third wiring side surface of the first phase change layer; a second phase change layer disposed between the third and the second wirings; a third conducting layer disposed on a third wiring side surface of the second phase change layer; and a fourth conducting layer disposed on a second wiring side surface of the second phase change layer. The first and the fourth conducting layers have coefficients of thermal conductivity larger or smaller than the coefficients of thermal conductivity of the second and the third conducting layers.
Patent TW-202045533-A (TW)
Title: Modified il-12 t cell therapy for the treatment of cancer
Inventor: LI SHULIN
IPC: C07K14/54
Filed: 2020-01-31
Abstract: Provided herein are chimeric antigen receptor (CAR)-like constructs comprising tumor-targeted and membrane-anchored IL-12. Also provided herein are T cells expressing the CAR-like IL-12 construct. Further, methods of treating cancer comprising administering T cells expressing CAR-like IL-12 are provided herein.
Patent TW-202100792-A (TW)
Title: Solid vaporizing/supplying system for thin film-forming metal halide compound
Inventor: ITSUKI ATSUSHI
IPC: C23C16/448
Filed: 2020-02-07
Abstract: Provided is a solid vaporizing/supplying system for a thin film-forming metal halide compound with which particle contamination can be reduced. The invention comprises an evaporation material container 100 for storing and evaporating a thin film-forming metal halide compound, and a buffer tank 101 connected to the evaporation material container 100, wherein: the evaporation material container 100 includes a container body having a container wall, a lid, a fastening member, and a joint member; the container wall has a double-wall structure constituted by an inner wall member and an outer wall member, and is configured such that a carrier gas is introduced into the container body via a space between the double-wall structure; the container wall is made of copper at a purity of 99 to 99.9999%, aluminum at a purity of 99 to 99.9996%, or titanium at a purity of 99 to 99.9999%; and the container body, the lid, the fastening member, and the joint member are each subjected to fluorine resin coating and/or electrolytic polishing.
Patent TW-202131499-A (TW)
Title: Word-line structure, memory and method of manufacturing the same
Inventor: WANG LI-TING
IPC: H01L27/11563
Filed: 2020-02-11
Abstract: Provided is a word-line structure including a substrate , a word line, and an epitaxial pattern. The word line is embedded in the substrate. The word line includes a conductive layer, a barrier layer, an insulating layer, and a gate dielectric layer. The barrier wraps a lower portion of the conductive layer. The insulating layer wraps an upper portion of the conductive layer. The gate dielectric layer surrounds the insulating layer and the barrier layer to electrically isolate the barrier layer and the substrate. The epitaxial pattern is disposed between the insulating layer and the substrate and in contact with the substrate. A memory device including the word-line structure and a method of manufacturing the same are also provided.
Patent TW-202042913-A (TW)
Title: Shower column assembly
Inventor: SIERKS ERIK
IPC: E03C1/06
Filed: 2020-02-15
Abstract: A shower column assembly includes a shower column, and first and second shower column mounts. A showerhead is fluidically connected at a first end of the shower column, and a hand shower is fluidically connected to the shower column via a hose connection at a second end of the shower column opposite the first end. A diverter is positioned within the shower column at the supply location, and a flow selection valve is positioned offset from the diverter along a fluid path defined, at least in part, by the shower column.
Patent TW-202129884-A (TW)
Title: 封裝結構
Inventor: LI JEN-CHIH
IPC: H01L29/40
Filed: 2020-02-19
Abstract: 本發明提供一種封裝結構，包括：基板、複數個主動元件、複數個分離的金屬部、以及封裝材料。基板具有第一表面與第二表面。每一主動元件具有第一表面與第二表面。每一金屬部具有第一表面與第二表面。每一主動元件的第一表面連接基板的第一表面。一金屬部的第一表面連接一主動元件的第二表面。每一金屬部延伸連接基板的第一表面。封裝材料覆蓋基板的第一表面，並包圍主動元件與金屬部，露出每一金屬部的第二表面以及基板的第二表面。
Patent TW-202131971-A (TW)
Title: Mechanical flip box for demonstration
Inventor: SUNG HUEI-CHUAN
IPC: A63B22/08
Filed: 2020-02-21
Abstract: A mechanical flip box for demonstrating a piece of equipment, includes a box body, a winding mechanism, and a plurality of flip pieces. The box body defines an accommodation space and is formed with an opening communicating with the accommodation space. The winding mechanism is disposed in the accommodation space, and includes a drive unit and a roller shaft. The drive unit is partially exposed out of the accommodation space, and generates a kinetic energy while a force acting thereon. The roller shaft rotates when receiving the kinetic energy transferred from the drive unit. The flip pieces are sequentially disposed on an outer surface of the roller shaft, and extend outward from a center of the roller shaft. When the roller shaft is still, at least one of the flip pieces covers the opening. When the roller shaft rotates, the flip pieces are brought into flip-over and thereby pass the opening sequentially. The flip pieces are each formed with illustration drawings for continuously demonstrating the equipment.
Patent TW-202039944-A (TW)
Title: Method and apparatus for producing SiC substrate
Inventor: KANEKO TADAAKI
IPC: C30B25/08
Filed: 2020-03-05
Abstract: The present invention addresses the problem of providing a method and apparatus for producing an SiC substrate, by which an SiC substrate having a thin base substrate layer is able to be produced, while suppressing deformation or breakage. The present invention is characterized by being provided with: a main container 20 which is capable of containing an SiC base substrate 10, and which produces a vapor pressure of a vapor-phase species containing elemental Si and a vapor-phase species containing elemental C within the internal space by means of heating; and a heating furnace 30 which contains the main container 20 and heats the main container 20 so as to form a temperature gradient, while producing a vapor pressure of a vapor-phase species containing elemental Si within the internal space. The present invention is also characterized in that the main container 20 has a growth space S1 in which a growth layer 11 is formed on one surface of the SiC base substrate 10, and an etching space S2 in which the other surface of the SiC base substrate 10 is etched.
Patent TW-202137406-A (TW)
Title: 半導體結構及其形成方法
Inventor: SHEN HSIN-HUANG
IPC: H01L21/324
Filed: 2020-03-19
Abstract: 一種半導體結構的形成方法，包含形成閘極電極層於半導體基底之上、形成第一間隔物層以覆蓋閘極電極層的側壁、凹蝕第一間隔物層以暴露出閘極電極層側壁的上部、形成金屬材料覆蓋閘極電極層的上表面和側壁的上部、使用退火製程使該極電極層的半導體材料與金屬材料反應，以形成矽化物層、以及在退火製程之後，移除金屬材料。
Patent TW-202045332-A (TW)
Title: Fiber-reinforced resin molding material molded product and method for producing same
Inventor: YAMANAKA YUSUKE
IPC: C08J5/24
Filed: 2020-03-23
Abstract: Provided are a fiber-reinforced resin molding material molded product and a method for producing same, the molded product being a molded product [D] made of a fiber-reinforced resin molding material [C] obtained by impregnating chopped fiber bundles [A] with a matrix resin [B], wherein in a region excluding 30 mm from the edge of the molded product [D], when an arbitrary rectangular region having an area of at least 40 mm2 and defined by the thickness of the molded product and the width in the direction perpendicular to the thickness direction of the molded product is set in a cross section in an arbitrary thickness direction of the molded product [D], the bundle thickness [E] of the chopped fiber bundles [A] present in the set rectangular region satisfies the requirements [1]-[3] below: [1] when a frequency distribution in which the values of the bundle thickness [E] are distributed at intervals of every 0 [mu]m to 10 [mu]m is created, the most frequent value of the bundle thickness [E] in the span representing the highest value is in the range of 30-100 [mu]m; [2] the proportion of the chopped fiber bundles [A] having a bundle thickness [E] of at least 200 [mu]m is 5% or less; and [3] the CV value of the bundle thickness [E] is in the range of 10-60%. A fiber-reinforced resin molding material molded product capable of exhibiting excellent homogeneity and mechanical properties can be obtained.
Patent TW-202044498-A (TW)
Title: Semiconductor device packages
Inventor: CHEN YING-CHUNG
IPC: H01L23/28
Filed: 2020-03-31
Abstract: The present disclosure relates to a semiconductor device package, which includes a substrate, a heat dissipation structure disposed on the substrate, and a first optical module disposed on the heat dissipation structure. The heat dissipation structure includes a housing, an optical component disposed on the housing, and a light-emitting device disposed in the housing and capable of emitting light toward the first optical component.
Patent TW-202141847-A (TW)
Inventor: CHANG CHUN-YUAN
IPC: H01Q1/24
Filed: 2020-04-28
Abstract: An antenna supporting device and communication device thereof are provided. The antenna supporting device supports a cantilever of an antenna. The cantilever includes a first radiating section and a second radiating section. The antenna support device includes a body. The body includes a top surface and a side surface. The top surface has a first groove. The side surface has a second groove. The first groove and the second groove extend in the same direction to respectively accommodate the first radiating section and the second radiating section of the cantilever.