baber/WOPTO huggingface dataset:
Patent JP-S62288867-A (JP)
Title: Both-face image forming device
Inventor: MIYATA MASANORI
IPC: G03G21/00
Filed: 1986-06-09
Abstract: PURPOSE:To allow the omission of pictures to hardly occur, by finding a copying magnification in accordance with the size of a form and original size for a 2nd face when the original size for forming image on the 2nd face of the form is different from the original size applied for picture formation on the 1st face of the form. CONSTITUTION:When a copy start key is depressed, a document for the 1st face is fed from a document feeder 300 and the optimum cassette is found from the original size, and then, a 1st-face copying operation is started. When the copying operation is completed, the form is once stored in an intermediate tray 202 and the 1st-face original is discharged. Then a 2nd-face original is drawn in and the original size is checked. When the original size of the 2nd-face is different from that of the 1st-face, the optimum magnification is calculated from the document size and the size of the form stored in the intermediate tray 202 so that the images can be copied on the form. Thereafter, a zoom lens is moved in accordance with the calculated magnification and the 2nd-face copying operation is carried out.
Patent JP-H067990-A (JP)
Title: Solder material and joining method
Inventor: IDETA GORO
IPC: B23K1/00
Filed: 1992-05-26
Abstract: PURPOSE:To lighten the heat stress applying to a semiconductor tip, to prevent the deviation of positional relation of the members to be joined from generating, and together to shorten the time when the solder material is solidified while keeping the temperature nearby the melting temperature by keeping the interval of the semiconductor tip and the base material after joining in the prescribed value. CONSTITUTION:A semiconductor tip 1 and a lead frame 2a are arranged through the solder material composed of the 1st solder 6 and the 2nd solder 7a, 7b, and the semiconductor tip 1 and the lead frame 2a are joined by applying the temperature lower than the melting point of the 1st solder, higher than the melting point of the 2nd solder 7a, 7b and melting the 2nd solder 7a, 7b. Then, the 2nd solder 7a, 7b is solidified by lowering the heating temperature, or while keeping the initial melting temperature, it is solidified due to the elevation of melting point caused by the change of composition of the 2nd solder 7a, 7b.
Patent JP-H0427392-A (JP)
Title: G6 amylase gene
Inventor: HORIKOSHI KOKI
IPC: C12R1/07
Filed: 1990-05-23
Abstract: NEW MATERIAL:A G6 amylase gene coding a G6 amylase having the amino acid sequence of formula or coding a polypeptide having enzymatic activity similar to the amylase. USE:Mass production of G6-amylase having wide working pH range and high heat-resistance. PREPARATION:The objective G6 amylase gene can be produced e.g. by culturing Bacillus H-167 strain (FERM P-8683) belonging to alkalophilic bacillus in an alkaline medium, collecting the cells by centrifugal separation, separating chromosome DNA by phenol process, treating with restriction enzyme, linking the obtained fragment to a cloning vector, transforming E.coli, culturing the transformant in a starch-containing medium, selecting a clone having amylase activity and forming a distinct clear zone around the colony, collecting the plasmid, treating with restriction enzyme and subjecting to Southern hybridization.
Patent JP-S62295150-A (JP)
Title: Ic card
Inventor: TAMADA TAKEO
IPC: G06F21/31
Filed: 1987-05-29
Abstract: PURPOSE:To effectively protect the contents of a memory by dividing a data memory into an accessible zone and an impossible zone by an user or an using equipment. CONSTITUTION:The data memory 4 of an E<2>PROM constitution in which a control program and data are stored is divided into plural zones and a zone definition parameter table storing the access condition every zone is provided in a zone access control memory 5 of the E<2>PROM constitution. Further, in the table, an operator key memory area (a), a type of terminal equipment memory area (b) or the like are provided, in the area (a), when a producer can make access, the first bit is defined to be 1, when an issuer can make access, the second bit to be 1, when the user can make access, the third bit to be 1 respectively, and in the area (b), in the area (b), an issuing machine, an updating machine and a transaction machine can respectively make access, the first bit, the second bit and the third bit are respectively defined to be 1.
Patent JP-S5759355-A (JP)
Title: Manufacture of semiconductor device
Inventor: SAKURAI JIYUNJI
IPC: H01L21/3065
Filed: 1980-09-26
Abstract: PURPOSE:To prevent the disconnection of an upper layer wiring body by smoothly molding a shoulder section of a lower layer wiring body in multilayer wiring formed on a semiconductor substrate. CONSTITUTION:A metallic film 3 in aluminum, etc, is shaped onto a silicon dioxide film 2 coating the silicon substrate 1, and a wiring pattern 3' having high accuracy is formed through reactive-ionic-etching while using a photo-resist pattern 4 as a mask. When the whole surface of the silicon substrate to which the wiring pattern is shaped is etched by ions 5 using an inert gas, the shoulder section 6 is deformed and smoothed due to a shock of the ions. The upper layer aluminum wiring 7 and an insulating film 8 in phosphorus silicate glass, etc. are formed through a normal process.
Patent JP-H08330497-A (JP)
Title: Lead frame and semiconductor device having the same
Inventor: KATO MASAAKI
IPC: H01L23/50
Filed: 1995-05-31
Abstract: PURPOSE: To obtain a strong adhesion with an adhesive agent and/or covering sealing resin by causing a plated layer to contain minute substances of the same composition as the adhesive agent, and causing the minute substances to be exposed above the surface of the plated layer. CONSTITUTION: On the surface of a lead frame 11, a semiconductor bare chip 12 is packaged with silver paste 13 interposed. Concretely, a raw material 14 for a lead frame of iron, copper alloy, iron-nickel alloy, etc., is coated with a primarily plated layer 16 containing minute epoxy balls 15 of the same composition as the silver paste 13. The primarily plated layer 16 is coated with a secondarily plated layer 17, and the minute epoxy balls contained in the primarily plated layer 16 protrude from the of the secondarily plated layer 17. Strong adhesion can be obtained since the silver paste 13 and the minute epoxy balls 15 have the same composition. In addition, it becomes possible to obtain bondability capable of excellent die bonding and wire bonding, since the surface of the lead frame is composed of a secondarily plated layer 17 of noble metals of silver, gold, and palladium.
Patent JP-S5658247-A (JP)
Title: Production of semiconductor device
Inventor: TAKADA CHIYUUICHI
IPC: H01L21/3213
Filed: 1979-10-17
Abstract: PURPOSE:To obtain a buried wiring layer with a flat surface by covering a wiring body formed on the surface of a substrate with a flat insulation layer while unnecessary sections are removed from the wiring body and the insulation layer by nonselective etching. CONSTITUTION:An SiO2 film 2 is applied on an Si substrate 1, an Al wiring body 3 with a specified pattern is provided thereon and an SiO2 film 4 is formed on the entire surface thereof by CVD method. At this point, as the corresponding part of the film 4 swells with respect to the wiring body 3, high molecular compound such as photoresist and polymide, and a liquid glass is applied and baked until a flat insulator layer 4 is formed. Then, the assembly is placed into a parallel flat plate type reactive sputtering etching device and so etched by a gas mixture of H2 and CCl4 that the wiring body 3 is surrounded with a layer with a flat surface 4 leaving the layer 4 on the surface thereof slightly. Thereafter, the surface of the wiring  body 3 is exposed by additional etching if necessary.
Patent JP-S5659370-A (JP)
Title: Mark read device
Inventor: HOUKI YOUJI
IPC: G06K7/10
Filed: 1979-10-17
Abstract: PURPOSE: To increase the sheet processing speed without spoiling the resolution, by subscanning in the longitudinal direction of a mark which has been put on the sheet, and also increasing the subscanning speed so that size of the picture element recognized by the line sensor can be lengthened in the subscanning direction.  
     CONSTITUTION: The sheet 1 on which the mark information has been recorded is set in the direction which marks the longitudinal direction of the mark parallel with the subscanning direction, and the sheet is conveyed by the rubber roller 2. The encoder 3 coupled directly with the rubber roller 2 rotates the rubber roller 2, at the same time outputs a signal showing the sheet conveying amount, operates the pulse counter 4, and conveyance of the sheet 1 reaches the prescribed amount. Namely, when the pulse count number has reached the prescribed value, scanning of the line sensor 5 is started. On the other hand, the reflected ray of the mark information recorded on the sheet is focused by the condenser 6, it is made incident to the line sensor 5. When the subscanning pitch in the conveying direction of the picture element is made larger than the main scanning pitch, the sheet conveying speed can be increased without deteriorating the resolution. 
     COPYRIGHT: (C)1981,JPO&Japio
Patent JP-2000050057-A (JP)
Title: Image processing method and device and medium
Inventor: KAWAMURA NAOTO
IPC: G06T1/00
Filed: 1999-05-14
Abstract: PROBLEM TO BE SOLVED: To improve both image quality and resistance in burying additional information to image data. SOLUTION: In this image processing method for burying the additional information to the image data, as shown in the figure for instance, by constituting the components (a), (b), (c) and (d) of a pixel to be buried or a spatial frequency of plural pieces and changing the data values of the plural pieces of the components of the buried pixel or the spatial frequency corresponding to a value corresponding to the data value, the additional information is buried.
Patent JP-S6025921-A (JP)
Title: Etofenamate compound
Inventor: HANSUUDEIITAA DERU
IPC: A61K31/245
Filed: 1984-06-30
Abstract: 1. Cream formulation for etofenamate, characterized in that it contains 5 to 80% by weight of isopropyl myristate and 2 to 30% by weight of etofenamate.
Patent JP-S61292622-A (JP)
Title: Camera
Inventor: HARAGUCHI SHOSUKE
IPC: G03B13/34
Filed: 1985-06-21
Abstract: PURPOSE:To operate many functions efficiently by small number of motors by making zoom driving, operation before photographing, and film driving, operation after photographing, by the first motor, and making focus driving and preparatory driving for photographing which are similar combination to the above, by the second motor. CONSTITUTION:A motor 1 is made the first motor, and from a gear 32 to a gear 39 and from a gear 41 to a gear 43 are made a film driving transmitting system. Gears 10, 11 a slide lever 12 and a zoom driving member 14 are made a zoom driving transmitting system, and a sun gear 3, a planetary gear 5, an arm 6, a spring 8, a spring bracket 9, clutch levers 16, 17 and a stopper member 21 are used for the first clutching device. A motor 44 is made the second motor, and a focus driving member 53 is made a focus driving transmitting system, and a gear 55, a charge gear 56, a charge lever 58, an energy accumulating lever 63, a clamping lever 66, levers 68, 69, 77, an electromagnet 81, a shutter double shielding releasing lever 86 and a shutter charge lever 87 are made an exposure preparation driving transmitting system, and a sun gear 45 is used for the second clutching device.
Patent JP-S5659590-A (JP)
Title: Cooling device for resistance welding machine
Inventor: OKABE YOSHIO
IPC: B23K11/36
Filed: 1979-10-17
Abstract: PURPOSE: To satisfy the normal insulation resistance value between electric paths and the ground and enhance stability and cooling effect by dividing a cooling circuit for welding machine into two circuits and providing a heat exchanger between these.  
     CONSTITUTION: A heat exchanger 10 has a primary cooling circuit for a medium cooling an ignitron, thyristor 2 and a secondary cooling circuit for a medium cooling other structural parts 5, 6, 7, 8 excluding the ignitron, thyristor 2. A cooling water tank is provided on the way of the secondary cooling circuit as the heat exchanger, and part of the primary circuit is admitted into this water tank in a mutually electrically insulated state. As a result, the cooling medium flowing in the primary cooling circuit is sufficiently cooled by the heat exchanger using the cooling water of the welding transformer or electrode or cable of the welding machine as a secondary cooling medium, and consequently the ignitron, thyristor 2, etc. used in the  main power supply circuit are effectively cooled; in addition, the electric paths are perfectly insulated from the ground. 
     COPYRIGHT: (C)1981,JPO&Japio
Patent JP-H0419938-A (JP)
Title: Circuit breaker
Inventor: KOYAMA ATSUSHI
IPC: H01H71/08
Filed: 1990-05-24
Abstract: PURPOSE:To further ensure connection by electrically connecting a movable contact and a connection conductor, fixed to a case, by sliding contact. CONSTITUTION:A movable contact 32 is soldered to the end of a movable contact 31 made of a copper plate. A connection conductor 33 is integrated with a bimetal 9a. A pair of arms 33a are bent and formed on the conductor 33, and the end portion of the movable contact 31 is elastically sandwiched between, being the arms 33a brought into sliding contact with the arms 33a. A shaft 35 is passed through the common hole of the contact 31 and the arms 33. A recessed portion 36a is formed in a resin holder 36 and both ends of the shaft 35 are fitted in a wall. In this case, a compression spring 37 is inserted into the shaft 35 on both sides of the arms 33a. A closing shaft 38 connects the holder 36 to the holder of a pole on each side of the holder 36. The holder 36 is supported to a case via a shaft 38 in such a manner as being freely put in a turning movement. By this constitution a circuit breaker of high reliability and high breaking performance is obtained. Each sliding contact face is coated with a composite material of Ag and C whereby good electric conduction is maintained for a long period of time.
Patent JP-H05306712-A (JP)
Title: Bearing structure for high-speed rotation spindle
Inventor: HATANO KAZUHISA
IPC: F16C35/063
Filed: 1992-04-28
Abstract: PURPOSE:To provide a bearing structure where a high-speed rotation spindle lengthens its service life by stably rotating even at low speed rotation other than the rated high speed rotation. CONSTITUTION:An electric resistance heating element 4 is mounted on the inner periphery of a bearing support for a high-speed rotation spindle 1. Power supply to the electric resistance heating element 4 is controlled by way of temperature difference between the rotating spindle 1 and a housing 2, so that the gap between the inner periphery of an inner race 3a of a bearing 3 and the spindle 1 is held at a design optimal value.
Patent JP-H10312633-A (JP)
Title: Digital disk recorder
Inventor: MIYABE YUTAKA
IPC: G11B20/10
Filed: 1997-05-09
Abstract: PROBLEM TO BE SOLVED: To improve mutual orthogonality between a storage system for a video and audio (V and A) processing system to a memory and a transfer system for the memory to a disk device and also to simplify their control system by controlling and operating the storage system and the transfer system independently when V and A signals are recorded in the disk device via the memory. SOLUTION: Signals from a video processing part 1 and an audio processing part 2 are subjected to synthesizing and separating processing and sent to the memory 5, where the final address VCP is recorded. Then, a difference between the rear address DCP of the V and A signals to be transferred from the memory 5 via a disk I/F control part 6 to the disk device 7 and the final address VCP, i.e., VCP-DCP is meant by a residual storage capacity of the memory 5. When VCP-DCP becomes larger than a prescribed threshold set in a CPU 8, the CPU 8 is controlled by a memory control part 4 to transfer the V and A signals of the memory 5 to the disk device 7. Thus, the storage system of the V and A signals into the memory 5 and the transfer system of data to the disk device 7 are independently operated.
Patent JP-S5934210-A (JP)
Inventor: EERITSUHI RETSUKU
IPC: A47B88/14
Filed: 1983-07-25
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H09316772-A (JP)
Title: Antistatic overlapped moire cloth
Inventor: KAMEMARU KENICHI
IPC: D06C23/00
Filed: 1996-05-29
Abstract: PROBLEM TO BE SOLVED: To obtain an antistatic overlappod moire cloth capable of generating a three-dimensional moire pattern rich in variety by overlapping a surface cloth having a pattern synchronizing with a regular fine line pattern and the antistatic property over an underlaying cloth printed with the regular fine line pattern. SOLUTION: This antistatic overlapped moire cloth is obtained by overlapping a mesh woven fabric excellent in antistatic property and having a fine line pattern as a surface cloth for an overlapping, obtained by weaving with arranging a nylon 50de monofilament as warp yarns, using the same yarn as above and a nylon black colored electroconductive yarn containing a carbon black and alternately striking these two yarns as weft yarns, cover a plain fabric obtained by weaving a polyestor filament for both of the warp and weft yarns as an underlying cloth, and printing a fine line pattern having 0.1-7mm width in 3-100 lines/inch density in one direction after refining the fabric.
Patent JP-2000323425-A (JP)
Title: Processor
Inventor: SUGIURA MASAHITO
IPC: H01L21/68
Filed: 1999-05-14
Abstract: PROBLEM TO BE SOLVED: To provide a processor capable of reducing the foot print and enhancing the throughput. SOLUTION: A pre-processing chamber 120 is disposed in a vacuous carrying chamber 102 of a processor. The pre-processing chamber 120 comprises a positioning mechanism 128 which rotates a wafer W mounted on a mounting stand 130, and positions the wafer W by an optical sensor 134; and a UV lamp 124 which radiates UV via a UV transmission window 126 meshing with a ceiling part of the pre-processing chamber 120 on a surface of the wafer W at the same time as positioning, and removes carbon adhered to the wafer W. The UV is radiated also on a processing gas to be supplied into the pre- processing chamber 120 to remove the carbon also by active atoms generated from the processing gas. As the pre-processing chamber 120 is formed in the vacuous carrying chamber 102, the foot print of the processor can be decreased.  As the positioning of the wafer W and a contamination removal processing are simultaneously carried out, the throughput is enhanced.
Patent JP-H05327863-A (JP)
Title: Automatic answering telephone set
Inventor: HIRAI YUJI
IPC: H04M1/65
Filed: 1992-05-27
Abstract: PURPOSE:To easily identify a telephone number of a caller whose message is not recorded. CONSTITUTION:A telephone set is provided with a telephone number detection circuit 4 detecting telephone number data inputted from a telephone line 1, a voice signal identification means identifying whether or not a signal inputted from the telephone line 1 is a voice signal, a storage circuit storing a telephone number inputted from the line 1 separately when the voice signal is inputted and not inputted, and a display circuit 10 displaying the telephone number stored and distinguished in the storage circuit 9 in a way of identification. Even when the caller does not record a message, the caller telephone number is displayed and the caller not recording the message easily recognizes the telephone number. Moreover, when the recorded message is replied, dialing is made while observing the telephone number and dialing is easily made without mistake.
Patent JP-H08301536-A (JP)
Title: Stopper for cable winding device
Inventor: YAMAGUCHI AKIHIRO
IPC: B65H75/44
Filed: 1995-05-08
Abstract: PURPOSE: To provide a stopper for a cable winding device, operating the final rotation stop of a drum rapidly and positively and in its turn preventing a cable from being cut by excessive force applied to the connecting part of the drum and cable. CONSTITUTION: A device for rotating a drum 2 with a cable 1 wound thereon so as to wind and deliver the cable 1 is provided with a through hole 3 bored in a place appropriately distant from the cable connecting part of the drum 2, and a stopper operating rod 4 pivotally supported to a drum side plate 5 on the inside of the drum 2. This stopper operating rod 4 has a contact arm 4a formed at one end so as to pass through the through hole 3 and come in energizing contact with the outer peripheral surface of the cable 1, and an operating arm 4b formed at the other end. The device is further provided with a stopper body 11 having a stopper pin 12 energized toward a pin receiver 10 disposed opposedly to the drum side plate 5, and a pin pressing plate 14 installed opposedly to the operating arm 4b so as to press down the stopper pin 12.
Patent JP-S5759971-A (JP)
Title: Wood adhesive
Inventor: SHIMOKAWA WATARU
IPC: C08L57/00
Filed: 1980-09-26
Abstract: PURPOSE: To prepare a wood adhesive composed of a vinyl acetate polymer emulsion, and having excellent resistance to the lowering of adhesivity in hot water or under repeated boiling, by using PVA containing acetoacetic acid ester groups, as protective colloid.  
     CONSTITUTION: The objective adhesive is prepared by the emulsion polymerization of (A) vinyl acetate polymer using (B) protective colloid consisting of a PVA having an average polymerization degree of pref. 500W2,600 and containing (i) acetoacetic acid ester group and (ii) residual acetic acid group. The contents of the component (i) and (ii) are pref. 2W8mol% and 0.1W15mol%, respectively, and the weight ratio of (A) to (B) is pref. 100 to 2W20. 
     COPYRIGHT: (C)1982,JPO&Japio
Patent JP-H09317674-A (JP)
Title: Fluid machinery
Inventor: TERAOKA MASAO
IPC: F04C18/18
Filed: 1996-05-29
Abstract: PROBLEM TO BE SOLVED: To prevent seizure and pressure leakage between the shaft end of a rotor and a casing, by arranging a thinned part in the axial wall of the casing, and arranging a lubricating member in the thinned part between the axial end of the rotor and the axial wall of the casing. SOLUTION: Thinned parts 71, 73 are formed in the left cover 26 of a compressor casing 13 and a casing main body 23, and solid lubricants 19 are arranged in the thinned parts 71, 73. Then, the solid lubricants 19 are pushed and pressed to axial end surfaces of rotors 15, 17 by coil springs 77 (energizing members) through plates 75. Further, discharge pressure is applied from an ejection opening 69 to the solid lubricants 19 through a channel 79. Hereby, clearances 81, 83 among the axial end surface of the rotors 15, 17 and the axial wall of the compressor casing 13 can be lubricated, and seizure among the rotors 15, 17 and the casing 13 can be prevented.
Patent JP-H09319684-A (JP)
Title: Health check system
Inventor: MORI TADASHI
IPC: G06F11/30
Filed: 1996-05-29
Abstract: PROBLEM TO BE SOLVED: To recognize the generation of any fault at a host computer through a communication processor when the operation of the host computer is temporarily interrupted at the time of monitoring mutual operating states by the host computer and the communication processor. SOLUTION: An execution interruption/restart request accepting means 5 accepts an execution interruption/restart request from an operating console 6 and an execution interruption/restart instruction reporting means 4 transmits this information to an execution interruption/restart instruction accepting means 11 inside a communication control program 8 on a communication processor 7. An execution interruption/restart managing means 12 controls the interruption or restart of the host operating state monitoring through a host operating state monitoring means 10 while monitoring time through a time managing means 3 and a time synchronizing means 9 for synchronizing the time between a host computer 1 and the communication processor 7 according to this information.