Patent SG-11201906310V-A (SG)
Title: Mass transfer of micro structures using adhesives
Inventor: CHONG WING
IPC: H01L33/08
Filed: 2017-12-11
Abstract: SiliconSubstrate ''Adhesive 260 (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 21 June 2018 (21.06.2018) WI P0 I PC T ill mu °mons I SID o HE HE VIII ill Imo VII IE (10) International Publication Number WO 2018/111752 Al (51) International Patent Classification: H01L 33/08 (2010.01) HOlL 21/78 (2006.01) H01L 27/15 (2006.01) H01L 21/306 (2006.01) (21) International Application Number: PCT/US2017/065553 (22) International Filing Date: 11 December 2017 (11.12.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/433,741 13 December 2016 (13.12.2016) US 15/836,703 08 December 2017 (08.12.2017) US (71) Applicant: HONG KONG BEIDA JADE BIRD DIS- PLAY LIMITED [CN/CN]; Unit 7605, 76/F The Center, Queen's Rd Central, Hong Kong (CN). (72) Inventors; and (71) Applicants: CHONG, Wing, Cheung [ /CN]; c/o Hong Kong Beida Jade Bird Display Limited, Unit 7605, 76/F The Center, Queen's Rd Central, Hong Kong (CN). ZHANG, Lei [US/US]; c/o Hong Kong Beida Jade Bird Display Lim- ited, Unit 7605, 76/F The Center, Queen's Rd Central, Hong Kong (CN). OU, Fang [CN/US]; c/o Hong Kong Beida Jade Bird Display Limited, Unit 7605, 76/F The Center, Queen's Rd Central, Hong Kong (CN). LI, Qiming [CN/US]; c/o Hong Kong Beida Jade Bird Display Limited, Unit 7605, 76/F The Center, Queen's Rd Central, Hong Kong (CN). (74) Agent: FARN, Michael, W. et al.; Fenwick & West LLP, Silicon Valley Center, 801 Califorinia Street, Mountain View, CA 94041 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (54) Title: MASS TRANSFER OF MICRO STRUCTURES USING ADHESIVES Laser Sapphire Substrate 242 W O 20 18/ 11175 2 Al GaN Micro LED 240 FIG. 2C (57) : Mass transfer of micro structures are effected from one substrate to another using adhesives. In the context of an inte- grated micro LED display, a micro LED array is fabricated on a native substrate and corresponding CMOS pixel drivers are fabricated on a separate substrate. The micro LED substrate (e.g., sapphire) and the CMOS substrate (e.g., silicon) may be incompatible. For example, they may have different thermal coefficients of expansion which make it difficult to bond the micro LEDs to the pixel driver circuitry. The micro LED array is transferred to an intermediate substrate (e.g., silicon) by use of an adhesive. This intermediate sub- strate may be used in a process of bonding the micro LED array to the array of pixel drivers. The intermediate substrate is separated from the micro LED array by releasing the adhesive. [Continued on next page] WO 2018/111752 Al MIDEDIMOMBIMMIN311010HERIDIIMEMOIMIE (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))