baber/WOPTO huggingface dataset:
Patent TW-202122349-A (TW)
Title: Method for regenerating carbonate-type layered double hydroxide and acidic exhaust gas treatment facility
Inventor: ITOU ICHIROU
IPC: F23G7/06
Filed: 2020-03-11
Abstract: The purpose of the present invention is to provide: a method for regenerating a carbonate-type layered double hydroxide, said method being capable of efficiently regenerating an anion-type Mg-Al layered double hydroxide (Mg-Al LDH), which has been used in an acidic exhaust gas treatment, to a carbonate-type Mg-Al LDH; and an acidic exhaust gas treatment facility. A method for regenerating a carbonate-type layered double hydroxide according to the present invention regenerates a carbonate-type Mg-Al LDH by bringing a mixed gas, which is at 70 DEG C or higher and contains water and carbon dioxide at a concentration of 5 vol% or more, into contact with an anion-type Mg-Al LDH that is generated in an acidic exhaust gas treatment that uses the carbonate-type Mg-Al LDH.
Patent TW-202134111-A (TW)
Title: Power detection system and total power estimation method capable of providing a higher level precision to estimate a total power of a bicycle rider applying to a bicycle
Inventor: Jiang meng-hua
IPC: G06F17/00
Filed: 2020-03-12
Abstract: A power detection system comprises a power sensor, a control unit, a storage unit, and a processor. The power sensor comprises a sensing unit and a signal processing unit. The sensing unit is selectively disposed on a right side operation part or a left side operation part of a bicycle. The signal processing unit outputs a corresponding electrical signal according to deformation of the sensing unit. The control unit is controlled by a user and outputs a weighting instruction. The processor, after receiving the weighting instruction, stores the weighting instruction in the storage unit and retrieves a weighting parameter corresponding to the weighting instruction according to a reference table stored the storage unit. The processor receives the electrical signal output by the signal processing unit and calculates a first power value and multiplies the first power value by the weighting parameter to obtain a second power value, and adds the first power value and the second power value to obtain a total power value.
Patent TW-202106128-A (TW)
Title: Printing method, and method for manufacturing hole-filled board and circuit board
Inventor: TANAKA TAKAYUKI
IPC: H05K7/06
Filed: 2020-03-26
Abstract: This printing method includes: a placement step for placing a mask in which a hollow opening section is formed on a support substrate having a plurality of through holes formed therein, such that the single opening section is in communication with two or more of the through holes; a supply step for supplying a resin composition to a surface of the mask on the reverse side from the support substrate; a first printing step for filling the resin composition in the through holes by moving a first squeegee on the surface of the mask and relatively along said surface such that the first squeegee is partially pressed into the opening section; and a second printing step for applying a resin composition upon the resin composition that has been filled in the through holes by moving a second squeegee on the surface of the mask and relatively along said surface.
Patent TW-202043297-A (TW)
Title: Method for manufacturing substrate with cured film, substrate with cured film, photosensitive resin composition, cured film obtained by curing photosensitive resin composition, and display device having cured film or substrate with cured film
Inventor: NIINA Masashi
IPC: C08L63/10
Filed: 2020-03-26
Abstract: This invention provides a method for manufacturing a substrate with a cured film. 
 
     A method for manufacturing a substrate with a cured film according to the present invention is a method for producing a substrate with a cured 
film by forming a cured film pattern having light scattering properties on the substrate, wherein an photosensitive resin composition having an inorganic particle with average particle diameter of 100 to 700 nm is applied onto a substrate, exposed through a photomask, and the unexposed portions are removed by development, and heated to form a predetermined cured film pattern.
Patent TW-202102236-A (TW)
Title: Compositions and methods for cancer immunotherapy
Inventor: HSIA HOUN SIMON
IPC: A61K31/202
Filed: 2020-04-01
Abstract: Compositions and methods are described in which a nutritional supplement（such as a supplement that includes chromium and certain plant-derived materials and/or a supplement that includes a selenium yeast peptide complex and fish oil）is used to provide an immunotherapeutic effect, which can be demonstrated by modulation of cell-surface markers targeted by conventional immunotherapeutic drugs. The nutritional supplements can be used in combination with other antineoplastic therapies, such as radiation and/or chemotherapeutic agents. Such combination therapy can provide a synergistic effect in regard to modulation of cell surface markers that serve as immunotherapy targets.
Patent TW-202042159-A (TW)
Title: 與分散式帳本相關聯之目的地定址技術
Inventor: MEE ANDY
IPC: G06F21/33
Filed: 2020-04-08
Abstract: 本揭露內容係關於與用於諸如比特幣區塊鏈之一分散式帳本之一交易相關聯之方法、裝置及/或系統。在一些實施例中，本揭露內容係關於一種用於基於請求執行付款人實體驗證之方法。在其他實施例中，本揭露內容係關於一種用於當一收款人實體無回應時實施由一付款人實體發送之一請求的異步處理之方法。
Patent TW-202100946-A (TW)
Title: Method of measuring semiconductor wafer thickness and system of measuring semiconductor wafer thickness
Inventor: MIYAZAKI YUJI
IPC: G01B11/06
Filed: 2020-04-23
Abstract: Methods of measuring semiconductor wafer thickness capable of decreasing variations of measured values of thickness resulting from the in-plane temperature variation when measuring the thickness of a semiconductor wafer in a plurality of points in the surface thereof using a spectral interference method at short time are provided. When measuring the thickness of a semiconductor wafer in a plurality of points in the surface thereof using a spectral interference method, steps of finding a refractivity and an optical path length of a thickness at a predetermined position of the surface of the semiconductor wafer and finding a measured value of the thickness of the semiconductor wafer at the predetermined position using the optical path length divided by the refractivity are performed at a plurality of points in the surface of the semiconductor wafer.
Patent TW-202040572-A (TW)
Inventor: RAMASWAMY DURAI VISHAK NIRMAL
IPC: G11C11/24
Filed: 2018-06-28
Abstract: A memory array comprises vertically-alternating tiers of insulative material and memory cells, with the memory cells individually comprising a transistor comprising first and second source/drain regions having a channel region there-between and a gate operatively proximate the channel region. At least a portion of the channel region is horizontally-oriented for horizontal current flow in the portion between the first and second source/drain regions. A capacitor of the memory cell comprises first and second electrodes having a capacitor insulator there-between. The first electrode is electrically coupled to the first source/drain region. A horizontal longitudinally-elongated sense line is in individual of the memory-cell tiers. Individual of the second source/drain regions of individual of the transistors that are in the same memory-cell tier are electrically coupled to the horizontal longitudinally-elongated sense line in that individual tier of memory cells. A capacitor-electrode structure extends elevationally through the vertically-alternating tiers. Individual of the second electrodes of individual of the capacitors are electrically coupled to the elevationally-extending capacitor-electrode structure. An access-line pillar extends elevationally through the vertically-alternating tiers. The gate of individual of the transistors in different of the memory-cell tiers comprises a portion of the elevationally-extending access-line pillar. Other embodiments, including method, are disclosed.
Patent TW-202145442-A (TW)
Title: Manufacturing method of semiconductor device
Inventor: LAI CHUN-CHI
IPC: H01L21/768
Filed: 2020-05-19
Abstract: A manufacturing method of a semiconductor device is provided. A substrate is provided. The substrate has an active area. A plurality of word lines are formed on the substrate. Each of the word lines extends along a first direction, and the word lines are arranged on both sides of the active area along a second direction. A first dielectric layer is formed on the substrate. The first dielectric layer covers the active area and the word lines. A contact is formed on the active area. The contact is penetrated through the first dielectric layer and electrically connected to the active area. The first dielectric layer is heated to shrink the first dielectric layer inward, and the contact expands outward correspondingly.
Patent TW-202044368-A (TW)
Title: Method of manufacturing molded chip
Inventor: SUZUKI KATSUHIKO
IPC: H01L21/304
Filed: 2020-05-20
Abstract: A method of manufacturing a molded chip includes a preparing step of sticking device faces of a plurality of device chips arrayed to a protective member that is thermally insulative, thereby forming a chip group; a molding step of, after the preparing step, supplying a molding resin to reverse sides of the device chips and gaps between the device chips, thereby forming a molded wafer in which the reverse sides and side faces of the device chips are covered with a resin molding; and a molded wafer dividing step of, after the molding step, dividing the molded wafer along centers of the gaps filled with the resin molding into molded chips on the basis of an image in which a face side of the molded wafer has been captured.
Patent TW-202147361-A (TW)
Inventor: LIN CHIEH
IPC: H01G11/12
Filed: 2020-06-10
Abstract: A winding-type capacitor package structure and a method of manufactured the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a positive winding conductive foil and a negative winding conductive foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure includes a main casing for enclosing the filling body and a retaining body inwardly bent from a bottom side of the main casing. The bottom carrier frame is disposed on a bottom portion of the casing structure as so to protect the filling body and match with the casing structure. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be retained and limited inside the casing structure through the retaining body.
Patent TW-202200466-A (TW)
Title: An internal combustion engine with hydrogen-oxygen and fog fuel hybrid system
Inventor: CHIU KAO-KUNG
IPC: A61L2/18
Filed: 2020-06-16
Abstract: An internal combustion engine with hydrogen-oxygen and fog fuel hybrid system, which includes a housing, a fuel injector and a hydrogen-oxygen separation device, the housing is provided with a combustion chamber and an air inlet in communication with the combustion chamber, the fuel injector and the hydrogen-oxygen separation device are disposed on the housing and are in communication with the air inlet, the fuel injector atomizes the fuel and sprays it into the air inlet, the hydrogen-oxygen separation device sprays hydrogen and oxygen into the air inlet, The atomized fuel and the hydrogen-oxygen gas fuel enter the combustion chamber for explosive use and will not produce hydrocarbons (HC), carbon monoxide (CO), NOx (nitrogen oxides), SOx( sulfur oxides) and lead (Pb) after explosion, thereby, the exhaust gas from the exhaust channel is significantly less harmful than that from the general fuel vehicle, thus reducing exhaust pollution and the use of fuel.
Patent TW-202120544-A (TW)
Title: Bispecific antibodies to tnf-alpha and il-1beta and uses thereof
Inventor: ZHANG DI
IPC: A61P37/00
Filed: 2020-07-09
Abstract: The present disclosure relates to bi-specific antibodies that specifically bind and neutralize both tumor necrosis factor α (TNFα) and interleukin-1β (IL-1β), and to the use of such bispecific antibodies for the therapeutic treatment of TNFα and IL-1β-mediated diseases and disorders.
Patent TW-202203735-A (TW)
Inventor: Wang jun-hao
IPC: H05K7/18
Filed: 2020-07-16
Abstract: A detachably fixing device includes a base, a circuit board carrying plate, and a sliding plate. The circuit board carrying plate is slidably disposed on the base along a first direction and has a carrying plate linkage portion. The sliding plate is slidably disposed on the base along a second direction. The first direction and the second direction are non-parallel. The sliding plate has a sliding plate linkage portion and an engaging portion. The sliding plate linkage portion and the carrying plate linkage portion are mechanically connected. The circuit board carrying plate is operable to move to make the sliding plate slide outward relative to the base, so that the engaging portion protrudes from the base. An electronic apparatus casing includes a casing frame and the detachably fixing device. The casing frame has an engaging structure. The detachably fixing device is detachably disposed on the casing frame. The engaging portion is separably engaged with the engaging structure.
Patent TW-202111022-A (TW)
Title: Radiation curable intaglio inks
Inventor: SPITTELER JEAN-DANIEL
IPC: C09D11/101
Filed: 2020-07-24
Abstract: The present invention relates to the field of security documents and their protection against counterfeit and illegal reproduction and relates to the field of intaglio printing processes for the printing of said security documents. In particular, the present invention relates to radiation curable intaglio inks suitable for intaglio printing a pattern or image, wherein said intaglio printing comprises wiping off ink excess with a polymeric wiping cylinder and cleaning said cylinder with an alkaline aqueous wiping solution. The disclosed radiation curable intaglio inks comprise one or more radiation curable compounds, wherein at least one of said one or more radiation curable compounds is a fatty acid polyester (meth)acrylate oligomer; one or more photoinitiators; and a high molecular weight acid modified alkyd surfactant and/or an alkylarene sulfonic acid surfactant; one or more fillers or extenders.
Patent TW-202207161-A (TW)
Title: 運輸監控方法及其系統
Inventor: CHEN YI-TA
IPC: G06T7/11
Filed: 2020-08-05
Abstract: 本發明提出一種運輸監控方法，包括以下步驟：通過影像擷取裝置從固定視野擷取機械手臂在承載容器外的監控影像，其中機械手臂用以將物品移入或移出承載容器；通過處理裝置從監控影像中獲得取樣區域；以及，通過處理裝置根據取樣區域來判斷機械手臂的傾斜狀態，其中當處理裝置判斷機械手臂傾斜時，由處理裝置發出警示信號。一種運輸監控系統亦被提出。
Patent TW-202123342-A (TW)
Title: Heat treatment method and heat treatment apparatus
Inventor: MATSUURA HIROYUKI
IPC: H05B6/64
Filed: 2020-08-11
Abstract: The invention provides a heat treatment method and a heat treatment apparatus. The heat treatment method includes: forming an amorphous silicon film having a hydrogen concentration in a film of 5*1019atoms/cm3 or more, on a substrate; and irradiating the substrate with microwaves to heat the amorphous silicon film thereby forming a polycrystalline silicon film from the amorphous silicon film.
Patent TW-202207872-A (TW)
Title: Electrotherapy device with inhibiting knob over-excited operation
Inventor: YANG SHIH-LIANG
IPC: A61H39/00
Filed: 2020-08-18
Abstract: The present invention is an electrotherapy device with inhibiting the over-excited operation of the knob. The operating knob of the electrotherapy device is linked with a potentiometer, and the movable contact of the potentiometer outputs a voltage value with the rotation of the knob. This voltage value is captured by a microcontroller and calculated and analyzed. When the voltage change rate exceeds the threshold value, it is regarded as an over-excited operation. At this time, the microcontroller can output the suppression signal to suppress the signal output generated by the pulse generator, and record the potentiometer voltage value before the over-excitation operation. When the operating knob returns to the relative voltage before the over-excitation operation, the suppression signal is released, and the operation before the over-excitation operation is restarted. An electrotherapy with inhibiting over-excitation operation function can prevent users from improper operation, misoperation or man-made mischievous operations, resulting in excessively strong output signals of the electrotherapy device, causing discomfort to the patient, and improving the safety and comfort of the electrotherapy device.
Patent TW-202108724-A (TW)
Title: Adhesive composition, adhesive layer and adhesive film to provide high adhesive strength and durability while maintaining optical transparency
Inventor: TSUNASHIMA KEIJI
IPC: C09J7/38
Filed: 2020-08-19
Abstract: The object of the present invention is to provide high adhesive strength and durability while maintaining optical transparency. The adhesive composition of the present invention is characterized by containing an acrylic polymer (A), a cross-linking agent (B) and a silane coupling agent (C), wherein the acrylic polymer (A) contains a unit derived from a (meth)acrylate monomer (a1), a unit derived from a monomer (a2) having a nitrogen atom, and at least one unit derived from a group selected from the monomer having an acid group (a3) and the monomer having a hydroxyl group (a4). The silane coupling agent (C) has a group capable of reacting with the acrylic polymer (A).
Patent TW-202125687-A (TW)
Title: Substrate processing apparatus
Inventor: TAKAYAMA YUICHI
IPC: H01L21/677
Filed: 2020-08-21
Abstract: The purpose of the present invention is to provide a substrate processing device capable of suitably processing a substrate. A substrate processing apparatus (1) includes a first processing unit (7A)and a second processing unit (7B). The first processing unit (7A) includes a first substrate holding portion (91A) and a first rotation driving portion (92A). The first substrate holding section (91A)has a first plate (101), a fixing pin (103), and a gas outlet (104). The second processing unit (7B) has a second plate (131) and an end edge contact pin (133). A substrate processing apparatus (1) includes a transport mechanism (8) and a control unit (9). The transport mechanism (8) transports the substrate (W) to the processing unit (7). The control unit (9) specifies a processing unit (7) for processing the substrate (W) as either the first processing unit (7A) or the second processing unit (7B) in accordance with the shape of the substrate (W), and transports the substrate (W) to the specified processing unit (7) by means of the transport mechanism (8).
Patent TW-202123960-A (TW)
Inventor: JOSIEN HUBERT B
IPC: A61P3/06
Filed: 2020-08-28
Abstract: Disclosed are compounds of Formula A 
, or a pharmaceutically acceptable salt thereof: 
where A, X, R 1 
, and R 2 
are as defined herein, which compounds have properties for antagonizing PCSK9. Also described are pharmaceutical formulations comprising the compounds of Formula I or their salts, and methods of treating cardiovascular disease and conditions related to PCSK9 activity, e.g. atherosclerosis, hypercholesterolemia, coronary heart disease, metabolic syndrome, acute coronary syndrome, or related cardiovascular disease and cardiometabolic conditions.
Patent TW-202210678-A (TW)
Title: Production apparatus with double dies for melt-blowing non-woven fabric including a main rack, an extruding unit, a distribution unit, at least two melt-blowing dies, at least one hot air unit, a conveying and molding unit and at least one air exhaust unit
Inventor: HSU CHIH-CHIN
IPC: D04H1/54
Filed: 2020-09-10
Abstract: Provided is a production device with double dies for melt-blowing a non-woven fabric. The production apparatus includes a main rack, an extruding unit, a distribution unit, at least two melt-blowing dies, at least one hot air unit, a conveying and molding unit and at least one air exhaust unit. The extruding unit is provided with an extruding outlet. The distribution unit includes an intake hole connected to the extruding outlet and at least two distribution outlets opposite to the intake hole. Each of the melt-blowing dies is provided with a feeding hole connected to the corresponding distribution outlet and a plurality of spraying holes opposite to the feeding hole. The hot air unit is provided with a plurality of hot air outlets corresponding to the spraying holes. The conveying and molding unit is provided with a conveying belt disposed below the spraying holes and having air permeability, and a power assembly. The air exhaust unit is disposed inside the conveying and molding unit and is capable of exhausting air from the conveying belt to adsorb an upper sprayed material for molding and recover residual hot air of the sprayed material, thereby reducing influences of heat energy on a production environment. By virtue of such overall configuration, the energy consumption can be reduced, carbon reduction and environment protection can be achieved, and manpower averagely needed for each unit output is reduced; and by adopting a multilayer structure, the application range of the product is widened, various adjustable functional values are increased, the operation is more convenient than the simultaneous operation of a multi-machine single melt-blowing die, and machine space needed by the same number of dies can be saved so that the utilization ratio of space is increased.
Patent TW-202119615-A (TW)
Title: Semiconductor device and method for fabricating the same
Inventor: CHIEN JUNG-HSING
IPC: H01L29/06
Filed: 2020-09-14
Abstract: The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate, a pad structure positioned above the substrate, and a top groove positioned on a top surface of the pad structure. The method for fabricating the semiconductor device includes forming a pad structure over a substrate and forming a top groove on a top surface of the pad structure.
Patent TW-202120730-A (TW)
Title: Indium precursor compound, preparing method of thin film using the same, and substrate prepared thereof
Inventor: YEON CHANG-BONG
IPC: C23C16/40
Filed: 2020-10-30
Abstract: The present invention relates to an indium precursor compound, a method of preparing a thin film by using the same, and a substrate prepared from the same and, more specifically, to an indium precursor compound represented by chemical formula 1, a method of preparing a thin film by using the same, and a substrate prepared from the same. The present invention has the advantages of forming a uniform thin film, increasing productivity through an improved rate of deposition, being excellent in thermal stability and storage stability, and being easy to handle. In chemical formula 1, R1, R3 and R4 are each independently a substituted or unsubstituted C1 to C6 alkyl group, R2 is a C1 to C6 linear or branched alkyl group, R5 and R6 are each independently hydrogen or a C1 to C3 alkyl group, X is carbon or a hetero atom, and n is an integer of 1 to 3.
Patent TW-202218621-A (TW)
Inventor: HO YEN-YI
IPC: G08B21/02
Filed: 2020-11-03
Abstract: An electronic skin for attaching on a skin of a user and detecting a physiological information of the user is disclosed. The electronic skin includes a pasting layer, an electronic unit layer and a covering layer. The electronic unit layer includes a transmission module, a physiological information sensor, a using state sensor, a storage module, a processor, a power module and a flexible substrate. The physiological information sensor is used for sensing the physiological information. The using state sensor is used for sensing the using state of the electronic skin. The flexible substrate is located on the pasting layer and under the transmission module, the physiological information sensor, the using state sensor, the storage module, the processor and the power module. The covering layer is located on the electronic unit layer.