baber/WOPTO huggingface dataset:
Patent JP-2009110425-A (JP)
Title: Clinical trial support device and clinical trial support program
Inventor: IKEMATSU HIDEYUKI
IPC: G16H10/60
Filed: 2007-10-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a clinical trial support device and a clinical trial support program, capable of efficiently checking a clinical trial even when a pharmaceutical company is remote from a medical institution.  <P>SOLUTION: The clinical trial support device 4 for providing a clinical trial support site via a network W for a medical institution computer 2 installed at medical institutions A and B and a pharmaceutical company computer 3 installed at a pharmaceutical company C, includes: a database means for storing charte information, charte identification information, clinical trial identification information, execution facility identification information, and subject identification information uploaded from the medical institution computer 2 in association with one another; and a page control means for generating a page which includes a hierarchical tree-display data of the clinical trial identification information, the execution facility identification information, the subject identification information, and the charte identification in this order and transmitting the charte information to the pharmaceutical company computer 3 when the charte identification information is designated from the pharmaceutical company computer 3 and a browsing request of the charte information is received.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009111276-A (JP)
Title: Thermosetting film for die bonding and method of manufacturing semiconductor apparatus using the same
Inventor: TERAKI SHIN
IPC: H01L21/52
Filed: 2007-10-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a thermosetting film for die bonding which has superior adhesive strength with a chip, etc., during dicing, can be peeled off a dicing tape when picked up, has superior adhesive strength with the chip, etc., after being cured, suppresses void formation, and has a high elastic modulus at high temperature, folding endurance, and superior humidity resistance at high temperature.  <P>SOLUTION: There is provided the thermosetting film for die bonding containing (I) a bifunctional straight-chain epoxy resin of 10,000 to 200,000 in weight-average molecular weight which has a hydroxyl group, (II) one or more epoxy resins selected from a group of a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a naphthalene type epoxy resin, (III) a novolak type phenol resin, (IV) a maleimide compound, (V) a silane coupling agent, and (VI) carboxyl group end acrylonitrile butadiene rubber or epoxy group containing acryl rubber.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009109940-A (JP)
Title: Projector and control method thereof
Inventor: HAYAMA HITOSHI
IPC: G09G5/00
Filed: 2007-11-01
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a projector and a control method thereof, with which the position of the projector can be specified, and unauthorized use can be prevented without a troublesome operation.  <P>SOLUTION: In the state where the projector is currently situated other than a using position or beyond the using region, a control part 20 transmits prescribed identification information and information on the current position of the projector to a communication part 60. If the transmission to an external communication device is established, the projector function is actuated. If the transmission to the external communication device is not established, the projector function is not actuated.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009116711-A (JP)
Title: Servo amplifier and method for adjusting reference position
Inventor: TAKASHIMA SHINYA
IPC: G05D3/12
Filed: 2007-11-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide a servo amplifier which is ready both for full close control and for semi close control and facilitates a simplified reference position adjustment.  <P>SOLUTION: The servo amplifier 2 is provided with a first signal selector 10a which inputs AB phase pulses and a second signal selector 10b which inputs Z phase pulses, the AB phase pulses and the Z phase pulses being outputted from a position detecting device 4 mounted on the rotational axis of a servo motor 3 and from an external position detecting device 8 mounted on a loading device 5 connected to the output shaft of the servo motor 3. The servo amplifier outputs, via a communication response line 15, the pulse signals selected both in the first signal selector 10a and in the second signal selector 10b to a high-order controller 1 as the AB phase regeneration pulses and the Z phase regeneration pulses.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008139298-A (JP)
Title: Temperature-sensor-integrated pressure sensor
Inventor: KAMINAGA TOSHIAKI
IPC: G01L19/00
Filed: 2007-11-09
Abstract: <P>PROBLEM TO BE SOLVED: To make it possible to obtain a desired response speed of a temperature sensor without depending on the tilt angle at which a temperature-sensor-integrated pressure sensor is tilted when installed.  <P>SOLUTION: When a temperature-sensor-integrated pressure sensor including a temperature sensor element and a pressure sensor element is installed on a target object at a tilt angle of θ<SB>rg</SB>to an ideal installation location where the central axis of the main body of the temperature sensor element is orthogonal to the direction in which gas passes through a measuring object, the tilt angle θ<SB>pos</SB>at which the main body of the element is tilted to the original central axis of the main body of the element in this sensor is set in accordance with the following formula: (θ<SB>rq</SB>-θ<SB>allow</SB>)≤θ<SB>pos</SB>≤(θ<SB>rq</SB>+θ<SB>allow</SB>), where θ<SB>allow</SB>is a permissible angle from the gas passing direction orthogonal to the central axis of the main body of the element at which a permissible response speed of the temperature sensor element can be obtained.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2009123835-A (JP)
Title: Method of manufacturing semiconductor device
Inventor: NAKAMURA MASARU
IPC: H01L21/304
Filed: 2007-11-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, by which an adhesive film for die bonding can be mounted on backsides of individual devices divided by a dicing-before-grinding method without lowering quality of the devices.  <P>SOLUTION: In the method of manufacturing the semiconductor device, by which a wafer with devices formed in a plurality of regions demarcated by a plurality of streets formed in a grid pattern in the face-side surface is divided along the streets into individual devices, and the adhesive film for die bonding is attached to the backside of each of the devices, an adhesive film fusion-cutting process is carried out such that the adhesive film is attached to the backside of the wafer divided into individual devices by exposing cut grooves formed along the streets by the dicing-before-grinding method, and thereafter the adhesive film is irradiated with a laser beam along the cut grooves through the cut grooves from the side of a protective tape adhered to the face-side surface of the wafer so as to fusion-cut the adhesive film along the cut grooves.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008126315-A (JP)
Title: Laser welding process with improved penetration
Inventor: BRIAND FRANCIS
IPC: B23K26/067
Filed: 2007-11-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a laser welding process with improved penetration.  <P>SOLUTION: The invention relates to a welding process using a laser beam (FL1, FL2) to weld at least one metal workpiece, preferably to weld two metal workpieces together, in which: a first laser beam (FL1) is employed and the first laser beam (FL1) is focused so that it strikes at least one workpiece to be welded and creates a keyhole-type-capillary (KH) having a keyhole opening; a second laser beam (FL2) is focused in the keyhole (KH) opening created by the first laser beam (FL1); and the workpiece or workpieces are progressively welded by melting the metal of the workpiece or workpieces to be welded at the points of impact of the laser beams (FL1, FL2) with the workpiece or workpieces to be welded. The depth of penetration (x) of the first laser beam (FL1) is greater than the depth of penetration (y) of the second laser beam (FL2).  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2009122868-A (JP)
Title: Printing system, printing method and program
Inventor: MITSUNARI MAKOTO
IPC: B41J29/38
Filed: 2007-11-13
Abstract: <P>PROBLEM TO BE SOLVED: To automatically apply layout data of a business form changed on a printer to other printer using the layout data of the same business form.  <P>SOLUTION: This printing system has: a merge means merging print data with a template; an update means updating a history of editing as document set update information; and a means distributing the template and the document set update information stored in the update means to the printer.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008121893-A (JP)
Title: Energy recovery and reuse technique for hydraulic system
Inventor: HAMKINS ERIC P
IPC: F15B21/14
Filed: 2007-11-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide several modes for recovering hydraulic energy generated by an excess load acting on a cylinder connected to a machine component in parallel.  <P>SOLUTION: In one mode, a fluid from first chambers in both cylinders is sent to an accumulator, and simultaneously another fluid is directed to second chambers in these cylinders. In another mode, a fluid is sent from the first chamber of only one cylinder to the accumulator, and a fluid from the first chamber of the other cylinder is caused to flow into the second chambers of both cylinders. Still in another mode, a fluid is sent from the first chambers of both cylinders to the second chambers of both cylinders. Still in another mode, a fluid from the first chambers of both cylinders flows into a return conduit, and simultaneously the second chambers of both cylinders receive a fluid from a supply conduit. The present invention also discloses several modes of reusing the recovered energy.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2009121105-A (JP)
Title: Wooden clay wall and method of constructing the same
Inventor: SAKAKIBARA KATSUMI
IPC: E04F13/04
Filed: 2007-11-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a wooden clay wall easily constructed on site and having the highly strong plate wall surface of a clay wall.  <P>SOLUTION: An assembly 4 is manufactured by fixing a vertical plate 43 to the outdoor side surface of a base plate 41 with rustproof nails 42, and fitting a lateral plate 45 to the outer surface of the vertical plate with rustproof nails 44. The assembly is fallen between the recesses 21, 31 of wooden columns 2, 3 secured to a base to form the plate wall surface. A beam is secured to the upper surface of the plate wall surface, and a clay material is applied into the outdoor side recessed part of the plate wall surface to form a wood clay wall. Since the assembly 4 does not need to be manufactured at a site where the wooden clay wall is constructed, a construction operation at the site can be simplified. Since carpentering and plastering can be simultaneously performed at different positions of the wooden clay wall under construction, the construction can be efficiently performed and the construction period can be shortened.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009123898-A (JP)
Title: Electronic device and its manufacturing method
Inventor: SAKAI TAIJI
IPC: H01L21/60
Filed: 2007-11-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electronic device capable of simply relaxing a stress difference between an electronic part and a board and a method for manufacturing the electronic device.  <P>SOLUTION: A connecting structure connects first electrodes 51 for a circuit board 50 and second electrodes 62 for a semiconductor element 60. In the connecting structure, laminates 16 laminating first metallic films 16a and second metallic films 16b having mutually different stresses are curved. In the connecting structure, one end sections A of the second metallic films 16b are joined with the first electrodes 51, and the other end sections B of the second metallic films 16b are joined with the second electrodes 62.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009122452-A (JP)
Title: Image forming apparatus
Inventor: MIYAZAKI HIDEKI
IPC: G03G15/00
Filed: 2007-11-15
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a small product size and a high speed without increasing the size of an exterior cover and a cooling fan even if heat generation from an electric component on a circuit board increases.  <P>SOLUTION: Two circuit boards 15 and 16 are fixed in an angled L shape. On the one circuit board 15, electric components having large heat generation are fixed to a heat sink 15c. Large-sized electric components mounted on the other circuit board 16 are disposed facing each other. The respective electronic components are disposed so that distal end portions overlap with each other and then the area as a power source substrate unit D is reduced to a half as compared with a case wherein the electronic components are mounted all over one circuit board, thereby reducing the size. A cooling air path Da is formed by the space enclosed with the two circuit boards 15 and 16 fixed in the L shape and the electric components mounted on those boards. The cross section S1 of the cooling air path Da is formed so as to have the same size as that of the area of an opening provided on a cooling air discharge opening side of a fan duct to minimize the loss of cooling air, thereby effectively cooling the electronic components.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008074495-A (JP)
Title: Apparatus for feeding drug into drug bag and method used for the same
Inventor: IWASAKI SHINJI
IPC: B65B1/30
Filed: 2007-11-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide an apparatus for feeding a drug into a drug bag which is capable of efficiently feeding the drug into the drug bag, and also to provide a method used for the same.  <P>SOLUTION: The apparatus for feeding the drug into the drug bag is provided with a put-out means 7 for putting out preliminarily set drugs 8, a storage part 2 with an opening 1a at one end which stores the drug bags 1, a drug bag take-out means 3 for taking out the drug bags 1 from the storage part 2 one by one, and a drug bag opening means 6 which opens the drug bag 1 taken out of the drug bag take-out means 3 and feeds the drugs 8 into the opening 1a of the opened drug bag 1 from the put-out means 7 and stores the drugs 8 in the drug bag 1. The apparatus for feeding the drug into the drug bag has a preserving part 9 for preserving the drug bag 1 to which the drugs 8 are fed below the drug bag opening means 6 and a drug bag feeding means which calculates the number of the drug bags 1 preserved in the preserving part 9 from the number of the drugs 8 put out at the put-out means 7 by a computer and feeds the drug bags 1 to the preserving part 9 based on the calculated number.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2009130987-A (JP)
Title: Energy management system
Inventor: MAEDA HIROKO
IPC: G06Q50/00
Filed: 2007-11-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide an energy management system which can raise awareness of a user about energy saving and show promise for energy saving by providing information on energy saving.  <P>SOLUTION: A center device SV includes an information database. In the database, bits of knowledge on energy saving are successively stored as information on energy saving. Upon reception of a display screen request to display bits of knowledge from a terminal device such as the display control device CV, a personal computer PC, and a mobile terminal PT, the center device SV creates image data on the screen on which the bits of knowledge are to be displayed and transmits the image data to the terminal device as the request source of the display screen, and the terminal device displays the transmitted image data. Thus, the user can obtain the bits of knowledge on energy saving.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009127689-A (JP)
Title: Speed change controller for motorcycle
Inventor: TSUKADA YOSHIAKI
IPC: F16H61/18
Filed: 2007-11-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a speed change controller for a motorcycle detecting a turning state of a vehicle on the basis of a rotational speed difference of front and rear wheels, and prohibiting automatic speed change.  <P>SOLUTION: The speed change controller includes a speed change control command part 60 carrying out automatic speed change of an automatic manual transmission (AMT) 16 in response to at least a vehicle speed, and a rotational speed difference detecting means 63 for detecting a difference between a rotational speed of a front wheel WF detected by a first sensor 51 and a rotational speed of a rear wheel WR detected by a second sensor 52. In the speed change control command part 60, when the rotational speed of the front wheel WF is larger than the rotational speed of the rear wheel WR, and the difference of the rotational speeds exceeds a predetermined value, it is determined that the motorcycle 1 is in midst of turning, and automatic speed change of the AMT 16 is prohibited. In the speed change control command part 60, by detecting that, in addition to the difference of rotational speeds exceeding the predetermined value, the vehicle speed is below a predetermined value and a steering angle α detected by a steering angle sensor 54 exceeds a predetermined value, a turning state at low speed is positively detected, and the automatic speed change is prohibited.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009126953-A (JP)
Title: Pressure-sensitive adhesive composition for liquid crystal element
Inventor: YANAGISAWA HIDEYOSHI
IPC: C09J133/00
Filed: 2007-11-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive composition for liquid crystal elements capable of bonding a polarizing plate or a laminate of a polarizing plate and a retardation plate at a moderate strength in the production of a liquid crystal element, easily releasing the bonded product optionally, and stably keeping high adhesive strength for a long time after using the liquid crystal element for practical use.  <P>SOLUTION: The pressure-sensitive adhesive composition for liquid crystal elements contains (A) an acrylic polymer and (B) an adhesiveness modifier composed of an organosilicon compound having a β-ketoester structure and obtained by reacting a compound containing an unsaturated group having a specific β-ketoester structure with an alkoxysilane expressed by formula: (R<SP>7</SP>O)<SB>m</SB>(R<SP>8</SP>)<SB>(3-m)</SB>Si-H (in the formula, R<SP>7</SP>and R<SP>8</SP>are each independently a 1-4C univalent hydrocarbon group; and m is 1, 2 or 3) in the presence of a transition metal catalyst, wherein the ratio of the adhesiveness modifier of the component B is 0.001-10 pts.wt. based on 100 pts.wt. of the acrylic polymer of the component A.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009127757-A (JP)
Title: Pipe fitting for flexible pipe
Inventor: KIMURA MITSUJI
IPC: F16L37/12
Filed: 2007-11-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a pipe fitting for a flexible pipe capable of minimizing the entire pipe fitting by suppressing the axial length of the fitting body.  <P>SOLUTION: A pressing ring 7 in a half-inserted state is positioned and held at the initial position where the front end thereof is brought into contact with or close to the rear side of a seal rubber 6 before the flexible pipe 2 is inserted. A positioning and holding means comprises: a spacer 29 detachably fitted into a spacer groove 28 formed in the outer periphery of the pressing ring 7 in a half-inserted state which is exposed to the inlet side of a socket part 3; a snap ring storage groove 23 formed in the inner periphery of the socket part 3; a snap ring 27 having an outer peripheral part fitted to the snap ring storage groove 23; and a snap ring holding groove 21 formed in the pressing ring 7 and engaged with the inner peripheral part of the snap ring 27. When completely pressed, the pressing ring 7 is positioned and held at the pressing position where the front end thereof is brought into contact with or close to the rear side of the seal rubber 6 which is pressed when the flexible pipe 3 is inserted. The positioning and holding are performed by removing a spacer 29 from the spacer groove 28 and pressing the pressing ring 7 to engage the spacer groove with the inner peripheral part of the snap ring 27.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009140020-A (JP)
Title: Annotation program, annotation device, and annotation method
Inventor: NISHINO FUMITO
IPC: G06F13/00
Filed: 2007-12-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide an annotation program, an annotation device and an annotation method for making annotation accurately act on information to which annotation has been applied even if the position of the information to which annotation has been applied is changed.  <P>SOLUTION: A computer which applies annotation to information included in an information resource or makes annotation act is made to function as: an annotation application means for registering a first pseudo identifier for specifying information as the object of application in an annotation management means by making it associate with information resource specification information and annotation information based on the application request of annotation; and an annotation acting means for retrieving an annotation management means by a second pseudo identifier for specifying information included in the information resource based on the reference request of the information resource, and for making annotation information corresponding to the second pseudo identifier act on one or more information included in an information resource whose reference request has been made.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009140976-A (JP)
Title: Semiconductor light-emitting element and lighting device employing it and manufacturing process of semiconductor light-emitting element
Inventor: ROBERT ARMITAGE
IPC: H01L33/44
Filed: 2007-12-04
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a high quality LED with high efficiency in a nano-column LED.  <P>SOLUTION: After a recess 4 is formed in a conductive silicon substrate 3 serving as an n-type electrode and a first insulating film 5 is formed on the sidewall of the recess 4, a nano-column 2 is grown and when its p-type GaN layer 2c is grown, it is integrated by enlarging its diameter and the outer peripheral edge is stuck to the first insulating film 5 on the inner circumferential surface 4a of the recess 4, thus sealing the recess 4 airtightly. Consequently, the nano-column 2 is not exposed to the open air under vacuum state and a contamination can be prevented from adhering to the surface of a nano-column 2 and causing a leak current to flow, thus decreasing the efficiency. A high quality LED can thereby be obtained with high efficiency. Furthermore, since a thin film electrode 6 on the p-type GaN layer 2c is led out to the upper surface of sidewall on the circumferential edge of the recess 4 and a p-type pad electrode 17 is formed at that part, the nano-column 2 is not damaged even if wire bonding is performed with sufficient strength and optimal bonding conditions can be selected.  <P>COPYRIGHT: (C)2009,JPO&INPIT