baber/WOPTO huggingface dataset:
Patent JP-2004165517-A (JP)
Title: Manufacturing method of multilayer circuit board
Inventor: TAKAHASHI HIROYOSHI
IPC: H05K3/46
Filed: 2002-11-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer circuit board having high reliability in the connection between layers.  <P>SOLUTION: The method for manufacturing a multilayer circuit board comprises a step for processing a connection layer having a conductive circuit, a plurality of conductive posts 104, and solder layers which are formed on respective upper surfaces of the conductive posts 104 so as to be projected from an insulating layer, so that the height of the individual solder layers from the surface of the insulating layer is uniformed; bonding the connection layer to a to-be-connected layer through an adhesive layer 108, so that the solder layer is brought into contact with the adhesive layer 108; heating the resultant at a temperature more than a melting point of the solder which forms the solder layers to allow the solder layers to melt; and pressing the resultant to attain solder bonding. Thus, adverse effects that would be caused by the height variation of the solder layer are eliminated, which in turn suppresses variation in the function of cleaning the solder surfaces, thereby providing the multilayer circuit board 130 having reliable connection between layers. As a result, electronic parts can be integrated or mounted with high density.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004168083-A (JP)
Title: Seat belt device of child safety seat
Inventor: SUGIMOTO MUTSUMI
IPC: B60R22/12
Filed: 2002-11-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a seat belt device of a child safety seat capable of secure buckling of a belt, easy checking of whether the belt is released or secured, and easy detachment of left and right tongues when releasing the belt.  <P>SOLUTION: The seat belt device has a buckle portion fixed to the child safety seat and a main tongue and a sub tongue to be inserted and secured to the buckle portion. The main tongue has at least one main tongue engagement claw to be detachably engaged with the sub tongue and a notch to be engaged with a latch formed on the buckle portion. The sub tongue has at least one sub tongue engagement claw to be detachably engaged with the main tongue. The main tongue engagement claw and the sub tongue engagement claw are engaged with each other to unite the main tongue and the sub tongue to form a tongue unit, which is inserted to the buckle portion to secure the seat belt.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004135252-A (JP)
Title: Encoding processing method, encoding apparatus, and decoding apparatus
Inventor: SATO KAZUFUMI
IPC: H04N19/136
Filed: 2002-10-09
Abstract: <P>PROBLEM TO BE SOLVED: To reduce the processing load in encoding processing without lowering the encoding efficiency.  <P>SOLUTION: Allocations of code numbers respectively allocated for each kind of MB types are adaptively switched in accordance with a quantization parameter value QP, so that thresholding is made possible without using a thresholding table and the processing load in encoding processing is reduced without lowering the encoding efficiency regardless of an increase/decrease in generation frequency of an eight-pixel MB type.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004169729-A (JP)
Title: Electric disk brake
Inventor: SEKIGUCHI KAZUHIRO
IPC: F16D55/08
Filed: 2002-11-18
Abstract: <P>PROBLEM TO BE SOLVED: To facilitate assembly by preventing a ball from getting over a ball groove by driving force of an electric motor, and by preventing a piston head from falling off from a ramp plate.  <P>SOLUTION: A ball ramp mechanism constituting a force transmission converting mechanism is inwardly inserted into a cylinder of a caliper body 1, and its relative rotation angle is regulated within a predetermined range. The piston head 4; the ramp plate 10, the ball 11, and a screw shaft member 9 which constitute the ball ramp mechanism; a coil spring 23; and an end plate 22 are assembled in this order. The end plate 22 is hooked to a slit S of a piston case 6 in a state in which the coil spring 23 is flexed, whereby each of parts is elastically coupled and assembled by its spring.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004172746-A (JP)
Title: Speaker edge
Inventor: USUI KIYOSHI
IPC: H04R7/20
Filed: 2002-11-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a speaker edge with sufficient strength and rigidity capable of attaining weight reduction and low profile.  <P>SOLUTION: The speaker edge is made of rubber to which a modified filler and / or fine filler are blended. The fillers are preferably Nylon short fibers, carbon fibers, or straitform or flaky inorganic fillers. The carbon fibers are preferably carbon nano tubes or gas phase growing method carbon fibers. The straitform or flaky inorganic filler is preferably mica.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2003265454-A (JP)
Title: Medical communication system
Inventor: YAMADA NAOKI
IPC: H04M9/00
Filed: 2002-11-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a medical communication system, surely enabling a doctor in one room and a medical staff in another room to communicate with each other without being tapped by the third party such as a patient so as to make close mutual understanding.  <P>SOLUTION: This medical system performs communication between a test room for installing a test display device 118 displaying a test screen for a patient to be tested and an operating room for installing an operating display device 119 displaying the same screen as the test screen and controlling the displayed test screen. The system includes a character converting means 17 for converting information 16 input from the operating room to character information and a character information display means 11 for testing, which displays the character information converted by the character converting means on the test display device 118.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2004167534-A (JP)
Title: Structure and method for fitting press-forming die
Inventor: NIWA YOSHIO
IPC: B21D37/20
Filed: 2002-11-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide structure and a method for fitting a press-forming die by which workability and safety are improved.  <P>SOLUTION: By embedding a integral screw 7 in the peripheral wall of a columnar cam 5, a connecting member 9 is preliminarily mounted to the columnar cam 5 by screwing the screw part 10 of the connecting member 9 into the tapped hole 8 of the integral screw 7 and a handle 22 is installed on the columnar cam 5 by connecting an insert rod 11 to the columnar cam 5 through the connecting member 9 with one operation when fitting the columnar cam 5 to a supporting die 6. By constitution like this, the workability and safety when fitting the press-forming die are improved.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004171260-A (JP)
Title: Reprint system and computer program for this system
Inventor: TOKUMATSU YOSHIHARU
IPC: G06F3/12
Filed: 2002-11-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a reprint system for efficiently executing reprint processing.  <P>SOLUTION: This reprint system has an image database 5 for storing image data acquired from a negative film in accordance with an order, a list display means 28 for displaying a list of the stored image data in a monitor 7 in accordance with the order and an image selecting means 29 capable of selecting the image data to be reprinted over a plurality of orders via the displayed list, and is constituted so as to be capable of collectively printing the selected image data.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2003185961-A (JP)
Title: Radiation director apparatus, radiation scanning method and scanning station
Inventor: GRANT WAYNE E
IPC: G06K7/10
Filed: 2002-11-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a scanning station which has a simple configuration and is easy to handle.  <P>SOLUTION: A radiation director 24 is coupled to move under the control of a piezoelectric element 2. The director directs electromagnetic radiation 20 from a radiation source 22 under the control of the piezoelectric element. In a scanning station embodiment, an electrical signal element 12 is connected to cause the piezoelectric element to vibrate, and a radiation director 32 is positioned to detect radiation from an object scanned by the radiation. In a radiation scanning method, the piezoelectric element is caused to move in a reciprocating fashion, and the movement of the piezoelectric element is used to direct an electromagnetic radiation beam in a scanning motion.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2004180398-A (JP)
Title: Wire holder
Inventor: SONO YOSHIYUKI
IPC: H04N5/64
Filed: 2002-11-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a wire holder capable of assuring a prescribed insulation space so that any other general lead wire may not approach a high-voltage lead wire in wiring the high-voltage lead wire and storing the other general lead wire.  <P>SOLUTION: An outer ring 11 and a central inner boss 12 are jointed to each other through a plurality of ribs 13, 14, 15, and a high-voltage lead wire 24 is fitted into a central space 23 of the inner boss portion 12. A cut portion 17 communicating with the central space 23 is formed by cutting the outer ring 11, and an opening in the cut portion 17 formed at the outer ring 11 is formed so as to open and close. Near the opening in the cut portion 17, a storage space 19 for storing the other lead wires 25, 25 is provided inside the outer ring 11 so as to be open and close.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2003179186-A (JP)
Title: Semiconductor device, its producing method and packaging method
Inventor: TAKAHASHI TOSHIYUKI
IPC: H01L23/12
Filed: 2002-11-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a small and high integrated semiconductor device in which package test is performed readily and surely.  <P>SOLUTION: The semiconductor device comprises at least one package body section consisting of a wiring board provided with external terminals on one side, one overlapping part consisting of a wiring board mounting an electronic component including at least a semiconductor chip, and at least one turnup part consisting of a flexible wiring board for electrically and mechanically coupling the same type or different type of the package body section and the overlapping part wherein the overlapping part is turned up at the turnup part and stacked on a specified package body section or overlapping part. The wiring board at the package body section, the turnup part and the overlapping part is composed integrally of a transparent flexible body (resin film). An external terminal is also provided in a region of the package body section being overlapped by the electronic component mounting region of the overlapping part. The overlapping part is secured to the package body section by a securing means (adhesive). The mounting region of a semiconductor chip (electronic component) is covered with a sealing body.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2004180204-A (JP)
Title: Mobile terminal
Inventor: ONO NAOKO
IPC: H04W4/029
Filed: 2002-11-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a mobile terminal by which a user can easily determine a location where a radio service is received.  <P>SOLUTION: A mobile terminal has a function of associating the identifying information of a radio base station accumulated by the user himself/herself upon receiving a radio service with the location information of a terminal upon receiving the service to be stored, and displays a radio LAN service area together with map information.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004175317-A (JP)
Title: Vehicle theft preventing system
Inventor: INOUE HITOSHI
IPC: B60R25/00
Filed: 2002-11-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a vehicle theft preventing system capable of making a thief losing the intention of stealing a vehicle by detecting a theft for degradation of the product value of the vehicle.  <P>SOLUTION: This vehicle theft preventing system 10, equipped with a theft detection means 141 for generating a theft detection signal when the theft of the vehicle is detected, comprises an instrument panel 11 for displaying a status of the vehicle; a state detection part 12 for outputting a state signal by sensing the state of the vehicle; a display control part 13 for receiving the state signal and conducting display processing for the instrument panel 11; a theft detection means 141; and a warning control part 14 for outputting a warning mode signal to the display control part 13 when the theft detection signal is received, is structured so as to conduct failure display processing for the instrument panel 11 when the display control part 13 receives a warning mode signal.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004186255-A (JP)
Title: Dicing method of thin film structure forming substrate
Inventor: ITOI KAZUHISA
IPC: H01L21/301
Filed: 2002-11-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a dicing method where a thin film structure is not damaged in a dicing process.  <P>SOLUTION: A thin film structure forming substrate 3 has the thin film structure 2 such as a sensor and a high frequency device at the position of a hollow part 1a of a substrate 1. A resin protective layer 11 is formed on the surface of the thin film structure forming substrate 3 on the side of the thin film structure 2. A dicing sheet 5 is stuck to the opposite surface to the just-mentioned surface, which is fixed to a dicing stage by vacuum suction. Then, the thin film structure forming substrate 3 is cut (dicing) into individual chips 12 with a dicing blade 4. Thereafter, the protective layer 11 is removed by a resin release solution or the like. Since the thin film structure 2 is protected with the protective layer 11, there is no possibility of the thin film structure 2 being damaged in the dicing process. Since a device layer (thin film structure 2 ) lies on an upper surface, and mounting thereof is the same as in dicing in an ordinary LSI manufacturing process, it can be mounted on a printed board as it is without inversion with the aid of a chip mounter or the like. There is also no problem of the thin film structure 2 being contaminated with the dicing sheet 5.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004186430-A (JP)
Title: Working method for semiconductor wafer
Inventor: ARAI KAZUNAO
IPC: H01L21/683
Filed: 2002-12-03
Abstract: <P>PROBLEM TO BE SOLVED: To prevent the generation of any crack or bending in the working of a semiconductor wafer whose back face is formed with a metal film.  <P>SOLUTION: This method for working a semiconductor wafer for dividing a semiconductor wafer whose surface is formed with a plurality of circuits into semiconductor chips for those individual circuits comprises a thinning process for covering the surface of the semiconductor wafer W with a protecting member, and for erasing the back face of the semiconductor wafer W to form it with predetermined thickness; a metallization process for forming a metallic film on the back face; a transfer process for adhering the back face on which the metallic film is formed to a dicing tape T integrated with a dicing frame F, and for exposing the surface of the semiconductor wafer W by removing the protecting member from the surface; a testing process for connecting the metallic film to the ground in a status that the semiconductor wafer W is adhered to the dicing tape T, and for executing the electric test of each circuit formed on the surface; and a dividing process for dividing the semiconductor wafer W into individual semiconductor chips.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004186432-A (JP)
Title: Radiation image pickup unit and its driving method
Inventor: IZUMI YOSHIHIRO
IPC: H01L27/146
Filed: 2002-12-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide a radiation image pickup unit in an indirect conversion system for preventing the deterioration of sensitivity even at the time of reducing a pixel size for improving resolution, and making it unnecessary to set any complicate process in manufacturing.  <P>SOLUTION: This method for driving a radiation image pickup unit equipped with a radiation/light converting layer for converting incident radiation into lights, and for emitting the lights and an active matrix array having a thin film transistor(TFT) and a storage capacity connected to the drain electrode of the TFT for each pixel comprises a charging step(t6) for charging charge in the storage capacity by predetermined quantity; a discharging step for irradiating the radiation/light converting layer with radiation, and for irradiating the TFT in an off status with the outgoing lights to make the storage capacity discharge the charge charged by the charging step; and a charge reading step(t3) for reading the charge remaining in the storage capacity through the TFT in an on status posterior to the charging step.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004187055-A (JP)
Title: Miniaturized antenna
Inventor: FUTAMATA HIROMASA
IPC: H01Q1/24
Filed: 2002-12-04
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a smaller and thinner antenna with a simple structure.  <P>SOLUTION: An antenna element unit 5 is provided wherein two coaxial cables 3 have a center conductor 7, an outer conductor 11 and an insulating layer 9 for insulating the periphery of the outer conductor 11, have a length of about 1/4 of the wavelength to be oscillated, and are juxtaposed in parallel. Further, a connection unit 17 is provided for connecting respective center conductors 7 and respective outer conductors 11 with each other at one end of the two coaxial cables 3. At the other end of the two coaxial cables 3, there are provided a feeding unit 21 for connecting the center conductor 7 of one coaxial cable 3 to a feeding line 19, and a grounding unit 25 for connecting the center conductor 7 of the other coaxial cable 3 to the ground 23. When the two coaxial cables 3 as the antenna element unit 5 are made to have a smaller diameter, the antenna itself is made so thin and constricted that the smaller and thinner antenna can be obtained.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004182903-A (JP)
Title: Method and apparatus for gasifying biomass
Inventor: KUMAGAI CHIKANORI
IPC: F02C3/20
Filed: 2002-12-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method and apparatus favorable for gasification, by which a gas having a high utilization ratio of energy is obtained and adhesion of tar onto related equipments can be prevented by solving the following conventional problem: a formed gas contains a large amount of tar against a small content of a combustible gas.  <P>SOLUTION: A biomass is gasified at a fluidizing layer 11c and the temperature of the formed gas is controlled at a freeboard zone 11d locating at an upper part of the fluidizing layer 11c, by using another system from that of used in the fluidizing layer 11c. The method is carried out by blowing an oxygen-containing gas into the freeboard zone 11d through an opening-adjustable valve 12 together with setting a temperature sensor 13.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004183588-A (JP)
Title: Fuel injection control method for internal combustion engine
Inventor: SERIZAWA TAKESHI
IPC: F02D41/34
Filed: 2002-12-05
Abstract: <P>PROBLEM TO BE SOLVED: To solve a problem wherein effect for reducing smoke is low even if fuel is injected twice from start of an intake stroke to completion of a compression stroke when a fuel injection valve is not deteriorated.  <P>SOLUTION: An internal combustion engine has a first air-fuel ratio sensor 6 arranged upstream of a catalyst 5 disposed to an exhaust system 4 and a second first air-fuel ratio sensor 7 arranged downstream of the catalyst 5 to directly inject fuel into a cylinder. From the start of the intake stroke to the completion of the compression stroke, the fuel injection in a time is switched from/to the fuel injection in twice where second injection is performed at least in the compression stroke. Oxygen concentration upstream and downstream of the catalyst 5 is detected based on output signals from the first and second air-fuel ratio sensors 6, 7, when lowering of an oxygen utilization rate is detected based on the detected oxygen concentration, the fuel is injected twice.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004189034-A (JP)
Title: Transponder of tire status monitoring device
Inventor: KATO MICHIYA
IPC: B60C23/02
Filed: 2002-12-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a transponder of a tire status monitoring device never depending on tire replacement.  <P>SOLUTION: This transponder 30 is provided in a lower part 63 of a tire valve 60. For this reason, the transponder 30 is not replaced even when replacing with a new tire. Since the transponder 30 is provided in the tire valve 60, a scope of selection of tire is not narrowed. An old tire is merely removed from a wheel as usual when disposing the old tire. Even if the transponder 30 is provided in the tire valve 60, any accompanying work caused by it does not occur. Consequently, it is possible to provide the transponder 30 of the tire status monitoring device never depending on tire replacement.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004189088-A (JP)
Title: Sea rescue alarm and marine accident lifeboat
Inventor: TAKAMURA KATSUTOSHI
IPC: G08B23/00
Filed: 2002-12-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a sea rescue alarm and a marine accident lifeboat capable of certainly notifying the rescue staff about the current position of casualties by continuously alarming for rescue with no fear of power exhaustion.  <P>SOLUTION: The sea rescue notifying device is composed at least of a rescue notifying means 12 consisting of a light emitter 13 and a rescue signal transmitting box 17 and a power supply means 32 consisting of a solar cell 33 and a charger 36 required to feed electricity to the rescue notifying means 12, wherein the rescue notifying means 12 and the power supply means 32 are fed with electricity from the charger 36 charged with electric power sent from the solar cell 33 and arranged capable of emitting light from the light emitter 13 and transmitting a rescue signal from the rescue signal transmitting box 17.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004072064-A (JP)
Title: Metal base wiring board and high-frequency device using the same
Inventor: MIYA TATSUYA
IPC: H05K1/05
Filed: 2002-12-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a metal base wiring board in which the thickness of an insulating layer of a strip line formed by a surface conductor pattern can be thinned, the entire thickness can be prevented from becoming thick, a GND surface rigid in high frequency can be obtained on the surface conductor pattern, and the degree of freedom in design of a wiring pattern can be obtained, and to provide a high-frequency device using this board.  <P>SOLUTION: A metal base 1 has an engraved portion 2, the portion 2 is filled with an insulator 3, copper plating is performed on the surfaces of the insulator and the metal base, and a first conductor pattern 4 having a desired pattern is formed by etching. A single-sided copper foil substrate 6 is stuck on the entire top surface of the metal base including the engraved portion. A second conductor pattern 7 is formed on the copper foil of the substrate 6, and the pattern 7 is connected to a chip component 8.  <P>COPYRIGHT: (C)2004,JPO