Patent EP-2224795-A1 (EP)
Inventor: ROSTAMI BARDIA DR
IPC: H01L51/00
Filed: 2009-08-27
Abstract: The method comprises carrying out a polymerization process where a structural electrode (50) is used whose surface has a first area of a predetermined structure such as electrode contact area (46) and a remaining second area such as electrode complementary area (48) and a galvanic process. The electrode contact area is connected with a first voltage potential. A part of the electrode contact area is contacted with liquid first electrolytes, where polymerizable and/or cross-linkable compounds are introduced in the first electrolytes. A first current flow is generated by the first electrolytes. The method comprises carrying out a polymerization process where a structural electrode (50) is used whose surface has a first area of a predetermined structure such as electrode contact area (46) and a remaining second area such as electrode complementary area (48) and a galvanic process. The electrode contact area is connected with a first voltage potential. A part of the electrode contact area is contacted with liquid first electrolytes, where polymerizable and/or cross-linkable compounds are introduced in the first electrolytes. A first current flow is generated by the first electrolytes over the structural electrode. A conductive polymer film such as polymer structure (66) of the predetermined structure is formed on the electrode contact area contacted with the first electrolytes. A part of the polymer structure is contacted with liquid second electrolytes, where a metallic material is introduced in the second electrolytes. A second current flow is generated by the second electrolytes over the polymer structure. A conductive metal film such as metal structure of the predetermined structure is formed and/or deposited on the area of the polymer structure contacted with the second electrolytes. A transfer of the metal structure is carried out on the substrate where a part of the metal structure is introduced on the substrate, and a transfer of the polymer structure is carried out on the substrate where a part of the polymer structure is introduced on the substrate. The metal- and/or polymer structure introduced on the substrate is materially bonded with the substrate by an adhesive agent (substrate adhesive agent) and/or by thermal joining process such as soldering, welding, laminating and/or ultrasonic joining. The substrate adhesive agent is selected, so that an adhesion between the electrode and the polymer structure is weak than an adhesion between the substrate adhesive agent and the metal structure, substrate and/or polymer structure. A transfer of the part of the polymer structure and/or the part of the metal structure is carried out on the substrate, where the part of the polymer structure and/or the part of the metal structure are connected with the substrate. A liquid is hardened by removing a solvent, by illuminating with UV-radiation and/or by adding a hardener for the formation of the substrate. The electrode is reusable. The part of the polymer structure and/or metal structure adhered on the substrate is non-destructively removed from the structural electrode. The metal structure and/or the substrate connected with the metal structure is separated from a part of the conductive polymer structure by soldering and/or etching the part of the polymer structure using the liquid solvent dissolving the polymer structure, by liquefying the polymer structure using an energy supply and/or heat supply and/or by transferring the polymer structure into a gas state using the energy supply and/or heat supply and/or by mechanical separation such as water jet process, air jet process, spreading process, sand jet process and/or abrading process. The polymer structure has low melting point than the metal structure. The solvent does not dissolve and/or etch the metal structure. The gasification temperature of the polymer structure is lower than the melting temperature of the metal structure. The polymer structure has low tensile strength and/or breaking strength than the structural electrode, the structural electrode surface, the metal structure, the substrate adhesive agent, the transfer adhesive agent and/or the substrate. The substrate adhesive agent and the transfer adhesive agent have different melting points and sublimation points and/or the transfer adhesive agent has a clear low melting point and a clear low sublimation point than the substrate adhesive agent. The compounds introduced in the first electrolytes are partially low-molecular compounds such as monomer, dimer or other short-chain basic component of polymers.