baber/WOPTO huggingface dataset:
Patent TW-202020412-A (TW)
Title: Stress measuring device and stress measuring method
Inventor: CHIANG I-HUNG
IPC: H01L21/66
Filed: 2019-11-06
Abstract: A stress measuring device and a stress measuring method for measuring a stress distribution of an object. The stress measuring method includes: receiving a first-dimension image of the object; marking the first-dimension image to generate a marked area; calculating a first stress applied to the marked area which converts the marked area to a strained marked area corresponding to a second-dimension image so as to generate a determination result; and calculating the stress distribution corresponding to the first-dimension image of the object according to the determination result.
Patent TW-202022992-A (TW)
Title: Methods of forming semiconductor devices
Inventor: YIN JIN-MU
IPC: H01L21/822
Filed: 2019-11-20
Abstract: Methods of forming a 3-dimensional metal-insulator-metal super high density (3D-MIM-SHD) capacitor and semiconductor device are disclosed herein. A method includes depositing a base layer of a first dielectric material over a semiconductor substrate and etching a series of recesses in the base layer. Once the series of recesses have been etched into the base layer, a series of conductive layers and dielectric layers may be deposited within the series of recesses to form a three dimensional corrugated stack of conductive layers separated by the dielectric layers. A first contact plug may be formed through a middle conductive layer of the corrugated stack and a second contact plug may be formed through a top conductive layer and a bottom conductive layer of the corrugated stack. The contact plugs electrically couple the conductive layers to one or more active devices of the semiconductor substrate.
Patent TW-202121209-A (TW)
Title: Storage device with message projection function capable of reducing space occupied by a large-size panel
Inventor: YU HONG-CHI
IPC: G06F21/31
Filed: 2019-11-22
Abstract: The present invention relates to a storage device with a message projection function. When a dedicated storage module and an information socket are electrically connected, an image generating unit of the information socket emits an image light. The image light passes through a diffusion unit, so that the diffusion unit diffuses the image light to form a virtual image and project it on a surface.
Patent TW-202121669-A (TW)
Title: Package structure of sensor device and manufacturing method thereof
Inventor: TSENG CHAO-TSUNG
IPC: H01L21/56
Filed: 2019-11-27
Abstract: A semiconductor device includes a sensing die, a dielectric layer, a first conductive wire layer, a second conductive wire layer, at least a conductive pillar, and at least a front-side fan-out circuit. The sensing die has an active face with a sensing region and a metal pad region having at least a metal pad thereon. The dielectric layer covers a periphery, back surface and a part of the active surface of the sensing die, and the first face of the dielectric layer has an elevation higher than the active face of the sensing die and exposes the sensing region of the sensing die. The first conductive wire layer and the second conductive wire layer are disposed on the first and second faces of the dielectric layer respectively. The conductive pillar is disposed within the dielectric layer and connected to the first and second conductive wire layers. The front-face fan-out circuit is connected to the first conductive wire 
layer and the metal pad of the sensing die. A manufacturing method for making the above semiconductor device is also disclosed.
Patent TW-202022933-A (TW)
Title: Wafer dividing apparatus
Inventor: MASADA TAKAYUKI
IPC: H01L21/677
Filed: 2019-12-03
Abstract: A wafer dividing apparatus for dividing a wafer stuck to an adhesive tape and supported at an opening of a frame into individual chips along a scheduled division line, comprising: a cassette table on which a cassette that accommodates a plurality of wafers each stuck to an adhesive tape and supported at an opening of a frame is placed and which is movable upwardly and downwardly in a Z axis direction; a first carry-out/in unit to carry out the frame from the cassette placed on the cassette table or carry in the frame to the cassette; a first temporary receiving unit including a pair of first guide rails the extend in the X axis direction and configured to support the frame carried in by the first carry-out/in unit and a guide rail opening/closing portion configured to increase a distance; a reversing unit including a holding portion configured to hold the frame and configured to rotate by 180 degrees to reverse front and back of the frame; a transport unit configured to move the reversed frame; a second temporary receiving unit including a pair of second guide rails extending in the X axis direction; a second carry-out/in unit configured to move the frame supported on the second temporary receiving unit in the X axis direction; a third temporary receiving unit disposed on one side in the X axis direction and a guide rail operation portion configured to expand a distance of third guide rails; a frame lifting unit configured to support and move the frame supported on the third temporary receiving unit upwardly or downwardly in the Z axis direction; a dividing unit including a cylindrical portion configured to be brought into contact, when the frame supported on the frame lifting unit is moved up, with the adhesive tape located between the frame and the wafer to expand the adhesive tape thereby to divide the wafer into the individual chips along the scheduled division line; a suction table disposed in an inside of the cylindrical portion and configured to suck and hold the wafer divided into the chips to maintain a distance between the chips; and a tape contraction unit disposed on the frame lifting unit side and configured to heat and contract the slackened adhesive tape.
Patent TW-202126902-A (TW)
Title: Thin gas transportation device
Inventor: MOU HAO-JAN
IPC: F04B43/04
Filed: 2019-12-31
Abstract: A thin gas transportation device is disclosed and includes a thin gas pump and a thin valve structure. The thin valve structure includes a first thin plate, a valve frame, a valve plate and a second thin plate. The first thin plate includes a hollowed region. The valve frame includes a valve accommodating region. The valve plate is disposed within the valve accommodation region and includes a valve hole misaligned to the hollowed region. The second thin plate includes a gas outflow surface, a pressure relief surface, a gas outflow slot, a gas outflow hole, a gas relief hole and a pressure relief trench. The pressure relief surface is opposite to the gas outflow surface. The gas outflow slot is concaved from the gas outflow surface and partly misaligned to the hollowed region of the first thin plate. The gas outflow hole is hollowed from the gas outflow slot to the gas relief surface, and the gas outflow hole is aligned to the valve hole. The pressure relief hole is separated apart from the gas outflow slot. The pressure relief stretch is concaved from the pressure relief surface and in communication with the pressure relief hole. The first thin plate, the valve frame and the second thin plate are sequentially stacked and fixed.
Patent TW-202114150-A (TW)
Title: Semiconductor device and manufacturing method thereof
Inventor: MOMO NOBUYUKI
IPC: H01L27/105
Filed: 2020-02-05
Abstract: According to one embodiment, a semiconductor device includes a first semiconductor chip including a first metal pad and a second metal pad; and a second semiconductor chip including a third metal pad and a fourth metal pad, the third metal pad joined to the first metal pad, the fourth metal pad coupled to the second metal pad via a dielectric layer, wherein the second semiconductor chip is coupled to the first semiconductor chip via the first metal pad and the third metal pad.
Patent TW-202132066-A (TW)
Title: Hammer for breaking hard objects wherein each striking area protrudes from the striking surface to effectively strike and break hard objects
Inventor: CHEN YING-JIE
IPC: B25D1/02
Filed: 2020-02-21
Abstract: The invention is a hammer used for breaking hard objects, including at least one striking surface. One of the striking surfaces has a breaking part, which accounts for about 80% of the area of the striking surface. The breaking part provides at least two striking areas. Each striking area protrudes from the striking surface to effectively strike and break hard objects.
Patent TW-202102239-A (TW)
Title: Antiaging agent, antioxidant, antiinflammatory agent and whitening agent, and cosmetic
Inventor: IWATAKE MIWA
IPC: A61P17/00
Filed: 2020-03-30
Abstract: An antiaging agent that comprises, as an active ingredient, at least one of a fermented liquid of an Artemisia plant, a fermented liquid of Thymus vulgaris, a fermented liquid of Melissa officinalis and a fermented liquid of Centaurea cyanus; an antioxidant that comprises, as an active ingredient, at least one of a fermented liquid of an Artemisia plant, a fermented liquid of Thymus vulgaris, a fermented liquid of Melissa officinalis and a fermented liquid of Centaurea cyanus; an antiinflammatory agent that comprises, as an active ingredient, at least one of a fermented liquid of an Artemisia plant and a fermented liquid of Melissa officinalis; a whitening agent that comprises, as an active ingredient, at least one of a fermented liquid of an Artemisia plant, a fermented liquid of Melissa officinalis and a fermented liquid of Centaurea cyanus; and a cosmetic.
Patent TW-202142874-A (TW)
Inventor: LEE WEN-TSUNG
IPC: G01R1/073
Filed: 2020-05-11
Abstract: The present invention provides a thin-film probe card with array type and a test module thereof. The test module includes a carrying unit, a plurality of vertical probes positioned by the carrying unit, a resilient cushion disposed on the carrying unit, and a thin-film sheet. The thin-film sheet includes a carrier partially disposed on the resilient cushion, a plurality of signal circuits disposed on the carrier, and a plurality of conductive protrusions respectively formed on the signal circuits. The conductive protrusions are in a ring-shaped arrangement. One ends of the vertical probes are arranged at an inner side of the conductive probes, and are coplanar with distal ends of the conductive probes.
Patent TW-202145842-A (TW)
Title: Electronic device
Inventor: CHANG CHIA-CHI
IPC: H05K1/11
Filed: 2020-05-18
Abstract: An electronic device including a substrate, a plurality of first signal lines, and a plurality of second signal lines is provided. The first signal lines are disposed on the substrate. Each of the first signal lines includes a first intersecting section and a first extending section. The first intersecting section has a fixed extending direction. The first intersecting section is connected to the first extending section while the first intersecting section and the first extending section have different extending directions. The second signal lines are disposed on the substrate. The second signal lines intersect with the first signal line to form a plurality of intersections on the each of the first signal lines and the plurality of intersections are positioned on the first intersecting section.
Patent TW-202120906-A (TW)
Title: Artificial intelligence based cell detection method by using optical kinetics and system thereof
Inventor: WANG WEI-CHUNG
IPC: C12M1/00
Filed: 2020-05-28
Abstract: An artificial intelligence based cell detection method by using optical kinetics includes acquiring a plurality of cells, sampling N images of the cells during a first time point and a second time point, determining an analytic region of each cell, executing an image processing process to the analytic region of the each cell according to the N images of the cells for generating a plurality of optical kinetics vector parameters, generating deformation vector information of the cells during the first time point and the second time point according to the plurality of optical kinetics vector parameters, acquiring at least one key deformation vector characteristic value of the cells according to the deformation vector information, and inputting the deformation vector information and the at least one key deformation vector characteristic value to a neural network for detecting qualities of the cells.
Patent TW-202112356-A (TW)
Title: Wearable phototherapy apparatus with anti-viral and other effects
Inventor: SCHMIDT DAVID
IPC: A61K9/70
Filed: 2020-06-03
Abstract: Embodiments enables a wearable phototherapy apparatus that produces beneficial effects to a human body such as anti-viral effects, activation of stem cells, improvement in strength, improvement in stamina, pain relief via a non-transdermal container. May include an optional transdermal container that releases or increases copper peptide GHK-Cu in a subject’s body. The non-transdermal apparatus reflects or emits specific wavelengths of light to elevate levels of the copper peptide GHK-Cu in the body. The non-transdermal apparatus includes one or more materials that prevent the Left-Handed molecule from direct contact with the body while the enclosure is coupled to the body and prevents the Left-Handed molecules from entering the body. Embodiments may include or be used with any bioavailable form of copper, e.g., such as copper glycinate as an anti-viral therapy and may include an anti-inflammatory or both.
Patent TW-202104080-A (TW)
Title: Protective structure for silicon rod and method for manufacturing silicon rod
Inventor: SAKAI JUNYA
IPC: C01B33/035
Filed: 2020-06-11
Abstract: 無。
Patent TW-202206222-A (TW)
Title: Electric grinding machine tool further reduces the center of gravity of a handhold body to allow a user to stably operate handhold body
Inventor: CHEN BACH PANGHO
IPC: B24B55/10
Filed: 2020-08-13
Abstract: An electric grinding machine tool includes a handhold body, a grinding tray, and a battery. The handhold body is internally provided with a tool shaft connected with the grinding tray, a driving assembly capable of rotating the tool shaft while receiving power, and a circuit board electrically connected with the driving assembly and the battery. The handhold body is provided with a battery mounting base exposed to the outer surface. The surface of the circuit board is not relatively perpendicular to the tool shaft, and the circuit board and the battery mounting base are respectively located on two opposite sides of the tool shaft. The circuit board and the battery mounting base are connected to penetrate through the tool shaft. By changing the position of the circuit board, the height of the handhold body is descended to lower the center of gravity of the handhold body, thereby increasing the stability of grinding operation.
Patent TW-202139354-A (TW)
Title: Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems
Inventor: LUO SHUANG-QIANG
IPC: H01L21/76
Filed: 2020-09-24
Abstract: A method of forming a microelectronic device comprises forming a microelectronic device structure. The microelectronic device structure comprises a stack structure comprising insulative structures and additional insulative structures vertically alternating with the insulative structures, a dielectric structure vertically extending partially through the stack structure, and a dielectric material vertically overlying and horizontally extending across the stack structure and the dielectric structure. Portions of at least the dielectric material and the dielectric structure are removed to form a trench vertically overlying and at least partially horizontally overlapping a remaining portion of the dielectric structure. The trench is substantially filled with additional dielectric material. Microelectronic devices, memory devices, and electronic systems are also described.
Patent TW-202212643-A (TW)
Inventor: WENG JIAN-MING
IPC: C25D17/06
Filed: 2020-09-25
Abstract: The present invention provides an electroplating fixture with positioning holes, which includes two clamping pieces, wherein each of the clamping pieces is side by side. The clamping piece includes a connecting section and a clamping section, wherein the connecting section and the clamping section are arranged along the length direction of the clamping piece, and the connecting sections are connected, so that, the clamping sections relatively clamp a stitch of an electroplating workpiece. Each of the clamping sections respectively laterally penetrates a positioning hole, so that the two sides of the stitch respectively enter each of the positioning holes for positioning the stitch.
        The positioning hole is formed so that the stitch enters each positioning hole, and the stitch is positioned accordingly. It also can ensure the effective coverage and the quality of the subsequent electroplating layer formed on the electroplated workpiece, and to improve the convenience of setting up the electroplated workpiece.
Patent TW-202213018-A (TW)
Title: Intelligent water tower monitoring system comprising a sensing module, a monitoring module, a communication module, and a management module
Inventor: LI JIAN-XING
IPC: G08B3/00
Filed: 2020-09-26
Abstract: The present invention discloses an intelligent water tower monitoring system, which comprises a sensing module, a monitoring module, a communication module, and a management module; the sensing module comprises a high water-level sensor and a low water-level sensor used to detect the water level and generate a conduction signal or not; the monitoring module is electrically connected with the sensing module to receive the conduction signal and convert it into a warning signal; the communication module is electrically connected with the monitoring module to transmit the warning signal to a user device in a wired or wireless manner; and the management module is electrically connected with the communication module to receive the warning signal and prompt the user that the water level of the water tower is abnormal, thereby completing the real-time water level monitoring.
Patent TW-202217626-A (TW)
Inventor: LIN WEN-YI
IPC: G06F30/17
Filed: 2020-10-19
Abstract: A tooth profile design method for an involute gear set for second-stage planetary gear reducer with high reduction ratio. The main steps include: under a certain high reduction ratio and certain performance requirements, firstly finding an appropriate number of teeth combination of two sets of basic planetary gear sets in the second-stage planetary gear reducer through a number of teeth pairing, and then carrying out the tooth profile design for the basic planetary gear sets respectively. With three technical methods of tooth profile displacement from internal and external gears, the change of tooth crown height, and one tooth of the internal and external teeth that uses non-standard module and non-standard pressure angle, the most suitable tooth profile can be found. Also, by means of the optimization method, the non-interference meshing gear tooth profile is designed to achieve the optimal other working performance, thereby satisfying the requirements of certain mechanical efficiency.
Patent TW-202134557-A (TW)
Title: Welded check valve
Inventor: LEYS JOHN A
IPC: F16K15/02
Filed: 2020-11-04
Abstract: Welded check valves include a poppet assembly, a spring, and a disc that contacts the spring. The disc may be held at a position away from a weld when forming the welded check valve. Embodiments may include retention features configured to allow one or more of the poppet assembly and disc to pass the retention features in an assembly orientation, and to retain those elements when they are in an operational orientation. Methods include inserting the poppet assembly, contacting the poppet assembly with a spring, inserting a disc, retaining the disc away from a weld side, and welding the check valve together. The poppet assembly and/or disc may pass one or more retaining features when inserted, and be retained by the retaining features when the check valve is operated. The weld may be a thermal weld.
Patent TW-202125677-A (TW)
Inventor: HAWRYLCHAK LARA
IPC: H01L21/67
Filed: 2017-04-10
Abstract: 此處所述之實例提供熱基板處理裝置，包括兩個熱處理腔室，該等熱處理腔室之各者界定處理容積及佈置於各個處理容積內的基板支撐件。一或更多遠端電漿源可與處理容積流體連通，且遠端電漿源可配置成傳送電漿至處理容積。亦提供遠端電漿源及腔室的各種安排。
Patent TW-202135613-A (TW)
Title: Mounting wiring board, electronic component mounted board, method of mounting electronic component, microwave heating method, and microwave heating device
Inventor: KANAZAWA KENJI
IPC: H05K3/34
Filed: 2020-11-12
Abstract: Provided are: a mounting wiring board including a base material, an electrode part disposed on the base material, and a heat generation pattern disposed on the electrode part and heated by stationary waves of microwaves, wherein the occupied area of the heat generation pattern is smaller than the area of the upper surface of the electrode part; an electronic component mounting board using this mounting wiring board; a method of mounting this electronic component; and a microwave heating method and microwave heating device that heats an object to be heated disposed through the heat generation pattern.
Patent TW-202128445-A (TW)
Title: Printing unit and thermal printer
Inventor: YOSHIKAWA FUMITAKA
IPC: B41J11/04
Filed: 2020-11-26
Abstract: A printing unit includes: a head unit including a thermal head configured to perform printing on a recording sheet; a platen unit which is detachably combined with the head unit, and includes: a platen roller configured to feed the recording sheet; and a pair of platen bearings configured to support both end portions of the platen roller in a rotatable manner; an operation lever which is movable about a rotation axis between a lock position of locking the platen unit to the head unit and an unlock position of unlocking the platen unit from the head unit; a platen lock mechanism which includes a lock arm swingable about a swing axis parallel to the platen roller, and is configured to switch the lock arm between a lock state of locking the platen roller and an unlock state of unlocking the platen roller; and an urging member configured to urge the lock arm about the swing axis so as to maintain the lock state. The head unit has a pair of receiving grooves which is configured to allow the pair of platen bearings to be fitted therein through openings of the pair of receiving grooves, and configured to receive the pair of platen bearings in contact with groove bottom portions of the pair of receiving grooves when the operation lever is at the lock position. The lock arm is configured to press at least one of the pair of platen bearings received in the receiving groove from the opening side when the operation lever is at the lock position, and is configured to allow disengagement of the at least one of the pair of platen bearings from the receiving groove through the opening by being swung about the swing axis along with movement of the operation lever from the lock position toward the unlock position side. The lock arm includes a pushing-up arm configured to push the at least one of the pair of platen bearings from the groove bottom portion toward the opening side along with movement of the operation lever from the lock position toward the unlock position. The urging member urges the lock arm toward the platen unit side.