baber/WOPTO huggingface dataset:
Patent JP-2009113469-A (JP)
Title: Optical information recording medium, method of recording information, and azo metal complex dye
Inventor: WATANABE KOSUKE
IPC: G11B7/243
Filed: 2008-03-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide an optical information recording medium affording good recording and reproduction characteristics and good light resistance in recording and reproduction by irradiation of a short-wavelength laser beam and a novel compound suitable for use as a dye in a recording layer of the optical information recording medium.  <P>SOLUTION: The optical information recording medium comprises the recording layer on the surface of a support having pregrooves with a track pitch ranging from 50 to 500 nm on the surface thereof. The recording layer comprises an azo metal complex dye which is a complex of azo dyes and transition metal ions, whose number is equal to or greater than the number of the azo dyes, and comprises two or more transition metal ions in one molecule thereof.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009234626-A (JP)
Title: Sheet-like lid material for microwave processed package and microwave processed package
Inventor: SAKATA RYOTSU
IPC: B65D77/20
Filed: 2008-03-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a sheet-like lid material for use in sealingly closing an opening part of a container, capable of producing a vapor permeating port at the time of microwave processing operation and hardly curved during its storing time.  <P>SOLUTION: The sheet-like lid material is formed by a laminated sheet 4 having a rigid layer 7 and a metal deposition layer 6. The rigid layer 7 contains one sheet selected from a group consisting of a biaxially stretched sheet, a synthetic resin sheet having some fine cavities therein and paper, and a part of the plane in the metal deposition layer 6 is formed with a heat generating part 5 where end edges of the metal deposition layer 6 are oppositely faced to each other.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009236050-A (JP)
Title: Cooling device for internal combustion engine
Inventor: SUGIURA HIROYUKI
IPC: F01P7/16
Filed: 2008-03-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a cooling device for an internal combustion engine capable of improving cooling efficiency of a cooling part.  <P>SOLUTION: The cooling device includes: an oil pump 51 for supplying oil under pressure; a cylinder head 15 forming part of a combustion chamber 20; a cooling portion 70 formed in the cylinder head 15 and adapted to allow circulating oil to cool heat transmitted from the combustion chamber 20; an oil cooler 41 for cooling oil; and a thermostat 60 for switching between an oil passage 87 routed through the oil cooler 41 and a bypass passage 84 bypassing the oil cooler 41. The thermostat 60 is disposed in an oil passage between the oil pump 51 and the cooling portion 70.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009235838-A (JP)
Title: Asbestos removal apparatus
Inventor: SAEGUSA SHOZO
IPC: E04F21/00
Filed: 2008-03-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide an asbestos removal apparatus which can ensure the safety of a worker and a safe working environment, and can surely and efficiently remove asbestos existing in various states in a building.  <P>SOLUTION: The asbestos removal apparatus includes a work room 10 closely contacting with an asbestos construction surface 100 of a building, a robot 30 which inserts an articulated arm 31 into the work room, and mounts a nozzle 53 spraying dry ice particles to the asbestos construction surface 100 at the tip end of the articulated arm 31, a dry ice supply means 50 supplying the dry ice particles to the nozzle 53, a suction means 60 maintaining negative pressure in the work room 10, a discharge means 70 discharging asbestos removed from the asbestos construction surface 100 to the outside of the work room 10, and a vehicle 80 mounting the work room 10 and the robot 30 on it.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009239190-A (JP)
Title: Dicing die-bonding tape
Inventor: WATABE KOJI
IPC: H01L21/301
Filed: 2008-03-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a dicing die-bonding tape wherein a semiconductor wafer and a die-bonding film are precisely cut by laser dicing, and after the laser dicing, a semiconductor chip is easily released together with the die-bonding film.  <P>SOLUTION: The dicing die-bonding tape for laser dicing includes a die-bonding film 3 and a non-adhesive film 4 pasted on one side 3a of the die-bonding film 3. The die-bonding film 3 contains a thermosetting compound and thermosetting agent. The non-adhesive film 4 contains resin bridging substance as a main component. The dicing die-bonding tape has the storage elasticity at 25°C of 1-1,000 MPa, and that at 60°C of 1 MPa or higher.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009242476-A (JP)
Title: Microcapsule for epoxy resin curing promotion and method for producing microcapsule for epoxy resin curing promotion
Inventor: WADA TAKUYA
IPC: B01J13/14
Filed: 2008-03-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a microcapsule for epoxy resin curing promotion which combines high curing properties with storage stability and which is suitably used for high density electronic equipment and the like and to provide a method for producing the microcapsule for epoxy resin curing promotion.  <P>SOLUTION: The microcapsule for epoxy resin curing promotion is provided wherein a resin having a primary amino group at its side chain as a core agent is involved in a shell made of resin. In the microcapsule, the resin having the primary amino group at its side chain has a weight average molecular weight of 5,000 to 150,000.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009241775-A (JP)
Title: Glove compartment device in vehicle
Inventor: SHIGA MINORU
IPC: B60R7/06
Filed: 2008-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To simplify a constitution of a glove compartment device in a vehicle and to easily perform operation with respect to the glove compartment device.  <P>SOLUTION: The glove compartment device in the vehicle is provided with a lid body 16 pivotally supported on a cabin wall 4 so as to be reciprocation-turned A, B; an arm 21 projected from the lid body 16 and penetrated through a through-hole 20; and an engagement part 22 for suppressing advancement turning A of the lid body 16 of a predetermined angle or more. The arm 21 is integrally formed on the lid body 16. When a projection end part of the arm 21 is fitted into the through-hole 20 from the cabin 2 side, a fragile part 35 is formed on the projection end part of the arm 21 such that a cross section of the projection end part of the arm 21 is elastically contracted by external force from a hole edge part of the through-hole 20. An engagement part 22 is provided with an engagement projection 37 projected from the hole edge part of the through-hole 20 toward the inner side of the cabin wall 4; and an engagement recession part 38 formed on the projection end part of the arm 21 and fitted to the engagement projection 37 when the lid body 16 is advancement-turned A by a predetermined angle.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009246827-A (JP)
Title: Device for determining positions of sound source and virtual sound source, method and program
Inventor: TAKAHASHI YOSHINORI
IPC: H04R3/00
Filed: 2008-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a device for determining positions of a sound source and virtual sound source that obtains the intended measurement results without using measurement signals, a method and program.  <P>SOLUTION: The device for determining the position of the sound source determines the positions of the sound source and virtual sound source by using three or more microphones disposed on a predetermined sound field space. The three or more microphones comprising the number greater than that of spatial dimension include: an acquiring means 11 for acquiring plurality of pairs of acoustic signals comprised of a pair of the acoustic signals from two microphones out of three or more microphones; and a calculating means 14 for calculating a plurality of linear equations by estimating the sound source direction expressed by the linear equations passing a middle point between the microphones in each pair of microphones from a phase difference of each pair of acoustic signals in the acquired plurality pairs of the acoustic signals. Further, the device includes a determining means 15 for determining a minimum square resolution of a simultaneous equation comprising the plurality of the linear equations as the positions of the sound source and virtual sound source.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009246254-A (JP)
Title: Thermoelectric conversion temperature sensor
Inventor: KATAKURA TATSUO
IPC: G01K7/02
Filed: 2008-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a thermoelectric conversion temperature sensor using thermoelectric conversion semiconductors providing thermoelectromotive force suitable for temperature detection.  <P>SOLUTION: A P-type thermoelectric conversion semiconductor 1 and an N-type thermoelectric conversion semiconductor 2 are connected to each other through a conductor 3 by interposing an insulator 4 between them, the insulator 4 such as air is filled between the P-type thermoelectric conversion semiconductor 1 and the N-type thermoelectric conversion semiconductor 2, and all of them are housed in an insulating container 7.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009046655-A (JP)
Title: Production method of unsaturated (poly)alkylene glycol ether monomer and production method of (poly)alkylene glycol chain-containing polymer
Inventor: YUASA TSUTOMU
IPC: C08G65/28
Filed: 2008-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a production method of a (poly)alkylene glycol chain-containing polymer which can be preferably used in various applications such as an admixture for cement, etc., and which can exhibit extremely high dispersibility to a cement composition.  <P>SOLUTION: The invention relates to a method for producing an unsaturated (poly)alkylene glycol ether monomer by an addition reaction of an alkylene oxide to an unsaturated alcohol, wherein the production method comprises a step of carrying out addition reaction under condition of existence of 0.001 to 25 parts by mass of an unsaturated (poly)alkylene glycol diether monomer to 100 parts by mass of the unsaturated alcohol, and a (poly)alkylene glycol chain-containing polymer production method, wherein the polymer is produced by a step in which a 100 parts by mass of the unsaturated (poly)alkylene glycol ether monomer is polymerized in the presence of 0.001-20 parts by mass of the unsaturated (poly)alkylene glycol diether.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008265877-A (JP)
Title: Foam ejection pump dispenser
Inventor: CHOI HEE JIN
IPC: B65D83/76
Filed: 2008-04-02
Abstract: <P>PROBLEM TO BE SOLVED: To provide a foam ejection pump dispenser which has a content backflow preventing function for preventing the backflow of a liquid.  <P>SOLUTION: This foam ejection pump dispenser is equipped with: an air valve member 100; an air valve guide member 300; a piston disengagement preventing surface 500; a piston member disengagement preventing surface holder portion 700; a liquid leakage preventing spring 200; and a ball valve support 90. The air valve member 100 covers an upper step of a piston cover member 50, and a main wall of an upper portion thereof is equipped with an air opening/closing plate 120. The air valve guide member 300 is fitted into the inner surface of the intermediate section of the piston cover member 50, and the upper step thereof is composed of an air opening/closing step flange 310. The piston disengagement preventing surface 500 is constituted integrally with the piston cover member 50, and the main wall thereof is equipped with a large number of outside air inflow grooves 501. The piston member disengagement preventing surface holder portion 700 is constituted above the piston member 70, and an inner surface of an upper step is equipped with a piston member disengagement preventing step flange 701. The liquid leakage preventing spring 200 is constituted between the piston cover member 50 and the piston member 70. The ball valve support 90 is constituted on the lower step of a valve shaft 80.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009253446-A (JP)
Title: Multi-image file generating device, program, and method
Inventor: OKAZAWA ATSURO
IPC: H04N5/91
Filed: 2008-04-02
Abstract: <P>PROBLEM TO BE SOLVED: To provide a multi-image file generating device, etc., for generating a multi-image file wherein re-connection after division is comparatively easily performed.  <P>SOLUTION: A multi-image file includes in one file: one kind of main image data to be a representative; and one or more kinds of sub-image data other than the main image data, wherein header areas are respectively arranged in the respective kinds of image data. When the multi-image file is generated, a multi-image file generating device records related information including main image file information for identifying that the main image data and one or more sub-image data belong to the same multi-image file, in the respective header areas of the main image data and one or more kinds of sub-image data. The related information may also includes the total number of sub-images, an image identification number, an identifier, and an image kind, for example.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009248179-A (JP)
Title: Steel plate introducing guide, hot straightening machine equipped with steel plate introducing guide and hot-rolled steel plate manufacturing line equipped with hot straightening machine
Inventor: OZEKAWA ATSUSHI
IPC: B21B39/14
Filed: 2008-04-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide a steel plate introducing guide with which even the steel plate having a camber is stably introduced into the hot straightening machine without performing once stop and pulling-out in the opposite direction to the conveying direction, and to provide a hot straightening machine equipped with the steel plate introducing guide and a hot-rolled steel plate manufacturing line equipped with the hot straightening machine.  <P>SOLUTION: The steel plate introducing guide is a steel plate introducing guide 10 which is installed on the inlet side of the steel plate in the hot straightening machine 2 which is equipped on the hot-rolled steel plate manufacturing line 1 and used for introducing the steel plate 3 into the hot straightening machine and equipped with a plate-like body 11, wide flange beams 12e, 12f, 12g which are installed on the rear side of the plate-like body and arranged in the approximately parallel direction to the width direction of the hot-rolled steel plate manufacturing line and wide flange beams 12a, 12b, 12c, 12d which are arranged in the approximately parallel direction to the longitudinal direction of the hot-rolled steel plate manufacturing line; and the hot straightening machine equipped with the steel plate introducing guide and the hot-rolled steel plate manufacturing line equipped with the hot-straightening machine are provided.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009259414-A (JP)
Title: Organic el element
Inventor: MORI KOICHI
IPC: H05B33/06
Filed: 2008-04-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide an organic EL element for reducing luminance spots while improving the extraction of light.  <P>SOLUTION: The organic EL element 1 comprises a substrate 2, a first transparent electrode 3 formed on the substrate 2 for transmitting light, an organic luminescent layer 6 formed on the first transparent electrode 3, a negative electrode 7 formed on the organic luminescent layer 6 and having an opening portion 7a formed in a region where the organic luminescent layer 6 is formed, a conductive feeding member 8 arranged above the negative electrode 7 in spaced relation and connected to the first transparent electrode 3 on the outside of the organic luminescent layer 6, and a protruded connection member 9 inserted through the opening portion 7a in no contact with the negative electrode 7 and connected to the first transparent electrode 3 and the feeding member 8.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2008270815-A (JP)
Title: Method of eliminating m-shape etching rate distribution in inductively-coupled plasma reactor
Inventor: YUEN STEPHEN
IPC: H01L21/3065
Filed: 2008-04-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide an induction coupled plasma processing chamber.  <P>SOLUTION: The induction coupled plasma processing chamber has a chamber having an upper wall. A first antenna and a second antenna are arranged, adjoining the upper wall. The first antenna is coaxially provided with the second antenna. A plasma source power supply is connected to the first antenna and the second antenna. The plasma source power supply generates a first RF power for the first antenna and a second RF power for the second antenna. A substrate support member is arranged in the chamber. The size of the first antenna and a distance between the substrate supporting member are so defined as the etching rate of the substrate on the substrate supporting member which is substantially uniform.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2009263444-A (JP)
Title: Base material comprising hollow silicone fine particle or bell-structure silicone fine particle including core particle in hollow particle
Inventor: MURATA TERUICHI
IPC: F16F15/02
Filed: 2008-04-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a base material which can maintain transparency because the particle size is small and excels in sound insulating properties and vibration damping performances by dispersing the particles in the base material or a matrix.  <P>SOLUTION: The base material comprises hollow silicone fine particles having a volume average particle size of <0.5 μm, which have on the shell part a layer consisting of a silicone compound which consists of one or more units selected from the group consisting of a SiO<SB>4/2</SB>unit, RSiO<SB>3/2</SB>unit (wherein R indicates at least one organic group having a 1-4C alkyl group, 6-24C aromatic group, vinyl group, γ-(meth)acryloxypropyl group or SH group), R<SB>2</SB>SiO<SB>2/2</SB>unit and R<SB>3</SB>SiO<SB>1/2</SB>unit and in which the proportion of the RSiO<SB>3/2</SB>unit is ≥50 mol% (provided that the total of the SiO<SB>4/2</SB>, RSiO<SB>3/2</SB>, R<SB>2</SB>SiO<SB>2/2</SB>and R<SB>3</SB>SiO<SB>1/2</SB>units is 100 mol%) and which have in the inside at least one hollow, and/or bell-structure silicone fine particles including core particles in the hollow particles.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009264444-A (JP)
Title: Air spring
Inventor: ANDO SATORU
IPC: F16F9/32
Filed: 2008-04-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide an air spring 10 for preventing the disappearance of reverse portions 5, 6 of a diaphragm 3 and return to an original straight shape.  <P>SOLUTION: The air spring 10 is provided with a constraining member 7 provided at the end of the diaphragm 3 on the side of a piston member 1 for preventing the disappearance of the reverse portions.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009267669-A (JP)
Title: Gateway device, communication method and program
Inventor: OZAWA KAZUNORI
IPC: H04L12/66
Filed: 2008-04-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a gateway device which interconnects multimedia services for TV telephones that use a mobile circuit-switching network or a mobile circuit-switching protocol to a mobile IMS network, interconnects circuit-switching mobile terminals and IMS mobile terminals, and achieves total IMS services; and to provide a program and a method.  <P>SOLUTION: The gateway device 110 interconnects the mobile circuit-switching network 130 with the mobile IMS network 102 to achieve TV telephones. The gateway device 110 has a converter which separates multiplexed bit stream signals that are output from a mobile terminal 120 connected to the mobile circuit-switching network, extracts at least one of a control signal, a compressed and encoded audio signal, and a compressed and encoded video signal, converts the control signal to at least one of a MEGACO signal, an SIP signal and an SDP signal, converts the audio signal and the video signal to packetize them if necessary, and transmits them to the IMS network.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009265012-A (JP)
Title: Semiconductor sensor
Inventor: HASHIMOTO MIKIO
IPC: G01L9/00
Filed: 2008-04-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor sensor improved in measuring accuracy by reducing a temperature drift caused due to a difference in thermal expansion coefficient between constituting members.  <P>SOLUTION: The semiconductor sensor 1A(1) comprises at least a semiconductor substrate 2, a pressure sensing part 3 disposed on the semiconductor substrate, and a pad part 4 disposed adjacently to the pressure sensing part and electrically connected to the outside. The semiconductor substrate includes a groove 6 disposed between the pressure sensing part and the pad part on the surface provided with the pad part.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009268488-A (JP)
Title: Electric rice cooker
Inventor: YANO YOSHIHIKO
IPC: A47J27/00
Filed: 2008-04-30
Abstract: <P>PROBLEM TO BE SOLVED: To reduce the consumption power under a control-waiting state as much as possible in an electric rice cooker which is constituted in such a manner that a desired control for a control object is performed by using a plurality of microcomputer control units which can communicate with each other.  <P>SOLUTION: This electric rice cooker is constituted in such a manner that the desired control of the control object is performed by using the plurality of microcomputer control units which can communicate with each other. The electric rice cooker is made to be able to direct or release the shifting to a power saving standing-by mode which keeps the power consumption less than that of a control-waiting time from a specified microcomputer control unit to the other microcomputer control units at the control-waiting time.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009272505-A (JP)
Title: Method of manufacturing semiconductor device, and semiconductor package carrier
Inventor: MASUDA NAOMI
IPC: H01L25/07
Filed: 2008-05-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device and a semiconductor package carrier that achieve thickness reduction and cost reduction and prevent damaging.  <P>SOLUTION: The method of manufacturing the semiconductor device includes the processes of: electrically connecting a tip portion 16 to a lead 6 of a lead frame 2 using a connection means; flip-chip mounting a semiconductor chip 22 on the tip portion 16; conducting an electric test of the semiconductor chip 22 through the lead 6; and separating the semiconductor package 28 consisting of the tip portion 16 and semiconductor chip 22 from the lead 6 by removing the connection means 14. Thus, the method of manufacturing the semiconductor device and the semiconductor package carrier are provided that achieve thickness reduction and cost reduction and prevent damaging.  <P>COPYRIGHT: (C)2010,JPO&INPIT