baber/WOPTO huggingface dataset:
Patent JP-S6019086-A (JP)
Title: Treatment of heavy oil ash
Inventor: SAKUMA AKIRA
IPC: C01B31/00
Filed: 1983-07-12
Abstract: PURPOSE:To recover valuable metals in good efficiency by improving the separation of components in ash, by providing a specific means for allowing water, an acid or alkali to act on ash discharged from the dust collector provided in the exhaust gas flue of a heavy oil burning boiler. CONSTITUTION:Water J is added to heavy oil ash A in a mixing tank 1 and both of them are stirred by a stirrer to form a slurry which is, in turn, guided to a dissolving tank 2 where sulfuric acid E is added to the slurry to adjust the pH thereof to 3 or less. Subsequently, the slurry is guided to a separator 3 to perform solid-liquid separation by a filter and the filtrate is introduced into a pH adjusting tank 4. On the other hand, separated carbon sludge is guided to a dissolving tank 13 where recirculated water J is added to said sludge to dissolve residual ammonium sulfate or heavy metals and, thereafter, solid-liquid separation is performed by a centrifugal separator 14 to obtain carbon sludge. The filtrate of the separator 3 is guided to the pH adjusting tank 4 while aqueous ammonia is added to said tank 4 from an aqueous ammonia tank 15 to adjust the pH thereof to 7-8 and vanadium is separated as VO(OH)2.
Patent JP-S5828229-A (JP)
Title: Preparation of cold drink of green tea
Inventor: TOUMI TAKEO
IPC: A23F3/16
Filed: 1981-08-10
Abstract: PURPOSE:To prepare instantly a cold drink of green tea for common use, by powdering green tea component, blending it with various kinds of seasonings. CONSTITUTION:Distilled water is fed to a container, it is heated at about 70 deg.C, leaves of green tea (refined green tea, green tea of middle grade, etc.) are added to it, the component of the green tea is oozed out, and filtered, to give green tea water. Dextrin is added to it, stirred fully, the liquid is put in a spray drying device, and powdered with keeping it at <=70 deg.C. The resultant powder is blended with powder of Ume (a Japanese apricot), powder of beefsteak plant, glucose, salt, sodium glutamate, sugar, etc. Ice water is added to the blend to give a cold drink of green tea.
Patent JP-S6019021-A (JP)
Title: Gas drying apparatus
Inventor: NOHARA SABUROU
IPC: B01J20/28
Filed: 1983-07-12
Abstract: PURPOSE:To obtain a method excellent in vibration resistance and the anti- powdering property of an adsorbent, by arranging a porous filter layer wherein zeolite particles are held in a fiber aggregate so as to pack the same and a molded adsorbent layer in a laminar state. CONSTITUTION:A zeolite powder with a specific surface area of 300m<2>/g or more is scattered on a blended fiber aggregate sheet prepared by applying heat treatment to a staple natural fiber or synthetic fiber and a staple fiber containing a low m.p. thermoplastic synthetic fiber comprising copolymerized polyester and the same sheet is further placed on the zeolite layer while the whole is pressurized under heating to obtain a filter. The obtained filter layer 31, 33, zeolite adsorbent layers 30, 32 and an alumina gel adsorbent layer 34 are arranged in a drying tower 27 in a laminar state. Gas is introduced into this drying tower 27 from the bottom part 37 thereof and dried gas with a low dew point is obtained from the tower top according to a pressure swing (PSA) method.
Patent JP-H04326947-A (JP)
Title: Apparatus for pulverizing and feeding sample
Inventor: SATAKE TOSHIHIKO
IPC: G01N1/04
Filed: 1991-04-27
Abstract: PURPOSE:To automate feeding raw material grain and discharging sample particles, by making electric connection between a raw material feeder and a sample container feeder through a control part and by filling pulverized raw material automatically corresponding to raw material fed. CONSTITUTION:When the temperature of a pulverizing part 21 reach a prescribed point, grain including rice is fed respectively to raw material hoppers 9A, 9B on a rotary disk 10. A motor 17, actuated by a signal from a control part, turns a rotary table 8 to locate the raw material hopper 9A to an inlet 11 on the rotary disk 10. Rice grains in the raw material hopper 9A is added into a feeding hopper from the inlet 11, and the rice grains around a falling hole are transferred portion by portion of a proper and constant quantity through a feeding trough 24 to a discharging part. When all pulverized rice powder is fed into a sample container 44A, a rotary disk 51 is turned by a motor 55, actuated by a signal from the control part, and stopped at the position of a sample container 44B. A screw bar 61 is always turned normally by a normal reversing motor 63, and a lid feeding plate 59 is moved forward by the movement of a transfer screw bar 60.
Patent JP-S5751077-A (JP)
Title: Preventing method for water feeding noise
Inventor: MIYATA TEIZABUROU
IPC: F16K31/18
Filed: 1980-09-10
Abstract: PURPOSE: To prevent the occurrence of noise in a water tank by exhausting and shielding air in the entire surfaces of a groove, a silencer and a hose of effluent storage water and stopping sound wave produced due to air vibration.  
     CONSTITUTION: When water in a tank is exhausted externally from a drain pipe 22, water flowed out of a feedwater stopper 2 is partly flowed into a hand washing unit, the residue of the water is flowed down to a buffer plate surface 7 in a vibration preventing unit B, the collision vibration and sound wave propagation of the water are stopped while flowing down in the unit C, and the water is steadily exhausted from an effluent groove 13 to the bottom surface of the tank. When the groove 13 becomes under water with the effluent storage water, air on the entire surfaces of the groove 13, silencer 14 and hose 15 are exhausted and shielded, thereby eliminating the cause of occurring the sound wave and preventing the occurrence of the noise. 
     COPYRIGHT: (C)1982,JPO&Japio
Patent JP-H10321645-A (JP)
Title: Semiconductor device and its manufacture
Inventor: NAGAHARA MASAKI
IPC: H01L21/338
Filed: 1997-05-15
Abstract: PROBLEM TO BE SOLVED: To restrain the electric field intensity of a channel layer and suppress gun oscillation, by forming the channel layer on a base substrate, and making the practical thickness in a drain region greater than the practical thickness in a source region, in the surface side. SOLUTION: When a specified negative voltage is applied to a gate electrode 26, a depletion layer 37 is formed in a barrier layer 16 and a channel layer 14. In this semiconductor device, the channel layer 14 is thickly formed in a drain region reaching an ohmic region 34 from below the gate electrode 26, so that the depletion layer 37 is hard to stretch to the ohmic region 34 side. Thereby the density of electric lines of force in the channel layer 14 can be restrained to be low, in the drain region reaching the ohmic region 34 from an inert layer 36 end portion. The traveling path of carriers traveling in the channel layer 14 becomes short, in the drain region reaching the ohmic region 34 from below the gate electrode 26. Thereby Gunn oscillation can be suppressed.
Patent JP-S61282661-A (JP)
Title: Revolution introducing mechanism for sealed container
Inventor: NAKAMURA YOZO
IPC: F16D3/00
Filed: 1985-06-10
Abstract: PURPOSE:To prevent the deflection of revolution ratio and generation of breakage by using an inscribed gear mechanism between an internal gear and an external gear for introducing a turning power into a sealed container and permitting the revolution movement of one gear around another gear. CONSTITUTION:The first rotary shaft 15 and the second rotary shaft 17 are rotatably accommodated into a sealed container 10, and at the edge part of the second rotary shaft 17, a counterweight 19 is installed on one edge side and a crank 20 is installed on the other. Further, an internal gear 21 is installed onto the crank pin 20B of the crank 20 through a needle bearing 22. While, an external gear 23 is installed integrally onto the first rotary shaft 15. Therefore, the internal gear 21 performs revolution motion around the external gear 23, and since the transmission of revolution is carried out certainly with the revolution ratio determined according to the number of teeth, the deflection of revolution ratio, breakage of each part due to slide, and the difficulty in assembly work can be eliminated.
Patent JP-2000282548-A (JP)
Title: Manhole toilet for men and women at the time for disaster
Inventor: TANABE SEIZO
IPC: E03D11/00
Filed: 1999-03-29
Abstract: PROBLEM TO BE SOLVED: To facilitate the setting of a closet and a urine at a single toilet for disaster by providing a toilet stool on a manhole cover or forming a hole for use as a urine in the cover. SOLUTION: At the time of a disaster, a sewerage manhole cover is detached for attaching thereto a manhole toilet for men and women for disaster. A hole for attaching a toilet stool 3 is formed in the cover 1 of the manhole. Then, a hole 6 into which drainage from a urine or after washing hands is discharged is formed. The cover 1 of the manhole is set in an attaching frame 2. Next, the attaching frame 2 is embedded by paving 10. Then, the toilet stool 3 is fixed by means of a toilet stool attaching screw 4. A safety bar 5 is provided for preventing children from falling. When drainage from the urine for men is connected to the toilet stool 3 or to the urine drainage hole 6, the toilet stool is available for men and women. Thus, the manhole toilet can serve as an emergency common toilet at the time of a disaster.
Patent JP-H06336129-A (JP)
Title: Driver's seat installation structure for tractor
Inventor: MIZOHATA NORIHIRO
IPC: B60N2/00
Filed: 1993-05-27
Abstract: PURPOSE:To provide the driver's seat installation structure for a tractor which can provide the large head clearance by reducing the installation height of a driver's seat and achieve cost reduction. CONSTITUTION:A floor plate 17 is installed at the bottom part of a cabin mounted on a tractor car body, and a bulging-out part 23 is formed by upwardly projecting the floor plate 17 itself, and the undersurface of a driver's seat 17 is placed on the bulging-out part 23, and the fixed members 30 and 31 fixed on the undersurface side of the driver's seat 17 are allowed to penetrate through the floor plate 17, and the fixed members 30 and 31 are fixed on the floor plate 17 on the undersurface side of the floor plate 17.
Patent JP-S5649744-A (JP)
Title: Composite oleogel and production thereof
Inventor: BUSA GIICHI
IPC: C08L91/00
Filed: 1979-09-29
Abstract: PURPOSE: To obtain a composite olegel which is useful as a gel mat and which has a high stress dissipation ability, by dissolving a rubber component in an oil component, adding a crosslinking agent to the solution, at the same time emulsifying a high b.p. hydrophilic liquid into the solution, and then crosslinking the rubber component.  
     CONSTITUTION: A rubber component containing unsaturated bonds in the molecule is dissolved in an excess of an oil component ar room temperature or under heating. The system containing the dissolved rubber component and the oil component is mixed with a crossliking agent at a temperature lower than the decomposition temperature of the agent, and at the same time a high b.p. hydrophilic liquid is added and emulsified uniformly in the system with the aid of an emulsifier to form an O/O emulsion containing 15W99wt% of a continuous phase consisting of the rubber component and the oil component and 85W1wt% of a dispersed phase of  the emulsified high b.p. hydrophilic liquid. Then, the emulsion is gelled by crosslinking the rubber component. The high b.p. hydrophilic liquid is one which is  emulsified into particles of a diameter of about 0.1W20μ. Examples of the liquid  include n-butyl alcohol, ethylene glycol and benzyl alcohol. 
     COPYRIGHT: (C)1981,JPO&Japio
Patent JP-H01295463-A (JP)
Title: Thin film semiconductor element and manufacture thereof
Inventor: MURAMOTO HIDETOSHI
IPC: H01L21/31
Filed: 1988-05-24
Abstract: PURPOSE:To improve step coverage property, by covering a semiconductor island having a right-angle edge part with a dummy insulating film having a smoothly curved surface. CONSTITUTION:A semiconductor film 10 which is formed on an insulating substrate 1 is divided by anisotropic etching to form a plurality of semiconductor islands 2. A dummy insulating film 3 having a smoothly curved surface is formed so as to cover at least a plurality of the semiconductor islands 2. Of the dummy insulating film 3, a part covering a functional-element forming surface 2a on the upper surface of each semiconductor island is removed by isotropic etching. Thereafter, a film layer 4 constituting functional elements is overlapped and formed on the upper part. Even if the film layers are overlapped and formed on the exposed element-forming surface 2a and dummy insulating film 3, there is no problem such as the local thinning of the film layers, and the step coverage property is improved.
Patent JP-H11330116-A (JP)
Title: Manufacture of semiconductor device and lead frame and molding die to be used for the method
Inventor: TANAKA ATSUHIKO
IPC: B29K105/20
Filed: 1998-05-08
Abstract: PROBLEM TO BE SOLVED: To obtain a lead frame and a molding die for executing a resin encap sulated type semiconductor device manufacturing method capable of reducing voids generated in a resin encapsulating part, uniforming the thickness of the resin and improving manufacturing yield. SOLUTION: In the manufacturing method for a resin encapsulated type semiconductor device formed by transfer molding, one end side (held part 201) of the lead frame is held by a holding part 712 of a molding die 7 and the other side (movable held part 202) of the lead frame is movably held by a movable holding part 7 of the die 7. A movable holding part 713 absorbs the drawing of the frame 2 due to heat and prevents a frame 2, especially a supporting plate 21, from warping. In this state, the inside of a cavity of the die 7 is filled with thermosetting dissolved resin, which is thermally set to form a resin encapsulating part.
Patent JP-H10306355-A (JP)
Title: Aluminum alloy substrate for lithographic plate, and its production
Inventor: OOYAMA YASUSHI
IPC: C22C21/00
Filed: 1997-04-30
Abstract: PROBLEM TO BE SOLVED: To provide an aluminum alloy substrate for a lithographic plate, capable of giving uniform rough surface by means of surface roughing treatment and excellent in annealing softening resistance and thermal fatigue resisting strength. SOLUTION: This substrate is an aluminum alloy sheet produced by subjecting an aluminum alloy ingot, having a composition consisting of, by weight, 0.2-0.5% Fe, 0.02-0.15% Si, <=0.05% Cu, and the balance Al with inevitable impurities, to soaking treatment at 500-620 deg.C for >=1hr, to hot rolling at 380-480 deg.C starting temp. and 280-380 deg.C finishing temp., and to cooling down to <=250 deg.C at <=5 deg.C/min average cooling rate and then applying cold rolling to the resultant hot rolled plate to final sheet thickness at >=60% total rolling rate without applying heat treatment, such as annealing, after hot rolling.  Moreover, the ratio of recrystallization at the surface of the plate cooled down to ordinary temp. after hot rolling is regulated to >=80%, and also the average width of crystalline grains, in a direction orthogonal to rolling direction, at the surface of the sheet at final sheet thickness is regulated to <50 μm.
Patent JP-S614149-A (JP)
Inventor: ANDOREASU SEBASUTEIANUSU HERUT
IPC: H01J61/04
Filed: 1985-06-12
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S6017883-A (JP)
Inventor: ITSUNO KIYOSHI
IPC: H05B6/64
Filed: 1983-07-11
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H01295430-A (JP)
Title: Printed wiring board
Inventor: MUKAI KAORU
IPC: H05K3/28
Filed: 1988-05-24
Abstract: PURPOSE:To decrease wiring density without providing extra through holes or via holes in a board, by providing a circuit between a bonding part and a chip mounting part, forming interconnections between the bonding pad and other conductor parts, and applying an insulating coating on the circuit. CONSTITUTION:Interconnecting relation is determined for a bonding pad 6 on a wire bonding board. A pattern wiring between the bonding pad 6 and other conductor parts F such as through holes and a chip pad 53 is formed. At this time, a circuit 30 is formed between a bonding pad part 10 and a chip mounting part 20. At this time, the circuit 30 is insulated and coated so that short circuits are not formed even if wires between a chip 52 and a bonding pad 7 are lowered and sufficient electrical functions can be accomplished. In this way, interconnections between the required bonding pad 7 and the conductor parts A-H can be formed at a low density without providing extra through holes or via holes.
Patent JP-S5554214-A (JP)
Title: Long size coil possessing fold
Inventor: HANAIKE TOSHIMICHI
IPC: E04C2/30
Filed: 1978-10-14
Abstract: PURPOSE: To give the long size coil like as the coil for manufacturing the architectural materials the suitable workability and the material strength, by forming the flods with a specified breadth at a specified interval in the strip.  
     CONSTITUTION: The Z-section fold 4 is formed at a specified position parallelly to the broad direction A in the strip 3 like as the steel sheet, nonferrous metallic sheet, etc. The fold 4 is pressed from upside and bottom side B to form the flat surface; hereby, the fold 2 with thickness treble of that of the strip 3 is formed. This fold 2 is repeatedly formed at the required interval along the longitudinal direction of the long size strip 3 parallelly to the broad direction A of the strip 3. By coiling this long size strip 3, the long size coil 1 with folds 2 is obtained. According to this method, the long size coil with required strength suitable for the purpose can be simply manufactured. 
     COPYRIGHT: (C)1980,JPO&Japio
Patent JP-S6017734-A (JP)
Title: Controlling system of original scanner
Inventor: AKIYAMA YASUHISA
IPC: G03B27/50
Filed: 1983-07-12
Abstract: PURPOSE:To prevent generation of damage or distortion, etc. of a moving means by switching and using hourly at least two kinds of set speeds, when resetting the moving means to its scanning initial position. CONSTITUTION:An installing position of a switch SW2 is set so that the switch SW2 is turned on when a carriage is returned to a distance having a little allowance in a no-load running distance. When the switch SW2 is turned on in the course of moving backward at a high speed, the backward moving action is set to a low speed backward motion mode at that time point. Thereafter, the carriage moves backward by the low speed backward motion mode on a control signal, and at the time point when it is returned to the scanning initial position and a switch SW1 is turned on, it enters into a stop mode. As for an action of the carriage, after the switch SW2 is turned on, it is returned to the scanning initial position by inertia for the most part, and a short portion of the moving distance due to the inertia is compensated by a low speed backward motion. By executing such a control, the carriage stops smoothly at the scanning initial position.
Patent JP-S5650935-A (JP)
Title: Expanded synthetic resin heat insulating body
Inventor: KOIZUMI MUTSUO
IPC: C08L67/00
Filed: 1979-10-03
Abstract: PURPOSE: To provide the titled polyolefinic or polystyrenic, heat insulating body which is formed by adding a material having a specific radiation absorption rate to prevent the increase in its heat conductivity as the expansion ratio increases.  
     CONSTITUTION: A material having >0.3 mean radiation absorption rate at 10μ thickness basing on blackbody radiation at 300°K (about 27°C or near room  temperature), such as polyvinyl alcohol or calcium phosphate is used. Such a material is used in amount of 1W200pts.wt. (preferably 1W50pts.wt.) to be added to 100pts.wt. of a polyolefinic or polystyrenic polymer which absorbs infrared ray of 5W30μ wavelength. Then, the mixture is blown up. Preferably, the expansion ratio is set above the value at which the expanded body would show the minimum apparent conductivity without adding the above described material. 
     COPYRIGHT: (C)1981,JPO&Japio
Patent JP-S63292299-A (JP)
Title: Output circuit for alarm test signal
Inventor: SAITO TOSHIBUMI
IPC: G08B29/02
Filed: 1987-05-26
Abstract: PURPOSE:To obtain a compact output circuit for alarm test signal by using a parallel load shift register as well as a ROM which is controlled by a signal received from an encoder part, a selecting signal for alarm data transmission unit and an alarm data selecting signal. CONSTITUTION:An encoder 12 converts unit selecting signals 203-205 received from an alarm unit 10 into binary address signals. A ROM 11 stores alarm data and is controlled by the signal received from the encoder 12, an alarm data transmission unit selecting signal 13 and an alarm data selecting signal 14. A parallel load shift register 1 receives an alarm clock 201 received from the unit 10, a shift load signal 202 and the alarm data received from the ROM 11 to convert serially them and transmit an alarm test signal 206. As a result, the number of alarm data setting terminals is decreased and a compact output circuit for alarm test signal is obtained.
Patent JP-S5251771-A (JP)
Title: Waste burning furnace
Inventor: SONODA TAKESHI
IPC: F23H9/06
Filed: 1975-10-21
Abstract: PURPOSE: To provide a waste burning furnace, which is equipped with a rotary fire grate at the bottom opening thereof so as to make it possible to easily discharge incombustible substances and to be used as a trash box. 
     COPYRIGHT: (C)1977,JPO&Japio
Patent JP-H07310422-A (JP)
Title: Manufacture of tile panel with synthetic resin formed layer
Inventor: YAMAOKA KENJI
IPC: E04F13/08
Filed: 1994-05-16
Abstract: PURPOSE:To unitize tile materials simply and easily and, in addition, prevent burrs from producing for high practical use. CONSTITUTION:Multiple tile materials 10 are arranged in a vacuum mold in a specified arrangement, and a plastic film 12 is put on the rear side of the tile materials 10 through an adhesive layer and vacuum formed so as to firmly bound the tile materials 10 and the plastic film 12 together integrally. Also the tile materials 10 bonded to the plastic film 12 are put in the foaming mold, and a foaming synthetic resin material is introduced into the outer surface of the plastic film 12 so as to form panel products integrally by forming.
Patent JP-H05326400-A (JP)
Title: Manufacture of semiconductor device
Inventor: SUGAWARA HIROHIKO
IPC: H01L29/205
Filed: 1992-05-20
Abstract: PURPOSE:To obtain a semiconductor device wherein its overall characteristic is good and its reliability is high without sharply changing a process from conventional manufacturing processes. CONSTITUTION:When a semiconductor device is former on a multilayer compound semiconductor crystal substrate which is composed of at least two compound semiconductor crystal layers, the following are included: an annealing process (2) at a temperature which is the growth temperature or higher of a lower-layer epitaxial growth layer after the lower-layer epitaxial growth layer has been grown (1); and, in succession, a process (3) wherein an upper-layer epitaxial growth layer is formed at a temperature which is the growth temperature or lower of the lower-layer epitaxial growth layer.