baber/WOPTO huggingface dataset:
Patent JP-2008230633-A (JP)
Title: Defective article selecting device and defective article selecting method
Inventor: ARAI HIROAKI
IPC: H01M2/02
Filed: 2007-03-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a defective article selecting device for rationally selecting two types of opening defects.  <P>SOLUTION: This unacceptable item selecting device includes a box body support part 11 whose standing face on four sides raised on a flat panel part 10a is square and a movable piece 14 provided at least on one face 13 of the support part 11. The movable piece 14 moves depending on the shape of the inside face of a box body 30 and includes an opening-out stopper 17 for preventing the piece 14 from opening more than predetermined and a support protrusion 16 for keeping the piece 14 open in advance. When the opening size of the box 30 is smaller than an acceptable range, the opened piece 14 is pressed by the inside face of the body 30 where the piece 14 or a contact piece 15 provided at the piece 14 contacts for pushing the protrusion 16 toward the inside of the part 11.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008232704-A (JP)
Title: Inertia force sensor
Inventor: AIZAWA HIROYUKI
IPC: G01P15/18
Filed: 2007-03-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide an inertia force sensor having heightened detection sensitivity.  <P>SOLUTION: This sensor is equipped with a detection element 1 having an acceleration detection part and an angular velocity detection part. The detection element 1 has two orthogonal arms wherein first arms 8 are connected to second arms 10 approximately in the orthogonal direction, and has a constitution described as follows: one end of each of two first arms 8 is supported by a support part 12; the other end of each of the two first arms 8 is connected to a frame body part 4; a weight part 2 is fixed to the tip part of the second arm 10; the frame body part 4 is connected to a fixing part 7 by a fixing arm 11; each thickness of the first arms 8 and the fixing arm 11 is formed extremely more thinly than the thickness of the second arm 10 or the weight part 2; and the first arms 8 and the fixing arm 11 are arranged mutually in the orthogonal direction.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008233371-A (JP)
Title: Antireflection film
Inventor: INAKURA TOMOO
IPC: G02F1/1335
Filed: 2007-03-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide an antireflection film with a low-refractive index layer, which has both an antistatic characteristic and an antireflection characteristic and has a mechanical strength of a practical layer and is available for a display surface.  <P>SOLUTION: An antireflection film 1 has an antireflection layer provided on one principal surface of a light-transmissive substrate 10, and a low-refractive index layer 12 which contains an ionic liquid and has a refractive index of ≤1.45 is provided in the outermost surface of the antireflection layer.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008232835-A (JP)
Title: Analyzer
Inventor: MORI YASUO
IPC: G01N35/10
Filed: 2007-03-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide an analyzer capable of preventing back flow of the waste liquid from a drain pipe.  <P>SOLUTION: The analyzer 1 is equipped with a plurality of measuring mechanisms 3a-3c for performing measuring processing with respect to the reaction liquid of a specimen and a reagent in a reaction container 30 and also equipped with the waste liquid pumps 40a-40c provided to the respective measuring mechanisms 3a-3c and sucking the liquid in the reaction container 30 sucked by the suction nozzles connected to the measuring mechanisms 3a-3c, to send out the same to the drain pipe 31 and a control part 41 for operating all of the waste liquid pumps 40a-40c in a case that at least either one of a plurality of the measuring mechanisms 3a-3c is operated. When at least either one of a plurality of the measuring mechanisms 3a-3c is operated, the back flow of the waste liquid from the drain pipe 31 is surely prevented by always operating all of the waste liquid pumps 40a-40c.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008202588-A (JP)
Title: Wind/hydraulic power impeller using lift-drag force by double-acting rotations
Inventor: ABE YUTAKA
IPC: F03D3/06
Filed: 2007-02-22
Abstract: <P>PROBLEM TO BE SOLVED: To materialize a wind/hydraulic power impeller taking in most of not only lift but also drag larger than the lift in regard to the impeller using wind/hydraulic power, and to provide the wind/hydraulic power impeller capable of dealing with an ocean current or river flow having huge energy even at low flowing speed.  <P>SOLUTION: A plurality of rotation blades 1 is provided on a circumference around a rotating shaft 4 of the impeller. Per one rotation of the impeller, the rotating blades 1 are controlled to rotate in an opposite direction at half speed of the impeller. To a wind/hydraulic current, the rotating blades 1 are set to be parallel with on one side in a right-angle direction of the impeller, and to be orthogonal on the other side. Therefore, the lift and the drag is used together, thereby taking out rotation force.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007288179-A (JP)
Title: Wiring board, and ceramic chip to be buried
Inventor: ORIGUCHI MAKOTO
IPC: H05K3/46
Filed: 2007-03-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a wiring board having excellent connection reliability between a semiconductor element and a mother board.  <P>SOLUTION: A core material 11 of a wiring board 10 with a built-in ceramic chip has an accommodation hole 91 opening at a first main surface 12 of core and a second main surface 13 of core. A ceramic capacitor 101 is accommodated in the accommodation hole 91 while a first main surface 102 of chip is directed to the same side of the first main surface 12 of core, and a second main surface 103 of chip is directed to the same side of the second main surface 13 of core. A first core side insulating layer 33 is formed on the first main surface 12 of core and the first main surface 102 of chip, and a second core side insulating layer 34 is formed on the second main surface 13 of core and the second main surface 103 of chip. In the second core side insulating layer 34, a via hole 54 and a via conductor 50 are not formed in a region corresponding to the second main surface 103 of chip.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008229572-A (JP)
Title: Treatment method of facility wastewater from hot-dip galvanized steel sheet manufacture
Inventor: YAMASHITA SHUJI
IPC: C02F1/56
Filed: 2007-03-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a treatment method of facility wastewater from hot-dip galvanized steel sheet manufacture which can reduce the amount of acid necessary to neutralize an alkaline wastewater and achieve the cost reduction and the space saving of the treatment facility.  <P>SOLUTION: Thick system acid wastewater, thin system acid wastewater and thin system alkaline wastewater are processed through the process of introducing thick system acid wastewater, thin system acid wastewater and thin system alkaline wastewater into a raw water tank 1; a first neutralization process of adjusting the wastewater from the raw water tank 1 to acid water of pH2.5-3; the second neutralization process of generate an insoluble material by adjusting the acid water from the first neutralization process to pH6-11; the flocculating process to flocculate the insoluble material which was generated in the second neutralization process; the solid-liquid separation process of separating the flocculated matter from the treated water as sludge in the flocculating process; and the alkaline sludge return process of adding the alkali to a part of the sludge separated in the solid-liquid separation process and return it to the second neutralization process.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2007293298-A (JP)
Title: Light input/output port of optical component
Inventor: WATANABE SHINGO
IPC: G02B6/02
Filed: 2007-03-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a light input/output port of an optical component capable of preventing damage by leaked light to a clad mode and damage of a fiber end by an increase in an optical power density at each fiber end to which light converged by a lens and the like is coupled.  <P>SOLUTION: The light input/output port 100 is composed of a jacket tube 110 and a flange 120, and a fiber wire 20 is inserted into the center portion. To efficiently remove leaked light in a clad 22 into the jacket tube 110, the jacket tube 110 is formed of quartz glass or the material same as that of the clad 22, and the jacket tube 110 and the clad 22 are integrated by fusion bonding or adhesion fixing of the jacket tube 110 with the clad 22. The beam diameter at the fiber end portion is increased by a part which fusion-bonds the leading end of the optical fiber with the coreless fiber, and power density at the light input/output port is reduced.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008242643-A (JP)
Title: Image forming system handling secure job information, information processing program, and image forming apparatus
Inventor: ASAI NORIHIKO
IPC: G06F3/12
Filed: 2007-03-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image forming system that enables users to appropriately erase job information held in an image forming apparatus while preventing images from being viewed by unspecified users.  <P>SOLUTION: In the system, an information processing apparatus 30 sends to the image forming apparatus 20 secure job information (SJ information) including authentication information for image forming and authentication information for erasure. The image forming apparatus holds the received SJ information in a RAM 23. The image forming apparatus forms an image based on the SJ information when receiving information to instruct execution of image forming and information corresponding to the authentication information for image forming included in the SJ information (Step 540 to 565). The image forming apparatus erases the SJ information from the RAM when receiving information to instruct erasure of the SJ information and information corresponding to the authentication information for erasure included in the SJ information (Step 570 to 585).  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008240609-A (JP)
Title: Piston for internal combustion engine
Inventor: KANAI SHOJI
IPC: F01P3/10
Filed: 2007-03-27
Abstract: <P>PROBLEM TO BE SOLVED: To efficiently cool the temperature of a piston top part by always uniformly separating cooling oil into a cooling cavity, even if a piston vertically moves, even when an injection nozzle or an intake port for injecting the cooling oil from below into the piston cooling cavity, is slantingly arranged in the circumferential direction of the cooling cavity.  <P>SOLUTION: This piston for an internal combustion engine has a cooling system of forming the annular cooling cavity in an outer peripheral wall part of the piston top part of an engine for the internal combustion engine. The piston for the internal combustion engine is characterized in that the cooling system has the cooling oil intake port for taking in the cooling oil injected in the inclined direction to the vertical direction of the piston by the injection nozzle toward the cooling cavity, and the cooling oil intake port is slantingly arranged to the vertical direction in the piston outer peripheral wall part, and a distribution wall on which the injected cooling oil strikes at a substantially right angle, is arranged in a connecting part with the cooling oil intake port of the cooling cavity, and the cooling oil flows in the cooling cavity from the cooling oil intake port.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2007311771-A (JP)
Title: Semiconductor device and method of manufacturing the same
Inventor: OIKAWA TAKAHIRO
IPC: H01L21/3205
Filed: 2007-03-27
Abstract: <P>PROBLEM TO BE SOLVED: To attain both prevention of insuflicient coverage of barrier layer in a via hole and control of via resistance, is a semiconductor device with the via hole and its manufacturing method.  <P>SOLUTION: A semiconductor substrate 1 is prepared having a pad electrode 3 on its front surface. The semiconductor substrate 1 is then etched from its back surface to its front surface to form a via hole 8 exposing the pad electrode 3. A first barrier layer 11 is formed in the via hole 8 by a sputtering method or a PVD method and reverse-sputtering (etching). By this reverse-sputtering, the barrier layer on the bottom of the via hole 8 is removed to expose the pad electrode 3. A second barrier layer 12 is then formed on the pad electrode 3 exposed in the via hole. The via resistance is controlled by adjusting only the thickness of the second barrier layer 12.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008238598-A (JP)
Title: Ligneous board
Inventor: MAEDA NAOHIKO
IPC: B27K5/00
Filed: 2007-03-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a new ligneous board having a natural wood feel, capable of exhibiting, even in a thin veneer, a three-dimensional feel created by Uzukuri (brushing work) and having improved abrasion resistance and crack resistance.  <P>SOLUTION: The surface of a ligneous base material is coated and impregnated with a resin having tenacity, such as a silicone resin having a three-dimensional ladder structure to form the ligneous board.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008242245-A (JP)
Title: Optical scanner
Inventor: INAGAKI YUUKI
IPC: H04N1/113
Filed: 2007-03-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide an optical scanner which accurately detects an angular dislocation even when the angular displacement is large.  <P>SOLUTION: The optical scanner 1 includes: a main body part 11 on the surface of which a mirror face is formed; elastically deformable elastic connection parts 12a and 12b which connect the main body part 11 and a supporting part 3; comb-teeth shaped electrode parts 13a, 13b, 14a, 14b, 14c and 14d which are provided on the main body part 11 and formed into a comb-shape; and comb-teeth shaped electrode parts 4a, 4b, 5a, 5b, 5c and 5d which are engaged with comb-teeth shaped electrode parts 13a, 13b, 14a, 14b, 14c and 14d with a predetermined gap. The main body part 11 oscillates around a turning axis composed of elastic connection parts 12a and 12b by applying an electric voltage between the comb-teeth shaped electrode parts 13a, 13b and the comb-teeth shaped electrode parts 4a, 4b. Further, the scanning angle of the main body part 11 is detected by the electrostatic capacity between the comb-teeth shaped electrode parts 14a to 14d and the electrode pats 5a to 5d.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008249330-A (JP)
Title: Apparatus and method for testing device under test, and tool for cutting and connecting transmission cable
Inventor: ARAI TAKAHIRO
IPC: G01R31/28
Filed: 2007-03-29
Abstract: <P>PROBLEM TO BE SOLVED: To suppress manufacturing cost, improve performance test efficiency, and shorten performance testing time.  <P>SOLUTION: An apparatus includes: a testing computer 200 executing a performance test of a card 100 under test based on a testing macro; a testing tool 300, mounting the card 100, operating according to the instruction from the testing computer 200; and a transmission cable cutting and connecting tool 400, interposed between Ether cables 901 which connect the card 100 with the testing computer 200, cutting/connecting Ether cables 901 according to an instruction from the testing computer 200. With instructing the transmission cable cutting and connecting tool 400 to perform cutting and connecting of the Ether cables 901 by the testing computer 200 instead of demand for manually inserting and extracting the Ether cables 901, The test requiring inserting and extracting the Ether cables 901 in testing is thus automated.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008251587-A (JP)
Title: Part-mounting device and part-mounting method
Inventor: NAKANISHI TOMOAKI
IPC: H01L21/50
Filed: 2007-03-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a part-mounting device and a part-mounting method by which tact time can be shortened to a large extent in comparison with conventional devices.  <P>SOLUTION: The parts are mounted by repeating the steps of a first step of picking up a lower part P1, moving it to a standby stage 49, picking up an upper part P2 and turn it upside down; a second step of picking up a lower part P1 on a standby stage 49 and transferring it to a mounting stage 48; and a third step of picking up the inverted upper part P2 and mounting it on the lower part P1 on the mounting stage 48. When the lower part P1 on the standby stage 49 is picked up and transferred to the mounting stage 48 in the second stage, a completed part P3, manufactured in the previous mounting step, is picked up and transferred to the standby stage 48 from the mounting stage 48; and, while the third step is being executed, the completed part P3 on the standby stage 49 is collected and the first step is executed.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008246298-A (JP)
Title: Superfine grain grinder
Inventor: SUDO KIYOYUKI
IPC: B02C19/06
Filed: 2007-03-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a superfine grain grinding system capable of taking in raw materials to be crushed and outside air from a supply nozzle side, while eliminating a high-pressure gas pipe or tube, and capable of forming the raw materials to be crushed into a superfine granulated shape at a time in a hollow part of a swirling crushing chamber, air current passage gutter, or the like, with air current from crushing nozzles and supply nozzles with filters.  <P>SOLUTION: The superfine grain grinder has a tank 27, the upper part of which has a cylindrical body casing 28. The body casing 28 has a top cover 28a on its upper side, a bottom ring 28b on its lower side, and intermediate multiple rings 28c having crushing nozzles with filters on its outer peripheral surface between them. The intermediate multilayered ring 28c is constituted by overlaying, e.g. first to fourth four intermediate rings 28c1 to 28c4. The set number of these intermediate rings 28c1 to 28c4 are determined by kinds of the materials to be crushed to be superfinely crushed by the superfine grain grinder.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008251791-A (JP)
Title: Adhesive sheet applying apparatus and method
Inventor: MAEDA TAKESHI
IPC: B65H23/188
Filed: 2007-03-30
Abstract: <P>PROBLEM TO BE SOLVED: To efficiently apply the cut adhesive sheet onto a substrate with use of a plurality of pressing heads against a plurality of applying positions upon cutting an adhesive sheet bonded to one surface of a relesable sheet into a predetermined length.  <P>SOLUTION: An adhesive sheet applying apparatus comprises a sheet length adjusting device for adjusting an interhead sheet length between first and second pressing heads so that other one of a plurality of adhesive sheet pieces is located at a pressing application position of the second pressing head when one of the adhesive sheet pieces is located at a pressing application position of the first pressing head. The adjusting device includes an adjusting roller supported to transport a releasable sheet for adjusting the interhead sheet length by varying the position of the rotary shaft of the adjusting roller, and a sheet inverter for contacting the releasable sheet side of the adhesive sheet with the adjusting roller by inverting the front and back sides of the releasable sheet between the pressing application position and the adjusting roller.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008251943-A (JP)
Title: Pull-out shelf
Inventor: MATSUDA SHINJI
IPC: H05K7/18
Filed: 2007-03-30
Abstract: <P>PROBLEM TO BE SOLVED: To solve the problem, wherein regarding a pull-out shelf for facilitating mounting or removal of various devices in a rack used for housing the devices, in order to prevent a device from being moved by push-button operation or the like or from falling by vibration during operation or earthquake, legs of the device are fixed conventionally by leg fixing brackets but since there is a need for adjusting the positioning for each leg fixing bracket in lateral and longitudinal directions to meet leg positions, much time and effort may be required for positioning.  <P>SOLUTION: The pull-out shelf, in which at the front side and the rear side of a device placing surface 5, device leg fixing bracket positioning members 6a and 6b are disposed so as to be movable back and forth, is provided with positioning fixing mechanisms 7. At both ends of the positioning members 6, device leg fixing brackets 8 are disposed movable horizontally, and positioning fixing mechanisms 9 are provided.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008250221-A (JP)
Title: Methods for manufacturing thinner composition, semiconductor device, and the like
Inventor: SANUKI HIDEAKI
IPC: C11D3/43
Filed: 2007-03-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide methods for manufacturing a thinner composition that has superior solubility with respect to a composition containing cyclic olefin polymers and is superior in drying characteristics, and a semiconductor device or a flat display device having a process for cleaning an object to be cleaned, to which a composition containing cyclic olefin polymers is attached, using a thinner composition.  <P>SOLUTION: The methods manufacture a thinner composition for removing a composition containing cyclic olefin polymers containing two kinds of alcohol ether and two kinds of alcohol ester, and a semiconductor device or a flat display device, and have a process for cleaning an object to be cleaned to which a composition containing cyclic olefin polymers is attached, using the thinner composition.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008257871-A (JP)
Title: Battery pack
Inventor: ENARI MASAYUKI
IPC: H01H9/54
Filed: 2007-03-30
Abstract: <P>PROBLEM TO BE SOLVED: To enable a plurality of remaining amounts of batteries to be efficiently checked and to assure viewability of display of the remaining amounts.  <P>SOLUTION: A battery pack comprises: a display unit 121 for displaying a remaining capacity of a battery; a remaining amount display switch 122 for turning on the display unit 121; detection means 123 for detecting a press state of the remaining amount display switch 122; and control means 124 for switching a display state of the display unit 121 in accordance with the time period of pressing of the remaining amount display switch 122.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008258197-A (JP)
Title: Process for fabricating piezoelectric element and process for manufacturing liquid ejection head
Inventor: TSUKAMOTO TATSUJI
IPC: H01L41/318
Filed: 2007-03-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a process for fabricating a preferable piezoelectric element by epitaxial growth method such as sputtering or orientation growth method, and to provide a process for manufacturing a liquid ejection head.  <P>SOLUTION: A lower electrode 14 is formed on the upper surface 12 of a substrate 10, a piezoelectric film 16 is deposited on the lower electrode 14 by sputtering and an upper electrode 18 is formed on the upper surface of the piezoelectric film 16. An electric field is applied to the piezoelectric film by applying a positive voltage to the upper electrode 18 with the lower electrode 14 as the ground under a temperature environment above 100°C and below the Curie point. After holding that state for one minute or longer, the temperature is lowered below 70°C and then the electric field is released. Polarization takes place in a direction from the lower electrode 14 toward the upper electrode 18 during deposition of the piezoelectric film 16 but since the direction of polarization of the piezoelectric film 16 is reversed through a step for reversing polarization, the piezoelectric element 20 can be deformed in the ejecting direction by applying a positive voltage to the upper electrode 18 with the lower electrode 14 as the ground.  <P>COPYRIGHT: (C)2009,JPO&INPIT