baber/WOPTO huggingface dataset:
Patent JP-H0696273-A (JP)
Title: Recognition field retrieving method in business form reader
Inventor: MORITA MASAYUKI
IPC: G06K9/20
Filed: 1992-09-17
Abstract: PURPOSE:To obtain the recognition field retrieving method which can cope with even a deflection in the course of carrying a business form by reading out image data from an image memory vertically to the longitudinal direction of the business form. CONSTITUTION:The left end edge position (3) of a business form S corresponding to a position of a recognition field I1 is detected. Subsequently, a position (4) in which it ascends by X bits from (3), is obtained and also, a position (5) in which it descends by X bits, is obtained. The position (3) is subjected to scanning along a direction line (2) being vertical to a base point against a line for connecting the positions (4), (5), retrieval of an entered character in the field I1 is executed, and positioning of a detected character is executed. In such a way, when scanning for retrieving a character is executed, scanning being vertical to the left end edge can be executed, and even if a deflection is generated to some extent in the business form on the way of carrying, it does not occur that a recognition field position recognized by a host and an actual recognition field position are shifted greatly, and probability of being rejected decreases.
Patent JP-H0295627-A (JP)
Title: Paper sheet takeup and accumulation device
Inventor: KUBO ICHIRO
IPC: G07D11/00
Filed: 1988-09-30
Abstract: PURPOSE:To control a pressure between a takeup and accumulation roller and a paper sheet properly by providing a pressure sensor at a takeup and accumulation part of a takeup and accumulation device for bank notes or the like, and controlling the motion of a pressure plate by a fuzzy control part based on an output of the sensor. CONSTITUTION:The subject device is provided with a pressure plate 2 for pressing a paper sheet 1 to a takeup and accumulation part, and a means to control the motion of the pressure plate 2. In addition, this takeup and accumulation device has a pressure sensor 8 at the takeup and accumulation part for bank notes or the like for detecting a pressure between a takeup and accumulation roller 3 and the paper sheet 1, and a fuzzy control part provided for performing fuzzy inference based on a signal from the pressure sensor 8 and outputting a motion control signal for the pressure plate 2. The pressure between the takeup and accumulation roller 3 and the paper sheet 1 is detected constantly, therefore, by the pressure sensor 8 at the takeup and accumulation part in this device. The signal of the sensor 8 is inputted to the fuzzy control part, and the motion of the pressure plate 2 is controlled to make the pressure proper.
Patent JP-H0697271-A (JP)
Title: Wafer carrier
Inventor: OKUMA YUJI
IPC: B65D85/00
Filed: 1992-09-17
Abstract: PURPOSE:To provide a wafer carrier which is improved so as to decrease processing liquid in usage by lessening a wet processing tank in width, where wafers are housed in the wafer carrier as arranged in an upright position when they are subjected to a batch process such as a chemical liquid process. CONSTITUTION:Wafers 2 are housed in a wafer carrier in an upright position, and a carrier moving handle 3 is provided along each top of a front and a rear side wall 2 in parallel with the surfaces of the wafers 2, where the length W of the carrier moving handle 3 is set smaller than the diameter of the wafer 2.
Patent JP-2000082358-A (JP)
Title: Whole direction detection type cable switch
Inventor: HOSHIKAWA KIYOUFU
IPC: H01H13/52
Filed: 1998-09-02
Abstract: PROBLEM TO BE SOLVED: To certainly carry out a switching action and realize a bent wiring and a wide range of utilization by a light touch from all directions by inserting a conductive wire to two parallel conductive rubbers clamping a three-directional branched gap having an arrow shape and filled. SOLUTION: Three conductive rubbers 3a, 3b, 3c divided to large and small sizes and clamping three direction branched gaps 2a, 2b, 2c of an arrow shape are filled in a plastic insulation outer skin 1 of a circular section, conductive wires 4a, 4b are inserted into parallel conductive rubbers 3b, 3c having a small size and are integrally extruded to obtain a whole direction detection type cable switch 5. A ridgeline angle of a top surface 2d of a gap having an arrow shape is made to 110 deg.. When a detection current flows in the conductive wires 4a, 4b to operate an instrument, if the outer skin 1 is lightly touched from every directions, a portion surface of the conductive rubbers 3b, 3c is contacted directly or through the conductive rubber 3a and a space between the conductive wires 4a, 4b is energized to carry out a switching operation.
Patent JP-S63102882-A (JP)
Inventor: YOMODA MASAHIKO
IPC: B25J9/22
Filed: 1986-10-21
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-2000075074-A (JP)
Title: Armatile and heat sink combined heat removal device
Inventor: KUBOTA YUSUKE
IPC: G21B1/17
Filed: 1998-09-02
Abstract: PROBLEM TO BE SOLVED: To provide an armatile and heat sink combined heat removal device with high heat resistivity raising heat conduction from the armatile to a cooling pipe and capable of improving the heat removal efficiency and simplifying whole structure and lightening. SOLUTION: The title device has a combined armatile heat sink member 13 with one body structure of the armatile part 11 and heat sink part 12. A cooling pipe 15 is placed in between the heat sink part 12 and a back plate 14. The armatile and heat sink combined heat removal device has an integrated structure by pinching a super graphite sheet 18 between the heat sink part 12 and the cooling pipe 15.
Patent JP-H0966244-A (JP)
Title: Method and equipment for recycling surplus soil
Inventor: HASEGAWA YOICHI
IPC: B02C19/00
Filed: 1995-09-01
Abstract: PROBLEM TO BE SOLVED: To regenerate surplus soil into backfilling earth or the like and recycle the same by screening the surplus soil from a civil engineering work site into earth and sand, concrete cinders for regeneration and waste, crushing the waste and mixing the concrete cinders and the like with earth and sand. SOLUTION: Surplus soil 5 containing concrete cinders and stones dug out of a civil engineering work site is screened into earth and sand, concrete cinders 11 of lumps of given dimension or smaller for regeneration, waste concrete cinders 12 of lumps larger than the given dimension and the like by a screen 7A or the like. The waste concrete cinders 12 are crushed by a crusher 9, and the screened again by the screen 7A or the like. Then the concrete cinders 11 for regeneration is mixed with earth and sand by the given ratio and regenerated into backfilling earth or banking earth.
Patent JP-H0888107-A (JP)
Title: Fuse resistor
Inventor: TAKEUCHI NOBUYUKI
IPC: H01C1/02
Filed: 1994-09-16
Abstract: PURPOSE: To provide a fuse resistor which is blown reliably by prescribed electric power and in which an irregulairy in characteristics is hard to generate. CONSTITUTION: A fuse-resistor body 11 is provided in such a way that caps 17, 17 are attached to both ends of a resistor 13 in which the outer circumferential face of a ceramic rod is plated with a resistor film 15 and that lead out wires 21, 21 are attached to both caps 17, 17. The fuse-resistor body 11 is housed inside a cylindrical case 31. Two partition plates 41, 41 as plate bodies whose shape nearly shut openings 33, 33 at both ends of the case 31 and in which holes passing the derivation lead wires 21, 21 have been made in their center are prepared. The lead-out wires 21, 21 are inserted into the holes in both partition plates 41, 41, and both partition plates 41, 41 are pushed from the openings 33, 33 in the case 31 to their inside by prescribed distances K.  Resin materials 51, 51 are felled into spaces between the partition plates 41, 41 and the openings 33, 33 in the case 31 so as to seal the inside.
Patent JP-S60134179-A (JP)
Inventor: YAMAMOTO NORIMASA
IPC: F25D23/02
Filed: 1983-12-23
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H0886583-A (JP)
Title: Heat exchanger
Inventor: NAGAI TOSHITAKE
IPC: F28F1/00
Filed: 1994-09-16
Abstract: PURPOSE: To improve the heat exchanging efficiency by reducing the uneven flow of refrigerant in a heat exchanger. CONSTITUTION: This heat exchanger 1 comprises a refrigerant tube 4 provided through a plurality of fins 3. The tube 4 is partitioned to a plurality of sets S1-S3 formed of a plurality of parallel tubes 6, 7. The tuber 6, 7 of the sets S1, S2 communicate with each other at the ends, and communicate with the ends of the tubes 6, 7 of the other sets S2, S3 at a single passage 2P.
Patent JP-S60142006-A (JP)
Title: Intake/exhaust unit of internal-combustion engine
Inventor: KANOU SHINZOU
IPC: F01L7/02
Filed: 1983-12-28
Abstract: PURPOSE:To improve the simplification of a valve drive mechanism and its follow-up performance at the time of high-speed rotation by employing a rotating valve as an intake/exhaust valve. CONSTITUTION:A cylinder head 2 is provided with cylindrical valve elements 3, 4, and the continuity from the combustion chamber to an intake hole 5 and an exhaust hole 6 is controlled by means of rotating these valve elements 3, 4 synchromously with the engine. In this way, fan-shaped openings 8, 9 are formed on the peripheral surface of the valve elements 3, 4, and, in the state that the valve elements 3, 4 are fixed to the engine, the valve open/close time can be controlled by adjusting the valve elements 3, 4 with respect to the direction of the shaft. In addition, there is no necessity for a valve spring required for a tappet valve, the fuel cost is decreased, and the valve drive mechanism can be simplified and its follow-up performance can be improved.
Patent JP-H1186536-A (JP)
Title: Semiconductor storage device
Inventor: NAKAI JUN
IPC: G11C5/14
Filed: 1997-09-12
Abstract: PROBLEM TO BE SOLVED: To realize a DRAM(dynamic random access memory) shallowing a substrate voltage in its level at the time of a disturb test mode and a self refresh mode without increasing an area penalty. SOLUTION: This storage device is provided with a switch circuit 40 activating a shallow level detector 38 and inactivating a deep level detector 36 when a disturb test signal TESTUBBS or a self refresh signal/BBU is activated. Thus, the shallow level of substrate voltage VBB equal to the detection level of the shallow level detector 38 is generated by a substrate voltage generation circuit 34 not only at the time of the disturb test mode, but also at the time of the self refresh mode.
Patent JP-S62109442-A (JP)
Title: Pulse transmission system
Inventor: JINGUU TAKASHI
IPC: H04L25/38
Filed: 1985-11-08
Abstract: PURPOSE:To simplify the constitution of a pulse transmission system by controlling two terminal equipments with a single interface circuit. CONSTITUTION:Two terminal equipments A and B are connected to a master device M via a pulse transformer T. Then the device M sends a pulse having the same polarity between the start and stop bits to the equipment A. Thus the terminal A receives the pulses of the same polarity. While the data pulse which is sent back to the device M from the equipment A has the same polarity as that of the dta pulse received from the device M. The master M receives the pulse of the same polarity as that of the data pulse sent from the equipment A. Then the device M sends the pulse of the adverse polarity to the data pulse sent to the terminal A to the equipment B. Thus the equipment B receives the pulse of the adverse polarity to the data pulse sent from the device M since the equipment B is connected to the master M so that the polarity of the pulse is adverse in the device M. The polarity of the pulse received by the equipment B has the same polarity as the pulse which is received by the equipment from the device M.
Patent JP-H0590314-A (JP)
Title: Resin molding method of semiconductor
Inventor: MATSUMURA KEIZO
IPC: B29L31/34
Filed: 1991-09-27
Abstract: PURPOSE:To provide a resin molding method of a semiconductor which enables improvement of quality to a molding by a non-injection method in a formation method of a semiconductor element such as an IC and an LSI. CONSTITUTION:After an upper package part 5 and a lower package part 6 are formed by pressurizing and molding at a temperature which does not attain a molding temperature respectively by an upper package mold 1 and a lower package mold 2, a semiconductor element 10 is held therebetween without releasing from a die and molding is carried out at a molding temperature thereafter. Thereby, utilization of resin by gate runnerless can be improved, a thin and large area package can be formed, and wire falling and void can be prevented.
Patent JP-H1190764-A (JP)
Title: Slide cover device
Inventor: HAYASHI TAKEHIKO
IPC: B23Q11/08
Filed: 1997-09-12
Abstract: PROBLEM TO BE SOLVED: To simplify structure by eliminating any actuator other than the actuator for opening and closing a movable cover in a device involving a plurality of movable covers of extendable structure. SOLUTION: This slide cover device is provided with a first movable cover 44 and a second movable cover 46 of extendable structure which is opened and closed by sliding operation. An actuator 60 for opening and closing the first movable cover 44 is formed, and at a space between both the movable covers 44, 46, an interlocking mechanism 64 is formed, which opens and closes the second movable cover 46 by interlocking with the opening and closing operation of the first movable cover 44. The second movable cover 46 opens and closes through the interlocking mechanism 64 which interlocks with the opening and closing operation of the first movable cover 44 by the actuator 60.
Patent JP-2001077153-A (JP)
Title: Substrate, connection structure, and manufacturing method of the substrate
Inventor: NIIMI AKIHIRO
IPC: H01L23/12
Filed: 1999-09-02
Abstract: PROBLEM TO BE SOLVED: To provide a connection structure for connecting an IC chip to a substrate, in which re arrangement of pads is realized on a chip level, while a variation in circuital characteristics is prevented. SOLUTION: An IC chip 1, with a plurality of pads 4 formed on one face 1a and a wiring substrate 10 with a plurality of substrate lands 13 formed on one face 10a are provided with their faces 1a and 10a placed opposite to each other. The pads 4 and the substrate land 13 are connected via a plurality of metallic bumps 5 and 6 which project from the one face 1a of the IC chip 1. At least one of bumps 5 and 6 it constituted as a different location bump 6, formed on a protective film 3 at a position different from the pad 4 on the side of one face 1a. Then, a pad 4b and a substrate land 13b at different relative positions are connected electrically via the different location bump 6 and a wire 7 formed through wire-bonding.
Patent JP-H09118561-A (JP)
Title: Production of molded part by compression of ferrite particle
Inventor: GERUTO SHIYURUTSU
IPC: C04B35/632
Filed: 1996-08-30
Abstract: PROBLEM TO BE SOLVED: To impart a shape under slight compressive pressure and to minimize thermal load on compacted parts in the decomposition of an org. additive by adding specified amts. of an org. binder and a wetting agent to ferrite particles and compressing the particles so that the org. additive is subjected to thermal and oxidative decomposition.  
     SOLUTION: An org. binder and a wetting agent are added to ferrite particles by 0.5-1.5wt.% and 1.0-5wt.%, respectively, and the ferrite particles are compressed so that the org. additive is subjected to thermal and oxidative composition to produce the objective compacted parts. Since the amt. of the org. binder is reduced to 0.5-1.5wt.% and the water content of the particles is increased to 1.0-5.0wt.%. relative compressive pressure is reduced to about 70% of the original value. Since the total amt. of heat in the thermal decomposition of the org. additive is extremely reduced by the remarkably reduced amt. of the additive, a harmful sudden temp. change is avoided. 
     COPYRIGHT: (C)1997,JPO
Patent JP-S61127261-A (JP)
Title: Digital talkie testing system
Inventor: OGAWA YASUNORI
IPC: H04M3/50
Filed: 1984-11-26
Abstract: PURPOSE:To prepare for a check in conformity with collation from subscribers by providing in talkie testing set with a memory where data for voice answer testing are storable and a collation circuits where a read output of memory is collated to original data for testing which are transferred through network. CONSTITUTION:A processor 5 (CC) permits a voice answer device 1 to start and input a general message to be checked to one side terminal of collation circuit 72 of talkie testing device 7 by taking a route 2 of network 3(NW) through a talkie trunk 2. Besides it, the processor 5(CC) also inputs data of counter 73 after reading out a memory 71 as an address. The collation circuit 72 checks for both data and confirms designated data. A test result is passed through reception information distribution equipment 6(SRD) to the central processor 5(CC), outputting to a typewriter 9 after all. As regard to data to be checked in the next place, storing them in the memory 71 will be carried out repeatedly.
Patent JP-2001074009-A (JP)
Title: Coupling device
Inventor: OCHIAI NOBUFUMI
IPC: F16B2/22
Filed: 1999-09-02
Abstract: PROBLEM TO BE SOLVED: To provide a coupling device to hardly break, extremely simplify molding, hardly pull off a polygonal shaft, and facilitate mounting of it on another parts. SOLUTION: A coupling device 1 is molded by using a flexible synthetic resin material and provided with a device body 2 approximately in a rectangular shape consisting of a pair of long plates 3 and 5 and a pair of short plates 6 and 7. The long plates 3 and 5 cause pressure contact of the side 11 of a polygonal shaft 10. The short plates 6 and 7 are provided with stopper pieces 12 and 13 regulating such that the polygonal shaft 10 is prevented from movement in a longitudinal direction. The long plates 3 and 5 are provided with respective engaging parts 15 and 16 to engage one side of the polygonal shaft 10. The short plates 6 and 7 are provided with respective mounting parts to mount the device body 2 on another part 31.
Patent JP-H04128040-A (JP)
Title: Polyolefinic multilayered film
Inventor: OKUDAIRA HARUO
IPC: B32B27/32
Filed: 1990-09-18
Abstract: PURPOSE:To provide non-anchor laminate characteristics as a sealant material and to enhance heat sealability by forming a base film layer from a polypropylene type polymer and forming a specific resin composition layer composed of a blend of a three-component or more system to the single surface or both surfaces thereof. CONSTITUTION:A polypropylene type multilayered film 4 is formed by laminating a resin composition layer wherein three components of a low-crystalline or non- crystalline ethylene/alpha-olefin copolymer and/or a propylene/alpha-olefin copolymer (a) specified in density, a polypropylene (b) and an ethylenic polymer (c) are main constituents to the single surface or both surfaces of a base film layer based on a propylene type polymer. This multilayered film 4 is laminated to a base film 1 by melt extrusion using a polyethylene type adhesive 3. Herein, the densities of the constituents of the resin composition are set so that the a-component is 0.85-0.90g/cm<3>, the b-component is 0.89-0.92g/cm<3> and the c-component is 0.91-0.97g/cm<3> and, in order to impart excellent laminate strength, heat sealability and the adhesiveness with the base film layer to the resin composition layer, the compounding amounts of these components are extremely important and the compounding ratio of the components (a), (b), (c) is set to 5-80:10-90:5-60wt.%.
Patent JP-H1098856-A (JP)
Title: Manufacturing method of laminated core
Inventor: NAGASHIMA KIYOSHI
IPC: H02K15/02
Filed: 1996-09-20
Abstract: PROBLEM TO BE SOLVED: To prevent damage on an insulating film due to a burr generated by shearing in a series of steps without particular labor hours. SOLUTION: Core plates are sequentially punched while a plate material is being fed at a constant pitch interval by a series of steps, and the plates are stacked at each predetermined number of the plates. At a second stage, a strip 4 is punched from a lower surface side at a molding position of the first core plates for constituting a lowermost stage of the laminated core, and a first slot hole 6 where a burr is formed at an upper surface side is perforated. At a fourth stage, the strip 4 is punched from an upper surface side at a molding position of the second core plate for constituting uppermost and intermediate stages of the core, and a second slot hole 8 where a second burr is formed at a lower surface side is perforated. At eleventh stage, first and second core plates are molded by outline punching from one direction, and laminated in the order.  The first core plate is disposed at the lowermost stage, the second core plate is disposed at the uppermost stage, and the respective burrs are disposed in a laminated layer.
Patent JP-S63105902-A (JP)
Title: Magnetic powder for magnetic powder type power transmission device
Inventor: SAKUMA KAZUHISA
IPC: F16D37/02
Filed: 1986-10-22
Abstract: PURPOSE:To provide a good power transmission characteristic from an initial period without requiring a pretreatment by mixing specific Co-based amorphous and Fe based amorphous alloy powders at a prescribed ratio and using the resulted powder mixture for a magnetic powder type power transmission device. CONSTITUTION:The soft magnetic metal powder to be used as a medium for this powder transmission is formed of the powder mixture composed of 5-95wt.% Co-based amorphous alloy powder and 5-95wt.% Fe-based amorphous alloy powder. The Co-based alloy powder is the scaly, planar or spherical powder having >=700Hv hardness, <=10 aspect ratio and 20-300mum major axis and has -10X10-6=+10X10<-6> magnetorestriction. The Fe-based alloy powder is the scaly, planar or spherical powder having >=700Hv hardness, <=10 aspect ratio, and 20-300mum major axis and has 2-20atomic% >=1 kinds among Co, Cr, Ni, Mo, and Nb and >=0.8T saturation magnetic flux density.
Patent JP-H0297362-A (JP)
Title: Device for scooping out noodle ball
Inventor: KOMORI NOBUO
IPC: A23L7/109
Filed: 1988-10-03
Abstract: PURPOSE:To obtain a device for scooping out noodle balls, consisting of a boiling device, disperser and weighing device and capable of scooping out the balls of noodles, such as wheat or buckwheat vermicelli, in a prescribed weight. CONSTITUTION:Uncooked noodles are placed in a bucket 12, which is then placed in a boiling vessel 2 of a boiling device 1 and boiled. The resultant boiled noodles are fed to the top of a noodle ball scooping out device 10 with a conveyor 11 and then loosened to 1 to several noodle strips by a disperser 20 consisting essentially of a rotating drum having many movable projections (projections) 26 on the outer periphery thereof. A prescribed amount of the boiled noodles is subsequently separated with a weighing device 50 and a package by a prescribed amount is then formed with a packing device 80.