baber/WOPTO huggingface dataset:
Patent TW-I228543-B (TW)
Title: Pretreatment process for plasma immersion ion implantation
Inventor: BERNSTEIN JAMES DAVID
IPC: H01J37/32
Filed: 2000-12-19
Granted: 2005-03-01
Abstract: A method for use with a plasma immersion ion implantations systems wherein a substrate W having a patterned photoresist P thereon is implanted. The method includes ionizing a first gas in a chamber 12 to produce electrically inactive ions and reacting the electrically active ions with the photoresist P to produce outgassing 64. The outgassed material 64 is continuously evacuated until outgassing is substantially completed. The method further includes ionizing a second gas to produce electrically active ions and implanting a positively charged species of the electrically active ions into the substrate. Also disclosed is a method for curing the photoresist prior to ion implantation. A gas is ionized in the chamber 12 to produce positively and electrons. The electrons are first attracted to a substrate in the chamber having patterned photoresist P thereon for hardening the photoresist. The positively charged ions are then implanted into substrate W wherein photoresist outgassing is substantially prevented.
Patent TW-I233764-B (TW)
Title: Mechanism for manufacturing edge lead angle of gold finger on circuit board
Inventor: CHEN SHU-HUA
IPC: H05K3/00
Filed: 2000-12-19
Granted: 2005-06-01
Abstract: This invention relates to a kind of mechanism for manufacturing edge lead angle of gold finger on circuit board. A circuit board is placed onto a platform, in which the platform makes the circuit board flatly adhere onto the flat surface of one side of a jig to eliminate the tolerance of the circuit board so that the circuit board displays a better degree of flatness. Moreover, there is at least one gold finger disposed on the circuit board corresponding to at least one opening position disposed at the jig. A knife tool is arranged in an angle with reference to the vertical direction of the processing face of the circuit board so that the knife tool can be applied from the other side of the jig through the opening position, and cut the edge of the gold finger to form inclined lead angle vertically leveled of the gold finger.
Patent TW-490765-B (TW)
Title: A process and an integrated tool for low k dielectric deposition including a PECVD capping module
Inventor: PONNEKANTI HARI
IPC: H01L21/316
Filed: 2001-02-07
Granted: 2002-06-11
Abstract: The present invention generally provides a process and an apparatus for depositing low dielectric constant films and low dielectric constant capping layers on a substrate. The low dielectric constant films are mesoporous oxide films formed by depositing and curing a sol gel precursor containing a surfactant to form an oxide film having interconnecting pores of uniform diameter, and then annealing the film in an inert gas atmosphere or exposing the film to an oxidizing atmosphere containing a reactive oxygen species to form a mesoporous oxide film. A preferred mesoporous oxide film is produced by spin-on deposition of a sol gel precursor containing TEOS, water, and a surfactant in an alcohol based solvent on a substrate, curing the sol gel precursor to form a cubic phase film, and then exposing the film to an oxidizing atmosphere. The apparatus of the invention provides a cassette to cassette processing system which processes multiple substrates and combines the advantages of an atmosphere processing module for depositing films, such as dielectric films, with an in-situ vacuum capping module for high quality substrate processing, high substrate throughput and reduced contamination of the process.
Patent TW-498436-B (TW)
Title: Apparatus of processing a sample surface and surface processing method
Inventor: NAKAUNE KOICHI
IPC: H01L21/302
Filed: 2001-02-13
Granted: 2002-08-11
Abstract: This invention relates to an apparatus of processing a sample surface of semiconductor device and a surface processing method. Especially, plasma is employed to perform etching or film-forming process suitable for the surface processing apparatus and surface processing method. The purpose of this invention is to provide a surface processing reactor with a high etching rate ratio of an organic material such as a BARC of anti-reflective film to a resist of mask forming a pattern, that is, a selective ratio is high. The anti-reflective film is a means for forming the pattern with a high accuracy in surface processing of a semiconductor. In the inventive surface processing apparatus is a vacuum vessel, in which plasma is produced and a sample pedestal is installed for plasma surface treatment of the sample, a power supply is used to apply high frequency bias on the sample, a photomask material and anti-reflection film are also used. This surface processing method is characterized by introducing mixture gas of hydrogen gas and deposition gas as the etching gas for surface processing of the above-mentioned sample in the vacuum vessel.
Patent TW-518439-B (TW)
Title: Platform and optical module, manufacturing method of the same, and optical transmission device
Inventor: MURATA AKIHIRO
IPC: G02B6/42
Filed: 2001-04-04
Granted: 2003-01-21
Abstract: The present invention provides a platform and optical module, manufacturing method of the same, and optical transmission device, which will not form protrusions due to wiring. The method of manufacturing a platform comprising the steps of providing an interconnecting lines 20, 22 adhered to and allocated in the first and second regions of a mold 10; disposing a pin 32 with a tip facing the mold 10; sealing the pin 32 and interconnecting lines 20, 22 with a molding material 40; curing the molding material 40; removing the pin from the molding material to form a through hole 44; and removing the molding material 40 together with the interconnecting lines 20, 22 from the mold 10.
Patent TW-527209-B (TW)
Title: Process and apparatus for treating contaminated gas
Inventor: LIN SHU-SUNG
IPC: G05D21/02
Filed: 2001-04-12
Granted: 2003-04-11
Abstract: The present invention provides a process and apparatus for treating contaminated gas. A contaminated gas containing volatile organic compounds is introduced into a reactor continuously, so as to allow the gas to contact with a metal oxide catalyst and an oxidant for a period of time. The concentration of the volatile organic compound can be thus decreased. Then, the treated gas is expelled from the reactor continuously. The concentration of the organic compounds of the expelled gas and/or the concentration of the oxidant are continuously monitored, and the oxidant amount to be fed is controlled according to the monitored concentration. During the treatment, the temperature of the contaminated gas is raised to be higher than the temperature of the gas before treatment by 5 DEG C to 70 DEG C. By means of the process of the present invention, volative organic compounds-containing waste gas with high humidity can be effectively treated, and the utility ratio of the oxidant can be increased.
Patent TW-538162-B (TW)
Title: Fibrous aggregate forming method, fibrous aggregate formed by said method, and fibrous aggregate forming apparatus
Inventor: YAMAMOTO HAJIME
IPC: D04H1/542
Filed: 2001-04-13
Granted: 2003-06-21
Abstract: A forming method for a fiber aggregate in which fibers are heated to be welded with each other, the method includes a heating step of applying upward heated air to a bottom of a block of the fibers to pass the heated air therethrough and to cause the block of fibers to float, wherein at least parts of fibers are melted while the block of the fibers float; a compression step of compressing substantially in a vertical direction the heated block of fibers into a desired height; and a cooling step of cooling the compressed block of fibers to solidify melted portions of the fibers at portions where the fibers intersect with each other.
Patent TW-507419-B (TW)
Title: Fault simulation method and fault simulator for semiconductor integrated circuit
Inventor: ISHIDA MASAHIRO
IPC: G01R31/28
Filed: 2001-06-18
Granted: 2002-10-21
Abstract: A transient power supply current testing technique that affords a high level of observability is used to prepare a list of detectable faults including a delay fault, an open circuit fault, a path delay fault and test pattern sequence. A test pattern sequence (202) formed by two or more test patterns is obtained. Through the use of a transition simulation, a train of transition signal values (203) that occurs on various signal lines within the circuit when the pattern sequence is applied to operate IC under test is determined. In addition, the train of transition signal values occurring on various signal lines is adopted when the IC under test is operated to use the pattern sequence for preparing a detectable fault list (204) through the transient power supply current test.
Patent TW-514976-B (TW)
Title: Method for processing semiconductor wafer and semiconductor wafer
Inventor: NIHONMATSU TAKASHI
IPC: H01L21/306
Filed: 2001-06-28
Granted: 2002-12-21
Abstract: In a method for processing a semiconductor wafer which comprises chamfering, lapping, etching, and mirror-polishing, the etching is alkali etching and then acid etching. The acid etching is executed with an acid etchant consisting of hydrofluoric acid, nitric acid, phosphoric acid, and water. In a method for processing a semiconductor wafer which comprises chamfering, surface grinding, etching, and mirror-polishing, the etching is executed as mentioned above. In a method for processing a semiconductor wafer which comprises planarizing, etching, and mirror-polishing, the etching is executed as mentioned above, and the mirror-polishing is executed by the acid etching, back polishing, and then surface polishing. Thus a semiconductor wafer which improves in the flatness, the surface roughness, and the condition of the wafer back is provided.
Patent TW-518467-B (TW)
Title: Data processing device and data processing method in connection with network capable of connecting with multiple machines and memory medium therefor
Inventor: SATO NAOYUKI
IPC: H04L12/46
Filed: 2001-07-10
Granted: 2003-01-21
Abstract: The object of the present invention is to provide a device that allows the node of another bus to retrieve a reserve owner via a bridge, in the case that a bus reset occurs to the bus to which the reserve owner is connected when reservation has been made on, e.g. an IEEE1394 serial data bus or the like via the bridge. To solve the problem, a controller A transmits its own EUI (extended unique identifier)-64 to a reserved target. Then, the target stores information of its part or all functions that is reserved and the EUI-64 of a device (node) having reserved its use. When a controller B reserves the target, the controller B reads the EUI-64 of the server owner from the target, discriminates whether the reservation is available and writes its own EUI-64 to the target, when reservation is available.
Patent TW-497238-B (TW)
Title: Semiconductor device
Inventor: TANAKA NAOTAKA
IPC: H01L23/12
Filed: 2001-07-13
Granted: 2002-08-01
Abstract: In order to realize a semiconductor device having high reliability of electric connection between each bump pad formed on LSI chip and each electrode pad formed on the wiring board within an guaranteed temperature range, a line thermal-expansion coefficient of the adhesive 3 is made in the range of 20 to 60 ppm and an elastic modulus of the build-up member 6 is in the range of 5 to 10 Gpa. In addition, the build-up portion (6) is constituted by a multi-layer build-up substrate with its peak value (a glass transition temperature) of loss coefficient existing within a range of 100 DEG C to 250 DEG C. and not existing within the range of 0 DEG C to 100 DEG C. By setting the physical properties in the manner stated above, it is possible to realize a semiconductor device capable of assuring high reliability of the electric connection between the bump pads 2 formed on the LSI chip 1 and the electrode pads 4 on the wiring substrate 5 within a guaranteed temperature range.
Patent TW-544525-B (TW)
Title: Sensor for the detection of the direction of a magnetic field
Inventor: POPOVIC RADIVOJE
IPC: H02K29/08
Filed: 2001-08-02
Granted: 2003-08-01
Abstract: A sensor for the detection of the direction of a magnetic field comprises one single magnetic field concentrator with a flat shape and at least a first horizontal Hall-effect element and a second horizontal Hall-effect element, whereby the Hall-effect elements are arranged in the area of the edge of the magnetic field concentrator. Within its environment, the magnetic field concentrator alters the course of the field lines of the magnetic field and, in particular, has the effect that the field lines which, in the absence of the magnetic field concentrator would run parallel to the surface of the Hall-effect elements penetrate the Hall-effect elements almost vertically to their surface. Instead of horizontal Hall-effect elements, vertical Hall-effect elements can also be used when they are arranged beside the magnetic field concentrator. The sensor is particularly suitable as an angle sensor.
Patent TW-503621-B (TW)
Title: Noise-shaped digital frequency synthesis
Inventor: SHEEN TIMOTHY W
IPC: H03M3/02
Filed: 2001-08-07
Granted: 2002-09-21
Abstract: A clock generator for automatic test equipment employs an improved technique for generating clock signals from a reference clock. To generate a desired clock signal, a clock generator produces a time-quantized signal having a period equal to an integer number of reference clock periods and equal to the desired clock period, plus or minus a quantization error. For each cycle of the desired clock signal, a noise-shaping requantizer processes the quantization error to generate noise-shaping signals. The noise-shaping signals then establish delay values of a variable pipeline delay. The variable pipeline delay adjusts each period of the time-quantized signal by an integer number of reference clock cycles, based upon the noise-shaped signals. The effect of noise shaping the quantization error and selectively delaying the time-quantized signal is to shift jitter in the time-quantized signal from relatively low frequencies to relatively high frequencies. A phase-locked loop can then be used to filter the remaining high-frequency jitter.
Patent TW-503120-B (TW)
Title: Distillation system with individual fractionation tray temperature control
Inventor: YOUNG LI
IPC: B01D3/20
Filed: 2001-08-28
Granted: 2002-09-21
Abstract: The present invention is a distillation system with individual fractionator tray temperature control, with the use of either a heating element or a cooling element, and in some preferred embodiments, the use of both a heating element and a cooling element in a plurality of fractionator trays. There is at least, and typically more than one distillation column having a plurality of fractionation trays, and having feed input, liquid removal, and vapor removal with the plurality of trays including at least one of a heating element and a cooling element. Controls are included for separate control of each of the heating element(s) and/or said cooling element(s). These controls may be regulated by a programmable microprocessor, and feedback from temperature sensors may be employed to provide discrete tray-by-tray temperature controls.
Patent TW-517041-B (TW)
Title: Direct acting vertical thermal actuator
Inventor: WEAVER BILLY LEE
IPC: B81B3/00
Filed: 2001-08-28
Granted: 2003-01-11
Abstract: A micrometer sized, single-stage, vertical thermal actuator capable of repeatable and rapid movement of a micrometer-sized optical device off the surface of a substrate. The vertical thermal actuator is constructed on a surface of a substrate. At least one hot arm has a first end anchored to the surface and a free end located above the surface. A cold arm has a first end anchored to the surface and a free end. The cold arm is located above the hot arm relative to the surface. A member mechanically and electrically couples the free ends of the hot and cold arms such that the member moves away from the substrate when current is applied to at least the hot arm. The hot arm can optionally include a grounding tab to minimize thermal expansion of the cold arm.
Patent TW-521364-B (TW)
Title: Manufacturing method of semiconductor device
Inventor: HAMAMOTO MASATO
IPC: H01L21/822
Filed: 2001-08-30
Granted: 2003-02-21
Abstract: A manufacturing method of a semiconductor device capable of obtaining highly reliable semiconductor devices with the realization of high integration and high speed is provided. The solving means is described in the following. During the processes after a desired circuit including a CMOS static type circuit is formed on a semiconductor substrate until product shipment, the first operation, which feeds a predetermined input signal to the circuit and retrieves the first output signal corresponding to it, and the second operation, which gives an operating condition of increasing an ON resistance value of MOSFET constituting the CMOS static type circuit and retrieves the second output signal corresponding to the condition, are conducted. A testing process of determining a failure is conducted based on the difference between the first output signal and the second output signal.
Patent TW-565747-B (TW)
Title: Polymers, resist compositions and patterning process
Inventor: HATAKEYAMA JUN
IPC: C08F212/14
Filed: 2001-09-06
Granted: 2003-12-11
Abstract: A polymer having fluorinated vinyl phenol units copolymerized with acrylonitrile units has high transmittance to VUV radiation. A resist composition using the polymer as a base resin has high sensitivity and resolution to high-energy radiation and good plasma etching resistance and is suited for lithographic microprocessing.
Patent TW-530336-B (TW)
Title: Lithographic method and lithographic apparatus
Inventor: VAN DEN BROEKE DOUGLAS JOSEPH
IPC: G03F1/00
Filed: 2001-09-13
Granted: 2003-05-01
Abstract: A device manufacturing method, comprising the steps of: providing a substrate that is at least partially covered by a layer of radiation-sensitive material; providing a projection beam of radiation using a radiation system; using patterning means to endow the projection beam with a pattern in its cross-section; projecting the patterned beam of radiation onto a target portion of the layer of radiation-sensitive material, wherein, for a given pattern, each target portion is exposed in at least a first step and a second step, whereby the coherency of the radiation during the first step is selected to be different to that during the second step.
Patent TW-522241-B (TW)
Title: Apparatus for inspecting display board or circuit board
Inventor: OKUNO TOSHIO
IPC: G01R31/02
Filed: 2001-10-16
Granted: 2003-03-01
Abstract: The subject of the present invention is to enable exchange of a display board or a circuit board generally in an occupation space at the time of inspection of a board so as to eliminate the need of a side space, which is conventionally needed for use in exchange, and to greatly miniaturize the apparatus for inspecting a display board or a circuit board. The solving means is described in the following. For the apparatus for inspecting a display board or a circuit board P, in which an inspection terminal 4 of an inspection probe block B is pressed to contact with an electrode pad 3 of a display board or a circuit portion P for inspection, the probe block supporting frame member 2 is formed to have a structure capable of being expanded and shrunk. The probe block supporting frame member 2 is expanded and a board supporting frame member 1 is relatively advanced. By the relative advancement, the display board or the circuit board P is caused to protrude forward of a distal end of the terminal 4 of the probe block B through an enlarged opening portion 16 of the probe supporting frame member 2, so that the display board or the circuit board P supported on the board supporting frame member 1 can be exchanged.
Patent TW-525002-B (TW)
Title: System of increasing assembling precision and yield for fiber ferrule and its tool
Inventor: TUNG CHAO-NIEN
IPC: G02B6/36
Filed: 2001-11-06
Granted: 2003-03-21
Abstract: The present invention provides a system of increasing assembling precision and yield for fiber ferrule and its tool, in which precise ceramic adjusting axis almost same as a fiber core is produced by five steps of ceramic powder preprocess, ceramic powder activating process, embryo formation, sintering thermal process, and high-precision grinding process. This ceramic adjusting axis has the excellent advantages of easy formation, high rigidity, high wear-resisting, high toughness, and not adhering to metal. After a fiber ferrule adjusting machine uses the ceramic adjusting axis to adjust the inner hole dimension of the fiber ferrule of the base and the concentricity, the rebound effect of the metal deformed by force is utilized to make the common difference dimension and true centricity of the inner hole of the fiber ferrule have a precision almost the same as the ceramic adjusting axis, thereby increasing the tightness between the fiber and the inner hole of the fiber ferrule, maintaining concentricity and avoiding signal loss in light transmission.
Patent TW-508749-B (TW)
Title: Multi-chip module package of ceramic substrate with heat conductive plug and its manufacturing process
Inventor: HUNG GUO-JI
IPC: H01L21/77
Filed: 2001-12-07
Granted: 2002-11-01
Abstract: There is provided a manufacturing process for multi-chip module package of ceramic substrate with heat conductive plug, which comprises: forming a plurality of electrically conductive holes and a plurality of heat conductive holes on a green compact; then, filling a metal ink paste into the electrically conductive holes and heat conductive holes; then stacking the green compact to make the metal ink pastes in adjacent electrically conductive holes of the green compact come into touch with each other, and the metal ink pastes in adjacent heat conductive holes of the green compact come into touch with each other; next, sintering the green compact and metal ink paste to form a prototype substrate, wherein the prototype substrate includes an insulating body, a plurality of heat conductive plugs and a plurality of electrically conductive plugs; next, respectively forming a metal film on the front and back surfaces of the substrate; then, patterning the metal film to form a plurality of chip pads and a plurality of wires; next, adhering a plurality of chips to the chip pads; and electrically connecting the chips and wires by wire bonding.
Patent TW-522137-B (TW)
Title: Transporting device capable of climbing and descending steps
Inventor: CHIU JIA-JIUN
IPC: A61G1/02
Filed: 2001-12-13
Granted: 2003-03-01
Abstract: Disclosed is a transporting device capable of climbing and descending steps and carrying various articles thereon, comprising: a machine chassis, a two-DOE planetary gear transmission mechanism and driving mechanism provided beneath the machine chassis. When the transporting device travels on the ground, the output of the transporting device is dependent on the driving wheel driven by the transmission mechanism that is driven by the driving mechanism. When the transporting device climbs upwards in steps, the wheel is stopped by the obstruction of the steps, such that force is output by the planetary support through the transmission mechanism that results in the movement of straddling over the steps. When the transporting device descends downwards in steps, the driving mechanism drives the driving wheel, such that the transmission mechanism automatically selects that output via an energy-conserving link thereby achieving the descending movement. When the transporting device travels on level ground, the driving mechanism drives the driving wheel such that planetary support is immobile while the force is output by the wheel through the transmission mechanism thereby achieving the advancement on level ground.