baber/WOPTO huggingface dataset:
Patent JP-S63316447-A (JP)
Title: Mounting structure of semiconductor integrated circuit
Inventor: NAKANO FUMIO
IPC: H01L21/60
Filed: 1987-06-19
Abstract: PURPOSE:To prevent the breakage due to thermal fatigue at a soldered connection part and to reduce a thermal stress exerted on a fine wiring part formed on an LSI chip by a method wherein a shear modulus of elasticity of a resin for a resin layer is made to be smaller than that of a low-melting alloy constituting a solder bump and its coefficient of thermal expansion is made to be nearly equal to that of the low-melting alloy. CONSTITUTION:After an LSI chip 2 where solder bump 3 are formed has been connected to and mounted on a substrate 5 by a flip-chip method, gaps around the solder bumps are filled with a resin 4 and are protected. During this process, the gaps are filled with the resin whose modulus of longitudinal elasticity is less than 1000kg f/mm<2> at the normal temperature, especially preferably in a range of 10-900kg f/mm<2>, and whose coefficiently of thermal expansion is in a range of 20-30X10-<6>/ deg.C at the normal temperature. Because the optimum resin of this kind is used, a multilayer wiring part of an aluminum thin film formed on a face of the LSI chip whose strength is weak is not broken down in an early stage; a characteristic of thermal fatigue is improved.
Patent JP-H0316100-A (JP)
Title: Semiconductor integrated circuit
Inventor: ISHII TAKASHI
IPC: H01L21/822
Filed: 1989-06-13
Abstract: PURPOSE:To remarkably shorten the test time by reading out simultaneously one of values of a first memory and a first comparing circuit, or values of a second memory and a second comparing circuit. CONSTITUTION:The semiconductor integrated circuit is provided with means 2, 8 and 7 for writing directly data to memories 3, 4 from the outside, and means 9, 10 for reading out simultaneously the data written in the memories 3, 4 and outputs of comparing circuits 5, 6 to the outside. In this state, at the time of a memory write test, data given from the outside through a data input part 2 is written in a first memory 3 or a second memory 4. Also, at the time of a memory read-out test, one of a value of a first memory 3 and a value or a first comparing circuit 5, or values of a second memory 4 and a second comparing circuit 6 is selected by a selecting circuit 9, and sent out to the outside from a data output part 10. Accordingly, by only giving a single read-out instruction, the contents of the memories 3, 4 and output values of the comparing circuits 5, 6 can be read out simultaneously. In such a way, the time required for a read-out test can be shortened remarkably.
Patent JP-S624437-A (JP)
Inventor: TORUBEN ENKEGAARUTO
IPC: F27D15/02
Filed: 1986-06-27
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S5578198-A (JP)
Title: Linking structure of fan with motor
Inventor: FUKUSHIMA MASAFUMI
IPC: F04D29/66
Filed: 1978-12-06
Abstract: PURPOSE: To improve the noise level by fitting the boss of a fan or a rotary shaft with an inertia governor in order to keep away the oscillating resonance from a particular frequency.  
     CONSTITUTION: A motor rotor shaft 1a is connected to the boss 8 of the fan 6 fitted with vibro-isolating rubber 7. The vibration in the blower shaft system of an air harmonizer is mess-controlled by attaching the inertia governor 9 in the shape of a disk to the motor rotor shaft 1a, thus it is possible to adjust the oscillating resonance in the blower shaft system to a particular frequency. Therefore, quiet and gentle ventilation can be obtained because the oscillation responding characteristics are improved by the inertia governor 9, with a simple constitution. 
     COPYRIGHT: (C)1980,JPO&Japio
Patent JP-S6129591-A (JP)
Title: Thermal recording method
Inventor: ENMANJI KIMIE
IPC: B41M5/50
Filed: 1984-07-19
Abstract: PURPOSE:To obtain a thermal recording method which enables easy image fixing and provides high image stability and sensitivity by heating a thermal recording body consisting of a nitrocellulose support and a double-chain DNA which is impregnated in the former, changing said DNA to a single-chain DNA and dying this DNA. CONSTITUTION:Moisture-absorbing agent containing H2O, double-chain DNA and Cu<2+> are impregnated into a porous nitrocellulose support having 0.1-10mum mircopores, thus preparing a thermal recording medium. Copper chloride or copper sulfate is used as Cu<2+> and 0.4-1.0mol of Cu<2+> is added to 1mol of phosphorous acid of DNA. In addition, H2O is contained in a moisture-absorbing agent e.g. lithium chloride and calcium bromide and 0.1-10pts.wt. of said agent are used for DNA and Cu<2+>. This recording medium is to be heated and DNA of the heated part to be changed to a single-chain DNA. Then this DNA is to be adsorbed into the nitrocellulose support and the support to be water-washed to wash out double-chain DNA. Next, the support is to be immersed into a 0.01- 5% ethydium bromide solution to dye single-chain DNA and fix the dye.
Patent JP-S5853813-A (JP)
Title: Magnetic core
Inventor: AKACHI YOSHIAKI
IPC: H01F38/42
Filed: 1981-09-25
Abstract: PURPOSE:To obtain a magnetic core having an inductance value which is large in the region of a low current, but becomes small in the region where the current has a constant value, and becomes constant thereafter, by a constitution wherein laminated magnetic bodies being different in the volume ratio, having two kinds or more magnetic characteristics and being formed of an amorphous alloy, are arranged in the vicinity of a gap formed between iron cores. CONSTITUTION:Two E-type cores 3 and 4 are combined with their magnetic legs opposed, and a gap Ga is formed between short center core parts 3a and 4a. Next, magnetic bodies 5A and 5B are arranged addtionally in such a manner that they are positioned on the opposite sides of the gap Ga and enclose the core parts 3a and 4a through the intermediary of a gap g1. These magnetic bodies are formed of composite resin ferrite or the like which is prepared by mixing the powder of an amorphous alloy, permalloy, silicon steel or ferrite with synthetic resin, have different volume ratios and are laminated to form a magnetic body 5. By this constitution, the inductance can be increased sharply when a load is light, and an output is remarkably stabilized.
Patent JP-S5578223-A (JP)
Title: Thermocouple
Inventor: YODA TADAYOSHI
IPC: G01K7/02
Filed: 1978-12-07
Abstract: PURPOSE: To enable the thermocouple to be applied to the failure analysis of semiconductor integrated circuit by means of Auger electron spectroscopy, by providing the insulator film on the surface of the thermocouple metal body and making small the thermocouple through the coating and forming the conductive film on the insulator film.  
     CONSTITUTION: The insulation film 105 is coated on the exposed surface of the thermocouple metal wires 102, 103 made of Pt/PtRh and the conductive film 106 is coated on the film 105 to form the thermocouple. As the insulating material constituting the insulation film 105, SiO 2 , Si 3 N 4 , and prosphosilicate glass are used, and coating is made with vapor phase growing method and coating baking method. Further, as the conductive material constituting the conductive film 106, metals such as Mo, Cr, Ti, are used and coating is made by vapor phase growing method. vapor deposit method and sputtering method. 
     COPYRIGHT: (C)1980,JPO&Japio
Patent JP-S6130146-A (JP)
Title: Hierarchical polling method
Inventor: IKEZAKI MASAO
Filed: 1984-07-20
Abstract: PURPOSE:To reduce the processing load in a master control station to simplify the constitution of the master control station and use the reduced throughput for another processing by performing the polling processing hierarchically. CONSTITUTION:A storage part 9 is connected to a master control station 1 of a security system, and a transmission line 2 terminated by a terminator 7 is connected to the master control station 1. Plural repeating control stations 31-3m are connected to the transmission line 2 through distributing amplifiers 5, and storage parts 101-10m are connected to control stations 31-3m. Transmission lines 8 terminated by terminators 7 are connected to control stations 31-3m, and terminal slave stations 411-41n, 421-42n, 4m1-4mn are connected to transmission lines 8 through distributing amplifiers 6. Polling from the master control station 1 to control stations 31-3n and polling from control stations 31-3n to slave stations 411-4mn are separated hierarchically, and each polling is performed independently. By this polling method, the processing load of the master control station 1 is reduced, and the reduced throughput is used for another processing.
Patent JP-H07336666-A (JP)
Title: Signal processor
Inventor: KATSUTA NOBORU
IPC: H04N7/167
Filed: 1994-06-08
Abstract: PURPOSE:To control the degradation of a scramble image by controlling a quantization matrix, in particular, for a compressed video signal. CONSTITUTION:Digital compressed video signals are successively outputted in accordance with the control signals from a scramble location detector 11 after the signals are inputted in a buffer 12 and become scramble signals via an exclusive OR circuit 15. For this period, the scramble location detector 11 detects quantization matrix buried timing, a 'dot type' and an 'alternate scan'. When the quantization matrix embedding timing is detected, a dummy bit is made to be outputted from a dummy quantization matrix code output device 13 and the bit is embedded within the scramble signal. When 'dct type' and 'alternate scan' signals are detected, a signal '1' is transmitted to the exclusive OR circuit 15 and a bit inversion is performed.
Patent JP-H11347818-A (JP)
Title: Working method of work
Inventor: HONDA YUJI
IPC: B26F1/16
Filed: 1998-06-01
Abstract: PROBLEM TO BE SOLVED: To improve working accuracy in the depth direction, in a work working method in a work working device. SOLUTION: In this work working method detecting (S100, S200) the extreme end position of a tool and the working face of a work and setting the working- depth of the work, by a tool detecting means detecting the extreme end of the tool provided on the elevatable body of a work working device by non- contact, a detector elevatably provided on the elevatable body and contacting with the work to detect the work, and a measuring means measuring the descent distance of the tool and the moved distance of the detector, this is the working method of a rotor in which after detecting the extreme enact position of the tool and the position of the worked face of a work, trial working of fixed depth is executed on the work (S230), the trial worked depth is measured by the detector and the measuring means (S240),  and the extreme end position of the tool is corrected by difference between the fixed depth and the measured worked depth (S250, S260).
Patent JP-S5775422-A (JP)
Title: Manufacture device for thin film
Inventor: KITAGAWA MASATOSHI
IPC: H01L21/205
Filed: 1980-10-28
Abstract: PURPOSE:To obtain a thin film having superior characteristic without receiving adverse influence from the circumference by a method wherein magnetic field is made to be generated as to apply necessary magnetic field only to space between electrodes, and not to apply magnetic field to the unnecessary part. CONSTITUTION:SiH3 is introduced 21, and is discharged 20, a substrate is supported on the electrode 23 and is heated with a heater 25. Electric field of high-frequency or DC is applied to the electrodes 23, 24 from the outside through metal bars 26, 27 insulated by a gap 28 to perform plasma discharge decomposition. Size of the gap 28 is selected at the necessary minimum considering resistance of magnetic path of an electromagnet 29. By this constitution, discharge decomposition is performed forming magnetic field only in space between the electrodes to reduce accumulation of decomposed material to the undesired part, and the thin film having superior characteristic can be obtained. Size of the electromagnet 29 is not controlled by size of a reaction tube 22, and is decided by necessitated magnetic field intensity, and the electromagnet can be small in size.
Patent JP-H0443324-A (JP)
Title: Orientation treatment
Inventor: KAWAMURA TETSUYA
IPC: G02F1/1337
Filed: 1990-06-11
Abstract: PURPOSE:To decrease the defects arising in the production process and the nonuniformity of performance by spraying fine particles for controlling flow to one direction to an oriented film material to be deposited on a substrate, etc. CONSTITUTION:A liquid crystal panel is provided with thin-film transistors (TFTs) 4 and picture element electrodes 5 on the substrate 3 and has an insulating film 6 covering the same. The oriented film is formed thereon. The fine particles 1 of ice are formed from the pure water introduced with carbonic acid ions as an ionic material in an atmosphere subjected to electrostatic charge control (destaticization). The fine particle flow 1a of the specified direction is formed by using the fine particles 1 of the ice. The fine particle flow 1 is sprayed at a specified angle with the substrate (TFT array substrate) 3 of an active matrix type coated with the oriented film 2 and thereafter, the substrate is dried and the liquid crystal display panel is assembled. The fine particle flow 1 is sprayed in the specified direction to the oriented film 2 in such a manner, by which the orientability is generated in the oriented film 2. The defect by dust and static electricity arising from the rubbing method and the nonuniformity of the performance are lessened in this way.
Patent JP-S6043138-A (JP)
Title: Air-fuel ratio controlling apparatus
Inventor: SUZUKI ATSUSHI
IPC: F02D41/00
Filed: 1983-08-20
Abstract: PURPOSE:To control the air-fuel ratio accurately to a value in a rich mixture region, by providing a metering means for metering the quantity of air-fuel mixture supplied to an engine, an air-fuel ratio sensor for detecting an air-fuel ratio richer than the theoretical air-fuel ratio, and a control means for controlling said metering means. CONSTITUTION:A control unit 13 is furnished with output signals of a sensor 8 for detecting the quantity of intake air, an engine-speed sensor 12, an air-fuel ratio sensor 1, an opening sensor 10 for detecting the opening of a throttle valve 9, etc. and calculates and controls the valve opening timing and the valve opening period of an injection valve. The air-fuel ratio sensor 1 detects an air-fuel ratio richer than the theoretical air-fuel ratio. When an engine is operated in a region requiring a rich air-fuel ratio, a mixture metering means 11 is controlled by use of the output signal of said air-fuel ratio sensor 1 to obtain a required air-fuel ratio. With such an arrangement, it is enabled to control the air-fuel ratio accurately to a value richer than the theoretical air-fuel ratio.
Patent JP-H098308-A (JP)
Title: Transistor of semiconductor element and its manufacture
Inventor: KOU SHIYUN
IPC: H01L21/336
Filed: 1996-06-13
Abstract: PROBLEM TO BE SOLVED: To enhance the operating speed by making a trench in an SOI layer, forming a gate electrode and an LDD region in the trench, and implanting ions heavily into the outside of LDD region to form a junction region thereby decreasing the resistance of junction region itself. SOLUTION: An insulation layer 12 and an SOI layer 13 are formed on a silicon substrate 10 and then the SOI layer 13 is coated with a first photosensitive film 9 before being etched at a specified depth to make a trench 11. The first photosensitive film 9 is then removed and a gate oxide 14, a polysilicon 15 and a second photosensiLive film 16 are deposited thereon before a gate electrode 15A is formed by etching, for example. Subsequently, ions are implanted lightly to form an LDD region 17 and an oxide spacer 16 is formed on the opposite side walls of gate electrode 15A and above the LDD region 17. Finally, the exposed SOI layer 13 is implanted heavily with ions to form a junction region 18.
Patent JP-H04354897-A (JP)
Title: Automatic plating device for plate product
Inventor: KONISHI TADAYUKI
IPC: C23C18/31
Filed: 1991-05-29
Abstract: PURPOSE:To reduce the length and floor area of an automatic plating tank as compared with the conventional one and to improve plating quality by using this new automatic plating method for a plate product such as a printed board by which a hanger and the labor for mounting are dispensed with and the bubbles on the surface to be plated are removed. CONSTITUTION:A circulating band 3 having a tooth 4 is provided in the plating tank 1 having the inlet and outlet for a product P under the liq. surface. The tip of the product P introduced from an inlet 1a is inserted between the teeth 4 of the band 3 by a conveyor 2, and the product is erected and sent forward in the tank. The product is laid down at an outlet 1b, placed on the conveyor 2 and discharged. The plating soln. circulated from a storage tank 6 is sprayed from a submerged injection pipe 18. The upper and lower vibrators 13 and 16 are set on the way forth of the band 3 carrying the erected products P to remove the bubbles on the surface to be plated.
Patent JP-S6131220-A (JP)
Title: Supporting base of injection mold
Inventor: FUKAZAWA MITSURU
IPC: B29C45/17
Filed: 1984-07-24
Abstract: PURPOSE:To enable setting and changing operation to be performed quickly and quite simply by aligning a mold with specified positions of tie bars. CONSTITUTION:The upwardly opening recessed part 3 is provided in the center of a square metallic plate member 2 having a nearly constant thickness, projections 4 are provided on the right and left sides of the plate member 2 so as to project on the mold fitting surface and a guide groove 5 is provided on each of the upper and the lower projections 4. The guide groove 5 has a T-shaped section and a female hole 9 is provided on the bottom surface thereof. The claw 10 to be passed through each guide groove 5 is provided with a female screw 11 on its top end and an elongated hole 12 extending in the longitudinal direction. The claw 10 can move right and left in the guide groove 5 and be fixed at a desired position of the end of the recessed part. When the fixing bolt 14 is inserted into the elongated hole 12 and the male screw part at the end of the fixing bolt 14 is screwed tightly into the female screw hole 9 of the guide groove 5, the claw 10 can be fixed at a desired position.
Patent JP-H025348-A (JP)
Title: Separation of planar body from holder
Inventor: HAGIMOTO KAZUYOSHI
IPC: H01J37/317
Filed: 1988-06-20
Abstract: PURPOSE:To separate a planar body from a holder by supplying a pressurized gas to an adsorption surface of the holder while maintaining it at a predetermined temperature. CONSTITUTION:An adsorption holder 2 taken out of a vacuum chamber is placed in a heating chamber 5, placed on a metallic plate 6, and the holder 2 and a planar body 1 are kept at a predetermined temperature higher than the room temperature, for example at about 70 deg.C by a heater 7. A pressurized gas such as nitrogen gas is supplied from a small hole 3 of the holder 2 to separate the planar body 1 from the holder 2. Such a procedure facilitates the separation of the planar body 1 by means of the pressurized gas because the components are not cooled down to the room temperature but kept at the predetermined temperature and the adhesive force of a packing 4 is kept within a small range.
Patent JP-S6214433-A (JP)
Title: Electronic circuit device and manufacture thereof
Inventor: SATO RYOHEI
IPC: H01L21/60
Filed: 1985-07-12
Abstract: PURPOSE:To execute a highly reliable soldered joint by a method wherein only the superfine powders which are made from the same composition as those of the soft worked solders having an excellent ductility and fatigue characteristics are sintered without fusing these solders to connect components with the substrate. CONSTITUTION:Each worked solder is obtainable by homogenization through a cold rolling and a heat treatment in advance of a solder of Pb:Sn=95:5 (wt%) into the prescribed shape. Each superfine powder 6 is formed in an average particle diameter of 800Angstrom  and in the ratio of Pb:Sn=95:5 and its sintering starts at temperatures of 200-250 deg.C lower than that of the worked solders 5. The superfine powders 6 are fed on the electrodes 3 of a substrate 2 through the metal mask. After the worked solders 5 are fed on the superfine powders 6, both of them are heated to about 230 deg.C to start the sintering only of the powder 6, and the substrate 2 and the worked solders 5 are connected to each other by the resultant reaction.
Patent JP-H0445569-A (JP)
Title: Semiconductor stacked cmos device and its manufacture
Inventor: ITO MASAHIRO
IPC: H01L21/822
Filed: 1990-06-13
Abstract: PURPOSE:To prevent it from being affected by the insulation breakdown strength of a gate insulating film by oxidating an upper layer polycrystalline Si, and providing gate insulating films above and below the channel region of an upper layer MOS FET. CONSTITUTION:This is the process in which the process of removing the silicon initride film 11 or the silicon oxide film formed in the gate electrode region at the bottom after formation of an upper layer MOS FET element region and the process of forming a polycrystalline Si 16 after formation of a gate insulating film 15 by thermal oxidation under the element region of the upper layer MOS FET are combined. In this method, the gate insulating films 15 are arranged above and below the upper layer MOS FET. Furthermore, the gate insulating film 15 of the upper layer MOS FET is the one that the polycrystalline Si 16 low in impurity concentration is oxidated, so the intake of impurities into the gate insulating films 15 is small, so it ceases to affect insulation breakdown strength.
Patent JP-H051421-A (JP)
Title: Construction method for basement
Inventor: FUKUSHIMA SHIGEHARU
IPC: E02D29/00
Filed: 1991-06-25
Abstract: PURPOSE:To substantially improve workability for constructing a basement, shorten a construction period and easily improve the finished accuracy of the basement. CONSTITUTION:Concrete filling space is formed between an outer enclosure 1 having an upper section open approximately over an entire area, and an inner enclosure 2 having an inlet 13 open through a ceiling plate 15. An upright coaming 16 is erected around the inlet 13, and a ceiling concrete filling space 17 is formed at a ceiling section around the coaming 16 in such a way as continuous to the space 3. Reinforcements 12 are provided in the space 3 and 17, thereby constituting a basement unit 4. This unit 4 is carried to a construction site and installed. Thereafter, the space 17 and another space 3 continuous thereto is filled with concrete.
Patent JP-H11345847-A (JP)
Title: Manufacture of semiconductor wafer and semiconductor device
Inventor: SHIROYAMA HIROAKI
IPC: H01L21/301
Filed: 1998-06-02
Abstract: PROBLEM TO BE SOLVED: To provide the manufacture of a semiconductor wafer and a semiconductor device which is capable of reducing the area of the chip of the semiconductor device, and to manufacture the semiconductor device at low cost by devising the configuration of an input/output device. SOLUTION: Bonding pads 61 and 62 are made on the transistor parts of input/output devices 41 and 42 at the peripheries of semiconductor devices 31 and 32, and pads 71 and 72 for wafer inspection which are electrically connected to these are made on a scribe lane 2. The pads 71 and 72 for wafer inspection are used for wafer inspection, and the bonding pads 61 and 62 are used at assembling. At dicing, the pads 71 and 72 for wafer inspection are cut off, so that the chip size can be reduced.