baber/WOPTO huggingface dataset:
Patent TW-440665-B (TW)
Title: Gas feed device
Inventor: YAMAMOTO RYOICHI
IPC: F17D1/02
Filed: 2000-09-26
Granted: 2001-06-16
Abstract: The object of this invention is to provide a gas feed device, capable of feeding high purity gas stably to consuming facilities by preventing the gas from being accumulated in a piping system. The gas feed device comprises: a loop main pipe 2 connected to a gas feed source 6 and auxiliary pipes 3 having both ends connected to the main pipe 2 and having the consuming facilities 7 connected on the way thereof, wherein a valve V3 for controlling the flow of gas in the auxiliary pipe 3 is provided on the way of the auxiliary pipe 3, exhaust pipes 4 are connected to near both sides of the valve V3, respectively, and each of the exhaust pipes 4 has a valve V4 and flowmeter FI1, the exhaust pipes 4 can exhaust a part of the gas in the auxiliary pipe 3 to the outside while the gas is fed to the consuming facilities 7, and an opening and closing type valve V2 is provided at both ends of the auxiliary pipe 3.
Patent TW-545021-B (TW)
Title: A method for prohibiting transacting parties from subsequently repudiating an executed transaction with trusted third party
Inventor: ZHANG CHUNRU
IPC: H04L29/06
Filed: 2000-11-27
Granted: 2003-08-01
Abstract: A protocol for prohibiting non-repudiation by transacting parties involved in an executed electronic transaction, whereby a trusted third party is responsible for ensuring non-repudiation. In this protocol, a sender uses a secret sharing technology to divide the original session key into a first sub-session key and a second sub-session key. The first and second sub-session keys must be combined into the original session key in order for a recipient to decrypt a product that is encrypted with the original session key. The sender includes the first sub-session key that is encrypted with a recipient's public key and an encrypted product in a first message. Then the sender transmits the first message to the recipient. The recipient uses the first message as evidence of non-repudiation of origin, i.e., evidence of non-repudiation that the sender sent the transaction. The recipient transmits, to the sender, a second message requesting the second sub-session key. The sender may use the second message as evidence of non-repudiation of receipt, i.e., evidence of non-repudiation that the recipient received the transaction. Thereafter, the sender includes the second sub-session key which is encrypted with the trusted third party's public key in a third message that is forwarded to the trusted third party. The trusted third party decrypts the third message to retrieve the second sub-session key and then re-encrypts the second sub-session key with the recipient's public key. The trusted third parry includes the re-encrypted second sub-session key in a fourth message and publishes the fourth message on the trusted third party's web site where the recipient is responsible for retrieving i.e., This protocol therefore ensures non-repudiation of origin and non-repudiation of receipt without reliance on the trustworthiness of one of more transacting panics. Furthermore, by involving the trusted third party in minimal transaction processing, i.e., only non-repudiation processing, the responsibility and liability of die trusted third party is reduced, thereby reducing the cost associated with trusted third parties in electronic transactions.
Patent TW-552130-B (TW)
Title: PC-based man-machine interface for medical ultrasonic diagnostic device
Inventor: SHIU YI-CHANG
IPC: G16Z99/00
Filed: 2000-10-18
Granted: 2003-09-11
Abstract: A PC-based man-machine interface for a medical ultrasonic diagnostic device comprises an input part, an output part, and an integral I/O part. The integral I/O part comprises: a data input control unit, an image display unit, and an image retrieval control unit. The image retrieval control unit comprises a transducer connector, an ultrasonic pre-processor, a system sequence controller, and a PC mainframe. In the input part, the data input control unit comprises: a panel having a plurality of input devices, a circuit part with a circuit layout compatible with the input device of the PC, and a decoder. In the output part, the image display unit comprises: a digital scanning converter, an image display controller, and a digital display output device capable of selectively displaying a digital image signal from the image display controller and a digital signal from the PC mainframe.
Patent TW-527808-B (TW)
Title: Wide band radio transmission method
Inventor: PARK DONG-SEEK
IPC: H04W4/06
Filed: 2001-01-20
Granted: 2003-04-11
Abstract: A wide band radio transmission method for transmitting bit streams of a video-related application through a radio channel is provided. The wide band radio transmission method comprises the steps of: (a) obtaining identification information on a video-related application which is executed in a user layer, from the user layer; (b) obtaining information on at least one of channel characteristics and a decoding state from a physical layer; and (c) deciding on a quality of service (QoS) level with reference to the identification information and the information on at least one of the channel characteristics and the decoding state from the physical layer. The wide band radio transmission method can efficiently support video-related applications such as applications of H.324M standard, H.323 standard, H.320 standard, and MPEG-4 standard. Also, negotiations on video services having different quality of service (QoS) levels can be performed, and then, optimum video services considering channel characteristics can be provided.
Patent TW-517315-B (TW)
Title: Ag-pre-plated lead frame for semiconductor package
Inventor: PARK SE-CHUL
IPC: H01L21/60
Filed: 2000-12-12
Granted: 2003-01-11
Abstract: A lead frame for a semiconductor package including a base metal layer made of copper (Cu), Cu alloy or iron-nickel (Fe-Ni) alloy, anderly-ing plating layer formed on at least one surface of the base metal layer and made of Ni or Ni alloy, an intermediate plating layer formed on the underlying plating layer to a thickness of 0.00025 to 0.1 μm (0.1 to 4 microinches) and made of palladium (Pd) or Pd alloy, and an outer plating layer formed in the intermediate plating layer to a thickness of 0.05 to 0.75 μm (2 to 30 microinches) and made of silver (Ag) or Ag alloy. Since an Ag plated layer is formed as the outer plating layer, excellent oxidation resistance and corrosion resistance can be exhibited even under a high-temperature thermal condition, thereby improving wire bondability, solderability and good adhesion with epoxy for use in the semiconductor package, and preventing heel crack at a wire bonding portion. In particular, since thin layers of the Pd plated layer and Ag plated layer are used, Ag migration can be prevented. Also, the amount of a noble metal such as Pd or Ag can be greatly reduced, thereby attaining thin-film, light-weigh semiconductor packages.
Patent TW-553797-B (TW)
Title: Pat using for grinding, grinding device and method use it
Inventor: SHIMAGAKI MASAAKI
IPC: B24B37/26
Filed: 2000-12-19
Granted: 2003-09-21
Abstract: The invention provides a pat using for grinding, which characterizes in that there is a construction of supplying water on its surface contacting with the material to be ground, especially having a domain construction of an area less than 1x10<-6> m<2>, wherein the said pat effects that the scratch on the surface of a grounded material will be less, the contents of dust attached toward a grounded material will be less and the dressing or erosion will be less, and thus the grinding velocity will be higher for applied in grinding a semi-conductor and the other fields.
Patent TW-I278448-B (TW)
Title: Unsaturated monocarboxylic ester compound, process for producing the same, and composition curable with actinic energy ray
Inventor: NISHIKUBO TADATOMI
IPC: C07C67/24
Filed: 2001-01-20
Granted: 2007-04-11
Abstract: There is provided an unsaturated monocarboxylic ester compound having at least one structure represented by the following general formula (1), wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, and R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group. A curable composition comprises (A) the unsaturated monocarboxylic ester compound having one or more structures represented by the general formula (1) mentioned above and (B) a polymerization initiator as indispensable components thereof, and further, as occasion demands, (C) a diluent.
Patent TW-491775-B (TW)
Title: Self coloring stamp
Inventor: PICHLER WOLFGANG
IPC: B41K1/54
Filed: 2001-03-02
Granted: 2002-06-21
Abstract: The present invention relates to a self-coloring stamp with the over-rap-coloring, including: an under-part, which can be placed on the stampable place; a color pad which is arranged in reception bucket (8) that is in a replaceable insertable container (3); a turn-over mechanism for a press-plate-carrier which is arranged in the under-part and when turned-over can be moved to and fro between a color pad and an upright frame (5); an operation-upper-part (6) which can move against the spring force relative to the under part, wherein on the surface of color pad container is provided with at least a slot (7) extending in the insertion direction, in which a rib (9) is arranged on the surface of reception bucket that engages the slot by positive-locking.
Patent TW-I222205-B (TW)
Title: Multi-chip ball grid array IC packages
Inventor: DEGANI YINON
IPC: H05K1/14
Filed: 2001-03-20
Granted: 2004-10-11
Abstract: The specification describes a high density IC BGA package in which one or more IC chips are wire bonded to a BGA substrate in a conventional fashion and the BGA substrate is solder ball bonded to a printed wiring board. The standoff between the BGA substrate and the printed wiring board to which it is attached provides a BGA gap which, according to the invention, accommodates one or more IC chips flip-chip bonded to the underside of the BGA substrate. The recognition that state of the art IC chips, especially chips that are thinned, can easily fit into the BGA gap makes practical this efficient use of the BGA gap. The approach of the invention also marries wire bond technology with high packing density flip-chip assembly to produce a low cost, high reliability, state of the art IC package.
Patent TW-I298069-B (TW)
Title: Process for the preparation of dialkoxythiophenes and alkylenedioxythiophenes
Inventor: RAUCHSCHWALBE GUENTER
IPC: C07D495/04
Filed: 2001-03-28
Granted: 2008-06-21
Abstract: In the preparation of 3,4-dialkoxy- or 3,4-alkylenedioxy-thiophenes (I) or (II) by decarboxylation of the corresponding 3,4-dialkoxy- or 3,4-alkylene-dioxo-2,5-thiophene-dicarboxylic acids (III) or (IV), (i) decarboxylation is carried out in a solvent or diluent with a higher boiling point than (I) or (II), which is not an aromatic amine; and (ii) the end product is separated from this solvent or diluent by distillation. In the preparation of 3,4-dialkoxy- or 3,4-alkylenedioxy-thiophenes of formula (I) or (II) by decarboxylation of the corresponding 3,4-dialkoxy- or 3,4-alkylene-dioxo-2,5-thiophene-dicarboxylic acids of formula (III) or (IV): (i) decarboxylation is carried out in a solvent or diluent with a higher boiling point than (I) or (II), which is not an aromatic amine; and (ii) the end product is separated from this solvent or diluent by distillation. R<1>, R<2> = linear or branched 1-15 carbon (C) alkyl; X = optionally substituted -(CH2)n-; n = 1-12.
Patent TW-I283205-B (TW)
Title: Method for producing elastic stretchable composite sheet
Inventor: KOBAYASHI TOSHIO
IPC: B32B7/022
Filed: 2001-03-28
Granted: 2007-07-01
Abstract: A composite web 10 comprising the stretchable web joined to the extensible web is extended between at least two sets of nip roll pairs 31 and 32 to produce the elastic stretchable composite sheet 20. The composite web 10 is brought into contact with the peripheral surface of at least the one nip roll in an area of a quarter circle or above on each of the nip roll pairs 31 and 32.
Patent TW-533510-B (TW)
Title: Production method of silicon mirror wafer
Inventor: AKIYAMA SHOJI
IPC: H01L21/324
Filed: 2001-04-23
Granted: 2003-05-21
Abstract: The invented production method of silicon mirror wafer is characterized that a mirror-polished CZ silicon wafer having an interstitial oxygen concentration below 16 ppma is heat-treated in an atmosphere of hydrogen, argon or a mixer of these gases so that the micro-roughness of the silicon wafer is up to 1.00 nm in terms of a 2 mum-square P-V value measured by an atomic force microscope, whereby providing a simple method for producing a silicon mirror wafer, capable of reducing grown-in defects in the vicinity of the surface of a CZ silicon wafer without sacrifice in micro-roughness and haze on the surface thereof.
Patent TW-511343-B (TW)
Title: Communication system with frequency modulation and with a single local oscillator
Inventor: BRUNEL DOMINIQUE
IPC: H04B1/04
Filed: 2001-05-03
Granted: 2002-11-21
Abstract: A communication system by radio waves with frequency modulation, comprising: a signal processing unit (120), a transmission stage (110), a modulator (130) connected between the processing unit (120) and the transmission stage (110), and means (170, 173) for providing a frequency reference signal to the transmission stage (110) and to the modulator (130). According to the invention, said means for providing the first and the second frequency reference signal comprise a single local oscillator (174). Application: mobile telephones.
Patent TW-514674-B (TW)
Title: Process for producing three-dimensional, selectively metallized parts, and three-dimensional, selectively metallized part
Inventor: LUC BOONE
IPC: C25D5/02
Filed: 2001-05-11
Granted: 2002-12-21
Abstract: The parts (T) are produced by two-component injection molding, the regions which are to be metallized consisting of a first plastic and the regions (B2) which are not to be metallized consisting of a second plastic. After the entire surface of the parts (T) has been seeded, this seeding is selectively removed again with the aid of a solvent in the regions (B2) which are not to be metallized. The first plastic is insoluble and the second plastic soluble in this solvent. The selective metallization (M) then takes place by electroless metal deposition and, if appropriate, electrodeposition of metal.
Patent TW-584990-B (TW)
Title: Sigma-Delta modulation device
Inventor: LIOU SHEN-YUAN
IPC: H03M1/06
Filed: 2001-05-25
Granted: 2004-04-21
Abstract: A sigma-Delta modulation device to convert the external analog signal into digital output signal is disclosed, which comprises: a first filter circuit to output a first analog signal based on the external analog signal and a single-bit output signal; a second filter circuit to output a third analog signal based on the first analog signal and the second analog signal; a single bit quantization circuit coupled to the second filter circuit to convert the third analog signal into the single bit output signal; a multi-bit quantization circuit coupled to the second filter circuit to convert the third analog signal into multi-bit output signal; a digital/analog converter circuit having plural capacitors, which can determine the number of capacitors needed to be charged based on the multi-bit output signal, and can select the capacitor and charge in a predetermined sequence based on a multi-bit output signal and the number of capacitors needed to be charged, wherein when receiving the multi-bit output signal every other time, it selects the corresponding number of capacitors and recharges in the opposite sequence, and after the charging of each time, the charged capacitor generates a second analog signal; and a digital filter coupled to a single-bit quantization circuit and multi-bit quantization circuit to convert the single-bit output signal and multi-bit output signal into digital output signal.
Patent TW-569361-B (TW)
Title: Gold wire for semiconductor element connection and semiconductor element connection method
Inventor: MURAI HIROSHI
IPC: H01L21/60
Filed: 2001-05-30
Granted: 2004-01-01
Abstract: A gold wire, for semiconductor element connection, consisting of 5-100 ppm by weight of Ca, 5-100 ppm by weight of Gd, 1-100 ppm by weight of Y and preferably 1-100 ppm by weight of at least one from among rare earth elements other than Y, as well as 1-100 ppm by weight of at least one from among Mg, Ti and Pb, the total amount of these elements being no greater than 200 ppm by weight, the balance being gold and unavoidable impurities. A semiconductor element connection method by ball bonding or bump connection using the gold wire.
Patent TW-493296-B (TW)
Title: Waterproof connector
Inventor: YUASA KATSUHIKO
IPC: H01R13/52
Filed: 2001-07-09
Granted: 2002-07-01
Abstract: The present invention provides a waterproof connector, wherein the sealing member is engaged at the opening on the terminal insertion side of the shell as a waterproof connector in an integrated waterproof shape, so that the operation for opening the through-hole on the waterproof connector is made easier; thus, the terminal with wires can be inserted into the waterproof connector with single touch. The waterproof connector (C) according to the present invention is provided with: a shell (10) accommodating the terminal (T); an opening (12) engaged with the terminal insertion side of the shell (10); a sealing portion (21) air-tightly contacted with the inner surface (12a) of the opening (12) at the perimeter; and, a sealing member (20) having a plurality of through-holes (22) with the inner surface air-tightly contacted with the electrical wires (H); and, a bushing (30) configured in each through-hole (22) with the perimeter (31) connecting with the peripheral wall of the through-hole (22) as a whole, and the perimeter has a thickness which can be pulled apart manually.
Patent TW-595034-B (TW)
Title: Enhanced pigment-sensitive photoelectro-transform element
Inventor: MASAAKI IKEDA
IPC: H01L31/04
Filed: 2001-07-27
Granted: 2004-06-21
Abstract: The present invention relates to an organic enhanced pigment-sensitive semiconductor device and to a solar cell using the same and, particularly, to a photoelectric conversion device using semiconductor fine particles sensitized with a dye having an acrylic acid part and a solar cell using the same. According to the present invention, a low-cost photoelectric conversion device having favorable conversion efficiency and a solar cell can be obtained.
Patent TW-I233127-B (TW)
Title: Method for testing cache memory
Inventor: LIANG JING-JE
IPC: G11C29/00
Filed: 2001-08-07
Granted: 2005-05-21
Abstract: The present invention provides a method for testing cache memory, which is suitable for a device having cache memory and system memory. The method includes the following steps: writing a written data into the cache memory; converting the written data into a first encoded data through a first encoding operation; writing the first encoding data into the system memory; and, reading a read data from the system memory; converting the read data into a second encoding data through a second encoding operation; storing the second encoding data into the cache memory; and, comparing the first encoding data or the second encoding data with the corresponding expected reference data.
Patent TW-507468-B (TW)
Title: Flat panel display module and method of manufacturing the same
Inventor: ISHIKAWA TAKASHI
IPC: H05B33/06
Filed: 2001-08-07
Granted: 2002-10-21
Abstract: A flat panel display module includes a transparent substrate, a light emitting section, a sealing cap, a flexible printed circuit board and a semiconductor device. The transparent substrate with a wiring line terminal section is formed on one of surfaces of the transparent substrate in at least one of opposing ends of the transparent substrate. The light emitting section is provided in a display region in a center section on the surface on which the wiring line terminal section of the transparent substrate is formed. The sealing cap is provided for a sealing region to cover the light emitting section such that ends of the sealing cap does not reach the ends of the transparent substrate or the wiring line terminal section of the transparent substrate. The flexible printed circuit board is connected to the wiring line terminal section and extending along the sealing cap of the transparent substrate. The semiconductor device is mounted on the flexible printed circuit board for the light emitting section.
Patent TW-522444-B (TW)
Title: Method for forming a self-aligned copper capping diffusion barrier
Inventor: KONECNI ANTHONY
IPC: H01L21/4763
Filed: 2001-09-14
Granted: 2003-03-01
Abstract: A copper interconnect having a self-aligned aluminum barrier (124). After the copper interconnect lines (118) are formed, an aluminum layer (124) is selectively deposited over the surface of the copper interconnect lines (118), but not over the IMD (108). The aluminum barrier (124) may be converted to aluminum-oxide or aluminum-nitride.
Patent TW-521379-B (TW)
Title: Use of a barrier sputter reactor to remove an underlying barrier layer
Inventor: CHEN LING
IPC: H01L21/768
Filed: 2001-10-31
Granted: 2003-02-21
Abstract: A method and resultant structure of forming barrier layers in a via hole extending through an inter-level dielectric layer. A first barrier layer of TiSiN is conformally coated by chemical vapor deposition onto the bottom and sidewalls of the via holes and in the field area on top of the dielectric layer. A single plasma sputter reactor is used to perform two steps. In the first step, the wafer rather than the target is sputtered with high energy ions to remove the barrier layer from the bottom of the via but not from the sidewalls. In the second step, a second barrier layer, for example of Ta/TaN, is sputter deposited onto the via bottom and sidewalls. The two steps may be differentiated by power applied to the target, by chamber pressure, or by wafer bias. The second step may include the simultaneous removal of the first barrier layer from the via bottom and sputter deposition of the second barrier layer onto the via sidewalls. Chamber conditions in the first step, including balancing neutrals and ions, may be controlled to remove the first barrier layer from the via bottom while leaving it on the more exposed the field area.
Patent TW-521391-B (TW)
Title: Method of manufacturing a display device
Inventor: LIFKA HERBERT
IPC: H01L27/32
Filed: 2001-11-07
Granted: 2003-02-21
Abstract: ICs (20) are nearly separated from the semiconductor substrate (10) on/in which they are formed. Subsequently, the substrate is positioned upside down on a substrate (carrier) (3) which is provided with glue (21) at the location of a crystal. After attachment of the crystal to the carrier, the semiconductor substrate is removed and the crystal remains attached to the carrier e.g. at the crossing of rows and columns. The separate crystals may contain TFTs (simple AM addressing) but also more complicated electronics (address of pixel in memory + identification).