baber/WOPTO huggingface dataset:
Patent TW-201804586-A (TW)
Title: Semiconductor device
Inventor: TAKAYANAGI KOJI
IPC: H01L23/48
Filed: 2013-04-03
Abstract: A semiconductor device according to the present invention includes: a through via formed to penetrate a semiconductor substrate; first and second buffer circuits; a wiring forming layer formed in an upper layer of the semiconductor substrate; a connecting wiring portion formed in an upper portion of the through via assuming that a direction from the semiconductor substrate to the wiring forming layer is an upward direction, the connecting wiring portion being formed on a chip inner end face that faces the upper portion of the semiconductor substrate at an end face of the through via; a first path connecting the first buffer circuit and the through via; and a second path connecting the second buffer circuit and the through via. The first path and the second path are electrically connected through the connecting wiring portion.
Patent TW-201919225-A (TW)
Title: Device substrate and manufacturing method thereof
Inventor: TSAO TZU-YI
IPC: H01L21/78
Filed: 2017-11-08
Abstract: A device substrate includes a receiving substrate, a micro light-emitting device, a first conductive structure, a second conductive structure, a reference voltage line and a driving element. The receiving substrate has a plurality of sub-regions. The micro light-emitting device is disposed on at least one of the sub-regions. The micro light-emitting device includes a first patterned semiconductor layer, a second patterned semiconductor layer, and a patterned light-emitting layer. The first patterned semiconductor layer has a first notch adjacent to a first side. The second patterned semiconductor layer has a second notch adjacent to a second side. A portion of the first conductive structure is disposed in the first notch and electrically connect the first patterned semiconductor layer to the reference voltage line. A portion of the second conductive structure is disposed in the second notch and electrically connect the second patterned semiconductor layer to the driving element. A manufacturing method of the device substrate is provided.
Patent TW-201824185-A (TW)
Title: Image processing method and device, electronic device, and computer readable storage medium
Inventor: Sun jian-bo
IPC: G06T1/00
Filed: 2017-11-14
Abstract: An image processing method includes (a) obtaining a first image corresponding to a first photography parameter; (b) obtaining a second image having a same scene as the first image, the second image corresponding to a second photography parameter; (c) blurring the first image to obtain a blurred first image; (d) defining a to-be-replaced portion of the blurred first image, the to-be-replaced portion corresponding to an overexposed portion of the first image; (e) obtaining a replacing portion of the second image, the replacing portion corresponding to the to-be-replaced portion; and (f) replacing the to-be-replaced portion of the blurred first image with the replacing portion of the second image to obtain a merged image. The present invention further discloses an image processing device, a control method, a control device, an imaging device, and an electronic device.
Patent TW-201824233-A (TW)
Title: Display device
Inventor: LEE SO-YOUNG
IPC: G09G3/30
Filed: 2017-11-20
Abstract: A display device includes a substrate that includes a display area and a pad area, and a plurality of data pads that are provided on the pad area of the substrate and arranged along a first direction and a second direction, where the plurality of data pads includes a first data pad, a second data pad that is disposed adjacent to the first data pad along the first direction, a third data pad that is disposed adjacent to the first data pad along the second direction, and a fourth data pad that is disposed adjacent to the second data pad along the second direction, and the first data pad and the second connection wire are respectively disposed in different layers.
Patent TW-201925033-A (TW)
Title: Unmanned aerial vehicle, control system for unmanned aerial vehicle and control method thereof
Inventor: CHEN GUO-RUEI
IPC: G05D1/12
Filed: 2017-11-30
Abstract: A control method of UAV (Unmanned Aerial Vehicle) is configured to a UAV with a camera shooting a target. The control method comprises retrieving a first image by the camera; retrieving a second image after retrieving the first image; calculating a plurality of keypoints respectively according to the first image and the second image by the processing device, selecting a first set of keypoints and a second set of keypoints respectively by the processing device; calculating a first axial displacement and a second axial displacement respectively according to the first set of keypoints and the second set of keypoints by the processing device; calculating an area of first region of interest, an area of second region of interest and a third axial displacement according to the first set of keypoints and the second set of keypoints by the processing device; adjusting a pose of the camera or the flight path of UAV according to the first axial displacement, the second axial displacement and the third axial displacement.
Patent TW-201922160-A (TW)
Title: Floor-drop detection system for mobile robot
Inventor: SUN YU-CHUN
IPC: G05D1/02
Filed: 2017-12-13
Abstract: A system whereby a mobile robot can detect a floor-drop includes a chassis and at least one infrared (IR) sensor. The chassis includes a mounting portion and a translucent lens mounted on the mounting portion. The mounting portion and the translucent lens are inclined downwards, at an angle to a horizontal plane. The IR sensor is mounted in the chassis adjacent to the translucent lens. The IR sensor transmits a signal to a lower surface in front of the chassis through the transparent lens. The IR sensor can detect a distant floor-drop such that the mobile robot can have enough time to stop a front wheel going over the floor-drop.
Patent TW-201929348-A (TW)
Title: Terminal contact structure of connector can breakthrough the problem of electromagnetic interference and radio-frequency interference of the connector
Inventor: CHUNG HSUAN-HO
IPC: H01R13/648
Filed: 2017-12-15
Abstract: This invention relates to a terminal contact structure of connector. A main structure of the terminal contact structure includes a first transmission conductor group and a second transmission conductor group disposed in upper and lower rows at intervals and respectively includes a first transmission conductor group contact part and a second transmission conductor group contact part, wherein a first grounding contact part and a second grounding contact part are respectively forked to form a first extended transmission conductor and a second extended transmission conductor while a third grounding contact part and a fourth grounding contact part are respectively forked to form a third extended transmission conductor and a fourth extended transmission conductor, and a first surrounding part, a second surrounding part, a third surrounding part and a fourth surrounding part are connected to form a first surrounding assembly and a second surrounding assembly so that noise isolating walls are formed at the front ends and two sides of the first transmission conductor group contact part and the second transmission conductor group contact part, and by incorporating with a first grounding member and a second grounding member, a tongue plate of a USB Type C female connector can be propped when a USB Type C male connector is butt-jointed with the USB Type C female connector. Accordingly, the problem of electromagnetic interference and radio-frequency interference of the connector can be improved.
Patent TW-201927300-A (TW)
Title: Method for the treatment of ATG4-related disorders
Inventor: YANG LEE-WEI
IPC: A61K45/06
Filed: 2017-12-26
Abstract: The present invention relates to the area of ATG4-related disorders. More particularly, the present invention relates to a method of treating an ATG4B-related disorder comprising a step of administering a subject with an effective amount of tioconazole. The present invention relates also to a method of increasing a subject's responsiveness to a therapy for a cancer comprising inhibition of ATG4B activity in a cell, said method comprises administering the subject with an effective amount of tioconazole. The present invention also relates to a method for enhancing or inducing a response in cancer cell consisting of cytotoxicity, chemosensitivity or starvation-sensitivity; said method comprises administering a subject with an effective amount of tioconazole to inhibit ATG4B activity.
Patent TW-201840549-A (TW)
Title: 2-heteroaryl-3-oxo-2,3-dihydropyridazine-4-carboxamides
Inventor: SCHMEES NORBERT
IPC: C07D401/04
Filed: 2018-02-05
Abstract: The present invention covers 2-heteroaryl-3-oxo-2,3-dihydropyridazine-4-carboxamide compounds of general formula (I): in which X, R1, R2, R3, R4 and R5 are as defined herein, methods of preparing said compounds, intermediate compounds useful for preparing said compounds, pharmaceutical compositions and combinations comprising said compounds and the use of said compounds for manufacturing pharmaceutical compositions for the treatment or prophylaxis of diseases, in particular of cancer or conditions with dysregulated immune responses or other disorders associated with aberrant AHR signaling, as a sole agent or in combination with other active ingredients.
Patent TW-201833226-A (TW)
Title: Silicone rubber syntactic foam
Inventor: O'NEIL VIRGINIA
IPC: C08L83/04
Filed: 2018-02-08
Abstract: The present invention relates to a novel silicone rubber syntactic foam and the silicone precursor of said foam.
Patent TW-201834519-A (TW)
Title: Bonding apparatus and control method thereof which can protect a die to be bonded
Inventor: JUNG HYUN-GYUN
IPC: H05K3/36
Filed: 2018-02-14
Abstract: The invention discloses a bonding apparatus and a control method thereof. The bonding apparatus includes a bonding head for separately adsorbing the cut die, a driver for moving the bonding head in a vertical direction to be transferred to a position on the XY plane, and a bonding substrate on which the die absorbed by the bonding head is mounted. The bonding head includes a joint member for vacuum absorbing the die, a first pneumatic pressure member for supplying a buffering power to the joint member by selectively applying and canceling a pneumatic pressure, wherein the volume of the first pneumatic pressure member is variable according to the pressure, and a second pneumatic pressure member continuously applied with the pneumatic pressure to maintain the pneumatic pressure applied to the first and second pneumatic pressure members while the bonding head is transferred to the position on the XY plane, wherein when the bonding head moves vertically downward, the pneumatic pressure applied to the first pneumatic pressure member is removed in a state where the bonding head is spaced apart from the upper portion of the bonding substrate by a predetermined height, and the die adsorbed by the joint member is mounted on the bonding substrate. According to the present invention, the bonding apparatus is capable of protecting a die to be bonded (such as a semiconductor wafer). When the bottom surface of the die is immersed in the welding flux through the bonding components of the bonding apparatus or when the die immersed in the welding flux is mounted on the bonding substrate for bonding the die on the substrate (such as printed circuit board), the bonding apparatus can prevent the damage of the bump on the bottom surface of the die. The bonding apparatus can move the die to a dipping plate containing the welding flux or the bonding substrate at a high speed to minimize the processing time required to immerse the die into the welding flux, thereby maximizing the productivity.
Patent TW-201937722-A (TW)
Title: Pixel array substrate
Inventor: LIN YU-KAI
IPC: H01L27/32
Filed: 2018-02-27
Abstract: A pixel substrate including sub pixels is provided. The sub pixels include first color sub pixels, second color sub pixels and third color sub pixels. Pixel openings of the first color sub pixels and pixel openings of the second color sub pixels are alternately arranged in a first direction so as to form a row. Pixel openings of the third color sub pixels are arranged in a direction parallel to the first direction so as to form a next row. A pixel opening of a first color sub pixel, a pixel opening of a second color sub pixel and a pixel opening of a third color sub pixel are disposed adjacent to each other. L1 represents a distance between an edge of the pixel opening of the first color sub pixel and an edge of the pixel opening of the second color sub pixel in the first direction. W3 represents a width of the pixel opening of the third color sub pixel in the direction parallel to the first direction. L1 > W3.
Patent TW-201940034-A (TW)
Title: Electronic module and manufacturing method thereof and housing of electronic device and manufacturing method thereof
Inventor: HO CHI-NENG
IPC: H05K5/02
Filed: 2018-03-08
Abstract: A method of manufacturing an electronic module includes the following steps: Providing a substrate, a conductive circuits is formed on a surface of the substrate, the conductive circuits has at least one contact. Fixedly connected a first end of a conductive elastic member to the contact. And forming an insulating package covering at least a portion of the conductive elastic member and exposing a second end of the conductive elastic member. Thus, the conductive elastic member can be used as a conductive contact for the electrical connection of an electronic component. The foregoing manufacturing method simplifies the manufacturing process, greatly shortens the total processing time and reduces the manufacturing cost. In addition, the reliability of the fixed connection between the conductive elastic member, the contact of the substrate and the pins of the electronic component can be improved so as not to affect the electrical signal transmission between the electronic component and the substrate.
Patent TW-201836053-A (TW)
Title: Apparatus for processing of a substrate, system for processing a substrate, and method for aligning a substrate carrier and a mask carrier in a chamber
Inventor: HEYMANNS MATTHIAS
IPC: H01L21/68
Filed: 2018-03-15
Abstract: An apparatus for vacuum processing of a substrate is described. The apparatus includes a vacuum chamber, a substrate transport assembly, a mask transport assembly, and an alignment system having an actuator and a mechanical isolation element between the actuator and the vacuum chamber.
Patent TW-201941849-A (TW)
Title: Saw handle improvement structure which has advantages of convenient and fast assembly for the swinging arm
Inventor: WANG GUANG-BIN
IPC: B23D29/00
Filed: 2018-03-29
Abstract: Provided is a saw handle improvement structure, which includes a body having a grip portion and a support arm disposed at a distance from the grip portion. The body is pivotally provided with a swingarm, and the support arm is recessed with a cavity for the swingarm to swing sideways. The bottom end of the grip portion is pivotally provided with a pressing handle pivotally connected to a pivotal end thereof, and the pivoting end has a connecting portion. The two ends of the connecting rod are pivotally connected with the connecting portion of the pressing handle and the other end of the swingarm, respectively, so that the pressing handle swings pivotally toward the grip with its pivotal end as an axis, and the swingingarm is interlinked to be laterally swung and positioned in the cavity; therefore, a saw blade is mounted on the swingarm to pivot the pressing handle, and the saw blade is fixed on the body.
Patent TW-201910909-A (TW)
Inventor: HSU CHIN-CHANG
IPC: G03F1/72
Filed: 2018-04-09
Abstract: A method for mitigating extreme ultraviolet (EUV) mask defects is disclosed. The method includes the steps of providing a wafer blank, identifying a first plurality of defects on the wafer blank, providing an EUV mask design on top of the wafer blank, identifying non-critical blocks with corresponding stretchable zones on the EUV mask design, overlapping the EUV blank with the EUV mask design, identifying a second plurality of defects, the second plurality of defects are solved, identifying a third plurality of defects, the third plurality of defects are not solved, adjusting the relative locations of the EUV mask design and the EUV blank to solve at least one of the third plurality of defects, and adjusting the locations of at least one of the non-critical blocks within corresponding stretchable zones to solve at least one of the third plurality of defects.
Patent TW-201903704-A (TW)
Inventor: Sun shu-juan
IPC: G06Q50/30
Filed: 2018-04-26
Abstract: The present disclosure relates to systems and methods for determining an estimated time of arrival (ETA) for a transportation service order. The systems may perform the methods to obtain at least one first feature vector associated with at least one non-quantifiable feature of a historical transportation service order; obtain at least one second feature vector associated with at least one quantified feature of the historical transportation service order; obtain a trained hybrid model by training a hybrid model including a first model and a second model, wherein the at least one first feature vector is an input of the first model and the at least one second feature vector is an input of the second model; direct the at least one storage medium to store the trained hybrid model.
Patent TW-201947618-A (TW)
Title: Power inductor and manufacturing method thereof
Inventor: CHIEN SHIH-FENG
IPC: H01F17/00
Filed: 2018-05-15
Abstract: A power inductor comprises a primary body, an insulating layer, an induction coil, a first electrode and a second electrode. The primary body comprises opposite first and second ends. The insulating layer overlays the primary body except the first and second ends. The induction coil is disposed in the primary body, and comprises a first extending portion from the primary body to the first end and a second extending portion from the primary body to the second end. The first electrode is disposed on the first end and connects to the first extending portion. The second electrode is disposed on the second end and connects to the second extending portion.
Patent TW-201901870-A (TW)
Inventor: HUANG TIAN
IPC: H01L23/15
Filed: 2018-05-22
Abstract: Articles and semiconductor packages that incorporate glass-based substrates are disclosed, as well as methods of forming thereof. An article includes a glass-based substrate comprising first and second major surfaces spaced a distance from and parallel to each other, and a tapered via extending through the substrate. The tapered via includes a cross section that is symmetrical about a plane that is between and equidistant to the first and second major surfaces of the glass-based substrate and an interior wall with a first tapered region and a second tapered region positioned between the first major surface and the plane. The respective slopes of the first and second tapered regions are constant and the slope of the first tapered region is not equal to the slope of the second tapered region.
Patent TW-201902243-A (TW)
Inventor: LIU HUI-CHUN
IPC: H04W88/08
Filed: 2018-05-24
Abstract: Certain aspects of the present disclosure relate to methods and apparatus for optimizing delivery of a data to and/or from a UE in a connected but inactive state.
Patent TW-201908010-A (TW)
Inventor: JOHNSON DAVID MATHEW
IPC: B01J13/00
Filed: 2018-06-19
Abstract: A roller has an outer cylindrical surface having an array of holes, a central feed channel inside the roller, and vanes connecting the channel to the holes, forming a path for liquid between the channel and the holes. An atomization system having a fluid reservoir; a pair of rollers, at least one of the rollers having: a central feed channel, the channel fluidically connected to the fluid reservoir, an array of holes on a surface of the roller, and vanes connecting the channels to the holes, a nip formed between the rollers, and a receiving surface positioned to receive droplets formed when liquid exits the holes, stretches between the rollers as they counterrotate to form filaments and the filaments break into droplets.
Patent TW-201917914-A (TW)
Title: Light source device and light emitting device
Inventor: ONUMA HIROAKI
IPC: H01L33/50
Filed: 2018-06-29
Abstract: A light source device (1) is provided with: a drive circuit (11); a blue light emitting element (30) formed of a group III nitride semiconductor, said blue light emitting element having a light output surface on the reverse side of the drive circuit, being disposed on the drive circuit, and being electrically connected to the drive circuit; and a color conversion layer (40), which is in contact with the light output surface, and which converts the wavelength of light outputted from the light output surface. The light output surface is formed of a group III nitride semiconductor.
Patent TW-201911061-A (TW)
Inventor: NASU OSAMU
IPC: G06F9/46
Filed: 2018-07-05
Abstract: An information processing apparatus (1) includes a data input unit (11) for inputting time series data from an external device, a first processing unit (12) for adding time information to the data received from the data input unit (11) and processing the data added with time information on a real time operating system that performs processing within a designated time, and a second processing unit (21) for processing data added with time information on a non-real time operating system, wherein the same time information added by the first processing unit (12) is maintained for the output of the processing result of the first processing unit (12) and the output of the processing result of the second processing unit (21).
Patent TW-202006208-A (TW)
Title: 製造薄型保暖布之方法、利用該方法製成的薄型保暖布及保暖物件
Inventor: NG LOK-MAN
IPC: D04H1/46
Filed: 2018-07-06
Abstract: 本申請係關於一種製造布料層之方法，其使用較少保暖纖維製造保暖值實質上相近於一對照布料層保暖值之布料層，該方法包含：提供一種包含梳理交疊(CCL，combing and cross lapping)纖維之保暖布料層，並以一針軋方式(needle punch)加工該保暖布料層，直至該保暖布料層之最終厚度等於該保暖布料層重量之2-2.5倍之對照布料層之厚度，俾得一薄型保暖布。
Patent TW-201921590-A (TW)
Title: Fine pitch and spacing interconnects with reserve interconnect portion
Inventor: KANG KUI-WON
IPC: H01L21/768
Filed: 2018-07-31
Abstract: Some features pertain to a substrate that includes a first dielectric, a first interconnect, and a second interconnect. The first interconnect is at least partially embedded in the first dielectric layer. The first interconnect includes a first portion and a second portion. The first portion is configured to increase reliability as compared to a substrate having only a second portion of a first interconnect. The increase in reliability due at least in part to the first portion providing additional interconnect material to mitigate interconnect material lost through electromigration. A part of the second portion (of the first interconnect) is free of the first dielectric and may be configured to be coupled to another device.
Patent TW-201911789-A (TW)
Inventor: GAO XUE-JUAN
IPC: H04L5/00
Filed: 2018-08-03
Abstract: Provided by the present disclosure are an information transmission method, a terminal and a base station. The method comprises: acquiring a symbol occupied by a physical uplink control channel (PUCCH) in a time unit; determining a cyclic shift (CS) value that corresponds to the symbol; on the basis of the CS value, sending the PUCCH on the symbol.