Patent SG-11201900196P-A (SG)
Title: Modular die handling system
Inventor: YINGLING MICHAEL MURRAY
IPC: H01L21/683
Filed: 2017-07-13
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property C.--.` 1#111011110111010101111101 110 1 00111111011110011111011101111011 OEN Organization International Bureau (10) International Publication Number 03 (43) International Publication Date ......\"' WO 2018/013769 Al 18 January 2018 (18.01.2018) W I PO I PC T (51) International Patent Classification: (72) Inventors: YINGLING, Michael Murray; 33 Broome HO1L 21/677 (2006.01) HO1L 21/683 (2006.01) Corporate Parkway, Conklin, New York 13748 (US). HO1L 21/68 (2006.01) ADAMS, Sean Michael; 295 Browncroft Blvd., Rochester, (21) International Application Number: New York 14609 (US). LYNDAKER, David W.; 17042 PCT/US2017/041867 Ladue Road, Holley, New York 14470 (US). PROCTOR, Scott C.; 61 Capen Rd., Brockport, New York 14420 (US). (22) International Filing Date: (74) Agent: BARANOWSKI, Victor J.; Schmeiser, Olsen & 13 July 2017 (13.07.2017) Watts, LLP, 22 Century Hill Drive, Suite 302, Latham, New (25) Filing Language: English York 12110 (US). (26) Publication Language: English (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, (30) Priority Data: AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, 62/361,790 13 July 2016 (13.07.2016) US CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, (71) Applicant: UNIVERSAL INSTRUMENTS CORPO- DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, RATION [US/US]; 33 Broome Corporate Parkway, Con- HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, klin, New York 13748 (US). KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, (54) Title: MODULAR DIE HANDLING = _ = = 130a = 123 105a _ = = = = = 121 = 119a _ 1-1 (57) : Die handling systems and ON materials. The die handling systems are IN process the wafers, extract the dies, and M Embodiments of the wafer handler module include C one or more different sizes to a pre-expanded ---. proprietary cartridge and delivered to the c)1: 1-1 and delivers the extracted dies to subsequent 0 ei 4 -*04. 1' I ik 1 die handler, SYSTEM methods configured inspect 111 126 127 .4 the state without interrupting machinery, 1 of a 109 -'i , ' t use for preparing in modular fashion, allowing for concurrent extracted dies without forcing one where pick head , 1: a 53a mechanism, such such a 100Z 117 , 40 ---- as 115 FIG a pick 116 113,_ 40- ' 1 la or as an of and 103 , ..-' ' i the die the die place processing expander capable \ \,.,__ .._ \-,„._ 180 handler machine, dies handler. The * of 4 1 the 105b : 1 01 from removes for further processing. `' 159 of processes 130b 119b 120 150 1 7 3b 1 1 multiple types of pre-expanded wafer processes to expand the wafers, of the system to remain idle. stretching or expanding wafers having pre-expanded wafers are stored as a each die of the pre-expanded wafer O [Continued on next page] WO 2018/013769 Al MIDEDIMOMOIDEIREIDIONIMMINIHRIONVOIMIE OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))