baber/WOPTO huggingface dataset:
Patent JP-2018047402-A (JP)
Title: Hydrogen water supply apparatus
Inventor: NAKAO ISATO
IPC: C02F1/46
Filed: 2016-09-20
Abstract: PROBLEM TO BE SOLVED: To provide a large amount of hydrogen water from a hydrogen water supply device.SOLUTION: In a hydrogen water supply apparatus (1) for supplying from a supply port (E) hydrogen water containing hydrogen produced by electrolyzing water supplied from a supply source (S) with a hydrogen water generator (C), the inside of the hydrogen water generator (C), into which the water is supplied from the supply source (S), is partitioned into a cathode side treatment space (10) and an anode side treatment space (11) by a diaphragm (9) and a flow regulating valve (B1) is provided on the upstream side of the anode side treatment space (11), and the flow regulating valve (B1) controls so that the water supplied into the cathode side treatment space (10) from the supply source (S) is larger in amount than that supplied into the anode side treatment space (11). In addition, a pressure regulating valve (B2) is provided on the downstream side of the cathode side treatment space (10), and the pressure regulating valve (B2) controls to adjust the concentration of hydrogen contained in the hydrogen water.SELECTED DRAWING: Figure 1
Patent JP-2018048838-A (JP)
Title: Probe device
Inventor: IIDA KAZUHIRO
IPC: G01R1/067
Filed: 2016-09-20
Abstract: PROBLEM TO BE SOLVED: To provide a probe device capable of obtaining an effect of suppressing common mode noise without separately adding a circuit component for measures against the common mode noise.SOLUTION: A probe device which is used for means for inputting measurement signals of a measurement device includes a head, a cable, and a termination. A covering layer compounded of ferrite is provided as a jacket of the cable.SELECTED DRAWING: Figure 1
Patent JP-2018049147-A (JP)
Title: Image forming apparatus
Inventor: ISHIKAWA NAOTOSHI
IPC: G03G21/00
Filed: 2016-09-21
Abstract: PROBLEM TO BE SOLVED: To reduce failure in removal of an image performed by a removing part, compared with an image forming apparatus that, when transferring a rimless image to a medium, forms a band image in an area of a circulating body other than a contact area with the medium from one end to the other end in a width direction of the circulating body.SOLUTION: An image forming apparatus comprises: a circulating body that circulates in one direction and on which an image to be transferred to a medium is formed; a transfer part that sandwiches the medium with the circulating body while rotating to transfer the image to the medium; a removing part that is in contact with the transfer part and removes a band image attached to the transfer part; and a forming part that, when a rimless image is transferred to a medium, forms an image protruding from a contact area with the medium on the circulating body, and forms the band image in an area other than the contact area on the circulating body, the area other than an area on which the protruding portion of the image is overlapped in the one direction.SELECTED DRAWING: Figure 4A
Patent JP-2018049196-A (JP)
Title: Display and driving circuit board
Inventor: IWAI YOHEI
IPC: G09F9/00
Filed: 2016-09-23
Abstract: PROBLEM TO BE SOLVED: To reduce the amount of deformation of a TFT substrate or a driving circuit board when a driver IC is mounted on one of the substrates to prevent a reduction in display quality and prevent a reduction in reliability of the product.SOLUTION: A display includes a first substrate 100 on which a driver IC 40 is mounted. The driver IC 40 is mounted with an anisotropic conductive film therebetween, and the first substrate 100 has a concave part 60 in the vicinity of a short side of the driver IC 40.SELECTED DRAWING: Figure 1
Patent JP-2018047158-A (JP)
Title: Urine absorption pad and pants including the same
Inventor: KATO RYOICHI
IPC: A61F5/44
Filed: 2016-09-23
Abstract: PROBLEM TO BE SOLVED: To provide a urine absorption pad capable of reducing a cost by reducing replacement frequency of the urine absorption pad, and pants using the urine absorption pad.SOLUTION: The urine absorption pad according to the present invention, which is placed on men's pants and used includes: a water-absorbing first area located at a front side of the pants; a water-absorbing second area located at the back side of the pants; and an intermediate area formed between the first area and the second area. The intermediate area is molded so as to project to the surface with respect to the first area and the second area and to have a front face in the first area side and a rear face in the second area side.SELECTED DRAWING: Figure 4
Patent JP-2018054796-A (JP)
Title: Display device, display method, and display system
Inventor: NAKAGAWA ATSUSHI
IPC: H04N5/74
Filed: 2016-09-28
Abstract: PROBLEM TO BE SOLVED: To provide a display device allowing for smooth display operation in accordance with image output of an external device.SOLUTION: A projection device (display device) 20 includes: a projection unit (display unit) 220 for displaying an image; a detection unit 230 for detecting a detection value which is associated with an input of an image output from an external terminal; and a control unit 211 which controls operation of the projection unit 220, on the basis of the detection value detected in the detection unit 230. The projection device 20 includes: a USB terminal 22 (power-supply terminal) having a feed line L1 to be used for supplying electric power to the external terminal; and an HDMI (R) terminal 21 (input terminal) which is a line L5 where an image output from the external terminal is input. The detection unit 230 detects a current and/or voltage of the power-supply terminal, as a detection value.SELECTED DRAWING: Figure 2
Patent JP-2018052687-A (JP)
Title: Printing apparatus
Inventor: ODAKA TOSHIKAZU
IPC: B41J29/38
Filed: 2016-09-29
Abstract: PROBLEM TO BE SOLVED: To provide a printing apparatus in which an ejecting section rotatable with respect to a main body can be closed properly.SOLUTION: A printing apparatus comprises a printing section, a main body 20, an ejecting section 22 that has a resting surface where a printed medium is ejected and the ejected medium rests and is received in the main body rotatably between an open position and a close position, a detecting section that detects the ejecting section staying in the close position, a protrusion 40 that is provided in the ejecting section and projects from the resting surface to support a medium being ejected so as to be displaceable in a protrusion amount, and a control section that controls the protrusion amount of the protrusion. The ejecting section has a rack 51, and the main body has a pinion 49 engageable with the rack when the ejecting section is in a close position, and a drive source 48 that rotates the pinion. The control section performs an operation for initialization when the ejecting section rotates from the open position to the close position and the detecting section detects the ejecting section, while the detecting section is allowed to detect the ejecting section in the case where the rack and the pinion contact each other at their teeth.SELECTED DRAWING: Figure 7
Patent JP-2017066399-A (JP)
Title: Resin composition, laminate, and manufacturing method of laminate structure
Inventor: DEGUCHI HIDEHIRO
IPC: H05K1/03
Filed: 2016-09-29
Abstract: PROBLEM TO BE SOLVED: To provide a resin composition capable of effectively removing smear in a via bottom when an insulation layer is formed and via is formed in the insulation layer and capable of enhancing adhesiveness between the insulation layer and a metal layer when the metal layer is formed on a surface of the insulation layer opposite to a via bottom side.SOLUTION: The resin composition contains a thermosetting compound, a curing agent and an inorganic filler, the curing agent contains an active ester compound of 30 wt.% or more in whole 100 wt.% of the curing agent, and content of the inorganic filler is 230 pts.wt. or more based on the 100 pts.wt. of components excluding a solvent and the inorganic filler in the resin composition.SELECTED DRAWING: Figure 1
Patent JP-2018051123-A (JP)
Title: Mounting structure of bathroom counter
Inventor: YASUZAWA TOMOAKI
IPC: A47K4/00
Filed: 2016-09-30
Abstract: PROBLEM TO BE SOLVED: To provide a mounting structure of bathroom counter capable of preventing a bathroom counter attachable to/detachable from a wall surface from moving and coming into contact with other members such as an apron of a bathtub, the wall surface of a bathroom and the like.SOLUTION: A mounting structure 1 of bathroom counter includes: brackets 2 fixed to a first wall surface of the bathroom; and a bathroom counter 3 which can be attached to/detached from the brackets 2. The bathroom counter 3 is constituted so as to slide in a width direction (a slide direction crossing a mounting direction of the brackets 2), and it has a movement restriction part 6 for restricting slide in the slide direction of the bathroom counter 3.SELECTED DRAWING: Figure 16
Patent JP-2018052728-A (JP)
Title: Sheet conveyance device and image formation apparatus having the same
Inventor: KADOKURA NORIAKI
IPC: B65H7/02
Filed: 2016-09-30
Abstract: PROBLEM TO BE SOLVED: To provide a sheet conveyance device which can achieve skew correction and positional deviation correction of a sheet while saving a space, and achieve the high productivity.SOLUTION: A sheet conveyance device 20 includes: a plurality of first main conveyance rollers 30 which are arranged with a prescribed interval in the width direction of a sheet S and drive independently around a first main rotational shaft 39; and a plurality of main driven rollers 60 which are arranged correspondingly to the first main conveyance rollers 30 and are driven to rotate. The skew of the sheet S is corrected by providing the rotational speed difference around the first main rotational shaft 39 in the plurality of first main conveyance rollers 30. The positional deviation in the width direction of the sheet S is corrected by rotating sub conveyance rollers 33 of the first main conveyance rollers 30 around a first sub rotational shaft 32.SELECTED DRAWING: Figure 3
Patent JP-2018059288-A (JP)
Title: Overhang construction method
Inventor: UEDA AKIRO
IPC: E01D21/10
Filed: 2016-10-03
Abstract: PROBLEM TO BE SOLVED: To provide an overhang installation method capable of narrowing a column head for installation of a mobile work vehicle so as to perform overhang construction.SOLUTION: The overhang installation method uses: a first mobile work vehicle 10 which performs overhang construction from one end 103a of a column head 103 in the X direction (bridge axial direction); and a second mobile work vehicle 20 which performs overhang construction from the other end 103b. The first mobile work vehicle 10 includes an upper support frame 11 which comprises a front frame 11b for supporting a bridge girder block B protruding forward in the advancing direction of the overhang construction above the column head 103 and overhung, and a rear frame 11c connected to the front frame 11b and fixed to an upper surface of the column head 103. The second mobile work vehicle 20 includes: a support portion 23 fixed to the upper surface; a main member 22 connected to the support portion 23 and extending from the upper side to the lower side of the column head 103; and a lower support frame 21 connected to the main member 22, projecting forward in the advancing direction of overhang construction below the column head 103 and supporting the bridge girder block B.SELECTED DRAWING: Figure 1
Patent JP-2018059568-A (JP)
Title: Drive device for vehicle
Inventor: EBIMOTO HIROSHI
IPC: B60T8/17
Filed: 2016-10-05
Abstract: PROBLEM TO BE SOLVED: To quickly lower the rotational frequency of an input shaft without deteriorating energy efficiency during up-shifting of an automatic transmission.SOLUTION: A drive device for vehicle includes: an engine 1; an automatic transmission 4 for shifting output rotation of the engine and transmitting it to the wheel side; a regeneration device 3 for converting torque of an input shaft of the automatic transmission into energy and storing it; a shift control part for executing a shift shock reduction operation for bringing a specific friction fastening element included in the automatic transmission into a state of slipping temporarily during up-shifting of the automatic transmission; and a regeneration control part for executing a regeneration brake operation for controlling the regeneration device so that reverse torque imparted to the input shaft 16 from the regeneration device 4 increases, during execution of the shift shock reduction operation.SELECTED DRAWING: Figure 1
Patent JP-2016225322-A (JP)
Title: Method for manufacturing light emitting device
Inventor: HATANO KAORU
IPC: H05B33/10
Filed: 2016-10-06
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a light emitting device including a flexible substrate, in which separation is performed without separation at an interface between a light emitting layer and an electrode, although, in the case where the adhesion between a light emitting layer and an electrode is low, separation may occur at an interface between the light emitting layer and the electrode when a separation layer is separated from a layer to be separated by physical force.SOLUTION: In a method for manufacturing a light emitting device, a spacer made of a light absorbing material which absorbs laser beams is formed over a partition of one of substrates, a coloring layer is formed over the other substrate, and each of them is bonded on the substrates with the use of an adhesive layer. A light emitting layer and an electrode which are formed over the spacer are irradiated with a laser beam through the coloring layer, so that at least the adhesive layer among the light emitting layer, the electrode, the coloring layer, and the adhesive layer is melted to form a fixed portion where the adhesive layer and the spacer are bonded by welding.SELECTED DRAWING: Figure 5
Patent JP-2017098535-A (JP)
Title: Semiconductor device, module, electronic apparatus and semiconductor device manufacturing method
Inventor: NODA KOSEI
IPC: H01L27/08
Filed: 2016-10-07
Abstract: PROBLEM TO BE SOLVED: To provide a transistor with less parasitic capacitance; or provide a transistor having stable electric properties.SOLUTION: A semiconductor device has a first insulator on a substrate, an oxide semiconductor on the first insulator, a second insulator on the oxide semiconductor, a third insulator on the second insulator, a first conductor on the third insulator and a second conductor on the first conductor. The first conductor has a first region and a second region. The first region has a part sandwiched by the second region, and the second region has an element included in the first region and oxygen.SELECTED DRAWING: Figure 1
Patent JP-2018067414-A (JP)
Title: Mother board of board for electronic device
Inventor: HANADA SEIICHI
IPC: H05B33/02
Filed: 2016-10-18
Abstract: PROBLEM TO BE SOLVED: To provide a mother board of an electronic device board where an uneven structure is provided on the surface of a translucent substrate, and having a structure capable of protecting the uneven structure from an extraneous material, such as moisture component, dust, and the like, effectively.SOLUTION: A mother board A of an electronic device board includes a translucent substrate 1 having first and second surfaces 1a, 1b facing each other in the thickness direction, an uneven layer 2 as an uneven structure provided on the first surface 1a of the translucent substrate 1, and a translucent coating layer 3 covering the first surface 1a of the translucent substrate 1 and the uneven layer 2. Outer peripheral end 3E of the translucent coating layer 3 is at a position on the farther inner peripheral side than the outer peripheral end 1E of the translucent substrate 1, and the outer peripheral end 2E of the uneven structure 2 is at a position on the farther inner peripheral side than the outer peripheral end 3E of the translucent coating layer 3.SELECTED DRAWING: Figure 1
Patent JP-2018067474-A (JP)
Title: Method for manufacturing lithium secondary battery electrode material, method for manufacturing lithium secondary battery, and lithium-niobium solution
Inventor: ABE DAISUKE
IPC: H01M4/36
Filed: 2016-10-20
Abstract: PROBLEM TO BE SOLVED: To provide: a lithium-niobium solution improved in storage stability; and a technique which can suppress the reduction in discharge capacity and increase the production efficiency concerning a lithium secondary battery electrode and its material.SOLUTION: A method for manufacturing a lithium secondary battery electrode material and its related technique are provided. The method comprises: the step 1 of mixing an aqueous solution with a lithium salt dissolved therein, particles A composed of fine particles including at least one of a niobium oxide and a niobium hydroxide, of which the mode diameter (highest-frequency particle diameter) according to a dynamic light scattering method is 5 to 200 nm, and a lithium secondary battery positive electrode active material to obtain slurry; the step 2 of recovering powder with niobium and lithium deposited on the surface of each particle B of the lithium secondary battery positive electrode active material by applying an evaporation drying method to the slurry; and the step 3 of firing the powder at 150 to 700°C to form a lithium niobate layer on the surface of each particle B of the lithium secondary battery positive electrode active material.SELECTED DRAWING: None
Patent JP-2018066206-A (JP)
Title: Joining structure of steel pipe pile and steel column
Inventor: TANAKA EIJI
IPC: E02D27/00
Filed: 2016-10-20
Abstract: PROBLEM TO BE SOLVED: To provide a joining structure of a steel pipe pile and a steel column, which can achieve reduction in a work period and a construction cost, and which can perform adjustment of a height, an angle and a horizontal position of a steel column without welding during construction, and which is superior in a shearing transfer mechanism.SOLUTION: In this joining structure, a pile side member 3, which is fixed to a pile head of a steel pipe pile 1, and a column side member 4, which is fixed to a column base of a steel column 2, are coupled via a fastener 5 while they are spaced vertically each other. An upper part hardening filling body 7 is interposed between the pile side member 3 and the column side member 4. The pile side member 3 has a pile head mounting part 11, a pile internal insertion part 12 and a flow stopper 13. Inside the steel pipe pile 1, a space between the pile head mounting part 11 and the flow stopper 13 is filled with a lower part hardening filling body 6. By this lower part hardening filling body 6, the pile side member 3 is fixed to the steel pipe pile 1. Any one or both of a pile side fastener insertion hole 15 of the pile head mounting part 11 and a column side fastener insertion hole 25 of the column side member 4 are loose holes.SELECTED DRAWING: Figure 1
Patent JP-2017089002-A (JP)
Title: Method for fabrication of gold alloy wire
Inventor: VINCENT DENIS
IPC: B21B1/16
Filed: 2016-10-24
Abstract: PROBLEM TO BE SOLVED: To provide a condition for obtaining a gold alloy wire that allows white or grey gold alloys to be substantially improved.SOLUTION: A method for fabrication of a gold alloy wire is provided in which: an alloy is prepared containing 33.33 to 45.83% of Au, 3.64 to 12.44% of Zn, 18.46 to 45.02% of Cu, 9.88 to 33.78% of Ni and 0.0 to 5.0% of at least one element selected from among Ir, In, Ti, Si, Ga, Ra; a continuous cast bar having a diameter of 8.0 to 20.0 mm is produced; this bar is wire rolled while limiting the cross-section deformation to less than 20% per pass, preferably 13%; the cumulative deformation compared to the initial cross-section is measured; the wire rolling is stopped when the cumulative deformation reaches 60% to 75%; an anneal is performed; the wire rolling is started again and the wire rolling, measuring, annealing process is repeated until the desired cross-section is achieved; the intermediate product is drawn to obtain a section wire of circular cross-section.SELECTED DRAWING: Figure 1
Patent JP-2018019055-A (JP)
Title: Heat dissipation substrate, semiconductor package, semiconductor module, and method for manufacturing heat dissipation substrate
Inventor: FUKUI AKIRA
IPC: H05K7/20
Filed: 2016-10-24
Abstract: PROBLEM TO BE SOLVED: To provide a heat dissipation substrate which has high thermal conductivity and high electric conductivity in an XY plane and a Z-direction, does not include a void or the like, and can offer desired characteristics, and a method for manufacturing the heat dissipation substrate.SOLUTION: A heat dissipation substrate is manufactured by the steps of: inserting each insertion body including, as a core material, a second metal larger than a first metal in thermal conductivity so as to pierce a plate-like core base material including the first metal as a core material in a thickness direction to prepare a main body; disposing a plate-like heat-conducting member including, as a core material, a third metal larger than the first metal in thermal conductivity on each of front and rear faces of the main body to prepare a laminate; and sintering, by discharge plasma, the laminate at a temperature under melting points of the first, second and third metals.SELECTED DRAWING: Figure 1
Patent JP-2018071595-A (JP)
Title: Damper
Inventor: TOMITA SHIGEMITSU
IPC: F16F9/36
Filed: 2016-10-26
Abstract: PROBLEM TO BE SOLVED: To provide a damper that can control a movement of an object to be damped properly throughout the whole process thereof and is suitably made compact and thin.SOLUTION: The present invention relates to a damper consisting of a piston P comprising a rod 1, and a housing H housing the piston P, and generates brake force as the piston P operates. The piston P comprises a seal member 2 for an inner wall of the housing H, and a slider 3 coming into contact with the inner wall of the housing H with frictional force. On the generation of the brake force, the slider 3 is pressed against the seal member 2, and a part 2i, coming into contact with the inner wall of the housing H, of the seal member 2 deforms to outside the housing H. Inside the part 2i, coming into contact with the inner wall of the housing H, of the seal member 2, a deformation control part 13 is provided which suppresses the seal member 2 from deforming to the inside of the housing H.SELECTED DRAWING: Figure 3
Patent JP-2018073909-A (JP)
Title: Laminate ceramic capacitor
Inventor: ONO AKIRA
IPC: H01G4/30
Filed: 2016-10-26
Abstract: PROBLEM TO BE SOLVED: To provide a laminate ceramic capacitor with high connection strength of an external electrode and an element assembly.SOLUTION: A laminate ceramic capacitor 10 laminated in a first direction has an element assembly 11, and external electrodes 14, 15. The element assembly has: plural ceramic layers laminated in the first direction; first and second internal electrodes 12, 13 alternately arranged between the plural ceramic layers; an end face that is directed to a second direction orthogonal to the first direction and from which the first and second internal electrodes are drawn; end margin parts 20, 21 arranged between the end face and the first and second internal electrodes; a laminate part 16 directed to a third direction orthogonal to the first and second directions and having side faces on which the first and second internal electrodes are exposed; and a side margin part covering the side face of the laminate part. The external electrode has entering parts 14a, 15a arranged on the end margin part and entering between the side face and the side margin part from the end face, and covers the element assembly from the end face side.SELECTED DRAWING: Figure 5