baber/WOPTO huggingface dataset:
Patent TW-479334-B (TW)
Title: Electroplated circuit process in the ball grid array chip package structure
Inventor: LI WEN-CHENG
IPC: H05K3/24
Filed: 2001-03-06
Granted: 2002-03-11
Abstract: There is provided an electroplated process in the ball grid array chip package structure, which is suitable for forming electroplated circuit, including conductive fingers, conductive traces, and solder pads on a package substrate. The electroplated circuit process is characterized in using a drilling needle to make a temporary electrical bridging wire among the integrally and electrically connected conductive fingers, conductive traces, and solder pads in an open circuit state by drilling and grinding, thereby separating from the electroplating bus. Because the drilling procedure does not require etching solution, there is no contamination on the surfaces of the conductive fingers and solder pads, and thus subsequent waste processing and environmental protection problems are not existed. In addition, this electroplated circuit process can also decrease the total number of required branched electroplated wires and their layout density. Therefore, it is able to make the layout design process for the signal lines easier, and decrease the inductive interference between the branched electroplated wires.
Patent TW-498504-B (TW)
Title: Semiconductor device and method of manufacturing the same
Inventor: SHIOYA YOSHIMI
IPC: H01L21/768
Filed: 2001-05-01
Granted: 2002-08-11
Abstract: The present invention relates to a semiconductor device manufacturing method for forming an interlayer insulating film having a low dielectric constant by coating a copper wiring. In configuration, in a semiconductor device manufacturing method of forming an insulating film 25 having a low dielectric constant on a substrate 21, the insulating film 25 is formed by plasmanizing a film forming gas containing any one oxygen-containing gas of N2O, H2O, and CO2, ammonia (NH3), and at least one of an alkyl compound having a siloxane bond and methylsilane (SiHn(CH3)4-n: n=0, 1, 2, 3) to react.
Patent TW-I264166-B (TW)
Title: Casing locking method for cable splitter and system thereof
Inventor: LU SHAN-RUEI
IPC: H01R31/02
Filed: 2001-07-11
Granted: 2006-10-11
Abstract: This invention discloses a casing locking system of a cable splitter, and the system includes a conveying mechanism having a plurality of positioning plates equidistantly disposed on a working platform, a positioning base disposed on each positioning plate, a circulating chain mounted on internal side of the positioning plate for engaging a plurality of gears and rotated by the gears, and a screwing mechanism disposed across the top of the working platform for elevating a pressing rod and connecting a pneumatic tool and a detector, such that after the detector sends out a signal to stop the circulating chain, the pressing rod descends to press a locking cover, and the pneumatic tool also descends and is embedded by a screw nut and rotated to screw the cover with a base.
Patent TW-564325-B (TW)
Title: Image display device
Inventor: TAKEUCHI MASANORI
IPC: G09G3/36
Filed: 2001-07-12
Granted: 2003-12-01
Abstract: On a termination side of each scanning line is provided a charging switching element and a discharging switching element in parallel with each other, the charging switching element having a gate electrode which is connected with one end of a scanning auxiliary line, the other end of which is connected to a scanning line of the same stage, the discharging switching element having a gate electrode which is connected with one end of a scanning auxiliary line, the other end of which is connected to a scanning line of the following stage. Further, the charging switching element has a source/drain electrode which is connected to a scanning line and a selected state scanning driving voltage power source, whereas the discharging switching element has a source/drain electrode which is connected to a scanning line and the non-selected state scanning driving voltage power source, thereby allowing an image display device of the present invention to suppress the dull waveform of a driving voltage at both rise and fall, and prevent erroneous writing without reducing effective writing time.
Patent TW-521093-B (TW)
Title: Piston ring having improved scuffing, cracking and fatigue resistances, and its production method, as well as combination of piston ring and cylinder block
Inventor: TAKAHASHI JUNYA
IPC: C22C38/22
Filed: 2001-07-16
Granted: 2003-02-21
Abstract: A piston ring having improved scuffing resistance, cracking resistance and fatigue resistance, consists of a high-chromium martensitic stainless steel and a sliding nitriding layer formed on the surface of said steel. The stainless steel consists of C: 0.3 to 1.0%; Cr: 14.0 to 21.0%; N: 0.05 to 0.50%, at least one of Mo, V, W and Nb: 0.03 to 3.0% in total, Si: 0.1 to 1.0%; Mn: 0.1 to 1.0%; P: 0.05% or less; S: 0.05% or less. The balance being Fe and unavoidable impurities. The sliding nitriding layer comprises on its surface hard particles mainly consisting of nitrides in a range of from 0.5 to 2.0 μm of average particle size, 7 μm or less of the longest diameter, and from 5 to 30% in area %.
Patent TW-540062-B (TW)
Title: Method to improve charge pump reliability, efficiency and size
Inventor: HSU LOUIS
IPC: G11C5/14
Filed: 2001-07-23
Granted: 2003-07-01
Abstract: A dynamic clamp is used in conjunction with capacitors with thinner dielectric or with deep trench capacitors to solve the problem of dielectric breakdown in high stress capacitors. The dynamic clamp is realized using a two stage pump operation cycle such that, during a first stage pump cycle, a middle node of a pair of series connected capacitors is pre-charged to a supply voltage and, during a second stage pump cycle, the middle node is coupled by a boost clock. Thus, at any moment in the pump operation cycle, the voltage across the capacitors is held within a safety range.
Patent TW-558799-B (TW)
Title: Fabrication method of contact hole/via hole
Inventor: MA CHING-TIAN
IPC: H01L21/768
Filed: 2001-09-05
Granted: 2003-10-21
Abstract: This invention discloses a kind of fabrication method of contact hole/via hole of a semiconductor device. During the formation of the contact hole/via hole in a dielectric layer, before etching the contact hole/via hole, a deep ultra violet curing (DUV curing) is performed onto the photoresist on top of the dielectric layer to modify the property of the photoresist. Therefore, in the subsequent process of etching the contact hole/via hole, there is no need for adjusting etching recipe, and the amount of reaction gas adhered to the photoresist polymer can be reduced to decrease the amount of polymer dropped onto the etching area, thereby increasing etching rate of the contact hole/via hole, achieving greater aspect ration and obtaining better etching stop control.
Patent TW-504371-B (TW)
Title: A process of using pectin for culturing mycelium of Reichi (LingZhi), and the related healthy food
Inventor: DUNG DA-CHENG
IPC: A23L29/269
Filed: 2001-09-19
Granted: 2002-10-01
Abstract: The present invention relates to a healthy food obtained by cultivating the spawn of Reichi (LingZhi) in pectins, fruit juice or fruit and vegetable juice, as well as to the processes for the preparation thereof.
Patent TW-I236967-B (TW)
Title: Compact case forming machine
Inventor: BIERENACKI WOJCIECH
IPC: B31B50/76
Filed: 2001-09-26
Granted: 2005-08-01
Abstract: A case forming machine for assembling erected cases from blanks including a stacking means configured for receiving a supply of blanks, an opening and forming means for erecting the blanks and ejecting erected cases, and the machine is constructed and arranged so that the stacking means is configured for biasing the supply of blanks in a first direction and the forming means is configured so that the blanks are ejected in a second direction. The machine also includes a frame, a stacking apparatus for holding a supply of blanks, an opening and forming apparatus, a vertical blank guide configured to advance the supply of blanks in a first direction, a vertical blank mover for transporting blanks from the stacking apparatus to the opening and forming apparatus, a first minor flap folder and a second minor flap folder, a first major flap folder and a second major flap folder: and a case advancement mechanism attached to the opening and forming apparatus, the case advancement mechanism configured to advance cases in a second direction along the opening and forming apparatus.
Patent TW-529140-B (TW)
Title: Semiconductor packaging process and the package thereof
Inventor: SHIE WEN-LE
IPC: H01L23/12
Filed: 2001-09-26
Granted: 2003-04-21
Abstract: A thick, heat-resistant adhesive tape is applied in the present invention, and its surface is coated with a Copper layer, photoresist with good photosensitivity is coated on the Copper layer, use negative film with circuit pattern to expose it by light source, so that the photoresist remains on the surface of the Copper layer. Proceed etching operation to leave the Copper wire having circuit pattern, bond the chip to the Copper wire by wire-bonding or flip-chip, package in appropriate packaging way, tear off the heat-resistant adhesive tape to form the package.
Patent TW-518661-B (TW)
Title: Electron beam exposure method having good linearity with respect to producing fine patterns
Inventor: YANG SEUNG-HUNE
IPC: G03F7/20
Filed: 2001-09-27
Granted: 2003-01-21
Abstract: A variable shaped beam exposure method and a pattern forming method using the same exhibit excellent linearity insofar as the variation in measured critical dimension from design critical dimension is concerned. First, the design critical dimension of one of a plurality of patterns that can be formed through the use of the variable shaped beam exposure method is determined. If the value of the critical dimension exceeds a predetermined value, the selected pattern is formed using a first exposure dose which has previously designated for this case. On the other hand, if the value of the critical dimension is less than the predetermined value, the selected pattern is formed using a second exposure dose that is equal to the first exposure dose plus a supplementary exposure dose.
Patent TW-552417-B (TW)
Title: Test device and method to test the analog signal of integrated circuit
Inventor: CHEN TE-WEI
IPC: G01R1/00
Filed: 2001-11-08
Granted: 2003-09-11
Abstract: A test device and method to test the analog signal of integrated circuit is disclosed, which is for testing the integrated circuit. The test device has a test output device for disposing and electrically coupling to the integrated circuit, and a test receiving device electrically coupled to the integrated circuit. When the integrated circuit is tested, the test output device will input the test signal to the integrated circuit, so that the integrated circuit generates the test result signal which is received by the test receiving device.
Patent TW-562730-B (TW)
Title: Blow-molding method for forming bottle-shaped container
Inventor: LIN CHIUNG-CHI
IPC: B29C49/06
Filed: 2001-11-13
Granted: 2003-11-21
Abstract: A rotary injection blow-molding machine with an attachable base platen and a fixed base platen is provided. The space between these base platens is the molding space. There is a ring-shaped portion between the attachable base platen and the fixed base platen, wherein a rotary platen is mounted on one side of the ring-shaped portion. Also, there are a first molding stage and a second blowing stage between the rotary platen and the fixed base platen. A pre-form mold and a blowing rod are mounted to the attachable base platen, and respectively disposed at the first molding stage and the second blowing stage. First, a melting material is injected toward the pre-form mold to form the pre-form of the bottle at the first molding stage. Then, the attachable base platen is removed, and the rotary platen on the ring-shaped portion is vertically rotated for transferring the pre-form to the second blowing stage. The attachable base platen is then moved back to the original position. By pumping gas through the blowing rod, a bottle is blow molded from the pre-form at the second molding stage. Also, the pre-form molding at the first molding stage and blow-molding of the bottle at the second stage can be simultaneously performed.
Patent TW-565645-B (TW)
Title: Improvements in and relating to fluid valves
Inventor: TSUI WILLIAM TAK MING
IPC: D06B5/16
Filed: 2001-12-31
Granted: 2003-12-11
Abstract: The present invention provides a fluid flow reversal device (100) comprising a first conduit (1), the first conduit (1) having a cross-shaped configuration provided by a first arm (30) and a second arm (32, 34) thereof, a second conduit (6), which second conduit (6) is concentrically arranged about the first arm (30) of the first conduit (1), the second arm (32, 34) of the first conduit (1) being arranged to extend through opposing sides of the second conduit (6), and a valve (2, 3) designed to control the direction of fluid flow through the second arm (32) of the first conduit (1), in use.
Patent TW-516954-B (TW)
Title: Method for rapidly forming artificial tooth and artificial tooth made therefrom
Inventor: FANG JENG-GUO
IPC: A61C13/08
Filed: 2002-01-28
Granted: 2003-01-11
Abstract: The present invention provides a method for rapidly forming an artificial tooth and an artificial tooth made therefrom. The method sequentially comprises a base mold forming step, a trial wearing step, and a trimming step. A base mold, that is most suitable for a user and conforms to the roof of the mouth, is selected from a plurality of base molds. A filling material, that can be hardened quickly, is coated on the base mold, and is used to adhere to the roof of the mouth of a user. The base mold is removed, and the filling material is hardened before the overflowed filling material is trimmed off, thereby obtaining an artificial tooth that can accurately conform to the shape of the roof of the mouth of a user and has a strong adhesion.
Patent TW-538432-B (TW)
Title: Ultra fast rapid thermal processing chamber and method of use
Inventor: MAHAWILI IMAD PH D
IPC: H01L21/00
Filed: 2002-02-15
Granted: 2003-06-21
Abstract: An apparatus and method of processing a semiconductor substrate that controls heating of the substrate to thereby control the depth of the junctions formed by impurities implanted in the semiconductor substrate by heating a non-device side of the semiconductor substrate to a reference temperature and heating the device side of the semiconductor substrate to a heat activation temperature that is greater than the reference temperature for an activation period, which provides sufficient energy to activate the impurities so that they become part of the lattice structure of the substrate while minimizing diffusion of the impurities across the substrate and reducing the temperature gradient in the substrate to minimize stress in the substrate.
Patent TW-I243265-B (TW)
Title: Method for forming a reflection-type light diffuser
Inventor: WEI CHUNG-KUANG
IPC: G03F7/20
Filed: 2002-02-27
Granted: 2005-11-11
Abstract: A reflection-type light diffuser is fabricated on a glass substrate, which has a pixel matrix array disposed thereon. The pixel matrix array includes a plurality of adjacent pixel regions, and each of the pixel regions has a pair of side edges that are parallel and opposite. A photoresist pattern is formed on the glass substrate, and the photoresist pattern includes a plurality of wave-shaped slit structures formed on the side edges of each of the pixel regions and a plurality of bump structures formed on each of the pixel regions. A reflective metal layer is formed on the photoresist pattern.
Patent TW-544903-B (TW)
Title: Semiconductor component with at least one semiconductor chip on a base chip serving as a substrate and method of production the said component
Inventor: HUEBNER HOLGER
IPC: H01L25/18
Filed: 2002-04-30
Granted: 2003-08-01
Abstract: The invention proposes a semiconductor component with at least one semiconductor chip on a base chip serving as a substrate, in which the at least one semiconductor chip and the base chip have contact areas of metal. The semiconductor chip and the base chip are aliened with respect to each other in such a way that mutually assigned contact areas of the at least one semiconductor chip and of the base chip are facing one another and the mutually facing contact areas are connected to one another in an electrically conducting manner. The distance between a respective contact area of the at least one semiconductor chip and the contact area connected to it of the base chip is in this case less than 10 mum. The base chip contains components which are produced by a first technology, while the at least one semiconductor chip contains components which are produced by a second technology.
Patent TW-564277-B (TW)
Title: Lid-locking device for washing machine
Inventor: HIROOKA HIROSHI
IPC: D06F37/28
Filed: 2002-05-06
Granted: 2003-12-01
Abstract: To provide a lid locking device for a washing machine in an electrically simple structure without using complicated mechanisms, capable of surely locking a lid, improving reliability and reducing a manufacture cost. In the washing machine, an outer tub is freely swingably suspended inside an outer box, a washing and dehydrating tub having a rotary blade at a bottom part is freely rotatably disposed inside the outer tub, the upper part of the outer box is covered with a top cover with a clothes feeding port to the washing and dehydrating tub, the lid is provided so as to open and close the clothes feeding port and the lid locking device 8 for locking the lid so as not to be opened during a dehydrating operation is provided. The lid locking device 8 is constituted of a slider 14 for which a tip is formed at a lid locking part 14a and a permanent magnet 13 is fixed, an electromagnetic coil 9 arranged at a position perpendicular to the slider 14 and moving the slider 14 to a locking position and a release position and the yoke 10 of the electromagnetic coil 9.
Patent TW-I226985-B (TW)
Title: Data transmission circuit for universal serial bus
Inventor: LEE HAK-MIN
IPC: H04L29/02
Filed: 2002-05-30
Granted: 2005-01-21
Abstract: The data transmission circuit has a test mode for offsetting variation of crossover voltages of the first and second data signals, which rises from threshold voltage distribution of plural transistors embedded in a transceiver. The transceiver converts an external test clock signal into the first and second data signals to be transferred to the first and second data lines, making the first and second data signals be set with predetermined delay times. The delay times of the first and second data signals are adjusted when those crossover voltages deviate from a predetermined range, so that the crossover voltages of bus-specific data signals generated from the USB low-speed transceiver are always positioned within a normal range.
Patent TW-594122-B (TW)
Title: Control device of a liquid crystal display device
Inventor: KAWANO HIDEO
IPC: G09G3/20
Filed: 2002-06-20
Granted: 2004-06-21
Abstract: It is intended to provide a control device of a liquid crystal display device which can increase the response speed of liquid crystal display devices of the IPS mode and other modes without lowering the liquid crystal elastic torque. Image signals are supplied in such a manner that one display pattern is displayed in two consecutive frames that are a first frame and a second frame. When the image signal voltage is increased to produce an increased luminance value, the image signal voltage is made higher than a gradation voltage value corresponding to the increased luminance value in the first frame and is made equal to the gradation voltage value corresponding to the increased luminance value in the second frame. When the image signal voltage is decreased to produce a decreased luminance value, the image signal voltage is made approximately equal to a counter voltage value of a counter substrate in the first frame and is made equal to a gradation voltage value corresponding to the decreased luminance value in the second frame.
Patent TW-583402-B (TW)
Title: Test socket
Inventor: FRANKOWSKY GERD
IPC: G01R1/04
Filed: 2002-07-10
Granted: 2004-04-11
Abstract: A test socket for a semiconductor device includes a guide plate operable to receive the semiconductor device and to maintain electrical terminals of the semiconductor device in registration with electrical terminals of a base, a shell operable to couple to the base and to maintain the guide plate in registration with the electrical terminals of the base, the shell including an aperture in communication with the base through which the guide plate can be inserted and removed when the shell is coupled to the base; and at least one fastener coupled to the shell and operable to maintain the semiconductor device in engagement with the guide plate and to urge the electrical terminals of the semiconductor device in contact with the electrical terminals of the base. A method for operating the test socket is also disclosed.
Patent TW-I251096-B (TW)
Title: Liquid crystal display device
Inventor: KOSHIO YOSHITUGU
IPC: G02F1/133
Filed: 2002-08-21
Granted: 2006-03-11
Abstract: The present invention provides a liquid crystal display device in which fluctuation in the amount of input voltage leak is suppressed and the amount of leak of a single body is stabilized. The liquid crystal display device 50 of the presentation stores the cable for built-in lamp 5 or cable 6 connected to inverter using the storage compartment 12 located at the bottom of back light frame 7. Therefore the distance between cable 10 of the low voltage side and cable 11 of high voltage side and the distance between conductor and cable 6 is fixed.
Patent TW-592814-B (TW)
Title: Double-metal cyanide catalysts for preparing polyether polyols
Inventor: SCHAFER WALTER
IPC: B01J27/26
Filed: 2002-08-28
Granted: 2004-06-21
Abstract: The invention relates to double-metal cyanide (DMC) catalysts for preparing polyether polyols by the polyaddition of alkylene oxides on to starter compounds containing active hydrogen atoms, wherein the DMC catalysts are composed of: (a) at least one DMC compound; (b) at least one organic complexing ligand which is not a coronand; and (c) at least one coronand. The DMC catalysts of the present invention have increased activity compared to known catalysts.
Patent TW-546234-B (TW)
Title: Load storage equipment
Inventor: INUI YOSHITAKA
IPC: B65G1/04
Filed: 2002-08-28
Granted: 2003-08-11
Abstract: According to the present invention, there is provided compact load storage equipment that can store a large number of loads. The storage equipment comprises a rotary rack 21, a transferrer 51, one or more fixed racks 101, an inlet port 111a and an outlet port 111b. The rotary rack 21 is supported rotatably around a first vertical axis and includes a number of vertically arranged stages of turning load supports 32. The transferrer 51 adjoins the rotary rack 21 and includes a carrier 81, which can vertically move and turn on a second vertical axis. The fixed racks 101 are positioned in a space around the transferrer 51 and each includes a number of vertically arranged stages of fixed load supports 103. The ports 111a and 111b each overlap with one of the rotary and fixed racks 21 and 101 in plan view. The transferrer 51 can transfer loads between the carrier 81 and any one of the turning and fixed load supports 32 and 103, and between the carrier 81 and each of the ports 111a and 111b, by means of the turning and vertical movement of the carrier 81, or by means of the combination of the turning and vertical movement of the carrier 81 and the turning of the turning load supports 32.
Patent TW-578335-B (TW)
Title: Electrical contact for improved wiping action
Inventor: BRANDT JEFFREY J
IPC: H01R13/24
Filed: 2002-08-30
Granted: 2004-03-01
Abstract: A contact for use in an IC test socket having a body with a generally linear interface surface. The contact is adapted to be pivotally movable with respect to the socket.