baber/WOPTO huggingface dataset:
Patent JP-S5939493-A (JP)
Title: Brazing material
Inventor: KASHIWAGI KOUZOU
IPC: B23K35/30
Filed: 1982-08-27
Abstract: PURPOSE:To provide a brazing material which is low in a brazing temp. and high in a heat resisting temp., has good wettability and joint strength and is adapted to joining of sintered hard and tool steels, by limiting the composition of Ag, Cu, Zn, Cd, Ni, Mn or the like. CONSTITUTION:A brazing material consisting of 30-46wt% Ag, 10-35% Cu, 10-35% Zn, 10-30% Cd, 1-5% Ni, 1-7% Mn, and the balance unavoidable impurities, with 50-70% Ag+Cu, and is adapted to joining of sintered hard and tool steels or the like. The reason for limiting the above-mentioned compsn. lies in that, if Ag is <30%, fluidity of the brazing material and wettability are poor and at 46% or above, the m.p. increases, resulting in decreased workability. If Cu is <10%, the fluidity of the brazing material is poor, and at 35% or above, the m.p. increases. If Ag+Cu is <50%, workability is poor and if 70% or above, the m.p. increases. The m.p. is not decreased if Zn, Cd, Mn are at the lower limit or below and the workability is poor at the upper limit or above. The brazing strength is low if Ni is <=1% and the m.p. increases if 5% or above.
Patent JP-S5850756-A (JP)
Title: Forming method for bump
Inventor: KIMURA KAZUO
IPC: H01L21/306
Filed: 1981-09-19
Abstract: PURPOSE:To remarkably reduce the fraction defective in an etching process by a method wherein a passivation Si glass film (PSG film) employed as a protective film is further coated with a resin layer for the purpose of filling up the pinholes in the PSG film. CONSTITUTION:On the surface of a semiconductor 11, a PSG film 12, contact metal layer 13, barrier metal layer 13, photoresist layer 14 are provided. A bump 15 is built by Au plating or the like on an Al pad 16 on the surface of the semiconductor 11. Etching follows for the removal of the contact metal layer 13 and barrier metal layer 13. In the formation of a bump, a protective film that is  a resist coating layer 17 is added onto the PSG film 12, preventing an etchant from attacking the semiconductor surface through pinholes in the PSG layer 12. A polyimide resin is used, because of high chemical-resistant feature and adhesiveness and because it is easily affected by a selectively attaching etchant, to form the resin coating layer 17.
Patent JP-S5272252-A (JP)
Title: Ultrasonic transmitter and receiver
Inventor: KAWASAKI OSAMU
IPC: G01S7/521
Filed: 1975-12-12
Abstract: PURPOSE: Plural square plate form or disc form piezoelectric resonators are used as array elements and the position of each element is fixed only through its surrounding part, whereby ultrasonic directive characteristics, transmission efficiency and reception sensitivity are improved. 
     COPYRIGHT: (C)1977,JPO&Japio
Patent JP-S5937517-A (JP)
Title: Terminal connection part of optical fiber cable
Inventor: IKENAGA TOSHIO
IPC: G02B6/38
Filed: 1982-08-27
Abstract: PURPOSE:To prevent the breaking of an optical cable by connecting tension members by a sleeve and press-contacting an inclusion fixedly by a sleeve. CONSTITUTION:The tension member 9 is inserted into a tension member anchor sleeve 7 and press-contacted by a compressing tool. Then, the inclusion 3 such as Keplerian fibers are arranged around the tension member anchor sleeve 7 and an inclusion anchor sleeve 6 are provided to press-contacting the sleeves 6 and 7 with the inclusive 3 inbetween. Further, an X-type branching connector fixing plate 8 is provided in the center of the sleeve 6, and an X-type branching connector 5 is fixed tothe connector fixing plate 8. Then, a connection connector 4 wherein the terminal of an optical fiber 2 is fitted is couled with the connector 5. Thus, the prevention of breaking of the optical cable is secured.
Patent JP-S5852357-A (JP)
Title: Dioxazine compound, production thereof and method for using the same
Inventor: NAKATOU KAZUMASA
IPC: C09B19/02
Filed: 1981-09-22
Abstract: MEW MATERIAL:Novel dioxazine compounds of formulaIwherein R is methyl, n-propyl, n-butyl, methoxyethyl, ethoxyethyl, methoxypropyl. USE:The compounds have blue to reddish purple tone, a high tinting strength, and excellent resistance to light, heat, bleed and solvents, and are used for coloring of printing ink, paints, natural and synthetic resins and spinning solution, or  for pigment printing of fibrous materials. PREPARATION:Two mol of a carbazole compd. of formula II is condensed with one mol of chloranil in an inert solvent such as 0-dichlorobenzene in the presence of an acid acceptor such as potassium carbonate. Then the condensate is  cyclized with heating in the presence of a cyclizing agent such as p-toluenesulfonyl chloride to obtain the desired dioxazine compd.
Patent JP-S635518-A (JP)
Title: Manufacture of semiconductor device
Inventor: HITOMI TAKANORI
IPC: H01L21/225
Filed: 1986-06-25
Abstract: PURPOSE:To perform a high density impurity doping on the first and the second semiconductor layers by a method wherein, after impurities have been coated on the surface of the first semiconductor layer, the second semiconductor layer is formed on the impurities, and the impurities are diffused on the first and the second semiconductor layers from between the two layers. CONSTITUTION:After an impurity coating liquid 12A has been coated on the surface of the first semiconductor layer (silicon substrate) 2, the second semiconductor layer (polysilicon layer) 10 is formed on said impurity coating liquid 12A. Then, the impurity coating liquid 12A, coated on the first and the second semiconductor layers 2 and 10 from between the two layers, is diffused. As a result, a high density doping can be made possible, and the impurity density can be increased on the region ranging from the boundary region of the first and the second semiconductor layers 2 and 10 toward the first and the second semiconductor layers 2 and 10.
Patent JP-H022785-A (JP)
Title: Network test system
Inventor: KOBAYASHI HIROSHI
IPC: H04Q1/24
Filed: 1988-06-15
Abstract: PURPOSE:To also enable a test between devices to be performed by providing a signal folding function for test and a function to send a test signal folded after being sent to a transmission equipment to a time divisional speech path device at an I interface device connected to the time divisional speech path device with plural transmission equipment. CONSTITUTION:The test of the time divisional speech path device 2 is performed by utilizing an idle slot in the time divisional multiplexing frame of the device 2 and folding test data at the device 2. The data is folded at the I interface signal devices 11 and 12 in the idle slot time of highways HW11 and HW12 corresponding to a control signal in the data, and also, furthermore, it is sent to the transmission equipments 41 and 42, and is folded at the equipments 41 and 42, and the confirmation of continuity not only for the device 2 but among the devices 2, 11 and 12, and 41 and 42 can be performed, and the discrimination of a faulty part at the time of generating a fault on a speech path can be performed.
Patent JP-S5574830-A (JP)
Title: Manufacturing of large-sized synthetic resin pallet
Inventor: SAMEJIMA MASAHIRO
IPC: B29C65/00
Filed: 1978-12-01
Abstract: PURPOSE: To make a splid, and superior large-sized pallet at low cost by a conventional facility by abutting adhering surfaces of a symmetrical in-process item formed by a plurality of molded parts adhered with each other to form an integral body.  
     CONSTITUTION: Adhering parts 11, 12, 13, 14, and 15 are combined by one adhering operation to make an in-process item A of a half of the pallet. Then this in- process item A is rotated by 180° and placed to face (dividing line 10) with in- process item A', the items are adhered to form an integral pallet. It is possible to minituarize the adhered parts by dividing them, a large-sized molding machine or mold may be eliminated a cost of facility and other related expenditure are decreased to enable a cost-down of the item to be realized. Further dividing the item into a number of adhered parts may enable a complex structure to be made and thereby it is possible to get a solid, safe and highly strong ultra large-sized pallet. 
     COPYRIGHT: (C)1980,JPO&Japio
Patent JP-S5672543-A (JP)
Title: Signal switching system
Inventor: WATARIKAWA KATSUYUKI
IPC: H04B1/16
Filed: 1979-11-16
Abstract: PURPOSE:To make an alarm sound and a broadcasting sound output from the same speaker, by processing an alarm signal and a radio signal by using in common the specific circuit in the tuner. CONSTITUTION:When only the timer setting operation key of the external input key operation panel 13 is operated, an output of the mode setting part 123 becomes low, and when the timer setting prescribed time comes in this state, high outputs are obtained to the output terminals t1, t2 of the microcomputer 12, the muting operation switching device 7 and the alarm signal on-off device 9 are operated, and the radio signal on-off device 8 is not operated. As a result, the radio signal is muted, the alarm signal is input to the sound amplifier 6, and they are output from the speaker 14.
Patent JP-H0444243-A (JP)
Title: Test substrate control system of bar-in testing device
Inventor: HIRATA YUTAKA
IPC: G01R31/26
Filed: 1990-06-07
Abstract: PURPOSE:To enable abnormality due to voltage noise, that of wiring resistance, that due to leak current, and that due to high temperature to be confirmed by providing a device for recognizing an individual BT substrate at a bar-in testing device and a monitor device and by providing a bar code for displaying the BT substrate individually at the BT substrate. CONSTITUTION:A recognition device detects a bar code which is provided at a BT substrate when inserting the BT substrate into bar-in testing device and the data is transferred to a monitor device. Then, when characteristics of an IC deteriorate rapidly and the IC is damaged due to abnormality in voltage noise which is produced on the BT substrate, abnormality of wiring resistance, abnormality due to leak current, and abnormality due to high temperature, a detection device of the bar-in testing device detects BT input abnormality and transfers its detection signal to a monitor device, thus enabling the BT substrate where the BT input abnormality occurred to be recognized and the number of BT input abnormalities to be counted. A BT substrate where abnormalities tend to occur easily can be found by collecting data obtained by counting the number of BT input abnormalities and by performing its statistical analysis.
Patent JP-H11343127-A (JP)
Title: Production of glass craft work
Inventor: TAKIGUCHI YOSHIHIRO
IPC: C03B19/06
Filed: 1998-05-29
Abstract: PROBLEM TO BE SOLVED: To produce glass craft works without such problems that a complicated form can not be produced unless trained techniques or large-scale equipment are used, by adding polysaccharides and an oil and fat to powder glass having a specified or higher softening point, kneading and molding the mixture with addition of water, and then firing. SOLUTION: Polysaccharides such as methylcellulose, hydroxyethylcellulose and glucan are added by 2 to 16 wt.% and an oil and fat such as di-2-ethylhexyl phthalate, octyl phthalate, oleic acid and olive oil is added by 1 to 10 wt.% to 100 wt.% of powder glass having >=650 deg.C softening temp. Further, water is added by 15 to 40 wt.% to the mixture and kneaded. If necessary, desired pigments such as pigments for vitreous enamel and pigments for ceramics are added. The kneaded glass clay material is formed into a desired shape, dried for 5 to 6 hours, and tired at about 650 to 1000 deg.C in air by using an electric furnace to obtain a glass craft work having light transmitting property, gloss and color intrinsic to glass.
Patent JP-H0812436-A (JP)
Title: Production of sintered silicon carbide
Inventor: TATENO SHUICHI
IPC: C04B35/573
Filed: 1994-06-30
Abstract: PURPOSE:To easily produce a sintered silicon carbide preventing the generation of crack by applying a specific paste to a formed article composed of SiC and C and subjecting the coated product to a specific treatment to fill the pores of the formed article with SiC and Si and densify the article. CONSTITUTION:This sintered silicon carbide is produced by coating a formed article composed of SiC and C with a paste composed of 100 pts.wt. of metallic Si, 20-100 pts.wt. of an organic solvent (e.g. isopropyl alcohol) and 0.5-15 pts.wt. of an organic binder (e.g. phenolic resin), impregnating the formed article with Si in excess of the amount necessary for completely silicifying the C in the formed article and heat-treating the product at 1400-1700 deg.C to fill the pores of the formed article with SiC and Si and densify the article.
Patent JP-S6211518-A (JP)
Title: Purifying device for bath water
Inventor: ONO ITARU
IPC: B01D35/027
Filed: 1985-07-08
Abstract: PURPOSE:To remove suspended matter on the water surface through a filter by providing a float on the water surface and providing a pipe connecting the filter to a filter. CONSTITUTION:A float 8 floating on the water surface sucks the surfacial water 7 and suspended matters 6 by the suction force of a pump 3, and dusts are collected in a filter 1 through a connecting pipe 9. As the result, suspended matters 6 on the water surface are sucked together with surfacial water by the float 8 and collected in the filter 1, suspended matters 6 are sucked securely even if the water surface is apart from a circulating port at the bottom of a bath 11.
Patent JP-S5273644-A (JP)
Title: Information processor
Inventor: KATOU MASAO
IPC: G06F12/16
Filed: 1975-12-17
Abstract: PURPOSE: The writing control section is provided to instruction in order to secure performance of both memory career information reading and writing with a single instruction in any case. As a result, reduction of program instruction step as well as shortening of execution time can be realized. 
     COPYRIGHT: (C)1977,JPO&Japio
Patent JP-S6129092-A (JP)
Inventor: NAKAHIRA HIROSHI
IPC: H05B7/08
Filed: 1984-07-20
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H0443388-A (JP)
Title: Structure and assembling method for lighting type liquid crystal display
Inventor: HIRAFUJI KAZUO
IPC: H04N5/66
Filed: 1990-06-11
Abstract: PURPOSE:To make the area of the display part of the liquid crystal display large by providing printed board which have lighting means on the right and left flanks of a face lighting means in contact. CONSTITUTION:An external frame 10a in a rectangular prism shape is formed of a resin material which is painted in white and a photoconductor plate 10b is provided in the recessed part 10a1 of the external frame 10a; and printed boards 10c where two LEDs 10d and 10d are fixed is fixed on the right and left flanks of the photoconductor plate 10c and the LEDs 10a and 10d are fitted in holes formed in the right and left flanks of the photoconductor plate 10c. Further, wiring patterns for supplying currents to the LEDs 10d are formed on the printed boards with the LEDs. Consequently, the area of the display part of the liquid crystal display 12 where character, symbols, etc., are displayed can be made large.
Patent JP-H09305420-A (JP)
Title: Device and method for controlling and testing tuple space communication
Inventor: KOZUKA HIROSHI
IPC: G06F11/22
Filed: 1996-05-20
Abstract: PROBLEM TO BE SOLVED: To improve the efficiency of tuple space communication by arranging a tuple redirect means between a network and tuple space communication equipment, temporarily capturing a tuple to pass there and temporarily holding this captured tuple in a tuple holding means. SOLUTION: Between a network 4 and tuple space communication equipment 1, a tuple redirect means 6 is arranged for capturing the tuple to pass there or sending the tuple from a controller 5 to the tuple space communication equipment 1 or the network 4. Then, a tuple holding means 7 is provided for temporarily holding the tuple captured by this tuple redirect means 6, and the tuple transferred between an application process 3 and the tuple space communication equipment 1 is temporarily captured. Thus, the efficiency of tuple space communication can be improved.
Patent JP-S6040340-A (JP)
Title: Paper feeder
Inventor: TAMURA TAKASHI
IPC: G03G15/00
Filed: 1983-08-16
Abstract: PURPOSE:To lift/lower a recording paper mounting table while balancing through simple structure employing crossed wire-suspension system. CONSTITUTION:A recording paper (P) mounted on an elevating table 41 where the longitudinal and lateral directions are restricted respectively by a rear end 32 and a side guide board is carried by a roller 33 into a copy machine. Synchronously with lowering of the height of recording paper, a drive motor 50 will start to rotate the coaxial pulleys 42, 42a to the right through a warm 52 and a warm gear 49 thus to move the elevating table 41 while maintaining the horizontal state upwardly in parallel through crossed wires 47, 47a and to continuously contact the uppermost recording paper (P) against a feed roller 33. Consequently, the recording paper mounting table can be moved in parallel accurately while balancing resulting in smooth carry-out of recording paper.
Patent JP-S63312814-A (JP)
Title: Molding of plate-shape synthetic resin molded item
Inventor: HOSOKAWA TOSHIHIRO
IPC: B29K105/08
Filed: 1987-06-16
Abstract: PURPOSE:To prevent a reinforced body from deformation due to injection pressure, by using a flat product woven with a reinforcing wire as the reinforcing body placed in a mold when injection molding is done. CONSTITUTION:A reinforcing wire 2 is prepared by placing powder 5 between a plurality of reinforcing fibers 3, bundling them and coating them with a flexible thermoplastic synthetic resin coating 4. A flat reinforcing body 1 is prepared by weaving this reinforcing wire 2. This reinforcing body 1 is placed in a mold 7. While a thermoplastic synthetic resin molding material 6 is being poured, molds are jointed and the reinforcing body 1 is integrally buried in the synthetic resin molding material 6. As the flat reinforcing body 1 woven with the reinforcing wire 2 is used, no deviation nor deformation occurs due to flow pressure of the synthetic resin molding material 6 when injection molding is done and smooth molding operation can be carried out.
Patent JP-S5373590-A (JP)
Title: New penicillin derivatives
Inventor: MORITA YOSHIMI
IPC: A61P31/04
Filed: 1976-12-14
Abstract: PURPOSE: Penicillin derivatives I and their salts (X is H or amino-protective groups; R is H or lower alkyl; Y is H, OH or amino). E.g., potassium 6-[D-2-(Nbenzyloxycarbonylprolyl) glycylamino-2-phenylacetamide] penicillanate. 
     COPYRIGHT: (C)1978,JPO&Japio
Patent JP-S6128821-A (JP)
Title: Ultrasonic flow meter
Inventor: YOSHIMURA HIROYUKI
IPC: G01F1/66
Filed: 1984-07-19
Abstract: PURPOSE:To perform highly accurate measurement by attenuating multiple reflected waves in piping for transferring a fluid, by providing a sonic wave absorber to the surface of the piping while providing an ultrasonic transmitter- receiver on said sonic wave absorber. CONSTITUTION:A sonic wave absorber 14 attenuating multiple reflected waves propagating through piping 1 for transferring a fluid is adhered or formed to the circumferences of the ultrasonic transmitter-receivers 2a, 2b of the piping 1 and the propagation path of reflected sonic waves subjected to multipath reflection in the piping 1. This sonic wave absorber 14 allows the acoustic impedance of the piping and the acoustic impedance matching layer of the sonic wave absorber 14 to coincide in order to absrob multiple reflection waves propagating through the piping 1 and it is necessary to satisfy such a condition that an absorber having good absorptivity is used in the material on and after the acoustic impedance matching layer of the absorber 14.
Patent JP-H0317566-A (JP)
Title: Apparatus for inspecting printed circuit board
Inventor: KOIWAI TAKU
IPC: H05K13/08
Filed: 1989-06-15
Abstract: PURPOSE:To discriminate whether the mounting state of a part is good by providing a movable shaft to the upper part of a part to be inspected and electrically measuring a contact opening and closing at the lower dead point of the movable shaft. CONSTITUTION:A board press frame 2 and a pin board 4 are set to an inspection apparatus main body 1 and a printed circuit board 3 to be inspected is placed on the pin board 4. Next, when the press frame 2 is pushed downwardly through a press part 7, the board 3 and the pin board 4 are brought to a pressure contact state and, at the same time, a movable shaft 12 is moved upwardly by a mechanism part 18 to close electrodes 14, 21 and a movable shaft 13 is held to a downwardly moved state to bring electrodes 16, 22 to an open state. Next, the lead wires 23 led out from the electrodes 14, 16, 21, 22 are selected by a scanner 5 to apply current/voltage to said electrodes and the detection data thereof are compared with the reference data from a good printed circuit board by a measuring part 6 to make it possible to discriminate that the part 18 is mounted exactly.
Patent JP-H022946-A (JP)
Title: Conduction detecting method for electronic circuit wire
Inventor: UEDA TETSUYA
IPC: G01R31/28
Filed: 1988-06-17
Abstract: PURPOSE:To make it possible to check leaking points and the like readily by bringing an electrode terminal into contact with each electronic wire securely without applying a large load. CONSTITUTION:A scanning stage 2 is moved backward, and the lower surface of power feeding terminal 10 is brought into contact with an electrode board A so that the terminal pushes the board A lightly. Furthermore, a probe 5 is held at an angle so that the tip of the probe is in contact with the upper surface of the board A lightly. When the scanning stage 2 is moved forward under this state, the terminal 10 is slid over the board A along a plurality of electrode patterns A1 so as to scan the pattern A1. The probe 5 is brought into contact with each piece of the pattern A1. The slant angle of the probe 5 is changed in conformity with the relief of the board. The probe 5 scans the pattern A1 in the crossing movement. During the scanning, the probe 5 and the terminal 10 are in contact with the same electronic circuit without fail even if the pitches of the electronic circuits are different at one side end part and the other side end part of the board A. When a non-conductive part is present in the pattern A1 and a voltage is applied across both end parts of the same circuit line by the movement of the scanning stage 2, the change in said voltage is read with a judging device. Thus the presence or absence of abnormality is detected.
Patent JP-S5852860-A (JP)
Title: Semiconductor device and manufacture thereof
Inventor: SATOU HAJIME
IPC: H01L23/495
Filed: 1981-09-25
Abstract: PURPOSE:To make the soldering property highly reliable by employing less man hours and at low cost by a method wherein, when the semiconductor devices such as IC and LSI are actually installed on substrate, lead layer and tin layer are successively and separately formed on the surface of lead frame before assembling operation such as pelleting on lead frame and the like is performed. CONSTITUTION:The lead plated layer 2 is formed on the outer lead 1A only of lead frame 1 and tin plated layer 3 is successively and separately formed on said layer 2, while the inner lead 1B of lead from 1 and the tab 1C for pelleting are not plated with Pb, Sn at all. The plated layers 2 and 3 are formed before the assembling operation such as pelleting is performed on the tab 1C of lead frame 1. The tin plated layer 3 is formed on the lead plated layer 2 formed as the primary plated layer. The soldering property may be made highly reliable since the lead shall not be oxidized even by heating at high temperature.