Patent SG-11201811325Q-A (SG)
Title: Wafer alignment method and system
Inventor: MAINS PETER
IPC: H01L21/68
Filed: 2017-12-20
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 1111111011111111101 111111111101111101011101011111111110111100111111111011110111111 Organization International Bureau (10) International Publication Number (43) International Publication Date ......0\" WO 2018/144154 Al 09 August 2018 (09.08.2018) WI P0 I P C T _ (51) (21) (22) (25) Filing Language: (26) (30) (71) (72) (74) (81) International Patent Classification: H01L 21/02 (2006.01) HO1L 21/68 International Application Number: International Filing Date: 20 December 2017 (20.12.2017) Publication Language: Priority Data: 62/452,602 31 January 2017 (31.01.2017) Applicant: ILLUMINA, INC. [US/US]; Way, San Diego, California 92122 (US). Inventors: MAINS, Peter; 5200 Illumina California 92122 (US). PRABHU, Anmiv PCT/US2017/067496 DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, (2006.01) HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. English (84) Designated States (unless otherwise indicated, for every English kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, US TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FL FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, 5200 Illumina MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, Way, San Diego, KM, ML, MR, NE, SN, TD, TG). S.; 5200 Illumi- CAPELLA, Declarations under Rule 4.17: California 92122 — as to the identity of the inventor (Rule 4.17(i)) Way, San Diego, — as to applicant's entitlement to apply for and be granted a patent (Rule 4.1700) Dierker & Ka- Published: Suite 109, Troy, — with international search report (Art. 21(3)) for every AG, AL, AM, BR, BW, BY, BZ, DK, DM, DO, na Way, San Diego, California 92122 (US). Richard; 5200 Illumina Way, San Diego, (US). SAMIEE, Kevan; 5200 Illumina California 92122 (US). Agent: DIERKER, Julia Church et al.; vanaugh, P.C., 3331 W. Big Beaver Road, Michigan 48084 (US). Designated States (unless otherwise indicated, kind of national protection available): AE, AO, AT, AU, AZ, BA, BB, BG, BH, BN, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, = = = = _ = — = = Title: WAFER ALIGNMENT METHOD I. 11 : Wafers are aligned with one another including a pivot-notch that allows for two-point contact, and a stop-notch that provides for pressing the wafers into engagement with the two-contact element when it is in the when it is in the stop-notch. The wafers may be bonded to one another to maintain the (54) ,.. element AND SYSTEM 82 98 100 102 each wafer. Notches are formed in each for single-point contact. A bias-notch is pivot-notch and with the single-contact alignment of the referenced features. = = = 66 = 0 0 64 46 38 108 76, 78 104 74 = = = _ = — iv 1-1 iv 1-1 iv iv 1-1 p i p (57) - wafer, 0 el formed 106 50 90 by reference to features formed on or in