baber/WOPTO huggingface dataset:
Patent JP-S61243002-A (JP)
Title: Insect repellent
Inventor: MATSUI MASANAO
IPC: A01N31/02
Filed: 1985-04-19
Abstract: PURPOSE:An insect repellent for clothing that contains, as an active ingredient, 1,1,2,2-tetramethylpropane derivative, thus having sublimation properties with high insect repellence without toxicity and being also used as a perfume, because it has a comphor-like and specific cool smell. CONSTITUTION:The objective repellent contains, as an active ingredient, at least one of 1,1,2,2-tetramethylpropane derivative of the formula (R is OH, Br, Cl) such as 1,1,2,2-tetramethylpropanol. The compound is used to control pests to clothing such as museum beetles or Tineola bisselliela Hummel, after it is absorbed in a variety of porous materials or molded together with various resins into a variety of shapes. EFFECT:It has the same level of insect repellence as p-dichlorobenzene without troubles such as imprenation of clothing with strange smells, moreover it has wider application, can be molded into any shapes. Further, it is convenient for consumers, because it can be directly seen with eyes the end point of the repelling activity with the proceeding of sublimation.
Patent JP-S59208766-A (JP)
Title: Semiconductor pellet mounted body and manufacture thereof
Inventor: ENOMOTO MINORU
IPC: H05K3/30
Filed: 1983-05-13
Abstract: PURPOSE:To form connecting solder into desired pole shape or hourglass shape by a method wherein a plurality of electrodes are provided on the back side circumferential part of a semiconductor pellet, and when the electrodes are connected to an insulating substrate using solder, isolated electrodes are provided between side electrodes, the isolation solder having the melting point higher than that of the connecting solder and an isolation solder receptacle are formed on the isolated electrodes, and the isolation solder is fused retardedly when the pellet and the substrate are connected by fusing the connecting solder. CONSTITUTION:A plurality of electrodes 2 are provided on the back side circumferential part of the semconductor pellet 3, an adhesion solder hillocks 25 are adhered to the surface of said electrodes 2, and connecting electrodes 5 having a solder hillock 7 on the surface are provided on the surface of the insulating substrate 4, whereon the pellet 1 will be adhered, corresponding to the solder hillocks 25. Also an isolated electrode 16, consisting of a solder hillock 26 containing isolation solder 17 of the melting point higher than that of the solder hillocks 7 and 25, is provided between the electrodes 2, and when the pellet 1 and the substrate 4 are adhered by fusing the solder hillocks 7 and 25, and the solder 17 is fused retardedly, thereby enabling to push up the pellet. While the above process is being performed, the solder hillocks 7 and 25 are formed into the prescribed pole shape or hourglass shape, and they are soldified.
Patent JP-H08275738-A (JP)
Title: Simultaneous cooking of different food material and food material retainer for cooking
Inventor: MUKAI ISAMU
IPC: A23L5/10
Filed: 1995-04-07
Abstract: PURPOSE: To efficiently and industrially produce a daily dish by making different food materials be cooked for a fixed small amount unit simultaneously in a short time. CONSTITUTION: The interior of a food material retainer 12 is divided into at least two housing chambers 46 and 48 of an upper and a lower stages by a middle partition plate 32. The middle partition plate 32 can be closed and opened by a hinge 34. The top of the food material retainer is opened and the bottom and the middle plate of the food material retainer 12 are provided with steam holes. A food material A to be relatively readily boiled is put in the lower housing chamber and a food material B to be relatively slightly boiled is put in the upper housing chamber. The food retainer 12 is introduced to a steaming pot 14, high-temperature steam is introduced to the upper and the lower housing chamber and the food materials are cooked simultaneously in a short time in heating degrees suitable for the food materials, respectively.
Patent JP-H07266380-A (JP)
Title: Injection mold device
Inventor: NORITAKE HIROSHI
IPC: B29C45/26
Filed: 1995-04-07
Abstract: PURPOSE:To simplify the assembly operation and prevent flashes from being produced. CONSTITUTION:A plurality of cassette molds insertion recessed parts 7b are provided in a stationary side base plate 7, a cassette mold 8 is inserted into the recessed part 7b and fixed by a fixing key 9. A spacer plate 5 and runner plate 6 which is fittable into a recessed part 5a provided on the spacer plate 5 are provided on the rear of the base plate 7. The runner plate 6 is stuck close to the rear of the base plate 7 so that the runner plate 6 is overlapped to the plurality of cassette molds 8. On the one hand, the spacer plate 5 is fixed to a supporting plate 4, and it is separable from the base plate 7 and runner plate 6. A runner groove 6a is engraved in the surface of the runner plate 6 facing on the inside of a recessed part 5a. Then the runner groove 6a is communicated with a runner 8a provided in the cassette mold 8.
Patent JP-H03283274-A (JP)
Title: Pin contact structure
Inventor: INASAKA JUN
IPC: H05K3/46
Filed: 1990-03-29
Abstract: PURPOSE:To ease generation of stress due to a difference between the coefficient of thermal expansion of a ceramics multilayered wiring substrate and that of a soldering portion for an external contact pin so as to prevent generation of ceramics on the substrate by providing a polyimide layer between the ceramics multilayered wiring substrate and the soldering portion, and adjusting the coefficient of thermal expansion of the polyimide layer. CONSTITUTION:A ceramics multilayered wiring substrate 1 has a conductor pattern 2 provided therein and connected to a through hole 3 connecting an LSI mounting face and a mounting face for an external contact pin 7 and the through hole 3 is exposed to the surface of the substrate on which the external contact pin 7 is mounted. A polyimide resin layer 4 is formed on the surface of the substrate and a coefficient of thermal expansion between those of the substrate and solder 6 is selected as that of the layer 4. The resin layer is applied to the surface of the substrate by spin coating and a via hole is formed in a portion of the ceramics multilayered wiring substrate 1 corresponding to the through hole 3 by photolithography technique. The solder 6 is used to stick the external contact pin 7 to a land 5.
Patent JP-S60226956-A (JP)
Inventor: NAKADA HIROSHI
IPC: F24S10/95
Filed: 1984-04-24
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H10285772-A (JP)
Title: Hanging-type jumper device
Inventor: KATO SUSUMU
IPC: H02G1/02
Filed: 1997-04-01
Abstract: PROBLEM TO BE SOLVED: To provide a hanging-type jumper device whose swinging amplitude is small, while the generation of a stress which is concentrated to the fixing bar fixing bar attaching part thereof by a cross wind is suppressed. SOLUTION: The upper side of the hanging bar 1 of a hanging-type jumper device is formed so as to be a fixed bar 1a which does not turn relative to a transmission tower side, and the lower side of the hanging bar 1 is formed so as to be a movable bar 1b which is turned relatively to the transmission tower side. The position of a bending point, where the fixed bar 1a and the movable bar 1b are connected to each other, is determined by a method, wherein the structure of a tension insulator string (a) and the structure of the movable bar 1b are deemed specified to simulate the swing amplitude towards the transmission tower side, and a position where the swinging amplitude is smallest is obtained.
Patent JP-H11253868-A (JP)
Title: Coating film removing spatula
Inventor: TAKAHATA MASATO
IPC: B08B7/00
Filed: 1998-03-13
Abstract: PROBLEM TO BE SOLVED: To provide a coating film removing spatula in which by simple equipment, dust of a coating film which is made radiation is prevented from being generated and noise, vibration or the like is also prevented from being generated. SOLUTION: A spatula 1 for removing a resin base hard coating film is constituted of a spatula 2 of a flat metal plate, a heating element 3 for heating the spatula 2, a handle 5 for grasping an electric wire code 4 connected to the heating element 3 and the spatula 2. The edge of the coating film is softened by the heated spatula 1 for removing the coating film, and it is raised from a body by the head part of the metal plate of the spatula 2, which is subjected to pointing at an acute angle. After that, the acute angle head part of the spatula 2 is inserted between the raised hard coating film and the adhesive part of the body, and while the hard coating film of the adhesive part is softened, the coating film is removed from the body in order.
Patent JP-H10279662-A (JP)
Title: Epoxy resin composition for semiconductor sealing
Inventor: NIWA KATSUHIRO
IPC: C08G59/40
Filed: 1997-04-01
Abstract: PROBLEM TO BE SOLVED: To obtain a composition excellent in reliability such as soldering cracking resistance and peeling resistance and moldability such as molding flow, curability and mold release by using an epoxy resin having at least two epoxy groups, having at least two aromatic rings between the epoxy groups and having a structure having at least one C-C double bond between the rings. SOLUTION: The epoxy resin (A) is represented by formula 1 (wherein hydrogen atoms bonded to the aromatic rings and to the doubly bonded carbon atoms may be substituted by monovalent organic groups). The phenolic curing agent (B) used is usually a compound having at least two phenolic hydroxyl groups and is exemplified by a phenol novolac resin. The chemical equivalent ratio of component A is 0.5-1.6. The inorganic filler (C) used is exemplified by fused silica and has a mean particle diameter of desirably 10-30 μm. A polyorganosiloxane (D) is added. The amounts of addition (wt.%) are 2-15 for component A, 2-15 for component B, 86-95 for component C and 0.01-3 for component D.
Patent JP-S61240557-A (JP)
Title: Small-type fluorescent lamp
Inventor: YANASE KOJIRO
IPC: H01J5/50
Filed: 1985-04-18
Abstract: PURPOSE:To assure the coldest temperature without increasing the length of the exhaust tube by installing partition walls, lower than guide cylinders to which terminal pins are attached, in he base and burying the end of the exhaust tube in a filler packed in the space separated by one of the partition walls. CONSTITUTION:A small-type fluorescent lamp is assembled by fusing electrodes 5 to the ends of a U-shaped bulb 1 the inner wall of which is coated with a phosphor 2 and by installing an exhaust tube 4 which protrudes from one of the ends and is supported by a base 7 having a terminal pin 6. The base 7 has partition walls 10 which are lower than guide cylinders 8 to which terminal pins 6 are attached. The end 41 of the exhaust tube 4 is buried in a filler 9 which is packed in the space separated by one of the partition wall 10. As a result, the exhaust tube 4 is efficiently cooled through the filler 9 and the coldest temperature is assured without increasing the length of the tube 4, thereby improving the efficiency of the lamp and reducing its size.
Patent JP-2000273259-A (JP)
Title: Vinyl chloride-based resin composition
Inventor: OKUBO YUICHI
IPC: C08L27/06
Filed: 1999-03-26
Abstract: PROBLEM TO BE SOLVED: To provide a vinyl chloride-based resin composition exhibiting excellent thermal stability and extrusion formability without using a heavy metal- based stabilizer. SOLUTION: This vinyl chloride-based resin composition comprises 100 pts.wt. of a vinyl chloride-based resin, (A) 0.1-10 pts.wt. of at least one compound selected from an organic acid calcium salt and an organic acid magnesium salt, (B) 0.1-5 pts.wt. of an organic phosphite ester, and (C) 0.05-10 pts.wt. of at least one compound selected from an alkyl or aryl aminocrotonate and a hydroxyl group or amino group-containing pyrimidine-based compound or triazine-based compound.
Patent JP-2000275356-A (JP)
Title: Multipoint road surface wetting-detecting device
Inventor: HORIUCHI HISAYOSHI
IPC: G01V8/16
Filed: 1999-03-26
Abstract: PROBLEM TO BE SOLVED: To achieve long-distance multipoint measurement and at the same time achieve repeated measurement following the change in the wetting of a road surface by changing the amount of distortion to be applied to an optical fiber according to water on a road surface and measuring the amount of distortion of an optical fiber. SOLUTION: The detection device is composed of an optical fiber amount-of- distortion distribution-measuring device 1, an optical fiber 2 and a wetting sensor 3. When a road surface is dry, a bimetal 4 inside the wetting sensor 3 is heated by a heater 5, and one end of the bimetal 4 gluing the optical fiber 2 is curved and displaced since the other end is fixed by a bimetal-fixing part 6, thus reducing the amount of distortion to be applied to zero. In wetting, the temperature of the bimetal 4 is changed according to the degree of wetting on a road surface and decreases as compared with when it is dry, and the amount of distortion being applied to the optical fiber 2 between one end of the bimetal 4 and the optical fiber 4 is changed.  By detecting the amount of distortion at each point of the optical fiber 2, a wetting state at a number of points on a road surface can be detected according to the obtained amount of distortion.
Patent JP-S63248122-A (JP)
Title: Semiconductor manufacturing equipment
Inventor: YOSHIDA NAOTO
IPC: H01L21/205
Filed: 1987-04-03
Abstract: PURPOSE:To enable a substrate to be cleaned up before crystal growing process for crystal growing in high quality with excellent reproducibility by a method wherein a material to be crystal-grown is free-movably arranged on an opposing position to a substrate on a susceptor in a reaction tube. CONSTITUTION:A substrate 7 is mounted on a susceptor 5 of a reaction tube 1 of semiconductor manufacturing equipment while H2 gas is led in from a gas leading-in port 2 to heat the susceptor 5 by RF coils 4. Besides, a GaAs 9 to be epitaxially grown on the surface of substrate 7 is held by a holder 8 to be arranged on the substrate 7 by a rod 10 holding the GaAs 9. This GaAs 9 is heated by the radiant heat of substrate 7 producing the vapor of Ga and As scattering to be oxidized by Ga. Furthermore, the GaAs 9 is shifted from the opposing position to the substrate 7 with the substrate 7 kept at specified temperature while TMG and AsH3 are led in from the gas leading-in port 2 for cleaning up the substrate 7 so that GaAs 9 may be grown on the surface of substrate 7 with excellent reproducibility.
Patent JP-S5720096-A (JP)
Title: Magnetostriction vibrator
Inventor: SAWADA RIYOUZOU
IPC: H03H9/22
Filed: 1980-06-19
Abstract: PURPOSE:To obtain a vibrator which has the same efficiency with lamination type one through simplifying a process by providing a winding by lapping and winding thin belts of magnetic metal having magnetic strain and alloy. CONSTITUTION:An amorphous ribbon having composition of (Fe0.9Ni0.1)78Cr2 Si6B14 is formed by a molten-metal quenching method by a single roll and, after being wound in a square shape, annealed, and it is dipped in resin, dried and solidified to obtain a core. This core is provided with a winding. In a diaphragm 3, a recess part is formed and all layers of the core are applied with an adhesive and cohered. This method eliminates the need for a snap flask and also eliminates the need to lap sheets, so that an efficient vibrator is obtained by a simple process.
Patent JP-S63248298-A (JP)
Title: Data collection system
Inventor: CHIJIIWA KAZUO
IPC: H04Q9/00
Filed: 1987-04-03
Abstract: PURPOSE:To automatically send data in order, by detecting the slave station discrimination code of a slave station before sending the data by each slave station after designating an arbitrary slave station and allowing the slave station to send the data by a master station device. CONSTITUTION:When the master station device 1 sends a designated code to start the collection of the data first, and the slave station discrimination code of the slave station from which the data is desired to be collected first of all, a station receiving the slave discrimination code sends the data following the slave discrimination code of its own station, and sends a data delivery comple tion code after sending the data. Those data are received by the master station device 1, and are stored in a storage part 13, and also, the slave device designat ed to detect a preceding slave station discrimination code in advance out of the slave stations receiving the signal sent from the slave station in parallel detects the completion of a preceding slave station, and sends its own slave discrimination code, the data, and the delivery completion code from its own slave station device. And so forth, since the discrimination code of the slave station device to be sent precedingly is set, each slave station device can send the data in order.
Patent JP-H09272133-A (JP)
Title: Apparatus for manufacturing resin mold
Inventor: TAKAHASHI YUKIO
IPC: B29L31/34
Filed: 1996-04-05
Abstract: PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a resin mold which reduces the weight of molding molds, shortens a molding cycle time, reduces costs for manufacturing the apparatus and producing moldings, can be compact as a whole, reduces operation costs, requires only a small installation area. SOLUTION: A molding apparatus 200 which injects resin into a cavity while applying mold clamping pressure to a molding mold 100 is arranged at a resin injection point (a), heaters are arranged at resin curing points (b-e), and a mold opening apparatus 500 is arranged at a molding take out point (f). The molding apparatus 200 can be small in size since the mold clamping pressure is applied only to the mold 100 located at the resin injection point (a), so that the whole apparatus can be compact and excess energy is not required for operating a mold clamping press means, reducing apparatus actuation costs. The lower part tables 201, 401, 501 of the molding apparatus, the heater, and the mold opening apparatus are made fixed tables, and a transfer mechanism 300a is arranged in a space secured below the tables so that an installation space can be made small not to hinder an operator.
Patent JP-H09271685-A (JP)
Title: Crusher
Inventor: ANDO SEIGO
IPC: B02C13/12
Filed: 1996-04-05
Abstract: PROBLEM TO BE SOLVED: To provide a rotor with high impact force even though the size is compact and prevent damages of center disks by hammers. SOLUTION: A rotor 5 installed between breaker plates comprises a large number of linked center disks 15 so installed in a rotor shaft 14 as to form a cross-shape and hammers 18 having slightly thinner thickness than that of the center disks and journalled between tip end parts of opposed center disks in a way the hammers 18 can swing freely. The hammers 18 are so installed as to be brought into face contact with the center disks 15.
Patent JP-H11281678-A (JP)
Title: Current sensor
Inventor: YOSHIMI KENICHI
IPC: G01R15/20
Filed: 1998-03-30
Abstract: PROBLEM TO BE SOLVED: To remove remanence and to reduce noise level of a current sensor tar measuring a current flowing through a conductor by measuring a measuring field induced by the current. SOLUTION: A gap 2 is provided at a part of a closed magnetic field 1 surrounding a conductor 4 passing a current to be measured. A flux gate type magnetic detection element 3 comprising a ferromagnetic core 3c applied with an exciting coil 3a and a receiving coil 3b is inserted into the gap 2. When an AC current of frequency (f) is fed through the exciting coil 3a from a signal generator 5, a voltage signal containing a harmonic of frequency 2f and proportional to the current to be measured is obtained from the receiving coil 3b. The voltage signal is passed through a band-pass filter 6 and only a voltage signal of frequency 2f is taken out. It is converted into a current signal by rectifying synchronously with a synchronization signal from a signal generator 5 at a phase detector 7 and smoothing at an integrator 8.  Residual filed in a closed magnetic path can be brought to zero by feeding that current to a feedback coil 10 and highly accurate current measurement can be carried out over a wide range.
Patent JP-S5418677-A (JP)
Title: Positioning mark for photo etching
Inventor: TSUJI KAZUHIKO
IPC: H01L21/027
Filed: 1977-07-12
Abstract: PURPOSE: To ensure an easy and high-accuracy positioning for the photo etching by forming previously the internal patterns to four square patterns each which are connected through the rectangular pattern and then forming the patterns to be overlapped to the internal patterns in a size between the square pattern and the internal pattern. 
     COPYRIGHT: (C)1979,JPO&Japio
Patent JP-S57199159-A (JP)
Title: Plate-like displayer
Inventor: MUTOO YUUHEI
IPC: H01J9/26
Filed: 1981-06-02
Abstract: PURPOSE:To provide a plate-like displayer with a high quality and a good reliability by preparing a panel from glass, preparing a back surface plate facing the panel from a metal, and joining the panel and the back surface plate quite efficiently. CONSTITUTION:A spacer 9 is fixed to a back surface plate 8, which is made of a metal and is a component of a vacuum encircling case, so as to provide a space for a getter. A panel 23 is made of transparent glass, is a component of the vacuum encircling case, and the inner wall of the panel 23 is coated with both a phosphor layer on which picture elements can be regularly arranged and a metal back layer used as an accelerating electrode. The panel 23 is provided over the spacer 9, with a cathode supporter 12, coil-like heater 13, control electrode groups 16, 18 and 20, a circular spacer 21 and the like interposed between the spacer 9 and the panel 23. In assembling the above internal electrodes, the end 82 of the back surface plate 8 is welded to both a glass block 251 and a glass block 252 by use of a crystallized frit before the panel 23 is placed over te block 252, and an electrode-drawing part 161 is fused to the panel 23 by use of a non-crystal frit glass with a good fluidity so as to form the vacuum case. As a result, a plate-like displayer with a high reliability can be obtaind.
Patent JP-H02118398-A (JP)
Title: Construction of heat accumulating chamber
Inventor: IZUMISAWA YATARO
IPC: F28D17/02
Filed: 1988-04-07
Abstract: PURPOSE:To permit the constitution of stabilized stacking structure by a method wherein bricks, provided with cut-in parts having depths equal to the 1/2 of the height of the corner of the bricks at respective corners, are employed and arranged so as to keep the cut-in part upward and, thereafter, other bricks are fitted to the arrangement of the bricks so as to override the cut-in parts of neighboring 4 pieces of the bricks while keeping the cut-in part downward. CONSTITUTION:A square tubular brick, having the length (a) of one side and a thickness (t), is employed. At first, the bricks 2 are arranged on a foundation 1 with a space (a-2t) to form a first brick layer shows by full lines in a diagram. Subsequently, other bricks 3 are fitted so as to ride over neighboring 4 pieces of the brick 2 while fitting the cut-in parts thereof to form a second brick layer shown by broken lines in the diagram. When a third layer is stacked, the bricks constituting the third layer are arranged properly so as to be positioned at the same positions of the bricks of the first brick layer, then, the bricks constituting a fourth layer are fitted thereto. Thereafter, the bricks are arranged and fitted in the same manner whereby the bricks may be stacked.