baber/WOPTO huggingface dataset:
Patent TW-494246-B (TW)
Title: Registration method for multiple sensor radar
Inventor: ALON YAIR
IPC: G01S7/40
Filed: 2000-09-08
Granted: 2002-07-11
Abstract: The invention is a method for radar registration by determining initially unknown azimuth and range biases (errors) in a system of multiple, overlapping coverage radars (10, 11, 12). Track data from multiple radar systems corresponding to a common target are associated into track pairs. Track pair data is then used to calculate state vectors in a multi-dimensional vector space (preferably six-dimensional), with state vector components corresponding to both position and velocity information. From these state vectors an average normalized statistical distance is calculated, where the averaging is over multiple track pairs. An azimuthal bias parameter (and preferably also a range bias parameter) are then varied to minimize the average normalized statistical distance, thereby finding the best estimates of the corrections required to register the multiple radars.
Patent TW-465084-B (TW)
Title: High dielectric constant nonvolatile memory and its manufacturing method
Inventor: ISHIWARA HIROSHI
IPC: H01L27/115
Filed: 2000-08-25
Granted: 2001-11-21
Abstract: A nonvolatile semiconductor memory, including a capacitor with high dielectric constant connected to the gate of a MOSFET, comprises a silicon thin film (10) formed in stripes on an insulated substrate and having an n+-region (13), a p-region (14) and an n+-region (15) layered in its thickness direction, a hole (17) formed in a portion of the silicon thin film and extending to the lower n+-region (13), a gate electrode (21) provided on the side walls of the hole (10) with a gate insulting film (19) interposed inbetween, and a capacitor with high dielectric constant formed on the silicon thin film (10) and having its lower electrode (25) connected to the gate electrode (21).
Patent TW-526300-B (TW)
Title: SiC single crystal and method for growing the same
Inventor: SHIOMI HIROMU
IPC: C30B23/00
Filed: 2000-09-06
Granted: 2003-04-01
Abstract: This invention provides a SiC single crystal and a method for growing the same to grow a 4H multiple type SiC single crystal 40, characterized in that the 4H multiple type SiC single crystal 40 is grown on a seed crystal 30 comprised of an SiC single crystal where a {03-38} plane or a plane which is inclined at off angle Α, within about 10 DEG, and with respect to the {03-38} plane, is exposed.
Patent TW-504795-B (TW)
Title: Seed layers for interconnects and methods and apparatus for their fabrication
Inventor: COHEN URI
IPC: G11B5/31
Filed: 2000-09-14
Granted: 2002-10-01
Abstract: One embodiment of the present invention is a method for making metallic interconnects including: (a) forming a patterned insulating layer on a substrate, the patterned insulating layer including at least one opening and a field surrounding the at least one opening; (b) depositing a barrier layer over the field and inside surfaces of the at least one opening; (c) depositing a first seed layer over the barrier layer using a first deposition technique; (d) depositing a second seed layer over the first seed layer using a second deposition technique, the first and second deposition techniques being different; and (e) electroplating a metallic layer over the second seed layer, the electroplated metallic layer including a material selected from a group consisting of Cu, Ag, or alloys including one or more of these metals.
Patent TW-480394-B (TW)
Title: Method of remote monitor, maintenance, and generating electronic commerce
Inventor: LEE WEN-LUNG
IPC: G06F15/16
Filed: 2000-09-21
Granted: 2002-03-21
Abstract: The present invention relates to a method of remote monitor, maintenance, and generating electronic commerce. The apparatus at the user side is connected to the monitoring device at the monitor side via a communication system. The operating information of the apparatus is transmitted to the monitor side via the communication system. When the monitor side receives the information transmitted from the apparatus, the monitor side notifies the user side to perform maintenance if the apparatus is detected to be abnormal. The user side is aware of the maintenance and condition of the apparatus via the communication system, thereby enhancing the transaction behavior between the user and the vendor.
Patent TW-520618-B (TW)
Title: Fluorescent lamp operating apparatus and compact self-ballasted fluorescent lamp
Inventor: KOMINAMI SATOSHI
IPC: H05B41/392
Filed: 2000-10-20
Granted: 2003-02-11
Abstract: Disclosed is a dimmable fluorescent lamp operating apparatus which comprises a fluorescent lamp, electrical characteristic detecting means for detecting an electrical characteristic of the fluorescent lamp, an inverter circuit for driving the fluorescent lamp, and a feedback controlling circuit for controlling the drive frequency of the inverter circuit such that the electrical characteristic of the fluorescent lamp becomes a predetermined value, wherein the feedback controlling circuit includes temperature detecting means for detecting the temperature of the fluorescent lamp and wherein the frequency characteristic bandwidth of the feedback controlling circuit is varied based on the detected fluorescent lamp temperature.
Patent TW-486407-B (TW)
Title: Substrate polishing article
Inventor: TOLLES ROBERT D
IPC: B24B37/24
Filed: 2000-11-08
Granted: 2002-05-11
Abstract: A polishing material for chemical mechanical polishing has a mesh of fibers and a binder material holding the fibers in the mesh. The binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh. The fibers and binder material provide the polishing material with a brittle texture. The fibers can be cellulose, and the binder material can be a phenolic resin.
Patent TW-467845-B (TW)
Title: Handy electric heat sealer
Inventor: OTA ATSUSHI
IPC: B65B51/10
Filed: 2000-11-23
Granted: 2001-12-11
Abstract: This invention is to obtain a highly practical handy electric heat sealer for sealing an opening of a plastic bag or the like for hermetic sealing wherein sealing can be reliably and smoothly done. A slit 3 for inserting a member to be sealed on a side face of a housing 10 is formed in a large depth L. A long heater unit 5 in the slit and a pressing part 4 opposite thereto hold the member to be sealed for sealing. The deep slit 3 is used to position a portion to be sealed in an inclined posture and to repetitively seal in a zigzag with crossings, thereby obtaining a highly airtight seal. In addition, since a display 2d on an upper surface of the housing shows a position and a length of a heating wire 5b provided in the heater unit 5, it is easy to perform a sealing operation with positioning.
Patent TW-563283-B (TW)
Title: Methods and apparatus for web-enabled engine-generator systems
Inventor: LESLIE DAVID STUART
IPC: H02J9/06
Filed: 2000-11-24
Granted: 2003-11-21
Abstract: A controller (108) for controlling and monitoring the operation of an engine-generator (14) is disclosed. The controller includes a central processing unit (122), a power supply, an input/output system (126), a communication system (134), an annunciation system (130, 132) and mode control switches (158). The operational status of the engine-generator is displayed on a liquid crystal display (154) and logged in a data storage system or communicated to an external system using a communications interface. The controller also incorporates a monitoring system.
Patent TW-510966-B (TW)
Title: Straight line defect detection
Inventor: SARIG NIMROD
IPC: G06T1/00
Filed: 2001-03-26
Granted: 2002-11-21
Abstract: A method and apparatus for inspecting the straightness of edges of features on a reticle is provided wherein the feature edges are analyzed for local defects as small groups of pixels, rather than pixel-by-pixel. In one embodiment, the reticle is imaged to produce pixels having a gray level and associated with an x and a y coordinate. A small array of pixels, such as a 2 x 2 array, that lays on an edge of the target feature is identified, a plane is calculated based on the x coordinate, the y coordinate and the gray level of each of the pixels in the array, and an angle Α between a reference line and a line at the intersection of the calculated plane and a reference plane is calculated. Several other edge-straddling arrays adjacent to the first array are identified, their respective angles Α are calculated, and all the Α's are compared. If the Α's are substantially equal, it is determined that the target feature edge is straight, and if the Α's are not substantially equal, it is determined that the target feature edge is curved. A corresponding reference feature image is analyzed in the same way as the target feature image, and a defect is determined to exist in the target feature when the target feature edge is curved and the reference feature edge is straight.
Patent TW-562663-B (TW)
Title: Toothbrush
Inventor: NAKANISHI YOSHINARI
IPC: A46D1/00
Filed: 2001-03-15
Granted: 2003-11-21
Abstract: A toothbrush capable of readily entering gaps between teeth, periodontal pockets and triangular portions between teeth, effectively clearing hard-to-remove dental plaque accumulated between teeth and at boundaries between teeth and gums and being soft to gums, to thereby give the user a good feeling in use thereof. Synthetic monofilaments (18) having the following tapered shape are employed. Supposing that three dimensional coordinates (x, y, z), wherein a distal end of each of the synthetic monofilaments is defined as an origin (0, 0, 0) of the coordinates and the monofilament is arranged while being aligned at a central axis thereof with a +x axis of the coordinates, are established, the synthetic monofilaments are each configured to have a tapered shape (20) which ensures that a ratio p between a sectional area s of the monofilament in a y-z plane at any site thereof positioned within a region thereof spaced by a distance of 0.1 to 8.0 mm from the distal end and a sectional area S0 of the monofilament in a y-z plane at a maximum diameter portion thereof is specified by the expression p=s/S0=a.x<0.85-a> (0.05 <= a <= 0.65). The synthetic monofilaments (18) may each have constructed in such a manner that diameter (d0.1, d1, d3) of sites thereof spaced by distances of 0.1 mm, 1mm and 3mm from the distal end thereof are 5 to 35%, 35 to 60% and 60 to 90% based on a diameter (D) of the maximum the synthetic monofilament, respectively.
Patent TW-554636-B (TW)
Title: Food managing/processing system
Inventor: HIRAHARA MORIO
IPC: G06Q30/06
Filed: 2001-03-16
Granted: 2003-09-21
Abstract: The present invention relates to a food managing/processing system. The object is to totally control foods contained in a refrigerator in a house and foods cooked with a microwave oven. To solve the problem, a main data server 1 controls a food global data server 2 for storing food information of all objects to be controlled, and an individual food control data base 3. In a house 4 there are provided a refrigerator 5 including a food local data base 7 and a microwave oven 6 capable of automatic cooking. These are coupled through a network 8 in the house. A radio tag storing food identification code is attached to a food, and is read depending upon accommodation state into the refrigerator 5 and is controlled as a stock food. When food is cooked with the microwave oven 6, cooking information is read, and automatic cooking is made possible on the basis of the read data. The food information is available in and out the house with the aid of a portable terminal 10.
Patent TW-480577-B (TW)
Title: Semiconductor etching system and method with heating function
Inventor: JANG JR-YUNG
IPC: H01L21/00
Filed: 2001-05-11
Granted: 2002-03-21
Abstract: This invention provides semiconductor etching system and method with heating function to eliminate residual hydrogen bromide. The semiconductor etching system at least contains: a first loadlock chamber to function as a buffer space for receiving wafer; an etching device coupled with the first loadlock chamber to etch semiconductor wafer by etching gases; heating reaction chamber connected to the etching device to provide temperature-adjustable reaction chamber capable of vaporize residual etching gases on wafer by heating treatment; heat exchanger coupled to the heating reaction chamber to provide stable heat source to the heating reaction chamber and to maintain constant temperature in the heating reaction chamber; vacuum device to pump out residual etching gases in the heating reaction chamber and increase the degree of vacuum of the semiconductor etching system; and a second loadlock chamber to provide a buffer space for retrieving wafers from the heating reaction chamber.
Patent TW-516314-B (TW)
Title: Interactive television application with watch lists
Inventor: ELLIS MICHAEL D
IPC: H04N7/16
Filed: 2001-05-23
Granted: 2003-01-01
Abstract: An interactive television application with watch lists is provided. The user may add programs such as television programs, Internet web pages, e-commerce applications, e-mail applications, and music channels, to a watch list. The user may also select a program from the watch list to watch it or to perform some other function related to that program. The interactive television application may display, under user control, watch lists that are overlaid over television programming, scaled so as not to obscure television programming, or on touch-screen remote controls. Programs may be added by the user to the watch lists at any time, or may be automatically added or removed by the interactive television application based on user preference profiles and reminder lists.
Patent TW-529223-B (TW)
Title: High-efficient motor
Inventor: SHIU JIUN-FU
IPC: H02K3/12
Filed: 2001-06-01
Granted: 2003-04-21
Abstract: The present invention relates to a high-efficient motor, and more particularly to a stator device used in a motor. The stator of same motor provides plural sets of stator coil, each having line head and line tail independent with each other, and connected by a switch control system, respectively, so as to form various single-phase and tri-phase coil type connected coil networks for the stator. The coil network is managed and controlled by a switch control system to provide intense and diversified changes for the coil number of the stator. The change of coil number can change the torque constant KT of the motor. Therefore, the motor can maintain an averaged high operating efficiency value in the operating ranges of low, middle and high speeds. Also, in the low and middle operating ranges, the motor has plural changes of more coil numbers and thus KT value can be intensely and suitably increased. Because T=KT*I, the output torque can be easily, variously and suitably increased.
Patent TW-562886-B (TW)
Title: Sliding apparatus for sewing machine and sewing machine
Inventor: OU SEIHOU
IPC: D05B55/00
Filed: 1999-09-23
Granted: 2003-11-21
Abstract: It is an object to provide a needle bar exhibiting light weight and great rigidity and a sliding apparatus for a sewing machine and a sewing machine each of which is capable of reliably preventing wear of a sliding portion and damage caused from seizure for a long time even with an oilless structure. A needle bar 1 has a needle bar body 2 made of fiber reinforced resin. At least a sliding surface 111a of a sliding member 11 is made of pitch carbon fiber reinforced resin. Thus, a sliding apparatus 60 for a sewing machine is manufactured. A sliding member 11 is employed in a sewing machine M.
Patent TW-587380-B (TW)
Title: Identification number management apparatus, identification number management system and identification number management method
Inventor: OCHI AKIRA
IPC: H04L29/08
Filed: 2001-06-18
Granted: 2004-05-11
Abstract: In the prior art, when two IEEE 1394 equipments that can perform independently respective processes are provided in one manufactured product, once a common identification number is set, it is difficult to maintain the conformity of EUI-64 that serves as the manufactured product. Independently operable IEEE 1394 equipments A101 to C103 have EUI-64 memory means for storing the processed identification number as a common identifier, and communication means 201 to 203 that transmit the identification number to the IEEE 1394 equipments. Once the IEEE 1394 equipments A101 to C103 receive the identification number transmitted from the communication means, the identifier is generated from the identification number and the configuration ROM containing the identifier can be established.
Patent TW-502479-B (TW)
Title: Semiconductor light-emitting element and method of manufacturing the same
Inventor: AKAIKE YASUHIKO
IPC: H01L33/30
Filed: 2001-07-17
Granted: 2002-09-11
Abstract: The present invention relates to a semiconductor light-emitting element applying chip direct-bonding technology and method of manufacturing the same. The subject of the present invention is to provide a method to prevent the diffusion of P-type dopants from the substrate to the active layer, inhibit the formation of non-light-emitting centers, so as to obtain higher brightness and stability. The semiconductor light-emitting element utilizing the chip bonding technology comprises: a double hetero structure formed of InGaAlP material layers including an active layer 13 acting as a light emitting layer and an n-type, p-type cladding layer 12, 14 having the active layer sandwiched in between, and a p-type GaP substrate 20 directly bonded to the p-type cladding layer 14 of the double hetero structure, and a Zn diffusion preventing layer formed of InGaAlP, which is interposed between the p-type cladding layer 14 and p-type GaP substrate 20. The Zn diffusion preventing layer 15 is formed by doping p-type dopant Zn and Si with n-type dopants simultaneously. When the impurity concentration of Zn, Si is Na, Nd respectively, they satisfy the condition: Na > Nd, and Nd > 2x10<SP>17</SP> cm<SP>3</SP>.
Patent TW-523653-B (TW)
Title: Electronic device
Inventor: OHASHI SHIGEO
IPC: F25D9/00
Filed: 2001-08-07
Granted: 2003-03-11
Abstract: The present invention relates to an electronic device. While heat productivity of heating element is increasing along with more process functions are required on electronic devices, it becomes necessary to provide a water cooling structure that has sufficient flow of circulation liquid and is ideal for miniaturization and slim-typing. A water cooling sleeve (8) is connected under heat to a heating element (7) and an exothermic pipe (9) is connected under heat to an exothermic board (10) installed on the back of a monitor cabinet (2) while using a liquid driver (11) to allow cooling liquid to circulate between the water cooling sleeve (8) and the exothermic pipe (9). Based on the relationship between the upper temperature limit of the heating element (7) and the exothermic threshold of the cabinet surface, the required sufficient circulation flow and output pressure can be determined. Hence, based on the present invention, heat of the heating element can be released from the back of the monitor cabinet by means of sufficient circulation liquid flow.
Patent TW-483803-B (TW)
Title: Method to reduce amount of slurry used in chemical mechanical polishing device
Inventor: CHEN KE-WEI
IPC: B24B57/02
Filed: 2001-08-14
Granted: 2002-04-21
Abstract: This invention provides a slurry supply condition to fully utilize slurry during polishing process. According to the inventive manufacture conditions, the amount of slurry used can be reduced without affecting the polishing efficiency for the wafer. This enables wafer throughput per unit time being constant. The inventive method is to distribute slurry onto the polishing stage on an off intermittently to fully utilize the slurry during the supply-off section and to reduce the amount of slurry used.
Patent TW-523745-B (TW)
Title: Microelectronic programmable device and methods of forming and programming the same
Inventor: KOZICKI MICHAEL N
IPC: G11C13/02
Filed: 2001-09-10
Granted: 2003-03-11
Abstract: A microelectronic programmable structure and methods of forming and programming the structure are disclosed. The programmable structure generally include an ion conductor and a plurality of electrodes. Electrical properties of the structure may be altered by applying a bias across the electrodes, and thus information may be stored using the structure.
Patent TW-I236037-B (TW)
Title: Method of manufacturing miniaturizing sensor
Inventor: LIN PAO-TE
IPC: H01L21/00
Filed: 2001-09-26
Granted: 2005-07-11
Abstract: A method of making micro-electromechanical sensor is provided. It is used to make small surface area, high density and high quality micro-electromechanical sensor. Generally speaking, the proportion of sensor body occupied on the wafer area relates to the thickness of sensor body. The thinner the sensor thickness is, the smaller the area is occupied, however, the more easily the sensor breaks, and the more difficult the process is. The present invention provides a method to use a special wafer carrier, wafer transferring method. The carrier wafer is used to carry the wafer and grind and thin the sensor wafer substrate, and sensor wafer is transferred to the base wafer. This process can reduce the proportion of sensor body occupying the wafer area, increase the yield per unit area, reduce the error, increase the quality of sensor, and operate the process easily.
Patent TW-517363-B (TW)
Title: Resin packaged semiconductor device, and die bonding material and packaging material thereof
Inventor: KURAFUCHI KAZUHIKO
IPC: H01L23/29
Filed: 2001-09-28
Granted: 2003-01-11
Abstract: This invention relates to a resin-sealed semiconductor device which comprises a lead frame having a die bonding pad and an inner lead, a semiconductor chip installed on the die bonding pad via a die bonding material and a sealing material for sealing the semiconductor chip and the lead frame, in which properties of the die bonding material and the sealing material after curing satisfies the following formulae (1), (2) and (3): σ e ≤ 0.2 x σ b formula (1), Ui ≥ 2.0x10<SP>-6</SP> x σ e1 formula (2), Ud ≥ 4.69x10<SP>-6</SP> x σ ed formula (3), in which σb(Mpa) represents the flexural strength at break of the sealing material at 25 DEG C, Ui(N*m) and Ud(N*m) represent shear strain energies of the sealing material at a soldering temperature for the inner lead and the die bonding pad, respectively, at a peak temperature during soldering, where σ e=(1/log(kd1)) x Ee1 x (Α m-Α e1) x Δ T1 formula (4), σ ei=Ee2 x (Α e2-Α m) x Δ T2 formula (5), σ ed=log(kd2) x Ee2 x (Α e2-Α m) x Δ T2 formula (6), kd1: a ratio of the flexural modulus Ed1(Mpa) of the die bonding material at 25 DEG C to 1 Mpa of elastic modulus (Ed1 > 1 Mpa), kd2: a ratio of the flexural modulus Ed2(Mpa) of the die bonding material at a peak temperature during soldering to 1 Mpa of elastic modulus (Ed2 > 1 Mpa), Ee1: a flexural modulus (Mpa) of the sealing material at 25 DEG C, Ee2: a flexural modulus (Mpa) of the sealing material at a peak temperature during soldering, Α e1: an average thermal expansion coefficient (1/DEG C) of the sealing material from the forming temperature for the semiconductor to room temperature (25 DEG C), Α e2: an average thermal expansion coefficient (1/DEG C) of the sealing material from the forming temperature for the semiconductor to a peak temperature during soldering, Α m: a thermal expansion coefficient (1/DEG C) of the lead frame, Δ T1: the difference (DEG C) between the forming temperature for the semiconductor and the low temperature side temperature in the temperature cycle, and Δ T2: the difference (DEG C) between the forming temperature for the semiconductor and the peak temperature during soldering.