baber/WOPTO huggingface dataset:
Patent TW-I281708-B (TW)
Title: Vacuum chamber for vacuum processing appartaus
Inventor: HAMADA YASUO
IPC: C23C14/22
Filed: 2004-05-07
Granted: 2007-05-21
Abstract: To enable the shape or size of a vacuum chamber to be changed even after the installation of the vacuum chamber by a user's request etc. A vacuum chamber 1 has the structure of being able to be divided freely into a rectangular chamber main body 2, triangular side frames 3a and 3b detachably and tightly joined to both side faces of the chamber main body 2 by bolting, top plates 5 and 8 joined to respective top faces of the chamber main body 2 and the side frames 3a and 3b each of which has an opening, and bottom plates 7 and 9 joined to respective bottom faces of the chamber main body 2 and the side frames 3a and 3b each of which has an opening. Hence, it is possible to easily change the shape and size of the vacuum chamber by a user's request etc.
Patent TW-I245927-B (TW)
Title: Light modulator
Inventor: REBOA PAUL F
IPC: G02F1/29
Filed: 2004-06-29
Granted: 2005-12-21
Abstract: A light modulator includes a substrate (110; 110'/210; 210'), a transparent plate (120/220) spaced from the substrate such that the transparent plate and the substrate define a cavity (140/240) therebetween, at least one electrode (150; 150'/250; 250') formed on the substrate adjacent the cavity, and a liquid (170/270) having an index of refraction greater than one disposed within the cavity. An interface (172/272) of the liquid is oriented at an angle to a surface (152; 152'/252; 252') of the at least one electrode and oriented at an angle to a surf ace (124/222, 224) of the transparent plate. As such, light is adapted to pass through and refract at the interface of the liquid.
Patent TW-I248147-B (TW)
Title: Method for cleaning residual flux on surface of element and bumping process using the same
Inventor: WANG LYNN
IPC: H01L21/60
Filed: 2004-07-21
Granted: 2006-01-21
Abstract: A method for cleaning residual flux that uses the methyl sulfonic acid to clean the residual flux is disclosed. The cleaning method described above can be applied the cleaning residual flux on surface of an element. The element that has a substrate and a plurality of solder posts is provided first. The solder posts are disposed on the surface of the element. Then, the element is immersed in the methyl sulfonic acid. After, a washing procedure for the element is executed. Final, a drying procedure for the element is executed. The method for cleaning residual flux can be further applied in a bumping process. A wafer with a plurality of bonding pads is provided first. Then, a plurality of solder posts is disposed on the bonding pads. After, a flux is sprayed on the wafer and the solder posts. Next, the solder posts are reflowed to form a plurality of bumps on the bonding pads. Final, the flux is cleaned by the methyl sulfonic acid with the cleaning method described above.
Patent TW-I267072-B (TW)
Title: Optical pickup head
Inventor: HSIEH KUO-CHING
IPC: G11B7/12
Filed: 2004-07-21
Granted: 2006-11-21
Abstract: An optical pickup head comprises a laser beam source, a beam splitter, a collimating lens, a reflector, a focusing lens, a first wedge optical plate, a second wedge optical plate, an optical plate position module, and a laser photo detector. The first wedge optical plate comprises a first plane and a first inclined plane, which is not parallel to the first plane. The second wedge optical plate comprises a second plane and a second inclined plane, which is not parallel to the second plane. The first inclined plane faces to the second inclined plane so that the first plane is parallel to the second plane. Therefore, a laser beam, which is emitted from the laser beam source, passes through the first wedge optical plate and the second wedge optical plate and then focuses on an optical storage medium.
Patent TW-I276833-B (TW)
Title: Using time and/or power modulation to achieve dose gray-scaling in optical maskless lithography
Inventor: CEBUHAR WENCESLAO A
IPC: G02B26/00
Filed: 2004-07-26
Granted: 2007-03-21
Abstract: In lithography applications, it is desirable to control, for example, a position or width of a printed line. An effective method of controlling these patterns and their resolution is by having as many grayscale levels as possible. The present invention comprises methods of grayscaling wherein modulation of the exposure time increases the number of grayscale levels on an object. In addition, the present invention comprises methods of grayscaling wherein modulating the power of an exposure beam provides additional grayscale levels.
Patent TW-I265909-B (TW)
Title: Method of producing three-dimensional structure and fine three-dimensional structure
Inventor: MURATA KAZUHIRO
IPC: B05D1/26
Filed: 2004-07-30
Granted: 2006-11-11
Abstract: A method of producing a three-dimensional structure contains the steps of: arranging a substrate close to a tip of a needle-shaped fluid-ejection body having a fine diameter supplied with a solution, ejecting a fluid droplet having an ultra-fine diameter toward a surface of the substrate by applying a voltage having a prescribed waveform to the needle-shaped fluid-ejection body, making the droplet fly and land on the substrate, and solidifying the droplet after the fluid droplet is landed on the substrate; further a three-dimensional structure has a fine diameter comprises droplets having an ultra-fine particle diameter, wherein the structure is grown by solidifying the droplets and stacking the solidified droplets.
Patent TW-I289853-B (TW)
Title: Nonvolatile semiconductor storage device, and liquid crystal display device including the same
Inventor: MASUOKA FUJIO
IPC: G11C16/08
Filed: 2004-08-23
Granted: 2007-11-11
Abstract: A nonvolatile semiconductor storage device including: a plurality of memory cell unit groups each comprising one or more NAND nonvolatile memory cell units each comprising at least one memory cell having a control gate, a first selection transistor having a first selection gate, and a second selection transistor having a second selection gate, the memory cell unit groups each further comprising a control gate line connected to the control gate, a first selection gate line connected to the first selection gate, and a second selection gate line connected to the second selection gate; a common control gate line connected commonly to the control gate lines of different ones of the memory cell unit groups; a first common selection gate line connected commonly to the first selection gate lines of different ones of the memory cell unit groups; and a second common selection gate line connected commonly to the second selection gate lines of different ones of the memory cell unit groups; wherein the memory cells in the respective memory cell unit groups are each uniquely selected on the basis of a combination of the common control gate line and the first and second common selection gate lines.
Patent TW-I249140-B (TW)
Title: Window-type image object labeling system and its label value operation method
Inventor: CHIEN HUNG-EN
IPC: G06K9/46
Filed: 2004-09-27
Granted: 2006-02-11
Abstract: A kind of window-type image object labeling system and its label value operation method are disclosed in the present invention. By using the raster scan manner, the first pixel value of the binary image and the pixel of the second pixel value are inputted. After conducting the operation between the pixel of the first pixel value and its neighboring pixels, a corresponding label value is then obtained. After merging and processing these label values, a symbolic image is obtained so as to raise the image processing speed.
Patent TW-I253400-B (TW)
Title: Printer capable of detecting status of unused ribbon
Inventor: HUANG KUANG-HUEI
IPC: B41J2/315
Filed: 2004-11-10
Granted: 2006-04-21
Abstract: A printer includes a ribbon supply end, a ribbon retrieving end, and a ribbon. The two ends of the ribbon are installed on the ribbon supply end and the ribbon retrieving end respectively. The printer further includes a print head, a driving module for driving the ribbon supply end and the ribbon retrieving end so as to move the ribbon from the ribbon supply end to the ribbon retrieving end, a light source for emitting light, an optical sensor installed in the position that the optical sensor can sense the light emitted from the light source when the thickness of the remaining ribbon on the ribbon supply end is less than a predetermined value and the optical sensor can not sense the light emitted from the light source when the thickness of the remaining ribbon on the ribbon supply end is not less than the predetermined value, and a control module for controlling the printer according to whether the optical sensor can sense the light emitted from the light source or not.
Patent TW-I248303-B (TW)
Title: Method of taking a picture by composing images
Inventor: HO DAI-SHUI
IPC: G06F9/44
Filed: 2004-11-17
Granted: 2006-01-21
Abstract: The present invention provides a method of taking a picture for a camera device by composing images, wherein an image software installed in the camera device provides a plurality of frames each having a plurality of image reserved areas. The method comprises the steps of running the image software; selecting one of the frames by a user through the image software; enabling the camera device to capture at least one image data record; enabling the camera device to run the image software to locate each of image data records in each of the image reserved areas of the selected frame; and forming a composite picture (e.g., portrait), so as to easily compose a picture prior to taking a picture of same.
Patent TW-I259507-B (TW)
Title: Circuit device and method for making same
Inventor: KATO ATSUSHI
IPC: H05K3/28
Filed: 2004-12-27
Granted: 2006-08-01
Abstract: In a conventional circuit device, passive elements are soldered to mounting lands with solder as electrodes are tin plated, and therefore a single layer cross-wiring is impossible when passive elements are mounted on the circuit device. Therefore, a larger mounting area is required, the reflow temperature of the reflow process when mounting passive elements on a printed circuit board is limited, and the reliability is deteriorated due to cracking of solder after packaging. This invention provides a new circuit device in which the electrodes for passive elements are gold plated, and the bonding wires are directly press fixed to the electrodes. As a result the mounting density can be improved. Furthermore, an increase of the thickness of the package is controlled by employing the package without a supporting substrate and fixing the bonding wires by bonding the passive elements in an isolation trench.
Patent TW-I404355-B (TW)
Title: Pilot transmission and channel estimation for miso and mimo receivers in a multi-antenna system
Inventor: KADOUS TAMER
IPC: H04B7/06
Filed: 2005-03-04
Granted: 2013-08-01
Abstract: A transmitter generates multiple composite pilots with a training matrix and a gain matrix. Each composite pilot includes multiple training pilots generated with multiple columns of the training matrix and scaled with multiple gain elements in a column of the gain matrix. The transmitter transmits each composite pilot via multiple transmit antennas. A MISO receiver obtains received symbols for the multiple composite pilots and derives an estimate of a composite MISO channel. For OFDM, the MISO receiver derives an initial impulse response estimate for each composite pilot, filters the initial impulse response estimates for all composite pilots, and derives a frequency response estimate for the composite MISO channel. A MIMO receiver obtains and processes received symbols for the multiple composite pilots based on the training and gain matrices and derives channel estimates for individual SISO channels between the multiple transmit antennas and multiple receive antennas.
Patent TW-I264248-B (TW)
Title: A method of electrostatic discharge prevention for a systematic circuit
Inventor: LIN CHIN-YUAN
IPC: G06F1/00
Filed: 2005-03-25
Granted: 2006-10-11
Abstract: This invention presented is a method of electrostatic discharge prevention for a systematic circuit, changing the system operation state into an idle mode by the mechanism displacements to make the systematic chip of hardware remain in the non-operating state, and then prevent the external electrostatic discharge transmitting the electric charge to the electronic element and causing the static electric charge impact to the hardware systematic of chip.
Patent TW-I258857-B (TW)
Title: Method for automatic equalizing mode selection and its device
Inventor: HUANG KE-CHIANG
IPC: H01L27/01
Filed: 2005-04-26
Granted: 2006-07-21
Abstract: A method and a device for automatic equalizing mode selection are disclosed. The method comprises steps of: providing first sampling pulses in response to an equalized signal; providing second sampling pulses lagging behind the first sampling pulses for a pre-determined phase shift for sampling the equalized signal; establishing a first observing window and a second observing window according to the first sampling pulses and the second sampling pulses, so as to determine whether each of a plurality of equalizing modes is good or bad; and selecting one equalizing mode to respond to the judging step. Because the first sampling pulses and the second sampling pulses are not necessary to precisely fall at the point of time with specific equalizing signals, the phenomenon of judging mistakes during judgment can be avoided.
Patent TW-I289300-B (TW)
Title: Optical disk device
Inventor: MASHIMO AKIRA
IPC: G11B7/007
Filed: 2005-04-27
Granted: 2007-11-01
Abstract: In a HD (Hi-Definition)-DVD, address information is utilized to check an optical disk. In an optical disk 10 of HD-DVD type, data is recorded in both lands and grooves. G track address group for the specific application of grooves is formed in a groove track, while L track address group for the specific application of lands is formed in a land track. When a target groove track is determined to be ""n"", the address information of L track address group of the same target groove track is read, and judged whether it is ""n"" or ""n-1"". If the read address is ""n"" or ""n-1"", then we judge that optical disk 10 is normal, otherwise optical disk 10 is abnormal.
Patent TW-I276519-B (TW)
Title: A stackable barber scissors
Inventor: YEH WEN-YA
IPC: B26B13/12
Filed: 2005-06-06
Granted: 2007-03-21
Abstract: This invention relates to a stackable barber scissors, which consists of a first blade and a second blade pivoted with each other. Both the first blade and the second blade have an extended handle on their bottom ends respectively. Each handle has a first side of pre-determined shape and a second side in opposite to the first side at certain distance. In between the first side and the second side, there is a perimeter surface that connects the two sides so as to form the handle with certain thickness. There is at least a buckle piece mounted on the first side of the handle. The buckle piece consists of a base plate and two clasping parts on two sides of the base plate. There are slots formed on the handle, in corresponding to the buckle piece, for the clasping parts to insert and engage with so that a multiple pairs of scissors can be stacked together, which enables the barber to hold multiple pairs of scissors at a time for cutting or trimming hair with one hand.
Patent TW-I282631-B (TW)
Title: A wire-bonding free packaging structure of light emitted diode
Inventor: SHIE JIN-SHOWN
IPC: H01L33/00
Filed: 2005-07-11
Granted: 2007-06-11
Abstract: The present invention discloses a wire-bonding free packaging structure for light emitting diode (LED). Prepare a silicon sub-mount having a backside bulk micromachining reach-through U-shape cavity for accommodating a flip-chip LED, the silicon cavity side wall is selectively deposited metal by selective plating to form optical reflecting mirror. This stack-integrated packaging module with one or two layers of solder bumps on the surface to make the flip-chip bonding of surface mount package easier, heat conduction better and strengthen the dielectric membrane. This module is then bonded to a PC board with flip-chip surface mount technology (SMT) or bump technology. This gives very good heat conduction to the heat sink of the PC board and can endure more current to enhance light intensity of the LED. This stack-integrated packaging module can also be bonded on an ordinary bonding seat of two leg packaging, which can also increase heat conduction.
Patent TW-I345499-B (TW)
Title: Miter lock assembly for miter saws
Inventor: GEHRET ROBERT S
IPC: B27B5/16
Filed: 2005-07-12
Granted: 2011-07-21
Abstract: A power tool comprising: 
a base assembly (10); 
a fixed table (16), wherein the fixed table is pivotally attached to the base assembly; 
a rotatable table (17) rotatably disposed on the fixed table; 
a saw assembly (20) supported by the rotatable table, wherein the fixed table (16) is movable between a first position where the saw assembly (20) is disposed above the fixed table, and a second position where the saw assembly is disposed below the fixed table, and wherein the fixed table has a first plane for supporting a workpiece when in the first position, and a second plane for supporting the workpiece when in the second position; and 
a miter lock assembly (40) comprising a housing attached to the rotatable table, and a knob (42K) engaging the housing, wherein the location of the rotatable table relative to the fixed table is locked when the knob is moved along a direction substantially perpendicular to at least one of the fixed table and the rotatable table; whereby the miter lock assembly (40) is coplanar or below the second plane when the fixed table (16) is in the second position.
Patent TW-I389501-B (TW)
Title: Rate prediction in fractional reuse systems
Inventor: KHANDEKAR AAMOD
IPC: H04B1/7143
Filed: 2005-07-15
Granted: 2013-03-11
Abstract: A method of determining a Channel Quality Indicator (CQI) in a fractional reuse communication system, the method comprising: selecting a subcarrier of a plurality of subcarriers; determining a fractional reuse set based on the subcarrier; and determining the CQI based on the fractional reuse set and a corresponding apparatus.
Patent TW-I262059-B (TW)
Title: A shoe for inducing electric power
Inventor: LIN CHANG-KUANG
IPC: A43B7/02
Filed: 2005-08-08
Granted: 2006-09-21
Abstract: A shoe for inducing electric power comprises a shoe body, a bottom layer located in the bottom of the shoe body, a container located between the shoe body and the bottom layer and an outputting device. A fixed coil and a horizontal supporting rod with two rigid ends are located in the container. The fixed coil and the outputting device are electric connecting. The horizontal supporting rod is connected to a swinging device with a bearing. A magnetic device is located on one end of the swinging device and a driving device is located on the other end. The swinging device moves backward and forward by using the horizontal supporting rod as an axis when a pressing force is driven by a use. As a result, the magnetic device and the fixed coil is relative turned to induce an inductive electromotive force effecting the outputting device heating or lighting.
Patent TW-I321404-B (TW)
Title: Five-level feed-back digital-to-analog converter for a switched capacitor sigma-delta analog-to-digital converter
Inventor: DEVAL PHILIPPE
IPC: H03M3/02
Filed: 2005-08-19
Granted: 2010-03-01
Abstract: A five-level feed-back digital-to-analog converter (DAC) in a switched capacitor sigma-delta analog-to-digital converter has an improved switching sequence that boosts from two to five the number of quantization levels of the feed-back DAC. Switching sequences are used to obtain five equally distributed charge levels C*V<SMALLCAPS>REF</SMALLCAPS>, C*V<SMALLCAPS>REF</SMALLCAPS>/2, 0, -C*V<SMALLCAPS>REF</SMALLCAPS>/2 and -C*V<SMALLCAPS>REF</SMALLCAPS>. When summed with an input voltage, V<SMALLCAPS>IN</SMALLCAPS>, the five-level feed-back DAC produces five equally distributed output voltages of A*V<SMALLCAPS>IN</SMALLCAPS>+V<SMALLCAPS>REF</SMALLCAPS>, A*V<SMALLCAPS>IN</SMALLCAPS>+V<SMALLCAPS>REF</SMALLCAPS>/2, A*V<SMALLCAPS>IN</SMALLCAPS>+0, A*V<SMALLCAPS>IN</SMALLCAPS>-V<SMALLCAPS>REF</SMALLCAPS>/2 and A*V<SMALLCAPS>IN</SMALLCAPS>-V<SMALLCAPS>REF</SMALLCAPS>, where A is gain, V<SMALLCAPS>IN </SMALLCAPS>is the input voltage, and V<SMALLCAPS>REF </SMALLCAPS>is the reference voltage.
Patent TW-I261846-B (TW)
Title: Variable resistor free of limitation of rotation angle
Inventor: LIAO WEN-CHANG
IPC: H01C10/24
Filed: 2005-10-25
Granted: 2006-09-11
Abstract: A variable resistor free of limitation of rotation angle comprises a rotation shaft, a shaft bushing, a fixing frame, a retainer ring, a rotation member, a contact piece, a base and a circuit board, wherein there is no conflict between the rotation member and the fixing frame within a rotation angle, and a plurality of variable resistor carbon films are disposed on a surface of the circuit board and arranged in the form of concentric rings with different radiuses such that brush pins of the contact piece on the top side of the circuit board is electrically connected with a surface of the variable resistor carbon film. When the rotation shaft consistently rotates in a direction, a gradually increasing or decreasing resistance value variation between the brush pins of the contact piece and the variable resistor carbon film can be continuously and cyclically generated.
Patent TW-I287325-B (TW)
Title: Connector capable of easily increasing a holding force for holding a connection object
Inventor: MORITAKE TOSHIYUKI
IPC: H01R13/639
Filed: 2005-11-17
Granted: 2007-09-21
Abstract: In a connector to be connected to a connection object, a housing holds a contact having a conductivity. An operating member is coupled to the housing to bring a part of the connection object into press contact with the contact. The connector is provided with a locking member which is for clamping the other part of the connection object in cooperation with the operating member. It is preferable that the locking member is engaged with the operating member and the housing to lock the operating member with respect to the housing.
Patent TW-I291756-B (TW)
Title: Low cost lead-free preplated leadframe having improved adhesion and solderability
Inventor: ABBOTT DONALD C
IPC: H01L23/48
Filed: 2005-12-30
Granted: 2007-12-21
Abstract: A leadframe with a structure made of a base metal (105), wherein the structure has a plurality of surfaces. On each of these surfaces are metal layers in a stack adherent to the base metal. The stack comprises a nickel layer (201) in contact with the base metal, a palladium layer (202) in contact with the nickel layer, and an outermost tin layer (203) in contact with the palladium layer. In terms of preferred layer thicknesses, the nickel layer is between about 0.5 and 2.0 mum thick, the palladium layer between about 5 and 150 nm thick, and the tin layer less than about 5 nm thick, preferably about 3 nm. At this thinness, the tin has no capability of forming whiskers, but offers superb adhesion to polymeric encapsulation materials, improved characteristics for reliable stitch bonding as well as affinity to reflow metals (solders).
Patent TW-I283892-B (TW)
Title: Vertical metal-insulator-metal (MIM) capacitor and method of fabricating the same
Inventor: LEE CHARLES
IPC: H01L21/02
Filed: 2006-01-12
Granted: 2007-07-11
Abstract: A method of fabricating a vertical MIM capacitor. An insulation layer is formed on a substrate. The insulation layer is patterned to form an opening in a predetermined area of a core electrode, the opening filled to form a sacrificial plug. The insulation layer is patterned to form a trench in a predetermined area of an outer electrode around the sacrificial plug, and a fenced insulation layer around the sacrificial plug remains simultaneously. The sacrificial plug is removed, and a metal layer is filled in the predetermined area of the core and outer electrodes. A MIM capacitor made up of the core electrode, fenced insulation layer, and outer electrode is formed. A vertical MIM capacitor is also disclosed.