baber/WOPTO huggingface dataset:
Patent TW-202217789-A (TW)
Title: Offset voltage compensation circuit, OLED display device and information processing device which can compensate the offset voltage (ELV DD/ELV SS) according to the RC path impedance of the transmission line of the OLED panel
Inventor: HAO RONG-JIE
IPC: G05F1/10
Filed: 2020-10-20
Abstract: The present invention mainly discloses an offset voltage compensation circuit, which is applied in an OLED display and used for performing a voltage compensation process on at least one offset voltage (ELV DD/ELV SS) according to a RC path impedance existing between M×N sub-pixel units of the OLED display panel and the offset voltage supply unit so that (M/K)×(N/L) of at least one offset voltage after the voltage compensation process is completed are transferred by partitions to (M/K)×(N/L) display areas, each of which includes K×L sub-pixel units, thereby eliminating the voltage difference between the offset voltage delivered to the display area furthest from the offset voltage supply unit and the offset voltage delivered to the display area closest to the offset voltage supply unit so that all display areas exhibit uniform luminous brightness. The OLED display device has a main substrate, at least one flexible circuit board and an OLED panel. The at least one flexible circuit board is connected to the main substrate and the OLED panel. An offset voltage compensation circuit is arranged on the main substrate. The offset voltage compensation circuit has a plurality of first buffer circuits and/or a plurality of second buffer circuits, wherein each of the first buffer circuits is used for generating a first offset voltage according to a first reference voltage, each of the second buffer circuits is used for generating a second offset voltage according to a second reference voltage, and the first offset voltage is higher than the second offset voltage. The OLED panel has a plurality of partitions, each of which is coupled to the first offset voltage and/or the second offset voltage through the flexible circuit board. The first buffer circuit and the second buffer circuit are operational amplifier circuits. The OLED panel is an active OLED panel or a passive OLED panel.
Patent TW-202144593-A (TW)
Title: Ag alloy sputtering target
Inventor: HAYASHI YUJIRO
IPC: C22F1/00
Filed: 2020-10-26
Abstract: This Ag alloy sputtering target comprises an Ag alloy that includes Ge and In, and the crystallite diameter thereof as derived by the Scherrer equation is 220 Å or less. The Ag alloy preferably has a composition containing In in a range of 0.1-1.5 mass% (inclusive) and Ge in a range of 0.1-7.5 mass% (inclusive), the balance being Ag and unavoidable impurities.
Patent TW-202133259-A (TW)
Title: A semiconductor wafer dicing process
Inventor: DAY MATTHEW MICHAEL
IPC: H01L21/3065
Filed: 2020-11-10
Abstract: A semiconductor wafer dicing process is disclosed for dicing a wafer into individual dies, each die comprising an integrated circuit. The process comprises coating a semiconductor wafer with a polymer coating, disposing the wafer comprising the coating upon an adhesive tape and mounting the tape upon a wafer frame. The process further comprises forming scribe lines within the polymer coating to expose regions of wafer to form a pre-processed product. The wafer frame is subsequently disposed upon a support within a process chamber and a frame cover is disposed over the wafer frame to cover at least a portion of the wafer frame and adhesive tape. The process further comprises plasma etching the pre-processed product within the chamber to remove the exposed regions of the wafer to separate the individual dies, to form a processed product. The frame cover is then removed from over the wafer frame and the processed product, wafer frame and adhesive tape are exposed to an oxygen plasma within the chamber to partially remove an outermost region of the polymer coating which is most heavily contaminated with fluorine, to leave a residual polymer coating on the individual dies, to form a post-processed product. The residual polymer coating on the individual dies of the post-processed product is then removed using a wet removal technique.
Patent TW-202125997-A (TW)
Title: Downlink common burst channelization
Inventor: JI TINGFANG
IPC: H04W48/08
Filed: 2017-01-20
Abstract: Techniques for utilizing resources in a downlink (DL) common burst are described herein. In one aspect, a channel state information reference signal (CSI-RS) may be included in the DL common burst for channel estimation. In another aspect, a demodulation reference signal (DM-RS) and DL data may be included in the DL common burst for low latency data transmission. In yet another aspect, a measurement reference signal (M-RS) may be included in the DL common burst to assist handover decisions. The techniques described herein may be used for various wireless communications systems.
Patent TW-202134431-A (TW)
Title: Ny-eso-1-containing artificial adjuvant vector cell used for treating cancer
Inventor: AKIBA Ayaka
IPC: C12N5/10
Filed: 2020-12-01
Abstract: The present invention addresses the problem of providing an aAVC-NY-ESO-1 cell, which stably expresses NY-ESO-1 and is clinically applicable, in order to use the aAVC-NY-ESO-1 cell to treat a patient with NY-ESO-1 expressing cancer. The present invention provides a human-derived cell including, for example, a polynucleotide encoding CD1d, and a polynucleotide encoding NY-ESO-1 which is operably linked to an inducible promoter or a fragment thereof.
Patent TW-202222522-A (TW)
Title: Utility knife
Inventor: CHEN YUNG-SHUN
IPC: B26B1/08
Filed: 2020-12-04
Abstract: A utility knife is provided, including: a housing, defining an operation compartment and a storage compartment; a blade holder, movably received within the operation compartment; a blade storing carrier, movably received within the storage compartment, including a receiving portion and a grip portion which are connected with each other, the grip portion being protrusive out of the housing; and a locking mechanism, including a base body, a movable member, a first engaging member and a second engaging member, the base body being disposed to the housing, the movable member being attached to the base body, the first engaging member being disposed on and movable with the movable member, the second engaging member being disposed on the blade storing carrier, one of the first engaging member and the second engaging member including a slot, the other of the first engaging member and the second engaging member including a projection which is releasably engaged within the slot.
Patent TW-202136779-A (TW)
Title: Immunoassay method and immunoassay device
Inventor: KUWAHARA MIWA
IPC: G01N33/569
Filed: 2020-12-11
Abstract: The present invention provides a highly-sensitive antibody and a test reagent using the same. An immunoassay method for detecting an analyte by an immunoassay method using a carrier to which an antigen, an antibody, or an antigen-binding fragment thereof is fixed, the immunoassay method comprising detecting an analyte, with detection sensitivity increased by using a carrier to which an antigen, an antibody, or an antigen-binding fragment thereof is fixed by adding a dissacharide and a sugar alcohol to a solution containing the antigen, the antibody, or the antigen-binding fragment thereof.
Patent TW-202225420-A (TW)
Inventor: YEN YEE-WEN
IPC: B23K35/26
Filed: 2020-12-15
Abstract: 本揭露提供一種複合焊料及其製造方法。製造複合焊料的方法包括以下步驟。提供包含有Ag和Bi的二元合金的第一焊料。相對於100重量份的二元合金，Ag的含量約為2.5重量份，Bi的含量約為97.5重量份。提供包含有Sn、Ag和Cu的三元合金的第二焊料。相對於100重量份的三元合金，Sn的含量約為96.5重量份，Ag的含量約為3重量份，Cu的含量約為0.5重量份。在混合溫度下混合第一焊料和第二焊料以形成複合焊料。
Patent TW-202132266-A (TW)
Title: Organic electronic device comprising a compound of formula (1), display device comprising the organic electronic device as well as compounds of formula (1) for use in organic electronic devices
Inventor: UVAROV VLADIMIR
IPC: C09K11/06
Filed: 2020-12-18
Abstract: The present invention relates to an organic electronic device comprising a semiconductor layer which comprises a compound of formula (1).
Patent TW-202226066-A (TW)
Inventor: HUANG KUO-EN
IPC: G16H50/20
Filed: 2020-12-29
Abstract: 本發明揭示一種用於辨識生理量測裝置及其數據之系統及方法以及內儲用於辨識生理量測裝置及其數據的程式之電腦程式產品，其中，當執行該程式後，係完成以下步驟：辨識第一影像中的生理量測裝置；根據辨識結果於用戶端檔案中進行搜尋，以取得與生理量測裝置對應的導引框，俾顯示與生理量測裝置對應的導引框；對在導引框中的物件進行影像擷取，以獲得第二影像；根據辨識結果來辨識第二影像中的量測數據，以輸出量測數據。
Patent TW-202136532-A (TW)
Title: Cu-ni-si based copper alloy plate material and manufacturing method thereof, and conductive component
Inventor: JIANG WAN-QING
IPC: C22F1/08
Filed: 2021-01-06
Abstract: An object of the present invention is to provide a Cu-Ni-Si based copper alloy plate material which has etching characteristics advantageous for obtaining high dimensional accuracy even in etching with very narrow pitch. 
 
     As a solution, the copper alloy plate material of the present invention has a chemical composition containing Ni: 1.00 to 4.50% and Si: 0.10 to 1.20% by mass, 
and optionally at least one of Co, Mg, Cr, P, B, Mn, Sn, Ti, Zr, Al, Fe, Zn, and Ag in an appropriate amount, wherein in EBSD measurement for a cross section perpendicular to a rolling direction, when the area of the region satisfying at least one of the condition that the crystal orientation difference from the S1 orientation {241} <112> is within 10° and the condition that the crystal orientation difference from the S2 orientation {231} <124> is within 10° is defined as SS, and the area of the region where the crystal orientation difference from the Brass orientation {011} <211> is within 10° is defined as SB, area ratio SB/SS is 0.40 or more.
Patent TW-202228964-A (TW)
Title: System and method for detecting influences from vehicle
Inventor: WU CHO-HAN
IPC: B25J19/04
Filed: 2021-01-15
Abstract: The present disclosure describes a system and method for detecting influences from vehicle, which is adapted to detect the influences on a sensing set from a branch structure connecting to a main structure. The method calculates a position of the branch structure according to a rotation or movement of a first connecting structure which connects the main structure and the branch structure, compares the position of the branch structure and a position of a specific area in which an object can be sensed by the sensing set, and determines whether the branch structure enters into the specific area such that a sensing result of the sensing set is influenced.
Patent TW-202144910-A (TW)
Title: 清潔光遮罩的方法及清潔裝置
Inventor: LEE HSIN-CHANG
IPC: G03F1/82
Filed: 2021-01-26
Abstract: 在一種清潔光遮罩之方法中，將光遮罩放置於支撐件上，使得經圖案化表面面朝下，且將黏著片施加於該光遮罩之背面的邊緣。
Patent TW-202226388-A (TW)
Title: Method for manufacturing semiconductor device and semiconductor manufacturing device
Inventor: SHIMA MASAYA
IPC: H01L21/67
Filed: 2021-02-01
Abstract: To provide a method for manufacturing a semiconductor device capable of improving manufacturing throughput, and a semiconductor manufacturing device. According to an embodiment there is provided a method for manufacturing a semiconductor device. The method includes sticking a sheet to a substrate, individualizing the substrate into a plurality of chips, increasing a space between a plurality of chips by expanding the sheet, forming a sealing body by covering and sealing a principal surface and a side surface of each of the plurality of chips with a resin, and forming a laminate laminated with a plurality of sealing bodies. The plurality of sealing bodies include first and second sealing bodies. Forming the laminate includes laminating the second sealing body on the first sealing body with a chip position in the second sealing body being offset in a plane direction with respect to a chip position in the first sealing body.
Patent TW-202120120-A (TW)
Inventor: FARES FUAD
IPC: A61K38/27
Filed: 2014-10-21
Abstract: 揭露CTP修飾的人類生長激素多肽以及含有該多肽的藥物製劑和藥物組合物，以及其生產和使用它們的方法。
Patent TW-202146333-A (TW)
Title: Method for producing sol of surface-modified silica particles dispersed in organic solvent
Inventor: IMAI SHOTA
IPC: C01B33/149
Filed: 2021-03-03
Abstract: To provide a method for producing a sol of surface-modified silica particles dispersed in an organic solvent which has excellent storage stability. A method for producing a sol of surface-modified silica particles dispersed in an organic solvent, the method comprising the following steps (A) to (C). (A) A step for mixing a sol of surface-unmodified silica particles dispersed in an organic solvent with a silane coupling agent. (B) A step for adding a basic compound to the product obtained in the step (A). (C) A step for bringing a cation exchange resin into contact with the product obtained in the step (B).
Patent TW-202200547-A (TW)
Title: 喹啉酮化合物的新穎鹽類
Inventor: SHARMA RAJIV
IPC: A61K31/47
Filed: 2021-03-12
Abstract: 本發明關於新穎的式(Ia)之醫藥上可接受的鹽類。本發明亦關於製備該新穎鹽類之方法及其醫藥組成物。本發明之化合物為脯胺醯基羥化酶抑制劑且適合於治療貧血。
Patent TW-202144121-A (TW)
Title: Method for manufacturing carrier for double-side polishing device, carrier for double-side polishing device, and method for wafer double-side polishing
Inventor: YOSHIDA YASUKI
IPC: B24B37/08
Filed: 2021-03-23
Abstract: The present invention is a method for manufacturing a carrier for a double-side polishing device that has an upper surface plate and a lower surface plate with polishing cloths adhered thereto, said carrier having a carrier base material and a resin insert, said carrier base material having a retention hole formed therein for retaining a wafer, and said resin insert being positioned along an inner circumference surface of the retention hole and having an inner circumference section formed therein that contacts an outer circumference section of the wafer. This method for manufacturing a carrier for a double-side polishing device has: a preparation step in which the carrier base material and the resin insert, which is thicker than the carrier base material, are prepared; a forming step in which the resin insert is formed on the inner circumference surface of the retention hole in an unbonded manner and so as to have a peel strength of 10N to 50N; and a startup polishing step in which the double-side polishing device is used to perform startup polishing, with a multi-level load of two or more levels, of the carrier that comprises the carrier base material and the resin insert. Accordingly, the present invention provides a manufacturing method for a carrier for a double-side polishing device wherein obverse/reverse discrepancy in the level difference between the resin insert and the carrier base material in the carrier for a double-side polishing device can be reduced.
Patent TW-202227463-A (TW)
Title: Unsaturated group-containing phosphoric acid ester, thermosetting resin composition containing same, and resin material
Inventor: MOCHIZUKI Yusaku
IPC: H05K1/03
Filed: 2021-04-01
Abstract: The present invention addresses the problem of providing a highly heat-resistant thermosetting resin composition able to be used in a high frequency printed circuit board. Provided is a phosphoric acid ester compound having an ethylenically unsaturated bond. This compound can be added as a modifier to a thermosetting resin such as an ethylenically unsaturated bond-containing poly(phenylene ether) resin. Also provided is a thermosetting resin composition that contains this modifier and a thermosetting resin. This thermosetting resin composition has the advantage of exhibiting high heat resistance. Furthermore, it is possible to achieve excellent dielectric properties and high heat resistance, which are required of printed circuit boards for next generation communication standards.
Patent TW-202131537-A (TW)
Title: Light-emitting device, light-emitting apparatus, electronic device, and lighting device
Inventor: SEO SATOSHI
IPC: C07D209/80
Filed: 2019-09-24
Abstract: A light-emitting device including an EL layer including a first layer, a second layer, a
third layer, a light-emitting layer, and a fourth layer in this order from the anode side is provided.
The first layer contains a first organic compound and a second organic compound. The light-emitting layer contains a sixth organic compound. The fourth layer contains a seventh organic
compound. The first organic compound exhibits an electron-accepting property with respect to
the second organic compound. A HOMO level of the second organic compound is higher than
or equal to -5.7 eV and lower than or equal to -5.2 eV. A HOMO level of the third organic compound is equal to or deeper than the HOMO level of the second organic compound. A difference between the HOMO levels of the second organic compound and the third organic compound is less than or equal to 0.2 eV. A LUMO level of the sixth organic compound is shallower than a LUMO level of the seventh organic compound.
Patent TW-202209942-A (TW)
Inventor: KE TSUNG-YING
IPC: H05K3/02
Filed: 2021-04-13
Abstract: An electronic device includes a stretchable substrate, a plurality of components, and at least one stretchable traces. The components and the stretchable trace are disposed on the stretchable substrate, where the stretchable trace is connected at least two components. The stretchable trace includes a resilient conductive pattern layer and a protective layer. The protective layer disposed between the resilient conductive pattern layer and the stretchable substrate covers the lower surface of the resilient conductive pattern layer that is not stretched completely. The protective layer has a plurality of first notches, a plurality of second notches, and first and second sides opposite to each other. The first notches are arranged along the first side, whereas the second notches are arranged along the second side, in which the adjacent both of the first notch and the second notch align with each other.
Patent TW-202147753-A (TW)
Inventor: CARTER DANIEL
IPC: H05H1/46
Filed: 2021-04-22
Abstract: Systems, methods and apparatus for regulating ion energies in a plasma chamber and avoiding excessive and damaging charge buildup on the substrate surface and within capacitive structures being built on the surface. An exemplary method includes placing a substrate in a plasma chamber, forming a plasma in the plasma chamber, controllably switching power to the substrate so as to apply a periodic voltage function (or a modified periodic voltage function) to the substrate, and modulating, over multiple cycles of the periodic voltage function, the periodic voltage function responsive to a defined distribution of energies of ions at the surface of the substrate so as to effectuate the defined distribution of ion energies on a time-averaged basis, and to maintain surface charge buildup below a threshold.
Patent TW-202244324-A (TW)
Title: Copper surface microetching agent capable of quickly removing oxides on the copper surface and having a lower copper etching level to prevent line stripping
Inventor: ZHENG JING-HONG
IPC: H05K3/06
Filed: 2021-05-04
Abstract: The present invention relates to a copper surface microetching agent, and the copper surface microetching agent is an aqueous solution prepared by oxidizing agents, acids and oxoacid compounds containing lanthanide elements, which is used for copper surface treatment in printed circuit boards and semiconductor manufacturing processes. The copper surface microetching agent can quickly remove oxides on the copper surface, and has a lower copper etching level, such that less side etching is resulted on the copper line to prevent line stripping. The present invention meets the application requirements for thinning printed circuit boards.
Patent TW-202217838-A (TW)
Inventor: CHEN SAMUEL SHENG HSIUNG
IPC: G16H30/40
Filed: 2021-05-27
Abstract: Example methods and systems to obtain images associated with target cells distributed in a cytology specimen have been disclosed. One example method includes obtaining a first image associated with a first region of the cytology specimen through a first object lens, determining a first subregion of the first region, obtaining a second set of one or more images associated with the first subregion through a second object lens, identifying a third image from the first image, and in response to a ratio of a second number of the target cells in the second set of one or more images to the first number of the target cells in the third image being in a predetermined range, obtaining images associated with the target cells based on the second set of images.
Patent TW-202248694-A (TW)
Inventor: WU WEN-CHENG
IPC: H04B10/25
Filed: 2021-06-01
Abstract: 本專利揭露一種光電訊號轉換傳輸裝置，包括有相互對接結合之光電訊號模組及光纖接頭；該光電訊號模組之光電訊號處理機板設有單一或複數轉接板，由轉接板之第一對接面分別設有複數發光元件及複數收光元件及訊號放大器，可令光電訊號處理機板、複數發光/收光元件及訊號放大器，由複數第一、二打線接合電性連接而形成導通；光纖接頭所設複數光纖其末端與複數發光/收光元件相互軸向對準；如此，透過複數發光/收光元件及訊號放大器相同設於轉接板之第一對接面並相鄰光電訊號處理機板，有效縮減訊號放大器與複數發光/收光元件及光電訊號處理機板之間的物理結構(打線接合)距離，達到減少信號衰減與提升訊號傳輸效益及達到整體結構微型化效益。
Patent TW-202203385-A (TW)
Title: Circuit board having cavity and manufacturing method thereof
Inventor: TSUYUTANI KAZUTOSHI
IPC: H01L23/52
Filed: 2021-06-07
Abstract: The present invention provides a circuit substrate forming cavity for accommodating electronic components such as sensor chips and having a multilayered wiring structure.
The circuit board 1 of the present invention is provided with an insulating layer 4 laminated on a surface of an insulating layer 3. The insulating layer 4 forms a cavity C exposing the surface of the insulating layer 3, and the insulating layer 3 forms a through hole T connecting with the cavity. An overhanging shape is formed near the bottom of the inner wall of the cavity C. There is a structure laminating several insulating layers, so that the substrate can be made into a multilayer wiring structure. Moreover, the overhanging shape is formed near the bottom of the inner wall of the cavity C, so that a bonding strength can be enhanced in the case where electronic components 70 such as sensor chips contained in the cavity C are fixed by adhesive 74.
Patent TW-202202578-A (TW)
Inventor: ZONG JIAN
IPC: C09D4/02
Filed: 2021-06-07
Abstract: Embodiments of the present invention provide a protective coating. The protective coating includes a first coating formed by a plasma polymerization of a monomer A which includes a silicon structural unit, a secondary amine structural unit or a primary amine structural unit and a monomer B which includes a carboxyl end group structure on the surface of a base material. The protective coating is tightly combined with the base material and has excellent wear resistance.
Patent TW-202209404-A (TW)
Title: Plasma processing device for enhancing uniformity of plasma distribution and wafer etching
Inventor: LIAN ZENG-DI
IPC: H01J37/02
Filed: 2021-06-17
Abstract: The present invention discloses a plasma processing device, which comprises: a reaction chamber; an insulation window located at the top of the reaction chamber; a coil located on the insulation window including a first end and a second end; a first coil connecting member connected with the first end; a second coil connecting member connected with the second end; a radio frequency power source, wherein the radio frequency power source, the first coil connecting member, the coil, and the second coil connecting member form a loop to complete the connection with the radio frequency power source. When the radio frequency power source passes the coil, it will generate electromagnetic field. The magnetic field lines of the electromagnetic field penetrate the insulation window and enter the reaction chamber, and then penetrate the insulation window from the reaction chamber. When the radio frequency power source sequentially passed the first coil connecting member, the coil, and the second coil connecting member, the first shielding member may shield the electromagnetic field generated on the first coil connecting member and the second shielding member may shield the electromagnetic field generated on the second coil connecting member, so as to reduce the influence on the electromagnetic field generated by the coil, enhance the uniformity of plasma, and further enhance the uniformity of wafer etching.