baber/WOPTO huggingface dataset:
Patent JP-H0376269-A (JP)
Title: Semiconductor device
Inventor: KISHIMOTO SATORU
IPC: H01L29/41
Filed: 1989-08-18
Abstract: PURPOSE:To obtain a semiconductor device high in reliability and large in current carrying capacity by a method wherein a second electrodes is selectively formed on an electrode required to have a large current carrying capacity. CONSTITUTION:A plating base metal 2 is formed on a semiconductor substrate 1, and a first photoresist 3 is applied thereon, which is exposed to light and developed to form a first electrode opening 4, and a first electrode 5 is formed through electroplating. Then, the first photoresist 3 is removed, moreover the plating base metal 2 under the photoresist 3 is removed, and then an insulating film 6 is formed on the whole face. Then, a second photoresist 7 is applied onto the insulating film 6, which is patterned through light exposure and development, and then the insulating film 6 is etched using the patterned second photoresist 7 as a mask to form a second electrode opening 8. Next, a second electrode material 9' is evaporated on the whole face, the disused second electrode 9' is removed with the second photoresist 7, and a second electrode 9 is selectively formed on the first electrode 5.
Patent JP-H0555301-A (JP)
Title: Electronic circuit device
Inventor: YAMAMOTO YOSHIE
IPC: H01L21/60
Filed: 1991-08-26
Abstract: PURPOSE:To provide an electronic circuit device on which electronic parts can be face-down mounted on a wiring substrate without forming a bump electrode on the electronic parts such as an IC chip and the like, and to cut down the manufacturing cost. CONSTITUTION:In an electronic circuit device on which an IC chip 20 is face- down mounted on a wiring substrate 10, after a conductive layer 12, consisting of a thermoplastic resin composition, has been formed in a prescribed pattern on an insulating layer 11 consisting of a thermoplastic composition, an insulating layer 13, consisting of a thermoplastic resin composition and having an opening on a part of the conductive layer 12, is formed on the insulating layer 11 and the conductive layer 12. Then, a wiring substrate 10, on which the conductive layer 12 is exposed on the main surface on the side of an insulating layer 13 by pressing the layers 11 to 13 to the direction of lamination, is formed. Subsequently, an IC chip 20 is mounted on the wiring substrate 10 is such a manner that the electrode surface 21 is mated to the conductive layer 12 exposed to the above-mentioned main surface, and then the IC chip 20 is pressure-welded by heat to the wiring substrate 10.
Patent JP-2000048548-A (JP)
Title: Tape position detection method, detection device, and storage medium
Inventor: GOTO OSAMU
IPC: G11B27/17
Filed: 1998-07-29
Abstract: PROBLEM TO BE SOLVED: To improve the detection accuracy and response speed of a tape position and to reduce the wind-up time of a tape by subtracting a pulse one cycle before from the time when a pulse is generated from a reel and obtaining the most recent reel rotation speed at a current point constantly. SOLUTION: Reels A and B are provided with a slit and generate n pulses in each cycle. A counter generates a time signal and the latches A and B store the time when the reels A and B generate pulses. Time A1-An and B1-Bn store the occurrence time for each of n pulses in one cycle of the reels A and B and rewrites it at each time when a new pulse is generated. The cycles A and B subtract the time when the pulse in the previous cycle occurred and obtains and stores the cycle when the new pulses of the reels A and B occur. A CPU calculates a tape position from the most recent cycle data that the cycles A and B store. Even if the edge of the tape is close, the tape position can be detected rapidly.
Patent JP-H0376608-A (JP)
Title: Cylinder type hole saw
Inventor: MATSUDA YUSAKU
IPC: B23B51/05
Filed: 1989-08-18
Abstract: PURPOSE:To easily manufacture a cylinder type hole saws having the sharpness of their blades, being hardly damaged and further being different in size by providing a beltlike base plate to be fixed to a core and a plurality of cutting members containing cutting grains on the end portion of the base plate which is opposite to the core. CONSTITUTION:The core 12 of a cylinder type hole saw 10 has a plurality of protruding parts 14 at one of its end portions extended in an axial direction. A base plate 16 disposed on the core 12 is formed into a beltlike configuration having a plurality of recesses 16a at one of the end portions extended in the axial direction of said base plate, thereby forming a plurality of protrusions 16b. Moreover, cutting members 18 containing cutting grains such as diamond fine particles are formed on the protrusions 16b of the base plate 16, and the base plate 16 having the cutting members 18 are fixed to the core 12 so as to alternately pass through the outer and inner circumferential sides of the protruding parts 14 of the core 12. By this method, the cutting members 18 can be thinned in thickness, and when the cylinder type hole saw is used, a load applied on the cutting members can be reduced to improve the sharpness of the their blades. Further, cylinder type hole save different in size can be easily manufactured.
Patent JP-H1087339-A (JP)
Title: Recovery of helium for manufacturing optical fiber
Inventor: HEIM CARL JOSEPH
IPC: C01B23/00
Filed: 1997-07-25
Abstract: PROBLEM TO BE SOLVED: To provide a recovering method of helium which economically recovers substantial part of helium abandoned up heretofore a manufacturing process of an optical fiber. SOLUTION: Contaminated helium flow is recovered not only from an optical fiber line-drawing stage 40 but also from a preform sintering stage 30 and/or a preform accumulation stage 20 in the manufacturing process. Recovered helium is purified to a lover grade purity for supplying to a line-drawing station or is purified to a higher purity level for supplying to all stages in the manufacturing process. Otherwise, sufficient amount of the recovered helium for supplying to the fiber line-drawing stage in the line-drawing station is purified to the lower grade purity and is recycled to the line-drawing station and residual part of the recovered helium is purified to the higher purity level and is supplied back to other stages in the process to recycle.
Patent JP-S6369628-A (JP)
Title: Correction of tire uniformity
Inventor: TAKAGI HARUYUKI
IPC: B29D30/08
Filed: 1986-09-12
Abstract: PURPOSE:To correct the fluctuation of the widthwise force of a tire in a condition that the tire is attached, by a method wherein the (-) position of the rigidity of X-axis in the shoulder of the tire is worked by buffing in accordance with the fluctuation of rigidity, which is generated from the shoulder of the tire. CONSTITUTION:A drum 2 is pushed against a rotating tire W to detect the rigidity (component in the direction of RF, Ax, Bx) of both shoulders W1, W2 of the tire W in the direction of X-axis as well as the rigidity (component in the direction of LF, Ay, By) of the same in Y-axis by load cells 3a, 3b attached to a drum shaft 2a, while the detected data are outputted to a computer 5 by a rigidity detector 4. Further, the waveform of the rigidity in the direction of X-axis is processed by the computer 5, and the (-) part of the rigidity in X-axis in the shoulders is worked by buffing with grinding stones 6a, 6b based on said waveform processed, whereby the fluctuation of the widthwise force of the tire in a condition that the tire is attached may be corrected.
Patent JP-S6370519-A (JP)
Title: Positioning device
Inventor: ONODA RURI
IPC: H01L21/68
Filed: 1986-09-12
Abstract: PURPOSE:To perform the positioning operation in a highly accurate manner by a method wherein the quantity of driving in proportion to the deviation in a plurality of relative positionings conducted in the past on the two objects to be positioned is memorized and a positioning is performed while an absolute positioning length measurement operation is being conducted. CONSTITUTION:In a relative positioning (die-by-die mode) to be performed for every shot, a shot Sn is brought in the state wherein the relative positioning of the shot Sn is not completed. At this time, run-on quantities dn-1, dn-2 and dn-3 of the positioning in a plurality of shots such as shots Sn-1, Sn-2 and Sn-3, for example, performed before the error shot Sn, are added and averaged, and the data obtained therein of dn=(dn-1+dn-2+dn-3+...+dn-k/k(k is the prescribed constant) are memorized in a VPU 17 and a memory in advance. Then, an X-Y stage 3 is driven to the position P in which the adding quantity dn is corrected on the positioning starting position P' of the error shot Sn. As the stage 3 is brought into the position wherein the average adding quantity of positioning is corrected, the effect of the variation by aging of the wafer shape in response to the state of layer of the part 1 (first) in the wafer 2 and the process is not inflicted on the positioning.
Patent JP-S59104292-A (JP)
Title: Production of steel wire for welding
Inventor: YAMAZAKI TAKETOMO
IPC: B23K35/40
Filed: 1982-12-08
Abstract: PURPOSE:To produce stably a copper plated steel wire for welding having excellent feedability in a short time by coating carbonate on the surface of the steel wire then annealing the wire in an inert gaseous atmosphere then subjecting the wire to copper plating and drawing. CONSTITUTION:A steel wire is dipped in an aq. soln. of carbonate, such as potassium carbonate, and is dried, whereafter the wire is softened by annealing in a gaseous nitrogen atmosphere contg. an extremely small amt. of oxygen. An internal oxidized layer is then formed in a short time simultaneously with the annealing. The top surface layer of the iron oxide, etc. formed in the annealing is thereafter removed in a pickling stage which is a treatment prior to plating; at the same time, the thickness of said hard internal oxidized layer is adjusted and thereafter the wire is subjected to copper plating. The steel wire having the soft and elongatable plating layer on the outside peripheral part, the hard internal oxide layer in the intermediate part and the elongatable inside part softened by the annealing is thus obtd. Such wire is subjected to finish drawing to form fine tortoise shell-shaped crazings on the surface without spoiling the inter-layer adhesion. A micro lubricating state having the lubricant entering these crazes is formed, whereby the steel wire for welding having good feedability is obtd.
Patent JP-H0879946-A (JP)
Title: Bus bar connection structure
Inventor: KANESASHI SATSUKI
IPC: H02G3/16
Filed: 1994-09-07
Abstract: PURPOSE: To obtain a bus bar structure in which the interlayer connection is employed in the bus bar circuit in order to decrease the number of layers of wiring board being laminated in an electric connection box and the displacement between tabs is restricted by employing such shape as allowing insertion and connection of outer male terminal. CONSTITUTION: Second and third tabs 8, 10 rising, respectively, from second and third bus bars 7, 9 arranged on the lower layer side penetrate a through hole 4 opened at the root of a first tab 3 rising from the end part of a first bus bar 2 arranged on the upper layer side and then the second and third tabs 8, 10 are disposed oppositely to the first tab 3.
Patent JP-H0378235-A (JP)
Title: Lead frame
Inventor: BABA ISAO
IPC: H01L21/60
Filed: 1989-08-22
Abstract: PURPOSE:To improve productivity, reliability and to reduce an apparatus in size and thickness by electrically connecting a resin-sealed semiconductor chip to a lead frame through an adhered part provided at the end of an inner lead of the frame. CONSTITUTION:A connecting bump 12 is formed on a chip formed to be transferred to the end of a tapelike lead frame at the end of an inner lead of a lead frame 11 made of Cu or the like by Au plating or the like. After the bump 12 is aligned with the electrode pad of a semiconductor chip 13, it is adhered by thermocompression bonding. The bump 12 is formed of a plating layer 15 made of Ni, Cu, etc., and a second plating layer 16 made of Au, Pt, etc., formed on the layer 15. The end of the frame 11 is bent in a wing state, and upper and lower molding ratio is easily aligned on the lead in the case of sealing with resin. The warpage of a package can be suppressed, and the end of the frame 11 is bent in a wing state 12 to the side of the chip 13 to effectively prevent it from touching the edge.
Patent JP-S6273908-A (JP)
Inventor: TAKAHASHI RYUICHI
IPC: B32B13/04
Filed: 1985-09-26
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S58115224-A (JP)
Title: Two-line glow plug
Inventor: YOKOI SHINICHI
IPC: F23Q7/00
Filed: 1981-12-28
Abstract: PURPOSE:To provide a perfect air tightness between a heating tube and a metal pipe, by drawing the metal pipe externally engageable with the heating tube jointly with the heating tube, in a two-line glow plug adapted to preheat an internal combustion engine. CONSTITUTION:A two-line glow plug has a heating tube 2 co-axially engaged with and secured to the inside of a hollow attachment metal 1. The heating tube 1 has a metallic central electrode 22 centrally inserted into a sheath tube 21 with its top end closed, and a heating wire 23 intermediately positioned between the top end 22A and a base wall 21B of the sheath tube 21. The heating wire 23 is secured in place by filling a magnesium 24 and the like. In this case, the sheath tube 21 has its outer periphery externally engaged by the metallic pipe 3, and has its rear end including a portion engaged by the pipe 3 being swage-finished for reducing its outside diameter. This arangement can permit the tube 21 to be in close contact with the pipe 3, and an annular clearance defined between the  pipe 3 and the attachment metal 1 has a top end thereof secured in place by a glass sealing material 4.
Patent JP-S6272383-A (JP)
Inventor: HIROTA KIMIO
IPC: G09B5/00
Filed: 1985-09-26
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H0263184-A (JP)
Title: Semiconductor laser device
Inventor: HASEGAWA KAZUYOSHI
IPC: H01S5/00
Filed: 1988-08-29
Abstract: PURPOSE:To assure satisfactory mass-production, miniaturization, and low cost by placing an LD chip in a cap including a lens therethrough via a heat sink and the like, and forming part of the cap into a flat shape to die-bond said LD chip to said flat-shaped part. CONSTITUTION:An LD chip 1, a sub-mount 2, and a heat sink 3 are superimposed and joined with each other. The resulting LD chip 1 is die-bonded using a brazing material 12 or the like to a flat part of a cap 10 which includes a lens 11 mounted therethrough by positionally adjusting the LD chip 1 and the lens 11 in a direction z by energizing the LD chip 1 to obtain laser light A6 and monitoring the laser light B8 transmitted through the lens 11, and aligning them in directions x, y. For an electrode from the LD chip 1, there is provided a pattern electrode including an insulating film and the like on the sub-mount 2, block 3, and cap 10, and the like. After the die-bonding, the cap 10 is joined with a stem 9 with a lead terminal by making use a brazing material B14.
Patent JP-H0532641-A (JP)
Title: Mercaptotriazine derivative and herbicide containing the same as active ingredient
Inventor: GO ATSUSHI
IPC: C07D253/06
Filed: 1991-07-31
Abstract: PURPOSE:To obtain a new mercaptotriazine derivative having excellent weeding activity and useful as a herbicide capable of controlling weeds which grow in a paddy field and upland and having excellent safety to crops. CONSTITUTION:A compound, e.g., 3-(m-fluorophenyl) methylthio-5-methoxy-1,2,4- triazine, expressed by formula I [R<1> is lower alkyl, cycloalkyl, phenyl, benzyl or naphthyl capable of having one or more substituent groups such as halogen on an aromatic nuclei; R<2> is H or lower alkyl; R<3> is lower alkoxy, benzyloxy, COOH, alkoxy, cyanoalkoxy, alkoxycarbonylalkoxy or NR<5>R<6>; R<5> and R<6> are H or lower alkyl or R<5> and R<6> together form a ring; R<4> is H, lower alkyl, lower alkoxy, phenyl, lower alkoxycarbonyl or benzyloxycarbonyl]. The compound expressed by formula I-a in the above-mentioned compound is obtained by reacting a compound expressed by formula II with diazomethane in a proper solvent.
Patent JP-S58117687-A (JP)
Inventor: YAMAMOTO MINORU
IPC: H05B41/18
Filed: 1981-12-29
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H0642428-A (JP)
Title: High pressure fuel injection pipe and manufacture thereof
Inventor: TAKIGAWA KAZUYOSHI
IPC: F02M55/02
Filed: 1992-07-20
Abstract: PURPOSE:To prevent the chemical erosion of a connection head part and the mechanical cavitation by installing a cap-shaped collar which covers the connection head part and has a through hole at the center part and has an equal sectional shape and is made of the metal having a high strength and high erosionproofness, at the connection head part arranged at the edge part of an injection pipe. CONSTITUTION:As for a high pressure fuel injection pipe 1, a connection head part 2 having a truncated conical shape outside the axis center is arranged on one side or both side edge parts. A sleeve pusher 4 is installed at the neck lower part of the connection head part 2, and a tightening nut 5 in connection is assembled. In this case, at the connection head part 2, a cap-shaped collar 3 which covers the connection head part 2, has a through hole 3' at the center part and an equal sectional shape and is made of the metal material having a high strength and high erosionproofness is applied and engaged with the connection head part 2. Accordingly, the chemical erosion on the pressing surface including the top edge surface of the connection head part 2 and the generation of the mechanical cavitation can be effectively lightened and prevented. Further, the volume of the connection head part 2 is reduced by the volume portion of the cap-shaped collar 3, and an annular recessed groove on the inner peripheral surface of a flow hole 1' is made shallow.
Patent JP-S6192461-A (JP)
Title: Optomagnetic disc device
Inventor: IMURA MASAHARU
IPC: G11B11/10
Filed: 1984-10-12
Abstract: PURPOSE:To improve S/N of a reproducing signal, to attain light weight of a moving part and high-speed access by using a rod prism and applying a metallic film to the reflecting plane. CONSTITUTION:The metallic films 35, 36 are applied to full reflecting planes 14, 15 of the rod prism 13. In rotating the rod prism 13, the phase of P and S components on the full reflecting plane of the rod prism 13 is advanced respectively by phiP, phiS. In general, the reflecting factor is deteriorated at the reflection of the metallic surface, and the said phase difference (phiP-phiS) is known to be smaller than the full reflection, the phase difference on the full reflecting plane of the rod prism by the metallic surface reflection, not by the full reflection, is reduced by applying the metallic film to the full reflection plane of the rod prism and the reflecting light from the recording medium is minimized to be elliptic polarized light (as the elliptic rate of the elliptic polarized light is smaller, transmitted luminous amounts A'x, A'y of the analyzer are equal).
Patent JP-H0965156-A (JP)
Title: Image processor and method therefor
Inventor: SHIRAIWA KEISHIN
IPC: H04N1/48
Filed: 1995-08-23
Abstract: PROBLEM TO BE SOLVED: To provide an image processor and the method capable of performing color balance adjustment even when objects to be viewed as white are not present or a few. SOLUTION: The optional position of images is indicated by an image position indication mechanism 24 and the image data of an indicated position are inputted by an image data input mechanism 25. An image data extraction mechanism 22 extracts the image data equivalent to the indicated position from image pickup data held in an image pickup data holding mechanism 21. An image reproduction parameter decision mechanism 23 decides an image reproduction parameter based on the extracted image data and the inputted image data and a color balance adjustment mechanism 26 performs the color balance adjustment to the image pickup data held in the image pickup data holding mechanism 21 by the parameter.
Patent JP-S6277266-A (JP)
Title: Car washer
Inventor: DENDA MAMORU
IPC: B60S3/06
Filed: 1986-09-11
Abstract: PURPOSE:To prevent a car washer from freezing in winter by judging the necessity of antifreezing actions based on a detection signal from a temperature sensor when car washing is completed and, if necessary, performing the draining of pipelines and the dewatering of brushes. CONSTITUTION:When car washing is completed, a temperature sensor built-in on a car washer detects the temperature, and if this temperature is a fixed value or less, antifreezing actions are performed. An antifreezing actions, first, liquid detecting sensors 51-53 detect whether intake ends of liquid pipelines 31-33 are inserted into the liquid in liquid containers 28-30 respectively. If either one is inserted into liquid, a warning is displayed on a display panel. Compressed air from an air tank 43 is guided into water feed pipelines by opening solenoid valves 49, 23-27, and water in pipelines is discharged through nozzles 9-14.
Patent JP-S6275417-A (JP)
Title: Gate element for optical switch
Inventor: TERUI HIROSHI
IPC: H01L31/0264
Filed: 1985-09-30
Abstract: PURPOSE:To attain the integration and size reduction of a gate element by successively laminating the 1st clad layer and the 2nd clad layer having forbidden band width equal to that of the 1st clad layer so that respective gratings are matched with each other to constitute a wave guide structure consisting of a stripe-like double heterojunction part. CONSTITUTION:The 1st and 2nd optical waveguide layers 7, 7' transparent to operating wavelength, having an intermediate refractive index between the refractive indexes of the 1st and 2nd clad layers 1, 1' and an active layer 2 to be a core layer and matching their gratings with that of the materials of the clad layers 1, 1' are arranged between the clad layers 1, 1' and the core layer 2 adjacently to the clad layers 1, 1'. The 1st and 2nd carrier confining layers 8, 8' of which forbidden band width is larger than that of the optical waveguide layers 7, 7' are inserted between the layers 7, 7' as core layers adjacently to the layers 7, 7' so as to sandwich the active layer 2 to be the core layer. Consequently, the united integration and size reduction can be easily attained.
Patent JP-H0555178-A (JP)
Title: Patterning method using multilayer resist
Inventor: SATO TAKAMASA
IPC: H01L21/3065
Filed: 1991-08-27
Abstract: PURPOSE:To prevent generation of corrosion by switching process gas from (oxygen + chlorine gas) or bromine series gas to gas containing any of SF6, NF3, and nitrogen immediately before or after resist of a lower layer is patterned with resist of an upper layer as a mask. CONSTITUTION:With an intermediate layer resist 1 as a mask a lower layer resist 2 is etched. This etching is conducted by a plasma of (oxygen + chlorine series gas) or bromine-based gas. After etching, the remaining chlorine or bromine adhering to the surface of the resist 2 is removed by exposing the substrate to plasma of gas containing any of SF6, NF3, CF4, nitrogen, oxygen, hydrogen and water. In the next step, the same or coupling chamber is used, an aluminum alloy film 3 is etched with the resist 2 as a mask by a (CL2 + SiCl4) plasma without exposing it to the atmosphere. Thus, generation of corrosion is prevented, and corrosion due to moisture in the atmosphere does not occur.