baber/WOPTO huggingface dataset:
Patent TW-451384-B (TW)
Title: Manufacturing method of semiconductor and device for manufacturing semiconductor
Inventor: OSAKA AKIHIRO
IPC: B23Q3/18
Filed: 2000-04-07
Granted: 2001-08-21
Abstract: The object of the present invention is to prevent particles from being deposited on the backside of a wafer when executing a notch alignment of the wafer and eliminate nonconformity occurring when a plurality of wafers are aligned at the same time. To achieve the object, three supporting poles 105 are erected on a turntable 103. The outer peripheral part 104b of a wafer 104 is supported by a tapered part of a supporting pin 107 projected on the supporting pole 105. The turntable 103 is driven by a motor 106, and all wafers 104 are rotated at the same time. While the wafers 104 turn, notches 104 thereof are detected by an optical sensor 116 provided on a sensor pole 117, and the detected angular positions are stored. According to the angular position data, the wafers 104 are turned, and they are subject to the notch alignment upwardly one by one from the lowermost side. The finished wafers 104 are picked up in sequence by the picking-up supporting pin 111 of a pole 110 and they are retracted from the supporting pole 105. When the alignment is thoroughly completed, the retracted wafers 104 are restored to the supporting pin 107.
Patent TW-456065-B (TW)
Title: Humidification device for polymeric membrane fuel cells
Inventor: MAZZUCCHELLI GABRIELE
IPC: H01M8/04
Filed: 2000-05-12
Granted: 2001-09-21
Abstract: A humidification device for polymeric membrane fuel cell stacks fed with gaseous reactants is disclosed. The gases supplied to the stack are previously fed in admixture with a stream of liquid water to a chamber filled with a reticulated material, whose highly subdivided geometry provides an extended exchange surface favouring the saturation of gas. The device is more efficient and compact than those known in the art.
Patent TW-I235252-B (TW)
Title: Front light and electronic device
Inventor: KIMURA HAJIME
IPC: F21V8/00
Filed: 2000-07-21
Granted: 2005-07-01
Abstract: A front light includes: a light source 102, a light guide plate 101, and a plurality of prism-shaped lenses 106 each being in contact with a lower surface of the light guide plate 101. A cross-section of each of the prism-shaped lenses, in a plane perpendicular to the side surfaces thereof, has a shape of equally-sided trapezoid. An obtuse angle phiout of the equally-sided trapezoidal cross-section and a critical angle thetac for the total reflection of the prism-shaped lenses satisfy the relationship of 90 DEG < phiout <= 90 DEG + thetac. When the light emitted from the light source 102 enters the prism-shaped lens 106, the light is allowed to be reflected at a side surface defined by side-edges of the trapezoidal cross-section and thereafter exit through a lower surface 106b. Thus, the light can illuminate pixel electrodes in a liquid crystal panel from a direction normal thereto. Thus, light utilization efficiency of the front light can be improved.
Patent TW-488032-B (TW)
Title: Integrated bipolar junction transistor for mixed signal circuit
Inventor: SRIDHAR SEETHARAMAN
IPC: H01L29/732
Filed: 2000-08-11
Granted: 2002-05-21
Abstract: A method for forming integrated circuit bipolar junction transistor for mixed signal circuits. The implants used to form the well regions of the CMOS circuits 20, 40 form the collector regions of bipolar junction transistors. The CMOS transistor pocket implants form the base region of the bipolar junction transistor, and the CMOS drain extension implants form the emitter region of the bipolar junction transistor.
Patent TW-561401-B (TW)
Title: Method for automatically recognizing peripheral component interconnect card
Inventor: LIN CHI-TZUNG
IPC: G06F11/28
Filed: 2000-08-16
Granted: 2003-11-11
Abstract: The present invention is a method for automatically recognizing peripheral component interconnect (PCI) card, which is used to increase the function of recognizing board ID on each industrial PCI card, so that the computer system can read the ID of a plurality of PCI cards to easily recognize the base address for these PCI cards, and then the user can immediately separate the relative positions for these PCI cards in the computer system.
Patent TW-475108-B (TW)
Title: Integrated circuit device, its testing method, database for its design, and its designing method
Inventor: OTA MITSUHO
IPC: G06F17/50
Filed: 2000-08-22
Granted: 2002-02-01
Abstract: The object of the present invention is to provide a structure, testing method, designing method and database for designing to suppress the peak power consumption at the time of testing an integrated circuit device. A combinational circuit 10 is divided into three groups X, Y, and Z. The output of a Q terminal is fixed with timing displaced for every flip-flop circuit corresponding to each of the groups X, Y, and Z which have been divided into groups. After shift-mode operations are performed with the Q terminals of the flip-flop circuits fixed, and when the shift-mode operations are completed, hold releases and capture operations are performed for every flip-flop circuit corresponding to each of the groups X, Y, and Z divided into groups. The hold releases are performed at the time of the H level of one clock, and the capture operations are performed or the capture operations to capture a data signal D in the order of the groups X, Y, and Z after the hold releases are performed in the order of the groups X, Y, and Z at the time of the L level of the clock.
Patent TW-466713-B (TW)
Title: Lead frame and resin package and photoelectron device using the same
Inventor: NAKANISHI HIDEYUKI
IPC: H01L23/495
Filed: 2000-09-05
Granted: 2001-12-01
Abstract: A lead frame includes a die pad including a die pad main portion 203 having a large thickness and a die pad peripheral portion 201 having an intermediate thickness smaller than A lead frame is possessed of a die pad 200, equipped with a thick-walled die pad body 203 and a middle thick-walled die pad peripheral part 201 provided around the die pad body 203, at least a support lead 110 connected to the die pad, and at least two thin-walled first inner leads 101 allocated at the opposing front end portion at the peripheral of the die pad. The lead frame is enhanced in heat-dissipating characteristics by the thick-walled die pad, and the leads can be provided at a fine pitch by reducing them in thickness. The lead frame can be manufactured easily by a punching process in such a manner that a material is rolled in the direction of an arrow 150 into belt-line regions different from each other in thickness.
Patent TW-472215-B (TW)
Title: Image processing apparatus, recording medium, and program
Inventor: SEKI TAKUYA
IPC: G06T15/50
Filed: 2000-09-15
Granted: 2002-01-11
Abstract: A light sphere and a flare appearing therearound are easily and realistically displayed on a display screen. A plurality of disks (230A, 230B, 230C), each comprising a substantially circular central portion which is brighter and a substantially ring-shaped portion disposed around the substantially circular central portion and having a brightness lower than the substantially circular central portion, are placed at different angles in a three-dimensional space, and rotated at different speeds about the centers thereof at an origin (O).
Patent TW-498397-B (TW)
Title: Long-stroke precision piezoelectric actuator
Inventor: DAI HUNG-MING
IPC: H01L21/00
Filed: 2000-10-19
Granted: 2002-08-11
Abstract: The present invention provides a novel piezoelectric driving device and its driving control method to achieve the objects of long-distance motion and high positioning resolution. The piezoelectric driving device includes a piezoelectric driver for generating a forward pushing force, a piezoelectric driving micro flexible clutch unit for generating the effect of clutch. The driving device has functions of programmable shift resolution, programmable operating speed and being driven by a single driving command. By applying the device, the driven object can perform a stepping linear or circumferential long-distance motion. When the driven object approaches the object, the piezoelectric driver performs a smooth fine tuning operation, thereby achieving a feature of high positioning precision.
Patent TW-I233430-B (TW)
Title: Method for manufacturing glass base material, glass base material, and optical fiber
Inventor: ABE JUN
IPC: G02B6/028
Filed: 2000-12-19
Granted: 2005-06-01
Abstract: A method for manufacturing a glass base material, which is a base material of an optical fiber, comprising: forming a core of the glass base material; forming the core includes: accumulating glass particles on a starting rod to form a porous glass soot; sintering the porous glass soot in an atmosphere of fluorine gas to form a GI type refractive index profile, the refractive index of which gradually decreases with a distance from a center of core; and forming a clad of the glass base material around the core.
Patent TW-521018-B (TW)
Title: Power supply for electrodischarge wire machining and electrodischarge wire machining method
Inventor: NAKASHIMA TOSHIO
IPC: C01F11/18
Filed: 2001-01-31
Granted: 2003-02-21
Abstract: This invention relates to a power supply for electrodischarge wire machining in which high-frequency AC voltage is applied between a wire electrode (1a) and a workpiece (2), comprising a high-frequency AC oscillator and amplifier circuit (4) and a pulse source (5) which is a high-frequency AC voltage intermittently supplying device applying and pausing high-frequency AC voltage between a wire electrodes. In the electrodischarge wire machining using this power supply, the vibration of the wire electrode (1a) due to electrostatic force between the wire electrode (1a) and the workpiece (2) is suppressed, thus improving the straightness of the machined surface of the workpiece (2) and reducing surface roughness.
Patent TW-480563-B (TW)
Title: Method to form active layer without lattice defect on wafer surface
Inventor: CHEN SHENG-SHIUNG
IPC: H01L21/00
Filed: 2001-02-06
Granted: 2002-03-21
Abstract: This invention provides a method to form active layer without lattice defect on wafer surface, which can be used in the manufacture of CZ silicon wafer. Molten polycrystalline silicon is place into a crucible and halogen-containing compounds are added into the molten polycrystalline silicon, in which the halogen element in the halogen-containing compounds is chlorine, bromine or iodine. The drawing process is subsequently carried out to pull a crystal cylinder from the molten polycrystalline silicon. A plurality of wafers are obtained by sawing the drawn crystalline cylinder. The active layer without lattice defect on silicon wafer is acquired by performing plasma annealing process under inert gas atmosphere and planarizing wafer surface through chemical mechanical polishing.
Patent TW-515856-B (TW)
Title: Monofilament yarn and process for producing thereof
Inventor: YUUKI YASUNORI
IPC: D01F6/62
Filed: 2001-03-30
Granted: 2003-01-01
Abstract: This invention provides a polytrimethyleneterephthalate monofilament yarn which has properties of softness, good recovery from bending or durability for long periods of use. The monofilament yarn of this invention is characterized in that it comprises a polytrimethyleneterephthalate of 90 mol% or more of trimethyleneterephthalate repeating unit and 10 mol% or less of the other ester repeating unit, and has 50 dtex or more of yarn size, and properties of 0.8-1.3 dl/g of intrinsic viscosity and 2% or less of boiling water shrinkage.
Patent TW-583093-B (TW)
Title: Three-dimensional highly elastic film/non-woven composite, and method for forming same
Inventor: MIDDLESWORTH JEFFREY A
IPC: B32B7/04
Filed: 2001-04-09
Granted: 2004-04-11
Abstract: A three-dimensional highly elastic film/non-woven composite having a fluid and air impervious core layer and a first and second consolidated layer. The consolidated layers have unidirectional and non-unidirectional fibers. The composite is formed by laminating the air and fluid impermeable elastic core layer between the two layers of consolidated non-wovens. The resulting composite stretches only in the cross-machine direction due to the unidirectional properties of the consolidated non-woven material. The layers are then point bonded or welded together. Preferably the layers are welded by passing the composite between an ultrasonic horn and an ultrasonic bond roll having raised areas for effecting the weld points. A thin inelastic membrane is formed at each of the weld points. The welded composite may then be pre-stretched to rupture the membranes, thereby creating apertures, which makes the composite permeable.
Patent TW-571315-B (TW)
Title: Circuit-arrangement
Inventor: SCHAEFER ANDRE
IPC: G11C5/06
Filed: 2001-05-31
Granted: 2004-01-11
Abstract: In a circuit-arrangement, especially a DRAM-element with a protection-device (4) to suppress the formation and/or output of a reflection-signal (R) related to a. received corresponding input-signal (l), an active signal-adaptive-device (5) is provided, through which the formation of a reflection-signal can be prevented by the use of the input-signal.
Patent TW-508666-B (TW)
Title: Method of preventing nitrogen molecule contamination in silicon ion implantation process
Inventor: CHEN LU-CHANG
IPC: H01L21/265
Filed: 2001-05-02
Granted: 2002-11-01
Abstract: This invention provides a method to prevent nitrogen molecule contamination in silicon ion implantation process, which is suitable for ion implantation apparatus using a gas cylinder to control the dopant gas entering the ion implantation apparatus. The method includes the following steps: providing a semiconductor wafer and placing the wafer in the ion implantation apparatus; using inert gas as a driving gas source for the gas cylinder; using the gas cylinder control the dopant gas entering the ion implantation apparatus; and performing an ion implantation process on the wafer.
Patent TW-505859-B (TW)
Title: System to process multiple electronic messages
Inventor: WEN SAYLING
IPC: G06F13/00
Filed: 2001-05-10
Granted: 2002-10-11
Abstract: The present invention discloses a system to process multiple real-time electronic messages on electronic devices, which at least comprises: a storage module to store the real-time electronic messages, which at least comprises a client index database and an information index database; a communication module to communicate with at least a remote electronic device for receiving and transmitting the real-time electronic messages; an information management module to communicate with the input device for receiving a command; a receiving/transmitting module to communicate with the storage module, communication module and message management module for outputting a real-time electronic message according to the command and real-time electronic messages, such concentrated management of electronic messages can avoid the opening of too many real-time electronic message blocks.
Patent TW-526445-B (TW)
Title: Input device applying static capacity detection method
Inventor: SHIGETAKA HIROSHI
IPC: G06F3/033
Filed: 2001-05-30
Granted: 2003-04-01
Abstract: The present invention provides a coordinate input device that can avoid any error detection when a palm touches the device and any deviation on cursor display if fingers stop moving when static capacity variation eases off. For a static capacity type input unit, the maximum detecting value (B) and the detecting values (A, C) detected at the points right before and right after the point of the maximum detecting value (B) are applied for computing 2B-A-C. If the result is less than the first threshold, generation of the coordinate data will be deleted. If the result is between the first and the second thresholds, the smaller corrected value on the coordinate data generation end will be selected to prevent any coordinate data deviation from occurring when fingers stop moving.
Patent TW-480644-B (TW)
Title: Method to increase the yield rate of testing the bonding pad
Inventor: CHEN YAN-MING
IPC: H01L21/66
Filed: 2001-06-06
Granted: 2002-03-21
Abstract: The present invention discloses a method to increase the yield rate of testing the bonding pad, which comprises providing a substrate with a photodiode formed thereon, the substrate having plural metal bonding pads for input/output on the substrate; then forming the passivation layer on said metal bonding pad and substrate and exposing part of the metal bonding pad; forming a metal layer on the metal bonding pad in the way of electroplating without mask; forming a color filter on the planarized layer; forming a spacer on the color filter and forming a micro-lens array on the spacer individually corresponding to the photodiode.
Patent TW-521008-B (TW)
Title: Method for treating wastes using multistage thermal operation combined with addition of additives
Inventor: CHANG CHING-YUAN
IPC: B09B3/00
Filed: 2001-06-11
Granted: 2003-02-21
Abstract: A method for treating wastes to obtain valueable products (such as high-class oils, raw chemicals and hydrocarbon gases) is disclosed. By using a multistage thermal operation combined with the addition of additive to treat industrial wastes, the wastes can be decomposed and thus producing low-molecular gases, oils and residues. In order to reveal this method, it is demonstrated by applying the method to treat the oil sludge as industrial waste. The oil sludge is one of the major industrial wastes from petroleum refinery plants and petrochemical industries, requiring treatment. This method is a new process with three stage operation. The first stage operation is pyrolysis at low temperatures. The second stage operation is thermal decomposition at moderate temperatures with either inert gas or gas with low oxygen concentration. The third stage operation is oxidative decomposition at moderate to high temperatures with moderate to high oxygen concentrations (≤ that of air). Additive (such as CaO and fly ash) is added to the system combined with the multistage thermal operation. Using this new method, one can not only obtain high-class hydrocarbon gases, oil products, raw chemicals and residues, but also significantly reduce the volume and mass of wastes. Therefore, this method can solve the problems of sole pyrolysis with significant amount of residues and of incineration with low resources utilization. Meanwhile, from the environmental and economic points of view, this method can achieve the resources utilization and reduce the loading of the disposal of wastes.
Patent TW-498039-B (TW)
Title: Foldable crank for bicycle
Inventor: JU YU-SHIUE
IPC: B62M3/00
Filed: 2001-07-10
Granted: 2002-08-11
Abstract: This invention is related to a foldable crank for a bicycle, comprising: a crank, a coupling arm, a pivoting button, and pedals. The crank is equipped with a crank fitting. The crank fitting includes a connecting slot and the first and the second pivoting holes. The coupling arm is pivoted into the connecting slot of the crank and includes a pivoting head at a pivoting end connecting to the connecting slot. The pivoting head is provided with the first the second, and the third connecting holes. The pivoting button includes a button body, at least the first and the second pivoting rods. An end of each of the first and second pivoting rods is connected to the button body, wherein the first pivoting rod includes a hollow compartment and an urging end. Inside the compartment, it is provided with a pivot rod. The end of the pivot rod corresponding to the opposite end of the button body protrudes out of the first pivoting rod to be connected to a retainer. Between the pivot rod and the first pivoting rod is engaged with a spring. The pedals are connected to the coupling arm. As such, the pedals may be folded in a very efficient space so as to provide a minimum folding volume.
Patent TW-508742-B (TW)
Title: Method of improving reliability of a dual damascene interconnection
Inventor: LIU JENG-MEI
IPC: H01L21/768
Filed: 2001-07-20
Granted: 2002-11-01
Abstract: A method for improving reliability of a dual damascene interconnection is provided. A damascene opening and a plurality of dummy via holes adjacent to the damascene opening are formed simultaneously within a dielectric layer. The damascene opening connects to an underlying conductor or wire line. A barrier layer is formed in the damascene opening and the dummy via holes. A metal layer is formed on the barrier layer to fill both the damascene opening and the dummy via holes. The dielectric layer has a first coefficient of thermal expansion (CTE) greater than a second CTE of the barrier layer. The metal layer has a third CTE greater than the second CTE.
Patent TW-526663-B (TW)
Title: Moving image decoding device and moving image decoding method
Inventor: OKADA SHIGEYUKI
IPC: H04N19/156
Filed: 2001-08-30
Granted: 2003-04-01
Abstract: The purpose of the present invention is to provide a moving picture decoding apparatus capable of performing high quality picture display in plural channels while suppressing increase in the circuit scale of a decoder and in the use amount of a memory. It comprises: a header information capture section 114 for extracting information such as the numbers of dots in horizontal and vertical directions of the picture respectively, the frame rate and so on from a sequence header included in an MPEG video stream; a total processing amount estimation/reproduction scheme determination section 116 for receiving a channel priority determined for each display mode and an output of header information capture section 114 to estimate a total processing amount and determine a reproduction scheme for each channel; a MPEG decoder 118 for receiving code inputs of channels 1 to 4 in a time-dividing manner through header information capture section 114 to perform decoding of picture codes of each channel according to the determination signal outputted from the total processing amount estimation/reproduction scheme determination section 116.
Patent TW-507497-B (TW)
Title: Solder masking method of printed circuit board
Inventor: MA CHUNG-REN
IPC: H05K3/00
Filed: 2001-09-07
Granted: 2002-10-21
Abstract: The present invention relates to a solder masking method of printed circuit board. A layer of semi-solid solder masking material having the same expansion coefficient as the substrate of the circuit board is added on one or two sides of a circuit board having printed circuit and a metal foil is placed to cover the resin material. Then, a preset pressure is applied on the metal foil and baking is carried out for a preset time under a preset temperature to solidify the semi-solid soldering resistance material. After removing the metal foil above the copper or the gold surface to be exposed on the circuit board by means of chemical solvent etching, the solid soldering resistance material above the copper surface to be exposed on the circuit board is removed by means of plasma etching. The required copper surface is exposed. Finally, a chemical solvent is applied to remove the remaining metal foil and dried film covering the soldering resistance material before completing the soldering resistance operation of the printed circuit board.
Patent TW-524946-B (TW)
Title: Pipe joint
Inventor: SUNDHOLM GORAN
IPC: F16L19/08
Filed: 2001-10-26
Granted: 2003-03-21
Abstract: The invention relates to a pipe joint for joining a tubular component (1) to a receiving piece (2), the pipe joint comprising a fitting body (3) having a recess (8), a tightening nut (6a) having a first thread (7a), the fitting body having a corresponding thread (4), and a cutting ring (9) being arranged to be pressed between a wedge-like wall portion (10) of the recess, and the tubular component when the tightening nut is tightened. In order that the pipe joint could be tightened to form a leak-proof and strong joint using low torque, which enables the use of small tools applicable in confined spaces, the pipe joint comprises a supplementary nut (6b) having a thread (7c) whose handedness corresponds to that of the first thread (7a) but is smaller, the tightening nut comprising a second thread (7b) corresponding to that of the supplementary nut.