baber/WOPTO huggingface dataset:
Patent JP-2008082401-A (JP)
Title: Pulley device
Inventor: WATANABE HAJIME
IPC: F16H55/36
Filed: 2006-09-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a pulley device in which load fluctuations can be dynamically and inexpensively checked.  <P>SOLUTION: This pulley device is equipped with a pulley main body 2 having a belt wound around its outer peripheral face, and a rolling bearing 3 mounted on the inner periphery of the pulley main body 2. A reflection surface 2e is provided on an end face of the pulley main body 2, on which a deformed state can be viewed by a reflected light.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008084998-A (JP)
Title: Plate member and method of manufacturing circuit apparatus using it
Inventor: TAKAHASHI YUKITSUGU
IPC: H05K3/00
Filed: 2006-09-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a plate member capable of improving productivity in manufacturing a circuit apparatus, and to provide a method of manufacturing the circuit apparatus using the plate member.  <P>SOLUTION: The plate member 60 is formed by laminating a plurality of wiring layers via insulating layers, and has a strip-shape wherein a plurality of blocks 66 are separated from each other with intervals. Further, the blocks 66 are connected to each other by a support to form one plate-shape. This support comprises a first support 64 for supporting the plurality of blocks 66 from the outside like a frame, and a second support 65 located between counterpart blocks 66 respectively to connect the counterpart blocks together. Further, each electrically conductive film 68 included in the first support 64 and the second support 65 is removed in the periphery of the extension line 67 formed by extending the borderline between counterpart units 61 in the block 66.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008085050-A (JP)
Title: Manufacturing method of semiconductor device
Inventor: MIYASHITA ISAO
IPC: H01L29/739
Filed: 2006-09-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a technique for realizing an IGBT of high breakdown voltage which is excellent in switching property.  <P>SOLUTION: Activation annealing of n-type impurity ion which is subjected to ion implantation for forming a field stop layer (n<SP>+</SP>type semiconductor region) and activation annealing of p-type impurity ion which is subjected to ion implantation for forming a collector region (p<SP>+</SP>type semiconductor region) are carried out in separate processes. Activation ratio of n-type impurity ion of the field stop layer is made 60% or more, and activation ratio of p-type impurity ion of the collector region is made 1 to 15%, thus forming an IGBT of high breakdown voltage and rapid switching property. Furthermore, since a lamination film consisting of a nickel silicide film, a titanium film, a nickel film and a gold film is used for the collector electrode, ohmic junction with the collector region is possible and corrosion due to moisture or the like of the collector electrode is prevented.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008092055-A (JP)
Title: Printer, printing method, and printing program
Inventor: MATSUDAIRA MASATOSHI
IPC: H04N1/60
Filed: 2006-09-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a printer capable of efficiently executing a correction processing and a color conversion processing.  <P>SOLUTION: The printer comprises: a determining means (core module 80) for determining whether or not the correction processing is performed; a calculating means (correction parameter calculating part 20i) for calculating a correction parameter in the case of performing the correction processing; a first correcting means (image correction module 82) for performing the correction processing on the basis of the correction parameter; the determining means (core module 80) for determining whether corresponding color conversion information exists when the correction processing is not performed; a first color converting means (color conversion module 84) for performing color conversion processing when the color conversion information exists; a second correcting means (image correction module 82) for performing correction processing on the basis of a fixed correction parameter when the color conversion information does not exist; a second color converting means (color conversion module 84) for performing color conversion of the corrected image data; and a printing means (print mechanism 50) for printing the color-converted image data.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008089252-A (JP)
Title: Cooling apparatus
Inventor: OKAI MIYUKI
IPC: F25B1/00
Filed: 2006-10-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide a small and lightweight cooling apparatus with a low exhaust heat temperature, high cooling efficiency, and low electric power consumption.  <P>SOLUTION: It is characterized by that a gas coolant partial solidifying means 9 is provided in a middle of a piping connecting a compressor 1 and a condenser 2, one pat of gas coolant coming out from the compressor 1 is liquefied by the gas coolant partial liquefying means 9, and gas coolant including liquid coolant is introduced into the condenser 2.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008090666-A (JP)
Title: Document management system, document management device, and document management program
Inventor: SUZUKI NORIAKI
IPC: G06F17/21
Filed: 2006-10-03
Abstract: <P>PROBLEM TO BE SOLVED: To manage a provisional document of which handling is permitted to only specific persons involved by registering it in a regular storage place where it is registered as a formal document, and prohibiting its disclosure to and handling by persons other than the specific persons involved until it is regularized.  <P>SOLUTION: A document management server 200 detects the registration operation of the provisional document 42 from a client terminal 100, registers the document ID of the provisional document 42 to be registered, and identification information of a user who is able to perform document processing to the provisional document 42, to provisional document management information 5, and registers the regularization condition on which the provisional document 42 can be changed to a regular document 41 to a provisional document regularization condition 6 together with the document ID of the provisional document 42. The document mangement server checks the provisional document 42 that meets the regularization condition registered in the provisional document regularization condition 6 immediately after the document processing has been performed on each occasion, and deletes the registration data of the provisional document 42 that can be regularized, from the provisional document management information 5 and the provisional document regularization condition 6.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008086677-A (JP)
Title: Support frame
Inventor: KIMURA SATOSHI
IPC: A63F7/02
Filed: 2006-10-05
Abstract: <P>PROBLEM TO BE SOLVED: To enable a support frame to be easily operated such as installation and uninstallation and adjusted the installation height according to the kind of game machine and to secure a large space at the feet of a player.  <P>SOLUTION: A support frame 1 is provided with: support legs 10 installed on an installation surface F through an anchor bolt (a); a support table 20 for supporting a game machine by being gotten across to the support legs 10; and studs 30 arranged on the left and right of the game machine. The support table 20 is provided with: an upper surface part 22 for supporting the studs 30 and the game machine; a side surface part 23; and a lower surface part 21 supported by the support legs 10. The side surface part 23 has inclined surfaces 23a and 23b inclined to extend from the lower surface part 21 to the upper surface part 22, and the lower surface part 21 is detachably attached on the support legs 10 and the studs 30 are detachably attached on the upper surface part 22.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008097173-A (JP)
Title: Data processor
Inventor: KONDO TAKEKI
IPC: G06F9/46
Filed: 2006-10-10
Abstract: <P>PROBLEM TO BE SOLVED: To contribute to prevention of malfunction due to resource competition, and security improvement by reducing redesign accompanying the change of system specifications.  <P>SOLUTION: This data processor is provided with a central processing unit(CPU) in which a plurality of virtual machines (101) for executing a user program under the control of different operating systems and a virtual machine manager (190) for controlling the virtual machines are selectively configured according to information set in mode registers (140, 150, 151) and a resource access management module (110) for managing access to hardware resources available by the virtual machines. The resource access management module inputs information to be acquired from the set mode register and access control information to the hardware resource by the central arithmetic processor, and controls the validity/invalidity of access to the hardware resource corresponding to the access control information by comparing the input information with the information set in the control register.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008097991-A (JP)
Title: Electric storage device
Inventor: KOMURO MASAKI
IPC: H01M4/02
Filed: 2006-10-12
Abstract: <P>PROBLEM TO BE SOLVED: To improve safety in handling an electric storage device by freely setting timing causing the electric storage device to generate a voltage.  <P>SOLUTION: An electrode stacked unit 14 with positive electrodes 12 and negative electrodes 11 stacked on each other is arranged in an armoring vessel 13. A lithium ion supply source 16 is arranged oppositely to the negative electrode 11 above the electrode stacked unit 14. A separator 20 is arranged between the negative electrode 11 and the lithium ion supply source 16 to keep an insulation state between the negative electrodes 11 and the lithium ion supply source 16. Multiple projecting parts 21 are formed on a negative electrode collector 11a facing the lithium ion supply source 16, and the separator 20 is penetrated by the projecting parts 21 by applying pressure from the outside of the armoring vessel 13. Thereby, the negative electrodes 11 is short-circuited to the lithium ion supply source 16, whereby lithium ions are supported to the negative electrodes 11 at optional timing.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008094052-A (JP)
Title: Multilayer injection molding method of resin, and multilayer injection molding apparatus of resin
Inventor: OKAMOTO AKIO
IPC: B29L9/00
Filed: 2006-10-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a multilayer injection molding method of a resin and a multilayer injection molding apparatus of the resin in which enlarging position controlling of a mold cavity volume is improved and a resin molding of a desired multilayer structure is obtained.  <P>SOLUTION: When a resin molding material of a first layer is injection filled and molded in the mold cavity, a movable platen is moved backward, the mold cavity is enlarged, a secondary cavity is formed between the resin molding material of the first layer and the mold cavity, and the resin molding material of a second layer is injected and filled in the formed secondary cavity; the formation of the secondary cavity is performed by releasing mold clamping force, then driving a mold thickness regulating mechanism, retreating a toggle mechanism until the movable platen is located at a predetermined mold cavity enlarging position in the locking state of the toggle mechanism, then driving the toggle mechanism, and advancing the movable platen up to the locking state of the toggle mechanism.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008102263-A (JP)
Title: Hologram screen and method for manufacturing the same
Inventor: UEDA HIDEAKI
IPC: G03B21/62
Filed: 2006-10-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a hologram screen which has high transparency and is free from chromatic aberration and brightness unevenness in the screen surface, and to provide a method for manufacturing the hologram screen.  <P>SOLUTION: The hologram screen 11 is obtained by irradiating a recording medium 100 with reference light LR in hologram screen recording, that is, non-diffused light, as the light emitted from a zoom lens (combination lens) 90 comprising a plurality of lenses, used in a video projection device.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007079591-A (JP)
Title: Optical scanner
Inventor: ATSUMI HIROMICHI
IPC: B41J2/44
Filed: 2006-10-20
Abstract: <P>PROBLEM TO BE SOLVED: To obtain an optical scanner in which a high correction effect is obtained concerning curvature of the field caused by change in the curvature radius of an optical element or the refractive index by the fluctuation of environmental temperature, and to obtain an optical characteristic correction apparatus.  <P>SOLUTION: The optical scanner is provided with: a light source 1 which radiates a luminous flux; a first optical system 2 which couples the luminous flux from the light source; a second optical system which focuses the luminous flux from the first optical system into a long line in a main scanning corresponding direction; an optical deflector 5 which has a deflecting and reflecting face in the vicinity of the linearly focused point and which deflects the luminous flux on the deflecting and reflecting face; and a third optical system 60 which focuses the luminous flux deflected by the optical deflector as a light spot on a face to be scanned 7. The third optical system 60 of the optical scanner is provided with at least a one-sheet resin-made image forming element and a second optical system is provided with at least a one-sheet resin-made image forming element 10 and at least a one-sheet glass-made image forming element 12. At least the one-sheet resin-made image forming element 10 constituting the second optical system is provided with a light axial direction poisoning reference surface on the side of the light deflector 5.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2008100460-A (JP)
Title: Inkjet recording system and recorder
Inventor: HIROSHIMA SUSUMU
IPC: C09D11/00
Filed: 2006-10-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide an inkjet recording system of high reliability by improving the filling capacity of ink in the inkjet recording system equipped with an inkjet recording head in which a part of a pressurization chamber wall surface consists of a piezoelectric element.  <P>SOLUTION: In the inkjet recording system, a center line average roughness Ra of the piezoelectric element 8 is 0.05 to 2 μm, and a contact angle with ink is not larger than 45 degrees. Moreover, the inkjet recording system satisfies the formula (1). In the formula (1), A expresses the center line average roughness Ra (μm) of the piezoelectric element surface which constitutes the pressurization chamber wall surface, and θ expresses the contact angle of ink to the piezoelectric element.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008076372-A (JP)
Title: Balance for correcting tooth brushing pressure
Inventor: YOKOSUKA TAKEYOSHI
IPC: G01G23/00
Filed: 2006-09-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a balance for correcting tooth brushing pressure used under a condition fixed to an outer facing or a specular face of a wash stand.  <P>SOLUTION: This balance is provided with a suction cup in a main body or a main body support tool, and has structure attached to an outer facing face or the specular face of the wash stand. The main body is inclinedly fixed to be suitable for applying a force to a weight receiving part of the balance from a horizontal direction, when fixed. A weight receiving cover of an individual person is prepared and can be replaced to allow sanitary use, considering that the plurality of persons uses the same balance for correcting the tooth brushing pressure.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007150275-A (JP)
Title: Semiconductor built-in substrate and manufacturing method of the same
Inventor: KONDO HIROSHI
IPC: H05K3/32
Filed: 2006-10-26
Abstract: <P>PROBLEM TO BE SOLVED: To simplify the manufacturing steps of a semiconductor built-in substrate, so as to cope with the narrow pitch of a semiconductor element built in a print wiring board.  <P>SOLUTION: The semiconductor element is disposed in an opening part provided in an insulating resin, which is then sandwiched between a front surface wiring layer and a rear surface wiring layer, and hot-press is applied thereto. Thus a semiconductor built-in substrate, with a semiconductor element 1 built-in, is formed. Bumps of the semiconductor element and the front surface wiring layer are connected by a connecting wiring pattern, and the connecting wiring pattern is patterned by directly exposing a resist film thus formed to a beam light, and is formed by etching. Thus, it is possible to absorb mounting errors of the semiconductor element on a print wiring board and positional errors of an electrode between the respective semiconductor elements that occur with a narrow pitch of the semiconductor element, and surely perform electrical connections with the wiring pattern.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2008107728-A (JP)
Title: Device for prepeeling photosensitive web
Inventor: WATANABE YASUHISA
IPC: G03F7/004
Filed: 2006-10-27
Abstract: <P>PROBLEM TO BE SOLVED: To achieve satisfactory and assured peeling of a support layer from a substrate and to improve the sticking accuracy of a photosensitive material layer, by a simple configuration.  <P>SOLUTION: A prepeeling device 144 is provided comprising a peeling member 150 which presses a remaining part 30b exposed between glass substrates 24 to peel the remaining part 30b from the glass substrates 24, and a movement mechanism 152 which can move the peeling member 150 in the direction of an arrow C. The peeling member 150 is housed in a casing 158 together with receiving rollers 162 and this casing 158 moves in the direction of the arrow C via a uniaxial robot 156 and is disposed corresponding to the remaining part 30b between the glass substrates 24. The peeling member 150 is in the form of a plate which is longer in the width direction of the remaining part 30b and the member is provided with corrugated ends 172a, 172b which come into contact with the remaining part 30b.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008111802-A (JP)
Title: One-way rotating clutch wheel, self-winding mechanism equipped therewith, and self-winding watch
Inventor: TOKORO TAKESHI
IPC: G04B5/12
Filed: 2006-10-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a one-way rotating clutch wheel having no rocking component, and having the number of components suppressed to the minimum, a self-winding mechanism equipped therewith, and a self-winding watch.  <P>SOLUTION: The one-way rotating clutch wheel 30A of the self-winding mechanism 20 of the self-winding watch 1 has a driven wheel part 31A, and a one-way rotating clutch wheel part 32A which is coaxial with the driven wheel part 31A, and the one-way rotating clutch wheel part 32A has a disk-shaped body part 33A fixed to the driven wheel part 31A, and a plurality of plate-spring-shaped projection parts 34A formed integrally at intervals in the circumferential direction on the outer circumferential surface of the disk-shaped body part 33A. Each of the plurality of plate-spring-shaped projection parts 34A is elongated protrusively in one direction in the circumferential direction of a portion from a base end 37A fixed to the portion positioned at the interval in the circumferential direction on the outer circumferential surface of the disk-shaped body part 33A to the tip 39A.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008111317-A (JP)
Title: Pull dowel, joint fitting for building and gate-type frame
Inventor: KUREYA SHIGEO
IPC: E04B1/48
Filed: 2006-10-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a pull dowel capable of improving joining strength relative to external force in a horizontal direction, and also to provide a joint fitting for building equipped with the dowel, and further to provide a gate-type frame using the joint fitting for building.  <P>SOLUTION: The gate-type frame 1 enables each gate-type pillar 3 to be erected on a base 10 through a pillar base fitting 2. A beam 7 is joined to the gate-type pillar 3 through the joint fitting 4 for building having the attracted dowels 6 which joins the gate-type pillar 3 with a beam 7 in such a way as to pull the gate-type pillar 3 and the beam 7 with each other.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008114247-A (JP)
Title: Soldering method in soldering device
Inventor: SAKAGAMI SHIGERU
IPC: H01R43/02
Filed: 2006-11-02
Abstract: <P>PROBLEM TO BE SOLVED: To provide a soldering method in a soldering device capable of attaining the excellent deposition state of a solder and enhancing the quality by promoting the wettability of the solder.  <P>SOLUTION: A core portion 2a of an end of a wire 2 with a covered portion 2b thereof being peeled is inserted in a soldering tank 3 by the predetermined length, and a solder 4 is deposited on the core portion 2a. The soldering method comprises a basic insertion-evacuation step of one reciprocation of inserting/evacuating the core portion 2a in/from the solder tank 3 by the predetermined length, and a solder deposition promoting step of moving the core portion 2a to be inserted in the solder tank 3 by the basic insertion-evacuation step in the molten solder 4 in addition to one reciprocation. The solder 4 is deposited on the core portion 2a by combining the basic insertion-evacuation step and the soldering deposition promoting step.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008116354-A (JP)
Title: Warpage measurement system, film formation system, and warpage measurement method
Inventor: FUJITA TAKESHI
IPC: G01B5/02
Filed: 2006-11-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a warpage measurement system, a warpage measurement method and a film formation system for implementing a stable in-situ measurement.  <P>SOLUTION: The warpage measurement system is provided with: a wafer lifting mechanism vertically moved, supporting an outer circumference of a wafer placed on a film formation holder, and lifting the wafer; a height measurement mechanism for detecting a height of the lifted wafer at a predetermined location; and a control section. The wafer lifting mechanism supports the wafer within a film formation chamber. The control section places the wafer lifting mechanism at the measurement height in a state that the wafer is supported before and after a film formation on the wafer, measures the height of the lifted wafer, and calculates a change in a warpage of the wafer before and after the film formation based on height data of the wafer before and after the film formation.  <P>COPYRIGHT: (C)2008,JPO&INPIT