baber/WOPTO huggingface dataset:
Patent TW-446978-B (TW)
Title: Phosphor film structure, paste for forming phosphor film and plasma display panel using phosphor film
Inventor: UESUGI RYUJI
IPC: H01J11/22
Filed: 1999-11-19
Granted: 2001-07-21
Abstract: The present invention relates to increase the luminance of a phosphor film and to reduce the manufacturing cost by forming the phosphor film with many phosphor grains. The quantity of expensive phosphor powder to be used can be decreased. Voids 16b are formed at the ratio of 40-80% in a phosphor film 16 against 100% when the phosphor film 16 is completely filled with phosphor grains 16a without gaps.
Patent TW-575751-B (TW)
Title: Constitution and fabrication of flat-panel display and porous-faced structure suitable for partial or full use in spacer of flat-panel display
Inventor: BARTON ROGER W
IPC: H01J29/02
Filed: 2000-03-28
Granted: 2004-02-11
Abstract: A structure suitable for partial or full use in a spacer (24) of a flat-panel display has a porous face (54). The structure may be formed with multiple aggregates (100) of coated particles (102) bonded together in an open manner to form pores (58). A coating (88) consisting primarily of carbon and having a highly uniform thickness may extend into pores of a porous body (46). The coating can be created by removing non-carbon material from carbon-containing species provided along the pores. A solid porous film (82) whose thickness is normally no more than 20 mum has a resistivity of 10<8> to 10<14> ohm-cm. A spacer for a flat-panel display contains a support body (80) and an overlying, normally porous, layer (82) whose resistivity is greater parallel to a face of the support body than perpendicular to the body's face.
Patent TW-I252719-B (TW)
Title: Conductive connecting pin and package board
Inventor: HIROSE NAOHIRO
IPC: H05K1/00
Filed: 1999-12-15
Granted: 2006-04-01
Abstract: On the board provided with a conductive layer (5), a pad (16) is formed to fix a conductive connecting pin (100) on a package board (310). The conduction connecting pin (100) serves as an electrical connection to a motherboard. The pad (16) is coated with an organic-resin insulating layer (15) having an opening section (18) from which the pad (16) is partially exposed. The conductive connecting pin (100) is fixed to the pad exposed from the opening section using a conductive adhesive (17), preventing the conductive connecting pin (100) from separating off the board at the time of mounting.
Patent TW-584593-B (TW)
Title: Process for manufacturing a bi-axially oriented, heat-shrinkable, polyolefin multi-layer film and film obtained thereby
Inventor: FORLONI ROBERTO
IPC: B29C55/02
Filed: 1999-12-16
Granted: 2004-04-21
Abstract: A process for manufacturing a bi-axially oriented, heat-shrinkable, polyolefin, multi-layer film comprising a first layer (A) comprising an ethylene-alpha-olefin copolymer and a second layer (B), which is an outer layer, comprising an ethylene or propylene homo- or co-polymer, which process comprises melt extrusion of the film polymers through a flat die and orientation of the obtained cast sheet simultaneously in the longitudinal and the transversal directions by a simultaneous tenter.
Patent TW-524902-B (TW)
Title: Process for making spandex
Inventor: GREENE ROBIN N
IPC: C08G18/82
Filed: 2000-01-15
Granted: 2003-03-21
Abstract: A process for melt spinning spandex, utilizing a po1yurethaneurea polymer prepared from a purified capped glycol, linear aliphatic diamines and a monoamine chain terminator, is provided.
Patent TW-446770-B (TW)
Title: Stitch loop retaining method by using a flat knitting machine
Inventor: TAKEDA KOJI
IPC: D04B1/24
Filed: 2000-02-01
Granted: 2001-07-21
Abstract: A method for knitting without retaining double or more stitches on a needle when a loop transferring is performed in the fabric knitting including a stitch narrowing knitting and the like. The method includes the steps that a stitch loop is rested on the tongue of the compound needle on the first bed; that the stitch loop retained by the knitting member on the second bed is guided to a position where it can be transferred to the compound needle on the first bed; that the hook of the needle proper is advanced into the stitch loop retained on the knitting member on the second bed positioned at the transferring position; that the knitting member on the second bed is retracted to allow the stitch loop retained thereon to be retained by the compound needle on the first bed; and that the compound needle on the first bed is retracted to knock over the stitch loop rested on the tongue of the slider of the compound needle on the first bed, whereby the stitch loop is retained on the stitch loop transferred to the compound needle on the first bed.
Patent TW-452942-B (TW)
Title: Semiconductor device and the manufacturing method thereof
Inventor: HOMMA SOICHI
IPC: H01L21/60
Filed: 2000-02-24
Granted: 2001-09-01
Abstract: The semiconductor device of the present invention comprises: a semiconductor substrate, and a wiring pad formed on the semiconductor substrate, and a burr metal layer formed on the wiring pad, the Ag3Sn intermetallic compound formed on the burr metal layer, and the bulged electrode made of low melting point metal on the Ag3Sn intermetallic compound. Furthermore, the manufacturing method of the present invention for semiconductor device includes the following steps: forming wiring pad on the semiconductor substrate; forming burr metal layer on the wiring pad; forming Ag3Sn intermetallic compound on the burr metal layer; and forming the bulged electrode made of low melting point metal on the Ag3Sn intermetallic compound layer; and, forming Ag3Sn intermetallic compound around the interface between the metal layer containing Ag and the low melting metal layer containing Sn. Therefore, the invention can use the solder without Pb to get the semiconductor device with high reliability.
Patent TW-507233-B (TW)
Title: Circuit breaker handle block
Inventor: CASTONGUAY ROGER NEIL
IPC: H01H73/12
Filed: 2000-03-14
Granted: 2002-10-21
Abstract: A circuit breaker having a crank for coupling a switching mechanism to the contact pole structure is presented. The crank has a pair of cam surfaces which cooperate with a blocking lever to restrict movement of the operating handle when the contacts of the circuit breaker are welded. The blocking lever is arranged such that it does not interfere with the handle under normal operating conditions.
Patent TW-527392-B (TW)
Title: Isobutylene based elastomer blends having improved strength, elasticity and reduced permeability
Inventor: WANG HSIEN-CHANG
IPC: C08L23/08
Filed: 2000-05-19
Granted: 2003-04-11
Abstract: The improved green strength, green elongation, and green relaxation properties of isobutylene based elastomers at elevated temperatures along with improved aging and barrier properties are achieved by blending semi-compatible, semi-crystalline polymers with the isobutylene elastomers. The improved properties are maintained in subsequent rubber compounds containing said blends and are particularly useful in tire and pharmaceutical container applications.
Patent TW-477943-B (TW)
Title: System and method for providing additional functions to the homepage of the homepage provider via a network
Inventor: TSAI FU-CHIAN
IPC: G06Q30/06
Filed: 2000-07-07
Granted: 2002-03-01
Abstract: There are a system and a method for improving the registration service of an ordinary search engine, so as to provide more services, such as purchasing and customization services of the network device, professional technique service provided by the network device manufacture professional, and service for converting the data statistics and analysis to knowledge, to the website establisher. Therefore, the website establisher who provides the homepage content can easily design, with minimum website establishing knowledge, a professional website (homepage) having many network devices and functions by the system of the present invention or the service of manufacture professional. Furthermore, it is able to tightly combine the portal website, website establisher (homepage content provider), manufacture professional, and network browser, thereby providing a better efficiency for the network service.
Patent TW-453002-B (TW)
Title: Semiconductor laser diode having non-absorption window layer and the fabrication method thereof
Inventor: CHIU CHIEN-CHIA
IPC: H01S3/0941
Filed: 2000-09-22
Granted: 2001-09-01
Abstract: The present invention is a semiconductor laser diode having non-absorption window layer and the fabrication method thereof, wherein each of the semiconductor layer with quantum well active layer, and one layer of mask for forming the window layer region are epitaxially grown on a substrate, then diffuse zinc (Zn) into the window layer region to let aluminum (Al) enter the quantum well active layer (MQW), so that the bandgap of the passing region of laser light near the facet of semiconductor laser device is larger than the bandgap of the quantum well in the rest portion to avoid the catastrophic optical damage in the high power operation.
Patent TW-463014-B (TW)
Title: Shaping method of pad piece for locking nail of metallic wave plate
Inventor: LIN HAN-YUAN
IPC: E04D3/38
Filed: 2000-10-13
Granted: 2001-11-11
Abstract: The basic material of this invention of shaping method of pad piece for locking nail of metallic wave plate is rustproof galvanized board of proper thickness and raw rubber. Procedures includes following steps: 1) to overlap the galvanized board over the raw rubber by prior adhesion of glue evenly pasted under the raw material, and then put it on top of the under form; 2) to act sulfur adding heat treatment through upper and under forms to let the raw rubber melt and stick to the galvanized board solidly; 3) to put the sulfur heat-treated galvanized board with raw rubber on the under mold of a punch machine; 4) to direct punch by the top and under molds of the punch machine to shape an inward arc pad piece with piercing hole in the middle. The pad will better the joint effect of the nail lock of the metallic wave plate and improve its leak-proof and rustproof functions. (diagram 4: Shaping method of pad piece for locking nail of metallic wave plate)
Patent TW-522772-B (TW)
Title: Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board
Inventor: NAKAMURA KEI
IPC: H05K3/34
Filed: 2000-12-14
Granted: 2003-03-01
Abstract: A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.
Patent TW-460995-B (TW)
Title: Flip-chip manufacturing process
Inventor: TSENG NOTY
IPC: H01L21/60
Filed: 2000-12-29
Granted: 2001-10-21
Abstract: A flip-chip manufacturing process comprises major steps in sequence as providing wafer, forming bumps, testing wafer, laser mending, and wafer dicing. The present invention is to conduct the testing and mending after forming bumps so as to simplify the manufacturing processes and increasing the yield.
Patent TW-488000-B (TW)
Title: Mounting method for chip
Inventor: YAMAUCHI AKIRA
IPC: H01L23/31
Filed: 2001-02-13
Granted: 2002-05-21
Abstract: The present invention provides a mounting method for chip, which includes the following steps: coating with underfill with specially specified viscosity or triggering temperature on at least on side of the substrate and the chip; during pressing the bump on the electrode, the underfill between the chip and the substrate is extended around the pressed bumps and electrodes; embedded the bumps in the underfill and with heating to melt the bumps and bond the melted bumps with the electrodes; and, during the melting bonding of bumps, before the curing of the underfill, to ensure the wet extension time period for the melted bumps; without the secondary oxidation in the underfill, the melted bumps can be sufficiently wet extended to realize excellent bonding with high reliability between the bumps and the electrodes, and the time period for the underfill to be cured as specific state can be reduced, and further advance the pressure releasing time for the chip. In this way, it can greatly simplify the overall mounting steps, and reduce the working time.
Patent TW-546361-B (TW)
Title: Radiation-curable heat-peelable pressure-sensitive adhesive sheet and process for producing cut pieces with the same
Inventor: KIUCHI KAZUYUKI
IPC: C09J7/38
Filed: 2001-02-15
Granted: 2003-08-11
Abstract: A radiation-curable heat-peelable pressure-sensitive adhesive sheet is disclosed which has tackiness enabling adherends to withstand transportation and other steps, with which cutting can be conducted without flinging up an adhesive waste or causing chipping, and from which the cut pieces can be easily separated and recovered. The radiation-curable heat-peelable pressure-sensitive adhesive sheet comprises a substrate and, formed on at least one side thereof, a pressure-sensitive adhesive layer containing heat-expandable microspheres and a radiation-curable compound. A work to be cut is placed on the surface of the pressure-sensitive adhesive layer of the radiation-curable heat-peelable pressure-sensitive adhesive sheet, and the pressure-sensitive adhesive layer is irradiated with a radiation to cure the adhesive layer. The work is cut into pieces and the pressure-sensitive adhesive layer is then thermally foamed, before the cut pieces are separated and recovered from the adhesive sheet. Thus, cut pieces can be efficiently produced without arousing troubles in processing steps.
Patent TW-499567-B (TW)
Title: An improved device for analyzing samples by multi-capillary electrophoresis with solid/solid temperature regulation
Inventor: ALBERTO,FEI
IPC: G01N27/447
Filed: 2001-02-21
Granted: 2002-08-21
Abstract: A device for analyzing samples by electrophoresis comprises a plurality of capillaries, receiver means comprising a multiplicity of independent units each made of a material that is thermally conductive and electrically insulating, and designed to be closely enclosed over the central portion of a capillary, and temperature regulator means comprising at least one Peltier unit for exchanging heat with the units via a solid/solid exchange so as to regulate the temperature of the capillaries via said units.
Patent TW-578443-B (TW)
Title: Method of and device for operating a gas discharge lamp
Inventor: DERRA GUNTHER HANS
IPC: H05B41/292
Filed: 2001-04-19
Granted: 2004-03-01
Abstract: A method of and a device for operating a gas discharge lamp which is fed with an alternating voltage or an alternating current and wherein the instantaneous power of the lamp is increased at given time intervals are used to form the electrodes. The value of an operational datum of the lamp which varies in time is continuously or discontinuously measured and the frequency of the alternating voltage or the alternating current (operating frequency) is selected in dependence on the measured values.
Patent TW-546866-B (TW)
Title: LGA package socket
Inventor: GOODWIN JONATHAN W
IPC: H01R12/71
Filed: 2001-04-19
Granted: 2003-08-11
Abstract: A socket for an LGA or BGA package is provided which is of relatively simple construction and which provides reliable and efficient interconnection of the package and a printed circuit board. The socket comprises a contact assembly having an array of resilient conductive columns having respective contact ends, the columns being mounted on a thin insulative sheet. The contact assembly is supported on a frame of insulating material and which had alignment post for alignment of the contact assembly to the frame and for alignment of the frame and mounted contact assembly to an associated circuit board. The frame also includes elements for soldering or bonding the socket to a circuit board.
Patent TW-544830-B (TW)
Title: A method of testing an integrated circuit
Inventor: RYAN VIVIAN
IPC: G01R31/02
Filed: 2001-06-20
Granted: 2003-08-01
Abstract: A process to assess the occurrence or the likelihood of a failure in an integrated circuit. The process includes forming a conductive region such as a runner about the periphery of a substrate or die. The conductive regions may be located at one or more different metallization layers within the integrated circuit. The conductive region is coupled to one or more of the bond pads. The die is assessed by measuring the resistance, conductivity, cross talk or other electrical characteristics on the conductive region via the bond pads. The assessment can then be used to predict whether, for example, the runners formed in the integrated circuit have failed or are likely to fail.
Patent TW-511390-B (TW)
Title: Connection method for microphone of mobile radio communication unit and connection structure thereof
Inventor: KIM JONG-DAL
IPC: H04W88/02
Filed: 2001-07-12
Granted: 2002-11-21
Abstract: Disclosed are a connection method for a microphone mounted in a mobile radio communication unit and a connection structure thereof, in which the connection of the microphone to a printed circuit board is made using circular conductive contacts formed at a holder made of a rubber material to protect the microphone, thereby being capable of conveniently achieving the connection between the microphone and the printed circuit board without using wires involving a welding process, as in conventional cases, while reducing the assembling time of the product, achieving an improvement in workability, and preventing an interference with peripheral components and a degradation in the connection resulting in a degradation in the reliability of the product. Alternatively, the connection of the microphone to a printed circuit board is made using a connector coated with a conductive adhesive (or a non-conductive adhesive) at both surfaces thereof. In this case, a movement preventing rim is protruded from the periphery of the microphone at the upper end of the microphone. In this case, it is also possible to minimize an increase in thickness resulting from the connection between the microphone and the printed circuit board, thereby achieving a miniature and lightness of a housing of the mobile radio communication unit.
Patent TW-588079-B (TW)
Title: Composite soundproof material for automobile interior use and method for producing the same
Inventor: LIU CHIN-DER
IPC: C08J9/00
Filed: 2001-07-17
Granted: 2004-05-21
Abstract: The present invention provides a composite soundproof material for automobile interior use and a method for producing the same. The method comprises using a composite soundproof material formed of a foaming-type positive-directional soundproof sponge made of a polyetherpolyol, a diisocyanate and water, and a surface layer material made from an ethylene/EVA, a rubber, or the combination of them with a carpet. The present invention also provides a composite soundproof material for automobile interior use having excellent sound absorption properties, air permeability, resiliency, and light in weight.
Patent TW-502351-B (TW)
Title: Arrangement of flip-chip bump pads
Inventor: JANG WEN-YUAN
IPC: H01L21/60
Filed: 2001-08-08
Granted: 2002-09-11
Abstract: There is provided an arrangement of flip-chip bump pads, which comprises a substrate having a plurality of flip-chip bump pads corresponding to the conductive bumps of the flip-chip. In addition to an array of flip-chip bump pads, the arrangement of flip-chip bump pads comprises two rings of flip-chip bump pads on the outer periphery of the array of flip-chip bump pads. Furthermore, in addition to being arranged in a mutually interlaced manner, the two rings of flip-chip bump pads are also arranged in an interlaced manner in position with respect to the array of flip-chip bump pads, so as make the conductive trace connect with the two rings of flip-chip bump pads simply in a straight line manner. The outer ring of the flip-chip bump pads is used to connect with high frequency signals and clock signals.
Patent TW-I289271-B (TW)
Title: Cargo delivery supporting method for an imaginary shopping mall
Inventor: KUMAKAWA TAKAYASU
IPC: G06Q30/06
Filed: 2001-08-30
Granted: 2007-11-01
Abstract: This invention provides a cargo delivery supporting method for an imaginary virtual shopping mall. In the delivery supporting system of present invention, a supporting server is composed of a communication processing section, a controlling section, a first memory section, a second memory section, a display and a keyboard, and an address information is memorized as a database in the first memory section of the delivery supporting server, and the bellowing datas are memorized in the second memory section of the delivery supporting server: (I) a controlling data which memorizes the order information received by an order accepting server into the first memory section of the delivery supporting server as an order information of a delivery with no indication list composed of the file items of a determination code, an error code, a delivery unit, an order number, an order information and a determination information, (II) a controlling data which transmits the delivery with no indication list to the terminal of a branch store after receiving request of the delivery with no indication list from the terminal of the branch store, checking the address information included in the order information of the delivery with no indication list and the address information memorized in the first memory of the delivery supporting server, and judging whether the address information of the order information is correct or not, (i) when the address information of the order information is judged as correct, the delivery with no indication list is transmitted to the terminal of the branch store, (ii) when the address information of the order information is judged as incorrect, an error information is added to the delivery with no indication list, and (III) a controlling data which transmits the delivery with no indication list to the terminal of a branch store after receiving the correcting request of address information of the order information from the terminal of the branch store, correcting the address information memorized in the first memory section into the requested address information and checking the corrected address information and the address information memorized in the first memory of the delivery supporting server, and judging whether the address information of the order information is correct or not, (i) when the address information of the order information is judged as correct, the delivery with no indication list is transmitted to the terminal of the branch store, (ii) when the address information of the order information is judged as incorrect, an error information is added to the delivery with no indication list.
Patent TW-I224618-B (TW)
Title: Liquid crystal mixture
Inventor: HIRSCHMANN HARALD
IPC: C09K19/02
Filed: 2001-09-19
Granted: 2004-12-01
Abstract: Liquid crystal mixture comprising at least one compound of the formula I, in which R3 is an alkenyl group having 2 to 7 carbon atoms, and R4 is an alkyl alkoxy or alkenyl group having 1 to 12 carbon atoms, in which, in addition, 1 or 2 non-adjacent CH2 groups may be replaced by -O-, -CH=CH-, -CO-, -OCO- or -COO- in such a way that O atoms are not linked directly to one another characterized in that it further comprises at least one compound of the formula IV9 and/or IV24, in which R1 is alkenyl having 2 to 7 carbon atoms and R2 is alkyl or alkoxy having 1 to 6 carbon atoms. wherein the mixture comprises 3-40% of compounds of formula I and 2-30% of compounds of formula IV9 and/or IV24.