baber/WOPTO huggingface dataset:
Patent TW-512069-B (TW)
Title: Golf club head and method for producing the same
Inventor: REYES HERBERT
IPC: A63B53/02
Filed: 2000-12-28
Granted: 2002-12-01
Abstract: A golf club head (20) composed of a composite material and having a metal weight strip (40) in a ribbon section (30) is disclosed herein. The metal strip (40) may be composed of copper, tungsten or a similar metal. The composite golf club head (20) may also have a sole plate (42) composed of stainless steel attached to a sole (28) of the golf club head (20). The golf club head (20) is preferably composed of plies of pre-peg sheets (41). A method for fabricating the golf club head (20) is also disclosed herein. The method uses a three-piece mold (60) and bladder (90) to produce a composite golf club head (20) with a metal weight strip (40) embedded in the ribbon (30).
Patent TW-I255850-B (TW)
Title: Slurry for chemical mechanical polishing
Inventor: TSUCHIYA YASUAKI
IPC: C09G1/02
Filed: 2000-12-28
Granted: 2006-06-01
Abstract: In chemical mechanical polishing of a substrate comprising a tantalum-containing metal film, a slurry for chemical mechanical polishing comprising a silica polishing grain and an inorganic salt in an amount of 0.01 wt% to 10 wt% both inclusive may be used to prevent dishing and erosion, as well as to achieve an improved polishing rate for tantalum without any damage to tantalum.
Patent TW-498469-B (TW)
Title: BGA semiconductor device capable of preventing passive component from short circuit and its manufacture method
Inventor: HE TZUNG-DA
IPC: H01L21/60
Filed: 2000-12-30
Granted: 2002-08-11
Abstract: This invention provides a BGA semiconductor device and its manufacture method, which can prevent passive component from short circuit. It includes: a substrate having a chip paste area on the surface, which has a soldering pad area with a plural number of conductive traces at the outside of the chip paste area, and connecting a plural number of passive components onto a component area located between the chip paste area and the soldering pad area; covering the passive components by non-conductive paste; pasting a semiconductor chip onto the chip paste area; then, using encapsulation resin to cover the semiconductor chip and the bonding wires; and finally placing the conductive components onto the back surface of the substrate to complete the package manufacture process of the BGA semiconductor device. The occurrence of short circuit due to direct contact between the soldering wires and the passive components can be avoided by the use of non-conductive paste which can separate them. Meanwhile, the non-conductive paste can also support the weight of the soldering wires and reduce impact on the soldering wires from molten encapsulation resin flow, which can prevent shifting or sagging of the soldering wires and thus reduce the defective rate of product.
Patent TW-531848-B (TW)
Title: Reduction of orientation dependent oxidation for vertical sidewalls of semiconductor substrates
Inventor: TEWS HELMUT HORST
IPC: H01L21/8242
Filed: 2001-03-20
Granted: 2003-05-11
Abstract: A method for growing a dielectric layer on a substrate, in accordance with the present invention, includes the steps of providing a substrate (102) having at least two crystallographic planes (planes (100) and (110)) which experience different dielectric layer growth rates due to the at least two crystallographic planes. A first dielectric layer (124) is grown on the at least two crystallographic planes such that the first dielectric layer has a first thickness on a first crystallographic plane and a second thickness on a second crystallographic plane. The first thickness is thicker than the second thickness for the first dielectric layer. Dopants (126) are implanted through the first dielectric layer. A greater number of dopants are implanted in the substrate through the second thickness than through the first thickness of the first dielectric layer. The first dielectric layer is then removed. A second dielectric layer (130) is grown at a same location as the removed first dielectric layer. The second dielectric layer has a first thickness on a first crystallographic plane and a second thickness on a second crystallographic plane. The first thickness and the second thickness of the second dielectric layer are closer in thickness than the first thickness and the second thickness of the first dielectric layer due to the implantation of the dopants.
Patent TW-518423-B (TW)
Title: Reflection-reducing film
Inventor: HASEGAWA HIROAKI
IPC: G02B1/11
Filed: 2001-03-07
Granted: 2003-01-21
Abstract: A reflection-reducing film formed by being applied onto the surface of a substrate having light transmitting property, and including a base layer formed on the surface of said substrate and a surface layer formed on the upper side of said base layer, wherein: said base layer has a thickness of from 50 to 200 nm; and said surface layer is formed of a hydrolyzed product of a silane compound represented by the following formula (I): Rn-Si(X)4-n, wherein R is a substituted or unsubstituted alkyl group or an alkenyl group, X is a hydrolyzable group, and n is a number of 1 or 2, a metal chelate compound and a silica sol, and has a thickness of from 50 to 200 nm. The reflection-reducing film is easily formed on a light-transmitting substrate by applying a multi-layer coating thereon, and exhibits an excellent liquid resistance.
Patent TW-535366-B (TW)
Title: Integrated circuit with a demodulation-circuit
Inventor: EICHNER DIERK
IPC: G06K19/07
Filed: 2001-03-26
Granted: 2003-06-01
Abstract: An integrated circuit for chip-cards and similar mobile data-carrier (for example, according to ISO 14443) has two independent demodulation-devices with a sensitivity-setting-device respectively, where between the two demodulation-devices is it periodically switched, and only the control-area of the demodulation-device, the output-signal of which is actually not selected, can be varied.
Patent TW-533590-B (TW)
Title: Semiconductor device
Inventor: KUNIKIYO TATSUYA
IPC: H01L27/02
Filed: 2001-03-29
Granted: 2003-05-21
Abstract: A diode (QN1) is connected in parallel to one of two bipolar transistors (PB1, NB1) constituting a semiconductor-controlled rectifier or SCR (400) in such a direction as to encourage positive feedback. This enhances current drivability and accelerates a turn-on operation.
Patent TW-495904-B (TW)
Title: A method to form zirconium oxide and hafnium oxide for high dielectric constant materials
Inventor: CHOOI SIMON
IPC: H01L29/786
Filed: 2001-05-11
Granted: 2002-07-21
Abstract: A new method of forming a metal oxide high dielectric constant layer in the manufacture of an integrated circuit device has been achieved. A substrate is provided. A metal oxide layer is deposited overlying the substrate by reacting a precursor with an oxidant gas in a chemical vapor deposition chamber. The metal oxide layer may comprise hafnium oxide or zirconium oxide. The precursor may comprise metal alkoxide, metal alkoxide containing halogen, metal β-diketonate, metal fluorinated β-diketonate, metal oxoacid, metal acetatc, or metal alkene. The metal oxide layer is annealed to cause densification and to complete the formation of the metal oxide dielectric layer in the manufacture of the integrated circuit device. A composite metal oxide-silicon oxide (M02-Si02) high dielectric constant layer may be deposited using a precursor comprising metal tetrasiloxane.
Patent TW-554352-B (TW)
Title: Magnetic powder, manufacturing method of magnetic powder and bonded magnets
Inventor: ARAI AKIRA
IPC: H01F1/06
Filed: 2001-05-22
Granted: 2003-09-21
Abstract: Disclosed herein is a magnetic powder which can provide magnets having excellent magnetic properties and having excellent reliability especially excellent heat stability. The magnetic powder is composed of an alloy composition represented by (R1-aDya)x(Fe1-bCob)100-x-yBy (where R is at least one kind of rare-earth element, x is 7.1 to 9.9 at%, y is 4.6 to 8.0 at%, a is 0.02 to 0.2, and b is 0 to 0.30), wherein the magnetic powder is constituted from a composite structure having a soft magnetic phase and a hard magnetic phase, and the intrinsic coercive force (Hcj) of the magnetic powder at a room temperature is in the range of 400 to 750 kA/m.
Patent TW-546924-B (TW)
Title: On-line offset cancellation in flash a/d with interpolating comparator array
Inventor: FEYGIN GENNADY
IPC: H03M1/36
Filed: 2001-05-25
Granted: 2003-08-11
Abstract: A method for performing an auto-zero function in a flash analog to digital converter (""ADC""), the ADC including a reference voltage circuit, providing a plurality of evenly spaced analog reference voltages, and a plurality of system voltage comparators for comparing an input voltage against the reference voltages and providing an indication of which reference voltage corresponds to the input voltage. In the method the following steps are performed. A plurality of redundant voltage comparators are provided. A subset of the plurality of system voltage comparators are selected. Auto-zero is performed on the selected comparators, and the redundant comparators are used in the place of the selected comparators. The outputs of the main comparator array and the extra comparators are combined to produce a final digital output.
Patent TW-502406-B (TW)
Title: Ultra-thin package having stacked die
Inventor: WU CHI-CHUAN
IPC: H01L23/433
Filed: 2001-08-01
Granted: 2002-09-11
Abstract: An ultra-thin package having stacked die is disclosed. Its substrate has a cavity, an upper surface and a bottom surface. The heat sink sheet is connected to the bottom surface. A part of the heat sink sheet is used as the die pad, and the die pad is opposed to the cavity. The first die is located inside the cavity and is bonded to the die pad, and the first die is electrically connected to the substrate. The second die is located inside the cavity and is fixed to the first die, and the second die is electrically connected to the substrate. The encapsulant is formed in the cavity, and the encapsulant covers the first die, the second die, heat sink sheet, and bottom surface of part of the substrate. Plural solder balls are located on the bottom surface of the substrate, the present invention can achieve the purpose of thin and small volume, and has the advantage of simple process and low cost.
Patent TW-516097-B (TW)
Title: Illumination optical apparatus and exposure apparatus having the same
Inventor: TANITSU OSAMU
IPC: G02B5/04
Filed: 2001-08-23
Granted: 2003-01-01
Abstract: An illumination optical apparatus capable of successfully realizing mutually different illumination conditions in two orthogonal directions on an illumination objective plane is disclosed in the present invention. An optical system (7) with variable magnification for similarly changing the entire size of the secondary multiple light sources is arranged in an optical path between the first optical integrator (6) for forming the first multiple light sources based on the light beam from a light source mechanism (1) and the second optical integrator (8) for forming the second multiple light sources having light sources of a larger number on the basis of the light beam from the first multiple light sources. In addition, an aspect ratio-changing element (10) is provided for changing the aspect ratio of the incoming light beam in order to change the angle of incidence of the incoming light beam into the first optical integrator in a predetermined direction.
Patent TW-539926-B (TW)
Title: Lithographic apparatus, device manufacturing method, and device manufactured thereby
Inventor: DE JAGER PIETER WILLEM HERMAN
IPC: H01J37/305
Filed: 2001-09-12
Granted: 2003-07-01
Abstract: Various options for improving throughput in an e-beam lithography apparatus are described. A slider lens moves in synchronism with the scanning motion of the electron beam. A lithographic projection apparatus comprising: a radiation system for providing a projection beam of radiation; a support structure for supporting patterning means, the patterning means serving to pattern the projection beam according to a desired pattern; a substrate table for holding a substrate; a projection system for projecting the patterned beam onto a target portion of the substrate, characterized in that: at least one of said radiation system and said projection system comprises a sliding electron-optical element for generating an electromagnetic field for acting on said projection beam such that the optical axis of said electromagnetic field is displaced in at least one direction perpendicular to said axis in synchronism with said scanning motion.
Patent TW-501320-B (TW)
Title: Laser light generating apparatus and optical apparatus using the same
Inventor: MASUDA HISASHI
IPC: G11B7/125
Filed: 2001-09-12
Granted: 2002-09-01
Abstract: Provided is a small sized laser light generating apparatus capable of oscillating continuous light with a range of wavelengths of about 200 nm or less with stability at high conversion efficiency. Light with wavelength λ1 and light with wavelength λ2 outputted from a first laser light generator and a second laser light generator are introduced into a first resonator and a second resonator, respectively, and then a nonlinear optical device included in both the first and second resonators generates light with wavelength λ3 through sum-frequency mixing of these two incoming light beams. The light with the wavelength λ1, the light with the wavelength λ2 and the light with the wavelength λ3, which are spatially separated from one another, enter into and exit from the nonlinear optical device and have different optical paths. The light with the wavelength λ3 and the light with the wavelength λ2 are set so that the optical axes thereof do not perfectly match in the nonlinear optical device, and an incident angle or an exit angle of at least one of the two light beams is set at a Brewster angle, whereby reflection loss can be further reduced.
Patent TW-536776-B (TW)
Title: Manufacturing method of dual-damascene pattern to prevent photoresist scum in via hole
Inventor: LIN JENG-JUNG
IPC: H01L21/768
Filed: 2001-10-09
Granted: 2003-06-11
Abstract: A kind of method for manufacturing dual-damascene pattern to prevent photoresist scum in via hole is disclosed in the present invention and includes at least the following steps: providing a semiconductor substrate, in which the semiconductor substrate is covered with a low-k material layer and a via hole of dual-damascene process is formed in the low-k material layer; forming amorphous silicon liner layer on the surface of the low-k material layer; forming a photoresist layer on the amorphous silicon liner layer to fill up the via hole; conducting a photolithography process onto the photoresist layer to form and define a photoresist pattern of the conduction line trench; and using the photoresist layer which is completed with a photolithography process as the mask to etch away part of the amorphous silicon liner layer and part of the low-k material layer so as to form a trench in the low-k material layer. Thus, the fabrication of dual-damascene pattern is then completed.
Patent TW-I285553-B (TW)
Title: New inhalable powder containing tiotropium
Inventor: BECHTOLD-PETERS KAROLINE
IPC: A61K31/439
Filed: 2001-10-09
Granted: 2007-08-21
Abstract: The invention relates to powdered preparations containing tiotropium for inhalation, processes for preparing them as well as their use in preparing a pharmaceutical composition for the treatment of respiratory complaints, particularly for the treatment of COPD (chronic obstructive pulmonary disease) and asthma.
Patent TW-507342-B (TW)
Title: Packaging method
Inventor: CHEN HSING
IPC: H01L23/28
Filed: 2001-11-20
Granted: 2002-10-21
Abstract: A LED chip and frames are packaged with epoxy or a LED chip is coated with a layer of silica gel and then is packaged with epoxy for conventional LED packaging. Since the available epoxy is not able to sustain irradiating by short wavelength and high temperature, the deterioration or the discoloration occurs and the brightness and the lifetime decrease substantially. The present invention provides a packaging method for LED with short wavelength to coat a layer of inorganic liquid glass gel for protection first and to fill gel for packaging. Since the epoxy and the surface of a LED chip are isolated, the deterioration from the exposure of the outer epoxy of LED chips to high temperature and irradiation of short wavelength can be improved. In addition, the current method is easy processing, and the brightness and the lifetime can be increased.
Patent TW-I224176-B (TW)
Title: Pseudo engaging and shaping method and application thereof
Inventor: WU CHIA-TEIN
IPC: F16B4/00
Filed: 2001-12-06
Granted: 2004-11-21
Abstract: This invention provides a pseudo engaging and shaping method and application thereof, which is characterized in: dividing a mobile assembled product into an embedding member part and an enveloped-shaping part by the characteristics of the pseudo material engagement under certain conditions; wherein the embedding member part includes a shaped part featuring certain functions; the enveloped-shaping part envelops the embedding member part and is provided inside the mold and over the embedding member part, so as to form another part with certain functions, and to pseudo-engage with the embedding member part, thereby assembling a mobile assembly product.
Patent TW-524943-B (TW)
Title: Valve box
Inventor: RENN DANIEL JOHN
IPC: B65D53/02
Filed: 2001-12-10
Granted: 2003-03-21
Abstract: Valve boxes of this invention comprise a housing including an inner chamber that extends axially through the housing from a housing base. The housing chamber includes a diameter that is defined by a housing sidewall surface that extends outwardly from the base, forming a chamber opening. The chamber opening includes a seal surface that is positioned radially inwardly towards the chamber. The valve box further includes a lid that is positioned over the housing chamber opening. The lid includes a concave center section and a seal surface disposed radially therearound. The lid seal surface is positioned radially towards the chamber, and is placed opposite the chamber opening seal surface. An annular seal is interposed between the housing chamber and lid seal surfaces. The chamber and lid seal surfaces are configured generally perpendicular to the chamber opening, such that internal pressure within the chamber causes the concave center portion to impose a radially outwardly directed pressure onto the lid, thereby further compressing the annular seal to ensure a leak-tight seal.
Patent TW-577853-B (TW)
Title: System and method for holding critical fluids
Inventor: GARGANO ANTHONY
IPC: B65D90/00
Filed: 2002-01-25
Granted: 2004-03-01
Abstract: A sealing system, sealing system components, and methods of manufacture and use for a vessel that holds corrosive liquid, with the sealing system having a port on the vessel, an insert, and a sealing element. The sealing element is corrosion-resistant, essentially impermeable to corrosive and critical fluids, essentially free of leachable impurities and is made with a material having a Shore A hardness between about 70 and about 95. A preferred material for the sealing ring is the class of materials known as polyolefins. The insert is operably engageable with the port and the sealing element to create a seal between the sealing element and the first and second sealing surfaces to prevent fluid flow through the port.
Patent TW-509616-B (TW)
Title: Filtration cassette and injection-molding tool for making the frame of the filtration cassette
Inventor: EBERLE ADAM
IPC: B60H3/06
Filed: 2002-02-26
Granted: 2002-11-11
Abstract: This invention provides an injection-molding tool for making a plastic frame of a filtration cassette; a plastic is injection molded along the edge of a lengthwise side of a filtration material folded into a sawtooth shape. Half of the injection-molding tool is designed into a tooth-like mutual insertion and forms a space to accommodate the filtration material and a mold space for the plastic frame; the two spaces are separated from each other by a toothed clamped region; in the clamped region (31) of the lengthwise side (4) of the injection molding tool (30), and in the arc region (32) of the top folded edge (9) and/or the bottom folded edge (10) of the filtration material (3), the seams (7)(17) formed between the closed half molds (1)(2) of the injection-molding tool is larger or smaller than the seam (8) of the folded side flank (11).
Patent TW-530376-B (TW)
Title: Top corner rounding for swallow trench isolation and method thereof
Inventor: WU JIE-SHING
IPC: H01L21/76
Filed: 2002-03-22
Granted: 2003-05-01
Abstract: A top corner rounding for swallow trench isolation (STI) and method thereof are described. After a silicon nitride layer is pulled back, the sharp top corner of the swallow trench isolation is cut by heavy ions sputtering which is adjusted to suitable sputtering angles and energy to make a radius of the top corner increasing, and prevents a semiconductor device from generating leakage current.
Patent TW-548758-B (TW)
Title: Conductor bodies attached adhesive sheet, process for producing semiconductor device and semiconductor device
Inventor: YAMAZAKI OSAMU
IPC: C09J7/20
Filed: 2002-03-27
Granted: 2003-08-21
Abstract: A semiconductor device, which is obtained by sticking a conductor bodies attached adhesive sheet 1 comprising a base material 2, an adhesive agent layer 3 formed on the base material 2 and conductor bodies 4 buried in the adhesive agent layer 3 to a semiconductor wafer, removing the base material from the adhesive agent layer of the conductor bodies attached adhesive sheet 1, then, the adhesive agent layer 3 and a substrate are aligned and the semiconductor wafer and the substrates are adhered via the adhesive agent layer 3, has no defects caused by fluidity of an under filling material.
Patent TW-560097-B (TW)
Title: Improved cathode compositions for lithium-ion batteries
Inventor: LU ZHONGUA
IPC: C01G53/00
Filed: 2002-04-01
Granted: 2003-11-01
Abstract: A cathode composition for a lithium-ion battery having the formula Li[M1(1-x)Mnx]O2 where 0 < x < 1 and M1 represents one or more metal elements, with the proviso that M1 is a metal element other than chromium. The composition is in the form of a single phase having an O3 crystal structure that does not undergo a phase transformation to a spinel crystal structure when incorporated in a lithium-ion battery and cycled for 100 full charge-discharge cycles at 30 DEG C and a final capacity of 130 mAh/g using a discharge current of 30 mA/g.
Patent TW-560173-B (TW)
Title: Automatically adjusting line art threshold method and apparatus
Inventor: WANG KUO-JENG
IPC: H04N1/04
Filed: 2002-05-27
Granted: 2003-11-01
Abstract: An automatically adjusting line art threshold method is disclosed. The invention comprises the following steps. Firstly, a start density value, a finish density, a white percentage threshold, a black percentage threshold and a threshold specification value are set. Then a calibration chart comprising at least one density unit and having gray-scale values varying continuously from full whiteness to full darkness is scanned. The calibration chart can be built in an image scanner or be placed on transparent scanning sheet by a user. A line art threshold value is calculated by the start density value, the finish density, the white percentage threshold and the black percentage threshold. Finally, the threshold specification value is compared to the line art threshold value.