baber/WOPTO huggingface dataset:
Patent JP-2005259969-A (JP)
Title: Semiconductor device and manufacturing method thereof
Inventor: SOEJIMA KOJI
IPC: H01L25/07
Filed: 2004-03-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a technique for forming a coil on a semiconductor device by a simple method.  <P>SOLUTION: The semiconductor device 100 comprises a first semiconductor element 102 and a second semiconductor element 104. Further, the semiconductor device 100 comprises a coil 20 constituted of a first conductor 12a provided on the first semiconductor element 102, and a second conductor 12b provided on the second semiconductor element 104 while being wound around a central axis in a direction horizontal to the first semiconductor element 102. The coil 20 is formed in a region wherein the electrode pad 22 and the first connecting electrode 24a of the first semiconductor element 102 and the second connecting electrode 24b of the second semiconductor element 104 are formed.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005258793-A (JP)
Title: Individual information management device, individual information managing method and program for making computer execute the same method
Inventor: SATO MIKI
IPC: G06Q10/00
Filed: 2004-03-11
Abstract: <P>PROBLEM TO BE SOLVED: To execute proper individual information management by easily and accurately inputting individual information and its location information stored in a home or personal information or the like.  <P>SOLUTION: When an article 22 attached with an RFID tag 23 in which individual information is stored is brought in a home, short-range radio communication is performed between an RFID reading part 11 and an RFID tag 23 of an individual information management device 10 placed in a front door, and the stored individual information is read. Also, when an individual 24 is carrying an RFID tag 25 in which personal information is stored, short-range radio communication is performed between the RFID reading part 11 and the RFID tag 25 in the same way, and the stored personal information is read. A CPU 13 of the personal information management device 10 registers the individual information and the personal information read by the RFID reading part 11 into a memory 12, and the registered information is displayed at a monitor 14 or the like so that the individual information or the like can be managed.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005258816-A (JP)
Title: Plant operation management support system
Inventor: SAKAMOTO YOSHIYUKI
IPC: G06Q50/04
Filed: 2004-03-11
Abstract: <P>PROBLEM TO BE SOLVED: To enable efficient operation in plants installed in any regions, supporting to establish a plan necessary for deriving operation management performance after installation to the maximum extent with reduced installation costs, when newly installing or updating plant facilities.  <P>SOLUTION: The system fetches a measurement data, etc. on the plant side from an input/output means 2, and stores the above data into a data storage means 3. Based on the measurement data from the past to the present, etc. stored in the data storage means 3, a simulation means 4 simulates plant behaviors from the past to the future. Based on the above simulation results, a running cost trial calculation means 5 and an installation cost trial calculation means 6 performs trial calculations of the running cost and the installation cost.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005257048-A (JP)
Title: Tapered roller bearing
Inventor: MATSUYAMA HIROKI
IPC: F16C19/36
Filed: 2004-03-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a tapered roller bearing by which a running torque can be lessened.  <P>SOLUTION: An outward end surface 15 in the diameter direction of a small-diameter annular part 12 of a cage 10 is located more inwardly in the diameter direction than a pitch conical surface P of the tapered roller 3, while an inward end surface 16 in the diameter direction of a large-diameter annular part 13 is located more outwardly in the diameter direction than the pitch conical surface P. Further, an opposed part 18 against the small-diameter surface of the tapered roller 3 in the small-diameter annular part 12 is located more inwardly in the diameter direction than the pitch conical surface P, while an opposed part 19 against the large-diameter surface of the tapered roller 3 in the large-diameter annular part 13 is located more outwardly in the diameter direction than the pitch conical surface P. Additionally, the small-diameter annular part 12, a column portion 14 and the large-diameter annular part 13 are positioned substantially in alignment.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005268303-A (JP)
Title: Method of manufacturing semiconductor device
Inventor: IRIE SHIGEO
IPC: H01L21/28
Filed: 2004-03-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device by which a rectangular resist pattern having no hemming bottom in its cross section is formed with high reproducibility by suppressing the peeling of the resist pattern, in the course of lithography performed for forming the resist pattern on a reflection preventing film.  <P>SOLUTION: In the course of the lithography performed for forming the resist pattern containing fluorine on the reflection preventing film, the surface energy of the reflection preventing film 4 and a photoresist film 5 is calculated by measuring contact angles by respectively dropping a plurality of reagents (liquids) onto the films 4 and 5. Then the films 4 and 5 are formed by selecting the materials of the films 4 and 5 so that the surface energy of the film 4 may become larger than that of the film 5, and, in addition, the difference between the surface energy of the films 4 and 5 may become ≥10 mN/m and the lithography is performed. Consequently, the adhesive property between the films 4 and 5 is improved, and the peeling off of the resist pattern is suppressed. At the same time, the rectangular resist pattern having no flanging in its cross section is formed with high reproducibility.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005269806-A (JP)
Title: Dc motor drive device, drive control method, image forming apparatus using the dc motor drive device, image scanner
Inventor: KOMATSU MAKOTO
IPC: H02P6/24
Filed: 2004-03-19
Abstract: <P>PROBLEM TO BE SOLVED: To prevent, with a low-cost configuration, a DC motor from rotating due to environmental changes, measurement error, individual difference of circuit elements, or the like, even if control instructions for stopping the DC motor are outputted.  <P>SOLUTION: A motor driving part including DC motors 102 and 121 is so configured that the DC motor rotates, when a motor current flows in normal direction, while rotation of the DC motor stops when it flows in the opposite direction. A current control signal Vo, which determines direction and quantity of the motor current, is outputted from a current control part 200 to a motor driver 141. The current control part contains an analogue circuit and outputs the current control signal Vo, to allow the motor current in the direction opposite to the normal direction to flow to the DC motor, when a controller 150 outputs the command instruction for stopping the DC motor.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005266549-A (JP)
Title: Optical fiber array
Inventor: TANAKA HIRONORI
IPC: G02B6/40
Filed: 2004-03-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide an optical fiber array which is free of the generating of position shift and deformation or the like of an optical fiber and has superior reliability.  <P>SOLUTION: In the optical fiber array, a resin layer having a plurality of grooves is formed in a portion of the surface of a substrate and optical fibers are stored in the grooves. A lid part is formed on the resin layer to store a portion of the optical fibers. A recessed section is formed on the surface which is opposed to the resin layer of the lid part to store the optical fibers in block.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005262153-A (JP)
Title: Fine particle deposition pattern formation method and functional patterned material
Inventor: KAWAMURA KOICHI
IPC: C08F291/00
Filed: 2004-03-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a fine particle deposition pattern formation method applicable to pattern formation with a large surface area and capable of pattern-wise arranging fine particles in a region with a desired high resolution degree and forming such patterns by simple operation and a functional patterned material comprising various functional fine particles stuck in a region with a desired high resolution, excellent in durability, applicable in a wide range of applications by the method.  <P>SOLUTION: The fine particle deposition pattern formation method comprises a step of forming hydrophilic/hydrophobic patterns composed of surface graft polymer chain present/absent regions by exposing a surface-grafted material, which is a substrate having surface graft polymer chains whose one end terminals are bonded directly to the substrate surface by the covalent bonds and which are bonded to the substrate surface by the covalent bonds through photo-openable portions, so as to open the photo-openable portions and remove the surface graft polymer chains and a step of depositing functional fine particles to the hydrophilic regions or the hydrophobic regions of the hydrophilic/hydrophobic patterns.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005268690-A (JP)
Title: Manufacturing method of multi-layered circuit substrate
Inventor: MATSUBUCHI HIROSHI
IPC: H05K3/00
Filed: 2004-03-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a multi-layered circuit substrate for suppressing the deviation of each layer at the time of lamination pressing in the multi-layered circuit substrate.  <P>SOLUTION: The manufacturing method of the multi-layered circuit substrate having a process for forming a laminated body where a plurality of circuit substrates and an inter-layer adhesive are laminated, a process for temporarily bonding the laminate body, and a process for heating and pressurizing the laminated body, wherein the adhesive at a reference mark section for temporarily bonding the circuit substrate and adhesive provided at the peripheral section of the circuit substrate in the process of the temporary bonding is almost completely hardened.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005278249-A (JP)
Title: Capacity adjustment device and adjusting method of battery pack
Inventor: NAKADA YUSHI
IPC: H02J7/02
Filed: 2004-03-23
Abstract: <P>PROBLEM TO BE SOLVED: To perform a capacity adjustment of a battery pack comprising a plurality of cells while suppressing energy loss.  <P>SOLUTION: Voltage comparators IC1-IC8 compare the voltage of corresponding C1-C8 with a predetermined bypass operation voltage to output a comparison results. Switches SW1-SW8 are turned on when a signal indicating that the cell voltage is higher than the bypass operation voltage is output from the voltage comparators IC1-IC8. Consequently, a part of charging current flows through bypass resistors R1-R8 connected in series with the switches SW1-SW8. In such a circuit, the bypass operation voltage is set at a relatively high level and when the capacity of a battery pack 1 is adjusted, a target charging rate of the battery pack is set higher than that in normal charge/discharge mode.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005273637-A (JP)
Title: Failure predicting system for gas discharger such as vacuum pump
Inventor: OYAMA ATSUSHI
IPC: F04B37/16
Filed: 2004-03-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a failure predicting system enabling maintenance of a monitored object to be performed at the correct timing.  <P>SOLUTION: The failure predicting system 1 for monitoring a gas discharger used for discharging gas generated in a manufacturing process such as a semiconductor producing process, comprises an oscillator 14 provided in a casing of the gas discharger and/or gas atmosphere in piping near the gas discharger; an exciting element 13 capable of oscillating the oscillator 14; a oscillation detecting element 15 for detecting oscillation generated by the oscillator 14; and a protecting device 12 controlling an action of the exciting element 13, receiving an output signal of the oscillation detecting element 15, memorizing changes in a structure of the oscillator 14, and detecting that the change exceeds a predetermined threshold to output.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005286641-A (JP)
Title: Communication device, communication system, and receiving method
Inventor: ARIKAWA TOSHIAKI
IPC: H04L45/586
Filed: 2004-03-29
Abstract: <P>PROBLEM TO BE SOLVED: To solve the problem that duplication or missing of frames can occur in the communication device that uses Ethernet (R) for connection with double transmission paths because there exists no such means as absorbing a delay difference of data inputted from two transmission paths.  <P>SOLUTION: The communication device comprises a medium access control means, first and second encoding/decoding means, a memory for holding reception data, and a signal conversion means. The first and second encoding/decoding means assigns a consecutive number to the region between transmission frames when transmitting, while extracting the consecutive number at receiving to adjust transmission delay difference between the reception data. In the receiving method, the data containing the consecutive number assigned to the region between the frames is received from two transmission paths, and the consecutive number is extracted from the reception data to adjust transmission delay difference between the reception data.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005285632-A (JP)
Title: Nonaqueous electrolyte battery
Inventor: SARUWATARI HIDESATO
IPC: H01M10/0568
Filed: 2004-03-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a nonaqueous electrolyte battery having high safety and superior high load discharging characteristics.  <P>SOLUTION: This nonaqueous electrolyte battery is provided with a positive electrode 2, a negative electrode 3, and nonaqueous electrolyte containing normal temperature melting salt containing organic cation, having skeleton expressed by formula 1 in a cation component. At least either of the positive electrode 2 or the negative electrode 3 includes current-carrying assist agent, containing carbon substance in which the half-value width of a peak, in which 2θ appears in a scope of 15 to 30° in X-ray diffraction by use of CuKα ray, is 4 to 20°.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005294906-A (JP)
Title: Reading and recording apparatus
Inventor: NIIKURA TAKEJI
IPC: H04N1/00
Filed: 2004-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a reading and recording apparatus the number of components of which can be reduced to thereby attain furthermore miniaturization and cost reduction.  <P>SOLUTION: The reading and recording apparatus including: a recording section 100 for using a recording medium 105 to making recording on a sheet member; and a read section 200 for using a read means 203 to read an original, shares at least part of a drive and drive transmission means such as a motor and a timing belt for moving the recording means 105 and part of a drive and drive transmission means such as a motor and a timing belt for moving the read means 203.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2004304194-A (JP)
Title: Sewing device for semiconductor package production process and its control method therefor
Inventor: YON-GU LEE
IPC: H01L21/56
Filed: 2004-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a sewing device for a semiconductor package production process that can improve productivity and its control method by making it possible to simultaneously achieve the loading of a strip and the unloading of a package when doing a sewing work to produce a semiconductor package.  <P>SOLUTION: The sewing device for a semiconductor package production process includes a chuck table base 200, a chuck table 23 installed onto the chuck table base 200 such that it can be moved in a horizontal direction, two chuck plates 233a and 233b installed onto the upper part of the chuck table 23 in a rotatable way and onto whose upper part strips (S) are alternately loaded, a slicing machine 30 that slices a strip (S), loaded onto the chuck plate, into respective packages in a mutual motion with the chuck table 23, and a strip/package picker 22 that simultaneously performs an operation of loading the strip (S) onto the chuck plate and an operation of unloading the package (P).  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005291266-A (JP)
Title: Electric valve
Inventor: AOKI TETSUYA
IPC: F25B41/06
Filed: 2004-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electric valve capable of reducing electric power consumption to 1/2 to 1/3 of conventional electric power consumption without increasing size of a motor.  <P>SOLUTION: This electric valve 10 is provided with a valve main body 20 in which passing flow rate is adjusted by a valve element 23 coming into contact with or leaving a valve seat 22 in a valve chamber 21 by a valve shaft 24, a can 40 fixed to the valve main body 20 and incorporating a rotor 30 bringing the valve element 23 into contact with the valve seat 22 or making it leave the valve seat 22, and a stator 50 fitted into the can 40 externally and having a driving coil 53 rotating and driving the rotor 30. A coil driving circuit 60 for driving the driving coil 53 constituting the stator 50 is molded integrally with the stator 50. The coil driving circuit 60 is constituted by arranging an IC 62 for driving having serial interface on a printed wiring board 63. A lead wire for supplying input electric power and a serial signal wire 69 for control in the coil driving circuit are mutually connected, and a lead terminal 54 of the driving coil is connected with output. The driving coil 53 is constituted as a coil for bipolar driving.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005294577-A (JP)
Title: Semiconductor device and its manufacturing method
Inventor: KAWANO MASAYA
IPC: H01L23/52
Filed: 2004-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a through electrode excellent in performance and manufacture stability as an electrode.  <P>SOLUTION: The through electrode 135 which is constituted of a conductive small diameter plug 119 and a conductive large diameter plug 131 is arranged on the semiconductor device 100. Cross section of the small diameter plug 119 is made greater than cross section and diameter of a connection plug 123 and smaller than cross section and diameter of the large diameter plug 131, respectively. A projection 141 wherein the small diameter plug 119 is projected from a silicon substrate 101 is inserted into an upper surface of the large diameter plug 131. An upper surface of the small diameter plug 119 is connected to a first wiring 121.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005291674-A (JP)
Title: Indirect heating type rotary kiln furnace
Inventor: TATSUMI KEIJI
IPC: F27B7/34
Filed: 2004-04-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide an indirect heating type rotary kiln furnace capable of preventing a constitution of a device from being large-scaled and complicated, surely improving heat transfer efficiency with a comparatively simple constitution, and needing less rotating driving force.  <P>SOLUTION: In this indirect heating type rotary kiln furnace comprising a rotating drum 10 for conveying a heated object while rotating to perform heat treatment, and transferring the heat to the rotating drum 10 by circulating heating fluid on an outer surface of the rotating drum 10, a number of approximately spherical concave parts 12 are formed on the outer surface of the rotating drum on which the heating fluid is circulated.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005297623-A (JP)
Title: Shock absorbing structure of vehicle
Inventor: OMI YASUAKI
IPC: B60R19/34
Filed: 2004-04-07
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a shock absorbing structure of a vehicle capable of obtaining an energy absorbing characteristic to be desired (namely, a characteristic with still high energy absorbing volume even when the structure is deformed in a load input direction) at the time of collision by a low-cost structure.  <P>SOLUTION: A required number of hollow shock absorbing elements 22 formed into a conical trapezoidal shape by press molding a steel plate are laminated in an axial direction, and adjacent peripheral walls 22A are adhered by an adhesive 24. According to this constitution, when a shock load F is inputted to a tip end of a shock absorbing structure 10, a tensile load in a peripheral direction acts on a large diameter part 22A2 side of a peripheral wall 22A of each of the shock absorbing elements 22, so as to cause plastic deformation in a face. Accordingly, an energy absorbing effect is made high compared to a structure for causing deformation outside a face by compression buckling. Also, because press molding can be utilized, the structure can be produced at low costs.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005298855-A (JP)
Title: Titanium alloy, titanium-alloy product and method for manufacturing them
Inventor: ITO KAZUHIKO
IPC: C22B9/20
Filed: 2004-04-07
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for melting a titanium alloy containing many Va group elements.  <P>SOLUTION: The method for manufacturing the titanium alloy comprises: a melting step wherein a uniform raw-material powder of 1μm to 5 mm average particle size, which is regulated into a desired total composition consisting of a group of alloying-elements containing at least Va group elements and the main balance Ti, is compacted into a desired shape and the resultant powder compact is heated to undergo melting; and a solidification step wherein the resultant molten alloy melted in the above melting step is successively cooled to undergo solidification. After the solidification step, the titanium alloy containing the above Va group elements in the amount of 15 to 60 mass% in total (when the whole is 100 mass%) and having an alloy composition practically uniform regardless of the part of the alloy can be obtained. By melting the powder compact composed of the powder with the specific particle size, the uniform titanium alloy which hardly causes unmelting even in the case where large amounts of high-melting-point alloying elements are contained and is minimal in composition fluctuations, solidification segregation, etc., can be obtained.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005264313-A (JP)
Title: Roll
Inventor: ISHIGURO SHINJI
IPC: B08B1/04
Filed: 2004-03-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a roll which is extremely high in durability, and is substantially free of the occurrence of elasticity degradation discoloration, yellowing, etc.  <P>SOLUTION: The roll used for removing, sucking and cleaning the moisture, oil-components or chemical components sticking to a surface to be cleaned consisting of a steel plate, nonferrous metallic sheet, resin plate or film, etc., or for applying the moisture, oil-components or chemical components to the surface to be cleaned is formed of a pedestal and a roll section. The roll section is formed of a plurality of roll pieces. The roll pieces are formed to an approximately disk shape by double structures composed of nonwoven fabrics and polyurethanes which have extremely fine pores and are made porous. A plurality of the roll pieces are stack on each other and are penetrated through the pedestal.  <P>COPYRIGHT: (C)2005,JPO&NCIPI