Patent SG-11201810649P-A (SG)
Title: Methods and apparatus for depositing materials on a continuous substrate
Inventor: ISHIKAWA DAVID MASAYUKI
IPC: C23C16/04
Filed: 2017-06-02
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 07 December 2017 (07.12.2017) WIP0 I PCT oimitia inn Hol Holm mil ooluom oimIE (10) International Publication Number WO 2017/210583 Al (51) International Patent Classification: C04B 35/628 (2006.01) C23C 16/54 (2006.01) C04B 35/80 (2006.01) C23C 16/04 (2006.01) (21) International Application Number: PCT/US2017/035728 (22) International Filing Date: 02 June 2017 (02.06.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/344,962 02 June 2016 (02.06.2016) US (71) Applicant: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue, Santa Clara, California 95054 (US). (72) Inventors: ISHIKAWA, David Masayuki; 1009 Clark Avenue, Mountain View, California 94040 (US). BUR- ROWS, Brian H.; 2434 Tulip Road, San Jose, California 95128 (US). (74) Agent: TABOADA, Alan et al.; MOSER TABOADA, 1030 Broad Street, Suite 203, Shrewsbury, New Jersey 07702 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, = (54) Title: METHODS AND APPARATUS FOR DEPOSITING MATERIALS ON A CONTINUOUS SUBSTRATE 132 FIG. 1A 122 128 (57) : Methods and apparatus for depositing material on a continuous substrate are provided herein. In some embodiments, an apparatus for processing a continuous substrate includes: a first chamber having a first volume; a second chamber having a second volume fluidly coupled to the first volume; and a plurality of process chambers, each having a process volume defining a processing path between the first chamber and the second chamber, wherein the process volume of each process chamber is fluidly coupled to each other, to the first volume, and to the second volume, and wherein the first chamber, the second chamber, and the plurality of process chambers are configured to process a continuous substrate that extends from the first chamber, through the plurality of process chambers, and to the second chamber. [Continued on next page] WO 2017/210583 Al MIDEDIMOMOIDEIRMEM00110101liniMMOVOIMIE GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))