Patent SG-11201906621Q-A (SG)
Title: Cleave systems, mountable cleave monitoring systems, and methods for separating bonded wafer structures
Inventor: KAYSER JUSTIN SCOTT
IPC: B32B43/00
Filed: 2018-01-16
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 26 July 2018 (26.07.2018) WIP0 I PCT omit VIII °nolo imooliono iflo oimIE (10) International Publication Number WO 2018/136399 Al (51) International Patent Classification: HOlL 21/67 (2006.01) B32B 43/00 (2006.01) B28D 5/00 (2006.01) HO1L 21/762 (2006.01) (21) International Application Number: PCT/US2018/013820 (22) International Filing Date: 16 January 2018 (16.01.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/449,251 23 January 2017 (23.01.2017) US (71) Applicant: SUNEDISON SEMICONDUCTOR LIMIT- ED [SG/SG]; 9 Battery Road, #15-01, Straits Trading Building, Singapore 049910 (SG). (72) Inventors: KAYSER, Justin Scott; 501 Pearl Drive, St. Peters, Missouri 63376 (US). VALLEY, John Francis; 501 Pearl Drive, St. Peters, Missouri 63376 (US). EOFF, James Dean; 501 Pearl Drive, St. Peters, Missouri 63376 (US). (74) Agent: SCHUTH, Richard A. et al.; ARMSTRONG TEASDALE LLP, 7700 Forsyth Blvd., Suite 1800, St. Louis, Missouri 63105 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, (54) Title: CLEAVE SYSTEMS, MOUNTABLE CLEAVE MONITORING SYSTEMS, AND METHODS FOR SEPARATING BONDED WAFER STRUCTURES (57) : Cleave systems for separating bonded wafer structures, mountable cleave monitoring systems and methods for separating bonded wafer structures are disclosed. In some embodiments, the sound emitted from a bonded wafer structure is sensed during cleaving and a metric related to an attribute of the cleave is generated. The generated metric may be used for quality control and/or to adjust a cleave control parameter to improve the quality of the cleave of subsequently cleaved bonded wafer structures. [Continued on next page] WO 2018/136399 Al MIDEDIMOMOIDEIREEMOMMIMIMMEHMOVOIMIE TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: with international search report (Art. 21(3)) before the expiration of the time limit for amending the claims and to be republished in the event of receipt of amendments (Rule 48.2(h))