Patent SG-11201805152U-A (SG)
Title: Superconducting bump bonds
Inventor: MUTUS JOSHUA YOUSOUF
IPC: H01L23/498
Filed: 2015-12-30
Abstract: liIN ill IS h. le Mr :WI -.....\" A 883 / 1 1 '6 111 61 4 • • • 111211811EN tf1151151111 V' AM r r , (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (10) International Publication Number (43) International Publication Date WO 2017/105524 Al 22 June 2017 (22.06.2017) WIPO I PCT 111111111111110111011111111111010111110 III 0101111111111111110101111111111111110111111 (51) International Patent Classification: HOlL 27/18 (2006.01) HOlL 23/498 (2006.01) (21) International Application Number: PCT/US2015/068082 (22) International Filing Date: 30 December 2015 (30.12.2015) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/267,824 15 December 2015 (15.12.2015) US (71) Applicant: GOOGLE INC. [US/US]; 1600 Amphitheatre Parkway, Mountain View, California 94043 (US). (72) Inventors; and (71) Applicants : MUTUS, Joshua Yousouf [US/US]; Google Inc., 1600 Amphitheatre Parkway, Mountain View, Cali- TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, fornia 94043 (US). LUCERO, Erik Anthony [US/US]; Google Inc., 1600 Amphitheatre Parkway, Moutain View, California 94043 (US). (74) Agent: VALENTINO, Joseph; Fish & Richardson P.C., P.O. Box 1022, Minneapolis, Minnesota 55440-1022 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, [Continued on next page] (54) Title: SUPERCONDUCTING BUMP BONDS 100 108 108 108 110 (57) : A device (100) includes a first chip (104) having a first circuit ele- ment (112), a first interconnect pad (116) in electrical contact (118) with the first circuit element, and a barrier layer (120) on the first interconnect pad, a supercon- ducting bump bond (106) on the barrier layer, and a second chip (102) joined to the first chip by the superconducting bump bond, the second chip having a quantum circuit element (108), in which the superconducting bump bond provides an electrical connection between the first circuit element and the quantum circuit element. 102 118 116 120 106 104 120 116 118 118 116 120 106 120 116 18 W O 20 17 / 1055 24 Al 112 112 FIG. 1 WO 2017/105524 Al MIDEDIM000101011101010MOIDIREM1111101011111111011110111111 SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, Published: GW, KM, ML, MR, NE, SN, TD, TG). — with international search report (Art. 21(3))