Patent SG-11201906446R-A (SG)
Title: Removable temporary protective layers for use in semiconductor manufacturing
Inventor: VARAPRASAD DESARAJU
IPC: H01L21/78
Filed: 2018-01-17
Abstract: 1 co 00 O O (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 26 July 2018 (26.07.2018) WIP0 I PCT omit VIII °nolo moim oimIE (10) International Publication Number WO 2018/136484 Al (51) International Patent Classification: H01L 21/56 (2006.01) H01L 21/78 (2006.01) H01L 21/324 (2006.01) H01L 21/02 (2006.01) (21) International Application Number: PCT/US2018/014000 (22) International Filing Date: 17 January 2018 (17.01.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/448,177 19 January 2017 (19.01.2017) US 15/849,988 21 December 2017 (21.12.2017) US (71) Applicant: HONEYWELL INTERNATIONAL INC. [US/US]; Intellectual Property-Patent Services, 115 Tabor Road, M/S 4D3, P.O. Box 377, Morris Plains, New Jersey 07950 (US). (72) Inventors: VARAPRASAD, Desaraju; Honeywell Inter- national Inc., Intellectual Property-Patent Services, 115 Ta- bor Road, M/S 4D3, P.O. Box 377, Morris Plains, New Jer- sey 07950 (US). KATSANES, Ronald R.; Honeywell In- ternational Inc., Intellectual Property-Patent Services, 115 Tabor Road, M/S 4D3, P.O. Box 377, Morris Plains, New Jersey 07950 (US). (74) Agent: CONNER, Jeffrey et al.; Honeywell International Inc., Intellectual Property-Patent Services, 115 Tabor Road, M/S 4D3, P.O. Box 377, Morris Plains, New Jersey 07950 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, (54) Title: REMOVABLE TEMPORARY PROTECTIVE LAYERS FOR USE IN SEMICONDUCTOR MANUFACTURING FIG. 3 (57) : A method for temporarily protecting a semiconductor device wafer during processing includes preparing a solution including poly(vinyl alcohol) and water, coating the device wafer with the prepared solution, baking the coated device wafer to form a protective layer, processing the baked device wafer, and dissolving the protective layer from the processed wafer with a solvent at a temperature not less than 65°C. The solvent includes water. The baking is at a temperature from 150°C to 170°C. The protective layer remains on the baked device wafer during processing. The poly(vinyl alcohol) has a degree of hydrolysis greater than or equal to 93%. [Continued on next page] WO 2018/136484 Al MIDEDIMOMOIDEIREEMOMMIMINIUMOHMEHOIMI SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))