Patent TW-200415720-A (TW)
Title: Cleaning sheet and method of cleaning substrate processing equipment
Inventor: TERADA YOSHIO
IPC: B08B7/00
Filed: 2003-11-25
Abstract: An aim of the invention is to provide a cleaning member which causes no contamination of a substrate processing equipment by ionic impurities in the removal of foreign matters attached to the interior of the equipment through cleaning by the conveyance thereof into the equipment, a cleaning member which causes little contamination of a substrate processing equipment by metal impurities attributed to a protective film in the removal of foreign matters attached to the interior of the equipment through cleaning by the conveyance thereof into the equipment and a cleaning member which causes no contamination of a substrate processing equipment by metal impurities in the removal of foreign matters attached to the interior of the equipment through cleaning by the conveyance thereof into the equipment. The means for solving the aims of the invention concerns a cleaning sheet comprising a cleaning layer provided on one side of a base material, from which cleaning layer F<SP>-</SP>, Cl<SP>-</SP>, Br<SP>-</SP>, NO2<SP>-</SP>, NO3<SP>-</SP>, PO4<SP>3-</SP>, SO4<SP>2-</SP>, Na<SP>+</SP>, NH4<SP>+</SP> and K<SP>+</SP> are extractable with pure water each in an amount of not greater than 20 ppm (as extracted under boiling at 120 DEG C for 1 hour), and a pressure-sensitive adhesive layer provided on the other, a carrying material with cleaning capacity comprising the aforementioned cleaning sheet laminated on a carrying material with a pressure-sensitive adhesive layer and a method for cleaning a substrate processing equipment which comprises conveying the aforementioned carrying material with cleaning capacity into the substrate processing equipment; a cleaning sheet comprising a releasable protective film laminated on a cleaning layer, wherein the protective film is formed by a material from which metal elements such as Na, K, Ca, Mg, Al, Ti, Cr, Mn, Fe, Co, Ni, Cu and Zn or compounds thereof are transferred to a silicon wafer each in an amount of not greater than 1×10<SP>12</SP> atoms/cm<SP>2</SP> as calculated in terms of metal element when the protective film is brought into contact with (the mirror surface of) the silicon wafer at 23 DEG C for 1 minute, a carrying material with cleaning capacity comprising the aforementioned cleaning sheet laminated on a carrying material with a pressure-sensitive adhesive layer and a method for cleaning a substrate processing equipment which comprises conveying the aforementioned carrying material with cleaning capacity into the substrate processing equipment with the releasable protective film peeled off the cleaning layer; and a cleaning sheet comprising a cleaning layer provided on one side of a base material, which cleaning layer containing metal elements such as Na, K, Mg, Al, Ca, Ti, Cr, Mn, Fe, Co, Ni, Cu and Zn or compounds thereof each in an amount of not greater than 5 ppm (μ g/g) as calculated in terms of metal element, and a pressure-sensitive adhesive layer provided on the other, a carrying material with cleaning capacity comprising the aforementioned cleaning sheet laminated on a carrying material with a pressure-sensitive adhesive layer and a method for cleaning a substrate processing equipment which comprises conveying the aforementioned carrying material with cleaning capacity into the substrate processing equipment.