baber/WOPTO huggingface dataset:
Patent JP-H02129775-A (JP)
Title: Differential circuit
Inventor: SAKANO RYUICHI
IPC: H03H11/04
Filed: 1988-11-10
Abstract: PURPOSE:To accurately set up differential constants and to switch the differential constants without being influenced by an external noise signal by using two conductive transistors(TRs) and constituting the switching of the differential constants without using a switching element. CONSTITUTION:When a signal is inputted to a differential constant switching signal input terminal SIN, a connecting means connect a 1st conductive TR Q12 and the input signal inputted to the base of the TR Q12 is outputted to the 1st external terminal PT1 through the TR Q12. On the other hand, the terminal PT1 is connected to an output signal output terminal OUT1 and the input signal is differentiated in accordance with the differential constants of external differential constant setting elements C2, R connected to the terminal PT1 and outputted. When a differential constant switching signal with a 2nd level is similarly inputted to the terminal SIN, the connecting means connects a 2nd conductive TR Q19. Consequently, the connection can be switched to one of the differential constant setting elements C1, C2 to set up the differential constant.
Patent JP-H05127489-A (JP)
Title: Image forming device
Inventor: MASUDA KATSUMI
IPC: G03G15/02
Filed: 1991-10-30
Abstract: PURPOSE:To securely prevent a damage to a photosensitive body, which is caused by a nerroneously inserted corona discharger. CONSTITUTION:The guide rail 8 of a transfer charger 7 is supported by the main body of an image forming case via four connecting rods 9. By means of the connecting rods 9, the guide rail 8 can move between the operation position where the guide rail is close to the photosensitive body 5 and the separation position where it is separated from the photosensitive body 5. The guide rail 8 is provided with a stop means 10 for once stopping the transfer charger 7 inserted downstream in the direction in which the transfer charger 7 is inserted. When being inserted along the rail 8, the transfer charger 7 is guided by the rail and abuts on the abutment part 11a of a stop member 11 so that it is stopped once. When the transfer charger 7 is moved, after being stopped, in the direction in which the transfer charger 7 is inserted, the connecting rods 9 turn, and for the first time the transfer charger 7 is moved together with the guide rail 8 in the operation position where it is close to the photosensitive body.
Patent JP-2001106422-A (JP)
Title: Feeder for adhesive tape
Inventor: UENO AKIO
IPC: B65H35/07
Filed: 1999-10-06
Abstract: PROBLEM TO BE SOLVED: To provide a feeder for adhesive tape allowing to adhere lead sheet to an adhesive face at both ends of the adhesive tape and select whether or not to adhere the lead sheet to the adhesive face. SOLUTION: This feeder for the adhesive tape is provided with a tape holding part 1 for holding the wound adhesive tape 8 and a cutting part 2 placed near the tape holding part 1 and comprising a cutting edge capable of cutting the rewound adhesive tape 8. A sheet feeding part 4 for feeding the lead sheet 3 is provided on an adhering surface at a position to be cut of the adhesive tape 8, and the cutting part 2 cuts the lead sheet 3 when cutting the adhesive tape 8.
Patent JP-H11118052-A (JP)
Title: Flow control valve
Inventor: MASE MASATAKA
IPC: F16K25/00
Filed: 1997-10-17
Abstract: PROBLEM TO BE SOLVED: To provide a flow control valve having reduced vibration and noise and high durability by providing flexibility to a plug and easily bringing the tip of the plug into contact with a valve hole. SOLUTION: In a flow control valve provided with a plug 1 to be fitted in a valve hole provided in a cylindrical cage provided with a passage hole for allowing fluid to flow so as to be reciprocated and slid, and for changing the opening of the passage hole, a plurality of slits 9 are circumferentially provided on the tip of the plug 1 along the axial direction, a projecting part 10 having the diameter equal to or larger than the inside diameter of the valve hole of the cage is provided on the tip outer periphery of the plug 1, and the projecting part 10 is brought into contact with the inner peripheral surface of the valve hole of the cage in incorporating of the plug 1 to the cage.
Patent JP-H02130965-A (JP)
Title: Manufacture of semiconductor device
Inventor: MIZUKAMI HIROYUKI
IPC: H01L29/80
Filed: 1988-11-11
Abstract: PURPOSE:To provide an electrostatic induction transistor having a high factor of voltage amplification and low ON resistance by forming a semiconductor layer of a second conductivity type selectively on the surface of a semiconductor substrate of a first conductivity type by means of epitaxial growth such that the semiconductor layer takes the form of stripes or mesh. CONSTITUTION:A P<+> type epitaxial layer 1 is formed on a P<-> type silicon substrate 2 and silicon oxide films 10 are provided on the opposite faces of the substrate. The silicon film 10 on the top is patterned to provide a stripe mask 10. Then, an N<+> type layer 30 is epitaxially grown in the form of stripes through the mask 10. The mask 10 is then removed and a P<-> type epitaxial layer 4 is deposited such that the N<+> type layer 30 is buried therein. A P<+> type layer 5 is formed on the surface of the epitaxial layer 4. The surface of the layer 5 is oxidized to provide a mask and unrequired parts of the epitaxial layer 4 and P<+> type layer 5 are removed by using the mask so that electrodes 6, 7 and 8 are formed. In this manner, it is possible to obtain an electrostatic induction transistor having a high factor of voltage amplification and low ON resistance.
Patent JP-2000111283-A (JP)
Title: Manufacture of inclusion hydrate slurry
Inventor: MATSUMOTO SHIGENORI
IPC: F24F5/00
Filed: 1998-10-07
Abstract: PROBLEM TO BE SOLVED: To simplify a configuration and to increase a chill transportation density by storing a solution for generating an inclusion hydrate for cooling in a heat storage tank, installing an evaporator for composing a freezing device in the heat storage tank, and evaporating the refrigerant in the evaporator and cooling the solution, and allowing the inclusion hydrate slurry to adhere to the evaporator. SOLUTION: When a solution W is stored in a heat storage tank 1 and a freezing device 4 is operated, a high-temperature high-pressure refrigerant being compressed by a compressor 6 is condensed by a condenser 7 and becomes a liquefied refrigerant. Also, the liquefied refrigerant is guided to an inflation valve 9 through a liquid receiver 8 while pressure is reduced and is guided to an evaporator 5. Further, since the refrigerant absorbs heat around a copper pipe 5a and evaporates, the solution W in the heat storage tank 1 is cooled, an inclusion hydrate is generated and adheres to the surface of the copper pipe 5a, and a solid where it is peeled off is dispersed into the solution and becomes an inclusion hydrate slurry W1 in sherbet shape.  In this manner, by a heat storage medium for easily generating the inclusion hydrate even under an atmospheric pressure, earth environmental problems such as ozone destruction can be solved.
Patent JP-H01272129-A (JP)
Title: Feeling method of protective film
Inventor: AMETANI MINORU
IPC: B65H29/54
Filed: 1988-11-10
Abstract: PURPOSE:To prevent the possibility of damage to a wafer by a method wherein an adhesive tape is contact-bonded onto the rear end of a protective film on the wafer by a sticking roller, the sticking roller is floated and moved forward, a peeling unit is shifted from a rear section to a front section and a protective film is peeled from the wafer together with a sticking tape. CONSTITUTION:When a wafer 8 is placed onto a table 3, the wafer 8 is sucked by a vacuum suction means and fixed onto the table 3, and the wafer 8 is brought near to an adhesive tape 20 on the lower side of a sticking roller 23, and the adhesive tape 20 is bonded with the top face of the rear end of a protective film 9 on the wafer 8 when a sticking unit 21 is lowered and begins to be forward moved. When the sticking unit 21 is lifted slightly and forward shifted gradually, the pushing of the adhesive tape 20 by the sticking roller 23 is released, and the tape 20 is peeled together with the protective film 9 when a peeling unit 22 begins to be moved.
Patent JP-2001105564-A (JP)
Title: Method and apparatus for manufacturing printed product, and method for manufacturing electric device
Inventor: FUKUCHI YOSHIHARU
IPC: B41F15/40
Filed: 1999-10-06
Abstract: PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a printed product capable of immediately printing a printed board with a solder paste of predetermined specifications when restarted even by stopping a printer for printing the board with the paste and an electric device using the printer. SOLUTION: When a time from restarting to print after finishing printing is a predetermined time or more in the case of restarting printing after the printing is finished in a state in which a solder paste 1 is left to stand on a metal mask 4 for, squeegees 8, 9 are reciprocated to a restarted first printed board 2.
Patent JP-H04160259-A (JP)
Title: Connecting mechanism between screw shaft-nut mechanism and slider-guide mechanism
Inventor: SAWADA KIYOSHI
IPC: B23Q5/44
Filed: 1990-10-25
Abstract: PURPOSE:To make a slider carry out a highly accurate linear movement by making a screw shaft-nut mechanism fluctuatable freely around a pivot installed rotatably to the slider around the central axis as the center, as the axis through a linking member, while moving along the screw axis parallel to the guide rail. CONSTITUTION:A slider 10 can be moved linearly along a guide rail 16, and a screw shaft 12 is regulated to be parallel to the guide rail 16. At the peripheral surface of a nut 14 screwed to the outer surface of the screw shaft 12, a spiral groove 32 is provided, and a tube member 24 is welded and fixed to the outer side. A pivot pin 28 is inserted to the hole 27 of a linking member 26 welded and fixed to the outer side of the tube member 24, and tapers 28a and 28b at both ends of the pivot pin 28 are set to pivot seat members 30a and 30b respectively. By rotating a rod 22 with screw which connects ring members 18a and 18b to approach or separate the ring members 18a and 18b each other, the holding condition of the tapers 28a and 28b at both ends of the pivot pin 28 to the pivot seat members 30a and 30b is adjusted.
Patent JP-H08142408-A (JP)
Title: Printer
Inventor: NISHIJIMA KATSUMI
IPC: B41J2/36
Filed: 1994-11-21
Abstract: PURPOSE: To find the bit density related to the black pixels in printing data by dispensing with the transfer of printing data from a printing buffer region and reducing the load of a CPU. CONSTITUTION: A printer is equipped with a CPU 11, a memory 14 having a printing buffer region in which printing data is written, a printing part 17 outputting the written printing data to the printing buffer region, region specifying means 19, 20 wherein the address of the printing buffer region is specified by the CPU 11, detection means 21, 22 detecting the access operation to the printing buffer region of the specified address and an addition means 24 adding the number of bits showing black pixels in the printing data written in the printing buffer region at the time of the detected access operation. By this constitution, only by writing the printing data on the printing buffer region in the memory 14, the bit density capable of being contained in the printing buffer region can be formed.
Patent JP-2001111585-A (JP)
Title: Device and method for information processing and network system
Inventor: NAGASHIMA TAKAYUKI
IPC: H04L12/437
Filed: 1999-10-06
Abstract: PROBLEM TO BE SOLVED: To provide an information processing method, an information processor and a network which can easily and also efficiently perform network management. SOLUTION: Information, showing that a node device is newly added between node devices 203 and 204, is inputted to node devices 202 and 203. Thus, the devices 202 and 203 control a switch 141 so as not to use transmission paths 208 and 209. A node device 705 is connected between the devices 202 and 204. A rewrite message of a storage address in a header detecting part 502 and new address information are sent to node-managing parts 144 of the devices 202 and 203, a registration message of the storage address in the part 502 and the new address information are sent to the node-managing part 144 of the device 705, and a switching message to a mode, in which operation is performed with a normal control pattern is sent to the parts 44 of the devices 202, 203 and 705. The devices 202 and 203 resume operations with the normal control pattern, to complete the addition of the node device.
Patent JP-H11105974-A (JP)
Title: Device for improving powder-grain introducing property and apparatus equipped with the same
Inventor: KUTSUZAWA KICHIYA
IPC: B65D88/28
Filed: 1997-10-02
Abstract: PROBLEM TO BE SOLVED: To improve powder-grain introduction, by reducing speed at which powder- grain are introduced into a device or by dispersing the flow of the powder-grain. SOLUTION: A device 1 for improving powder-grain introducing property is provided with a support part 2 of a flat plate, and parts thereof near the center are bendingly projected in one direction at an angle smaller than 85 deg. to form vane-like projecting faces 3. The vane-like projecting faces 3 are formed so that the front end of at least one vane-like projecting face 3 does not come into contact with the other vane-like projecting face 3. The angle of each vane-like projecting face 3 is preferably in the range of the repose angle of to-be-introduced powder-grain to 60 deg., and it is selected according to behavior represented by the repose angle of powder-grain to be used. Further the angle can appropriately be selected according to the number of vane-like projecting faces 3, their shapes, sizes and the like.  The forms of the vane-like projecting faces 3 are not limited in particular so long as they are buffering means for reducing speed at which they are introduced or causing the flow of powder-grain to scatter, the number of them is preferably about 1-6. In the structure, an operation rate can be improved without causing blockage.
Patent JP-H02133783-A (JP)
Title: Door opening or closing device
Inventor: SUGIMOTO KAZUO
IPC: F25D23/02
Filed: 1988-11-11
Abstract: PURPOSE:To enable a door to be opened from inside the door and prevent the door from being removed erroneously from a main body by a method wherein a pair of stoppers are arranged at both right and left sides of a fixing plate in such a way as they may be freely extended or retracted and a pair of slide contacting members for extending or retracting each of the stoppers are arranged in sliding contact with each of the stoppers or spaced-apart from each of the stoppers. CONSTITUTION:A pair of stoppers 14a, 14b extended or retracted in response to an engagement or disengagement of each of hinge pins 2a, 2b for each of engaging grooves 4a, 4b and for restricting or allowing a rotation of each of latch plates 7a, 7b in an opposite direction of a restricting or a releasing direction are provided, so that under a condition in which a door is kept open, i.e. one hinge 2a (2b) is released from its corresponding engaging groove 4a (4b), one stopper 14a (14b) may restrict a rotation of a corresponding latch plate 7a (7b) opposite to a restriction releasing direction, thereby a rotation of the other latch plate 7b (7b) in a restriction releasing direction is limited. With this arrangement, it is possible to prevent the other hinge pin 2b (2b) from being out of the outer engaging groove 4b (4a), that is, the door from being removed from the main body.
Patent JP-H04162462-A (JP)
Title: Semiconductor device improved in moisture resistance and head dissipation and manufacture thereof
Inventor: KAMEYAMA MASAO
IPC: H01L23/50
Filed: 1990-10-24
Abstract: PURPOSE:To effectively prevent invasion of moisture and to effectively externally dissipate heat generated by an operation by forming a tab made of a predetermined material at a semiconductor chip bonded part of a box-shaped resin molded form. CONSTITUTION:A tab 3 prevents external invasion of moisture and externally dissipates heat stored therein. As the tab 3,, a vapor impermeable platelike body and particularly a platelike body made of metal such as aluminum, copper, iron or oxides thereof, which have thermal conductivity of 0.01cal/cm.sec. deg.C or more thereby not only to improve moisture resistance but also to effectively dissipate heat generated from a semiconductor chip out of a package. A chip bonded part 4 secures the chip. In this semiconductor device, a semiconductor element 7 is secured to the tab 3 of the part 4 of a box-shaped resin molded foot 1, the element and a lead frame 2 are coupled via a bonding wire 6, and then a cover material 8 is adhered to a cover adhered part 5 of the form via epoxy, imide or acryl adhesive.
Patent JP-H03255662-A (JP)
Title: Semiconductor memory device
Inventor: KUBOTA HIDEKO
IPC: H01L27/10
Filed: 1990-10-24
Abstract: PURPOSE:To form a semiconductor memory device into a structure whose breakdown voltage is independent of the polarity of the impressed voltage, to enable it to be connected in a circuit without taking its polarity into consideration, and to lessen it in dispersion of resistance after a data write operation is finished by a method wherein two pairs of non-fusion memory elements reverse in characteristics are connected. CONSTITUTION:Non-fusion memory elements 10 and 20 are formed, a first connection A of the non-fusion memory element 10 and a second connection B' of the non-fusion memory element 20 are connected to an Al electrode wiring 6a, and a second connection B' of the non-fusion memory element 10 and a first connection A of the non-fusion memory element 20 are connected to an Al electrode wiring 6b. As voltages impressed on the non-fusion memory elements 10 and 20 are opposite in polarity without fail, in accordance with the programmed voltage of either of the non-fusion memory elements notwithstanding the polarity of the impressed voltage, a dielectric breakdown occurs in an amorphous silicon layer 12 or an amorphous silicon layer 22, and a conductivity increases and a write operation is finished.
Patent JP-H02132569-A (JP)
Title: Pattern recognizing method applying degree of superposition
Inventor: TANIMORI MASAYUKI
IPC: G06T7/00
Filed: 1988-11-11
Abstract: PURPOSE:To simplify an entire process for a pattern recognition by disconnecting and connecting the lines of the plural input closed patterns with the note given to only the apexes and intersections of the closed patterns. CONSTITUTION:A closed pattern to be processed is inputted to an input tablet 1 via a stylus pen 2, etc., and a processor 3 applies a logical arithmetic process to the pattern. In other words, the apexes and intersecting points formed by plural component lines of the closed pattern are recognized. Then these lines are disconnected and connected by noting only these apexes and intersections and based on the prescribed conditions. Then the data on each new line is recognized in a list structure. Furthermore a start line is selected to designate a degree of superposition and the combinations of the component lines connected to the start line are extracted. Thus the patterns are outputted in accordance with each of degrees of superposition decided by the line combinations. Thus it is possible to simplify a process where the patterns are recognized by the degrees of superposition.
Patent JP-H10128441-A (JP)
Title: Method for winding steel strip
Inventor: SAIKI JUNICHI
IPC: B21C51/00
Filed: 1996-10-29
Abstract: PROBLEM TO BE SOLVED: To improve the productivity by judging without generating top mark flaw when a specific formula is realized using each weight function in a time of winding a steel strip with using a stepped sleeve. SOLUTION: Whether top mark flaws generating in the longitudinal direction of a coil is lain or not is judged automatically by calculating the weight function contained based each data of the displacing amount of the top end part of a steel strip to the top end part of the step difference part of a stepped sleeve, the thickness of the steel strip and the width, the kind of steel, the tension value of a belt of a belt rapper, and the value of outside diameter of a mandrel. When the next formula is realized in the time of calculating each weight function, the judgment is made that the top mark flaw is not generated.  The equation is G1 ×G2 ×G3 ×G4 ×G5 ×6 >UL, In here, G1 : the weight function of the amount of the displacement of the top end position G2 : the weight function of the thickness of the sheet, G3 : the weight function of the width of the sheet, G4 : the weight function of the steel kind, G5 : the weight function of the tension value, G6 : the weight function of the outside diameter value and UL: the lower limit value.
Patent JP-H10233319-A (JP)
Title: Oil filled electromagnetic apparatus
Inventor: TSUJI HIROSHI
IPC: H01F27/14
Filed: 1996-10-29
Abstract: PROBLEM TO BE SOLVED: To provide an economical oil filled electromagnetic apparatus by simplifying and downsizing it. SOLUTION: An oil filled electromagnetic apparatus is provided with an iron core 2, a coil 1 wound around the iron core 2, a tank 5 which contains the iron core 2 and the coil 1 and is filled with insulating oil, a conservator 10 for absorbing the change in volume of the insulating oil caused by the temperature change through a connecting tube 11. A bushing 3 provided with terminals for connecting to outer electrical paths is fixed on the conservator 10. A connecting conductor 4 for connection between the coil 1 and the bushing 3 passes through the inside of the connecting tube 11 which is connected between the conservator 10 and the tank 5.
Patent JP-H01128521-A (JP)
Title: Ion implantation
Inventor: NAGAYASU YOSHIHIKO
IPC: H01L29/72
Filed: 1987-11-13
Abstract: PURPOSE:To precisely and easily control the depth of an outside layer without misregistration of the outside layer and the inside layer by ion-implanting impurities giving prescribed electrically conductive form on the surface of a semiconductor through a second ion implantation in which a second impurity ion is implanted in shallower and higher peak concentration than a first ion implantation. CONSTITUTION:A mask 5 attached to the surface of a semiconductor is commonly used in a first ion-implantation process and a second ion-implantation process, and both the ion-implantation process is continuously performed without inserting heat treatment and the like between the first ion-implantation process and the second ion-implantation process. This peak concentration Np2 is higher than that Np1 of the first ion-implantation process, for example, ion-implantation is X10<21>atom/cm<3> and ion-implantation depth X2 is shallower than the first ion-implantation depth X1, for example, 0.13mum. Therefore, misregistration of an outside layer 12 and an inside layer 22 is not produced. Further, since the depth of the outside layer 12 is determined in a heat treatment process, the depth of the outside layer 12 can be controlled precisely.