baber/WOPTO huggingface dataset:
Patent JP-H01132544-A (JP)
Title: Production of 4-biphenylacetic acid
Inventor: ISOGAI YOSHIO
IPC: C07C51/12
Filed: 1987-11-18
Abstract: PURPOSE:To obtain the title compound for analgesic and antiphlogistic agent or raw material therefor in good yield, by reacting 4-biphenylmethanol obtained by hydrogenation of 4-biphenylmethanol readily available with CO in the presence of a specific Ni-P-I or Br based catalyst. CONSTITUTION:4-Biphenylaldehyde is hydrogenated to afford 4-biphenyl- methanol, which is then reacted with carbon monoxide in the presence of a catalyst consisting of a nickel compound, phosphine, iodine compound or brominated compound (e.g. catalyst consisting of dicarbonylbistriphenylphosphine nickel or methyl iodide) to provide the 4-biphenylacetic acid. 4-Biphenyl-aldehyde which is a raw material is readily obtained from reaction of biphenyl with carbon monoxide in the presence of a strong acid catalyst. 4-Biphenylacetic acid has excellent percutaneous absorption and is useful also as a raw material for hexylester, etc., having analgesic and antiphlogistic action. The above- mentioned method can be carried out without using expensive noble metal.
Patent JP-S63142564-A (JP)
Title: Lid opening and closing mechanism
Inventor: ANDO SHIGERU
IPC: G11B33/02
Filed: 1986-12-04
Abstract: PURPOSE:To prevent the double insertion of recording medium and also to reduce the size of a device by sliding a 2nd lid orthogonally against the insertion way and closing the insertion opening at the recording and reproduction time. CONSTITUTION:An axis 820 inside the insertion opening 832 of a front panel 810 is provided with a 1st lid 804 freely turnably. On the other hand, a pin 812 of the main body is arranged to be fitted freely turnably with a lever 802 and its long hole 828 is engaged with a 2nd lid 808 via a pin 824 and then the lever is energized counterclockwise by a spring 816. Now, when a magnetic sheet pack 10 is inserted, the 1st lid 804 is opened and the lever 802 is revolved to the left so that the 2nd lid 808 closes the insertion opening 832, thus preventing the double insertion of the recording medium at the recording and reproducing time. Furthermore, since the lid 808 is slid at right angles against the insertion direction, the space is saved and the size of the device is hence minimized.
Patent JP-2001108865-A (JP)
Title: Optical connector assembling tool
Inventor: SHIINO MASAHITO
IPC: G02B6/36
Filed: 1999-10-12
Abstract: PROBLEM TO BE SOLVED: To facilitate the attachment of a guide pin to a dummy ferrule. SOLUTION: This optical connector assembling tool is provided with a ferrule holder 2 which holds a ferrule 1 of an optical connector and a guide pin fixing jig 3 which faces the ferrule holder 2 and can slide back and forth. When the guide pin 5 is inserted into the inserting hole 4 of the guide pin fixing jig 3 so that one end of the guide pin 5 projects toward the ferrule holder 2 side, the guide pin 5 is passed through the through hole 7 of the dummy ferrule 6 and the guide pin fixing jig 3 is slid toward the ferrule holder 2 side, a guide pin projection part 9 projecting from the end surface 8 of the dummy ferrule 6 is inserted into the guide hole 10 of the ferrule 1. When the guide pin fixing jig 3 is inversely slid, the guide pin projection part 9 is drawn out of the guide hole 10 of the ferrule 1.
Patent JP-H07120235-A (JP)
Title: Hot size-measurement device for shape steel
Inventor: OHIRA NOBORU
IPC: G01J5/00
Filed: 1993-10-25
Abstract: PURPOSE:To improve the examination precision by performing thermal expansion correction reflecting average internal temperature for each section obtained from the surface temperature for each section of a shape steel, difference in cooling speed due to thickness, etc. CONSTITUTION:From the position of two-axis stage mechanisms 13 and 14, measurement values of laser displacement meters 72 and 73, etc., a data processing means 16 obtains the hot size value of an H-shape steel 11. Since this value does not agree with cold value due to thermal expansion, surface temperature at each section is measured by a radiation thermometers 49 provided to measurement devices 42 and 43, and then operated (16) for more accurate cold size value. For example, the measurement devices 42 and 43 are respectively lifted/lowered to be arranged at the level of internal quarter part of a flange part 90, so that the axis center of round holes 57 and temperature measurement holes 63 of respective measurement devices is made vertical to the internal surface of flange part 90. Then while lifting/lowering the measurement devices, the temperature at the quarter part is measured by the thermometer 49. A means 16, based on measurement point Xi and surface temperature measured Ti, obtains average internal temperature T'i for each section, and according to the expansion factor with respect to this, converts it into cold length for each section, and the cold size of the steel 11 is calculated from the sum.
Patent JP-H03205381-A (JP)
Title: Mutual electric joining of ceramic hollow part material
Inventor: OKUDA KOJI
IPC: C04B37/00
Filed: 1990-10-26
Abstract: PURPOSE:To electrically join at a low electric voltage and reduce a cost of an equipment and to improve safety by providing an inner electroconductive part material at an opposing part between hollow part materials other than an outer electroconductive part material and successively switching an electric conduction between the both part materials. CONSTITUTION:For instance, a cementing material 2 is applied on opposing faces of electroconductive ceramics 1a and 1b and the both are superposed, then held by keeping tools 3a and 3b. Next, carbon paste is applied on respective outer and inner sides of opposing parts of respective four outer electroconductive part materials 5c-5f and an inner electroconductive part material 41 having a disk-like shape, thus the applied parts are brought into contact with each other. In said process, the outer electroconductive part material is fixed and the part materials 5c and 5d are arranged almost perpendicular to each other, then the part materials 5c and 5e, and 5d and 5f are respectively arranged in opposing. Thus, an electric conduction between the part material 41 and the part materials 5e-5f is successively switched and an electric conducting region in the ceramics 1a and 1b or the cementing material 2 is transferred to a direction of peripheries of the opposing parts, then whole of the opposing parts is heated and joined.
Patent JP-S62149188-A (JP)
Inventor: NODA TAKAMITSU
IPC: H05K1/02
Filed: 1985-12-23
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-2000123476-A (JP)
Title: Data transmitting/receiving device
Inventor: KONDO TOSHIYUKI
IPC: G10K15/04
Filed: 1998-10-13
Abstract: PROBLEM TO BE SOLVED: To provide a data transmitting/receiving device which can perform reading/writing of managing information, synchronism-reproduction of plural contents, and the like with less throughput, when the managing information of AV data recorded in a recording medium and its attached data are externally accessed. SOLUTION: An audio list 201 is constituted of a pointer 222 for a title, a pointer 223 for text file information, and the like. Link information for a first object 233 of a title list 231 is described in the pointer 222 for a title. Also, link information for a first object 253 of a text file list 251 is described in the pointer 223 for text file information.
Patent JP-2001107354-A (JP)
Title: Ground agitating device
Inventor: MURAMOTO KATSUMI
IPC: E02D3/12
Filed: 1999-10-13
Abstract: PROBLEM TO BE SOLVED: To provide a ground agitating device capable of simplifying the device and capable of reducing weight by projecting/housing an agitating blade with simple constitution. SOLUTION: This ground agitating device is provided with an inner for excavating the ground and a cylindrical outer arranged by surrounding this inner, and an agitating blade expanding by resistance of the ground in a plane orthogonal to the axis of the outer at reversely rotating time and being housed by resistance of the ground at normally rotating time is arranged on a tip part side wall of the outer.
Patent JP-S63143050-A (JP)
Inventor: YODA KIYOSHI
IPC: A61B10/00
Filed: 1986-12-05
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H04164670-A (JP)
Title: Printer device
Inventor: KOMIYA KEISUKE
IPC: B41J21/16
Filed: 1990-10-30
Abstract: PURPOSE:To prevent the setting of wrong paper by a method wherein when document name data is added to a data stream of printing data to be transmitted from a computer to a printer device, the document name data is fetched from a reception data buffer and displayed. CONSTITUTION:Document name data 17 is added to printing data 14 in an output symbiont file 12 to be transmitted from 2 computer 11 to an interface control part 1. The data 14, 17 are received by a data reception part 2 and stored in a printing data buffer 3. When receiving the document name data 17, a printing control part 4 transmits the data 17 to a document name edition part 15. The data is edited in a visually recognizable format and displayed on a document name display 16. On the other hand, when detecting the completion of reception in accordance with the date reception part 2, the printing control part 4 conducts 2 document printing while controlling a printing head drive part 5 and a paper drive part 7 so that a printing head is driven by a lateral servo motor 6 and paper is fed by 2 vertical servo motor 8. A paper detection part 9 displays 2 paper setting instruction on a paper setting display part 10 when detecting the unsetting of paper in accordance with the paper feed part 7.
Patent JP-2000124465-A (JP)
Title: Manufacture of semiconductor dynamical amount sensor
Inventor: TERADA MASAKAZU
IPC: G01P15/12
Filed: 1998-10-13
Abstract: PROBLEM TO BE SOLVED: To prevent current leak from a junction interface between a P-layer and an N-layer which are exposed in a side wall of a trench or a vertical hole when electrochemically etching a semiconductor board from a trench, or a vertical hole part formed in a wafer with an N-type epitaxial layer on a P-type semiconductor board in a manufacturing method of a semiconductor pressure sensor. SOLUTION: After a surface of an N-type epitaxial layer 12 of a wafer 20 is covered with a first oxide film 13 and a formation region of a vertical hole 16 is removed, the vertical hole 16 is formed by RIE by using the first oxide film 13 as a mask. Then, after a second oxide film 21 is formed in a surface of the first oxide film 13 and an inner surface of the vertical hole 16, RIE is performed in a direction vertical to a plane of the wafer 20, a first oxide film 13 is left in a surface of the N-type epitaxial layer 12, and a second oxide film 17 is made to remain in a side wall surface of the vertical hole 16. Succeedingly, electrochemical etching is carried out by using both the oxide films 13, 17 as a protection film, and a cavity part 14 is formed inside a P-type semiconductor board 11 from a bottom part of the vertical hole 16.
Patent JP-H02137197-A (JP)
Title: Interface device
Inventor: TORIKAI KAZUYA
IPC: G11C17/00
Filed: 1988-11-17
Abstract: PURPOSE:To attain exact data transfer by executing data error processing when data are transferred by a first data transfer means, which transfers file data in a computer to a ROM writer, and a second data transfer means to transfer ROM data to the computer. CONSTITUTION:A first transfer means 14 can execute the transmission and reception of the data between a computer 2 and a ROM writer 3 with responding to a writing command, with which the file data in the computer 2 are written to a ROM in the ROM writer 3, and transfers the file data to the ROM writer 3. A second data transfer means 15 can execute the transmission and reception of the data between the computer 2 and the ROM writer 3 with responding to the writing command, whith which the ROM data in the ROM writer 3 are written to a data file in the computer 2, and transfers the ROM data to the computer 2. When the data are transferred by the first and second data transfer means 14 and 15, a data error is detected and the error processing is executed. Thus, the exact transmission and reception can be executed.
Patent JP-H03156196-A (JP)
Title: Axial fan
Inventor: SHIMIZU TOMOSHI
IPC: F04D29/32
Filed: 1989-11-10
Abstract: PURPOSE:To prevent a plurality of axial fans piled in transportation from the positional deviation from each other, breakage and cracking by making the inner diameter of radius rib or auxiliary blade rib larger than or equal to the diameter of a cylindrical boss hub to protrude the ends of both ribs from the end face of the boss hub. CONSTITUTION:When cylindrical boss hubs 11 of respective axial fans 10... are piled on each other, since a radial rib 13 and auxiliary blade rib 14 are inclined to the end face of the boss hub 11, the end face guides both ribs 13, 14 to be easily overlaid on the end of boss hub 11 of the lower side fan 10. The inner diameters of the ribs 13, 14 are made larger than or equal to the diameter of the boss hub 11, while the ends of these ribs 13, 14 are protruded from the end face of the boss hub 11 by X, so that the ends of the radial rib 13 and auxiliary blade rib 14 of the upper side fan are fitted on the end of boss hub 11 of the lower side fan. When a plurality of axial fans 10... are thus piled sequentially, they are prevented from the positional deviation from each other, breakage and cracking in the transportation.
Patent JP-H10118733-A (JP)
Title: Form rolling flat die and rolling method
Inventor: SUMIYA MASARU
IPC: B21H5/00
Filed: 1996-10-15
Abstract: PROBLEM TO BE SOLVED: To provide a form rolling flat die and rolling method capable of precisely working the both side shapes of the rolling surface of a tooth profile or the like and the sork easily to collapse without using plural form rolling machines, plural dies and furthermore a long die. SOLUTION: About constant shaped rugged part 2 corresponding to the member to be worked are cyclically and successively provided in the longitudinal direction of the form rolling flat die 1, heights 4a, 4b, 4c connecting the maximum height of the rugged part from the die reference surface 3 are made to be the height of the rugged part, a finishing part 5 wherein heights 4a, 4b, 4c of the rugged part are constant is provided in the central part, regulating part 6a, 6b wherein heights 4a, 4b, 4c of the rugged part are gradually lowered toward the out side are provided in the both sides of the finishing part 5, the recess part 7a, 7b wherein heights 4a, 4b, 4c of the rugged part are lowered with a sharper slope than the regulating part 6a, 6b toward the out side are provided adjacent to respective regulating part 6a, 6b,  and the member to be worked is reciprocated and form rolled while gradually reducing the interval of a pair of dies 1 when the member to be worked positions in the recess part 7a, 7b.
Patent JP-H01132137-A (JP)
Title: Semiconductor device
Inventor: SHIMODA MASAKI
IPC: H01L21/8238
Filed: 1987-11-17
Abstract: PURPOSE:To obtain a highly reliable semiconductor device by electrically connecting the drain region of an N-channel transistor and the power supply potential with a high heat-resistant wiring material, thereby preventing the thermally destruction of the wiring material providing the electrical connection of the drain region of the N-channel transistor and the power supply potential. CONSTITUTION:In a semiconductor device having an N-channel transistor wherein a drain region 2a is connected to the power supply potential and its conduction is controlled by a input signal supplied to a gate 5a, the drain region 2a of the N-channel transistor and the power supply potential are electrically connected by a high heat-resistant wiring material 14. For instance, the high heat-resistant wiring material 14 is of polycrystalline silicon or polycrystalline silicide. Accordingly, even if a surge voltage generated externally of a semiconductor device is added to the power supply potential and applied to an N<+> type drain region 2a through a high heat-resistant wiring material 14 to cause breakdown and heat-generation in the connecting portion of the drain region 2a and the highly heat-resistance wiring material 14, the thermal destruction of the wiring material 14 is prevented.
Patent JP-H10231122-A (JP)
Title: Production of polycrystalline thin film, and production of oxide superconductor, and device for producing polycrystalline thin film
Inventor: IIJIMA YASUHIRO
IPC: H01B12/06
Filed: 1997-10-23
Abstract: PROBLEM TO BE SOLVED: To obtain a polycrystalline thin film capable of orientating the (c) axes of crystals at a right angle to the film-forming surface of a substrate and simultaneously arranging the (a) and (b) axes of crystal granules along a surface parallel to the film-forming surface, and excellent in crystal orientability, and to obtain an oxide superconductor provided with an oxide superconductive layer excellent in crystal orientability and high in critical electric current density. SOLUTION: In this method for forming a polycrystal thin film depositing particles generated from the target 36 on the substrate A and forming elements constituting a target 36 on a substrate when the particles constituting the target 36 are deposited on the substrate, ion beams generated from an ion source 39 are radiated in the oblique direction at an incidence angle of 50-60 degree based on the normal line H of the film-forming surface of the substrate A, and the temperature at the film-forming time is controlled to <=300 deg.C.
Patent JP-2000139902-A (JP)
Title: Local irradiation x-ray ct photographing method and its device
Inventor: ARAI YOSHINORI
IPC: A61B6/14
Filed: 1998-09-28
Abstract: PROBLEM TO BE SOLVED: To provide a local irradiation X-ray CT photographing method and its device in which reposed dose of X-ray is restrained and a photographing time is shortened to provide a tomographic image of a local portion of an object. SOLUTION: In a state of the rotation center 3a of a turning arm fixed to a central position Pa of a local portion P, an X-ray generator 1 locally radiates an X-ray cone beam 1a covering only the local portion P to be photographed, that is a part of an object, and simultaneously the turning arm is turned in an angle range according to a photographing condition. Thus, an X-ray projection image of the local portion P is created on a two-dimensional X-ray image sensor 2, such created X-ray projection image is calculated and processed, three-dimentional X-ray absorption coefficient distribution information of the local portion is taken out as image information, and any tomographic image of the local portion P is created.
Patent JP-H09134091-A (JP)
Title: Fixing device for continuous paper printer
Inventor: KAWASAKI KAZUHIKO
IPC: G03G15/20
Filed: 1995-11-10
Abstract: PROBLEM TO BE SOLVED: To prevent reduction in an effective printing speed and to reduce the size of an opening/closing mechanism and the cost by executing the opening/ closing operations of a heating roll and a backup roll, after transient stopping at a position just before the heating roll and a paper come into contact with each other. SOLUTION: When a printing start command is issued from a host device 16, a motor 15 is driven clockwise. When a sensor 27 for detecting the position just before the heating roll 9 and the paper come into contact with each other is turned on, a middle position is obtained and the driving of the motor 15 is transiently stopped. Then, the motor 15 is driven clockwise again and when the sensor 27 for detecting the contact state of the heating roll 9 with the paper 5 is turned on, the motor 15 is stopped. After that, the feeding of the paper is started to start, a printing operation. When printing is stopped, a printing stop command is issued from the host device and the motor 15 is driven counterclockwise.  When the middle position as the position just before the heating roll 9 and the paper 5 come into contact with each other is obtained, the sensor 27 is turned on to transiently stop the driving of the motor 15.
Patent JP-H04164304-A (JP)
Title: Chip part for electronic circuit
Inventor: HATAYA FUTOSHI
IPC: H05K1/18
Filed: 1990-10-29
Abstract: PURPOSE:To manufacture the title chip part in less stress concentration capable of avoiding any defective connection to a conductive paste and the electrical shortcircuit between electrodes by forming oblique electrodes in the chip part. CONSTITUTION:The title chip part is manufactured by forming and setting the electrodes 2 using an electrode forming conductive paste discharged onto both ends of the main body 1 from a rated volume discharging device. A wiring 4 is formed on a substrate 3 and after mounting said chip part through the intermediary of the conductive paste 5 printed on the wiring 4, the whole surface is coated with a sealing regin 6. Through these procedures, the chip part, when mounted, is structured in less stress concentration and relatively wide bonding area onto the wiring 4 of the substrate 3 furthermore, in intensive connection strength even if it is connected using a bit of conductive paste in the printing mode, etc., so that the connection in high reliability and resistant to the stress may be made.
Patent JP-H07143503-A (JP)
Title: Convergence corrector
Inventor: MUTO YASUAKI
IPC: H04N9/28
Filed: 1993-11-22
Abstract: PURPOSE:To provide a convergence corrector for multi-scan monitor so as to deal with various horizontal and vertical scanning frequencies and raster sizes. CONSTITUTION:Horizontal and vertical current waveforms are respectively converted into voltage signals by current detection circuits 1 and 2, and sawtooth waves are extracted. The phase delay of horizontal sawtooth wave is corrected by a phase control circuit 3, and that wave is turned to a parabolic wave by a multiplying circuit 7. Further, replacement circuits 9 and 10 are respectively operated to replace the horizontal flyback periods of the sawtooth wave and the parabolic wave with the peak values of waveforms and generate a basic waveform for convergence correction. On the other hand, the vertical sawtooth wave is transformed to a parabolic wave by a multiplying circuit 8. Thus, the generated horizontal and vertical sawtooth waves and horizontal and vertical parabolic waves are turned to an actual corrected waveform by a waveform synthesizing circuit 19 and outputted through an output amplifier circuit 20 to a convergence coil (CY).
Patent JP-S61154658-A (JP)
Inventor: HERUMUUTO RAIHIENBERUGAA
IPC: A61B17/22
Filed: 1985-12-23
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H03152406-A (JP)
Title: Inspecting method for pattern
Inventor: TAKAHASHI HIDEMI
IPC: G01B11/24
Filed: 1989-11-09
Abstract: PURPOSE:To reduce a false information and to enable high-speed execution of inspection by using as standard data and edge image in a permissible area wherein criteria of inspection are incorporated and by comparing it with an edge image of a board to be inspected. CONSTITUTION:First a good board 1 is set on a table 2 for fine adjustment. An image-sensing device 3 outputs an analog image signal of the board 1. This signal is binary-codes 4 and an edge is detected 5. An image of the edge thus detected is stored in a good-article storage circuit 6. Next, a board to be inspected is set on the table 2 in the same manner as the board 1. The image- sensing device 3 outputs an analog image signal of the board to be inspected, this signal is binary-coded 4, the edge is detected 4 and the image of the edge is formed. A defect detecting circuit 7 conducts dilation of the good-article image read out of the storage circuit 6, by a dilation circuit of the circuit 7, and prepares an edge image in a permissible area wherein permissible amounts are incorporated. The edge image of the board to be inspected and the edge image in the permissible area of the board 1 are compared with each other by a comparing circuit of the circuit 7, and when the edge is found in the permissible area of the edge, the board to be inspected is determined as a good article.