baber/WOPTO huggingface dataset:
Patent JP-2004261813-A (JP)
Title: Friction stir joining method
Inventor: SUNADA TOSHIHIDE
IPC: B23K20/12
Filed: 2003-01-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a friction stir joining method capable of easily joining a block body and a cylinder sleeve which constitute a cylinder block of an internal combustion engine.  <P>SOLUTION: A diameter reduced part 32, which has a tapered part 38 reduced in diameter in a tapered shape, is formed at the inner peripheral wall part of the cylinder sleeve 30a. A probe 54 of a tool 50 for the friction stir joining is inserted to the tapered part 38 at the diameter reduced part 32 of the cylinder sleeve 30a, which is inserted to a communicating hole part 18 of the block body 10. After that, the probe is moved so as to go around via the tapered part 38. Following it, the friction stir joining is performed mutually to the outer peripheral wall of a cylindrical body part 34a of the cylinder sleeve 30a and the inner peripheral wall part at a first annular notched part 14 in the communicating hole part 18.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004241401-A (JP)
Title: Light emitting diode lamp
Inventor: SUENAGA RYOMA
IPC: H01L23/48
Filed: 2003-02-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide a highly reliable light emitting diode lamp in which the cracking of a molding member is hardly generated while securing good heat dissipation by contriving the shape of a lead.  <P>SOLUTION: In the light emitting diode lamp comprising first and second lead electrodes 2 and 4, a light emitting diode chip 6 bonded to the end of the first lead electrode 2, and the molding member 10 for sealing the light emitting diode chip 6, when the first lead electrode 2 is divided into a lead 2a sealed with the molding member, a lead 2c becoming a joint to a substrate, and a heat dissipation lead 2b coupling them, the first lead electrode 2 is wider than the second lead electrode 4 at the heat dissipation lead 2b and has a through hole 3 extending from the sealed lead 2a to the heat dissipation lead 2b wherein the molding members 10 on both sides of the first lead electrode 2 are connected in the through hole 3.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004237754-A (JP)
Title: Spring bracket structure
Inventor: ENOMOTO MITSURU
IPC: B60G11/12
Filed: 2003-02-03
Abstract: <P>PROBLEM TO BE SOLVED: To reduce the cost due to the reduction of the number of parts by dispensing with a shackle by freely displacing and rotating a leaf spring in a longitudinal direction, and to achieve suitable assembly efficiency of the leaf spring.  <P>SOLUTION: A lower bracket 4 is attached on a lower end of right and left leg parts 1a of a bracket 1 capable of being attached on a chassis frame, and thereby a spring pin spacer 7 is fitted in a guiding groove 5 formed by a recessed part formed on the lower end of the leg part 1a and the lower bracket 4 so as to be slidable along the vehicle longitudinal direction. The leaf spring 9 is pivotally supported by a spring pin 8 fitted in the spring spacer 7 so as to extend to the vehicle width direction so that an eye part 9a formed on a vehicle rear side end part is positioned between the right and left leg parts 1a.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004209178-A (JP)
Title: Bat capable of being perfectly caught by fingers
Inventor: HASHIMOTO NAOJIRO
IPC: A63B59/58
Filed: 2003-01-02
Abstract: <P>PROBLEM TO BE SOLVED: To provide a bat capable of being perfectly caught by fingers even with a weak grip for a powerful swing and high-speed batting.  <P>SOLUTION: The grip of the bat is formed in a fishhook or L shape to be caught by fingers better than any other grip. In order to swing a bat fast for powerful batting, it is necessary to swing the bat while being relaxed at the shoulders. Relaxation, however, causes a weak grip so that the bat is pushed back at the instant when a ball hits it.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004243443-A (JP)
Title: Lapping device
Inventor: OGINO TAKASHI
IPC: B24B21/18
Filed: 2003-02-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide a lapping device which stably provides desired surface roughness of a workpiece even if the same portion of an abrasive surface of a lapping film is used for machining a plurality of times.  <P>SOLUTION: The lapping device has: a holding means for rotatably holding the workpiece W; the lapping film 1 formed of a thin substrate and abrasive grains attached to one surface of the same; at least two shoes 2a, 2b for pressing the abrasive surface of the lapping film 1 to the workpiece W; a take-up reel 6 for feeding the lapping film 1 during suspension of the machining; and a washing means arranged in a passage through which the lapping film 1 is fed, at a location between the two shoes 2a, 2b, for washing the abrasive surface of the lapping film 1.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004246131-A (JP)
Title: Riding simulation apparatus
Inventor: MAKUTA YOHEI
IPC: G09B9/058
Filed: 2003-02-14
Abstract: <P>PROBLEM TO BE SOLVED: To realize an operation feeling closer to gear changing in a real vehicle.  <P>SOLUTION: A riding simulation apparatus is provided with a clock generating means 150 including a steel ball 168 which is energized by a coiled spring 166 and a cover member 178 having a window part 176 which the steel ball 168 engages when a gear change pedal 18 is at a center position. When a gear change is made by operating the gear change pedal 18, the steel ball 168 engages the window part 176 again after coming out of the window part 176 to thereby generate a click sound and vibration like a gear change.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004253424-A (JP)
Title: Method and apparatus for manufacturing porous semiconductor layer
Inventor: INAKANAKA HIROSHI
IPC: H01L31/04
Filed: 2003-02-18
Abstract: <P>PROBLEM TO BE SOLVED: To make it possible to monitor a physical property by a nondestructive process for forming a porous semiconductor layer.  <P>SOLUTION: The porous semiconductor layer manufacturing apparatus comprises an anodization tub 1 which can supply a semiconductor substrate 2 as a treatment object and is filled with a medicine 4 of a prescribed composition; an electrode 5 which is arranged in the tub 1, and performs the anodization of the surface of the substrate 2 by applying a current and forms the porous semiconductor layer 3; a light projecting component 6 which is attached to the tub 1, and makes incidence of an optical beam; and a light-receiving component 7 which is attached to the tub 1 and receives an optical beam, thereby enabling optical monitoring of anodization. The light projecting component 6 is arranged at a position where the optical beam is incident on the porous semiconductor layer 3 on the substrate 2 supplied to the tub 1. The light-receiving component 7 is arranged at a position where an optical beam output from the porous semiconductor layer 3 is received.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004251689-A (JP)
Title: Three-phase induction motor insulation deterioration monitoring apparatus
Inventor: MOCHIZUKI KATSUHIKO
IPC: H02K17/30
Filed: 2003-02-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide an apparatus for greatly reducing inspection man-hours by automatically monitoring the insulation deterioration in a three-phase induction motor in a machine tool, or the like, and displaying the inspection result to the outside.  <P>SOLUTION: The apparatus for greatly reducing inspection man-hours comprises detection means 30, 40 for detecting on/off for indicating whether power is being fed to a motor M or not; measurement means 11b, 17 for measuring the insulation resistance of the motor M; a measurement control means 11a that applies an inspection voltage to winding to be measured from an inspection power supply 5, based on output from the inspection means 30, 40, when a switching circuit 20 for selecting the winding of the motor M to be measured and the detection means 30, 40 detect the off of the motor M, allows the measuring means 11b, 17 to measure the insulation resistance of the motor M, and allows the measurement to be made successively for each winding by controlling the switching circuit 20; a judgment means 11 for judging the degree of deterioration in the motor M by comparing the measured value of insulation resistance with a preset threshold; and a display means 41 for displaying the judgment result to the outside.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004250056-A (JP)
Title: Packaging vessel having closable opening device
Inventor: BENGTSSON ULF
IPC: B65D47/36
Filed: 2003-02-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a packaging vessel having a closable opening device capable of preventing the infiltration of a liquid content into a section of a vessel wall without the delamination of a laminate in an openable region.  <P>SOLUTION: In a packaging vessel for a liquid food having an openable region with an opening device including a frame, a cap and an opening-forming part. The frame comprises a flange and a spout. A first joint zone is formed between the bottom surface of the flange of the frame and the circumferential surface of the openable region around the openable region, and a second joint zone is formed on the upper surface of the openable region between the upper surface and the bottom surface of the opening forming part. An opening is broken in the openable region on the outer periphery of the second joint zone when the cap is unsealed.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004253294-A (JP)
Title: Dielectric thin film, thin film capacitor, and electronic circuitry component using it
Inventor: HOJO FUSAO
IPC: H01L27/04
Filed: 2003-02-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a dielectric thin film of high dielectric characteristics, wherein low-temperature formation is easy, and to provide a thin film capacitor and electronic circuit components using it.  <P>SOLUTION: A precursor solution in which paraelectric crystal particulates are dispersed in a metal oxide amorphous precursor having metal alkoxide, metal complex and/or metal carboxylate as a main raw material is applied on a substrate, and the thin film is formed by drying and calcining the solution.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004254531-A (JP)
Title: Top link-supporting member in movable farm machine
Inventor: WAKUTA TAKESHI
IPC: A01B59/043
Filed: 2003-02-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide an easily handleable top link-supporting member in a movable farm machine at a low cost.  <P>SOLUTION: The top link-supporting member 16 which is positioned and attached to the rear portion of the movable farm machine 1 through a bracket 17 on the machine frame side and to which a top link 13 for connecting and supporting the upper side of an implement 2 to be connected to the rear portion of the movable farm machine 1 is attached is formed by integrally molding an attaching portion 26 for being attached to the bracket 17 on the front end side, an opened supporting portion 27 for pivotally supporting the top link 13 on the rear end side, and a connection portion 28 for connecting the attaching portion 26 to the opened supporting portion 27.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004254858-A (JP)
Title: Shaver and tweezing device
Inventor: YAMAZAKI IWAO
IPC: B26B19/48
Filed: 2003-02-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a shaver a tweezing device mitigating damage to be caused on the skin during the shaving.  <P>SOLUTION: This shaver 100 and the tweezing device are provided with ultraviolet light sources 20 applying the ultraviolet light toward the skin before or after removing the hair by the shaver 100 or the tweezing device. The ultraviolet ray converts oxygen in the atmosphere into ozone, so that the skin before or after the hair removal is disinfected by the ozone. The shaving mechanism 40 and the tweezing mechanism can be also disinfected by the ozone, so that bacteria attached to the shaving mechanism or the tweezing mechanism can be prevented from moving to the skin.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004255774-A (JP)
Title: Conductive composite plastic sheet
Inventor: WAKITA NAOKI
IPC: B32B27/00
Filed: 2003-02-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a conductive composite plastic sheet which brings about no flash on the occasion of slitting.  <P>SOLUTION: This conductive composite plastic sheet has a sheet base which contains (A-1) a thermoplastic resin selected from a polyphenylene ether-based resin and a polystyrene-based resin and (A-2) a matter selected from a thermoplastic resin having noncompatibility with the thermoplastic resin and containing no styrene unit as a repetitive unit and a thermoplastic elastomer, and has a conductive resin layer which is formed on the surface of the sheet base. The sheet base contains a matter obtained by compounding 1-20 pts.mass of (A-2) with 100 pts.mass of (A-1). The conductive resin layer contains a matter selected from (B) a thermoplastic resin selected from the polyphenylene ether-based resin and a styrene-based resin, (C) carbon black and (D) the thermoplastic elastomer. The thickness ratio between the sheet base and the conductive resin layer is made 1/4-1/20 and the total thickness of the sheet is made 0.1-1.0 mm.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004257350-A (JP)
Title: Multicylinder single-stage compressor
Inventor: NISHIKAWA TAKEHIRO
IPC: F04B37/12
Filed: 2003-02-27
Abstract: <P>PROBLEM TO BE SOLVED: To prevent the early wear of a piston ring by preventing overcompression in a specific compression part in a multicylinder single-stage compressor provided with a plurality of compression parts.  <P>SOLUTION: In the case of a four-cylinder single-stage compressor with a first compression part 1 and a fourth compression part 4 opposedly arranged and with a second compression part 2 and a third compression part 3 opposedly arranged in an orthogonal direction to the first and fourth compression parts, compressed gas compressed in the first compression part 1 and second compression part 2 is fed into a cylinder head 4a of the fourth compression part 4 after joining through pipelines P1, P2, and compressed gas compressed in the third compression part 3 is fed into a discharge part 8 of the fourth compression part 4 through a pipeline P3. Overcompression in the fourth compression part 4 can be prevented by lowering the joining pressure in the cylinder head 4a of the fourth compression part 4. The cylinder head 4a communicates with the discharge part 8, and compressed gas from the first to fourth compression parts 1-4 is discharged from the discharge part 8 after joining.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004257184-A (JP)
Title: Structure of grade separated crossing of road, and its construction method
Inventor: KANEKO KENICHI
IPC: E01C1/04
Filed: 2003-02-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide the structure of grade separated crossing of roads and its construction method reducing a construction range while considering surrounding environment and using excavated sediment for banking.  <P>SOLUTION: In the structure of grade separated crossing of the roads and its construction method, earth retaining walls 1 considering a view are provided near both ends of the intersecting roads to project on the ground, and one intersecting road 4 is composed of a semi-underground type box body 2, while the other intersecting road 4 is formed as a banking road 3 constructed to straddle the box body 2.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004266065-A (JP)
Title: Semiconductor integrated circuit
Inventor: YOSHIKAWA HIDEAKI
IPC: H01L23/52
Filed: 2003-02-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit where the malfunction of the circuit due to the drop of power voltage can be prevented, which cannot be dissolved even if power reinforcing measures in an arrangement wiring process is taken in one chip.  <P>SOLUTION: The semiconductor integrated circuit comprises (a) a semiconductor chip 1 where wiring for supplying power potential of a high potential-side is formed, (b) a semiconductor chip 2 where wiring for supplying power potential of a low potential-side is formed, and (c) a semiconductor chip 3 including a semiconductor substrate 30, a first group of electrodes 39a which are formed on a first face of the semiconductor substrate and are electrically connected to wiring of the semiconductor chip 1, a second group of electrodes 35b which are formed on a second face of the semiconductor substrate and are electrically connected to wiring of the semiconductor chip 2 and a plurality of circuit elements to which power potential of the high potential-side is supplied from the first group of the electrodes and to which power potential of the low potential-side is supplied from the second group of the electrodes and are operated.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004265127-A (JP)
Title: Ordering system
Inventor: KIKAWADA ISAO
IPC: G06Q50/00
Filed: 2003-02-28
Abstract: <P>PROBLEM TO BE SOLVED: To respond detailed request from a customer in the case that the customer order is took at a restaurant or an eating and drinking place in a hotel and the like.  <P>SOLUTION: At the time that the customer places an order of drink and food, an IC tag 2 for storing the order information is issued and handed to the customer. When the customer takes an unoccupied table C and places or inserts the IC tag 2 to a reader 3 provided at the table C, the reader 3 reads the order information stored in the IC tag 2 and sends the read order information and relevant information including serving order of ordered drink and food and so on generated in relation to the order information by a predetermined operation by the customer to a kitchen side and displays them on a display part 44 of a managing device 4 at the kitchen side and makes a person in charge of cooking to cook in accordance with the serving order.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004264649-A (JP)
Title: Processing method for photosensitive lithographic printing plate, and developer therefor
Inventor: KONUMA TARO
IPC: G03F7/32
Filed: 2003-03-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for processing a photosensitive lithographic printing plate with excellent printing durability and a developer therefor by which sludges accumulating in a developing tank is decreased to suppress contamination on a plate face and reduce the cleaning load of the developing tank.  <P>SOLUTION: After a photosensitive lithographic printing plate material is imagewise exposed to light at 350 to 600 nm wavelength, the plate is developed with an alkali aqueous solution at 8.5 to 12.5 pH containing at least an inorganic alkali agent, a nonionic surfactant having ≥15.0 HLB (expressed by A for the HLB value and by MA for the content) and a nonionic surfactant having ≤13.5 HLB (expressed by B for the HLB value and by MB for the content), with the ratio of (A×MA+B×MB)/(MA+MB) ranging from 13 to 16.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2003264349-A (JP)
Title: Alignment mark structure in electric circuit board
Inventor: OUCHI TOSHIMICHI
IPC: G02F1/1345
Filed: 2003-03-03
Abstract: <P>PROBLEM TO BE SOLVED: To prevent the misconception and non-diocriminability of alignment marks.  <P>SOLUTION: The alignment marks 11a, 11b are formed on first outer layer copper foil 2 arranged on a PCB board 1 formed of a multilayer structure. In the vicinity of a part immediately below the alignment marks 11a, 11b, a solid pattern region 13 is formed on second inner layer copper foil 5. A blank region 12 in which a conductor wiring pattern does not exist is formed in the vicinity of a part immediately below the alignment marks 11a, 11b of first inner layer copper foil 4 which is positioned between the first outer layer copper foil 2 on which the alignment marks 11a, 11b are formed and the second inner layer copper foil 5 on which the solid pattern region part 13 is formed. When the PCB board 1 is aligned with the other member by using an automatic machine, the alignment marks 11a, 11b are not overlapped with the conductor wiring pattern of the first inner layer copper foil 4, and the contrast of the marks is enhanced, so that the misconception by the automatic machine can be prevented.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2004268634-A (JP)
Title: Lifting type platform movable fence
Inventor: SASAE KEISUKE
IPC: E01F1/00
Filed: 2003-03-05
Abstract: <P>PROBLEM TO BE SOLVED: To open/close a movable fence at a place corresponding to a position of a vehicle doorway when a plurality kinds of vehicles having different kinds of doors mixedly exist on the same railroad track and even when a stopping position of a train or the like is deviated in the movable fence for preventing fall provided at a front edge (track side) of a platform at a station.  <P>SOLUTION: In the movable fence provided near the front edge (track side) of the platform and forming an entrance/exit corresponding to the vehicle doorway of the vehicle, a plurality of doors forming the movable fence are liftably constituted by a driving means. A storing part of the door descending under the floor surface of the platform is provided.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004273600-A (JP)
Title: Method of manufacturing semiconductor device
Inventor: IKEMATSU YOSHIAKI
IPC: H01L21/28
Filed: 2003-03-06
Abstract: <P>PROBLEM TO BE SOLVED: To improve reliability of gate wiring through highly accurate formation of a fine gate electrode.  <P>SOLUTION: A gate insulating film 2 is formed on a substrate 1, and moreover electrode structuring films 3, 4, 5, 6 forming the gate electrode are sequentially formed. A silicon nitride film 7 and a second polysilicon film 8 are formed over a metal film 6, and a resist pattern 9 is also formed thereon. The second polysilicon film 8 is patterned using the resist pattern 9 as a mask, and the silicon nitride film 7 and the electrode structuring films are patterned using the patterned second polysilicon film 8 as a mask. An interlayer insulating film 11 is formed on the entire surface of the substrate 1, and contact holes 12 are also formed within the interlayer insulating film 11. After a polysilicon film 13 is formed inside the contact hole 12, a polysilicon plug 13a is formed with CMP using the silicon nitride film 7 as a stopper film.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004271672-A (JP)
Title: Driving device for display panel
Inventor: IDE SHIGEO
IPC: G09G3/2813
Filed: 2003-03-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a driving device for a display panel which improves luminance and light emission efficiency by improving a driving pulse waveform.  <P>SOLUTION: The driving device comprises; a first driving pulse generation part which has a resonance circuit for alternatively forming regular and reverse current paths including an inductor and a clamp circuit including a first switch for selectively clamping an output end of the resonance circuit at a supply potential and a second switch for selectively clamping the output end of the resonance circuit at the ground potential and generates a first driving pulse to apply it to an output line; a second driving pulse generation part which generates a second driving pulse to apply it to a line electrode group; and a mask circuit which is set to the turned-on state to connect the output line and the line electrode group during application of the first driving pulse to the line electrode group by the first driving circuit generation part and is set to the turned-off state to disconnect the output line and the line electrode group during application of the second driving pulse to the line electrode group by the second driving circuit generation part. The clamp circuit and the mask circuit are made into a module.  <P>COPYRIGHT: (C)2004,JPO&NCIPI