baber/WOPTO huggingface dataset:
Patent TW-341612-B (TW)
Title: Modular polymer matrix composite support structure and methods of constructing same
Inventor: CHRIS DUMLAO
IPC: E04B1/343
Filed: 1997-09-30
Granted: 1998-10-01
Abstract: A load bearing support structure comprising: at least one modular structural section; and support means supporting said at least one modular structural section; said at least one modular structural section supported on and connected with the support means; said at least one modular structural section comprising: a load bearing deck including at least one sandwich panel, said at least one sandwich panel having: an upper surface; a lower surface; and a core including, a plurality of adjacent, substantially hollow, elongated core members positioned between the upper surface and the lower surface, each of the elongated core members including a pair of side walls and upper and lower walls connecting the side walls, at least one side wall of the pair of side walls is disposed at an oblique angle to one of the upper and lower surfaces such that the pair of side walls and the upper and lower walls, when viewed in cross-section, define a polygonal shape, and each of the elongated core members has one of the side walls positioned generally adjacent to one of the side walls of one of the adjacent elongated core members and the other of the side walls positioned adjacent to one of the side walls of one of the adjacent elongated core members.
Patent TW-369443-B (TW)
Title: Method for spin forming articles
Inventor: DE SOUSA EGAS JOSE
IPC: B21D41/04
Filed: 1997-12-01
Granted: 1999-09-11
Abstract: A method of spin forming, comprising the steps of: providing a tool (20) having a first plurality of forming rollers (34, 36) spaced at a second plurality of distances from a spin axis (30); spinning around the spin axis at least one member of a set comprising (i) a work piece and (ii) the tool; and engaging the tool and a first end of the work piece. The method allows increased diameter reductions of a free end of a work piece in a single forming operation without collapse of the end of the work piece.
Patent TW-379433-B (TW)
Title: Interconnects using metal spacers and method for forming same
Inventor: CRONIN JOHN E
IPC: H01L21/768
Filed: 1997-12-16
Granted: 2000-01-11
Abstract: The preferred embodiment of the present invention provides increased conductivity between interlevel interconnection lines. The preferred embodiment uses sidewall spacers on the sides of the interconnection lines to increase the contact are between interconnection lines and interconnect studs. This increase in area improves connection resistance and allows further devices scaling without unacceptable decreases in the conductivity of the connection, and without adding significant expense in the fabrication process.
Patent TW-412832-B (TW)
Title: Method of forming capacitor in IC
Inventor: TSAI SHING-CHUAN
IPC: H01L21/70
Filed: 1998-01-20
Granted: 2000-11-21
Abstract: The present invention relates to a method of forming a capacitor in an IC, which comprises sequentially depositing a first dielectric layer and an etch stop layer and exposing a memory cell contact; forming a first polysilicon layer filling up said memory cell contact; forming a second polysilicon layer having a rough surface; orming a first hard mask on the second polysilicon layer, the first hard mask having a thickness of 100 to 300 angstroms; defining an initial pattern of the lower electrode plate of the capacitor; forming a third polysilicon layer having a rough surface; defining the third polysilicon layer by a photolithography and an etching technique to form the lower electrode plate of the capacitor.
Patent TW-387843-B (TW)
Title: Method of producing EMI-shielding plastic product with one face of which clad with metal foil and the device thereof
Inventor: JUANG DUNG-HAN
IPC: B21D26/055
Filed: 1998-02-05
Granted: 2000-04-21
Abstract: The present invention discloses a method and an apparatus for producing an EMI-shielding plastic product with one face of which clad with a metal foil. The method comprises mounting a super-plastic alloy plate in a mold; using a gaseous pressure to blow the super-plastic alloy plate to a suitable deformation; pushing the bottom of the mold in a reverse direction to form a constant shape; evacuating the mold cavity enabling a molten plastic in an injection machine, which is connected to the mold cavity, to be injected into the mold cavity such that the molten plastic is attached on one face of the super-plastic alloy plate. The thus obtained EMI-shielding plastic product with one face of which clad with a metal foil has a similar EMI shielding effect as a conventional sheet metal enclosure, a low production cost, and free of environmental contamination, while the metal and the plastic having a good connection.
Patent TW-393528-B (TW)
Title: Temperature control apparatus for a heating roller
Inventor: OSHIUMI KOICHIRO
IPC: D02J1/22
Filed: 1998-02-12
Granted: 2000-06-11
Abstract: To provide a temperature control apparatus for a heating roller that can make use of other normal temperature detecting components to maintain temperature control upon detecting errors in a temperature detecting component for control until the whole machine is stopped for maintenance. The temperature control apparatus is composed of multiple temperature-detecting components 21, 22 for detecting roller temperature, and a control means for controlling the temperature of a heating means 4 using the output from the temperature detecting component 21, in which the control means contains an error detecting means 32 for detecting abnormal conditions of temperature detecting component 21, and a switching means 32 for maintaining the temperature control of heating means 4 using the output from other temperature detecting components 22 when the abnormality in the particular temperature detecting component 21 is detected by the error detecting means 32.
Patent TW-368725-B (TW)
Title: Manufacturing method for synchronous forming alignment mark and shallow trench isolation structure
Inventor: JANG SYUN-MING
IPC: H01L21/76
Filed: 1998-02-16
Granted: 1999-09-01
Abstract: A kind of manufacturing method for synchronous forming alignment mark and shallow trench isolation structure which includes the following steps: (a) providing a substrate including a component area and an alignment area; (b) defining the substrate and forming a shallow trench in the component area and an aligned trench in the alignment area; (c) forming an insulation layer to cover the substrate and fill out the shallow trench and aligned trench; (d) defining a photoresistant layer covering the insulation layer above the shallow trench; (e) employing photoresistant as the mask to etch back the exposed insulation layer and form an aligned mark by etching to the bottom of aligned trench in the alignment area; and, (f) removing photoresistant and applying planarization on the residual insulation layer covering the top of shallow trench and complete the shallow trench isolation structure in the component area.
Patent TW-509705-B (TW)
Title: Process for fabricating a prepreg component
Inventor: HEDRICK JEFFREY CURTIS
IPC: C08J5/24
Filed: 1998-08-05
Granted: 2002-11-11
Abstract: The elimination of large volumes of organic solvents from the manufacture of printed wiring circuit boards may be possible through the utilization of waterborne epoxy resin emulsions. The preparation of high quality, in-spec prepreg from a waterborne epoxy resin emulsion was demonstrated in the laboratory and on a pilot treater. The prepreg was identical to that prepared with conventional organic solvent processing: it possessed the same level of stage curd and comparable rheological properties. Laminates fabricated from the prepreg possessed equivalent or improved thermal, adhesive and moisture absorption properties.
Patent TW-396534-B (TW)
Title: Process for dual damascene
Inventor: SHIU JEN-TSUNG
IPC: H01L21/768
Filed: 1998-08-28
Granted: 2000-07-01
Abstract: A dual damascene manufacturing process is disclosed, in which the structure of metal trench and via pattern is formed by two steps of lithographic etching method. After the first etching of dielectric layer, the first photo-resist is not removed, thus the first photo-resist and the second photo-resist could be used as the etching mask together in the second dielectric etching process, and could form self-aligned dual damascene structure. Moreover, after the first lithographic etching, titanium or titanium nitride could be deposited above dielectric layer, which could protect the first photo-resist, and be used as a anti-refractive layer.
Patent TW-387147-B (TW)
Title: Method of manufacture embedded DRAM
Inventor: YE WEN-GUAN
IPC: H01L27/108
Filed: 1998-09-14
Granted: 2000-04-11
Abstract: A method to produce embedded DRAM is disclosed. Including first, provide a substrate that has logic device region and memory device region. And produce isolation layer upon the logic device region and memory device region. Then produce mask layer upon the isolation layer. The functions of this mask layer are to reduce the depth of the photoresist layer, reduce the reflection of the lithography process and be the buffer layer of the follow-up process to reduce alignment error of the photoresist lithography and the plasma damage of the follow-up process. Then, photoresist defines the mask layer until the surface of the isolation layer uncovered. Then use the mask layer to be a mask to produce an opening.
Patent TW-432368-B (TW)
Title: A method for storing audio-centered information with a multi-level table-of-contents (TOC) mechanism with one master-TOC and sub-TOCs for various audio formats, a device for use with such mechanism and a unitary storage medium containing such mechanism
Inventor: MONS JOHANNES JAN
IPC: G11B27/30
Filed: 1998-12-10
Granted: 2001-05-01
Abstract: Audio information is stored on a unitary storage medium with a table-of-contents (TOC) mechanism for therein specifying an actual configuration of various audio items on the medium. In particular, one or more sub-TOCs are each assigned to a respective different audio format. A single master-TOC is provided for specifically pointing to each sub-TOC.
Patent TW-400470-B (TW)
Title: A dynamic monitoring method of file systems
Inventor: LI PENG
IPC: G06F11/00
Filed: 1998-12-17
Granted: 2000-08-01
Abstract: This dynamic file system monitoring method can rapidly monitor the operations of the file systems on a dynamic and real time basis by using little system resources. Also, it provides a standard filtering interface for monitoring the file systems, which user can realize the specified expansion of the monitoring functions for file systems via the public interface. Such dynamic monitoring method for the file systems includes the following steps: (i) the file types, such as file names, are analyzed first. (ii) Then, the related dynamic link library (DLL) is used to examine the monitoring conditions whether the user's requirements are satisfied or not. If yes, the next step is processed; if not, all steps up to (vii) are performed if user needs no monitoringi. (iii) Related processes, inclusive of setting marks and activating monitoring and control, are proceeded. (iv) automatic query is conducted regarding whether monitoring process is needed or not. The next step is processed if user requests for monitoring; otherwise steps up to (viii) are performed. (v) The related messages of the application program are recorded; then, the next step is processed. (vi) The program is transformed to a preparation stage and is ready for monitoring the next application program. (vii) The monitoring is aborted and the next step is processed if the condition examination result does not satisfy the user's requirements. (viii) The next hook is provoked.
Patent TW-406157-B (TW)
Title: Pre-cast light partition jointing method
Inventor: JANG HUEI-PING
IPC: E04B2/08
Filed: 1998-12-18
Granted: 2000-09-21
Abstract: A jointing method for light pre-cast partition wall, mainly setting a narrow and protruded steel plate at the proposed jointing face of light pre-cast partition wall. Then, pour concrete structure to wrap the outer layer, having a lightweight pre-cast partition with protruded steel plate. Between the two sheets of proposed pre-cast light wall partition, the relative opposite place of the two steel plate is the proposed protrusion and recess place; upon jointing, joint the two steel plate of the partition wall together and assemble according to the protrusion and recess portion; and, spot weld the side of the jointing line; then, fill the gap of the joint by sealant to flush with the surface of wall; thus providing an excellent joint strength, replacing the traditional sole cement joint method.
Patent TW-389926-B (TW)
Title: An over-current cut-off electric switch
Inventor: JIANG YI-DE
IPC: H01H73/26
Filed: 1998-12-24
Granted: 2000-05-11
Abstract: The present invetion relates to an electric switch with an over-current cut-off device. The electric switch comprises : a shell, two conduction leads, a push-button device and a conduction reed which is used to conduct the two leads. The push-button device comprises a two-stage push-button which can slide up and down and the push-button is in conduction or cut-off state, as the push-button is pushed down, it will change from one state to another state. A conduction reed is installed in the shell to conduct the two leads. As the push-button is in conduction state, there is a preserved space above the reed such that the reed flips upward for over heating and is not touching the push-button. If the current on the reed is over a pre-determined value, the reed will flip upward and stay in the preserved space. Then, the reed will disconnect at least one lead such that the current can not flow from one lead to the other lead.
Patent TW-401706-B (TW)
Title: A host apparatus for simulating two way connectivity for one way data streams
Inventor: HARRISON EDWARD R
IPC: H04N7/16
Filed: 1999-01-07
Granted: 2000-08-11
Abstract: A host device is disclosed. The host device includes a processor and a control mechanism. The processor operates to receive primary and associated data, decode and separate the associated data from primary data, and cause the associated data to be rendered on a separate hand-held device. The processor also operates the control mechanism to control a separate display apparatus to separately receive and render the primary data.
Patent TW-429326-B (TW)
Title: Dual window WDM optical fiber communication
Inventor: JUDY ARTHUR F
IPC: H04B10/275
Filed: 1999-01-19
Granted: 2001-04-11
Abstract: Simultaneous dense WDM operation in both the 1310 nm and 1550 nm transparency windows of silica-based optical fiber, is enabled by a fiber design providing for nulled dispersion within a critically postitioned wavelength range. Design provides for values of dispersion in both windows sufficiently low for desired per-channel bit rate, and, at the same time, sufficiently high to maintain effects of non-linear dispersion within tolerable limits for WDM operation. Fiber fabrication and system design are described.
Patent TW-411313-B (TW)
Title: Rapid prototyping system with filament supply spool monitoring
Inventor: DAHLIN THOMAS J
IPC: B29C/
Filed: 1999-03-02
Granted: 2000-11-11
Abstract: A filament spool used in a rapid prototyping system carries a circuit which maintains data regarding the type and amount of filament on the spool. When the spool is mounted onto a spindle in the rapid prototyping system, the circuit is connected to the electronic control of the system. The data indicating the electronic control of the system. The data indicating the amount of filament on the spool is updated as filament is used by the system.
Patent TW-I228628-B (TW)
Title: Compression-bond-connection substrate and liquid crystal device
Inventor: UCHIYAMA KENJI
IPC: H05K3/36
Filed: 1999-04-08
Granted: 2005-03-01
Abstract: In a compression-bond-connection substrate having a configuration wherein a plurality of wiring layers are formed, elevated compensation patterns having substantially the same thickness as that of backside wiring patterns are formed in positions corresponding to the backsides of substrate-side terminals to be conductively connected to opposing-side terminals on a compression-bonding-side surface of the compression-bond-connection substrate. Since uniform pressure is exerted on the substrate-side terminals when pressure is applied in compression-bonding, a highly reliable compression-bonding connected assembly can be stably obtained.
Patent TW-I245800-B (TW)
Title: Endo-beta-N-acetylglucosaminidase gene
Inventor: KOBAYASHI KAZUO
IPC: C12N9/24
Filed: 1999-05-21
Granted: 2005-12-21
Abstract: An endo-beta-N-acetylglucosaminidase gene encoding the following protein (a) or (b): (a) a protein comprising the amino acid sequence represented by SEQ ID NO: 3; and (b) a protein comprising an amino acid sequence derived from the amino acid sequence represented by SEQ ID NO: 3 by deletion, substitution, or addition of at least one amino acid and having the activity of endo-beta-N-acetylglucosaminidase.
Patent TW-449841-B (TW)
Title: Semiconductor wire soldering method
Inventor: TSAI YU-FANG
IPC: H01L21/60
Filed: 1999-05-21
Granted: 2001-08-11
Abstract: The present invention relates to a semiconductor wire soldering method. A capillary tube solders one terminal of a wire to a first soldering pad, and the wire is extended upwardly for a first distance. The wire is then processed by a first bend to a direction opposite to a second soldering pad. The wire is then extended upwardly for a second distance. The wire is then processed by a second bend to a direction toward to the second soldering pad. The wire is then extended upwardly for a third distance. The wire is then processed by a third bend to a direction opposite to the second soldering pad. The wire is then extended upwardly for a fourth distance, so that the length of the wire reaches a predefined distance. Then, the end of the wire is moved onto the second soldering pad for being soldered. Therefore, the wire connects the first soldering pad and the second soldering pad, and the height of the wire is smaller at the portion of the fourth distance.
Patent TW-476153-B (TW)
Title: Integral manufacturing method for high voltage device and low voltage device
Inventor: FAN YUNG-JIE
IPC: H01L27/02
Filed: 1999-06-05
Granted: 2002-02-11
Abstract: An integral manufacturing method for high voltage device and low voltage device which includes the following steps: isolating a high voltage device region and a low voltage device region on a substrate with an isolation region; next, in the high voltage device region, forming a doped region on the surface of the exposed substrate in the isolation region; conducting a drive-in process to diffuse the doped region into the substrate to form a junction region; then, form a first gate structure and a second gate structure in the high voltage device region and the low voltage device region of the substrate respectively, and the first gate structure is located on the exposed substrate by the isolation region next to the junction region; forming a lightly doped drain region on both sides of the second gate structure in the low voltage device region of substrate; then, forming a spacer on the sidewall of the first and second gate structures; forming the heavily doped region in the exposed substrate between the isolation structure and the source/drain region on the sidewall of the first and second gate structures respectively, wherein the heavily doped region and the junction region form a double diffused drain structure.
Patent TW-I222873-B (TW)
Title: Hair care compositions and method for deposition swollen polymer particles onto hair
Inventor: BERGMANN WOLFGANG ROBERT
Filed: 1999-07-12
Granted: 2004-11-01
Abstract: A hair care composition which comprises (a) one or more polymer systems in the form of discrete particles, wherein said particles are swollen with a non-aqueous solvent; and (b) water or a hydroalcoholic solution carrier, are described. A method for treating hair which comprises contacting said hair with compositions of the invention is also described.
Patent TW-448683-B (TW)
Title: Multiple storage node active pixel sensors
Inventor: MERRILL RICHARD B
IPC: H04N5/355
Filed: 1999-09-30
Granted: 2001-08-01
Abstract: An active pixel sensor disposed on a semiconductor substrate includes a photosensor, a reset transistor, a plurality of storage nodes and outputting means. The photosensor has a first terminal and a second terminal, wherein the first terminal is coupled to a first reference potential. The reset transistor has a first terminal coupled to the second terminal of said photosensor, a second terminal coupled to a reset potential, and a third terminal coupled to a reset line. The plurality of storage nodes are coupled to said second terminal of said photosensor, and the means for outputting a value from any of said plurality of storage nodes is coupled to the storage nodes.
Patent TW-424323-B (TW)
Title: Structure and method for forming crown-type capacitor electrode
Inventor: HUANG RUEI-JEN
IPC: H01L27/108
Filed: 1999-07-26
Granted: 2001-03-01
Abstract: The present invention relates to a processing method for improving the capacitance of DRAM. The processes of the present invention comprises: firstly, providing a semiconductor chip in which the via of capacitor electrode is formed therein; using LPCVD to deposit an amorphous silicon on the via of capacitor electrode and on part of the semiconductor chip surface adjacent to the via of capacitor electrode; further, forming the photoresist on the amorphous silicon and transferring the pattern to the photoresist through the photolithography process and using the photoresist as the mask to etch the amorphous silicon layer and conducting the process of removing the photoresist; and, depositing the oxide layer on the amorphous silicon and on part of the semiconductor chip surface and spraying the plantarized Accuflo layer; then, back etching the plantarization layer and the oxide layer; further, forming loose HSG on the amorphous silicon; and, depositing again the oxide and spraying the plantarized layer on the surface of the amorphous silicon and the oxide formed by the HSG; then, using etching process of Accuflo/Oxide and back etching again the plantarized layer and the oxide to form an oxide mask; further, using the oxide as the mask to etch the HSG and the underneath amorphous silicon layer; lastly, removing the oxide to form the crown-type capacitor electrode.