baber/WOPTO huggingface dataset:
Patent TW-484139-B (TW)
Title: Method for the inspection of steam generator tubing utilizing nonaxisymetric guided waves
Inventor: MCCLELLAND RICHARD G
IPC: G01N29/34
Filed: 2000-04-27
Granted: 2002-04-21
Abstract: A method of inspecting a steam generator tube within a steam generator to detect damage, flaws corrosion, wall thinning, or breach, comprising the steps of: (a) placing in an open end of the steam generator tube and in contact with an inner wall of the steam generator tube a first partially loaded, tone burst activated, comb ultrasonic transducer; (b) transmitting a first nonaxisymetric ultrasonic wave into the steam generator tube using the first partially loaded transducer; (c) detecting a first reflected ultrasonic wave from the steam generator tube which reflected ultrasonic wave is indicative of a variation from a predetermined steam generator tube wall thickness.
Patent TW-468297-B (TW)
Title: Charging controller
Inventor: TOKUYAMA HIROSHI
IPC: H02J7/10
Filed: 2000-04-29
Granted: 2001-12-11
Abstract: A charging controller for charging a secondary battery by a dc source has a consumption current detector detecting a consumption current of a load; a charging current detector detecting a charging current to the secondary battery; a charging voltage detector detecting a charging voltage to the secondary battery, a function-processor to which detection outputs from the consumption current detector, the charging current detector, and the charging voltage detector are provided, respectively, and a charging control circuit controlling a charging output to the secondary battery, based on calculation results by the function-processor such that driving the load and charging are simultaneously executed within the ratings of the dc source.
Patent TW-524035-B (TW)
Title: Thin film adhesion device
Inventor: HAMAMURA AYAO
IPC: H05K3/10
Filed: 2000-09-30
Granted: 2003-03-11
Abstract: The present invention aims to provide a thin film adhesion device that can cut a continuous thin film into thin films of a pre-determined size and adhere the cut thin films on a laminate. The cutter applied is a type of rotary cutter consisting of a rotary knife installed transversely across the thin film and a fixed knife. With axle support on both ends, the rotary knife is installed for free rotation on a sliding table. The sliding table is connected onto the supported board of a base and can move backwards and forwards from its front towards the thin film. Also, with respect to the supported board which is fixed on a pre-determined position, the sliding table can move freely towards its front and away from the thin film. The fixed knife is installed nearby a thin film front-end holder that can move forwards and backwards from the back of the thin film and towards the thin film.
Patent TW-580676-B (TW)
Title: Plasma display apparatus and manufacturing method
Inventor: ONOZAWA MAKOTO
IPC: G09G3/288
Filed: 2000-11-04
Granted: 2004-03-21
Abstract: A PDP apparatus of low power consumption and without erroneous malfunctions equipped with the sustaining circuit that prevents the on/off timing shift and deterioration of the sustaining pulse, wherein phase adjusting circuits, which adjust the timing of the changing edge of the sustaining pulse, are provided to the sustaining circuit and the power recovery circuit is improved efficiently and the power consumption is reduced by optimizing the timing of the changing edge of the sustaining pulse, has been disclosed. The circuit devices used in the sustaining circuits are classified according to delay times and sets of the circuit devices are selected so that the timing of the changing edge of the sustaining pulse falls within a predetermined allowance, and the selected sets of the circuit devices are set to the PDP.
Patent TW-487875-B (TW)
Title: Method for electronic device to send and receive electronic message
Inventor: LAI JEN-SHING
IPC: G06F7/00
Filed: 2000-11-17
Granted: 2002-05-21
Abstract: The invention relates to a method for electronic device to send and receive electronic message, which stores at least a keyword in an electronic device in advance. Those keywords are compatible with a software installed in the electronic device. When the electronic device issues an electronic message, a keyword can be added to the electronic message so that the microprocessor of the remote electronic device can look for the software compatible with the keyword and then conduct processing on the electronic message in terms of the software when the remote electronic device receives the electronic message. As such, the contents of the electronic message can be instantly outputted via the output device of the electronic device, making user capable of saving the action and time in picking and starting the electronic message and preventing user from forgetting to read the contents of the electronic message, encountering the situation of missing critical events.
Patent TW-490821-B (TW)
Title: Application of wire bonding technique on manufacture of wafer bump and wafer level chip scale package
Inventor: SHIE WEN-LE
IPC: H01L23/485
Filed: 2000-11-16
Granted: 2002-06-11
Abstract: This invention provides an application of wire bonding technique on manufacture of wafer bump and wafer level chip scale package. In the embodiment of wafer level bumping, a wire bumping technique is primarily employed. There is no need to form under bump metallurgy (URM) but a group of metal bonding bumps are formed directly on the metal pads of the wafer. The metal bonding bumps are subsequently flattened using a mold and solder bumps are mounted by techniques such as ball mounting or solder paste printing. When any detrimental intermetallic compound is formed between the metal in the metal bonding bumps and the solder bumps, an UBM is formed on the surface of the metal bonding bumps by metal deposition before ball mounting. As to the embodiment of wafer level chip scale package, a wire bumping technique is also primarily employed. Without the formation of UBM, metal posts with adequate height are produced directly on the metal pads of the wafer. The metal posts are encapsulated by a polymer material, which is not fully cured and will not be removed on the chip passivation layer. The polymer material is then completely cured by means of providing energy or heating. The cured polymer material layer is polished to fully expose the top surface of the encapsulated metal posts. The manufacture process is completed once the solder bumps on the metal posts are formed by printing or ball mounting. The inventive process for mounting metal bonding bumps or metal posts process by wire bonding can be directly applied to the metal pads of I/O redistribution layer on wafers and is not restricted on the metal pads on wafers. According to the inventive process in plating solder bumps on the metal bonding bumps or metal posts, when any detrimental intermetallic compound is formed between the metal bonding bumps (posts) and the solder bumps, an UBM is formed on the surface of the metal bonding bumps (posts) by metal deposition before solder bumps planting.
Patent TW-494606-B (TW)
Title: Dual-beam microstripe antenna
Inventor: LIN YU-DE
IPC: H01Q9/04
Filed: 2000-11-28
Granted: 2002-07-11
Abstract: The invention relates to a planar printing antenna, including a substrate and top and down metal layers printed hereon. Use the gap on metal and the via holes between two layers of metal, the microstrip lines can be used as signal feeding device to stimulate the second higher order leaky mode of microstrip of another microstrip line to enable the far-field and dual-beam characteristics, achieving the radiation of antenna. The features provided include the panar antenna that employs the frequently used microstrip feeding method in circuit easily being linked with other circuits. The radiation model is the tilted dual beam with higher gain. Such structure is not limited to materials and is suitable for mass production in terms of all frequencies.
Patent TW-493207-B (TW)
Title: Method for producing GaN-based compound semiconductor and GaN-based compound semiconductor device
Inventor: SAKAI SHIRO
IPC: H01L21/20
Filed: 2000-12-15
Granted: 2002-07-01
Abstract: A production method of a GaN-based compound semiconductor having excellent crystallinity and a GaN-based semiconductor device produced therefrom. A discrete SiN buffer body is formed on a substrate, and a GaN buffer layer is formed thereon at low temperatures and a GaN semiconductor layer is then formed at high temperatures. By forming the discrete SiN buffer body, the crystal growth, which is dependent on the substrate, of the low-temperature buffer layer is inhibited and is inhibited and monocrystallization is promoted to generate seed crystals used at the time of growing the GaN buffer layer. Further, by forming SiO2 discretely between the substrate and the SiN buffer body or by forming InGaN or a superlattice layer on the GaN semiconductor layer, distortion of the GaN semiconductor layer is reduced.
Patent TW-544298-B (TW)
Title: Ladle and cooking utensil
Inventor: OYAMA JIRO
IPC: A47J43/28
Filed: 2001-03-21
Granted: 2003-08-01
Abstract: The present invention provides a cooking utensil, which is characterized in that the ladle has a spatulate part of which ground surface is formed into a rough area with many protuberances, and also the shrivelled area is formed on this roughness area to have double-embossed processed area all over the spatulate part.
Patent TW-514807-B (TW)
Title: System of providing integrated circuit bonding diagram through internet
Inventor: JUANG CHUEN-MIN
IPC: H01L21/00
Filed: 2001-03-28
Granted: 2002-12-21
Abstract: The network bonding diagram system of the invention comprises a processing unit processing data transmission by a user through network, in which the data comprise a user information and a package information. An empty blank lead frame/substrate graphics database is connected with processing unit to store lead frame information. A working database is connected with processing unit to store the forward information by hidden user. A bonding diagram generator is connected with processing unit to generate a bonding diagram layout with the information provided by user. A forward module responds to the bonding diagram by forward bonding diagram layout to user.
Patent TW-518304-B (TW)
Title: Liquid filling method
Inventor: KONDO MASAKATSU
IPC: B67C3/26
Filed: 2001-03-30
Granted: 2003-01-21
Abstract: The subject of present invention provides a liquid filling method capable of filling liquid into containers at a rate as high as 3500 containers/nozzle.hour (2 pitch-feed) without causing the problems such as foaming, turbulence of liquid surface and the like inside the container, and a high-speed liquid filling machine used in said method. In the solution of this invention, liquid is filled into a container that had been intermittently carried in a sequential manner to a filling station by raising and lowering said container, characterized in that the filling is started when the container is raised before it reaches the upper dead point of raising and lowering, the container is filled with a specified amount of liquid at the upper dead point of raising and lowering, and then filling is continued while lowering the container. It is preferable for the filling to be started before the carrying of the container is stopped, for example, the start of the filling to be advanced 30 DEG to 90 DEG from the upper dead point of raising and lowering in one raising and lowering cycle of 360 DEG. Furthermore, it is preferable for the carrying to be started before the lowering of the container is finished, wherein the start of carrying the container is advanced 40 DEG to 70 DEG from the end of lowering in one raising and lowering cycle of 360 DEG.
Patent TW-494385-B (TW)
Title: Image display apparatus
Inventor: ARIMIZU AKIRA
IPC: G09G5/00
Filed: 2001-04-25
Granted: 2002-07-11
Abstract: When a display image is a photographic image or a moving image, an ON signal is inputted from the ON-OFF circuit and the ON-OFF circuit to the sharpness circuit and the gamma correction circuit under a control signal from the control circuit. An inputted image signal Fc is subjected to sharpness processing for edge enhancement by the sharpness circuit, and the intermediate signal level of the image signal Fc is raised by gamma correction of the gamma correction circuit. Thus, the CRT can display a sharp, high-quality photographic or moving image having an enhanced edge and emitting light with its luminance proportional to the signal level. When a display image is a code display image of letters or the like, the sharpness circuit is controlled to be in an unactivated state and the gamma correction circuit is controlled to be in an activated state under a control signal from the control circuit. Thus, the CRT can display a sharp code image having light emission characteristics proportional to the signal level of an inputted image signal Fc.
Patent TW-I222082-B (TW)
Title: Semiconductor memory device
Inventor: KOSHIKAWA YASUJI
IPC: G11C11/401
Filed: 2001-05-18
Granted: 2004-10-11
Abstract: A semiconductor memory device (10) having a normal mode of operation and a test mode of operation is provided. The semiconductor memory device (10) can include a plurality of banks (100A to 100D). A bank (100A) may have a plurality of plates (PLT). In the normal mode of operation a row of plates (11020, 11021, ... 11027) may be activated. In the test mode of operation, half of the row of plates (11020, 11021, ... 11027) may be activated.
Patent TW-499693-B (TW)
Title: Dual-layer metal for flat panel display
Inventor: CHAKRAVORTY KISHORE K
IPC: H01J9/14
Filed: 2001-05-31
Granted: 2002-08-21
Abstract: A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a cathodic structure which is formed within an active area on a backplate. The cathodic structure includes a emitter electrode metal composed of strips of aluminum overlain by a layer of cladding material. The use of aluminum and cladding material to form emitter electrode metal gives emitter electrode metal segments which are highly conductive due to the high conductivity of aluminum. By using a suitable cladding material and processing steps, a bond between the aluminum and the cladding material is formed which has good electrical conductivity. In one embodiment, tantalum is used as a cladding material. Tantalum forms a bond with the overlying resistive layer which has good electrical conductivity. Thus, the resulting structure has very high electrical conductivity through the aluminum layer and high conductivity into the resistive layer. Electrode structures that use resistor material, chromium-containing material, nickel and vanadium alloy, and gold are also disclosed.
Patent TW-I236210-B (TW)
Title: Power amplifier module
Inventor: YAMASHITA KIICHI
IPC: H04B1/40
Filed: 2001-07-17
Granted: 2005-07-11
Abstract: The present invention provides a power amplifier module, which has the function for protecting the amplifier device from the damage by the standing wave reflected from the antenna during loading variation, and provides high damage durability and high efficiency. The solution is to detect and eliminate the excess current flowing through the base of GaAs-HBT at the last stage of the amplifier during loading variation, and thus eliminate the collector current, so as to prevent the increase of output and the damage to GaAs-HBT. Moreover, the present invention combines the functions of successively lowering the idling current when power source voltage is elevated and a clipping function of diodes connected in parallel with the output stage of GaAs-HBT, so as to prevent too-large voltage and current than necessary being applied to GaAs-HBT at the output. The present invention can improve the damage durability of the power amplifier module, and prevent the device damage during loading variation; furthermore, because of reducing the effects from fabrication deviation of current amplification rate or temperature variation for the GaAs-HBT, the present invention can obtain higher fabrication yield and achieve lower cost.
Patent TW-502449-B (TW)
Title: Thin film transistor, liquid crystal display and manufacturing method thereof
Inventor: KAWASAKI MASAHIRO
IPC: H01L29/786
Filed: 2001-07-24
Granted: 2002-09-11
Abstract: The present invention provides a thin film transistor comprising a drain electrode and a source electrode separated by a channel region formed over a contact portion with an amorphous silicon layer and wherein an impurity from the channel region is removed and a remaining impurity is diffused into the contact portion to form a contact layer wherein the contact layer has a second resistance at least lower than the first resistance.
Patent TW-518539-B (TW)
Title: Plasma display panel with superior luminous characteristics
Inventor: YAMADA KAZUHIRO
IPC: G09G3/291
Filed: 2001-08-27
Granted: 2003-01-21
Abstract: A technology for a plasma display panel (PDP) that enables writing to be properly performed in a shorter writing period. During the writing period, a scan pulse is applied to a plurality of first electrodes one after another, while a data pulse is selectively applied to a plurality of third electrodes. This causes write discharge in selected cells to perform writing. To ensure writing to be properly performed in a shorter writing period, auxiliary write discharge which is smaller than the write discharge is generated, at least in or around the selected cells of all the cells during the writing period when the scan pulse is being applied. The auxiliary write discharge produces priming particles in or around the selected cells, raising the possibility of the write discharge being generated in the space inside the selected cells. Therefore, even with a reduction in the width of the scan pulse, the possibility of a writing error remains low, which ensures the writing to be properly performed.
Patent TW-508659-B (TW)
Title: Selective growth of semiconductor structure and process for fabricating same
Inventor: DROOPAD RAVINDRANATH
IPC: H01L21/205
Filed: 2001-09-05
Granted: 2002-11-01
Abstract: High quality epitaxial layers of compound semiconductor materials can be selectively grown overlying large silicon wafers by first growing an accommodating buffer layer (24) on a silicon wafer (22). The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous intermediate layer (28) of silicon oxide. The amorphous intermediate layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous intermediate layer. The buffer layer is reduced in thickness in selected areas. In one area (18) of the buffer layer, a layer of an amorphous material (25) is deposited to inhibit growth of monocrystalline compound semiconductor material (26). Alternating areas of the buffer layer include a compound semiconductor material.
Patent TW-511392-B (TW)
Title: Organic luminescence device
Inventor: UENO KAZUNORI
IPC: H01L51/52
Filed: 2001-12-31
Granted: 2002-11-21
Abstract: An organic luminescence device is constituted by an organic luminescence lamination structure comprising a pair of an anode and a cathode, and at least one organic compound layer disposed between the anode and the cathode, a hermetic sealing housing enclosing therein the organic luminescence lamination structure and blocking external air, and a drying agent disposed within the hermetic sealing housing. The drying agent comprises a compound represented by the following formula (1): R-NCO, wherein R denotes a substituted or unsubstituted alkenyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted styryl group, a substituted or unsubstituted acyl group, or a substituted or unsubstituted heterocyclic group. The drying agent comprises the compound of the formula (1) in a polymerized form.
Patent TW-I257871-B (TW)
Title: Pharmaceutical formulation
Inventor: MCALLISTER STEPHEN MARK
IPC: A61K9/54
Filed: 2002-01-30
Granted: 2006-07-11
Abstract: The present invention is directed to pharmaceutically acceptable polymeric compositions suitable for injection molding of single or multi-component pharmaceutical dosage forms comprising a plurality of drug substance containing sub-units, being capsule compartments and/or solid sub-units comprising a solid matrix of a polymer which contains a drug substance, the sub-units being connected together in the assembled dosage form by a weld between parts of the assembled dosage form.
Patent TW-552816-B (TW)
Title: Radio access networks
Inventor: SODERSTROM RAUL
IPC: H04L12/56
Filed: 2002-03-22
Granted: 2003-09-11
Abstract: A method of controlling the flow of data packets, destined for user equipment (UE), between a radio network controller (RNC) and a Node B of a UMTS terrestrial radio access network (UTRAN), where it is sought to synchronise the Node B and the RNC in order to allow data packets sent from the RNC to arrive at the Node B in time to be included in the allocated physical channel frames. The method comprises sending a data packet from a MAC entity of the RNC to the Node B, whilst retaining a copy of the sent data packet at the transmitting MAC entity, sending a notification from the Node B to the transmitting MAC entity, which notification indicates whether the sent data packet was transmitted to the UE on the allocated physical channel frame, and in the event that the sent data packet was transmitted on the allocated physical channel frame, sending a new data packet to the Node B from said MAC entity and discarding the original data packet stored at the MAC entity, and, in the event that the sent data packet was not transmitted on the allocated physical channel frame, resending the original data to the Node B from said MAC entity.
Patent TW-I246864-B (TW)
Title: A controller for providing an efficient dormant mode for a group communication network
Inventor: ROSEN ERIC
IPC: H04M3/42
Filed: 2002-05-15
Granted: 2006-01-01
Abstract: A method and apparatus for providing an efficient dormant mode for push-to-talk communication devices in a group communication network provides for determining whether the net has been inactive for a predetermined first time period and, if so, causing each member of the net to enter a control-hold mode, wherein each member of the net maintains its dedicated traffic channel. The method further includes the steps of determining whether each member of the net has been in the control-hold mode for a predetermined second time period and, if so, causing each member of the net to enter a dormant mode, wherein each member of the net releases its dedicated traffic channel. The method and apparatus further provides for causing each member of the net to cache its service configuration state before entering the dormant mode.
Patent TW-I220610-B (TW)
Title: Method and device for setting the autonegotiation mode of a repeater
Inventor: TIMG JIAM-SHIUN
IPC: H04B7/155
Filed: 2002-05-24
Granted: 2004-08-21
Abstract: The present invention discloses a method and device for setting the autonegotiation mode of a repeater, which can be applied between two node devices of an Ethernet system to complete the setting of automatic coordinating mode between the two node devices. Several pre-staged and post-staged repeaters are arranged between the two node devices. Each repeater can receive the autonegotiation mode message of a pre-staged repeater based on the pre-staged/post-staged relation, and adjust the content of the autonegotiation mode of itself based on the received autonegotiation mode message. Then, the repeater transmits the autonegotiation mode message of itself to the next repeater, so that the two node devices can complete the setting of autonegotiation mode via several repeaters.