baber/WOPTO huggingface dataset:
Patent JP-2013053450-A (JP)
Title: Base-isolating device and base isolation method using the same
Inventor: HAYASHI SHINICHIRO
IPC: E04H9/02
Filed: 2011-09-05
Abstract: PROBLEM TO BE SOLVED: To provide a base isolation technology which imparts a base isolation function to a structure such as a detached house.SOLUTION: A base-isolating device provided under a recess of a foundation bottom surface of a structure includes: a container 2 into which an elastic body chip 5 is inserted; a core body 3 which is inserted into the container from above; and a tray 6 which is provided on the core body and which is made of an elastic body for accommodating spheres 7 for decreasing a coefficient of friction. The base-isolating device absorbs a vertical seismic ground motion by the elastic body chip, and absorbs horizontal vibrations by the spheres in the tray and by a gap 4 provided between the core body and an inner wall of the container. In a base isolation method, the tray of the base-isolating device is arranged in the recess of the foundation bottom so that the horizontal vibrations can be absorbed and so that the tray as the elastic body can absorb an impact caused by colliding with an edge of the recess of the foundation bottom.
Patent JP-2013062046-A (JP)
Title: Method for manufacturing spark plug
Inventor: KANEMARU TOMONORI
IPC: H01T13/20
Filed: 2011-09-12
Abstract: PROBLEM TO BE SOLVED: To implement satisfactory joining strength by more reliably welding a surface of a tip with no burrs formed to a ground electrode.SOLUTION: A spark plug 1 comprises: a center electrode 5; a ground electrode 27; and a ground electrode side tip 32 joined to the ground electrode 27 at its join surface 32B. A process for manufacturing the spark plug 1 comprises: a tip forming step; and a tip joining step of resistance-welding the ground electrode side tip 32 to the ground electrode 27. The tip forming step comprises: a wire rod forming step of forming a wire rod WR having a base plane BS; and a wire rod cutting step of moving a cutting edge CE from one lateral end edge of the base plane BS to the other lateral end edge thereof to cut the wire rod WR into the ground electrode side tip 32. In the tip joining step, the base plane BS of the ground electrode side tip 32 is at least partly joined to the ground electrode 27 to form the join surface 32B.
Patent JP-2013060042-A (JP)
Title: Hybrid vehicle and control method thereof
Inventor: MINEGISHI SHINICHIRO
IPC: B60L50/16
Filed: 2011-09-12
Abstract: PROBLEM TO BE SOLVED: To control the voltage variation in the power supply system according to the drive force change corresponding to the user operation in the batteryless traveling of the hybrid vehicle.SOLUTION: The hybrid vehicle turns off an SMR 55 at the abnormality of the battery 50 and executes the batteryless traveling. During the batteryless traveling, a converter 40 controls the dc voltage VL of a power line 56. The HVECU 70 turns off the SMR 55 when starting the batteryless traveling, in a turned off state of a DC/DC converter 80. After the SMR 55 is turned off, the DC/DC converter 80 in a stopped state is restarted after the dc voltage VH of the power line 56 is raised beforehand.
Patent JP-2013060281-A (JP)
Title: Refuse collecting vehicle
Inventor: OKUBO YUSUKE
IPC: B65F3/20
Filed: 2011-09-14
Abstract: PROBLEM TO BE SOLVED: To provide a refuse collecting vehicle that reduces a burden of a worker and can perform a loading operation during a travel of a vehicle.SOLUTION: The refuse collecting vehicle includes an electric refuse loading apparatus 1 that performs the loading operation of compressing using an output of an electric motor 210 and loading refuse that is charged from an opening having an openable and closable hopper door 20a to a refuse housing part 10. The vehicle includes: a refuse charging amount estimation device for estimating a refuse charging amount after the last loading operation of the electric refuse loading apparatus is finished; a vehicle stop detection device for detecting a stop of a vehicle; a hopper door close detection device 302 for detecting a close of the hopper door; and a loading controller 300 for automatically starting the loading operation of the electric refuse loading apparatus when the refuse charging amount estimated by the refuse charging amount estimation device is a predetermined value or higher and both the stop of the vehicle and the close of the hopper door are detected.
Patent JP-2012024096-A (JP)
Title: Method for manufacturing dimethylglycine
Inventor: KONISHI KAZUMASA
IPC: C12N9/10
Filed: 2011-09-14
Abstract: PROBLEM TO BE SOLVED: To provide a method for more easily and effectively manufacturing dimethylglycine.SOLUTION: Dimethylglycine is manufactured by introducing exogenous genes related to a metabolic pathway for dimethylglycine synthesis by two-staged methylation reaction from glycine to sarcosine and from sarcosine to dimethylglycine into microorganisms. Further, by strenghthening a synthetic system of S-adenosylmethionine (SAM) to be used as a methyl group donor in the dimethylglycine synthesis at the same time, a larger amount of dimethylglycine can be biosynthesized. According to the method of manufacture, dimethylglycine can be highly densely accumulated inside the microorganism from a simple carbon source derived from plant biomass, and further, dimethylglycine can be easily separated and collected by discharging dimethylglycine under a low osmotic pressure condition such as fresh water. Further, by repeatedly utilizing the used microorganism, a large amount of dimethylglycine can be continuously produced.
Patent JP-2012146950-A (JP)
Title: Wiring substrate, wiring substrate with solder bump, electronic device, and method of manufacturing wiring substrate with solder bump
Inventor: NAGATA YOSHIKATSU
IPC: H01L23/12
Filed: 2011-09-27
Abstract: PROBLEM TO BE SOLVED: To provide a wiring substrate suppressing cracks of an insulation substrate and enabling coining of a solder bump, and to provide a wiring substrate with a solder bump, an electronic device, and a method of manufacturing a wiring substrate with a solder bump.SOLUTION: In a wiring substrate 9, a mounting part 1b is provided on an upper face of an insulation substrate 1 formed by laminating insulating layers 1a. A plurality of electrode pads 2 are formed to the mounting part 1b. A through conductor 3 is connected to each of the electrode pads 2. Through conductors 3 in the center part of the mounting part 1b penetrate through more insulating layers 1a compared with those in an outer peripheral part of the mounting part 1b. The insulation substrate 1 has a convex part 1c on the upper face. An upper face of the convex part 1c serves as the mounting part 1b. The electrode pad 2 formed to the mounting part 1b is connected to an electrode of the semiconductor element 10 via a solder bump 5. Since the electrode pads 2 are formed using the upper face of the convex part 1c as the mounting part 1b, cracks of the insulation substrate 1 caused by contact with a device applying pressure on the solder bump 5 bonded to the electrode pad 2 can be suppressed.
Patent JP-2012073018-A (JP)
Title: Thermoelectric drinking apparatus, and thermoelectric heat pump
Inventor: HUNG MIN-HSIUNG
IPC: F25B21/02
Filed: 2011-09-27
Abstract: PROBLEM TO BE SOLVED: To provide a thermoelectric drinking apparatus and a thermoelectric heat pump.SOLUTION: The thermoelectric drinking apparatus has a feeding pipe, a cooling-gain circulating loop, a heating-gain circulating loop, an outlet pipe, and a thermoelectric heat pump. The thermoelectric heat pump is provided with a thermoelectric chip, a cooling unit attached to the cold side of the thermoelectric chip and provided with a cooling channel therein, and a heating unit attached to the hot side of the thermoelectric chip and provided with a heating channel therein. The feeding pipe guides fluid into the cooling channel and the heating channel. The cooling-gain circulating loop and the heating-gain circulating loop cause fluids in the cooling channel and the heating channel to circulate such that the cold side and the hot side of the thermoelectric chip cool and heat the fluids via the cooling channel and the heating channel. The outlet pipe discharges the cooled and/or heated fluids from the cooling-gain circulating loop and the heating-gain circulating loop.
Patent JP-2013074410-A (JP)
Title: Ad-hoc network communication terminal, ad-hoc network communication terminal control method, and ad-hoc network communication system
Inventor: SATO HIROTATSU
IPC: H04W28/04
Filed: 2011-09-27
Abstract: PROBLEM TO BE SOLVED: To make it possible to control communication accuracy corresponding to temporal change in the transmission priority of data in an ad-hoc network.SOLUTION: An ad-hoc network communication terminal 100 comprises: a network interface 113 for exchanging a packet with another communication terminal 101; and an arithmetic unit 111 for performing processing of calculating the transmission priority of a packet by applying a lapsed time from packet reception clock time to next packet transmission clock time at the communication terminal to a temporal change function of the transmission priority depending on a packet type indicated by the packet for each packet received from the other communication terminal 101 via the network interface 113, processing of determining earlier transmission order according to height of the calculated transmission priority per packet among packets scheduled to be transmitted, and processing of transmitting each packet scheduled to be transmitted on the basis of the determined transmission order at an arrival of the next packet transmission clock time.
Patent JP-2013072213-A (JP)
Title: Seismic strengthening method of existing pipeline
Inventor: SATO KENZO
IPC: E03F3/04
Filed: 2011-09-28
Abstract: PROBLEM TO BE SOLVED: To provide a seismic strengthening method of an existing pipeline with which seismic strengthening can be performed on the existing pipeline with non-open cut and construction can be performed in a short time and at low cost.SOLUTION: A blockade member 15 is narrowed while turning its outer edge toward a distal end side so as to include a folded pressing balloon 21, the outside of the narrowed blockade member 15 is covered with a leading member 29 and in such a state, a distal end of an inner pipe is guided in from one inlet/outlet of an existing pipeline 12. At the same time, the distal end of the inner pipe 13 is guided out of another inlet/outlet through the inside of the existing pipeline 12 to install the inner pipe 13 within the existing pipeline 12 and after the leading member 29 is removed, the pressing balloon 21 is expanded, thereby pressing a rear face side of the blockade member 15 to an opening edge of the other inlet/outlet by pressing with the pressing balloon 21. Therefore, a gap between the existing pipeline 12 and the inner pipe 13 in the other inlet/outlet is closed and pressing means 19 is separated from the inner pipe 13 thereafter.
Patent JP-2013071612-A (JP)
Title: In-wheel motor driving unit
Inventor: SEO TAKASHI
IPC: B60K7/00
Filed: 2011-09-28
Abstract: PROBLEM TO BE SOLVED: To provide an in-wheel motor driving unit which enables miniaturization of a relative displacement absorption-type drive connection structure for drive-connecting both input and output shafts while absorbing relative inclination of the input and output shafts.SOLUTION: Running of an electric motor 2 is transmitted to a hub bearing 8 (wheel) via the input shaft 3, the relative displacement absorption-type drive connection structure 11, and the output shaft 6. The relative displacement absorption-type drive connection structure 11 is configured by infilling an elastic material between inner and outer cylinders. The input and output shafts 3 and 6 are swingably drive-connected via a connection part 7 by connecting the output shaft 6 to the inner cylinder and connecting the input shaft 3 to the outer cylinder. The relative displacement absorption-type drive connection structure 11 is arranged on the opposite side of the hub bearing 8 with the electric motor 2 in between. Thus, the swingable connection part 7 of the input and output shafts 3 and 6 is set to exist in an axial-direction position distant from the hub bearing 8, and an oscillation angle α of the output shaft 6, which is made by displacement of a wheel rotation surface, caused by the backlash, dimensional tolerance and deflection of the hub bearing 8, becomes smaller than a conventional angle "α'". This enables the miniaturization of the relative displacement absorption-type drive connection structure 11.
Patent JP-2013074263-A (JP)
Title: Semiconductor device
Inventor: TORII YASUSHI
IPC: H01L25/18
Filed: 2011-09-29
Abstract: PROBLEM TO BE SOLVED: To solve such a problem that when stacking semiconductor chips each having a through electrode and interconnecting the through electrodes, a layer to be fluidized by heating, e.g., a solder layer, out of the metal bonding layers on the surface of a bump becoming the connection terminal of the through electrode may be collapsed and thinned thus lowering the bonding strength.SOLUTION: First and second sub-bumps 50, 68 are provided along with a normal bump structure (first and second main bumps 51, 69) on both principal surfaces of a semiconductor substrate. At least one of the first and second sub-bumps is made higher than the first and second main bumps, so that the sub-bumps are brought into contact with each other earlier than the main bumps when bonding a semiconductor chip. Consequently, the bonding margin of the main bumps is ensured, and thinning of a layer fluidized by heating, e.g., a solder layer 49, is minimized on the main bump.
Patent JP-2013074912-A (JP)
Title: Heated toilet seat device
Inventor: KAWAMATA ATSUSHI
IPC: A47K13/24
Filed: 2011-09-29
Abstract: PROBLEM TO BE SOLVED: To provide a heated toilet seat device that has a high energy-saving effect by suppressing heat radiation of the heated toilet seat.SOLUTION: The heated toilet seat device includes: a toilet seat 200; a toilet cover 300 for covering the toilet seat 200; a heater 210 for heating the toilet seat 200; a temperature detector for detecting the temperature of the toilet seat 200; and a controller 410 for controlling energization amount to the heater 210. The controller 410 performs control to close the toilet cover 300, when the temperature of the toilet seat 200 is shifted from a set temperature to a standby temperature which is lower than the set temperature, and when it is detected that the temperature of the toilet seat 200 reaches an intermediate temperature between the set temperature and the standby temperature by the temperature detector.
Patent JP-2013047200-A (JP)
Title: Freshness retaining agent for plant, and method for retaining freshness of plant
Inventor: JOKA MIKIO
IPC: A01N3/00
Filed: 2011-09-30
Abstract: PROBLEM TO BE SOLVED: To provide a freshness retaining agent for a plant such as a vegetable or a flower which is safe when being eaten as it is, and which can show a freshness retaining effect, and to provide a method for retaining freshness of a plant.SOLUTION: This freshness retaining agent for a plant includes hyaluronic acid, The freshness of a plant can be retained by bringing the freshness retaining agent for a plant containing hyaluronic acid into contact with a plant not containing hyaluronic acid. The obtained plant whose freshness is retained excellently can be taken directly, and further an effect for heightening nutritive/healthful function can be expected.
Patent JP-2013079143-A (JP)
Title: Operation device on elevator landing
Inventor: DAIKOKUYA ATSUSHI
IPC: B66B5/00
Filed: 2011-10-05
Abstract: PROBLEM TO BE SOLVED: To provide an operation device on elevator landing capable of housing connector for maintenance and cable for maintenance without causing the breakage of the connector for maintenance and the cutting of the cable for maintenance after maintenance operations.SOLUTION: The operation device on elevator landing includes a case 4 which is disposed on the wall of a landing 1 and houses the cable 14 for maintenance having the connector 14a for maintenance on the edge part thereof, wherein a cover plate with which the case 4 is covered is composed of an inner plate 6 which is fastened to the case 4 and retains a display element comprising a display board 7 and a display cover 9, and an operation buttons 19, and an outer plate 21 which is arranged on the outside of the inner plate 6 and is disposed attachably and detachably on the inner plate 6 and, on the inner plate 6, a take-out port capable of taking-out the cable 14 for maintenance having the connector 14a for maintenance on the edge part thereof is provided on the inner plate 6. The taking-out port comprises an opening part 16a which is blocked by an opening and closing door 16 and a hole 18 formed on the opening and closing door 16.
Patent JP-2012103242-A (JP)
Title: Torque sensor
Inventor: GOTO TADATOSHI
IPC: G01L3/10
Filed: 2011-10-14
Abstract: PROBLEM TO BE SOLVED: To provide a torque sensor having a novel structure where no housing rigidity is required.SOLUTION: A coil assembly CA having first and second coils 11 and 12 fixed around the axial circumference of a torsion bar includes first and second magnetic material ring plates M1 and M2 arranged corresponding to both ends of the first coil, third and fourth magnetic material ring plates M3 and M4 arranged corresponding to both ends of the second coil 12, a synthetic resin section 13 where the first to fourth magnetic material ring plates are integrally insert-molded, and a magnetic cylinder 14 for inserting the synthetic resin section 13 inside to cover the outer peripheral side face of the synthetic resin section. The coil assembly CA is housed in a synthetic resin sensor housing 50. A movable section MS employs a well-known configuration including a first magnetic response member 3 connected to an input shaft 1 and a second magnetic response member 4 connected to an output rotary shaft 2.
Patent JP-2013089886-A (JP)
Title: Semiconductor device, semiconductor device packaging structure, semiconductor device manufacturing method, and semiconductor device packaging structure manufacturing method
Inventor: SAKURAI DAISUKE
IPC: H01L21/60
Filed: 2011-10-21
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device which can achieve high connection reliability by simple means even when external connection electrodes are narrow-pitched.SOLUTION: In a semiconductor device, an external connection electrode is included. The external connection electrode comprises: a metal layer 12 formed on a semiconductor substrate; an insulation layer 13 which is formed so as to abut on the metal layer 12 and also has an opening 13a through which part of the metal layer 12 is exposed; and a barrier metal layer 14 which is formed so as to electrically connect to the metal layer 12 exposed through the opening 13a of the insulation layer 13. The barrier metal layer 14 has a radius of curvature in portions of a line segment which is formed by a plane perpendicular to the insulation layer 13 and the surface of the barrier metal layer 14 intersecting each other, the portions corresponding to regions around the opening 13a of the insulation layer 13.
Patent JP-2013092559-A (JP)
Title: Image display apparatus
Inventor: YANAGAWA HIROTO
IPC: G09F9/00
Filed: 2011-10-24
Abstract: PROBLEM TO BE SOLVED: To provide a thin-type portable image display apparatus.SOLUTION: An image display apparatus 1 has: a display unit main body 10 including a rectangular chassis 11, a display 12 and a drive unit 14 for driving the display 12; and a housing 20 housing the display unit main body 10. The display unit main body 10 is configured to include: the display 12 attached to the front face of the chassis 11 while being interposed by a heat-conducting sheet 13; and drive members 14a-14c disposed in a transverse direction on the back side of the chassis 11. In the drive unit 14, taller electronic components are disposed on a drive circuit board 140b in the center; and shorter electronic components 141a and 141c are disposed on drive circuit boards 140a and 140c on the left and right side, respectively. A rear side housing 22 has a protruding portion 22a formed in an area corresponding to the drive circuit board 140b located in the central area.
Patent JP-2012017474-A (JP)
Title: Resin composition for interconnecting foam, and interconnecting foam using the same
Inventor: MIYAKE YUJI
IPC: C08L23/02
Filed: 2011-10-24
Abstract: PROBLEM TO BE SOLVED: To provide a resin composition useful for forming an interconnecting foam excellent in restoration (and flexibility) and having a uniform open cell structure.SOLUTION: The resin composition is constituted of a non-crosslinkable polyolefinic resin (a low-density polyethylene resin or the like) and a specific aliphatic acid amide (for example, a 10-28C alkanecarboxylic acid monoamide such as stearic acid amide) satisfying expression (1):|Mp-Mp|≤20°C (1) where Mpis a melting point of the non-crosslinkable polyolefinic resin, and Mpis a melting point of the aliphatic acid amide. The proportion of the aliphatic acid amide may be about 0.1 to 10 pts.wt based on 100 pts.wt of the non-crosslinkable polyolefinic resin. The resin composition may further contain a thermoplastic elastomer in order to further improve flexibility.
Patent JP-2012107004-A (JP)
Title: Phenanthrene compound, light-emitting element, light-emitting device, electronic device, and lighting device
Inventor: KAWADA YUUKO
IPC: C07D333/76
Filed: 2011-10-25
Abstract: PROBLEM TO BE SOLVED: To provide a novel compound having high triplet excitation energy, and to provide a novel compound having a bipolar property.SOLUTION: A phenanthrene compound represented by a general formula (G1) is provided, however, in the general formula (G1), Rto Rand Rto Rseparately represent any one of hydrogen, a 1-4C alkyl group, and a substituted or non-substituted 6-13C aryl group. In addition, Ar represents a substituted or non-substituted 6-13C arylene group, and Z represents a sulfur atom or an oxygen atom.
Patent JP-2013093520-A (JP)
Title: Manufacturing method of multilayer wiring board, multilayer wiring board and probe card
Inventor: OTSUBO YOSHITO
IPC: H05K3/46
Filed: 2011-10-27
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board of excellent reliability, and to provide a multilayer wiring board of excellent reliability.SOLUTION: A laminate is prepared by laminating a plurality of ceramic green sheets in which a plurality of via conductors 15 are arranged in order to constitute wiring 14. When preparing the laminate, an insulating material 20 is interposed between the ceramic green sheets adjoining in the lamination direction x, so as to be located between adjoining via conductors 15. The laminate is pressed in the lamination direction x. A multilayer wiring board 1 is obtained by calcining the laminate thus pressed.