baber/WOPTO huggingface dataset:
Patent JP-2004534112-A (JP)
IPC: B04C5/26
Filed: 2002-04-11
Abstract: Fluid catalytic reactor vessel comprising: at its upper end a single centrally positioned primary cyclone having a gas-solids inlet fluidly connected to the downstream end of a fluid catalytic riser, which riser is positioned externally from a fluid catalytic reactor vessel; said primary cyclone further provided with a gas outlet conduit at its upper end fluidly connected to one or more secondary cyclone separators, which secondary cyclone separators are positioned in the space between the centrally positioned primary cyclone and the wall of the reactor vessel and which secondary cyclones have means to discharge solids to the lower end of the reactor vessel and means to discharge a gaseous stream poor in solids to a gas outlet of the reactor vessel; said primary cyclone further provided with a primary stripping zone at its lower end and means to discharge pre-stripped solids from the primary cyclone to the lower end of the reactor vessel; and wherein the reactor vessel further comprises at the lower end of reactor vessel a secondary stripping zone is and means to discharge stripped solids from the reactor vessel.
Patent JP-2003273504-A (JP)
Title: Soldering method
Inventor: OSHIMA MASAYUKI
IPC: B23K3/06
Filed: 2003-01-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a simplified method to additionally supply an oxidation control element to solder bath not using a mother alloy of higher oxidation control element concentration.  <P>SOLUTION: A solder alloy including the oxidation control element of an amount larger than the reduction amount thereof obtained from reduction rate is additionally supplied depending on the reduction amount of solder bath by measuring the reduction rate of the oxidation control element in the solder bath used. Composition of the solder alloy is always held to a constant value as accurately as possible.  <P>COPYRIGHT: (C)2003,JPO
Patent JP-2004220126-A (JP)
Title: Design support method and design support system of base-isolated structure
Inventor: SHIMODA IKUO
IPC: G06F17/50
Filed: 2003-01-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a design support method and design support system of base-isolated structure capable of reducing the labor, time and cost for designing a draft of a desired base-isolated structure.  <P>SOLUTION: This design support system 1 comprises a computer 8 having a design program 5 for designing a bridge on the basis of inputted condition data of the bridge, checking whether the designed bridge satisfies a design basis or not, and calculating the performance and dimensional data required in a laminated rubber in order that the bridge satisfies the design basis on the basis of the checking result, and a transmitting means 7 for forming data including the performance and dimensional data calculated by the design program 5 and transmitting the formed data to a computer 10 through the Internet 6; the computer of a supplier C who forms the draft of the laminated rubber on the basis of the data transmitted from the computer; and a transmitting means 11 for transmitting the formed draft to a designer B.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004221179-A (JP)
Title: Aluminum electrolytic capacitor
Inventor: KAWAHARA KAZUYA
IPC: H01G9/10
Filed: 2003-01-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide an aluminum electrolytic capacitor which assures excellent bonding of an anode foil and/or a cathode foil and lead wires for leading out to the external side and also assures excellent connection reliability.  <P>SOLUTION: Junction between a flat surface of the lead wire 5 for leading out to the external side and the anode foil and/or cathode foil is realized by caulking at least two or more points at both ends of junction and a plurality of compressed junctions on the line connecting the caulked junctions at both ends. Accordingly, higher junction strength can be attained through the caulked junctions provided respectively at both ends of the flat surface. Moreover, the stable connection having low resistance can be realized with the compressed junctions provided on the line coupling the caulked junctions at both ends. Accordingly, the aluminum electrolytic capacitor having sufficient junction strength and connection reliability can be realized enabling application to a small size electronic component which has been difficult for the component formed only by caulking.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004187257-A (JP)
Title: Multi-carrier transmission apparatus and multi-carrier transmission method
Inventor: SUDO HIROAKI
IPC: H04W52/24
Filed: 2003-01-15
Abstract: <P>PROBLEM TO BE SOLVED: To remarkably improve an error rate characteristic of transmission data for which excellent quality is required, and to prevent deterioration in the quality of the transmission data for which excellent quality is required.  <P>SOLUTION: An encoding part 101 performs turbo encoding to the transmission data to output parity bit data and systematic bit data for which high quality is required. A modulation part 102 modulates the parity bit data and the systematic bit data. A subcarrier location part 103 relocates the transmission data, such that the systematic bit data is located in a subcarrier near a center frequency and the parity bit data are located in a subcarrier near both ends. An OFDM part 104 performs orthogonal frequency division multiplexing on the transmission data to locate the parity bit data and the systematic bit data in the subcarriers.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2003324007-A (JP)
Title: Method of manufacturing laminated ceramic electronic component
Inventor: MIHARA KENJIRO
IPC: H01C17/065
Filed: 2003-01-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of stably manufacturing a laminated ceramic electronic component such as a laminated positive temperature coefficient thermistor of high reliability.  <P>SOLUTION: A method of manufacturing the laminated ceramic electronic component such as the laminated positive temperature coefficient thermistor comprises a process 41 of forming a green laminate containing a thermistor green layer for a thermistor layer, as a ceramic layer and a conductive paste layer for an internal electrode; a process 42 of thermally treating the green laminate at a temperature of 80 to below 300°C; a process 43 of polishing the thermally treated green laminate through a dry barrel polishing method; a process 44 of forming a conductive paste film for a external electrode on each end face of the green laminate; and a process 45 of baking the green laminate together with the conductive paste film.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004263881-A (JP)
Title: Heat transfer fin, heat exchanger, evaporator and condenser for car air conditioner
Inventor: YAMAUCHI SHINOBU
IPC: F25B39/04
Filed: 2003-01-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a heat transfer fin for improving heat transfer efficiency, reducing a pressure loss, and having superior heat exchange performance.  <P>SOLUTION: A corrugate fin 53 is arranged between a plurality of respective heat exchange tubes 51 and 52. The corrugate fin 53 is formed by meanderingly continuously connecting louver fins 54 arranged in parallel at a prescribed interval in the tube longitudinal direction. A ventilation passage 56 is formed between the respective louver fins 54, and a plurality of louvers 55 are formed in a cut and raised manner at a proper interval in the louver fins 53. The windward side edges 54a and 55a of the louver fins 54 and the louvers 55 are formed in a semi-elliptic shape getting thinner toward the windward side.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004225852-A (JP)
Title: High pressure tank
Inventor: KUBO HIDETO
IPC: H01M8/04
Filed: 2003-01-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a high pressure tank for securing the sealing performance of the joint surfaces of split portions of a liner of a split type.  <P>SOLUTION: On the inner face of a base end side cover portion 7, a grooved portion 22 is formed ranging from a protruded portion 17 all over in the peripheral direction. The grooved portion 22 is located near the outside end of the protruded portion 17 in a radial direction R, and its depth extends near a position where the groove bottom is thinner than other portions. A thinner portion 23 and a bendable portion 24 are formed on the groove bottom of the grooved portion 22 and between the grooved portion 22 and a body 5, respectively, by forming the grooved portion. When a high pressure condition is established in a hydrogen tank 1, the body 5 is expanded to the outside and at the same time the thinner portion 23 is elongated, the bendable portion 24 is in a bent state, and a seal portion with an O-ring 26 follows the expansion of the body 5 to secure sealing performance.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004235407-A (JP)
Title: Method for plasma processing
Inventor: SAITO MITSUHISA
IPC: H01L21/3065
Filed: 2003-01-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for plasma processing which can control a plasma generating region to an arbitrary size by using only one plasma source.  <P>SOLUTION: A microplasma source has an outside plate 1, inside plates 2 and 3 and an outside plate 4 made of ceramics. An outside gas channel 5 and an outside gas jet port 6 are respectively provided in the outside plates 1 and 4. An inside channel 7 and an inside gas jet port 8 are respectively provided in the inside plates 2 and 3. A high-frequency power is supplied to an electrode 14 to which the high-frequency power is applied, via through holes 16 provided at the outside plates 1 and 4. The plasma generating region can be controlled to the arbitrary side by changing a distance between the microplasma source and a material to be processed on the way of the plasma processing.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004234309-A (JP)
Title: Printed board evaluation supporting system
Inventor: KOYAMA NOBUYUKI
IPC: H05K3/00
Filed: 2003-01-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a printed board evaluation supporting system capable of evaluating the configuration of a build-up substrate on the basis of information obtained at the initial stages of framework design and circuit design.  <P>SOLUTION: The printed board evaluation supporting system is constituted of an all-component number-of-pin pairs setting part for setting the number of pin pairs between main IC components which is reference information in circuit design, a circuit inference part for inferring a circuit scale, a board size setting part for setting the size of a printed board, the number of layers and the sorts of the layers, a wiring parameter setting part for setting wiring parameters on the printed board, and an evaluation part for evaluating the size of the printed board, the number of layers and the kinds of the layers.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004235506-A (JP)
Title: Light emitting element and its fabricating process
Inventor: HAGIMOTO KAZUNORI
IPC: H01L33/40
Filed: 2003-01-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a process for fabricating a light emitting element having a structure formed by pasting an emission layer part and an element substrate through a metal layer in which metallurgic reaction of the element substrate and the metal layer can be prevented effectively during heat treatment for pasting and thereby pasting strength and reflectivity are prevented from lowering through the metallurgic reaction.  <P>SOLUTION: On the major surface of the element substrate 7 being bonded with a compound semiconductor layer 24, a diffusion blocking layer 10d composed of a conductive material and blocking diffusion of components deriving from the element substrate 7 into a main metal layer is formed. Main metal layers 10a and 10b are formed on at least any one of the major surface of the compound semiconductor layer 24 and the major surface of the diffusion blocking layer 10d formed on the element substrate 7. The element substrate 7 and the compound semiconductor layer 24 are then laid in layer through the diffusion blocking layer 10d and the main metal layers 10a and 10b. Under that state, they are pasted and heat treated thus pasting the element substrate 7 and the compound semiconductor layer 24 through the diffusion blocking layer 10d and the main metal layer 10.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004233804-A (JP)
Title: Display device and guide light apparatus
Inventor: MITSUDA HIROSHI
IPC: F21V8/00
Filed: 2003-01-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a display device and a guide light apparatus which enables a connection operation between a light source part and a lighting means and a replacement operation of an electric component to be more convenient and simpler.  <P>SOLUTION: The display and guide light apparatus is provided with a device body 1 having an opening part 3 on the front surface, a display means 17 which has a light guiding plate 19 and a light source part 20 applying the light from a side part of the light guiding plate 19 and closes the opening part 3 with a size smaller than the opening part 3, a lighting means 12 which is stored in the device body 1 and has the electric component for lighting the light source part 20 and a closing means 22 which closes the opening part 3 together with the display means 17.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004236189-A (JP)
Title: Display device
Inventor: KATO SHIGERU
IPC: H04N5/64
Filed: 2003-01-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a display device which is rather not an obstacle for a wearer when a display section is not used and has good external appearance, with respect to the display device used to be mounted on the head.  <P>SOLUTION: The device is provided with a display means for displaying an image to the wearer, a supporting means for supporting the display means, and a mounting means which supports the supporting means and is to be mounted at a position where it does not cover the front of a face. When the mounting means is mounted, the display means can move between a position in use as a position on the front of the eyes of the wearer and a position out of use as a position near the ears of the wearer.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004237365-A (JP)
Title: End mill
Inventor: WATANABE KENJI
IPC: B23C5/10
Filed: 2003-02-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide an end mill which prevents clogging with chips, smoothly discharges the chips allowing them to wind about the tool, and achieves a highly efficient machining.  <P>SOLUTION: The end mill comprises chip discharging grooves, bottom blades 17a, and cutting faces 19. Each chip discharging groove is formed in a peripheral surface of a front end of a tool main body rotatable about a tools axial line. Each bottom blade extending from the periphery of the tool main body to the tool axial line, is formed along an intersecting ridge line between a groove wall surface 13 in the chip discharging groove, facing a tool rotating direction, and a front end face of the tool main body. Each cutting face is formed at the tip of the groove wall surface 13, along the bottom blade 17a. Herein the cutting face 19 has a step portion 21a formed along the bottom blade 17a, for colliding chips produced by the bottom blade 17a therewith.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2003301220-A (JP)
Title: Heat treatment method for metal ring
Inventor: IMAI HITOSHI
IPC: C21D1/76
Filed: 2003-02-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide a heat treatment method for imparting superior hardness to a metal ring.  <P>SOLUTION: This heat treatment method comprises correcting a peripheral length of the metal ring made of a maraging steel, then sub-aging the metal ring in a non-oxidative atmosphere, subsequently cooling it to such a temperature as an again precipitation reaction stops, and nitriding it in the atmosphere including at least an ammonia gas. The above sub-aging treatment is performed under a vacuum condition of 10<SP>-2</SP>Pa or lower, and holds the above metal ring at an aging temperature of 400-500°C for 2-3 hours. Alternatively, the above aging treatment is performed in a reduced atmosphere which contains hydrogen of 1-30 vol.% of a total capacity and the balance nitrogen, and has an atmosphere dew point in a range between -40°C and -70°C, and holds the above metal ring at the aging temperature of 420-480°C for 2-3 hours. The above nitriding treatment comprises setting such a time and a temperature that the Larson-Miller parameter P is in a range of 14.7-15.3, and heating the above metal ring in the atmosphere which contains ammonia of 60-80 vol.% of the total capacity and the balance nitrogen.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004238683-A (JP)
Title: Method for treating copper-etching waste liquid
Inventor: MATSUMOTO HIROMICHI
IPC: C02F1/461
Filed: 2003-02-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for recovering copper from a copper-etching waste liquid containing sulfuric acid, hydrogen peroxide and a hydrogen peroxide stabilizer, without producing sludge, wasting electricity, considering variations in current efficiency caused by variations in a composition of copper and hydrogen peroxide, and causing an increase of the cost.  <P>SOLUTION: The method for treating the copper-etching waste liquid comprises heating the copper-etching waste liquid containing sulfuric acid, hydrogen peroxide and a hydrogen peroxide stabilizer containing an organic compound, to 60 to 80°C, keeping the liquid in the same temperature range for 0.5 to 10 hours to decompose hydrogen peroxide, and then recovering a copper content as metallic copper through electrolysis. The treatment method further comprises, prior to the electrolysis, mixing a copper separation-treated waste liquid from which the copper content has been already recovered as metallic copper, with the copper-etching waste liquid to decrease COD, and then electrolyzing the resultant liquid to recover copper with high purity.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004240261-A (JP)
Title: Wavelength selective phase plate and projection display apparatus using the same
Inventor: SUZUKI TETSUJI
IPC: G03B21/00
Filed: 2003-02-07
Abstract: <P>PROBLEM TO BE SOLVED: To provide a wavelength selective phase plate having excellent heat resistance by laminating a plurality of layers of alicyclic polyolefin resin films according to the color to be applied, and to provide a projection display apparatus using the wavelength selective phase plate.  <P>SOLUTION: The wavelength selective phase plates 16, 17 for G light and wavelength selective phase plates 18, 19 for R light are obtained by laminating a plurality of layers of alicyclic polyolefin resin films having birefringence given by stretching an alicyclic polyolefin resin according to the colors to be applied. These plates are used to constitute the projection display apparatus 300.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004243572-A (JP)
Title: Image recording apparatus and system equipped with dynamic hue correction method
Inventor: TAKAHASHI YOSHIHIRO
IPC: B41J2/01
Filed: 2003-02-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image forming apparatus capable of easily printing an image of high hue quality on media having various color forming characteristics for a short time without requiring user's special consciousness, operation and procedure, and a system for using it.  <P>SOLUTION: The image forming apparatus and the system are constituted so that the printing result of the first pass or the like in multi-pass printing is scanned after printing to acquire the color forming state in an actual medium and this data are used to correct the printing data or printing method of a pass from now on to complete an image, and thereby, a printing automatically corrected to the optimum hue is applied to media having various color forming characteristics.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004247515-A (JP)
Title: Method for accelerating electronic component poor package rate, and method for comparing electronic component poor package rates
Inventor: UTSUNOMIYA ISAMU
IPC: H05K3/34
Filed: 2003-02-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for accelerating electronic component poor package rates for enabling a significant comparative test by intentionally accelerating the occurrence of poor packages, such as tombstones, and to provide a method for comparing electronic component poor package rates.  <P>SOLUTION: Electronic component 2a, and a test board 1a wherein a plurality of land patterns 4 are formed each corresponding to one of the external electrodes 3 built at both ends of the electronic components 2a, are prepared. A conductive bonding material 5 is attached to each land pattern 4 and then the electronic components 2a are arranged, and the test board 1a is subjected to a reflow treatment. These steps are performed at least once, and a plurality of test pieces 9 are obtained, each different from the others concerning at least one out of the electronic component 2a, the land pattern 4, the constituents of the conductive bonding material 5, the position of the electronic component 2a as mounted, and the reflow conditions. A tombstoning rate is determined for each of the test pieces 9, and comparison is established.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004252544-A (JP)
Title: Application program managing means and management device
Inventor: FUJISAWA KUNIMASA
IPC: G06F3/0482
Filed: 2003-02-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide an application program managing means capable of starting a lot of application programs.  <P>SOLUTION: This application program managing means is provided with a means for preparing the list of application programs which are not displayed although started by switching a display switching button or tab, and for switching the application program in the list and the application program which can be displayed by switching the display switching button or tab through a network or the like. Thus, it is possible to start a lot of application programs. Also, the application program which is not usually displayed and the display application program are switched based on user information, use frequency information and use date information so that it is possible to display a proper application program on a picture for each user who logs in.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004253507-A (JP)
Title: Locally cleaned wafer processing apparatus
Inventor: MATSUMOTO MASANORI
IPC: H01L21/68
Filed: 2003-02-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a locally cleaned wafer processing apparatus which can efficiently process a wafer having a different size from the wafer housed in a pod.  <P>SOLUTION: The locally cleaned wafer processing apparatus 20 includes a first loading port in which the pod for housing the wafer of a mechanism closely mounted in the apparatus for opening a cover is placed; and a second loading port having a cassette placing base for placing an open cassette containing the wafer, and a window 3 of the size capable of conveying the wafer into the apparatus 20 and having an opening/closing door 3a in the locally cleaned wafer processing apparatus 20 corresponding to the wafer outlet of the open cassette. When the pod is placed in the first loading port, the wafer housed in the pot in the state that the opening/closing door 3a is closed is conveyed. When the open cassette is placed on the cassette placing base, the wafer housed in the open cassette is conveyed in the state that the opening/closing door 3a is opened.  <P>COPYRIGHT: (C)2004,JPO&NCIPI