baber/WOPTO huggingface dataset:
Patent JP-2008034654-A (JP)
Title: Manufacturing method for wiring substrate, wiring structure used therefor, and manufacturing method thereof
Inventor: OKAMOTO KAZUHISA
IPC: H05K3/00
Filed: 2006-07-28
Abstract: <P>PROBLEM TO BE SOLVED: To solve problems of damage to a metal mold caused when molding is repeated many times, especially, when a metal mold such as a metal pile for forming a through-hole or via hole is bent or broken owing to repetition of molding.  <P>SOLUTION: A manufacturing method for a wiring substrate includes the stages of: fabricating a resin plate 10 having a hole 12 for forming thickness-directional wiring; forming a first metal layer 16 covering at least one main surface of the resin plate and an internal wall surface of the hole by plating the resin plate; fabricating a wiring structure 30 such that a base made of the first metal layer covering the one main surface of the resin plate, and the thickness-directional wiring made of the first metal layer covering the internal wall surface of the hole of the resin plate, are formed in one body by removing the resin plate; and forming an insulating layer 58 united with the wiring structure so that the thickness-directional wiring of the wiring structure is buried except at least a portion of its end.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008033706-A (JP)
Title: Tag with attachment
Inventor: INOUE TAIJI
IPC: G06K19/00
Filed: 2006-07-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a tag with an attachment, which can ensure bundling with high flexibility and be produced at low cost with a small and simple structure.  <P>SOLUTION: The tag with an attachment comprises a bundling band 4 consisting of a flexible band part 1 which extends narrowly and a bundling part 3 provided at one end side of the band part 2 to which the other end side of the band part is fixed; a bar-like RFID tag body 5 disposed in a closely fitted state along the band part 2; and a heat-shrinkable tube 6 covering the RFID tag body 5 in a closely fitted state with the band part 2 and laid in a contracted state. The RFID tag body 5 is disposed distant from the bundling part 3.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008033720-A (JP)
Title: Design data management system
Inventor: OIDA MIKINORI
IPC: G06Q50/00
Filed: 2006-07-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a design data management system which reports, when design data is changed, a change schedule prior to the actual change.  <P>SOLUTION: A configuration data server 1 registers configuration data composed of attribute information of design data in linkage with the design data for each product. A drawing registration server 2 registers the design data. A registration terminal 3 registers the configuration data to the configuration data server 1, and registers the design data to the drawing registration server 2. A reference terminal 4 refers to the configuration data and the design data. When the configuration data is changed, the configuration data server 1 extracts change information for design data to be changed based on a difference of the configuration data before and after the change, and transmits the change information as a schedule announcement to the reference terminal 4 prior to the change of the design data.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008031365-A (JP)
Title: Equipment for manufacturing water-repellent powder
Inventor: KOBAYASHI SHINICHIRO
IPC: F26B17/00
Filed: 2006-07-31
Abstract: <P>PROBLEM TO BE SOLVED: To reduce in size the equipment for manufacturing, after subjecting a mixture of water-repellent powders and water to treatment, the water-repellent powders as an end product.  <P>SOLUTION: In the main unit (15) of the manufacturing equipment (10), many conveying trays (70) are arranged up and down. Into each conveying tray (70) is placed the half-finished product obtained as a mixture of PTFE powders and water. In the ascent side space (26), the conveying trays (70) move upwards and in the descent side space (27), they move downward. Each conveying tray (70) passes the first drying zone (41), the second drying zone (42) and the heat treatment zone (43) in turn. In the first drying zone (41), is conducted the drying treatment utilizing microwave and in the second one (42), is performed the drying treatment utilizing hot air. In the heat treatment zone (43), the temperature of the dried PTFE powders is kept at about 160°C. The half-finished product on the conveying trays (70) passes these three zones in turn to end up in the PTFE powders as the finished product.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008012515-A (JP)
Title: Apparatus for decomposition and heat treatment of garbage component
Inventor: AOKI YOSHIO
IPC: B09B3/00
Filed: 2006-07-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a garbage component decomposition heat treatment apparatus for decomposing and reducing organic substances by heat energy of plasma and arc generated by magnetic force using magnetic poles set face to face in the inside of a decomposition treatment chamber of a garbage treatment main body, without utilizing incineration treatment by burning various types of organic substances.  <P>SOLUTION: A garbage treatment main body is formed in an approximately cubic shape and three chambers: a decomposition chamber, a cooling water chamber, and a spraying chamber from one end side, are integrally constructed. The decomposition chamber is made to have a double structure, and a water bath is formed in the entire inner periphery and mutually opposed different magnetic poles are installed face to face. A plurality of air injection pipes for air suction are inserted from outside of the magnetic poles and water bath. Further, a cooling pipeline in which high-temperature gas flows is installed in the cooling water chamber and a bubbling pipe for generating bubbles is laid in the bottom part. In the spraying chamber, a spraying nozzle is laid on the opposite to a gas generation pipe and a water filtration apparatus is disposed in the bottom part.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008039985-A (JP)
Title: Image projector
Inventor: IMAIDE SHINICHI
IPC: G03B21/00
Filed: 2006-08-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image projector for displaying excellent projected images by achieving the reduction of unnecessary light unused in image formation.  <P>SOLUTION: The image projector is provided with: a light source part 2; a tapered rod 3 for enhancing a degree of parallel of illumination light emitted from the light source part 2; and a light branched part 4 for branching the illumination light from the tapered rod 3 into two optical paths L1 and L2. The image projector 1 is provided with: DMD 5a and 5b giving modulation in response to image data to the branched illumination light on each optical path L1 and L2; and projection optical parts 6a and 6b for projecting light modulated by DMD 5a and 5b, and displays images by superposing light projected by each projection optical part 6a and 6b on a screen 15.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008041867-A (JP)
Title: Manufacturing method of soldered circuit board
Inventor: SHOJI TAKASHI
IPC: B23K101/42
Filed: 2006-08-04
Abstract: <P>PROBLEM TO BE SOLVED: To solve problems in a method for forming a solder circuit by causing an adhesiveness imparting compound react on the electrode surface, thereby imparting adhesiveness that the solder powder comes into spot contact with the circuit board and tends to fall off therefrom when ordinary solder powder is employed, and that the thickness control of a solder layer is difficult because the thickness of a formed solder layer must be controlled by the particle size of solder powder, and to provide a highly reliable soldered circuit board in which a variation in the thickness of the solder layer is suppressed, and an electronic circuit component mounting an electronic component which can achieve high reliability and high packaging density.  <P>SOLUTION: Adhesiveness is imparted to the circuit surface of an electronic circuit board. Solder particles are processed to have predetermined shapes, e.g. the solder particles are obtained by punching sheetlike solder or rodlike solder particles obtained by cutting wirelike solder to predetermined lengths, and are made to adhere to the adhesive part. Subsequently, the electronic circuit board is heated and the solder is melted, thus forming a solder circuit in the manufacturing method of the soldered circuit board.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008272545-A (JP)
Title: Detoxification treatment method of asbestos-containing scrap wood
Inventor: HIRABAYASHI KATSUMI
IPC: B09B3/00
Filed: 2006-08-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide the detoxification treatment method of asbestos-containing scrap wood, by which a lot of asbestos-containing scrap wood can be certainly subjected to a detoxification treatment and further treated asbestos-containing scrap wood can be utilized as resources as it is.  <P>SOLUTION: In the detoxification treatment method of the asbestos-containing scrap wood, the asbestos-containing scrap wood is charged in a rotary kiln 5 for cement calcination from the front 5a of the kiln to detoxify the asbestos. In the method, the asbestos-containing scrap wood is molded to a flat flake Y and the asbestos-containing scrap wood molded to the flat flake Y is transported into the rotary kiln 5 under air pressure while being crushed by the compressed air A.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2008046670-A (JP)
Title: Flow-control valve
Inventor: FURUKAWA AKIRA
IPC: F16K1/00
Filed: 2006-08-10
Abstract: <P>PROBLEM TO BE SOLVED: To reduce a risk of valve leakage by improving displacement between an axis of a cylindrical section 12 and an axis of a valve member 7 in a flow control valve 1 which uses a stepping motor 2 as an actuator.  <P>SOLUTION: A flow-control valve 1 is equipped with; an axial member 5 which converts torque given by a stepping motor 2 to an axial force and is displaced in an axial direction according to the axial force, and a valve member 7 which is pressed so as to be in contact with the axial member 5 by a spring 6 and displaced in the axial direction according to the biasing force by the spring 6 and the axial force transmitted from the axial member 5, and displaces the valve member 7 by displacing the axial member 5 and controls a degree of opening of a bypass flow path 3. Thereby the valve member 7 can be displaced without restraining the axial center by an engaging structure of the axial member 5 and a rotor. Consequently, since the valve member 7 can displace its own axial center in nearly alignment with the axial center of the cylindrical section 12 irrelevantly to the axial center of a rotor and the risk of the valve leakage can be reduced.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007288122-A (JP)
Title: Active matrix substrate, manufacturing method thereof, electro-optical device and electronic equipment
Inventor: JIROKU HIROAKI
IPC: G02F1/1368
Filed: 2006-08-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an active matrix substrate capable of eliminating the necessity of formation of a metal film for mask in laser annealing after formation of a semiconductor film, and to provide the active matrix substrate, an electro-optical device and electronic equipment.  <P>SOLUTION: (a) A light-shielding film 49 containing metal is formed and patterned on a substrate 10. Then, (b) an silicon oxide film 41 and (c) amorphous silicon film 42A are laminated so as to cover the light-shielding film 49. Then, the amorphous silicon film 42A is crystallized by irradiating (d) the substrate 10 with a laser beam, and a polycrystalline silicon film 42P having high mobility is formed. In this case, since the light-shielding film 49 works as a mask, the amorphous silicon film 42A is not crystallized but remains in a region where the light-shielding film 49 is formed. The amorphous silicon film 42A and the polycrystalline silicon film 42P having different mobility which are obtained in this way are each used as a semiconductor film of TFT in the pixel region 5 and the driving circuit 6.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008053814-A (JP)
Title: Video and audio output system
Inventor: ONISHI KAZUAKI
IPC: H04N5/44
Filed: 2006-08-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a video and audio output system that automatically switch the input of a television receiver when reproducing equipment is used, and automatically turns on the power source of the reproducing equipment when the input of the television receiver is switched to the side of the reproducing equipment.  <P>SOLUTION: Once the television receiver is powered on when a DVD recorder is powered on in a state wherein the television receiver and the DVD recorder are powered off, a process of switching the input of the television receiver to the DVD recorder side and a process associated with the switching process are performed. Further, when the input of the television receiver is switched to the DVD recorder side in a state wherein the television receiver is power on and the DVD recorder is power off, a process of power on the DVD recorder and a process associated with initialization of the television receiver are performed.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007294839-A (JP)
Title: Laminated capacitor and mounting structure thereof
Inventor: SHIMIZU NAOKI
IPC: H05K1/18
Filed: 2006-08-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a laminated capacitor with an excellent reliability which can enhance a surge withstand voltage, whereby it is difficult to cause a breakdown and the like upon a static electricity discharge.  <P>SOLUTION: In the laminated capacitor in a ceramic laminate 2, first and second internal electrodes 3, 4 are disposed one over the other through a ceramic layer. An outer surface of the ceramic laminate 2 has thereon a first external electrode 5 electrically connected to the first internal electrode, a second external electrode 6 electrically connected to the second internal electrode, and third external electrodes 7A, 7B. With this structure, a different potential is connected to the first and second internal electrodes 3, 4. The third external electrodes are not electrically connected to any one of the first and second internal electrodes 3, 4, and are formed on the outer surface of the ceramic laminate 2 so as to have an electrode portion located between the first external electrode 5 and the second external electrode 6. With this structure, a surge current is made to escape from the third external electrodes.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008053382-A (JP)
Title: Mounting machine
Inventor: TSUKAGOSHI KAZUHIRO
IPC: H05K13/02
Filed: 2006-08-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a mounting machine which can reduce waste of the components.  <P>SOLUTION: When tape feed operation for feeding out a component 64 held on a component feed tape 60 to a pickup position 53 is performed and pickup of the component 64 by means of a mounting head failed, tape feed operation is not performed at the time of next pickup. Consequently, the component 64 which was left at the pickup position 53 due to failure of pickup can be reused at the time of next pickup, thus preventing the components from being discarded and wasted.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007084928-A (JP)
Title: Backing plate made of copper alloy, and method for producing the copper alloy
Inventor: FUYU KIYOUHEI
IPC: B21B1/26
Filed: 2006-08-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a backing plate made of a copper alloy in which deformation is hard to occur, and which combines excellent characteristics in thermal conductivity, 0.2% proof stress, a Young's modulus and oxidation resistance; and to provide a method for producing the same.  <P>SOLUTION: A copper alloy for a backing plate, which has a composition comprising, by mass, 1.0 to 5.0% Ni and 0.2 to 1.0% Si in such a manner that the mass ratio Ni/Si lies in the range of 3.5 to 5.5, and further comprising at least one or more kinds selected from Zn, Sn, P, Fe, Mg, Cr, Zr, Ti, Mn and Ag by 0.01 to 3.0% in total, and the balance Cu with inevitable impurities, does not comprise inclusions having the maximum crystal grain size of ≤0.06 mm and a diameter of >0.005 mm, and has a thermal conductivity of ≥170 W/m×K, is produced through a casting stage, a hot rolling stage, solution treatment stage, a cold rolling stage and an aging treatment stage.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2008053448-A (JP)
Title: Mis-type field effect transistor and manufacturing method thereof
Inventor: OTA HIROAKI
IPC: H01L29/12
Filed: 2006-08-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a group III-V nitride semiconductor MIS type field effect transistor suitable for application to a power device.  <P>SOLUTION: The field effect transistor is composed by arranging a nitride semiconductor lamination structure section 2 on a sapphire substrate 41. The nitride semiconductor lamination structure section 2 comprises: an n-type AlGaN layer 9; an n-type GaN layer 5; a p-type GaN layer 6; and an n-type GaN layer 7. A trench 16 having a V-shaped section is formed at the nitride compound semiconductor lamination structure section 2, a gate insulation film is formed on a wall surface 17 in the trench 16, and further a gate electrode 20 is formed so that it opposes the wall surface 17 while sandwiching the gate insulation film 19. The n-type AlGaN layer 9 has an extraction section 10 extracted laterally from the nitride semiconductor lamination structure section 2. A drain electrode 15 is formed so that it is in contact with the extraction section 10.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008051417-A (JP)
Title: Cooling device
Inventor: YASUJIMA KENTETSU
IPC: F25D19/00
Filed: 2006-08-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide an environment-friendly cooling device such as an automatic vending machine by efficiently cooling commodities stored in each commodity storage by utilizing the cold generated by a Stirling refrigerator even in a machine chamber space limited in its height.  <P>SOLUTION: In this cooling device using the Stirling refrigerator, an evaporator has a branching header for branching a refrigerant flowing in from a cold transferring means, a collecting header for collecting the refrigerant flowing out from the cold transferring means, and a group of pipes composed of pipes connected in parallel between the branching header and the collecting header, an outlet of the collecting header is positioned at an uppermost stage of the group of pipes, and an inlet of the branching header is positioned at a lowermost stage to secure cooling performance.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008056502-A (JP)
Title: Apparatus for molding optical element
Inventor: TANAKA TAKASHI
IPC: B29C43/32
Filed: 2006-08-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide an apparatus for molding an optical element reducing the time needed for stabilizing the temperature of a set of molds after heating is started.  <P>SOLUTION: The apparatus is for molding an optical element by conveying a set of molds 15, where an optical element material is placed between the upper mold and the lower mold, in sequence to each process stage, i. e. heating, press-molding, and cooling, where a thermocouple 26 is embedded in the plate 1 of the heating stage around the lower surface of the lower mold of the set of molds. Electricity is supplied independently to respective infrared lamps 22 arranged to be moving up and down in an infrared lamp heating apparatus 4. More electricity is supplied for heating the plate to the infrared lamps placed at the lowest row which are located nearest to the plate than those supplied to the other infrared lamps placed at the middle and upper rows. Since the thermocouple is embedded in the plate and does not receive directly the radiant heat from the infrared lamps, it can feed back a stable detected signal to a heater control unit (not shown) and a designated temperature can be attained within a short time after heating is started.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008059659-A (JP)
Title: Optical pickup
Inventor: HATANO SHINYA
IPC: G11B7/135
Filed: 2006-08-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide an optical pickup including two objective lens different in numerical apertures, and to enhance the accuracy of recording/reproducing of a plurality of optical disk media, such as CDs, DVDs, and BDs, even when the objective lenses, an objective lens holder include errors, to suppress the occurrence of a failure due to contact of the objective lens and (or) the objective lens holder and the optical disk media, such as CDs, DVDs, and BDs, and to suppress the occurrence of an accident during recording/reproducing.  <P>SOLUTION: The optical pickup includes a first objective lens 38, a second objective lens 48 having a numerical aperture different from that of the first objective lens 38, and an objective lens holder 24. The first objective lens 38 is attached to the objective lens holder 24 via a spacer 27 that has a cylindrical shape and is provided with a lens receiving portion 271 of a stepped shape for receiving the first objective lens 38, a protruding portion 272 having cushioning properties that protrudes from the upper surface, and a salient portion 275 having a spherical shape formed at the lower surface. The protruding portion 272 is formed so that a tip thereof is closer to an optical disc medium than any other part of the objective lens holder 24.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008054914-A (JP)
Title: Game machine
Inventor: TSUMEKAWA NOBUTOSHI
IPC: A63F7/02
Filed: 2006-08-31
Abstract: <P>PROBLEM TO BE SOLVED: To enhance the efficiency of game processing by reporting an abnormality to players and attendants in a straightforward manner upon connecting a sensor needed for game control and a sensor for preventing fraudulence to a main control device and a sub control device.  <P>SOLUTION: Game abnormality detecting sections (a magnetism detecting sensor 46, a radiowave detecting sensor 47, a vibration detecting sensor 83) detecting abnormal action provided from the outside of a game machine and a game relating control device (a game control device 100) are separatedly arranged and a reporting relating control device reporting abnormality by controlling a reporting device by abnormality reporting command from the game relating control device in a game machine is arranged in a game machine. The reporting relating control device receives the signal from the game abnormality detecting sections without passing through the game relating control device, and the reporting relating control device a reporting control means determining the content of the abnormality reported by the reporting device based on the input signal from the game abnormality detecting section and the abnormality reporting command signal from the game relating control device.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008042862-A (JP)
Title: Wireless lan communication system, method thereof and program
Inventor: NAKATSUMA SHIGEHIRO
IPC: G06Q30/02
Filed: 2006-08-07
Abstract: <P>PROBLEM TO BE SOLVED: To improve value of an advertisement and to increase advertising revenue so as to provide, as a result, free or low-priced public wireless LAN services to a user.  <P>SOLUTION: A wireless LAN communication system 1 includes: an authentication means 9 which authenticates a wireless LAN device 6 when the wireless LAN device 6 requests a connection to a wireless LAN access point 5; and advertising means 11, 12, 13 each for distributing an advertisement to the wireless LAN device 6 when the wireless LAN device 6 requests the connection to the wireless LAN access point 5, wherein the authentication means 9 completes the authentication of the wireless LAN device 6 after the wireless LAN device 6 meets the display ending conditions of advertisements transmitted from the advertising means 11, 12, 13.  <P>COPYRIGHT: (C)2008,JPO&INPIT