baber/WOPTO huggingface dataset:
Patent JP-2011076238-A (JP)
Title: Image layout determining method as well as program and information processing apparatus for the method
Inventor: YAMAJI HIROSHI
IPC: H04N5/265
Filed: 2009-09-29
Abstract: <P>PROBLEM TO BE SOLVED: To determine a visually appealing layout of a set of a composite image and a still image.  <P>SOLUTION: In S8, subject types of a still image material and a panoramic image are different, for example, if the subject type of the still image material is animal and the subject type of the panoramic image is landscape, a layout determination unit 9 determines a representative position in the point image as a position for placing the still image material. In S9, if a point image is of the same subject type, the layout determination unit 9 determines, as the position for placing the still image material, a position outside the area of the panoramic image near the representative position in the point image. If there are a plurality of still image materials shot with different zoom factors and corresponding to the same point image, the layout determination unit 9 can determine the layout of the still image materials according to the zoom factor for each still image material.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010004075-A (JP)
Title: Transformer for power distribution
Inventor: HOSOKAWA MASAO
IPC: C22C38/00
Filed: 2009-09-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide an oil-immersed transformer in which a tank is improved in corrosive resistance since the oil-immersed transformer has a problem of oil leakage due to corrosion of the tank etc.  <P>SOLUTION: The tank and an upper lid of the transformer are made of ferrite-based stainless steel, and contain one or more kinds among 7.0 to 14.0% by mass of Cr and 0.08 to 2% of Ti, 0.08 to 2% of Nb, 0.01 to 1% of Al, 0.08 to 2% of Ni, 0.08 to 2% of Cu, 0.08 to 2% of Mo, and 0.08 to 2% of W to be improved in corrosion resistance. Further, components of the material are suitably selected not to impair processability of manufacture.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011075780-A (JP)
Title: Fixing apparatus and image forming apparatus
Inventor: NAGAI YOSHIYUKI
IPC: G03G15/20
Filed: 2009-09-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a fixing apparatus capable of reducing the influence of heat from a second fixing roller on the surface of an image while employing a simple structure, or to provide an image forming apparatus capable of forming a favorable image.  <P>SOLUTION: The fixing apparatus has: a first fixing roller pair 91 which has a first heating roller 91a heating transfer material carrying an image, and which has a first pressure roller 91b being in contact with the first heating roller 91a; a fixing portion suction guide 300 which has a fixing portion suction surface 302 performing the suction vertically and upwardly, while directing vertically and downwardly a surface carrying the image of the transfer material S heated by the first fixing roller pair 91, and which guides the transfer material S; a second fixing roller pair 92 which fixes the transfer material S guided by the fixing portion suction guide 300, and which has a second heating roller 92a disposed below in a vertical direction and heating the transfer material S and which has a second pressure roller 92b disposed above the second heating roller 92a in the vertical direction and being in contact with the second heating roller 92a; and movement members 93 to 99 which cause the second pressure roller 92b to move vertically and upwardly.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011076370-A (JP)
Title: Deployment system
Inventor: AOYANAGI YOSHIMITSU
IPC: G06F11/00
Filed: 2009-09-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a deployment system and a deployment method for collectively and quickly performing security patch application to a plurality of different server environments and deploying software.  <P>SOLUTION: The deployment system comprises: a start-up means for mounting a disk image file of an OS corresponding to an individual server environment as a volume of an exclusive updating server; an updating means for executing application of a security patch and software deployment; and an access management means for selectively distributing an I/O access request from the updating means. The deployment system includes: a first means which when the updating means accesses a repository for managing past updating history, determines a server updated and distributes an I/O access to a volume with a disk image file of a proper OS mounted thereon; and a second means for mounting the disk image file of the OS as a volume of the exclusive updating server.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011074677-A (JP)
Title: Tail piece truck, method for moving the same, and method for extending continuous belt conveyor
Inventor: KANEDA TSUTOMU
IPC: E21D9/12
Filed: 2009-09-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a tail piece truck which efficiently moves with a small number of persons, a method for moving the tail piece truck, and a method for extending a continuous belt conveyor.  <P>SOLUTION: The tail piece truck 1 includes a frame 4 for placing a tail piece part 3 of the continuous belt conveyor 2; a first expansion means 5 for supporting the frame 4; a support base 6 for supporting the frame 4 in a relatively movable manner; a second expansion means 7 for supporting the support base 6; a first driving means 8 for moving the frame 4 in a direction to extend the continuous belt conveyor 2; a second driving means for moving the frame 4 in a direction orthogonal to a traveling direction; and a measuring instrument 13 for measuring the height of the tail piece part 3.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011076550-A (JP)
Title: Application cooperation method and system
Inventor: KASHIOKA ATSUSHI
IPC: G06F21/41
Filed: 2009-10-01
Abstract: <P>PROBLEM TO BE SOLVED: To provide an application cooperation method for transferring an object to prevent a security problem.  <P>SOLUTION: The application cooperation method includes: a holding step of holding correspondence between functions provided by applications and operation categories which categorize operation contents for the object by the functions provided by the applications; an acquisition step of acquiring an object managed by a first application, and acquiring an operation authority of a user for the object managed by the first application; an object information management step of storing and managing, as object information, the object and the operation authority for the object acquired in the acquisition step in the storage unit; and a determination step of determining whether or not operation categories held in the holding step in correspondence with functions of a second application which processes the object managed as the object information in the object information management step are permitted for the operation authority for the object managed as the object information.A cooperation means transfers the object managed as the object information to the second application, when permission is determined in the determination step.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011086688-A (JP)
Title: Method of processing semiconductor wafer
Inventor: TABUCHI TOMOTAKA
IPC: H01L21/301
Filed: 2009-10-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of processing a semiconductor wafer capable of simplifying processes and members.  <P>SOLUTION: The method of processing the semiconductor wafer processes the semiconductor wafer including devices in each region partitioned by a plurality of split predetermined lines formed in a latticed shape on a surface. The method of working the semiconductor wafer includes a die-attach film sticking process forming wafers with DAFs by sticking die-attach films (DAFs) disposing pressure-sensitive adhesive layers on tape base materials on top faces forming the devices in the semiconductor wafer. The method of working the semiconductor wafer further includes: a holding process holding the die-attach film sides of the wafers with the DAFs by a chuck table for a grinding attachment; and a grinding process grinding the exposed surfaces of the wafers with the DAFs held by the chuck table by a grinding means for the grinding attachment.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011067566-A (JP)
Title: Storage box
Inventor: SASAKURA KENTARO
IPC: E05C19/16
Filed: 2009-10-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a storage box capable of bringing out emergency kit items even under a situation that it must take refuge suddenly.  <P>SOLUTION: The storage box 1, which is mounted on a wall, includes: a back section 2; a front section 3 provided in front of the back section 2; a turning part 4 on which the back section 2 and the front section 3 are turnably attached; and an attaching/detaching part 5 that makes a part of the back section 2 and a part of the front section 3 attachable/detachable. The front section 3 is mounted on the turning part 4 to be able to be vibrated at least in one direction in case of earthquake.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011084434-A (JP)
Title: Ozone generating apparatus
Inventor: NAKAZAWA YOSHIAKI
IPC: C01B13/11
Filed: 2009-10-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide an ozone generating apparatus which is small in size and low in cost and does not disturb someone's daily life.  <P>SOLUTION: The ozone generating apparatus 10 comprises ozone generating units 60 each comprising an ozonizer 30 with a discharge gap 34 and an ozone discharge section 50 which surrounds the discharge gap 34 and is left open in a predetermined direction so as to discharge generated ozone in the predetermined direction; and a housing part 20 which is formed with a U-shaped cross section and can be attached to the entrance upside of a building in such a way that the open side of the U shape is located downward. In the housing part 20, the ozone generating units 60 are arranged in the longitudinal direction of the housing part 20 in such a way that the open sides of the open parts of the ozone discharge sections 50 are turned to downward.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011084660-A (JP)
Title: Cleaning solvent composition
Inventor: KANEKO BINSUKE
IPC: B08B3/08
Filed: 2009-10-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a cleaning solvent composition which is nonflammable, non-hazardous, safe to be handled, legally free from restrictions on its storage or use, highly user-friendly, convenient, free from certain problems such as rust or waste water, and more excellent in detergency than that of conventional ones.  <P>SOLUTION: The cleaning solvent composition contains 0.1-60 wt.% dodecylbenzenesulfonic acid and 40-99.9 wt.% normal propyl bromide, or contains 0.1-60 wt.% dodecylbenzenesulfonic acid, 40-99.9 wt.% normal propyl bromide and 0-89.9 wt.% diluent which comprises one or more organic solvents and has ≥20°C flash point.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010140015-A (JP)
Title: Carrier
Inventor: MASUDA MINORU
IPC: G03G9/113
Filed: 2009-10-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a carrier in which blocking upon formation of a coating layer can be suppressed, and which has excellent durability, to provide a developer comprising the carrier, and to provide an image forming method using the developer.  <P>SOLUTION: In the carrier, a coating layer is formed on the surfaces of core material particles, wherein the coating layer is formed by condensing a composition comprising a silicon resin having at least one of a silanol group and/or a functional group capable of generating silanol group by means of hydrolysis, and an organic zirconium compound.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011096703-A (JP)
Title: Semiconductor device and semiconductor unit
Inventor: SAKAI KOJI
IPC: H01R43/00
Filed: 2009-10-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a semiconductor unit, wherein wiring connection between semiconductor elements each directly mounted on a substrate is carried out by using connectors so that the size of a portable device or the like can be further reduced.  <P>SOLUTION: Fine micro connectors 1, 11 corresponding to a height and a size in a width direction of a bare chip IC 7 can be obtained by producing a micro connector through a plating process. As such the fine micro connectors 1, 11 are included, the wiring connection between the bare chip ICs 7 directly mounted on the substrates 6 can be carried out by the micro connectors 1, 11. In addition, because the micro connector 1 for connecting the substrate 6 in a vertical direction and the micro connector 11 for connecting the substrate 6 in a horizontal direction are included, the semiconductor devices (10n, 10p, 10q) each having the substrate 6 on which the bare chip IC 7 is directly mounted can be connected in the vertical direction and the horizontal direction of the substrates by using the micro connectors 1, 11.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011093142-A (JP)
Title: Gluing bookbinding device, post-treatment device, and image forming system
Inventor: MATSUI MASAKI
IPC: B42C9/00
Filed: 2009-10-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a gluing bookbinding device that prevents excessive side glue and rounded corners on a cover sheet from occurring, maintains high bookbinding quality, and reduces bookbinding time, and to provide a post-treatment device, and an image forming system.  <P>SOLUTION: The gluing bookbinding device has: a sheet-bundle storage part that bundles sheets discharged from an image forming device to load the sheet bundle thereon; a glue coating part for coating glue on the back of each sheet bundle loaded on the sheet-bundle storage part; a cover-sheet feed part for feeding cover sheets to a cover-sheet pasting part; and the cover-sheet pasting part that bonds the cover sheet onto the glue-coated back of each sheet bundle and executes bookbinding by folding the cover sheet. The glue coating part includes: a moving mechanism for the glue coating; a glue molding plate for regulating the thickness of glue to be coated; a vertical lifting mechanism for changing the interval in-between the back of the sheet bundle; a means for controlling the temperature of the glue molding plate; and a glue cooling fan for cooling the glue on the back of the sheet bundle.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011093451-A (JP)
Title: Cover device for vehicle
Inventor: TAKEMURA SEIJI
IPC: B60R5/04
Filed: 2009-10-30
Abstract: <P>PROBLEM TO BE SOLVED: To shield a gap among a plurality of covers when the covers can be pulled in substantially the same direction along substantially the same plane.  <P>SOLUTION: This cover device includes a center cover winding part 30 having a center cover 32 and a center winding shaft part 34 storing the center cover 32 so that it may be pulled and wound, and a side cover winding part 40 having a side cover 42 and a side winding shaft part 44 storing the side cover 42 so that it may be pulled and wound. The center winding shaft part 34 and the side winding shaft part 44 are supported so that axes X1 and X2 may be mutually shifted and the end parts with each other may be overlapped with each other in the axial directions to overlap a side edge part of the center cover 32 with a side edge part of the side cover 42 in the pulled states.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011092133-A (JP)
Title: Method for simply identifying moldy grain
Inventor: HOGETSU HIROKO
IPC: C12Q1/04
Filed: 2009-10-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for simply identifying moldy grains capable of precisely inspecting mold without relying the experience of a worker, simple in mold inspection work and requiring no special microbial inspection facilities or machinery/instruments and materials.  <P>SOLUTION: The method for simply identifying the moldy grain includes the process for preparing a mold cultivation container equipped with a resin body which houses a mold detection medium and a resin lid for sealing the opening of the resin body, the process for opening the opening of the resin body sealed by the resin lid, the process for placing grains on the mold detection medium from the opening, and the process for keeping the mold cultivation container at room temperature after covering the opening with the resin lid.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010034581-A (JP)
Title: Aqueous dispersing element for chemical mechanical polishing
Inventor: NISHIMOTO KAZUO
IPC: B24B37/00
Filed: 2009-11-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide an aqueous dispersing element for chemical mechanical polishing that suppresses erosion and its speed when overpolishing is carried out in a chemical mechanical polishing process.  <P>SOLUTION: The aqueous dispersing element for chemical mechanical polishing contains abrasive grains, water, and potassium dodecylbenzene sulfonate and/or ammonium dodecylbenzene sulfonate.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011100819-A (JP)
Title: Magnetic coupler
Inventor: TOBA AKIO
IPC: B60M7/00
Filed: 2009-11-05
Abstract: <P>PROBLEM TO BE SOLVED: To reduce the thickness, size and weight of a magnetic coupler without causing abnormal overheat of a core or a coil nor degradation of power transmission efficiency.  <P>SOLUTION: In this magnetic coupler where a primary unit and a secondary unit are arranged oppositely to each other through a nonmagnetic body and can be magnetically coupled to each other, both the units 100, 200 include coils 103, 203 each formed of a flat braided wire, respectively, and further include cores 101, 201 relatively movable for winding coils 103, 203 therearound, respectively; and so-called dust core and dust material are used as material of the cores 101, 201. The primary unit is fixed, and a reciprocating conductor formed of a pair of conductors is arranged in a part of the coil constituting the primary unit; and the secondary unit can be moved along the longitudinal direction of the reciprocating conductor.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011101214-A (JP)
Title: Vibration device
Inventor: KOYAMA YUGO
IPC: H01L25/16
Filed: 2009-11-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a vibration device capable of avoiding variations in a planar size and protecting a connection member certainly.  <P>SOLUTION: The quartz oscillator 1 includes a quartz vibrator 10, an IC chip 20, and a wiring board 30. The quartz vibrator 10 holds a quartz vibration piece 12 in the interior of a package 11 having an external terminal 14 at its outside surface. The IC chip 20 drives the quartz vibration piece 12. The IC chip 20 is arranged at one surface 31 of the wiring board 30, while the quartz vibrator 10 is arranged at another surface 32 of the wiring board 30. The wiring board 30 has a through hole 33 from which at least a part of the external terminal 14 of the quartz vibrator 10 is exposed in plan view. An internal connection terminal 34 formed at the one surface 31 is connected to the external terminal 14 of the quartz vibrator 10 via a metal wire 40 through the through hole 33. The IC chip 20 and metal wires 40 and 41 are covered with resin 42.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011100674-A (JP)
Title: Electrode group for nonaqueous secondary battery, and nonaqueous secondary battery using this
Inventor: KANEDA MAYUMI
IPC: H01M4/13
Filed: 2009-11-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electrode group for a secondary battery, in which stress applied when constituting the electrode group or the stress accompanied with expansion and contraction of an electrode plate when charging and discharging is reduced, and a fracture or the like of the electrode plate can be suppressed, and which is high in reliability and safety.  <P>SOLUTION: In the constitution of the electrode group 4, at least one electrode plate of either a positive electrode plate 14 or a negative electrode plate 24 has uncoated parts 23a, 23b in which mixture layers 22a, 22b are not formed on a current collector 21 in a curved part at the end part of the longitudinal direction of the electrode group 4. In a trapezoid shape, a width composed of both coated ends 27a, 27b neighboring the exposed current collector parts 26a, 26b is larger than that between current collector parts 26a, 26b in which a cross-sectional shape is exposed which consists of: the current collector parts 26a, 26b where the uncoated parts 23a, 23b are exposed; and coated end parts 27a, 27b.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010137557-A (JP)
Title: Film cover bonding system
Inventor: OKUMA ATSUSHI
IPC: B42C19/08
Filed: 2009-11-10
Abstract: <P>PROBLEM TO BE SOLVED: To automate work for bonding film covers onto surfaces of various sizes of booklets.  <P>SOLUTION: This film cover bonding system includes: a film supplying device 200 for cutting a band-like resin film 10 in response to the size of the bonding-objective booklet, to be supply-arranged to a preset film supply position; a film bonding device 300 for moving the booklet from an opposed position to cross the booklet with respect to the film 10 arranged in the film supply position, and for bonding the film 10 onto the surface of the booklet; a film conveying device 400 for conveying the booklet with the film 10 bonded on the surface; a film partial cutter 500 for cutting circular-arc-shapedly a corner part peripheral portion of the booklet, in the film 10 extended from an end edge of the booklet surface; an end turn-in device 600 for turning the film 10 extended from an end edge of the end of the booklet surface in each of cover reverse face sides of the booklet; and a top and bottom turn-in device 900 for turning the film 10 extended from each end edge of a top and a bottom of the booklet surface in the cover reverse face sides of the booklet.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011108908-A (JP)
Title: Solar cell substrate detecting device, and method of detecting the solar cell substrate
Inventor: AKITA NORITAKA
IPC: H01L31/04
Filed: 2009-11-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a solar cell substrate detecting device capable of performing detection without reference to whether a reverse surface of a solar cell substrate is a mirror plane or an uneven surface.  <P>SOLUTION: A substrate detector 41 is constituted, by packaging a light emitting portion 42 and a light receiving portion 43, and the light-emitting portion 42 has an tilt angle of 10 to 45° to the solar cell substrate 1. When a reflecting surface of the solar cell substrate 1 is a mirror-finished surface, the solar cell substrate 1 mounted on a tray 31 is irradiated with a light emitted from the light-emitting portion 42 via an opening 32, and its reflected light is reflected by a side surface of the opening 32 of the tray 31 to be incident on the light-receiving portion 43. Additionally, when the reflecting surface of the solar cell substrate 1 is an uneven surface, the scattered light from the reflecting surface is made incident directly on the light-receiving portion 43, as shown in Fig. 4.  <P>COPYRIGHT: (C)2011,JPO&INPIT