baber/WOPTO huggingface dataset:
Patent JP-2013212971-A (JP)
Title: Low-strontium high-purity barium chloride and method for producing the same
Inventor: JIANG ZHIGUANG
IPC: C01F11/28
Filed: 2012-09-13
Abstract: PROBLEM TO BE SOLVED: To provide a method for producing low-strontium high-purity barium chloride, which gives high yield, reduces cost and reduces the content of impurities, and the barium chloride.SOLUTION: A method for producing barium chloride includes the steps of reacting barium carbonate with hydrochloric acid, keeping the temperature at 55 to 60°C in the system, controlling the reaction so as to make the pH value of the reaction end point to 3.5 to 4.0, and performing solid-liquid separation after the end of the reaction; adding hydrochloric acid to the resultant barium chloride-containing filtrate, controlling the [H] to be 2.0 to 6.0 mol/L, cooling the temperature of the solution to the temperature of lower than 35°C, and performing solid-liquid separation; dissolving the resultant barium chloride crystal in water to prepare a saturated solution of 80 to 90°C, adding hydrogen peroxide, heating the resulting solution till light boiling, neutralizing it with barium hydroxide, and performing solid-liquid separation; and transferring the resultant liquid phase to a cooling crystallization pot, slowly cooling it to a temperature of 38-42°C, performing solid-liquid separation, and drying the resultant solid, thus obtaining a barium chloride product.
Patent JP-2014054934-A (JP)
Title: Heater
Inventor: NISHIGAKI TAKU
IPC: B60H1/22
Filed: 2012-09-13
Abstract: PROBLEM TO BE SOLVED: To provide a heater which has high heat efficiency and can be made compact, and has a small number of components and simple structure, thereby can be manufactured easily and at low cost compared to conventional heaters used for in-vehicle heating.SOLUTION: A heater 100 mounted on a vehicle for in-vehicle heating includes: a tubulous honeycomb structure part 4 including division walls 1 which define and form a plurality of cells 2 extending from one end face 11 to the other end face 12 and serving as a passage of air that is a medium to be heated, and an outer peripheral wall 3 positioned at the outermost periphery; and a pair of electrode parts 21, 21 which are connected with a lateral face 5 of the honeycomb structure part 4. The honeycomb structure part 4 is made of a material mainly comprising ceramic, and generates heat by energization. A combination of thickness of the division wall 1 and cell density in the honeycomb structure part 4 is a predetermined combination, and resistivity of the honeycomb structure part is 1.5-20 Ω cm.
Patent JP-2012245411-A (JP)
Title: Injection system
Inventor: GONNELLI ROBERT R
IPC: A61M5/30
Filed: 2012-09-20
Abstract: PROBLEM TO BE SOLVED: To disclose injection systems (50) and devices (52 and 54) that can be used in the injection system.SOLUTION: The injection device includes an injector defining a first cavity and an orifice; a movable member in the first cavity; a housing defining a second cavity at a proximal end part of the movable member; and a charge in the second cavity comprising at least two propellants, or at least one propellant and at least one passive decay material. The ignition of the charge produces multistage reaction comprising the ignition of at least the two propellants in a predetermined order, or the ignition of at least the one propellant and at least the one passive decay material.
Patent JP-2014063058-A (JP)
Title: Spot size converter
Inventor: ONAWA YOSUKE
IPC: G02B6/122
Filed: 2012-09-21
Abstract: PROBLEM TO BE SOLVED: To provide a spot size converter having low polarization dependence.SOLUTION: A spot size converter has a first optical waveguide core 30, a second optical waveguide core 40, and a third optical waveguide core 50. The spot size converter is also provided with a first bidirectionally coupled region, in which light propagating in a basic mode through the first optical waveguide core and light propagating in an n-th order mode (n is a positive integer) through the second optical waveguide core are coupled, and a second bidirectionally coupled region in which the light propagating in the n-th order mode through the second optical waveguide core and light propagating in the basic mode through the third optical waveguide core are coupled. The first optical waveguide core has a larger cross-sectional area in a plane perpendicular to a propagation direction of light than the second optical waveguide core and the third optical waveguide core.
Patent JP-2014066154-A (JP)
Title: Control device of internal combustion engine
Inventor: ASANO MORIHITO
IPC: F01N3/24
Filed: 2012-09-25
Abstract: PROBLEM TO BE SOLVED: To optimize a timing to restart air-fuel ratio feedback control after termination of fuel cut for temporarily stopping fuel supply to a cylinder.SOLUTION: In a control device for feedback controlling an air-fuel ratio of a gas flowing into a catalyst by referring to an output of an air-fuel ratio sensor disposed at a downstream side of the exhaust gas purification catalyst disposed in an exhaust passage of an internal combustion engine, a maximum oxygen storage capacity of the catalyst is estimated in advance, the operation is executed in a rich air-fuel ratio after termination of fuel cut, a releasing amount of oxygen stored in the catalyst to approximately the maximum oxygen storage capacity during the fuel cut, from the catalyst due to the rich air-fuel ratio, is repeatedly estimated, and the air-fuel ratio feedback control is restarted when the oxygen storage amount of the catalyst is lowered to an amount from 40 to 60 percent of the maximum oxygen storage capacity.
Patent JP-2014068461-A (JP)
Title: Power control device, power control system, and power control method
Inventor: KUMASAKA HIROYUKI
IPC: H02M3/155
Filed: 2012-09-26
Abstract: PROBLEM TO BE SOLVED: To provide a power control device, a power control system and a power control method that can stabilize a controlled object in a short time.SOLUTION: The power control device includes a control circuit 2 for controlling a power supply 3 as a controlled object, and a control operation section 1 for calculating an operation amount with which the control circuit 2 controls the power supply 3. If a disturbance occurs in the power supply 3, the control operation section 1 reflects a parameter in the operation amount to amplify the operation amount during the disturbance occurrence period. The power control device, power control system and power control method provided can stabilize the controlled object in a short time.
Patent JP-2014078065-A (JP)
Title: Data communication device and control method thereof, and computer program
Inventor: MIZUKO YOICHI
IPC: G06F13/28
Filed: 2012-10-09
Abstract: PROBLEM TO BE SOLVED: To provide a data communication device or the like which appropriately reduces electric power consumed by a data bus according to a buffer use ratio in a data buffer.SOLUTION: A data communication device 1 includes a communication buffer 3 which is used when data communication is performed through a data bus 4, and a control unit 2 for controlling data communication by the data bus 4 to which the communication buffer 3 is connected. When a buffer use ratio which shows a ratio of data in the communication buffer 3 does not exceed a first use ratio, the control unit 2 reduces data speed in the data bus 4 which is currently connected and the number of lanes constituting the data bus 4. When the buffer use ratio exceeds a second use ratio which is greater than the first use ratio, the control unit 2 increases data speed in the data bus 4 which is currently connected and the number of lanes.
Patent JP-2013084339-A (JP)
Title: Semiconductor chip package
Inventor: KANG SUN-WON
IPC: H01L25/00
Filed: 2012-10-10
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor chip package capable of removing or minimizing power noise generated in a voltage generation circuit in an integrated circuit chip.SOLUTION: The semiconductor chip package includes: an integrated circuit chip including a voltage generation circuit for receiving external power source voltage to generate supply voltage to be used for an internal circuit and a connection terminal connected to an output node of the supply voltage of the voltage generation circuit; a noise remover electrically connected to the connection terminal to reduce power noise on the supply voltage; a loading substrate for loading the integrated circuit chip to package the integrated circuit chip as the semiconductor chip package.
Patent JP-2014081540-A (JP)
Title: Developing apparatus and image forming apparatus
Inventor: OTA NAOKI
IPC: G03G15/08
Filed: 2012-10-17
Abstract: PROBLEM TO BE SOLVED: To provide a developing apparatus configured to prevent accumulation of developer when the developer is transferred between a conveyance/supply member arranged in a conveyance/supply path and a conveyance/agitation member arranged in a conveyance/agitation path, in order to circulate the developer in the developing apparatus, and to provide an image forming apparatus.SOLUTION: In transferring developer G from a conveyance/supply auger 74 arranged in a conveyance/supply path 72 to a conveyance/agitation auger 80 arranged in a conveyance/agitation path 78, the developer G is transferred from the conveyance/supply path 72 to a first conveyance path 94 temporarily, and guided by a first conveyance auger 100, to transfer the developer G to the conveyance/agitation path 78. In transferring the developer G between the conveyance/supply auger 74 arranged in the conveyance/supply path 72 and the conveyance/agitation auger 80 arranged in the conveyance/agitation path 78 in order to circulate the developer G in a developing apparatus 32, accumulation of the developer G is prevented.
Patent JP-2014084768-A (JP)
Title: Assembling structure of hollow component
Inventor: SHIBATA TAKAFUMI
IPC: F16B5/07
Filed: 2012-10-23
Abstract: PROBLEM TO BE SOLVED: To improve assemblability of a hollow component made of a synthetic resin.SOLUTION: A guide rib 26 is disposed on an inner wall surface of a second side wall 21 constituting an outer wall surface of an opening portion of a resonator cover 4. The guide rib 26 is set so that its tip is lapped with a tip of a first side wall 11 of a resonator body 3 by a prescribed amount M in the assembling direction when a tip of a locking piece 7 is brought into contact with an inclined face 8a of an engagement projection 8 in assembling the resonator body 3 and the resonator cover 4. Further the guide rib 26 is positioned at an inner side with respect to an outer wall surface 21c of the second side wall 21 as a whole, and a stepped portion 28 is formed between the guide rib 26 and the wall surface 21c of the second side wall 21.
Patent JP-2013013807-A (JP)
Title: Game machine
Inventor: KOREEDA YOSHIO
IPC: A63F5/04
Filed: 2012-10-24
Abstract: PROBLEM TO BE SOLVED: To provide a game machine that is configured so that a front door is divided into a plurality of portions and suppresses the complication of the opening work of each door.SOLUTION: A slot machine 10 includes a casing 11 and the front door 12 on the front of the casing. The front door 12 is attached to a front side of the casing 11 so as to be openable and closable. The front door 12 comprises an upper door 13 and a lower door 14, and locking devices are individually provided on back surfaces of the respective doors 13, 14. A through hole 80 penetrating the back is formed at a right end side of the lower door 14, and a key hole 655 of a key cylinder 627 is visible from the through hole 80. Predetermined key operation to the key cylinder 627 releases a locked state of the locking device provided on the respective doors 13, 14.
Patent JP-2014086338-A (JP)
Title: Charging connector
Inventor: SAWADA ATSUSHI
IPC: H01R13/52
Filed: 2012-10-25
Abstract: PROBLEM TO BE SOLVED: To provide a charging connector at low cost with a structure for waterproofing a terminal.SOLUTION: A charging connector 1 includes an outer case 2 in which both of butting surfaces 3 and 7 of two case separate bodies 2A and 2B are butted and assembled, and, in the assembled state, a connector engagement part projecting hole 9 and an electric wire drawing hole 10 are opened, and a connector main body part 20 which is stored into the outer case 2, and in which a connector engagement part 21A is exposed to the out of the outer case 2 from the connector engagement part projecting hole 9. In the charging connector 1, an electric wire W1 from the connector main body part 20 is conducted from the electric wire drawing hole 10 to the out of outer case 2. The charging connector 1 further includes a sealing part 40 integrally arranging a case separate surface sealing part 41 that is interposed between both butting surfaces 3 and 7 of the case separate bodies 2A and 2B; a sealing part 42 for a connector main body, that is interposed between the outer case 2 and the connector main body part 20; and an electric wire sealing part 43 that is interposed between the outer case 2 and the electric wire W1.
Patent JP-2014085090-A (JP)
Title: Hot water storage tank
Inventor: YASUI KENJI
IPC: F24H1/00
Filed: 2012-10-26
Abstract: PROBLEM TO BE SOLVED: To provide a hot water storage tank capable of uniformizing a temperature of high-temperature water inside of the hot water storage tank from an upper portion to a lower portion of the hot water storage tank.SOLUTION: A hot water storage tank 1 includes: a hot water storage tank body 11 having a hot water inflow port 21 and a hot water outflow port 22 at its lower portion; and a projecting space formation portion 12 disposed on a position above the hot water inflow port 21 at a position inside of the hot water storage tank body 11, and defining a part of the space in the hot water storage tank body 11 as a space 124 having the upward projecting shape. The projecting space formation portion 12 is disposed in several stages in a vertical direction, and a peripheral edge portion 126 of the projecting space formation portion 12 of one stage, is positioned in a region surrounded by a peripheral edge portion 126 of the other projecting space formation portion 12 adjacent to the projecting space formation portion 12 of one stage in the vertical direction, when observed in the vertical direction.
Patent JP-2014093328-A (JP)
Title: Semiconductor film, semiconductor film manufacturing method, solar cell, light-emitting diode, thin film transistor and electronic device
Inventor: ONO MASASHI
IPC: H01L51/30
Filed: 2012-10-31
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor film which can obtain a high photocurrent value and inhibit film peeling.SOLUTION: A semiconductor film includes an aggregate of semiconductor quantum dots containing metal atoms and at least one ligand which is coordinated to the semiconductor quantum dots and represented as a general formula (I). In the formula (I), A represents a hydrogen atom or a substituent of atom number 10 or less where a terminal is other than NHor SH.
Patent JP-2014091918-A (JP)
Title: Window
Inventor: YANAI SATOSHI
IPC: E06B1/18
Filed: 2012-10-31
Abstract: PROBLEM TO BE SOLVED: To provide a window which can improve design including an existing architrave.SOLUTION: A window includes parting materials 7a, 7b and a covering material 19. The parting materials 7a, 7b comprise overhanging frames 8a, 8b mounted to the indoor side end surfaces of existing architraves 6a 6b, and resin covering materials 9a, 9b mounted to the indoor sides of the overhanging frames 8a, 8b, and further project to the inner peripheral sides than the existing architraves 6a, 6b. The covering material 19 has heat insulating properties, and covers the inner peripheral side surfaces of the existing architraves 6a, 6b. The indoor side end 19b is hidden by the parting materials 7a, 7b.
Patent JP-2014091560-A (JP)
Title: Carrier tape
Inventor: HOSHI TAIJIRO
IPC: B65D73/02
Filed: 2012-11-05
Abstract: PROBLEM TO BE SOLVED: To provide a carrier tape whose adhesive strength is improved and adhesion of cover tape can be performed substantially uniformly.SOLUTION: The carrier tape 10 storing plural components comprises: concavity recesses 12 formed by resin molding and disposed in parallel along a longitudinal direction and storing components; plural sprocket holes 11 disposed adjacent to disposed direction of the concavity recesses 12; and concavities 14 disposed between each of adjacent concavity recesses 12, which are both ends of orthogonal direction to the disposed direction of the concavity recesses 12.
Patent JP-2014096488-A (JP)
Title: Semiconductor device and manufacturing method of the same
Inventor: AUCHI MAKOTO
IPC: H01L23/12
Filed: 2012-11-09
Abstract: PROBLEM TO BE SOLVED: To provide a BGA (Ball Grid Array) semiconductor device which is unlikely to cause detachment of a solder ball even when impact (stress) is applied from outside.SOLUTION: A BGA semiconductor device comprises: a wiring board which has a square planar shape and includes a top face where a plurality of bonding leads are formed and an undersurface where a plurality of bump lands are formed; a semiconductor chip which is mounted on the top face of the wiring board and which is electrically connected to the plurality of bonding leads; an encapsulation body for encapsulating the top face of the wiring board and the semiconductor chip; and a plurality of solder balls formed on the plurality of bump lands of the wiring board. A central part of the top face of the wiring board is covered with the encapsulation body and corners of the top face of the wiring body are not covered with the encapsulation body.
Patent JP-2014096337-A (JP)
Title: Connection structure of coated carbon fiber wire
Inventor: TANAKA MIZUHO
IPC: H05B3/02
Filed: 2012-11-12
Abstract: PROBLEM TO BE SOLVED: To allow the passage of current efficiently through a carbon fiber wire obtained by bundling carbon fiber strands.SOLUTION: A connection structure of a coated carbon fiber wire 4 is obtained by: peeling off a coat 4B of a terminal part of a coated carbon fiber wire 4A formed by coating the bundle of a plurality of carbon fiber strands 41A with a synthetic resin material; rolling a conducting layer 6 around a coated terminal part; inserting a pin 5 having a washer 5A attached at an intermediate part thereof into an inside of the carbon fiber wire 4A from the terminal part of the carbon fiber wire 4A whose coat 4B has been peeled off; radially spreading the bundle of the carbon fiber strands 41A by the washer 5A of the pin 5 and folding the carbon fiber strands 41A on the conducting layer 6; inserting the washer 5A of the pin 5 into one end of a cylindrical connecting element 1 having the other end connected to an electric wire 3 while the washer 5A is brought into close contact with the tip of the folded part of the carbon fiber strands 41A; and crimping the connection part 2A of the cylindrical connecting element 1.
Patent JP-2014099495-A (JP)
Title: Silicon carbide semiconductor device manufacturing method
Inventor: WAKI EIJI
IPC: H01L29/78
Filed: 2012-11-14
Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a MOS semiconductor device which has a low interface state density at an SiO-SiC interface in a simple and inexpensive method.SOLUTION: In a manufacturing method, a MOS structure is formed by combining extremely simple and highly controllable manufacturing processes such as a process of exposing a surface of a silicon carbide semiconductor to plasma generated inside an ECR sputtering device, a process of depositing an SiOfilm by an ECR sputtering method while maintaining a vacuum state in the same device, a subsequent heat treatment process at approximately 1000°C-1200°C and a process of stacking metal films.
Patent JP-2013065873-A (JP)
Title: Lpd-reducing agent and method for reducing defects of silicon wafer using the same
Inventor: KAMIMURA YASUHIDE
IPC: C09K3/14
Filed: 2012-11-14
Abstract: PROBLEM TO BE SOLVED: To provide an LPD-reducing agent which allows the reduction in the number of LPDs resulting from a polishing treatment on a surface of a workpiece after the polishing with the LPD-reducing agent, and a method for reducing defects of a silicon wafer using the LPD reducing agent.SOLUTION: The LPD-reducing agent of the invention comprises at least one kind of a water-soluble polymer molecule selected from the group consisting of polyvinylpyrrolidone and poly N-vinyl formamide, and is for use in polishing a silicon wafer.
Patent JP-2013031753-A (JP)
Title: Ultrasonic imaging apparatus
Inventor: TOMATSU TADASHI
IPC: A61B8/06
Filed: 2012-11-19
Abstract: PROBLEM TO BE SOLVED: To provide an ultrasonic imaging apparatus capable of determining the acoustic pressure of ultrasonic waves to be emitted, in consideration of the acoustic pressure distribution of ultrasonic waves in a subject.SOLUTION: The ultrasonic imaging apparatus is adapted to display an MI (mechanical index) value distribution function 62 or a black-and-white gradation scale 63 on a display part 106 so as to be placed side by side with or to be superimposed on tomographic image information 41. An operator therefore acquires, prior to imaging, a region where the acoustic pressure in an imaging region becomes the destructive acoustic pressure of a contrast medium, and eventually makes the region in which the contrast medium is destroyed, coincident with the described position of the contrast medium in the imaging region by resetting a scan parameter value, thereby achieving the efficient, accurate and reliable destruction of the contrast medium.
Patent JP-2013136736-A (JP)
Title: Coating material, coating film, solar-cell-module backsheet, and solar-cell module
Inventor: NAKAGAWA HIDETO
IPC: C09D127/16
Filed: 2012-11-26
Abstract: PROBLEM TO BE SOLVED: To provide a coating material remarkably improved in pot life; to provide a coating film obtained from the coating material; to provide a solar-cell-module backsheet having the coating film; and to provide a solar-cell module.SOLUTION: The coating material is characterized by including a curing functional group-containing fluoropolymer, and a blocked isocyanate based on hexamethylene diisocyanate.
Patent JP-2014106028-A (JP)
Title: System and method for inspecting wall thickness of boiler tube
Inventor: HOSHI YONOSUKE
IPC: G01B17/00
Filed: 2012-11-26
Abstract: PROBLEM TO BE SOLVED: To provide a system and method for inspecting the wall thickness of a boiler tube in which measurement accuracy is improved in a wall-thickness measuring position of the boiler tube.SOLUTION: A system for inspecting the wall thickness of a boiler tube comprises: a portable unit including a wall-thickness measuring probe, an ultrasonic receiver, a synchronous signal receiver, and an angle sensor that can measure the tilt of the wall-thickness measuring probe to a boiler wall; a fixed unit including a first ultrasonic transmitter, a second ultrasonic transmitter, and a synchronous signal transmitter; a wall-thickness display unit capable of being carried by a worker and displaying wall-thickness measurement results measured with the wall-thickness probe; a computing unit for obtaining a position of the wall-thickness probe by computing on the basis of a distance measuring signal measured with the ultrasonic receiver and the tilt of the wall-thickness measuring probe measured with the angle sensor; and a position coordinate display unit capable of being carried by a worker and displaying the position of the wall-thickness probe obtained by the computing unit.
Patent JP-2014021967-A (JP)
Title: Earthquake emergency life-saving device with lighting means
Inventor: CHIEN KUO-HUI
IPC: H05B37/02
Filed: 2012-11-26
Abstract: PROBLEM TO BE SOLVED: To provide an earthquake emergency life-saving device with lighting means capable of improving a victim's survival rate even if an evacuation route is blocked.SOLUTION: An earthquake emergency life-saving device with lighting means includes: a device main body 1; earthquake detection means 3 to be installed in the device main body 1; lighting means 2 to be attached to the device main body 1; and voice broadcasting means 7 capable of broadcasting a voice demanding rescue.