baber/WOPTO huggingface dataset:
Patent TW-200722022-A (TW)
Title: Drying apparatus
Inventor: DYSON JAMES
IPC: A47K10/48
Filed: 2006-07-28
Abstract: Drying apparatus (10) has a casing (12), a cavity (30) formed in the casing (12) for receiving an object, a fan (40) located in the casing (12) and capable of creating an airflow, a motor (39) arranged to drive the fan (40). At least one opening (60, 62) communicates with the fan (40) and is arranged in the casing (12) so as to direct an airflow transversely across the cavity (30). According to the invention, the motor (39) and fan arrangement generate an airflow across the cavity, wherein, in use, the pressure of the airflow emitted through the opening is at least 8 kPa. In one arrangement the motor has a rotor which, in use, is capable of rotating at a speed of at least 80,000 rpm. The high velocity, high pressure airflow provided by the apparatus is capable of drying an object efficiently and quickly. The invention is suitable for use in a hand dryer.
Patent TW-200711458-A (TW)
Title: Compensating for improperly exposed areas in digital images
Inventor: ROGERS SEAN SCOTT
IPC: H04N1/60
Filed: 2006-07-28
Abstract: A method and apparatus compensates for improperly exposed areas in a first digital image taken with a first aperture setting by rapidly and automatically capturing a second digital image of the same scene using a second aperture setting. If a portion of the first image is properly exposed, then image information for the portion is used in a third adjusted image. If the portion is improperly exposed, then image information for the portion is combined with image information for a corresponding portion in the second image, thereby generating a composite portion used in the adjusted image. The manner of combining can be based on the luminance of the portion in the first image. In another example, one image is captured. Improperly exposed portions are adjusted using a screening process. The adjusted image is stored as a file with an indication in the file header that the image has been adjusted.
Patent TW-200814421-A (TW)
Title: Fuel cell
Inventor: KANG KU-YEN
IPC: H01M8/10
Filed: 2006-09-05
Abstract: A fuel cell. A membrane electrode assembly includes a proton exchange membrane, a cathode electrode, and an anode electrode. The proton exchange membrane is disposed between the cathode and anode electrodes. A cathode porous current collector is disposed on the cathode electrode. An anode porous current collector is disposed on the anode electrode and opposite the cathode porous current collector. A cathode water absorbing layer is disposed on the cathode porous current collector, preventing water film from being generated on the surface of the cathode porous current collector, facilitating gas to pass through the cathode porous current collector.
Patent TW-200820476-A (TW)
Title: Battery structure
Inventor: GE PENG-JIN
IPC: H01M2/04
Filed: 2006-10-23
Abstract: The present invention provides a battery structure including a cover, a body and a locking assembly. The cover has a clutching portion. The locking assembly includes a button and a restoring element. The button is slidably fixed to the clutching portion and has a groove defined therein. The restoring element functions to force the clutching portion to engage into the groove slidably.
Patent TW-200732321-A (TW)
Title: Fast dissociating dopamine 2 receptor antagonists
Inventor: DE BRUYN MARCEL FRANS LEOPOLD
IPC: C07D401/12
Filed: 2006-10-25
Abstract: The present invention relates to compounds that are fast dissociating dopamine 2 receptor antagonists, processes for preparing these compounds, pharmaceutical compositions comprising these compounds as an active ingredient. The compounds find utility as medicines for treating or preventing central nervous system disorders, for example schizophrenia, by exerting an antipsychotic effect without motor side effects.
Patent TW-200721433-A (TW)
Title: Latch-up prevention in semiconductor circuits
Inventor: CHEN KE-YUAN
IPC: H01L23/58
Filed: 2006-11-07
Abstract: This invention discloses a semiconductor device with latch-up prevention mechanisms. According to one embodiment, it comprises a first N-type region, wherein one or more P-type metal-oxide-semiconductor (PMOS) devices are disposed therein, a second N-type region adjacent to the first N-type region, wherein one or more PMOS devices are also disposed therein, and a P-type region disposed between the first and second N-type regions, wherein one or more guard ring is disposed therein, so that the semiconductor device is more immune to latch-up.
Patent TW-200729560-A (TW)
Title: Arrays of light emitting articles and method of manufacturing same
Inventor: LEATHERDALE CATHERINE ANNE
IPC: H01L33/58
Filed: 2006-11-21
Abstract: Light-emitting articles and methods of manufacturing such articles are disclosed. In one aspect, a light emitting article includes an optical element having an input and an output aperture, each having a size. An LED die having a size is optically coupled to the optical element. The output aperture size of the optical element matches the LED die size. In another aspect, an array of light-emitting articles includes an array of optical elements having a lapped input aperture surface, and an array of LED dies optically coupled to the optical elements at the input aperture. In another aspect, an array of light-emitting articles includes an array of optical elements, and an array of LED dies, each LED die having a size. Each LED die is optically coupled to an optical element at the input aperture. The output aperture size of the optical element is matched to the LED die size.
Patent TW-200802119-A (TW)
Title: Semiconductor device
Inventor: TAKANO TAMAE
IPC: G06K19/07
Filed: 2007-01-30
Abstract: When a conductive layer occupying a large area is provided in a coiled antenna portion, it has been difficult to supply power stably. A memory circuit portion and a coiled antenna portion are disposed by being stacked together; therefore, it is possible to prevent a current from flowing a conductive layer occupying a large area included in the memory circuit portion, and thus, power saving can be achieved. In addition, the memory circuit portion and the coiled antenna portion are disposed by being stacked together, and thus, it is possible to use a space efficiently. Therefore, downsizing can be realized.
Patent TW-200800493-A (TW)
Title: Double side wafer grinder and methods for assessing workpiece nanotopology
Inventor: BHAGAVAT SUMEET S
IPC: H01L21/304
Filed: 2007-01-30
Abstract: A double side grinder comprises a pair of grinding wheels and a pair of hydrostatic pads operable to hold a flat workpiece (e.g., semiconductor wafer) so that part of the workpiece is positioned between the grinding wheels and part of the workpiece is positioned between the hydrostatic pads. At least one sensor measures a distance between the workpiece and the respective sensor for assessing nanotopology of the workpiece. In a method of the invention, a distance to the workpiece is measured during grinding and used to assess nanotopology of the workpiece. For instance, a finite element structural analysis of the workpiece can be performed using sensor data to derive at least one boundary condition. The nanotopology assessment can begin before the workpiece is removed from the grinder, providing rapid nanotopology feedback. A spatial filter can be used to predict the likely nanotopology of the workpiece after further processing.
Patent TW-200810642-A (TW)
Title: In solder coated copper foil ribbon wire and its connection method
Inventor: TAZAWA KENICHI
IPC: H05K3/32
Filed: 2007-01-31
Abstract: To connect a conductor electrode and a ribbon wire on a glass substrate together inexpensively, surely and rigidly without causing any damage. On the exposed portion of an Mo metallic back surface electrode layer 4B formed on a glass substrate 4A, an In solder coated copper foil ribbon wire 1 is mounted where the one side of a copper foil or a tin plated copper foil 2 having a thickness of 300 μm or less or the surface other than the one side is coated with In solder 3 (In 100-90%, Ag 10-0%) having a thickness of 100 μm, and then an ultrasonic solder iron 5 is applied against the upper surface of the copper foil ribbon wire 1 in order to melt the In solder 3, thus connecting the copper foil ribbon wire 1 to the electrode layer 4B. Alternatively, the In solder 3 (above-mentioned composition) is previously soldered to the electrode layer 4B, a ribbon copper foil or a tin plated copper foil 2 is mounted thereon, and then the copper foil 2 is connected to the electrode layer 4B by means of the ultrasonic solder iron 5.
Patent TW-200734815-A (TW)
Title: Radiation sensitive resin composition, laminates and method of preparing the same
Inventor: SHINDOU HIROAKI
IPC: G03F7/004
Filed: 2007-02-07
Abstract: A radiation sensitive resin composition, a laminate using the composition, a method for preparing the laminate by using the composition, and an optical part comprising the laminate are provided to improve heat resistance and to widen the temperature margin in case of melt flowing. The radiation sensitive resin composition comprises 100 parts by weight of a cyclic olefin-based polymer having a cyclic structure at main chain; 1-100 parts by weight of a radiation sensitive compound; and 5-80 parts by weight of a blocked polyisocyanate compound having a blocked isocyanage group. Preferably the cyclic olefin-based polymer has a protic polar group.
Patent TW-200836370-A (TW)
Title: High power LED
Inventor: CHANG ABRAM
IPC: H01L33/00
Filed: 2007-02-26
Abstract: The present invention provides a high power LED, which comprises a first conductive frame and a second conductive frame separated from each other, a spotlight seat integrally formed on top of heat sink portion of the first conductive frame, a light emitting chipset attached inside the spotlight seat, a packaging body, and a heat sink unit including two heat sink blocks and a locking unit. The first conductive frame comprises a heat sink portion having two large-area heat dissipation surfaces located in the front and back sides, and a first locking hole penetrating along the front and back direction. The packaging body is covering on top of the conductive frames, the spotlight seat and the light emitting chipset. The two heat sink blocks are respectively placed against one side of the heat dissipation surfaces, and provided with the second locking hole penetrating along the front and back direction. The locking piece is penetrating through these locking holes for combining the two heat sink blocks and the heat dissipation portion together.
Patent TW-200746696-A (TW)
Title: Methods, apparatus, and system for venue-cast
Inventor: WALKER GORDON KENT
IPC: H04N7/16
Filed: 2007-02-27
Abstract: A communications method for broadcasting an event is provided. This includes generating a plurality of media streams at an event and providing a service to receive the media streams. From the service, an interface can be generated to select a subset of the media streams. Media streams can include audio, video, or other formats that are selected from alternative broadcasting channels provided at the event.
Patent TW-200812673-A (TW)
Title: Game device, method of controlling the same and information recording media
Inventor: SUZUKI EIJI
IPC: A63F13/56
Filed: 2007-03-12
Abstract: Provided is a game device capable of appropriately showing an appearance that a first game character loses the sight of a second game character and responds lately against the second game character when the second game character performs a motion to disappear from the field of view of the first game character. An operated object selecting section (72) selects an operated object character from a plurality of first game characters. An operated object controlling section (74a) allows the state of the game character in a game space, which is selected by the operated object selecting section (72), to change according to an operation signal inputted from an operation means. A selection restricting section (72b) restricts the selection of the first game character performed by the operated object selecting section (72) when a determination section (72a) determines that the position of the second game character is contained within a determined object area of the game space based on the position and orientation of the first game character.
Patent TW-200818710-A (TW)
Title: Method of forming a signal level translator and structure therefor
Inventor: CHAOUI HASSAN
IPC: H03K5/003
Filed: 2007-04-02
Abstract: In one embodiment, a translator circuit is configured to extract an internal operating voltage from a high level of an input signal.
Patent TW-200841851-A (TW)
Title: Meat tenderizer
Inventor: Fu zhi-ren
IPC: A47J43/00
Filed: 2007-04-24
Abstract: This invention is to provide a meat tenderizer, comprising: a grip with a pivoting base on which shaft hole are formed; a roller set pivoted to the pivoting base, the roller set consisting of several wheels having several ratchets disposed around its exterior circumference; and a pivoting shaft penetrating the pivoting base and the roller set to secure the roller set in the pivoting base. With the ratchets disposed around the exterior circumference of the wheels, users can easily cut off the tendon of the meat by the back-and-forth movement of the ratchets. Therefore, the users can use the meat tenderizer of this invention to tenderize the meat.
Patent TW-200845301-A (TW)
Title: Method for fabricating opening and patterning method
Inventor: WU CHANG-RONG
IPC: H01L21/8242
Filed: 2007-05-04
Abstract: A method for fabricating an opening is described. A substrate is provided. A pad layer is formed on the substrate. A doped silicate glass layer is formed on the pad layer. A boro-silicate glass (BSG) layer is formed on the doped silicate glass layer. A patterned mask layer is formed on the BSG layer. A portion of the BSG layer, a portion of the doped silicate glass layer and a portion of the pad layer are removed by using the patterned mask layer to be the mask. The patterned mask layer is moved. A portion of the substrate is removed by using the BSG layer to be the mask. The BSG layer and the doped silicate glass layer are removed by using the vapor hydrofluoric acid.
Patent TW-200845139-A (TW)
Title: Clean method for vapor deposition process
Inventor: TAN HWEE-LEONG
IPC: H01L21/205
Filed: 2007-05-07
Abstract: A method for cleaning a reaction chamber having a pedestal and a carrier ring is provided. First, the pedestal and the carrier ring are cleaned with a high pressure gas. Next, the carrier ring is moved to leave the pedestal, and a low pressure gas is provided to clean the pedestal, the carrier ring, and an area between the pedestal and the carrier ring. Thereafter, a full flush is performed to clean the pedestal and the carrier ring.
Patent TW-200812647-A (TW)
Title: Bilayer tablet for preventing cardiovascular events
Inventor: GUERRERO MARTA
IPC: A61P9/12
Filed: 2007-05-21
Abstract: The present invention relates to a bilayer tablet which comprises a compartment containing a pharmaceutically acceptable simvastatin compound as its active ingredient; and at the same time a separate compartment containing a pharmaceutically acceptable lisinopril compound and a pharmaceutically acceptable folic acid compound as active ingredients, for the prevention of stroke in high-risk conditions or diseases.
Patent TW-200812162-A (TW)
Title: Manufacturing method of connector connecting terminal of wiring board
Inventor: FUJIMURA TAKASHI
IPC: H05K3/00
Filed: 2007-06-01
Abstract: To provide a manufacturing method of a connector connecting terminal thinly and uniformly forming the thickness of a solder layer when the solder layer is formed by printing inexpensive solder paste without using lead to the connector connecting terminal. The connector connecting terminal 20 comprises a plurality of contact pieces 14 mounted on a printed wiring board 10. The termination part of the connector connecting terminal 20 is extended longer than a predetermined length L, and a connection region 22 connecting the extended parts 21 to one another is formed. Solder paste 16 is printed to areas among the contact pieces 14 and all of the extended parts 21 including the connection region 22, and a solder pre-coat layer 17 is formed by fusing the printed solder paste 16. Thereafter, the connector connecting terminal 20 having the predetermined length L is formed by cutting and removing the extended parts 21 including the connection region 22.
Patent TW-200849642-A (TW)
Title: LED heat dissipation module
Inventor: HO CHING
IPC: H01L33/00
Filed: 2007-06-06
Abstract: A LED heat dissipation module is suited to dissipate heat for at least a LED. The LED heat dissipation module includes a thermal base, at least a heat conductor, and multiple fins. The thermal base has a first surface and a second surface corresponding to the first surface. The LED is disposed on the first surface and the heat conductor is disposed on the second surface. In addition, the fins are disposed on the heat conductor, and the fins and the thermal base are separated.
Patent TW-200807679-A (TW)
Title: Integrated circuit package system with offset stack
Inventor: JU JONG-WOOK
IPC: H01L25/04
Filed: 2007-06-12
Abstract: An integrated circuit package system (1100) is provided including mounting a first integrated circuit device (104) over a carrier (106), mounting a second integrated circuit device (108) having an adhesive spacer (212) over the first integrated circuit device (104) in an offset configuration, connecting a first internal interconnect (118) between the carrier (106) and the first integrated circuit device (104) with the first internal interconnect (118) within the adhesive spacer (212), connecting a second internal interconnect (120) between the carrier (106) and the second integrated circuit device (108), and encapsulating the first integrated circuit device (104), the second integrated circuit device (108), the first internal interconnect (118) and the second internal interconnect (120).
Patent TW-200810196-A (TW)
Title: Battery charger chute
Inventor: POISNER DAVID I
IPC: H01M2/10
Filed: 2007-06-28
Abstract: The embodiments of the invention relate to a novel apparatus and method for a battery charging system in a shared environment, as well as for monitoring battery usage and tracking battery location. In one embodiment, the battery charging chute comprises a housing configured to receive a battery via an insertion slot and configured to dispense a battery through a dispensing slot. Within the housing, charging terminals are disposed is a spaced or continuous manner, to come in contact with the charging terminals on batteries inserted into the housing. Optionally, solenoid-controlled gates may be employed at the insertion slot and dispensing slot, to inhibit the removal or insertion of batteries from the incorrect location, to ensure that the battery with the longest residence time in the chute is dispensed to a user. The housing may also include a radio-frequency identification tag reader to permit inventorying and tracking of batteries inserted into the housing.
Patent TW-200816659-A (TW)
Title: A receiver for reducing intersymbol interference of a channel and compensating for signal gain loss, and method thereof
Inventor: LEE JAE-WOOK
IPC: H04B1/10
Filed: 2007-07-04
Abstract: Example embodiments are directed to a receiver for reducing ISI of at least one data transmission channel and compensating for signal gain loss, and method thereof. A receiver may include a high pass filter and a Schmitt trigger controlled by a plurality of first control signals and a plurality of second control signals. The plurality of first control signals and the plurality of second control signals may be used to shift a first trigger voltage and a second trigger voltage of the Schmitt trigger. A method of reducing intersymbol interference and compensating for signal gain loss of a receiver connected to at least one data transmission channel is also provided.
Patent TW-200902184-A (TW)
Title: Combined mold
Inventor: LIN HOU-YAO
IPC: B21J5/02
Filed: 2007-07-13
Abstract: The present invention relates to a combined mold for cold upsetting a fastener piece having a head body and a main body. The combined mold includes a middle trimble, a templet, a concave mold and an internal trimble. The middle trimble includes a first center hole. The templet includes a second center hole, and is arranged in the first center hole to form interference fit with the middle trimble. The concave mold includes a third center hole, and is arranged in the second center hole to form interference fit with the templet. The internal trimble includes a fourth center hole having an inner diameter same to that of the third center hole. One end of the internal trimble collides with one end of the concave mold, and the fourth center hole is coaxial with the third center hole.
Patent TW-200911041-A (TW)
Title: Circuit board having electrical connecting structure and fabrication method thereof
Inventor: HU WEN-HUNG
IPC: H05K3/46
Filed: 2007-08-23
Abstract: A printed circuit board having an electrical connecting structure is disclosed, including a main body having inner-layer circuits and a circuit layer formed on at least an outermost surface thereof, the circuit layer having a plurality of electrical connecting pads and circuits, wherein part of the circuits electrically connect to the electrical connecting pads and the other part of the electrical connecting pads electrically connect to the inner-layer circuits by a conductive blind via, wherein the connecting pads are configured to connect with external electronic components; an insulating protective layer disposed on the main body and formed with openings for exposing the electrical connecting pads therefrom; a plurality of conductive posts disposed on the connecting pads; and a separate metal pad disposed on the insulating protective layer that does not have electrical connection capability, thereby eliminating the necessity to form conductive posts and connecting pads under the metal pad in the protective layer and facilitating formation of circuits under the protective layer to increase layout space. The invention further proposes a method of fabricating the circuit board described above.
Patent TW-200823260-A (TW)
Title: Thermoplastic polycarbonate compositions with improved static resistance
Inventor: HOEKS THEODORUS LAMBERTUS
IPC: C08K5/42
Filed: 2007-08-24
Abstract: A thermoplastic resin composition comprises an aromatic polycarbonate; an impact modifier; a flame retardant; and from 0.9 to 5.38 mol% of an anti-static additive having the formula: wherein X is independently selected from halogen or hydrogen provided that at least one X is halogen; n, m and p are integers from 0 to 12; Y is zero or a heterocyclic atom, other than carbon, of an atomic ring and is either nitrogen, oxygen, sulfur, selenium, phosphorus, arsenic, and the like; R1, R2, and R3 are the same, each having an aliphatic hydrocarbon radical with 1 to 8 carbon atoms or an aromatic hydrocarbon radical of 6 to 12 carbon atoms and R4 is a hydrocarbon radical with 1 to 18 carbon atoms; wherein the amount of the anti-static additive is based on 100 kg of the composition.
Patent TW-200910165-A (TW)
Title: Method for adjusting sensing range and sensitivity and inertia interactive aparatus and system using thereof
Inventor: LU YING-KO
IPC: A63F13/211
Filed: 2007-08-30
Abstract: The present invention provides an architecture of a method, apparatus and system for user adjusting the sensing range and sensitivity dynamically according various user status so as to obtain an appropriate interactive effect regardless of different age group of users. In the present invention, a way of adjusting sensing range according to a switch signal, or a ratio for adjusting magnitude of a processed signal, or changing the threshold of the application program directly are illustrated as embodiments respectively for adjusting the sensing range and sensitivity dynamically.