baber/WOPTO huggingface dataset:
Patent TW-202240114-A (TW)
Title: Method and system for dynamically adjusting defrosting timing of freezer which can judge the frosting state of the freezer according to the time spent on the previous defrosting to dynamically adjust the next defrosting time point so as to advance or delay defrosting in addition to avoiding unnecessary consumption of electric energy caused by defrosting
Inventor: YOU DE-RONG
IPC: F25D21/06
Filed: 2021-04-08
Abstract: A method for dynamically adjusting the defrosting timing of a freezer enables the freezer to continuously upload operation information to the server so that the server generates a historical operation data corresponding to the freezer. When the server judges that the defrosting time included in the operation information uploaded by the freezer is less than the preset defrosting time, a coefficient is generated according to the historical operation data. Further, an offset time is calculated and obtained according to the time difference between the defrosting time and the preset defrosting time and the coefficient, the next defrosting time point of the freezer is adjusted to delay the offset time, and then the adjusted next defrosting time point is sent to the freezer so that the freezer performs the defrosting operation according to the adjusted next defrosting time point. After the defrosting is completed, the operation information including the defrosting time is uploaded to the server. A system for dynamically adjusting the defrosting timing of a freezer comprises a freezer and a server capable of communicating with the freezer to control timely defrosting of the freezer, wherein the server includes a database. When the server judges that the defrosting time is equal to the preset defrosting time, it adjusts the next defrosting time point of the freezer forward so that the next defrosting time point is advanced by a preset time. The server calculates and obtains the preset time according to a basic time and the coefficient. The freezer communicates with the server via the Internet. The freezer and the server are integrated in the refrigeration equipment, and the freezer and the server are electrically coupled to communicate with each other.
Patent TW-202208015-A (TW)
Title: Indwelling needle assembly
Inventor: YASHIMA Takuya
IPC: A61M39/22
Filed: 2021-04-21
Abstract: Provided is an indwelling needle assembly having improved assemblability. The indwelling needle assembly 1 comprises: an outer needle 10; an outer needle base 20; a cylindrical moving member 30 capable of moving in the axial direction of the outer needle base 20, and disposed in the inner space of the outer needle base 20 in such a manner that the respective axial directions are aligned with each other; a valve body 40 fixed to the moving member and having the constitution of a bottomed cylinder shape that includes a cylindrical section 42 in tight contact with the inner circumferential surface 30a of the moving member 30, and a bottom section 41 provided with an opening/closing hole 44; an opening valve member 22a protruding, in the inner space of the outer needle base 20, from the forward end side to the base end side of the outer needle base 20; and a support protrusion 23b protruding toward the axial center of the outer needle base 20, at a position closer to the base end of the outer needle base 20 than the forward end of the opening valve member 22a, on the inner circumferential surface 23a of the outer needle base 20. The moving member 30 is constituted from a harder material than that of the valve body 40, and includes: a fitting section 31 which fits the inner circumferential surface 23a of the outer needle base 20 on the forward end side of the support protrusion 23b; and a supported section 32 which abuts the support protrusion 23b, thereby suppressing an inclination of the moving member 30.
Patent TW-202141564-A (TW)
Inventor: LIN CHUN-CHIEH
IPC: H01J37/08
Filed: 2021-04-22
Abstract: A mechanical arm and an ion implantation apparatus are provided. The mechanical arm includes a first arm, a second arm, a third arm, a vertical arm and a wafer holder. The long axis of the first arm, the second arm and the third arm is perpendicular to the Z axis. The proximal end of the second arm is pivotally connected to the distal end of the first arm. The proximal end of the third arm is pivotally connected to the distal end of the second arm. The lower end of the vertical arm is fixedly connected to the distal end of the third arm. The wafer holder is pivotally connected to the upper end of the vertical arm along a pivoting direction. The pivoting direction is perpendicular to the long axis direction of the vertical arm and is not parallel to the long axis of the third arm.
Patent TW-202245558-A (TW)
Inventor: LAU JOHN HON-SHING
IPC: H05K3/40
Filed: 2021-05-13
Abstract: 一種電路板結構，包括一重配置線路結構層、一增層線路結構層以及一連接結構層。重配置線路結構層包括多個第一連接墊。增層線路結構層配置於重配置線路結構層的一側，且包括多個第二連接墊。重配置線路結構層的線寬與線距小於增層線路結構層的線寬與線距。連接結構層配置於重配置線路結構層與增層線路結構層之間，且包括一基材與貫穿基材的多個導電膠柱。第一連接墊分別透過導電膠柱與第二連接墊電性連接。第一連接墊與第二連接墊分別嵌入基材的相對兩表面。
Patent TW-202202770-A (TW)
Inventor: SUN PENG
IPC: F16L3/18
Filed: 2021-05-14
Abstract: A manifold assembly including a guide rod, a method of moving a filter capsule along the manifold assembly, and a method of filtering fluid using the manifold assembly are provided.
Patent TW-202249546-A (TW)
Title: Interlayer connective structure of wiring board and method of manufacturing the same
Inventor: CHANG CHI-MIN
IPC: H05K3/42
Filed: 2021-06-01
Abstract: An interlayer connective structure is suitable for being formed in a wiring board, in which the wiring board includes two traces and an insulation part between the traces. The insulation part has a through hole. The interlayer connective structure located in the through hole is connected to the traces. The interlayer connective structure includes a column and a pair of protuberant parts. The protuberant parts are located at two ends of the through hole respectively and connected to the column and the traces. The protuberant parts stick out from the outer surfaces of the traces respectively. Each of the protuberant parts has a convex curved surface, in which the distance between the convex curved surface and the axis of the through hole is less than the radius of the through hole.
Patent TW-202247731-A (TW)
Title: Circuit board and method for manufacturing the same
Inventor: LI CHENG-JIA
IPC: H05K3/40
Filed: 2021-06-01
Abstract: A circuit board includes a wiring board which includes a substrate layer, a first conductive wiring layer, a second conductive wiring layer, a first conductor layer, a first insulation layer, and a second conductor layer. The first and second conductive wiring layers are disposed on opposite surfaces of the substrate layer. The wiring board defines a first groove penetrating through the substrate layer and the first conductive wiring layer. The second conductive wiring layer is exposed from the first groove. The first conductor is disposed in the first groove and is connected to the first and second conductive wiring layers. The first conductor layer defines a second groove, the first insulation layer is disposed in the second groove and defines a third groove. The second conductor layer is disposed in the third groove. A method for manufacturing the circuit board is further disclosed.
Patent TW-202207356-A (TW)
Title: Substrate comprising an inductor and a capacitor located in an encapsulation layer
Inventor: KIM JONGHAE
IPC: H01L23/48
Filed: 2021-06-11
Abstract: A package that includes a power amplifier and a substrate coupled to the power amplifier. The substrate includes an encapsulation layer, a capacitor device located in the encapsulation layer, an inductor located in the encapsulation layer, at least one first dielectric layer coupled to a first surface of the encapsulation layer, and a plurality of first interconnects coupled to the first surface of the encapsulation layer. The plurality of first interconnects is located at least in the at least one first dielectric layer. The plurality of first interconnects is coupled to the capacitor device and the inductor. The inductor and the capacitor device are configured to be electrically coupled together to operate as elements of a matching network for the power amplifier. The capacitor device is configured to be coupled to ground.
Patent TW-202207763-A (TW)
Title: 包括複數個晶片之量子計算電路及其製造方法
Inventor: HASSEL JUHA
IPC: H05K3/40
Filed: 2021-06-24
Abstract: 量子計算電路包括其上具有至少一個量子位元之第一晶片，及其上至少具有除了量子位元之外的其他量子電路元件之第二晶片。所述第一晶片和所述第二晶片以覆晶方式方式堆疊，且通過凸塊結合彼此，所述凸塊結合包括結合凸塊。
Patent TW-202207340-A (TW)
Title: Automatic wafer carrying system and method for transferring wafer using the system
Inventor: Yang hua-long
IPC: H01L21/687
Filed: 2021-06-24
Abstract: An automatic wafer carrying system and a method for transferring a wafer using the system are provided. The system includes: a vacuum chamber, including a plurality of wafer carrying stations; a plurality of first paddles and second paddles, all located inside the vacuum chamber and capable of rotating synchronously separately, where each of the plurality of second paddles and a corresponding first paddle form a pair of paddles to carry a wafer jointly; a double-ferrule magneto fluid, connected to the vacuum chamber in a sealed manner, and connected to the plurality of first paddles and the plurality of second paddles, to drive the first paddles or the second paddles or both the first and second paddles to rotate; a first drive mechanism, and a second drive mechanism. The system can reduce movement steps of a wafer during transfer, so as to improve transfer accuracy and stability of the wafer and reduce a position error of the wafer.
Patent TW-202139500-A (TW)
Title: Vapor deposition mask package and vapor deposition mask packaging method
Inventor: IKENAGA CHIKAO
IPC: H01L51/56
Filed: 2017-09-21
Abstract: This vapor deposition mask package is provided with: a receiving section; a cover section that faces the receiving section; and a vapor deposition mask that is disposed between the receiving section and the cover section and has effective regions in which multiple through holes are formed. The receiving section has a first counterface that faces the cover section and a recess provided in the first counterface. The recess is covered by a first flexible film. The effective regions of the vapor deposition mask are disposed above the recess with the first flexible film therebetween.
Patent TW-202300968-A (TW)
Inventor: CHANG YEONG-MING
IPC: G02B9/60
Filed: 2021-06-29
Abstract: 一種光學成像系統，由物側至像側依序包含第一透鏡、第二透鏡、第三透鏡、第四透鏡以及第五透鏡。第一透鏡至第五透鏡中至少一透鏡具有正屈折力。第五透鏡可具有負屈折力，其兩表面皆為非球面，其中第五透鏡的至少一表面具有反曲點。光學成像系統中具屈折力的透鏡為第一透鏡至第五透鏡。當滿足特定條件時，可具備更大的收光以及更佳的光路調節能力，以提升成像品質。
Patent TW-202303103-A (TW)
Inventor: CHANG YUNG-CHANG
IPC: G01J5/52
Filed: 2021-07-06
Abstract: 本發明公開一種溫度量測裝置的溫度校正方法，其包括：提供一溫度量測裝置，其包括可活動遮擋模組、第一以及第二非接觸式溫度感測模組，可活動遮擋模組的可活動遮擋結構包括用於透過電控加熱器的加熱而產生一預定加熱溫度的一黑色物質；可活動遮擋結構透過電控驅動器的帶動而移動到一第一位置，以使得第二非接觸式溫度感測模組的第二溫度量測視角完全被可活動遮擋結構的黑色物質所遮擋；第二非接觸式溫度感測模組在第二溫度量測視角內透過測量可活動遮擋結構的黑色物質所產生的預定加熱溫度，以取得黑色物質的一黑體溫度資訊。藉此，第一非接觸式溫度感測模組可以透過第二非接觸式溫度感測模組所取得的黑體溫度資訊，以進行溫度校正。
Patent TW-202210875-A (TW)
Title: Antireflective member, and polarizing plate, image display device, and antireflective article in which said antireflective member is used, as well as method for selecting antireflective member
Inventor: SUZUKI SHO
IPC: G02B5/30
Filed: 2021-07-14
Abstract: Provided is an antireflective member whereby scratch resistance can be improved. An antireflective member having, on a light-transmissive substrate, a low-refractive-index layer containing a binder resin and hollow particles, the antireflective member satisfying condition 1. Condition 1: In a 5 [mu]m * 5 [mu]m region of the surface of the antireflective member on the side having the low-refractive-index layer with reference to the light-transmissive substrate, the power spectral intensity of the elevation for each wavelength is calculated by implementing spatial frequency analysis of the elevation. When the sum of the power spectral intensities of the elevation for each wavelength is calculated, and the sum is then normalized to 1, the power spectral intensity P1 of the elevation at a wavelength of 1.25 [mu]m is 0.015 or greater.
Patent TW-202217928-A (TW)
Title: Pattern forming method
Inventor: ISHIBASHI SHOTA
IPC: H01L21/3065
Filed: 2021-07-29
Abstract: There is provided a pattern forming method for forming a pattern on a substrate. The method comprises preparing on a base a substrate in which a plurality of core materials arranged in a convex shape and in a line shape, and first and second line materials arranged in a convex shape and in a line shape on one side and the other side of each of the core materials, respectively, are formed, selectively forming a mask material on any one of the first and the second line materials by a process including anisotropic film formation, by a process including etching using a line mask having a line-shaped hole at a portion corresponding to a region where line cutting is performed, etching and removing the one on which the mask material is not formed among the first and the second line materials in the region, and removing the core material.
Patent TW-202219168-A (TW)
Title: Compound material, molded body, and cured product of compound material
Inventor: YAMAGUCHI SHOHEI
IPC: C08K3/08
Filed: 2021-08-30
Abstract: A compound material according to one aspect of the present invention comprises a metal powder and a resin composition that contains an epoxy resin, a curing agent and a coupling agent; the coupling agent contains a first silane compound which has a functional group that is selected from among an epoxy group, an amino group, a ureido group and an isocyanate group, and a second silane compound which has a chain hydrocarbon group having 6 or more carbon atoms; and the content of the metal powder is not less than 90% by mass but less than 100% by mass.
Patent TW-202227634-A (TW)
Inventor: RODINO-KLAPAC LOUISE
IPC: C07K14/47
Filed: 2021-08-30
Abstract: 本文描述治療肌肉失養症之方法，該等方法包含投與重組AAV (rAAV) scAAVrh74.MHCK7.hSGCG載體；表現患者之γ-肌聚醣基因之方法；包含該rAAV之醫藥組成物；及產生該rAAV之方法。
Patent TW-202310803-A (TW)
Title: Acne removal apparatus patch and acne removal apparatus including acne removal apparatus patch wherein an acne removal apparatus patch layer is formed so that the acne removal apparatus can be prevented from puncturing the human skin
Inventor: HONG SHENG-YAO
IPC: A61Q19/00
Filed: 2021-09-03
Abstract: Provided are an acne removal apparatus patch and an acne removal apparatus including the acne removal apparatus patch. The acne removal apparatus patch is attached to an acne removal apparatus to form an acne removal apparatus patch layer so that the acne removal apparatus can be prevented from puncturing the human skin when the acne removal apparatus deep penetrates into pores of the human skin or is in contact with the skin, wherein the acne removal apparatus can be fully or partially wrapped by the acne removal apparatus patch layer. A form of the acne removal apparatus patch layer conforms to the part of the acne removal apparatus to be wrapped. The acne removal apparatus patch layer is assembled in a form of a patch group, that is, a plurality of acne removal apparatus patch layers are combined in a patch material, and the acne removal apparatus patch layers are mounted in the patch material in a form that is easy to separate. The patch material and the plurality of acne removal apparatus patch layers are pasted in a release paper. When in use, the acne removal apparatus patch layers are torn off from the release paper for easy use.
Patent TW-202222911-A (TW)
Title: Resin composition, cured object, layered product, method for producing cured object, and semiconductor device
Inventor: ASAKAWA DAISUKE
IPC: H01L21/312
Filed: 2021-09-14
Abstract: A resin composition which includes a precursor of a cyclization-product resin and satisfies the following requirement 1 and/or requirement 2; a cured object obtained by curing the resin composition; a layered product including the cured object; a method for producing the cured object; and a semiconductor device including the cured object or the layered product. Requirement 1: To contain compound B, which has both a group that generates an acid group by the action of heat and/or light and a group that generates a base by the action of an acid. Requirement 2: To contain both compound C, which has a group that generates an acid group by the action of heat and/or light and which differs from the compound B, and compound D, which has a group that generates a base by the action of an acid.
Patent TW-202314492-A (TW)
Inventor: ZHANG TIAN-CHAO
IPC: G06F9/455
Filed: 2021-09-24
Abstract: 一種硬碟模擬裝置及應用該裝置的測試系統及其測試方法，透過提供具有檢測電路的硬碟模擬裝置以連接待測裝置，並且串接硬碟模擬裝置及待測裝置的測試連接埠，以便在待測裝置執行測試程序時，讀取待測裝置的插槽的信號連接狀態，以及通過測試連接埠傳送檢測指令驅動硬碟模擬裝置的檢測電路檢測電源腳位、時脈腳位及系統管理匯流排的信號以產生檢測結果，進而根據信號連接狀態及檢測結果驗證待測裝置的正確性，用以達到降低待測裝置的測試成本之技術功效。
Patent TW-202322311-A (TW)
Title: Immersion-type heat dissipation structure and method for manufacturing the same
Inventor: YANG CHING-MING
IPC: H01L23/36
Filed: 2021-11-29
Abstract: An immersion-type heat dissipation structure and method for manufacturing the same are provided. The immersion-type heat dissipation structure includes a first heat dissipation element and a second heat dissipation element that is disposed on the first heat dissipation element and has a plurality of heat dissipation pin fins. The second heat dissipation element is a porous heat dissipation element, the first heat dissipation is a solid heat dissipation element, and the thermal conductivity of the first heat dissipation is higher than that of the second heat dissipation element. The shortest distance between the bottoms of any two adjacent heat dissipation pin fins ranges from 0.2 to 1.2 mm. The minimum diameter of top surface of any heat dissipation pin fin ranges from 0.2 to 1.2 mm. The draft angle of sidewall of any heat dissipation pin fin ranges from 1 to 5DEG.
Patent TW-202230489-A (TW)
Title: Substrate treatment device, nozzle assembly, method for manufacturing semiconductor device, and program
Inventor: SHIMADA HIRONORI
IPC: H01L21/31
Filed: 2021-11-29
Abstract: A substrate treatment device according to the present invention is provided with: a nozzle that is arranged along an inner wall surface of a treatment container and that is provided with a gap from the inner wall surface of the treatment container at least at a lower section of said treatment container; a nozzle base section that supports the nozzle and that has, in the interior thereof, a flow passage communicating with the nozzle; a support member that is provided along the inner wall surface and that is joined to a first joining surface of the nozzle base section, said first joining surface not facing the inner wall surface; and a slope adjusting tool configured to be capable of adjusting the slope of the nozzle base section at a position displaced toward the center of the treatment container with respect to the center of gravity of a nozzle assembly including the nozzle and the nozzle base section.
Patent TW-202325234-A (TW)
Inventor: HO MING-CHUN
IPC: A61B34/10
Filed: 2021-12-16
Abstract: A verification block structure and a verification system for orthopedic surgery are provided. The verification block structure includes a base and a simulated bone block. The base has a carrying portion and a bottom portion corresponding to the carrying portion. The simulated bone block is removably fixed to the base, and the shape or material of the simulated bone block is determined according to the bone characteristics of the patient and/or the operation method to be implemented.
Patent TW-202312397-A (TW)
Title: Semiconductor package structure and method for preparing the same
Inventor: SHIH SHING-YIH
IPC: H01L23/535
Filed: 2021-12-21
Abstract: A semiconductor package structure includes a first semiconductor wafer including a first bonding pad. The semiconductor package structure also includes a second semiconductor wafer including a second bonding pad and a third bonding pad. The second bonding pad and the third bonding pad are bonded to the first bonding pad of the first semiconductor wafer. The semiconductor package structure further includes a first via penetrating through the second semiconductor wafer to physically contact the first bonding pad of the first semiconductor wafer. A portion of the first via is disposed between the second bonding pad and the third bonding pad.
Patent TW-202233024-A (TW)
Title: Plasma processing apparatus and plasma processing method can ignite the plasma stably in a plasma processing apparatus that generates plasma by inductive coupling
Inventor: MACHIYAMA WATARU
IPC: H01L21/67
Filed: 2022-01-05
Abstract: The plasma can be ignited stably. A plasma processing apparatus is configured for generating plasma by inductive coupling in a processing chamber, which comprises a VUV lamp mounted on the wall of the processing chamber to communicate with the interior of the processing chamber; a gate that is disposed between the VUV lamp and the processing chamber for the opening/closing between the VUV lamp and the processing chamber; and a bypass line connecting the space between the gate and VUV lamp with the interior of the processing chamber.
Patent TW-202247090-A (TW)
Title: The method and system for providing mobility service for group user of self-driving car
Inventor: KIM YOUNG-REAL
IPC: G06Q50/30
Filed: 2022-01-07
Abstract: The present invention relates to a service technology for providing a transportation service to an organization user by using a self-driving car. Also, the present invention relates to a method and system for providing a transportation service which transports a user belonging to an organization, such as a school, a public institution, a local government, or a company, to a destination by using a self-driving car. In order to efficiently provide the transportation service to users belonging to the organization, each organization having the right to use the transportation service receives the right to use the transportation service by donating a fund, providing a facility, or paying a prepaid usage fee or a membership fee. Another method for providing the transportation service is a post-payment system, in which a server provides the transportation service in advance upon each user's request, and then charges a usage fee to each user or each user's organization for the provided transportation service. In addition, in order to provide a more efficient transportation service, proposed is an A2A shared transportation service in which, when a plurality of users request a transportation service including a departure point and a destination, users with the same adjacent departure point and the same adjacent destination are allowed to share the same vehicle.
Patent TW-202302890-A (TW)
Title: Ta-B sputtering target
Inventor: UMEMOTO KEITA
IPC: C23C14/34
Filed: 2022-01-27
Abstract: This Ta-B sputtering target contains Ta and B, and is characterized by having Ta-B compound particles comprising one or more kinds selected from among Ta2B, Ta3B2, Ta3B4, Ta5B6, TaB, and TaB2, wherein the abundance ratio of elementary substances of B in the B content is 50% or less.