baber/WOPTO huggingface dataset:
Patent TW-I220299-B (TW)
Title: Semiconductor process
Inventor: LAI ERH-KUN
IPC: H01L21/8242
Filed: 2003-03-18
Granted: 2004-08-11
Abstract: A semiconductor process comprises the following steps: providing a substrate with a pad oxide, the substrate is divided into a cell region a periphery region and a DRAM region; forming a plurality of patterned buried drain regions in the cell region; forming a plurality of shallow trench isolation structures in the periphery region and DRAM region; removing the pad oxide; forming an oxide-nitride-oxide layer on the substrate; forming a polysilicon layer on the substrate, wherein the polysilicon layer pattern in the cell region is perpendicular to the patterned buried drain regions; forming an insulating layer on the structure; planarizing the insulating layer; removing the polysilicon layer pattern in the periphery region; performing a well implantation to form a plurality of wells in the periphery region; removing the oxide-nitride-oxide layer; and forming a salicide layer on the polysilicon layer pattern in the cell region.
Patent TW-I268813-B (TW)
Title: Process for forming a patterned thin film conductive structure on a substrate
Inventor: HAUBRICH JEANNE E
IPC: H05K3/18
Filed: 2003-04-08
Granted: 2006-12-21
Abstract: A process for forming a patterned conductive structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired conductive structures will be formed in the areas where the printed material is not present, i.e. a negative image of conductive structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired conductive structures will be formed in the areas where the printed material is present, i.e. a positive image of the conductive structure is printed. The conductive material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned electrode structures.
Patent TW-583492-B (TW)
Title: Manufacturing method for LCD panel with high aspect ratio
Inventor: LIANG GUO-CHAU
IPC: H01L21/84
Filed: 2003-04-17
Granted: 2004-04-11
Abstract: There is provided a manufacturing method for LCD panel with high aspect ratio capable of reducing the number of masks, which forms a passive layer on a transparent substrate with plural thin-film transistors and uses half-tone mask to complete en exposure process. An out lead bonding (OLB) area is provided on the periphery of the transparent substrate. After developing, most area of passive layer of the out lead bonding is removed. An etching process is performed to expose the top of the insulating layer on the out lead bonding area, and plural through holes are formed on the insulating layer. The metal wires are exposed out of the through holes to form out lead bonding pads. Finally, a transparent conductive layer of specific pattern is formed on the passive layer. The transparent conductive layer enters the through holes of the passive layer to connect with the thin film transistors.
Patent TW-I220053-B (TW)
Title: Plasma display panel
Inventor: LIN YU-KAI
IPC: H01J17/49
Filed: 2003-05-02
Granted: 2004-08-01
Abstract: A plasma display panel is disclosed, which comprises a panel, metal plate and driving module. The metal plate is connected with the panel in the way of thermal conduction, the metal plate comprises a main body part, erecting part and platform part. The mainbody part is allocated on the panel, one end of the erecting part is connected to one end of the mainbody part, the erecting part is about perpendicular to the mainbody part. One end of the platform is connected to the other end of the erecting part. The platform part is about perpendicular to the erecting part. The driving module is connected with the aluminum plate in the way of thermal conduction. The driving module comprises an aluminum sheet and FPC (flexible printed circuit board). The aluminum sheet is allocated on the platform part, the FPC is allocated on the aluminum sheet in the way of thermal conduction, and is electrically connected to the panel.
Patent TW-I238736-B (TW)
Title: Set of elements for assembling structures
Inventor: TUSACCIU EDOARDO PIO
IPC: A63H33/04
Filed: 2003-05-20
Granted: 2005-09-01
Abstract: The invention relates to a set of elements for assembling complex structures, the set comprising a plurality of first magnetic bar elements, having a first length, a plurality of ferromagnetic elements, and a plurality of second magnetic bar elements, having a second length. Said two lengths and the dimension of said ferromagnetic elements are such to allow the assembling of complex structures, e.g. classic crystallographic structures.
Patent TW-I220685-B (TW)
Title: Pneumatic illuminating device
Inventor: LIOU SHIANG-CHI
IPC: A61C1/02
Filed: 2003-07-11
Granted: 2004-09-01
Abstract: A pneumatic illuminating device, including a pneumatic driving device, a magnetic membrane placed over the pneumatic driving device, a planar coil spaced from the magnetic membrane by a distance, such that when the magnetic membrane is driven by the pneumatic driving device to vary its magnetic field, the planar coil generates an induced electromotive force. The induced electromotive force is then able to drive an illuminating device to illuminate so as to eliminate the need of additional power sources and the use of optical fibers for transmission service while providing easy illuminating effect.
Patent TW-I224740-B (TW)
Title: Start-up automatic frequency control (AFC) method and apparatus
Inventor: DEMIR ALPASLAN
IPC: H04B1/707
Filed: 2003-07-25
Granted: 2004-12-01
Abstract: Method and apparatus for adjusting the frequency of a VCO at a receiver to synchronize the receiver with the transmitter by correlating a synchronization code channel with training sequences to estimate positive and negative offsets which are employed to estimate an error, which is then filtered. The filter output provides voltage controlling the VCO. The same technique may be employed to control a numeric controlled oscillator (NCO).
Patent TW-I226642-B (TW)
Title: Semiconductor memory device
Inventor: ANZAI SHINSUKE
IPC: G11C16/06
Filed: 2003-07-29
Granted: 2005-01-11
Abstract: A semiconductor memory device is provided, which comprising a memory cell array comprising a two-value memory region and a multi-value memory region, in which the two-value memory region comprises a plurality of memory cells each storing 1-bit data and the multi-value memory region comprises a plurality of memory cells each storing 2 or more-bit data, and a sense amplifier section common to data read of the two-value memory region and data read of the multi-value memory region, for reading data stored in a selected memory cell by comparing a potential of the selected memory cell with a reference potential.
Patent TW-I234005-B (TW)
Title: Continuously variable analog micro-mirror device
Inventor: BLAKLEY DANIEL ROBERT
IPC: G02B26/08
Filed: 2003-08-25
Granted: 2005-06-11
Abstract: A micro-mirror device includes a substrate, a reflective element spaced from the surface of the substrate, a pair of electrodes disposed adjacent to the surface of the substrate, spaced apart from each other, and disposed adjacent to opposite ends of the reflective element, and also includes a dielectric liquid disposed at least between the reflective element and the pair of electrodes. The reflective element is adapted to be positioned at any position within a continuous range between a first position and a second position in response to analog electrical signals applied to the pair of electrodes.
Patent TW-I226553-B (TW)
Title: Bus adapting module
Inventor: LU SAMUEL
IPC: G06F13/38
Filed: 2003-10-31
Granted: 2005-01-11
Abstract: The present invention discloses a bus adapting module, which is composed of a PCI-X golden finger slot and a PCI-EXPRESS golden finger slot, such that a PCI/PCI-X card or a PCI-EXPRESS card could employ one or more PCI-X slots or one or more PCI-EXPRESS slots on the bust adapting module disclosed in the present invention for the connection to the motherboard of the server for the signal communication.
Patent TW-I255762-B (TW)
Title: A system and a method for cooling a tool
Inventor: MANUAL MARK
IPC: B21D37/16
Filed: 2003-11-07
Granted: 2006-06-01
Abstract: A tool (10) having improved heat transfer characteristics and a method for cooling a tool (10) which is comprised of several selectively coupled sectional members (12-17). Each selected sectional members (16) include an outer contour (19), while each of the sectional members (12-17) include at least one coolant passage (14) cooperatively form a coolant manifold (18) which is a predetermined distance from contours (19). An amount of coolant (40) is passed through manifold (18) to cool tool (10).
Patent TW-I283779-B (TW)
Title: Light conducting plate and logo displaying device using the same
Inventor: TSAI KUN-JUNG
IPC: F21V8/00
Filed: 2003-12-02
Granted: 2007-07-11
Abstract: The present invention relates to a light conducting plate and a logo displaying device using the same. The light conducting plate includes an incident surface for receiving incident light, a bottom surface for reflecting the incident light, a light emitting surface for directing the light to emit. There are plural grooves which constitute a logo on the bottom surface.
Patent TW-I280831-B (TW)
Title: High speed circuit board and method for fabrication
Inventor: CHAN BENSON
IPC: H01L25/065
Filed: 2004-01-16
Granted: 2007-05-01
Abstract: A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of making these structures have also been provided.
Patent TW-I295242-B (TW)
Title: Safety document with at least a safety element
Inventor: REINHART WERNER
IPC: B42D15/00
Filed: 2004-02-02
Granted: 2008-04-01
Abstract: There is proposed a security document comprising a security element, wherein the security element is of such a configuration that it can be determined by means of the sense of human touch. For that purpose either the surface nature of various surface regions can be selected differently so that the configuration and size of the different surface regions can be determined by the human sense of touch. Another possibility is for the substrate of the security document to be provided with suitably shaped openings which can be identified by means of the human sense of touch. A combination of different tactile security elements of that kind is also described.
Patent TW-I262002-B (TW)
Title: System and method for providing service of blocking connection to harmful sites by using tunneling protocol and packet mirroring scheme
Inventor: KIM SEONG-KOOK
IPC: H04L29/06
Filed: 2004-02-19
Granted: 2006-09-11
Abstract: Disclosed is a system and method for providing a service of blocking connection to harmful sites, which employs both a tunneling protocol and a packet mirroring mode. When the connection blocking service is selectively provided to Internet users, a tunneling protocol such as L2TP (layer 2 tunneling protocol), GRE (generic routing encapsulation), MPLS (multi protocol label switching) or IPSec (IP security) is employed to effectively prevent connection to harmful sites such as sexual or gambling sites at the request of users. Accordingly, the Internet users are classified into subscribers and non-subscribers of the connection blocking service to implement the harmful site connection blocking function. When a malfunction occurs in the system due to an overload of the system, a packet mirroring mode, which has no influence on the network load, is activated to provide the connection blocking service.
Patent TW-I224860-B (TW)
Title: Automatically-packaging apparatus which can package an optical sensing module with a preferred distance between a lens and an optical sensor
Inventor: LIU CHIA-YI
IPC: G06K9/00
Filed: 2004-03-18
Granted: 2004-12-01
Abstract: An automatically-packaging apparatus which can package an optical sensing module with a preferred distance between a lens and an optical sensor includes a base, an image-analyzing module, a distance-adjusting module, and a stains-detecting module. The automatically-packaging apparatus packages a lens and an optical sensor separated in a preferred distance into an optical sensing module, and is able to detects if there are stains on the lens or there are flaws in the optical sensor. The advantages of the automatically-packaging apparatus are to package and detect optical modules quickly, efficiently and accurately.
Patent TW-I243524-B (TW)
Title: A semiconductor device equipped with a protection circuit to protect the internal circuit
Inventor: KITAGAWA NOBUTAKA
IPC: H01L21/822
Filed: 2004-03-23
Granted: 2005-11-11
Abstract: A semiconductor device is provided with an internal circuit and a protection circuit. The internal circuit has a first well and a first semiconductor element formed in the first well. The protection circuit has a second well and a second semiconductor elements formed in the second well. The impurity concentration of the second well is smaller than that of the first well. And the protection circuit is used to protect the first semiconductor elements.
Patent TW-I264174-B (TW)
Title: An operating apparatus and an electric instrument
Inventor: MIYAZAWA OSAMU
IPC: H01L41/09
Filed: 2004-04-02
Granted: 2006-10-11
Abstract: An operating apparatus 1 of the present invention has a driven element 5, a frame 4 having a contacted element 51 and rotatably supporting the driven element 5, and an ultrasonic motor. The ultrasonic motor includes a vibrating element 6. The vibrating element 6 includes a first piezoelectric element 62 that undergoes extension and contraction by application of an AC voltage, a reinforcing plate 63 having a contact portion 66 and an arm portion 68, and a second piezoelectric element 64 that undergoes extension and contraction by application of an AC voltage. The first piezoelectric element 62, the reinforcing plate 63, and the second piezoelectric element 64 are laminated in this order. The vibrating element 6 is fixedly mounted on the driven element 5 in a state where the contact portion 66 abuts on the contacted element 51. Further, the vibrating element 6 receives reaction force from the contacted element 51 when the vibrating element 6 vibrates so that the driven element 5 is rotated together with the vibrating element 6 by means of the reaction force.
Patent TW-I231386-B (TW)
Title: A rectangular waveguide with periodical structures and the design method thereof
Inventor: TZUANG CHING-KUANG C
IPC: G02B6/10
Filed: 2004-04-06
Granted: 2005-04-21
Abstract: According to this invention, some or all of the surfaces of a traditional rectangular waveguide are replaced with periodical structures. It will not be necessary to use materials with high dielectric constants or change the operation mode of the rectangular waveguide. The rectangular waveguide with lower cut-off frequence than the traditional rectangular waveguide with the same size is designed in accordance with the perturbation characteristics below the band-gap frequency band. On the other hand, the rectangular waveguide, which uses TM10 as dominant mode, is realized in accordance with high impedance surface in the band-gap frequency band. According to this invention, a method of designing rectangular waveguide with periodical structures is also provided.
Patent TW-I236644-B (TW)
Title: Arc tube array type display and its driving method
Inventor: ISHIMOTO MANABU
IPC: H01J11/18
Filed: 2004-04-09
Granted: 2005-07-21
Abstract: A plurality of arc tubes is arranged in parallel with the long side of a rectangular screen. A plurality of the first electrodes and the second electrodes are arranged on the display surface side of the arc tube array in the direction intersecting the longitudinal direction of the arc tubes. A plurality of the third electrodes is arranged on the backside of the arc tube array along the longitudinal direction of the arc tubes. When the screen displays, the third electrodes are used as scan electrodes and the scan voltages are applied sequentially to the plurality of the third electrodes. Meanwhile, a voltage is applied to the desired first electrode or second electrode so that the discharge takes place in a desired light-emitting cell and a light-emitting cell is selected. Thereafter, a display discharge takes place between the adjacent first electrode and second electrode for display.
Patent TW-I291500-B (TW)
Title: Method of electrochemically fabricating multilayer structures having improved interlayer adhesion
Inventor: ZHANG GANG
IPC: C25D5/14
Filed: 2004-05-07
Granted: 2007-12-21
Abstract: Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.
Patent TW-I277051-B (TW)
Title: Liquid crystal display device
Inventor: YOSHIHARA TOSHIAKI
IPC: G09G3/36
Filed: 2004-05-31
Granted: 2007-03-21
Abstract: A voltage according to desired image data is applied to a ferroelectric liquid crystal having spontaneous polarization at a predetermined cycle to rewrite a display image (period A). After this, all the voltages applied to the ferroelectric liquid crystal are removed (period C) and the display image before the removal is maintained (period B). The gate selection period (time of voltage application to the ferroelectric liquid crystal) t2 immediately before termination voltage application is made longer than the gate selection period (time of voltage application to the ferroelectric liquid crystal) t1 in the normal display. By increasing the time of voltage application to the ferroelectric liquid crystal, the liquid crystal sufficiently responds and realizes high memory ability in the gate selection period.
Patent TW-I239900-B (TW)
Title: Capping device, capping method, and liquid drop ejector
Inventor: SUGIMURA SHIGEO
IPC: B41J2/18
Filed: 2004-06-10
Granted: 2005-09-21
Abstract: To provide a capping device through which an operation for filling an ink jet head with a liquid material and an operation for recovering an ink jet head from incomplete ejection state can be carried out without ejecting the liquid material uselessly by ink jet system, and to provide a capping method and a liquid drop ejector. In the capping device 22 where an ejection head having a cavity for storing a liquid material, a nozzle communicating with the cavity and a means for ejecting the liquid material stored in the cavity from the nozzle is coated with a coating mean, which comprises a first coating means 31 having a member 31b exhibiting high gas permeability, and a second coating means 32 having a means 32b for keeping a moist condition in the vicinity of the nozzle.
Patent TW-I364574-B (TW)
Title: Driver chip and display apparatus including the same
Inventor: HWANG SEONG-YONG
IPC: G02F1/1345
Filed: 2004-06-18
Granted: 2012-05-21
Abstract: A driver chip includes a base body having a driver circuit formed therein. A plurality of conductive bumps is disposed over a top face of the base body, the plurality of conductive bumps being arranged in a plurality of rows along the longitudinal direction of the base body. A plurality of conductive wirings is formed over the top face of the base body that electrically connects the driver circuit to the plurality of conductive bumps.
Patent TW-I238470-B (TW)
Title: Film coating unit and film coating method
Inventor: MIZUNO TSUYOSHI
IPC: H01L21/00
Filed: 2004-06-21
Granted: 2005-08-21
Abstract: Film coating unit has a substrate holder for holding a wafer, a coating solution discharge nozzle, and anti-drying boards opposed to a surface of the wafer. The coating solution is applied to the surface of the wafer while relatively moving the substrate holder with respect to the coating solution discharge nozzle in a direction from a front end toward a rear end of the wafer. During that time, the anti-drying boards are disposed at height of maximum 2 mm from the surface of the wafer so as to form dense atmosphere of a solvent between the surface of the wafer and the anti-drying board.
Patent TW-I238568-B (TW)
Title: Electrical power connector for flexible circuit borard
Inventor: CHEN WEN-HSIN
IPC: H01R12/24
Filed: 2004-09-10
Granted: 2005-08-21
Abstract: Electrical power connector for flexible circuit board (2) comprises the housing, mobile cover, positioning tab and a plurality of terminals. The end of the spring arm of the terminal places a protrudent apex portion and the end of the positioning arm places an indented supporting portion. The supporting axis and pivotal axis are used with the same axle center. The pressure protrusion and the supporting portion will form a slope and drive the apex portion of the terminals to fasten more tightly when the mobile cover is closed. When pushed down, the pressure protrusion will still remain the fasten effect without exceeding the line between supporting axis and apex portion.
Patent TW-I255023-B (TW)
Title: Cavity down stacked multi-chip package
Inventor: HO KWUN-YAO
IPC: H01L23/31
Filed: 2004-10-05
Granted: 2006-05-11
Abstract: A cavity down stacked multi-chip package comprising a plurality of stacked package is provided. The highest package comprises a circuit board with a central opening, a heat spreader, and a chip. The heat spreader is placed on the circuit board and covers the opening. The chip, which is placed in the opening, is attached to a lower surface of the heat spreader. In addition, the chip is connected to a lower surface of the circuit board through a conductive line.
Patent TW-I251666-B (TW)
Title: Method for measuring average velocity pressure
Inventor: HUANG JIAN-PING
IPC: G01L7/00
Filed: 2004-12-06
Granted: 2006-03-21
Abstract: A method for measuring average velocity pressure of a chimney. The method comprises the following steps. First, a total pressure measurement device is provided. Then, the total pressure measurement device is disposed at a first measurement location to achieve a total pressure. Meanwhile, physical parameters including distance, diameter and shape of the chimney between the first measurement location and an exhaust end of the chimney are measured. Then, a function of a static pressure drop and the average velocity pressure between the first measurement location and the exhaust end of the chimney are achieved from the physical parameters and experience data of hydrodynamics. Finally, the average velocity pressure is achieved from the function and the total pressure.