baber/WOPTO huggingface dataset:
Patent JP-2000268760-A (JP)
Title: Focusing device for scanning electron microscope
Inventor: HASHIMOTO NAOKI
IPC: H01J37/21
Filed: 1999-03-18
Abstract: PROBLEM TO BE SOLVED: To simplify focusing during high-powered observation by adjusting the focus of an image on the center of a observing monitor for obtaining an image of a normal-focus. SOLUTION: This scanning electron microscope 1 is constituted so that X, Y deflected signal generated by a deflection circuit 2 mounted in the scanning electron microscope 1 and a focus control signal generated by a focus control circuit 3 are input to a focus correcting circuit 4, and focus control correction associated with an image scanning speed and magnifying power is performed and the result is output when an auxiliary function for the focus is on for controlling the focus coil 5 so that parts except the vicinity of the center are set in insufficient focus if normal-focus is obtained.
Patent JP-S6182097-A (JP)
Inventor: MAENO SHOHACHIRO
IPC: F16L59/00
Filed: 1985-04-05
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S63238722-A (JP)
Title: Clock regenerating circuit
Inventor: KAWAHARA NOBUHIRO
IPC: H03L7/107
Filed: 1987-03-26
Abstract: PURPOSE:To shorten a pull-in time and to stabilize the frequency of a pulled-in regenerative clock by using a difference value of frequency information as it is or after amplifying it in accordance with the amplitude of the difference value. CONSTITUTION:A difference device 1 finds out a difference between frequency obtained from the transmitting side and that formed on the receiving side in accordance with a regenerative clock and generates difference value information. When the amplitude of the difference value information is included within a prescribed range, the information is applied to an integrated circuit as it is, and when the value is not included in the range, the information is adjusted at its gain by a gain adjusting circuit 3 and then applied to the integrated circuit 4. An integrated value obtained from the circuit 4 is applied to an oscillator 6 through a D/A converter 5 to generate a regenerative clock. A counting circuit 7 counts the regenerative clock to form the frequency information of the regenerative clock.
Patent JP-S55165562-A (JP)
Title: Metallic vapor discharge lamp
Inventor: DANNO YUUJI
IPC: H01J61/56
Filed: 1979-06-11
Abstract: PURPOSE:To decrease a number of part items of a lamp and simplify a construction and assembly work in its outer tube, by permitting a bimetal tip of a bimetal switch, that generates a high voltage pulse, to isolate a proximity conductor from a luminous tube. CONSTITUTION:A bimetal tip 18 is placed at the reset position because a lamp is in a cold state when it is started. When a power source 31 is turned on, a filament 21 is conducted to flow an electric current. A high potential gradient is generated between a proximity conductor 16 and electrode 15b to provide a condition susceptible of causing a discharge in a luminous tube 12. If promoted a heat generation of the filament 21, the bimetal tip 18 is curved to apply a high voltage pulse to between electrodes 15a, 15b and start an electric discharge. After the discharge is started, when transferred to a state of stable lighting of the lamp, the bimetal tip 18 is further curved to cause one end of the proximity conductor 16 to be displaced integrally with the bimetal tip 18 and the proximity conductor 16 to be isolated in such a manner as to be away from the luminous tube 12.
Patent JP-H04308035-A (JP)
Title: Production of steel plate for structural use excellent in toughness at low temperature
Inventor: NOMIYAMA YUJI
IPC: C22C38/00
Filed: 1991-04-06
Abstract: PURPOSE:To economically produce a steel plate for structural use having excellent toughness at low temp. in weld heat-affected zone (HAZ) as well as in base material with superior productivity. CONSTITUTION:In the course of rolling a cast slab of structural steel heated to 1200 deg.C after solidification in the temp. region to the Ar3 point, cooling is done so that the required cooling rate V according to plate thickness (t) satisfies the relation in V>(18/t)<0.5>. By this method, the production of the steel plate having superior toughness in base material and toughness in HAZ is made possible without using the means so far inevitably used in the course of rolling, such as temp. waiting, low temp. heating and rolling, and reheating and rolling, and further, the productivity of the steel plates of this kind can be increased and manufacturing costs can be remarkably reduced.
Patent JP-H06290719-A (JP)
Title: Color image pick-up tube device
Inventor: SATO AKIRA
IPC: H01J29/76
Filed: 1993-03-31
Abstract: PURPOSE:To effectively correct misconvergence with ease by controlling a current by variable resistance, and disposing a pair of sub coils in series in a vertical deflection coil. CONSTITUTION:A vertical deflection coil is connected to a pair of sub coils L1, L2 wound in series, where the same magnetic poles are opposite to each other. Currents flowing in the coils L1, L2 are controlled by a variable resistance R4. The coils L1, L2 are arranged within a deflection region on the axis of a color image pick-up tube and the vertical axis in such a manner that magnetic fluxes generated in the coils L1, L2 cross a vertical deflection magnetic field. With this arrangement, the variable magnetic fluxes generated in the coils L1, L2 are coupled to the vertical deflection magnetic field so that misconvergence generated in the same direction above and under a screen can be effectively corrected with ease.
Patent JP-H10308479-A (JP)
Title: Resin-sealed semiconductor device
Inventor: KANESAKA KENJI
IPC: H01L23/28
Filed: 1998-03-06
Abstract: PROBLEM TO BE SOLVED: To prevent a resin-sealed part from contacting a tie bar cutting punch when a tie bar connecting leads is cut even if the tie bar is arranged near the resin-sealed part. SOLUTION: A difference L1 in width between an upper mold 6 for forming a molded part 18 covering the plane of a semiconductor chip 1 on which a circuit is formed and a lower mold 7 covering the opposite plane is set larger than a difference in the deviation of position between the upper mold 6 and the lower mold 7 when the semiconductor chip 1 is molded. This prevents the upper mold 6 from oozing out to an outer lead 5 from the lower mold 7 after the semiconductor chip 1 is molded and hence a distance between a tie bar 8 and the molded part 18 can be always kept more than a predetermined distance L2.
Patent JP-H06288491-A (JP)
Title: Automatic flow regulating valve
Inventor: ITO YASUO
IPC: F16K31/126
Filed: 1993-03-31
Abstract: PURPOSE:To maintain a fluid (coating material) to constant flow regardless of temperature change. CONSTITUTION:An automatic flow regulating valve is provided with an air cutoff diaphragm 41 for isolating an intermediate chamber 21 from an air chamber 31 so that laminated bimetal 29 is not influenced by operating air temperature, and a connecting member (a valve body 25) for connecting the air cutoff diaphragm 41 to a diaphragm 15 so as to be deformed simultaneously.
Patent JP-S59199705-A (JP)
Title: Preparation of phenol residue-containing high polymer having narrow molecular-weight distribution
Inventor: FUJIMOTO TERUO
IPC: C08F8/12
Filed: 1983-04-28
Abstract: PURPOSE:To obtain the titled high polymer useful as a resist material for preparing VLSI, having narrow molecular-weight distribution, by polymerizing a monomer whose hydroxyl group of a phenol residue is protected with a saturated aliphatic protecting group having a large volume, eliminating the protecting group. CONSTITUTION:(A) A monomer (e.g., p-tert-butoxystyrene, etc.) shown by the formula (R1 is H, 1-12C alkyl; R2 and R3 are 1-12C alkyl; R<4> is H, or methyl) having a hydroxyl group of a phenol residue protected with a saturated aliphatic protecting group is polymerized using (B) a living anionic polymerization initiator consisting of an organometallic compound (e.g., n-butyl lithium, etc.), and the saturated aliphatic protecting group is eliminated, to give the desired high polymer. The elimination of the protecting group is preferably carried out by dropping hydrochloric acid, etc. to the polymer in a solvent such as dioxane, etc. under heating, so that the ether bond of the protecting group is cleaved.
Patent JP-S55164643-A (JP)
Title: Purification of coenzyme q
Inventor: RIYOUNO HIROKAZU
IPC: C07C46/10
Filed: 1979-06-12
Abstract: PURPOSE: To obtain a high purity coenzyme Q, which takes an important role in the biological electron transport system and has an excellent pharmaceutical activity for various diseases, at room temp., easily, in the yield, by recrystallizing a low purity coenzyme Q using isopropanol as a solvent.  
     CONSTITUTION: A coenzyme Q having 40W98% purity is recrystallized in isopropanol by conventional method to give the high purity coenzyme. For example, the starting material is dissolved in isopropanol by heating at 35W60°C to give a homogeneous solution, which is then cooled to ca. 0W35°C. The recrystallization solvent may be a mixture of isopropanol and an organic solvent soluble in isopropanol, e.g. hexane, ethyl ether, acetone, etc. In this case the amount of isopropanol is preferably 50W99% (V/V). Esp. a mixture of isopropanol and 5W30% of ethyl acetate is preferable for removing a trace of impurities. 
     COPYRIGHT: (C)1980,JPO&Japio
Patent JP-S58191405-A (JP)
Inventor: FUJII SHIYOUSAKU
IPC: H01C1/12
Filed: 1982-05-01
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-2000269037-A (JP)
Title: Thin type coil and manufacture thereof
Inventor: ONO TOMEJI
IPC: H01F41/04
Filed: 1999-03-18
Abstract: PROBLEM TO BE SOLVED: To provide a thin type coil and a method of manufacturing the same, wherein a thinner multilayer coil than a thin type coil using a printed wiring board can be obtained, and wherein thin type coils can be manufactured at a low cost and a high yield due to the absence of warpages, cracks and chips which are present in a thin type coil using a ceramic board. SOLUTION: A ceramic powder is blended with an organic binder or a binder, such as water glass and formed into sheet-shaped composite sheets 1 using a film-forming machine, a printing machine, or the like. Using conductors, planar coils 2a, 2b and 2c are formed on the surfaces of the sheets 1. A plurality of coil boards 10a, 10b and 10c made of these sheets 1 are superposed upon another. During the superposing operation, the coils 2a, 2b and 2c are connected to one another through through-holes 3a, 3a', 3b and 3b' and 3b", and 3c and 3c", thereby preparing a multilayer coil. The multilayer coil is made rigid by thermal compression using a hot press or the like after lamination.  Through such a manufacturing method and structure design, a thin type multilayer coil 10 can be obtained without sintering, and hence IC cards and antennas for portable terminals can be provided in small and thin sizes as well as at low cost.
Patent JP-S553611-A (JP)
Title: Resin flash eliminating method
Inventor: SUZUKI AKIRA
IPC: H01L23/50
Filed: 1978-06-21
Abstract: PURPOSE:Resin flashes which may be produced when a resin mouldng is carried out by inserting electronic parts into a metal mould can be easily removed by taking off a covering provided in advance on the portion wherein resin flashes may be produced after moudling, together with the resin deposited thereon during moulding. CONSTITUTION:Resin moulding is conducted by mounting a metallic header 12 on a resin package 10 having projection leads 16 and inserting it into a metal mould. At this juncture, the surface of the header 12 is exposed to the outside of the package 10, and the surface of the header 12 is adhered closely to the inside of cavity within the metal mould. However, an undesired gap is formed therebetween due to errors in dimension or transformation, and a resin will enter this cap to produce the resin flash 18 to be removed afterwards. Consequently, the flash 18 can be removed together with a covering after moulding, if there is provided such a covering as indicated by 14, made of photosensitive resist or photosensitive polyimide resin, in advance on the surface of the header 12 on which the flash 18 may be deposited.
Patent JP-S55165986-A (JP)
Title: Measurement of coal temperature during dry distillation in coking furnace
Inventor: KATOU HIDEO
IPC: C10B45/00
Filed: 1979-06-13
Abstract: PURPOSE: To easily measure a temp. of a coal layer in a height direction of a furnace during dry distillation, by a method wherein a hollow protecting pipe is inserted into a coal layer after leveling work is completed while a pressurized gas is  injected from a leading end thereof and a temp. measuring element is inserted into  said protecting pipe to measure the temp.  
     CONSTITUTION: A hollow protecting pipe 8 wherein an injecting hole 9 of a pressurized gas is equipped to a leading end thereof and an inflow port 10 of the pressurized gas to a trailing end thereof as well as the total length thereof is longer than the length between an air space above the introduced coal, and a furnace bottom of a carbonization chamber 5 is prepared. After the coal is charged into the carbonization chamber 5 and leveling work is completed, a pressurized gas such as compressed air of 5W10kg/cm 2  is supplied from an inflow port 1 of the protecting pipe 8 and said protecting pipe 8 is pierced in the coal while pressurized air is injected from an injecting hole 9 and, thereafter, inserted into the coal by drilling force of said pressurized gas injected from the injecting hole 9 and, subsequently, a temp. measuring element 7 is inserted into the protecting pipe 8 from the inflow port 10 and an introducing lid 11 is closed to measure the temp. 
     COPYRIGHT: (C)1980,JPO&Japio
Patent JP-S55165664-A (JP)
Title: Ceramic substrate for packaging semiconductor device
Inventor: MIYAWAKI KIYOSHIGE
IPC: H01L23/12
Filed: 1979-06-12
Abstract: PURPOSE:To save the quantity of used gold by a method wherein when the wire bonding part of the conduction pattern and the diamond touch part, which are fitted in the concave of the ceramic substrate, are plated with gold, the thickness of gold film is thinned on the touch part. CONSTITUTION:The concave is formed in the central part of the ceramic substrate 1 that is to be a package, and the ceramic substrate 1c that has the diamond touch part 2 for securing the semiconductor chip, ceramic substrate 1b that has the conduction pattern 3' and ceramic substrate 1a wherein a window is opened are laminated from the lower side in turn and fitted in the concave. In this way, current is fed to the wire bonding part 3 of the conduction pattern 3' and touch part 2 by means of the lead frame 4 of the substrate 1 in order to form the gold plated layer. At this time, the touch part 2 is connected to the opposite pattern R to control the current that flows in the touch part 2, and only the gold film for securing the semiconductor chip is made thinner.
Patent JP-S59200391-A (JP)
Inventor: NISHI KENICHI
IPC: G09F9/00
Filed: 1983-04-27
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-2000263200-A (JP)
Title: Immersion nozzle for continuous casting
Inventor: NOMURA OSAMU
IPC: B22D41/54
Filed: 1999-03-18
Abstract: PROBLEM TO BE SOLVED: To provide an immersion nozzle for continuous casting which is suitable for casting a steel such as high oxygen-containing steel, high Mn-containing steel, Ca treating steel or stainless steel, excellent is thermal impact resistance high in erosion resistance and capable of improving the producing condition to reduce its producing cost. SOLUTION: The immersion nozzle for continuous casting is composed of a main body material portion 11 consisting of an AG quality refractory material, an inner hole portion 12 consisting of a graphite-less refractory material containing >=90 wt.% spinel and <=10% the other component, a charging hole surrounding portion 13 consisting of a graphite-containing refractory material containing 5-35 wt.% graphite, >=65 wt.% spinel (MgO-Al2O3 base) and <=10 wt.% the other component, and a powder-line part 14 consisting of ZrO2-C base refractory material.
Patent JP-S56897-A (JP)
Title: Grease for slow-operating device
Inventor: MATSUURA MAKOTO
IPC: C10N50/10
Filed: 1979-06-15
Abstract: PURPOSE:To provide title grease having sufficient slow-operating effect without the destruction of micellar structure, by a method wherein sodium n-octadecylterephthalamate and ultrafine SiO2 are blended with a base oil consisting of polybutene and organopolysiloxane. CONSTITUTION:1-15wt% of sodium n-octadecylterephthalamate is added to a base oil obtd. by mixing 10-40pts.wt. of polybutene with 90-60pts.wt. of organopolysiloxane. The mixt. is heated with stirring to dissolved sodium n-octadecylterephthalamate. NaOH is added to the mixt. The resulting mixt. is heated. Then the reaction mixt. is cooled. 1-15wt% of ultrafine SiO2 is added to the cooled mixt. The resulting mixt. is subjected to a milling treatment to obtain the desired grease. This grease has a high torque value. The difference between initial torque and running torque is small. This grease is useful for use in the cassette holder means of a cassette tape recorder, since critical shearing stress is shifted to high speed side.
Patent JP-H05280498-A (JP)
Title: Cross flow fan
IPC: F04D29/02
Filed: 1992-03-31
Abstract: PURPOSE:To reduce the generation of noise by forming at least a synthetic resin plate part from a synthetic resin foamed body, to reduce the weight of a cross flow fan itself, and reduce the creep deformation for the lengthwise direction due to the dead weight. CONSTITUTION:Fan assembly bodies 4a-4a consisting of a syntyhetic resin plate part 2 and a pluralty of fan blades 3 which are arranged in a prescribed intervals along the outer peripheral edge of the plate part 2 are assembled in plural quantity. As for a cross flow fan 1, at least the synthetic resin plate part 2 is formed from a synthetic resin foamed body. Further, in the foaming operation of the plate part 2, the porosity inside the plate part 2 is increased, and the porosity in the surface part is reduced. Accordingly, weight can be reduced without deteriorating the reduction of the rigidity in the lengthwise direction, and the noise due to the dynamic imbalance which is generated by the creep deformation can be reduced.
Patent JP-S571493-A (JP)
Title: Filth disposer
Inventor: TAKESHITA SADAO
IPC: B09B3/00
Filed: 1980-06-05
Abstract: PURPOSE: To provide an apparatus having a simplified structure for facilitating the disposal of filth and the  effective use of generated gases, by constructing the apparatus with upper and lower chamber communicated  together through a penetrating opening, an inlet for charging filth into the lower chamber, a pipe for taking out  generated gases from the lower chamber, an opening for discharging a generated liquid from the lower chamber  and means for controlling a liquid amount in the lower chamber on the basis of the gas amount.  
     CONSTITUTION: Upper and lower portions 2 and 3 are intercepted with a slab 1 except communication through  a penetrating opening 4. Filth to be disposed in charged through a charge opening into a chamber 3, where the  filth is decomposed by anaerobic bacteria such as methane bacteria or the like to generates residues and a liquid. The liquid is drained through the opening 4 and a discharge opening 7. Combustible gases containing a  large quantity of methane generated by the decomposition are taken out through a gas pipe 9 provided with a  valve 8 and offered for a variety of use. Amounts of gas generation and consumption are changed widely by  various factors. The generated gases are reserved in the upper portion of the chamber 3. When the amount of  the reserved gas increase, the liquid in the chamber 3 is pushed through the opening 4 into the chamber 2 by its  gas pressure. Consequently, when the amount of gas consumption decreases, a large quantity of gases are reserved. On the other hand, when the amount of gas consumption increases, an amount of the liquid corresponding to the pressure drop is returned from the chamber 2 to the chamber 3.  
     COPYRIGHT: (C)1982,JPO&Japio
Patent JP-H05283417-A (JP)
Title: Treating method of inter-lattice oxygen deposition in semiconductor silicon wafers
IPC: H01L21/322
Filed: 1992-03-31
Abstract: PURPOSE:To stabilize leak fraction defective by putting semiconductor wafers mounted on a high purity quartz boat in a thermal diffusion furnace whose furnace body temperature is 450+ or -10 deg.C, and taking them out from the thermal diffusion furnace. CONSTITUTION:Semiconductor silicon wafers 1 mounted on a high purity quartz boat 2 are put in a thermal diffusion furnace 3 whose furnace body temperature is 450+ or -10 deg.C, at a boat speed of 50 cm/min. The inside of the thermal diffusion furnace has been substituted by nitrogen gas. The furnace body temperature of the thermal diffusion furnace.3 is raised up to 650 deg.C at the rate of 0.5 deg.C/min by increasing the output of a heater 4. After the furnace body temperature of the thermal diffusion furnace 3 is kept at 650 deg.C, treatment is performed for a specified period while a specified amount of nitrogen gas is made to flow. After that, the furnace body temperature of the thermal diffusion furnace 3 is reduced down to 450+ or -10 deg.C at the rate of 0.5 deg.C/min by decreasing the output of the heater 4, and the semiconductor silicon wafers are taken out at a boat speed of 50cm/min. Thereby a stable yield can be obtained.
Patent JP-S58193118-A (JP)
Title: Resin mold for fiber reinforced plastic molding
Inventor: MINO SHIYUNSAKU
IPC: B29C57/00
Filed: 1982-05-07
Abstract: PURPOSE:To obtain an FRP product having an improved gel coat effect and an excellent outer appearance in good moldability by coating the surface layer in a mold with hardened film of a mixture of radical hardened resin and special (meta)acrylester. CONSTITUTION:The surface layer with which molding material for a resin mold for FRP molding comes in contact is coated with the hardened film of a mixture composed of radical hardening resin and acrylic ester or metacrylic ester of alcohol having a fluoridated alkyl and/or alkylene group or groups. Unsaturated polyester resin, unsaturated vinylester resin, unsaturated acrylate resin are preferred as the radical hardened resin.
Patent JP-S57190338-A (JP)
Title: Water-cooled thyristor valve
Inventor: NISHIKAWA HISAO
IPC: H01L29/74
Filed: 1981-05-19
Abstract: PURPOSE:To improve electric insulation property by a method wherein insulation pipes for cooling water are provided between the earth and a live part and each module and the lengths of the return pipes are made longer than those of the supply pipes. CONSTITUTION:The lengths of return pipes 6' and 7' are made longer than those of supply pipes 6 and 7 which supply cooling water from the earth to a live part and each module. According to this composition, flow resistance inside the pipes 6' and 7' increases with the lengths of the pipes. On the other hand, amount of adhesion of copper ions or compound is determined by leakage current, area of copper portion which has contact with cooling water, capability of a filter 12 and ion exchange resin 11 and so forth. If the lengths of the pipes 6' and 7' are approximately double the lengths of the pipes 6 and 7, the electric insulation property of a water-cooled thyristor valve is improved and high reliability is obtained.