baber/WOPTO huggingface dataset:
Patent TW-I724684-B (TW)
Title: Method, system and device for performing cryptographic operations subject to identity verification
Inventor: Feng zhi-yuan
IPC: G06K19/077
Filed: 2019-12-12
Granted: 2021-04-11
Abstract: Disclosed herein are methods, systems, and apparatus, including computer programs encoded on computer storage media, for performing cryptographic operations subject to identity verification. One of the methods includes receiving, by a cryptography chip, a request to perform a requested cryptographic operation from a client including client identity information, wherein the cryptography chip includes a processing resource that performs cryptographic operations and a storage resource that stores key information used in the cryptographic operations, and identity information associated with clients that are permitted to request cryptographic operations; determining, by the cryptography chip, that the client identity information is associated with one of the clients that are permitted to request cryptographic operations; and performing, by the cryptography chip, the requested cryptographic operation based on the key information stored in the storage resource.
Patent TW-I743667-B (TW)
Title: Heat dissipation structure of a motor coil
Inventor: CHEN SHAN-NAN
IPC: H02K9/22
Filed: 2020-02-03
Granted: 2021-10-21
Abstract: Present invention discloses a heat dissipation structure for a motor coil, including a motor having a rotor and a stator, the stator disposed on the periphery of the rotor, the stator has at least one core group, and the core group has a plurality of winding portions, two sides of the winding portions having a winding groove respectively; a plurality of coils provided on each of the winding portion; and a plurality of the thermally conductive adhesives are coated on the outer sides of the plurality of coils, and filled in gaps between the plurality of coils and the plurality of winding grooves.
Patent TW-I730628-B (TW)
Title: 高爐操作方法
Inventor: SAKAI HIROSHI
IPC: C21B5/00
Filed: 2020-02-15
Granted: 2021-06-11
Abstract: 本發明一觀點下之高爐操作方法，具有以下步驟：事先對每個還原氣體中之碳原子與氫原子之莫耳比C/H，求算該還原氣體中之碳基本單位與將該還原氣體吹入高爐所致之碳消費基本單位削減量InputΔC的相關關係；根據對每個C/H求得之相關關係，來決定還原氣體中之碳基本單位，且該還原氣體中之碳基本單位達到事先訂定之碳消費基本單位削減量InputΔC之目標值以上；及根據所決定之該還原氣體中之碳基本單位與還原氣體中之碳比率，來調整吹入高爐內之還原氣體的吹入量。
Patent TW-I740399-B (TW)
Title: 資料處理方法、裝置和電子設備
Inventor: LI LI-CHUN
IPC: H04L9/28
Filed: 2020-03-02
Granted: 2021-09-21
Abstract: 本說明書實施例提供一種資料處理方法、裝置和電子設備。所述方法包括：對標識資料進行加密，將加密結果作為第一密文集合中的第一標識資料密文；向第二資料方發送第一密文集合；接收第二資料方發來的第二密文集合，所述第二密文集合包括第二標識資料密文；對第二標識資料密文進行解密，將解密結果作為第三密文集合中的第三標識資料密文；接收第二資料方發來的第四密文集合，所述第四密文集合包括第三標識資料密文和業務資料密文；獲取所述第三密文集合和所述第四密文集合間共有的第三標識資料密文；計算共有的第三標識資料密文所對應的業務資料密文的同態相加結果；向第二資料方發送同態相加結果。
Patent TW-I725786-B (TW)
Title: Slave device, master device and data transfer method
Inventor: SUN CHI-YUNG
IPC: G08C19/28
Filed: 2020-03-20
Granted: 2021-04-21
Abstract: A slaver device coupled to a master device via a bus and including a serial interface, a code generation circuit and a control circuit is provided. The serial interface is configured to couple to the bus. The code generation circuit is configured to generate a unique code. The control circuit is coupled between the serial interface and the code generation circuit. In a setting mode, the control circuit triggers the code generation circuit to generate the unique code. In an operation mode, the control circuit determines whether to execute the command provided by the master device according to the unique code.
Patent TW-I732518-B (TW)
Title: Modular instruction control system and method thereof
Inventor: TSAI PO-YI
IPC: G06K9/62
Filed: 2020-04-09
Granted: 2021-07-01
Abstract: A modular instruction control system and a method thereof are provided. The modular instruction control system includes an instruction database, an instruction receiving module, a keyword recognition module, and an instruction generating module. The instruction database includes a device instruction library and a matching instruction library. The device instruction library stores a plurality of device instructions, each the device instruction matches a plurality of matching instructions, and the plurality of matching instructions is stored in the matching instruction library. The instruction receiving module receives an instruction message. The keyword 
recognition module is connected to the instruction receiving module and receives the instruction message, and recognizes the instruction message to generate instruction information, and then recognizes the instruction information to generate a plurality of instruction keywords. The instruction generating module is connected to the keyword recognition module and the instruction database and receives the plurality of instruction keywords, and compares the device instruction that matches one of the instruction keywords. Then, the matching instruction that matches at least one instruction keyword is compared among the plurality of matching instructions that matching the device instruction. The instruction generating module generates a control signal according to the device instruction and at least one matching instruction that match a plurality of command keywords.
Patent TW-I739413-B (TW)
Title: Semiconductor device and manufacture method thereof
Inventor: WENG CHENG MING
IPC: H01L21/60
Filed: 2020-05-04
Granted: 2021-09-11
Abstract: A semiconductor device includes a carrier wafer, a stacked wafer, a plurality of through silicon vias(TSVs), a plurality of third conductive bumps, and a plurality of conductive terminals. The carrier wafer has a carrier surface and a plurality of first conductive bumps on the carrier surface. The stacked wafer has a first surface, a second surface opposite to the first surface, and a plurality of second conductive bumps on the first surface. The stacked wafer is located on the carrier wafer. The first surface faces the carrier surface. The second conductive bumps directly contact the first conductive bumps and are electrically connected to the first conductive bumps. The TSVs are located in the stacked wafer. The third conductive bumps are located on the second surface. Partial of the third conductive bumps are electrically connected to the second conductive bumps through TSVs. The conductive terminals are located on the third conductive bumps. A manufacturing method of a semiconductor device is also provided.
Patent TW-I725852-B (TW)
Title: 外衣
Inventor: MATSUMOTO DAISUKE
IPC: A41D1/02
Filed: 2020-05-18
Granted: 2021-04-21
Abstract: 本發明之目的在於提供一種具備較高之防寒功能且輕便、可謀求穿衣者之輪廓纖細化之外衣。
本發明之外衣(1)之特徵在於具備前身(10)、後身(11)、袖部(12)及脅部(13)，且前身(10)、後身(11)、袖部(12)及脅部(13)之各部分具備內包有防寒材料之防寒區域(R1、R2、R4、R5)，前身(10)之上部具備內包有羽絨之羽絨區域(R1)，後身(11)之上部具備內包有羽絨之羽絨區域(R2)，袖部(12)之整體具備內包有棉材料之棉區域(R4)，且脅部(13)之下部具備內包有棉材料之棉區域(R5)。
Patent TW-I754972-B (TW)
Title: Image verification method and real-time product verification system
Inventor: SHAE ZON-YIN
IPC: G06Q30/06
Filed: 2020-06-23
Granted: 2022-02-11
Abstract: The invention discloses an image verification method and a real-time product verification system, where the image verification method is used in a deep learning model for plural of species of one product. The image verification method comprises a training phase and a testing phase. The steps in the training phase may comprise: inputting a training image; separating the training image into plural of training sub-images; training the deep learning model by the training sub-images, where each training image contains a unique physical property. The steps in the testing phase may comprise: inputting a testing image and separating the testing image into plural of testing sub-images; executing a testing for checking if the testing sub-images are associated with one of the plural species of the product; and outputting a verification 
result to identify if the testing image is belonging to one of the plural species of the product.
Patent TW-I736341-B (TW)
Inventor: HATAKEYAMA JUN
IPC: G03F7/039
Filed: 2020-06-30
Granted: 2021-08-11
Abstract: A positive resist composition comprising a base polymer comprising recurring units (a) having the structure of an ammonium salt of fluorosulfonic acid having an iodized or brominated aromatic ring, and recurring units (b1) having an acid labile group-substituted carboxyl group and/or recurring units (b2) having an acid labile group-substituted phenolic hydroxyl group exhibits a high sensitivity, high resolution, low edge roughness and dimensional uniformity, and forms a pattern of good profile after exposure and development.
Patent TW-I727853-B (TW)
Title: Chip-transferring system and chip-transferring method
Inventor: LIAO CHIEN-SHOU
IPC: H01L21/67
Filed: 2020-07-15
Granted: 2021-05-11
Abstract: A chip-transferring system and a chip-transferring method are provided. The chip-transferring system includes a substrate-carrying module, a chip-transferring module and a system-controlling module. The substrate-carrying module carries a chip-carrying structure. The chip-carrying structure includes a circuit substrate for carrying a plurality of conductive materials, a plurality of micro heaters disposed on or inside the circuit substrate and a micro heater controlling chip electrically connected to the micro heaters. A chip is disposed on the two corresponding conductive materials by the chip-transferring module. The chip-transferring module includes a motion-sensing chip. Therefore, when chip movement information provided by the motion-sensing chip of the chip-transferring module the system control module is transmitted to the system control module, the micro heater control chip is controlled by the system control module according to the movement information of the chip, so that the micro heater control chip can control the micro heaters to start or stop to heat the two conductive materials.
Patent TW-I749723-B (TW)
Title: 藥物包裝用複合膜材
Inventor: LIAO TE-CHAO
IPC: A61J1/00
Filed: 2020-08-20
Granted: 2021-12-11
Abstract: 本發明公開一種藥物包裝用複合膜材，其包括一熱封層、一鋁箔層以及一抗衝擊層。熱封層含有1,4-丁二醇、間苯二甲酸、異戊二醇以及異丙醇中的至少一種衍生的殘基，以使熱封層具有130
         o C至180
         o C之間的熔點，鋁箔層設置於熱封層上，且抗衝擊層設置於鋁箔層上。本發明的藥物包裝用複合膜材無毒性，且具有優越的抗衝擊性能和熱封性能。
Patent TW-I756808-B (TW)
Title: 無線通訊網路裝置、無線通訊終端、無線通訊系統以及通訊方法
Inventor: UGA SHINSUKE
IPC: H04W80/10
Filed: 2020-09-01
Granted: 2022-03-01
Abstract: 目的在於提供關於無線通訊終端的終端群可使通訊得當的技術。
無線通訊網路裝置，包括資料庫，保持有關屬於終端群的複數無線通訊終端的通訊之資訊即群通訊資訊。又，無線通訊網路裝置，包括資訊管理部，管理資料庫內保持的群通訊資訊，根據上述群通訊資訊，每無線通訊終端選擇1個以上的MNO網路及對話(session)，根據上述選擇結果，進行無線通訊終端的對話確立或轉換的控制。
Patent TW-I756811-B (TW)
Title: 振動檢測系統
Inventor: KIRKBY MICHAEL
IPC: H01L21/60
Filed: 2020-09-02
Granted: 2022-03-01
Abstract: 本發明的課題為實時檢測觀測對象物的二維面上的振動。振動檢測系統100對表面為非鏡面的超音波焊頭12及焊針13的振動進行檢測，包括：雷射光源20，對超音波焊頭12及焊針13照射平行雷射光21；相機30，包括對平行雷射光21所照射的超音波焊頭12及焊針13的圖像進行拍攝的拍攝元件31；以及圖像處理裝置40，對相機30所拍攝的圖像進行處理而顯示振動產生部位。
Patent TW-I765351-B (TW)
Inventor: YOSHIZUMI KENSUKE
IPC: G09F9/00
Filed: 2016-01-15
Granted: 2022-05-21
Abstract: Provided is a display device or a display system capable of displaying images along a curved surface, a display device or a display system capable of displaying images seamlessly in the form of a ring, or a display device or a display system that is suitable for increasing in size. The display device includes a display panel. The display panel includes a first part and a second part and is flexible. The first part can display images. The second part can transmit visible light. The display panel is curved so that the second part and the first part overlap with each other.
Patent TW-I768478-B (TW)
Title: Electronic device and method and for adaptively arranging external hardware resources
Inventor: CHEN KUAN-JU
IPC: G06F1/16
Filed: 2020-09-25
Granted: 2022-06-21
Abstract: The disclosure provides an electronic device and a method and for adaptively arranging external hardware resources. The electronic device is built with a virtual environment, and a guest operating system is executed in the virtual environment. The method includes: obtaining a usage rate of a specific hardware device in the electronic device in response to receiving a virtual device command from the guest operating system; in response to determining that the usage rate of the specific hardware device is higher than a usage rate threshold, obtaining a foreground process, background process, and operating system services of the electronic device, and determining an external resource demand accordingly; arranging a hardware device of an external device based on the external resource demand, and using the hardware device of the external device and the specific hardware device to collaboratively execute the foreground process, the background process and the operating system service.
Patent TW-I763065-B (TW)
Inventor: CHEN WEI-JEN
IPC: C07K14/435
Filed: 2020-09-30
Granted: 2022-05-01
Abstract: A recombinant fusion protein includes a receptor associated protein 1 (RAP1), a cluster of differentiation 28 (CD28)-Pseudomonas exotoxin A translocation domain (PEt) fusion polypeptide, a legumain protein and a target peptide. The RAP1 is located at the N-terminus of the recombinant fusion protein. The CD28-PEt fusion polypeptide is located at the C-terminus of the RAP1. The legumain protein is located at the C-terminus of the CD28-PEt fusion polypeptide. The target peptide is located at the C-terminus of the legumain protein. In another embodiment of the present disclosure, an immunogenic composition is provided. The immunogenic composition including the recombinant fusion protein and an adjuvant is used for inducing specific immune responses in a subject with cancer, whereby the risk of cancer metastasis and recurrence for the subject may be successfully reduced.
Patent TW-I778446-B (TW)
Inventor: ZHANG CHAOQI
IPC: H01L21/56
Filed: 2020-11-05
Granted: 2022-09-21
Abstract: A package that includes a substrate having a routing region and a non-routing region along a periphery of the substrate. The non-routing region includes a plurality of vias configured as a shield. The package includes an integrated device coupled to the substrate, and an encapsulation layer located over the substrate such that the encapsulation layer encapsulates the integrated device.
Patent TW-I749890-B (TW)
Inventor: FAN YUN-KUANG
IPC: H01F38/02
Filed: 2020-11-20
Granted: 2021-12-11
Abstract: A hybrid inductive device includes a magnetic core and a plurality of coil windings. The magnetic core has a plurality of winding areas. The plurality of coil windings is respectively wound in the plurality of winding areas. A gap is between the coil windings in two adjacent winding areas. A winding direction of the coil winding in each of the plurality of winding areas is different from the winding direction of the coil windings in the adjacent winding areas. The coil winding in each of the plurality of winding areas is symmetrical to the coil windings in the adjacent winding areas.
Patent TW-I770739-B (TW)
Inventor: Ren jian-xun
IPC: F28F11/00
Filed: 2020-12-25
Granted: 2022-07-11
Abstract: 本發明涉及一種列管換熱器，該列管換熱器包括：上管板箱、下管板
箱、多個換熱管以及加壓螺栓，所述多個換熱管的入口端貫穿所述上管板箱，所述多個換熱管的出口端貫穿所述下管板箱，所述上管板箱和下管板箱內填充有密封橡膠，所述密封橡膠填充進所述換熱管與所述上管板箱的間隙內，且所述密封橡膠填充進所述換熱管與所述下管板箱的間隙內，所述加壓螺栓設置於所述上管板箱和下管板箱。另外，本發明還涉及一種列管換熱器的封裝方法。
Patent TW-I764602-B (TW)
Inventor: ZENG SHIH-JIA
IPC: G11C29/42
Filed: 2021-03-03
Granted: 2022-05-11
Abstract: 一種記憶體控制方法、記憶體儲存裝置及記憶體控制電路單元。所述方法包括：使用多個讀取電壓準位來讀取多個第一記憶胞，以獲得第一記憶胞的第一臨界電壓分布；獲得第一臨界電壓分布相較於第一記憶胞的原始臨界電壓分布的偏移資訊；獲得對應於第一臨界電壓分布的第一可靠度資訊；根據第一可靠度資訊的統計特性還原出對應於原始臨界電壓分布的原始可靠度資訊；根據所述偏移資訊調整原始可靠度資訊，以獲得對應於第一臨界電壓分布的第二可靠度資訊；以及根據第二可靠度資訊更新與第一記憶胞有關的可靠度資訊。
Patent TW-I758119-B (TW)
Title: Exposure apparatus
Inventor: KANDA HIROYUKI
IPC: G03F9/00
Filed: 2021-03-05
Granted: 2022-03-11
Abstract: An exposure apparatus includes an exposure part for exposing a pattern on a base material 9, a table 41 having a holding plate 43 to be in contact with one main surface of the base material 9, to hold the base material 9, an optical unit 5 for irradiating the main surface of the base material 9 with light through an opening 432 provided in the holding plate 43 to form on the main surface a reference mark referenced in pattern exposure by the exposure part, and a gas supply part 71 for supplying a predetermined gas between a light-transmitting member 541 arranged closest to the holding plate 43 in the optical unit 5 and the holding plate 43. The gas supplied from the gas supply part 71 flows across the opening 432 at the position between the light-transmitting member 541 and the holding plate 43. It is therefore possible to prevent unwanted substances from adhering to the surface of the light-transmitting member 541.
Patent TW-I752854-B (TW)
Title: 沃斯田鐵系不鏽鋼以及彈簧
Inventor: SEKIMUKAI KOTARO
IPC: C22C38/56
Filed: 2021-03-30
Granted: 2022-01-11
Abstract: 本發明的技術課題是要提供：具有較SUS316L不鏽鋼更高位階的耐腐蝕性，較SUS329J1不鏽鋼更優異的加工性，而且耐疲勞特性良好之價格低廉的沃斯田鐵系不鏽鋼。
        本發明的沃斯田鐵系不鏽鋼，以質量%計，係含有C：0.010～0.200%、Si：2.00%以下、Mn：3.00%以下、P：0.035%以下、S：0.0300%以下、Ni：6.00～14.00%、Cr：20.0～26.0%、Mo：3.00%以下、Cu：0.01～3.00%、Ti：1.000%以下、Al：0.200%以下、Ca：0.1000%以下、N：0.100～0.250%、O：0.0080%以下，其餘部分是Fe以及雜質，以下列數式(1)來表示的E值是-17.0以上，以下列數式(2)來表示的F值是0以上，
        E=-0.33×SFE +0.25×R　　數式(1)
        數式(1)中的SFE是25.7+2Ni+410C-0.9Cr-77N-13Si-1.2Mn(各元素記號是表示各元素的含量(質量%))，R是平均結晶粒徑(μm)，
        F=1003O-211Al-158Ca-79Ti　　數式(2)
        數式(2)中的各元素記號是表示各元素的含量(質量%)。
Patent TW-I750080-B (TW)
Title: 具散熱裝置的晶片模組及其製作方法
Inventor: WANG TIEN-LAI
IPC: G06F1/20
Filed: 2021-04-15
Granted: 2021-12-11
Abstract: 本發明於提供一種具散熱裝置的晶片模組，其包含晶片模組、散熱體及複數個金屬連接件。散熱體設置於晶片模組上。該些金屬連接件設置於晶片模組與散熱體之間，並且利用超音波接合程序，使晶片模組與散熱體相互連接。
Patent TW-I782486-B (TW)
Inventor: CHUANG CHIH YUN
IPC: H04L9/32
Filed: 2021-04-15
Granted: 2022-11-01
Abstract: 一種門檻式簽章方案的門檻值與參與數量的調整系統及其調整方法，透過節點主機執行(t,n)門檻式簽章方案，並且在n減少且t不變、t增加且n不變，或t減少且n不變時，由節點主機在不還原私鑰的條件下，基於安全多方計算重新計算共享單元，以及在n增加且t不變時，由已持有共享單元的節點主機，根據欲加入的節點主機的x座標及層級值計算其相應的共享單元，達到提高(t,n)門檻式簽章方案的可用性之技術功效。
Patent TW-I793578-B (TW)
Inventor: ROMANOVSKY ANATOLY
IPC: G01N21/95
Filed: 2012-07-12
Granted: 2023-02-21
Abstract: Systems configured to inspect a wafer are provided. According to one embodiment, the system includes an illumination subsystem configured to simultaneously form multiple illumination areas on the wafer with substantially no illumination flux between each of the areas. The system also includes a scanning subsystem configured to scan the multiple illumination areas across the wafer. In addition, the system includes a collection subsystem configured to simultaneously and separately image light scattered from each of the areas onto two or more sensors. Characteristics of the two or more sensors are selected such that the scattered light is not imaged into gaps between the two or more sensors. The two or more sensors generate output responsive to the scattered light. The system further includes a computer subsystem configured to detect defects on the wafer using the output of the two or more sensors.
Patent TW-I774335-B (TW)
Inventor: LIN YUNG-HSIANG
IPC: A61P7/00
Filed: 2018-09-26
Granted: 2022-08-11
Abstract: 本發明提供一種苦蕎麥種皮萃取物用於製備促進抗老化基因表現之組合物之用途。該苦蕎麥種皮萃取物較佳為以水為溶劑對苦蕎麥種皮進行萃取而製得，其能促進CCT、PINK1、SIRT1、及FOXO3等多種抗老化基因之表現，因此預防個體機能衰退與維持健康。
Patent TW-I784500-B (TW)
Inventor: CHANG HUI-NENG
IPC: G06F21/57
Filed: 2021-04-28
Granted: 2022-11-21
Abstract: 電子裝置及其安全韌體更新方法，其包含：第一積體電路晶片，其中包含有一安全韌體更新主控台；第一非揮發記憶體晶片，信號連接於該第一積體電路晶片，其用以儲存該第一積體電路晶片的一第一韌體碼並另外包含有一備用資料儲存空間；第二積體電路晶片，信號連接至該第一積體電路晶片；以及第二非揮發記憶體晶片，信號連接於該第二積體電路晶片，其用以儲存該第二積體電路晶片的一第二韌體碼，其中當對應該第二非揮發性記憶體晶片之一筆待更新之韌體碼資料被轉存至該備用資料儲存空間中後，該第一積體電路晶片中之該安全韌體更新主控台對該備用資料儲存空間中之該筆待更新之韌體碼資料來進行一驗證程序，當該驗證程序通過則進行一韌體更新程序，而將該筆待更新之韌體碼資料寫入該第二非揮發性記憶體晶片而取代該第二韌體碼。
Patent TW-I768880-B (TW)
Inventor: HUNG KUO-TENG
IPC: H04L25/493
Filed: 2021-05-07
Granted: 2022-06-21
Abstract: 本發明提供一種同步脈衝通訊方法，脈衝訊號編碼步驟係驅動一次側模組將第一電路參數與第二電路參數透過資訊編碼程序編碼成脈衝訊號，使脈衝訊號攜帶第一編碼資訊與第二編碼資訊。第一編碼資訊與第二編碼資訊分別對應第一電路參數與第二電路參數。脈衝訊號傳輸步驟係驅動一次側模組將脈衝訊號傳送至二次側模組。脈衝訊號解碼步驟係驅動二次側模組將脈衝訊號透過資訊解碼程序解碼出第一電路參數與第二電路參數。第一編碼資訊包含時間間隔，第二編碼資訊包含傳輸次數。藉此，可大幅降低隔離通訊時的能量消耗，並增加通訊傳輸量。
Patent TW-I752881-B (TW)
Title: Semiconductor package
Inventor: WANG CHIN-HUA
IPC: H01L21/56
Filed: 2021-05-19
Granted: 2022-01-11
Abstract: A semiconductor package includes an interposer, a semiconductor die, an underfill layer and an encapsulant. The semiconductor die is disposed over and electrically connected with the interposer, wherein the semiconductor die has a front surface, a back surface, a first side surface and a second side surface, the back surface is opposite to the front surface, the first side surface and the second side surface are connected with the front surface and the back surface, and the semiconductor die comprises a chamfered corner connected with the back surface, the first side surface and the second side surface, the chamfered corner comprises at least one side surface. The underfill layer is disposed between the front surface of the semiconductor die and the interposer. The encapsulant laterally encapsulates the semiconductor die and the underfill layer, wherein the encapsulant is in contact with the chamfered corner of the semiconductor die.
Patent TW-I797666-B (TW)
Title: 外迫式膨脹螺栓製法及其模具構造
Inventor: ZHANG TU-HUO
IPC: B21K21/00
Filed: 2021-07-05
Granted: 2023-04-01
Abstract: 本發明揭露一種外迫式膨脹螺栓製法及其模具構造，其係經由：取材、整形、後擠伸及溝槽成形、沖下料孔及去除廢料等步驟所完成，使胚料整形後經沖壓形成圓孔及溝槽，再經沖壓下料孔與去除阻隔廢料，使其形成中空狀的圓形套筒。藉此以提供一種套筒，令其得以連貫的沖壓步驟下完成套筒之製作，進而有助於提升製造效能之目的。
Patent TW-I772099-B (TW)
Title: Brightness compensation method applied to organic light-emitting diode display
Inventor: TANG SHANG-PING
IPC: G09G3/3225
Filed: 2021-07-09
Granted: 2022-07-21
Abstract: A brightness compensation method applied to an OLED display is disclosed. The brightness compensation method includes following steps of: (a)using a skip frame method or an extend porch method to reduce a display frame rate of the OLED display from a first frame rate to a second frame rate, wherein the first frame rate is higher than the second frame rate; and (b)compensating pulse widths of N light-emitting control pulses corresponding to a repeat frame or an extended porch not refreshed, wherein the N light-emitting control pulses correspond to N compensation values, N≧1 and the N compensation values are positive or negative.
Patent TW-I808449-B (TW)
Title: 晶粒接合裝置、清潔頭及半導體裝置的製造方法
Inventor: IKARASHI ITSUKI
IPC: H01L21/67
Filed: 2021-07-12
Granted: 2023-07-11
Abstract: [課題]提供可抑制異物擴散來清洗基板的表面的晶粒接合裝置。
        [解決手段]晶粒接合裝置係具備：搬送部，其係沿著第一方向搬送載置晶粒的基板；清潔頭，其係具有：第一噴嘴、第二噴嘴、及吸引口；及驅動部，其係使清潔頭沿著第二方向移動。吸引口係具有在平面視下沿著第一方向延伸的第一邊及第二邊，吸引口係鄰接於第一噴嘴的吹出口與第二噴嘴的吹出口之間作配置。第一噴嘴的吹出口係構成為在平面視下沿著吸引口的第一邊延伸，且構成為相對基板的表面呈垂直延伸。第二噴嘴的吹出口係構成為在平面視下沿著吸引口的第二邊延伸，且構成為相對基板的表面斜向吸引口側延伸。
Patent TW-I792454-B (TW)
Inventor: LIN SHENG-KAI
IPC: G06T7/507
Filed: 2021-07-28
Granted: 2023-02-11
Abstract: Adaptive image shading correction method and system are provided. The methods includes: configuring an image capture device to obtain a current frame; configuring an image processing circuit to receive the current frame, and configuring a processing unit to: divide the current frame into a plurality of blocks; select a plurality of block pairs from the plurality of blocks, in which each of the block pairs includes an inner block and an outer block; perform a filtering process for the plurality of block pairs to determine whether brightness conditions, saturation conditions, hue similarity conditions, and sharpness similarity conditions are met; in response to obtaining a plurality of filtered block pairs, calculate a sum similarity threshold based on hue statistics, a saturation difference, and a brightness difference; and use the filtered blocks with individual thresholds less than the sum similarity threshold to calculate a shadow compensation value to adjust the current frame.
Patent TW-I790744-B (TW)
Title: 自行車踏板結構
Inventor: HSIEH CHIN LONG
IPC: B62M3/12
Filed: 2021-09-14
Granted: 2023-01-21
Abstract: 本發明自行車踏板結構，包括：一具有第一踩踏面及第二踩踏面的踏板本體，該第一踩踏面及該第二踩踏面的對應邊外側分別凹設一嵌槽。至少二反光件，該反光件內緣對應置入該嵌槽內部。至少二第一止滑片，該第一止滑片藉由多數第一螺絲分別鎖固於該第一踩踏面及第二踩踏面的對應邊，該第一止滑片的中段對應壓掣該反光件的外緣。至少二第二止滑片，該第二止滑片藉由多數第二螺絲鎖固於該第一止滑片的相對邊上。該反光件藉由嵌槽的卡掣限位及第一止滑片的縱向壓掣，可穩固定位於踏板本體二踩踏面的對應邊上，使反光件與踏板本體的組裝簡單而又不易產生脫落，且同時又具有踩踏的止滑功效目的者。
Patent TW-I803011-B (TW)
Title: 基板處理裝置
Inventor: TAKAHASHI TOMOHIRO
IPC: H01L21/67
Filed: 2021-10-07
Granted: 2023-05-21
Abstract: 本發明之課題為，於將基板W浸漬於處理槽821中貯存之處理液內，並且於處理液內向上述基板W供給氣泡而對其進行處理之基板處理系統1中，縮小氣泡V之尺寸，提高基板之處理品質。
        本發明係一種基板處理裝置，其包含：處理液噴出部830，其形成處理液之液流L，該液流L自保持於基板保持部810之基板W之下方沿著基板W流向上方；及氣泡供給部840，其配置於處理液噴出部830與基板保持部810之間，向處理槽821中貯存之處理液內供給氣泡V；且氣泡供給部840具有：氣體供給管842，其向內部供給氣體；及氣泡噴出口845，其設置於氣體供給管842，向基板之排列方向噴出氣泡V。