baber/WOPTO huggingface dataset:
Patent JP-2015143990-A (JP)
Title: System and method for processing image data about focus of attention within overall image
Inventor: MICHAEL C MOED
IPC: G06T1/20
Filed: 2015-02-07
Abstract: PROBLEM TO BE SOLVED: To process discrete image data on the basis of a focus of attention within an overall set of acquired image data.SOLUTION: A processing result is configured to act on a sub-set of overall image data to generate an output value to be requested by a vision system process. The output value can be a decoded ID or other alphanumeric data. In a vision system having two processor groups, the system is configured to be executed using a memory that is smaller in capacity than an amount of image data to be read from a sensor array. A first processor group includes a plurality of SIMD processors and at least one general-purpose processor. A data reduction function is configured to generate a reduced data set to be stored in the memory. At least one portion of overall, unreduced image data is concurrently transmitted to a second processor, and a first processor is configured to transmit at least one region indicator to the second processor regarding the reduced data set.
Patent JP-2016147374-A (JP)
Title: Three-dimensional molding apparatus, three-dimensional molding method, and program
Inventor: HOSONO GAKU
IPC: B33Y50/00
Filed: 2015-02-10
Abstract: PROBLEM TO BE SOLVED: To provide means for solving such problems that a three-dimensional molded object cannot be taken out until a molding solution is dried, which increases a wait time for taking out the three-dimensional molded object.SOLUTION: A three-dimensional molding apparatus is provided, which includes: a molding vessel 22 where a powder 20 is supplied to form a powder layer 31 and a molded layer 30 formed by binding the powder 20 of the powder layer 31 is stacked; a flattening roller 12 disposed as reciprocally movable for flattening a surface of the powder 20 in the molding vessel 22 to form the powder layer 31; a molding unit for discharging a molding solution 10 to the powder layer 31 in the molding vessel 22 to form the molded layer 30; heating means for heating the flattening roller 12; and means for bringing the flattening roller 12 in a heated state by the heating means into contact with the powder 20 on the molded layer 30 and moving the roller.SELECTED DRAWING: Figure 3
Patent JP-2016149835-A (JP)
Title: Motor control apparatus
Inventor: IDE YUJI
IPC: H02P5/74
Filed: 2015-02-10
Abstract: PROBLEM TO BE SOLVED: To provide a machine for driving one movable part by a plurality of motors to secure synchronous accuracy between the plurality of motors even when a control response of a machine system to actually be driven cannot be sufficiently improved.SOLUTION: A motor control apparatus 1 for cooperatively driving a movable part such as one table 4 by two motors 2, 3 to be driven on the basis of a common external position command includes: model control systems 10, 50 including movable part models 17, 57 corresponding to movement of the movable part driven by the motors to generate a model command including a model position command from the external position command; and two feedback control systems 30, 70 provided in a 1 to 1 correspondence with the two motors 2, 3 for feedback control of the respective motors on the basis of the model commands. One feedback control system 30 compensates for a control error generated when controlling the motor 2, using a difference between the control error and a control error in the other remaining feedback control system 70.SELECTED DRAWING: Figure 1
Patent JP-2015111725-A (JP)
Title: Semiconductor light emitting device
Inventor: KOBAYAKAWA MASAHIKO
IPC: H01L33/62
Filed: 2015-02-16
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device capable of properly achieving downsizing.SOLUTION: A semiconductor light emitting device comprises: a first lead frame; a second lead frame; a semiconductor light emitting element 2 which is bonded to a die bonding part 11 of the first lead frame and electrically conducted with the second lead frame; and a case 3 which has sides extending along a first direction and a second direction perpendicular to the first direction and covers a part of the first lead frame and a part of the second lead frame to support the first lead frame and the second lead frame. The first lead frame has an extension part extending in the second direction in planar view and a shape of an end face facing the second direction in planar view is a convexoconcave shape composed of the extension part and a part other than the extension part. The extension part includes a first thin extension part 12 having a thickness smaller than that of the die bonding part. The case 3 has a first wrap part which covers a lower surface of the first thin extension part 12 while exposing a rear face of the die bonding part 11.
Patent JP-2016152310-A (JP)
Title: Electronic component built-in wiring board and method for manufacturing the same
Inventor: KIYOTA YASUHIRO
IPC: H05K3/46
Filed: 2015-02-17
Abstract: PROBLEM TO BE SOLVED: To provide an electronic component built-in wiring board capable of improving the reliability of a built-in electronic component.SOLUTION: An electronic component built-in wiring board comprises: an insulating base material including a wiring circuit pattern including a thermosetting resin and formed on at least one surface thereof, and a via hole conductor 3 composed of a plating layer electrically connected to the wiring circuit pattern; and an electronic component 4 which is embedded in the insulating base material and includes a ceramic body 5 and an external electrode 6 provided in a part of the ceramic body 5, and in which the external electrode 6 is connected to the via hole conductor 3. The external electrode 6 includes a base electrode 6a, a nickel plating layer 6b1 covering the base electrode 6a, and a copper plating layer 6b2 covering the nickel plating layer 6b1. The copper plating layer 6b2 includes a region 7 a part of which has been subjected to etching treatment, and is connected to the via hole conductor 3 in the region 7.SELECTED DRAWING: Figure 3
Patent JP-2016152319-A (JP)
Title: Power semiconductor device
Inventor: NOGUCHI MUNETAKA
IPC: H01L21/336
Filed: 2015-02-18
Abstract: PROBLEM TO BE SOLVED: To provide a power semiconductor device such as a MOSFET, achieving a low on-resistance and a high withstand voltage.SOLUTION: First to third drain regions 101, 103, 102 having a first conductivity type are formed of first to third semiconductor materials, respectively. The second drain region 103 and the third drain region 102 are provided, in the order, on the first drain region 101. When the first conductivity type is an n-type, energy at a conduction band end of the second semiconductor material is lower than that at a conduction band end of the first semiconductor material, and energy at a conduction band end of the third semiconductor material is lower than that at a conduction band end of the second semiconductor material.SELECTED DRAWING: Figure 5
Patent JP-2016152574-A (JP)
Title: Program output device, output method and program of program and supplementary information
Inventor: NAKATANI TERUHIRO
IPC: H04N21/431
Filed: 2015-02-19
Abstract: PROBLEM TO BE SOLVED: To provide a program output device which automatically adjusts the parameters related to output of a program or supplementary information.SOLUTION: A program output device 1A includes a program reception unit 101 for receiving a program, a supplementary information reception unit 102 receiving the supplementary information for the program, a parameter acquisition unit 103 for acquiring any one or both of the program parameters related to output of a program and the supplementary information parameters related to output of the supplementary information, a parameter change unit 104 for changing the other or both of the program parameters and supplementary information parameters by using any one of them, and an output unit 105 for outputting a program by using the changed program parameters or outputting the supplementary information by using the changed supplementary information parameters. The brightness and color of a caption are automatically adjusted to easy-to-see values according to the program.SELECTED DRAWING: Figure 1
Patent JP-2016152379-A (JP)
Title: Multilayer capacitor and method of manufacturing the same
Inventor: TSUKIDA YUKI
IPC: H01G4/232
Filed: 2015-02-19
Abstract: PROBLEM TO BE SOLVED: To provide a small-sized multilayer capacitor having large capacity and capable of suppressing both deterioration of moisture resistance and occurrence of delamination.SOLUTION: A multilayer capacitor includes: a laminate body having external dimensions in which each side is no more than 0.3 mm when viewed from a lamination direction; and a first external electrode and a second external electrode provided on a surface of the laminate body apart from each other in a length direction of the laminate body. One conductor layer positioned at the outermost side in the laminate direction among a plurality of conductor layers is curved toward the lamination direction and includes a plurality of penetration portions that penetrate in the lamination direction. A cross-section of the curved conductor layer orthogonal to the length direction of the laminate body is equally divided into four at an equal interval in a width direction of the laminate body to be defined as a region A, a region B, a region C, and a region D in order from one side of the width direction, so that a sum total value of minimum dimensions of the plurality of penetration portions in the region A is larger than that in the region B, and that sum total value in the region D is larger than that in the region C.SELECTED DRAWING: Figure 6
Patent JP-2016151004-A (JP)
Title: Resin foam sheet and fiber reinforced composite
Inventor: FUKUNAGA YOICHIRO
IPC: B32B5/28
Filed: 2015-02-19
Abstract: PROBLEM TO BE SOLVED: To provide a resin foam sheet that has a foam layer made of a resin composition containing a polyester-based resin as well as being excellent in formability, and that enables an easy production of a fiber reinforced composite having excellent lightness in weight and strength.SOLUTION: Provided is a resin foam sheet that has a crystallization peak having a heat of crystallization of 20 mJ/mg or more appearing in a DSC curve obtained when the foam layer is heated at a temperature increase rate of 10°C/minute from 30°C to 290°C, and that has a semi-crystallization time of the foam layer at 120°C of 30 seconds or more and 350 seconds or less.SELECTED DRAWING: None
Patent JP-2015170359-A (JP)
Title: Data processing apparatus and method for multiplying floating point operands
Inventor: DAVID RAYMOND LUTZ
IPC: G06F7/76
Filed: 2015-02-20
Abstract: PROBLEM TO BE SOLVED: To provide a particularly efficient mechanism for multiplying floating point numbers, whilst correctly rounding the result in situations where the result is subnormal.SOLUTION: A data processing apparatus and a method are provided for multiplying first and second normalized floating point operands to generate a result, in which each comprises a significand and an exponent. An exponent determination circuit is used to compute a result exponent for a normalized version of the result, and rounding value generation circuit then generates a rounding value by shifting a rounding constant in a first direction by a shift amount dependent on the result exponent. A partial product generation circuit multiplies the significands of the first and second normalized floating point operands to generate first and second partial products, and, in order to generate a normalized result significand, the first and second partial products are then added together, along with the rounding value. Thereafter, in order to generate a rounded result significand, the normalized result significand is shifted in a second direction opposite to the first direction by the shift amount.
Patent JP-2016153583-A (JP)
Title: Non-welding reinforcement structure of construction
Inventor: MOGI JUNICHI
IPC: E04B1/58
Filed: 2015-02-21
Abstract: PROBLEM TO BE SOLVED: To provide a simple non-welding reinforcement structure of a construction, which has high construction accuracy and does not require welding work on site.SOLUTION: A non-welding reinforcement structure of a construction comprises: a coated member 10, which covers an outer peripheral surface of an installation target member (column material or beam material) 60 by integrally arranging joint members 11 formed by separating the coated member into two sections; a fixing member 20, which fixes the coated member 10 to the installation target member (column material or beam material) 60; a filler 30, which is charged between an inner peripheral surface of the coated member 10 and an outer peripheral surface of the installation target member (column material or beam material) 60; a gusset plate 40, which is welded on at least one of the joint members 11 beforehand; and a brace material 50, which is fit to the gusset plate 40. It is preferable that multiple projections 12 are disposed on the inner peripheral surface of the coated member 10.SELECTED DRAWING: Figure 1
Patent JP-2016157746-A (JP)
Title: Method of manufacturing semiconductor element, and semiconductor element
Inventor: HARADA SUSUMU
IPC: H01L21/306
Filed: 2015-02-23
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor element, and a semiconductor device that are capable of suppressing generation of side etching at the time when an electrode is formed, and of suppressing generation of voltage rising failures caused by reduction in electrode area.SOLUTION: A method of manufacturing a semiconductor element includes the following steps of: forming a conductive layer, on a semiconductor layer having a convex part on a principal surface, in a region including at least an upper surface and a lateral surface of the convex part; forming a first mask for covering a part of a surface of the conductive layer; performing first etching of a part, in a film thickness direction, of the conductive layer by using the first mask; forming a second mask at least covering the part of the surface of the conductive layer subjected to the first etching; and performing second etching of the conductive layer by using the second mask to expose a part of the semiconductor layer and to process the conductive layer into an electrode.SELECTED DRAWING: None
Patent JP-2015146424-A (JP)
Title: semiconductor device
Inventor: KATO KIYOSHI
IPC: H01L21/477
Filed: 2015-02-24
Abstract: PROBLEM TO BE SOLVED: To provide a novel nonvolatile latch circuit and a semiconductor device using the same.SOLUTION: A latch circuit comprises a loop structure in which output of a first element is electrically connected to input of a second element, and output of the second element is electrically connected to input of the first element through a second transistor. A transistor using an oxide semiconductor as a semiconductor material constituting a channel formation region is used as a switching element. Also, the transistor comprises capacitor which is electrically connected to a source electrode or a drain electrode of the transistor, thereby, data of the latch circuit can be retained. Thus, a nonvolatile latch circuit can be constituted.
Patent JP-2015112015-A (JP)
Title: Semiconductor module and power conversion device equipped with the same
Inventor: TOKUYAMA TAKESHI
IPC: H02M7/48
Filed: 2015-02-25
Abstract: PROBLEM TO BE SOLVED: To ensure not only a downsizing technology but also inter-terminal insulation between a positive electrode terminal and a negative electrode terminal by adding a twist in arrangement and alignment of constituent elements, which leads to downsizing of an entire power conversion device.SOLUTION: A power semiconductor module comprises: power semiconductor elements (537 etc.); conductor plates (534, 574) which continue to terminals for supplying DC power to the power semiconductor elements; and a mold resin (507) for covering part of the conductor plates. The terminals and the conductor plates are composed of semiconductor module side positive electrode terminals (532) and negative electrode terminals (572), and a positive electrode side conductor plate (534) and a negative electrode side conductor plate (574). Each of both conductor plates has a principal surface having a width wider than that of another surface and lateral faces each having a width narrower than that of the principal surface. The conductor plates has non-opposite parts where lateral faces of both conductor plates are not opposite to each other, and opposite parts where lateral faces of both conductor plates are opposite to each other. Both conductor plates which form the opposite parts are formed outside the mold resin (507) and a terminal insulation part (396) is arranged between both conductor plates which form the opposite parts.
Patent JP-2016048910-A (JP)
Title: Image processor, image processing system, image processing method, and program
Inventor: OMURA KEIJI
IPC: G06T7/00
Filed: 2015-03-03
Abstract: PROBLEM TO BE SOLVED: To provide an image processor, an image processing system, an image processing method and a program that are capable of freely generating timing of a trigger, which is to be a reference of timing for image determination, or the like.SOLUTION: A trigger area specification part 305 specifies a trigger area for determining timing of a trigger in a display area of image data in a display device 317. A change point detection part 306 acquires frames for a prescribed period before and after the time of a frame of image data reproduced and displayed at the time of specifying the trigger area, calculates, in each of the acquired frames, the difference in pixel value between the frame and the previous frame thereof, and detects, on the basis of the calculated difference, a change point in the image in the trigger area. The trigger generation part 313 compares, in the trigger area on the image display part, a difference image with the image in the trigger area of the frame of the image data, and generates a trigger signal at the timing of the trigger.SELECTED DRAWING: Figure 3
Patent JP-2016162393-A (JP)
Title: Input device and input method
Inventor: HOSONO HIDEKAZU
IPC: G06F3/03
Filed: 2015-03-05
Abstract: PROBLEM TO BE SOLVED: To allow an operation corresponding to a multi-touch gesture to be easily applied to a touch panel with a tool other than a finger.SOLUTION: A contact unit 10 has a plurality of regions capable of independently stimulating the surface of a touch panel. When an operation unit is operated, a control unit 30 individually controls the states of the plurality of regions on the basis of a previously stored stimulation pattern. The stimulation pattern describes a state transition pattern of the plurality of regions corresponding to the loci of multi-touch gestures such as pinch-out gestures and pinch-in gestures.SELECTED DRAWING: Figure 2
Patent JP-2016165922-A (JP)
Title: Pneumatic tire for two-wheeled vehicle
Inventor: KOBAYASHI HIROYUKI
IPC: B60C9/22
Filed: 2015-03-09
Abstract: PROBLEM TO BE SOLVED: To provide a pneumatic tire 2 for a two-wheeled vehicle which achieves improvement of grip performance while inhibiting deterioration of traction performance.SOLUTION: A tire 2 includes a tread 4 and a band 12. The band 12 is positioned at a radial inner side of the tread 4. The band 12 includes a center part 30 and a pair of side parts 32. The center part 30 is positioned on an equatorial plane and comprises a center cord wound into a spiral shape and a center topping rubber. Each side part 32 is positioned at an outer side of the center part 30 in an axial direction and comprises a side cord wound into a spiral shape and a side topping rubber. The side topping rubber is harder than the center topping rubber. A complex elastic modulus of the side topping rubber is 12 MPa or larger.SELECTED DRAWING: Figure 1
Patent JP-2015128794-A (JP)
Title: Hot forging die
Inventor: SASAKI SHOHEI
IPC: B21J13/02
Filed: 2015-03-09
Abstract: PROBLEM TO BE SOLVED: To provide an inexpensive hot forging die in which a desired shape can be obtained even if it is a large-scale forged steel.SOLUTION: A hot forging die is provided for performing hot punch forging of a forged material with hot deformation resistance of 300 MPa or more in conditions where a surface temperature of a die to come into contact with the forged material is 500°C or more and a compression axial load is 150 MN or more. In the hot forging die, multiple ring shaped die pieces are combined and fixed to each other in a shape of a concentric circle, the axial directions of the ring-shaped die pieces serve as pressing force directions when the forged material is forged, a die face and a build-up layer of a nickel-based super-alloy are formed in a portion coming in contact with the forged material, the die face is formed on a portion coming in contact with at least one forged material among multiple ring-shaped die pieces, and the build-up layer is subjected to build-up wedding and formed for every ring-shaped die piece with the die face formed thereon.
Patent JP-2015193596-A (JP)
Title: THIENOPYRAZINE DERIVATIVE HAVING p-SULFANYL-SUBSTITUTED PHENYL GROUPS AND METHOD FOR PRODUCING THE SAME
Inventor: MORI TOMOHIRO
IPC: C07D495/04
Filed: 2015-03-11
Abstract: PROBLEM TO BE SOLVED: To provide a novel thienopyrazine derivative useful as a monomer which serves as a raw material of a low-bandgap (Eg<1.5 eV) conjugated polymer, and a method for producing the same.SOLUTION: Provided are a thienopyrazine derivative represented by the formula, and a method for producing the same. [Rand Rare each independently a substituted or unsubstituted aryl group.]
Patent JP-2016168877-A (JP)
Title: Visual recognition device for vehicle
Inventor: ICHIKAWA TOMONOBU
IPC: H04N7/18
Filed: 2015-03-11
Abstract: PROBLEM TO BE SOLVED: To easily and visually recognize a necessary region without moving a photographing section and replacing a lens.SOLUTION: A visual recognition device for a vehicle acquires a rear side photographed image obtained by photographing by a rear side camera 12 and a peripheral photographed image (photographed image including at least a part of the rear side photographed image and having a wider photographing range than that of the rear side photographed image) obtained by photographing by a peripheral camera 14. The visual recognition device includes a control device 18 to perform control of compounding the rear side photographed image and the peripheral photographed image by aligning the position and size of each subject, forming a display image and displaying the image on a monitor 16, when a retreat switch is turned on.SELECTED DRAWING: Figure 1
Patent JP-2016171134-A (JP)
Title: Semiconductor device and manufacturing method of the same
Inventor: ICHIMURA AKIO
IPC: H01L29/06
Filed: 2015-03-11
Abstract: PROBLEM TO BE SOLVED: To form a super junction structure having a high aspect ratio.SOLUTION: A semiconductor device manufacturing method comprises the steps of: forming an epitaxial layer EPI in a plurality of layers by employing a "trench fill method"; and forming trenches, respectively, at the stages of forming the plurality of layers. That is, as shown in FIG.3, for example, at the stage of forming the epitaxial layer EPI1, a trench TR1 is formed in the epitaxial layer EPI1, and subsequently, at the stage of forming the epitaxial layer EPI2, a trench TR2 is formed in the epitaxial layer EPI2, and at the stage of forming the epitaxial layer EPI3, a trench TR3 is formed in the epitaxial layer EPI3.SELECTED DRAWING: Figure 3