baber/WOPTO huggingface dataset:
Patent TW-201425336-A (TW)
Title: BCMA antigen binding proteins
Inventor: ARMITAGE RICHARD J
IPC: A61K39/395
Filed: 2013-11-29
Abstract: The present invention relates to BCMA (B-Cell Maturation Antigen) antigen binding proteins, such as antibodies, polynucleotide sequences encoding said antigen binding proteins, and compositions and methods for diagnosing and treating diseases. The present invention also relates to BCMA antibody drug conjugates and uses thereof.
Patent TW-201524166-A (TW)
Title: Calibration method and calibration apparatus for calibrating mismatch between first signal path and second signal path of transmitter/receiver
Inventor: CHANG YUAN-SHUO
IPC: H04L27/36
Filed: 2013-12-04
Abstract: A method for calibrating mismatches of an in-phase signal path and a quadrature signal path of a transmitter, including: additionally setting at least one mixer calibration coefficient at a transmitting part of the transmitter; obtaining at least one mixer testing signal from the transmitting part via loopback for spectrum analysis to derive at least one mixer spectrum analysis result; adjusting the at least one mixer calibration coefficient of the transmitting part according to the at least one mixer spectrum analysis result; additionally utilizing an in-phase signal path finite impulse response filter and a quadrature signal path finite impulse response filter to calibrate mismatches between a low pass filter of the in-phase signal path of the transmitting part of the transmitter and a low pass filter of the quadrature signal path of the transmitting part of the transmitter. A similar mismatch calibration operation may be applied to a receiver.
Patent TW-201521922-A (TW)
Title: Electrode structure for electrochemical processing and electrochemical processing device
Inventor: LIAN SHI-CHANG
IPC: B23H3/04
Filed: 2013-12-06
Abstract: This invention is to provide an electrode structure for electrochemical processing and an electrochemical processing device. The electrode structure comprises of an electrode body and a turbulent flow structure which is disposed on the surface of the electrode body. The electrolyte enters the space between the electrode structure and a workpiece while electrochemical processing is performed to the workpiece by the electrode structure, and the turbulent flow structure makes the electrolyte disturbed to change the flow field of the electrolyte, so as to effectively increase the processing efficiency of electrochemical process.
Patent TW-201419941-A (TW)
Title: LED lamp structure for normal fluorescent light fixture
Inventor: YANG SEN-TAI
IPC: H05B37/02
Filed: 2013-12-10
Abstract: The present invention provides a LED lamp structure for normal fluorescent light fixture, which is to respectively configure a first and a second contact unit at both ends of a transparent lamp tube body. The first and second contact units are respectively configured with two contacts to be respectively contacted with the two sockets of the two lamp holders of a normal fluorescent light fixture. A light emitting LED module is configured within the lamp tube body, and is configured with a first end and a second end for connecting with the power source. A first rectifying module and a second rectifying module are respectively configured between the LED module and the first and second contact units. The first and second rectifying modules are respectively configured with two forward diodes for conduction from each contact of the first and second contact units toward the first end of the LED module, and two reverse diodes for conduction from the second end of the LED module toward each contact of the first and second contact units. Each of the forward diodes and the reverse diodes of the first and second rectifying modules may prevent the current from the external power source from flowing through the starter of the fluorescent light fixture, so as to effectively avoid the occurrence of high voltage at each lamp holder of the fluorescent light fixture and further damage the LED module.
Patent TW-201528893-A (TW)
Title: Plug-in type electronic component jointing method (2)
Inventor: CHEN SHANG-REN
IPC: H05K3/34
Filed: 2014-01-09
Abstract: The present invention provides a plug-in type electronic component jointing method (2), which comprises providing a printed circuit board and at least one plug-in type electronic component for correspondingly being installed on the printed circuit board; arranging a through-hole on an electrode contact pin of the printed circuit board for allowing the plug-in type electronic component to plug in correspondingly; respectively plugging all electrode contact pins of the plug-in type electronic component into the corresponding through-holes of the printed circuit board; and finally providing and releasing the plasma arc to the jointing parts between all the electrode contact pins of the plug-in type electronic component and the corresponding electrode contacts of the printed circuit board for a predetermined time. The heat provided by the plasma arc partially melts and joints all the electrode contact pins of the plug-in type electronic component with the electrode contacts of the printed circuit board, thus, the present invention can joint the plug-in type electronic component with the printed circuit board in a more environmental-friendly way.
Patent TW-201434635-A (TW)
Title: Molded article and method of manufacturing the same
Inventor: WATANABE TAKAYUKI
IPC: B29K101/10
Filed: 2014-01-10
Abstract: The invention provides a molded article, which is obtained by thermally molding a molding resin laminate formed by laminating in sequence at least three layers of a resin layer C formed of a thermoplastic resin composition c, a resin layer A formed of a thermoplastic resin composition a, and a resin layer B formed of a curable resin composition b, wherein the pencil hardness of the surface of the resin layer B is 5H or above, and the roundness (R) of the corner portion of the molded article is 2 mm or more and 200 mm or less, or wherein the roundness (R) of the corner portion of the molded article is 2 mm or more and 200 mm or less, and the extensibility ( Δ L1) of the corner portion of the molded article according to the following formula (1) is -40% or more and less than 4%. The molded article of the invention has a beautiful appearance with no occurrence of bleaching, cracking, foaming, etc., and is excellent in surface hardness. Δ L1(%) = (the thickness of the molding resin laminate before molding - the thickness of the corner portion of the molded article after molding) / the thickness of the molding resin laminate before molding * 100...... (1).
Patent TW-201530536-A (TW)
Title: Methods and systems for voice management, and related computer program products
Inventor: WANG JOHN C
IPC: G10L17/22
Filed: 2014-01-29
Abstract: Methods and systems for voice management are provided. First, sounds surrounding an electronic device are received via a sound reception unit, and the sounds are stored in a buffer unit, wherein the sounds received in a predetermined interval preceding a current time are buffered in the buffer unit. When a specific instruction is received, a sound recording process is performed, wherein the buffered sounds are recorded using the sound recording process.
Patent TW-201505651-A (TW)
Title: Microneedle coating composition and microneedle device
Inventor: MACHIDA KAZUYA
IPC: A61K39/12
Filed: 2014-02-13
Abstract: Disclosed is a microneedle coating composition which includes a Japanese encephalitis vaccine antigen, a basic amino acid, and an acid, the number of moles of the acid relative to 1 mol of the basic amino acid being in the range of more than 1/(N+1) to less than 2 when N is the valence of the acid.
Patent TW-201445613-A (TW)
Title: Patterning device, method of producing a marker on a substrate and device manufacturing method
Inventor: BASELMANS JOHANNES JACOBUS MATHEUS
IPC: G03F7/20
Filed: 2014-03-14
Abstract: The invention provides a patterning device, for use in forming a marker on a substrate by optical projection, the patterning device comprising a marker pattern having a density profile that is periodic with a fundamental spatial frequency corresponding to a desired periodicity of the marker to be formed. The density profile is modulated (such as sinusoidally) so as to suppress one or more harmonics of the fundamental frequency, relative to a simple binary profile having the fundamental frequency.
Patent TW-201446515-A (TW)
Title: Film composition for paper thermal lamination
Inventor: LI JEFFREY J
IPC: B32B37/06
Filed: 2014-03-17
Abstract: The present invention relates to a multilayer film comprising a skin layer comprising a anhydride and/or carboxylic acid functionalized ethylene/alpha-olefin interpolymer having a melting point in the range of from 50 to 89 DEG C, wherein the anhydride and/or carboxylic acid is present in an amount of from 0.02 to 0.3 percent by weight of the polyethylene based resin. The multilayer film further comprises a substrate layer comprising a resin selected from the group consisting of polypropylene or polyethylene terephthalate.
Patent TW-201537182-A (TW)
Title: Smart meter capable of wireless transmission
Inventor: TSENG JIUN-KAI
IPC: G01R11/02
Filed: 2014-03-17
Abstract: A smart meter cable of wireless transmission is used to show some power information, in which the smart meter includes an inner cylindrical case, a ring layer, an inner layer antenna, and an outer layer antenna. The interior of the inner cylindrical case is hollow. The ring layer surrounds the inner cylindrical case. The inner layer antenna is attached to the ring layer and slides on the ring layer. The outer layer antenna is also attached to the ring layer and overlaps as well as contacts with the inner layer antenna. The inner layer antenna and the outer layer antenna are driven to adjust the total length of them in order to receive signals of different frequency bands.
Patent TW-201441034-A (TW)
Title: Laminate for temporary adhesive used for manufacturing semiconductor
Inventor: KOYAMA ICHIRO
IPC: B32B33/00
Filed: 2014-03-19
Abstract: Provided is a laminate for temporary bonding in semiconductor device manufacture which is capable of reliably and easily providing temporary support for a member (such as a semiconductor wafer) being mechanically or chemically processed, wherein, even in high-temperature processing, said temporary support can easily be removed without damaging the member when processing has been completed; also provided is a semiconductor device manufacturing method. This laminate for temporary bonding in semiconductor device manufacture has (A) a release layer and (B) an adhesive layer, and the release layer (A) includes (a1) a resin (1) which has a softening point of 200 DEG C or greater, and (a2) a resin (2), wherein 5 mass% or more of said resin (2) dissolves at 25 DEG C in at least one of prescribed solvents after curing.
Patent TW-201446419-A (TW)
Title: Polishing apparatus and wear detection method
Inventor: KOSUGE RYUICHI
IPC: B24B49/18
Filed: 2014-03-26
Abstract: There is provided a polishing apparatus capable of detecting uneven wear occurring on a polishing pad and detecting an appropriate replacement timing of the polishing pad. The polishing apparatus detects, every predetermined time, a value of rotation speed or a value of rotation torque of a table drive shaft for rotationally driving a polishing table or a dresser drive shaft for driving a dresser, or a value of swing torque of a dresser swing shaft for driving the dresser; calculates a change quantity thereof based on the value of the detected rotation speed, the value of the detected rotation torque, or the value of the detected swing torque; determines whether or not the change quantity exceeds a predetermined value; and notifies a user of a warning when a determination is made that the change quantity exceeds the predetermined value.
Patent TW-201504169-A (TW)
Title: Method for the production of glass components
Inventor: BULLESFELD FRANK
IPC: C03B23/037
Filed: 2014-04-02
Abstract: The present invention relates to a method for the production of glass components, an apparatus for carrying out the method and a glass component that is obtainable through the method. The method is a drawing method wherein a deformation zone of a blank is heated to a temperature that allows drawing of the glass. The method is characterized in that the deformation zone of the blank is very small. Thereby the width of the blank is decreased to a smaller extent than its thickness. The glass components that can be obtained by this method have very smooth surfaces.
Patent TW-201445815-A (TW)
Title: Multiband antenna and slotted ground plane therefore
Inventor: BEREZIN ANATOLY
IPC: H01Q1/48
Filed: 2014-04-22
Abstract: A multiband antenna including a ground plane having at least one periphery, at least one non-radiative slot being formed along the at least one periphery, a first plurality of radiating elements mounted on the ground plane adjacent to the at least one periphery and radiating in a first frequency band and a second plurality of radiating elements mounted on the ground plane adjacent to the at least one periphery and radiating in a second frequency band, the second frequency band being higher than the first frequency band.
Patent TW-201544882-A (TW)
Title: Display device
Inventor: CHANG JUNG-FANG
IPC: G02F1/1333
Filed: 2014-05-21
Abstract: A display device is disclosed, which comprises: a substrate comprising a display region and a non-display region; a first conductive layer; a semiconductor layer comprising a first part and a second part, the first conductive layer disposed between the first part and the substrate without between the second part and the substrate; a second conductive layer comprising a plurality of data lines corresponding to the display region; and a plurality of thin film transistor structures composed of the first conductive layer, the semiconductor layer, and the second conductive layer; where each data line includes a first side and a second side opposing to and spacing from each other, and part of the first side is adjacent to a channel located in the thin film transistor structure; wherein a first distance between the second side and the adjacent first part is longer than a second distance between the second side and the adjacent second part.
Patent TW-201545513-A (TW)
Title: Wideband calibration method and wideband calibration apparatus for calibrating mismatch between first signal path and second signal path of transmitter/receiver
Inventor: CHENG CHING-CHIA
IPC: H04L27/34
Filed: 2014-05-29
Abstract: A method for calibrating mismatches of an in-phase signal path and a quadrature signal path of a transmitter, including: utilizing the receiver to receive at least one test signal via the first signal path and the second signal path, wherein each test signal possesses a specific frequency within a specific frequency band; calculating at least one calibration coefficient for each test signal respectively, so as to calibrate mismatch between the first signal path and the second signal path of the receiver with respect to the specific frequency corresponding to each test signal; deriving a tap coefficient of a calibration filter of a calibration filter unit according to the at least one calibration coefficient of each test signal; and utilizing the calibration filter unit to calibrate a received signal.
Patent TW-201524269-A (TW)
Title: Miniaturized head for induction welding of printed circuits
Inventor: CERASO BRUNO
IPC: H05B6/48
Filed: 2014-06-12
Abstract: The invention relates to an induction head (1) for welding multilayer stacks (52) for printed circuits and the like, wherein an inductor core (3) associated with an excitation inductance (6) is cooled by air or another gaseous fluid, which circulates in a path provided in the induction head. A second inductor core (4) cooperates with the first one to guide a magnetic flux to at least one junction area of a multilayer stack (52) interposed between the cores (3, 4): the cooling fluid laps the junction area of the multilayer stack, thus facilitating the detachment of the head at the end of the welding process.
Patent TW-201518309-A (TW)
Title: Process for preparing indium alkoxide compounds, the indium alkoxide compounds preparable by the process and the use thereof
Inventor: STEIGER JUERGEN
IPC: H01L29/772
Filed: 2014-06-23
Abstract: The present invention relates to indium alkoxide compounds preparable by reacting an indium trihalide InX3 where X = F, Cl, Br, I with a secondary amine of the formula R"2NH where R" = alkyl, in a molar ratio of 8:1 to 20:1 in relation to the indium trihalide, in the presence of an alcohol of the generic formula ROH where R = alkyl, to a process for preparation thereof and to the use thereof for production of indium oxide-containing or (semi)conductive layers.
Patent TW-201439192-A (TW)
Title: Thermosetting resin composition, cured product thereof, and printed circuit board using the same
Inventor: ENDO ARATA
IPC: H05K3/28
Filed: 2012-09-19
Abstract: The present invention provides a thermosetting resin composition having a cured product with excellent low bending properties and thermal cycle, etc. and in which cracking of a coating film is suppressed in a B stage condition; a cured product thereof; and a printed wiring board using the same. In addition, the present invention provides a thermosetting resin composition characterized by comprising: (A) an epoxy resin, (B) a curing agent for an epoxy resin, (C) spherical silicon dioxide and/or spherical aluminum oxide, and (D) a block copolymer.
Patent TW-201503629-A (TW)
Title: Method of handling HARQ feedbacks and related communication device
Inventor: LEE CHIEN-MIN
IPC: H04L1/18
Filed: 2014-07-04
Abstract: A method of transmitting hybrid automatic repeat request (HARQ) feedbacks for a communication device comprises transmitting at least one first HARQ feedback to a first base station according to first downlink (DL) control information (DCI) indicating at least one first DL packet, if the at least one first HARQ feedback is at least triggered by the at least one first DL packet, wherein the at least one first DL packet is transmitted by the first base station to the communication device; and transmitting at least one second HARQ feedback to the first base station, if the at least one second HARQ feedback is only triggered by at least one second DL packet, wherein the at least one second DL packet is transmitted by a second base station to the communication device.
Patent TW-201506134-A (TW)
Title: Liquid crystal composition applicable in in-plane switching mode and an application of the composition
Inventor: DING WEN-QUAN
IPC: G02F1/13
Filed: 2014-08-05
Abstract: Provided in the present invention is a liquid crystal composition applicable in an in-plane switching mode. The liquid crystal composition comprises: accounting for 25% to 55% of the total weight of the liquid crystal composition, one or more compounds as represented by formula I; accounting for 20% to 40% of the total weight of the liquid crystal composition, one ore multiple compounds as represented by formula II; accounting for 5% to 25% of the total weight of the composition, one or multiple compounds as represented by formula III; accounting for 5% to 20% of the total weight of the liquid crystal composition, one or multiple compounds as represented by formula IV; and, accounting for 5% to 25% of the total weight of the liquid crystal composition, one or multiple compounds as represented by formula V. An in-plane switching mode liquid crystal display component that uses the liquid crystal composition has the advantages of fast response, high-definition highlights, and low driving voltage. Also provided in the present invention is an electro-optical liquid crystal display. The liquid crystal display comprises the liquid crystal composition described in the present invention.
Patent TW-201513346-A (TW)
Title: Semiconductor element
Inventor: FUJIOKA HIROSHI
IPC: H01L21/205
Filed: 2014-08-29
Abstract: A transistor (1a) is provided with a substrate (2a), a first insulating layer (3a), a nitride semiconductor layer (4a), a second insulating layer (5a), a source electrode (61), a drain electrode (62), and a gate electrode (63). The first insulating layer (3a) has functions as a base layer of the nitride semiconductor layer (4a), and is, for instance, an HfO2 layer having a thickness of approximately 1-20 nm. The nitride semiconductor layer (4a) is an InN layer that is provided on the substrate (2a), and is a polycrystalline or amorphous film having a film thickness of 1-10 nm. The InN layer having a film thickness within the range exhibits electrical characteristics equivalent to those of a single crystal, even if the layer is a polycrystalline or amorphous film. Consequently, constraints in manufacturing conditions are greatly eliminated, and a semiconductor element that is provided with an InN layer as a channel is provided, said InN layer being low-cost and having excellent electrical characteristics.
Patent TW-201517149-A (TW)
Title: Electronic component manufacturing device and manufacturing method
Inventor: IZUMI YUYA
IPC: H01L21/304
Filed: 2014-09-03
Abstract: The present invention provides an electronic component manufacturing device and a manufacturing method. The device and the method are to accommodate a plurality of electronic components, which are formed by cutting an object to be cut, into an accommodating box. The electronic component manufacturing device, which is used to manufacture a plurality of electronic components by cutting a package substrate having a whole substrate and semiconductor chips into a plurality of regional units, includes: a rotary blade; a first conveying mechanism for fixing the plurality of electronic components and moving afterwards; an output portion for outputting the plurality of electronic components to the external of the manufacturing device; an accommodating box disposed below a moving path of the first conveying mechanism; and a scrapping member fixed at the internal side of the accommodating box and composed of a single plate member treated as a rigid member, wherein the whole substrate has a plurality of regions and the semiconductor chips are respectively installed in the plurality of regions. Through the moving of the first conveying mechanism, the scrapping member contacts and scrapes the electronic components. The scrapped electronic components are accommodated into the accommodating box.
Patent TW-201612440-A (TW)
Title: Holder and chain type ball holding device
Inventor: WU FANG-XUAN
IPC: F16H25/22
Filed: 2014-09-26
Abstract: Disclosed is a chain type ball holding device, which comprises a plurality of balls and a holder. The holder comprises two connecting members and a plurality of spacers. The connecting members are respectively disposed on both sides of the balls. The head and tail of each connecting member are provided with a joining surface. The joining surfaces of each connecting member are overlapped in the arrangement direction of the balls and are seamlessly joined. The spacers are disposed among the connecting members with intervals along the arrangement direction. Every two spacers are provided for disposing one ball in between. By overlapping the head and tail of the holder in the arrangement direction of the balls and seamlessly joining at the overlapped positions, the head and tail of the holder may achieve excellent joining effect and may be presented with a curved shape during operation corresponding to the curved condition of the rolling channel, so as to solve the friction and noise issues of the connecting members caused by yawing in operation.
Patent TW-201518319-A (TW)
Title: Human relaxin analogs, pharmaceutical compositions thereof and pharmaceutical use thereof
Inventor: Zhang lian-shan
IPC: A61K47/48
Filed: 2014-11-04
Abstract: The present invention relates to human relaxin analogs, pharmaceutical compositions and pharmaceutical use thereof. Particularly, the present invention discloses analogs of human relaxin, derivatives and compositions thereof, and nucleic acid encoding said analogs.