Patent SG-11201902587R-A (SG)
Title: Transfer method providing thermal expansion matched devices
Inventor: DRAB JOHN J
IPC: H01L21/683
Filed: 2017-10-17
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 111111101111 0 1110101011111 011101 0 01111H111111111111111111111111111111110111111 Organization International Bureau (10) International Publication Number (43) International Publication Date .....0\"\" WO 2018/075444 Al 26 April 2018 (26.04.2018) WIP0 I PCT — (51) (21) (22) (25) Filing Language: (26) (30) International Patent Classification: (74) Agent: LAWRENCE, M. Brad; CANTOR COLBURN HO1L 21/683 (2006.01) H01L 23/00 (2006.01) LLP, 20 Church Street, 22nd Floor, Hartford, Connecticut HO1L 27/14 (2006.01) 06103 (US). International Application Number: (81) Designated States (unless otherwise indicated, for every PCT/US2017/056875 kind of national protection available): AE, AG, AL, AM, International Filing Date: AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, 17 October 2017 (17.10.2017) CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, English HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, Publication Language: English KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, Priority Data: OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, 15/331,149 21 October 2016 (21.10.2016) US SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (71) (72) Inventor: DRAB, John J.; Raytheon Vision Systems, 75 Applicant: RAYTHEON COMPANY [US/US]; 870 Winter Street, Waltham, Massachusetts 02451-1449 (US). (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, Coromar Drive, Goleta, California 93117 (US). UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, = Title: TRANSFER METHOD PROVIDING THERMAL EXPANSION MATCHED DEVICES FIG 3 11.........___,, _122 (54) — = = = 12 13.--- - ``e 121 11 FIG. 4A = = = 14 12 FIG. 6 14 12 ..........._ 122 _„„„„, 15 r 121 4 60 : A method of transferring an integrated circuit (IC) onto an alternative substrate is provided at a wafer level to enable of thermal expansion (CTE) matching for a circuit layer to a different material. The method is executable relative to a wafer with a circuit layer (12), a first major surface (121), a second major surface (122) opposite the first major surface, and a substrate affixed to the first major surface. The method includes temporarily bonding a handle (14) to the second major surface, removing a of the substrate to expose the first major surface and bonding a second substrate (16) to the first major surface with deposited material (15). If) coefficient majority 0 bonding = = = = = 71' 71' si. (57) IN (11) 0 - --- GC (13) N C [Continued on next page] WO 2018/075444 Al O II MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: — as to applicant's entitlement to apply for and be granted a patent (Rule 4.17(11)) — as to the applicant's entitlement to claim the priority of the earlier application (Rule 4.17(iii)) Published: — with international search report (Art. 21(3))