Patent EA-001814-B1 (EA)
Title: Monocrystalline ic module
IPC: H01L23/538
Filed: 1999-03-01
Abstract: 1. A monocrystalline IC module comprising a plate with said IC crystal with contact pads, a system of conductors connecting, via elements of contact units, contact pads of said IC crystal with output contact plugs arranged on the periphery of the plate in a predetermined co-ordinate system and a cover defining together with the plate an enclosed space for the IC crystal which is thus protected from any external action, characterized in that the plate is designed in the form of f flat plate, a support is fixed onto said plate and comprises the IC crystal, a system of conductors in the form of electroconductive tracks on the support surface connecting the metallised openings to electroconductive tracks on the surface of the support, some of them, together with the contact pads of the crystal form the contact units connecting the crystal with the to electroconductive tracks on the surface of the support, while other the metallised openings together with the output contacts designed in the form of contact plugs and arranged with some clearance in the metallised openings of the support, form the contact units connecting output contacts to the electroconductive tracks on the surface of the support, wherein elements of the contact units are connected together by an electoconductive binding material, and the cover is designed the form of a plate with a recess in its central portion for the IC crystal and openings in a co-ordinate system that coincides with the co-ordinate system of the base openings, the contact plugs are inserted into the openings, the cover defining together with the plate an enclosed space for the IC crystal which is thus protected from any external action. 2. The monocrystalline IC module according to claim 1, characterized in that the metallised openings in the support for the contact units connecting the contact pads of the IC module to the electroconductive tracks on the surface of the support are made in the form of truncated cones, lesser bases of the truncated cones face the contact pads of the IC module and splice with them, said splices are filled with an electroconductive binding material, and bigger bases are provided with metallized rims along their periphery, connected to the electroconductive tracks. 3. The monocrystalline IC module according to claim 1, characterized in that the metallised openings in the support for the contact units connecting the contact pads of the IC module to the electroconductive tracks on the surface of the support are made in the form of cylinders with metallized rims along their edge periphery, some of them are connected to the electroconductive tracks, and others form splices with the contact pads of the IC module filled with electroconductive binding material. 4. The monocrystalline IC module according to claim 1, characterized in that the metallised openings in the support for the contact units connecting the electroconductive tracks with the output contact plugs are made in the form of truncated cones, the bigger bases of which connected via the metallised rims along the periphery to the electroconductive tracks, the lesser bases are made with the metallised rims or without them, the outlet contact plugs are positioned the metallised openings having gaps filled with the electroconductive binding material. 5. The monocrystalline IC module according to claim 1, characterized in that the metallised openings in the support for the contact units connecting the electroconductive tracks with the output contact plugs are made in the form of cylinders with metallised rims along their edges, wherein upper rims are connected to the electroconductive tracks provided on the support surface, and the output contact plugs are positioned in the metallised openings having gaps filled with the electroconductive binding material. 6. The monocrystalline IC module according to claim 1, characterized in that comprises a frame arranged between the support and the cover, the cover is made of insulating material with a window for a crystal and openings in the coordinate system coinciding with the coordinate system in the base, through which the output contact plugs are introduced, and the cover is made in the form of flat plate, wherein the base, the frame and the cover tightly fit to each other and fasten together. 7. The monocrystalline IC module according to claim 6, characterized in that the upper and lower surfaces of the frame are coated with electroconductive coatings insulated from each other, and the openings for the output contact plugs are metallised and have metallised rims, wherein a first group of metallised openings is isolated from the electroconductive coatings on both the upper and lower frame surfaces, a second group of the metallised openings is insulated from electroconductive coating on the upper surface and electrically connected to the electroconductive coating on the lower surface of the frame, and a third group of the metallised openings is insulated from the electroconductive coating on the lower surface and electrically connected to the electroconductive coating on the upper surface of the frame, wherein the electroconductive coatings on the upper and lower surfaces of the frame are used as power lines or grounding. 8. The monocrystalline IC module according to claim 6, characterized in that the base and the cover are made of from an electroconductive material, their surfaces and openings made in them are coated with an insulating material. 9. The monocrystalline IC module according to claim 6, characterized in that the base and the cover, made of electroinsulation material, their surfaces are coated with the electroconductive coating and the openings for the output contact plugs are metallised and insulated from the electroconductive coatings of the base and cover surfaces. 10. The monocrystalline IC module according to claims 8 and 9, characterized in that a first group of the output contact plugs is electrically connected to the base electroconductive material, a second group of the output contact plugs is electrically connected to the cover, and a third group of the output contact plugs is insulated from both the base and the cover. 11. The monocrystalline IC module according to claims 8 and 9, characterized in that the base is used as a busbar "ground" and electrically connected to the corresponding output contact plugs and the crystal contact pads, and the cover is used as a busbar "power" and electrically connected to the corresponding the corresponding output contact plugs and the crystal contact pads. 12. The monocrystalline IC module according to claims 8 and 9, characterized in that the base is used as a busbar "power" and electrically connected to the corresponding output contact plugs and the crystal contact pads, and the cover is used as a busbar "ground" and electrically connected to the corresponding the corresponding output contact plugs and the crystal contact pads. 13. The monocrystalline IC module according to claims 8 and 9, characterized in that the base and the cover are used as a screen for protection of the IC crystal from outer electromagnetic fields and radiations and also outer components from effects of electromagnetic fields and crystal radiations. 14. The monocrystalline IC module according to claims 1 and 6, characterized in that the cover fits tightly the rear side of the IC crystal. 15. The monocrystalline IC module according to claims 1 and 6, characterized in that the support is made of polyimide base film. 16. The monocrystalline IC module according to claims 1 and 6, characterized in that the support is a multi-layer structure. 17. The monocrystalline IC module according to claims 1 and 6, characterized in that openings are made in the ends of output contacts opposite to the ends of contacts interacting with the commutation plate, the depth and the diameter of said openings provide coupling with contacts made in the form of pins. 18. The monocrystalline IC module according to claims 1 6 and 7, characterized in that a closed volume cavity for the crystal is filled with an insulating material. 19. The monocrystalline IC module according to claim 18, characterized in that a heat-conducting material is used as the filling material. 20. The monocrystalline IC module according to claim 1, characterized in that the base and the cover are made from a high heat-conductivity material. 21. The monocrystalline IC module according to claim 1, characterized in that the free ends of the output contact plugs are ball-like. 22. The monocrystalline IC module according to claim 21, characterized in that the ball-shaped ends of the output contact plugs are spaced at a predetermined distancefrom the body cover. 23. The monocrystalline IC module according to claim 21, characterized in that the surfaces of the ball-shaped ends of the output contact plugs are tinned with a solder.