baber/WOPTO huggingface dataset:
Patent JP-S5671136-A (JP)
Title: Japanese word processor system
Inventor: INOUE CHIYUUYA
IPC: G06F3/02
Filed: 1979-11-14
Abstract: PURPOSE: To obtain a cheap Japanese word processor as the whole, by using the Kanji (Chinese character) font memory, which is constituted by plural divided blocks, by plural Japanese word processors commonly.  
     CONSTITUTION: Word processors IWN provided with CPU1, Kanji input part 2, display device 3, and printer 4 are connected to kanji font memory PM, which is constituted by plural divided blocks B 1 WB n , through controller CON. Word processors IWN, output the read request signal when they require Kanji patterns, and controller CON connects word processors and a desired block of kanji font memory PM according to determined priority, and word processors read kanji patterns. After this read, another suspended word processor is connected to a desired block. 
     COPYRIGHT: (C)1981,JPO&Japio
Patent JP-H09330153-A (JP)
Title: Electric power distribution device
Inventor: YOSHINAGA KOJI
IPC: G06F1/26
Filed: 1996-06-10
Abstract: PROBLEM TO BE SOLVED: To improve the security by inputting a control signal to a switch group which set respective subordinate outlets so that electric power can be supplied in arbitrary combination according to power source control information read out of a medium wherein a combination of the subordiante outlets to be made ready for power supply is previously recorded. SOLUTION: The power plug of a terminal 101, etc., whose security function is not sufficient is connected to a subordinate outlet S, and a voltage led out of a main outlet M is distributed to subordiante outlets S. On ID cards 21 that only specific operators have, a combination of subordinate outlets to be made ready for power supply is recorded as the power source control information. Then a card reader 2 reads the power source control information out of the ID cards 21-24, a control part 3 inputs a control signal to switch groups 11-14 according to the power source control information, and the switch groups 11-14 set the respective subordinate outlets S in a power supply state in arbitrary combination.
Patent JP-H05344352-A (JP)
Title: Image processor
Inventor: NAKAJIMA TOSHIFUMI
IPC: H04N1/32
Filed: 1992-06-08
Abstract: PURPOSE:To provide a compact image processor in which a progressive build-up can be attained at a low cost by encoding and transmitting transmission image sequentially from an image of a high resolution to the image of a low resolution. CONSTITUTION:A CPU 2 stores the image of a 400dpi resolution in an image encoding buffer area, converts the resolution of the image into the image of 200dpi resolution by a hierarchical encoding/decoding LSI 9, and stores it. Next, the CPU 2 encodes the data of 400dpi and 200dpi resolution by the LSI 9, converts the image of 400-200dpi resolution in a transmission buffer by an MO DEM 14, and transmits through an NCU 15 and a line 33. Then, the CPU 2 converts the resolution of the data of 200dpi into the image of 100dpi resolution by the LSI 9, and transmits the data of 200dpi and 100dpi resolution through the MODEM 14 and the NCU 15. Afterwards, the transmission image is encoded and transmitted sequentially from the image of the high resolution to the image of the low resolution in the same way.
Patent JP-H071098-A (JP)
Title: Die casting method
Inventor: KURIYAMA MINORU
IPC: B22D17/00
Filed: 1993-06-18
Abstract: PURPOSE:To improve the quality of a formed product by replacing the air in a die cavity and an injection sleeve with inert gas before pouring molten metal into the injection sleeve. CONSTITUTION:In the condition of abutting the upper end part of the injection sleeve 30 on the lower part of the die, a passage introduced to the cavities 11a, 12a from an inert gas supplying source 85 at the outside of the die is opened by action of a valve, and after replacing the air in the die cavity and the injection sleeve with the inert gas, the molten metal is poured into the injection sleeve.
Patent JP-H10335660-A (JP)
Title: Semiconductor device and manufacture thereof
Inventor: NAKAHARA YASUSHI
IPC: H01L29/78
Filed: 1997-06-05
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device equipped with an insulated gate field effect transistor which is provided with a diffusion layer that is lessened in capacitance without using a selective growth method and decreased in size by lessening the diffuison layer in depth. SOLUTION: An element region is formed under a gate electrode 105 and demarcated with an element isolation insulating region 102 in a semiconductor substrate 101 which forms an insulated gate field effect transistor, where a space between a position at which a part of the element region where two diffusion layers 112 and 113 are formed is brought into contact with the element isolation insulating region 102 and the side of the gate electrode 105 is set smaller than the height of the gate electrode 105, the diffusion layers are each composed of an upper layer 112 and a lower layer 113, a distance between the one edge of the diffusion upper layer 112 on an gate electrode side and the other edge on an element isolation insulation region side is set larger than the height of the gate electrode 105, and the edge of the diffusion upper layer 112 on an element isolation region side is formed on the element isolation region 102.
Patent JP-S6339826-A (JP)
Inventor: REJISU JIYOZEFU PERETSUTO
IPC: C07C5/27
Filed: 1987-06-16
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S63312528-A (JP)
Title: Flat spring device
Inventor: MISUMI ATSUSHI
IPC: F16F1/28
Filed: 1987-06-15
Abstract: PURPOSE:To prevent abrasion of a spring plate caused by friction between this spring plate and a member for a spring eye, by fastening a pressure plate with a fastening means, as this pressure plate is wedged in between guide parts of the spring eye frame and the spring plate, in a vehicle suspending flat spring device. CONSTITUTION:In a spring eye assembly 2 which is connected to a vehicle body side member, an end part of a spring plate 1 is inserted between a pressure plate 14 and a spring eye frame 3, and the pressure plate 14 is fastened with a nut 23. This pressure plate 14 is wedged in firmly between guide parts 11, 12 and the spring plate 1, by a wedging effect. When a force by which the spring plate 1 is pulled out from the spring eye assembly 2, acts on the spring plate 1, the pressure plate 14 enters more firmly. As the entire circumference of the end part of the spring plate 1 is surrounded with a bottom wall 5 and side walls 6, 7 of the spring eye frame 3, and a flat plate part 15 of the pressure plate 14, and as liners 28, 29 formed of rubber elastic bodies are set between the spring plate 1 and the flat plate part 15 or the bottom wall 5, the connecting strength between the spring plate 1 and the spring eye assembly 2 is increased, by synergistic effect brought on by said members. In this way, abrasion of the spring plate caused by slight friction, and damage of the spring plate caused by localized stress concentration, can be prevented.
Patent JP-H10330435-A (JP)
Title: Graft-modified polyolefin resin and polyester resin composition containing the same
Inventor: TAMAI KAZUHIKO
IPC: C08F8/08
Filed: 1997-06-05
Abstract: PROBLEM TO BE SOLVED: To obtain a polyester resin composition capable of being suitably used for automotive parts, home electric appliance parts, industrial parts, sports articles, furnitures, etc., and excellent in heat resistance and physical property balance between molding flowability and mechanical properties such as impact resistance. SOLUTION: This graft-modified polyolefin resin is obtained by preparing an aqueous suspension comprising (a-1) 100 pts.wt. of a polyolefin resin, (a-2) 0.1-20 pts.wt. of an unsaturated epoxy monomer, (a-3) 0.1-20 pts.wt. of a vinylic monomer copolymerizable with the component (a-2), and (a-4) a radical initiator in an amount of 0.001-10 pts.wt. per 100 pts.wt. of the total amount of the components (a-2) and (a-3), impregnating the components (a-3) and (a-4) into the component (a-1) in the aqueous suspension, and graft-copolymerizing the components (a-2) and (a-3), and has a gel fraction of <=5 wt.%. The polyester resin composition comprises 1-50 wt.% of the graft-modified polyolefin resin and 99-50 wt.% of a polyester resin.
Patent JP-H05315487-A (JP)
Title: Hybrid integrated circuit device
Inventor: OGATA TOSHIICHI
IPC: H01L23/40
Filed: 1992-05-13
Abstract: PURPOSE:To prevent a ceramic substrate from being cracked by interposition of a foreign substance or the like by a method wherein a stress, which is generated when a heat dissipation fin is secured on a case body, is made to relax by providing flexible places provided between screwed parts and the ceramic substrate. CONSTITUTION:In a hybrid integrated circuit device of a structure, wherein a heat dissipation fin 1 soldered with a ceramic substrate 2 mounted with a semiconductor component is placed on a case body 7 and the substrate 2 is sealed by a cap 8, it consists of a metal or a resin, has flange parts 8a in its longitudinal direction, has a hat-shaped section and is formed into a form covering the fin 1. The cap 8 is mounted on the case body 7 by screws 6 utilizing mounting holes 8b provided in the flange parts 8a. Thereby, a stress, which is generated by interposition of a foreign substance, the recesses and projections of the case body 7 or the like, is made to relax by the flange parts 8a, the stress is prevented from acting to the fin 1 and the substrate 2 is prevented from being cracked.
Patent JP-S6127488-A (JP)
Inventor: MATSUBARA YOSHIAKI
IPC: B65G47/82
Filed: 1984-07-17
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H09307236-A (JP)
Title: Manufacture of multilayer printed wiring board and prepreg
Inventor: SATO NORIYUKI
IPC: B29K101/10
Filed: 1996-05-17
Abstract: PROBLEM TO BE SOLVED: To provide the manufacturing method of a multilayer printed wiring board and a prepreg having little warp and twist, microscopic workability, high densification and adaptability for a process in which material can be mounted by reflowing solder regardless of the type of structure of glass cloth and the manufacturing method of a prepreg. SOLUTION: When a multilayer printed wiring board, in which an inner layer circuit board in which a circuit pattern is formed, a prepreg and an outer layer conductive layer are formed in one body, is manufactured, after thermosetting resin is applied to a glass substrate and dried up in a drying tower 6 and a prepreg is formed, semihardened resin, which is once fused, is used in the state wherein the tension between pinch rollers 9 and 10 does not work.
Patent JP-2000340214-A (JP)
Title: Protecting cover of battery terminal
Inventor: KOSUGE HIDEJI
IPC: H01M2/34
Filed: 1999-05-27
Abstract: PROBLEM TO BE SOLVED: To prevent a cover piece from removing even when a hinge is cut. SOLUTION: This protecting cover 1 includes a body 1A for mounting an electric wire connecting part of a battery terminal and a cover piece 1B for covering a clamp part 2B of the battery terminal 2. A locking arm 21 is suspended so as to be bent on an inner side of the cover piece 1B, and a locking receiving part 23 for engaging with a claw part 20 of the locking arm 21 when the cover piece 1B is closed is formed on the body 1A. The locking receiving part 23 is opened forward so as to simplify a die structure. A stopper projecting part 27 is formed on a ceiling surface of the cover piece 1B so as to compensate when a hinge 7 cuts, and a locking hole 28 is opened on a corresponding position on a side of the body.
Patent JP-2000339705-A (JP)
Title: Information recording and reproducing device
Inventor: WATABE TETSUO
IPC: G11B7/085
Filed: 1999-05-27
Abstract: PROBLEM TO BE SOLVED: To perform a detection in which positional accuracy of moving bodies is more enhanced under a situation in which the backlash in sliding parts of the moving bodies (an optical head and a card mounting base or the like) with respect to guide shafts is suppressed to the absolute minimum. SOLUTION: In this information recording and reproducing device, guide means consisting of guide shafts 53, 54 of at least one or more which includes a maing shaft, a moving body (an optical head 51) which is supported with respect to the main shaft with plural supporting points, a driving mechanism linearly driving the moving body along the main guide shaft and optical detectors 60 of at least one or more detecting the position of the moving body are constituted as a unit 69. As the optical detectors, a fixed detecting element and a movable detecting elements 62 which moves together with the movement of the moving body are arranged so as to detect the position of the moving body at a position close to a direction intersecting with the axial line of the main shaft.
Patent JP-S5481501-A (JP)
Title: Radial piston motor
Inventor: FUKUNAGA KOREYUKI
IPC: F04B1/26
Filed: 1977-12-10
Abstract: PURPOSE: To avoid abnormal pressure rise in feed passages to a radial piston motor used in combination with a brake valve, which may be caused when operating the brake.  
     CONSTITUTION: In the cylinder block 23 of a radial piston motor, plural number sylinders 26a-26e extending radially from an output shaft 21 are provided, slidable pistons 29a-29e are fitted respectively in those cylinders and connected to an eccentric shaft 32 via connecting rods 31. In this eccentric shaft 32, a relief oil passage 54 which will be opned to a notch 53 at its maximum eccentric position, it means one of the pistons is at the top dead center. By so doing, when the piston motor acts as a pump at the time of braking, high pressure oil in an oil passage 39a is relieved through the oil passage 54 and an abnormal pressure rise in the feeder side including a feed port 42 is avoided. 
     COPYRIGHT: (C)1979,JPO&Japio
Patent JP-S629791-A (JP)
Title: Method for abutting wide and thin steel strips
Inventor: TAJIKA HIROSHI
IPC: B23K26/26
Filed: 1985-07-05
Abstract: PURPOSE:To increase an abutting accuracy by making the cut face of the preceding steel sheet coincided with a welding torch traveling line by using an image sensor, then by arranging both cut faces so as to minimize the gap with the succeeding sheet cut face. CONSTITUTION:A preceding sheet 1 is transferred by a roller 10 and the rear end part thereof is cut by a cutting device 6. The cut face of the preceding sheet 1 is made coincident with the traveling line of a welding torch 5 with enlarging observation by using an image sensor by forming clamps 3, 3' in unclamping state. The succeeding sheet 1' is then transferred by a lead-in roller 10 and the cut face thereof is abutted to the cut face of the preceding sheet 1. In this case, the gap between both cut faces is made minimum by using the image sensor and sheets 1, 1' are clamped by the clamps 3, 3' as well. The generation of the deformation and slippage of the sheet is eliminated thus and the butt accuracy is increased.
Patent JP-S5671740-A (JP)
Title: Ventilation fan for duct
Inventor: OOHIRA KATSUNORI
IPC: F04D25/08
Filed: 1979-11-15
Abstract: PURPOSE: To enable a grille to be installed by 'One Touch', in a ventilation fan for duct installed inside the ceiling, etc., by providing the fan with a grille-installing mechanism which holds the grille on an opening on the suction side of a main frame by tension of a pull-type srping.  
     CONSTITUTION: A ventilation fan for duct is provided with a cylindrical motor base 5 in a main frame 1, and a motor 15 which is equipped with a fan 18 is tightly mounted onto the base. A mouth 24 is provided under the fan 18 with an appropriate gap, and a grille-installing mechanism 27 is screwed to bosses 26 located around an air inlet 25 of the mouth 24. This grille-installing mechanism 27 is composed of an installing table 28, which has a fallen-U-shape section, a spring 29 which is installed onto a stopping piece 31 formed on a part of the table and a wire rope 31 which is to be connected to the spring and has a hook 34 on its tip. The grille 37 is maintained with contraction energy of the spring 29 by connecting the hook 34 to its eyebolt 36. 
     COPYRIGHT: (C)1981,JPO&Japio
Patent JP-S5772744-A (JP)
Title: Production of embossed deck plate
Inventor: AKAHORI AKIO
IPC: B21H8/00
Filed: 1980-10-23
Abstract: PURPOSE: To prevent the slack of a material plate and to produce a good titled plate by passing the material plate through rolls to subject the same successively to embossing of the slopes of a central crest, forming of the central crest, and embossing and forming of the slopes of the right and left crests of the central crest, and maintaining the material speed by each roll constant.  
     CONSTITUTION: The leading end part of a material 2 is fed into the 1st embossing rolls 6 embossing the slopes of a central crest, so that it is screwed down and embossed by rugged patterns 6b, 6a from above and below, thence the leading end part is fed to the next central crest forming rolls 7. In the rolls 7, a central crest 11 is formed with an upper roll 7a and a lower roll 7b by avoiding the embossed patterns 13 formed by the rolls 6, after which the leading end part of the material 2 is fed into the 2nd embossing rolls 8 working the embossed patterns 14 on the slopes of the crests 12, 12 on the right and left of the central crest. The leading end part of the material 2 embossed in the slope positions of the right and left crests with the rolls 8 is fed to the 2nd forming rolls 9 for forming right and left crests, by which the right and left crests are formed; thereafter, the material is cut to prescribed length with a cutter 10, whereby it is made into products. 
     COPYRIGHT: (C)1982,JPO&Japio
Patent JP-S6211040-A (JP)
Inventor: ITO TETSUO
IPC: A01K93/00
Filed: 1985-07-06
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H022637-A (JP)
Title: Field effect transistor
Inventor: NODA MINORU
IPC: H01L29/80
Filed: 1988-06-15
Abstract: PURPOSE:To obtain an FET structure which decreases to the utmost a leakage current at places other than channel parts by providing a carrier conductive material layer directly below channel layers in such a way that its layer has polarity which is oppo site to that of an insulating material layer or of the channel layer where its band gap is larger than that of the semiconductor of a substrate. CONSTITUTION:This device is equipped with: a semi-insulating semiconductor substrate 1; a carrier conductive material layer 2' which is formed on the substrate 1 and has polarity in such a way that it is opposite to that of an insulating material layer or a channel layer where its band gap is larger than that of the semiconductor of the substrate 1; the channel layer 3 which is formed on the foregoing layer 2' and has a relatively high concentration; and the channel layer 4 which is formed on the layer 3 and has a relatively low concentration. For example, the mixed crystal layer 2' of AlGaAs, AlGaAsP and the like that has a band gap which is larger than that of a channel crystal and may form the channel layer continuously on the layer 2' is provided. Further, an n-type doped GaAs channel layer 3 having a relatively high concentration and an n-type doped GaAs channel layer 4 having a relatively low concentration are formed on the layer 2' and then, a gate electrode made of Ti-Au and the like is provided on the channel layers 3 and 4.
Patent JP-S5772147-A (JP)
Title: Method and device for development
Inventor: ITOU KAZUO
IPC: G03F7/039
Filed: 1980-10-22
Abstract: PURPOSE:To detect the secular change of a developing soln. accurately, and perform pattern formation on a photoresist layer with good accuracy by detecting the change in the fluorescence emission intensity of the developing soln. and controlling the development time. CONSTITUTION:A branch pipe 43 is provided between a circulating pump 23 and a filter 24 for the developing soln., and a flow cell 41 and a spectrophotofluorometer 40 are connected thereto. With this constitution, the developing soln. passes through the cell 41, and is excited by the meter 40 to emit fluorescence. The intensity of the fluorescence is read with an indicator 42, and the developing time for substrates to be developed is controlled by a motor 34 of variable speeds. Thereby, the secular change of the developing soln. is detected accurately by the change in the luminous intensity of the fluorescence and the pattern formation on the photoresist layer exposed under the same exposure conditions is accomplished with good accuracy.
Patent JP-H0722362-A (JP)
Title: Grinding of semiconductor substrate
Inventor: KURISU CHIYAN YUU
IPC: B24B37/26
Filed: 1994-06-08
Abstract: PURPOSE: To avoid rounding or bending the corners by polishing a semiconductor substrate for raising the planar treating efficiency, using a polishing pad having a large mean protrusion diameter, low standard deviation in the protrusion heights and low square means surface roughness. CONSTITUTION: Regions 621 correspond to polishing regions of a polishing pad 61. The polishing regions are part of the pad, where a semiconductor substrate is exposed during polishing. They are deformed to make the protrusions flat and lower the square mean surface roughness. Making them flatter means lowering the protrusion heights at large protrusion diameters. Each region 621 of an improved polishing pad 62 has protrusions and mean protrusion diameter of at least 40 microns and a standard deviation of the protrusion heights is 30 microns or less and square mean surface roughness of 30 microns or less.
Patent JP-H09329305-A (JP)
Title: Combustion apparatus
Inventor: YOTSUYA NORIO
IPC: F23D11/40
Filed: 1996-06-11
Abstract: PROBLEM TO BE SOLVED: To shorten a heating-up time interval of an evaporator for evaporating a liquid fuel, reduce power consumption, and make its construction compact. SOLUTION: The present combustion apparatus is adapted such that there are provided and communicated with each other an evaporator 10, a mixing chamber 16, and a flame hole part 17, and there are provided a plurality of independent evaporation surface heaters, a heater 21, and a temperature detector 22, and further a power supply part 23 for controlling the operation of the evaporation surface heater 20 and the heater 21. Accordingly, since the evaporator 10 is heated from each part, uniform and rapid heating is ensured, and hence a heating-up time interval of the evaporator 10 is reduced, the evaporator 10 is made compact owing to the expansion of an effective part in the evaporator 10, and power consumption of the evaporation surface heater 20 and the heater 21 is reduced.
Patent JP-H10340927-A (JP)
Title: Manufacture of semiconductor device and bonding device
Inventor: NAGAO KOICHI
IPC: H01L21/60
Filed: 1997-06-06
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device and a bonding device, which can avoid connection failures caused by the warpage of a semiconductor chip and a circuit board to realize a semiconductor device having high reliability. SOLUTION: After starting pressurization on a semiconductor chip 1 and a circuit board 3 by means of a bonding tool 2, a resin on the side surface of the semiconductor chip 1 is subjected to ultraviolet irradiation. Then, the semiconductor chip 1 and the circuit board 3 are heated to thermally cure the resin. After the semiconductor chip 1, the circuit board 3 and a resin 9 returned to normal temperatures, the pressurization is removed, and the resin is cooled sufficiently so as to maintain the condition where the warpage of the semiconductor chip 1 is corrected, thus eliminating the occurrence of connection failures between a bump and a connection electrode.