baber/WOPTO huggingface dataset:
Patent TW-I689461-B (TW)
Inventor: SOUNDARA PANDIAN MOHANRAJ
IPC: B81B7/00
Filed: 2018-08-31
Granted: 2020-04-01
Abstract: 本公開描述了一種單石積體裝置，其包括作為該裝置的基部的基板層(101)；介電隔層(102)，設置於基板層(101)的頂部，並位於保護層(103)的下方；電子線路，形成在介質電隔層(102)內，並由基板層(101)支撐，電子線路包括由一個或多個間隔開的金屬(204)形成的多個金屬層；以及至少一個微機械超音波換能器。 每個微機械超音波換能器包括底部電極(301)，其設置在保護層(103)的頂部並連接到電子線路； 壓電體(302)設置在底部電極(301)的頂部；頂部電極(303)設置在壓電體的頂部；彈性層(304)位於頂部電極(303)的頂部。 在底部電極(301)下方形成有空腔(306)，其從保護層(103)延伸到介電隔層(102)的一部分。
Patent TW-I798263-B (TW)
Title: Method for producing a mirror as an optical component for an optical system of a projection exposure apparatus for projection lithography
Inventor: HEMBACHER STEFAN
IPC: G02B27/18
Filed: 2018-09-14
Granted: 2023-04-11
Abstract: When producing a mirror (M10) as an optical component for an optical system of a projection exposure apparatus for projection lithography, first, an average value of a global gravitational acceleration is determined. Next, a gravitational acceleration difference between the gravitational acceleration at the production location and the gravitational acceleration average value is determined. After a determination of a target surface shape of a reflection surface of the mirror, a mirror substrate is machined at the production location taking into consideration the gravitational acceleration difference in a manner such that, under the influence of the gravitational acceleration average value, a current surface shape of the reflection surface of the mirror substrate does not deviate from the target surface shape by more than a prescribed figure tolerance value (P max ). The result is an optical element with the smallest possible figure at a use location of the mirror.
Patent TW-I757554-B (TW)
Title: Semiconductor device package
Inventor: HUNG CHIH-PIN
IPC: H01L23/367
Filed: 2018-10-09
Granted: 2022-03-11
Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a heat dissipation lid and thermal isolation. The substrate has a surface. The first electronic component and the second electronic component are over the surface of the substrate and arranged along a direction substantially parallel to the surface. The first electronic component and the second electronic component are separated by a space therebetween. The heat dissipation lid is over the first electronic component and the second electronic component. The heat dissipation lid includes one or more apertures at least over the space between the first electronic component and the second electronic component. The thermal isolation is in the one or more apertures of the heat dissipation lid.
Patent TW-I677650-B (TW)
Inventor: CHEN MING TSUNG
IPC: G05D23/32
Filed: 2018-10-11
Granted: 2019-11-21
Abstract: 本發明提供了一種室內溫度控制系統包括一伺服器、一第一溫度感測器、一第二溫度感測器、以及一第三溫度感測器。伺服器根據第一溫度感測器的第一溫度值，獲得一第一熱能調整量，伺服器根據第二溫度感測器的第二溫度值，獲得一第二熱能調整量。伺服器根據第三溫度感測器的第三溫度值，獲得預定區域的一預定熱能量。伺服器根據第一熱能調整量、第二熱能調整量、以及預定熱能量，取得一熱能流動模擬圖。伺服器根據一目標溫度、所述第二溫度值、以及熱能流動模擬圖，決定空調裝置的一操作時間。
Patent TW-I778166-B (TW)
Title: 彎曲成形模具
Inventor: LAN GUANG PING
IPC: B29C49/48
Filed: 2018-11-02
Granted: 2022-09-21
Abstract: 本發明提供一種彎曲成形模具，其構成簡單，且可迅速並確實地於XYZ之三維方向對棒狀體進行彎曲加工。
 
     彎曲成形模具係具備有：XY平面成形模具10、20，其係於X方向被合模且進行棒狀體之於XY平面上之彎曲加工；及Z方向成形模具30、40，其係於Z方向被合模且進行棒狀體之Z方向之彎曲加工，當上述兩成形模具被合模時於其等之間區劃成有空腔，該空腔係對朝XYZ之三維方向被進行彎曲加工的棒狀體進行成形。
Patent TW-I781259-B (TW)
Title: 用於裝置相關疊加度量之系統及方法
Inventor: LASKE FRANK
IPC: G03F7/20
Filed: 2018-12-04
Granted: 2022-10-21
Abstract: 一種疊加度量系統可量測一樣本上之一疊加目標之一第一層上之一裝置特徵圖案與一參考特徵圖案之間的一第一層圖案放置距離。該系統可進一步繼製造至少包含該裝置特徵圖案及該參考特徵圖案之一第二層之後量測該第二層上之該裝置特徵圖案與該參考特徵圖案之間的一第二層圖案放置距離。該系統可進一步基於該第一層及該第二層上之該參考特徵圖案的相對位置量測一參考疊加。該系統可進一步藉由用該第一層圖案放置距離與該第二層圖案放置距離之間之一差調整該參考疊加而判定該裝置級特徵圖案之一裝置相關疊加。
Patent TW-I684111-B (TW)
Inventor: SINIVAARA HASSE
IPC: G06T15/08
Filed: 2018-12-12
Granted: 2020-02-01
Abstract: An electronic arrangement for facilitating circuit layout design in connection with three-dimensional (3D) target designs, the arrangement including at least one communication interface for transferring data, at least one processor for processing instructions and other data, and a memory for storing the instructions and other data. The at least one processor being configured, in accordance with the stored instructions, to cause: obtaining and storing information in a data repository hosted by the memory, receiving design input characterizing 3D target design to be produced from a substrate, determining a mapping between locations of the 3D target design and the substrate, and establishing and providing digital output comprising human and/or machine readable instructions indicative of the mapping to a receiving entity, such as a manufacturing equipment, e.g. printing, electronics assembly and/or forming equipment.
Patent TW-I773861-B (TW)
Inventor: OCHIAI KOJI
IPC: A01K89/01
Filed: 2018-12-19
Granted: 2022-08-11
Abstract: [課題] 提供可防止聲響的導線滾子。
[技術內容] 第1O形環(151)及第2O形環(155)，皆是橡膠等的彈性體的環。第1O形環(151)，是嵌入溝(141AA)，比圓筒部(141A)的外周面更朝外周側突出，與導引構件(160)的內周面彈性接觸。第2O形環(155)，是嵌入溝(145AA)，比圓筒部(145A)的外周面更朝外周側突出，與導引構件(160)的內周面彈性接觸。第1O形環(151)及第2O形環(155)，是藉由彈性變形，將導引構件(160)的內周面推壓(推迫)。第1O形環(151)及第2O形環(155)，是將導引構件(160)支撐。第1O形環(151)及第2O形環(155)，因為是與導引構件(160)彈性接觸，所以可藉由摩擦，來限制導引構件(160)對於軸套(140)旋轉。
Patent TW-I697730-B (TW)
Inventor: HUANG CHUN-YAO
IPC: G03B43/00
Filed: 2018-12-21
Granted: 2020-07-01
Abstract: 一種相機模組測試治具，包括一座體以及一治具塊模組，其中所述治具塊模組包括相互獨立的一第一治具塊、一第二治具塊及一第三治具塊，所述第一治具塊、所述第二治具塊及所述第三治具塊可拆卸地固定於所述座體上；所述第一治具塊、所述第二治具塊以及所述第三治具塊分別用於收容鏡頭元件、軟板以及連接元件。本發明當待測試的相機模組進行外型改變的時候，可以視情況更改所述治具塊模組的某一單一治具塊，而不用整個報廢。
Patent TW-I678496-B (TW)
Inventor: TANG TE-LUNG
IPC: F21S41/36
Filed: 2018-12-28
Granted: 2019-12-01
Abstract: 一種導光透鏡，具有底面、出光面、第一反射面以及反射結構。底面具有彼此相對的第一側邊與第二側邊以及入光部。出光面連接於第一側邊。第一反射面相對於底面的局部且連接於出光面，且入光部位於第一反射面往底面垂直投影的投影區域內。反射結構包括多個反射面連接於第二側邊與第一反射面之間。一種包括上述導光透鏡的交通工具頭燈亦被提出。
Patent TW-I705281-B (TW)
Inventor: CHEN KUAN-YU
IPC: G02F1/01
Filed: 2019-04-08
Granted: 2020-09-21
Abstract: A front-lit display includes a light source, a coupling lens, a first and a second polarizers, a light guide plate, and a reflective display panel. The light guide plate has a first surface, a second surface, a side surface connecting the first and second surfaces, and light guiding microstructures located between the first and second surfaces. The first polarizer, the coupling lens, and the light source are sequentially disposed at a side of the side surface. Light emitting elements of the light source that emit light beams of different colors are arranged along a first direction instead of a second direction. The first direction is parallel to the side surface and the first surface, and the second direction is parallel to the side surface and perpendicular to the first surface. The coupling lens includes vertical columnar structures arranged along the first direction and respectively extending along the second direction.
Patent TW-I693461-B (TW)
Inventor: CHIU CHI WEI
IPC: G03B13/36
Filed: 2019-04-26
Granted: 2020-05-11
Abstract: 一種鏡頭自動對焦驅動裝置至少包括一固定環，其設置於基一座之一上表面；複數個限位元件，其分別立設於固定環；一鏡筒，其設置於基座之上，並實質位於該些限位元件之間，且鏡筒之一外側面具有複數個凸部及凹部，其中之一凹部係與對應的限位元件構成一設置空間；一致動器，其設置於基座之上表面，並且具有二組電極端子對以及二組對向設置的形狀記憶合金線，其中各形狀記憶合金線的中段係接觸於鏡筒之一對應的凸部，而其兩端係分別連結於各組電極端子對之電極；複數組滾珠，其位於對應之設置空間中，並且分別與限位元件及凹部的表面接觸。
Patent TW-I700414-B (TW)
Inventor: Liang ming-hua
IPC: E04C2/26
Filed: 2019-05-29
Granted: 2020-08-01
Abstract: 一種防火建築隔板結構，係包括一基板及一防火層，該基板具有一上側面及一下側面，該防火層具有一外表面及一內表面，該內表面對應與所述上側面相貼附結合，該防火層係由氯化錳、聚磷酸銨、聚醋酸乙烯、矽酸鈣及氯化鈣混合而成，藉由該防火建築隔板結構設計而得以大幅增加耐高溫及隔熱性之效果外，還可大幅延長防火時效。
Patent TW-I706947-B (TW)
Title: 含有葡萄糖激酶啟動劑和k-atp通道阻斷劑的藥物組合及其製備方法和用途
Inventor: CHEN LI
IPC: C07D403/12
Filed: 2019-05-31
Granted: 2020-10-11
Abstract: 本發明涉及一種藥物組合，所述藥物組合包含葡萄糖激酶啟動劑或其可藥用鹽、其同位素標記物、其結晶形式、水合物、溶劑合物、非對映異構體或對映異構體形式和K-ATP通道阻斷劑。本發明進一步涉及藥物組合物、固定劑量複方製劑，以及所述藥物組合物和所述固定劑量複方製劑的製備方法及其用途。
Patent TW-I739117-B (TW)
Inventor: WU CHUN-YIH
IPC: G06F3/033
Filed: 2019-06-19
Granted: 2021-09-11
Abstract: 本發明提供一種通訊系統、頭戴式顯示器及其切換傳輸模式的方法。所述方法包括：基於定位技術取得頭戴式顯示器當下的第一地理資訊；將第一地理資訊透過存取點轉傳至基地台；反應於頭戴式顯示器從第一地理資訊改變為一第二地理資訊，依據來自基地台的控制訊號而切換為特定傳輸模式。
Patent TW-I710852-B (TW)
Inventor: NIJE JELLE
IPC: G03F1/70
Filed: 2018-03-09
Granted: 2020-11-21
Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method comprising: (a) receiving object data 210, 230 representing one or more parameters measured 206, 208 across wafers 204, 224 and associated with different stages of processing of the wafers; (b) determining fingerprints 214, 234 of variation of the object data across the wafers, the fingerprints being 
associated with different respective stages of processing of the wafers. The fingerprints may be determined by decomposing 212, 232 the object data into components using principal component analysis for each different respective stage; (c) analyzing 246 commonality of the fingerprints through the different stages to produce commonality results; and (d) optimizing 250-258 an apparatus for processing 262 product units based on the commonality results.
Patent TW-I717786-B (TW)
Inventor: HSIEH HUNG-CHIEN
IPC: G02B15/14
Filed: 2019-07-19
Granted: 2021-02-01
Abstract: 一種光學成像鏡頭，從物側至像側沿光軸依序包含第一透鏡、第二透鏡、第三透鏡以及第四透鏡，各透鏡分別具有物側面以及像側面。第一透鏡的像側面的光軸區域為凸面、第四透鏡的像側面的光軸區域為凹面、HFOV為光學成像鏡頭的半視場角、TTL為第一透鏡的物側面到成像面在光軸上的距離，而滿足條件式：HFOV/TTL≦1.500˚/mm。
Patent TW-I714232-B (TW)
Title: Projection optical unit for imaging an object field into an image field, and projection exposure apparatus comprising such a projection optical unit
Inventor: SCHWAB MARKUS
IPC: G03F7/20
Filed: 2014-07-28
Granted: 2020-12-21
Abstract: A projection optical unit (7) serves for imaging an object field (4) in an image field (8). A plurality of mirrors (M1 to M8) serves for guiding imaging light (3) from the object field (4) to the image field (8). At least two of the mirrors (M1 to M8) are embodied as mirrors (M2, M3; M5, M6), arranged directly behind one another in the beam path of the imaging light (3), for grazing incidence with an angle of incidence of the imaging light (3) which is greater than 60°. This results in an imaging optical unit with a well-corrected imageable field with, at the same time, a high imaging light throughput.
Patent TW-I802744-B (TW)
Title: 薄片狀導電構件
Inventor: ITO MASAHARU
IPC: H01B5/00
Filed: 2019-08-28
Granted: 2023-05-21
Abstract: 一種薄片狀導電構件(10)，其係具有複數導電性線狀體(22)空出間隔排列成之擬薄片構造體(20)之薄片狀導電構件(10)，薄片狀導電構件(10)具有伸縮性，導電性線狀體(22)之最小間隔為50μm以上。
Patent TW-I791903-B (TW)
Title: 積體電路及其形成方法
Inventor: PENG TAI-YEN
IPC: H01L21/027
Filed: 2019-10-01
Granted: 2023-02-11
Abstract: 一種積體電路之形成方法，包含：形成磁性穿隧接合面堆疊層、沉積導電蝕刻停止層於磁性穿隧接合面堆疊層之上、沉積導電硬遮罩於導電蝕刻停止層之上、以及圖案化導電硬遮罩以形成複數個蝕刻遮罩。藉由導電蝕刻停止層停止圖案化導電硬遮罩的步驟。此形成方法更包含使用蝕刻遮罩蝕刻導電蝕刻停止層以定義複數個圖案，以及蝕刻磁性穿隧接合面堆疊層以形成複數個磁性穿隧接合面堆疊。
Patent TW-I704829-B (TW)
Inventor: GUEY JIANN-CHING
IPC: H04W28/06
Filed: 2019-10-16
Granted: 2020-09-11
Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and UE are provided. The UE receive a configuration from a base station, the configuration indicating one or more constraints for constructing and transmitting a multiple-access signature. The UE then constructs the multiple-access signature in accordance with the one or more constraints. The UE autonomously transmits the multiple-access signature to the base station in accordance with the one or more constraints.
Patent TW-I734218-B (TW)
Title: 無線訊號電子鎖之保密解鎖方法
Inventor: LIN JAO CHING
IPC: E05B47/00
Filed: 2019-10-16
Granted: 2021-07-21
Abstract: 一種無線訊號電子鎖之保密解鎖方法，該電子鎖儲存一組以上的鑰匙並接收由一開鎖裝置無線傳輸的開鎖數據串，該開鎖數據串包括依據一演算邏輯分為一段以上的開鎖鑰匙的資訊以及動態隨機插入該開鎖數據串的亂碼，該電子鎖由本身或該開鎖數據串讀取該演算邏輯，依據該演算邏輯在該開鎖數據串取出該開鎖鑰匙的數據得出一開鎖鑰匙，將該開鎖鑰匙與電子鎖儲存的一組以上的鑰匙比對，若相符則該電子鎖開門；本發明藉由在該開鎖數據串中隨機插入亂碼的方式，使第三人側錄封包也無法直接得到正確的開鎖鑰匙，達到開鎖時無線通訊保密的效果。
Patent TW-I715285-B (TW)
Title: Immunogenic compositions comprising conjugated capsular saccharide antigens and uses thereof
Inventor: COOPER DAVID
IPC: A61K39/116
Filed: 2015-01-20
Granted: 2021-01-01
Abstract: The present invention relates to new immunogenic compositions comprising conjugated Streptococcus pneumoniae capsular saccharide antigens (glycoconjugates) and uses thereof. Immunogenic compositions of the present invention will typically comprise at least one glycoconjugate from a S. pneumoniae serotype not found in Prevnar, Synflorix and/or Prevnar 13. The invention also relates to vaccination of human subjects, in particular infants and elderly, against pneumoccocal infections using said novel immunogenic compositions.
Patent TW-I726484-B (TW)
Title: Mutant yeast and method for producing protein using the same
Inventor: MORITA TOMOTAKE
IPC: C12N1/19
Filed: 2019-11-13
Granted: 2021-05-01
Abstract: An object of the present invention is to find out a peptidase or a protease involved in degradation of cutinase-like enzymes, and efficiently produce a cutinase-like enzyme by suppressing the activity of the peptidase or the protease. 
 
     The present invention provides a yeast in which the activity of at least one peptidase or protease involved in the degradation of PaE is suppressed by introducing a mutation into the gene of the peptidase or protease.
Patent TW-I812823-B (TW)
Title: Antimicrobial polymer compositions, fibers, and yarns
Inventor: OSBORN SCOTT E
IPC: A01N25/10
Filed: 2019-12-18
Granted: 2023-08-21
Abstract: The present disclosure relates the polymer compositions, fibers, and yarns having near-permanent antimicrobial activity, and a method of producing the same. In one embodiment, the antimicrobial polymer composition from 50 wt% to 99.9 wt% of a polymer, from 5 wppm to 1000 wppm of zinc, and from 0.005 wt% to 1 wt% of phosphorus, wherein fibers formed from the polymer composition demonstrate a zinc retention rate of greater than 20% when tested in a dye bath test.
Patent TW-I704091-B (TW)
Inventor: CHEN NIEN-CHIU
IPC: B65D43/00
Filed: 2020-01-10
Granted: 2020-09-11
Abstract: The invention provides a device with temperature difference driving the fluid to flow in the landscape globe, which comprises a main body and a chamber. The main body forms a space, and the space is provided with fluid and decoration pieces. A first thermally conductive sheet is disposed between the chamber and the space. A second thermally conductive sheet is disposed in the chamber. The generator is a semiconductor temperature difference power generation chip, and the two sides of the generator are abutted against the first thermally conductive sheet and the second thermally conductive sheet. The generator generates electric current through the temperature difference, so that the fluid leads the decoration pieces to flow in the space.
        The electric current is generated by temperature difference, and the driver drives the fluid and then causes the decoration pieces to flow in the space, forming a dynamic visual effect.
Patent TW-I734365-B (TW)
Title: Control methods and controllers for tintable windows
Inventor: BROWN STEPHEN C
IPC: G02F1/1524
Filed: 2015-05-08
Granted: 2021-07-21
Abstract: A method of controlling tint of a tintable window to account for occupant comfort in a room of a building. The tintable window is between the interior and exterior of the building. The method predicts a tint level for the tintable window at a future time based on a penetration depth of direct sunlight through the tintable window into the room at the future time and space type in the room. The method also provides instructions over a network to transition tint of the tintable window to the tint level.
Patent TW-I749459-B (TW)
Title: 吊扇控制系統
Inventor: LIN KUO TSUN
IPC: H02P4/00
Filed: 2020-02-05
Granted: 2021-12-11
Abstract: 一種吊扇控制系統，包含一調光模組、一電力模組、一無線接收模組、一操作模組，及一控制模組，該無線接收模組用於接收一無線控制訊號，該操作模組可受操作而產生一操作訊號，該控制模組包括一電連接該調光模組、該電力模組、該無線接收模組及該操作模組的處理器，該處理器能於一無線控制模式及一有線控制模式之間切換，該處理器啟動後的一控制時間內，當該處理器於該無線控制模式時，該處理器於接收該操作訊號後，切換至該有線控制模式，該處理器啟動後的該控制時間內，當該處理器於該有線控制模式時，該處理器於接收該無線控制訊號後，切換至該無線控制模式，進而方便一使用者使用。
Patent TW-I730672-B (TW)
Title: Circuit board fixing structure
Inventor: FU YUNG-TENG
IPC: H05K3/32
Filed: 2020-03-13
Granted: 2021-06-11
Abstract: A circuit board fixing structure comprising a first fixing element and a first circuit board is provided. The first fixing element includes a shaft, a first flange and a second flange. The first flange is connected with a side surface of the shaft. The second flange is connected with the side surface of the shaft and is spaced apart from the first flange. A height of the second flange relative to the side surface of the shaft is greater than a height of the first flange relative to the side surface of the shaft. The circuit board is fixed on a surface of the first flange away from the second flange, and forms a surface mounted structure with the first fixing element.
Patent TW-I744825-B (TW)
Title: Chip embedded substrate structure, chip package structure and methods of manufacture thereof
Inventor: CHOU SHIH-WEN
IPC: H01L23/29
Filed: 2020-03-18
Granted: 2021-11-01
Abstract: A chip embedded substrate structure includes an encapsulant, a plurality of first pads and a plurality of second pads, a chip, a plurality of conductive connecting members and a redistribution layer. The encapsulant has a first surface and a second surface opposite to the first surface. The first pads and the second pads are embedded in the encapsulant and exposed on the first surface. The chip is embedded in the encapsulant and is connected to the first pads with an active surface. The conductive connecting members are embedded in the encapsulant and is located on the second pads. The second surface exposes the top surfaces of the conductive connecting members. The redistribution layer is located on the second surface and is connected to the top surfaces of the conductive connecting members. A manufacturing method of the chip embedded substrate structure, a chip package structure and a manufacturing method of the chip package structure are also provided.
Patent TW-I725796-B (TW)
Title: Mixed silver powder and conductive paste comprising same
Inventor: YOON CHI HO
IPC: H01L31/0224
Filed: 2020-03-27
Granted: 2021-04-21
Abstract: The present invention relates to mixed silver powders and a conductive paste comprising the same. Two or more types of spherical silver powders having different characteristics are mixed, whereby it is possible to improve the characteristics of the product while the disadvantages of each type of powders are minimized and the advantages thereof are maximized. In addition, according to the present invention, the particle size distribution of the mixed silver powders and the particle size and the specific gravity of the primary particles are comprehensively controlled, so that it is possible to simultaneously achieve a highly densified conductor pattern, a precise line pattern, and suppression of coagulation over time.
Patent TW-I706235-B (TW)
Inventor: FLAGELLO DONIS G
IPC: H01L21/31
Filed: 2017-06-03
Granted: 2020-10-01
Abstract: Extreme ultra-violet (EUV) lithography ruling engine specifically configured to print one-dimensional lines on a target workpiece includes source of EUV radiation; a pattern-source defining 1D pattern; an illumination unit (IU) configured to irradiate the pattern-source; and projection optics (PO) configured to optically image, with a reduction factor N＞1, the 1D pattern on image surface that is optically-conjugate to the 1D pattern. Irradiation of the pattern-source can be on-axis or off-axis. While 1D pattern has first spatial frequency, its optical image has second spatial frequency that is at least twice the first spatial frequency. The pattern-source can be flat or curved. The IU may include a relay reflector. A PO's reflector may include multiple spatially-distinct reflecting elements aggregately forming such reflector. The engine is configured to not allow formation of optical image of any 2D pattern that has spatial resolution substantially equal to a pitch of the 1D pattern of the pattern-source.
Patent TW-I721867-B (TW)
Title: A high strength steel with excellent temper resistance
Inventor: CHEN CHIH YUAN
IPC: C21D8/02
Filed: 2020-04-20
Granted: 2021-03-11
Abstract: The present invention relates to a high strength steel, which comprises, based on a total weight of 100 wt%, carbon of 0.01-0.20 wt%, silicon of 1.0-2.0 wt%, manganese of 0.50-3.00 wt%, microalloying elements of 0.01-0.3 wt%, copper of 0.05-0.5 wt%, nitrogen of 0.0020-0.0150wt%, and remaining part of iron. The ratio of titanium to nitrogen is greater than 3.42. The microalloying elements can be selected from the following elements, titanium, vanadium, niobium, and 
molybdenum. The microstructure of the steel includes a ferrite (area ratio of 30% - 73%), martensite (25%-68%), and retained austenite. With the manufacturing process of the present invention, the microstructure is provided with lower hardness difference between soft ferrite and hard martensite, which can be used to avoid the microcrack formed between ferrite /martensite interface and enhanced the workability of steel.
Patent TW-I776164-B (TW)
Title: 半導體裝置及其製造方法
Inventor: HOMMA SOICHI
IPC: H01L23/28
Filed: 2020-06-02
Granted: 2022-09-01
Abstract: 本實施形態之半導體裝置係具備電性連接於設在絕緣基板的配線的焊墊。配線基板係具有設在焊墊間的第1絕緣材。第1半導體晶片係在與該配線基板相對向的第1面具有連接於配線基板的焊墊的金屬凸塊。第1接著層係設在第1絕緣材與第1半導體晶片之間，且將配線基板與第1半導體晶片接著。絕緣樹脂係在配線基板與第1半導體晶片之間，以覆蓋第1接著層及金屬凸塊的周圍與前述配線基板上的構造體的方式而設。
Patent TW-I768426-B (TW)
Title: New sample sets and new down-sampling schemes for linear component sample prediction
Inventor: LAROCHE GUILLAUME
IPC: H04N19/60
Filed: 2019-02-18
Granted: 2022-06-21
Abstract: The disclosure regards cross-component prediction and methods for deriving of a linear model for obtaining a first-component sample for a first-component block from an associated reconstructed second-component sample of a second-component block in the same frame, the method comprising determining the parameters of a linear equation representing a straight line passing through two points, each point being defined by two variables, the first variable corresponding to a second-component sample value, the second variable corresponding to a first-component sample value, based on reconstructed samples of both the first-component and the second-component; and deriving the linear model defined by the straight line parameters.
Patent TW-I722957-B (TW)
Title: Semiconductor device and method of manufacturing the same
Inventor: SHIH CHIANG-LIN
IPC: H01L23/535
Filed: 2020-08-18
Granted: 2021-03-21
Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor component, a re-routing layer, a bonding dielectric and an insulating layer. The re-routing layer is disposed over the semiconductor component and electrically coupled to the semiconductor component. The bonding dielectric is disposed over the semiconductor component to surround a top portion of the re-routing layer. The insulating layer is disposed between the semiconductor component and the bonding dielectric to surround a bottom portion of the re-routing layer.
Patent TW-I740622-B (TW)
Inventor: Chu Chien-Lun
IPC: H02P6/16
Filed: 2020-08-26
Granted: 2021-09-21
Abstract: 一種馬達控制器用以降低馬達噪音。該馬達控制器係用以驅動一馬達，其中該馬達具有一馬達線圈與一轉子。該轉子是由4個磁極區域N1、S1、N2、以及S2在進行相位切換。該4個磁極區域具有一製造公差且該磁極區域N1具有一時間區間T1。該馬達控制器具有一開關電路、一控制單元、一相位偵測單元、以及一電流偵測單元。該開關電路係用以供應一驅動電流至該馬達線圈。根據該製造公差與該時間區間T1，將偵測該驅動電流之時間點設成相位切換前提早一比例時間PT，其中PT/T1大於該製造公差。
Patent TW-I774080-B (TW)
Title: Keyless access control with neuro and neuro-mechanical fingerprints
Inventor: ZIZI MARTIN
IPC: G06F21/32
Filed: 2016-02-04
Granted: 2022-08-11
Abstract: In accordance with one embodiment, an access control system is disclosed. The access control system comprises an access control panel including a touchable surface, a multi-dimensional touch sensor under the touchable surface, and a processor coupled to the multi-dimensional touch sensor. The multi-dimensional touch sensor captures a multi-dimensional motion signal including a micro-motion signal component representing neuro-mechanical micro-motions of a user touching the multi-dimensional touch sensor. The processor performs signal processing of the multi-dimensional motion signal to obtain the micro-motion signal component; and extracts unique values of predetermined features from the micro-motion signal component to form a neuro-mechanical fingerprint or neuro-fingerprint (NFP) that uniquely identifies the user. The NFP can be used as a gatekeeper to control entry into homes, offices, buildings, or other real property typically protected by access control.