Patent SG-11201408833Y-A (SG)
Title: Chemical mechanical polishing composition comprising non-ionic surfactant and carbonate salt
Inventor: REICHARDT ROBERT
IPC: C09K3/14
Filed: 2013-06-21
Abstract: (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 9 January 2014 (09.01.2014) WIPOIPCT (10) International Publication Number WO 2014/006526 A3 (51) International Patent Classification: C09G1/02 (2006.01) COM 3/14 (2006.01) (21) International Application Number: (22) International Filing Date: (25) Filing Language: (26) Publication Language: PCT/IB2013/055102 21 June 2013 (21.06.2013) English English (30) Priority Data: 12175331.3 6 July 2012 (06.07.2012) EP (71) Applicant: BASF SE [DE/DE]; 67056 Ludwigshafen (DE). (71) Applicant (for CYonly): BASF SCHWEIZ AG [CH/CH]; Klybeckstrasse 141, 4057 Basel (CH). (71) Applicant (for MN only): BASF (CHINA) COMPANY LIMITED [CN/CN]; 300 Jiangxinsha Road, Shanghai, 200137 (CN). (72) Inventor: REICHARDT, Robert; T6 12, 68161 Man­ nheim (DE). (72) Inventor: LI, Yuzhuo (deceased). (72) Inventors: LAUTER, Michael; Gontardstrasse 6, 68163 Mannheim (DE). CHIU, Wei Lan William; 9F-11, No.55, Loyang St., Taipei City (TW). (74) Common Representative: BASF SE; 67056 Ludwig­ shafen (DE). (81) Designated States (unless otherwise indicated, for every kind of national protection available)'. AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available)'. ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3)) — before the expiration of the time limit for amending the claims and to be republished in the event of receipt of amendments (Rule 48.2(h)) — with information concerning refusal to authorize the recti­ fication of an obvious mistake under Rule 91.1 (Rule 91.3(d)) (88) Date of publication of the international search report: 27 February 2014 CJ o o o CJ O & (54) Title: CHEMICAL MECHANICAL POLISHING COMPOSITION COMPRISING NON-IONIC SURFACTANT AND CAR­ BONATE SALT (57) Abstract: A chemical mechanical polishing composition comprising: (A) Inorganic particles, organic particles, or a mixture or composite thereof, wherein the particles are cocoon-shaped, (B) non-ionic surfactant, a (C) a carbonate or hydrogen carbonate salt, (D) an alcohol, and (M) an aqueous medium. A process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of substrate used a in the semiconductor industry in the presence of a CMP composition and the use of CMP composition thereof are also provided.