baber/WOPTO huggingface dataset:
Patent TW-469159-B (TW)
Title: Air delivery device and method of filtering particles from moving airstream
Inventor: TANG YUAN-MING
IPC: F24F1/0073
Filed: 1999-07-17
Granted: 2001-12-21
Abstract: There is provided a filter device with a housing having an air delivery fan, preferably a fan having an axial air inlet and a radial air outlet. An axially rotating fan and filter unit is located between the air inlet and air outlet. The filter unit is comprised of at least one filter element with a front face and a back face. Adjacent filter element front and back faces are mutually spaced over at least a portion of their entire width and/or length such that air can pass unimpeded in an air channel formed between the adjacent front and back faces. Adjacent filter element front and back faces are preferably on different filter elements. Preferably, multiple filter elements are spaced in the radial direction around the axis of rotation and in the direction of rotation are mutually parallel. The fan and filter units are also provided with air moving means which can be air moving elements and/or air filter elements. The air moving elements are also preferably spaced in the radial direction around the axis of rotation and in the direction of rotation are mutually parallel. The optional air moving means establish the airflow with a general airflow direction at a given pressure head and volumetric flowrate. With the preferred centrifugal type radial fan the air is drawn in axially with the fan and filter unit axis of rotation and discharged radially outward. The air moving elements and/or filter elements are spaced from adjacent air moving elements and/or filter elements to allow the unimpeded passage of air between the air moving elements and/or filter elements.
Patent TW-424392-B (TW)
Title: Power supply for a deflection circuit operating at multi-scan frequencies
Inventor: FERNSLER RONALD EUGENE
IPC: G09G1/04
Filed: 1999-08-05
Granted: 2001-03-01
Abstract: A television apparatus has the capability of selectively displaying picture information obtained from a broadcast television signal and a display monitor data signal. A zero voltage switching switch mode power supply (100) generates a higher voltage B+ supply voltage, for a horizontal deflection circuit output stage (101), when the deflection circuit output stage operates at a rate greater than or equal to approximately 32 KHz. A series-pass regulator power supply (102) generates, at a common supply terminal (B+), a lower voltage B+ supply voltage, when the deflection circuit output stage operates at a lower rate equal to approximately 16KHz. During a start-up interval, the horizontal scanning output stage is supplied with the lower B+ supply voltage regardless of the scan frequency for reducing excessive stress in the horizontal output stage switching transistor to improve reliability.
Patent TW-428307-B (TW)
Title: Integrated inductive components and method of fabricating such components
Inventor: HARVEY IAN ROBERT
IPC: H01F17/00
Filed: 1999-09-29
Granted: 2001-04-01
Abstract: An inductive component includes a substrate on the surface of which is a lower insulation layer having a shallow concavity or trench, a first plurality of conductive elements formed in the trench, a magnetic core formed over the first plurality of conductive elements, and a second plurality of conductive elements formed over the core. The first and second pluralities of conductive elements are connected to each other so as to form an inductive coil around the core. First and second core insulation layers are disposed between the core and the first and second pluralities of conductive elements, respectively. The component is fabricated by a method in which it is built up in the trench using thin film techniques. A first array of conductors is patterned over the lower insulation layer, and a first core insulation layer is applied over the first conductor array. A magnetic core is formed on top of the first core insulation layer, and a second core insulation layer is applied over the core. A second array of conductors is patterned on top of the second core insulation layer so that the ends of the conductors in the first and second arrays contact each other to form an inductive coil around the core. The formation of either the first or second plurality of conductors may coincide with the formation of the metal conductor layer in the manufacture of a semiconductor integrated circuit, whereby the inductive component can by manufactured as part of the integrated circuit.
Patent TW-459284-B (TW)
Title: Semiconductor device manufacturing method to enhance the stability of photoresist
Inventor: TSAI CHING-LUNG
IPC: H01L21/027
Filed: 1999-08-30
Granted: 2001-10-11
Abstract: A manufacturing method of semiconductor device manufacturing method to enhance the stability of photoresist is disclosed by the present invention, which provides a processing method to have complete cross-linking of photoresist for enhancing the stability of photoresist. The present invention comprises providing a semiconductor substrate, forming devices on the semiconductor substrate. Next, form metal layer on the device, then form a photoresist layer on the metal layer, and the photoresist layer is for defining the multiple metal connections. Provide a light source for photoresist exposure in association with the etcher, which can irradiate deep UV light at the same time as etching, or which can switch between deep UV light exposure step and etching step, so that the surface has a completely cross-linked photoresist to strengthen the resistance of the photoresist to ion bombardment.
Patent TW-508704-B (TW)
Title: Semiconductor chip
Inventor: AMAKO JUN
IPC: H01L25/065
Filed: 1999-12-16
Granted: 2002-11-01
Abstract: The present invention relates to a semiconductor chip having a vertical current conduction structure of a high aspect ratio and high reliability, a semiconductor device, a circuit substrate, and an electronic apparatus each containing such semiconductor chips, and a method for producing them. A prehole (3) is formed in a silicon substrate (10) surface-oriented to a (100) face by laser beam irradiation. In addition, the prehole (3) is enlarged by anisotropic etching to thereby form a through-hole (4). An electrically insulating film is formed on an inner wall of the through-hole (4). An electrically conducting material is provided inside the insulating film to thereby form a metal bump (30).
Patent TW-513900-B (TW)
Title: Electronic component handler
Inventor: GARCIA DOUGLAS J
IPC: G01R31/01
Filed: 2000-01-15
Granted: 2002-12-11
Abstract: A high-speed handler for receiving a heap of randomly oriented parallel piped-shaped ceramic components, each component of the type having at least one set of metal termination located on opposite edges thereof, presenting them in individual seats in controlled orientation for electrical parametric testing, and sorting them according to their test results, comprising a rotating feed wheel, mounted on a central shaft and defined by an outer rim concentric will the axis of the central shaft, the wheel inclined to the horizontal and including an upper surface on which to receive a heap of randomly oriented ceramic components, a plurality of radially-pointing, spaced-apart bosses extending upward and outward on the upper wheel surface terminating at component-sized cavities formed in the wheel adjacent the outer rim an arranged to receive therein a single ceramic component in specific orientation, a rotating carrier plate mounted planar to and spaced-apart from the feed wheel having an upwardly extending circular peripheral wall arranged in tangential adjacency and synchronous peripheral velocity with the feed wheel, the peripheral wall having formed therein a plurality of test seat notches in spaced-apart arrangement and adjacent alignment with the cavities in the feed wheel, the notches of a size and shape to receive a ceramic component therein with it opposed terminals facing inward and outward from the wall, first vacuum pressure device to draw the ceramic component radially from the cavity into the test seat notch and a second vacuum pressure device to hold the component in the test seat notch during further rotation of the carrier plate, a device for testing including at least one roller assembly arranged to contact the terminals of the ceramic components as they are moved in the test seat notches on the carrier plate, and a device for separately ejecting the ceramic components from the test seat notches and transferring them to separate locations according to their test results.
Patent TW-469568-B (TW)
Title: Shallow trench isolation (STI) with bilayer of oxide-nitride for VLSI applications
Inventor: AGAHI FARID
IPC: H01L21/762
Filed: 2000-01-29
Granted: 2001-12-21
Abstract: A reduction in parasitic leakages of shallow trench isolation vias is disclosed wherein the distance between the silicon nitride liner and the active silicon sidewalls is increased by depositing an insulating oxide layer prior to deposition of the silicon nitride liner. Preferably, the insulating oxide layer comprises tetraethylorthosilicate. The method comprises of etching one or more shallow trench isolations into a semiconductor wafer; depositing an insulating oxide layer into the trench; growing a thermal oxide in the trench; and depositing a silicon nitride liner in the trench. The thermal oxide may be grown prior to or after deposition of the insulating oxide layer.
Patent TW-444362-B (TW)
Title: Method of producing semiconductor devices and metal mold for producing semiconductor devices
Inventor: KAWAHARA TOSHISANE
IPC: B29C43/18
Filed: 2000-02-18
Granted: 2001-07-01
Abstract: A method of producing semiconductor devices which have an excellent separability from a metal mold after resin encapsulation and thus eliminates the need to clean the metal mold. A metal mold for producing such semiconductor devices is also provided. According to the method of the present invention, the metal mold is first opened, and two separation sheets are disposed on dividing surfaces including cavity forming surfaces of a first metal mold and a second metal mold. A substrate is then placed on one of the separation sheets, with its semiconductor chip formed surface facing the second metal mold. An encapsulation resin is provided on the substrate placed on one of the separation sheets. The metal mold in a heated state is closed and pressed to form a resin layer for encapsulating electrodes formed on the substrate. The metal mold is again opened, and the resin-encapsulated substrate is taken out of the metal mold. After the separation sheets are removed, the substrate is divided into individual semiconductor devices.
Patent TW-464715-B (TW)
Title: Air-tight device in side press-contacting member of moving wall
Inventor: MUKAIDE TAKAHIDE
IPC: E04B1/66
Filed: 2000-02-23
Granted: 2001-11-21
Abstract: This invention aims to attain air-tightness to the wall surface by providing a partition part for dividing the space into two parts in a recessed part of a moving wall, and attaching a second plate-like seal to the side press-contacting member in the recessed part. A partition part 9 for partitioning a recessed space 7 of press-contacting member 1 into two parts is fitted to a side frame 8 of a moving wall 2. A first seal 10 is provided on the outside of the side press-contacting member 1 and a thin plate-like second seal 11 is largely bent and deformed on the inside thereof to be pressed to the surface 13 of the partition part 9 to provide air-tight and sound-insulating effect.
Patent TW-566039-B (TW)
Title: System for providing personalized services
Inventor: SINKE JOHANNES GORERT
IPC: H04N7/16
Filed: 2000-03-06
Granted: 2003-12-11
Abstract: The invention relates to a system for providing personalized services. The system comprises an apparatus which is capable of personalizing its behavior in accordance with a user profile, and a gatekeeper device which comprises control means for allowing a user to control said personalization of the apparatus. The gatekeeper device is capable of detecting apparatuses which have personalization capabilities and of notifying the user upon such detection. The user may then decide to establish a relationship with the apparatus, which relationship specifies the extent of personalization which the apparatus is allowed to exhibit and whether confirmation by the user is required at future occasions. The user is allowed to change the relationship at any time. The system according to the invention enables the user to build up anonymous relationships with various apparatuses, providing the user with personalized services while privacy is guaranteed.
Patent TW-457781-B (TW)
Title: Filter for digital to analog converters
Inventor: PFLAUMER MICHAEL W
IPC: H03H17/00
Filed: 2000-03-22
Granted: 2001-10-01
Abstract: An analog-to-digital converter responsive to an analog signal converts the analog signal to a digital signal. A digital decimation filter, having an associated frequency response, is responsive to the digital signal for producing a decimated digital signal. An alias correction filter attenuates the decimated digital signal to remove distortion. A digital interpolation filter, having an associated frequency response, is responsive to the alias-corrected signal for producing an interpolated digital signal which subsequently is converted to an analog signal by a digital-to-analog converter. The alias correction filter has a frequency response that attenuates the decimated digital signal in a frequency range generally corresponding to a distortion portion that is present within the combination of the digital decimation filter frequency response and the digital interpolation filter frequency response.
Patent TW-459452-B (TW)
Title: Weighted open loop power control in a time division duplex communication system
Inventor: ZEIRA ARIELA
IPC: H04B7/005
Filed: 2000-03-22
Granted: 2001-10-11
Abstract: The invention controls transmission power levels in a spread spectrum time division duplex communication station. A first communication station transmits a communication to a second communication station. The second station receives the communication and measures its received power level. Based on, in part, the received communication's power level and the communication's transmission power level, a path loss estimate is determined. A quality of the path loss estimate is also determined. The transmission power level for a communication from the second station to the first station is based on, in part, weighting the path loss estimate in response to the estimate's quality.
Patent TW-474100-B (TW)
Title: Packaged image sensor structure and method of packaging the same
Inventor: YANG SHIAN-JIE
IPC: H01L21/56
Filed: 2000-04-11
Granted: 2002-01-21
Abstract: An image sensor package structure is disclosed, which comprises: (1) an image sensor having a photo-receiving surface and a bottom surface, the photo-receiving surface comprises: (a) a photo-receiving region having plural photosensitive devices to receive light and convert it into electronic signal; (b) an adhesive agent formed around the photo-receiving region; and (c) plural bonding pads formed on the periphery of the adhesive agent; and (2) a glass cap covering the image sensor, which is a little larger than the region formed by the adhesive agent and the photo-receiving region, and the bonding pad is exposed, adhered to the adhesive agent to seal the photo-receiving region, thereby the packaging efficiency can be increased and the package structure dimension can be shrunken.
Patent TW-I231245-B (TW)
Title: Method of modifying a surface
Inventor: PENDERGRASS DANIEL BOONE JR
IPC: B24B37/24
Filed: 2000-05-30
Granted: 2005-04-21
Abstract: A method of modifying a surface comprising the steps of: (a) contacting the surface to be modified with a working surface of an abrasive article, the abrasive article comprising a phase separated polymer having a first phase and a second phase, the first phase being harder than the second phase; and (b) relatively moving the surface to be modified and the fixed abrasive article to remove material from the surface to be modified in the absence of an abrasive slurry.
Patent TW-469550-B (TW)
Title: Component and its production method
Inventor: RAMM JURGEN
IPC: H01L23/52
Filed: 2000-06-26
Granted: 2001-12-21
Abstract: Electronic component with a parts, which is composed of copper, and a 2nd metal-parts, which is connected with the 1st part through an inter-metallic connection, wherein in the surrounding-region of the connection the parts, which is composed of copper, has a hard-layer, which is stable at the temperature of at least 80 DEG C and forms an oxygen-diffusion-barrier at this temperature, at least similar to an aluminium-oxide layer on aluminium, which is formed on a normal-surrounding.
Patent TW-527397-B (TW)
Title: Polyester compositions of low residual aldehyde content
Inventor: ANDREWS STEPHEN MARK
IPC: C08L67/00
Filed: 2000-06-28
Granted: 2003-04-11
Abstract: A mixture of a polyester, such as poly(ethylene terephthaiate) PET, and a second polymer which is selected from the group consisting of poly(vinyl alcohol), ethylene/vinyl alcohol copolymer and a suitable polyhydric alcohol when extrusion compounded exhibits a lower residual acetaldehyde content than does PET alone when similarly treated. The invention pertains to any polyester used in the manufacture of bottles or containers which in turn are used to store consumer materials, especially food, beverages and most especially water.
Patent TW-457650-B (TW)
Title: Metal material for electronic parts, electronic parts, electronic apparatuses, and method of processing metal materials
Inventor: UENO TAKASHI
IPC: H01L23/532
Filed: 2000-07-11
Granted: 2001-10-01
Abstract: The present invention relates to a metal material for electronic parts, electronic parts, electronic apparatuses, a method of processing metal materials, and electro-optical parts. For example, the present invention is applied to liquid crystal display panels, various semiconductor devices, wiring boards, chip parts, and the like. The present invention proposes a metal material for electronic parts which is characterized by lower resistivity, higher stability, and more excellent processability than the prior art. The present invention also proposes electronic parts and electronic apparatuses which use this metal material. An applicable metal material is an alloy containing Ag as a main component, 0.1 to 3 wt% of Pd, and 0.1 to 3 wt% in total of elements such as Al.
Patent TW-524747-B (TW)
Title: A method and system for curing a curable sealant that is shadowed by metallization
Inventor: VON GUTFELD ROBERT J
IPC: B29C35/08
Filed: 2000-09-13
Granted: 2003-03-21
Abstract: The invention is a method for curing a sealant used to affix two substrates to one another. The sealant requires curing by heat or uv photons. To overcome the shadowing caused by metal patterns, the uv light is directed in a path towards said sealant, and a light diffusion element is positioned in the optical path. The diffusion element causes a diffusion of the optical radiation so as to enable some of the diffused optical radiation to avoid the metallization features and to be incident on the sealant. If the sealant is of the dual cure type, the curing thereof is further aided by application of heat.
Patent TW-477146-B (TW)
Title: Electronic device and method with communication transfer function
Inventor: JAN YUAN-CHAU
IPC: H04M11/10
Filed: 2000-09-20
Granted: 2002-02-21
Abstract: The invention provides an electronic device and a method with communication transferring function. The device is equipped with a microprocessor, in which there's a transfer program burned in the microprocessor to connect with a receiving circuit and a transmitting circuit. When the switch of a central office determines a preset transfer call, the incoming call is transferred to the receiving circuit without being received, thereby allowing the receiving circuit to receive the incoming call signal and transfer the same to the microprocessor for being processed. By means of the transmitting circuit, the microprocessor transmits a transferring voice signal to the calling telephone and inform the caller not to hang up the phone. Meanwhile the user of the incoming call is informed with a caller ID device by displaying the received call, so that the user inputs the code of communication device intended to be connect. After the microprocessor transmits the inputted code of user to the switch, the user can receive the incoming call from the designated communication device via the transfer of the switch.
Patent TW-I229081-B (TW)
Title: 2-phenyl-substituted imidazotriazinones
Inventor: NIEWOHNER ULRICH
IPC: A61P15/10
Filed: 1998-11-11
Granted: 2005-03-11
Abstract: The 2-phenyl-substituted imidazotriazinones having short, unbranched alkyl radicals in the 9-position are prepared from the corresponding 2-phenyl-imidazotriazinones by chlorosulphonation and subsequent reaction with the amines. The compounds inhibit cGMP-metabolizing phosphodiesterases and are suitable for use as active compounds in pharmaceuticals, for the treatment of cardiovascular and cerebrovascular disorders and/or disorders of the urogenital system, in particular for the treatment of erectile dysfunction.
Patent TW-461808-B (TW)
Title: Wrapping material for absorbent article
Inventor: TOYOSHIMA YASUO
IPC: B65D85/07
Filed: 2000-11-22
Granted: 2001-11-01
Abstract: The present invention relates to a wrapping material for absorbent article. In this packaging material to individually package the absorptive articles, the coefficient of static friction on at least one surface of the packaging material is ≥0.35, the coefficient of dynamic friction is ≥0.35, and the observed loading variation range when measuring the coefficient of dynamic friction is ≥50 cN.
Patent TW-496763-B (TW)
Title: Effluent abatement process and effluent abatement system for abating hydride species in a hydride-containing effluent
Inventor: FALLER REBECCA
IPC: B01D53/34
Filed: 2000-12-01
Granted: 2002-08-01
Abstract: An effluent abatement system for abating hydride species in a hydride-containing effluent, arranged for carrying out the steps of: (1) contacting the hydride-containing effluent with a dry scrubber material comprising a metal oxide that is reactive with the hydride species to remove the hydride species from the effluent, until the capacity of the dry scrubber material for hydride species is at least partially exhausted; and (2) contacting the at least partially exhausted capacity dry scrubber material with an oxidant to at least partially regain the capacity of the dry scrubber material for the hydride species. The system of the invention has particular utility in the treatment of effluent from III-V compound semiconductor manufacturing operations.
Patent TW-533454-B (TW)
Title: Method for improving ash rate uniformity in photoresist ashing process equipment
Inventor: HOGAN TIMOTHY J
IPC: H01L21/302
Filed: 2000-12-27
Granted: 2003-05-21
Abstract: A method for improving the edge-to-center photoresist ash rate uniformity in lower temperature (typically, but not limited to < 100 DEG C.) processing of integrated circuits and micro-electro-mechanical devices. A varying gap distance 32 from the edge-to-center of the upper and lower grid plates, 30 and 31, of a plasma ashing machine is provided to allow additional flow of plasma gases into the normally semi-stagnated area near the center of the wafer being processed. This improvement overcomes the problem of slower photoresist removal in the center of the wafer. Three configurations of the invention is described, including both stepwise and continuous variation of the grid plate gap spacing and optionally, the variation of the size of grid plate holes in a parallel grid plate assembly.