baber/WOPTO huggingface dataset:
Patent JP-H09328166-A (JP)
Title: Packaging body
Inventor: INOUE ISAO
IPC: B65D75/36
Filed: 1996-06-10
Abstract: PROBLEM TO BE SOLVED: To provide a packaging body which neither hurt fingers during unpacking nor hurt the inside of one's body even if one has swallowed it by mistake and which can be easily unpacked to take out tablets in the inside. SOLUTION: A packaging body 10 is provided with the bottom material 11 constituted of embossed parts 12 opening the upper end and containing tablets 15 and flanges 13 put on the upper end opening of the embossed parts 12. The bottom materials 11 are connected to a cover material 20 through the flanges 13. The bottom materials are separated from each other and independent and stuck to the cover material 20 through the flanges 13 of the bottom materials 11. The cover material 20 is made of a material which is easily breakable by an external force.
Patent JP-S5939022-A (JP)
Title: Manufacture of semiconductor single crystal thin film
Inventor: HIGUCHI KOUHEI
IPC: H01L21/86
Filed: 1982-08-27
Abstract: PURPOSE:To form a single crystal film with an excellent reproducibility, by a novel method wherein a semiconductor film is formed on an amorphous insulative layer and simultaneously single-crystallized by moving a substrate or a shielding plate. CONSTITUTION:An Si oxide film 22 and an Si nitride film 23 are formed on an Si substrate 21 and are selectively removed with the part thereof on a linear region left. A thermal oxide film 24 is formed on the substrate 21, and the films 23, 22 on the linear region are removed to expose a substrate surface 25. The whole surface is flattened to prepare a sample 31 with a flat surface. The sample 31 is mounted on a stage 32 which is movable in the directions A and B and can be heated. A shielding plate 33 provided with a slit, and a lamp heater 34 are placed above the sample 31. This is placed in an electron gun evaporation apparatus, in which the sample 31 is heated and the substrate 21 is moved while silicon is being vacuum-evaporated through the slit and while the surface silicon layer is being melted on heating by the heater 34. Thus, a single crystal silicon film can be formed on an amorphous insulating film with an excellent reproducibility.
Patent JP-S6125906-A (JP)
Title: Lubricating device for engine
Inventor: SHIBANO KENJI
IPC: F01M9/10
Filed: 1984-07-16
Abstract: PURPOSE:To reduce the friction in a tappet valve system and minimize the power loss by cooling the lube oil supplied to the said system to be kept at lower temperature than the preset level which is specified lower than the temperature of the lube oil supplied to the other lubricated portions of te engine main body. CONSTITUTION:In lubrication system A, the lube oil, sucked up by an oil pump 3 from an oil pan 2 having a cooling fan 1, is led through a filter 6 and a conduit 7 into the through hole 9 of a cam shaft 8 to be spouted out of oiling nozzles 12 of cams 11 to lubricate the sliding parts of rocker arms 13, cams 11, or the like. Meanwhile the lube oil temperature is controlled to be kept at a relatively lower level by an oil cooler 10, set on the way of the conduit 7, in order to get a high viscosity enough to prevent the slick from falling. On the other hand, in the lubrication system B, the lube oil, sucked up by an oil pump 15 from an oil pan 14, is left at a relatively higher temperature and supplied to the sliding parts of bearings 21, crank shafts 20, pistons 22, etc. with the viscosity kept low to allow fluid lubrication.
Patent JP-H10337356-A (JP)
Title: Circuit board for pachinko machine
Inventor: OSAWA HITOSHI
IPC: H05K3/22
Filed: 1997-06-05
Abstract: PROBLEM TO BE SOLVED: To enable a storage part on a circuit board for a pachinko machine to be easily and rapidly exchanged in a production process using a melted solder bath. SOLUTION: On the appropriate part for exchanging electric parts, which is a part of a board 36 on an electronic circuit board to be mounted on this pachinko machine for use, an exchangeable storage 38 is soldered, a range 50 to be soldered excluding electronic parts from the range on the periphery of the exchangeable memory 38 on the base 36, where soldering is disturbed, is set, only this memory part 38 is omitted to be soldered, it can be easy and rapid to exchange this memory part with another memory 38 and to solder it again. In this case, the other electronic parts excluding the memory 38 to be exchanged are reused, and it can be difficult to exchange this memory 38 in a hole placed to provide the pachinko machine as a game and so on because the storage 38 is soldered.
Patent JP-H1080711-A (JP)
Title: Rolling method by using roll stand equipment
Inventor: MUELLER HUBERT
IPC: B21B1/14
Filed: 1997-06-05
Abstract: PROBLEM TO BE SOLVED: To reduce a production cost by cutting a continuous rolled material drawn from a compacting rolling group in rolling a shape when a finish rolling time is longer than the time cycle of a continuous casting device and supplying to a cooling floor so as to adjust a time cycle to continuous casting and eliminate intermediate storing of a rough shape material. SOLUTION: A first finish continuous rolling material PSTI coming out from a compacting rolling group is transferred to a front face of a cooling floor KB by a guide roller gang R2 and stopped. By cutting the PSTI to a length of 1/2 into PSTI', in following to transferring to the cooling floor KB, a remaining PSTI'' is transferred in the same way. Successively, a continuous rolling material PSTII shown by a broken line is supplied on a roller gang R", this is cut after finish rolled and sent to the cooling floor KB. In the figure, UG1, UG2 show an universal stands, the compacting rolling group is arranged between these stands.
Patent JP-S5271927-A (JP)
Title: Decreasing seizure of vidicon
Inventor: OSA HIDEO
IPC: H04N3/16
Filed: 1975-12-11
Abstract: PURPOSE: The idle time before and after the character/picture signal transmission is utilized to carry out bright scanning, thereby preventing the seizure of the vidicon. 
     COPYRIGHT: (C)1977,JPO&Japio
Patent JP-H09307240-A (JP)
Title: Manufacture of multilayer wiring board
Inventor: HANAMURA KENICHIRO
IPC: H05K3/46
Filed: 1996-05-17
Abstract: PROBLEM TO BE SOLVED: To provide a multilayer wiring board having heat resisting property, moisture resisting property and close contact property without using a halogen as a non-flammable method and without generation of hydrogen bromide, which is poisonous gas, when a burning operation is conducted. SOLUTION: In the manufacturing method of a multilayer wiring board using a build-up method, a process in which a red phosphorus containing photosensitive resin composition is formed at least on one surface of an inner layer wiring board where a non-halogen containing resin composition is used, and a process in which a wiring pattern is formed on the layer insulating film by etching a conductive layer after formation of a conductive layer by non- electrolytic plating and electric plating, are repeated.
Patent JP-H0816410-A (JP)
Title: Unit and method for schedule control
Inventor: SUEMATSU KAZUYO
IPC: G06F9/48
Filed: 1994-06-29
Abstract: PURPOSE:To enable a parallel processing system to perform the execution of jobs using an optional number of processor elements, the setting of job priority corresponding to a system resource demand quantity, the execution of proper jobs corresponding to the set priority, the preferential processing of an emergent job, etc. CONSTITUTION:Jobs which wait to be executed and jobs which are being executed are managed by using plural job queues, and a queue to be assigned to and in-queue priority are set corresponding to a system resource demand quantity, a wait time, etc., of each job. The queue to be assigned to and in-queue priority are dynamically reviewed and the jobs are scheduled according to them. A nonpreferential job which is being executed is an object to be swapped out and a processor element which is swapped out is assigned so as to actuate a preferential execution job in a queue.
Patent JP-H10324181-A (JP)
Title: Mounting and demounting mechanism of seat for vehicle
Inventor: MIYASHITA HIDEYA
IPC: B60N2/90
Filed: 1997-05-23
Abstract: PROBLEM TO BE SOLVED: To increase the strength, to reduce the number of components, and to easily and rapidly perform the assembling work, without increasing the thickness of a lock bracket or a lock panel of a locking mechanism. SOLUTION: A locking mechanism 31 comprises a belt-shaped lock panel 32 of which the left and right both edges 32a, 32b are respectively mounted on the upper parts of a pair of left and right movable rails, slidably in the fore and aft direction, and the lock panel 32 comprises plural lock holes 33. Plural stopper members 9 mounted on a lower part of a seat body 7, are stopped by the plural lock holes 33. An operation part 35 is formed on an almost central front edge of the lock panel 32. The lock panel 32 is slided in the fore and aft direction by the drawing operation of the operation part 35, whereby the stopping condition of the lock holes 33 and the stopper members 9 of the lower part of the seat body 7, is released.
Patent JP-H06335870-A (JP)
Title: Jig for incorporating assembly parts
Inventor: NIIMI TOMOHITO
IPC: B25F3/00
Filed: 1993-05-26
Abstract: PURPOSE:To smoothly and surely carry out an incorporating operation by absorbing dispersion on the incorporation generated in an assembly consisting of a plurality of parts. CONSTITUTION:A supporting bed 13 is adapted to be attracted fixedly to a recess 12 in a base 11 by magnets 16, 17 and movably deviated according to the dispersion of an assembly so that errors of incorporation are absorbed. Since the supporting bed 13 is held by a holding shaft 20 connected to a hydraulic balancer circuit 18 provided in the base 11, the supporting bed 13 even in the position deviating operation thereof can be followed up. Further, since a switch valve 25 is interposed in the hydraulic balancer circuit 18 to fix the holding shaft 20 by shutting off an oil path 19, the supporting bed 13 is held under the locked condition in the incorporation operation.
Patent JP-H04126276-A (JP)
Title: Ink sheet cartridge and recorder on which the ink sheet cartridge can be loaded
Inventor: AWAI TAKASHI
IPC: B41J17/12
Filed: 1990-06-08
Abstract: PURPOSE:To change a drive speed from a recorder side to change a feed ratio of an ink sheet to a recording medium feed amount by a method wherein gears which transmit a force to an ink sheet so as to feed an ink sheet from a first winding member to a second winding member are replaced for changing the gear ratio thereof. CONSTITUTION:The tooth number of a large gear 101b of a cartridge A cannot be changed because it engages with a drive force transmitting gear 31 of a device body. However, the tooth number of a small gear 101a and that of a take-up reel gear 3c can be selected so that the addition thereof can be kept constant. In this manner, various n-tuple multi-ink sheets can be used by being loaded on a common container 4 of the cartridge A. Therefore, in accordance with a value (n) of an ink sheet incorporated in the cartridge, the gears are replaced for changing the gear ratio thereof. In this manner, a feed ratio of an ink sheet to a recording sheet feed amount can be changed. Namely, a feed speed of an ink sheet to a feed speed of a recording sheet can be changed.
Patent JP-S63311904-A (JP)
Inventor: KAKO AKIHARU
IPC: A43C15/02
Filed: 1987-06-15
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S5574523-A (JP)
Title: Electromagnetically driven aperture shutter
Inventor: HIROHATA MICHIROU
IPC: G03B9/24
Filed: 1978-12-01
Abstract: PURPOSE: To achieve less weight and less power by specifying the meterials of the members constituting shutter moving parts.  
     CONSTITUTION: The shutter blade 9, sector ring 4, combination-use blade 10, sector pin 8, axis pin 11 constituting the shutter moving parts are formed by non-magnetic material or plastics. This reduces the weight of the shutter moving parts and makes possible the reduction in the power of driving current to be supplied to the coil patterns provided to the front and back surfaces of the sector ring 4 of the time when the opening and closing of the shutter are accomplished through supply of the driving current to the coil patterns by a release operation, rotating of the sector ring 4 until it is braked and positioned by the stopper 14 and the transmission of its revolution to the shutter blade 9 and combination-use blade 10 by the sector pin 8. 
     COPYRIGHT: (C)1980,JPO&Japio
Patent JP-S6127228-A (JP)
Title: Mold for molding plastic
Inventor: IZUMI TAMOTSU
IPC: B29C45/26
Filed: 1984-07-18
Abstract: PURPOSE:To prevent strain from reaching a product section thereby allowing a product to be uniformalized, by providing an intermediate path located between a runner section and a molding section for the intended product of a mold with a molding strain decreasing section with a plurality of bent sections. CONSTITUTION:A molding strain decreasing section 4 comprises a corrugated section. A plastic that is injected from a molding machine is fed via a sprue 1, a runner 2 and a film gate 3, and since, when it passes through the molding strain decreasing section 4, the path is corrugated, the resistance increases and the flow velocity is decreased. As a result, while the plastic is passing the section, strain in the plastic results in, and since the residual internal strain almost disappears when the plastic reaches a thin wall section 6 and a product section 6, the product section 6 would be free from deformation due to molding strain. By cutting the thin wall section 6 off after the molding, a uniform product section 6 can be taken out.
Patent JP-H11337006-A (JP)
Title: Boiler
Inventor: AMITANI KAZUYUKI
IPC: F22B37/04
Filed: 1998-05-29
Abstract: PROBLEM TO BE SOLVED: To securely prevent corrosion as caused by sulfurization of an evaporation pipe at the bottom part of the body of a furnace. SOLUTION: The body 10 of a surface is provided with a film made of a 50Ni-50Cr alloy which is applied by a plasma spraying on the surface of an evaporation pipe of a furnace wall part 10a while a film made of a high Cr steel such as 13 Cr steel or 18 Cr steel is applied on the surface of an evaporation pipe of the bottom part of the furnace and the film of the furnace bottom part 10b is covered with 8 refractory brick and a refractory material. The arrangement of the films enables preventing of corrosion of the evaporation pipe of the furnace wall part 10a as caused by combustion ash and a combustion gas generated by the heating of a burner zone Z of the furnace wall part 10a of the body 10 of the furnace with a burner using a fuel containing a plenty of sulfur component.
Patent JP-H09330284-A (JP)
Title: Automatic ip address allocating method
Inventor: KAYANO YUUJI
IPC: H04L12/28
Filed: 1996-06-11
Abstract: PROBLEM TO BE SOLVED: To improve the efficiency of network construction work by automating the IP address setting of a terminal connected to a network, the management of an IP address and the check of a terminal user at the time of IP address allocation. SOLUTION: A terminal 106 transmits an IP address request frame containing a MAC address and personnel information concerning the user of the terminal to a managing device 101, and the managing device collates the personnel information concerning the user contained in the IP address request frame with a personnel data base 105. When personnel information coincident with the personnel information concerning the user exists in the personnel data base, the non-allocated IP address is taken out of an IP address managing table and based on the MAC address contained in the received IP address request frame, this IP address is reported to the terminal that transmits the IP address request frame.
Patent JP-S6126874-A (JP)
Title: Burn-in device for semiconductor device
Inventor: YANO SHUICHI
IPC: G01R31/26
Filed: 1984-07-16
Abstract: PURPOSE:To conform a burn-in state without opening the door of a thermostatic chamber by making an illumination display to the outside when a burn-in substrate is mounted and applied with a voltage. CONSTITUTION:An earth wire and a substrate power wire 24 from a power source part 18, and plural substrate input signal lines 27 from a burn-in substrate signal generating circuit 26 are connected to the burn-in substrate connector 20 in the thermostatic chamber 2 through cable repeating connectors 22 and 21. When the burn-in substrate 31 to which many sockets 28 are fitted is not pluged in the connector 20, a mounting connection line 32 is broken in the middle by the connector 20 and a pilot lamp 35 does not turn on. When the burn-in substrate 31 is pluged in the connected 20 and supplied with electric power, the mounting connection line 32 is connected and the pilot lamp 35 illuminates, thereby confirming the mount state of the substrate 31 without opening the door of the thermostatic chamber 2.
Patent JP-S5671479-A (JP)
Title: Controlling method of variable voltage variable frequency three-phase inverter
Inventor: KOO HIDEO
IPC: H02M7/48
Filed: 1979-11-15
Abstract: PURPOSE:To alleviate the abrupt increase or decrease in the voltage by sequentially switching the respective phases of modulated waves. CONSTITUTION:Several types of carriers are always generated from carrier oscillators 42-44, and waveform mode switching circuit 45 is switched to next state carrier sequentially at the outputs of respective phase waveform selecting circuits 46-48 in accordance with a command. Then, the respective carriers are compared with the modulated waves by comparators 49-51 in the respective phases, thereby obtaining gate signal for a thyristor. Only U-phase carrier 57 is switched as indicated in figure (a) in accordance with the pulse mode switching command at point A, then V-phase carrier 58 is switched as indicated in figure (b) at a delay of 120 deg., and further the W-phase carrier is switched as indicated in figure (c), thereby obtaining the gate signals in the respective phases.
Patent JP-H0312901-A (JP)
Title: Temperature detector
Inventor: FUJISAKA TOMOHIRO
IPC: G01K7/16
Filed: 1989-06-12
Abstract: PURPOSE:To obtain a temperature detector equipped with a sensor made of synthetic resin which can easily be shaped into a thin film by making up the sensor for detecting a temperature with a specific polymer. CONSTITUTION:This detector is composed of an insulating substrate 1, electrodes 2, and a sensor 3 for detecting a temperature consisting of a polymer having a constituent unit which is expressed by means of a structural formula (I) as a main composition, where X is S or O and R indicates an alkyl group which has the number of hydrogen and carbon of 20 or less or an alkoxyl group which has the number of carbon of 20 or less. Once this polymer is used as the sensor 3 for detecting the temperature, electric resistance value varies at a certain rate and the temperature is detected suitably. As its sensor consists of synthetic resin, it can easily be shaped into a thin film.
Patent JP-S5773014-A (JP)
Title: Acrylic polymer having improved formability
Inventor: MATSUMOTO AKIRA
IPC: C08F8/00
Filed: 1980-10-24
Abstract: PURPOSE: To prepare the titled polymer having excellent coating film characteristics physical properties, etc., by melting and reacting a polymer composed of a specific amount of methyl methacrylate and a specific amount of specific ethylenically unsaturated compound, in the presence of an organic peroxide, at a specific temperature.  
     CONSTITUTION: A thermoplastic polymer having improved formability as represented by the melt viscosity or the solution viscosity of the product, is obtained by compounding (A) a polymer (composition) composed of, as monomer units, (i) ≥50wt% of methyl methacrylate and (ii) ≥10wt% of an ethylenically unsaturated compound composed mainly of a (meth)acrylic acid ester (usually ≤5C alkyl ester) and other compounds (e.g. styrene) with (B) usually 0.3W3pts.wt., based on 100pts. of the polymer, of an organic peroxide (e.g. dicumyl peroxide), and then melting, mixing and reacting the composition at or above the decomposition temperature of the compound (B). 
     COPYRIGHT: (C)1982,JPO&Japio
Patent JP-S63314243-A (JP)
Title: Production of thermosetting resin
Inventor: MATSUMURA SHUNICHI
IPC: C08G73/22
Filed: 1987-06-17
Abstract: PURPOSE:To obtain the title resin which can give a molding low in water absorptivity and excellent in heat resistance, hydrolysis resistance, chemical resistance, flame retardancy and toughness in excellent moldability and rapid curability, by reacting an oxazoline derivative with a halogenated bisphenol by heating in the presence of a specified catalyst. CONSTITUTION:An oxazoline derivative (A) of formula I (wherein n is 2-4, R is an n-valent aliphatic, alicyclic or aromatic hydrocarbon group, and may be a direct bond when n=2, Ra-Rd are each H, a 1-3C aliphatic or 7C or lower aromatic hydrocarbon group), e.g., 2,2'-bis(2-oxazoline), is intimately mixed with 10-120% OH equivalent, based on the oxazoline equivalent of component A, of halogenated bisphenol (B) of formula II (wherein X is Cl or Br, and m is 1 or 2) in the presence of 0.01-20mol.%, based on component A, catalyst selected from a proton acid of a Pka <=2.5, a proton acid ester of a Pha <=1.0, a Lewis acid (complex), I2, etc. (C), and the resulting mixture is molten by heating, poured into a mold of any desired shape and reacted by heating.
Patent JP-H0312969-A (JP)
Title: Semiconductor device
Inventor: SUZUKI HISAMITSU
IPC: H01L29/78
Filed: 1989-06-12
Abstract: PURPOSE:To make a smaller device by making one or more deeper square holes than source-drain regions in a region which traverses a channel region and reaches the source-drain regions, forming gate insulating films on the walls of said holes, and filling said holes, the walls of which are coated by said gate insulating films, with a conductive material. CONSTITUTION:Separated element regions formed in semiconductor substrate 1 are surrounded by a moat-shaped element separation insulating film 2, impurities are introduced into said element regions separated by a channel region 4 to form source-drain regions 3, a deeper square hole than said source-drain regions 3 is made, and a gate insulating film 5 is formed on the wall of said hole. The hole the wall of which is coated by the gate insulating film 5 is filled with polycrystalline silicon to form a gate electrode 6. Therefore, a plurality of gates can be formed in the element regions and smaller elements can be used because the gate electrode 6 is perpendicular to the semiconductor substrate 1. The source-drain regions 3 can be co-used, therefore, a pattern can be laid out with the minimum wirings. Thereby a smaller device can be made.
Patent JP-H09331069-A (JP)
Title: Method of manufacturing semiconductor device
Inventor: SUZUKI TATSUHIKO
IPC: H01L29/41
Filed: 1996-06-11
Abstract: PROBLEM TO BE SOLVED: To enable semiconductor substrates to be leveled leaving them intact without cutting down respective elements for cleaning up the beveled ends when they are cut down into pieces by forming laminated layer films at low etching rate on the main surface opposite to the processed surface of angled trenches on the semiconductor substrates. SOLUTION: Semiconductor substrates 1-6 having P-N junction surfaces having processing surface of angled trenches V at specific position are prepared. Next, laminated layer film 7 at lower etching rate than that of the semiconductor substrates 1-6 relating to the etchant for said substrates 1-6 is formed. Next, the angled trenches V in a specific depth are formed on the specific positions. Finally, the angled trenches V in the specific depth is dug out down to the laminated layer films 7 to make the angle with the P-N junction surfaces. In such a constitution, the laminated layer films 7 may be made of e.g. an aluminum films.