baber/WOPTO huggingface dataset:
Patent JP-2021052901-A (JP)
Title: Absorbent article
Inventor: TAKAGI YURIKA
IPC: A61F13/532
Filed: 2019-09-27
Abstract: To improve viscous liquid absorbency.SOLUTION: An absorbent article includes an absorber 70 and a liquid permeable top sheet 30 arranged on the surface side of the absorber 70. The absorber 70 includes a cell absorption sheet 50 which has an upper sheet 51 and a lower sheet 52 having liquid permeability, cells 55 which are surrounded by a bonded part 54 of the upper sheet 51 and the lower sheet 52 where the upper sheet 51 and the lower sheet 52 are not bonded, and particulate matters containing high absorbent polymer particles 53 housed in the cells 55. The upper sheet 51 is highly water-absorbing nonwoven fabric whose Klemm water absorbency is 50 mm or more.SELECTED DRAWING: Figure 16
Patent JP-2021053019-A (JP)
Title: Game machine
Inventor: TAKEKOSHI DAISUKE
IPC: A63F7/02
Filed: 2019-09-30
Abstract: To provide a game machine capable of suitably improving an attention degree to a game machine.SOLUTION: A sub control board 940 executes control for displaying a prescribed first performance when an operation plane of a pressing operation unit 1261 is displaced to a first position to which the operation plane can be moved by a small movement amount relative to when being moved to a neutral position, and control for displaying a second performance different from the prescribed first performance when a position of an operated part is displaced to a second position to which the operated part is moved by a large movement amount relative to that when being moved to the first position.SELECTED DRAWING: Figure 34
Patent JP-2021057509-A (JP)
Title: Manufacturing method of semiconductor wafer and semiconductor wafer
Inventor: IWATA KUNIHIRO
IPC: H01L21/301
Filed: 2019-10-01
Abstract: To provide a manufacturing method of a semiconductor wafer, and a semiconductor wafer which can be chamfered to a desired shape on the front and back surfaces of a small-diameter semiconductor wafer used in minimal fab system and have no roll-off to a chamfered portion.SOLUTION: In a manufacturing method of a semiconductor wafer, cutting processing is performed in which a groove is formed on the front surface and the back surface of a first silicon wafer W1 with a rotary tool to which a cup wheel 100 is attached. In one step of rotating the cup wheel 100 on the front surface (back surface) of the first silicon wafer W1 and processing the groove S at a protrusion 102, a chamfered portion is formed over the entire circumference of the front surface side (back surface side) of one second semiconductor wafer W2.SELECTED DRAWING: Figure 1
Patent JP-2020098567-A (JP)
Title: Adaptive detection/avoidance system
Inventor: TIMOTHY DAWSON-TOWNSEND
IPC: G08G5/04
Filed: 2019-10-02
Abstract: To detect obstacles, including other transportation bodies, and automatically navigate a transportation body around the obstacle.SOLUTION: In an ASA system 200, a plurality of sensors 226 generate sensor data that reflects positions of an obstacle in an environment. An obstacle detection circuit 202 is connected to a processor and the plurality of sensors 226 in an operable manner so as to specify the obstacle based on at least a part of the sensor data, and generates obstacle information that reflects the best estimate of a location of the obstacle in the environment. The obstacle detection circuit 202 weights the sensor data according to a state of an air transportation body and an environment thereof. An avoidance flight path circuit 204 is connected to the obstacle detection circuit 202 and the processor in an operable manner, and calculates flight path data according to the obstacle information and the information from one or more databases. The obstacle detection circuit 202 transmits flight path data to a flight control system 120.SELECTED DRAWING: Figure 2a
Patent JP-2021057546-A (JP)
Title: Coating and development apparatus and coating and development method
Inventor: WATANABE TAKASHI
IPC: H01L21/027
Filed: 2019-10-02
Abstract: To provide a small-sized coating and development apparatus which can perform processing at a high throughput and has a small occupied floor area.SOLUTION: A coating and development apparatus comprises: a processing block B2 in which processing modules including a post-exposure processing module performing liquid processing of a substrate before an exposure is provided; and a relay block B3 which couples the processing block B2 and an exposure device E in a width direction and in which a post-exposure processing module performing the liquid processing of the substrate before a development processing after the post-exposure and a first carry-in and carry-out module 41 that carries-in and carries-out the substrate to the exposure device E. In the relay block B3, a second carry-in and carry-out module 42 that carries-in and carries-out the substrate to the delivery part and the post-exposure processing module is provided in a region adjacent to a delivery part in the width direction, and a relay mechanism 50 relaying the substrate between the first carry-in and carry-out module 41 and the second carry-in and carry-out module 42 in a region opposite to the post-exposure processing module across the second carry-in and carry-out module 42 in a depth direction orthogonal to the width direction.SELECTED DRAWING: Figure 1
Patent JP-2021060722-A (JP)
Title: Transparent conductive sheet, touch sensor, image display device and method for manufacturing the same
Inventor: YANO TAKANOBU
IPC: G06F3/041
Filed: 2019-10-04
Abstract: To provide a transparent conductive sheet, a touch sensor, an image display device, and a method for manufacturing the same capable of suppressing damage to a transparent conductive layer while reducing thickness.SOLUTION: A first transparent conductive sheet 1 comprises a display area 3 for arranging an image display member 9 and a margin area 4 continuous with the display area 3. In the display area 3, a base sheet 5, a release layer 6, a transfer layer 7, and a transparent conductive layer 8 are arranged in order toward one side in a thickness direction. In the margin area 4, the base sheet 5, the transfer layer 7, and the transparent conductive layer 8 are arranged in order toward one side in the thickness direction.SELECTED DRAWING: Figure 1
Patent JP-2021060775-A (JP)
Title: Reception unit, automated machine, association method, and association program
Inventor: TSUBOUCHI TAKASHI
IPC: G07B15/00
Filed: 2019-10-07
Abstract: To improve user operability without compromising security against unauthorized use by others.SOLUTION: A short-range wireless communication unit receives an identification user code from a mobile terminal located in a wireless communication area. A reference code generation unit extracts a feature amount of biometric information of a user acquired by a biometric information acquisition unit and generates a reference user code. An association unit checks the reference user code against the identification user code to associate the user with the mobile terminal. The identification user code is a code generated by the same logic as a logic with which the reference code generation unit generates the reference user code.SELECTED DRAWING: Figure 2
Patent JP-2021060105-A (JP)
Title: Valve device
Inventor: HORIKAWA TSUYOSHI
IPC: F16K43/00
Filed: 2019-10-09
Abstract: To provide a valve device which prevents a seal performance from being reduced by rubbing up a vertical packing part of a packing of an inner valve box with divided surface packings of an outer valve box, while attaining reduction of insertion resistance of the inner valve box.SOLUTION: The present invention relates to a valve device comprising an outer valve box 2 which is mountable on a fluid pipe, and an inner valve box 4 which is accommodated within the outer valve box 2. On an outer surface of the inner valve box 4, a packing 6 is provided for sealing gaps among an annular packing contact surface 2a on an inner surface of the outer valve box 2 closer to a valve insertion port part 20, a vertical packing contact surface 2b continued to a plurality of parts of the annular packing contact surface 2a, and a bottom packing contact surface 2c continued to a lower end of the vertical packing contact surface 2b. The packing 6 is configured while being divided into an annular first packing 61 in contact with the annular packing contact surface 2a and a second packing 62 in contact with the vertical packing contact surface 2b and the bottom packing contact surface 2c. An upper end side of a vertical packing part 62A of the second packing 62 is supported in a vertically movable state while penetrating a vertical packing connection portion of the first packing 61.SELECTED DRAWING: Figure 3
Patent JP-2020077452-A (JP)
Title: Universal storage carrier
Inventor: TSORNG YAW-TZORNG
IPC: G06F1/16
Filed: 2019-10-09
Abstract: To provide a storage device carrier that receives multiple types of storage devices.SOLUTION: An adapter bracket 200 configured to be mounted within a carrier device includes a receiving space 210 configured to receive a SSD module 300, a left wall element located on one side of the receiving space 210, and a right wall element located opposite of the left wall element. The adapter bracket 200 also includes a plurality of receiving elements 211 located between the left wall element and the right wall element. The receiving element 211 are configured to receive a securing element 15 through an aperture 311 of the SSD module 300.SELECTED DRAWING: Figure 3A
Patent JP-2021063248-A (JP)
Title: rail
Inventor: TOKUNAGA KAZUYA
IPC: C22C38/24
Filed: 2019-10-11
Abstract: To provide a rail in which cracks caused in a web section of the rail can be prevented from progressing, thereby preventing the rail from being broken.SOLUTION: A rail 1 comprises a foot section 2, a web section 3, and a head section 4. The component composition of the head section includes, by mass: 0.70 to 1.00% of C; 0.20 to 1.00% of Si; 0.50 to 1.50% of Mn; 0.035% or less of P; 0.0005 to 0.010% of S; 0.20 to 1.00% of Cr; 0.05 to 0.10% of V; 0.0015 to 0.0150% of N; and the balance of Fe and inevitable impurities, wherein the rail satisfies formula (1): [%Mn]/([%Si]+[%Cr])≥0.60, formula (2): ([%Si]+2[%Cr])-[%Mn]≥0.30, and formula (3): [%Mn]×[%S]≤0.004. In the formulae (1) to (3), [%X] expresses mass% of a component composition X. In the rail, the hardness from a surface layer of the head section to the depth of 25 mm is 380 to 480 HV, and a hardness difference between the surface layer of the head section and a position at a depth of 25 mm is less than 40 HV.SELECTED DRAWING: Figure 1
Patent JP-2021063693-A (JP)
Title: Method for measuring shape of wafer
Inventor: ONISHI OSAMU
IPC: G01B11/30
Filed: 2019-10-11
Abstract: To provide a method for measuring a shape of a wafer that can measure an original warp value of a wafer using a flatness measurement machine, and obtain the warp value with a machine difference suppressed.SOLUTION: A method for measuring a shape of a wafer with a first main surface and a second main surface while holding the outer periphery of the wafer with a flatness measurement machine including a first optical system and a second optical system positioned on both sides of the wafer input into the machine includes: a first step of measuring the surface displacement quantity of the first main surface and the second main surface of the wafer using only one of the first optical system and the second optical system, a second step of calculating the outer periphery holding deformation quantity generated by the holding of the outer periphery of the wafer by using the surface displacement quantity of the first main surface and the second main surface measured by the one optical system, and a third step of calculating an original warp value of the wafer by subtracting the outer periphery holding deformation quantity from the warp value output from the flatness measurement machine.SELECTED DRAWING: Figure 1
Patent JP-2021063719-A (JP)
Title: Radiation detection module and radiation detector
Inventor: SHINBA YUICHI
IPC: G01T1/20
Filed: 2019-10-15
Abstract: To provide a radiation detection module and a radiation detector that can improve impact resistance of a substrate and prevent deformation of the substrate due to a change in temperature.SOLUTION: A radiation detection module according to an embodiment comprises: a substrate that exhibits a sheet-like shape and contains resin; a plurality of photoelectric conversion units that are provided on one face of the substrate; a scintillator that is directly deposited on the plurality of photoelectric conversion units and converts a radiation ray into fluorescent light; a frame-like sealing unit that contains a thermoplastic resin as a main component, is provided around the scintillator, and is joined to the substrate and the scintillator; and a moisture proofing unit that covers the scintillator and is joined to an outer surface of the sealing unit in the vicinity of its circumference.SELECTED DRAWING: Figure 2
Patent JP-2021068813-A (JP)
Title: Semiconductor device and manufacturing method thereof
Inventor: TAKAO TOMA
IPC: H01L25/18
Filed: 2019-10-24
Abstract: To provide a semiconductor device that ensures the injection property of a filler and improves the heat dissipation.SOLUTION: A semiconductor device includes a semiconductor module, a substrate, and a filler. The semiconductor module includes a semiconductor chip, a control integrated circuit (IC) that controls the drive of the semiconductor chip, and a package that seals the semiconductor chip and the control IC with an insulating material. The semiconductor module is mounted on the substrate. The filler is provided between the lower surface of the package of the semiconductor module and the substrate. The substrate includes a through hole provided below the package and closer to the control IC than the semiconductor chips in the package.SELECTED DRAWING: Figure 2
Patent JP-2020011153-A (JP)
Title: Game machine
Inventor: TSUCHIYA YOSHITAKA
IPC: A63F7/02
Filed: 2019-10-29
Abstract: To provide a game machine that can make a performance related to a holding symbol easy to understand.SOLUTION: A game machine 1 includes: display means 91 for displaying a varying holding symbol 11 which is a symbol indicating the presence of win/lose determination information for which notification of a win/lose determination result has not yet been completed, and corresponds to the one in which a notification performance for notifying of the win/lose determination result is currently executed, and a prior variation holding symbol 12 which corresponds to the one for which the notification performance has not been started; and a movable member 40 which can be located at a first position that does not overlap with both the varying holding symbol 11 and the prior variation holding symbol 12 and a second position that does not overlap with one of the varying holding symbol 11 and the prior variation holding symbol 12 but overlaps with the other. The movable member 40 positioned at the first position in the normal mode is positioned at the second position when a predetermined condition is satisfied.SELECTED DRAWING: Figure 25
Patent JP-2021072579-A (JP)
Title: Cleaning device and cleaning method
Inventor: ITO KOICHI
IPC: B08B1/00
Filed: 2019-10-31
Abstract: To provide a cleaning device that can cope with a positional change or a size difference of a detection surface to be cleaned.SOLUTION: A cleaning device includes a second cleaning unit 5 for cleaning a detection element provided with a detection surface and a control unit 10 for controlling the second cleaning unit 5. The second cleaning unit 5 includes a light-emitting unit 66 for irradiating a tip portion with light. The control unit 10 controls the position of the second cleaning unit 5 based on measured first positional information of the second cleaning unit 5 and second positional information of the second cleaning unit 5 based on a captured image 65 in which light of the light-emitting unit 66 that illuminates the detection surface is captured.SELECTED DRAWING: Figure 4
Patent JP-2020017545-A (JP)
Title: Mold for manufacturing organic light emitting diode
Inventor: HONGO KOKI
IPC: H05B33/26
Filed: 2019-11-01
Abstract: To provide a mold for manufacturing an organic light emitting diode that can exhibit sufficient light emitting characteristics even when a method combining an application step, a stamper step, and a vacuum film-forming step is used.SOLUTION: The mold includes a flat surface and a plurality of protrusions on the main surface, the average pitch of the plurality of protrusions is 50 nm to 5 μm, and the average aspect ratio of the plurality of protrusions is 0.01 to 1, and 80% or more of the plurality of protrusions has a predetermined curved surface, and when any point of the predetermined curved surface is defined as a first point, a point shifted by 1/10 of the average pitch from the first point is defined as a second point, an inclination angle of a second tangent plane contacting the second point with respect to a first tangent plane contacting the first point is within 60°.SELECTED DRAWING: Figure 1
Patent JP-2021074804-A (JP)
Title: Machining device
Inventor: NOMARU KEIJI
IPC: B24B37/10
Filed: 2019-11-06
Abstract: To provide a new machining device capable of machining a workpiece with high precision.SOLUTION: A machining device includes: a machining unit that has a chuck table having a supporting surface supporting a workpiece and configured to rotate while supporting the workpiece, a spindle installed with a machining tool for grinding or polishing, and a driving source for rotating the spindle; a measurement unit that measures a distribution of the thickness of the workpiece; a laser beam irradiation unit that has an adjuster for adjusting the power of a laser beam emitted to the workpiece; and a control unit that has a power setting portion for setting the power of the laser beam emitted to any region of the workpiece on the basis of the distribution of the thickness of the workpiece measured by the measurement unit, and an adjuster control portion controlling the adjuster of the laser beam irradiation unit so as to realize the power of the laser beam set by the power setting portion.SELECTED DRAWING: Figure 1
Patent JP-2021075937-A (JP)
Title: Facility cradle structure, and building comprising the same
Inventor: KITAGAKI HIDENORI
IPC: E04H17/14
Filed: 2019-11-12
Abstract: To provide a facility cradle structure capable of installing pieces of equipment with various sizes without damaging a water proof layer of an outdoor floor and capable of concealing installed pieces of equipment from external line of sight.SOLUTION: A facility cradle structure 1 of this invention comprises: a plurality of posts 4 whose base end portions are fixed to a beam 2, whose upper end portions protrude above a floor material 3, and which are arranged on two rows of straight lines substantially parallel to each other; a first horizontal member 5 bridged on the posts 4 arranged on one straight line; a second horizontal member 6 bridged on the posts 4 arranged on the other straight line; a plurality of support materials 7 whose upper face is horizontally bridged between the first horizontal member 5 and the second horizontal member 6 and on which a piece of equipment E is mounted; and a blind 8 for concealing the piece of equipment E. The first horizontal member 5 includes: a support material attaching portion 51 to which the support material 7 is attached; and a blind attaching portion 52 to which the blind 8 is attached. The blind attaching portion 52 is positioned above the support material attaching portion 51 with a prescribed interval.SELECTED DRAWING: Figure 1
Patent JP-2021075212-A (JP)
Title: Pneumatic tire
Inventor: TOMOMATSU RYOICHI
IPC: B60C11/00
Filed: 2019-11-12
Abstract: To secure the steering stability while improving the noise performance and rolling resistance.SOLUTION: In a pneumatic tire 1, an average gauge Ga_c1 of an under-tread rubber 152 on one outer center land part 32 and an average gauge Ga_c2 of the under-tread rubber 152 on another outer center land part 34 have the relation of Ga_c1<Ga_c2, a groove area ratio S_c1 of a tread surface 15a on the one outer center land part 32 and a groove area ratio S_c2 of the tread surface 15a on the other outer center land part 34 have the relation of S_c1>S_c2.SELECTED DRAWING: Figure 3
Patent JP-2021074401-A (JP)
Title: toothbrush
Inventor: IKEDA TAKEHIKO
IPC: A46B9/04
Filed: 2019-11-12
Abstract: To provide a toothbrush capable of achieving both softness in touching the gum and the tooth rows, and cleaning property.SOLUTION: An implanting base 11 in a toothbrush 10 comprises: an inside hair bundle region 17 implanted with inside hair bundles 15a and 15b, and an outside hair bundle region 18 of an outer peripheral part of the inside hair bundle region 17, implanted with outside hair bundles 15c and 15d. A tip inside brush surface 20 formed by connecting the tips of bristles 16 constituting the inside hair bundles 15a and 15b has a contour shape projecting upward when viewed from a short-side direction Y of the implanting base 11. A tip outside brush surface 21 formed by connecting the tips of the bristles 16 constituting the outside hair bundles 15c and 15d has a contour shape recessed downward when viewed from the short-side direction Y of the implanting base 11. The toothbrush 10 has a part in which the tip inside brush surface 20 projects more upward than the tip outside brush surface 21 when viewed from the short-side direction Y of the implanting base 11.SELECTED DRAWING: Figure 4
Patent JP-2021080075-A (JP)
Title: Guide roller body pressing rail for man conveyor
Inventor: ASADA NOBUAKI
IPC: B66B23/14
Filed: 2019-11-20
Abstract: To make it possible to facilitate post-installation of a pressing rail for preventing the contact between a comb beam and a footstep.SOLUTION: A guide roller body pressing rail 10 for a man conveyor includes a plurality of footstep guide rollers 12, each of which is supported by a shaft rod 11 to be rotatable and abuts on a side surface of a footstep, and a pressing rail part, which is fixed to the shaft rod 11 and presses a front wheel of the footstep in a height direction while being mounted thereon.SELECTED DRAWING: Figure 1
Patent JP-2020023440-A (JP)
Title: Manufacturing method of cement hardened body
Inventor: KONO KATSUYA
IPC: C04B24/26
Filed: 2019-11-21
Abstract: To provide a manufacturing method that can obtain a cement hardened body having high compressive strength.SOLUTION: The manufacturing method is a manufacturing method of cement hardened body with compressive strength of 80 N/mmor more. The manufacturing method of cement hardened body includes: a molding process of installing a cement composition containing at least cement, water, and a water-reducing agent into a frame mold to obtain an uncured molded body; a first curing process of subjecting the uncured molded body to sealed curing or air curing for 10 hours or more at 10 to 40°C to demold it from the frame mold and obtain a hardened molded body; a water absorption process of impregnating the hardened molded body into water under reduced pressure to absorb water into the hardened molded body; and a second cure process of curing the water absorbed molded body at 15°C or more (except for the case of impregnating the hardened molded body in water under reduced pressure).SELECTED DRAWING: None