baber/WOPTO huggingface dataset:
Patent JP-2006252840-A (JP)
Title: Circular fluorescent lamp and manufacturing method of circular fluorescent lamp
Inventor: MURAMATSU TERUTAKA
IPC: H01J5/50
Filed: 2005-03-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a circular fluorescent lamp with display items changing in accordance with a change of brand names displayed on a base, doing away with the need to stop a lamp manufacturing line due to difference of display.  <P>SOLUTION: For the circular fluorescent lamp 1 provided with a glass tube 3 with phosphor printed on its inner face and rare gas and mercury sealed in, and a base 2 fitted at an end of the glass tube 3, at least such display items that change in accordance with the change of brand names are displayed on the surface of the base 2.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006247043-A (JP)
Title: Information display device per game machine
Inventor: HARADA TATSUHIRO
IPC: A63F7/02
Filed: 2005-03-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide an information display device per game machine which can carry out a brilliant light emitting performance.  <P>SOLUTION: The information display device 100 per game machine has a transparent cover 17 for covering an information display part 11. An LED 29 deep inside an insertion hole TH for fixing the transparent cover 17 on a frame body 15 is lit to make the transparent cover 17 glow entirely independent of lamp parts 13 and 13.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006249784-A (JP)
Title: Foundation structure of base isolation building and its construction method
Inventor: SHINOZAKI YOZO
IPC: E02D27/34
Filed: 2005-03-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide a foundation structure of a base isolation building, inexpensively constructible, having sufficient strength for providing the required base isolation effect and easily performing work in a base isolation pit; and its construction method.  <P>SOLUTION: This foundation structure 1 of the base isolation building is composed of a pile 2, a foundation slab 7 constructed on the ground 41 for constructing its pile 2, a stand 4 constructed just above the pile 2, and a base isolation device 6 arranged between the stand 4 and an upper structure 8; and is constituted so as to restrict rotation of a pile head part 3 by arranging a hunch 9 in a joining part of the foundation slab 7 with the pile head part 3 by forming the pile 2 so that the upper end of its head part 3 extends up to the height of a lower end surface or more of the foundation slab 7.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006248697-A (JP)
Title: Image forming device
Inventor: YASUI KAZUMASA
IPC: B65H5/06
Filed: 2005-03-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image forming device of simple structure capable of restricting break out of problems due to mismatch of conveying speed when delivering sheets in an intermediate conveying roller without hindering reduction of costs.  <P>SOLUTION: This image forming device has a drive control unit 101 for controlling driving speed of the intermediate conveying roller 38 for conveying the sheets to a resist roller 37 for correcting bias feeding of the conveyed sheets, and a conveying speed information obtaining unit 102 for obtaining information about conveying speed of the sheets supplied to the intermediate conveying roller 38. The drive control unit 101 controls drive of the intermediate conveying roller between three kinds of speed different from each other on the basis of the information about conveying speed obtained by the conveying speed information obtaining unit 102.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006248114-A (JP)
Title: Writing utensil
Inventor: IWATA HISATSUGU
IPC: B43K5/00
Filed: 2005-03-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a writing utensil by which the color of an ink held in the same can be easily discriminated without writing on trial, appearance meet the preference of the young can be obtained by adding colorfulness to the vicinity of a pen tip, further appearance is not degraded even though the ink oozes out to the outer surface of the support portion of the pen tip, furthermore there is no concern of missing an ink color before changing an ink tank and an ink color after changing the ink tank in the case that the ink tank can be changed.  <P>SOLUTION: The writing utensil has a tapered pen tip 2 of a metal plate and a tapered pen tip supporting portion 63. The surface of the pen tip 2 is exposed to outside. The pen tip supporting portion 63 is arranged on the back surface of the pen tip 2 and supports the pen tip 2. An ink guiding portion supplying an ink held within a barrel 3 to the pen tip 2 is arranged between the back surface of the pen tip 2 and the pen tip supporting portion 63. The outer surface of the pen tip supporting portion 63 is colored to the same color or substantially the same color as the color of the ink held in the barrel 3.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006257449-A (JP)
Title: Method for manufacturing medium- to high-carbon steel sheet superior in machinability
Inventor: KATAGIRI YUKIO
IPC: C22C38/06
Filed: 2005-03-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a medium- to high-carbon steel sheet which has improved machinability by optimizing a final annealing condition and is useful for a material used in machine parts, automotive parts and the like.  <P>SOLUTION: A steel material for the steel sheet includes 0.45-1.5% C, 1.0% or less Si, 0.1-2.0% Mn, 0.02% or less S, 0.03% or less P and 0.005-0.20% Al. The manufacturing method comprises the steps of: hot-rolling the steel material; pickling it or further cold-rolling it; and final-annealing it. The steel sheet acquires a mixed structure of spheroidal cementite and pearlite, which is effective for improving machinability, when being final-annealed under conditions of a soaking temperature T<SB>a</SB>between (A<SB>1</SB>point +20°C) and (A<SB>1</SB>point +80°C), a soaking period of time (t) of 5 to 40 hours, a cooling rate (R) of 5 to 60°C/hour, and an X value of 0 or larger, which is defined by the expression (A): X=R-(4.81×10<SP>5</SP>)/ä(t<SP>2/3</SP>+20)×(T<SB>a</SB>-A<SB>1</SB>)}<SP>3/2</SP>.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006259860-A (JP)
Title: Safe driving support device
Inventor: TAJIMA YASUHIRO
IPC: G08G1/16
Filed: 2005-03-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a safe driving support device for improving the safety of a vehicle by solving the problem that it is hardly possible to remove the factor of the dangerous driving of a driver only by issuing an alarm when any dangerous status is detected in a conventional alarm device for a vehicle.  <P>SOLUTION: This safe driving support device is provided with an arrival deciding means for deciding whether or not the arrival of a vehicle to a destination is delayed, a driving status deciding means for deciding whether or not the driving of a vehicle is in a dangerous status and a contact prompt means for prompting a user to make a contact with destination based on the decision of the arrival deciding means and the driving status deciding means. Also, when it is decided that the arrival of the vehicle to the destination is delayed by the arrival deciding means, and it is decided that the driving of the vehicle is in the dangerous status by the driving status deciding means, it is preferable that the user is prompted to make a contact with the destination by the contact prompt means.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006261369-A (JP)
Title: Semiconductor device
Inventor: IZUMITANI SEIJI
IPC: H01L21/60
Filed: 2005-03-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a technology which reduces cost as much as possible for achieving the following two purposes of the prevention of water invasion from an end surface and the prevention of the performance deterioration of a semiconductor device, and the sufficient achievement of the exfoliation prevention of a bonding pad.  <P>SOLUTION: The semiconductor device comprises a bonding pad 11 and an impermeability layer 13. The impermeability layer 13 is constituted in a shape of a vertical wall. The bonding pad 11 is provided on the impermeability layer 13 in the shape of the vertical wall.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006258621-A (JP)
Title: Creep damage estimation method of ferritic heat resisting steel
Inventor: SATO YASUSHI
IPC: G01N3/00
Filed: 2005-03-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for estimating accurately a creep damage from the hardness of chrome-molybdenum (Cr-Mo) ferritic high-strength heat resisting steel having a chrome (Cr) content of 9% or more.  <P>SOLUTION: In this creep damage estimation method of ferrite steel for estimating nondestructively a creep damage of the ferritic heat resisting steel of a tempered martensitic structure, hardness of the member surface is measured, and a strain quantity of the member is estimated from a relation between the hardness and the strain quantity generated beforehand, and the creep damage is determined from comparison with a creep strain curve determined separately. Especially as for the hardness of the heat resisting steel surface to be measured, the minimum hardness of a welding heat influenced part wherein the damage is progressed most quickly is preferably measured.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006260378-A (JP)
Title: Semiconductor integrated circuit
Inventor: MATSUMOTO KAZUTAKE
IPC: G06F12/08
Filed: 2005-03-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit capable of improving system performance by suppressing penalty due to reading operation accompanying with refill in a cache memory circuit and writing operation accompanying with write-back or write-through.  <P>SOLUTION: This semiconductor integrated circuit is provided with a processor part 10 connected with a first bus line, a main memory circuit 70 connected with a second bus line to store program and data, a first cache memory circuit 20 which is connected with the first bus line and in which a part of data used in the processor part is written and access to the written data is performed with priority, and a second cache memory circuit 30 which is connected with the first bus line and in which the data erased by overwriting data in the first cache memory circuit and the data written back from the first cache memory circuit into the main memory circuit are temporarily written when storage capacity of the first cache memory circuit is short and access to the written data is possible.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006261543-A (JP)
Title: Semiconductor device package and relay printed board
Inventor: ITO SAKAE
IPC: H01L23/12
Filed: 2005-03-18
Abstract: <P>PROBLEM TO BE SOLVED: To improve the efficiency of a wiring pattern in a land array area on a mother board without shortening the land diameter of each land in the land array area.  <P>SOLUTION: A relay board 30 is constituted of forming lands 31a having the same arrays as those of solder balls 12b of a semiconductor device 10 on a surface side layer 30a, forming solder balls 32b having the same arrays as those of lands 21a of a mother board 20 and connected to the respective lands 31a through through-holes, and forming a by-pass wiring pattern extended from the solider ball 32b counted by the prescribed number of solder balls from the outer edge of the solder ball array area up to a by-pass wiring solder ball 35b on a rear side layer 30b. In the case of packaging the semiconductor device 10 through the relay board 30, the by-pass wiring pattern formed on the layer 30b of the relay board 30 is electrically connected to the wiring pattern of the mother board 20 through the by-pass wiring solder balls 35b and by-pass wiring lands 25a of the mother board 20.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006260431-A (JP)
Title: Power bid price decision support system
Inventor: YAMAMOTO TAKESHI
IPC: G06Q30/08
Filed: 2005-03-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a power bid price decision support system for preparing electric power bid data to be used as the base, when deciding on an electric power bid price.  <P>SOLUTION: Each power generation facility is provided with a power increment unit price database 20 for storing power increment unit prices as power generation cost per unit power quantity required for the unit increase in a generation power, a power increment unit price curve preparing means 50 for preparing a power increment unit curve, expressing each power increment unit price for the generation power by arranging power generation facilities operating for generating power, in the order of power generation facilities of inexpensive power increment unit price, an operation point deciding means 60 for deciding the operation point in the power increment unit curve, based on the preliminarily and separately searched power demand prediction and a bid base data preparing means 70 for calculating a buying and selling reference price by bidding for the bid power separately decided with the operation point as a center, based on the power increment unit price curve.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005277415-A (JP)
Title: Lead chip directly adhered semiconductor package, and manufacturing method and device of same
Inventor: LEE CHAN-SUK
IPC: H01L21/50
Filed: 2005-03-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a lead chip directly adhered semiconductor package.  <P>SOLUTION: The semiconductor package 100 comprises an integrated circuit chip 110 having an upper surface and a lower surface, a lead frame 120 that directly contacts any one of the upper surface or the lower surface of the integrated circuit chip, and an adhesive 130 which is partially formed on the lead frame.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006267195-A (JP)
Title: Induction heating and fixing apparatus
Inventor: YAMANO MIHO
IPC: H05B6/14
Filed: 2005-03-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide an induction heating and fixing apparatus wherein a fixing temperature is always made uniform in accordance with the paper size of each transfer paper, without specially using a controller, and to always obtain a stable image free from occurrence of wrinkles and offset without causing wasteful energy consumption in an image forming apparatus.  <P>SOLUTION: In the induction heating and fixing apparatus, an endless fixing belt and 1st and 2nd supporting rollers on which the fixing belt is wound and which support the fixing belt from the inside are arranged, and an exciting coil having a plurality of cores is arranged opposite to the 1st supporting roller across the fixing belt, and the 1st supporting roller or the fixing belt is induction-heated by the exciting coil, further, a pressure roller coming into press contact with the 2nd supporting roller across the fixing belt and the transfer material is arranged, some of the cores can be moved by the shape memory alloy with respect to the exciting coil, and the distance or the direction of the core arranged opposite to the exciting coil is varied to two positions by taking a prescribed temperature as a boundary value.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006267269-A (JP)
Title: Packing device
Inventor: ENDO MAKOTO
IPC: G03C3/00
Filed: 2005-03-22
Abstract: <P>PROBLEM TO BE SOLVED: To prevent film units from being sandwiched between a cover and a pack body.  <P>SOLUTION: A packing device 33 is composed mainly of a unit transfer 41, a pack support 42 and a cover transfer (not shown). The unit transfer 41 is composed of a chuck unit 55, guides 56a, 56b, a unit base 57, a film crushing unit 59 and a pack holddown actuation unit 61. The pack support 42 is composed of a pack holddown unit 60 and a support body 82. At the time of packing, accumulated films 39 obtained by accumulating film units 9 are crushed into the pack body 40 using the film crushing unit 59. At the same time, the pack holddown unit 60 is actuated by the pack holddown actuation unit 61 to hold the accumulated films 39 in the state crushed into the pack body 40, so that the film units 9 are prevented from being sandwiched between the cover and the pack body 40 at the time of covering.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006269163-A (JP)
Title: Organic electroluminescent element
Inventor: SATO AKIRA
IPC: H01L51/50
Filed: 2005-03-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide an organic EL element in which the light extraction efficiency is significantly improved, in comparison with that of conventional types.  <P>SOLUTION: In the organic EL element in which a transparent electrode, an organic light-emitting layer, and an electrode are laminated on a transparent substrate, in this order, the organic EL element is fabricated, in which the light extraction layer of which the refractive index is lower than that of the transparent substrate and where a face side facing the transparent electrode is uneven is installed between the transparent substrate and the transparent electrode.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006269797-A (JP)
Title: Ninety degree inverted transistor circuit
Inventor: OKADA KEIICHI
IPC: H01L21/82
Filed: 2005-03-24
Abstract: <P>PROBLEM TO BE SOLVED: To prevent malfunction caused by variation in manufacture by providing independently a circuit changed in a disposition direction in advance and selecting its circuit output.  <P>SOLUTION: A circuit comprises: a circuit A1 and a circuit B2 different by 90° in their dispositions with respect to an input; a voltage comparator 3 and an output decision circuit 5 for detecting characteristics of respective circuit outputs; and a selector 4 for selecting the output having more excellent characteristics from the result of the output decision circuit 5.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006270666-A (JP)
Title: Image recording apparatus and monitoring system
Inventor: YOSHIMURA NAOHIRO
IPC: G08B25/00
Filed: 2005-03-25
Abstract: <P>PROBLEM TO BE SOLVED: To detect abnormality and to transmit an alarm signal based thereon, in a monitoring system, without using any sensor or motion detect function.  <P>SOLUTION: In an image recording apparatus of the present invention, an image signal outputted from an imaging apparatus is recorded after predictive compression encoding utilizing frame correlation, and the encoded image signal is appropriately transmitted to a network. Each time one frame is encoded, the image recording apparatus determines the total data size of a predetermined number of data frames, including that frame, encoded in the past and discriminates whether or not the total data size is equal with or greater than a predetermined threshold and if the total data size is equal with or greater than the threshold, an alarm signal is transmitted to the network. Predictive compression encoding is performed based on an MPEG scheme and the predetermined number is preferably equal with the number of frames included in one GOP.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006279527-A (JP)
Title: Mobile communication apparatus, data transmission method, and program
Inventor: ISHIDA KAZUHIRO
IPC: H04L1/18
Filed: 2005-03-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a mobile communication apparatus capable of reducing power consumption by preventing useless decoding, and to provide a data transmission method and a program.  <P>SOLUTION: The last error detection result is held for each HARQ process. When the result of the last ACK/NACK of the process stored in an ACK/NACK Data Memory 103 is ACK, no decoding is performed.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006136189-A (JP)
Title: Capacitor device and power conversion device
Inventor: WATANABE KEISUKE
IPC: H02M7/48
Filed: 2005-03-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a capacitor device that can reduce inductance and a power conversion device.  <P>SOLUTION: The capacitor device is provided with electronic-part modules 1U, 1V and 1W of each phase that have electronic parts and electronic-part terminals and a capacitor module 2 that has capacitor cells, that can electrically be connected, and in which electrical connection holes 21a, 21b into which the electronic-part terminals 12, 13 can be inserted are formed. The electronic-part terminals 12, 13 are inserted into the electrical connection holes 21a, 21b so that the module 2 is electrically connected to the electronic-part terminals 12, 13 and the electronic-part modules 1U, 1V and 1W of each phase and the like and the capacitor module 2 are formed integrally.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006274117-A (JP)
Title: Stabilized olefin polymer and method for producing the same
Inventor: YODA KAORU
IPC: C08L23/00
Filed: 2005-03-30
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a stabilized olefin polymer particle and to provide a method for producing the same, in detail, to obtain a stabilized olefin polymer particle usable as a molding material without passing through a melting and kneading process and to provide its production method.  <P>SOLUTION: The stabilized olefin polymer particle impregnated and/or coated with a stabilizer is obtained by bringing a stabilizer mixed with carbon dioxide in a supercritical state into contact with an olefin polymer particle polymerized from one or more kinds of olefin monomers.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006274734-A (JP)
Title: External member mounting structure for horizontally laid external facing structure
Inventor: FUNAKI GANTAN
IPC: E04D13/00
Filed: 2005-03-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide an external member mounting structure for a horizontally laid external facing structure allowing an external member to be mounted without affecting a seam structure of a horizontally laid external facing material and obtaining strength or the like as the horizontally laid external facing material as designed without a possibility of submergence from a seam part to the back face side of the external facing material.  <P>SOLUTION: In the horizontally laid external facing structure, the horizontally laid external facing materials 2 are laid in the engaged state of an upstream side formed part 2a and a downstream side formed part 2b. A holding member 3 has a base part 3c provided with a fixed part 3d penetrating the horizontally laid external facing material 2 and fixed to a backing 1. The base part 3c of the holding member 3 is projected penetrating the upstream side formed part of the horizontally laid external facing material 2, and the fixed part 3d of the base part 3c in the projecting state is mounted to the backing 1.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2006280394-A (JP)
Title: Method of manufacturing protein porous matrix
Inventor: SHIGEMATSU TAKASHI
IPC: A61L27/00
Filed: 2005-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of preparing a protein porous matrix with air gap parts.  <P>SOLUTION: The method includes a process of freezing a barlike body to be heated after inserting it in a liquid containing a protein, a process of removing the barlike body by heating the barlike body to melt a contact part between the frozen article and the barlike body, and a process of freeze-drying the obtained frozen article. The protein porous matrix with less destruction of tissues is easily prepared.  <P>COPYRIGHT: (C)2007,JPO&INPIT