baber/WOPTO huggingface dataset:
Patent JP-H11115028-A (JP)
Title: Manufacture of thermoplastic resin foam sheet
Inventor: NISHINO MASABUMI
IPC: B29L7/00
Filed: 1997-10-09
Abstract: PROBLEM TO BE SOLVED: To enable the rolling-up of a foam sheet so that no gauge bands are generated and neither are creases or flares generated in the foam sheet after it is spread by rocking a widening device in the sheet width direction. SOLUTION: A sheet widening device 6 is rocked in the sheet width direction. That is, a foamable sheet 11 is pinched under pressure and conveyed by a pair of pressing rolls 31, then is caused to pass through a thin gap path 21 to be guided into a heating furnace 2, and is preheated using a preheater 4. Further, the sheet 11 is caused to pass through a heating device 5 to obtain a thermoplastic resin foam sheet 12. This foam sheet 12 is widened by the widening device 6 installed between the latter half and the end point of a foaming stage and then is conveyed to the outside of the heating furnace 2 after passing through a thin gap path 22. This widening device 6 is rocked in the sheet width direction. The rocking operation is performed at a surface temperature of 50-150 deg.C, preferably at a rocking speed of 2.5-1200 mm/min. The rocking width is preferably 40-200 mm.
Patent JP-H11118962-A (JP)
Title: Standard clock device
Inventor: UEMATSU TOMONORI
IPC: G04G5/00
Filed: 1997-10-09
Abstract: PROBLEM TO BE SOLVED: To improve transmission efficiency and operability by simply constituting the circuit/device for editing image/voice data from a plurality of remote locations such as a main broadcasting station and an outdoor broadcast van. SOLUTION: Automatic calibration processing parts 3 and 13 use a GPS time signal being inputted from GPS reception parts 2 and 12 as a standard, compare the GPS time signal with Japanese Standard Time being used as the standard by an inner clock, and performs automatic calibration. Timing control pats 4 and 14 receive a standard signal being obtained by the automatic calibration from the automatic calibration processing parts 3 and 13 and output it as a timing signal for controlling the timing of image/voice data.  Therefore, a signal from a GPS satellite is received and accurate standard time is shared between a device A at a broadcast van side and a device B at a main broadcasting station side, and the standard signal being synchronized with the Japanese Standard Time being and automatically calibrated is obtained, thus accurately synchronizing the timing signal of the processing of each of image/voice data without providing an expensive atomic clock in the main broadcasting station and the broadcast van.
Patent JP-H10105025-A (JP)
Title: Process cartridge and electrophotographic image forming device
Inventor: WATANABE KAZUFUMI
IPC: G03G21/18
Filed: 1996-09-26
Abstract: PROBLEM TO BE SOLVED: To position a photosensitive drum in a process cartridge with respect to a device main body. SOLUTION: The photosensitive drum 7 is supported by a cartridge frame 13, to be movable in a longitudinal direction and the cartridge frame 13 is attached to the guiding members 16 of the device main body, to be movable in the longitudinal direction. The shaft coupling member 39b on a driving side of the device main body is at a fixed position in an axial direction. A shaft coupling member 37 at the end of the photosensitive drum has a helical triangular prism and the shaft coupling member 39b has a helical hole with a triangular cross section fitted to the helical triangular prism. The photosensitive drum is moved in the direction of (a) by the rotation of a shaft coupling, so that the cartridge frame 13 is moved with a bearing 38, to butt against the guiding member 16R.
Patent JP-H03154891-A (JP)
Title: Nuclear reactor fuel aggregate
Inventor: HANSU RETAU
IPC: G21C3/14
Filed: 1990-10-15
Abstract: PURPOSE: To prevent the galling of a control rod by bringing respective supports into contact with the outsides of adjacent second both sides of a fuel assembly case, and providing a contact spring in at least one support at the outside. CONSTITUTION: The plate springs 31 to 32 at both sides oppositely disposed at a fuel assembly case 7 are brought into contact with one another by bias pressure, and the contacts 45, 46 of the case 7 are brought into contact with the strip plates 3 to 4 of upper reactor core lattice 2. At the central axis N deviated from the central axis M of the fuel assembly 6 of annular mating surface 16a of a hollow truncated cone 14, the springs 31, 32 of a square component 21 at the center of the interstices of the lattice 2 accurately vertically fix four fuel assemblies 6 at the central axis M in the interstices. Accordingly, no galling occurs at a control rod 8 in an intermediate chamber.
Patent JP-2001096881-A (JP)
Title: Method for forming precise pattern and semiconductor device
Inventor: TANAKA TOSHIAKI
IPC: B41F15/40
Filed: 1999-09-30
Abstract: PROBLEM TO BE SOLVED: To provide a method for forming a precise pattern having excellent resolution without bleeding or sagging and a semiconductor device having the pattern and excellent reliability. SOLUTION: The method for forming a precise pattern comprises the steps of printing a resin paste having a complex viscosity measured at a frequency of 1 rad/s of 5 to 1,000 Pa.s, a ratio tanδ of a loss elastic modulus to a storage elastic modulus measured at a frequency of 100 rad/s of 1.2 to 10 times as large as a ratio tan δof the loss elastic modulus to the storage elastic modulus measured at the frequency of 1 rad/s while controlling a printing pressure.  In this case, the method for forming the precise pattern comprises a step (A) of printing the resin paste having the complex viscosity measured at the frequency 1 rad/s of 5 to 1,000 Pa.s., a ratio tanδ of the loss elastic modulus to the storage elastic modulus measured at the frequency of 100 rad/s of 1.2 to 10 times as large as the ratio tanδ of the loss elastic modulus to the storage elastic modulus measured at the frequency of 1 rad/s while controlling to print through a meshless metal plate, a step (B) of thermally drying the printed paste, and repeating the steps (A) and (B) plural times. The semiconductor device is formed of the pattern on a substrate by the method for forming the pattern.
Patent JP-H10125602-A (JP)
Title: Simulation method
Inventor: YAMADA HIROAKI
IPC: G06F19/00
Filed: 1996-10-21
Abstract: PROBLEM TO BE SOLVED: To greatly reduce random error by calculating the release angle distribution of supper particles, performing the orbital calculation of an MC method with practical precision and time, and obtaining a maturation figure. SOLUTION: The release angle distribution of particle from a target is calculated by using a molecular dynamics method (S1). The vertical component of the distribute is calculated in the angle region of equal interval, and the intensity function of the distribution is calculated by an interpolation method (S2). The vertical component is determined with the intensity function by using a critical method (S3). The horizontal component is determined with equal probability all directions by using random numbers (S4). The vertical component and the horizontal component are used, and the orbit of sputter particles in an equipment calculated by using a Monte Carlo method (S5). From the orbit, the film formation figure of a wafer is obtained by using a string model or the like. Thereby a generation of random error is reduce, and an ideal film formation figure can be realized.
Patent JP-S62165603-A (JP)
Title: Photo induction tube
Inventor: SANFUOODO KOBU JIYUNIA
IPC: G02B6/10
Filed: 1986-11-20
Abstract: A hollow, tubular light conduit (10) including a wall (11) of a transparent polymeric material, and the wall having a structured surface (12) and an opposite, smooth, glossy surface (14), and at least a portion of the cross-section of the wall lying in a smooth arcuate curve, wherein light (15) striking the inner surface, within an acceptable angular range, is contained by total internal reflection. The structured surface includes a linear array of substantially right angled isosceles prisms arranged side-by-side to form grooves. In addition, the perpendicular sides of the prisms make an angle of approximately 45 DEG  with the tangent to the smooth surface. Because of the flexibility of the light conduit and its ability to totally internally reflect light, a manipulated light conduit may be utilized in a variety of ways, for example, as a light fixture whereby some of the light directed into the light conduit is emitted from the light conduit for illumination or for use as a secondary light source. A suitable light source may include artificial or solar energy. However, when a light fixture operates as a warning light it is preferred that a strobe light be used.
Patent JP-S62142185-A (JP)
Inventor: JIYON ARAN UEEBAA
IPC: C07D501/00
Filed: 1986-11-20
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H02124622-A (JP)
Title: Quantizing error reducing device
Inventor: TAKAYAMA TAKEYUKI
IPC: H03M1/00
Filed: 1988-11-02
Abstract: PURPOSE:To reduce the waveform distortion attended with quantization by passing only a component of a frequency band including a signal before quantization among frequency components of a digital signal after the quantization. CONSTITUTION:An m-bit digital signal 71 being an output of a decoder 7 is inputted to a quantization error reducing device 11 and its l-bit arithmetic result 81 is given to a D/A converter(DAC) 13 and a low pass filter 9 to obtain an analog signal output 10. On the other hand, A fourier transformation device 13 as the frequency detection means applies Fourier transformation to N-sample of the m-bit signal 71 to output an amplitude term output 14. In this case, a band limit digital filter 15 has a cut-off characteristic to pass through only a spectrum component f0 whose amplitude is larger than the level of average quantizing noise level. The bit number l of the output signal 81 of the filter 15 in this case is increased more than the bit number (m) of the signal 71 to reproduce a smooth waveform without any distorted component attended with quantization.
Patent JP-H01121370-A (JP)
Title: Overcoat composition for optical disk
Inventor: SASAHARA KAZUNORI
IPC: G11B7/257
Filed: 1987-11-05
Abstract: PURPOSE:To provide the title composition containing a specific di(meth)acrylate and a compound containing ethylenic unsaturated group, etc., curable with ultraviolet radiation, having excellent adhesivity to recording medium, moisture resistance and hardness and capable of recording and reproducing optical signals in high speed and density. CONSTITUTION:The objective composition contains (A) a compound of formula (R is H or methyl) {e.g., tricyclo[5,2,1,0<2>,<6>]decane (meth)acrylate}, (B) a com pound containing one or more ethylenic unsaturated groups in a molecule (exclud ing the compound of formula) (preferably tricycle[5,2,1,0<2>,<6>]decane acrylate, etc.) and (C) a photo-polymerization initiator (preferably 1-hydroxy.cyclohexyl phenyl ketone, etc.) as an arbitrary component.
Patent JP-H03140434-A (JP)
Title: Beta-type silicon nitride whisker reinforced magnesium composite
Inventor: HIRASAWA YOSHIKAZU
IPC: C22C23/00
Filed: 1989-10-27
Abstract: PURPOSE:To obtain the beta-type Si3N4 whisker reinforced Mg composite excellent in mechanical characteristics and withstanding use at >250 deg.C by forming the composite from an Mg alloy contg. each prescribed amt. of Y and Sm and the balance substantial Mg and B-type Si3N4 whiskers. CONSTITUTION:The above Mg composite is formed from 95 to 75vol.% Mg alloy contg. 2 to 8% Y, 2 to 7% Sm and the balance substantial Mg and 5 to 30vol.% beta-type B3N4 whiskers. The Mg composite exhibits the above characteristics because in which beta-type Si3N4 whiskers having a prescribed fibrous volume ratio are used as reinforcing fiber and an Mg-Y-Sm series alloy is used as a matrix. Thus, the composite is considered to be used for the ones requiring lightness in weight, low thermal expansion and thermal resistance such as automobile engine parts and general purpose engine parts.
Patent JP-H08125156-A (JP)
Title: Image sensor
Inventor: OKUTSU YOSHIHIRO
IPC: H01L27/146
Filed: 1994-10-19
Abstract: PURPOSE: To protect an image signal against deterioration by locating a signal line, being connected with an array of light receiving elements arranged between two light receiving elements, oppositely to the side where the light receiving elements are formed with reference to the common electrodes of light receiving elements constituting an array of other two light receiving elements thereby eliminating mutual electrostatic coupling. CONSTITUTION: The discrete upper transparent electrode 17 of a photodiode in a green light receiving element array is connected, at an appropriate position, with a connection wiring formed on a passivation film 19 through a contact hole 20a made thereon. In the vicinity of the photodiode, a connection wiring 21 is connected with discrete lower electrode line 11 through a contact hole 20b communicated therewith from the passivation film 19 side. The discrete lower electrode line 11 is located, with respect to a common electrode layer 14, on the side where the photodiode is not formed. The upper transparent electrode 17 is connected with a discrete electrode line 22 and thereby the discrete lower electrode line 11 and the discrete electrode line 22 are located on different layers. Since mutual electrostatic coupling can be neglected, the image signal is protected against deterioration.
Patent JP-H04152540-A (JP)
Title: Mounting method of semiconductor device
Inventor: ONISHI TETSUYA
IPC: H05K3/32
Filed: 1990-10-16
Abstract: PURPOSE:To keep the reliability and the quality of a connection at a high-density mounting operation by a method wherein an electrode for a semiconductor device is coated with a conductive adhesive, conductive components in the adhesive are made to cohere to the central part of the electrode and the electrode on the semiconductor device is connected to an electrode on a board. CONSTITUTION:A semiconductor device 2 is mounted on a board 3 in a faced-down state. At the mounting method of the semiconductor device 2, an electrode 5 for the semiconductor device 2 is coated with a conductive adhesive 1, conductive components 6 in the adhesive 1 are made to cohere to the central part of the electrode 5 and, after that, the electrode 5 on the semiconductor device 2 is connected to an electrode 4 on a board 3. For example, the face of an active element having an electrode 5 for a semiconductor device 2 is faced downward. Then, the electrode 5 for the semiconductor device 2 is coated with an anisotropic conductive resin (resin) 1. While the electrode 5 is faced downward and the viscosity of the resin 2 is lowered by instantaneously heating the electrode 5, conductive components 6 are made to cohere to a part near the central part of the resin 1. Then, the electrode 5 is aligned with an electrode 4 on a board. Both electrodes are connected by executing a pulse heating operation which repeates a heating operation and a cooling operation.
Patent JP-H07252176-A (JP)
Title: Prduction of tert-butyl alcohol from tert- butyl hydroperoxide by using supported chromium catalyst
Inventor: JIYON RONARUDO SANDAASON
IPC: C07C29/132
Filed: 1994-11-14
Abstract: PURPOSE: To produce the subject compound in high selectivity and conversion by contacting a feedstock comprising solvent solution of t-butyl hydroperoxide with a specific hydroperoxide decomposition catalyst.  
     CONSTITUTION: Tertiary-butyl hydroperoxide feedstock solution containing 5 to 30 (wt.%) of t-butyl hydroperoxide in t-butyl alcohol is contacted with a hydroperoxide decomposition catalyst comprising alumina having 0.2 to 25% of chromium deposited thereon in a hydroperoxide decomposition zone in liquid phase under hydroperoxide decomposition conditions of a temperature of 20 to 25°C and a pressure of 0.1 to 7.0 MPa (0 to 1,000 psig) so as to convert the t-butyl hydroperoxide to decomposition products mainly comprising t-butyl alcohol. 
     COPYRIGHT: (C)1995,JPO
Patent JP-H02125152-A (JP)
Title: Drive releasing device
Inventor: KIMURA AKIYOSHI
IPC: F16H35/00
Filed: 1988-11-04
Abstract: PURPOSE:To facilitate the movement of a gear by displacing an endless drive transmitting member, slightly rotating the gear in the direction opposite to the drive rotation direction, and loosening the tight engagement of two gears before the gear is moved. CONSTITUTION:When a paper discharging cover 9 is opened for jam processing, an operation section 41 is moved to the right, an interlocking plate 42 is made free, a sliding plate 45 is lifted by the excitation force of a spring 52 via a U-shaped long hole 47, a long hole 46, and sliding dowels 48 and 49, an idler sprocket 50 is moved from A to C in sequence, an input sprocket 24 and a driving chain 25 are pulled in the left rotation direction at the middle point B, a swaying gear 14 is slightly reversely rotated, and the tight engagement with a relay gear 12 is loosened. When the cover 9 is further opened, the swaying gear 14 is easily moved, and the drive force transmission state is released. The deformation of a structure and the damage of gear teeth faces to move the gear can be prevented.
Patent JP-H02125452-A (JP)
Title: Resin-sealed semiconductor device
Inventor: AIBA MASATO
IPC: H01L23/28
Filed: 1988-11-02
Abstract: PURPOSE:To alleviate the temperature rise of a resin-sealed semiconductor device due to the radiation heat of an infrared ray at the time of mounting by providing a heat shielding roof at the top of the sealing resin of the device. CONSTITUTION:A semiconductor element secured to an island and metal fine wirings are sealed with rectangular sealing resin 3, and external leads 4 connected at the ends to the wirings are disposed in four directions outside the resin 3. A roof 1 supported by four supporting rods 2 connected to the resin 3 is so disposed as to cover the upper face of the resin 3. When the roof 1 and the rods 2 are formed of resin, they are manufactured by an integral die, the rods are inserted into the recesses of the resin 3 and secured with adhesive.
Patent JP-H08208910-A (JP)
Title: Polypropylene resin composition
Inventor: OKAWA KENICHI
IPC: C08L23/12
Filed: 1995-10-26
Abstract: PURPOSE: To obtain a polypropylene resin composition excellent in pigment dispersibility even in batchwise kneading of a pigment and a polypropylene resin, improved in falling weight impact resistance and capable of developing use into the industrial field of automotive, electrical, electronic components, etc., which need to have high-level heat resistance and impact resistance. CONSTITUTION: This polypropylene resin composition comprises 100 pts.wt., in total, composition comprising 55-85wt.% polypropylene resin, 15-45wt.% polypropylene resin composition containing talc in a high concentration and obtained by previously melt-kneading 10-60wt.% polypropylene resin and 40-90wt.% talc, 0-50 pts.wt. ethylene/α-olefin copolymer rubber and/or alkenylaromatic-containing rubber and 0.5-5.0 pts.wt. processed pigment prepared by using one or two dispersion media selected from among a metal salt of a fatty acid, a polyethylene wax and a polypropylene wax.
Patent JP-S61157370-A (JP)
Inventor: SUDO JUSABURO
IPC: B02C18/12
Filed: 1984-12-28
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H10127079-A (JP)
Title: Dc motor drive unit
Inventor: YAMANOI MASARU
IPC: H02P7/06
Filed: 1996-10-22
Abstract: PROBLEM TO BE SOLVED: To provide a DC motor drive unit where the drive unit is miniaturized and is made less expensive by suppressing the excessive regeneration current of a motor being generated owing to short circuit damping and reducing the rated current of a switching element to be used. SOLUTION: A DC motor drive unit comprises a switching element 2 for driving a brushless DC motor 3 and a speed control circuit 1 for generating a conduction signal (e) of the switching element 2 by receiving a rotary speed command signal (a) from an upper controller 1A, a start/stop signal (b), a rotary direction signal (c), a damping signal (d), and a rotary speed signal (g) of the DC motor 3. When the rotary speed signal (g) of the DC motor 3 is larger than a reference signal (j), an inversion damping signal (f) for inverting and damping the DC motor 3 is outputted. Further, when the rotary speed signal (g) of the DC motor 3 becomes smaller than the reference signal (j), all coil windings of the DC motor 3 are short-circuited and damped for switching to a short-circuiting damping signal (k) automatically by a damping control circuit 11.
Patent JP-2000111667-A (JP)
Title: Gadget timepiece
Inventor: TANAKA HIDEYUKI
IPC: G04B25/06
Filed: 1998-09-30
Abstract: PROBLEM TO BE SOLVED: To provide a gadget timepiece imparting excellent appreciativeness rich in unexpectedness of a dynamic change and being actuated with high accuracy while simplifying a structure and reducing the number of part items. SOLUTION: A dial 6 having a decorative body housed in a casing and being arranged in front of this decorative body is divided into two parts by a line passing through a rotary shaft 5, and is formed of a left side dial 6a and a right side dial 6b to perform opening/closing operation by making the left side dial 6a and the right side dial 6b autorotate and revolving around the rotary shaft 5 by using planetary gear mechanisms 30, 31. A second crank member 34 is arranged to prevent the left side dial 6a and the right side dial 6b from swinging in the axial direction of the rotary shaft 5.
Patent JP-S61158138-A (JP)
Title: Device for removal of protrusino on wafer surface
Inventor: SAWADA HIROSHI
IPC: H01L21/205
Filed: 1984-12-28
Abstract: PURPOSE:To enable to completely remove the protrusions on the surface of a wafer without giving damage to the wafer by a method wherein a scraping means is used in the state in the state in which the surface height of the wafer is made uniform. CONSTITUTION:The upper surface of a theta-table 3 is leveled, the center of rotation of the table and the center of a wafer are brought in coincidence with each other, and a wafer W is placed thereon. The surface height of the wafer W is measured by a thickness measuring sensor 4 for each rotating angle while the theta-3 is being rotated. The maximum surface height and the minimum surface height are detected, the theta-table 3 is adjusted in such a manner that the part having the maximum surface height or the minimum surface height is moved close to a rotating shaft 12 based on the read-out value of the rotating angle of the theta-table 3, and at the same time, a signal for removal of the difference between the maximum and the minimum of the surface height is given to an actuator 2. As a result, a swinging stand 1 is slightly moved upward or downward, and the surface of the wafer W is made even horizontally. A scraping means 5 is operated under the above-mentioned condition, and the protrusions on the surface of the wafer W are scraped off.