Patent DE-20122196-U1 (DE)
Title: Imprint lithography template for producing microelectronic devices, has multiple recesses of specified size and alignment marks and is transparent to activating light
IPC: H01L21/027
Filed: 2001-10-12
Abstract: A template (12) having multiple recesses of size less than 250 nm and alignment marks, is transparent to activating light. Preferred Features: The imprint lithography template is made of silicon, silicon dioxide, silicon germanium carbon, gallium nitride, silicon germanium, sapphire, gallium arsenide, epitaxial silicon, polysilicon, gate oxide, quartz or indium tin oxide. The portion of the template has pair of opposite surfaces. The bottom surface of the template has a surface free energy measured at 25[deg]C of less than about 40 dynes/cm or less than about 20 dynes/cm. Multiple recess of varying width and varying depth are formed on the top and bottom surfaces of the template. The surfaces of the template have an imprinting area and a kerf area, with the imprinting area being formed by the pattern of recesses. Multiple alignment marks provided on the template are opaque and transparent to analyzing and activating lights, respectively. The marks has multiple activating light-diffusing lines etched on surface, which are configured to produce analyzable mark under analyzing light. The mark is made of SiO x, where the x is either 1.5 or less than 2. A surface treatment layer is formed on the bottom surface of template. The layer comprises a reaction product of alkylsilane, fluoroalkylsilane or fluoroalkyltrichlorosilane with water, or a reaction product of tridecafluoro-1,1,2,2-tetrahydrooctyl trichlorosilane with water. The treatment layer reduces the surface free energy of the bottom surface to less than 40 or 20 dynes/cm, measured at 25[deg]C. The template has conductive coating and reflective coating on edges. A mirror is also coupled to the edge of the template. A gap sensing area is also formed in a portion of the template. Independent claims are also included for the following: (1) a device formed using imprint lithography template; (2) the production of an imprint lithography template, which involves forming multiple recesses on the bottom surface, by etching or using optical lithography, electron beam lithography, ion beam lithography, X-ray lithography, extreme ultraviolet lithography, scanning probe lithography, focused ion beam milling, interferrometric lithography, epitaxial growth, thin film deposition, chemical etch, plasma etch, ion milling or reactive ion etch processes, where the bottom surface of the template is planar, parabolic or spherical, and then shaping the template and forming a surface treatment layeron the template using a vapor-phase reaction process, with the patterned template and a substrate (20) aligned subsequently; (3) the production of a pattern on a substrate using a patterned template, which involves determining the alignment between the template and the substrate by applying a pair of wavelengths of light through the patterned template, such that the light causes substrate alignment mark to be in focus and the template alignment mark to be out of focus with respect to an analysis tool. The alignment is also determined using polarizing light alignment tool and placing polarizing filter system between the tool and the patterned template. The alignment is also determined by using a moire pattern detector. The alignment determination method involves determining the centers of the substrate and template alignment marks. Then, the overlay placement of the patterned template and substrate is adjusted by altering the angle of orientation of the patterned template with respect to the substrate and altering the dimensions of patterned template by altering the temperature of the patterned template or by applying compressive force to the patterned template or by applying elongating force to the patterned template. The patterned template is parallely moved towards the substrate until a predetermined gap is maintained between the template and the substrate. The gap is filled with liquid without air bubbles. The gap is less than 200 nm. Alternately, the alignment determining method involves determining error signal corresponding to difference between desired distance between template and substrate and determined distance between the template and substrate. Actuators are provided to adjust the relative position between the template and substrate based on the error signal; and (4) a device for holding an imprint lithography template, which has an opening and supporting plate for receiving and supporting the imprint lithography template. A piezoactuator is also coupled to the device for altering the physical dimension of the imprint lithography template during use. The supporting plate having quartz, silicon dioxide or sapphire spans to the opening in the device. The supporting plate is also provided with vacuum opening for applying vacuum to the template.