baber/WOPTO huggingface dataset:
Patent JP-H1173651-A (JP)
Title: Optical storage device
Inventor: YAMASHITA TOMONORI
IPC: G11B11/105
Filed: 1997-08-28
Abstract: PROBLEM TO BE SOLVED: To stabilize seek control and to arrange an accurate seek position in a target track by judging a zero-cross error detection of a tracking error signal due to an ID part or noise. SOLUTION: In a low speed seek control part 85, when the zero-cross error detection is judged by an error detection judging part 218 during the seek time, a correct speed is predictively calculated by a speed predicting calculation part 224, based on a zero-cross interval time of a detected track as the one having no error in the previous time, and the predicted speed in place of the detected speed is supplied to a speed control part 115-1 to perform speed control, and count value of a track counter 110 is returned to a value before the error detection by a counter correcting part 225.  In a high speed seek control part 86, when a zero-cross error detection is judged by an error detection judging part 232, a correct speed is predictively calculated by a speed predicting calculation part 234, and the predicted speed in place of the detected speed is supplied to a speed control part 115-2 to perform speed control, and a count value of a track counter 110 is corrected to a correct value by a counter correcting part 236.
Patent JP-H04112561-A (JP)
Title: Semiconductor element
Inventor: HARADA SATORU
IPC: H01L25/16
Filed: 1990-08-31
Abstract: PURPOSE:To reduce an effect on a functional circuit of a diode, etc., in a protective circuit as the trigger of a latch-up phenomenon by installing the protective circuit between a functional circuit chip and an inner lead and electrically connecting the chip and the inner lead respectively. CONSTITUTION:In a semiconductor element, a protective circuit 3 is mounted between an inner lead 1 and a functional circuit chip 6, and both the lead 1 and the circuit 3 and both the circuit 3 and the chip 6 are connected electrically by bonding wires 2. Since the circuit 3 is not positioned on the same chip as the functional circuit 6, a latch-up phenomenon is reduced, latch-up strength and static breakdown strength can be reinforced simultaneously, and the reliability of the semiconductor element is improved. When the chip constituting the functional circuit is designed, the protective circuit may not be considered, a design is facilitated, the time for correction at the stage of evaluation is shortened, and cost is reduced.
Patent JP-H04117177-A (JP)
Title: Hollow type ultrasonic wave motor
Inventor: SHIRASU ISAO
IPC: H02N2/12
Filed: 1990-09-04
Abstract: PURPOSE:To obtain a stable rotary force by a high torque in a microscopic size by providing a hollow shaft rotatably supported in a casing, aligning a plurality of motors on the outer periphery of the shaft, and rotating the shaft by the drive forces of the motors. CONSTITUTION:A hollow shaft 1 is arranged in a cylindrical casing 2, and rotatably supported to the casing 2 through a ball bearing 3. A pair of rotors 4 are supported by a rotor retainer 5 provided on the outer periphery of the shaft 1, and pressed to a stator 7 through a lining material 8 by a suitable force by a belleville spring 6. The rotation of the rotor 4 is transmitted to the shaft l by a spline mechanism through the retainer 5, and the shaft l is rotated through the bearing 3 in the casing 2. Thus, a stable rotary force is obtained by a high torque in a microscopic size adapted for a motor to be used for repairing a sleeve.
Patent JP-S6387606-A (JP)
Title: Composite magnetic head
Inventor: URAI AKIRA
IPC: G11B5/23
Filed: 1986-09-30
Abstract: PURPOSE:To attain a high effective permeability in the short wavelength area and to reduce the magnetic reluctance to show a good reproducing characteristic by alternately laminating a magnetic alloy thin film and an oxide magnetic thin film to form a ferromagnetic thin metallic film. CONSTITUTION:Magnetic core parts 11 and 12 consist of a ferromagnetic oxide, and multilayered films formed by alternately laminating magnetic alloy thin films 13a and 14a and oxide magnetic thin films 13b and 14b are formed on ferromagnetic thin film forming surfaces 11a and 12a, which are formed by obliquely cutting joint surfaces of magnetic core parts 11 and 12, continuously from front gaps forming surfaces to back gap forming surfaces, thereby constituting magnetic core half bodies I and II. Since the specific resistance of oxide magnetic thin films is relatively high, the eddy current loss of multilayered films formed by alternately laminating magnetic alloy thin films and oxide magnetic thin films is small and they have structures magnetically continuous in the laminating direction, the magnetic reluctance in this direction is suppressed. Thus, if multilayered films are used as ferromagnetic thin metallic films of a composite magnetic head, the effective permeability in the short wavelength area is secured, and the reproducing efficiency is improved.
Patent JP-H1060433-A (JP)
Title: Solidifying composition for vegetation
Inventor: SHIRASAKA MASARU
IPC: C09K17/08
Filed: 1996-08-14
Abstract: PROBLEM TO BE SOLVED: To obtain a solidifying composition useful for vegetation that is composed of a combination of a calcium aluminate-based material and dihydrated gypsum, and can efficiently solidify soil and prevent rise of hydrogen ion concentration (pH) of the soil. SOLUTION: This solidifying composition for vegetation comprises (A) a calcium aluminate-based material, such as alumina cement, and (B) dihydrated gypsum, such as natural dihydrated gypsum and by-product dihydrated gypsum, as a mixture of both component which contains 10-50wt.%, preferably 10-20wt.%, of component A, and further preferably (C) calcium chloride, which contributes to enhancement of the soil pH lowering effect, in a quantity of 1-10wt.% based on the weight of component A. The solidifying compulsion is used in condition of powder or slurry for the soil when aiming at the hardening.
Patent JP-H03267070-A (JP)
Title: Device for stimulating nerve electrically and percutaneously
Inventor: BERUNTO KUROITONAA
IPC: A61N1/32
Filed: 1990-09-04
Abstract: PURPOSE: To form a pulse shape matching a pulse shape measured as to a patient by triggering the base of a second transistor by means of the collector of a transistor which has received a trigger pulse, and short-circuiting an output via a discharge resistor coupled to its emitter side. CONSTITUTION: The base of the transistor T1 of an output short circuit is coupled to a trigger part via an input resistor R1 . Further the collector of the transistor T1 is coupled to one of output electrodes, and a discharge resistor Rent coupled to the emitter of a transistor T2 is coupled to the other output electrode. Trigger pulses to the transistor T1 are inverted, the transistor T2 is made to conduct according to a negative pulse edge, and its output is short- circuited via the discharge resistor Rent coupled to the emitter side, so that a main capacitor that has been charged between the pulses is discharged very rapidly. At the edge of the next positive trigger pulse, the transistor T2 is blocked to allow the pulses to reach the patient.
Patent JP-H0282493-A (JP)
Title: Thin film electroluminescence element
Inventor: KAGEYAMA YOSHIYUKI
IPC: H05B33/14
Filed: 1988-09-19
Abstract: PURPOSE:To make it excellent in long-term reliability and to make other electroluminescence EL various characteristics enough satisfactory by constituting a luminous layer out of one which contains alkaline earth chalcogenide as parent material, and constituting at least one layer among insulating layers out of a specific compound. CONSTITUTION:A luminous layer 4 is one which contains alkaline earth chalcogenide as parent material, and at least one layer between insulating layers 3 and 5 is constituted of an AIN-BN or AIN-Si3N4 compound. As the AIN-Si3N4 or AIN-BN insulating layer does not contain oxygen, in an EL element wherein this and alkaline chalcogenide are stacked, the oxidation deterioration of an alkalline earth chalcogenide layer being a luminous layer does not occur, and an element with high reliability can be obtained. Also, as the insulation breakdown mode becomes selfrestoration type, the breakdown area is small, and it is suitable as an insulating layer, and the adhesive forth to an electrode is also strong and separation is hard to occur.
Patent JP-2000065944-A (JP)
Title: X-ray energy-measuring apparatus of handy type
Inventor: OZU AKIRA
IPC: G01T7/00
Filed: 1998-08-19
Abstract: PROBLEM TO BE SOLVED: To detect an energy of X-ray pulses by measuring only one X-ray pulse by adding a substance such as metal or the like to an X-ray linear image sensor which attenuates X rays. SOLUTION: A substance 7 of a material shielding X rays, e.g. metal or the like is set in front of an incident face of X rays of an X-ray linear image sensor with or without a scintillator (fluorescent body). A thickness of the substance is changed in a longitudinal direction of the sensor. When X-ray pulses 6 enter within a gate time of the linear image sensor, a signal value corresponding to the X-ray pulse attenuated by the thickness of the substance shielding at each position can be obtained from a cell of the position of the linear sensor. An attenuation curve of X, radioactive rays (relationship between the thickness of the substance and a quantity of attenuated × rays) when the material is used can be simply obtained from the thickness and the quantity of X rays of the sensor at the position of the thickness.  The attenuation curve is known for each substance, for each X-ray energy and the X-ray energy can be obtained from an inclination of the attenuation curve.
Patent JP-S61111564-A (JP)
Title: Manufacture of semiconductor device
Inventor: ONO JUNICHI
IPC: H01L27/118
Filed: 1984-11-05
Abstract: PURPOSE:To manufacture of the title device of arbitrary logic in a short time by a method wherein all the processes to the formation of the first wiring layer is made common, and the first logic wiring is formed by cutting desired wiring tracks. CONSTITUTION:After formation of an n<+> diffused layer 1, a p<+> diffused layer 2, and a gate oxide film and poly Si gate 3, contact holes 4 are bored, and all the wiring tracks 5 are connected into the first wiring layer. The processes so far are made common. For example, the semiconductor substrate is cut along the A-A line in order to form the first logic wiring out of this first wiring layer. Poly Si gates 3 are formed in a region isolated with a thick oxide film 11, via gate oxide film 12, on an n type semiconductor substrate 10, and p<+> diffused regions are formed in the substrate 10 on both sides of them. An interlayer insulation film 13 is formed on these elements, and the first wiring layers 5a are formed thereon. Further, an interlayer insulation film 14 is formed thereon, and the second wiring layer 5b is formed thereon.
Patent JP-H04113399-A (JP)
Title: Voice amplification device
Inventor: KONDO KIYOMI
IPC: G10L21/0316
Filed: 1990-09-03
Abstract: PURPOSE:To make the output voice of a 1st amplifier easy to hear by providing a 1st and a 2nd amplifier which select and amplify a 1st and a 2nd frequency band and a controller for the amplification factor of the 1st amplifier, and increasing the amplification factor of the 1st amplifier automatically when a noise including the 1st and 2nd frequency bands is generated at the periphery. CONSTITUTION:A filter 4 and a filter 5 select only the 1st and 2nd frequency bands from the entire frequency band and output them. The 1st amplifier l amplifies the output of the filter 4 with the amplification factor controlled with the control signal of an amplification factor setter 6 and the control signal of a controller 3, and outputs the amplified signal. The 2nd amplifier 2 amplifies the output of the filter 5 with a previously set amplification factor and outputs the amplified signal. The controller 3 controls the amplification factor of the amplifier l so that the difference between or the ratio of the output levels of the amplifiers l and 2 becomes constant. Then the 1st frequency band is assigned to a voice band and the 2nd frequency band is assigned to the ultrasonic wave band which is outside the 1st frequency band and nearby to increase the voice output when the noise at the periphery of a listener is loud and decrease the voice output when the noise is small.
Patent JP-S6387535-A (JP)
Title: Container for microwave cooking
Inventor: MOMOTOME MASAAKI
IPC: F24C7/02
Filed: 1986-09-30
Abstract: PURPOSE:To produce a properly scorched part of a food, to apply a paper package, and to prevent the generation of spark, by a method wherein a printed film of an ink composition, containing potassium titanate reductant and conductive-material particle, is formed through a surface flat layer of ink-non-impregnated resin or an inorganic material. CONSTITUTION:By irradiating a print film, being a heat generating substance, with microwaves, both heat generating effects, produced by absorption of microwaves by potassium titanate reductant, and by a resistance loss, are produced. Simultaneously a heat generating effect by an eddy current is produced in conductive material particle dispersed in the printed film, and a food is heated and a properly scorched part of the food can be produced. In the case of a conductive material particle being metallic particle which reflects microwaves, action of reflecting microwaves and heating the food is effected. A layer having a flat surface maintains a flat state even when heat generated during microwave heating is imparted, and simultaneously, a film with a uniform thickness can be formed, and spark is prevented from generation. Through selection of print concentration, sudden heating is prevented from occurring, and paper or a composite material composed of paper and aluminium may be applied as a container.
Patent JP-S61112348-A (JP)
Title: Semiconductor element
Inventor: AZUMA TAKASHI
IPC: H01L21/3205
Filed: 1984-11-07
Abstract: PURPOSE:To manufacture a semiconductor element having gate wiring structure, which has low resistance and obtains stable MOS characteristics and to which a direct contact can be formed, by laminating a polysilicon layer, an silicide layer having stoichiometric molecular structure and a plurality of silicide layers, silicon contents therein are reduced successively, onto a gate SiO2 film in succession. CONSTITUTION:A film being in contact with a gate SiO2 film 4 is formed in second layer structure consisting of a polysilicon layer 6 and a first silicide layer 7a at a stoichiometric level, and multilayer polycide layers 8', silicon contents therein are reduced successively and a last layer therein functions as a refractory metallic layer 7, are shaped onto the film being in contact with the film 4 as a gate electrode 5'. Accordingly, a low resistance value approximately close to a refractory metallic electrode is obtained while polysilicon-SiO2-silicon MOS group structure can be held, and a direct contact is facilitated when the film 4 is brought into contact directly with an silicon bulk 1.
Patent JP-H0892959-A (JP)
Title: Head-section structure of earth retaining wall
Inventor: NOJIRI AKIYOSHI
IPC: E02D17/04
Filed: 1994-09-28
Abstract: PURPOSE: To construct an earth retaining wall having high self-supporting properties by rigidly welding one end of a broad beam having a flexural rigidity approximately equal to the flexural rigidity of the earth retaining wall to the head section of the earth retaining wall through a circumferential girder and projecting the broad end to the mountain side in a type crossing at right angles with the earth retaining wall. CONSTITUTION: A continuous underground wall 1 or a column wall 6 as a earth retaining wall is constructed up to specified depth through a normal method of construction. The mountain-side ground of the earth retaining wall is compacted sufficiently, and broad beams 2 are built onto the surface of the ground and welded rigidly to the head section of the earth retaining wall. When the broad beams 2 are erected, reinforcements in the same quantity as the quantity of the reinforcements of the continuous underground wall 1 are arranged when the broad beams 2 made of reinforced concrete are joined with the head section of the continuous underground wall 1 consisting of cast-in-place reinforced concrete, circumferential girders 3 are arranged, and concrete is placed.  When the broad beams 2 made of reinforced concrete are jointed with a column wall 6 through a method of soil cement construction, the arranged reinforcements of the circumferential girders 3 and broad beam steel frames 5 are installed to the head section of H-steel 4 as the core material of the column wall 6, and concrete is placed.
Patent JP-H04116200-A (JP)
Title: Apparatus for supplying metal ion in electroplating
Inventor: FUJINAGA TADAO
IPC: C25D17/00
Filed: 1990-09-05
Abstract: PURPOSE:To prevent explosion due to generated H2 gas, development of pressed flaw in a plating product, deterioration of characteristic value in the product, etc., and to accelerate dissolving of metal powder by arranging an N2 gas supply hole, filter, sludge discharg hole, stirrer, etc., in a metal ion supplying apparatus. CONSTITUTION:In the above apparatus 2, circulating plating liquid lowered in metal ion concn. from a supply hole 11 and metal powder 10 of flaky Zn, etc., from a supplying hole 14 are introduced, respectively. By working the stirrer 21 having stirring blades 22 at tip part, the metal powder 10 is stirred, and by giving turbulent flow to the plating liquid with baffleplates 23, the dissolving of metal powder 10 is accelerated and the plating liquid increased in the ion concn. is filtrated with a filter 17 made of 'Teflon(R)', etc., and supplied to a plating bath vessel through a discharg hole 12. Further, N2 gas is supplied from the supply hole 16 and generated H2 gas at the time of dissolving the metal powder 10, is diluted and the explosion is prevented. Further, a sludge settling part 19 is arranged at the bottom part of a vessel body 13, and by periodically discharging the deposited sludge from the discharg hole 18 with a solenoid valve 20, the deterioration of characteristic of the plating quality caused by Fe, Pb, etc., harmful to the plating, is prevented.
Patent JP-H0956539-A (JP)
Title: Display board body
Inventor: WAKURA HIROSHI
IPC: G09F5/00
Filed: 1995-08-18
Abstract: PROBLEM TO BE SOLVED: To provide a display board by suitable for hanging and displaying an article inside a ship or the like. SOLUTION: A locking member 5 made of synthetic resin into which colorant is mixed and provided with two projection pieces 2 projecting in parallel on the surface of a base plate and upward locking parts 4 having inner circular-arc surfaces 3 on the tips of the projection pieces 2 is formed. Further, the projection pieces 2 of the locking member 5 are inserted from the back surface of a display board 6 to a window hole 7 pierced through the display board 6 and an insertion clearance part is formed between the front surface of the display board 6 and the upward locking parts 4.  Also, a locking bar body 11 made of the synthetic resin into which the colorant is mixed and provided with rotary shafts 8 inserted to the insertion clearance part and freely turnably supported between the front surface of the display board 6 and the inner circular-arc surfaces 3 is formed and the locking bar body 11 is formed by providing the rotary shafts 8 on the bent part of a locking bar 10 provided with a downward bent piece 9 in an inverse U shape abutted on the front surface of the display board 6.
Patent JP-2000114885-A (JP)
Title: Power amplifier and circuit protecting device with monitoring device
Inventor: BORODULIN DMITRYI
IPC: H03F3/60
Filed: 1999-08-19
Abstract: PROBLEM TO BE SOLVED: To obtain a power amplifier with a monitoring device monitoring and protecting a system by providing a signal modulating means modulating the gain of an inputted signal and a monitor controlling means impressing a gain control signal to the signal modulating means. SOLUTION: Concerning a signal from power amplifiers PA-1 to PA-N, N inputted signal to be composed by a signal composer CB is impressed to a vector modulator 16 in a case when an RF switch 20 is on (closed), in order to provide an output signal impressed to a load L. A microcontroller MC controls the vector modulator for varying the phase and gain of an RF signal. In addition, the microcontroller MC monitors the operation of an amplifier system, varies the phase or gain of the RF signal and controls the operation of the switch 20 and a DC switch 40 to control the system. The signal modulating means varies the gain of the inputted signal and the monitor control means impresses the gain control signal to the signal modulating means in order to control the gain of the inputted signal.
Patent JP-S6285668-A (JP)
Inventor: RAINAA FUAI
IPC: H02K49/02
Filed: 1986-10-02
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H09181011-A (JP)
Title: Manufacturing of semiconductor device material thin film
Inventor: MISHIERU BURIYUERU
IPC: H01L21/265
Filed: 1996-09-03
Abstract: PROBLEM TO BE SOLVED: To provide a process to manufacture a sufficiently rigid thin film in such a degree as eliminating the use of stiffener. SOLUTION: A method for manufacturing a thin film formed of a semiconductor device material comprises a step of implanting ions 12 through the wafer surface 14 to form a dividing layer 16 consisting of gaseous microblisters within the wafer 10 to specify the range of the surface layer 18 in the wafer 10 formed of one semiconductor device material and a step for executing the heat treatment for the wafer 10 in sufficiently high temperature to separate the surface layer 18 along one fine blister layer 16. In the thin film manufacturing method, ion implantation is performed in such energy that ion implantation depth exceeds the minimum predetermined depth in order to obtain a sufficiently rigid thin film.
Patent JP-H0282682-A (JP)
Title: Multiterminal plane packaging part and method of packaging the same
Inventor: YABE NORIO
IPC: H05K3/34
Filed: 1988-09-20
Abstract: PURPOSE:To package a part by soldering by a reflow method by installing leads to the part so that the distances from the side face thereof to the packaging parts of the leads may vary alternately in zigzag form, bending the centers of the packaging parts upward in bridge form, and packaging the tips and the parts near the bent parts of the leads on a printed circuit board by plane packaging. CONSTITUTION:When an LSI package 11 is packaged on a printed circuit board 14, paste solder is printed on the footprints 15a to 15d of the printed circuit board 14. The LSI package 11 is mounted on the PC board so that the packaging parts 12c, 12e, 13c, and 13e of leads 12 and 13 may correspond to the footprints 15a to 15d on which the paste solder is printed. The leads 12 and 13 of the LSI package 11 are connected to the footprints 15e to 15d of the printed circuit board 14 at the same time by passing through the desired reflow furnace.