baber/WOPTO huggingface dataset:
Patent TW-568801-B (TW)
Title: Paste pattern forming method
Inventor: IKUSHIMA KAZUMASA
IPC: H01L21/52
Filed: 1999-10-15
Granted: 2004-01-01
Abstract: The invention intends to form a paste pattern with no variations in liquid amount while preventing a bubble from being entrapped in a step of bonding a bonded member. A paste pattern forming method wherein a drawing pattern is formed on a paste-applied body with a linearly drawn paste line. The drawing pattern is linearly drawn with a paste on the paste-applied body by using a nozzle, the paste, a paste reserving container, and paste supply means. The paste is continuously discharged from the nozzle while the paste line is being drawn. The paste line is drawn while moving any of the paste-applied body, the nozzle and the paste. The paste-applied body is a lead frame, and the paste is an adhesive for die bonding. The drawing pattern is a figure made up of a plurality of segment lines, preferably a figure in the radial form. The drawing pattern is a figure including an enclosed shape. At least one segment line is formed of two drawn lines by moving any of the paste-applied body, the nozzle and the paste to go and return. The drawing pattern is formed such that the total number of start and end points of drawn lines is not larger than the number of segment lines, and that the start and end points of drawn lines are positioned other than the ends of the drawing pattern. The drawing pattern is formed with a minimum number of points at which the drawn lines are returned in a drawing process.
Patent TW-466279-B (TW)
Title: Electrochemical half-cell
Inventor: GESTERMANN FRITZ
IPC: C25B9/19
Filed: 1999-10-29
Granted: 2001-12-01
Abstract: An electrochemical half-cell (1) is described which comprises at least a membrane (4), an electrode (3), which possibly evolves gas, as anode or cathode, possibly an outlet (8; 16) for the gas and a supporting structure (12) which links the electrode which possibly evolves gas to the half-cell rear wall (15), the supporting structure (12) dividing up the interior (13) of the half-cell (1) into vertically disposed channels (5, 9) in which the electrolyte (14) flows upwards in the electrode channels (9) adjacent to the electrode (3) and flows downwards in the channels (5) remote from the electrode (3) and in which the electrode channels (9) and the channels (5) remote from the electrode (3) are linked together at their upper end and at their lower end.
Patent TW-445189-B (TW)
Title: Laser processing apparatus and method
Inventor: MUNEYUKI KEN
IPC: B23K26/02
Filed: 2000-02-02
Granted: 2001-07-11
Abstract: To provide a laser processing apparatus and method wherewith changes in the dimensions of the work being processed can be coped with, and laser processing can be performed efficiently and with high productivity. In a laser processing apparatus wherein a laser beam 2 output from a laser oscillator 1 is branched by branching means, the branched laser beams 2a and 2b are respectively guided by scanning means 4 and 5 to process positions on work 7 being processed, and focused and irradiated by focusing means 6a and 6b onto the work 7 being processed, thereby performing laser processing with the laser beams 2a and 2b on processing areas B within prescribed ranges on the work 7 being processed, the work 7 being processed is moved relative to the focusing means 6a and 6b, and the next processing areas are sequentially laser-processed by the laser beams 2c and 2c irradiated from the focusing means, adjustment means 10 are provided for automatically adjusting the interval C between the center points of the focusing means 6a and 6b in correspondence with the size of the entire processing area A on the work 7 being processed.
Patent TW-530267-B (TW)
Title: Multimedia player for an electronic content delivery system
Inventor: GRUSE GEORGE GREGORY
IPC: H03M7/30
Filed: 2000-03-02
Granted: 2003-05-01
Abstract: A method of playing digital content data that has been compressed and encrypted with a first encrypting key on a system. According to the method, at least part of the content data is decrypted with a first decrypting key that corresponds to the first encrypting key. The decrypted content data is decompressed to produce decompressed content data, and the decompressed content data is played. In one preferred method, multiple segments of a second decrypting key that are stored separately on the system are retrieved, and the first decrypting key is decrypted using the second decrypting key. Additionally, a digital content player for playing digital content that has been compressed and encrypted with a first encrypting key is provided. The digital content player includes a decrypter for decrypting at least part of the content data using a first decrypting key that corresponds to the first encrypting key, a decompressor for decompressing the decrypted content data, and a player for playing the decompressed content data. In one preferred player, the decrypter retrieves multiple segments of a second decrypting key that are stored separately on the computer system, and decrypts the first decrypting key using the second decrypting key. Disclosed is a method and apparatus of securely providing data to a user's system. The data is encrypted so as to only be decryptable by a data decrypting key, the data decrypting key being encrypted using a first public key, and the encrypted data being accessible to the user's system, the method comprising the steps of: transferring the encrypted data decrypting key to a clearing house that possesses a first private key, which corresponds to the first public key; decrypting the data decrypting key using the first private key; re-encrypting the data decrypting key using a second public key; transferring the re-encrypted data decrypting key to the user's system, the user's system possessing a second private key, which corresponds to the second public key; and decrypting the re-encrypted data decrypting key using the second private key.
Patent TW-451369-B (TW)
Title: Semiconductor device
Inventor: YAGUCHI AKIHIRO
IPC: H01L23/12
Filed: 2000-03-16
Granted: 2001-08-21
Abstract: The present invention relates to a semiconductor device formed of an insulating tape of a conductive wiring for the external terminal and electrical connection semiconductor device, especially relates to a ball grid array (BGA) type semiconductor device of the external terminal formed of solder ball, etc. The subject of the present invention is: to prevent the broken lead generated at the external terminal when the temperature variation is repeatedly applied during the state of the semiconductor device packaged on the printed wiring substrate in the BGA-type semiconductor device. The solution of the present invention is: a soft bonding member for bonding the semiconductor device to an insulating tape is disposed to cover the range of the land of the insulating tape surface of the bonding external terminal, or cover the land with a soft, low elasticity member.
Patent TW-457665-B (TW)
Title: A cooling unit for an integrated circuit package
Inventor: ISHIDA KENZO
IPC: F25B21/02
Filed: 2000-04-13
Granted: 2001-10-01
Abstract: A cooling unit for an integrated circuit. The cooling unit may include a peltier device that may be coupled to the integrated circuit and a plurality of fins that are thermally coupled to the peltier device. The fins may be separated by at least one channel. The cooling unit may include a fan that generates a flow of fluid through the channel.
Patent TW-497312-B (TW)
Title: Switch gear and special-height metal closed type switch gear
Inventor: SATO TOSHIFUMI
IPC: H01H31/00
Filed: 2000-04-18
Granted: 2002-08-01
Abstract: A main circuit switching device 20 and a grounding switching device 30 are stored in the interior portion of a vacuum container 10, the vacuum container 10 is molded by an insulation, and a bus connecting terminal 71 and a load side transmission cable connecting terminal 72 are disposed directly in the molded portion 60.
Patent TW-497116-B (TW)
Title: Equipment to process wafers
Inventor: GOETZKE MICHAEL
IPC: B65G49/07
Filed: 2000-07-29
Granted: 2002-08-01
Abstract: This invention relates to an equipment to process wafers in at least one clean-room (3) with an arrangement of manufacture-units (1) and measure-units (2), which are connected through a transport-system to transport the cases with wafers. Several functional arranged manufacture-(1) and/or measure-units (2) are combined to a manufacture-cell (4), which has a be-und de-lood station (7) to deliver/remove the case with wafers. In the manufacture-cell (4), each wafer can be supplied to the manufacture-(1) and/or measure-unit (2) for processing.
Patent TW-490430-B (TW)
Title: Twine package, twine end fixing method and device for said twine package, and twine winding machine
Inventor: HINO TSUNEO
IPC: B65H54/72
Filed: 2000-05-25
Granted: 2002-06-11
Abstract: For a twine package having bunch winding, mount twine end fixing member that presses bunch winding on the said package to fix twine end. Thus, the twine end can be firmly fixed on the outer layer with a simple method, and a sound twine winding machine can be provided at low cost.
Patent TW-513361-B (TW)
Title: Multiple-bladed windshield wiper
Inventor: NELSON LENARDO SR
IPC: B60S1/38
Filed: 2000-07-13
Granted: 2002-12-11
Abstract: A multiple-bladed windshield wiper is disclosed in which a blade multiple edged is axially rotated in a support bracket to bring a fresh blade edge into use. The multi-edged blade has two edge elements which are received in a pair of U-shaped channels forming part of the bracket. A fresh blade may be brought into use by slidably removing the blade element from the channels in the bracket, rotating the blade, then reinserting the blade edges into the channels in the bracket.
Patent TW-456001-B (TW)
Title: Semiconductor memory device
Inventor: NAGASAWA TAKAYUKI
IPC: G11C29/00
Filed: 2000-07-13
Granted: 2001-09-21
Abstract: A semiconductor memory device having memory cells, spare memory cells to replace defective memory cells and a decision block. The decision block has a plurality of groups, each of which decides whether an input address is an address which selects a memory cell in the defective memory cells. A signal having a different address expression type of the input address is provided to each of the groups.
Patent TW-499482-B (TW)
Title: Pressure control
Inventor: BURKE PETER DAMIAN
IPC: C22B5/10
Filed: 2000-08-09
Granted: 2002-08-21
Abstract: A direct smelting process for producing molten iron and/or ferroalloys from a metalliferous feed material is disclosed. The process is a molten bath based process that is carried out in a direct smelting vessel. The process includes the steps of supplying metalliferous feed material, carbonaceous material and fluxes into the vessel; smelting metalliferous feed material to molten iron In the molten bath; and injecting an oxygen-containing gas into the vessel to post-combust gases generated in the process. The process is characterised by controlling the level of molten metal in the vessel by adjusting the pressure in the vessel.
Patent TW-568958-B (TW)
Title: Nanoporous silica treated with siloxane polymers for ULSI applications
Inventor: RUTHERFORD NICOLE
IPC: H01L21/312
Filed: 2000-08-29
Granted: 2004-01-01
Abstract: A surface-coated nanoporous silica dielectric film that is prepared by a process comprising the steps of forming a nanoporous silica dielectric coating on a substrate, and coating the formed nanoporous silica dielectric film with a coating composition comprising a polymer precursor, under conditions effective to form a strength-enhancing and/or hydrophobicity enhancing layer on the treated nanoporous silica dielectric film.
Patent TW-457741-B (TW)
Title: Planar sleeve dipole antenna
Inventor: CHEN TAI-LI
IPC: H01Q9/28
Filed: 2000-08-31
Granted: 2001-10-01
Abstract: The present invention relates to a plane printed dipole antenna apparatus that includes a layer of substrate and, the upper and the lower metal layers printed on the substrate. The upper metal layer includes the conductive strip of signal fed microstrip line and the radiation part of conductive strip with the extension of one-quarter wavelength. The lower metal layer includes the grounded surface of microstrip line and the radiation part of conductive strip with the extension of two sections of one-quarter wavelength. Signal source is fed from microstrip line. Through the extension of one-quarter wavelength conductive strip for the upper layer and two sections of one-quarter wavelength conductive strip extended from the grounded conductor for the lower layer, a set of dipole with half wavelength oscillation structure is commonly formed so as to accomplish the purpose of antenna radiation. The provided advantages include the followings: a plane antenna; a terminal edge feeding type, which greatly reduces the required empty area for the conventional plane T-shaped dipole antenna fed from center; a symmetric structure, which is beneficial to match with input impedance of the conventional microstrip line or the coaxial cable circuits such that it is easy to connect with the rear stage of circuit. The symmetric structure also makes its form of radiation field remain symmetric such that it is beneficial to the design requirement of H-plane omni-direction. In addition, substrate material is not limited in this invention and mass production is suitable for each frequency.
Patent TW-I290161-B (TW)
Title: Composition of heat insulating coating used for constant temperature protection of buildings
Inventor: SHEN HAN-TSUNG
IPC: C09D1/04
Filed: 2000-09-18
Granted: 2007-11-21
Abstract: A composition of heat insulating coating used for constant temperature protection of buildings is disclosed. An inorganic mineral is treated through a foaming process into hollow micro particles. A 40% in weight of this inorganic hollow micro particle is thoroughly mixed with 35% rubber resin and 15% titanium oxide powder to form an elastic insulating compound with 10% toluene added as additive. This elastic insulating compound can be directly applied on both indoor and outdoor surfaces of buildings, or can be coated on metals or non-metals surfaces in order to formed a constant temperature thermal protective coating layer.
Patent TW-495708-B (TW)
Title: Touch panel with high operability in low temperature environments
Inventor: HIRANO SHUNSUKE
IPC: G06F3/041
Filed: 2000-11-10
Granted: 2002-07-21
Abstract: A touch panel is constructed of a top sheet member having a resistive membrane on its inner surface and a base sheet member having a resistive membrane on its inner surface, the top and base sheet members facing each other with dot spacers being located in between. The top sheet member is formed by laminating a bulge-resistant film, a polarizing plate, a quarter wavelength plate, and a light isotropic film in this order from above. The base sheet member is constructed of a glass sheet and a reinforcement film whose thermal linear expansion coefficient is almost the same as the thermal linear expansion coefficient of the polarizing plate or the quarter wavelength plate included in the top sheet member, the reinforcement film being adhered to the lower surface of the glass sheet.
Patent TW-480694-B (TW)
Title: Semiconductor package manufacturing method having a plurality of flip chip tile structures
Inventor: LIAU JUNG-DA
IPC: H01L23/48
Filed: 2000-12-21
Granted: 2002-03-21
Abstract: There is provided a semiconductor package manufacturing method having at least two flip chip tile structures. The flip chip tile structure refers to structure having a semiconductor chip stacked on another semiconductor chip in a flip chip manner. The manufacturing method comprises: first providing a first semiconductor chip, a second semiconductor chip, and a plurality of first conductive devices, wherein the second semiconductor chip is electrically connected to the first semiconductor chip in a flip chip manner via the first conductive device, thereby forming a flip chip tile structure; then, providing a chip carrier and a plurality of second conductive devices to fix the flip chip tile structure to the surface of the chip carrier, perform a bottom resin filling process, and electrically connect the flip chip tile structure to the chip carrier via the plurality of second conductive devices, thereby constructing a package structure; then, making at least one flip chip tile structure assemble and stack to the package structure, and performing a bottom resin filling and wire soldering process to the flip chip tile structure; and finally, performing an encapsulating process to complete the package process. The present invention can package more than two flip chip tile structures in the same package unit at the same time without influencing the overall thickness of the semiconductor package, thereby greatly increasing the number of semiconductor chips arranged in an unit package area, and expanding the circuit function or memory capacity of the package unit.
Patent TW-595249-B (TW)
Title: Organic electroluminescent element structure and its manufacturing method
Inventor: JUNG JIA-TING
IPC: H01L27/32
Filed: 2001-01-08
Granted: 2004-06-21
Abstract: Organic electroluminescent element structure and its manufacturing method are disclosed. Icon patterns are formed on the organic electroluminescent element display panel. The inventive method comprises first forming rampart structures on the continuous surface of the transparent conduction film, for example, Indium-Tin oxide (ITO) and defining icon patterns by the rampart structures; and finally forming organic function layers and electrodes. This process is compatible to the conventional array type display panel process and can resolve the shortcoming of conventional skill in that production of the array type display panel and production of icons of the organic electroluminescent element are separated.
Patent TW-526249-B (TW)
Title: Polishing composition
Inventor: INA KATSUYOSHI
IPC: H01L21/304
Filed: 2001-01-11
Granted: 2003-04-01
Abstract: A polishing composition comprising an abrasive, an anticorrosive, an oxidizing agent, an acid, a pH regulator and water and having a pH within a range of from 2 to 5, wherein the abrasive is colloidal silica or fumed silica, and its primary particle size is at most 20 nm.
Patent TW-492054-B (TW)
Title: Wafer processing apparatus and method
Inventor: TRAN KHANH
IPC: H01L21/677
Filed: 2001-03-08
Granted: 2002-06-21
Abstract: A method and apparatus are described for transferring processing structures between first and second processing environments. The apparatus includes a first apparatus compartment configured to provide the first processing environment and a second apparatus compartment configured to provide the second processing environment. The apparatus is preferably configured for transferring wafer structures between the processing environments. The first and second processing environments are coupled together through a transfer passage that is opened and closed in order to isolate the wafer in a small transfer volume between the processing environments. Preferably, the transfer passage is opened and closed with first and second movable tables to create the small volume transfer cavity. In operation, the wafer is isolated within the small volume transfer cavity and the first and second tables are individually raised and lowered to expose the wafer to the first and second processing environments without opening the transfer passage between the first and second apparatus compartments. According to an embodiment of the invention, the apparatus is configured with a chemical delivery system that monitors the chemical composition or chemical concentration within the second apparatus compartment and supplies the appropriate quantity of chemical or chemicals to maintain a selected composition or concentration therein. According to a preferred embodiment the apparatus is configured for processing wafers coated with silicon-based materials to produce porous low-k coatings.
Patent TW-591991-B (TW)
Title: Copper foil with low profile bond enhancement
Inventor: CHEN SZUCHAIN
IPC: C25D7/06
Filed: 2001-03-09
Granted: 2004-06-11
Abstract: A composite material (10) includes a structural carrier layer (12) and a relatively thin metal foil layer (14) separated by a release layer (16). The release layer (16), that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a separation force for the metal foil layer (14) from the carrier strip (12) that is typically on the order of 1.79 kg/m (0.1 pound per inch) to 35.7 kg/m (2 pounds per inch). This provides sufficient adhesion to prevent premature separation of the metal foil layer (14) from the carrier layer (12), but easy removal of the carrier layer (12) when desired. The metal foil layer (14) may be electrolytically formed copper having a low height profile, on the order of 0.5 micron to 2.7 microns, bond strength enhancing agent (20) coating a side (18) of the metal foil layer (14). The enhanced surface is subsequently bonded to a dielectric (22) and the carrier layer (12) then removed.
Patent TW-I223849-B (TW)
Title: Planarization method of inter-metal dielectric layer
Inventor: YANG YI-CHUAN
IPC: H01L21/768
Filed: 2001-04-04
Granted: 2004-11-11
Abstract: A planarization method of inter-metal dielectric (IMD) layer proposes an IMD structure composed by a dielectric layer, a pre-planarization layer, a SOG layer and a second dielectric layer. The utilization of high flow property pre-planarization layer can achieve better planarization effect and hence avoid the metal bridge issue of the later metal connection process. The planarization method comprises the following steps: providing a semiconductor substrate on which metal connection is formed; forming a first dielectric layer that covers the metal connection on the substrate; forming a pre-planarization layer on the first dielectric layer; forming a SOG layer on the pre-planarization layer; and finally forming a second dielectric layer on the SOG.
Patent TW-510057-B (TW)
Title: Solid state imaging device fitted for electronic zooming function
Inventor: JUNG SANG-IL
IPC: H04N5/335
Filed: 2001-05-07
Granted: 2002-11-11
Abstract: A solid state imaging device fitted for an electronic zooming function and a method of the same are provided. The device has a barrier part and a discharge part to easily discharge inflow charges over the barrier part, enabling potentials of the barrier part and the discharge part to be variable by a gate electrode. This makes it possible to easily discharge fast-inflow electrons of a skipped area in an electronic zoom mode. The method includes the steps of forming a drain part at a region adjacent to a horizontal transfer stage using a high concentration impurity doping manner before forming a field insulating layer, and forming a barrier part between the horizontal transfer stage and the drain layer using an ion implantation manner of impurities that are contrary in type to the impurities implanted into the horizontal transfer stage.