baber/WOPTO huggingface dataset:
Patent TW-I252743-B (TW)
Title: High security buckle assembly
Inventor: ANSCHER JOSEPH
IPC: A44B11/25
Filed: 2000-06-14
Granted: 2006-04-11
Abstract: A buckle assembly comprising a plug portion and a socket portion. The plug portion has a base, a pair of parallel side arms attached to and extending away from the base, the side arms being flexible toward each other, and a center arm disposed between the side arms and connected to the base as well. The center arm has a push button disposed adjacent the base and a catch disposed adjacent the push button. Both the catch and push button extend upward from the center arm. Each side of the socket portion has an aperture for receiving an end of one of the side arms, and the top surface of the socket portion has spaces to allow the push button and catch to protrude therethrough when the plug portion is inserted in the socket portion. The buckle assembly is locked by inserting the plug portion into the open end of the socket portion until the side arms protrude through the apertures and the push button and catch protrude through the spaces. The buckle assembly can only be disengaged by simultaneously pressing the center push button downward and the side arms inward until the catch clears the second space and the side arms clear the apertures in the socket portion.
Patent TW-474850-B (TW)
Title: Dresser for polishing cloths and its manufacturing method
Inventor: KIMURA KENICHI
IPC: B24D3/06
Filed: 2000-07-14
Granted: 2002-02-01
Abstract: The present invention provides a dresser for a chemical and mechanical polishing cloth wherein a bonding material for retaining diamond grit is not dissolved and contamination of chemical slurry caused by dissolving of metal or peeling-off of diamond grit is prevented from occurring. A sintered product constituting the dressing face 2a is obtained by mixing a bonding material 4, consisting of silicon and/or silicon alloy with diamond grit 3, and forming and sintering the mixture. A carbide film 5 generated by sintering silicon in the bonding material into diamond is formed on the surface of the diamond grit 3. Thereby, the diamond grit is firmly bonded with the bonding material, and the bonding material is not dissolved. As a result, the contamination of the chemical slurry or the peeling-off of the diamond grit is prevented.
Patent TW-454298-B (TW)
Title: Manufacturing method of semiconductor device
Inventor: KOBAYASHI KEN
IPC: H01L21/76
Filed: 2000-07-20
Granted: 2001-09-11
Abstract: The present invention discloses a kind of manufacturing method of semiconductor device that includes the following steps. A silicon nitride film is formed on a semiconductor substrate and is followed by forming a CVD silicon oxide film on the silicon nitride film. By using a resist mask, the silicon nitride film and the CVD silicon oxide film are patterned. After peeling off the resist mask, a groove is formed by etching the substrate through the use of the patterned silicon nitride film and the patterned CVD silicon oxide film as masks. An insulating material is embedded in the groove and the insulating material, and silicon nitride film is used as the stopper to make planar. In this manufacturing method, an annealing process of the substrate is included after the formation of CVD silicon oxide film and before the etching of the substrate.
Patent TW-445611-B (TW)
Title: Encapsulating method of semiconductor device
Inventor: SU ZHAO-YUAN
IPC: H01L23/28
Filed: 2000-08-01
Granted: 2001-07-11
Abstract: An encapsulating method of semiconductor device is revealed, which comprises the following steps: (a) provide a molding device which comprises a molding portion with a cavity to accommodate the semiconductor device, and a plurality of eject pins; (b) clamp the mold tightly so that the semiconductor device is located in the cavity; (c) inject the encapsulating material into the cavity; (d) harden the encapsulating material to form an encapsulating body to wrap the semiconductor device, wherein the encapsulating body has a plurality of bulge portions corresponding to the plurality of eject pins; (e) open the mold; (f) eject the mold product out of the cavity by using the plural eject pins, wherein the plural mold-slipped-off holes formed by eject pins are located at the bulge portion of the encapsulating body.
Patent TW-499401-B (TW)
Title: Method of treating silica-containing mud sludge
Inventor: HASEGAWA MASATAKA
IPC: C02F11/14
Filed: 2000-08-03
Granted: 2002-08-21
Abstract: Solidification products of excellent strength and low water absorption are obtained by treatment of mud cake (silica-containing mud sludge) such as the sludge resulting from construction the effluent water cake resulting from treatment of dredged mud, the effluent water cake resulting from crushing plants (including gravel plants) and the fine powder resulting from the crushing plant, by a method comprising a mixing step of mixing the calcium compound with the silica-containing mud sludge to obtain the mud-like raw material a granulating the mud-like raw to obtain the granulating products and a hydrothermal solidification step of solidifying the granulation product by a hydrothermal treatment, the products being used in wide application and in great demand.
Patent TW-527571-B (TW)
Title: Image noise eliminating device using time domain method
Inventor: HUANG HO-CHAO
IPC: G06K9/00
Filed: 2000-08-19
Granted: 2003-04-11
Abstract: The image noise eliminating device using time domain method of the present invention includes: a first register for sequentially storing the processed frames; a second register for sequentially storing a delayed frame by delaying a feedback frame for a frame time; a first multiplying device for sequentially multiplying the processed frames with a first predetermined weighting constant to form a first image signal; a second multiplying device for sequentially multiplying the delayed frames with a second predetermined weighting constant which is equal to 1 subtracted from the first predetermined weighting constant, thereby forming a second image signal; and an adding device for sequentially adding the first image signal and second image signal to form a resultant frame to be outputted as the feedback frame.
Patent TW-455519-B (TW)
Title: Zirconium oxide blank by powder injection molding and blending process thereof
Inventor: WEI WEN-CHENG
IPC: B22F3/00
Filed: 2000-09-20
Granted: 2001-09-21
Abstract: The present invention discloses a zirconium oxide blank by a powder injection molding and a blending process thereof. The material thereof uses a high purity, partially-stabilized zirconium oxide (Mg-PSZ) powder, which contains 0.1-3.5 wt% of a magnesium oxide powder. The powder is mixed with a binding agent, a plasticizer, and various surfactants. The mixer is then blended in a Σ blender to produce a uniform zirconium oxide blank which contains a highly pure, sub-micron powder with a solid content higher than 50 vol%. The zirconium oxide according to the present invention contains a surfactant with an ester functional group to provide the dispersion and wetting properties needed by the partially stabilized zirconium oxide powder in the wax-based plastic injection material. The ester surfactant and stearic acid form a multifunctional composite surfactant to provide the effects of lubricating the mold and reducing the viscosity of the blank. The zirconium oxide injection blank has a better dispersion property, a lower viscosity, a good wetting property and uniformity during blending. Therefore, the solid content in the injection blank can be increased.
Patent TW-478300-B (TW)
Title: Base webs for printed circuit board production using the foam process and acrylic fibers
Inventor: KOMLENIC ROD
IPC: D21F11/00
Filed: 2000-09-26
Granted: 2002-03-01
Abstract: A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 50% by weight acrylic fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and may contain 60-80% straight polyacrylonitrile fibers and 40-20% fibrillated (pulp) ones. The web or sheet is preferably compressed by thermal calendering so that it has a density of about 0.1-1 grams per cubic centimeter; and the web or sheet may have a basis weight of between about 20-120 grams per square meter. The web or sheet may also have a 1-40% of substantially electrically non-conductive organic or inorganic binder, or may be substantially binder free. A printed circuit board made using the layers of these non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics, and has improved properties compared to woven glass and non-woven aramid products, including improved fiber consolidation, easy board construction, and improved MD/CD ratio and stability.
Patent TW-465038-B (TW)
Title: A method to form metal-insulator-metal capacitors by using copper inter-metal connection during mixed mode signal process
Inventor: TZENG LING-SHIU
IPC: H01L21/768
Filed: 2000-10-30
Granted: 2001-11-21
Abstract: This invention discloses a method to form metal-insulator-metal (MIM) capacitors and inter-metal connections during mixed mode signal process. The method at least includes providing a substrate, which has plural conducting blocks under its surface. Then, the first nitride layer, the first inter-metal dielectric layer, the second nitride layer, and the second inter-metal dielectric layer are formed in order on the substrate. After that, the first photo mask is formed on the second inter-metal dielectric layer. This photo mask contains the first opening exposing the second inter-metal dielectric layer. Then, by using the first etching process, a through-layer hole is formed at the location of the first opening penetrating through the second inter-metal dielectric layer, the second nitride layer, the first inter-metal dielectric layer, and the first nitride layer and exposes one of the conducting blocks. Then, the second etching process is used to form a hole located above one of the conducting blocks and exposing the first nitride layer. At last, the via hole and this hole are filled with a conducting material to form a metal-insulator-metal capacitor and inter-metal connection.
Patent TW-486625-B (TW)
Title: Electronic authentication method
Inventor: MEYA TATSUHIRO
IPC: H04L9/32
Filed: 2000-11-07
Granted: 2002-05-11
Abstract: A method is provided to transmit and receive a safe security mail with simple procedures. Each user (A, B, ...) registers personal authentication information, which is individually generated and is respectively proper to the user, in a key center KC on-line, and the key center KC manages the personal authentication information transmitted from each user. When the user A sends a message to the user B, the user A sends a key for communication to the key center KC on-line. The key center KC sends the enciphered key for communication to the user B, which is received from the user A, to the user B on-line. Next, the key center KC directly transmits the message enciphered with the key for communication to the user B from the user A on-line. The user B decodes the enciphered message received from the user A into plaintext by using the key for communication transmitted from the key center KC.
Patent TW-I259086-B (TW)
Title: Pharmaceutical formulation adapted for intra-muscular injection
Inventor: EVANS JOHN RAYMOND
IPC: A61K47/14
Filed: 2001-01-10
Granted: 2006-08-01
Abstract: The invention relates to a novel sustained release pharmaceutical formulation adapted for administration by injection containing the compound 7alpha-[9-(4,4,5,5,5-pentafluoropentylsulphinyl)nonyl]oestra-1,3,5(10)-triene-3,17beta-diol, more particularly to a formulation adapted for administration by injection containing the compound 7alpha-[9-(4,4,5,5,5-pentafluoropentylsulphinyl)nonyl]oestra-1,3,5(10)-triene-3,17beta-diol in solution in a ricinoleate vehicle which additionally comprises at least one alcohol and a non-aqueous ester solvent which is miscible in the ricinoleate vehicle.
Patent TW-492030-B (TW)
Title: Circuit breaker
Inventor: TOYAMA KENTARO
IPC: H01H73/04
Filed: 2001-01-19
Granted: 2002-06-21
Abstract: To improve a contact opening and closing mechanism so as to reduce the size of a circuit breaker and to facilitate user circuit opening operation and operations. A circuit breaker comprises main circuit contact shoes disposed in a circuit breaker case at a bottom thereof and compelled by a contact spring, a contact opening and closing mechanism 12 located above the contact shoes and including a combination of an opening and closing lever 10, a toggle link, an opening and closing handle 11, and a latch 17, and an overcurrent tripping device also located above the contact shoes. The toggle link comprises a first link 16 extended between the opening and closing lever and a toggle shaft 15 located above and a second link 18 extended between the toggle shaft and the latch in such a manner as to overlap the first link in the form of a ""V"", and an opening and closing spring 21 is extended between the toggle shaft and a tip of a handle lever 11a coupled to the opening and closing handle 11 to extend downward. As a result, a space occupied by the contact opening and closing mechanism section in the height direction can be reduced to make the circuit breaker more compact.
Patent TW-507392-B (TW)
Title: Separator for a high energy rechargeable lithium battery
Inventor: ZHANG ZHENGMING
IPC: H01M50/457
Filed: 2001-03-16
Granted: 2002-10-21
Abstract: The instant invention is directed to a separator for a high energy rechargeable lithium battery and the corresponding battery. The separator includes a ceramic composite layer and a polymeric microporous layer. The ceramic layers includes a mixture of inorganic particles and a matrix material. The ceramic layer is adapted, at least, to block dendrite growth and to prevent electronic shorting. The polymeric layer is adapted, at least, to block ionic flow between the anode and the cathode in the event of thermal runaway.
Patent TW-503399-B (TW)
Title: Design structure of memory array
Inventor: GUO NAI-PING
IPC: G11C5/00
Filed: 2001-04-09
Granted: 2002-09-21
Abstract: A design structure of memory array is disclosed. There are plural memory cell columns in a memory array. Plural parallel bit-lines connect the memory cells through selective transistors. Let the adjacent bit-lines belong to different metal layers or interlaced arranging them can effectively reduce the coupling effect among the bit-lines. The read speed of the memory cell is increased and then the operation performance is improved.
Patent TW-530177-B (TW)
Title: Connecting structure of wraparound eyepiece and arm
Inventor: MIYAZAWA NOBORU
IPC: G02C5/22
Filed: 2001-04-30
Granted: 2003-05-01
Abstract: The object of the present invention is to provide a connecting structure of wraparound eyepieces and arms which makes it possible to obtain a good wearing feel by exhibiting a spring characteristic in couplings between the wraparound eyepieces and the arms and making fine adjustment possible. The wraparound eyepieces of the connecting structure between the wraparound eyepieces and the arms attached to the wraparound eyepieces by means of wraparound endpiece parts are formed to a linear shape and are formed by extending their ends in a backward direction and turning back these ends. The wraparound endpiece parts have a pair of collars and the couplings to connect these collars to each other. The ends of the wraparound eyepieces are inserted into the central holes disposed in the central parts of the collars, by which the couplings are turnably supported in the state facing a vertical direction. The arms are fixed to the couplings of the wraparound endpiece parts and the central parts of the arms and the wraparound eyepieces are position in a juxtaposition state in a horizontal direction. The ends of the arms fixed to the couplings are formed to parts to be pressed which are thrust in linear contactor surface-to-surface contact with the central parts of the wraparound eyepieces.
Patent TW-515754-B (TW)
Title: A method of extruding a continuous moulding
Inventor: ZIKELI STEFAN
IPC: B29C48/08
Filed: 2001-05-14
Granted: 2003-01-01
Abstract: The present invention relates to a method of producing a continuous moulding (11) making use of an extrusion solution containing preferably water, cellulose and a tertiary amine oxide. The extrusion solution is extruded through an extrusion-channel opening (10) so as to form a continuous moulding. The continuous moulding is conducted through an air gap (12) in which it is drawn. In order to increase the non-looping property and in order to reduce the fibrillation tendency, the present invention is so conceived that the mean acceleration and/or the mean heat flow density are controlled in accordance with predetermined formulae.
Patent TW-553814-B (TW)
Title: Bonding machine for lamellar pieces of wood to be joined to a board and method for pressing lamellar pieces of wood to boards
Inventor: JUNG ERHARD
IPC: B27M3/00
Filed: 2001-05-18
Granted: 2003-09-21
Abstract: A bonding machine for lamellar pieces of wood to be joined to a board has at least one clamping and pressing device and at least one drive, wherein the clamping and pressing device (3) has at least two pressing members (27) that are configured to be loaded independently of one another against the board (12) by a pressure force. The present invention also relates to a method for pressing lamellar pieces of wood to boards, wherein the pieces of wood have coated on at least one side thereof a bonding agent, the wood pieces being pressed together by having longitudinal edges coated with the bonding agent abutting each other, wherein the pressing force acts against a braking pressure perpendicularly acting upon the board (12).
Patent TW-I242295-B (TW)
Title: Improvements in photo detectors
Inventor: HERBERT DAVID CHARLES WILFRED
IPC: H01L31/107
Filed: 2001-05-22
Granted: 2005-10-21
Abstract: A horizontal access semiconductor photo detector (2) comprising a horizontal light absorbing layer (8) for converting light into photo-current which layer is configured to confine light within it in whispering gallery modes of propagation. The detector is configured to have a first waveguide portion (18) and a second light confining portion (20, 21) arranged such that the waveguide portion couples light into the detector and transfers light into the light confining portion so as to excite whispering gallery modes of propagation around the light confining portion. The light absorbing layer may be part of the light confining portion or alternatively light can be coupled into the light absorbing layer from the light confining portion by evanescent coupling. The excitation of whispering gallery modes within the light absorbing layer significantly increases the effective absorption coefficient of the light absorbing layer.
Patent TW-495792-B (TW)
Title: Display device comprising a deflection unit
Inventor: WASSINK MICHIEL HARJON
IPC: H04N3/16
Filed: 2001-06-15
Granted: 2002-07-21
Abstract: A color display device comprising a cathode ray tube and a deflection unit is described. The display device includes compensation coils for correcting a raster distortion in the raster displayed on the screen and means for providing correction currents through the correction coils. The ratio between the correction current I24 and the vertical deflection current I21 is higher at half vertical deflection than at full vertical deflection.
Patent TW-523669-B (TW)
Title: South bridge chip and north bridge chip connection architecture for multiple selections
Inventor: PENG SHENG-CHANG
IPC: G06F13/40
Filed: 2001-07-12
Granted: 2003-03-11
Abstract: The present invention discloses a south bridge chip and north bridge chip connection architecture for multiple selections. It includes a north bridge chip and a south bridge chip with a private link bus. By applying the principle of disabling and enabling the bi-directional communication with bus arbiter, the up/down controller and the peripheral component interconnect (PCI) response device in the south bridge chip can make various linkages in accordance with the designer's requirements and operate under different modes. Thus, not only manpower and material wastage caused due to the necessity of a redesign when peripherals are unable to cooperate can be reduced but also, with chip unification, factory internal material control efficiency can be improved.
Patent TW-511180-B (TW)
Title: Mixed acid solution in etching process, process for producing the same, etching process using the same and process for producing semiconductor device
Inventor: HAGA SADAO
IPC: H01L21/306
Filed: 2001-07-25
Granted: 2002-11-21
Abstract: There is disclosed an etching solution containing at least hydrofluoric acid, nitric acid and hexafluorosilicic acid wherein the concentration of hexafluorosilicic acid is not less than 10% by weight based on the weight of the etching solution.
Patent TW-487788-B (TW)
Title: Hydrostatic gas bearing
Inventor: MUKAI TOSHIO
IPC: F16C32/06
Filed: 2001-08-06
Granted: 2002-05-21
Abstract: The present invention has its objection to provide a hydrostatic gas bearing excellent in vibration-damping characteristic. The hydrostatic gas bearing is provided with a gas ejecting equipment composed of a cylindrical fine hole having a diameter of not less than 0.04 mm and not more than 0.4 mm, wherein a helium gas is ejected through the cylindrical fine hole. The cylindrical hole has a diameter D and a length L, and in the case where a relationship of D4/L is not more than 2x10<SP>-4</SP> mm<SP>3</SP> is established, the hydrostatic gas bearing excellent in vibration-damping characteristic is specifically realized.
Patent TW-I290726-B (TW)
Title: Method of manufacturing passive devices on a semiconductor substrate
Inventor: BEHAMMER DAG
IPC: H01L21/8222
Filed: 2001-08-10
Granted: 2007-12-01
Abstract: Methods are specified for producing passive components on a substrate, which methods permit, with a low outlay and a good yield, the production of different components, in particular high-resistance and low-resistance resistor elements and/or capacitor elements having a higher and those having a lower capacitance per unit length on a substrate. In this case, lift-off processes can largely be dispensed with, particularly in the case of critical patternings, and selective dry-and/or wet-chemical etching can be effected.