Patent AU-2020314513-B2 (AU)
Title: Manufacturing method for shingled assembly and shingled assembly
Inventor: DING ERLIANG
IPC: H01L31/05
Filed: 2020-09-27
Granted: 2023-04-06
Abstract: if§t@&NJ F~d 9WJ -N |i EP il 
(10)9)a 
'43 PdVT WO 2021/008634 A4 
2021 4 1fl - 21 (21.01.2021) WIPO T PWC0T 
(51) pW j}4-: (72) &PA :T -- 5(DING, Erliang); +Pd W SW E 
HO1L 31/05 (2014.01) i % X -K T Z i1888, Anhui 230000 (CN) 
(21) I1p5 i(NY : PCT/CN2020/118132 TJI &$ (SUN, Jun); + li M& SE & T 1 E 
V9*i888t, Anhui 230000 (CN) oWPrf(YIN, 
(22) 'R8 iN : 2020 9 f] 27 H (27.09.2020) Bingwei); +E % 3 X K T 
(25) $j' jg : i888 , Anhui 230000 (CN)o   p, Ni(CHEN, 
Dengyun); + HE NrW Nif -KTtil 
(26)4& v +7:888 ,Anhui 230000 (CN)o (LI, Yan); + 
(30) M£2t: M f A^E rii A x T * 888 Anhui 
202010076474.X 20201f] 23 H (23.01.2020) CN 230000 (CN) ; NTi (SHI, Gang); +P M 
(71) $ iA : a # F t4 4; PR / is] (CHENGDU Anhui 230000 
YEFAN SCIENCE AND TECHNOLOGY CO., LTD.) (CN)o i fi(XIE,Yi); +E I if 
[CN/CN]; + l H )Il @ ) 4 r - V F f B E K T 1i 888 Anhui 230000 (CN)o   2l Y 
A M M 599 - )Q 4+H D 6 % 505 yt(LIU,iHanyuan); +Pd K 
,Sichuan 610041 (CN)o   TA 1888, Anhui 230000 (CN)o 
(54) Title: MANUFACTURING METHOD FOR SHINGLED ASSEMBLY AND SHINGLED ASSEMBLY 
=~(54)&liA: Tt4+ltA42khI+ 
121a 
123 
121b 13 
> 131 
14 5 
145 
16a 
D2 11 16b 
D1X 112 
113 
(57) Abstract: The present invention relates to a method for manufacturing a shingled assembly, and a shingled assembly. The method 
Comprises the following steps: arranging solar cell pieces and conductive pieces in a shingled manner on a top surface of a bottom 
encapsulation structure along a second direction to form a plurality of cell strings, such that the conductive pieces are positioned at back 
CA ends of the cell strings, and the cell strings being arranged along a first direction perpendicular to the second direction to form a cell 
piece array; providing a first bus bar and a second bus bar on a top side or a bottom side of he cell piece array, so as to cause the first
W O 202 1/00863 4 A 4 |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||| 
(74) (tTA: dL A $ $1[ fth$ -ff (KING& 
WOOD MALLESONS); lid L i f EXTK 
20)P, Beijing 100020 (CN)o 
Ef)f) : AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, 
BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, 
CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, 
GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, IT, 
JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, 
LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, 
MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, 
PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, 
ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, 
UZ, VC, VN, WS, ZA, ZM, ZWc 
fi)): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, 
NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), RIl (AM, 
AZ, BY, KG, KZ, RU, TJ, TM), RJI(AL, AT, BE, BG, 
CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, 
IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, 
RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, 
CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).  
- Af f fG&9 2%3) 
- t$tf iE fl $ % , it#9 219(2) (a)* M ) 
2021 4 2 f] 18 H (18.02.2021) 
bus bar to be in electrical contact with a main gate line of the solar cell piece at the front end of each cell string, and the second bus 
bar to be in electrical contact with the conductive piece of each cell string; and laminating a combined structure of a top encapsulation 
structure, the cell piece array, and the bottom encapsulation structure. The method provided in the present invention is able to combine 
arraying processing and shingling processing, directly shingling and arraying cell pieces on a bottom encapsulation material, and doing 
so is low-cost, high-efficiency, and easy to operate.  
rpk VA a N M - A L AL& A nltttF% LkItLnlt 
d *fltIIA St I* k0 t4 thdfltS4 irp1L ktu Yi~3- ~A :11, 
f t n h1LI-, ) T X ½4&3 tfAltn fl4W& I)IN I" 1