baber/WOPTO huggingface dataset:
Patent TW-202103213-A (TW)
Title: Dual-station processor and plasma processing equipment for achieving uniform exhaust improving the uniformity of the reaction gas distribution on the surface of the substrate in the reaction chamber in the plasma processing equipment
Inventor: LEI LARRY
IPC: H01J37/32
Filed: 2020-06-09
Abstract: Disclosed are a dual-station processor and plasma processing equipment for achieving uniform exhaust. The dual-station processor includes two adjacently arranged plasma processing chambers and a shared exhaust pump, and each plasma processing chamber is provided therein with a gas injection device and a base for supporting the substrate; a plasma confinement device is arranged around the periphery of the base in each plasma processing chamber, and an exhaust area is provided under each plasma confinement device. There are two exhaust passages between every plasma processing chamber and the exhaust pump. Each exhaust passage has an air inlet and an air outlet, wherein the air inlet is connected to the exhaust area in the plasma processing chamber, and the air outlet is connected to the exhaust pump. The invention improves the uniformity of the reaction gas distribution on the surface of the substrate in the reaction chamber of the plasma processing equipment, thereby improving the uniformity of substrate etching, and increasing the qualified rate of substrates.
Patent TW-202146502-A (TW)
Title: Liquid-state reactive polyurethane adhesive
Inventor: LIU SHIH-WEI
IPC: C08G18/20
Filed: 2020-06-11
Abstract: The present disclosure provides a liquid-state reactive polyurethane adhesive, including a polyurethane prepolymer. The polyurethane prepolymer is blocked by an isocyanate group, and the polyurethane prepolymer is obtained by a polymerization reaction. The reaction monomer of the polymerization reaction includes a polyisocyanate, a polyol, a stabilizer, a catalyst and a hydrophobic filler. The functionality of the polyisocyanate is 2.4 to 3. The molecular weight of the polyol is 1000 to 8000, and has hydrolysis resistance. The stabilizer has a structure represented by formula (I), and the catalyst has a structure represented by formula (II), in which each symbol is as defined in the specification. Accordingly, the liquid-state reactive polyurethane adhesive of the present disclosure has the effects of excellent adhesive strength and non-toxic by different components and formulations. That is favorable for the adhesive for structural woodworking.
Patent TW-202116297-A (TW)
Title: Combination therapy methods, compositions and kits
Inventor: VILLOSLADA DIAZ PABLO
IPC: A61P25/28
Filed: 2020-07-01
Abstract: Invention relates to combinations comprising: a) a compound of formula (I) 
or a pharmaceutically or veterinary acceptable salt thereof, wherein:
R 1 
R 2 
and R 3 
have particular meaning; and (b) one or more drugs selected from the group consisting of i) a compound of formula (IV), or a pharmaceutically or veterinary acceptable salt thereof, 
wherein R 5 
and R 6 
have particular meaning, ii) a sphingosine-1-phosphate receptor inhibitor (S1PR modulator), and iii) a Signal transducer and activator of transcription 3 (STAT3) inhibitor. Particular combinations and single pharmaceutical compositions and kits of parts are disclosed. These combinations, single pharmaceutical compositions and kits of parts are for use in the treatment and/or prevention of an inflammatory neurological disease or condition which can result in the destruction or degeneration of axons or myelin in a subject in need thereof
Patent TW-202132070-A (TW)
Title: Computer program and computer-implemented method providing automation windows for robotic process automation
Inventor: HALL ANDREW
IPC: G06F9/54
Filed: 2020-07-17
Abstract: Automation windows for robotic process automation (RPA) for attended or unattended robots are disclosed. A child session is created and hosted as a window including the user interfaces (UIs) of applications of a window associated with a parent session. Running multiple sessions allows a robot to operate in this child session while the user interacts with the parent session. The user may thus be able to interact with applications that the robot is not using or the user and the robot may be able to interact with the same application if that application is capable of this functionality. The user and the robot are both interacting with the same application instances and file system. Changes made via the robot and the user in an application will be made as if a single user made them, rather than having the user and the robot each work with separate versions of the applications and file systems.
Patent TW-202206979-A (TW)
Inventor: HO HSUAN-WEI
IPC: G06F3/02
Filed: 2020-08-05
Abstract: The invention discloses an illuminated keyboard, comprising: a first keycap group and a second keycap group, and a backlight module. The first keycap group and the second keycap group respectively have a plurality of keycaps. The backlight module has a first light-emitting unit, a second light-emitting unit, a first resistor, a second resistor, a light guide plate, and a circuit board. The light-emitting elements in the first light-emitting unit and the second light-emitting unit are respectively electrically connected to each other in parallel. The first resistor is electrically connected with the first light-emitting unit in series, and the second resistor is electrically connected with the second light-emitting unit in series. The light guide plate is provided with a plurality of through holes, and the circuit board is disposed under the light guide plate. The first light-emitting unit, the second light-emitting unit, the first resistor and the second resistor are disposed on the circuit board. The sum of a first light-emitting area of the keycaps of the first keycap group is not equal to the sum of a second light-emitting area of the keycaps of the second keycap group.
Patent TW-202127705-A (TW)
Title: Semiconductor structure
Inventor: LIN CHIA-HUA
IPC: H01L51/54
Filed: 2020-08-05
Abstract: A semiconductor structure is provided. The semiconductor structure includes metallization structure, a plurality of conductive pads, and a dielectric layer. The plurality of conductive pads is over the metallization structure. The dielectric layer is on the metallization structure and covers the conductive pad. The dielectric layer includes a first dielectric film, a second dielectric film, and a third dielectric film. The first dielectric film is on the conductive pad. The second dielectric film is on the first dielectric film. The third dielectric film is on the second dielectric film. The a refractive index of the first dielectric film is smaller than a refractive index of the second dielectric film, and the refractive index of the second dielectric film is smaller than a refractive index of the third dielectric film.
Patent TW-202116178-A (TW)
Title: Methods of binding textured substrates using mycelium-producing fungi and food products formed therefrom
Inventor: KIMBERLIE LE
IPC: C12R1/66
Filed: 2020-08-10
Abstract: Described herein are various embodiments of methods for binding together textured substrates using mycelium-producing fungi. The method can generally include providing a textured substrate, such as a textured protein substrate, that may or may not be subjected to various pre-processing steps used to help promote mycelium growth inside, outside or inside and outside of the textured substrate, inoculating the textured substrate with mycelium-producing fungi, and growing mycelium inside, outside, or inside and outside of the textured substrate to bind the textured substrate. The bound textured substrate can be used as a high protein food, such as meat substitutes, meat analogues, or seafood analogues. In some embodiments, the mycelium-producing fungi is used to bind together multiple textured substrates to form larger composite food products.
Patent TW-202115493-A (TW)
Title: Resist composition and patterning process
Inventor: HATAKEYAMA JUN
IPC: H01L21/027
Filed: 2020-08-20
Abstract: A resist composition comprising a base polymer and an acid generator containing a sulfonium salt which is structured such that an iodized or brominated hydrocarbyl group (exclusive of iodized or brominated aromatic ring) is bonded to a benzene ring via an ester bond-containing group offers a high sensitivity, minimal LWR and improved CDU independent of whether it is of positive or negative tone.
Patent TW-202213815-A (TW)
Title: Die structure of light-emitting diode comprising a substrate, a metallic contact layer on the substrate, a light-emitting semiconductor layer on the metallic contact layer, an insulation protective covering the metallic layer and the light-emitting semiconductor layer, and a metallic conductive layer
Inventor: CHEN FU-BANG
IPC: H01L33/26
Filed: 2020-09-15
Abstract: The present invention relates to a die structure of a light-emitting diode, which comprises a substrate. A metallic contact layer is disposed on the substrate. A light-emitting semiconductor layer is disposed on the metallic contact layer. Further, an insulation protective layer covers the metallic contact layer and the light-emitting semiconductor layer. The insulation protective layer has a first opening that exposes the light-emitting semiconductor layer and a second opening that exposes the metallic contact layer. An end of a first metallic conductive layer extends through the first opening to electrically connect to the light-emitting semiconductor layer, and an opposite end is extended atop the insulation protective layer. A first electrode pad and a second electrode pad are respectively located at lateral sides of the light-emitting semiconductor layer and are arranged to be disposed on the metallic conductive layer and to be extended through the second opening to dispose on the metallic contact layer, respectively. As such, the present invention allows the first and second electrode pads to be not located above the light-emitting semiconductor layer to prevent the light-emitting semiconductor layer from being damaged by the pressing force applied in a wire bonding process.
Patent TW-202124522-A (TW)
Title: Fluorine-containing compound, surface treatment agent, fluorin-containing composition, coating liquid, article, and compound
Inventor: TAKASHITA RYUTA
IPC: C07F3/02
Filed: 2020-09-18
Abstract: The present invention provides: a fluorine-containing ether compound, a fluorine-containing ether composition and a coating liquid, each of which is capable of forming a surface layer that has excellent durability; an article having a surface layer that has excellent durability; and a compound which is useful as a starting material of this fluorine-containing ether compound. A fluorine-containing ether compound which is represented by formula (A1) or formula (A2). Formula (A1): Rf-O-(Rf1O)m-Rf2[-R1-C(-R2-T)a(-R3)3-a]b Formula (A2): [(T-R2-)a(R3-)3-aC-R1-]bRf2-O-(Rf1O)m-Rf2[-R1-C(-R2-T)a(-R3)3-a]b In the formulae, the symbols are as defined in the description.
Patent TW-202131888-A (TW)
Title: High efficiency external counter pulsation system and method of treatment using the system
Inventor: YANG FU-LIANG
IPC: A61B5/02
Filed: 2020-09-21
Abstract: An external counter pulsation system (ECP) and method for using the system to improve circulation as well as cardiovascular related diseases. The ECP system of the present invention comprises a helical air bladder for modulating blood flow of major veins and arteries of the thigh. High efficiency is realized with the helical shape of the air bladder to lower the cost, weight and size of the ECP of the present invention.
Patent TW-202212057-A (TW)
Inventor: CHENG CHIAO-YANG
IPC: B24B53/017
Filed: 2020-09-21
Abstract: A device for dressing polish pad includes a support plate, a polish pad deposited on the support plate, an activation dresser, and a carrier. An upper surface of the activation dresser is fixed with the carrier, and a lower surface of the activation dresser contacts an upper surface of the polish pad. The activation dresser includes an upper portion and a lower portion adhesive to a lower surface of the upper portion which a coefficient of friction of the lower portion is larger than 0.15.
Patent TW-202128910-A (TW)
Title: Filamentous adhesive body
Inventor: TAKASHIMA ATSUSHI
IPC: C09J7/38
Filed: 2020-09-30
Abstract: The present invention relates to a filamentous adhesive body including a filamentous core material and an adhesive layer that coats the longitudinal surface of the core material, the core material including a biomass-derived component, and the biomass ratio of the filamentous adhesive body being 35% or greater.
Patent TW-202128927-A (TW)
Title: An adhesive composition
Inventor: XUE YIN
IPC: C09J133/02
Filed: 2020-10-12
Abstract: An adhesive composition is provided. The adhesive composition comprises the following components: (a) a polyacid polymer aqueous dispersion, wherein the polyacid polymer contains 50%~100% by weight of one or more ethylenically unsaturated mono- or dicarboxylic acid/anhydrides; (b) a hydroxyl group-containing acrylic copolymer emulsion, wherein the hydroxyl group-containing acrylic copolymer is obtained from polymerizing a monomer mixture which contains 0.1-10% hydroxyl group-containing monomer, 0.1% to 20% weight unsaturated carboxylic acid and 30%-90% acrylic monomer, wherein the solid weight ratio of the above components (a) and (b) is 0.1:100 to 10:100, based on the solids of the components (a) and (b).
Patent TW-202216401-A (TW)
Title: Sheet structure
Inventor: WANG SHUI-MU
IPC: B29B17/00
Filed: 2020-10-15
Abstract: A sheet structure includes a plurality of first recycled granule portions and a plurality of second recycled granule portions. Each of the first recycled granule portions includes a first surface layer. Each of the second recycled granule portions includes a second surface layer. The first surface layer of one of the first recycled granule portions is fusingly connected to the first surface layer of another one of the first recycled granule portions and/or the second surface layer of one of the second recycled granule portions. The second surface layer of one of the second recycled granule portions is fusingly connected to the second surface layer of another one of the second recycled granule portions and/or the first surface layer of one of the first recycled granule portions.
Patent TW-202217125-A (TW)
Title: Water guiding device, roof device having the same and roof corrugated sheet water guiding device wherein the water guiding device includes a bottom plate, a front baffle, a rear baffle and two open areas
Inventor: CHAN YA-CHING
IPC: E04D13/04
Filed: 2020-10-19
Abstract: A water guiding device suitable for guiding rainwater is disclosed. The water guiding device comprises a bottom plate, a front baffle, a rear baffle and two open areas. The bottom plate is inclined forward and downward along an inclined direction and includes two opposite ends disposed along an extending direction perpendicular to the inclined direction. The front baffle is connected to a front side of the bottom plate along the inclined direction. The rear baffle is connected to a rear side of the bottom plate along the inclined direction, and includes two connecting portions spaced apart along the extending direction and an opening opened between the connecting portions. The open areas correspond to the ends respectively. Each open area is surrounded and defined by the front baffle, the rear baffle and the respective ends. Rainwater can flow in from the opening of the rear baffle and be guided by the front baffle to flow along the extending direction and eventually flows out through the open areas. The invention can guide rainwater to avoid flooding problems.
Patent TW-202121663-A (TW)
Title: Method of forming high-voltage transistor with thin gate poly
Inventor: CHEN CHUN
IPC: H01L27/11546
Filed: 2018-07-16
Abstract: A semiconductor device and method of fabricating the same are disclosed. The method includes depositing a polysilicon gate layer over a gate dielectric formed over a surface of a substrate in a peripheral region, forming a dielectric layer over the polysilicon gate layer and depositing a height-enhancing (HE) film over the dielectric layer. The HE film, the dielectric layer, the polysilicon gate layer and the gate dielectric are then patterned for a high-voltage Field Effect Transistor (HVFET) gate to be formed in the peripheral region. A high energy implant is performed to form at least one lightly doped region in a source or drain region in the substrate adjacent to the HVFET gate. The HE film is then removed, and a low voltage (LV) logic FET formed on the substrate in the peripheral region. In one embodiment, the LV logic FET is a high-k metal-gate logic FET.
Patent TW-202119824-A (TW)
Title: Protection of speaker from excess excursion
Inventor: HODGES RICHARD
IPC: H04R3/00
Filed: 2020-10-30
Abstract: Systems and methods for protecting a loudspeaker from excessive excursion include an audio source, an adaptive excursion protection filter, an audio clipper, an inverse excursion protection filter, an amplifier and a loudspeaker. The system performs operations including receiving an audio signal, applying an excursion protection filter, the excursion protection filter adapting in real-time to one or more speaker conditions, clipping the audio signal, applying an inverse excursion protection filter, and amplifying, using an amplification circuit, the audio signal for output to the speaker.
Patent TW-202130686-A (TW)
Title: Polishing pad, preparation method thereof, and preparation method of semiconductor device using same
Inventor: AHN JAE-IN
IPC: H01L21/304
Filed: 2020-11-24
Abstract: Embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, a process for preparing the same, and a process for preparing a semiconductor device using the same. According to the embodiments, it is possible to provide a polishing pad in which the average diameter of the plurality of pores contained in the polishing pad, the sphericity of the plurality of pores, and the volume ratio thereof are adjusted, thereby enhancing the polishing speed and reducing surface such defects as scratches and chatter marks appearing on the surface of a semiconductor substrate.
Patent TW-202138394-A (TW)
Title: High molecular weight polymer sheet and method for producing same
Inventor: MIYAMURA Yasunao
IPC: C08J5/18
Filed: 2020-12-18
Abstract: In this method for producing a high molecular weight polymer sheet, when a monomer composition containing silver nanowires is to be polymerized, the monomer composition is placed at rest prior to the polymerization such that the vertical direction is the thickness direction of the high molecular weight polymer sheet to be obtained, the silver nanowires in the monomer composition are oriented along the vertical direction, and then polymerization is carried out.
Patent TW-202143481-A (TW)
Inventor: SHERIDAN DAVID
IPC: H01L29/08
Filed: 2021-01-13
Abstract: A semiconductor apparatus has a silicon carbide substrate heavily doped with the first conductivity type and a lightly doped silicon carbide drift region of the first conductivity type over the silicon carbide substrate. A first body region in the drift region is doped with second conductivity type opposite the first. A first source region in the first body region is heavily doped with the first conductivity type. A gate trench is formed in the first source region and first body region. At least one sidewall of the gate trench is parallel to a crystal plane of the silicon carbide structure having greater carrier mobility than a C-face thereof. The gate trench extends a length of the first body region and the source region to a separation region laterally adjacent to the first region wherein the separation region is in the drift region.
Patent TW-202131752-A (TW)
Title: Handling of multi-access pdu session upgrade
Inventor: HUANGFU CHIEN-CHUN
IPC: H04L29/06
Filed: 2021-02-03
Abstract: A method of handling multi-access (MA) Protocol data unit (PDU) session upgrade is proposed. An MA PDU session uses one 3GPP access network or one non-3GPP access network at a time, or simultaneously one 3GPP access network and one non-3GPP access network. A UE may be served by a network slice if a corresponding Single Network Slice Selection Assistance Information (S-NSSAI) is included in the allowed NSSAI per Radio Access Technology (RAT) access type. In accordance with one novel aspect, a UE performs additional check on whether the S-NSSAI associated with an MA PDU session is included in the allowed NSSAI for both 3GPP and non-3GPP access types before the UE sending out a PDU session establishment request or a PDU session modification request of the MA PDU session.
Patent TW-202232293-A (TW)
Inventor: YU CHIEN-HSIEN
IPC: B82Y30/00
Filed: 2021-02-04
Abstract: A touch sensor having a visible area and a peripheral area on at least one side of the visible area includes a substrate, a metal nanowire layer, and a metal layer. The metal nanowire layer is disposed on the substrate and has a first portion correspondingly in the visible area and a second portion correspondingly in the peripheral area. The metal layer is disposed on the second portion of the metal nanowire layer and has at least one extending portion extending into the visible area, in which the extending portion overlaps the first portion of the metal nanowire layer.
Patent TW-202135969-A (TW)
Title: Workpiece cutting method and resin applying device
Inventor: KURITA DAISUKE
IPC: B05C9/08
Filed: 2021-02-17
Abstract: This workpiece cutting method comprises: a first step for affixing an extensible sheet onto a front surface or a back surface of a workpiece; a second step, after the first step, for irradiating the workpiece with laser light along a cutting line to form a modified region, and extending the extensible sheet to divide at least a part of the workpiece into a plurality of chips and to form a gap present between the plurality of chips and extending to a side surface of the workpiece; a third step, after the first step, for irradiating the extensible sheet with ultraviolet radiation; a fourth step, after the second step and the third step, for filling the gap with resin from an outer edge portion of the workpiece including the side surface; a fifth step, after the fourth step, for curing the resin; and a sixth step, after the fifth step, for extracting the chips from above the extensible sheet.
Patent TW-202234333-A (TW)
Inventor: WANG JOHN C
IPC: G06F15/163
Filed: 2021-02-26
Abstract: 一種具可變能源管理方案之電動車充電管理方法及系統，適用於包括複數電動車充電站之一充電場域，且電動車充電站透過一網路與一伺服器連接。首先，於伺服器提供複數能源管理方案，其中每一能源管理方案記錄一配電邏輯，用以控制電動車充電站中之每一者所相應之一充電作業。由能源管理方案中選擇一者，並執行選定之能源管理方案以對於每一電動車充電站之充電作業決定相應之一目標電力參數值。
Patent TW-202239084-A (TW)
Inventor: HUANG MAO-JUNG
IPC: H01R24/20
Filed: 2021-03-17
Abstract: 本發明係關於一種電連接器，其具有絕緣本體、固定於前述絕緣本體的電路板和卡扣件，前述絕緣本體具有主體部及自前述主體部向前延伸的對接部，前述卡扣件具有作動部、固定於前述絕緣本體的固定部、將前述固定部與前述作動部相連的連接部及與前述作動部相對設置的兩端相連以與對接連接器相鎖扣的一對卡持臂，前述作動部與前述固定部分別與前述連接部相對設置的兩端相連，前述電連接器還具有一拉帶，前述拉帶在外力作用下被向後拉動時抵推前述作動部並使前述卡持臂的自由末端向上抬起以與對接連接器分離。
Patent TW-202203461-A (TW)
Inventor: HSU MIN-HAN
IPC: H01L21/336
Filed: 2021-03-19
Abstract: 半導體元件包括半導體鰭和在半導體鰭上方的閘極堆疊。閘極堆疊包括在半導體鰭的通道區域上方的閘極介電層，在閘極介電層上方的功函數材料層，其中功函數材料層包括摻雜劑，以及在功函數材料層上方的閘極電極層。閘極介電層不含摻雜劑。
Patent TW-202141806-A (TW)
Inventor: TSOU WEN-CHIEH
IPC: H01L31/02
Filed: 2021-03-25
Abstract: 一種光感測器封裝結構及其封裝方法，其中該光感測器封裝結構包含一基板，於一發光元件及一感光元件之間設置一導通孔；及一蓋體，覆蓋於該基板，該蓋體包含一遮擋部及一延伸部，該遮擋部設置於該發光元件和該感光元件之間，該遮擋部朝向該基板之表面設置一金屬接面，該延伸部設置一金屬側壁，該金屬側壁連接於該金屬接面。該導通孔覆蓋一導電膠，該金屬接面係接觸該導電膠。藉此，本發明的光感測器封裝結構及其封裝方法可縮小光感測器的體積、提供穩固封裝、降低封裝成本並提升產品可靠度。