baber/WOPTO huggingface dataset:
Patent TW-580574-B (TW)
Title: Wafer including an In-containing-compound semiconductor surface layer, and method for profiling its carrier concentration
Inventor: SAWADA SHIGERU
IPC: H01L21/66
Filed: 2002-10-25
Granted: 2004-03-21
Abstract: Method for non-invasively profiling carrier concentration in In-containing compound semiconductor wafers that enables employing the profiled wafers themselves in semiconductor device applications. The method, which using the C/V technique profiles carrier concentration in wafers including an In-containing-compound semiconductor surface layer, is characterized in non-invasively profiling carrier concentration by contacting a liquid electrode on the wafer surface, and without using photo-etching, employing an applied voltage that is up to a voltage surpassing 10V.
Patent TW-594025-B (TW)
Title: Method and device for determining signal transmission quality of circuit board
Inventor: PENG HIS-CHIH
IPC: G01R31/319
Filed: 2002-12-31
Granted: 2004-06-21
Abstract: A method and a device for determining the signal transmission quality of a circuit board are disclosed. An output test signal is generated by a source device and transmitted to a destination device via the circuit board. A signal transmission quality detector directly disposed on the circuit board compares the electric level change of the output test signal, resulting from signal reflection and interference, with a first and a second reference levels to obtain a comparing result. According to the comparing result, the signal transmission quality of the circuit board is determined, and a slew rate may optionally be adjusted.
Patent TW-592967-B (TW)
Title: Improved transparence properties of ITO plastic substrate
Inventor: YOU WU-BIN
Filed: 2003-02-11
Granted: 2004-06-21
Abstract: The general commercial transparent conductive substrates have two kinds, one is ITO (indium tin oxide) plasma sputtering on the glass and the other is ITO plasma sputtering on transparent substrate film. This invention is to improve transparent property of ITO sputtering on the glass or transparent substrate film. The improved method is using IZO (indium zinc oxide) sputtering onto ITO film on the glass or transparent substrate film.
Patent TW-I275602-B (TW)
Title: Hardener particle, manufacturing method for hardener particle, and adhesive
Inventor: MATSUSHIMA TAKAYUKI
IPC: C08G59/40
Filed: 2003-02-17
Granted: 2007-03-11
Abstract: To obtain an adhesive which can be cured at a low temperature in a short time and has high storability. Since a siloxane or alkoxy groups are bound to central metals located on the surfaces of the curing agent particles, the curing agent particles do not react with a silane coupling agent at a normal temperature, thereby enhancing the storability of an adhesive, when the curing agent particles and the silane coupling agent are together dispersed in an epoxy resin to obtain the adhesive. Further, since a metal chelate and a metal alcoholate in the portions excluding the surface of the curing agent particles are not bound to the siloxane, the adhesive particles are broken, when the adhesive is heated. Thus, the metal chelate and the metal alcoholate in the portions excluding the surface of the curing agent particles react with the silane coupling agent to produce cations, with which the epoxy resin is polymerized to cure the adhesive. Since the reaction of the silane coupling agent with the metal chelate proceeds at low temperature, the adhesive is cured at a lower temperature and in a shorter time than those of conventional adhesives.
Patent TW-583064-B (TW)
Title: Runner-free forming system
Inventor: WENG SHIAN-PING
IPC: B29C45/17
Filed: 2003-03-14
Granted: 2004-04-11
Abstract: A runner-free forming system is installed on an injection molding machine for molding a preform, and comprises: at least a manifold device installed at the end of a main injection heating cylinder of the injection molding machine for heating and melting the plastic material, and with one end of which having an outlet end of plural split flows; at least a mold set installed in the forward direction of the manifold device for receiving the molten plastic material and molding a preform while the mold set having an injection opening corresponding to the outlet end and forming a concave cavity on the periphery of the injection opening; a plurality of heat conductive elements pivotally positioned on the outlet end of the manifold device to allow minute axial adjustment, the heat conductive elements having a disk part with a minimum thickness clearance and a nozzle part with a protrusion on the top of its end and an axial through hole, and the bottom end of the disk part and the end of the manifold being constantly maintained at a close contact to receive thermal conduction from the manifold device; a heat insulative cap closely housed on the nozzle part of said heat conductive elements to prevent temperature drop, a through hole installed on the top thereof corresponding to the through hole of the nozzle part; and a positioning bushing axially housed on the outside diameter of the disk part of said heat conductive elements, a hollow cap-like part protruding from the top thereof corresponding to said heat insulative cap, the top end of the cap-like part being indented with an injection hole in communication with the through hole of the nozzle part for injection of the plastic material by upwardly connecting to the injection opening of the mold set and naturally forming an appropriate lining space between the cap-like part and the inner wall of the concave cavity in order to provide a double thermal insulative function with air in situ, thereby forming a runner-free forming system for forming a preform.
Patent TW-I284424-B (TW)
Title: Producing self-aligned and self-exposed photoresist patterns on light emitting devices
Inventor: COLLINS WILLIAM DAVID III
IPC: H01L33/50
Filed: 2003-03-19
Granted: 2007-07-21
Abstract: A method of forming a photoresist mask on a light emitting device is disclosed. A portion of the light emitting device is coated with photoresist. A portion of the photoresist is exposed by light impinging on the interface of the light emitting device and the photoresist from inside the light emitting device. The photoresist is developed, removing either the exposed photoresist or the unexposed photoresist. In one embodiment, the photoresist mask may be used to form a phosphor coating. After the photoresist is developed to remove the exposed photoresist, a phosphor layer is deposited overlying the light emitting device. The unexposed portion of photoresist is stripped. In some embodiments, the light exposing the photoresist is produced by electrically biasing the light emitting device, or by shining light into the light emitting device through an aperture or by a focussed laser.
Patent TW-I259150-B (TW)
Title: Recording liquid container, ink jet recording apparatus, and cartridge collecting apparatus
Inventor: HATASA NOBUYUKI
IPC: B41J29/38
Filed: 2003-04-08
Granted: 2006-08-01
Abstract: A recording liquid container for containing liquid for recording to be supplied to recording means, said recording liquid container being detachably mountable to a mounting portion of a recording device, said recording liquid container includes an information memory medium storing predetermined information; wireless sending means capable of wireless sending of a predetermined information in said information memory medium within a predetermined range; a wireless communication antenna for wirelessly sending radio wave; and communication property changing means for changing a communication property of the wireless sending.
Patent TW-I286046-B (TW)
Title: Full wave sense amplifier and lamp tube driving device incorporating the same
Inventor: MOYER JAMES C
IPC: H05B37/02
Filed: 2003-05-16
Granted: 2007-08-21
Abstract: A full wave sense amplifier for sensing a periodic current flowing through a discharge lamp is disclosed. The full wave sense amplifier comprises a first circuit for sensing the positive going portion of the periodic current. The amplifier also includes a second circuit for sensing the negative going portion of the periodic current. Finally, an output circuit for combining the negative going portion and the positive going portion into a current flow signal is provided.
Patent TW-I220068-B (TW)
Title: A structure of chip package with copper bumps and manufacture thereof
Inventor: SU CHIEN-CHIH
IPC: H01L23/48
Filed: 2003-05-29
Granted: 2004-08-01
Abstract: A structure of chip package with copper bumps and manufacture thereof is provided. The copper bumps fabricating on first contacts of a carrier for connection with flip-chip package, is formed by means of electroplating. The length of copper bumps is satisfied with a stand between the chip and the carrier. The pitch between neighboring copper bumps is reduced because the diameter of the copper bumps is more less than the diameter of the tradition ball bumps so that the number of the first contacts and bonding pads is added.
Patent TW-I276163-B (TW)
Title: Apparatus and method of plasma processing, and apparatus and method of plasma film formation
Inventor: MATSUDA RYUICHI
IPC: H01L21/205
Filed: 2003-06-18
Granted: 2007-03-11
Abstract: The invention is provided with the second antenna 11b disposed outside the smallpox of the periphery of antenna 11a. The current provided from the power supply means for the antenna 11a is reversed in its direction and is supplied to the second antenna 11b such that the magnetic force lines F2 generated at the second antenna 11b are reverse to the magnetic force lines F1 generated at the antenna 11a. Thus, even for the wide range inside the can-shape container 2, uniform plasma is generated such that it is capable of making the magnetic flux density in the wall-face direction small.
Patent TW-I331811-B (TW)
Title: Side emittintg led and lens
Inventor: ROBERT S WEST
IPC: H01L33/58
Filed: 2003-06-24
Granted: 2010-10-11
Abstract: A lens comprises a bottom surface, a reflecting surface, a first refracting surface obliquely angled with respect to a central axis of the lens, and a second refracting surface extending as a smooth curve from the bottom surface to the first refracting surface. Light entering the lens through the bottom surface and directly incident on the reflecting surface is reflected from the reflecting surface to the first refracting surface and refracted by the first refracting surface to exit the lens in a direction substantially perpendicular to the central axis of the lens. Light entering the lens through the bottom surface and directly incident on the second refracting surface is refracted by the second refracting surface to exit the lens in a direction substantially perpendicular to the central axis of the lens. The lens may be advantageously employed with LEDs, for example, to provide side-emitting light-emitting devices. A lens cap attachable to a lens is also provided.
Patent TW-593036-B (TW)
Title: Motorcycle seat closing/opening structure
Inventor: SUEDA KENICHI
IPC: B62J1/12
Filed: 2003-07-10
Granted: 2004-06-21
Abstract: The solution of the present invention is that a hinge axle (77) is inclined in such a manner that it inclines toward front bottom side when viewed from one lateral side and that its front section extends inward of a vehicle body. When a dual person seat cushion (23) is in a closed condition, a projection (186) formed in a front portion of a bottom plate (54) of the dual person seat cushion (23) engages a recess (184) formed in a front portion of a receiving box (22). The effect of the present invention is that the coupling between the receiving box and the dual person seat cushion is provided by the projection and the recess and thus the number of seat fasteners is reduced by one, while the capability of anti-thief is maintained and the costs reduced.
Patent TW-I284275-B (TW)
Title: Graphic display architecture and control chip set therein
Inventor: CHANG NAI-SHUNG
IPC: G06F3/14
Filed: 2003-07-25
Granted: 2007-07-21
Abstract: A graphic display architecture comprises a control chip set, an AGP slot, and a PCIE slot. The control chip set comprises an AGP core circuit, a PCIE core circuit, a graphic core circuit, and a multiplex/demultiplex circuit. The control chip set supports AGP interface specification, PCIE interface specification, and graphics (Gfx) interface specification by using the multiplex/demultiplex circuit cooperated with above core circuits. The control chip set couples to both the AGP slot and the PCIE slot in order to support multiple interface specifications of graphic display in a single main-board.
Patent TW-I248914-B (TW)
Title: Method for forming metal oxide film and method for forming secondary electron emission film in gas discharge tube
Inventor: YAMADA HITOSHI
IPC: H01J1/70
Filed: 2003-07-31
Granted: 2006-02-11
Abstract: According to the present invention, there is provided a method for forming a metal oxide film comprising, when a metal oxide film is formed by conducting a thermal treatment on a coating film containing an organic metal compound formed on an inner wall of a tube, performing an ultraviolet irradiation treatment or an ozone treatment on the coating film prior to or simultaneously with the thermal treatment.
Patent TW-I231339-B (TW)
Title: Breather apparatus of internal combustion engine
Inventor: AKIYAMA MAMORU
IPC: F01M13/00
Filed: 2003-08-22
Granted: 2005-04-21
Abstract: A breather apparatus includes a first oil separation chamber disposed in a case and extending substantially in a vertical direction. The case constitutes a part of a vertical wall of an internal combustion engine, and blowby gas flows inside the case. A second oil separation chamber is superposed upon the first oil separation chamber. An opening formed in the lower part of the first oil separation chamber is communicated with the inside of the case. An upper part of the second oil separation chamber is communicated with the first oil separation chamber via a through hole. The blowby gas which has flown into the second oil separation chamber is supplied into an intake system via an outflow port formed in the lower part of the second oil separation chamber. In the separation chambers, oil in the blowby gas is separated by mutually different flow characteristics.
Patent TW-I275478-B (TW)
Title: Apparatus for extruding thermoplastics
Inventor: GUENTHERBERG NORBERT
IPC: B29C48/395
Filed: 2003-09-19
Granted: 2007-03-11
Abstract: An apparatus intended for extruding thermoplastics and having at least one vent and, if desired, also at least one dewatering aperture, which has been equipped with a metal-wire-mesh composite sheet, with a finely perforated metal sheet, or with a slit diaphragm.
Patent TW-I277833-B (TW)
Title: Photosensitive resin composition, forming method of relief pattern and electronic parts
Inventor: KOMATSU HIROSHI
IPC: G03F7/022
Filed: 2003-10-08
Granted: 2007-04-01
Abstract: The present invention provides a photosensitive composition with a good cured film property and high storage stability being proper for the use of surface protective film of semiconductor devices and interlayer insulating layer, forming method of relief pattern using such photosensitive resin composition, and electric parts comprising the electric devices comprising the above relief pattern. The photosensitive resin composition of the present invention comprises the composition of (A) heat-resistant polymer represents by formula (1), (B) photo-reactive compound, and (C) solvent.
Patent TW-I228950-B (TW)
Title: Circuit device, circuit module, and method for making a circuit device
Inventor: NAKAMURA TAKESHI
IPC: H01L25/00
Filed: 2003-10-15
Granted: 2005-03-01
Abstract: This invention provides a circuit device (10) on which a second conductive pattern (14) is formed for enabling a three-dimensional mounting. A second conductive pattern (14) is formed on insulating resin (13) which seals a built-in first circuit element (12), and a first conductive pattern (11) and the second conductive pattern (14) are connected by connecting means (15). A second circuit element (22) is mounted on the second conductive pattern (14). By the above arrangement the elements constituting the circuit can be mounted in a three-dimensional fashion. Furthermore, as the circuit device (10) eliminates a mounting substrate the thickness of the circuit device can be reduced.
Patent TW-I226445-B (TW)
Title: Integrated circuit testing system
Inventor: LIN YI-MIN
IPC: G01R31/26
Filed: 2003-10-22
Granted: 2005-01-11
Abstract: A kind of integrated circuit testing system is used to test the changes of the integrated circuits generated under different temperatures. The integrated circuit testing system comprises: at least a set of 2-dimensional matrix type testing module which is installed with a testing section for inserting the to-be-tested integrated circuits in a matrix manner and a heating section for heating integrated circuits individually; a computer main frame which is connected to the 2-dimensional matrix type testing module to control the whole operation of the testing system; and a database. According to the above-mentioned structure, the computer main frame is connected to the database and the 2-dimensional matrix type testing module for transmitting the temperature control information, providing the adequate temperature generated by each heater on the heating section to heat up the integrated circuits, and storing the testing information.
Patent TW-I234398-B (TW)
Title: Automatic contrast limiting circuit by spatial domain infinite impulse response filter and method thereof
Inventor: SHAN PEI-MING
IPC: H04N5/57
Filed: 2003-11-20
Granted: 2005-06-11
Abstract: An automatic contrast limiting circuit by spatial domain infinite impulse response filter and a method thereof are disclosed. A spatial domain infinite impulse response filter is used to generate an output value of the spatial domain infinite impulse response filter, which is related to an input signal. A peak value detector is used to detect the peak output value of the spatial domain infinite impulse response filter in a predetermined recording period. A contrast evaluator is used to evaluate the required contrast referring to a predetermined threshold value and the output value of the spatial domain infinite impulse response filter.
Patent TW-I225670-B (TW)
Title: Packaging method of multi-chip module
Inventor: LIN CHIAN-CHI
IPC: H01L23/02
Filed: 2003-12-09
Granted: 2004-12-21
Abstract: A kind of method for stack packaging of multi-chips is disclosed in the present invention. The first packaging body structure contains plural first semiconductor chips, in which each one of the first semiconductor chips respectively has plural exposed contact pads and an appropriate separation distance is set in between the chips. After that, the first metal layer is formed on the packaging body structure and is patterned to form the extension portion of contact pad. Then, a dielectric layer is formed on the first packaging body structure. The second packaging body structure is formed, in which plural second semiconductor chips are included. Plural connecting holes are formed at the periphery of the second semiconductor chip so as to pass through the second packaging material layer and the first dielectric layer for connecting the first metal layer. The conducting layer is formed to have interconnects with the contact pad through the connecting hole so as to form connection between the contact pad of the second semiconductor chip of the second packaging body structure and the contact pad extending portion of the first semiconductor chip. After that, the second dielectric layer is formed on the second packaging body structure where the predetermined externally connected contact pad is patterned. At last, the conducting balls are planted at the externally connected contact pad. Then, a dicing process is conducted to complete stack package of plural chips.
Patent TW-I244786-B (TW)
Title: Dual panel-type organic electroluminescent device and method for fabricating the same
Inventor: PARK JAE-YONG
IPC: G09G3/32
Filed: 2003-12-16
Granted: 2005-12-01
Abstract: A dual panel-type active matrix organic electroluminescent device includes a gate line disposed along a first direction on a first substrate, a data line disposed along a second direction on the first substrate, a power line disposed along the second direction on the first substrate and spaced apart from the data line to define a pixel region with the gate and data lines, the power line and the gate line both formed of a same material during a same process, a switching thin film transistor disposed on the first substrate near a crossing of the gate and data lines, a driving thin film transistor disposed on the first substrate near a crossing of the gate and power lines, a connecting pattern within the pixel region on the first substrate formed of an insulating material, and a connecting electrode disposed within the pixel region on the first substrate to cover the connecting pattern and electrically interconnecting the driving thin film transistor to an organic electroluminescent diode.
Patent TW-I240843-B (TW)
Title: Flash device, camera device with flash device, and method and program thereof
Inventor: YUYAMA MASAMI
IPC: G03B17/02
Filed: 2003-12-26
Granted: 2005-10-01
Abstract: In a REC mode of an ordinary image pickup standby state, a main capacitor 71 is connected to a side of a step-up/charging circuit 72 via a switch 82, and the main capacitor 71 is charged with electric power of a charging battery 91. When the REC mode is changed to other modes, the main capacitor 71 is connected to a side of a step-down circuit 81 by a switching operation of the switch 82. The step-down circuit 81 steps down charging voltage of the main capacitor 71 to 4.2 V to supply it to a power supply circuit 9-3 of a camera, and steps down the charging voltage to 5 V to supply it to the charging battery 91 which is a power supply of the camera. When it is no longer necessary to emit fill light, the electric power lost from the main capacitor 71 due to natural discharge can automatically be utilized efficiently for operations other than the emission of the fill light.
Patent TW-I231540-B (TW)
Title: Method and apparatus for removing material from chamber and wafer surfaces by high temperature hydrogen-containing plasma
Inventor: NEMOTO TAKENAO
IPC: H01L21/306
Filed: 2004-01-15
Granted: 2005-04-21
Abstract: A cleaning method is provided using a cleaning gas mixture of hydrogen and inert gas, for example a mixture in which the hydrogen content is between 20 percent and 80 percent by volume, provided to the chamber of a semiconductor wafer processing apparatus and an ICP power source only to generate a high density plasma in the gas mixture without biasing the surface to be cleaned. In examples of the invention, Si and SiO2 contaminants or CFx contaminants are cleaned from a silicon contact prior to subsequent metal deposition. In another example of the invention, silicon residue is cleaned from internal chamber surfaces before oxide etching to recover the baseline oxide etch rate.
Patent TW-I287125-B (TW)
Title: A light guide plate and method for making the same
Inventor: CHANG JEN-TSORNG
IPC: G02B6/00
Filed: 2004-01-16
Granted: 2007-09-21
Abstract: The present invention relates to a light guide plate and a method for making the same. The light guide plate includes an incident surface for receiving incident light, a bottom surface for reflecting and diffusing the incident light, a light emitting surface for directing the light to emit. Wherein a reflexible aluminum foil hologram is adhered to the bottom surface.