baber/WOPTO huggingface dataset:
Patent JP-2006091238-A (JP)
Title: Composition for resist removal
Inventor: SHIMONO TETSUSUU
IPC: G03F7/42
Filed: 2004-09-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a composition which is acidic and can remove resist, moreover at a low temperature of 100°C or lower.  <P>SOLUTION: This composition contains sulfuric acid and organic nitrile, and may further contain alcohol, ketone and ester. Preferably, the composition consists of, for example, 0.5 to 98 wt.% sulfuric acid, 1 to 99 wt.% organic nitrile, 0 to 30 wt.% alcohol, and 0 to 50 wt.% ketone and/or ester. As the organic nitrile, there are acetonitrile, propionitrile, succinonitrile, butyronitrile, benzonitrile, adiponitrile, etc., available.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006092281-A (JP)
Title: Security device equipped with authentication function
Inventor: NAKA TAKESHI
IPC: G06F21/44
Filed: 2004-09-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a security device for preventing the illegal use of value information such as electronic money or an electronic ticket and digital contents such as music or a video, and for authenticating a terminal application itself dealing with the value information.  <P>SOLUTION: A security device 102 is provided with an application processing means 152, and the application processing means 152 applies proper processing and electronic signature to a terminal application stored in an original application storing part 155 based on a processing request from an information terminal 101, and stores the terminal application in a processed application storing part 156, and issues the processed application preliminarily stored in the processed application storing part 156 to the information terminal 101 based on an application issue request from the information terminal 101, and the information terminal 101 verifies the electronic signature applied to the processed application, and the security device 102 authenticates the application started based on authentication information embedded at the time of processing.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006088890-A (JP)
Title: Pneumatic tire
Inventor: KAWAKAMI SHINJI
IPC: B60C11/00
Filed: 2004-09-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a pneumatic tire, capable of simultaneously achieving improvement of wet friction force and reduction of rolling resistance.  <P>SOLUTION: On a tread part 1, a base rubber layer 11 comprising first rubber composition having a Lupke rebound of 50 or more at 40°C, and a high friction rubber layer 12, 0.2-2 mm thick, comprising second rubber composition having a slide resistance value of 70 or more at 20°C as measured by a portable skid tester are provided. The high friction rubber layer 12 is disposed to be at least partly exposed in a tread surface S.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006049792-A (JP)
Title: Manufacturing method of dielectric film and of liquid injecting head
Inventor: KURIKI AKIRA
IPC: B41J2/14
Filed: 2004-09-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a dielectric film in which a stable property can be usually obtained by controlling crystallized state comparatively easily, and a manufacturing method of a liquid injecting head capable of improving the property of a piezo-electric element.  <P>SOLUTION: The manufacturing method of the dielectric film comprises an applying process of forming a dielectric precursor film by applying the sol of an organometallic compound, a drying process of drying the dielectric precursor film, a degreasing process of degreasing the above-mentioned dielectric precursor film, and a calcining process of calcining the above-mentioned dielectric precursor film to get the dielectric film. The drying process comprises a first drying process of drying the dielectric precursor film in such a way that the dielectric precursor film is heated at a temperature lower than the boiling point of a solvent, a main solvent of the sol, and that the heating process is kept for a fixed time, and a second drying process of further drying the dielectric precursor film by reheating the film and by keeping the reheating process for a fixed time.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006095775-A (JP)
Title: Manufacturing method of concrete panel and form structure used therein
Inventor: KOHAMA YOSUKE
IPC: B28B1/14
Filed: 2004-09-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a concrete panel capable of reducing the number of processes in the production of the concrete panel and capable of easily forming the side surface of the concrete panel into a desired shape even in a form wherein a side form and a surface form are integrated, and a form structure used therein.  <P>SOLUTION: In the manufacturing method of the concrete panel, the form is composed of an outer form and the form material mounted on the outer form in a freely detachable manner and, after cast concrete is aged, concrete is demolded along with the form material and the form material is detached, to manufacture the concrete panel. The form structure is composed of the outer form and the form material mounted on the outer form in a freely detachable manner.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006099324-A (JP)
Title: Non-contact card
Inventor: IMADA MASAYUKI
IPC: H04B5/02
Filed: 2004-09-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a non-contact card which is available for a plurality of non-contact communication systems.  <P>SOLUTION: This non-contact card for executing non-contact communication corresponding to a plurality of protocols with a reading device is provided with a non-contact communication part for executing non-contact communication with the reading device, an electrical field detection part for detecting the input and output of the electrical field of electromagnetic waves to be generated by the reading device, a plurality of protocol processing parts for executing one protocol processing depending on non-contact communication specifications, a protocol status management part for managing the execution status of the protocol processing part, a data communication part for transmitting and receiving communication data with the reading device and a protocol processing control part for executing the initialization of the plurality of protocol processing parts based on the detection of the input of the electrical field by the electrical field detection part, and for permitting the reception of the non-contact communication data to the protocol processing part based on the executions status of the protocol processing parts.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006100491-A (JP)
Title: Semiconductor device, wafer, and designing method and manufacturing method of semiconductor device
Inventor: MATSUBARA YOSHIHISA
IPC: H01L21/82
Filed: 2004-09-29
Abstract: <P>PROBLEM TO BE SOLVED: To extend a process margin of wiring for vibration accompanying scanning operation of a scanning type exposure device.  <P>SOLUTION: In a semiconductor device, in a wiring layer where wiring width or wiring pitch of the semiconductor device having multilayer wiring is minimum, the lengthwise direction of the wiring is superior in the amount of data (wiring frequently used) is made the same as the scanning direction of the scanning type exposure device. In other words, the influence of a shift by vibration can be suppressed to the minimum by making the direction of the vibration the same as the lengthwise direction of a pattern.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006099337-A (JP)
Title: Arithmetic processing unit
Inventor: KARAKI ISUKE
IPC: G06F9/54
Filed: 2004-09-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide an arithmetic processing unit where time required for arithmetic processing is shortened by efficiently transmitting the instruction on arithmetic execution of the data element of a processor element.  <P>SOLUTION: The arithmetic processing unit is provided with: a processor part 1 where a plurality of threads can be processed in parallel; and an arithmetic processing part 2 having an arithmetic execution part 150 provided with a plurality of arithmetic functions for performing an arithmetic processing in accordance with a request of the processor part 1. The processor part 1 is provided with: an arithmetic execution request adjusting part adjusting an arithmetic execution request generating a plurality of threads; and a transmission/reception part which performs packet-transmission of data comprising information for specifying the thread requesting arithmetic execution for a plurality of arithmetic functions in accordance with the result of adjustment and information for executing requested arithmetic operation.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006103692-A (JP)
Title: Blow molded container
Inventor: FURUSAWA MITSUO
IPC: B29C49/22
Filed: 2004-09-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a blow molded container capable of strongly preventing bottom breakage of a laminated releasable plastic container and consistently maintaining an excellent service state by increasing the peel-resistant strength of a pair of rib pieces to constitute a bottom rib at a pinch-off bottom seal part of a bottom of the blow-molded laminated releasable plastic container.  <P>SOLUTION: A bottom seal part 14 of a bottom part 7 of the blow-molded laminated releasable plastic container 1 is constituted of a bottom rib 16 with a pair of rib pieces 15 overlapped and press-attached thereto. A plurality of biting parts 17 to be bitten from one rib piece 15 to the other are provided on the bottom rib 16. A swollen part 18 is provided on a hole face part in a vicinity of a bottom portion of each biting part 17, and an engagement part 19 is formed on an overlapping part of each rib piece 14 to increase the bottom breakage strength.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006105641-A (JP)
Title: Backup power supply system
Inventor: NAGAOKA MASAKI
IPC: H01M10/48
Filed: 2004-10-01
Abstract: <P>PROBLEM TO BE SOLVED: To provide a backup power supply system that can determine the deterioration state of a lithium secondary battery constituting a backup power supply, without using resistors or power supplies for energizing a large current.  <P>SOLUTION: A CPU in a microcomputer 13 supplies backup power from a backup power supply 3 to a load 5 via a diode 6 for a fixed amount of time by turning on the switch 6, even if a load voltage determined by subtracting the voltage drop of a diode 4 from the voltage of a main power supply 1 is higher than a preset voltage, when it is judged that the voltage of the main power supply 1 is lower than that of the backup power supply 3. The CPU calculates the internal resistance of each cell from current detected, while supplying backup power and a cell voltage for composing the backup power supply 3, corrects the temperature by temperature detected by a thermistor 14, and decides the deterioration state of each cell from the correspondence relation between the internal resistance and deterioration state, after a predetermined temperature correction.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005132718-A (JP)
Title: Fertilizer for raising lawn and method for raising lawn
Inventor: YONAMINE KATSUYA
IPC: C05F15/00
Filed: 2004-10-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a fertilizer for raising lawn and a method for raising lawn with which soil damages by a chemical fertilizer, damages by the fertilizer, blight, relational agricultural chemicals problems and the like are solved and that strong and healthy lawn can be raised without the chemical fertilizer at a golf course and the like.  <P>SOLUTION: The fertilizer for raising lawn is an organic fertilizer in which at least an artificial zeolite, pulverized sweet acorn and pulverized rice bran are mixed with compost. The strong and healthy lawn can be raised by direct dispersing of the fertilizer and by sprinkling of water treated with the artificial zeolite.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2006109059-A (JP)
Title: Electronic circuit
Inventor: SENDA TAISUKE
IPC: H03M1/66
Filed: 2004-10-05
Abstract: <P>PROBLEM TO BE SOLVED: To reduce the number of switches to be serially connected and to avoid increase of output errors due to increase of clock feed-through and a linearity error of a buffer amplifier in an electronic circuit having a voltage selection output circuit such as a DAC and an SCF.  <P>SOLUTION: The electronic circuit has the voltage selection output circuit such as the DAC and the SCF and driving conditions of an input side switch such as the SCF, etc. are added to selecting conditions of a selection switch of the voltage selection output circuit. Thus, the selection switch is also used as the input side switch to reduce the number of serial connection of switches of a MOS transistor, etc. Consequently, on-state resistance of the switch is lowered.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006104336-A (JP)
Title: Resin composition and semiconductor device manufactured by using resin composition
Inventor: KANAMORI NAOYA
IPC: C09J163/00
Filed: 2004-10-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide a resin composition which has improved stability at room temperature as a one-component adhesive, can be cured at a low temperature of 100°C or less, and is excellent in adhesion reliability.  <P>SOLUTION: The resin composition comprises (A) a silver powder, (B) a compound which has two or more glycidyl groups in a molecule and is liquid at room temperature, and (C) a reaction product between a compound represented by general formula (1) and a compound having an acryloyl group (wherein R<SP>1</SP>: -H or an alkyl group having a carbon number of 20 or less, R<SP>2</SP>: -H or a methyl group, R<SP>3</SP>: -H or a methyl group).  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006111054-A (JP)
Title: Vehicular air conditioner
Inventor: KUWAYAMA KAZUTOSHI
IPC: F25B41/00
Filed: 2004-10-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide a vehicular air conditioner easily securing waterproofness inside/outside its case body.  <P>SOLUTION: The air conditioner comprises: the hollow case body 2; and a pipe connection means 1 provided near the inside of a wall part of the case body 2 for connecting a pipe inside the case body 2 and a pipe outside the case body 2. The pipe connection means 1 is characterized by having: a connection part 14 connected to the pipe outside the case body 2 via a penetration hole formed at the wall part of the case body 2; and an abutting member 13 having an abutting surface for pressurizing/abutting to a peripheral part of the penetration hole in the axial direction of the penetration hole. In the conventional art, a clearance in the circumferential direction of the pipe connection means is sealed with a grommet, etc., so as to eliminate the clearance between the pipe connection means and the case body and secure the waterproofness. In this invention, making the pipe connection means contact the case body in the axial direction, enlarges an abutting area even though the accuracy between the pipe connection means and the case body is not high, which enables to tolerate misalignment of the pipe connection means to some extent.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006111938-A (JP)
Title: Electroless plating apparatus
Inventor: JOMEN MIHO
IPC: H01L21/288
Filed: 2004-10-15
Abstract: <P>PROBLEM TO BE SOLVED: To stabilize a condition of an electroless plating solution and to stably plate the surface of a substrate with the plating solution, by avoiding a problem that an electroless plating solution used in an electroless plating step carried out in a process of manufacturing a semiconductor device deposits a metal in the solution and becomes an unstable state, particularly when used in a heated condition, because of containing a reducing agent which is a supply source of electrons.  <P>SOLUTION: This electroless plating apparatus comprises: chemical-solution-feeding channels for independently passing a first chemical solution containing a metal salt and a second chemical solution including a reducing agent, both of which constitute the electroless plating solution; opening/closing means installed in the vicinity of the confluence and in each of the chemical-solution-feeding channel; and an opening/closing means for the plating solution installed in the vicinity of a discharge opening in the channel for feeding the electroless plating solution after the two channels are joined. By this configuration, the electroless plating apparatus stores the plating solution in an approximately necessary amount to be spouted during one plating step, in the feeding channel sandwiched between both of the opening/closing means, and keeps both of the chemical solutions mixed only in a period after plating treatment for one substrate has been started and before the treatment for the next substrate begins.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005101627-A (JP)
Title: Photoelectric converter
Inventor: TAKAHASHI HIDEKAZU
IPC: H04N5/369
Filed: 2004-10-21
Abstract: <P>PROBLEM TO BE SOLVED: To reduce bias effect of a substrate such as variation in threshold value Vth of an MOS transistor, dropping of an amplification gain, and fluctuation of a power supply voltage VDD, which adversely affects the reading of photoelectric conversion charges.  <P>SOLUTION: A photoelectric converter provided with a plurality of pixels comprises a photoelectric charge accumulating part, an MOS transistor 1 for an amplifier to amplify the photoelectric charges, a resetting MOS transistor 4 for resetting the gate of the MOS transistor for an amplifier, a switching MOS transistor 2 for taking out the output of the MOS transistor for an amplifier, and a transferring MOS transistor 5 which transfers the photoelectric charges to the gate of the MOS transistor for an amplifier. The impurity concentration of a semiconductor region where the MOS transistor 1 is disposed is lower than that of the semiconductor region where the resetting MOS transistor 4 is disposed.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2006119892-A (JP)
Title: Image supply device, control method of this device, and print system
Inventor: YAMADA KENRI
IPC: B41J21/00
Filed: 2004-10-21
Abstract: <P>PROBLEM TO BE SOLVED: To solve the problem in a conventional direct printing that it is important to designate an image printing according to the print characteristics of a printer, and an image subjected to image processing or print processing according to a DSC user's desire cannot be always printed.  <P>SOLUTION: Actual and virtual object handles are set respectively to images which need predetermined image processing and images other than those among images of supply objects to a printer (S105), and a print job containing the object handle of an image of print object is issued according to a print instruction (S107). When the handle of image requested from the printer in response to the issuance of the print job is a virtual object handle, the predetermined image processing is executed to the image data corresponding to this handle, and the resulting data are supplied to the printer.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006120918-A (JP)
Title: Positioning jig
Inventor: WAKITA SHIGERU
IPC: H05K3/34
Filed: 2004-10-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a positioning jig for soldering a plurality of substrates to a heat radiating plate, wherein its accurate positioning and its easy cooled-off removal from the substrates are made compatible with each other.  <P>SOLUTION: The positioning jig 1 is the one for positioning insulating substrates 12 on a heat-radiating plate 11. The positioning jig 1 has an upper-frame jig 23, having a positioning portion for so contacting it with one end of each insulating substrate 12 mounted on the heat-radiating plate 11 as to position each insulating substrate 12, and has first and second central jigs 24, 25 having respectively contact portions 24b, 25b each of which is so disposed facing the positioning portion of the upper-frame jig 23 as to interpose each insulating substrate 12 between them and makes contact with the other end-portion of each insulating substrate 12. Each of the contacting portions 24b, 25b includes an inclined portion having inclining sense such that its lower portion interposes a larger interval between the upper-frame jig 23 and it than the interval interposed by its upper portion as to be contacted with the other end-portion of each insulating substrate 12 by the inclined portion.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006121628-A (JP)
Title: Image processing apparatus
Inventor: OYAMA TAKAYUKI
IPC: H04N1/00
Filed: 2004-10-25
Abstract: <P>PROBLEM TO BE SOLVED: To perform appropriate roll sheet cut, according to size classification of a manuscript for reading.  <P>SOLUTION: An image reading portion 15b at a manuscript reading mechanism 15 reads an image of a manuscript set at a manuscript set portion 15a. A CPU 11 distinguishes whether the manuscript is an A4, A3, A2, A1, or A0 regular size manuscript or not, based on the read image. As the result of the distinction, when the manuscript corresponds to anyone of regular size manuscripts, the CPU 11 controls a printing mechanism 16 so as to perform roll sheet cut according to a paper finishing dimension corresponding to size classification of the manuscript. Additionally, when the manuscript does not correspond to anyone of regular size manuscripts, the CPU 11 performs roll sheet cut according to the length of a side perpendicular to one side of the manuscript, using a roll sheet of which the length of the short side corresponds to the one side of the manuscript.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005033231-A (JP)
Title: Wiring substrate and method for fabricating the same
Inventor: YAMAZAKI KOZO
IPC: H05K3/42
Filed: 2004-10-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a wiring substrate which reliably establishes electrical continuity between a lower conductive layer and an upper conductive layer by a via-hole conductor that is suitably formed in the resin-insulating layer of a wiring substrate, and also to provide a method of manufacturing the same.  <P>SOLUTION: After a via-hole 5 is formed by exposure and development, a bottom 5A of the via-hole is subjected to resin-etching, and then the surface of an exposed lower conductive layer 4 is etched (a conductive layer etching process). As a result, adhered residual resin 5B is removed together with metal on the lower conductive layer 4. In etching the conductive layer, the lower conductive layer 4 is preferably etched in an amount of 5-30% of the thickness of the lower conductive layer 4, thereby establishing electrical continuity between the lower conductive layer 4 and an upper conductive layer 8 by means of a via-hole conductor 7.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2006133296-A (JP)
Title: Voice interactive device
Inventor: NOMURA KAZUYA
IPC: G10L15/06
Filed: 2004-11-02
Abstract: <P>PROBLEM TO BE SOLVED: To provide an easy-to-use voice interactive device with which the user would not feel troublesome.  <P>SOLUTION: A interactive control part 12 makes a dictionary control part 14 create a voice recognition dictionary, including possible phrases, such as "I do not understand" which a user may utter, when the user cannot find a reply to a question, and a voice recognition part 11 performs voice recognition, according to this voice recognition dictionary and outputs a result to the interactive control part 12. The interactive control part 12 decides it by an unknown expression word deciding part 18 whether the result of the voice recognition is, in agreement with an unknown expression word registered in an unknown expression word dictionary 17; and if the result is in agreement, a counter for counting the frequency in which the unknown expression word corresponding to the question was replied, is made to count up another count, and when a counter value exceeds pre-set value, the question is deleted from a scenario so as not to be made from the next time thereafter.  <P>COPYRIGHT: (C)2006,JPO&NCIPI