baber/WOPTO huggingface dataset:
Patent TW-I244636-B (TW)
Title: Classification method of phonetic tone parameters
Inventor: YANG HUANG-LIN
IPC: G10L13/02
Filed: 2003-06-17
Granted: 2005-12-01
Abstract: The present invention provides a classification method of phonetic tone parameters. By applying the recursive formula to calculate the mean value and the mean square error, the tone parameters of all the phonemes are analyzed to classify the tone parameters and, therefore, find and establish a representative tone sample model. While being applied for text to speech (TTS) or phonetic data compression, the method disclosed by the present invention can effectively increase the phonetic data compression ratio.
Patent TW-I272236-B (TW)
Title: Conveyor of sheet body
Inventor: YASUDA TOMOHIKO
IPC: H01L21/68
Filed: 2003-07-24
Granted: 2007-02-01
Abstract: The object is to reduce the vibration occurring during conveyance of a sheet body, while preventing serpentine traveling. While viewing from the planar view, pulleys 3, 4 that are provided to the front and rear sections and are wound for driving an endless belt 5 towards the conveying direction D of the sheet body are arranged into multiple rows and arranged as groups towards the conveying direction D. The projection backings 7 of respective belts 5 for supporting the sheet body 6 are provided along a lengthy direction by a predetermined interval. The projection backings 7 project the pulleys 3, 4, belt 5 upwards at the conveying side of the sheet body 6 in a slightly protruding manner. The projection backings 7 are received in a frame 2. An exhaust device 10 is provided to exhaust the frame 2.
Patent TW-I226921-B (TW)
Title: Bushing structure
Inventor: MA HAI-TAO
IPC: F16C33/20
Filed: 2003-09-16
Granted: 2005-01-21
Abstract: A bushing structure includes an outer shell and an inner shell. The outer shell shaped as a thin ring with a predetermined length further has at least a locating aperture. The inner shell shaped as another thin ring to be double layered firmly inside the outer shell has at least a locating protrusion with respect to the locating aperture. When the inner shell is mounted inside the outer shell, the locating protrusion is anchored inside the respective locating aperture so as to prevent possible relative movement in between. By providing the thin outer shell and the thin inner shell to form a complete bushing structure, an inherent material-shrinkage problem of plastic bushing can then be avoided.
Patent TW-I231088-B (TW)
Title: Control IC for low power auxiliary supplies
Inventor: ABDOULIN EDGAR
IPC: H02M3/07
Filed: 2003-11-13
Granted: 2005-04-11
Abstract: A non-isolated, low cost, switched capacitor converter for providing auxiliary power for use in systems with a wide range of input voltages up to 600 Vdc. The converter delivers low output power with low EMI at efficiencies of around 70%. The output voltage is either fixed or adjustable. A control IC is provided for controlling first and second semiconductor switches in the switched-capacitor converter. The converter includes a load resistance and a load capacitance connected in parallel; a first diode and a second diode connected in series the diodes being connected in parallel with the output circuit; first and second semiconductor switches connected in series; the semiconductor switches being connected between the supply voltage input and the output circuit; and a flying capacitance connected across the second semiconductor switch and to the diode junction point. The load capacitance is charged via the flying capacitance and the second diode in a charge cycle; and the load capacitance is discharged via the first diode and the flying capacitance in a discharge cycle. The control IC has a high side well powered by the input supply voltage which drives the first semiconductor switch; a floating well powered by the flying capacitor which drives the second semiconductor switch; and a control circuit powered by an output voltage. The control circuit delivers a variable amount of charge to the load capacitance per unit time. It increases a discharge frequency in response to an increase in load power demand, and maintains a predetermined fixed discharge time, until the discharge frequency reaches a predetermined maximum. Then, the control circuit maintains the maximum frequency and increases the discharge time in response in load power demand.
Patent TW-I233761-B (TW)
Title: Circularly polarized microwave elliptic ball plasma source structure and plasma generation method
Inventor: DAI FU
IPC: H05H1/00
Filed: 2003-12-16
Granted: 2005-06-01
Abstract: This invention provides a circularly polarized microwave elliptic ball plasma source structure and a plasma generation method. A kind of plasma source device can use microwave to generate homogeneous plasma, irradiate high power electromagnetic wave resonantly, ionize the reaction gases by focusing through the optical reflection surface of elliptic ball and combine effectiveness of circularly polarized electromagnetic wave to provide homogeneous high density plasma required for certain application areas, which exhibits better quality than conventional plasma source and thus can replace traditional plasma source. The device comprises a main body which is a hollow elliptic casing with optical reflection surface on the inner surface; a microwave source disposed at the first focus inside the elliptic main body; and a plasma generation device disposed at the second focus inside the elliptic main body.
Patent TW-I244180-B (TW)
Title: Chip package structure
Inventor: YANG CHIH-AN
IPC: H01L23/32
Filed: 2004-02-05
Granted: 2005-11-21
Abstract: A chip package structure is disclosed. The chip package structure comprises a carrier, at least one chip and an encapsulant compound. The carrier has a carrying surface and a plurality of contact pads, and the contact pads are disposed on the carrying surface. The chip is disposed on the carrying surface of the carrier. The chip has an active surface and a corresponding back surface. The active surface has a central region and a metal pad region, and the metal pad region surrounds the central region. The chip further comprises a plurality of metal pads that are disposed on the metal pad region of the active surface. The metal pads electrically connect to the contact pads with wire bonding. The encapsulant compound covers the chip and the contact pads. The encapsulant compound has at least one concave, which sinks in the surface of the encapsulant compound away from the chip, and the concave locates above the central region.
Patent TW-I238906-B (TW)
Title: Device for transforming 2D image into 3D image
Inventor: CHEN CHUAN-SHENG
IPC: G02C7/02
Filed: 2004-02-11
Granted: 2005-09-01
Abstract: A device for transforming 2D image into 3D image is disclosed. The device consists of circuits for the input and the control of the image, the output of the odd coupled horizontal offset image, the infrared ray (IR) circuit, and the IR lens for receiving the odd coupled horizontal offset image. The image and its color are separated by the input circuit, and the odd and the even image are formed by the control circuit. At the forming of the odd and the even image, both of the odd and the even images are delayed by time elapse control. Then the image is integrated by the horizontal offset control circuit. The image is transferred to the phase detector to return the color and the image and separated into two units by an input circuit. One forms the corrected horizontal offset signal by the image controller and the divider, the horizontal offset signal connects to the offset controller for suitable personal adjust through offset image adjust button. The other is for the image to be processed and transferred to the output odd coupled horizontal offset image IR circuit by the input circuit, and is received by the lens. By using the IR lens and its optical phenomena, the eyes' shielding effects, and the visual lagged effect duo to human physiology, such that the lens will provide the horizontal offset image with Cache Flash lens, so human brain will form 3D images.
Patent TW-I231068-B (TW)
Title: Board-to-board connector and testing method thereof
Inventor: TAN MING-YEN
IPC: H01R12/14
Filed: 2004-03-03
Granted: 2005-04-11
Abstract: A board-to-board connector and testing method thereof. The board-to-board connector has a body, a first flexible printed circuit board portion and a second flexible printed circuit board portion. The body has a base and a first row and a second row of pins provided on the base. The first flexible printed circuit board portion has a plurality of first wires connected to the first row of pins. The second flexible printed circuit board portion has a third row of pins and a plurality of second wires connecting the second row and the third row of pins. When a plurality of tests is set to perform on the board-to-board connector, the third row of pins are used to perform the L/O test and the burn-in test, then the body is used to perform the F/I test. After the tests are completed, the second flexible printed circuit board portion is removed.
Patent TW-I244712-B (TW)
Title: Semiconductor package with bump chip carrier structure and method for making the same
Inventor: LIU SHENG-TSUNG
IPC: H01L21/60
Filed: 2004-03-11
Granted: 2005-12-01
Abstract: A semiconductor package with bump chip carrier (BCC) structure is provided. At least a passive component is vertically installed inside a molding compound. One end electrode of the passive component is mounted in a sunken hole of a bump plating layer and electrically connected with the bump plating layer. The other end electrode of the passive component is electrically connected to a bonding pad on a chip by a bonding wire. An Au plating layer is covered on both end electrodes of the passive component for wire-bonding connection. The bump plating layer protrudes and is exposed to a SMT surface of the molding compound.
Patent TW-I243732-B (TW)
Title: Process for making nano-grade lead-free solder
Inventor: DU JENG-GUNG
IPC: B23K35/22
Filed: 2004-04-15
Granted: 2005-11-21
Abstract: This invention relates to a process for making nano-grade lead-free solder, where Sn/Ag mixture solution or Sn/Ag/Cu mixture solution is reacted with a reduction dispersion solution containing mixture of NaBH4, NaOh and C12H25OSO3Na, so as to reduce and produce Sn/Ag or Sn/Ag/Cu reactants by means of chemical reduction process. 95% ethanol is then used to clean the reactants in cooperation with ultrasonic vibration so as to remove B and S atoms in the reactants, thereby obtaining a nano-grade (0.1 to 100 nm) lead-free solder in the form of Sn-3.5Ag or Sn-3.5Ag-xCu (x=0.2 to 1.0).
Patent TW-I338068-B (TW)
Inventor: TABATA SHINOBU
IPC: D06M13/188
Filed: 2004-05-27
Granted: 2011-03-01
Abstract: It is an object of the present invention to provide a method for providing detergent-free washing function by which a washing effect approximately same as that in the case of using a detergent can be caused even in the case of washing a fiber or a fiber product without using a detergent and a fiber product capable of washing without using a detergent.  The present invention relates to a method for providing a detergent-free washing function to a fiber or a fiber product, which is subjected to hydrophilization treatment.
Patent TW-I276376-B (TW)
Title: Method for producing electrically conductive circuit and structure thereof
Inventor: HE JIAN-HAN
IPC: H05K3/00
Filed: 2004-07-13
Granted: 2007-03-11
Abstract: The present invention provides a method for producing an electrically conductive circuit and a structure thereof. The disclosed method comprises: providing an insulative substrate; engraving a groove of an electrically conductive circuit in the insulative substrate; filling the groove of the electrically conductive circuit with a first adhesive capable of forming cross-linking with the insulative substrate; and filling a second adhesive capable of forming chemical reactions with the first adhesive in order to form an electrically conductive adhesive in the groove of the electrically conductive circuit.
Patent TW-I289218-B (TW)
Title: Fiber display
Inventor: LEE CHUN-YU
IPC: A61B1/04
Filed: 2004-07-23
Granted: 2007-11-01
Abstract: The present invention relates to a fiber display, which includes a light source for providing illumination; a cluster of fibers, one end of which forming an incidence surface for receiving the coupled light and the other end of which forming a display surface; and a light modulator disposed between the incidence surface and the display surface for modulating the intensity of the light transmitted in the fibers. The fiber display can further include a color filter, a couple element, a band-pass filter for visible-light or a diffusion element to realize colorful displaying or improve display quality.
Patent TW-I266154-B (TW)
Title: Method and system for determining lithography overlay offsets
Inventor: LEE YUNG-YAO
IPC: G03F7/20
Filed: 2004-09-21
Granted: 2006-11-11
Abstract: A system for determining lithography overlay offsets adapted to exposure tool consecutively processes product lots is described. The system comprises an execution database; an overlay database; and a controller. The execution database records operation records of lots processed consecutively by an exposure tool, wherein each lot corresponds to a layer of a product, and the operation records pertain to a subsequent lot and a previous lot corresponding to products, respectively. The overlay database stores overlay information of lots corresponding to the products, comprising overlay information corresponding to records of products. The controller determines the overlay offset corresponding to lot according to the overlay information.
Patent TW-I268543-B (TW)
Title: Composite optical lithography method for patterning lines of substantially equal width
Inventor: BORODOVSKY YAN
IPC: H01L21/027
Filed: 2004-10-07
Granted: 2006-12-11
Abstract: A composite patterning technique may include two lithography processes. A first lithography process may use interference lithography to form a continuous pattern of lines of substantially equal width on a photoresist. A second lithography process may use one or more non-interference lithography techniques, such as optical lithography, imprint lithography and electron-beam lithography, to break continuity of the patterned lines and form desired integrated circuit features.
Patent TW-I285620-B (TW)
Title: Packaging machine and packaging method
Inventor: ITO TOMOAKI
IPC: B65B67/10
Filed: 2004-10-07
Granted: 2007-08-21
Abstract: A packaging machine (1) capable of easily packaging, by simple structure, a generally rectangular parallelepiped-shaped packaged object with specified width, length, and thickness by using a packaging body, comprising a mounting (10), an upper side folder (17), a first heater (15), second hesters (16), first projections (11), second projections (12), and interfolding portions (13). A resin film (packaging body) is put on the mounting (10) and a CD case (packaged object) is put on the resin film at the recessed part (10a). The resin film is folded back to the upper surface side of the CD case, and the upper side folder (17) is moved to fuse the resin film by the first heater (15). In addition, the first projections (11) and the second projections (12) are moved and the mounting (10) is moved downward to fold the resin film and the resin film is fused by the second heaters (16).
Patent TW-I259581-B (TW)
Title: Precision creation of inter-gates insulator
Inventor: DONG ZHONG
IPC: H01L21/28
Filed: 2004-11-19
Granted: 2006-08-01
Abstract: An ONO-type inter-poly insulator is formed by depositing intrinsic silicon on an oxidation stop layer. In one embodiment, the oxidation stop layer is a nitridated top surface of a lower, and conductively-doped, polysilicon layer. In one embodiment, atomic layer deposition (ALD) is used to precisely control the thickness of the deposited, intrinsic silicon. Heat and an oxidizing atmosphere are used to convert the deposited, intrinsic silicon into thermally-grown, silicon dioxide. The oxidation stop layer impedes deeper oxidation. A silicon nitride layer and an additional silicon oxide layer are further deposited to complete the NON structure before an upper, and conductively-doped, polysilicon layer is formed. In one embodiment, the lower and upper polysilicon layers are patterned to respectively define a floating (FG) and a control gate (CG) of an electrically re-programmable memory cell. In an alternative embodiment, after the middle, silicon nitride of the ONO structure is defined, another layer of intrinsic silicon is deposited, by way of for example, ALD. Heat and an oxidizing atmosphere are used to convert the second deposited, intrinsic silicon into thermally-grown, silicon dioxide. An ONO structure with two thermally-grown, and spaced apart, silicon oxide layers is thereby provided.
Patent TW-I267846-B (TW)
Title: Dual-layer recordable optical disc and manufacturing method thereof
Inventor: YEH RU-LIN
IPC: G11B7/259
Filed: 2004-11-25
Granted: 2006-12-01
Abstract: A dual-layer recordable optical disc including a first recording layer and a second recording layer. The second recording layer is disposed on the first recording layer. The recording material of the first recording layer is organic material and the recording material of the second recording layer is inorganic material. In one embodiment, the disc further includes a first substrate, a second substrate and a bonding layer. The first recording layer includes a dye recording layer disposed on the first substrate and a first reflection layer disposed on the dye recording layer. The second recording layer includes an inorganic recording layer and a second reflection layer disposed on the inorganic recording layer. Furthermore, the second substrate is disposed on the second reflection layer and the bonding layer is disposed between the first reflection layer and the inorganic recording layer. A simple manufacturing method of the dual-layer recordable optical disc is further provided to improve the process yield and to save the manufacturing cost.
Patent TW-I263570-B (TW)
Title: Lock buckle structure of tool case
Inventor: LIN TINA
IPC: B25H3/02
Filed: 2004-12-06
Granted: 2006-10-11
Abstract: The present invention relates to a lock buckle structure of tool case. The tool case includes two cases made by same mold, one end of the case is pivotally connected to lock buckle member provided in the other end and buckled with lock buckle body, the lock buckle member of the case is designed to be symmetric to each other, one end of the lock buckle body is a lock member and the other end is a buckle member, the lock member is locked with a case as one whole piece, and the buckle member is buckled or separated form the lock buckle member of the other case. The cases of the tool case can use the same mold by having symmetric lock buckle members and the cost of manufacturing the tool case can be lower and easier to assemble and repair.
Patent TW-I239619-B (TW)
Title: Gluing machine of wafer and lead frame for LOC package
Inventor: YOU HE-JEN
IPC: H01L23/495
Filed: 2004-12-13
Granted: 2005-09-11
Abstract: A gluing machine of wafer and lead frame for LOC package in this invention includes: a supplying device of lead frame to store and supply the lead frame; a dispensing device, involving a glue supplying tank and a robot to soak the glue and print to the surface of adhesive tape; a wafer sticking device, involving a wafer supplying mechanism and a sticking robot to pick up the wafer from wafer supplying mechanism and stick on the adhesive tape. A collecting device to collect said lead frame sticking with wafer includes: a storage box; a moving mechanism carrying and moving the storage box, when the lead frame is moved by a transporting device into the storage box, the moving mechanism carries the storage box to go forward to the designated position, waiting for the next lead frame to move in; a conveying device transporting the lead frame from the lead frame supplying device to the dispensing device, wafer-sticking device and collecting device.
Patent TW-I290598-B (TW)
Title: Glass structural body and method for producing the same
Inventor: SU TUNG-CHIN
IPC: E04C1/42
Filed: 2004-12-21
Granted: 2007-12-01
Abstract: A method for manufacturing glass structural body, including the steps of: (A) obtaining a first glass sheet having a bore; (B) placing and limiting a lid-shaped mounting base having an opening facing inwards into the bore from an outside of the glass sheet towards its inside; and (C) joining a second glass sheet to the outside of the first glass sheet, so as to seal the bore of the first glass sheet. As such, by joining the second glass sheet to the outside of the first glass sheet, it is able to prevent weathering of the components as mounted in the bore, which would result in water permeation.
Patent TW-I390029-B (TW)
Title: Gasoline sulfur reduction catalyst for fluid catalytic cracking process
Inventor: HU RUIZHONG
IPC: C10G11/04
Filed: 2005-03-14
Granted: 2013-03-21
Abstract: The present invention is directed to certain catalyst compositions and processes that are capable of reducing sulfur compounds normally found as part of the gasoline fraction streams of fluid catalytic cracking processes. The present invention is a cracking catalyst composition comprising a zeolite in combination with a Lewis Acid containing component, wherein the cracking catalyst composition comprises 0.2% Na2O or less. It has been found that sulfur compounds in hydrocarbon feeds to fluid catalytic cracking processes can be reduced by at least 15% compared to the same composition, which does not comprise the aforementioned Lewis Acid containing component.
Patent TW-I279493-B (TW)
Title: Combination structure of frame of cabinet
Inventor: JIANG JIA-LING
IPC: A47B47/00
Filed: 2005-05-03
Granted: 2007-04-21
Abstract: The invention provides a combination structure of frame of cabinet including a solid connecting rod. One end of the connecting rod, which is fixed in the rim of notch by welding is inserted tightly into a connecting notch of a straight frame. The other end of the connecting rod has a threaded hole which is for a screwed attachment at the bottom end of a hanger. The end surface of a horizontal frame and a side frame are connected in the corresponding surface of the connecting rod, and are welded along the connecting surface. By the above-mentioned structures, it has the effect of increasing the combination strength of the frame and the welding combination area, and the connecting interface of the frames has the effect of impermeability.
Patent TW-I263054-B (TW)
Title: System and method for testing electric performance of fans
Inventor: YU GUO-JUN
IPC: G01R1/00
Filed: 2005-06-03
Granted: 2006-10-01
Abstract: A system for testing electric performance of fans is disclosed. The system can test electric performance of various kinds of fans. The system includes: a computer, which is connected to a data acquisition controlling box via a serial interface; a data acquisition card, which is located in a PCI slot on the mother board of the computer, for transforming analog signals received from the data acquisition controlling box into digital signals, sending the digital signals to the computer, and also for receiving instructions from the computer in order to control the data acquisition controlling box; a fan interface, which is connected to the data acquisition controlling box and fans to be tested. The data acquisition controlling box generates impulse signals according to the instructions to control the tested fans, and switches testing power. At the same time, the data acquisition controlling box collects current signals and feedback of fan rotational speed, and sends the signals to the data acquisition card.