baber/WOPTO huggingface dataset:
Patent TW-201720656-A (TW)
Title: Substrate equipped with electroconductive film
Inventor: MIEDA EIKO
IPC: H01B5/14
Filed: 2016-12-01
Abstract: The purpose of the present invention is to provide a substrate equipped with an electroconductive film, the substrate having an electroconductive film in which the surface is devoid of irregularities, and the adhesion between the electroconductive film and a plastic substrate being excellent regardless of the type of electroconductive ink. A substrate equipped with an electroconductive film having a base film and the electroconductive film on the surface of a substrate in the stated order, wherein the base film is an object obtained by curing a coating agent containing a condensate of an organosilane compound represented by formula (II) R4Si(R3)3 (II) (where: R4 represents an epoxy group, etc.; and R3 represents a hydroxyl group or a hydrolyzable group) and a compound represented by formula (I) (where: Ar represents a C6-C10 aryl group optionally having an electron-donating group; X represents a single bond, etc.; Y represents a polymerizable functional group; Z represents a carbon atom or a silicon atom; R2 represents a hydrogen atom, etc.; and Ar may be identical or different to each other).
Patent TW-201826526-A (TW)
Title: Metal oxide semiconductor device having recess and manufacturing method thereof
Inventor: HUANG TSUNG-YI
IPC: H01L29/78
Filed: 2017-01-04
Abstract: The present invention provides a metal oxide semiconductor(MOS) device having recess and manufacturing method thereof. The MOS device having recess includes: a semiconductor substrate, a gate, a source, a drain and two lightly doped diffusions (LDD). A first recess and a second recess are formed at an upper face of the semiconductor substrate. The first recess and the second recess are filled with a conductive material, such that the conductive material functions as a contact material. From a crosssectional view, the first recess and the second recess respectively have its respective depth, which is defined as a distance extending from the upper face of the semiconductor substrate downward along a vertical direction. Such respective depth of the first recess and the second recess are all deeper than a depth of the two LDDs, wherein the depth of the two LDDs is defined as a distance extending from the upper face of the semiconductor substrate downward along the vertical direction. The source and the drain has its own respective vertical connection portion, wherein the vertical connection portion of the source is formed at a boundary of the first recess along the vertical direction, while the vertical connection portion of the drain is formed at a boundary of the second recess along the vertical direction.
Patent TW-201736118-A (TW)
Title: Copper clad laminate and printed circuit board wherein the metal clad laminate has excellent metal adhesion, heat resistance, low dielectric constant of insulating material, and low dielectric loss tangent characteristics, and the printed circuit board has low transmission loss
Inventor: TASAKI TAKASHI
IPC: C08G73/10
Filed: 2017-01-05
Abstract: The problem to be solved by the present invention is to provide a metal clad laminate and a novel printed circuit board. The metal clad laminate has excellent metal adhesion, heat resistance, low dielectric constant of insulating material, and low dielectric loss tangent characteristics, and the printed circuit board is characterized in using the metal clad laminate to result in low transmission loss. The solution of the present invention is a copper clad laminate, which comprises a copper foil (3) laminated on at least one side of an insulating film (1) via an adhesive layer (2), wherein the insulating film (1) has a thermal expansion coefficient of 4 to 30 ppm/Celsius degree, and the adhesive layer (2) contains an acid anhydride group terminal polyimide (A) and a crosslinking component (B). The acid anhydride group terminal polyimide (A) is a reaction product of aromatic tetracarboxylic anhydride and a diamine monomer, and the diamine monomer contains dimeric diamine. Moreover, the ten-point average roughness Rz of the contact surface between the copper foil (3) and the adhesive layer (2) is 0.1 to 1.5[mu]m.
Patent TW-201735020-A (TW)
Title: Memory device
Inventor: PARK IL-MOK
IPC: G11C11/34
Filed: 2017-01-19
Abstract: A memory device including first conductive lines spaced apart from each other and extending in a first direction; second conductive lines spaced apart from each other and extending in a second direction that is different from the first direction; first memory cells having a structure that includes a selection device layer, a middle electrode layer, a variable resistance layer, and a top electrode layer; and insulating structures arranged alternately with the first memory cells in the second direction under the second conductive lines, wherein the insulating structures have a top surface that is higher than a top surface of the top electrode layer, and the second conductive lines have a structure that includes convex and concave portions, the convex portions being connected to the top surface of the top electrode layer and the concave portions accommodating the insulating structures between the convex portions.
Patent TW-201731953-A (TW)
Title: A reinforced thermoplastic resin composition and a molded product and manufacturing method thereof
Inventor: NAKAMOTO MASAHITO
IPC: B29K69/00
Filed: 2017-01-20
Abstract: The present invention provides a reinforced thermoplastic resin composition exhibiting excellent moldability, improving the rigidity, impact resistance, mechanical strengths, heat resistance, and flame resistance of the resulting molded article. In addition, the present invention provides a molded product exhibiting excellent improving the rigidity, impact resistance, mechanical strengths, heat resistance, flame resistance, and weld strength. The reinforced thermoplastic resin composition of the present invention containing: a resin component having 80 to 100% by weight of a polycarbonate resin (A) and 0 to 20% by weight of a specific graft copolymer (G); a polyethylene terephthalate resin (B) formed by solid phase polymerization of recycled and/or re-pellet; an inorganic filler (D); and a glycidyl ether unit-containing polymer (E) having a weight average molecular weight of 3,800 to 60,000.
Patent TW-201803664-A (TW)
Title: Continuous casting mold and method for continuous casting of steel
Inventor: IWATA NAOMICHI
IPC: B22D11/059
Filed: 2017-01-20
Abstract: A continuous casting mold having low-thermal-conductivity metal filled parts formed by filling a low-thermal-conductivity metal into a plurality of recessed grooves provided in a range from an arbitrary position above a meniscus to an arbitrary position below the meniscus in an inner wall surface of a copper alloy mold copper plate for configuring a water-cooled continuous casting mold, the thermal conductivity [lambda]m (W/(m * K)) of the low-thermal-conductivity metal being 80% or less of the thermal conductivity [lambda]c (W/m * K)) of the mold copper plate, and the thermal resistance ratio R defined by equation (1) being 5% or greater. (1): R = [(T-H)/(1000 * [lambda]c) + H/(1000 * [lambda]m) - T/(1000 * [lambda]c)]/[T/(1000 * [lambda]c)] * 100. In the formula, R is the thermal resistance ratio (%) of the low-thermal-conductivity metal filled parts and the mold copper plate, T is the distance (mm) from a bottom surface of a slit in the mold copper plate as a flow path for mold cooling water to the surface of the mold copper plate, and H is the filling thickness (mm) of the low-thermal-conductivity metal.
Patent TW-201827207-A (TW)
Title: Paperboard having side edge sealed with mixed hot melt adhesive and wax comprising two surface layers between which an intermediate core layer is arranged and having side edge openings that are sealed with an edge sealing structure comprising an adhesive material and a sealing material
Inventor: LAU CHI WAH
IPC: B31F5/04
Filed: 2017-01-26
Abstract: The present invention relates to a paperboard having a side edge sealed with mixed hot melt adhesive and wax. The paperboard (such as corrugated paperboard) has two surface layers and at least one intermediate core layer. The surface layers form a side edge opening between corresponding side edges thereof. Each side edge opening is in communication with a separation space in the interior of the paperboard. The separation space is provided therein with an edge sealing structure. The edge sealing structure comprises an adhesive material and a sealing material. The adhesive material is formed of hot melt adhesive and wax and can bond the surface layers and the intermediate core layer together integrally and may form a bonding layer having multiple pores after being cured. The sealing material has a viscosity that is less than the adhesive material and may fill up the pores. As such, the adhesive material forms a porous support surface, which allows for coating the sealing material thereon, so that the surface layers and the intermediate core layer may be made with reduced material costs but realizing fabrication of a paperboard having excellent water resistance, thermal insulation property, and sound isolation property.
Patent TW-201740237-A (TW)
Title: Imaging using multiple unmanned aerial vehicles
Inventor: MISHRA LALAN JEE
IPC: G05D1/10
Filed: 2017-02-21
Abstract: An aerial imaging system and method of aerially capturing an image including a first unmanned aerial vehicle (UAV) and a second UAV. The first UAV includes a camera and may be configured to receive input from an operator. The second UAV may be configured to dock with and deploy from the first UAV. The second UAV includes a light configured to provide remote illumination for the camera. The light on the second UAV may be activated to illuminate a target of photography by the camera while the second UAV is flown separate from the first UAV.
Patent TW-201739759-A (TW)
Title: Treatment of diabetes, toll-like receptor 4 modulators and methods for using the same
Inventor: SIU LEUNG-KEI
IPC: C12N15/63
Filed: 2017-02-24
Abstract: The present invention relates to treatment of diabetes, toll-like receptor 4 (TLR-4) modulators and methods for using the same. Particularly, the present invention provides an isolated peptide from pneumolysin (PLY peptide) which is effective in treatment of diabetes. In addition, the PLY peptide of the present invention is a TLR-4 antagonist and thus can be used in the treatment of a disease or condition associated with TLR-4 activation. The present invention also provides treatment of diabetes with a TLR-4 antagonist.
Patent TW-201738011-A (TW)
Title: Formed material manufacturing method
Inventor: NAKAMURA NAOFUMI
IPC: B21D22/30
Filed: 2017-03-03
Abstract: The purpose of the present invention is to provide a method for manufacturing a molded member, whereby high precision of inside diameter roundness of a cylindrical body part is maintained even when the plate thickness of a raw material metal plate varies, and it is also possible to prevent adhesion, seizing, and the like of the raw material metal plate to a die for finish ironing. In the present invention, a molded member having a cylindrical body part and a flange part formed on an end part of the body part is manufactured by performing multistage drawing of a raw material metal plate. The multi-stage drawing includes: preliminary drawing for forming a preliminary body having a body part element from the raw material metal plate; at least one compressive drawing for forming a body part by drawing the body part element while applying a pressure-adjustable compressive force to the body part element, the compressive drawing being performed after the preliminary drawing; and at least one finish ironing for ensuring dimensional precision, the finish ironing being performed subsequent to the compressive drawing.
Patent TW-201816388-A (TW)
Title: Broadband spectrum optical measurement device and plasma processing device comprising a broadband light source, a parabolic reflector, a reflective light receiving element, a semi-transparent mirror, and a control element
Inventor: WAN LEI
IPC: H01L21/66
Filed: 2017-03-13
Abstract: The present invention discloses a broadband spectrum optical measurement device, comprising a broadband light source for emitting incident light of various wavelengths; a parabolic reflector for collimating the incident light to form a plurality of parallel light beams which are emitted onto the surface of a wafer through an optical window; a reflective light receiving element for receiving a light reflected from the surface of the wafer; a semi-transparent mirror arranged behind the parabolic reflector and in front of the reflective light receiving element, wherein the plurality of parallel light beams is transmitted through the semi-transparent mirror and emitted onto the surface of the wafer through the optical window, the light reflected by the surface of the wafer, after passing the optical window and reflected by the semi-transparent mirror, is received by the reflective light receiving element; and a control element electrically connected to the reflective light receiving element for determining the end of wafer etching according to the light reflected by the surface of the wafer. The present invention further discloses a plasma processing device. The present invention is capable of collimating the broadband spectrum and efficiently improving collimation of the broadband light source and utilization of luminous flux in the IEP detection method.
Patent TW-201802185-A (TW)
Title: Metal-polyorganosiloxanes
Inventor: BHAGWAGAR DORAB E
IPC: C08L83/04
Filed: 2017-03-21
Abstract: Metal-polyorganosiloxane materials, methods of making and using them, and manufactured articles and devices containing them. The metal-polyorganosiloxane materials have improved thermal stability and may be used as thermal interface materials in applications and devices in need of heat management. The materials may also be used as athermal materials in applications and devices that do not involve heat or a change in temperature.
Patent TW-201802059-A (TW)
Title: Cordierite-based sintered body, method for producing the same, and composite substrate
Inventor: ISODA YOSHINORI
IPC: C04B35/645
Filed: 2017-03-22
Abstract: A cordierite-based sintered body according to the present invention contains cordierite as a main component and silicon nitride or silicon carbide. The cordierite-based sintered body preferably has a thermal expansion coefficient less than 2.4 ppm/DEG C at 40 DEG C to 400 DEG C, an open porosity of 0.5% or less, and an average grain size of 1 [mu]m or less.
Patent TW-201741793-A (TW)
Title: Pressure control device and pressure control system
Inventor: NOZAWA TAKAHIRO
IPC: G05D16/02
Filed: 2017-03-30
Abstract: Provided are a pressure control device and a pressure control system with which the pressure within a chamber can be maintained at a constant level quickly even if the volume of the chamber relative to a gas control flow rate is large or a pipe between a flow rate control valve and the chamber is long. A pressure control device 1 comprises: a CPU 18 that subtracts, at a predetermined ratio, a flow rate signal from a set pressure signal when gas is being supplied into a chamber 3 in order to set the inside of the chamber 3 to a negative pressure; a comparator circuit 21 that compares a detected pressure signal indicating the pressure within the chamber 3 that was detected by a pressure sensor 4 and the set pressure signal from which the flow rate signal has been subtracted; and a valve drive circuit 22 that controls a flow rate control valve 14 on the basis of the comparison results obtained by the comparator circuit 21.
Patent TW-201736200-A (TW)
Title: An electric power system for supplying electric energy to a vessel
Inventor: RAUMA KIMMO
IPC: H02J3/34
Filed: 2017-03-31
Abstract: A power system for supplying electric power from shore-side to a vessel is presented. The power system comprises one or more shore-side converters (101-112) for receiving electric power from a shore-side alternating voltage network (137) and for producing one or more direct voltages. Each shore-side converter can be a controllable converter for controlling the produced direct voltage to be suitable for the vessel in accordance with a control signal received from the vessel, or the vessel may comprise a direct voltage converter for converting the direct voltage received from the shore-side to be suitable for the vessel. The vessel can be an electric vessel which comprises a chargeable battery (132) for supplying electric power to the propulsion system (135) of the vessel.
Patent TW-201830594-A (TW)
Title: Package structure and manufacturing method thereof
Inventor: LIN PO-CHUN
IPC: H01L21/56
Filed: 2017-03-31
Abstract: A package structure includes an interconnection layer; a passivation layer disposed on the interconnection layer, in which the interconnection layer and the passivation layer defined at least one opening; at least one elastic bump disposed on the interconnection layer, in which a portion of the elastic bump is embedded in the opening; and a conductive layer disposed on the elastic bump.
Patent TW-201839929-A (TW)
Title: Packaging structure
Inventor: PAN CHI-LIANG
IPC: H01L23/60
Filed: 2017-04-25
Abstract: A packaging structure including a substrate, a first chip, an encapsulation layer, a capacitor, and an electromagnetic interference (EMI) shielding layer is provided. The substrate includes a first pad and a second pad. The first chip is disposed on the substrate and is electrically coupled to the substrate. The encapsulation layer is disposed on the substrate and covers the first chip. The capacitor includes a first capacitor electrode and a second capacitor electrode which are electrically insulated from each other. The first capacitor electrode and the second capacitor electrode are embedded in the encapsulation layer. The EMI shielding layer at least covers the encapsulation layer. The first capacitor electrode and the second capacitor electrode extend from the substrate toward the EMI shielding layer. The EMI shielding layer is grounded via the first capacitor electrode and the first pad. The second capacitor electrode is electrically connected to the second pad.
Patent TW-201741865-A (TW)
Title: Enhanced low cost microcontroller
Inventor: SENAPATI ASHISH
IPC: G06F9/22
Filed: 2017-05-12
Abstract: An 8-bit microprocessor has a program memory having a 16-bit instruction word size and a data memory having an 8-bit data size. An instruction word has a payload size for an address of up to 12 bits. The microprocessor furthermore has a central processing unit coupled with the program memory and the data memory, a bank select register configured to select one of up to 64 memory banks, and an indirect addressing register operable to address up to 16KB of data memory. The CPU is configured to execute a first move instruction having two instruction words and being configured to only access the lower 4KB of the data memory and a second move instruction having three instruction words and configured to access the entire data memory.
Patent TW-201732074-A (TW)
Title: Tunable gas delivery assembly with internal diffuser and angular injection
Inventor: KNYAZIK VLADIMIR
IPC: C23C16/52
Filed: 2014-02-06
Abstract: Embodiments of the present invention relate to an apparatus for providing processing gases to a process chamber with improved uniformity. One embodiment of the present invention provides a gas delivery assembly. The gas delivery assembly includes a hub, a nozzle, and one or more gas diffusers disposed in the nozzle. The nozzle has a cylindrical body with a side wall and a top surface. A plurality of injection passages are formed inside the nozzle to deliver processing gases into the process chamber via a plurality of outlets disposed in the side wall. The injection passages are configured to direct process gases out of each outlet disposed in the side wall in a direction which is not radially aligned with a centerline of the hub.
Patent TW-201839075-A (TW)
Title: Water-based treatment solution, chemical conversion treatment method, and chemical-conversion-treated steel sheet
Inventor: MATSUNO MASANORI
IPC: C09D7/40
Filed: 2017-05-26
Abstract: The purpose of the present invention is to provide a water-based treatment solution which makes it possible to form a chemical-conversion-treated coating film having further improved corrosion resistance. The present invention relates to a water-based treatment solution for a chemical conversion treatment of a steel sheet or a plated steel sheet. The water-based treatment solution contains an organic resin including a fluororesin, a Group-4A metal compound, and at least one binding promoter selected from the group consisting of dimethyl adipate, diethyl adipate, di(iso)propyl adipate, di(iso)butyl adipate, dimethyl phthalate, diethyl phthalate, di(iso)propyl phthalate and di(iso)butyl phthalate.
Patent TW-201804010-A (TW)
Title: Coating device and coating method
Inventor: GERSDORFF MARKUS
IPC: C23C16/06
Filed: 2017-06-09
Abstract: The invention relates to a device for depositing a layer onto one or more substrates (10), comprising: a process chamber (2), which is arranged in a reactor housing (1) and which has a gas inlet element (3), which can be temperature-controlled, for letting a process gas flow into the process chamber (2) in a flow direction (S) to the substrates (10); a shielding element (6), which is arranged directly after the gas inlet element (3) in the flow direction (S) and which thermally insulates the gas inlet element (3) and the substrate (10) from each other in a shielding position; a plurality of mask holders (7, 7') arranged after the shielding element (6) in the flow direction (S), each for holding a mask (8, 8'); substrate holders (9, 9') for holding at least one of the substrates (10), each substrate holder corresponding to one of the plurality of mask holders (7, 7'), which substrate holders are arranged after the masks (8, 8') in the flow direction (S) and are physically separated from each other, wherein, for each of the plurality of substrate holders (9, 9'), a displacement element (11, 11') is provided for displacing the substrate holder (9, 9') from a position distanced from the mask holder (7, 7'), in which position the substrate (10, 10') can be loaded onto and unloaded from the substrate holders (9, 9'), into a position adjacent to the mask holder (7, 7'), in which position a substrate (10, 10') arranged on the substrate holder (9, 9') can be coated while lying in a contact position against the mask (8, 8').
Patent TW-201813086-A (TW)
Title: Semiconductor device and method for manufacturing same
Inventor: KOSUGI RYOUJI
IPC: H01L29/06
Filed: 2017-06-13
Abstract: The purpose of the present invention is to improve the manufacturing yield and reliability of a semiconductor device including a power semiconductor element. In a substrate having a crystal main surface inclined with respect to the <11-20> direction, a plurality of trenches DT which extend in an x-direction and are spaced apart from each other in a y-direction orthogonal to the x-direction are formed. A superjunction structure is configured from a p-type column region PC comprising a semiconductor layer embedded in the trenches DT, and an n-type column region NC comprising a portion of the substrate between the trenches DT adjacent to each other in the y-direction, wherein an angular error between an extending direction of the trenches DT (x-direction) and the <11-20> direction is not more than ±[theta], where [theta] is determined by {arctan{k * (w/h)}}/13 with respect to the trenches having a height h and a width w, where k is at least less than two, preferably not more than 0.9, more preferably 0.5, and even more preferably not more than 0.3.