baber/WOPTO huggingface dataset:
Patent JP-5211766-B2 (JP)
IPC: G06F11/20
Filed: 2008-03-10
Granted: 2013-06-12
Abstract: <P>PROBLEM TO BE SOLVED: To simultaneously guarantee the reliability of services that a virtualization data center provides and to optimize the efficiency of utilizing resources, regarding a method, an apparatus and a program for allocating resources.  <P>SOLUTION: The method for allocating resources by means of a computer that allocates virtualized resources to be provided to a plurality of physical servers causes a computer to implement a step for recognizing the failure of any one physical server, a step for retrieving redundant virtualized resources at the physical server whose failure has been recognized, and a step for determining a physical server which can be made redundant and to which virtualized resources can be allocated from the physical servers except the one physical server.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-5305731-B2 (JP)
IPC: H01L29/786
Filed: 2008-05-12
Granted: 2013-10-02
Abstract: A method for controlling the threshold voltage of a semiconductor element having at least a semiconductor as a component is characterized in including a process to measure one of a threshold voltage and a characteristic value serving as an index for the threshold voltage; a process to determine one of the irradiation intensity, irradiation time, and wavelength of the light for irradiating the semiconductor based on one of the measured threshold voltage and the measured characteristic value serving as the index for the threshold voltage; and a process to irradiate light whose one of the irradiation intensity, irradiation time, and wavelength has been determined onto the semiconductor; wherein the light irradiating the semiconductor is a light having a longer wavelength than the wavelength of the absorption edge of the semiconductor, and the threshold voltage is changed by the irradiation of the light.
Patent JP-5356729-B2 (JP)
IPC: C08G77/42
Filed: 2008-05-26
Granted: 2013-12-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a primer composition for excellently adhering a sealing material, which comprises a vinyl polymer having at least one crosslinkable silyl group as a main component, with various substrates, in particular, a primer composition exhibiting good adhesiveness in jointing the sealing material (post placing) principally consisting of the vinyl polymer to a silicone sealing material (prior placing).  <P>SOLUTION: The primer composition comprises (A) the vinyl polymer having at least one crosslinkable silyl group, (B) a silane coupling agent, (C) a silanol condensation catalyst, (D) a silicone resin, and (E) calcium carbonate having a surface treated with fatty acid, a resin acid or a fatty acid ester.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-5297707-B2 (JP)
IPC: G06F19/00
Filed: 2008-07-08
Granted: 2013-09-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide an efficient HILS (Hardware In the Loop Simulation) device and increase the computing accuracy of HILS.  <P>SOLUTION: The HILS device for verifying the response of a target system by using a block line drawing model expressing the target system controlled by an electronic control unit includes an FPGA (Field Programmable Gate Array) which includes: a non-real-time processor which constitutes a non-real-time system for executing the input/output of a first subsystem model while communicating with an HILS terminal by executing a simulation program; a user logic unit which constitutes a high-speed computing unit for executing the computation of a second subsystem model while communicating with the electronic control unit by being defined by a net list; and a real-time processor which constitutes a real-time system for executing the computation of the first subsystem model while communicating with the electronic control unit, the non-real-time system, and the high-speed computing unit by executing the simulation program.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-5303704-B2 (JP)
IPC: H01L51/30
Filed: 2008-07-09
Granted: 2013-10-02
Abstract: Monomeric, oligomeric and polymeric electrically conductive compounds and methods of making the compounds having a repeating unit having formula P1, as follows:   
where X is S or Se, Y is S or Se, wherein one or both of X and Y is Se, R is a substituent group capable of bonding to the ring structure. R may include hydrogen or isotopes thereof, hydroxyl, alkyl, including C 1  to C 20  primary, secondary or tertiary alkyl groups, arylalkyl, alkenyl, perfluoroalkyl, perfluororaryl, aryl, alkoxy, cycloalkyl, cycloalkenyl, alkanoyl, alkylthio, aryloxy, alkylthioalkyl, alkynyl, alkylaryl, arylalkyl, amido, alkylsulfinyl, alkoxyalkyl, alkylsulfonyl, aryl, arylamino, diarylamino, alkylamino, dialkylamino, arylarylamino, arylthio, heteroaryl, arylsulfinyl, alkoxycarbonyl, arylsulfonyl, carboxyl, halogen, nitro, cyano, sulfonic acid, or alkyl or phenyl substituted with one or more sulfonic acid, phosphoric acid, carboxylic acid, halo, amino, nitro, hydroxyl, cyano or epoxy moieties. Electrical devices utilizing the electrically conductive polymers is also disclosed.
Patent JP-5281330-B2 (JP)
IPC: H02M7/48
Filed: 2008-07-25
Granted: 2013-09-04
Abstract: In an inverter generator having an engine generator unit, a converter that converts generated alternating current to direct current, an inverter that converts the direct current to alternating current with switching elements to supply to an electrical load, an inverter driver that drives the switching elements with a PWM signal and makes the alternating current of a predetermined frequency, the alternating current supplied to the electrical and voltages of the direct and alternating currents are detected, the detected voltage of the alternating current is corrected as a predetermined value based on a coefficient (DCgainA) set based on the detected voltage of the direct current, when the detected alternating current is greater than a threshold value (S10 to S26); and the PWM signal is corrected by the predetermined value (S28), thereby limiting overcurrent.
Patent JP-5262400-B2 (JP)
IPC: B62D25/06
Filed: 2008-07-29
Granted: 2013-08-14
Abstract: <P>PROBLEM TO BE SOLVED: To form a recessed portion at a part of a spoiler, and to improve aerodynamic characteristics while ensuring a machining property of a back door by decreasing a recessed portion area on a back door upper surface.  <P>SOLUTION: The vehicle rear part structure is equipped with the back door 20 opening/closing a rear opening portion S provided at a rear part of a vehicle body, and the spoiler 30 provided on the back door 20 and extended in a vehicle width direction. The back door 20 has the back door upper surface portion 21 generally continuing to a roof portion supper surface 11 of the vehicle body, and the spoiler 30 has a spoiler upper surface portion 31 generally continuing to the back door upper surface portion 21. At a center portion in the vehicle width direction, the recessed portion 40 extended in a vehicle fore-and-aft direction over the roof portion upper surface 11, the back door upper surface portion 21, and the spoiler upper surface portion 31 is provided.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-4631946-B2 (JP)
IPC: H01L21/20
Filed: 2008-08-11
Granted: 2011-02-16
Abstract: The present method of manufacturing a group III nitride semiconductor layer bonded substrate includes the steps of: implanting ions I of at least any of hydrogen and helium in a region having a prescribed depth D from one main surface (20m) of a group III nitride semiconductor substrate (20); bonding a different-composition substrate (10) with the main surface (20m) of the group III nitride semiconductor substrate (20); obtaining a group III nitride semiconductor layer bonded substrate (1) by separating the group III nitride semiconductor substrate (20) at a region (20i) implanted with the ions I; and annealing the group III nitride semiconductor layer bonded substrate (1) at a temperature not lower than 700°C in an atmosphere of a nitrogen-containing gas N. Thus, a group III nitride semiconductor layer bonded substrate high in crystallinity of a group III nitride semiconductor layer is provided.
Patent JP-5353150-B2 (JP)
IPC: B29L17/00
Filed: 2008-09-25
Granted: 2013-11-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a stamper which is advantageous for manufacturing a transferred matter with excellent quality by suppressing occurrence of a level difference on the seam of the stamper, and to provide the transferred matter.  <P>SOLUTION: The stamper 1 has a body 10 to be wound on the peripheral surface of a cylinder 2, and a level difference section 12 set on one edge of the body 10 in a direction of being wound on the peripheral surface of the cylinder 2. The level difference section 12 has: a first abutting section 14 protruding to a side in the thickness direction of the body 10; and a second abutting section 16 protruding from the tip of the first abutting section 14 in a direction parallel to the body 10. The stamper 1 is attached to the cylinder 2 in a state that a surface opposite to the peripheral surface of the cylinder 2 is made to abut on the second abutting section 16 on the other edge 18 of the body 10 in the direction of being wound on the peripheral surface of the cylinder 2, and furthermore, the tip end face of the other edge 18 of the body 10 in the direction of being wound on the peripheral surface of the cylinder 2 is made to abut on the first abutting section 14.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-5203188-B2 (JP)
IPC: C07K1/113
Filed: 2006-06-29
Granted: 2013-06-05
Abstract: The present invention provides a process for attaching one or more effector molecules to one or more cysteines in a protein comprising: a) activating one or more cysteines in the protein by diafiltering the protein against a monothiol reducing agent or a multi-thiol reducing agent which is incapable of forming intramolecular disulphide bonds and b) reacting the treated protein with an effector molecule.
Patent JP-4499815-B2 (JP)
IPC: B65G47/90
Filed: 2006-06-14
Granted: 2010-07-07
Abstract: An apparatus ( 1 ) to remove one individual hair/fiber ( 2 ) at a time from a tuft ( 3 ) using a gripping device ( 4 ), which has a first and a second opposing gripping element ( 5, 6 ). The first and the second gripping elements ( 5, 6 ) are relatively moveable with respect to one another, wherein the first gripping element ( 5 ) has a wedge-shaped groove ( 7 ) oriented towards the second gripping element ( 6 ) and the second gripping element ( 6 ) has an essentially flat counterpressure zone ( 8 ), and wherein the first gripping element ( 5 ) is tapered on the side of the wedge-shaped groove ( 7 ) (taper A) (FIG. 2 ).
Patent JP-5107243-B2 (JP)
IPC: C07F7/22
Filed: 2006-07-11
Granted: 2012-12-26
Abstract: The present invention relates to a process for the production of dialkyltin dihalides of the formula R 2 SnHal 2 from monoalkyltin trihalides of the formula RSnHal 3 , in which R = alkyl or cycloalkyl and Hal = Cl, Br or I. Said process comprises contacting monoalkyltin trihalides RSnHal 3  and Sn metal, optionally thereafter isolating the dialkyltin dihalides R 2 SnHal 2  from the medium.
Patent JP-4322312-B2 (JP)
IPC: H01M4/48
Filed: 2007-11-13
Granted: 2009-08-26
Abstract: Disclosed is an electricity storage device which can be charged/discharged at high rate and have high output, high capacity and excellent repeating charge/discharge characteristics, although it uses a non-carbon material as a negative electrode active material. Specifically disclosed is an electricity storage device comprising: a positive electrode collector; a positive electrode disposed on the positive electrode collector and including a positive electrode active material which can reversibly absorb/desorb at least anions; a negative electrode collector; and a negative electrode disposed on the negative electrode collector and including a negative electrode active material which can substantially absorb/desorb lithium ions reversibly. The negative electrode active material is composed of at least one substance selected from the group consisting of silicon, a silicon-containing alloy, a silicon compound, tin, a tin-containing alloy, and a tin compound; and the negative electrode is formed as a thin film having a thickness of 10 µm or less.
Patent JP-5059769-B2 (JP)
IPC: A47J31/46
Filed: 2006-10-17
Granted: 2012-10-31
Abstract: The invention relates to a device for preparing hot water provided with a pressure pump with a supply pipe for supplying relatively cold water to the pressure pump and an outlet connected to a heating pipe which is in heat-exchanging contact with a heating body, with an outlet valve in the heating pipe and a coffee holder, connected to the heating pipe, for accommodating a bed of coffee, whereby the heating body comprises a reservoir that is openly connected to the environment, with a heating element and water in the reservoir as a heat-exchange medium. A by-pass pipe (54) connects the inlet (57) and outlet (35) of the pressure pump (34) to each other, with a pressure-operated valve (56) in the by-pass pipe.
Patent JP-4938024-B2 (JP)
IPC: A61B8/06
Filed: 2006-12-07
Granted: 2012-05-23
Abstract: An ultrasonic diagnostic and therapy system is described for stopping the bleeding of severely damaged blood vessels or vessels severed in a limb amputation. A cuff ( 30 ) is attached to the stump of the severed limb which contains a diagnostic transducer array ( 52, 54, 56 ) and a HIFU transducer ( 42, 44 ). The diagnostic transducer surveys the tissue of the severed limb, searching for a Doppler flow signal. When a Doppler flow signal is detected, the range to and coordinates of the sample volume where the flow was detected are determined, as well as the flow velocity. This information is supplied to a HIFU therapy transducer controller, which controls the HIFU transducer to transmit focused ultrasound to the sample volume of the flow locus, the center of the lumen of a blood vessel. The focused ultrasound heats and coagulates blood in the severed vessel to stem the bleeding. Heat dissipation due to the blood flow is reduced by tracking and continuously heating the same bolus of blood as it flows, or by heating a significant length of the blood vessel instead of a fixed spot in the vessel .
Patent JP-5295811-B2 (JP)
IPC: B32B27/36
Filed: 2009-02-17
Granted: 2013-09-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a film and a laminated body which have superior adhesiveness to a polyvinyl butyral layer, with excellence in economy and productivity.  <P>SOLUTION: The coated film has a coated layer formed by applying and drying a coating liquid containing polyester resin (A), oxazoline group-containing polymer (B) and melamine type compound (C) on one surface of polyester film. The laminated body has a polyvinyl butyral layer on the coated layer of the coated film.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-5278062-B2 (JP)
IPC: G03B9/10
Filed: 2009-03-13
Granted: 2013-09-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a lens-barrel and a camera for moving a light quantity adjusting member without providing an another separate space.  <P>SOLUTION: The lens-barrel (1, 501) for changing length of the lens-barrel between a photographing state and a storage state being shorter in time than the photographing state includes a vibration control unit (300, 500) having the first lens (L2), the second lens (L3) being apart from the first lens (L2) by first distance in the photographing state and coming closer to the first lens (L2) by distance smaller than the first distance in the storage state, and a magnet (305, 805) to move the first lens (L2) and correct blurring and a light quantity limiting member (201, 701a) arranged between the first lens (L2) and the second lens (L3), limiting quantity of light entering the optical path and passing through the optical path in the photographing state, and being moved to evacuate from the optical path by magnetic force of the magnet (305, 805) when moving from the photographing state into the storage state, respectively.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-5319348-B2 (JP)
IPC: B60T7/12
Filed: 2009-03-23
Granted: 2013-10-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a driving supporting device 1 for controlling a vehicle C to hardly deviate from an adequate course without giving a sense of incongruity to a driver when there is the possibility of the contact of the vehicle C with an obstacle even in the case a road surface friction coefficient (a road surface μ) is low.  <P>SOLUTION: The driving supporting device 1 supports driving while calculating the controlled variable of steering control or brake control to support the avoidance of an obstacle and executing the steering control or the brake control at a predetermined control starting timing in accordance with the controlled variable. It gives vibration to a steering wheel 3, determines whether the road surface μ is low, depending on the behavior of the vehicle or a variation of a steering angle resulting from the vibration, and corrects the controlled variable or the control starting timing when determining that the road surface μ is low.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-5278105-B2 (JP)
IPC: B62D21/00
Filed: 2009-03-30
Granted: 2013-09-04
Abstract: <P>PROBLEM TO BE SOLVED: To dramatically enhance accuracy when a sub-frame is removed from a side frame by predetermined load.  <P>SOLUTION: The sub-frame support structure includes the side frame extending in a longitudinal direction of the vehicle; the sub-frame provided below the side frame and supporting a suspension; and a connection means for connecting the sub-frame relative to a part to be mounted of the side frame. The connection means includes a first connection member provided so as to surround an opening formed on the part to be mounted; and a second connection member engaged with the first connection member via the opening and connecting the sub-frame to the side frame. On the part to be mounted, a notch is formed on an edge of the opening, and the first connection member is partially fixed relative to the part to be mounted. A relative position relationship in a circumferential direction of a fixed position of the first connection member and a formation position of an apex part of the notch is specified such that a circumferential center of the fixed position and the apex part are not overlapped in a circumferential direction.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-5101556-B2 (JP)
IPC: F21V8/00
Filed: 2009-04-02
Granted: 2012-12-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electronic apparatus including a light guide member which suppresses occurrence of a position having insufficient brightness is caused on a light emitting surface.  <P>SOLUTION: The light guide member includes an extending section 82 which extends in the direction of the outer surface of the electronic apparatus. The extending section 82 includes a light emitting surface 82a which is exposed from the outer surface of the electronic extending and the rear surface 82b being the surface of a reverse side to the light emitting surface 82a. The rear surface 82b includes a curved surface 82L curved to dent to a light emitting surface 82a side.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-4877365-B2 (JP)
IPC: H05K1/14
Filed: 2009-07-13
Granted: 2012-02-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a circuit connecting method capable of connecting two circuit members each other with sufficient adhesive strength even if one of the two circuit members to be connected is either a TCP or a FPC, capable of reducing connection resistance between circuit electrodes, and capable of sufficiently preventing the connection resistance from rising with the passage of time.  <P>SOLUTION: This circuit connecting method is to connect the first circuit member 20 having a first circuit electrode 22 to the second circuit member 31 having a second circuit electrode 32 to form the TCP or the FPC using a circuit connecting material 10 to connect both electrodes by disposing them face to face. The circuit connecting material contains a thermosetting composition and a photo-curing composition, and can be connected to either the TCP or the FPC, and when the second circuit member is the TCP, both members are connected after the value of the ratio of the area S<SB>b</SB>of the circuit connecting material after heating and pressing it to its initial area S<SB>a</SB>is set to 1.3-3.0 by applying light, and when the second circuit member is the FPC, the members are connected without applying light.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-5270492-B2 (JP)
IPC: E02D3/12
Filed: 2009-08-05
Granted: 2013-08-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a device for measuring displacement of the entire multiaxial excavation shaft, at less cost and failure.  <P>SOLUTION: In the multiaxial excavation shaft, a plurality of excavation shafts are bound together with a connection band. A linear twisted driven shaft is fixed on the downward biased connection band, at the lower end of the twisted driven shaft, being held rotatably from the lower end to the upper end of the twisted driven shaft. The upper end of the twisted driven shaft is extended close to the upper end of the excavation shaft. A display means of the twisted angle received by the twisted driven shaft is provided at the upper end of the twisted driven shaft. A sensor for detecting twisted angle display is arranged and an inclination angle detecting gauge is arranged on the downward biased connection band.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-5460175-B2 (JP)
IPC: F16H61/02
Filed: 2009-08-17
Granted: 2014-04-02
Abstract: The method involves maintaining forward gear during uphill orientation of motor vehicle (1), when parking mode is selected among several driving modes. A reverse gear is maintained during downhill orientation of vehicle, when parking mode is selected. The selection of parking mode is performed such that the forward gear has high transmission ratio. An independent claim is included for automated gear shift transmission.
Patent JP-5366004-B2 (JP)
IPC: B29C45/26
Filed: 2009-08-28
Granted: 2013-12-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a mold for the laminated injection molding which does not leave a gate trace at a design surface side of a secondary molding, and can obtain stably the wall thicknesses of a primary molding and the secondary molding of the standing surface of the molding.  <P>SOLUTION: In the mold for laminated injection molding, the primary molding is injection-molded through a primary injection gate by a primary injection molding unit after a primary mold clamping using a product core mold and a plurality of product cavity molds different in product design shape. After a predetermined cooling holding time, a predetermined distance is mold-opened, the product cavity mold is replaced in a state that the primary molding is left in the product core mold. Thereafter, a secondary mold clamping is carried out and a new product cavity is formed. A secondary injection molding is carried out at the surface side of the primary molding through a secondary injection gate by a secondary injection molding unit to the formed product cavity, by which a secondary molding is laminated on the primary molding to obtain an integrated laminate molding. A projection blocking the secondary injection gate at the primary clamping state is provided on a primary molding cavity surface.  <P>COPYRIGHT: (C)2011,JPO&INPIT