baber/WOPTO huggingface dataset:
Patent JP-S62186106-A (JP)
Title: Low nox burner for liquid fuel
Inventor: NAKAMOTO MITSUYOSHI
IPC: F23D11/40
Filed: 1986-02-07
Abstract: PURPOSE:To provide a combustion device which reduces an amount of NOX exhausted and increases the varying range of a combustion amount, by a method wherein a combustion chamber is formed between combustion plates positioned facing each other, a fuel feed chamber is formed between the combustion plate and a burner body containing the combustion plates, an evaporating chamber for liquid fuel is formed on the upper stream of the bottom plate of the combustion chamber, and a burner port plate forms a radiation surface. CONSTITUTION:Liquid fuel 25 is injected through a fuel nozzle 17, and collides with an evaporating cylinder 13 for evaporation. After the liquid fuel is mixed with air 26 fed from a blast fan 19, the mixture presses a throttle port 14, and produced uniform air-fuel mixtures 27 and 28, which pass through fuel feed chambers 10 and 11 and are fed to burner port plates 4 and 5, respectively. The mixtures are fed to a combustion chamber 12 and are ignited by an ignitor 20 to form flames 22 and 23. Since heat is imparted on a bottom plate 8 from combustion plates 2 and 3 and flame, an air-fuel ratio can be increased, and combustion, reducing an amount of NOX exhausted, is practicable. Since the burner port plates 4 and 5 are positioned facing flame, a decrease in temperatue produced when a combustion amount is decreased is reduced, stable combustion is practicable, and the varying range of a combustion amount can be increased.
Patent JP-S58142640-A (JP)
Title: Radio transmission and reception device
Inventor: SETO SHINJI
IPC: H04B1/40
Filed: 1982-02-18
Abstract: PURPOSE:To obtain an equalizing means which is operated stably, by amplifying a part of a residual noise by a circuit having the almost same constitution as a regular path, and charging it on the way of a reception circuit so as to offset the residual noise which has flowed into the reception circuit. CONSTITUTION:A signal received by an antenna 4 passes through a switching circuit by which a reception circuit is not broken down at the time of transmission from a circulator 3, the signal is processed by passing through a route of a reception amplifier (RFA) 6, a charging circuit 7 and a reception post-stage circuit 8, the reception function. Also, an equalizer 10 is constituted of a circulator 20, an antenna 21, a switching circuit 23 and an RFA 24, and a signal having an opposite phase characteristic to the circuit consisted of the circulator 3, the antenna 4, the switching circuit 5 and the REA 6, having a similar amplitude characteristic, delay characteristics, etc. is generated to offset a residual noise by the charging circuit 7.
Patent JP-H02206599-A (JP)
Title: Method for applying pattern to japan ware
Inventor: SHINTANI RYOHEI
IPC: B44C3/00
Filed: 1989-02-04
Abstract: PURPOSE:To form a pattern efficiently and accurately by a method wherein a Japanese lacquer pattern sheet is applied on an over-coating of a basis material, a required color Japanese lacquer is applieid thereon to be more than the Japanese lacquer pattern sheet in thickness, and the coated surface is polished until the surface of the Japanese lacquer pattern sheet is exposed in relief-like pattern. CONSTITUTION:Firstly, a color Japanese lacquer is applied on a thin silk, a mask sheet is releasably bonded thereon, and a color Japanese lacquer of the same color is overlappedly applied thereon and dried. Next, the mask sheet is peeled, and a color Japanese lacquer of another color is applied on produced recessed parts and dried. After that, the material is cut into a required shape to form Japanese lacquer pattern sheets 2, 3 shaped into a butterfly and a square. The Japanese lacquer pattern sheets 2, 3 are bonded on an over-coating of a basis material 1 of a nest of boxes with an adhesive. A color Japanese lacquer is overlappedly applied thereon to be more than the Japanese lacquer pattern sheets 2, 3 in thickness and dried, and the coated surface is polished for exposing the surface of the Japanese lacquer pattern sheets 2, 3 in relief. Lastly, the coated surface is polished glossily using polishing powder. In this manner, a pattern is applied easily and more efficiently with less failure.
Patent JP-S58142200-A (JP)
Inventor: MASHITA TOORU
IPC: E21B15/00
Filed: 1982-02-19
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H11214213-A (JP)
Title: Ferrite, transformer and its driving method
Inventor: SAIDA HITOSHI
IPC: H01F1/34
Filed: 1998-01-23
Abstract: PROBLEM TO BE SOLVED: To reduce the power loss and increase saturated magnetic flux density at a high temperature, by incorporating a specified mol.% of iron oxide, zinc oxide and manganese oxide as main components, and incorporating a specified ppm of silicon oxide, calcium oxide, niobium oxide and zirconium oxide as subcomponents. SOLUTION: As main components, iron oxide of 53-55 mol.% (in terms of Fe2 O3 ), zinc oxide of 6.5-9.5 mol.% (in terms of ZnO), and manganese oxide of the residual part (in terms of MnO) are contained. As subcomponents, silicon oxide of 80-150 ppm (in terms of SiO2 ), calcium oxide of 600-1000 ppm (in terms of CaCO3 ), niobium oxide of 150-400 ppm (in terms of Nb2 O5 ), and zirconium oxide of 40-300 ppm (in terms of ZrO2 ) are contained. Saturation magnetic flux density (DC) of ferrite having the above component at 100-120 deg.C is set at least 410 mT.
Patent JP-S58141705-A (JP)
Inventor: ITOU KATSUMI
IPC: A01B69/00
Filed: 1982-02-19
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S60248637-A (JP)
Inventor: KURAUSU PUREFUTSUKE
IPC: C07C29/78
Filed: 1985-02-15
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H07235675-A (JP)
Title: Manufacture of semiconductor device
Inventor: KANBA KOJI
IPC: H01L29/78
Filed: 1994-02-24
Abstract: PURPOSE:To achieve the accuracy of the sizes of the side walls having the mutually different widths in a MOS transistor having the LDD structure excellently. CONSTITUTION:An oxide film 6a is formed in one semiconductor substrate region including the half part on one side of a gate electrode 4 by using LPD technology. The oxide film undergoes anisotropic etching by RIE technology. The procedure is repeated twice, and side walls having the mutually different widths are formed at the facing side wall parts of the gate electrode. It is not necessary to etch the oxide films having the mutually different thicknesses at the same time in the respective regions holding the gate electrode. Therefore, the surface of the semiconductor substrate is not exposed to DIE plasma for the long time. Thus, the occurrence of a crystal defect caused by irradiation of a diffused layer region 2 with the plasma is suppressed, and the increase in leakage current at a junction part caused by the crystal defect is suppressed. The width of the side wall of each side wall part of the gate electrode is formed with an accurate precision, and the semiconductor device is made to agree with the optimum operation design.
Patent JP-H09224026-A (JP)
Title: Communication node, fault recovery method and communication network
Inventor: AZUMA MITSUHIRO
IPC: H04M3/10
Filed: 1996-02-14
Abstract: PROBLEM TO BE SOLVED: To attain high-speed fault recovery with a little recovery messages by performing the fault recovery while using a topology table concerning an entire network. SOLUTION: After fault report messages are sent out, nodes A and C start an alternative route calculation phase. A node B receives the fault messages from the nodes A and C, records these messages, broadcasts a fault report message later and starts an alternative route calculation phase. In the alternative route calculation phase to be performed at the respective nodes A-C, an alternative route is calculated while using topology information, which is common for the respective communication nodes, specified by physical topology tables or logical topology tables preserved in the respective nodes. Since the alternative route is calculated at the respective communication nodes receiving the information concerning the fault while using this information, physical topology information and logical topology information, the high-speed fault recovery is possible with a little recovery messages.
Patent JP-S55118940-A (JP)
Title: Composite resin composition
Inventor: TAKAGI KANEYUKI
IPC: C08L33/00
Filed: 1979-03-08
Abstract: PURPOSE: To prepare the title composition having excellent sound insulating and absorbing characteristics, and processability, by melting and mixing a polyolefin with specific amounts of a specific thermoplastic rubber and an inorganic filler.  
     CONSTITUTION: A composition obtained by the melt-mixing of (A) a polyolefin, (B) a thermoplastic rubber incompatible with the polyolefin (e.g. styrene-butadiene rubber), and (C) an inorganic filler such as barium sulfate, zinc oxide, etc. The amount of the (B) component is more than 10vol% of the whole composition and less than the (A) component, and that of the (C) component is 20W50vol%. Combined use of the polyolefin with minor amount of other resin such as polystyrene improves the paintability without lowering the sound insulating and absorbing characteristics and processability of the original composition. 
     COPYRIGHT: (C)1980,JPO&Japio
Patent JP-H03233224-A (JP)
Title: Cooking heater
Inventor: IKEDO KATSURA
IPC: F24C7/04
Filed: 1990-02-08
Abstract: PURPOSE:To prevent the lowering of the performance and life of each part by providing the blower connected to a lower limit detection bimetal and continuously operating the same while the temp. in a main body case is lower limit temp. or higher. CONSTITUTION:A blower 10 is connected to a power supply 1 on one side thereof and connected to a lower limit detection bimetal 6 on the other side thereof. When a power supply switch 2 is turned ON and a thermal power controller 3 is set to definite quantity, temp. rises and, when the temp. reaches lower limit temp. or higher, the lower limit detection bimetal 6 transfers to a closed state to operate the blower 10. Even when the power supply switch 2 is turned OFF after cooking is completed, the lower limit detection bimetal 6 keeps the closed state by residual heat. Therefore, the blower 10 is operated regardless of ON-OFF of the power supply switch 2 until the temp. in a main body case reaches lower limit temp. or lower. by this constitution, it is prevented that each part in the main body case is exposed to high temp. and the lowering of the performance and life of each part is prevented.
Patent JP-S59152456-A (JP)
Title: Printing plate for electrophotomechanical process
Inventor: TSUTSUI KIYOUJI
IPC: G03G13/28
Filed: 1983-02-21
Abstract: PURPOSE:To obtain a printing plate for an electrophotomechanical process with high printing resistance by forming a layer contg. an alkali-soluble resin and a specified org. photoconductive compound on an elctrically conductive support. CONSTITUTION:A compound represented by the formula (where R1 is lower alkyl; R2 is lower alkyl, phenyl, lower alkyl-substituted phenyl, lower alkoxy- substituted phenyl or benzyl; and R3 is lower alkyl, lower alkoxy or H) is used as an org. photoconductive compound. An alkali-soluble resin (A) such as a styrene-maleic anhydride copolymer, said org. photoconductive compound (B) and additives (C) such as a dye sensitizer and a plasticizer are dissolved in an org. solvent. The resulting soln. is coated on an electrically conductive substrate such as an Al plate of about 0.1-1mm. thickness, and it is dried to form a photoconductive layer of about 1-30mum thickness. Thus, a printing plate is obtd.
Patent JP-H02207374-A (JP)
Title: Information processor
Inventor: OMODA KOICHIRO
IPC: G06F15/80
Filed: 1989-02-08
Abstract: PURPOSE:To properly use processors in correspondence to the processing contents of various programs and to realize high performance by arranging a vector processor and a parallel processors together and controlling activation and end from a scolar processor. CONSTITUTION:In addition to conventional constitution where a main storage device 1, scolar processor 6 and vector processor 5 are connected, a parallel processor 100 composed of a lot of processor elements (PE) 8-1 - 8-n is further provided to successively execute parallel processing by many processor elements for many parallel processing units. The activation and end of the vector processor 5 and parallel processor 100 are controlled by the scolar processor 6. Further, a holding means 7-2 is provided to hold the respective operating states of many PEs in the parallel processor 100 and a means 7-1 is provided to allocate the unexecuted parallel processing unit to the unoperated PE based on information from this holding means. Thus, in correspondence to the processing contents of the program, processing allocated to the three types of the processors in advance can be efficiently executed at high speed.
Patent JP-S56124829-A (JP)
Title: Combustion control device
Inventor: OOHARA TAKUO
IPC: F23N1/00
Filed: 1980-03-04
Abstract: PURPOSE:To ensure prevention of temperature of hot water from becoming excessively high, in a combustion device equipped with a gas burner, by increasing  volume of gas gradually in accordance with rise in temperature of going out hot  water. CONSTITUTION:When a knob 5 is operated to Open, a main valve 4 and a water valve 6 are opened, and at the same time, an ignition circuit 8 is activated to generate spark, and then, a pilot burner 2 is ignited. When this ignition is detected by a flame detecting circuit 9, a transistor Tr2 of a signal circuit 10B in an output circuit 10 is conducted, and in the condition that a Tr1 of a control circuit 10A is kept in OFF position, Tr3 becomes ON and a capacitor C2 is charged. And therefore, FET(T1) is gradually conducted by time constants of a resistance R3 and the capacitor C2, and a driving circuit 11 of an electromagnetic proportionating valve 3 is gradually driven through a nonreversible amplifying circuit 10D. The control circuit 10A controls motion of the signal circuit 10B on the basis of the output of a thermistor 12.
Patent JP-H05192511-A (JP)
Title: Method and apparatus for heating/degassing
Inventor: KAWAI YOSHIO
IPC: B01D19/00
Filed: 1992-01-20
Abstract: PURPOSE:To degass dissolved gas in a supersaturated state within a short time to remove the same as gas bubbles by holding heat flow density to a specific value or more by a heater to heat and boil the local part of a liquid. CONSTITUTION:The local part of a liquid is heated and boiled by holding heat flow density to 10W/cm<2> or more, pref., 30W/cm<2> or more by a heater to remove the dissolved gas in the liquid. That is, a heating degassing apparatus is constituted of a heating part wherein a heater 2 is provided to the lower part of a main body 1 and an upper gas bubble separating part 3. A raw material liquid is supplied to the main body 1 from the inlet 6 thereof while it passes through a flowmeter 5 from a storage tank 4 and heated by the heater 2 and the dissolved gas becoming gas bubbles rises along with the liquid to float on the surface of the liquid within the gas bubble separating part 3 and is separated into mist and the gas by a mist separator 7 and the gas is discharged from a vacuum system composed of a vacuum pump 10 through a receiver tank 9. The degassed liquid is discharged from a discharge line 8 and can be also circulated to the storage tank 4 if necessary.
Patent JP-H10225822-A (JP)
Title: Electric discharge machining control device
Inventor: MIZUKAMI HIROTAKA
IPC: B23H7/20
Filed: 1997-02-12
Abstract: PROBLEM TO BE SOLVED: To stably continue machining by arranging a judging part to judge whether or not a stored reference value is changed with respective items according to a time series change in a deviation and a changing means to change the stored reference value on the basis of an obtained judging result. SOLUTION: A machining condition deviation calculating part 11 finds a deviation between an output value and a reference value of a machining condition. Then, a machining condition deviation judging part 12 judges whether or not the deviation is larger than a change judging value, and also judges whether or not a counter CNT is larger than 0 and is also less than the reference number of times if it is judged as large. Here, when judged that the CNT is larger than 0 and is also less than the reference number of times, a machining condition reference value changing part 13 finds a reference value by adding or subtracting a prescribed operation value to or from a reference value of the machining condition.
Patent JP-H08201434-A (JP)
Title: Magnetic card reader/writer
Inventor: NIINO KOJI
IPC: H04N7/16
Filed: 1995-01-25
Abstract: PURPOSE: To easily handle and operate a magnetic card reader/writer by eliminating the physical burden of charged electric equipment and easily control the electric equipment. CONSTITUTION: A magnetic card reader/writer is composed of a remote control section 4 in which a means which changes the operation of utilized electric equipment including a control switch and adjusts channels or sound volume, power supply turning on/off means 5, and sound generating means 6 composed of a loudspeaker are arranged on a control board 3 provided with a connecting section 2 which can be connected to used electric equipment 7. The magnetic card reader/writer is equipped with a microcomputer means 9 which performs arithmetic processing on the frequency of data read from a magnetic card C at every unit time, rewrites the data by performing addition and subtraction, and can confirm the using frequency of the card C from signals so that charged electric equipment can be operated easily with the card C.
Patent JP-S58145136-A (JP)
Title: Manufacture of semiconductor device
Inventor: ATSUMI TSUNEO
IPC: H01L21/316
Filed: 1982-02-23
Abstract: PURPOSE:To improve the difficulty of the semiconductor manufacturing process due to the warpage of an wafer, and to enable to manufacture the semiconductor device without depending upon the material of glass and the glass passivation adhesion method by a method wherein after the electrode regions of the semiconductor element is patterned, glass films are formed, and the glass films thereof are removed selectively when electrodes are to be formed afterward. CONSTITUTION:The electrode forming regions and patterned on the surface of the semiconductor element at first. A resist film 26 is adhered on the surface thereof, and a passivation forming region only is etched selectively to form a mesa groove 27. The resist film 26 is removed, and the glass passivation film 28 is adhered on the mesa groove 27. When the glass passivation film 28 is to be formed, the glass layers 29, 30 are formed also on the surface and the back of the exposed semiconductor. A photo sensitive resist film 32 is formed selectively only on the glass passivation film 28 on an SiO2 film 3, and the glass layers 29, 30 on the surface and the back are etched.
Patent JP-S62186427-A (JP)
Inventor: KOBAYASHI AKIO
IPC: H01H33/56
Filed: 1986-02-13
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H07235480-A (JP)
Title: Projection aligner and aligning method
Inventor: KITAJIMA HIRONOBU
IPC: H01L21/027
Filed: 1994-02-25
Abstract: PURPOSE:To provide a projection aligner being employed in a semiconductor fabrication process in which the illuminance is prevented from lowering or fluctuating due to adhesion of impurities, produced through photochemical reaction caused by light having shorter wavelength than the exposing light, to an optical component such as a lens. CONSTITUTION:A filter film 22 transmitting the light of exposing wavelength but attenuating the light having shorter wavelength is applied to the outer wall or the glass tube of a mercury lamp 1. A glass cover 10 for shielding an optical component from the outer atmosphere and means 11 for heating the glass cover 10 are disposed closely to the optical component 3.
Patent JP-H08222826-A (JP)
Title: Printed wiring board
Inventor: TSUJIMOTO IKUO
IPC: H05K1/18
Filed: 1995-02-16
Abstract: PURPOSE: To obtain a printed wiring board wherein excellent solder fillets are formed on the opposite sides of a through hole and thereby sufficiently strong joining is made even in the case when an electronic component having a recessed part which is formed on one side thereof and in which a lead wire is provided is mounted by pin insertion. CONSTITUTION: In a printed wiring board wherein the outer periphery 4 of a recessed part 1 of an electronic component 3 which is formed on one side of the component and wherein a lead wire 2 is provided is brought into contact with the surface of the printed wiring board 5 and the electronic component is mounted by pin insertion by double-sided through hole solder joining, indentations 6 stretching from the inside of the recessed part 1 to the outside of the outer periphery 4 of this recessed part 1 are formed in a plurality intermittently in the part of the surface of the printed wiring board 5 corresponding to the outer periphery 4 of the recessed part 1.
Patent JP-S55120418-A (JP)
Title: Manufacture of thin diameter steel pipe with inner surface provided with metallic or alloy protective coat
Inventor: USUI MASAYOSHI
IPC: B21C37/06
Filed: 1979-03-11
Abstract: PURPOSE: To spread the electrically plated film over the inner surface to form the uniform protective coat, by first forming the electrically plated film of tin, etc., continuously and longitudinally in the inner surface of the thin diameter electric welded steel pipe made from single or double wound steel strip, and then, by heating within the nonoxidizing gas.  
     CONSTITUTION: The electrically plated film 4 comprising tin, lead, etc., is longitudinally, continuously formed at the end plane 1b longitudinally continuing between both side edges 1, 1', of the steel strip 1 being applied with the copper plating, for example, on one side. Next, this sheet 1 is sent into the pipe former so as to make the film 4 to be inside of the pipe, and both side edges 1a, 1a, are heated by the electrode roll, and are pressure welded by the pressure welding roll; hereby, the electric welded pipe (p) is formed. Then, the inner and outer surfaces of this pipe (p) are exposed to the nonoxidizing gas or reducing gas atmosphere, and also, the pipe (p) is heated to temperatures higher than the melting and flowing point of the film 4, in order to melt and spread the film 4 over the inner surface. Hereby, the entire surface inside of the pipe (p) is coated with the protective coat 6 comprising the film 4, and the aim thin diameter steel pipe P is manufactured. Besides, the thin diameter steel pipe whose inner surface is provided with the protective coat is manufactured through the similar procedure from the double wound pressure welded pipe (t). 
     COPYRIGHT: (C)1980,JPO&Japio
Patent JP-S63197105-A (JP)
Title: Standard antenna
Inventor: MURAKAWA KAZUO
IPC: H01Q7/00
Filed: 1987-02-12
Abstract: PURPOSE:To theoretically obtain the characteristic by setting the characteristic impedance of a feeding point of two antenna elements to a value being over the impedance of the antenna element side of an electronic circuit. CONSTITUTION:Since the electronic circuit is built in a metallic case 2, the distance between an oscillator 3 and feeding points A, A' is only the thickness of the metallic case 2 without giving adverse effect onto the basic characteristic of the antenna thereby decreasing the feeding distance. Then the condition of Zd>=Z0 is to be satisfied, where Z0 is the characteristic impedance by the thickness (feeding length l) of the metallic case at antenna feeding points A, A' and Zd is the impedance when viewing the antenna element from the feeding point A, A'. Thus, the antenna factor (ratio of an output voltage Vd with respect to input voltage V0) is not changed over + or -3dB. Moreover, the upper semi-sphere is formed to be an umbrella-shaped cavity semi-sphere, then the static capacitance Cd when viewing the antenna elements 1, 2 from the feeding points A, A' is decreased. Thus, the structure above is used as the standard antenna whose characteristic is obtained theoretically.