baber/WOPTO huggingface dataset:
Patent JP-H06350851-A (JP)
Title: Background density detection device
Inventor: OSUGA BUNICHI
IPC: H04N1/407
Filed: 1993-06-03
Abstract: PURPOSE:To provide a background density detection device which precisely detect the density of a background. CONSTITUTION:The background density detection device 10 is provided with a picture data division part 12 which equally divides picture data of one piece of original into plural blocks, a frequency detection part 14 detecting the frequencies of respective density in one block, a most frequent density detection part 16 detecting most frequent density becoming most frequent among the frequencies of respective density for the respective blocks, which the frequency detection part 14 detects, a high density cumulative frequency calculation part 18 integrating all the frequencies of density, which are more than a value obtained by adding an offset value to most frequent density detected from the respective blocks, and calculating a high density cumulative frequency and a background density detection part 22 detecting background density based on most frequent density detected in the most frequent density detection part 16, the high density cumulative frequency calculated in the high density cumulative frequency calculation part 18 and a threshold.
Patent JP-H01300751-A (JP)
Title: Telephone number discriminating and display system
Inventor: TANAKA TAKASHI
IPC: H04M1/57
Filed: 1988-05-30
Abstract: PURPOSE:To immediately display a telephone number of a calling telephone set by adding a function for receiving a response signal to a response telephone set and an automatic telephone number sending-out function to the calling telephone set, and adding functions for detecting a call signal, sending out a response signal and discriminating a multi-frequency sound signal, to a called telephone set. CONSTITUTION:When a handset is picked up in a telephone set 1(2), a speech path between a telephone set 1(1) and the telephone set 1(2) is closed, and a hook-off signal 13 is sent out of the telephone set 1(2). A response signal sending-out circuit 11 inputs the hook-off signal 13 and a detecting signal 14, and sends out a response signal to a calling telephone set 7. The calling telephone set 7 sends out a number sending-out command signal 5. A number sending-out circuit 3 sends out a telephone number of the calling telephone set 7 which has been set to a number setting circuit 4. A calling number receiving and display circuit 12 of a called telephone set 9 receives this sound signal, discriminates a calling telephone number and displays the number by numerals.
Patent JP-S5658290-A (JP)
Title: Hall element
Inventor: HOUJIYOU AKIMICHI
IPC: H01L43/06
Filed: 1979-10-18
Abstract: PURPOSE:To obtain the characteristics of high performance and high reliability by a method wherein a lead terminal unified with a pellet mounting region of a lead frame is selected as one of output terminals, and input terminals are selected from other lead terminals. CONSTITUTION:A Hall element pellet 1 is glued to a pellet mounting region 6 of a lead frame with conductive paste. Four ohmic electrodes 2-5 of a Hall element are each connected to the lead terminals 2'-5' of the lead frame by wire bonding by gold wires. In the Hall element incorporated in such structure, the potential of the terminal 4' is equal to one of not only the electrode 4 but also the back of the Hall element. Here, the terminals 3'-5', a pair of terminals except the terminals 4' are selected as the input terminals of the Hall element. Thus, the reliability of the Hall element can be improved because an extent of the concentration of an electric field near the electrodes is reduced against high control currents. The resistance of the element is not also changed against the polarity inversion of currents.
Patent JP-H05328583-A (JP)
Title: Cable connection provided with charge condition monitoring function
Inventor: MIYAUCHI HIDEYUKI
IPC: H02G15/08
Filed: 1992-05-26
Abstract: PURPOSE:To easily check the charge condition of a power cable line at the cable connection. CONSTITUTION:The voltage applied to a power cable is divided by two-layer structure of capacitors C1 and C2 by forming the two-layer structure of capacitors C1 and C2 in a power cable connection, using one part of the reinforcing insulating layer 3 of the power cable connection. The divided voltage is given to a voltage display means 20 consisting of, for example, a liquid crystal, and the charge condition of the power cable is displayed. The divided voltage V can be decided by properly adjusting the thickness of the reinforcing insulating layer 3 of the cable connection and the thickness of the insulating tape layer 32.
Patent JP-S63298926-A (JP)
Title: Installing structure of lightning insulator
Inventor: NAKAYAMA TETSUYA
IPC: H01B17/46
Filed: 1987-05-28
Abstract: PURPOSE:To reduce the bending moment inflicting to a lightning insulator and to make the size of the insulator compact by placing a damper to damp the mechanical vibration between the lower surface of an installing adapter installed at the supporting arm of an iron tower and the upper surface of an electrode metal at the grounding side. CONSTITUTION:To an installing adapter 13 installed to the supporting arm of an iron tower, the first lightning insulator 15A is installed through a damper 20 swayable each other. As a result, even though the iron tower is swayed by a strong wind or an earthquake, the delivery of the vibration is damped extensively, delivering only the vibration after the damping to the lightning insulator, and the bending moment owing to the inertial force of the insulators 15A and 15B is also reduced extensively compared to the case of no damper. The mechanical strength of the lightning insulators can be reduced accordingly, and the insulators can be made in a compact and light size. On the other hand, an excessive bending stress at the junction J between the installing adapter 13 and the lightning insulator 15A is absorbed by the damper, and the deformation or the damage at the junction is prevented, while the bending moment to the supporting arm can be reduced.
Patent JP-H07321057-A (JP)
Title: Film-forming device for semiconductor device
Inventor: HORINOUCHI NORIHITO
IPC: H01L21/31
Filed: 1994-05-23
Abstract: PURPOSE:To reduce an exhaust gas treatment and a burden of maintenance, to prevent film quality from being deteriorated and to ensure the evenness of a gas concentration by a method wherein a gas injection hole for injecting gas locally on a substrate is made to scan all over the upper part of the substrate and the gas subsequent to the injection is rapidly sucked. CONSTITUTION:An external reaction gas feeding device and a gas supply and exhaust tube 6 connected with a gas suction device to suck gas subsequent to reaction are provided in the interior of a reaction chamber 1. This tube 6 is extendedly provided in parallel to a wafer A and is provided with a flexible tube 7 in its intermediate part. A point side movable part of the tube 6 is formed in such a way that the movable part is bent in its middle as a nozzle 8 and a point opening part 9 of the movable part opposes to the surface of the wafer A. That is, the nozzle 8 scans the surface of the wafer A in the radius direction of the wafer A. When this scanning is conducted while the wafer A is rotated by a substrate rotating device 3, the nozzle 8 can be made to scan all over the surface of the wafer A.
Patent JP-H10325852-A (JP)
Title: Selection jig
Inventor: UEHARA TORAHIKO
IPC: G01R31/26
Filed: 1997-05-23
Abstract: PROBLEM TO BE SOLVED: To provide a selection jig capable of performing good selection and inspection working of contact in simple structure. SOLUTION: A plurality of contact pins 4 connected to the pads 3a of LSI 3 are vertically provided on a contact block 5 in response to the positions of the pads 3a. The contact block 5 is fixed on a substrate 6. The contact pins 4, the contact block 5 and the substrate 6 are electrically connected to one another and conducted to a tester part. In addition, a press mechanism 1 for pressing the package of LSI 3 is disposed at a position opposed to the formation area of the contact pin 4. A flat plate-like lapping film 2 being a polishing part is provided on the face part of the side of the contact pin 4 of the press mechanism 1.
Patent JP-H06350188-A (JP)
Title: Semiconductor laser element
Inventor: MATSUBARA KUNIO
IPC: H01S5/00
Filed: 1993-06-04
Abstract: PURPOSE:To increase accuracy of the width of a third clad layer and stabilize threshold current at oscillation start. CONSTITUTION:A semiconductor laser element has a structure formed by laminating a substrate 1, a first clad layer 2, an activating layer 3 and a second clad layer 4, a third clad layer 5, a fourth clad layer 9 and contact layer 6 in such order and by burying current bottlenecking layers 8 on 1 both side planes of the third clad layer 5 which is a stripe-shaped mesa part. Especially the thickness of the third clad layer 5 is permitted to be small within a range of 0.2-0.5mum, and an etching depth, which has been conventionally approximately 1.5mum including a contact layer, is reduced. Therefore, the width of the third clad layer 5 is accurately reduced to a desired size, and laser beam oscillation is stabilized by forming the fourth clad layer 9 and the contact layer 6 at the third deposition process to deal with the thinned third clad layer 5.
Patent JP-H01306102-A (JP)
Title: Complex cutter table provided with y-axis function and machining method
Inventor: YAMANAKA HIDEHARU
IPC: B23P23/02
Filed: 1988-05-31
Abstract: PURPOSE:To enable assembling as an attachment and to enable Y-axis movement over a wide range by securing a turned work then indexing a Y-axis unit through swivel of a turret thereafter rotating a rotary tool and turning the rotary tool around the axis of turning shaft through NC control while simultaneously moving the rotary tool along Z-axis. CONSTITUTION:Rotation of a spindle is regulated to secure a work W to be held, then a turret 3 is turned to index a Y-axis unit 23 to a machining position so as to rotate a rotary tool shaft 8 mounting a rotary tool T and moving a cutter table body in X, Z axis directions thus positioning the tip of the tool T at the work W. Then the tool shaft 8 is turned around a turning shaft 5 to feed the tool T in Y-axis direction and to move the cutter table body in Z-axis direction thus machining a plane parallel to an axis having a perpendicular endface (d) at a portion of the outer circumference of the work W. The tool T mounted on the tool shaft 8 is turned around the turning shaft 5 and point positioned while the cutter table body is moved in Z-axis direction and point positioned, then Y-axis positioning is made through combination thereof thus carrying out boring at a position separated from the center.
Patent JP-H06350065-A (JP)
Title: Solid-state image pickup device and its manufacture
Inventor: UCHIYA SATOSHI
IPC: G02B3/00
Filed: 1993-06-04
Abstract: PURPOSE:To improve a converging factor by a lens array and to raise sensitivity by thinning a polycrystalline silicon film at a part having an influence on the shape of a shading film, concerning to a solid-state image sensing device with a lens array. CONSTITUTION:Only at a wiring part (transfer electrode wires 10A and 15A) where the value of resistance becomes an imprortant factor, a polycrystalline silicon film part is thickened by doubling polycrystalline silicon films, and a part having an influence on the shape of a shading film on a charge transfer part (transfer gate electrodes 8-1A and 8-2A) is thinned by leaving only the second one out of the two layers of the polycrystalline silicon films.
Patent JP-S5834733-A (JP)
Title: Control process of tire assembly line
Inventor: FUJII HIROSHI
IPC: B23P21/00
Filed: 1981-08-25
Abstract: PURPOSE:To permit automation of the tire assembly line and save manhour by performing transportation of wheels, and tires, tire assembly bodies and control of a various kinds of equipment by means of the information signals outputted successively from a computer. CONSTITUTION:The tire transported by a conveyor 11 according to the signal from a host computer 70 is sent to a tire setting apparatus 18a through a conveyor 18 and a distributor 15, and sent to a wheel-diameter detecting apparatus 19a and placed on the wheel for which centering has been performed, and temporarily set. The tire assembly body set temporarily is sent to a mounter 37a, and the clearance in the tire pressing part is automatically adjusted by the signal of a line computer 71, and the tire in the temporarily set state is fitted onto a wheel. The tire assembly body is shifted to an inflator 38a, and air is charged, and the tire assembly body is distributed to the second assembly lines 4a, 4b, and 4c, and tire assembly is completed with balancers 51a, 51b, and 51c.
Patent JP-H01302838-A (JP)
Title: Semiconductor device and its manufacture
Inventor: ENDO NOBUHIRO
IPC: H01L21/205
Filed: 1988-05-31
Abstract: PURPOSE:To reduce a junction leakage current and a leakage current flowing along a side wall and to improve an electrical characteristic of a semiconductor device by a method wherein a side wall at the bottom of an opening part in an amorphous insulating film is formed of a silicon nitride film and a side wall at the upper part of the opening part in the amorphous insulating film is formed of a silicon oxide film. CONSTITUTION:In a semiconductor device having a device isolation structure where silicon 4 is filled into an opening part in an amorphous insulating film 2 by a selective epitaxial growth method, a side wall at the bottom of the opening part in said amorphous insulating film 2 is formed of a silicon nitride film 3 and a side wall at the upper part of the opening part in said amorphous insulating film 2 is formed of a silicon oxide film. For example, a device isolation structure where a silicon film 4 is filled into an opening part formed in a silicon oxide film 2 by a selective epitaxial growth method is constituted; a side wall at the bottom of the opening part is formed of a silicon nitride film 3. By this setup, the silicon selective epitaxial film 4 becomes a silicon growth film having a good-quality crystal without a crystal defect; a fixed electric charge at an interface between silicon and the side-wall silicon oxide film 2 can be reduced; a leakage current flowing near the side wall can be reduced.
Patent JP-S6112470-A (JP)
Title: Method of manufacturing retainer for trim member
Inventor: TAMURA TATSUYA
IPC: B29C48/07
Filed: 1984-06-28
Abstract: PURPOSE:To make it possible to simply and automatically produce retainers and to make the thickness of damping members variable to commonly use the retainers for several kinds of trim members, by forming notches in a metal strip and by cutting the strip along the notches after extrusion molding thereof. CONSTITUTION:Upon manufacturing, at first a metal strip material 21 is fed from a roll 21, and an adhesive 24 is coated by means of a roll coater 23 on both surfaces of the strip 21 at one side thereof. Then, substantially U-like shape notches 27 extending widthwise of the strip 21 are punched out by means of a press 26. Then the strip 21 is subjected to extrusion moulding by means of an extrusion die 29, and is covered with a continuous synthetic resin 30 in one widthwise part of the strip 21. Thereafter, the extruded material 31 is cooled by a cooling device 32, and is cut at cutting positions in the intermediate sections of the notches 27 at the same pitches as those of the notches 27 by means of a cutting device 34 while it is drawn up by means of a drower device 33, thereby retainers are manufactured. The thus manufactured retainers 10 each have a base section 11, a narrow width section 12, a damping member 14, etc.
Patent JP-S5657391-A (JP)
Title: Ultrasonic oscillator
Inventor: MIYAZAKI JIYUNJI
IPC: G01N29/24
Filed: 1979-10-17
Abstract: PURPOSE:To eliminate the variance of intensity at a close-distance sound field, by forming the disk-type oscillator into a curved structure in which the thickness is reduced at the center part and increased at the circumference part respectively. CONSTITUTION:The oscillator 2 has the maximum amplitude at its thickness S= lambda/2 and has deterioration of the efficiency as the thickness is reduced or increased. In this connection, the thickness of the oscillator is set to lambda/2 at the center part and then increased toward the circumference. As a result, the waveform of a simple gauss-type distribution can be obtained even at a close-distance sound field as well as the waveform in which the side lobe is reduced greatly even at a long-distance sound field. Thus the quality of a picture can be improved.
Patent JP-H09320822-A (JP)
Title: Thick-film resistor, manufacture thereof, and resistance measuring device of thick-film resistor
Inventor: EGUCHI KENICHI
IPC: H05K1/16
Filed: 1996-05-28
Abstract: PROBLEM TO BE SOLVED: To provide a thick-film resistor which can cope with the higher accuracy and higher integration demands. SOLUTION: In the thick-film resistor 30, electrode conductors 31 and 32 are formed as opposed to each other, and a resistor 33 is printed between the electrode conductors 31 and 32. A length L1 corresponding to the opposing parts of the both electrode conductors 31 and 32 is made to be smaller than a width W1 of the resistor 33. The value of the resistance of the resistor 33 is adjusted by laser trimming according to a trimming loci 34 and 35. According to the trimming locus 34, trimming is carried out in a length direction of the resistor 33 on one end side of the electrode conductor 31, is changed in its trimming direction at a curved direction change part 34a of the locus, and then is carried out as far as an outer end of the resistor 33.  In the trimming focus 35, trimming is carried out in the length direction of the resistor 33 on one end side of the electrode conductor 32, is changed in its trimming direction at a curved direction change part 35a of the locus 35, and then is carried out as far as an outer end of the resistor 33.
Patent JP-S6111279-A (JP)
Title: Pressure-sensitive transfer ribbon
Inventor: KOBAYASHI KATSUHIKO
IPC: B41M5/10
Filed: 1984-06-28
Abstract: PURPOSE:To eliminate oil bleeding, deterioration in printing quality and lowering of strike-over performance in the use of subject ribbon by specifying composition of vinyl chloride and vinyl acetate of a resin which forms a fine porous structure and by containing in a pressure-sensitive transfer ink layer 5-30% by weight of fine fiber particles against the whole quantity of the former. CONSTITUTION:Vinyl chloride.vinyl acetate copolymer of different rates of copolymerization is used for a fine porous structure of a pressure-sensitive transfer ink layer. The fine porous structure stands the impact of being hit and is required to ooze out ink by a capillary action a little by little from inside without releasing it all at once, and, therefore, the copolymer of vinyl chloride and vinyl acetate is used; but if the rate of copolymerization of vinyl chloride is too big, the ink does not ooze out satisfactorily and, on the other hand, if it is too small, oil bleeding wound be extremely inferior. For the above reason the rate of copolymerization should be within the range of 86:14-60: 40. In addition, vinyl chloride.vinyl acetate copolymers of different degrees of polymerization of average degrees of polymerization of 250-350, 360-450, and 800-900 are mixed at the rates by weight of 1-3:5:3-1. Further, fine powder, specifically fine fibrous powder, of 5-30% by weight against the whole quantity of the ink layer is used.
Patent JP-S5358216-A (JP)
Title: Preparation of materials for magnetic head core
Inventor: TAKAMURA MASAYUKI
IPC: G11B5/147
Filed: 1976-11-08
Abstract: PURPOSE: To readily obtain a laminate layer material of good thichness accuracy even with the material which cannot be cold relled, without depending upon the bonded laninate layers of thin plate materials by hot-roolling the laminate comprising laminating a glass layer between plate form magnetic materials. 
     COPYRIGHT: (C)1978,JPO&Japio
Patent JP-H05318168-A (JP)
Title: Multilayered solder material foil and its production
Inventor: MORI AKIRA
IPC: H05K3/34
Filed: 1992-05-26
Abstract: PURPOSE:To increase the bond strength of a core material layer and a surface layer by forming a surface layer of a low melting solder material on the surface of a core material layer consisting essentially of lead and heating the material to the m.p. of the surface layer or above. CONSTITUTION:The surface layer consisting of the solder material having the m.p. lower than the m.p. of the core material layer is formed on the surface of the core material layer consisting essentially of lead or lead alloy. The material is then heated to the temp. above the m.p. of the surface layer to form the multilayered solder material foil 3. The heating rate in heating is preferably kept at <=20 deg.C/sec at this time. The surface layer melted by heating is sufficiently wetted with the surface of the core material layer and is then solidified. This multilayered solder material foil 3 is formed by blanking to a prescribed shape.
Patent JP-S63297418-A (JP)
Title: Cover lay film
Inventor: EIKUCHI KICHIJI
IPC: C08G59/00
Filed: 1987-05-29
Abstract: PURPOSE:To provide the titled film containing a carboxyl-containing polyester polymer, an epoxy polymer, a phenolic polymer, inorganic fine powder and a curing agent at specific ratios, having excellent adhesivity, wet solder resistance and thermal degradation resistance and useful as a flexible printed circuit board. CONSTITUTION:The objective film has a composition composed of (A) 100pts.wt. of a polyester polymer containing carboxy group (preferably having an acid value of 60-200 equivalent/10<6>g and a softening point of >=120 deg.C), (B) 10-90pt.wt. of an epoxy polymer, (C) 10-90pts.wt. of a phenolic polymer (the sum of the components B and C is 20-100pts.wt.), (D) 1-60pts.wt., preferably 5-40pts.wt. of inorganic fine powder (e.g. silica powder having particle diameter of preferably <=1mum) and (E) 0.1-50pts.wt., preferably 0.5-10pts.wt. of a curing agent (e.g. 2-alkyl-4-methylimidazole).
Patent JP-H04359888-A (JP)
Title: High frequency heating device
Inventor: SHIBUYA MAKOTO
IPC: F24C7/02
Filed: 1991-06-05
Abstract: PURPOSE:To enhance the cooling efficiency of a high frequency heating device and prevent a radiation noise or an undesired sound generated in the high frequency heating device from leaking outward by providing an air guide in an integrated high frequency heating device, connecting the high frequency heating device of a high frequency heating cooking device. CONSTITUTION:A high frequency heating device 21 is composed of a microwave generator 22, an electric power converting device 23, a cooling means 26, and a storing part 27 for storing them; a first air guide 43, for introducing an air being inhaled by the cooling means 26, and a second air guide 41, for introducing an air being discharged from the cooling means 26, are mountably provided in the high frequency heating device, thereby it is possible to prevent a radiation noise or an undesired sound generated in the high frequency heating device from leaking outward.