Patent SG-11201906177W-A (SG)
Title: Transparent film error correction pattern in wafer geometry system
Inventor: LIU HELEN
IPC: H01L21/66
Filed: 2018-01-05
Abstract: Title: TRANSPARENT FILM ERROR CORRECTION PATTERN IN WAFER GEOMETRY SYSTEM (57) : A system includes one or more wafer geometry measurement tools con- figured to obtain geometry measurements from a wafer. The system also includes one or more processors in communication with the one or more wafer geometry measurement tools. The one or more processors are configured to apply a correction model to correct the geometry measurements obtained by the one or more wafer geometry measurement 0.3 Jjtools. The correction model is configured to correct measurement errors caused by a transparent film positioned on the wafer. 0.1 0.05 W O 20 18/129385 Al D.25 0.2 0.15 FIG.9B 4900 5000 5100 5200 5300 True Thickness (nm) n 902— N D.35 (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 12 July 2018 (12.07.2018) WIP0 1 PCT 0111111010 0111 °nolo VIII H Imo oimIE (10) International Publication Number WO 2018/129385 Al (51) International Patent Classification: HO1L 21/66 (2006.01) (21) International Application Number: PCT/US2018/012673 (22) International Filing Date: 05 January 2018 (05.01.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/443,815 09 January 2017 (09.01.2017) US 15/649,259 13 July 2017 (13.07.2017) US (71) Applicant: KLA-TENCOR CORPORATION [US/US]; Legal Dept., One Technology Drive, Milpitas, California 95035 (US). (72) Inventors: LIU, Helen; 48617 Tonopah Court, Fremont, CA 94539 (US). ZENG, Andrew; 134 Leal Way, Fremont, California 94539 (US). (74) Agent: MCANDREWS, Kevin et al.; Kla-Tencor Corpo- ration, Legal Dept., One Technology Drive, Milpitas, Cali- fornia 95035 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). [Continued on next page] WO 2018/129385 Al D ill Published: with international search report (Art. 21(3)) before the expiration of the time limit for amending the claims and to be republished in the event of receipt of amendments (Rule 48.2(h))