baber/WOPTO huggingface dataset:
Patent TW-504828-B (TW)
Title: Bi-directional electrical overstress and electrostatic discharge protection apparatus
Inventor: CHEN WEI-FAN
IPC: H01L27/02
Filed: 2001-08-17
Granted: 2002-10-01
Abstract: A kind of bi-directional EOS/ESD (electrical overstress and electrostatic discharge) protection apparatus is disclosed in the present invention and is suitable for use in the input/output (I/O) port. The EOS/ESD protection apparatus contains a P-type semiconductor layer, the first N-type conducting layer, the second N-type conducting layer, the first P-type doped region, the first N-type doped region, the second P-type doped region and the second N-type doped region. The first N-type conducting layer and the second N-type conducting layer are respectively disposed on the P-type semiconductor layer surface. The first P-type doped region and the first N-type doped region are entirely disposed on the first N-type conducting layer surface. The second P-type doped region and the second N-type doped region are entirely disposed on the second N-type conducting layer surface. The first N-type doped region is connected to an I/O bonding pad, and the second N-type doped region is connected to a power source line. Regardless of the voltage polarities, all the signals are transmitted through the I/O bonding pad. When the voltage of the I/O bonding pad exceeds a constant range, the bi-directional EOS/ESD protection apparatus is then conducted to release the stress and protect the inner circuit.
Patent TW-I256123-B (TW)
Title: Diode able to avoid damage of electrostatic discharge and production method thereof
Inventor: YU TA-LEE
IPC: H01L23/60
Filed: 2001-08-22
Granted: 2006-06-01
Abstract: This invention is a method for manufacturing electrostatic discharged diode in the same well rather than defined in the shallow trench, which decreases series resistance of the diode to avoid aggregation of the electric current and improves forward current characteristic of the diode. This method is also suitable for the conventional process of shallow trench isolation, especially suitable for the isolation technique with silicon on the isolation layer.
Patent TW-542957-B (TW)
Title: System and method for providing reliable transmission in a buffered memory system
Inventor: DODD JAMES M
IPC: G06F13/42
Filed: 2001-09-19
Granted: 2003-07-21
Abstract: The present invention provides a system and method for providing reliable transmission in a buffered memory system. The system includes memory devices, a memory controller, data buffers, an address/command buffer, and a clock circuit. The memory controller sends data, address information, status information and command information, to the memory devices and receives data from the memory devices. The buffers interconnect the memory devices and the memory controller. The clock circuit is embedded in the addr/cmd buffer. The clock circuit takes an input clock and outputs an output clock to the data buffers and/or the memory devices to control clock-skew to the data buffers and/or the memory devices.
Patent TW-510090-B (TW)
Title: Method and apparatus for efficient Walsh covering and summing of signals in a communication system
Inventor: SCHLEGEL NIKOLAI
IPC: H04J13/00
Filed: 2001-09-28
Granted: 2002-11-11
Abstract: A method and apparatus is provided for efficient processing of signal in a communication system. The processing of the signal for transmission may include encoding a block of data at an encoding rate 1/R. The encoding produces R number of data symbols for every data bit in the block of data. A block of RAM (299,600) is partitioned into a plurality of blocks of RAM to allow reading simultaneously data symbols from the plurality of blocks of RAM to produce an in-phase and a quad-phase data symbols simultaneously. At least two scramblers (306 and 307) are used for simultaneously scrambling the in-phase and quad-phase data symbols. A Walsh covering/summing block (700) followed by the scramblers provides efficient Walsh covering and summing of signals for a combined transmission from the communication system.
Patent TW-520552-B (TW)
Title: Method for forming copper diffusion barrier layer by self-aligned displacement reaction
Inventor: TU YEUR-LUEN
IPC: H01L21/768
Filed: 2001-11-05
Granted: 2003-02-11
Abstract: The present invention provides a method for forming a copper diffusion barrier layer, particularly a method for forming a copper diffusion barrier layer by a self-aligned displacement reaction on a semiconductor substrate with a groove structure. The abovementioned method comprises: forming a barrier layer on the sidewall and the bottom of the abovementioned groove; forming a copper conductive layer on the barrier layer; performing a displacement reaction to convert the surface of the copper conductive layer into a tantalum layer; and applying a plasma nitriding process on the tantalum layer to form a tantalum nitride layer.
Patent TW-I258783-B (TW)
Title: Black plaster, plasma display panel and process for manufacturing thereof
Inventor: MATSUMOTO MASAHIRO
IPC: C08K3/08
Filed: 2001-11-06
Granted: 2006-07-21
Abstract: For increasing display contrast of a plasma display panel, a metallic electrode with high reflection ratio will be placed on the front panel in order to achieve the object of reducing reflection from outside light. Under a circumstance of forming a black layer with low transparency and reflection, it needs to contain an oxide of high valence Ruthenium or Ruthenium oxides so as to let said black layer have high black color tint and conductivity. The invention provides a black plaster, a plasma display panel comprising a black layer having cobalt oxides and glass component thereon, and a process for preparing thereof.
Patent TW-522123-B (TW)
Title: Method for manufacturing a packaging bag
Inventor: LIN IRENE H
IPC: B31B50/59
Filed: 2001-11-26
Granted: 2003-03-01
Abstract: Disclosed is a method for manufacturing a packaging bag. The packaging bag is made of an air permeable material with an air permeable film that is formed with a plurality of slits and a non-sticky sealing material layer located above the film, wherein the sealing material is a sealant filled into the slits to avoid leakage from the slits. On the opposing sides of the film slits are formed with an air permeable structure that is deformed under pressure deviations. The air permeable packaging bag of this invention may be implemented to food packaging, where pressure deviations are formed between the interior and exterior of the packaging bag, so as to serve as excellent, dynamic pressure adjustment and burst-proofing means under high temperature or high pressure, while inhibiting lost of evaporative substance. The packaging bag maintains freshness under normal or low temperature. For heating purpose, the packaging bag may be placed in a microwave oven for heating the packaged food.
Patent TW-583555-B (TW)
Title: Menu prompt server, menu prompt system, menu prompt method and the recording medium
Inventor: SUZUKI SHIGEMI
IPC: H04M1/72469
Filed: 2001-12-06
Granted: 2004-04-11
Abstract: The present invention provides a menu prompt system 10, which comprises: a menu prompt server 12, and a PHS terminal 16 connected to a menu prompt server 12 through a PHS cell network 14. The menu prompt server 12 includes a storage 18 and a menu prompt portion 20. The storage 18 can be stored with a plurality of additive directory screens 22a-22z, which are used to introduce a plurality of contents transmitted to the PHS terminal 16. The menu prompt portion 20 is to read a plurality of additive directory screens 22a-22z stored in the storage 18 according to the inputted instruction from the PHS terminal, for being sequentially prompted on the PHS terminal 16.
Patent TW-521403-B (TW)
Title: Method for producing nitride ROM (NROM)
Inventor: LAI JIUN-REN
IPC: H01L21/311
Filed: 2001-12-10
Granted: 2003-02-21
Abstract: A method for producing a nitride ROM (NROM) comprises: sequentially forming a bottom anti-reflective layer and a patterned photoresist layer on a substrate formed with an electron trapping layer; using the patterned photoresist layer as a mask to perform an etching process to remove the bottom anti-reflective layer and the electron trapping layer and exposing the substrate, in which the etching process is carried out in an etching machine having a source power supply and a bias power supply, and the power supply ratio between the source power supply and the bias power supply is 1 to 2; and sequentially forming a buried drain in the substrate and a buried drain oxide layer and a plurality of gate structures on the substrate.
Patent TW-529212-B (TW)
Title: Laser diode package with thick metal substrate to be heat sink
Inventor: WANG BILY
Filed: 2002-01-11
Granted: 2003-04-21
Abstract: This invention discloses a package for a laser diode chip with thick metal substrate to be heat sink, with good heat absorption and dissipation ability, the package can run with acceptable temperature, the product shall not be damaged through high temperature that accumulates if heat can not dissipate efficiently.
Patent TW-538405-B (TW)
Title: Organic EL circuit
Inventor: KOMIYA NAOAKI
IPC: H05B44/00
Filed: 2002-01-30
Granted: 2003-06-21
Abstract: The present invention relates to an organic EL circuit to diminish irregular display, wherein 3 bits data, received from data lines DATA 1 to 3, is stored in reserving capacitance SC 1 to 3 by scanning TFT 1-1 to 1-3. Then the voltage of reserving capacitance SC 1 to 3 is used to move the entire connection of TFT 1-1 to 1-3. Finally, a brightness is controlled by controlling the move of connection switch of TFT 1-1 to 1-3 with digital data and the connection switch of organic elements EL 1 to 3.
Patent TW-I254083-B (TW)
Title: ITO sputtering target and production method therefor
Inventor: UCHIUMI KENTARO
IPC: C23C14/08
Filed: 2002-03-29
Granted: 2006-05-01
Abstract: To provide an ITO (indium-tin-oxide) sputtering target having a structure which suppresses the frequency of arcing caused by intermediate compound phases, and to provide a production method therefor. The target uses an ITO sintered compact consisting of a base phase consisting of cubic system In2O3, and having relative density of >= 99%, and an intermediate compound phase of IN2O3 and SnO2. The ratio between the elliptic major axis and the minor axis in the intermediate compound particles in the SEM (scanning electron microscope) observation of the optional cross-section in the sintered compact is >= 2.1, or >= 80% of the number of the intermediate compound particles have polygonal shape including recessed faces. The target is obtained by mixing the powder of In2O3 and the power of SnO2, compacting the powdery mixture, sintering the compact in a pure oxygen current heated at 1,550 to < 1,650 DEG C, and thereafter reducing its temperature from the sintering holding temperature to at least 1,300 DEG C at a temperature reduction rate of >= 200 DEG C/hr.
Patent TW-I258012-B (TW)
Title: Support pack for vibratory testing of printed circuit boards
Inventor: LIKEN PETER
IPC: G01R1/00
Filed: 2002-04-16
Granted: 2006-07-11
Abstract: A circuit board support rack (10) for vibratory testing of printed circuit boards comprises a frame (11) and a board engagement platform (29) fixed with respect to such frame (11). A board retention member (39) is spaced from the engagement platform (29). The rack (10) has a first adjustment mechanism (47), e.g., rows of vertically-spaced apertures (49, 51, 53, 55), any of which may receive a shoulder screw (61) to thread to the retention member (39). Such first adjustment mechanism (47) coacts with the frame (11) and the retention member (39), thereby permitting selection of the dimension by which the engagement platform (29) and the board retention member (39) are spaced apart. The rack (10) also has a second adjustment mechanism (63), e.g., a plurality of screws threaded to the retention member. Each such screw (65) has a notched locating pin (67) coupled to it. Such second adjustment mechanism (63) is mounted for locating-pin movement toward and away from the engagement platform (29). The first adjustment mechanism (47) permits configuring the rack (10) for the approximate vertical height of the boards to be tested and the second adjustment mechanism (63) permits secure edge clamping of each board as it is loaded into the rack (10) for vibratory testing.
Patent TW-591898-B (TW)
Title: Multistage modulation architecture and method in a radio frequency transmitter
Inventor: CHOMINSKI PAUL P
IPC: H04B1/40
Filed: 2002-04-29
Granted: 2004-06-11
Abstract: In a multiple stage transmitter, and analog signal is modulated and mixed to produce a radio frequency output. A separate mixing frequency signal is provided to each stage. A single frequency synthesizer is used rather than a plurality of frequency synthesizers. In a two-stage system, first and second dividers each receive the output of the frequency synthesizer and deliver a mixing signal to the first and second stages respectively. The modulus of each divider may be selected to minimize spurious signals.
Patent TW-594788-B (TW)
Title: Word line driver for a semiconductor memory device
Inventor: SIM JAE-YOON
IPC: G11C8/08
Filed: 2002-05-02
Granted: 2004-06-21
Abstract: A memory device utilizing a negatively biased word line scheme diverts word line discharge current from the negative voltage source during a precharge operation, thereby reducing voltage fluctuations and current consumption from the negative voltage source. A main word line, sub-word line, word line enable signal, or other type of word line is coupled to the negative voltage source during a precharge operation. The word line is also coupled to a second power supply during the precharge operation, and then uncoupled from the second power supply after most of the word line discharge current has been diverted. The negative voltage source can then discharge and maintain the word line at a negative bias.
Patent TW-541608-B (TW)
Title: Method of enhancing adhesion strength of BSG film to silicon nitride film
Inventor: WU HSIN-CHANG
IPC: H01L21/30
Filed: 2002-05-16
Granted: 2003-07-11
Abstract: A method of enhancing adhesion strength of a boro-si1icafe glass (BSG) film to a silicon nitride film is provided. A semiconductor substrate with a, silicon nitride film formed thereon is provided. The silicon nitride film is then exposed to oxygen-containing plasma such as ozone plasma. A thick BSG film is then deposited onto the treated surface of the silicon nitride film. By pre-treating the silicon nitride film with ozone plasma for about 60 seconds, an increase of near 50% of Kapp of the BSG film is obtained.
Patent TW-593386-B (TW)
Title: Process for the preparation of low molecular weight hydrogenated nitrile rubber
Inventor: GUERIN FREDERIC
IPC: C08F236/12
Filed: 2002-06-10
Granted: 2004-06-21
Abstract: A hydrogenated nitrile rubber having lower molecular weights and narrower molecular weight distributions than those known in the art can be prepared by the olefin metathesis of nitrile butadiene rubber, followed by hydrogenation of the resulting metathesized NBR.
Patent TW-531580-B (TW)
Title: Method for manufacturing a floor mat having mixed color effect
Inventor: YAU TSUNG-MING
IPC: D01D7/00
Filed: 2002-06-10
Granted: 2003-05-11
Abstract: This invention provides a method for manufacturing a floor mat with mixed color effect, including the a first injection tube extruding machine connected to at least one second injection tube extruding machine, and then to an injection port with a buffering chamber; a plurality of nozzle holes formed beneath the buffering chamber, wherein the injection machines are capable of injecting molten plastic of different colors that are fed to the injection port from the injection machines so as to result in a mixed color effect by the free flows at the buffering chamber at the injection port. The single-ply with the mixed color effect is then stacked into annular threads that are then tangled into a floor mat.
Patent TW-I276815-B (TW)
Title: Apparatus for handling electronic components and method for controlling temperature of electronic components
Inventor: YAMASHITA TSUYOSHI
IPC: G01R31/28
Filed: 2002-07-09
Granted: 2007-03-21
Abstract: A handler 1 is provided with an inner chamber 104 containing inside thereof heat sinks 40 of pushers 30, a temperature adjusting unit 91 for controlling the atmosphere temperature inside the inner chamber 104, a test chamber 102 containing inside thereof sockets 40 located on the test head 5 and the inner chamber 104, and a temperature adjusting unit 90 for controlling the atmosphere temperature inside the test chamber 102. With such a handler 1, the temperature control can be conducted so that the temperature of electronic components is brought close to the set temperature of the target test.
Patent TW-538529-B (TW)
Title: Thin film transistor structure and the manufacturing method thereof
Inventor: CHANG KOW-MING
IPC: H01L27/01
Filed: 2002-07-15
Granted: 2003-06-21
Abstract: The present invention is a thin film transistor structure and the manufacturing method thereof, which includes the following steps: providing an insulative substrate; forming a source/drain layer, a main gate insulative layer, and a first conductor layer on the insulative substrate; conducting etching on the first conductor layer to define a main gate conductor structure; sequentially forming a sub-gate insulative layer and a second conductor layer on the main gate conductor structure; and, conducting etching on the second conductor layer and the sub-gate insulative layer to define a first sub-gate conductor structure, a second sub-gate conductor structure, a first sub-gate insulative layer, and a second sub-gate insulative layer.
Patent TW-542819-B (TW)
Title: Half-square welding processing system with multiple feeding lines
Inventor: WANG JOHNNY
IPC: B23K3/00
Filed: 2002-07-26
Granted: 2003-07-21
Abstract: A half-square welding processing system with multiple feeding lines includes a robotic half-square welding apparatus and a plurality of feeding lines. Each of the feeding lines further includes, in path order, a feeding end for work piece feeding, a welding area, and an outlet end. In the system, the welding apparatus and any two adjacent welding areas form a bilateral triangle having the welding apparatus located at the tip of the triangle. By providing the welding apparatus to reciprocally work among the welding areas, yield of the welding process can be increased so that a trade-off point between cost and effectiveness of the welding process can be achieved.
Patent TW-593611-B (TW)
Title: Adhesive composition for semiconductor device and adhesive sheet for semiconductor device using the same
Inventor: SUZUKI NAOJI
IPC: C09J161/06
Filed: 2002-07-30
Granted: 2004-06-21
Abstract: This invention provides an adhesive composition for semiconductor device containing: (A) 10 to 30 mass % of a reactive elastomer, (B) 40 to 65 mass % of an epoxy resin having more than two glycidylether groups, (C) a phenol resin, (D) a hardening promoter, wherein the epoxy resin (B) and phenol resin are contained at a ratio of functional group equivalent of 1:0.6 to 1:1, and an adhesive sheet for semiconductor device. The composition and the adhesive sheet have excellent characteristics with respect to the endurance to heat of reflow process and a short curing time, low temperature adhesion without significantly lowering the heat resistance, low moisture absorption, high adhesive strength and electrical insulation.
Patent TW-I227823-B (TW)
Title: Flexible heat sink fin set and heat sink
Inventor: SHIU HUEI-CHIUN
IPC: G06F1/20
Filed: 2002-08-06
Granted: 2005-02-11
Abstract: The invention relates to a flexible heat sink fin set and a heat sink. The heat sink fin set includes a plurality of continuously latched and arranged fins, in which each fin is installed with at least a latch structure to be mutually latched and form a heat sink fin set, in which at least a part of the latch structure is flexible and bendable, and each fin forms into a sheet edge corresponding to one end of the latch structure thereof, so that the heat sink fin set can be deformed towards the center of curvature of the sheet edge and form into a curved heat sink fin set. The heat sink includes a curved heat conductive base and the above-mentioned heat sink fin set, which can be arranged in a curve shape. The heat sink fin set is bent in compliance with the curve shape of the heat conductive base so that the heat sink fin set is mounted on the curve face.
Patent TW-585809-B (TW)
Title: Tool box with a positioning device
Inventor: HU HOU-FEI
IPC: B25H3/02
Filed: 2002-08-09
Granted: 2004-05-01
Abstract: This invention relates to a tool box with a positioning device, including: the tool box is constructed of a first casing and a second casing, the first casing being formed with at least one retaining slot laterally across its predetermined location, both ends of the retaining slot passing through the first casing in an open state, the second casing being formed with a stopping block corresponding to the retaining at a predetermined location, the stopping block projecting out of the outer edge of the second casing, such that when the tool boxes are stacked on tops of each other, the retaining slots and stopping blocks would cooperate to allow horizontal sliding movement between tool boxes, while retaining a fixed state along the radial direction of the tool boxes, without affecting the overall length of the boxes while stacking the tool boxes. That is, tool boxes with different lengths may still be stacked on top of each other while ensuring a steady and reliable positioning between the tools boxes. This invention provides flexible adaptability to allow precise positioning between tool boxes of different lengths.
Patent TW-I285478-B (TW)
Title: Personal communication device with RF transmitted power strength indicator and warning system
Inventor: SHIH DID-MIN
IPC: H04B7/005
Filed: 2002-09-17
Granted: 2007-08-11
Abstract: This invention provides a radio frequency (RF) communication device, comprising a transmitter for transmitting a RF signal to a corresponding receiver comprising an indication device and a controller, in which the indication device can display RF transmitted power strength of the transmitter and the controller can detect and output the transmitted power strength displayed by the indication device. The controller comprises a power detection device coupling to the transmitter for detecting the transmitted power strength transmitted from the transmitter to the corresponding receiver.