baber/WOPTO huggingface dataset:
Patent JP-2021156116-A (JP)
Title: Beam joint structure
Inventor: ARITA MASAKI
IPC: E04B1/24
Filed: 2020-03-30
Abstract: To improve rigidity during construction of a beam joint structure in which an upper flange of a beam having an H-shaped cross section is not directly joined to a bearing member.SOLUTION: A beam joint structure comprises: a first beam having an H-shaped cross section, which has a first upper flange, a first lower flange, and a first web; and a bearing member, which faces a longer direction end surface of the first beam having the H-shaped cross section. A bearing member includes a first section that is joined to the first web, and a second section at which a compression force applied to the first lower flange is transmitted by a first compression force transmitting means, and does not include the section that is directly connected to the first upper flange. A rotational resistance due to connection between the first section and the first web is higher on upper side of a height center line of the first web than on lower side of the height center line of the first web, with respect to an in-plane rotation of the first web around a height center of the first web at the longer direction end surface of the first beam having the H-shaped cross section.SELECTED DRAWING: Figure 1
Patent JP-2021155680-A (JP)
Title: Film adhesive
Inventor: TANAKA YUYA
IPC: C09J201/00
Filed: 2020-03-30
Abstract: To provide a film adhesive which, when used as a heat curable die bonding film to divide a semiconductor wafer, can sufficiently suppress occurrence of defective cutting, die crack, and burr.SOLUTION: Provided is a curable film adhesive. When the film adhesive, a double-sided tape, and a rigid support are laminated in this order on a testing substrate formed of polyolefin, a 180° peel strength between the film adhesive and the testing substrate is 0.01 to 0.2 N/25 mm as measured at a peel rate of 300 mm/min and a temperature of 23°C. In a specimen prepared by laminating a plurality of the film adhesive and cutting the laminate in a size of a thickness of 200 μm, a width of 15 mm, and a length of 70 mm, a breaking strength obtained from the result of measuring a stress-strain curve under conditions of 25°C, a distance between chucks of 30 mm, and a tensile speed of 200 mm/min is 30 MPa or less and an elongation at break is 11% or more.SELECTED DRAWING: None
Patent JP-2021163771-A (JP)
Title: Method for producing slurry, method for producing ceramic layer, and method for producing ultrasonic thickness sensor
Inventor: NAKANO TAKASHI
IPC: C04B35/491
Filed: 2020-03-30
Abstract: To provide a method for producing a slurry, a method for producing a ceramic layer and a method for producing an ultrasonic thickness sensor, which are excellent in work efficiency and capable of producing an ultrasonic thickness sensor having the same performance as before without the use of stabilizers.SOLUTION: A method for producing a slurry of the present disclosure includes: a first mixing step of mixing a dispersant and at least one of a mixture of zirconium oxide fine particles with an average particle size of 1-100 nm and lead acetate and a mixture of titanium oxide fine particles with an average particle size of 1-100 nm and a bismuth compound, thereby obtaining a liquid mixture; and a second mixing step of mixing the liquid mixture obtained in the first mixing step and titanate compound powder, thereby obtaining a slurry.SELECTED DRAWING: Figure 3
Patent JP-2021163802-A (JP)
Title: Chip transfer method and chip transfer device
Inventor: HASHIMOTO YASUNORI
IPC: H01L21/67
Filed: 2020-03-31
Abstract: To provide a chip transfer method and a chip transfer device for transferring a chip from a dicing tape to a substrate which is capable of realizing laser lift off so as to make it possible to use a laser lift off method even for a semiconductor chip comprising silicon.SOLUTION: There are provided a chip transfer method and a chip transfer device. The chip transfer method transfers a large number of semiconductor chips formed by dicing a wafer held on a dicing tape to a transfer destination substrate having an adhesive layer, and includes an ultraviolet ray radiation step of radiating ultraviolet ray to an ultraviolet ray curing type adhesive for fixing the semiconductor chips to the dicing tape through the dicing tape for decreasing the adhesive force of the adhesive, a bonding step of arranging the transfer destination substrate and the dicing tape so that the adhesive face of the transfer destination substrate and the semiconductor chips face and closely contact with each other, and a removing step of removing the dicing tape from the semiconductor chips in a state where the semiconductor chips are closely contact to the transfer destination substrate.SELECTED DRAWING: Figure 3
Patent JP-2021163085-A (JP)
Title: Optimal calculation method of energy operation condition in iron mill, optimal calculation device of energy operation condition in iron mill, and operation method of iron mill
Inventor: OGASAWARA TOMOYOSHI
IPC: C21B7/00
Filed: 2020-03-31
Abstract: To provide an optimal calculation method and an optimal calculation device of energy operation conditions in an iron mill that can shorten time required for optimum calculation of the energy operation conditions in the iron mill.SOLUTION: An optimal calculation method of energy operation conditions in an iron mill according to the present invention, in which an actual value and a predicted value of the amount of energy service generation and consumption for each factory that composes the iron mill are used, a total energy operation cost of the iron mill within predetermined time from current time is used as an evaluation function, and operation conditions of energy equipment in the iron mill that a value of the evaluation function becomes small are calculated as a decision variable at each predetermined time within a predetermined time, comprises a step of calculating the decision valuable by imposing an equation constraint so that the decision valuable of a power generation installation included in the energy equipment is constant within predetermined collection time.SELECTED DRAWING: Figure 3
Patent JP-2021162072-A (JP)
Title: Metal coating insulation device
Inventor: TAKAHASHI KAZUHIRO
IPC: F16L59/147
Filed: 2020-03-31
Abstract: To improve radiation heat reduction and space securing functions inside of a partially cylindrical metal casing.SOLUTION: With respect to an insulation target 6 including a columnar outer peripheral surface, a box-shaped partially cylindrical metal casing 2 including a curved surface along with the columnar outer peripheral surface is provided. A plurality of box-shaped partially columnar metal casings can be disposed along with the columnar outer peripheral surface. An insulation material is accommodated within the partially cylindrical metal casing 2, and a plurality of metal plates 3 along with the curved surface inside of the partially cylindrical metal casing 2 are laminated and disposed in a heat transmission direction. Between the plurality of metal plates 3 and at least at two positions in a length direction of the partially cylindrical metal casing 2, a metallic wire 4 is disposed in a curving direction of the curved surface, a space S is formed between the metal plates 3 adjacent in the heat transmission direction and between the wires 4 adjacent in the length direction of the partially cylindrical metal casing 2, and a surface of the metal plate 3 is formed into a heat ray reflection surface.SELECTED DRAWING: Figure 1
Patent JP-2021163160-A (JP)
Title: Information providing device, information providing system, information providing method, and program
Inventor: TERAUCHI AKIRA
IPC: G06Q50/10
Filed: 2020-03-31
Abstract: To inform users of services provided for mobile bodies of an implementation status of the services at appropriate timing.SOLUTION: An information providing device 1 includes: a communication unit that communicates with a server 400; an implementation information acquisition unit that acquires implementation information indicating implementation status of a service whose service provision place is the stop position of a mobile body V by the communication unit; a moving state detection unit that detects moving state of the mobile body V; and a notification unit that notifies a user of the implementation status of the service based on the implementation information when a specific state based on which the mobile body V is estimated to start moving is detected by the moving state detection unit.SELECTED DRAWING: Figure 1
Patent JP-2021162223-A (JP)
Title: container
Inventor: NISHIMURA SATORU
IPC: F25D23/02
Filed: 2020-03-31
Abstract: To provide a container which is mounted with cooling means to cool a cargo chamber and enables: a refrigeration device to be continuously operated regardless of an operation environment; and operation performance of the refrigeration device to be improved.SOLUTION: A container comprises: a refrigerator storage section which is positioned above a storage chamber 14 storing an electric refrigerator for a cargo chamber 12 and a power source therefor; and a power source storage section which is positioned below the refrigerator storage section. The power source storage section has an external panel 24 and an opening-and-closing door 26 so as to cover the power source to protect the same from an outside. An operation section of a controller 28 of the electric refrigerator is installed in a manner that can be exposed to the outside so as to secure operational performance of the container from the outside of the container 10. Also, the controller 28 is installed at a lower edge of the storage chamber 14 or at a position lower than a midpoint in a height direction of the container so as to enable the controller 28 to be within arm's reach of an operator even when the container 10 is placed on a place higher than a ground surface, thereby securing favorable operation performance of the container.SELECTED DRAWING: Figure 1
Patent JP-2021160764-A (JP)
Title: Liquid-spout tool
Inventor: KISHIDA KOJI
IPC: B65D25/48
Filed: 2020-03-31
Abstract: To provide a liquid-spout tool allowing for pouring a predetermined quantity from a container merely by enabling attachment to the container and performing a simple work.SOLUTION: A liquid-spout tool 10 comprises: an inlet portion 1 for allowing liquid to enter; a reservation portion 2 that stores liquid; a connection portion 3 that connects between the inlet portion 1 and the reservation portion 2; and a spout portion 4 that is provided continuously with the reservation portion 2 and for pouring liquid. A spouting direction DB of the spout portion 4 inclines to a direction away from the connection portion 3 with respect to an orthogonal direction DE to an extension direction DA of the connection portion 3.SELECTED DRAWING: Figure 1
Patent JP-2020170512-A (JP)
Title: Information processing device
Inventor: IMAFUKU YOSUKE
IPC: G06Q30/06
Filed: 2020-03-31
Abstract: To properly manage a vehicle as an asset that is the object to be leased.SOLUTION: In a server 1 for managing a vehicle T which is the object of lease and a borrower R who procures the vehicle T by lease, a start time information acquisition unit 101 acquires information as start time information that indicates the state of the vehicle T at the start time of lease. A borrower information acquisition unit 102 acquires information relating to the borrower R as borrower information that at least includes the qualitative information of the borrower R at the start time of lease. An in-period information acquisition unit 103 acquires information as in-period information that indicates the state of the vehicle T during the period of lease. A termination time information acquisition unit 104 acquires information as termination time information that indicates the state of the vehicle T at termination time of lease. A management unit 105 manages, for the vehicle T, the start time information, in-period information and termination time information in association each other. Thus, the above problem is solved.SELECTED DRAWING: Figure 4
Patent JP-2021164092-A (JP)
Title: Communication system, communication terminal, communication method and program
Inventor: IKEDA KENICHI
IPC: H03M13/27
Filed: 2020-04-01
Abstract: To provide a communication system, a communication terminal, a communication method and a program, which can reduce a processing time.SOLUTION: A transmission side terminal performs convolution coding of transmission target data based on a preset coding rate, to interleave, for each bit included in the coded data, in a manner that bits having a high coding rate and a high ratio of being thinned out are transmitted earlier, whereas bits which are not transmitted among bits having a low coding rate and a low ratio of being thinned out are transmitted successively, so that data for one period are transmitted by the successive transmission of each bit as voice. A reception side terminal successively receives each bit to insert dummy data into bits among the data for one period to generate data after reception. Then, for each bit of the data after reception, the reception side terminal performs interleaving reverse to the transmission side to decode the data.SELECTED DRAWING: Figure 1
Patent JP-2021167511-A (JP)
Title: Structure analysis system
Inventor: SAITO TAKAHITO
IPC: G06T7/00
Filed: 2020-04-09
Abstract: To provide a structure analysis system capable of appropriately determining the state of a structure such as a bridge.SOLUTION: A structure analysis system 10 comprises: a moving image acquisition unit 11 that acquires a moving image obtained by imaging a structure; a speed vector detection unit 12 that detects a speed vector indicating a speed and direction of a displacement at a plurality of points of the structure based on the moving image acquired by the moving image acquisition unit 11; and a probability density calculation unit 13 that calculates a probability density for the existence of an instantaneous rotation center according to a position in the structure from the speed vectors of the plurality of points detected by the speed vector detection unit 12.SELECTED DRAWING: Figure 1
Patent JP-2021167387-A (JP)
Title: Method for producing luminous material
Inventor: TSUTSUI OSAMU
IPC: C09K11/08
Filed: 2020-04-10
Abstract: To provide a method for producing a luminous material having a large luminance value usable as outdoor use.SOLUTION: A light-emitting material having high light-emitting efficiency is manufactured by using Eu metal as an activator and Sr0.9Al2O4 as a base material, mixing the materials and filling a small-sized crucible, accommodating the small-sized crucible in a middle-sized crucible, filling a gap between the small-sized crucible and the middle-sized crucible with activated carbon, and heating the crucibles at 1,500°C for 10 hours in a tunnel type atmospheric heating furnace (first heating treatment). A luminous material having a crystal diameter of about 40 microns and a Dy dissolution amount of 0.5% is manufactured by crushing the light-emitting material having high light-emitting efficiency by a ball mill, then adding Dy2O3, B2O3 and a base material to the light-emitting material, agitating and mixing the luminous raw material and filling the small-sized crucible, storing the small-sized crucible in the middle-sized crucible, filling a gap between the small-sized crucible and the middle-sized crucible with activated coal, then closing the lid, and heating the crucibles at 1,500°C for 10 hours in a batch type tunnel heating furnace (second heating treatment).SELECTED DRAWING: Figure 4
Patent JP-2021155838-A (JP)
Title: MANUFACTURING METHOD OF HIGH STRENGTH Zn SINTERED BODY AND HIGH STRENGTH Zn SINTERED BODY
Inventor: SATO HIROYUKI
IPC: B22F3/14
Filed: 2020-03-25
Abstract: To provide a manufacturing method of high strength Zn sintered body excellent in mechanical characteristics than a conventional casting material and high strength Zn sintered body.SOLUTION: A manufacturing method of high strength Zn sintered body comprises: a first step of manufacturing ultrafine Zn powder of an average particle diameter of 100 to 1000 nm by an arc plasma forced evaporation method that discharges arc to Zn in a hydrogen gas containing atmosphere; and a second step of heating the ultrafine Zn powder to a temperature of 100 to 350°C by a discharge plasma while pressurizing the ultra-fine Zn powder to produce a sintered body having the Vickers hardness of 50 or larger at room temperature, and a high strength Zn sintered body having the Vickers hardness of 50 or larger manufactured by the method.SELECTED DRAWING: Figure 8
Patent JP-2020110044-A (JP)
Title: Electric motor drive device, refrigeration cycle device and air conditioner
Inventor: ARISAWA KOICHI
IPC: H02P25/18
Filed: 2020-04-16
Abstract: To provide an electric motor device unit capable of improving system efficiency in low speed and low current regions.SOLUTION: An electric motor drive unit 100 is used to drive an electric motor 2 having a plurality of winding groups comprising a three-phase winding. The electric motor drive unit 100 is provided with a switching section 3 for switching the connections of the windings of a first winding group 2a and a second winding group 2b, inverters 1a and 1b for driving the electric motor 2, and a control unit 4 for controlling the inverters 1a and 1b and the switching section 3. The switching section 3 uses a single-circuit one-contact switch and a single-circuit two-contact switch. The inverters 1a and 1b supply power to the windings of each phase of a plurality of winding groups via either the single-circuit one-contact switch or the single-circuit two-contact switch.SELECTED DRAWING: Figure 5
Patent JP-2021171771-A (JP)
Title: Punching device
Inventor: TAKAHASHI MASAYUKI
IPC: B21D28/02
Filed: 2020-04-20
Abstract: To provide a punching device having high foreign matter detection accuracy as compared with a prior art.SOLUTION: A punching device is a punching device for punching work to punch a workpiece in a prescribed shape by using a die formed of a metal mold having hole of a prescribed shape and a punch formed of a metal mold of a prescribed shape. The punching device further includes: load sensors respectively arranged at positions where force acting on the die is transmitted on the punching device and measure a load in punching direction at each one of at least three prescribed points on the die different from each other; and a control device which calculates, for a first and second axes on a plane vertical to the punching direction, a first moment as a sum total of moments around the first axis of the measured load and a second moment as a sum total of moments around the second axis of the measured load, and determines that a foreign matter has occurred when a magnitude of at least one of the first and second moments falls outside of a prescribed range of values.SELECTED DRAWING: Figure 1
Patent JP-2020115587-A (JP)
Title: Capacitor
Inventor: HARADA MAOMI
IPC: H01G4/30
Filed: 2020-04-23
Abstract: To provide a capacitor that prevents generation of a substrate capacitance composed of an upper electrode, a substrate, and a lower electrode.SOLUTION: A capacitor according to one aspect of the present invention includes: a substrate; a lower electrode formed on the substrate; a dielectric film formed on the lower electrode; an upper electrode formed on a part of the dielectric film; and a first terminal electrode that is connected to the upper electrode. The upper electrode and the first terminal electrode are formed in a region for forming the lower electrode in a plan view of the capacitor viewed from a first terminal electrode side.SELECTED DRAWING: Figure 1
Patent JP-2020183122-A (JP)
Title: Supply or removing method of slide treatment object to surface of slide object
Inventor: SAITO TAKAYUKI
IPC: B41M1/10
Filed: 2020-04-30
Abstract: To evenly supply a slide treatment object in a slide device that supplies or removes a slide treatment object on a surface of a slide object.SOLUTION: When performing supply or removal of a slide treatment object F relative to a surface of a slide target object W with a slide part 4 provided with a plurality of slide bodies 6 having a flat action surface 6A, while the slide body 6 is regularly moved in parallel with the action surface 6A, preferably by a first driving mechanism, the slide part 4 is regularly moved in parallel with the action surface 6A of the slide body 6 and in a direction different from the moving direction of the slide body 6, preferably by a second driving mechanism.SELECTED DRAWING: Figure 1
Patent JP-2021179506-A (JP)
Title: Optical instrument and imaging apparatus
Inventor: MATSUMOTO KOHEI
IPC: H04N5/225
Filed: 2020-05-12
Abstract: To stably regulate the movement of a flexible printed board with a simple configuration without increasing the size of an optical instrument and prevent a reduction in quality of signals.SOLUTION: A flexible printed board (FPC) 701 arranged in an interchangeable lens 101 has a motor wiring part 711 that is wired with motor signal wiring 712 and an element wiring part 721 that is wired with detection signal wiring 722. The element wiring part 721 is locked with a first tongue part 716 and a second tongue part 717 provided on a side of the motor wiring part 711 to arrange the motor wiring part 711 and the element wiring part 721 not to overlap each other when seen from a direction orthogonal to a surface of the motor wiring part 711.SELECTED DRAWING: Figure 9
Patent JP-2021180430-A (JP)
Title: Power management system
Inventor: TAKAMATSU EIJI
IPC: F25D23/00
Filed: 2020-05-14
Abstract: To provide a power management system that can properly save power according to situations of a plurality of automatic vending machines to be managed.SOLUTION: A power management system 100 includes: an automatic vending machine 1 equipped with a cooling/heating device 31 that cools and/or heats products stored in a storage; and a power management server 2 that is communicatively connected to the automatic vending machine 1 and manages power of the automatic vending machine 1. The automatic vending machine 1 includes: a storage unit 14 that stores power saving possibility data D2 as to whether power saving is possible or not; and a power control unit 13 that performs power saving control of the cooling/heating device 31 in response to a power saving instruction when the power saving possibility data D2 is set to power saving possible. The power management server 2 presets the power saving possibility data D2 stored in the storage units 14 of a plurality of automatic vending machines 1, selects an automatic vending machine 1 necessary for power saving among the automatic vending machines 1 that are set to power saving possible for the plurality of automatic vending machines 1, and transmits the power saving instruction to the selected automatic vending machine 1.SELECTED DRAWING: Figure 2