Patent SG-11201901582Q-A (SG)
Title: Chemical mechanical polishing tool with robot access to cassettes
Inventor: HU YONGQI
IPC: H01L21/677
Filed: 2017-08-25
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 01 March 2018 (01.03.2018) W I PO I PCT omit °nolo oui onno oimIE (10) International Publication Number WO 2018/039525 Al (51) International Patent Classification: H01L 21/304 (2006.01) HOlL 21/67 (2006.01) H01L 21/677 (2006.01) (21) International Application Number: PCT/US2017/048553 (22) International Filing Date: 25 August 2017 (25.08.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/380,273 26 August 2016 (26.08.2016) US 62/464,204 27 February 2017 (27.02.2017) US (71) Applicant: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue, Santa Clara, California 95054 (US). (72) Inventors: HU, Yongqi; 49204 Park Terrace, Fremont, California 94539 (US). TERRY, Thomas Lawrence; 585 Tiffany Drive, Hollister, California 95023 (US). (74) Agent: GOREN, David J.; Fish & Richardson P.C., P.O. Box 1022, Minneapolis, Minnesota 55440-1022 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (54) Title: CHEMICAL MECHANICAL POLISHING TOOL WITH ROBOT ACCESS TO CASSETTES — 110 20 — 112 102 -- 103 114 — 120 80 108 ' 1 — 136 A - 4 - 132 130 _ 134 146 82 50c — 70 22 82 140 42 Figure 3 30 (57) : A semiconductor fabrication system includes a chemical mechanical polishing system, a cassette holding area enclosed by a wall and having a door openable by an operator to place one or more cassettes into the cassette holding area, a robot configured to transfer substrates between a cassette in the cassette holding area to the chemical mechanical polishing system, a computer controller configured to cause the robot to move to a home position, a circuit breaker in a power supply line to the robot, a door sensor to detect whether the door is open, a robot presence sensor to detect whether the robot is in the home position, and control circuitry configured to receive signals from the door sensor and the robot presence sensor and cause the circuit breaker to cut power to the robot if the door is open and the robot is not in the home position. [Continued on next page] 142 144 118 100 WO 2018/039525 Al MIDEDIMOMOIDEIREIDIONIMOIHRIOHODEVOIS (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: as to applicant's entitlement to apply for and be granted a patent (Rule 4.1700) as to the applicant's entitlement to claim the priority of the earlier application (Rule 4.17(iii)) Published: with international search report (Art. 21(3)) before the expiration of the time limit for amending the claims and to be republished in the event of receipt of amendments (Rule 48.2(h))