baber/WOPTO huggingface dataset:
Patent TW-201608260-A (TW)
Title: Polyester resin composition for reflective materials and reflection plate containing same
Inventor: OHSHIMIZU KAORU
IPC: B32B37/26
Filed: 2015-06-30
Abstract: A polyester resin composition for reflective materials according to the present invention contains: 30-80% by mass of (A) a polyester resin which has a melting point (Tm) or glass transition temperature (Tg) of 250 DEG C or more as measured by a differential scanning calorimeter (DSC); 5-30% by mass of (B) a fibrous reinforcing material which has an average fiber length (l) of 2-300 [mu]m, an average fiber diameter (d) of 0.05-18 [mu]m and an aspect ratio (l/d) of 2-20, said aspect ratio being obtained by dividing the average fiber length (l) by the average fiber diameter (d); and 5-50% by mass of (C) a white pigment (with the total of (A), (B) and (C) being 100% by mass).
Patent TW-201703973-A (TW)
Title: Gate bush which can easily exhaust air to prevent injection finished product from air trap (foam) and plastic material from being burnt due to air
Inventor: Xu zhi-wei
IPC: B29C45/17
Filed: 2015-07-24
Abstract: The invention provides a gate bush, comprising a detachable head having a first pouring passage; and a body portion having a second pouring passage. The detachable head can be detachably connected to the body portion. The first pouring passage is communicated with the second pouring passage, wherein connection place between the detachable head and the body portion has an exhaust passage communicating the first pouring passage and the second pouring passage to outside of the detachable head and the body. One width of one end of the exhaust passage connected to the first pouring passage and the second pouring passage is smaller than 2 micrometer to 8 micrometer. Accordingly, the gate bush of the invention can easily exhaust air to prevent injection finished product from air trap (foam) and plastic material from being burnt due to air.
Patent TW-201614776-A (TW)
Title: Method of making embedded memory device with silicon-on-insulator substrate
Inventor: SU CHIEN-SHENG
IPC: H01L21/8239
Filed: 2015-08-11
Abstract: A method of forming a semiconductor device starts with a substrate of silicon, a first insulation layer on the silicon, and a silicon layer on the first insulation layer. The silicon layer and the insulation layer are removed just from a second substrate area. A second insulation layer is formed over the silicon layer in the substrate first area and over the silicon in the second substrate area. A first plurality of trenches is formed in the first substrate area that each extends through all the layers and into the silicon. A second plurality of trenches is formed in the second substrate area that each extends through the second insulation layer and into the silicon. An insulation material is formed in the first and second trenches. Logic devices are formed in the first substrate area, and memory cells are formed in the second substrate area.
Patent TW-201706014-A (TW)
Title: Elastic rope providing a good ductility under the condition of reducing the weight and lowering the cost
Inventor: CHEN WEN-SUAN
IPC: A63B21/02
Filed: 2015-08-12
Abstract: Disclosed is an elastic rope, mainly comprising a rope body, wherein the rope body is provided with a foldable telescopic section and a non-telescopic section; the foldable telescopic section is internally provided with an elastic belt and the foldable telescopic section is connected with the non-telescopic section by means of a transition section; and the width of the non-telescopic section may be greater than or less than the width of the foldable telescopic section. When the width of the non-telescopic section is less than the width of the foldable telescopic section, the width of the transition section is gradually reduced in a direction from the foldable telescopic section to the non-telescopic section; and when the width of the non-telescopic section is greater than the width of the foldable telescopic section, the width of the transition section is gradually reduced in a direction from the non-telescopic section to the foldable telescopic section. Accordingly, the elastic rope of this invention can achieve an effect of providing a good ductility under the condition of reducing the weight and lowering the cost.
Patent TW-201616199-A (TW)
Title: Method for fabricating optically anisotropic film
Inventor: YU BYUNG-MUK
IPC: G02B5/30
Filed: 2015-08-25
Abstract: The invention relates to a method for fabricating optical anisotropic film that allows an orientation film layer and a liquid crystal composition layer on the carrier substrate to form required optical axis range so as to form the optical anisotropic film. The method comprises the steps of: in a stage of forming the orientation film layer on the carrier substrate; in a stage of coating a composition containing liquid crystal compound on the foregoing orientation film layer to form the optical anisotropic film whose optical axis is under control; and in a stage of controlling surface roughness.
Patent TW-201701081-A (TW)
Title: Manufacturing method of laminate body having patterned plating layer, manufacturing method of laminate body having metal layer, touch panel sensor, touch panel, laminate body having patterned plating layer and laminate body having metal layer
Inventor: TSUKAMOTO NAOKI
IPC: H05K3/18
Filed: 2015-08-28
Abstract: The invention provides manufacturing method of laminate body having patterned plating layers that are disposed on two sides of substrate, manufacturing method of laminate body having metal layer, touch panel sensor, touch panel, laminate body having patterned plating layer and laminate body having metal layer in an easier way. The procedure of manufacturing method of laminate body having patterned plating layer comprises: manufacturing laminate body having substrate and layers formed by the coating layer, the substrate is provided with two main surfaces and the layers formed by the coating layer containing polymerization initiator are placed on the two main surfaces of the substrate; having the layers formed by the coating layer of the laminate body exposure to patterned light in accordance with the requirement and eliminating the area of the layers formed by the coating layer that is not illuminated by the light and respectively forming patterned plating layers on two main surfaces of the substrate.
Patent TW-201640271-A (TW)
Title: Computer system and computer-implemented method for managing power consumption of storage subsystem
Inventor: LI YUNG-FU
IPC: G06F1/32
Filed: 2015-09-10
Abstract: Various embodiments of the present technology provide methods for monitoring storage needs of one or more server systems, determining a specific server system that does not need storage capacity from corresponding storage subsystems, determining one or more storage subsystems corresponding to the specific server system, and causing at least one component of the one or more storage subsystems to be switched into a power saving mode.
Patent TW-201712258-A (TW)
Title: Pressure-adjustable fire hydrant applicable to fire fighting systems with various ultimate pressure values
Inventor: LIN YI-XING
IPC: F16K5/10
Filed: 2015-09-18
Abstract: A pressure-adjustable fire hydrant includes a flow regulator provided at a liquid outlet of a main body of the first hydrant. The flow regulator has a connecting pipe which is provided with a fixed gate sheet and a movable gate sheet. The fixed gate sheet and the movable gate sheet are provided with gate holes respectively. As such, the movable gate sheet can be rotated to align or misalign the gate hole of the movable gate sheet with the gate hole of the fixed gate sheet, such that a flow and a pressure of a fire fighting liquid that passes through the gate holes can be further regulated so as to allow the fire hydrant to be applicable to fire fighting systems with various ultimate pressure values.
Patent TW-201714504-A (TW)
Title: Chip package substrate and manufacturing method of same
Inventor: HUANG YU-CHENG
IPC: H05K1/16
Filed: 2015-09-23
Abstract: The present invention relates to a manufacturing method of a chip package substrate. The method includes steps as follows: a double-sided copper clad laminate is first provided and the copper clad laminate includes a substrate, a first copper layer and a second copper layer located opposite two sides of the substrate, respectively. The first copper layer is formed into a first conductive wiring layer, and the first conductive wiring layer includes a first opening. A third copper layer is formed at one side of the first conductive wiring layer away from the substrate. The second copper layer is formed into a second conductive wiring layer, and the second conductive wiring layer includes a second opening, the second opening is not overlap with the first opening. A fourth copper layer is formed at one side of the second conductive wiring layer away from the substrate. The third and the fourth copper layer are formed into a third and a fourth conductive wiring layer, respectively. Two solder mask layers are formed on the third conductive wiring layer, and the fourth conductive wiring layer, respectively. Parts of the third conductive wiring layer and the fourth conductive wiring layer which not covered by the solder mask are pads, and a thickness of the first and third conductive wiring layer is equal to a thickness of the second and the four conductive wiring layer.
Patent TW-201627223-A (TW)
Title: Abrasive grains for polishing hard metal material, polishing composition and method for manufacturing hard metal product
Inventor: MIWA NAOYA
IPC: C09K3/14
Filed: 2015-09-25
Abstract: Provided are abrasive grains that are to be supplied to a polishing table for polishing a hard metal material at a higher efficiency. The abrasive grains have an average grain size of 2-10 [mu]m and show a holding rate to the polishing table of 5-60%. Also provided are a polishing composition comprising the abrasive grains and a method for manufacturing a hard metal material using the composition.
Patent TW-201641954-A (TW)
Title: Positioning system for indoor and surrounding area, method thereof and mobile apparatus
Inventor: LEE OWEN HOWNWUN
IPC: G01S5/02
Filed: 2015-09-25
Abstract: A positioning system includes a wireless device network disposed in a predetermined area. The wireless device network includes a first directional RF signal device disposed at a first known location for transmitting a plurality of first RF signal, which has a first identification data and forms a first signal covering area over the predetermined area, and a second directional RF signal wireless device disposed at a second known location for transmitting a plurality of second RF signal, which has a second identification data and forms a second signal covering area over the predetermined area, and a mobile apparatus storing location data of the said wireless devices and a wireless device network identification data. The mobile apparatus receives at least one of the first RF signal or the second RF signal and determines and obtains a positioning location according to the signal strength of the first identification data and its disposed location, or the signal strength of the second identification data and its disposed location.
Patent TW-201626503-A (TW)
Title: Feature fill with nucleation inhibition
Inventor: CHANDRASHEKAR ANAND
IPC: H01L21/324
Filed: 2015-09-30
Abstract: Described herein are methods of filling features with tungsten, and related systems and apparatus, involving inhibition of tungsten nucleation. In some embodiments, the methods involve selective inhibition along a feature profile. Methods of selectively inhibiting tungsten nucleation can include exposing the feature to a direct or remote plasma. Pre-inhibition and post-inhibition treatments are used to modulate the inhibition effect, facilitating feature fill using inhibition across a wide process window. The methods described herein can be used to fill vertical features, such as in tungsten vias, and horizontal features, such as vertical NAND (VNAND) wordlines. The methods may be used for both conformal fill and bottom-up/inside-out fill. Examples of applications include logic and memory contact fill, DRAM buried wordline fill, vertically integrated memory gate and wordline fill, and 3-D integration using through-silicon vias.
Patent TW-201703948-A (TW)
Title: Robot and control method therefor
Inventor: ONO SEITA
IPC: B25J19/04
Filed: 2015-11-04
Abstract: Provided are a robot and a control method therefor with which workpiece removal work can be easily achieved without disposing a dedicated jig or device and without providing an advanced visual recognition system and performing a complicated control. The robot is provided with: a first arm having a first end provided on the distal end thereof and at least one joint shaft provided between a base and the first end; a first action part provided on the first end for contacting a specified platform on which multiple workpieces can be loaded; a control unit; an imaging unit for two-dimensionally imaging the workpiece loading surface of the platform from a vertical direction thereof; and a recognition unit for recognizing a workpiece position by performing two dimensional pattern matching from a two dimensional image taken by the imaging unit. The control unit jars the platform by controlling the first arm so as to cause the first action part to act on the platform.
Patent TW-201622015-A (TW)
Title: Integrating enhancement mode depleted accumulation/inversion channel devices with mosfets and preparing method thereof
Inventor: BOBDE MADHUR
IPC: H01L21/762
Filed: 2015-12-04
Abstract: A plurality of gate trenches is formed into an epitaxial region of a first conductivity type over a semiconductor substrate. One or more contact trenches are formed into the epitaxial region, each between two adjacent gate trenches. One or more source regions of the first conductivity type are formed in a top portion of the epitaxial region between a contact trench are a gate trench. A barrier metal is formed inside each contact trench. Each gate trench is substantially filled with a conductive material separated from trench walls by a layer of dielectric material to form a gate. A heavily doped well region of a conductivity opposite the first type is provided in the epitaxial region proximate a bottom portion of each of the contact trenches. A horizontal width of a gap between of the well region and the gate trench is about 0.05 [mu]m to 0.2 [mu]m.
Patent TW-201638854-A (TW)
Title: Fund recovery method and apparatus
Inventor: Ji da-song
IPC: G06Q20/22
Filed: 2015-12-15
Abstract: A fund recovery method includes receiving and storing details of arrears sent from a transaction system; selecting details of arrears that meet one or more recovery application conditions and generating a recovery application form; conducting a fund operation according to the recovery application form; and allocating an obtained fund to the details of arrears from which the recovery application form is generated according to one or more preset fund refilling rules. Using technical solutions of the present disclosure, each transaction system does not need to implement a recovery function individually, thus avoiding a large amount of repeated work and improving the performance of transaction systems and payment systems.
Patent TW-201623971-A (TW)
Title: Camera module test jig
Inventor: CHUNG YOUNG-BAE
IPC: G01R1/04
Filed: 2015-12-16
Abstract: A camera module test jig comprises: a base plate provided with a camera module mounting unit; a cylinder support base provided between the base plate and a cylinder that drives a roller module to move forward and backward for supporting the cylinder; a jig cover, which covers the camera module mounting unit and closes the same via the roller module which partially moves forward in response to a single stroke of the cylinder; a base coupled to the jig cover through a hinge and comprising a tapered hinge unit; and a roller module which moves forward in response to a single stroke of the cylinder, while enabling the jig cover to cover the camera module mounting unit and makes it closed, wherein the tapered hinge unit may move forward with the remaining stroke of the cylinder for pushing down the base. This invention can achieve vertical connector on a pushdown clamshell type jig cover to make it subjected to a contact force perpendicularly, so as to avoid damages of the spring thimble. As a result, it is possible to reduce the impact applied to the spring thimble, prolong the service life of the spring thimble, thereby obtaining economic benefits of reduced maintenance fees and workforce management fees.
Patent TW-201725005-A (TW)
Title: Physiological status monitoring device
Inventor: OUYANG HSNG
IPC: A61B5/01
Filed: 2016-01-08
Abstract: A physiological status monitoring device includes a monitoring module and a fixing module. The monitoring module includes a first housing for being arranged at a first side of a flexible object, a monitoring unit arranged in the first housing for monitoring a physiological status of a human body, a first processing unit electrically connected to the monitoring unit for controlling operations of the monitoring unit, and a first magnetic fixing unit connected to the first housing. The fixing module includes a second housing for being arranged at a second side of the flexible object, and a second magnetic fixing unit connected to the second housing. Wherein, the first magnetic fixing unit and the second magnetic fixing unit are configured to hold the first housing and the second housing on the flexible object by magnetic force.
Patent TW-201728034-A (TW)
Title: Circuit system
Inventor: HUANG WEI-CHANG
IPC: H02H9/02
Filed: 2016-01-25
Abstract: The invention provides a circuit system for preventing electrostatic discharge (ESD), which comprises an electrostatic discharge (ESD) clamp circuit, an internal circuit, and a dynamic ground switching circuit. The ESD clamp circuit comprises a first end and a second end which are respectively connected to a high voltage end and a low voltage end of a power source for discharging the surge voltage of the power source. The internal circuit is connected to the power source and the ESD clamp circuit for providing a specific circuit function. The dynamic ground switching circuit has a first input end and a first output end. The first input end is connected to the low voltage end and the first output end is connected to the internal circuit. When there is a negative surge voltage at the low voltage end, the dynamic ground switching circuit provides a high impedance path between the ESD clamp circuit and the internal circuit for preventing the negative surge voltage from entering the internal circuit.
Patent TW-201632750-A (TW)
Title: Anti-friction bearing
Inventor: Matsunaga kyohei
IPC: F16C19/04
Filed: 2016-02-01
Abstract: In an angular contact ball bearing (10), an outer ring (12) is provided with a plurality of oil holes (15), each located at the same position in the axial direction, separated from each other in the circumferential direction, and passing through the outer ring in the diametric direction. The circumferential phases of the plurality of oil holes (15) are such that, viewing the angular contact ball bearing (10) from the axial direction while the bearing is rotating, when the center (A) of a ball (13) passes through the center line (L1) of any one oil hole (15a), a ball (13) nearest to a remaining oil hole (15b) is in a position intersecting the center line (L2) of the oil hole (15b); and when viewing the angular contact ball bearing (10) from the axial direction, the angle ([Theta]) formed by a straight line (LA) that passes through the center (A) of the ball (13) nearest to the oil hole (15b) and that is perpendicular to the diametric direction of the angular contact ball bearing (10), and a tangent line (LB) at a tangent point (B) of the ball (13) and the center line (L2) of the oil hole (15b), is at least 45 degrees.
Patent TW-201728827-A (TW)
Title: Solid-hydrogen carbon deposit removal control apparatus
Inventor: GUAN JIN-CHIN
IPC: B60K15/00
Filed: 2016-02-05
Abstract: A solid-hydrogen carbon deposit removal control apparatus includes a control device and a hydrogen carrier, and the control device has a gas inlet and a gas outlet, and the gas inlet is connected to the hydrogen carrier, and the gas outlet is connected to an intake manifold of a car, and the control device includes a flow rate setter for setting a multiple of flow rate values, and the flow rate values are calculated according to the engine displacement and number of cylinders of a car and a specific proportion of the mixture of air, fuel and hydrogen. When the control device removes the carbon deposit of a car engine, the engine is started first, and then the control device sends hyrogen gas stored in the hydrogen carrier to the intake manifold of the car according to the flow rate set by the flow rate setter, and an appropriate amount of hydrogen flows into the car while the temperature of burning a trace of hydrogen is contorlled without melting a metal surface of a combustion chamber by the high heat of the hydrogen gas or corroding any metal in the combustion chamber by acidic/alkaline solution produced by hydrogen electrolyte, so as to ensure that the carbon deposit of the engine can be removed sucessfully.
Patent TW-201732807-A (TW)
Title: Static memory apparatus and static memory cell thereof
Inventor: Zhang zhao-yong
IPC: G11C11/413
Filed: 2016-03-22
Abstract: A static memory apparatus and a static memory cell thereof are provided. The static memory cell includes a data latch circuit, a data write-in circuit and a data read-out circuit. The data latch circuit has a first tristate output inverting circuit and a second tristate output inverting circuit. The data write-in circuit provides a first reference voltage to a power receiving end of a selected tristate output inverting circuit which is one of the first and second tristate output inverting circuit, and provides a second reference voltage to an input end of the selected tristate output inverting circuit during a data write-in time period. The data read-out circuit generates read-out data according to a voltage at an output end of the second tristate output inverting circuit and the second reference voltage during a data read-out time period.
Patent TW-201737372-A (TW)
Title: Semiconductor structure and method for manufacturing the same
Inventor: JIANG YU-WEI
IPC: H01L21/60
Filed: 2016-04-07
Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a plurality of first stacked structures and two second stacked structures disposed on the substrate. Each of the first stacked structures includes alternately stacked metal layers and oxide layers. Each of the second stacked structures includes alternately stacked silicon nitride layers and oxide layers. The first stacked structures are disposed between the two second stacked structures.