baber/WOPTO huggingface dataset:
Patent TW-I278025-B (TW)
Title: Method of making an SOI semiconductor device having enhanced, self-aligned dielectric regions in the bulk silicon substrate
Inventor: WEI ANDY C
IPC: H01L27/12
Filed: 2003-05-29
Granted: 2007-04-01
Abstract: In one illustrative embodiment, the method comprises forming a gate electrode above an SOI substrate comprised of a bulk substrate, a buried insulation layer and an active layer, the gate electrode having a protective layer formed thereabove, and forming a plurality of dielectric regions in the bulk substrate after the gate electrode is formed, the dielectric regions being self-aligned with respect to the gate electrode, the dielectric regions having a dielectric constant that is less than a dielectric constant of the bulk substrate. In further embodiments, the method comprises forming a gate electrode above an SOI substrate comprised of a bulk substrate, a buried insulation layer and an active layer, the gate electrode having a protective layer formed thereabove, performing at least one oxygen implant process after the gate electrode and the protective layer are formed to introduce oxygen atoms into the bulk substrate to thereby form a plurality of oxygen-doped regions in the bulk substrate, and performing at least one anneal process to convert the oxygen-doped regions to dielectric regions comprised of silicon dioxide in the bulk substrate. In one illustrative embodiment, the device comprises a gate electrode formed above an SOI structure comprised of a bulk substrate, a buried insulation layer, and an active layer, and a plurality of dielectric regions comprised of silicon dioxide formed in the bulk substrate, the dielectric regions being self-aligned with respect to the gate electrode.
Patent TW-583061-B (TW)
Title: Method for producing latex cushion
Inventor: JANG HENG-TAI
IPC: B29C39/00
Filed: 2003-06-10
Granted: 2004-04-11
Abstract: A method for producing a latex cushion comprises: mixing a latex main material with a specified amount of additives and air; injecting the mixed mixture into a forming mold; raising the temperature of the mold to a specified value to cross-link the mixture; and opening the mold and removing the cross-linked product from the mold.
Patent TW-I242717-B (TW)
Title: Memory bus termination
Inventor: ZUMKEHR JOHN F
IPC: G06F13/40
Filed: 2003-06-20
Granted: 2005-11-01
Abstract: Methods, apparatus and machine-readable medium are described to terminate a memory bus line. In some embodiments, the memory bus line is terminated with one or more transistors of an output buffer that are used to drive the memory bus line during a memory write.
Patent TW-I228814-B (TW)
Title: Parasitic capacitance-preventing dummy solder bump structure and method of making the same
Inventor: JAO JUI-MENG
IPC: H01L23/522
Filed: 2003-06-26
Granted: 2005-03-01
Abstract: A parasitic capacitance-preventing dummy solder bump structure on a substrate has at least one conductive layer formed on the substrate, a dielectric layer employed to cover the conductive layer, an under bump metallurgy layer (UBM layer) formed on the dielectric layer, and a solder bump formed on the UBM layer.
Patent TW-I234592-B (TW)
Title: Thin sheet manufacturing method, and thin sheet manufacturing apparatus
Inventor: GOMA SHUJI
IPC: C30B29/64
Filed: 2003-06-27
Granted: 2005-06-21
Abstract: A thin sheet manufacturing method with very high manufacturing efficiency and at a revolutionarily low manufacturing cost per unit area both achieved by expanding the production scale and a thin sheet manufacturing apparatus. A silicon thin sheet (1) is manufactured by the process including a dipping step in which the surface portion of a base sheet (2) is dipped in a silicon melt (10), and silicon is made to adhere to the surface of the base sheet. After the silicon thin sheet (1) formed on the surface (2a) of the base sheet (2) is separated from the base sheet, at least the peripheral portion (4) of the silicon thin sheet (1) is cut. Since a high-quality silicon thin sheet can be manufactured at a high efficiency, the manufacturing cost can be lowered.
Patent TW-I220069-B (TW)
Title: Bumping process
Inventor: LIN YUEH-LUNG
IPC: H01L23/48
Filed: 2003-07-04
Granted: 2004-08-01
Abstract: A bumping process is described. The bumping process comprises the following steps: (a) Providing a wafer that has a plurality of bonding pads and a passivation layer. The passivation layer exposes the bonding pads; (b) Forming a metal layer on the wafer that at least covers the bonding pads; (c) Forming a positive photoresist layers on the wafer; (d) Forming a plurality of first openings corresponding to the bonding pads in the positive photoresist layer respectively to expose the metal layer; (e) Forming a negative photoresist layers on the patterned positive photoresist layer; (f) Forming a plurality of second openings corresponding to the bonding pads in the negative photoresist layer respectively; (g) Filling the solder material into each of the first openings and the second openings to form a plurality of solder posts; (h) Removing the positive photoresist layer and the negative photoresist layer. The bumping process can prevent the decrease in height of bumps caused by undercut and further increase the height of bumps to enhance the reliability of the connection between chip and carrier.
Patent TW-I225964-B (TW)
Title: Fan structure and heat dissipation device for projector incorporating the same
Inventor: LIN CHIA-JUI
IPC: G03B21/16
Filed: 2003-09-05
Granted: 2005-01-01
Abstract: A fan structure includes a base, a fan blade and a fan frame. The fan blade used for inducing an airflow from an intake side to an exhaust side is pivoted on the base, and the fan frame is mounted on the base to accommodate the fan blade. A first region enclosed by one end of the fan frame at the intake side is larger than a second region enclosed by the other end of it at the exhaust side.
Patent TW-I242782-B (TW)
Title: Chip type power inductor and fabrication method thereof
Inventor: HONG SOON-GYU
IPC: H01F27/28
Filed: 2003-11-28
Granted: 2005-11-01
Abstract: A chip type power inductor comprising: a stack body where a magnetic substance which forms a magnetic core stacked with a plurality of layers and non-magnetic layers inserted to inside of the magnetic substance which forms a magnetic core are formed as one unit; coil patterns formed on either upper surfaces or lower surfaces of the plurality of layers of the magnetic substance which forms a magnetic core; and via holes formed at the plurality of layers constituting the magnetic substance which forms a magnetic core in order to electrically connect the coil patterns. A magnetic saturation is restrained by a non-magnetic layer formed in the power inductor, so that a DC bias characteristic corresponding to several hundreds of mA to 1A which could not be realized by the conventional multi-layer chip power inductor can be obtained.
Patent TW-I246946-B (TW)
Title: Method and system for manufacturing a tubing having a conical end
Inventor: LIU FENG-CHI
IPC: B21D51/10
Filed: 2003-12-15
Granted: 2006-01-11
Abstract: A method for manufacturing a tubing having a conical end, the method including the steps of: (1) receiving and clamping a tubing in a first tubular compartment through a feeding device; (2) delivering the tubing clamped by the first tubular compartment to a second tubular compartment of a material storage device, causing the second tubular compartment to receive and retain the tubing, where an end of the tubing exposes out of the second tubular compartment; and (3) using a tapering indent of a stamping device to stamp the end of the tubing exposed out of the second tubular compartment to form a tapering profile at the end of the tubing.
Patent TW-I260806-B (TW)
Title: A method for filling electrolyte solution and sealing of battery
Inventor: HUANG WEN-JENG
IPC: H01M10/04
Filed: 2003-12-23
Granted: 2006-08-21
Abstract: The present invention relates to a method for filling electrolyte solution and sealing of battery. The method includes the following steps: providing a battery case and a cap assembly having an injection hole defined therein; providing a cover member having a shaft connected thereon; guiding the shaft passing through the injection hole from an inner side of the cap assembly and extending from an outer side of the cap assembly; welding the cap assembly with the battery case to form an integral assembly; introducing electrolyte solution into the case via the injection hole; pulling the shaft and attaching the cover member tightly to the cap assembly so as to cover the injection hole; welding the shaft with the cap assembly into an integration; and removing an portion of the shaft that extending out of the cap assembly.
Patent TW-I240121-B (TW)
Title: Liquid crystal display
Inventor: WANG HAI-LIN
IPC: G02F1/1335
Filed: 2004-01-07
Granted: 2005-09-21
Abstract: A liquid crystal display. The liquid crystal display has a liquid crystal panel, a backlight module, a frame and a light-inductive adhering layer. The backlight module and the frame are disposed respectively on the two sides of the liquid crystal panel, and the liquid crystal panel and the backlight module are enclosed by the frame. The light-inductive adhering layer is disposed between the liquid crystal panel and the frame to adhere the liquid crystal panel and the frame. When a specific light is provided to irradiate the light-inductive adhering layer, the light-inductive adhering layer loses adhesion so that the liquid crystal panel and the frame are separated.
Patent TW-I257109-B (TW)
Title: Cable with foamed plastic insulation comprising an ultra-high die swell ratio polymeric material
Inventor: BLEW DOUGLAS J
IPC: H01B3/44
Filed: 2004-04-09
Granted: 2006-06-21
Abstract: An electrical communications element having a foamed plastic insulation extruded about a conductor with said insulation comprising at least one component with no more than 20% by weight of an ultra-high die swell ratio polymer (UHDSRP), preferably around 15% by weight. The UHDSRP is defined as greater than 55% die swell ratio and more preferably greater than 65% die swell ratio. The insulation also preferably comprises at least a second component with a high degree of stress crack resistance, such that the combination of (minimally) these polymers will yield an insulation layer that has a unique combination of physical properties yielding a high degree of foaming, small uniform cell structure, characteristically lower attenuation, and stress crack resistance capable of withstanding greater than 100 hours at 100 DEG C while coiled at a stress level of 1 times the insulation outside diameter without failure (cracking).
Patent TW-I273967-B (TW)
Title: Thermoplastic copolyester and heat-shrinkable tube made with the copolyester
Inventor: JEN ZO-CHUN
IPC: B29C55/26
Filed: 2004-04-29
Granted: 2007-02-21
Abstract: A thermoplastic copolyester is molten extruded into an unstretched tube and then is air-inflated into a heat-shrinkable tube by tubular stretching. The heat-shrinkable tube has shrinkage of not more than 15% in the longitudinal direction (MD) and shrinkage of at least 40% in the radial direction (TD). The heat-shrinkable tube is suitable for the insulation of any conductor.
Patent TW-I285772-B (TW)
Title: A light guide plate and a backlight module using the same
Inventor: TENG CHING-HUNG
IPC: F21V8/00
Filed: 2004-06-18
Granted: 2007-08-21
Abstract: The present invention relates to a light guide plate, the light guide plate includes a bottom surface and a light incident surface. The bottom surface connects with the light incident surface, wherein a plurality of V-shaped grooves are formed therein. The V-shaped grooves are disposed continuous and asymmetric so as to improve the light utilization efficiency of the light guide plate.
Patent TW-I250226-B (TW)
Title: Copper electrolytic solution containing a dialkyl amino group-containing polymer having a specific skeleton and an organic sulfur compound as additives, and an electrolytic copper foil prepared by the same
Inventor: TSUCHIDA KATSUYUKI
IPC: C25D3/38
Filed: 2004-06-21
Granted: 2006-03-01
Abstract: This invention provides a low profile electrolytic copper foil having low surface roughness on the rough side (the opposite side of the glossy side) in a process for making an electrolytic copper foil using a cathode drum. This method more particularly provides an electrolytic copper foil capable of forming a fine pattern and having excellent tensile strength and an elongation under ambient temperature and high temperature. This invention also provides an electrolytic solution containing an additive including an organic sulfur compound and a polymer containing a dialkyl amino group obtained by polymerizing an acrylic compound having a dialkyl amino group or copolymerizing said acrylic compound with other compound(s) having an unsaturated bond.
Patent TW-I252616-B (TW)
Title: Electrical connector contact
Inventor: YU WEI
IPC: H01R13/02
Filed: 2004-06-30
Granted: 2006-04-01
Abstract: A contact of electrical connector for interconnecting an IC package and a printed circuited board includes a body, a soldering portion, a contacting portion, and an arm portion extending from the body. The arm portion includes an extending arm extending from the body, a connecting arm folding from the extending arm. The connecting arm is used to connect the extending arm and the contacting portion so as to add the length of the arm portion and the elasticity of the arm portion.
Patent TW-I270858-B (TW)
Title: Apparatus for preventing disengagement in disk device
Inventor: WU PING-TIEN
Filed: 2004-08-12
Granted: 2007-01-11
Abstract: An apparatus for preventing disengagement in a disk device includes a supporting frame with an elastic section, a carrier connecting to one end of the supporting frame, a tooth base connecting to the other end of the supporting frame, and a position spring. A plurality of racks is set on the tooth base. The position spring has a main spring supported between the carrier and the tooth base, and a limiting part connects to the main spring and leaves a predetermined space between the carrier and the tooth base. The position spring pushes the tooth base to engage a lead screw and limits the bend of the tooth base, so as to simplify the servo control and components.
Patent TW-I279878-B (TW)
Title: Flip-chip bonding process and chip package structure and package carrier thereof
Inventor: CHEN JEN-CHUAN
IPC: H01L21/68
Filed: 2004-09-29
Granted: 2007-04-21
Abstract: A flip-chip bonding process. At first, forming a pre-solder layer on a portion of contacts of a substrate, the other contacts without the pre-solder layer is used to be a position contact for lower melting-point bump, then a chip is disposed on the substrate to connect with the portion of contacts by higher melting-point bumps and to connect with the above position contact by lower melting-point bump. Therefore, during the reflow process, lower melting-point bump can enhance the alignment between the chip and the substrate by means of surface tension effect to overcome the question of misalignment of the chip due to bias shift during reflow.
Patent TW-I269241-B (TW)
Title: Shunt of floating-ball machine
Inventor: LIN YUE-CHUEN
IPC: G07C15/00
Filed: 2004-11-17
Granted: 2006-12-21
Abstract: The present invention is related to a shunt of a floating-ball machine, which is mounted at the venting-tube top portion of the blower set for the floating-ball machine. In addition, the shunt located at the horn-shaped ball trough bottom portion of the floating-ball machine, which includes a flat-shaped top plate; and several shunting trough holes disposed and spaced at intervals are distributed on the top plate. When the blower set vents the disordered airflow to pass through each shunting through hole, the original fluid is squeezed to generate the consistence phenomenon of airflow so as to obtain the laminar flow effect. By quickly and uniformly blowing the lottery ball to completely obtain the rolling convection, the opened probability of each lottery ball becomes even more equal so as to raise the equity and justice. In addition, it is capable of increasing the efficiency of getting a ball because the rolling speed is high.
Patent TW-I245406-B (TW)
Title: Cascaded gate-driven ESD clamp
Inventor: CHEN KER-MIN
IPC: H01L23/60
Filed: 2004-12-09
Granted: 2005-12-11
Abstract: A method is provided for semiconductor ESD protection in a mixed voltage device using cascaded gate driven NMOS clamp circuit. Used of a bias circuit allows for an external I/O signal to have a voltage higher than the internal circuit power supply voltage so that a proper trigger level is provided in reference to an external power supply reference. A cascaded gate-driven NMOS clamp circuit dissipates charge from an ESD event from the higher external I/O signal level without interfering with the normal operation of the internal or ""core"" circuits.
Patent TW-I246089-B (TW)
Title: Device and method for determining phase sequence and turns ratio
Inventor: JANG YAU-GUANG
IPC: H01F29/00
Filed: 2004-12-31
Granted: 2005-12-21
Abstract: The present invention provides a device and method for determining phase sequence and turns ratio, which could be used to determine the phase sequence and the turns ratio of three-phase transformer. The device for determining phase sequence and turns ratio is used to apply the voltage on the primary of three-phase transformer, and detect the inductive voltage generated at the secondary of the three-phase transformer, and then determine the phase sequence and turns ratio according the input voltage at the primary of three-phase transformer and the inductive voltage generated at the secondary of the three-phase transformer, and the determination method is based on the method for determining phase sequence and turns ratio according to the present invention. Because the device for determining phase sequence and turns ratio according to the present invention has simple structure and is of low cost, which could eliminate the defects of the conventional device for determining phase sequence and turns ratio.
Patent TW-I276059-B (TW)
Title: Wear proof device for a disk drive
Inventor: WU JEN-CHEN
IPC: G11B17/02
Filed: 2005-01-28
Granted: 2007-03-11
Abstract: The invention is a wear proof device for a disk drive. The disk drive has a carrying area for accommodating a rotating disk. A loading base mounted in the carrying area has a long slot for guiding a pick-up head to move back and forth. The wear proof device is higher than the pick-up head, located at the rim of the carrying area, and attached on the loading base as a whole. The wear proof device is also close to the outer end of the moving path of the pick-up head to touch the non-data rim of the disk which is vibrating down. The wear proof device prevents the disk from colliding against the pick-up head, such that the pick-up head and disk avoid damaging.
Patent TW-I270805-B (TW)
Title: Key and keyboard
Inventor: YEH CHUN-LIANG
Filed: 2005-03-15
Granted: 2007-01-11
Abstract: A key includes a light-permeable body, a light-shading layer, and a first dye layer. The light-permeable body has a surface. The light-shading layer is formed on the surface and has a first light-permeable area and a second light-permeable area. The first dye layer is formed on the light-shading layer and covers the first light-permeable area.
Patent TW-I250918-B (TW)
Title: Hammering assembly structure for a power tool
Inventor: JANG RUEI-SHENG
IPC: B25B21/02
Filed: 2005-03-24
Granted: 2006-03-11
Abstract: This invention relates to a ""hammering assembly structure for a power tool,"" including: a hammering chamber and a hammering element. The hammering chamber is provided in the power tool and driven to rotate by the power tool. The hammering chamber is provided at an end thereof with two pin-holes that are each slidably provided with a percussion pin. The hammering chamber is provided with a resilient body in each of the two pin-holes. The resilient body applies a force to cause the percussion pins to move out of the pin-holes. The hammering element includes a first end and a second end. The first end has an end face that is formed with two indents, through which the two percussion pins may extend. The second end of the hammering element is provided with a transmission shaft. The transmission shaft serves to tighten or release a workpiece. As such, the hammering chamber and the hammering element can simplify the manufacturing process and reduce assembling time, reduce manufacturing cost and improve structural strength.
Patent TW-I260294-B (TW)
Title: Bicycle brake control device with electrical operating member
Inventor: FUJII KAZUHIRO
IPC: B62L3/02
Filed: 2005-05-12
Granted: 2006-08-21
Abstract: A bicycle brake control device includes a brake lever bracket, a brake control lever and an electrical operating member. The brake lever bracket is configured to be attached to a mounting portion of a bicycle handlebar. The brake control lever is pivotally coupled to the bracket to move toward the handlebar from a rest position along a braking plane to a braking position. The brake control lever includes a proximal portion pivotally coupled to the bracket and a distal portion extending from the proximal portion. The electrical operating member is movably coupled to the distal portion to electrically operate a bicycle component. The distal portion has a laterally outermost distal edge located laterally outwardly from a laterally outermost proximal edge of the proximal portion as measured perpendicularly relative to the braking plane such that the operating member is located laterally outwardly from a handlebar centerline of the mounting portion.
Patent TW-I266789-B (TW)
Title: Molding compositions with acrylonitrile-alkyldiene rubber-styrene terpolymer for laser marking
Inventor: LU WEN-CHIH
IPC: C08L55/02
Filed: 2005-05-26
Granted: 2006-11-21
Abstract: The invention relates to compositions comprising Acrylate group and acrylonitrile/diene rubber/styrene (ABS) terpolymer and/or its derivative products process and method for making such compositions have excellent laser marking ability. The ABS terpolymer is core-shell type resin and contains in blends have 10 to 99.9% by weight percent, and there are 5 to 70% by weight percent diene rubber component in core and there are maximum 10% by weight percent multi-functional group monomer in core. The shell component in ABS terpolymer contains acrylonitrile group 5 to 15% by weight percent and acrylate group 40 to 70% by weight percent and there are 0.01 to 15% by weight percent multi-functional group monomer by calculate of the acrylate group base. In blends components, the main components is poly(styrene-co-acrylonitrile) and it contains 0 to 90% by weight. The main blends components it contains acrylonitrile group 20 to 40% by weight in itself and there are 0.01 to 10% by weight percent multi-functional group monomer by calculate of the acrylonitrile group base. These molding compositions have excellent laser marking ability.
Patent TW-I266105-B (TW)
Title: Liquid crystal display
Inventor: CHEN HUNG-YU
IPC: G02F1/13
Filed: 2005-08-26
Granted: 2006-11-11
Abstract: The present invention relates to a liquid crystal display, which includes two opposite substrates. Liquid crystal is disposed between the two substrates. One of the two substrates includes gate lines, source lines, pixel electrodes, and common electrodes. The common electrode has a slit structure to reduce the signal coupling to the pixel electrode for decreasing crosstalk of the picture.