baber/WOPTO huggingface dataset:
Patent JP-2004311365-A (JP)
Title: Discharge lamp lighting device
Inventor: ADACHI YUKIFUMI
IPC: H05B41/24
Filed: 2003-04-02
Abstract: <P>PROBLEM TO BE SOLVED: To make sure to start a discharge lamp by simply and properly preheating a filament when components are not uniform, and to detect the end of a lamp life.  <P>SOLUTION: This discharge lamp lighting device is provided with a preheating timer circuit 42 to measure timing of changing the oscillating frequency of a driving circuit 41, a starting timer circuit 43, a detecting circuit 44 controlled by the preheating timer circuit 42 and the starting timer circuit 43, and a lighting circuit 50 composed of an inductor 51 for a ballast, an auxiliary capacitor 52, and a discharge lamp 53. It is also provided with a detecting winding 51C wound on the secondary side of the inductor 51 for the ballast to monitor a filament winding 51A and a filament winding 51B connected between the filaments of the discharge lamp 53, and voltages at both ends of the windings during the preheating period, and to monitor the voltages at both ends of the inductor 51 for the ballast after lighting to detect the end of life of the discharge lamp 53.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004330149-A (JP)
Title: Circulation type photocatalyst filter apparatus
Inventor: MURAKAMI MAKOTO
IPC: B01J35/02
Filed: 2003-05-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide a circulation type photocatalyst filter apparatus for gases using a photocatalyst, for cleaning gases to be cleaned by circulating the gases.  <P>SOLUTION: In this photocatalyst filter apparatus, multiple filter elements fixing the photocatalyst and multiple light emitting tubes emitting light to the filter elements are contained, and a diffuser part of an ejector type circulator having a box part having an electrode for the light emitting tubes, a gas introducing port, a gas exhausting port and a suction port, and a gas supply port, is connected to the gas inlet port and the suction port of the box part is connected to a return port by a return pipe.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004329761-A (JP)
Title: Endoscopic equipment
Inventor: MIYAKE KIYOSHI
IPC: A61B1/04
Filed: 2003-05-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide an endoscopic equipment either of whose functions can be amplified, intensified, or added to expand its practical performance, for laborsaving in test preparation and the test itself, and reduction in cost of its entire system.  <P>SOLUTION: The endoscopic equipment has an amplifying unit 60 to amplify a regular function of either of a scope unit 2 or a fixed unit 3 at least between the scope unit 2 and the fixed unit 3.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004338489-A (JP)
Title: Folding motorcycle
Inventor: MIYA NAOKI
IPC: B62K15/00
Filed: 2003-05-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a folding motorcycle maintained in a folded state and considered in safety without releasing fastening if not performing a fastening releasing operation by an intention of a user and without freely releasing the folded state against the intention of the user.  <P>SOLUTION: In this folding motorcycle, a vehicle body frame 3 is divided into a front frame 4 and a rear frame 5, and the divided front frame 4 and rear frame 5 are foldably connected by a hinge body 6. The motorcycle is provided with the following requirements. (a) A front wheel 14 and a rear wheel 17 are faced to each other when folding the vehicle body frame 3. (b) A fastening mechanism A for fastening the front frame 4 and rear frame 5 for supporting the front wheel 14 and the rear wheel 17 with each other is provided on the front frame 4 and rear frame 5 when folding the vehicle body frame 3. (c) The fastening of the fastening mechanism A is not released if not performing the fastening releasing operation.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004337073-A (JP)
Title: Connecting type planter
Inventor: KITADA YASUTOMO
IPC: A01G9/02
Filed: 2003-05-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a connecting type planter facilitating construction and workability without the need of a special and skilled technique, corresponding to a planting space in various ways and enabling expecting rich diversification as stage effect especially on greening a rooftop of a building or the like.  <P>SOLUTION: The connecting type planter 1 includes a cover 2 having pockets 4 each recessed at a top plate 2 corresponding with the outer shape of a pot 3 to be inserted and supporting the pot and a water supplying mat 17 for supplying water to the pot at the bottom 4a and a waterway 6 on the periphery of the top panel, a water storage tank 8 composed of a vessel capable of storing water inside and having a grip 9 constructed in a flange shape so as to receive an edge plate of the waterway provided on the periphery of the cover on the upper and outer periphery and, a connection hole 10 composed of a notch opening to the upper part of a side wall, and connection hole insertion devices 11 and 12 inserted into the connection hole 10 of the water storage tank, surrounded with the cover 2 at the upper face and constructed to be united with the water storage tank 8.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004339831-A (JP)
Title: Fingerprint authentication type radio communication system
Inventor: BUKE TAKAYUKI
IPC: B60R25/10
Filed: 2003-05-16
Abstract: <P>PROBLEM TO BE SOLVED: To surely enhance a security level while suppressing a deterioration in communication responsiveness and an increase in amount of power consumption.  <P>SOLUTION: A portable machine 11 divides portable-machine-side fingerprint data into a plurality of partial data, and imparts an individually corresponding identifier to each of the partial data. An authentication device 21 divides authentication-side fingerprint data into partial data and imparts identifiers, in such a manner as to correspond to the portable-machine-side fingerprint data, arbitrarily selects one of the imparted identifiers, and transmits a request signal including the selected identifier. When receiving the request signal, the portable machine 11 converts the partial data, corresponding to the identifier included in the request signal, into a radio signal, so as to transmit the radio signal to the outside. The authentication device 21 determines whether or not the portable machine 11 is authenticated, in accordance with the result of comparison between the partial data, corresponding to the identifier included in the request signal, of the authentication-side fingerprint data, and the partial data included in the received radio signal.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004346336-A (JP)
Title: Laminate containing wurtzite crystalline layer and its manufacturing method
Inventor: AKIYAMA MORIHITO
IPC: C23C28/00
Filed: 2003-05-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a laminate having a multilayer structure wherein a layer comprising a compound having a wurtzite crystalline structure whose crystallinity and crystalline orientation are regulated is grown on a functional substance layer independent of the crystalline structure of the functional substance layer.  <P>SOLUTION: A first wurtzite crystalline layer 2 comprises the compound having the wurtzite crystalline structure and is previously formed between a substrate 1 and the functional substance layer 3 serving as a ground. This improves the crystallinity and the crystalline orientation of a second wurtzite crystalline layer 4 formed on the functional substance layer 3.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004349282-A (JP)
Title: Method and system for filling via hole with paste and method of producing multilayer substrate
Inventor: HAYASHI YOSHITAKE
IPC: H05K3/46
Filed: 2003-05-20
Abstract: <P>PROBLEM TO BE SOLVED: To fill a via hole well with a conductive paste regardless of the aspect ratio of the via hole or the viscosity of the conductive paste, and to perform electrical connection surely and stably.  <P>SOLUTION: The whole of the lower surface of a substrate 1 provided with a through via hole 2 is made to touch the paste liquid surface at the opening 6a of a container 6 containing conductive paste 4 under enclosed state except the opening 6a. Open liquid surface around the substrate 1 at the opening 6a is enclosed with a mask fixing frame 7 and then one side of the substrate 1 and the container 6 is moved to approach the other side or the one side and the other side are moved relatively to approach each other in order to press the conductive paste 4 thus filling the via hole 2 of the substrate 1 with the conductive paste 4.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2006240315-A (JP)
Title: Saddle type vehicle
Inventor: KONNO TOSHIHIKO
IPC: B62J17/06
Filed: 2003-05-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a saddle type vehicle capable of attaining a sufficient amount of airflow and high cooling performance while suppressing size enlargement, as well as comfortable driving conditions by preventing warm air from directly hitting a driver.  <P>SOLUTION: This saddle type vehicle is composed of a leg shield 20 for covering the front portion of legs of a driver 32 and a cooling device displaced in front of the front portion of the leg shield 20.The leg shield 20 includes a space 21 formed inside the leg shield 20; a first opening 22 for connecting the space 21 to the rear of the cooling device; and a second opening 23 formed at a position apart from the first opening 22, thus forming an introducing passage 24 for introducing the air passing through the cooling device from the first opening 22 into the inside of the space 21 and for discharging it to the outside of the space 21 from the second opening 23.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2004349351-A (JP)
Title: Crystalline semiconductor film, its manufacturing method, semiconductor device, and indicating device
Inventor: MIZUKI TOSHIO
IPC: H05B33/14
Filed: 2003-05-20
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a semiconductor device with high electron mobility by a method wherein crystal quality is evaluated with sufficient reproducibility, so that crystal defect is reduced and a crystalline semiconductor film with superior crystallinity is obtained.  <P>SOLUTION: In a method for forming the crystalline semiconductor film by a method wherein energy is applied to an amorphous semiconductor film 2 formed on a substrate 1 and crystal growth is performed, each crystal grain which constitutes the crystalline semiconductor film is controlled in such a manner that ratio of grains wherein crystal orientation angle difference of adjoining crystal grains is at least 34° and at most 42° and at least 58° and at most 62° is controlled to at least 0.35 and at most 1. For example, excimer laser luminous energy density is set to at least 380 mJ/cm<SP>2</SP>and at most 400 mJ/cm<SP>2</SP>.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004347822-A (JP)
Title: Light emitting device and its manufacturing method
Inventor: KOYAMA JUN
IPC: G09F9/30
Filed: 2003-05-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide such a light emitting device which can satisfy the structure of the light emitting device permitting additional miniaturization and the reliability requested for the miniaturized light emitting device.  <P>SOLUTION: The light emitting device having an electroluminescence element is formed with a signal processing circuit in a place which has heretofore been a dead space on the side of an FPC and the like and is formed with a structure in which the TFTs, wiring and electroluminescence element formed on a substrate are held covered by barrier films having a function to prevent the infiltration of moisture and oxygen from the outside.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004348411-A (JP)
Title: Distributed power receiving/distributing facility integrated with central supervisory control system
Inventor: YUI SHUNJIRO
IPC: G05B23/02
Filed: 2003-05-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a system, for integrating power reception/distribution with central supervisory control, which permits energy conservation, space saving and construction saving, in a customer having a power receiving/distributing facility and a central supervisory control system, by the unification of duplicate functions between these facilities and the appropriate distributed installation of power transformation functions.  <P>SOLUTION: A power receiving/distributing facility system and a central supervisory control system are integrated, and electronic management equipment for measurement installed in the power receiving/distributing facility and a transmission terminal controller for an electric facility of the central supervisory control system are integrated. Thereby, downsizing, cost reduction, and construction saving can be achieved.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004348466-A (JP)
Title: Clock signal distribution circuit and semiconductor integrated circuit
Inventor: HIROZAWA SAKURA
IPC: H03K17/16
Filed: 2003-05-22
Abstract: <P>PROBLEM TO BE SOLVED: To average the accumulation value of the peak value of a feedthrough current generated in each circuit block, and to avoid noise having an inherent phase, in a semiconductor integrated circuit having a plurality of circuit blocks.  <P>SOLUTION: In the semiconductor integrated circuit 1, a selection signal generation random number generation circuit 42 generates a selection signal S that changes randomly in a set range each time when an inverted signal U rises, a selector 43 switches input and output ends, where delay clock signals C<SB>1</SB>, C<SB>2</SB>, and C<SB>3</SB>are inputted according to details instructed by the selection signal S, and randomly supplies delay clock signal each having a different delay time for each circuit block.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004349493-A (JP)
Title: Device for controlling film thickness and method of manufacturing soi substrate
Inventor: AHEI TADASHI
IPC: H01L21/205
Filed: 2003-05-22
Abstract: <P>PROBLEM TO BE SOLVED: To make the film thickness of a semiconductor layer (SOI (silicon on insulator) layer) fall within a predetermined range.  <P>SOLUTION: A film thickness controlling device is provided with depositing devices 101, 102 for depositing a semiconductor layer on the surface of a substrate, etching devices 104, 105 for etching the semiconductor layer on the surface of the substrate, and a controlling device 112 for controlling the devices 101, 102, and the devices 104, 105. The device 112 controls the depositing processes of the devices 101, 102, and the etching processes of the devices 104, 105 so that the film thickness of the semiconductor layer is the predetermined thickness.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004346226-A (JP)
Title: Epoxy resin molding material for sealing, and electronic component apparatus
Inventor: HAMADA MITSUYOSHI
IPC: C08K5/5419
Filed: 2003-05-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing, excellent in fluidity, adhesiveness and solder reflow resistance without lowering curing properties, and to provide an electronic component apparatus equipped with an element sealed with the material.  <P>SOLUTION: The epoxy resin molding material for sealing comprises (A) an epoxy resin, (B) a curing agent, (C) a silane compound containing a structure represented by formula (I) (wherein (n) is an integer of 1-6) in the skeleton and (D) an inorganic filler. In the epoxy resin molding material, the component (C) preferably comprises a silane compound further containing a nitrogen atom in the skeleton.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004356947-A (JP)
Title: Non-reciprocal circuit element and its manufacturing method
Inventor: INOUE YOSHITAKA
IPC: H01P1/36
Filed: 2003-05-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide a non-reciprocal circuit element in which the bending of conductors, each consisting of a plurality of strip bodies are corrected and less bending of the conductors is available and to provide its manufacturing method.  <P>SOLUTION: In the non-reciprocal circuit element, a first, a second, and a third center conductor 5, 6, 7 have the conductors 5a, 6a, 7a, each consisting of the plurality of mutually branched strip bodies, respectively. At least one surface of each of the two conductors of the central conductor is provided with an insulating thin plate 11 stuck to each of the strip bodies in a mutually isolated state. Each of the conductors 5a, 6a, 7a of the first, the second, and the third center conductor, 5, 6, 7 is intersected with each other in a mutually insulated state through the insulating thin plate 11. Consequently, each of the strip bodies of the conductors solely allows the correction (amendment) of the bending, or the like even if the conductors develop the bending in sticking the insulating thin plates 11. Thus, good performance is available.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004351034-A (JP)
Title: Golf ball with high strength
Inventor: ONODA KENJI
IPC: A63B37/04
Filed: 2003-05-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a golf ball which provides both a soft feeling and enough distance, and is excellent in durability, and to provide an efficient production method therefor.  <P>SOLUTION: The golf ball includes carbon nanotubes and/or fullerene in one or more of a core and layers for covering it. One or more kinds of carbon nanotubes such as the carbon nanotube, carbon fiber, or carbon nanohorn are used for the core or an intermediate layer. The fullerene can be used for a cover in addition to the carbon nanotubes. Since the carbon nanotubes are contained in the core or the intermediate layer, a crack arisen inside the ball is hardly propagated, so as to provide the ball with excellent durability. Since the carbon nanotubes and/or fullerene are contained in the cover, the ball with excellent durability and wear resistance is obtained.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004363146-A (JP)
Title: Inspection chip for evaluating joined quality of electronic component to circuit board and tool and method therefor using the chip
Inventor: NAKAJIMA KAZUTO
IPC: H05K3/34
Filed: 2003-06-02
Abstract: <P>PROBLEM TO BE SOLVED: To provide an inspection chip with which the joined state of an electronic component bump-joined to a circuit board to the circuit board can be evaluated, and to provide a tool and method for evaluating the joined quality of the electronic component to the circuit board using the chip.  <P>SOLUTION: On the inspection chip 1, a conductor pattern which insulates the closed circuit of circuit patterns 5 formed on the circuit board 4 and conducts the opened circuit of the patterns 5 is formed. At the time of evaluating the joined state of the electronic component to the circuit board 4, the chip 1 is formed into an evaluating tool 53 by mounting the chip 1 on the surface of the circuit board 4 instead of the electronic component, in a state which is equal to the mounted state of the component and the joined state is evaluated by measuring the resistance value between the circuit patterns 5.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004326064-A (JP)
Title: Picture display device and slide holder
Inventor: NOSAKA TOSHIYUKI
IPC: G03B31/04
Filed: 2003-04-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a slide system capable of recognizing a film number and controlling an external apparatus such as voice output in accordance with the recognized result.  <P>SOLUTION: The picture display device comprises a light source unit, a film arrangement unit in which a film arrangement part is arranged on a position where light emitted from the light source crosses, a photographing lens for projecting light transmitted through the film, a film discrimination means arranged in the film arrangement unit, and a processing means for performing processing corresponding to the discrimination number discriminated by the film discrimination means. Interactive operation can be attained by the picture display device.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004360511-A (JP)
Title: Emission control device
Inventor: FURUKAWA TAKATOSHI
IPC: F01N3/01
Filed: 2003-06-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide an emission control device with high removing efficiency of particulates and eased maintenance.  <P>SOLUTION: In this emission control device, tubular outside electrodes 7 for collecting the particulates are provided with collection cells 2 in which inside electrodes 6 are inserted. Outer faces of the inside electrodes 6 are covered with dielectric material 5. The collecting cells 2 are disposed inside a tubular housing 1. One end part of the housing is provided with an exhaust distributing means 3 for guiding exhaust G to the inside of the outside electrode of each collecting cell 2. The other end part of the housing 1 is provided with an exhaust aggregation means 4 communicating to voids 14 between the inside of the housing and outer faces of the outside electrodes 7 of each of the collecting cells 2. A discharge control unit 15 is connected to the inside electrodes 6 and the outside electrodes 7.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004359998-A (JP)
Title: Method for manufacturing metallic member having compound-particle-dispersed alloy layer, and slide member
Inventor: CHIKAZAKI MITSUO
IPC: B23K101/04
Filed: 2003-06-04
Abstract: <P>PROBLEM TO BE SOLVED: To manufacture a metallic member having an alloy layer of dispersing hard compound particles therein, on the surface, without using a jointing method such as welding.  <P>SOLUTION: This method for manufacturing the metallic member comprises sealing the powder of the alloy containing a compound in a tubular container, and hot-isostatic-forming and/or hot-extruding the container in the state, to thereby divide the compound and metallically combine powders with each other. In the above step, the metallic member may be inserted into the container, or alternatively when the metallic member is tubular, the container is formed of the material of the metallic member. Then, the container is machined into the metallic member having the alloy layer with the hard compound particles dispersed therein, on the surface. The metallic member having the alloy layer with the hard compound particles dispersed therein, on the surface, is manufactured without using the jointing method such as welding.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004360267-A (JP)
Title: Long-distance jacking method
Inventor: KAWAHARA KOJI
IPC: F16L1/024
Filed: 2003-06-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a long-distance jacking method which can prevent a collapse of natural ground even in the case of weak ground, and which enables excavation to be smoothly performed by a small jacking force even in the case of a sharply curved line.  <P>SOLUTION: In this long-distance jacking method, a jacking pipe 11 is slidably fitted into a guide pipe 10; the guide pipe 10 and the jacking pipe 11 are connected to the rear of an excavator M with an excavation diameter almost equal to a diameter of the guide pipe 10; a back end of the guide pipe 10 and that of the jacking pipe 11 are concurrently pushed so that the pipe can be jacked while the ground G is excavated by means of the excavator M; another guide pipe 10 and another jacking pipe 11 are connected to the back end of the guide pipe 10 and that of the jacking pipe 11 one after another; the excavation is performed up to a target position while only the jacking pipe 11 is slid in the guide pipe 10; a back-filling material or a lubricant is injected and infilled between the ground G and the guide pipe 10 inserted into the earth; and the pipe is jacked with the stabilization of the ground.  <P>COPYRIGHT: (C)2005,JPO&NCIPI