Patent DE-102006012960-A1 (DE)
Title: Device for embossing foil substrates for production of components in the areas of micro fluidics, biotechnology, medicine and chemistry, comprises an embossing roll, heat conducting bodies and homogeneous temperable surfaces
Inventor: VELTEN THOMAS
IPC: B29C59/04
Filed: 2006-03-21
Abstract: The device for embossing polymer foil substrates (1) for production of components in the areas of micro fluidics, biotechnology, medicine and chemistry, comprises an embossing roll (3), heat conducting bodies (9, 10) and homogeneous temperable surfaces (11). The foil substrates exhibit the embossing roll and a unit for supplying the foil substrate to the embossing roll. The heat conducting material of the body is metal and/or graphite. Distance of overlapping surfaces of both bodies is five times less than the foil substrate thickness. The device for embossing polymer foil substrates (1) for production of components in the areas of micro fluidics, biotechnology, medicine and chemistry, comprises an embossing roll (3), heat conducting bodies (9, 10) and homogeneous temperable surfaces (11). The foil substrates exhibit the embossing roll and a unit for supplying the foil substrate to the embossing roll. The heat conducting material of the body is metal and/or graphite. Distance of overlapping surfaces of both bodies is five times less than the foil substrate thickness. An embossing or overlapping region of the foil substrate is conductible between the surfaces by the supplying unit. The heat conducting bodies in conveying direction of the foil substrates are directly arranged before the embossing roll. Each of the heat conducting bodies exhibits a heat capacity, which is larger than the heat capacity of the overlapping surface of the embedded foil substrate. The temperable surfaces of both bodies are spaced apart from each other and overlap within a coherent lap region. The overlapping region exhibits a shape and size, which correspond to the shape and size of the embossing regions of the embossing die or the embossing regions of the embossing roll. The temperable surfaces are rectangular and exhibit a counter contour three-dimensional surface contour. The bodies exhibit a metal plate shape with a width, a length and a thickness. The plate thickness is more than 5 mm. A first overlapping surface corresponds to a part of a cylinder outer cover inner surface of a first cylinder with a cylinder diameter D1. A second overlapping surface corresponds to a part of a cylinder cover inner surface of a second cylinder with a cylinder diameter D2. The diameter D1 is less than the diameter D2. The device is intended a negative pressure system connected with one of the body and the foil substrate is suctionable at the surface of this body by means of negative pressure. Means is provided for the adjustment of predefinable distances between the overlapping surfaces of the body. A tempering system provided with the surfaces is formed in such a way that the surfaces are temperable at 0-250[deg]C with an accuracy of +-0.1[deg]K respectively. The tempering system is formed in such a way that one of the surfaces is temperable at temperature T1 greater than Tg and the other surfaces at temperature T2 less than Tg. The thermal energy of the bodies is supplyable in the form infrared radiation by means of inductive heating, electrical resistive heating or heat exchanger. The foil substrate is a foil laminate composed of two single foils, which exhibit different glass transitions. The device is operated cyclically and/or continuously.