baber/WOPTO huggingface dataset:
Patent JP-S5890547-A (JP)
Inventor: YOSE AKOSUTA MIRA
IPC: A61P43/00
Filed: 1982-11-08
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-2001023872-A (JP)
Title: Semiconductor substrate processing apparatus
Inventor: ONUMA MITSURU
IPC: H01L21/302
Filed: 1999-07-09
Abstract: PROBLEM TO BE SOLVED: To allow an operator to quickly and easily take care of an abnormality even when the abnormality occurs by allowing the operator to visibly check the internal conditions of an apparatus easily, quickly and reliably. SOLUTION: The semiconductor substrate processing apparatus includes a processing chamber 101, a transfer chamber 104, a cooling chamber 107, a load lock chamber 109, an unload lock chamber 110, a transfer machine 113, and a load port section 114. Transparent windows 106, 108, 111 and 112 are provided on top of the chambers 104, 107, 109 and 110, respectively, thereby allowing a maintenance operator to visibly check the internal conditions of the chambers. Further, lids 102 and 105 are provided on the chambers 101 and 104, whereby cleaning, maintenance and the like can be performed therethrough. Still further, the external surface of each of the above components constituting the apparatus is colored in different colors, so that the maintenance operator or the like can identify each component at a glance.
Patent JP-2001024021-A (JP)
Title: Semiconductor device and manufacturing method
Inventor: YAMAGUCHI YOSHIHIDE
IPC: H01L21/3205
Filed: 1999-07-09
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device at a low cost and its manufacturing method for reducing stress caused by the difference in coefficient of thermal expansion with a mounting substrate surely. SOLUTION: A semiconductor device includes an electrode part 2 on a semiconductor element 1, a wiring layer 6 connected to the electrode part 2 via an insulating layer 4, and a package electrode 7 formed on the wiring layer 6. A conductive member 8 made of alloy with martensitic transformation is placed party in a conductive path from the wiring layer 6 to the package electrode 7 to absorb stress caused in the conductive path. In this way, a semiconductor device with reliability in connection, superior electrical characteristics and suitability in high-density mounting can be obtained at a low cost. As a result, the semiconductor device can be connected with a wiring board, using solder to complete high-performance electronic apparatus.
Patent JP-2001024390-A (JP)
Title: Electronic component supply equipment and method and electronic component mounting machine
Inventor: KITAMURA NAOYUKI
IPC: H05K13/02
Filed: 1999-07-09
Abstract: PROBLEM TO BE SOLVED: To provide electronic component supply equipment, an electronic component supply method, and an electronic component mounting machine where no electronic component are fitted to a material, where components are to be fitted in a wrong mounting posture. SOLUTION: A detector 141 for detecting a fitting direction instruction part 151 of electronic components, when fitting electronic components 11 where a fitting direction becomes a problem when the electronic components are to be fitted to a printed-circuit board is provided, thus determining whether the position direction of the fitting direction instruction part of electronic component is in a proper direction, before fitting to the substrate, thus preventing the occurrence of the problems where a number of materials to be fitted with electronic components in wrong packaging attitudes are manufactured.
Patent JP-S6257636-A (JP)
Title: Reaction apparatus for high-viscosity liquid
Inventor: INOUE MASAFUMI
IPC: B01J19/20
Filed: 1985-09-06
Abstract: PURPOSE:To improve working efficiency and product accuracy and to permit easy maintenance and inspection by fixing the top end of a driving shaft which is inserted into a reaction vessel from below at the center in the bottom of said vessel to stirring vanes connected to a revolving shaft, thereby constituting a raeation apparatus for high-viscosity liquid. CONSTITUTION:A lower mounting frame 14 having the same size as the size of an upper mounting frame 10 or the like is provided to the bottom end and the top end of the driving shaft 7 is fixed to the central part thereof. The center of the upper mounting frame 10 is freely rotatably and pivotally supported by a pin 16 to a cruciform pivotal supporting frame 15 fixed to the inside upper part of a cylindrical part 2. A raw material is fed through a feed port 6 into the reaction vessel 1 and is stirred and mixed by a ribbon screw 12 and plate vanes 19 via the driving shaft 7 which is driven by a motor 9. Since the shaft 7, the revolving shaft 11 and the ribbon screw 12 are fairly lower than a liquid level 21 of a reactant, the generation of soaring matter to the revolving shaft 11 as with the conventional reaction apparatus is obviated.
Patent JP-S6089090-A (JP)
Inventor: KISHIMOTO YOSHIO
IPC: H05B3/56
Filed: 1983-10-20
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S6441280-A (JP)
Title: Thin film electrode and its forming method
Inventor: KISHI FUMIO
IPC: H01L39/24
Filed: 1987-08-07
Abstract: PURPOSE:To realize an electrode wherein the adhesion to superconductor is large and the contact resistance is small, by constituting the electrode material for metal oxide superconductor by using a metal contained in the superconductor or its alloy. CONSTITUTION:Thin films 2, 3 are arranged on a metal oxide superconductor 1. The lower layer thin film electrode 2 is formed of the material containing metal component capable of forming an electrode contained in the above superconductor 1. That is, metal capable of constituting an electrode directly from the above superconductor 1, or by mixing other electrode constituting material is selected, and the film is formed by using this metal or alloy containing this metal. In the case of superconductor containing Cu, for example, Cu, Cu-Cr alloy, etc., are selected. An upper layer electrode 3 is constituted of, for example, Au, in order to facilitate the junction to a lead wire.
Patent JP-S6255925-A (JP)
Title: Forming method of thin film
Inventor: YAMASHITA HIROSHI
IPC: H01L21/203
Filed: 1985-09-05
Abstract: PURPOSE:To improve the adhesiveness of an evaporation film to a substrate by a method wherein the substrate is coated with a hexamethyldisilazane solution, baking is applied, and a thin film is formed by vapor deposition on the substrate thus treated. CONSTITUTION:A hexamethyldisilazane solution is applied on an Si substrate 1 to form a hexamethyldisilazane film 2 thereon, and baking is applied thereto. Then, a BN film 3 is formed by sputter evaporation on the substrate thus treated. The film 3 formed by the evaporation according to this process shows strong adhesiveness and causes no exfoliation.
Patent JP-S5985923-A (JP)
Title: Temperature detecting probe for high frequency heating device
Inventor: MASUBUCHI TOSHIO
IPC: G01K1/08
Filed: 1982-11-08
Abstract: PURPOSE:To use a detecting probe in a safe mode in food sanitation, by providing a freely rotatable metallic casing at the casing part at the tip of the temperature detecting probe in a dual mode, providing a flange, which is to become a stopper at the timer of insertion to a material to be cooked at the outer casing, and using metal for the part which is contacted with the material to be cooked. CONSTITUTION:A casing cap 2 of a temperature detecting probe, which has a flange part 2a, is inserted into a material to be cooked 7, which is mounted on a rotary table 8. A plug 6 is inserted into a jack part 1, which is attached to an inner wall 9 of an oven and used. When the material to be cooked 7 is rotated, the cap 2 is rotated as a unitary body together with the material to be cooked 7, but the main body of the temperature detecting probe is not rotated. A wire 5 is not twisted. A part contacting with the material to be cooked 7 is all made of metal. The casing part 1 of the temperature detecting probe is electrically contacted in a coupling manner by a metal plate spring 3, which is inserted in a part of the casing cap 2, and sparks are prevented.
Patent JP-S6256375-A (JP)
Inventor: YOSHIMURA HIRONORI
IPC: C04B35/58
Filed: 1985-09-05
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S6352837-A (JP)
Inventor: SAKUMA KAZUO
IPC: A21D13/08
Filed: 1986-08-21
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H0738611-A (JP)
Title: Time division calling channel network configuration system
Inventor: MIYAHARA KEIICHI
IPC: H04Q11/04
Filed: 1993-07-15
Abstract: PURPOSE:To obtain both the 64k base service and the broad band exchange service by providing a time division multiplex space division switch between plural input time division multiplex calling channel switches and plural output stage time division calling channel switches so as to connect them mutually. CONSTITUTION:A time division multiplex signal received by input stage time division calling channel switches 1a-1n is subjected to time slot exchange by a time division calling channel and sent to output path dependent calling channel multiplexers 3a-3n. Then the multiplexers 3a-3n apply m-channel multiplex of user communication information of 64kbit/sec and 64kXn bit/sec from the switches 1a-1n by a time division switch at an output stage side based on a signal commanding a connection destination time division calling channel for each time slot sent from the space division switch controller 2 so that the time slot sent to a specific connection destination time division calling channel is consecutive m-time slots. Then the multiplexed information is outputted through a cell switch 5 via cell composing devices 4a-4n.
Patent JP-H0642578-A (JP)
Title: Semi-active vibration proof device, semi-active damper device, semi-active stiffness mechanism device, reduced projection exposure device and its semi-active damping method
Inventor: KURIHARA MASAKI
IPC: G02B27/18
Filed: 1992-07-23
Abstract: PURPOSE:To provide an inexpensive semi-active damping device which enables damping by providing a semi-active damper device or a semi-active stiffness mechanism device on a damping device consisting of a structure subject to the step input in the horizontal direction and the floor vibration and a damping table, apart from a passive damping device. CONSTITUTION:When the X-Y stage 4 is driven by its driving device, a reaction force is exerted on a level block 3 supporting the driving device, and a damping device 2 is deformed thereby. If an electro-magnet 14 is actuated immediately before the X-Y stage 4 is driven, a movable member 16 and the level block 3 are connected to each other, and a relative motion is generated between the movable member 16 and a container member 17, and the viscous resistance of the viscous fluid 18 to be generated when the viscous fluid 18 is removed performs the damping effect as a damper. In particular, when the higher the viscosity of the viscous fluid 18 becomes, and the narrower the space between the movable member 16 and the container member 17 becomes, the larger damping force is obtained, and if required, it is possible to provide the overdamping.
Patent JP-S6439436-A (JP)
Title: Beveling building unit
Inventor: ONISHI KATSUNORI
IPC: E04B1/348
Filed: 1987-08-06
Abstract: PURPOSE: To obtain a chamfered building unit capable of utilizing a space under the roof effectively by setting up a middle long column between a long column and short column set up at a floor, and constructing an inclined beam part between the upper end parts of the middle long column and short column before forming an inclined roof part. CONSTITUTION: An inclined roof 36B is formed such that a long column 32 and short column 33 are set up at the opposite side peripheries of a floor 31, and a middle long column 34 is set up intermediate both side peripheries of the floor 31, and further an incline beam part 35B is constructed over between the upper end parts of the middle long column 34 and short column 33. By the structure a chamfered building unit 30 can be obtained easily, which enables the use of a space under the roof of the inclined roof everywhere, and the strength of a unit can be improved by the existence of the middle long column 34.
Patent JP-H0641173-A (JP)
Title: Production of 4-deoxy-d-mannose
Inventor: MATSUMOTO KATSUYA
IPC: C07H1/00
Filed: 1992-07-23
Abstract: PURPOSE:To provide a method to efficiently obtain the compound useful for medicines, agricultural chemicals, etc., in a high yield by reacting anhydrodideoxythreohexoenopyranose under specific conditions. CONSTITUTION:An iodine group at 4-position of formula II (R<1> and R<2> are each H or an acyl) obtained by reacting 1,6-anhydro-3,4-dideoxy-beta-D-threo-hexo-3- enopyranose of formula I with a compound containing an iodine group and an acyloxy ion is reductively eliminated to afford a compound of formula III. 1,6-Anhydro bond and acyl group of this compound of formula III are hydrolyzed with an acid to provide the compound of formula IV.
Patent JP-H0483397-A (JP)
Title: Electronic component mounting device
Inventor: SAKAGUCHI HIROYUKI
IPC: B23P21/00
Filed: 1990-07-25
Abstract: PURPOSE:To transfer and place an electronic component on a board at a high speed by providing a light diffuser for diffusing and reflecting an illumination light emitted from a light source toward the component sucked to a nozzle between an electronic component supply unit and the positioning unit of the board. CONSTITUTION:When passing over a light diffuser 16, a light source 15 is lit. Then, since its illumination light is diffused and reflected upward by the diffuser 16, a silhouette of an electronic component P sucked to a nozzle 14 is observed by a camera 13 as a still image, and positional deviations of XYtheta of the component P are detected. Even when the component P of a part feeder 6 is transferred to and placed on a board 2, a light is reflected by a light diffuser 17, and the component P sucked to the nozzle 14 is observed by the camera 13. Thus, since the positional deviation of the component P can be detected on the way of transferring the component P to the board 2, a loss time for observing can be eliminated to mount the component P on the board 2 at a high speed.
Patent JP-2001018364-A (JP)
Title: Design color tone monitoring apparatus and print color tone controller
Inventor: HIROTA MORIKAZU
IPC: G01J3/46
Filed: 1999-07-12
Abstract: PROBLEM TO BE SOLVED: To eliminate printing of a color patch and to continuously monitor a design color tone change by calculating chromaticity and a spectral density based on spectral reflectance corresponding to a desired design area, storing them as reference values, and setting an allowable range based on a measured value and a color difference. SOLUTION: A spectrum measuring unit 22 is provided on a plurality of conveying rollers 18 for guiding a printed product from a cooler 10e to a folding machine 10f, and to smooth measuring errors, an aperture area is measured while overlapping a plurality of aperture area at each printing unit period. Measured results corresponding to desired design areas of all measured number are integrated, averaged at each CH, calculated as a spectral reflecting intensity, its spectral reflectance is calculated, and supplied to a color tone judging processor 28. The processor 28 calculates an Lab chromaticity and a spectral density in a wavelength indicating maximum absorption of each ink from the reflectance.  A color difference is calculated by using the Lab chromaticity, a deviation of the color tone of the printed product is detected, and a detected result is displayed together with a spectral density difference.
Patent JP-S6442064-A (JP)
Title: Magnetic recording and reproducing device
Inventor: TAKEGUCHI SATORU
IPC: G11B20/00
Filed: 1987-08-07
Abstract: PURPOSE:To enable various kinds of combinations of recording in case of consecutive time reserves by recording/reproducing television voice and independent voice among the voice programs in the same channel of satellite broadcasting, separately from each other. CONSTITUTION:When an instruction signal from the input part 33 of a system control circuit 13 is outputted via a CPU 31, input/output circuit 37, BC reception circuit 1, BS reception circuit 2, video signal selection circuit 14, and a voice signal selection circuit 20 are controlled by said instruction. For example, when a BC tuner terminal BC is selected through a first switch 38 and a Hi-Fi terminal Hi-Fi is selected through a second switch 39, a video signal and its voice signal are recorded through a video recording process part 15, recording amplifier 17, and head 18 on a tape. In a voice magnetic recording and reproducing device 12, respective PCM, Hi-Fi, and linear outputs are recorded respectively by heads 24, 29 on the tape when the BC tuner terminal BC is selected by third through fifth switches 40-42. As a result, the satellite television broadcasting can be recorded/reproduced in addition to the ground television broadcasting.
Patent JP-H0362572-A (JP)
Title: Semiconductor protecting element
Inventor: OGAWA KEIJI
IPC: H01L29/74
Filed: 1989-07-28
Abstract: PURPOSE:To enable setting a desired breakdown voltage by forming semiconductor regions so as to contain parts exposed to both main surfaces of P-N junctions in a bilateral semiconductor protecting element of five-layer structure. CONSTITUTION:A bilateral semiconductor protecting element of five-layer PNPNP type is constituted of the following; a P<-> type semiconductor substrate 1, N-type semiconductor regions 2, 4 formed by introducing N-type impurity from both main surfaces, and P<+> type semiconductor regions 3, 5 formed by selectively introducing P-type impurity into the surface parts of the regions 2, 4. In this element, P<-> type semiconductor regions 6 and 7 are formed on the first main surface of a P-N junction formed by the substrate 1 and the region 2 and on the second main surface of a P-N junction formed by the substrate 1 and the region 4, respectively. Electrodes 8 and 9 are formed on apertures of an Si oxide film 10 on the first main surface and the second main surface, respectively. In this constitution, breakdown voltage can be uniquely set by selecting the values of impurity concentration in the regions 6, 7.
Patent JP-H06155892-A (JP)
Title: Ink-jet recording paper having intense gloss
Inventor: SASAKI TAKEYOSHI
IPC: B41M5/52
Filed: 1993-07-16
Abstract: PURPOSE:To improve ink-jet recording aptitude (ink absorptivity and color- developing properties) as jet recording paper and to impart an intense gloss capable of particularly enhancing the visual image after ink-jet et recording. CONSTITUTION:In the ink-jet recording paper having an intense gloss regarding this invention, a film containing polyvinyl alcohol having a 50-90mol% saponification degree and 5-50wt.% of a crosslinking agent to the polyvinyl alcohol (converted into solid matter) is formed onto a casting-coated paper having surface glossiness of 80% or more in JISP-8142 as a support.
Patent JP-S5987888-A (JP)
Title: Semiconductor laser element
Inventor: TAKIGUCHI HARUHISA
IPC: H01S5/16
Filed: 1982-11-10
Abstract: PURPOSE:To prevent any noise from increasing and to improve the combination of semiconductor laser element of a gain waveguide mechanism with an optical system by a method wherein the thickness of active layer of a crystal layer for operating laser deposited on an internal stripe for current strangulation the width of which becomes wider near an end of a resonator and narrower inside the resonator. CONSTITUTION:A current confining layer 2 is grown in a GaAs substrate 1 to form a stripe groove by one time photoetching process. Next when a P type clad layer 23 is epitaxially grown, the surface of the layer 3 is flattened in the region with stripe width of W2 while the same surface is dented in the region with stripe width of W1 because more P-GaAlAs is needed to bury the stripe groove in the region with wider stripe width of W1. In such a constitution, the refractive index difference in the lateral direction is larger to focus a laser beam on a spot with fine diameter not exceeding 1mum near an end of a resonator while the laser beam is enlarged up to 3-4mum in the lateral direction due to smaller refractive index difference in the same direction inside the resonator.
Patent JP-H08316346-A (JP)
Title: Eprom,preparation of flash eeprom nonvolatile memory and nonvolatile memory
Inventor: FRATIN LORENZO
IPC: H01L29/10
Filed: 1995-07-12
Abstract: PROBLEM TO BE SOLVED: To provide a nonvolatile memory including cells having an N<+> type source region and a drain region surrounded by a P pocket buried in a P<-> type substrate. SOLUTION: In order to improve a cell size and to avoid deterioration of a snap-back voltage, drain and source P pockets 16 and 26 are formed in two different high-angle boron implantation steps designed to optimize implantation energy and dosage. Cells formed thereby exhibit a breakdown voltage higher than that of conventional cells.
Patent JP-H0752200-A (JP)
Title: Method for molding plastic molded piece
Inventor: OSEKO HISAAKI
IPC: B29C45/26
Filed: 1993-08-10
Abstract: PURPOSE:To provide a method for molding a plastic molded piece capable of molding a plurality of fine through holes with high precision and at low cost by stretching a plurality of wire rods having the same sectional shapes as the through holes in a mold so as to form a plurality of through holes in the molded piece. CONSTITUTION:Upper and lower molds 11 and 12 are prepared. The molds 11 and 12 comprises a plurality of wire rods 16 having outside diameter equal to inside diameter of each through hole 19, a molding face 14 for molding a cavity 13 in the inside at mold clamp, and a plurality of embedding grooves 17 which are engraved on a joint face 15 at mold clamp and embed and fix both ends of the wire rods 16 so as to stretch the wire rods 16 in the cavity 121 The upper and lower molds 11 and 12 are clamped so as to form the cavity 13 and the wire rods 16 are embedded in the embedding grooves 17 so as to stretch the wire rods 16 in the cavity 13. Thereafter, the cavity 13 is filled with a resin and cured. The upper and lower molds 11 and 12 are opened and a molded piece 18 is taken out. Then, the wire rods 16 are pulled out from the molded piece 18.
Patent JP-H0361572-A (JP)
Title: Multicolor thermal transfer printer
Inventor: SAITO KAZUMASA
IPC: B41J35/16
Filed: 1989-07-31
Abstract: PURPOSE:To obtain a multicolor thermal transfer printer capable of reducing the wastefulness of a ribbon by providing an arrangement containing a means for selecting one specified ribbon cassette from a plurality of ribbon cassettes according to a color printing instruction and performing printing. CONSTITUTION:A multicolor thermal transfer printer has a carrier 2 reciprocally movable horizontally, ribbon cassettes 1 loaded with a plurality of monochromat ic ribbons, and a printing head 3 for selecting one specified ribbon cassette from a plurality of ribbon cassettes according to a color printing instruction and performing printing, where the carrier 2 is rotated based on transfer record ing data to set a ribbon in a desired ribbon cassette 1 and a printing head 3 in parallel on the surface of a platen 4. A belt 7 is rotated by a stepping motor 6 to move the carrier 2, and only the ribbon in the set ribbon cassette 1 is taken up with line transfer being applied to paper 5. Thereafter, the carrier 2 is returned to the initial position and said ribbon cassette is replaced with the desired ribbon cassette 1 on the basis of the next transfer recording data thus performing line transfer. As a result, unused part of the color ribbon can be reduced.