baber/WOPTO huggingface dataset:
Patent TW-494499-B (TW)
Title: Formation method of metal oxide semiconductor transistor
Inventor: LIN JIAN-TING
IPC: H01L21/335
Filed: 2000-09-27
Granted: 2002-07-11
Abstract: This invention provides a formation method of metal oxide semiconductor transistor, which consists of at least: providing a gate dielectric layer on a substrate; forming a polysilicon gate electrode on the gate dielectric layer; performing a polysilicon oxidation process to form a first oxide layer on the polysilicon gate electrode and the substrate; then, forming a compensation spacer on the first oxide layer at the sidewall of the polysilicon gate electrode; using the polysilicon gate electrode and the compensation spacer as mask to perform ion implantation to form a lightly doped drain region; forming a primary spacer adjacent to the compensation spacer; and finally using the polysilicon gate electrode, the compensation spacer and the primary spacer as mask to perform ion implantation to form source/drain region.
Patent TW-471015-B (TW)
Title: Solution processing apparatus
Inventor: MATSUYAMA YUJI
IPC: G03F7/30
Filed: 2000-10-25
Granted: 2002-01-01
Abstract: A developing processing apparatus for supplying a developing solution to a wafer on which a photoresist film has been formed to thereby perform developing processing includes a wafer holding portion for horizontally holding the wafer, a linear nozzle held above the wafer holding portion for supplying the developing solution onto the wafer while moving in a predetermined horizontal direction, and a resistance bar for imparting discharge resistance to the developing solution discharged from the linear nozzle. This allows all discharge ports to discharge the developing solution uniformly, especially even when discharge pressure for the developing solution to be supplied is low in development of a scan method using a linear nozzle or a slit nozzle.
Patent TW-500698-B (TW)
Title: Apparatus and method for waste water treatment
Inventor: BABA YASUHIRO
IPC: C02F3/12
Filed: 2000-11-16
Granted: 2002-09-01
Abstract: Provided are an apparatus and a method for waste water treatment not generating excessive sludge, for which down-sized tanks are usable. The apparatus comprises an aeration tank where waste water to be treated is kept in contact with carrier particles in an aerobic condition, and a complete oxidation tank. In this, the liquid in the complete oxidation tank is filtered through a separation membrane and the resulting filtrate is discharged out of the system. The s-BOD sludge load to the complete oxidation tank is preferably at most 0.1 kg-BOD/kg-MLSS day.
Patent TW-463424-B (TW)
Title: Method for producing electrical connector
Inventor: MA HAO-YUN
IPC: H01R12/57
Filed: 2000-12-05
Granted: 2001-11-11
Abstract: The present invention relates to a method for producing an electrical connector, which comprises: 1. forming by pressing a connection belt and a row of pin terminals; 2. forming an indent on the tail of the terminals; 3. electroplating a layer of nickel on the indent region of the terminals, followed by electroplating a layer of SnPb alloy; 4. forming by injection an insulation body and housing two rows of terminals therein, the indents of the two rows of terminals facing each other; 5. outwardly bending the tail of the terminals; and 6. cutting off the connection belt at the indent, leaving a portion of the indent at the tail of the terminals. In an electrical connector made according to the present invention, after being soldered to a printed circuit board, the amount of solder covering the cut portion of the tail of the terminals is larger than half the thickness of the tail, so that the solder point has a higher reliability.
Patent TW-494228-B (TW)
Title: Apparatus for measuring unbalance of a rotor
Inventor: ROTHAMEL KARL
IPC: H02P23/00
Filed: 2001-01-05
Granted: 2002-07-11
Abstract: A kind of apparatus for measuring unbalance of a rotor includes a main shaft capable of rotating and being supported inside the machine housing, in which the rotor to be measured can be fixed; a single-phase AC motor, which drives the main shaft to a measuring rotation speed and is provided with a sing-phase winding 4 and a phase offset auxiliary winding 5; and a control apparatus 17, which is used to adjust motor current and is provided with apparatus 8, 6, 7, 20, 22, 23 such that currents of two windings 4, 5 for the motors 3, 21 are decreased when the rotation speed for measurement is reached. Consequently, the motor is made to generate a reduced output torque that is basically capable of compensating the decrease of rotation speed caused by friction and air resistance.
Patent TW-I283672-B (TW)
Title: Novel 1,3-dihydro-2H-indol-2-one derivatives, process for preparing them and pharmaceutical compositions containing them
Inventor: ROUX RICHARD
IPC: A61P1/18
Filed: 2001-01-19
Granted: 2007-07-11
Abstract: The invention relates to compounds of formula, as well as the possible salts thereof with mineral or organic acids, and the solvates and/or hydrates thereof, which have affinity for and selectivity towards the V1b receptors or towards both the V1b and V1a receptors of arginine-vasopressin. The invention also relates to the process for preparing them, to the intermediate compounds of formula (II) that are useful for preparing them, to pharmaceutical compositions containing them and to their use for the preparation of medicinal products.
Patent TW-486699-B (TW)
Title: Rotary-type electric component with a switch
Inventor: MIZOBUCHI SHINICHI
IPC: H01H3/12
Filed: 2001-02-02
Granted: 2002-05-11
Abstract: The present invention provides a kind of rotary-type electric component attached with a switch, that can be formed in a thin type and has less number of components compared with the conventional one to improve assembling property. As the example shown in figure 1, the invented rotary-type electric component with a switch is provided with an insulating base body 6 for burying the base portion 7b of the sliding plate 7. The first and the second fixed contact points 8, 9 are disposed to bury the base portion 8b and 9b at the insulating base body 6. The contact portion 7a of the sliding plate 7 is formed by exposing from the conduction pattern 4b side of the rotation body 4. The first and the second contact portions 8a, 9a of the first and the second fixed contact points 8, 9 are formed by exposing from the face that is opposite to the protruding direction of the contact portion of the sliding plate 7. In addition, the conductive and movable contact point 11 is provided and formed to be elastically pressed at the first and the second contact portion 8a, 9a of the first and the second fixed contact points 8, 9 such that the movable contact point 11 is constructed and can be contacted as well as separated from the first and the second contact portion 8a, 9a of the first and the second fixed contact points 8, 9 through the press operation of the operation shaft 2.
Patent TW-I253015-B (TW)
Title: Method allowing a desired operating system to be executed on different configurations of a base configurable processor, system for adapting operating systems to configurable microprocessors, method of porting a desired operating system to different ...
Inventor: SONGER CHRISTOPHER M
IPC: G06F9/455
Filed: 2001-05-21
Granted: 2006-04-11
Abstract: A hardware abstraction layer operations as a system architectural layer between a real-time operating system and an underlying configurable processor. The hardware abstraction layer provides an abstraction of processor-specific functionality to the operating system. In particular, it abstracts configurable processor features visible to the operating system to provide a uniform, standardized interface between the operating system and the configurable processor on which it runs. Thus, an operating system running on top of the hardware abstraction layer will work on all configurations of the processor which differ from one another only in the configuration parameters covered by the hardware abstraction layer. The hardware abstraction layer may be generated using the same information that is used to describe the features being configured in the configurable processor. Automatic generation of the HAL greatly eases use of the HAL and the configurable processor, since the user is not required to manually write the HAL or adapt an existing one based on the processor configuration parameters.
Patent TW-I228439-B (TW)
Title: Electronic equipment and semiconductor device
Inventor: SOGA TASAO
IPC: H05K3/34
Filed: 2001-03-19
Granted: 2005-03-01
Abstract: The object of the present invention is to improve drop shock resistance or impact resistance of an electronic equipment, and in particular to improve reliability of a solder joint in a semiconductor device in which an Si chip or the like being weak against a thermal impact in association with a large deformation is die-bonded or a power module in which a large stress is operated. To realize the object, the present invention comprises a circuit board, and an electronic component electrically connected to an electrode of the board. The electrode of the board is solder connected to the electrode of the component by using a lead-free solder containing Cu of 0 to 2.0 mass%; In of 0.1 to 10 mass%; and Sn of the residue.
Patent TW-552505-B (TW)
Title: Method and apparatus for secure execution using a secure memory partition
Inventor: MITTAL MILLIND
IPC: G06F21/22
Filed: 2001-03-22
Granted: 2003-09-11
Abstract: A processor capable of secure execution. The processor contains an execution unit and secure partition logic that secures a partition in memory. The processor also contains cryptographic logic coupled to the execution unit that encrypts and decrypts secure data and code.
Patent TW-522009-B (TW)
Title: Solid drug product supply device
Inventor: TAKAHASHI HIDEYUKI
IPC: A61J7/00
Filed: 2001-04-04
Granted: 2003-03-01
Abstract: The present invention provides a solid drug product supply device capable of filling tablets into a bottle container stably regardless of the mouth diameter of the bottle container and the shape of the tablet. The device has a first partition plate (27) which is slidably mounted to a chute (6) for reserving a solid preparation on the chute (6) temporarily and has a first fitting part (27A), and a second partition plate (28) which has a second fitting part (28A) slidably mounted to the chute (6) and engaged with the first fitting part (27A) in the case that the first partition plate (27) slides by a prescribed length and an opening part (28B) through which the solid drug product passes.
Patent TW-516311-B (TW)
Title: Combining method for TV wall
Inventor: WANG WEI-MIN
IPC: H04N11/00
Filed: 2001-04-09
Granted: 2003-01-01
Abstract: There is provided a combining method for TV wall, wherein the TV wall using the present method includes a plurality of digital display devices, and each digital display device has a built-in ratio processor. The method comprises: based on the location of each digital display device at the TV wall, setting margin parameters for each ratio processor; providing a primary screen data and feeding the primary screen data to the digital display devices, wherein each ratio processor captures a subsidiary screen data from the primary screen data based on the set margin parameters; and finally, making each digital display device display image based on each subsidiary screen data.
Patent TW-I220060-B (TW)
Title: Cleaning method of semiconductor wafer
Inventor: CHEN JUNG-TAI
IPC: B08B3/08
Filed: 2001-05-10
Granted: 2004-08-01
Abstract: A kind of cleaning method of semiconductor wafer is disclosed. After a wafer is cleaned by a chemical cleaning liquid in a chemical cleaning tank, the cleaned wafer is placed in a cleaning tank filled with de-ionized water. Then, a neutralizer is added into the cleaning tank to make the pH value on the surface of the wafer be close to neutral. The wafer is subsequently cleaned by de-ionized water to remove the residual chemical cleaning liquid on the surface of the wafer.
Patent TW-538273-B (TW)
Title: Liquid crystal display
Inventor: SHIBAHARA HIDEO
IPC: G02F1/1368
Filed: 2001-05-18
Granted: 2003-06-21
Abstract: A first substrate, a second substrate opposing to the first substrate, and liquid crystal provided in a space between the first substrate and second substrate are provided to an IPS mode liquid crystal display. A plurality of gate lines and a plurality of drain lines, thin film transistors, pixel electrodes, and common electrodes are formed on a transparent substrate in a first substrate. Each of the thin film transistors is provided in a vicinity of the intersection of the gate line and drain line. Each of the pixel electrodes is formed within a pixel region enclosed with an adjacent pair of the gate lines and an adjacent pair of the drain lines. Each of the common electrodes develops an electric field within each of the pixel regions between the pixel electrode and itself. The second substrate includes color layers provided for each of the pixel regions. The color layers are spaced apart from the gate lines and drain lines when seen on a plane.
Patent TW-493294-B (TW)
Title: Assembly interface structure for plug and socket
Inventor: LIOU SEN-SHIANG
IPC: H01R27/00
Filed: 2001-06-08
Granted: 2002-07-01
Abstract: An assembly interface structure for plug and socket, which is configured at the end of one communication line for providing both the plug and the socket structures, which comprises a body, a plurality of metal strips, and a socket frame; wherein, one end of the body is formed as a plug structure, and the other end is used to configure the connected communication lines and the socket frame, and a plurality of longitudinal slots for configuring with metal strips are also included on one side connecting between the two ends; a plurality of metal strips, for inserting in the corresponding slots of the body respectively as the external contacts of the communication lines; the socket frame is crossed on the body, wherein the frame is formed as a socket space therein for the connection with an external plug. The present invention further comprises a sliding mechanism, so that the socket frame can be moved up and down on the body. The assembly interface structure according to the present invention can achieve the effect for simple application and easy carrying.
Patent TW-552179-B (TW)
Title: Polishing pad and method for manufacturing the same
Inventor: TOMINAGA SHIGERU
IPC: B24B37/20
Filed: 2001-07-04
Granted: 2003-09-11
Abstract: An object of the present invention is to provide a polishing pad capable of obtaining a stable polishing performance and a method for manufacturing the same. The polishing pad according to the present invention is characterized that cut surfaces of not less than one kind of sheets are arranged spirally on the polishing surface of the polishing pad.
Patent TW-594381-B (TW)
Title: Process for patterning non-photoimagable ceramic tape
Inventor: CHOI JOHN HAETAK
IPC: G03F7/11
Filed: 2001-07-09
Granted: 2004-06-21
Abstract: The invention is directed to a process for patterning ceramic tape wherein a photoresist is applied to a ceramic tape, which enables the photoresist, after being exposed patternwise, and developed, to act as a development mask for the tape. The tape then undergoes a development stage, which ultimately removes undesired sections of tape. The tape contains polymeric binder(s) with acidic or alkaline functional pendant groups but not photosensitive ingredients. Therefore, the tape is aqueous processable but itself cannot be photoimaged. However, when this tape is used with conventional photoresists that have the development chemistry opposite from that of the tape, it allows the photoresist to be used as a development barrier layer for the tape.
Patent TW-521362-B (TW)
Title: Semiconductor manufacturing-and-inspection system, and semiconductor device
Inventor: HASHIMOTO OSAMU
IPC: G01R31/3185
Filed: 2001-07-24
Granted: 2003-02-21
Abstract: The peak of the current dissipated by semiconductor devices is dispersed and suppressed to a level below the current supply capability of a burn-in apparatus. As a result, there is obtained a semiconductor manufacturing-and-inspection apparatus which enables easy performance of a burn-in test without involvement of anomalies arising in the burn-in apparatus or limitations on the number of semiconductor devices mounted on the burn-in board. A semiconductor manufacturing-and-inspection system, which tests semiconductor devices provided in a plurality of areas on a burn-in board through use of a burn-in apparatus, includes a driver for supplying a drive signal to the semiconductor devices provided in the plurality of areas, a delay circuit which is provided for one of a plurality of drive signals output from the signal generation apparatus and delays the drive signal relative to the other drive signal; and a driver for controlling the delaying operation of the delay apparatus.
Patent TW-575587-B (TW)
Title: Method for carrying out photoinitiated reaction
Inventor: BRADLEY GRANT DR
IPC: C08F2/46
Filed: 2001-08-03
Granted: 2004-02-11
Abstract: Photoinitiated reactions especially in photopolymer technology, as well as photoinitiated colour forming reactions are achievable by applying a reactive substrate selected from a polymerisable and/or crosslinkable composition and a colour changing substance to a support, activating a latent photoinitiator applied with the reactive substance and subsequently exposing the reactive substrate with the resulting photoinitiator therein to photoreaction conditions wherein actinic radiation causes the substrate to undergo polymerisation and/or crosslinking or colour change respectively, the substrate being locally modified in its constitution as a result of its exposure to actinic radiation at at least one stage of the method, so that the resulting polymerised and/or crosslinked composition or colour changed substance corresponds in its distribution on the support to the locations of the modification of the substrate.
Patent TW-523471-B (TW)
Title: Card clip
Inventor: YOSHIDA TSUKASA
IPC: B42D1/02
Filed: 2001-08-20
Granted: 2003-03-11
Abstract: This invention relates to card clip structure allowing easy insertion of paper or card therein without limitation in paper thickness, where the paper or cards may be removed by single piece or multiple pieces. The card clip may be cheaply manufactured with a sound structure and wide applications. The card clip includes a base and a covering plate having specific configurations while the two may be assembled to form clip having an end with a matching structure and another end with a mouth allowing insertion or removal of paper. In a hollow portion of the card clip is provided with a resilient clamping tab having a joined portion and a clamping head connected by a lever. The lever is provided at an end thereof with two steps tapering and projecting towards the paper insertion end.
Patent TW-514643-B (TW)
Title: Method for preparing poly(chlorotrifluoroethylene) having a low molecular weight
Inventor: JONG SHIAN-JENG
IPC: C08F2/00
Filed: 2001-08-22
Granted: 2002-12-21
Abstract: The present invention discloses a method for preparing poly(chlorotrifluoroethylene) having a low molecular weight, including polymerizing chlorotrifluoroethylene monomers in an organic solvent of n-hexane or CH2C12 and in the presence of an organic peroxide at 25-60 DEG C and 250-500 psi to form a homopolymer of chlorotrifluoroethylene having a number average molecular weight (Mn) 263-8033. The method of the present invention has a lower reaction temperature and pressure compared to the prior art, and uses a solvent which is cheaper and non-corrosive. In the preparation of a homopolymer having Mn lower than 1100 according to the method of the present invention, the chlorine-containing solvent can be excluded, so that the method is more environment friendly.
Patent TW-I243081-B (TW)
Title: Method for cutting a non-metal substrate
Inventor: JEON BAEK-KYUN
IPC: B23K26/06
Filed: 2001-10-16
Granted: 2005-11-11
Abstract: Disclosed is a method for cutting a non-metallic substrate. A designated cutting line formed on the non-metallic substrate is cut using a thermal stress generated by rapidly heating and cooling the designated cutting line. Further, a shape and an alignment, etc., of an energy source is optimized, thereby maximizing a cutting speed of the non-metallic substrate and also precisely cutting the non-metallic substrate.
Patent TW-515023-B (TW)
Title: Seed layer monitor method
Inventor: TSAI MING-SHING
IPC: H01L21/66
Filed: 2001-10-22
Granted: 2002-12-21
Abstract: A seed layer monitor method is disclosed. On-line synchronously monitor the wafer being covered with a seed layer or not by an in-situ way before the metal electroplating step. The thickness and quality of the seed layer are inspected to see if they meet the process requirement or not, so as to avoid the failure in the following electroplating step and raise the reliability of the electroplating process. Then enhance the metal film quality and prevent the damage to the electroplating equipment. Besides, because of in-situ monitoring, the process error can be corrected right away and achieve the yield improvement purpose.
Patent TW-589267-B (TW)
Title: Bicycle handlebar and outer gripping portion thereof
Inventor: IRIE YOSHINORI
IPC: B62K23/06
Filed: 2001-10-26
Granted: 2004-06-01
Abstract: An outer gripping portion of a bicycle handlebar includes a mounting section and a bracket section. The mounting section has a first cross-sectional shape. The bracket section has a second cross-sectional shape and is releasably coupled to the mounting section to form a first gripping section. The first and second cross-sectional shapes of the mounting section and the bracket section have flush longitudinal edges that mate together to form a first annular gripping surface of the first gripping section. Preferably, the bicycle handlebar includes a pair of outer gripping portions coupled to opposite ends of a transverse portion.
Patent TW-521372-B (TW)
Title: Contactor and assembly apparatus, assembly method and manufacture method of the same, and alignment substrate
Inventor: IINO SHINJI
IPC: G01R1/06
Filed: 2001-10-31
Granted: 2003-02-21
Abstract: This invention discloses an assembly apparatus 1 having a unit contactor 1A and a base substrate 1B, which comprises: a support mechanism 3 for supporting an alignment substrate 2; a transfer mechanism 4 for transferring a plurality of unit contactors 1A with respect to the alignment substrate that is supported on the support mechanism; a second transfer mechanism 5 for transferring the base substrate; a holding mechanism 7 for holding the base substrate; an alignment mechanism 9 for aligning the alignment substrate provided with a plurality of the unit contactors with the base substrate; a contact mechanism 20 for contacting the plural unit contactors on the alignment substrate and the base substrate; and a heating mechanism 11 for heating at least one of the alignment substrate and the base substrate in order to connect electrically the plural unit contactors on the alignment substrate and the base substrate.