baber/WOPTO huggingface dataset:
Patent JP-2006035290-A (JP)
Title: Three-dimensional laser beam machine
Inventor: MIYAJIMA KEIICHIRO
IPC: B23K26/00
Filed: 2004-07-29
Abstract: <P>PROBLEM TO BE SOLVED: To facilitate the teaching of a posture by automating the vertical regulation of a nozzle in a laser beam machine of five-axis control.  <P>SOLUTION: An index (n) is initialized (S1), the nozzle is made to take initial posture (S2), and in the case the detected value by a photo detector 30 lies within an allowable range, it is determined that the vertical regulation is completed (S3, 12). In the case other than that, the nozzle is tilted to the designated angle/direction of the n-th by fixing control for a front point (S4), and, as a C axis is rotated by 360 degrees by fixing control for the front point, the transition in the intensity of reflected light is recorded (S5). In the case the maximum value lies within an allowable range, it is determined that the vertical regulation is completed (S6, 12). In the case other than that, while the A axis value is changed to ± both directions within a prescribed angle range by fixing control for the front point from the tilted state where the maximum value has been obtained, the transition in the intensity of reflective light is recorded (S8). In the case the maximum value lies within the allowable range, it is determined that the vertical regulation is completed (S9, 12). Thereafter, the treatment is repeated in the range not exceeding a limiting number N (S10, 11).  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006045900-A (JP)
Title: Building material fixing metal fitting
Inventor: SAKAMOTO KIKUO
IPC: E04F13/26
Filed: 2004-08-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a building material fixing metal fitting capable of firmly installing a building material, easily installing and removing the building material, without impairing an appearance of the building material.  <P>SOLUTION: This building material fixing metal fitting fixes the building material by a first fixing member installed on a wall surface and a second fixing member detachably installed in the first fixing member. The first fixing member has a first fixing member body for forming a storage part, a first locking part formed in the storage part and composed of an elastic material, and a first engaging part continuously arranged with the first fixing member body and engaging with one groove part formed in the building material. The second fixing member has a second fixing member body stored in the storage part, and a second engaging part continuously arranged with the second fixing member body and engaging with the other groove part formed in the building material. A recess-projection part engaging with the first locking part is formed in the second fixing member body, and regulates the movement in the separating direction of the second fixing member by engaging the first locking part with the recess-projection part.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006049567-A (JP)
Title: Semiconductor apparatus and using method of the same
Inventor: YAMAGIWA MASANORI
IPC: H01L25/18
Filed: 2004-08-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a using method of a semiconductor apparatus inhibiting the spread of cracks and the generation of peelings in a semiconductor device, a substrate and a bonding section and being capable of using the semiconductor apparatus semiparmanently.  <P>SOLUTION: In the semiconductor device 1a, IGBT elements 21 to 26 and FWD elements 31 to 36 are bonded on the surface of a metal plate directly or by using a solder material. In the semiconductor device 1a, the temperature of the first IGBT element 21 is measured by a temperature sensor 2a, and a control circuit 5 controls the gate voltage of the first IGBT element 21 so that the bonding section is held substantially for a fixed time at a constant temperature on the basis of the result of the measurement. A residual strain generated in the bonding section is removed by annealing and treating metallic material itself constituting the metal place by intentionally adjusting the temperature of the element 21.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006049682-A (JP)
Title: Semiconductor device and method for manufacturing the same
Inventor: FUKUYOSHI HIROSHI
IPC: B29C45/26
Filed: 2004-08-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device constituted of power semiconductor elements in which lead frames and a plurality of pads are arranged, bumps for electrically connecting them and a resin sealing body for carrying out one side sealing of them and a method for manufacturing the semiconductor device by simplifying a burr removing process without generating any burr by deforming the shape of the lead frame projected on the side face of the resin sealing body.  <P>SOLUTION: The lower face of each of a plurality of leads 2 is exposed from the lower face of a resin sealing body 4, one end of the lead is projected from the side face of the resin sealing body, and the lead projecting part is deformed so as to be made thinner than the other resin-sealed part, and the upper face of the lead projecting part is positioned within the same plane as the other part of the lead upper face, and the lower face of the lead projecting part is formed with a difference 7 in level from the other part of the lead lower face. The lead projecting part is held and pressurized between a lower metallic mold 6 whose peripheral part is thick and an upper metallic mold 5 so that the thin part can be formed.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006053673-A (JP)
Title: Information communication system and home server device
Inventor: TANAKA MASATO
IPC: H04N21/436
Filed: 2004-08-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide an information communication system and a home server device capable of sharing multimedia contents in real time.  <P>SOLUTION: At a mobile terminal device 101, a content information creating part 111 transmits content information to a transmission/reception control part 112 and the transmission/reception control part 112 controls transmission of the content information to the home server device 106. At the home server device 106, a control part 154 manages information about the mobile terminal device 101 to which the information is transferred, a domestic electric device or the like, and controls the transfer of the content information. At the mobile terminal device 101 to which the information is transferred, a reproducing part 116 reproduces the content information transferred.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006057719-A (JP)
Title: Nozzle flapper valve
Inventor: SASAKI KATSUMI
IPC: F15B5/00
Filed: 2004-08-19
Abstract: <P>PROBLEM TO BE SOLVED: To suppress hysteresis of a nozzle flapper valve.  <P>SOLUTION: This nozzle flapper valve 10 is provided with a linear motor 14, a flapper 22 moving in an integrated manner with the linear motor 14, radial springs 24, 26 for supporting the linear motor 14 and the flapper 22, a nozzle 32 directing an ejection opening to the flapper 22, and a restriction device 100 in a gas flow passage for restricting supply pressure Ps from a gas supply source and supplying the pressure to the nozzle 32 and a load, in a case body 12 having an airtight structure. The linear motor 14 has a magnet 16 fixed to the case body 12, a traveling body 18, and a coil 20 attached to the traveling body 18. The coil 20 is connected with a control part through a connection terminal 30 by a signal line 28.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006055940-A (JP)
Title: Multi-blanking die
Inventor: AMADA MASAE
IPC: B26F1/00
Filed: 2004-08-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a multi-blanking die which copes with the distortion of a cardboard, and precisely and simultaneously carries out the blanking of a large number of cards more than those of conventional cases.  <P>SOLUTION: The multi-blanking die is composed of a punch (A) and a die (a). <1> The punch (A) has, on a punch holder (B), a fixed punch block (C) having a plurality of punch members (C2) and a sliding punch block (D) having a plurality of punch members (D2). <2> The die (a) has, on a die holder (b), a fixed die block (c) which has a plurality of die holes (c2) having the same shape and size as those of the respective punch member (C2) and is correspondingly fitted to the fixed punch block (C), and a sliding die block (d) which has a plurality of die holes (d2) having the same shape and size as those of the respective punch members (D2) and is correspondingly fitted to the sliding punch block (D).  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006060133-A (JP)
Title: Semiconductor device
Inventor: MINAMI TOSHIFUMI
IPC: H01L29/788
Filed: 2004-08-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device that reduces impact due to light proximity effects and easily enables wiring including pitch conversion in NAND flash memories.  <P>SOLUTION: For example, when a flash memory 10 comprises a memory cell array 11 and a row decoder circuit 13 for controlling this cell array 11, two wires 22a and 22b, which are present at the memory cell array 11 and the row decoder circuit 13 and have different wiring pitches, are connected by a wire 22c drawn aslant with an angle of 30° at the space between the wire 22a and the wire 22b, because its wiring incidence angle P' with respect to the wiring 22a is determined to be 30°. In this way, a layer of wires 22, connecting two wires 22a and 22b via a wiring 22c drawn aslant with an angle of 30°, is formed between the memory cell array 11 and the row decoder circuit 13.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006065631-A (JP)
Title: Communication control system
Inventor: KIRISEKO YOSHIE
IPC: H04L12/46
Filed: 2004-08-27
Abstract: <P>PROBLEM TO BE SOLVED: To realize a communication control system capable of eliminating the necessity of specific hardware and software for duplication, reducing development cost/timewise load and quickly switching control right.  <P>SOLUTION: In the communication control system provided with a control side sub-system gateway and a stand-by side sub-system gateway which can communicate with an operation monitoring apparatus and communicate with a common sub-system through a sub-system communication network, the stand-by side sub-system gateway is inhibited to write output dada in the sub-system.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005306709-A (JP)
Title: METHOD OF MANUFACTURING GaN CRYSTAL AND GaN CRYSTAL SUBSTRATE, GaN CRYSTAL AND GaN CRYSTAL SUBSTRATE OBTAINED BY THE METHOD, AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
Inventor: KITAOKA YASUO
IPC: C30B9/10
Filed: 2004-08-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a GaN crystal and a GaN crystal substrate, by which the high quality GaN crystal and GaN crystal substrate can be manufactured under mild conditions of low pressure and low temperature.  <P>SOLUTION: In the method of manufacturing the GaN crystal, comprising forming the GaN crystal by reacting gallium and nitrogen in a mixed melt of gallium and sodium under a gas atmosphere containing nitrogen, the reaction of the gallium and the nitrogen is performed under a pressurizing condition that exceeds atmospheric pressure, and the pressure P1 (atm (×1.013×10<SP>5</SP>Pa)) of the pressurizing condition is set so as to satisfy the condition expressed by following conditional expression (I): P≤P1<(P+45) (I), wherein, P (atm (×1.013×10<SP>5</SP>Pa)) denotes the minimum pressure required for generating the GaN crystal at a temperature T°C of the mixed melt.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006065678-A (JP)
Title: Data conversion apparatus and its method
Inventor: NAKAYAMA TADAYOSHI
IPC: H04N19/60
Filed: 2004-08-27
Abstract: <P>PROBLEM TO BE SOLVED: To realize 16-point lossless Hadamard transform only by one rounding processing.  <P>SOLUTION: The data conversion apparatus comprises a linear transformation process for obtaining sixteen linear Hadamard transform coefficients by multiplying sixteen data by an Hadamard transform matrix, an offset process for classifying the sixteen linear Hadamard transform coefficients into four groups so that each group becomes the odd number of coefficients and adding a prescribed offset value to each group and an integer formation process capable of obtaining lossless Hadamard transform coefficients by rounding all numbers after a decimal point after adding the offset value.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005338747-A (JP)
Title: Electrostatic movable micro mirror chip
Inventor: CHEN BING-RU
IPC: G02B26/00
Filed: 2004-08-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electrostatic movable micro mirror chip including an upper mirror plate and a lower electrode plate which are positioned and joined together via fitting solder and positioning grooves.  <P>SOLUTION: The optical quality of the mirror chip is improved by using a low-temperature soldering. The positioning and the joining method of the present invention are very simple, and the fabrication time and cost are remarkably reduced. The mirror in the mirror chip is plated with metallic coating on both sides to thereby balance the stress and improve its flatness.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006068201-A (JP)
Title: Comb vibration preventing structure for hair cutter
Inventor: YAMAGUCHI TAKASHI
IPC: B26B19/20
Filed: 2004-09-01
Abstract: <P>PROBLEM TO BE SOLVED: To provide a comb vibration preventing structure for a hair cutter reducing the generation of fluttering sound by preventing the vibration of a cutting height adjusting comb, having favorable operability, and facilitating a quality management.  <P>SOLUTION: This hair cutter 1 adjusts the cutting height by vertically slidably moving the cutting height adjusting comb 3 to be fitted to the upper part of a cutter body 4, and is provided with a wire spring (a resilient member) 10 thrustingly energizing the both insides 3a and 4b of the cutting height adjusting comb 3 in the both side outward directions P.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006073405-A (JP)
Title: Heat element for thermal relay
Inventor: NAKANO MASAYOSHI
IPC: H01H61/01
Filed: 2004-09-03
Abstract: <P>PROBLEM TO BE SOLVED: To secure stable curvature operating characteristic, to reduce consumed power and to reduce heat interference between phases by uniformly winding heater wire to bimetal without any deviation in winding pitch by applying a simple processing to the bimetal.  <P>SOLUTION: A heat element corresponds to each phase of the main circuit of a thermal relay which is linked to each contact point mechanism through a shifter. The heat element 2 consists of the bimetal 6 with an operating end confronting the shifter and connected to the main circuit by having another end fixed to a terminal 10, and the heater wire 8 which is serially connected with the bimetal by being wound around the periphery surface of the bimetal. Indented grooves 6b for alignment retaining the heater wire 8 to a specified winding position are formed on the right and left side edges of the bimetal according to the winding pitch p of the heater wire. Furthermore, the periphery surfaces of the bimetal and the heater wire are covered by a heat resistant thermal insulator 11 in an assembled state with the heater wire wound to the bimetal.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006073889-A (JP)
Title: Composition for forming insulating film, insulating film and method of forming it
Inventor: AKIYAMA MASAHIRO
IPC: H01L21/312
Filed: 2004-09-03
Abstract: <P>PROBLEM TO BE SOLVED: To provide a composition for forming a film suitably used in a semiconductor element etc. and to provide an insulating film and a method of forming it.  <P>SOLUTION: The composition for forming the insulating film contains (A) a polyorganosiloxane compound having the MFI structure of a zeolite in which a nitrogen-containing compound exists in a hole formed of 10 member rings of a siloxane for constituting the MFI structure, (B) a compound obtained by hydrolyzing and condensing at least one type of silane compound selected from a compound represented by the following general formula (1), a compound represented by the following general formula (2) and a compound represented by the following general formula (3), and (C) an organic solvent. Si(OR)<SB>4</SB>... (1), R<SP>1</SP><SB>a</SB>Si(OR<SP>2</SP>)<SB>4-a</SB>... (2), R<SP>3</SP><SB>b</SB>(R<SP>4</SP>O)<SB>3-b</SB>Si-(R<SP>7</SP>)d-Si(OR<SP>5</SP>)<SB>3-c</SB>R<SP>6</SP><SB>c</SB>...(3).  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006070225-A (JP)
Title: Method for manufacturing fiber reinforced resin composition
Inventor: YANO KIMINORI
IPC: C08L23/00
Filed: 2004-09-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a fiber reinforced resin composition (a fiber reinforced resin pellet) with a good molding appearance and suitable for mass production.  <P>SOLUTION: This method for manufacturing the fiber reinforced resin composition comprises steps of feeding a plurality of fiber bundles 1 into an impregnating bath 10, forcing a melted thermoplastic resin to flow in the impregnating bath 10 via a plurality of resin inlets 4 such that the resin inflow becomes approximately same amount at bilateral positions for a travelling direction of the fiber bundle 1, contacting the melted thermoplastic resin to the fiber bundle 1 to impregnate the resin, and withdrawing the melted thermoplastic resin-impregnating fiber bundle 1 from the impregnating bath 10.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006077347-A (JP)
Title: Sock
Inventor: MUKAI MICHIRO
IPC: A41B11/00
Filed: 2004-09-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide a sock having patterns even on its toe part in view of the fact that footwear such as sandals or mules makes the toe part of a wearer visible from outside and therefore such a sock as to have patterns even on its toe part is desired, and produced through knitting with a hosiery knitting machine.  <P>SOLUTION: The sock is formed as follows: knitting the toe part through decreasing/increasing stitches with a central focus on an ordinary gore line; and decreasing the number of stitches upper than the gore line so as to make the toe part invisible from the instep side when worn.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006075421-A (JP)
Title: Multi-slice x-ray ct apparatus
Inventor: HASHIMOTO TOMOKI
IPC: A61B6/03
Filed: 2004-09-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide an X-ray CT apparatus capable of smoothly executing the reconstruction computing process of the X-ray CT apparatus with a large number of slices.  <P>SOLUTION: The multi-slice X-ray CT apparatus comprises an X-ray source, a multi-row detector, a rotary board rotatable with the X-ray source and the multi-row detector mounted on the board, and an image processing device for processing the measurement data obtained by the multi-row detector and imaging the data. The image processing device comprises a reverse projection processing means for reconstructing the image of a desired section based on the measurement data of a plurality of slices, a slice range computing means for computing the minimum necessary slicing range for reconstructing the section based on the relative positional relation between the position of at least the X-ray source and the multi-row detector in the direction of the body axis and the position of the reconstructed section in the direction of the body axis, and a data obtaining means for taking in the measurement data in the slicing range computed by the slice range computing means among the measurement data of the plurality of slices obtained from the multi-row detector into the reverse projection processing means whenever one image is reconstructed.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006082296-A (JP)
Title: Precoated metal sheet excellent in corrosion resistance
Inventor: UEDA KOHEI
IPC: C09D7/12
Filed: 2004-09-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a precoated metal sheet excellent in long-term corrosion resistance in a corrosive environment high in wet ratio even if hexavalent chromium is not contained and also excellent in humidity resistance.  <P>SOLUTION: In the precoated metal sheet wherein a rustproof coating film is provided on both sides or one side of a metal sheet, the rustproof coating film at least on one side of the metal sheet contains Si, P and Mg as coating film components but contains no Cr. A semi-columnar protruded bead mold with a radius of 4 mm is arranged on the coating film surface having the rustproof coating film at least on one side of the precoated metal sheet while a flat mold is arranged on the other side of the precoated metal sheet and, when the precoated metal sheet is drawn out in the direction right-angled to the axis of the semi-column in a state that the mold is pressed to the precoated metal sheet, pressing linear pressure (the pressure of the leading end of a semi-columnar protruded bead) not peeling the coating film surface having the rustproof coating film is 20 kg/mm or above.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006083568-A (JP)
Title: Direct-sticking construction method of electric floor heating structure, and wiring tool used for the same
Inventor: MIWA KAZUHIRO
IPC: F24D13/02
Filed: 2004-09-15
Abstract: <P>PROBLEM TO BE SOLVED: To easily and inexpensively carry out electric floor heating construction by direct sticking to a concrete slab (or as post-construction on the underfloor ground of an existing house in reforming or the like).  <P>SOLUTION: A wiring kit 30 equipped with a power line 31 and a connector 32 connected to a connector 4a of a conventionally used heater panel A is used, and a wiring tool for ensuring positioning of the wiring kit 30 on the concrete slab is used. The wiring kit 30 is wired in a predetermined position on the concrete slab while holding the power line 31 or the like in the wiring tool, and floor panels for wiring formed with recessed grooves in the back faces are laid all over thereon.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006082177-A (JP)
Title: Amorphous carbon covering tool and covering method for amorphous carbon coating
Inventor: ISHIKAWA TAKASHI
IPC: C23C14/06
Filed: 2004-09-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide an amorphous carbon covering tool which has a low coefficient of friction, high hardness and suitable toughness and an effect of restraining crack development while maintaining effective adhesion reduction and to provide a covering method for amorphous carbon coatings.  <P>SOLUTION: This tool is an amorphous carbon covering tool covered with the amorphous carbon coating. The amorphous carbon coating has 0.30 or more and less than 0.42 in π bonding/σ bonding which is a strength ratio of π bonding to σ bonding.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2006081468-A (JP)
Title: Apparatus and method for internalizing cell in three-dimensional porous substrate
Inventor: FUKUCHI TAKESHI
IPC: C12M3/06
Filed: 2004-09-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for efficiently inoculating cells to the inside of a three-dimensional porous substrate.  <P>SOLUTION: The apparatus includes an airtight chamber with one or more openings and a filter; wherein the filter covers the opening(s) so that the three-dimensional porous substrate can be charged on the filter, where a fluid is flowable via the filter, and when the three-dimensional porous substrate is placed on the filter, the filter is flexible enough to be in firm contact with the substrate. In the airtight chamber, there is contained a means capable of applying negative pressure compared with the ambience, wherein a negative pressure is applied into the chamber by the above means, the negative pressure thus being applied via the filter to the inside of the substrate, thereby cells to be charged into the substrate can be internalized in the substrate.  <P>COPYRIGHT: (C)2006,JPO&NCIPI