baber/WOPTO huggingface dataset:
Patent TW-429560-B (TW)
Title: Heatspreader for a flip chip device, and method for connecting the heatspreader
Inventor: LISCHNER DAVID
IPC: H01L23/36
Filed: 1999-11-26
Granted: 2001-04-11
Abstract: A circuit board assembly includes an integrated circuit package. A first substrate has first and second surfaces. Each surface of the first substrate has a plurality of terminal pads. An integrated circuit device has first and second faces. The first face has a plurality of electrical interconnections to the terminal pads in the first surface of the first substrate. A heatspreader plate has a plurality of legs. For example, the heatspreader may be shaped like a table with four legs. The heatspreader may be formed of copper. The second face of the integrated circuit device is connected to the heatspreader plate by a first thermal interface material. Each of the plurality of legs is connected to the first surface of the first substrate by a second thermal interface material. The first and second thermal interface materials may both be, for example, a conductive silver-filled epoxy. The heatspreader provides an open package that is easily cleaned and drained. A second substrate (which may be a motherboard, system board, or other printed circuit board) has a plurality of terminal pads. The terminal pads of the second substrate are connected to the terminal pads of the second surface of the first substrate. In an alternative (direct chip attach) configuration, the flip chip device and the heatspreader may be directly connected to a printed circuit board, which may be a motherboard or other system board.
Patent TW-447117-B (TW)
Title: Metal oxide semiconductor capacitor utilizing dummy lithographic patterns
Inventor: HSU LOUIS L
IPC: H01L29/94
Filed: 1999-12-23
Granted: 2001-07-21
Abstract: A semiconductor structure (and method for manufacturing the same) comprises an active array of first elements having a first manufacturing precision, a peripheral region surrounding the active array, the peripheral region including second elements having a second manufacturing precision less than the first manufacturing precision, wherein the second elements are isolated from the active array and comprise passive devices for improving operations of the active array.
Patent TW-478282-B (TW)
Title: Programmable incremental A/D converter for digital camera and image processing
Inventor: AFGHAHI MORTEZA
IPC: H04N19/593
Filed: 2000-01-14
Granted: 2002-03-01
Abstract: A method is provided having the steps of receiving a first pixel signal; generating a first set of bits representative of the first pixel signal; receiving a second pixel signal; and, generating a second set of bits representative of a difference between the first pixel signal and the second pixel signal. An apparatus and system for performing the above method is also provided.
Patent TW-461203-B (TW)
Title: A wireless local area network (LAN) and a method of operating the LAN
Inventor: BAKER MATTHEW PETER JOHN
IPC: H04L12/28
Filed: 2000-01-12
Granted: 2001-10-21
Abstract: A wireless local area network (LAN) comprises a primary station (PS) having a radio transceiving means and a plurality of secondary stations (SS) each secondary station having radio transceiving means. The primary station operates in accordance with a time division protocol comprising a plurality of concatenated frames. A predetermined number of the concatenated frames comprise a superframe which further includes a time slot (HiRBS). In response to the transmission of a system wide clock cycle synchronisation signal the primary station initiates the transmission of a superframe and a secondary station (HN) wishing to join the LAN but unable to communicate directly with the primary station transmits a signal burst in the time slot for reception by a secondary station (FN) which is in range of the primary station, the secondary station (FN) acting as a relay station for the out-of-range secondary station (HN) during its registration with the LAN. The time slot (HiRBS) may be located in front of the first frame or within the first frame of the superframe.
Patent TW-516986-B (TW)
Title: Attachment structure for brake-equipped cylinder
Inventor: NUMATA MASAYUKI
IPC: F15B15/26
Filed: 2000-02-15
Granted: 2003-01-11
Abstract: Disclosed is an attachment structure for a brake-equipped cylinder, comprising a through-hole-equipped bolt (64a to 64d) formed with a through-hole (66) penetrating therethrough in an axial direction, for integrally joining a main cylinder body (16) and a brake section (22) by being screwed into an attachment hole (62a to 62d) penetrating through a cylinder tube (14) and a lock body (20); and an attachment bolt (68a to 68d) for fixing the main cylinder body (16) and the brake section (22) which are integrally joined to one another, to a wall surface (82) by being inserted through the through-hole (66).
Patent TW-444221-B (TW)
Title: Trip unit settings lock out assembly
Inventor: FISCHER KENNETH M
IPC: H01H71/02
Filed: 2000-02-29
Granted: 2001-07-01
Abstract: A circuit breaker having a trip unit includes a lock out assembly positioned adjacent the trip unit for controlling access thereto. The lock out assembly includes a base member, a cover member and a slide member received therebetween. The slide member is moveable between various positions for controlling access to settings for the various operating parameters of the circuit breaker as provided by the trip unit.
Patent TW-457654-B (TW)
Title: Method for die attach
Inventor: JANG JIN-HUANG
IPC: H01L23/28
Filed: 2000-03-23
Granted: 2001-10-01
Abstract: The present invention refers to a method for attaching a die to a specific portion of an object. The object can be a lead frame, a substrate, another die, or any other one that can electrically connect to or support the die. The present invention is characterized by applying a sticky paste in a half-dried state for attaching the die to a heated portion of the object such that the defective overflow of bond in the conventional techniques can be avoided. The effect is remarkable while the present invention is adopted to attach a daughter die onto a mother die.
Patent TW-440709-B (TW)
Title: Mechanically simplified, high resolution, optical focusing and steering apparatus
Inventor: NEVIS ELIZABETH ANNE
IPC: G02B27/40
Filed: 2000-03-23
Granted: 2001-06-16
Abstract: A method and apparatus for focusing a free beam of light onto a target. The target is often very small or angle restricted. The apparatus includes a lens (20) surrounded by two parallel windows. The focusing of the free beam is achieved by tilting the first window (30) to orient the beam of light through the lens toward the target, adjusting the lens focus to focus the beam of light into a focused spot, and tilting the second window (40) to translate the focused spot across the target. The lens may also be tilted to provide a greater range of translation.
Patent TW-449795-B (TW)
Title: Method to solve the problem of bonding pad stain/discolor in color filter fabrication process
Inventor: HUANG JIA-MEI
IPC: H01L21/02
Filed: 2000-05-06
Granted: 2001-08-11
Abstract: The present invention discloses a method to solve the problem of bonding pad stain/discolor in color filter fabrication process, wherein a passivation layer is covered on the substrate which has completed the front end process and reserve the window opening procedure of bonding pad connecting to the exterior until the color filter set is formed in the color filter process. The main point of the present invention is that the top of bonding pad is covered by a passivation layer to prevent the direct contact of the bonding pad and the developer of lithography when the color filter is fabricated, so that the number of times the bonding pad metal is eroded is reduced, which solves the problem that the bonding pad is eroded by the developer for many times and has serious stain/discolor, and thereby good bondability is maintained when the bonding pad and the packing frame are connected.
Patent TW-473462-B (TW)
Title: Drop-resistant and non-brittle environmental-friendly earth product
Inventor: YU TIAN-SZ
IPC: C04B33/36
Filed: 2000-05-15
Granted: 2002-01-21
Abstract: This invention is of a drop-resistant and non-brittle environmental-friendly earth product made from 30-50% of kaolin, 20-30% of fiber, 5-7% of PVA adhesive, 1-2% of CMC, and 5-10% of SiOZAl2O3. To put all the material mentioned above together, add two and a half amount of water into it, then mix, and stir it thoroughly before putting it into gypsum mould. A certain width of the surrounding filler becomes dry and hardens for water absorption function of the gypsum mould. Then a hollow mould-made product is made after pouring out the still wet inside part filler and removing the gypsum mould. Other treatments like finishing, painting, and water-proof can be applied to the product when necessary. When solid product is expected, then to remove the gypsum mould after the whole filler becomes dry. The product will remain texture of natural earth and stone as well as providing a light, drop-resistant and non-brittle environmental-friendly product.
Patent TW-523883-B (TW)
Title: Temperature sensing integrated circuit device
Inventor: RAZALI KAMEL FAUZI
IPC: H01L23/34
Filed: 2000-06-03
Granted: 2003-03-11
Abstract: A method of making a temperature sensing integrated circuit device and a device as such are disclosed. The method involves etching away the encapsulation 14 of an 1C device 10 to expose a surface of the die 12. A junction 24 of a thermocouple 22 is then attached directly onto the surface of die 12. The cavity 18 formed by the etching step, is then refilled with a casting compound. The temperature sensing device 10 is used for calibrating the chamber temperature of a test handler in which 1C devices are soaked to reach a pre-determined temperature prior to electrical testing. The attachment of a thermocouple junction 22 directly onto a surface of the die 12 allows accurate measurement of the temperature of the die 12.
Patent TW-446927-B (TW)
Title: Entertainment system, entertainment apparatus, recording medium, and program
Inventor: KOBAYASHI TAKAKI
IPC: A63F13/47
Filed: 2000-07-01
Granted: 2001-07-21
Abstract: An entertainment system comprises story developing means (302) for allowing a player to a virtually experience a cooking operation in a kitchen of a restaurant registered with a restaurant information table from opening time to closing time of the restaurant, three-minute cooking processing means (394) for allowing a player to virtually experience a cooking operation in a kitchen of a restaurant registered with the restaurant information table for a predetermined time period (for example, three minutes), and competition processing means for allowing a player to virtually experience a cooking operation in a kitchen of a restaurant registered with the restaurant information table, while playing a match game with a plurality of other players.
Patent TW-451225-B (TW)
Title: Flexible wiring board element and wiring sheet
Inventor: TSUTSUMI AKIRA
IPC: G11B5/17
Filed: 2000-07-06
Granted: 2001-08-21
Abstract: The object of the present invention is to prevent short-circuit due to disturbance of a connection terminal and facilitate cutting from the intermediate connection terminal part, in a flexible wiring board element. To achieve the object, a wiring pattern 13 [131-134] for a circuit is covered with insulating films 11, 14. A connection terminal 17 of the wiring pattern 13 and a cutting part 18 of the wiring pattern 13 which part is distant from the connection terminal 17 are exposed on both surfaces through apertures 20a, 20b, 21a, 21b formed in the insulating films 11, 14. A narrow part for cutting is formed in a cutting part 18 facing the apertures 20b, 21b.
Patent TW-I258426-B (TW)
Title: Laminated product, process for its production and use thereof
Inventor: SAWADA YUJI
IPC: H01M50/122
Filed: 2000-08-25
Granted: 2006-07-21
Abstract: A laminated product for a film for sealing the electrolyte of secondary battery or for protecting the electrodes of secondary battery, comprising a metal layer, a surface treatment layer formed on the surface of the metal layer, a layer of a primer formed on the surface treatment layer and a layer, formed on the primer layer, of an adhesive resin constituted of a polyolefin modified by a carboxylic acid or derivative thereof, the laminated product being superior in the adhesive strength of the adhesive resin layer to the metal layer and in the fastness to a polar organic solvent and to salts without suffering from interlayer exfoliation on contact with non-aqueous electrolyte or the like, making suitable to use especially as protective film for sealing the electrolyte of secondary batteries.
Patent TW-454321-B (TW)
Title: Semiconductor package with heat dissipation structure
Inventor: LAI JENG-YUAN
IPC: H01L23/16
Filed: 2000-09-13
Granted: 2001-09-11
Abstract: A semiconductor package with heat dissipation structure is disclosed, which comprises a semiconductor device bonded to a substrate. The semiconductor chip has an active surface for plural bonding wires to be bonded on it and electrically connects the semiconductor chip and the substrate. The active surface is bonded to a lid made of the material whose thermal expansion coefficient is close to the semiconductor chip through an adhesive layer, so as to reduce the effect of thermal stress to the semiconductor chip and effectively avoid the crack of the semiconductor chip. Thereby to enhance the heat dissipation efficiency generated from the active surface of the semiconductor chip, and prevent the moisture from the exterior from condensing on the active surface of the semiconductor chip. A heat dissipation sheet is disposed on the substrate. The heat dissipation sheet has a top surface to expose the encapsulant wrapping the semiconductor chip and lid, and the heat dissipation sheet spaces from the lid top for a proper distance to avoid the heat dissipation sheet from touching and pressing the semiconductor chip. It can effectively reduce the thickness of the packaging resin between the heat dissipation sheet and the semiconductor substrate at the same time, so as to promote the heat dissipation efficiency.
Patent TW-512400-B (TW)
Title: Megasonic resonator for disk cleaning and method for use thereof
Inventor: FISHKIN BORIS
IPC: G10K11/28
Filed: 2000-09-26
Granted: 2002-12-01
Abstract: A Megasonic cleaning apparatus having at least one reflector (e.g., a parabolic or paraboloid reflector) positioned to collect otherwise wasted cleaning energy and redirect that energy to one or a plurality of positions on a wafer's edge is provided. A first embodiment comprises a complex parabolic reflector which has a width greater than that of the wafer and a preferred length approximately equal to the diameter of the wafer, and which is shaped to provide focal points which vary along the length of the parabolic reflector, such that energy striking the reflector at different points along the reflector's length is directed to a plurality of different points along the wafer's edge. A second embodiment comprises a simple parabolic reflector having a width greater than that of the wafer and a preferred length less than the diameter of the wafer, and which is provided to focus at a cord along the wafer's surface, effectively focusing cleaning energy on two points along the wafer's edge at any given time. Yet another embodiment of the invention comprises a paraboloid reflector having a width greater than that of the wafer and a preferred length which is substantially less than the diameter of the wafer and which is shaped to focus all collected energy to a single point on the wafer's edge. Multiple such reflectors may be positioned in the cleaning tank to optimize energy usage and wafer cleaning.
Patent TW-556354-B (TW)
Title: Pressure sensor, pressure sensor control apparatus, and pressure sensor system
Inventor: IROKAWA KENJI
IPC: G01R19/00
Filed: 2000-10-04
Granted: 2003-10-01
Abstract: The type of a pressure sensor is automatically identified even when the input/output lines of the pressure sensor are three lines, i.e., power source lines (two of + and -) and a voltage output line for outputting a voltage corresponding to an applied pressure. The current value (Ip), which flows through the power source lines of the pressure sensor (16), is made to be a different value depending on each type of the pressure sensor (16). A voltage value (Vr) (Vr=IpxRr, where Rr is a resistance value of a resistor (50)) is measured by using a differential amplifier (54), and the voltage value (Vr) is compared with a voltage range previously recorded in ROM (68). Accordingly, the type of the pressure sensor (16) can be automatically identified by using a microcomputer (64).
Patent TW-589503-B (TW)
Title: Liquid crystal display device
Inventor: MURAI HIROYUKI
IPC: G09G3/36
Filed: 2000-12-02
Granted: 2004-06-01
Abstract: The present invention provides a liquid crystal display device comprising plural first vertical scanning lines and plural horizontal scanning lines, which are formed in matrix on a substrate, a first switching means connected to said horizontal scanning line controllable by said first vertical scanning line, a capacity element for control employed to hold the control signal of said horizontal scanning line connected to the first switching means, and a second switching means for connecting picture element signal line and picture element electrode so as to write the potential of picture element signal line into the picture element electrode, wherein said second switching means is in connection with said capacity element; thereby the liquid crystal display device can be driven at low power consumption but without ruining the display quality.
Patent TW-I256998-B (TW)
Title: Surface plasmon resonance
Inventor: PERKINS ELAINE ANN
IPC: G01N21/27
Filed: 2000-12-11
Granted: 2006-06-21
Abstract: With reference to figure 1, surface plasmon resonance apparatus (1) for detecting a soluble and/or particulate analyte comprises a prism sensor (2) providing a metallised sensor surface (3) capable of binding the analyte, and a laser (10) providing a light source excitation beam (4) for direction at the sensor surface (3). A detector (5) is provided which is capable of detecting light (6) from the light beam (4), which light beam is internally reflected from the sensor surface (3). Displacement means (7) comprising a vibrator (8) and mirror (9), is operable whereby the excitation beam (4) is displaced over an angular range (A) relative to the sensor surface (3). The displacement means (7) operate to influence the excitation beam (4) in a controlled manner, whereby the level of light reflected from the sensor surface (3) and detected by the detector (5) is substantially enhanced and analytical sensitivity improved. An analyte sample (15) is disposed on the metallic sensor surface (3) whereby it is exposed to said surface. The detector (5) is used to interpret the light signals (6) internally reflected from the sensor surface (3) so that the sample (15) is analysed. A video camera system (16), which includes a mirror (17), microscope object (18) and CCD (charge-coupled device) array (19), is used to detect the scattered light emitted from the upper face of the sensor surface (3). The invention also resides in a microscope incorporating the detection apparatus.
Patent TW-558688-B (TW)
Title: Security tag detection and localization system
Inventor: DAVIES JOHN E JR
IPC: H04B1/59
Filed: 2000-12-29
Granted: 2003-10-21
Abstract: A security tag detection and localization system for detecting a resonant security tag in a security zone comprising a plurality of detection zones, and generating an alarm signal localizing the resonant security tag to a detection zone. The system includes an antenna array for radiating interrogation signals and receiving response signals. The antenna array forms the upper boundary, the lower boundary or both the upper and lower boundaries of a security zone and extends horizontally across the width and length of the security zone. The antenna array comprises at least two antennas. The antennas forming the upper and lower boundaries are disposed side-by-side in a single horizontal plane with each antenna being electromagnetically coupled to one of the detection zones. The security tag detection and localization system also includes one or more electronic article security (EAS) sensors for transmitting interrogation signals to the antenna array, receiving response signals from the antenna array, and generating an alarm signal. The security tag detection and localization system also includes an annunciator connected to each EAS sensor, for receiving the alarm signal and indicating a detection zone corresponding to the alarm signal.
Patent TW-509736-B (TW)
Title: Embroidery machine with operation data storing function and method for controlling the same
Inventor: KIM DO-WAN
IPC: D05B19/12
Filed: 2001-02-15
Granted: 2002-11-11
Abstract: The embroidery machine includes: (1) a function-setting unit 110 having a current-operation data storing key for storing current-operation data and an operation data retrieval key for retrieving stored previous-operation data; (2) an operation data storage unit 120 for storing data with respect to the current operation in response to a signal generated by the selection of the operation-data storing key at the function-setting unit 110; and (3) a control unit 130 for controlling storage of the current-operation data in the operation data storage unit 120, checking whether there exist an operation stored in the operation data storage unit 120 if the operation data retrieval key is selected at the function-setting unit 110, and controlling the performance of the corresponding embroidery operation as a result of the check.
Patent TW-487974-B (TW)
Title: Manufacturing method for bonding wafer
Inventor: ABE TAKAO
IPC: H01L21/762
Filed: 2001-03-26
Granted: 2002-05-21
Abstract: A kind of method for manufacturing bonding wafer is provided with the followings: an ion implantation step, in which at least either hydrogen ions or rare gas ions are implanted into the first wafer surface to form a micro bubble layer (implanted layer) in the first wafer; a bonding step, in which the surface subjected to the ion implantation of the first wafer is bonded to the second wafer surface and a heat treatment is conducted onto the bonded first wafer as well as the second wafer; and a stripping step, in which the first wafer is stripped from the micro bubble layer and the ion implantation is performed while temperature of the first wafer is maintained at a temperature lower than 20 DEG C in the ion implantation step. The invention provides a method for producing a bonded wafer and enables improvement of productivity as well as decrease of cost by reduction of implantation dose required for stripping and bonding wafers without causing breakage of the wafers even when the temperature for stripping process is low and wafers having different thermal expansion coefficients are bonded in the ion implantation stripping method.