baber/WOPTO huggingface dataset:
Patent TW-202324120-A (TW)
Title: Clustered storage system
Inventor: WANG CHIEN-CHUNG
IPC: G06F13/14
Filed: 2021-12-08
Abstract: A clustered storage system includes a first input-output module, a second input-output module, a plurality of first sensors, a plurality of second sensors, a first read-only memory, and a second read-only memory, a first bus, and a second bus. The first input-output module is used for reading a parameter data of the first read-only memory and the state of the first sensors via the first bus. The second input-output module is used for reading the parameter data of the second read-only memory and the states of the second sensors via the second bus. When the first input-output module fails to read the parameter data of the first read-only memory via the first bus, the first input-output module reads the parameter data of the second read-only memory via the second bus.
Patent TW-202225136-A (TW)
Title: Use of medicinal composition for treating lung cancer
Inventor: TSAI Chang-Hai
IPC: C07C69/602
Filed: 2021-12-14
Abstract: The present disclosure relates to a use of a medicinal composition. The medicinal composition includes a diarylheptanoid compound and a pharmaceutically acceptable salt thereof. The diarylheptanoid compound has a structure shown in Formula (I): in Formula (I), each symbol is as defined in the specification. The diarylheptanoid compound can inhibit growth of lung cancer cells, and it can be used as a therapeutic drug for treating lung cancer.
Patent TW-202230811-A (TW)
Title: Semiconductor device
Inventor: LEE BOK-YOUNG
IPC: H01L29/78
Filed: 2021-12-16
Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a first base fin protruding from the substrate and extending in a first direction, and a first fin type pattern protruding from the first base fin and extending in the first direction. The first base fin includes a first sidewall and a second sidewall, the first and second sidewalls extending in the first direction, the first sidewall opposite to the second sidewall, the first sidewall of the first base fin at least partially defines a first deep trench, the second sidewall of the first base fin at least partially defines a second deep trench, and a depth of the first deep trench is greater than a depth of the second deep trench.
Patent TW-202236378-A (TW)
Title: Gripper and lithographic apparatus comprising the gripper
Inventor: VAN DONGEN PAUL
IPC: G03F7/20
Filed: 2021-12-27
Abstract: Disclosed herein is a gripper configured to transport a substrate in a lithographic apparatus, the gripper comprising: a main body with one or more engagement portions for engaging with a surface of the substrate; wherein a part of the main body, that is overlapped by a region of a substrate when the one or more engagement portions are engaged with the substrate, comprises a plurality of openings that extend through the main body in a direction substantially perpendicular to the surface of the substrate.
Patent TW-202241916-A (TW)
Title: Compound, bonding agent, joined body, printed substrate, and method for manufacturing bonded body
Inventor: HAPPOYA AKIHIKO
IPC: B32B15/08
Filed: 2021-12-27
Abstract: The present disclosure is a compound that includes, in a molecule: at least one functional group of an OH group and an OH-generating group; an organic group that contains a carbon-carbon double bond; and a triazine ring.
Patent TW-202331467-A (TW)
Title: Electronic device with dynamic wallpaper
Inventor: WENGHUANG TZU-CHUAN
IPC: G06F3/01
Filed: 2022-01-18
Abstract: An electronic device is provided. The electronic device includes a touch screen and a processor. The processor is coupled to the touch screen. The processor displays, through the touch screen, a first dynamic wallpaper when the electronic device determines the electronic device is in a lock screen mode.
Patent TW-202302824-A (TW)
Title: Compound, liquid crystal composition, and liquid crystal display element, sensor, liquid crystal lens, optical communication device and antenna each using same
Inventor: HIRATA SHINICHI
IPC: G02F1/13
Filed: 2022-02-17
Abstract: The present invention addresses the problem of providing: a compound which enables the achievement of a liquid crystal composition that has a high Tni, a large [Delta]n, a low Vth, a large [Delta][epsilon]r and a small tan[delta]iso, while having good storage stability at low temperatures; a liquid crystal composition; and a liquid crystal display element, a sensor, a liquid crystal lens, an optical communication device and an antenna, each of which uses this liquid crystal composition. The present invention specifically provides: a compound which is represented by general formula (i), while having an ethynylene group (-C ≡ C-) and an isothiocyanate group (-NCS); and a liquid crystal composition which contains one or more kinds of this compound.
Patent TW-202239209-A (TW)
Title: Multi-scale optical flow for learned video compression
Inventor: POURREZA REZA
IPC: H04N19/50
Filed: 2022-02-18
Abstract: Systems and techniques are described for encoding and/or decoding data based on motion estimation that applies variable-scale warping. An encoding device can receive an input frame and a reference frame that depict a scene at different times. The encoding device can generate an optical flow identifying movements in the scene between the two frames. The encoding device can generate a weight map identifying how finely or coarsely the reference frame can be warped for input frame prediction. The encoding device can generate encoded video data based on the optical flow and the weight map. A decoding device can generate a reconstructed optical flow and a reconstructed weight map from the encoded data. A decoding device can generate a prediction frame by warping the reference frame based on the reconstructed optical flow and the reconstructed weight map. The decoding device can generate a reconstructed input frame based on the prediction frame.
Patent TW-202240780-A (TW)
Title: Method for manufacturing multilayer wiring board, kit for forming laminated film, and composition in which an organic film having excellent adhesion can be formed on the inner wall surface of a via hole, and the metal can be excellently embedded in the via hole
Inventor: KOMATSU HIROYUKI
IPC: H05K3/46
Filed: 2022-02-25
Abstract: The present invention provides a method for manufacturing a multilayer wiring board, in which an organic film having excellent adhesion to a plating layer can be formed on the inner wall surface of a via hole, and the metal can be excellently embedded in the via hole by a plating treatment. The multilayer wiring board is manufactured by the method including: a first formation step for forming a first organic film 16 on a wiring 13 inside a via hole 11 formed in an insulating layer 14 provided on the wiring 13; a second forming step for forming a second organic film 17 on the inner wall surface of the via hole 11 after forming the first organic film 16; a removing step for removing the first organic film 16 after forming the second organic film 17; and a plating step for forming a plating layer 18 inside the via hole 11 after removing the first organic film 16. The second organic film 17 is formed by using a polymer (I) having a first functional group capable of interacting with a group on the surface of the insulating layer 14, and has a second functional group capable of forming a bond with the metal contained in the plating layer 18.
Patent TW-202315563-A (TW)
Title: Toilet paper roll
Inventor: AMANO YOSHIMI
IPC: A47K10/22
Filed: 2022-03-10
Abstract: To provide a toilet paper roll such that it is easy to increase the length of toilet paper that is suitable for use with a toilet having a cleaning function. This problem is solved by a toilet paper roll in which two-ply toilet paper composed of two sheets bonded via recesses formed by an embossing process is wound upon a paper tube, wherein: the wound diameter is 120 mm or shorter; the degree of roll compression is 0.66-1.50; and the toilet paper has a configuration in which a first sheet having first recesses and second recesses of different depths formed therein by an embossing process is layered on a second sheet.
Patent TW-202335633-A (TW)
Inventor: TU SHIH-HAI
IPC: A61B5/05
Filed: 2022-03-11
Abstract: 一種多雷達感測系統，包含：一個射頻積體電路、一第一操作模式發射天線、一第二操作模式發射天線、一第一操作模式接收天線組、一第二操作模式接收天線組、一類比數位轉換器以及一處理裝置。射頻積體電路以分時運作的方式而運作第一操作模式及第二操作模式。藉由分時運作，本發明的多雷達感測系統可以降低平均功率而維持低瓦數。
Patent TW-202303878-A (TW)
Inventor: PARK KUN-SANG
IPC: H01L23/31
Filed: 2022-04-12
Abstract: 一種半導體封裝包括：第一結構，具有第一絕緣層及穿透第一絕緣層的第一結合墊；以及第二結構，位於第一結構上且具有第二絕緣層、結合墊結構及測試墊結構，所述第二絕緣層結合至第一絕緣層，所述結合墊結構穿透第二絕緣層且結合至第一結合墊，所述測試墊結構穿透第二絕緣層且包括測試墊及結合層，所述測試墊位於穿透第二絕緣層的開口中且具有帶有平整表面的突出部，所述結合層對開口進行填充且覆蓋測試墊及平整表面，測試墊的突出部自與結合層接觸的表面延伸，且突出部的平整表面位於開口內且與結合層和第一絕緣層之間的介面間隔開。
Patent TW-202309285-A (TW)
Inventor: SAZANI PETER
IPC: C12N15/113
Filed: 2009-10-26
Abstract: 本發明提供能夠結合人類肌縮蛋白(dystrophin)基因中之選定目標位點以誘導外顯子略過(exon skipping)之反義分子，及使用其治療肌肉萎縮症之方法。
Patent TW-202300540-A (TW)
Title: Ethylene vinyl alcohol copolymer resin particle composition, ethylene vinyl alcohol copolymer film and multilayer structure formed therefrom
Inventor: LIANG CHIH-CHIEH
IPC: B29K29/00
Filed: 2022-06-16
Abstract: The instant disclosure relates to an ethylene vinyl alcohol copolymer (EVOH) resin particle composition, an EVOH film formed therefrom, and a multilayer structure containing the same. The EVOH resin particle composition includes a first EVOH resin particle having a surface valley void volume (Vvv) of 0.00003~2 um3/um2; and a second EVOH resin particle having a surface valley void volume (Vvv) of 0.00005~10um3/um2. The present invention can improve thickness uniformity, oxygen transmission rate and strechability of the film made by the EVOH resin particle compositions.
Patent TW-202306756-A (TW)
Inventor: JANG KWANG-HO
IPC: G09F9/00
Filed: 2022-07-25
Abstract: 實例涉及具有優異的光學特性如折射率、霧度、黃度等和優異的機械特性的薄膜、透光性層疊體、用作覆蓋膜的用途、以及包括其的多層電子設備等。所述薄膜包括彈性層，所述彈性層的折射率為1.48至1.58，低溫損傷指數為在特定溫度下的拉伸模數與拉伸強度之差，所述彈性層在-40℃下的低溫損傷指數為1300MPa以下。
Patent TW-202335211-A (TW)
Title: Semiconductor device and semiconductor device manufacturing method
Inventor: ITAKURA SATORU
IPC: H01L23/48
Filed: 2022-08-02
Abstract: According to one embodiment, a semiconductor device includes: a circuit board; a first semiconductor chip mounted on a face of the circuit board; a resin film covering the first semiconductor chip; and a second semiconductor chip having a chip area larger than a chip area of the first semiconductor chip, the second semiconductor chip being stuck to an upper face of the resin film and mounted on the circuit board. The resin film entirely fits within an inner region of a bottom face of the second semiconductor chip when viewed in a stacking direction of the first and second semiconductor chips.
Patent TW-202313381-A (TW)
Inventor: MOIA ALESSANDRO
IPC: B60T8/172
Filed: 2022-08-03
Abstract: 本發明係關於一種用於判定一液壓煞車系統（10）、尤其用於一電動腳踏車（100）之液壓煞車系統之一剛性（33）的方法，其中該液壓煞車系統（10）具有一防鎖死單元（1），該防鎖死單元具有一活塞（4），該活塞可以一可控制的方式致動以用於一煞車壓力之主動壓力調變，且其中該方法包含在該活塞（4）之致動期間進行的以下步驟：藉由該活塞（4）之致動判定一煞車流體之一體積改變（32）；判定該煞車壓力之一壓力改變（31）；及將該液壓煞車系統（10）之該剛性（33）判定為該壓力改變（31）與該體積改變（32）之一比率，其中該體積改變（32）係基於該活塞（4）之一位置改變來判定。
Patent TW-202320775-A (TW)
Title: Stephania cephalantha-derived alkaloid-containing preparation
Inventor: WATASHI KOICHI
IPC: A61K31/4741
Filed: 2022-08-05
Abstract: In one embodiment, provided is a Stephania cephalantha-derived alkaloid-containing preparation for treating SARS-CoV-2 infection. According to one embodiment of the present invention, the preparation for treating SARS-CoV-2 infection contains cepharanthine, isotetrandrine, cycleanine and berbamine. This preparation for treating SARS-CoV-2 infection is for treating infection caused by a SARS-CoV-2 variant. According to one embodiment of the present invention, provided is a Stephania cephalantha-derived alkaloid-containing preparation for treating SARS-CoV-2 infection.
Patent TW-202311061-A (TW)
Inventor: LOSIEWICZ WILLIAM A
IPC: H05K3/26
Filed: 2022-08-08
Abstract: 一種刮刀滴液收集系統經配置來接收來自印刷頭總成的至少一個刮刀刀片的組裝材料。該刮刀滴液收集系統包括一膏劑護罩，該膏劑護罩耦接至印刷頭台架且經配置成在一縮回位置與一伸出位置之間移動，在該縮回位置中該膏劑護罩與該至少一個刮刀刀片間隔開，在該伸出位置中該膏劑護罩定位在該至少一個刮刀刀片下方。該刮刀滴收集系統進一步包括一膏劑護罩移除總成，該膏劑護罩移除總成經配置來將該膏劑護罩與該印刷頭台架解耦並移除該膏劑護罩。
Patent TW-202309375-A (TW)
Title: Slope protection connecting plate, ecological protection slope design and method of construction thereof
Inventor: TSOU CHI-HUI
IPC: A01G24/20
Filed: 2022-08-08
Abstract: A slope protection connecting plate includes three connecting sections, three curved sections, a plurality of pin-like hooks and a plurality of traction nails. Each of the connecting sections has at least one positioning hole. Each of the connecting sections is connected between two adjacent curved sections. The curved sections are centrally symmetrical. Each of the curved sections has a radius, a curvature and a center. The radii are equal to each other. The curvatures are equal to each other. The centers are located outside the curved sections. The pin-like hooks are distributed on the curved sections in a curved way. The traction nails are respectively matched with the corresponding positioning hole.
Patent TW-202300704-A (TW)
Title: Copper surface passivation composition, application thereof, and photoresist stripping liquid containing copper surface passivation composition
Inventor: HOU JUN
IPC: C11D11/00
Filed: 2022-08-19
Abstract: The invention relates to a copper surface passivation composition. The copper surface passivation composition comprises 4-(2-pyridylazo)resorcinol and a glucosamine derivative. The invention also relates to a photoresist stripping liquid containing the copper surface passivation composition, and a cleaning method of a copper substrate. The copper surface passivation composition has good copper passivation protection performance, so the composition can be used for photoresist removal and copper surface passivation protection in a bump process of semiconductor back-end packaging, and has good industrial application prospects and popularization potential in the technical field of microelectronics.
Patent TW-202316850-A (TW)
Title: Solid-state imaging element and electronic device
Inventor: KASUKAWA Shuhei
IPC: G02B3/00
Filed: 2022-08-25
Abstract: The present disclosure relates to a solid state imaging element and an electronic device that make it possible to obtain more uniform sensitivity characteristics. This solid-state imaging element comprises a same-color pixel group in which pixels for receiving the same color of light are disposed in a 4*4 array, wherein an on-chip lens is provided for each 2*2 array pixels. In-pixel grooves having various shapes are formed by digging shallower than an element isolating portion for isolating a photoelectric conversion portion of each pixel. Predetermined pixels of the same-color pixel group have the in-pixel grooves on a light-incident surface side of a semiconductor substrate, whereby a sensitivity-adjusting structure is constructed. The present technology can be applied to CMOS image sensors, for example.
Patent TW-202324196-A (TW)
Inventor: KAWASAKI HIROKI
IPC: G06N3/08
Filed: 2022-08-30
Abstract: According to one embodiment, a method, computer system, and computer program product for object detection. The embodiment may include receiving an annotated image dataset comprising rectangles which surround objects to be detected and labels which specify a class to which an object belongs. The embodiment may include calculating areas of high and low probability of rectangle distribution for each class of objects within images of the dataset. The embodiment may include applying a correction factor to confidence values of object prediction results, obtained during validation of a trained object detection (OD) model, depending on a class label and a rectangle location of an object prediction result and calculating an accuracy of the trained OD model. The embodiment may include increasing the correction factor and re-calculating the accuracy of the trained OD model with every increase. The embodiment may include selecting an optimal correction factor which yields a highest accuracy.
Patent TW-202301456-A (TW)
Title: Polishing pad and polishing equipment for polishing silicon wafer
Inventor: Bai zong-quan
IPC: H01L21/461
Filed: 2022-09-05
Abstract: The embodiment of the invention discloses a polishing pad for polishing a silicon wafer and polishing equipment, and the upper surface of the polishing pad comprises a circular first area located in the center of the polishing pad, and a circular second area located in the center of the polishing pad, the second area and the third area are concentric with the first area and are in a circular ring shape, and the second area is located between the first area and the third area in the radial direction; wherein a plurality of linear grooves are formed in each of the first region, the second region and the third region, the plurality of grooves are separated from one another through a plurality of linear groove gaps, and the first region, the second region and the third region are separated from one another through a plurality of linear groove gaps. The plurality of grooves and the plurality of groove gaps are arranged such that the amount of polishing liquid temporarily present on the surfaces of the grooves in the first region and the third region during polishing is greater than the amount temporarily present on the surfaces of the grooves in the second region.
Patent TW-202324625-A (TW)
Title: Ceiling heater, semiconductor device manufacturing method, substrate processing method, and substrate processing apparatus
Inventor: SUGIURA SHINOBU
IPC: H01L23/34
Filed: 2022-10-18
Abstract: The present invention suppresses the deformation of heating elements. A ceiling heater provided above a reaction tube includes a disk-shaped base material and heating elements continuously spread on the base material over a plurality of areas obtained by dividing a circle centered at the center of the base material into sectors, wherein each of the heating elements spread over the plurality of areas is connected to the heating element in the adjacent area at a predetermined portion, the base material has a groove corresponding to the shape of the heating elements, a wall is formed by portions other than the portion where the groove is provided, and the space between the heating elements respectively spread over the two regions adjacent to each other is configured to be wider than the width of the wall separating the two regions.
Patent TW-202322271-A (TW)
Title: Electrostatic tray and base
Inventor: RONG YAN-TIAN
IPC: H01L21/687
Filed: 2022-11-15
Abstract: An electrostatic tray and a base, wherein the electrostatic tray comprises a tray body, a voltage feeding part and a plurality of adsorption parts, wherein a plurality of adsorption parts are arranged on the tray body at intervals, and each adsorption part comprises an insulating layer, an electrode layer and a dielectric layer arranged in turn along the direction away from the tray body; The voltage feeding part is arranged between the adsorption part and the tray body, and is electrically connected with the electrode layers of a plurality of adsorption parts. The voltage feeding part is used to feed DC voltage to the electrode layers of each adsorption part to adsorb a plurality of wafers one by one through a plurality of adsorption parts.
Patent TW-202322234-A (TW)
Title: Package device manufacturing method
Inventor: KOBINATA KYOSUKE
IPC: H01L21/56
Filed: 2022-11-21
Abstract: A package device manufacturing method comprising: a workpiece preparation step of preparing a workpiece in which a plurality of planned dividing lines that intersect each other are set on a side of one surface and that has a first region on which a device chip is disposed and a second region outside the first region in each zone marked out by the planned dividing lines in the one surface; a device chip disposing step of disposing the device chips on the first regions of the workpiece; a resin molding step of, after the workpiece preparation step and the device chip disposing step, supplying a mold resin to the second regions higher than the first regions and the first regions and covering the device chips and the workpiece by the mold resin; a resin thinning step of, after the resin molding step, processing and thinning the mold resin from the side of the one surface of the workpiece to a thickness with which the second regions of the workpiece covered by the mold resin are not exposed and the device chips disposed on the first regions are not exposed; a polishing step of, after the resin thinning step, polishing the mold resin from the side of the one surface by a polishing pad to expose the second regions of the workpiece and further polishing the mold resin and the second regions, the mold resin being disposed on the first regions, by the polishing pad to form a flat surface including the mold resin and the second regions on the side of the one surface of the workpiece; and a dividing step of dividing the workpiece along the planned dividing lines to manufacture individual package devices each including the device chip.
Patent TW-202330933-A (TW)
Title: Sample contamination detection of contaminated fragments for cancer classification
Inventor: GROSS SAMUEL S
IPC: C12Q1/6816
Filed: 2022-11-23
Abstract: Methods and systems for detecting contaminated fragments in a biological sample for cancer classification are disclosed. The system identifies multiple SNP site contamination markers and indel site contamination markers. The multiple SNP site contamination markers include at least two SNP sites within a threshold distance, having population haplotype frequency within a range of threshold frequencies, excluding guanine-adenine polymorphisms and/or cytosine-thymine polymorphisms, ensuring Hardy-Weinberg equilibrium, or any combination of the parameters above. The indel site contamination markers include indel sequences that are within a threshold length, having high complexity, having population haplotype frequency within a range of threshold frequencies, ensuring Hardy-Weinberg equilibrium, or any combination of the parameters above. The system identifies contamination markers for which the sample is homozygous. The system estimates the contamination level of the sample by identifying fragments having a haplotype that is different than the homozygous haplotype of the respective contamination marker sites in the sample.
Patent TW-202335848-A (TW)
Title: Anti-reflective film-attached transparent substrate and image display device
Inventor: TAKEMOTO KAZUYA
IPC: B32B17/10
Filed: 2023-01-19
Abstract: An anti-reflective film-attached transparent substrate includes: a transparent substrate including two major surfaces; and a diffusion layer and an anti-reflective film on one major surface of the transparent substrate, which are provided in this order. (A) A luminous reflectance SCI Y of an outermost surface of the anti-reflective film-attached transparent substrate is 1% or lower. (B) The anti-reflective film has a lamination structure in which at least two dielectric layers having different refractive indices are laminated. (C) A ratio (SCE Y)/(SCI Y) of a diffuse reflectance SCE Y of the outermost surface of the anti-reflective film-attached transparent substrate to the luminous reflectance SCI Y of the outermost surface of the anti-reflective film-attached transparent substrate is 0.15 or higher.
Patent TW-202333733-A (TW)
Title: Therapeutic agent for nocturnal pollakiuria
Inventor: SEGAWA KATSUYA
IPC: A61K31/519
Filed: 2018-12-21
Abstract: To provide a novel therapeutic agent for nocturnal pollakiuria. A therapeutic agent for nocturnal pollakiuria which contains, as an active ingredient, (6S)-N-[4-({(2S,5R)-5-[(R)-hydroxy(phenyl)methyl]pyrrolidin-2-yl}methyl)phenyl]-4-oxo-4,6,7,8-tetrahydropyrrolo[1,2-a]pyrimidine-6-carboxamide.