Patent SG-11201903503T-A (SG)
Title: Apparatus and method for cleaning semiconductor wafers
Inventor: WANG HUI
IPC: B08B3/12
Filed: 2016-10-25
Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 1#11101111 0 11101 HOE HI 1 0 011101 Ell Ell 01111101011 MEV OEN Organization International Bureau (10) International Publication Number (43) International Publication Date ......0\"\" WO 2018/076152 Al 03 May 2018 (03.05.2018) WIP01 PCT (51) International Patent Classification: ming; Bld. 4, No. 1690 Cailun Road, Zhangjiang High-Tech B08B 3/12 (2006.01) H01L 21/00 (2006.01) Park, Shanghai 201203 (CN). CHEN, Fuping; Bld. 4, No. (21) International Application Number: 1690 Cailun Road, Zhangjiang High-Tech Park, Shanghai 201203 (CN). PCT/CN2016/103151 (22) International Filing Date: (74) Agent: SHANGHAI PATENT & TRADEMARK LAW 25 October 2016 (25.10.2016) OFFICE, LLC; 435 Guiping Road, Shanghai 200233 (CN). (25) Filing Language: English (81) Designated States (unless otherwise indicated, for every (26) Publication Language: English kind of national protection available): AE, AG, AL, AM, (71) Applicant: ACM RESEARCH (SHANGHAI) INC. AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, [CN/CN]; Bld. 4, No. 1690 Cailun Road, Zhangjiang High- DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, Tech Park, Shanghai 201203 (CN). HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, (72) Inventors: WANG, Hui; Bld. 4, No. 1690 Cailun Road, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, Zhangjiang High-Tech Park, Shanghai 201203 (CN). MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, WANG, Xi; Bld. 4, No. 1690 Cailun Road, Zhangjiang PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, High-Tech Park, Shanghai 201203 (CN). CHU, Zhen- (54) Title: APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR WAFERS 112 . / 103 102 Cm4 1 I i 101 „........_ ....„ 1 104 108 _ ---, /// / 4 / - , 4 107 113 107 / 106 Fig. 1A 105 111 1— H ..0 (57) : An apparatus for cleaning a semiconductor wafer comprises a chuck (106), an ultra or mega sonic device, an actuator (1 1 3 ), at least one dispenser (108, 209) and a rotating driving mechanism (111). The chuck (106) holds the semiconductor wafer (105). N The actuator (113) drives the ultra or mage sonic device to a position above the surface of the semiconductor wafer (105) and a gap iln is formed between the ultra or mega sonic device and the surface of the semiconductor wafer (105). The at least one dispenser (108, 11 ,t: 209) sprays cleaning liquid on the surface of the semiconductor wafer (105). The rotating driving mechanism drives the chuck (106) IN to rotate at a spin speed lower than a set spin speed for ensuring that the gap between the ultra or mega sonic device and the surface of 0 --.... the semiconductor wafer (105) is fully and continuously filled with the cleaning liquid (104), making the ultra or mega sonic energy ° Il O be stably transferred to the entire surface of the semiconductor wafer (105) through the cleaning liquid (104). A method for cleaning C a semiconductor wafer is also disclosed. ei C [Continued on next page] WO 2018/076152 Al 111111111111111111101010111110111110111011111111111111110111111111111111110111111111111 SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))