baber/WOPTO huggingface dataset:
Patent JP-2004270237-A (JP)
Title: Scaffolding for support work and building method therefor
Inventor: YONAHARA YOSHIHIRO
IPC: E04G3/00
Filed: 2003-03-07
Abstract: <P>PROBLEM TO BE SOLVED: To provide scaffolding for support work, which can be rapidly moved in an assembled state without being assembled/disassembled in the section of work for each column of a skeleton structure.  <P>SOLUTION: This skeleton structure comprises a plurality of vertical supports and a plurality of beam materials which are horizontally extended so as to be coupled to the supports, and a unit frame body 21 is mounted on the beam material which is temporarily fixed to the support. The frame body 21 comprises a vertically-extended vertical bar 22 and a plurality of horizontal bars 23 which are horizontally elongated so as to couple the vertical bar 22. A scaffolding board supporting beam 30 is mounted on the frame body 21, and a scaffolding board 37 is mounted on the supporting beam 30.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004268206-A (JP)
Title: Wet etching method of processing object substrate
Inventor: ASHIDA KIWAMU
IPC: B81B1/00
Filed: 2003-03-10
Abstract: <P>PROBLEM TO BE SOLVED: To form a fine three-dimensional image without using a photolithography technology.  <P>SOLUTION: A first step S1 selectively irradiates FIB onto a processing object substrate such as a monocrystal silicon substrate. In that case, dose quantity of the FIB, a dot pitch, and accelerating voltage are adjusted according to the height of a projecting part to be formed. The masking effect to an etching liquid is revealed in an FIB irradiation part by this FIB irradiation. A second step S2 removes a natural oxide film formed on a substrate surface by being processed by a buffered hydrofluoric acid (BHF). After performing flowing water cleaning in a third step S3, ultrasonic cleaning is performed by using pure water and acetone in a fourth step S4. A fifth step S5 etches the FIB irradiation surface of the processing object substrate by being soaked in a KOH aqueous solution. Afterwards, a sixth step S6 observes a level difference by AFM for confirmation.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004271073-A (JP)
Title: Luminescent unit and air conditioning apparatus using the same
Inventor: FUJITO TOSHIYA
IPC: F24F11/02
Filed: 2003-03-10
Abstract: <P>PROBLEM TO BE SOLVED: To reliably inform a user of important information such as a trouble of an apparatus or its operated condition by flashing an air passage through which air passes to emit a light from almost all front face of an apparatus body while securing the air passage.  <P>SOLUTION: The air conditioning apparatus comprises a light source 24 provided on the side face of a suction panel 23 for irradiating a reflecting plate 25 to be indirectly flashed, an opening portion 27 provided on the reflecting plate 25, and a plurality of bar reflecting planes 26. Thus, an air flow can pass through the opening portion 27. Namely, all air passage can be flashed and so a user can be reliably informed of important information such as a trouble of the apparatus or its operated condition of which he is conventionally informed by a liquid crystal provided at the corner of the apparatus.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004152461-A (JP)
Title: Actuator of hard disk drive
Inventor: CHOI IL-YEON
IPC: G11B21/02
Filed: 2003-03-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide an actuator of HDD operated more stably by enforcing coupling force of a molding part and an actuator arm.  <P>SOLUTION: This actuator of HDD is provided with a suspension 154 supporting a slider 152 on which a magnetic head is mounted, an actuator arm 156 in which a pivot hole 157 is provided at an intermediate part and the suspension 154 is provided at its one end part so as to be provided on a base plate of the HDD freely rotatably, a coil 158 coupled to the other end part of the actuator arm 156 through a molding part 159, and a voice coil motor 158 separated from the coil 158a by the prescribed interval and having a magnet 158b arranged so as to opposite to the one plane. A plurality of projections 161 projected toward the molding part 159 are provided at a contact plane of the molding part 159 and the actuator arm 156.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004278562-A (JP)
Title: Tandem type friction coupling device
Inventor: ONISHI HIROBUMI
IPC: F16H57/023
Filed: 2003-03-12
Abstract: <P>PROBLEM TO BE SOLVED: To keep axial dimensions as small as possible; to facilitate the control of piston strokes of both friction coupling devices; to control dragging of friction plates; to improve the assembling workability, in a tandem type friction connecting apparatus in which a pair of the friction coupling devices adjoining each other are disposed in the axial direction.  <P>SOLUTION: A brake housing 40 in which a third brake B3 is to be arranged, is constituted separately, from a case 26 in which a first brake B1 is to be arranged, is set to act as a second stopper member pressing the friction plates 72 and 74 of the first brake B1 between the second stopper member and a second piston 78 while making the tip of a first fitting portion 42 of the third brake B3 opposed to the tip of a second fitting portion 70 of the first brake B1 with a minute gap.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004281782-A (JP)
Title: Semiconductor device and its manufacturing method
Inventor: MORIKADO MUTSUO
IPC: H01L27/12
Filed: 2003-03-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a leakage current can be reduced, and to provide its manufacturing method.  <P>SOLUTION: The semiconductor device has a projecting second semiconductor layer 14 formed on a first semiconductor layer 10, third and fourth semiconductor layers 12 and 13 brought in contact with the layer 14 and formed on the layer 10 so as to be mutually opposed while interposing the layer 14, a gate electrode 16 being in contact with the layer 14 while interposing a gate insulating film 15 and forming a channel in the layer 14, and insulating films STI formed in the layer 10 positioned at sections just under the layers 12 and 14.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004281875-A (JP)
Title: Silicon carbide semiconductor device and its manufacturing method
Inventor: OKAMOTO MITSUHISA
IPC: H01L29/78
Filed: 2003-03-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device having groove structure in which device characteristics are most improved in epitaxial growth on a step.  <P>SOLUTION: The silicon carbide semiconductor device is provided with a hexagonal silicon carbide layer in which a face sloped from a (0001) or (000-1) face is an uppermost surface, a groove area in which the longitudinal direction of a rectangular groove formed by selectively etching the silicon carbide layer is parallel with an off direction and a silicon carbide epitaxial layer stacked on the silicon carbide layer including the groove area. Consequently a silicon carbide semiconductor device can be manufactured without being affected by a c-facet appearing on a step of the groove and the occurrence of characteristic deterioration such as the increase of resistance due to the narrowing of a transmission line in the c-facet can be prevented.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004289908-A (JP)
Title: Manufacturing method for layered iron core
Inventor: MITSUI TAKAAKI
IPC: H02K1/18
Filed: 2003-03-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a layered iron core capable of preventing the deformation of the layered iron core, and preventing the lowering of magnetic characteristics of a stator core.  <P>SOLUTION: A lower-side divided iron core piece 15, a middle-side divided iron core piece 16, and an upper-side divided iron core piece 17 which are divided into a plurality of pieces at a forming position of a prescribed slot 11 are formed of band-shaped thin plate materials 36 and band-shaped thin plate materials 55. A divided iron core pieces block 13 which is formed by caulking and layering the lower side divided iron core piece 15, the middle side divided iron core piece 16, and the upper side divided iron core piece 17 is connected via hinges 28 formed at both ends of the block into a chain form and so as to be freely turnable and pulled out in a straight line form. The divided iron core pieces block 13 connected in a straight state is wound into a spiral form to be layered and formed.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004288007-A (JP)
Title: Digital image recorder, image viewer device, image reproduction program, and recording medium
Inventor: NOJIMA HIROYUKI
IPC: G06F12/00
Filed: 2003-03-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a digital image recorder for recording image data on a recording medium according to an own original file system without performing system conversion of the own original file system, an image viewer device capable of reproducing the image data written on the recording medium by a general-purpose personal computer, its image reproduction program, and the recording medium.  <P>SOLUTION: In this digital recorder 1 for recording the image data on the recording medium 20 according to the own original file system, this image recorder which can write management information recognizable by a personal computer mounted with a Windows OS and continuous information of image data by the own original file system in a pseudo FAT area of the recording medium 20.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004283128-A (JP)
Title: Method for producing high-quality (meth)acrylamide polymer using biocatalyst
Inventor: ISHII KATSUO
IPC: C12P13/02
Filed: 2003-03-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide an almost colorless (meth)acrylamide polymer having increased viscosity.  <P>SOLUTION: The method for the production of the (meth)acrylamide polymer comprises the reaction of (meth)acrylonitrile having a hydrocyanic acid concentration of ≤1 mg/Kg in the presence of a biocatalyst under a condition satisfying formula I: θ(c)/θ(L)<1.2 [θ(c) is the residence time of the biocatalyst; and θ(L) is the residence time of the reaction liquid] and the polymerization of the produced monomer containing (meth)acrylamide.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004292621-A (JP)
Title: Curable composition, sealing material and adhesive
Inventor: FUKUI KOJI
IPC: C08L101/10
Filed: 2003-03-26
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a curable composition which comprises a vinylic polymer having crosslinkable hydrolysable silyl groups and is quickly cured with moisture in the atmosphere to give a cured product having excellent elasticity and excellent transparency.  <P>SOLUTION: The curable composition is characterized by comprising a curable composition (a1) [excluding a filler (b)] containing the vinylic polymer (a) having at least the crosslinkable hydrolysable silyl groups and the filler (b) having a refractive index difference of ≤0.02 between the refractive index of the curable composition (a1) and the refractive index of the filler (b) is characterized in that the haze value of a 1 mm-thick cured coating film of the curable composition is ≤10.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004292748-A (JP)
Title: Aqueous polymer dispersion and coating agent containing the dispersion
Inventor: INUI KUNIHIRO
IPC: C09D133/00
Filed: 2003-03-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide an emulsion polymerization type resin capable of forming a coating film excellent in long term weather resistance and long term soil resistance, concretely excellent in luster maintaining property, crack resistance, yellowing resistance, waterproof property, etc., and also hardly being attached with soiling substances, and also excellent in freezing/thawing stability.  <P>SOLUTION: This aqueous dispersion of a polymer is obtained by the multiple stage emulsion polymerization of radically polymerizable unsaturated monomers capable of forming a polymer having (-)10-60°C range glass transition temperature is characterized by exhibiting the glass transition temperature [first stage] Tg obtained from the radically polymerizable unsaturated monomer used in a first stage polymerization lower by ≥50°C than the glass transition temperature [final] Tg obtained from a radically polymerizable unsaturated monomer used in the final stage polymerization, and performing the polymerization of a monomer containing a polymerizable ultraviolet light stabilizer as an essential component in the presence of a silane coupling agent having a cycloalkyl group in the final stage.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004295800-A (JP)
Title: Vending machine
Inventor: ANADA KOJI
IPC: G07F9/00
Filed: 2003-03-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a vending machine having simple structure and suitable for preventing such mischief as stealing commodity stored inside the vending machine by using a long and narrow tool or the like which is inserted into a commodity delivery outlet.  <P>SOLUTION: The vending machine comprises a shielding plate placed in the back of a commodity delivery outlet to prevent looking inside the vending machine main body through the commodity delivery outlet and a chute placed in the back of the shielding plate to guide commodity which is delivered from a commodity storing part placed in the above vending machine main body toward a commodity receiving part. This chute body consists of a first tilting plate disposed in the back of the shielding plate to guide the commodity delivered from the commodity holding part toward its downward direction and a second tilting plate placed in a different level with a predetermined gap with respect to the lower end of the first tilting plate to guide the commodity guided by the first tilting plate toward the commodity receiving part.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004291216-A (JP)
Title: Cutting machine for corrugated cardboard
Inventor: MAEDA SHIZUMASA
IPC: B26D1/24
Filed: 2003-03-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide a cutting machine for corrugated cardboard which reduces paper powder produced during the cutting and cuts even a thick corrugated board with ease.  <P>SOLUTION: The cutting machine is adapted to cut a large-sized corrugated cardboard D into corrugated cardboard pieces d with a predetermined width. A slitter 1 comprising a plurality of equally spaced semicircular blade edge sections 1a is moved forward at low speed while rotated at low speed, so that the blade edge sections 1a press and cut the corrugated cardboard D fixed on a fixed base 2 into the corrugated cardboard pieces d.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004303342-A (JP)
Title: Semiconductor storage
Inventor: WADA OSAMU
IPC: H01L27/04
Filed: 2003-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing influence exerted to data on a bit line at a portion adjacent to the bit line controlled by a different column selection signal in an early write operation.  <P>SOLUTION: A semiconductor storage includes first and second bit lines B3b, B0a, where data from first and second memory cells are read each by activating a word line W. A first dummy bit line DB is arranged between the first and second bit lines without interposing other bit lines for being fixed to the ground potential. First and second sense amplifiers SA3, SA0 amplify potential on the first and second bit lines each. Connection control sections S0, S1 perform control so that write data are supplied to the first or second bit line after the word line is activated and then the first and second sense amplifiers are operated.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004304019-A (JP)
Title: Connection pattern structure of circuit board, and circuit board
Inventor: ISHIZAKI YOSHINOBU
IPC: H05K3/32
Filed: 2003-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a connection pattern structure of a circuit board and the circuit board capable of reducing the melting of solder by spot welding, regarding the connection pattern structure of the circuit board and the circuit board for which a terminal is spot-welded to a conductive block soldered on the connection pattern of the circuit board.  <P>SOLUTION: In the connection pattern structure of the circuit board for which the terminals (21, 22) are spot-welded to the conductor blocks (32, 33) soldered to land parts (111, 112) formed on the circuit board (31), the land parts (111, 112) are provided with non-soldering parts (121, 122) where soldering is not performed on positions corresponding to positions (P1) where spot welding is performed on the conductor blocks (32, 33).  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004301446-A (JP)
Title: Heat transfer pipe for condenser
Inventor: TAKAHASHI HIROYUKI
IPC: F25B39/04
Filed: 2003-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a heat transfer pipe for a condenser capable of obtaining high heat transferring performance and reducing the pressure loss of the pipe even when a refrigerant meeting chlorofluorocarbon regulations is used.  <P>SOLUTION: A fin 1 extended in the orthogonal or oblique direction to the pipe axial direction is mounted on the outer face of a pipe body, and a rib 7 is mounted on an inner face. The fin 1 is provided with a plurality of first grooves 5 formed by dividing its peak along the direction in parallel with the fin, and a plurality of second grooves 2 formed by dividing the fin in its longitudinal direction. An angle (θ1) between side faces of the second groove 2 is 55° or less, and an opening angle θ4 of the rib observed from a cross section in the tube axial direction, of the rib 7 is 64-98°.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004306038-A (JP)
Title: Method and device for manufacturing linear body
Inventor: KOKURYO HIROAKI
IPC: B21F23/00
Filed: 2003-04-01
Abstract: <P>PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing device of a linear body by which the processing efficiency of the linear body, the yield and quality of processed the linear body are improved by surely clamping the linear body by preventing the insufficient clamping of the linear body when processing the linear body.  <P>SOLUTION: In the manufacturing method of the linear body in which a first clamp 21 and a second clamp 23 having clamping members 22, 25 for clamping the linear body W on both inlet and outlet sides thereof in a processing machine 17 are provided, and the linear body W is processed with the processing machine 17 after passing the body W through a first clamp 21, the working machine 17 and a second clamp 23 and clamping the body W by closing the clamping members 22, 25 of the first and the second clamps 21, 23. The body W is passed through the first and the second clamps 21, 23 by making at least the clamping member 25 of the second clamp 23 into a semi-closed position such that the body W is not pressed but confined within the range of the clamping member 25.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004310192-A (JP)
Title: Server, system, and method for information delivery, and display unit
Inventor: HACHITANI TAKUYA
IPC: G06Q50/00
Filed: 2003-04-02
Abstract: <P>PROBLEM TO BE SOLVED: To provide an information delivery server, a display unit, an information delivery system, and an information delivery method which are related to technology for repairing on the basis of a moving image file transmitted during failure and are intended for the reduction of the maintenance management cost of the entire system.  <P>SOLUTION: The information delivery server 10 is provided with a store information storage device 16, an operation achievement storage device 17, a moving image information storage means 18, a CPU 15, or the like. The CPU 15 is provided with an error reception means 15a for receiving failure data, a store information extraction means 15b for extracting store information, an error outline registration means 15c for registering operation achievement, an error code decision means 15d for deciding whether it is required to dispatch an engineer, an alarm notification means 15e for notifying error occurrence, a moving image file retrieval means 15f for retrieving a moving image file, a moving image file transmission means 15g for transmitting a moving image file, a store information registration means 15h for registering information on a store, a maintenance means 15i for transmitting maintenance moving images, or the like.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004311628-A (JP)
Title: Multilayer substrate and its manufacturing method
Inventor: TADA KAZUO
IPC: H05K1/16
Filed: 2003-04-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a multilayer substrate wherein thermoplastic resin films in which conductor patterns are formed are alternately stuck and generation of cracks to a built-in thin film resistor is restrained at the time of manufacturing, and to provide a method for manufacturing the multilayer substrate.  <P>SOLUTION: In the multilayer substrate 102, the thin film resistor 4 is included in resin base material 1 wherein a plurality of numbers of the thermoplastic resin films are laminated and mutually stuck in which conductor patterns constituted of metal foils are formed. Electrodes 5 are formed on the thin film resistor 4, and outer edges 5e of the electrodes 5 are covered with right above or just below conductor patterns 20a, 21a, 20b, 21b.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004312242-A (JP)
Title: Image forming apparatus
Inventor: SUZUKI CHIKATSU
IPC: G03G21/00
Filed: 2003-04-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image forming apparatus capable of efficiently utilizing a memory for storing image data.  <P>SOLUTION: The image forming apparatus for storing received image data, applying image processing to the image data as required and thereafter printing out the processed data on a transfer member, includes: a memory used for storing the received image data and for the image processing required at print; and a control means for controlling the storage of the image data to the memory at the reception and the image processing of the image data at print, and the control means is characterized in to reserve a prescribed capacity for the image processing applied to the image data to be printed by revising a threshold value for discrimination of limit of reading due to deficient memory capacity when storing the received image data.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2003345472-A (JP)
Title: Electric power profiling method and system for electric power profiling
Inventor: CYRAN ROBERT J
IPC: G06F11/34
Filed: 2003-04-04
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method to obtain an electric power profile information of a target system in an embedded application and its system.   <P>SOLUTION: This method recognizes a software which is selected from a plurality of software units constituting the application in the predefined order to generate execution data without stopping the embedded application, acquires electric power measurement data in executing the recognized software unit on the target system, and determines power consumption of the embedded application by executing a processing to correlate the electric power measurement data with the executing data for each software unit.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004312327-A (JP)
Title: Signal processing apparatus and method, as well as program
Inventor: FUKUSHIMA MASAKATSU
IPC: H04L7/00
Filed: 2003-04-07
Abstract: <P>PROBLEM TO BE SOLVED: To adequately inspect an output of a semiconductor device.  <P>SOLUTION: An output control unit 61 outputs the device data which is inputted from output control units 11, 13 and is outputted from a device 2 and the reference data from a data output unit 12 to an exclusive OR circuit 14, but outputs the preceding input data to the exclusive OR circuit 14 with a delay as much as the shift of input timing when such shift is included in the reference data from the output control unit 13. Namely, as a result, since the device data and reference data synchronously inputted to the exclusive OR circuit 14, the exclusive OR of the corresponding data can be obtained.  <P>COPYRIGHT: (C)2005,JPO&NCIPI