baber/WOPTO huggingface dataset:
Patent JP-H10115331-A (JP)
Title: Electromagnetic spring clutch
Inventor: AKASHI TOSHIAKI
IPC: F16D27/105
Filed: 1996-10-09
Abstract: PROBLEM TO BE SOLVED: To shorten a size in an axial direction, to reduce the weight and size, and to easily mount a clutch on a machine, by applying the structure that a coil spring, a rotor and a stator to be wound on a spring winding face of a rotary member, are successively fitted to the outside in a radius direction. SOLUTION: In the assembling order, a fitting part 3b of a hollow shift 3 is fitted to a center hole of a stator 9, one edge 6a of a coil spring 6 is latched to a hole 4d of a gear 4, and then an opening edge part of a covering member 7a to which the other edge 6b of the coil spring 6 is latched, is fitted to a small diameter fitting part 4e of the gear 4. Further the fitting part 4b of the gear 4 is fitted to the center hole of the stator 9 while building the covering member 7a and the rotor 8 into the center hole of the stator 9, in a condition that the coil spring 6 is wound on the spring winding face 3c of the hollow shaft 3. And the gear 4 is stopped by a stop ring 14 to the hollow shaft 3, thereby the assembling is completed.  As mentioned in the above, the structure that the members are successively built-in in the radius direction, is applied, so that the size in the axial direction can be shortened, and the weight and size can be reduced.
Patent JP-S63140345-A (JP)
Title: In-processor information dumping system
Inventor: TSURUYA HIROSHI
IPC: G06F11/34
Filed: 1986-12-02
Abstract: PURPOSE:To secure an effective program area widely, by enabling a part or the whole of a program area on a main memory device to be used as a processor information saving area. CONSTITUTION:A monitoring processor 1 monitors the operating status of an information processor via a monitoring bus 7 generally. When an error is generated and it is judged that it is impossible to continue an operation, the processor 1 issues indication to a disk processor 4 and makes it dump the content of the program area 2 on the main memory device 5. Next, the processor 1 issues the indication to each of the processors 2-4 and makes them store in-processor information in an in-processor information saving area 1 on the main memory device 5. Following that, the processor 1 issues the indication to the processor 4, and makes it dump the content of the saving area 2 on the disk device 6. In such way, it is possible to use a part or the whole of the program area as the processor information saving area, and to secure the effective program area over a wide range.
Patent JP-S61179999-A (JP)
Inventor: KIERU HOORESHIYUTEERU
IPC: E21D11/00
Filed: 1985-12-20
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H03149456-A (JP)
Title: Gear change control of automatic transmission
Inventor: ASADA TOSHIYUKI
IPC: F16H3/66
Filed: 1989-11-04
Abstract: PURPOSE:To reduce change gear shock by selecting an engagement/release pattern so as to make a number of frictional engaging means for changing over engagement/release condition in order to change gear to an upper stage or to a lower stage, no more than two. CONSTITUTION:In an automatic transmission in which first through third plane tary gear mechanisms 1-3 are arranged coaxially with input/output axes 4, 5, by preferentially engaging or releasing clutch means K1-K5 and braking means B1-B4, five-speed advance as well as astern stage are achieved. A pattern of engagement/release is selected so as to make a number of frictional engaging means that switches engagement/release condition for changing gear to upper stage or to lower stage, no more than two. For example, for 1-2 gear change, a brake B2 is released while B3 is engaged. At the time, K5 and B4 can be engaged, however, from the view point of control, they re preferred to be re leased. Switching timing of the frictional engaging means can thus be reduced, and change gear shock can be reduced thereby.
Patent JP-H06138979-A (JP)
Title: Portable terminal equipment
Inventor: SUZUKI HIDETAKA
IPC: G06F1/18
Filed: 1992-10-26
Abstract: PURPOSE:To apply power from an unloaded battery pack to a main body by providing a jack attachment port for applying power on the device main body and connecting it to the power connector of the battery pack by cable. CONSTITUTION:When an operator gets the information on low battery from warning such as message display in the case a battery pack 17 being loaded becomes a low-battery state, the device main bodys connected to an external battery pack 22 by means of a power cable 20. In this case, the current sent from a connection section A with the external power source is sent to a load D when the battery pack 17 is in a low battery state. Thus, even when the battery pack 17 being loaded is in a low battery state, the power is supplied from a spare battery pack 22 so that the operator can continue processing. In this case, the battery pack 17 can be removed and loaded again after charging.
Patent JP-S62132625-A (JP)
Title: Method of injection-molding plurality of synthetic material link element of link chain or link belt and mold for injection molding
Inventor: LIEBL RUDOLF
IPC: B29L31/12
Filed: 1986-12-04
Abstract: A link chain or string is produced in an injection molding tool in such a way that a plurality of links threaded onto a string or cable are molded simultaneously, for example in the form of spheres. In order to avoid the transmission of axial forces to the links, which forces might disturb the axial spacings from link to link, the injection molding tool is provided with restrictions which reduce the cross-sectional area of molten material flow channels to a minimum. Preferably, the restricted area is located directly at the respective link. The channels all lead to a common injection molding channel to which the molten material is supplied for thus simultaneously casting or molding of a plurality of links to strings or cables. The restrictions make sure that any forces resulting from shrinkage during the cooling and solidifying cannot shift the balls or links even if the latter are not yet completely solidified internally. Thus, errors in the on-center spacing between adjacent links are avoided.
Patent JP-H06138771-A (JP)
Title: Printer
Inventor: KOJIMA ETSURO
IPC: B41J2/00
Filed: 1992-10-27
Abstract: PURPOSE:To prevent the occurrence of uneven printing on printing paper by an electrophotographic printer. CONSTITUTION:Three slits 29 are provided at a partition separating a part where a stirring part 6 and a screw 5 in a developing device 2 other than a slit. A shutter 8 closing the respective slits 29, at ordinary times and opening them according to an opening signal and an opening/closing mechanism 28 having an arm moving the shutter 8 in parallel with the rotary shaft of a photosensitive drum 12 are fixed. A pattern sensor 9 detecting the density of toner transferred on the printing paper 11 in a transfer part 15 and outputting an electrical signal at a level in proportion to the density is provided corresponding to the shutter 29 by the same number. A developing control part 10 which detects the level of the signal outputted from the sensor 9 and outputs the opening signal when the detected level becomes equal to or under a previously set one is provided, and the toner supplied to the stirring part 6 through the slit 29 is partially supplied so as to average the density of the toner supplied to the photosensitive drum 12.
Patent JP-S62147297-A (JP)
Title: Improvement of heat exchanger
Inventor: KAIRIKU TSUTOMU
IPC: F28F9/22
Filed: 1985-12-20
Abstract: PURPOSE:To preclude bypass current to improve a thermal efficiency and prevent mechanical damages to restrain errosion as well as electric corrosion by a method wherein elastomer sealing is applied to a gap between a baffle plate and the inner wall of the cylinder of a shell as well as the gap between the tube inserting hole of the baffle plate and a tube. CONSTITUTION:An elastomer sealing member 21 is constituted of a fixing part 21a, covering, pinching and fixing the circumferential wall of the tube inserting hole 20 of a baffle plate 10, and a seal lip 21b while the seal lip 21b is provided at the high-pressure side of cooling water and is contacted with both of the outer peripheral surface of a tube 15 and the surface of the baffle plate 10 to effect sealing effect. Another elastomer sealing member 22 is constituted of a fixing part 22a, attached and fixed to the baffle plate 10, and the seal lip 22b while the fixing part 22a is provided with an engaging protuberance for fitting and fixing the fixing part 22a to dovetail groove on the whole circumferential surface of the arc of the baffle plate 10. the seal lip 22b is provided at the high-pressure side of cooling water and is contacted with the high-pressure side of the baffle plate 10 and the inner surface of the cylinder 1 of a shell to effect self sealing effect.
Patent JP-H02134227-A (JP)
Title: Extrusion molding apparatus for continuous length resin molding
Inventor: SHIMIZU SHOHACHI
IPC: B29C48/30
Filed: 1988-11-15
Abstract: PURPOSE:To simplify setting of mold and make the work efficient by separating and transporting at return conduits formed at both sides of a molding conduit, and letting the article configuration surface of a half-split mold to be transported and circulated in the condition of being always faced to the molding conduit. CONSTITUTION:In an extrude molding apparatus 100, at first, a mold 200 positioned at the terminal end of return conduits 3 is die-matched by combining means 10, and next, while the mold 200 is being guided in the condition of being die-matched by the guide plate of guide means 40, the molding conduit 2 on a base 1 is moved from a resin injection side to an extrusion side by transporting means 30; at the same time, the mold 200 during the transporting period in the molding conduit 2 is cooled by cooling means 50, and separated to be straddled into both ends of the base 1 after completion of the molding. In the next place, at a speed faster than the speed of being moved in the molding conduit 2 on the base 1, it is returned up to the terminal end of the return conduits 3 as a first molding commence position, and taken into the die-matching condition again by the combining means 10, thereby manufacturing a continuous length resin molding by repeating this process.
Patent JP-H03149924-A (JP)
Title: Error correcting decoder
Inventor: NAKAMURA TAKAHIKO
IPC: G06F11/10
Filed: 1989-11-06
Abstract: PURPOSE:To attain burst error correction at high speed by retrieving a ROM having a conversion table, and obtaining a burst error location from a specific burst error pattern and the value of a syndrome. CONSTITUTION:The decoder is provided with a syndrome generating section 13, an arithmetic section 19 and a burst error correction section 26, and S<3>1/S3 or S3/S1<3> is calculated from syndromes S1, S3 for random error correction, and the result of calculation is used as an address to retrieve a burst error pattern calculated and stored in advance in a ROM is retrieved to correct the burst error of a received word. Thus, an error correction decoder capable of high speed decoding and easily used also for random error correction function is realized.
Patent JP-H10129741-A (JP)
Title: Light-shading paper cup
Inventor: YANAI KUNIO
IPC: B32B27/32
Filed: 1996-10-30
Abstract: PROBLEM TO BE SOLVED: To provide a light-shading cup of paper which appears nice, is hygienic, and keeps the commercial value unimpaired, relating to a type which does not contain a layer of metal and enables applying a metal detector for the quality control of the contents, particularly concerning foods or beverages, by making inconspicuous the black polyethylene-forced out on the ends of the barrel, being a splice in the internal surface of the cup, or on the end of the bent bottom. SOLUTION: The light-shading layer 10 of a light-shading paper cup 1 consists of colored polyethylene. In a conventional light-shading paper cup black polyethylene 10a as a light-shading layer 10 is forced out on the ends 30 of the barrel, etc., so conspicuously that it gives an unhygienic feeling to the consumer. This invention improves on this polyethylene, making the color inconspicuous and felt with cleanliness and yet without impairment of the light-shading property.
Patent JP-2000110396-A (JP)
Title: Method for constructing fire protection water tank of cast-in-place concrete and fire protection water tank of cast-in-place-concrete
Inventor: KOBAYASHI KAZUHIRO
IPC: E04H7/18
Filed: 1998-10-09
Abstract: PROBLEM TO BE SOLVED: To construct a fire protection water tank of cast-in-place concrete which is unitized and can be easily constructed in a narrow area, which does not allow the entrance of a car of middle or large size. SOLUTION: A plurality of units, each of which is of such size that the unit can be carried by a small transportation means which can get into a narrow area, which area does not allow the entrance of a car of middle or large size, are connected one to another to form a side wall 2, a bottom panel 3, and a top panel 4 of a fire protection water tank 1 of cast-in-place concrete by arranging forms and reinforcing bars. And the central portion of a top panel permanent form forming the underside surface of the top panel 4 is supported by a support 40 formed by using a support permanent form. The shape of a side wall form 5 of the side wall 2 having a cylindrical shape is adjusted by handling turnbuckle braces 8 disposed radially with respect to split side wall form units 6 constituting the form 5.
Patent JP-H01129437-A (JP)
Title: Method of shifting wafer
Inventor: KINOSHITA KENICHI
IPC: H01L21/68
Filed: 1987-11-16
Abstract: PURPOSE:To shorten exchange work, and to improve the efficiency of shifting remarkably by installing a control mechanism moving a wafer chuck only by a distance corresponding to the difference of the groove pitches of a carrier and the groove pitches of the chuck. CONSTITUTION:A wafer 27 at the left end of a carrier 281 is engaged with the left end of a wafer chuck 24, a pulse motor is turned for a fixed time from a control mechanism, and the wafer chuck 24 is transferred only by a distance (a 3/16 inch pitch) corresponding to the difference of the groove pitches of the carrier 281 and groove pitches among pawls for the chuck 24 in the left direction. A cylinder 8 for a push-up mechanism 6 is driven and No.2 piston 7 from a left end is lowered, a push-up plate 9 is brought down between-open- close plates 25a, 25b under the closed state of the wafer chuck 24, and the wafer 27 is engaged with a groove between No.2 pawls from left ends formed to molding sections 26a, 26b for the open-close plates 25a, 25b. The movement of a distance corresponding to the 3/16 inch pitch in the left direction of said wafer chuck 24 and the descent of No.3 and subsequent push-up plate 9 are repeated, thus connecting the wafer 27 into the groove between the pawls at the double pitches of the carrier 281 shaped to the wafer chuck 24.
Patent JP-H01110708-A (JP)
Title: Ferrite sintered body, chip inductor and lc composite component
Inventor: WATANABE HIDEO
IPC: H01F1/36
Filed: 1987-11-16
Abstract: PURPOSE:To obtain the ferrite sintered body, the chip inductor and the like having a high degree of mechanical strength, a low sintering temperature and excellent high frequency characteristics by a method wherein the material, containing ferrite and boron-silicate glass and also having the content of the boron-silicate glass within the prescribed range, is used. CONSTITUTION:The material containing ferrite and boron-silicate glass, the content of the latter being 15-75wt.%, is used. In the chip inductor 1 which is formed by laminating a ceramic magnetic layer 3 and an internal conducting layer 2, ferrite and boron-silicate glass is contained in the ceramic magnetic layer 3. In the ceramic LC composite part 5 in which a capacitor part 7, formed by laminating a ceramic 71 and an electrode layer 5, and an inductor part 6, formed by laminating a ferrite magnetic layer 61 and an internal conducting layer 65, are integrally formed, the ceramic magnetic layer 61 contains ferrite and boron-silicate glass. The silicon oxide of 75-90wt.% and the boron oxide of 8-20wt.% are contained in the above-mentioned boron-silicate glass, for example.
Patent JP-2000124258-A (JP)
Title: Semiconductor device and manufacture thereof
Inventor: MURAYAMA HIROSHI
IPC: H01L23/12
Filed: 1998-10-12
Abstract: PROBLEM TO BE SOLVED: To obtain a semiconductor device which realizes miniaturization thereof and easy manufacturing thereof by eliminating the need for providing a subwiring substrate. SOLUTION: A rewiring circuit 120 connected to electrodes of a semiconductor chip 10 is formed on an insulating layer 100 which covers the active surface of the semiconductor chip 10. Then inner bumps 140 are formed on conductor pads 122 formed at parts of the rewiring circuit 120 as being projected therefrom. An insulating film 160 is continuously coated on the rewiring circuit 120 and on the insulating layer 100 around the rewiring circuit, and the inner bumps 140 are fitted in through-holes 180 made in the film 160. Outer bumps 200 are formed on the parts of the film 160, having the holes 180 projected outward of the film 160 and being overlapped with the inner bumps 140.
Patent JP-S62151177-A (JP)
Title: Production of mold spore by liquid cultivation
Inventor: YASUI TAKAO
IPC: C12R1/645
Filed: 1985-12-24
Abstract: PURPOSE:To produce spores of mold in high efficiency in a germ-free state under aerobic condition of conventional aeration and agitation culture and wide pH condition, by aerobically culturing a mold in a liquid medium composed mainly of boiled soybean soup. CONSTITUTION:A mold belonging to Aspergillus genus, Trichoderma genus, Mucor genus or Monascus genus is aerobically cultured in a liquid medium containing boiled soybean soup as a main component. The pH of the medium is 5.0-8.3. The concentration of the soybean soup in the medium is preferably about 20% and the medium is preferably added with proper inorganic salt, etc.
Patent JP-H02135557-A (JP)
Title: Data bus system
Inventor: SHIODA IORI
IPC: G06F13/00
Filed: 1988-11-16
Abstract: PURPOSE:To prevent data transfer competition on a local bus from affecting the transfer of a system bus by separating a local bus from a system bus control part by means of a line corresponding part, and providing a transfer managing part between them. CONSTITUTION:A transfer managing part 10 is provided between a system bus control part 7 and a local bus 2 in a line corresponding part, and the transfer managing part 10 provides special FIFO memories 13 and 15 and DMA transfer control parts 14 and 16 for the transfer of a system bus 1. When the system bus control part 7 activates a transmission DMA transfer control part 14 of the transfer supervisory part 10, the transmission DMA transfer control part 14 starts the transfer from a data memory 6 to the FIFO memory 13 for the transmission data. When the FIFO memory 13 is filled, the transmission DMA control part 14 transfers the data from the data memory 6 to the system bus control part 7 by alternately using FIFO memory 132 surfaces for the transmission data. Thus, the transfer of the system bus is not made to stand by due to the competition of the local bus during the reception of the data.
Patent JP-H02134821-A (JP)
Title: Polyimide baking device
Inventor: KATO SHIGEKI
IPC: G01K7/02
Filed: 1988-11-15
Abstract: PURPOSE:To obtain a device which has high adhesion with a foundation and forms a polyimide film which produces little leak current by providing a specific temperature measuring instrument through infrared ray, a specific heater and heater controlling device and a specific imidation rate measuring device and by carrying out imide- processing of a polyimide film while measuring the imidation rate. CONSTITUTION:The device is provided with a temperature measuring instrument 1 through infrared rays which scans on a polyimide film applied onto semiconductor substrate 4 and measures a temperature of the polyimide film and a temperature distribution, a plurality of heaters 7 built in a heating base 5 to control the temperature and a heater control device to control the heaters 7, and imide-processing rate measuring devices 2, 3 to measure the imide-processing rate by irradiating infrared ray 6 onto the polyimide film and by measuring the amount of the reflected light. The device performs imide-processing of the polyimide film while measuring the imide- processing rate. According to this constitution, it is possible to make a uniform temperature distribution all over the polyimide film, to obtain a high imide-processing rate uniformly all over, and to obtain the device which can form a polyimide film which has high adhesion and little leak current.
Patent JP-H03149453-A (JP)
Title: Velocity controller of working car
Inventor: MINAMI TERUO
IPC: A01D69/00
Filed: 1989-11-07
Abstract: PURPOSE:To prevent unnecessary deceleration during non-operation by setting a value for working mode in such a way that a load is larger than a reference value corresponding to a non-load condition, and by setting a value for non- working period in such a way that a load is smaller than the set value for working period and larger than the reference value. CONSTITUTION:Whether a working car is in operating mode or non-operating mode is judged by a controller 11 based on the information of a share base sensor S0. At the time of working, velocity is decreased when an engine load is larger than a set value for working mode, while, at the time of non-working, velocity is decreased when the engine load is larger than a set value for non- working mode. A value for working (N0-n2) is set by subtracting the set value from a reference rotational number N0, while a value for non-working mode (N0-n3) is set as a middle value between the reference rotational number 0 and the set value for working mode (N0-n2), i.e., a load is smaller than the set value for working mode (N0-n2) and is larger than that in a non-load condi tion.
Patent JP-H03150132-A (JP)
Title: Bonding method using thermoplastic material
Inventor: MIYAKI KATSUMI
IPC: B29C65/08
Filed: 1989-11-07
Abstract: PURPOSE:To shorten the bonding time and enhance general-purpose properties by applying supersonic vibration while pressing a thermoplastic material by means of a supersonic vibration transmitting component, heat melting a pressed section, tack welding a melted section with a first component and bonding the section on which a bonding agent is tack welded with a second component. CONSTITUTION:A vibrator 26 and a supersonic vibration transmitter 27 are lowered integrally, and a conductive bonding agent 8 is pressed to electrodes 2 on a semiconductor chip 1 by a press surface 27a of the supersonic vibration transmitter 27. When a supersonic generator 29 is actuated, an electrical signal is converted to a mechanical supersonic vibration by a vibrator 26 and enlarged by the supersonic vibration transmitter 27 to be transferred to a release paper 9 and the conductive bonding agent 8. Sections in contact with the upper surfaces of respective electrodes 2 of the conductive bonding agent 8 are heat developed and melted. When the supersonic generator 29 is stopped while being pressed by the supersonic vibration transmitter 27, molten bonding agent 8a is solidified and tack welded on the upper sections of electrodes 2. A semiconductor chip 1 is placed on a base 3 so that respective electrodes 2 are brought into contact with respective electrodes 4 through the bonding agent i, and the supersonic vibration transmitter 27 is lowered again to apply supersonic vibration, and the bonding agent 8 is solidified to bond the electrodes 2 with the electrodes 4.