baber/WOPTO huggingface dataset:
Patent TW-407074-B (TW)
Title: Method and apparatus for manufacturing a length of connected pocketed coil springs
Inventor: MAULDIN MICHAEL
IPC: C21D9/02
Filed: 1998-06-16
Granted: 2000-10-01
Abstract: A method and apparatus for forming a length of connected, pocketed coil springs to be used in mattresses and the like where wire from a supply source is heated to between 450 DEG F and 500 DEG F by an induction heater before the wire is coiled. Thereafter, the wire is hot coiled, severed and cooled below a temperature where a permanent set might occur from further processing of the spring. Thereafter, the spring is compressed in preparation for its insertion into a space provided by stretchable fabric from a supply reel. The fabric is folded on itself to provide the space. The temperature of the spring must also be sufficiently low to contact the fabric without causing burns or other damage. After insertion of a compressed spring into the space, the fabric is ultrasonically welded to create individual but connected pockets for each spring. Thereafter, the springs are oriented to allow each spring to expand thereby creating the length of connected, pocketed coil springs.
Patent TW-382881-B (TW)
Title: Low thermal expansion circuit board and multilayer wiring circuit board
Inventor: INOUE YASUSHI
IPC: H05K1/05
Filed: 1998-10-15
Granted: 2000-02-21
Abstract: A low thermal expansion circuit board 1 on which a semiconductor element can be mounted with ease and high reliability, which comprises an insulating layer 3 having an Ni-Fe-bases alloy foil or a titanium foil as a core, a wiring conductor 4 on both sides thereof, and an adhesive resin layer 5 on the side on which a semiconductor element is to be mounted.
Patent TW-417304-B (TW)
Title: Nonvolatile semiconductor memory device whose addresses are selected in a multiple manner
Inventor: TOKUSHIGE KAORU
IPC: G11C16/16
Filed: 1998-11-06
Granted: 2001-01-01
Abstract: A block size buffer and block address pre-decoder are provided for a flash memory. At the time of data erase, the size of a block to be erased is input to the block size buffer and a set of block addresses is input to the block address pre-decoder. An output signal of the block size buffer is supplied to and decoded by the block address pre-decoder, a row decoder is controlled based on the result of pre-decoding, and a plurality of addressing including the above block address as a top address are selected in a multiple manner. Then, a plurality of successive blocks are simultaneously selected to simultaneously erase data in the memory cells in the plurality of blocks.
Patent TW-400387-B (TW)
Title: Cooling plate for the well type furnaces
Inventor: SMIALEK KARL HEINZ
IPC: B23C3/30
Filed: 1999-01-13
Granted: 2000-08-01
Abstract: A cooling plate, for a well type furnace equipped with refractory lining (especially shaft furnace), is composed of copper or low content copper alloy with cooling duct. The cooling plate is manufactured from a wrought or rolled ingot with grooves formed on the front side for receiving refractory material. Cooling ducts are defined on the rear side of the cooling plate, being partially defined by the cooling plate and also partially by sheet metal pieces, having milled ducts in their surfaces.
Patent TW-393416-B (TW)
Title: Improved floating offshore structure
Inventor: FRAYSSE PHILIPPE
IPC: B63B35/44
Filed: 1999-04-12
Granted: 2000-06-11
Abstract: The floating structure has an angle of oscillation I at most equal to about 10 DEG.  The structure bears an air distillation column with cross-corrugated packing.  The configuration of the corrugations of the corrugated strips (4A) of at least one length of the packing is chosen to be such that d/I<0.6, where d is the deviation from the axis (18) of the cone in which the liquid spreads out, when each pair of adjacent strips of the length is inclined by the angle I in its general plane.  Application to the production of oxygen by the distillation of air on barges of oil platform.
Patent TW-407361-B (TW)
Title: Electric Static Discharge protection (ESD) circuit structure
Inventor: SHIU JEN-TSUNG
IPC: H01L23/60
Filed: 1999-05-27
Granted: 2000-10-01
Abstract: An Electric Static Discharge (ESD) protection circuit structure. Fabricate the grid shape of floating metal silicide when connecting the contact window of the input line to the edge of the gate of the drain region. This could attract the electric static discharge current and circumvent the current roadpath, prolong effectively the extinction length of the electric power so that the current produced by the electricstatic discharge could be distributed uniformly, avoiding from producing high temperature at local region that causes the destruction of the integrated circuit structure, to achieve the purpose of enhancing the electricstatic discharge protection (ESD) ability.
Patent TW-583142-B (TW)
Title: Method and composition for inhibiting growth of microorganisms including peracetic acid and a non-oxidizing biocide
Inventor: LAZONBY JUDY G
IPC: C02F1/72
Filed: 1999-07-06
Granted: 2004-04-11
Abstract: The present invention provides a composition and method of administering same for inhibiting the growth of microorganisms. The composition of the present invention includes sufficient amounts of peracetic and a non-oxidizing biocide. The method of the present invention includes the step of adding sufficient amounts of peracetic acid and the non-oxidizing biocide to industrial process waters.
Patent TW-504448-B (TW)
Title: Abnormal mold detector
Inventor: AKINARI CHISATO
IPC: B29C45/40
Filed: 1999-08-21
Granted: 2002-10-01
Abstract: An abnormal mold detector is provided that can previously detect the breakage of a mold tool with an ejector plate. A pressure sensor is attached to the ejector pin of a mold to detect the mold internal pressure. The operation status of the mold is detected by the sensor attached to the mold piece of the mold. A device for detecting abnormality, formed of a CPU, processes the detected pressure signal and the mold working state indicating signal. The device for detecting abnormality sets a reference value D exceeding a normal sticking resistance of the ejector pin. As a material is injected, the mold internal pressure increases during one cycle (A and B) in the molding step. After the molding process, the ejection process is carried out by the ejector pin during the value C. When a sticking resistance exceeding the value D is confirmed during the monitoring operation (FF), the device for detecting abnormality decides that there may be the possibility that an abnormal state occurs in the mold tool. Thus the A device for detecting abnormality issues an alarm signal to the operator to halt the operation of the molding machine.
Patent TW-421604-B (TW)
Title: Plate-shaped gym exerciser and method for manufacturing same
Inventor: YANG SHAU-FU
IPC: A63C5/00
Filed: 1999-09-07
Granted: 2001-02-11
Abstract: This invention discloses a plate-shaped gym exerciser and its manufacturing method, where an upper and a lower fibrous board, a main body, an upper and a lower external flange, that are of high integrity, strength, and light weight, are made independently. These elements are then arranged and thermally pressed to form an integral body so as to increase manufacturing efficiency and to allow batch production. Even after the shoe boots secured above the exerciser are under forces, their bolting elements are prevented from damages, whereby the life span of the plate-shaped gym exerciser is increased, the appearance is improved, and the overall effectiveness is enhanced.
Patent TW-518367-B (TW)
Title: Plasma treatment apparatus and plasma treatment method performed by use of the same apparatus
Inventor: SAWADA YASUSHI
IPC: H01J37/32
Filed: 1999-10-22
Granted: 2003-01-21
Abstract: A plasma treatment apparatus capable of efficiently performing a plasma treatment to a large area of an object while preventing the occurrence of streamer discharge is provided. The apparatus includes at least one pair of electrodes, gas supply unit for supplying a gas for plasma generation to a discharge space defined between the electrodes, and an electric power supply for applying an AC voltage between the electrodes to generate plasma of the gas for plasma generation in the discharge space. At least one of the pair of electrodes has a dielectric layer at an outer surface thereof. At least one of the pair of electrodes has a curved surface jutting into the discharge space. It is preferred that the electrodes are of a cylindrical structure. In this case, it is particularly preferred that the plasma treatment apparatus further includes a coolant supply unit for supplying a coolant to the interior of the electrodes to reduce an electrode temperature during the plasma treatment.
Patent TW-445375-B (TW)
Title: Vehicle operation management system and digital vehicle operation recording apparatus
Inventor: EZAWA RYOJI
IPC: G01P15/18
Filed: 1999-11-15
Granted: 2001-07-11
Abstract: In order to control reckless drive, to instruct safety drive and to analyze accident conditions, the present state of a vehicle during the operation is recognized and the impact applied to the vehicle itself is continuously detected such that data of vehicle is recorded. This vehicle operation management system is composed of the followings: an onboard device part A, which is used to detect the impact and the speed generated during the travel of the vehicle or at the stoppage in the manner of signals so as to display and record the signals as well as the various kinds of data relating to a driver and the vehicle; and a management department machine part B, which is used to control the signals and the data from the onboard device part A. In the onboard device part A, the signals from an acceleration sensor 6 and the data stated above are mainly recorded in a memory card 5, the operation state of the vehicle is displayed and the various kinds of condition setting are performed. By reading the recorded signals and the various kinds of data in the management department machine part B through the use of the memory card 5, the operation condition of the vehicle is recorded, preserved, displayed and analyzed.
Patent TW-460826-B (TW)
Title: Thin film switch circuit board having gas chamber for pressure adjustment
Inventor: YEH CHI-PIN
IPC: A45D44/12
Filed: 2000-03-31
Granted: 2001-10-21
Abstract: The present invention provides a kind of thin film switch circuit board used for a computer keyboard. The computer keyboard contains one base stage and at least one keystroke structure. The thin film switch circuit board is installed between the base stage and the keystroke structure. The thin film switch circuit contains an upper thin film circuit layer, a lower thin film circuit layer, and at least one gas chamber for pressure adjustment installed on the thin film switch circuit board. The upper thin film circuit layer contains at lest one upper contact point, and the lower thin film circuit layer contains the lower contact point corresponding to the upper contact point. The lower thin film layer is located under the upper thin film circuit layer and can be bonded in a sticking manner such that a prearranged space containing air is formed between the upper and the lower contact points. Therefore, a predetermined height for the separation between the upper and the lower contact points is formed. The keystroke structure can enable the upper contact point to touch a corresponding lower contact point so as to generate a corresponding keystroke signal. The gas chamber for pressure adjustment is intercommunicated with the prearranged space and is used to adjust the gas pressure inside the prearranged space. When the external gas pressure is changed, the volume of the gas chamber for pressure adjustment is followed to increase or diminish so as to adjust the gas pressure inside the prearranged space. Therefore, the upper contact point is made enabled by the keystroke structure in order to contact the corresponding lower contact point, or the separation distance between the upper and the lower contact points is made to maintain appropriately equal to the predetermined height.
Patent TW-449551-B (TW)
Title: Nonwoven sheets, adhesive articles, and methods for making the same
Inventor: SWANSON DAVID P
IPC: C09J7/21
Filed: 2000-05-18
Granted: 2001-08-11
Abstract: Nonwoven sheet materials, and adhesive articles formed therefrom are provided that are made with fibers, preferably tensilized nonfracturable staple fibers, and binder fibers, and formed from a combination of interbonding, smooth roll calendering, and pattern embossing techniques. These sheet materials are especially useful as tape backings that are finger tearable in the cross web and the down web directions and also possess a number of other desirable properties, including acceptable tensile strength and enhanced overtaping, for example. A nonwoven sheet material, and adhesive article including the same, can include an embossed pattern having a variety of discontinuous configurations to enhance tearing properties in both the down web and cross web directions.
Patent TW-541805-B (TW)
Title: Receiving device and method for multimedia information
Inventor: ICHIGUCHI TETSUICHIRO
IPC: H04N19/895
Filed: 2000-06-01
Granted: 2003-07-11
Abstract: In a multimedia separation portion, the data separation portion is divided into video packets and audio packets. Through the CRC code separation portion, the CRC operation portion again executes the same operation as the operation executed at the encoding side, and outputting the operation result to the fault information attachment portion. The fault information attachment portion is used to compare the operation result and the CRC code attached with the video packet to see if they are matched. Thus, once the determination is made, the fault information attachment portion will treat the determination result as the fault information which is attached with the video packet as a new video packet to pass the buffer and output to the video decoder.
Patent TW-524854-B (TW)
Title: Method and apparatus for producing fine wire
Inventor: GRAF RALPH ARMIN
IPC: C21D9/64
Filed: 2000-08-25
Granted: 2003-03-21
Abstract: In a method for producing fine wire, especially card wire, in which an optionally already treated, especially drawn, wire blank is transformed into a drawable state by a heat treatment process, is subsequently drawn, and then hardened and tempered for obtaining predetermined mechanical properties, a further development is suggested according to which, for hardening and tempering, the drawn wire passes through at least one furnace and/or cooling device previously already used for performing the heat treatment process.
Patent TW-507201-B (TW)
Title: Semiconductor memory device
Inventor: YAMADA SHIGEKASU
IPC: H01L27/115
Filed: 2000-09-29
Granted: 2002-10-21
Abstract: A wordline tracking structure for use in an array or flash EEPROM memory calls is provided. The tracking structure serves to match reference and sector core wordline voltages across the entire chip regardless of sector location. The tracking structure includes a second VPXG conductor line operatively connected between sector wordlines of a ""far"" sector and a reference cell mini-array. The second VPXG conductor line has a substantially smaller time constant than in a first VPXG conductor line operatively connected between an output of a boosting circuit and the sector wordlines of the ""far"" sector. As a consequence, the reference wordline voltage associated with the reference cell mini-array will track closely the sector wordline voltage during the read operation regardless of the location of the selected sector.
Patent TW-515735-B (TW)
Title: Semiconductor device manufacturing method, electronic parts mounting method and heating/melting process equipment
Inventor: MATSUKI HIROHISA
IPC: B23K35/38
Filed: 2000-10-12
Granted: 2003-01-01
Abstract: There is provided a semiconductor device manufacturing method which comprising the steps of forming solder bumps on an underlying metal film of a semiconductor device, and placing the semiconductor device and the solder layer in a reduced pressure atmosphere containing a formic acid to heat the solder bumps. Accordingly, the solder bumps can be formed without the use of flux not to generate voids in the solder layer, and also the cleaning required after the solder bumps are formed can be omitted.
Patent TW-569051-B (TW)
Title: Package article for removably accepting a fiber optic cable and method for using same
Inventor: CHAN BENSON
IPC: H01S5/022
Filed: 2000-10-17
Granted: 2004-01-01
Abstract: A package is described that couples a twelve channel wide fiber optic cable to a twelve channel vertical cavity surface emitting laser (VCSEL) transmitter and a multiple channel perpendicularly aligned integrated die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.
Patent TW-506125-B (TW)
Title: Fully amorphized source/drain for leaky junctions
Inventor: CROWDER SCOTT
IPC: H01L21/265
Filed: 2000-10-25
Granted: 2002-10-11
Abstract: A semiconductor device having a silicon-on-insulator (SOI) structure includes a field-effect transistor having amorphized source and drain regions formed by implanting silicon or germanium ions into a silicon layer formed over a buried insulator. The fully amorphized source and drain regions ultimately result in permanent crystalline defects that cause p-n junction leakage which allows charge in the body of the device to dissipate, thereby improving the overall efficiency and performance of the device. The source and drain regions are amorphized throughout their entire thickness to prevent single crystal re-crystallization from occurring during annealing and other subsequent processing steps that can degrade the quality of the p-n leakage junctions.
Patent TW-581656-B (TW)
Title: Stable dispersions of propanil
Inventor: BEAN TIMOTHY ANDREW
IPC: C08K5/00
Filed: 2000-10-26
Granted: 2004-04-01
Abstract: The present invention provides stable dispersions of propanil herbicide in an agricultural oil wherein the dispersion contains an oil-soluble polymer which comprises one or more alkyl methacrylates and/or alkyl acrylates and one or more copolymerized polar monomers selected from N-vinylpyrrolidone, hydroxyalkyl methacrylate, dimethylaminopropyl methacrylate and dimethylaminopropyl methacrylamide. Also provided are methods to prepare the dispersions.
Patent TW-526376-B (TW)
Title: Liquid crystal display device and its manufacturing method
Inventor: HARUHARA KAZUYUKI
IPC: G02F1/1339
Filed: 2000-11-02
Granted: 2003-04-01
Abstract: The liquid crystal display device of the present invention comprises: a first substrate; a column spacer with a light shielding feature formed on the first substrate; a wiring film formed by covering at least one part of the column spacer; a second substrate oppositely arranged with the first substrate at a predetermined gap by the column spacer; and liquid crystal component arranged in the predetermined gap, which is characterized in that: the column spacer has a right taper shape from the view of the first substrate on its part closest to the second substrate, and has a maximum diameter at a part other than where the column spacer is closest to the first substrate.
Patent TW-463136-B (TW)
Title: Coin-type determining device
Inventor: HIBARI EIKO
IPC: G07D5/10
Filed: 2000-12-11
Granted: 2001-11-11
Abstract: The coin-type determining device is provided for determining the presence or absence of inclined notches formed on the circumferential surface of the coin transferred through a coin transfer path, which comprises: a plurality of notch detecting devices provided separately from each other with respect to an axis of the coin; a determining device for determining the presence or absence of inclined notches based on the difference between the notch detection results from the notch detecting devices.
Patent TW-480236-B (TW)
Title: Transmission for unit swing type engine
Inventor: NARA KAZUHIRO
IPC: B62M7/12
Filed: 2000-12-19
Granted: 2002-03-21
Abstract: This invention provides a transmission for a unit swinging type engine capable of securing a high degree of freedom in the hub shape of the rear wheel of a motorcycle while intending for a compact size around a driven shaft, a light weight, and noise reduction. In this transmission for a unit swinging type engine, a V belt type automatic transmission to transmit power to a driven shaft 25 extending in the width direction of a vehicle from a driving pulley supported by a crank shaft extending in the width direction of a body through a V belt 37 and a driven pulley 30, and a speed reducing gear to transmit power to an output shaft 27 from one end of the driven shaft 25 in the width direction of the vehicle through reduction gears 38-41 are disposed in a transmission case 3 extending toward the back of the body from one side of the crank case of the engine in the width direction of the vehicle. The driven shaft 25 is disposed parallel to the output shaft 27 by separating them frontward and backward, the driven shaft 25 is doubly supported by a pair of right and left bearings 28, 29, and the driven pulley 30 of the V belt type automatic transmission is supported between the right and left bearings 28, 29 of the driven shaft 25.
Patent TW-494550-B (TW)
Title: Manufacture method of annular cathode electrode contact region for tin bump manufacture process
Inventor: CHING KAI-MING
IPC: H01L23/28
Filed: 2000-12-19
Granted: 2002-07-11
Abstract: This invention provides a Manufacture method of annular cathode electrode contact region for tin bump manufacture process, which consists of following steps: providing semiconductor wafer with integrated circuit device completely formed and being connected through a plural number of metal pads protected by passivation layer, in which the metal pads are provided for the conductive bump manufacture process of I/O ball-shape lead, the wafer has under bump seed layer formed and all area on the wafer top surface containing metal pads is used as electrode for the electroplating of metal layer; forming a dry film on the seed layer; using organic solvent or inorganic solvent to remove the dry film at the wafer edge to expose the annular seed layer surface for the preparation of the annular cathode electrode contact region; then, forming a protection layer on the exposed dry film using water-soluble polymer to prevent oxygen attack and thus decrease in photosensitivity during lithography process; and finally, performing lithography process to expose the non-electroplating region and developing and using the non-electroplating region as mask and the annular cathode electrode contact region as electrode to perform electroplating process.