baber/WOPTO huggingface dataset:
Patent TW-563388-B (TW)
Title: Surface mount process for double-sided circuit module
Inventor: TSAI CHIOU-FENG
IPC: H05K1/11
Filed: 2001-05-30
Granted: 2003-11-21
Abstract: The present invention provides a surface mount process for double-sided circuit module, which can be used to mount the electronic components on the front face and the back face of the laminated circuit board, so as to produce a plurality of circuit modules in batches. The surface mount process for double-sided circuit module is characterized in that: the plurality of single sheet of printed circuit board employed in the laminated circuit board is divided into two sets previously during the layout design; and making the component layout pattern on the front face of the first set of single sheet of printed circuit board and the component layout pattern on the back face of the second set of single sheet of printed circuit board face toward the second face. Thus, the overall component layout pattern for the first face and the second face of the laminated circuit board can be completely the same. The method can make the surface mount process only need to use one mount control program and a layout steel plate to provide more cost efficiency for the process.
Patent TW-I221243-B (TW)
Title: Storage communication network interface card for communication protocol device providing dual interfaces
Inventor: LIOU WEN-TSUNG
IPC: G06F3/00
Filed: 2001-07-18
Granted: 2004-09-21
Abstract: The invention provides a storage communication network interface card interface, particularly specifying a dual-interface integrated device providing both the interface of the communication transmission protocol and the interface of the storage communication network interface card. The storage communication network interface card comprises all peripheral products in compliance with PC card and CF card specifications and installs the communication protocol device providing USB or 1394 specification. By means of microcontroller chip to automatically detect, determine and support the interfaces of the said two types of devices so as to directly connect with the host system without having to go through the intermediate product like card reader, significantly enhancing the convenience in connecting with all the peripheral devices and host system in compliance with the specifications of the storage communication network interface card.
Patent TW-I235668-B (TW)
Title: Non-aerosol type hair cosmetic
Inventor: HORINISHI NOBUTAKA
Filed: 2001-07-25
Granted: 2005-07-11
Abstract: Hair cosmetics prepared by filling into a non-aerosol type discharging container a composition containing the following components (A) and (B): (A) polypropyleneglycol or polyoxypropylene ether, and (B) polyether-modified silicone or amino-modified silicone. The present hair cosmetics are superior in foamability, rich amount of foams, and stability of foams, having a fine texture, and being creamy and soft. Feeling after drying the hair-applied composition is excellent, and has no problem in safety and environmental issue because it is free from any spraying agent.
Patent TW-503542-B (TW)
Title: Fork package for light emitting chips
Inventor: CHANG BILL
IPC: H01L23/28
Filed: 2001-07-24
Granted: 2002-09-21
Abstract: This invention discloses a fork type package for light emitting chips to form a direction adjustable single in line package. The direction adjustable ability for the package is achieved by foldable electrical terminals of the package.
Patent TW-533637-B (TW)
Title: Switchgear
Inventor: KASHIMA JUNICHI
IPC: H02B13/02
Filed: 2001-09-07
Granted: 2003-05-21
Abstract: The instrumentation transformers 6a to 6d and 7a to 7f for measuring the voltage of the main circuit are arranged within the container 15b located in the midst of the containers 15a to 15c. In the present invention, the containers 15a and 15b are linked by the insulating tube 21a and the primary-side lead lines 49 and 53 connected electrically to the primary-side terminal of the instrumentation transformers 6a and 7a are made routed from the container 15b through the insulating tube 21a to the container 15a, and the containers 15b and 15c are linked by the insulating tube 21b and the primary-side lead lines 51 and 55 connected electrically to the primary-side terminal of the instrumentation transformers 6d and 7e are made routed from the container 15b through the insulating tube 21b to the container 15c.
Patent TW-525071-B (TW)
Title: Design analysis workstation for analyzing integrated circuits
Inventor: SKOLL DAVID F
IPC: G06T11/00
Filed: 2001-09-25
Granted: 2003-03-21
Abstract: A design analysis workstation for performing design analysis of integrated circuits provides facilities for extracting design and layout information from digital image-mosaics captured during deconstruction of an integrated circuit. Each image-mosaic is displayed in at least one mosaic-view as a background image that is overlaid with at least one annotation overlay. An engineer analyst creates annotation objects on the annotation overlay based on information inferred concurrently from one or more image-mosaics. Concurrent display of a plurality of image-mosaics facilitates the understanding of interrelations between components on different layers. The design analysis workstation displays a plurality of cursors in respective views of mosaic-images, the cursors having lock-step motion to facilitate comprehension of the alignment of features on different concurrently displayed image-mosaics. The design analysis workstation provides facilities for performing operations on created annotation objects including grouping, cell definition, signal carrier creation, contact creation, signal propagation, net-list generation, etc. The advantages include annotation of image-mosaics using information derived from a plurality of concurrently displayed mosaic-views to facilitate tracing of interconnected busses and an understanding of interrelations between components.
Patent TW-512412-B (TW)
Title: Semiconductor processing system and method for controlling moisture level therein
Inventor: GIRARD JEAN-MARC
IPC: H01L21/3065
Filed: 2001-09-27
Granted: 2002-12-01
Abstract: Provided is a novel semiconductor processing system. The system includes a process chamber for treating a semiconductor substrate with one or more process gases comprising water vapor, means for delivering the water vapor or one or more precursors thereof to the process chamber, an exhaust conduit connected to the process chamber, an absorption spectroscopy system for sensing water vapor in a sample region, and a control system which controls water vapor content in the process chamber. Also provided is a method for controlling the water vapor level in a semiconductor process chamber. The system and method allow for measurement and control of the water vapor level in a semiconductor processing chamber in which water vapor is present as a process gas.
Patent TW-I221456-B (TW)
Title: Vacuum container
Inventor: YU RUNG-YOU
IPC: B65D83/14
Filed: 2001-11-01
Granted: 2004-10-01
Abstract: This invention is to provide a vacuumed container, including a container body for filling fluid and a nozzle device installed on the container body. The container body is a flexible body capable of sustaining a force to expand or contract in an axial direction, and includes an outer circumference with a plurality of wrinkle layers, a sealed face extending horizontally from the bottom edge of the outer circumference, an accommodating chamber enveloped and defined by the outer circumference and the sealed face for filling fluid, and a retaining portion provided at the top edge of the outer circumference. The nozzle device is installed on the retaining portion of the container body, and able to control discharge amount of fluid in the accommodating chamber. A vacuumed state may be obtained while the container body is fully filled with fluid, thereby ejecting the fluid from the nozzle device, such that the container body is gradually contracted upwards along the axial direction by a vacuum suction.
Patent TW-546887-B (TW)
Title: Lead battery charging/discharging control method and controller
Inventor: YOSHIHARA YASUYUKI
IPC: H02J7/00
Filed: 2001-11-09
Granted: 2003-08-11
Abstract: The present invention relates to a charging/discharging control method and a charging/discharging controller for lead battery. It is a lead battery and its application method to be applied to increase state of charging (SOC) mainly when SOC is dropping under a non-fully charged condition so as to overcome the deficiency of frequent deterioration of lead battery.
Patent TW-546588-B (TW)
Title: User-defined boot-up motion picture system and method thereof
Inventor: CHEN FRED HUAI-YAN
IPC: G06F3/06
Filed: 2001-11-16
Granted: 2003-08-11
Abstract: A user-defined boot-up motion picture system and method thereof convert files from movie, motion picture, image, e-book, etc. to e-book on computer after system's processing and then go through a serial port to interconnect computer and PDA so as to download files to PDA; further use PDA to alter configuration for setting boot-up motion picture as the downloaded e-book play; such arrangement and configuration system and method can significantly augment entertaining fun of user and increase the willingness of user to use PDA.
Patent TW-586073-B (TW)
Title: Method, apparatus, and system for executing multi-cycle instructions
Inventor: ROTH CHARLES P
IPC: G06F9/32
Filed: 2001-12-05
Granted: 2004-05-01
Abstract: In one embodiment, a pipelined processor is described that includes an execution pipeline having a plurality of stages and a multi-cycle instruction (MCI) controller adapted to assert a stall signal to stall the multi-cycle instruction within one of the stages of the execution pipeline. The MCI controller is adapted to issue a plurality of instructions to subsequent stages in the pipeline while the multi-cycle instruction is stalled.
Patent TW-544649-B (TW)
Title: Liquid crystal display and its driving method
Inventor: NAKAO KENJI
IPC: G02F1/133
Filed: 2001-12-18
Granted: 2003-08-01
Abstract: The liquid crystal display device of the present invention performs an initialization by reversing the polarities of voltages inputted to two pixel electrodes (23alpha.beta) adjacent in the front and rear directions. Preferably, the front side edge (231alpha) of the rear pixel electrode (23alpha) out of the two pixel electrodes (23alpha.beta) adjacent in the front and rear directions is provided with a first projection (232alpha), and the rear side edge (233beta) of the front pixel electrode (23beta) out of the two pixel electrodes adjacent in the front and rear directions is provided with a second projection (234beta).
Patent TW-583140-B (TW)
Title: Silicoaluminophosphate molecular sieve
Inventor: JANSSEN MARCEL JOHANNES GERARA
IPC: B01J29/85
Filed: 2002-02-07
Granted: 2004-04-11
Abstract: The present invention relates to a silicoaluminophosphate molecular sieve comprising at least one intergrown phase of molecular sieves having AEI and CHA framework types, wherein said intergrown phase has an AEI/CHA ratio of from about 5/95 to 40/60 as determined by DIFFaX analysis, using the powder X-ray diffraction pattern of a calcined sample of said silicoaluminophosphate molecular sieve. It also relates to methods for its preparation and to its use in the catalytic conversion of methanol to olefins.
Patent TW-583329-B (TW)
Title: Sputtering apparatus for depositing a film
Inventor: PARK YOUNG-KYOU
IPC: C23C14/35
Filed: 2002-02-07
Granted: 2004-04-11
Abstract: Sputtering apparatus for generating a magnetic field at a front side of a target during forming a metal layer is disclosed. A substrate is positioned within a sputtering chamber facing the front side of the target. A metal layer is formed by depositing atoms sputtered from the front side of the target onto the substrate. The magnetic field generating part has an enclosure shape and opening portions and faces the backside of the target. The magnetic field generating part is positioned went off from a vertical central line of the target, and provides a magnetic field having a non-uniform distribution onto the front side of the target. The behavior of the sputtered atoms can be effectively controlled by generating the magnetic field having non-uniform distribution. A uniform distribution. A uniform corrosion profile of the target may be obtained.
Patent TW-533463-B (TW)
Title: Method of manufacturing a semiconductor device
Inventor: YAMAZAKI SHUMPEI
IPC: H01L21/336
Filed: 2002-02-25
Granted: 2003-05-21
Abstract: When a laser beam is irradiated onto a semiconductor film, a steep temperature gradient is produced between a substrate and the semiconductor film. For this reason, the semiconductor film contracts, so that a warp in the film occurs. Therefore, the quality of a resulting crystalline semiconductor film sometimes deteriorates. According to the present invention, it is characterized in that, after laser beam crystallization on the semiconductor film, heat treatment is carried out so as to reduce the warp in the film. Since the substrate contracts by the heat treatment, the warp in the semiconductor film is lessened, so that the physical properties of the semiconductor film can be improved.
Patent TW-544306-B (TW)
Title: Material composition of environment-protection coffin and its producing method
Inventor: HOU YU-CHIUAN
IPC: A61G17/00
Filed: 2002-07-23
Granted: 2003-08-01
Abstract: The present invention relates to a material composition of an environment-protcoffin and its producing method. The material composition comprises a composite material made of a powder formed by smashing an agricultural waste; a filler from a natural starch for filling the gaps of the composite material; and a binder from PVA formed with water as a medium for binding the filler and the composite material together. The method for producing the material composition comprises: drying the material, smashing the material, mixing the material, forming the material, naturally drying the material, performing a waterproof treatment, performing an assembly process, and performing a coating process to produce a product.
Patent TW-563383-B (TW)
Title: Encoding device for remote control with high security
Inventor: LI YUNG-JEN
IPC: G07C9/00
Filed: 2002-08-30
Granted: 2003-11-21
Abstract: The present invention discloses an encoding device for remote control with high security, which includes: a timer for providing a transmitting timing value; a mode selector for providing a mode selection value; a controller for receiving an authentication serial number, the transmission timing value and the mode selection value to generate a control signal; a key; an encrypter for receiving the control signal for encrypting the control signal with the key into a ciphertext; and, an RF modulator for modulating the ciphertext and outputting. The present invention further discloses a method for improving the power consumption of the remote control, which includes: activating the encoding device; activating the timer of the encoding device; encrypting the transmission timing value and the authentication serial number of the timer, and transmitting to the decoding device; comparing the data received by the decoding device with the timing value of itself; synchronizing the timer of the decoding device with the timer of the encoding device; determining if again activating the encoding device within a period of time; if not, stopping the timing, but the final timing value is still stored in the memory; and, if so, repeating the above-mentioned steps until the controlled device is activated.
Patent TW-I284155-B (TW)
Title: Process and apparatus for organic vapor jet deposition
Inventor: SHTEIN MAX
IPC: H01L51/00
Filed: 2002-09-04
Granted: 2007-07-21
Abstract: A method of fabricating an organic film is provided. A non-reactive carrier gas is used to transport an organic vapor. The organic vapor is ejected through a nozzle block onto a cooled substrate, to form a patterned organic film. A device for carrying out the method is also provided. The device includes a source of organic vapors, a source of carrier gas and a vacuum chamber. A heated nozzle block attached to the source of organic vapors and the source of carrier gas has at least one nozzle adapted to eject carrier gas and organic vapors onto a cooled substrate disposed within the vacuum chamber.
Patent TW-571368-B (TW)
Title: A method of characterizing a step of implanting in a material substrate
Inventor: MALEVILLE CHRISTOPHE
IPC: H01L21/66
Filed: 2002-09-27
Granted: 2004-01-11
Abstract: The invention provides a method of ex situ characterization of the implanted dose of at least one species in a substrate, the method being characterized in that it comprises: an annealing step for causing the species to blister in the implanted substrate; a step of acquiring an image of the surface of the substrate; and a step of processing the image; implantation dose characteristics being deduced from the image processing step.
Patent TW-I237269-B (TW)
Title: Flash memory device
Inventor: JOO SEOK-JIN
IPC: H01L21/8247
Filed: 2002-11-06
Granted: 2005-08-01
Abstract: The present invention relates to a flash memory device. The flash memory device comprises a first flash memory cell array in which a plurality of flash memory cells are connected by a plurality of word lines and a plurality of bit lines, a plurality of switching means connected to bit lines of each of the flash memory cell array, and a second flash memory cell array in which a plurality of flash memory cells are connected by a plurality of word lines and a plurality of bit lines, and a common terminal of the plurality of the switching means and each of the word lines are connected. Therefore, the present invention can reduce the manufacturing cost of a product without increasing the chip size even though a self-converged erase mode is employed.
Patent TW-571448-B (TW)
Title: Light-emitting diode array
Inventor: YUKIMOTO TOMIHISA
IPC: B41J2/45
Filed: 2002-12-04
Granted: 2004-01-11
Abstract: The present invention provides a light-emitting diode array free from a detour electric current path not contributing to light emission, thereby providing increased light-emitting power. The light-emitting diode array comprises a conductive layer formed on a substrate, a plurality of separated light-emitting parts formed on the conductive layer, a first electrode formed on at least part of a top surface of each light-emitting part, and a second electrode formed on the conductive layer near the light-emitting part. The second electrode is a common electrode for operating a plurality of the light-emitting parts, and regions of the conductive layer between the adjacent light-emitting parts are removed.
Patent TW-583601-B (TW)
Title: Data processing path selection method and graphics processor utilizing the same
Inventor: LIN CHI-YANG
IPC: G06T15/00
Filed: 2003-01-15
Granted: 2004-04-11
Abstract: A data processing path selection method and a graphics processor utilizing the method for use in a digital data processing system are disclosed. The data processing system includes a central processing unit (CPU). The graphics processor includes a transformation and lighting engine, and a path selection unit. An application program is executed by the system. In the selection method, the path selection unit receives a plurality of vertex data generated by the application program, detects the utilization rate of the CPU, and then determines whether the vertex data are transmitted to the CPU or the transformation and lighting engine to be processed according to the utilization rate of the CPU.
Patent TW-591450-B (TW)
Title: Computer aided drawing method of pipeline equipment graphics
Inventor: LIN CHANG-YI
IPC: G06F17/50
Filed: 2003-01-30
Granted: 2004-06-11
Abstract: The invention provides a computer aided drawing method of pipeline equipment graphics, which is used to draw a design drawing with various pipeline equipments. Such method comprises the following procedures: pre-store the template graphics representing those pipeline equipments, create a drawing file for the design drawing, select a first template graphics and add to drawing file, specify a connection end, placing orientation, specification and material representing equipment in the first template graphics in terms of requirement of first user and display the specification and material representing equipment in the first template graphics on the working windows in which the drawing file is located. Select a second template graphics and add it to the drawing file, matching to placing orientation, specification and material of the second template graphics with those of the first template graphics and display the specification and material representing equipment in the second template graphics on the working windows in which the drawing file is located, and based on the requirements of a second user, specify a connection end of the second template graphics in proximity of connection end of the first template graphics.
Patent TW-I268821-B (TW)
Title: Adjustment of heat transfer in continuous casting molds in particular in the region of the meniscus
Inventor: MANGLER DIRK
IPC: B22D11/124
Filed: 2003-03-04
Granted: 2006-12-21
Abstract: The invention relates to a mold for the continuous casting of molten metals, in particular steel, comprising cooling channels (1), such as cooling grooves, cooling slits or cooling drillings in the side of the mold (2) away from the melt contact surface. According to the invention, the heat transfer in the mold can be improved, whereby the geometric arrangement of the heat transfer planar surfaces of a cooling channel (1) or a group of cooling channels is adjusted in form, cross-sectional area, circumference, boundary surface qualities, orientation with respect to contact surfaces, arrangement and/or arrangement density with respect to the contact surfaces for the local formation of thermal flux density and/or temperature of the contact surfaces (18) during casting operation and in particular in the region of the meniscus (11).
Patent TW-I221324-B (TW)
Title: Image sensor package and image pickup module using the image sensor
Inventor: WANG HUNG-REN
IPC: H01L21/8238
Filed: 2003-04-16
Granted: 2004-09-21
Abstract: The present invention is related to a kind of image sensor packaging structure, which is mainly packaged on a PCB circuit board to form an image sensor. At least one surface of the PCB circuit board is provided with the conducting layer and is disposed with one opening window, in which the specifications of the opening window is nearly equal to the size of sensing area of the image sensor chip. The etching process through the use of mask is conducted onto the PCB circuit board to form plural leads, which correspond to the positions of the bonding pads of one image sensor chip; and the leads are partially covered with the electrically conductive medium for bonding the chip to the PCB circuit board to form electric connection through the application of SMT process. And, the position corresponding to the chip is encapsulated with glass. For the image pickup module of the invented image sensor, the module circuit is disposed on the PCB circuit board, or the module circuit is disposed inside one SMT board where an opening hole is preserved. The specification of the opening hole is similar to the product size of the packaged image sensor. The external leads of the image sensor are fixed at the opening-hole position of the SMT board through the use of surface mounting method so as to form electric connection with the module circuit. The lens holder of one lens set is disposed to cover above the image sensor so as to form one image pickup module.