baber/WOPTO huggingface dataset:
Patent TW-201834002-A (TW)
Title: Wafer manufacturing method
Inventor: NAKATANI YUYA
IPC: H01L21/306
Filed: 2018-03-05
Abstract: The present invention provides a method for manufacturing a product wafer, the method comprising the steps for a wafer peripheral portion chamfering process, a major surface lapping or double-side grinding process, an etching process, a major surface mirror polishing process, and a chamfered portion mirror polishing process. The chamfered portion has a cross sectional shape comprising a first inclined portion continuous from a first major surface, a first arc portion continuous from the first inclined portion and having a curvature radius of R1, a second inclined portion continuous from a second major surface, a second arc portion continuous from the second inclined portion and having a curvature radius of R2, and an end portion connecting the first arc portion and the second arc portion. The chamfering process includes achieving R1 and R2 smaller than target value ranges for R1 and R2 of the product wafer. The chamfered portion mirror polishing process includes achieving values within the target value ranges for R1 and R2 of the product wafer. Thus, there is provided a wafer manufacturing method with which circumferential variations in the chamfered cross sectional shape due to etching can be suppressed.
Patent TW-201839076-A (TW)
Title: Aqueous slurry composition for chemical mechanical polishing
Inventor: PARK HYE-JUNG
IPC: C09G1/02
Filed: 2018-03-07
Abstract: The present invention relates to a slurry composition for chemical mechanical polishing. More particularly, the present invention relates to a slurry composition for chemical mechanical polishing which uses a compound having phosphate groups as a polishing selectivity regulator and optionally further uses a tertiary amine compound along with the polishing selectivity regulator, such that it is possible to polish, either alone or in combination, an insulating film such as a silicon nitride film or a metal film such as tungsten in contrast to the prior art, and particularly, to easily control the polishing rate thereof, thereby minimizing an interlayer step of a semiconductor element; and a method for polishing a semiconductor substrate using the same.
Patent TW-201837057-A (TW)
Title: Immunogenic peptide composition
Inventor: CHAI SAN JIUN
IPC: C07K16/28
Filed: 2018-03-15
Abstract: The present invention relates to a peptide composition capable of binding with major histocompatibility complex class I molecules to induce an anti-cancer immune response in a subject. Particularly, the peptide composition comprises at least a Four-jointed Box 1 peptide and a Melanoma Antigen family D4b peptide. The present invention further relates to the use of a peptide composition and a peptide vaccine for inducing the anti-cancer immune response in the subject.
Patent TW-201837310-A (TW)
Title: Pumping unit and use thereof
Inventor: D'HARBOULLE PHILIPPE
IPC: C23C16/54
Filed: 2018-03-23
Abstract: The invention relates to a pumping unit (1) comprising: a rough-vacuum pump (2) of the multi-stage dry pump type comprising at least four pumping stages (T1, T2, T3, T4, T5)mounted in series, characterized in that the pumping unit (1) comprises: a vacuum pump (3) of the two-stage Roots type comprising a first and a second pumping stage (B1, B2) mounted in series, the second pumping stage (B2) of the two-stage Roots type vacuum pump (3) being mounted in series with and upstream of a first pumping stage (T1) of the rough-vacuum pump (2) in the direction of flow of the gases that are to be pumped, the ratio of the flowrate generated by the first pumping stage (B1) of the two-stage Roots type vacuum pump (3)to the flowrate generated by the second pumping stage (B2) of the two-stage Roots type vacuum pump (3) being less than six, and the ratio of the flowrate generated by the second pumping stage at (B2) of the two-stage Roots type vacuum pump (3) to the flowrate generated by the first pumping stage (T1) of the rough-vacuum pump (2) being less than six. The present invention also relates to a use of the said pumping unit (1).
Patent TW-201843600-A (TW)
Title: Endpoint detection in manufacturing process by near infrared spectroscopy and machine learning techniques
Inventor: HSIUNG CHANGMENG
IPC: G06F17/50
Filed: 2018-04-17
Abstract: A device may receive training spectral data associated with a manufacturing process that transitions from an unsteady state to a steady state. The device may generate, based on the training spectral data, a plurality of iterations of a support vector machine (SVM) classification model. The device may determine, based on the plurality of iterations of the SVM classification model, a plurality of predicted transition times associated with the manufacturing process. A predicted transition time, of the plurality of predicted transition times, may identify a time, during the manufacturing process, that a corresponding iteration of the SVM classification model predicts that the manufacturing process transitioned from the unsteady state to the steady state. The device may generate, based on the plurality of predicted transition times, a final SVM classification model associated with determining whether the manufacturing process has reached the steady state.
Patent TW-201945927-A (TW)
Title: Data writing method, memory control circuit unit and memory storage apparatus
Inventor: WU CHAO-HAN
IPC: G06F12/00
Filed: 2018-04-26
Abstract: A data writing method, a memory control circuit unit, and a memory storage device are provided. The method includes: determining whether to use a first programming mode or a second programming mode to program memory cells according to a first data amount and a second data amount; when the first data amount is greater than the second data amount, programming the memory cells by using the first programming mode; and when the first data amount is not larger than the second data amount, programming the memory cells by using the second programming mode.
Patent TW-201947619-A (TW)
Title: Magnetic induction element and manufacturing method of the same capable of easily implementing automation for manufacturing process of transformers to improve efficiency and reduce defective rate of products
Inventor: LIANG JING-WEI
IPC: H01F41/02
Filed: 2018-05-02
Abstract: The present invention provides a manufacturing method of magnetic induction element, which includes: deploying a conductive pattern on a printed circuit board to form a first set of coils and establish a first adapting hole; using conductive material to form at least a second set of coils and establish a second adapting hole; enclosing the surface of the first set of coils not including the first adapting hole with an insulation material as a first isolation layer and also establishing a positioning mechanism for alignment of the first and second adapting holes; and, fabricating an iron core with a magnetic conduction column and inserting the magnetic conduction column into the first and second adapting holes, so that the iron core is coupled with the first set of coils and the second set of coils. Thus, the present invention may easily implement automation for the manufacturing process of transformers thereby improving the efficiency and reducing the defective rate of products.
Patent TW-201947678-A (TW)
Title: Flip-chip package substrate and method of fabricating the same
Inventor: CHOU PAO-HUNG
IPC: H01L23/28
Filed: 2018-05-10
Abstract: A flip-chip package substrate and a method of fabricating the same are provided. The method includes stacking a plurality of insulating layers having respective conductive pillars that are stacked and in contact with one another. The insulating layers and the conductive pillars serve as a core layer structure of the flip-chip package substrate. With the core layer structure fabricated according to the present invention, conductive pillars can be fabricated on demands to have a small size in their ends. Therefore, as the thickness of the core layer structure is increased, the flip-chip package substrate not only has a robust stiffness, but can also withstand warpage. The small size of the ends of the conductive pillars facilitates the flexibility of design. As a result, conductive contacts can be densely formed on the core layer structure, so does a circuit layer being a kind of fine pitch and high density layout.
Patent TW-201906012-A (TW)
Inventor: AOYAMA TAKAYUKI
IPC: H01L21/677
Filed: 2018-05-29
Abstract: A semiconductor wafer transport mode of a heat treatment apparatus is switchable between two modes of a "high throughput mode" and a "low oxygen concentration mode" as appropriate. In the "low oxygen concentration mode", a first cooling chamber is used only as a path for transferring the semiconductor wafer, and a second cooling chamber is used only as a dedicated cooling unit for cooling the semiconductor wafer subjected to flash heating. On the other hand, in the "high throughput mode", both of the first cooling chamber and the second cooling chamber are used as paths for transferring the semiconductor wafer, and as the cooling units, too.
Patent TW-201904743-A (TW)
Inventor: LAWLESS WILLIAM FRANCIS III
IPC: G06G7/66
Filed: 2018-06-11
Abstract: Non-time dependent calculated variables based on measured strain are used to effectively determine an optimal hold profile for an expanding crosslinking polymer part in a mold cavity. A system and/or approach may first inject molten expanding crosslinking polymer into a mold cavity, then measure strain at the mold cavity or at another location within the injection molding system, and then calculate at least one non-time dependent variable during an injection molding cycle. Next, the system and/or method commences a hold profile for the part, and upon completing the hold profile, the part is ejected from the mold cavity, whereupon a cure profile is commenced.
Patent TW-202001703-A (TW)
Title: System of machine tool processing behavior abnormal analysis and predictive maintenance and method thereof
Inventor: LIAO KUO-KAI
IPC: G06Q10/04
Filed: 2018-06-12
Abstract: A system of machine tool processing behavior abnormal analysis and predictive maintenance and method thereof are disclosed. The method comprises: capturing a sensed value of a spindle or a key component of a machine by a machine sensor capturing module to calculate a time-domain vibration value and a frequency-domain vibration value, capturing an operation information of a spindle rotating speed, operating status or processing program of the machine by a machine controller capturing module; providing a warning for an abnormal time-domain vibration value or an abnormal frequency-domain vibration value of the spindle or key component and analyzing abnormal machining behavior or faulty component cause of the machine according the time-domain vibration value, frequency-domain vibration value, spindle rotating speed, operating status or machining program; and integrating information from the machine sensor capturing module and the machine controller capturing module to generate integrated information, and providing maintenance method and maintenance timing of the machine before abnormal machining behavior or component failure of the machine.
Patent TW-201906982-A (TW)
Inventor: ICHIKAWA MASAYOSHI
IPC: C09K11/08
Filed: 2018-06-13
Abstract: Provided is a fluoride phosphor that has a satisfactory external quantum efficiency and that is suitable for stably producing white LEDs. The fluoride phosphor has a composition represented by general formula (1) and an angle of repose of 30 DEG-60 DEG. General formula (1): A2M(1-n)F6:Mn4+ n (wherein 0 < n ≤ 0.1, the element A is one or more alkali elements including at least K, and the element M is a combination of elemental Si, elemental Ge, or Si and one or more elements selected from the group consisting of Ge, Sn, Ti, Zr, and Hf).
Patent TW-201939166-A (TW)
Title: Direct pattern process for forming touch panel and touch panel thereof
Inventor: LI CHAO-SUNG
IPC: H01B13/00
Filed: 2018-07-16
Abstract: A direct pattern process for forming a touch panel includes following steps. The first step is providing a substrate having a display area and a peripheral area, and peripheral conductive traces each having a bonding pad are formed on the peripheral area. Next, a metal nanowire layer is formed on the display area and the peripheral area. Next, a pre-cured film layer is formed on the metal nanowire layer, and a negative photo-active layer is formed on the pre-cured layer. Next, a lithograph process is performed, and the process includes the following steps. Defining a removing area and a remaining are of the negative photo-active layer is performed by an exposure process. Then, removing the negative photo-active layer, the pre-cured film layer and the metal nanowire layer in the defined removing area is performed by a developer solution so as to form a touch sensing electrode in the display are, and the pads of the peripheral conductive traces are exposed. The touch sensing electrode and the peripheral conductive trace are electrically connected with each other, and the touch sensing electrode is formed by the metal nanowire layer and the film layer. The next step is curing the pre-cured film layer.
Patent TW-201908342-A (TW)
Inventor: BIILMANN RONN LARS CHRISTIAN
IPC: A61P21/00
Filed: 2018-07-19
Abstract: The present invention relates to monoclonal anti-Sortilin antibodies which have been found useful in correcting a deficientlevel of progranulin (PGRN). In particular, these antibodies can be used in the treatment of frontotemporal dementia (FTD) and amyotrophic lateral sclerosis (ALS) and other neurodegenerative disorders such as Alzheimers disease (AD).
Patent TW-201940019-A (TW)
Title: Carrier substrate and printed circuit board fabricated using the same
Inventor: LEE YONG-JIK
IPC: H05K3/10
Filed: 2018-08-01
Abstract: A printed circuit board divided into a rigid portion and a flexible portion in accordance with an aspect of the present invention includes: flexible adhesive layer; first flexible insulating layer and second flexible insulating layer laminated, respectively, on an upper surface and a lower surface of the flexible adhesive layer; rigid insulating layer formed on the first flexible insulating layer and the second flexible insulating layer in correspondence with the rigid portion; first circuit embedded in the lower surface of the flexible adhesive layer and having one surface thereof in contact with the second flexible insulating layer and having remaining surfaces thereof surrounded by the flexible adhesive layer; second circuit formed on an upper surface of the first flexible insulating layer and a lower surface of the second flexible insulating layer; and third circuit formed on the rigid insulating layer.
Patent TW-201912665-A (TW)
Inventor: LEE NAM-KYU
IPC: B32B27/00
Filed: 2018-08-09
Abstract: Provided are a random copolymer for forming a neutral layer promoting directed self-assembly pattern formation, a laminate for forming a pattern including the same, and a method for forming a high-quality pattern using the same.
Patent TW-201946548-A (TW)
Title: Dual-purpose cigarette and tobacco filler thereof
Inventor: WANG HUA-YOU
IPC: A24D1/20
Filed: 2018-08-13
Abstract: A dual-purpose cigarette and a tobacco filler thereof are provided, the cigarette comprises a tobacco-filled section and a filter segment, and the tobacco filler in the tobacco-filled section comprises tobacco raw material added with PG and VG, and PG. The weight ratio of VG and VG is 5%-50%, and the moisture content of tobacco raw materials is 5%-10%. The present invention has the advantage that the mist does not have a water odor and is similar to a normal cigarette.
Patent TW-202009547-A (TW)
Title: Optical image capturing module
Inventor: CHANG YEONG-MING
IPC: G02B9/60
Filed: 2018-08-16
Abstract: An optical image capturing module includes a lens assembly and a circuit assembly including a circuit substrate, a sensor holder disposed on the circuit substrate, and an image sensing component connected to the circuit substrate and having a sensing surface and multiple image contacts. The circuit substrate has multiple circuit contacts. The image contacts are electrically connected to the circuit contacts. The lens assembly includes a lens base disposed on the sensor holder and a lens group. The lens base has a receiving hole penetrating through two ends of the lens base, thereby the lens base is hollow, and the receiving hole directly faces the image sensing component. The lens base is disposed on the circuit substrate, thereby the image sensing component is located in the receiving hole. The lens group includes at least two lenses, and is disposed on the lens base and is located in the receiving hole.
Patent TW-201922422-A (TW)
Title: Retaining ring design
Inventor: OH JEONGHOON
IPC: B24B37/32
Filed: 2018-10-03
Abstract: Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.
Patent TW-201934434-A (TW)
Title: Packing unit and manufacturing method thereof
Inventor: TAKEUCH MASANORI
IPC: B65D77/30
Filed: 2018-10-09
Abstract: Provided is a packaging body capable of being easily opened up to the last part. According to the present invention, the packaging body (1) comprises a container (2) with a flange (2b) and a cover thermal-welded to the flange and having an opening tap (3a). The container is formed by molding a composite sheet (20), which includes a thermosetting resin layer (22) and a base layer (21) detachably stacked on a surface of a part of the thermosetting resin layer, to allow the thermosetting resin layer (22) to be the inside of the container. The lower surface of the cover is formed by a thermosetting resin layer (32) capable of being thermal-welded on the thermosetting resin layer of the container. A notch (23) with a height capable of almost cutting the thermosetting resin layer is formed on the upper surface of the flange all around a more inner portion than a thermal welding part (4) with the cover. A spacing (S2) between the inner circumference of the thermal welding part and the outer circumference of the notch is 0 to 5 mm.
Patent TW-201932197-A (TW)
Title: Fluid dispenser
Inventor: SHKOLNIKOV VIKTOR
IPC: B05B7/24
Filed: 2018-10-23
Abstract: A fluid dispenser may include a fluid ejector to eject fluid in a direction and a capillary pick up to wick fluid to the fluid ejector with capillary action. The capillary pick up may project beyond the fluid ejector in the direction.
Patent TW-201939688-A (TW)
Title: Semiconductor package
Inventor: MOON SEON-HEE
IPC: H01L21/56
Filed: 2018-10-29
Abstract: A semiconductor package includes a connection structure including a first insulation layer, a second insulation layer, first and second wiring layers, and first and second connection vias. A core structure including a core member is on the first insulation layer. A first through-hole passes through the core member. Passive components are on the first insulation layer in the first through-hole and connected to the first wiring layer through the first connection via. A first encapsulant covers at least a portion of the passive components. A second through-hole passes through the core structure and the first insulation layer. A semiconductor chip is on the second insulation layer in the second through-hole and is connected to the second wiring layer through the second connection via. A second encapsulant covers at least a portion of the semiconductor chip.
Patent TW-201923287-A (TW)
Title: Air-jet enthalpy-increasing heat pump air conditioning system and electric vehicle comprising the same
Inventor: Zhao rui-po
IPC: B60H1/00
Filed: 2018-11-01
Abstract: The invention belongs to the field of air conditioning equipment, in particular to an air-jet enthalpy-increasing heat pump air conditioning system and an electric vehicle comprising the air-jet enthalpy-increasing heat pump air conditioning system. The heat pump air conditioning system comprises a compressor, a first condenser, a first heat exchanger, a first expansion valve and a second condenser, which are connected end to end in sequence, wherein the first heat exchanger comprises a first channel and a second channel, the first end of the first channel is communicated with the first condenser, the second end of the first channel is communicated with the first expansion valve; the first end of the second channel is communicated with the first condenser through a second expansion valve, and the second end of the second channel is communicated with the compressor. The coolant entering the second channel is subjected to reduced pressure vaporization through the second expansion valve, causing its temperature lower than the temperature of the coolant in the first channel. Therefore, when the coolant in the first channel flows through the compressor again, the temperature of the compressor can be prevented from becoming too high, so that the heat pump air conditioning system can also be used for heating under the temperature of minus 10 degree to provide hot air for the interior of the electric vehicle.
Patent TW-201922944-A (TW)
Title: Coloring curable resin composition, color filter, and display device
Inventor: NAKAYAMA TOMOHIRO
IPC: C09B11/28
Filed: 2018-11-08
Abstract: The present invention relates to a coloring curable resin composition, a color filter, and a display device, wherein the coloring curable resin composition comprises a colorant, a resin, a polymerizable compound, and a polymerization initiator, the colorant containing a compound represented by formula (I) and a red pigment (but excluding a compound represented by formula (I)), the content percent of the red pigment being equal to or more than 1 mass% and equal to or less than 95 mass% relative to the total weight of the colorant.
Patent TW-201925187-A (TW)
Title: Sulfone pyridine alkyl amide-substituted heteroaryl compounds
Inventor: LIU CHUNJIAN
IPC: A61K31/5377
Filed: 2018-11-20
Abstract: Compounds having the following formula I: or a stereoisomer or pharmaceutically-acceptable salt thereof, where R1, R2, R3, R4, and R5 are as defined herein, are useful in the modulation of IL-12, IL-23 and/or IFN[alpha], by acting on Tyk-2 to cause signal transduction inhibition.
Patent TW-201937721-A (TW)
Title: X-ray detector
Inventor: YOON JAE-HO
IPC: H01L31/08
Filed: 2018-11-28
Abstract: An X-ray detector device includes in one example a switching portion and a photodetecting portion connected to the switching portion. The photodetecting portion includes a bottom electrode, a semiconductor area disposed above the bottom electrode, and a top electrode disposed above the semiconductor area. The area of the top electrode is smaller than the area of a top surface of the semiconductor area.