baber/WOPTO huggingface dataset:
Patent JP-2014094113-A (JP)
Title: Locker device
Inventor: KOBAYASHI TOMIO
IPC: A47G29/12
Filed: 2012-11-09
Abstract: PROBLEM TO BE SOLVED: To provide a locker device capable of improving assemblability while retaining strength.SOLUTION: A rocker device 1 comprises: a box body 10 made of a metallic material and opened on one side; an inner box 20 adapted to be opened in the same direction as that of said box body and is fitted so as to be housed in said box body; and doors 15 and 16 disposed openably along the opening of the box body. The inner box is partitioned to form a plurality of housing portions 2 and 3 and is integrally made of a synthetic resin material.
Patent JP-2013059094-A (JP)
Title: Three-dimensional image processing apparatus and three-dimensional image processing method
Inventor: MATANO TOMOHIRO
IPC: H04N13/04
Filed: 2012-11-09
Abstract: PROBLEM TO BE SOLVED: To provide a three-dimensional image processing apparatus and a three-dimensional image processing method that enable a user to view a three-dimensional image at an appropriate position.SOLUTION: A three-dimensional image processing apparatus comprises: detection means that detects a user from an image captured by imaging means that captures a region including the front of a display for displaying a three-dimensional image; and display means that controls the display to display the image captured by the imaging means and a guide display indicating a region for appropriately viewing the three-dimensional image, and changes the size of the region depending on a result of user detection by the detection means.
Patent JP-2014099323-A (JP)
Title: Thin film superconducting wire rod and superconducting coil
Inventor: TOMIOKA AKIRA
IPC: H01F6/06
Filed: 2012-11-14
Abstract: PROBLEM TO BE SOLVED: To provide a thin film superconducting wire rod capable of optimization of the current carrying capacity and reduction of the AC loss by improving divided patterns of a superconducting thin film layer which is deposition-formed on a base sheet of the thin film superconducting wire rod.SOLUTION: In a thin film superconducting wire rod in which a superconducting thin film layer 3 deposition-formed on a surface of a base sheet 1 is divided into a plurality of divided thin film parts 3a, 3b, and 3c in a width direction of the base sheet 1 and aligned parallel, a current capacity of the superconducting wire rod and critical current are matched by setting widths a, b, and c of the divided thin film part 3a, 3b, and 3c to adjust to distribution ratios of current flowing in each divided thin film part by "skin effect" and the like when current fluctuation is flowing to the superconducting wire rod.
Patent JP-2014098853-A (JP)
Title: Inspection device for lamination position of polarizing film
Inventor: ARAI TOSHINARI
IPC: G01M11/00
Filed: 2012-11-15
Abstract: PROBLEM TO BE SOLVED: To provide an inspection device for a lamination position of a polarizing film, configured in such a manner that a lamination position of a polarizing film with a liquid crystal display panel is inspected after laminating these components in a lamination step, the polarizing film is replaced by another film if necessary, and thereby, a liquid crystal display panel having a lamination failure is prevented from being delivered to the succeeding manufacturing process, and that, it is unnecessary to increase a width of a black matrix for accepting misalignment of a lamination position between a polarizing film and a liquid crystal display panel.SOLUTION: In an inspection device 1 for a lamination position of a polarizing film, pattern surfaces of a polarizing film 3 and of a color filter substrate 6 can be observed from a single image, and thereby, the number of inspection for photographing a plurality of images can be reduced. Further, as focus adjustment onto the pattern surface of the color filter substrate 6 after focusing onto the polarizing film 3 is unnecessary, inspection with high accuracy and high throughput can be performed.
Patent JP-2013116632-A (JP)
Title: System diagnostic tool for printmaking device
Inventor: MONTFORT DAVID BRADLEY
IPC: B41J29/46
Filed: 2012-11-16
Abstract: PROBLEM TO BE SOLVED: To provide a method and system evaluating performance of a printing device.SOLUTION: A diagnostic routine is executed in the printing device. The diagnostic routine evaluates performance of the printing device using a set of instructions stored on a computer-readable medium. The set of instructions are configured to identify a fault in the performance of the printing device based on an artifact identifiable on at least one diagnostic output. The diagnostic output is generated by the printing device with the identifiable artifact in accordance with the diagnostic routine for identifying the artifact and associated fault of the printing device.
Patent JP-2014103022-A (JP)
Title: Piezoelectric terminal, connection structure, connector and manufacturing method of connection structure
Inventor: ORITO HIROSHI
IPC: H01R4/70
Filed: 2012-11-21
Abstract: PROBLEM TO BE SOLVED: To provide a crimp terminal capable of obtaining stable conductivity while ensuring assemblability, and to provide a connection structure, a connector and a manufacturing method for connection structure.SOLUTION: A crimp terminal 11 includes at least a crimp part 13 of hollow cross-sectional shape allowing crimp connection for a wire exposed part 52a exposed from the tip of an insulating coating 53 of a covered wire 51. The crimp part 13 is configured to crimp across the wire exposed part 52a and the insulating coating 53, by a wire crimp range 13b for crimping the wire exposed part 52a, and a coating crimp range 13a for crimping the insulating coating 53. The crimp part 13 is provided with resin injection ports 101-103 for injecting resin 105, as a filler, between the crimp part 13 and the covered wire 51.
Patent JP-2014107312-A (JP)
Title: Thickness reduction processing method of semiconductor wafer
Inventor: TANAKA HIROSHI
IPC: H01L21/304
Filed: 2012-11-26
Abstract: PROBLEM TO BE SOLVED: To provide a thickness reduction processing method of a semiconductor wafer which can inhibit formation of an etching groove at a processing upper end of the semiconductor wafer.SOLUTION: A thickness reduction processing method of a semiconductor wafer comprises: a first process of forming a groove 2 on a whole circumference on an outer peripheral side of a semiconductor wafer 1 by injecting or irradiating solid particles 13, liquid particles or light; and a second process of reducing a thickness of the semiconductor wafer 1 at an inner peripheral side than the groove 2 by a grindstone.
Patent JP-2014104012-A (JP)
Title: Automatic waist size adjusting tool
Inventor: MIYANAGA KENICHI
IPC: A41D1/14
Filed: 2012-11-26
Abstract: PROBLEM TO BE SOLVED: To provide an automatic waist size adjusting tool as a front belt, capable of being used on an overlapped portion of a front side cloth with high load while using a synthetic resin material lower in cost and higher in safety, compared to a waist size adjusting device of a metallic material.SOLUTION: An automatic waist size adjusting tool includes an adjustment stopper body, and a piece body made of synthetic resin in an engageable manner by their engaging means. The adjustment stopper body includes: a base body made of synthetic resin, and including base body sewing parts for sewing on one side cloth of a waist part on both end parts in the longitudinal direction; and a slider made of synthetic resin, and sliding on the base body by spring energization by a metallic spring. The piece body includes a piece body sewing part for sewing on the other side cloth of the waist part.
Patent JP-2013125271-A (JP)
Title: Toner with improved dielectric loss
Inventor: ZHOU KE
IPC: C09C3/10
Filed: 2012-11-27
Abstract: PROBLEM TO BE SOLVED: To provide toner having a low level of dielectric loss.SOLUTION: The present invention discloses pigment treated with rosin, and toner particles containing the rosin-treated pigment particles.
Patent JP-2014104661-A (JP)
Title: In-mold molding method for sheet-fitted food container, and the sheet-fitted food container
Inventor: AIKAWA MASANORI
IPC: B29C33/42
Filed: 2012-11-28
Abstract: PROBLEM TO BE SOLVED: To provide an in-mold molding method for a sheet-fitted food container whose decorativeness can be increased by imparting a cubic feeling to its outer circumferential face, and the sheet-fitted food container.SOLUTION: A recessed part 33b for forming a cubic display part or design part on a film sheet 10 is formed at the inside face 33a of the taper of a cavity die 31, further, the recessed part 33b is filled with a resin together with the film sheet 10, thus the resin infiltrated into a gap between the inside face of the film sheet 10 and a core die 32 is integrally adhered with the whole of the inside face of the film sheet 10, and the sheet part infiltrated into the recessed part 33b and the resin part are integrated to form a bulge part 6, and the bulge part 6 is climbed over the opening edge part 33c of the recessed part 33b and is separated from the recessed part 33b. In this way, a sheet-fitted food container having increased decorativeness by imparting a cubic feeling to the outer circumferential face can be produced by in-mold molding.
Patent JP-2014107965-A (JP)
Title: Electric power tool
Inventor: TANIMOTO HIDEYUKI
IPC: H02K29/00
Filed: 2012-11-28
Abstract: PROBLEM TO BE SOLVED: To provide an electric power tool capable of increasing a screw fastening speed in comparison with the prior arts.SOLUTION: A full length of an impact tool is 120 to 138 mm and a rated voltage of a battery pack 11 is 14.4 to 18 V (the maximum voltage is 16 to 20 V). In a brushless motor as a drive source, an outer diameter of a stator core 31 is 48.5±2 mm, a width of teeth is 5.4 to 6.6 mm, a yoke width is 1/2 as wide as the width of the teeth, a coil winding number is 8.5 to 11.5 turns/slots, and a coil wire diameter is 1.1 to 1.3 mm. A rotating speed of the brushless motor can be set to 14,600 to 19,000 minover an entire torque range (e.g., 0.15 to 0.20 N m) of the brushless motor during actual work.
Patent JP-2013039670-A (JP)
Title: Rotary joint wiring unit for robot
Inventor: NAKAMURA SATORU
IPC: B25J19/00
Filed: 2012-11-29
Abstract: PROBLEM TO BE SOLVED: To prevent the early wearing of a flexible printed wiring board (FPC board) when configuring a rotary joint wiring unit for a robot using the FPC.SOLUTION: A wiring case 13 is configured by combining a casing 15 connected to one of members of a robot with a reel 20 rotatable relatively to the casing 15 and connected to the other member rotated relatively to the one member. In the wiring case 13, an annular slide aid 23 having both ends in which a plurality of rollers 25 are arranged is disposed rotatably around the core member 16 of the reel 20. A FPC board 14 housed in the wiring case 13 is connected to the core member 16 at one end side and connected to the casing 15 at the other end side. A part located inside the slide aid 23 is wound along the inner periphery of the slide aid 23. A part drawn out from both ends of the slide aid 23 to the outside of the slide aid 23 is wound around the outside of the slide aid 23 in such a way that its winding direction is reverse to that inside the slide aid 23.
Patent JP-2014107506-A (JP)
Title: Semiconductor module
Inventor: SATO HIROSHI
IPC: H01L23/34
Filed: 2012-11-29
Abstract: PROBLEM TO BE SOLVED: To inhibit an influence on a bonding part of an electrode of a semiconductor chip and a surface wiring layer of a module substrate caused by temperature variation at the time of mounting or at the time of operation in a semiconductor module having a structure in which the semiconductor chip is sandwiched by a pair of module substrates.SOLUTION: A semiconductor module 1 according to the present embodiment comprises: a semiconductor chip 10 having electrodes on both electrode surfaces, respectively; and a pair of module substrates 11, 12 which are arranged on respective electrode surfaces of the semiconductor chip 10 and includes surface wiring layers 52, 62 having electrodes. The electrodes on each electrode surface of the semiconductor chip 10 are bonded to the electrodes of each opposite surface wiring layer of the module substrate. An electrode 50 in a surface wiring layer 52 of the module substrate 11 includes a groove 55. The semiconductor module further comprises rear face wiring layers 70, 71 on respective substrate rear faces of the module substrates 11, 12, respectively.
Patent JP-2014108035-A (JP)
Title: Rotary electric machine
Inventor: HIROSE HIDEO
IPC: H02K5/10
Filed: 2012-11-30
Abstract: PROBLEM TO BE SOLVED: To provide a risk measure for avoiding occurrence of troubles of a rotary electric machine, such as a rotation failure of the machine or deterioration in dielectric strength of a coil of the machine, by capturing magnetic metal objects, such as iron powder, inside the machine even when such metal objects enter a casing from the outside of the machine, and preventing the metal objects from being scattered in the machine.SOLUTION: A rotary electric machine comprises: a casing 1 formed of an enclosure frame 2 in a cylindrical shape and brackets 4 and 5 arranged at both ends of the enclosure frame 2; and a stator and a rotor included in the casing 1. Magnet pieces 14 are arranged inside the casing 1 for absorbing and capturing magnetic metal foreign matter, such as iron powder, which enters the casing 1 from the outside of the machine or is generated inside the machine during operation. The magnet pieces 14 are ferrite magnets, and arranged on an inner peripheral wall surface of the frame 2 (or the bracket 4 and 5) at a bottom side of the casing 1.
Patent JP-2014109798-A (JP)
Title: Operation device, image processing apparatus, and computer program
Inventor: KAWASHIMA YASUAKI
IPC: G06F3/041
Filed: 2012-11-30
Abstract: PROBLEM TO BE SOLVED: To prevent a situation in which a certain operation is erroneously recognized as a different operation even when a user intends to perform the certain operation on a touch panel.SOLUTION: In the case of performing a next second operation from coordinates x3 after performing a first operation between coordinates x1 and coordinates x2 on a touch panel, processing about the second operation is nullified if a coordinate displacement amount between the coordinates x3 and the coordinates x2 is smaller than a threshold and if a lapse time is also equal to or less than a fixed time.
Patent JP-2014109316-A (JP)
Title: Seismic isolation member
Inventor: HAYASHI SHINICHIRO
IPC: F16F15/02
Filed: 2012-11-30
Abstract: PROBLEM TO BE SOLVED: To provide a seismic isolation member which exhibits seismic actuation for either of short-period earthquake ground motion and long-period earthquake ground motion by interposing the seismic isolation member mainly between the earthquake ground motion generation surface side and the seismic isolation object member side.SOLUTION: A seismic isolation member is configured such that a lower side cylinder body 1 is vertically disposed on the earthquake ground motion generation surface side A, an upper side cylinder body 2 is hung on the seismic isolation object member side B concentrically with the lower side cylindrical body 1 and while keeping a prescribed interval S from the lower side cylindrical body 1, a linking spring 6 is intervened between both cylinder bodies 1, 2, both cylinder bodies 1, 2 are elastically connected via a controlling rod 3 on the axial line part of the cylinder bodies, the existing seismic isolation member which slides in the lateral direction is interposed on the interval S, thereby, pitching seismic isolation based on the existence of the interval S is stopped and such a change as to be engaged exclusively in rolling seismic isolation is permitted.
Patent JP-2014110203-A (JP)
Title: Illumination device
Inventor: MITOME MASAHIRO
IPC: F21V29/00
Filed: 2012-12-04
Abstract: PROBLEM TO BE SOLVED: To provide an illumination device using a light emitting element such as an LED which has characteristics of both uniformity of distribution of emitted light amount and high density.SOLUTION: An illumination device 1 includes a hollow case 10, one or more light emitting element 20 disposed inside the case 10, a diffusion and reflection part 30 which diffuses and reflects the light emitted from the light emitting element 20, and a light emitting part 40 which is provided as an opening of the case 10 and emits the light emitted from the light emitting element 20 and diffused and reflected by the diffusion and reflection part 30 outside the case 10 as a light flux. The light emitting element 20 is disposed outside a view range when the inside of the case 10 is viewed from the outside of the case 10 through the light emitting part 40.
Patent JP-2013191538-A (JP)
Title: Power storage module, manufacturing method therefor, and work machine
Inventor: YOKOYAMA KAZUYA
IPC: H01M50/211
Filed: 2012-12-06
Abstract: PROBLEM TO BE SOLVED: To provide a power storage module which allows for reduction in man-hour required for assembling a power storage module by stacking power storage cells.SOLUTION: A plurality of cell units are stacked. A pressurization mechanism applies a compression force in the stacking direction to the stack structure of cell units. Each cell unit has a power storage cell, and a frame for supporting the power storage cell. The frame has a positioning part for constraining the relative position of frames adjoining in the stacking direction in a direction orthogonal to the stacking direction. The positioning part positions the frames in a direction orthogonal to the stacking direction. Furthermore, in a state where a compression force is applied to the stack structure by the pressurization mechanism, a margin is left in such a direction that the frames approach furthermore.
Patent JP-2014115382-A (JP)
Title: Image forming system
Inventor: KIDERA HIRONARI
IPC: G03G21/14
Filed: 2012-12-07
Abstract: PROBLEM TO BE SOLVED: To provide a serial tandem type image forming system capable of preventing consumables used in each of image forming apparatuses from being deteriorated ununiformly.SOLUTION: When a print job performing an image forming process on one side of a sheet by using any of a first and a second image forming apparatuses 100, 200, and performing a paper conveying process without performing an image forming process on both sides of the sheet by using the other image forming apparatus is set, the degree of deterioration of a first consumable is compared with that of a second consumable on the basis of use histories of the first and the second consumables. A printing mode for performing an image forming process on one side of the sheet is set to any of the first and the second image forming apparatuses 100, 200, in accordance with a comparison result, and a conveyance mode for performing a paper conveying process without performing an image forming process on both sides of the sheet is set to the other image forming apparatus.
Patent JP-2014116737-A (JP)
Title: Image formation device, image formation device control method, and program
Inventor: NOMURA NOBUSHIGE
IPC: H04N1/46
Filed: 2012-12-07
Abstract: PROBLEM TO BE SOLVED: To generate a color image adapted to an image processing request with respect to a manuscript to be read for computerization, and also to reduce the consumption of a development material with background image printing.SOLUTION: An image formation device includes: reading means for reading an image from a manuscript; identification means for recognizing objects in an image to be read and identifying a background area; extraction means for extracting the background color of the manuscript on the basis of pixel characteristics of the identified background area; generation means for generating an electronic file added to image data from which the extracted background color is to be read; storage means for storing the generated electronic file; reception means for receiving a processing request with a different attribute with respect to the stored electronic file; and control means for controlling processing with respect to the electronic file in accordance with the attribute of the received processing request.
Patent JP-2014117117-A (JP)
Title: Control system of ac motor
Inventor: MORII AKIYOSHI
IPC: H02P21/00
Filed: 2012-12-12
Abstract: PROBLEM TO BE SOLVED: To suppress a loss when a control system formed so as to variably control the DC link voltage of an inverter by a step-up converter controls an AC motor by rectangular wave voltage control.SOLUTION: A converter 12 controls a system voltage VH that is the DC link voltage of an inverter 14 in accordance with a voltage command value. The inverter 14 outputs a rectangular wave voltage having the system voltage VH as an amplitude to an AC motor M1 when the rectangular wave voltage control is applied. When the rectangular wave voltage control is applied, the voltage command value of the system voltage VH is corrected so as to bring a current phase on a d-q plane of the AC motor M1 close to a target current phase line. The target current phase line is set at an advance angle side compared with an optimum current phase line that is the aggregation of current phases by which output torque becomes the maximum with respect to the same amplitude of the motor current in the AC motor M1.
Patent JP-2014116548-A (JP)
Title: Multilayer wiring board and manufacturing method therefor
Inventor: MAEDA SHINNOSUKE
IPC: H05K3/46
Filed: 2012-12-12
Abstract: PROBLEM TO BE SOLVED: To enhance the degree of freedom of design, in a multilayer wiring board with a built-in electronic component.SOLUTION: A multilayer wiring board 1 includes a first laminate constituted by laminating insulation layers 23, 24, 25, 26 in which via conductors 33, 34, 35, 36 having a shape of reducing the diameter from the upper surface side toward the lower surface side are formed, and conductor layers 13, 14, 15, 16, an electronic component 51 embedded in the first laminate, and a second laminate constituted by laminating an insulation layer 27 in which a via conductor 37 having a shape of reducing the diameter from the upper surface side toward the lower surface side is formed, and conductor layers 17, 18.
Patent JP-2014116550-A (JP)
Title: Temperature sensor, manufacturing method therefor and connection method of lead frame
Inventor: INABA HITOSHI
IPC: H01C17/12
Filed: 2012-12-12
Abstract: PROBLEM TO BE SOLVED: To provide a temperature sensor which allows for temperature measurement even under high temperature environment, while ensuring high bond strength of a pattern electrode and a lead frame, and to provide a manufacturing method therefor and a connection method of a lead frame.SOLUTION: A temperature sensor includes an insulating film 2, a thin film thermistor 3 patterned of a thermistor material on the surface of the insulating film, a pair of interdigital electrodes 4 formed on the thin film thermistor so as to face each other while having a plurality of combs, a pair of pattern electrodes 5 connected with the pair of interdigital electrodes and formed on the surface of the insulating film, and a pair of lead frames 6 arranged on the back of the insulating film on the opposite side of the pair of pattern electrodes, and connected therewith through a via hole H formed in the insulating film. The pair of lead frames are welded to a metal material M filling the via hole.