baber/WOPTO huggingface dataset:
Patent TW-I281435-B (TW)
Title: Mold set with core of adjustable position height
Inventor: LIAO CHIEN-CHUN
IPC: B29D11/00
Filed: 2004-08-20
Granted: 2007-05-21
Abstract: mold set with core of adjustable position height comprises a 1st mold unit and one 2nd mold unit installed opposite to the 1st mold unit. The 1st and 2nd mold units contain respectively a mold base and a core installed within the mold base, and the 2nd mold unit further contains an adjusting article installed onto one side of the core, in which the adjusting article is screwed into one screw hole of the mold base. By means of the design, when the adjusting article is rotated, one touch-stop end of the adjusting article is moved closer or away relative to the core to achieve the purpose of adjusting the position height of the core.
Patent TW-I237538-B (TW)
Title: Apparatus for automatic machine operation panel
Inventor: YE TZ-YUAN
IPC: H05K5/00
Filed: 2004-08-20
Granted: 2005-08-01
Abstract: An apparatus for automatic machine operation panel includes: a plurality of through holes is disposed on a surface of the operation panel, a plurality of screws is disposed on a reverse surface of the operation panel; at least one unit frame which has a plurality of protrusion portions and a plurality of concave portions; a circuit board is attached to an outer edge of the unit frame; a water-proof plastic pad is attached to an inter edge of the unit frame; flanges of a plurality of keys are attached to a concave notch of the water-proof plastic pad, front protrusion surfaces of the plurality of keys protrude from the though holes of the panel; a positioning block has a through hole and a notch, a top press surface of the notch is pressed on a backside surface of the circuit board, the screws extend through the holes, nuts are bolted on the screws; therefore, the circuit board, the unit frame, the water-proof plastic pad and the plurality of keys are positioned to the reverse surface of the operation panel tightly, the plurality of unit frames can be expanded and assembled to form various predetermined shapes, individual key element is then mounted so as to match the plurality of through holes of the operation panel.
Patent TW-I288478-B (TW)
Title: High voltage tolerance output stage
Inventor: LEE CHAO-CHENG
IPC: H01L29/66
Filed: 2004-08-26
Granted: 2007-10-11
Abstract: An output stage structure includes the first and second PMOS transistors and the first and second NMOS transistors, wherein these MOS transistors are manufactured with the twin well process. The first PMOS transistor has source connected to VDD, and gate connected to the first voltage. The second PMOS transistor has source connected to drain of the first PMOS transistor, gate connected to the second voltage, and drain connected to an output pad. The first NMOS transistor has drain connected to the output pad, and gate connected to the third voltage. The second NMOS transistor has drain connected to source of the first NMOS transistor, gate connected to the fourth voltage, and source connected to ground.
Patent TW-I265565-B (TW)
Title: A method to make a weight compensating/tuning layer on a substrate
Inventor: DOROS THEODORE
IPC: H04Q7/22
Filed: 2004-08-26
Granted: 2006-11-01
Abstract: Embodiments of the present invention form a weight-compensating/tuning layer on a structure (e.g., a silicon wafer with one or more layers of material (e.g., films)) having variations in its surface topology. The variations in surface topology take the form of thick and thin regions of materials. The weight-compensating/tuning layer includes narrow and wide regions corresponding to the thick and thin regions, respectively.
Patent TW-I273628-B (TW)
Title: Formation of a metal-containing film by sequential gas exposure in a batch type processing system
Inventor: DIP ANTHONY
IPC: H01L/
Filed: 2004-09-06
Granted: 2007-02-11
Abstract: A method is provided for forming a metal-containing film on a substrate by a sequential gas exposure process in a batch type processing system. A metal-containing film can be formed on a substrate by providing a substrate in a process chamber of a batch type processing system, heating the substrate, sequentially flowing a pulse of a metal-containing precursor gas and a pulse of a reactant gas in the process chamber, and repeating the flowing processes until a metal-containing film with desired film properties is formed on the substrate. The method can form a metal-oxide film, for example HfO2 and ZrO2, a metal-oxynitride film, for example HfxOzNw and HfxOzNw, a metal-silicate film, for example HfxSiyOz and ZrxSiyOz, and a nitrogen-containing metal-silicate film, for example HfxSiyOzNw and ZrxSiyOzNw. A processing tool containing a batch type processing system for forming a metal-containing film by a sequential gas exposure process is provided.
Patent TW-I281771-B (TW)
Title: Clocked cascading current-mode regulator with high noise immunity and arbitrary phase count, multiphase power converters and methods of controlling a plurality of clocked cascadable regulators
Inventor: HARRIS MATTHEW B
IPC: G05F1/40
Filed: 2004-09-21
Granted: 2007-05-21
Abstract: A clocked cascadable power regulator including synchronization logic and PWM control logic. The synchronization logic receives a clock signal and asserts a digital, output signal synchronized with the clock signal in response to assertion of a digital input signal. The PWM control logic controls a PWM cycle in response to the digital input signal and in response to an output control condition. The regulator may be used alone or cascaded with other similar regulators for implementing a multiphase power converter with multiple channels. The clocked cascadable regulator uses digital signals to communicate between channels. Digital signals are not prone to the same kind of signal degradation or noise susceptibility as analog signals. In the cascaded configuration, there is one clock common to all channels which ensures that the phase separation between the channels is symmetrical to within the jitter tolerance of the common clock.
Patent TW-I275680-B (TW)
Title: Artificial leather having laser pattern making layer and method for producing the same
Inventor: WU TZONG-BIN
IPC: D06N3/00
Filed: 2004-09-24
Granted: 2007-03-11
Abstract: This invention relates to an artificial leather having laser pattern making layer and method for producing the same. The artificial leather includes a substrate. The substrate is formed thereon with at least two resin layers each having a surface resin layer of different colors. By emitting high-energy excited emitting light beams to the surface resin layer for patterned scanning engraving, the different characteristics of the upper and lower layers of different colors allow the surface of the artificial leather to display patterns with multi-colored, 3D effects.
Patent TW-I262223-B (TW)
Title: Method for manufacturing fibril yarns having hologram
Inventor: TSAI PEI-TING
IPC: D02G1/00
Filed: 2004-10-22
Granted: 2006-09-21
Abstract: According to this invention, the method for manufacturing fibril yarns having hologram includes the steps of: arranging plural fibril yarns parallel to or substantially parallel to but not interlacing each other; coating a bonding resin and adhering a hologram film; curing the bonding resin, so as to cause the hologram film to be bonded to the plural fibril yarns arranged parallel or substantially parallel to each together; separating and recovering the plural fibril yarns arranged parallel or substantially parallel to each together. As such, the hologram films having predetermined patterns can be attached to the fibril yarns to allow the plural fibril yarns to display the hologram.
Patent TW-I337085-B (TW)
Title: A synergistic skin lightening composition
Inventor: SANZGIRI VIBHAV RAMRAO
IPC: A61K8/365
Filed: 2004-11-05
Granted: 2011-02-11
Abstract: A cosmetic composition is provided comprising vitamin B<SUB>6</SUB>, vitamin B<SUB>3 </SUB>and an organic acid. The components of the composition interact synergistically to enhance skin lightening.
Patent TW-I237330-B (TW)
Title: Hetero-junction bipolar transistor (HBT) power device with high heat-dissipation efficiency
Inventor: WANG YU-CHI
IPC: H01L21/331
Filed: 2004-11-10
Granted: 2005-08-01
Abstract: A hetero-junction bipolar transistor (HBT) power device is disclosed. It has a special layout of transistors. By using the backside via hole, the grounded backside metal will efficiently dissipate the heat generated by the power device. This design makes the temperature at the emitter junction of the device more uniform. The thermal runaway of the device is prevented and the operational characteristics of HBT power transistor of the device is preserved.
Patent TW-I272515-B (TW)
Title: Information input unit, storing unit, information input device, and information processing device
Inventor: NISHI KENJI
IPC: G06F3/0489
Filed: 2004-11-25
Granted: 2007-02-01
Abstract: An information input unit and the like being able to save space and less restraint on a key-touch operation. The information input unit is characterized in comprising a reflection unit (11B) provided with one or a plurality of reflection members (11C) having a retro-reflection feature, attaching elements (11c, etc.) for attaching the reflection unit to a finger of an operator, and changing mechanisms (11S, 11a1, etc.) for changing the reflectance distribution of the reflection element according to a finger pressure applied to the tip of the finger.
Patent TW-I249465-B (TW)
Title: Optical lens molding apparatus
Inventor: WANG MENG-KUN
IPC: B29D11/00
Filed: 2004-12-01
Granted: 2006-02-21
Abstract: An optical lens molding apparatus comprises a first mold core, a second mold core, two internal sleeves and an external sleeve. Moreover, the second mold core and the first mold core have a first coefficient of thermal expansion. The two internal sleeves invaginate to the outer surface of the first mold core and the second mold core individually, and have a second coefficient of thermal expansion. Furthermore, the external sleeve has a first internal diameter and a second internal diameter. The first mold core and the second mold core invaginate within the first internal diameter individually, and a cave is formed between the two mold cores. The two internal sleeves invaginate within the second internal diameter. Besides, the external sleeve has a third coefficient of thermal expansion, and the first and the second coefficient of thermal expansion are greater than the third coefficient of thermal expansion individually. The internal sleeves can improve the defect of the molded optical lens with bad quality caused by the heated expansive spacing between the first mold core, the second mold core and the external sleeve.
Patent TW-I271015-B (TW)
Title: Redundant power supply with AC-DC power input
Inventor: HUANG YUNG-SHIN
Filed: 2004-12-06
Granted: 2007-01-11
Abstract: A redundant power supply with AC-DC power input is disclosed. The redundant power supply is used through the parallel connection with the DC/DC power supply of the DC power source and the AC/DC power supply of the AC power source for electrically connecting to the power controlling circuit board, enabling the redundant power supply under an abnormal condition of power source to ceaselessly output the DC power to the electronic device for normal operation.
Patent TW-I241540-B (TW)
Title: Remote identification counterfeit-proof device
Inventor: FANG JIAN-SHING
IPC: G06K19/077
Filed: 2004-12-15
Granted: 2005-10-11
Abstract: The present invention relates to a counterfeit-proof device, and more particularly to a remote identification counterfeit-proof device, which is mainly provided a film on the outer package of merchandise having an identification module capable of performing remote identification. During the process of circulation and transportation management of goods, an external device can be employed to facilitate the control of the goods by reading and identifying the product information pre-stored in the identification module. Furthermore, because the identification module is damaged or removed when the product is sealed off or used, the identification capability will thus be removed and the fake product can be easily distinguished as a result of no identification from the film or the identification module when it is to be re-packaged in the outer package for sales, so as to prevent the trade of the fake product.
Patent TW-I250914-B (TW)
Title: Assembled type tool magazine tray for a CNC machining center
Inventor: LIOU SHING-RUNG
IPC: B23Q3/157
Filed: 2005-01-04
Granted: 2006-03-11
Abstract: This invention relates to an assembled type tool magazine tray for a CNC machining center, particularly to one for the tool magazine provided to the CNC machining center, including: an annular outer tray secured to the machine; an annular inner tray distant from an inner side of the outer tray at an appropriate distance, where the annular outer tray is not in contact with the annular inner tray; plural tool adaptor retaining plates provided to the annular inner tray and spaced at an appropriate distance, where tool adaptors can be engaged to the tool adaptor retaining plates, where the tool adaptors are also provided to locations between two neighboring tool adaptor retaining plates. The tool adaptor retaining plates can be formed by stamping dies and are punched to form plural retaining holes and assembling holes so as to reduce its volume and its weight, while ensuring steady and easy manipulation of dimension tolerance, reducing noises and prolonging lifespan of the tool magazine.
Patent TW-I264737-B (TW)
Title: High-power chip resistor structure with dual-layer resistance
Inventor: JI CHING-LIN
IPC: H01C7/00
Filed: 2005-01-10
Granted: 2006-10-21
Abstract: A structure of a high-power chip resistor with dual resistor layer for forming a pair of front conductive layers and a pair of back conductive layers on a substrate is disclosed. A first resistance layer is formed on the substrate and the front conductive layers. The two extremities of the first resistance layer are electrically connected to the front conductive layers respectively. A second resistance layer is formed on the substrate and the back conductive layers. The two extremities of the second resistance layer are electrically connected to the front conductive layers respectively. A conductive layer, a nickel layer and a tin layer are formed sequentially on the two extremities of the chip resistor wherein the tin layer could be soldered on a circuit substrate.
Patent TW-I271916-B (TW)
Title: Single-phase winding DC brushless motor pump
Inventor: SHIU SHIANG-YUAN
Filed: 2005-01-10
Granted: 2007-01-21
Abstract: The present invention relates to a single-phase winding DC brushless motor pump, which includes a hollow housing, a single-phase winding motor, a front cover body and a control unit. The control unit includes an excitation circuit and a signal controller. The excitation circuit is connected to an input end of a coil set of the motor to generate an excitation function to the coil set, so as to drive a rotor for rotation. The signal controller supplies power to the excitation circuit and continuously generates pulse signals with different frequencies. While supplying power, pulse signals starting from low frequency to high frequency are supplied to the excitation circuit to excite the coil set and drive the rotor to rotate from low speed to high speed.
Patent TW-I249456-B (TW)
Title: A ratchet spanner (2) having right-left horizontal shifting switch
Inventor: HU HOU-FEI
IPC: B25B13/46
Filed: 2005-01-21
Granted: 2006-02-21
Abstract: This invention of a ratchet spanner (2) having right-left horizontal shifting switch includes a spanner body, a ratchet element, a ratchet block, a shift switch, and a brake device. The spanner body has a head and a handle with a belly formed in between. The head has a hollow cylinder housing space with a concave room set inside; the belly has a long channel set on its top to connect to the beforesaid concave room and the long channel has a concave part formed on its sidewall; the ratchet element is set inside the spanner body housing space in a turnable manner; the ratchet block is set inside the spanner body concave room in a slidable manner, capable of engaging with the ratchet element at one end and with an indent set at the other end; the shift switch having a guide hole and an applying element for users to move the spanner is set inside the spanner body long channel in a slidable manner; the brake device is set inside the guide hole of the shift switch with both two ends against the ratchet block indent and the long channel concave part respectively. Thus when the shift switch is operated, the second brake element of the brake device inserts into the concave part as an axis center in order to make operations easier for users' convenience.
Patent TW-I375979-B (TW)
Title: Modeling resolution enhancement processes in integrated circuit fabrication
Inventor: TSAI CHI MING
IPC: G06F17/50
Filed: 2005-04-04
Granted: 2012-11-01
Abstract: A Wafer Image Modeling and Prediction System ("WIMAPS") is described that includes systems and methods that generate and/or apply models of resolution enhancement techniques ("RET") and printing processes in integrated circuit ("IC") fabrication. The WIMAPS provides efficient processes for use by designers in predicting the RET and wafer printing process so as to allow designers to filter predict printed silicon contours prior to application of RET and printing processes to the circuit design.
Patent TW-I282392-B (TW)
Title: Passive fan assembly
Inventor: HSU CHIA-MING
IPC: F04D29/36
Filed: 2005-08-04
Granted: 2007-06-11
Abstract: A passive fan assembly includes an impeller and a plurality of guiding blades set up in front of the impeller. The guiding blades and rotor blades of the impeller are positioned in a nearly perpendicular relationship from the cross-sectional view. Accordingly, airflow entering the passive fan assembly is guided along the curve surface of the guiding blades to effectively blow the rotor blades of the impeller.
Patent TW-I269263-B (TW)
Title: Display device
Inventor: HARADA KAZUYUKI
IPC: G09G3/36
Filed: 2005-08-08
Granted: 2006-12-21
Abstract: To provide a display capable of detecting surely defective wires on a panel, and capable of restraining production yield from becoming low. This display is provided with the first wire 52 for inspection of connected to the first wire 21 of an odd-numbered wire group 20 and the third wire 33 of an even-numbered wire group 30, and the second wire 53 for inspection connected to the second wire 22 adjacent to the first wire 21 of the odd-numbered wire group 20 and the fourth wire 34 adjacent to the third wire 33 of the even-numbered wire group 30.
Patent TW-I277528-B (TW)
Title: Disassembling device and wiping device for ink-jet head using same
Inventor: CHENG CHEN-HSING
IPC: B41J2/145
Filed: 2006-03-17
Granted: 2007-04-01
Abstract: The present invention relates to a disassembling device used for disassembling a wiper-winding spindle from a wiping device. The disassembling device includes a connecting element connecting with one end of the wiper-winding spindle, a pulling pole connecting with the connecting element, a bush for housing the pulling pole, and a flexible element located between the bush and the connecting element. The disassembling device can quickly make the wiper-winding spindle leave the wiper-winding spindle from the wiping device. A wiping device using the disassembling device is also included in the present invention.
Patent TW-I411052-B (TW)
Title: Flexible circuit substrate for flip-chip-on-flex applications
Inventor: COHN CHARLES
IPC: H05K3/34
Filed: 2006-11-14
Granted: 2013-10-01
Abstract: A circuit substrate for attachment to an integrated circuit chip comprises an electrical trace, a mounting pad and a dielectric layer. The mounting pad has a first surface, one or more sidewalls and a second surface. The first surface is attached to the electrical trace. The dielectric layer substantially covers the one or more sidewalls of the mounting pad and has an uppermost surface that is substantially coplanar with the second surface of the mounting pad.
Patent TW-I358638-B (TW)
Title: Heat dissipating system having detecting dust func
Inventor: CHEN MING-KE
IPC: G08B21/18
Filed: 2007-04-10
Granted: 2012-02-21
Abstract: A heat dissipating system includes a heat sink module, and a light alarm. A light element is arranged on the heat sink module and the light element emits light to the light alarm. When dust block the light emitted from the light element to the light alarm, the light alarm sends out an alarm signal.
Patent TW-I410140-B (TW)
Title: Video encoder and method for performing intra-prediction and video data compression
Inventor: ZHANG KAI
IPC: H04N19/159
Filed: 2009-09-28
Granted: 2013-09-21
Abstract: The invention discloses a method for internal prediction. The method comprises following steps: firstly, determining a first internal prediction mode of a left region block, a second internal prediction mode of an upper region block and a third internal prediction mode of a current region block, wherein the left region block is located on the left of the current region block, and the upper regionblock is located over the current region block; and then, selecting a target pixel from a plurality of pixels of the current region block, calculating a first predicted value of the target pixel according to the first internal prediction mode, calculating a second predicted value of the target pixel according to the second internal prediction mode, and calculating a third predicted value of the target pixel according to the third internal prediction mode; finally, averaging the first predicted value, the second predicted value and the third predicted value to obtain a weighted average predicted value. With the internal prediction method of an embodiment of the invention, the internal prediction can be performed on the current region block according to the internal prediction modes of adjacent region blocks. The invention also discloses a video coder and a method for video data compression.
Patent TW-I407868-B (TW)
Title: Method for manufacturing printed circuit board
Inventor: CHENG CHIEN PANG
IPC: H05K3/42
Filed: 2010-04-14
Granted: 2013-09-01
Abstract: A method for manufacturing a printed circuit board includes steps below. Firstly, a metal substrate is provided. Secondly, a liquid insulation material is printed on the metal substrate to form a first insulation layer. A first through hole is defined in the first insulation layer and a portion of the metal substrate is exposed from the through hole. Thirdly, a first conductive layer is formed on the surface of the first insulation layer, an inner wall of the first through hole, and the surface of the portion of the metal substrate exposed at the through hole. Fourthly, a first conductive circuit is formed from the first conductive layer on the surface of the first insulation layer, and a first communication structure is constituted by the first conductive layer on the inner wall of the first through hole and on the surface of the portion of the metal substrate. Thus that the first conductive circuit is electronically connected with the metal substrate by the first communication structure.