Patent SG-11201402746T-A (SG)
Title: Electronic substrate housing equipment and electric apparatus
Inventor: YOSHIKAWA MINORU
IPC: H05K7/18
Filed: 2012-11-16
Abstract: (i2) mwu ft iz s-5 iv x m £ titz s issaj n d9) mm IHMMi _ (43) 2013 ^6^ 6 0 (06.06.2013) I P O I P C T (10) WO 2013/080897 A1 (51) HOSK 7/20 (2006.01) (21) (22) (25) (26) 4>§fl(£> s In: HOSK 7/18 (2006.01) PCT/JP2012/080402 2012 ^ 11 M 16 0(16.11.2012) 0*ig (30) fiBfeltx — $: 2011-263753 2011 ^ 12 .E 1 0(01.12.2011) JP (71) ttllA ^TCDJI^IIICOI^T): 0* HI §1 3S ft (NEC CORPORATION) [JP/JP]; T 1088001 |7S1^ Tokyo (JP). (72) (71) ttllA (^lllCO^TCD^): H(YOSHI- KAWA, Minora) [JP/JP]; T 1088001 T g 7 # 1 0 Tokyo (JP). tM (SAKAMOTO, Hitoshi) [JP/JP]; T 1088001 M 7f1 Tokyo (JP). IE lit (CHIBA, Masaki) [JP/JP]; T 1088001 7f 1 ^0$lt Tokyo (JP). fiaH S — (INABA, Keni- chi) [JP/JP]; T 1088001 SET g 7 # 1 0 sstt l*l Tokyo (JP). |i»^C (MATSUNAGA, Arihiro) [JP/JP]; T 1088001 iE2iTg7Si Tokyo (JP). (74) ft H A : ~F W. H lit (SHIMOSAKA, Naoki); T 1088001 K«f|5;SESETg 7f 1 ^0^1f Tokyo (JP). (8i) II^H (^ro&i^PBy, IS ft nj f b): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) (asrofci^isy > ±T(Dmm(Dfcm% V&tf nlfb): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), n. — V 7 (AM, AZ, BY, KG, KZ, RU, TJ, TM), 3 — • V / ^ (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (54) Title: ELECTRONIC BOARD CONTAINING DEVICE AND ELECTRONIC APPARATUS (54) i mv&m : (57) Abstract: An electronic board (200A) incorporates heat generating a element (220). A housing (300A) hermetically contains the electronic board (200). A cooling unit (400) cools the electronic board (200). The cooling unit (400) comprises heat receiving a unit (410) and heat radiating a unit (420). The heat receiving unit (410) receives a heat from the electronic board (200). The heat ra - t diating unit (420), which is coupled to the heat receiving unit (410), radiates the heat that has been received by the heat receiving ^ unit (410) the from electronic board (200). The heat receiving unit (410) is hermetically disposed inside the housing (300A), while ^ the heat radiating unit (420) is disposed outside the housing (300). In this way, an efficient cooling can be achieved, and further, 00 maintenance and replacement can be done for each individual electronic board containing device. § (57)®$: 0 0 A 14, 2 2 0 tt1*3 0 0AI4, *15 2 0 0 L £3 TJRJg-fSo JfrSlSMOOIA, 1^*152 0 0^;tSP\"T-So Jfrsiauooii, S8&SP4 1 Ot, WL © S&SP4 2 0<t£ii*.Tl^o S8&SM10I4, 1^*152 0 -So SJS&SP4 2 014, S c* mUA- 1 odiiftSU SS&SP4 1 1^*152 o ofrbomZMt&o £& n nP4 1 0 14, ttf*3 0 0 ArtlcffifflSftTiSltbftTfcy, &8&SM2 0I4, ttf*3 0 onicfSltbtlT WO 2013/080897 Al I lllll llllllll II llllll III lllll lllll III III III lllll lllll lllll lllll llll lllll llll lllllll llll llll (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). - (&&£ 21 &(3))