baber/WOPTO huggingface dataset:
Patent TW-202219328-A (TW)
Inventor: TSUJI KAZUHITO
IPC: C25D21/04
Filed: 2021-09-27
Abstract: A technique that ensures suppressing deterioration of a plating quality of a substrate caused by air bubbles accumulated on a lower surface of a membrane is provided. An air bubble removing method of a plating apparatus is an air bubble removing method for removing air bubble in an anode chamber 13 in a plating apparatus 1000 including a plating tank 10 and a substrate holder 30. The air bubble removing method includes: supplying a plating solution Ps from at least one supply port 70 disposed in an outer peripheral portion 12 of the anode chamber to the anode chamber and causing at least one discharge port 71 disposed in the outer peripheral portion of the anode chamber so as to face the supply port to suction the supplied plating solution to form a shear flow Sf of the plating solution along a lower surface on the lower surface 61a of a membrane 61 in the anode chamber.
Patent TW-202223451-A (TW)
Title: Method for detecting edge part of optical film
Inventor: UNEME NOBUHISA
IPC: G02B5/30
Filed: 2021-09-29
Abstract: Provided is a method for detecting the edge part of an optical film with which it is possible to reliably detect the edge part of an optical film affixed to a rectangular panel. The detection method includes: a transportation step for transporting a rectangular panel on which an optical film is laminated; an imaging step for imaging a target region including the edge part of the optical film on the rectangular panel; an optimum image selection step for selecting, from a plurality of images obtained by imaging the target region at a plurality of positions, an optimum image for detecting the edge part; and an edge part detection step for detecting the edge part in the optimum image. In the imaging step, light is sequentially beamed from a plurality of light sources disposed along the transportation direction in which the rectangular panels are transported, and the target region is imaged at a plurality of positions extending from the upstream side to the downstream side with respect to the transportation direction by a single imaging means.
Patent TW-202232821-A (TW)
Title: battery connection module
Inventor: LI YUN-JIN
IPC: H01M50/50
Filed: 2021-03-16
Abstract: A battery connection module is provided and is adapted to connect a plurality of batteries, the battery connection module includes busbars, a circuit board and bridging pieces. The busbars are used to be connected to the batteries. The bridging pieces are connected between the corresponding busbars and the circuit board, each bridging piece has a circuit board connection segment and a busbar connection segment which are arranged along a straight direction and are respectively connected to the circuit board and the corresponding busbar and a buffering segment which is positioned between the circuit board connection segment and the busbar connection segment, the buffering segment includes at least two buffering strips, the at least two buffering strips are constructed as symmetry in a transverse direction with respect to a central line extending along the straight direction, each buffering strip has at least one curving portion.
Patent TW-202301335-A (TW)
Title: semiconductor memory device
Inventor: KUMAZAKI NORIYASU
IPC: G11C7/12
Filed: 2021-10-25
Abstract: A semiconductor memory device includes memory cell arrays including a first memory cell and a first word line connected to the first memory cell, a first wiring electrically connected to the first word lines corresponding to the memory cell arrays, a driver circuit electrically connected to the first wiring, second wirings electrically connected to the first wiring via the driver circuit, a voltage generation circuit including output terminals disposed corresponding to the second wirings, and first circuits disposed corresponding to the memory cell arrays. The voltage generation circuit is electrically connected to the first word lines via a first current path including the second wirings, the driver circuit, and the first wiring. The voltage generation circuit is electrically connected to the first word lines via a second current path including the second wirings and the first circuits and without including the driver circuit.
Patent TW-202224064-A (TW)
Inventor: SASAKI JUNICHI
IPC: H01J37/32
Filed: 2021-11-01
Abstract: An edge ring disposed around a processing target substrate includes a first member of an annular shape, which is made of a first material and has a first inclined portion at a lower portion of an inner peripheral side surface thereof; and a second member of an annular shape, which is made of a second material different from the first material and has a second inclined portion facing the first inclined portion, the second member being provided under the first member.
Patent TW-202315308-A (TW)
Title: Driving circuit and signal converting circuit
Inventor: YANG JUN
IPC: H03F3/45
Filed: 2021-11-16
Abstract: A driving current includes a first and second push-pull circuits which each includes a first and second output terminals and a first to fourth transistors. The first to fourth transistors are series connected. At least one of gates of the first and second transistors of the first push-pull circuit and at least one of gates of the third and fourth transistors of the second push-pull circuit receive a positive input signal. At least one of gates of the third and fourth transistors of the first push-pull circuit and at least one of gates of the first and second transistors of the second push-pull circuit receive a negative input signal. The first output terminals output a pair of first signals. The second output terminals output a pair of second signals.
Patent TW-202225274-A (TW)
Title: Polyimide composition, adhesive film, laminate, coverlay film, copper foil with resin, metal-crad laminate and circuit board
Inventor: NAKAJIMA YOSHITO
IPC: C09J179/08
Filed: 2021-11-17
Abstract: The present invention provides a polyimide composition which uses thermoplastic polyimide and can form a resin film with a low dielectric loss tangent and excellent adhesion. A polyimide composition comprises (A) thermoplastic polyimide and (B) polystyrene elastomer resin with an acid value of 10 mgKOH/g or less, and with respect to 100 parts by weight of (A) component, the content of (B) component is in the range of 10 parts by weight or more and 100 parts by weight or less. The thermoplastic resin layer obtained by forming the polyimide composition into a film, after being dehumidified under the constant temperature and humidity conditions of 23 DEG C and 50% RH for 24 hours, has a dielectric loss tangent (Tan[delta]) as measured by split post dielectric resonator (SPDR) at 10 GHz of 0.0020 or less.
Patent TW-202237181-A (TW)
Title: Methods for treating ocular diseases
Inventor: CLEMENS ANDREAS
IPC: A61K39/395
Filed: 2021-11-23
Abstract: The invention relates to methods for treating ocular disease with a VEGF antagonist. In particular, the invention relates to methods for treating ocular disease, e.g., neovascular age-related macular degeneration (nAMD), in a patient, the method comprising administering to the patient one initial dose of a VEGF antagonist, e.g., brolucizumab, followed by a maintenance regimen of additional doses of the VEGF antagonist administered in an administration interval of at least 8 weeks. In particular, the invention relates to methods for treating ocular disease, in particular neovascular age-related macular degeneration (nAMD), in a patient pretreated with one or more doses of a VEGF antagonist B, the method comprising administering to the patient an initial dose of a VEGF antagonist A followed by one or more additional doses of a VEGF antagonist A in an administration interval according to a maintenance regimen of the VEGF antagonist A for the treatment of the ocular disease.
Patent TW-202323723-A (TW)
Title: 加熱爐之溫度控制方法
Inventor: CHEN PO-CHEN
IPC: F23D14/00
Filed: 2021-12-02
Abstract: 一種加熱爐之溫度控制方法，包括：計算多個熱電偶所分別測得的多個溫度讀值之熱電偶平均溫度；根據絕熱火焰溫度與熱電偶平均溫度之間的溫度差來計算出響應時間；根據響應時間來計算出調整倍率；計算預設比例係數乘上調整倍率的補償比例係數；計算預設積分係數乘上調整倍率的補償積分係數；及根據補償比例係數與補償積分係數來對加熱爐的燃燒器的控制閥執行比例積分控制，以調整控制閥的閥開度。
Patent TW-202301179-A (TW)
Inventor: SU LIU
IPC: G06T7/00
Filed: 2021-12-23
Abstract: 公開了一種影像處理方法、裝置、設備以及儲存媒體，所述方法包括：獲取包含至少一個指甲的待處理影像中所述指甲的第一關鍵點，其中，每個所述指甲對應於多個第一關鍵點；根據所述指甲的多個第一關鍵點，確定所述指甲的待處理區域；獲取指甲素材，所述指甲素材上標注有多個第二關鍵點；根據所述第一關鍵點和所述第二關鍵點之間的對應關係，將所述指甲素材渲染到所述待處理區域中，得到處理後的影像。
Patent TW-202326705-A (TW)
Inventor: TU PO-JEN
IPC: G10K11/18
Filed: 2021-12-27
Abstract: 本發明實施例提供一種聲音播放裝置及定位方法。聲音播放裝置包括二收音器及二揚聲器。依據固定頻率且高頻的第一檢測聲音訊號決定物體相對於聲音播放裝置的水平方向。決定頻率線性變化且高頻的第二檢測聲音訊號經物體反射的行徑距離。行徑距離是源自揚聲器並經過物體後到達二收音器。依據第二檢測聲音訊號分別至二收音器的行徑距離之間的距離差異決定物體相對於聲音播放裝置的垂直角度。依據水平方向、行徑距離及垂直角度決定物體相對於聲音播放裝置的分開距離。藉此，可透過高頻聲音訊號定位。
Patent TW-202320594-A (TW)
Inventor: YOO KWANG-SUNG
IPC: H05H1/46
Filed: 2021-12-30
Abstract: The present invention provides an apparatus for processing a substrate. The apparatus for processing a substrate may comprise: a chuck which supports a substrate; a gas supply unit which supplies process gas to the edge region of the substrate supported by the chuck; and an edge electrode which is provided to surround the substrate supported by the chuck as viewed from above and generates plasma from the gas, wherein the edge electrode has a ring shape, and the edge electrode has a groove formed to be indented in a direction from the inner circumference toward the outer circumference of the edge electrode as viewed from above.
Patent TW-202329225-A (TW)
Title: Method for dicing wafer
Inventor: LU YEN-HAO
IPC: H01L21/304
Filed: 2022-01-05
Abstract: A method for dicing wafer includes the following steps: forming a plurality of first dicing trenches on a first surface of a wafer, and fixing a second surface of the wafer on a carrier film; and dicing a plurality of dicing streets between bottoms of the first dicing trenches and the second surface of the wafer, so that the wafer has been diced into a plurality of dies and widths of the dicing streets are smaller than widths of the first dicing trenches; wherein a surface of each of the dies has no solder and bump. As such, the method can form the dicing trenches at first and then dice the wafer into the dies through dicing the dicing streets, the chipping of the die or residue on the die therefore hide in the dicing trenches, thereby enhancing the bonding yield between the dies and the base plate.
Patent TW-202235604-A (TW)
Title: Cleaning liquid for semiconductor substrate
Inventor: YAMADA SHIMPEI
IPC: C11D7/32
Filed: 2022-01-28
Abstract: The present invention addresses the problem of providing a semiconductor substrate cleaning solution that has excellent cleaning performance and excellent ruthenium oxide dissolution performance when used as a cleaning solution after CMP treatment of a semiconductor substrate containing a metal film. The semiconductor substrate cleaning solution of the present invention is used for cleaning a semiconductor substrate and contains a compound represented by formula (A) and at least one purine compound selected from the group consisting of purine and purine derivatives.
Patent TW-202239152-A (TW)
Inventor: VITTHALADEVUNI PAVAN KUMAR
IPC: G06N3/02
Filed: 2022-02-07
Abstract: 描述了用於無線通訊的方法、系統和設備。使用者設備（UE）可以接收對要用於對壓縮資料集進行編碼的一或多個編碼操作的指示，該一或多個編碼操作包括差分編碼操作，或熵編碼操作，或兩者。在一些實例中，使用神經網路，UE可以首先基於額外編碼操作來對資料集進行編碼以產生壓縮資料集，並且隨後對基於額外編碼操作進行編碼的壓縮資料集進行量化。隨後，在資料集已經初始被編碼並且隨後被量化之後，UE可以使用對一或多個編碼操作的指示來進一步對資料集進行編碼和壓縮。隨後，UE可以基於一或多個編碼操作來向第二設備傳輸資料集。
Patent TW-202307907-A (TW)
Title: Plasma treatment apparatus, lower electrode assembly and forming method thereof
Inventor: NI TU-QIANG
IPC: H01J37/32
Filed: 2022-02-25
Abstract: Disclosed is a plasma treatment apparatus, a lower electrode assembly and a forming method thereof, wherein the lower electrode assembly includes: a base for carrying a substrate to be treated; a focus ring encircling a periphery of the base; a coupling loop disposed below the focus ring; a conductive layer disposed in the coupling loop; and a wire for electrically connecting the conductive layer and the base so that the base and the conducting layer are equipotential. The lower electrode assembly is less prone to cause arc discharge.
Patent TW-202303949-A (TW)
Title: Memory device and method of forming the same
Inventor: YEONG SAI-HOOI
IPC: H01L27/11592
Filed: 2022-03-03
Abstract: In an embodiment, a device includes: a first word line over a substrate, the first word line including a first conductive material; a first bit line intersecting the first word line; a first memory film between the first bit line and the first word line; and a first conductive spacer between the first memory film and the first word line, the first conductive spacer including a second conductive material, the second conductive material having a different work function than the first conductive material, the first conductive material having a lower resistivity than the second conductive material.
Patent TW-202239105-A (TW)
Title: Stator and stator manufacturing method
Inventor: KANNO TOMOHISA
IPC: H02K1/26
Filed: 2022-03-23
Abstract: The present invention comprises a stator core having a plurality of slots penetrating in the axial direction and a plurality of coil wires disposed in the slots, wherein: the coil wires have a circular cross-sectional shape; and the side surfaces of the slots at both ends in the circumferential direction are planes having a constant circumferential direction width from the inner side end in the radial direction to the outer side end in the radial direction and extending in the axial direction.
Patent TW-202243060-A (TW)
Title: Multilayer substrate manufacturing method and wiring substrate
Inventor: KITABATAKE Yukiko
IPC: H01L23/12
Filed: 2022-03-25
Abstract: Provided is a multilayer substrate manufacturing method such that it is possible to inhibit between-bump short-circuiting and substrate warping. This multilayer substrate manufacturing method includes: a step for preparing a first substrate which is a rigid substrate comprising a plurality of first bumps on the surface thereof at specified dispositions, and a second substrate or a semiconductor device comprising a plurality of second bumps on the surface thereof at corresponding dispositions, said step being such that the first bumps and the second bumps are composed of a metal or an alloy having a melting point of 600 DEG C or greater, and the first bumps and the second bumps have a height of 0.3 [mu]m or greater; and a step for carrying out cleaning processing of bonding surfaces of the first bumps and bonding surfaces of the second bumps in an atmosphere having a pressure of 1*10<SP>-3</SP> Pa or less, stacking the first substrate and the second substrate or the semiconductor device such that the bonding surfaces of the first bumps and the bonding surfaces of the second bumps are continuously abutting, pressure welding the first bumps and the second bumps at a temperature of 90 DEG C or less, and forming a multilayer substrate.
Patent TW-202242820-A (TW)
Title: Method of manufacturing led display panel
Inventor: CHEN ZHI-WEN
IPC: H01L33/62
Filed: 2022-04-12
Abstract: A method of manufacturing an LED display panel includes holding an LED wafer on a first holding unit, holding a circuit board on a second holding unit, positioning electrodes of the board at positions corresponding to electrode layers of the wafer while a face side of the board and a face side of the wafer are facing each other, joining the electrode layers and the electrodes to each other by applying a laser beam having a wavelength absorbable by a reverse side of one of the board and the wafer, to the reverse side of the one of the board and the wafer, thereby heating at least either the electrode layers or the electrodes, and breaking the buffer layers by applying a pulsed laser beam having a wavelength transmittable through a substrate of the wafer, to the buffer layers through a reverse side of the wafer.
Patent TW-202316250-A (TW)
Inventor: HSIEH MING-CHENG
IPC: G06F3/041
Filed: 2022-05-18
Abstract: 本揭露提供一種電子裝置，包括一功能層、一觸控層、以及一保護層。觸控層包括至少一觸控電極，且觸控層設置於功能層和保護層之間。保護層包括一底面和一頂面，底面面向觸控層，且頂面相反於底面。頂面包括一內部區域、一外部區域、以及一虛擬旋鈕部，其中虛擬旋鈕部設置於內部區域和外部區域之間且對應觸控電極，且虛擬旋鈕部的至少一部份相對於外部區域凸出或凹陷。
Patent TW-202246161-A (TW)
Title: Automatic webbing winding device and bedside bed having the same
Inventor: Hu jun-jie
IPC: A47D7/00
Filed: 2022-05-26
Abstract: The present invention discloses an automatic webbing winding device and a bedside bed having the same. The automatic webbing winding device includes: a base; a reel, mounted on the base and rotatable around a center of the base; a winding spring, mounted on the reel, and having one end fixed to the reel and the other end fixed to the base; and a webbing, mounted on the reel, where a fixed end of the webbing is fixed to the reel, and a free end of the webbing extends from the automatic webbing winding device, where when the free end of the webbing is pulled outward under an external force, the reel rotates along a forward direction, to wind the winding spring tightly, and when the external force is released, the reel rotates along a reverse direction under a tension of the winding spring, to wind the webbing up around the reel.
Patent TW-202308015-A (TW)
Title: Placing ultra-small or ultra-thin discrete components
Inventor: MARINOV VAL
IPC: H01L21/67
Filed: 2016-01-25
Abstract: A method includes dicing a wafer to form discrete components; transferring the discrete components onto a transparent carrier, including adhering the discrete component to a carrier release layer on the transparent carrier; and releasing one of the discrete components from the transparent carrier, the one of the discrete components being deposited onto a device substrate after the releasing.
Patent TW-202320185-A (TW)
Title: Methods and apparatus for tungsten gap fill
Inventor: LEI WEI
IPC: H01L21/54
Filed: 2022-07-12
Abstract: Methods for forming tungsten gap fill on a feature. A method for forming tungsten gap fill in a feature can include: treating a first layer on a substrate having a portion of the first layer exposed through the feature; depositing a tungsten liner layer atop the treated portion of the first layer in the feature using a physical vapor deposition (PVD) process; and depositing a tungsten fill layer into the feature and atop the tungsten liner layer using a chemical vapor deposition (CVD) process.
Patent TW-202324095-A (TW)
Inventor: XIU CHEN
IPC: G06F11/07
Filed: 2022-07-13
Abstract: An interface receives reported information from a system on chip (SOC), where the reported information includes: (1) hardware-reported information that is reported by a hardware functional module included in the SOC and (2) firmware-reported information that is reported by a firmware functional module included in the SOC. A processor receives one or more display settings and generates visual information based at least in part on: (1) the one or more display settings, (2) the hardware-reported information, and (3) the firmware-reported information. The visual information is displayed via a display.
Patent TW-202314591-A (TW)
Title: Appearance inspection device and method wherein the appearance inspection device includes a first imaging unit and a second imaging unit
Inventor: UCHIYAMA SHIGEYUKI
IPC: H05K13/00
Filed: 2022-08-16
Abstract: The present invention provides an appearance inspection device and an appearance inspection method capable of improving inspection accuracy. The appearance inspection device (1) includes: a first imaging unit (C1) configured to image a workpiece (W) from a side of a workpiece surface (Wa) on which an electronic component (PT) is mounted; and a second imaging unit (C2) configured to image the workpiece (W) from a side of a back surface (Wb) opposite to the workpiece surface (Wa). The first imaging unit (C1) is configured to capture at least one image capable of being identified from at least one of a position and an angle of the electronic component (PT) with respect to a lead frame (LF) when the workpiece surface (Wa) is viewed in a plan view. The second imaging unit (C2) is configured to capture an image capable of being identified by the size of a conductive bonding member (CB) protruding from the lead frame (LF) when overlooking the back surface (Wb) is viewed in a plan view.
Patent TW-202329095-A (TW)
Title: Sram design for energy efficient sequential access
Inventor: DALLARD EDITH
IPC: G11C7/10
Filed: 2022-08-22
Abstract: An SRAM controller for performing sequential accesses using internal ports that operate concurrently on different rows. Each internal port includes a row address strobe (RAS) timer that generates clock signals controlling the timing of operations during a RAS phase in which word line decoding is performed once for a group of bit cells being accessed. The RAS phase can involve additional conditioning operations, such as precharging of local bits lines associated with the group of bit cells. The RAS phase is followed by an input/output (IO) phase in which individual bit cells are accessed in sequential address order using a column select signal generated by an IO timer. The RAS phase of a first internal port can be at least partially overlapped by the IO phase of a second internal port to hide the RAS latency of the first internal port. The IO timer can be shared among internal ports.
Patent TW-202313838-A (TW)
Inventor: KAN DONCHORU
IPC: C08L63/00
Filed: 2022-08-26
Abstract: 一種硬化性樹脂組成物，其中，於藉由對硬化性樹脂組成物的樹脂硬化物進行動態黏彈性測定而獲得的縱軸為tanδ及橫軸為30℃～260℃的溫度的圖表中，（1）tanδ成為最大時的溫度未滿120℃，（2）tanδ的最大值超過0.400，且（3）220℃、230℃、240℃及250℃各溫度下的tanδ值的合計超過0.400或者70℃、80℃及90℃各溫度下的tanδ值的合計超過0.600。
Patent TW-202321813-A (TW)
Title: Photo mask and method for manufacturing semiconductor device
Inventor: LI BAO-CHIN
IPC: G03F1/38
Filed: 2022-08-29
Abstract: A photo mask includes a plurality of device features, a first assist feature, and a second assist feature. The device features are in a patterning region of a device region. The first assist feature are in the patterning region and adjacent to the device features. The first assist feature is for correcting an optical proximity effect in a photolithography process. The second assist feature is in a non-patterning region of the device region. The second assist feature is a sub-resolution correction feature, and a first distance between the second assist feature and one of the device features closest to the second assist feature is greater than a second distance between adjacent two of the device features.
Patent TW-202323622-A (TW)
Title: 縫紉機之控制裝置及設定裝置、以及縫紉機
Inventor: EGAMI SHINKO
IPC: D05B19/14
Filed: 2022-09-20
Abstract: 本發明之目的在於可變性設定用以避免加繞線跡之控制條件。
        本發明藉由CPU101執行之程式，判定形成下個針腳之方向是否屬於與加繞線跡對應之特定區域，於判定為是該特定區域時，進行包含以下之迂迴控制，即，藉由移動保持被縫製物之保持體(5)，使自縫針朝下方延伸之面線朝與完整線跡對應之方向迂迴，其後，使上述保持體移動至與上述下個針腳對應之目標位置。藉由操作面板6及CPU101執行之程式(設定機構)，可變性設定迂迴控制之各種條件。該可變性設定可以經由操作面板6之使用者操作，或組入於縫紉圖案程式資料中之迂迴控制用程式資料之設定等形態實現。迂迴控制之條件中，包含將迂迴控制之執行有效化，或可變性設定特定區域之範圍。
Patent TW-202322127-A (TW)
Title: Input/output circuit, memory device and method of multiply-accumulate operation
Inventor: HUNG JE-MIN
IPC: G11C11/54
Filed: 2022-09-22
Abstract: An input/output (I/O) circuit, a memory device and a method of multiply-accumulate operation are provided. The I/O circuit includes a charge integration circuit coupled to a bitline of the memory device. The charge integration circuit provides a sensing voltage based on a decrease of a voltage on the bitline. A comparator is coupled to the charge integration circuit. The comparator compares the sensing voltage with a reference voltage and provides an output voltage based on the comparison. A time-to-digital converter coupled to the comparator. The time-to-digital convertor converts a time associated with the output voltage to a digital value.