baber/WOPTO huggingface dataset:
Patent TW-202224123-A (TW)
Title: Chip package structure and method of manufacturing the same
Inventor: WANG TZU-HSUAN
IPC: H01L23/36
Filed: 2020-12-11
Abstract: A chip package structure includes a wiring board, a first chip, a second chip, a thermal conductive material, a molding compound and a heat dissipation part. The wiring board includes a plurality of circuit pads. The first chip is mounted on the wiring board and is electrically connected to at least one of the circuit pads. The first chip is located between the second chip and the wiring board. The thermal conductive material is located on the wiring board and penetrates the second chip and the first chip to extend to the wiring board. The molding compound is disposed on the wiring board, and the heat dissipation part is disposed on the molding material and thermally coupled to the thermal conductive material.
Patent TW-202218574-A (TW)
Inventor: NAZIR AAMER
IPC: A43B13/24
Filed: 2020-12-14
Abstract: A shoe midsole having a structure formed by additive manufacturing process, including a bottom pad, an upper pad and a shock-absorbing layer. The bottom pad has foot-shaped profile and includes a plurality of stress zones. The upper pad is arranged opposite to the bottom pad and has foot-shaped profile almost identical to that of the bottom pad. The shock-absorbing layer is arranged between the bottom pad and the upper pad and includes a plurality of pressure-bearing units. The pressure-bearing unit is arranged between the bottom pad and the upper pad in the manner that two ends of each pressure-bearing unit abut against the bottom pad and the upper pad respectively. The pressure-bearing unit has excellent mechanical properties such as higher energy absorption and force bearing capacity for bearing pressures or stress put by the foot, good flexibility and higher deflection capacity that can be elastically deformed in the longitudinal direction.
Patent TW-202147128-A (TW)
Inventor: CHEN BEN WEI
IPC: G06F13/42
Filed: 2020-12-25
Abstract: A universal peripheral extender architecture, system, and method is disclosed that addresses the need of communicatively connecting peripheral I/O devices and the smart host devices in legacy, medical, and industrial applications. As disclosed, a universal peripheral extender includes an I/O device translation & management module that has a device-side utility, a host-side I/O device translation & management utility, and a host/device translation & management scheduler utility.
Patent TW-202204218-A (TW)
Inventor: HUANG SZU-CHEN
IPC: B65B43/30
Filed: 2021-01-13
Abstract: An apparatus and method for expanding a box blank into a box, the apparatus comprising an arm assembly, a controller, a camera and a box blank conveyor. The arm assembly includes a folding arm having a position in a first direction and a rotational angle controlled by the controller based on a position of a feature of the box blank in the field of view of the camera. The camera captures images of the box blank which are used to position the arm assembly and to evaluate the need to reject a box blank.
Patent TW-202228938-A (TW)
Title: Tool extension
Inventor: CHEN CHIA-YI
IPC: B25F1/02
Filed: 2021-01-15
Abstract: A tool extension is provided, including a main body, a swing member and a locking structure. The main body has a connecting channel. The swing member is disposed on the main body. A driving member is disposed through the swing member and is movable between a first position and a second position. When the driving member is in the first position, the driving member is not extended into the connecting channel, the swing member is able to swing relative to the main body. When the driving member is in the second position, the driving member is extended into the connecting channel, the swing member is not able to swing relative to the main body.
Patent TW-202230703-A (TW)
Title: Patterned ground shield device
Inventor: YEN HSIAO-TSUNG
IPC: H01L23/58
Filed: 2021-01-20
Abstract: A patterned ground shield device includes a first patterned ground shield layer and a second patterned ground shield layer. The first patterned ground shield layer is disposed on a first layer, and the first patterned ground shield layer includes a plurality of first strip-shaped structures. Each of the first strip-shaped structures includes an oxide diffusion material. The second patterned ground shield layer is disposed on a second layer, and the second patterned ground shield layer includes a plurality of second strip-shaped structures. Each of the second strip-shaped structures includes a conductive material. The first strip-shaped structures and second strip-shaped structures are disposed to each other in an interlaced manner.
Patent TW-202146501-A (TW)
Title: Curable composition, and dry film and cured object obtained therefrom
Inventor: CHA HA-NEUL
IPC: C08G59/02
Filed: 2021-01-26
Abstract: To provide a curable composition capable of forming solder resists which combine flux resistance and folding endurance. The curable composition comprises (A) an alkali-soluble resin having at least any one structure selected from among a bisphenol A structure, a bisphenol F structure, and a urethane structure, (B) a photopolymerization initiator, and (C) an epoxy resin having an isocyanurate structure, wherein the epoxy resin (C) having an isocyanurate structure has a structure in which a nitrogen atom contained in the isocyanurate structure has been bonded to an epoxy group by an alkylene chain having two or more carbon atoms.
Patent TW-202130862-A (TW)
Title: Fused quartz crucible for producing silicon crystals, and method for producing a fused quartz crucible
Inventor: LEHMANN TONI
IPC: C30B29/06
Filed: 2021-01-29
Abstract: A fused quartz crucible for pulling a single crystal of silicon according to the Czochralski technique, having an inner side on which there is located an inner layer of fused quartz that forms a surface, the inner layer being provided with a crystallization promoter which on heating of the fused quartz crucible in the context of its designated use, in crystal pulling, brings about crystallization of fused quartz to form ß-cristobalite,
wherein the concentration C of synthetically obtained SiO 2 
at a distance d from the surface is greater than the concentration of synthetically obtained SiO 2 
at a distance d2 from the surface, where d2 is greater than d.
Patent TW-202133686-A (TW)
Title: Showerhead assembly
Inventor: FRANKLIN TIMOTHY JOSEPH
IPC: H05H7/00
Filed: 2021-01-29
Abstract: A showerhead assembly, and method of forming thereof is provided. The apparatus, for example, includes a gas distribution plate comprising an inner portion and an outer portion, the inner portion made from single crystal silicon (Si) and the outer portion made from one of single crystal Si or polysilicon (poly-Si), wherein a bonding layer is provided on a back surface of at least one of the inner portion or outer portion; a backing plate formed from silicon (Si) and silicon carbide (SiC) as a major component thereof, wherein the backing plate is bonded to at least one of the back surface of at least one of the inner portion or outer portion of the gas distribution plate.
Patent TW-202232210-A (TW)
Inventor: SUNG HSIN-HUNG
IPC: G02F1/1339
Filed: 2021-02-08
Abstract: 一種電子裝置包括主動元件基板、絕緣膜材、垂直線路以及異方性導電膠。主動元件基板包括基板、第一線路以及第二線路。第一線路配置於基板的第一表面上，第二線路配置於基板的第二表面上，且第一表面與第二表面彼此相對而基板的側表面將第一表面與第二表面連接。絕緣膜材配置於基板的側表面。垂直線路配置於絕緣膜材的表面上且位於絕緣膜材與基板的側表面之間。異方性導電膠配置於垂直線路與基板的側表面之間，且將垂直線路電性連接第一線路與第二線路。
Patent TW-202232107-A (TW)
Title: Bipolar high-precision current sensor which can generate a precise current signal to compensate for the lack of uneven output signal of the DC current converter
Inventor: LIU ZHEN-YAO
IPC: G01R19/00
Filed: 2021-02-09
Abstract: A bipolar high-precision current sensor mainly includes a current sensing unit, an adjustment correction unit, a signal conversion unit, a temperature control unit, and a temperature-adjusting unit, all of which are electrically connected with each other. A sensing current is supplied by the current sensing unit. After the current is adjusted by the adjustment correction unit, the current is converted into the display data for output by the signal conversion unit. The temperature control unit cooperates with the temperature-adjusting unit to generate a stable temperature so as to keep the sensor in a constant temperature state higher than room temperature for preventing the component errors caused by the change in ambient temperature, and then generating a precise current signal to compensate for the lack of uneven output signal of the DC current converter.
Patent TW-202146008-A (TW)
Title: Treatment of hbv
Inventor: LENZ OLIVER
IPC: A61K31/40
Filed: 2021-02-25
Abstract: The present disclosure is directed to methods of using a capsid assembly inhibitor for the treatment of hepatitis B virus infection.
Patent TW-202235728-A (TW)
Inventor: CHEN WEN-I
IPC: E04D13/00
Filed: 2021-03-05
Abstract: An embedded structure includes a bottom board, at least two bonding posts and at least two hook members. The bonding posts are erectly disposed on the bottom board, and are arranged at intervals. The hook members are respectively disposed on the bonding posts, or at one side of the bonding posts. The hook members can be bonded with structural reinforcement and concrete, so that the embedded structure is embedded in a ceiling. Screws can be conveniently used to combine with the embedded structure and a suspension plate, so that the weight of a water heater can be directly transferred to the embedded structure and the construction is simple and easy.
Patent TW-202236296-A (TW)
Title: Image processing apparatus for cardiac image evaluation and ventricle status identification method
Inventor: HSU HUNG-SHENG
IPC: G06T3/40
Filed: 2021-03-10
Abstract: An image processing apparatus for cardiac image evaluation and a ventricle status identification method are provided. In the method, a region of interest (ROI) is determined from multiple target images, a variation of grayscale values of multiple pixels in the ROIs of each target image is determined, and one or more representative images are determined according to the variation of the grayscale values. The target image is related to the pixels within the endocardium outline of the left ventricle. The boundary of the ROI is located at two sides of the bottom of the endocardium outline approximately. The ROI is corresponding to the mitral valve. The variation of the grayscale values is related to the motion of the mitral valve. The representative image is used for the evaluation of the status of the left ventricle. Accordingly, the end-systolic and end-diastolic can be identified with high precision and celerity.
Patent TW-202205159-A (TW)
Inventor: HASSEL JUHA
IPC: H01L39/00
Filed: 2021-03-17
Abstract: 一種低溫積體電路或積體模組(1201)包括行波參數放大器或約瑟夫遜參數放大器(1001)。振盪器(1004)組構為產生振盪驅動信號，並且將所述振盪驅動信號耦合到所述放大器中。信號輸入(1203)將輸入信號耦合到所述放大器中。偏壓輸入(1205)將偏壓信號耦合到所述振盪器中。信號輸出將來自所述放大器的輸出信號輸送出該低溫積體電路或積體模組(1201)。
Patent TW-202203862-A (TW)
Inventor: FITTIPALDI MAURO
IPC: A61B90/10
Filed: 2021-03-25
Abstract: 一種用於引導式機器人手術的夾板裝置包含弧形夾板本體，該弧形夾板本體具有第一端及第二端及相對的凹面及凸面。該夾板本體於該第一端與該第二端之間界定複數個隔開的孔，而且每一個孔都於該凹面與該凸面之間延伸。於該第一端與該第二端之間，追蹤部與該夾板本體的凸面接合，使得該孔中的至少一者部署於該追蹤部與該第一端及該第二端中之每一者之間。該追蹤部自該凸面向外延伸且具有與其接合的動力座。
Patent TW-202240499-A (TW)
Title: 交易處理方法、終端及存儲介質
Inventor: YANG CHUN-CHIH
IPC: G06Q20/32
Filed: 2021-04-01
Abstract: 本申請涉及智慧支付技術領域，提出一種交易處理方法、終端及存儲介質，所述方法包括：第一終端發送目標交易授權請求至服務端；服務端接收目標交易授權請求，解析目標交易授權請求獲取客戶的卡片資訊，發送生物特徵認證請求至第二終端；第二終端接收服務端發送的生物特徵認證請求，根據生物認證請求對客戶進行認證，在認證成功後發送授權指令至第一終端；第一終端執行目標交易。本申請透過利用第二終端的生物特徵辨識技術進行生物特徵認證，無需將客戶的生物特徵資料上傳到服務端，提高了交易安全性。
Patent TW-202240125-A (TW)
Title: Escape-preventing arrow with which the animal hit by the arrow body will be restrained and cannot escape
Inventor: Liu ji-chang
IPC: F41B15/10
Filed: 2021-04-09
Abstract: The present invention provides an escape-preventing arrow, which includes: an arrow body having two ends that are an arrow tail and an arrowhead, respectively, wherein the arrow body has a buckle portion near the arrowhead; a hook arranged on the buckle portion, wherein the hook is separated from the arrow body when being impacted; and a restraining line connected between the hook and the arrow body. With the arrow made of the arrow body, the hook and the restraining line, after the arrow body hits an animal, the hook may be hooked on the grass and trees, so that the animal is restrained and cannot escape. As a result, the hunter has enough time to go forward and give the animal another knife so as to kill the animal quickly and reduce its pain, thereby greatly mitigating the problem of insufficient killing efficiency when using the arrow and bow.
Patent TW-202232116-A (TW)
Title: 測試樣品特性之焦耳(joule)加熱誘發的調變之微四點(micro-four-point)計量
Inventor: PETERSEN DIRCH HJORTH
IPC: G01R15/12
Filed: 2021-04-14
Abstract: 本發明揭示一種藉由使用一多端子微探針執行電量測而獲得包括一導電或半導電材料(線/面積/體積)之一測試樣品之一物理特性的方法。藉由跨電連接至該測試樣品之一第一對探針端子傳遞一ac電流，跨電連接至該測試樣品之一第二對探針端子量測電流傳導端子之電力供應頻率之一倍及三倍下之電壓，且依據該等頻率下之電壓量測計算該測試樣品之(若干)經溫度調變特性而誘發該測試樣品內之週期性焦耳加熱。可藉由從該測試樣品之表觀(加熱影響)電阻率減去一可量測電阻率溫度係數(TCR)偏移而判定與TCR、一電氣關鍵尺寸(ECD)或該測試樣品在環境實驗溫度下之真實電阻率成比例之一值。
Patent TW-202209608-A (TW)
Title: Packaging structure applied to power converter
Inventor: FANG CHI-QING
IPC: H01L23/52
Filed: 2021-04-21
Abstract: The invention provides a packaging structure suitable for the power converter. The packaging structure is characterized in that a first power transistor and a control and drive circuit are integrated on the same wafer, so the high-frequency switching action of the first power transistor can be better realized, the working frequency of the first power transistor is improved, and switching loss is reduced; a second power transistor is integrated in an independent second wafer, the first wafer and the second wafer are separated in the packaging structure, interference or other negative effects on the first wafer are not generated by control and driving actions of the second power transistor, and reliability is improved. The packaging structure is advantaged in that the first wafer and the second wafer can be connected through a large-area connection structure, and thereby relatively low interconnection resistance and improving large-current processing capability are realized.
Patent TW-202202644-A (TW)
Inventor: ORII YUICHI
IPC: C23C14/35
Filed: 2021-04-28
Abstract: 本發明之課題為謀求膜厚分布的均勻化。在本發明之成膜方法中，使用至少3個以上的複數個旋轉靶來對基板進行濺鍍成膜，複數個該旋轉靶係具有中心軸與靶面且在內部具備能夠繞中心軸旋轉的磁石。複數個旋轉靶係被配置為中心軸互相平行且中心軸與基板平行。一邊對複數個旋轉靶供應電力，一邊使複數個旋轉靶之各自的磁石在具有離基板最近的A點之圓弧上繞中心軸移動，一邊對基板進行濺鍍成膜，在複數個旋轉靶內，至少被配置於兩端的一對旋轉靶之磁石於圓弧上，在比A點更遠離基板之中心的區域成膜的時間較在比A點更靠近基板之中心的區域成膜的時間更短。
Patent TW-202244871-A (TW)
Inventor: LIN CHIH-LUNG
IPC: G09G3/32
Filed: 2021-04-30
Abstract: 一種驅動電路，包含發光元件、第一P型電晶體、第二P型電晶體、第三P型電晶體、第一N型電晶體、第二N型電晶體、第三N型電晶體以及第四N型電晶體。第一P型電晶體用以提供驅動電流予發光元件以驅動發光元件發光。發光元件、第一P型電晶體、第二P型電晶體、第三P型電晶體電性耦接在驅動電流的電流路徑。第一N型電晶體用以於預充電期間重置發光元件之第一端的電位。第二N型電晶體用以於預充電期間將系統高電壓端之電位傳送該第一P型電晶體之閘極端。第三N型電晶體以及第四N型電晶體用以進行第一P型電晶體之臨界電壓的補償。
Patent TW-202238754-A (TW)
Inventor: CHEN JIUN-TING
IPC: H01L25/065
Filed: 2021-05-24
Abstract: 一種半導體封裝以及其製造方法。半導體封裝包含至少一個半導體晶粒、插入件、包封體、保護層以及連接件。插入件具有第一表面、與第一表面相對的第二表面以及連接第一表面和第二表面的側壁。半導體晶粒設置在插入件的第一表面上且與插入件電連接。包封體設置在插入件上方且橫向地包封至少一個半導體晶粒。連接件設置在插入件的第二表面上且通過插入件與至少一個半導體晶粒電連接。保護層設置在插入件的第二表面上且環繞連接件。插入件的側壁包含連接到第二表面的傾斜側壁，且保護層與插入件的傾斜側壁接觸。
Patent TW-202147644-A (TW)
Inventor: MEZOUARI SAMIR
IPC: H01L33/10
Filed: 2021-06-04
Abstract: A pixel comprising a first sub-pixel. The first sub-pixel comprises an LED layer comprising a light-emitting material configured to emit pump light having a pump wavelength. A container layer has a container surface comprising a first container aperture that defines a first container volume extending through the container layer. A first colour converting layer provided in the first container volume is configured to receive pump light from the LED layer and emit first converted light of a first converted wavelength. A first lens is provided on the container layer over the first container aperture, having an outer side that comprises a first convex surface. A first reflector conforming to the first convex surface comprises a first reflector configured to reflect light at the pump wavelength and transmit light at the first converted wavelength; and a second reflector configured to reflect light at both the pump wavelength and the first converted wavelength.
Patent TW-202203771-A (TW)
Title: Method for reducing amount of sugar used in chocolate
Inventor: HE MO-GENG
IPC: A23L27/30
Filed: 2021-06-15
Abstract: The present invention addresses the problem of providing a method for enhancing the sweetness of sugar in chocolate that contains a prescribed amount of sugar, to thereby reduce the amount of sugar used. Upon thoroughly investigating a resolution to the abovementioned problem, the inventors discovered that incorporating a prescribed amount of phosphatidyl choline in chocolate that contains a prescribed amount of sugar makes it possible to enhance the sweetness of the sugar, resultantly making it possible to reduce the amount of sugar used, whereupon the inventors perfected the present invention.
Patent TW-202217315-A (TW)
Title: Methods of providing modulators of tau aggregation
Inventor: WISCHIK CLAUDE MICHEL
IPC: G01N33/68
Filed: 2021-07-09
Abstract: The present invention relates generally to methods for selecting or designing a compound for modulating the aggregation of a Tau protein.The method comprising using computer-implemented molecular modelling means to compare the three-dimensional structure of a candidate compound with a three-dimensional structure of at least a part of the Tau protein comprising amino acids 315-378 and determine whether the candidate compound is able to simultaneously form non-covalent interactions with two or more of Leu315, Ser341, Glu342, Lys343, Phe346, Lys347, Val350, Ser352, Ile354, Lys369, Ile371, Glu372, Phe378 and Thr373. A candidate compound that is able to form said interactions is predicted to modulate the aggregation of the Tau protein or truncated form thereof. Methods using a three-dimensional structural model of at least a part of the Tau protein comprising amino acids 315-378, wherein the model is an intermediate in the aggregation process of the part of the Tau protein with a paired helical filament(PHF) are also described, as are computing systems and products.
Patent TW-202213557-A (TW)
Title: Methods for forming semiconductor devices
Inventor: Wu pei-wen
IPC: H01L21/60
Filed: 2021-07-14
Abstract: A metal adhesion layer may be formed on a bottom and a sidewall of a trench prior to formation of a metal plug in the trench. A plasma may be used to modify the phase composition of the metal adhesion layer to increase adhesion between the metal adhesion layer and the metal plug. In particular, the plasma may cause a shift or transformation of the phase composition of the metal adhesion layer to cause the metal adhesion layer to be composed of a (111) dominant phase. The (111) dominant phase of the metal adhesion layer increases adhesion between the metal adhesion layer.
Patent TW-202216781-A (TW)
Inventor: MIN JING
IPC: A61P31/18
Filed: 2021-07-16
Abstract: 本揭示案提供結合人類α4β7之抗α4β7抗體、其製備方法及其治療感染HIV之患者的用途。
Patent TW-202305820-A (TW)
Title: Management system of isolated patients run by visualized smart system enabling the health care workers to quickly browse the status of each responsible patient to apply individually corresponding infection protective measures for each patient
Inventor: LAI LAI-XUN
IPC: G16H10/00
Filed: 2021-07-23
Abstract: Disclosed is a management system of isolated patients run by visualized smart system, which relates to patients under investigation with specific targets such as infectious diseases and/or antimicrobial-resistant bacteria that require a testing result for possible and necessary infection caution control. The disclosed uses a determination module to determine whether the testing result of a patient is positive for a specific target or not, and the result of the testing target is visualized along with the patient, the ward and the hospital bed on a display by using visual content such as diagrams, colors and/or characters based on the result of determination, thereby enabling the health care workers to quickly browse the status of each responsible patient, so as to apply individually corresponding infection protective measures for each patient.
Patent TW-202220994-A (TW)
Inventor: Xu xiao-feng
IPC: A61K31/437
Filed: 2021-08-17
Abstract: 本發明涉及式 (I)所示化合物，包含其的藥用組合物和其用途。所述化合物可用於治療，預防或改善諸如癌症之類的疾病或障礙。
Patent TW-202219266-A (TW)
Title: 微熱循環儀
Inventor: OVERMAAT TOBY FIONA
IPC: C12M1/38
Filed: 2021-08-25
Abstract: 本發明係關於一種微熱循環儀包含至少一微型貯存槽、至少一溫控元件、至少一位移單元和至少一位移傳動機構，該至少一位移單元包含該至少一微型貯存槽或該至少一溫控元件，並且該至少一位移單元可以通過該位移傳動機構沿著一第一方向自一第一位置移動到一第二位置，並且其中該至少一溫控元件在該第一位置對該至少一微型貯存槽溫控作用，並且該位移傳動機構可操作地耦合該至少一位移單元和另一溫控元件或另一微型貯存槽。
Patent TW-202214401-A (TW)
Inventor: KWAK DONG-HOON
IPC: B25J9/16
Filed: 2021-09-06
Abstract: The present disclosure relates to an embodiment of a moving robot system, including a plurality of moving robots that perform cleaning while driving in an area to be cleaned, and a controller that communicates with the plurality of moving robots to transmit a control command for remote control to the plurality of moving robots, wherein upon receiving a control command for a collaborative driving mode for collaboratively cleaning the area to be cleaned from the controller, the plurality of moving robots determine whether driving states of the plurality of moving robots correspond to preset reference conditions to perform a motion for the collaborative driving mode according to the determination result.
Patent TW-202314877-A (TW)
Title: Substrate holder, bonding system, and bonding method capable of stably bonding semiconductor chips to individual substrates
Inventor: SEYAMA KOHEI
IPC: H01L21/60
Filed: 2021-09-15
Abstract: A bonding system (90) of the present invention is provided with a bonding device (80) for bonding semiconductor chips (45) to individual substrates (41); and a substrate holder (10) for holding the individual substrates (41). The bonding device (80) is provided with a stage (31) for fixing, by suction, the substrate holder (10) on a placement surface (13a). The substrate holder (10) is provided with a plate-shaped base (11) having an upper surface (11a) on which the individual substrates (41) are placed and a lower surface (11b) that is fixed by suction onto the placement surface (31a); and a positioning member (21) provided on the base (11) for defining the position of the individual substrates (41).
Patent TW-202216762-A (TW)
Title: TGFBR2-ECD mutant, and fusion protein comprising same and use thereof
Inventor: Wang hai-bin
IPC: C07K16/22
Filed: 2021-09-22
Abstract: Provided are a TGFBR2-ECD mutant, a fusion polypeptide, targeting molecule or fusion protein comprising same, and the use of the mutant, fusion polypeptide, targeting molecule or fusion protein in the preparation of a drug for treating and/or preventing neoplastic diseases.
Patent TW-202233900-A (TW)
Title: Method of electroplating
Inventor: BERNT MARVIN L
IPC: C25D5/18
Filed: 2021-10-21
Abstract: Exemplary methods of electroplating may include delivering a current from a power supply through a plating bath of an electroplating chamber for a first period of time. The current delivered may be or include a pulsed current at a duty cycle of less than or about 50%. The methods may include plating a first amount of metal on a substrate within the plating bath. The substrate may define a via within the substrate. The methods may include, subsequent the first period of time, transitioning the power supply to a continuous DC current delivery for a second period of time. The methods may include plating a second amount of metal on the substrate.