Patent SG-186485-A1 (SG)
Title: Electronic component mounting apparatus and the same method thereof
Inventor: NAGAI SATORU
Filed: 2011-06-27
Abstract: Mobile I Deutsch Espanol Frangais 1_1:4tVici Oi I Portugues I Pyc,ccue I 'hi' IWIPO PATENTSCOPESearch International and National Patent Collections WOFILD 11•1TEL TUA P PERTY ORGANILZATFONI 'I Search I Browse [ Translate Options I News E Login HelpHome IP Services PATENTSCOPE 1. (W02012002300) ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT OUNTING METE PCT Biblio. Data Full Text National Phase Notices Documents Latest bibliographic data on file with the International Bureau Per LinPub. No.: WO/2012/002300 International Application No.: PCT/JP2011/064625Publication Date: 05.01.2012 International Filing Date: 27.06.2011IPC: HOW 21/52(2006.01), HOW 21/60 (2006.01)8Applicants: SHINKAWA LTD. [JP/JP]; 2-51-1, lnadaira, Musashimurayama-shi, Tokyo 2088585 JP) (ForAll Designated States Except US).NAGAI, Satoru [JP/JP]; (JP) (For US Only). SONODA, Yukitaka [JP/JP]; (JP) (For US Only)Inventors: NAGAI, Satoru; (JP). SONODA, Yukitaka; (JP)Agent: YKI Patent Attorneys; 1-34-12, Kichijoji-Honcho, Musashino-shi, Tokyo 00004 (JP)Priority 2010-149107 30.06.2010 JPData:Title (EN) ELECTRONIC COMPONENT MOUNTING APPARATUS AN ELECTRONIC COMPONENTMOUNTING METHOD(FR) APPAREIL DE MONTAGE DE COMPOSANT ELECTRO QUE ET PROCEDE DE MONTAGE DE COMPOSANT ELECTRONIQUE(JA) Z±SigaggfflatiZ±SeciNgZfA(EN)Disclosed is an electronic component mounting app atus, which bonds together the electrode of an electronic co onent (31) and the electrode of a substrate by having there.. -tween a bonding metal that melts with heat and which mou theelectronic component (31) on the substrate. The ctronic component mounting apparatus is provided with a heater base (27a), which is driven in the direction in which e heater baseis brought close to or far from the substrate d which has a built-in ceramic heater (27h); and a bondin tool (28), which has the upper surface (28a) adhered to d fixed on the lower surface of the heater base (27a), and a •ase (28c) formed on the lower surface (28b) so as to suck nd hold the electronic component (31), and which is heate by means of the ceramic heater (27h) in the heater base (2 a), and bonds the electronic component (31) sucked to the b e (28c) to the substrate by thermocompression bonding. e bonding tool (28) has a cooling flow channel that co ects between the upper surface(28a) and the side surface 8d) of the base (28c). Consequently, a cooling time required at the time ofmounting the electronic mponent is shortened.(FR)Cette invention co erne un appareil de montage de composant electronique qui retie ['electrode duncomposant electroni (31) a relectrode d'un substrat en deposant entre celles-ci un metal liant qui fondsous l'effet de la ch eur, et qui effectue le montage du composant electronique (31) sur le substrat Leditappareil de mon e de composant electronique comprend : une base de rechauffeur (27a), entratneedans un sens q a rapproche ou qui reloigne du substrat, et qui comprend un rechauffeur ceramiqueintegre (27h); un outil de soudure (28) dont la surface superieure (28a) est fixee a la surface inferieurede la base d rechauffeur (27a) et adhere a celle-ci. Ledit oufil (28) comprend de plus une base (28c)formee sur a surface superieure (28b) de sorte a aspirer et retenir le composant electronique (31). L'outilde soud e est chauffe au moyen du rechauffeur ceramique (27h) situe dans la base de rechauffeur (27a), et il so e, par soudage par thermocompression, le composant electronique (31) aspire contre la base(28c) u substrat. L'outil de soudure (28) comprend un canal d'ecoulement de fluide de refroidissementqui lie la surface superieure (28a) a la surface laterale (28d) de la base (28c). L'appareil de l'inventionp met de reduire un temps de refroidissement requis au moment du montage du composant electronique. (31)021.1e46COMOLVMat, 'MPicaPp (31) .X4kcoitz Wg1--61M±SilAgWalz151,vC, a 4E et Hit IzENVI, t5vt —9(27h) eptik21-.6t —9A—X (27 a)L, t-9e(—a (27a) OTffliZttLTINZV14± (28a)LTE(28b)ffilzfr4FRWCZ±Sell (31)t.10*.alffnitEE —9"C—A (27a)(DeSty9t —9 (27h)(Zek-D-Cfilltat4t— etft(2801:10*Litt÷fIl (31 ) (28) e,fiti, (2 8) It, _t(28a) &kg (28c)OARIN (28d) e.31i1"4-Znifigni4-4-Z. Zttlz.t9, a±fffiNaWgfl PaiartillOrel MetEl Z.Designated AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BR, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ,States: DE, DK, DM, DO, DZ, EC, EE, EG, ES, Fl, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, NP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.African Regional Intellectual Property Org. (ARIPO) (BW, OH, GM, NE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)Eurasian Patent Organization (EAPO) (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, Fl, FR, GB, GR, HR, RU, 1E, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)African Intellectual Property Organization (0API) (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).Publication Language: Japanese (JA)Filing Language: Japanese (JA)Provided is an electronic component mounting apparatus for bonding an electrode of an electronic component (31) and an electrode of a substrate with thermally fusible bond metal to mount the electronic component (31) on the substrate, including a heater base (27a) incorporating a ceramic heater (27h), the heater base to be driven in a direction getting close to and away from the substrate, and a bonding tool (28) having an upper surface (28a) fixed in close contact to the lower surface of the heater base (27a) and a pedestal (28c) formed on a lower surface (28b) to suck and hold the electronic component (31) thereon, the bonding tool to be heated with the ceramic heater (27h) in the heater base (27a) to thermally bond the electronic component (31) sucked on the pedestal (28c) to the substrate, in which the bonding tool (28) includes a cooling flow passage providing communication between the upper surface (28a) and a side surface (28d) of the pedestal (28c). This offers the advantage of shortening the time for cooling during mounting of the electronic component.Figure 1