baber/WOPTO huggingface dataset:
Patent JP-2010092564-A (JP)
Title: Method for manufacturing magnetic disk
Inventor: KAJITA KEIICHI
IPC: G11B5/84
Filed: 2008-10-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a magnetic disk with which a magnetic disk equipped with a thin film carbon-based protective layer having enhanced adhesiveness between itself and a lubricating layer and sufficient mechanical hardness is obtained.  <P>SOLUTION: In the method for manufacturing the magnetic disk: an adhesion layer 2, a soft magnetic backing layer 3, an underlayer 4, a nonmagnetic intermediate layer 5, a magnetic recording layer 6, a carbon-based protective layer 7, and a lubricating layer 8 are sequentially formed on a substrate 1, wherein nitriding treatment is conducted to the carbon-based protective layer 7 by using a mixed gas of gaseous nitrogen and a rare gas having ionization energy larger than that of the gaseous nitrogen after deposition of the carbon-based protective layer 7.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009041363-A (JP)
Title: Method of constructing prestressed concrete structure
Inventor: ICHINAMI KATSUHIRO
IPC: E04H7/20
Filed: 2008-10-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of constructing a prestressed concrete structure capable of preventing an intermediate tensioning operation from affecting the start of an upper side-wall construction operation by reducing the amount of a tendon in the vertical direction of a side-wall.  <P>SOLUTION: The side-wall 2 comprises a side-wall general part 21 and a portion 22 increased in member thickness from the intermediate part of the general part downward. The tendon 51 is disposed vertically at the portion 22 increased in member thickness. The portion 22 increased in member thickness can be formed in a tapered shape expanded downward or in a shape tiered expanded downward.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2010103229-A (JP)
Title: Silicon carbide semiconductor device and manufacturing method of the same
Inventor: TAMASO HIDETO
IPC: H01L21/28
Filed: 2008-10-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a silicon carbide semiconductor device that has an ohmic electrode with a contact of an interconnection improved, by suppressing deposition of carbon without causing Schottky contacts to be generated, and to provide a manufacturing method for the device.  <P>SOLUTION: When the ohmic electrode of an SiC (silicon carbide) semiconductor device is produced, a first metal layer 12 made of one kind of first metallic element is formed on one main surface of the SiC layer 11. A Si (silicon) layer 13 made of Si (silicon) is formed on the surface (upper side shown in Fig.1) opposite to the surface facing to the SiC layer 11 of the first metallic layer. A laminated structure 10A formed in this way is subjected to heat treatment. According to the procedure, the silicon carbide semiconductor device having an ohmic electrode providing a satisfactory contact with interconnections with a deposition of carbon atom on the surface layer of electrodes and the formation of the Schottky contact by the Si and the SiC suppressed can be acquired.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010104129-A (JP)
Title: Power supply system, power supply side controller, and electric motor car
Inventor: KISHIMOTO KEIJI
IPC: H02M3/155
Filed: 2008-10-22
Abstract: <P>PROBLEM TO BE SOLVED: To provide a power supply system, which suppresses the shortening of life as a whole system by suppressing the temperature rise of each storage device and the temperature dispersion of each storage device and which suppresses the interruption of the power supply system by the occurrence of an error, a power supply side controller, and an electric motor car.  <P>SOLUTION: The power supply side controller 211 controls the duty ratios of switching elements (FETs 21A/22A to FETs 21C/22C), or performs the duty ratio control of reducing the time ratio of an ON state in controlling the ON state and OFF state of the switching elements, if temperatures detected by NTC 40A to NTC 40C are higher than a predetermined temperature TH. The power supply side controller 211 transmits a temperature control notice showing the performance state of the temperature control to a load side controller 221. This load side controller 221 controls electric power consumed by a load 220 or electric power generated by the load 220 based on the temperature control notice.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010102959-A (JP)
Title: Interconnector for solid oxide fuel cell, and solid oxide fuel cell
Inventor: TAKAHASHI YOSUKE
IPC: H01M8/02
Filed: 2008-10-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide an interconnector not including an element deteriorating battery performance, and having a low reduction expansion rate.  <P>SOLUTION: This interconnector 20 is disposed between cells so as to electrically connect a plurality of cells, in a solid oxide fuel cell 1 having the plurality of cells 10 each comprising an air electrode 14 that is a positive electrode, a fuel electrode 16 that is a negative electrode, and a solid oxide electrolyte (a solid electrolyte 12) disposed between both the electrodes. The interconnector 20 consists of a perovskite type oxide represented by a formula, Ln<SB>1-x</SB>Ae<SB>x</SB>Zr<SB>1-y</SB>Fe<SB>y</SB>O<SB>3-δ</SB>(wherein, Ln is at least one of element selected from lanthanoids; Ae is one or more kinds of elements selected from a group comprising Sr, Ba, and Ca; x is ≥0 and ≤1; y is ≥0.4 and <1; and δ is a value decided such that the value satisfies a charge neutral condition).  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010103355-A (JP)
Title: Led module for backlight
Inventor: TAKAHASHI TOMOHIRO
IPC: F21S2/00
Filed: 2008-10-24
Abstract: <P>PROBLEM TO BE SOLVED: To prevent a corrosive gas from invading in an LED module to keep the intensity of the LED module from falling off for an extended period of time, and simplify the shape of a light guide plate and make it a productive "LED module for a backlight".  <P>SOLUTION: The LED module for fixing an LED element, a light guide plate, various optical sheets, LCD, and the like are provided to form an LED module for a backlight that is to guide light from the LED module to the backside of the LCD via a light guide plate. The LED module fixes the LED element onto the FPC, fixes the FPC on a metallic frame so as to promote heat release, and closely seals and insulates the interior of the LED module from the outside by various methods. As this insulation method, a metallic frame for fixing an FPC is formed in an L shape, for example, and a cap of a transparent material is formed in an inverted L shape and put on its top, and is sealed together with the edge parts. Alternatively, the lower part of the light guide plate may be made concave, and the LED module may be tightly sealed therein.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010106790-A (JP)
Title: Hermetic compressor
Inventor: YAMADA TAKEHIRO
IPC: F25B1/00
Filed: 2008-10-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a hermetic compressor having improved oil separation effect and capable of reducing oil rising.  <P>SOLUTION: The hermetic compressor is equipped with a casing 2 being a hollow airtight compressor, a compression mechanism 3, a motor 4, and a coolant guide 5. The coolant guide 5 forms a coolant passage 21 guiding coolant gas compressed by the compression mechanism 3 to the motor 4 along with a body part of the casing 2. The coolant passage 21 has an inlet part 21a taking in the coolant gas compressed by the compression mechanism, a middle passage portion 21b, and two or more outlet parts 21c, 21d, 21e. The middle passage portion 21b is communicated with the inlet part 21a, and it is extended in a circumferential direction of the body part of the casing 2 more than the inlet part 21a. The two or more outlet parts 21c, 21d, 21e are communicated with the middle passage portion 21b, and they guide the coolant gas from the middle passage portion 21b to a plurality of core cut spaces 15 formed between a stator core 11 and the body part of the casing 2.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010105880-A (JP)
Title: Quartz glass crucible having multilayered structure
Inventor: KODAMA MAKIKO
IPC: C30B29/06
Filed: 2008-10-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a quartz silica glass crucible which enables the production (pulling) of silicon single crystals with uniform quality even in the production (pulling) of large sized silicon single crystals, while suppressing local temperature fluctuation of molten silicon.  <P>SOLUTION: The quartz silica glass crucible is employed in pulling silicon single crystals and includes at least a transparent layer, semitransparent layer, and opaque layer disposed from the inner surface side to the outer surface side of the crucible. The content of bubbles in the transparent layer is less than 0.3%; the content of bubbles in the semitransparent layer falls within a range of 0.3-0.6%; and the content of bubbles in the opaque layer is greater than 0.6%.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010107893-A (JP)
Title: Liquid crystal display device and electronic apparatus
Inventor: NOGUCHI KOJI
IPC: G02F1/13363
Filed: 2008-10-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a liquid crystal display device with which contrast in a reflective display can be improved.  <P>SOLUTION: A retardation plate 15 of which the refractive index is maximum in a Z direction (a direction normal to the substrate) is disposed on a reflective display section 1R. Thereby retardation observed from a slanting direction is compensated between itself and a liquid crystal layer 13 exhibiting a black display state in a homogeneous alignment state. Consequently on the reflective display section 1R, viewing angle characteristics in the black display is improved. Further, the retardation plate 15 is optionally constructed with a single retardation layer formed by stretching in the Z direction, or optionally constructed with a laminated structure of an A plate and a positive C plate.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010109934-A (JP)
Title: Content receiving device and content reproducing method
Inventor: NARAHARA TAKASHI
IPC: G06F3/048
Filed: 2008-10-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a content reproducing device capable of switching by an easy operation, from a moving video content being received and reproduced through moving video distribution service that utilizes a network, to another moving video content.  <P>SOLUTION: The content reproducing device 10 has a browser 16, which is connected to a server 30 for distributing moving video contents of program units via the network 31 to reproduce the moving video contents of the program units on the screen of a monitor 18. The browser 16 includes a function of performing program switch processing that maintains a specified program which is switched, from a program in full-screen reproduction, according into an input instruction from a remote controller 20 in a full-screen reproduction mode.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010114996-A (JP)
Title: Multiphase dc/dc converter
Inventor: MIKI TOMOYUKI
IPC: H02M3/155
Filed: 2008-11-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide a multiphase DC-DC converter that performs suitable overvoltage protection operation regardless of the number of drive phases.  <P>SOLUTION: A control circuit 20 for the multiphase DC/DC converter drives a plurality of DC/DC converter circuits 10-1 to 10-m connected in parallel while shifting the output phases from each other, and includes a phase controller 24 which sets the number of drive phases of the DC/DC converter circuits 10-1 to 10-m arbitrarily, and an overvoltage protection unit 25 which turns the low-side transistors NL1 to NLm forming the output stages of all DC/DC converter circuits 10-1 to 10-m on, respectively, regardless of the number of drive phases when the overvoltage of the output voltage Vout is detected.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2009133610-A (JP)
Title: Refrigerator
Inventor: MORI KIYOSHI
IPC: F25D23/00
Filed: 2008-11-06
Abstract: <P>PROBLEM TO BE SOLVED: To solve a problem in a device functioned by application of high voltage such as an electrostatic atomization device that an electric field is formed around the device, and a structure and received objects in the electric field are charged with high potential, thus causing harmful effects such as a malfunction of an apparatus and electric discharging accompanied by an electric shock to a human body.  <P>SOLUTION: In this refrigerator comprising the device such as the electrostatic atomization device 115 functioned by the application of a high voltage, a vegetable compartment case 116, a partition 103b, a partition 114 and the like disposed around an installation position of the electrostatic atomization device 115 are composed of conductive materials, and these structures are connected with a reference potential portion, thus the electric potential of the structures around an electric field generation source is suppressed by reference potential, the generation of the electric field can be suppressed, and not only the structure constrained by the reference potential but also objects around the structure can be prevented from being charged.  <P>COPYRIGHT: (C)2009,JPO&INPIT
Patent JP-2010114312-A (JP)
Title: Organic electroluminescent device
Inventor: HAMAGUCHI ATSUSHI
IPC: H01L51/50
Filed: 2008-11-07
Abstract: <P>PROBLEM TO BE SOLVED: To lower a drive voltage of an organic EL element by lowering a hole injection barrier from an positive electrode to an organic layer.  <P>SOLUTION: The organic EL element includes a hole injection layer containing aromatic hydrocarbon, comprising no hetero atom, and metal oxide. By vacuum-depositing a low-molecular organic EL material by using a metal mask, a device of top emission type is manufactured.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010116666-A (JP)
Title: Come-off prevention implement and assembling method for opening/closing body
Inventor: SUMI KAZUHIRO
IPC: E06B9/18
Filed: 2008-11-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a come-off prevention implement capable of improving the efficiency of assembling work for an opening/closing body.  <P>SOLUTION: The come-off prevention implement 41 prevents the occurrence of the come-off of silencing members 21 fitted into both ends in the axial direction of a link connection shaft of a link 11a of a shutter curtain, respectively. The come-off prevention implement 41 is provided with a come-off prevention implement body 42. A holding body 43 at one side for holding the silencing member 21 fitted into one end in the axial direction of the link connection shaft is provided at one side of the come-off prevention implement body 42. A holding body 44 at the other side for holding the silencing member 21 fitted into the other end in the axial direction of the link connection shaft is provided at the other side of the come-off prevention implement body 42. Each of the holding body 43 at one side and the holding body 44 at the other side has a fitting 46 fitted into an outer peripheral face of the silencing member 21 and an abutting part 48 abutted on an outer end face of the silencing member 21.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010115996-A (JP)
Title: Rear seat back supporting structure
Inventor: SHO KENGO
IPC: B62D25/08
Filed: 2008-11-12
Abstract: <P>PROBLEM TO BE SOLVED: To improve the fixing accuracy of a rear seat back of an automobile and to suppress the increase of cost and vehicle weight.  <P>SOLUTION: A rear seat back supporting structure, which includes an upper back panel 12 and hook members 14 provided toward the front of a vehicle body at both right and left sides of the upper back panel 12, fixes the rear seat back by locking a wire member 2 provided at the back surface of the rear seat back to the hook members 14. The structure further includes brace members 1, which are extended being inclined in the height direction at the rear of the rear seat back, and a front panel 13, to which the upper ends 1a of the brace members 1 are attached and on which the hook members 14 are provided. The upper ends 1a of the brace members 1 are attached at positions where a line segment, which connects linearly the upper ends 1a of the brace member 1 and fulcrums 13a that are caused to occur to the front panel 13 when the upper ends 1a act as points of application, is positioned below the hook members 14.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010117587-A (JP)
Title: Camera system for construction work, and stroboscopic device for cellular phone with camera
Inventor: NISHIMURA HIROAKI
IPC: H04N5/238
Filed: 2008-11-13
Abstract: <P>PROBLEM TO BE SOLVED: To take a photograph of construction work in which a small chalkboard for construction work is electronically photographed on a dark construction site by using a cellular phone with a camera.  <P>SOLUTION: A stroboscopic device 4, which emits strobe light by a strobe light-emitting part 11 when receiving an infrared ray radiated from an infrared transmission part of the cellular phone with a camera 3, is attached to the cellular phone with a camera 3. The cellular phone with a camera 3 is connected to a WEB server 5 through a base station 6 and the Internet 7, so as to download a chalkboard application 8 and a stroboscope control application 9 fit to a type of the cellular phone with a camera 3. When taking the photograph of construction work by using the cellular phone with a camera 3, an image of the chalkboard for construction work is electronically taken by the chalkboard application 8. When taking the photograph by a camera part of the cellular phone with a camera 3, the infrared ray is radiated from the infrared transmission part by the stroboscope control application 9.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010117975-A (JP)
Title: Image forming system, terminal device, server, image forming device, and image forming method
Inventor: SUMIMOTO HARUNAO
IPC: G06F3/12
Filed: 2008-11-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image forming system capable of updating driver modules.  <P>SOLUTION: A device driver with a module, corresponding to a terminal device function, is installed in a first terminal device. Then, the module in the first terminal device is transmitted to a server. Next, the module is imported into the device driver of the server. The module imported into the device driver of the server is transmitted to a second terminal device. The second terminal device installs the received module as a module for its device driver.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010094482-A (JP)
Title: Method of coupling fused brush part and main body part
Inventor: TAKEUCHI ETSUKO
IPC: A46B9/02
Filed: 2008-10-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of coupling a fused brush part and a body part, without using an adhesive or the like and without worsening productivity.  <P>SOLUTION: A proper amount of yarn material group is inserted into metal, when coupling the fused brush part and the body part, an end face is fusion-molded to prepare a proper number of metal protrusions on a body coupling face, the yarn material group is fused, and the fused brush part is joined thereafter to the body part, by bringing the body part into pressure contact under softened states of a resin and a metal component. The body part 2 is provided with a proper number of protrusions 3, a brush part fused liquid comes in around the periphery of portion thereof, followed to be cooled, and the fused brush part is thereafter fixed firmly to the body part.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010123686-A (JP)
Title: Semiconductor device and manufacturing method thereof
Inventor: SATO YUKIHIRO
IPC: H01L21/60
Filed: 2008-11-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a means for improving reliability of a semiconductor device.  <P>SOLUTION: A semiconductor chip 3 is mounted over a chip mounting portion 2 of a lead frame 41 via solder 11a. A metal plate 6 is arranged over a source pad electrode 3s of the semiconductor chip 3 and a lead portion 4a of a lead frame 41 via solder 11b, 11c. A solder reflow process is performed thereby to bond the semiconductor chip 3 over the chip mounting portion 2 with the solder 11a, and to bond the metal plate 6 to the source pad electrode 3a and the lead portion 4 with the solder 11b, 11c. The lead frame 41 is formed of a copper alloy, and thus has its softening temperature higher than the temperature of the solder reflow process. The metal plate 6 is formed of oxygen-free copper, and has its softening temperature lower than the temperature of the solder reflow process, whereby the metal plate 6 is softened in the solder reflow process. Thereafter, a gate pad electrode 3g of the semiconductor chip 3 is coupled to a lead portion 5a via a wire 7, a sealing resin portion 8 is formed, and then the lead frame 41 is cut.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010122994-A (JP)
Title: Face authentication system
Inventor: ENDO JUNPEI
IPC: G06T7/00
Filed: 2008-11-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a face authentication system hardly affected by a quantization error.  <P>SOLUTION: The system includes: an imaging means 1; a face detecting means 2; a cutting-out means 4 for cutting out a plurality of normalized cut-out images A, B, by changing respectively cut-out conditions for cutting out the normalized cut-out images A, B in conformity with a preset size and angle of an image used for authentication, from an image of a face area; a cut-out condition changing means 5 for changing the cut-out condition in the cutting-out means 4; a density gradient image generating means 6 for generating density gradient images from the plurality of normalized cut-out images A, B, respectively; an authentication image generating means 8 for generating one sheet of authentication image from the plurality of density gradient images; and an authentication means 10 for authenticating the face, using the authentication image.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010122129-A (JP)
Title: Measuring device
Inventor: IGUCHI KIYOSHI
IPC: A61B1/00
Filed: 2008-11-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a measuring device capable of measuring easily a tubular measuring object.  <P>SOLUTION: This device includes an irradiation means 4 for irradiating light over the whole circumference of an inner circumferential surface 2a of the tubular measuring object 2, a projection means 6 for projecting reflected light of light irradiated by the irradiation means 4, and an imaging means 7 for imaging an image projected by the projection means 6. The irradiation means 4 and the imaging means 7 are arranged oppositely, and the projection means 6 is arranged between the irradiation means 4 and the imaging means 7, and the irradiation means 4 has a constitution for irradiating light to the inner circumferential surface 2a extendedly conically so as to form linear ring light L between the irradiation means 4 and the imaging means 7 on the inner circumferential surface 2a, and the ring light L is projected to the projection means 6, and the ring light projected to the projection means is imaged by the imaging means 7, to thereby measure the measuring object 2.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010122558-A (JP)
Title: Heater for fixing, and method for manufacturing the same
Inventor: KANBA NOBORU
IPC: G03G21/00
Filed: 2008-11-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a new heater for fixing provided with a protective layer, which excels in heat resistance, insulating property, and wear resistance and whose friction coefficient is low to some extent and whose heat conductivity is high to some extent, as a heating element for a fixing device of an electrophotographic image forming apparatus.  <P>SOLUTION: The heater includes: base material; a carbon-based heating element layer provided on the base material and containing at least amorphous carbon; a first protective layer covering the carbon-based heating element layer and obtained by mixing a metal or semimetal compound in heat resistant resin body material; and a second protective layer covering the first protective layer and composed of heat resistant resin.  <P>COPYRIGHT: (C)2010,JPO&INPIT