baber/WOPTO huggingface dataset:
Patent JP-2010042450-A (JP)
Title: Apparatus for rolling seamless pipe and control method for rolling of seamless pipe
Inventor: YAMANE AKIHITO
IPC: B21B17/02
Filed: 2009-10-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide an apparatus for rolling a seamless pipe and a control method for rolling of the seamless pipe by which the tube having small thickness deviation on the outlet side of a reducing mill or the like for adjusting the outside diameter of the pipe is manufactured without using internal tools.  <P>SOLUTION: The apparatus for rolling the seamless pipe is provided with: a mandrel mill 31 for rolling the pipes, which has a plurality of caliber roll stands and, in which a mandrel bar 33 is arranged in the array of roll calibers which is formed with the caliber roll stands; an extractor for pulling the pipe out of the mandrel bar or a rolling mill 35 for adjusting the outside diameter of the pipe, which is arranged in series on the downstream side of the mandrel mill; and the device for controlling the rolling with which the roll gap of the mandrel mill is adjusted on the basis of the calculated amount of thickness deviation after calculating the amount of the thickness deviation to be imparted to the pipe on the outlet side of the mandrel mill.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010130004-A (JP)
Title: Integrated circuit substrate and multi-chip integrated circuit element package
Inventor: SHIN MU-SEOB
IPC: H01L23/12
Filed: 2009-10-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide an integrated circuit substrate capable of relatively improving electric resistance and signal delay and employing a bond finger; and an integrated circuit element package.  <P>SOLUTION: This integrated circuit substrate includes an integrated circuit chip having a plurality of conductive pads on a surface thereof and a printed circuit board mounted with the integrated circuit chip. The printed circuit board includes a plurality of alternately arranged first and second conductive bond fingers having first and second heights different from each other corresponding to the plurality of conductive pads, and a plurality of first insulating supports 112 supporting the first conductive bond fingers 114 to have relatively large heights relative to the second conductive bond fingers 113. In addition, the integrated circuit substrate includes: a plurality of first electric connection bodies for respectively electrically connecting a plurality of first conductive pads in the plurality of conductive pads to the corresponding first conductive bond fingers, and a plurality of second electric connection bodies for respectively electrically connecting a plurality of second conductive pads in the plurality of conductive pads to the corresponding second conductive bond fingers.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2010098314-A (JP)
Title: Image sensor and method of manufacturing the same
Inventor: SHIM HEE SUNG
IPC: H04N5/361
Filed: 2009-10-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image sensor capable of obtaining the ohmic contact of the interconnection of a readout circuit and an image sensing part without the need of wafer alignment for the connection of the image sensing part at the upper part and the readout circuit, and to provide a method of manufacturing the same.  <P>SOLUTION: The image sensor comprises: the readout circuit 120 formed in a first substrate 100; the interconnection 150 electrically connected to the readout circuit 120 and formed on the first substrate 100; the image sensing part 210 formed on the interconnection 150; and a via plug 250 formed at a pixel boundary so as to electrically connect the image sensing part 210 and the interconnection 150.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011085864-A (JP)
Title: Screen, and method for manufacturing the same
Inventor: OTANI MAKOTO
IPC: G03B21/60
Filed: 2009-10-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a screen capable of reflecting an image properly, and to provide a method for manufacturing the screen.  <P>SOLUTION: The screen for displaying a projected image includes a screen substrate 11 having an incidence surface 11A entered by light. A plurality of recessed parts 22 are formed on the incidence surface. In the plurality of recessed parts 22, a dimension in the A-direction from a reference point positioned on the same plane as the incidence surface 11A toward the center C of each recessed part 22 is set beforehand respectively. At least some of the plurality of recessed parts 22 have respectively a first recessed part 3 with an approximately concave curved surface shape having a reflection domain (reflection surface 33) for reflecting incident light, and a second recessed part 4 with an approximately concave curved surface shape having a center C2 on a nearer position to the reference point with respect to the first recessed part 3, and formed so that a part is overlapped on the first recessed part 3, for allowing light to enter the reflection domain. The reflection domain is positioned on the opposite side to the center C2 of the second recessed part with respect to the center C1 of the first recessed part 3, and a curvature radius r2 of the second recessed part 4 is smaller than a curvature radius r1 of the first recessed part 3.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010017714-A (JP)
Title: Composite polyamide reverse osmosis membrane and method of producing the same
Inventor: KOO JA-YOUNG
IPC: B01D61/02
Filed: 2009-09-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a composite polyamide reverse osmosis membrane and a method of producing the same.  <P>SOLUTION: The polyamide reverse osmosis membrane is made by coating a porous polysulfone support with an aqueous solution containing 2 wt.% m-phenylenediamine (MPD), and 0.1 wt.% di(ethylene glycol) hexyl methyl ether. Next, the excess solution is removed, and the coated support is dipped in 0.1 wt.% organic solvent solution of trimesoyl chloride (TMC) in a mixture of 8-12C alkanes. After draining surplus organic solvent solution off, the resulting composite membrane is air dried and then rinsed in a basic aqueous solution. The resultant membrane exhibits a permeate flow rate of 21.3 gfd and a salt rejection of 98.9% in the experiment comprising pressurized permeation at 225 psi using an inflow water containing 2,000 ppm of NaCl.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011088493-A (JP)
Title: Vehicle body structure of vehicle
Inventor: KODAIRA MASANORI
IPC: B62D25/04
Filed: 2009-10-20
Abstract: <P>PROBLEM TO BE SOLVED: To concurrently achieve assurance of vehicle body rigidity and its weight reduction without complicating its structure.  <P>SOLUTION: An upper vehicle body part more upward than the middle part of each pillar of the vehicle body is taken as an upper vehicle body part 101, while the lower part is taken as a lower vehicle body part 102. The upper vehicle body part 101 is integrally formed from a resin member, and the lower vehicle body part 102 is formed from a metallic member. Lower ends of respective pillar upper parts 5a-7a included in the upper vehicle body part 101 are fitted into upper end opening parts 35-37 of the respective pillar lower parts 5b-7b included in the lower vehicle body part 102 for bonding, thus connecting the upper vehicle body part 101 to the lower vehicle body part 102.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011093952-A (JP)
Title: Foamable polystyrene-based resin particle for manufacturing heat insulation material for hot water storage tank and manufacturing method therefor, pre-foamed particle for manufacturing heat insulation material for hot water storage tank, and heat insulation material for hot water storage tank
Inventor: TARUMOTO HIROYUKI
IPC: C08L25/04
Filed: 2009-10-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a heat insulation material for hot water storage tanks excellent in environmental compatibility and flame-retardancy, a foamable polystyrene-based resin particle for manufacturing the heat insulation material for hot water storage tanks used for the manufacturing, and a manufacturing method therefor.  <P>SOLUTION: The foamable polystyrene-based resin particles for manufacturing the heat insulation material for the hot water storage tank are obtained by a melt-extrusion method in which a flame-retardant having a bromine atom in the molecule and a bromine content of less than 70 mass% and having a benzene ring in the molecule and a 5 mass% decomposition temperature within a range of 200-300°C is used, the flame-retardant and the foaming agent are added and kneaded to the polystyrene-based resin in a resin feeding apparatus, the melted resin containing the flame-retardant and the foaming agent is directly extruded from a small hole of a die provided on a distal end of the resin feeding apparatus into a cooling liquid, the extruded article is cut simultaneously when it is extruded, and the extruded article is cooled/solidified by contact with the liquid to obtain the foamable polystyrene-based resin particles.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011096859-A (JP)
Title: Exposure apparatus and device manufacturing method
Inventor: TAKAGI ATSUSHI
IPC: H01L21/027
Filed: 2009-10-29
Abstract: <P>PROBLEM TO BE SOLVED: To provide an exposure apparatus that can reduce alignment errors or focus errors, thus achieving a pattern form and a line width as targets.  <P>SOLUTION: The exposure apparatus has a substrate stage, an atmosphere maintaining section for maintaining atmosphere in a space within the exposure house to be air atmosphere, and a gas supply section for supplying either of a mixed gas of air and inert gas and air in a local space between the final surface of the projection optical system and a substrate held by the substrate stage in the space, a first detector for detecting the position of an alignment mark and that of a reference mark formed in the substrate stage, and a controller. The controller does not supply the mixed gas when the position of the reference mark is detected by the first detector, but it detects the position of the alignment mark in the mixed gas atmosphere, and exposes a resist while driving the substrate stage based on the detected results of the reference mark position and alignment mark position.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011092493-A (JP)
Title: Rice cooking apparatus
Inventor: IMAIZUMI TADAHARU
IPC: A47J27/14
Filed: 2009-10-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a three-dimensional rice cooking apparatus 1 easy to convey a pot K in/out each heating room 2 in a plurality of tiers.  <P>SOLUTION: The three-dimensional rice cooking apparatus 1 includes a pot lifting up/down mechanism 7 for placing the pot K to be conveyed in/out the heating room 2 in the front of an opening 11 to lift it up/down. The mechanism 7 includes a pot support 18 able to place the pot K and a lifting drive part 19 for lifting the support 18 up/down from the proximity of the opening 11 of the room 2 in the uppermost tier to that of the opening 11 of the room 2 in the lowermost tier. The drive part 19 includes a lifting base 20 lifting up/down along the side wall face 10 of the apparatus 1 and a drive means 21 for lifting the base 20 up/down. The support 18 includes a pot rest 40 for approximately horizontally keeping and resting the pot K and support arms 41 each of which keeps one end fixed to the rest 40 and each of the other ends is connected with the base 20.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011093057-A (JP)
Title: Wafer edge polishing apparatus and edge polishing method used therein
Inventor: KISHISHITA SHINICHI
IPC: B24B9/00
Filed: 2009-10-30
Abstract: <P>PROBLEM TO BE SOLVED: To carry out a wafer edge polishing with a high precision by using a polishing tape.  <P>SOLUTION: A polishing head 52 is provided with a cylinder 77 which has a movable roller 78 protruding, a polishing tape 51 which is movably held by a guide roller 75 and a conveyer roller 72, and a guide roller 76 and a conveyer roller 73, inside a nearly square shape having four conveyer rollers 71, 72, 73, 74 as vertexes, toward an edge of a wafer 2 and bringing the polishing tape 51 into nearly point-like contact with the edge of the wafer 2 at the tip end thereof.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2010027626-A (JP)
Title: Seal member for spark plug, and spark plug
Inventor: FUKUZAWA REIMON
IPC: F02P13/00
Filed: 2009-11-02
Abstract: <P>PROBLEM TO BE SOLVED: To provide a seal member for a spark plug, and a spark plug, capable of obtaining enough axial tension even by a low clamping torque.  <P>SOLUTION: Of a cross section of a gasket 80 made of stainless steel of high rigidity to be mounted on the spark plug for M12 use, provided, the number of layers of plate materials at a site where the most layers of the plate materials overlap each other in an axis-line O direction is n, and a total of thicknesses of the layers at the most-overlapped site (a total thickness) is denoted by L, a thickness x of the gasket 80 as a whole satisfies: 1.1L≤x≤1.45L. Clamping torque increases as clamping of the spark plug progresses at its fitting, but, the gasket 80 first begins to generate elastic deformation, and, when it reaches the limit, generates plastic deformation. The above formula is satisfied at this point, so that, the plate materials themselves get adhered to each other during the elastic deformation, or soon after generation of the plastic deformation, which hardly gives rise to loss of the axial tension.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-2011103316-A (JP)
Title: Component mounting machine
Inventor: KOKETSU NAOHITO
IPC: H05K13/04
Filed: 2009-11-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide a component mounting machine in which a degradation in positioning accuracy of a mounting head is suppressed by preventing the occurrence of local thermal deformation of a base member of a head moving mechanism owing to heat generation of a coil provided in a mover of a linear motor.  <P>SOLUTION: The component mounting machine 1 includes the head moving mechanism 6 for moving the mounting head 7, the head moving mechanism 6 comprising: a Y-axis table 11 provided extending in an in-horizontal-plane direction; and an X-axis table 12 provided movably along the Y-axis table 11. The component mounting machine 1 is configured to move the X-axis table 12 on the Y-axis table 11 by the linear motor 14 comprising a stator 14a provided extending from one end side to the other end side of the Y-axis table 11 and the mover 14b provided in the X-axis table 12. The component mounting machine 1 further includes: an air path 16 provided extending from the one end side to the other end side of the Y-axis table 11; and a pair of fans (an air delivering fan 17a and an air sucking fan 17b) for circulating air in the air path 16.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011045355-A (JP)
Title: Raising seedling pot
Inventor: ANDO NAOZO
IPC: A01G9/02
Filed: 2009-11-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a raising seedling pot increasing a label retaining force after attaching while enabling easy performance of label attaching work.  <P>SOLUTION: This raising seedling pot 1 is formed in a bottomed cylindrical form with an opened upper end, integratedly having a bottom part 3 and a cylindrical part 2, and includes a label retaining part 7 seizing and retaining a thin plate-like label 10. The cylindrical part 2 is installed with at least one pair of recessed wall parts 6 depressed to an inner space side and extending in the vertical direction. The label retaining part 7 is made of first slits 7a and 7a each set on the top part 6a of the paired recessed wall parts 6 and 6, and second slits 7b and 7b each set in the opposed areas among the paired recessed wall parts 6 and 6, extending in the vertical direction, and connected to the first slit 7a on the upper end.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011105314-A (JP)
Title: Wrap round case
Inventor: NISHIKAWA YOICHI
IPC: B65D5/52
Filed: 2009-11-12
Abstract: <P>PROBLEM TO BE SOLVED: To enable to use a case upper part as an auxiliary stand for bottom raising by simply reinforcing the case upper part without reducing use efficiency of a corrugated board as a material.  <P>SOLUTION: In a wrap round case 1 in which a case lower part 13 and a case upper part 14 are separated, and a commodity (a) is exposed from the case lower part 13 being a tray condition, on an inner flap 6, a notch 10 which is cut from a side edge 6b opposing a top face plate 4 and is curved to the opposite side of a vertical face plate 3, is made, and a folding line 11 extending in parallel to an base end of the inner flap 6 from an inner end of the notch 10 is made to form a reinforcing plate 12 on a tip side from the folding line 11, and a detent piece 12a projecting from the base end of the reinforcing plate 12 by the notch 10 is formed. When displayed in a shop front, returning of folding of the reinforcing plate 12 is prevented by the detent piece 12a, and the case upper part 14 is placed below the case lower part 13 to use it as the auxiliary stand for the bottom raising, and the case lower part 13 is displayed at a high position.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011049516-A (JP)
Title: Light mixing type led package structure for increasing color rendering properties and brightness
Inventor: CHUNG CHIA-TIN
IPC: F21S2/00
Filed: 2009-11-12
Abstract: <P>PROBLEM TO BE SOLVED: To provide a light mixing type LED package structure for increasing color rendering properties and brightness.  <P>SOLUTION: The light mixing type LED package structure for increasing color rendering properties and brightness includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The light-emitting unit has a first light-emitting module for generating a first color temperature and a second light-emitting module for generating a second color temperature. The frame unit has two surrounding type frame colloids surroundingly formed on the top surface of the substrate unit by coating. The two surrounding type frame colloids respectively surround the first and second light-emitting modules in order to form two colloid position limiting spaces above the substrate unit. The package unit has a first transparent package colloid and a second transparent package colloid both molded on the top surface of the substrate unit and respectively covering the first light-emitting module and the second light-emitting module, and the first and second transparent package colloids are limited to within the two colloid position limiting spaces respectively.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011103938-A (JP)
Title: Game machine
Inventor: OGURA TOSHIO
IPC: A63F7/02
Filed: 2009-11-12
Abstract: <P>PROBLEM TO BE SOLVED: To increase excitement and enjoyment of a game by enhancing player's participation will to a presentation corresponding to a continuous operation.  <P>SOLUTION: Assignment of a decisive value to an operation system prediction type or a presentation pattern to decide a presentation motion of "continuous hits of pushbutton" at a higher rate compared with the presentation motion of "continuous hits of trigger button" drops performance frequency of the presentation motion requiring continuous hits to the trigger button of a stick controller difficult for continuous hits. Changing or not the content of the presentation and the content of the presentation after the change is decided at a different rate according to the progress condition of the content of the presentation. In addition, the decision rate to change or not the content of the presentation or the decision rate of the content of the presentation after the change differs according to the result of a special symbol display turning to a "jackpot" or not. A probability variation upgrade presentation pattern corresponding to the content of the presentation is decided at a different rate according to the performance period of a probability variation upgrade presentation.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011108754-A (JP)
Title: Method of manufacturing group iii nitride semiconductor light-emitting device, method of forming electrode for group iii nitride semiconductor device, and the group iii nitride semiconductor device
Inventor: ADACHI MASAHIRO
IPC: H01S5/343
Filed: 2009-11-13
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a group III nitride semiconductor light-emitting device for forming an exposure area of a group III nitride with excellent position controllability to an opening of an insulation film.  <P>SOLUTION: A group III nitride semiconductor region 29 including a contact layer 27 and a cladding layer 25 is etched by a mask 35a to form a group III nitride region 33c and an epitaxial region 29b. Then, an insulation film 39 is grown on the mask 35a, a pattern-formed group III nitride lift-off layer 31a, and a pattern-formed group III nitride semiconductor region 33c. The insulation film 39 includes: a first part 39a film-formed on the mask 35a; and a second part 39b film-formed on the pattern-formed group-III nitride semiconductor region 33c. Then, the pattern-formed group III nitride lift-off layer 31a is selectively removed by an etchant to the insulation film 39, and an insulation film 39b including an opening 39c is formed by a lift-off method.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011104033-A (JP)
Title: Transfer supporting device
Inventor: SHIBATA MASAYUKI
IPC: A61G7/10
Filed: 2009-11-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a transfer supporting device capable of avoiding interference with a care receiver by a completely new idea.  <P>SOLUTION: The transfer supporting device 100 includes: a trolley 1; an arm portion 2 that is pivotably attached to the trolley 1; a body holder 3 provided on the arm portion 2 to hold a care receiver M; a third motor 15 as a driving source that pivots the arm portion 2; and a driving force transmission mechanism D. The driving force transmission mechanism D transmits the driving force of the third motor 15 to the body holder 3 while the care receiver M is being transferred, and does not substantially transmit the driving force of the third motor 15 to the body holder 3 while the care receiver M is not being transferred.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-2011106967-A (JP)
Title: Apparatus and method for measuring size and weight
Inventor: ONISHI HIDEO
IPC: G01B11/04
Filed: 2009-11-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a size/weight measuring apparatus for measuring the size and weight of freight in conveyance with high accuracy.  <P>SOLUTION: The apparatus for measuring the size and weight of freight A moving on a conveyance route includes: an optical gate 50 including a plurality of light receiving sensors arranged in a direction orthogonal to a conveying direction to receive a parallel beam of light projected onto the freight A by the light receiving sensors, thereby detecting the position of a shaded photoreceptive sensor incapable of receiving light by being shaded from light by the freight A; a conveyance distance detection means 12 for detecting a conveyance distance of the freight A; a memory for therein storing the position of the shaded photoreceptive sensor of the optical gate 50 each time the conveyance distance increases by a prescribed amount while repeating this operation until the freight A passes through the optical gate 50; a size measuring means for calculating the size of the freight A based on data stored in the memory after the freight A passes through the optical gate 50; and a weight measuring means for measuring the weight of the freight moving on the conveyance route. The apparatus highly precisely measures the size and weight of the freight A without being affected by the conveying speed of the freight A.  <P>COPYRIGHT: (C)2011,JPO&INPIT