Patent DE-102008024443-A1 (DE)
Title: Semiconductor package for electronic system comprises electrode having first part extending through second surface of semiconductor substrate and second part extending from first part through compositional layer to contact conductive pad
Inventor: JANG HYUNG-SUN
IPC: H01L27/146
Filed: 2008-05-13
Abstract: A semiconductor integrated circuit (IC) package (100) comprises substrate (105) having first (1051) and second surface (1052); compositional layer (115); a conductive pad (120); electrode (155) having first part extending through substrate from second surface and second part extending from first part through compositional layer to electrically contact pad; and spacer insulation layer (145) separating first part of electrode from substrate. The package further has semiconductor device (110); passivation layer (127); and handling substrate (130) adhered to the layer with adhesive (125). A semiconductor integrated circuit (IC) package (100) comprises a substrate (105) having a first surface (1051) and a second surface (1052); a compositional layer (115) formed on the first surface; a conductive pad (120) formed on or formed at least partially in the compositional layer; an electrode (155) containing a first part extending through the substrate from the second surface, and a second part extending from the first part through the compositional layer to electrically contact the conductive pad; and a spacer insulation layer (145) separating the first part of the electrode from the substrate. When the electrode further comprises re-routing layer (156) formed on the second surface of the substrate, the package further comprises insulation layer disposed on the second surface of the substrate and covering re-routing layer; and a terminal (165) connected to the electrode through an opening in the insulation layer. The package further comprises semiconductor device (110) disposed on, or at least partially in the substrate; a passivation layer (127) formed on the composition layer and covering the semiconductor device, where an opening in the passivation layer exposes at least a portion of the conductive pad; and a handling substrate (130) adhered to at least a portion of the passivation layer with an adhesive (125). Independent claims are included for the following: (1) a semiconductor integrated circuit (IC) optical device module comprising: a substrate having opposing first and second surfaces; an active pixel sensor formed on the first surface; a compositional layer formed on the first surface and contacting at least a portion of the active pixel sensor; a conductive pad formed on, or formed at least partially in the compositional layer; an electrode containing a first part extending through the substrate from the second surface, and a second part extending from the first part through the compositional layer to reach the conductive pad; a spacer insulation layer disposed between the first part of the electrode and the substrate; and a transparent substrate disposed on the substrate over the active pixel sensor. The module further comprises lens arranged in relation to the sensor; infrared (IR) filter arranged in relation to sensor and associated with transparent substrate. The active pixel sensor is complementary metal oxide semiconductor (CMOS) sensor or charge-coupled device (CCD) sensor. The module further has insulation layer formed on second surface of substrate; terminal connected to the electrode through an opening in insulation layer; and barrier layer formed between the first part of electrode and the spacer insulation layer; and (2) an electronic system comprising a controller operatively connected to a semiconductor package via a bus; an input/output (IO) interface allowing data transfers between the semiconductor package and the controller via the bus, where the semiconductor package has substrate having opposing first and second surfaces; a semiconductor device disposed on the first surface of the substrate; a compositional layer formed on the first surface of the substrate and contacting at least a portion of the semiconductor device; a conductive pad formed on, or formed at least partially in the compositional layer; an electrode comprising a first part extending through the substrate from the second surface, and a second part extending from the first part through the compositional layer to reach the conductive pad; and a spacer insulation layer separating the first part of the electrode from the substrate.