baber/WOPTO huggingface dataset:
Patent JP-H05121120-A (JP)
Title: Office automation equipment
Inventor: KISHI KATSUMI
IPC: B41J29/00
Filed: 1991-10-30
Abstract: PURPOSE:To easily attach accessory equipment to an equipment main unit in a simple constitution and enhance safety. CONSTITUTION:A first connector 51 is disposed in an equipment main unit 2. A second connector 61 capable of locking an accessory equipment main unit 31 with the equipment main unit 2 in engagement with the first connector 51 is provided in the accessory equipment main unit 31. A wiring connecting portion 56 on a side of the main unit 2 is disposed in the first connector 51. A wiring connecting portion 66 connected to the wiring connecting portion 56 on the main unit 2 side by the use of relative movement when the connector 61 is engaged with the first connector 51 is provided in the second connector 61.
Patent JP-S62143278-A (JP)
Title: Information processor
Inventor: KAMOYA YOSHIYASU
IPC: G11B33/14
Filed: 1985-12-18
Abstract: PURPOSE:To facilitate the recording/detection of information and to save power by driving an air control means through the operation of a drive source and facing the nozzle linked thereto on the surface of the information recording medium thereby removing dusts on the information recording medium. CONSTITUTION:An information processing section 5 is moved to a desired position on an information disk 3 to detect or record the information. In this case, the air sucked from a suction hole 13 by a blade wheel 11 driven by the drive source 2 of the information disc 3 is jetted onto the information disc 3 from the nozzle 16 through an exhaust 14 and a tube 15 to blow out and clean the dusts on the information disk 3 detected or recorded by the information processing section 5.
Patent JP-2001111212-A (JP)
Title: Manufacturing method of wiring board
Inventor: HAYASHI MASAHIRO
IPC: H05K1/09
Filed: 1999-10-06
Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board, where the problem of the pin mark after the circuit inspection never arises, even if the finish plating film is small in thickness. SOLUTION: After forming a Cu plating pattern involving bonding pads by Cu plating, the circuit inspection is executed before applying the finish plating, and then the Ag plating is applied for finishing into nondefective pieces. Thus, the Ag plating layer is sufficiently formed even on the pin mark portions resulting from the circuit inspection and a wiring board in this state can be supplied for mounting. Hence, a wiring board displaying a satisfactory solderability in mounting is manufactured.
Patent JP-2001110884-A (JP)
Title: Electrostatic chuck device and its manufacturing method
Inventor: KAWAMINAMI SHUICHI
IPC: H01L21/68
Filed: 1999-10-06
Abstract: PROBLEM TO BE SOLVED: To provide an electrostatic chuck device and its manufacturing method, which is used even in an environment at high temperature, without deflection or peeling even under an environment with temperature change. SOLUTION: An electrostatic chuck of ceramics and a base stage of composite material of metal-ceramics for fixing the electrostatic chuck are provided. Here, the electrostatic chuck is jointed to the base stage with a solder consisting of aluminum alloy containing Mg. Related to a method for fixing the electrostatic chuck to the base stage, a solder consisting of aluminum alloy containing Mg is inserted between the electrostatic chuck and the base stage, which is thermally processed in nitrogen for jointing.
Patent JP-H01128489-A (JP)
Title: Printed circuit board pattern
Inventor: SATO MICHIO
IPC: H05K1/00
Filed: 1987-11-13
Abstract: PURPOSE:To reduce line burnout at side line part and to enable repairing by repairing welding to be made easily when a line burnout occurs by connecting a pad to a line using two side lines. CONSTITUTION:A pad 2 and a line 1 are connected by two side lines. In a circuit pattern on a printed-circuit board where two side lines 3 are provided, line burnout of the side line 3 at one side exists in configurations a-c of line burnout which occurs when forming a circuit pattern by etching and the remaining side line 3 allows electrical conduction to be achieved. In a configuration d of line burnout, repairing welding fitting can be made by a linear welding line material 4 as in normal line burnout. It allows line burnout generated on forming circuit pattern due to etching to be reduced and fitting by the repairing welding to be made easily, thus resulting in reduction of failure of circuit substrate due to line burnout.
Patent JP-H11121565-A (JP)
Title: Inspection method of semiconductor integrated circuit
Inventor: MIYAKE NAOKI
IPC: H01L27/04
Filed: 1997-10-17
Abstract: PROBLEM TO BE SOLVED: To stabilize a power-supply voltage without increasing a chip area by a method, wherein the electrical characteristics of elements are inspected by feeding a voltage to the elements on a semiconductor wafer by a voltage stabilizing means. SOLUTION: A plurality of semiconductor integrated circuit elements 21 are formed on the surface of a semiconductor wafer 12 in the form of matrix, and a power pad 23A and output pads 24 which are applied with a power-supply voltage, are provided on each of those elements 21. The pad 23A feeds the power-supply voltage Vdd to the element 21 through a power-supply voltage stabilizing circuit 25, which is provided on each scribed plane 25 and is used as a voltage stabilizing means, to contrive to inspect in one operation the electrical characteristics of each semiconductor integrated circuit element 21. Thereby, the elements 21 respectively can be actuated stably without increasing the area of each element 21.
Patent JP-H07116824-A (JP)
Title: Cooling treatment device for casting
Inventor: SHISHIDA TOSHIFUMI
IPC: B22D30/00
Filed: 1993-10-20
Abstract: PURPOSE:To discharge sand without hindrance even in the case of occurring of some trouble in a discharging pump at the time of discharging the sand separated from a casting, from the lower part of a cooling vessel by dipping the casting including the core sand into the cooling vessel and rapidly cooling. CONSTITUTION:In this cooling treatment device, the cooling vessel 1 for dipping the heated casting W into cooling liquid and rapidly cooling, a discharging course 8 for discharging the cooling liquid in the cooling vessel to the outer part and a circulating course 21 for circulating the cooling liquid, are provided. The discharging pump 10 in the discharging course and a circulating pump 22 in the circulating course are arranged. Further, a first connecting passage 24 for connecting mutually the upstream sides of the pumps in both course and a second connecting passage 25 for connecting mutually the downstream sides of the pumps in both courses are formed. At the time of occurring of the trouble of the discharging pump, the valves (a)-(d) are closed and valves (e), (f) are opened to constitute the course going around the discharging pump and the sand is discharged with a circulating pump 22.
Patent JP-H05125463-A (JP)
Title: Method for refining aluminum
Inventor: MAEDA HIDEO
IPC: C22B9/02
Filed: 1991-10-31
Abstract: PURPOSE:To uniformize concn. of impurities and to obtain a high purity aluminum by vertically moving a plate in the molten aluminum at the time of refining aluminum with fractional crystallization. CONSTITUTION:The raw material Al is charged to a graphite crucible 1 and melted in a furnace 10, and after the atmosphere in the furnace is held to the prescribed temp., the graphite-made plate 3 is dipped into the molten Al 2. The plate 3 is arranged on a lifter 4 fixed to a shaft 5 and vertically moved in the Al 2 at the desired interval. Further, the shaft 5 is fixed to the lifter 7 attached to a slide 6 and the plate 3 can be lifted to the desired position. The flow rate of cooling gas is adjusted with a controller 9 and the cooling gas is injected from an outlet 11 and the Al 2 is solidified from the bottom part, and at the time of starting the development of solidified layer, the lifting of the plate 3 is started. Then, the Al 2 is slowly solidified in parallel to the bottom from the bottom of the crucible 1 successively, and according to the growth of the solidified layer, the plate 3 is lifted and when the solidified quantity reaches about 60% of the molten Al, the plate 3 is pulled up and the molten Al in the crucible 1 is removed.
Patent JP-S63139296-A (JP)
Inventor: OKUYAMA GORO
IPC: G21F9/04
Filed: 1986-12-02
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S63140542-A (JP)
Title: Probe card
Inventor: HARAGUCHI AKIHISA
IPC: G01R1/073
Filed: 1986-12-02
Abstract: PURPOSE:To ensure that probe pins are not concentrated and are surely placed on the electrodes of a chip without interference, and that chips assembled in an unit by a conventional method are simultaneously measured without errors, by constituting a solid arrangement wherein each probe pin has a different height with reference to the wafer surface. CONSTITUTION:Electric characteristics are judged by applying a probe card 17, in the manner in which probe pins are simultaneously brought into contact with the electrodes of two chips 11a and 11b formed on a water 16. The card comprises the following; probe pins 13a and 13b which are brought into contact with each electrode of the chips 11a and 11b, a printed wiring 14 for testing electric characteristics of the chips 11a and 11b, and contacts 15 to obtain electrical connection between the wiring 14 and an external measuring equipment. The probe pins 13a contacting the electrodes 12a arranged along the neighbouring sides of the chips and the probe pins 13b contacting the electrode 12b arranged along the other sides of the chips have different heights which constitute a solid arrangement of pins. Thereby, concentration of the probe pins is avoided, the pins can be surely placed on the electrodes of the chips without interference, error judgements are reduced, and simultaneous measurement of chips are enabled.
Patent JP-H02130997-A (JP)
Title: Electronic component mounting on substrate
Inventor: YASHIRO MASAKAZU
IPC: H05K3/34
Filed: 1988-11-11
Abstract: PURPOSE:To perform a consistent automatic treatment by a method wherein a plurality of sheets of substrates are respectively placed on lower jigs and transfer, a printing of solder, placing of electronic component, placing of upper jig, an insertion of lead and a reflow treatment are performed en bloc from the first of an assembly line to the end of the line. CONSTITUTION:Reflow lower jigs 38, on which a plurality of sheets of substrates are respectively placed, are sucked one sheet by one sheet by a lower jig loader 31 and are fed to a positioning table part 40 of a solder printer 33 by s transferring machine 32. The jigs 38 are positioned by the table 40, sucked and fixed, are carried directly under a printing mask and are performed a printing of a cream solder. Then, the jigs 38 are transferred to component placing devices 9 and 10 by a belt conveyor 4 to place components, reflow upper jigs 29 are respectively superposed on the jigs 38 by an upper jig superposing machine 35, leads 3 are automatically inserted in lead holding grooves 29a of the jigs 29 by 8 lead inserting machine 36 and the points of the leads are abutted on the substrates. Then, the jigs 38 with the jigs 29 superposed on them are sent to a reflow furnace 12 by a conveyor 12a and both jigs 38 and 29 are soldered to each other. The jigs 29 are sucked using vacuum by vacuum suction holes 38c of placing recessed parts 38a of the substrates 1 of the jigs 38 and the external shape of the jigs 38 and the dimension and positions of suction holes (not shown in the diagram) of a receiving plate of the table 40 are standardized. By this constitution, the whole process can be automatized.
Patent JP-H08124755-A (JP)
Title: Suction/exhaust air duct of air blower and stationary induction apparatus
Inventor: HASEGAWA YOSHITSUGU
IPC: H01F27/08
Filed: 1994-10-25
Abstract: PURPOSE: To reduce the peripheral noise of a suction/exhaust air duct used for the cooling system, etc., of a stationary induction apparatus, etc. CONSTITUTION: A porous acoustic material 5b is positioned at a fixed distance from the internal surface of a suction/exhaust air duct 5 and an air layer 16g is formed between the internal surface of the air duct 5 and material 5b. In addition, a pass partition plate 5a which divides an air flow is provided on the air passage of the air duct 5. Since the air layer 16g is provided, noise can be absorbed by converting the noise into heat energy through the vibration of air. In addition, the air passage of the air duct 5 can be divided by the partition plate 5a by calculating the width of the duct 5 so that the sound reducing effect can become the optimum. Therefore, the structures and dimensions of the acoustic material 5b, partition wall 5a, etc., can be decided in accordance with the frequency of the noise to be reduced.
Patent JP-H06139112-A (JP)
Title: Method and device for preparing flag code
Inventor: OYA MASAYUKI
IPC: G06F11/34
Filed: 1992-10-23
Abstract: PURPOSE:To save parts to be substituted and to shorten the time required for repair by entering the name of a unit for generating a succeeding hardware fault in a flag code at the time of generating the succeeding hardware fault during the analysis of a preceding fault by a service processor (SVP). CONSTITUTION:When a hardware fault is generated in a unit (YY) such as an MCU during the analysis of a fault generated in a unit (XX) such as a CPU by the SVP, a region code 15 frozen, the SVP is requested for reading out error information and writing machine checking processing data in its logging file. The SVP reads out data as shown in step (2), a fault analyzing mechanism ASOA is operated to analyze respective data and enters the unit name YY of the unit successively generating a fault in an already prepared flag code. Then the SVP displays the entered contents or sends them to a remote maintenance center.
Patent JP-H04160728-A (JP)
Title: Manufacture of secondary-electron multiplier
Inventor: YAMAMOTO HIROSHI
IPC: H01J43/04
Filed: 1990-10-23
Abstract: PURPOSE:To improve saturation characteristic and linearity by burning a tube- shape semi-conductor ceramics material under the condition that an outlet of the semi-conductor ceramics material is sealed. CONSTITUTION:The semi-conductor ceramics material is molded into the twice- coiled shape, and a notch 37 is formed in the surface of the periphery of an outlet 36 of the molded material 30 to facilitate folding of a long part of the outlet 36 of the molded material 30 after burning. Furthermore, a small piece 40 made of the semi-conductor ceramics material as same as the molded material 30 is bonded to the outlet 36 to seal the outlet 36 of the molded material 30, and burning is performed. Atmosphere of the inside surface of the semi-conductor ceramics material is thereby evened at the time of burning, and the inside surface of a secondary-electron multiplier is formed even.
Patent JP-H02132182-A (JP)
Title: Fireproof joint filling material
Inventor: YASUDA TETSUO
IPC: C09K21/06
Filed: 1988-11-11
Abstract: PURPOSE:To obtain a fireproof joint filling material forming a fireproof layer (film) having excellent adhesively and ductility, containing a carbonizing inflating agent, dehydrating catalyst and specific emulsion type vehicle. CONSTITUTION:The aimed joint filling material containing (A) a carbonizing inflating agent comprising a polyhydric alcohol such as preferably (di- or tri-) pentaerythritol, (B) a dehydrating catalyst comprising ammonium polyphosphate having preferably <=5% water solubility at 20 deg.C and (C) an emulsion type vehicle containing preferably >=15wt.% emulsion of epoxy resin and/or emulsion of polybutene resin in liquid or semiliquid state at 25 deg.C.
Patent JP-H08148863-A (JP)
Title: Package structure of flexible printed board
Inventor: AIKAWA SATOSHI
IPC: H05K1/02
Filed: 1994-11-21
Abstract: PURPOSE: To mount only in one time step for avoiding the increase in the manufacturing cost without complicating an equipment structure by a method wherein a spring is inserted into a hole made by the lamination of the first and second trench holes of the first and second board to pull out the flexible boards. CONSTITUTION: The first trench hole 1a tilted at the first specific angle is made on a specific position of a flexible board 1 while the second trench hole 2a tilted at the second specific angle is made on the corresponding position to the trench hole 1a of the flexible board 2. Next, leaving the laminated state intact of the flexible boards 1, 2 a turn up part for sag correction is formed while engaging the pin 3a at one end of a spring 3 is relative slidably engaged with a square hole 4. On the other hand, the pin 3a is engaged with the corner of the square hole 4 so that the flexible boards 1, 2 may be pulled up in the arrow C direction thereby enabling the sag of both flexible boards to be simultaneously removed using only one spring 3.
Patent JP-2001109420-A (JP)
Title: Driving circuit for matrix type display panel and matrix type display device provided therewith
Inventor: ISHIDA KOZO
IPC: G09G3/296
Filed: 1999-10-07
Abstract: PROBLEM TO BE SOLVED: To realize power control and heat control not by conventional mechanical parts such as a heat sink but only by signal processing, in a data driver circuit of a capacitive load of a matrix display device. SOLUTION: Power consumption of a data driver is controlled only by signal processing by controlling signal processing of an image processing part so that the power is reduced, based on the detection result from a correlation detecting part for detecting a correlation with display data or from a count part for counting a discharge-nondischarge change-over frequency.
Patent JP-S62144108-A (JP)
Title: Production of low-loss plastic optical fiber
Inventor: MATSUMIYA NORIBUMI
IPC: G02B6/00
Filed: 1985-12-18
Abstract: PURPOSE:To obtain a plastic optical fiber having excellent mechanical characteristics and low transmission loss by spinning a core material consisting of a transparent plastic material and stretching the core under heating at the glass transition temp. of the plastic material or above then coating a cladding material thereon. CONSTITUTION:This plastic optical fiber is formed by spinning the core material consisting of the transparent plastic material and stretching the core under heating at the glass transition temp. of the plastic material or above then coating the cladding material thereto. The core material to be used is exemplified by a polymethyl methacrylate (PMMA) and the deuterides thereof, etc., the cladding material by a vinylidene fluoride/tetrafluorethylene copolymer, etc. The transmission loss value thereof is made approximate to the limiting loss value of the core material because the mis-matching between the core material and the cladding material by stretching is decreased.
Patent JP-2001106496-A (JP)
Title: Level difference remover
Inventor: SODA KIYOSHI
IPC: B66F7/02
Filed: 1999-10-07
Abstract: PROBLEM TO BE SOLVED: To provide a level difference remover to be favorably used in a house, for example of Japanese style, having many steps indoors and outdoors using frames to form a slope easily and an aux. footboard to rotate interlocking with a footboard furnished with handles to serve a person in particular the aged, being applicable also to objects instead of person and the level difference remover to serve for a person, in particular the aged who wants to get over a step on a floor, is structured to have grips on the footboard. SOLUTION: Frames 26 and 27 capable of inclining are installed on bases 21 and 22, and guide members 5 and 6 are installed on the frames 26 and 27, and slides 3 and 4 are threaded through the guide members 5 and 6 and make vertical motions. The frames 26 and 27 are arranged to incline easily and installed on the left and right, and the person gets on and off via the center between them. The aux. footboard 2 is fixed to the footboard 1 rotatably and makes vertical motions simultaneously with the 1. Movement of the bases 21 and 22 is made with wheels 35 and 36.
Patent JP-H02130193-A (JP)
Title: Transfer sheet and transferring using same
Inventor: NAKADE HIROYUKI
IPC: B41M5/40
Filed: 1988-11-11
Abstract: PURPOSE:To simplify a transferring step by forming a peeling layer on a base material made of a resinous film, and forming an adhesive film layer made of a picture pattern layer and thermosetting resin on the peeling layer. CONSTITUTION:A peeling layer 2 capable of peeling by heat is formed on a base material 1 made of resinous film, and a picture pattern layer 3 and an adhesive film layer 7 made of thermosetting resin are formed on the layer 2. In this case, a protective layer 4 may be formed between the layers 3 and 7. When a picture pattern is transferred with this transfer sheet, the layer 7 is brought into contact with an article of a matter to be printed, pressurized and heated from the material 1 side to peel the material 1, the layer 7 is temporarily softened by subsequent pressurizing and heating, then set and stabilized to be seized on the article, and the layer 3 is transferred. Here, if there is the layer 4, the picture pattern is protected, and neither peeled nor damaged.
Patent JP-H09101815-A (JP)
Title: Device and method for servo control and device and method using for robot control the device and the method
Inventor: ITOU IETOSHI
IPC: G05B19/416
Filed: 1995-10-06
Abstract: PROBLEM TO BE SOLVED: To prevent generated operation from being deviated from the limit performance of a controlled target by regulating an acceleration/deceleration pattern controlling outer frame having a reference function and its peak speed arrival, time. SOLUTION: A signal generated from a command means 2 is sent to an acceleration/deceleration pattern generating means 3 and a TP value determining means 4. The means 4 determines a peak speed arrival time TP value corresponding to a position command Δθ and sends the TP value to an α value determining means 5. The means 3 generates an acceleration/deceleration pattern based upon the command signal from the means 2 and a time base extending/ shortening parameter α value. Since the means 3 has a standardizing function corresponding to the limit performance of a controlled target, the means 3 can generate scaling available pattern by scaling operation, so that motion following up the pattern is not deviated from the limit performance of the controlled target. An output from the means 3 is sent to a servo system 7 through a low pass filter 6.
Patent JP-H04161540-A (JP)
Title: Repairing of sewer pipe
Inventor: UI MASAMITSU
IPC: E03F3/06
Filed: 1990-10-23
Abstract: PURPOSE:To greatly shorten the time of construction for repairing sewer pipe by a method in which a grout-injecting packer is inserted into a fitted tube and a two-component hardening type chemical grout is injected into the aperture between the existing tube and a new tube. CONSTITUTION:A new tube 5 is formed inside an existing sewer tube 1, and a fitting tube 15 is connected to the tube 1. An A-liquid supply hose 22 and a B-liquid supply hose 3 are connected from a supplyer 40 set near the ground's surface to a packer 20 through a three-way joint. The packer 20 is then extend to the periphery of the tube 1. A compressor is operated to expand a bag 25 to seal up the inside of the tube 15. Finally, chemical grout is injected from an injector 40 into the aperture between the tube 1 and the new tube 5 and hardened. The two-component quick-setting type grout can be injected by using the tube 15 and the construction time can be greatly shortened.