baber/WOPTO huggingface dataset:
Patent JP-2008166652-A (JP)
Title: Method for manufacturing semiconductor device
Inventor: NISHIMURA KAZUMI
IPC: H01L21/3205
Filed: 2007-01-05
Abstract: <P>PROBLEM TO BE SOLVED: To make it unnecessary to perform any operation to cut a semiconductor substrate by using a cutting device.  <P>SOLUTION: A semiconductor integrated circuit is manufactured on the surface of a semiconductor substrate 1, and an etching mask having a scribe line pattern 3 and a via-hole pattern 4 is formed on the surface of the semiconductor substrate 1, and a scribe line hole 5 and a via-hole hole 6 which do not reach the back face of the semiconductor substrate 1 are formed on the surface of the semiconductor substrate 1, and a conductor layer 9 configured of a plating film is formed on the inner face of the via-hole hole 6, and the semiconductor substrate 1 is cut along the scribe line hole 5 by grinding the back face of the semiconductor substrate 1 until the back face of the semiconductor substrate 1 reaches the back face of the scribe line hole 5 and the via-hole hole 6 so that the semiconductor substrate 1 can be divided into each semiconductor device 10 to form a through-via hole 11.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007258677-A (JP)
Title: Silver conductive film and method of manufacturing the same
Inventor: SATO KIMITAKA
IPC: H01L21/28
Filed: 2007-01-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a conductive thin film which can be largely formed in a non-vacuum atmosphere and at temperatures lower than 300°C, has a texture structure suitable as a reflective film on the side of a rear electrode of a thin-film solar cell, and has high adhesion with a substrate with a low resistance.  <P>SOLUTION: A silver conductive film is a silver thin film formed on a substrate, is made up of a layer including sintered silver particles having an average grain size D<SB>TEM</SB>of 100 nm or less, has a resistivity of 5 μΩ cm or less, includes not more than three holes/μm<SP>2</SP>in the sintered layer, and has a texture structure with a surface roughness Ra of 10 nm to 100 nm. The silver conductive film having such a texture structure can be manufactured by a manufacturing process including a step of applying a solution of dispersed silver particles to the substrate to form a film, and then sintering the film. The solution is obtained by dispersing silver particles having an average grain size D<SB>TEM</SB>of 100 nm or less in a liquid organic medium which is nonpolar or has low polarity and boils at 60 to 300°C.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008175425-A (JP)
Title: Condenser
Inventor: TAKASAKI HIROMI
IPC: F25B43/00
Filed: 2007-01-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a condenser capable of post-installation of a filter with a simple constitution, and exerting a filtering function for removing foreign matters included in a refrigerant while keeping a good filter replacement work efficiency.  <P>SOLUTION: In this condenser 2 comprising an inlet header tank 21 for distributing the refrigerant from a refrigerant inlet 25 into a plurality of refrigerant flow channels, and an outlet header tank 22 for guiding the refrigerant from the plurality of refrigerant flow channels to a refrigerant outlet 26, a joint 11 having a connecting port 10 capable of connecting a second pipe 7 is disposed on a position of the refrigerant outlet 26 of the outlet header tank 22, and a strainer 12 inserted to the inside of the outlet header tank 22 from the connecting port 10, is disposed on the joint 11.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008177309-A (JP)
Title: Molding die for resin sealing, semiconductor device using the same, and semiconductor device manufacturing method
Inventor: KANEMITSU YASUO
IPC: B29C45/27
Filed: 2007-01-18
Abstract: <P>PROBLEM TO BE SOLVED: To prevent the occurrence of a resin residue that causes deterioration in dimensional accuracy while preventing the occurrence of deformation during resin sealing even if a bonding wire is used.  <P>SOLUTION: A molding die for resin sealing is composed as follows. An upper die 5, having a recessed part 11 forming a cavity 6 in-between a lower die 4, has a gate 7 that is opened in the bottom face of the recessed part 11. The end part of the gate 7 part cylindrically protrudes to the lower die 4 side from the bottom face of the recessed part 11.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008182383-A (JP)
Title: Facsimile apparatus and paper feeding/discharging mechanism thereof
Inventor: UCHIDA TORU
IPC: H04N1/00
Filed: 2007-01-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a facsimile apparatus having improved visibility on a discharge paper stacker for reception and on a feed paper stacker for transmission and improved operability when setting an original for the transmission.  <P>SOLUTION: The discharge paper stacker 3 for the reception is provided on the rear part of the feed paper stacker 1 for the transmission so that recording paper 7 on the discharge paper stacker 3 for the reception is discharged above the original on the feed paper stacker 1 for the transmission and the recording paper 7 and the original are not piled up. Thus, the visibility of the recording paper 7 on the discharge paper stacker 1 for the reception and the original on the feed paper stacker 1 for the transmission is improved. Also, since a paper feed part 4 and an optical part 5 are integrated and configured so as to be projected obliquely upwards from a machine main body 6, the feed paper stacker 1 for the transmission and the discharge paper stacker 2 for the transmission are lifted obliquely upwards when they are projected obliquely upwards. Thus, a peripheral space is widened and thereby the operability when setting the original for the transmission is improved.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008183736-A (JP)
Title: Insert and molding
Inventor: SHINDOU NAOAKI
IPC: B29C45/14
Filed: 2007-01-26
Abstract: <P>PROBLEM TO BE SOLVED: To suppress the occurrence of whitening in an OVD layer included in an insert.  <P>SOLUTION: The insert 10 which is used in insert molding has a substrate 11, the OVD layer 12 overlying the substrate 11, and a heat-resistant resin layer 13 which faces the substrate 11 with the OVD layer 12 held between them and contacts the OVD layer 12. The surface of the heat-resistant resin layer 13 composes the outermost surface of the insert 10. Each layer included in the heat-resistant resin layer 13 is formed by a solution application method or a printing method.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008184052-A (JP)
Title: Operation result data analyzing system, program and recording medium
Inventor: TANI KINYA
IPC: G07C5/08
Filed: 2007-01-30
Abstract: <P>PROBLEM TO BE SOLVED: To quantitatively analyze and present operation result data on a vehicle such as a railroad vehicle in a short time.  <P>SOLUTION: A control part reads out the operation result data from an information storage part based on a calculation condition, and calculates operation state information indicating an operation state of a train in a predetermined travel section based on its read-out operation result data, and displays its evaluation result on a display part together with the operation state information by evaluating whether or not the operation state of the vehicle is proper in the predetermined travel section by referring to an evaluation reference stored in the information storage part. Thus, the operation result data on the vehicle such as the railroad vehicle can be quantitatively analyzed and presented in the short time. Objective evaluation can also be performed differently from subjective evaluation of a manager.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008187533-A (JP)
Title: Band control system, band control program, and band control method
Inventor: IWASAKI NAOYUKI
IPC: H04L47/22
Filed: 2007-01-30
Abstract: <P>PROBLEM TO BE SOLVED: To keep a fairness between users who are connected to different prestage packet multiplex apparatuses and to increase the user easily.  <P>SOLUTION: If a transmission indication of priority information is received from a poststage packet control apparatus 50, a prestage packet control apparatus 10 leads out the priority information 2 from a ratio of a band capable of using user apparatuses 1a1 to 1an to a minimum and from a storage situation in a buffer and transmits the priority information 2 to the poststage packet control apparatus 50. The post-packet control apparatus 50 selects one prestage packet control apparatus 10 to give a transmission permission of the packet actually based on each priority information received from a plurality of prestage packet control apparatuses 10 and transmits the indication related to the transmission permission of the packet to the selected prestage packet control apparatus 10. The prestage packet control apparatus 10 which has received the indication related to the transmission permission of the packet from the poststage packet control apparatus 50 transmits the packet 3 to the poststage packet control apparatus 50.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007204280-A (JP)
Title: Method for forming stacking body from printing paper longitudinally aligned in rising state and device for performing its method
Inventor: HALLER MIRKO
IPC: B65H31/26
Filed: 2007-02-02
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for forming a stacking body from printing paper longitudinally aligned in a rising state, and a device for performing its method, capable of largely reducing useless printing, and switchable to a product B from a product A substantially without switching time.  <P>SOLUTION: In this method, the printing paper 8 and 9 are supplied in a scale-like row flow S to a stacking machine 2 from a printer 3 by a carrying device 4, and is separated here into the stacking body 5 by a separator 15. A residual pamphlet (x1 or x6 and z) in one kind of products A and B is counted by a counter device 7. A reference stacking body 5' is formed of the whole residual pamphlets (x1 or x6 and z). The stacking body 5 to be further formed of the residual pamphlets (x1 or x6 and z) is formed in response to the residual pamphlet number at respective points so that the stacking body 5 composed of the specific residual pamphlet number and having the variable length is formed of the residual pamphlet.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2008193589-A (JP)
Title: Electronic device, and digital camera
Inventor: KOSUGI TATSUHIRO
IPC: H04N5/225
Filed: 2007-02-07
Abstract: <P>PROBLEM TO BE SOLVED: To cut off noise to a microphone with a simple configuration.  <P>SOLUTION: A sheet metal 48 is disposed between a projection 45 and a microphone 46, the projection 45 comprising a resin screw hole 44, for fixing a tripod, into which a metallic screw 43 for fixing the tripod. The sheet metal 48 is fastened by a third fitting screw 53 together with an electric circuit board 33 and a ground board 34 and grounded at a reference potential point due to the ground board 34. The sheet metal 48 is fastened together with a front case 30, a rear case 31 and a main body base part 32 by first and second fitting screws 36 and 40.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008193604-A (JP)
Title: Reproducing apparatus and method, and program
Inventor: TANAKA MITSUKANE
IPC: G10L19/00
Filed: 2007-02-07
Abstract: <P>PROBLEM TO BE SOLVED: To synthesize audio data as needed, and to prevent audio data from being deteriorated.  <P>SOLUTION: A controller 34 appropriately controls a switch 45 and analyzes an encoded audio stream of a reproduction object acquired by a reproduction data acquisition section 32 to strictly determine presence/absence of the effect of re-encoding and performs control so as to avoid re-encoded audio stream from being output to the outside, as much as possible. Namely, if there is the effect of re-encoding, with respect to a non-compressed audio signal after audio synthesis processing from a mixing processing section 97, a re-encoded audio stream obtained as a result of re-encoding by an audio encoder 41 is output to the outside. In other cases, the non-compressed audio signal after audio synthesis processing from the mixing processing section 97 or an original encoded audio stream from a switch 101 is output to the outside.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008199117-A (JP)
Title: Digital broadcast receiver
Inventor: ISHIHARA HITOSHI
IPC: H04N7/173
Filed: 2007-02-08
Abstract: <P>PROBLEM TO BE SOLVED: To provide a digital broadcast receiver capable of superimposing subtitle information for live broadcasting on video information at a time difference wherein unnaturalness is not felt.  <P>SOLUTION: Under the control of a CPU 7, a TUN 1 receives the digital broadcast of live broadcasting, a TSDMX 3 classifies received transport signals in each packet ID and separates video information, sound information and subtitle information from the transport signal of each packet ID, an STCCTL 11 delays decoding processing timing of the video information and the sound information, and then a mixer 10 makes the superimposed display timing of the subtitle information be coincident with that of the video information.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008066693-A (JP)
Title: Semiconductor integrated circuit
Inventor: YONEZU TOSHIAKI
IPC: H01L21/3205
Filed: 2007-02-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit capable of achieving highly reliable repair using an electrical fuse.  <P>SOLUTION: The present invention includes fuse wiring 1, a first electrode pad 2, a second electrode pad 3, an anti-pollution layer 11, first via wiring 12, and second via wiring 13. Then, the fuse wiring 1 is blown by an excessive current flow. The first electrode pad 2 is connected to one side of the fuse wiring 1 and the second electrode pad 3 is connected to the other side of the fuse wiring 1. The anti-pollution layer 11 is formed above and below the fuse wiring 1 with insulating layers interposed therebetween. A pair of the first via wirings 12 are formed on side surfaces of the fuse wiring 1 with insulating layers interposed therebetween and are connected with the anti-pollution layer 11 to surround the fuse wiring 1. A pair of the second via wirings 13 are formed outside the first via wiring 12 with respect to the fuse wiring 1 so that they surround the first via wiring 12.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2007226222-A (JP)
Title: Gel material for sticking polarizing plate together, polarizing plate stuck by the gel material and fabrication method thereof
Inventor: TSAI CHENG HSIN
IPC: G02F1/13363
Filed: 2007-02-15
Abstract: <P>PROBLEM TO BE SOLVED: To provide a gel material which can be simply prepared, is excellent in water resistance, has a long retention period and is hard to gel in order to fabricate a polarizing plate with high water resistance.  <P>SOLUTION: The gel material utilized in a polarizing plate sticking process includes a polyvinyl alcohol solution and a dicarboxylic acid dissolved into the polyvinyl alcohol solution. By using the gel material, triacetyl cellulose protection layers 32,34 are stuck onto a polyvinyl alcohol polarizer layer 30. Diester structure 46,48 is formed by adipic acid 38 which is a dicarboxylic acid contained in the gel material.  <P>COPYRIGHT: (C)2007,JPO&INPIT
Patent JP-2008203529-A (JP)
Title: Process cartridge and electrophotographic device
Inventor: MIYAGAWA NOBORU
IPC: G03G5/14
Filed: 2007-02-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a process cartridge having a long life in a high-speed and high-quality electrophotographic device.  <P>SOLUTION: The process cartridge comprises: an electrophotographic photoreceptor made by disposing a conductive layer, an intermediate layer and a photoreceptor layer in the order on a substrate, wherein the conductive layer contains a binder resin and conductive particles, the conductive particles are titanium oxide covered with oxygen-deficient tin oxide and have an average particle size more than 0.2 μm and less than 0.6 μm; and a charging member made by disposing a conductive elastic layer and a surface layer in the order on a conductive support, wherein the surface layer contains at least a binder resin, conductive particles, organic polymer particles and inorganic particles, and surface roughness Rz of the charging member is more than 4.0 μm and less than 30.0 μm.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008206307-A (JP)
Title: Integrated circuit device and electronic apparatus
Inventor: ONISHI KOTA
IPC: H01L21/822
Filed: 2007-02-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide an integrated circuit device or the like capable of stably efficiently driving an external device.  <P>SOLUTION: The integrated circuit device includes a pre-driver PR1 for driving an N-type power MOS transistor of an external driver configured of an N-type power MOS transistor and a P-type power MOS transistor; a pre-driver PR2 for driving the P-type power MOS transistor; a low-potential side power supply pad PVSS1; output pads PDN1, PDP1; and a high-potential side power supply pad PVDD1. The power supply pad PVSS1, and the output pads PDN1, PDP1 are disposed in a D1 direction. The pre-driver PR1 is disposed in a D2 direction of the power supply pad PVSS1 and the output pad PDN1, and the pre-driver PR2 is disposed in a D2 direction of the output pad PDP1 and the power supply pad PVDD1.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008205216-A (JP)
Title: Laminated coil unit and electronic apparatus having the same, and charger
Inventor: HASEGAWA MINORU
IPC: H01F38/14
Filed: 2007-02-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a laminated coil unit capable of increasing a coil Q value by increasing inductance L that is a coil characteristic and decreasing resistance R, to provide an electronic apparatus using the laminated coil unit, and to provide a charger.  <P>SOLUTION: The laminated coil unit is used for at least one of primary- and secondary-side coils for contactless power transmission. The unit has N (N is an even number of not less than 4) plane air cores 40A-40D, and each of N plane air cores is composed of a spiral conductive pattern formed on an insulating board and is laminated in the thickness direction of the insulating board. N/2 sets of coil connection units 80, 82, where respective two plane air cores 40A, 40B and 40C, 40D in the N air cores are connected in a first connection form (for example, parallel) that is either parallel or series, are connected in a second connection form (for example, series) that is the other of parallel and series.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008204272-A (JP)
Title: Object recognition system
Inventor: OKUGAWA YUICHIRO
IPC: G06K17/00
Filed: 2007-02-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide an object recognition system that can further reduce the complexities at use and attain higher convenience.  <P>SOLUTION: This object recognition system 1 for recognizing an object includes a wireless tag 101 attached to an object to write information; a reader/writer 102 for reading the information written to the wireless tag 101 and writing information to the wireless tag; and a voice output device 103 for outputting the information read by the reader/writer 102 by voice, wherein the reader/writer 102 is shaped to be mountable on the fingers or arm.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008210005-A (JP)
Title: Road-vehicle communication system, vehicle system and road system
Inventor: KIMURA TATSU
IPC: G08G1/09
Filed: 2007-02-23
Abstract: <P>PROBLEM TO BE SOLVED: To properly prevent a traffic accident beforehand.  <P>SOLUTION: By using an electronic number plate 4 and an onboard DSRC unit 5, of which future wide use is expected, a road system 2 predicts whether or not the possibility of the occurrence of traffic accident is high, based on a communication state between an electronic number plate reader unit 8 and the electronic number plate 4. When high possibility of the occurrence of traffic accident is predicted, the DSRC road unit 9 and the onboard DSRC unit 5 perform narrowband radio communication, so as to transmit warning information from the road system 2 to the vehicle system 3. The vehicle system 3 then issues warning information.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008208168-A (JP)
Title: Polyamide resin composition and resin molded product composed of the same
Inventor: FUJII SHIGETA
IPC: B63B5/24
Filed: 2007-02-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a resin composition consisting essentially of a polyamide and a polyphenylene ether having low water absorption, excellent dimensional stability, mechanical properties during water absorption, heat and chemical resistances and moldability and a low specific gravity.  <P>SOLUTION: The polyamide resin composition is obtained as follows: melt kneading of 100 pts.mass of a polyamide/polyphenylene ether resin composition composed of 20-80 mass% of a polyamide containing 0.01-20 mass% of a swelling fluorine mica-based mineral and obtained by polymerizing a monomer in the coexistence of the swelling fluorine mica-based mineral and 80-20 mass% of a polyphenylene ether with 1-20 pts.mass of a styrenic elastomer having 35-60 mass% styrene content, 0.05-5 pts.mass of an unsaturated carboxylic acid, an unsaturated dicarboxylic acid or an acid anhydride thereof and 0.01-3 pts.mass of a radical generator.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008210952-A (JP)
Title: Manufacturing method of semiconductor device, manufacturing method of silicone interposer and manufacturing method of semiconductor module
Inventor: OIKAWA TAKAHIRO
IPC: H01L21/3065
Filed: 2007-02-26
Abstract: <P>PROBLEM TO BE SOLVED: To form a through hole from the rear face toward the surface of a semiconductor substrate to be straight, and to improve a coating property of a conductive material arranged on the side wall of the hole.  <P>SOLUTION: An insulating layer 15 is disposed in the semiconductor substrate 10. A connection electrode 18 formed on an upper layer is electrically connected to the semiconductor substrate 10 through an opening. In this state, when the through hole 30 is formed toward a part of the connection electrode 18 which is brought into contact with the semiconductor substrate 10, a charge accumulated in the insulating layer can be discharged through the connection electrode 18 and the straight through hole can be formed.  <P>COPYRIGHT: (C)2008,JPO&INPIT
Patent JP-2008206768-A (JP)
Title: Energizing device of rotary member for chair
Inventor: MASUNAGA HIROSHI
IPC: A47C1/02
Filed: 2007-02-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide an energizing device of a rotary member for chairs which enables the stable supporting of a twist coiled spring for gaining reaction forces as set without generating vertical twisting forces nor causing it to play even when a pair of arms in it is extended in the same direction.  <P>SOLUTION: A pair of twist coiled springs 19 and 19 horizontally symmetrical to each other is externally fitted onto a guide cylinder 28 externally fitted onto a pivot 5 and the first and second arms 19b and 19c in the respective twist coiled springs 19 are both extended in the same direction from a coiled part 19a while a portion biased outward of a lower half of the guide cylinder 28, which the first arm 19b contacts and a portion biased inward of its upper half, which the second arm 19c contacts are made as the largest diameter parts larger than other parts.  <P>COPYRIGHT: (C)2008,JPO&INPIT