baber/WOPTO huggingface dataset:
Patent JP-H03126099-A (JP)
Title: Musical tone signal generator
Inventor: TODA HIROYUKI
IPC: G10H7/08
Filed: 1989-10-11
Abstract: PURPOSE:To improve the degree of freedom in sound creation by connecting plural sets of 1st register groups, adder means, 2nd register groups and selecting means between the outputs and inputs forming the feedback paths of modulation computing units. CONSTITUTION:The modulation computing units 200, 203 to 206 make modulation computation based on input information and the 1st register groups 207a to 207c take in and store the waveform data computed by the modulation computing units 200, 203 to 206. The adder means 208 adds the computation waveform data computed by the modulation computing units 200, 203 to 206 and respective pieces of the waveform data stored in the 1st register groups 207a to 207c. The 2nd register groups 209a to 209c take in and store respective pieces of the waveform data added by the adder means 208. The selecting means 201a, 201b output respective pieces of the waveform data stored in the 2nd register groups 209a, 209b selectively to the modulation computing units 200, 203 to 206. The degree of freedom in sound creation is improved in this way.
Patent JP-S63119247-A (JP)
Title: Lead frame for electronic component
Inventor: NAKAMURA KAZUNOBU
IPC: H01L23/50
Filed: 1986-11-06
Abstract: PURPOSE:To eliminate production of solder refuse and avoid obstruction against a press work by a method wherein solder plating is applied to the die-bonding part of a lead frame beforehand and, further, silver plating with a specific thickness is applied to the solder plating. CONSTITUTION:In a lead frame for electronic components, the thickness of silver plating on solder plating is selected to be 0.1-0.5 mum. The thickness of the silver plating applied to the solder plating is related to the production of solder refuse. Moreover, the fact that the silver on the solder is diffused into the solder at the temperature for bonding silicon pellets is also related to the possibility of bonding the pellets without influence of the silver. The die-bonding part of a T0220 frame for transistors is coated with the solder plating 1 and the silver plating 2 of the present invention.
Patent JP-H08125948-A (JP)
Title: Suction mounting type head mounted display
Inventor: HIRAIWA AKIRA
IPC: G02B27/02
Filed: 1994-10-28
Abstract: PURPOSE: To provide a head mounted display without the handling time of mounting and dismounting without letting a user feel an unpleasant feeling by tightening a head part by tightening a buckle or putting on a tight helmet for bringing the head mount display into close contact with a face. CONSTITUTION: The air of a clearance between the face and an HMD (head mounted display) part which is turned to an airtight structure by a face contact pad 19 is sucked by a sucking pump 21 and an air pressure inside the clearance is lowered. By utilizing a difference between the air pressure inside the clearance and an atmospheric pressure, the HMD part is brought into close contact with the face of the user and the weight of the HMD part is supported. Thus, the need of the tightening of the head part by the buckle and the unpleasant helmet is eliminated and the mounting and the dismounting are simplified.
Patent JP-H10214850-A (JP)
Title: Electronic part-mounting substrate, electronic part device and manufacture those
Inventor: TAKEDA SHINJI
IPC: C09J163/00
Filed: 1997-09-30
Abstract: PROBLEM TO BE SOLVED: To provide an electronic part mounting substrate and electronic part device which enables manufacture of such an electronic part device as semiconductor package causing no package cracking or having an good reliability. SOLUTION: A film-like organic die bonding material 3 is placed on a perforated support substrate 1. In this case, the film is bonded onto the substrate at temperature, pressure and in time which satisfy the condition to prevent the film from sagging from the perforations. Next a semiconductor chip 4 is placed and bonded onto the film. Even in this case, the semiconductor chip is bonded to manufacture a semiconductor device at temperature pressure and in time which satisfy the condition to prevent the film from extruding and dropping from the perforations, or the extruded sagged film from coming into contact with the a carrier base on which the support substrate is laced, as above.
Patent JP-H03127134-A (JP)
Title: Computer simulation method
Inventor: KOIKE SATOKO
IPC: G06F11/26
Filed: 1989-10-13
Abstract: PURPOSE:To efficiently execute the simulation by converting an operation description to a description for executing the simulation and predicting the sum total of the processing time required for a series of processings for executing the simulation, and selecting a method of conversion for minimizing its sum total. CONSTITUTION:In a computer model operation description converting program 105, a conversion mode determining part 106 for determining a form after the conversion processing is provided. When a conversion mode designation 103 is executed by a user, the conversion mode determining part determines a conversion mode in accordance with its designation. Unless the conversion mode is designated, from the description quantity of an inputted computer model operation description group 101, and the number of simulation cycles designated in a simulation execution environment designation 102, the sum total of the processing time of the conversion processing of an operation description group and the simulation execution is predicted, and such a converting method as its sum total becomes minimum is selected and determined. In such a way, the simulation can be executed efficiently.
Patent JP-H04142888-A (JP)
Title: Solid-state image pickup device
Inventor: OHASHI KAZUHITO
IPC: H04N5/3725
Filed: 1990-10-04
Abstract: PURPOSE:To obtain a video signal of a sufficient band by outputting simultaneously signals of plural lines, storing the signals tentatively and reading signals of each line serially timewise. CONSTITUTION:The system is provided with a solid-state image pickup element 101 able to read a line signal of an optional line address simultaneously and read signals, e.g. signals of two lines are converted into digital signals respectively by A/D converters 102,103. Line memories 104-107 store the line signals tentatively and read the signals at a speed twice that at storage and rearrange them serially timewise. Thus, a High definition signal output with a sufficient band is obtained without deteriorating the transfer efficiency.
Patent JP-H03144174-A (JP)
Title: Manufacture of ball for ball valve
Inventor: KANAMARU TONAHARU
IPC: F16K5/06
Filed: 1990-10-04
Abstract: PURPOSE:To prevent the formation of the casting defect in a connection part and prevent the stay of flowing foreign materials by setting an inclination angle in 30 deg. or less on the connection surface between both edge inner peripheral part and a central inner peripheral part which form the flow passage of a ball body. CONSTITUTION:As for a ball body 1 which is installed in rotatable manner in a ball valve, both edge inner peripheral parts 3 and a central inner peripheral part 4 are formed in a flow passage 2 penetrating in the lateral direction through the ball body 1, and the central inner peripheral part 4 is formed to the larger diameter than that of both edge inner peripheral parts 3. Further, the connection part between both edge inner peripheral parts 3 and the central inner peripheral part 4 is casted to form a conical surface 5 having an inclination angle of 30 deg. or less, and the formation of the casting defect is prevented, and the stay of flowing foreign articles in the flow passage 2 is prevented. Then, both edge inner peripheral parts 3 and the outer peripheral surface 6 of the ball body 1 as the casting material are cut, and the outer peripheral surface 6 is ground, and the sealing performance and driving performance of the ball are improved, and the concentricity of the flow passage 2 is improved.
Patent JP-H1088036-A (JP)
Title: Aqueous composition for surface treatment of metallic material
Inventor: KOMIYAMA SHINOBU
IPC: C09D5/24
Filed: 1996-09-13
Abstract: PROBLEM TO BE SOLVED: To provide an aq. compsn. for surface treatment of a metallic material which can impart further improved corrosion resistance in worked area, corrosion resistance in end face, electroconductivity, coatability and other properties while maintaining various properties of the conventional resin-contg. chromate treatment. SOLUTION: This aq. compsn. for surface treatment of a metallic material comprises a water-soluble synthetic resin; a hexavalent chromium ion, a smectite clay mineral [Si8 (Mga Lib )O20 (OH)c F4-c ]<-x> Me<+x> (wherein 0<a<=6, 0<b<=6, 4 <a+b<8, O<=c<=4, x=12-2a-b, and Me: at least one member selected from among Na, K, Li and NH4 ), and water, or alternatively may comprise a synthetic resin, a hexavalent chromium ion, the smectite clay mineral, a surfactant, and water. In this case, the synthetic resin includes a water-soluble synthetic resin, and the wt. ratio of the synthetic resin to the hexavalent chromium ion to the smectite clay mineral is (25 to 1000):5:(0.1 to 300).
Patent JP-H04141778-A (JP)
Title: Hierarchical arrangement processing system
Inventor: ISHIMORI AKIO
IPC: H01L21/82
Filed: 1990-10-03
Abstract: PURPOSE:To average interblock distance and to simplify wiring paths by arranging a block connected to the long distance net among group external terminals to be nearer to the external terminal position of the group at the time of arrangement processing in the group. CONSTITUTION:When blocks 35 to 38 to be arranged in groups 21 and 22 are not connected to the external terminals 28 to 31 of the groups 21 and 22, the blocks are arranged based on the weight of the net being the intensity of the connection relation against the arranged block in the group and their arrangement position. When connected to the external terminals 28 to 31 of the groups 21 and 22, the blocks are arranged based on the arranged block in the block, the weight of the net being the intensity of the connection relation against the external terminal of the group, and their arrangement positions. Thus, the block distances are averaged, and the wiring path is simplified.
Patent JP-S63120348-A (JP)
Title: One-chip processor
Inventor: SATO TADASHI
IPC: G06F12/06
Filed: 1986-11-10
Abstract: PURPOSE:To decrease the noises produced when an access is given to a memory by having a slight difference between the rise and fall times of an access valid signal applied to each memory module when accesses are simultaneously given to plural memory modules. CONSTITUTION:The instructions stored in a CS 2-1 consisting of plural RAM modules 2 are read out by the addresses stored in an address register 3-1 and set to a register CSDR 3-3. The contents of the CSDR 3-3 are decoded by an instruction decoder 3-4 for control of the inside of a 1-chip processor 1. Then a module address comparator 3-31 compares the module addresses of the register 3-1 and an address +1 circuit 3-30 with each other. When the next access is given to the CS 2-1 with different RAM modules, a dummy FF 3-32 is set. Then the control is carried out so as to cause a slight difference between the rise and fall times of an access valid signal applied to each memory module.
Patent JP-H05202194-A (JP)
Title: Production of graft polymer
Inventor: ASANUMA TADASHI
IPC: C08G81/02
Filed: 1992-10-05
Abstract: PURPOSE:To simply obtain a graft polymer free from cross-linking by heating and melting a copolymer of an alkenylsilane and an olefin, an OH group- containing compound and a copolymer of styrene, an alkenylnitrile and an alkadiene in the presence of an amine. CONSTITUTION:(A) (i) A copolymer of an alkenylsilane and an olefin and (ii) an OH group-containing compound and (B) (iii) an unsaturated bond-containing compound, a copolymer of styrene and/or an alkenylnitrile and an alkadiene or (iv) a copolymer of ethylene, propylene and an alkadiene are heated and melted in the presence of (C) an amine to give a graft polymer.
Patent JP-H0798566-A (JP)
Title: Method for decorating three-dimensional body and shrinkable transfer material
Inventor: KONDO HIROKO
IPC: G09F3/04
Filed: 1993-09-28
Abstract: PURPOSE:To provide a method for decorating a three-dimensional body by which transfer to the surface of an arbitrary three-dimensional body can easily be carried out and to obtain a shrinkable transfer material. CONSTITUTION:A transfer layer including a peeling layer, a patterned layer and an adhesive layer is formed on a shrinkable substrate to obtain the objective shrinkable transfer material. A three-dimensional body 6 is wrapped with the transfer material so that the adhesive layer is brought into contact, with the body 6 and the transfer material 1 is shrunk by heating and allowed to adhere to the surface of the body 6 to be decorated. Rubber 9 of a shape capable of adhesion to the surface of the body 6 to be decorated is then pressed against the body 6 wrapped with the transfer material 1 and the substrate of the transfer material 1 is peeled off after heating. The transfer layer of the transfer material 1 is transferred to the surface of the body 6 to be decorated.
Patent JP-H01107999-A (JP)
Title: Powder molding machine
Inventor: KATAGIRI NOBUYUKI
IPC: B30B11/00
Filed: 1987-10-21
Abstract: PURPOSE:To correspond to disturbance such as difference and variation in powder quality, etc., and to obtain sufficient strength by directly detecting the molding pressure of rolls and adjusting only the supply amount of powder. CONSTITUTION:The molding pressure corresponding to a strength requirement of a molding object is considered as a measured value of pressure 36. Regarding the control deviation to an input signal 38, the number of revolutions of a supply means of powder 30 is operated by the control performance of a controller 34 to control the supply amount of powder and working force is generated by the compression corresponding to the powder characteristic in compression molding to make it possible to obtain a molded object having a desired strength.
Patent JP-H10108847-A (JP)
Title: Gradient coil and manufacture thereof
Inventor: SATO KAZUHIKO
IPC: A61B5/055
Filed: 1996-10-07
Abstract: PROBLEM TO BE SOLVED: To realize a gradient coil generating no troubles caused by the thermal expansion of the heated coil. SOLUTION: An inner layer 1 of a bobbin is formed inside a gradient coil and first intermediate layers 41, 42 of a member having the coefficient of thermal expansion of value intermediate the coefficients of thermal expansion of the coil and the inner surface of the bobbin are formed on the inner surface layer 10 of the bobbin. Further, the first intermediate layers 41, 42 are formed with coils 21, 22 and second intermediate layers 51, 52 of a member having the coefficient of thermal expansion of a value intermediate the coefficients of thermal expansion of the coil and the outer surface layer of the bobbin are formed on the coil and the outer surface layer 30 of the bobbin is formed on the second intermediate layers.
Patent JP-S63121156-A (JP)
Title: Tape recorder
Inventor: KOGA NOBUYUKI
IPC: G11B15/44
Filed: 1986-11-08
Abstract: PURPOSE:To house and arrange a gear system in a small space, by arranging a driving gear, a first notch gear, and a second notch gear respectively so as to enclose the periphery of an intermediate gear. CONSTITUTION:Since the driving gear 46, the first notch gear 38, and the second notch gear 39 are arranged so as to enclose the periphery of the intermediate gear 45, both notch gears 38 and 39 with different function are driven rotatably respectively by one intermediate gear 45 being always driven rotatably by the driving gear 46. And the driving gear 46 is also the gear to transfer a driving force to a pair of reel bases. In such way, it is possible to house and arrange the driving gear for driving the reel base required for a tape recorder, the first notch gear 38 for switching the reproducing (recording) mode, and the second notch gear 39 for switching a tape feeding direction, in the small space centering the intermediate gear 45.
Patent JP-H10158985-A (JP)
Title: Deinking
Inventor: IRINATSU YUUICHI
IPC: C11D1/94
Filed: 1997-09-30
Abstract: PROBLEM TO BE SOLVED: To obtain deinked pulp with reduced area percentage of residual ink without deterioration of whiteness, as suitable yield is maintained, by carryign out at least a part of floatation process using a treatment water containing rice-rinsed water in the presence of a specific compound. SOLUTION: At least a part of the floatation process using the treatment water containing rice-rinsed water is carried out in the presence of at least one selected from the group consisting of cationic compounds of formula I (R1 and R2 are independently a 10-24C alkyl, alkenyl; R3 and R4 are independently a 1-8C alkyl, hydroxyalkyl; X<-> is a gegen ion), amines of formula II (W1 -W4 are independently H, a 1-24C alkyl) or its acid salts, and amphoteric compounds of formula III (Y1 is R5 NHCH2 CH2 ; R5 is a 1-36C alkyl; Y2 is H, R5 NHCH2 CH2 ).
Patent JP-H10110528-A (JP)
Title: Sleeve for slab and sleeve with base
Inventor: WATANABE YOSHIHISA
IPC: E04G15/06
Filed: 1996-10-07
Abstract: PROBLEM TO BE SOLVED: To reduce the number of part items while easily specifying a place of a sleeve embedded in a slab and adjusting the height of the sleeve so as to facilitate manufacture, storage, conveyance and fitting at a construction site. SOLUTION: A marker member 4 of such height as to be protruded from the upper face of a slab when the slab is placed with a sleeve 1 embedded therein is provided at the upper face of a cover part 3 formed integrally with a body 2 of the sleeve 1. The inside of a lower end opening part 6 of the sleeve 1 is so formed as to be insert-connectable to the cover part 3 side of another sleeve of the same shape. In addition, the sleeve 1 is so erected as to be adjustable in height and to be detachable from a base 10 fitted to a slab structural angle.
Patent JP-H0989623-A (JP)
Title: Gas meter
Inventor: FUJISAWA KAZUYA
IPC: G01F1/00
Filed: 1995-09-20
Abstract: PROBLEM TO BE SOLVED: To more accurately judge the abnormal state of a gas supply pressure without greatly increasing power consumption. SOLUTION: A safety function part 23 drive a pressure sensor 15 intermittently at every 10 seconds when the gas supply pressure which is measured by the pressure sensor 15 is within a normal supply pressure range and drives the pressure sensor 15 intermittently at every one second when it is not within a normal supply pressure range. The safety function part 23 judges whether the state is normal or not based on the gas supply pressure which is measured by the pressure sensor 15 and closes a gas channel by driving a shut-off valve 13 when it judges that the state is abnormal.
Patent JP-H04144034-A (JP)
Title: Frame structure
Inventor: OOTANI GENTAROU
IPC: H01J9/227
Filed: 1990-10-05
Abstract: PURPOSE:To ease disassembly and assembly and improve dimensional accuracy and torsional rigidity etc., by composing a frame structure with upper, lower, side, and partition frames, and assembling these frames with bolt joining. CONSTITUTION:A frame structure is composed of an upper frame 1, a lower frame 2, two side frames 3, and partition frames 4 joining these frames 1-3. The frames 1-3 are composed of flat plates respectively, and bolt inserting holes are drilled on right and left end parts. A frame 4 is formed in a framework state with a bottom plate 4a, two struts 4b, and a top plate 4c. Backplates 5, 6, and 7 for the upper, lower, and side frames are weldedly fixed to the top and bottom plates 4c and 4a and the strut 4b respectively, and bolt inserting holes are drilled on the right and left end parts of each backplates 5-7. This permits the easy and firm assembly of the frame structure by joining it with many bolts 11. The bolts 11 can be removed and the frame structure can be disassembled to be carried at the time of transport.
Patent JP-H04143315-A (JP)
Title: Method for separately removing temporary iron pole foundation
Inventor: MACHIDA TOKUJI
IPC: E02D9/02
Filed: 1990-10-05
Abstract: PURPOSE:To save the time for digging up the earth and sand around an iron pole foundation by releasing the connection between main materials on the four corners of a temporary iron pole and vertical frames connecting them by operating a long bolt and an upper bolt, and successively pulling and removing them from the ground. CONSTITUTION:A vertical frame 10 formed by welding upper and lower horizontal materials 3, 5, vertical materials 4, 4, on both ends, and diagonal reinforcing materials 7, 7 to main pole materials 1, 1 is removed from horizontal plates 2, 2, by rotating long bolts 8, 8 and separating them from fused nuts 9, 9 on the lower end. Then, bolts 11, 11 and 12, 12 are removed, whereby plates 6, 6 are removed from the main pole materials 1, 1. Further, such a work is conducted for each vertical frame 10, whereby the vertical frame is separated from each main pole 1 in the state where it remains buried in the earth and sand. These separated members are separately hung up from the ground to remove the foundation.
Patent JP-H02113590-A (JP)
Title: Manufacture of printed-wiring board
Inventor: KASAI YOSHIHARU
IPC: H05K3/18
Filed: 1988-10-22
Abstract: PURPOSE:To make it possible to deposit a rough surface-like plating even near fine patterns and a plated resist by a method wherein the roughened surfaces of conductor circuits are formed of a roughening plating using a copper sulfate plating solution containing a specified component. CONSTITUTION:At least one kind selected from among an oxyethylene surface active agent, a sulfer compound and a safranine dye is used as a component (a) and chloride ions are used as a component (b). At least roughened surfaces 5 of conductor circuits 4, which are formed on the surface of a temporary substrate 1 using a plated resist by a plating method, are formed of a roughening plating using a copper sulfate plating solution containing at least the component (a) out of the components (a) and (b). Thereby, the deposition property of the roughening plating is improved and the roughening plating is deposited in fine grooves, which are pinched by the plated resist, of the circuits and even near the plated resist.
Patent JP-2000093100-A (JP)
Title: Rice cake-containing thermal sterilization-treated food
Inventor: IDENO CHIEKO
IPC: A23L7/10
Filed: 1998-09-21
Abstract: PROBLEM TO BE SOLVED: To obtain a rice cake-containing thermal sterilization-treated food without causing the loss in shape even by preservation at high temperatures and without deteriorating the texture such as stiffness or an elastic feeling. SOLUTION: This rice cake-containing thermal sterilization-treated food is obtained by making the osmotic pressure of a rice cake containing a starchy substance in an amount of 10-20 wt.% based on the total weight and gellan gum in an amount of >=0.6 wt.% based on the total weight nearly equal to that of a seasoning liquid, carrying out the thermal sterilization treatment and hermetically sealing the resultant mixture. The prepared food is excellent in high-temperature stability.