baber/WOPTO huggingface dataset:
Patent TW-201340359-A (TW)
Title: Method for producing metal oxide film and metal oxide film
Inventor: SHIRAHATA TAKAHIRO
IPC: H01L21/205
Filed: 2012-06-01
Abstract: This invention provides a method for producing metal oxide film capable of producing a metal oxide film having a low resistance with a low cost. In the method for producing metal oxide film of this invention, a solution (7) containing Zinc is sprayed on a substrate (1) disposed in a non-vacuum environment, and a dopant solution (5) containing a dopant is further sprayed on the substrate (1). A resultant metal oxide film (10) is performed with a low resistance treatment. Herein, the molar concentration of the dopant supplied to the substrate (1) with respect to the molar concentration of Zinc supplied to the substrate (1) is a predetermined value or more.
Patent TW-201317399-A (TW)
Title: Electrolytic copper foil, circuit board using said, and flexible circuit board
Inventor: SAITO TAKAHIRO
IPC: H05K1/09
Filed: 2012-06-28
Abstract: An electrolytic copper foil according to the present invention, having excellent pliability and flexibility, of which the crystal distribution per 300 μm<SP>2</SP> before heat treatment (untreated) is 10,000-25,000 crystal grains having a grain diameter of less than 2 μm, and of which the crystal distribution per 300 μm<SP>2</SP> after a one-hour heat treatment at 300 DEG C is 5,000-15,000 crystal grains having a grain diameter of less than 2 μm. As regards this electrolytic copper foil, the percentage of change in the crystal orientation ratio (%) as measured by EBSD before heat treatment (untreated) to as measured by EBSD after a one-hour treatment at 300 DEG C is within ±20% for each of the following: the sum of the (001) face and the (311) face; the sum of the (011) face and the (210) face; and the sum of the (331) face and the (210) face.
Patent TW-201304096-A (TW)
Title: Semiconductor package and manufacturing method thereof
Inventor: KANG TAE-SIN
IPC: H01L21/60
Filed: 2012-06-29
Abstract: A semiconductor package and manufacturing method thereof are describe. A package substrate is disposed on a base board having conductive patterns and includes a semiconductor chip. The package substrate has conductive patterns thereon and a recession area is disposed under the central portion of the package substrate. The soldering balls are formed under the package substrate except the recess area for electrically connecting to the base board. The semiconductor chip is disposed within the recess area. The inactive surface of the semiconductor chip is adhered to the inactive surface of the package substrate and the active surface of the semiconductor chip is connected to the base board by way of the second soldering balls. The semiconductor chip in the present invention is disposed under the recess area. The active surface of the semiconductor chip is connected to the base board faced up the active surface of the semiconductor chip by way of the second soldering balls.
Patent TW-201310604-A (TW)
Title: Semiconductor device
Inventor: UNO TOMOAKI
IPC: H01L25/04
Filed: 2012-06-29
Abstract: To improve reliability of a semiconductor device A power MOSFET for switching and a sense MOSFET having an area smaller than that of the power MOSFET and configured to detect an electric current flowing through the power MOSFET are formed within one semiconductor chip CPH and the semiconductor chip CPH is mounted over a chip mounting part via an electrically conductive joining material and sealed with a resin. In a main surface of the semiconductor chip CPH, a sense MOSFET region in which the sense MOSFET is formed is located more internally than a source pad PDHS4 of the sense MOSFET region RG2. Furthermore, in the main surface of the semiconductor chip, the sense MOSFET region RG2 is surrounded by a region in which the power MOSFET is formed.
Patent TW-201403532-A (TW)
Title: Medical information exchange system
Inventor: CHEN CHI-KUAN
IPC: G16H10/60
Filed: 2012-07-11
Abstract: A medical information exchange system is provided for at least one medical information provider to provide medical information and allow at least one medical information requester to request the anonymized medical information. The medical information exchange system includes a medical information database, an information anonymization processing module, a medical information query interface, and an information contribution calculation module. A variety of medical information is stored in the medical information database, and the medical information is provided by the medical information provider. The information anonymization processing module is connected to the medical information database, and the medical information query interface is connected with the information anonymization processing module. Moreover, the information contribution calculation module is connected to the medical information database, the information contribution calculation module gives a credit on the contribution of medical information provider based on the medical information selected by the medical information requester.
Patent TW-201332706-A (TW)
Title: Machining center and switch door for machine operation
Inventor: KITAMURA AKIHIRO
IPC: B23Q11/08
Filed: 2012-09-03
Abstract: In this invention, a machining center is provided with a protective cover that covers the processing part of a working machine. An openable and closable operation door is mounted in front of the protective cover. The operation door is formed in an arch shape along a vertical direction from the surface of the protective cover. The operation door is provided with a handle for opening and closing the operation door. The operation door is curved on an arched line that reaches the highest point at its center and lowers toward the top and bottom ends. The protective cover is provided with a semi-cylindrical LED display device protruding from the surface of the protective cover. The operation door is made of carbon fiber.
Patent TW-201328837-A (TW)
Title: Transfer robot and substrate processing apparatus
Inventor: FURUICHI MASATOSHI
IPC: H01L21/677
Filed: 2012-09-04
Abstract: A transfer robot includes an arm unit having a hand capable of holding one of transferred objects, a base unit mounted to an installation frame and horizontally rotatably supporting the arm unit, an attachment member for attaching the base unit to the installation frame, and an elevation mechanism arranged within the base unit and provided with an elevation member linked to the arm unit. The elevation mechanism is configured to move the arm unit up and down within an arm-unit up/down movement range defined above the base unit by moving the elevation member up and down along a vertical shaft. The base unit is fixed to the installation frame in a state that a portion of the base unit extending by a specified height from a bottom wall of the base unit to the attachment member is embedded in the base receiving recess of the installation frame.
Patent TW-201414382-A (TW)
Title: Methods for fabricating metal-containing device and antenna device
Inventor: HSU CHIEN-PIN
IPC: H01Q1/27
Filed: 2012-09-17
Abstract: A method for fabricating a metal-containing device is provided, including: providing a substrate; forming a non-conductive ink layer over the substrate, wherein the non-conductive ink layer comprises powders of base metal and epoxy; and performing a displacement process to the non-conductive layer to form a first metal layer over a surface of the non-conductive ink layer.
Patent TW-201414375-A (TW)
Title: Electronic component processing apparatus
Inventor: HUANG MING-HONG
IPC: H05K13/02
Filed: 2012-09-28
Abstract: An electronic component processing apparatus includes a machine platform, a material supplying device, a guiding device, at least one work station, a material receiving device, a delivery device, and a central control device. The material supplying device is provided to accommodate at least one electronic component under processing. The guiding device is provided with at least a guider for guiding the placement angle of the electronic component under processing. The at least one work station is provided with at least one processing mechanism for performing a predetermined processing to the electronic component. The material receiving device is provided to accommodate at least one processed electronic component. The delivery device includes a carrying and moving mechanism with a carrying platform, a first material moving mechanism, and a second material moving mechanism. The first material moving mechanism is provided with a plurality of holders for carrying and moving the electronic component in a reciprocating manner on the same path route among the material supplying device, the guiding device and the carrying platform. The second material moving mechanism is provided with at least one holder for carrying and moving the electronic component among the carrying platform, the work station and the material receiving device. The central control device is provided to control and integrate the operation of each device so as to execute an automated processing. Accordingly, the apparatus is able to smooth the matched operation timing between each device and the work station and rapidly carry and move the electronic component, thereby achieving the practical efficiency of increasing apparatus production performance.
Patent TW-201414129-A (TW)
Title: Non-contact type inductive power transmission apparatus
Inventor: HSU JR-UEI
Filed: 2012-09-28
Abstract: A non-contact type inductive power transmission apparatus applicable to supplying power to a load comprises a power supply system and a power receiving system. The power supply system includes a primary coil used to generate an electromagnetic field according to an alternating current with an operating frequency. The power receiving system comprises a secondary coil and a reactance value. The secondary coil induces the electromagnetic field to generate an open-loop voltage and contains a coil inductance value. The reactance value contains a first capacitance value across two sides of the secondary coil, a second capacitance value across two sides of the secondary coil, and a first inductance value across the secondary coil and the load. The first capacitance value and the coil inductance value generate resonance under the operating frequency. The second capacitance value and the first inductance value generate resonance under the operating frequency.
Patent TW-201413182-A (TW)
Title: A cross connected indoor and outdoor unit heat recovery air conditioning system
Inventor: HSIEH WEN-CHIEN
IPC: F24F13/06
Filed: 2012-09-28
Abstract: A cross connected indoor and outdoor unit heat recovery air conditioning system comprises a compression unit, a switching unit and a heat exchange unit. The switching unit contains the first switching valve connected to the compression unit, the second switching valve connected to the first switching valve. The system includes a first control valve, and a second control valve connected to the second switching valve. The heat exchange unit includes an outdoor unit connected with the first switching valve and the second switching valve, an indoor unit comprised of the second heat exchange module that connects with the second switching valve and a 3-Way tee pipe respectively. The third heat exchange unit connects with the first switching valve and the compression unit. A 3-Way tee connects the second heat exchange module, the first control valve and the second control valve. The system exhausted heat is recovered by the second heat exchange module to reduce the energy demanding.
Patent TW-201415313-A (TW)
Title: Touch panel and manufacturing method
Inventor: CHEN WEI-CHUAN
IPC: G06F3/041
Filed: 2012-10-08
Abstract: The present invention discloses a touch panel comprising: a first transparent flexible substrate, a touch sensing structure which be settled on first transparent flexible substrate and includes a plurality of transparent sensing series and a first peripheral circuit. A patterned light-shielding layer deposed on touch sensing structure. The patterned light-shielding layer is disposed on the first peripheral circuits, and the plastic substrate is integrally formed on the top surface of the patterned light-shielding layer.
Patent TW-201335946-A (TW)
Title: Semiconductor memory device and package thereof
Inventor: SOHN KYO-MIN
IPC: G11C7/22
Filed: 2012-11-13
Abstract: A semiconductor memory device and package thereof is provided, the semiconductor memory device includes a plurality of memory banks in a first region, a data terminal to which an input data signal is input, the data terminal being in a second region, and an inverting circuit that inverts or non-inverts the input data signal in response to an inversion control signal indicating whether the input data signal has been inverted, wherein at least one inverting circuit is disposed for each of the plurality of memory banks.
Patent TW-201332916-A (TW)
Title: Glass plate cleaving device, method for cleaving glass plate, method for manufacturing glass plate, and glass plate cleaving system
Inventor: MISHINA KENJI
IPC: C03B33/02
Filed: 2012-11-13
Abstract: A glass plate cleaving device (100) according to the present invention is provided with a cleaving member (10) that applies a force to the principal surface (Ga) of a glass plate (G) which has the principal surface (Ga) and a principal surface (Gb) on which a scribe line (S) is formed, and a press member (20) which presses the principal surface (Gb) of the glass plate (G). The press member (20) has a brush shape. Preferably, the press member (20) has a rectangular shape along the scribe line (S) when viewed from a direction normal to the principal surface (Gb).
Patent TW-201421023-A (TW)
Title: Chlorine ion measurement system
Inventor: CHOU JUNG-CHUAN
IPC: G01N27/416
Filed: 2012-11-19
Abstract: The invention relates to a chlorine ion measurement system, including: a container used for containing a measurand solution; a reference electrode disposed in the container for contacting the measurand solution; a chlorine ion sensing element disposed in the container for contacting the measurand solution, wherein the chlorine ion sensing element includes: a substrate; an oxide film formed on the substrate; and a chlorine ion sensing film formed on the oxide film; and an instrumentation amplifier coupling to the chlorine ion sensing film and the reference electrode by a first wire and a second wire respectively, wherein the chlorine ion sensing film couples to a negative input terminal of the instrumentation amplifier and the reference electrode couples to a positive input terminal of the instrumentation amplifier.
Patent TW-201339093-A (TW)
Title: Composite graphite particle and the use
Inventor: YOKOYAMA YOSHIHITO
IPC: C01B31/04
Filed: 2012-12-07
Abstract: A composite graphite particle comprising: a core composed of graphite obtained by heat treatment of petroleum-derived coke having a hardgrove grindability index (HGI) of 35 to 60 at not less than 2500 deg. C and not more than 3500 deg. C, and a carbonaceous layer existing on a surface of the core; in which the composite graphite particle: is not less than 0.1 in an intensity ratio (ID/IG) of intensity ID of a peak within a range of 1300 cm<SP>-1</SP> to 1400 cm<SP>-1</SP> and intensity IG of a peak within a range of 1500 cm<SP>-1</SP> to 1620 cm<SP>-1</SP> as measured by raman spectroscopy, is not less than 3 micron meter and not more than 30 micron meter in 50%-particle diameter (D50) based on volume particle size cumulative distribution as measured by laser diffractometry, and is not less than 0.2 in an intensity ratio (I110/I004) of intensity I110 of a 110 diffraction peak and intensity I004 of a 004 diffraction peak as measured by wide-angle X-ray diffraction of a pressed compact having a density of 1.35 g/cm<SP>3</SP> to 1.45 g/cm<SP>3</SP> obtained using a binder.
Patent TW-201336517-A (TW)
Title: Oral care compositions comprising color changing films
Inventor: PAN GUISHENG
IPC: A61K8/73
Filed: 2012-12-14
Abstract: Described herein are powder coated films comprising a polymer matrix designed for use in a children's toothpaste, compositions comprising the films; and methods of making and using the same.
Patent TW-201411244-A (TW)
Title: Optical member and display device having the same
Inventor: LEE GI-SEOK
IPC: G02F1/1335
Filed: 2012-12-25
Abstract: The exemplary embodiments of the present invention include a driving substrate, a light source arranged on the driving substrate, a luminous flux control member arranged on the light source, and lug members arranged at a bottom surface of the luminous flux control member and extended to a direction of the light source.
Patent TW-201336134-A (TW)
Title: Organic light emitting diode, manufacturing method for organic light emitting diode, image display device, and illumination device
Inventor: SHINOTSUKA KEI
IPC: H01L51/56
Filed: 2012-12-28
Abstract: The present invention provides an organic light emitting diode substrate configured so that the light extraction efficiency of a single color organic light emitting diode element made from one type of light emitting material is high, so that there is no risk of an extraction wavelength deviating from a target light emission wavelength due to slight variations in a fine uneven structure, and so as to enable extraction of a narrow bandwidth of light, from visible light, that has any central wavelength within the near infrared band and that has a degree of broadness. Also provided are an organic light emitting diode, a manufacturing method for the organic light emitting diode substrate, a manufacturing method for the organic light emitting diode, an image display device, and an illumination device. The organic light emitting diode, which is a top emission-type, is configured so that at least the following are laminated on the substrate: a reflective layer comprising a metal material; an anode conductive layer comprising a transparent conductive material; an organic EL layer having a light emitting layer which contains an organic light emitting material; and a cathode conductive layer in which a semi-transmissive metal layer and a transparent conductive layer comprising a transparent conductive material are laminated. On the surface of the semi-transmissive metal layer that is in contact with the transparent conducive layer side, a two-dimensional lattice structure is formed in which a plurality of protrusions are arranged periodically and two-dimensionally. If in the surface the real part of propagation constant of a surface Plasmon expressed by complex numbers is k, a distance between centers (P), which is the distance between centers (P) of adjacent protrusions from among the protrusions formed on the surface, is set to be a value within the range of formula (1). When forming a triangular lattice structure as the two-dimensional lattice structure, P0 in formula (1) satisfies formula (2), and when forming a rectangular lattice structure as the two-dimensional lattice structure, P0 satisfies formula (3).[formular: 0.8P0 ≤ P ≤ 1.2P0]
Patent TW-201351529-A (TW)
Title: Method and device for measuring temperature of substrate in vacuum processing apparatus
Inventor: LI YOU-SEN
IPC: H01L21/67
Filed: 2012-12-28
Abstract: A method and device for determining temperature of a substrate in a vacuum processing apparatus during a process of the substrate are disclosed, the substrate to be measured is placed on a susceptor in the vacuum processing apparatus for a manufacture process, and the method includes: selecting i wavelengths from radiance emitted from the susceptor through a substrate, where i is a natural number greater than 1; obtaining at least i pieces of radiance corresponding to the selected i wavelengths; and calculating the temperature of the substrate based on the i pieces of radiance and the i wavelengths, by using a mathematical equation: E(lambdai)=T(d)M(lambdai,T), where E(lambdai) is the ith radiant quantity corresponding to the ith wavelength lambdai, T(d) is transmittance of the substrate, which is a function of thickness d of a film grown on the substrate, and M(lambdai,T) is blackbody radiation equation, which is a function of the ith wavelength lambdai and the substrate temperature T.
Patent TW-201350609-A (TW)
Title: Film deposition apparatus
Inventor: KATO HITOSHI
IPC: C23C16/455
Filed: 2013-01-17
Abstract: A film deposition apparatus deposits a thin film on a substrate by repeating a cycle of supplying plural kinds of process gases that react with each other in a vacuum chamber. The film deposition apparatus includes a turntable to hold a substrate thereon and to rotate the substrate, and a plurality of process gas supplying parts. At least one of the process gas supplying parts extends from the center to the periphery and is formed as a gas nozzle including gas discharge holes. The gas discharge holes are formed along a length direction of the gas nozzle. The film deposition apparatus also includes current plates provided on upstream and downstream sides in a rotational direction of the turntable and extending along the length direction of the gas nozzle, and having at least one bent section bent downward from an outer edge of the current plates.
Patent TW-201336984-A (TW)
Title: Thermoplastic resin composition for cleaning molding machine
Inventor: WAKITA NAOKI
IPC: C11D1/66
Filed: 2013-01-25
Abstract: The present invention provides a thermoplastic resin composition for cleaning a molding machine which has good detergency and good workability while cleaning the inner part of the thermoplastic resin molding machines, such as an extruder and an injection molding machine. The thermoplastic resin composition for cleaning a molding machine comprises (A) a thermoplastic resin containing a styrene-based resin, (B) an alkali metal salt of aliphatic acid, (C) a nonionic surfactant and (D) a metal salt of acid phosphate.
Patent TW-201401462-A (TW)
Title: Copper interconnect structure and method for fabricating thereof
Inventor: HUANG CHI-WEN
IPC: H01L21/3213
Filed: 2013-02-07
Abstract: A method of fabricating a copper interconnect structure is disclosed. A substrate having a conductive region is provided. An insulating layer with a via opening is formed on the substrate. The via opening exposes the conductive region. A copper layer is formed on the first insulating layer and fills the via opening by the sequentially performing deposition and reflowing process. A masking layer is formed on the copper layer to cover the via opening. The copper uncovered by the masking layer is anisotropically oxidized. The masking layer and the oxidized copper layer are removed by a wet etching process, to form a copper plug in the via opening and a copper wire line on the copper plug. A copper interconnect structure is also disclosed.
Patent TW-201401830-A (TW)
Title: Method for half-duplex FDD operation in LTE FDD network
Inventor: LEE MOON-IL
IPC: H04L5/16
Filed: 2013-03-15
Abstract: A method and apparatus for half-duplex (HD) frequency division duplex (FDD) (HD-FDD) operation are disclosed. The method in a wireless transmit/receive unit (WTRU) includes monitoring a first frequency for all downlink sub-frames for downlink communication except during a cell specific uplink frame, retuning to a second frequency and transmitting a scheduling request (SR) during a WTRU specific period of the cell specific uplink frame, wherein the WTRU specific period is based on a duty cycle, and retuning to the first frequency and receiving an uplink grant in a subsequent sub-frame.