baber/WOPTO huggingface dataset:
Patent JP-H02156586-A (JP)
Title: Formation of quantum well structure
Inventor: MURATA MICHIO
IPC: H01S5/343
Filed: 1988-12-08
Abstract: PURPOSE:To realize a quantum well structure by one time process by a method wherein a mask to hinder crystal growth is patterned and formed on a substrate surface in the manner as to have a coverage ratio and a shape corresponding with the well with of a layer of the quantum well structure, and epitaxial growth is alternately performed by supplying material gas. CONSTITUTION:On a substrate 1 surface in the vicinity of a region where a quantum well structure is formed, a mask 2 of SiO2, SiNx, etc., to hinder crystal growth is patterned and formed, so as to have a coverage ratio and a shape corresponding with the well width of a well layer 41 to be formed or the barrier width of a barrier layer 31. The barrier layer and the well layer 4 are alternately subjected to epitaxial growth by supplying material gas A, B on the substrate surface. As a result, the barrier width and the well width are widely formed on the substrate 1 surface in the vicinity of the mask 2, and are narrowly formed on the substrate 1 surface distant from the mask 2. At a part where the coverage ratio of the substrate 1 surface by the mask 2 is large, the barrier width and the well width are widely formed. At a part where the coverage ratio is small, the above widths are narrowly formed. As a result, the barrier width and the well width can be freely controlled. Thereby, the quantum well structure can be realized by one time epitaxial growth process.
Patent JP-H08221257-A (JP)
Title: Divider for data processor
Inventor: DEBITSUDO BIBIAN JIYAGAA
IPC: G06F7/537
Filed: 1995-11-29
Abstract: PROBLEM TO BE SOLVED: To provide a hardware divider exclusively for an integer dividing instruction. SOLUTION: The hardware divider generates the plural bit parts of a quotient in response to plural different dividing instruction codes. When a partial remainder is zero, following dividing instructions are not executed, and a dividing operation is immediately ended. The successive dividing instruction calculates the residual bits of the quotient in response to a zero display flag set in a present programming state register 26. This is an execution example in which a 32 bit quotient and a 32 bit remainder are generated from a 32 bit divisor and a 64 bit dividend in response to four different dividing instruction codes which respectively generates a 8 bit quotient.
Patent JP-2000138343-A (JP)
Title: Semiconductor device
Inventor: KAWATO HISASHI
IPC: H01L25/18
Filed: 1998-10-30
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device, where a molding process can be reduced, and molding region is enhanced in filling properties. SOLUTION: This semiconductor device has a structure, where a power chip lead frame 2a is arranged nearly in parallel with an integrated circuit chip lead frame 2c through the intermediary of a power chip lead terminal 2b and a lead step 2e. The rear of the power chip lead frame 2a is set closer to the outer surface of a molding resin than that of the integrated circuit chip lead frame 2c.
Patent JP-H08163913-A (JP)
Title: Reel type lawn mower
Inventor: KISHI ICHIRO
IPC: A01D34/47
Filed: 1994-12-14
Abstract: PURPOSE: To provide a lawn mower capable of smoothly feeding cut lawn grass into a housing part. CONSTITUTION: This reel type lawn mower is obtained by arranging a motor 5 for driving a rotating blade 3 on the upper sidle of the rotating blade 3, forming the whole surface on the rear side of the rotating blade 3 into a space communicating with a housing part 7 and smoothly feeding the lawn grass cut by the rotating blade 3 and a fixed blade 4 to the housing part 7 by the rotation of the rotating blade 3 in the reel type lawn mower equipped with the reel type rotating blade 3, rotated and driven with the motor 5 and the fixed blade 4 arranged at a position corresponding to the rotating blade 3 and further the housing part 7 for the cut lawn grass formed on the rear side in the lawn cutting forward direction.
Patent JP-H08145120-A (JP)
Title: Viscous rubber damper
Inventor: OTAKA HIDEKI
IPC: F16F15/167
Filed: 1994-11-21
Abstract: PURPOSE: To provide a viscous rubber damper which does not require formation of a recess inside an injection port by means of counterboring and allows shortening of the time for injection of a viscous fluid. CONSTITUTION: A viscous fluid is injected, and a plug 27 whose periphery is tapered is fitted by pressure into an injection port 25 for viscous fluid, and the surrounding area of the injection port 25 is fastened, for example, by caulking using a punch 31.
Patent JP-H03212753-A (JP)
Title: Apparatus and method for atomic access to input and output device
Inventor: BURAIAN MAIKERU KERAHAA
IPC: G06F13/12
Filed: 1990-11-16
Abstract: PURPOSE: To enable plural atomics to execute plural instructions by transferring a command bucket when a graphic processor is utilizable. CONSTITUTION: When rectangular clipping is performed in a hardware, a LiNe procedure checks the state of an I/O read transaction, and when the state is excellent, a graphic sub system 45 immediately starts the transfer of the command bucket. Since the procedure just turns on a state word, a BUSY state causes a software retrial. The physical address of the command bucket is encoded in the address of the I/O read transaction, a bucket address is obtained for the graphic sub system 45 by the encoding, command bucket transfer is made possible and an application receives the state as a part of the same atomic processing.
Patent JP-H09150357-A (JP)
Title: Semiconductor wafer chamfered face polishing method and device thereof
Inventor: KAWAGUCHI AKIRA
IPC: B24B9/00
Filed: 1995-11-29
Abstract: PROBLEM TO BE SOLVED: To form a smooth chamfered face and to improve machining precision by rotating a semiconductor wafer in the circumference direction and sliding a polishing cloth, which is arranged so as to touch the chamfered face, in the direction different from the circumference direction of the semiconductor wafer while supplying polishing liquid onto the chamfered face. SOLUTION: When a bearing part 14 is moved upward, a semiconductor wafer W is lifted by means of a supporting rod 16 so as to be clamped between the supporting rods, 15, 16, and then, a vacuum suction mechanism 16b is operated so as to suck the semiconductor wafer W to the supporting rod 16. Subsequently, the supporting rods 15, 16 are rotated so as to rotate the semiconductor wafer W in its circumference direction, while a polishing drum is brought close to the surface of the semiconductor wafer W while being rotated, and polishing of a chamfered face is carried out while polishing liquid is supplied. In this process, polishing is carried out by means of the whole side face of the polishing drum as a polishing drum rotating mechanism 21 is horizontally moved in the rotation axis direction of the polishing drum.
Patent JP-2001095856-A (JP)
Title: Bedsore preventing bed
Inventor: NISHIOKA HIDEYA
IPC: A47C31/12
Filed: 1999-09-28
Abstract: PROBLEM TO BE SOLVED: To realize a bedsore preventing bed featuring automatic and complete dispersion of body pressure and shifting of sleeping positions. SOLUTION: A control system is adopted which has a mechanism for moving up and down a plurality of independent supporting bodies arranged crosswise and longitudinally along a bed floor surface for supporting body pressure being dispersed, wherein tension transmitting wires commonly used for the plurality of supporting bodies are set among running blocks secured to the lower parts of the supporting bodies with their axes in horizontal, running blocks secured to bed frames corresponding thereto with their axes in horizontal and fixed blocks mounted to be in the same plane, so that the individual supporting bodies are automatically held in positions where tension given from the outside to the wires and the body pressure given to the supporting bodies are kept in balance.
Patent JP-H11135538-A (JP)
Title: Semiconductor device and wire bonding method
Inventor: NISHIURA SHINICHI
IPC: H01L21/607
Filed: 1997-10-27
Abstract: PROBLEM TO BE SOLVED: To provide a stable wire loop form with high form retainability. SOLUTION: A wire loop form obtained by connecting a first bonding point A and a second bonding point G by a wire is constituted of a neck height part 31 which almost vertically extends upward from the first bonding point A, a first lateral wire part 35 which laterally extends downward from the neck height part 31, a second lateral wire part 36 which almost horizontally extends from the first lateral wire part 35, a third lateral wire part 37 which extends downward from the second lateral wire part 36, and an inclination part 38 which extends to the second bonding part G from the third lateral wire part 37.
Patent JP-H05326858-A (JP)
Title: Semiconductor device
Inventor: KITSUKAWA GORO
IPC: H01L27/06
Filed: 1992-11-20
Abstract: PURPOSE:To provide a semiconductor device equipped with transistors of various characteristics and formed on a single substrate. CONSTITUTION:At least two N-type impurity layers and two P-type impurity layers are formed on an insulating film (INSULATOR), one or more transistors are formed on each impurity layer, and different voltages are applied to the impurity layers respectively. Therefore, wells are electrically isolated from each other, so that elements of different characteristics can be obtained.
Patent JP-H10152141-A (JP)
Title: Pulling-out plate for inner stopper and container with different quality member
Inventor: YUZUHARA YUKITOMO
IPC: B65D39/04
Filed: 1996-11-22
Abstract: PROBLEM TO BE SOLVED: To obtain a pulling-out plate by which an inner stopper fitted to the opening of a container body can be separated by making use of the delivery opening, by providing a trunk part having the width which can be inserted in the delivery opening and a fixing part formed wider than the inner stepped part at the rear part and shorter as it goes to the end at the front part. SOLUTION: The trunk part 32 is formed to be almost the same with the diameter of the delivery opening 21a or narrower than that. The fixing part 31 is formed at the front end of the trunk part 32 and shaped to form a triangle with a narrow front. And the trunk side thereof is made wider than the diameter of the delivery opening 21a of the inner stopper 2 and made narrower than the diameter of the inner peripheral face. When separating the inner seal, the insertion part 30 is inserted in the delivery opening 21a from the fixing part 31. And the fixing part 31 is pressed in while deflecting the delivery opening 21a. When the fixing part 21 reaches the inside of the delivery opening 21a, the delivery opening is elastically contracted in the diameter. In this way, the fixing part 31 is completely fixed to the inner stopper.  In this condition, the pulling-out plate 3 for the inner stopper is drawn up and the outer peripheral face is deflected to release the engegement of the rib of the inner stopper 2 and the body 1 and separate the inner stopper 2 from the container body 1.
Patent JP-H11147132-A (JP)
Title: Roller straightening method for wide-flange shape steel
Inventor: HORIE MASAYUKI
IPC: B21D3/05
Filed: 1997-11-13
Abstract: PROBLEM TO BE SOLVED: To heighten an effect on straightening of upward and downward bends by pressing with a load being bigger than a specified value of a vertical roll while concentration of deformation is relived, web height is increased and damage to fillet and an inclination of a flange are restrained. SOLUTION: When pressing force is small, an inclination of a flange 2 produced with horizontal press down force is not suppressed and clearance between a vertical roll 10 and a flange 2 is made and a pressing effect is lost. Thereat, a minimum pressing force necessary for suppressing deformation of the flange is strongly affected by size of a wide-flange shape steel and the force is calculated with the following formula: PV/PH>=0.287-4.23×10-9×B<2> t2 ×t1 . In this formula, PV is load of the vertical roll, PH is straightening load, B is width of the flange, t1 is thickness of a web, t2 is thickness of the flange. As parts within a half length of the roll pitch from a fore and back ends of the wide- flange shape steel are scarcely applied with bending deformation, the straightening load is scarcely applied.  Therefore, pressing with the vertical roll 10 on these parts is not necessary.
Patent JP-H07163476-A (JP)
Title: Electric warmer
Inventor: KOBAYASHI SOKICHI
IPC: A47J39/02
Filed: 1993-12-13
Abstract: PURPOSE:To provide an electric warmer, which can reduce the temperature rise of a warm chamber itself by lessening the difference between the temperature of the warm chamber and the temperature of the materials to be stored. CONSTITUTION:A warm chamber 2 comprises a cylindrical member 4 made of folded aluminium panel and the like, and a base plate 5 made of a heat resisting plastics and combined in an inside face 7 of a main body 1 of an electric warmer. A thermistor 12 is mounted externally on the center of the bottom of the warm chamber 2.
Patent JP-S63169334-A (JP)
Title: Production of chromium stainless steel strip of double phase structure having small intra-surface anisotropy and high ductility and high strength
Inventor: TANAKA TERUO
IPC: C21D9/46
Filed: 1986-12-30
Abstract: PURPOSE:To obtain a stainless steel strip of double phase structure having small intra-surface anisotropy and having high ductility and high strength by hot rolling a steel slab having a specific compsn. essentially consisting of Cr, then subjecting the slab to cold rolling including intermediate annealing and holding the rolled sheet in a specific temp. region in a continuous heat treatment furnace then subjecting the sheet to controlled cooling. CONSTITUTION:The slab of the steel consisting of <=0.08wt.% C, <=2.0% Si, <=3.0% Mn, <=0.040% P, <=0.030% S, <=3.0% Ni, 10.0-14.0% Cr, <=0.08% N, <=0.02% O, <=3.0% Cu and the balance Fe and unavoidable impurities and satisfying the relations expressed by the formulas I, II is produced. Said slab is then subjected to hot rolling and >=2 passes of cold rolling including intermediate annealing under heating to the single phase region temp. of ferrite to the product sheet thickness. The rolled sheet is passed through the continuous heat treatment furnace where the sheet is held at the two-phase region temp. of ferrite + austenite of Ac1 point or above and <=1,100 deg.C within 10min and is then cooled at 1-500 deg.C/sec average cooling rate from the max. heating temp. down to 100 deg.C. The chromium stainless steel strip of double phase structure having >=200HV hardness, the small intra-surface anisotroy and the high ductility and high strength is obtd. by the above-mentioned finishing heat treat ment.
Patent JP-H06154529-A (JP)
Title: Filter
Inventor: TANIOKA TAKASHI
IPC: B01D39/20
Filed: 1992-11-20
Abstract: PURPOSE:To provide a filter having high adsorptive function and reusable after oil removal by thermal treatment by laminating a net-like woven cloth layer prepared from heat resistant inorganic long fibers on the upstream side of a nonwoven cloth layer made of heat resistant inorganic fibers and holding both of them with a ventilative holding material. CONSTITUTION:Alumina-based heat resistant inorganic fibers and an alkali metal silicate-based binder as an inorganic binder are used to make paper by dry method and to obtain nonwoven cloth 6. A net-like woven cloth 5 prepared by knitting alumina-based inorganic long fibers using colloidal silica as an inorganic binder is stuck to at least the upsteam side of the nonwoven cloth layer 6. After that, the laminated article is held by ventilative holding bodies 7a, 7b such as a whole frame made of a stainless steel. The filter obtained in this way adsorbs oils in waste gas efficiently and has high oil drops removing function and can be used for a long period of time.
Patent JP-2001131539-A (JP)
Title: Thermally conductive material
Inventor: YAMAGUCHI AKIO
IPC: H01L23/373
Filed: 1999-11-02
Abstract: PROBLEM TO BE SOLVED: To provide a thermally conductive material that has extremely good thermal conductivity and also shows excellent properties in adhesion to electronic parts and the like and in durability. SOLUTION: Alumina fiber mesh 3 is prepared by impregnating woven alumina fibers with liquid silicone formulated in 0.8-3.0 W/(m.K). The objective thermally conductive material 1 is constituted by alternately laminating the sheets 5 similarly impregnated with a liquid silicone and cured and the above-described alumina fiber mesh sheets 3. The sheets 5 and the alumina mesh sheet 3 have almost the same outer shapes, thus the alumina fibers continuously distribute all over the whole width of the sheet 5. The alumina fibers have very good thermal conductivity along the alumina fiber direction. Since the alumina fibers are woven, the orientation of the fibers are kept good. Thus, this thermally conductive material 1 has very good thermal conductivity in the direction of the alumina fiber.
Patent JP-2000142048-A (JP)
Title: Split type tire antiskid device
Inventor: NISHI TOSHITAKA
IPC: B60C27/16
Filed: 1998-11-02
Abstract: PROBLEM TO BE SOLVED: To easily pull out the opening inside edge of an opening part without contacting/interfering with a grounding part of a tire by forming the tire grounding part in a completely avoidable opening shape in pulling out a device body to the outside from the width directional inside of the tire. SOLUTION: In this device 1, a belt-like device body 3 wound round the outer periphery of a tire has two nonmetallic net constituting pieces 4 juxtaposed in the tire circumferential direction. A tire grounding opening part 10 widely opened in an adjacent interval of both net constituting pieces 4 is formed in a lengthwise directional midway part of this device body 3. An opposed end part 12 of this opening part 10 is composed of a tread corresponding part 13 of a central part, an outside sidewall corresponding part 14 and an inside sidewall corresponding part 15. This outside side wall corresponding part 14 is extendedly formed by accompanying an oblique directional straight line in the inward direction. Thus, an opening edge part can be easily pulled out without contacting/interfering with a tire grounding part.
Patent JP-H03173471-A (JP)
Title: Wiring structure of master slice system lsi
Inventor: TAWADA SHIGEYOSHI
IPC: H01L21/82
Filed: 1989-12-01
Abstract: PURPOSE:To comparatively easily adjust wiring length by arranging a first and a second wiring layer wherein a vertical and a horizontal wiring lattice are defined and a third wiring layer wherein a wiring lattice connecting diagonal lines of both lattices is defined. CONSTITUTION:When both of the lattice intervals in the vertical and the horizontal directions are (d), the wiring length between the terminals t1 and t2 of a wiring network is shorter than or equal to 8d, in order to satisfy restrictions like the delay time of an LSI required for high speed operation. When wiring process is performed by using a first and a second wiring layer 2 in accordance with the order that the angle of the line connecting the terminals t1 and t2 is approximate to 0 deg. or 90 deg., the wiring between the terminal t1 and t2 is detoured by wiring routes 101 and 102, and a wiring route 201 of alpha length 12d is obtained. On the other hand, by constituting an oblique wiring between the terminals t1 and t2 by using the layer 3, a wiring route 221 of a length l=4.2<2/1>d can be obtained as follows, the wiring routes 101 and 102 are not corrected, and through holes 231 and 232 between the first and the this wiring 1, 3 are arranged at the positions of the terminals t1 and t2.
Patent JP-2001135409-A (JP)
Title: Water-resistant connector
Inventor: ICHIO TOSHIFUMI
IPC: H01R13/52
Filed: 1999-11-02
Abstract: PROBLEM TO BE SOLVED: To provide a water-resistant connector for avoiding a drop in performance of a seal between both connectors even if an electric wire is pulled improperly. SOLUTION: A water-resistant connector has a housing 5 for allowing the storage of a metal fitting for a terminal and a retainer 13 for stopping the fall of the metal fitting for the terminal. A frame-like front cover 7 and a connector seal member 9 are assembled to the front of the housing 5. A wire seal member 8 and a rear cover 10 are assembled to the rear of the housing 5. Along the periphery of the wire seal member 8, there is formed a projecting section 34 thinner than a fit-in section 37 with holes 35 for inserting electric wires therethrough. The projection section 34 is held between the rear cover 10 and the front cover 7.
Patent JP-H04185464-A (JP)
Title: Recorder
Inventor: MURANO KATSUMI
IPC: G03G15/04
Filed: 1990-11-20
Abstract: PURPOSE:To realize good recording both of pseudo-middle tone image and solid image, even when they are present mixedly in a single sheet of image, by recognizing the status of picture elements arranged laterally, longitudinally and obliquely from a picture element designated by a remark picture element data and then setting the size of the picture element according to the data. CONSTITUTION:Status of objective picture elements extracted by shift registers 4a-4c and eight picture elements adjacent thereto is recognized and a data representing a selected status is fed, as a light emission time setting signal SA, to a light emission driving section 67. Picture elements are then recorded according to thus provided signal SA where a small picture element inscribing a single picture element area is formed in an area of pseudo-middle tone image or character sparse black picture element thus reproducing a good middle tone image and recording a fine character. On the contrary, a large picture element covering a single picture element area is formed in a solid image area and a sufficiently high density is obtained.
Patent JP-H05148813-A (JP)
Title: Pavement unit
Inventor: KOBANE KENJI
IPC: E01C5/20
Filed: 1991-11-27
Abstract: PURPOSE:To make rainwater over the surface of a paved road permeate into soil, and to improve traffic safety. CONSTITUTION:A pavement unit 1a is constructed of a lower plate 2 that is buried underground and an upper plate 3 that is placed over the lower plate 2. The pavement unit 1a is buried so that the surface of the upper plate 3 is made flush with the surface of the paved road and at the same time, openings 2b and 3b for drainage are opened respectively to the lower plate 2 and the upper plate 3. Furthermore antiskid protuberances 3a in gridiron shape are formed all over the surface of the upper plate 3 and at the same time, reinforcing frames 2a and 3c are formed all over the surface of the lower plate 2 and the undersurface of the upper plate 3.
Patent JP-H03172030-A (JP)
Title: Line control method
Inventor: HAYASHI MASATO
IPC: H04J3/16
Filed: 1989-11-30
Abstract: PURPOSE:To improve efficiency for a retransmission processing by predicting the fluctuation of a traffic amount to be generated corresponding to the fluctuation of line quality and changing the allocation of an inbound line. CONSTITUTION:A slot control part 67 accesses a line quality control part 68 through a signal line 630 and takes out a bit error rate Pe and a NACK counter value from a line quality control file 7. A frame error rate Pf and an average retransmission request number beta as the function of a slot number M for the retransmission request are calculated and the slot number M for the retransmission request is calculated so that the value of a success rate Ru=beta/M can be maximum, and notified through a signal line 640 to an inbound line control part 60. Thus even when the number of the retransmission requests is increased, the retransmission request can be transmitted to a host station with high probability.