baber/WOPTO huggingface dataset:
Patent JP-2001011426-A (JP)
Title: Surface-modifier
Inventor: NISHIMURA SONOKO
IPC: C08F290/06
Filed: 1999-06-30
Abstract: PROBLEM TO BE SOLVED: To endow water-draining properties with a hydrophilic surface and stain-proofing properties with a hydrophobic surface by forming a water-soluble or water-dispersible copolymer containing in a specific weight ratio a plurality of monomer components each having a specific structure. SOLUTION: There is provided a water-soluble or water-dispersible copolymer having a weight-average mol.wt. of 5,000-1,000,000 and comprising monomer components (A)-(D) having a structural formula represented by formulae I-IV, respectively, in a ratio of 0.1-50 wt.%, 0.1-50 wt.%, 10-60 wt.% and 10-70 wt.%, respectively. The ratio by weight of the components in the subject surface modifier is such that the component A/component B ratio is 0.20-0.05 and that the component B/component C ratio is 0.5-0.01.  In the formulae, R1, R4, R5 and R7 are each H or a methyl group; R2 is a 1-6C divalent aliphatic group; R3 is a 2-30C aliphatic group or the like; R6 is H or a 1-9C divalent aliphatic group; R8 is a 1-8C divalent aliphatic group; R9 and R10 are each a 1-4C hydrocarbyl group; Y is a 1-30C divalent linking group; AO is an ethyleneoxy group or the like; L is -O- or the like; X is a 1-4C aliphatic group; Z is an anion; h is 0-2; and j is 0-500 or the like.
Patent JP-H05216087-A (JP)
Title: Camera with moving body detecting device
Inventor: NONAKA OSAMU
IPC: G03B7/00
Filed: 1991-07-25
Abstract: PURPOSE:To allow a stroboscope to emit light, to stop down a lens and to take a picture in the case that a moving body is at a short distance in order to take the picture without blurring by automatically focusing on the moving body. CONSTITUTION:This camera is provided with a range-finding circuit 1 which measures an object distance, a moving body detection circuit 2 which detects the moving speed of the object along the optical axis direction of the object, and a stop-down control circuit 5 which stops down a photographing lens. When the object distance measured by the range-finding circuit 1 is shorter than a specified distance and the speed detected by the circuit 2 is higher than specified one, a CPU 3 decides that the object is in a short distance moving state. In the case of deciding that the object is in the short distance moving state, the CPU 3 allows the circuit 5 to perform stop-down action so as to deepen the depth of field and drives a stroboscopic circuit 6 to illuminate the object.
Patent JP-S57110370-A (JP)
Title: Powder painting apparatus
Inventor: SUEHIRO ATSUO
IPC: B05C19/02
Filed: 1980-12-27
Abstract: PURPOSE: To enable to enhance adhesion strength as well as to make a coating thin, in the powder painting apparatus of a small article, by imparting vibration which raises and conveys an article to be painted along a surface of an inclined screen net of which a part is embedded in a fluidized layer.  
     CONSTITUTION: Air from a nozzle 15 is dispersed by a partition wall 11 and entered into a powder fluidizing chamber 10 and a fluidized powder forms a fluidized powder interface 13. In this time, a bottom part of a screen net is embedded below the interface 13 and vibration is imparted to a main body 3 by a vibration generating apparatus 16. Herein, a heated article M is thrown onto the bottom part 12a from a port 7 used for other purpose and contacted with the powder to form a desired coating thereon corresponding to heat capacity of the article and, further, as adhered with unmelted powder, raised on a surface of the screen net along a guide shelf 14 by vibration action and, as appearing from the interface, discharged out of the system from an outlet 17 while the unmelted powder is shaken off. Because the powder fluidized on the screen net is fine, even an article with small heat capacity can be painted. 
     COPYRIGHT: (C)1982,JPO&Japio
Patent JP-H0536751-A (JP)
Title: Semiconductor assembling structure
Inventor: SHINOZAKI SATORU
IPC: H01L21/60
Filed: 1991-07-26
Abstract: PURPOSE:To make it possible to reduce the number of manday for connection, cut off working time and reduce inductance induced by a connection medium and, what is more, make compact its size by connecting a semiconductor chip with an outside electrode and sealing them simultaneously, using a metallic bump. CONSTITUTION:A metallic bump 8 is formed on a bonding pad 7. Then, a metallic board 2 is covered with a non-metallic housing member 3 so that they may be bonded. After the bonding, they are heated, contact-bonded and sealed while the metallic bump 8 is connected with a metallic electrode 6 simultaneously. It is, therefore, possible to cut off the number of manday for connection and working time. In addition, this construction makes it possible to reduce the inductance induced by a connection medium and reduce its size as well so that it is possible to improve its high frequency characteristic and reduce the size after the completion of assembling.
Patent JP-H0831025-A (JP)
Title: Production of substrate for optical information recording medium and apparatus for production thereof
Inventor: TOSHIDA YOSHI
IPC: B29D17/00
Filed: 1994-07-18
Abstract: PURPOSE:To obtain a process for producing a substrate for optical information recording media which improves transferability of preformat patterns and suppresses double refraction down to a low level and a device therefor. CONSTITUTION:This process comprises continuously producing the substrate for optical information recording media by melting and extruding a resin to mold a resin sheet 3 and clamping the resin sheet 3 in a substantially molten state with a stamper roll 5 and a mirror-finished surface roll 4 arranged opposite to the stamper roll 5 to transfer the preformat patterns onto the surface of the resin sheet, then peeling the sheet from the stamper roll 5. The clamped resin sheet 3 is cooled with a cooling gas from a cooling means 8 until the resin sheet is peeled from the stamper roll 5.
Patent JP-S6247121-A (JP)
Title: Manufacture of semiconductor device
Inventor: MORITSUKA KOHEI
IPC: H01L29/812
Filed: 1985-08-26
Abstract: PURPOSE:To obtain a high density N-type layer by conducting ion implantation of Si, by performing ion implantation of the Si to a III-V group compound semiconductor layer, and ion implantation of P which is not contained in the semiconductor layer into the same region around this process. CONSTITUTION:Si is ion implanted to a III-V compound semiconductor layer such as a GaAs layer. P is ion implanted around this process, and high density N-type layer is formed by heat treating after the ion implanting process. In this manufacture, the substitution of Si to Ga lattice point is accelerated, P of the same group V element as As is ion implanted to supplement the insufficient As amount at that time to improve the activity as an Si doner. Since P is larger by only one in atomic number than Si, the same implanting stroke as that of Si can be obtained by supplying substantially the same implanting energy a of Si. According to this method, high carrier density N-type layer can be obtained by the Si ion implantations.
Patent JP-H0352347-A (JP)
Title: Disturbance detection and protection device for input reference signal
Inventor: TAKAHASHI YUJI
IPC: G06F1/04
Filed: 1989-07-19
Abstract: PURPOSE:To facilitate the adjustment of the characteristic by providing a disturbance detection means generating a reference signal synchronously with a reference signal in its own station when disturbance is detected as to a 1st reference signal, a 2nd reference signal protection detection means having a self-running synchronization counter and a phase synchronization oscillation circuit receiving the output. CONSTITUTION:When a fault or the like takes place on the way of transmission, a reference signal 64kHz selected by a selection circuit 4 is inputted to a disturbance detection means 16, which detects the disturbance of the reference signal. Even when the detection is implemented, a 8MHz reference signal is received from a phase synchronization oscillation circuit (PLO) and a reference signal 64kHz generated from the 8MHz reference signal is fed to a protection detection means 7. On the other hand, even when the protection detection means 7 detects the presence of disturbance in the reference signal 8MHz, the self-running synchronization counter in the protection detection means 7 is run itself with the reference signal from the PLO 8 similarly. Then the reference signal 8MHz is used as an input reference signal of the PLO 8 and inputted to the PLO 8, which generates the reference signal in its own station for the receiver synchronously therewith. Thus, the adjustment of the characteristic is facilitated.
Patent JP-H0851050-A (JP)
Title: Semiconductor wafer joining method
Inventor: TSUDA SHUHEI
IPC: H01L21/02
Filed: 1994-08-09
Abstract: PURPOSE:To prevent the void and the ring-like distortion generated between surfaces by a method wherein a semiconductor wafer is curvedly deformed into protruding spherical form, and after the center parts of both semiconductor wafers have been brought into contact within the prescribed hours, the curved deformation is removed, and the state wherein both semiconductor wafers are superposed is maintained for the prescribed hours or more. CONSTITUTION:A wafer W1 is attracted to the joining surface 2 of a vacuum chuck 3, and it is curvedly deformed and retained on a convexed spherical surface. The wafer 2 is set on the wafer 1 in such a manner that their spherical surfaces are brought into contact with each other. The wafer 1, which is elastically deformed by the chucking, is restored to flat shape within five seconds after the center parts of both wafers W1 and W2, and the entire surfaces of the wafers W1 and W2 are brought into contact with each other. After erapse of thirty seconds under the above-mentioned state, the mirror faces of both wafers Wl and W2 are coupled completely on the whole surface, they are joined to each other, and generation of the voids and ring-like distortion on the plane surface are prevented.
Patent JP-H03263351-A (JP)
Title: Manufacture of semiconductor device
Inventor: USUI TAIJI
IPC: H01L21/208
Filed: 1990-07-17
Abstract: PURPOSE:To eliminate an auto-doping from a first semiconductor substrate, to easily form the substrate having a high specific resistance and to increase in thickness by forming a part for forming an active region in an isolation island by a bonding method of first and second semiconductor substrates. CONSTITUTION:An N<+> type semiconductor substrate 1 having about 500mum of thickness and, for example, about 0.01OMEGA.cm of specific resistance and an N-type semiconductor substrate 2 having, for example, about 3OMEGA.cm of specific resistance are bonded, for example, at main surfaces to each other by a wafer bonding method for directly bonding Si wafers processed to be hydrophilic in aqueous HF solution. Here, the thickness of the substrate 2 is, for example, desirably 100mum or more so as not to be damaged in the following steps. Then, after a first insulating film 3 is formed on the other main surface of the substrate 1, the film 3 on a shallow isolation island forming region is removed. Thereafter, with the film 3 existing on the deep isolation island forming region as a mask the substrate 1 is removed by etching to about 400mum of depth with alkaline etchant.
Patent JP-H0851351-A (JP)
Title: Level converter circuit
Inventor: OTSUKA NOBUAKI
IPC: G11C16/12
Filed: 1994-08-09
Abstract: PURPOSE:To provide a level converter circuit suitable for use in a row decoding circuit in a negative gate erasing flash memory. CONSTITUTION:The input end and the output end of the two inverter circuits are connected to form a latching circuit and the two N-channel MOS transistors Q16, Q15 and Q18, Q17 are serially connected between the connecting points N1 and N2 of the input/output ends and a grounded point respectively. The respective inverter circuits are operated by a voltage between potentials VH and VL. The potential of a power source VCC is supplied to the transistors Q16 and Q18 at a high level and the control signal ERS of potential VL is supplied at a low level. Input signals IN and, the inverse of IN set mutually in inversion relation are supplied to the transistors Q15 and Q17 at the side of the connecting points N1 and N2. A system is characterized by obtaining output signals, the inverse of OUT and OUT from at least one of the above connecting points N1 and N2. Level conversion at the 'H' level side and the 'L' level side is realized by one stage and the latching operation of the input signal is enabled.
Patent JP-H1170936-A (JP)
Title: Opening device for packaging container
Inventor: DERVING JACKIE
IPC: B65D17/28
Filed: 1998-07-02
Abstract: PROBLEM TO BE SOLVED: To provide an opening device for a packaging container for food or the like that is capable of developing reliable functions at repeated opening and closing and preventing contents remaining at a spout from scattering on occasion of closing again. SOLUTION: The present opening device 1 for a packaging container is made up, including an openable spout 5 and a lid 4 having a sealing part that can be pushed into the spout 5 and a pressing part in a cross section area larger than that of the spout 5. A stopping protuberance, mechanical working together with the edge 7 of the spout 5, is arranged at the end facing the pressing part of the sealing part. As the stopping protuberance comes into contact with the surrounding wall surface of the edge 7 on closing the spout, preventing the pressing part in a larger area from contacting with the wall surface, the remnants at the spout can be prevented from scattering.
Patent JP-H0353397-A (JP)
Title: Magnetic card reading method
Inventor: KAWADA NORIHIDE
IPC: G06K17/00
Filed: 1989-07-21
Abstract: PURPOSE:To easily hold a magnetic card by holding a part of a magnetic card taken out of a card case by a card gripping adapter and reading the magnetic card in this state by a magnetic data reader. CONSTITUTION:A card user normally holds a magnetic card 1 in a card case 4 made of leather or the like. when using the magnetic card 1, the user takes out the card 1 from the card case 4 and sets it to a card gripping adapter 9. The user picks the adapter with his fingers to execute the read work of the magnetic card. Thus, the size of the magnetic card 1 is reduced, and the magnetic card 1 is easily held, and the workability for read of the magnetic card 1 is not damaged.
Patent JP-H0719009-A (JP)
Title: Regulating method for preventing scuffing abrasion in engine valve system
Inventor: NORIMOTO NORIYA
IPC: F01L1/16
Filed: 1993-06-30
Abstract: PURPOSE:To prevent surface abrasion damage of a cam and a follower from being generated in a same engine, and/or prevent dispersion in relation to advance of surface abrasion by changing, by a simple means, contact condition of a position where scuffing is advanced early or it may be advanced early, in the case when scuffing may be generated or it is actually generated in the same engine. CONSTITUTION:In regulating method for preventing scuffing abrasion in an engine valve system, the thickness of a valve spring spacer and/or the cotter hole diameter of a valve spring retainer, which exist below respective valve springs in the engine valve system, are/is changed independently per valve so as to prevent scuffing abrasion in the engine valve system.
Patent JP-S5978828-A (JP)
Title: Method and apparatus for forming plastic
Inventor: KAJIYAMA SAKUJI
IPC: B29C41/00
Filed: 1982-10-27
Abstract: PURPOSE:To prevent occurrence of rejectable products and to improve productivity as a result of reduced cooling time of the product by a method wherein a forming apparatus of special construction is used to make molding while controlling the mold temperature to come into appropriate ranges at the time of injecting materials and removing the products, respectively. CONSTITUTION:Hot air is introduced via a heat inlet 10a from a heater 14 to a heat chamber 10 provided around a cavity 7 and a heat chamber 11 provided around a runner 12, and a mold 1 is heated up to appropriate temperatures. Thereafter, a molten material is injected into the cavity 7 through the runner 12 using an injector 8. Immediately after injection, a shut-off valve 16 is closed, heating of the mold 1 is stopped and a shut-off valve 17 for a cooled medium inlet 10c is opened to introduce cooling water to the heating chamber 10 from a cooler 15 thereby to cool the mold 1. Subsequently, the mold 1 is opened to remove the product, and then the mold 1 is closed and cooling of the mold 1 is stopped for reheating.
Patent JP-S58101151-A (JP)
Inventor: ROBAATO JIEI AKUSERUROTSUDO
IPC: C08L21/00
Filed: 1982-10-27
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S5889973-A (JP)
Title: Manufacture of painted plate
Inventor: KATAYAMA YOSHIHISA
IPC: B05D7/24
Filed: 1981-11-25
Abstract: PURPOSE:To prevent a paint from being sucked in a porous base plate by painting the surface of the porus base plate with a paint containing mixed short fiber and then applying a paint containing a flaky pigment. CONSTITUTION:Surfaces of a porous base plate like wood are applied with a paint containing short fiber likeasbestos and further applied with a paint containing a flaky pigment like mica. Namely, painting is performed twice, but meshes of the short fiber are obtained and the flaky pigment is utilized effectively, thereby preventing the absorption of the paints.
Patent JP-H0524711-A (JP)
Title: Sheet-sensor cooling device for sheet-reversing device
Inventor: SHIMOOOSAKO MASATAKA
IPC: B41J29/48
Filed: 1991-07-26
Abstract: PURPOSE:To provide a highly reliable sheet-sensor cooling device for a sheet- reversing device by cooling the sheet-sensor itself and the circumference thereof, so that the malfunction of the sheet sensor and also the malfunction of the sheet-reversing device can be prevented. CONSTITUTION:In a sheet-reversing device provided with a sheet sensor 17 for detecting the presence of a sheet P that has been placed in a sheet transfer passage 4, a ventilating duct 18 of a structure for taking in the outside air, or a suction fan or an exhaust fan is arranged in the vicinity of the sheet sensor 17 for cooling the circumference of the sheet sensor 17 and the sheet sensor 17 itself.
Patent JP-H1029288-A (JP)
Title: Mold release film
Inventor: INAGAKI MASASHI
IPC: B32B27/30
Filed: 1996-07-17
Abstract: PROBLEM TO BE SOLVED: To provide a mold release film having excellent aging adhesive properties of a polyester film and a cured silicone resin coating film and releasability. SOLUTION: A primer layer coated with coating agent containing at least one type of water soluble or water dispersible resin selected from polyester resin, polyurethane resin and polyacrylate resin and at least one type of melamine and epoxy crosslinkers is provided on at least one side surface of a polyester film, and a silicone release layer is provided on the primer layer.
Patent JP-H1034585-A (JP)
Title: Robot arm drive mechanism
Inventor: IKEDA JUNICHI
IPC: B25J9/06
Filed: 1996-07-17
Abstract: PROBLEM TO BE SOLVED: To reduce a gas release amount and to reduce dust in the case of driving an arm of a robot. SOLUTION: In this arm drive mechanism 32, a reinforcing plate 32 in one end of a second steel belt 30 is fixed to the periphery of a third pulley 28 by a set screw 36. A reinforcing plate 33 in a central part of the second steel belt 30 is fixed to the periphery of a fourth pulley 29 by a set screw 37. A reinforcing plate 34 in the other end of the second steel belt 30 is fixed to a periphery of the third pulley 28 by a set screw 38 in an opposite side to a mounting position of the reinforcing plate 32. The second steel belt 30 is helically mounted so as to tilt (angle α relating to a horizontal line, and is diagonally wound to a periphery of the third/fourth pulley 28, 29. The reinforcing plate 32, 34 in both ends of the second steel belt 30 is fixed to be displaced in a height direction (pulley width direction) so as to be prevented from overlapping.
Patent JP-S57113158-A (JP)
Title: Information processing system
Inventor: FUJITA MAKOTO
IPC: G06F11/28
Filed: 1980-12-29
Abstract: PURPOSE:To shorten test time by improving debugging efficiency by collecting addresses and data information corresponding to instructions executed ranging from a starting address to an ending address. CONSTITUTION:When the addresses of store instructions executed by an object program 8 ranging from a specified starting address to an ending address, store addresses, and a store data are pooled in a pool part 14, a signal from an information collection part 13 is supplied to a run track control part 15. When a next instruction is a store instruction again, the control part analyzes the instruction to obtain its store address for the collection of old data in the collection part 13, and discriminates the next dynamic step of the object program 8 on the basis of register save information during interruption for next interruption, thereby specifying a fetch trap at the address.
Patent JP-S6166355-A (JP)
Title: Ion implantation device
Inventor: TOKIKUCHI KATSUMI
IPC: G21K5/10
Filed: 1984-09-10
Abstract: PURPOSE:To obtain high efficiency by reducing idle implanting area by controlling beam scanning width so as to coincide a beam radiation region to the shape of a sample wafer and changing driving speed of the sample wafer according to the controlled width. CONSTITUTION:When implanting impurity ion of arsenic into a silicon wafer, a line sensor 6 combining a luminous element and a light receiving element is disposed on the half-way of continuous transfer of a sample wafer 2 by a motor 7, and the voltage signal changing with the transfer of the sample wafer 2 is applied to a coil exciting source 10 through a signal converter 9 and scanning width of an ion beam 3 scanning on the sample wafer 2, and the voltage signal is applied to a motor driving source 8 to change the driving speed of the sample wafer 2 in inverse proportion to the scanning width. Therefore, the beam radiation range can be limited to the wafer part even a large caliber wafer, and the number of processing can be increased.
Patent JP-S6433359-A (JP)
Title: Structure of sound-insulating floor material
Inventor: MORIYAMA TETSUO
IPC: E04F15/18
Filed: 1987-07-28
Abstract: PURPOSE: To improve a soundproof effect by reducing the sinking of a surface material by interposing an elastic body, to which a space section is formed partially, between a base material and the surface material, making the thickness of the elastic body thinner than a cushioning material and making the surface material thinner than the base material. CONSTITUTION: Partially thin elastic bodies 3 are interposed between the surface of a base material 1 and the rear of a surface material 2 and unified while sections, in which the elastic bodies 3 are not interposed between the surface of the base material 1 and the rear of the surface material 2, are formed in space sections 4. A cushioning material 5 is laminated on the rear of the base material 1, the thickness of the elastic bodies 3 is made thinner than that of the cushioning material, and the surface material 2 is made thinner than the base material 1. Accordingly, an impact received by the surface material 2 is absorbed, and the surface material 2 is difficult to be sunk owing to the thin elastic bodies 3, and the overall thickness of the floor material can be thinned comparatively.