baber/WOPTO huggingface dataset:
Patent TW-376394-B (TW)
Title: Polystannoxane salts of a strong organic acid, process for producing the same, curable polymeric coating composition comprising the same, and their uses
Inventor: SESHADRI SRI R
IPC: C08K5/57
Filed: 1998-06-24
Granted: 1999-12-11
Abstract: Dual cure organotin salts of strong organic acids, the use of such salts as catalysts and an improved process for producing the catalysts are provided. The catalysts are capable of effectively catalyzing esterification and transesterification reactions and urethane, silicone, melamine, ester and acrylic forming reactions and can simultaneously catalyze more than one reaction in a mixture of urethane, silicone, amino, ester and acrylic polymer forming reactants to produce a polymer mixture.
Patent TW-529912-B (TW)
Title: Satiety product
Inventor: HERSLOF BENGT
IPC: A23L33/20
Filed: 1998-07-07
Granted: 2003-05-01
Abstract: A food composition giving a rapid and improved feeling of satiety, comprising a mixture or an oil-in-water emulsion of triglycerides with a lecithin or a galactolipid based emulsifier. The invention also refers to me use of said mixture or oil-in-water emulsion for the preparation of a pharmaceutical composition for the control of calorie or fat intake.
Patent TW-431993-B (TW)
Title: Tongue lid pack, its blank and manufacturing method thereof
Inventor: TAMBO HITOSHI
IPC: B65D85/10
Filed: 1998-07-23
Granted: 2001-05-01
Abstract: A tongue lid pack comprises a body containing a packing article of filter cigarettes, and a cutting line is formed on the front wall of the body. A tongue lid is hingedly connected to the opening end of the body, and the tongue lid has a lid portion for closing and opening the opening end and a tongue extending from the lid portion and a bent tip. When the tongue lid is closed, the bent tip of the tongue is inserted through the cutting line of the front wall. Also, a blank for the tongue lid pack and a method for folding the blank are disclosed.
Patent TW-444293-B (TW)
Title: Nondestructive optical method for monitoring the situation of etching chamber
Inventor: LI SHR-CHEN
IPC: H01L21/3065
Filed: 1998-10-30
Granted: 2001-07-01
Abstract: The present invention discloses a kind of optical method that can nondestructively in-situ monitor plasma etching reaction chamber when using RF power source to fabricate semiconductor device. The steps include the followings: (a) at least one kind of plasma gas is selected as the probe of plasma etching reaction chamber that is just completed with the clean process, in which the plasma gas can display the specific spectrum intensity at a set wavelength and its spectrum intensity can be increased or decreased by following the RF time. (b) The spectrum intensity of the plasma gas is measured at a set wavelength. (c) The measured spectrum intensity is directly or indirectly plotted for the RF time. A pair of conjugate plasma gases, whose spectrum intensities have opposite reactions as following the increase of RF time, can be selected as the plasma gas. Or, a kind of ordinary plasma gas, which can generate opposite relationship with the RF time at two different wavelengths, is selected.
Patent TW-400656-B (TW)
Title: The structure of epitaxial type high power Schottky diode and the manufacture method thereof
Inventor: LIAU CHUNG-WEI
IPC: H01L29/872
Filed: 1998-11-06
Granted: 2000-08-01
Abstract: A kind of structure of epitaxial type high power Schottky diode and the manufacture method thereof. First, to provide a N<+> substrate, and to form a P<-> epitaxy and a first oxide on the N<+> substrate in order. Next, to etch part of the first oxide, it forms an opening on the P<-> epitaxy. Then, it forms a N<-> well under the opening and in the P<-> epitaxy, and the bottom of the N<-> well contacts the N<+> substrate. Next, it forms a metal silicide layer on part of the N<-> well, such that the N<-> well electrically contacts the metal silicide layer. Then, it forms a first metal layer on the metal silicide layer and part of the first oxide, and the first metal layer electrically contacts the metal silicide layer. Next, it forms a second metal layer under the N<+> substrate. The characteristic of this invention is that the process uses 2 less masks than conventional process, which could reduce the complexity of process and save the cost.
Patent TW-446916-B (TW)
Title: Computer instruction which generates multiple results of different data types to improve software emulation
Inventor: TRISSEL DAVID WESLEY
IPC: G06F9/318
Filed: 1998-11-06
Granted: 2001-07-21
Abstract: Accelerating software emulation and other data processing operations utilizes execution of a single computer instruction that produces multiple data type results from a single source. The instruction generates from a single operand a plurality of different types of outputs in a corresponding plurality of registers (102-106) which are available for use as input operands to subsequently executing instructions.
Patent TW-407445-B (TW)
Title: Process for preparing printed-circuit board
Inventor: BANDO RYOTA
IPC: G03F7/027
Filed: 1998-11-09
Granted: 2000-10-01
Abstract: A process for preparing a printed-circuit board, which process comprises coating a liquid photosensitive resist onto a copper-clad insulative laminate at least partly having a copper pattern for use in a printed-circuit according to an electrodeposition coating method by use of an electrodeposition coating apparatus, said liquid photosensitive resist having an apparent viscosity in the range of 0.01 Pa.sec to 1 (one) Pa.sec, a structural viscosity index R in the rang of 1.2 to 8, and preferably a volume resistivity in the range of 1.3 M<OMEGA>.cm to 150 M<OMEGA>.cm.
Patent TW-413820-B (TW)
Title: Access control method for memory with limited erasure frequency
Inventor: MULLER OTTO
IPC: G06F12/02
Filed: 1999-01-26
Granted: 2000-12-01
Abstract: The invention relates to an access control method in a computer, which has an erasure frequently limited by blocks. The memory has a memory block (NB0) (NB1) for user's access. The method utilizes an address conversion, in which the address conversion is achieved by an index table (AZTO) containing the data concerning erasure utility category, (LNO) - (LN1023) pertaining to each of the address index. The utility category will increase when a predefined erasure state criteria is reached. Then another erasure utility category in index table (AZTO) is kept searching until the lower erasure of operation class value is found. The related address index (AP0) - (AP1023) and the address index (AP1) in the initial index location are exchanged. When no further lower erasure utility category is found, the search task is terminated.
Patent TW-417263-B (TW)
Title: Packaging structure, liquid crystal device of semiconductor device and electronic machine
Inventor: UCHIYAMA KENJI
IPC: G02F1/13
Filed: 1999-02-22
Granted: 2001-01-01
Abstract: The present invention is a packaging structure, liquid crystal device of semiconductor device and electronic machine that the subject is to use bonding agent such as ACF for semiconductor in the packaging structure carrying in the substrate to prevent the residual stress caused by bonding agent and enhance the connection reliability between electrode terminals. The method is to comprise the semiconductor chip 6 with a plurality of raised electrodes 16, and the circuit substrate 3 of packaging structure comprising a plurality of output wiring 11 and input terminals 12. The ACF 4 is applied with pressing process and the land portion of raised electrode 16 and output wiring 11 are conductively connected the semiconductor chip 6 and circuit substrate 3. The area surrounded by the land portion of wiring 11 and terminal 12 in the circuit substrate 3 is separately allocated with a plurality of through holes 10. During the pressing process, the excessive ACF 4 is escaped from the through holes 10 and the generation of large internal stress in ACF 4 could be prevented. Therefore, the invention can enhance the connection reliability relating to IC 6.
Patent TW-404907-B (TW)
Title: Rotary handgrip for bicycle control
Inventor: JANG LIN-YUAN
IPC: B62K23/04
Filed: 1999-02-26
Granted: 2000-09-11
Abstract: A kind of rotary handgrip for bicycle control comprising: the cabinet fixed on the handgrip of bicycle having the first rotary guide and the rotating member of the second rotary guide in which the second rotary guide is rotatably configured in the first rotary guide; the first guide rail on the cabinet, having different locations for two ends of the first guide rail corresponding to the axial position of center line of the first guide; the second guide rail on the rotating member, the second guide is intersected with the first guide but not overlapped; the sliding mechanism, connecting to the end of cable, which is slidingly configured at the intersection of the first and the second guide so that the rotation of said rotating member can change the position of sliding mechanism in the first guide by the rotation of the second guide.
Patent TW-429668-B (TW)
Title: Control system for, in the presence of a varying system load, establishing generator current to maintain a particular battery charge state
Inventor: CHADY CHRISTINE MARIE
IPC: B60L11/18
Filed: 1999-04-29
Granted: 2001-04-11
Abstract: A controller for a hybrid electric system such as a hybrid electric vehicle includes a load, a battery, and a controllable source of auxiliary electricity. The state of charge (SOC) of the battery is estimated, and an error signal is generated which represents the difference between a desired and actual SOC. The SOC error signal is processed by at least integration, to produce a source signal representing the desired auxiliary source current. A second error signal is generated between the actual current from the auxiliary source and the desired current from the auxiliary source. The second error signal is processed, at least by integration, to produce a control signal for controlling the auxiliary signal source.
Patent TW-446583-B (TW)
Title: Method and apparatus for wafer edge scrubbing
Inventor: EMAMI RAMIN
IPC: G11B23/50
Filed: 1999-05-12
Granted: 2001-07-21
Abstract: An inventive brush and scrubbing device is provided for simultaneously scrubbing both planar and profiled (e.g., edge) surfaces of a thin disk such as a semiconductor wafer. The inventive brush has a contact surface having two portions, a planar portion for contacting a planar surface of a wafer, and a profiled portion for contacting an edge surface of a wafer. The profile of the profiled portion preferably follows the edge profile of a wafer to be cleaned by the brush. The profiled portion may have a higher modulus of elasticity than does the planar portion. Preferably the brushes are roller type PVA brushes having a plurality of nodules formed thereon.
Patent TW-429193-B (TW)
Title: Solder powder, flux, solder paste, soldering method, soldered circuit board and junction articles by soldering
Inventor: AMITA HITOSHI
IPC: C07C19/00
Filed: 1999-06-10
Granted: 2001-04-11
Abstract: The present invention provides solder power, flux, solder paste with excellent preservation stability and reflow properties, and a soldering method, junction method for circuit board and electrical parts in response to the change into fine pitch and diversification of parts, and junction articles. The particle size under 20 mu m in the powder is set to be less the 30% in particle number and less than 500 ppm in oxygen content. And the flux is constituted of organic constituents comprising organic acid ester, and ester decomposition catalyst, organic halide compound, reducing agent and pH modifier. Also, the water content of the solder paste containing said flux and solder powder is set to less than 0.5 wt%.
Patent TW-561192-B (TW)
Title: Post treatment process for electroplated tin or tin-lead alloy
Inventor: KANG YI-MING
IPC: C22C11/06
Filed: 1999-06-22
Granted: 2003-11-11
Abstract: A post treatment process for electroplated tin or tin-lead alloy at least comprises a step of soaking with a mixture solution of acid and salt and a baking step; thus, the tin or tin-lead plated layer can withstand a high temperature without yellowing or discoloring due to corrosion.
Patent TW-474933-B (TW)
Title: Muscarinic antagonists
Inventor: KOZLOWSKI JOSEPH A
IPC: A61K31/4427
Filed: 1999-06-28
Granted: 2002-02-01
Abstract: Heterocyclic derivatives of di-N-substituted piperazine or 1,4 di-substituted piperidine compounds in accordance with formula I (including all isomers, salts and solvates) wherein wherein one of Y and Z is -N- and the other is -N- or -CH-; X is -O-, -S-, -SO-, -SO2- or -CH2- Q is R is alkyl, cycloalkyl, optionally substituted aryl or heteroaryl; R1, R2 and R3 are H or alkyl; R4 is alkyl, cyclolalkyl or R5 is H, alkyl, -C(O)alkyl, arylcarbonyl, -SO2alkyl, aryl-sulfonyl -C(O)Oalkyl, aryloxycarbonyl, -C(O)NH-alkyl or aryl-aminocarbonyl, wherein the aryl portion is optionally substituted; R6 is H or alkyl; and R7 is H, alkyl, hydroxyalkyl or alkoxyalkyl; are muscarinic antagonists useful for treating cognitive disorders such as Alzheimer`s disease. Pharmaceutical compositions and methods of treatment are also disclosed.
Patent TW-444238-B (TW)
Title: A method of making thin film
Inventor: MATSUDA TETSUO
IPC: H01L21/288
Filed: 1999-08-07
Granted: 2001-07-01
Abstract: This invention provides a high quality metal plating film having a large crystal grain size. The method comprises steps: forming a first continuous metal film on a substrate, forming a second discontinuous metal film on the first underlying film, and forming a third metal plating film on the substrate to be processed where first and second underlying parts are formed.
Patent TW-539725-B (TW)
Title: Preparation of organopolysiloxane emulsion
Inventor: HASEGAWA KOHEI
IPC: C08G77/22
Filed: 1999-08-18
Granted: 2003-07-01
Abstract: A stable organopolysiloxane emulsion is briefly prepared by emulsifying and dispersing a low molecular weight organopolysiloxane (A) in water in the presence of an organic sulfonic acid or organic sulfate anionic surfactant (B) to form an initial emulsion having a mean particle size of up to 300 nm, and effecting polymerization reaction, followed by neutralization.
Patent TW-I239261-B (TW)
Title: High-temperature stabile catalysts for decomposition N2O
Inventor: BAIER MICHAEL
IPC: B01J23/00
Filed: 1999-09-30
Granted: 2005-09-11
Abstract: A copper-containing catalyst of the decomposition of N2O contains a compound of the formula MxAl2O4, where M is Cu or a mixture of Cu and Zn and/or Mg and x is from 0.8 to 1.5. The novel catalyst is used in a process for the catalytic decomposition of pure N2O or N2O contained in gas mixtures, at elevated temperatures.
Patent TW-541291-B (TW)
Title: Semiconductor ceramic and device using the same
Inventor: NABIKA YASUHIRO
IPC: C04B35/46
Filed: 1999-10-21
Granted: 2003-07-11
Abstract: A semiconductor ceramic composed of barium titanate, lead titanate, strontium titanate, and calcium titanate as primary components, includes samarium oxide as a semiconductor-forming agent in the primary components, and the average diameter of crystalline particles of the semiconductor ceramic is 7 to 12 mum. The semiconductor ceramic has a resistivity at room temperature not greater than 3.5 Omega x cm, a withstand voltage not less than 50 V/mm, and a resistance-temperature coefficient alpha 10-100 not less than 9%/DEG C, and also has a less variability of resistance.
Patent TW-413643-B (TW)
Title: Shape fitting toy
Inventor: YAMAZAKI TOMOHIRO
IPC: G09B1/32
Filed: 1999-11-24
Granted: 2000-12-01
Abstract: A shape fitting toy comprising: a plurality of blocks having different types of shapes from each other, and a block selection part having a plurality of block passing holes each of which has a shape corresponding to one of the blocks having a plurality of different shapes and can pass only a corresponding one of the blocks. Each of the different types of shapes of the blocks is selected from a group consisting of a sphere and various types of regular polyhedrons.
Patent TW-439260-B (TW)
Title: Semiconductor device including logic circuit and memory circuit
Inventor: SHINMORI MASAHIRO
IPC: H01L21/8247
Filed: 1999-12-07
Granted: 2001-06-07
Abstract: The semiconductor device with its primary bit line and secondary bit lines, according to the present invention, is capable of being accessed at a high speed. In this semiconductor device, any one of a plurality of secondary bit lines is selectively connected to the primary bit line. The primary bit line 1 and secondary bit lines 3 are all formed on the same insulating film 26. A lined layer of wiring 15 for a memory cell selection word line 8 is formed on an insulating film 27.
Patent TW-522756-B (TW)
Title: Power supply circuit
Inventor: FURUHASHI NAOKI
IPC: H02M7/48
Filed: 1999-12-10
Granted: 2003-03-01
Abstract: Disclosed is a power supply circuit for boosting drive voltage by a booster circuit, inputting the boosted voltage to the primary side of a piezoelectric transformer, and driving a load with an impedance of large temperature dependency by output voltage generated at the secondary side of the piezoelectric transformer. The circuit has: an excessively-small current detection means that outputs excessively-small current signal when load current flowing through the load is smaller than a predetermined value; a stopping means that stops the operation of the booster circuit when the excessively-small current signal is output; and a delaying means that sets a delay time according to the level of the output voltage. The stopping means determines the execution or inexecution of the operation according to the existence of the excessively-small current signal when the delay time passes.
Patent TW-524724-B (TW)
Title: A method of regulating tension/compression in a multi-frame hot rolling mill, and a corresponding control system
Inventor: SCHWEDT JOSEPH
IPC: B21B37/48
Filed: 2000-01-11
Granted: 2003-03-21
Abstract: The value of the rolling torque is measured at each frame (11, 12, 1i, 1n) through which a metal product (B) passes, and the measurement is performed at the moment when said product reaches the following frame, at which point the frame at which the measurement is performed is switched over to torque regulation. The last frame reached by the product remains in speed regulation and it acts as a controlling frame for all other frames situated upstream therefrom so as to enable them to conserve torque equal to their respective reference torques by adapting their speeds. Once the reference torque measurements have been stored in the control system (2, 3), regulation is obtained by making use of a distribution key for the stresses between the frames.
Patent TW-565446-B (TW)
Title: A pharmaceutical composition for treating bulimia nervosa
Inventor: HOOPES SCOTT P
IPC: A61K31/7028
Filed: 2000-03-09
Granted: 2003-12-11
Abstract: Anticonvulasnt derivatives useful in treating bulimia nervosa are disclosed. A pharmaceutical composition for treating bulimia comprising, as an active ingredient, a therapeutically effective amount of a compound of the formula I, wherein X is CH2 or oxygen; R1 is hydrogen or C1-C4 alkyl; and R2, R3, R4 and R5 are independently hydrogen or C1-C3 alkyl and, when X is CH2, R4 and R5 may be alkene groups joined to form a benzene ring and, when X is oxygen, R2 and R3 and/or R4 and R5 together may be a methuylenedioxy group of the following formula (II), wherein R6 and R7 are the same or different and are hydrogen, C1-C3 alkyl or R6 and R7 together with the carbon to which they are attached are joined to form a cyclopentyl or cyclohexyl ring.
Patent TW-457398-B (TW)
Title: Photomask, method for producing TFT substrate, and method for producing display device
Inventor: YAMADA SHIGEYUKI
IPC: G03F1/68
Filed: 2000-03-01
Granted: 2001-10-01
Abstract: A photomask of the present invention is a photomask for use in production of a display device, the photomask having on its surface a plurality of drawn areas and a transitional portion between two adjacent ones of the drawn areas. A pattern is formed on at least one of the drawn areas. A ratio between a pattern pitch and a transitional portion pitch is an integral ratio such that a length defined by a least common multiple of the pattern pitch and the transitional portion pitch is 1 mm or less.
Patent TW-459192-B (TW)
Title: Electronic apparatus and electronic system provided with the same
Inventor: KISHIDA TAKESHI
IPC: H04N5/225
Filed: 2000-03-14
Granted: 2001-10-11
Abstract: A camera is detachably fitted to the rear end central part of the apparatus main body of a personal computer and is located between a pair of hinge parts. A lens is installed at the camera main body of the camera, and this camera main body is rotatable and is installed around an axial line of the camera main body, in which the axial line is substantially coaxial to the rotation axis of a display unit. When the camera main body is removed from the apparatus main body, the camera is connected to the equipment main body through an extending adapter and is located at a position away from the personal computer. The camera main body and the equipment body are provided with shutter buttons respectively.
Patent TW-430756-B (TW)
Title: Self-compensating spiral for a spiral balance-wheel in watchwork and process for treating this spiral
Inventor: BAUR JACQUES
IPC: G04B17/22
Filed: 2000-03-21
Granted: 2001-04-21
Abstract: This self-compensating spiral for a mechanical spiral balance-wheel oscillator in watchwork or other precision instrument, made of a paramagnetic alloy, contains at least one of the elements Nb, V, Ta, Ti, Zr, Hf and is covered with a substantially uniform oxide layer having a thickness greater than or equal to 20 nm, formed by subjecting the said spiral to an anodizing treatment.
Patent TW-445558-B (TW)
Title: Manufacturing method for cavity-down plastic ball grid array package substrate
Inventor: CHIEN CHIA-CHI
IPC: H01L21/48
Filed: 2000-04-14
Granted: 2001-07-11
Abstract: The present invention provides a manufacturing method for cavity-down plastic ball grid array package substrate that the package substrate is made by bonding a plastic substrate with a Cu heat spreader. The manufacturing method according to the present invention includes the following steps: first, preparing the plastic substrate and the Cu heat spreader; next, using a part of solidified liquid adhesive layer to bond the plastic substrate with the Cu heat spreader; the plastic substrate is sequentially produced until forming a solder mask and a cavity for the IC die; then, conducting a surface roughening process on a Cu wiring layer under the plastic substrate; the Cu heat spreader is first conducting a double-sided surface roughening process; then, printing a black ink layer on a side surface of the Cu heat spreader and also printing another black ink layer in a specific area on another side of surface; the specific area is used to allocate the IC die and the black ink layer in the specific area are configured with a plurality of heat spreading points; next, conducting another liquid adhesive printing and a part of solidifying process to form the portion of solidified liquid adhesive layer on the surface outside the specific area of the Cu heat spreader; then, pressing the plastic substrate and the Cu heat spreader under high temperature; finally, simultaneously forming a Ni/Au layer on a plurality of contacts and heat spreading points of the package substrate.