baber/WOPTO huggingface dataset:
Patent TW-535476-B (TW)
Title: Method of forming metallic pattern
Inventor: TSUSHIMA HIROSHI
IPC: G03F7/26
Filed: 2002-03-22
Granted: 2003-06-01
Abstract: A method of forming metallic patterns on a substrate comprising the steps of coating photosensitive resin composition on a substrate to form a photosensitive layer, said resin composition including a polysilane having average molecular weight over 10000 and being soluble in organic solvent, a photoradical generating agent, an oxidizing agent, a silane compound containing alkoxyl group and an organic solvent, selectively exposing said photosensitive layer to form a latent image of metallic pattern, absorbing a metal or metallic colloid having small standard electrode potential to the latent image portion by making said photosensitive layer contact the solution which contains a salt or colloid of metal of which the standard electrode potential is lower than the metal to be deposited on said latent image portion, and depositing a metallic film on said latent image portion, which has metal or metallic colloid of small standard electrode potential absorbed thereon, so as to form a metallic pattern by making said photosensitive layer contact non-electrolytic liquid.
Patent TW-I300077-B (TW)
Title: Melt polycarbonate with improved resistance to hydrolysis
Inventor: JAMES MASON
IPC: C08K5/49
Filed: 2002-03-25
Granted: 2008-08-21
Abstract: A molding composition containing melt polycarbonate conforming to a specific formula is disclosed. The composition that additionally contains a phosphorous compound is characterized in its improved resistance to hydrolysis.
Patent TW-583229-B (TW)
Title: Method and device of molding using degradable polymer protected with inert gas
Inventor: TZENG HOU
IPC: C08J5/00
Filed: 2002-03-25
Granted: 2004-04-11
Abstract: The present invention relates to a method and a device of molding using a degradable polymer protected with an inert gas. An inert gas, which is not reactive with the degradable polymer, is used to form a gas barrier during the molding process of the degradable polymer in order to increase the stability of the polymer. An injection molding process is used to mold the polymer, and an inert gas is used to protect the polymer at the feed region and the molten region in order to isolate the polymer from air.
Patent TW-577092-B (TW)
Title: Method of producing coil structures
Inventor: GUNDLACH HARALD
IPC: H01F41/04
Filed: 2002-03-26
Granted: 2004-02-21
Abstract: Mental strips (2) running parallel to one another are applied to the upper side of a flexible carrier material (1). The ends of the metal strips are closed to form coil-shaped conductor tracks and permanently connected. Rotary processing using fast-running rollers makes it possible for these coil structures to be produced at low cost in a high number of units.
Patent TW-I247450-B (TW)
Title: A low-profile slot antenna for vehicular communications and methods of making and designing same
Inventor: SIEVENPIPER DANIEL
IPC: H01Q1/42
Filed: 2002-03-26
Granted: 2006-01-11
Abstract: A crossed slot antenna, a method of fabricating same and a method of designing same. The antenna includes a cavity structure having conductive material on opposed surfaces thereof; and two slots in said conductive material, the slots having slightly different lengths and intersecting each other at or close to a 90 degree angle.
Patent TW-I228540-B (TW)
Title: Oil composition for very small amount oil supply type cutting and grinding operation
Inventor: YOKOTA HIDEO
IPC: C10M169/04
Filed: 2002-04-03
Granted: 2005-03-01
Abstract: An oil composition for very small amount oil supply type cutting and grinding operation according to the present invention comprises an ester as well as a sulfur compound and/or a phosphorus compound. When it is used in a cutting and grinding operation by means of very small amount oil supply, the operational efficiency, the tool service life and the handling property can be improved.
Patent TW-589819-B (TW)
Title: Adaptive, multimode rake receiver for dynamic search and multipath reception
Inventor: HEIDARI-BATENI GHOBAD
IPC: H04B1/711
Filed: 2002-05-22
Granted: 2004-06-01
Abstract: The present invention concerns a new type of rake receiver, namely, a multimode rake receiver, which may be included within either a mobile station or a base station, and which has dynamic pilot signal searching and multipath reception and combining capability, for CDMA, cdma2000, W-CDMA, or other mobile communication systems. The adaptive, multimode rake receiver includes a network interface, a plurality of adaptive multimode rake fingers, and a multimode processor. Each adaptive multimode rake finger and the multimode processor are responsive to first configuration information (a first mode signal) to configure for a path reception functional mode and are further responsive to second configuration information (a second mode signal) to configure for a searcher functional mode, providing the multimode rake receiver with acquisition, traffic, and idle modes. In the preferred embodiment, the multimode rake receiver is implemented using a new category of integrated circuitry for adaptive or reconfigurable computing, providing a plurality of heterogeneous computational elements coupled to an interconnection network, to form adaptive and reconfigurable multimode rake fingers and a multimode processor, for a plurality of different functional modes, including pilot signal searching and multipath reception and combination.
Patent TW-578053-B (TW)
Title: System and method for automatically processing a plurality of server states
Inventor: WU JENG-YI
IPC: H04L12/24
Filed: 2002-06-28
Granted: 2004-03-01
Abstract: The present invention provides a system and method for automatically processing a plurality of information platform states, such as sever, network device and database. Each server respectively has at least one state file. The state file records the states of the information platform. And the state is recorded in a unified format. The present invention receives the state files from information platforms through a single transmission protocol and analyzes the state file to determine whether there are situations that should send a notification to a receiver. The present invention then transmits a message to the receiver by sending an electronic message. The present invention also provides a unified interface for presenting information. The present invention reduces management complexity and cost, and increases the productivity.
Patent TW-578257-B (TW)
Title: Manufacturing method of plasma-nitridated titanium-base barrier layer
Inventor: WU WEN-FA
IPC: H01L21/76
Filed: 2002-07-04
Granted: 2004-03-01
Abstract: This invention provides a manufacturing method of a titanium-base diffusion barrier layer using plasma-nitridation to manufacture the barrier layer in integrated circuit production process so as to block diffusion damage of metal (copper, aluminum, tungsten and silver) during a metallization process. The invented method employs a chemical vapor deposition (CVD) method with reaction precursors containing at least TiCl4 and hydrogen in a CVD system to perform titanium-base metal film deposition. After the titanium-base metal film is deposited, the same chamber (or another chamber) of the system is used to perform a nitridation plasma surface treatment.
Patent TW-573341-B (TW)
Title: Locally increasing sidewall density by ion implantation
Inventor: APELGREN ERIC M
IPC: H01L23/52
Filed: 2002-07-08
Granted: 2004-01-21
Abstract: A method is provided, the method comprising forming a first conductive structure, and forming a first dielectric layer above the first conductive structure. The method also comprises forming a first opening in the first dielectric layer above at least a portion of the first conductive structure, the first opening having sidewalls, and densifying the sidewalls.
Patent TW-578183-B (TW)
Title: Shadow-mask holding device in organic electro-luminescent display manufacturing equipment
Inventor: BAE KYUNG-BIN
IPC: H05B33/10
Filed: 2002-08-08
Granted: 2004-03-01
Abstract: There is provided a shadow-mask holding device in organic electro-luminescent display manufacturing equipment, capable of enabling the control of increasing or decreasing the magnetic field intensity between a permanent magnet and a magnet, and capable of arbitrarily mounting and dismounting the shadow-mask on the shadow-mask clip. The structure of the shadow-mask holding device in organic electro-luminescent display manufacturing equipment is composed of a shadow-mask clip H and a shadow-mask placement stage T. The shadow-mask clip H arranged plural permanent magnets 35 spaced by a predetermined gap on the whole surface of a glass 45 connected to the metal-film shaped shadow-mask 1. The shadow-mask 1 is provided at the middle portion below the shadow-mask placement stage T and the shadow-mask clip H. Plural permanent magnets 85 are respectively arranged at positions corresponding to each permanent magnet 35 of the shadow-mask clip H and separated by a predetermined distance from the lower portion of the shadow-mask clip H. Plural electromagnets 81 are arranged on the circumference of the permanent magnets 85 and the lower portion close to the permanent magnets 85, thereby controlling the increasing or decreasing of the magnetic field intensity of the permanent magnets 85.
Patent TW-591815-B (TW)
Title: PEM fuel cell
Inventor: LEBAN MARZIO
IPC: H01M8/10
Filed: 2002-08-29
Granted: 2004-06-11
Abstract: The invention disclosed herein is directed toward a novel structural design for a PEM fuel cell, as well as a novel method of creating an anode and a cathode via a sputtering technique. This invention can be used with hydrogen or direct methanol fuel cells. The geometry, discussed more fully above, allows a design engineer to construct a compact fuel cell useful in portable devices requiring battery power. In addition to facilitating connecting multiple fuel cells together in a layer, the design of this invention allows for the creation of fuel cell stacks. The sputtering disclosed herein is comprised of sputtering thin film catalysts onto the surfaces of anodes [22, 24, 26] and cathodes [32, 34, 36]. In order for a high effective surface area for the fuel and oxidant and their respective reactions to be created, a porous catalyst could be used. In addition, the thickness of the catalysts can be chosen in such a way as to support electron conduction and, therefore, to allow the catalyst and the surface upon which it was sputtered to act as an anode and a cathode.
Patent TW-542707-B (TW)
Title: Colposcope puncture guidance needle and sleeve thereof
Inventor: SHIU JAU-SUNG
IPC: A61B17/34
Filed: 2002-09-27
Granted: 2003-07-21
Abstract: A colposcope puncture guidance needle and a sleeve thereof comprise a guidance needle, a protective rod, and a sleeve; the protective rod can be inserted into the guidance needle, and the guidance needle can be inserted into the sleeve; the front end of the guidance needle has a blade while the other end of the guidance needle corresponding to the blade has a transparent liquid storage chamber; the sleeve contains a longitudinal channel with a communication space existing between the sleeve and the channel; the two sides of the sleeve separately are installed with an opening in communication with the communication space for separately installing a valve; the front end of the sleeve is installed with a plurality of first holes in communication with the communication space.
Patent TW-561524-B (TW)
Title: Method of reducing the collapse of rework photoresist
Inventor: WU YUAN-HSUN
IPC: G03F7/42
Filed: 2002-10-24
Granted: 2003-11-11
Abstract: A method of reducing the collapse of a rework photoresist. First, a plasma containing oxygen is preformed to remove a collapsed photoresist with high aspect ratio patterns. Because the plasma containing oxygen would react with a bottom anti-reflection coating layer comprising SiOXNy, some acids are produced on the surface of the bottom anti-reflection coating layer, resulting the undercut pattern of a following rework photoresist. According to the present invention, an alkaline solution treatment is preformed on the anti-reflection coating layer. Finally, a rework photoresist with high aspect ratio patterns is formed on the anti-reflection coating layer without undercut.
Patent TW-I258821-B (TW)
Title: Laser apparatus, laser irradiation method, manufacturing method for semiconductor device, semiconductor device, production system for semiconductor device using the laser apparatus, and electronic equipment
Inventor: YAMAZAKI SHUNPEI
IPC: G03F1/00
Filed: 2002-10-30
Granted: 2006-07-21
Abstract: Provided are a laser apparatus of continuous oscillation that is capable of enhancing the efficiency of substrate processing, a laser irradiation method, and a manufacturing method for a semiconductor device using the laser apparatus. A portion of a semiconductor film that should be left on a substrate after patterning is grasped in accordance with a mask. Then, a portion to be scanned with a laser light is determined so that it is possible to crystallize at least the portion to be obtained through the patterning. Also, a beam spot is made to strike the portion to be scanned. As a result, the semiconductor film is partially crystallized. That is, with the present invention, the laser light is not scanned and irradiated onto the entire surface of a semiconductor film but is scanned so that at least an indispensable portion is crystallized. With the construction described above, it becomes possible to save a time taken to irradiate the laser light onto a portion that will be removed through the patterning after the crystallization of the semiconductor film.
Patent TW-I231576-B (TW)
Title: Molding device and system of lead frame
Inventor: WANG WEI-CHIH
IPC: H01L23/02
Filed: 2002-12-30
Granted: 2005-04-21
Abstract: A molding device of a lead frame is used for encapsulating a semiconductor package with molding compound, and the semiconductor package has a lead frame defining a molding area and having a through opening which extends from the inside of the molding area to the outside thereof. The molding device comprises a cavity, a runner, and a control pin. The cavity is corresponding to the molding area. The runner abuts the through opening for injecting the molding compound. The control pin is disposed at the runner and movable relating to the lead frame such that the injection velocity of the molding compound is controlled.
Patent TW-580614-B (TW)
Title: System for sequencing CNC machine controller
Inventor: TARNG AN-GWO
IPC: G05B19/4093
Filed: 2003-01-14
Granted: 2004-03-21
Abstract: A number of computer-numerical control (CNC) machine controllers are associated in the same plant or facility or in related facilities. Each CNC machine controller gathers and stores manufacturing information related to the state of operations being performed into an application program by sequence of the operator's choice. The sequence of the operation can be operated with a continuation operation as a whole and as a set, or can be operated by skip to another by choice. Simplified the complexity of manufacturing by operation is reached.
Patent TW-I241000-B (TW)
Title: Semiconductor package and fabricating method thereof
Inventor: HUANG CHIEN-PING
IPC: H01L21/48
Filed: 2003-01-21
Granted: 2005-10-01
Abstract: A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. Then, a first copper layer and a second copper layer are in turn deposited on the dielectric material layer and solder materials, and the first and second copper layers are patterned to form a plurality of conductive traces, each of the conductive traces having a terminal coated with a metal layer (such as silver, nickel/gold alloy, etc). Thereafter, at least a chip is mounted on the conductive traces and electrically connected to the terminals by conductive elements such as bonding wires. Finally, an encapsulant is formed and encapsulates the chip, conductive elements, and conductive traces, allowing the dielectric material layer and solder materials to be exposed to outside of the encapsulant by which the exposed solder materials serve as input/output ports of the semiconductor package. This package structure can flexibility arrange the conductive traces and effectively shorten the bonding wires connected to the terminals of the conductive traces, thereby improving routability and quality of electrical connection for the semiconductor package.
Patent TW-I269325-B (TW)
Title: Laminated electronic component
Inventor: YOSHII AKITOSHI
IPC: H02B1/00
Filed: 2003-03-07
Granted: 2006-12-21
Abstract: The laminated electronic component 1 of the invention at least contains the followings: the dielectric portion 2 composed of dielectric material; and a pair of the first external electrode 31 and the second external electrode 32, which are respectively disposed at the dielectric portion 2 in a close contact state such that they are disposed opposite to each other with the dielectric portion 2 sandwiched in between. The dielectric portion 2 contains the laminated dielectric layers 21a-21f and more than two internal electrodes 23a-23e, which are one by one disposed between the adjacent layers among the dielectric layers 21a-21f and are electrically connected to one of the first external electrode 31 and the second external electrode 32. At least one of the internal electrodes 23a-23e is electrically connected to the first external electrode 31; and at least one of the internal electrodes 23a-23e is electrically connected to the second external electrode 32. The first external electrode 31 and the second external electrode 32 comprise: the resin electrode layers 31a and 32a, which are composed of the conductive resin where the thermally hardened resin and the conductive particles are the main composition, the metal electrode layer 31b, which is disposed between the resin electrode layer 31a and the dielectric portion 2, and the metal electrode layer 32b, which is disposed between the resin electrode layer 32a and the dielectric portion 2. The constituent rate of the conductive particles in the resin electrode layer is 70 to 75 mass%. The average length in the longitudinal direction contained in the conductive particles is 30 to 70 mum. The pin-shaped particles 71 having the aspect ratio 1.5 to 3.3 are the main composition.
Patent TW-I268449-B (TW)
Title: Method, apparatus, system, and related machine-readable medium for microcode patch authentication
Inventor: SUTTON JAMES A
IPC: G06K19/00
Filed: 2003-04-11
Granted: 2006-12-11
Abstract: Microcode patches are encoded before delivery to a target processor that is to install the microcode patches. The target processor validates the microcode patches before installation. The security of the process may be enhanced by one or more of: (1) performing the validation in a secure memory, (2) using a public/private key pair for encryption and decryption of the microcode patch, (3) using at least one key that is embedded in the target processor and that cannot be read by non-secure software, and (4) using a hash value that is embedded in the target processor to validate at least one non-embedded key.
Patent TW-I267645-B (TW)
Title: Electrical measurement method for printed circuit board
Inventor: SU SUNG-LENG
IPC: G01R31/02
Filed: 2003-05-20
Granted: 2006-12-01
Abstract: The present invention is an electrical measurement method for printed circuit board. The method is realized by a dedicated tester made of conductive rubber and printed circuit board with a special shape, so as to eliminate the disadvantage that the open-short circuit electrical testing method of printed circuit board in the prior art cannot be applied in fine circuits with high resolution.
Patent TW-I225382-B (TW)
Title: Hole punching device for flexible PCB
Inventor: CHOU CHIN-TE
IPC: H05K3/00
Filed: 2003-06-09
Granted: 2004-12-11
Abstract: A flexible PCB used hole punching device is composed by a machine (10), a first press to fasten unit (20), A second press to fasten unit (30), a hole-punching unit (40), a material supply unit (50), a material output unit (60) and a circuit control box. A hole-punching pin that can operate upwardly and downwardly is installed in the hole-punching unit (40). When the flexible PCB is input the hole punching unit (40), the hole-punching pin downwardly operates to make a through-hole at the defined position of the flexible PCB and to match the requirement of the following electrical circuit formation step. The serious shortcomings, such as process shift and material shrinkage of the conventional flexible PCB that result in the holes of the finished goods cannot accurately coincide the required location of the layout loop are entirely avoided.
Patent TW-I221621-B (TW)
Title: Solid electrolytic capacitor and a production method therefor
Inventor: KOBAYASHI MASAAKI
IPC: H01G9/08
Filed: 2003-06-18
Granted: 2004-10-01
Abstract: The purpose of the present invention is to provide a solid electrolytic capacitor capable of reducing inductance, especially ESR and ESL, and a production method therefor. A cathode electrode (14) is provided on a surface-roughened aluminum foil substrate (2). One ends of aluminum foil substrates (3a, 3b) are respectively joined to the opposite ends of the surface-roughened aluminum foil substrate (2), so as to electrically connect valve metals together. One ends of conductive metal substrates (15a, 15b) fabricated in advance in a lead frame are respectively joined to the other ends of not-surface-roughened valve metal foil substrates (3a, 3b) so as to establish an electric connection, thereby constituting an anode lead electrode. A cathode lead electrode (15c) is led out from a conductor layer (cathode electrode (14)) formed on the surface-roughened aluminum foil substrate (2) in a direction perpendicular to the main plane of the aluminum foil substrate (2).
Patent TW-I233681-B (TW)
Title: Method for manufacturing wafer lever chip scale package and structure from the same
Inventor: CHENG SHR-JIE
IPC: H01L23/48
Filed: 2003-06-26
Granted: 2005-06-01
Abstract: A method for manufacturing wafer lever chip scale package is disclosed. A metal layer is formed on an active surface of a chip. A photo-resist covers on the metal layer. The photo-resist forms a plurality of line exposure areas and block exposure areas. An etching-resistant metal layer is formed at the line exposure areas and block exposure areas. Then, etching the metal layer but keep the part of the metal layer that under the etching-resistant metal layer to form a plurality of redistribution traces and a plurality of bump-connecting pads. Then, a strengthening compound is formed on the active surface of the chip. The strengthening compound seals the redistribution traces and the etching-resistant metal layer, meanwhile, the strengthening compound supports the bottom of the bumps for providing the protection of the redistribution traces and surrounding supporting of the bumps.
Patent TW-I254900-B (TW)
Title: Liquid crystal driving device
Inventor: PARK JUNG-KOOK
IPC: G09G3/20
Filed: 2003-07-15
Granted: 2006-05-11
Abstract: Disclosed is an impulsive type liquid crystal driving device which inserts black data during a vertical blanking interval and then realizes motion picture, comprising: a liquid crystal panel for including a plurality of gate bus lines, which are arranged in one-direction, and a plurality of data bus lines which are arranged in a direction perpendicular to the plurality of gate bus lines; a gate driver section for sequentially scanning the plurality of gate bus lines during an active address interval in response to a second vertical starting signal, a vertical clock signal and an output enable signal, and scanning the plurality of gate bus lines during a vertical blanking interval in a unit of a predetermined number of lines; and a current boosting section for increasing current amount supplied to the gate bus lines during the vertical blanking interval in response to a pulse width modulation signal.