baber/WOPTO huggingface dataset:
Patent JP-5332911-B2 (JP)
IPC: B41J2/175
Filed: 2009-05-29
Granted: 2013-11-06
Abstract: <P>PROBLEM TO BE SOLVED: To provide an inkjet recording device capable of improving design flexibility of ink supply pipes, holding air within the ink supply pipe by a simple structure without adding large change in a configuration to the inkjet recording device, alleviating fluctuation of ink supply pressure by the held air and improving discharge stability.  <P>SOLUTION: The inkjet recording device includes: an inkjet head for discharging ink within a pressure chamber; an ink supply passage for supplying ink from an ink supply source to the pressure chamber of the inkjet head; and an air holding member inserted to inside of the ink supply pipe in the state enabling communication of the ink and holding air in at least part of a space formed between the air holding member and the inner face of the ink supply pipe. The ink supply passage includes: the first ink supply pipe to which the air holding member is inserted; and the second ink supply pipe which is constituted of a member separated from that of the first ink supply pipe and to which the air holding member is not inserted.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-5369910-B2 (JP)
IPC: A63F7/02
Filed: 2009-06-08
Granted: 2013-12-18
Abstract: <P>PROBLEM TO BE SOLVED: To enhance a player's eagerness for the play by making the player sufficiently feel a sense of participation in the change of the content of operation of a game machine.  <P>SOLUTION: In the game machine 1, a password can be acquired when the play is in a ready-to-win state. When the password is input by the player, the content of the presentation in the game machine 1 is changed accordingly. In the game machine 1, images on the game presentation are displayed in a special symbol display device 23, and information on the password is displayed in an outside display device 150. When the information on the password is displayed, information on the outside display device 150 is displayed in the special symbol display device 23.  <P>COPYRIGHT: (C)2010,JPO&INPIT
Patent JP-5320197-B2 (JP)
IPC: D01F8/06
Filed: 2009-07-17
Granted: 2013-10-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide a crimping composite fiber and a fibrous mass having high bulkiness recovery in repeated compression, and containing a polyolefin polymer in both of a core component and a sheath component.  <P>SOLUTION: The composite fiber 10 comprises a first component 1 and a second component 2, wherein the first component 1 comprises polybutene-1 and the second component 2 comprises either a polyolefin polymer having a melting peak temperature higher by ≥20°C than that of the polybutene-1 or a polyolefin polymer having a melting initiation temperature of ≥120°C, and an olefinic thermoplastic elastomer. The content of the olefinic thermoplastic elastomer in the second component 2 is 3-25 mass%, the first component 1 accounts for at least 20% of the surface of the composite fiber 10 in a fiber cross-section, the gravity center position 3 of the second component 2 is apart from the gravity center position 4 of the composite fiber 10, and the composite fiber 10 is actually crimped or potentially crimped.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-5290899-B2 (JP)
IPC: G01R15/18
Filed: 2009-07-21
Granted: 2013-09-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide a current sensor which enables a reduction of manufacturing cost.  <P>SOLUTION: The current sensor includes a plurality of first air-core coils 2(2a) which are prepared by winding a first conductor clockwise around a first winding core and also by winding a second conductor counterclockwise around the first conductor, and second air-core coils 3(3a) which are prepared in the same number as the air-core coils 2(2a) by winding a third conductor counterclockwise around a second winding core and also by winding a fourth conductor clockwise around the third conductor. The air-core coils 2(2a) and 3(3a) are arranged annularly so that one end part of each of the air-core coils 2(2a) and 3(3a) and the other end part of each of the air-core coils 3(3a) and 2(2a) adjacent to each of the air-core coils 2(2a) and 3(3a) are opposed to each other, and the first and fourth conductors are connected in series respectively so as to form a clockwise winding conductor line, while the second and third conductors are connected in series respectively so as to form a counterclockwise winding conductor line, and either of the end parts of both of the conductor lines is connected mutually.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-5311227-B2 (JP)
IPC: C08J5/20
Filed: 2009-08-05
Granted: 2013-10-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide an anion exchanger whereby metal impurities contained in an aqueous alkali solution thereof can be eliminated rapidly by a simple method, and to provide a method and a device for refining an alkali aqueous solution using the anion exchanger.  <P>SOLUTION: The method for refining an alkali aqueous solution includes a pre-treated anion exchanger having been prepared by a process of bringing an anion exchanger into contact with a high concentration alkaline which removes impurities contained in an anion exchanger by making into contact with a high concentration alkali treating liquid being not lower than 5.0 N, and a device 1 for refining an alkali aqueous solution using the anion exchanger 3, and a process of removing metal impurities in an alkali aqueous solution containing the metal impurities by using the anion exchanger.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-5367503-B2 (JP)
IPC: A61M25/09
Filed: 2009-08-19
Granted: 2013-12-11
Abstract: <P>PROBLEM TO BE SOLVED: To provide a manufacturing method or the like which is a technical subject as a suitable condition for improving the tensile strength characteristics of a core wire by paying attention to the temperature and tensile strength characteristics of the core wire to which high deformation wire drawing is executed, in a medical guide wire using a stainless steel wire for the core wire.  <P>SOLUTION: By using an austenitic stainless steel wire to which solid solution treatment is executed for the core wire, performing the wire drawing work of strong deformation with the total area reduction rate of 90% to 97.6%, and repeatedly using low temperature heat treatment of a suitable condition for each mechanical work of the core wire, and by taking into consideration the low temperature heat treatment after twisting work, the heat utilization of resin film formation to the core wire and the heat conductivity of the core wire, etc., the mechanical strength characteristics of the core wire are improved.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-5333047-B2 (JP)
IPC: G03G21/00
Filed: 2009-08-24
Granted: 2013-11-06
Abstract: An optical writing device includes a light source that emits multiple laser beams; a separating unit that separates each of the multiple laser beams into a monitor beam and a scanning beam; a photoelectric converting element 218 that outputs a monitor voltage depending on a quantity of the monitor beam; a memory that stores an initial correction value for correcting a set common current; and a microcontroller that calculates a reference current, which is produced by correcting the common current updated on the basis of the monitor voltages with the initial correction values, obtains corrected currents by correcting the common current with the calculated correction values, controls each quantity of the laser beam on the basis of the corrected currents, and determines that the light source is degraded if a ratio of the corrected current to the reference current is larger than a predetermined threshold value.
Patent JP-5314544-B2 (JP)
IPC: B29C35/02
Filed: 2009-09-10
Granted: 2013-10-16
Abstract: <P>PROBLEM TO BE SOLVED: To provide a tire mold which highly precisely adjusts a slit width, changes a type of the slit as required, and suppresses the decrease in the slit width by repeating a vulcanization molding.  <P>SOLUTION: The tire mold is composed of a plurality of pieces 6 circumferentially arranging an annular molding surface 1a forming a tread surface of the tire. In the tire mold, the slit S open to the molding surface 1a is provided by a shim 11 sandwiched between adjacent pieces 6, a discharge groove 10 communicating with the back surface 6 on the adjacent surfaces 6a of the pieces 6 is provided away from the molding surface 1a, the discharge groove 10 is partially opened to the slit S while covering the discharge groove 10 with the shim 11 to form an discharge passage of the air communicating from the slit S to the discharge groove 10.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-4723023-B2 (JP)
IPC: H04N11/04
Filed: 2009-12-14
Granted: 2011-07-13
Abstract: Adjacent regions are identified in an image. Coding parameters for the adjacent regions are identified. Selective filtering is performed at the region between the identified adjacent regions based on the identified coding parameters.
Patent JP-5325765-B2 (JP)
IPC: G06T1/00
Filed: 2009-12-28
Granted: 2013-10-23
Abstract: Disclosed is a road-shoulder detecting device including a distance-information calculating portion for calculating the presence of a physical object and the distance from the subject vehicle to the object from input three-dimensional image information relating to an environment around the vehicle, a vehicular road surface detecting portion for detecting a vehicular road surface with the subject vehicle from a distance image, a height difference calculating portion for measuring height difference between the detected vehicular road and an off-road region, and a road shoulder decision portion for deciding height difference as to whether the road shoulder is boundary between the surface and the region in a case where there is an off-road region lower than the vehicular road surface.
Patent JP-5006378-B2 (JP)
IPC: H01L21/28
Filed: 2009-12-28
Granted: 2012-08-22
Abstract: The object to provide a semiconductor device comprising a highly-integrated SGT-based CMOS inverter circuit is achieved by forming an inverter which comprises: a first transistor (148) including; an first island-shaped semiconductor layer (105a); a first gate insulating film (124a); a gate electrode (125); a first first-conductive-type high-concentration semiconductor layer (121) arranged above the first island-shaped semiconductor layer (105a); and a second first-conductive-type high-concentration semiconductor layer (120) arranged below the first island-shaped semiconductor layer (105a), and a second transistor (149) including; a second gate insulating film (124b) surrounding a part of the periphery of the gate electrode (125); a second semiconductor layer (103A) in contact with a part of the periphery of the second gate insulating film (124A); a first second-conductive-type high-concentration semiconductor layer (117) arranged above the second semiconductor layer (103A); and a second second-conductive-type high-concentration semiconductor layer (118) arranged below the second semiconductor layer (103A).
Patent JP-4897873-B2 (JP)
IPC: H03K7/08
Filed: 2007-03-27
Granted: 2012-03-14
Abstract: A digital signal converter (CNV) converts a digital input signal (PCM) into a pulse width modulated signal (PWM), which is a binary signal that comprises pulses of varying width. The digital signal converter can operate in a signal mode and a transition mode. In the transition mode, the digital converter provides the pulse width modulated signal (PWM) by applying an anti-transient noise shaping function (NSH2) to a direct current modification signal (SC). In the signal mode, the digital signal converter provides the pulse width modulated signal by applying a signal noise shaping function (NSH1) to the digital input signal.
Patent JP-5324424-B2 (JP)
IPC: H04L69/40
Filed: 2007-04-10
Granted: 2013-10-23
Abstract: Systems and methods ensure that datagrams retain integrity in light of the problems associated with the internetworking protocol's use of datagram identifiers drawn from a first pool of datagram identifiers. The methods involve controlling the use of datagram identifiers to ensure that only certain identifiers are allowable. A second pool of datagram identifiers is created that is different from the first pool. A datagram identifier is drawn from the second pool and assigned to a datagram in a manner that the datagram identifier is controlled from being reused during the lifetime of the datagram. In alternative embodiments the number of available datagram identifiers is either increased through optional header fields, or reduced through tracking allowed datagram identifiers. A first host notifies a second host of an allowed identifier. The second host uses the allowed identifier as a datagram identifier.
Patent JP-5224070-B2 (JP)
IPC: B64F5/00
Filed: 2007-08-03
Granted: 2013-07-03
Abstract: A rib bay platform for use in an aircraft rib bay, is adjustable in length (for example it comprises two telescopically mounted sections. The platform comprises a first end configured for mounting on a stringer of the rib bay (for example by an interference fit), and a second end configured for mounting on another stringer of the rib bay (for example on feet mounted on ball-and-socket joints). A method of operating in an aircraft rib bay comprises the steps of providing a rib bay platform of adjustable length; adjusting the length of the platform; mounting the platform between the two stringers; whereby a person may then operate inside the aircraft rib bay while being supported on the platform.
Patent JP-5131280-B2 (JP)
IPC: F16K7/02
Filed: 2008-01-03
Granted: 2013-01-30
Abstract: The connector has a fixed axial end fitting (3) conformed such that an elastically deformable monoblock valve is maintained on the fitting. A slot of the valve has a molded proximal slit (9A) such that the slot is opened and closed when a closure (5a) is outside an axial duct (4) and laterally forced by a wall of the duct, respectively. A pierced distal slit (9B) allows communication between the proximal slit and a tubular space (6) when the slot is opened. The fitting traverses the distal slit and a part of the proximal slit when the closure is outside the duct, without penetrating slot.
Patent JP-5375630-B2 (JP)
IPC: H01L23/48
Filed: 2010-01-25
Granted: 2013-12-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a lead frame with a resin and a method for manufacturing the same capable of reducing the thickness of an LED element package and improving the light emitting efficiency of the LED element package, and to provide the LED element package and a method for manufacturing the same.  <P>SOLUTION: The lead frame 20 with a resin includes a die pad 21 for placing an LED element 11 and a wiring conductor 30 provided around the die pad 21. A reflecting resin 23 for reflecting light from the LED element 11 is formed around at least the die pad 21, and a support substrate 40 is formed on the rear surfaces of the die pad 21, the wiring conductor 30, and the reflecting resin 23. The die pad 21 and the wiring conductor 30 are formed by plating using a plating forming resist on the supporting substrate 40, and the reflecting resin 23 is formed of the plating forming resist.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-5379710-B2 (JP)
IPC: H05K3/00
Filed: 2010-01-29
Granted: 2013-12-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible printed circuit board with a reinforcing layer, capable of reliably reducing the occurrence of a gap of a second adhesive layer disposed on an edge of a first reinforcing layer to make a highly reliable flexible printed circuit board with a reinforcing layer.  <P>SOLUTION: The first reinforcing layer 4 is adhered via a first adhesive layer 3 under the flexible printed circuit board 2 so that a rear edge 8 of the first reinforcing layer 4 is included in the flexible printed circuit board 2 when projected in a thickness direction. A filling adhesive layer 7 is stacked under a flexible printed circuit board 1 exposed from the first reinforcing layer 4 to be adjacent to a rear edge 25 of the first adhesive layer 3 with a thickness t3 smaller than a total thickness T of the first adhesive layer 3 and the first reinforcing layer 4. A second reinforcing layer 6 is adhered via the filling adhesive layer 7 and a second adhesive layer 5 under the first reinforcing layer 4 and the flexible printed circuit board 2 exposed from the first reinforcing layer 4.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-5298040-B2 (JP)
IPC: B08B9/02
Filed: 2010-02-02
Granted: 2013-09-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a deposit recovery device which efficiently recovers deposits on the inside surface of a long and narrow pipe line which cannot be easily accessed by a person.  <P>SOLUTION: A recovery head of the recovery device for internal pipline deposits is provided with a deposit removal member whose diameter is increased/decreased by a conical cam, and a deposit guide member whose diameter is increased/decreased by a cylinder rod of an air cylinder. When the recovery head is entered into the pipeline, the deposit removal member and the deposit guide member are set smaller than the inner diameter of the pipeline. After the recovery head is entered into the pipeline, the deposit removal member and the deposit guide member are expanded and extended so as to be equal to the inner diameter of the pipeline, and then recovery work for the deposits inside the pipeline is performed; thereby the internal pipeline deposits are recovered efficiently.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-5299302-B2 (JP)
IPC: B60R22/12
Filed: 2010-02-04
Granted: 2013-09-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a buckle device which can stand a cylindrical member like a boot and facilitate connection work of a connector.  <P>SOLUTION: In the buckle device 10, an interference piece 24 of an anchor plate 12 passes through a slit hole 68 formed on a boot 62. When the boot 62 is displaced relative to the anchor plate 12, the interference piece 24 interferes with the inner peripheral portion of the slit hole 68 to regulate the displacement of the boot 62 and support the boot 62. Further, a connector support piece 26 extends from the interference piece 24 to the outer side of the boot 62 to mount a connector 92 to the connector support piece 26. Since the connector support piece 26, which is part of the anchor plate 12, has higher rigidity than the boot 62, the connector 92 is not easily displaced even when the pressing force is applied from a connector 104 to the connector 92 in connecting the connector 104 to the connector 92. Thus, the connector 104 can be reliably and easily connected to the connector 92.  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-5235919-B2 (JP)
IPC: B21B1/22
Filed: 2010-02-05
Granted: 2013-07-10
Abstract: The method involves initially punching circumferential side T-shaped contoured output plates (3) that are made from a metal strip with constant thickness, in an interlocked position. The output plates are guided with a pre-load (V) acting in a longitudinal direction by a roll stand (5). The output plates are individually and longitudinally aligned afterwards by the roll stand and rolled on the roll stand to form plates (6) with thickness areas that are different over the length (L1) of the plates.
Patent JP-5353747-B2 (JP)
IPC: G05B19/05
Filed: 2010-02-16
Granted: 2013-11-27
Abstract: <P>PROBLEM TO BE SOLVED: To create a control program from the same source code in a control program creation device attached with a standard library even if there does not exist a standard function used for a source code when the control program is created in the attached standard library.  <P>SOLUTION: This control program creation device attached with a standard library including a standard function is provided with: a means for creating a standard library sub-set constituted of only a standard function used for a source code; and a means for creating a standard library (complemented) by complementing the standard function which does not exist in the standard library with the standard library sub-set. The control program creation device create the control program from the source code and the standard library (complemented).  <P>COPYRIGHT: (C)2011,JPO&INPIT
Patent JP-5372839-B2 (JP)
IPC: H05B6/12
Filed: 2010-06-11
Granted: 2013-12-18
Abstract: <P>PROBLEM TO BE SOLVED: To provide an induction heating cooker capable of accurately detecting the temperature of the bottom of a pan and capable of preventing accumulation of dust within a field of view of an infrared sensor.  <P>SOLUTION: The induction heating cooker is provided with a top plate 2 for placing a pan 501 thereon; a heating coil 201 provided with a clearance below the top plate 2 for heating the pan; a cooling fan 401 for generating a cooling air 406; an infrared sensor 12 for receiving an infrared ray radiated from the pan; a resin case 16 which houses the infrared sensor 12 and has a window part 14 opened on a light-receiving surface side of the infrared sensor 12; a window material 15 provided on the window part 14 of the resin case 16 for sealing the resin case 16; and a wave guide 508 which is provided approximately perpendicular to the top plate 2 between the top plate 2 and the window material 15 and determines the field of view of the infrared sensor 12. The wave guide 508 has its lower end side contact the resin case 16, with an opening 510 formed at the contact point, facing the cooling air 406 blown from the cooling fan 401, and has its upper end side provided with a clearance from the top plate 2.  <P>COPYRIGHT: (C)2012,JPO&INPIT
Patent JP-5375765-B2 (JP)
IPC: G01B11/00
Filed: 2010-08-04
Granted: 2013-12-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide a mounting state inspection device for an electronic component, which can properly determine the quality of a distribution state of a resin part when an inspection object includes the resin part where a thermosetting adhesive is cured.  <P>SOLUTION: A mounting state inspection section 11 for inspecting a mounting state of a chip type electronic component includes: a second attaching state inspection section 11b for inspecting an attaching state; a second soldering state inspection section 11d for inspecting a state of a solder part which connects a terminal and an electrode of a substrate; and a resin part inspection section 11e for inspecting a distribution state around the chip type electronic component of the resin part formed to reinforce the solder part, and further executes the inspection by the second attaching state inspection section 11b and the resin part inspection section 11e when a thermosetting adhesive including solder particles is used as a bonding material for mounting.  <P>COPYRIGHT: (C)2012,JPO&INPIT
Patent JP-5263244-B2 (JP)
IPC: G09G3/20
Filed: 2010-09-09
Granted: 2013-08-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a stereoscopic display device capable of easily generating a high-definition and realistic stereoscopic image.  <P>SOLUTION: A stereoscopic display device 1 is configured by a plurality of regularly arranged scan module pixels (SM pixels) 2. The SM pixels 2 scan image information toward the front side the stereoscopic display device 1 by a beam of light. The image information displayed in each of display ranges 3 of the pixel information output by one of the SM pixels 2 represents a minimum unit constituting a three-dimensional image. The SM pixels 2 output different information for different angles at which the beam is emitted. Each of the SM pixels 2 can change the information according to the direction to which the beam is emitted, therefore, different image can be seen for the same pixel according to the direction from which the display device is seen. Moreover, by using the SM pixels 2, since only one piece of information of a light source in each of the pixels can be sent for one direction, a plurality of light sources do not overlap with each other within the pixel.  <P>COPYRIGHT: (C)2012,JPO&INPIT