baber/WOPTO huggingface dataset:
Patent JP-2000008787-A (JP)
Title: Tile work method and work instrument
Inventor: TAKAMURO KAZUTOSHI
IPC: E21D11/04
Filed: 1998-06-24
Abstract: PROBLEM TO BE SOLVED: To facilitate tile work by using one tile work frame applicable to various skeleton wall surfaces different in curvature. SOLUTION: Support members 2 are temporarily installed parallel with a specified space at the upper and lower parts of a skeleton wall surface 1. A flexible tile work frame 3 is fittingly inserted between the upper and lower support members 2, and a space between the upper and lower support members 2 is adjusted to adjust the tile work frame 3 to the curvature of the skeleton wall surface 1. In this state, the support members 2 are fixed to the skeleton wall surface 1, and tiles are worked in the specified position of the skeleton wall surface 1. After a bond layer 12 is hardened, the tile work frame 3 is removed together with the support members 2.
Patent JP-H0341299-A (JP)
Title: Device for stopping apparatus in earthquake
Inventor: YAMADA KATSUHIKO
IPC: G01P15/18
Filed: 1989-07-10
Abstract: PURPOSE:To prevent moving sections, their peripheral sections, and objects of work from malfunctioning and braking in a precision positioning device by acting to retract, stop, and fix the moving sections of the device in earthquake of specified earthquake intensity or more. CONSTITUTION:Relative movements caused by earthquake are detected as the acceleration in each direction of the X axis through Z axis by acceleration sensors (1X through 1Z)1, and the detected fine signals of the axes X through Z are amplified by amplifiers 2(2X through 2Z) respectively, and an earthquake sensing section 3 judges whether or not acceleration signals, to which amplified output is added, exceed the specified level, i.e., the specified earthquake intensity. Judging that actual earthquake intensity exceeds the specified earthquake intensi ty, the earthquake sensing section 3 outputs earthquake detecting signals. A device stop processing section 4 acts to retract, stop, and fix the moving section of the device based on the output signals. Thus, the moving section can be prevented from running into the objects of work, and as a result the moving section, its peripheral sections, and the objects of work can be prevented from malfunctioning and breaking.
Patent JP-2000006856-A (JP)
Title: Coupler with load measuring device
Inventor: OSADA WAKUO
IPC: B62D53/08
Filed: 1998-06-24
Abstract: PROBLEM TO BE SOLVED: To measure vertical load and longitudinal load accurately and easily by mounting a vertical load sensor in a sensor mounting hole formed on the center side of a coupler, and mounting a longitudinal load sensor in a sensor mounting hole formed on the outside of the coupler. SOLUTION: A coupler comprises a coupler base and a coupler bracket 3. The coupler base is supported by a pair of coupler brackets 3 fixed to a tractor. Sensor mounting holes are formed on both sides of the side face center lower part of each coupler bracket 3. A vertical load sensor 11 is embedded in the sensor mounting hole formed on the center side of the coupler, and a longitudinal load sensor 12 is embedded in the sensor mounting hole formed on the outside of the coupler. When the tractor turns, load applied in a horizontal direction becomes larger toward the outside of the coupler, so that the longitudinal load sensor 12 is embedded on the outside of the vertical load sensor 11 so as to positively measure load applied in a longitudinal direction.
Patent JP-H0464473-A (JP)
Title: Printing press with eraser
Inventor: TSUKAMOTO KATSUHIDE
IPC: B65H7/20
Filed: 1990-07-05
Abstract: PURPOSE:To prevent the wasteful use of forest resources by a method wherein an eraser for releasing a hot melt resin together with a toner is provided, and printing is made on erasable paper passing through this eraser by an electrophotographic method. CONSTITUTION:A hot melt resin 203 is heated on the peripheral surface of a heating roller 106 to be melted or softened. Printed erasable paper 201 is inserted from rightward and pressed up against the hot melt resin by a pressing roller 103. In this stage, a toner 202 on the erasable paper 201 adheres to the hot melt resin 203 on a cleaning sheet 104. The cleaning sheet 104 is fed toward a cooling roller 105 in this state and cooled, whereby the hot melt resin 203 is increased in internal cohesion and set. At the cooling roller 105, the hot melt resin 203 is separated from the erasable paper 201. At this time, the toner 202 on the erasable paper 201 is released therefrom, and the paper is fed out in unprinted states. This is used as new paper in a copying machine 102.
Patent JP-H0845649-A (JP)
Title: Heater element
Inventor: HOSOKAWA TATSUYA
IPC: H05B3/14
Filed: 1994-07-29
Abstract: PURPOSE:To allow a heater element to make serviceleven in the atmosphere and heat an object quickly by connecting a current feed terminal with a heater element consisting of a carbon fiber/carbon composite, and covering the whole area or part of the surface of the heater element with crystal glass. CONSTITUTION:A sheet-form heater element 1 is made of carbon fiber/carbon composite (C/C composite) and has a current feed path in a spiral plane pattern, wherein one of the heat emitting surfaces 1c of the heater element 1 is put in plane contacting condition on one of the surfaces 2a of a crystal glass plate 2 of the heater element 1. Current feed terminals 3a, 3b are inserted through terminal parts 1a, 1b of the heater element 1 and installed upright on the terminal parts 1a, 1b in connection therewith using washers 4a, 4b. The foremost parts of the glass plate 2 and terminals 3a, 3b are masked and set in a sealed chamber, and the surfaces of the other heat emitting surface 1d of the heater element 1. terminals 3a, 3b, and washers 4a, 4b are covered with crystal glass layer 5. Thereby the current feeding section area can be lessened to allow increase in the temp. rising speed so that the object is heated rapidly, and also the heater element can serve even in the atmosphere.
Patent JP-H1022660-A (JP)
Title: Structure of optical cable surplus length treatment apparatus
Inventor: YAMAZAKI YASUHISA
IPC: H05K7/00
Filed: 1996-07-08
Abstract: PROBLEM TO BE SOLVED: To prevent an optical cable from being broken, by installing pawl type legs retaining the surplus length of an optical cable wound around a column part around which the surplus length of the optical cable is wound in the form of circular arc, and reinforcing ribs turning to bench legs when a communication apparatus main body is mounted, and monolithically molding them. SOLUTION: A column part 3 around which surplus length 2 of an optical cable is wound in the form of circular arc, and four pawl type legs 4 which retain the surplus length 2 of the optical cable wound around the column part 3 in order that the surplus length 2 may not disperse are installed on the bottom surface of an optical cable treatment apparatus 1. Reinforcing ribs 5 (which act as a role of bench legs when a communication apparatus main body 6 is mounted on the treatment apparatus 1 and are monolithically molded) are installed in the treatment apparatus 1. Since the column part 3 installed on the bottom surface of the treatment apparatus 1 maintains a column shape even if the optical cable is strongly wound when the surplus length of the optical cable is treated, the optical cable is wound always drawing a circle, and retained by the pawl type legs 4.  Thereby the optical cable can be prevented from being broken.
Patent JP-H0846205-A (JP)
Title: Thin-film transistor and manufacture thereof
Inventor: ARAI MICHIO
IPC: H01L21/02
Filed: 1994-07-29
Abstract: PURPOSE:To provide a thin-film transistor having excellent characteristics, in which leakage current is reduced, by constituting the thin-film transistor so that stress applied when amorphous silicon is changed into polysilicon is not applied to an active layer. CONSTITUTION:In a thin-film transistor having an island formed onto a substrate 1, a first polycrystalline semiconductor layer 2 as a buffer formed on the substrate 1 side, a second polycrystalline semiconductor layer 4 as an active layer and an intermediate layer 3 shaped between these polycrystalline semiconductor layers are formed to the island, and a gate electrode 6 is formed while being oppositely faced to the second polycrystalline semiconductor layer 4. Stress is applied to the polycrystaline semiconductor layer 2 when an amorphous state is changed into a polycrystaline state, but the polycrystalline semiconductor layer 2 functions as a buffer, and the stress is not applied to the polycrystalline semiconductor layer 4 as the active layer, thus bringing the active layer to an excellent state, then reducing leakage current.
Patent JP-H0621898-A (JP)
Title: Distortion compnesation system for modulated optical signal
Inventor: WADA TETSUO
IPC: H04B10/07
Filed: 1992-07-06
Abstract: PURPOSE:To provide the distortion compensation system of a modulation optical signal in which the distortion of a modulated optical signal is eliminated concerning the circuit generating the modulation optical signal used for optical communication or the like. CONSTITUTION:A main signal optical modulation means 1 generating a modulated optical signal with a master signal is provided with an optoelectric conversion means 3 to detect a waveform of a modulated optical signal, provided with an error signal detection means 5 to detect an error signal between a main signal waveform and a detected modulation optical signal waveform, with an error signal optical modulation means 7 to generate an error signal light in response to the detected error signal and the distortion of the modulated optical signal is compensated by synthesizing the error signal light of the error signal optical modulation means 7 onto the modulation optical signal by the main signal optical modulation means 1.
Patent JP-H0343886-A (JP)
Title: Money receiving and paying device
Inventor: AYUGAI MASAMI
IPC: G07F19/00
Filed: 1989-07-12
Abstract: PURPOSE:To simplify the settling operation of money in hand to shorten the work time for power-on by discriminating whether the money in hand in a collective cassette may be changed or not and performing the processing to settle the money in hand independently of an operation command at the time of the change. CONSTITUTION:An attachment/detachment detecting means which detects attachment/ detachment of a collective storage box, a storage means 82b where the money in hand in the collective storage box is stored, and an auxiliary power source 87 which supplies power to the storage means 82b and the attachment/detachment detecting means 2 at the time of breaking a main power source 86 are provided. A money-in- hand settling means 80 is provided, and this means 80 settles the money in hand at the time of turning on the main power source if the collective storage box is not attached neither detached during the main power source break period, and the means 80 discriminates all coins in the collective storage box and settles the money in hand in the collective storage box through the loading operation to denomination-classified storage boxes if the collective storage box is attached or detached in the break period or the power supply period of the main power source 86. Thus, the money-in-hand settling processing is simplified to shorten the work time for power-on.
Patent JP-H0622843-A (JP)
Title: Electric heating cooker
Inventor: ONO ATSUO
IPC: A47J27/00
Filed: 1992-07-06
Abstract: PURPOSE:To appropriately select electric power supply, while looking at the cooked state, and to satisfactorily execute cooking by heating an inner vessel consisting of ceramic, providing a heating vessel provided with a heating element in the outside, and providing a means for controlling steplessly electric power supplied to the heating element. CONSTITUTION:When an adjusting knob is turned a little, a cam piece 5 and a cam piece 10 are adjusted together with a turning shaft 14, a movable armature 4a and an adjusting armature 9a are adjusted to a state of 4b and 9b and contacts 6, 7 and 11, 12 are closed. Accordingly, a heating element 1 and an auxiliary heating element 13 are heated, and the heating element 1 heats a heating vessel 17, and also, an inner vessel 16 consisting of ceramic, and moreover, the auxiliary heating element 13 is heated, therefore, a thermal sensitive element 3 consisting of a bimetal, etc., is heated and displaced to a state of 3b from 3a. In this case, the contents 11, 12 are opened, and the heating element 1 and the auxiliary heating element 13 are cooled, therefore, the thermal sensitive element 3 is cooled and displaced. Subsequently, when the thermal sensitive element 3 returns to 3a, the contact 12 connected to the contact 11, and thereafter, this operation is repeated.
Patent JP-S6238809-A (JP)
Title: Power plant by temperature difference
Inventor: ICHIKAWA JIRO
IPC: F01K25/00
Filed: 1985-08-13
Abstract: PURPOSE:To generate power in a simple and inexpensive manner by the effective use of heat source such as the sunlight or the like by taking out driving force of kinetic energy which is generated when fluid moves from a heat receiving part to a radiating part inside a circulating system. CONSTITUTION:An annular circulating system 1 is filled with fluid 2 and has both a heat receiving part 3 and a radiating part 4 at the opposed sides of said system, each of said parts 3 and 4 being surrounded by heat holding and insulating substance 5 and radiating substance 4, respectively. A starting power unit 7 is disposed in a route of the fluid 2 between the heat receiving part 3 and radiating part 4. Said unit 7 consists of both wheels 8 exposed to the fluid route and an output shaft 9 led out from the circulating system 1. The fluid 2 is heated and evaporated by the heat receiving part 3 and the resulting steam is cooled and liquefied by the radiating part 4. The liquid is then returned into the heat receiving part 3 along a capillary tube 12. The wheels 8 are at this time turned by the kinetic energy of the fluid 2 and the turning force is taken out from the circulating system 1 via the output shaft 9.
Patent JP-2001004952-A (JP)
Title: Optical deflector
Inventor: IZEKI TAKAYUKI
IPC: G02B26/08
Filed: 1999-06-24
Abstract: PROBLEM TO BE SOLVED: To make it possible to deflect light, such as a laser beam, at a high velocity and wide deflection angle. SOLUTION: This optical deflector 10A has a mirror diaphragm 12, which is integrally formed with a planar fixing plate part 12a fixed to a base board 11, a pair of leaf spring parts 12b and 12c which face each other from one end to the other end of this fixing plate part 12a and is bendable and displaceable, a pair of torsional spring parts 12d and 12e which are respectively extended toward between a pair of the leaf spring parts 12b and 12c from the front end sides of a pair of the leaf spring parts 12b and 12c and are torsionally displaceable and a mirror surface part 12 which is suspended to a pair of the torsional spring parts 12d and 12e and of which the surface is finished to a mirror finished surface and a pair of vibration drive sources 13 and 14,  which are mounted onto the base board 11 and vibrate the mirror surface part 12 of the mirror diaphragm 12 at the high velocity and the wide deflection angle.
Patent JP-2001007280-A (JP)
Title: Semiconductor device and mounting structure thereof
Inventor: IMAMURA YUKINAGA
IPC: H01L25/18
Filed: 1999-06-24
Abstract: PROBLEM TO BE SOLVED: To mount a package substrate which is vertical to a packaging substrate for mounting a semiconductor chip by equipping the package substrate with first and second main surfaces and a side end face that oppose each other with the semiconductor chip and a lead pin for electrical connection, extending in one direction and nearly in parallel with the main surface on the side end face. SOLUTION: Semiconductor chips 11 and 12 are arranged via a die pad 7 on the main surface at both the front and rear sides of a package substrate 13, where a lead pin 9 is arranged only on one side end face. The semiconductor chips 11 and 12 are connected to a package substrate pad provided on the package substrate 13 with wire 6. The package substrate pad is connected to an internal wiring 14, through the inside of the package substrate 13. Also the internal wiring 14 is connected to the lead pin 9 projecting from one side end face of the package substrate 13 to the outside. The semiconductor chips 11 and 12, the die pad 7, and the wire 6 are covered with mold 4 for covering the surface of the package substrate 13, thus packaging the semiconductor device two dimensionally for the packaging substrate with high density.
Patent JP-H0466449-A (JP)
Title: Paper detection mechanism
Inventor: MATSUDA TOMIYASU
IPC: B65H7/02
Filed: 1990-07-05
Abstract: PURPOSE:To obtain a stable paper detection mechanism having little malfunction and little failure by providing an electret possessing a specified potential and a potential sensor sensing the potential in the mutually opposite positions with a paper conveyance path inbetween, thereby eliminating movable parts. CONSTITUTION:A potential sensor 8 normally senses the potential of an electret E at a predetermined distance without shielding body. Then, when paper P conveyed along a conveyance path 6 intervenes between the electret E and the potential sensor 8, the potential sensor 8 senses a drop of the potential. Then, after the paper passes through, the shielding state by the paper P is cleared, the potential sensor 8 senses the return to the initial potential.
Patent JP-H0620933-A (JP)
Title: Manufacture of semiconductor device
Inventor: OKADA MAKOTO
IPC: H01L21/027
Filed: 1992-07-06
Abstract: PURPOSE:To remove an electron beam resist pattern without damaging a semiconductor substrate by exposing the resist to an electron beam through a conductive film, and removing the resist with developer. CONSTITUTION:A semiconductor substrate 1 is coated with an electron beam resist 2, exposed with an electron beam and developed to form an opening 2a to be exposed with the substrate 1. Then, after a conductive film 3 is formed on the substrate 1 and the resist 2 in the opening 2a, the film 3 on the resist 2 is irradiated with the beam through the film 3. The exposed part is removed with developer, the film 3 on the resist 2 is also removed, the film 3 formed on the substrate 1 in the opening 2a remains to obtain a desired film 3. Thus, the electron beam resist pattern can be removed without damaging the substrate of a ground.
Patent JP-H0715493-A (JP)
Title: Folded type portable telephone set
Inventor: SHIMAZAKI MAMORU
IPC: H04M1/72513
Filed: 1993-06-28
Abstract: PURPOSE:To prevent erroneous operation of a telephone set by switching either a talking holding state or a talking state without making key operation in the folding type portable telephone set. CONSTITUTION:In the folding type portable telephone set comprising a main body section 1 and an open/close enabling cover section 2, a reed switch 18 provided to the cover section 2, a magnet 19 provided to the main body 1, a detection circuit 27 for detecting the on/off state of the reed switch 18, and a means detecting the open/close state of the cover section 2 are constituted of the above mentioned and when the closing of the cover section 2 during talking is detected, the speech holding state is set. The speech holding state is switched by only closing the cover section 2 to prevent erroneous operation of the operation key 16 and on the other hand, key 16 is not exposed in the speech holding state and the operation of the operation key is prevented.
Patent JP-S6422198-A (JP)
Title: Large quantity condition change processing system for supervising system
Inventor: MITSUNAGA EIJI
IPC: G08B29/26
Filed: 1987-07-17
Abstract: PURPOSE:To shorten a processing time by making a condition change acceptance processing into only a condition change bit updating. CONSTITUTION:A large quantity condition change processing system has a condition change acceptance processing mean 14c and a decision processing means 14d. The condition change acceptance processing means 14c receives data 22, updates a condition change control table 24 having the condition change and present value for respective supervising objects and informs of the activation to the decision processing means 14d when it is not processing. After the information of the activation is received, the decision processing means 14d updates the condition change and the present value of all the supervising objects of a table 26 for the decision having the condition change, the present value and the previous value for the respective supervising objects by those of the condition change control table 24, and decides the condition change by the present value and the previous value after the updating.
Patent JP-S5875541-A (JP)
Title: Trocar needle
Inventor: HANSU RAIRANDERU
IPC: A61M27/00
Filed: 1982-10-13
Abstract: A surgical trocar comprising a flattened oblong unit having at the front end an angled sharpened cutting edge, and at the rear end a device for removably attaching a tube for drainage or other purposes. The trocar's cutting edge produces fissure-shaped skin incisions which heal more easily than circular wounds, and the trocar's flattened shape reduces the risk of slippage and attendant damages to the patient and/or surgeon's hand from such slippage.
Patent JP-H0341901-A (JP)
Title: Nonslip outsole and its manufacture
Inventor: MIZUNO AKIRA
IPC: A43D86/00
Filed: 1989-07-11
Abstract: PURPOSE:To improve the external force supporting force by providing leg parts of a pair of spikes adjacently to each other or allowing them to abut on each other. CONSTITUTION:A spike 37 is constituted of a spike seat 39 formed by blending annularly a hard wire rod and embedded in a shoe bottom 33, and a pair of leg parts 41 formed by allowing both end parts of the hard wire rod being roughly vertical to the spike seat 39 to abut on each other. The spike seats 39 of a pair of spikes 37 are embedded adjacently to each other, and its leg parts 41 are formed integrally by sticking them mutually with an adhesive agent, and thereafter, when the leg parts 41 are inserted into a fitting and inserting hole of an outsole forming die, and an outsole material consisting of thermoplastic elastomer, etc., is pressed against the inside of the outsole forming die and vulcanized, four pieces of leg parts 41 protrude to the outside from an outsole protruding parts 35 in a state that they are abutting on each other. According to such a constitution, four pieces of leg parts 41 support each other, and the external force supporting force of the spike 37 can be improved remarkably.
Patent JP-S6155517-A (JP)
Title: Composite device
Inventor: KIMURA AKIRA
IPC: F22B1/18
Filed: 1984-08-28
Abstract: PURPOSE:To contrive to increase the heat recovery by a method wherein a waste heat boiler is provided at the upstream side of an indirect heat exchanger. CONSTITUTION:After the heat recovery of an exhaust gas from a gas turbine 1 by a waste heat boiler 2, further, the heat recovery is contrived so that the temperature of the exhaust gas is lowered to approximate at mospheric temperature by the heat exchanging with a burning air required for a thermal decomposition furnace 3. Meantime, a preheated burning air is supplied into the thermal decomposition furnace 3. That is, the air is preheated by a high temperature exhaust gas of the gas turbine 1 after the heat recovery at the high temperature condition in the waste heat boiler 2 and preheated by one air preheater 15, then the preheated air is utilized as the burning air for the thermal decomposition furnace 3 in which a hydrocarbon 6 for raw material and a diluted steam 7 are mixed and pyrolytically decomposed. Thereby, the increasing of heat recovery canf be contrived without remodelling of conventional thermal decomposition furnace.
Patent JP-S6239227-A (JP)
Inventor: KUSAKAWA SEIHEI
IPC: B31B1/14
Filed: 1985-08-14
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。