baber/WOPTO huggingface dataset:
Patent JP-H066044-A (JP)
Title: Connection of land for connection use in multilayer printed wiring board
Inventor: KAWAKAMI SHIN
IPC: H05K3/40
Filed: 1992-06-17
Abstract: PURPOSE:To obtain a method of manufacturing a multilayer printed wiring board, which can connect lands for connection use to each other without adopting a through hole plating method. CONSTITUTION:While internal and external layer printed wiring boards 1, 4 and 6 are aligned with each other, they are laminated to each other to form a multilayer printed wiring board 15 and at the same time, a stranded conductor 21 consisting of a plurality of thin wires 16 is charged and set in respective through holes 12, 13 and 14 in lands 8, 9, 10 and 11 for connection use of respective printed wiring circuits 2, 3, 5 and 7 of the boards 1, 4 and 6 and thereafter, a molten solder 16 is filled in the holes 12, 13 and 14 utilizing the capillarity of the thin wires 16. By solidifying this solder, the mutual electric connection of the lands 9, 10 and 11 for connection use of the circuits 2, 3, 5 and 7 is performed, whereby the multilayer printed wiring board 15 provided with the first to fourth layer printed wiring circuits 2, 3, 5 and 7 as its internal layers is manufactured.
Patent JP-H0842546-A (JP)
Title: Structure for preventing screw from dropping off
Inventor: MURAI YUKIO
IPC: F16B41/00
Filed: 1994-08-04
Abstract: PURPOSE:To prevent the dropping off of a screw used for a mold member by providing a hole having a taper surface where the side, where a screw is inserted, of a screw hole is widen, and specifying a relation among the minimum diameter of a screw hole, the diameter of the round rod of a screw, and the diameter of a thread ridge. CONSTITUTION:A relation among the minimum diameter N of a screw hole, the diameter N of the round rod of a screw, and the diameter M of a thread ridge is set to K<N<M. When a stepped screw 1 is inserted in a screw hole 5 in a boss shape of a mold material 6, since the stepped screw is induced in the screw hole 5 along the taper-form surface 9 of the screw insertion hole 8 of the mold material 6, for example, even a machine screw is prevented from falling and insertion is effected with the diameter N of an insertion hole 10 as plastic deformation is effected. Thus, after the stepped screw 1 is inserted in the boss-shaped screw hole 5 of the mold material 6, in a thread ridge containing part 11, the maximum diameter M of the screw part 4 of the screw 1 is increased to a value higher than the minimum diameter N of the screw hole 5 and diameter P is higher than the diameter M of the screw part 4. Thereby, after the screw 1 is mounted, the screw is prevented from slip-out from the insertion diameter 10 and slip-out preventing structure having a play in a vertical direction is provided.
Patent JP-H1027997-A (JP)
Title: Part mounting device
Inventor: FUKATSU KENTA
IPC: B23P19/00
Filed: 1996-07-12
Abstract: PROBLEM TO BE SOLVED: To provide a part mounting device which is provided on the head body, in which couplings which rotate integrally with chucking nozzles so as to be resilient in the sliding direction are provided on the other ends of the chucking nozzles which slide in the longitudinal direction and rotate around the sliding direction as an axis, thereby enabling electronic parts to be mounted they accurately with a simple structure. SOLUTION: A nozzle holder 34 is attached rotatably around a vertical axial line e on the other end of a head body 32. In the holder 34, six chucking nozzles 33... are held rotatably and slidably in the vertical direction. A rotary member 39 is inserted into the center of the nozzle holder 34 so as to be slidable in the vertically direction. Six couplings 44... are inserted into a flange 39a formed on the upper end of the rotary member 39 so as to be slidable in the vertical direction. The chucking nozzle 33 and the coupling 44 are connected by a pin 45 so as to be movable in the vertical direction but so as not to be rotatable. The chucking nozzle 33 is resiliently pressed downward via the coupling 44 and a spring 46 attached to the coupling 44.
Patent JP-H0470757-A (JP)
Title: Photosensitive body and electrostatic information recording method
Inventor: UCHIUMI MINORU
IPC: G03G5/06
Filed: 1990-07-11
Abstract: PURPOSE:To maintain high sensitivity without forming any electric charge implantation preventive layer, to reduce rise of dark potential with the lapse of time after forming the photosensitive body and to enhance stability in contrast with light potential for a long period by adding an electron acceptor to a photoconductive layer containing a bisazo compound laminated on an electrode. CONSTITUTION:The photosensitive body is obtained by forming an electrode on a substrate and laminating on the electrode the photoconductive layer containing the electron acceptor and the bisazo compound represented by formula I in which X is H or lower alkyl or the like; (n) is an integer of 0 - 3; and R is an optionally substituted hydrocarbon ring or alkyl group, thus permitting a charge bearing medium to accumulate information charge high in sensitivity and high in contrast with the dark part without forming any charge implantation preventive layer, and rise of the dark potential of the photosensitive body to be reduce for a long time after forming the photosensitive body, drop of contrast to be lowered, and stability with the lapse of time to be enhanced.
Patent JP-H0928704-A (JP)
Title: Ultrasonic diagnostic device
Inventor: SATO MINORU
IPC: A61B8/00
Filed: 1995-07-20
Abstract: PROBLEM TO BE SOLVED: To provide an ultrasonic diagnostic device enabling to improve operability. SOLUTION: This device is constituted of a transmitter-receiver part 5 which transmits ultrasonic waves into a reagent and also receives the reflected waves to obtain an echo data, a scanning conversion means which converts the echo data to a scanning form for display, and a monitor 17 which displays the output of the scanning conversion means. The scanning conversion means is provided with a frame memory 9 which has a storage capacity an integer number times as much as the one corresponding to a display area of the monitor 17 and a post stage arithmetic means 11 which determines the maximal reflection level among multiple echo data read out of the frame memory 9.
Patent JP-S5889548-A (JP)
Title: Rewinding device of photogravure rotary press
Inventor: NAKAJIMA SEIJI
IPC: B65H19/18
Filed: 1981-11-18
Abstract: PURPOSE:To surely perform action at high speed operation, by decelerating a  film feed at rewinding to stock a film, performing adhesive and cutting work  and then temporaily feeding the film at a high speed to both roll the stock film  and detect the adhesive part. CONSTITUTION:A deceleration drag roller 39 and deceleration nip roller 38 decelerate a film 8 by a paper connection command, and a guide roller 35 is lifted to stock the running film 8. The film 8 decelerated from a printing speed is fed by the rollers 39, 38. Then an adhesive part is detected by a seam detector 40, and the film 8 is further decelerated by this detection to simultaneously perform paster preparation. Further the same adhesive part is detected by a seam detector 41, with the lapse of a certain time, adhesive and cutting works are performed by an adhesive roller 10 and cutter 9. Then the jointed feed film 8 is wound to a new winding core 5.
Patent JP-H0936847-A (JP)
Title: Data retiming system
Inventor: IZUMI FUTOSHI
IPC: H04L7/00
Filed: 1995-07-20
Abstract: PROBLEM TO BE SOLVED: To enable a correct retiming even for data in a complicated mode and including the jitter of size incapable of being ignored to a nominal period. SOLUTION: Data DB0 having the jitter is sampled again by a clock CKB becoming the source and data DB1 is obtained. Data D3 is held for a short section in input data DB0, and is held for the long period in data DB1. Data D4 is held for the long period in the data DB0 but held for the short period in data DB1. Furthermore, data DB0 and DB1 are sampled by a clock CKA without jitter and data DC0 and DC1 are generated. Thus, short data D3 on input data DB0 is not sample in a section 1 and sampled by data DC1 in a sections 2. Long data D4 on input data DB0 is sampled by data DC0 in the sections 2 and 3. Respective pieces of input data are retimed in the equal sections on data DC0 and DC1.
Patent JP-2000022695-A (JP)
Title: Redundant system
Inventor: OYA MASAO
IPC: H04Q3/00
Filed: 1998-06-30
Abstract: PROBLEM TO BE SOLVED: To provide a redundant system which does not cause the loss or duplicate transmission of data even when a system is switched from an active system to a standby system without a hit. SOLUTION: In a bus duplex system for which a cell bus for serially multiplexing and transmitting cells transferred to plural routes are duplexed into the active system and the standby system, the frame synchronizing signals of the cell bus control function block 110-1 or 110-0 of the standby system are synchronized with and made to follow up the frame synchronizing signals of the cell bus control function block 110-0 or 110-1 of the active system. In the case of switching the system from the active system to the standby system, the frame synchronizing signals of the cell bus control function block 110-0 or 110-1 of the active system are synchronized with and made to follow up the frame synchronizing signals of the cell bus control function block 110-1 or 110-0 of the standby system and both frame synchronizing signals are synchronized at all times.
Patent JP-S6342335-A (JP)
Title: Treatment of slag concentrate of copper converter
Inventor: KIMURA TAKAYOSHI
IPC: C22B7/04
Filed: 1986-08-07
Abstract: PURPOSE:To efficiently remove and recover impurities from the copper- component in slag concentrate of a copper converter by subjecting the matte formed by melting the slag concentrate of the copper converter and adding a sulfur source to the molten metal of the separated metal phase to a vacuum treatment, thereby evaporating away the impurities. CONSTITUTION:The copper converter slag is solidified and pulverized and the powder thereof is subjected to flotation. Tailings are discarded and the slag concentrate having the high copper-component is obtd. The slag concentrate is melted in a weak reducing or neutral atmosphere to form and separate the matte and the metal phase. The slag is discarded and the matte is separately treated. The sulfur source is added to the melt of the above-mentioned metal phase until the matte phase is formed. The molten metal of the matte formed in such a manner is subjected to a pressure reduction in a vacuum refining vessel, by which the impurities such as Zn, Pb, As, Sb, and Bi contained therein are evaporated and recovered. The refined matte obtd. in the above-mentioned manner is returned together with the matte separated in the above-mentioned melting furnace to the copper converter for treating the matte produced by the smelting furnace and is thereby treated.
Patent JP-H03148996-A (JP)
Title: Universal isdn subscriver line module
Inventor: RIHIYARUTO FUUTSUENRAUPU
IPC: H04M1/725
Filed: 1990-07-13
Abstract: PURPOSE: To connect arbitrary analog and digital terminals to an integrated service digital network at low cost by comprising, at least, one digital subscriber interface, analog subscriber interface and digital network interface, respectively. CONSTITUTION: This universal subscriber line module 1 has a control unit 2 equipped with a digital memory 3. The control unit 2 and memory 3 are mutually connected by an internal system bus 4. The digital subscriber interface 6 is also connected to the system bus 4 and performing interface to the digital terminal 9. The analog subscriber interface 11 is connected to the system bus 4 to make connectable the analog terminal 10. Then, the digital network interface 5 is connected to the system bus 4 and performing interface to the integrated service digital network 8. The digital memory 3 has all of the structural parameters necessary for controlling and monitoring a module so that all analog and digital terminals are connected to the digital network.
Patent JP-H0850161-A (JP)
Title: Measuring method of semiconductor device
Inventor: OKADA KOJI
IPC: G01R31/26
Filed: 1994-08-05
Abstract: PURPOSE:To provide a measuring method of cut-off frequency in which the number of measuring points can be reduced while keeping the measuring precision, and the measuring time can be shortened. CONSTITUTION:Respective gains yL, yH in two minimum and maximum frequencies xL, xH of a measuring frequency range for conforming a gain to a prescribed value yADJ are measured. The approximate value x'ADJ of frequency for conforming the gain to the prescribed value yADJ is arithmetically determined by linear approximation. When the approximate value x'ADJ of frequency determined by linear approximation is largely different from xADJ which is the actual frequency value, the frequency characteristic is assumed to be a broken line to approximate it. Namely, optional frequencies x1, x2 are taken between xL and xH, and gains yL, y1, y2, yH in the respective frequencies yADJ measured It is then confirmed between which gains yADJ is situated. In this case, since yADJ is between yL and y1, the approximate value x'ADJ in yADJ is arithmetically determined by linear approximation.
Patent JP-S6427933-A (JP)
Title: Conductive polypropylene sheet
Inventor: DAIMON TAKASHI
IPC: B32B27/18
Filed: 1987-07-23
Abstract: PURPOSE:To obtain a conductive sheet, never generating hairiness even when the surface layer thereof is rubbed, by a method wherein a conductive nonwoven fabric, consisting of fibers, obtained from modified polypropylene (PP) prepared by modifying crystalline PP by a specified compound or the crystalline PP containing the modified PP, and conductive fibers, is superposed on one or both surfaces of a crystalline PP resin film, thereafter, they are integrated by fusion welding. CONSTITUTION:Modified polypropylene (PP) is obtained by modifying crystalline PP by unsaturated carboxylic acid or the derivative thereof, while acrylic acid or maleic anhydride is preferable as the unsaturated carboxylic acid. The containing amount of modifying agent in the modified PP or the crystalline PP containing the modified PP is preferably 0.1-10wt.%. Conductive fibers may be selected from metallic compound-coated synthetic fibers, metal-plated synthetic fibers, carbon-coated type synthetic fibers, metal-plated glass fibers, metal-coated carbon fibers, metallic fibers and the like. Polyacrylonitrile fibers, polyamide resin, polyester resin or the like may be used as the material of the core of metal or carbon composite synthetic fiber. The resin film and the conductive nonwoven fabric are integrated through fusion welding by a polishing roll at 40-90 deg.C.
Patent JP-H0350511-A (JP)
Title: Plastic optical fiber cable
Inventor: TOYOSHIMA SHINICHI
IPC: G02B6/44
Filed: 1989-07-19
Abstract: PURPOSE:To sufficiently intensify the strength to pulling off and to facilitate termination by imparting the counter force to tensile force and compressive force and further increasing the adhesive strength of a plastic optical fiber and a 1st coating layer. CONSTITUTION:The fiber is coated with a resin which contains polyvinylidene fluoride or vinylidene fluoride constituting unit and has >=60 value of Shore D hardness at 23 deg.C of this resin as the 1st coating layer 2 to 0.01 to 0.2 mm thickness. The 2nd coating layer 3 is the layer of 0.1 to 1.0 mm thickness consisting of the resin contg. the polyvinylidene fluoride or vinylidene fluoride constituting unit. The 1st coating layer 2 and the 2nd coating layer 3 are ther mally welded to each other. The hardness of the 2nd coating layer is required to be equal to the hardness of the resin of the 1st coating layer or lower than the same and is specified to 30 to 70. The work for laying the cable is simplified in this way without requiring intricate parts, such as reinforcing materials and protective pipes.
Patent JP-S6441147-A (JP)
Title: Cathode ray tube with in-line electron gun
Inventor: RANBAATO YOHANESU SUTEIRU
IPC: H01J29/50
Filed: 1988-07-22
Abstract: PURPOSE: To eliminate the compromise for optimizing free fall error, beam displacement and core haze eccentricity by providing a means for generating asymmetrical electric field in a beam route of the outside electron beam between a third electrode and a main focus electrode. CONSTITUTION: Electrodes 40, 46A cooperatively generate the asymmetrical electric field in relation to the outside beam, and this electric field gives two degree of freedom separated from the degree of freedom by the pitch of an aperture inside of a first and a second electrodes 30, 36 and eccentricity of an outside aperture in a preparatory focus electrode 38. These separate degree of freedom are used so as to eliminate the spot error, beam displacement and the asymmetry of beam. In the electrodes 40, 46A, these separate degree of freedom can be obtained by changing the pitch, which is obtained by forming the aperture into the narrow and long shape, and appropriately adjusting the mutual distance between the electrodes 40, 46A.  With this structure, three stages of degree of freedom is provided, and the compromise between free fall error, beam displacement and core haze eccentricity can be eliminated.
Patent JP-2001014559-A (JP)
Title: Crime prevention device provided with wrench open prevention structure
Inventor: MURATA NORIKAZU
IPC: H05K5/02
Filed: 1999-06-30
Abstract: PROBLEM TO BE SOLVED: To provide a crime prevention device which easily and also inexpensively prevents a cover from being wrench-opened and can prevent the cover from being removed from the chassis by impact. SOLUTION: This crime prevention device houses an electric circuit 3 in a case 2 and is for detecting an intruder, the case 2 consists of a chassis 21 to be attached to a mounting surface S and a cover 22 covering the opening, and an engagement pawl 13 engaging with the part 12 to be engaged of the chassis 21 and preventing one side part from being moved from the opening of the chassis 21 in the direction where it is perpendicular to an opening face 20 and an opening prevention pawl 14 engaging with the inner face of the side part of the chassis 21 and preventing the cover 22 from being moved in a direction parallel with the face 20 of the chassis 21 are provided on the side part of the cover 22. Then, stops 9 that are freely locked and detached to/from the stopping part 8 of the chassis 21 are mounted on the other side part of the cover 22.
Patent JP-H1131778-A (JP)
Title: Semiconductor device and its manufacturing method
Inventor: SUZUKI YASUHIRO
IPC: H01L23/50
Filed: 1997-07-10
Abstract: PROBLEM TO BE SOLVED: To allow reduction of a semiconductor device profile with superior wire-bonding characteristic. SOLUTION: By supporting in a fixed manner, a plurality of inner leads as one body by filling a resin film 10 between the inner lead 2, no thick film is allowed to be on the rear surface side of each inner lead, so that a bonding load and ultrasonic vibration are effectively acted at the inner lead 2, when a bonding wire 4 is connected for improved bonding characteristic. A semiconductor element 3 is mounted on the resin film 10 to eliminate the need for a die pad, allowing reduction of thickness of a semiconductor device by the amount of a die pad.
Patent JP-H1031327-A (JP)
Title: Electrostatic charge image developing carrier, developer and image forming method
Inventor: ISHIKAWA MICHIAKI
IPC: G03G15/09
Filed: 1996-07-15
Abstract: PROBLEM TO BE SOLVED: To increase the rising rate for electrification of a carrier by forming a polymer coating layer containing an alicyclic methacrylate monomer component and a chain methacrylate monomer component on the surface of a core material and controlling the number average particle size of the carrier to a specified range. SOLUTION: The core material of the carrier particle consists of a composite particle containing ferromagnetic fine particles and a hardened phenol resin, and a polymer coating layer containing an alicyclic methacrylate monomer component and a chain methacrylate monomer component is formed on the surface of the core material. The number average particle size of the carrier is 1 to 1000μm. Or, the carrier consists of composite particles of ferromagnetic fine particles, and if necessary, the surface of the particle is coated with an acryl resin. The number average particle size of the carrier is 1 to 1000μm, preferably 10 to 100μm, and more preferably 10 to 50μm. If the particle size of the carrier is <1μm, it easily causes secondary aggregation. If the particle size exceeds 1000μm, the carrier has low mechanical strength so that a sharp image can not be obtd.
Patent JP-H061026-A (JP)
Title: Cassette for printer
Inventor: YUKITA YASUO
IPC: B41J17/32
Filed: 1992-06-19
Abstract: PURPOSE:To certainly supply recording paper and an ink ribbon to a printer by a simple operation. CONSTITUTION:A recording paper receiving part 2 and an ink ribbon receiving part 3 are provided in one housing 1 and the recording paper 7 wound around a core 8 in a roll form is received in the recording paper receiving part 2 and a supply reel 9 wherein an ink ribbon 13 is wound around a bobbin 12 and a take-up reel 10 having a bobbin 14 to which one end of the ink ribbon 13 is fixed and taking up the ink ribbon 13 are received in the ink ribbon receiving part 13. Support plates 15 are provided at both left and right side parts of the receiving space 11 in the ink ribbon receiving part 13 and the bobbin 14 of the take-up reel 10 is placed on the recessed parts 16 provided at the upper parts of the support plates 15 and the take-up reel 10 is detachable with respect to the ink ribbon receiving part 13. A lid 22 openable and closable with respect to the ink ribbon receiving part 3 is attached to the housing 1.
Patent JP-S6341038-A (JP)
Title: Inspection device for foreign matter of wafer
Inventor: NEMOTO RYOJI
IPC: G01N21/94
Filed: 1986-08-06
Abstract: PURPOSE:To operate a wafer with a pattern and a wafer with a deposition film for inspecting foreign matters on both wafers in combination by one inspection device by selecting a first mode or a second mode. CONSTITUTION:A first mode for a wafer with a pattern and a second mode for a wafer with a deposition film are changed over and worked. When an inspection device is set at the first mode, an XY moving table 10 is operated, the point of irradiation of S polarized light laser beams 18 is shifted in the X-Y directions on the surface of the wafer 12, the surface of the wafer is scanned by the S polarized light laser beams 18, only the P polarized light component of scatterred light 29 is extracted and projected to a photomultiplier 34, and the result of the decision of foreign matters based on a photoelectric conversion signal is inputted to a process control section 42 from a level comparison circuit 38. When the inspection device is set at the second mode, the surface of the wafer 12 is scanned in the XY directions by unpolarized light laser beams 26. Scattered light 29 is projected to a photomultiplier 36 as it is, and the result of the decision of foreign matters based on a photoelectric conversion signal from the photomultiplier 36 is inputted to the process control section 42 from a level comparison circuit 40.