baber/WOPTO huggingface dataset:
Patent TW-I277166-B (TW)
Title: Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor
Inventor: OZONO MITSURU
IPC: H01L21/301
Filed: 2003-07-15
Granted: 2007-03-21
Abstract: In an adhesive sheet exfoliation process in a pick-up operation for a thin-type chip 6 adhered to the adhesive sheet 5, a suction exfoliation tool 22 provided at its adhesion surface 22a with plural suction grooves 22b is abutted against the lower surface of the adhesive sheet 5. Then, air within the suction grooves 22b are vacuum-sucked to bend and deform the adhesive sheet 5 together with the chip 6 thereby to exfoliate the adhesive sheet 5 from the lower surface of the chip 6 due to such bending deformation. Thus, it is possible to realize the picking-up operation with high productivity without causing a problem such as breakage or crack.
Patent TW-I254137-B (TW)
Title: Optical anisotropic film
Inventor: PAUKSHTO MICHAEL V
IPC: G02B5/30
Filed: 2003-08-04
Granted: 2006-05-01
Abstract: There is disclosed an optical anisotropic film which includes at least one anisotropic crystalline layer comprising a substance whose molecules contain aromatic rings and form a lattice and at least one transparent layer. The relative refractive index n satisfies the condition 2n<2> < NO<2>+ne<2> where no and ne, are the refractive indices of the crystalline layer for ordinary and extraordinary rays respectively.
Patent TW-I248958-B (TW)
Title: Synthetic resin emulsion powder
Inventor: TANIMOTO SEIJI
IPC: C08L47/00
Filed: 2003-09-15
Granted: 2006-02-11
Abstract: Disclosed is a synthetic resin emulsion powder obtained by spray-drying a composition that comprises an emulsion (A) where the dispersoid is a polymer that having one or more unsaturated monomer units selected from ethylenic unsaturated monomers and dienic monomers, and a polyvinyl alcohol (B) having, in the molecule, from 1 to 12 mol% of ethylene units. The emulsion powder has good redispersibility and good water resistance. Its redispersion well form good films and has good storage stability at low temperatures. The emulsion powder is favorable for additives to hydraulic substances, as it well disperses in hydraulic substances such as cement mortar and gives hardened articles of high mechanical strength. The emulsion powder is also favorable for joint materials for hydraulic substances, as its adhesiveness and durability are both good and gives jointed articles of high mechanical strength.
Patent TW-I280298-B (TW)
Title: Washing machine with dewatering functions
Inventor: KOMATSU MORIMASA
IPC: D06F25/00
Filed: 2003-10-09
Granted: 2007-05-01
Abstract: A washing machine will not be affected by the clothes placed on the cover thereof and not be detrimental to its outlook, and can obtain a high dewatering effect. A rotary tank is mounted inside the enclosure 5 for dewatering the clothes by rotation. A suction opening 25 for sucking external air to the rotary tank is mounted on a handle part 24 equipped on the cover 4 in the enclosure 5. So that even clothes are placed on the cover 4, the handle part 24 can continuously sucking in external air through the suction opening 25 to achieve a full and continuous ventilation for the rotary tank. Moreover, the suction opening 25 becomes non-conspicuous through the handle part 24.
Patent TW-I289192-B (TW)
Title: Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
Inventor: KENNY THOMAS WILLIAM JR
IPC: G06Q20/20
Filed: 2003-10-09
Granted: 2007-11-01
Abstract: A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.
Patent TW-I236964-B (TW)
Title: Blow-molding machine
Inventor: NETSU YOICHI
IPC: B29C49/06
Filed: 2003-10-30
Granted: 2005-08-01
Abstract: A first transfer mechanism (13) of a biaxial stretch blow-molding apparatus (1) has a plurality of sliders (45) that are transported along a circular transportation passage (12). The sliders (45) slide along a circular guide rail (44) installed on a turntable (43). Each of the sliders (45) is swingable by a swing arm (49) as the turntable (43) rotates, and a feed pitch of a preform holding groove (46a) formed in a holding plate (46) installed at an end of each of the sliders is changed. The feed pitch can be changed by a simple mechanism. Because the holding groove (46a) always faces a radial direction, receiving and handing over actions of a preform (2) sent along the circular transportation passage can be reliably performed.
Patent TW-I275997-B (TW)
Title: Switching between secure and non-secure processing modes
Inventor: WATT SIMON CHARLES
IPC: H04L69/14
Filed: 2003-11-17
Granted: 2007-03-11
Abstract: There is a provided a data processing system comprising: a processor operable in a plurality of modes and either a secure domain or a non-secure domain including: at least one secure mode being a mode in said secure domain; at least one non-secure mode being a mode in said non-secure domain; and a monitor mode, wherein when said processor is executing a program in a secure mode said program has access to secure data which is not accessible when said processor is operating in a non-secure mode; and switching between said secure mode and said non-secure mode takes place via said monitor mode, said processor being operable at least partially in said monitor mode to execute a monitor program to manage switching between said secure mode and said non-secure mode.
Patent TW-I282446-B (TW)
Title: Light guide plate and backlight device using the same
Inventor: LIN JHY-CHAIN
IPC: G02B6/00
Filed: 2003-12-05
Granted: 2007-06-11
Abstract: The present invention relates to a light guide plate and a backlight device. The light guide plate includes a light emitting surface, a bottom surface opposing to the light emitting surface, a light incident surface joining with the light emitting surface and the bottom surface. The light emitting surface defines a plurality of dots. The dots having grating.
Patent TW-I224579-B (TW)
Title: Nano-grade high aspect ratio structure and manufacturing method thereof
Inventor: WANG YU-REN
IPC: B82B1/00
Filed: 2003-12-19
Granted: 2004-12-01
Abstract: Disclosed is a nano-grade high aspect ratio structure, including a substrate, an electroplating layer, a catalyst layer and a nano tube layer. Sputter plating or chemical vapor deposition is used to deposit an electroplate starting layer and the catalyst layer on the substrate sequentially. The catalyst layer is defined with patterns required for forming nano tubes. The nano tube layer is only formed on the area having the catalyst layer and extends in the direction perpendicular to the substrate for a predetermined height. Part of the electroplating layer is exposed at areas having no nano tube layer so as to serve as the reactive electrodes for the subsequent electroplating process. After electroplating, the nano tube layer and the substrate are removed to obtain a microstructure with high rigidity and high aspect ratio.
Patent TW-I252884-B (TW)
Title: Washing machine
Inventor: TERAI KENJI
IPC: D06F37/00
Filed: 2004-02-12
Granted: 2006-04-11
Abstract: A washing machine according to the present invention discharges foams from the top of the washing articles to undergo washing operation, generates foams from the dissolved washing solution, and collects the generated foams to a foam chamber before discharging the foams to the top and then spraying the foams from the top to the washing inside an inner tank, thereby ensuring a high washing power and reducing the condition of inhomogeneous washing. Further, the inner tank for housing the washing is housed in an outer tank. The inner tank is freely rotatable and is driven by a motor. Furthermore, the inner face of the outer tank is formed with a foam chamber, and the rotation of the inner tank enables the washing solution between the inner tank and the outer tank to form foams, where the developed foams on top of the washing solution will converge into the foam chamber to be discharged to the top before being discharged from top of the inner tank to the inside of the inner tank.
Patent TW-I232172-B (TW)
Title: Method for forming a multi-colored label
Inventor: LIOU KUEN-JUNG
Filed: 2004-02-13
Granted: 2005-05-11
Abstract: A method for forming a multi-colored label comprises the steps of: preparing a mold seat; sequentially filling a pigmented chip unit in a cavity unit and a first back glued sheet in a groove on the mold seat; heating the first back glued sheet and the pigmented chip unit to bind them together; heating the mold seat in order to heat and expand the first back glued sheet; loading a second back glued sheet into a recessed part; binding the first back glued sheet and the second back glued sheet together to produce a label. Also, the mold seat can only be mounted with a groove and a cavity unit in order to form a pigmented chip unit with a larger volume in the cavity unit.
Patent TW-I229017-B (TW)
Title: Surface cleaning method of wafer carrying mechanism of semiconductor machine
Inventor: JANG JI-YUN
IPC: C23C14/56
Filed: 2004-03-16
Granted: 2005-03-11
Abstract: This invention relates to a surface cleaning method of wafer carrying mechanism of semiconductor machine. The semiconductor machine has a sputtering chamber which is provided with a wafer carrier to carry wafer. The surface cleaning method of wafer carrying mechanism includes the following steps: adjusting the semiconductor machine to a cleaning state while a plasma can be generated, utilizing the plasma to clean the oxidized pollutants on the wafer carrier, and then adjusting the semiconductor machine to a release state to stop generating plasma. The aforementioned cleaning state at least includes three steps: introducing protective gas into sputtering chamber, amplifying the radio frequency power of the wafer carrier to a suitable range, keep the radio frequency power of the wafer carrier in the suitable range for a period of time. The aforementioned release state at least includes two steps: making radio frequency power of the wafer carrier back to zero, and releasing the protective gas in sputtering chamber.
Patent TW-I236209-B (TW)
Title: Motor driver circuit of unmixed CMOS transistor player
Inventor: LIN WAN-RUNG
IPC: H02P7/00
Filed: 2004-03-19
Granted: 2005-07-11
Abstract: The present invention relates to a motor driver circuit of unmixed CMOS transistor player. The motor driver circuit of a digital audio (image) player is mainly composed of a non-Bi-CMOS type CMOS transistor. The motor drive circuit comprises a front stage and a driving stage, wherein the front stage can generate a higher trigger voltage by connecting CMOS transistors in series, so as to decrease the conduction impedance of the drive stage, and further increase the output current for driving the motor. By the above-mentioned design, the motor drive circuit can be manufactured by low-cost CMOS process.
Patent TW-I247997-B (TW)
Title: Serial and parallel interchange circuit system for addressing data
Inventor: TANG DI
IPC: G11C5/00
Filed: 2004-06-15
Granted: 2006-01-21
Abstract: A serial and parallel interchange circuit system for addressing data mainly includes a bus; a data collector connected with the bus and acquiring address and data inputted by the bus; an addressing input register that stores the data intended for input; a control terminal that controls data input/output status of serial and parallel interchange circuit system for addressing data; a microprocessor that processes the data transmitted from the said data collector, where the microprocessor has a serial/parallel interchange judging circuit to judge the transmission method of the data intended for output; and an addressing output register that stores the processed data intended for output.
Patent TW-I260465-B (TW)
Title: Light direction assembly and method of controlling rotation of a tip-tilt platform
Inventor: LONG MICHAEL D
IPC: G03B21/28
Filed: 2004-08-10
Granted: 2006-08-21
Abstract: A light direction assembly (100, 600) includes a tip-tilt platform (110, 610) having a first and second axes (155 and 620, 160 and 630 respectively) and having a light direction member (640) coupled thereto, first and second current coils (650, 660 respectively) coupled to the platform, and a plurality of pole stand assemblies (125, 130, 135, 140, 670) coupled to the first and second current coils (650, 660 respectively) and including a plurality of magnets (165) wherein the magnets (165) are configured to selectively tilt the tip-tilt platform (110, 610) with respect first and second axes (155 and 620, 160 and 630 respectively) in response to first and second currents flowing through the first and second current coils (650, 660 respectively).
Patent TW-I255019-B (TW)
Title: Flip chip bonding method for enhancing the performance of connection in flip chip packaging process and layered metal architecture of substrate for stud bump
Inventor: KOO JA-UK
IPC: H01L21/60
Filed: 2004-09-21
Granted: 2006-05-11
Abstract: A flip chip bonding method for enhancing a bonding performance between a chip and a substrate by forming a bump on the chip or the substrate, and a layered architecture of the substrate for the same are disclosed. The flip chip bonding method comprises the steps of performing pretreatment of a wafer having chips, dicing it, and obtaining the pretreated individual chip; performing pretreatment of a substrate; aligning the pads of the pretreated chip with the pads of the pretreated substrate, and bonding the chip and the substrate together by applying an ultrasonic wave and heat using a collet and simultaneously applying pressure; and performing posttreatment for filling or molding resin after bonding. The chip or the substrate is formed with a plated bump, a stud bump or a wedge bump, respectively. Here, the stud bump or the wedge bump can be additionally formed on the plated bump. The bump can be made of Au, Ni, Ag or Cu. The bump of the substrate has the same size as the bump of the chip or any one of the bump of the substrate and the bump of the chip has a larger size than the other of them. The substrate is plated with Au, Ag, Cu, or Sn.
Patent TW-I257483-B (TW)
Title: Automatic testing system for electronic devices and its method
Inventor: TZU CHUNG-HSING
IPC: G01R31/01
Filed: 2004-10-05
Granted: 2006-07-01
Abstract: The present invention provides an automatic testing system for electronic devices and its method. The system comprises at least one upright motherboard cabinet, two access devices, a storing area, a transmission device and a control host. The major test includes: a step of implanting electronic devices, in which one access device accesses electronic devices for being mounted on a motherboard under test in the motherboard cabinet; a step of testing, in which the motherboard under test and the electronic devices are operated together to perform a test for actual operation; a step of host controlling, in which test data and the like are transmitted to the control host so that the control host compares the qualities and effects of the electronic devices; a step of taking out electronic devices, in which the control host controls the other access device to take out the electronic devices for being classified and stored based on the test result, thereby achieving the benefits of increasing the test speed and reducing the quality control cost.
Patent TW-I245398-B (TW)
Title: Integrated circuited package with plating on exposed die pad and leadframe used in the same
Inventor: WANG WEI-CHIH
IPC: H01L23/495
Filed: 2004-10-19
Granted: 2005-12-11
Abstract: An integrated circuited package with plating on exposed die pad mainly includes a die pad, a plurality of tie bars and a plurality leads constituted by a leadframe, a chip, a molding compound and a plating layer. The tie bars connect a plurality of corners of the die pad. The chip is disposed on an upper surface of the die pad and electrically connected to the leads. The molding compound exposes a bottom surface of the die pad. Corresponding to each corner, the die pad has a first L-shaped groove and a second L-shaped groove formed at periphery of the bottom surface. Since a bend point of each first L-shaped groove and a bend point of the corresponding second L-shaped groove are oriented toward the corresponding corners for the plating layer smoothly forming on the bottom surface of the die pad.
Patent TW-I244237-B (TW)
Title: Quadri-filar helix antenna structure
Inventor: YANG PEI-LIN
IPC: H01Q1/38
Filed: 2004-11-12
Granted: 2005-11-21
Abstract: This invention relates to a quadri-filar helix antenna structure, which includes one cylinder composed of dielectric material with the relative dielectric constant of epsilonr greater than 4, wherein one distal surface of the cylinder is equipped with 4 pieces of radiating metal pieces, each oh which is extended from the center of cylinder along the radial direction to its peripheral edge and extended to the distal edge from the surface of circumference according to the helical route along the axial direction; on the distal surface, the ends of two neighboring radiating metal pieces are connected with each other to form two sets of antenna structures; in the central position of the cylinder is installed with one penetration aperture, within which is embedded one coaxial cable; the shelter line on the peripheral edge of coaxial cable is connected to one end of a set of antenna structure, while the end of feeder conductor is connected to one end of another set of antenna structure. Therefore, the antenna prepared by this invention can not only be miniaturized in its volume of the whole antenna, but also be manufactured at reduced cost.
Patent TW-I242290-B (TW)
Title: Fabrication method of thin film transistor
Inventor: GAN FENG-YUAN
IPC: H01L29/786
Filed: 2004-11-22
Granted: 2005-10-21
Abstract: A fabrication method of a thin film transistor. A metal gate stack structure is formed on an insulator substrate. The substrate is performed using thermal annealing to create an oxide layer on the sidewalls of the metal gate stack structure. A gate insulating layer is formed on the substrate covering the metal gate stack structure. A semiconductor layer is formed on the gate insulating layer. A source/drain layer is formed on the semiconductor.
Patent TW-I280695-B (TW)
Title: High speed electrical connector
Inventor: ZHANG GEORGE HUANYI
IPC: H01R13/518
Filed: 2004-12-31
Granted: 2007-05-01
Abstract: An electrical connector (1) includes an elongated housing (2) and a number of first and second contacts (3, 4). The insulative housing includes a first body portion (23) defining a first and a second pin receiving spaces (231, 232) to receive the second contacts and a second body portion (24). The second body portion includes a base (240), a tongue portion (241) extending forwardly from the base, a pair of end walls (243) located at opposite ends of the tongue portion and a strengthening wall (242) extending from the base and connecting with the pair of end walls. The tongue portion includes a first, a second and a third tongue sections (2413, 2414, 2415). The third tongue section has a thickness greater than each of those of the first and the second tongue sections. The first contacts are grouped into a first, a second and a third sets of first contacts (31, 32, 33) respectively received in the second body portion of the housing.
Patent TW-I250268-B (TW)
Title: Portable quartz crystal microbalance
Inventor: LI JAU-FA
IPC: G01G7/00
Filed: 2004-12-31
Granted: 2006-03-01
Abstract: This invention relates to a portable quartz crystal microbalance, including: a piezo quartz crystal to be attached to an object to be measured; an electrical oscillator circuit for supplying appropriate energy to the piezo quartz crystal so as to output oscillating frequency corresponding to the object to be measured; a counter for counting the oscillating frequency and outputting frequency values corresponding to the oscillating frequency; a microprocessor for plotting an oscillogram corresponding to the frequency values according to the frequency values and outputting the same; a display device for inputting and displaying the oscillogram; and an input device for controlling operation of the portable quartz crystal microbalance.
Patent TW-I291443-B (TW)
Title: Carrier and fastening device thereof
Inventor: LEE TSUNG-HO
IPC: B65G47/90
Filed: 2004-12-31
Granted: 2007-12-21
Abstract: A carrier includes a robot arm, a belt and a fastening device. The belt connects the robot arm mechanically and controls the horizontal movement as well. The belt has a belt surface. The fastening device includes a guiding portion, an upper fastening body and a lower fastening body. The guiding portion has a first guiding end, a second guiding end and a middle guiding part. The upper fastening body has a first fastening surface, the lower fastening body has a second fastening surface and a moving device which the lower fastening body is below the first fastening body. The moving device moves along the surface of the guiding portion, the second fastening surface towards the first fastening surface. The first fastening surface and the second fastening surface is located on the two sides of the belt surface.
Patent TW-I287960-B (TW)
Title: One/multi layer printed circuit board capable of preventing electrostatic discharge and routing method thereof
Inventor: SU CHIH-CHIANG
IPC: H05K3/46
Filed: 2005-01-12
Granted: 2007-10-01
Abstract: An one/multi-layer printed circuit board capable of preventing electrostatic discharge and a routing method of the one/multi-layer printed circuit board are disclosed. The routing method includes placing a first routing area, placing a second routing area apart from the first routing area for a predetermined distance at least, and connecting a blocking device between the first routing area and the second routing area for attenuating an impulse generated by electrostatic discharge in order to prevent the impulse spreading to the second routing area from the first routing area.
Patent TW-I270012-B (TW)
Title: RFID tag
Inventor: YAMAGAJO TAKASHI
IPC: G06K19/077
Filed: 2005-01-19
Granted: 2007-01-01
Abstract: An RFID tag which has improved radiation/reception characteristics when used in proximity to the human body, and has an antenna which, when stacked with a 13 MHz band RFID tag, does not have an effect on the loop antenna of that tag. An RFID tag assembly comprises a first RFID tag having a coiled loop antenna and a second RFID tag superposed on the first RFID tag, the second RFID tag comprising an antenna formed by a metal member which covers at least a portion of a surface of a dielectric substrate, an electronic part mounted on the metal member, and a member which is provided with the overlapped coiled loop antenna of the first RFID tag housed in the end thereof so as to cover a portion of the antenna formed by the metal member.