baber/WOPTO huggingface dataset:
Patent JP-S61135255-A (JP)
Title: Data transmission system
Inventor: MINO YASUSHIROU
Filed: 1984-12-06
Abstract: PURPOSE:To secure the validity of data and to detect a fault with a data transmission system by providing a data replacement flag to specify that the data given from an input station is replaced. CONSTITUTION:The process input stations 4a and 4b collect data in a fixed cycle and send them to a transmission line 3 after turning them into clocks. Then the stations of the CPU1a and 1b store at a time those data in their own data memories 2a and 2b respectively and also set the data replacement bits 5a and 5b at '1'. The memories 2a and 2b are replaced in the reception cycles given from stations 4a and 4b. It is possible to know the immediately preceding process input data by reading the memories 2a and 2b in a cycle longer than the data replacement cycle.
Patent JP-2001085640-A (JP)
Title: Semiconductor device and fabrication method thereof
Inventor: ONO KEIICHI
IPC: H01L21/8242
Filed: 1999-09-13
Abstract: PROBLEM TO BE SOLVED: To obtain a stacked capacitor in which deterioration of characteristics due to oxidation of an adhesion layer (or barrier layer) is prevented by employing a structure where the adhesion layer (or barrier layer) is spaced apart from a dielectric film. SOLUTION: The semiconductor device comprises a tubular bottomed first electrode 21, a dielectric film 22 formed at least on the inner surface of the first electrode 21, and a second electrode 23 formed at least on the inside of the first electrode 21 through the dielectric film 22 wherein an adhesion layer 15 is provided at least on the bottom of the first electrode 21. The adhesion layer 15 is isolated from the dielectric film 22 by means of an insulation film 16, a sidewall 17 or the first electrode 21.
Patent JP-H02106843-A (JP)
Title: Cathode for electron tube
Inventor: IMURA HIRONORI
IPC: H01J1/20
Filed: 1988-10-14
Abstract: PURPOSE:To obtain the electron emission characteristic and life equal to a Sc2O3 cathode at low cost by adding So2O3 and (BaSrCa)O or (BaSr)O coated with Ni to an oxide coated layer. CONSTITUTION:An oxide coated layer 1 contains 5% of Sc2O3 and 30% of (BaSrCa)O coated with Ni, the remaining being (BaSrCa)O or (BaSr)O having no Ni coat. A Ni base metal 2 contains 0.1% of Zr, and it is fixed and supported by a sleeve 3 and heated by a heater 4. By adding 20% of normal Sc2O3, the life of 10,000 hours can be obtained at the electron emission capacity of 1.5 A/cm<2>. The addition of Sc2O3 more than 20% never contribute the increase in electron emission capacity. Hence, a cathode having the electron emission capacity and life equal to the Sc2O3 cathode containing 20% of Sc2O3 can be obtained by a cathode consisting of 5% of Sc2O3, 30% of (BaSrCa)O coated with Ni, and 65% of (BaSrCa)O having no Ni coat.
Patent JP-H09102918-A (JP)
Title: Video signal display device
Inventor: ISHIKAWA KENJI
IPC: H04N5/45
Filed: 1995-10-05
Abstract: PROBLEM TO BE SOLVED: To easily visually discriminate a picture operated by a remote controller, etc., by changing luminance for each picture by varying a selected luminance signal. SOLUTION: In a discriminating means 7, the picture selected by a user is discriminated by a picture operate signal 7a and a select signal 7c on the side of the selected picture is turned into 'H' but a select signal 7b on the side of a non-selected picture is turned into 'L'. A luminance signal 1b separated by a signal processing means 1 is inputted to a luminance amplitude varying means 2 and divided, the amplitude of the signal 1b is reduced, and that signal is outputted as a variable luminance amplitude signal 2b. Besides, a luminance signal 3b inputted to a luminance amplitude varying means 4 is outputted as a variable luminance amplitude signal 4b without attenuating its amplitude. The signals 2b and 4b are passed through a deflecting means 8 and outputted as a composite signal 8b.  Thus, even in the case of operating the picture of multiscreen display, the selected picture is identified by an operation discriminating means and only the selected picture is displayed bright.
Patent JP-H07115277-A (JP)
Title: Laminated ceramic component
Inventor: SUGO KIMIHIDE
IPC: H05K3/46
Filed: 1993-10-15
Abstract: PURPOSE:To provide laminated ceramic components which have construction to compensate for the electrostatic capacitance of a built-in capacitor, thereby providing a required capacitance. CONSTITUTION:In a laminated ceramic component I which laminates a plurality of insulation sheets 2 which print a circuit pattern, places a dielectric ceramic piece 4 between the insulation sheets 2, clamps the dielectric ceramic piece 4, installs a pair of electrodes 5 in such a fashion that they may be opposed to each other, thereby forming a built-in capacitor 3 and sinters the laminated insulation ceramic sheets 2, a penetration hole 6 is formed on an insulation ceramic sheet 2a on the uppermost layer so as to penetrate the insulation ceramic sheet 2a. Dielectric ceramic pieces 7 are filled up in the penetration hole 6 so that the hole 6 may be clogged with the dielectric pieces 7. A pair of electrodes 8 are installed so that they may be opposed, thereby forming an additional built-in capacitor 9 and connecting the additional built-in capacitor 9 to the built-in capacitor 3.
Patent JP-H03120494-A (JP)
Title: Road surface state detecting method
Inventor: WATABE TAKAAKI
IPC: G01W1/10
Filed: 1989-10-03
Abstract: PURPOSE:To accurately judge a road surface state by comparing the inter- electrode resistance value of a 1st detecting element which has no heating means for an insulator between a couple of electrode with that of a 2nd detecting element which has a heating means. CONSTITUTION:A voltage is applied between the outside and inside electrodes 11 and 21, and 12 and 22 of the 1st and 2nd detecting elements 1 and 2 and electricity is fed even to the heater 4 in the insulator 32 between the couple of electrodes of the detecting element 2. The resistance between the electrodes 11 and 12 of the detecting element 1 is high when the road surface 6 is dry or when there is ice or snow and low when the road surface is merely wet. The detecting element 2, on the other hand, is equipped with the heater 4, so the resistance between the electrode 21 and 22 is high only when the road surface 6 is wet and increases faster than the detecting element 1 when the wet road surface 6 begins to become dry. Therefore, the inter-electrode resistances of the detecting elements 1 and 2 are compared with each other to accurately judge the state of the road surface 6 from a combination of a high-resistance case and a low-resistance case.
Patent JP-H10103921-A (JP)
Title: Measuring method for cross section of work by optical cutting method
Inventor: ODA KOJI
IPC: G06T1/20
Filed: 1996-09-30
Abstract: PROBLEM TO BE SOLVED: To obtain a measuring method in which the equation of an image line closely resembled to an image part continued to a prescribed feature part in an optical cutting image is found precisely in a short time. SOLUTION: On the basis of data on the optical cutting image of a master work, a template TP which expresses the shape of a specific feature part Sa is created. A pattern matching operation is performed to a photographed image in a work measuring operation by using the template TP, and the position of a point Pam1 corresponding to the feature point Sa is calculated. Positions of a point Pam0 and a point Pam2 which correspond to end parts of an image part used to compute an image line are computed by connecting teaching data according to a deviation amount from the reperence position of the point Pam1.  A plurality of scanning lines L are set between the point Pam1 and the point Pam0 anal between the point Pam1 and the point Pam2, and the coordinates of image points PS which agree with the respective measuring lines L in the optical cutting image S of the work are detected on the basis of a luminance distribution on the respective scanning lines L. On the basis of the coordinates of the image points Ps, the equation of image lines LS1, LS2 is computed by a regression processing operation.
Patent JP-H11171853-A (JP)
Title: Solvent and new electrolytic composition having large range of stability and high conductivity
Inventor: MICHOT CHRISTOPHE
IPC: H01M10/36
Filed: 1998-09-11
Abstract: PROBLEM TO BE SOLVED: To obtain a solvent having greatly highly polar amide functional groups and enabling the preparation of highly stable electrolytic compositions useful for electrochemical uses. SOLUTION: This solvent comprises an aprotic polar compound of formula I [X is C or SO; Z is O, NSO2 NR3 R4 (R3 and R4 are each a 1-18C alkyl or the like (or NCN; R<1> and R<2> are a 1-18C alkyl, a 1-18C oxaalkyl or the like; R<7> is RF (RF is a fluorine atom, a 1-4C alkyl or the like), RFCH2 O, NR<5> R<6> (R<5> and R<6> are the same as R<3> and R<4> , respectively) or the like with the provisos that if Z is O, RF is then not a 1-4C alkyl; if Z and X are O and SO, respectively, R<5> and R<6> are then not each a 1-4C alkyl or a 1-4C oxyalkyl] having solubility. The compound of formula I includes a polar compound of formula II. The polar compound is mixed with a soluble salt, a salt having an anion having a delocalized charge and at least one kind of polymer to obtain an electrolytic composition.
Patent JP-H02105491-A (JP)
Title: Resistance wiring board
Inventor: AKAO KIYOSHI
IPC: H01C13/02
Filed: 1988-10-13
Abstract: PURPOSE:To make easy a peripheral circuit which can be handled similarly to a final product having a resistor contained and not to make a mounting area be increased by a method wherein terminals are provided on an insulating substrate in correspondence to the lead terminals of a semiconductor device, a resistor layer is provided to an insulating substrate, and the section between the resistor layer and the terminals is connected with a conductive layer. CONSTITUTION:Holes 1 corresponding to respective positions of lead terminals of a semiconductor device, to which lead terminals are inserted, are provided on two opposing sides of an insulating substrate. A conductive layer 5 and a resistor layer 6 connected to the conductive layer 5 are provided on an insulating substrate 2 between a terminal 3 corresponding to lead terminals for which a mask option can be specified and a terminal 4 corresponding to the power supply terminal provided in the holes 1 and a resistor circuit is formed, constituting a resistor wiring board.
Patent JP-S60186241-A (JP)
Inventor: SEODOA EE HAADEN
IPC: A01M7/00
Filed: 1984-12-07
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S60142636-A (JP)
Inventor: FUIRITSUPU DEBITSUDO HOWAITO
IPC: H04M1/72511
Filed: 1984-12-07
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-S61137776-A (JP)
Title: Recording medium
Inventor: KAWADA HARUNORI
IPC: G11B7/249
Filed: 1984-12-10
Abstract: PURPOSE:To obtain a recording medium having high sensitivity and high resolution, by constituting the medium of a monomolecular film or a built-up film thereof of a metal chelate compound having a specified bond capable of cis-trans isomerization to liberate metal ion or metal atom when being irradiated with light and a support for the film. CONSTITUTION:The recording medium comprises, for exampl, a two-layer built-up film of chelate complex molecules consisting of cis-form chelate ligand molecules 1 and metal ions (or metal atoms) 3 provided on a glass base 4. The medium is immersed in a liquid phase 5 contained in a container having a transparent glass plate 6 as a bottom wall, and is irradiated with trans-form isomerizing light 7 such as UV rays and visible rays to induce photo- isomerization of formula (i), whereby rearrangement into trans-form chelate ligand molecules takes place, and metal ions 3 are librated. When the recording medium thus having liberated the metal ions 3 is taken out and is dried, the reverse isomerization will not occur. Accordingly, the recording medium with information recorded therein is obtained. The information thus recorded is read by irradiating the medium with light.
Patent JP-H10106675-A (JP)
Title: Pc card connector
Inventor: NAKAMURA HIDEHIRO
IPC: H01R13/629
Filed: 1996-09-30
Abstract: PROBLEM TO BE SOLVED: To make a required number of pin housings in common and reduce the cost. SOLUTION: At both ends of a pin housing into which a number of pin contacts are pressed and fixed, a pair of arms 18 are integrally molded. Recessed grooves are formed in the centers on the side faces of these arms 18 to be extended to the inserting/removing direction of a PC card. A shroud is fixed to the upper face of the pin housing and a drive lever and a rotationally movable lever are supported on the lower face in a rotationally movable manner to form one header 2. Two protrusions 5 are formed on one frame 1 to be extended to the inserting/removing direction of the PC card and parted into positions, equally far from the center of the frame 1.  In the condition that the headers 2 in the same structure are layered at two upper and lower stages, the same-shape frames 1 are inserted into the respective arms 18 of both pin housings provided for the headers 2 and the protrusions 5 on the frames 1 are snap-joined to the recessed grooves in the pin housings so that the pin housings for the upper and lower headers 2 can be integrated with the right and left frames 1.
Patent JP-H1196014-A (JP)
Title: Device and method for distributing program component
Inventor: TOMONO MASAHIRO
IPC: G06F13/00
Filed: 1997-09-25
Abstract: PROBLEM TO BE SOLVED: To efficiently retrieve a usable program component by displaying a program component list menu on the client side and enabling a user to select any program component. SOLUTION: At a client part, an anchor display means 4 displays an anchor included in program components on a screen and dispatches the anchor selected by the user to a program component information acquiring means 5. The program component information acquiring means 5 dispatches the data type of that anchor to a program component name retrieving means 2 at a server part and acquires a program component name executable to that data type. A program component information display means 6 displays the list of program component names provided by the program component information acquiring means 5 on a screen and waits the selection of the user. A program component acquiring means 7 dispatches the program component name selected out of the program component name list by the user to a program component retrieving means 3 and acquires the relevant program component.
Patent JP-H01102986-A (JP)
Title: Manufacture of circuit block using printed board
Inventor: TAKIGAMI KOTARO
IPC: H05K1/02
Filed: 1987-10-16
Abstract: PURPOSE:To cut off one circuit pattern side from the other circuit pattern side easily by dividing a printed board along a V-groove after line operations such as mounting and soldering of circuit parts of a block are finished. CONSTITUTION:A V-groove 5 is formed to divided a printed board 1 into two across the printed board 1 through a connecting section 3. Since the machine to form the V-groove 5 is constituted to form the V-groove 5 on the printed board 1 whereon nothing is mounted, the V-groove 5 should be formed in advance before circuit parts are mounted. If the printed board 1 is divided in the first place, operations such as mounting and soldering of the circuit parts by using a line to manufacture a unit which has both a standard circuit block and an option circuit block can not be conducted; therefore, the V-groove 5 should be shaped to an extent that the printed board 1 is not divided. When the V-groove 5 is shaped, the connecting section 3 is cut off.
Patent JP-S61126127-A (JP)
Inventor: HERUMAN ANTSUINGERU
IPC: C08L27/02
Filed: 1985-11-18
Abstract: (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。
Patent JP-H10206895-A (JP)
Title: Production of liquid crystal display element
Inventor: LIM KYOUNG NAM
IPC: G02F1/136
Filed: 1997-09-25
Abstract: PROBLEM TO BE SOLVED: To prevent the generation of disclination by the differences in level of light shielding layers and to improve image quality by irradiating oriented films with light and determining the orientation directions thereof. SOLUTION: Amorphous silicon is laminated by a CVD method on a gate insulating film 111 and is etched to form a semiconductor layer 113 and thereafter, metals, such as Cr, Ti or Al, are laminated thereon and are photo-etched to form source/drain electrodes 104 and data wirings on the semiconductor layer 113. Transparent electrodes are laminated by a sputtering method in pixel regions and are etched, by which the pixel electrodes 105 are electrically connected to the source/drain electrodes 104. After a protective film 116 is formed, a black resin is applied to form the light shielding layers 106, i.e., black matrices. A light orienting material like a polysiloxane material is then applied over the entire surface of the substrate 110 to form the oriented film 118 and, thereafter, the oriented film 118 is irradiated with light, by which the orientation direction is determined.
Patent JP-H04137540-A (JP)
Title: Connection method for semiconductor chip with substrate
Inventor: ISHII HIROMITSU
IPC: H05K3/34
Filed: 1990-09-27
Abstract: PURPOSE:To surely and easily connect a semiconductor chip with a substrate and obtain high reliability, by a method wherein, after solder protruding parts composed of solder are previously formed on electrode parts, solder bumps and the solder protruding parts are connected by heating and fusing. CONSTITUTION:Flux is spread on the whole surface of a solder dam layer 3 and protruding parts 6, A semiconductor chip 5 is temporarily fixed on the region of the solder protruding parts 6 or at the position of the solder dam layer 3, by using a face down bonding equipment. Solder bump connection electrode parts 2 and solder bumps 4 are electrically connected by a reflow process. When the solder bumps 4 are temporarily fixed at a position on the solder dam layer 3, on account of the irregularity of mounting precision of the bonding equipment, the solder bumps are easily absorbed in the solder protruding parts 6, because the solder protruding parts 6 are formed on the solder bump connection electrode parts 2. Thereby self-alignment effect is improved, and an ideal shape of solder bump connection (barrel shape) is obtained, so that the semiconductor chip 5 can be easily connected with the substrate 1 and high reliability is obtained.
Patent JP-H04247092-A (JP)
Title: Phosphorus compound
Inventor: HANSUUPEETAA HEERUNAA
IPC: C07F9/30
Filed: 1991-09-11
Abstract: PURPOSE: To obtain a novel phosphorus compd. which has a self-annihilation property and is extremely excellent as a flame retardant for a polymer not contg. halogen by bringing dicarboxylic anhydrides into reaction with an equal. molar ratio of specific phosphinic acid at a high temp.  
     CONSTITUTION: The novel phosphorus compd. expressed by formula IV or formula V is obtd. by bringing the dicarboxylic anhydrides expressed by formula I (R 1 , R 2  are H, alkyl, alkenyl, aryl, alicyclic group made together with the carbide atom of an α-position with respect to a carbonyl group, etc.; R' 3 , R 4  are H, alkyl, alkenyl, aryl, etc.), or formula II (e.g.; 4-methylclohexye-4- endicarboxylic anhydride, etc.), into reaction with approximately the equal molar ratio of the phosphinic acid (e.g.; ethyl methyl phosphinic acid, etc.), expressed by formula III (R 5 , R 6  are alkyl, aryl, etc.), by vigorous stirring for 4 hours at 100°C in a nitrogen atmosphere. 
     COPYRIGHT: (C)1992,JPO
Patent JP-S62120123-A (JP)
Title: Latch method for rom output
Inventor: KUSANO MASASHI
IPC: H03L7/08
Filed: 1985-11-20
Abstract: PURPOSE:To operate a ROM without error while being operated at a low frequency by providing a latch clock generator, dividing the frequency of the oscillated clock, detecting a phase error of a phase set signal at the same time so as to inhibit the generation of the latch clock during the phase set period. CONSTITUTION:A phase set signal generator 5 detects that the phase difference between a counter 2 and a synchronizing signal is small and inhibits the output of a phase set signal C, then since the counter 2 is operated by a self-set signal (b) only, only the oscillation frequency of a oscillator VCO1 adjusts the phase of the counter 2. When the signal (b) is inputted to the counter and a basic latch clock signal (g) rises, an output (i) of a ROM 3 is latched stably and surely. On the other hand, when the set signal generator 5 detects a large phase error in an input synchronizing signal, the counter 2 is set by 4 phases in response to the error amount and a latch clock inhibiting the latch of the ROM output just after the setting is generated.
Patent JP-H1058864-A (JP)
Title: Movable schedule program with today's column always placed at home position
Inventor: KISHIGAMI YOSHIHIRO
IPC: B42D15/00
Filed: 1996-08-23
Abstract: PROBLEM TO BE SOLVED: To provide a method for facilitating counting of the number of days with easy observation and without erroneous description and without erroneous recognition by forming the program in a movable type, and operating every day so that today is always moved to a home position such as an endmost end. SOLUTION: A plurality of struts are rotated to form schedule program fill-in columns 2 in a movable type along the struts. The columns 2 of the program are moved by one column per one day so that the column 3 of today is always retained at a predetermined position such as an endmost left end. Thus, in other words, when the program is observed, today can be immediately found to be what month, what day and what day of the week, and the column of that day and schedule of that day are discovered. A scale of number of days counted from that day is punched in an immovable outer frame 1.
Patent JP-H04135802-A (JP)
Title: Cutting device for pottery body
Inventor: YASUI MASAYOSHI
IPC: B28B11/12
Filed: 1990-09-28
Abstract: PURPOSE:To make the positive vibration damping with good vibration clamping effect possible by a method wherein the vibration, which is normal, to the axis of an inner surface cutting rod, of a cutting edge is detected so as to obtain vibration damping controlling signal by converting the phase and amplitude of vibration signal. waveform in order to generate the vibration normal to the axis and transmit the vibration to the basic part of the inner surface cutting rod. CONSTITUTION:An inner surface cutting mechanism 10 consists of an inner surface cutting rod 60, which is movable back and forth, and a cutting edge 36, which is provided at the tip of the rod. The inner surface of a pottery body 50 is automatically cut by inserting the cutting edge 36 in the interior space 50a of the pottery body 50, which is rotated with a rotary potter's wheel. In this case, an acceleration pickup 32 is attached to the tip 60a of the inner surface cutting rod 60 so as to detect the chattering vibration Fe and send acceleration signal. from an accelerometer to a controller in order to produce vibration damping controlling signal by converting the phase and amplitude of acceleration signal waveform. Next, at an actuator 34, vibration Fc, which is proportional to the vibration clamping controlling signal and normal to the axis A of the inner surface cutting rod, is generated so as to vibrate a linear guide 33 in order to transmit said vibration to the basic part 60, which is fixed to the linear guide, resulting in all-owing to realize the positive vibration damping of the tip of the rod.