baber/WOPTO huggingface dataset:
Patent TW-200745390-A (TW)
Title: Method and device for processing a semiconductor wafer by etching
Inventor: FEIJOO DIEGO
IPC: C30B33/10
Filed: 2007-05-09
Abstract: The present invention relates to a method for treating a semiconductor wafer, comprising the following steps in the order indicated: (a) position-dependent measurement of a parameter characterizing the semiconductor wafer, in order to determine the position-dependent value of this parameter over an entire surface of the semiconductor wafer, (b) applying an etchant with a viscosity of from 50 mPas to 2000 mPas onto this entire surface of the semiconductor wafer, (c) etching treatment of the entire surface of the semiconductor wafer by action of the etchant with simultaneous exposure of this entire surface to light, the removal rate of the etching treatment being dependent on the light intensity on the surface of the semiconductor wafer, and the light intensity being specified position-dependently so that the differences in the position-dependent values of the parameter as measured in step (a) are reduced by the position-dependent removal rate, and (d) removing the etchant from the surface of the semiconductor wafer. The invention also relates to a device for carrying out the method according to the invention.
Patent TW-200845150-A (TW)
Title: A method of real-time monitoring implantation
Inventor: WANG TA-YUNG
IPC: H01L21/265
Filed: 2007-05-09
Abstract: A method of real-time monitoring implantation includes plotting a calibration curve of implantation first. Next, a testing substrate covered a photoresist is provided and then implanted. Since the surface roughness of the photoresist will be changed after implantation, the extent of the surface roughness changed could be quantified by measuring a scattering light. Finally, the scattering value is scaled by using the calibration curve of implantation to analyze if a condition of implantation monitored is acceptable or not.
Patent TW-200807169-A (TW)
Title: Lithographic apparatus and lithographic apparatus cleaning method
Inventor: STAVENGA MARCO KOERT
IPC: G03F7/20
Filed: 2007-05-16
Abstract: An immersion lithographic projection apparatus having a megasonic transducer configured to clean a surface and a method of using megasonic waves to clean a surface of an immersion lithographic projection apparatus are disclosed.
Patent TW-200807912-A (TW)
Title: Optical transceiver device
Inventor: SHIBAYAMA KATSUMI
IPC: H01S5/022
Filed: 2007-05-17
Abstract: Provided is a light transmitting/receiving device which can accurately detect light entered from external. On a front plane (27a) of a light transmitting member (27) in the light transmitting/receiving device (1), a groove (28) is formed. The groove passes between an opening section (22) and a pin hole (23) when viewed from the front, and opens on the side plane of the light transmitting member (27). A light blocking resin section (3) reaches inside the groove (28). Thus, even when a part of light outputted from an LD (9) is multiply reflected in the light transmitting member (27), the light blocking resin section (3) in the groove (28) prevents the multiply reflected light from reaching a PD (12) as unnecessary light. Therefore, a noise current due to such unnecessary light is prevented from being detected, and the light entered from external can be accurately detected.
Patent TW-200811240-A (TW)
Title: Polylactic acid based heat-resistant sheet
Inventor: INUI YUKIKO
IPC: B29C51/00
Filed: 2007-05-31
Abstract: Provided is a polylactic acid based heat-resistant sheet appropriate for forming processing, which includes 50 to 95 mass% of polylactic acid, and 5 to 50 mass% of polylactic acid based copolymer containing 30 to 70 mol% of lactic acid component, wherein crystallization peak temperature is 60 to 120 DEG C, crystallization heat quantity is 10 to 25 J/g, melting point is equal to or more than 160 DEG C, crystallization melting heat quantity is 15 to 40 J/g when the sheet is measured by a differential scanning calorimeter and the temperature thereof is increased at a rate of 20 DEG C/min.
Patent TW-200809719-A (TW)
Title: Method and device for driving a lamp
Inventor: BREMER PETRUS JOHANNES
IPC: G09G3/10
Filed: 2007-06-08
Abstract: A method is described for driving a lamp with a periodic signal (L) having a frame period (t13 - t11), the periodic signal (L) being a block-shaped signal during an ON-interval (t11 to t12) of said frame period and being zero during an OFF-interval (t12 to t13) of said frame period. Said block-shaped signal has a duty cycle of 50% and a block period (t22 - t11) smaller than said frame period. The duration (t12 - t11) of said ON-interval (t11 to t12) of said frame period is equal to an integer number times said block period (t22 - t11). According to the invention, the beginning (t11) of said ON-interval (t11 to t12) of said frame period coincides with a phase 90 DEG of said block-shaped signal.
Patent TW-200824129-A (TW)
Title: Semiconductor device
Inventor: OHMI TADAHIRO
IPC: H01L21/8238
Filed: 2007-06-27
Abstract: A transistor is obtained in which a threshold value is adjusted by adjusting an impurity concentration of a silicon substrate supporting a SOI layer and by controlling the thickness of a buried insulating layer formed on a surface of the silicon substrate and contacted with the SOI layer.
Patent TW-200808325-A (TW)
Title: Novel compounds
Inventor: HALSALL CHRISTOPHER THOMAS
IPC: A61P35/00
Filed: 2007-06-28
Abstract: There is provided a compound of formula (I): processes for the manufacure thereof, pharmaceutical compoitions thereof and uses in therapy.
Patent TW-200815942-A (TW)
Title: Wafer-level alignment of optical elements
Inventor: GOEBEL ANDREAS
IPC: G03F9/02
Filed: 2007-07-02
Abstract: Methods are disclosed of fabricating an optical assembly. An active optical element is disposed near or on a first surface of a slab of optical material. A passive optical element is formed on a second surface of the slab, with the second surface being substantially parallel to the first surface. An optical axis of the passive optical element is aligned with an optical path between the passive optical element and an active region of the active optical element using a lithographic alignment process.
Patent TW-200816353-A (TW)
Title: Octagon transfer chamber
Inventor: WHITE JOHN M
IPC: H01L21/677
Filed: 2007-07-24
Abstract: A method and apparatus for processing substrates in a cluster tool is disclosed. The transfer chambers of the cluster tool have eight locations to which additional chambers (i.e., load lock, buffer, and processing chambers) may attach. The transfer chamber may be formed of three separate portions. The central portion may be a rectangular shaped portion. The two other portions may be trapezoidal shaped portions. The trapezoidal shaped portions each have three slots through which the substrate can move for processing. The central portion of the transfer chamber may have a removable lid that allows a technician to easily access the transfer chamber.
Patent TW-200905041-A (TW)
Title: Method of manufacturing safety cone by utilizing recycled material
Inventor: LI JIN-TAI
IPC: E01F9/012
Filed: 2007-07-25
Abstract: A method of manufacturing a safety cone by utilizing recycled material is disclosed, comprising the steps of: placing recycled material in a forming machine, in which the recycled material is formed as a safety cone blank; and coating paint containing plastic powder, solvent and dyeing agent on the surface of the safety cone blank, such that the safety cone blank is formed as a colored safety cone. Thus, a colored safety cone made of recycled material with lower production cost can be provided by this invention.
Patent TW-200905546-A (TW)
Title: Harddisk security method
Inventor: CHO SHU-CHING
IPC: G06F3/06
Filed: 2007-07-31
Abstract: A harddisk security method, provides a security mechanism combining with the power-on password function for the storage data in a harddisk. By restoring the partition table into the BIOS ROM in advance, and erasing the partition table of the harddisk, thus the harddisk is secured.
Patent TW-200907234-A (TW)
Title: LED lamp
Inventor: LEE TSUNG-LUNG
IPC: F21V29/00
Filed: 2007-08-03
Abstract: An LED lamp includes a lampshade, a plurality of LEDs received in the lampshade, and a heat dissipation device. The heat dissipation device includes a heat-absorbing portion received in the lampshade, a heat-dissipating portion positioned outside of the lampshade, and a heat pipe with an evaporator and a condenser. The heat-dissipating portion includes a base and a plurality of fins extending from an outer periphery of the base. The evaporator of the heat pipe contacts with the heat absorbing portion, and the condenser of the heat pipe contacts with the base of the heat-dissipating portion. The LEDs are distributed on the heat-absorbing portion.
Patent TW-200908869-A (TW)
Title: Shielding structure for electronic devices and method of manufacturing the same
Inventor: HUANG ZHONG-E
IPC: H05K9/00
Filed: 2007-08-08
Abstract: A shielding structure for electronic devices includes a circuit board, at least one electronic module disposed on the circuit board and electrically connected thereto, at least one first covering layer, at least shielding layer, and one second covering layer. Each first covering layer is connected on the exterior of one electronic module and the exterior of each first covering layer is covered by a shielding layer. Furthermore, the second covering layer covers the shielding layers. In the above-mentioned structure, the shielding layer is formed by a coating method or a printing method on the exterior of the first covering layer for shielding electromagnetic field so that the process is provided for reducing the cost and time of the production.
Patent TW-200832559-A (TW)
Title: Manufacturing method of semiconductor device
Inventor: FUTASE TAKUYA
IPC: H01L21/768
Filed: 2007-09-10
Abstract: An object of the invention is to avoid an inconvenience at a connection portion formed by filling a metal film in a connecting hole, which has been opened in an insulating film, via a barrier metal film having a titanium nitride film stacked over a titanium film. A manufacturing method of a semiconductor device has the steps of: forming a thermal reaction Ti film over the bottom of a connecting hole by a thermal reaction using a TiCl4 gas; forming a plasma reaction Ti film by a plasma reaction using a TiCl4 gas; forming a nitrogen-rich TiN film over the surface of the plasma reaction Ti film by plasma treatment with H2 and plasma treatment with NH3 gases; repeatedly carrying out film formation by CVD using a WF6 gas and reduction using an SiH4 or B2H6 gas to form a tungsten nucleation film of a multilayer structure over the nitrogen-rich TiN film; and forming a blanket.tungsten film at 400 DEG C. or less by CVD using WF6 and H2 gases. This makes it possible to avoid an inconvenience at a connection portion formed by filling a metal film in a connecting hole, which has been opened in an insulating film, via a barrier metal film having a titanium nitride film stacked over a titanium film.
Patent TW-200832558-A (TW)
Title: Method for integrated substrate processing in copper metallization
Inventor: SUZUKI KENJI
IPC: H01L21/3213
Filed: 2007-09-13
Abstract: A method of copper metallization includes providing a patterned substrate containing a via and a trench, and performing an integrated process on the patterned substrate. The integrated process includes depositing a first metal-containing layer over the patterned substrate, removing by sputter etching the first metal-containing layer from the bottom of the via and at least partially removing the first metal-containing layer from the bottom of the trench, depositing a conformal Ru layer onto the sputter etched first metal-containing layer, depositing a Cu alloying metal layer onto the conformal Ru layer, and plating Cu over the patterned substrate. According to one embodiment, the method can further include depositing a second metal-containing layer onto the sputter etched first metal-containing layer prior to depositing the conformal Ru layer. According to another embodiment, a Cu alloying metal may be deposited onto the plated Cu and the plated Cu annealed.
Patent TW-200831657-A (TW)
Title: Antistatic composition and molding thereof
Inventor: TAKAMA HIDEYUKI
IPC: C08L23/02
Filed: 2007-10-02
Abstract: An antistatic composition comprising a polyolefin of below 2.5 g/10min melt flow rate and a polymer antistatic agent.
Patent TW-200833037-A (TW)
Title: Method and apparatus for multiple scrambling code impairment compensation
Inventor: LINDOFF BENGT
IPC: H04B7/216
Filed: 2007-10-05
Abstract: In one or more embodiments, a receiver circuit generates impairment correlation estimates for a desired signal that are compensated for the use of different transmission scrambling codes in transmitting the desired signal and an associated pilot signal. In one embodiment, an impairment correlation estimation method comprises determining impairment correlation estimates from a pilot signal in a received CDMA signal, adapting the impairment correlation estimates for scrambling code effects if the desired signal and pilot signal are transmitted under different transmission scrambling codes, and performing one or more signal processing operations with respect to the desired signal based on the impairment correlation estimates. For example, in at least one embodiment, the receiver circuit is configured to compensate elements of an impairment correlation matrix that correspond to signal delays of the desired signal based on transmit power allocation differences between pilot and desired signal scrambling codes.
Patent TW-200824685-A (TW)
Title: Novel vinylogous acids derivatives II
Inventor: BANNER DAVID
IPC: A61K31/381
Filed: 2007-10-09
Abstract: The invention is concerned with novel vinylogous acid derivatives of formula(I) wherein A and R1 to R5 are as defined in the description and in the claims, as well as physiologically acceptable salts thereof. These compounds inhibit chymase and can be used as medicaments.
Patent TW-200916366-A (TW)
Title: Shock absorber damping power device
Inventor: WANG JUNE-CHI
IPC: B62K25/28
Filed: 2007-10-12
Abstract: Shock absorbers are widely used and well designed in mechanism field, especially in vehicles like cars and bikes. A shock absorber consists of a sprig to take the vertical shock forces, and a damping system to consume energy and slow down the vertical motion. This invention is to use the energy consumed by the damping system as power supply through the relative moving of the shock absorber's parts. Basically a pulley is pulled and rotated by a steel wire as the relative motion between the piston lever and the sleeve of the shock absorber. The pulley rotates a one-way gear to save the work for the bike-rider when the shock absorber is vibrated. A damping spring system and a clutch system are incorporated into this invention also.
Patent TW-200824034-A (TW)
Title: Semiconductor device and method for forming the same
Inventor: KWAK DONG-HWA
IPC: H01L21/74
Filed: 2007-10-19
Abstract: In one embodiment, a semiconductor device includes odd contacts and respective odd lines. Spacers are formed on sidewalls of the odd lines and even openings for even lines are formed by performing an etching process. Even contacts are formed in the even openings and then even lines are formed.
Patent TW-200837202-A (TW)
Title: Composite material and method for producing the same
Inventor: KON TATSUICHIRO
IPC: C22C49/14
Filed: 2007-10-26
Abstract: Disclosed is a composite material having excellent thermal conductivity and high heat dissipation performance. The composite material has a thermal expansion coefficient close to those of Si, InP and GaAs as typical semiconductor substrate materials, and when such semiconductor substrate materials are directly arranged on the composite material, there is generated only little thermal stress. Specifically disclosed is a composite material containing a pitch-based graphitized carbon fiber (component A) having an average fiber diameter of 0.1-30 μm and a true density of 2.0-2.5 g/cc and a matrix metal (component B). In this composite material, the volume ratio between the component A and the component B (A/B) is from 20/80 to 90/10.
Patent TW-200826973-A (TW)
Title: Method of micronization
Inventor: NUR ISRAEL
IPC: A61K9/19
Filed: 2007-10-30
Abstract: A method for micronization of a dispersion of particles comprising a protein having a predetermined level of biological activity. The method comprises introducing the dispersion into a vortex chamber milling apparatus under milling conditions which result in a protein powder having a particle size distribution of 5 to 100 μm and/or exhibiting a 30 to 400 fold size reduction of the protein particle dispersion from its original size, retaining at least 80% of the predetermined level of biological activity of the protein. The milling conditions include one or more parameters selected from the following; input pressure between 1 and 7 Bars; injector pressure between 0.2 and 5 Bars; loading rate between 0.1 and 5 kg/hour; and gas flow between 30 and 100 m3/hour.
Patent TW-200922282-A (TW)
Title: Method for adjusting size of facsimile image and image processing apparatus using the same
Inventor: WANG TSAI-FA
IPC: H04N1/32
Filed: 2007-11-06
Abstract: Method for adjusting the size of facsimile image is disclosed. The method is employed by the image processing apparatus to directly adjust the size of the facsimile image during the facsimile process of transmitting the image of an object to a receiver. The method includes the steps of (a) scanning the image of an object into a scanned image and storing the scanned image; (b) adjusting the size of the scanned image and generating a facsimile image having a size with a zoom in/out ratio relative to that of the scanned image; and (c) transmitting the adjusted facsimile image to the receiver.
Patent TW-200923462-A (TW)
Title: Camera lens of digital image capturing device and its packaging method
Inventor: LIN ZHI-MING
IPC: G02B7/04
Filed: 2007-11-27
Abstract: The present invention provides a camera lens of a digital image capturing device and its packaging method. The camera lens includes a base, a lens member and a fixing member. The base is provided with an accommodation room with an opening on the top thereof. The lens member is assembled in the accommodation room. The fixing member includes a washer, a light penetrating plate and adhesive glue. A concave trough is defined in the top surface of the washer. Next, the washer is assembled to the outside of the lens member, and the outside of the concave trough of the washer is spotted with adhesive glue. Then, the light penetrating plate is pressed down for being adhered to the washer, wherein the adhesive glue overflowing outward flows to the inner side wall of the base for securely sticking the fixing member to the base, and the excessive adhesive glue overflowing inward flows into the concave trough but not to the lens member. Therefore, it is able to ensure the integrity and quality of the camera lens of the digital image capturing device, thereby satisfying the requirement of the market and possessing competitiveness in the market.
Patent TW-200840070-A (TW)
Title: Method and device for producing an anti-reflection or passivation layer for solar cells
Inventor: TRASSL ROLAND
IPC: H01L21/34
Filed: 2007-12-12
Abstract: The present invention relates to a method of producing an anti-reflection and/or passiviation coating for solar cells comprising the steps of providing a silicon wafer in a deposition chamber, pre-heating of said silicon wafer to a temperature above 400 DEG C and deposition of a hydrogen containing anti-reflection and/or passiviation coating by a sputter process as well as to a coating apparatus for producing solar cells, especially anti-reflection and/or passiviation coatings on Si wafers, especially for carrying out the invention method, comprising a first vacuum chamber (1), a second vacuum chamber (2) and conveying means (4) for transporting a substrate (5) through said first and second vacuum chambers in this order, said first vacuum chamber comprising at least one infrared radiation heater (16) being capable to be heated such that a heater filament has a temperature between 1800 DEG C and 3000 DEG C and said second vacuum chamber comprising sputter means (12) for vaporization of a target as well as a gas inlet for introducing a reactive gas including hydrogen.
Patent TW-200928276-A (TW)
Title: Organic anti-oxidant coating for gas heat transfer apparatus and manufacturing method thereof
Inventor: Wang bai-yu
IPC: F28F21/04
Filed: 2007-12-28
Abstract: An organic anti-oxidant coating for gas heat transfer apparatus which can sustain in high temperature environment. This coating have high thermal conductivity and high specific surface area attribute. Thus this coating can conspicuously improve performance of heat transfer compare to prior art copper or aluminum tube with lead or zinc anti-oxidant coating.
Patent TW-200841104-A (TW)
Title: Array substrate and method for manufacturing the same
Inventor: CHANG CHUN-HUAN
IPC: H01L29/786
Filed: 2008-01-03
Abstract: An array substrate is disclosed, which includes a pixel electrode, a TFT, and a storage capacitor line. The pixel electrode is disposed on the pixel composed of a scan line and a data line. The TFT includes a source, a drain, and a gate, which connects to the data line, the pixel electrode and the scan line, respectively. The storage capacitor line is disposed parallel to the data line, and an extending portion of which is parallel to the scan line. The storage capacitor line is formed with the data line at the same time by patterned. A method for manufacturing the array substrate is also provided.
Patent TW-200913482-A (TW)
Title: Current mode logic-complementary metal oxide semiconductor converter
Inventor: KIM KYUNG-HOON
IPC: H03K19/0175
Filed: 2008-01-10
Abstract: A current mode logic (CML)-complementary metal oxide semiconductor (CMOS) converter prevents change of a duty ratio to stably operate during an operation for converting a CML level signal into a CMOS level signal. The CML-CMOS converter includes a reference level shifting unit configured to receive a CML signal swinging about a first reference level to shift a swing reference level to a second reference level; and an amplifying unit configured to amplify an output signal of the reference level shifting unit to output the amplified signal as a CMOS signal.
Patent TW-200903592-A (TW)
Title: Gas treatment systems
Inventor: ARMOUR ERIC A
IPC: H01L21/205
Filed: 2008-01-11
Abstract: An MOCVD reactor such as a rotating disc reactor (10) is equipped with a gas injector head having diffusers (129) disposed between adjacent gas inlets. The diffusers taper in the downstream direction. The injector head desirably has inlets (117) for a first gas such as a metal alkyl disposed in radial rows which terminate radially inward from the reactor wall to minimize deposition of the reactants on the reactor wall. The injector head desirably also has inlets (125) for a second gas such as ammonia arranged in a field between the rows of first gas inlets, and additionally has a center inlet (135) for the second gas coaxial with the axis of rotation.
Patent TW-200932448-A (TW)
Title: Locking structure for a tool head
Inventor: CHEN BO-SHEN
IPC: B25F3/00
Filed: 2008-01-18
Abstract: A locking structure for a tool head comprises a body and a control ring. A receiving groove is defined axially in the body, a radial movable positioning member is disposed on the body, and the control ring is mounted outside the body. By rotating the control ring to drive the positioning member to move out of the receiving groove, the tool head can be disengaged from the receiving groove, and the body can be inserted in a handle or a pneumatic tool. By such arrangements, the body can work together with the head tool.