baber/WOPTO huggingface dataset:
Patent TW-503161-B (TW)
Title: Apparatus and method for making electro-depositted grinding stone
Inventor: TAKAHASHI TSUTOMU
IPC: B24D7/14
Filed: 2000-12-20
Granted: 2002-09-21
Abstract: The object of this invention is to improve the cutting quality and life, and reduce the manufacturing cost. In this invention, an abrasive grain layer 13 made of a plurality of abrasive grain layer parts 12 is provided on the surface 11a of a grinding wheel substrate 11, and the abrasive grain layer parts 12 are connected together by bridge parts 9. Non-abrasive grain parts 22 are provided between the abrasive grain layer parts 12. Super-abrasive grains 14 are densely arranged at the central part 12a of each abrasive grain layer part 12 and coarsely arranged at peripheral parts 12b. The metal coupling phase for fixing the super-abrasive grains 14 is formed with first and second metal plating phases 15 and 16. The first metal plating phase 15 is decreased in thickness into a ridge shape from the central part 12a toward the peripheral parts 12b.
Patent TW-540153-B (TW)
Title: BICMOS semiconductor integrated circuit device and fabrication process thereof
Inventor: KONDO MASAO
IPC: H01L27/06
Filed: 2001-02-01
Granted: 2003-07-01
Abstract: Provided is a BiCMOS semiconductor integrated circuit device which comprises a semiconductor substrate having an insulating layer internally and partially embedded therein and a plurality of semiconductor layers deposited on the dielectric layer; an n channel insulated gate type transistor and a p channel insulated gate type transistor formed in the semiconductor layers, a highly-doped collector layer embedded in an insulating-layer-free portion of the semiconductor substrate, and a lightly-doped collector layer disposed on the highly-doped collector layer of the bipolar transistor, in which the height level of the lower portion of the lightly-doped collector layer is below the height level of the lower portion of the dielectric layer.
Patent TW-532018-B (TW)
Title: Fax receive control system
Inventor: HUANG JEN-PENG
IPC: H04L29/02
Filed: 2001-03-09
Granted: 2003-05-11
Abstract: The invention provides a fax receive control system, including additional microprocessor in fax system, ring detection device and tone responding device. The microprocessor receives DTMF telecommunication signal and ascertain whether the decoded signal by decoding circuit is identical to internal key data or not, if yes, the calling number is accepted. The ring detection device gets the ring signal input from DTMF telecommunication signal and goes through test of multi-band component to compensate frequency variation and oscillate different frequency for activation of a buzzer. The tone responding device activates buzzer and control the activation of microprocessor through switch circuit to control normal receiving information and is treated as medium to convert signal of calling party by means of activating decoding circuit with switch circuit.
Patent TW-493153-B (TW)
Title: Display device
Inventor: SEMPEL ADRIANUS
IPC: G09G3/325
Filed: 2001-03-30
Granted: 2002-07-01
Abstract: Grey scale linearity and power efficiency in active matrix (O) LEDs are enhanced by storing the grey value in a memory circuit, coupled to an adjusting circuit, preferably via a current mirror. A display device comprising a matrix of pixels at the area of crossings of row and column electrodes, each pixel comprising at least a current adjusting circuit based on a memory element, in series with a luminescent element, characterized in that the display device comprises means at the area of a pixel for adjusting a current through the luminescent element, as well as switch between a plurality of luminescent elements and a connection point for an operating voltage.
Patent TW-567080-B (TW)
Title: Golf club
Inventor: IWATA MOTOTAKA
IPC: A63B102/32
Filed: 2001-04-27
Granted: 2003-12-21
Abstract: The inventive golf club comprises a head (1) of a metal having a face (2) and a flexural range, defined in the face (2), where the quantity of flexure in a direction perpendicular to the face (2) is at least 45% of the maximum quantity of vertical flexure of the face (2). The flexural range is arranged in coincidence with a hitting spot distribution range of a player in the face (2). Alternatively, a flexural range having a spring constant of at least 2 kN/mm and not more than 4 kN/mm is present in the face (2) of the inventive golf club.
Patent TW-505898-B (TW)
Title: Electricity card billing system
Inventor: GUO TZUNG-YI
IPC: G07C3/00
Filed: 2001-05-17
Granted: 2002-10-11
Abstract: The invention relates to an electricity card billing system that utilizes the interface connection between the card issuing system of IC card and the computer, and the location of IC card planned by the human-machine interface program to write amount and other related data into IC card, acquire the related data of the mentioned IC card with electricity card billing unit and perform calculation of electricity consumption and consumed amount. While reading data of IC card, the electricity cardbilling unit can be connected with a monitoring and control system to conduct the status monitoring, enforced card return, fault detection, rate update and time adjustment
Patent TW-522557-B (TW)
Title: Nonvolatile semiconductor storage device and test method therefor
Inventor: YAMAUCHI YOSHIMITSU
IPC: G11C29/34
Filed: 2001-06-08
Granted: 2003-03-01
Abstract: A control signal MBPRG is inputted to individual block decoders that constitute a block decoder section 37 of an ACT type flash memory. Then, the level of the control signal MBPRG is set to ""H"" to select all the blocks regardless of the contents of address signals a5 through al3, and one word line WL is selected from all the blocks by the addresses a0 through a4. By thus selecting one word line WL every block that is electrically separated by the select transistor and simultaneously applying a write voltage during the test to the same number of word lines WL as the number of blocks, the possible occurrence of a bad influence exerted on the other memory cells is prevented even when the memory cells in which a write operation during the test has been executed include a memory cell that has a negative threshold voltage.
Patent TW-564313-B (TW)
Title: Method and apparatus for testing an integrated circuit, probe card for testing a device under test, apparatus for generating test vectors, computer-readable medium having instructions for testing a device under test and generating test vectors and method
Inventor: COOKE LAURENCE H
IPC: G01R31/00
Filed: 2001-06-28
Granted: 2003-12-01
Abstract: A method of testing an integrated circuit including component blocks of random logic in a manufacturing environment is disclosed. The method includes the steps of performing built-in self tests, at least in part to test memory and data paths of the integrated circuit, performing diagnostics tests, at least in part to test the component blocks of random logic individually, performing stress tests using test vectors, at least in part to test the component blocks of random logic collectively; and performing scan-based tests of the integrated circuit, at least in part to test for structural faults in the integrated circuit.
Patent TW-540216-B (TW)
Title: A method and system with optimal communication expense rate
Inventor: HUANG TIAN-LI
IPC: H04M1/27485
Filed: 2001-07-16
Granted: 2003-07-01
Abstract: A method and system with optimal communication expense rate primarily utilize central server and front end control box to perform optimization of communication expense rate. By means of the dialing information transmitted back to front end control box at the subscriber side, perform the calculation of lowest communication expense rate combination with a spreadsheet in generation of the mapping table of carrier code with each lowest communication expense rate. The mapping table is forwarded to the front end control box so as to alter the dialing conversion mapping table, allowing the front-end control box to automatically apply the mapping table with lowest carrier's communication expense when the subscriber is making call services, such as dialing international phone call.
Patent TW-539706-B (TW)
Title: Modified layered clay material and epoxy/clay nanocomposite containing the same
Inventor: TSAI TSUNG-YEN
IPC: C08K9/06
Filed: 2001-08-17
Granted: 2003-07-01
Abstract: A layered clay material is modified by ion exchange with (1) ZrOCl2 and (2) a silane surfactant. The modified clay material is kneaded with epoxy oligomer and which is cured to produce an epoxy/clay nanocomposite comprising the modified clay material uniformly dispersed in an epoxy polymer matrix. The nanocomposite thus obtained is excellent adhesion and less hygroscopicity, which makes it especially suitable as encapsulating materials for electronic devices.
Patent TW-554442-B (TW)
Title: Low-dielectric silicon nitride film and method of forming the same, semiconductor device and fabrication process thereof
Inventor: CHUNG GISHI
IPC: H01L23/522
Filed: 2001-08-17
Granted: 2003-09-21
Abstract: A method of forming a silicon nitride film includes a CVD process that uses an organic Si compound having an organic silazane bond as a gaseous source. The CVD process is conducted under a condition that the organic silazane bond in the organic Si source is preserved in the silicon nitride film.
Patent TW-511450-B (TW)
Title: Heat dissipation plate with inlay pin and its assembly components
Inventor: SHIE WEN-LE
IPC: H01L23/40
Filed: 2001-08-16
Granted: 2002-11-21
Abstract: Heat dissipation plate with inlay pin and its assembly components are provided. The heat dissipation plate covered the semiconductor use its inverse-hook type inlay pin through the hole of the carrier substrate to fix. The heat dissipation plate is through and hooks the carrier substrate so there is a pressure force. The pressure force provides a pressure control to the covered semiconductor so a well gap control can be gotten and is good for heat dissipation. Besides, because the heat dissipation plat has through holes through the carrier substrate, it is able to produce a grounded conductive layer connecting to the through holes in the carrier substrate to let the heat dissipation plate also has a ground function. Because the heat dissipation plate connects to the semiconductor, the current passing induced noise can be filtered and the inductance can be reduced. The assembly bottom layer is also able to plant tin balls that connect to the circuits of the carrier substrate. When the tin balls connect to the printed circuit board (PCB), the inlay pin of the heat dissipation plate can connects to the PCB to increase the strength, heat dissipation capability and electrical characteristics of the whole package.
Patent TW-I229083-B (TW)
Title: Process for the production of yellow bis(3-[triethoxysilyl]-propyl)-polysulfane
Inventor: KRAFCZYK ROLAND
IPC: C07F7/18
Filed: 2001-09-07
Granted: 2005-03-11
Abstract: Process for the production of yellow bis(3-[triethoxysilyl]propyl)polysulfane with an average sulfur chain length of less than 4 and an iodine colour value of <=10 mg iodine/100 ml, wherein neutral chloropropyltriethoxysilane is mixed with chloropropyltrichlorosilane and then reacted with sodium sulfide (Na2S) and sulfur, disodium tetrasulfide (Na2S4) and Na2S or disodium trisulfide (Na2S3) and Na2S in ethanol.
Patent TW-539936-B (TW)
Title: Information providing system, information image management server, clients, and recording medium recorded with information image management program
Inventor: FUJITA TAKESHI
IPC: G06F17/30
Filed: 2001-10-11
Granted: 2003-07-01
Abstract: The information image management server, the terminal in the advertisement agent and the clients are connected together through the network. According to the information of client specified conditions from the terminal in the advertisement agent, the information image management server will choose the client compliant to the client specified conditions, and send the updating or addendum messages for the information image recorded in the management area for the chosen clients. Thus, the clients receiving the messages can update or add for the information image based on the message.
Patent TW-503678-B (TW)
Title: Manufacturing method of transfer print back adhesive type copper foil with carrier
Inventor: KE JIAN-SHIN
IPC: H05K3/10
Filed: 2001-10-16
Granted: 2002-09-21
Abstract: The present invention is a manufacturing method of transfer print back adhesive type copper foil with carrier, which comprises the following steps: (1) provide a carrier having the first surface; (2) form a metal medium layer on the first surface of the carrier; (3) electroplate copper on the surface of the metal medium layer to form a copper foil layer adhered to the carrier; (4) form an external prepreg layer on the copper foil layer; and (5) proceed drying process to the external prepreg layer to cure it to the unpolymerized quasi-solid state. Thus, the copper foil substrate with super thin copper foil can be formed by direct pressing and laminating the product.
Patent TW-506929-B (TW)
Title: Controller in banding packing machine
Inventor: SHIBAZAKI TOKIO
IPC: B65B13/32
Filed: 2001-11-12
Granted: 2002-10-21
Abstract: It is an object to provide a controller in a banding packing machine which can easily set a correct condition when the controller for clamping, returning and tightening a band has a timing shifted from a predetermined timing. A controller in a banding packing machine comprises a cam shaft (22) to be rotated upon receipt of force from a driving source, a plurality of cams (24, 26, 28) provided in the cam shaft (22), a timing plate (45) provided in the cam shaft (22) and having holes (42, 44, 46) formed corresponding to predetermined positions such that a rotation position of the cam shaft (22) can be detected, and detecting means (50) for detecting that the holes (42, 44, 46) formed on the timing plate (45) reach the predetermined positions, wherein an inching mode is provided in which the rotations of the can shaft (22) is stopped when the detecting means detects the predetermined holes (42, 44, 46) of the timing plate (45).
Patent TW-546153-B (TW)
Title: Luminous device for photo-dynamic therapy
Inventor: LO ADRIAN WING-FAI
IPC: A61N5/00
Filed: 2001-12-25
Granted: 2003-08-11
Abstract: A luminous device for a photo-dynamic therapy comprises a support substrate, a plurality of semiconductor luminous elements mounted on the support substrate, a heat sink bonded to the support substrate, and a fan. The present invention is characterized in that: the support substrate is semi-spherical such that a concentrated photo beam can be generated when above-mentioned plurality of semiconductor luminous elements mounted on the support substrate illuminate. Furthermore, the concentrated photo beam generated by the luminous device can be used to irradiate a medicine for undergoing chemical reaction(s).
Patent TW-552764-B (TW)
Title: Structure of outer rotor brushless motor
Inventor: IKUI KUNIAKI
IPC: H02K29/00
Filed: 2002-02-22
Granted: 2003-09-11
Abstract: The object of the invention is to reduce the magnetic influence of stator winding on a magnetic sensor for detecting the position of permanent magnets to enhance the precision of rotor revolution angle detection. A stator 11 is positioned on the motor fixed side and an output shaft 12 and a rotor 13 are positioned on the motor rotation side and the rotor 13 is placed outside the stator 11. The rotor 13 is fixed at one end of the output shaft 12 penetrating the center of the stator 11, and the peripheral wall portion 18 thereof is placed outside the stator 11 and is provided on the inner circumferential surface with the permanent magnets 19. The open-side edge of the peripheral wall portion 18 is partly protruded at a position corresponding to the installation position of the permanent magnets 19 to form a projection 20 for detection, and the detecting element 23 of the magnetic sensor 22 is placed in proximity to the tip of the projection.
Patent TW-548155-B (TW)
Title: Laser beam positioning device for laser machining apparatus
Inventor: IWATA TAKAAKI
IPC: B23K26/02
Filed: 2002-03-29
Granted: 2003-08-21
Abstract: A laser beam positioning device for laser machining apparatus comprises a stage for mounting work piece to be processed, a laser oscillator, an optical device having laser beam scanning means and guiding laser beam to the object work piece mounted on stage, a measuring device for measuring the process end position and a control device for calculating the common value to be sent to laser beam scanning means with the coordinate of process end position and the co-ordinate of objective position wherein said control mean calculates an unknown parameter, where is for determining the optimum command value to be sent to laser beam scanning means pointing laser beam to the objective position on work piece, by adding a weight, which corresponds to the distance between the co-ordinate of objective position and the co-ordinate of process position, to said co-ordinate of process ending position and said command value to be sent to laser beam scanning means at that time.
Patent TW-561652-B (TW)
Title: Method of manufacturing compound semiconductor substrate
Inventor: MIYAJIMA TAKAO
IPC: H01L21/20
Filed: 2002-04-03
Granted: 2003-11-11
Abstract: A compound semiconductor substrate is manufactured by forming a higher-quality compound semiconductor layer having a smaller number of crystalline defects on a single-crystal substrate, and removing the single-crystal substrate without causing damage to the compound semiconductor layer. The method comprises the steps of forming the compound semiconductor layer (first, second and third compound semiconductor layers) on the single-crystal substrate (sapphire substrate) through crystal growth so as to partially have a space between the compound semiconductor layer and the single-crystal substrate; and removing the compound semiconductor layer from the sapphire substrate by irradiating the compound semiconductor layer from a side of the sapphire substrate with a laser beam passing through the single-crystal substrate and being absorbed in the compound semiconductor layer to melt an interface between the single-crystal substrate and the compound semiconductor.
Patent TW-550662-B (TW)
Title: Workpiece stage of a resist curing device
Inventor: WATANABE YOSHIHIKO
IPC: H01L21/027
Filed: 2002-04-11
Granted: 2003-09-01
Abstract: This invention provides a workpiece stage of a resist curing device. The workpiece stage of a resist curing device is devised in which a workpiece on which a resist has been applied is held on a workpiece stage by vacuum suction, in which the workpiece is irradiated with UV radiation with a simultaneous temperature increase, in which it is cooled after UV radiation and by which the resist is cured, the workpiece stage has heating and cooling arrangements, so that major warping of the carrier is avoided, and reliable holding of the workpiece on the carrier surface by vacuum suction is obtained by the carrier being made of an aluminum alloy or a copper alloy which meets the following condition: sigma/sigmay <= 3.1 (where sigma labels the thermal stress which is determined by using the following formula: (sigma=EalphaDeltaTE, where E is Young's modulus (N/mm2) at 200 DEG C, alpha is the coefficient of linear expansion (1/DEG C) at 200 DEG C and DeltaT is a temperature difference (DEG C) of 120 DEG C, and sigmay is the fracture point at 200 DEG C).
Patent TW-567525-B (TW)
Title: Method for real-time monitoring and controlling perovskite oxide film growth and semiconductor structure formed using the method
Inventor: YU ZHIYI
IPC: H01L21/66
Filed: 2002-05-28
Granted: 2003-12-21
Abstract: High quality epitaxial layers of monocrystalline oxide materials (24) are grown overlying monocrystalline substrates such as large silicon wafers (22) using RHEED information to monitor the growth rate of the growing film. The monocrystalline oxide layer (24) may be used to form a compliant substrate for monocrystalline growth of additional layers. One way to achieve the formation of a compliant substrate includes first growing an accommodating buffer layer (24) on a silicon wafer (22) spaced apart from the silicon wafer (22) by an amorphous interface layer of silicon oxide (28). The amorphous interface layer (28) dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer (24).
Patent TW-I267098-B (TW)
Title: Fuse
Inventor: KALRA VARINDER K
IPC: H01H85/02
Filed: 2002-06-05
Granted: 2006-11-21
Abstract: In an exemplary embodiment, a fuse body includes a first end, a second end and a bore extending therethrough for receiving a fuse element assembly. The bore includes a clearing portion having a first cross sectional area and a positioning portion having a second cross sectional area. The first cross sectional area is larger than the second cross sectional area. The positioning portion provides a receptacle for receiving the fuse element assembly and ensuring that the fuse element is substantially centered within the clearance portion.
Patent TW-571481-B (TW)
Title: On-line interactive UPS power-supplying method and device
Inventor: DAI JR-JAN
IPC: H02J9/00
Filed: 2002-07-05
Granted: 2004-01-11
Abstract: The present invention relates to an on-line interactive UPS power-supplying method and device, wherein the boost and step-down voltage conversion is proceeded at the utility power input end through a high-frequency AC/AC bi-directional converter. When the utility power voltage is getting higher or lower, the high-frequency AC/AC bi-directional converter outputs a compensation voltage to be superimposed with the utility power voltage, so as to complete the voltage boosting or step-down voltage operation in the utility power mode. Thus, a stable rated voltage is outputted to the load end.
Patent TW-544974-B (TW)
Title: An electromagnetic inductive system with multi-antenna loop layout and battery less pointer device and its method for locating the coordinate
Inventor: CHAO CHING-CHUAN
IPC: G06F3/033
Filed: 2002-07-25
Granted: 2003-08-01
Abstract: A multi-antenna loop layout of an electromagnetic inductive system is disclosed. The multi-antenna loop layout of the invention comprises plurality antenna loops, one end of each antenna loop connecting to an antenna switch, and the other end connecting to the common contact point. Every antenna loop is a relative close antenna loop, the relative close antenna loop possessing plurality ∩-type sections, forming a sawtooth-shaped region and corresponding to and closing each other to form plurality close-like regions, the form of which gradually approaches the multi-antenna loop layout.
Patent TW-I230880-B (TW)
Title: Semiconductor dispatching integration system and method using the same to dispatch
Inventor: WANG MING
Filed: 2002-08-20
Granted: 2005-04-11
Abstract: A semiconductor dispatching integration system includes a manufacture scheduling system for generating manufacture schedule and related evaluation result; a dispatching system for generating dispatching schedule and related evaluation result; an automatic transporting system for estimating the transport cost of each transporting route; and a rule base decision engine for determining the dispatching sequence and the corresponding machines for each batch based on the manufacture schedule plan, the dispatching plan and the transport cost calculated by the transporting system, wherein the rule base decision engine changes the decision condition by directly inserting or deleting rules without rebooting the rule base decision engine.