baber/WOPTO huggingface dataset:
Patent TW-I236245-B (TW)
Title: Method of tracking finger assignment
Inventor: PENG BAO-CHI
IPC: H04B1/707
Filed: 2002-03-07
Granted: 2005-07-11
Abstract: The present invention is a system and method of assigning a plurality of rake finger tracking units of a rake receiver. The rake receiver is applied in code division multipath access (CDMA) communication system for disposing multipath signal received from outside environment. The assigning system includes a searcher, a tracker, and an assigning management unit. The searcher is used for searching a plurality of path signals in a multipath signal, and then acquiring a plurality of corresponding searching time positions. The tracker includes a plurality of tracking units. Each of the tracking units has a corresponding predetermined tracking time position for tracking the position of the path signal. The assigning management unit is used for matching the plurality of searching time positions and the plurality of predetermined tracking time positions, then obtaining a plurality of combinations of matching pairs, and finding out the best matching pair from the plurality of combinations. The assigning management unit will also amends the predetermined tracking time positions of the rake finger tracking units according to the relationship of the searching time position and the predetermined tracking time position in the best matching pair, and accordingly reassigns the rake finger tracking units by their amended tracking time positions. Hence, the present invention can prevent the rake finger tracking units from repeatedly unnecessary reassignments and effectively improve the accuracy of the received signal.
Patent TW-I285531-B (TW)
Title: Composition
Inventor: ASHFORD EMMA JANE
IPC: A01N43/90
Filed: 2002-03-25
Granted: 2007-08-21
Abstract: The use of an alginate as a pH-triggered gelling agent in the manufacture of a composition comprising a salt of paraquat, a salt of diquat or a mixture thereof, the composition further comprising an emetic and/or purgative such that a pH-triggered gel effect takes place at the acid pH of human gastric juice. The gelling agent is preferably used in the substantial absence of magnesium trisilicate and preferably has a 1% solution viscosity in water of from 2 to 2000 mPas.
Patent TW-I249744-B (TW)
Title: Trim circuit and method for tuning a current level of a reference cell in a flash memory
Inventor: YEH CHIH-CHIEH
IPC: G11C16/28
Filed: 2002-03-25
Granted: 2006-02-21
Abstract: The present invention provides a trim circuit and method for tuning a current level of a reference call in a flash memory, in which the flash memory includes a sensing amplifier to compare the cell current of a flash memory cell with the reference current of the reference cell to generate a sensing signal. The memory cell has a gate to receive a word line signal voltage. The reference cell has a gate to receive a working bias. The trim circuit and method employs a voltage division circuit to divide the word line signal voltage to generate the working bias. The voltage division circuit comprises at least a flash cell as the rheostat, a programmable/erasable circuit to connect the flash memory cells with the rheostat cells for determining the resistance of the rheostat cells with respect to the memory cell.
Patent TW-577058-B (TW)
Title: Disk device
Inventor: OSANAI NORIHIRO
IPC: G11B7/005
Filed: 2002-04-01
Granted: 2004-02-21
Abstract: This invention relates to one replaying the header (emboss) portion of an optical disk, such as DVD-RAM, and recording data. A sector in a disk 100 comprises a header portion and a data portion, in which address is obtained by replaying the emboss portion and then recording the data into the data portion. A controller 14 will shift the best focusing offset to near a best offset suitable for replay during recording, if the best focusing offset cannot replay the emboss portion. By means of the above, the emboss portion will be correctly replayed during the period of recording data and the data can be recorded in the data portion with a good condition.
Patent TW-512076-B (TW)
Title: Device for cleaning indium tin oxide for color filter
Inventor: CHEN CHIN-CHIH
IPC: B08B7/00
Filed: 2002-04-15
Granted: 2002-12-01
Abstract: A device for cleaning an indium tin oxide for color filter comprises a cleaning machine, a material supply tank, a material supply pipeline, a pressurization pump, a circulation pipeline, and a circulation pump, in which the material supply tank is divided into a circulation tank and a supply tank. The material supply pipeline connects the supply tank to the cleaning machine, and connects the cleaning machine to the circulation tank. The pressurization pump is installed between the supply tank and the cleaning machine. The two ends of the circulation pipeline are connected to the circulation tank. The circulation pump is installed on the circulation pipeline. Furthermore, the material supply tank can be installed with a vacuum pressure reduction opening and connected to a vacuuming device for removing bubbles.
Patent TW-540280-B (TW)
Title: Multi-layered printed wiring board having via holes, circuit module comprising circuit elements mounted on the multi-layered printed wiring board, and method of manufacturing the multi-layered printed wiring board
Inventor: HAPPOYA AKIHIKO
IPC: H05K3/42
Filed: 2002-09-03
Granted: 2003-07-01
Abstract: A multi-layered printed wiring board comprising a multi-layered substrate (18). The substrate (18) has a plurality of conductor layers (20a, 20b, 20c, 20d, 20e, 20f, 20g, 20h), a plurality of insulating layers (21) interposed between the conductor layers (20a, 20b, 20c, 20d, 20e, 20f, 20g, 20h), a via hole (22, 61) penetrating the insulating layers (21) and having a plated layer (24, 62) electrically connecting the conductor layers (20a, 20b, 20c, 20d, 20e, 20f, 20g, 20h), and a plating resist layer (23, 51a, 51b) through which the via hole (22, 61) passes. The plating resist layer (23, 51a, 51b) is exposed to an interior of the via hole (22, 61) and divides the plated layer (24, 62) into a plurality of parts (25a, 25b, 52a, 52b, 52c, 63a, 63b). The parts (25a, 25b, 52a, 52b, 52c, 63a, 63b) of the plated layer (24, 62) electrically connect the conductor layers (20a, 20b, 20c, 20d, 20e, 20f, 20g, 20h).
Patent TW-I242734-B (TW)
Title: Method for ordering and facilitating the collection items
Inventor: CHOW HOO SIONG
IPC: G07F7/00
Filed: 2002-10-11
Granted: 2005-11-01
Abstract: A method for ordering and facilitating the collection of items such as food items. A set of user terminals 12 may be distributed around a building, each user terminal 12 being connected to a central server 10. The central server 10 is also connected to one ore more operator terminals 14 located in the building canteen. A user may order the food at the user terminal 12 by perusing a menu and making selections. The user also inserts a smart card which serves to identify the user as an account holder in the central server 10 database. After making selections, the information is stored in the central server 10 and is collated so that the food items selected by all the users requiring food from the canteen are known by the central server 10 before some defined cut-off point in time. The collated order is then sent by the central server 10 to the operator terminals 14 so that an appropriate number of each ordered food item can be prepared. To collect the food, the user simply inserts his smart card into an operator terminal 14 and his order is displayed. Preferably, the smart card is also used to transact payment of the food and the central server 10 may be connectable to the internet 22 so as to allow remote ordering by users and to allow the central server 10 to order raw materials from suppliers in accordance with how much raw material has been actually used.
Patent TW-561563-B (TW)
Title: Flip-chip packaging process and its fixture
Inventor: HSIEH HAN-KUN
IPC: H01L21/56
Filed: 2002-10-23
Granted: 2003-11-11
Abstract: A kind of flip-chip process suitable for use in an underfilling method includes the following steps: providing a chip having an active surface with plural metal bumps arranged at intervals; providing a substrate, in which one surface of the substrate has a chip bonding area that has plural bonding pads arranged at intervals and having the pre-placed soldering paste; using a printing screen to conduct a screen printing method, so as to form the filling material between the bonding pads inside the chip bonding area; attaching the metal bumps to the bonding pads to adhere the chip to the substrate; using a flip-chip packaging fixture in a flip-chip packaging process; and using screen printing to form underfilling material on a substrate through the printing area, in which the utilized printing screen contains a printing area and the other areas. The printing area contains plural opening regions, plural masking portions, and plural connecting lines for connecting the masking portions to the other regions of the printing screen, and the connection between the masking portions.
Patent TW-I265621-B (TW)
Title: Mark position inspection device
Inventor: FUKUI TATSUO
IPC: H01L23/544
Filed: 2002-11-12
Granted: 2006-11-01
Abstract: This invention provides a mark position inspection device, which can correctly inspect the mark position even if there is any residual abnormal aberration. It comprises: illuminating mechanisms (13-19) used for illuminating inspected mark (30) on a substrate (11), image-forming optical systems (19-24) for forming image of light (L2) from the inspected mark to form image of the inspected mark; an optical device support mechanism (20a) which supports part of the optical device (20) of the image-forming optical system, and utilizes X-axis and Y-axis which are perpendicular to the light axis O2 as the center for tilt; an image-capturing mechanism (25) which captures the image of the inspected mark formed in the image-forming optical system to export image signal, and a computing mechanism (26) which computes the position of the inspected mark by the inputted image signal from the image-capturing mechanism.
Patent TW-I239063-B (TW)
Title: Method for detecting defectives in an integrated circuit
Inventor: WU JANNE-WHA
IPC: G01R31/311
Filed: 2002-12-20
Granted: 2005-09-01
Abstract: A method for detecting defectives in an integrated circuit that is composed of a plurality of transistors in parallel. The method includes the following steps: applying a bias to the plurality of transistors in parallel; and catching the infrared imagery of the plurality of transistors.
Patent TW-593805-B (TW)
Title: Spinning apparatus and method with blowing by means of a turbulent cooling gas stream
Inventor: ZIKELI STEFAN
IPC: D01D5/06
Filed: 2002-12-24
Granted: 2004-06-21
Abstract: The present invention relates to an apparatus for producing continuously molded bodies from a molding material, such as a spinning solution containing cellulose, water and tertiary amine oxide. The apparatus (1) comprises a die plate (3) including extrusion orifices (4) through which the molding material is extruded into substantially filament-like continuously molded bodies (5). The continuously molded bodies (5) are passed through an air gap (6) and guided in a precipitation bath (9) by a deflector (10) to a bundling means (12) where they are united into a bundle of fibers. In the air gap, a blowing means (14) is provided for directing a cooling gas stream (15) onto the continuously molded bodies (5) in a direction transverse to the direction of passage (7). To improve the spinning stability and mechanical properties of the continuously molded bodies, it is intended according to the invention that the cooling gas stream (15) is turbulent when exiting from the blowing means (14).
Patent TW-I265838-B (TW)
Title: Solder metal, soldering flux and solder paste
Inventor: SHOJI TAKASHI
IPC: H05K3/34
Filed: 2002-12-27
Granted: 2006-11-11
Abstract: The present inventor provides a Sn-Zn-Bi solder paste containing a minute amount of Bi or a Sn-Zn solder metal free of Bi, metal components with high wettability and impact resistance or a soldering flux. The solder metal consists essentially of 8.8 to 5.0 mass% of Zn, 0.05 to 0 mass% of Bi and the balance of Sn and unavoidable impurities, or a solder metal consists essentially of 9.0 to 5.0 mass% of Zn, 2.0 to 0.05 mass% of Bi and the balance of Sn and unavoidable impurities. The present invention also provides soldering flux comprising a hydrocarbon compound having at least one primary, secondary or tertiary CH bond and a halogen-containing and hydrogen-donating compound.
Patent TW-I234290-B (TW)
Title: Capacitor in semiconductor device and method for fabricating the same
Inventor: PARK CHEOL-HWAN
IPC: H01L29/92
Filed: 2002-12-31
Granted: 2005-06-11
Abstract: A capacitor in a semiconductor device and a method for fabricating the same is disclosed. Disclosed the method for fabricating the capacitor in a semiconductor device comprises the steps of: forming a lower electrode made of doped silicon materials on a semiconductor substrate; depositing a thin silicon nitride layer on the lower electrode; forming a silicon oxynitride layer on the surface of the nitride layer through oxidation of the silicon nitride layer; depositing a dielectric layer on the silicon oxynitride layer; and forming an upper electrode on the dielectric layer. According to the method, after the deposition of the silicon nitride layer on the dielectric layer, oxidation treatment of the resultant structure is performed and the dielectric layer is formed on the oxidized silicon nitride layer, thereby improving the interface characteristics between the lower electrode and the dielectric layer and resulting in a decrease of leakage current and an increase of the breakdown voltage of the capacitor in the semiconductor device.
Patent TW-I232388-B (TW)
Title: Management system, method and apparatus for licensed delivery and accounting of electronic circuits
Inventor: RICCHETTI MICHAEL
IPC: H01L21/02
Filed: 2003-01-23
Granted: 2005-05-11
Abstract: A system and method of licensing electronic circuit designs within target electronic circuits or devices that allows secure delivery and reliable accounting of the licensed circuit designs on a per-usage basis. The method includes determining whether an electronic circuit design is licensable for use within a target electronic circuit by verifying licensing information included in a set of predetermined vectors associated with the electronic circuit design. In the event it is determined that the electronic circuit design is licensable for use within the target electronic circuit, the set of vectors is applied to the target electronic circuit by a licensing controller. Next, in response to a predetermined event, an attribute of the licensing information is updated to indicate the licensed use of the electronic circuit design within the target circuit. The licensing system allows IP core providers and IP core users to account for the use of licensed electronic circuit designs on a per-usage basis with higher accuracy, thereby providing increased assurance that the electronic circuit designs are being licensed in a manner that is fair to all parties.
Patent TW-594894-B (TW)
Title: Flip-chip type semiconductor device, process for manufacturing such semiconductor device, and process for mounting such semiconductor device
Inventor: OHUCHI RIEKA
IPC: H01L21/60
Filed: 2003-04-01
Granted: 2004-06-21
Abstract: A flip-chip type semiconductor device includes a semiconductor chip (22) having electrode pads (24) formed and arranged on a chip surface thereof. Sprout-shaped metal bumps (26) are bonded to the electrode pads on the chip, and an adhesive resin layer (32, 32') is formed on the chip surface of the chip such that tip ends of the sprout-shaped metal bumps are protruded from the adhesive resin layer. A circumference of the tip end of each sprout-shaped metal bump is surrounded by a protective resin material (38, 38') integrally swelled from the adhesive rein layer such that a tip end face of each sprout-shaped metal bump is at least exposed to the outside.
Patent TW-589716-B (TW)
Title: Method of fabricating memory device having a deep trench capacitor
Inventor: HSU PING
IPC: H01L27/108
Filed: 2003-06-10
Granted: 2004-06-01
Abstract: A method of fabricating a memory device having a deep trench capacitor is described. A first conductive layer is formed in the lower and middle portions of a deep trench in a substrate. An undoped semiconductor layer is formed in the upper portion of the deep trench. A mask layer is formed on the substrate. The mask layer covers the undoped semiconductor layer in the edge regions adjacent to neighboring predetermined active regions of the deep trench. An ion implantation process is performed to implant dopants into the undoped semiconductor layer exposed by the mask layer so as to form a second conductive layer. The first and the second conductive layers construct the upper electrode of the deep trench capacitor.
Patent TW-I220382-B (TW)
Title: Method for producing decorative cover of waterproof slider
Inventor: YANG SHR-SHENG
IPC: A44B19/42
Filed: 2003-08-21
Granted: 2004-08-21
Abstract: A method for producing a decorative cover of a waterproof slider comprises the steps of preparing a zipper body in which two sides of a substrate cloth on one end of the zipper body are respectively formed with a perforation; covering the perforations on the two sides of the substrate cloth on one end of the zipper body with an upper mold having an injection opening and a lower mold, and inserting an insert between the upper mold and a chain body; injecting plastic material through the injection opening; after curing of the plastic material, releasing the upper mold and the lower mold so that one end of the chain body is provided with a decorative cover; and hanging from-top-to-bottom a zipper stop on one end of the chain body and respectively riveting a fastener on two ends of the chain body. Thus, when the zipper is pulled on, the zipper stop is positioned in the decorative cover so that the joint part of the chain body and the zipper stop is covered by the decorative cover. Therefore, rain water can be prevented from permeating through the joint part of the chain body and the zipper stop.
Patent TW-I232764-B (TW)
Title: Golf club head
Inventor: HOU WEN-CHING
IPC: A63B102/32
Filed: 2003-09-01
Granted: 2005-05-21
Abstract: A golf club head comprises a main body, a striking plate, a hosel, and a cover layer. The main body, the striking plate, and the hosel are made of metal while the cover layer made of relatively light material. The hosel is formed with a narrowed portion which can reduce a total weight of the hosel. Thus, a center of gravity of the golf club head can be shifted and inclined to a toe portion of the golf club head, and moment of inertia thereof can be extended. Furthermore, the cover layer is covered on the narrowed portion of the hosel for increasing strength of the entire structure and absorbing striking vibration of the golf club head.
Patent TW-I224397-B (TW)
Title: Semiconductor device and manufacturing method of semiconductor device
Inventor: SONODA MASAHISA
IPC: H01L27/115
Filed: 2003-09-17
Granted: 2004-11-21
Abstract: The present invention is related to aspects of the field effect transistor semiconductor device having gate insulation film and the manufacturing method, and provides a semiconductor transistor device that can be further fined and the manufacturing method of the same. In the semiconductor device aspect containing plural device regions and STI (shallow trench isolation) device isolation regions for electrically isolating the device regions, the device region is respectively provided with the followings: the channel region; source, drain regions, which is formed and isolated by the channel region in the horizontal direction; the gate insulation film formed on the channel region, so that the formed bird's beak angle is smaller than 1 DEG, the bird's beak angle is on the face opposite to the side of the channel region from the device isolation region in the horizontal direction roughly vertical to the direction with the source, drain regions separated with the channel region; and the gate layer, which is formed on the gate insulation film.
Patent TW-590856-B (TW)
Title: Handle device of document punching apparatus
Inventor: LEE PEI-YUAN
IPC: B26F1/36
Filed: 2003-09-19
Granted: 2004-06-11
Abstract: A handle device for use in a document punching apparatus includes a first handle holder disposed at a first end of the document punching apparatus; a second handle holder disposed at a first end of the document punching apparatus; and a detachable handle detachably mounted to the first or the second handle holder at any position for exerting thereon a force by the user to punch the document.
Patent TW-I227626-B (TW)
Title: Operation method for image floating-point data conversion
Inventor: WANG CHIH-MING
IPC: H04N1/41
Filed: 2003-09-26
Granted: 2005-02-01
Abstract: The present invention is an operation method for image floating-point data conversion applied in the process of image compression/decompression. The method is to make the portion with floating-point numbers in the conversion matrix for color mode conversion as integers, and to conduct the operation of adding and multiplying accumulatively in integers; finally, recovering into the original value domain, so as to improve the overall operation efficiency.
Patent TW-I228411-B (TW)
Title: Folding mechanism of electric wheel chair
Inventor: JENG MING-CHIUAN
IPC: A61G5/08
Filed: 2003-09-30
Granted: 2005-03-01
Abstract: This invention relates to a folding mechanism of an electric wheelchair of which the frame comprises a chassis and a mobile frame provided on the top part of the chassis. In the range of the chassis, a power device is installed, and two wheels are combined at the front and rear end of the chassis respectively. Two front pivot seats are provided at both sides of the front end of the chassis, and a rear pivot seat is pivoted at the middle of the rear end. One end of the aforementioned mobile frame is pivoted on the front pivot seat while the other is pivoted with a combining post. The combining post and the rear pivot seat are mutually pivoted, and a detachable bolt is inserted and fastened on the combining post and rear pivot seat. While transporting is needed, the mobile frame can be pivot rotated and pressed close to the chassis, to greatly reduce the volume by pulling out the detachable bolt.
Patent TW-I279703-B (TW)
Title: Interface determination method of combo input device
Inventor: TSENG CHIH-HUNG
IPC: G06F3/00
Filed: 2003-10-09
Granted: 2007-04-21
Abstract: The present invention relates to an interface determination method of combo input device for determining an interface existed between a combo input device and a host machine to decide an interface mode of the combo input device. The method includes steps of providing a first signal and a second signal serving as interface signal between the combo input device and the host; setting the interface mode of the combo input device as a first mode in response to the first signal and the second signal all being a first potential; setting the interface mode as a second mode of the combo input device in response to the first signal and the second signal all being a second potential; setting the interface mode of the combo input device to a first mode in response to the interface mode of the combo input device being the second mode as well as the first signal and the second signal all being the first potential; and setting the interface mode of the combo input device as the second mode in response to the interface mode of the combo input device being the first mode as well as the first signal and the second signal all being the second potential.