baber/WOPTO huggingface dataset:
Patent JP-2005133850-A (JP)
Title: Check valve device
Inventor: OGAWA MASAYA
IPC: F16K15/04
Filed: 2003-10-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a check valve having the small damage of a seal part and a long seal life.  <P>SOLUTION: This check valve device 1 includes a body 2 having a conical first recess part 23 and a flow path 24 opened with the first recess part 23 at the bottom 22 of a hole 21 in which female threads are provided, a fixing member 3 having a conical second recess part 32 at a distal end with male threads to be engaged with the female threads and a flow path opened with the second recess part 32, and a valve member 4 having a conical first protrusion 41 and a conical second protrusion 42 provided at both ends and the through hole 42 provided at an axial center. A valve body 51 is formed to push to a valve seat 44 by the energizing force of a spring 52 in the valve member 4. The male threads of the fixing member 3 are tightly engaged with the female threads to form metal seals between the first protrusion 41 and the first recess part 23 and between the second protrusion 42 and the second recess part 32.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004201486-A (JP)
Title: Half-bridge high voltage gate driver having protection of transistor
Inventor: GALLI GIOVANNI
IPC: H03K17/56
Filed: 2003-10-31
Abstract: <P>PROBLEM TO BE SOLVED: To dynamically protect an output stage and at the same time to quickly perform turn-on by high current output.  <P>SOLUTION: A gate drive integrated circuit for switching a power transistor using an external controller includes gate drive capability and a low zero input current, and enables the use of bootstrap supplitechnic technique to supply a logic supply voltage. The gate drive integrated circuit detects power transistor non-saturation and protects a non-saturated transistor from a transitional excessive voltage by gently turning off a non-saturated transistor via a soft shut-down sequence. The fault control circuit of the gate drive integrated circuit manages the shortage of a supply voltage and the protection of the non-saturation of a transistor and can communicate with a plurality of gate drive integrated circuits in a polyphase system using an exclusive local network.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2005133516-A (JP)
Title: Floor panel
Inventor: TSUGE KEIJU
IPC: E04F15/024
Filed: 2003-10-31
Abstract: <P>PROBLEM TO BE SOLVED: To effectively suppress looseness by minutely coping with the unevenness of a building floor face while suppressing the occurrence of a defect that the strength of one of a surface material and a backing material is lowered in comparison with that of the other in a floor panel with the surface material placed over the backing material.  <P>SOLUTION: This floor panel 1 is constituted by placing the surface material 2 provided with slits 2s, over the backing material 3 provided with slits 3s in different positions from the slits 2s of the surface material 2, and the floor panel 1 can be laid along the unevenness of the building floor face F because of being deformed along the slits 2s of the surface material 2 and the slits 3s of the backing material 3.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005141523-A (JP)
Title: Image processing method
Inventor: KAWABE TORU
IPC: H04N1/407
Filed: 2003-11-07
Abstract: <P>PROBLEM TO BE SOLVED: To estimate the scene attributes of an image to process the image in a way that suits the scene attributes.  <P>SOLUTION: This image processing method which records or displays images according to image data includes detecting face areas using a face detection means, creating image processing condition parameters according to the number of face areas detected, and processing images according to the image processing condition parameters.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005137303-A (JP)
Title: Apparatus for roasting coffee bean
Inventor: MATSUMOTO TAKEO
IPC: A23N12/08
Filed: 2003-11-07
Abstract: <P>PROBLEM TO BE SOLVED: To enable coffee beans B to be roasted by microwave heating.  <P>SOLUTION: The subject roasting apparatus has a container 10 in which the coffee beans B are put, and a motor M for stirring the coffee beans B, installed therein, and is constituted so that the motor M may be stored in a shielding case 20. As a result, when the whole of the apparatus is placed in a heating chamber to which microwaves are introduced, the coffee beans B in the container 10 are properly roasted in a short time.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004041791-A (JP)
Title: Connecting pin for adjusting piece and watch band/personal ornament using the same
Inventor: SHIBAMIYA YOSHIFUMI
IPC: A44C5/10
Filed: 2003-11-10
Abstract: <P>PROBLEM TO BE SOLVED: To provide a connecting pin for adjusting piece, which uses a fine body such as a tip end cylinder of a mechanical pencil without using a special jig to easily attach/detach an adjusting piece, and a watch band using the connecting pin for adjusting piece and accessories .  <P>SOLUTION: This connecting pin is to connect an adjusting piece 4a with another piece 4b, and is equipped with the pin body 1 to be inserted through pin holes 40, 43 formed by the adjusting piece 4a and the other piece 4b and an engaging body 3 comprising an elastic body to be attached to the pin body 1. The engaging body 3 is pressed against the inside wall of the pin hole 43.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004044607-A (JP)
Title: Combustion type heater for internal combustion engine
Inventor: SUZUKI MAKOTO
IPC: F02M31/06
Filed: 2003-11-10
Abstract: <P>PROBLEM TO BE SOLVED: To certainly perform ignition of a combustion type heater by one operation, and certainly prevent generation of white smoke and generation of uncomfortable smell caused by generation of unburned hydrocarbon.  <P>SOLUTION: This combustion type heater is provided with a combustion chamber body 17b which burns combustion fuel for the combustion type heater 17 to generate flame, an air flow passage 17d for supplying and discharging air to/from the combustion chamber body 17b, a fuel supplying means 17e supplying the combustion chamber body 17b with the combustion fuel, and an igniting means 17g igniting the combustion fuel supplied to the combustion chamber body 17b by the fuel supplying means 17e by generating heat. The combustion type heater is also provided with a supplied fuel integrated value detecting means 46 detecting an integrated value of the fuel supplied by the fuel supplying means 17e when the combustion fuel is not in an ignited state after the igniting means 17g starts generating heat, and a fuel supply stop control means 46 stopping supply of the fuel by the fuel supplying means 17e when the integrated value detected by the supplied fuel integrated value detecting means 46 is not less than a prescribed value.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2005149777-A (JP)
Title: Electric toilet seat
Inventor: IZAKI KIYOSHI
IPC: A47K13/30
Filed: 2003-11-12
Abstract: <P>PROBLEM TO BE SOLVED: To solve the problem wherein a toilet seat is difficult to be detached when it is electrically connected to a main body by four pieces of wires.  <P>SOLUTION: A toilet stool comprises a toilet seat and an electric toilet seat main body. The toilet seat comprises a toilet seat case, a heater embedded in the toilet seat case, a temperature detection means detecting temperature of the toilet seat, and a toilet seat side electric circuit, and the electric toilet seat main body comprises a main body case and a main body side electric circuit. The toilet seat side electric circuit is connected to the main body side electric circuit with two wires.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005150298-A (JP)
Title: Minute tile-like element, connecting structure, connecting method, thin film device, and electronic apparatus
Inventor: KONDO TAKAYUKI
IPC: H01S5/026
Filed: 2003-11-13
Abstract: <P>PROBLEM TO BE SOLVED: To remarkably increase the reliability by electrically connecting a minute tile-like element and a final substrate easily with small crimping force without damaging the minute tile-like element.  <P>SOLUTION: In a connecting structure wherein the minute tile-like element 161 formed with a surface emitting semiconductor laser 113 is connected to the final substrate 171, the minute tile-like element 161 has a surface electrode 162 electrically connected to the terminal electrode 172 of the final substrate 171. The terminal electrode 172 of the final substrate 171 has a plurality of projections 172a formed in the form of a spike projecting toward the surface electrode 162 side. The minute tile-like element and the final substrate are crimped by pressurizing these projections 172a against the surface electrode 162.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005111649-A (JP)
Title: Abrasive grain collecting device
Inventor: NAGASAWA HIDENORI
IPC: B24B55/03
Filed: 2003-10-09
Abstract: <P>PROBLEM TO BE SOLVED: To provide an abrasive grain collecting device which is for use in processing of coolant flowing out of a main machine tool, and efficiently removes non-magnetic sludge such as abrasive grains from the coolant.  <P>SOLUTION: The abrasive grain collecting device for removing the sludge from the coolant flowing out of the machine tool, is comprised of a swirling settling device 12 which is arranged in the coolant stored in an abrasive grain settling tank 13 for extracting the sludge such as the abrasive grains contained in the coolant, and has a coolant inflow port 18 and a coolant outflow port 22. The coolant inflow port is formed in the vicinity of an upper edge of a cylinder side surface 16 of a top-covered bottomless cylinder 14 for accelerating a settling effect, for pouring the coolant in a tangent direction of the cylinder side surface 16 along an inner wall 17 of the cylinder side surface 16, and generating a swirl 11 in the top-covered bottomless cylinder 14. The coolant outflow port 22 is formed at the center of an upper lid 15 of the top-covered bottomless cylinder 14, for discharging the coolant from which the sludge is removed due to settling by the swirl 11. The swirling settling device 12 has a cavity 21 formed at a location between a cylinder lower edge 20 of the top-covered bottomless cylinder 14, and a bottom portion 19.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005150323-A (JP)
Title: Gap adjusting device and method therefor
Inventor: RI KEN
IPC: G03F7/207
Filed: 2003-11-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a gap adjusting device which is capable of precisely obtaining a space between the two opposed objects of interest even when at least one of the objects is not connected to a ground potential.  <P>SOLUTION: The gap adjusting device is equipped with a first dummy target which is provided with a first dummy surface that is to be measured and faces in the same direction with the first surface of the first object to be measured to obtain a space between the first surface of the first object to be measured and the second surface of the second object to be measured, a first displacement gauge for obtaining a distance between the first surface to be measured and the first dummy surface to be measured, a second displacement gauge for measuring a distance from it to the first dummy surface to be measured, a second dummy target which is fixed at a relative position to the second displacement gauge and has a second dummy surface that is to be measured and faces in the same direction with the second surface to be measured, and a third displacement gauge for obtaining a distance from the second surface to be measured to the second dummy surface to be measured.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005144495-A (JP)
Title: Solder alloy and solder ball
Inventor: SHOJI TATSUYA
IPC: C22C13/00
Filed: 2003-11-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a Pb-free solder alloy with which the strength of a joint boundary can be improved without impairing the fundamental mechanical properties of the conventionally proposed solder alloy of a composition system, and a solder ball.  <P>SOLUTION: The solder alloy contains, by mass%, in total, ≤20% one or more elements selected from Ag, Cu, and In, and ≤1% Ru, and the balance Sn and inevitable impurities. The solder ball contains, by mass %, in total, ≤20% one or more elements selected from the Ag, Cu, and In, and ≤1% Ru, and the balance the Sn and the inevitable impurities.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005146195-A (JP)
Title: Manufacturing method of ethylene-vinyl acetate copolymer emulsion
Inventor: SHIRAHASE TORU
IPC: C08F4/40
Filed: 2003-11-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an ethylene-vinyl acetate copolymer emulsion which permits reduction of the unreacted vinyl acetate monomer concentration without generating formaldehyde and satisfactory attainment of the purposes of non-formaldehyde, low VOC and low odor.  <P>SOLUTION: The manufacturing method comprises the first to forth steps below: The first step is a step of emulsion polymerization using a redox catalyst comprising water-soluble hydrogen peroxide or persulfates as an oxidizing agent and erythorbic acid compounds or ascorbic acid compounds as a reducing agent to reduce the unreacted vinyl acetate monomer concentration down to less than 10 wt%; The second step is a step of purging unreacted ethylene to ordinary pressure and further depressurizing to remove ethylene to 4-26 KPa at 30-70°C; The third step is a step of adjusting the amount of the reducing agent so that the amount of the oxidizing agent is at most 4.0 times the molar amount of the reducing agent; and The fourth step is a step of adding a water-soluble oxidizing agent and/or an oil-soluble t-butyl hydroperoxide in an amount of 1.8-10 times the molar amount of the whole added reducing agent to lower the unreacted vinyl acetate monomer concentration down to at most 0.1%.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005037346-A (JP)
Title: Micro fluid control system
Inventor: KONO TAKASHI
IPC: G01N37/00
Filed: 2003-11-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a micro fluid control system advantageous for quick mass-processing, and capable of distributing target substances such as liquid drops unit by unit, adopting a system for making the micro target substances such as the liquid drops flow together with a main liquid.  <P>SOLUTION: This system has a fluid passage 1 having a main passage 10 for making the main liquid dispersed with the micro target substances and having a distribution passage 12 for distributing the target substances in a downstream, and a target substance sorting means 2 for sorting the target substances flowing in the fluid passage 1 to be supplied to the distribution passage 12. The target substance sorting means 2 has electrodes 41, 42 for impressing the polarities of voltages same or different to the polarity of the of the target substances flowing in the main passage 10 to attract or repulse the target substances, and for moving the target substances to be sorted.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005158807-A (JP)
Title: Ultrasonic flip-chip bonding structure and connecting method
Inventor: KITAOKA KOKI
IPC: H01L21/56
Filed: 2003-11-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide an ultrasonic flip-chip bonding structure damaging no electrical connectability by the filling of an underfill resin.  <P>SOLUTION: A partitioning member 46 surrounding so as to partition a second region 48 is formed in a first region 47 partitioned by a plurality of bump electrodes 42 on a surface 49, on which the bump electrodes 42 for a semiconductor element 41 are formed. The surface of the semiconductor element in the second region 48 surrounded by the partitioning member 46 is coated previously with the first underfill resin 45a. The bump-electrode forming surface 49 of the semiconductor element 41 and the electrode-pad forming surfaced 50 of a wiring board 43 are opposed. The bump electrodes 42 and the electrode pads 44 are abutted, and ultrasonic flip-chip bonded by applying a load and ultrasonic vibrations. An ultrasonic flip-chip bonding structure 40 is obtained by filling a second underfill resin 45b.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005153576-A (JP)
Title: Vehicular air conditioner
Inventor: INO RYUNOSUKE
IPC: B60H1/08
Filed: 2003-11-21
Abstract: <P>PROBLEM TO BE SOLVED: To effectively use energy possessed of a condensate generated by an evaporator.  <P>SOLUTION: This vehicular air conditioner has the evaporator 6 stored in an air conditioning unit 11, drain passages 41 and 51 for draining the condensate generated by the evaporator 6 to the outside of the air conditioning unit 11, a cold storage unit 31 for storing or releasing low temperature heat possessed by the condensate, and a moving means 34 for moving the cold storage unit 31 to a cold releasing position for releasing cold to air passed through the evaporator 6 from a cold storage position in the drain passage 41 for storing the low temperature heat.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005153227-A (JP)
Title: Cover sheet coated forming material and cover sheet laminating method
Inventor: OKADA MASAYASU
IPC: B60R13/02
Filed: 2003-11-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a cover sheet coated forming material reducing a gap formed with respect to a partner material, and a cover sheet laminating method capable of simply manufacturing the cover sheet coated forming material at a low cost without increasing the number of processes, and a cover sheet laminating method.  <P>SOLUTION: This cover sheet coated forming material 1 has a base material 4 having a surface 41 and the side surface 42 bent to continue to the surface 41 and an elastically deformable cover sheet 5 laminated to the base material 4 from the surface 41 thereof to the side surface 42 thereof. A protruded part 44 is arranged to the end part in the direction of the side surface 42 of the surface 41. Further, the cover sheet laminating member has a protruded part arranging process for arranging the protruded part 44 to the end part in the direction of the side surface 42 of the surface 41 and a cover laminating process for laminating the cover sheet 5 to the base material from the surface 41 thereof to the side surface 42 thereof through the protruded part 44.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005151846-A (JP)
Title: Method for making gateway entry clone
Inventor: TANAKA SHIGEO
IPC: C12N15/09
Filed: 2003-11-21
Abstract: <P>PROBLEM TO BE SOLVED: To provide a technique for the Gateway cloning of a large-size gene for which a PCR amplification becomes difficult and an error probability in the amplification becomes higher and for a cloning by introducing mutations of point mutation, deletion, insertion and substitution into a gene in high accuracy and efficiency.  <P>SOLUTION: A method for making a Gateway entry clone, comprises the following procedure: amplifying an N-terminal fragment using a primer A whose 5'-terminal is allowed to be added with a Gateway recombinant sequence attB1 and a primer D designed in a gene by PCR or adaptor PCR, and amplifying a C-terminated fragment using a primer C designed in contact with the primer D and a primer B to which a Gateway recombinant sequence attB2 can be added, thereby the C-terminal fragments and/or N-terminal fragments are integrated in an attP plasmid vector followed by cyclization by self ligation, and the cyclized product is then introduced into a competent cell.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005158899-A (JP)
Title: Semiconductor memory device and its manufacturing method
Inventor: TANAKA TOSHIJI
IPC: H01L27/108
Filed: 2003-11-21
Abstract: <P>PROBLEM TO BE SOLVED: To suppress increase in the resistance of a strap contact accompanying scaling-down.  <P>SOLUTION: The semiconductor memory device comprises a trench provided in a semiconductor substrate; a diffusion layer for first electrode, provided in the semiconductor substrate in contact with the inner surface of the trench; a capacitor insulating film provided on the inner surface of the trench to cover the diffusion layer; a conductive layer for second electrode provided on the capacitor insulating film for embedding the lower side part of the trench; a first insulating film provided on the inner surface of the trench above the conductive layer, a first conductive layer provided on the first insulating film and the conductive layer for embedding the intermediate part of the trench; a first contact layer provided on the first insulating film and the first conductive layer for embedding the upper side part of the trench; and a second contact layer, provided on the surface of the semiconductor substrate in contact with the first contact layer.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2004041815-A (JP)
Title: Organismic light measuring device
Inventor: MAKI ATSUSHI
IPC: G01N21/35
Filed: 2003-11-25
Abstract: <P>PROBLEM TO BE SOLVED: To provide an organismic light measuring device having high detecting sensitivity in an organism deep part.  <P>SOLUTION: The light from light sources 1-1 and 1-3 (a wave length λ1) and light sources 1-2 and 1-4 (a wave length λ2) are irradiated to a subject 7 via irradiating optical fibers 5-1 and 5-2, and are condensed by condensing optical fibers 8-1 and 8-2, and are photoelectrically converted and amplified by detectors 9-1 and 9-2. Output signals from the detectors 9-1 and 9-2 are distributed into two, and are then inputted to phase detectors 10-1, 10-2, 10-3 and 10-4. Intensity of the transmitted light with respective wave lengths from the condensing optical fibers 8-1 and 8-2 of a position opposed to the irradiating optical fibers 5-1 and 5-2 is separated, and is multiplied by multipliers 11-1 and 11-2 with respective wave lengths. After arithmetic operation processing, an arithmetic operation result is displayed on a display device 15.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2005153294-A (JP)
Title: Mold for molding plastic, plastic molded product, optical device and optical scanning device
Inventor: HARADA TOMOHIRO
IPC: B29L11/00
Filed: 2003-11-25
Abstract: <P>PROBLEM TO BE SOLVED: To enhance the dimensional precision of a plastic molded product by uniformizing the temperature distribution of a mold to prevent the lowering of the quality of the plastic molded product.  <P>SOLUTION: In this mold for molding a plastic constituted using at least one member comprising a metal-ceramic composite material, coating layers 13,14 and 15 are formed on a part of or the whole of the member comprising the metal-ceramic composite material. The coating layer 13 is a nickel plating layer formed by electroless plating and the coating layer 15 is a mixture layer of nickel and a fluoroplastic formed by electroless plating. The coating layer 14 is either one of a titanium nitride film, a titanium carbide film and a titanium carbonitride film.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005167303-A (JP)
Title: Image display method of videophone
Inventor: TANAKA HIROYUKI
IPC: H04N7/14
Filed: 2003-11-28
Abstract: <P>PROBLEM TO BE SOLVED: To provide an image display method of a videophone capable of easily revising the display state of an image in response to a communication state without spending time and effort.  <P>SOLUTION: In the image display method of the videophone provided with a camera and a display apparatus, the videophone is connected to a plurality of other videophones by lines, can separately display an image photographed by the camera to the display apparatuses of the other videophones, make a voice speech with any of the other videophones, detects a voice communication state with the other videophone, and executes at least one of identification displays of the images from the videophone being a communication opposite party and the magnification display of the image from the videophone being the communication opposite party in comparison with a state before detection when the detected communication state indicates call origination or call termination.  <P>COPYRIGHT: (C)2005,JPO&NCIPI