baber/WOPTO huggingface dataset:
Patent JP-2004225267-A (JP)
Title: Lining mountng method and lining mounting device for existing horseshoe-shaped water way
Inventor: ISHIYAMA SAKAE
IPC: E03F7/00
Filed: 2003-01-20
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a lining mounting device, by which a lining material for a repair can be carried into an existing water way by a simple device while an upper lining material can be carried in particularly and safely.  <P>SOLUTION: The lining mounting device is used for installing the upper lining material 3 for the existing horseshoe-shaped water way 4, and jacks 13 for adjusting a height are secured to a truck 12 travelling in the existing water way 4. A rotating shaft 17 rotatable around the axis of the lining material 3 is supported pivotally to a lifting-lowering supporting member 15 lifted and lowered and moved by the jacks 13. Three expansible fixed arms 19 connected to the arcuate central section of the lining material 3 and arcuate both end sections are fitted to the supporting member 18 fixed onto the shaft 17, and the shaft 17 is turned by a driving means set up on the supporting member 15.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004228760-A (JP)
Title: Method, program, and apparatus for replying to inquiry of address and for notifying address
Inventor: NAKAZAWA HIROAKI
IPC: H04L12/70
Filed: 2003-01-21
Abstract: <P>PROBLEM TO BE SOLVED: To avoid a situation where connection cannot be made even if an address can be acquired, in a method, a program, and an apparatus that reply to the inquiry of the address.  <P>SOLUTION: A DNS server 109 receives the inquiry of the address of a server 107 from a client 106, inquires a DNS server 108, and notifies the term of validity shorter than that of the address of the server 107 obtained by the DNS server 108 as the term of validity of the address of the server 107 when notifying the client 106. Additionally, when the DNS server 109 performs a connection test with the server 109 and fails, the DNS server 109 answers that there are no addresse when receiving the inquiry of the address of the server 107 from the client 106. Thus, the following problem is solved that an IPv4 address is acquired after the time-out of several seconds for performing communication utilizing the IPv4 address since communication with the server cannot be made by an IPv6, although communication utilizing the IPv6 is tried because an IPv6 address can be acquired when only IPv6 connectivity is interrupted in an intermediate network although Ipv4 connectivity is maintained.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2003293037-A (JP)
Title: METHOD OF PRODUCING Fe-Ni BASED ALLOY HAVING EXCELLENT BLANKING WORKABILITY
Inventor: TODOROKI HIDEKAZU
IPC: H01L23/50
Filed: 2003-01-22
Abstract: <P>PROBLEM TO BE SOLVED: To stably produce an Fe-Ni alloy in which fine MnS and oxide-based inclusions are properly dispersed, at a low cost.  <P>SOLUTION: The molten metal of an Fe-Ni based alloy containing 30 to 55 wt.% Ni is charged with Si and Mn. After the concentration of oxygen is reduced to ≤50 ppm, casting is performed, and hot rolling and cold rolling are performed. Thus, MnS with a particle diameter of ≤3 μm and oxide based inclusions with a particle diameter of ≤3 μm are uniformly dispersed into a matrix at a density of 3,000 to 10,000 pieces/mm<SP>2</SP>in total in the cross-section parallel to the rolling direction and the sheet thickness direction.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004228313-A (JP)
Title: Inspection equipment for semiconductor wafer
Inventor: WAKUI MASAYUKI
IPC: H01L21/66
Filed: 2003-01-22
Abstract: <P>PROBLEM TO BE SOLVED: To eliminate the need for ensuring an arranging space when an electric connection structure to the outer surface of a wafer cassette is added, and to ensure reliability and accuracy of connection without causing a cost increase in the components and production.  <P>SOLUTION: The inspection equipment 1 for a semiconductor wafer comprises wafer cassettes C, ... for holding semiconductor wafers W, ... by vacuum suction, and an inspection equipment body M incorporating an evacuating section 4 for connecting the openings 2, ... to be sucked of the contained wafer cassettes C, ... with suction openings 3, ... and performing evacuation. A vacuum connection mechanism 5 for connecting the openings 2, ... to be sucked of the wafer cassettes C, ... with the suction openings 3, ... of the evacuating section 4 is provided with electric contact parts 6a, ... for one or more systems performing electric connection at the time of mechanical connection such that they also serve as mechanical connecting parts 7a, ... of the vacuum connection mechanism 5.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004228338-A (JP)
Title: Electromagnetic wave absorber and its manufacturing method
Inventor: OKADA TAKAHIKO
IPC: H05K9/00
Filed: 2003-01-23
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electromagnetic wave absorber that can be manufactured easily, shows stable electromagnetic wave absorption characteristics in a gigahertz (GHz) frequency band at normal temperature, and can form a solid structure.  <P>SOLUTION: This electromagnetic wave absorber is characterised by being constituted of a ceramic and manufactured by molding a mixture of an alumina-based ceramic raw material and a carbon source, and baking the molded body in a reducing atmosphere maintained at a temperature of ≥1,400°C.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004227706-A (JP)
Title: Electron beam exposure method, its exposure device, manufacturing method of original optical disk, and information recording medium
Inventor: FUJIWARA YASUHIDE
IPC: H01L21/027
Filed: 2003-01-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide an electron beam exposure method in which pit width is not varied always independently of pit length.  <P>SOLUTION: In an electron beam exposure method by which a pit pattern having area a plurality of stages of a resist film on a surface of an original disk 13 is plotted by irradiating the original disk 13 which rotates at the prescribed speed with an electron beam 5 turning ON or OFF, when it is assumed that linear velocity of the original disk 13 is LV, a diameter of the electron beam is D, a period in which the electron beam is made ON is Ton, exposure is performed by varying the period Ton in a range of Ton<2*D/LV.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004223469-A (JP)
Title: Method for regenerating activated carbon containing organic harmful substance and regenerating apparatus
Inventor: SHIMIZU AKIO
IPC: B01J20/34
Filed: 2003-01-27
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for regenerating activated carbon to effectively separate organic harmful substances adsorbed to the activated carbon and to effectively process the separated organic harmful substance.  <P>SOLUTION: The activated carbon 10 containing organic harmful substances is housed in a heating container 1, into which steam at 500°C is supplied through a steam supply port 11 to heat the activated carbon under reduced pressure so as to decompose the organic harmful substances. Oxygen is supplied by an oxygen supplying means 6 to the produced discharged gas, which is converted into plasma under reduced pressure by a plasma generating means and oxidized.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004234070-A (JP)
Title: Duplicate acquisition method in electronic application, system, program, and storage medium
Inventor: NISHIMOTO KYOKO
IPC: G06Q10/00
Filed: 2003-01-28
Abstract: <P>PROBLEM TO BE SOLVED: To easily and surely acquire a duplicate of application data and to perform opening processing in consideration of security properties.  <P>SOLUTION: The duplicate acquisition method in digital application includes a step wherein a request for the application processing or acquisition of the duplicate by an applicant is received from an input interface, a step wherein an attribute of configuration information about the digital application data is recognized in compliance with the request, a step wherein the recognized attribute is collated to a table defining a relation between the attribute and a code key for recognizing the code key used for each configuration information, a step wherein the code key is created to be acquired or acquired from its own storage device or an authentication station on a network, and a step wherein the respective configuration information is encoded according to the matching code key stored as a digital application duplicate in a storage device.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004235409-A (JP)
Title: Method of manufacturing semiconductor integrated circuit device
Inventor: AOYAMA TAKUJI
IPC: H01L21/3065
Filed: 2003-01-30
Abstract: <P>PROBLEM TO BE SOLVED: To improve the yield of a semiconductor integrated circuit device.  <P>SOLUTION: After a photoresist film is applied onto the insulating film 7b of a wafer 1W, a desired pattern is transferred by performing an exposure process at this. Then, after a developing process is performed on the wafer 1W after the exposure process and a photoresist pattern 11a is formed, the cleaning process and a spin drying process are sequentially performed at the wafer 1W. Thereafter, after the photoresist residue 14 adhered to the bottom of the opening 12 of the photoresist pattern1 1a is removed by a light ashing process, a through hole is bored through the insulating film 7b by a dry etching process using an etching gas, etc. containing C<SB>5</SB>F<SB>8</SB>, O<SB>2</SB>and Ar gas with the photoresist pattern 11a used as an etching mask. Thus, the through hole opening fault due to the photoresist residue 14 can be prevented.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004235520-A (JP)
Title: Semiconductor device
Inventor: HIRASHIKI KENICHI
IPC: H01L23/12
Filed: 2003-01-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can have good sensitivity and isolation characteristics.  <P>SOLUTION: The semiconductor device has a circuit substrate; a semiconductor chip disposed on a first main surface of the circuit substrate; a wiring pattern provided on the first main surface for performing signal transfer with the semiconductor chip; a power supply pattern provided on the first main surface between the chip and the wiring patter; and metallic thin wires for connecting the chip, the wiring pattern, and the power supply pattern.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004241567-A (JP)
Title: Composite material and method for manufacturing the same
Inventor: TAGUCHI KOHEI
IPC: H01L23/36
Filed: 2003-02-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide a composite material with its warpage suppressed, comprising a heat sink and an electric circuit section both bonded to a ceramic insulating layer.  <P>SOLUTION: The composite material 10A comprises a metal heat sink 11, a ceramic insulating layer 12 bonded to the heat sink 11 with an insert layer 13 in between, and a conducting electric circuit section 14 bonded to the side of the ceramic insulating layer 12 opposite to the side bonded to the heat sink 11. The heat sink 11 comprises a first layer 11a on the side near the ceramic insulating layer 12 and a second layer 11b bonded to the first layer 11a, and the first layer 11a is made of a metal whose thermal expansion coefficient is higher than that of the second layer 11b.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004241687-A (JP)
Title: Forming method of trench capacitor and semiconductor device
Inventor: SAIDA SHIGEHIKO
IPC: H01L29/76
Filed: 2003-02-07
Abstract: <P>PROBLEM TO BE SOLVED: To provide a semiconductor device whose memory holding characteristic does not deteriorate even if a memory cell is fined.  <P>SOLUTION: A trench is formed in the surface of the semiconductor substrate of a first conductivity type. A first insulating film is formed on the inner wall of the trench and a semiconductor pillar is buried in the trench on the first insulating film. The first insulating film and the semiconductor pillar positioned in the upper part of the trench are etched. A second insulating film is deposited on the exposed inner wall of the trench. The semiconductor pillar is etched and the first insulating film is etched. A plate electrode whose conductivity type is different from the first conductivity type is formed in an exposed inner wall of the trench by a gas phase diffusion method. A capacitor insulating film is formed on the plate electrode. A storage electrode is buried in the trench on the capacitor insulating film and the second insulating film.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004264055-A (JP)
Title: Sensor assembly, sealing device, and antifriction bearing apparatus
Inventor: CHITOKU MINORU
IPC: F16C33/58
Filed: 2003-02-12
Abstract: <P>PROBLEM TO BE SOLVED: To improve reliability by easily exchanging disconnected harness, and improving strength at a connector section for preventing disconnection, or the like, regarding an antifriction bearing apparatus, where a sealing device incorporating a rotation detector is fitted.  <P>SOLUTION: In the antifriction bearing apparatus, a ball 5 is interposed between the track surfaces of inner/outer ring members 2, 3 and the sealing device 8 is fitted between the shoulders of the inner/outer ring members 2, 3. In the bearing apparatus, the sealing device 8 comprises an outer ring side seal ring fixed to the outer ring member 2; and an inner ring side seal ring fixed to the inner ring member 3. A pulser ring 16 is fixed to the annular core of the inner ring side seal ring, and a reversal detection sensor 15 is covered with an encapsulant 17 made of resin for integration at the outer diameter side of the annular core of the outer ring side seal ring. A connector 20 that is extended in the outer diameter direction of the encapsulant 17 made of resin and is connected to the reversal detection sensor 15 is provided in one piece. At least a connector section in a metal circular body is extended in the outer diameter direction to form a reinforcement section 83d for reinforcing the strength of the connector 20.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004245653-A (JP)
Title: Apparatus and method for measuring electric current
Inventor: KIKUCHI KATSUHIDE
IPC: G01R19/00
Filed: 2003-02-12
Abstract: <P>PROBLEM TO BE SOLVED: To accurately measure an electric current by enabling current measurement in consideration of the temperature characteristics and secular degradation of a current sensor.  <P>SOLUTION: A reference current generating circuit 20 supplies a reference current for each current sensor 24 via a conductor 22 for reference. A current passing through the conductor 22 for reference becomes a common reference current and passes through five current sensors 24. The reference current generating circuit 20 controls a reference current value into a prescribed current value on the basis of instructions of a measurement control part 30. On the basis of both the reference current value supplied for the current sensors 24 from the reference current generating circuit 20 and measurement values outputted from the current sensors 24, the measurement control part 30 computes a current value actually outputted from a battery 10 to a load 12.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004245706-A (JP)
Title: Drilling well displacement measuring device
Inventor: FUJITA TAKATOYO
IPC: E02D3/12
Filed: 2003-02-14
Abstract: <P>PROBLEM TO BE SOLVED: To provide a drilling well displacement measuring device capable of precise displacement measurement for drilling a well while keeping utility and durability.  <P>SOLUTION: The drilling well displacement measuring device is constituted such that a cable guard pipe 9 is held in a hollow screw rod 6 keeping a clearance between an internal peripheral surface, a cable 15 is extended from a clinometer 18 stored in the bottom end part of cable guard pipe through the inside of the cable guard pipe 9 to a measuring equipment via a slip ring 21 at the upper part of the cable at the upper part of the hollow screw rod 6, preferably the cable guard pipe 9 is provided with a mail socket 24 at its one end and a female socket 25 at the other end for connecting freely and successively, and more preferably the mail socket 24 and the female socket 25 are separated and an intermediate guard pipe 26 having proper length for the use is interposed therebetween.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004247619-A (JP)
Title: Holder, exposure device, and device manufacturing method
Inventor: MURASATO NAOKI
IPC: G02B7/00
Filed: 2003-02-17
Abstract: <P>PROBLEM TO BE SOLVED: To provide a holder which can realize a projection optical system having a desired optical performance and a high resolution by reducing an aberration caused by the deformation of an optical member resulting in the deterioration of an imaging performance.  <P>SOLUTION: The holder for holding the optical member comprises a means for detecting a deformation in the shape of the optical member and a unit for adjusting the shape of the optical member on the basis of the deformation.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004244093-A (JP)
Title: Cap with tamper preventive capability and container using the same
Inventor: SASO TAKAYUKI
IPC: B65D41/17
Filed: 2003-02-17
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a cap having a high degree of enclosing capability and a sure tamper preventive capability before unsealing, capable of being easily opened when opening the cap, and of being opened and closed, after being unsealed, with single motion with a weak enclosing capability and locking capability, and to obtain a container applying the same.  <P>SOLUTION: The cap is formed of an annular engaging wall 3 vertically extending downward from a ceiling wall 2, at the lower part of which a hem part 4 having a form of a skirt is formed, with the annular engaging wall 3 being constituted of a dual structure having an engaging wall 7 on whose inner peripheral face engaging protrusions 10 that engage with the engaging jaw part of the container mouth part are formed and a TE band 8 formed around the outer face of the engaging wall 7, while, on the inner surface of the hem part 4, a protrusion 20 is formed that corresponds to a cam provided on the mouth part of the container.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2003318793-A (JP)
Title: Radio communication apparatus and radio communication method
Inventor: MIYANO KENTARO
IPC: H04B7/08
Filed: 2003-02-18
Abstract: <P>PROBLEM TO BE SOLVED: To reduce interference due to a signal transmitted from a terminal using the same frequency in a single direction.  <P>SOLUTION: When the communication speed of a transmission signal is not less than prescribed, an antenna switching section 104 outputs a transmission signal to an antenna 102 for vertical polarization, and when the communication speed of the transmission signal is less than prescribed, the section 104 outputs a transmission signal to an antenna 103 for horizontal polarization. The antenna 102 transmits the transmission signal in vertical polarization. The antenna 103 transmits the transmission signal in horizontal polarization. An antenna 202 receives radio signals principally in vertical polarization. An antenna 203 receives radio signals principally in horizontal polarization. When the communication speed is not less than the prescribed value, an antenna switching section 204 outputs a signal received by the antenna 202 to a receiving section 206, and when the communication speed is less than the prescribed value, the section 204 outputs a signal received by the antenna 203 to the section 206.  <P>COPYRIGHT: (C)2004,JPO
Patent JP-2004250146-A (JP)
Title: Paper inversion device
Inventor: OTOMO SATOSHI
IPC: B65H29/58
Filed: 2003-02-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a paper inversion device at low cost with a smaller size, which is capable of inversing and re-feeding paper to realize stabilized paper conveyance.  <P>SOLUTION: A flexible sheet member 10 is stuck on a guide 4 in the vicinity of the inlet roller 3 of a carry-in passage 7. The recording paper 20 sent to a carrying passage 7 from a double-sided branching pawl 9 pushes the sheet member 10 aside, and is sent to a pair of contacting/ separating rollers 6 in a turn-up passage 5. Then, the rollers 6 are reversed to send the paper 20 to the carrying roller 8 in the carry-in passage 7. A sensor 11 provided in the way of the carrying passage 7 detects the front edge of the paper 20, and according to the detection signal, the rollers 6 are connected/separated and reversely rotated. There further provided a side fence 12 as a means adjusting a position in a paper width direction, and an adjusting mechanism 15 adjusting a space between side fence members 13, 14 according to the size of the paper 20, thereby correcting the deviation between the conveyance center and the actual center of the paper 20 to prevent the center deviation of a double-sided image.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2004252657-A (JP)
Title: Drive circuit for internal data bus and external data bus of microcomputer peripheral circuit
Inventor: TAKEUCHI HIROYUKI
IPC: G06F13/42
Filed: 2003-02-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide an internal data bus drive circuit and an external data bus drive circuit inside a custom LSI, capable of coping with high-speed reading of a microcomputer with a small occupying area on an integrated circuit.  <P>SOLUTION: A PMOS transistor between a power source and each bit line of an internal data bus sets the bit line to an H level when a read enable signal is in an L level. The internal data bus drive circuit has an NMOS transistor between the bit line and a ground, and the NMOS transistor is electroconducted to set the bit line to an L level when the PMOS transistor is not electroconducted and when transmission data are in an L level. A data latch of the external data bus drive circuit is reset during an L level of a read signal, and a signal formed by inverting a signal of the internal data bus is latched at time when a prescribed time lapses from the rising of the read signal. A 3-state non-inverting driver drives a bit line of an external data bus corresponding to a signal formed by inverting an output signal of the data latch only during an H level of the read signal.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2003294520-A (JP)
Title: Seat weight measuring device
Inventor: AOKI HIROSHI
IPC: B60R21/16
Filed: 2003-02-20
Abstract: <P>PROBLEM TO BE SOLVED: To provide a seat weight measuring device which is improved so that measurement of higher accuracy can be performed.  <P>SOLUTION: A load sensor 50 has a sensor plate 51 of a cantilever deformed elastically by taking sensor applied loads, and a plurality of strain gages 54a, 54c secured to one surface (strain measuring surface) of it. When the sensor plate is deformed by taking the sensor applied loads, the sensor plate is deformed so that a part of the plurality of the strain gages is subjected to tensile strain and the other part is subjected to compressive strain.  <P>COPYRIGHT: (C)2004,JPO