baber/WOPTO huggingface dataset:
Patent JP-2017073843-A (JP)
Title: Remote supervisory control device
Inventor: NISHIO KOYA
IPC: H02J13/00
Filed: 2015-10-05
Abstract: PROBLEM TO BE SOLVED: To provide a remote supervisory control device capable of safely and quickly replacing a TRD.SOLUTION: A remote supervisory control device 100 comprises one or more TRDs 1 and a case 2. The TRD 1 includes a conversion circuit inside a frame 1f. The TRD 1 can convert a value of AC current input from a current transformer CT and a value of AC voltage input from a voltage transformer PT to DC values to output the DC values. The case 2 can house the TRD 1 inside. The TRD 1 includes a front panel 1a that is freely fixed on the front side of the case 2, and a plurality of first connection terminals 11t arranged on a back panel 1b. The case 2 includes a rear surface plate 2a arranged so as to be opposite to the back panel 1b, and a plurality of second connection terminals 21t. The second connection terminal 21t includes a one end side protruding from the rear surface plate 2a to the first connection terminal 11t, an elastic part 211 electrically connectable to the first connection terminal 11t, and a connection part 212 that is provided on the other end side and electrically connects with the current transformer CT or the voltage transformer PT.SELECTED DRAWING: Figure 2
Patent JP-2016087691-A (JP)
Title: Pb-FREE SOLDER AND ELECTRONIC PARTS BUILT-IN MODULE
Inventor: YASUI TSUTOMU
IPC: C22C19/03
Filed: 2015-10-05
Abstract: PROBLEM TO BE SOLVED: To prevent melting upon re-heating from occurring while suppressing the deterioration of workability.SOLUTION: A second metal including at least an Ni-Fe alloy is added to a first metal including at least Sn and Bi to constitute a Pb-free solder. The Pb-free solder allows a reaction between Sn as the first metal and an Ni-Fe alloy as the second metal to proceed in a melting process in the first place and is formed of an Ni-Sn phase on the structure of the Pb-free solder hardened after melting. Thereby, the Pb-free solder once molten and hardened has a melting point elevated as compared to that before being molten in the first place, has an improved heat resistance and can prevent the melting upon the re-heating from occurring. Further, the Pb-free solder can bond two members according to the same process as the ordinary solder and, therefore, the deterioration of workability upon the bonding of two members is suppressed.SELECTED DRAWING: Figure 1
Patent JP-2017071708-A (JP)
Title: Thermosetting epoxy resin composition and optical semiconductor device
Inventor: TAKAMATSU NORIHITO
IPC: H01L23/29
Filed: 2015-10-08
Abstract: PROBLEM TO BE SOLVED: To provide a thermosetting epoxy resin composition that has excellent crack resistance and high strength, and is small in burr length and linear thermal expansion coefficient.SOLUTION: The present invention provides a thermosetting epoxy resin composition comprising a prepolymer obtained by the reaction between (A) an alicyclic epoxy compound having one or more epoxy group and one or more alicyclic structure in one molecule and (B) an acid anhydride free from a carbon-carbon double bond, (C) inorganic filler (excluding the following (D) white pigment), and (D) white pigment, (E) (meth) acryl block copolymer, and (F) curing accelerator.SELECTED DRAWING: None
Patent JP-2017072791-A (JP)
Title: Molding with nanostructure
Inventor: KAJITANI SHUNICHI
IPC: B29C51/12
Filed: 2015-10-09
Abstract: PROBLEM TO BE SOLVED: To provide a thermoplastic resin molding to which a film having a nanostructure is uniformly fused even when a thermoplastic resin molding has a curved surface and a step.SOLUTION: In a molding 100A with a nanostructure, a nanostructure film 21 having a nanostructure 22, in which a structure 25 formed from a recess or a projection on the surface of a film is provided at a pitch with a visible light wavelength or less, is fused to a thermoplastic resin molding 50 so that the nanostructure 22 is placed on the outer side. A thickness of the nanostructure film 21 in the molding 100A with the nanostructure is 1-10 μm.SELECTED DRAWING: Figure 1B
Patent JP-2017074679-A (JP)
Title: Decorative sheet
Inventor: KOBAYASHI HIROYUKI
IPC: B32B27/42
Filed: 2015-10-13
Abstract: PROBLEM TO BE SOLVED: To provide a decorative sheet excellent in processability and excellent in smoothness of a surface.SOLUTION: There is provided a decorative sheet 100 having a surface layer 11 and a core material layer 12, wherein the surface layer 11 contains a melamine resin, the core material layer 12 contains a fire retardant nonwoven fabric, and satisfying conditions of the following formula [1] and the following formula [2]: 1000≤B/A≤2000 [1]; 0.4≤T/Y≤2.5 [2], where average diameter of a fiber constituting the fire retardant nonwoven fabric is A [μm], average length of the fiber is B [μm], tensile strength in a first direction, which is an in-plane direction of the fire retardant nonwoven fabric is T [N/25 mm] and tensile strength in a second direction orthogonal to the first direction, which is an in-plane direction of the fire retardant nonwoven fabric is Y [N/25 mm]. There is provided a decorative sheet 100, wherein the fire retardant nonwoven fabric is a glass nonwoven fabric and the surface layer 11 is one by impregnating the melamine resin into a fabric substrate.SELECTED DRAWING: Figure 1
Patent JP-2016034531-A (JP)
Title: Game machine
Inventor: OGURA TOSHIO
IPC: A63F7/02
Filed: 2015-10-14
Abstract: PROBLEM TO BE SOLVED: To provide a game machine that is enhanced in interest in a game.SOLUTION: After execution of a stop pattern notice for stopping a chance pattern ("1, 1, 2") indicating low jackpot reliability as shown in (C) and (D), a background change notice may be executed, where a background image in an image display device 5 indicating low jackpot reliability changes from an image (normal background image) with the daytime as a motif to a background image (special background image) with the nighttime as a motif as shown in (E) to (G). In this manner, in transition from a stop pattern notice to a background change notice, only a predetermined varying notice performance can be executed.SELECTED DRAWING: Figure 29
Patent JP-2017076731-A (JP)
Title: LED light emitting device
Inventor: UENO TETSUYA
IPC: H01L33/62
Filed: 2015-10-16
Abstract: PROBLEM TO BE SOLVED: To prevent occurrence of positional deviation of the optical axis of LED with a simple configuration in an LED light emitting device using a shell type LED.SOLUTION: An LED light emitting device 1 includes an LED 10 and a mounting substrate 20. In the LED 10, the outer shape of a mold portion 11 in which a light emitting element is sealed is formed in a shell shape and includes leads 12A and 12B protruding outwards from the opposite side to a light emitting portion 11a of the mold portion 11. A mounting board 20 includes a through-hole 21 having an inner diameter substantially coincident with the outer diameter of the mold portion 11 of the LED 10, and the LED 10 is mounted on the mounting board 20. The mold portion 11 of the LED 10 is fitted in the through-hole 21 of the mounting board 20, the leads 12A and 12B are bent at an angle of 90 degrees or more at a bent portion 12e as a portion between a base portion 12d and a tip portion 12c, and the tip portion 12c thereof is joined to the mounting board 20.SELECTED DRAWING: Figure 1
Patent JP-2017079233-A (JP)
Title: Protective tape and method for manufacturing semiconductor device
Inventor: MORIYAMA HIRONOBU
IPC: H01L23/31
Filed: 2015-10-19
Abstract: PROBLEM TO BE SOLVED: To suppress chipping of a wafer and improve solder joinability when a semiconductor chip is mounted.SOLUTION: There is provided a method for manufacturing a semiconductor device which includes: a step of sticking a protective tape 10 having an adhesive layer 11, a thermoplastic resin layer 12 and a base material film layer 13 in this order onto a wafer 21 surface having a bump electrode 22 formed thereon; a step of grinding an opposite surface to a protective tape 10 stuck surface of the wafer 21; a step of sticking an adhesive tape 30 to the ground surface of the wafer 21; a step of peeling the protective tape 10 while leaving the adhesive layer 11 and removing the other layers; a step of dicing the wafer 21 to which the adhesive tape 30 is stuck to obtain individual semiconductor chips; and a step of curing the adhesive layer 11 before dicing, where a storage shear modulus of the adhesive layer 11 after curing is 3.0E+08 Pa to 5.0E+09 Pa, and a ratio (thickness of adhesive layer before sticking/height of bump electrode) of the thickness of the adhesive layer 11 of the protective tape 10 before sticking to the height of the bump electrode 22 is 1/30 to 1/6.SELECTED DRAWING: Figure 2
Patent JP-2017078911-A (JP)
Title: Card type data storage device
Inventor: OMOTE HIROFUSHI
IPC: G01D21/00
Filed: 2015-10-19
Abstract: PROBLEM TO BE SOLVED: To provide a card type data storage device having, for example, novel constitution less in trouble.SOLUTION: A data storage device according to an embodiment has a first sensor provided on a substrate and located on the opposite side from a first wall part. A second sensor or output part is provided on the substrate and located on the opposite side from the fist wall part, and also arranged together with the first sensor in a first direction along a first end. A memory is provided on the substrate and arranged on the opposite side from the fist wall part, and stores data showing a detection result of the first sensor or second sensor. A control section is provided on the substrate, and located on the opposite side from the first wall part more remotely from the first end than the first sensor, second sensor or output section, and controls writing of the data showing the detection result of the first sensor or second sensor to the memory or reading from the memory.SELECTED DRAWING: Figure 4
Patent JP-2017078814-A (JP)
Title: Sealing kit, sealing structure, cartridge for image forming apparatus having sealing structure, method of sealing leakage of toner, and method of reusing toner storage container
Inventor: HARADA KENTARO
IPC: C08K5/544
Filed: 2015-10-21
Abstract: PROBLEM TO BE SOLVED: To provide a sealing kit excellent in workability, sealability, and repairability, a sealing structure, a cartridge for an image forming apparatus having a sealing structure, a method of sealing leakage of toner, and a method of reusing a toner storage container.SOLUTION: In a developing cartridge 3, a toner storage container 3a for storing a toner and a doctor blade 3d are sealed with a sealing structure 3f formed of a porous elastic foam and an adhesive layer formed only of a cured product of an adhesive composition so as to seal leakage of a toner from the toner storage container 3a. A liquid adhesive composition is excellent in coating workability, and the sealing structure is excellent in sealability and repairability.SELECTED DRAWING: Figure 1
Patent JP-2016026012-A (JP)
Title: Game machine
Inventor: BANNO MAKOTO
IPC: A63F7/02
Filed: 2015-10-28
Abstract: PROBLEM TO BE SOLVED: To provide a game machine capable of eliminating an irritated feeling caused by a game stop.SOLUTION: A Pachinko machine includes performance mode change input means for changing selection of one of a plurality of game performance input modes 1-3 by manual input operation. A display control device of the Pachinko machine includes: performance mode update means for updating storage contents of the performance mode storage means according to a mode selection signal from game performance mode change input means; and means for activating the performance mode update means during a high-speed variation period of a first pattern row Z1. Thus, during a period from variation start to a change from high-speed variation to low-speed variation of the first pattern row Z1, selection of a performance mode can be changed, a change is performed to a performance mode selected at the point of time in the selection change, and variation display of the selected performance mode is executed.SELECTED DRAWING: Figure 27
Patent JP-2016097301-A (JP)
Title: Ventilation-type brain wave detection device
Inventor: LIN CHIN-TENG
IPC: A61B5/296
Filed: 2015-10-28
Abstract: PROBLEM TO BE SOLVED: To provide a ventilation-type brain wave detection device.SOLUTION: The ventilation-type brain wave detection device comprises: a ventilation-type cap to be worn on the head of a subject; and one or more detection electrodes 20. In the ventilation-type cap, plural support strips are installed and the detection electrodes 20 are installed on the support strips. After the air is supplied into the ventilation-type cap, the detection electrodes 20 are stuck to the head of the subject and detect brain wave signals. The ventilation design makes it possible to widely apply the ventilation-type brain wave detection device to the detection of brain wave signals at the different sizes of head peripheries, and extremely excellent development potential and industrial utilization are obtained.SELECTED DRAWING: Figure 7
Patent JP-2017084610-A (JP)
Title: Ground spring, display device and grounding method
Inventor: OKADA YOSHIFUMI
IPC: H01R4/64
Filed: 2015-10-28
Abstract: PROBLEM TO BE SOLVED: To sufficiently ensure grounding of a function extension module that is inserted into a slot of a display device, even if thinning of the display device comprising the function extension module that can be inserted/ejected progresses.SOLUTION: A ground spring 20 for electrically connecting a function extension spring 5 to an interposing portion 12 of a back cover 3 and a bracket 4 of the display device comprises: a fixed part 21 which has conductivity and is formed while being bent, elastically deformable and fixed in the interposing portion of the bracket; a first contact part 22 which is formed while extending from the fixed part via a first folding portion 24 and elastically displaceable relatively to the fixed part and can be brought into contact with one of the back cover and the function extension module that is inserted into a slot 8; and a second contact part 23 which is formed while extending from a distal end of the first contact part in an extension direction via a second folding portion and elastically displaceable relatively to the first contact part and can be brought into contact with the other of the back cover and the function extension module.SELECTED DRAWING: Figure 10
Patent JP-2017082105-A (JP)
Title: Method for producing fiber-reinforced curable resin
Inventor: TOMINAGA YUICHI
IPC: C08J5/04
Filed: 2015-10-28
Abstract: PROBLEM TO BE SOLVED: To provide a fiber-reinforced curable resin with an excellent interfacial adhesion between regenerated carbon fiber and curable resin.SOLUTION: A method for producing fiber-reinforced curable resin has a step for irradiating a resin composite material comprising regenerated carbon fiber and thermosetting resin with microwaves. A method for producing an article has a step for producing fiber-reinforced curable resin using the method for producing fiber-reinforced curable resin.SELECTED DRAWING: None
Patent JP-2016028454-A (JP)
Title: Method of cleaning semiconductor wafers
Inventor: BARR ROBERT K
IPC: C11D3/04
Filed: 2015-11-02
Abstract: PROBLEM TO BE SOLVED: To provide a method of cleaning contaminants on semiconductor wafers.SOLUTION: A method of cleaning semiconductor wafers using an acid cleaner followed by an alkaline cleaner to clean contaminants from substances is provided. The acid cleaner removes substantially all of metal contaminants. On the other hand, the alkaline cleaner removes substantially all of non-metal contaminants such as an organic substance and a particulate substance.SELECTED DRAWING: None
Patent JP-2017087786-A (JP)
Title: Control device of four-wheel drive vehicle
Inventor: YAGI YASUSHI
IPC: B60K17/348
Filed: 2015-11-04
Abstract: PROBLEM TO BE SOLVED: To determine a friction coefficient of a road surface at an earlier stage while suppressing deterioration of fuel consumption performance.SOLUTION: A four-wheel drive vehicle 1 includes: driving force distribution means 8 for distributing driving force generated in a driving source 10 to rear wheels 102 and 102 to be main driving wheels and front wheels 101 and 101 to be auxiliary driving wheels; and control means 200 including driving force distribution control means 202 for controlling the driving force distribution means. The control means further includes friction coefficient determination means 207 for determining a friction coefficient μ of a road surface on the basis of the driving force of the front wheels 101 when a prescribed condition is established. When the prescribed condition is established, forward traveling in which a steering angle is less than a prescribed steering angle is performed and the driving force distributed to the front wheels 101 is less than prescribed driving force, the driving force distribution means 8 is controlled so that driving force of the prescribed driving force or more is distributed to the front wheels 101 by the driving force distribution control means 202, and the friction coefficient μ of the road surface is determined on the basis of the driving force of the prescribed driving force or more distributed to the front wheels 101 by the friction coefficient determination means 207.SELECTED DRAWING: Figure 8
Patent JP-2017090097-A (JP)
Title: Cylinder internal pressure sensor
Inventor: NAKAYAMA MASAO
IPC: G01L23/22
Filed: 2015-11-04
Abstract: PROBLEM TO BE SOLVED: To facilitate adjustment of natural frequency in a cylinder internal pressure sensor.SOLUTION: A cylinder internal pressure sensor 30 comprises: a cylindrical housing 31; a diaphragm 40 having flexibility and provided on an end of the housing 31; a counter member 50 facing the inner face of the diaphragm 40 and forming an accommodation chamber 60 between the diaphragm 40 and itself; and a sensor element 70 accommodated in the accommodation chamber 60 and an output signal of which changes in response to the deformation of the diaphragm 40. In this cylinder internal pressure sensor 30, the counter member 50 has a cylindrical layer-structured cylinder part 51 having an inner tube 52 and an outer tube 53, and a sealing part 54 provided on the inside of the cylinder part 51, in which the sensor element 70 is secured, with a through-hole 52A as a thickness reducing part provided in the cylinder part 51, the inner tube 52 and the outer tube 53 being joined at a position more apart from the diaphragm than the through-hole 52A is.SELECTED DRAWING: Figure 2
Patent JP-2017085975-A (JP)
Title: Methods for enhancing immunostimulating activity of lactic acid bacteria
Inventor: KATO YUKIKO
IPC: C12N1/38
Filed: 2015-11-10
Abstract: PROBLEM TO BE SOLVED: To provide lactic acid bacteria with enhanced immunostimulating activity not mixed with esters of polyhydric alcohols and fatty acids.SOLUTION: The invention provides a method comprising a step of contacting a lactic acid bacterium having an immunostimulating activity with a composition containing an ester of a polyhydric alcohol and a fatty acid as an effective ingredient to enhance the immunostimulating activity of the lactic acid bacterium; and then a step of washing the lactic acid bacterium to remove the composition to produce a lactic acid bacterium having an enhanced immunostimulating activity but free from the ester of the polyhydric alcohol and the fatty acid.SELECTED DRAWING: None
Patent JP-2017092275-A (JP)
Title: Semiconductor device
Inventor: HISAKA TAKAYUKI
IPC: H01L21/321
Filed: 2015-11-11
Abstract: PROBLEM TO BE SOLVED: To obtain a semiconductor device that is small in variation of a capacitance value of an MIM capacitor in a multilayer wiring structure, and that can be easily connected with the other circuit element on a semiconductor substrate.SOLUTION: In an MIM region 8, a second wiring layer 5 doubles as an upper electrode 9 of an MIM structure, and a dielectric film 4 doubles as a capacitance film of the MIM structure, and a first wiring layer 2 doubles as a lower electrode 10 of the MIM structure. The upper electrode 9 of the MIM structure, is formed inside a first opening 11a so as to be separated from an end part of the opening 11a. The upper electrode 9 of the MIM structure is connected with the other circuit element by a third wiring layer 7, via a second opening 12a. The lower electrode 10 (the first wiring layer 2) of the MIM structure is connected with the other circuit element by the third wiring layer 7 through a relay electrode 13, via the second opening 12b.SELECTED DRAWING: Figure 1
Patent JP-2016027506-A (JP)
Title: POS system
Inventor: ONO TETSUO
IPC: G07G1/06
Filed: 2015-11-11
Abstract: PROBLEM TO BE SOLVED: To suppress the consumption of sheets due to the printing of authentication receipts as much as possible when the authentication receipts are printed.SOLUTION: Control means performs control, when allowing an authentication receipt on which an adjustment result using a privilege medium is printed to be issued: to print, on a sheet, at least a header area showing that the authentication receipt is a purchase detail receipt and a transaction detail area showing a transaction detail content; next, to execute the cutting off of the sheet and the printing of the header area showing that the sheet is the authentication receipt at a predetermined timing for the cutting off of the sheet; and then, to print the transaction detail area showing the transaction detail content.SELECTED DRAWING: Figure 8
Patent JP-2017089841-A (JP)
Title: clip
Inventor: IWAHARA TOSHIO
IPC: F16B19/00
Filed: 2015-11-16
Abstract: PROBLEM TO BE SOLVED: To amend both inclination and rotational displacement of an engaging leg before the engaging leg is fitted against a fixing hole and reduce an insertion resistance, always keep appropriately the fitted state of the engaging leg and positively position-set the engaging leg under its fitted state without being loosened.SOLUTION: This invention relates to a clip 20 that is fixed to a mating member under a fitted state in which an engaging leg 24 is inserted into the attachment hole of a long hole shape opened thereon. The engaging leg 24 comprises a supporting column 26 and engaging claws 36 positioned at both sides of the supporting column. There are provided a straight surface 28 having a size in a direction where it is crossed at right angle with both engaging claws 36 kept constant, an inclined taper surface 30 where a size in a direction crossing at a right angle with both engaging claws 36 is gradually decreased toward the extremity end of the column and an inclined releasing surface 40 inclined along a direction around an axis line of the column 26 at a region overlapping at least a part of the tapered surface 30.SELECTED DRAWING: Figure 6
Patent JP-2017095956-A (JP)
Title: Sliding door device with handrail part
Inventor: MATSUZAKI MASATOYO
IPC: E05B1/00
Filed: 2015-11-24
Abstract: PROBLEM TO BE SOLVED: To provide a sliding door device with no need to design a corridor to be wide in order to install a handrail part.SOLUTION: A cover member 14 is swingably supported by a sliding door body 10. If the cover member 14 is switched to an open position, a marginal part 10a of the sliding door body can be used as a handrail part as shown in the figure 1(d). As the cover member 14 is stored inside the sliding door body 10 and does not protrude from front or rear surface of the body 10 when the cover member is not used, there is no need to design a corridor to be wider (compared to a structure in which the handrail protrudes to the corridor side).SELECTED DRAWING: Figure 1