baber/WOPTO huggingface dataset:
Patent TW-I260036-B (TW)
Title: Semiconductor device, method of manufacturing semiconductor device, resin molding die, and semiconductor manufacturing system
Inventor: HARADA SUSUMU
IPC: H01L21/00
Filed: 2001-05-02
Granted: 2006-08-11
Abstract: In a semiconductor device manufacturing method, at least a semiconductor element is arranged in a cavity of a resin molding die. A resin is supplied to a resin reservoir in direct contact with the cavity and is then injected in order to substantially fill the cavity. The resin filled in the cavity forms a resin seal for encapsulating the semiconductor element. The resin seal has a recess or a protrusion as a remainder of the resin reservoir.
Patent TW-492150-B (TW)
Title: Copper interconnects with improved electromigration resistance and low resistivity
Inventor: WOO CHRISTY MEI-CHU
IPC: H01L23/532
Filed: 2001-05-30
Granted: 2002-06-21
Abstract: Copper interconnects are formed by depositing substantially pure copper (30) into the lower portion of an interconnect opening (24). The upper portion of the interconnect opening (24) is then filled with doped copper (32) followed by a planarization process. The resulting copper interconnect exhibits reduced electromigration while maintaining low overall resistivity.
Patent TW-567474-B (TW)
Title: Disk device
Inventor: WATANABE MASASHI
IPC: G11B33/12
Filed: 2001-06-06
Granted: 2003-12-21
Abstract: The fix type disk device is disclosed. The disk is provided in the frame. The frame is covered by the covers, a gap is formed between the edge of the cover and the frame, and the gap is sealed by the sheet provided with adhesion portion.
Patent TW-579359-B (TW)
Title: Container for fast food and its main body
Inventor: KANO TOSHIAKI
IPC: B65D85/816
Filed: 2001-06-08
Granted: 2004-03-11
Abstract: This invention provides a container for fast food where the lid may be prevented from excessive opening upon peeling the lid that is adhered to the flange of the container body. On the top of the flange (6a, 6b, 6c, 6d) of a container body (1) is formed with two protrusions (7, 7, 12, 12) that are raised above the top of the flange and spaced at a fixed gap, such that their adhesive force acted on an inside of the lid (2) is stronger than the remaining portion. The entire or part of the protrusions (7, 12) are provided at a location that is recessed more inward than the inner periphery of the flange, to enhance the adhesive force of the protrusions (7, 12), such that when one intends to pour hot water, the user only needs to peel the lid (2) to an extent located between the protrusions (7, 7). The lid (2) may then be further peeled to an extent located between the protrusions (12, 12) upon draining the hot water.
Patent TW-574355-B (TW)
Title: Heat-transfer fluid containing nano-particles and carboxylates
Inventor: MAES JEAN-PIERRE
IPC: C10N10/02
Filed: 2001-06-19
Granted: 2004-02-01
Abstract: The use of sub-micron particles (nano-particles) and carboxylates for improving the heat-exchange characteristics of heat-transfer fluids or antifreeze coolants. The carboxylates form a stable physisorbed- or chemisorbed carboxylate protective layer on metallic nano-particles that does not hinder heat-transfer. The combination of carboxylates and metallic nano-particles provide excellent corrosion protection, improved heat-transfer and enhances the stability of the sub-micron particles (nano-particles) in suspension. Sub-micron particles (nano-particles) treated with carboxylates to form a chemisorbed carboxylate protective layer are used in a heat transfer fluid or a lubricant or hydraulic fluid or soap. <IMAGE>
Patent TW-498521-B (TW)
Title: Semiconductor package with enhanced heat-dissipation efficiency
Inventor: HE TZUNG-DA
IPC: H01L23/373
Filed: 2001-08-03
Granted: 2002-08-11
Abstract: There is provided a semiconductor package with enhanced heat-dissipation efficiency, which comprises at least one die attached to a substrate formed thereon at least one die-attach region defined therein a plurality of thermal vias passing through the substrate, such that the top of the thermal vias can be connected to the die attached to the substrate, and the bottom thereof is connected to the thermal pad formed below the substrate and corresponding to the die-attach region. The thermal pad has a surface directly exposed to the atmosphere. Therefore, the heat generated by the die can be dissipated to the atmosphere via the thermal vias and the exposed surface of the thermal pad, so as to effectively increase the heat dissipating efficiency of the semiconductor package.
Patent TW-515871-B (TW)
Title: Dynamic-static mixing pressure fluid bearings and method of manufacturing same
Inventor: HUANG CHING-HSING
IPC: F16C33/10
Filed: 2001-08-21
Granted: 2003-01-01
Abstract: Disclosed is a dynamic-static mixing pressure fluid bearings and method of manufacturing the same. On the linen surface in the bearing base is engraved with penetrative dynamic pressure slits so as to significantly eliminate the hardship involved in machining minute slits. The engagement between the bearing base and the linen is enhanced by a porous material containing lubricant therein. When external air pressure is applied to the porous material, the pressure pre-applied by the air after sealing causes the lubricant to fill the gap between the linen and the axle so as to provide fluidic lubricating and supporting effects for the bearings with respect to the axle.
Patent TW-I245213-B (TW)
Title: Construction method of multi-code composite key
Inventor: GUO YING-YU
IPC: G06F3/023
Filed: 2001-09-21
Granted: 2005-12-11
Abstract: This invention provides a construction method of multi-code composite key for the composite functional key in computer keyboard keys. Wherein, in the microprocessor memory of computer keyboard, or the memory of computer host, it pre-builds multiple sets of different key code tables. It establishes and provides multiple sets of key function menus in corresponding to different code tables in computer host for selection. After selection on the key function menu on the computer host, it sends a code-switching signal to the microprocessor of computer keyboard by the computer host. Therefore, the microprocessor calls the key code table corresponding to the selected key function menu item. It plays the role as the reference of functional operation and computer keyboard keys and encoding.
Patent TW-518765-B (TW)
Title: Thin film transistors on plastic substrates with reflective coatings for radiation protection
Inventor: WOLFE JESSE D
IPC: H01L29/786
Filed: 2001-11-02
Granted: 2003-01-21
Abstract: Fabrication of silicon thin film transistors (TFT) on low-temperature plastic substrates using a reflective coating so that inexpensive plastic substrates may be used in place of standard glass, quartz, and silicon wafer-based substrates. The TFT can be used in large area low cost electronics, such as flat panel displays and portable electronics such as video cameras, personal digital assistants, and cell phones.
Patent TW-517365-B (TW)
Title: Heat dissipation plate and its bonding process with substrate
Inventor: CHIN HUNG
IPC: H01L21/60
Filed: 2001-11-29
Granted: 2003-01-11
Abstract: This invention relates to a heat dissipation plate and its bonding process with substrate, which has a primary structure containing a substrate, which has at least a chip bonded and electrically connects with the chip through gold wire made by wire-bonding technique; an adhesive layer with a adequate thickness applied by a screen printing method to glue the heat dissipation plate; and a heat dissipation sheet made of thin-shell plate body using dimples on the bottom of the heat dissipation plate to pick up the above-mentioned adhesive layer. After adequate amount of adhesive is obtained, the heat dissipation plate covers the chip and its gold wire to bond to the substrate by the adhesive on the dimples.
Patent TW-508650-B (TW)
Title: Preventive maintenance device for process reaction chamber
Inventor: LIAU MAU-CHENG
IPC: H01L21/00
Filed: 2001-12-28
Granted: 2002-11-01
Abstract: There is provided a preventive maintenance (PM) device for process reaction chamber, which is connected to, for example, a chemical vapor deposition (CVD) process reaction chamber for performing preventive maintenance, and which is characterized as follows. An air pump is connected with the exhaust pipe in the chamber. The processed work-piece in the chamber can be cleaned or removed through a sliding door when pumping air. The top cover of the chamber can be rotated 360 degrees so that every corner of the chamber can be cleaned. Most of the device's parts are made with transparent materials, such as acrylics. With the preventive maintenance device for process reaction chamber in accordance with the present invention, it is able to restrict the pollutant source diffusing, prevent workers from contacting and breathing poison gas, and effectively avoid industrial accident.
Patent TW-504492-B (TW)
Title: Micro-pump of gas thermal expansion driven type and method of manufacturing the same
Inventor: JOU JENG-SAN
IPC: B81B3/00
Filed: 2002-02-22
Granted: 2002-10-01
Abstract: The present invention provides a micro-pump of gas thermal expansion driven type and method of manufacturing the same, utilizing the thrust generated by thermal expansion of gas and a dual chamber design, which the first chamber is filled with driving gas and the second chamber is filled with liquid fluid. By the high temperature generated from a heater provided in the first chamber, the driving gas is heated and expands to form bubbles compressing the liquid fluid of the second chamber, so as to achieve a function of injecting liquid fluid droplet. The heater in the first chamber is provided on an insulating membrane produced by a silicone micro processing technique so as to increase the heating efficiency and reduce the power consumption. At the same time, by providing a adiabatic layer between the first and the second chamber by a manufacturing process design, the high temperature in the first chamber conducting to the liquid fluid in the second cavity can be avoided, so as to prevent the liquid fluid from degrading.
Patent TW-522770-B (TW)
Title: Printed board designing apparatus, printed board designing method, and recording medium on which control program for printed board design is recorded
Inventor: ETOH JYUN
IPC: G06F17/50
Filed: 2002-04-09
Granted: 2003-03-01
Abstract: A printed board designing apparatus and method is disclosed by which a printed circuit board which prevents occurrence of crosstalk with regard to various signals of high frequencies can be prevented. Signals to flow in each to adjacent ones of patterns are compared with each other in terms of the voltage, type and frequency, and occurrence of crosstalk is discriminated when the signals are different from each other in terms of at least one of the factors of the voltage, type and frequency. In a region of a display of the patterns in which the patterns between which occurrence of crosstalk is discriminated are positioned adjacent each other, a crosstalk possibility mark is displayed.
Patent TW-I221623-B (TW)
Title: Discharge lamp having improved shield
Inventor: WILSON CAROLYN E
IPC: F21Y101/00
Filed: 2002-04-16
Granted: 2004-10-01
Abstract: A high intensity discharge lamp assembly (10) has improved thermal venting. The discharge light source (12) is housed within a reflector body (20). Recesses (40) are circumferentially spaced around an open end (28) of the reflector body. A containment structure (50, 50', 50"") provides a structure that serves the containment function without interfering with the thermal venting.
Patent TW-I258214-B (TW)
Title: Data storage device and memory cell thereof
Inventor: NICKEL JANICE H
IPC: H01L27/10
Filed: 2002-04-24
Granted: 2006-07-11
Abstract: A data storage device includes a resistive cross point array of memory cells. Each memory cell includes a memory element and electrically conductive hard mask material on the memory element. The data storage device may be a magnetic random access memory (""MRAM"") device.
Patent TW-538658-B (TW)
Title: Manufacturing method for circuit device
Inventor: KOBAYASHI YOSHIYUKI
IPC: H05K1/00
Filed: 2002-05-28
Granted: 2003-06-21
Abstract: A manufacturing method for a circuit device is provided, wherein a Clamper 70 is used to press the circumference of a block 62 in a conductive foil 60 when the wire bonding between the circuit element 52A of a carrier unit 65 in the block 62 and the desired conductive pattern 51B is performed so as to efficiently perform the wire bonding. Meanwhile, during the wire bonding, nitrogen gas from the gas ways 75, 76 provided in the clamper 70 is blown onto the conductive foil 60 to thereby to prevent the conductive foil 60 from being oxidized. Compared with the case that a circuit device is manufactured by using ceramic substrate or flexible sheet as support substrate and mounting circuit elements on it, the method provided herein can assure the mass productivity of the circuit device even the circuit device is asked to be more compact and thinner.
Patent TW-564307-B (TW)
Title: Optical encoder alignment device
Inventor: LIN CHING-FANG
IPC: G01D5/00
Filed: 2002-06-05
Granted: 2003-12-01
Abstract: There is provided an optical encoder alignment device, which has a scale device, an alignment member, an elastic member and a housing. The scale device is provided to determine the original output cycle. The alignment member is wedged with the scale device for performing an alignment. The elastic member has a push part and a carrying part. The push part pushes the alignment member to the scale device. The carrying part is carried in the housing, wherein the elastic member is preferably to be a M-shape elastomer or a V-shape elastomer, and the width of the carrying part is larger than the inner diameter of the housing when the elastic member is in a free status.
Patent TW-588160-B (TW)
Title: Cell positioning method using signal interception
Inventor: HE YE-CHIN
IPC: G01S5/00
Filed: 2002-06-21
Granted: 2004-05-21
Abstract: The present invention provides a cell positioning method using signal interception. Generally, SS7 signaling is employed to transfer routing information among GSM switches for correctly establishing communication paths based on the routing information. In the present invention, the transmitting cell information of handset is embedded in the routing information transmitted by a transmitting switch. When the information is transmitted to a gate switch, the signal is extracted to resolve the information of the cell where the calling handset locates. The present invention successfully utilizes the routing information transfer mechanism of the conventional switch network to obtain the position information of the calling handset. In other words, this technique can be easily applied to switch networks of different brands.
Patent TW-586197-B (TW)
Title: Image sensor semiconductor package
Inventor: WANG RONG-HUEI
IPC: H01L23/492
Filed: 2002-07-16
Granted: 2004-05-01
Abstract: A non-ceramic image sensor semiconductor package with improved moisture resistance, lower cost, higher reliability, and lower profile is provided. A semiconductor chip with a vision chip active area is attached to a multi-layer resin mask organic substrate. A plurality of bonding wires are attached between conductive parts of the semiconductor chip and the multi-layer resin mask organic substrate to create selective electrical connections. A transparent window is placed on top of the semiconductor chip and covers the vision chip active area. A wire shielding block is formed on the multi-layer resin mask organic substrate around the semiconductor chip covering and protecting the bonding wires and the semiconductor chip not covered by the transparent window. A liquid encapsulant is formed to protectively seal the device but does not block the vision of the vision chip active area through the transparent window. Since no space is required between the vision chip active area, and the transparent window, the overall height of the device is reduced. This allows the image sensor semiconductor package of the present invention to be more compact.
Patent TW-I282701-B (TW)
Title: Organic electroluminescent device
Inventor: WANG YI-FAN
IPC: H01L51/50
Filed: 2002-08-16
Granted: 2007-06-11
Abstract: An organic electroluminescent device consists of a cathode, an ITO anode, an emitting layer, a hole transport layer, an electron transport layer, a hole injecting layer, and an intermediate layer. The location of the above layers is that the emitting layer located between the cathode and the ITO anode, the hole transport layer located between the emitting layer and the ITO anode, the electron transport layer located between the emitting layer and the cathode, the hole injecting layer ie between the hole transport layer and the ITO anode, and the intermediate layer located between the hole injecting layer and the hole transport layer.
Patent TW-556010-B (TW)
Title: Wavelength division multiplexer device
Inventor: TAI SHU-LIN
IPC: G02B6/34
Filed: 2002-09-09
Granted: 2003-10-01
Abstract: A wavelength division multiplexer (WDM) device includes a metal tube, a glass tube enclosed by the metal tube, a dual fiber pigtail having a first fiber and a second fiber, a GRIN lens engaging with the metal device via certain adhesive, a first filter mounted on the GRIN lens and a second filter mounted between the dual fiber pigtail and the GRIN lens. Light input from the filter only a first wavelength of light and reflects all others, which pass back through the GRIN lens to the second filter. The second filter reflects only the first wavelength of light and passes all others, which is transmitted into the second fiber.
Patent TW-565997-B (TW)
Title: Variable impedance network for an integrated circuit
Inventor: NAZARIAN HAGOP A
IPC: H03H11/00
Filed: 2002-09-13
Granted: 2003-12-11
Abstract: A variable impedance network for the use in building potentiometers and digital-to-analog converters (DAC) is disclosed. The impedance network is constructed such that it reduces the overhead circuits associated with it compared to conventional approach. The percent reduction of overhead circuitry including the wiper transistors increases exponentially as the number of the taps required for the potentiometer increases.
Patent TW-557619-B (TW)
Title: Ridge-waveguide semiconductor laser device
Inventor: MIHASHI YUTAKA
IPC: H01S5/12
Filed: 2002-09-24
Granted: 2003-10-11
Abstract: A laser device includes a double hetero-structure element constructed by depositing a p-type cladding layer, a quantum well active layer, an n-type thin first cladding layer and an n-type thick second cladding layer sequentially. A ridge-waveguide is shaped between two trenches formed in the second cladding layer. The first cladding layer serves as an etching stopper while etching the second cladding layer to form the two trenches. The trenches reach to or reach in vicinity to the surface of the first cladding layer. High-resistance regions may be formed in portions of the first cladding layer directly underneath the trenches. The thin first cladding layer suppresses leakage current and improves the temperature characteristics and the operating speed characteristics of the laser device.
Patent TW-I249542-B (TW)
Title: Polymer compound and polymer light-emitting device using the same
Inventor: OGUMA JUN
IPC: C09K11/06
Filed: 2002-10-31
Granted: 2006-02-21
Abstract: A polymer compound comprising a repeating unit represented by formula (1) and a repeating unit represented by formula (2), wherein, Ar1, Ar2 and Ar6 each independently represent an arylene group, a divalent heterocyclic compound group, etc.; Ar3 is an arylene group, arylene vinylene group, or a divalent heterocyclic compound group; Ar4 and Ar5 are each independently an aryl group or a monovalent heterocyclic compound group. The polymer compound has excellent characteristics of strong fluorescence and large charge transporting property.
Patent TW-I221089-B (TW)
Title: Cleaning implement
Inventor: NAKAMURA KAZUO
IPC: A46B13/02
Filed: 2002-11-12
Granted: 2004-09-21
Abstract: A durable cleaning implement can be used to effectively and reliably clean the floor or tatami without damaging a normal wiping member. A tilt formation part 10e is formed around the outer periphery of the rear lower part of a rotative brush 12. A wiping member maintaining groove with a lower opening 10f is formed between a tilt face formation part 10e and a front vertical upper part 10d of a dust housing part 10a. A wiping member maintaining protrusion sheet 20b is upwardly protruded on the front end of a bottom forming component 20 rotatably supported using the rear end thereof as the center such that the front edge of the sheet-like wiping member 24 is pressed between the wiping member maintaining protrusion sheet 20b and the wiping member maintaining groove 10f. A rear edge of an elastic keeper 22 for maintaining the sheet-like wiping member 24 is mounted on an elastic tongue keeper mounting sheet 20b.
Patent TW-589832-B (TW)
Title: QoS router for effectively processing fragmented packets and method thereof
Inventor: LIN JIUN-NAI
IPC: H04L12/56
Filed: 2002-11-12
Granted: 2004-06-01
Abstract: The invention relates to a QoS router for effectively processing fragmented packets and method thereof. When a router receives the first packet from certain IP fragmentation of a data flow, the router follows the pre-defined QoS conditions to determine if the first packet will be passed or discarded. When deciding to allow the packet to pass, the record on the set of packets is recorded with pass status, and when deciding to discard the packet, the record on the set of packets is recorded with discard status. When the router receives other packets of the same set of IP fragmentation, it determines if the packet is passed or discarded based on the record of the set of packets. If all records of the set of packets show discard status, the packets are discarded. If the record of the set of packets is recorded with pass status, the packet is directly allowed to pass without employing random early detection (RED) means using random number to determine pass or discard before the operating bandwidth used by the data flow exceeds a preset allowable maximum bandwidth; otherwise the packet is discarded and the set of packets is recorded with discard status.
Patent TW-589749-B (TW)
Title: Structure and forming method of multi-layered LED having high fill factor
Inventor: WU GUO-MING
IPC: H01L33/00
Filed: 2002-11-27
Granted: 2004-06-01
Abstract: A forming method of multi-layered LED having high fill factor is disclosed, which at least comprises the following steps: proceeding the first N-type ion implantation onto a p-type substrate, so as to form an N-type buried layer in the p-type semiconductor substrate; growing a P-type epitaxial layer on the upper surface of the P-type semiconductor substrate, and covering the N-type buried layer; proceeding plural ion implantations onto the P-type epitaxial layer right above the N-type buried layer, so as to convert the P-type epitaxial layer right above the N-type buried layer into a composite layer having at least one N-doped layer and at least two P-doped layers, wherein a P-doped layer and an N-type buried layer are adjacent in this composite layer, and there is an N-type doped layer sandwiched between any two P-doped layers in the composite layer; proceeding the second N-type ion implantation onto a sidewall of the composite layer, so that the whole said sidewall is converted into an N-type heavily doped region for connecting any one layer of the N-type buried layer and the composite layer, wherein the N-type heavily doped region is connected to the source region of MOS transistor or functions as the source region of MOS transistor; forming an isolation region on the upper surface of the composite layer.