baber/WOPTO huggingface dataset:
Patent JP-2013172131-A (JP)
Title: Electronic component mounting method
Inventor: MIYAZAKI YUJI
IPC: H05K13/08
Filed: 2012-02-23
Abstract: PROBLEM TO BE SOLVED: To provide an electronic component mounting method which allows for reliable mounting of an electronic component in each cavity even if a circuit board is deformed.SOLUTION: A plurality of cavities 3 provided in a circuit board 2 are recognized, respectively, by mens of an inspection camera 34a provided in an inspection head 34, and the inner shape dimensions of each cavity 3 are calculated. Subsequently, an electronic component 4 is held by means of a mounting head 35, the electronic component 4 is recognized by means of a component recognition camera 37 and the external dimensions of the electronic component 4 are acquired. A determination is then made whether or not the electronic component 4 can be mounted in a corresponding cavity 3, by comparing the external dimensions of the electronic component 4 thus acquired with the inner shape dimensions of each cavity 3 thus calculated. The electronic component 4 is mounted in a corresponding cavity 3 if a determination is made that the electronic component 4 can be mounted therein, otherwise mounting of the electronic component 4 in the cavity 3 is stopped.
Patent JP-2013173388-A (JP)
Title: Side door structure
Inventor: YAMADA KENJIRO
IPC: B60J5/04
Filed: 2012-02-23
Abstract: PROBLEM TO BE SOLVED: To obtain a side door structure that can reduce the difficulty in opening a side door when a vehicle frontal collision occurs.SOLUTION: A belt line reinforcement 24 includes: a reinforcement body part 26 disposed along a vehicle longitudinal direction; a front side offset part 28 and a rear side offset part 30 that are extended outward from both ends of the reinforcement body part 26 in the vehicle width direction. One end 26A and the other end 26B of the reinforcement body 26 are disposed closer to the center part of an inner panel body 22B than both ends of the inner body 22B, respectively.
Patent JP-2013172879-A (JP)
Title: Fastener member
Inventor: SANO KOJI
IPC: A44B17/00
Filed: 2012-02-27
Abstract: PROBLEM TO BE SOLVED: To provide a fastener member obtained by providing a fitting portion fixedly fitted to a fitted portion of a base, to part of a loop forming body of a conventional fastener member forming two loops using the one loop forming body, wherein the fitting portion is accurately located without damaging the loop forming body, has good appearance, and is fitted in a correct direction to solve the problem of a conventional fastener member.SOLUTION: A fastener member has a loop forming body integrally including insertion portions inserted into receiving portions formed at both ends, and the loop forming body partially includes an integrated fitting portion fixedly fitted to a fitted portion provided at the body and formed by insert molding.
Patent JP-2012111961-A (JP)
Title: Polycarbonate composition, article, and method of manufacturing the article
Inventor: GOVAERTS LUC
IPC: B29C45/00
Filed: 2012-02-27
Abstract: PROBLEM TO BE SOLVED: To provide compositions which have improved weld line strength, and are useful in the manufacture of molded parts for electronic devices.SOLUTION: A thermoplastic composition comprises: about 10 to about 84 wt.% of a polycarbonate resin; about 0.5 to about 40 wt.% of a polycarbonate-polysiloxane copolymer; 1 to about 40 wt.% of an impact modifier composition; and about 1 to about 50 wt.% of an alkyl (meth)acrylate polymer; each based on the total combined weight of the thermoplastic composition, exclusive of any filler. In another embodiment, the thermoplastic composition comprises: about 10 to about 85 wt.% of a polycarbonate resin; about 1 to about 40 wt.% of an impact modifier composition; and about 1 to about 50 wt.% of an impact-modified alkyl (meth)acrylate polymer; each based on the total combined weight of the thermoplastic composition, exclusive of any filler.
Patent JP-2013178334-A (JP)
Title: Display device and television receiver
Inventor: TOMOMASA MASATOSHI
IPC: F21S2/00
Filed: 2012-02-28
Abstract: PROBLEM TO BE SOLVED: To prevent or suppress leakage of light guided through a light guide plate to a display panel side, while realizing a positioning structure of the light guide plate.SOLUTION: A liquid crystal display device 10 comprises: an LED 17; a liquid crystal panel 11; a light guide plate 16 that is provided with a notch 16s on an edge of the light guide plate; a chassis 14 that is provided on a side opposite the liquid crystal panel side with respect to the light guide plate 16; a frame 13 that is provided on a display surface side of the liquid crystal panel 11 and houses the liquid crystal panel 11, the LED 17 and the light guide plate 16 in a shape of sandwiching between the chassis 14 and the frame; a positioning member 30 that is attached to the frame 13 and positions the light guide plate 16 between the frame 13 and the chassis 14 by being housed inside the notch 16s to be engaged with the notch 16s; and a light shield member 32 which is provided at a gap between the positioning member 30 and the notch 16s, a part of which is attached to the frame 13 together with the positioning member 30 and which shields light from the LED 17.
Patent JP-2013178646-A (JP)
Title: Process planning method
Inventor: SAKAGUCHI YUSUKE
IPC: G06Q10/06
Filed: 2012-02-28
Abstract: PROBLEM TO BE SOLVED: To more objectively predict a site dispatch work period in process planning.SOLUTION: A process planning method executes: an item selection step of selecting an item correlated with a work period among items related to a region from work result data including the items related to the region where the work is performed and a period during which the work is performed for each of a plurality of work results; and a period calculation step of calculating the period of the work of a process planning object, on the basis of the data of the item selected in the item selection step among the work result data, the data of the item selected in the item selection step for a spot where the work of the process planning object is to be performed, and the data of the period during which the work is performed in the work result data.
Patent JP-2013180007-A (JP)
Title: Sewing machine
Inventor: UMEDA KAZUTOSHI
IPC: D05B69/36
Filed: 2012-02-29
Abstract: PROBLEM TO BE SOLVED: To provide a sewing machine which does not damage a workpiece and can prevent a needle thread from excessively winding around a rotary thread take-up lever when the needle thread is broken.SOLUTION: A sewing machine includes: a thread guide part 18 which guides a needle thread 10 led to a rotary thread take-up lever 9 to a needle bar 3; a thread guide part 19 which is provided on the needle bar 3, and which guides the needle thread 10 guided by the thread guide part 18 to a sewing needle 2; and a sensor 40 which is arranged between the thread guide part 18 and the thread guide part 19, and which receives the reflection of light projected toward the needle thread 10 to output a light-receiving signal according to a received light quantity. When the sensor 40 outputs a light-receiving signal corresponding to the time when the needle thread 10 is absent in a predetermined timing, it is determined that the needle thread is broken.
Patent JP-2013181090-A (JP)
Title: Magnetic particle-containing composite viscoelastic body, and variable rigidity type dynamic vibration absorber using the viscoelastic body
Inventor: KOMATSUZAKI TOSHIHIKO
IPC: F16F15/02
Filed: 2012-03-01
Abstract: PROBLEM TO BE SOLVED: To provide a magnetic particle-containing composite viscoelastic body excellent in changeability of viscoelasticity, and also to provide a variable rigidity type dynamic vibration absorber using the viscoelastic body.SOLUTION: A magnetic particle-containing composite viscoelastic body is formed by dispersing a magnetic particle having an average grain size of <50 μm in a viscoelastic material so as to become 20-70 vol% with respect to a composite elastic body, wherein after mixing the magnetic particle with the viscoelastic material, a magnetic flux having the intensity of a magnetic flux density of 50 mT or higher is applied to cure the mixture.
Patent JP-2013181520-A (JP)
Title: Submerged pump
Inventor: OKIZOE AKIMASA
IPC: F04D1/04
Filed: 2012-03-05
Abstract: PROBLEM TO BE SOLVED: To suppress the lowering of performance of a submerged pump 1 even while avoiding clogging in a pipe line when a passage particle size of the pipe line disposed on the downstream side of the submerged pump 1 is smaller than a passage particle size of the submerged pump 1.SOLUTION: In a suction port 4 disposed on a casing 22, a passage particle size thereof is set to d, and the passage particle size is the smallest passage particle size in a pump part 2. Furthermore, the suction port is formed in such a shape that at least one opening edge E exists in a range C of a radius d/2 with an arbitrary point within an opening thereof as a center P and an opening area of the suction port is set to be larger than πd/4.
Patent JP-2012209544-A (JP)
Title: Method for manufacturing semiconductor device
Inventor: YAMAZAKI SHUNPEI
IPC: H01L27/115
Filed: 2012-03-06
Abstract: PROBLEM TO BE SOLVED: To increase the reliability of a semiconductor device including an oxide semiconductor by giving stable electric characteristics thereto.SOLUTION: In a process of manufacturing a transistor including an oxide semiconductor layer, an amorphous oxide semiconductor layer is formed on a silicon oxide film, the amorphous oxide semiconductor layer including a region containing excessive amount of oxygen relative to the stoichiometric composition in a state that the oxide semiconductor is crystalline. An aluminum oxide film is formed on the amorphous oxide semiconductor layer and heated in order to crystallize at least a part of the amorphous oxide semiconductor layer, thereby forming the oxide semiconductor layer including a crystal with a c axis that is approximately vertical to a surface.
Patent JP-2013184707-A (JP)
Title: Packaging body for prepreg roll
Inventor: KIKUCHI HITOSHI
IPC: B65D77/04
Filed: 2012-03-06
Abstract: PROBLEM TO BE SOLVED: To provide a packaging body for a prepreg roll which does not use a conventional pressing frame member, removes a possibility of the occurrence of a failure of a resin film for sealing when the pressing frame member is used, and can obtain a desirable packaging form for storage and transportation even for the prepreg roll of heavy weight without efforts for packaging and unpacking.SOLUTION: A packaging body for a prepreg roll includes a prepreg roll holding member 9 which is so constituted that a part of it serves as a holding part contacting with the prepreg roll 2 in a box body 1. The prepreg roll holding member includes a holding part of an approximately triangle shape and approximately linear-shaped parts at both ends of the holding part formed by folding one sheet of a rectangular member in a direction parallel to a height direction of the rectangular member. The holding parts are arranged at four corners of the box body. The prepreg roll holding member is higher than the prepreg roll to support a vertical load on the packaging body of the prepreg roll.
Patent JP-2012253320-A (JP)
Title: Metal base circuit board and light emitting element
Inventor: KONDO GOJI
IPC: H05K1/05
Filed: 2012-03-07
Abstract: PROBLEM TO BE SOLVED: To provide a metal base circuit board that does not require special machining to the board, has high flexibility in circuit pattern designing, and is excellent in heat radiation, insulating property, and folding processability.SOLUTION: A conductor circuit is arranged on a metal base via an insulating layer. The insulating layer contains liquid crystal polyester. The liquid crystal polyester includes repeating units represented by general formulas (1), (2), and (3). The thickness of the metal base is 20 to 1,000 μm, the thickness of the insulating layer is 20 to 90 μm, and the thickness of the conductor circuit is 9 to 140 μm. The general formulas are (1)-O-Ar-CO-, (2)-CO-Ar-CO-, and (3)-X-Ar-Y-.
Patent JP-2013186801-A (JP)
Title: Image processor
Inventor: AMAMIYA SATOKO
IPC: H04N5/232
Filed: 2012-03-09
Abstract: PROBLEM TO BE SOLVED: To help make-up fit for a user face.SOLUTION: An image processing engine 13 retains make-up frame information corresponding to a face part composing a face, determines a position to which the make-up is applied on the basis of a position and a size of the face part detected by a face part detection engine 12, and puts the make-up frame information over a face image detected by a face detection engine 11 from a photographed image so that the make-up frame information corresponding to the face part is placed on the determined position.
Patent JP-2013186114-A (JP)
Title: Position detection device
Inventor: TAMIYA HIDEAKI
IPC: G01B11/00
Filed: 2012-03-12
Abstract: PROBLEM TO BE SOLVED: To detect an absolute position to restore the origin without a movement operation in a height direction when displacement of a measured surface of a measured member capable of a relative movement in a measurement direction and a vertical direction is detected on the basis of measurement light reflected by the measured surface in an incremental-type displacement detection device.SOLUTION: A position detection device comprises a relative position detection part 20 and an absolute position detection part 30 that optically detect a relative position and an absolute position in a measurement direction Z on the basis of measurement light L1 reflected by a measured surface 1a of a movable measured member 1 in a direction X orthogonal to the measurement direction Z. The position detection device has an absolute position detection area 4 in which an optical axis of the measurement light L1 is moved to an end of a movement direction X of the measured member 1. The absolute position detection part 30 detects an absolute position by moving the optical axis of the measurement light L1 in the absolute position detection area 4, and restores position information obtained by the relative position detection part 20.
Patent JP-2013191317-A (JP)
Title: Electrical apparatus
Inventor: YASUKAWA KENICHI
IPC: H01R13/46
Filed: 2012-03-12
Abstract: PROBLEM TO BE SOLVED: To simplify an assembly operation by allowing connection members, such as a cable and a socket, to be connected to terminal parts of a substrate in the final step after the substrate is stored inside a body, and by achieving common use of most processes of the assembly operation between a plurality of types.SOLUTION: A photoelectric switch 10A of a cable connection type is obtained by fitting a first connection block 41 into an opening 31 of a case 3. When the first connection block 41 is fitted into the opening 31, three coated wires 101 exposed to the front surface side of the first connection block 41 are respectively electrically connected to individual terminal 91. A photoelectric switch 10B of a connector connection type is obtained by fitting a second connection block 42 into the opening 31 of the case 3. When the second connection block 42 is fitted into the opening 31, three coated wires 201 exposed to the front surface side of the second connection block 42 are respectively electrically connected to the individual terminals 91.
Patent JP-2013189905-A (JP)
Title: Internal combustion engine
Inventor: KOMORI KEISUKE
IPC: F02M61/14
Filed: 2012-03-13
Abstract: PROBLEM TO BE SOLVED: To provide an internal combustion engine capable of reducing a bending stress generated in a fuel injection valve.SOLUTION: An internal combustion engine 1 includes a fuel injection valve 50, a cylinder head 30 formed with a mounting hole 33 in which the fuel injection valve 50 is inserted, and a bushing 22 mounted on the mounting hole 33. The fuel injection valve 50 has a seating part 52 protruding on an outer surface side of the fuel injection valve 50 and opposing to a contact surface 22A of the bushing 22 in a direction of the center axis CF of the fuel injection valve 50. The fuel injection valve 50 has a recessed part 53A to be supported by a sealing member 23 inside the mounting hole 33. The seating part 52 has a sphere-shaped seating surface 52A that protrudes to a side parting from an injection port 54 of the fuel injection valve 50, as the seating surface goes apart from the center axis CF of the fuel injection valve 50. The contact surface 22A of the bushing 22 in contact with the seating surface 52A has a spherical shape protruding to a side parting from the injection port 54 of the fuel injection valve 50, as the contact surface comes closer to the center axis CP of the mounting hole 33.
Patent JP-2013189343-A (JP)
Title: Method for manufacturing glass substrate having transparent conductive film
Inventor: KITO AKIKO
IPC: C03B33/023
Filed: 2012-03-14
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a glass substrate, having a transparent conductive film, that can form a scribe line on the main surface on the side, formed with a transparent conductive film, of a mother substrate without damaging the transparent conductive film, and also, can prevent the contamination of members used for scribing.SOLUTION: A method for manufacturing a glass substrate includes: a process in which a coating composition containing a conducting substance is coated on one main surface of a mother substrate 1, being an optical glass substrate, so as to form a non-coated part 1c dividing the one main surface of the mother substrate 1 into at least two regions 1a, 1b, and then, dried to form a transparent conductive film 3 on the one main surface of the mother substrate 1; a process for forming a scribe line 1d on the non-coated part 1c; and a process in which the mother substrate 1 is cut along the scribe line 1d to obtain glass substrates 4 each having the transparent conductive film 3 on one main surface.
Patent JP-2013191129-A (JP)
Title: Information processing apparatus, simulation method, and program
Inventor: SAKAGUCHI YASUKI
IPC: G05B19/05
Filed: 2012-03-15
Abstract: PROBLEM TO BE SOLVED: To provide an information processing apparatus for supporting a controller, capable of easily setting an input variable used for simulation.SOLUTION: A PC being an information processing apparatus simulates a control program and displays an outcome of the simulation on a monitor. The PC obtains a value of at least one variable number and a variable name at an arbitrary timing in the simulation. The PC changes a control program according to a user's command. The PC simulates the changed control program using a value of a variable number identified by the obtained variable name as the value of the variable number. The PC displays an outcome of the simulation of the changed control program on the monitor.
Patent JP-2013198174-A (JP)
Title: Driving force control device for vehicle
Inventor: OKADA KOJI
IPC: B60L15/20
Filed: 2012-03-15
Abstract: PROBLEM TO BE SOLVED: To provide a driving force control device useful for improving the operability of a vehicle in turning.SOLUTION: A driving force control device for a vehicle includes: an operation unit for a driver; a control unit for controlling the driving force of the vehicle on the basis of an input to the operation unit; and a detection section for detecting the steering angle of a steered wheel. The control unit corrects the driving force according to the detected steering angle, for example, so that a deceleration due to the rolling resistance of the steered wheel on the degree of freedom relating to a rotational motion around the vertical direction of the vehicle is reduced. The control section may correct the driving force at a steering angle corresponding to a pivotal turn or a spin turn of the vehicle.
Patent JP-2013197129-A (JP)
Title: Connection structure of printed circuit board, fpc for connection thereof, and electronic apparatus
Inventor: MATSUMURA SHUYA
IPC: H05K1/14
Filed: 2012-03-16
Abstract: PROBLEM TO BE SOLVED: To provide a connection structure of a printed circuit board capable of preventing erroneous insertion of an FPC even when a versatile connector is used, an FPC for connection thereof and an electronic apparatus.SOLUTION: When FPCs 3 are connected to connector circuit boards 4 and 5 and connector circuit boards 6 and 7 in a correct orientation, a coupling part 12 for connection restriction is avoided from interfering with a connection restriction projection part 9 provided in one of a first printed circuit board 1 and a second printed circuit board 2, and when the FPCs 3 are not connected to the connector circuit boards 4 and 5 and the connector circuit boards 6 and 7 in the correct orientation, outer shapes of the connection restriction projection part 9 and the coupling part 12 for connection restriction are set so that the coupling part 12 interferes with the connection restriction projection part 9.
Patent JP-2013122568-A (JP)
Title: Disk of alarming horn for vehicle
Inventor: CAI JI SHANG
IPC: G10K9/15
Filed: 2012-03-19
Abstract: PROBLEM TO BE SOLVED: To provide a disk of an alarming horn for vehicles capable of improving a tone of the alarming horn into softer one by generating sound with various frequency components in a single disk type alarming horn.SOLUTION: The disk for vehicles according to the present invention has such a configuration that all areas of the disk are divided into a plurality of areas with different vibration characteristics and the plurality of areas are arranged in the circumferential direction of the disk. The plurality areas have different vibration characteristics by being dividedly formed to have different areas. Further, the disk has the configuration divided by forming long cut parts from the outer peripheral edge towards the center of the disk. Each cut part is formed long from the outer peripheral edge towards the center of the disk in the radial direction.
Patent JP-2013197258-A (JP)
Title: Circuit board and manufacturing method for semiconductor module
Inventor: TAKAYAMA YASUSHI
IPC: H01L25/07
Filed: 2012-03-19
Abstract: PROBLEM TO BE SOLVED: To improve insulation properties of a semiconductor element and a wiring board.SOLUTION: A manufacturing method for a semiconductor module comprises the steps of: disposing a semiconductor element 150 in an opening part 145 of a second joint layer 140 so that an excessive part, corresponding to a difference Δh between a depth H of the opening part 145 and a distance h from a top surface 145a of the opening part 145 to a rear face 155 of the semiconductor element 150, is generated in a joint layer 120; disposing a second wiring board 110 laminated on a rear side of the semiconductor element 150, that is, on a top of a second face 142 of the second joint layer 140; applying heat and pressure on wiring boards 100 and 110, the semiconductor element 150, and the joint layer 120 so as to unify them by diffusion bonding; and filling a gap between a side wall 145b of the opening part 145 and a side wall 154 of the semiconductor element 150 caused by deformation of the excessive part of the joint layer 120 due to applied heat and compression on unifying. Consequently, a periphery of the side wall 154 of the semiconductor element 150 is shield by the second joint layer 140.