baber/WOPTO huggingface dataset:
Patent JP-2005261768-A (JP)
Title: Game machine
Inventor: UGAWA SHOHACHI
IPC: A63F7/02
Filed: 2004-03-19
Abstract: <P>PROBLEM TO BE SOLVED: To provide a game machine administrating the starting order of respective boards in a simple structure and reducing the amount of data of control signals to be transmitted from a game control means to a putout control board.  <P>SOLUTION: This game machine is provided with a game control means and a putout control means separately and is so constituted that, when a power supply to the game machine is started, a power supply monitoring circuit 920 outputs a reset signal for commanding to start a putout control preparation processing to the putout control board 37, a putout control CPU 371 executes the putout control preparation processing based on the input of the reset signal and then transmits a reset confirmation signal to a main board 31, a CPU 56 performs a game control preparation processing based on the receiving of the reset confirmation signal and then turns on a connecting confirmation signal. This game machine can thus administrate the starting order of the CPU 56 and the putout control CPU 371 without providing a delay circuit.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005277078-A (JP)
Title: Multi-patterned wiring board
Inventor: KAWAKAMI TAKESHI
IPC: H01L23/13
Filed: 2004-03-24
Abstract: <P>PROBLEM TO BE SOLVED: To provide a multi-patterned wiring board, capable of surely detecting the positional deviation of ceramic layers between upper and lower ceramic layers and superior in productivity, while being capable of surely sealing electronic components by sealing resin.  <P>SOLUTION: The multi-patterned wiring board 9 is constituted of a plurality of laminated ceramic layers 1a, and is provided with a matrix substrate 1, on one principal surface of which a plurality of wiring substrate regions 4 are arrayed and formed at the central part thereof and a dummy region 5 is formed at the peripheral part of the wiring board regions 4; the mounting units of electronic components; and wiring conductors 3. The electronic components are sealed by sealing resin. In this case, the mother board 1 is provided with a non-penetrating first hole 6 formed in the dummy region 5 of one principal surface, and a second non-penetrating hole 7 formed in the region facing the dummy region 5 of the other principal surface so as not to be superposed on the first hole 6, in the planar view of the matrix substrate 1.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005270497-A (JP)
Title: Luminescent plate
Inventor: TSUNEMOTO MITSUO
IPC: A47G23/03
Filed: 2004-03-26
Abstract: <P>PROBLEM TO BE SOLVED: To provide a luminescent plate excellent in decorative effect, which can be used as a coaster for keeping children from getting bored and which can furnish topics of conversation for adults.  <P>SOLUTION: The luminescent plate 1 is composed of a hollow plate-like body 2 translucent at the upper surface thereof and a printed-circuit board 3 loaded inside. A plurality of light-emitting diodes 4R, 4G and 4B are arranged on the printed-circuit board 3 to project light toward the upper surface of the plate-like body 2. A replaceable battery 5 is disposed inside the plate-like body 2. A power switch 6 or power switches 6 each made of a reed switch are placed in a current-carrying circuit between the battery 5 and each of the luminescent diodes 4R, 4G and 4B.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2004310763-A (JP)
Title: Parallel printing system
Inventor: KLASSEN R VICTOR
IPC: G06F3/12
Filed: 2004-03-26
Abstract: <P>PROBLEM TO BE SOLVED: To dispense with many times of access to a storage disk even for any single job by boosting the control and data flow of a print job for a printing system.  <P>SOLUTION: The printing system is provided with a printer, two or more processing nodes disposed for processing a part of the print job into a printer-dependent format, and a processing manager which spools the print job to a selectively sized chunk, and allocates the chunks to a selected node for processing the chunks in parallel into the printer-dependent format by a processing node. The chunks are selectively sized by predetermined counting (factor) for improving page processing efficiency to at least one page through the entire size of the print job.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005278056-A (JP)
Title: Circuit for detecting power supply voltage drop
Inventor: SHIGEMI TOMOYA
IPC: H03K17/22
Filed: 2004-03-26
Abstract: <P>PROBLEM TO BE SOLVED: To prevent a malfunction by surely stopping the operation of an electronic circuit when a power supply voltage is low.  <P>SOLUTION: A first switch 101 that is turned on by an output of reference voltage VREF is connected to a second switch 103 that is synchronized with the first switch 101 to operate between a power supply voltage 1 and a voltage divider 3. When there is no output of reference voltage just after the application of the power supply voltage, the first switch 101 is turned off and the second switch is also turned off. An output of the reference voltage turns on the first switch 101 and also turns on the second switch 103. Divided voltage VS of the power supply voltage and the reference voltage VREF are inputted to a comparator 4 to make an electronic circuit operable, and thus preventing a malfunction at the time of low voltage. In addition, a malfunction can be prevented not only when the power supply voltage is increased but also when the power supply voltage is reduced.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005286143-A (JP)
Title: Wiring board
Inventor: TSURUGASAKI MASATO
IPC: H05K1/02
Filed: 2004-03-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a wiring board which can be manufactured through more efficient and economical processes as compared with conventional technology.  <P>SOLUTION: The wiring board can be quickly manufactured without requiring excess materials and operation by starting etching from the same positions on both the sides of a metal plate 1, forming a metallic pattern by dividing a prescribed area including the metal exists from an area not including the metal, and then filling the area not including the metal with insulating resin 2 from the backside of the metallic plate. Specifically, the board is manufactured through a process (1) for simultaneously performing etching from the backside and etching from the surface side in etching for both the sides, and then filling the area not including the metal with the insulating resin; or a process (2) for performing etching of the backside at first, filling the metal plate dented by the etching with the insulating resin, and then etching the surface side.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005286207-A (JP)
Title: Flexible board and its manufacturing method
Inventor: YAMAGUCHI ATSUSHI
IPC: H01B5/14
Filed: 2004-03-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible board capable of manufacturing a lengthy flexible board without lengthening an exposure mask, and to provide the flexible board.  <P>SOLUTION: The method for manufacturing the flexible board comprises the steps of forming a metallic layer, forming a resist layer, exposing, developing, etching, removing the resist, and forming an insulating layer. The resist film is repeatedly exposed with the exposure mask arranged in the exposure process so that an end part of a pattern hole is sequentially overlapped. This can manufacture the lengthy flexible board longer than the length of the pattern hole of the exposure mask.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2004241786-A (JP)
Title: Method of manufacturing ig wafer and ig wafer manufactured by the method
Inventor: SHIOTA TAKAAKI
IPC: H01L21/322
Filed: 2004-03-30
Abstract: <P>PROBLEM TO BE SOLVED: To obtain a desired IG effect by reducing the number of times of heat treatment in a state of a wafer in addition to the absence of aggregates having point defects.  <P>SOLUTION: A silicon wafer, on which an OSF is formed on 25% or larger of the total area of the wafer during an OSF actualization thermal process and oxygen deposit causing no dislocation is formed at a density of 1 × 10<SP>5</SP>to 3 × 10<SP>7</SP>/cm<SP>2</SP>, is rapidly heated from a room temperature to 1,100 to 1,250°C at a temperature increase rate of 3°C/minute to 150°C/second in hydrogen gas or an atmosphere containing hydrogen gas, and then, the silicon wafer is kept for 1 minute to 2 hours.  <P>COPYRIGHT: (C)2004,JPO&NCIPI
Patent JP-2005285269-A (JP)
Title: Disk drive
Inventor: NAKAMURA NOBORU
IPC: G11B33/02
Filed: 2004-03-30
Abstract: <P>PROBLEM TO BE SOLVED: To make a face whereon a closing means of a disk drive is disposed different from a face whereon an open knob thereof is arranged.  <P>SOLUTION: A protrusion 22b at a tip of a lever 22 driven by the open knob 14 is engaged with a hole 23b at one end of a conversion lever 23, and a driving pawl 23c at another end of the conversion lever 23 is engaged with a driving lever 25b of closing components 25. Then, the driving lever 25b is turned counterclockwise against a pressing force of a torsion coil spring 24 by the driving pawl 23c by means of depressing the open knob 14 so that a closing pawl 13 is driven to the open state from the closed state.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005286899-A (JP)
Title: Information distribution apparatus and information terminal device
Inventor: HARADA SEIJI
IPC: H04L47/43
Filed: 2004-03-30
Abstract: <P>PROBLEM TO BE SOLVED: To provide an information distribution apparatus for enabling a highly important part of distribution information to be certainly distributed to a user's information terminal device, and to provide an information terminal device for receiving the distribution information.  <P>SOLUTION: There is provided the information distribution apparatus that is connected with the information terminal device via a network in which the larger is the distribution unit volume, the larger is the distribution loss rate, and which distributes the distribution information to the information terminal device. The information distribution apparatus includes a specified information distinguishing means for distinguishing specified information contained in the distribution information from information other than the specified information contained in the distribution information, a dividing means for acting as a dividing means for dividing the distribution information to obtain the specified information as at least one or more pieces of important information with a first distribution unit defined as an upper-limit volume and besides obtain information other than the specified information as at least one or more pieces of unimportant information with a second distribution unit defined as an upper-limit volume, and a transmitting means for transmitting the important information and the unimportant information to the information terminal device. The first distribution unit is smaller than the second one.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005019956-A (JP)
Title: Electronic component mounter and electronic component mounting method
Inventor: YONEZAWA TAKAHIRO
IPC: H05K13/04
Filed: 2004-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To obtain an electronic component mounter for mounting an electronic component, e.g. a semiconductor bare chip, on a substrate in which a load can be detected in the vicinity of the mounting position.  <P>SOLUTION: Since a vertical load and a horizontal load being applied to an electronic component 1 is detected by a load sensor 30 having piezoelectric elements 31-33 stacked in the mounting direction of the electronic component 1 in the electronic component mounter 10, a load being applied to the electronic component 1 can be detected in the vicinity of the mounting position thereof by decreasing the horizontal size of the load sensor 30. Furthermore, abnormal mounting can be detected from a deviation of the horizontal load by comparing the position on a two-dimensional space having the load values of the horizontal load in the X and Y directions as coordinate values with an allowable range on the two-dimensional space.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005289163-A (JP)
Title: Control method of 4-wheel drive vehicle
Inventor: MORI ATSUSHI
IPC: B60K17/348
Filed: 2004-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a control method of a 4-wheel drive vehicle having a speed increasing mechanism capable of exactly controlling the switch between direct connection and speed increase.  <P>SOLUTION: The control method of the 4-wheel drive vehicle has front wheels as main driving wheels always connected to a driving source, rear wheels as driven wheels capable of adjusting the amount of drive torque, and the speed increasing mechanism capable of switching the rear wheel side between the direct connection state and the speed increase state with respect to the front wheel side. The control method can control the speed increasing mechanism to be switched to the speed increasing state according to the travel state. The switch of the speed increasing mechanism is delayed until a speed increasing command or a direct connecting command continues for a certain time.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005288816-A (JP)
Title: Bladder for vulcanizing tire
Inventor: YOSHIOKA NARISHIRO
IPC: B29L30/00
Filed: 2004-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a bladder for vulcanizing a tire with a long life.  <P>SOLUTION: In the bladder for vulcanizing the tire comprising staple fibers consisting of an organic material, the staple fibers preferably has a mean fiber diameter of 10-500 μm and a mean fiber length of 50-5,000 μm, and at least 80% of the staple fibers incorporated in the bladder are preferably oriented by an angle of 0-20° to the radial direction of the bladder.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005291314-A (JP)
Title: Vibration control device
Inventor: OGAWA SHINJI
IPC: F16F15/02
Filed: 2004-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To provide a vibration control device capable of obtaining sufficient vibration control effect.  <P>SOLUTION: This vibration control device installed on a structure 100 to damp vibration of the structure 100 is provided with a main damper 20 for damping vibration of the structure 100, an auxiliary damper 30 for damping vibration of the main damper 20, and a vibration applying means for inputting vibration applying force into the auxiliary damper 30. The main damper 20 is constituted in such a way that fluid 21 is stored to form air chambers 23, 23 in a tank 22 provided on the structure 100 to damp vibration of the structure 100 by vibration of the fluid 21. The auxiliary damper 30 is constituted by connecting expansion and contraction parts 31, 31 capable of changing volume with the tank 22 to damp vibration of the fluid 21 by changing volume of the expansion and contraction parts 31, 31.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005295805-A (JP)
Title: Mulch film for cultivating tabacco
Inventor: EGAMI MASAYUKI
IPC: A01G9/14
Filed: 2004-03-31
Abstract: <P>PROBLEM TO BE SOLVED: To prepare a mulch film for cultivating tabacco maintaining a soil temperature increasing effect, securing moderate moisture for plant roots, promoting generation and growth of adventitious roots, and making the tabacco continue to well grow even in the latter half of its growth stage.  <P>SOLUTION: This mulch film for cultivating tabacco is provided with transparent areas 2, 2 at both sides of a colored initial vegetation area 1 extending in the length direction of the film corresponding to the initial vegetation portion of a cultivated plant 3. The initial vegetation area 1 is colored black, and the initial vegetation area 1 is 5-50 cm in width.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005291993-A (JP)
Title: Surface layer analysis method of silicon wafer
Inventor: MATSUDA KENJI
IPC: G01N33/00
Filed: 2004-04-01
Abstract: <P>PROBLEM TO BE SOLVED: To etch the surface layer section of a silicon wafer by vapor generated from a solution at normal temperatures, and to measure metal impurities at the surface layer section of the silicon wafer easily and precisely, by analyzing droplets, by allowing the part of the surface layer of the silicon wafer to be measured to be close to and face the silicon solution.  <P>SOLUTION: In a method for analyzing the surface layer of the silicon wafer, the analyzing surface of the silicon wafer is made close to and face the liquid surface of the silicon solution made of a mixed liquid of fluorine and nitric acid under normal temperatures so as to etch the surface layer section of the silicon wafer, and the etching liquid is collected for analysis.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005294639-A (JP)
Title: Flex rigid wiring board
Inventor: MIKADO YUKINOBU
IPC: H05K1/02
Filed: 2004-04-01
Abstract: <P>PROBLEM TO BE SOLVED: To provide a flex rigid wiring board capable of preventing the deformation of a base material which may be easily generated in the vicinity of a bent part, the disconnection of a conductor circuit, the formation of waviness, etc., and excelling in connection reliability.  <P>SOLUTION: The flex rigid wiring board is constituted of connecting a flexible board provided with a conductor circuit formed on an insulating base material and a cover layer covering the conductor circuit and having a flexible property and hard rigid boards constituted of forming a conductor circuit on an insulating substrate. In the flex board, a flexible base material formed by impregnating resin into glass cloth and drying it is adopted as the insulating base material of the flexible board, the conductor circuit is formed on one surface of the flexible board, and a dummy pattern is formed on the other surface in the vicinity of the bent part.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005294202-A (JP)
Title: Lithium secondary battery
Inventor: OKA TETSUTO
IPC: H01M10/0566
Filed: 2004-04-05
Abstract: <P>PROBLEM TO BE SOLVED: To provide a lithium secondary battery which is a 1.5 V system using lithium titanate as an active material of a positive electrode, which has high capacity and wherein remaining capacity of the battery can be predicted.  <P>SOLUTION: In this lithium secondary battery using the lithium titanate expressed by a general formula Li<SB>x</SB>Ti<SB>y</SB>O<SB>4</SB>as an active material of the positive electrode, using a carbon material as an active material of a negative electrode, and having an electrolyte wherein lithium salt is dissolved in an organic solvent, amorphous carbon is used as the carbon material. The lithium titanate expressed by the general formula Li<SB>x</SB>Ti<SB>y</SB>O<SB>4</SB>preferably has stoichiometric numbers of 0.8≤x≤1.4 and 1.6≤y≤2.2. The negative electrode is preferably constituted of the amorphous carbon and a binder. Their composition ratios are preferably 90-95 mass% and 5-10 mass% for the amorphous carbon and the binder respectively.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005300172-A (JP)
Title: Method and device for position measurement, exposure method using this position measuring method, exposure device provided with this position measuring device, position measuring program for performing this position measuring method and recording medium memorized with this position measuring program
Inventor: NAKAJIMA SHINICHI
IPC: H01L21/027
Filed: 2004-04-06
Abstract: <P>PROBLEM TO BE SOLVED: To measure the positional information of an alignment mark by applying an AGC on the detection signal of the alignment mark by finding out the detection signal buried in the noise signals.  <P>SOLUTION: The image signal as the measuring signal is obtained by irradiating the area where the alignment mark AM1 of a wafer W is formed with the light flux of detection illumination light, the reflected light of which is focused on the imaging surface of the CCD camera 26. From the image signal obtained, the interval where the signal form almost flat continues more than the area of the alignment mark AM1 is extracted. The extracted signal part is amplified and determined whether the image signal is corresponding to the alignment mark AM1 or not based on the design value of the alignment mark AM1. If the image signal is determined as that of the alignment mark AM1, the alignment of the wafer W is executed. If the image signal does not corresponding to the alignment mark AM1, the interval other than the previous one is extracted, and the same acton is repeated so on.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005300645-A (JP)
Title: Developing roller
Inventor: ANAMI ITSUYA
IPC: G03G15/08
Filed: 2004-04-07
Abstract: <P>PROBLEM TO BE SOLVED: To provide a developing roller by which images which have stable image density and are free from fog and development streaks are supplied in a consecutive image formation test.  <P>SOLUTION: In a developing device for use in electrophotography, the developing roller for forming a visible image onto an image forming body by being in contact with the image forming body, thereby supplying developer to the surface of it has a single layer or multiple layer structure including a conductive elastic layer, which structure has a satisfactorily conductive metal core in its center. Any part of the outermost surface of the developing roller having a radius r is such that the surface area b(mm<SP>2</SP>) of a shape with four sides that are all a (mm) is r/50≤a≤r/30 and 1.125≤b/a<SP>2</SP>≤5. In addition, the Asker C hardness is 10° or greater but less than 70°.  <P>COPYRIGHT: (C)2006,JPO&NCIPI
Patent JP-2005253920-A (JP)
Title: Laundry hanger having grip and clamp at hook
Inventor: KAMATA MASAYOSHI
IPC: A47G29/00
Filed: 2004-03-12
Abstract: <P>PROBLEM TO BE SOLVED: To solve the problem of a conventional laundry hanger that it is a pretty hand-aching job to hold it at the lower side of its hook with one hand after suspending the laundry therefrom and carry it to a laundry pole and it is another hard job to hitch the hanger thereon because the hanger has no grip.  <P>SOLUTION: The laundry hanger comprises at its hook a grip portion integrally formed therewith and also a clamping portion. The hanger can be lifted by holding the grip portion such that it is in equilibrium to be carried to a laundry pole, onto which it can be easily hitched by pulling an open/close bar with a middle finger or the like to open the clamping portion. In addition, a spring provided adjacent to the clamping portion is used to close the open clamping portion.  <P>COPYRIGHT: (C)2005,JPO&NCIPI
Patent JP-2005304135-A (JP)
Title: Harness lead-out structure for electric connection box
Inventor: IKEDA KAZUHIRO
IPC: H01R13/56
Filed: 2004-04-08
Abstract: <P>PROBLEM TO BE SOLVED: To simply and surely engage a protector for leading-out a harness with a lower cover of an electric connection box.  <P>SOLUTION: This harness lead-out structure has such a structure that the lower cover 3 of the electric connection box 1 is provided with a harness lead-out part 41, a protector 5 for the regulation of a wire harness is engaged from the outside with the harness lead-out part, the protector 5 is separatable, and it has bends 12, 13 which are bent outward to the harness lead-out direction of the harness lead-out part 41. The harness lead-out part 41 has a rib 42 covering the whole periphery outside thereof, and one split engagement part 14a and the other engagement part 14b of the protector have ribs 29, 30, 29' and 30' for engagement with the ribs at the internal perimeter. One split engagement part 14a has long ribs 29, 30 covering their half circumferences, and the other split engagement part 14b has short ribs 29', 30' on the central side, and one split engagement part is engaged previously with the harness lead-out part 41, and the other split engagement part is engaged with the harness while being rotated.  <P>COPYRIGHT: (C)2006,JPO&NCIPI