Scythe Mugen 5 Rev.B CPU Air Cooler, 120mm Single Tower, Intel LGA1151, AMD AM4/Ryzen
Brand: SCYTHE
Color: black

The revision B of the award-winning Mugen 5 CPU Cooler has been updated with a reworked mounting system, which now offers full compatibility with AMD's new AM4 platform. Spring-loaded screws prevent uneven pressure distribution and allow for a quick and easy assembly. The unusual shape of the heatsink provides unrivaled memory compatibility thanks to its asymmetrical design. A fan from the new Kaze Flex series is used for active cooling. Sealed Precision FDB bearing and rubberized decoupler grant the fan with an increased smoothness during operation and an average lifespan of 120,000 hours. In addition to the polished and high-quality copper base-plate, the heatpipes are now completely nickel-plated, too. The result is an excellent and award-winning tower cooler that does not compromise either in terms of optics nor performance. Model Number : SCMG-5100, Socket : INTEL: 775 / 115x / 1366 / 2011(V3) / 2066, AMD: AM4 / AM3(+) / AM2(+) / FM2(+) / FM1, Dimension : (W)130 x (H)154.5 x (D)110mm, Fan Size : 120 x 120 x 25mm, Heatpipes : Ø6mm x 6, Fan Speed : 300±200～1200 rpm±10% RPM, Air Flow : 16.6～51.17 CFM, Statics : 0.0762～1.05 mmH2O / 0.75~10.3 Pa, Noise : 4.0～24.9 dBA, Weight(Fan included) : 890g

Quiet 120mm Kaze Flex fan (Fluid Dynamic Bearing) for high airflow and static pressure with silent operation(PWM, 300-1200RPM). Addition fan clip for adding 2nd fan(optional) as push-pull configuration for maximal performance.
RAM modules with tall heatsink are no problem for the Mugen 5, the asymmetric design allows unrestricted access to the memory banks. Classic size CPU fan stands 154.5mm in height, Mugen5 offers great compatibility with most popular computer case on the markets.
Secure and easy-to-install spring loaded mounting system compatible with socket INTEL LGA 775 / 1150/1151/1155/1156 / 1200 / 1366 / 2011(V3) Square ILM / 2066 Square ILM & AMD AM4 / AM3(+) / AM2(+) / FM2(+) / FM1
6 x 6mm heatpipes and copper plate base ensure greater heat dissipation and superior cooling performance for mainstream, gaming PC, even overclocking with high TDP processor(9900k, 9700k, 9600k,3700x, 3800x, 3900x, 3950x).
Product dimension: (W)136 x (H)154.5 x (D)110.5mm, Weight: 890g. Thermal compound paste included. Premium model for Intel Core i9, i7, i5, i3 and AMD Ryzen.