Judul: Optimization of Heating Time for Produced Complete Feed Wafers Containing Corn Husk Using with Different Molasses Viscosity
Abstrak: Klobot jagung memiliki kandungan serat yang tinggi namun palatabilitasnya rendah dan sifat fisiknya voluminous. Salah satu cara yang dapat dilakukan dengan pembuatan pakan dalam bentuk wafer. Tujuan penelitian ini adalah mengoptimasi waktu pemanasan dalam pembuatan wafer klobot jagung dengan viskositas molasses yang berbeda. Rancangan percobaan menggunakan Rancangan Acak Lengkap (RAL) faktorial dengan 2 faktor A adalah lama pemanasan dengan 3 taraf (3, 5, 7) menit dan faktor B adalah viskositas molasses dengan 2 taraf (760, 2090) mPas-1. Peubah yang diamati adalah kualitas fisikokimia, efisiensi produksi, dan biaya produksi. Hasil penelitian menunjukkan bahwa perbedaan taraf lama pemanasan dan viskositas molasses berbeda nyata (P<0,05) terhadap kadar air, aktivitas air, dan wafer durability indeks. Wafer dengan lama pemanasan 5 menit dan viskositas molasses 2090 mPas-1 memberikan kondisi optimal berdasarkan pengambilan keputusan menggunakan metode Analytical Hierarchy Process (AHP) dengan peubah prioritas adalah Wafer Durability Indeks (WDI), Corn has a high fiber content but low palatability and is voluminous. One of to fix this problem corn husk can be processed into wafers with physical processing. The research aimed to optimize the heating time with different molasses viscosities on produce the best produce wafers corn husk. The experimental design used a factorial Completely Randomized Design (CRD) with 2 factors, factor A was heating time with 3 levels (3, 5, 7) minutes and factor B was the viscosity of molasses with 2 levels (760, 2090) mPas-1. The observed variables are physicochemistry quality, production efficiency, and production costs. The results showed that the heating time and molasses viscosity were significantly different and had significant interaction (P<0.05) regarding water content, water activity, and wafer durability index. Wafers with a heating time of 5 minutes and a molasses viscosity of 2090 mPas-1 provide optimal conditions based on decision making using the Analytical Hierarchy Process (AHP) method with the priority variable Wafer Durability Index (WDI)
Keyword: heating time, molasses, optimization, viscosity, wafer corn husks

Judul: Physical Quality and Production Efficiency of Black Cumin Waste Wafer at Different Heating Time and Thickness
Abstrak: Limbah Habbatusauda merupakan salah satu limbah industri hasil olahan pertanian yang dapat dimanfaatkan sebagai pakan alternatif untuk hewan ternak. Pembuatan pakan dalam bentuk wafer merupakan salah satu cara pengawetan yang dapat dilakukan. Pencetakan wafer biasanya dilakukan mengunakan suhu 95-130℃ selama 10 hingga 15 menit. Rancangan percobaan untuk lama pemanasan dan ketebalan wafer menggunakan rancangan acak lengkap (RAL) faktorial dengan 2 faktor, yaitu faktor A dan faktor B. Faktor A adalah lama pemanasan dengan 6 taraf (4, 6, 8, 10, 12, 14) menit dan faktor B adalah ketebalan wafer dengan 2 taraf (2 dan 4) cm. Peubah yang diamati adalah kualitas fisik, efisiensi mesin, dan biaya produksi. Data dianalisis menggunakan analysis of variance (ANOVA). Hasil penelitian menunjukkan bahwa perbedaan taraf lama pemanasan dan ketebalan wafer tidak berbeda nyata(P<0,05) terhadap kadar air, aktivitas air, berat jenis, dandurabilitas wafer. Lama pemanasan mempengaruhi sifat fisik wafer pada kadar airdan wafer durability indeks, sedangkan ketebalan tidak mempengaruhi sifat fisikwafer. Wafer dengan lama pemanasan 6 menit memberikan kondisi yang terbaik pada kualitas sifat fisik wafer serta wafer dengan ketebalan 4 cm memerlukan biaya produksi yang lebih rendah dibandingkan dengan ketebalan wafer 2 cm., Black cumin seed waste has a very good potential to be used as alternative feed for livestock. Wafer production was conducted by heating and forming with temperature of 120-130 ℃ for 10 to 15 minutes. This heating process had a good impact to increase palatability. The aim of research was to examine the effect of heating time and wafer thickness in the production of black cumin waste wafer on its physical quality and the efficiency. The Experimental design used was a completely randomized factorial design of two factors. Factor A was heating time with 6 levels (4, 6, 8, 10, 12,14) minutes, and factor B was wafer thickness (2 and 4) cm. The variables observed were physical quality, machine efficiency, and production costs. Data were analyzed using analysis of variance (ANOVA). results showed the heating time and wafer thickness had no significant different (P<0,05) on physical quality. Heating time had an affect on moisture content and waferr durability indeks, while wafer thickness had no impact on physica quality of wafer. The 6 minutes wafer heating time provide the best condition for the physical quality and 4 cm wafer thickness required low production compared to 2 cm wafer thickness.
Keyword: Black cumin waste, Feed wafer, Heating time, physical quality, production efficiency

Judul: Posisi Filogenetik Kura-Kura Carettochelys Insculpta  (Reptillia: Testudinata)
Abstrak: Carettochelys insculpta is an endemic freshwater turtle of southern Papua and northern Australia. Phylogenetic position of this turtle is remain unresolved until now. Most of the research conducted show close relationships of C. insculpta and members of Trionychidae family. However, some of the research show distance between C. insculpta and members of Trionychidae family. This research is conducted to analyze phylogenetic relationship between C. insculpta and other members of Testudinata using 12S rRNA, 16S rRNA, and both gene as markers. DNA samples were obtained from three different organisms of C. insculpta. Two species used as outgroups were Alligator mississippiensis and Iguana iguana. Phylogenetic analysis was carried out using Neighbor-Joining method with Felsenstein 1981 (F81) modeltest. A polytomy tree of Testudinata was produced by using 12S rRNA gene. However, analysis using 16S rRNA and both genes as markers confirmed that C. insculpta was located between the Chelonidae and the Trionychidae family.
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