Current control circuit for display device

Abstract: A current control circuit for a display device is disclosed. The current control circuit for a display device includes a current mirror circuit consisted of high voltage electronic devices, for outputting current equivalent to a power source voltage to a load, a current set unit connected with the current mirror circuit, for setting a value of the current flowing in the load, and a switching element connected with the current mirror circuit, for switching the operation of the current set unit through an external control signal. An amount of the current applied to the load can accurately be controlled due to nonlinear characteristic of the high voltage devices.

Description: BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a current control circuit for a display device, and more particularly, to a passive type current control circuit based on high voltage devices. Background of the Related Art Recently, a flat display market is rapidly developing. A flat display, developed beginning with liquid crystal displays (LCD), has received much attention. A cathode ray tube (CRT), which had been generally used in the field of display for several decades, is recently being replaced with flat displays such as Plasma Display Panel (PDP), Visual Fluorescent Display (VFD), Field Emission Display (FED), Light Emitting Diode (LED), and Electro-luminescence (EL). Recently, there are two methods for driving display devices. The one is a passive type driving method for use in a simple matrix. The other is an active type driving method for use in a thin film transistor (TFT)-LCD. The active type driving method is a voltage driving type and is mainly used in the PDP and the VFD. The passive type driving method is a current driving type and is mainly used in the FED, the LED and the EL device. A display device of the simple matrix type is driven in a scan mode. However, since the display device has a limited scanning turn on time, a high voltage is required to obtain desired luminance. Meanwhile, the TFT-LCD includes a liquid crystal panel consisting of a plurality of gate lines, a plurality of data lines, and a plurality of pixels arranged in crossing points between the gate lines and the data lines. A driving circuit for the TFT-LCD applies display signals to the liquid crystal panel so that each pixel emits light. Each pixel includes a TFT having a corresponding gate line (or scan line) connected with a corresponding data line, and a storage capacitor and a display device connected with a source of the TFT in parallel. A related art passive type driving circuit will be described with reference to the accompanying drawings. FIG. 1 is a diagram illustrating a related art passive type current driving circuit. Referring to FIG. 1, an amount of current flowing in a load is controlled using current to voltage (I-V) characteristic of a P type FET Qp1. To control current to voltage (I-V) characteristic of the P type FET Qp1, an amount of a voltage applied to a gate of the P type FET Qp1 is controlled using resistance to voltage (R-V) characteristic of an N type FET Qs which is a switching element. Maximum current iL that may flow in the load is also controlled. However, the circuit of FIG. 1 depends on the P type transistor Qp1 and the N type transistor Qs to control the current flowing in the load. Accordingly, there is difficulty in exactly implementing the current control circuit. As an example, if there is any deviation in manufacturing the current control circuit in an integrated circuit type, a problem arises in that there are no solutions to solve the deviation. In other words, when the integrated circuit is manufactured, a threshold voltage and an effective channel length of the P type transistor Qp1 and the N type transistor Qs may be varied depending on the process change and the location of a wafer. In this case, the current control circuit cannot exactly be implemented. FIG. 2 is a circuit for compensating the deviation that may occur in an example of FIG. 1. As shown in FIG. 2, a current mirror circuit based on two high voltage devices is used as an element of the current control circuit. Referring to FIG. 2, the current control circuit includes first and second PMOS transistors Qp1 and Qp2 having a power source voltage V dd as an input signal and constituting a current mirror 1, a load 2 connected with a drain of the first PMOS transistor Qp1, a variable resistor VR connected between the first PMOS transistor Qp1 and the load 2, and an NMOS transistor Qs connected with a drain of the second PMOS transistor Qp2 and acted as a switching element. The operation of the current control circuit of the related art flat display device will be described with reference to FIG. 2. Referring to FIG. 2, the first PMOS transistor Qp1 and the second PMOS transistor Qp2 have the same characteristic as each other. Meanwhile, the current iL flowing in the load 2 is controlled by the variable resistor VR connected with the first PMOS transistor Qp1. In other words, when the variable resistor VR is varied to a high resistance value, the current iL flowing in the load 2 becomes smaller. When the variable resistor VR is varied to a low resistance value, the current iL flowing in the load 2 becomes greater. The current iL flowing in the load 2 can be expressed as follows. i L = V dd - V sgp - V dss R 1 In the above equation (1), Vdd is a power source voltage, V sgp is a Voltage drop between a source and a gate of a PMOS transitor, and V dss is a voltage difference between a drain and a source of an NMOS transistor. As described above, the NMOS transistor Qs is used as a switching element and is controlled by an externally input signal C on . The aforementioned passive type current control circuit has several problems. The current mirror circuit of the current control circuit includes high voltage devices. The high voltage devices have a nonlinear period in the current to voltage (I-V) characteristic. Moreover, a problem may occur in the characteristic of the current control circuit due to turn-on and turn-off characteristics of the high voltage device when a low current period is set or the high voltage devices are turned off. In other words, when the high voltage devices include the first PMOS transistor Qp1 and the second PMOS transistor Qp2, the NMOS transistor Qc for switching should be provided with the high voltage device. At this time, a voltage of a current set terminal corresponding to the NMOS transistor Qc for switching should properly be controlled to resist a predetermined high voltage. WO 99/65012 and US 6,091,203 discuss circuits for controlling the current flowing through an organic electro-luminescence (EL) element for use in a display. The circuits described include a current mirror formed from two MOSFETs, which is used to control the current flowing through the EL element. The circuit further includes a switching element and capacitor connected to the gates of these two transistors, for preventing leakage through the EL element. US 6,091,203 further incorporates a control connection for operating these leakage prevention elements. These documents, however, do not disclose that the leakage prevention circuitry is composed of a further MOSFET which is switched through a level shifter. This switching is operated in such a manner that the leakage prevention transistor is on when the current mirror transistors are off. EP 0 365 445 discusses a system of controlling a matrix of organic EL display elements. Each display pixel is provided with a memory cell which is used to control the brightness of the emission from the pixel. Powering of the pixel element using the signal from the memory cell is achieved through a current mirror circuitry, wherein the memory cell is used to control the current through a FET on one side of the mirror. There is no provision made in this document, however, for preventing any leakage current through the MOSFETs of the mirror circuitry US 5,747,820 presents a processing method for fabricating high voltage MOSFET devices alongside low voltage MOSFETs. Discussion is presented that these can be used for powering display elements, however, there is no disdosure of any circuit elements for performing such. US 5,966,110 discusses a circuitry for powering a plurality of light emitting diodes (LEDs), which is based around a current mirror circuit fabricated with MOSFETs. This circuit further includes bipolar junction transistors which are connected via their gates to either side of the current mirror. These bipolar devices are included to stop a high voltage appearing at the MOSFETs which are not disclosed as being high voltage devices. As a result, there is not the demand for the leakage prevention circuitry of the current invention. WO 99/38148 and JP 11045071 both discuss the use of current mirror circuits for powering EL pixel elements Unlike the current invention, however, the current mirrors of these documents do not contain a switching element between the gate connection of the transistors making up the current mirror. EP 0 809 229 discusses a matrix array for controlling light emission from an LED display, with full details of the circuitry for element selection Further, a series of level shifters is disclosed attached to the gates of the transistors controlling power to the pixel column. These level shifters are required to prevent undesirable biasing of the transistors: No disclosure is made about using these level shifters in a circuit for controlling the switching of a leakage prevention circuit in a current mirror for powering EL devices. EP 0 932 137 and EP 0 895 219 each discuss display circuitry for connecting the individual elements in a matrix array. The document discloses, that contained within the driving circuits, level shifters are provided. There is no discussion that these circuit elements are utilised for ensuring no leakage current passes through MOSFETs in a current mirror circuit, as in the present invention SUMMARY OF THE INVENTION The invention is set forth in attached claim 1. Accordingly, the present invention is directed to a current control circuit for a display device that substantially obviates one or more problems due to limitations and disadvantages of the related art. An object of the present invention is to provide a current control circuit for a display device that can solve problems due to process error when the display device is manufactured. Another object of the present invention is to provide a current control circuit for a display device that can accurately control current flowing in a load considering nonlinear characteristic of a high voltage device. Another object of the present invention is to provide a current control circuit for a display device, having a mirror structure with high voltage devices. Other object of the present invention is to provide a current control circuit for a display device that can prevent leakage current from flowing in a load. Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings. To achieve these objects and other advantages and in accordance with the purpose of the invention, a current control circuit for a display device includes a current mirror circuit consisted of high voltage electronic devices, for outputting current equivalent to a power source voltage to a load, a current set unit connected with the current mirror circuit, for setting a value of the current flowing in the load, and a switching element connected with the current mirror circuit, for switching the operation of the current set unit through an external control signal. The current mirror circuit includes a first PMOS transistor having a first source connected with a power source voltage, a first drain, and a first gate, and a second PMOS transistor having a second source connected with the power source voltage, a second drain connected with the load, and a second gate connected with the first gate. The current control circuit further includes an element for preventing leakage current between the power source voltage and the gates to cut off the leakage current flowing in the load. The current control circuit further includes a level shifter for switching the element for preventing leakage current through the control signal for the switching element. In the embodiment of the present invention, the current control circuit is provided with the current mirror circuit based on high voltage devices, so that current applied to the display device can accurately be controlled. It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRZEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principle of the invention. In the drawings: FIG. 1 is a diagram illustrating a related art passive type current control circuit; FIG. 2 is a diagram illustrating another related art passive type current control circuit; FIG. 3 is a diagram illustrating a current control circuit according to a comparative example; FIG. 4 is a diagram illustrating a current control circuit according to the embodiment of the present invention; FIG. 5 is a sectional view illustrating a structure of a transistor as a high voltage device in accordance with the present invention; and FIG. 6 is a diagram illustrating layout of two transistors having a mirror type in accordance with the present invention. DETAILED DESCRIPTION OF THE INVENTION Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. A current control circuit based on high voltage devices according to a comparative example will be described with reference to FIG. 3. Referring to FIG. 3, a current control circuit for a display device includes a current mirror circuit 10, a current set unit Iset, and a switching element Qc. The current mirror circuit 10 includes a first PMOS FET Qp1 and a second PMOS FET Qp2 which are high voltage electronic devices, and outputs current equivalent to a power source voltage HVDD through two output terminals. The current set unit Iset is connected with a drain of the second PMOS FET Qp2 corresponding to one of the two output terminals and controls current iL flowing in a load 20 connected with a drain of the first PMOS FET Qp1. Meanwhile, the switching element Qc is connected between the drain of the second PMOS FET Qp2 and the current set unit Iset, and includes a switching element for switching the operation of the current set unit Iset, i.e., turn-on operation and turn-off operation, through an external control signal DEN. The current mirror circuit 10 includes the first PMOS FET Qp1 and the second PMOS FET Qp2. The first PMOS FET Qp1 has a first source S1 connected with the power source voltage HVDD, a first drain D1, and a first gate G1. The second PMOS FET Qp2 has a second source S2 connected with the power source voltage HVDD, a second drain D2 connected with the load 20, and a second gate G2 connected with the second drain D2 and the first gate G1. In FIG. 3, the second drain D2 and the second gate G2 are connected with each other in the second PMOS FET Qp2 to obtain diode characteristic. Therefore, the first gate G1 and the second gate G2 are maintained at a constant voltage. The operation of the current set unit Iset of FIG. 3 will now be described. If an appropriate amount of current is set by the current set unit Iset, the current iL corresponding to the set amount of current flows in the load 20. Meanwhile, when the NMOS FET Qc for switching is turned off, it is general that the high voltage devices, i.e., the first PMOS FET Qp1 and the second PMOS FET Qp2 constituting the current mirror circuit 10 are also turned off. However, as is well known, since the high voltage devices have poor turn-off characteristic, leakage current occurs in the load 20. When the NMOS FET Qc for switching is turned on, the current iL set by the current set unit Iset uniformly flows in the load 20 in view of the characteristic of the current mirror circuit 10. A current control circuit based on high voltage devices according to the embodiment of the present invention will be described with reference to FIG. 4. Referring to FIG. 4, the current control circuit for a display device includes a current mirror circuit 10, a current set unit Iset, a switching element Qc, a third PMOS FET Qp3, and a level shifter 30. The third PMOS FET Qp3 acts to prevent leakage current from occurring. The level shifter 30 controls the operation of the third PMOS FET Qp3, i.e., turn-on and turn-off of the third PMOS FET Qp3. The third PMOS FET Qp3 is connected between gates G1 and G2 of the first and second PMOS FETs Qp1 and Qp2 and a power source voltage HVDD, and is controlled by an output signal of the level shifter 30 to cut off leakage current flowing in a load 20. As described above, the third PMOS FET Qp3 is turned on or off in accordance with the output signal of the level shifter 30, and the level shifter 30 is turned on or off by an external control signal DEN of the switching element Qc, i.e., NMOS FET. The current mirror circuit 10 includes high voltage electronic devices, i.e., the first PMOS FET Qp1 and the second PMOS FET Qp2, and outputs current equivalent to the power source voltage HVDD through two output terminals, in the same manner as FIG. 3. Meanwhile, the current set unit Iset is connected with a drain of the second PMOS FET Qp2 corresponding to one of the two output terminals and sets current iL flowing in the load 20 connected with a drain of the first PMOS FET Qp1 corresponding to the other of the two output terminals. Meanwhile, the switching element Qc is connected between the drain of the second PMOS FET Qp2 and the current set unit Iset, and switches the operation of the current set unit Iset, i.e., turn-on operation and turn-off operation, through the external control signal DEN. The current mirror circuit 10 includes the first PMOS FET Qp1 and the second PMOS FET Qp2. The first PMOS FET Qp1 has a first source S1 connected with the power source voltage HVDD, a first drain D1 that acts as the first output terminal, and a first gate G1. The second PMOS FET Qp2 has a second source S2 connected with the power source voltage HVDD, a second drain D2 that acts as the second output terminal, and a second gate G2 connected with the second drain D2 and the first gate G1. The second drain D2 and the second gate G2 are connected with each other in the second PMOS FET Qp2 to obtain diode characteristic. Therefore, the first gate G1 and the second gate G2 are maintained at a constant voltage. The operation of the current set unit Iset of FIG. 4 will now be described. If an appropriate amount of current is set by the current set unit Iset, the current iL corresponding to the set amount of current flows in the load 20. Meanwhile, when the NMOS FET Qc for switching is turned on, the current iL set by the current set unit Iset uniformly flows in the load 20 in view of the characteristic of the current mirror circuit 10. However, when the NMOS FET Qc for switching is turned off, leakage current may occur in the load 20 due to turn-off characteristic of the high voltage devices. To prevent the leakage current from occurring, the third PMOS FET Qp3 is provided between the gates G1 and G2 of the high voltage devices, i.e., the first and second PMOS FETs Qp1 and Qp2 and the power source voltage HVDD. Thus, the leakage current can be prevented from flowing in the load 20. Meanwhile, the first PMOS FET Qp1 and the second PMOS FET Qp2, the switching element Qc, i.e., NMOS FET, and the third PMOS FET are formed in an Extended-Drain MOS FET (ED MOSFET) type. The operation of the current control circuit of FIG. 4 will be described in more detail. First, the amount of the current iL applied to the load 20 is determined by the current set unit Iset. Once the switching element Qc, i.e., NMOS FET is turned on by the control signal DEN, the third PMOS FET Qp3 is turned off. Meanwhile, the gates G1 and G2 of the first PMOS FET Qp1 and the second PMOS FET Qp2 constituting the current mirror circuit are always maintained at a constant voltage level due to the diode characteristic of the second PMOS FET Qp2. Accordingly, the first PMOS FET Qp1 is turned on by the constant voltage level, and the current set by the current set unit Iset flows in the load 20. As described above, in the current control circuit according to the second embodiment of the present invention, the first PMOS FET Qp1 and the second PMOS FET Qp2 constituting the current mirror circuit have matched characteristic. When the first PMOS FET Qp1 and the second PMOS FET Qp2 are manufactured on one chip, some process change may occur and a threshold voltage and an effective channel length may be varied depending on the location of a wafer. However, the current iL output from the first PMOS FET Qp1 to the load 20 has the same value as that set by the current set unit Iset. Therefore, to obtain the matched characteristic, layout of the first PMOS FET Qp1 and the second PMOS FET Qp2 is very important when they are manufactured on one chip. FIG. 5 is a sectional view illustrating a structure of a high voltage device, i.e., MOS FET in accordance with the present invention, and FIG. 6 is a diagram illustrating layout of two MOS FETs having a mirror type in accordance with the present invention. Referring to FIG. 5, a drain region 60 is longer than a source region 70. The drain region 60 has a drift region 20 with a smaller density than an ion injection density of the source region 70 to resist a high voltage applied thereto. In other words, the MOS FET of FIG. 5 has an asymmetrical structure not a soft alignment structure. Accordingly, the drain region 60 may be longer or shorter due to misalignment of a mask during the process of manufacturing the MOS FETs on a wafer. In this case, the effective channel lengths of the MOS FETs are varied and voltage-current characteristic of the MOS FETs is also varied. Therefore, it is very important that the first PMOS FET Qp1 and the second PMOS FET Qp2 have matched characteristic. As shown in FIG. 6, it is necessary to form layout of the current mirror circuit in order that the drain regions D1 and D2 of the PMOS FETs Qp1 and Qp2 are arranged in parallel to, thereby obtaining the matched characteristic of the PMOS FETs. Thus, the effective channel lengths of the MOS FETs are varied at the same size as each other by misalignment of the mask during the process of manufacturing the current mirror circuit. Accordingly, there is no change of the voltage-current characteristic of the MOS FETs according to change of the effective channel lengths. Meanwhile, the effective channel length is proportional to the amount of current flowing in the channel while a channel width is inversely proportional to the amount of current flowing in the channel. For example, in a state where the channel length ratio of the first PMOS FET Qp1 and the second PMOS Qp2 is 1:1, the channel width ratio of them is 1/N:1. Alternatively, in a state where the channel width ratio of the first PMOS FET Qp1 and the second PMOS Qp2 is alike, the channel length ratio of them is 1:1/N. In this case, power consumption of the current control circuit can remarkably be reduced as compared with that the channel length ratio and the channel width ratio of the first PMOS FET Qp1 and the second PMOS FET Qp2 are all 1:1. As aforementioned, the current control circuit based on high voltage devices according to the present invention has the following advantages. First, since the transistors constituting the current mirror circuit have matched characteristic, the current flowing in the load can be set to be equivalent to the current set by the current control circuit even if the threshold voltage and the effective channel length are varied depending on the process change and the location of the wafer during the manufacturing process of the chip. Since the channel length or the channel width of the high voltage devices constituting the current mirror circuit is controlled, power consumption of the current control circuit can remarkably be reduced. Furthermore, it is possible to accurately control the current flowing in the load considering the nonlinear characteristic of the high voltage devices. Finally, the effective channel lengths of the high voltage devices are varied at the same size as each other by misalignment of the mask during the process of manufacturing the current mirror circuit. Accordingly, the voltage-current characteristic of the current control circuit is not varied. The forgoing embodiment is merely exemplary and is not to be construed as limiting the present invention. The present teachings can be readily applied to other types of apparatuses. The description of the present invention is intended to be illustrative, and not to limit the scope of the claims. Many alternatives, modifications, and variations will be apparent to those skilled in the art.

Claims: A current control circuit for a display device comprising: a current mirror circuit (10) consisting of MOS FETs for resisting a high voltage for outputting current to a load (20); a current set unit (Iset) connected with the current mirror circuit (10), for setting the magnitude of the current flowing in the load (i L ); a first switching element (Qc) connected between the current mirror circuit (10) and the current set unit (Iset), for switching the operation of the current set unit (Iset) through an external control signal (DEN), wherein the current set unit (Iset) is connected between the switching element (Qc) and a ground voltage (GND); wherein the MOS FETs for resisting a high voltage constituting the current mirror circuit (10) include two PMOS FETs, a first PMOS FET (Qp1) of the two PMOS FETs including a first source (S1) connected with the power source voltage (HVDD), a first drain (D1) connected with the load (20), and a first gate (G1), a second PMOS FET (Qp2) of the two PMOS FET s including a second source (S2) connected with the power source voltage (HVDD) together with the first source (S1), a second drain (D2) connected with the switching element (Qc), and a second gate (G2) connected to the first gate (G1), and connected with the second drain (D2) to implement a diode function, wherein the first switching element (Qc) is an NMOS FET, which is connected via its gate to the external control signal (DEN), characterized in that said MOS FETs are extended drain MOS FETs, an element (Qp3) is connected between the power source voltage (HVDD) and the current mirror circuit (10), for preventing leakage (Qp3) current from flowing in the load (20); and the element (Qp3) for preventing leakage is a PMOS FET, which is connected through a level shifter (30) to the external signal (DEN) so that the element (Qp3) for preventing leakage is switched off while the first switching element (Qc) is switched on and vice versa. The current control circuit of claim 1, wherein the extended drain MOS FETs for resisting a high voltage constituting the current mirror circuit (10) have at least one controlled ratio of a channel length ratio and a channel width ratio between them. The current control circuit of claim 1, wherein the first PMOS FET (Qp1) and the second PMOS FET (Qp2) have drain regions arranged in parallel to have matched characteristic. The current control circuit of claim 1, wherein the first PMOS FET (Qp1) and the second PMOS FET (Qp2) have a channel length ratio of 1:1 and a channel width ratio of 1/N:1. The current control circuit of claim 1, wherein the first PMOS FET (Qp1) and the second PMOS FET (Qp2) have a channel width ratio of 1:1 and a channel length ratio of 1:1/N. The current control circuit of claim 1, wherein the NMOS FET (Qc) is an extended drain MOS FET. The current control circuit of claim 1, wherein the current set unit (Iset) is connected between the switching element (Qc) and a ground voltage (GND). The current control circuit of claim 1, wherein the level shifter (30) is a switching element (30) for switching the element for preventing leakage (Qp3) through the control signal (DEN). The current control circuit of claim 1, wherein the current mirror circuit (10) consists of two transistors (Qp1, Qp2), wherein the current mirror circuit (10) is fixed, and wherein the first switchingcircuit (Qc) enables and disables the current mirror circuit (10).

Inventors: KIM HAK-SU, NA YOUNG-SUN, KIM, HAK-SU, NA, YOUNG-SUN
Applicants: LG ELECTRONICS INC, LG ELECTRONICS INC.
Application year: 2001
Main classification: G09G3
IPC codes: G09G3