APPARATUS FOR THE APPLICATION OF DEVELOPING SOLUTION TO A SEMICONDUCTOR WAFER

Abstract: A wedge-shaped nozzle (70) for dispensing fluids onto a round surface (76) is disclosed. The nozzle (70) dispenses the fluid with a generally uniform volume of fluid per unit area of the round surface (76) to achieve rapidly a uniform thickness of applied fluid on the round surface (76). The wedge-shaped nozzle (70) has orifices (81) of equal size disposed on its bottom through which the fluid is dispensed. The orifices (81) are disposed along arcs (171), with increasing numbers of orifices (81) on the arcs (171) at greater and greater distances of the arcs (171) from the apex of the wedge-shaped nozzle (70). The numbers of the orifices (81) on each arc (171) are proportional to the area of an annular region determined by the arcs (171).

Description: APPARATUS FOR THE APPLICATION OF DEVELOPING SOLUTION TO A SEMICONDUCTOR WAFER TECHNICAL FIELD The present invention relates to the field of semiconductor integrated circuits The invention is illustrated in an example with regard to a semiconductor integrated circuit wet processing method and apparatus, but it will be recognized by those of skill in other arts that the invention has a wider range of applicability Merely by way of example, the invention can also be applied to the manufacture of raw wafers, disks and heads, flat panel displays, microelectronic masks, and other applications requiring high purity wet processing such as steps of rinsing, drying, and the like The present invention generally relates to a nozzle and a method for dispensing process liquids onto a surface More particularly, the present invention relates to a fluid dispense nozzle for dispensing fluids of photoresist developer chemicals, photoresist chemicals, cleaning and πnsuig chemicals, etchant chemicals, or dielectric chemicals onto a rotating semiconductor substrate matenal BACKGROUND ART Integrated circuits are typically constructed by depositing a series of individual layers of predetermined materials on a wafer shaped semiconductor substrate, or "wafer " The individual layers of the integrated circuit are m turn produced by a series of manufactunng steps For example, m formmg an individual circuit layer on a wafer containmg a previously formed circuit layer, an oxide, such as silicon dioxide, is deposited over the previously formed circuit layer to provide an insulating layer for the circuit A pattern for the next circuit layer is then formed on the wafer using a radiation alterable mateπal, known as photoresist Two very common families of photoresists are phenol- formaldehyde polymers and polyisoprene polymers Photoresist matenals are generally composed of a mixture of organic resins, sensitizers and solvents Sensitizers are compounds, such as bio-aryldiazide and o-naphthaqumone-diazide, that undergo a chemical change upon exposure to radiant energy, such as visible and ultraviolet light resulting in an irradiated mateπal having differing solvation characteπstics with respect to vaπous solvents than the nonirradiated mateπal Resins are used to provide mechanical strength to the photoresist and the solvents serve to lower the viscosity of the photoresist so that it can be uniformly applied to the surface of the wafers After a photoresist layer is applied to the wafer surface, the solvents are evaporated and the photoresist layer is hardened, usually by heat treating the wafer The photoresist layer is then selectively irradiated by placing a radiation opaque mask containing a transparent portion defining the pattern for the next circuit layer over the photoresist layer and then exposing the photoresist layer to radiation The photoresist layer is then exposed to a chemical, known as developer, in which either the lπadiated or the nonirradiated photoresist is soluble and the photoresist is removed m the pattern defined by the mask, selectively exposing portions of the underlying insulating layer Common developers are tetramethyl ammonium hydroxide, sodium hydroxide, xylene and Stoddard solvent After development rinsing is performed with fluids such as water or n-Butylacetate The exposed portions of the insulating layer are then selectively removed using an etchant to expose corresponding sections of the underlymg circuit layer The photoresist must be resistant to the etchant, so as to limit the attack of the etchant to only the exposed portions of the insulating layer Alternatively, the exposed underlying layer(s) may be implanted with ions which do not penetrate the photoresist layer thereby selectively penetrating only those portions of the underlying layer not covered by the photoresist The remaining photoresist is then stπpped using either a solvent, or a strong oxidizer in the form of a liquid or a gas in the plasma state The next layer is then deposited and the process is repeated until fabπcation of the semiconductor device is complete Photoresist solution, developer solution and other process liquids are typically applied to the wafer using a spin coating technique in which the process liquid is sprayed on the surface of the wafer as the wafer is spun on a rotating chuck The spinning of the wafer distributes the liquid over the surface of the mateπal In particular, when developer chemicals are applied to the surface, it is necessary to quickly and gently produce a deep puddle of developer on the wafer to ensure that the photoresist layer is dissolved uniformly m areas that are soluble in the developer In a developing process, among other manufactunng processes for a semiconductor device, a developer should be uniformly applied to a resist film on a semiconductor wafer within a predetermined time The reason is that the developing uniformity for the resist film is generally supposed to depend on the state of development, so that the development is subject to lπegulaπty unless the developer is first uniformly supplied to the whole surface of the wafer Conventionally, therefore, liquid coating nozzles of vanous types have been proposed U S. Pat No 4,267,212 discloses a process for spin coating a semiconductor wafer uniformly with a coating solution such as a photographic emulsion by rotatmg the wafer at a first speed while simultaneously applying the coating solution through a circular nozzle at a radially moving position Once the semiconductor wafer has been initially covered, the speed of rotation of the wafer is increased and rotation continues until a uniform coating has been obtained A similar process having a stationary nozzle is disclosed in U S Pat No 3,695,928 In each of the aforedescnbed apparatuses and methods, the fluid coating matenal is dispensed m a column of fluid whose cross-section approximates a circle, either dunng wafer rotation or while the wafer is stationary Wafer coating is achieved by building up a pool of the fluid coating mateπal in the nature of a thick layer and spm casting a film thereof by accelerating the rotation of the wafer about its own center in order to remove the excess mateπal and to leave a thin film coating therebehind The amount of fluid coating mateπal. such as photoresist, remaining on the wafer is known to be a very small fraction of the amount that is initially dispensed, approximately one part in one thousand This results in a substantial matenal loss of unusable photoresist along with its attendant cost In addition, this creation of a pool of the fluid coating matenal on the wafer surface can result in the formation of uneven films which might adversely effect subsequent wafer processing Very specifically, in the pπor art, a vanety of devices, called nozzles, are used to apply fluids to a wafer surface In Fig 1. a simple spout nozzle 5 is depicted with an orifice 10 at the end of a spout attached to a fluid supply tube 15 The nozzle is positioned above the center of a rotating wafer 20 shown m the plan view Fig 2 depicts a side view of this device dispensing fluid 31 onto the wafer 20 supported by a spin chuck 33 connected to a motor (not shown) that rotates the chuck and thus the wafer In this nozzle 5. the fluid reaches the wafer center 35 first and only gradually is dispersed by centπfugal force to the penmeter 37 of the wafer In fact, even after distnbution to the penmeter, a greater amount of developer remains near the center 35 as shown in Fig 3 Fig 4 depicts a cross-sectional view along a longitudinal axis of another version of the pnor art. known as a block nozzle 55 which tπes to solve some of the difficulties of the spout nozzle In this case, the block nozzle 55 is a rectangular vessel 40 with an inteπor 42 serving as a liquid reservoir The nozzle's top surface 44 has two inlet fittings 46A B for attachment to a fluid supply tube 48A, B, a support 41 for connection to an external apparatus not depicted, and an outlet fittmg 43 for attachment to a gas outlet tube The bottom 45 of the nozzle has a portion downwardly projecting called a nozzle tip 47 with a multiplicity of openings or onfices, e g , 49, out of which the fluid is dispensed Fig 5 depicts a transverse cross-section of the block nozzle 55 The figure shows the onfices, e g , 49, in fluid communication with the vessel's mtenor 42 through a slit 51 in the nozzle tip 47 and small passages 53 in the bottom wall of the mtenor The nozzle tip and its onfices are arranged on the nozzle in a row approximately the diameter of the wafer, and each of the onfices have similar opening areas Fig 6, m bottom plan view looking upwards from a rotatmg wafer 20 below the block nozzle 55. shows the block nozzle with its row of onfices 49A-I A vaπation of the block nozzle is the partial-block nozzle 57 depicted m bottom plan view looking upwards from a rotating wafer 20 m Fig 7 The difference between the block and partial-block nozzle is apparent by companson to the wafer diameter The partial-block nozzle is only about half the length of the block nozzle, and when placed over the wafer, extends about one wafer radial length from the center to the penmeter 59 The cross-sectional views of the partial-block nozzle 57, along both its longitudinal axis and its transverse axis, would be similar to the cross-sectional views of the block nozzle 55 shown m Fig 4 and Fig 5 Unlike the spout nozzle, the block nozzle and partial-block nozzle dispense fluid near the penmeter 59 of the wafer and at points between the penmeter and center 52 at the same time that those two nozzles dispense fluid to the center of the wafer, thereby solving the most extreme difficulty of the spout nozzle However, despite the improvement in uniform distribution of the dispensed fluid on the wafer, substantial non-uniformity persists To understand the cause of the persistmg non-uniformity, suppose the wafer is 8 inches in diameter, suppose that the nozzle is of the partial-block design, and suppose that there are four equally-spaced onfices of equal openmg area Suppose further that in Fig 7 the nozzle is placed so that one end onfice 54E overlies the center of the wafer 52, while the other end onfice 54A overlies a wafer region just mside the wafer's penmeter 59 The first end onfice dispenses fluid onto the wafer's center while each of the other three onfices dispenses fluid onto a separate annulus Fig 8 shows a circular region 60 of one mch radius and three concentnc annular regions 62, 64 and 66 of inner and outer radii, respectively, of 1" and 2", 2" and 3", and 3" and 4" The area of each annulus is π (r 2 oute r - r " i nner ) and, accordingly, Fig 9 shows the area 61 of the 1" circle 68 and the three successive annuluses as a function of the radius 63 of the circle and the outer radius of the three annuluses From Fig 9 it is evident that the area of the circle is '/7th of the outer-most annulus Accordingly, assuming approximately equal fluid flow per unit time through the opening of each orifice, the fluid dispensed from the central onfice 54E m Fig 7 is spread over an area only '/7th that of the fluid dispensed from the onfice nearest the wafer's penmeter 54A As a result, assuming for simplicity fluid dispensed over the circle 68 remains in the circle and fluid dispensed over the penmeter annulus 66 remains there, serious non-uniformity with a radial dependence exists because the average thickness of the dispensed fluid over the center circle is seven times that over the penmeter annulus This non-uniformity will be further exaggerated as the semiconductor industry over time employs wafers of ever-increasing diameter As a result, over-de elopment can occur in the wafer center compared to the wafer perimeter The timing of the application of de\ eloper fluid to the wafer can also affect the uniformity of the results of development For example, chemically amplified photoresists tend to develop much more rapidly than non- chemicallv amplified photoresists The speed of chemically amplified photoresists can be as little as one second That time is often less than the time required to apply the developing solution to the entire wafer surface Consequently, if some portions of the wafer are covered with developer earlier than other portions the developing process will proceed to a farther stage at those earlier portions in a given amount of time In the use of the partial-block design described m Fig 7, the center circle 68 is covered with at least some fluid at the onset of fluid dispensing, while the penmeter annulus 66 receives fluid along its full extent only at the end of one revolution of the wafer spun by the chuck Accordingly, if the fluid is developer, development begms much sooner on the center circle than at many portions of the wafer penmeter That development might even run to completion much sooner at the central circle than in the penmeter annulus m the event chemically-amplified photoresists are used, for the reasons discussed above Accordingly, there is a need for a nozzle which applies fluid uniformly per unit wafer area to wafer portions of increasing distance from the center to produce more uniform thickness of the dispensed fluid over the whole water area and therefore more uniform photoresist layers and more uniform development processes Moreover, there is a need for more rapid application of the wafer fluid to wafer regions distant from the wafer center That more rapid application will produce more uniform development times from the beginning of fluid dispensmg mdependent of the distance of the wafer region from the wafer center Accordingly, there is an unsolved need for an apparatus which minimizes consumption of the coatmg matenal such as photoresist, dunng spin casting and the like, as well as providing a more uniform and more rapidly applied thin film coatmg on semiconductor wafers dunng the fabncation of integrated circuits and other electronic components therefrom in the semiconductor industry Thus it is apparent that a need exists for an improved nozzle for spin dispensing apparatuses which overcomes among others the above-discussed problems so as to produce a more uniform and more rapidh applied layer of process liquid over the surface of the wafer DISCLOSURE OF INVENTION The present mvention is defined by the following claims, and nothing in this section should be taken as a limitation on those claims By way of introduction, the prefeπed embodiments descπbed below relate to a wedge-shaped nozzle for dispensing fluids onto a round surface with a generally uniform volume of fluid per unit area of the round surface to achieve rapidly a uniform thickness of applied fluid on the round surface The wedge-shaped nozzle has onfices of equal size disposed on its bottom through which the fluid is dispensed The onfices are disposed along arcs, with increasing numbers of onfices on the arcs at greater and greater distances of the arcs from the apex of the wedge-shaped nozzle The numbers of the orifices on each arc are proportional to the area of an annular region determined by the arcs Accordingly, the present invention provides an improved nozzle that allows process liquid to be dispensed more uniformly on a rotating surface which provides for a more uniform distπbution of the process liquid on the surface of the layer while requiπng less process liquid and slower rotational speed to ensure full coverage of the surface One object of the present invention is to provide an apparatus tor applying a thm layer of a fluid mateπal such as photoresist or developer fluid on the surface of a wafer which eliminates pooling of the mateπal Another object of the present mvention is to provide an apparatus for applying a layer of a fluid mateπal such as a photoresist or developer fluid on the surface of a wafer which reduces the amount of the material required for a given coating thickness Another object of the present mvention is to provide an apparatus for applying a layer of a fluid matenal such as a photoresist or developer fluid on the surface of a wafer which enhances uniformity of coating thickness Another object of the present mvention is to provide an apparatus which renders uniformity of fluid matenal application to a wafer more insensitive to greater and greater wafer diameters Another object of the present mvention is to provide a photoresist application or developing treatment apparatus making it possible to form a resist pattern havmg a very small measurement error range and high precision and improve the yield rate of the resist pattern Another object of the invention is to provide a method for photoresist application or developing treatment making it possible to form a resist pattern having a very small measurement error range and high precision and improve the ield rate of the resist pattern Additional objects and advantages of the mvention will be set forth in the descnption which follows, and in part will be obvious from the descπption, or may be learned by practice of the mvention The objects and advantages of the invention may be realized and obtained by means of the instrumentalities and combmations particularly pointed out hereinbefore These and other details, objects, and advantages of the mvention will become apparent as the following detailed descnption of the present preferred embodiment thereof proceeds BRIEF DESCRIPTION OF DRAWINGS Fig 1 is a bottom plan view of a spout nozzle lookmg upwards from a rotating wafer disposed below the spout nozzle and showing its orifice Fig 2 is a side view of the spout nozzle Fig 3 is a side view of the non-uniform distnbution of fluid material on a wafer Fig 4 is a longitudinal cross-sectional view of a pnor art block nozzle Fig 5 is a transverse cross-section of the pnor art block nozzle Fig 6 is a bottom plan view of the pnor art block nozzle showing its orifices looking upwards from a rotatmg wafer Fig 7 is a bottom plan view of a pnor art partial-block nozzle lookmg upwards from a rotatmg wafer disposed below the partial-block nozzle and showing its orifices Fig 8 is a top plan view of concentnc annular regions of a wafer receiving dispensed fluid from the pnor art partial-block nozzle Fig 9 is a graph depicting the areas of the circular region and annular regions of the wafer as a function of the radii of the regions Fig 10 is a perspective view of a first embodiment of the invention called a half-block nozzle Fig 1 1 is a longitudinal cross-sectional view of the half-block nozzle Fig 12 is a transverse cross-sectional view of the half-block nozzle Fig 13 is a bottom plan view of the half-block nozzle lookmg upwards from a wafer disposed below the half-block nozzle and showing its onfices Fig 14 is a bottom plan view of an alternative embodiment of the half-block nozzle showing concentnc annuluses used for measunng fluid flow Fig 15 is a bottom plan view of a second embodiment of the invention called the full-block (even) nozzle looking upwards from a wafer disposed below the full-block nozzle and showing its orifices Fig 16 is a bottom plan view of an alternative embodiment of the full-block (even) nozzle showing concentnc annuluses used for measunng fluid flow Fig 17 is a bottom plan view of a third embodiment of the mvention called the full-block (odd) nozzle looking upwards from a wafer disposed below the full-block nozzle and showing its onfices Fig 18 is a bottom plan view of an alternative embodiment of the full-block (odd) nozzle showing concentnc annuluses used for measunng fluid flow Fig 19 is a perspective view of the fourth and preferred embodiment of the mvention called a wedge nozzle Fig 20 is a cross-sectional view of the wedge nozzle along an axis connecting the middle side edge and a point on the penmeter edge Fig 21 is a transverse cross-section of the wedge nozzle Fig 22 is a bottom plan view of the wedge nozzle, looking upward from a wafer disposed below the wedge nozzle and showing its onfices Fig 23 is a bottom plan view of an alternative view of the wedge nozzle and more preferable embodiment of the invention showmg concentnc annuluses used for measunng fluid flow Fig 24 is a perspective view of the fifth embodiment of the mvention called a general-purpose (full) nozzle Fig 25 is a cross-sectional view of the general-purpose (full) nozzle Fig 26 is a transverse cross-section of the general-purpose (full) nozzle Fig 27 is a bottom plan view of the general-purpose (full) nozzle, lookmg upward from a wafer disposed below the general-purpose (full) nozzle and showing its onfices Fig 28 is a bottom plan view of an alternative embodiment of the general-purpose (full) nozzle showing concentnc annuluses used for measunng fluid flow Fig 29 is a bottom plan view of the alternative embodiment of the general-purpose (full) nozzle showing concentric annuluses used for measuring fluid flow for the case where a bottom subregion contains the middle pomt Fig 30 is a bottom plan view of the sixth embodiment of the invention, called a general-purpose (half) nozzle, lookmg upward from a wafer disposed below the general-purpose (half) nozzle and showing its onfices Fig 31 is a bottom plan view of an alternative embodiment of the general-purpose (half) nozzle showing concentnc annuluses used for measunng fluid flow MODE(S) FOR CARRYrNG OUT THE INVENTION Fig 10 depicts a perspective view of a first embodiment of the invention known as a half-block nozzle 70 This embodiment is a generally rectangular vessel 72 with a longitudinal axis 74 a total surface and a generalh rectangular top surface 76 Ot course variations in this general shape will be readilv apparent to those of ordinary skill in the art Fig 1 1 depicts a cross-sectional view along the longitudinal axis 74 and perpendicular to the top surface 76 of this embodiment of the invention showing the mtenor 78 serving as a liquid reservoir The half- block nozzle's top surface 76 has one or more inlet fittings 71 A, B for attachment to a fluid supply tube 73 A, B, a support 75 for connection to an external apparatus (not depicted) to support the nozzle, and an outlet fittmg 77 for attachment to a gas outlet tube Nevertheless, it will be apparent to those of ordinary skill in the art that these items shown on the top surface may or may not be present in the numbers, or m the locations on the nozzle, or in fact may be entirely absent The bottom of the nozzle has a portion downwardly projectmg called a nozzle tip 79 with a multiplicity of openings or onfices, e g , 81 , out of which the fluid is dispensed Agam, it will be apparent to those of ordinary skill in the art that the onfices might be disposed on a bottom that has no nozzle tip Fig 12 depicts a transverse cross-section of the half-block nozzle 70 The figure shows one of the onfices 81 m fluid communication with the vessel's mtenor 78 through a slit 83 in the nozzle tip 79 and a small passage 85 in the bottom wall of the mtenor The nozzle tip and its onfices are arranged on the nozzle m a row whose length is approximately half the diameter of the wafer Fig 13, in bottom plan view looking upwards from a rotating wafer 20 below the half-block nozzle 70 shows the half-block nozzle with its row of onfices 81A-D In this view and this onentation of the nozzle with respect to the wafer, the onfices face the wafer sufficiently to allow fluid dispensed from the onfices to contact the wafer surface with minimal disturbance of the desired dispensmg process Although the onfices 81A-D are depicted in Fig 13 as being generally co-planar, circular in shape, and equidistant from each other m center-to- center distance, it will be apparent to those of ordinary skill m the art that the bottom may not be planar, the nozzle tip bottom ends m which the onfices are openmgs may not be co-planar, that the onfice centers 88A-D might not be equidistant from each other, and that the onfice shapes might not be planar or two-dimensional and even if two-dimensional and planar, might be semi-circular, elliptical, square or hexagonal in shape or of some other shape altogether The half-block nozzle 70. when placed over the wafer 20. extends about one wafer radial length from the wafer center 86 to the wafer penmeter 87 It will be apparent to one of skill in the art that the center of the one end orifice 88A might be placed substantially overlying the wafer center 86 The central onfice 81 A is the onfice at one end of the row of onfices, / e , the onfice closest to one of the two opposite side surfaces 82A, B depicted m Figs 10 and 1 1 and called the first side surface 82B The charactenstics of the nozzle are selected so that the volume of fluid flow per unit time through a given onfice exceeds, or is at least substantially equal to, the volume of fluid flow per unit time through any other onfice closer to the central onfice 81A than the given onfice As depicted m Fig 13, the areas of the circular onfices increase along the row beginning with the central onfice The increasing onfice areas is one nozzle characteπstic that can produce the result of generally mcreasmg, or non-decreasing, volume of fluid flow just descπbed However it will be apparent to those of ordinary skill in the art that other characteristics of the nozzle, including its nozzle tips and small passages, can produce pressure, viscosity and other physical effects with the same result More particularly, this embodiment can be employed so that the first side surface 82B is that one of the two opposite side surfaces closest to the center 86 of the wafer So utilized, the half-block nozzle provides greater uniformity of dispensed fluid on the wafer than the pnor art bv providing greater amounts of fluid into annular regions of the wafer with greater area An alternative version of this embodiment of the half-block nozzle provides an even closer match between the amount of fluid dispensed onto the annular regions of the wafer and the area of those regions The extent to which the desired uniform dispensing of fluid onto a wafer results can be measured by defining concentnc annuluses using physical distances determined by the structure of the nozzle Fig 14 depicts the half- block nozzle 72 again, but this time with concentnc annuluses 90A-C drawn In this version, although depicted as circles with equidistant centers e g 88C.D, it will be appreciated by those of skill in the art that more generally, the onfices 81C are merely two-dimensional with a vanety of possible non-circular shapes and have an approximate center, but may not have equidistant centers The center of the concentnc annuluses is an end point 94 The end point is a pomt on the bottom surface lying anywhere between the center of the central onfice 81A and the linear intersection 96 of the bottom and the first side surface, preferably along a line 98 connecting the center of the central circle and the center of that linear intersection To assist n defining the concentnc annuluses. the halfway points 91 A. 9 IB between the centers of adjacent onfices, e g 88B, 88C. 88D are employed, whether or not those halfway points are points within, on. or outside the nozzle To further assist the definmg of the concentnc annuluses, a flow circle with a penmeter 93 is defined by a center at the end point 94 and by a radius at least substantially equal in length to the distance from the end point to the furthest possible pomt 95 or pomts from the end pomt yet lying on an onfice (that onfice bemg called a penmeter onfice 8 ID) Except for the outermost concentric annulus or penmeter annulus 90C, the concentnc annuluses are defined as annuluses within the flow circle, having centers at the end pomt and having inner 100 and outer 102 radiuses (one set of which is depicted), m the plane of the flow circle, defined as the distances, respectively, in length equal to the distances from the end point to two successive halfway pomts 91 A, 9 IB The outermost concentnc annulus is defined in the same way except that its outer penmeter is not defined by an outer radius but by the penmeter 93 of the flow circle Finally, m the middle of. and withm. the flow circle and inside the concentnc annuluses is a central circle 104 corresponding to the central orifice 81 A The central circle is defined by a center at the end point 94 and a radius (not depicted), in the plane of the flow circle, m length equal to the distance from the end point to the halfway point 91C closest to the end point Each of the concentnc annuluses corresponds to an onfice. the penmeter annulus 90C coπespondtng to the penmeter onfice 8 ID and the other concentnc annuluses coπesponding to the onfice between the two halfway pomts which define the radii of these other concentnc annuluses For example concentnc annulus 90B coπesponds to onfice 81 C The measurement of uniform dispensing of fluid onto a wafer is accomplished by measunng the volume of fluid flow per unit time through each onfice and compaπng that volume to the area of the coπespondmg concentric annulus. or, m the case of the central orifice, to the area of the central circle The areas of the onfices can be selected by methods well known in the art to produce a volume of fluid flow per unit tune dispensed through each onfice proportional to the area of the corresponding concentnc annulus or coπesponding central circle, all with the same proportionality constant The areas of the orifices are one nozzle charactenstic that can produce the proportional vanation in. and affect, the volume of fluid flow just descπbed However, it will be apparent to those of ordinary skill m the art that other charactenstics of the nozzle, including its nozzle tips and small passages, can produce pressure, viscosity and other physical effects with the same proportional vanation A second embodiment of the invention, called the full block (even) nozzle, has the same perspective \ lew. cross-sectional view along the longitudinal axis and transverse cross-sectional view as the half-block nozzle shown m Figs 10. 1 1 and 12 However, the nozzle tip and its orifices, even m number, are arranged on the nozzle in a row whose length is approximately the diameter of the wafer One of the pairs of side surfaces depicted in Fig 1 1 as 82 A.B compnses a first side surface 1 1 18B and a second side surface 1 18 A Fig 15. in bottom plan view lookmg upwards from a rotating wafer 20 below the nozzle, shows the full-block (even) nozzle 1 10 with its row of onfices 1 1 1A-H In this view and this onentation of the nozzle with respect to the wafer, the onfices face the wafer sufficiently to allow fluid dispensed from the onfices to contact the wafer surface with minimal disturbance of the desired dispensing process Although the onfices 1 11 A-H are depicted in Fig 15 as being generally co-planar, circular in shape and equidistant from each other in center-to- center distance, it will be apparent to those of ordinary skill m the art that the bottom may not be planar, the nozzle tip bottom ends in which the onfices are openings may not be co-planar, that the onfice centers 1 13 might not be equidistant from each other, and that the onfice shapes might not be planar or two-dimensional and, even if two-dimensional and planar, might be semi-circular, elliptical, square or hexagonal in shape or of some other shape altogether The nozzle 1 10, when placed over the wafer 20, extends about one wafer diameter between opposite pomts on the penmeter of the wafer For measurement convenience, a middle point 115 is defined as the point halfway between the middle two members 1 1 ID, 11 IE of the row of onfices This middle pomt may be a point within, on or outside the nozzle, dependmg upon the exact geometry of the bottom of the nozzle The charactenstics of the nozzle are selected so that the volume of fluid flow per unit tune through a given onfice exceeds, or is at least substantially equal to. the volume of fluid flow per unit time through any other onfice closer to the middle point 115 than the given onfice As depicted m Fig 15, the diameters of the circular onfices increase along the row beginning with the middle point The increasmg onfice diameter is one nozzle charactenstic that can produce the result of generally increasing, or non-decreasing, volume of fluid flow just descnbed Howev er. it will be apparent to those of ordinary skill in the art that other charactenstics of the nozzle, including its nozzle tips and small passages, can produce pressure, viscosity and other physical effects with the same result More particularly, this embodiment can be employed so that the middle point 115 lies approximately over the center of the wafer (not depicted) So utilized, this embodiment provides greater uniformity of dispensed fluid on the wafer than the pnor art by providmg greater amounts of fluid into annular regions of the w afer with greater area An alternative version of this embodiment of the invention provides an even closer match between the amount of fluid dispensed onto the annular regions of the wafer and the area of those regions The extent to which the desired uniform dispensing of fluid onto a wafer results can be measured bv definmg concentnc annuluses using physical distances determined by the structure of the nozzle Fig 16 depicts the full-block (even) nozzle 1 10 again, but this time with concentric annuluses drawn In this version, although depicted as circles with equidistant centers e g 1 12A. 1 12B. 1 12C, it will be apparent to those of skill in the art that more generally the orifices 1 1 1 A-F are merely two-dimensional with a vaπety of possible non-circular shapes and have an approximate center but may not have equidistant centers The center of the concentric annuluses is the middle point One-half of the row of orifices 1 1 1 A. 1 1 IB. 1 1 lC. a half on one side of the middle point 1 15, is referred to as the half row. and that side is the side closest to the first side surface 1 18B The two penmeter onfices 1 1 IF, 111 A comprise the two orifices furthest from the first side surface 118B and the second side surface 118 A, respectively The onfices are disposed in pairs, e g 1 1 IB and 1 1 IE, on opposite sides of the middle pomt 1 15 so that the center of each onfice in a pair, e g 1 12B, 1 12D is at a substantially equal distance from the middle point 115, each onfice m a pair bemg a partner of the other orifice in that pair To assist in defining the concentric annuluses. the halfway points 120A, 120B between the centers of adjacent onfices, e g 1 11 A. 11 IB in the half row are employed, whether or not those halfway pomts are points within, on, or outside the nozzle To further assist the definmg of the concentnc annuluses. a flow circle with a penmeter 122 is defined by a center at the middle pomt 1 15 and by a radius at least substantially equal in length to the distance from the middle pomt to one of the points the furthest 190 from the middle pomt lymg on the penmeters of the penmeter onfices 11 1 A, 11 IF Except for the outermost concentnc annulus or penmeter annulus 191, the concentnc annuluses are defined as annuluses withm the flow circle, having centers at the middle pomt and having inner and outer radiuses 124, 126. in the plane of the flow circle, defined as the distances, respectively, in length equal to the distances from the middle pomt to two successiv e halfway pomts 120B, 120A The outermost concentric annulus is defined in the same way except that its outer penmeter is not defined by an outer radius but by the penmeter 122 of the flow circle Finally, in the middle of, and within, the flow circle and mside the concentnc annuluses is a middle circle 128 The middle circle is defined by a center at the middle pomt 115 and a radius 124, in the plane of the flow circle, m length equal to the distance from the middle point to the halfway pomt 120B closest to the middle pomt Each of the concentnc annuluses conesponds to an onfice. the perimeter annulus 191 coπesponding to the penmeter onfice 111A in the half row and the other concentnc annuluses coπesponding to the onfice between the two halfway pomts which define the radii of these other concentric annuluses For example concentnc annulus 121 conesponds to onfice 1 1 IB The measurement of uniform dispensing of fluid onto a wafer is accomplished by measunng the volume of fluid flow per unit time through each onfice and its partner and comparmg that volume to the area of the coπesponding concentric annulus, or, in the case of the two onfices closest to the middle point, to the area of the middle circle The areas of the onfices can be selected by methods well known in the art to produce a volume of fluid flow per unit tune dispensed in the aggregate through each onfice (other than the two onfices closest to the middle pomt) and its partner proportional to the area of the coπesponding concentnc annulus. all with the same proportionality constant, and dispensed in the aggregate through the two onfices closest to the middle part proportional to the area of the middle circle with such proportionality constant The areas of the onfices are one nozzle characteristic that can produce the proportional vanation in, and affect, the volume of fluid flow just descπbed However, it will be apparent to those of ordinary skill m the art that other charactenstics of the nozzle, including its nozzle tips and small passages, can produce pressure. \ iscosity and other physical effects with the same proportional vanation A third embodiment of the invention, called the full block (odd) nozzle, has the same perspective view cross-sectional view along the longitudinal axis and transverse cross-sectional view as the half-block nozzle shown in Figs 10. 1 1 and 12 However, the nozzle tip and its orifices, odd in number, are aπanged on the nozzle m a row whose length is approximately the diameter of the wafer One of the pairs of side surfaces depicted in Fig 1 1 as 82A,B comprises a first side surface 139B and a second side surface 139A Fig 17. in bottom plan view looking upwards from a rotating wafer below the nozzle, shows the full- block (odd ) nozzle 130 with its row of onfices 131 A-G In this view and this onentation of the nozzle with respect to the wafer, the onfices face the wafer sufficiently to allow fluid dispensed from the onfices to contact the wafer surface with minimal disturbance of the desired dispensing process. Although the onfices 131 A-G are depicted m Fig 16 as being generally co-planar, circular in shape and equidistant from each other m center-to- center distance, it will be apparent to those of ordinary skill in the art that the bottom may not be planar, the nozzle tip bottom ends in which the onfices are openings may not be co-planar, that the onfice centers 133 might not be equidistant from each other, and that the onfice shapes might not be planar or two-dimensional and, even if two-dimensional and planar, might be semi-circular, elliptical, square or hexagonal m shape or of some other shape altogether. The nozzle 130. when placed over the wafer 20, extends about one wafer diameter between opposite pomts on the penmeter of the wafer For measurement convenience, a middle onfice 13 ID is defined as the middle member of the row of onfices The charactenstics of the nozzle are selected so that the volume of fluid flow per unit time through a given onfice exceeds, or is at least substantially equal to, the volume of fluid flow per unit time through any other onfice closer to the middle onfice 115 than the given onfice. As depicted m Fig 17, the diameters of the circular onfices mcrease along the row beginning with the middle onfice. The increasing onfice diameter is one nozzle charactenstic that can produce the result of generally mcreasing, or non-decreasmg, volume of fluid flow just descπbed However, it will be apparent to those of ordinary skill in the art that other charactenstics of the nozzle, including its nozzle tips and small passages, can produce pressure, viscosity and other physical effects with the same result More particularly, this embodiment can be employed so that the middle onfice 13 ID lies approximately over the center of the wafer (not depicted). So utilized, this embodiment provides greater uniformity of dispensed fluid on the wafer than the pnor art by providing greater amounts of fluid into annular regions of the wafer with greater area An alternative version of this embodiment of the mvention provides an even closer match between the amount of fluid dispensed onto the annular regions of the wafer and the area of those regions The extent to which the desired uniform dispensing of fluid onto a wafer results can be measured by definmg concentnc annuluses using physical distances determined by the structure of the nozzle. Fig 18 depicts the full-block (odd) nozzle 130 again, but this time with concentric annuluses drawn. In this version, although depicted as circles with equidistant centers, e.g., 13 IG, 13 IF, 13 IE. it will be apparent to those of skill in the art that more generally the orifices 131 A-G are merely two-dimensional with a vanety of possible non-circular shapes and have an approximate center but may not have equidistant centers The center of the concentnc annuluses is the center 137 of middle onfice 13 ID The middle orifice 13 ID. together with one-half 13 IE. F. G of the row of other orifices, a half on one side of the middle onfice. is refeπed to as the half row, and that side is the side closest to the first side surface 139B The two perimeter orifices 131 A 13 IG compπse the two orifices furthest from the first side surface 139B and the second side surface 139A respectively The orifices other than the middle orifice are disposed in pairs on opposite sides of the middle onfice 13 ID so that the center of each onfice in a pair, e g , 132A. B is at a substantially equal distance from the center 137 of the middle orifice, each onfice in a pair being a partner of the other onfice m that pair To assist in defining the concentric annuluses, the halfway points, e g , 134A, B between the centers of adjacent onfices in the half row are employed, whether or not those halfway pomts are points withm on, or outside the nozzle To further assist the defining of the concentnc annuluses, a flow circle with a penmeter 136 is defined by a center at the center 137 of the middle orifice and by a radius at least substantially equal in length to the distance from the center of the middle onfice to one of the points the furthest 138 from such center lymg on the penmeters of the penmeter onfices 13 IG. 131A Except for the outermost concentnc annulus or penmeter annulus 140, the concentnc annuluses are defined as annuluses withm the flow circle, having centers at the center 137 of the middle onfice and havmg inner and outer radiuses, e g , 142A, B, in the plane of the flow circle, defined as the distances, respectively, in length equal to the distances from the center of the middle onfice to two successive halfway pomts 134B, A The outermost concentnc annulus is defined m the same way except that its outer penmeter is not defined by an outer radius but by the penmeter 136 of the flow circle Finally, in the middle of, and withm. the flow circle and inside the concentnc annuluses is a middle circle 144 The middle circle is defined by a center at the center 137 of the middle onfice and a radius, m the plane of the flow circle, in length equal to the distance from the center of the middle orifice to the halfway point 134C closest to the middle onfice Each of the concentnc annuluses coπesponds to an onfice, the penmeter annulus 140 coπespondmg to the penmeter onfice 13 IG in the half row and the other concentnc annuluses coπesponding to the onfice between the two halfway pomts which define the radii of these other concentnc annuluses For example concentnc annulus 146 coπesponds to onfice 13 IF The measurement of uniform dispensing of fluid onto a wafer is accomplished by measunng the volume of fluid flow per unit tune through each onfice and its partner and companng that volume to the area of the coπesponding concentnc annulus, or, m the case of the middle onfice, to the area of the middle circle The areas of the onfices can be selected by methods well known m the art to produce a volume of fluid flow per unit time dispensed in the aggregate through each onfice (other than the middle onfice) and its partner, proportional to the area of the coπespondmg concentnc annulus, all with the same proportionality constant, and dispensed through the middle onfice proportional to the area of the middle circle with such proportionality constant The areas of the onfices are one nozzle charactenstic that can produce the proportional vanation in, and affect, the volume of fluid flow just descnbed However, it will be apparent to those of ordinary skill in the art that other charactenstics of the nozzle, including its nozzle tips and small passages, can produce pressure viscosity and other physical effects with the same proportional vanation Fig 19 depicts a perspective view of a fourth and prefeπed embodiment of the invention known as a wedge nozzle 150 The nozzle is a generally wedge-shaped vessel with a total surface, a top surface 151. a bottom 153. a first side surface 155, a second side surface 157, and a very small middle side surface 159 The bottom has a penmeter edge 152, a first side edge 154 a second side edge 156 and a very small middle side edge 158 In a more preferable embodiment, the penmeter is arc-shaped and the small middle side edge 158 is substantially a point Of course vanations in this general shape will be readilv apparent to those of ordinarv skill Fig 20 a depicts a cross-sectional view of the prefeπed embodiment along an axis 160 connecting the middle side edge 158 and a point on the perimeter edge 152 and perpendicular to the top surface 151 of this embodiment This view shows the mtenor 161 serving as a liquid reservoir The nozzle's top surface has one or more inlet fittings 163 A. B for attachment to a fluid supply tube 165 A, B, a support 167 for connection to an external apparatus (not depicted) to support the nozzle, and an outlet fitting 169 for attachment to a gas outlet tube Nevertheless, it will be apparent to those of ordinary skill in the art that these items shown on the top surface may or may not be present in the numbers, or in the locations on the nozzle, or in fact may be entirely absent The bottom of the nozzle has portions downwardly projectmg called nozzle tips 262A, B, C, D, E, F, G, H with a multiplicity of openmgs or onfices 264A, B, C, D, E, F, G, H out of which the fluid is dispensed With the exception of the nozzle tips, the bottom is generally planar Again, it will be apparent to those of ordinary skill m the art that the onfices might be disposed on a bottom that has no nozzle tips Fig 21 depicts a transverse cross-section of the wedge nozzle 150 perpendicular to the longitudinal axis 160 and to the top surface 151 The figure shows several onfices 362A-F, possibly in several different arcs (descπbed below), in fluid communication with the vessel's mtenor 161 through slits, e g , 364, in the nozzle tips and small passages, e g , 366. in the bottom wall 368 of the interior Fig 22, in bottom plan view looking upwards from a rotatmg wafer 20 below the nozzle, shows the wedge nozzle 150 with its arc-shaped rows of onfices, e g , 164A-E The bottom plan view depicts a reference point 170 situated on or m proximity to the bottom 153 and lymg on a reference lme (not shown) generally perpendicular to the bottom 153 A plurality of non-mtersecting arcs 171A-E are shown, each with a center lymg substantially on the reference line For simplicity of depiction, the centers of the arc are shown at only one point on the reference line, the reference point 170 The arcs have a substantially circular shape and are defined by an arc radius, e g , 173 A-C The onfices and their nozzle tιps(not shown in FIG 22) are depicted as disposed substantially along the arcs and it is implicit in the figure that the nozzle tips themselves also have this arc-like contour, with each orifice on a specific arc regarded as coπesponding to that specific arc Nevertheless, it will be apparent to one of skill in the art that the onfices and their nozzle tips can be disposed along only one or a small number of arcs or. for that matter, in patterns other than along arcs In fact, it is apparent to one of skill in the art that there could be an individual nozzle tip for each onfice In this bottom plan view and this onentation of the nozzle with respect to the wafer, the onfices face the wafer sufficiently to allow fluid dispensed from the onfices to contact the wafer surface with minimal disturbance of the desired dispensing process Although the onfices, e g , 164A-E, are depicted in Fig 22 as being generally co-planar, circular in shape with equal diameters (and are so in the most preferable embodiment), and equidistant from each other in center-to-center distance along a given arc, it will be appreciated by those of ordinary skill in the art that the bottom may not be planar, the nozzle tip bottom ends in which the onfices are openings may not be co-planar, that the orifice centers, e g , 175 A, 175B. might not be equidistant from each other, and that the onfice shapes might not be planar or two-dimensional and, even if two- dimensional and planar, might be semi-circular, elliptical, square or hexagonal in shape or of some other shape altogether The wedge nozzle, when its small middle side edge 158 is placed over the wafer's center 177. covers an approximately arc-shaped segment of the wafer The characteristics of the nozzle are selected so that the aggregate volume of fluid flow per unit time through the onfices coπesponding to one arc, e g , 171C. defined by its arc radius is greater than or substantially equal to such fluid flow through the orifices coπesponding to another arc. e g , 171 B. with a smaller arc radius As depicted in Fig 22. the numbers of the onfices increase along the rows beginning with the row 171 A closest to the reference point 170 The increasing onfice numbers, and coπesponding increase in aggregate area of the orifices along the rows, are one nozzle charactenstic that can produce the result of generally increasing, or non- decreasing, olume of fluid flow just descnbed and that can affect that volume of fluid flow However, it will be apparent to those of ordinary skill in the art that other characteπstics of the nozzle, including its nozzle tips and small passages, can produce pressure, viscosity and other physical effects with the same result More particularly, this embodiment can be employed so that the small middle edge 158 is placed over the center 177 of the wafer So utilized, the wedge nozzle provides greater uniformity of dispensed fluid on the wafer than the pnor art by providing greater amounts of fluid into annular regions of the wafer with greater area A more preferable embodiment of the wedge nozzle provides an even closer match between the amount of fluid dispensed onto the annular regions of the wafer and the area of those regions The extent to which the desired uniform dispensing of fluid onto a wafer results can be measured by defining concentric annuluses lying within a circle using physical distances determined by the structure of the nozzle This embodiment applies only when there are two or more arcs The description that will be provided applies to the case when there are three or more arcs The modification of this discussion for application to nozzles with two arcs will be apparent to one of skill m the art, but will nonetheless be bnefly discussed below Fig 23 depicts the wedge nozzle 150 again in a fashion similar to Fig 22, but this time with concentnc annuluses formed by halfway circles drawn with dashed lmes In this embodiment, although depicted as circles with equidistant centers, e g , 175 A, 175B, along a given arc, it will be apparent to those of skill m the art that in a less preferable embodiment the onfices, e g , 164A-E, can be merely two-dimensional with a vanety of possible non-circular shapes, but with an approximate center, and along a given arc may not have equidistant centers In addition, m the more preferable embodiment, the penmeter edge is arc-shaped, the middle side edge is substantially a point and the reference point is situated at or in proximity to the middle side edge To assist in defining the concentnc annuluses, several geometnc concepts are defined a penmeter curve 171E as the arc having the longest arc radius, and a central curve 171 A as the arc closest to the reference point 170 In addition, a flow circle radius 179 is defined as the distance greater than or substantially equal to the distance from the reference point 170 to one of the points 177 furthest from the reference point of all of the points on the orifices coπesponding to the penmeter curve 17 IE With that definition, a flow circle 172 is defined by a radius equal to the flow circle radius and a center at the reference point Several additional geometnc concepts are defined as well Two arcs, e g , 171 A. B, are said to be adjacent when they are defined respectively by two arc radiuses 173A,B of successively greater length An arc tnplet compnses three arcs, e g , 171A,B,C, defined respectively by three arc radiuses 173A,B,C of successively greater length The inside arcs of the arcs of the arc triplet are the two arcs 171 A,B of the arc triplet with the smallest two arc radiuses, while the outside arcs of the arc tnplet are the two arcs 171B,C with the largest two arc radiuses The middle arc of the arc triplet is the arc 17 IB with the arc radius of length between the lengths of the other two arc radiuses m the arc tnplet Finally, a halfway circle, e g , 174B, is defined as a substantially circular shape within the flow circle having a radius 180A substantially halfway in length between the lengths ol two arc radiuses 173B.C, defining any adjacent arcs, e g 171B.C Now the defining characteristics of the concentric annuluses can be laid out An inner annular penmeter 174B compnses that halfway circle 174B of any two adjacent halfway circles, e g 174B.C, which is closer to the reference point 170 The inner annular perimeter 174B is said to coπespond to that arc 171 C which is the middle arc of that arc tnplet 171B.C.D whose two inside arcs 171B,C define that closer halfwav circle 174B Conversely, an outer annular perimeter 174C compnses that halfway circle 174C of any two adjacent halfway circles, e g , 174B.C, which is further from the reference point The outer annular penmeter 174C coπespondmg to that arc 171C which is the middle arc of that tnplet 17 IB. CD whose two outside arcs 171C,D define that further halfway circle 174C However, at the peπphery, the inner final penmeter 174D is the halfway circle furthest from the reference point, while the outer final perimeter 172 is the penmeter of the flow circle At this point the concentric annuluses themselves can be descnbed An mtenor annulus. e g , 181, is an annulus withm the flow circle defined by an inner annular penmeter , e g , 174B, coπespondmg to an arc 171C, and the outer annular penmeter 174C, coπesponding to that arc The mtenor annulus, e g , 181 is deemed to coπespond to that arc 171C On the other hand, the penmeter annulus 183 is an annulus withm the flow circle 172 defined by the inner final penmeter 174D and the outer final penmeter 172 The penmeter annulus is deemed to coπespond to the perimeter curve 17 IE Putting together these two groups of annuluses, the concentnc annuluses coπesponding to an arc are defined as the penmeter annulus 183 coπesponding to the penmeter curve (which is also an arc) and any mtenor annulus. e g , 181, coπespondmg to any arc, e g , 171 C, other than the penmeter curve 17 IE Together with the concentnc annuluses. a central circle 185 is employed for measurement That circle lies withm the flow circle and is defined by a penmeter identical to the halfway circle 174 A closest to the reference pomt 120 and by a center at the reference point This central circle is employed in connection with the central curve 171 A The measurement of uniform dispensing of fluid onto a wafer is accomplished by measunng the combmed volume of fluid flow per unit time through the onfices on an arc. e g , 171C. and companng that volume to the area of the concentnc annulus, e g , 181. coπesponding to that arc (for all arcs other than the central curve), or. in the case of that arc 171 A which is the central curve to the area of the central circle 185 The areas of the onfices can be selected by methods well known in the art to produce a combined volume of fluid flow per unit time dispensed through each orifice on an arc (other than the central curve) proportional to the area of the coπesponding concentnc annulus or dispensed through each onfice on the central curve proportional to the area of the coπesponding central circle, all with the same proportionality constant For example, if the onfices on the nozzle are all of equal area, the number of onfices on each arc will be selected to produce the required proportional volume of fluid flow As mentioned above, the more preferable embodiment has been descnbed for cases in which there are three or more arcs By modifying the descπption in one major respect, the descπption would apply to the case of two arcs This modification consists in eliminating the notion of the mtenor annulus The measurements of fluid flow are then undertaken only for the penmeter annulus and the central circle The areas and numbers of the onfices on each of the two arcs are then selected to produce the same proportionality achieved m the case where there are at least three arcs The areas or numbers of the onfices are one nozzle charactenstic that can produce the proportional vanation in. and affect the \ olume of fluid flow just described However, it will be apparent to those ol ordinary skill m the art that other characteristics of the nozzle including its nozzle tips and small passages can produce pressure, viscosity and other physical effects with the same proportional vanation Fig 24 depicts a perspective view of a fifth embodiment of the mvention known as a general-purpose (full) nozzle 350 This embodiment is a vessel with a longitudinal axis 370. a total surface, a top surface 351 a bottom 353, a first side surface 305A. and a second side surface 305B Fig 24 depicts the intersections of vanous surfaces as linear Other contours for those intersections and other vaπations in the general shape depicted will be readily apparent to those of ordinary skill in the art Fig 25 depicts a cross-sectional view along the longitudinal axis 370 and perpendicular to the top surface 351 of this embodiment of the mvention showing the mtenor 378 serving as a liquid reservoir The general-purpose (full) nozzle's top surface 351 has one or more mlet fittings 363A B for attachment to a fluid supply tube 367A, B, a support 367 for connection to an external apparatus (not depicted) to support the nozzle, and an outlet fitting 369 for attachment to a gas outlet tube Nevertheless, it will be apparent to those of ordmary skill in the art that these items shown on the top surface may or may not be present m the numbers or in the locations on the nozzle, or m fact may be entirely absent The bottom of the nozzle has portions downwardly projecting called nozzle tips 372 A. B, C with a multiplicity of openings or onfices 384A, B, C out of which the fluid is dispensed Agam. it will be apparent to those of ordmary skill m the art that the orifices might be disposed on a bottom that has no nozzle tip Fig 26 depicts a transverse cross-section of the general-purpose (full) nozzle 350 perpendicular to the longitudinal axis 370 and to the top surface 351 of this embodiment The figure shows several onfices 394A. B. C, D in fluid communication with the vessel's mtenor 378 through slits, e g , 392, m the nozzle tips and small passages e g . 386 in the bottom wall 388 of the mtenor Fig 27 in bottom plan view looking upwards from a rotating wafer 280 below the nozzle 290, shows the general-purpose (full) nozzle 290 and orifices, e g , 310C1 310C2. 310C3 In this view and this onentation of the nozzle with respect to the wafer, the orifices face the wafer sufficiently to allow fluid dispensed from the onfices to contact the wafer surface with minimal disturbance of the desired dispensing process Although the onfices. e g , 310C1. 310C2. 310C3, are depicted in Fig 27 as being generally co-planar and circular m shape, it will be apparent to those of ordinary skill in the art that the bottom may not be planar and the nozzle tip bottom ends in which the onfices are openmgs may not be co-planar and that the onfice shapes might not be planar or two-dimensional and, even if two-dimensional and planar, might be semi-circular, elliptical square or hexagonal in shape or of some other shape altogether The nozzle 290 when placed over the wafer 280 extends about one wafer diameter between opposite points on the penmeter of the wafer 280 For measurement convenience, several geometncal features of the bottom are defined The bottom is subdivided mto two or more non-overlapping portions called bottom subregions 310A.B,C,D One of these is called the first penmeter subregion 310A which is one of the one or more bottom subregions closest to the first side surface 305A, while the second perimeter subregion 310D is one of the one or more bottom subregions closest to the second side surface 305B Each orifice is wholly contained with one of the bottom subregions and each bottom subregion contains at least one onfice In addition to bottom subregions. special points are isolated The first perimeter point 315A is one of the one or more points on the first penmeter subregion closest to the first side surface 305A. while the second perimeter point 315B is one of the one or more pomts on the second perimeter subregion closest to the second side surface 305B The halfway point 320 is a point substantially halfway between the first perimeter point and the second penmeter point while the middle pomt 330 is one of the one or more pomts on the bottom closest to the halfway point This halfway pomt may be a pomt withm, on or outside the nozzle 290, dependmg upon the exact geometry of the bottom of the nozzle while the middle point is on the nozzle bottom The characteπstics of the nozzle are selected so that the aggregate volume of fluid flow per unit time through all the onfices in a given bottom subregion, e g , 310B, are greater than or substantially equal to such flow through all the onfices in any other bottom subregion, e g , 310C, closer to the middle point 330 than the given bottom subregion As depicted in Fig 27, the numbers of the circular onfices are generally larger m bottom subregions further from the middle point This increasing number of orifices is one nozzle charactenstic that can produce the result of generally increasing, or non-decreasmg, volume of fluid flow just descπbed However, it will be apparent to those of ordmary skill in the art that other charactenstics of the nozzle, mcludmg its nozzle tips and small passages as well as the diameters of the onfices. can produce pressure, viscosity and other physical effects with the same result More particularly, this embodiment can be employed so that the middle point 330 lies approximately over the center of the wafer (not depicted) So utilized, this embodiment provides greater uniformity of dispensed fluid on the wafer than the pnor art by providmg greater amounts of fluid into annular regions of the wafer with greater area An alternative version of this embodiment of the invention provides an even closer match between the amount of fluid dispensed onto the annular regions of the wafer and the area of those regions The extent to which the desired uniform dispensing of fluid onto a wafer results can be measured by defining concentnc annuluses using physical distances determined by the structure of the nozzle Fig 28 depicts the general-purpose (full) nozzle 290 again, but this time with a vanety of concentnc annuluses, e g , 365P-T, drawn In this version, although depicted as circles, it will be appreciated by those of skill in the art that more generally the onfices. e g , 310C1. 310C2, 310C3. are merely two-dimensional with a vanety ofpossible non-circular shapes and have an approximate center The center of the concentnc annuluses is the middle pomt 330 To assist in defining the concentnc annuluses, a long distance, e g , 310BL, for each bottom subregion is defined as the distance from the middle point to one 31 OBF of that one or more points on the penmeter 31 OBF of that subregion which are furthest from the middle point Similarly, a short distance, e g , 310BS, for each bottom subregion is defined as the distance from the middle point to one 310BC of that one or more points on the penmeter of that subregion which are closest to the middle point To further assist the defining of the concentnc annuluses, a flow circle 360 is defined as the circle with the middle point as its center and having a radius 361 greater than or substantially equal to the long distance 310AL for the first penmeter subregion Defining the concentnc circles is more difficult for this embodiment than the earlier ones due to possible overlap of geometric areas The defining process has three steps First a "concentnc annulus" is defined as an annulus (e g , the area enclosed by inner penmeter 320BI and outer penmeter 320BO which is a combination of areas 365R.S in the flow circle) with a center at the middle point, with an outer radius equal to the long distance 310BL for a bottom subregion. e g , 310B. not containing the middle pomt 330, and with an inner radius equal to the short distance 310BS for that bottom subregion The annulus is said to coπespond to that bottom subregion The special case where there is a bottom subregion containing the middle point will be descnbed below Second, a "simple annulus" is defined as an annulus of the flow circle comprising both (l) any group of two or more concentnc annuluses, each of which contains, is contained m (area 365Q is contained in the combmation of areas 365Q,R), is identical to, or substantially overlaps (the combination of areas 365Q,R overlaps the combination of areas 365R.S) at least one other concentnc annulus within such group, as well as (n) any one concentric annulus (area 365T) not containing, not contained in, not identical to, and not substantially overlappmg any other concentric annulus Third, a "bottom simple subregion" is defined as any group of one 3 IOC or more (310A,B,D) bottom subregions coπesponding, respectively, to the one (the area 365T) or more (the multiple concentnc annuluses compnsmg the area 365Q as one concentric annulus. the areas 365Q,R, in combination as another concentnc annulus. and the areas 365R.S in combmation as yet another concentnc annulus) concentnc annuluses which together compnse a simple annulus That bottom simple subregion is said to coπespond to that simple annulus Thus, the bottom simple subregion 31 OA.B.D coπesponds to the simple annulus determined by radii 31 OAL and 310BS. while the bottom simple subregion 365T coπesponds to the simple annulus 365T determined by radii 310CS and 310CL The measurement of uniform dispensing of fluid onto a wafer is accomplished by measunng the combined volume of fluid flow per unit time through the onfices, e g , 365C1,2,3, in each bottom simple subregion, e.g , 3 IOC. and companng that volume to the area of the coπespondmg simple annulus 365T The areas of the onfices can be selected by methods well known in the art to produce a volume of fluid flow per unit tune dispensed in the aggregate through the onfices m each bottom simple subregion proportional to the area of the simple annulus. all with the same proportionality constant The areas of the onfices are one nozzle charactenstic that can produce the proportional vanation m. and affect, the volume of fluid flow just descnbed However, it will be appreciated by those of ordinary skill in the art that other charactenstics of the nozzle, including its nozzle tips and small passages as well as the diameters of the orifices, can produce pressure, viscosity and other physical effects with the same proportional vanation For the special case depicted m Fig 29 showing the same nozzle as in Fig 28. but with a bottom subregion 310E containmg the middle point 330, no concentnc or simpleannulus or bottom simple subregion is defined by the dimensions of that bottom subregion 310E Instead, a central circle 325 is defined as the circle having a center at the middle point 330 and a radius equal to the long distance 325R of the bottom subregion containing the middle point Assume for the moment (as depicted in Fig 31 ) that no simple annulus substantially overlays the central circle 325 In this special case, the characteπstics of that bottom subregion (e g , its number of onfices or their area) are selected so that the total volume of fluid flow per unit time through the onfices. e g . 310E 1, m that bottom subregion 310E is substantially proportional to the area of the central circle 325 with the same proportionality constant descnbed above for the simple annuluses If the assumption is false for this special bottom subregion 310E and there is a substantially overlappmg simple annulus (not depicted), the central circle 325 must be expanded to define a circle that will include that simple annulus From the foregoing teachings regarding the definitions of simple annulus and bottom simple subregion and their use to account for overlap, it will be apparent to those of skill in the art how to perform that expansion and it will also be apparent to those of skill in the art how to select the area of the onfices m the bottom simple subregions and the characteristics of the bottom subregions defining the expanded central circle all to the end that the same proportionalities of fluid flow to areas are achieved In fact the claims associated with this embodiment descnbe in detail that very expansion and selection process A sixth embodiment of the invention, called the general-purpose (half) nozzle has perspective and cross section views of the general-purpose (half) nozzle substantially identical to those depicted in Fig 's 24, 25, and 26 for the general-purpose (full) nozzle Fig 30. in bottom plan view lookmg upwards from a rotating wafer 480 below the nozzle 490, shows the general-purpose (half) nozzle 490 and orifices, e g , 510C 1 510C2, 510C3 In this view and this onentation of the nozzle with respect to the wafer, the onfices face the wafer sufficiently to allow fluid dispensed from the onfices to contact the wafer surface with minimal disturbance of the desired dispensing process Although the onfices e g , 510C1, 510C2, 510C3, are depicted in Fig 30 as being generally co-planar and circular in shape, it will be appreciated by those of ordinary skill in the art that the bottom may not be planar and the nozzle tip bottom ends m which the onfices are openmgs may not be co-planar and that the onfice shapes might not be planar or two-dimensional and. even if two-dimensional and planar, might be semi-circular, elliptical, square or hexagonal in shape or of some other shape altogether The nozzle 490, when placed over the wafer 480. extends about one water radial length from the center of the wafer (not shown) to the penmeter of the wafer 480 For measurement convenience, several geometncal features of the bottom are defined The bottom is subdivided mto two or more non-overlappmg portions called bottom subregions 510A, B, C, D and one of those is called the first penmeter subregion 510A, which is one of the one or more bottom subregions closest to the first side surface 505 A. while the second penmeter subregion 510D is one of the one or more bottom subregions closest to the second side surface 505B Each onfice is wholly contained within one of the bottom subregions and each bottom subregion contains at least one onfice In addition to the bottom subregions, special points are isolated The first penmeter point 515A is one of the one or more points on the first penmeter subregion closest to the first side surface 505 A The central point 530 lies on the bottom and is one of the one or more points on the second penmeter subregion 510D closest to the second side surface 505B The characteristics of the nozzle are selected so that the aggregate volume of fluid flow per unit time through all the onfices m a given bottom subregion, e g , 510B, are greater than or substantially equal to such flow through all the onfices in any other bottom subregion, e g , 510C, closer to the central point 530 than the given bottom subregion As depicted m Fig 30, the numbers of the circular onfices are generally larger in bottom subregions further from the central point This increasing number of onfices is one nozzle charactenstic that can produce the result of generally increasing, or non-decreasing, volume of fluid flow just descnbed However, it will be appreciated by those of ordinary skill in the art that other charactenstics of the nozzle. including its nozzle tips and small passages as well as the diameters of the orifices, can produce pressure, viscosity and other physical effects with the same result More particularly this embodiment can be employed so that the central pomt 530 lies approximately over the center of the wafer (not depicted) So utilized, this embodiment provides greater uniformity of dispensed fluid on the wafer than the pnor art by providing greater amounts of fluid into annular regions of the wafer with greater area A.n alternative version of this embodiment of the invention provides an even closer match between the amount of fluid dispensed onto the annular regions of the wafer and the area of those regions The extent to which the desired uniform dispensing of fluid onto a wafer results can be measured by definmg concentnc annuluses using physical distances determined by the structure of the nozzle Fig 31 depicts the general-purpose nozzle (half) 490 again, but this time with a variety of concentnc annuluses, e g , 565P-T, drawn In this version, although depicted as circles, it will be appreciated by those of skill in the art that more generally the onfices e g , 510C1. 510C2. 510C3. are merely two-dimensional with a vanety of possible non-circular shapes and have an approximate center The center of the concentnc annuluses is the central point 530 To assist in defining the concentric annuluses. a long distance, e g , 51 OBL, for each bottom subregion is defined as the distance from the central point to one 510BF of that one or more points on the perimeter 510BP of that subregion which are furthest from the central point Similarly, a short distance, e g , 510BS, for each bottom subregion is defined as the distance from the central point to one 51 OBC of that one or more points on the penmeter of that subregion which are closest to the central point To further assist the defining of the concentnc annuluses. a flow circle 560 is defined as the circle with the central pomt as its center and having a radius 561 greater than or substantially equal to the long distance 510AL for the first penmeter subregion Defining the concentnc circles is more difficult for this embodiment than the earlier ones due to possible overlap of geometnc areas The defining process has three steps First a "concentnc annulus" is defined as an annulus (e g , the area enclosed by inner penmeter 520BI and outer penmeter 520BO which is a combination of areas 565R,S in the flow circle) with a center at the central point, with an outer radius equal to the long distance 510BL for a bottom subregion, e g , 510B, not containing the central pomt. and with an inner radius equal to the short distance 510BS for that bottom subregion The annulus is said to coπespond to that bottom subregion The bottom subregion 510D containing the central pomt 530 will be disregarded temporanly Second, a "simple annulus" is defined as an annulus of the flow circle compnsing both (I) any group of two or more concentnc annuluses, each of which contains, is contained m, is identical to, or substantially overlaps (the combination of areas 565Q,R overlaps the combination of areas 565R, S) at least one other concentnc annulus withm such group, as well as (n) any one concentnc annuius area 565T not containing, not contained in. not identical to, and not substantially overlappmg any other concentnc annulus Thud, a "bottom simple subregion" is defined as any group of one 510C or more bottom subregions coπesponding to the one (the area 565T) or more (the multiple concentnc annuluses compnsmg the areas 565Q.R in combination as one concentric annulus and the areas 565R.S in combination as another concentnc annulus) concentnc annuluses which together comprise a simple annulus That bottom simple subregion is said to coπespond to that simple annulus Thus the bottom simple subregion 553 10A,B, coπesponds to the simple annulus determined by radii 510AL and 510BS. while the bottom simple subregion 565T coπesponds to the simple annulus determined by radii 510CS and 510CL The measurement of uniform dispensing of fluid onto a wafer is accomplished by measunng the combined volume of fluid flow per unit time through the orifices, e g . 510C1, 2, 3. in each bottom simple subregion. e g . 510C, and companng that volume to the area of the coπesponding simple annulus 565T The areas of the orifices can be selected by methods well known in the art to produce a volume of fluid flow per unit time dispensed in the aggregate through the orifices in each bottom simple subregion proportional to the area of the simple annulus all with the same proportionality constant The areas of the orifices are one nozzle charactenstic that can produce the proportional vanation in, and affect, the volume of fluid flow just descnbed However, it will be appreciated by those of ordinary skill in the art that other characteristics of the nozzle, mcludmg its nozzle tips and small passages as well as the diameters of the onfices, can produce pressure, viscosity and other physical effects with the same proportional vanation The special bottom subregion 510D contaming the central point 530 was temporanly disregarded No concentnc or simple annulus, or bottom simple subiegion is defined by the dimensions of that bottom subregion 510D Instead, a central circle 525 defined as the circle havmg a center at the central point 530 and a radius equal to the long distance 525R of the bottom subregion containmg the central point Assume for the moment (as depicted in Fig 31 ) that no simple annulus substantially overlays the central circle 525 For this special bottom subregion, the charactenstics of that bottom subregion (e g , its number of onfices or their area) are selected so that the total volume of fluid flow per unit time through the onfices in that bottom subregion 510D is substantially proportional to the area of the central circle 525 with the same proportionality constant descnbed above for the simple annuluses If the assumption is false for this special bottom subregion 510D and there is a substantially overlappmg simple annulus (not depicted), the central circle 525 must be expanded to define a circle that will include that simple annulus From the foregoing teachings regarding the definitions of simple annulus and bottom simple subregion and their use to account for overlap, it will be apparent to those of skill m the art how to perform that expansion and it will also be apparent to those of skill in the art how to select the area of the onfices m the bottom simple subregions and the charactenstics of the bottom subregions definmg the expanded central circle, all to the end that the same proportionalities of fluid flow to areas are achieved In fact, the claims associated with this embodiment descnbe m detail that very expansion and selection process The vaπous embodiments of the invention have many physical characteristics in common, such as the composition of matenals forming the vessel, orifice size and the like, as will be appreciated by those of skill in the art. and those charactenstics will be apparent to those of such skill For example, the height of the block or wedge embodiments will typically be in the approximate range of %"- 1 ' .", the fluid supply also used with the embodiments will typically be in the approximate range of l/8"-l/4" or greater in diameter, the inlet fittmgs will typically be at one end or another of the top surface or on an upper portion of the side surfaces, the onfice diameters will typically be in the approximate range of 1 mm-5 mm, perhaps most effectively at about 5 mm The nozzle tip will have a height m the approximate range of 1 mm-2 mm The arc angle formed by the wedge shape will typically be in the range of approximately 15°-45° The nozzles are generally fabπcated of plastics that are both mechanically stable and resistant to chemical attack, charactenstics well known to those of skill in the art The nozzle is usually fabncated in two monolithic pieces the top surface and the remainder of the nozzle Typically, the nozzle is positioned above the wafer below a distance ranging between 1 mm and 1 cm

Claims: CLAIMS What is claimed is 1 A nozzle for use in applying fluid to a round surface compnsmg a vessel having a total surface and an mtenor, the total surface having a bottom, a top surface, and a pair of opposite side surfaces the pair of side surfaces compnsmg a first side surface and a second side surface, a longitudinal axis connecting the first pair of side surfaces, a row of onfices of even number disposed on the bottom of the vessel m a row substantially parallel to the longitudinal axis, the onfices bemg openings m the total surface, being m fluid communication with the vessel's mtenor, and being configured to permit a flow of the fluid to outside the vessel from the mtenor of the vessel, a middle point substantially halfway between the middle two members of the row of onfices, or a middle onfice being the middle member of the row of onfices, the volume of fluid flow per unit time through each onfice being greater than or substantially equal to such flow through any other orifice closer to the middle pomt than said each onfice 2 A nozzle according to claim 1 , wherem each onfice defines a substantially two-dimensional shape, and the area of each onfice is greater than or substantially equal to the area of any other onfice closer to the middle pomt than said each onfice 3 The nozzle according to claim 2, further comprising a half row mcludmg the onfices between the middle point and the first side surface a halfway point substantially halfway in distance between the centers of adjacent onfices in the half row, each onfice having an approximate center, two perimeter onfices compnsmg the two onfices furthest from the first side surface and the second side surface, respectively, the onfices being disposed in pairs on opposite sides of the middle pomt so that the center of each onfice in a pair is at a substantially equal distance from the middle point, each onfice in a pair being a partner of the other orifice in that pair, a flow circle radius, the flow circle radius being a distance greater than or substantially equal to the distance from the middle point to one of the points furthest from the middle point on the penmeters of the penmeter onfices, a flow circle defined by a radius equal to the flow circle radius and a center at the middle point an inner radius equal to the distance from the middle point to that halfway point of anv two adjacent halfway points which is closer to the middle point the inner radius coπesponding to the onfice between said t o halfway pomts T? an outer radius equal to the distance from the middle point to that halfway point of any two adjacent halfway points which is further from the middle pomt the outer radius coπesponding to the orifice between said two halfway pomts, an inner perimeter radius equal to the distance from the middle point to the halfway point furthest from the middle pomt, an outer penmeter radius equal to the radius of the flow circle, an mtenor annulus withm the flow circle defined by a center at the middle point and by any inner radius coπesponding to an onfice in the half row and any outer radius coπesponding to said onfice, the mtenor annulus coπesponding to said onfice, a penmeter annulus withm the flow circle defined by a center at the middle point and by the inner penmeter radius and the outer penmeter radius, the penmeter annulus coπespondmg to the perimeter onfice in the half row. one or more concentnc annuluses coπesponding to an onfice in the half row, the concentnc annuluses compnsmg the penmeter annulus coπespondmg to the penmeter onfice m the half row and any mtenor annulus coπesponding to any onfice between two halfway points, a middle circle withm the flow circle defined by a radius equal to the distance from the middle point to the halfway point closest to the middle point and by a center at the middle point. the charactenstics of the nozzle being such that the total volume of fluid flow per unit time through the onfice coπespondmg to a concentnc annulus and through the orifice which is the partner of such concentnc annulus 's coπespondmg onfice is substantially proportional to the area of such concentnc annulus with a proportionality constant, and the charactenstics of the nozzle bemg such that the total volume of fluid flow per unit tune through the two onfices closest to the middle point is substantially proportional to the area of the middle circle with said proportionality constant 4 The nozzle according to claim 3. wherein the charactenstics of the nozzle affectmg the total volume of fluid flow per unit time through the onfice coπesponding to a concentric annulus and through the onfice which is the partner of such concentnc annulus's coπespondmg onfice are the areas of the onfices, and the charactenstics of the nozzle affectmg the total volume of fluid flow per unit time through the two onfices closest to the middle pomt are the areas of said onfices 5 The nozzle according to claim 4, further comprising one or more inlet fittings disposed on the top surface in fluid communication with the vessel's interior and configured to receive fluid from outside the vessel, and a support disposed on the top surface and adapted for attachment external to the vessel to physically support the vessel 6 The nozzle according to claim 4. further compnsmg one or more inlet fittings disposed on the total surface other than on the top surface, such one or more inlet fittings being in fluid communication with the vessel's mtenor and configured to receive fluid from outside the vessel, and a support disposed on the top surface and adapted for attachment external to the vessel to physically support the vessel 7 The nozzle accordmg to claim 4, wherein the center-to-center distance between adjacent onfices in the row is substantially identical for all onfices 8 The nozzle according to claim 4 wherein the onfices are approximately circular m shape, and the round surface is a semiconductor wafer surface 9 A nozzle for use in applying fluid to a round surface compnsmg a vessel having a total surface and an mtenor, the total surface having a bottom, a top surface, and a pair of opposite side surfaces, the pau of side surfaces compnsmg a first side surface and a second side surface, a longitudinal axis connecting the first pair of side surfaces, a row of onfices disposed on the bottom of the vessel in a row substantially parallel to the longitudinal axis, the onfices bemg openmgs m the total surface, bemg m fluid communication with the vessel's mtenor, and bemg configured to permit a flow of the fluid to outside the vessel from the mtenor of the vessel, a central onfice compnsmg the onfice closest to the first side surface, the volume of fluid flow per unit tune through each onfice being greater than or substantially equal to such flow through any other onfice closer to the central onfice than said each onfice 10 A nozzle for use in applying fluid to a round surface compnsmg a vessel having a total surface and an mtenor, the total surface having a top surface and a bottom. a plurality of onfices disposed on the bottom of the vessel, the orifices being in fluid communication with the vessel's mtenor and being configured to permit a flow of the fluid to outside the vessel from the mtenor of the vessel, one or more arcs substantially circular in shape, and the onfices being disposed substantially along the one or more arcs, the one or more onfices substantially disposed along a specific arc coπesponding to such specific arc

Inventors: PIKE CHRISTOPHER LEE, PIKE, CHRISTOPHER, LEE
Applicants: ADVANCED MICRO DEVICES INC, ADVANCED MICRO DEVICES, INC.
Application year: 2001
Main classification: B05B
IPC codes: B05C11, H01L21