ELECTRONIC DEVICE

Abstract: The electronic device (10) of the invention has a first inductor (12) and a first capacitor (11). The capacitor (11) comprises a first capacitor electrode (21) in a first electrically conducting layer (3), a dielectric (26), and a second capacitor electrode (25) in a second electrically conducting layer (7). The second conductive layer (7) also comprises the first inductor (12) and a via (13). In order to get a resonance frequency with a low tolerance, which can be used at high frequencies in RF equipment, the second capacitor electrode (25) has a contour whose projection onto the first conductive layer (3) lies within the first capacitor electrode (21). In this way the decrease in capacitance of the first capacitor (11) due to etching can be leveled out against the increase in inductance of the first inductor (12) due to the same etching. Preferably, the dielectric (26) has a middle zone (24) and edge zones (22, 23). The dielectric consists of a layer of dielectric material (5) in the middle zone (24). In the edge zones (22, 23), the dielectric consists of the layer of dielectric material (5) and a layer of electrically insulating material (4).

Description: Electronic device The invention relates to an electronic device provided with a first coil and a first capacitor which has a first and a second capacitor electrode and a dielectric, which device compπses a substrate with a first and a second side, at which second side the following are present: - a first electπcally conducting patterned layer in which the first capacitor electrode is defined, a layer of dielectπc matenal which constitutes at least in part the dielectπc, and a second electπcally conducting patterned layer compπsing a first pattern which is substantially the first coil and a second pattern which is at least a portion of the second capacitor electrode. Such a device is known from M. de Samber & L Tegelaers, Philips Journal of Research, 51 (1998), 389-410. The known device is an LC filter. The substrate compπses silicon with an electπcally insulating surface of SιO 2 at the second side The first electπcally conducting layer compπses aluminum. The second electπcally conducting layer may compπse aluminum and gold If this layer compπses aluminum, the layer was provided by means of sputteπng and subsequent etching. A second electπcally conducting patterned layer of gold is manufactured in that a resist layer is provided on a thin gold layer, the resist layer is structured by means of photolithography, and the gold is electrochemically grown. A disadvantage of the known device is that the LC filter has a resonance frequency having a margin of error owing to uncontrollable steps in the manufacture of the device. This margin of error is too great for high-frequency applications of the device. It is a first object of the invention to provide an electronic device of the kind mentioned in the opening paragraph which has a resonance frequency with a margin of error which is sufficiently small for applications of the device at high frequencies This object is achieved that the dielectric has a middle zone and edge zones parallel to the second side of the substrate, the dielectric has a greater dielectric thickness in the edge zones than in the middle zone, and - a perpendicular projection of the second capacitor electrode onto the first electrically conducting layer lies at least partly within the first capacitor electrode. The resonance frequency of the first order is equally strongly dependent on the inductance of a coil present and on the capacitance of a capacitor present. Owing to the greater dielectric thickness - defined as the ratio of the thickness of the layer to the dielectric constant - an increase in the inductance owing to a badly controllable step in the manufacture of the device is compensated by a decrease in the capacitance in that same step in the manufacture. The badly controllable step usually is the patterning of the second electrically conducting layer, because this layer preferably has a comparatively great thickness. This patterning may take place, for example, through wet or dry etching or in a process in which a pattern is electrochemically enhanced. A similar compensation may occur if the inductance decreases: the capacitance then increases. It is necessary in the case of a varying capacitance that a perpendicular projection of the second capacitor electrode onto the first electrically conducting layer lies at least partly within the first capacitor electrode. The perpendicular projection need not lie entirely within the first capacitor electrode; an electrically conducting connection from the second electrode to other parts of the device, such as the first coil, may be present in the second electrically conducting layer. The compensation may also require that the perpendicular projection lies only partly within the first capacitor electrode. Preferably, the ratio of the dielectric thickness in the edge zones to that in the middle zone lies between 3 and 20. The result is that the resonance frequency of the device is not influenced by the error tolerances in the manufacture of the device. The device, which may be not just an LC filter, but also, for example, an integrated circuit provided with a coil and a capacitor, is suitable for application in RF cordless communication products such as mobile telephones which operate at frequencies above 100 MHz. The use of the electronic device according to the invention in a high-frequency application renders it possible to adjust the frequency with a more accurate bandwidth. The high-frequency application thus has a better performance. It is also possible to use very high frequencies, such as frequencies of more than 2000 MHz. In a favorable embodiment the dielectric in the middle : ,one is built up from the layer of dielectric material, and the dielectric in the edge zo les is built up from the layer of dielectric material and a layer of electrically insulating ma.erial. The difference in dielectric thickness between the edge zones and the middle zone can be greater owing to the combination of the layer of dielectric material and the layer of electrically insulating material in the edge zones than if only the layer of dielectric material were present. In another embodiment of the device according to the invention an electrically conducting patterned intermediate layer is present between the layer of dielectric material and the layer of electrically insulating material, in which intermediate layer a planar conductor track is defined which is in electrical contact with the second pattern of the second electrically conducting layer and forms the second capacitor electrode in conjunction with this pattern, and a perpendicular projection of said second pattern onto the intermediate layer lies at least partly outside the conductor track. In this embodiment, the layer of dielectric material is present between the layer of electrically insulating material and the first electrically conducting layer. This has the advantage that the layer of dielectric material and the intermediate layer were deposited consecutively and that the boundary surface between these layers is not influenced by etching means. The intermediate layer serves as an etch stop layer during etching of the layer of electrically insulating material, the latter lying partly on the intermediate layer and partly on the layer of dielectric material. In a specific modification of the above embodiment, the layers of dielectric material and electrically insulating material are locally absent outside the first capacitor, and an electrically conductive connection is present between the first and the second electrically conducting layer. Such a connection is known as a via. The modified embodiment has the advantage that it can be manufactured without additional steps in the manufacturing method. Etching of the layer of electrically insulating material outside the first capacitor, where no intermediate layer is present, at the same time removes the layer of dielectric material. The subsequent deposition of the second electrically conducting layer then completes the via. It is favorable, furthermore, when the second electrically conducting layer has a thickness greater than 5 μm. The losses of the first coil are small in the case of such a thickness. Preferably, the second electπcally conducting layer compπses aluminum. This material is easy to provide by sputteπng and can be patterned through wet etching. Underetching takes place in this case, which causes the capacitance of the first capacitor to decrease, while the inductance of the first coil increases. Furthermore, aluminum has a good conductivity. This is important not only for the coil but also for the conductor tracks or interconnects, which are preferably defined in the second electncally conducting layer. The first electπcally conducting layer compπses, for example, aluminum, doped poly(3,4-ethylenedιoxy)thιophene, polyanihne, nickel, copper, gold, platinum, or doped silicon. The matenal of the substrate may be chosen from a large number of matenals Examples are glass, alumina, polyimide, and silicon Preferably, high-ohmic silicon, which is oxidized to silicon oxide at the second side, is chosen on account of the high-frequency application. Preferably, the dielectπc matenal is a material having a high dielectπc constant. Examples are silicon nitπde, substituted barium titanate and baπum niobate, tantalum oxide, and polyvinylphenol Preferably, the electπcally insulating matenal is a matenal having a low dielectπc constant such as silicon oxide, polyimide, benzocyclobutene The electπcally insulating matenal may possibly be patterned by means of photolithography These and other aspects of the invention will be explained in more detail with reference to drawings, in which Fig. 1 is a diagrammatic side elevation of a first embodiment of the device according to the invention; and Fig. 2 is a diagrammatic side elevation of a second embodiment of the device according to the invention Embodiment 1 The LC filter 10 in Fig 1 has a substrate 1 of A1 2 0 with a fist side 41 and a second side 42, of the substrate 1, there is a first electπcally conducting layer 3 of Ni in which a first capacitor electrode 21 is defined Also present in the first electπcally conducting layer 3 is a conductor track 27 which connects a via 13 - and thereby inter aha a first coil 12 - to a U-shaped electπcal contact 14. A dielectπc 26 lies on the first capacitor electrode of the first capacitor 11. In the edge zones 22 and 23 of the capacitor 11, the dielectric 26 comprises a layer of dielectric material 5 of 0.01 to 0.2 μm thickness and a layer of electrically insulating material 4 of 0.1 to 0.8 μm thickness. The dielectric 26 comprises the layer of dielectric material 5 in the middle zone 24 of the capacitor 11. The dielectric material is BaNdTiO 3 . The electrically insulating material is SiO x , 1 < x < 2. A second electrically conducting layer 7 of Al is present on the layer of dielectric material 5. The second capacitor electrode 25 of the first capacitor 11, the first coil 12, and a vertical interconnect area (via) 13 are defined in this second electrically conducting layer 7, which has a thickness of 4 to 7 μm. The first coil 12 is the first pattern, the second capacitor electrode is the second pattern. A perpendicular projection of the second capacitor electrode 25 onto the first conducting layer 3 lies within the first electrode 21. The fact that underetching occurs during etching of holes 31, 32, and 33 in the second conducting layer 7 causes the surface area of the second capacitor electrode 25 to decrease, and thus also the capacitance value of the first capacitor 11. At the same time, the inductance value of the first coil 12 increases. The second conducting layer 7 is covered with a protective layer 8. Embodiment 2 The electronic device 110 in Fig. 2 comprises a substrate 1 of silicon with a first side 41 and a second side 42. At the second side 42, the substrate 1 is covered with an electrically insulating layer 2 of silicon oxide. A first electrically conducting layer 3 of Al, in which a first capacitor electrode 21 of the first capacitor 11 is defined, is present on the layer 2. A layer of dielectric material 5, which is removed at the area of the via 13, lies on the first electrically conducting layer 3. The layer of dielectric material 5 comprises SiN x , 0.5 < x ≤ 2, and constitutes the dielectric 26 in a middle zone 24 of the capacitor 11. In the edge zones 22 and 23, the dielectric 26 comprises not only the layer of dielectric material 5 but also a layer of electrically insulating material 4, in this example SiO x , 1 < x < 2. An intermediate layer 6 comprising Al lies on the layer of dielectric material 5 and is partly covered by the layer of electrically insulating material 4. A conductor track 28 is defined in the intermediate layer 6. A second pattern 29 of a second electrically conducting layer 7, also comprising Al, is in electrical contact with this conductor track 28. The conductor track 28 and the second pattern 29 together form the second capacitor electrode 25 of the first capacitor 11. The second conducting layer 7 in addition comprises a first coil 12 as a first pattern, a via 13, and an interconnect 14, and is covered with a protective layer 8. A perpendicular projection of the second pattern 29 onto the intermediate layer 6 lies partly outside the conductor track 28. A perpendicular projection of the second pattern 29 onto the first conducting layer 3 lies partly outside the first capacitor electrode 21, i.e. at the area of the interconnect 14. This interconnect 14 is necessary for connecting the second capacitor electrode 25 to other parts of the device 110. Hence, a peφendicular projection of the second capacitor electrode 25 onto the first conducting layer 3 lies at least partly inside the first capacitor electrode 21.

Claims: CLAIMS: 1. An electronic device (10, 110) provided with a first coil (12) and a first capacitor (11) which has a first (21) and a second capacitor electrode (25) and a dielectric (26), which device (10) comprises a substrate (1) with a first (41) and a second side (42), at which second side (42) of the substrate (1) the following layers are present: - a first electrically conducting patterned layer (3) in which the first capacitor electrode (21) is defined, a layer of dielectric material (5) which constitutes at least in part the dielectric (26), and a second electrically conducting patterned layer (7) comprising a first pattern which is substantially the first coil (12) and a second pattern which is at least a portion of the second capacitor electrode (25), characterized in that: the dielectric (26) has a middle zone (24) and edge zones (22, 23) parallel to the second side of the substrate (1), the dielectric (26) has a greater dielectric thickness in the edge zones (22, 23) than in the middle zone (24), and - a peφendicular projection of the second capacitor electrode (25) onto the first electrically conducting layer (3) lies at least partly within the first capacitor electrode (21). 2. An electronic device (10, 110) as claimed in claim 1, characterized in that the dielectric (26) in the middle zone (24) is built up from the layer of dielectric material (5), and the dielectric (26) in the edge zones (22, 23) is built up from the layer of dielectric material (5) and a layer of electrically insulating material (4). 3. An electronic device (110) as claimed in claim 1, characterized in that - an electrically conducting patterned intermediate layer (6) is present between the layer of dielectric material (5) and the layer of electrically insulating material (4), in which intermediate layer (6) a planar conductor track (28) is defined which is in electrical contact with the second pattern (29) of the second electrically conducting layer (7) and forms the second capacitor electrode (25) in conjunction with this pattern (29), and a peφendicular projection of said second pattern (29) onto the intermediate layer (6) lies at least partly outside the conductor track (28). 4. An electronic device (10, 110) as claimed in claim 3, characterized in that the layers of dielectric material (5) and electrically insulating material (4) are locally absent outside the first capacitor (11), and an electrically conductive connection (13) is present between the first (3) and the second electrically conducting layer (7). 5. An electronic device (10, 110) as claimed in claim 1, characterized in that the second electrically conducting layer (7) has a thickness greater than 5 μm. 6. An electronic device (10, 110) as claimed in claim 1, characterized in that the second electrically conducting layer (7) comprises aluminum. 7. The use of the electronic device as claimed in claim 1 (10, 110) for a high- frequency application.

Inventors: PULSFORD NICOLAS J, VAN BEEK JOZEF T M, PULSFORD, NICOLAS, J., VAN BEEK, JOZEF, T., M.
Applicants: KONINKL PHILIPS ELECTRONICS NV, KONINKLIJKE PHILIPS ELECTRONICS N.V.
Application year: 2001
Main classification: H03H7
IPC codes: H01G4, H01L21, H01L27, H03H3, H03H7