Resin composition comprising ethylene-vinyl alcohol copolymer with good interlayer adhesiveness

Abstract: Disclosed are a resin composition comprising an ethylene-vinyl alcohol copolymer and a multi-layered structure comprising the resin composition. The resin composition comprises an ethylene-vinyl alcohol copolymer which contains from 500 to 2000 ppm, in terms of the metal, of an alkali metal salt (A) and from 0.05 to 4.5 µmol /g of a carboxylic acid (B), where the ratio of the content (µmol/g) of a carboxylic acid (b1) having a molecular weight of at least 75 and its salt to the total content (µmol/g) of the carboxylic acid (B) and its salt is at least 0.1; or comprises an ethylene-vinyl alcohol copolymer which contains from 500 to 2000 ppm, in terms of the metal, of an alkali metal salt (A), from 10 to 500 ppm of a carboxylic acid (b2) having a molecular weight of smaller than 75, and from 10 to 500 ppm, in terms of the phosphate radical, of a phosphate compound (C). The resin composition has extremely good adhesiveness, and its moldings have good appearance with few gels and fish eyes. When molded, the resin composition ensures good long-run workability and recyclability, and the recycled resin composition is yellowed little.

Description: The present invention relates to a resin composition comprising an ethylene-vinyl alcohol copolymer (EVOH) and a multi-layered structure comprising the resin composition. The resin composition has extremely good adhesiveness, and its moldings have good appearance with few gels and fish eyes. When molded, the resin composition ensures good long-run workability and recyclability, and the recycled resin composition is yellowed little. EVOH is a useful polymer material having good oxygen barrier properties, oil resistance, antistatic properties and mechanical strength, and is widely used for various wrapping and packaging materials such as films, sheets, containers, etc. As it is generally molded in melt into such moldings, EVOH is required to have good long-run workability in melt molding (that is, it can be molded in good moldings with neither fish eyes nor streaks even in long-run molding lines), and its moldings are required to have good appearance (that is, they have neither gels nor hard spots). Another important matter with EVOH recently discussed is its recyclability. Concretely, in case where wastes of EVOH moldings are recovered and again molded in melt through repeated heat history, they are required to have good recyclability (that is, the recovered EVOH wastes have good moldability) and the recycled EVOH moldings are required to be yellowed little. For producing EVOH moldings with good mechanical strength, moisture resistance and heat-sealability, in general, EVOH is co-extruded together with a substrate of polyolefinic resin or the like to give multi-layered structures in which the EVOH layer and the substrate resin layer are bonded to each other via an adhesive layer therebetween. In those structures, therefore, EVOH is required to have high interlayer adhesiveness. For improving the interlayer adhesiveness of EVOH in such multi-layered structures, known is (1) a method of adding a minor component, especially an alkali metal, to EVOH. On the other hand, disclosed is (2) an EVOH composition containing from 0.0005 to 0.05 % by weight (in terms of the metal) of a salt of a metal of Group 2 of the Periodic Table, from 0.002 to 0.2 % by weight of an acid having a pKa of at least 3.5 and a boiling point of not lower than 180°C, and from 0.01 to 0.2 % by weight of an acid having a pKa of at least 3.5 and a boiling point of not higher than 120°C, and having a specific melt viscosity (JP-A-66262/1989). It is said that the EVOH composition with such additives has improved long-run workability and its moldings have good appearance with neither gels nor fish eyes. Also disclosed is (3) an EVOH resin composition containing, relative to 100 parts by weight of EVOH therein, from 0.001 to 1 parts by weight (in terms of the boron element) of a boron compound, at most 0.05 parts by weight of acetic acid, and from 0.001 to 0.05 parts by weight (in terms of the metal) of a metal acetate (EP 930339, corresponding to JP-A-43571/1999). They say that the EVOH resin composition has good long-run workability in melt molding lines and gives moldings with good appearance and good interlayer adhesiveness. In Comparative Example 5 in the laid-open specification, a resin composition is demonstrated, comprising 100 parts by weight of EVOH, 0.03 parts by weight (in terms of the boron element) of boric acid, 0.009 parts by weight of acetic acid and 0.08 parts by weight (in terms of sodium) of sodium acetate. It is said that, though their interlayer adhesiveness is good, films of the resin composition have many streaks and fish eyes and their appearance is not good, and, in addition, the stretched films are uneven. There is (4) still another related art disclosure of an EVOH resin composition capable of being molded in melt to give moldings with few fish eyes and having good adhesiveness (JP-A-67898/1998). The EVOH resin composition contains from 100 to 5000 ppm, in terms of the free acid, of a hydroxycarboxylic acid and/or its salt, from 50 to 500 ppm, in terms of the metal, of an alkali metal salt, and from 20 to 200 ppm, in terms of the metal, of an alkaline earth metal salt. In the related art disclosures (1) to (4), however, the interlayer adhesiveness of EVOH could not be improved to a satisfactory degree. Therefore, a further improvement of EVOH resins to that effect is desired. In addition, heretofore, adhesive resins for nylons could not be used in multi-layered structures with EVOH, as their adhesiveness to EVOH is poor. Therefore, in cases where EVOH is layered over substrates of polyolefinic resins and the like, it indispensably requires high-performance and expensive adhesive resins for its exclusive use. In that situation, the latitude in choosing the adhesive resins for EVOH is limited. In compositions as used in Comparative Example 5 in the related art disclosure (3), EVOH has good interlayer adhesiveness, but its films are still problematic in their appearance and stretchability. As in the related art disclosures discussed herein, it has heretofore been said that improving both the interlayer adhesiveness and the appearance of EVOH resin compositions and moldings is extremely difficult, and the development of EVOH resin compositions and moldings having both good interlayer adhesiveness and good appearance is strongly desired in the art. For recycling burrs and other wastes that will be inevitable in long-run molding lines for producing EVOH resin moldings. EVOH resin compositions and moldings are required to have not only good interlayer adhesiveness and good appearances but also good long-run workability and recyclability, and, in addition, the recycled compositions and moldings are required to be yellowed little. To meet the requirements, it is desired to provide an improved EVOH resin composition the advantages of which are that it has extremely good adhesiveness and its moldings have good appearance with few gels and fish eyes, and, when molded, it ensures good long-run workability and recyclability and the recycled resin composition is yellowed little. Also, it is desired to provide a multi-layered structure comprising the resin composition. The invention provides an EVOH resin composition containing from 510 to 2000 ppm, in terms of the metal, of an alkali metal salt (A), from 10 to 500 ppm of a carboxylic acid (B) having a molecular weight of smaller than 75 (g/mol) and from 10 to 500 ppm, in terms of the phosphate radical, of a phosphate compound (C) selected from phosphoric acid, phosphorous acid and their salts. In one preferred embodiment of the resin composition, the content (µmol/g in terms of the metal) of the alkali metal salt (A) is from 3 to 20 times the content (µmol/g) of the carboxylic acid (B) having a molecular weight of smaller than 75. In another preferred embodiment thereof, the carboxylic acid (B) having a molecular weight of smaller than 75 is acetic acid. Still another preferred embodiment of the resin composition contains from 50 to 2000 ppm of a boron compound (D). In this embodiment, preferably, the content (µmol/g, in terms of the boron element) of the boron compound (D) is from 2 to 500 times the content (µmol/g) of the carboxylic acid (B). Still another preferred embodiment of the resin composition satisfies the following formula (1): 0.1 < MFRmax/MFR0 < 10 wherein MFRmax indicates a maximum value of MFR (measured at 230°C and under a load of 10.9 kg) of the resin composition having been subjected to heat treatment at 220°C in a nitrogen atmosphere for a period of from 10 to 100 hours, and MFR0 indicates MFR (measured at 230°C and under a load of 10.9 kg) of the resin composition not subjected to the heat treatment. Still another preferred embodiment of the resin composition is for co-extrusion molding. The invention further provides a multi-layered structure that comprises at least one layer of the above-mentioned resin composition. The EVOH resin composition which contains from 510 to 2000 ppm, in terms of the metal, of an alkali metal salt (A), from 10 to 500 ppm of a carboxylic acid (B) having a molecular weight of smaller than 75 g/mol, and from 10 to 500 ppm, in terms of the phosphate radical, of the phosphate compound (C) has extremely good interlayer adhesiveness, and therefore adheres extremely firmly to adhesive resins for EVOH. Accordingly, the resin composition of the invention is favorable to co-extrusion molding but is not limited thereto. It has heretofore been said that the adhesiveness to EVOH of adhesive resins for nylons is poor, and adhesive resins for nylons could not be used in multi-layered structures with EVOH. However, since the resin composition of the invention has extremely good interlayer adhesiveness, it is favorably used even in multi-layered structures with adhesive resins for nylons, especially in co-extruded multi-layered structures using them. With regard to the broadening of the latitude in choosing adhesive resins applicable to the resin composition, the present invention is of great significance. The EVOH for use in the invention is preferably obtained by saponifying an ethylene-vinyl ester copolymer. Particularly preferred is an ethylene content of from 3 to 70 mol%. For ensuring good melt moldability of the resin composition to give moldings with good gas barrier properties, the ethylene content of EVOH preferably falls between 10 and 65 mol%, more preferably between 20 and 65 mol%, most preferably between 25 and 60 mol%. Also preferably, the degree of saponification of the vinyl ester moiety to give the vinyl alcohol moiety in EVOH is at least 80 %, but more preferably at least 95 % to ensure moldings with good gas barrier properties. Even more preferably it is at least 98 %, still more preferably at least 99 %. If the ethylene content of EVOH is larger than 70 mol%, the barrier properties and even the printability of the resin moldings may be poor. If the degree of saponification is smaller than 80 %, the barrier properties, the heat stability and the moisture resistance of the resin moldings may be poor. EVOH having an ethylene content of from 3 to 20 mol% is favorable to applications where water-solubility is required. An aqueous solution of such EVOH is an excellent coating material with good stability capable of being formed into coating films with good barrier properties. One typical example of vinyl esters to be used in producing EVOH is vinyl acetate, which, however, is not limitative. Any other vinyl esters of fatty acids (e.g., vinyl propionate, vinyl pivalate, etc.) are usable herein. EVOH may contain from 0.0002 to 0.2 mol% of a vinylsilane compound serving as a comonomer. The vinylsilane compounds include, for example, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri(β-methoxyethoxy)silane, γ-methacryloxypropylmethoxysilane, etc. Of those, preferred are vinyltrimethoxysilane and vinyltriethoxysilane. The method of producing EVOH for use in the invention is described concretely. To produce it, for example, ethylene is polymerized with vinyl acetate in any desired manner including not only solution polymerization but also suspension polymerization, emulsion polymerization or bulk polymerization and in any desired mode of continuous or batchwise polymerization. One example of batchwise solution polymerization to produce the polymer is described, for which the polymerization condition is as follows. Solvent: Alcohols are preferred, but any other organic solvents (e.g., dimethylsulfoxide, etc.) capable of dissolving ethylene, vinyl esters and ethylene-vinyl ester copolymers may also be used. Alcohols usable herein include methyl alcohol, ethyl alcohol, propyl alcohol, n-butyl alcohol, t-butyl alcohol, etc. Especially preferred is methyl alcohol. Catalyst: Usable are azonitrile-type initiators such as 2,2-azobisisobutyronitrile, 2,2-azobis-(2,4-dimethylvaleronitrile), 2,2-azobis-(4-methoxy-2,4-dimethylvaleronitrile), 2,2-azobis-(2-cyclopropylpropionitrile), etc.; organic peroxide-type initiators such as isobutyryl peroxide, cumyl peroxyneodecanoate, diisopropyl peroxycarbonate, di-n-propyl peroxydicarbonate, t-butyl peroxyneodecanoate, lauroyl peroxide, benzoyl peroxide, t-butyl hydroperoxide, etc. Temperature: 20 to 90°C, preferably 40 to 70°C. Time: 2 to 15 hours, preferably 3 to 11 hours. With continuous polymerization, the average residence time in the polymerization vessel is desirably about the same. Degree of polymerization: 10 to 90 %, preferably 30 to 80 % based on the vinyl ester fed into the reactor. Resin content of the solution after polymerization: 5 to 85 %, preferably 20 to 70 %. Ethylene content of copolymer: Preferably 3 to 70 mol%, more preferably 10 to 65 mol%, even more preferably 20 to 65 mol%, still more preferably 25 to 60 mol%. Except for ethylene and vinyl acetate, any other minor comonomers capable of copolymerizing with them may be present in the polymerization system. The comonomers include, for example, α-olefins such as propylene, isobutylene, α-octene, α-dodecene, etc.; unsaturated acids such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid, etc., and their anhydrides, salts, or mono- or di-alkyl esters, etc.; nitriles such as acrylonitrile, methacrylonitrile, etc.; amides such as acrylamide, methacrylamide, etc.; olefinsulfonic acids such as ethylenesulfonic acid, allylsulfonic acid, methallylsulfonic acid, etc., and their salts; alkyl vinyl ethers, vinyl ketones, N-vinylpyrrolidone, vinyl chloride, vinylidene chloride, etc. After the monomers have been polymerized for a predetermined period of time to give the intended copolymer having a predetermined degree of polymerization, a polymerization inhibitor may be added thereto, if desired. Then, the non-reacted ethylene gas is evaporated away, and the non-reacted vinyl acetate is purged away. To purge the ethylene-vinyl acetate copolymer from the non-reacted vinyl acetate after the removal of ethylene from the copolymer through evaporation, for example, the copolymer solution is continuously run into a column filled with Raschig rings, in the downward direction at a constant flow rate, while a vapor of an organic solvent such as methanol or the like is jetted into the column from its bottom, whereby a mixed vapor of the organic solvent such as methanol or the like and the non-reacted vinyl acetate is run off from the column through its top, and the copolymer solution from which the non-reacted vinyl acetate was removed is taken out of the column through its bottom. An alkali catalyst is added to the copolymer solution from which the non-reacted vinyl acetate was removed, and it saponifies the vinyl acetate moiety of the copolymer. For this, employable is any of continuous or batchwise saponification. The alkali catalyst includes, for example, sodium hydroxide, potassium hydroxide, alkali metal alcoholates, etc. One example of batchwise saponification is described, for which the condition is as follows. Concentration of copolymer solution: 10 to 50 %. Reaction temperature: 30 to 60°C. Amount of catalyst to be used: 0.02 to 0.6 equivalents (based on the vinyl acetate moiety). Time: 1 to 6 hours. The degree of saponification of the saponified copolymer will vary, depending on the use of the copolymer, but is preferably at least 80 % of the vinyl acetate moieties, more preferably at least 95 % thereof, even more preferably at least 98 % thereof, still more preferably at least 99 % thereof. The degree of saponification could be varied in any desired manner by controlling the condition for saponification. After having been thus processed, the resulting ethylene-vinyl alcohol copolymer is optionally but preferably neutralized and then washed to remove the alkali catalyst, by-produced salts and other impurities therefrom. In the EVOH resin composition of the invention, the content of the alkali metal salt (A) falls between 510 and 2000 ppm in terms of the metal. It is important that the content of the alkali metal salt (A) is at least 510 ppm (in terms of the metal). Having the specific constitution, the EVOH resin composition ensures extremely good adhesiveness. The alkali metal salt (A) is not specifically defined, including, for example, sodium salts, potassium salts, etc. The anion of the alkali metal salt (A) is also not specifically defined. Preferred are acetate, phosphate and lactate anions; and more preferred are lactate and acetate anions. If the content of the alkali metal salt (A) in the composition is smaller than 510 ppm, the adhesiveness of the composition is poor. In particular, the adhesiveness to poorly adhesive resins such as those for nylons is poor in co-extrusion molding of the composition. On the other hand, if the content of the alkali metal salt (A) is larger than 2000 ppm, the resin composition will be strongly discolored when it is melted. Preferably, the lowermost limit of the content of the alkali metal salt (A) in the resin composition of the invention is at least 520 ppm, even more preferably at least 530 ppm. On the other hand, the uppermost limit of the content of the alkali metal salt (A) therein is preferably at most 1500 ppm, more preferably at most 1000 ppm, even more preferably at most 750 ppm. The carboxylic acid (B) having a molecular weight of smaller than 75 includes, for example, formic acid, acetic acid, propionic acid, etc. Especially preferred is acetic acid, as it is inexpensive and its acidity is suitable for use herein. The pH of a resin composition containing acetic acid is easy to control. Preferably, the carboxylic acid (B) for use in the invention has a pKa of at least 3.5 at 25°C. Containing a carboxylic acid having a pKa of smaller than 3.5 at 25°C, the pH of the EVOH resin composition will be difficult to control, and, In addition, the discoloration resistance and the interlayer adhesiveness of the resin composition will be poor. As mentioned above, the discoloration resistance of the resin composition is improved, since it contains a carboxylic acid (B); and the interlayer adhesiveness thereof is much improved, since it contains at least 510 ppm of an alkali metal salt (A). However, adding too much of the carboxylic acid (B) to the resin composition will lower the interlayer adhesiveness of the composition; and adding too much of the alkali metal salt (A) will lower the discoloration resistance of the composition. In particular, since the EVOH resin composition of the invention contains a larger amount of an alkali metal salt (A) than ordinary EVOH resin compositions, its moldings would be strongly discolored and would have many gels and fish eyes. By suitably controlling the content of the carboxylic acid (B) in the resin composition to thereby cause the resin composition to have a pH falling within a predetermined range, the resin moldings could be effectively prevented from being discolored and from having gels and fish eyes. In the EVOH resin composition of the invention, the content of the carboxylic acid (B) having a molecular weight of smaller than 75 falls between 10 and 500 ppm. In case where the carboxylic acid (B) having a molecular weight of smaller than 75 therein is acetic acid, its content falls between 0.17 and 8.33 µmol/g. If, in the resin composition, the content of the carboxylic acid (B) having a molecular weight of smaller than 75 is smaller than 10 ppm, the composition will be strongly discolored when it is melted; but if it is larger than 500 ppm, the adhesiveness of the composition to adhesive resins will be poor when the composition is molded through co-extrusion. Preferably, the lowermost limit of the content of the carboxylic acid (B) having a molecular weight of smaller than 75 is at least 30 ppm, more preferably at least 50 ppm. Also preferably, the uppermost limit of the content of the carboxylic acid (B) having a molecular weight of smaller than 75 is at most 300 ppm, more preferably at most 200 ppm, even more preferably at most 150 ppm. In one embodiment of the EVOH resin composition containing from 510 to 2000 ppm, in terms of the metal, of an alkali metal salt (A), from 10 to 500 ppm of a carboxylic acid (B) having a molecular weight of smaller than 75, and from 10 to 500 ppm, in terms of the phosphate radical, of a phosphate compound (C), it is desirable that the content (ppm, in terms of the metal) of the alkali metal salt (A) is from 3 to 20 times the content (ppm) of the carboxylic acid (B) having a molecular weight of smaller than 75. Since the EVOH resin composition of the invention contains a larger amount of an alkali metal salt than ordinary EVOH resin compositions, its moldings would be strongly discolored and would have many gels and fish eyes. By suitably controlling the content of the carboxylic acid (B) having a molecular weight of smaller than 75 in the resin composition to thereby cause the resin composition to have a pH falling within a predetermined range, the resin moldings could be effectively prevented from being discolored and from having gels and fish eyes. Accordingly, in the EVOH resin composition of the invention, the content (µmol/g, in terms of the metal) of the alkali metal salt (A) is preferably at least 4 times the content (ppm) of the carboxylic acid (B) having a molecular weight of smaller than 75, more preferably at least 5 times, even more preferably at least 5.5 times. Also preferably, the content (µmol/g, in terms of the metal) of the alkali metal salt (A) in the resin composition is at most 10 times the content (ppm) of the carboxylic acid (B) having a molecular weight of smaller than 75, more preferably at most 7.5 times. If the content of the alkali metal salt (A) is smaller than 3 times the content of carboxylic acid (B), the adhesiveness of the resin composition especially to adhesive resins for nylons (these have poor adhesiveness to EVOH) may be poor; but if larger than 20 times, the resin composition may be strongly discolored when it is melted. The phosphate compound (C) is selected from phosphoric acid, phosphorous acid and their salts. Any phosphate of any type of primary phosphates, secondary phosphates and tertiary phosphates may be used in the resin composition, and is cation is not specifically defined. Preferred are alkali metal salts and alkaline earth metal salts such as those mentioned above. Above all, especially preferred is any of sodium dihydrogenphosphate, potassium dihydrogenphosphate, disodium hydrogenphosphate or dipotassium hydrogenphosphate as a phosphate compound (C) to be in the resin composition; and more preferred is sodium dihydrogenphosphate or potassium dihydrogenphosphate. The effect of the phosphate compound (C) to solve the problem is especially remarkable when the resin composition is molded in long-run working lines and when the resin moldings are recycled. Preferably, the lowermost limit of the content of the phosphate compound (C) in the resin compositions is at least 50 ppm in terms of the phosphate radical, more preferably at least 70 ppm; and the uppermost limit thereof is preferably at most 300 ppm, more preferably at most 200 ppm. Containing a phosphate compound (C) within the defined range, the EVOH resin composition will be more effectively prevented from being discolored and gelled. If the content of the phosphate compound (C) in the resin composition is smaller than 10 ppm, the resin composition will be strongly discolored when it is molded in melt and the resin moldings will have poor appearance. In particular, the problem with the resin composition is more serious when the composition is subjected to repeated heat history (repeated heat cycles). Accordingly, the recyclability of the resin composition in which the content of the phosphate compound (C) is too small is poor. If, on the contrary, the content of the phosphate compound (C) in the resin composition is larger than 500 ppm, the resin moldings will have many gels and fish eyes and their appearances will be poor. To further improve the long-run workability and the melt moldability of the EVOH resin composition of the invention, a boron compound (D) is preferably added thereto. The EVOH resin composition containing a boron compound (D) can have increased melt viscosity even when EVOH therein has a low degree of polymerization. The advantage of the EVOH resin composition in which EVOH has a low degree of polymerization is that it can be molded into better moldings with fewer gels and fish eyes and it has better long-run workability than ordinary EVOH resin compositions. The reason why the melt viscosity of the EVOH resin composition in which EVOH has a low degree of polymerization is increased by adding a boron compound (D) thereto is not clear. The present inventors have investigated the matter in detail, and have noted that adding a boron compound (D) to EVOH results in further reduction in the adhesiveness of EVOH to adhesive resins having poor adhesiveness to EVOH (for example, to adhesive resins for nylons). Surprisingly, however, it was found that, even when a boron compound (D) is added to the EVOH resin compositions of the invention, the resulting EVOH resin composition thus containing a boron compound (D) could still keep extremely high adhesiveness, and, in addition, adding such a boron compound (D) to the EVOH resin compositions further improves their long-run workability and the melt moldability. The improvement in the adhesiveness of the resin compositions is especially remarkable when a boron compound is added to the resin compositions. In this respect, therefore, the invention is of high significance. The boron compound (D) includes, for example, boric acids, esters of boric acids, salts of boric acids, boron hydrides, etc., but is not limited to them. Concretely, the boric acids include orthoboric acid, metaboric acid, tetraboric acid, etc.; the esters of boric acids include triethyl borate, trimethyl borate, etc.; the salts of boric acids include alkali metal salts and alkaline earth metal salts of various types of boric acids such as those mentioned above, as well as borax, etc. Of those compounds, especially preferred is orthoboric acid (this will be hereinafter referred to as boric acid). The content of the boron compound (D) in the resin composition of the invention preferably falls between 50 and 2000 ppm in terms of the boron element, more preferably between 50 and 1000 ppm. If the content is smaller than 50 ppm, adding such a small amount of a boric acid (D) will be ineffective for improving the long-run workability of the resin composition; but if larger than 2000 ppm, the resin composition will be readily gelled and its moldability will be poor. The reason why adding a boron compound (D) to EVOH lowers the adhesiveness of EVOH is not clear. From the fact that adding a boron compound to an EVOH resin composition in which the content of an alkali metal salt (A) is smaller than 510 ppm in terms of the metal significantly lowers the adhesiveness of the resin composition, it is believed that the boron compound added will retard the effect of the alkali metal salt (A) that improves the adhesiveness of EVOH for some reason. Therefore, in the EVOH resin composition to which a boron compound (D) is added, it is desirable that the lowermost limit of the content of the alkali metal salt (A) is larger than 510 ppm, more preferably at least 520 ppm, still more preferably at least 530 ppm. As mentioned hereinabove, suitably adding a boron compound (D) to the resin composition effectively prevents the resin moldings from being discolored or from having gels and fish eyes; and suitably adding a carboxylic acid (B) thereto improves the discoloration resistance of the composition. However, adding too much carboxylic acid (B) thereto lowers the interlayer adhesiveness of the resin composition and promotes the formation of gels and fish eyes in the resin moldings. Also preferably, an alkaline earth metal salt (E) is added to the EVOH resin composition of the invention. The discoloration resistance of a resin composition containing an alkaline earth metal salt (E) may be lowered to some degree. However, when molded in melt, the resin composition containing an alkaline earth metal salt (E) will be prevented from being degraded under heat, and the amount of the thermally-degraded resin that may deposit around the dies of molding machines can be reduced. The alkaline earth metal salt (E) is not specifically defined, including, for example, magnesium salts, calcium salts, barium salts, beryllium salts, etc. Especially preferred are magnesium salts and calcium salts. The anion of the alkaline earth metal salt (E) is also not specifically defined. Preferred are acetate, phosphate and lactate anions; and more preferred are lactate and acetate anions. Preferably, the content of the alkaline earth metal salt (E) in the resin composition falls between 10 and 200 ppm in terms of the metal, more preferably between 10 and 100 ppm. If the content of the alkaline earth metal salt (E) is smaller than 10 ppm, the effect of the salt to improve the long-run workability of the resin composition may be poor; but if larger than 200 ppm, the resin composition may much discolor when it is melted. Preferably, the melt flow rate (MFR) of EVOH for use in the invention falls between 0.1 and 200 g/10 min, most preferably between 0.2 and 100 g/10 min. The MFR is measured at 190°C and under a load of 2160 g. For EVOH having a melting point of around 190°C or above 190°C, the MFR is measured under a load of 2160 g at different temperatures not lower than its melting point. The data are plotted on a semi-logarithmic graph with the horizontal axis indicating the reciprocal of the absolute temperature and the vertical axis indicating the logarithm of the melt flow rate measured, and the value corresponding to 190°C is extrapolated from the curve of the thus-plotted data. It is desirable that the EVOH resin of the invention satisfies the following formula (1): 0.1 < MFRmax/MFR0 < 10 wherein MFRmax indicates a maximum value of MFR (measured at 230°C and under a load of 10.9 kg) of the resin composition having been subjected to heat treatment at 220°C in a nitrogen atmosphere for a period of from 10 to 100 hours, and MFR0 indicates MFR (measured at 230°C and under a load of 10.9 kg) of the resin composition not subjected to the heat treatment. Preferably, the lowermost limit of the ratio MFRmax/MFR0 is at least 0.5, more preferably at least 0.7. Also preferably the uppermost limit of the ratio MFRmax/MFR0 is at most 8, more preferably at most 5. Satisfying the requirement, the resin composition of the invention can have more improved long-run workability. If the ratio MFRmax/MFR0 is smaller than 0.1, EVOH may gel in the composition and the resin moldings may have fish eyes; but if it is larger than 10, EVOH may decompose and may therefore gel so that the long-run workability of the resin composition may be poor. The heat treatment of the resin composition is effected as follows: From 3 to 4 g of a sample of the resin composition are put into a stainless steel pipe (having an inner diameter of 2.2 cm, a length of 12.5 cm and a capacity of 50 cm 3 ), then the stainless steel pipe is fully purged with nitrogen gas, and the sample therein is heated at 220°C. To obtain its MFR, the resin composition is heated in a melt indexer at 230°C for 6 minutes, and measured under a load of 10.9 kg. If desired, the EVOH resin composition of the invention may be blended with different types of EVOHs each having a different degree of polymerization, a different ethylene content and a different degree of saponification. Also if desired, a suitable amount of various plasticizers, stabilizers, surfactants, colorants, UV absorbents, slip agents, antistatic agents, drying agents, crosslinking agents, metal salts, fillers, reinforcing agents such as various fibers, etc. may be added to the resin composition. Also if desired, a suitable amount of any other thermoplastic resin may be added to the resin composition. Other thermoplastic resins that may be added to the resin composition include, for example, various types of polyolefins (e.g., polyethylene, polypropylene, poly-1-butene, poly-4-methyl-1-pentene, ethylene-propylene copolymers, copolymers of ethylene with α-olefins having at least 4 carbon atoms, polyolefin-maleic anhydride copolymers, ethylene-vinyl ester copolymers, ethylene-acrylate copolymers, and also modified polyolefins prepared by graft-modifying such polymers and copolymers with unsaturated carboxylic acids or their derivatives, etc.), various types of nylons (e.g., nylon-6, nylon-6,6, nylon-6/6,6 copolymers, etc.), and also polyvinyl chlorides, polyvinylidene chlorides, polyesters, polystyrenes, polyacrylonitriles, polyurethanes, polyacetals, modified polyvinyl alcohol resins, etc. The method of adding an alkali metal salt (A), a carboxylic acid (B), a phosphate compound (C), and optionally a boron compound (D) and an alkaline earth metal salt (E) to EVOH is not specifically defined. For example, employable are a method of dipping EVOH in a solution containing the compounds as above; a method of melting EVOH followed by mixing the EVOH melt with the compounds; and a method of dissolving EVOH in a suitable solvent followed by mixing the EVOH solution with the compounds. Of those, preferred is the method of dipping EVOH in a solution of the compounds for more favorably ensuring the effect of the invention. The treatment for the method may be effected in any mode of batch operation or continuous operation. For the treatment, the morphology of EVOH is not limited, including, for example, powders, granules, spherical pellets, columnar pellets, chips, etc. In the method where EVOH is dipped in a solution containing an alkali metal salt (A), a carboxylic acid (B), a phosphate compound (C), and optionally a boron compound (D) and an alkaline earth metal salt (E), the concentration of the alkali metal salt (A), carboxylic acid (B), phosphate compound (C), and optionally boron compound (D) and alkaline earth metal salt (E) to be in the solution is not specifically defined. The solvent of the solution is also not specifically defined. In view of its handlability, preferred is an aqueous solution. Preferably, the weight of the solution in which EVOH is dipped is at least 3 times, more preferably at least 20 times the dry weight of EVOH. The dipping time will vary, depending on the morphology of EVOH, but is preferably not shorter than 1 hour, more preferably not shorter than 2 hours, for chips of EVOH having a size of from 1 to 10 mm or so. Regarding the dipping treatment of EVOH in the solution of the compounds, EVOH may be dipped in a plurality of different solutions separately containing any of the compounds, or may be dipped in one solution containing all the compounds. In particular, especially preferred is dipping EVOH in one solution containing all of an alkali metal salt (A) and a carboxylic acid (B), a phosphate compound (C), (and optionally a boron compound (D) and an alkaline earth metal salt (E)), as the treatment in that manner is simple. After having been dipped in the solution, EVOH is finally dried and the intended EVOH composition is thus obtained. The EVOH resin composition obtained in the above manner is molded in melt into various moldings such as films, sheets, containers, pipes, fibers, etc. The moldings can be recycled by grinding and re-molding them. The films, sheets and fibers of the composition may be uniaxially or biaxially stretched. For molding the composition in melt, employable is any mode of extrusion, inflation extrusion, blow molding, melt spinning, injection molding, etc. The temperature at which the resin composition is melted varies, depending on the melting point of EVOH in the composition, but preferably falls between 150 and 270°C or so. The EVOH resin composition of the invention may be molded into single-layered moldings of the composition alone, but, in practical use, it is often molded into multi-layered structures comprising at least one layer of the composition in which the layer of the composition may be in any form of film, sheet or the like. The layer constitution of the multi-layered structures includes, for example, E/Ad/T, T/Ad/E/Ad/T, etc., in which E indicates the EVOH resin composition of the invention, Ad indicates an adhesive resin, and T indicates a thermoplastic resin. However, these are not limitative. In the multi-layered structures, each layer may be single-layered, or, as the case may be, multi-layered. The method of producing the multi-layered structures as above is not specifically defined. For example, employable are a method of melt-extruding a thermoplastic resin onto a molding (e.g., film, sheet, etc.) of the EVOH resin composition; a method of co-extruding the EVOH resin composition along with any other thermoplastic resin, etc.; a method of co-injecting the EVOH resin composition along with any other thermoplastic resin; a method of laminating films or sheets of a molding of the EVOH resin composition and any other substrate via a known adhesive of, for example, organotitanium compounds, isocyanate compounds, polyester compounds and the like, therebetween. Of those, preferred is the method of co-extruding the EVOH resin composition along with any other thermoplastic resin. As having extremely excellent interlayer adhesiveness, the EVOH resin composition of the invention is favorable to co-extrusion molding and to co-extruded multi-layered structures comprising it. The thermoplastic resin that may be laminated with the EVOH resin composition of the invention includes, for example, homopolymers or copolymers of olefins such as linear low-density polyethylenes, low-density polyethylenes, middle-density polyethylenes, high-density polyethylenes, ethylene-vinyl acetate copolymers, ethylene-propylene copolymers, polypropylenes, propylene-α-olefin copolymers (in which the α-olefin has from 4 to 20 carbon atoms), polybutenes, polypentenes, etc.; polyesters such as polyethylene terephthalates, etc.; polyester elastomers; polyamide resins such as nylon-6, nylon-6,6, etc.; as well as polystyrenes, polyvinyl chlorides, polyvinylidene chlorides, acrylic resins, vinyl ester resins, polyurethane elastomers, polycarbonate, chloropolyethylenes, chloropolypropylenes, etc. Of those, preferred are polypropylenes, polyethylenes, ethylene-propylene copolymers, ethylene-vinyl acetate copolymers, polyamides, polystyrenes, and polyesters. In case where the EVOH resin composition of the invention is layered with a thermoplastic resin, an adhesive resin may be used therebetween. In that case, the adhesive resin preferably comprises a carboxylic acid-modified polyolefin. The carboxylic acid-modified polyolefin is preferably a modified olefinic polymer having carboxyl groups that may be prepared by chemically bonding an ethylenic unsaturated carboxylic acid or its anhydride to an olefinic polymer, for example, through addition reaction or grafting reaction. The olefinic polymer includes, for example, polyolefins such as polyethylenes (produced in low-pressure, middle-pressure or high-pressure process), linear low-density polyethylenes, polypropylenes, polybutenes, etc.; copolymers of olefins with comonomers capable of copolymerizing with olefins (e.g., vinyl esters, unsaturated carboxylates, etc.), such as ethylene-vinyl acetate copolymers, ethylene-ethyl acrylate copolymers, etc. Of those, preferred are linear low-density polyethylenes, ethylene-vinyl acetate copolymers (having a vinyl acetate content of from 5 to 55 % by weight), and ethylene-ethyl acrylate copolymers (having an ethyl acrylate content of from 8 to 35 % by weight); and more preferred are linear-low density polyethylenes and ethylene-vinyl acetate copolymers. The ethylenic unsaturated carboxylic acid and its anhydride include, for example, ethylenic unsaturated monocarboxylic acids and their esters, ethylenic unsaturated dicarboxylic acids and their mono- or di-esters and anhydrides. Of those, preferred are ethylenic unsaturated dicarboxylic acid anhydrides. Concretely, they include maleic acid, fumaric acid, itaconic acid, maleic anhydride, itaconic anhydride, monomethyl maleate, monoethyl maleate, diethyl maleate, monomethyl fumarate, etc. Above all, most preferred is maleic anhydride. The amount of the ethylenic unsaturated carboxylic acid or its anhydride to be added to or grafted on the olefinic polymer (that is, the degree of modification of the polymer) may fall between 0.0001 and 15 % by weight of the olefinic polymer, but preferably between 0.001 and 10 % by weight. Addition reaction or grafting reaction of the ethylenic unsaturated carboxylic acid or its anhydride to the olefinic polymer may be effected, for example, through radical polymerization in a solvent (e.g., xylene, etc.) in the presence of a catalyst (e.g., peroxide, etc.). The melt flow rate (MFR) of the thus-prepared, carboxylic acid-modified polyolefin, when measured at 190°C, preferably falls between 0.2 and 30 g/10 min, more preferably between 0.5 and 10 g/10 min. The adhesive resins may be used either singly as single layer or combined as two or more layers. Of ordinary adhesive resins as above, those for nylons which could not be used in multi-layered structures with EVOH, especially in co-extruded multi-layered structures with EVOH as their adhesiveness to EVOH is poor, can be used in the multi-layered structures comprising the EVOH resin composition of the invention. To that effect, the invention is of high significance. Now that the EVOH resin composition having the advantages as above has been provided by the invention, the latitude in choosing the adhesive resins applicable to co-extrusion molding of EVOH has been enlarged. Needless-to-say, the EVOH resin compositions of the invention have extremely high adhesiveness to ordinary adhesive resins for EVOH. Therefore, the thickness of the adhesive resin layer used in multi-layered structures comprising a layer of the EVOH resin composition of the invention can be reduced compared to that in conventional EVOH multi-layered structures, without interfering with the properties of the structures. Also to that effect, the invention is of high significance. For co-extruding the resin compositions of the invention along with a thermoplastic resin, for example, employable is any of a multi-manifold flow-combining T-die process, a feed block flow-combining T-die process, or an inflation process. The thus-obtained, co-extruded multi-layered structures can be fabricated into various moldings (e.g., films, sheets, tubes, bottles, etc.), which include, for example, the following: (1) Multi-layered, co-stretched sheets or films, which are produced by uniaxially or biaxially stretching multi-layered structures (e.g., sheets, films, etc.), or biaxially stretching them, and thereafter thermally fixing them. (2) Multi-layered rolled sheets or films, which are produced by rolling multi-layered structures (e.g., sheets, films, etc.). (3) Multi-layered tray or cup containers, which are produced through vacuum forming, pressure forming, vacuum-pressure forming or isothermal forming of multi-layered structures (e.g., sheets, films, etc.). (4) Multi-layered bottle or cup containers, which are produced through stretch blow molding of multi-layered structures (e.g., pipes, etc.). The method for fabricating the multi-layered structures of the invention is not limited to the above, and any other known fabricating methods (e.g., blow molding, etc.) could apply to the structures. The co-extruded multi-layered structures and the co-injected multi-layered structures obtained in the manner as above smell little, and have few fish eyes. In addition, they are transparent and have few streaks. Therefore, they are favorable to materials for containers for drinks and edibles, for example, for deep-drawn containers, cup containers, bottles, etc. EXAMPLES The invention is described in more detail with reference to the following Examples, which, however, are not intended to restrict the scope of the invention. Unless otherwise specifically indicated, "%" and "parts" referred to herein are all by weight. Water used herein is all ion-exchanged water. (1) Quantitative determination of alkali metal salt (A) and alkaline earth metal salt (E) (quantitative determination of Na, K and Mg ions): 10 g of a sample of dry chips is put into 50 ml of an aqueous solution of 0.01 N hydrochloric acid, and stirred at 95°C for 6 hours. After having been thus stirred, the aqueous solution is subjected to quantitative analysis through ion chromatography, and the amount of Na ions, K ions and Mg ions therein is quantitatively determined. The column used is Yokokawa Electric's ICS-C25, and the eluent used is an aqueous solution containing 5.0 mM tartaric acid and 1.0 mM 2,6-pyridinedicarboxylic acid. For the quantitative determination, used are calibration curves of aqueous solutions of sodium chloride, potassium chloride and magnesium chloride. From the data of Na ions, K ions and Mg ions thus obtained, the content of the alkali metal salt (A) and the alkaline earth metal salt (E) in the sample of dry chips is derived in terms of the metal. (2) Quantitative determination of the content of carboxylic acid (B): 20 g of a sample of dry chips is put into 100 ml of ion-exchanged water, and extracted under heat at 95°C for 6 hours. The resulting extract is subjected to acid-base titration with 1/50 N NaOH to determine the content of the carboxylic acid (B) in the sample. Phenolphthalein is used as an indicator. (3) Quantitative determination of phosphate ions: 10 g of a sample of dry chips is put into 50 ml of an aqueous solution of 0.01 N hydrochloric acid, and stirred at 95°C for 6 hours. After having been thus stirred, the aqueous solution is subjected to quantitative analysis through ion chromatography, and the amount of phosphate ions therein is quantitatively determined. The column used is Yokokawa Electric's ICS-A23, and the eluent used is an aqueous solution containing 2.5 mM sodium carbonate and 1.0 mM sodium hydrogencarbonate. For the quantitative determination, a calibration curve of an aqueous solution of sodium dihydrogenphosphate is used. From the data, the content, in terms of the phosphate radical, of the phosphate compound (C) in the sample is obtained. (4) Quantitative determination of boron compound (D): 100 g of a sample of dry chips is put into a ceramic crucible, and ashed in an electric furnace. The resulting ash is dissolved in 200 ml of an aqueous solution of 0.01 N nitric acid, and subjected to atomic absorption analysis to thereby determine the content, in terms of the boron element, of the boron compound (D) in the sample. (5) Adhesiveness: A fresh sample of a three-kind five-layered film prepared through co-extrusion molding is tested through autograph (rate of pulling : 250 mm/min) for the 90-degree peeling strength between the EVOH layer and the adhesive resin layer, at 20°C and 65% RH. From the data of the peeling strength thus obtained, the interlayer adhesiveness of the sample is evaluated according to the criteria mentioned below. A: Over 1000 g/15 mm. B: From 700 to 1000 g/15 mm. C: From 400 to 700 g/15 mm. D: Smaller than 400 g/15 mm. (6) Test for forming a single-layered film: (6-a) Fish eye resistance (short time operation) A sample of dry EVOH chips is molded into a single-layered film in a continuous molding line. One hour after the start of the molding operation, the film formed is sampled and checked for gel-like fish eyes (having a macroscopically detectable size of larger than about 100 µm). The number of the gel-like fish eyes seen on the film is counted. From the number, per 1.0 m 2 , of the thus-counted number of the gel-like fish eyes, the fish eye resistance of the sample is evaluated according to the criteria mentioned below. A: Smaller than 20. B: From 20 to 40. C: From 40 to 60. D: Over 60. (6-b) Fish eye resistance (long-time operation) A sample of dry EVOH chips is molded into a single-layered film in a continuous molding line. Eight hours after the start of the molding operation, the film formed is sampled and checked for gel-like fish eyes (having a macroscopically detectable size of larger than about 100 µm). The number of the gel-like fish eyes seen on the film is counted. From the number, per 1.0 m 2 , of the thus-counted number of the gel-like fish eyes, the fish eye resistance of the sample is evaluated according to the criteria mentioned below. A: Smaller than 20. B: From 20 to 40. C: From 40 to 60. D: Over 60. (6-c) Resin deposition around die: A sample of dry EVOH chips is molded into a single-layered film in a continuous molding line. Eight hours after the start of the molding operation, the molding line is stopped. The EVOH resin in the extruder is substituted with LDPE having a MI of 1, which takes one hour. The weight of the thermally-degraded EVOH resin having deposited around the die is measured. From the data, the resin deposition resistance of the sample is evaluated according to the criteria mentioned below. A: Smaller than 1 g. B: From 1 to 5 g. C: From 5 to 10 g. D: Over 10 g. (7) Discoloration resistance: 8 g of a sample of dry chips is sandwiched between hot plates (Shindo's desktop test press YS-5) heated at 230°C with the hot plates being spaced from each other by 5 mm. In that condition, the sample is heated for 10 minutes. After having been thus heated, the degree of discoloration of the sample is macroscopically evaluated according to the criteria mentioned below. A: Colorless. B: Slightly yellowed. C: Visibly yellowed. D: Strongly yellowed. (8) Recyclability: A sample of a single-layered EVOH film (sampled within 2 hours after the start of the molding operation in a continuous molding line) is milled, melted and again pelletized (at 220°C). The pellets are molded into a film in the same manner as previously. (8-a) Yellowing resistance: The film is wound up around a paper board tube, and the rolled film is macroscopically checked for the degree of yellowing at its edges. The yellowing resistance of the film is evaluated according to the criteria mentioned below. A: Colorless. B: Slightly yellowed. C: Visibly yellowed. D: Strongly yellowed. (8-b) Fish eyes: One hour after the start of the molding operation, the film formed is sampled and checked for gel-like fish eyes (having a macroscopically detectable size of larger than about 100 µm). The number of the gel-like fish eyes seen on the film is counted. From the number, per 1.0 m 2 , of the thus-counted number of the gel-like fish eyes, the fish eye resistance of the sample is evaluated according to the criteria mentioned below. A: Smaller than 20. B: From 20 to 40. C: From 40 to 60. D: Over 60. (9) Intrinsic viscosity: 0.20 g of EVOH chips to be tested are sampled, and dissolved in 40 ml of aqueous phenol (water/phenol = 15/85 wt.%) under heat at 60°C over a period of 3 to 4 hours, and the viscosity of the resulting solution is measured with an Ostwald viscometer (t0 = 90 seconds). According to the following formula, the intrinsic (limiting) viscosity [η] of the sample is obtained. [η] = (2 × (ηsp - 1nηrel)) 1/2 /C (1/g), ηsp = t/t0 - 1 (specific viscosity), ηrel = t/t0 (relative viscosity), C: concentration of EVOH (g/l), t0: time taken by the blank (aqueous phenol) to pass through the viscometer, t: time taken by the sample-containing aqueous phenol to pass through the viscometer. (10) Odor: 20 g of a sample of EVOH chips is put into a 100-ml glass tube, and sealed with aluminium foil. The sample heated at 150°C for 90 minutes in a hot air drier. After having been taken out of the drier, the sample is left to cool at room temperature for 1 hour. The sample tube is shaken two or three times. The aluminium foil is removed, and the sample in the tube is sniffed. The odor of the sample is evaluated according to the criteria mentioned below. A: No smell. B: Slight smell. C: Smell. D: Strong smell. Example 1: A 45 % solution in methanol of ethylene-vinyl acetate copolymer having an ethylene content of 38 mol% was put into a reactor for saponification, to which was added a solution of sodium hydroxide in methanol (80 g/liter), the amount of sodium hydroxide added being 0.4 equivalents to the vinyl acetate moiety of the copolymer. Then, methanol was added thereto to make the solution have a copolymer concentration of 20 %. This was heated up to 60°C and reacted for about 4 hours with nitrogen gas being introduced into the reactor. After 4 hours, this was neutralized with acetic acid to stop the reaction. This was extruded into water through a die having a circular opening, solidified therein and cut into chips each having a diameter of about 3 mm and a length of about 5 mm. The resulting chips were dewatered in a centrifuge. A large amount of water was added thereto, and the chips were again dewatered. This operation was repeated. 3.5 kg of the wet chips of ethylene-vinyl alcohol copolymer thus obtained were dipped in 13 liters of an aqueous solution containing acetic acid (0.20 g/liter), sodium acetate (1.31 g/liter), potassium dihydrogenphosphate (0.14 g/liter) and boric acid (0.35 g/liter) at 25°C for 6 hours. After having been thus dipped, the chips were dewatered, and dried at 80°C for 3 hours and then at 107°C for 24 hours in a hot air drier. Thus were obtained dry chips. The acetic acid content of the dry chips was 90 ppm; the alkali metal salt content thereof was 550 ppm in terms of the metal; and the phosphate compound content thereof was 80 ppm in terms of the phosphate radical. MI of the sample was 2.1 g/10 min. Using the dry chips obtained herein, a three-kind five-layered co-extrusion film of LLDPE/adhesive resin/EVOH composition/adhesive resin/LLDPE (thickness: 50/10/10/10/50 µm) was molded. LLDPE used herein is Mitsui Chemical's Ultozex 3520L (MI = 2.1 g/10 min, measured at 210°C under a load of 2160 g); the adhesive resin is Mitsui Chemical's Admer NF308 (this is maleic anhydride-modified polyethylene for nylon adhesion, and its MI is 1.7 g/10 min, measured at 190°C under a load of 2160 g). The extrusion temperature for the EVOH composition, LLDPE and adhesive resin was 220°C, 170°C and 170°C, respectively; and the die temperature was 220°C. The details of the extruder for each resin and the T-die are as follows: LLDPE: 32  extruder, GT-32-A Model (from Plastic Engineering Laboratory). Adhesive resin: 25  extruder, P25-18AC (from Osaka Seiki). EVOH: 20  extruder, laboratory-size ME Model CO-EXT (from Toyo Seiki). T-die: for three-resin five-layer films having a width of 300 mm (from Plastic Engineering Laboratory). The chill roll temperature was 50°C; and the take-up speed was 4 m/min. For its interlayer adhesiveness between EVOH/adhesive resin, the fresh sample of the film was evaluated as grade A. On the other hand, the dry chips were molded into a single-layered EVOH film, and the film samples were tested for fish eyes, long-run workability and resin deposition around the die. The L/D ratio of the screw used for molding the single-layered EVOH film was 20; and the compression ratio was 4.0. The details of the extruder and the T-die used in the tests are as follows: Extruder: single-screw extruder D20/20 (from Toyo Seiki). T-die: straight hunger-type T-die having a width of 300 mm (from Toyo Seiki). Extrusion temperature: C1/C2/C3/die = 180/220/220/220°C. For its fish eye resistance and long-run workability, the sample was evaluated both as grade A. For the resin deposition around die, the sample was evaluated as grade B. The dry chips were tested for the discoloration resistance and odor according to the methods mentioned above. In the tests, the sample was evaluated as grade A for the discoloration resistance, and as grade C for the odor. A sample of the single-layered film (this was sampled within 2 hours after the start of the molding operation) was tested for the recyclability (with respect to the yellowing resistance (a) and the fish eye resistance (b)) according to the methods mentioned above. In the recycle test, the sample was evaluated as grade A both for the yellowing resistance (a) and the fish eye resistance (b). Examples 2 to 5, Comparative Examples 1 to 7: Dry chips were prepared in the same manner as in Example 1. In this, however, EVOH having been obtained through saponification followed by washing and dewatering was dipped in a processing solution indicated in Table 1. The composition of the dry chips is given in Table 2; and the test data are in Table 3. The EVOH resin compositions of the invention obtained in Examples 1 to 5 have extremely good adhesiveness, and their moldings have good appearance with few gels and fish eyes. In addition, the resin compositions all have good long-run workability and good recyclability, and the recycled resin compositions are yellowed little. The discoloration resistance and the recyclability of the EVOH resin compositions of Comparative Examples 1 and 2 are both extremely bad, since the content of the phosphate compound (C) therein is smaller than 10 ppm in terms of the phosphate radical. The adhesiveness of the EVOH resin composition of Comparative Example 3 that contains a boron compound is poor, since the content of the alkali metal salt (A) therein is smaller than 510 ppm in terms of the metal. Contrary to the object of the invention, the adhesiveness of the EVOH resin composition of Comparative Example 4 not containing a boron compound is not improved so much, since the content of the alkali metal salt (A) in the composition is smaller than 510 ppm in terms of the metal. In addition; the fish eye resistance, the long-run workability and the resin melt deposition resistance of the composition of Comparative Example 4 are not so much improved. The discoloration resistance and the recyclability of the EVOH resin composition of Comparative Example 5 in which the content of the alkali metal salt (A) is larger than 2000 ppm in terms of the metal are both extremely poor, and, in addition, the long-run workability thereof is not good. The fish eye resistance, the long-run workability and the resin melt deposition resistance of the EVOH resin composition of Comparative Example 6 of which the acetic acid content is larger than 500 ppm are all extremely poor, and the adhesiveness thereof is also extremely low. The discoloration resistance and the recyclability of the EVOH resin composition of Comparative Example 7 of which the acetic acid content is smaller than 10 ppm are both poor. As described in detail hereinabove with reference to its embodiments, the invention provides an improved EVOH resin composition and a multi-layered structure comprising it. The resin composition has extremely good adhesiveness, and its' moldings have good appearance with few gels and fish eyes. When molded, the resin composition ensures good long-run workability and recyclability, and the recycled resin composition is yellowed little. As having extremely good interlayer adhesiveness, the resin composition is extremely favorable to co-extrusion molding with substrates of e.g. polyolefins.

Claims: A resin composition comprising an ethylene-vinyl alcohol copolymer, which resin composition contains from 510 to 2000 ppm, in terms of the metal, of an alkali metal salt (A), from 10 to 500 ppm of a carboxylic acid (B) having a molecular weight of smaller than 75 g/mol, and from 10 to 500 ppm, in terms of the phosphate radical, of a phosphate compound (C) selected from phosphoric acid, phosphorous acid, and their salts. The resin composition as claimed in claim 1, wherein the carboxylic acid (B) having a molecular weight of smaller than 75 g/mol is acetic acid. The resin composition as claimed in claim 1 or 2, wherein the content (ppm in terms of the metal) of the alkali metal salt (A) is from 3 to 20 times the content (ppm) of the carboxylic acid (B) having a molecular weight of smaller than 75 g/mol. The resin composition as claimed in any of claims 1 to 3, which contains from 50 to 2000 ppm, in terms of the boron element, of a boron compound (D). The resin composition as claimed in any of claims 1 to 4, which satisfies the following formula (1): 0.1 < MFRmax/MFR0 < 10 wherein MFRmax indicates a maximum value of MFR (measured at 230°C and under a load of 10.9 kg) of the resin composition having been subjected to heat treatment at 220°C in a nitrogen atmosphere for a period of from 10 to 100 hours, and MFR0 indicates MFR (measured at 230°C and under a load of 10.9 kg) of the resin composition not subjected to the heat treatment. The resin composition as claimed in any of claims 1 to 5, which is for co-extrusion molding. A multi-layered structure comprising at least one layer of the resin composition of any of claims 1 to 6.

Inventors: INOMATA NAOKIYO, SHINDOME HIROYUKI, INOMATA, NAOKIYO, SHINDOME, HIROYUKI
Applicants: KURARAY CO, KURARAY CO., LTD.
Application year: 2000
Main classification: C08K5
IPC codes: C08K5, B32B27, C08L29, C08K3