COMPUTER SYSTEM CONFIGURATION

Abstract: Various embodiments of computer system configurations are disclosed herein. In one embodiment, the memory capacity of the computer system may be increased through efficient utilization of the computer system housing space. A first plurality of memory cards is inserted on a printed circuit board, generally the motherboard. A memory riser board or a vertical printed circuit board may then be inserted onto the motherboard and in parallel to the first plurality of memory cards. The riser board may carry a second plurality of memory cards that is oriented in vertical direction and at right angle to the first plurality of memory cards. In another embodiment, a computer system housing includes a chassis that may be partitioned into two separate sub-chassis for proper positioning of one or more cooling fans as well as to accommodate changes in computer system configurations with minimized retooling of the chassis. The cooling fans may be mounted at such locations on the chassis that allow optimization of air circulation and, hence, cooling within the housing. In yet a further embodiment, a computer system housing includes a curved bezel that forms one or more sideways gap between a side of the computer housing chassis and the bezel attached to that side. Typically, the curved bezel is attached to the front of the chassis with each sideways gap extending perpendicularly from the front of the chassis to a predetermined width and stretching to predetermined length along the front of the chassis. The sideways gaps facilitate increased air inlet from the sides and allow efficient cooling of various system components that are mounted on the chassis and housed within the housing. One or more cooling fans may be mounted at different locations within the housing to optimize air circulation and, hence, cooling within the housing. The chassis may be partitioned into two separate sub-chassis for proper positioning of the cooling fans as well as to accommodate changes in computer system configurations with minimized retooling of the chassis.

Description: TITLE: COMPUTER SYSTEM CONFIGURATION BACKGROUND OF THE INVENTION 1 Field of the invention The present invention broadly relates to computer system configurations and housmgs. 2. Descnption of the Related Art Modern computer systems generally mclude a housing or an enclosure, a display device and an external command data input device. The display device may be a CRT (cathode ray tube) monitor, e.g., m a desktop computer system, or it could be a TFT (thin film transistor) screen, e.g., in a portable laptop computer. The external mput device may be a keyboard, a pomtmg device, e.g., a mouse, or a combination of them. The system housmg is an enclosure that houses the hardware components that perform, along with necessary software, vaπous processing tasks as requested by the user. The housing may also include one or more power supplies to supply proper electrical power to vaπous electronic hardware circuit elements. Auxiliary storage device drives, e.g., a floppy disk drive or a CD-ROM drive may also be housed withm the computer system housmg Additionally, hard disk drive for large amount of data storage is almost invariably included withm the computer housing for greater digital information storage capacity Electronic components or hardware circuit elements mclude semiconductor devices. During operation, such electronic components dissipate electrical power (i.e., transform electrical energy into heat energy). At the same time, several key operating parameters of semiconductor electronic devices typically vary with temperature, and reliable device operation within specifications occurs only withm a defined operating temperature range For example, specified performance of a processor is typically achieved only when the temperature of the processmg device or "processor", e.g., one or more microprocessors, is maintained below a specified maximum operating temperature. Operation of the processor at a temperature above the maximum operating temperature may result m irreversible damage to the processor. In addition, it has been established that the reliabilities of semiconductor electronic devices decrease with increasing operatmg temperature. The heat energy produced by electronic components duπng operation must thus be removed to a suπoundmg ambient at a rate which ensures that operational and reliability requirements are met. As component speeds, capabilities and density increase, so does the amount of electrical power dissipated by the components duπng operation. Cooling mechanisms employed by computer systems must thus allow for more guided airflow into the housmg for faster heat transfer from the computer system enclosure to the surrounding ambient. Today, a typical computer system mcludes vaπous openmgs or vents on one or more of the side panels for the housmg and/or sometimes on the front bezel itself. The front bezel generally mcludes power and reset buttons for the system and typically mcludes areas to allow a user to load CDs and/or floppy disks into corresponding disk drives. The vaπous openmgs or vents, in conjunction with one or more fans mounted on a metal chassis or included withm an appropriate hardware unit, e.g., the power supply unit, allow ambient an- to flow into the computer system housmg and over the electronic hardware components withm the housmg, absorbing heat energy from the components before bemg expelled through the openmgs or vents m the rear of the metal chassis In some computer systems, an mdependent fan is attached to a heat sink mounted to the processor. However, as the number of processors withm the system mcreases, additional fans or coolmg mechanisms are needed to efficiently expel the heat generated by these processors. Fans are rotatmg electro-mechanical devices which produce acoustic noise and fail relatively often (1 e , have relatively short operatmg life) When a fan fails, the components that rely on the coolmg air provided by the fan can, and often do, fail as well. Further, fans are relatively heavier in weight, and increasing the number of fans may mcrease the weight of the computer system housmg Therefore, a computer system housmg where adequate component coolmg is achieved without undue multiplicity of coolmg fans may be desirable. The power supply unit normally produces more heat energy than most of the other electronic components. It may also be desirable to have a computer system chassis that keeps the power supply unit and its coolmg system physically separated from the rest of the system hardware mounted on the chassis so as to reduce heat dissipation around the rest of the system hardware. The enclosure for computer system components has a limited volume. The expandability of system processmg power or system storage capacity, e.g., on-board caches and RAMs (Random Access Memory), depends, among other factors, on the size or volume of the computer system housmg. Further, mcrease m the number of electronic components that are housed withm the enclosure may necessitate proportionate availability of adequate coolmg means for reliable operation of the computer system. Therefore, it may be desirable to optimize the component packmg density within the housmg while mamtammg proper airflow through the computer system components for adequate coolmg. SUMMARY OF THE INVENTION Various embodiments of computer system configurations are disclosed herem. In one embodiment, the memory capacity of the computer system is mcreased through efficient utilization of the computer system housmg space. A first plurality of memory cards are inserted on a printed circuit board, generally the motherboard. A memory riser board or a vertical printed circuit board may then be inserted onto the motherboard and m parallel to the first plurality of memory cards. The riser board may carry a second plurality of memory cards that is oπented m vertical direction and at right angle to the first plurality of memory cards. The second plurality of memory cards thus occupies the vertical space between the nser card and the memory card on the motherboard that is closest to the πser card. The vertical space withm the computer housmg may thus be efficiently utilized without necessitatmg additional coolmg for the memoπes on the riser board In another embodiment, a computer system housmg mcludes a metal chassis that provides a frame or structure to mount a number of computer system components on In one embodiment, the metal chassis may be partitioned mto separate sub-chassis. The partitioning of the system chassis may allow for flexible manufacturmg of different configurations of the computer system, for example, when the requirements for computer system component packmg density or for the size of the power supply unit are vaπable. Due to the separate toolmg of the two sub-chassis, only one of the sub-chassis may be retooled m view of the changed configuration requirements. The front of the computer system chassis (i.e., the side of the computer system chassis that generally faces a user when the housmg is placed m an upπght position over a surface) may be covered with a bezel that forms a first sideways gap (e.g., on the left side) between the front of the chassis and the bezel surface The sideways gap extends perpendicularly from the front of the chassis to a predetermined width and stretches to a predetermined length along the front of the chassis. A second sideways gap (e.g., on the right hand side) may also be formed by the bezel when attached to the front of the chassis The sideways gaps may allow efficient coolmg of system components due to the mcreased air mlet from the sides The bezel surface may be formed with a predetermined curvature to obtam desired sideways an" mlet area. The fans mounted at different locations on the metal chassis may draw air from the sideways air mlets and cool appropnate hardware components before expelling the heat-containing air to the surrounding ambient through one or more vents provided on the rear side of the chassis. In one embodiment, one or more coolmg fans may be mounted on the chassis without screws. Fans may be configured to snap into a corresponding bracket, and the bracket may be configured to snap mto the chassis without requiring any screws. In still a further embodiment, dedicated channels of coolmg air may be created by efficient placement of coolmg fans at vaπous locations on the chassis. Two larger coolmg fans may be mounted at the junction of the two sub-chassis to mamtam two an- channels withm the housmg. These two air channels effectively cover a substantial portion of the mtenor of the housmg. A relatively smaller coolmg fan may be mounted at the rear end of the rear sub-chassis to effectuate coolmg of the extreme top portion of the housmg, which mcludes the additional memory on the nser card. In one embodiment, the coolmg of the power supply unit withm the housmg is managed independently of the coolmg of the remamder of the computer system. Two smaller coolmg fans may be dedicated to cool the power supply unit. The optimization of fan placement withm the housmg results m efficient coolmg of vaπous system components and allows for increase m system component packmg density without a similar mcrease m the number of coolmg fans. BRIEF DESCRIPTION OF THE DRAWINGS A better understanding of the present mvention can be obtamed when the following detailed descπption of the preferred embodiment is considered m conjunction with the following drawings, in which: Fig. 1A shows a computer system housing havmg a sideways airflow gap m the front of the housmg. Fig. IB depicts a disassembled view of the housmg m Fig. 1A. Fig. 1C highlights the curved bezel portion of the housmg in Fig. 1A. Figs. 2A and 2B further depict various views of the curved bezel m Figs. 1 A-IC. Figs. 3A-3C show different views of an air guide that may be mounted on a coolmg fan to optimize channeling of the cooling air to the desired system components. Figs. 4A-4B depict structural details of the πght access panel shown m Fig. IB. Figs. 5A-5B illustrate partitioning of the chassis for the computer system housmg. Fig. 6A shows a cut-out view of the computer system housmg with the chassis havmg a penpheral bay unit (without fillers) mounted thereon. Fig. 6B shows m a disassembled form the computer system components shown mounted on the chassis m Fig. 6A. Fig. 6C depicts two three-dimensional views of the coolmg fan bracket shown m Figs. 6A and 6B Fig. 7A is a three-dimensional view of the storage chamber (without fillers) m Figs. 6A-6B. The access panel and the bracket are shown disassembled Fig. 7B depicts a penpheral assembly with vanous fillers attached to the storage chamber shown m Figs. 6A-6B and 7A. Fig. 8A illustrates internal and external views of a power button assembly mounted on a penpheral bezel. Fig. 8B is a disassembled view of the penpheral bezel m Fig. 8A Fig. 9 shows a pan of three-dimensional views of part of the power button assembly shown m Figs. 8A- 8B. Fig. 10 depicts front elevations for the corresponding three-dimensional views m Fig. 9. Fig. 11 illustrates different views of the light pipe forming part of the power button assembly shown m Figs. 8A-8B. Fig. 12A is a disassembled view of the computer system housing showing locations and placement of vaπous system components. Fig. 12B shows a simplified block schematic for the air coolmg of the housmg m Fig. 12A. DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS Referring now to Fig. 1A, a computer system housmg 10 is shown with a sideways airflow gap or air mlet 11 in the front of the housmg. Fig. IB illustrates a disassembled view of the housmg 10. The housmg 10 mcludes a metal chassis 12 that may be covered by a number of plastic access panels or enclosures. For example, the panel 16 may be securely placed at the top of the chassis 12, whereas access panels 14A,14B may be mounted on the chassis 12 to cover the left side and the nght side of the chassis 12 respectively. A plastic bezel 20 may also be placed at the front 13 of the chassis as is illustrated m Fig. IB. The bezel and various access panels provide an enclosure for the computer system components mounted on the chassis 12 A number of computer system components, e.g., motherboard, I/O cards, disk drives, coolmg fans, hard dπves, etc., may be mounted on the metal chassis 12. A coolmg fan 18A for processmg units (or processors), a cooling fan 18B for the PCI (Penpheral Component Interconnect) bus and PCI cards and a coolmg fan 18C for memory cards are shown mounted on the chassis 12 at appropnate locations. A detailed description of the complete cooling arrangement for the housmg 10 is given later. The sideways air inlet 11 (Fig. 1A) is formed when the bezel 20 is attached to the front of the chassis 12. In the preferred embodiment, the bezel 20 forms sideways airflow gaps 11 on both sides (left side and nght side) of the front 13 of the chassis. Each sideways airflow gap extends perpendicularly from the front of the chassis to a predetermined width, which is decided by the curvature of the bezel 20 placed over the chassis front. For example, the bezel 20 m Fig. IB (shown in detail in Fig. 2A) has a curvature over almost the entire length of the bezel. Therefore, m such a situation, the sideways airflow gaps may be contmuous over the entire length of the bezel 20, albeit of varying width. Each sideways air mlet 11 also extends to a predetermined length along the front of the chassis. Similar to the width of the sideways airflow gaps, the lengths of sideways an- inlets depend on the shape of the bezel 20 and on the length of the bezel. A plastic penpheral bezel 15 with a power button 17 may be configured to be snapped mto the bezel 20 as shown m Fig. IB. In one embodiment, a chassis cover 19A is placed between the front of the chassis and the curved bezel 20. The chassis cover 19A is normally hollow except for a small net 21 provided at the bottom of the chassis cover. The net 21 may comprise a large number of circular openmgs that prevent unwanted foreign objects or msects to enter mto the hard drive openmg 19 m the front wall of the chassis. The net 21 may be necessary m view of the large sideways air gaps created through the curved bezel 20, and also m view of the strong air currents generated by the coolmg fans 18A-18C. The holes m the net 21 may be rectangular, square, hexagonal, or a combmation of a number of shapes as desired. The chassis cover 19A may be of metal, plastic or any suitable mateπal. In an alternative embodiment, the chassis cover 19A is absent, but, mstead, a substantial portion of the front wall 13 of the chassis 12 is netted with holes similar to that m the chassis cover 19A. Only the top portion of the front of the chassis that houses penpheral dπves contams no holes or net therein, but, mstead, provides the regular openmg for the dπves as is shown m Fig. IB. The size, shape and placement of the net-like structure may thus be design-dependent. Fig. 1C emphasizes the curved bezel portion of the housmg 10 The curvature of the bezel 20 is clearly visible in Fig 1C The bezel 20 is preferably made of plastic and is securely fastened to the chassis 12 with molded- m hooks and screws (as partially illustrated in Figs IB and 1C). In one embodiment, the bezel 20 is attached to the front of the chassis 12 usmg four sliding molded-m hooks and two screws without removmg peripheral dnves or other access panels (e g., panels 14A and 14B). The bezel 20 may similarly be removed from the chassis without removing the peripheral devices that are already mounted on the chassis It is to be noted that the term "front" as used herem refers to that side of the housmg 10 which is generally accessed by a user (e.g., for turning on/off the computer system) when the housmg 10 is placed m an upnght position over a surface. Furthermore, the sideways air mlet 11 may also be formed along another wall of the chassis 12 m addition to or m lieu of the front wall 13 of the chassis illustrated in Figs. lA-lC. The location of sideways air mlet 11 may depend on the specific design considerations, e.g., placement of coolmg fans, placement of circuit components to be cooled, orientation of the housmg during regular usage, etc Figs. 2A and 2B show some additional views of the curved bezel 20 The bezel 20 contams an openmg 22 through which the penpheral bezel 15 may be snapped into Due to the snap-m feature of the peripheral bezel 15, the shape and size of the bezel 20 may be changed without requiring a similar change m the penpheral bezel 15 design. The penpheral bezel 15 design may therefore be made mdependent of the design of the bezel 20. The removal of the bezel 20 may similarly remove the attached penpheral bezel 15, but without removmg any penpheral devices or access panels as discussed earlier The curvature of the bezel surface is clearly visible in the views shown m Figs. 2A-2B. In one embodiment, the bezel 20 has no other openmg along its surface except for the openmg 22. This allows for substantial reduction m audible emissions transmitted m a "line of sight" direction to a user when the housing 10 is placed near the user with the bezel facmg the user. These audible emissions may be transmitted from the electronic or electromechanical components mounted along the front side of the chassis 12. Examples of such components may mclude hard disk dnves, CD ROM dnve, floppy disk dnve, a coolmg fan etc An acoustic foam may also be placed along the mside border of the bezel 20 and also over those parts of the bezel's inside surface that are m front of the noise sources, e.g., near the openmg 19 and near the openmg 22 The bezel 20 may then be securely fastened to the chassis 12 with hooks and screws as descnbed earlier In an alternative embodiment, the curved shape of the bezel 20 creates sideways (i.e , on the left side and on the right side of the housmg 10) an- mlets 11 that expose around 60% of the front of the chassis to the ambient air. Such an arrangement results m mcreased coolmg air supply for the coolmg fans, without mcreasmg the audible emissions (descnbed above) that may be transmitted to the user. Further, the curved shape of the bezel 20 may provide easy graspmg through the sideways air gaps when the housmg 10 is moved from one location to another or during a casual positioning of the housmg 10 For short distance or casual handlmg of the housmg 10, a finger gnp may be provided at the bottom front of the bezel 20. In one embodiment, the weight of the entire housmg 10 that may be ready for shippmg is around 60 lbs. The bezel 20 may be designed of plastic of appropnate thickness so as to provide firm and secure gnp (through hook and screw attachment and through the bezel curvature) duπng transportation or handlmg of the complete housmg weighing around 60 lbs Tummg now to Figs. 3A-3C, different views of a plastic air guide 30 that may be mounted on a coolmg fan (e.g., fan 18A or 18B m Fig. IB) to optimize channeling of the coolmg air to the desired system components are shown. The air guide 20 is formed of a narrow neck portion 32 and a wide and elongated mouth portion 34. The shape of the air guide 30 facilitates focussed channeling of the airflow coming from the corresponding coolmg fan the air guide is attached to. More than one air guide may be provided m the housmg 10 to efficiently direct the airflow to the electronic components to be cooled, e.g., the processors (cooled by the fan 18A) or the PCI cards (cooled by the fan 18B). The air guide 30 may distnbute the coolmg air evenly over the entire surface carrying the electronic components to be cooled. The air guide 30 may be snapped onto the corresponding coolmg fan bracket without requiring any tools or fixtures to mount the air guide. A further discussion of cooling with the help of air guides is provided later with reference to Fig. 12. As mentioned earlier, the side access panels 14A, 14B are mounted on the chassis 12 to provide enclosure for the components within the housmg. These side access panels 14A,14B, and the top access panel 16 may generally be made of the same plastic as the front bezel 20. Any other suitable mateπal may be used to manufacture access panels of desired strength and physical appearance. As descnbed before, the sideways air mlets 11 formed by the curved bezel 20 expose a large portion of the front 13 of the chassis to the ambient air. The surrounding air entenng mto the housmg through the an- mlets 11 may be directed with the help of a number of coolmg fans 18A- 18C to appropnate computer system components to be cooled. Additional channeling and containment of the air inside the housmg may be provided through the mtenor surfaces of the side access panels 14A and 14B. Referring now to Figs. 4A and 4B, some structural details of the nght access panel 14A (Fig. IB) are shown. The access panel 14A may have corrugations 44 of varying length along the edge that is closer to the bezel 20 as shown m Fig. 1 A. The width of each corrugation may not be identical. The corrugations may form a stπp 44 along the "front" edge of the access panel 14A as clearly shown in Fig. 4A. The stnp of corrugations may be formed at right angle to the edge, as shown. Alternately, the stnp may form any suitable angle with the edge of the access panel 14A so long as the strip does not block the adjacent sideways air mlet 11. The stπp of corrugations may be formed as part of a smgle mold for the entire access panel 14A. Alternately, the stπp may be attached to the corresponding edge of the access panel through suitable fasteners, e.g., screws, nuts and bolts, or the stnp may be made to snap mto the coπesponding edge. The stπp of corrugations may further prevent foreign objects or msects from entering mto the housmg via the corresponding sideways air mlet. Additionally, the stnp 44 may protect a user from directly accessmg sharp metal surface of the chassis 12 when the user tnes to grasp the front bezel 20 through The nght access panel 14A may further include a number of protrusions 42 along a portion of its internal surface. The protrusions 42 may taper off at a suitable angle to the internal surface of the access panel 14A, thereby forming the channel ends 46. The length, width and depth of the protrusions may depend on the designer. The protrusions 42 form channels for passage of airflow. The mside surface of the access panel 14A may be made smooth so that the air enteπng mto the housmg via the sideways air mlets 11 may move rapidly over the access panel. Faster an- movement may result m rapid circulation of air withm the housmg, and may result m faster coolmg of the desired system components. The left view m Fig. 4B is a front view of the right image m Fig. 4A, whereas the nght view in Fig. 4B is a partial front view of the left image m Fig. 4A. The central view m Fig. 4B depicts left hand side view of the left image m Fig. 4A. The left access panel 14B may be constructed similar to the nght access panel 14 A. In one embodiment, the left access panel 14B mcludes the stnp of corrugations, but does not have any protrusions 42 similar to the nght access panel 14A. Further, the left access panel 14B may not have an mdented portion (for the power supply unit) similar to that shown for the nght access panel 14A. The orientation of the stnp 44 m the left access panel 14B may be at a different angle to the panel edge than that of the stπp m the right access panel 14A. All of the access panels 14A, 14B and 16, may be snugly snapped mto the corresponding chassis walls. Alternately, the access panels may be mounted on the coπesponding chassis walls usmg fasteners, e.g., screws, nuts and bolts, etc. It is noted that efficient coolmg withm a computer system housmg generally depends on two factors: (1) The overall design of the housmg, which mcludes placement of coolmg fans and channeling of ambient air flow through various parts of the housmg; and (2) The density of the components packed withm the housmg, which depends on the projected air flow withm the housmg and the type and nature of the component that requires coolmg For example, processors or processmg units may require sustamed coolmg for efficient performance, whereas a memory card may not require similar level of coolmg. Therefore, processors and memory cards withm the housmg may be placed at different locations m the path of the projected air flow withm the housmg. The overall design of the housmg also includes shape and structure of the underlymg chassis. A flexible chassis design may be desirable to minimize expenses mvolved m retoolmg of a new chassis m the event of a changed configuration for one or more of the computer system component. For example, current computer systems typically utilize a smgle tooled mam chassis. The "Ultra 30" chassis design is one example of this structure. Under the smgle tooled chassis design, an improvement or modification in a component design (e.g., larger power supply unit or addition of penpheral bays) may require complete retoolmg of the entire chassis design. The foregoing problem is eliminated through a compartmentalized chassis design that is illustrated m Figs. 5A and 5B. The chassis 12 for the housmg 10 is shown partitioned mto two mam units: a front sub-chassis 51, and a rear sub-chassis 50. Each of these units may be retooled mdependent of the other unit. Therefore, a changed system configuration may not necessitate retoolmg of the entire chassis. Instead, one sub-chassis may be reused and only the other sub-chassis may be retooled. The front sub-chassis includes a first openmg 53 for a storage chamber or a peripheral bay unit 68 (Fig. 6B). The second openmg 19 allows ambient air to enter into the housmg 10 through the hard drive cage 67 (Fig. 6A) A metallic penpheral shelf 57 may extend from the front sub-chassis 51 to the rear sub-chassis 50 as is illustrated m Figs. 5A, 5B. The penpheral bay unit 68 may be placed over the penpheral shelf 57 (Figs. 6A, 6B), which provides support for the weight of the penpheral dnves as well as containment of any electromagnetic interference (EMI) generated in the vicinity of the penpheral shelf 57, for example, by the penpheral dnves mside the penpheral bay unit 68 and/or by one or more hard disk drives mside the hard drive cage 67. The rear sub-chassis 50 may include two openmgs 56 to mount the coolmg fan bracket 66 (Figs. 6A and 6B). The openmgs 56 may be provided at the junction of the front and the rear sub-chassis, as is shown m Fig. 5 A. The coolmg fans, therefore, may remam at a distance from the front 13 of the chassis 12 when mounted mside the openmgs 56. This may reduce transmission of audible emissions (from the coolmg fans m operation) to a user sitting adjacent to the front of the chassis. The back side of the rear sub-chassis 50 may mclude a predetermined number of openmgs 52 for I/O ports or connectors, and a power supply wmdow 54 to receive an external system power supply 118 (Fig. 12 A) for the entire computer housmg 10. Fig. 5B illustrates a disassembled view of the front and the rear sub-chassis. The rear sub-chassis 50 may compπse two portions: the front portion 62 and the back portion 64. The front portion 62 gets attached to the front sub-chassis 51 as is illustrated m Fig. 5B. Whereas, the back portion 64 is slid mside the front portion 62 and fastened to the front portion 62 with the help of a number of nvets 65. Additional fastenmg of the front and the rear portions of the rear sub-chassis 50 may be provided through various extruded features withm those portions and also with the help of additional fasteners, e.g., rivets, screws, nuts and bolts, toggle-lock features etc. The front sub-chassis 51 and the rear sub-chassis 50 may also be similarly fastened with each other. The power supply wmdow 54 is created when the rear portion 64 of the rear sub-chassis 50 is attached to the front portion 62 of the rear sub-chassis 50. Due to the confining of the system power supply mto a separate, closed chamber, the audible noise emissions from the system power supply may be reduced. Further, the shielding of other electronic components withm the housmg 10 from the effects of electromagnetic interference from the high-voltage power supply circuitry may effectively be reduced. Additionally, the compartmentalization approach illustrated through Figs. 5 A and 5B may facilitate easy removal and servicing of the system power supply, because an electromechanical component withm the high- voltage power supply unit 118 (Fig. 12A) may fail faster than the low power consummg electronic circuitry on a motherboard 113 (Fig 12A). Above all, the coolmg withm the housmg improves when the power supply is cooled mdependently of the other electronic components (e.g., fans 18D and 18E m Fig. 12A). The coolmg fans mounted m the openmgs 56 may not need to expend additional energy to cool the bulky power supply unit. Instead, a dedicated and focussed coolmg of vaπous electronic components may be accomplished as discussed later with reference to Fig. 12B Referring now to Fig. 6 A, a three-dimensional cut-out view of the computer system housmg 10 is shown. Vaπous computer system components, such as the penpheral bay unit or the peripheral dnve storage chamber 68, the hard disk dπve cage 67, the coolmg fan bracket 66, etc. are shown mounted on the chassis. The storage chamber 68 houses one or more storage dπves, e.g., the CD ROM (Read Only Memory) drive, the floppy disk drive, etc. The storage chamber is normally made of metal or components havmg similar strength to support the weight of the storage dπves. The hard disk dnve cage 67 may house one or more hard disk drives (not shown), and, preferably, may also mclude a SCSI (Small Computer System Interface) circuitry (not shown) for mterfacmg the hard disk dπve to one or more processors (not shown) housed withm the housmg 10. The hard disk dnve typically provides non-volatile auxiliary memory storage that is m addition to that provided by the system memory. The coolmg fan bracket 66 may house one or more coolmg fans (18A and/or 18B) to provide cooling for the heat generated by vaπous electronic parts when the computer system is powered on. Turning now to Fig. 6B, the computer system components shown mounted on the chassis 12 m Fig. 6A are shown m a disassembled view. The penpheral bay unit 68 may be inserted through the openmg 53 in the front sub- chassis 51, whereas the hard disk dπve cage 67 and the coolmg fan bracket 66 may be mounted on the front sub- chassis 51 from one of the sides as illustrated. The peripheral bay unit 68 may be securely fastened on/over the penpheral shelf 57, whereas the hard drive cage 67 may be fastened to the bottom of the front sub-chassis 51. Fasteners, such as adhesive tapes, rivets, screws, nuts and bolts, etc., may be used to securely mount these components on appropriate surfaces. The mounting of the coolmg fan bracket 66 and of each coolmg fan is descnbed below with reference to Fig. 6C. Fig. 6C depicts two views of the coolmg fan bracket 66. The fan bracket 66 is preferably a plastic structure that may house a maximum of two fans. The fan bracket 66 is formed of two halves: the top half 664 and the bottom half 665. The reference to the terms "top" and "bottom" here is m view of the actual installation of the bracket 66 as shown m Figs. 6A and 6B. Each half of the fan bracket 66 may be individually manufactured and later jomed with the other half through suitable fastener (mcludmg adhesive tapes) or snapped mto the other half. Preferably, the whole fan bracket 66 (mcludmg both of the halves) may be manufactured through a smgle mold. Each half of the fan bracket 66 has a fan entrance 661 through which a respective fan, 18A or 18B, may be snapped mto. The entire bracket 66 snaps mto the chassis frame at the junction of the front sub-chassis 51 and the rear sub-chassis 50 (Fig. 5A). The bracket 66 m Fig. 6C is first turned m a vertical position and then inserted mto the front sub-chassis 51 with the fan openmgs m the bracket 66 aligned with the openmgs 56 (Fig. 5A) m the rear sub- chassis 50. The bracket 66 is then snapped mto the chassis 12 at the junction of the front and the rear sub-chassis as shown m the assembled view m Fig. 6A. Each fan, 18A and 18B, also snaps mto the bracket 66 once the bracket is mounted on the chassis. Alternately, each fan may first be mounted on the bracket 66, and the complete assembly may then be snapped mto the chassis. In one embodiment, each coolmg fan 18 A, 18B is of 120 mm size. Each fan may be either a standard fan or a Japan Servo type fan. At the time of servicing, either fan (18A or 18B) may be individually removed and replaced without removmg the entire bracket 66 or without removmg the other fan. Thus, the bracket design allows mounting of two coolmg fans without screws. The bracket 66 also includes PCI card guides 662 (protruding from the bottom half 665 of the bracket) for long PCI cards mounted on a motherboard 113 (Fig. 12A). The PCI card guides 662 provide alignment support to such cards so that the card may remam firmly connected into the appropnate connector on the motherboard. Further, the bottom half 665 of the bracket may also mclude built-in cable routers 663 to securely route fan cables as well as other electrical cables m the vicinity of the bracket. This arrangement reduces wiring clutter withm the housmg, and therefore effectively optimizes the limited housmg space m a structured manner. Turning now to Fig. 7A, a detailed three-dimensional view of the penpheral bay unit or the storage chamber 68 is shown. The storage chamber 68 may mclude a cover plate 70 and a peripheral bracket 72. The cover plate 70 may be attached to the penpheral bracket 72 by reforming extruded features m the penpheral bracket 72. Any other suitable method of attachment may also be used to fasten the cover plate 70 to the penpheral bracket 72. The peripheral bracket 72 may be used as a cradle to house one or more storage drives that may be inserted through various openmgs or peripheral bays m the cover plate 70. The penpheral bracket 72 and the cover plate 70 may preferably be of metal. However, other matenals havmg sufficient strength to carry the weight of the storage dπves may also be utilized to make the penpheral bracket and the cover plate. Referring now to Fig. 7B, a penpheral assembly 78 with vaπous filler plates or EMI (electromagnetic mterference) shields — 73, 74, 75, and 76 — attached to the storage chamber 68 is shown at the nght hand side of the figure The left hand side of the figure shows a disassembled view of the fillers prior to bemg inserted or snapped into corresponding bays m the penpheral bay unit 68. The penpheral bay unit 68 may have one or more than one openmgs (or bays) to receive storage dπves for storage media of different sizes. For example, the top bay m the peripheral bay unit 68 m Fig. 7B may receive a CD ROM drive, whereas the bottom bay may receive a floppy disk dπve. Besides the top and the bottom bays, a typical computer system housmg generally provides two additional dedicated separate bays: one for a storage dπve for a 5.25" storage medium (e.g., 5.25" floppy diskette, CD ROM, etc.), and the other for a storage dπve for a 3.5" storage medium (e.g., 3.5" floppy diskette, data cartridge, etc.). The bay for the 5.25" storage dπve may not house a 3.5" storage dnve, and vice versa. Two separate bays may be unnecessary if a user, at some later pomt after purchasmg the computer system, may never insert both of the storage dnves. Additional openmgs may mcrease the size of the penpheral bay unit 68. In certain configurations of computer systems, it may be desirable to reduce the size of the penpheral bay unit 68. Therefore, the cover plate 70 for the penpheral assembly 78 in Fig. 7B is configured to have the central openmg adaptable to receive either a 5.25" storage dπve or a 3.5" storage dnve. Thus, a smgle openmg may be efficiently utilized for multiple dπves dependmg on the user's choice. The filler plate 73 may be utilized to enclose the top opening in the cover plate 70 until a corresponding storage dnve, e.g., a CD ROM dnve, is inserted therein. Similarly, the filler plate 76 may normally remam attached to or snapped mto the bottom openmg m the cover plate 70 until the insertion of, for example, a 3.5" floppy disk drive. The central bay, however, may be completely enclosed only when both of the filler plates, 74 and 75, are placed over it. The filler plate 74 remams normally detachably snapped mto the central openmg and partially encloses the central openmg. On the other hand, the filler plate 75 is configured to remam normally detachably snapped mto the filler plate 74, and not to the central openmg m the cover plate 70. Both of the filler plates, 74 and 75, completely enclose the central bay when placed over it. The shapes for the filler plates 74 and 75 may be rectangular (as shown m Fig. 7B), curved or any other suitable shape so long as the appropnate dπve (5 25" or 3.5") may be inserted as discussed below. Insertion of either a 3.5" or a 5.25" storage dπve mto the central bay may be earned out by removmg the appropnate filler plate. For example, when a user wants to insert a 3.5" storage dnve mto the central openmg, the user may only need to remove the filler plate 75. The filler plate 74 remams attached to the central openmg. On the other hand, when a user wishes to insert a 5.25" storage dnve mto the central bay, the user may need to remove the filler plate 74 from the central openmg. As the filler plate 75 is attached to the filler plate 74, the removal of the filler plate 74 may, therefore, result m the removal of the filler plate 75 also. Thus, both of the filler plates, 74 and 75, may need be removed from the central openmg when a 5.25" storage dnve is to be inserted. Preferably, the filler plates 73-76 are made of metal or metallic compound. The filler plates 74 and 75 may be the only plates that remam normally attached to the cover plate 70 when the housmg 10 is ready for shippmg. The remammg openmgs (i.e., the top and the bottom bays of the peripheral bay unit 68) may already contam corresponding storage drives at the time of shippmg of the computer system. Further, the removable penpheral bezel 15 (Fig. IB) with appropriate plastic cosmetic panels (similar m shape with the corresponding filler plate as shown m Fig. 8B) for the corresponding filler plates may be placed mto the front bezel 20 to provide a cosmetic cover for penpheral bays in the cover plate 70 at the time of shippmg of the computer system. Each filler plate, 73-76, is configured to function as an EMI shield when placed over the cover plate 70 to cover the corresponding penpheral bay. It is known that when the power is applied to vaπous electronic components, the electronic components generate electromagnetic radiation. Any uncovered or unfilled openmg m the cover plate 70 may result m the transmission of a significant portion of such electromagnetic radiation towards the user sitting adjacent to the computer housmg 10. The filler plates may thus be designed to effectively contam such electromagnetic radiation from spreadmg out of the housmg. Even when the housing 10 includes storage drives inserted m the top and the bottom openmgs m the cover plate 70, the filler plates (74 and 75) over the central openmg may still prevent outward emission of electromagnetic radiation generated by vaπous electronic components, mcludmg the storage dnves residmg m the top and the bottom bays of the penpheral bay unit 68. Turning now to Fig. 8A, the internal and external views of a lighted power button assembly 80 mounted on a penpheral bezel 15 are shown. A user turns the computer system power on/off with the help of the power button 17 that is a part of the power button assembly 80. The penpheral bezel 15 may also mclude one or more plastic cosmetic panels 82-85 to cover coπesponding openmgs m the cover plate 70 when respective penpheral storage dnves are absent. As mentioned earlier, the cosmetic panels 82-85 may still be snapped mto the penpheral bezel 15 (as illustrated m Fig. 8B) m the event that the openmgs m the cover plate 70 are covered by corresponding metal filler plates 73-76. The look of the front of the computer housmg may be improved with matchmg appearances of the penpheral bezel 15, the cosmetic panels 82-85, and the front bezel 20 (Fig. IB). Fig. 8B illustrates a disassembled view of the penpheral bezel 15 shown in Fig 8 A. The power button assembly 80 is shown to mclude two prmcipal parts: the power button unit 86 and the light pipe 88. Referring now to Fig. 9, a pan- of three-dimensional views of the power button unit 86 is shown. The power button unit 86 is mounted on the internal surface of the penpheral bezel 15 (Fig. 8A) with the help of horizontal 94B and vertical 94A wmgs The length and structure of the wings 94 may allow the wmgs to flex in response to the mward push of the power button 17 by a user. The flexing of the wmgs may provide the motion needed to actuate the power button 17. The power button may return to its oπgmal position with the help of an attached spring as discussed later. The wmgs may be attached to the internal surface of the penpheral bezel with the help of screws, adhesive tapes, or any similar fasteners The power button unit 86 mcludes a stationary member 90 and a slidmg member 92. The stationary member 90 remams immobile once the power button unit 86 is attached to the penpheral bezel. The slidmg member 92, however, slides within the stationary member when a user pushes the power button 17. The power button 17 may be molded as part of the slidmg member 92, which may be manufactured mdependently of the stationary member 90 and later inserted mto the stationary member 90 Alternately, the power button may be manufactured independently and then snapped into the slidmg member 92 before inserting the slidmg member mto the stationary member The power button unit 86 may be permanently mounted on the peripheral bezel 15 Therefore, removal of the peripheral bezel from the front bezel 20 may also remove the power button unit 86 away from the chassis, and, hence, may terminate the power on off operations through the power button 17 However, the replacement of the peripheral bezel 15 back mto the front bezel 20 allows the power button 17 to function effectively when the light pipe 88 is also inserted in the slidmg member 92 as discussed below Hence, the flexibility in removmg the peripheral bezel 15 away from the chassis is not affected by the attachment of the power button assembly 80 thereto The slidmg member 92 slides back and forth within the stationary member 90 with the help of an attached sprmg (not shown) The power button unit 86 mcludes an mtegral spring around the power button 17 One end of the spring is attached to the power button 17 itself, whereas the other end of the sprmg is attached to the internal surface of the peripheral bezel 15 to which the power button unit 86 is secured. In one embodiment, the sprmg is attached to the penpheral bezel via heatstakes. Because of the presence of a spring, the power button 17 returns to its normal position (l e., the position in which a maximum portion of the power button protrudes from the front of the penpheral bezel 15) after slidmg away from the normal position to the extended position m response to a push from a user When m the extended position, the power button (which is part of the slidmg member 92) establishes, albeit for a short duration, an electrical contact with a power switch (not shown) mounted on the front wall of the chassis behmd the power button assembly 80 The electπcal contact with the power switch is established with the help of the light pipe 88 as discussed below Once the electncal contact is established, the power button returns to its normal, front location because of the pulling force exerted by the sprmg. The user can therefore mm the computer system power on/off with the power button 17 Turning now to Fig. 10, front elevations for the corresponding three-dimensional views of the power button unit 86 m Fig. 9 are shown. The left drawmg m Fig 10 corresponds to the left three-dimensional view m Fig 9, and the nght drawmg m Fig. 10 coπesponds to the nght three-dimensional view in Fig 9. The slidmg member 92, the stationary member 90, and the light openmg 95 are clearly illustrated Fig 11 illustrates m different views the light pipe 88 that forms part of the power button assembly shown in Figs 8A-8B The light pipe 88 mcludes a hollow light tube 102 to which a number of support fins, 98A-98D, are attached The support fins allow the light pipe 88 to be securely snapped mto the slidmg member 92 of the power button unit 86 as is illustrated in Fig 8B The source of light may be a simple LED (light emitting diode) mounted on the front wall of the chassis behmd the power button assembly 80 For optimum light transmission, the light tube 102 is placed m straight line with the light source The light emitted from the LED enters the rear end 105 of the light pipe 88 and exits from the front end 104 of the light pipe When the light pipe is snapped mto the slidmg member 92, the front end of the light pipe is automatically positioned immediately behmd the light openmg 95 m the power button 17 (Fig 9) Thus, optimum light transmission from the source of the light to the user is achieved The light pipe 88 also mcludes a striking rod 100 that may be a part of one or more of the support fins, e g , support fins 98 A, 98C and 98D m Fig 11 The striking rod 100 momentaπly establishes an electπcal contact with the power switch circuitry (not shown) mounted on the chassis behmd the power button assembly 80 A vertical extension that forms the striking rod 100 may be necessary when the actuation direction of the power button 17 is m lme with the source of light In other words, the power switch may not occupy the same place as the source of light Therefore, the power switch may be placed above or below the source of light and adjacent to it on the front wall of the chassis behmd the power button assembly 80 In the embodiment where the power switch is placed below the source of light, the striking rod 100 may be a downward vertical extension of one or more of the support fins The opposite may be true where the power switch is placed above the source of light When a user pushes the power button 17, the slidmg member 92 stretches toward the power switch (not shown) on the chassis The light pipe 88 therefore also slides toward the power switch, and the striking rod 100 makes an electπcal contact with the power switch before the slidmg member (and, hence, the light pipe) slides away from the power switch because of the pull exerted by the mtegral sprmg m the power button unit 86 The striking rod 100 may be an mdependent appendage to the light tube 102, mstead of a part of one or more fins as discussed before With every push of the power button 17, the striking rod 100 strikes the power switch plunger (not shown), thereby turning on off the system power as well as the light from the source of light The back and forth movement of the light pipe 88 does not affect the central alignment of the hollow light tube 102 with reference to the light openmg 95 Thus, the light tube 102 stays m lme with the light openmg 95 once the light pipe 88 is snapped mto the slidmg member 92, irrespective of the back and forth movement of the slidmg member 92 m response to the movement of the power button 17 by a user The complete light pipe assembly, mcludmg the light tube and support fins, may be made of clear polycarbonate mateπal The power button unit 86, mcludmg the power button 17, may be manufactured with PC/ABS matenal Referring now to Fig 12A, a disassembled view of the computer system housmg 10 showing locations and placement of vaπous system components is shown The system power supply 118 may be separately placed on one side of the rear sub-chassis 50 (Fig 5 A) as discussed earlier The nght access panel 14A may then be attached to the chassis 12 to provide an aesthetic cover for the housmg, and also to provide support durmg transportation of the housmg 10 Similarly, the left access panel 14B and the top access panel 16 may be placed over the chassis 12 pπor to shippmg the housmg 10 The access panels 14 A, 14B and 16, may be made of plastic The front bezel 20 is shown attached to the chassis with the chassis cover 19A (not clearly visible) placed in-between Appropnate filler plates 73-76 (Fig 7B) may be removed from the penpheral assembly 78 while msertmg coπespondmg penpheral storage dnves For example, the bottom filler plate 76 (Fig 7B) may be removed to insert a 3 5" floppy disk dπve 123, whereas the top filler plate 73 (Fig 7B) may be removed to insert a CD ROM dπve 124 or an empty casmg for a CD ROM dnve 119 (with the dnve bemg inserted later). The penpheral storage dπves and the penpheral assembly may be covered with the front bezel 20 and with the penpheral bezel 15. The power button 17 and the power button assembly 80 (not visible m Fig. 12 A) may also be included as part of the penpheral bezel 15. The hard drive cage 67 carrying one or more hard drives 114, and, preferably, some SCSI logic may be placed at the front of the chassis 12. The computer system shown m Fig. 12A may be a workstation or may simply be a regular personal computer (PC). The coolmg fan bracket 66 is shown snapped mto the chassis behmd the hard dnve cage 67 with two coolmg fans 18 A, 18B snapped mto the bracket 66. One air guide 30 per coolmg fan 18 A, 18B may be snapped mto the bracket 66 and m front of the respective fans with the mouth portion 34 (Fig. 3 A) of each air guide directed toward the components to be cooled. An additional coolmg fan 18C may be provided on the rear wall of the chassis 12 as is illustrated m Fig. 12A. The coolmg of the entire system is discussed later with reference to Fig. 12B. Fig. 12A also shows a motherboard 113 with a number of components that may be mounted on the motherboard either pnor to or after the motherboard is securely mounted on the right wall of the chassis 12 created by the back portion 64 (Fig. 5B) of the rear sub-chassis 50. For example, one or more memory modules 122 may be inserted perpendicularly to the motherboard 113 via appropnate connectors on the motherboard 113. The memory modules 122 may be volatile or non- volatile, and may mclude one or more SIMM modules (Smgle In- lme Memory Module). Vanous audio and video cards, e.g., the graphics card 110 and the audio module 116 may be inserted onto the motherboard for multimedia applications. As discussed before, any long PCI card, e.g., the graphics card 110, may get additional support and alignment through the PCI card guides 662 (Fig. 6C) provided on the bottom half 665 of the coolmg fan bracket 66. A power converter 117 (e.g., from high voltage DC to low voltage DC) may reside on the motherboard for supplymg the requisite power required by relatively low-power consummg circuit components on the motherboard 113. A sheet metal stiffener (not visible in Fig. 12 A) may provide a back plane support for the large sized motherboard 113. The stiffener may be at least of the size of the motherboard 113, and may rest between the motherboard 113 and the chassis wall on which the motherboard is mounted. This aπangement may provide better board to chassis groundmg as well as better overall support for the motherboard durmg installation, mamtenance and transportation of the motherboard or of the entire housmg 10. The back plane support provided by the stiffener may reduce damage to the motherboard due to pressures exerted durmg component mountmg, for example, when the motherboard is already installed on the chassis. Additionally, as a motherboard generally cames heavily dense electronic circuitry and components, a stiffener may facilitate easy mountmg or removal of the motherboard from the chassis without damage to the motherboard's printed circuit paths or board material. The stiffener for the motherboard may thus provide the needed back plane support given the large size and heavy loading of the motherboard. Other circuit boards m the housmg 10 may also have similar stiff eners between them and the corresponding chassis walls so as to provide secure and πgid back plane supports. A shroud 111 that houses a number of central processmg units (CPUs) or processors may also be mounted on the motherboard 113 m a way that mamtams tight connections between the modules 112 carrying the processmg units and the coπespondmg connectors on the motherboard 113 for each module in the set of modules 112. The shroud 111 may support more than one modules 112. For example, the shroud 111 m Fig. 12A supports up to four CPU modules 112. The shroud 111 m Fig. 12A is constituted of four plastic parts that are heatstaked together to form the shroud frame. Further, each plastic part constituting the shroud 111 mcludes pertinent features that facilitate mountmg of the shroud 111 onto the motherboard as well as mountmg and support of airblocks 115, πser card 120 and the air guide 30 as discussed below As mentioned earlier, the air guide 30 may be mounted on the coolmg fan 18A to provide channeling of the coolmg air towards CPU modules 112. The air guide thus prevents the air coming out of the fan 18A to be wasted in other channels withm the housmg 10. The neck portion 32 (Fig. 3 A) of the air guide 30 snaps mto the fan bracket 66 and m front of the fan 18A. However, the mouth portion 34 (Fig. 3A) of the an- guide 30 may be configured to snap mto the coπespondmg features provided along the right hand side (i.e., the side adjacent to the mouth portion of the air guide) of the shroud 111 without requiring any tools or fixtures. This aπangement supports the air guide 30 and mamtams it m its place and m very close proximity with the CPU modules 112 even duπng transportation or shiftmg of the housmg 10 Further, the air guide, when mounted m such a manner, balances the airflow across all of the four modules 112 so that all modules are cooled equally In other words, a dedicated arr channel is mamtamed from the coolmg fan 18A to all of the CPU modules 112 A schematic representation of such an aπangement is shown m Fig. 12B. In the event that the number of modules 112 loaded with CPUs is less than what the shroud 111 can accommodate, an arrblock 115 may be inserted mto the appropnate empty slot withm the shroud 111 to prevent coolmg air (coming out of the mouth of the air guide 30) from bemg shunted m the empty slot. Thus, for example, when three of the four modules 112 m Fig. 12A contam processors and the fourth module has no processor loaded therein, then an arrblock 115 may be inserted mto the shroud 111 m place of the fourth module so as to prevent wastage of coolmg air. Each arrblock 115 has front and nght hand side edges (l e , the edge that faces the mouth portion of the an" guide 30) raised so that coolmg an from the air guide 30 may not enter mto the slot m the shroud 111 contammg the arrblock. However, each airblock 115 has a central openmg that allows vertical airflow withm the shroud. Further, due to the absence of a raised edge at the left side (i.e., the side facmg the rear of the chassis) of an arrblock 115, an exit passage for the coolmg air is not blocked. This mamtams contmuous air circulation withm the housing 10 One way to optimize the density of components packed withm the housmg 10 may be to use a πser card 120. The nser card 120 carnes additional memory modules 122 to expand the memory capacity of the motherboard 113 Fig 12A shows the memory modules mounted on the πser card 120 to be of the same type as those directly mounted on the motherboard 113. However, m one embodiment, the two modules may be of different types The riser card 120 is mounted in perpendicular to the plane contammg the motherboard 113. Additional memory slots are provided on the riser card 120 to accommodate memory modules 122. After the CPU shroud 111 has been mounted on the motherboard 113, the nser card 120 may be inserted on top of the shroud 111 through the guide features (not visible) provided on the top of the shroud 111. These guide features provide proper alignment of the nser card dual- in-line matmg connectors with the coπespondmg slots on the motherboard 113 The nser card 120 may also mclude two torque-limiting screws 121 supported through screw mount brackets securely placed on the coπespondmg edges of the nser card The nser card 120 may be screwed on top of the shroud 111 with the help of the torque-limiting screws. The torque-limiting screws 121 allow the nser card 120 to be secured on top of the shroud 111 and also mto the appropnate slots on the motherboard 113 without any damage to its conducting edges. The torque- limiting screws 121 may prevent "over tightening" of the nser card 120 mto the connecting slots on the motherboard 113 by limiting the tightenmg of the screws 121 beyond a predetermmed torque limit. Any additional torque applied by the person mountmg the πser card may result m the "slipping" of the corresponding torque-lrmiting screw 121. In other words, additional torque may simply rotate the head of the coπespondmg torque-limiting screw 121, but no spiral movement of the threads of the torque-limiting screw may occur (1 e., further tightening of the screw 121 may be prevented). Due to the torque-limiting screws 121 and due to the guide features (for proper alignment of the nser card 120 connectors with the coπespondmg slots on the motherboard 113) on the shroud 111, the nser card 120 fits snugly mto coπespondmg slots on the motherboard 113 Fig. 12A illustrates a situation where due to the specific alignment and placement of slots on the motherboard 113, a vertical space is created between the top of the shroud 111 and the memory module 122 that can be inserted nearest to the shroud 111 on the motherboard 113. In the absence of the πser card 120, this vertical space may get wasted. Further, no additional coolmg is required to channel coolmg air through this vertical space because that vertical space may already fall under a coolmg channel created by the fan 18C as is explamed later m view of Fig. 12B. Therefore, it is desirable to fill the vertical space above the shroud 111 so as to optimize the density of components on the motherboard 113 and also withm the housmg 10. As can be seen from Fig. 12A, the nser card 120 is mounted on the shroud 111 beneath the stack of the memory modules 122 (which are directly mounted on the motherboard 113) and m parallel to the motherboard memory modules. Whereas, the memory modules inserted on the πser card 120 remam vertical and perpendicular to the memory modules directly mounted on the motherboard 113 Therefore, additional memory is provided m a space savmg, vertical and modular fashion through the riser card aπangement. The modular form factor of the riser card 120 and the securmg of the nser card 120 with the help of the torque-limiting screws 121 provide mdependent insertion/removal (from the shroud 111 and the motherboard 113) of the riser card 120 for servicing. Turning now to Fig 12B, a simplified block schematic for the air coolmg of the housmg m Fig. 12A is illustrated. The top schematic shows coolmg arrangement for the power supply umt 118, whereas the bottom schematic shows cooling aπangement for other components within the housmg 10 excludmg the system power supply 118 The power supply 118 may provide up to 600 watts to the system, and may itself dissipate about 300- 400 watts. Therefore, a total of 1000 watts of power may be dissipated withm the housmg 10 The power supplied to the system may be consumed by a number of system components For example, the system may mclude: two full high hard drives 114 m the hard dπve cage 67 m front of the chassis; a motherboard 113 with up to four CPU plug- in modules 112, up to two UPA (Ultra Port Architecture) high-bandwidth graphics cards and other additional PCI cards, fully stacked memory modules (both on the motherboard and on the riser card 120); up to three removable penpheral dπves in the penpheral assembly 78 (with appropnate filler plates 73-76 removed), etc. The heat generated withm the system may be significant m view of the large amount of power consumed and m view of the dense packmg of a large number of electronic components withm the limited housmg space. The coolmg of the entire computer system may be managed by five fans as shown m Fig. 12B. The coolmg fans 18D and 18E may draw the ambient air surrounding the front of the power supply 118 through vents m nght access panel 14A. In one embodiment, some or all of the channel ends 46 (Figs. 4A, 4B) in the nght access panel 14A constitute vents along the front side of the mdented portion (i.e., the portion that covers the power supply unit 118). These vents allow the ambient an to enter mto the system power supply 118 through the drawmg force exerted by the coolmg fans 18D and 18E. The drawn air, once mside the power supply unit 118, is pushed (by the rotatmg fans 18D and 18E) past the vaπous components m the system power supply 118 before it exits through the vents provided on the rear end of the system power supply 118. Two air channels (as illustrated m Fig. 12B) may be created withm the power supply 118 coveπng the entire power supply mtenor duπng coolmg. Thus, the coolmg of system power supply 118 is managed mdependently of the coolmg of the remamder of the computer system as is illustrated through Figs 12A and 12B. Each of the coolmg fans 18D and 18E may be an 80mm standard fan or it may have a Japan Servo configuration The coolmg aπangement for the motherboard, the hard dπves, the CPUs, the memory modules, the penpheral dnves, etc. is shown m the bottom schematic m Fig. 12B. Three coolmg fans may be employed to maintain appropnate coolmg channels (illustrated by dotted aπows m Fig 12B) withm the housmg 10. The sideways air mlets 11 (Fig. 1A) created by the curved bezel 20 allow ambient an m front of the housmg to be drawn into the housmg with the help of the coolmg fans 18A-18C. The coolmg fan 18B draws an from the front sub-chassis 51 (through the sideways air mlets 11) past the hard drive cage 67 (thus coolmg the hard dnves withm the cage 67), and pushes the an over one or more PCI cards 110 mounted on the motherboard 113 before forcmg the air out of the vents in the rear sub-chassis 50. An air guide 30B may be mounted m front of the coolmg fan 18B and m close proximity to the PCI cards 110 so as to effectively channel the air flow over the PCI logic portion of the motherboard 113 The cooling fan 18B may be a 120 mm standard fan or it may have a Japan Servo configuration as mentioned earlier. The coolmg fan 18A similarly draws air from the front sub-chassis 51 (through the sideways air mlets 11) past the hard drive cage 67 (thus coolmg the hard dπves m the process), and pushes the air through the CPU shroud 1 1 1 mounted on the motherboard 113 before forcmg the an- out of the vents m the rear sub-chassis 50 As discussed earlier, an air guide 30A may be mounted m front of the coolmg fan 18A (on the fan bracket 66, Fig. 12A) and the mouth portion of the air guide 30A may be snapped mto the right-hand side (i.e., the side nearest to the mouth portion of the air guide 30A) of the shroud 111. The top edge of the mouth portion of the air guide 30A rests just below the bottom of the riser card 120. The extremely close proximity of the air guide 30A to the shroud 111 mamtams a consistent cooling environment for the crucial elements of the computer system, i.e , the processors. The airflow channel over the modules 112 (Fig. 12A) carrying processors remams heavy and concentrated around the shroud area, resultmg in a dedicated coolmg environment for the processors. The coolmg fan 18A may also be a 120 mm standard fan or it may have a Japan Servo configuration. The placement of the coolmg fans 18A and 18B at the junction of the front and the rear sub-chassis allows for a creation of dedicated channels of coolmg air extendmg lengthwise along a substantial portion of the mtenor of the housmg 10 as the dotted aπows in Fig 12B illustrate Furthermore, the removal of the relatively larger coolmg fans 18A, 18B from the immediate vicinity of the front wall 13 (Fig IB) of the chassis 12 reduces outward emissions of noise generated by these fans. Thus, the exposure of a large portion of the front wall 13 of the chassis 12 (through the curved bezel 20) to the surrounding air is balanced by the movmg back of the fans 18A, 18B towards the mtenor of the housmg so as to mamtam low noise emissions. The sideways air mlets 11 also allow for more ambient airflow mto the housmg, reducing the coolmg burden on the fans 18A-18C The fifth coolmg fan 18C may be attached to the top (Fig. 12A) of the back side (internal) of the rear sub- chassis 50 This fan may be of smaller size than the centrally mounted fans 18A, 18B. In one embodiment, the cooling fan 18C is an 80mm standard fan or has a Japan Servo configuration. The coolmg fan 18C draws air from the front sub-chassis 51 (through the sideways air mlets 11) past the penpheral bay unit 68 (thus coolmg any penpheral dnves present m the peripheral bay unit), through the memory modules 122 (mcludmg both, those mounted directly on the motherboard 113 as well as those mounted on the πser card 120) and through the power converter 117 (Fig. 12A) before forcmg the an out of the vents m the rear sub-chassis 50. The foregomg discloses a computer housmg configuration where a curved front bezel allows for creation of sideways air gaps along the front wall of the chassis, resultmg m ambient air flow mto the housmg through a larger surface area on the front wall of the chassis The placement of coolmg fans and air guides as well as the sideways air flow configuration provide adequate and efficient component coolmg without undue multiplicity of cooling fans and without sacnficmg component packmg density withm the housmg Furthermore, the compartmentalized chassis structure allows flexibility in chassis reconfiguration without compromismg system coolmg efficiency While the mvention is susceptible of vanous modifications and alternative forms, specific embodiments thereof are shown by way of examples m the drawmgs and are herem descnbed m detail It should be understood, however, that the drawmgs and detailed descπption thereto are not mtended to limit the mvention to the particular forms disclosed, but on the contrary, the mtention is to cover all such modifications, equivalents and alternatives as may fall withm the spiπt and scope of the present mvention as defined by the appended claims

Claims: What is claimed is: 1. A computer system housmg compπsmg: a chassis, a first circuit board mounted on a wall of said chassis, wherein said first circuit board compnses: one or more first sockets mounted on said first circuit board, one or more first memory cards, wherem each of said one or more first memory cards is inserted mto a coπespondmg one of said one or more first sockets, wherem upon insertion said each of said one or more first memory cards is oπented substantially perpendicularly to said first circuit board, and a second socket mounted on said first circuit board and m parallel to said one or more first sockets; and a second circuit board inserted mto said second socket and m parallel to said one or more first memory cards, wherem said second circuit board compnses' one or more third sockets mounted on said second circuit board, and one or more second memory cards, wherein each of said one or more second memory cards is inserted mto a coπespondmg one of said one or more third sockets, and wherem upon insertion said each of said one or more second memory cards is oriented substantially perpendicularly to said second circuit board and remams m a vertical space between said second circuit board and one of said one or more first memory cards that is inserted nearest to said second circuit board on said first circuit board 2. The computer system housmg as m claim 1, further compnsmg. a shroud mounted on said first circuit board, wherem the top of said shroud is aligned to said second socket, and wherem said second circuit board is screwed on the top of said shroud as part of insertion thereof mto said second socket. 3 The computer system housmg as m claim 2, wherem said first circuit board is a computer system motherboard. 4. The computer system housmg accordmg to claim 3, wherem said motherboard compnses one or more fourth sockets mounted thereon, said computer system housmg further compnsmg one or more processor modules housed withm said shroud, wherem each of said one or more processor modules is inserted mto a coπespondmg one of said one or more fourth sockets. The computer system housmg of claim 3, further compnsmg- a support frame positioned between said motherboard and said wall of said chassis, wherem said support frame is mounted on said wall of said chassis and said motherboard is mounted on said support frame, and wherem said support frame is of substantially the same size a said motherboard. The computer system housmg accordmg to claim 5, wherem said support frame is constructed of sheet metal The computer system housmg as m claim 3, wherem said chassis compnses a front sub-chassis formed of a first plurality of walls, and a rear sub-chassis formed of a second plurality of walls, wherem said wall of said chassis is a first one of said second plurality of walls, wherein said rear sub-chassis is fastened to said front sub-chassis, and wherem a second one of said second plurality of walls partitions said front and said rear sub- chassis when said rear sub-chassis is fastened to said front sub-chassis The computer system housing of claim 7, further compnsmg- one or more coolmg fans, wherem said second one of said second plurality of walls mcludes one or more wmdows therein, and wherem each of said one or more coolmg fans is housed withm a coπespondmg one of said one or more windows A computer system housmg compnsmg a chassis, a plurality of computer system components mounted on said chassis, wherem said plurality of computer system components mcludes one or more coolmg fans; and a bezel attached to a front of said chassis, wherem said bezel forms a first sideways gap between said front of said chassis and said bezel, wherem said first sideways gap extends from said front of said chassis to a first predetermmed width and stretches to a first predetermmed length along said front of said chassis, thereby allowing ambient coolmg an- to be sucked mto said chassis through said first sideways gap upon activation of said one or more coolmg fans The computer system housmg as in claim 9, wherem said bezel is curved along said first predetermmed length The computer system housmg accordmg to claim 9, wherem said bezel forms a second sideways gap between said front of said chassis and said bezel, and wherem said second sideways gap extends from said front of said chassis to a second predetermmed width and stretches to a second predetermmed length along said front of said chassis, and wherem said second sideways gap further allows said ambient coolmg air to be sucked mto said chassis upon said activation of said one or more coolmg fans The computer system housing of claim 9, wherem the edge of said bezel at said first sideways gap is lmear along said first predetermmed length, thereby keepmg said first predetermmed width constant over said first predetermmed length The computer system housmg accordmg to claim 9, wherem the surface of said bezel is configured to have a curvamre along said first predetermmed length, thereby contourmg said first predetermmed width to said curvature The computer system housmg of claim 9, wherem the edge of said bezel at said first sideways gap has a curvamre along said first predetermmed length, thereby contourmg said first predetermmed width to said curvamre The computer system housing as m claim 9, further comprising a chassis cover with a net formed therein, wherem said net compnses a plurality of openmgs distnbuted thereover, and wherem said chassis cover is inserted between said front of said chassis and said bezel The computer system housmg as m claim 9, wherem said chassis compnses a front sub-chassis, wherem a first wall of said front sub-chassis constitutes said front of said chassis, and a rear sub-chassis fastened to said front sub-chassis, wherein said rear sub-chassis is configured to house a motherboard and a power supply The computer system housmg of claim 16, wherein said rear sub-chassis compnsmg a first portion, wherem a second wall of said first portion constitutes a first side of said chassis, and a second portion inserted mto said first portion and fastened thereto, wherem a third wall of said second portion constitutes a second side of said chassis with said motherboard mounted thereon, and wherem said power supply is housed m an openmg created between said first side and said second side upon insertion of said second portion mto said first portion A computer system chassis compnsmg a front sub-chassis formed of a first plurality of walls, and a rear sub-chassis formed of a second plurality of walls, wherem said rear sub- chassis is configured to be fastened to said front sub-chassis, and wherein a first one of said second plurality of walls partitions said front and said rear sub-chassis when said rear sub-chassis is fastened to said front sub-chassis The computer system chassis as m claim 18, wherem said rear sub-chassis compnsmg a first portion mcludmg said first one of said second plurality of walls, and a second one of said second plurality of walls, and a second portion configured to be inserted mto and to be fastened to said first portion, wherem said second portion mcludes a third one of said second plurality of walls, wherem said third one of said second plurality of walls and said second one of said second plurality of walls form two sides of an enclosure created upon insertion of said second portion into said first portion The computer system chassis of claim 19, wherem said enclosure is configured to house a power supply unit The computer system chassis accordmg to claim 18, wherem said first one of said second plurality of walls includes one or more windows therem, wherem each of said one or more windows is configured to house a coπespondmg coolmg fan The computer system chassis of claim 18, wherem a first one of said first plurality of walls has a gπd formed therem of a plurality of openmgs The computer system chassis as m claim 18, further compnsmg a chassis cover with a grid formed therem of a plurality of openmgs, wherem said chassis cover is configured to be attached to a first one of said first plurality of walls The computer system chassis accordmg to claim 18, further compnsmg a penpheral assembly attached to a first openmg m a first one of said first plurality of walls of said front sub-chassis, wherem said penpheral assembly compnsmg an access panel that compnses a second openmg to allow a first storage drive to be inserted therethrough mto said first opening, wherem said first storage dπve is one of the following a storage dπve for a 5 25" storage medium, and a storage dnve for a 3 5" storage medium, a first filler plate configured to be detachably attached to said second openmg and to partially enclose said second openmg when attached thereto, wherem said first filler plate is detached from said second openmg when said storage dπve for said 5 25" storage medium is to be inserted mto said first openmg, and a second filler plate configured to be detachably attached to said first filler plate, wherem said first and said second filler plates completely enclose said second openmg when said first filler plate is attached to said second openmg and said second filler plate is attached to said first filler plate, wherem said second filler plate is detached from said first filler plate without detachmg said first filler plate from said second openmg when said storage dnve for said 3.5" storage medium is to be inserted mto said first openmg

Inventors: BARNES RONALD, FURUTA STEVE J, KITLAS KENNETH, LAJARA ROBERT J, LAM ALAN, LEE MILTON C, LEE WAYMAN, LEUNG WINNIE, LOWN KENNETH A, MARSHALL BARRY, NISHTALA SATYANARAYANA, PATEL ANITA, TANTOUSH MOHAMMED, WINICK ALAN LEE, BARNES, RONALD, FURUTA, STEVE, J., KITLAS, KENNETH, LAJARA, ROBERT, J., LAM, ALAN, LEE, MILTON, C., LEE, WAYMAN, LEUNG, WINNIE, LOWN, KENNETH, A., MARSHALL, BARRY, NISHTALA, SATYANARAYANA, PATEL, ANITA, TANTOUSH, MOHAMMED, WINICK, ALAN, LEE
Applicants: SUN MICROSYSTEMS INC, SUN MICROSYSTEMS, INC.
Application year: 2000
Main classification: G06F1
IPC codes: G06F1