METHOD AND SYSTEM FOR CLEANING A CHEMICAL MECHANICAL POLISHING PAD

Abstract: A method and a system are provided for cleaning a CMP pad. The method starts by applying chemicals onto the surface of the CMP pad. The chemicals are then allowed to react with a residue that may be on the pad to produce by-products. Next, the pad surface is rinsed to substantially remove the by-products. A mechanical conditioning operation is then performed on the surface of the pad. In one example, the wafer surface can be a metal, such as copper. Where the wafer surface is copper, the chemical is most preferably HC1, and a solution includes HC1 and DI water. Where the wafer suface is oxide, the chemical is most preferably NH4OH and the solution includes NH4OH and DI water. Generally, the CMP pad can be in the form of a linear belt, in the form of a round disk, or in any other mechanical or physical configuration.

Description: METHOD AND SYSTEM FOR CLEANING A CHEMICAL MECHANICAL POLISHING PAD BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to chemical mechanical polishing (CMP) techniques and related wafer cleaning and. more particularly, to improved CMP operations. 2. Description of the Related Art In the fabrication of semiconductor devices, there is a need to perform chemical mechanical polishing (CMP) operations and wafer cleaning. Typically, integrated circuit devices are in the form of multi-level structures. At the substrate level, transistor devices having diffusion regions are formed. In subsequent levels, interconnect metallization lines are patterned and electrically connected to the transistor devices to define the desired functional device. As is well known, patterned conductive layers are insulated from other conductive layers by dielectric mateπals. such as silicon dioxide As more metallization levels and associated dielectric layers are formed, the need to planaπze the dielectric mateπal grows. Without planaπzation, fabπcation of further metallization layers becomes substantially more difficult due to the higher vaπations in the surface topography. In other applications, metallization line patterns are formed in the dielectric mateπal, and then, metal CMP operations are performed to remove 'excess metallization. After any such CMP operation, it is necessary that the planaπzed wafer be cleaned to remove particulates and contaminants. Figure 1 shows a schematic diagram of a chemical mechanical polishing (CMP) system 14. a wafer cleaning system 16, and post-CMP processing 18. After a semiconductor wafer 12 undergoes a CMP operation in the CMP system 14, the semiconductor wafer 12 is cleaned in a wafer cleaning system 16 The semiconductor wafer 12 then proceeds to post- 2 CMP processing 18, where the wafer may undergo one of several different fabπcation operations, including additional deposition of layers, sputteπng, photolithography, and associated etching. A CMP system 14 typically includes system components for handling and polishing the surface of the wafer 12. Such components can be, for example, an orbital polishing pad, or a linear belt polishing pad. The pad itself is typically made of a polyurethane mateπal. In operation, the belt pad is put in motion and then a slurry mateπal is applied and spread over the surface of the belt pad. Once the belt pad having slurry on it is moving at a desired rate, the wafer is lowered onto the surface of the belt pad. In this manner, wafer surface that is desired to be planaπzed is substantially smoothed, much like sandpaper may be used to sand wood. The wafer is then sent to be cleaned in the wafer cleaning system 16 It is important to clean a semiconductor chip after a semiconductor wafer 12 has undergone a CMP operation in a chemical mechanical polishing (CMP) system 14 because particles, particulates and other residues remain on the surface of the semiconductor wafer 12 after the CMP operation. These residues may cause damage to the semiconductor wafer 12 in further post-CMP operations. The residues may, for example, scratch the surface of the wafer or cause inappropπate interactions between conductive features. Moreover, several identical semiconductor chip dies are produced from one semiconductor wafer 12. One unwanted residual particle on the surface of the wafer duπng post-CMP processing can scratch substantially all of the wafer surface, thereby ruining the dies that could have been produced from that semiconductor wafer 12. Such a mishaps in the cleaning operation may be very costly. Better cleaning of the wafer can be achieved in the wafer cleaning system 16 by improving the processes used in the CMP system 14 before the wafer even gets to the wafer cleaning system 16. The CMP system 14 can be improved for the next wafer by conditioning the surface of the belt pad. Pad conditioning is generally performed to remove excess slurry and residue build-up from the clogged belt pad. As more wafers are polished, the belt pad will collect more residue build-up which can make efficient CMP operations difficult. One well-known method of conditioning the belt pad is to rub the belt pad with a conditioning disk. The conditioning disk typically has a nickel-plated diamond gπd or a nylon brush over its surface. The diamond gπd is typically used to condition belt pads 3 having a hard surface. In contrast, the nylon brush is typically used to condition belt pads having a softer surface. The conditioning of the belt pad may be done m-situ, where the belt pad is conditioned while the belt pad is polishing the wafer, or ex-situ, where the belt pad is conditioned when the belt pad is not polishing a wafer. While conditioning disks remove slurry and residue, they inevitably remove some of the belt pad surface. Of course, removal of the belt pad surface exposes a fresh layer of the belt pad, thus increasing the polishing rate duπng CMP. Unfortunately, removal of the belt pad surface using conventional conditioning methods causes the belt pad to wear out quickly, thereby dπving up the cost of running the CMP system 14. On the other hand, if the belt pad is under-conditioned, the life of the belt pad may increase because less of the belt pad is removed However, residual clogging mateπals will be left on the belt pad surface Thus, the belt pad will generally not polish at an efficient rate and the CMP itself will not be of a very high quality. For the aforementioned reasons, techniques for conditioning the belt pad are an important part of the semiconductor chip fabπcation process. There is therefore a need for improved methods of conditioning the belt pad. SUMMARY OF THE INVENTION Broadly speaking, the present invention fills these needs by providing an improved method for conditioning a chemical mechanical polishing (CMP) pad and a system for implementing the same. The method involves a chemically treating and mechanically scraping the CMP pad. It should be appreciated that the present invention can be implemented in numerous ways, including as a process, an apparatus, a system, a device or a method. Several inventive embodiments of the present invention are descπbed below. In one embodiment, a method is disclosed for conditioning a CMP pad that has already been used for performing a CMP operation on a wafer surface and that already has a residue on its surface. The method starts by applying chemicals onto the surface of the CMP pad The chemicals are then allowed to react with the residue to produce a by-product. Next, the pad surface is πnsed to substantially remove the by-product. A mechanical conditioning operation is then performed on the surface of the pad. In one aspect of this embodiment, a portion of the wafer surface can be a metal, such as copper. Where the wafer surface is 4 copper, the chemical is most preferably HC1, and the solution is HC1 and DI water If the wafer surface is pπmaπly oxide, the chemical is NH OH, and the solution is NH OH and DI water. In another embodiment, a method is disclosed for conditioning a CMP pad, where the CMP pad has a residue on a surface of the CMP pad. The method starts by applying chemicals onto the surface of the CMP pad. The pad surface is then πnsed to substantially remove the applied chemicals and the residue. In one aspect of this embodiment, the chemicals are generally allowed to react with the residue for a peπod of time in order to produce a by-product, which is πnsed. Once πnsed, the embodiment can also include performing a mechanical conditioning operation on the surface of the pad before a next wafer is placed through a CMP operation. In yet another embodiment, a CMP system that has a CMP pad surface having a residue on it is disclosed. The CMP system includes a holding surface for receiving the CMP pad. Also included is a polishing head for holding and applying a wafer to the CMP pad surface The system further includes a chemical dispenser for applying pad conditioning chemicals to the CMP pad surface. The pad conditioning chemicals are preferably configured to substantially remove the residue from the CMP pad surface. In one aspect of this embodiment, the CMP pad can be in the form of a linear belt, m the form of an orbital disk, or in any other mechanical or physical oπentation. Advantageously, by conditioning a CMP pad in accordance with any one of the embodiments of the present invention, the CMP pad will be able to provide more efficient and cleaner polishing operations over wafer surfaces (e.g., metal and oxide surfaces). Furthermore, because the wafers placed through a CMP operation using a well conditioned pad are cleaner, subsequent wafer cleaning operations will also yield improved cleaning parameters. As a result of the improved CMP and cleaning operations, the wafers and resulting integrated circuit devices may also be of higher quality and, therefore, more reliable. Other aspects and advantages of the present invention will become apparent from the following detailed descπption, taken in conjunction with the accompanying drawings, illustrating by way of example the pπnciples of the present invention. 5 BRIEF DESCRIPTION OF THE DRAWINGS The present invention will be readily understood by the following detailed descπption in conjunction with the accompanying drawings. To facilitate this descπption, like reference numerals designate like structural elements. Figure 1 shows a schematic diagram of a chemical mechanical polishing (CMP) system, a wafer cleaning system, and post-CMP processing. Figure 2 shows a top-down view of a CMP and cleaning unit, in accordance with one embodiment of the present invention. Figure 3A shows an enlarged view of a CMP system, in accordance with one embodiment of the present invention Figure 3B shows how the cleaning process may be significantly improved by chemically treating a linear belt polishing pad before a conditioning disk is used to scrape the linear belt polishing pad, in accordance with one embodiment of the present invention. Figure 4A shows a cross-sectional view of a semiconductor wafer having a copper layer deposited over the top surface of the wafer. Figure 4B shows a cross-sectional view of a semiconductor wafer after its top surface has been polished duπng a CMP operation to form a polished wafer surface. Figure 4C shows a magnified cross-sectional view of the polishing pad duπng or after the CMP operation of Figure 4B Figure 5A shows a flow chart of a method for conditioning the linear belt polishing pad after a CMP operation has been performed on a metallization mateπal of the wafer, according to one embodiment of the invention. Figure 5B shows the linear belt polishing pad after the pad surface has been chemically treated and then πnsed with DI water pπor to mechanical conditioning and mechanically conditioned to substantially remove residue, such as copper oxide by-products, according to one embodiment of the present invention. Figure 6A shows a cross-sectional view of a semiconductor wafer having a dielectπc mateπal deposited over the top surface of the wafer. Figure 6B shows a cross-sectional view of the semiconductor wafer after the top surface has been polished duπng a CMP operation to form a polished wafer surface. 6 Figure 6C shows a magnified cross-sectional view of the linear belt polishing pad after the CMP operation of Figure 6B. Figure 7A shows a flow chart of a method for conditioning the linear belt polishing pad after a CMP operation has been performed on a dielectπc mateπal, according to one embodiment of the invention. Figure 7B shows the linear belt polishing pad after the pad surface has been chemically treated and then πnsed with DI water to substantially remove the oxide byproduct, according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An invention for methods and systems for conditioning CMP pads is disclosed. In the following descπption, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be understood, however, to one skilled in the art, that the present invention may be practiced without some or all of these specific details. In other instances, well known process operations have not been descπbed in detail in order not to unnecessaπly obscure the present invention. Figure 2 shows a top-down view of a CMP and cleaning unit 100 in accordance with one embodiment of the present invention. A user may set parameters and monitor operations of the CMP and cleaning unit 100 by way of a controlling computer system having a graphical user interface 130. Wafer cassettes 102 preferably containing at least one semiconductor wafer 101 may be provided to the CMP and cleaning unit 100. A dry robot 104 may then transfer the wafer 101 to a pre-a gner 106 where the wafer 101 is properly aligned for subsequent handling. The wet robot 108 may then transfer the wafer 101 from the pre-ahgner 106 to a load/unload to a dial plate 116. A polishing head (not shown) may be used to hold the wafer 101 when the wafer is placed over the polishing pads of the CMP systems. The dial plate 116 is used to rotate the wafer 101 to subsequent CMP and cleaning locations. For instance, the dial plate 116 may be used to rotate the wafer to a first CMP system 114a, where the wafer 101 is loaded onto the polishing head. The polishing head secures the wafer 101 in place as the wafer 101 is lowered onto a linear belt polishing pad that is part of the first CMP system 114a. Figure 3A, as discussed below, provides a more detailed view of the CMP system 114. The wafer 101 may thus undergo a CMP operation in the first CMP system 114a to remove a 7 desired amount of mateπal from the surface of the wafer 101 Although linear belt polishing systems 114 are descπbed herein, it should be understood by one of ordinary skill in the art that an orbital polishing pad, that rotates in a circular-type motion, may alternatively be used. After the wafer undergoes a CMP operation in the first CMP system 114a, the wafer 101 may be transferred by the dial plate 116 to an advanced polishing head 118 in a second CMP system 114b, where the wafer undergoes additional CMP operations. The wafer 101 may then be transferred to the advanced rotary module 120, where the wafer 101 may undergo pre-cleamng operations In this example, the advanced rotary module 120 implements a soft orbital pad surface The wafer 101 may then be loaded into a load station 124 in a wafer cleaning system 122. The wafer cleaning system 122 is generally used to remove unwanted slurry residue left over from CMP operations in the CMP systems 114 The unwanted residue may be brushed away by operations in the brush boxes 126. Each of the brush boxes 126 includes a set of PNA brushes that are very soft and porous. Therefore, the brushes are capable of scrubbing the wafer clean without damaging the delicate surface. Because the brushes are porous, they are also able to function as a conduit for fluids that are to be applied to the wafer surface duπng cleaning. These cleaning operations typically implement chemicals as well as deionized (DI) water. A spin station 128 may be used to finalize the cleaning operations of the wafer 101. The wafer 101 may then be transferred to the wet queue 110, where the wafer 101 awaits to be transferred to post-CMP processing Figure 3A shows an enlarged view of a CMP system 114 according to one embodiment of the present invention A polishing head 150 may be used to secure and hold the wafer 101 in place duπng processing A linear belt polishing pad 156 is preferably secured to a thin metal belt (not shown), which forms a continuous loop around rotating drums 160a and 160b. The linear belt polishing pad 156 may be secured to the metal belt by using a well-known glue or other adhesive mateπal. The linear belt polishing pad 156 itself is preferably made of a polyurethane mateπal. The linear belt polishing pad 156 generally rotates in a direction indicated by the arrows at a speed of about 400 feet per minute. As the belt rotates, polishing slurry 154 may be applied and spread over the surface 156a of the linear belt polishing pad 156. The polishing head 150 may then be used to lower the wafer 8 101 onto the surface 156a of the rotating linear belt polishing pad 156. In this manner, the surface of the wafer 101 that is desired to be planaπzed is substantially smoothed. In some cases, the CMP operation is used to planaπze mateπals such as oxide, and in other cases, it may be used to remove layers of metallization. The rate of planaπzation may be changed by adjusting the polishing pressure 152. The polishing rate is generally proportional to the amount of polishing pressure 152 applied to the linear belt polishing pad 156 against the polishing pad stabilizer 158. After the desired amount of mateπal is removed from the surface of the wafer 101, the polishing head 150 may be used to raise the wafer 101 off of the linear belt polishing pad 156. The wafer is then ready to proceed to the advanced polishing head 118 or to the wafer cleaning system 122. Better cleaning of the wafer can be achieved in the wafer cleaning system 122 by improving the processes used in the CMP system 114 before the wafer even gets to the wafer cleaning system 122. The CMP system 114 can be improved for the next wafer by conditioning the surface of the linear belt polishing pad 156. Conditioning of the pad may be performed by removing excess slurry and residue build-up from the clogged belt pad. As more wafers are planaπzed, the belt pad will collect more residue build-up which can make efficient CMP operations difficult. One method of conditioning the belt pad is to use a polishing pad conditioning system 166. A conditioning head 170 is preferably used to hold (and in some embodiments rotate) a conditioning disk 172 as a conditioning track 168 holds the conditioning head 170. The conditioning track 168 moves the conditioning head 170 back and forth as the conditioning disk 172 scrapes the linear belt polishing pad 156, preferably with a nickel-plated conditioning disk. The conditioning disk 172 preferably has a nickel-plated diamond gπd or a nylon brush over its surface. The diamond gπd is preferably used to condition belt pads having a hard surface. The nylon brush is preferably used to condition belt pads having a softer surface. The conditioning of the belt pad may be done m-situ, where the belt pad is conditioned while the belt pad is polishing the wafer, or ex-situ, where the belt pad is conditioned when the belt pad is not polishing a wafer. Unfortunately, although scraping the belt removes slurry and residues, it inevitably wears away the belt pad itself such that about 200 angstroms of belt pad mateπal is removed from the belt duπng each conditioning operation 9 Figure 3B shows how the cleaning process may be significantly improved by chemically treating the linear belt polishing pad 156 before the conditioning disk 172 is used to scrape the linear belt polishing pad 156, in accordance with one embodiment of the present invention. After a CMP operation has been performed on a wafer and before the linear belt polishing pad 156 is scraped with the conditioning disk 172, a chemical dispenser 174 is preferably used to apply chemicals 180 to the linear belt polishing pad 156 as the belt is rotating. In this embodiment, the chemical dispenser 174 is in the form of a bar having a plurality of holes. The holes are positioned in two or more rows, such that each hole in a row is off-set from respective surrounding holes of a next row. The chemicals 180 are preferably supplied from a chemical source 176 which may be located mside the CMP and cleaning unit 100 or may be located externally A conduit 178 leading from the chemical source 176 to the chemical dispenser 174 is preferably used to provide the pathway for the chemicals 180 to reach the chemical dispenser 174. In one embodiment, depending on the desired interaction of the chemicals with the mateπals left on the surface 156a after the CMP operation, the chemicals assist in achieving certain advantageous results. For example, the chemicals can react with and substantially dissolve the residue of the mateπals removed from wafer 101 and the slurry used in the CMP operation. As mentioned above, the CMP operation polishes mateπal from the wafer 101, thereby leaving wafer mateπal residue on the surface 156a of the linear belt polishing pad 156. After the chemicals react with the residue, substantially all of the resulting film on the surface 156a may be πnsed away with a πnsmg liquid, which is preferably DI water. The result is a linear belt polishing pad 156 that has been chemically treated before being conditioned and made ready for another CMP operation on a next wafer. The additional operation of chemically treating the linear belt polishing pad 156 may provide several advantages over traditional cleaning methods. An additional operation of chemical treatment substantially reduces the amount of pressure and the amount of time needed for applying the wafer to the polishing pad duπng a subsequent CMP operation because the polishing pad is cleaner and thereby more efficient. With a cleaner polishing pad, the necessary pressure is typically between about 3 and 4 pounds per square inch (psi), and the necessary time for polishing a wafer is typically about 60 seconds. For compaπson purposes, if no chemical treating is performed on the pad surface, the time for polishing a subsequently applied wafer is likely to be substantially more at about 2 minutes. 10 Further, an additional operation of chemical treatment saves a substantial amount of the pad mateπal from being unnecessaπly scraped away. As mentioned above, typical conditioning techniques pπmaπly rely on the scraping away of about 200 angstroms of polishing pad mateπal each time conditioning is performed. In a traditional conditioning technique, for example, where chemical treatment is not performed, a hard polishing pad may be usable for about 300 to 500 CMP operations. However, by implementing chemical treatments, as descπbed above, a typical hard polishing pad may be usable for up to about 800-1000 CMP operations. This increase in pad lifetime is pπmaπly due to the fact that the subsequent scraping operation does not have to be so intensive. An extended pad life leads to less downtime for maintenance and repair. Less downtime in turn leads to a significantly lower cost of ownership. Still further, the chemical treatment of the present invention may safeguard the fabπcation system from some of the consequences of over or under-conditioning. If a polishing pad is over-conditioned, the pad will likely not perform as expected, and the mateπal on the surface of the conditioning disk may degrade prematurely. The mateπal over the surface of the conditioning disk may include a diamond gπd, which is likely to be very costly to replace. Also, through its weaπng-out stages, fragments of the diamond gπd are likely to shed onto the pad surface and the surface of the wafer. Such unwanted shedding will likely require the entire wafer to be discarded. On the other hand, if a polishing pad is under-conditioned, unwanted residual mateπal may be left on the polishing pad. It is well-known in the art that it is important that a wafer be adequately cleaned after a CMP operation because of these slurry residues, which may cause damage to the wafer in post-CMP operations or in the operation of a device. The residues may, for example, cause scratching of the wafer surface or cause inappropπate interactions between conductive features. Moreover, a multitude of identical semiconductor chip dies are produced from one semiconductor wafer. One unwanted residual particle on the surface of the wafer duπng post-CMP processing can scratch substantially all of the wafer surface, thereby ruining the dies that could have been produced from that semiconductor wafer Such a mishaps in the cleaning operation may be very costly Accordingly, the chemical treatment operation provides a polishing pad that is in better condition for CMP operations, thereby providing stable removal rate and also reducing the 11 πsk of having unwanted particulates and residues left on the wafer in subsequent fabπcation processes. Fewer unwanted residues and particulates leads to fewer defective wafers and, thus, an increase in yield Preferred chemicals to be applied to the surface 156a depend on the type of slurry used duπng the CMP operation and the type of mateπal polished away from the wafer 101 duπng the CMP operation. The following discussion discloses vaπous types of fabπcation processes and respective preferred chemicals for conditioning the polishing pad. Figure 4A shows a cross-sectional view of a wafer 200 having a copper layer 208 deposited over the top surface of the wafer 200. An oxide layer 204 is deposited over a semiconductor substrate 202. Well-known photolithography and etching techniques may be used to form patterned features in the oxide layer 204. The top surface of the wafer is then coated with a Ta/TaN layer 206. Next, the top surface of the wafer is coated with a copper layer 208 and the patterned features are thereby filled with copper mateπal 210. Figure 4B shows a cross-sectional view of the semiconductor wafer 200 after the top surface has been polished duπng a CMP operation to form a polished wafer surface 212. Duπng the actual polishing, polishing slurry 154 is applied to the top surface 156a of the linear belt polishing pad 156. Where a CMP operation is to be performed on a metal layer such as copper layer 208, as shown here, the preferred polishing slurry 154 has Al,O 3 abrasive and other chemical components. However, it should be understood by one of ordinary skill in the art that vaπous other chemical compositions of polishing slurry 154 that work with metals such as copper may be used. The wafer 200 is then lowered onto the linear belt polishing pad 156 such that a desired amount of the wafer surface is planaπzed until the underlying oxide layer 204 is finally exposed. Figure 4C shows a magnified cross-sectional view of the linear belt polishing pad 156 after the CMP operation of Figure 4B. As shown, a residue film 214 of copper mateπal 210 and slurry having particulates 216 clog the surface 156a of the linear belt polishing pad 156. In general, the copper mateπal 210 from the wafer 200 combines with the polishing slurry 154 to form the residue film 214 that is in the form of copper oxide (CuO x ), and particulates 216 Where the polishing slurry 154 is Al,O 3 based, the particulates are pπmaπly alumina. It is desired that the copper oxide having the embedded particulates 216 are substantially removed from the surface 156a 12 Figure 5A shows a flow chart of a method for conditioning the linear belt polishing pad 156 after a CMP operation has been performed on a metallization mateπal, such as copper, according to one embodiment of the invention. The method starts in operation 410 by providing a CMP system having a polishing pad that has been previously used for polishing metallization mateπal. The method then moves to operation 412 where an even coat of chemicals is distπbuted onto the pad surface. In general, it is preferred that the linear belt polishing pad 156 is moving. In one example, the linear belt polishing pad 156 can be traveling at a rate of about 100 feet per minute. After the chemicals are distπbuted, the chemicals are allowed to react with the residue film 214 on the pad surface to produce a water soluble by-product The chemicals may be in the form of a solution that most preferably contains DI water and hydrochloπc acid (HC1). The concentration of HC1 in the solution is preferably between about 0.05% and about 1.0% by weight, more preferably between about 0.2% and about 0.8% by weight, and most preferably about 0.5% by weight The remainder of the solution is preferably DI water. The waiting time for allowing this solution to react with the residue is preferably between about 30 seconds and about 3 minutes, more preferably between about 60 seconds and about 2 minutes, and most preferably about 90 seconds. The chemical reaction that occurs here is likely to be CuO x + HC1 -> CuCl, + H ), where the by-product CuCl, + FLO is a water soluble mateπal. Another preferred solution of chemicals contains DI water, NH 4 C1, CuCl,, and HC1. The concentration of NH 4 C1 is preferably between about 0.5 and about 2.4 moles per liter. The concentration of CuCl, is preferably between about 0.5 and about 2.5 moles per liter. The concentration of HC1 is preferably between about 0.02 and about 0.06 moles per liter. The remainder of the solution is preferably DI water. Still another preferred solution of chemicals contains DI water, ammonium persulfate ((NH 4 ) 2 S,0 s ), and sulfuπc acid (FL,SO 4 ). The concentration of (NH 4 ) 2 S,0 8 is preferably between about 0.5 and about 1.0 molar. The concentration of FL,SO 4 is preferably between about 0.25 and about 0 5 molar. The remainder of the solution is preferably DI water. The waiting time for allowing this solution to react with the residue is preferably between about 30 and 180 seconds, and most preferably about 60 seconds. Yet another preferred solution of chemicals contains DI water, copper chloπde (CuCl,), ammonium chloπde (NH C1), and ammonium hydroxide (NH 4 OH) The 13 concentration of CuCl 2 is preferably between about 2 and about 5 grams per liter. The concentration of NH 4 C1 is preferably between about 5 and about 10 grams per liter. The concentration of NH 4 OH, is preferably between about 0.2% and about 0.5% by weight. The remainder of the solution is preferably DI water. The waiting time for allowing this solution to react with the residue is preferably between about 30 and about 180 seconds, and most preferably about 60 seconds. Next, in operation 414 the pad surface is πnsed with DI water to substantially remove the soluble by-product. A mechanical conditioning operation 416 is then performed on the pad The conditioning disk 172 may be applied to the surface of the polishing pad at a pressure preferably set between about 1 and about 2 pounds per square inch. At this point, where the pad has been conditioned and prepared to polish a next wafer, the operation moves to operation 418 where a wafer is polished. The polished wafer is subsequently moved to a post-CMP cleaning operation 420. The method now moves to a decision operation 422 where it is determined whether a next wafer is to undergo a CMP operation. If there is not a next wafer, the method is done. However, if there is a next wafer, the method goes back to and continues from operation 412. The foregoing cycle continues until there is no next wafer at decision operation 422. Figure 5B shows the linear belt polishing pad 156 after the pad surface has been chemically treated in operation 412, πnsed with DI water in operation 414, and mechanically conditioned in operation 416 to substantially remove the residue, according to one embodiment of the present invention. The foregoing discussion disclosed techniques for removing unwanted mateπals from a polishing pad where a CMP operation has been performed on metallization mateπal. The following discussion includes disclosure of techniques for cleaning and conditioning a polishing pad where a CMP operation has been performed on dielectπc mateπals or mateπals that are substantially oxide-based. Figure 6A shows a cross-sectional view of a wafer 600 having a dielectπc mateπal 604 deposited over the top surface of the wafer 600. Well-known photolithography and etching techniques may be used to form patterned metal features 606 over a substrate 602. The top surface of the wafer is generally coated with a dielectπc mateπal 604 and the patterned features 606 are completely covered. 14 Figure 6B shows a cross-sectional view of the semiconductor wafer 600 after the top surface has been polished duπng a CMP operation to form a polished wafer surface 612 Duπng the actual polishing, polishing slurry 154 is applied to the top surface 156a of the linear belt polishing pad 156 Where a CMP operation is to be performed on a dielectπc mateπal 604 such as SιO 2 , as shown here, the preferred polishing slurry 154 has SiO, as an abrasive component and other chemical components However, it should be understood by one of ordinary skill in the art that vaπous other chemical compositions of polishing slurry 154 that work with mateπals such as dielectπc mateπal 604 may be used The wafer 600 is then lowered onto the linear belt polishing pad 156 such that a desired amount of the wafer surface is planaπzed to form the polished wafer surface 612 Figure 6C shows a magnified cross-sectional view of the linear belt polishing pad 156 after the CMP operation of Figure 6B As shown, a residue film 310 of dielectπc mateπal 604 and abrasive slurry having particulates 312 clog the surface 156a of the linear belt polishing pad 156 In general, the dielectπc mateπal 604 from the wafer 600 combines with the polishing slurry 154 to form the residue film 310 that is in the form of amorphous silicon dioxide (SιO 2 ) and particulates Where the polishing slurry 154 is also silicon dioxide based, the particulates are pπmaπly abrasive silicon dioxide It is desired that the silicon dioxide having the embedded particulates 212 be substantially removed from the surface 156a to enable efficient CMP operations Figure 7A shows a flow chart of a method for conditioning the linear belt polishing pad 156 after a CMP operation has been performed on a dielectπc mateπal, such as silicon dioxide, according to one embodiment of the invention The method starts in operation 510 by providing a CMP system having a polishing pad that has been previously used for polishing dielectπc mateπal The method then moves to operation 512 where an even coat of chemicals is distπbuted onto the pad surface After the chemicals are distπbuted, the chemicals are allowed to react with the residue 310 on the pad surface to produce a soluble by-product and to modify the pad surface having embedded SiO, particles The chemicals may be in the form of a solution that most preferably contains DI water and ammonium hydroxide (NH 4 OH) The concentration of NH OH in the solution is preferably between about 0 5% and about 2 5% by weight, more preferably between about 0 7% and about 1 5% by weight, and most preferably about 1 0% by weight The remainder of the solution is preferably DI water The 15 waiting time for allowing this solution to react with the residue is preferably between about 45 seconds and about 3 minutes, more preferably between about 50 seconds and about 2 minutes, and most preferably about 60 seconds. This solution is preferably allowed to react at about an ambient room temperature of 21 degrees Celsius. By running the method at room temperature, there is advantageously no need for extra mechanical, electπcal and control equipment to modify the temperature of the applied solution. Another preferred solution of chemicals contains DI water, ammonium hydroxide (NH 4 OH), hydrogen peroxide (H-O 2 ), and DI water. The concentration of NH OH is preferably about 1% by weight. The volume ratio of NH OH : H.O, : DI water is preferably about 1:4:20, and most preferably about 1:1:5. The waiting time for allowing this solution to react with the residue is preferably between about 30 and about 180 seconds, and most preferably about 60 seconds. This solution may also be applied to the polishing pad at a heated temperature that is preferably between about 40 degrees Celsius and about 80 degrees Celsius, and most preferably about 60 degrees Celsius. Operation 512 is followed by operation 514 where the pad surface is πnsed with DI water to substantially remove particulates and the oxide by-product. In general, the residue will be substantially dissolved and substantially removed. Next, a mechanical conditioning operation 516 is performed on the pad. At this point, where the pad has been conditioned and prepared to polish a wafer, the operation moves to operation 518 where a wafer is polished. The polished wafer is subsequently moved to a post-CMP cleaning operation 520. Next, the method moves to a decision operation 522 where it is determined whether a next wafer is to undergo a CMP operation. If there is not a next wafer, the method is done. However, if there is a next wafer, the method goes back to and continues from operation 512. The foregoing cycle continues until there is no next wafer at decision operation 522. Figure 7B shows the linear belt polishing pad 156 after the pad surface has been πnsed with DI water to substantially remove the oxide by-product, according to one embodiment of the present invention. After nnsmg with DI water, a substantially small number of unwanted slurry particulates 312 may be left on the surface 156a of the linear belt polishing pad 156. These unwanted particulates 312 may be substantially removed by the mechanical conditioning operation 516 As mentioned above, a conditioning disk 172 can be used to perform the conditioning 16 It should be understood that although specific reference has been made to belt-type CMP machines, the conditioning methods of the present invention can be applied to other types of CMP machines, such as those that implement rotary mechanisms with round pads. Thus, by implementing these pad conditioning methods, the complete CMP and cleaning operations will generate a higher yield of quality planaπzed and cleaned metal and oxide surfaces. While this invention has been descπbed in terms of several preferred embodiments, it will be appreciated that those skilled in the art upon reading the preceding specifications and studying the drawings will realize vaπous alterations, additions, permutations and equivalents thereof. It is therefore intended that the present invention includes all such alterations, additions, permutations, and equivalents as fall within the true spiπt and scope of the invention.

Claims: 17 What is claimed is: 1. A method of cleaning a chemical mechanical polishing (CMP) pad that has already been used for performing a CMP operation on a wafer surface, the CMP pad having a residue on a surface of the CMP pad, the method compπsing: applying chemicals onto the surface of the CMP pad; allowing the chemicals to react with the residue to produce a by-product; πnsing the pad surface to substantially remove the by-product; and performing a mechanical conditioning operation on the surface of the pad. 2. A method of cleaning a CMP pad as recited in claim 1, wherein when the wafer surface includes copper, the chemical is HC1. 3. A method of cleaning a CMP pad as recited in claim 1, wherein when the wafer surface includes copper, the chemicals are selected from the group consisting of: (a) NH C1 + CuCl 2 + HCI, (b) (NH 4 ) 2 S 2 O s + IT SO 4 , and (c) CuCl 2 + NH C1 + NH OH. 4. A method of cleaning a CMP pad as recited in claim 1, wherein when the wafer surface is oxide, the chemical is NH OH. 5 A method of cleaning a CMP pad as recited in claim 1, wherein when the wafer surface is oxide, the chemical is NH 4 OH + H.O-+ DIW. 18 6. A method of cleaning a CMP pad as recited in claim 2, wherein when the wafer surface includes copper, the residue contains both slurry material and copper oxides, and the reacted by-product being in the form of a water soluble film that is substantially removed during the rinsing. 7. A method of cleaning a CMP pad as recited in claim 6, wherein the slurry material and the copper oxides of the residue define a copper oxide (CuO x ) that reacts with the HCl to form the by-product that is the water soluble film. 8. A method of cleaning a CMP pad as recited in claim 4, wherein when the wafer surface is oxide, the residue contains both slurry material and silicon dioxide material, and the reacted by-product being partially soluble and substantially removed during the rinsing. 9. A method of cleaning a CMP pad as recited in claim 8, wherein the slurry material and the silicon dioxide material of the residue defines an oxide particle residue that reacts with the NH,OH. 10. A method of cleaning a CMP pad as recited in claim 2, wherein allowing the HCl to react with the residue further comprises waiting for between about 30 seconds and about 180 seconds. 11. A method of cleaning a CMP pad as recited in claim 1, wherein rinsing the surface of the CMP pad further comprises rinsing the surface of the CMP pad with deionized water. 19 12 A method of cleaning a CMP pad as recited in claim 1, wherein performing a mechanical conditioning operation further compπses using a conditioner disk having a nickel- plated diamond gπd surface. 13. A method of cleaning a CMP pad as recited in claim 1, wherein performing a mechanical conditioning operation further compπses using a conditioner disk having a nylon brush surface. 14. A method of cleaning a CMP pad as recited in claim 1, wherein the CMP pad moves in a circular rotation. 15. A method of cleaning a CMP pad as recited in claim 1, wherein the CMP pad moves in a linear rotation. 16. A method of cleaning a chemical mechanical polishing (CMP) pad, the CMP pad having a residue on a surface of the CMP pad, the method compπsmg: applying chemicals onto the surface of the CMP pad; and πnsing the pad surface to substantially remove the applied chemicals and the residue. 17. A method of cleaning a CMP pad as recited in claim 16, further compπsing: allowing the chemicals to react with the residue to produce a by-product. 18. A method of cleaning a CMP pad as recited in claim 17, further compπsing: performing a mechanical conditioning operation on the surface of the pad after the by- product is produced and removed. 20 19. A method of cleaning a CMP pad as recited in claim 16, wherein when the wafer surface includes copper, the chemical is HCl. 20. A method of cleaning a CMP pad as recited in claim 19, further compπsing: allowing the chemicals to react with the residue to produce a by-product. 21. A method of cleaning a CMP pad as recited in claim 16, wherein when the wafer surface is oxide, the chemical is NH 4 OH. 22. A method of cleaning a CMP pad as recited in claim 21. further compπsing: allowing the chemicals to react with the residue to produce a by-product. 23. A method of cleaning a CMP pad as recited in claim 16, wherein the CMP pad is one of a linear moving pad and a round rotating pad. 24. A chemical mechanical polishing (CMP) system, the CMP system having a CMP pad surface having a residue, the CMP system compπsing: a holding surface for receiving the CMP pad; a polishing head for holding and applying a wafer to the CMP pad surface; and a chemical dispenser for applying pad cleaning chemicals, the pad cleaning chemicals being configured to substantially remove the residue from the CMP pad surface. 25. A chemical mechanical polishing (CMP) system, the CMP system having a CMP pad surface having a residue as recited in claim 24, wherein the chemical dispenser has a bar unit that includes a plurality of holes for applying the pad cleaning chemicals. 21 26 A chemical mechanical polishing (CMP) system, the CMP system having a CMP pad surface having a residue as recited in claim 25, wherein the CMP pad is a linear belt pad that linearly rotates about a pair of rotating drums 27 A chemical mechanical polishing (CMP) system, the CMP system having a CMP pad surface having a residue as recited in claim 26, wherein the bar unit spans a width of the linear belt pad so as to apply the pad cleaning chemicals over substantially all of the CMP pad surface. 28 A chemical mechanical polishing (CMP) system, the CMP system having a CMP pad surface having a residue as recited in claim 26, further compπsing- a conduit for connecting a chemical source to the chemical dispenser. 29. A chemical mechanical polishing (CMP) system, the CMP system having a CMP pad surface having a residue as recited in claim 28, wherein the polishing head can apply a force on the wafer against the CMP pad surface. 30 A chemical mechanical polishing (CMP) system, the CMP system having a CMP pad surface having a residue as recited in claim 24, further compπsing: a mechanical conditioning disk for scraping the residue from the CMP pad surface. 31. A chemical mechanical polishing (CMP) system, the CMP system having a CMP pad surface having a residue as recited in claim 24, wherein when a surface of the wafer to be polished is substantially copper, the pad cleaning chemicals are selected from the group consisting of: (a) HCl; (b) NH 4 C1 + CuCl. + HCl, (c) (NH 4 ) 2 S 2 O 8 + H, SO ; and (d) CuCl + NH.C1 + NH OH. 22 32. A chemical mechanical polishing (CMP) system, the CMP system having a CMP pad surface having a residue as recited in claim 24, wherein when a surface of the wafer to be polished is substantially oxide, the pad cleaning chemicals are selected from the group consisting of: (a) NH 4 OH + DIW; and (b) NH OH + H +DIW.

Inventors: MIKHAYLICH KATRINA A, SVIRCHEVSKI JULIA S, MIKHAYLICH, KATRINA, A., SVIRCHEVSKI, JULIA, S.
Applicants: LAM RES CORP, LAM RESEARCH CORPORATION
Application year: 2000
Main classification: B24B53
IPC codes: B24B37, B24B53, H01L21