PROCESS FOR THE RECOVERY OF TIN, TIN ALLOYS OR LEAD ALLOYS FROM PRINTED CIRCUIT BOARDS

Abstract: A process for the selective dissolution of tin and/or lead- or tin-containing alloys from printed circuit boards, comprises contacting the printed circuit board with a solution comprising Ti(IV) and an acid which forms stable and soluble salt of Ti(III), Ti(IV), Sn(II) and Pb(II), under conditions to effect dissolution of substantially all of the Sn and/or Pb- or Sn-containing alloy therefrom, as Sn(II) and/or Pb(II) and recovering from the solution by electrolytic reduction substantially all of the Sn(II) and/or Pb(II) species as Sn and/or Pb. After the electrolytic reduction step the oxidant metal species is regenerated by oxidation and recycled to the first stage of the process.

Description: PROCESS FOR THE RECOVERY OF TIN, TIN ALLOYS OR LEAD ALLOYS FROM PRINTED CIRCUIT BOARDS The present invention relates to a process for the recovery of tin, tin alloys or lead alloys (e.g. solder) from printed circuit boards (pcbs) . With the advent of more and more electronic hardware there is more and more electronic scrap produced, including scrap printed circuit boards. There is a growing need for more environmentally friendly methods of recycling scrap printed circuit boards. Many current commercial processes focus only on recovering some of the component parts of pcbs. For example, pcbs are heated in furnaces to pyrolyse the organic compounds and melt the metals. The plastics and the electronic components are destroyed giving potentially harmful fumes and the complex mixture of metals remaining then needs to be separated. An alternative process comprises the selective removal of the higher value components such as gold edge connectors and microprocessor chips and then scrapping the rest of the pcb, such as to landfill. Planned EC legislation is likely to require the manufacturers of electronic equipment to take back the equipment at the end of its useful life for recycling. There is therefore a need for a process for treating printed circuit boards that can recover the majority of the component parts of scrap pcbs without the production of undesirable waste products. During the manufacture of printed circuit boards, solder is applied at various stages for the purpose of bonding co m ponents to the exposed areas of metal using a wave soldering technique or using a solder paste. Furthermore, during the formation of lines and pads on the board a layer of tin or a tin-lead alloy (solder) may be deposited by electrodeposition, immersion plating or other process onto selected areas of the copper surfaces of the board to define conductive tracks, pads, through holes etc and to act as an etch resist during the subsequent etching array of the copper surface. Thus, in a process for the recycling of scrap printed circuit boards the selective dissolution of the tin or tin-lead alloy used in the manufacture of the pcbs from the copper substrate surface, without dissolving the copper, is an important first step. A new selective dissolution process has now been developed in which the plastics associated with electronic components are not attacked, the electronic components are not affected by the oxidant solution used in the process and the identification coding on the electronic components is unaffected. Thus the components can be recovered for use. Furthermore, the oxidant solution which is used to dissolve the tin or tin-lead alloy is regenerated and recycled to the process, thus avoiding the production of undesirable or unwanted waste products. EP-A-0508960 discloses a method of producing metallic lead from a material containing lead by dissolving the lead contained in the material and an electrolysis step for the cathodic deposition of the dissolved lead. The dissolving step is carried out with the use of an acid electrolyte in the presence of a redox couple. The method is used, in particular, for the production of lead from the active material of spent accumulators. Although this process discloses the dissolution of lead, a process for the selective dissolution of tin or tin-lead alloys is still desired. Accordingly, in one aspect the present invention provides a process for the selective dissolution of tin and/or lead- or tin-containing alloys from printed circuit boards, which process comprises the steps of: (i) providing a solution comprising Ti(IV) and an acid which forms stable and soluble salt of Ti(III), Ti(IV), Sn(II) and Pb(II), (ii) contacting the printed circuit board with the solution under anaerobic conditions for a time sufficient to effect dissolution of substantially all of the Sn and/or Pb- or Sn-containing alloy therefrom, as Sn(II) and/or Pb(II); (iii) subjecting the solution from step (ii) to electrolytic reduction in order to recover substantially all of the Sn(II) and/or Pb(II) species contained therein as Sn and/or Pb; and (iv) oxidising the solution from step (iii) in order to regenerate the oxidant metal species and recycling the regenerated solution to step (i) of the process. By the term "soluble salt" as used herein is meant that the salt has a solubility of at least 1 gram per litre in the solution at the temperature at which the process is carried out. For use in step (ii) of the present invention the oxidising solution will preferably oxidise tin and lead metals, but will not dissolve copper. For this to be achieved the solution redox potential should be in the range of from + 0.342 volts to - 0.126 volts (standard hydrogen electrode) , in terms of standard electrode potential, i.e. the interval between the anodic dissolution of copper and tin/lead. The preferred solution for use in step (ii) of the process comprises an acid selected from fluoroboric acid, fluorosilicic acid, hexafluoro- phosphoric acid, hexafluoroantimonic acid and an alkylsulphonic acid. A .solution comprising Ti(IV) and fluoroboric acid is particularly preferred. This solution may be prepared by dissolving Ti metal in fluoroboric acid with a sparge of oxygen gas or air. This solution has an unexpected selectivity for the dissolution of Sn and Pb over other metals, particularly copper. Other oxidant species/acids as defined in step (i) may also be used provided that, in use, the oxidant ions in solution have an oxidation potential which can selectively dissolve tin or a tin-lead alloy from the surface of the pcb, but does not oxidise copper metal. Step (ii) of the process is carried out anaerobically, for example by sparging the leach solution with an inert gas, such as nitrogen, during the leaching step. The solution used in step (ii) of the process preferably comprises the oxidant metal species at a concentration generally in the range of from 0.01 to l.OM metal ions, preferably 0.5 to 0.9M metal ion, and the acid at a concentration in the range of 10% to 100% by weight acid. The temperature at which the solution used in step (ii) is contacted with the substrate surface is generally C to 60°C, preferably 20 to 30°C. The process of the present invention may be used to dissolve tin or tin-lead alloys from printed circuit boards. Alloys which can be dissolved generally comprise from 5 to 99.5% by weight Sn, up to 95% by weight of Pb, and optionally up to 5% by weight of one or more of Ag, Bi, In, Zn, Cu or Sb. Solders commonly used in pcb manufacture comprise 63%Sn 37%Pb by weight or 62%Sn 36%Pb 2%Ag by weight. Aluminium and any iron present in the printed circuit boards will dissolve in the acid leach and reduce the Ti(IV) oxidant to Ti(III), thus leaving less Ti(IV) available to react with the solder. Accordingly, it is advantageous to remove these metals from the scrap pcb prior to treatment with the leach solution. For example, physical separation methods may be used such as by magnetic means for iron and using an eddy current separator for aluminium. In step (iii) of the present invention, the electrolytic reduction of the solution containing the dissolved species is preferably carried out in a divided cell with inert electrodes, such as graphite anodes and stainless steel cathodes and anolyte and catholyte compartments separated by a membrane, such as microporous or ion exchange material. The solution containing the dissolved species comprises the catholyte and the reaction at the cathode is the reduction of Sn(II) to Sn or the reduction of Sn(II) and Pb(II) to Sn and Pb which are deposited on the cathode. When Pb and Sn are present together, for example as a solder alloy, they are then deposited together as an alloy, which can be re-used. The anolyte may comprise the same solution, or any other electrolyte of choice. It is generally preferred for the catholyte solution to be isolated from the air since any oxygen present will oxidise Ti(III) in solution to Ti(IV) which in turn is reduced back to Ti(III) at the cathode. Furthermore, Sn(II) would be oxidised to Sn(IV)from which it is difficult to electrowin tin. Reduction of Ti(IV) to Ti(III) occurs at the expense of the metal plating reaction, leading to low metal yields and current efficiency. The electrolytic reduction in step (iii) of the process will generally be carried out at a current density in the range of from 50 to 500A/m 2 . The electrowinning of the tin and/or lead in step (iii) is carried out until substantially all of the metals are electrowon. The reason for this is that any Sn(II) present in the solution during step (iv) of the process would be oxidised to Sn(IV). In this form, it is very difficult to electrowin tin metal as normally the preferred cathodic reaction would be the evolution of hydrogen. The oxidation in step (iv) of the process of the present invention may be carried out by the electrolytic oxidation of the solution from step (iii). The oxidation of Ti(III) to Ti(IV) is preferably carried out in a divided cell with inert electrodes and anolyte and catholyte compartments divided by a membrane separator, such as a cation exchange membrane, for example Nafion. The oxidation of Ti(III) to Ti(IV) takes place at the anode with the solution from step (iii) forming the anolyte. The catholyte may comprise the same solution, or any other electrolyte of choice. The solution treated according to step (iv) is thus regenerated and then is recycled to step (i) of the process. Both steps can advantageously be carried out in the same cell. The leach solution loaded with Sn and Pb is first electrolysed as the catholyte where SnPb is plated onto the cathode. The metal depleted solution can then become the anolyte where Ti(III) is oxidised to Ti(IV) at the anode after as much tin as possible has been electrowon as solder at the cathode. This is because if any tin is still present when the solution is oxidised either with air/oxygen or electrochemically, then the Sn(II) species is converted to Sn(IV) ions. In the Sn(IV) form it is difficult to convert into the metal for the reasons as discussed above. However, alternatively two divided cells can be used. In another aspect, the oxidation may be carried out by contacting the solution with air or oxygen gas, for example by sparging the solution with oxygen or preferably with air at high sparge rates. Alter- natively oxygen gas can conveniently be generated electrolytically at the anode of the divided cell used for plating Sn/Pb. This requires no extra energy and so would be cheaper than using bottled oxygen gas. As previously stated, the process of the present invention is particularly applicable to the removal of lead and/or tin, and/or alloys containing lead and/or tin from printed circuit boards, and the subsequent removal and recovery of electronic components, such as transistors, capacitors and resistors from a printed circuit board after treatment in accordance with the process of the present invention. This is an important advantage of the present invention because the components are recovered in a functional state. The process of the present invention may additionally comprise the step of contacting the desoldered, and optionally component-stripped, printed circuit board with a copper leaching solution suitable for dissolving Cu for a time sufficient to effect dissolution of substantially all of the Cu from the printed circuit board. The copper leaching solution may comprise, for example, copper (II) chloride, sodium chloride and hydrochloric acid or an ammonium salt, ammonia and optionally Cu (II) ions, for example with ammonium sulphate/ammonia, which is most preferred. The copper leaching step will generally be carried out at a temperature in the range of from 30 to 60°C preferably 45 to 55°C. In the case of Cu(II) chloride leaching, optionally the Cu(II) species present in the resulting leaching solution at the end of the dissolution step may be electrolytically reduced to copper. Also, some of the Cu(I) can be oxidised anodically back to Cu(II), for further leaching, either in a divided cell or with hydrogen peroxide. Furthermore, prior to the copper leaching step the printed circuit board may be comminuted by one or more mechanical processing steps. This is important for multilayer printed circuit boards which contain thin layers of copper sandwiched between layers of plastic laminate. For the copper leach solution to gain access to this metal, the boards can be shredded or broken up in some way to create small pieces in which the maximum distance of any copper metal to an external edge is less than 10mm, preferably less than 5mm. Additional process steps may be included to further recover valuable components from the scrap pcbs. The components may be sorted in order according to value of component, value of contained element or toxicity of contained element and the decoppered plastic laminate could be treated further to recover any bromine that may be present from flame retarding additives. After the copper leaching step the residues will still contain all of the precious metals (if present originally) . These may be recovered by methods known in the art, for example leaching with cyanide to recover gold, or leaching with chlorine, for example chlorine generated electrochemically . All of the precious metals can thus be separated from the residual plastics and ceramic materials. The present invention will be further described with reference to the following Examples. EXAMPLE 1 1. Solder Leaching A solution of Ti(IV) in fluoroboric acid was prepared by dissolving titanium metal sponge (22.84g) in 42% fluoroboric acid (1.61) over a period of 20 hours with a sparge of nitrogen gas. The solution so- formed contained 0.3M titanium as Ti(IV). The rates of dissolution of a 63%Sn 37%Pb solder and copper were compared by the following procedure. The metals in the form of cylinders (25 mm diameter) were encapsulated by epoxy resin to leave only one flat end exposed. The exposed ends were rotated in the leach solution to eliminate diffusion effects and with an oxygen sparge to reoxidise reduced titanium species back to Ti(IV). The rates of dissolution of solder (63%Sn 37%Pb) and of copper in fresh leach solutions, maintained at 60°C, were compared by analysis of the metals content of the solution over six hours. The results are given in Table 1. TABLE 1 EXAMPLE 2 1. Solder Leaching A leach solution was prepared with 7.2g titanium metal dissolved in 1.51 concentrated fluoroboric acid (42%) . This was then air sparged to oxidise the Ti ions to Ti(IV). Whole and segmented printed circuit boards were placed in this solution which was sparged with nitrogen at 41/min. When all of the solder had dissolved from boards, they were removed and replaced with new ones. Table 2 below shows the build up of tin and lead in solution, as well as the concentration of iron and copper impurities. TABLE 2 2. Solder electrowinninσ and regeneration of leach solution Tin and lead were recovered by electrowinning these metals from the fluoroborate solution. The Ti(III) containing solution from step (i) above was regenerated by electrolysis. The anodic process was the oxidation of Ti(III) to Ti(IV) in order to regenerate active leachant for further leaching operations. The electrolytic cell was constructed from PVC and consisted of separate anolyte and catholyte chambers divided by a membrane separator (cation selective ion exchange membrane) . A graphite anode was placed in the anolyte compartment with a 316 stainless steel cathode in the catholyte compartment. The dimensions of each electrode were 90 mm x 100 mm. The electrolysis was carried out with separate anolyte and catholyte solutions (each 1.0 litre), which was recirculated continuously from external tanks at flow rates of 60 1/h and 10 1/h respectively. The low catholyte flow rate was chosen in order to minimise contact with air. The catholyte solution consisted of 75% v/v of 40% w/w fluoroboric acid containing 0.1M titanium ions. The initial concentration of Sn was 38g/l and the initial concentration of Pb was 32g/l. The cell was operated at a current of 1.8A (200 A/m 2 ) for a total of 11 hours. At the end of this time, the metal ion concentrations were reduced to 26g/l Sn and 35ppm Pb. The total weight of recovered metal was 28g. The redox potential of the solution changed from -200 mV to -220 mV. The total current efficiency for Sn and Pb deposition was 83%. During the electrolysis the redox value of the anolyte changed from -190 mV to +445 V, which corresponds to the regeneration of the leachant with the Ti ion content converted to the higher (IV) oxidation state. The concentrations of Sn and Pb in this example of regenerated leachant were 2.6g/l and 3.0g/l respectively. The regenerated leachant was then used to dissolve further solder. The solution was divided into two equal portions of 370ml. In one portion, a piece of scrap circuit board (area 50mm x 90mm) with attached electrical components was immersed and rotated at ~250 rp . After 8 hours at room temperature, 1.3g of solder had been leached from the board and the components had either fallen off or could be removed easily by light brushing. The redox potential of the solution had fallen to -188mV. The second sample was used to leach solder wire. After 18 hours the tin and lead concentrations had increased to 15.4g and 9.6g respectively with redox level of -214mV. When leaching was continued for a further 4 hours, the tin concentration only increased slightly to 16. lg, and there was no further increase in the Pb concentration. The final redox potential was -246mV. 3. Recovery of Components Printed circuit boards were removed from a variety of pieces of electronic equipment, including an IBM personal computer and treated with the solder leach solution as described above. Most of the components were of the surface mount type and either dropped off or were removed by brushing the surface. Some components (chip capacitors and resistors) mounted on the underside were attached with adhesive as well as being soldered. After leaching, these components could be removed with minimal force. The functionality of removed components was demonstrated with a 80486DX integrated circuit. After immersion in the sparged leach solution described above for three hours at 20°C, the functionality was tested by Intex Computers Ltd and was found to have been unaffected. 4. Copper Leaching A. A copper leaching solution was prepared from 0.3M copper (II) chloride, 4M sodium chloride and 0.4M hydrochloric acid. 500cm 3 of solution at 60°C was used to leach 100.25 grams of desoldered pcb with the components removed as described above. The boards were shredded so that 80% of the pieces were less than δmm and 75% were greater than 2mm. The boards were leached in the stirred solution for 4 hours. The copper concentration in the solution increased from 19g Cu/1 to 52.5g Cu/1 which is suitable for electrowinning. The copper dissolved accounts for over 90% of the theoretical quantity of copper available and very little metal was visible attached to the laminate after the leaching step. gj. A leach solution was prepared containing 1.5M ammonium sulphate, 2M ammonia and lg copper/litre. 500cm 3 of this solution was heated to 50°C and stirred with lOOg of PCB that had previously been desoldered, depopulated and shredded (as described above) . The mixture was sparged with oxygen gas (up to 0.5 1/min) . After 180 minutes, almost no copper metal was visible in the remaining plastic laminate and the solution contained 25g Cu/1. The small amount of gold that was present, however, was not dissolved. EXAMPLE 3 Printed circuit boards were shredded to give a product with particles all less than 12mm. Magnetic material and aluminium were removed by Eriez Magnetics Ltd. (Bedws, South Wales) using an eddy current separator. This gave a product with reduced iron and aluminium contents. A solder leach solution (500cc) was prepared by dissolving 18 grams of titanium sponge in 500cc of 30% fluoroboric acid. When this solution had cooled, oxygen was sparged into it until the colour changed from green, through brown to colourless. 260 grams of eddy current treated pcb scrap was added to the 500cc of leach solution and nitrogen was sparged through it to stir the mixture and to prevent oxidation by air of either any Ti(III) or Sn(II) in solution. Samples were taken periodically to monitor the progress of the reaction. The reaction was complete after 4 hours. Tin and lead concentrations were measured during the reaction. After 4 hours, most of the solder had dissolved and most of the Ti(IV) oxidant had been reduced to Ti(III) . A typical solution obtained by anaerobic leaching of PCB scrap was used for electrowinning of the solder metal. This was carried out in a glass divided cell with a cathode current density of 200 Am "2 for 6 hours. The catholyte was sparged with argon to prevent the formation of Sn(IV) and to stir the solution. The tin concentration dropped from 16g/l to 0.16g/l after 6 hours and the lead concentration dropped from 12 g/1 to 0.064 g/1 after 6 hours. The total current efficiency for electrowinning of solder was 100%. The remaining catholyte was sparged with oxygen to regenerate the Ti(IV) for re-use. After carrying out this process, the de-soldered pcb can be leached to dissolve copper according to the process as described in Example 2 above, process B.

Claims: CLAIMS : 1. A process for the selective dissolution of tin and/or lead- or tin-containing alloys from printed circuit boards, which process comprises the steps of: (i) providing a solution comprising Ti(IV) and an acid which forms stable and soluble salt of Ti(III), Ti(IV), Sn(II) and Pb(II), (ii) contacting the printed circuit board with the solution under anaerobic conditions for a time sufficient to effect dissolution of substantially all of the Sn and/or Pb- or Sn-containing alloy therefrom, as Sn(II) and/or Pb(II) ; (iii) subjecting the solution from step (ii) to electrolytic reduction in order to recover substantially all of the Sn(II) and/or Pb(II) species contained therein as Sn and/or Pb; and (iv) oxidising the solution from step (iii) in order to regenerate the oxidant metal species and recycling the regenerated solution to step (i) of the process. 2. A process as claimed in claim 1 wherein the solution provided in step (i) comprises an acid selected from fluoroboric acid, fluorosilicic acid, hexafluorophosphoric acid, hexafluoroantimonic acid and an alkylsulphonic acid. 3. A process as claimed in claim 1 or claim 2 wherein the pH of the solution is step (i) is less than pH 1.0. 4. A process as claimed in claim 2 wherein the solution provided in step (i) is prepared by dissolving Ti metal in fluoroboric acid with a sparge of oxygen gas or air. 5. A process as claimed in any one of claims 1 to 3 wherein the solution provided in step (i) comprises said oxidant metal species in a range of from 0.01 to l.OM and the acid in a range of from 10% to 100% by weight. 6. A process as claimed in any one of the preceding claims wherein step (ii) is carried out at a temperature in the range of from 20 to 60°C. 7. A process as claimed in any one of the preceding claims wherein the alloy comprises Sn in an amount of from 5 to 99.5% by weight, Pb in an amount of up to 95% by weight, and optionally up to 5% by weight of one or more of Ag, Bi, In, Zn, Cu or Sb. 8. A process as claimed in any one of the preceding claims wherein the electrolytic reduction in step (iii) is carried out in a divided cell comprising inert electrodes and a cation exchange membrane. 9. A process as claimed in claim 8 wherein the catholyte is isolated from the air. 10. A process as claimed in claim 7 or claim 8 wherein the electrolytic reduction is carried out at a current density in the range of from 50 to 500A/m 2 . 11. A process as claimed in any one of the preceding claims wherein the oxidation in step (iv) is an electrolytic oxidation and is carried out in a divided cell comprising inert electrodes and a suitable cell separator. 12. A process as claimed in any one of the preceding claims which further comprises the step of recovering electronic components, such as transistors, capacitors and resistors, from the printed circuit board after step (ii) of claim 1. 13. A process as claimed in claim 12 which additionally comprises the step of contacting the desoldered, and optionally component-stripped, printed circuit board with a copper leaching solution suitable for dissolving Cu for a time sufficient to effect dissolution of substantially all of the Cu from said printed circuit board. 14. A process as claimed in claim 13 wherein the copper leaching solution suitable for dissolving Cu comprises copper (II) chloride, sodium chloride and hydrochloric acid or an ammonium salt, Cu(II) ions and ammonia. 15. A process as claimed in claim 13 or claim 14 wherein the additional step occurs at a temperature of from 20 to 60°C. 16. A process as claimed in any one of claims 13 to 15 which further comprises the step of electrolytic reduction of the Cu(II) species present in the resultant solution to provide Cu. 17. A process as claimed in any one of claims 12 to 16 wherein the printed circuit board is subjected to one or more mechanical processing steps prior to step (ii) in order to decrease the bulk thereof and/or to increase the accessibility of copper to the leach solution. 18. A process as claimed in any one of claims 12 to 17 wherein the electronic components are recovered in a functional state. 19. A process as claimed in any one of claims 12 to 18, wherein the electronic components are sorted according to the value of the components, the value of elements contained therein or the toxicity of elements contained therein. 20. A process as claimed in any one of claims 13 to 17, wherein the board which has been subjected to the copper leaching step comprises a plastic laminate which is then treated in order to recover any bromine which may be present in the flame retardant additives used in the manufacture of the plastics material.

Inventors: DALRYMPLE IAN MCCRADY, FRAY DEREK JOHN, GIBSON ROBERT WILLIAM, GOODMAN PAUL DAVID, HOLT LYN, DALRYMPLE, IAN, MCCRADY, FRAY, DEREK, JOHN, GIBSON, ROBERT, WILLIAM, GOODMAN, PAUL, DAVID, HOLT, LYN
Applicants: ALPHA FRY LTD, DALRYMPLE IAN MCCRADY, EA TECH LTD, FRAY DEREK JOHN, GIBSON ROBERT WILLIAM, GOODMAN PAUL DAVID, HOLT LYN, UNIV CAMBRIDGE TECH, ALPHA FRY LIMITED, CAMBRIDGE UNIVERSITY TECHNICAL SERVICES LIMITED, DALRYMPLE, IAN, MCCRADY, EA TECHNOLOGY LIMITED, FRAY, DEREK, JOHN, GIBSON, ROBERT, WILLIAM, GOODMAN, PAUL, DAVID, HOLT, LYN
Application year: 2000
Main classification: C23F1
IPC codes: C22B25, C23F1, C25C1, H05K3