CONDITIONING OF THROUGH HOLES AND GLASS

Abstract: A composition and method for cleaning and conditioning a non-conductive surface defined by a through hole in a printed circuit board (PCB) is disclosed. The through hole surface is contacted with the composition of the invention to provide a cleaned and conditioned surface. The clean and conditioned surface is coated with conductive carbon particles (usually graphite) to provide a carbon-coated surface. The carbon-coated surface is electro plated and then soldered using hot solder. Those surfaces that have been soldered and also treated with the composition of the invention exhibit fewer blow hole problems. The composition of the invention comprises carbonates, binders, and resins, and combinations thereof, that improve the adhesion and coverage of a coating containing graphite to a surface defined by a through hole bore or other substrate. ("Through holes" as used herein refers both to through holes and to vias).

Description: TITLE OF THE INVENTION CONDITIONING OF THROUGH HOLES AND GLASS BACKGROUND OF THE INVENTION The present invention is directed to pnnted circuit boards (PCB's) having through holes, or othei substrates, made electπcally conductive by applying a conductive coating containing carbon, and more particularh graphite The invention is more particularly directed to compositions compπsing a pH buffer, binders, binding agents, dispersing agents, and combinations thereof, that improve the adhesion and coverage of a conductive coating containing graphite to a surface defined by at least one through hole bore or other substrate. ("Through holes" as used herein refers both to through holes and to vias.) Conductive graphite and carbon black dispersions are used to provide a supeπor conductive coating on through hole walls and other nonconductive surfaces. Such dispersions, methods for using such dispersions to coat through holes, and improved pnnted winng boards fabncated by using such dispersions are defined in U.S. Patent Nos. 5,476,580 and 5,389,270, respectively issued to Thorn et al. on February 14, 1995, and December 19. 1995 Both patents referred to in the preceding sentence are incorporated herein by reference in their entireties A graphite composition, cleaners, conditioners, and other matenals and directions needed to practice these patents are available under the trademark SHADOW ® from Electrochemicals Inc., Maple Plain, Minnesota. Other carbon dispersions containing carbon black or graphite are descnbed, for example, in U.S. Patent No 5,139,642. Soldenng is earned out by coating the through hole walls and other conductive surfaces of a pnnted wmng board with hot, molten solder to make electncal connections by wetting and filling the spaces between the conductive through hole surfaces and the leads of electncal components which have been inserted through the through holes A properly soldered through hole is filled with solder. A problem with "blowholes" occasionally develops after the through hole wall has received a conductive coating, has been electroplated with copper, and is then suddenly heated, as by contacting it with molten solder. Soldenng heats the copper plated through hole walls very quickly. If there are any gaps or voids in the plated copper, moisture in the substrate is vaponzed by the hot solder, which can blow some or all of the solder out of the hole and breach the copper layer. The result is a blowhole or a partially-filled or empty hole, any of which is counted as a soldenng defect. It is important that voids do not develop in the copper plate. The problem of blowholes in through holes made electncally conductive by electroless plating, and the solution to blowholes when that technology is used, are descnbed in a senes of articles published m CIRCUIT WORLD, Vol. 12 No. 4 (1986), Vol. 13 No. 1 (1986), and Vol. 13 Nos. 2-3 (1987), under the common title, Blowhohng in PTH Solder Fillets. A related article is C.Lea. The Harmfidness of Blowholes in PTH Soldered Assemblies, CIRCUIT WORLD, Vol.16. No 4, (1990). All the articles in this paragraph are incorporated herein by reference in their entirety for their discussion of blowholes in electroless copper technolog} Electroplating copper to the bore of through holes presents several problems as descnbed in U.S. Pat. No. 5,725,807. Chief among these is the requirement for a conductive through hole with a coating of negligible resistance, uniform thickness, durability, and the ability to withstand solder shock tests This requirement is met, at least in part, by applying an electncally conductive particulate coating of carbon to the through hole The carbon of the particulate coating is either carbon black or graphite While the particulate coating descnbed in U S Pat No 5,725 807 provides distinct advantages and improvements over the prior art, there remains the need to improve the quality of the binding of the paniculate coating, and more particularly the binding of the graphite particles to the surface of the through hole BRIEF SUMMARY OF THE INVENTION Accordingly, an object of this invention is to provide ιmpro\ ements m the cleaning and conditioning of through holes and glass fibers Another object is to provide a pnnted wmng board conditioner to improve the adhesion of carbon particles to the conditioned surface Yet another object is to piov ide a substrate conditioner that improves the continuity of coverage of carbon particles on a through hole wall or other substrate A furthei object is to provide a method of soldenng through holes to produce fewer blowholes At least one of these objects is addressed, in whole or m part b\ the present invention We have discovered that the binding and continuous coverage of carbon particles to a surface defined by at least one through hole is greatly improved by the addition of an ingredient selected from a pH buffer, a binder, a dispersant, or combinations thereof, to a conditioning formulation applied to a substrate before the carbon particles are applied BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING The following is a bnef descnption of the drawing w hich is presented for the purpose of illustrating the invention and not for purposes of limiting the same FIG 1 shows a schematic flow chart depicting one aspect of the present invention FIG. 2 shows the chemical steps in one aspect of the present invention DETAILED DESCRIPTION OF THE INVENTION While the invention will be descnbed m connection with one or more embodiments, it will be understood that the invention is not limited to those embodiments. On the contrary, the invention includes all alternatives, modifications, and equivalents as may be included within the spint and scope of the appended claims. The present invention is directed to a conditioning composition including, beyond the usual conditioning ingredients, one or more of the following: a binding agent, a pH buffer, a dispersing agent, and combinations thereof, that improve the adhesion and coverage of a conductive coating containing graphite to a surface defined by at least one through hole bore or other substrate Cleaning compositions, conditioning compositions, and cleaner/conditioner compositions contemplated for use in the invention are descnbed in detail in U.S. Patent Nos 5,725,807 and 5,690,805, which are incorporated by reference, and in matenal incorporated therein by reference Some of the useful ingredients of such compositions are descnbed below Conditioning Agent In the conditioning step, the substrate is contacted with a conditioning agent, which is a substantive matenal, commonly a cationic matenal such as a polyamidoamme, a cationic polymer, a cationic surfactant, or the like. The conditioning agent is applied as an adhesion promoter so the substrate will be attractive to the anionic particles of carbon which are later applied by contacting the substrate with a carbon dispersion. The conditioner can be an alkaline aqueous solution or dispersion of a conditioning agent selected from the group consisting of SANDOLEC CF SANDOLEC CU SANDOLEC CS SANDOLEC CL SANDOLEC CT CALLAWAY 6818 CYASTAT SP CYASTAT LS CYASTAT SN CYANAMER A-370 MAGNIFLOC 496 DAXAD CP2 PRIMAFLO C C3 CAT-FLOC CAT-FLOC T RETEN 210 POLYTEC 7M PERCOL 727 PERCOL 763 OCTOPOL SDE-25 OCTOPOL SDM-40 GLO-CLEAR 2202 GLO-CLEAR 2220 GLO-CLEAR 2283 PRIFRAC 2990 ALUBRAFSOFT GSS FIBRABON 35 DENSEFLOC 30 CALLAWAY 6817 CALLAWAY 6831 and combinations of those conditioners. A conditioner will also commonly contain a base. The bases contemplated herein include lower alkanol ammes (lower alkanol being defined as 1- to 4-carbon alcohol moieties), such as ethanolammes. for example mono-, di- or tnethanolamine; alkali matenals generally, such as alkali metal hydroxides, carbonates, and bicarbonates, for example potassium hydroxide, carbonate, or bicarbonate, other matenals capable of raising the pH of the composition, preferably to at least about 9, and mixtures of such matenals. Binding Agent One component of some of the compositions of the present invention is a water soluble or dispersible binding agent for binding the carbon particles The binding agent is believed to assist the dispersed carbon particles m adhenng to the surface of the non-conductive (i.e.. dielectnc) substrate which is to be made conductive for electroplating The binding agent may be present as from about 0% to about 15% by weight, or from about 0 2 to about 10% by weight, or from about 0.5% to about 6% by weight, or from about 1.5% to about 3% by weight, of the composition. The binding agent of the present invention is preferabh any natural oi synthetic polymer, polymenzable monomer, or other viscous or solid matenal (or precursor thereof) that is capable of both adhering to the carbon particles and of receiving an anionic dispersing agent (as descnbed below). For example, the binding agent may be a water soluble or water dispersible matenal selected from the group consisting of mono- and polysacchandes (oi , more broadly, carbohydrates) and anionic polymers Typically, for purposes of this invention, a 2% by eight aqueous test solution of the binding agent will have a viscosity within the range of 25-800 cps at 25°C, although other concentrations of the binding agent and other viscosities of the complete through hole coating composition are also contemplated herein Monosacchande binding agents contemplated for use herein include tetroses, pentoses, and hexoses. Polysacchande (which for the present purposes includes disacchande and higher sacchande) binding agents contemplate for use herein include sucrose (from beets, sugarcane, or other sources), maltose, fructose, lactose, stachyose. maltopentose, dextrin, cellulose, corn starch, other starches, and polysacchande gums. Polysacchande gums contemplated for use herein include agar, arable, xanthan (for example, KELZAN industnal grade xanthan gum. available from the Kelco Div. of Merck & Co, Inc. of Rahway, N.J.), pectin, alg ate, tragacanath, dextran, and other gums. Denvative polysacchandes contemplated for use herein include cellulose acetates. cellulose nitrates, methylcellulose, and carboxymethylcellulose Hemi-cellulose polysachandes contemplated for use herein include d-gluco-d-mannans, d-galacto-d-gluco-d-mannans. and others. Anionic polymers contemplated herein include the alkylcelluloses or carboxyalkylcelluloses, their low- and medium-viscosity alkali metal salts. Examples include methyl cellulose (CAS registry no.: 9004-67-5); sodium carboxymethylcellulose, or "CMC"; CAS register no.: 9004-32-4; cellulose ethers; and nitrocellulose. Examples of such anionic polymers include KLUCEL hydroxypropylcellulose: AQUALON CMC 7L sodium carboxymethylcellulose, and NATROSOL hydroxyethyl cellulose, which are all commercially available from Aqualon Company of Hopewell, Va.; ethylcellulose, available from Hercules of Wilmington, Del.; METHOCEL cellulose ethers, available from Dow Chemical Co., Midland, Mich.; and nitrocellulose, which is also available from Hercules. Sodium CMC is an anionic water soluble polymer denved from cellulose. Sodium CMC is believed to act as a thickener, binder, stabilizer, protective colloid, suspending agent, and rheology, or control flow, agent The acrylics contemplated herein for use as binding agents include polymenzable monomers and polymers, for example, emulsion polymers commonly known as acrylic latices. The monomers include acrylamide, acrylomtnle, acrylic acid, methacryhc acid, glycidyl methacrylate, and others The acrylic polymers include polymers of any one or more of the foregoing monomers; polyacrylamide polymers such as SEPARAN NP10, SEPARAN MGL, SEPARAN 870, and SEPARAN MG200 polymers, polyacryhc acid; acrylic ester polymers such as polymethyl acrylate, polyethyl acrylate, polypropyl acrylate. polyisopropyl acrylate, polybutyl acrylate, polyisobutyl acrylate, polypent\l ac late, polyhexyl acrylate, polyheptyl acrylate, polyoctyl acrylate, and polyisobomyl acrylate, and other polyacrylates Suitable acrylics available to the trade include NALCO 603, PURIFLOC C31, and ACRYSOL® acrylics sold Rohm and Haas Company of Philadelphia, Pa Other binding agents are also contemplated herein The vinyl resins contemplated herein include polyvinyl acetates, ethers, and polyvinyl chlorides The pyrro dinone resins contemplated herein include poly(N-vιnyl- 2pyrrohdιnone) Representative trade matenals of this kind are PVP K-60 resin, PVP/VA E335 resin, PVP/VA 1535 resm, and other resins sold by GAF Corporation The polyols contemplated herein include polyvinyl alcohols The polyvinyl alcohols contemplated herein include ELVANOL 90-50, ELVANOL HV, ELVANOL 85-80, and others Cationic resins and other matenals contemplated for use herein as binding agents include polyethylenimme, methylaminoethyl resins, alkyltnmethylammomum chlondes, and others Esters of olefimc alcohols, l esters, esters of ether alcohols, cycloalkyl esters, and esters of halogenated alcohols are also contemplated for use as binding agents Polyethylene oxides, such as matenals available under the trade names NSR N-10. NSR N3000. and NSR 301 from Union Carbide Corp., are contemplated herein Still more binding agents contemplated herein include epoxy resins, cresol novolac resins, phenol novolac resins, epichlorohydnn resins; bisphenol resins, phenolic resins, such as DURITE AL-5801A resm av ailable from Borden Packaging and Industnal Products of Louisville, K\.. and natural resins and polymenzable matenals such as damar, manila, rosin gum, rosin wood, rosm tall oil, and others. A practical upper limit to the amount of binding agents used is contemplated to be that amount which matenally interferes with the conductivity of the resulting conductive coatings by diluting the conductive solids in the composition after it is deposited as a film. Dispersing Agent Another component of some of the compositions of the present invention is an anionic dispersing agent. The anionic dispersing agent has a molecular weight less than about 1000 Daltons, so it is a substantially smaller molecule than the binding agent. The anionic dispersing agent has a hydrophobic end and a hydrophihc (anionic) end. It functions by surrounding the bound carbon particles and causing the bound particles to disperse. It is believed that the hydrophobic end of each anionic dispersing agent is attracted to the hydrophobic region of the binding agent, thereby causing the anionic end of the anionic dispersing agent to stick out into the aqueous surrounding dispersing medium. When each bound carbon particle has sufficient dispersing agent bound to it, the sphere of anionic charges surrounding each particle causes the particles to repel one another, and thus, to disperse The amount of anionic dispersing agent that is contemplated m the composition of the present invention is an amount sufficient to cause the bound carbon particles to disperse in the aqueous dispersing medium. The amount of dispersing agent that is used is dependent upon the size of the carbon particle and the amount of binding agent bound thereto. As a general rule, smaller carbon particles require lesser amounts of dispersing agent than would be required to disperse larger particles To determine the amount of dispersing agent that is required m any particular case, one of ordinary skill m the art can begin by adding e\ er increasing amounts of dispersing agent to the bound carbon particles until a sufficient amount is added to cause the particles to disperse. This amount of dispersing agent is the minimum effective amount of dispersing agent Increasing amounts of dispersing agent could be added without adversely affecting the dispersion of the carbon particles. To ensure that the particles remain dispersed, one could add a ten percent greater amount of dispersing agent than is needed. Thus, for purposes of the present invention, the amount of anionic dispersing agent that is used in the composition of the present invention must be an amount that is effective for dispersing the bound carbon particles. For example, the anionic dispersing agent may be present as from about 0% to about 10% by weight, alternatively from about 0.01% to about 5% by weight, alternatively from about 0.1% to about 2% by weight of the composition A practical upper limit to the amount of anionic dispersing agents used is contemplated to be that amount which matenally interferes with the conductiv ity of the resulting conductive coatings by diluting the conductive solids in the composition after it is deposited as a film Suitable anionic dispersing agents include acrylic latices, aqueous solutions of alkali metal polyacrylates. and similar matenals Specific dispersing agents contemplated herein include ACRYSOL® 1-1955, ACRYSOL® G110. and ACRYSOL® 1-545 dispersing agents, all of which are commerciallv available from the Rohm and Haas Co., Philadelphia, Pa. The ACRYSOL® dispersing agents may be used alone or together. Buffers The composition and method of the present invention is capable of being run over a wide pH range The present composition may have a pH within the range of from about 4 to about 14. An alternative pH range is from about 9 to about 11, another is from about 9.5 to about 10.5, and still another is from about 10.7 to about 11. Preferably, the pH is maintained by a pH buffer The buffer functions by precluding or minimizing changes m pH such as may occur dunng the course of a run as a large number of boards are treated with the composition of the present invention. The maintenance of a constant or nearly constant pH insures the composition is reproducible from board to board. Another advantage of using a buffer system is that the normalities of one or more buffer components can be measured and adjusted to maintain proper process control. A pH in the preferred range can be provided bv a carbonate-bicarbonate buffer. The use of other pH buffenng systems, such as phosphate, acetate, borate, barbital, and the like, are well known in the art. The anions of the buffer may be associated with any suitable cation, such as an alkali metal cation, such as sodium, potassium, or lithium; or an ammonium cation. Cleaning/Conditioning The present invention can also be earned out by using a single treatment both to clean and condition a nonconductive substrate In the event a combined cleaner/conditioner is to be made, cleaning ingredients can be added to the conditionei The pnncipal cleaning ingredients contemplated herein, beyond the ingredients specified previously for a conditioner formulation, are one or more of the following nomonic surfactants, glycols, or chelating agents The nomonic surfactants contemplated herein include the following TERGITOL 15-S-9 TERGITOL 15-S-15 NEODOL 25-12 IGEPAL CO730 IGEPAL CO887 TERGITOL NP- 15 MIRANOL 2M-CA MIRANOL 2M-CT MIRANOL CM-SF MIRANOL J2M-SF MIRANOL S2M-SF and combinations of those surfactants The alkylene glycols contemplated herein include 1- to 4-carbon alkylene glycols and their dimeis and ohgomers Specific alkylene glvcols contemplated herein include ethylene glycol, propylene glycol. butylene glycols, diethylene glycol, tnethylene glycol and mixtures of such matenals The chelatmg agents contemplated herein include alkali metal salts of ethylenediammetetraacetic acid (EDTA), foi example, sodium EDTA (Na 4 EDTA) Other suitable chelatmg agents may also be readily found by one of ordinary skill in the art Refernng to Figs 1 and 2. the cleaning and conditioning of the substrate forms part of a step by step procedure in which a suitable substrate might be placed in a bath containing the cleaner/conditioner, followed bv a nnsing step, followed by a carbon coating composition such as SHADOW 0 1 or SHADOW ® 2, followed by the electroplating step Cleaner/conditioners and conditioners according to the present invention have been found to reduce the problem of blowholes, which the inventors believe is related to the formation of voids It is believed that voids occur because the conductive coating applied to the substrate is deficient in some manner Where the conductive coating, for example a graphite coating, fails to cover the substiate adequately the copper electroplating of the conductive coating results in voids To avoid v oids, the conductive coating must be applied evenly and consistently to the substrate and remain in place It is believed that adhesion and coverage of the conductive coating to the surface of the substrate are important factors in minimizing the occurrence of blowholes While the invention is not limited by anv theorv as to why the composition of the invention improves the coverage and adhesion of a carbon coating to the surface of the through hole, the inventors believe the composition functions as follows When the composition is contacted with the non-conductive surface of the through hole, a thin layer of the composition is believed to adhere to the surface by means of largely non-covalent interactions with the surface of the substrate It is believed that when the conductive carbon composition is contacted with the substrate that has been treated w ith the composition of the invention, the carbon adheres to the surface in a continuous and even manner to achieve good coverage Subsequent copper electroplating of the conductive carbon layer produces few or no v oids Soldenng the copper plated through holes of the invention results in few or no blowhole problems One way for assessing the effectiveness of the cleaning and conditioning agents is by performing the hot oil thermal shock test. Hot oil is substituted for hot solder to provide a method to detect unwanted voids in copper plated substrate, particularly copper plated through holes The copper plated through hole is contacted with the hot oil and the thermal shock causes moisture trapped in any voids to vaponze Through holes and vias subjected to the hot oil test may be sectioned and examined microscopically for voids Alternatively , the through holes may be conventionallv, electroplated as printed wiring boards would be processed, the through holes then sectioned by cutting the boards, and the plated through holes evaluated for lump ess. pullaway, and voids under microscopic examination The effectiveness of the cleaning conditioning process of the present invention w as partly evaluated by assessing the degree of coverage of the graphite using a back lighting technique and further evaluated by a hot oil test procedure with an accompanying blowhole evaluation BACK LIGHTING TECHNIQUE In the back lighting technique a treated substrate is examined at low magnification to assess the degree of coverage in terms of back ght-v alues that can range from 1 to 10 or 10% to 100% THE HOT OIL TEST PROCEDURE The hot oil test procedure and accompanying blowhole evaluation is descnbed here with reference to SHADOW ® 2 graphite dispersion a cleaner/conditioner formulation The hot oil test procedure and accompanying blowhole evaluation can be earned out by making up separate one liter amounts (with DI, deionized water) of SHADOW ® 2 (8%) one part (available from Electrochemicals Inc.) and one part DI to piovide a "SHADOW ® bath", microetch solution 75g/l sodium persulfate & 1% v/v sulfunc acid, Acid Cleanei 7 A 15% v/v (available from Electrochemicals Inc ) With these solutions on hand place one to four coupons (i.e. substrate) on copper hooks and perform the steps listed in Table 4: BLOWHOLE EVALUATION After step 12 of Table 4 is complete a blowhole evaluation is performed to determine the number of holes that outgas. To ensure accurate counts, a VCR and camera may be used. The blowhole evaluation can be carried out, as follows: (i) Heat a quantity of oil (source for this oil etc.) sufficient to cover the coupons (heat to 235°C). Use stir bar to stir oil. (ii) Set up a suitable camera with VCR, check focus of camera by focusing on heated oil. Start camera and VCR. (iii) Turn off stir bar, using tongs and protective face mask carefully place the coupon in the hot oil. Record the coupon using the camera for about 5 seconds, (iv) Remove the coupon from the hot oil. Stop recording. (v) Rewind VCR tape and play the recording on a monitor by advancing in 3 second (±1/30 sec.) intervals. Count the number of holes that were outgassing and the total number of holes. The '"Hot Oil Test %"result is calculated as follows: Hot Oil Test % = [(number of holes that were outgassing) ÷ (total number of holes)] * 100. The following examples represent specific but nonlimiting embodiments of the present invention: EXAMPLE 1 The effect of different cleaning and conditioning agents ("CL/COND") with and without binders on the degree of coverage achieved with the SHADOW ® 1 Colloidal Graphite Dispersion was examined. The formulations and resulting observations are set out in Table 2. ; ' 1> The "9c " values in the "Formulation" column indicate the proportion of the as-sold cleaner/conditioner used in the bath; applies to all Examples. *2> Deionized water; applies to all Examples. *3> In practice, the working cleaner/conditioner was maintained between the range of 140°F to 160°F (60°C -71°C); applies to all Examples. EXAMPLE 2 The effect of different cleaning and conditioning agents ("CL/COND") with and without binders on the degree of coverage achieved with AQUADAG E, sold by Acheson Colloids Company, P.O. box 611757, Port Huron, Michigan, Asbury Graphite Mills Inc., Asbury, N.J, was examined. The formulations and resulting observations are set out in Table 3. EXAMPLE 3 The effect of different cleaning and conditioning agents ("CL/COND") with the SHADOW ® 1 and SHADOW ® 2 formulations was examined. The formulations and resulting observations are set out in Table 4. TABLE 4 CL/COND with Shadow 1 vs. CL/COND with SHADOW® 2 Run Formulation Coverage in Hot Oil Comments 10 minute Test plating % Scale 1-10 Colloidal Graphite #1 Dispersion A" A) 9.0 to 9.5 A) 60 No binder in 1 part SHADOW ® 2 cleaner/conditioner. (8% cone.) 1 part DI B) 9.0 to 9.5 B) 16 Colloidal Graphite Dispersion "B" 2 parts Shadow 1 1 part DI CL/COND for A & B CL/COND III 20% v/v Colloidal Graphite ! #2 Dispersion A" A) 9.0 A) 100 CL/COND III with 1 part SHADOW ® : ACRYSOL® I- (8% cone.) 1955 dispersant 1 part DI B) 10.0 B) 5.5 provides better Colloidal Graphite Coverage and Hot 11 Company The foregoing examples show that better coverage and fewer blow holes can be obtained by adding a binder and/or a dispersing agent, as defined above, to the cleaner/conditioner or conditioner formula applied before a carbon containing is applied While the invention is descnbed above in connection with preferced or illustrative embodiments and examples, thev are not intended to be exhaustive or limiting of the invention Rather, the invention is intended to cover all alternatives, modifications and equivalents included within its spirit and scope of the invention, as defined by the appended claims

Claims: CLAIMS: 1 A conditioning composition for improving the adhesion and coverage of a conductive coating to a surface comprising a through hole bore, said conditioning composition compnsing a conditioning agent and a further ingredient selected from a pH buffer, a binding agent, anionic dispersing agent, and combinations thereof 2 The composition of claim 1. wheiein said further ingredient is a carbonate- bicarbonate buffer. 3. The composition of claim 2, wherein said carbonate-bicarbonate buffei compnses potassium cations. 4 The composition of claim 1, wherein said composition further compnses a surfactant. 5. The composition of claim 1, wherein said conditioning agent is an anionic dispersing agent. 6 The composition of claim 5. wherein said anionic dispersing agent is an acrylic latex having a molecular weight of less than about 1000 7. The composition of claim 1, wherein said conditioning agent is a binding agent. 8. The composition of claim 7, wherein said binding agent is carboxymethylcellulose 9. A method for providing a soldered surface that is substantially free of blow holes, compnsing the steps of: (a) contacting a surface with a conditioning composition to provide a conditioned surface, said conditioning composition compnsing a conditioning agent and at least one of a buffer, a anionic dispersing agent and a binder; (b) contacting said conditioned surface with a conductive carbon coating to provide a carbon coated surface, (c) electroplating said carbon coated surface to provide an electroplated surface, and (d) soldenng said electroplated surface to provide a soldered surface that is substantially free of blow-holes. The composition of claim 9, wherein said conditioning composition compnses an anionic dispersing agent. The composition of claim 9, wherein said conditioning agent compnses a binder. The composition of claim 11, wherein said conditioning composition compnses sodium carboxymethylcellulose.

Inventors: CARANO MICHAEL V, POLAKOVIC FRANK, CARANO, MICHAEL, V., POLAKOVIC, FRANK
Applicants: ELECTROCHEMICALS INC, ELECTROCHEMICALS INC.
Application year: 2000
Main classification: H05K
IPC codes: C25D5, C25D7, H05K3