OPTICAL INSPECTION METHOD AND APPARATUS

Abstract: A method and an apparatus for an optical inspection of an object (12), having upper (12A) and lower (12B) faces, so as to detect defects existing on the object. First and second beams (118A, 130A) of an incident radiation are produced and directed onto the object. A light component (140) of the first incident beam, which is reflected from one face of the object, and a light component (142) of the second incident beam, which is transmitted through the upper and lower faces of the object, are simultaneously sensed. First and second images, formed, respectively by reflected and transmitted light components are acquired and analyzed so as to provide data indicative of the defects.

Description: Optical Inspection Method and Apparatus FIELD OF THE INVENTION The present invention is in the field of optical inspection techniques and relates to a method and a system for inspecting patterned objects such as, for example, photomasks, printed circuit boards (PCBs) or the like. BACKGROUND OF THE INVENTION There is a great variety of optical inspection systems having a common goal for locating defects existing on the patterned surface of an inspected object. The term "patterned surface " signifies such a surface which is formed with regions having different optical properties in respect of an incident radiation. An inspection system of the kind specified typically comprises means for iUuminating an object to be inspected, acquiring images formed by light reflected from the Uluminated object, and image processing. However, if the inspected object is a photomask, flexible printed circuit board (PCB) or the like, whose pattemed surface typically comprises transparent and opaque regions, the acquired images formed of light reflected from the illuminated surface are not indicative of such 'defects' as foreign particles, for example, of dirt or dust which may occasionally be located in the transparent regions. Indeed, it is known that a surface of such particle is not mirror like, and, accordingly, light returned from the particle is irregularly reflected, scattered light. The problem is very essential when using the photomask as a phototool in PCB, graphic arts and printing industries. There have recently been developed methods and systems wherein the inspection is performed by means of Ulu inating an object and /acquiring and processing images formed of reflected and transmitted beams of light. Such systems are disclosed, for example, in U.S. Patents Nos. 5,572,598 and 5,563,702. The systems in both patents employ a so-called 'scanning technique', wherein an illuminating laser beam is generated and focused onto a pixel defining spot on the surface of an object to be inspected. The illuminated beam is deflected in an oscillatory fashion so as to sweep the spot across the inspected surface. The system is adapted for three different modes of operation. According to the first and second modes, so-called "Transmitted Light Inspection Mode" and "Reflected Light Inspection Mode", the object is point-by-point inspected by means of detecting either transmitted or reflected light, respectively. These modes of operation are timely separated. The third mode of operation, which is aimed at defects classification, is based on detecting both reflected and transmitted beams of light. A single laser beam of incident radiation is directed onto the patterned surface of an object through light deflection means and is either reflected or transmitted, or partly reflected and partly transmitted by the object. The intensity of the incident beam is determined before its interaction with the object. Two separate detectors are accommodated at opposite sides of the object and detect transmitted and reflected beams resulting from this interaction. To this end, the system comprises separate directing optics for receiving the transmitted and reflected beams, respectively, and directing them onto the detectors. This approach is based on that the interaction of an incident beam with an object to be inspected causes changes in beam's intensity, which changes depend on reflectivity and transmission of the respective region of the object. Hence, by appropriately detecting the intensities of the incident beams and reflected and transmitted beams, respectively, before and after the interaction, each inspectable point, or pixel, on the surface can be represented in a so-called 'T-R space', namely by a point with coordinates corresponding to the transmitted and reflected signal values produced at that point. However, the system requires very complicated arrangements for iUuminating and collecting optics. Indeed, the illuminating arrangement should be provided with the light deflection means and detector appropriately accommodated in the optical path of the incident beam so as to determine the beam intensity prior to the interaction with the object. This complicates and extends the optical path of the incident beam. Moreover, the use of a single beam of incident radiation results in an unavoidable requirement for locating the collecting optics, as well as the detectors for sensing the reflected and transmitted beams, at opposite sides of the object. SUMMARY OF THE INVENTION It is an object of the present invention to provide novel method and apparatus for automatic optical inspection of an object by means of detecting reflected and transmitted light components of an incident radiation. There is provided, according to one aspect of the invention, a method for an optical inspection of an object, having upper and lower faces, so as to detect defects existing on the object, the method comprising the steps of: (a) providing first and second beams of an incident radiation; (b) directing the first beam of the incident radiation onto the object and sensing a light component reflected from one face of the object; (c) directing the second beam of the incident radiation onto the object and sensing a light component transmitted through the upper and lower faces of the object; (d) simultaneously acquiring first and second images of the object, wherein the first image is formed by the reflected light component and the second image is formed by the transmitted light component; and (e) analyzing said first and second images so as to provide data indicative of said defects. The term "defects" used herewith signifies certain undesirable conditions of the object such as, for example, existence of foreign particles located on the object. Thus, the idea of the present invention is based on the following main features. The first and second beams of incident radiation are produced and directed towards the object for focusing them onto the upper face. It is understood that, generally, each of the incident beams can be both reflected and transmitted by the different regions of the object. In other words, each of the incident beams, depending on the region of its interaction with the object, may be partly transmitted and partly reflected resulting in, respectively, transmitted and reflected light components. To this end, what is actually detected by two image sensors are, respectively, that light component of the first incident beam which is reflected from the object and that light component of the second incident beam which is transmitted through the object. Generally, the first and second incident beams can be directed onto the object from the same side thereof, that is from either the upper or the lower face. In this case the sensors and associated directing optics are located at opposite sides of the object. It should be noted that it is advantageous to illuminate the object from opposite faces. This enables the sensors to be placed at one side of the object and, accordingly, a common directing optics to be employed for receiving both the reflected and transmitted light components and directing them onto the respective sensors. Thus, the reflected and transmitted light components are, preferably, directed onto the different sensors via a common optical system appropriately accommodated in the optical paths of the both light ^ components. It is understood that, accordingly, means should be provided for successfully separating the different light components so as to be sensed by the different image sensors. To this end, two alternating embodiments of the invention are exemplified. According to one embodiment, the first and second beams of the incident radiation are simultaneously directed onto different portions of the object. More specifically, they illuminate, respectively, first and second spaced-apart, parallel, identical strips of the upper face. The relationship between the two iUuminated strips and the common optical system is such that the strips extend symmetrically relative to the optical axis of the common optical system. The optical system actually projects the strips onto the first and second image sensors, which are, preferably, line sensors. Hence, a pair of spaced, parallel lines of the object is imaged. It is understood that the dimensions of the line are defined by a field of view of the image sensor, the width a of the line being substantially smaller than that of the iUuminated strip. The space between the two illuminated strips is adjusted so as to rninimize an overlap region between the two images. The space d between the two imaged lines satisfies the following condition: d=ria wherein n is an integer such that n≥l. According to an alternative embodiment of the invention, the first and second beams of the incident radiation Uluminate the same portion of the upper face, which portion is in the form of a strip. To this end, the first and second beams of the incident radiation are formed of light having either different wavelengths, or different " polarizations. In the case of different wavelengths, the common optical system comprises a suitable beam splitter, for example, a dichroic beam splitter. In the case of the different polarizations, the common optical system is provided with appropriate beam polarizer device based, for example, on a double refraction effect. The first and second beams of the incident radiation may be produced by either two light sources, or by a single Ught source adapted for generating a beam of Ught. If the single Ught source is employed, the generated beam is directed towards the object via a beam spUtter, which spUts it into the first and second beams of the incident radiation. Preferably, the image sensors are of a kind adapted to receive a light signal and provide an electric output representative thereof. For example, charge coupled device (CCD) cameras, or bi-directional time delay integration (TDI) sensor may be employed. In order to successively inspect the whole object, it is supported for sUding movement within an inspection plane along two orthogonally oriented axes. It is appreciated that in order to allow for so-caUed "double side" iUumination, the object may be supported on a transparent slab, or, alternatively, on a frame supporting solely the periphery region of the object. As a result of the inspection, each point on the upper face of the object is represented by so-caUed 'reflected' and 'transmitted' images. Comparing these images to each other enables to locate the defects, if any, on the object. For that purpose, the output signals provided by the image sensors are transmitted to a processor operated by a suitable software for comparing the first and second images to each other. According to another aspect of the present invention there is provided an apparatus for an optical inspection of an object, having upper and lower faces, so- as to detect defects existing on the object, the apparatus comprising: (i) an illumination system for producing first and second beams of an incident radiation and simultaneously directing them onto the object; (ii) a sensing system mounted for sensing a light component of the first incident beam reflected from the upper face and a Ught component of the second incident beam transmitted through the upper and lower faces of the object, and for providing output signals representative thereof; (iv) a Ught directing system accommodated in optical paths of the reflected and transmitted Ught components for directing them onto the sensing system; and (v) a processor coupled to the sensing system for receiving and analyzing said output signals representative of the reflected and transmitted Ught components and for providing data indicative of said defects. Thus, the present invention enables to inspect an object by simultaneously iUuminating it by two incident beams of Ught and detecting reflected and transmitted Ught components of these incident beams, respectively. In other words, in comparison to the above U.S. Patents, each point of the inspected object is represented by both "T-map" and "R-map", i.e. "transmitted image" and "reflected image". This simpUfies the analyzing procedure. AdditionaUy, owing to the provision of the common optical system for directing the reflected and transmitted beams onto the different sensors, and the above solutions for successful separation between the reflected and transmitted beams, the construction and operation of the apparatus can be significantly simpUfied. More specificaUy the present invention is used for inspecting a photomask which is typically in the form of a polished transparent substrate whose upper surface has a plurality of spaced-apart regions coated by a thin opaque layer such as, for example, chromium. The upper surface of the photomask represents a pattern in the form of transparent and opaque regions. Defects, which can be detected by the method according to the invention, may also be in the form of through-holes in the opaque regions and/or width variation of these regions. It is understood that the opaque and transparent regions of a photomask would be represented by bright and dark regions in the 'reflected image' and by dark and bright regions, respectively, in the 'transmitted image'. If a foreign particle is located in the transparent region, it will appear as a bright spot on a dark background in the reflected image and vice versa in the transmitted image. If a foreign particle is located in the opaque region, solely the image sensor responsive to the reflected Ught component wiU detect it. Such particle wiU appear as a dimmer spot on the bright background in the reflected image. The other kinds of defects such as, for example, through-holes in the opaque regions or width variation of these regions wiU be detected by both the reflected and transmitted beams. BREEF DESCRIPTION OF THE DRAWINGS In order to understand the invention and to see how the same may be carried out in practice, several preferred embodiments wiU now be described, by way of non-Umiting example only, with reference to the accompanying drawings, in which: Fig. 1 is a block diagram iUustrating the main components of an apparatus for optical inspection of a patterned object, according to one embodiment of the invention; Figs. 2 and 3 more specificaUy iUustrate the main principles of operation of the apparatus of Fig. 1; Fig. 4 is a graphic iUustration of the main principles of operation of an optical system of the apparatus of Fig. 1; Figs. 5a to 5f are schematic illustrations of images of the illuminated portion of an upper surface of the object during sequential steps of operation of the apparatus of Fig. 1; Figs. 6a and 6b are schematic iUustrations of two images of a region of the upper surfaces of the object; and Fig. 7 is a block diagram illustrating the main components of an inspection apparatus, according to another embodiment of the invention; and Fig. 8 is a block diagram iUustrating the main components of an inspection apparatus, according to yet another embodiment of the invention. DETAD ED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to Fig. 1, there is iUustrated an apparatus, generally designated 10, for inspecting a photomask 12. The propagation of beams of Ught is shown here schematicaUy solely in order to faciUtate the understanding of the main principles of the construction of the apparatus 10. The photomask 12 is typicaUy in the form of a polished transparent substrate having upper and lower surfaces 12a and 12b, respectively. The upper surface 12a is formed with a pattern (not shown) having a plurality of spaced-apart regions coated by a thin opaque layer such as, for example, chromium. In other words, surface 12a is formed with transparent and opaque regions. The photomask 12 is supported at its periphery region on a frame 14 mounted for sliding movement along mutuaUy orthogonal axes x and y. Alternatively, a sUding base formed of a transparent material may be employed for the same purpose of sUdingly displacing the photomask 12 within an inspection plane in a manner to provide iUumination access to the lower surface 12b. The apparatus 10 comprises an iUumination assembly, generally at 16 mounted at the upper side of the photomask 12 for Uluminating its upper surface 12a. The assembly 16 includes a Ught source 18, producing a beam of light 18a, and an optical system 20, accommodated in the optical path of the beam 18a. The optical system 20 includes an anamorphic optics 22 typically comprising a cylindrical lens or pluraUty of such lenses, which are not specifically shown, a beam splitter 24 and an objective lens 26. All these components of the optical system 20 are well known per se and, therefore, need not be described in more detail, except to note that they enable a desired shape of the beam 18a to be obtained and focussed onto the photomask 12. 'As shown, the beam 18a iUuminates a strip S r of the upper surface 12a. Further provided is an iUumination assembly, generally designated 28, mounted at the lower side of the photomask 12 for Uluminating its upper surface 12a. Similarly, the assembly 20 includes a Ught source 30 producing a beam of Ught 30a, and an optical system 32 accommodated in the optical path of the beam 30a. The optical system 32 comprises an anamorphic optics 34, a mirror 36 and a condenser lens 38. The beam 30a, being transmitted through the transparent lower surface 12b, iUuminates a strip S t of the upper surface 12a. It wiU be understood that the provision of the mirror 36 is optional and depends solely on the location of the Ught source 30 relative to the surface 12b. As further schematically shown in Fig. 1 and more specificaUy in Fig. 2, the beam 18a impinges onto the surface 12a and is reflected from reflective regions, if any, disposed within the strip S r , resulting in a reflected beam 40. The incident beam 30a, being transmitted through the transparent lower surface 12b of the photomask 12, impinges onto the upper surface 12a and is transmitted through transparent regions, if any, within the strip S t , producing a transmitted beam 42. An optical system 44, typicaUy comprising a collecting lens or pluraUty of such lenses (not shown), is located at the upper side of the photomask 12 so as to be in the optical paths of both the reflected beam 40 and transmitted beam 42. The system 44 has its optical axis shown in dotted line OA. The system 44 directs the beams 40 and 42 onto line sensors 46 and 48. respectively, thereby projecting two geometrically separated strips S r and S t into two imaged lines L r and L t . The image L r is formed by light reflected from the strip S r illuminated by the beam 18a, while the image L t is formed by light transmitted through Uluminated strip S t . As more specifically illustrated in Fig. 3, in order to render the image quaUty at both sensors equal, the configuration is such that the illuminated strips S r and S t extend 'symmetrically relative to the optical axis OA. It is understood, although not specifically illustrated, that the dimensions of the imaged lines L r and L t are defined by the field of view of each of the sensors 46 and 48 and are substantiaUy smaUer than those of the strips S r and S t . The sensors 46 and 48 are of a kind adapted for receiving light signals and generating electrical outputs corresponding thereto such as, for example, a conventional line-type CCD camera. Fig. 4 iUustrates the intensity distributions of the beams 40 and 42 which are in the form of two lobes 50 and 52, respectively. It is appreciated that the spacing between the two iUuminated strips S r and S t is arranged so as to minimize an overlap region 54, thereby reducing crosstalk between the two images. Turning back to Fig. 1, coupled to the sensors 46 and 48 is a processor 56 receiving the electrical outputs of the sensors 46 and 48. The processor 56 is operated by suitable software carrying out an image processing technique capable of analyzing the imaged lines L r and L t by means of comparing the electrical outputs to each other and of providing information indicative of defects, if any, on the photomask 12. The electrical outputs may also be compared with corresponding reference data which may be stored in a database of the processor 56 or derived from another photomask or from another part of the same photomask being inspected. The construction and operation of the processor 56 do not form a part of the present invention and therefore need not be more specifically described. The information generated by the image processor 56 is output to a computer device 58 and displayed on its screen 58a. Alternatively, although not specifically shown, the processor 56 and the computer device 58 may be combined in one integral unit. The light sources 18 and 30 may be replaced by a single Ught source for generating a beam of radiation, in which case the generated beam is directed onto the 'inspected photomask via a beam spUtter so as to be split into two separate beams for iUuminating the photomask from opposing sides. The operation of the apparatus 10 wiU now be described with reference to Figs. 5a-5f, partly iUustrating images of the upper surface 12a of the photomask 12 during the inspection. Initially, two strips are simultaneously illuminated (not shown) in the above described manner and two lines Lri and Lti are imaged. The lines Lri and Lti are identical having the same width a and length b and are aUgned in a spaced-apart, parallel relationship along the y axis. A space d between the lines Lri and Lti is defined as foUows: d=ria (1) wherein « is an integer n≥l, being equal to i in the present example. At a next operational stage, the support frame 14 moves the photomask a certain preset step Hi in a direction Di along the axis y, which step satisfies the foUowing condition: Rf=nia (2) wherein i; is an integer nι>l, being equal to 1 in the present example. A further pair of lines Lr 2 and Lt 2 is imaged by the sensors 46 and 48, respectively, and corresponding electrical outputs are transmitted to the processor 56. Meanwhile, the sliding movement of the frame 14 in the direction Di results in a further displacement of the photomask the same step Hi, and a pair of lines Lr 3 and Lt 3 is imaged. As clearly seen in Fig. 5c, the lines Lt t and Lr 3 coincide, which means that the corresponding strip of the surface 12a has now been sequentially illuminated by the beams 30a and 18a. Figs. 5d and 5e illustrate, in a self-explanatory manner, the sequential increase of the number of such imaged lines corresponding to those strips illuminated by both beams of the incident radiation. Hence, a slice, generaUy at B of the surface 12a is strip-by-strip inspected by step-by-step displacing the photomask 12 in the 'direction Di along the axis y. It is understood that the beginning of the inspection is stipulated such that the lines L r '-L r " and L t '-L t " corresponding to those strips iUuminated by either of the beams 18a or 30a, respectively, are associated with a so-called 'margin', non-patterned region of the surface 12a. In order to inspect an adjacent sUce Bn-i of the surface 12a, the sliding frame 14 is moved a preset step H2 in a direction D2 along the axis x, which step H2 is defined as follows: Hr=b (3) Thereafter, the photomask 12 is step-by-step displaced the same distance Hi in a direction D3 along the axis y. As shown, in the pair of simultaneously imaged lines L r and L t of the slice B -i the 'reflected' and 'transmitted' images are located in a reverse relationship relative to the direction of the displacement of the photomask, in comparison to that of the pair of simultaneously imaged lines Lri and Lti of the sUce Bt. To this end, the image processor 56 is provided with a suitable software for controlling its operation so as to consider the respective changes in the direction of movement of the photomask 12. Additionally, although not specifically shown, optical sensors may be appropriately accommodated at either side of the frame 14. It is important to note that if a pair of time delay integrated (TDI) sensors is employed as the imaging sensors 46 and 48, they should be of the so-caUed TDi-directional' kind. The construction and operation of such a *bi-directional' TDI sensor are weU known er se and do not form a part of the present invention. Turning now to Figs. 6a and 6b, there are more specificaUy illustrated the imaged lines Lti and Lrj, which correspond to the same illuminated strip on the surface 12a, which strip is sequentially illuminated by the beams 30a and 18a. It is assumed that the portion of the upper surface within the illuminated strip includes both transparent and opaque regions, generally designated 60 and 62, and that foreign particles 64 and 66 are located, respectively, in the transparent and opaque regions 60 and 62. As clearly shown, the transparent and opaque regions 62 and 64 are in the form of bright and dark areas, respectively, in the 'transmitted' image Lti (Fig. 6a), while being in the form of dark and bright areas, respectively, in the 'reflected' image Z-rj (Fig. 6b). As for the foreign particles, it is known that a surface of such particle is not mirror like, and, accordingly, Ught returned from the particle is irregularly reflected, scattered Ught. Therefore, both the transmitted and reflected beams 40 and 42 are indicative of the existence of the particle 64 located within the transparent region. The particle 64 appears as Ught faU-off, i.e. dark spot on the bright background 60, in the 'transmitted' image Lti and as a brighter spot on the dark background 60 in the 'reflected' image 2 3. The existence of the particle 66 located on the opaque region 62 may be detected solely by the reflected beam 40, appearing as a dhnmer spot on the bright background in the 'reflected' image irj. It is also appreciated that, should the plane of location of the particle 64 be identified, namely the upper or the lower surface of the photomask 12, this may be achieved by sUghtly shifting the upper surface 12a along the axis OA, so as to be out of the focal plane, and detecting the changes in the electrical output. AdditionaUy, it is understood, although not specifically shown, that both the 'reflected' and 'transmitted' images wfll be indicative of such 'defects' as through-holes in the opaque regions and missed chromium coating presenting a so-called 'width variation defect'. During the movement of the photomask 12 along the axes y and x as described above, the processor 56, to which the electrical signals generated by the sensors 46 and 48 are continuously fed, analyzes these electric signals and produces data indicative of the condition of the photomask 12. The processed data may be in the form of a list showing in respect of each 'defect' its type and coordinates, which Ust is displayed on the screen 58a. Reference is now made to Fig. 7 illustrating the main components of an apparatus, generally designated 100, which is constructed and operated according to another embodiment of the present invention. Those components which are identical in the apparatuses 10 and 100 are indicated by the same reference numbers, in order to facUitate understanding. The apparatus 100 inspects the photomask 12 supported on the sUding frame 14. Two iUumination assembUes 116 and 128 are provided for Uluminating the upper surface 12a of the photomask 12 from its opposite sides. The assemblies 116 and 128 are generally simflar to those of the apparatus 10, each comprising a Ught source for ermtting a beam of incident radiation and a suitable optical system accommodated in the optical path of the emitted beam. In distinction to the apparatus 10, the Ught sources 118 and 130 produce, respectively, Ught beams 118a and 130a of different wavelengths λi and λ2. The beam 118a is directed through the optical system 20 onto the surface 12a so as to iUuminate a strip S rt and be reflected from opaque regions, if any, producing a reflected beam 140. The Ught beam 130a, in turn, passes through the optical system 32 so as to impinge onto the surface 12a and iUuminate the same strip S rt , producing a transmitted beam 142. The reflected and transmitted beams 140 and 142 are projected via an optical system 144 onto the image sensors 46 and 48, respectively. To this end, the system 144, in addition to the collecting lens 44, comprises a dichroic beam spUtter 145. The dichroic beam splitter is a well known color-selective device which is widely used for transmitting a particular band of spectral energy and reflecting any other. It wiU be readily understood, although not specifically shown, that the operation of the apparatus 100 is generally similar to that of the apparatus 10. Each illuminated strip Srt is projected by the optical system 144 into two imaged lines (not shown). The photomask 12 is sequentially displaced along the axis y a certain preset step. It is appreciated that this step is, preferably, equal to the width of the imaged line so as to, on the one hand, 'avoid an overlap between the images and, on the other hand, speed up the inspection. Upon inspecting a sUce of the photomask, the latter is displaced along the axis x a certain step which is, preferably, equal to the length of the imaged line. Referring to Fig. 8, there is illustrated an apparatus 200 constructed and operated according to yet another embodiment of the invention. SimUarly, those components which are identical in the above described embodiments and the apparatus 200 are indicated by the same reference numbers. The apparatus 200 is capable of iUuinmating a strip S of the upper surface 12a of the photomask 12 by two beams of incident radiation 218a and 230a having different polarizations. To this end, the optical systems 220 and 232 comprise beam polarizer devices 234 and 236 accommodated in the optical paths of the beams 218a and 230a, respectively. Alternatively, each of the Ught sources 218 and 230 may be of a kind adapted for producing a polarized Ught beam. Hence, reflected and transmitted beams 240 and 242 are of different polarizations. The dichroic beam spUtter 145 of Fig. 7 is replaced by a beam polarizer device 245 of a kind capable of splitting the different polarizations. Such beam polarizer devices are known, typically comprising a polarization sensitive medium, for example, in the form of a bkefringent cell or multi-layered dielectric structure. It is appreciated that light component returned from a foreign particle located in the opaque region of the upper surface of the photomask, would be, due to reflection and diffraction effects, a depolarized scattered forward light. This increases the contrast of particle's appearance on the bright background in the 'reflected' image. Those skilled in the art will readily appreciate that various modifications and changes may be applied to the preferred embodiments of the invention as hereinbefore exemplified without departing from its scope as defined in and by the appended claims. In the method claims which foUow, • characters which are used to designate claim steps are provided for convenience only and do not apply any particular order of performing the steps.

Claims: WHAT IS CLAIMED IS: 1. A method for optically inspecting an object having upper and lower faces for detecting defects existing on the object, the method comprising the steps of: a) providing first and second beams of an incident radiation; b) directing the first beam of the incident radiation onto the object and sensing a light component reflected from one face of the object; c) directing the second beam of the incident radiation onto the object .and sensing a light component transmitted through the upper and lower faces of the object; d) simultaneously acquiring first and second images of the object, wherein the first image is formed by the reflected Ught component and the second image is formed by the transmitted Ught component; and e) analyzing said first and second images so as to provide data indicative of said defects. 2. The method according to Claim 1, wherein the step of acquiring the first and second images comprises directing the reflected and transmitted Ught components onto first and second image sensors, respectively. 3. The method according to Claim 2, wherein the first and second beams of the incident radiation are directed onto the object from the opposite faces thereof, and further comprising the step of; directing the reflected and transmitted Ught components via an optical system mounted in optical paths of the reflected and transmitted Ught components onto the first and second image sensors accommodated at one side of the object. 4. The method according to Claim 1, wherein the steps of directing the first and second beams of the incident radiation onto the object further comprise manipulating said first and second beams of the incident radiation to illuminate first and second parallel spaced-apart corresponding portions of the object. 5. The method according to Claim 4, wherein each of said first and second portions of the object are in the form of a strip. 6. The method according to Claim 4, wherein the first and second beams of the incident radiation are directed onto the object from the opposite faces thereof; the reflected and transmitted Ught components are directed onto, respectively, first and second image sensors, accommodated at one side of the object, via an optical system mounted in optical paths of the reflected and transmitted Ught components; and the first and second portions extend symmetrically relative to an optical axis of said optical system. 7. The method according to Claim 1, wherein the first and second beams of the incident radiation are directed onto the object from the opposite faces thereof; and the first and second beams of the incident radiation are formed of light having different wavelengths. 8. The method according to Claim 1, wherein the first and second beams of the incident radiation are directed onto the object from the opposite faces thereof; the first and second beams of the incident radiation are formed of light having different polarizations. 9. The method according to Claim 4, wherein the first and second images of the first and second portions are in the form of two lines, each having a width "a" and a length u b", the width "a" being substantiaUy smaUer than the width of the respective portion, a space "d" between lines being such as to satisfy the foUowing condition: d=n'a wherein "n" is an integer such n≥l. 10. The method according to Claim 1, wherein the step of providing the first and second beams of the incident radiation comprises providing first and second light sources each generating a beam of light. 11. The method according to Claim 1, wherein the step of providing the first and second beams of the incident radiation comprises providing a light source generating a beam of light and directing the generated beam of Ught ' towards the object via a beam splitter, which spUts the generated beam of light into .the first and second beams of the incident radiation. 12. The method according to Claim 1, further comprising the step of: supporting the object for sliding movement along two orthgonaUy oriented axes within an inspection plane so as to provide said first and second images of each point of the object 13. The method according to Claim 1, wherein the analyzing of the first and second images comprises comparing the images to each other. 14. An apparatus for an optical inspection of an object having upper and lower faces, so as to detect defects existing on the object, the apparatus comprising: i. an iUumination system providing first and second beams of an incident radiation simultaneously directed onto the object; ii. a sensing system mounted in the vicinity of the object and simultaneously sensing a Ught component of the first incident beam reflected from the upper face of the object and a light component of the second incident beam transmitted through the upper and lower faces of the object and providing output signals representative thereof; iii. a Ught directing system directing the reflected and transmitted light components onto the sensing system; and iv. a processor coupled to the sensing system for receiving the output signals representative of the reflected and transmitted light components and for analyzing the signals so as to provide data indicative of said defects. 15. The apparatus according to Claim 14, wherein the illumination system comprises two light sources for generating, respectively, said first and second beams of the incident radiation. 16. The apparatus according to Claim 14, wherein the illumination system comprises a light source for generating a beam of light and a beam splitter for 'splitting the generated beam into said first and second beams of the incident radiation.. 17. The apparatus according to Claim 14, wherein the iUumination system comprises a directing optics for ciirecting the first and second beams of the incident radiation onto, respectively, the opposite faces of the object. 18. The apparatus according to Claim 14, wherein the iUumination system comprises a directing optics for (iirecting the first and second beams of the incident radiation onto, respectively, first and second paraUel, spaced-apart portions of the object. 19. The apparatus according to Claim 14, wherein said first and second beams of the incident radiation are formed of Ught of different wavelengths. 20. The apparatus according to Claim 14, wherein said first and second beams of the incident radiation are formed of light of different polarizations. 21. The apparatus according to Claim 14, wherein the sensing system comprises first and second image sensors for detecting, respectively, the reflected and transmitted Ught components. 22. The apparatus according to Claim 17, wherein the light directing optics and the sensing system are accommodated at one side of the object. 23. The apparatus according to Claim 14, and also comprising a support base for supporting the object for sUding movement along two orthogonally oriented axes within an inspection plane.

Inventors: ELYASAF EMANUEL, TIROSH EHUD, ELYASAF, EMANUEL, TIROSH, EHUD
Applicants: APPLIED MATERIALS INC, APPLIED MATERIALS, INC.
Application year: 1999
Main classification: G01N21
IPC codes: G01N21