SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Abstract: An encapsulated semiconductor device wherein a semiconductor chip is mounted on a semiconductor chip mounting substrate with an adhesive having a curing start temperature of exothermic reaction of 130 DEG C or less measured by means of a differential scanning calorimeter on the assumption that the temperature rise rate is 10 DEG C/min. A method for manufacturing the same is also disclosed.

Description: EMI1.1 EMI2.1 EMI3.1 EMI4.1 EMI5.1 EMI6.1 EMI7.1 EMI8.1 EMI9.1 EMI10.1 EMI11.1 EMI12.1 EMI13.1 EMI14.1 EMI15.1 EMI16.1 EMI17.1 EMI18.1 EMI19.1 EMI20.1

Claims: EMI21.1 EMI22.1

Inventors: KANEDA AIZOU, KOUSAKA TAKASHI, SUZUKI NAOYA, TANAKA TOSHIAKI, YASUDA MASAAKI, KANEDA, AIZOU, KOUSAKA, TAKASHI, SUZUKI, NAOYA, TANAKA, TOSHIAKI, YASUDA, MASAAKI
Applicants: HITACHI CHEMICAL CO LTD, KANEDA AIZOU, KOUSAKA TAKASHI, SUZUKI NAOYA, TANAKA TOSHIAKI, YASUDA MASAAKI, HITACHI CHEMICAL COMPANY, LTD., KANEDA, AIZOU, KOUSAKA, TAKASHI, SUZUKI, NAOYA, TANAKA, TOSHIAKI, YASUDA, MASAAKI
Application year: 1999
Main classification: H01L21
IPC codes: H01L21, H01L23