PICK AND PLACE MACHINE WITH VARIED NOZZLE LENGTHS

Abstract: A beam configured pick and place machine has nozzles of differing lengths for carrying large components simultaneously at different heights without any risk collision between the components.

Description: Pick and place machine with varied nozzle lengths. The invention relates to the field of pick and place machines such as are used to place components on a pπnted circuit board ("PCB") m a manufactuπng context. The invention relates more particularly to increasing the number of components that can be picked and placed in one placement cycle. Currently there are several types of component placement machines. Some have a single placement head and some have several placement heads. The placement heads may be disposed in a turret configuration or in a line, also called a "beam" The turret configuration typically includes multiple heads arranged around a circle The Philips Topaz is an existing component placement machine that has eight placement heads arranged in a beam The placement heads are 16 mm apart Each placement head includes a nozzle for holding a component in place by suction The standard Topaz can bπng eight small parts from the pick to the place area in one pick & place cycle, by allowing a "pay load" of eight parts per beam For the purposes of this application, a "large" part is one which has at least one hoπzontal dimension greater than 12 mm When large parts have to be turned in order to be placed, or when large parts exceed 12mm in all hoπzontal dimensions, a problem aπses Namely two sucn parts cannot be placed on adjacent nozzles without a collision occurring between the parts Parts which are larger than 12mm include DRAM chips commonly used for SIMM (Single In-line Memory Modules) boards Such chips are commonly 18-22 mm in their larger horizontal dimension Fig 1 shows a typical arrangement of DRAM chips as they come from their manufacturer The chips 102 come arranged like chocolates in a tray 103 Their first pin 101 has a known oπentation in the tray, with all chips arranged in the same orientation The SLMM board 201, on which the DRAM chips are to be placed, is commonly oblong, as shown in Fig 2 Depending on the layout envisioned by the board designer, the chips 102 may have any oπentation when placed. For instance, a chip might be rotated by 90 degrees as shown at 202 or by 270 degrees as shown at 203. The pins 101 are shown with their different positions depending on the placement of their respective chips on the board. When such larger parts are to be placed, the PCB manufacturer currently only uses alternate heads on a beam configuration machine to allow for the rotation required by a layout such as shown on Fig. 2. Fig. 3 shows a pπor art beam configured pick and place machine 301 with 8 nozzles 302, like the Philips Topaz. When carrying the larger chips 102, half of the nozzles are empty. When only alternate heads are used, an eight head beam machine becomes no more effective than a four-headed machine. The enhanced component placement speed normally expected from having eight heads instead of four heads is lost. However, spacing the eight heads farther from each other is not a viable option, because then component placement efficiencies would be lost for smaller components and a much larger and costlier frame design would be needed to allow all heads to reach all component pick-up locations The object of the invention is to create a beam configuration pick and place machine which is suitable for placing both large and small electronic components and also can carry larger components on all of its placement heads simultaneously. This object is achieved by using nozzles of diffeπng lengths in the beam configuration pick and place machine The invention will now be descnbed by way of non-limitative example with reference to the following drawings Fig. 1 shows how "large" components come from their manufacturer Fig. 2 shows a possible layout for the large components on a PCB. Fig. 3 shows a pπor art pick and place machine carrying large components Fig 4 shows a portion of the pick and place machine in accordance with the invention Fig 5 shows a full view of the pick and place machine of Fig. 4 Fig. 6a shows an abstract view of the motion of the beam of a beam configuration pick and place machine. Fig. 6b is a flowchart. Fig. 6c shows a numbering scheme for the heads in accordance with the invention. Fig. 4 shows a pick and place machine 401 in accordance with the invention. This machine has nozzles of differing lengths. Nozzles 402 are longer than nozzles 403. As a result the chips 102 are carried at different heights. Consequently, each chip experiences at least a 32mm clearance between nozzles, rather than a 16 mm clearance as shown in the prior art. Nevertheless, the nozzles are actually 16 mm apart at their bases and can therefore be used effectively for small component placement. Herein the pick and place machine has been described as carrying components using a nozzle. However the invention is equally applicable to pick and place machines using other mechanisms such as grippers to pick up components. The invention is shown with the nozzles oriented vertically, but the principle of the invention would be equally applicable to other machines, for instance machines with horizontal nozzles. Fig. 5 shows a more complete view of the pick and place machine including a processor 501 for controlling movement of the heads 502. The direction Y shows the direction of the beam, while the direction X, into the paper, shows the direction of motion of the beam. Fig 6a shows an abstracted view of the pick and place machine. The beam is parallel to the Y axis and moves parallel to the axis X. A largest component to be placed has a current dimension L in the direction Y. A distance Yi is taken to be a bit less than the distance between adjacent nozzles in the beam. For instance, with the Topaz, the nozzles are 16 mm apart, but Y) is preferably 12 mm. The nozzles of the invention have the advantage of being able to use of much existing software on the pick and place machines. The higher carried parts have to be picked up first and the lower carried parts have to be placed first. Existing software on such pick and place machines is able to sequence pick up and placement. The sequencing does not result in substantial time loss, because commonly the machine needs to move between pickups and placements. Fig. 6b is a flowchart showing a slight modification of the control software needed to handle sequencing with the nozzles of the invention. In this flowchart, at box 601 it is tested whether any current dimension L is less than Y \ , if so, the picking sequence is not critical and control passes to box 602. If L is greater than Yi, then control passes to box 603 where the machine is instructed to pick up with the short nozzles first and then with the long ones. At 604 it is tested whether the largest component length in the Y direction is less than Y] for mounting. Of course, some components may have been rotated, so the current largest dimension L in the Y direction may not be the same as it was for pickup. Moreover, the current largest dimension L in the Y direction may not be on the same component as it was for pickup. If the current largest dimension L is less than Yi for mounting, then the mount sequence is not critical, and control passes to 605. On the other hand, if L is not less than Yi for mounting, then at 606 the components on the long nozzles are mounted prior to the components on the short nozzles. Control passes to 607 after both 605 and 606. Fig. 6c shows a numbering scheme for the nozzles, with the short nozzles being numbered 2, 4, 6, & 8 and the long nozzles being numbered 1, 3, 5, & 7. In addition the software needs to be accommodated to give a greater travel distance for the short nozzles than for the long nozzles and this is done in the vision file.

Claims: CLAIMS: 1. A method of carrying components to be placed on a PCB, the method comprising executing the following on a multihead pick and place machine: a. picking up first and second components using first (403) and second (402) heads, respectively; b. carrying the first and second components, so that a bottom surface of the first component is above a top surface of the second component. 2. The method of claim 1 wherein each head comprises a respective nozzle. 3. The method of claim 2 wherein the respective nozzle for carrying the first component is shorter than the respective nozzle for carrying the second component. 4. The method of claim 1 wherein the heads are arranged in a beam. 5. The method of claim 1 wherein the first and second components each have at least one horizontal dimension greater than 12mm. 6. The method of claim 5 wherein first and second heads are 16 mm apart at their bases. 7. The method of claim 1 wherein the picking up of said first component is sequenced before the picking up of the second component. 8. The method of claim 1 wherein the method is part of a pick and place operation and further comprises placing the first and second components on the PCB. 9. The method of claim 8 wherein the placing of the second component is sequenced before the placing of the first component. 10. Apparatus for picking up components for placement on a printed circuit board comprising a. a plurality of heads arranged in a beam (502); and b. a processor for controlling the heads so that the heads execute the following operations: i. picking up first and second components using first (403) and second (402) heads, respectively; ii. carrying the first and second components, so that a bottom surface of the first component is above a top surface of the second component. 11. The apparatus of claim 10 wherein each head comprises a respective nozzle and the respective nozzle of the first head is shorter than the respective nozzle of the second head. 12. The apparatus of claim 10 wherein the processor is further for controlling the heads so that the first head picks up the first component before the second head picks up the second component. 13. The apparatus of claim 10 wherein the processor is further for controlling the heads so that the second head places the second component on the PCB prior to the first head placing the first component on the PCB.

Inventors: BORN RUDOLF A J, VAN DE VALL LEOPOLD B A, BORN, RUDOLF, A., J., VAN DE VALL, LEOPOLD, B., A.
Applicants: KONINKL PHILIPS ELECTRONICS NV, KONINKLIJKE PHILIPS ELECTRONICS N.V.
Application year: 1999
Main classification: H05K13
IPC codes: H05K13