Synchronous burst semiconductor memory device

Abstract: A synchronous burst semiconductor memory device (300) with a pipelined multi-bit prefetch architecture includes separate intemal address generators (310,314) for respective read and write burst modes. The synchronous memory device (300) also adopts an auto-tracking bit line scheme to reduce core cycle time, a shortened main data line for current reduction, a noise immune circuit having high-speed transfer characteristics through a dual-rail reset dynamic circuit, and strobe clocks synchronized with the output data to guarantee processor data-validation time.

Description: Field of the Invention The present invention relates to a semiconductor memory device and, more particularly, to a synchronous burst memory device with a pipelined multi-bit prefetch architecture. Background of the Invention Fig. 1 is a block diagram illustrating a conventional synchronous burst pipelined SRAM (Static Random Access Memory) device operating in synchronism with an externally applied clock signal. The SRAM device 100 integrates an SRAM core with synchronous peripheral circuitry. The SRAM device 100 has a mode ofwrite operation in which the write data are written into memory cells at least one clock cycle later after the addresses and control inputs have been presented. The prior art memory device 100 can access data in response to both rising and falling edges of an external clock signal CK (or CK#), as well as accessing the rising (or falling) edge of the clock signal. In other words, the device 100 can operate in either of the single data rate (SDR) and double data rate (DDR) modes of operation. The SDR mode of operation allows a user to read or write a single word on every rising edge ofthe clock signal CK, and the DDR mode allows a read or write operation in synchronism with every clock edge of the clock signal CK. The SRAM device 100 includes a clock buffer 102, an address register 104, a burst address sequence counter 106, a write address register 108, 2x1 multiplexers 110, 124a, 124b, 124c, 136 and 138, an address decoder 112, an SDR/DDR output control logic 114, an address comparator 116, logic gates 118 and 150, data input registers 120 and 122, a write register 126, a write driver 128, a memory cell array 130, a sense amplifier circuit 132, an output register 134, an output buffer 140, a data rate register 142, a read/write enable register 144, an output enable register 148, and echo clock buffers 152 and 154. To the SRAM device 100, a data rate signal SD/DD# indicating the SDR or DDR mode and a burst type signal LOB# indicating a linear or interleaved burst type are externally applied. In SDR mode, write data are registered on the rising of the clock signal CK. In DDR mode, write data are registered on both the rising and falling edges of the clock signal CK. Read data are driven on the rising edge of the clock signal CK in SDR mode and on the rising and falling edges of the clock signal CK in DDR mode. Address signals SA0' and SA1' are advanced in the order indicated by the signal LBO#. Fig. 2 is a timing diagram of the prior art SRAM device 100 shown in Fig. 1. For the purposes of explanation, assuming that the prior art SRAM device 100 supports burst lengths of 1, 2 and 4, and that the memory device has a two stage delay feature. As can be seen in Fig. 2, when a command DW4 representing a DDR burst write operation with burst length of 4 (hereinafter abbreviated as "DW4 operation") is externally issued in cycle C1 of the external clock signal CK, an external address A0_b as an initial burst address is presented on the rising edge of the external clock signal CK. Since the SRAM device is the late write type, in next cycle C2 of the clock signal CK (i.e., a burst write continue cycle without any external address input), a pair of write data W0b and W0a are sequentially inputted on the rising edge and the falling edge of the clock signal CK, respectively. During cycle C3 of the clock signal CK, in which a command DW2 representing a DDR burst write operation with burst length of 2 (hereinafter abbreviated as "DW2 operation") is issued, two subsequent write data W0d and W0c corresponding to the command DW4 are also inputted in synchronism with the rising and falling edges of the clock signal CK, respectively. The input sequence of the write data W0d, W0c, W0a and W0b, is determined by the external address A0_b and the selected burst mode (i.e., either interleaved or linear burst mode). Due to the 2 stage delay write feature of the SRAM device, an internal address WA0_ba for the write data W0b and W0a is generated in cycle C3, and so the data W0b and W0a are written into memory cells selected by decoding the address W0_ba. The reference symbol WA0_ba of the burst write address for the write data W0b and W0a represents that both of the data W0b and W0a having been serially inputted are written into the selected memory cells in parallel. In cycle C4, a pair of write data W1a and W1b are inputted at the rising and falling edges of the clock signal CK in response to the command DW2 issued in cycle C3. However, when a command DR4 representing a DDR burst read operation of burst length 4 (hereinafter abbreviated as "DR4 operation") is given in cycle C4, a burst address RA2_cd for the DR4 operation is internally generated by using an external address A2_c for the DR4 operation, instead of using the address A1_a for the DW2 operation as an initial burst address. In cycle C4, the write data W0d, W0c, W1a and W1b may be registered and they may not be written into memory cells until the DR4 operation has been completed. Like cycle C2 with the burst write continue command, there is also no external address input in cycle C5 with a burst read continue command. In this cycle C5, subsequent internal burst address RA2_ab is generated depending upon the external address A2_c and the first read data R2c corresponding to the burst address RA2_cd for the DR4 operation is driven to data bus. The reference symbol RA2_cd (or RA2_ab) of the burst address for the read data R2c and R2d (or R2a and R2b) represents that both of the data R2c and R2d (or R2a and R2b) are read out of the selected memory cells in parallel. In cycle C6, a command SR1 representing an SDR burst read operation of burst length 1 (hereinafter abbreviated as "SR1 operation") is given together with an external address A3_d. In this single read cycle C6, the external address A3_d itself becomes the internal address RA3_d, without generating additional internal address, and the read data R2d and R2a corresponding to the DR4 operation appear on the data bus. As can be seen in Fig. 2, the prior art SRAM device 100 requires a single "no operation (NOP)" cycle without external address input when transitioning from a read cycle to a write cycle even though the NOP cycle is not required when switching from a write cycle to a read cycle. Thus, in cycle C7 of the clock signal CK, an NOP cycle is added for a next write operation which will be executed in subsequent cycle C8. In the NOP cycle C7, the final read data R2b corresponding to the DR4 operation is driven to the data bus without generating internal address and the DR4 operation is completed. Like the above-described burst write operations, the read data output sequence of the data R2c, R2d, R2a and R2b is also determined by both the external address A2_c and the selected burst mode. In cycle C8 of the clock signal CK, in which a command DW1 representing a DDR burst write operation with burst length of 1 is given together with an external address A4_a, the write data W0d and W0c registered in cycle C4 are written into the memory cells selected by decoding internal address WA0_dc. As described above, the registered data W0d and W0c for the DW4 operation are written into memory cells in the write cycle C8 since the DR4 and SR1 operations have been completed. However, to write the registered data W0d and W0c into the memory cells designated by the internal address WA0_dc in the first write cycle C8 after the SR1 operation, the memory device has difficulty in setting the burst address sequence counter fast with the internal address WA0_dc because only a single burst address sequence counter 106 (shown in Fig. 1) is used for both read and write operations, resulting in address decoding speed loss. EP 0421627 whereon the preamble of claim 1 is based, discloses a dual-port memory device that is capable of operating in a burst mode or a random access mode. The dual-port memory device is able to read or write on one port in a burst mode or a random access mode, while simultaneously reading or writing on the other port in either a burst mode or a random access mode. US 5,587,954 discloses a synchronous random access memory arranged to be responsive to a system clock signal, and can operate in either a synchronous burst mode or a synchronous wrap mode in addition to a synchronous random access mode. US 5,784,705 discloses a device for implementing pipeline burst read and write operations in which the memory cycle time is substantially longer than its I/0 time, A double-buffering technique is used to provide gap-less output data for consecutive pipeline burst read operations. Summary of the Invention Accordingly, it is a general object of the present invention to provide a synchronous burst semiconductor memory device having an improved performance. It is another object of the present invention to provide a synchronous burst semiconductor memory device which can overcome address decoding timing loss due to use of a single burst address generator. According to a first aspect of the invention, there is provided a semiconductor memory device as set out in claim 1. Preferred features of this aspect are found in Claims 2 to 15. The semiconductor memory device can be an SRAM, a DRAM, a flash EEPROM, a ferroelectric RAM, or the like, and can operate in synchronism with an external clock (or, system clock) signal. A major advantage of synchronous memories is that the system clock edge is the only timing strobe that must be provided by the system to the memory. This reduces the need to propagate multiple timing strobes around the printed circuit board or module. The memory device can operate in burst read and write modes. These burst mode accesses take advantage of the fact that the internal bus of the memory device is wider than the external bus. This permits all of the data from a series of burst mode addresses to be fetched from the memory device to its outputs upon the entry of the initial address. Since the synchronous semiconductor memory is equipped with separate internal read- and write-dedicated address generators, although a burst write operation is interrupted by a read operation, the internal address generator resetting for the interrupted write operation is not required. Therefore, the memory device can have a shorter internal address decoding time, and as a result the device performance can be improved. Brief Description of the Drawings A more complete appreciation of the present invention, and many of the attendant advantages and features thereof, will become readily apparent as the same becomes better understood by reference to the following detailed description when considered in conjunction with the accompanying drawings in which like reference symbols indicate the same or similar components, wherein: Fig. 1 is a block diagram illustrating a synchronous semiconductor memory device according to the prior art; Fig. 2 is a timing diagram of the prior art memory device of Fig. 1; Fig. 3 is a block diagram illustrating a preferred embodiment of a synchronous semiconductor memory device according to the present invention; Fig. 4 is a detailed circuit diagram of the circuitry on read and write address paths ofthe memory device of Fig. 3; and Fig. 5 is a timing diagram of the memory device of Fig. 3. Detailed Description of The Preferred Embodiment Throughout the following description, specific details are set forth in order to provide a more thorough understanding ofthe present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without these specific details. It is a key feature that a semiconductor memory device according to the invention uses separate internal address generators for burst read and write operations. These separate burst read and write address generators shorten internal address decoding time so as to improve the device performance. Herein, an embodiment ofthe invention will be discussed with reference to an SRAM environment, for the sake of simplicity. It is noted, however, that any other semiconductor memory device, such as a DRAM, a flash EEPROM, and a ferroelectric RAM, can be used to implement the inventive concept ofthe presently disclosed embodiment. In addition, the semiconductor memory device of the invention can be implemented with an auto-tracking bit line scheme to reduce core cycle time, a shortened main data line for current reduction, a noise immune circuit having high-speed transfer characteristics through a dual-rail reset dynamic circuit, a two-bit prefetched operation, and strobe clocks synchronized with the output data to guarantee processor (or CPU) data-validation time. Accordingly, the specification and drawings are to be regarded in an illustrative, rather than a restrictive sense. A preferred embodiment ofthe invention will now be described by way of example and with reference to the accompanying drawings. Fig. 3 is a block diagram illustrating a preferred embodiment of a synchronous pipelined burst SRAM device according to the present invention, and Fig. 4 is a detailed circuit diagram illustrating the circuits on read and write address paths ofthe memory device of Fig. 3. In these figures, well-known circuits are shown in block diagram form in order not to obscure the present invention, and only for simplicity it is also assumed that the SRAM device of the invention supports a maximum burst length of 4 and has a two stage delay feature (i.e., write latency of 2 cycles). Referring first to Fig. 3, the synchronous pipelined burst SRAM device 300 operates in synchronism with externally applied differential clock signals K and K . A clock buffer 302 generates an internal clock signal CLK in synchronism with the external clock signals K and K . The SRAM device 300 includes a memory cell array 326 consisting of 4 mats, although not shown. Each mat consists of 3 blocks and has 9 I/Os. Each block with 3 I/Os is divided into 8 sub-blocks each having a capacity of 64 Kb. The memory device 300 is applied with a 17-bit external address A0-A16. The address signals A0-A16 are fed to first and second address registers 308 and 312 through an address buffer 306. The registers 308 and 312 temporally hold the address signals A0-A16, respectively. Further, first and second data-in registers 320a and 320b each having a 36-bit wide bus are incorporated to enhance pipelined write cycles and reduce read-to-write turnaround time. The SRAM device 300 has a "late write" mode of operation in which write data are written into its memory cells one or more clock cycles later after the addresses and control inputs have been presented. This mode enables to minimize the number of the idle cycles which normally occur when a read operation is followed by a write operation. Further, the memory device 300 operates in burst read and write modes. Also, the memory device 300 has both normal SDR (Single Data Rate) and DDR (Double Data Rate) modes of operation. That is, the memory device 300 is capable of accessing data in response to both rising and falling edges of the external clock signal K (or K ) (DDR mode), as well as accessing either rising or falling edge of the clock signal K (or K ) (SDR mode). Additionally, ifa read command is issued while the SRAM device 300 is performing a write operation, the memory device 300 temporally stores addresses and data for the write operation in its registers because the memory device 300 can not write the last data word into its memory cells without conflicting with the read operation. The remaining write data stays in the registers until a next write cycle occurs. On the first write cycle after the read cycle(s), the registered data from the earlier write cycle are written into the memory cells. This is called a "posted write" function. In the SRAM device 300, all synchronous inputs pass through the registers controlled by the clock signal K (or CLK). The synchronous inputs are latched on the rising edge ofthe clock signal. The synchronous inputs include all addresses A0-A16, all data inputs DQ0-DQ35, a synchronous load signal B1, a read/write (R/W) enable signal B2, and a data rate signal B3 for selecting one of the SDR and DDR operation modes. As can be seen in Fig. 3, a control logic 304 receives the synchronous load signal B1, the R/W select signal B2, and the data rate signal B3 in synchronism with the internal clock signal CLK. The synchronous load signal B1 goes low when a bus cycle sequence is to be defined. This definition includes address, data transfer direction and data length. The R/W select signal B2 designates access type (read or write). The read operation is available when the signal B2 is high but the write operation is available when the signal B2 is low. Also, the signal B2 designates whether a burst cycle is performed when the signal B1 is high. The SRAM device 300 further includes several asynchronous control inputs, such as an output enable signal (not shown), and a burst type signal LBO . The signal LBO allows a choice of either an interleaved burst or a linear burst. In SDR write operation, data are registered on the rising edge of the clock signal K; in DDR write operation, data are registered on both the rising and falling edges of the clock signal K. Read data are driven on the rising edge of the clock signal K in SDR mode and on the rising and falling edges ofthe clock signal K in DDR mode. The internal addresses are advanced when the signal B2 is high, but no operation ( NOP) is performed when the signal B2 is low. The data rate signal B3 is sampled by the control logic 304 on the rising edge of the clock signal CLK (or K) while the synchronous load signal B1 is low. At this time, the SRAM device 300 can perform a SDR read or write operation. If the signal B3 is sampled low, a DDR read or write operation can be performed at every clock edge of the clock signal CLK (or K). The control logic 304 and generates a plurality of internal control signals, such as register enable signals E1 through E4, a write rate signal WD indicating the data rate of a write operation (DDR write or SDR write), a read rate signal RD for indicating the data rate of a read operation (DDR read or SDR read), a write enable signal WEN , and a burst continue signal BCN for enabling subsequent burst addresses to be generated internally. Meanwhile, among outputs RA0-RA16 of the first address register 308, two LSB (Least Significant Bit) address signals RA1 and RA0 are loaded into a first internal address generator 310 used as a burst read address generator. Other output signals RA2-RA 16 ofthe address register 308 are directly provided to an address selector 316, such as a 2x1 multiplexer. Similarly, two bit output signals WA1 and WA0 of the second address register 312 are loaded into a second internal address generator 314 used as a burst write address generator. Other output signals WA2-WA 16 ofthe register 312 are provided to the address selector 316. Both of the internal address generators 310 and 314 operate in synchronism with the internal clock signal CLK and supplied with the burst continue signal BCN, the write enable signal WEN and the burst type signal LBO . The first internal address generator 310 generates burst read address signals RA0' and RA1'. The second internal address generator 314 generates burst write address signals WA0' and WA1'. The address signals RA0', RA1', WA0' and WA1' are advanced in the order indicated by the signal LBO at each clock edge in DDR operation, but only at each rising edge in SDR operation. The burst read address signal RA1' is supplied to an input A of the address selector 316 together with the address signals RA2-RA16 from the first address register 308. The burst write address signal WA1' is applied to the other input B of the address selector 316 together with the address signals WA2-WA16 from the second address register 312. Referring to Fig. 4, the first address register 308 includes a switch circuit 402 connected to the address buffer 306 and a latch circuit 404 connected to the switch circuit 402. The switch circuit 402 is closed/opened in response to the control signal E1 from the control logic 304 (shown Fig. 3). The first internal address generator 310 includes a counter 406 connected to the latch circuit 404 and a 2x1 multiplexer 408. The counter 406 operates in synchronism with the internal clock signal CLK and also controlled by the burst type signal LBO from the control logic 304. The counter 406 generates burst read address signals RA0' and RA1' in synchronism with the internal clock signal CLK. The sequence of the address signals RA0' and RA1' is determined by the burst type signal LBO from the control logic 304. The multiplexer 408 has two inputs A and B of which one receives an output of the counter 406 and the other does an output of the latch circuit 404. The multiplexer 408 selectively outputs one of its two inputs in response to the burst continue signal BCN from the control logic 304. An output of the multiplexer 408 is provided to an input A of the address selector 316. The second address generator 312 includes two switch circuits 410 and 414, and two latch circuits 412 and 416. The switch circuit 410 is connected between the address buffer 306 and the latch circuit 412. The switch circuit 412 is connected between the latch circuits 412 and 416. The switch circuit 410 is controlled by the control signal E2 from the control logic 304. The switch circuit 402 is controlled by the inverted signal E2 ofthe control signal E2. The switch circuits 402, 410, and 414 can be implemented with either MOS transistors or CMOS transmission gate circuits. The number of latch circuits is determined by the write latency. The second internal address generator 314 includes a counter 418 connected to the latch circuit 416 and a 2x1 multiplexer 420. The counter 418 generates burst write address signals WA0' and WA1' in synchronism with the internal clock signal CLK. The sequence of the address signals WA0' and WA1' is determined by the burst type signal LBO from the control logic 304. The multiplexer 420 has two inputs A and B of which one receives an output of the counter 418 and the other does an output of the latch circuit 416. The multiplexer 420 selects one of its two inputs in response to the burst continue signal BCN from the control logic 304. An output of the multiplexer 420 is provided to an input B of the address selector 316. The decoder 318 is supplied with an output ofthe address selector 315. Herein, it should be noted in other versions ofthe invention that the first and second internal address generators 310 and 314 can be implemented as the read and write address generators, respectively. As described above, the synchronous pipelined burst SRAM device 300 has separate internal read- and write-dedicated address generators 310 and 314, and so it is unnecessary for setting the internal address generator with the registered address during the posted write cycles after read cycle(s). Therefore, the internal address decoding time ofthe SRAM device 300 can be reduced, compared to the prior art memory device. Referring back to Fig. 3, the address selector 316 selects one of both the burst read address signals RA1'-RA16 and the burst write address signals WA1'-WA16 in response to the write enable signal WEN . The burst read address signals RA1'-RA16 are selected when the write enable signal WEN is high and the burst write address signals WA1'-WA16 are selected when the signal WEN is low. An output of the address selector 316 is provided to the decoder 318. The decoder 318 selects rows and columns of the memory cell array 326 by decoding the 16-bit address A1'-A16 from the address selector 316. The data-in registers 320a and 320b hold two successive 36-bit data being serially inputted, respectively. The outputs of the registers 320a and 320b are simultaneously provided to a write data sorter 322. The write data sorter 322 switches the transfer paths of the two 36-bit outputs of the data-in registers 320a and 320b depending on the address signal WA0' from the second internal address generator 314. For example, when the address signal WA0' is high, the outputs of the registers 320a and 320b are sorted into the higher order 36-bit data and the lower order 36-bit data, respectively, and vice versa. When the signal WA0' is low, the outputs of the registers 320a and 320b are switched inversely. The sorted write data of 72 bits are provided to a write driver 324. The write driver 324 writes the data of either 72 or 36 bits into the memory cell array 326 in response to the write rate signal WD from the control logic 304. When the signal WD is low (i.e., DDR write mode), the 72-bit data is written into the memory cell array 326. When the signal WD high (i.e., SDR write mode), the 36-bit data is written into the memory cell array 326. The sense amplifier circuit 328 senses and amplifies the 72- or 36-bit data from the memory cell array 326 in response to the read rate signal RD from the control logic 304. The sense amplifier circuit 328 senses a 72-bit data from the memory cells selected by the decoder 318 when the signal RD is low (i.e., DDR read mode), and the sense amplifier circuit 328 senses a 36-bit data when the signal RD high (i.e., SDR read mode). The output data of the sense amplifier circuit 328 is provided to a read data sorter 330. During the DDR mode, the read data sorter 330 divides the 72- bit output data into two 36-bit data and sorts them into a higher order data and a lower order data depending on the address signal RA0' from the first internal address generator 310, and vice versa. The sorted data are sequentially outputted through data-out buffer 332 to output pads 334. An address comparator 336 is enabled only when a write operation is pending and a read operation is requested. The comparator 336 compares the output address of the first address register 308 with the output address of the second address register 321. If the addresses are identical with each other, the comparator 336 generates a comparison signal EQA of active high level, and if not, it generates the comparison signal of inactive low level. When the signal EQA goes high, the data held in the data-in registers 320a and 320b are routed directly to the read data sorter 330, bypassing the memory cell array 326. Thus, a read operation can be made immediately to an address even if that address was written in the previous cycle. During this read cycle, the memory cell array 326 is bypassed by the comparator 336, and data is read instead from the data-in register 320a or 320b storing the recently written data. Echo clock buffer 338 generates differential echo clock signals KQ and KQ as output data strobe signals, in synchronism with the clock signal CLK (or K). The output data DQ0-DQ35 are closely matched to the echo clock signals KQ and KQ . The echo clock signals KQ and KQ are not disabled by any control signals and always matches the frequency of the clock signal CLK (or K). Fig. 5 is a timing diagram ofthe SRAM device 100 shown in Fig. 3. For the purposes of explanation, assuming that the DDR SRAM device 300 supports burst lengths of 1, 2 and 4, and that the memory device has two stage delay features. Referring to Fig. 5, in cycle C1 of the external clock K, if a command DW2 representing a DDR burst write operation (all the external control signals B 1, B2 and B3 are low) with burst length of 2 is issued while an external address A0_a is presented as an initial burst address, write data W0a and W0b corresponding to the DW2 command are sequentially inputted in cycle C2 of the clock signal K because the SRAM device 300 is the late write type. Next, if a command DW4 representing a DDR burst write operation with burst length of 4 is given while an external address A1_b is presented, write data corresponding to the DW4 command are sequentially inputted in cycles C3 and C4 of the clock signal K. During cycle C3 of the clock signal K, in which a continue command of the DW4 command is issued, an internal address WA0_ab for writing the data W0a and W0b into memory cells is generated according to the 2 stage delay write feature. The reference symbol WA0_ab of the burst write address for the write data W0a and W0b represents that both of the data W0a and W0b having been inputted serially are simultaneously written into the selected memory cells in parallel. In cycle C4, ifa command DR4 representing a DDR burst read operation (the external control signals B1 and B3 are low, B2 is high) of burst length 4 is issued while an external address A2_c is presented as an initial burst address, due to the posted write feature of the SRAM device 300, a burst address RA2_cd for the DR4 operation is internally generated by using the external address A2_c. In accordance with the posted write feature, the write data W1b, W1a, W1d and W1c are registered until the DR4 operation has been completed. In cycle C5 with a burst read continue command, a sequent internal burst address RA2_ab is generated and the first read data R2c corresponding to the burst address RA2_cd for the DR4 operation is driven to data bus on the falling edge of the clock signal K. In cycle C6, if a command SR1 representing an SDR burst read operation (the external control signal B1 is low, B2 and B3 are high) of burst length 1 is given along with an external address A3_d, the external address A3_d becomes the internal address RA3_d without generating additional internal address and the read data R2d and R2a corresponding to the DR4 operation appear on the data bus. The reference symbol RA2_cd (or RA2_ab) of the burst address for the read data R2c and R2d (or R2a and R2b) represents that both of the data R2c and R2d (or R2a and R2b) are read out ofthe selected memory cells in parallel. As can be seen in Fig. 5, the SRAM device 300 requires a single "NOP (no operation)" cycle (the external control signals B1 and B3 are high, B2 is low) without external address input when transitioning from a read cycle to a write cycle although the NOP cycle is not required when switching from a write cycle to a read cycle. Thus, in cycle C7 of the clock signal K, an NOP cycle is added for a next write operation which will be executed in subsequent cycle C8. During the NOP cycle C7, the final read data R2b corresponding to the DR4 operation is driven to the data bus without generating internal address, completing the DR4 operation. The read data output sequence ofthe data R2c, R2d, R2a and R2b is determined by the external address A2_c and the selected burst mode. In cycle C8 of the clock signal K, while a command DW1 representing a DDR burst write operation (the external control signals B1 and B2 are low, B3 is high) with burst length of 1 is given together with an external address A4_a, the write data W1b and W1a registered in cycle C4 are written into the memory cells selected by decoding internal address WA1_ab. According to the present invention, since separate internal burst read and write address generators are provide for a synchronous burst semiconductor memory device, the memory device can shorten internal address decoding time in the posted write mode, and as a result the device performance can be improved. The above description of the preferred embodiment of the present invention is intended to be utilized as an illustration of the concept of the present invention. The scope of the present invention is by no means limited by this embodiment. The scope ofthe present invention shall be defined in the following claims.

Claims: A semiconductor memory device (300) operating in synchronism with an external clock signal, comprising: a memory cell array (326) including a plurality of memory cells storing data bits; a first internal address generator (310) responsive to an external address, for generating a series of first internal addresses; a second internal address generator (314) responsive to the external address, for generating a series of second internal addresses; an address selector (316) for selecting outputs of one of the first and second internal address generators; a controller (304) for controlling operations of the first and second internal address generators (310, 314), and the address selector (316), in response to externally applied read and write command information; and an address decoder (318) for decoding an output of the address selector to select the memory cells; characterised in that the first internal address generator (310) is dedicated for read operation, and the second internal address generator (314) is dedicated for write operation. A memory device according to claim 1, wherein the memory device (300) accesses the data bits on both rising and falling edges of the external clock signal. A memory device according to claim 1, wherein the memory device (300) is a static random access memory (SRAM) device. A memory device according to claim 1, wherein the memory device (300) is a dynamic random access memory (DRAM) device. A memory device according to claim 1 arranged to operate in burst read and write modes, the memory device further comprising: a first address register (308) for temporally holding the external address; wherein the first internal address generator (310) is arranged to receive an output of the first address register to generate a series of first internal addresses for a burst read operation; a second address register (312) for temporally holding the external address; wherein the second internal address generator (314) arranged to receive an output of the second address register to generate a series of second internal addresses for a burst write operation; wherein the controller (304) is arranged to control an operation of the first and second address registers (308, 312), the first and second internal address generators (310, 314), and the address selector, in response to at least an external write enable signal. A memory device according to claim 5, further comprising: a first data-in register (320a) for temporally holding a first write data; a second data-in register (320b) for temporally holding a second write data; the first and second write data being inputted serially; a write data sorter (322) for sorting the first and second write data in response to the output of the second internal address generator (314); and a write driver (324) for writing the sorted data into the memory cells. A memory device according to claim 5, further comprising: a sense amplifier circuit (328) for sensing in parallel and amplifying a first read data and a second read data stored in the memory cells; and a read data sorter (330) for sorting the first and second read data in response to the output of the first internal address generator (310) and outputting the first and second read data serially. A memory device according to claim 5, wherein the memory device (300) is a static random access memory (SRAM) device. A memory device according to claim 5, wherein the memory device (300) is a dynamic random access memory (DRAM) device. A memory device according to claim 1, wherein each of said first and second internal address generators (310, 314) includes: a counter operating in synchronism with an internal clock signal; and a multiplexer for selecting one of an output of said first internal address generator and an output of said multiplexer. A memory device according to claim 10, wherein said counter (406, 418) operates in response to a write enable signal. A memory device according to claim 10, wherein said multiplexer operates in response to a burst continue signal for enabling subsequent bursts addresses to be generated internally. A memory device according to claim 5, wherein each of said first and second internal address generators (310, 314) includes: a counter operating in synchronism with an internal clock signal; and a multiplexer for selecting one of an output of said first internal address generator and an output of said multiplexer. A memory device according to claim 13, wherein said counter operates in response to a write enable signal. A memory device according to claim 13, wherein said multiplexer operates in response to a burst continue signal for enabling subsequent burst addresses to be generated internally.

Inventors: KIM SU-CHUL, PARK HEE-CHOUL, KIM, SU-CHUL, PARK, HEE-CHOUL
Applicants: SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO., LTD.
Application year: 1999
Main classification: G11C7
IPC codes: G11C7, G11C11