MULTILAYER CONDUCTIVE POLYMER DEVICE AND METHOD OF MANUFACTURING SAME

Abstract: A conductive polymer device has three or more conductive polymer layers sandwiched between two external electrodes and two or more internal electrodes. The electrodes are staggered to create a first set of electrodes, in contact with a first terminal, alternating with a second set of electrodes in contact with a second terminal. A device having three polymer layers is manufactured by: 1) providing (a) a first laminated substructure comprising a first polymer layer between first and second metal layers, (b) a second polymer layer, and (c) a second laminated substructure comprising a third polymer layer between third and fourth metal layers; 2) forming first and second internal arrays of isolated metal areas in the second and third metal layers, respectively; 3) laminating the first and second substructures to opposite surfaces of the second polymer layer to form a laminated structure; 4) forming first and second external arrays of isolated metal areas in the first and fourth metal layers, respectively; 5) forming a plurality of first terminals, each electrically connecting one of the metal areas in the first external array to one of the metal areas in the second internal array, and a plurality of second terminals, each electrically connecting one of the metal areas in the second external array to one of the metal areas in the first internal array; and 6) singulating the laminated structure into a plurality of devices, each having three polymer layers connected in parallel between a first terminal and a second terminal.

Description: 1 MULTILAYER CONDUCTIVE POLYMER DEVICE 2 AND METHOD OF MANUFACTURING SAME 3 4 CROSS-REFERENCE TO RELATED APPLICATIONS 5 Not Applicable 6 7 FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT 8 Not Applicable 9 I o BACKGROUND OF THE INVENTION II The present invention relates generally to the field of conductive 12 polymer positive temperature coefficient (PTC) devices. More specifically, it 13 relates to conductive polymer PTC devices that are of laminar construction, 14 with more than a single layer of conductive polymer PTC material, and that 15 are especially configured for surface-mount installations. 16 Electronic devices that include an element made from a conductive 17 polymer have become increasingly popular, being used in a variety of 18 applications. They have achieved widespread usage, for example, in 19 overcurrent protection and self-regulating heater applications, in which a 20 polymeric material having a positive temperature coefficient of resistance is 21 employed. Examples of positive temperature coefficient (PTC) polymeric 22 materials, and of devices incorporating such materials, are disclosed in the 23 following U.S. patents: 24 3,823,217 - Kampe 25 4,237,441 - van Konynenburg 26 4,238,812 - Middleman et al. 27 4,317,027 - Middleman et al. 28 4,329,726 - Middleman et al. 1 4,413,301 - Middleman et al. 2 4,426,633 - Taylor 3 4,445,026 - Walker 4 4,481,498 - McTavish et al. 5 4,545,926 - Fouts, Jr. et al. e 4,639,818 -Cherian 7 4,647,894 - Ratell 8 4,647,896 - Ratell 9 4,685,025 - Carlomagno ιo 4,774,024 - Deep et al. 11 4,689,475 - Kleiner et al. 12 4,732,701 -Nishiietal. 13 4,769,901 - Nagahori 14 4,787,135 -Nagahori is 4,800,253 - Kleiner et al. 16 4,849,133 - Yoshida et al. 17 4,876,439 - Nagahori 18 4,884,163- Deep etal. 19 4,907,340 - Fang et al. 20 4,951,382- Jacobs etal. 21 4,951,384- Jacobs etal. 22 4,955,267 - Jacobs et al. 23 4,980,541 - Shafe et al. 24 5,049,850 - Evans 25 5,140,297- Jacobs etal. 26 5,171,774 -Ueno etal. 27 5,174,924- Yamada etal. 28 5,178,797 -Evans 5,181,006 - Shafe et al. 5,190,697 - Ohkita et al. 5,195,013 - Jacobs et al. 5,227,946 - Jacobs et al. 5,241,741 - Sugaya 5,250,228 - Baigrie et al. 5,280,263 - Sugaya 5,358,793 - Hanada et al. One common type of construction for conductive polymer PTC devices is that which may be described as a laminated structure. Laminated conductive polymer PTC devices typically comprise a single layer of conductive polymer material sandwiched between a pair of metallic electrodes, the latter preferably being a highly-conductive, thin metal foil. See, for example, U.S. Patents Nos. 4,426,633 - Taylor; 5,089,801 - Chan et al.; 4,937,551 - Plasko; and 4,787,135 - Nagahori; and International Publication No. WO97/06660. A relatively recent development in this technology is the multilayer laminated device, in which two or more layers of conductive polymer material are separated by alternating metallic electrode layers (typically metal foil), with the outermost layers likewise being metal electrodes. The result is a device comprising two or more parallel-connected conductive polymer PTC devices in a single package. The advantages of this multilayer construction are reduced surface area ("footprint") taken by the device on a circuit board, and a higher current-carrying capacity, as compared with single layer devices. In meeting a demand for higher component density on circuit boards, the trend in the industry has been toward increasing use of surface mount components as a space-saving measure. Surface mount conductive polymer PTC devices heretofore available have been generally limited to hold currents below about 2.5 amps for packages with a board footprint that generally measures about 9.5 mm by about 6.7 mm. Recently, devices with a footprint of about 4.7 mm by about 3.4 mm, with a hold current of about 1.1 amps, have become available. Still, this footprint is considered relatively large by current surface mount technology (SMT) standards. The major limiting factors in the design of very small SMT conductive polymer PTC devices are the limited surface area and the lower limits on the resistivity that can be achieved by loading the polymer material with a conductive filler (typically carbon black). The fabrication of useful devices with a volume resistivity of less than about 0.2 ohm-cm has not been practical. First, there are difficulties inherent in the fabrication process when dealing with such low volume resistivities. Second, devices with such a low volume resistivity do not exhibit a large PTC effect, and thus are not very useful as circuit protection devices. The steady state heat transfer equation for a conductive polymer PTC device may be given as: (1) 0=[I 2 R(f(T d ))]-[U(T d -T a )], where I is the steady state current passing through the device; R(f(T < ,)) is the resistance of the device, as a function of its temperature and its characteristic "resistance/temperature function" or "R/T curve"; U is the effective heat transfer coefficient of the device; T d is temperature of the device; and T a is the ambient temperature. The "hold current" for such a device may be defined as the value of I necessary to trip the device from a low resistance state to a high resistance state. For a given device, where U is fixed, the only way to increase the hold current is to reduce the value of R. The governing equation for the resistance of any resistive device can be stated as (2) R=pL/A, where p is the volume resistivity of the resistive material in ohm-cm, L is the current flow path length through the device in cm, and A is the effective cross- sectional area of the current path in cm 2 . Thus, the value of R can be reduced either by reducing the volume resistivity p, or by increasing the cross-sectional area A of the device. The value of the volume resistivity p can be decreased by increasing the proportion of the conductive filler loaded into the polymer. The practical limitations of doing this, however, are noted above. A more practical approach to reducing the resistance value R is to increase the cross-sectional area A of the device. Besides being relatively easy to implement (from both a process standpoint and from the standpoint of producing a device with useful PTC characteristics), this method has an additional benefit: In general, as the area of the device increases, the value of the heat transfer coefficient also increases, thereby further increasing the value of the hold current. In SMT applications, however, it is necessary to minimize the effective surface area or footprint of the device. This puts a severe constraint on the effective cross-sectional area of the PTC element in device. Thus, for a device of any given footprint, there is an inherent limitation in the maximum hold current value that can be achieved. Viewed another way, decreasing the footprint can be practically achieved only by reducing the hold current value. There has thus been a long- felt, but as yet unmet, need for very small footprint SMT conductive polymer PTC devices that achieve relatively high hold currents. SUMMARY OF THE INVENTION Broadly, the present invention is a conductive polymer PTC device that has a relatively high hold current while maintaining a very small circuit board footprint. This result is achieved by a multilayer construction that provides an increased effective cross-sectional area A of the current flow path for a given circuit board footprint. In effect, the multilayer construction of the invention provides, in a single, small-footprint surface mount package, three or more PTC devices electrically connected in parallel. In one aspect, the present invention is a conductive polymer PTC device comprising, in a preferred embodiment, multiple alternating layers of metal foil and PTC conductive polymer material, with electrically conductive interconnections to form three or more conductive polymer PTC devices connected to each other in parallel, and with termination elements configured for surface mount termination. Specifically, two of the metal layers form, respectively, first and second external electrodes, while the remaining metal layers form a plurality of internal electrodes that physically separate and electrically connect three or more conductive polymer layers located between the external electrodes. First and second terminals are formed so as to be in physical contact with all of the conductive polymer layers. The electrodes are staggered to create two sets of alternating electrodes: a first set that is in electrical contact with the first terminal, and a second set that is in electrical contact with the second terminal. One of the terminals serves as an input terminal, and the other serves as an output terminal. A first specific embodiment of the invention comprises first, second, and third conductive polymer PTC layers. A first external electrode is in electrical contact with a first terminal and with an exterior surface of the first conductive polymer layer that is opposed to the surface facing the second conductive polymer layer. A second external electrode is in electrical contact with a second terminal and with an exterior surface of the third conductive polymer layer that is opposed to the surface facing the second conductive polymer layer. The first and second conductive polymer layers are separated by a first internal electrode that is in electrical contact with the second terminal, while the second and third conductive polymer layers are separated by a second internal electrode that is in electrical contact with the second terminal. In such an embodiment, if the first terminal is an input terminal and the second terminal is an output terminal, the current flow path is from the first terminal to the first external electrode and to the second internal electrode. From the first external electrode, current flows through the first conductive polymer layer to the first internal electrode and then to the second terminal. From the second internal electrode, current flows through the second conductive polymer layer to the first internal electrode and then to the second terminal, and through the third conductive polymer layer to the second external electrode and then to the second terminal. Thus, the resulting device is, effectively, three PTC devices connected in parallel. This construction provides the advantages of a significantly increased effective cross-sectional area for the current flow path, as compared with a single layer device, without increasing the footprint. Thus, for a given footprint, a larger hold current can be achieved. A second specific embodiment of the invention comprises first, second, third, and fourth conductive polymer PTC layers. The first and fourth conductive polymer layers are separated by a first internal electrode that is in electrical contact with a first terminal; the first and second conductive polymer layers are separated by a second internal electrode that is in electrical contact with a second terminal; and the second and third conductive polymer layers are separated by a third internal electrode that is in electrical contact with the first terminal. A first external electrode is in electrical contact with the second terminal and with an exterior surface of the third conductive polymer layer that is opposed to the surface facing the second conductive polymer layer. A second external electrode is in electrical contact with the second terminal and with an exterior surface of the fourth conductive polymer layer that is opposed to the surface facing the first conductive polymer layer. In another aspect, the present invention is a method of fabricating the above-described devices. For a device having three conductive polymer PTC layers, this method comprises the steps of: (1) providing (a) a first laminated substructure comprising a first conductive polymer PTC layer sandwiched between first and second metal layers, (b) a second conductive polymer PTC layer, and (c) a second laminated substructure comprising a third conductive polymer PTC layer sandwiched between third and fourth metal layers; (2) isolating selected areas of the second and third metal layers to form, respectively, first and second internal arrays of internal electrodes; (3) laminating the first and second laminated substructures to opposite surfaces of the second conductive polymer PTC layer to form a laminated structure comprising the first conductive polymer layer sandwiched between the first and second metal layers, the second conductive polymer PTC layer sandwiched between the second and third metal layers, and the third conductive polymer PTC layer sandwiched between the third and fourth metal layers; (4) isolating selected areas of the first and fourth metal layers to form, respectively, first and second external arrays of isolated metal areas; and (5) forming a plurality of first terminals, each electrically connecting one of the isolated metal areas in the first external array to one of the isolated metal areas in the second internal array, and a plurality of second terminals, each electrically connecting one of the isolated metal areas in the first internal array to one of the isolated metal areas in the second external array. For a device having four conductive polymer PTC layers, a similar fabrication method is employed, except that a third laminated substructure, comprising a fifth metal layer laminated to a fourth conductive polymer PTC layer, is provided in the first step; selected areas of the first, second, and third metal layers are isolated in the second step to form, respectively, first, second, and third internal arrays of isolated metal areas; the fourth conductive polymer PTC layer is laminated to the first metal layer in the third step to form a laminated structure comprising the first conductive polymer PTC layer sandwiched between the first and second metal layers, the second conductive polymer PTC layer sandwiched between the second and third metal areas, the third conductive polymer PTC layer sandwiched between the third and fourth metal layers, and the fourth conductive polymer layer sandwiched between the first and fifth metal layers; selected areas of the fourth and fifth metal layers are isolated in the fourth step to form the first and second external arrays of isolated metal areas; and, in the fifth step, the pluralities of first and second terminals are formed such that each of the first terminals electrically connects one of the isolated metal areas in the first internal array to one of the isolated metal areas in the third internal array, and such that each of the second terminals electrically connects one of the isolated metal areas in the first external array to one of the isolated metal areas in the second external array and to one of the isolated metal areas in the second internal array. More specifically, the step of forming the arrays of isolated metal areas includes the step of isolating, by etching, selected areas of the metal layers to form the first and second internal arrays of isolated metal areas and the first and second external arrays of isolated metal areas (and the third internal array of isolated metal areas in the four conductive polymer PTC layer embodiment). The steps of forming the first and second terminals comprise the steps of (a) forming vias at spaced intervals in the laminated structure, each of the vias intersecting one of the isolated metal areas in each of the first and second external arrays and each of the first and second internal arrays; (b) plating the peripheral surfaces of the vias and adjacent surface portions of the isolated metal areas in the first and second external arrays with a conductive metal plating; and (c) overlaying a solder plating over the metal-plated surfaces. The final step of the fabrication process comprises the step of singulating the laminated structure into a plurality of individual conductive polymer PTC devices, each of which has the structure described above. Specifically, the isolated metal areas in the first and second external arrays are formed, by the singulation step, respectively into first and second pluralities of external electrodes, while the isolated metal areas in the first and second (and third) internal arrays are thereby respectively formed into first and second (and third) pluralities of internal electrodes. The above-mentioned advantages of the present invention, as well as others, will be more readily appreciated from the detailed description that follows. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view of the laminated substructures and a middle conductive polymer PTC layer, illustrating the first step of a conductive polymer PTC device fabrication method in accordance with a first preferred embodiment of the present invention; Figure 2 is a top plan view of the first (upper) laminated substructure of Figure 1; Figure 3 is a cross-sectional view, similar to that of Figure 1, after the performance of the step of creating first and second internal arrays of isolated metal areas respectively in the second and third metal layers of the laminated substructures of Figure 1; Figure 3 A is a cross-sectional view, similar to that of Figure 3, but showing the laminated structure formed after the lamination of the substructures and the middle conductive polymer PTC layer of Figure 1 ; Figure 4 is a top plan view of a portion of the laminated structure of Figure 3 A, after the performance of the step of creating first and second external arrays of isolated metal areas respectively in the first and fourth metal layers shown in Figure 1 ; Figure 5 is a cross-sectional view, taken along line 5 - 5 of Figure 4; Figure 6 is a top plan view of a portion of the laminated structure of Figure 5, after the performance of the step of forming a plurality of vias; Figure 7 is a cross-sectional view taken along line 7 - 7 of Figure 6; Figure 8 is a top plan view, similar to that of Figure 7, after the performance of the step of forming insulative isolation areas on the external metal areas; Figure 9 is a cross-sectional view taken along line 9 - 9 of Figure 8; Figure 10 is a cross-sectional view, similar to that of Figure 9, after the performance of the step of metal-plating the vias and adjacent surface portions of the external metal areas; Figure 11 is a cross-sectional view, similar to that of Figure 10, after the performance of the step of plating the metal-plated surfaces with solder; Figure 12 is a cross-sectional view of a singulated conductive polymer PTC device in accordance with a first preferred embodiment of the present invention; Figure 13 is a top plan view of Figure 12, taken along line 13 - 13 of Figure 12; Figure 14 is a cross-sectional view of the laminated substructures and an unlaminated internal conductive polymer PTC layer, illustrating the first step of a conductive polymer PTC device fabrication method in accordance with a second preferred embodiment of the present invention; Figure 15 is a cross-sectional view, similar to that of Figure 14, after the performance of the step of creating first, second and third internal arrays of isolated metal areas respectively in first, second, and third metal layers of the laminated substructures of Figure 14; Figure 15A is a cross-sectional view, similar to that of Figure 15, but showing the laminated structure formed after the lamination of the substructures and the internal conductive polymer PTC layer of Figure 14; Figure 16 is a cross-sectional view of the laminated structure, similar to Figure 15, after the performance of the step of creating first and second external arrays of isolated metal areas respectively in the fourth and fifth metal layers shown in Figure 1 ; and Figure 17 is a cross-sectional view of a singulated conductive polymer PTC device in accordance with a second preferred embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION Referring now to the drawings, Figure 1 illustrates a first laminated substructure or web 10, and a second laminated substructure or web 12. The first and second webs 10, 12 are provided as the initial step in the process of fabricating a conductive polymer PTC device in accordance with the present invention. The first laminated web 10 comprises a first layer 14 of conductive polymer PTC material sandwiched between first and second metal layers 16a, 16b. A second or middle layer 18 of conductive polymer PTC material is provided for lamination between the first web 10 and the second web 12 in a subsequent step in the process, as will be described below. The second web 12 comprises a third layer 19 of conductive polymer PTC material sandwiched between third and fourth metal layers 20a, 20b. The conductive polymer PTC layers 14, 18, 19 may be made of any suitable conductive polymer PTC composition, such as, for example, high density polyethylene (HDPE) into which is mixed an amount of carbon black that results in the desired electrical operating characteristics. See, for example, International Publication No. WO97/06660, assigned to the assignee of the present invention, the disclosure of which is incorporated herein by reference. The metal layers 16a, 16b, 20a, and 20b may be made of copper or nickel foil, with nickel being preferred for the second and third (internal) metal layers 16b, 20a. If the metal layers 16a, 16b, 20a, 20b are made of copper foil, those foil surfaces that contact the conductive polymer layers are coated with a nickel flash coating (not shown) to prevent unwanted chemical reactions between the polymer and the copper. These polymer contacting surfaces are also preferably "nodularized", by well-known techniques, to provide a roughened surface that provides good adhesion between the metal and the polymer. Thus, in the illustrated embodiment, the second and third (internal) metal layers 16b, 20a are nodularized both surfaces, while the first and fourth (external) metal layers 16a, 20b are nodularized only on the single surface that contacts an adjacent conductive polymer layer. The laminated webs 10, 12 may themselves be formed by any of several suitable processes that are known in the art, as exemplified by U.S. Patents Nos. 4,426,633 - Taylor; 5,089,801 - Chan et al.; 4,937,551 - Plasko; and 4,787,135 - Nagahori; and International Publication No. WO97/06660. It is advantageous at this point to provide some means for maintaining the webs 10, 12 and the middle conductive polymer PTC polymer layer 18 in the proper relative orientation or registration for carrying out the subsequent steps in the fabrication process. Preferably, this is done by forming (e.g., by punching or drilling) a plurality of registration holes 24 in the corners of the webs 10, 12 and the middle polymer layer 18, as shown in Figure 2. Other registration techniques, well known in the art, may also be used. The next step in the process is illustrated in Figure 3. In this step, a pattern of metal in each of the second and third (internal) metal layers 16b, 20a is removed to form first and second internal arrays of isolated metal areas 26b, 26c, respectively, in the metal layers 16b, 20a. Each of the isolated metal areas 26b, 26c in each of the internal metal layers 16b, 20a is electrically isolated from the adjacent metal areas in the same layer by the removal of a strip of metal. The metal removal is accomplished by means of standard techniques used in the fabrication of printed circuit boards, such as those techniques employing photoresist and etching methods. The removal of the metal results in an isolation gap 28 between adjacent metal areas in each of the metal layers. Ensuring that the webs 10, 12 and the middle conductive polymer PTC layer 18 are in proper registration, the middle conductive polymer PTC layer 18 is laminated between the webs 10, 12 by a suitable laminating method, as is well known in the art. The lamination may be performed, for example, under suitable pressure and at a temperature above the melting point of the conductive polymer material, whereby the material of the conductive polymer layers 14, 18, and 19 flows into and fills the isolation gaps 28. The laminate is then cooled to below the melting point of the polymer while maintaining pressure. The result is a laminated structure 30, as shown in Figure 3A. At this point, the polymeric material in the laminated structure 30 may be cross- linked, by well-known methods, if desired for the particular application in which the device will be employed. After the laminated structure 30 has been formed, isolation gaps 28 are formed in the first metal layer 16a and the fourth metal layer 20b (the "external" metal layers), as shown in Figures 4 and 5. The formation of the isolation gaps 28 in the external metal layers 16a, 20b creates, respectively, first and second external arrays of isolated metal areas 26a, 26d. The isolation gaps 28 are staggered in alternating metal layers, so that each of the isolation gaps 28 in the second metal layer 16b overlies one of the isolated metal areas 26c in the third metal layer 20a and underlies one of the isolated metal areas 26a in the first metal layer 16a. In other words, the metal areas 26a in the first external array are in substantial vertical alignment with the metal areas 26c in the second internal array, and the metal areas 26b in the first internal array are in substantial vertical alignment with metal areas 26d in the second external array. The shape, size, and pattern of the isolation gaps 28 will be dictated by the need to optimize the electrical isolation between the metal areas. In the illustrated embodiment, the isolation gaps 28 are in the form of narrow parallel bands, each with a plurality of arcs 29 at regular intervals. The purpose of the arcs 29 will be explained below. Figures 6 through 9 illustrate the next few steps in the fabrication process, which are performed with the laminated structure 30 properly oriented by means of the registration holes 24. First, as shown in Figure 6, a grid of score lines 3 la, 3 lb may be formed, by conventional means, across at least one of the major surfaces of the structure 30. A first set of score lines 31a comprises a parallel array of score lines that are generally parallel to the isolation gaps 28, and that are spaced at uniform intervals, each adjacent to one of the isolation gaps 28. A second set of score lines 3 lb comprises a parallel array of score lines that perpendicularly intersect the first set 31 a at regularly-spaced intervals. The score lines 31a, 31b divide each of the isolated metal areas 26a, 26b, 26c, 26d into a plurality of major areas 32a, 32b, 32c, 32d, respectively, and minor areas 34a, 34b, 34c, and 34d. Each of the major areas 32a, 32b, 32c, 32d is separated from an adjacent minor area 34a, 34b, 34c, 34d by one of the first set of score lines 31a. As will be seen, the major areas 32a, 32b, 32c, 32d will serve, respectively, as first, second, third, and fourth electrode elements in an individual device, and thus the latter terminology will hereinafter be employed. As shown in Figures 6 and 7, a plurality of through-holes or "vias" 36 are punched or drilled through the laminated structure 30 at regularly-spaced intervals along each of the first set of score lines 31a, preferably approximately mid way between each adjacent pair of the second set of score lines 31b. Because the isolation gaps 28 in the successive metal layers 16a, 16b, 20a, 20b are staggered, as described above, the major and minor areas of the metal areas 26a, 26b, 26c, and 26d are also staggered relative to each other, as best shown in Figure 7. Thus, going from the top of the structure 30 downward (as oriented in the drawing), the isolation gaps 28 in successive metal layers are adjacent opposite sides of each of the vias 36, and alternating major and minor metal areas of successive metal layers are adjacent each of the vias 36. Specifically, referring to Figure 7, and taking one of the vias 36' as a reference point, the first major area 32a, the second minor area 34b, the third major area 32c, and the fourth minor area 34d are adjacent the via 36', going from the top of the structure 30 downward. As shown in Figures 8 and 9, a thin isolating layer 38 of electrically insulating material, such as a glass-filled epoxy resin, is formed (as by screen printing) on each of the external major surfaces (i.e., the top and bottom surfaces, as viewed in the drawings). The isolating layers 38 are applied so as to cover the isolation gaps 28 and all but narrow peripheral edges of the electrode elements 32a, 32d and the minor metal areas 34a, 34d. The resulting pattern of the isolating layers 38 leaves a strip of exposed metal 40 along either side of each of the first set of score lines 31 a on the top and bottom major surfaces of the structure 30. The arcs 29 in the isolation gaps 28 define a "bulge" around each of the vias 36, so that each via 36 is completely surrounded by exposed metal, as best shown in Figure 8. The isolating layers 38 are then cured by the application of heat, as is well known in the art. The specific order of the three major fabrication steps described above in connection with Figures 6 through 9 may be varied, if desired. For example, the isolation layers 38 may be applied either before or after the vias 36 are formed, and the scoring step may be performed as the first, second or third of these steps. Next, as shown in Figure 10, all exposed metal surfaces (i.e., the bare strips 40) and the internal surfaces of the vias 36 are coated with a plating 42 of conductive metal, such as tin, nickel, or copper, with copper being preferred. This metal plating step can be performed by any suitable process, such as electrodeposition, for example. Then, as shown in Figure 11, the areas that were metal-plated in the previous step are again plated with a thin solder coating 44. The solder coating 44 can be applied by any suitable process that is well-known in the art, such as refiow soldering or vacuum deposition. Finally, the structure 30 is singulated (by well-known techniques) along the score lines 3 la, 3 lb to form a plurality of individual conductive polymer PTC devices, one of which is shown in Figures 12 and 13 and is designated by the numeral 50. Because each of the first set of score lines 31a passes through a succession of vias 36 in the laminated structure 30, as shown in Figure 6, each of the devices 50 formed after singulation has a pair of opposed sides 52a, 52b, each of which includes one-half of a via 36. The metal plating and the solder plating of the vias 36, described above, create first and second conductive vertical columns 54a, 54b in the half vias on the sides 52a, 52b, respectively. As can be seen in Figure 12, the first conductive column 54a is in intimate physical contact with one of the external electrode elements (i.e., the first or top electrode element 32a) and one of the internal electrode elements (i.e., the third electrode element 32c). The second conductive column 54b is in intimate physical contact with the other external electrode element (i.e., the fourth or bottom electrode element 32d) and the other internal electrode element (i.e., the second electrode element 32b). The first conductive column 54a is also in contact with the second and fourth minor metal areas 34b, 34d, while the second conductive column 54b is also in contact with the first and third minor metal areas 34a, 34c. The minor metal areas 34a, 34b, 34c, 34d are of such small area as to have a negligible current- carrying capacity, and thus do not function as electrodes, as will be seen below. Each device 50 also includes first and second pairs of metal-plated and solder-plated conductive strips 56a, 56b along opposite edges of its top and bottom surfaces. The first and second pairs of conductive strips 56a, 56b are respectively contiguous with the first and second conductive columns 54a, 54b. The first pair of conductive strips 56a and the first conductive column 54a form a first terminal, and the second pair of conductive strips 56b and the second conductive column 54b form a second terminal. The first terminal provides electrical contact with the first electrode element 32a and the third electrode element 32c, while the second terminal provides electrical contact with the second electrode element 32b and the fourth electrode element 32d. For the purposes of this description, the first terminal may be considered an input terminal and the second terminal may be considered an output terminal, but these assigned roles are arbitrary, and the opposite arrangement may be employed. In the device 50 shown in Figures 12 and 13, the current path is as follows: From the input terminal (54a, 56a), current flows (a) through the first electrode element 32a, the first conductive polymer PTC layer 14, and the second electrode element 32b to the output terminal (54b, 56b); (b) through the third electrode element 32c, the third conductive polymer PTC layer 19, and the fourth electrode element 32d, to the output terminal; and (c) through the third electrode element 32c, the second (middle) conductive polymer PTC layer 18 and the second electrode element 32b to the output terminal. This current flow path is equivalent to connecting the conductive polymer PTC layers 14, 18, and 19 in parallel between the input and output terminals. It will be readily apparent that the fabrication method described above may be easily adapted to the manufacture of a device having any number of conductive polymer PTC layers greater than three. Figures 14 through 17 illustrate specifically how the fabrication method of the present invention may be modified to manufacture a device having four conductive polymer PTC layers. For illustrative purposes only, the first few steps in the manufacture of a four layer device will be described. Figure 14 illustrates a first laminated substructure or web 110, a second laminated substructure or web 112, and a third laminated substructure or web 114. The first, second, and third webs 110, 112, 114 are provided as the initial step in the process of fabricating a conductive polymer PTC device in accordance with the present invention. The first laminated web 110 comprises a first layer 116 of conductive polymer PTC material sandwiched between first and second metal layers 118a, 118b. A second conductive polymer PTC layer 120 is provided for placement between the first web 110 and the second web 112. The second laminated web 112 comprises a third conductive polymer PTC layer 122 sandwiched between third and fourth metal layers 118c, 118d. The third web 114 comprises a fourth layer 124 of conductive polymer PTC material with a fifth metal layer 118e laminated to its upper surface (as oriented in the drawings). The metal layers 118a- 118e are made of nickel foil (preferred for the internal layers 118a, 118b, 118c) or copper foil with a nickel flash coating, and those surfaces of the metal layers that are to come into contact with a conductive polymer layer are preferably nodularized, as mentioned above. The webs 110, 112, 114 are shown in Figure 15 after the step of removing strips of metal in a predetermined pattern in each of the internal metal layers 118a, 118b, 118c to create first, second, and third internal arrays of isolated metal areas 126a, 126b, 126c in the metal layers 118a, 118b, 118c, respectively. This step is performed in the manner described above. After this step, the isolated metal areas in each of the internal metal layers are separated by isolation gaps 128. Ensuring that the webs 110, 112, 114, and the second conductive polymer PTC layer 120 are in proper registration, these webs and the second conductive polymer PTC layer 120 are laminated together to form a laminated structure 130, as shown in Figure 15 A. The lamination may be performed, for example, under suitable pressure and at a temperature above the melting point of the conductive polymer material, whereby the material of the conductive polymer layers 116, 120, 122, and 124 flows into and fills the isolation gaps 128. The laminate is then cooled to below the melting point of the polymer while maintaining pressure. The result is the laminated structure 130 shown in Figure 15 A. At this point, the polymeric material in the laminated structure 30 may be cross-linked, by well-known methods, if desired for the particular application in which the device will be employed. After the laminated structure 130 has been formed, isolation gaps 128 are formed in the fifth metal layer 118e and the fourth metal layer 118d (the "external" metal layers), as shown in Figure 16. The formation of the isolation gaps 128 in the external metal layers 118d, 118e creates, respectively, first and second external arrays of isolated metal areas 126d, 126e. The isolation gaps 128 are staggered in alternating metal layers, as described above with respect to the embodiment of Figures 1 through 13. In other words, the metal areas 126d in the first external array are in substantial vertical alignment with the metal areas 126b in the second internal array and with the metal areas 126e in the second external array, while the metal areas 126a in the first internal array are in substantial vertical alignment with metal areas 126c in the third internal array. Thereafter, the fabrication process proceeds as describe above with reference to Figures 7-11. The result is a device 150 (Figure 17) that is similar to that shown in Figures 12 and 13, except that there are four conductive polymer PTC layers separated by three internal electrode elements. The resulting device 150 is electrically equivalent to four conductive polymer PTC elements connected in parallel between an input terminal an output terminal. Specifically, the device 150 comprises first, second, third, and fourth conductive polymer PTC layers 1 16, 120, 122, 124 respectively. The first and fourth conductive polymer PTC layers 1 16, 124 are separated by a first internal electrode 132a that is in electrical contact with a first terminal 156a; the first and second conductive polymer PTC layers 116, 120 are separated by a second internal electrode 132b that is in electrical contact with a second terminal 156b; and the second and third conductive polymer PTC layers 120, 122 are separated by a third internal electrode 132c that is in electrical contact with the first terminal 156a. A first external electrode 132d is in electrical contact with the second terminal 156b and with an exterior surface of the third conductive polymer PTC layer 122 that is opposed to the surface facing the second conductive polymer PTC layer 120. A second external electrode 132e is in electrical contact with the second terminal 156b and with an exterior surface of the fourth conductive polymer PTC layer 124 that is opposed to the surface facing the first conductive polymer layer 116. Insulative isolation layers 138, formed as described above with reference to Figure 9, cover the portions of the external electrodes 132d, 132e between the electrodes 156a, 156b. The terminals 156a, 156b are formed by the metal plating and solder plating steps described above with reference to Figures 10 and 11. If the first terminal 156a is arbitrarily chosen as an input terminal, and the second terminal 156 is arbitrarily chosen as the output terminal, the current path through the device 150 is as follows: From the input terminal, current enters the first and third internal electrode elements 132a, 132c. From the first internal electrode element 132a, current flows (a) through the fourth conductive polymer layer 124 and the second external electrode element 132e to the output terminal; and (b) through the first conductive polymer PTC layer 116 and the second internal electrode element 132b to the output terminal. From the third internal electrode element 132c, current flows (a) through the second conductive polymer PTC layer 120 and the second internal electrode element 132b to the output terminal; and (b) through the third conductive polymer PTC layer 122 and the first external electrode element 132d to the output terminal. It will be appreciated that the device constructed in accordance with the above described fabrication process is very compact, with a small footprint, and yet it can achieve relatively high hold currents. While exemplary embodiments have been described in detail in this specification and in the drawings, it will be appreciated that a number of modifications and variations may suggest themselves to those skilled in the pertinent arts. For example, the fabrication process described herein may be employed with conductive polymer compositions of a wide variety of electrical characteristics, and is thus not limited to those exhibiting PTC behavior. Furthermore, while the present invention is most advantageous in the fabrication of SMT devices, it may be readily adapted to the fabrication of multilayer conductive polymer devices having a wide variety of physical configurations and board mounting arrangements. These and other variations and modifications are considered the equivalents of the corresponding structures or process steps explicitly described herein, and thus are within the scope of the invention as defined in the claims that follow.

Claims: WHAT IS CLAIMED IS: 1. A method of fabricating an electronic device, comprising the steps of: (1) providing (a) a first laminated substructure comprising a first conductive polymer layer sandwiched between first and second metal layers, (b) a second conductive polymer layer, and (c) a second laminated substructure comprising a third conductive polymer layer sandwiched between third and fourth metal layers; (2) forming first and second internal arrays of isolated metal areas by isolating selected areas of the second and third metal layers, respectively; (3) laminating the first and second laminated substructures to opposite surfaces of the second conductive polymer layer; (4) forming first and second external arrays of isolated metal areas by isolating selected areas of the first and fourth metal layers, respectively; and (5) forming a plurality of first terminals, each electrically connecting one of the metal areas in the first external array to one of the metal areas in the second internal array, and a plurality of second terminals, each electrically connecting one of the metal areas in the first internal array to one of the metal areas in the second external array. 2. The method of Claim 1, wherein the conductive polymer exhibits PTC behavior. 3. The method of Claim 1 , wherein the metal layers are made of a material selected from the group consisting of nickel foil and nickel-coated copper foil. 4. The method of Claims 1, 2, or 3, wherein a major portion of each of the metal areas in the first external array is configured as a first external electrode, a major portion of each of the metal areas in the first internal array is configured as a first internal electrode, a major portion of each of the metal areas in the second internal array is configured as a second internal electrode, and a major portion of each of the metal areas in the second external array is configured as a second external electrode, the method further comprising the step of: (6) separating the laminated structure into a plurality of devices, each having a first conductive polymer layer sandwiched between one of the first external electrodes and one of the first internal electrodes, a second conductive polymer layer sandwiched between one each of the first and second internal electrodes, and a third conductive polymer layer sandwiched between one of the second internal electrodes and one of the second external electrodes, with the first terminal being in electrical contact only with the first external electrode and the second internal electrode, and the second terminal being in electrical contact only with the first internal electrode and the second external electrode. 5. The method of Claims 1, 2, 3, or 4, wherein the step of forming the internal arrays comprises the step of removing selected portions of the second and third metal layers, and wherein the step of forming the external arrays comprises the step of removing selected portions of the first and fourth metal layers. 6. The method of Claim 5, wherein the selected portions of the first, second, third, and fourth metal layers are removed so as to form a pattern of isolation gaps between adjacent metal areas in each of the first, second, third, and fourth metal layers, whereby the metal areas in the first external array and the metal areas in the second internal array are staggered with respect to the metal areas in the first internal array and the metal areas in the second external array. 7. The method of Claim 6, wherein the step of forming the first and second pluralities of terminals comprises the steps of: (5)(a) forming a plurality of vias through the laminated structure, each of the vias passing through one of the metal areas in each of the first and second internal arrays and in each of the first and second external arrays, wherein the isolation gaps in successive arrays are on opposite sides of each of the vias; and (5)(b) metallizing the interior surface of each of the vias. 8. The method of Claim 7, wherein the step of metallizing comprises the steps of: (5)(b)(i) plating the interior via surfaces with a metal selected from the group consisting of tin, nickel, and copper; and (5)(b)(ii) coating the plated interior via surfaces with solder. 9. The method of Claim 7, further comprising, after the step of forming the vias and before the step of metallizing, the step of forming an isolation layer of insulative material on each of the metal areas in the first and second external arrays, each of the isolation layers being configured so as to overlie one of the isolation gaps and to leave exposed a portion of each metal area adjacent each of the vias. 10. The method of Claim 9, wherein the isolation layers are formed of glass-filled epoxy resin. 11. The method of Claim 9, wherein the step of metallizing is performed so as to metallize the exposed portions of each metal area adjacent each of the vias. 12. An electronic device, comprising: first and second terminals; and at least three conductive polymer PTC layers electrically connected in parallel between the first and second terminals. 13. The electronic device of Claim 12, further comprising: first, second, third, and fourth electrode elements, the first and third electrode elements being connected to the first terminal and the second and fourth electrode elements being connected to the second terminal; wherein the first conductive polymer PTC layer is laminated between the first and second electrode elements, the second conductive polymer PTC layer is laminated between the second and third electrode elements, and the third conductive polymer PTC layer is laminated between the third and fourth electrode elements. 14. The electronic device of Claim 13, wherein the electrode elements are made of a metal foil. 15. The electronic device of Claim 14, wherein the metal foil is made of a material selected from the group consisting of nickel and nickel-coated copper. 16. The electronic device of Claims 12, 13, 14, or 15, wherein each of the first and second terminals comprises: a first layer formed of a metal selected from the group consisting of tin, nickel, and copper; and a second layer formed of solder. 17. An electronic device, comprising: first and second terminals; first, second, and third conductive polymer PTC layers, each having first and second opposed surfaces; the first and second conductive polymer PTC layers being separated by a first internal electrode that is in electrical contact with the second terminal, the second surface of the first conductive polymer PTC layer and with the first surface of the second conductive polymer PTC layer; the second and third conductive polymer PTC layers being separated by a second internal electrode that is in electrical contact with the first terminal, the second surface of the second conductive polymer PTC layer, and the first surface of the third conductive polymer PTC layer; a first external electrode in electrical contact with the first terminal and with the first surface of the first conductive polymer PTC layer; and a second external electrode in electrical contact with the second terminal and with the second surface of the third conductive polymer PTC layer. 18. The electronic device of Claim 17, wherein the electrode elements are made of a metal foil. 19. The electronic device of Claim 18, wherein the metal foil is made of a material selected from the group consisting of nickel and nickel-coated copper. 20. The electronic device of Claim 17, further comprising: a first insulating layer on the first external electrode; and a second insulating layer on the second external electrode. 21. The electronic device of Claim 20, wherein the insulating layer is made of glass-filled epoxy resin. 22. The electronic device of Claim 17, wherein the first, second, and third conductive polymer PTC layers are connected in parallel between the first and second terminals by the first and second internal electrode elements and the first and second external electrode elements. 23. The electronic device of Claim 17, wherein each of the first and second terminals comprises: a first layer formed of a metal selected from the group consisting of tin, nickel, and copper; and a second layer formed of solder. 24. A method of fabricating an electronic device, comprising the steps of: (1) providing (a) a first laminated substructure comprising a first conductive polymer layer sandwiched between first and second metal layers, (b) a second conductive polymer layer, (c) a second laminated substructure comprising a third conductive polymer layer sandwiched between third and fourth metal layers, and (d) a third laminated substructure comprising a fourth layer of conductive polymer material laminated to a fifth metal layer; (2) forming first, second, third internal arrays of isolated metal areas by isolating selected areas of the first, second and third metal layers, respectively; (3) laminating the first and second laminated substructures to opposite surfaces of the second conductive polymer layer and laminating the third substructure to the first substructure so as to create a laminated structure comprising the first conductive polymer layer sandwiched between the first and second metal layers, the second conductive polymer layer sandwiched between the second and third metal layers, the third conductive polymer layer sandwiched between the third and fourth metal layers, and the fourth conductive polymer layer sandwiched between the first and fifth metal layers; (4) forming first and second external arrays of isolated metal areas by isolating selected areas of the fourth and fifth metal layers, respectively; and (5) forming a plurality of first terminals, each electrically connecting one of the metal areas in the first internal array to one of the metal areas in the third internal array, and a plurality of second terminals, each electrically connecting one of the metal areas in the second internal array to one of the metal areas in the first external array and to one of the metal areas in the second external array. 25. The method of Claim 24, wherein the conductive polymer exhibits PTC behavior. 26. The method of Claim 24, wherein the metal layers are made of a material selected from the group consisting of nickel foil and nickel-coated copper foil. 27. The method of Claims 24, 25, or 26, wherein a major portion of each of the metal areas in the first external array is configured as a first external electrode, a major portion of each of the metal areas in the first internal array is configured as a first internal electrode, a major portion of each of the metal areas in the second internal array is configured as a second internal electrode, a major portion of each of the metal areas in the third internal array is configured as a third internal electrode, and a major portion of each of the metal areas in the second external array is configured as a second external electrode, the method further comprising the step of: (6) separating the laminated structure into a plurality of devices, each having a first conductive polymer layer sandwiched between one of the first internal electrodes and one of the second internal electrodes, a second conductive polymer layer sandwiched between one the second internal electrodes and one of the third internal electrodes, a third conductive polymer layer sandwiched between one of the third internal electrodes and one of the first external electrodes, and a fourth conductive polymer layer sandwiched between one of the first internal electrodes and one of the second external electrodes, with the first terminal being in electrical contact only with the first and third internal electrodes, and the second terminal being in electrical contact only with the second internal electrode and the first and second external electrodes. 28. The method of Claims 24, 25, 26, or 27, wherein the step of forming the internal arrays comprises the step of removing selected portions of the first, second, and third metal layers, and wherein the step of forming the external arrays comprises the step of removing selected portions of the fourth and fifth metal layers. 29. The method of Claim 28, wherein the selected portions of the first, second, third, fourth, and fifth metal layers are removed so as to form a pattern of isolation gaps between adjacent metal areas in each of the first, second, third, fourth, and fifth metal layers, whereby the metal areas in the first and second external arrays and the metal areas in the second internal array are staggered with respect to the metal areas in the first and third internal arrays. 30. The method of Claim 29, wherein the step of forming the first and second pluralities of terminals comprises the steps of: (5)(a) forming a plurality of vias through the laminated structure, each of the vias passing through one of the metal areas in each of the first, second, and third internal arrays and in each of the first and second external arrays, wherein the isolation gaps in successive arrays are on opposite sides of each of the vias; and (5)(b) metallizing the interior surface of each of the vias. 31. The method of Claim 30, wherein the step of metallizing comprises the steps of: (5)(b)(i) plating the interior via surfaces with a metal selected from the group consisting of tin, nickel, and copper; and (5)(b)(ii) coating the plated interior via surfaces with solder. 32. The method of Claim 30, further comprising, after the step of forming the vias and before the step of metallizing, the step of forming an isolation layer of insulative material on each of the metal areas in the first and second external arrays, each of the isolation layers being configured so as to overlie one of the isolation gaps and to leave exposed a portion of each metal area adjacent each of the vias. 33. The method of Claim 32, wherein the isolation layers are formed of glass-filled epoxy resin. 34. The method of Claim 32, wherein the step of metallizing is performed so as to metallize the exposed portions of each metal area adjacent each of the vias.

Inventors: BARRETT ANDREW BRIAN, BARRETT, ANDREW, BRIAN
Applicants: BOURNS MULTIFUSE HONG KONG LTD, BOURNS, MULTIFUSE (HONG KONG), LTD.
Application year: 1999
Main classification: H01C
IPC codes: H01C1, H01C7