IMPROVED TRANSFORMER OPERATIONS

Abstract: A package for power converters in which a multilayers circuit board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some portions of the bottom layers are also support for electronic components. Some of the components are placed on the top layer, which may not be utilized for magnetic winding, reducing the footprint of the magnetic core (26a). The power dissipating devices placed on pads which have a multitude of copper coated via connecting the top to bottom layers. Through these via the heat is transferred from the power devices to the other side of the PCB. In some of the embodiments of this invention the heat can be further transferred to a metal plate connected to the multilayers circuit board via a thermally conductive insulator. The base plate has cutouts or cavities to accomodate the magnetic cores. A thermally conductive material is placed between the magnetic core (26a) and the metal plate on the bottom of the cavity.

Description: Improved Transformer Operations Background of the Invention: This invention relates generally to the electrical design and mechanical packaging of electronic components, and more particularly to a method of power conversion utilizing a multiple transformers primaries in series and secondary in parallel. One approach to packaging electric components in power converters (Fig. 1) includes a housing which both encloses the components and means of heat extraction from the components. The house includes a non-conductive casing 5 and an aluminum heat-smkmg base. A printed circuit board (PCB) 3 is mounted next to the upper wall 5a of the casing. Conductive pins 7 are attached directly to the PCB 3 and extend up through the wall 5a. Electronic components 9a, 9c are mounted to one or both sides of the PCB 3. Larger side components such as the transformer 9c are monted to the lower side for space reason. Power dissipat σ devices sucn as 9b are mounted directly on the base-plate 6 for better heat transfer. The power components 9b are electrically connected to the PBC by leads 12. Some of the power dissipating devices, 9d, are attached to the base plate via a thermally conductive insulator material 8 structure 1 may be filled with an encapsulant, which acts as a heat spreader and provides mechanical support. In the case when a hard epoxy encapsulant is used a"buffer coating" material is used to protect some of the components. In the multiple transformer configuration of this invention, the use of multiple transformers is not new. These multiple secondaries (parallel or not) provide for equal currents but these currents get constricted in the rectifiers and output cnokes. Using this type of structure requires large, expensive output chokes ana special high current rectifiers which take up precious PCB space. Another drawback to the standarα topology is that as device characteristics change over time in the rectifiers and transformers, the currents the secondaries become more unbalanced while adversely affecting the flux densities the transformers. It is clear that there is a need for an improved circuit for multiple transformer systems. Summary of the Invention: This invention is related to the electrical design and mechanical packaging of electronic components. It involves a new method of power conversion utilizing a multiple transformers primaries in series ana secondary m parallel (or vice versa) . Within the present invention, a transformer group is created in which The transformers are connected in series ; in order to assist m providing a The flux equalizer circuit provides a series of lux windings . Each flux *-' ΪVXJI XU j. mini a. ±ny±c j-QUOLUiiuci . me αlc cii- J. ctiigSQ in a closed loop. In this manner, a balancing of the output of the by its associated flux winding which is 'shared" with the other 10 As background, the invention provides a packaging technology for compact, inexpensive, easy to manufacture. The invention features a packaging concept most of the power magnetic elements are constructed into -I- ' Luc uiui iiQ i r . x x ϋ. iiyD w x. uc .uαyuc ι_ ..- -_ cxcuici: i-i Suυn a.z> transformer, inductors, ana m some cases event: signal transformers are lI.Cθ ' r a ~ ar~t _ Thα ]_ a v- a τ->H cnrng -> - +- i f— . τ» nf -f- i bottom layer are also support for electronic components. The windings of 20 electronic components are placed on the top and on the bottom of the PCB. interconnections between the magnetic elements. In this way the footprint ~ ι the in a t * iA n c core. The power-dissipatmg devices replaced on pads, which have a U --. 4- liic ucα transferred to the other side of the PCB can be further spread using a tnrougn an isolating material. For air-cooled due to the limited surface 30 spreaαer to increase its cooling area. magnetic element's windings are incorporated on the multilayers PCB construction which l c '™ , ^^ vss as a su r ort for cower- issirjatinr components and some of the control components. The heat from the power- ~>—» J. S5ipa i g componen s s CXU SCLCU u ou u coppe costcu v a nicn transfer the heat to the other side of the PCB. The heat is further conductive insulator. For airflow cooling applications the heat spreader connected to the th rm a l v a can s α rve as a s urface. A heatsink 40 can be also attached to the heat spreader to increased the heat dissipation area. In the multiple transformer configuration of this invention, order to ensure that the flux level is kept proper for each of the transformers, another secondary winding is added to each transformer to force that the flux densities each transformer to be equal. In addition, the outputs are paralleled after the output chokes so the currents are spread over multiple secondaries each complete with their own rectifiers and output chokes . The invention, together with various emocdiments thereof, will be more fully explained by the accompanying drawings and the following psfπ D inns - Figure 1 is a cross-sectional side view of prior art components ? mg. Figure 2 is a perspective exploded view of component packaging ie i ΠVPT Figure 3A is a top view of the packaging with a detailed section of the magnetic' winding. Figure 3B is an enlarged view of a section of Fig 3A Figure 4A is a top view of the packaging with a detailed section of the cooling via. Figure C is a section of the packaging through the cooling via and through a magnetic element. Figure D is a oro en view of the cooling via herein the insulator material penetrates in the cooling via. Figure 5A is the top view of the horizontal packaging with airflow cooling. Figure 5B is a cross section of the errJoodimer.t of figure 5A. Figure 6 is a top view of the packaging Figure 6A is a cross-section of the package with cooling by airflow and cavities for magnetic cores. Figure 6B is a cross-section of the package with cooling by airflow and holes for magnetic cores. Figure A it is a perspective view of the power packages for airflow cooling. Figure " 'B is a perspective view of the power packages for airflow cooling and additional heating applied to the multilayers circuit board. Figure θ is a cross-section of the packaging connected to the motherboard. Figure 9 it is another embodiment of the present invention. Figure 10A is a high power magnetics package according to this invention. Figure 10B is a cross-section of the magnetic package presented in figure 10. Figure 11 is an electrical schematic of the preferred embodiment of the multiple transformer using flux equalizing loops. Figure 12 is an electrical schematic of an alternative embodiment of the multiple transformer invention which no central taps have been utiliz e d. Figure 13 is an electrical schematic of an embodiment of the multiple transformer invention m which the flux equalizing loops react to electrical flow througn multiple power trains. Figure 1 is an electrical schematic of an alternative embodiment of the multiple transformer invention. Figure 15 is a method of implementing the flux equalizing loops of this invention. Figure 16 is an electrical schematic of an embodiment n which the flux equalizing loops are employed also in the output choke. Figure l 1 snows a cross-sectional diagram of the completed PCB assembly using the improved thermal coupling apparatus for this invention. an additional heats k. Figure 19 is still another embodiment of the invention in which the thermal slugs/inserts are wedged into the via. Figure 20 is still another embodiment of the thermal conductive aspect of this invention. Figure 21 illustrates an alternative embodiment in which the metal slugs extend past the PCB and are used to secure the neatsmk to the PCB. Figure 22 illustrates an emoodiment of the invention having enhanced cooling capabilities. Figure 23 presents a multilayer PCB which contain the magnetic element and the high frequency switchinq electronic components of the electronic circuit. Figure 24 presents the criteria used to define the high frequency switching electronic components. Figure 25A presents the multilayer PCB structure that incorporates the magnetic element and the high frequency electronic components. Figure 25B presents a method of attaching the power PCB to the mother PCB using copper coated via and solder penetrating through copper coated via. Figure 25C presents a method of attaching the power PCB to the mother PCB using through hole pins. Figure 25D presents a method of attaching the power PCB to the mother Figure 25E presents a method of attacning the power PCB to the mother T3 T-2 n e? 1 n «mvFar-o rnΛnn m n Figure 25F presents a method of attaching the power PCB to the mother rCB using L,WO P GSSGU inserts sπ a screw. Figure 26 presents the same structure depicted m figure 11 wherein cnrf ΛΓΏ TnAii oH C T _H Q θf h ITIO s PCB Figure 27A presents the same structure depicted figure 11 wherein a rnei ■ lt--h hppτ~- DΓP 10 Figure 27B presents the same structure depicted in figure 15A wherein ■ HVip r"« * " * -v 1 t rr n 1 a +~ p surface mounted components are placed in the space between power PCB and Figure 27C presents an embodiment wherein the magnetic element is --u αuLαuiicu - J an xo iαLCU ILLC - UJJO ux. CL ι_.e υiui uocu u_y α .- C:J-C-:V_L-. X. -. ma. ιcι α. J. , copper foil, and metal plate. magnetic core goes through both the power PCB and the mother PCB. 20 magnetic core goes through several PCB, αm Λrji m nf r> "'"hi i v ntion where m the magnetic core goes through several power PCB which contain high frequency CΓT.J'T f- - iT rr o 1 o— -- JT ^ I" * "• ' " ^^n nn ont-ς aηr^ Η ij- Q -πi-rVi +- Ω ^^h PCB Figure 31 presents another embodiment of this invention wherein a _ αι_ι-.α.Cιιc;Q L. L.IC wc . Figure 32 presents another embodiment of this invention wherein a switching electronic components are attached to the power PCB. TT i rr π v 3 ^"*"oop -r-c: anAf αr amhn i τnon +- -> -F ''" 0 iπVΘ-i l Λ ri he e m SQ Ϊ Tie 30 of the high heat dissipation components are located on an alumina substrate Figure 34 presents another embodiment of th s invention wherein the "*~OD o f a e m 1V conductive insert further soldered to a copper foil edged on an isolated -> ~» uie tax uj -ci c υuαxu. Figure 35 presents another embodiment of the invention wherein the processing cells, which can be multiplied to meet the power requirements. ** u iQwxuMo In ucι,αxι. As described before, figure 1, illustrates the prior art of this invention. P.e^erriπ^ to Fi 1 "* 2 m "h 0 ^ c ^i cf ^ o ovideo, y th s ven ion, a power-αissipatmg electronic components 22 are located on the multilayer pm ?ρ r-n +- n-f -HH-a v,Ωa +- <mnp Hor- aH i Q T -i r* ΛP The heat soreader oad is connected to the copper coated via. A heat spreader 74, Fig 4B, is connected on tne rjacKsic or tne Lets tnrougu v α. i * .. ue copper coated via can be filled with solder or can be empty in which case t- -.Ω noa-r- t π 11 o i τmoT-al -ι -at-ιnn O CPd OH th . S ll the via. The metalization is formed by copper deposit during the plating r-n^o- c aco /-'τ -t- H uπ tVi +- " h Ω tnannf a fnrinrf ^TCCSSS O t PCB. AS 3 . ¥ SSUl t 10 of the plating process the wall of the via is covered with copper. The via can be also filled with a thermall conductive material 30a as is presented in figure 4D. The isolated material 30 placed under the PCB 28 under p ress r will ^enetrate throu g h the via filling the space. In between the 28 and the metal base plate 32 an insulator material with good thermal - ~ι conductivity characteristics 30 is placed. In tnis way tne heat i-rom the power dissipating components 22, is transferred through the copper pad 48 n t.rn T f-* -ι +- Vi o Γ.Λ Q ~ rli ccmat-inn H p-yi r-Ω i c rnni Tit θ tO he C ppST CO e Vi 42 to the other side of the PCB, 28B, to the heat spreader 74. The heat is further transferred throu g h the thermall conductive insulator material 30 20 to the metal plate 32. In the case wherein the insulator material 30 will 42 the surface contact will increase and as a result the thermal transfer from tne copper pad 48 to the The ma embodiments of this invention is the magnetic elements extracted form the power dissipating αevices, from the magnetic winding 50, i Fi g r 3 and Fief core 26 and 26B, and the low power dissipation devices 20 to the baseplate 32. To increase the power d Ω nsιt cΛTng ccϊ τ τ*" , ei +- ° 88 ^T m.^' ι nt cι < on top cf the multilayers PCB 28a, 30 on top of the windings 50 embedded the inner _ayers of the multilayers PCB 28. In this wa the foot p rint of the magnetic element is reduced to the footprint of the magnetic core 26a. The ma embodiment of this invention is the fact that the magnetics elements are implemented m the multilayers PCB 28. In the prior art the -j cxcnicu L-D wc . c UIOL I C LC V - uvux i WCJ.C V_, JUUC .LC - L LUC r *_-._> i~ι means of through hole or surface mounted pins. Tne presence of the e 1 " i'"' e1 me t and t reduc s the reliability of the magnetic device due to the mechanical failure of the nι_nc The ιπ e ' ec + " Λ π r-.->^ .^ π- αri bro en easily. The presence 40 of the interconnection pins aαds supplementary stray inductance in series + "h *~ ^ +- τ :a r c -f ^i τ~τnα y" T π c l.π l l nαna uτo u 1!T1D3C t the el ctrical performance of the circuit. In most of the applications the energy parasitic inductance of the inter connection pins can increase to voltage In this invention the magnetic elements have the windings embedded —* iπsi c θι U FLU L1xsysTs iCu. X118 1 L6ΓC0 U C X0Π UC .IC m ic elements and between the magnetic elements and the electronic components a o m a de and through the copper coated via 42 in the multiyear PCB 28. This allows the u°e ^^ IHTG cornelsx IΠ^IΠ^ arrancrements and allows the use of more 0 magnetic elements on the same multilayers PCB construction. The PCB. The converter will contain a number of smaller magnetic elements penetrate through multilayers PCB via the cutouts 78a and 78b fitted for can be glued together or attached via a spring clips 82. To accommodate side of the magnetic core 26b, will surface on the back of the PCB. To be 0 insulator material 30. In most of applications the thickness of the accommodate the magnetic core 26b, cavities 56, are produced into the base pad 56, with small thermal impedance is placed under the magnetic core 26b The low thermal impedance of the pad 56, will also offer a cooling path for achieved to the oase plate, the pad, 56 have to have insulation properties. 0 core 26b will be placed on top of the pad 56. The thickness cf the pad has insulator 30. The insulator 30, is pressed between the PCB 28 and metal preferred embodiment the isolator material 30 has adhesive properties > J s ι_iiu . ι_e j-'y a curing process 5L ϋiyn iupera re. Λiter t.ie curing process the insulator created a bound between the PCB 28, and the metal plate, the flanges 40 can accommodate screws. 0 A section of the structure is blown figure 4B. In the cross-section of top of the copper pad 48, and the coated via 42. The copper coated via ca " the heat to the n oa+ " e ^reade ^ . The heat s further t ansfer ed via the thermally conductive insulator 30 to the metal plate 32. A second CΓOΞS-SS^'*""' Λf -Γ-KΩ τ Λi τι d structure ^, is presented in figure 4C. In the cross-section, 92, is presented the upper section of the under the magnetic core 34 located m the cavity 56. The heat generated in the core 26 is transferred to the base plate through the pad 34. For components wnich have to have a temperature close to the temperature of ■ f-ViΩ aσΩ nil a 1- o r> r-, -f- H a a nl a H π o * -t- i r*'" ,τγι rϊri'n PT"! t * °. Ci γ ' ^ ~ C* t"h 10 traces and pad connected to the components. In this way low thermal i πinoH Ω i o aphi αupH +- h σ p nl a p Tfi +-V» 1 f~ P"rϊiia 1 1 TΪΪD S an CP "*" O fh Q base plate, the temperature rise of these components will be small. OCV-ΩT 7C •-■ 1 t n σ n r- Hi ffprpnf mpan rs- 1 V ff " TP SUTP r O "f"" structure 7 can also make the attachment of the PCB 28, to the isolator 30 x vj LUC Liα5G ~ pxα_6 -_>_... ιH SGiT.e appxlCatlOnS LUC CULOULS iu LUC IUCLSXXXC plate 32 can penetrate through the plate. The magnetic cores 26b will be visible from the bottom c-tHo n-f +- o τ r,cι ' t~a lli'~' ^l t . For protectincr the magnetic cores 26b, soft epoxy material can cover the remaining cavity in p-t-T- opn +- o martnpf i « cnn aπ/ +-h cny ac ■ f- ' hΩ Ha n 1 a p 32. Tϊ"ϊ 20 application that cavity can be left open. In figure 8 is ^re c ^ n^ - o ^ ° o+~vπ.-t-πτ~Ω Q wnerem the package " ^ is attached to a motherboard 96. The attachment is done through the power connectors 24a and 24b. The n ov.'sr r,n nr * sctors are attached to the motherboard 96 through screws 98. There is a signal connector 106 located signal connector 104 located on motherboard 96. More than one structure 7 can ^~ tc> connected to ''"h C^TΠΩ rn^-r-ne.r'K^ar-r-i 6 ^n the motherboard 96 there are additional components 100 and 102. This structure it is suitable for 30 on the structure 7. Some of the control section components, supplementary locTi ' ^ c rcuits and ΞMI "FI IΉOV-C- no lΛAa pH n +"]τ,o mo e bo r . The bettorn, layer of the motherboard 96 may contain copper shields to protect the noise op c'T 'T-T P ccT - n pn-t- e T p nm σp & π c anp loca e H t" p motherboard and tne power αissipate components, some control components and — i .-» ii magnetics are ±ocsteu on tϋe structure > . In figure 5a and 5b is presented a packaging structure 11. In this structure the a^net ^ e^ Q ^ Q ^" h nσ "* ^ ~e .^n^^n^ embedded within the multilayers PCB 28 as it is in structure 7. The components are located on both sides of the multila y ers PCB This structure applies to low 40 power dissipation application wherein there is an airflow. The entire surface of multιla ers PCB 28 bec^ ΛC a heatsink. The structure 11 is connected to the other circuitry via the pins 52. packaging structures 15. The structure 15 include the magnetic elements components 20, similar with structure 7. The mam difference is that there the air, which flows m between the packaging structures 15. The entire surf a/ -* , __ nf ι_5 ^ Q C Γ, _.Θ C a he =, ' rc; k_ The structures 15 are connected to the motherboard 64 through signal connectors 70a, and power connectors 70b. AArn πnαnf c a no 1 AA gH OU th other o d 64 10 In figure 7B the motherboard 64 is connected to two packaging s ^c^ s 1 * ^ These r , f m f °^r ι .ctures contain the same components as structure 15 with an additional heat sink 58 attached to the multilayers PCB 28 throu g h the insulator 30. Two types of neatsmk construction are presented m figure 6A and B. cavities a soft compressible material 34, w th low thermal impedance is placed. The insulator wι ~ _ ^ o thermal impedance 30 is placed between the multilayers PCB 28 and the base plate 58. The magnetic core 26b is cooled 20 copper coated via like in structure 7. In i g ur 6B air fms 60 has cutout—outs 64 to accommodate for the magnetic core 26b. The cooling of the magnetic core dissipation devices is done through copper coated via 42. ---J In figure _> is presenter a ρac agιng struc ure Wϋerein ϋβ uiβ α± plate 32 does not contain cavities. It has elevated sections 104, which makes contact wι*~h the ^ ~ h°rm ll ^*~ ι nd τ ' , ctι e insulator 30, which is laced under the multilayers PCB 28. The elevated sections of the metal plate 104 are 30 dissipation components 20c which require to have a temperature close to the base plate tem p erature. The thermali conductive soft pad 34, on the base plate 32 supports the magnetic core 26a and 26b. The height of the elevated section of the ^^s Qr ^late 104 are function of the height of the magnetic core 26b and the compression ratio of the pad 34. The advantage * Oi- uiie ρac agιng concept is ne -.act tnat more components can be mounted on the multilayers PCB on the backside 20b. This package is suitable for o er ^ r n °rt Q ΎΛ C! ι ΓΠ AVI c^ -r-aτ ii - A n T I a nd ° ι rf ' D I intθ f a "S functions. The interconnection pins 24a and 24b will provide the power and 40 to accommodate the interconnection pins 24a and 24b. teeth 112 are formed along the lower edge of the case. A matching grove 108 s undercut into the base ^l t 32. In figure 10A is presented a high power magnetic structure wherein section through the structure 19 is presented in figure 10B. The windings The cutout 116 in the multilayers PBC 28 are made to accommodate the m a rm i ' cn.na 26. cn ΩΛ' -c -o ano m HT l t laVe S PBC 28. The connectors 24a and 24b are connected to the windings 50. The cores 26a and 26b are attache^ ^o^ th r via the clips 82. The multilayers 10 PCB 28 wherein the windings 50 are embedded into also offers supports for thermally conductive soft pad is placed under the magnetic core 26b on top of base ^l t 32 Figure 11 is an electrical schematic of the preferred embodiment of x w> L xc αu_) xuIiiL uoxuy c _ιαxx-.xuy xυuub . As shown, two (or more) separate primary windings (110A, HOB) are amongst them m an effort to reduce the size and cost of high power, high 20 Ul. There are multiple primaries denoted r. which are connected series . In this embodiment, the transformer is optionally a discrete type of tran ° ormer which ι c sol^e e^ * ~ ^ "* ~ ^e p^^ ^ ~ c t is constructed of windings embedded in a multilayer PCB with an E-cores. ~- > eparat g ne primaries (a ^ s conda i s; in tϋis manner pro id s for smaller components m the power tra . This allows for higher power devices. The secondaries are placed parallel prior to the output 30 The present invention provides for a balancing the output power needs auxiliary secondary winding (112A, 112B) is added to each transformer m secondary windings are denoted L B - L BN and are connected together m separate transformers, currents flow in this secondary winding to force the way accounts for differences m device characteristics between the different power trains v. r hιch is d Λc ιrable. 40 While only two transformers are illustrated, the invention demands of the circuit and loaα in question. Figure 12 is an electrical schematic of an alternative embodiment of the multiple transformer invention in which no central taps have been The embodiment of figure 12 performs in an identical manner as that of figure 11, except that in the figure 12 embodiment, the transformers do not have a central tap. The elimination of the central tap illustrates the versatility of the present invention. Figure 13 is an electrical schematic of an embodiment of the multiple transformer invention m which the flux equalizing loops react to electrical flow through multiple power tra s. These multiple power trains can be phase shifted to reduce the input and output current ripple. Figure 14 is an electrical schematic of an alternative embodiment of the multiple transformer invention. The auxiliary windings Lauxl and L.aux2, are connected in parallel with reverse polarity to insure a bi-αirectional flux swing m the transformers. Figure 15 is a method of implementing a flux equalizing loop. Layer 151A and 151B are two different layers of a multi-layered printed circuit board. Magnet core 152 extends through the multi-layered printed circuit board. Other magnet cores 155 and 154 are also positioned through the PCB. Copper layer 153A is used to create the flux windings; flux windings created by copper layer 153B is offset to create the required phase shift. These drawings present a simple and effective methodology of the flux equalizing windings implementation. This method nas the advantage that the copper layout can be used for multiple functions such as shield, heat spreader and even flux tunneling. Figure 16 is an electrical schematic of an embodiment which flux equalizing loops are employed also in the output choke. The flux equalizing loops L- ... L dN will ensure an equal flux swing the transformer T„, ... T„ . The flux equalizing loops L„._ ... L ofL will ensure equal flux swing in the output inductance elements L ... L for stead state and dynamic operating conditions. In some applications, the coupling between L 1 ...L OH and L ofl and L £N can be loose, without deviating from the scope of this invention. The same applies to the coupling between L ... L B ., and the rest of the winding of T 1 ...T W . Figure I "7 show's a cross-sectional diagram of the completed PCB assembly using the improved thermal coupling apparatus for this invention. \ The basic components for this embodiment are: power device I "7 ! other devices 172, magnetic cores l " ^, solder 174, via with plated copper walls 1 Tζ 1 pπc -f* ώ <a n o l i"? nni f-oH (PCB) having multilayers 178, copper foil 179, insulation material 1710, material 1713, and metal insert 1714. 5 Electrical components (171, 172 and 173) are assembled on a multilayer PCB (178) . Under the power device (171) are one or more rnπ1 +-1-— .I c* ( Λ H a τ- 1 a rrro enough to accept a large metal insert (1714) which is soldered to the PCB. TVi ocp mpf al i oonf- a. np /— n ___τ- "H p v- +- pττrι al /— nHπf-'+' v-o Vian onl Hor" a 1 oτ>ρ 10 In this context, the thermal insert/ plug 1714 used within the via >-ι a o +-Vιp- * ~m 1 n r- p n+- i p o i mnr-A r-l Λ ro Qnlrjor THpal 1 u +- p thermal conductivity of the plug is at least 25 percent greater than σ l pn TV> F 1 ? 1 Αnr *-ιτ-ι ττι u n o +- i p hpaf f 1 n a cm~-ra — Ωn nni f- time, divided by the negative of the rate of change of temperature with x w> n o w-xr v-LX -ui ]Jcxucuux ,u I ιυ ou.xxa.iwC. x UU-3C 1 x uxCXxiic-xy skill in the art readily recognize a variety of such materials, including, Kn nn.4- 1 π mi H f-Λ • cn c ant-i al 1 i; m i n p n o cπHo-r-a f-i l 1 m no o i li pr and substantially pure alumina. Located dire^tl- underneath the PCB is an insulated multilayer 20 substrate which aids in the transfer of heat form the PCB to the aluminum naopnl a p Vi i c cnKc af Q i o Vivpp rli ffprpn m f-pv'η al c T* Vi top layer is a thin copper foil (179) . A portion of this copper foil * 7 G f Vip D T-Ϊ i n hp l -<a+--ι uVipvp +- p metal inserts (1714) protrude through the PCB. Electrical isolation from location which is to be soldered to the metal inserts (1714) . The rest of the A Dθ foil ^ * ^9^ ° n°t s^ld r^d "* ~ o the bottom, of the PCB, t relies on pressure to provide the coupling for heat transfer. The middle layer of ■ h o πw<-7+- - -ι-Ω / 17i π^ 1 t-v-ιΩvmai i u r— iir—-ι-ι τ ma i ^ * 1 '""'h electrically 30 insulates the copper foil layer from the bottom aluminum plate (1711) . The PCB alone w η ''"h ^~he substrate ma' then be m.ounted to an aluminum, baseplate (1712) . Any conductive devices such as ferπte cores (1713) may be thermoconductive material. to the top of the PCB, on top of the soldered metal inserts. The heat (jaη ra +- H Hn inrt Ωl f—+-γ-ι ."al nnaraf Q through the metal inserts. The heat is spread out over a large surface area throucrh the ^u " ' 3 tιoπ m ^ Q rι a l ^^ the alum. um. late and to the 40 baseplate. TV> p m.T y Hpτπ ^ώ 171 ι o πnf i nnal 1 a Hi p nl aACA 1 fhp m ral i nopn-f- 1714 and with bond wire connected to the multilayer PCB. an additional heatsmk . ∑. are ass mbl d on a multilayer PCB ( 178 ) . Under the power device ( 171 ) there are multiple These improved vias 175 are larger than traditional vias to accept the metal nscrt/slu 1 " 1 1 "7 14. Solder ^rovidcd during the manufacture of the PCB (178) flows around the insert/slug 1714 to bond the assembly together. Located dιrectl underneath the PCB is an insulated multilayer 10 substrate which aids in the transfer of heat from the PCB to the aluminum h° a tsmk. This substrate is of three different materials. The top layer is a thin copper foil (179) . A portion of this copper foil '179^ is soldered to the under side of the PCB ^1^8) m the location where the metal insert protrude through the PCB (178) . a small island in this location which is to be soldered to the metal the bottom of the PCB, it relies on pressure to provide the coupling for heat transfer. The middle l a er of the substrate (1^10) is a thermally 20 conducting material which electrically insulates the copper foil layer from the copper foil layer from the bottom aluminum plate (1711). The PCB along w th the substrate is then be mounted to an aluminum heatsmk (182A) . The method of operation for this system is to solder the power device __. -v to the top of the PCB above the soldered metal inserts. nG ueat generatcu. during electrical operation of the circuit is transmitted through the metal m σ er"* ~ s to the co r,Ω ^il Λ ^ ^ ^^^ ι ' , n^ Q n at . This island s iarcre compared to tne metal inserts to allow for greater thermal conductivity. The heat s s^reao out over a lar^ surface area through the insulation 30 material to the aluminum plate and to the heatsmk. The size of the o τ ^er foil la α r 1~^9 underneath the metal insert is tailored to control the capacitance between tne power device 171 and heat s kl712. Figure 19 is still another embodiment of the invention in which the In this embodiment, the metal mserts/slugsl94A are also unique that th y have a sm l1 throu g h hole 1^15 wh ch e tends rom its top to bottom. This allows for a good solder flow due to a capillary action when the insert s o i_Hαn H r^m a ^"^r^i ' "^ 7 " 1 ^f the underly ncr multilayer 40 substrate to the power device on top side of the PCB. The metal inserts/sl ^s 194A have diameter ^ c tc than the diameter of the via with ts walls coated with copper. This re q uires the metal insert 'sl ^ 194Λ to be *wcdgcd" into the via. The solder flows through the internal channel to connect the top of PCB 178 t° the ^o^t^ . The PCB along with the substrate is mounted to an aluminum baseplate electronically isolated from the baseplate by means of compressible +- V-i Ω τ~ττι The method of operation for this system is to solder the power device 10 heat generated during electrical operation of the circuit is transmitted resistivity of this junction. The heat is spread out over a large surface re 3 t ^ lir,r the sula^ ^ a t e ial to the aluminum plate and to the baseplate. aspect of this invention. A° w +- O e bo i t o f cr w 0 in 1 "l de σ the electrical components (171, 172 and 173) are assembled on a multilayer PCB (l^S) . In this embodiment the metal inserts (194A) have a small 20 through hole 174A which extends from its top to bottom. This allows for a a portion of the underlying multilayer substrate to the power device on the f nn ,-> -F j-Vι -» Dl~ > n M " 7 Q 1 The substrate is located directly underneath the PCB and its function This substrate is comprised of three different materials. The top layer is a thin co ιη βr foil 'l ' ^9' 1 . The PCB alon^ with the substrate s mounted to an aluminum heatsmk (182A) . 30 device to the top of the PBC, on top of the pressure fitted metal inserts transmitted through the metal inserts (194A) . The heat generated during inserts to the copper foil island underneath. This island is large ~* ^ compared 1,0 is me άi inserts so ϋ s no decr ase n mc uϋ rma-L resistivity of this iunction. The heat is spread out over a large surface baseplate . 40 slugs extend past the PCB and are used to secure the neatsmk to the PCB. In this 214C have a len g t sufficient to extend through the PCB and also through holes 216 of heat sink 1712. The P^B a σ sembl s G ιι ' r,+*ca ' -t~~ ^ ^ al i , baseplate ^1 ~ ^12^ , actmcr as a heatsmk, which has holes (216) to accompany the metal inserts (214C) . — A -n- rt H thermal transfer. Any conductive devices such as ferrite cores (173) or smaller electrical vias (175) may be thermoconductive material. Manufacture of this nHιτγi - τ_o + -Q solder the power device to the top of the PCB, on top of the pressure fitted metal inserts. The heat the metal inserts directly to the aluminum baseplate underneath. 2 +-,τ_ inser ' e 'l , ' " τ 1713 r ' ^ ■ - "' ^ ^ -..-.i-.*-^ , ,,,- ,, ^ exterior wall to allow liquid solder to flow therebetween to provide for bonding and also for Figure 22 illustrates an embodiment of the invention having enhanced In this embo iment, metal mserts/sluσs (214C) are elongated to pass of figure 21, the embodiment of figure 22 uses metal inserts/slugs 214C the cooling vane 182. Metal insert/slug 214C have a contoured exterior also for electrical conductivity. I n f 1 Cf e 2 3 1 c T M-o o -t- ΩH 4 ~ nΩ -p Ω T- n H Ω K H i . t O f t lΩVΘi- ' ' " iOn There is a multilayer PCB , which incorporates the winding of the magnetic The winding 2318 of the magnetic element 2316 are constructed in the multιla"er PCB 232. The high frequency switching electronic components 238, which is also located on the multilayer PCB 232. The interconnection between the components 238 shall be made to minimize the parasitic inductance and with IT-i im. 11T T_ i . 1 ^ 0 ^ an/—Ω τ_n n+- I AΠ The rest of the electronic components 236 of the electronic circuit layers and as a result is lower cost. In ficrure 24 tne crιt Ω ι a ooH -n ^^f e the hi^h frecruenc 17 swιtchm rf electronic components _S presented. The loop lpl, 244, and p2 2446, have f be the components 2438, 2436, 2440, 2442 have to be located as close as possible power PCB, 242 . The rest of the electronic components which are processmg lower frequency signals, such as C2 240, Lin 242, Lo 244 and Co2 264, can be In figure 25A is presented the magnetic element 2310, with the high w xc4U nv- ow LL-uxug υυlupju uLύ <_. w u αuu Luc xu ww-xxuc x wu αQS 2350. Tn mira nΩ o +- * " i "F +"Vτp pmK H mpn r o -f " +"Vττ o nafpnf referring to the method of attachment of attachment of the power PCB, 232, containing the magnetic element 16, and the mother PCB, 234. The power PCB 10 232 contains copper coated via 2524, which allow the penetration of the solder 2522B. The sol^e^ 2522B creates a medium for current flow and also constitutes a mechanical bind between power PCB 232, and the mother PCB 9'31 copper pad 254B on the bottom of power PCB, 232. The melted solder 2522B, x w" uuxxuy LUC xi cx xuy p Uv- S wxxx o iCQU In X CLWCCU __ W IJ QUU αuu wx x further penetrate through 2524, creating a mechanical bound, and a path for ^ ι r ^ ~ a n^ Hoa i M In figure 25C is presented another embodiment of the invention wherein the 232 and 234 is accomplished with the 20 p 2526C pressed in power PCB 232, and further soldered to 234. Tn fi mirp O ^ i f p a +- +- a r* Vimon + ■ pf ppn 000 anH 00/1 ι o aCCOIΪDll hPfi Wi h the use of a pressed insert 2530D, The pressed insert has to be made from a conductive t°rι^^ "*~^ /-.->~ -- α+ _ -ι π^^ ~ ^nl τr a bond but also a path for current and heat. -- xϋ iiyu e Δ.~ LJ J. μ cacϋicu QUULILCI euLuuu mciiU u J- UC iiveli iuli wherein the surface mounted pm 2510E is used as interconnection between 232 and 234. The surface mounted "ir. 2510E has to be electπcall" and thermally conductive to allow an efficient current and heat flow between 232 and 23 . 30 In figure 25F is presented another embodiment of the invention hp p 1 " 1- ι 3p hv t e r)r oec ϊe connectors 260F and 280F and a screw 282F. The pressed connector 260F is pressed fit m the moth α r PCB 234 and the pressed connector 280F is pressed fit in the power PCB 232. The screw 282F ensures a bond between 280F and "3 P i / .πr TIL.--. --, -— ,-.--,.--.-,,-. -«_ — -__ - _ ^ Λ _, ,_ ,j o n -, u -. - 1 -J _-. ,-. — τ rtΛ TTΛV ... WΛΛ^ j rtΛV _.j,.„ _„- ^ ._ 1 * _.υυι . c xcSocu xu cx _.υuι oaυuxu -'c αxou vcxγ yυuu for current and heat to create a very low electrical and thermal impedance ^ t between 232 and 234 In figure 26 is presenteα an embodiment of the invention wherein components 2612 =>τ~ i * -t-ow ^π^ - Λ Hn fnm side of the mother PCB. In this 40 way the power density of the power-processing device formed by the power M pr Dm rT ffr " v*o *rn on *— i r c i f - ττ nrr l f---r -n i /- Ωnf" H rest of the electronic components, can increased. In figure 2 "7 A an additional metal plate 2 26 is attached to the mother PCB 234, via a dielectric material 2724. In this way the heat can be extracted from the mother PCB to the metal plate 2^26 which acts as a heatsink. In figure 27B is presented another embodiment of the invention wherein a isolated metal substrate element composed by a metal plate 2734, a dielectric 2 "7 32 and copper foil 2 7 30, is attached to the mother PCB. Additional electric components 2728 can be attached to the copper pads, edged on the copper foil 2" 7 30. This packaging method allows the heat transfer from the power PCB 232, and mother PCB 234, to be transferred to the metal plate 2 "7 34. The location of additional components as 2 7 28, leads to an increased in power density. Figure 2 C presents an embodiment of the invention which the magnetic element 2316 is attached to an isolated metal substrate composed O T ci ul S ici. i-i. i- Lu Lci i αj. -> -. , Lu β x l x -. / 3 -. , αiid luc: i- ax pi α tc -. / -> -* . s cutout 2700 in the isolated metal substrate is performed to accommodate the magnetic core 2310. The interconnection between the isolated metal substrate and the magnetic element 2316 is made via the copper foil 2752 and via 2 7 24. In the soldering process, the melted solder penetrates through via 2724, creating an electrical and mechanical bind. The advantage of this embodiment is the fact that high power dissipating devices are located directly on the isolated metal substrate with very low thermal impedance to the metal plate 2 34. In figure 28, the magnetic core 2310 penetrates through, power PCB 232, and mother PCB, 234. In this way the windings 2318 created in the layers of the power PCB 232, and the windings 2819 created in the mother PCB 234, can be magnetically coupled . In this way it is increased the level of utilization of the mother PCB 234. In figure 29 there a re tv» τ o ^o er PCB linked magneticallv through core 2310 with the mother PCB 234. This symmetrical structure can offer some advantages such as interleaving the primary and secondary winding of the magnetic structure using the magnetic core 2310. In figure 30 there are high frequency switching electronic components located on both power PCB. As an application the primary winding of the mother PCB 234, the secondary winding can be implemented in the power PCB 232 and 232B and the additional high frequency switching electronic components such as rectifiers means can be surface mounted on 232 and 232B. In figure 31 an additional metal plate 316 is attached to at he power PCB 232, via a dielectric material 314. The heat produced by the magnetic element 2316, with winding 2318 and magnetic core 2310, and by the high frequency switching electronic components 238 can be transferred to 316 and further transferred to air or additional heatsmk. In figure 32 is presented similar concept as in figure 31, wherein some of the high frequency switching electronic components is located under the metal plate 316B. The metal plate 316B, has cavities to accommodate ^ R -Lie v * -..w^rlur—j -.u.,u-icii uo ~ - 9. -0I 0UΛ7V i T Q ^u«c«u^ L Λ -i-ϋ, 4-w~_ j r O x= tϋc: y p .u-..W.»t'r- x■— π r /T * J->> - 9. -»-9. In figure 33 the high power dissipation electronic components 330, are located on an alumina substrate 332. The interconnection between the alumina substrate 332 and the power PCB 232 is provided by the pins 338. In between the magnetic core 2310 and the metal plate 336 there is a 0 thermally conductive compressible pad 334. The module created by the power PCB with the high frequency switching electronic components 238, 330 the metal plate 336 is attached to the mother PCB 232. The advantage of this concept is the fact that it offers a good thermal path from the high heat dissipation components to a metal plate heatsmk 336. 5 In figure 34 the high heat dissipation components as 340, are located on top of a heat conductive insert 344. The insert is further penetrating into a coρρer interface 342. Farth r ^~h copper interface 342 is soldered to the copper foil 341 located on the dielectric 346, attached to a metal plate 348. 0 The mechanical structure formed by 344, 342, 341 can efficiently extract the heat from the device 340 to the metal plate 348. This mechanical structure can also efficiently be a path for the current flow. The power processing module formed by power PCB 234, high frequency switching electronic components such as 238 and 340, the thermal interface 344, 342, 5 341, dielectric layer 34C and the metal plate 348, can be farther connected to the mother PCB 232 T n f ι ffiirp 0 ^ nnp o on -t- pH a ,— n.n /— o r- Vr p T-Ω T n rnn l f i n! o Aup T- i * ~'T-, o 232A...232Z are employed. Each power PCB contains at least one magnetic o 1 prη n +- a H f-Vi o /-τ n ci n f p i cr -r n n /- /-> m on r o Φ r p npc +- 0 of the electronic components, such as the signal control portion are located on the mother PCB 234. Cooling plates 316A... 316Z can be further attached to the power PCB for cooling. In this embodiment, the high frequency switching electronic components and high heat dissipation components are located on the power PCB, separated from the rest of 5 electronic components located on mother PCB, 234. In this concept the high power dissipation components, which most of the power converters are also high frequency switching electronic components, are separated by the noise and heat sensitive components located on the mother PCB. The size of high cost, large number of layers power PCB is reduced, 0 leading to a low cost design. The high frequency switching high power dissipation electronic components are separated by the rest of the components leading to improve electrical-thermal characteristics. This 1 1 o packaging concept offers also increased flexibility. The number of power PCB, which includes magnetic elements and high frequency switching electronic components, can increase to increase the output power. These power-processing cells can be standardized to constitute the building blocks for any power systems. It is clear from the foregoing that the present invention creates a highly improved transformer package which provides for the enhanced provision of power with the burden properly split between the transformers.

Claims: What is Claimed is. 1. A package for electrical components, comprising: a multilayer circuit ^ d havincj a o*"* side and α bottom side and inner layers windings of a magnetic element embedded n said multilayer circuit board; a * iiLαyliC LXw I C cuc L X α L uy LUX W V-JU oαxu UILX X L χ χ α._y x . X X <W U.X L uuαi u ul u uyii said windings; power dissipating components placed on a first thermally fin p ι 7g a H +- n +- o a τ_ H J T, rj ' ' f ]_ a upr- * _£"''" " , l " τ/- r-H an H connected to copper coated via which penetrate said multilayer circuit board to = n o ρosιnj side of °aιd rvltila^er circuit board to a second 10 thermally conductive pad, a metal plate, an elevated section of metal σ3 id multιla er circuit board throuoh a thermally conductive insulated material, said elevated section of metal plate placed under said first thermally conductive pad, and thermally conductive compressible pad positioned between said magnetic core and said . » lev u d sec ion ox uax px . 2 The package of claim 1, wherein the said bottom side multilayers circuit board is attached to a metal plate through a thermally conductive insulated matenal, said metal plate having cutouts to accommodate said magnetic core which will penetrate through said cutouts and cutouts to accommodate the said electronic 20 components placed on said bottom of the multilayers circuit board 3 The package of claim 1, v, herein the said bottom side of the said multilayers circuit board is attached to a metal plate through a thermally conductive insulated matenal, said metal plate having cavities to accommodate said magnetic core which will penetrate into said cavities, a thermally magnetic conductive 25 compressible pad in between said magnetic cores and the bottom of said cavities and cavities to accommodate the said electronic components placed on the bottom of the multilayers circuit board 30 4 The package of claim 1, further including devices placed on said top side and thermall communicating with said second thermally conductive pad using a second copper coated via 5 Λ transformer flux equalizer circuit comprising a) a first flux winding positioned to have an electncal flow induced therein when electncal energy flows 35 through a first transformer, and, b) a second flux winding positioned to have an electπcal flow induced therein when electncal energy flows through a second transformer, said second flux winding connected in a closed loop with said first flux winding 6 The circuit according to claim 5 a) wherein said first flux winding is positioned to have electπcal flow induced therein when electπcal energy flows through a secondary winding of said first transformer, and, b) wherein said second flux winding is positioned to have electncal flow induced therein when electπcal 5 energy flows through a secondary winding of said second transformer 7 The transformer group according to claim 5, a) wherein said first flux winding is positioned to have electπcal flow induced therein when electπcal energy flows through a pπmary winding of said first transformer, and, 10 b) wherein said second flax winding is positioned to have electπcal flow induced therein when electπcal energy flows through a pπmary winding of said second transformer 8 Λ thermal via assembly for a pnmary electronic board compπsing a) a via extending through said pπmary electronic board, walls of said via coated with copper, 15 b) a heat conductive plug extending through said via, and, c) solder connecting said heat conductive plug to the walls of said via 9 The thermal via assembly according to claim 8, wherein said heat conductive plug has a thermal conductance at least twenty five percent greater than solder 20 10 The thermal via assembly according to claim 8, wherein said heat conductive plug is substantially pure copper 1 1 The thermal via assembly according to claim 8, further including a secondary electronic board, and 25 wherein said secondary electronic board is secured to the pπmary board bv said solder 12 The thermal via assembly according to claim 10, a) further including a secondary electronic board having a via therein, the via of said secondary electronic board aligned with the via of said pπmary electronic board, and, T Π b) wherein said heat conductive plug extends through the via of said secondary electronic board 13 The thermal via assembly according to claim 10, a) further including a heat sink having a via therein, the via of said heat sink aligned with the via of said pπmary electronic board, and, b) wherein said heat conductive plug extends through the via of said heat Sink 14 The thermal via assembly according to claim 13, herein said heat sink and said heat conductive plug are adapted to conduct electπcal energy concert 15. The thermal via assembly according to claim 10, wherein said heat conductive plug has a diameter less than a diameter of said via with said walls coated with copper. 16. The thermal via assembly according to claim 10, wherein said heat conductive plug has a diameter slightly greater than a diameter of said via with said walls coated with copper. 17. The thermal via assembly according to claim 16, wherein an outer surface of said heat conductive plug is grooved to allow said solder, when in a liquid state, to pass through said grooves. 18. The via assembly according to claim 10, wherein said heat conductive plug has an internal channel extending through said copper plug, said internal channel having sufficient diameter to allow solder in a liquid state to flow therethrough. 19. Λn electronic assembly comprising: a) an electronic board having an opening therein, said electronic board further including two pad positioned on a first surface of said electronic board proximate to said opening; b) a multilayer circuit board having secured thereto a transformer, said multilayer circuit board positioned such that a portion of a first surface of said multilayer circuit board engages the first surface of said electronic board such that a portion of a core of said transformer extends into the opening of said electronic board, said multilayer circuit board having at least two channels therethrough, each of said channels aligned with one of said at least two pads of said electronic board; and, c) solder extending through said at least two channels in said multilayer circuit board, said solder bonded to the channel and to an associated pad on said electronic board. 20.The electronic assembly according to claim 19, further including at least one electronic component secured to an opposing second surface of said multilayer circuit board. 21. The electronic assembly according to claim 20, further including at least one electronic component secured to the first surface of said multilayer circuit board and enclosed within said opening in said electronic board. 22. The electronic assembly according to claim 21, wherein, during operation of said electronic assembly, electrical current passes through said solder extending through said at least two channels in said multilayer circuit board. 23. The electronic assembly according to claim 22, a) wherein said multilayer circuit board includes at least two aligning pins; and, b) wherein said electronic board includes at least two alignment holes adapted to receive said at least two aligning pins of said multilayer circuit board. 24. The electronic assembly according to claim 23, wherein said at least two aligning pins are not bonded with the at least two alignment holes of said electronic board. 25. The electronic assembly according to claim 19, further including high frequency switching electronic components located on said multilayer circuit board, said high frequency switching electronic components feeding a primary and secondary high frequency loops of said transformer.

Inventors: JITARU IONEL, JITARU, IONEL
Applicants: ROMPOWER INC, ROMPOWER INC.
Application year: 1999
Main classification: H01L
IPC codes: H01F27, H05K1, H05K7