METHOD FOR IMPROVING THE MACRO THROWING POWER FOR NICKEL AND CHLORIDE ZINC ELECTROPLATING BATHS

Abstract: An aqueous acid plating bath for the electro-deposition of a nickel, zinc or zinc alloy deposit on a substrate which includes zinc or nickel ions and an additive of general formula (I) wherein R1 and R2 are selected from the following functional groups hydroxyl, carbonyl, carboxylic acid or its salt; R3 is selected from the following groups hydrogen, hydroxyl, carbonyl, carboxylic acid or its salts; R4 and R5 are electron withdrawing groups, such as but not totally inclusive, halides, sulfonic acid or its salts, triflouromethyl, cyano, and amino groups.

Description: METHOD FOR IMPROVING THE MACRO THROWING POWER FOR NICKEL AND CHLORIDE ZINC ELECTROPLATING BATHS Field of the Invention The present invention relates to aqueous acid zinc electroplating solutions and a method for electroplating zinc coatings. More particularly, this invention relates to an acid zinc electroplating solution including a unique additive which increases macro throwing power. Similarly, the present invention relates to nickel electrodeposition processes. Background of the Invention Considerable attention has been directed to providing improved corrosion protection to metallic surfaces. One way of providing corrosion protection is by electro-depositing a zinc or zinc alloy coating on the surface. Similarly, nickel electroplating has become an important commercial practice. The term "alloy" is used in the specification and claims as defined as a mixture of two or more metallic elements which may be microscopically homogenous or microscopically heterogenous. For decades, electroplated zinc has been used to provide economical, highly corrosion resistant coatings. Traditionally, cyanide has formed a primary component of zinc plating baths. However, in light of the hazardous nature of cyanide, activity in the plating area has been concentrated on the development of cyanide- free alkaline baths or acid baths. One approach has involved the utilization of alkaline solutions containing the alkali metal pyrophosphates in combination with complex zinc compounds. The use of such phosphates, however, has created disposal problems since these phosphate compositions are difficult to remove from aqueous wastes, particularly when they are present in the concentrations required to achieve commercially satisfactory plating processes. Furthermore, electroplating zinc processes employing pyrophosphate baths can result in relatively poor low current density coverage, roughness, insufficient brightness and non-uniform deposits. Typically, acid zinc plating baths are based on a suitable inorganic zinc salt such as zinc chloride or zinc sulfate, and the baths usually include buffers such as ammonium salts or boric acid. Additives are often included in the baths to promote and improve ductility, brightness, throwing power and covering power. Surface active agents may also be included to improve crystal structure, reduce pitting, and increase the effectiveness of other additives. Additives can be generally characterized as falling into three general categories which can be identified as primary type additives or carriers, secondary type additives or brighteners and auxiliary additives. The primary type additives are present in the bath in higher concentrations than the secondary type auxiliary additives and generally function to provide grain refining and throwing power. Certain of these primary type additives also have hydrotropic properties which function to keep the secondary type additives or brighteners in solution. The secondary type additives generally function in the bath to provide luster or brightness to the deposit. In some instances, secondary additives also provide improved throwing power. The auxiliary additives, among other things, are intended to widen the brightness range and may also assist in solubiiizing the secondary additives. It will, of course, be appreciated that individual additives may, to a greater or lesser extent, function in more than one of the above-described capacities, particularly if used in excess quantities. A variety of exemplary additives for acid zinc plating baths have been identified in the patent literature. For example, U.S. Patent 4,075,066 discloses that bright, level and ductile zinc deposits can be obtained in baths which are free of ammonia or amines by including at least one polyoxy alkylated napthol, at least one aromatic carboxylic acid or soluble salt thereof and at least one ionic aromatic sulfonic acid or soluble salt thereof. U.S. Patent 4,076,600 discloses that bright and level zinc electro-deposits can be obtained from aqueous acid plating baths wherein the bath contains a phosphorous cation delivered on a particular hydrocarbon molecule. U.S. Patent 4,089,755 teaches that bright, fine grain zinc deposits over a broad current density range can be produced in an aqueous bath by including a primary additive or carrier component which comprises a cationic quaternary ammonium surfactant. U.S. Patent 4,162,947 discloses an acid zinc plating bath and a method of obtaining bright and level zinc electro-deposits over a wide current density range by including at least one aromatic sulfonic acid or salt U.S. Patent 4,405,413 discloses an acid zinc plating bath which will give a deposit having decreased susceptibility to blush achieved by including a surfactant comprised of a blend of at least two carboxy- terminated long chain alkyl phenols. U.S. Patent 4,422,908 is directed to an aqueous zinc electroplating bath wherein an organic salt of an alkaline metal and inorganic acid complexing agent selected from a group consisting of benzoic acid, cenamic acid, nicotinic acid and 2-furylacrylic acid are added to the bath. U.S. Patent 4,425,198 is directed to a zinc alloy electroplating bath incorporating zinc and nickel and/or cobalt ions in a brightening agent, the brightening agent being selected from the group consisting of homopolymer of acrylamide, a homopolymer of an N-substituted acrylamide and a copolymer of an acrylamide and an N-substituted acrylamide and/or a solubiiizing agent selected from a group consisting of methacrylic acid, acrylic acid, acrylonitrile, methacrylonitrile, vinyl C C 5 alkyl esters, vinyl halide, epihalohydrin, vinyiidine halide, alkylene oxide and mixtures thereof. U.S. Patent 4, 496,439 is directed to an aqueous acid plating bath for the electrolytic deposition of zinc which contains conductive salts, brighteners, and surfactants U.S. Patent 4,512,856 is directed to an aqueous acid zinc plating solution for electro-deposition of zinc coatings utilizing a grain refining agent comprising a non-surfactant substitute polyhydric alcohol having three or more ethoxylated and/or propoxylated hydroxyl groups. U.S. Patent 5,200,057 is directed to an additive composition for a zinc plating bath, the additive composition comprising a mixture of poly (N- vinyl-2-pyrolidone) and at least one sulfur containing compound. It is well known that bright and lustrous metallic zinc deposits can be electroplated on a metallic substrate from aqueous acid zinc plating solutions or baths. However, difficulties persist in commercially producing uniform and reliable zinc coatings of sufficiently high levels of brightness and luster, and most particularly, uniform thickness. Moreover, without an additive to increase macro throwing power, the zinc coatings produced by conventional baths may not exhibit uniformly smooth and refined surfaces over the full range of current densities normally encountered in commercial applications. Notwithstanding all of their previously developed additives which improve the qualities of coatings produced by an acid zinc electroplating bath, the macro throwing power of a mildly acidic bath has typically been unsatisfactory for parts having complex shapes. Accordingly, it is desirable in this art to develop an additive for an acid zinc chloride plating bath that will achieve improved macro throwing power. Similarly, nickel plating faces many of the same challenges, and the present invention is advantageous in nickel electrodeposition or a nickel plating bath. Summary of the Invention Accordingly it is a primary advantage of this invention to provide a new and improved additive for a nickel, or acid zinc chloride plating bath. It is a further object of this invention to provide a new and improved additive for a nickel or acid zinc chloride plating bath which improves the macro throwing power of the bath. Additional objects and advantages of the invention will be set forth in part in the description which follows and in part will be obvious from the description or may be learned by practice of the invention. The objects and advantages of the invention may be realized and attained by means of the instrumentalities and combinations particularly pointed out in the appended claims. To achieve the foregoing objects, and in accordance with the purpose of the invention, as embodied and broadly described herein, the additive is in the form of an aromatic hydrocarbon including carboxyl or hydroxl groups in an ortho position. Preferably, the additive of the present invention is characterized by the following general formula: wherein F^ and R 2 are selected from the following functional groups hydroxyl, carbonyl, carboxylic acid or its salt; R 3 is selected from the following groups hydrogen, hydroxyl, carbonyl, carboxylic acid or its salts; R 4 and Rg are electron withdrawing groups, such as but not limited to halides, sulfonic acid or its salts, triflouromethyl, cyano, and amino groups. Detailed Description of the Invention The aqueous acid zinc plating baths to which the present inventive additive is suitable include conventional zinc and ammonium or boric acid containing plating baths known to those skilled in the art. Such baths contain free zinc ions. Typically, zinc sulfate, zinc chloride, zinc floroborate and/or zinc sulfamate will provide the source of the zinc ions. The electroplating baths may be employed in all types of industrial zinc plating processes such rack plating baths, high speed plating baths for strip or wire plating, and barrel plating. Zinc plating baths typically also contain an ammonium compound in the form of ammonium chloride, ammonium fluoride or ammonium sulfate. Other conducting salts may also be used. Examples of conductive salts utilized in the acid zinc plating baths of the invention include sodium chloride, sodium borate and potassium chloride, sodium sulfate, potassium sulfate, ammonium chloride or sulfate, sodium, potassium or ammonium fluoroborate, sodium potassium or ammonium sulfate, magnesium sulfate, or mixtures thereof. Boric acid may alternatively be included in the zinc plating bath of the invention as a weak buffer to control the pH. The boric acid also is helpful in smoothing the deposit. The concentration of boric acid in the bath is not critical and generally will be in the range of up to about 40 grams per liter. The acidity of the acid baths of the invention may vary from a pH of about 1.5 to about 6 or 7. The pH may be lowered by the addition of acid solutions such as dilute hydrochloric or sulfuric acid solutions. If the pH falls below the desired operating range it can be increased by the addition of ammonium hydroxide or potassium hydroxide. Preferably the acid zinc baths are operated at a pH of from about 4 to about 6.5. The inorganic salts of zinc may be present in the plating baths of the invention in amounts ranging from about 10 to 150 grams per liter preferably, 30 to 110. The conductive salts such as ammonium or potassium chloride are present in amounts ranging from about 50 to 250 grams per liter or more. Of course, the bath may also include any desirable additional additives as are conventional including brighteners, wetting agents, etc. The acid zinc electroplating baths may be used to produce bright zinc deposits on all types of metals and alloys, for example, iron, copper and brass. Generally, other substances which have been found to exhibit secondary brightening action can be utilized including surfactants or wetting agents such as known materials like polyvinyl alcohol, gelatin, carboxymethyl cellulose, non-ionic polymerics and heterocyclic quaternaries and the like. If desired, chelating agents can be included such as, for example, citric acid and maleic acid to prevent the precipitation of zinc compounds either in the body of the plating bath or on the surfaces of the anode or cathode. These chelating agents also serve to provide buffering action in the bath. Organic brighteners may include acetothionapthene, fluorolacetone, benzalacetone, benzophenone, benzoacetonithle, and orthochlorobenzaldehyde. Alternative brightening agents of the types typically employed in zinc alloy plating solutions include aromatic aldehydes or ketones, nicotinate quaternaries, polyepichloralhydrin quanternaries with amines, polyethylene amines and their derivatives, thioureas or N substituted derivatives thereof. In addition, aluminum ion can be introduced into the bath by an aqueous soluble salt thereof such as aluminum sulfate, to obtain and enhance brightening effect. Similarly, corrosion resistance can be enhanced by the addition of small amounts of trace metals which will co-deposit with the zinc alloy. For example, soluble salts of chromium, tin or indium may be added to the baths. It will be appreciated that the operating conditions, such as temperature and current density under which the plating baths of this invention are employed, may vary depending on the particular bath composition on the nature of the metal surface to be plated. The zinc electroplating process may be carried out at temperatures of about 10°C to 50°C and preferably between 15°C to 35°C, either with or without agitation. If necessary, agitation of the plating bath can be provided either by mechanical movement or the article being plated by solution agitation during the electro-deposition. In a particularly preferred form, the present invention includes an additive of the following general formula: wherein R, and R 2 are selected from the following functional groups hydroxyl, carbonyl, carboxylic acid or its salt; R 3 is selected from the following groups hydrogen, hydroxyl, carbonyl, carboxylic acid or its salts; R 4 and R 5 are electron withdrawing groups, such as but not totally inclusive, halides, sulfonic acid or its salts, triflouromethyl, cyano, and amino groups. In a particularly preferred form of the invention, the additive will comprise dodecyl (sulfophenoxy) benzene sulfonic acid disodium salt or 4,5- dihydroxy-1 , 3-benzene disulfonate disodium salt. An important attribute of the present invention includes the adjacent positioning of the hydroxy or carboxylic acid groups on the benzene ring. Without being bound by theory, it is believed the inventive compounds may function to slow the deposition of zinc in the high current density areas, leading to a more uniform coating. This strategy is divergent from traditional practice wherein compounds such as pyrolidones have been used which are believed to absorb to the part in the high current density areas to slow the coating process in that region. The following examples illustrate the inventive additives of the invention. Examples Various additives for improving the throwing power of an acid- zinc chloride plating bath, was added to a plating bath with the composition given in the following table. The starter and brightener are commercially available from Pavco, Inc. of Cleveland, Ohio. All plating was performed at 23 to 27°C, and unless otherwise stated, the pH of the plating bath was 5.7-5.9. Plating evaluations were conducted in a 267 ml Hull cell panel with a zinc anode and a steel cathode. The Hull cell panels were pickled in 50% hydrochloric acid just prior to plating. During plating, the cell current was controlled at one ampere for fifteen minutes or at two amperes for five minutes. Thickness measurements were made using a CMI International Corp., Model EMX-D thickness tester equipped with an eddy current probe. Thickness readings were made at a high-current density (HCD) and a low- current density (LCD) regions of the Hull cell panel. The LCD and HCD regions of a one-ampere panel correspond to a current density of 0.3-0.4 and 3-4 amperes/square decimeter, respectively, while the LCD and HCD regions of a two ampere panel correspond to a current density of 0.6-0.8 and 6-9 amperes/square decuneterm respectively. At each current density, 6-10 individual thickness measurements were made and then averaged. The throwing power of the plating bath was determined from the ratio of the HCD/LCD thickness reading, and the effect of the additive can be determined by comparing the HCD/LCD ratios of panels prepared from the various additive baths to the HCD/LCD ratio of control baths. The various additives, plating conditions, and corresponding throwing power are listed in the following table. Chemical Class or Compound Manufacturer Compound Trade Concentration pH 5 minutes @ 2A 15 minutes @ 1A Name in Ptabng of Plating Bath(gΛ) Bath HCD LCD HCD HCD LCD HCO/LCO LCD Quatemized Vinybyrroidone ISP Technobgies, Inc Galquat 734 042 014 30 057 018 32 Dimethylaminoethyl Methacryletθ Copolymer 04 040 014 29 051 016 32 20 034 013 26 041 013 32 40 028 012 23 039 016 24 Quatemized Vinybyrroidone ISP Technobgies, Inc Gafquβt 755 043 014 31 065 019 34 Dimethylaminoethyl Methacrylate Copobmer 04 042 015 28 058 017 34 20 038 013 29 047 016 29 40 037 012 31 048 016 30 Quatemized Vinybyrroidone ISP Technobgies, Inc Gafquat 755N 042 013 32 055 016 34 Dimethteminoethyl Methacrylate Copolymer 04 041 015 27 055 016 34 20 038 012 32 051 016 32 40 035 012 2 9 046 014 33 Vinybyrroidone ISP Technobgies Inc Gafquat HS-100 040 015 27 055 015 37 Methacrytemidopropyl Tn ethylammonium Chbnde Copolymer 04 039 014 28 052 016 33 20 039 013 30 051 015 34 40 035 012 29 045 015 30 Polyethyteneimine BASF LugakranG20 039 009 43 057 016 36 031 008 39 047 011 43 027 007 39 040 011 36 10 026 0C 33 039 014 28 Pofyethybneimine BASF LugakranG35 040 012 33 057 015 38 031 011 28 042 012 35 028 011 2.5 037 016 23 025 011 23 038 013 As can be noted, several of the bidendate chelate compounds provide evidence of increased throwing power as the ratio HCD to LCD is significantly reduced. Similar to zinc electroplating processes, nickel is one of the most important metals applied by electrodeposition. Typically, nickel plate is applied as a coating underneath a thinner chromium electroplate to provide a highly lustrious and corrosion protective finish for articles of steel, brass, zinc chemically metalized plastics, aluminum and magnesium alloys. Historically, the Watts bath process is used for conducting nickel electrodeposition. Typically, the Watts bath includes nickel sulfate, nickel chloride and boric acid. Most of the nickel ion content is contributed by nickel sulfate. The principle function of the chloride ion is to improve anode disolution by reducing polarization and to increase the conductivity in the bath. Boric acid is provided to serve as a weak buffer to control the pH. It has been found that the present inventive additive is beneficial in increasing the throwing power in a nickel bath. A more extensive discussion setting forth the basics for nickel electroplating to which the present invention is suited, can be found in Modern Electroplating. Third Edition, Chapter 12, published by John Wiley and Sons, Inc. Thus, it is apparent that there has been provided in accordance with the invention, an acid zinc chloride plating bath that fully satisfies the objects, aims and advantages set forth above. While the invention has been described in conjunction with specific embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations which fall within the spirit and scope of the appended claims.

Claims: In the Claims 1. An aqueous acid plating bath for the electro-deposition of a nickel, zinc or zinc alloy deposit on a substrate which includes; i) zinc or nickel ions; and ii) an additive of the general formula: wherein R 1 and R 2 are selected from the following functional groups hydroxyl, carbonyl, carboxylic acid or its salt; R 3 is selected from the following groups hydrogen, hydroxyl, carbonyl, carboxylic acid or its salts; R 4 and R s are electron withdrawing groups, such as but not totally inclusive, halides, sulfonic acid or its salts, triflouromethyl, cyano, and amino groups. 2. The bath of claim 1 wherein R, and R 2 are each hydroxyl. 3. The bath of claim 1 wherein at least one of R 4 and R 5 is a sodium sulfonate. 4. The bath of claim 1 wherein R 3 is hydrogen. 5. The bath of claim 1 wherein said additive comprises 4, 5-dihydroxy-1 , 3-benzene disulfonate, disodium salt. 6. The bath of claim 1 wherein said additive comprises 4, -dihydroxy-1 , 3-benzene disulfonic acid, disodium salt monohydrate. 7. The bath of claim 1 further including a brightener. 8. The bath of claim 1 further including a starter. 9. The bath of claim 1 further including ammonium chloride. 10. An aqueous acid plating bath for the electro-deposition of a nickel, zinc or zinc alloy deposit on a substrate which includes; i) zinc nickel ions; and ii) a salt of poiyhydroxybenzene containing at least two hydroxy groups in ortho position. 11. An aqueous acid plating bath for the electro-deposition of a nickel, zinc or zinc alloy on a substrate which includes: i) zinc nicekl ions; and ii) a bidentate chelate forming a tetrahedral complex with zinc at a pH below 7. 12. The plating bath of claim 11 wherein said hydrocarbon compound is methionine. 13. The plating bath of claim 11 wherein said additive comprises 4,5-dihydroxy-1 , 3-benzene disulfonate, disodium salt. 14. The bath of claim 11 wherein said additive comprises 4,5-dihydroxy-1 , 3-benzene disulfonic acid, disodium salt monohydrate. 15. A process of coating a metal article comprising immersing said metal article in a bath comprising zinc or nickel ions and an additive of the general formula: wherein R and R 2 are selected from the following functional groups hydroxyl, carbonyl, carboxylic acid or its salt; R 3 is selected from the following groups hydrogen, hydroxyl, carbonyl, carboxylic acid or its salts; R 4 and R 5 are electron withdrawing groups, such as but not totally inclusive, halides, sulfonic acid or its salts, triflouromethyl, cyano, and amino groups. 16. The process of claim 15 wherein R 1 and R 2 are each hydroxyl. 17. The process of claim 15 wherein said additive further includes a sodium sulfonate group. 18. The process of claim 15 wherein said additive comprises 4,5-dihydroxy-1 , 3-benzene disulfonate, disodium salt. 19. The process of claim 15 wherein said additive comprises 4,5-dihydroxy-l , 4-benzene disulfonic acid, disodium salt monohydrate. 20. The process of claim 1 further including a starter. 21. An aqueous acid plating bath for the electro-deposition of nickel, zinc or zinc alloy which includes zinc or nickel ions and an aromatic hydrocarbon including carboxyl or hydroxyl groups in an ortho position.

Inventors: DIADDARIO LEONARD L JR, DIADDARIO, LEONARD, L., JR.
Applicants: DIADDARIO LEONARD L JR, PAVCO INC, DIADDARIO, LEONARD, L., JR., PAVCO, INC.
Application year: 1999
Main classification: C25D3
IPC codes: C25D3