Liquid injection molding silicone elastomers having primerless adhesion

Abstract: The compression set of elastomeric silicone compositions, addition cured injection moldable compositions, is reduced by the incorporation of nitrogen compounds wherein the nitrogen possesses at least one organic substituent and the nitrogen is tetravalent wherein the nitrogen is cationic. The adhesion of such compositions to thermoset or thermoplastic polymer substrates is improved by the addition of bis(trimethoxysilylpropyl)fumarate and a disilanol that may or may not contain alkenyl groups. The lubricity of such compositions is improved by the addition of compounds selected from the group consisting of diorganosiloxanes such as polydimethylsiloxanes, phenyl containing siloxanes such as copolymers of diphenylsiloxane with diorganosiloxanes and copolymers of methylphenylsiloxane with diorganosiloxanes, fluorosilicones such as silicones containing trifluoropropyl substituted siloxanes, polydimethylsiloxanes, aliphatic and aromatic hydrocarbons that are liquid between 0 °C and 100 °C without adversely affecting the adhesion of the composition.

Description: The present invention relates both to a process for improving the compression set of cured silicone elastomers and to curable (and cured) translucent, high strength, organopolysiloxane liquid injection molding compositions useful to produce cured silicone rubber articles that exhibit the property of an improved compression set by reason of the addition of a salt of a nitrogen containing organic cation. Liquid injection moldable organopolysiloxane compositions are known and used. A problem with all such compositions is that the hardness, tensile strength, elongation, tear and cure rates are so interdependent among themselves and also with the viscosity of the uncured liquid precursor that it is difficult to improve one property without deleterious effects on the other properties. Additionally, the kinetics and thermochemistry of the liquid injection molding process and the compositions used therewith have been such that only small lightweight articles of manufacture could be made by the techniques of liquid injection molding because of the speed with which the liquid precursor cures once it has been injected into the mold. Liquid injection molding organopolysiloxane compositions are typically provided as two components that are mixed immediately prior to use. Both components contain alkenyl polymers, fillers, and in some cases resins. The first component contains a platinum catalyst while the second component contains a hydride crosslinker and cure inhibitors. The two components are mixed immediately prior to use in the injection molding apparatus. In addition to providing a so-called formulation pot-life, the inhibitor must prevent curing of the curable composition until the mold is completely filled. Once the mold is completely filled the inhibitor must then allow for a rapid cure of the curable or polymerizable composition in order to ensure a short cycle life. U. S. Patents 3,884,866 and 3,957,713 describe high strength addition cured compositions suitable for low pressure liquid injection molding. These compositions comprise a first component containing a high viscosity vinyl end-stopped organopolysiloxane, a low viscosity vinyl containing organopolysiloxane, filler, and platinum catalyst which is cured by mixing with a second component containing a hydrogen silicone composition. This composition has a low durometer, ca 20-35 Shore A, and moreover it is difficult to increase the durometer or hardness without adversely affecting other properties. U.S. patent number 4,162,243 discloses compositions similar to the previously referenced compositions but they contain as the most important distinction, fumed silica that has been treated with tetramethyldivinyldisilazane in addition to hexamethyldisilazane (disclosed in the '866 patent). The compositions of the '243 patent cure to elastomers having high hardness with good retention of other properties including strength, elongation, and tear in addition to having a low viscosity in the uncured state. U.S. patent 4,427,801 extends the teaching of the '243 patent by incorporating a MM vi Q resin in addition to the vinyl containing treated fumed silica. This produces elastomers having even a higher hardness and tear strength but has the disadvantage of higher compression set and lower Bashore resilience. Recently, U.S. patent 5,674,966 has further improved upon the MM vi Q resin technology by incorporating a high alkenyl content silicone resin selected from the group of resins having the formula: M y M vi z D a D vi b T c T vi d Q and M y M vi z D a D vi b T c T vi d ; preferably described by the formula: M vi x Q resulting in cured rubbers having a faster cure rate, high durometer, high resiliency, better compression set, and improved heat age stability. The manufacturing technique of liquid injection molding typically has been limited to small parts, usually materials weighing less than from about 5 to about 50 grams. Advances in technology are allowing liquid injection molded parts to become larger. Larger parts require larger molds. Larger molds require more time to fill the mold with resin and thus curing must be inhibited for longer times in order to allow the mold to fill before cure may be initiated. Silicone liquid injection molding materials are pumpable blends of silicone oligomers and polymers typically possessing a viscosity ranging from 200,000 to 3,500,000 mPa.s (centipoise) (cps) at 25 °C. As presently utilized, these materials consist of two components that are mixed in a 1:1 ratio which when catalyzed will cure (or cross-link) to a rubber or elastomer upon heating. The first or "A" component typically contains siloxane polymers, fillers, various additives, and catalyst. The second or "B" component typically also contains siloxane polymers, additives, and fillers but also contains hydrogen siloxanes and cure inhibitors. The physical properties of both the cured and uncured materials depends in a very large degree upon the compositions utilized to generate the "A" and "B" components. Typical liquid injection molding compositions consisting of the "A" and "B" components together generally are made up of the following ingredients: 1) from 50 to 75 parts by weight of a vinyl stopped polydimethylsiloxane having a viscosity ranging anywhere from 10,000 to 100,000 mPa.s (centipoise) and a vinyl content of ranging from approximately 0.05 to 0.15 weight per cent; 2) up to 10 parts by weight of a low molecular weight vinyl stopped vinyl on chain polyorganosiloxane having a viscosity ranging from 200 to 1500 mPa.s (centipoise) and a vinyl content of approximately 1.5 weight per cent; 3) up to 10 parts by weight of a low molecular weight mono-vinyl stopped polyorganosiloxane having a viscosity ranging anywhere from 500 to 2,000 mPa.s (centipoise); 4) from 20 to 30 parts by weight of a fumed or pyrogenic silica having a surface area ranging from 150 to 450 m 2 /gm; 5) from 2 to 50 wppm of Pt hydrosilylation catalyst; 6) from 0.01 to 0.50 parts by weight of an inhibitor compound; and 7) from 100 to 1,000 wppm of silyl hydrides. Additional components may include extending fillers, coloring agents, additives to impart increased performance with respect to certain physical properties such as oil resistance, heat aging, ultra-violet stability and the like. One particularly desirable attribute of a cured liquid injection molded material is a cured rubber having a high durometer. To obtain a high durometer rubber, one typical solution to this problem is to add a large amount of a filler anywhere from 25 to 70% by weight of the final cured rubber or elastomer. Use of large quantities of filler in a moderately viscous fluid such as the polymers used to prepare the precursor mixtures results in a fluid having high levels of suspended solids that significantly increase the viscosity of the mixture. Fumed silica is routinely used as a reinforcing filler to achieve high durometer in the cured rubber, however, at weight percent levels above 25 weight percent fumed silica, the liquid injection molding compositions become un-pumpable, defeating the purpose of liquid injection molding. Consequently, extending fillers are added and these usually impart color to the finished product. While this is not an undesirable result for many applications, it is occasionally a drawback. Another approach to achieving a high durometer is to increase the cross link density of the cured rubber. It should be noted that because of the presence of vinyl groups, peroxide cures are not necessarily prohibited. Such formulations require the separate presence of olefinic unsaturation and hydride terminated siloxane species and are catalyzed by noble metal catalysts. While this results in a high crosslink density for the cured rubber, the drawbacks associated with these formulations is that although the desired high durometer is achieved the resulting cured rubbers suffer from very high moduli and very low elongations. The properties of fabricated rubber depend not only on the chemical nature of the components but also on the properties of the filler, additives, and type of curing catalyst. Consequently, the resultant property profile of a given heat cured or liquid injection molded silicone rubber is highly dependent on the chemical nature of the various constituent components as well as the relative proportions of those components. For example, a high filler content increases hardness and solvent resistance of the resulting rubber. Such increased hardness and solvent resistance however, comes at the price of reduced physical properties such as elongation and tear, depending on the filler. Not only do the properties of heat cured (i.e. high consistency or millable rubber) or liquid injection molded silicone rubbers vary with the nature of the silicone components and the various additives as well as their respective proportions but the properties also vary as a result of the various procedures used to compound the rubber. Properties of a heat cured rubber may therefore vary as a function of the thoroughness of the mixing and the degree of wetting of the filler by the component. Properties of liquid injection molded silicone rubbers will depend on the nature of the alkenyl and hydride components that form the basis of the elastomeric network, the catalysts employed, fillers and reaction inhibitors. All other factors being equal, a hydrophilic filler as opposed to a hydrophobic filler will impart significantly different properties to a finished rubber. Further, properties of heat cured or liquid injection molded rubbers change with time. This is particularly true during the initial periods of the curing reaction. Since silicone rubbers are complex chemical mixtures, the cure reactions and associated side reactions never completely stop although they may slow down considerably after the initial cure. The properties of a heat cured or liquid injection molded rubber thus change slowly with age, preferably as slowly as possible. Silicone rubbers may be cured by one of three general curing techniques: 1) hydrosilylation, 2) free radical initiation, and 3) high energy radiation initiation. For a hydrosilylation cure, high molecular weight polymers possessing a vinyl functionality are usually reacted with low molecular weight hydride-functional cross-linking agents. A stable platinum complex, functioning as a catalyst, is added along with an inhibitor to prevent cure initiation prior to heating. The reaction proceeds at room temperature, increasing reaction rate as the temperature is increased, to form a cross linked addition polymer. Free radical curing of silicone rubbers is effected by heating the rubber precursor in the presence of a free radical initiator such as benzoyl peroxide. The predominant mechanism operating involves hydrogen abstraction from the methyl groups of the dimethylsiloxane moiety followed by radical attack on another methyl group creating a cross-linking ethylene bridge. If a small percentage of vinyl groups are present, the methyl radical can add to the vinylic double bond. In addition to benzoyl peroxide, other radical cure initiators include bis(2,4-dichlorobenzoyl)peroxide, tert-butyl peroxybenzoate, dicumyl peroxide, 2,5-dimethyl-di-(tert-butylperoxy)hexane, and 1,1-di-(tert-butylperoxy)-trimethylcyclohexane. Both 2,5-dimethyl-di-(tert-butylperoxy)hexane, and 1,1-di-(tert-butylperoxy)-trimethylcyclohexane are particularly useful and specific as free radical cure initiators for vinyl silicone heat cured rubbers. High energy radiation, either as gamma rays or as an electron beam, can also effect cures. This type of cure causes a wide variety of bonds to be broken, thus cross-links occur between a variety of different atomic centers as the radicals created by the high energy recombine to form new chemical bonds. When a heat cured or liquid injection molded rubber formulation is used to manufacture products such as gaskets, the particular end use and the environment of that end use govern how the material is formulated and processed. In the case of gaskets, compression set, sealing force, and retention of sealing force are important measures of performance. Compression set has been a significant factor in heat cured or liquid injection molded rubber technology for many years. U. S. patent 2,803,619 discloses a polydimethylsiloxane gum filled with fumed silica and diatomaceous earth having a low compression set. The heat cured rubber of the '619 patent was cured by a peroxide initiated vulcanization lasting five minutes at 150 °C followed by a twenty-four hour cure at 250 °C. The compression set was measured according to ASTM D-395 after being compressed to 75% of its original thickness for 22 hours at 150 °C. Subsequent to the '619 patent, post-bake curing times have been significantly reduced to conditions that avoid thermal decomposition of the silicone, e.g. 4 hours at 200 °C as taught in U.S. patent 4,774,281. Such post-preparation finishing steps to control compression set add significantly to the cost of the materials. Curing of a heat cured or liquid injection molded rubber begins when the cure is initiated during the molding process. The cure must be sufficiently rapid that the article can be removed from the mold without deformation. Yet the requirement that the finished product possess elastomeric properties in some degree means that the cure cannot proceed to the extent that the initially elastomeric heat cured or liquid injection molded rubber is no longer deformable. Thus the kinetics of the cure reaction must be carefully balanced for a rapid initial cure. Subsequent developments have focused on three technical issues: 1) in-situ filler treatment, 2) post-reaction catalyst inhibition, and 3) additives. In-situ filler treatment may be divided into two broad classes: 1) hexamethyldisilazane and vinyl silazane treatment of the filler, and 2) hexamethyldisilazane and vinyl alkoxy silane treatments. In the case of free-radical cures, generally peroxide initiated, the initiator is consumed. Use of gamma radiation or high energy electron beams also leaves no reactive residues in the rubber. When a hydrosilylation catalyst is used to effect a cure in a vinyl-hydride compound rubber, the cure must be controlled because the catalyst is not destroyed by the cure reaction. Thus a large variety of inhibitor compounds have been used: alkaline earth metal silicates (U. S. patent 3,817,910), metal sulfides (U. S. patent 5,219,922), boron compounds (U. S. patent 4,690,967), and various organic compounds (U. S. patent 5,153,244). Catalyst residues that remain in a heat cured or liquid injection molded rubber may continue to function catalytically leading to low levels of continuous cross linking reactions that deleteriously affect compression set. Additives to heat cured or liquid injection molded rubbers to control compression set have most frequently involved the addition of substituted silicone resins. Recently, in sharp contrast, spinels have been used to control compression set (U. S. patent 5,260,364). Since the silicone resins added to the heat cured or liquid injection molded rubber formulation for compression set control are highly branched silicone resins, depending on when these resins are added can sometimes lead to the conclusion that these materials form part of the elastomeric matrix of the heat cured or liquid injection molded rubber. A current problem not yet fully solved by the art deals with the incompletely reacted surface silanol groups of the various silica fillers currently in use. The presence of reactive, i.e. unreacted, surface hydroxyl or silanol groups in silica leads to condensation reactions and structuring of the silica component. One solution currently in use is to use silanol or methoxy stopped silicone fluids as blending agents to assist in dispersing the filler into the silicone component and also provide a reaction center that does not lead to structuring of the filler. In a sense, these blending agents are reactive diluents as they react with the filler surface hydroxyl or silanol groups preventing the condensation reactions between filler particles or filler and gum molecules that lead to stiffening and a loss of elastomeric properties. U.S. patent 5,569,688 ('688) discloses the use of ammonia generating additives to control the compression set of liquid injection molded or heat cured rubbers. Thus aqueous ammonia, urea and other compounds capable of generating ammonia by thermal decomposition as well as compounds that generate ammonia by chemical decomposition, such as hexamethyldisilazane are used to lower the compression set values for cured liquid injection molded silicone rubbers. U.S. patent 5,486,551 ('551) discloses the use of ammonium carbonate and ammonium formate as compression set additives, compounds which thermally degrade to liberate ammonia. In contrast to other art that recommends the use of fumed silica as a reinforcing filler in heat curable or liquid injection molded silicone rubber systems, both the '688 and the '551 use precipitated silica as a filler. EP-A-0926207 which forms part of the state of the art under Art 54(3) EPC discloses reducing the compression set of cured silicone elastomers by the incorporation of nitrogen compounds wherein the nitrogen possesses at least one organic substituent and the nitrogen is tetravalent wherein the nitrogen is cationic. The adhesion of such compositions to thermoset or thermoplastic polymer substrates is improved by the addition of bis(trimethoxysilylpropyl) fumarate and a disilanol that may or may not contain alkenyl groups. US-A-567741 discloses secondary contact adhesion or self-bonding in cured liquid injection molding silicone compositions is reduced by the inclusion in the composition of an inhibitor compound selected from phenyl fluids, titanate esters, and silicate esters. JP-A-4339863 discloses a molded article having low compression set containing a six membered cyclic compound having at least one carbon-nitrogen unsaturated bond in the ring or derivatives thereof. EP-A-0388201 discloses a curable silicone composition having good curing properties having markedly small compression set which contain a triazole compound. EP-A-0822234 discloses an addition crosslinkable silicon rubber (I) comprising: (A) alkenyl functionalised polyorganosiloxane, (B) SiH-functionalised crosslinking agent, (C) Hydrosilylation catalyst and (D) 1H-benzotriazole-5-carboxylic acid ester and/or 1H-benzotriazole-5-carboxylic acid amide. Liquid injection molded silicone materials have several properties that make them useful as materials for many industrial applications. One such feature of silicones is that they possess low surface energies. This means that silicones as materials, readily release from contact with other materials. While this property can have advantages, when adhesion to a substrate is desired such as occurs in the case of two-component molding, transfer molding or overmolding the property of a ready release must be modified by an adhesion promoter. Frequently adhesion promoters are increased in effectiveness by a step known as post-baking. However, post-baking has a significant negative effect on productivity. When a silicone material is used as a part of a seal such as in an electrical connector, the silicone must adhere to one or the other mates of the connector and still allow for a ready release from the other mate. Thus the addition of additives that increase the lubricity and release of silicones work against the function of the adhesion promoter. Thus preparation of a liquid injection moldable silicone that adheres to certain substrates but is non-adherent to others represents a continuing problem in the art of silicone formulations because of the contradictions in performance required of the material. Summary of the Invention The present invention provides for a curable silicone elastomer composition comprising: 1) a silicone elastomer; 2) a salt of a cationic organic nitrogen compound; 3) bis(trimethoxysilylpropyl)fumarate; and 4) a silanol terminated polymer having the formula: (HO(R A1 ) 2 SiO 1/2 ) 2 (R A2 R A3 SiO 2/2 ) x' (R A4 R A5 SiO 2/2 ) y' where each of R A1 , R A2 , R A3 , and R A4 , is independently a one to forty carbon atom monovalent organic radical and R A5 is a two to forty carbon atom monovalent olefinic organic radical where the subscript y' may range from 0 to 50 and the subscript x' may range from 0 or 1 to 100, and a weight percent alkenyl content that ranges from zero when the subscript y' is zero to 25 weight percent when the subscript y' is greater than zero; and 5) a silicone soluble in said curable elastomer composition wherein said silicone is less soluble in said curable elastomer composition when said curable composition has been cured whereby said silicone bleeds out of said cured composition and wherein the compression set of the cured silicone elastomer is less than the compression set of the cured silicone elastomer free of said nitrogen compound that exhibits a primerless adhesion and has a ready release. The present invention also provides that the low compression set salt is preferably selected from the group of salts comprising a cationic nitrogen cation having the formulas: 1) a monovalent cation having the formula: R N1 a R N2 b R N3 c R N4 d N + where R N1 is selected from the group consisting of hydrogen and one to forty carbon atom monovalent organic radicals and R N2 , R N3 , and R N4 are each independently selected from the group consisting of one to forty carbon atom monovalent organic radicals with the subscript a having values ranging from 0 to 3 and the subscripts b, c, and d independently having values ranging from 0 to 4 subject to the limitation that a + b + c + d is always equal to 4; 2) cations of cyclo-aliphatic nitrogen heterocycle having the formula: ((CH 2-e Q e ) f NR N5 g H 2-g where the subscript e is 0, 1 or 2, Q is a one to forty carbon atom monovalent organic radical, the subscript f is an integer of 4 or greater, R N5 is a one to forty carbon atom monovalent organic radical and the subscript g is 0,1 or 2; 3) cations of cyclo-aromatic nitrogen heterocvcle compounds having the formula: ((CH 1-h Q h ) i NR N6 j H 2-j where the subscript h is 0 or 1, Q. is a one to forty carbon atom monovalent organic radical, the subscript i is an integer of 5 or greater, R N6 is a one to forty carbon atom monovalent organic radical and the subscript j is 0 or 1; and 4) a cation of a nitrogen compound containing a nitrogen double-bonded to a carbon atom. The present invention also provides for a curable silicone elastomer comprising: 1) an alkenyl organopolysiloxane and 2) a hydrogen containing silicon compound selected from the group consisting of hydrogen containing silanes and hydrogen containing organopolysiloxanes. The present invention provides that the curable silicone compositions of the present invention adhere to a substrate. The substrate may be a thermoset or a thermoplastic. The thermoset or thermoplastic substrates may be polymers. The present invention provides that the silicone compositions of the present invention release readily from substrates after they have been overmolded, transfer molded or two-component molded. The present invention further provides for the incorporation of an adhesion promoter and a self-bleed additive that allows lubrication of the surfaces of the cured silicone simultaneously with adhesion to the overmolded, transfer molded or two-component molded substrate. Detailed Description of the Invention We now disclose that the addition of a salt of a cationic organic nitrogen compound said nitrogen compound preferably selected from the group consisting of nitrogen compounds 1) containing a monovalent cation having the formula: R N1 a R N2 b R N3 c R N4 d N + where R N1 is selected from the group consisting of hydrogen and one to forty carbon atom monovalent organic radicals and R N2 , R N3 , and R N4 are each independently selected from the group consisting of one to forty carbon atom monovalent organic radicals with the subscript a having values ranging from 0 to 3 and the subscripts b, c, and d independently having values ranging from 0 to 4 subject to the limitation that a + b + c + d is always equal to 4; 2) cyclo-aliphatic nitrogen heterocycle cations that may be cations of single ring or multi-ring heterocyclic compounds, typically having the formula: ((CH 2-e Q e ) f NR N5 g H 2-g where the subscript e is 0, 1 or 2, Q is a one to forty carbon atom monovalent organic radical, the subscript f is an integer of 4 or greater, R N5 is a one to forty carbon atom monovalent organic radical and the subscript g is 0, 1 or 2; 3) cyclo-aromatic nitrogen heterocycle compounds that may be cations of single ring or multi-ring heterocyclic compounds, typically having the formula: ((CH 1-h Q h ) i NR N6 j H 2-j where the subscript h is 0 or 1, Q is a one to forty carbon atom monovalent organic radical, the subscript i is an integer of 5 or greater, R N6 is a one to forty carbon atom monovalent organic radical and the subscript j is 0 or 1; 4) double-bonded nitrogen cations such as guanidinium to a silicone composition suitable for making either a millable rubber or a pumpable liquid injection molding composition improves the compression set over an identical composition wherein the nitrogen compound is absent. Applicants recognize that cations do not generally exist in the absence of anions. However, the anions selected to perform the function of a neutralizing counter ion may be any known anion that does not catalyze the decomposition of the cationic nitrogen ions of the present invention subject to the further limitation that the resulting salt does not decompose the silicone elastomers where the effect of a reduced compression set is desired. Suitable anions include, but are not limited to fluoride, chloride, bromide, iodide, sulfate, bisulfate, sulfite, bisulfite, carbonate, bicarbonate, carboxylates such as acetate and propionate, nitrate, nitrite, phosphate, phosphite, borate, tetrafluoroborate, antimonate, arsenate, chlorate, bromate, iodate, hypochlorite, hypobromite, and hypoiodite. The liquid injection molding formulations useful with the present invention comprise: (A) 100 parts by weight of an alkenyl, preferably vinyl containing polyorganosiloxane component comprising: (1) 70 to 98 parts by weight of a linear high viscosity alkenyl or vinyl end-stopped organopolysiloxane having no more than 25 mole percent of phenyl radicals and having a viscosity of from 2,000 to 1,000,000 mPa.s (centipoise) at 25° C., (2) 1 to 15 parts by weight of a linear low viscosity organopolysiloxane having at least one terminal alkenyl group per molecule, having an alkenyl or vinyl content that may vary from 0.01 mole percent alkenyl or vinyl to 60 mole percent alkenyl or vinyl, having a viscosity that varies from 50 to 5,000 mPa.s (centipoise) at 25° C and having no more than 25 mole percent phenyl radicals, and, (3) 1 to 15 parts by weight of an alkenyl or vinyl on chain organopolysiloxane having from 0.1 to 25 mole percent alkenyl or vinyl, having a viscosity that varies from 50 to 10,000 mPa.s (centipoise) at 25° C and having no more than about 25 mole percent phenyl radicals; (B) from 5 to 70 parts by weight of a filler; (C) from 0.1 to 50 parts per million of the total organopolysiloxane composition of a platinum catalyst; (D) from 0.1 to 10 parts by weight a SiH composition selected from the class consisting of hydrogen containing silanes and hydrogen containing organopolysiloxane; (E) optionally, from 0.1 to 6.0 parts by weight of a hydroxy containing organopolysiloxane fluid having a viscosity ranging from 5 to 100 mPa.s (centipoise) at 25° C or hydroxy containing organopolysiloxane resin having a viscosity ranging from 100 to 15,000 mPa.s (centipoise) at 25° C; and (F) from 0.001 to 1.0 parts by weight per weight of the total liquid injection molding fluid of an injection molding inhibitor compound or compounds. This composition may be either cured to an elastomer at room temperature for several hours or may be cured at elevated temperatures, such as, for example, 150 - 200° C for 10 seconds. In one embodiment, the above composition is a two-component composition where the first component, contains at least all of ingredient (C), and the second component, contains all of ingredient (D) and the inhibitor compound(s) F. The linear high viscosity alkenyl or vinyl end-stopped organopolysiloxane, A(1), has no more than 25 mole percent of phenyl radicals and a viscosity of from 2,000 to 1,000,000 mPa.s (centipoise) 25° C, preferably from 10,000 to 500,000 at 25° C. These high viscosity organopolysiloxanes may be represented by the general formula: where Vi stands for alkenyl or vinyl, R is selected from the group consisting of monovalent hydrocarbon radicals and halogenated monovalent hydrocarbon radicals having up to about 20 carbon atoms, and x may vary from 100 to 10,000 or even higher, preferably ranging from 500 to 2,000. Suitable high viscosity organopolysiloxanes are disclosed in U. S. patent number 3,884,866. The linear low viscosity organopolysiloxane, A(2), has at least one terminal alkenyl or vinyl group per molecule, an alkenyl or vinyl content that may vary from 0.01 mole percent vinyl to 60 mole per cent vinyl, preferably from 0.05 to 10 mole percent alkenyl or vinyl, a viscosity that varies from 50 to 5,000 mPa.s (centipoise) at 25° C, preferably from 50 to 1,000 mPa.s (centipoise) at 25° C; and no more than about 25 mole percent phenyl radicals. These low viscosity organopolysiloxanes may be represented by the general formula: wherein R' is selected from the group consisting of monovalent hydrocarbon radicals having up to about 20 carbon atoms, halogenated monovalent hydrocarbon radicals having up to about 20 carbon atoms, and alkenyl or vinyl, Vi is alkenyl or vinyl, and y may vary from 1 to 750. Suitable low viscosity organopolysiloxanes are disclosed in U.S. patent number 3,884,886. The alkenyl or vinyl on chain organopolysiloxanes, A(3), is important to obtaining the desired properties. Suitable alkenyl or vinyl on chain organopolysiloxanes have from 0.1 to 25 mole percent alkenyl or vinyl and preferably from 0.2 to 5 mole percent alkenyl or vinyl, a viscosity that varies from 50 to 100,000 mPa.s (centipoise) at 25° C, preferably from 100 to 10,000 mPa.s (centipoise) at 25° C, and no more than about 25 mole percent phenyl radicals. These organopolysiloxanes may be characterized as copolymers of (I) organosiloxane units having the formula: (3) R f R g 2' SiO (4-f-g/2) wherein R is selected from the group consisting of monovalent hydrocarbon radicals and halogenated monovalent hydrocarbon radicals having up to about 20 carbon atoms, R 2' is an olefinic hydrocarbon radical attached to silicon by a C-Si linkage, and generally contains from 1 to 20 aliphatic carbons, either straight chain or branched, and preferably from 1 to 12 carbon atoms linked by multiple bonds, with the stoichiometric subscript f ranging from a value of 0 to 2 inclusive, and the sum of the stoichiometric subscripts f and g ranges from 0.8 to 3.0 inclusive, and copolymers of (II) organopolysiloxane units having the structural formula: (4) R h SiO (4-h)/2 wherein R is selected from the group consisting of monovalent hydrocarbon radicals and halogenated monovalent hydrocarbon radicals having up to about 20 carbon atoms, and the stoichiometric coefficient h ranges in value from 0.85 to 2.5, inclusive. R 2' may be for example, allyl, methallyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl and ethenyl, but is preferably vinyl. The copolymer of (I) and (II) generally contains from 0.5 to 99.5 mole percent of the compound of formula (3) above and from 0.5 to 99.5 mole percent of the compound of formula (4) above. The preparation of these copolymers is well known in the art, as is taught in U.S. patents numbers 3,436,366 and 3,344,111. Preferred alkenyl or vinyl on chain organopolysiloxanes are linear and have the general formula: wherein R is selected from the group consisting of monovalent hydrocarbon radicals and halogenated monovalent hydrocarbon radicals having up to about 20 carbon atoms, R 2' is an olefinic hydrocarbon radical attached to silicon by a C-Si linkage, and generally contains from 1 to 20 aliphatic carbons, either straight chain or branched, and preferably from 1 to 12 carbon atoms linked by multiple bonds, and i andj are positive integers such that the polymer contains up to approximately 20 mole percent R 2' . Vi is alkenyl or vinyl. Preferably R 2' is vinyl but may also be alkenyl, then the polymer contains from 0.05 to 10 mole percent R 2' , and the viscosity ranges from 300 to 1000 mPa.s (centipoise) at 25° C. As previously recited, R is selected from the group consisting of monovalent hydrocarbon radicals and halogenated monovalent hydrocarbon radicals having up to about 20 carbon atoms, that is radicals normally associated as substituent groups for organopolysiloxanes. Thus the radical R may be selected from the class consisting of mononuclear and binuclear aryl radicals such as phenyl, tolyl, xylyl, benzyl, naphthyl and alkylnaphthyl; halogenated mononuclear and binuclear aryl radicals such as chlorophenyl and chloronaphthyl; mononuclear aryl lower alkyl radicals having from 0 to 8 carbon atoms per alkyl groups such as benzyl and phenyl; lower alkyl radicals having from 1 to, 8 carbon atoms such as methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl and octyl either as straight or branched chain alkyl substituents, lower alkenyl radicals having from 2 to 8 carbon atoms such as vinyl, allyl, and 1-propenyl; halo lower alkyl radicals having from 1 to 8 carbon atoms such as chloropropyl, trifluoropropyl, and cycloalkyl radicals such as cyclobutyl, cyclopentyl and cyclohexyl. Though R may be any of the above, persons skilled in the art will readily recognize that not every R can be a high molecular weight radical and that R should be chosen so as to not adversely affect the vinyl group reactions. Preferably R is a lower alkyl radical of 1 to 8 carbon atoms, such as methyl, ethyl, and phenyl trifluoropropyl. More particularly, R, is at least 70 percent by number methyl. The SiH component, (D), serves as a cross linking agent and may be selected from the class consisting of hydrogen containing silanes and hydrogen containing organopolysiloxanes. Hydrogen containing organopolysiloxane can be characterized as copolymers containing at least one unit per molecule having the formula: (6) R k H m SiO (4-k-m)/2 where the remaining siloxane units in the organopolysiloxane are within the scope of formula (4) above, with the notable exception that the R of formula (4) as well as the R herein should be saturated, f has a value ranging from 0 to 2, inclusive; and the sum of k and m ranges from 0.8 to 3.0. The viscosity of the hydrogen containing organopolysiloxane should range from 5 to 100 mPa.s (centiposie) at 25° C. Included with the hydrogen containing organopolysiloxane described above are MQ resins having units of, for example, M(R) 2 , SiO 1/2 and SiO 2 . Also included therein are MDQ, MTQ, MDT, MTQ, and MDTQ resins with hydrogen substitution. Thus copolymer generally contains from 0.5 to 99.5 mole percent of the units of formula (6) and from 99.5 mole percent of the units of formula (4). The compounds, oligomers, resins or fluids designated MQ, MDQ, MTQ, MDT, MDTQ, and MT refer to the nomenclature explained in the research monograph by H. A. Liebhafsky, "Silicones Under the Monogram," published by Wiley - Interscience division of John Wiley and Sons, New York (publication date 1978) at pages 99 and following. In the context of the present invention, substitutional isomerization such as M' being different from M but functioning as an "M" in terms of polymer building blocks as well as D' and D, T' and T, and Q' and Q, likewise; there being many varieties of each type of building block, are ail encompassed by the simple shorthand notation referred to in the reference and herewith assume the same variability with respect to composition while retaining their respective M, D, T, and Q functionality. A preferred hydrogen containing organopolysiloxane is a linear organopolysiloxane of the formula: wherein R is defined as above, excluding unsaturated compounds, R 3 is the same as R excluding unsaturated compounds and with the addition of hydrogen, n varies from 1 to 1000, and p varies from 5 to 200. More preferably, n varies from 10 to 500 and p varies from 5 to 200. The hydrogen containing organopolysiloxane, (D), is utilized at a concentration of anywhere from 0.5 to 25 part by weight per 100 parts by weight (A), and preferably at a concentration of from 0.5 to 10 parts by weight per 100 parts by weight (A). It is desirable that in the SiH material there is at least one hydrogen atom for every vinyl group in (A) and preferably from 1.1 to 2.5 hydrogen atoms for every vinyl group. Many types of platinum catalysts for this SiH olefin addition reaction are known and such platinum catalysts may be used for the reaction in the present instance. When optical clarity is required the preferred platinum catalysts are those platinum compound catalysts that are soluble in the reaction mixture. The platinum compound can be selected from those having the formula (PtCl 2 Olefin) and H(PtCl 3 Olefin) as described in U.S. patent number 3,159,601. reference. The olefin shown in the previous two formulas can be almost any type of olefin but is preferably an alkenylene having from 2 to 8 carbon atoms, a cycloalkenylene having from 5 to 7 carbon atoms or styrene. Specific olefins utilizable in the above formulas are ethylene, propylene, the various isomers of butylene, octylene, cyclopentene, cyclohexene and cycloheptene. A further platinum containing material usable in the compositions of the present invention is the cyclopropane complex of platinum chloride described in U.S. patent number 3,159,662. Further the platinum containing material can be a complex formed from chloroplatininc acid with up to 2 moles per gram of platinum of a member selected from the class consisting of alcohols, ethers, aldehydes and mixtures of the above as described in U.S. patent number 3,220,972. The catalyst preferred for use with liquid injection molding compositions are described in U. S. Patents numbers 3,715,334; 3,775,452; and 3,814,730 to Karstedt. Additional background concerning the art may be found at J. L. Spier, "Homogeneous Catalysis of Hydrosilation by Transition Metals, in Advances in Organometallic Chemistry , volume 17, pages 407 through 447, F.G.A. Stone and R. West editors, published by the Academic Press (New York, 1979). Persons skilled in the art can easily determine an effective amount of platinum catalyst. Generally, an effective amount ranges from 0.1 to 50 parts per million of the total organopolysiloxane composition. In order to obtain high tensile strength in the compositions of the present invention, it is desirable to incorporate a filler, (B), into the composition. Examples of the many fillers that may be chosen are titanium dioxide, lithopone, zinc oxide, zirconium silicate, silica aerogel, iron oxide, diatomaceous earth, calcium carbonate, fumed silica, silazane treated silica, precipitated silica, glass fibers, magnesium oxide, chromic oxide, zirconium oxide, aluminum oxide, alpha quartz, calcined clay, asbestos, carbon, graphite, cork, cotton and synthetic fibers. The preferred fillers that should be utilized in the composition of the present invention are either a fumed silica or a precipitated silica that may have been surface treated. In one method of surface treatment, the fumed silica or precipitated silica is exposed to cyclic organopolysiloxanes under heat and pressure. An additional method of treating fillers is one in which the silica is exposed to siloxanes or silanes in the presence of an amine compound. A particularly preferred method of surface treating silica fillers employs methyl silane silazane surface treating agents. Methylsilane or silazane surface treated fumed or precipitated silica fillers exhibit the property of flowing easily and also do not significantly increase the low viscosity of the uncured liquid precursor silicone composition. After curing, silazane treated silicas impart an improved tear strength to the cured elastomer. Combining the silazane treatment with component (A) for in situ treating seems to give the greatest improvement in physical properties. Silazanes treatments are disclosed in U. S. patents 3,635,743 and 3,847,848. The filler, (B), is generally utilized in a concentration of from about 5 to about 70 parts, preferably 15 to 50 parts filler for each 100 parts by weight of (A). The preferred filler is in situ silazane treated fumed silica or mixtures of silazane treated fumed silica with silazane treated precipitated silica. This latter mixture is particularly preferred containing a weight ratio of fumed silica to precipitated silica of 25/1 to 1/1 and preferably from 10/1 to 5/1. Hydroxy containing organopolysiloxane fluid or resin, (E), may be added to improve the mold release properties and to extend the shelf life of the liquid injection molding organopolysiloxane composition. Where silazane treated precipitated silica filler is present in the composition, the hydroxy containing organopolysiloxane fluid or resin may be added in conjunction with the precipitated silica filler to obtain extended shelf life and mold release. Suitable hydroxy containing organopolysiloxane fluids have a viscosity of from 5 to 100 mPa.s (centiposie) at 25° C and preferably from 20 to 50 mPa.s (centipoise). These fluids or resins may be represented by the formula: (8) R q (OH) r SiO (4-q-r)/2 where R is defined as above, q may range from 0 to 3, preferably 0.5 to 2.0, r ranges from 0.005 to 2, and the sum of q and r ranges from 0.8 to 3.0. The hydroxy substitution on the organopolysiloxane fluid or resin is primarily a terminal hydroxy substitution. Suitable hydroxy containing organopolysiloxane resins have a viscosity of from 100 to 15,000 mPa.s (centipoise) at 25° C and preferably from 1,000 to 8,000 mPa.s (centipoise). Components (A), (B), (E), and additives are divided between both compositions that are mixed to form the liquid injection molding composition. Premature reactions are avoided in this manner during storage and transport. When it is desired to form the cured silicone rubber composition, the two components are mixed into each other and the composition is allowed to cure. A fairly general practice is to formulate inhibitors such that the cure rates will allow storage of the resin within a liquid injection molding apparatus over short periods of time such as a weekend without the curable composition curing during storage. Traditionally liquid injection molding systems have two compositions, a first composition that contains a platinum containing catalyst, and a second composition that contains a hydride and an inhibitor. The two compositions are mixed in a static mixer just prior to use in injection molding. Injection molding cavity temperatures are typically 149° C (300° F) or more. The primary function of the liquid injection molding inhibitor is to prevent curing of the molding composition until the mold is filled and thereafter, the mold being filled, to allow a rapid cure to ensure short cycle times. The two compositions may be injected molded directly or dissolved in solvents for application as a film or coating. In injection molding, the mixing barrel and shot chamber must be cool in order to prevent premature cure. The mold temperature generally varies from 66° C (150° F) to 260° C (500° F). Pigments, thixotropic agents, thermal stabilizers, and the like may be added according to the teachings in the art. It is particularly desirable to add inhibitors in order to obtain a reasonable work life in the catalyzed material. Suitable inhibitors are taught in U.S. patent number 4,256,870. One of the most significant problems present in the existing art is the limitation on article size and weight imposed by the kinetics of the catalyzation and the thermochemistry of the injection molding process. These two parameters presently interact to limit the size of liquid injection molded silicone rubber articles of manufacture. U.S. patent number 3,445,420, discloses and claims curable compositions comprising organopolysiloxanes and acetylenic compounds having a boiling point of at least 25° C where the acetylenic compound has at least one acetylenic moiety contained within the structural framework of the molecule. Although the use of the acetylenic compounds disclosed and claimed in the '420 patent is well-known in the art, practice of the invention represented by the '420 patent and related inventions has not enabled the liquid injection molding of larger molded articles as contrasted with the present invention. The liquid injection molding compositions used in conjunction with the low compression set additive compounds of the present invention are thus: 1) from 35 to 75 parts by weight of a vinyl stopped polydimethylsiloxane, A(1), having a viscosity ranging anywhere from 10,000 to 100,000 mPa.s (centiposie) and a vinyl content ranging approximately from 0.05 to 0.15 weight per cent; 2) up to 10 parts by weight of a low molecular weight vinyl stopped vinyl on chain polyorganosiloxane, A(2), having a viscosity ranging from 50 to 5,000 mPa.s (centipoise) and a vinyl content of approximately 1.5 weight per cent; 3) up to 10 parts by weight of a mono-vinyl stopped polyorganosiloxane, A(3), having a viscosity ranging anywhere from 50 to 10,000 mPa.s (centipoise); 4) from 5 to 30 parts by weight of a fumed or pyrogenic silica filler (B), having a surface area ranging from 150 to 450 m 2 /gm; 5) from 2 to 50 wppm of a Pt hydrosilylation catalyst, (C); 6) from 0.01 to 0.50 parts by weight of an inhibitor compound, (F); and 7) from 100 to 500 wppm of silyl hydrides, (D); 8) an additional amount, if necessary, of a silyl hydride whereby the hydride groups are present at least in molar equivalence to the total quantity of olefinic unsaturation present; and 9) from 0.1 to 6.0 parts by weight of a mold release agent, typically a silanol fluid being a hydroxy stopped polydiorganosiloxane having a silanol content of from 2 weight per cent to 11 weight percent silanol and a viscosity of 5 to 100 mPa.s (centipoise) or a silanol containing resin having a silanol content of from 1 weight percent to 5 weight percent silanol and a viscosity of 100 to 15,000 mPa.s (centipoise) and 10) from 1 part per million by weight to 10,000 parts per million by weight, preferably from 5 parts per million by weight to 5,000 parts per million by weight, more preferably from 10 parts per million by weight to 1,000 parts per million by weight, and most preferably from 20 parts per million by weight to 600 parts per million by weight of the low compression set additive compounds of the present invention. While an examination of chemical stoichiometry would indicate that a one to one molar basis between the alkenyl group and the hydride groups would establish the necessary one to one equivalence for cross linking, because of diffusion limitations and the fact that a cross linking reaction is occurring which further decreases diffusion, a molar excess of hydride to alkenyl will tend to improve the physical properties of a given formulation relative to those formulations where the two reactants are present in strict molar equivalence. This molar excess ranges from 20 to 40%, preferably from 25 to 35%, and most preferably a 30% molar excess of hydride over alkenyl in the liquid injection molding composition. While the addition of the high alkenyl content resins that may be utilized in the present invention for a liquid injection molding formulation will improve certain physical properties such as Durometer, given a standard quantity of a liquid injection molding base formulation, the addition of progressively larger quantities of the high alkenyl resin, or mixtures thereof, will progressively improve those properties. Accompanying this increase in high alkenyl content resin added to the liquid injection molding formulation to achieve this controllable improvement in physical properties, there should also be a proportional increase in the amount of hydride containing materials added to the liquid injection molding formulation, in order to maintain the desired 1 to 1.6 molar ratio of silyl hydride species to alkenyl species. When using liquid injection molding compositions, the process and compositions of the present invention allows for a reduction in compression set without affecting the peak cure rate. A peak cure rate that is unaffected by the low compression set additive is defined to be a peak cure rate that is no less than 80% of the base peak rate and no more than 120% of the base peak rate, where the base peak rate is defined to be the peak rate measured for a liquid injection molding composition where the low compression set additives of the present invention are absent. Thus a peak cure rate varying as about plus or minus 20% is an unaffected peak cure rate. Applicants note that it is a standard chemical shorthand in the field of silicone chemistry to refer to various fluids, resins and gums by such general designations as MDM for an M-stopped polydiorganosiloxane where the degree of polymerization of the repeating D units is unspecified except as to viscosity of the resulting polymer. Thus more particularly, MD x M, where x is a stoichiometric coefficient indicating a degree of polymerization would vary and low values of x produce pourable fluids, intermediate values of x produce more viscous fluids, and high values produce gums and that as x increases so does viscosity. Thus in terms of notation and equivalence, MD vi DM is exemplary of a chemical shorthand where the structure of the polymer more properly possesses stoichiometric subscripts, i.e. MD vi x D y M, and these relate directly to degree of polymerization and viscosity. By stipulating a viscosity for a given polymeric silicone, these stoichiometric subscripts are defined, even if their presence must be inferred from the chemical shorthand used. Various forms of untreated and treated pyrogenic or fumed silica fillers have been employed. Frequently the treatments of choice involve treating with low molecular weight cyclic oligomeric silicones such as octamethylcyclotetrasiloxane or silazane species such as hexamethyldisilazane. The art of such treated fillers has even involved double treating of such materials, first with a silazane followed by a finishing treatment with a low molecular weight cyclic oligomer or vice versa. Usually these treatments are conducted in situ and on an ad hoc basis. Frequently, the techniques have been such that process aids are selected for their ability to fulfill a dual function, that is to reduce the viscosity of the gum blend and treat the surface of the fumed silica reinforcing filler, simultaneously. Frequently it is desirable to have a formulation that will bond to other materials. Thus liquid injection moldable silicone compositions or millable heat curable rubber compositions may contain an additive that increases adhesion of the material to various substrates. The substrates that these materials may be bonded to include thermosetting polymers and thermoplastic polymers. Examples of thermosetting polymers include, by way of illustration only, alkyd resins, such as phthalic anhydride-glycerol resins, maleic acid-glycerol resins, adipic acid-glycerol resins, and phthalic anhydride-pentaerythritol resins; allylic resins, in which such monomers as diallyl phthalate, diallyl isophthalate diallyl maleate, and diallyl chlorendate serve as nonvolatile cross-linking agents in polyester compounds; amino resins, such as aniline-formaldehyde resins, ethylene urea-formaldehyde resins, dicyandiamide-formaldehyde resins, melamine-formaldehyde resins, sulfonamide-formaldehyde resins, and urea-formaldehyde resins; epoxy resins, such as cross-linked epichlorohydrin-bisphenol A resins; phenolic resins, such as phenol-formaldehyde resins, including Novolacs and resols; and thermosetting polyesters, silicones, and urethanes. Examples of thermoplastic polymers include, by way of illustration only, end-capped polyacetals, such as poly(oxymethylene) or polyformaldehyde, poly(trichloroacetaldehyde), poly(n-valeraldehyde), poly(acetaldehyde), and poly(propionaldehyde); acrylic polymers, such as polyacrylamide, poly(acrylic acid), poly(methacrylic acid), poly(ethyl acrylate) and poly(methyl methacrylate); fluorocarbon polymers, such as poly(tetrafluoroethylene), perfluorinated ethylene-propylene copolymers, ethylene-tetrafluoroethylene copolymers, poly(chlorotrifluoroethylene), ethylene-chlorotrifluoroethylene copolymers, poly(vinylidene fluoride) and poly(vinyl fluoride), polyamides, such as poly(6-aminocaproic acid) or poly( epsilon -caprolactam), poly(hexamethylene adipamide), poly(hexamethylene sebacamide) and poly(11-amino-undecanoic acid); polyaramides, such as poly(imino-1,3-phenyleneiminoisophthaloyl) or poly(m-phenylene isophthalamide); parylenes, such as poly-p-xylylene and poly(chloro-p-xylylene); polyaryl ethers, such as poly(oxy-2,6-dimethyl-1,4-phenylene) or poly(p-phenylene oxide); polyaryl sulfones, such as poly(oxy-1,4-phenylenesulfonyl-1,4-phenyleneoxy-1,4-phenylene-isopropylidene-1,4-phenylene), and poly(sulfonyl-1,4-phenyleneoxy1,4-phenylenesulfonyl-4,4'-biphenylene), polycarbonates, such as poly(bisphenolA)or poly(carbonyldioxy-1,4-phenyleneisopropylidene- 1,4-phenylene); polyesters, such as poly(ethylene terephthalate), poly(tetramethylene terephthalate), poly(cyclohexylene-1,4-dimethylene terephthalate) or poly(oxymethylene-1,4-cyclohexylenemethyleneoxyterephthaloyl); polyaryl sulfides, such as poly(p-phenylene sulfide) or poly(thio-1,4-phenylene); polyimides, such as poly(pyromellitimido-1,4-phenylene); polyolefins, such as polyethylene, polypropylene, poly(1-butene), poly(2-butene), poly(1-pentene), poly(2-pentene), poly(3-methyl-1-pentene), poly(4-methyl- 1 -pentene), 1,2-poly-1,3-butadiene, 1,4-poly- 1,3- butadiene, polyisoprene, polychloroprene, polyacrylonitrile, poly(vinyl acetate), poly(vinylidene chloride) and polystyrene; copolymers of the foregoing, such as acrylonitrile-butadiene-styrene (ABS) copolymers. In the case of liquid injection moldable compositions, a molded part can be part of the mold into which the liquid composition is injected and the additive imparts adhesion to surfaces where bonding is desired. This can occur whether the part is molded ex situ, i.e. outside of the mold where the liquid injection moldable silicone composition will be molded, or whether the part is mold in the mold where the liquid injection moldable silicone composition will be molded, i.e. co-injection. For the compositions of the present invention a two-part self-bonding adhesion promoter system appears to work best. This two part system is composed of a silanol terminated linear silicone which may have vinyl on chain and bis(trimethoxysilylpropyl)fumarate, which has the formula: and is the trans isomer (the trans isomers are fumarates and cis isomers are maleates). The formula of the silanol terminated polymer that may have vinyl on chain is: (HO(R A1 ) 2 SiO 1/2 ) 2 (R A2 R A3 SiO 2/2 ) x' (R A4 R A5 SiO 2/2 ) y , where each of R A1 , R A2 , R A3 , and R A4 , is independently a one to forty carbon atom monovalent organic radical and R A5 is a two to forty carbon atom monovalent olefinic organic radical where the subscript y' may range from 0 to 50 and the subscript x' may range from 0 or 1 to 100 and when alkenyl groups are present, i.e. y' is non-zero, a weight percent vinyl content ranging from 0.10 weight percent to 25.00 weight percent. The silanol stopped silicone component is used in the liquid injection molding formulation at a level ranging from 0.10 weight percent to 5.00 weight percent, preferably from 0.15 weight percent to 2.00 weight percent, more preferably from 0.20 weight percent to 2.00 weight percent, and most preferably from 0.25 weight percent to 1.00 weight percent based on the total weight of the composition. The bis(trimethoxysilylpropyl)fumarate component is used in the liquid injection molding formulation at a level ranging from 0.10 weight percent to 5.00 weight percent, preferably from 0.15 weight percent to 2.00 weight percent, more preferably from 0.20 weight percent to 2.00 weight percent, and most preferably from 0.25 weight percent to 1.00 weight percent based on the total weight of the composition. When this adhesion promoter system is used in millable heat curable rubber formulations, the weight ranges will vary from those ideal for liquid injection molding silicone compositions. Applicants note that the phrase "one to forty carbon atom monovalent organic radicals" recited earlier in the instant application includes compositions and ions specifically exemplified by, but not limited to the following: CH 3 CH(R N1 a R N2 b R N3 c N + )CO 2 H, CH 2 (R N1 a R N2 b R N3 c N + )CO 2 H etc., i.e. the ammonium cations of amino acids where R N1 R N2 , and R N3 are as previously defined or alternatively, the Zwitterionic forms of the amino acids, the amino acids thereof themselves and the ammonium cations of amino acid esters and amides. Any cationic nitrogen compound with the exception of simple ammonium ion salts, i.e. salts of NH 4 + , is envisioned by the Applicants as a low compression set additive compound of the present invention. While it is desirable to increase the adhesion of silicone compositions to substrates, it is frequently desirable to increase the ability of the silicone to be released from the substrate. These two properties collide in the manufacture of connectors where adhesion of the silicone to a particular substrate is desired but where a ready release from another substrate is necessary for the device to function. A fairly typical means of improving the ready release or lubricity of a silicone composition is simply to add a liquid compound to the formulation that has limited solubility in the silicone and thus the compound bleeds out over time. Ideally such a material has a lubricating quality to it as well. These compounds are typically selected from the group of compounds consisting of diorganosiloxanes such as polydimethylsiloxanes, phenyl containing siloxanes such as copolymers of diphenylsiloxane with diorganosiloxanes and copolymers of methylphenylsiloxane with diorganosiloxanes, fluorosilicones such as silicones containing trifluoropropyl substituted siloxanes, polydimethylsiloxanes, aliphatic and aromatic hydrocarbons that are liquid between 0 °C and 100 °C without adversely affecting the adhesion of the composition to a substrate. A significant drawback associated with the use of these compounds is that adhesion to substrates is generally decreased. The formulations of the present invention surprisingly and unexpectedly demonstrate that compositions containing both an adhesion promoter and a self-bleed additive for lubricity or ready release can simultaneously achieve the contradictory goals of adhesion to a substrate used in two-component molding, overmolding or transfer molding and release from a second identical substrate where the silicone was not bonded to the substrate by the action of the adhesion promoter and the co-molding process of overmolding, transfer molding or two-component molding. The simultaneous achievement of these two contrary or contradictory properties enables the assembly of connectors and similar articles where the silicone serves as a seal and is bonded to one of the mates or surfaces of the article of manufacture and yet the silicone releases readily from the other mate or surface. Self-bleed additives that provide this unique set of properties to the silicone compositions of the present invention and are compatible with the adhesion promoters used in the compositions of the present invention are selected from the group consisting of diorganosiloxanes such as polydimethylsiloxanes, phenyl containing siloxanes such as copolymers of diphenylsiloxane with diorganosiloxanes and copolymers of methylphenylsiloxane with diorganosiloxanes, fluorosilicones such as silicones containing trifluoropropyl substituted siloxanes, polydimethylsiloxanes, and silicones having a viscosity ranging between 1 to 10000 mPa.s (centipoise) at 25 °C, preferably ranging from 5 to 5000 mPa.s (centipoise) at 25 °C, more preferably ranging from 100 to 3000 mPa.s (centipoise) at 25 °C, and most preferably ranging from 500 to 2000 mPa.s (centipoise) at 25 °C, and aliphatic and aromatic hydrocarbons that are liquid between 0 °C and 100 °C having identical viscosity ranges. Considerations governing the use of self-bleeding additives limit the additive to any species that has a partial or low solubility in the cured liquid injection molded silicone elastomer material but which has sufficient solubility that a homogeneous mixture or true solution is achieved in the components of the uncured liquid injection moldable silicone elastomer. Preferably the self-bleeding additive will migrate to the surface of the cured silicone elastomer thus providing a lubricated surface. Typically based on the weight of the total silicone composition (the sum of parts A and B) of a 100 parts by weight, these self-bleed additives are used in a weight percent level ranging from 0.5 to 10 parts by weight, preferably from 1 to 7 parts by weight, more preferably from 1 to 5 parts by weight and most preferably from 1 to 4 parts by weight. These additives may be introduced into the composition in any convenient fashion provided there is no chemical reaction between the components of the liquid injection moldable silicone composition and the self-bleed additive. Experimental Cure performance was evaluated on a Monsanto MDR (Modulating Disk Rheometer) 2000 rheometer. Such testing is conducted as follows: an uncured liquid injection molding sample is placed in the sample chamber which is maintained at the desired cure temperature. The clamps then close and the top plate starts oscillating. As the material solidifies over time, the torque (S') increases until full cure is achieved. The most important data obtained in these runs for the purposes of illustrating the present invention are as follows: 1) the maximum S' value is related to the physical properties of the cured material; 2) integration of the torque curve allows the determination of cure level vs. time; the times at 2% and 90% of reaction extent (T02 and T90, respectively) are particularly significant as they provide information as to when the cure reaction starts and finishes; and 3) the peak rate value can be used to evaluate the speed or velocity of cure once it begins. The peak rate value is the change in torque with time at elevated temperature, and can be used to evaluate the speed or velocity of the cure once curing begins. For a liquid injection molding composition to be useful in large part formulation and molding, there should be a significant and observable difference in cure times at 121° C (250° F) and 177° C (350° F). Cure should be slow at 121° C (250° F) to allow for mold filling and very fast at 177° C (350° F) in order to accommodate short cycle times. STANDARD COMPRESSION SET TEST The standard compression set test used throughout these experiments, as detailed in ASTM D395, entails molding liquid injection molding silicone elastomer plugs 2.54 cm (1") in diameter by 1.27 cm (½") thick and compressing them in a jig to 75% of their original thickness or by using plies which are stacks of 3.175 mm (1/8") sheets in laminar form to obtain the required 1.27 cm (1/2") thickness and heating in an air circulating oven for 22hrs. at 177 °C. When the heating cycle is complete, the jig containing the sample is removed from the oven and the plugs contained within are also removed and permitted to "relax" while cooling in an uncompressed state. Once the plugs have reached an equilibrium with standard room temperature (25 °C) and have remained there for several hours, the degree of compression set is measured by comparing the thickness of the plugs to the original, un-compressed, thickness. A typical calculation for compression set is given below: Percent compression set = C= [(Yo - Yl)/ (Yo - Ys)] * 100 where Yo = initial thickness, Yl = final thickness, and Ys = 75% of initial thickness Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Control - No Low Compression Set Additive Experiment 1 Amount of Additive none MDR at (250 °F) 121°C T02, seconds 68 T90, seconds 126 Max. Torque, (inch-lbs.) Nm (18.54) 2.09 Peak Rate, (inch-lbs./min.) Nm/min (55.2) 6.24 MDR at (350 °F) 177°C T02, seconds 04 T90, seconds 15 Max. Torque, (inch-lbs.) Nm (18.72) 2.12 Peak Rate, (inch-lbs./min.) Nm/min (163.5) 18.47 Physical Properties Shore A 50.7 Tensile, (psi) KPa (1173) 8087.6 % Elongation 470 100% Modulus, (psi) KPa (296) 2040.8 Tear (die B), (ppi) Kg/m (230) 4107 Compression Set, percent; 22 hours at 177 °C 46 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - 20 wt. % KOH in Methanol Experiment 1 2 3 4 5 Amount of Additive 100 200 300 400 500 MDR at (250 °F) 121°C T02, seconds 8.8 15 75 66 71 T90, seconds 143 70 120 122 132 Max. Torque, (inch-lbs.) Nm (19.59) 2.21 (14.14) 1.60 (19.29) 2.18 (19.46) 2.20 (19.30) 2.18 Peak Rate, (inch-lbs./min.) Nm/min (59.3) 6.70 (30.2) 3.41 (58.6) 6.62 (40.4) 4.56 (56.3) 6.36 MDR at (350 °F) 177°C T02, seconds 04 04 05 04 04 T90, seconds 15 14 14 14 14 Max. Torque, (inch-lbs.) Nm (20.54) 2.32 (20.46) 2.31 (20.14) 2.28 (19.79) 2.24 (19.49) 2.20 Peak Rate, (inch-lbs./min.) Nm/min (181.2) 20.74 (183.4) 20.72 (180.5) 20.39 (179.7) 20.30 (176.9) 19.99 Physical Properties Shore A 52.6 52.0 52.9 53.0 52.8 Tensile, (psi) KPa (1212) 8356.5 (1244) 8577 (1275) 8791 (1134) 7819 (1089) 7508 % Elongation 503 478 495 437 421 100% Modulus, (psi) KPa (316) 2179 (318) 2193 (321) 2213 (313) 2158 (321) 2213 Tear (die B), (ppi) Kg/m (232) 4143 (204) 3643 (223) 3982 (224) 4000 (227) 4054 Compression Set, percent; 22 hours at 177 °C 55.3 55.7 55.3 56.6 51.7 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Potassium Silanolate Experiment 1 2 3 4 5 Amount of Additive 100 200 300 400 500 MDR at (250 °F) 121°C T02, seconds 47 72 69 49 67 T90, seconds 98 123 130 111 140 Max. Torque, (inch-lbs.) Nm (18.54) 2.09 (19.96) 2.26 (18.83) 2.13 (18.73) 2.12 (18.75) 2.12 Peak Rate, (inch-lbs./min.) Nm/min (65.4) 7.39 (49.5) 5.59 (61.1) 6.90 (36.4) 4.11 (59.0) 6.67 MDR at (350 °F) 177°C T02, seconds 03 04 05 05 04 T90, seconds 12 13 15 14 14 Max. Torque, (inch-lbs.) Nm (18.65) 2.11 (18.31) 2.07 (19.14) 2.16 (18.86) 2.13 (18.18) 2.05 Peak Rate, (inch-lbs./min.) Nm/min (182.6) 20.63 (173.7) 19.63 (169.2) 19.12 (168.7) 19.06 (166.7) 18.83 Physical Properties Shore A 52.9 52.8 52.3 52.4 51.4 Tensile, (psi) KPa (1154) 7957 (1119) 7715 (1147) 7908 (1074) 7405 (1074) 7405 % Elongation 446 432 444 417 424 100% Modulus, (psi) KPa (327) 2255 (317) 2186 (319) 2199 (315) 2172 (304) 2096 Tear (die B), (ppi) Kg/m (224) 4000 (231) 4125 (210) 3750 (235) 4197 (233) 4161 Compression Set, percent; 22 hours at 177 °C 47.7 50.2 50.0 50.2 65.5 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties -15 wt.% Ammonium Formate in Methanol Experiment 1 2 3 Amount of Additive 80 200 400 MDR at (250 °F) 121°C T02, seconds 66 62 79 T90, seconds 122 108 167 Max. Torque, (inch-lbs.) Nm (16.13) 1.82 (15.32) 1.73 (15.12) 1.71 Peak Rate, (inch-lbs./min.) Nm/min (64.7) 7.31 (56.2) 6.35 (24.1) 2.72 MDR at (350 °F) 177°C T02, seconds 4 4 5 T90, seconds 20 17 20 Max. Torque, (inch-lbs.) Nm (17.46) 1.97 (16.38) 1.85 (15.86) 1.79 Peak Rate, (inch-lbs./min.) Nm/min (131.0) 14.80 (130.6) 14.76 (117.8) 13.31 Physical Properties Shore A 49.9 49.5 50.1 Tensile, (psi) KPa (1078) 7433 (1130) 7791 (1018) 7019 % Elongation 459 463 442 100% Modulus, (psi) KPa (289) 1993 (287) 1979 (267) 1841 Tear (die B), (ppi) Kg/m (232) 4143 (220) 3929 (219) 3911 Compression Set, percent; 22 hours at 177 °C 50.0 36.2 24.8 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Ammonium Carbonate Experiment 4 5 6 Amount of Additive, ppm 100 200 400 Addition Point Relative to HMDZ MDR at (250 °F) 121°C T02 39 48 37 T90 95 82 82 Max. Torque (inch-lbs.) Nm (18.79) 2.12 (15.99) 1.81 (18.89) 2.13 Peak Rate (inch-lbs/min) Nm/min (55.4) 6.26 (56.6) 6.39 (49.9) 5.64 MDR at (350 °F) 177°C T02 04 04 03 T90 16 15 17 Max. Torque (19.02) 2.15 (20.19) 2.28 (19.62) 2.22 Peak Rate (154.1) 17.41 (173.3) 19.58 (159.5) 18.02 Physical Properties Shore A 53.9 52.1 52.7 Tensile (psi) KPa (1061) 7315 (1057) 7288 (1142) 7874 % Elongation 384 388 423 100% Modulus psi (KPa) (321) 2213 (319) 2199 (313) 2158 Tear (die B) (ppi) Kg/m (204) 3643 (231) 4125 (217) 3875 Compression Set, 22 hours at 177 °C 27.7 42.4 34.2 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Ammonium Carbonate Experiment 1 2 3 Amount of Additive, ppm 5000 5000 5000 Addition Point Relative to HMDZ Before Middle After MDR at (250 °F) 121°C T02 65 68 74 T90 107 107 112 Max. Torque (inch-lbs) Nm (19.11) 2.16 (18.82) 2.13 (18.06) 2.04 Peak Rate (inch-lbs/min) Nm/min (67.3) 7.60 (56.2) 6.35 (49.9) 5.64 MDR at (350 °F) 177°C T02 4 4 3 T90 15 14 14 Max. Torque (inch-lbs) Nm (19.28) 2.18 (20.81) 2.35 (20.21) 2.28 Peak Rate (inch-lbs/min) Nm/min (168.4) 19.03 (187.8) 21.22 (177.3) 20.03 Physical Properties Shore A 53.5 53.3 53.1 Tensile (psi) KPa (1106) 7626 (1251) 8625 (1100) 7584 % Elongation 473 420 371 100% Modulus (psi) KPa (330) 2275 (357) 2461 (342) 2358 Tear (die B) (ppi) Kg/m) (222) 3964 (223) 3982 (218) 3893 Compression Set, 22 hours at 177 °C 61.8 32.9 51.9 Although the prior art adds the hexamethyldisilazane and makes no teaching as to when in the process ammonium carbonate is added, these data clearly show that a difference occurs depending on when the ammonium carbonate is added in the process cycle. Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - 20 wt.% Tetramethylammonium Hydroxide in Methanol Experiment 1 2 3 4 5 Amount of Additive 100 200 300 400 500 MDR at (250 °F) 121°C T02, seconds 74 70 70 70 94 T90, seconds 122 127 121 121 155 Max. Torque, (inch-lbs.) Nm (18.61) 2.10 (18.73) 2.12 (18.06) 2.04 (18.01) 2.03 (18.33) 2.07 Peak Rate, (inch-lbs./min.) Nm/min (61.2) 6.91 (54.9) 6.20 (49.1) 5.55 (43.7) 4.94 (43.3) 4.89 MDR at (350 °F) 177°C T02, seconds 04 04 04 03 04 T90, seconds 15 14 14 14 17 Max. Torque, (inch-lbs.) Nm (19.93) 2.25 (19.78) 2.23 (17.83) 2.01 (17.90) 2.02 (19.82) 2.24 Peak Rate, (inch-lbs./min.) Nm/min (167.8) 18.96 (174.5) 19.72 (158.1) 17.86 (158.6) 17.92 (153.5) 17.34 Physical Properties Shore A 52.8 52.3 52.4 52.5 51.2 Tensile, (psi) KPa (1207) 8322 (1228) 8467 (1190) 8205 (1155) 7963 (1079) 7439 % Elongation 463 472 452 446 425 100% Modulus, (psi) KPa (332) 2289 (324) 2234 (325) 2241 (324) 2234 (304) 2096 Tear (die B), (ppi) Kg/m (260) 4643 (230) 4107 (219) 3911 (233) 4161 (205) 3661 Compression Set, percent; 22 hours at 177 °C 42.3 30.8 20.9 19.0 18.9 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties- 20 wt.% Tetrabutylammonium Hydroxide in Methanol Experiment 1 2 Amount of Additive 200 400 MDR at (250 °F) 121°C T02, seconds T90, seconds Max. Torque, (inch-lbs.) Nm Peak Rate, (inch-lbs./min.) Nm/min (27.3) 3.08 (14.7) 1.66 MDR at (350 °F) 177°C T02, seconds T90, seconds Max. Torque, (inch-lbs.) Nm Peak Rate, (inch-lbs./min.) Nm/min (103.3) 11.67 (46.1) 5.21 Physical Properties Shore A Tensile, (psi) KPa % Elongation 100% Modulus, (psi) KPa Tear (die B), (ppi) Kg/m Compression Set, percent; 22 hours at 177 °C 27.5 19.3 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - 20 wt.% Dodecyltrimethylammonium Bromide in Methanol Experiment 1 2 3 Amount of Additive 50 75 100 MDR at (250 °F) 121°C T02, seconds 47 T90, seconds 92 Max. Torque, (inch-lbs.) Nm (14.93) 1.69 Peak Rate, (inch-lbs./min.) Nm/min (38.5) 4.35 MDR at (350 °F) 177°C T02, seconds 05 T90, seconds 21 Max. Torque, (inch-lbs.) Nm (17.33) 1.96 Peak Rate, (inch-lbs./min.) Nm/min (139.1) 15.72 (134.0) 15.14 (130.2) 14.71 Physical Properties Shore A 49.9 Tensile, (psi) KPa (1130) 7791 % Elongation 482 100% Modulus, (psi) KPa (296) 2041 Tear (die B), (ppi) Kg/m (261) 4661 Compression Set, percent; 22 hours at 177 °C 16.8 15.1 18.1 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - 50 wt.% Dodecyltrimethylammonium Chloride in iso-Propanol Experiment 1 2 3 4 5 Amount of Additive 50 100 200 300 400 MDR at (250 °F) 121°C T02, seconds 50 41 45 36 37 T90, seconds 88 79 79 90 109 Max. Torque, (inch-lbs.) Nm (18.05) 2.04 (17.26) 1.95 (17.78) 2.01 (17.78) 2.01 (17.75) 2.00 Peak Rate, (inch-lbs./min.) Nm/min (65.2) 7.37 (53.5) 6.04 (66.3) 7.49 (46.7) 5.28 (29.3) 3.31 MDR at 350 °F T02, seconds 04 03 03 04 05 T90, seconds 14 13 14 16 17 Max. Torque, inch-lbs. (19.73) 2.23 (19.55) 2.21 (18.92) 2.14 (18.87) 2.13 (18.92) 2.14 Peak Rate, inch-lbs./min. (180.5) 20.39 (177.1) 20.01 (166.4) 18.80 (156.7) 17.70 (148.0) 16.72 Physical Properties Shore A 51.2 52.2 51.3 52.4 51.9 Tensile, (psi) KPa (984) 6784 (1062) 7322 (1031) 7108 (1153) 7950 (1004) 6922 % Elongation 413 446 433 484 405 100% Modulus, (psi) KPa (310) 2137 (310) 2137 (308) 2124 (311) 2144 (310) 2137 Tear (die B), (ppi) Kg/m (224) 4000 (229) 4089 (237) 4232 (236) 4214 (210) 3750 Compression Set, percent; 22 hours at 177 °C 41.6 26.9 20.0 13.5 14.4 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Low Compression Set Additive is a Mixture of Tertiary Substituted Ammonium Chlorides Experiment 1 Amount of Additive none MDR at (250 °F) 121°C T02, seconds 39 T90, seconds 344 Max. Torque, (inch-lbs.) Nm (2.96) 0.33 Peak Rate, (inch-lbs./min.) Nm/min (1.2) 0.13 MDR at (350 °F) 177°C T02, seconds 18 T90, seconds 59 Max. Torque, (inch-lbs.) Nm (18.3) 2.07 Peak Rate, (inch-lbs./min.) Nm/min (36.80) 4.16 Physical Properties Shore A 51.0 Tensile, (psi) KPa (1119) 7715 % Elongation 406 100% Modulus, (psi) KPa (318) 2192 Tear (die B), (ppi) Kg/m (239) 4268 Compression Set, percent; 22 hours at 177 °C 12.3 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties -Low Compression Set Additive is a Mixture of Halogen Substituted Alkyl Ammonium Chlorides Experiment 1 Amount of Additive 300 MDR at (250 °F) 121°C T02, seconds 58 T90, seconds 192 Max. Torque, (inch-lbs.) Nm (18.3) 2.07 Peak Rate, (inch-lbs./min.) Nm/min (11.8) 1.33 MDR at 350 °F (177°C) T02, seconds 05 T90, seconds 18 Max. Torque, (inch-lbs.) Nm (20.36) 2.30 Peak Rate, (inch-lbs./min.) Nm/min (159.2) 17.99 Physical Properties Shore A 53.3 Tensile, (psi) KPa (1085) 7481 % Elongation 403 100% Modulus, (psi) Kg/m (358) 2468 Tear (die B), ppi (231) 4125 Compression Set, percent; 22 hours at 177 °C 12.5 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Low Compression Set Additive is a Mixture of Alkyl Hydroxyl Ammonium Chlorides Experiment 1 Amount of Additive 300 MDR at (250 °F) 121°C T02, seconds 41 T90, seconds 79 Max. Torque, (inch-lbs.) Nm (18.5) 2.09 Peak Rate, (inch-lbs./min.) Nm/min (46.8) 5.29 MDR at (350 °F) 177°C T02, seconds 04 T90, seconds 14 Max. Torque, (inch-lbs.) Nm (19.6) 2.21 Peak Rate, (inch-lbs./min.) Nm/min (175.7) 19.85 Physical Properties Shore A 53.5 Tensile, (psi) KPa (1197) 8253 % Elongation 386 100% Modulus, (psi) KPa (356) 2517 Tear (die B), (ppi) Kg/m (248) 4429 Compression Set, percent; 22 hours at 177 °C 14.4 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Low Compression Set Additive is a Mixture of Primary Alkyl Ammonium Chlorides Experiment 1 Amount of Additive 300 MDR at (250 °F) 121°C T02, seconds 67 T90, seconds 157 Max. Torque, (inch-lbs.) Nm (17.51) 1.98 Peak Rate, (inch-lbs./min.) Nm/min (14.1) 1.59 MDR at (350 °F) 177°C T02, seconds 04 T90, seconds 14 Max. Torque, (inch-lbs.) Nm (18.91) 2.14 Peak Rate, (inch-lbs./min.) Nm/min (165.0) 18.64 Physical Properties Shore A 53.7 Tensile, (psi) KPa (1214) 8370 % Elongation 435 100% Modulus, (psi) KPa (342) 2358 Tear (die B), (ppi) Kg/m (240) 4286 Compression Set, percent; 22 hours at 177 °C 11.3 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Low Compression Set Additive is a Mixture of Tertiary Alkyl Ammonium Chlorides Experiment 1 Amount of Additive 300 MDR at (250 °F) 121°C T02, seconds 41 T90, seconds 94 Max. Torque, (inch-lbs.) Nm (18.04) 2.04 Peak Rate, (inch-lbs./min.) Nm/min (41.8) 4.72 MDR at (350 °F) 177°C T02, seconds 05 T90, seconds 14 Max. Torque, (inch-lbs.) Nm (19.65) 2.22 Peak Rate, (inch-lbs./min.) Nm/min (174.4) 19.70 Physical Properties Shore A 53.7 Tensile, (psi) KPa (1160) 7998 % Elongation 415 100% Modulus, (psi) KPa (343) 2365 Tear (die B), (ppi) Kg/m (239) 4268 Compression Set, percent; 22 hours at 177 °C 11.3 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Low Compression Set Additive is t-Butyl Ammonium Acetate Experiment 1 Amount of Additive 273 MDR at (250 °F) 121°C T02, seconds 56 T90, seconds 187 Max. Torque, (inch-lbs.) Nm (16.75) 1.89 Peak Rate, (inch-lbs./min.) Nm/min (15.4) 1.74 MDR at (350 °F) 177°C T02, seconds 08 T90, seconds 56 Max. Torque, (inch-lbs.) Nm (19.29) 2.18 Peak Rate, (inch-lbs./min.) Nm/min (34.9) 3.94 Physical Properties Shore A 53 Tensile, (psi) KPa (1012) 6977 % Elongation 347 100% Modulus, (psi) KPa (318) 2192 Tear (die B), (ppi) Kg/m (219) 3911 Compression Set, percent; 22 hours at 177 °C 23 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - 20 wt.% Hexamethylguanidinium Bromide in Methanol Experiment 1 2 3 Amount of Additive 50 100 200 MDR at (250 °F) 121°C T02, seconds 60 122 T90, seconds 139 332 Max. Torque, (inch-lbs.) Nm (18.07) 20.42 (11.32) 1.28 Peak Rate, (inch-lbs./min.) Nm/min (37.1) 4.19 (3.40) 0.38 MDR at (350 °F) 177°C T02, seconds 04 14 54 T90, seconds 17 42 189 Max. Torque, (inch-lbs.) Nm (20.54) 2.32 (19.10) 2.16 (17.87) 2.02 Peak Rate, (inch-lbs./min.) Nm/min (163.5) 18.47 (52.0) 5.88 (12.6) 1.42 Physical Properties Shore A 51.9 50.7 49.7 Tensile, (psi) KPa (1032) 7115 (1054) 7267 (1119) 7715 % Elongation 415 442 504 100% Modulus, (psi) KPa (314) 2165 (293) 2020 (270) 1862 Tear (die B), (ppi) Kg/m (213) 3804 (232) 4143 (203) 3625 Compression Set, percent; 22 hours at 177 °C 18.4 12.3 12.0 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - 20 wt.% Hexamethylguanidinium Tetrafluoroborate in Methanol Experiment 1 2 Amount of Additive 200 400 MDR at (250 °F) 121°C T02, seconds 65 75 T90, seconds 129 134 Max. Torque, (inch-lbs.) Nm (18.22) 2.06 (16.19) 1.83 Peak Rate, (inch-lbs./min.) Nm/min (54.4) 6.15 (35.8) 4.04 MDR at (350 °F) 177°C T02, seconds 04 04 T90, seconds 14 15 Max. Torque, (inch-lbs.) Nm (17.76) 2.01 (16.98) 1.92 Peak Rate, (inch-lbs./min.) Nm/min (153.8) 17.38 (149.4) 16.88 Physical Properties Shore A Tensile, (psi) KPa % Elongation 100% Modulus, (psi) KPa Tear (die B), (ppi) Kg/m Compression Set, percent; 22 hours at 177 °C 22.3 26.6 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - 20 wt.% Hexamethylguanidinium Chloride in Methanol Experiment 1 2 Amount of Additive 50 100 MDR at (250 °F) 121°C T02, seconds T90, seconds Max. Torque, (inch-lbs.) Nm Peak Rate, (inch-lbs./min.) Nm/min (49.9) 5.64 (17.1) 1.93 MDR at 350 °F (177°C) T02, seconds 03 05 T90, seconds 14 29 Max. Torque, (inch-lbs.) Nm (18.56) 2.10 (17.05) 1.93 Peak Rate, (inch-lbs./min.) Nm/min (159.7) 18.04 (108.8) 12.29 Physical Properties Shore A Tensile, (psi) KPa % Elongation 100% Modulus, (psi) KPa Tear (die B), (ppi) Kg/m Compression Set, percent; 22 hours at 177 °C 38.0 21.4 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Low Compression Set Additive is Alkylguanidinium Chloride Experiment 1 Amount of Additive 300 MDR at (250 °F) 121°C T02, seconds 75 T90, seconds 141 Max. Torque, (inch-lbs.) Nm (19.7) 2.23 Peak Rate, (inch-lbs./min.) Nm/min (41.6) 4.70 MDR at 350 °F T02, seconds 05 T90, seconds 16 Max. Torque, (inch-lbs.) Nm (19.2) 2.17 Peak Rate, (inch-lbs./min.) Nm/min (158.3) 17.88 Physical Properties Shore A 52.0 Tensile, (psi) KPa (1211) 8350 % Elongation 445 100% Modulus, (psi) KPa (333) 2296 Tear (die B), (ppi) Kg/m (241) 4304 Compression Set, percent; 22 hours at 177 °C 20.5 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Low Compression Set Additive is a Mixture of Alkylguanidinium salts Experiment 1 Amount of Additive 300 MDR at (250 °F) 121°C T02, seconds 89 T90, seconds 200 Max. Torque, (inch-lbs.) Nm (19.1) 2.16 Peak Rate, (inch-lbs./min.) Nm/min (22.9) 2.59 MDR at (350 °F) 177°C T02, seconds 06 T90, seconds 19 Max. Torque, (inch-lbs.) Nm (19.2) 2.17 Peak Rate, (inch-lbs./min.) Nm/min (141.1) 15.94 Physical Properties Shore A 52.5 Tensile, (psi) KPa (1082) 7460 % Elongation 386 100% Modulus, (psi) KPa (345) 2379 Tear (die B), (ppi) Kg/m (229) 4089 Compression Set, percent; 22 hours at 177 °C 16.8 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Low Compression Set Additive is a Mixture of Primary Guanidinium Chlorides Experiment 1 Amount of Additive 300 MDR at (250 °F) 121°C T02, seconds 70 T90, seconds 147 Max. Torque, (inch-lbs.) Nm (19.5) 2.20 Peak Rate, (inch-lbs./min.) Nm/min (49.9) 5.64 MDR at (350 °F) 177°F T02, seconds 04 T90, seconds 15 Max. Torque, (inch-lbs.) Nm (18.90) 2.13 Peak Rate, (inch-lbs./min.) Nm/min (170.2) 19.23 Physical Properties Shore A 52.6 Tensile, (psi) KPa (1215) 8377 % Elongation 377 100% Modulus, (psi) KPa (337) 2323 Tear (die B), (ppi) Kg/m (237) 4232 Compression Set, percent; 22 hours at 177 °C 16.4 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Low Compression Set Additive is Pyridine N-Oxide Experiment 1 Amount of Additive 300 MDR at (250 °F) 121°C T02, seconds 111 T90, seconds 279 Max. Torque, (inch-lbs.) Nm (17.4) 1.97 Peak Rate, (inch-lbs./min.) Nm/min (9.0) 1.02 MDR at (350 °F) 177°C T02, seconds 06 T90, seconds 21 Max. Torque, (inch-lbs.) Nm (18.9) 2.14 Peak Rate, (inch-lbs./min.) Nm/min (126.8) 14.33 Physical Properties Shore A 53.1 Tensile, (psi) KPa (1129) 7784 % Elongation 338 100% Modulus, (psi) KPa (331) 2282 Tear (die B), (ppi) Kg/m (230) 4107 Compression Set, percent; 22 hours at 177 °C 21.5 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Low Compression Set Additive is Pyridinium Chloride Experiment 1 Amount of Additive 300 MDR at (250 °F) 121°C T02, seconds 62 T90, seconds 100 Max. Torque, (inch-lbs.) Nm (18.3) 2.07 Peak Rate, (inch-lbs./ min.) Nm/min (22.4) 2.53 MDR at (350 °F) 177°C T02, seconds 05 T90, seconds 17 Max. Torque, (inch-lbs.) Nm (18.7) 2.11 Peak Rate, (inch-lbs./min.) Nm/min (143.0) 16.16 Physical Properties Shore A 51.7 Tensile, (psi) KPa (1206) 8315 % Elongation 440 100% Modulus, (psi) KPa (334) 2303 Tear (die B), (ppi) Kg/m (247) 4411 Compression Set, percent; 22 hours at 177 °C 14.7 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Low Compression Set Additive is a Mixture of Piperidinium Chlorides Experiment 1 Amount of Additive 300 MDR at (250 °F) 121°C T02, seconds 59 T90, seconds 174 Max. Torque, (inch-lbs.) Nm (18.6) 2.10 Peak Rate, (inch-lbs./min.) Nm/min (19.6) 2.21 MDR at (350 °F) 177°C T02, seconds 05 T90, seconds 18 Max. Torque, (inch-lbs.) Nm (19.5) 2.20 Peak Rate, (inch-lbs./min.) Nm/min (148) 16.72 Physical Properties Shore A 53.5 Tensile, (psi) KPa (1133) 7812 % Elongation 420 100% Modulus, (psi) KPa (345) 2379 Tear (die B), (ppi) Kg/m (220) 3929 Compression Set, percent; 22 hours at 177 °C 14.7 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Low Compression Set Additive is Glycine Experiment 1 Amount of Additive 300 MDR at (250 °F) 121°C T02, seconds 66 T90, seconds 192 Max. Torque, (inch-lbs.) Nm (13.97) 1.58 Peak Rate, (inch-lbs./min.) Nm/min (21.7) 2.45 MDR at (350 °F) 177°C T02, seconds 05 T90, seconds 18 Max. Torque, (inch-lbs.) Nm (17.99) 2.03 Peak Rate, (inch-lbs./min.) Nm/min (127.5) 14.41 Physical Properties Shore A 51.6 Tensile, (psi) KPa (1185) 8170 % Elongation 455 100% Modulus, (psi) KPa (310) 2137 Tear (die B), (ppi) Kg/m (228) 4072 Compression Set, percent; 22 hours at 177 °C 15 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Low Compression Set Additive is a Mixture of Alkyl Glycinium Salts Experiment 1 Amount of Additive 300 MDR at (250 °F) 121°C T02, seconds 109 T90, seconds 261 Max. Torque, (inch-lbs.) Nm (16.7) 1.89 Peak Rate, (inch-lbs./min.) Nm/min (10.2) 1.15 MDR at (350 °F) 177°C T02, seconds 07 T90, seconds 20 Max. Torque, (inch-lbs.) Nm (17.70) 2.00 Peak Rate, (inch-lbs./min.) Nm/min (133.1) 15.04 Physical Properties Shore A 50.5 Tensile, (psi) KPa (1250) 8618 % Elongation 448 100% Modulus, (psi) KPa (298) 2055 Tear (die B), (ppi) Kg/m (241) 4304 Compression Set, percent; 22 hours at 177 °C 16.0 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Low Compression Set Additive is a Mixture of Glycinium Ethyl Ester Chlorides Experiment 1 Amount of Additive 300 MDR at (250 °F) 121°C T02, seconds 65 T90, seconds 183 Max. Torque, (inch-lbs.) Nm (15.9) 1.80 Peak Rate, (inch-lbs./min.) Nm/min (11.8) 1.33 MDR at (350 °F) 177°C T02, seconds 05 T90, seconds 18 Max. Torque, (inch-lbs.) Nm (19.03) 2.15 Peak Rate, (inch-lbs./min.) Nm/min (148.3) 16.76 Physical Properties Shore A 52.7 Tensile, (psi) KPa (1140) 7860 % Elongation 425 100% Modulus, (psi) KPa (333) 2296 Tear (die B), (ppi) Kg/m (237) 4232 Compression Set, percent; 22 hours at 177 °C 15.2 Cure Profile Determination of a Standard Liquid Injection Molding Formulation by Modulating Disk Rheometer and Physical Properties - Low Compression Set Additive is a Mixture of Siloxane Tethered Ammonium Chlorides Experiment 1 Amount of Additive 300 MDR at (250 °F) 121°C T02, seconds 54 T90, seconds 81 Max. Torque, (inch-lbs.) Nm (17.0) 1.92 Peak Rate, (inch-lbs./min.) Nm/min (57.4) 6.49 MDR at (350 °F) 177°C T02, seconds 03 T90, seconds 14 Max. Torque, (inch-lbs.) Nm (19.23) 2.17 Peak Rate, (inch-lbs./min.) Nm/min (167.4) 18.91 Physical Properties Shore A 53.8 Tensile, (psi) KPa (1099) 7577 % Elongation 378 100% Modulus, (psi) KPa (347) 2392 Tear (die B), (ppi) Kg/m (248) 4429 Compression Set, percent; 22 hours at 177 °C 21 Low Compression Set is Unaffected by Self-Bleed Additive Experiment 1 2 3 4 5 Amount of Additive, g 200 200 200 200 200 MDR at (250 °F) 121°C 43 39 48 44 48 T02, seconds 87 101 122 111 128 Max. Torque, (inch-lbs. ) Nm (7.11) 0.80 (7.77) 0.88 (11.56) 1.31 (11.88) 1.34 (12.82) 1.45 Peak Rate, (inch-lbs./min.) Nm/min (14.1) 1.59 (12.6) 1.43 (16.2) 1.83 (17.5) 1.98 (16.2) 1.83 MDR at (350 °F) 177°C T02, seconds 5 5 5 5 5 T90, seconds 23 30 24 24 25 Max. Torque, (inch-lbs. ) Nm (17.23) 1.95 (16.96) 1.92 (16.20) 1.83 (16.06) 15.48 Peak Rate, (inch-lbs./min. ) Nm/min (134.4) 15.19 (131.5) 14.86 (123.2) 13.92 (120.5) 13.61 (110.1) 12.44 Physical Properties Shore A 51.8 50.7 47.4 46.3 44.4 Tensile, (psi) KPa (1085) 7481 (1089) 7508 (1046) 7212 (1047) 7219 (1037) 7150 % Elongation 384 382 367 376 398 100% Modulus, (psi) KPa (301) 2075 (211) 1455 (242) 1668 (264) 1820 (236) 1627 Tear (die B), (ppi) Kg/m (202) 3607 (211) 3768 (242) 4322 (264) 4714 (236) 4214 Compression Set, percent; 22 hours at 177°C 15 16 Self-Bleed Additive, wt. % 0 1.0 2.0 3.0 4.0 Adhesion (psi)/Failure Mode KPa (360/C) 2482/C (360/P) 2482/P (350/P) 2413/P (350/P) 2413/P (400/A) 2758/A Cure Profile Determination of a Standard Millable Rubber Formulation by Modulating Disk Rheometer and Physical Properties - 50 wt.% Dodecyltrimethylammonium Chloride in iso Propanol Experiment 1 2 Amount of Additive control 300 MDR at (250 °F) 121°C T02, seconds 122 60 T90, seconds 302 338 Max. Torque, (inch-lbs.) Nm (12.85) 1.45 (7.15) 0.81 Peak Rate, (inch-lbs./min.) Nm/min (9.8) 1.11 (1.6) 0.18 MDR at (350 °F) 177°C T02, seconds 09 11 T90, seconds 24 61 Max. Torque, (inch-lbs.) Nm (14.39) 1.63 (15.55) 1.76 Peak Rate, (inch-lbs./min.) Nm/min (81.9) 9.25 (51.1) 5.77 Physical Properties Shore A 52.5 55.8 Tensile, (psi) KPa (1374) 9473 (1331) 9177 % Elongation 742 777 100% Modulus, (psi) KPa (320) 2206 (307) 2117 Tear (die B), (ppi) Kg/m (290) 5179 (289) 5161 Compression Set, percent; 22 hours at 177 °C 67 34.5 Adhesion Control Measurements RUN# 1 2 Adhesion Promoter Amount. 0.25% 0.00% LCSA (amount) NONE NONE Adhesion Enhancer, HOD 3 D 3vi OH, Amount 0% 0.50% MDR @ 250 oF T02 0:29 T90 0:58 Max. Torque 13.55 Peak Rate 55.2 MDR @ 350 oF T02 0:04 T90 0:15 Max. Torque 15 Peak Rate 134.2 Physicals Shore A 52 Tensile 1100 %Elong. 480 100% Mod. 270 Tear (die-B) 241 % Comp. Set 46 (22hrs. @ 177 oC) Adhesion (Failure Mode, A or C) 286 A < 100 A (Lap Shear) **Adhesion Promoter is, Bis-(trimethylsilylpropyl)-Fumarate Adhesion Enhanced By HO D 3 D 3 vi OH Run Number 1 2 3 4 Adhesion Promoter Amount. 0.25% 0.25% 0.25% 0.25% LCSA (amount) DTMAB (65ppm) NONE DTMAB (65ppm) DTMAC (300ppm) Adhesion Enhancer Amount 0.13% 0.50% 0.50% 0.50% MDR @ 250 oF T02 1:00 0:28 0:58 0:29 T90 2:42 0:56 3:27 1:20 Max. Torque 13.8 15.99 16.04 -------- Peak Rate 11.8 69.8 8.9 28.4 MDR @ 350 oF T02 0:05 0:04 0:07 0:04 T90 0:27 0:25 0:24 1:03 Max. Torque 17.53 17.47 18.16 16.97 Peak Rate 135.4 154.4 128.4 119.1 Physicals Shore A 53 54.7 55.2 Tensile 1166 1124 1110 %Elong. 478 419 409 100% Mod. 290 325 329 Tear (die-B) 269 225 217 % Comp. Set 19.9 42.7 22.3 21.2 (22hrs. @ 177 oC) Adhesion (Failure Mode, A or C) >314 C >350 C >283 C 479 C (Lap Shear) **Adhesion Promoter is Bis-(trimethylsilylpropyl)-Fumarate Adhesion Enhanced By HOD 25 D vi OH RUN# 1 Adhesion Promoter Amount. 0.25% LCSA (amount) DTMAC (300 ppm) Adhesion Enhancer Amount 0.50% MDR @ 250 oF T02 0:36 T90 1:39 Max. Torque 10.08 Peak Rate 19.6 MDR @ 350 oF T02 0:04 T90 0:24 Max. Torque 16.14 Peak Rate 128.8 Physicals Shore A 53 Tensile 1090 %Elong. 392 100% Mod. 312 Tear (die-B) 194 % Comp. Set 24.3 (22hrs. @ 177 oC) Adhesion (Failure Mode, A or C) 430 C (Lap Shear) **Adhesion Promoter is Bis-(trimethylsilylpropyl)-Fumarate Adhesion Enhanced By HOD 10 D vi OH RUN# 1 Adhesion Promoter Amount. 0.25 LCSA (amount) DTMAC (300ppm) Adhesion Enhancer Amount 0.50% MDR @ 250 oF T02 43 T90 123 Max. Torque 5.49 Peak Rate 7.5 MDR @ 350 oF T02 5 T90 78 Max. Torque 17.51 Peak Rate 115.6 Physicals Shore A 52.8 Tensile 1287 %Elong. 446 100% Mod. 318 Tear (die-B) 213 % Comp. Set 24.1 (22hrs. @ 177 oC) Adhesion (Failure Mode, A or C) >250C (Lap Shear) **Adhesion Promoter is Bis-(trimethylsilylpropyl)-Fumarate The data presented in tables 31 through 35 is a measure of adhesive and cohesive failure of a liquid injection molding composition bonded against a substrate composed of 30 weight percent glass filled polybutylene terephthalate. The bis-(trimethylsilylpropyl)-fumarate while it increases adhesive strength did not increase it to where there was cohesive failure (adhesive failure, failure mode A; cohesive failure, failure mode C). Table 10 demonstrates that an adhesion enhancer does not impart significant adhesion or cohesion to a liquid injection molding composition. Table 11a demonstrates that the low compression set additive compounds (LCSA) of the present invention do not affect adhesive or cohesive failure but do continue to improve compression set of the composition independently of the presence of any adhesion promoters or enhancers. The remaining tables are exemplary of the various adhesion enhancing compounds of the present invention. The abbreviations used in Tables 31 through 35 are as follows: 1) DTMAC stands for dodecyltrimethylammonium chloride and 2) DTMAB stands for dodecyltrimethylammonium bromide. Adhesion Enhanced By HOD 6 OH RUN # 1 Adhesion Promoter Amount. 0.25% LCSA (amount) DTMAC (300ppm) Adhesion Enhancer Amount 0.50% MDR @ 250 oF T02 0:36 T90 1:32 Max. Torque 10.62 Peak Rate 21.1 MDR @ 350 oF T02 0:04 T90 0:27 Max. Torque 16.66 Peak Rate 133.1 Physicals Shore A 53.2 Tensile 1275 %Elong. 448 100% Mod. 307 Tear (die-B) 197 % Comp. Set 27.3 (22hrs. @ 177 °C) Adhesion (Failure Mode, A or C) >413 C (Lap Shear) **Adhesion Promoter is Bis-(trimethylsilylpropyl)-Fumarate

Claims: A curable silicone elastomer composition comprising: 1) a silicone elastomer; 2) a salt of a cationic organic nitrogen compound; 3) bis(trimethoxysilylpropyl)fumarate; and 4) a silanol terminated polymer having the formula: (HO(R A1 ) 2 SiO 1/2 ) 2 (R A2 R A3 SiO 2/2 ) x ' (R A4 R A5 SiO 2/2 ) y ' where each of R A1 , R A2 , R A3 , and R A4 , is independently a one to forty carbon atom monovalent organic radical and R A5 is a two to forty carbon atom monovalent olefinic organic radical where the subscript y' may range from 0 to 50 and the subscript x' may range from 0 or 1 to 100, and a weight percent alkenyl content that ranges from zero when the subscript y' is zero to 25 weight percent when the subscript y' is greater than zero; and 5) a silicone soluble in said curable elastomer composition wherein said silicone has a viscosity of from 1 to 10,000 mPa.s (cps) at 25°C and is less soluble in said curable elastomer composition when said curable composition has been cured whereby said silicone bleeds out of said cured composition and wherein the compression set of the cured silicone elastomer is less than the compression set of the cured silicone elastomer free of said nitrogen compound. The curable composition of claim 1 wherein said curable silicone elastomer comprises: 1) an alkenyl organopolysiloxane and 2) a hydrogen containing silicon compound selected from the group consisting of hydrogen containing silanes and hydrogen containing organopolysiloxanes. The curable composition of claim 1 or claim 2 wherein said salt is selected from the group of salts comprising a cationic nitrogen cation having the formulas: 1) a monovalent cation having the formula: R N1 a R N2 b R N3 c R N4 d N + where R N1 is selected from the group consisting of hydrogen and one to forty carbon atom monovalent organic radicals and R N2 , R N3 , and R N4 are each independently selected from the group consisting of one to forty carbon atom monovalent organic radicals with the subscript a having values ranging from 0 to 3 and the subscripts b, c, and d independently having values ranging from 0 to 4 subject to the limitation that a + b + c + d is always equal to 4; 2) cations of cyclo-aliphatic nitrogen heterocycle having the formula: ((CH 2-e Q e ) f NR N5 g H 2-g where the subscript e is 0,1 or 2, Q is a one to forty carbon atom monovalent organic radical, the subscript f is an integer of 4 or greater, R N5 is a one to forty carbon atom monovalent organic radical and the subscript g is 0, 1 or 2; 3) cations of cyclo-aromatic nitrogen heterocycle compounds having the formula: ((CH 1-h Q h ) i NR N6 j H 2-j where the subscript h is 0 or 1, Q is a one to forty carbon atom monovalent organic radical, the subscript i is an integer of 5 or greater, R N6 is a one to forty carbon atom monovalent organic radical and the subscript j is 0 or 1; and 4) a cation of a nitrogen compound containing a nitrogen double-bonded to a carbon atom. The composition of claim 3 wherein said cation is dodecyltrimethylammonium ion. The composition of claim 3 wherein said cation is piperidinium ion. The composition of claim 3 wherein said cation is pyridinium ion. The composition of claim 3 wherein said cation is guanidinium ion. A curable silicone elastomer composition of any preceding claim which has been cured wherein said cured silicone elastomer adheres to a polymeric substrate. The composition of claim 8 wherein said polymeric substrate is selected from the group consisting of thermosetting polymers and thermoplastic polymers.

Inventors: BURKUS II FRANK STEVEN, JERAM EDWARD MATTHEW, RUBINSZTAJN SLAWOMIR, BURKUS, II, FRANK STEVEN, JERAM, EDWARD MATTHEW, RUBINSZTAJN, SLAWOMIR
Applicants: GEN ELECTRIC, GENERAL ELECTRIC COMPANY
Application year: 1999
Main classification: C08K5
IPC codes: C08K5, C08L83