POLYMERIZABLE FLUXING AGENTS AND FLUXING ADHESIVE COMPOSITIONS THEREFROM

Abstract: A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon-carbon double bonds wherein in one embodiment, at least one is within an acrylate or methacrylate group, and which may further contain at least one aromatic moiety; (b) a carboxylic acid neutralizing agent; (c) optionally, an effective amount of a cross-linkable diluent; (d) optionally, an effective amount of a source of free radical initiators; and (e) optionally, an effective amount of a resin. By employing an acrylate, methacrylate, or phenol in the structure of the adhesive flux, the cure temperature and moisture absorption characteristics can be significantly improved. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically. These devices include, printed circuit substrates, connectors, components, cables, and otherelectrical devices having metallization patterns to be soldered together by means of a solder-bumped pattern on one or both surfaces. Alternatively, a solder paste, comprising solder powder mixed with the fluxing agent of the present invention can be used. During the reflow step, the fluxing agent promotes wetting of the solder to the metallization patterns and, simulatneously, the fluxing agent itself cross-links to mechanically bond and encapsulate the surfaces and their metallizations. The compositions can also be used to formulate sinterable conductive ink.

Description: POLY ERIZABLE FLUXING AGENTS AND FLUXING ADHESIVE COMPOSITIONS THEREFROM FIELD OF THE INVENTION This invention relates generally to electronic circuits and more particularly to electrical interconnection techniques. BACKGROUND OF THE INVENTION In the assembly of electronic components, the solder bump interconnection method was developed to eliminate the expense, unreliability, and low productivity associated with manually wire bonding integrated circuit chips onto carrier or printed circuit substrates. The method utilizes solder bumps deposited on solder- wettabie metal terminations on the chip and a matching pattern of solder- wettabie terminations on the substrate. In the case of an upside down integrated circuit (flip chip), the flip chip is aligned to the substrate and all the joints are made simultaneously by melting the solder. Typically, the solder bumps are placed on the integrated circuit terminals while the chip is still in wafer form. To join me integrated circuit to the substrate, a flux, generally a no- clean, low residue flux, is placed on the substrate as a temporary adhesive to hold the integrated circuit in place. The assembly is subjected to a solder melting thermal cycle in an oven or furnace thereby soldering the chip to die substrate. The surface tension of the solder aids to self align the chip to the substrate terminals. After this reflow step, removing the flux residue from under the chip is difficult and requires sophisticated cleaning regimes. This is due, in part, to the close proximity of the chip to the substrate which typically is about 0.001 to 0.006 in. (25.4 to 150 μm). Therefore with conventional techniques the flux residues are generally left in the space between the chip and the substrate. For this reason, the residues must be inert to prevent subsequent corrosion of the assembly. The next step in the assembly process is to encapsulate the chip which permits the use of polymeric substrates in flip chip assembly process. Encapsulation can result in significant improvements in the fatigue life of the solder bumps as compared to an unencapsulated flip chip assembly. The technique of underfill encapsulation has gained considerable acceptance by the electronics industry and the materials of choice for underfill encapsulation have been epoxies. Polymeric substrate materials have higher coefficients of thermal expansion than that of a silicon chip, but the expansion coefficients of the underfill encapsulant epoxies can be adjusted with the addition of ceramic fillers to reduce the level of thermal stress that develops between the substrate and the encapsulant. Most underfill encapsulation procedures involve dispensing liquid encapsulants onto one or more edges of the flip chip assembly. Capillary action draws the encapsulant material through the minute gap between the chip and the substrate. As is apparent, this underfill process can be quite slow due to the small dimensions. The gap must be completely filled and, after the epoxy is cured, be free of voids in order to provide adequate protection for the device and reduce fatigue of the solder joints. The flux residues remaining in the gap reduce the adhesive and cohesive strengths of the underfill encapsulating adhesive. As is apparent, the multi-step assembly process has a number of deficiencies. Furthermore, as the size of chips increases, the limiting effect of capillary action becomes more pronounced and renders the encapsulation procedure even more time consuming. As a result, it is expected that there will be a greater tendency for the epoxy polymer to separate from the ceramic filler during application. In addition, there will be more void spaces. In an attempt to alleviate these problems associated with flip chip assembly, the industry has employed polymer flux compositions. Prior art polymer flux compositions suitable for assembling electronic components and particularly flip chips generally comprise an elaborate mixture comprising a thermosetting or thermoplastic resin, a flux activator that is generally halogenated, and a chemically protected curing agent which can also function as a fluxing agent. See. for example, U.S. Patents 5 ,088.189. 5, 128.746, 5, 136.365. 5, 167,729. and 5.417.771 , and EP 0 620 077 Al . Prior an flux compositions containing thermosetting resins are undesirable due to their high viscosity and shoπ shelf life which is typically less than one week. Moreover, conventional multi-component fluxing compositions are intrinsically not self-crosslinking. They require resins, such as epoxy resins, for crosslinking thereby further limiting the shelf life or pot life of the material and decreasing flux activity substantially. In addition, chemical protection of the carboxylic acid in the fluxing agent was essential to achieving stability and preventing premature reactions. This results in an acid that is functioning at much less than its full strength with the metal oxides. As is apparent, the art is in search of more efficient chip assembly techniques that can consistently produce an essentially voidless underfill encapsulation. In particular, there is a need for a soldering flux that can remove oxides and promote soldering without use of ionic or halogen- containing flux activators and that can serve as an adhesive to provide improved bonding at electrical interconnections. SUMMARY OF THE INVENTION The present invention is based in part on the discovery of a thermally curable adhesive composition that comprises a fluxing agent that also acts as an adhesive. The composition includes: (a) a fluxing agent represented by the formula RCOOH. wherein R comprises a moiety having two or more carbon- carbon double bonds: (b) a carboxylic acid neutralizing agent: (c) optionally, an effective amount of a crosslinkable diluent; (d) optionally, an effective amount of a source of free radical initiators; and (e) optionally, an effective amount of a resin. In a preferred embodiment, at least one of the carbon-carbon double bonds in R is within an acrylate or methacrylate group. In another embodiment. R contains an aromatic moiety. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically. These devices include, for example, printed circuit substrates, connectors, components, cables, and other electrical devices having metallization patterns to be soldered together by means of a solder- bumped pattern on one or bom surfaces. Alternatively, a solder paste, comprising solder powder mixed with the fluxing agent of the present invention can be used. During the reflow step, the fluxing agent promotes wetting of the solder to the metallization patterns and, simultaneously, the fluxing agent itself crosslinks to mechanically bond and encapsulate the surfaces and their metallizations. Unlike the polymer flux mixtures of the prior art, the inventive fluxing agent integrates within a single molecule a carboxylic acid group that provides the fluxing action for the soldering process without need of corrosive ions or halogens, and polymerizable carbon-carbon double bonds that can polymerize upon application of heat, with or without the addition of free radical initiators, to form a high-strength solid adhesive polymer. This is accomplished without generating gases, water, or other harmful by-products. Moreover, after the thermally curable adhesive composition is cured, the residues and any remaining fluxing agent do not need to be washed away or removed since they are non-corrosive. Because these residues are located permanently between the two surfaces joined together they do not interfere with test probes. In a preferred embodiment, the fluxing agent contains acrylate or methacrylate groups which yields fast curing rates; their presence reduces the concentration of carboxylic acid and increases the hydrophobicity of d e adhesives. In addition, the introduction of hydrophobic groups into the polymer backbone, such as aromatic or fluorine moieties, dramatically enhances me water resistance. In addition, any unreacted carboxylic acid from me fluxing agent after the fluxing reaction present in the high- strength solid adhesive polymer is neutralized by die action of the carboxylic acid neutralizer. This neutralization reaction eliminates the pendant acid groups which could promote electromigration of metals in humid environments if left unreacted. Preferably, compounds that form the carboxylic acid neutralizing agent contain at least one epoxide moiety which reacts with me carboxyi group during the fluxing reaction that occurs during soldering. The epoxide consumes the carboxylic acid moiety by opening the epoxide three-member ring to form an ester and a hydroxyl group by the following reaction: R1-C=0 O O H R1 _ " °" H * R2- - -R3 R2-C-C-S3 I H In the absence of a catalyst, the above reaction proceeds slowly at temperatures below about 180 °C with the reaction rate depending in part on the particular neutralizing agent. Therefore, the neutralizing agent does not interfere significantly with the fluxing activity of the fluxing agent. The inventive thermally curable adhesive composition achieves good flux activity without the need for additional aggressive flux activators. The composition does not evolve gases that can create voids or bubbles in the composition during and after curing. Solvents are not required as the fluxing agent is itself a low viscosity liquid at soldering temperatures. The adhesive strengths of the cured composition are comparable to the adhesion of copper cladding on FR4 epoxy printed circuit board laminates. Finally, the cured composition becomes a high corrosion resistant adhesive at high temperatures having a glass transition temperamre above 150 °C and a coefficient of thermal expansion less than 80 ppm/ 0 C. After being cured, the thermally curable adhesive composition exhibits very low moismre absorption which minimizes the corrosion of the flip chip and reduces the tendency of the polymers to hydrolyze. BRIEF DESCRIPTION OF THE DRAWINGS As used herein, like reference numerals will designate similar elements in the various embodiments, wherein: Figures 1 and 3 are each a cross sectional view of a device and substrate prior to attachment of the two surfaces to be interconnected: Figures 2 and 5 are each a cross sectional view of the device and substrate surfaces after bonding; and Figure 4 is a cross sectional view of a flip chip temporarily attached without solder reflow for testing or burn in prior to reflow. DETAILED DESCRIPTION OF THE INVENTION The invention is directed to fluxing adhesive compositions that include a fluxing agent comprising a single active component which is capable of functioning as both a primary fluxing agent and a crosslinking monomer. Generally, depending upon the intended end use, the inventive thermally curable adhesive composition comprises (a) a fluxing agent having a carboxylic acid group and one or more carbon-carbon double bonds, (b) a carboxylic acid neutralizing agent; (c) optionally, a crosslinkable diluent, (d) optionally, a free- radical initiator, and (e) optionally, a resin. In addition the thermally curable adhesive composition may include a solvent for adjusting the viscosity. Other viscosity modifiers, thickeners and mixotropic agents may also be added. Fillers, such as silica powder, can be employed for increased modulus and lower thermal coefficient of expansion. 1. Fluxing Agents. The fluxing agent is a carboxyi containing compound that has the strucmre RCOOH. wherein R comprises a moiety which include two or more carbon-carbon double bonds. For high flux activity due to the presence of multiple carboxylic acids, the preferred fluxing agent is a carboxylic acid that is selected from me group consisting of compounds represented by Formulae I, II. and III, and mixtures thereof, HOOCCH=CH(O)COR 18 OC(O)CH=CHCOOH (I) R 2 H 2 C(HCOR n ) n CH 2 OR 3 (II) [X'X X X 4 ]C (III) wherein R 18 is an alkyl having 1 to 16 carbons, preferably 1 to 9 carbons, and more preferably 1 to 3 carbons, wherein n is an integer from 1 to 16 preferably an integer from 1 to 9, and more preferably an integer from 1 to 3, wherein each of R 1 , R 2 , ...R π , is independently selected from -C(O)CH = CHCOOH, and H, wherein X 1 , X 2 , X 3 , and X 4 , are each independendy selected from -CH 2 OH, -CH 2 OC(O)CH=CHCOOH, and H, with the proviso that not all of X 1 , X 2 , X 3 , and X 4 are H, and preferably only one of said X 1 , X 2 , X 3 , and X 4 is H. A preferred fluxing adhesive composition that has a lower curing temperamre, faster curing rate and increased moismre resistance includes a fluxing agent that has the general strucmre R'COOH, wherein R' comprises a moiety having two or more carbon-carbon double bonds, of which preferably at least one is within an acrylate or methacrylate moiety, that is, R' contains at least one acrylate (-C(O)CH = CH 2 ) or methacrylate (-C(O)C(CH 3 )=CH 2 ) group. (Preferably, there are 1 to 5 groups.) For high flux activity due to the presence of multiple carboxylic acids, a preferred fluxing agent is a carboxylic acid that is selected from the group consisting of compounds represented by Formulae IV. V, VI and mixtures thereof, HOOCCH = CH(O)COR' 18 OC(O)CH =CHCOOH (IV) R' 2 H 2 C(HCOR' n ) n CH 2 OR' 3 (V) [Y'Y : Y 3 Y 4 ]C (VI) where R' 18 is a substituted alkyl moiety containing at least one acrylate or methacrylate moiety and said substimted alkyl moiety comprising a chain having 1 to 16 carbons, preferably 1 to 9 carbons, and more preferably 1 to 3 carbons, and wherein n is an integer from 1 to 16, preferably an integer from 1 to 9, and more preferably an integer from 1 to 3 , wherein each of R' 1 , R' 2 , ...R' π , is independently selected from -C(O)CH = CHCOOH, -C(O)CH = CH 2 , -C(O)C(CH 3 )=CH 2 , and H, and wherein Y\ Y 2 , Y\ and Y 4 , are each independently selected from -CH 2 OH, -CH 2 OCOCH =CH 2 , -CH 2 OCOC(CH 3 ) =CH 2 , -CH 2 OC(O)CH = CHCOOH and H with the proviso that not all of Y 1 , Y , Y 3 , and Y 4 are H, and preferably not more than one of said Y 1 , Y 2 , Y 3 , and Y 4 is H. Incorporating an acrylate and/or methacrylate in e strucmre can reduce the curing temperamre of the adhesive polymer since the carbon-carbon double bonds in me acrylate or methacrylate tend be more reactive than most other such double bonds. Reducing the crosslink temperamre of the double bonds tends to make the adhesive flux more compatible with current practice in the field wherein solder reflow is achieved in a thermal cycle having a peak temperamre of 230 °C. The lower crosslink temperamre can produce an adhesive flux formulation that is fully crosslinked after only one or two passes through the solder reflow thermal cycle. The acrylate and methacrylate will also tend to repel moismre and reduce the absorption of water in the cured polymer. A particularly preferred acrylate containing fluxing agent is glycidyl methacrylate which exhibits low viscosity, high flux activity and excellent curing characteristics, as further described in Example 4. The fluxing agent typically comprises about 0.01 %-100% . preferably about 5 %-80% , and more preferably about 10%-70% by volume of the thermally curable adhesive composition. The fluxing agents of ie present invention exhibit flux activities that are superior to that of prior art polymer-fluxing agent mixmres. Since the inventive fluxing agents are intrinsically self-crosslinking, the thermally curable adhesive composition does not require the use of epoxy resins for crosslinking, though an epoxy may be used in the neutralizing agent. As a corollary, the shelf life or pot life of the composition is long and its flux activity high relative to conventional polymer- fluxing mixmres that include epoxy resins. Further, the adhesion properties, mechanical integrity, and corrosion resistance achieved with the fluxing agents are superior to those achieved with prior art polymer fluxing agents because there is no need to add aggressive fluxing activators. The inventive fluxing agents are fully crosslinked and all components thereof are chemically immobilized upon curing. Even the reaction by-products of flux deoxidization of the metals may be chemically bound in the polymer matrix. Carboxylic acids function well as fluxing agents to remove oxides from metals. In addition, carboxylic acids are also very effective crosslinking moieties when present in their reactive form in a fluxing composition containing a suitable thermosetting resin, such as an epoxy. For this reason, in die prior art, chemical protection of the carboxylic acid was essential to achieving stability and preventing premature reactions. Protection was achieved by binding the fluxing agent with a chemically- or thermally-triggered species so that it becomes reactive only at or near the time that the solder melts. However, with the present invention, no such protection is necessary because the compositions can be formulated with only minimal amounts of components that can crosslink with the carboxylic acid moiety. This results in a fluxing agent that can function at near its full strength with the metal oxides to produce fluxing that is superior to any heretofore polvmerizable fluxing agent. The flux activity of the inventive fluxing agent in some applications may be too high thereby requiring dilution of the fluxing agent to prevent formation of undesirable gaseous by-products. With the inventive fluxing agent, the principal crosslinking mechanism occurs at the carbon-carbon double bonds existing in die fluxing agent molecule and not at the carboxylic acid groups. The carboxylic acids do not react with the double bonds, therefore on its own. in the absence of other molecules that can react with the carboxylic acid, the fluxing agent does not polymerize at ambient temperatures. It is at elevated temperatures that the double bonds begin to open and react with other opened double bonds to crosslink. Since each fluxing agent molecule contains at least two double bonds, the molecules crosslink into polymeric networks. By reducing or eliminating the need for a separate thermosetting resin in the flux composition, as is required in the prior art, the flux activity can be kept very high without concern about pre-maturely crosslinking the thermosetting resin. By crosslinking the fluxing agent itself, an adhesive having a higher glass transition temperamre and lower coefficient of thermal expansion can be created without sacrificing fluxing activity. Another preferred fluxing-adhesive composition, one that has very high moisture resistance, comprises a fluxing agent with the general structure R"COOH, wherein R" comprises a moiety having two or more carbon-carbon double bonds, of which preferably at least one is within an acrylate or methacrylate moiety and R" further contains at least one aromatic moiety, which is an unsaturated aromatic carbocylic group having a single ring (e.g. , phenyl) or multiple condensed rings (e.g.. iiaphthyl) which condensed rings may or may not be aromatic. The aromatic moiety also includes substituted aromatic moieties. The R" group can also be fluorinated. For high flux activity due to the presence of multiple carboxylic acids, me preferred fluxing agent is a carboxylic acid mat is selected from the group consisting of compounds represented by Formulae VII and mixmres thereof. A particularly preferred aromatic -containing fluxing agent is one made from bisphenol A epoxy, as described in Example 1 , which exhibits significant hydrophobicity. The generalized strucmre for carboxylic acids containing two or more carbon-carbon double bonds and also containing aromatic moieties is: R 19 -Ar-R 20 (VII) tawωchAιιs f j - - in which R 21 is -C(O)CH=CH-COOH, -C(O)CF 2 CF 2 CF 2 COOH, or H. 2. Carboxylic Acid Neutralizing Agent. The carboxylic acid neutralizing agent is a compound mat has the structure R -X-R 2 , wherein X comprises a carboxy lie-neutralizing moiety such as, for example, epoxide, -NH- or -CH(OH)- group and wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons, preferably 1 to 9 carbons, and more preferably 1 to 3 carbons, and (iii) aromatic moiety which is an unsaturated aromatic carbocylic group having a single ring (e.g. , phenyl) or multiple condensed rings (e.g. , naphthyl) which condensed rings may or may not be aromatic. The neutralizing agent may also be a compound containing isocyanate or cyanate ester groups, or any other group that can react with die carboxylic acid. The aromatic moiety also includes substituted aromatic moieties. The alkyl, alkylene. or aromatic moieties can include one or more carbon-carbon double bonds and/or one or more of X groups. To neutralize the carboxylic acids without the formation of condensation by-products, me preferred neutralizing agent is an epoxide that is selected from the group consisting of compounds represented by Formulae VTTI. DC, and X, and mixtures thereof, H(CHOCH)R l (VUI) H(CHOCH)R (CHOCH)H (IX) R'(CHOCH)R 2 (X) wherein R 1 and R 2 are defined above and R 4 is preferably selected an alkyl, alkylene, or aromatic group. Preferably R 1 , R 2 , and R 4 is selected from: Another preferred neutralizing ageni has the general structure H(CHOCH)R 5 , wherein R 5 comprises a moiety having one or more carbon- carbon double bonds, of which preferably at least one is contained in an acrylate or methacrylate moiety, that is, R 5 contains at least one acrylate (- C(O)CH=CH 2 ) or methacrylate (-C(O)C(CH 3 )=CH 2 ) group. (Preferably, there are 1 to 5 groups, for example, glycidyl methacrylate: 1.2-epoxy-7-octene; and l ,2-epoxy-9-decene.) In the process of neutralizing the carboxylic acid of d e fluxing agent, the neutralizing agent becomes incorporated, i.e. , crosslinked. into the cured adhesive composition. Furthermore, incorporation an acrylate and/or methacrylate in the strucmre of die carboxylic neutralizing agent will also to reduce me curing temperamre of the adhesive polymer since the carbon-carbon double bonds in die acrylate or methacrylate tend to be more reactive than most other such double bonds. Reducing the crosslink temperature of the double bonds tends to make the adhesive flux more compatible with current practice in the field wherein solder reflow is achieved in a d ermal cycle having a peak temperamre of 230°C. The lower crosslink temperature can produce an adhesive flux formulation that is fully crosslinked after only one or two passes through the solder reflow thermal cycle. The acrylate and methacrylate will also tend to repel moismre and reduce me absorption of water in the cured polymer. A particularly preferred acrylate containing neutralizing agent is glycidyl methacrylate which exhibits low viscosity and high flux activity as further described in Example 4. The amount of neutralizing agent employed is preferably proportional to the amount of fluxing agent present and the neutralizing agent typically ι: comprise about 0.01 %-90 preferably about 5 %-50% , and most preferably about 10%-50% by volume of the thermally adhesive composition. Preferably, no more than a stoichiometric amount (with the carboxylic acid prior to fluxing reactions) is employed to neutralize the carboxylic acid in the fluxing agent. Thermally curable adhesive compositions where the amount of neutralizing agent is substantially higher than the required stoichiometric amount will generally exhibit inferior fluxing properties, whereas compositions with substantially less than stoichiometric amounts of neutralizing agent will generally exhibit poor electrical insulation and high metallic electromigration when exposed to humid environments. Since the neutralizing agents are chemically linked with the carboxylic acid in the fluxing agent only slowly and at elevated temperatures, they reduce the fluxing activity of the adhesive flux minimally. As a corollary, the shelf life or pot life of the composition is long and its flux activity high relative to conventional polymer-fluxing mixmres that require epoxy resins. With the inventive fluxing agent, the principal crosslinking mechanism still occurs at the carbon-carbon double bonds existing in the fluxing agent molecule and not at the carboxylic acid groups. 3. Diluents. The presence of carbon-carbon double bond(s) in the fluxing agent molecule allows much flexibility in die formulation of a flux composition with exceptional thermomechanical propeπies. This is achieved by the addition of double bond containing diluents that can also crosslink with the flux to create a superior adhesive. This technique permits the design of fluxing adhesive compositions that can aπain high crosslink densities, which are desirable for good thermomechanical propeπies and good adhesion. Moreover, this is accomplished without the concern of premature crosslinking and reduced pot life associated with the prior an. Preferred diluents include, for example, (a) penta eryethritol tetraacrylate, C(CH 2 OOCCH=CH 2 ) 4 , (b) triailyl- 1,3.5- triazine-2,4,6 (lH,3H,5H)-trione, (c) tris[2-(acryloxy)ethyl]isocyanurate, (d) glycerol propoxylate triacrylate and mixmres thereof. Diluents (b) and (c) have the following structures: (b) (c) Other double bond compounds, many of which are commercially available, including, for example, diallyl phthalate and divinyl benzene can also be used. Hydrophobic diluents as described are preferred but hydrophilic diluents can also be employed when appropriate. The diluent when employed typically can comprise up to about 90% , preferably between about 5%-80%, and more preferably between about 50% -80% by volume of me thermally curable adhesive composition. One benefit of employing hydrophobic diluents is mat their presence tends to reduce die amount of water which die cured adhesive composition will absorb. The reason is that the fluxing agent, when crosslinked, will have active carboxylic groups that can attract water, even though ±ese carboxylic groups, being part of a network, are immobile. Water acts as a plasticizer which softens the cured adhesive composition. The use of hydrophobic diluents which are crosslinked to the fluxing agent will counteract the hydrophilic effects of me carboxylic acid groups. Indeed, d e cured adhesive compositions containing hydrophobic diluents can have less than 2% (wt) moisture when exposed to ambient conditions. 4. Free Radical Initiators. While e thermally curable adhesive composition can be cured using heat alone, the cross linking reaction can be initiated and facilitated by die presence of free-radicals, including, for example, those generated by benzoyl peroxide, butyl hydroperoxide, 2,2'- azobisisobutyronitrile, and mixmres thereof. These free radical initiators or sources are commercially available. Free-radicals can be created in-situ by exposure of the free-radical initiator to heat, radiation, or other conventional energizing sources. Introduction of an appropriate free-radical initiator can accelerate die onset of crosslinking to the desired moment in a solder reflow operation. The presence of a small amount of free-radical crosslinking initiator in the fluxing agent can be used to control the rate and die temperamre of crosslinking of the fluxing agent, ensuring effective fluxing action and strong adhesion of the fluxing agent to d e substrates upon curing. The free radical initiator when employed typically comprises up to about 5 % , preferably between about 0%-3 % , and more preferably about 0.3 %-l % by weight of the thermally curable adhesive composition. 5. Resins. The tiiermally curable adhesive composition does not require resins; fuπher, compositions that do not include resins tend to have longer pot lives and lower viscosities during solder reflow. However, as an option, a resin can be employed and it functions to increase the adhesion of d e cured composition to the substrate and to increase me cohesive strength and glass transition temperamre of the cured composition. The resin may be any suitable resin that is compatible (i.e. , blendable) with die fluxing agent. By blendable is meant that the resins do not have to be chemically bonded to me fluxing agent and/or diluent. Resins which meet tiiese requirements include, but are not limited to, epoxies, phenolics, novalacs (both phenolic and cresolic), polyurethanes, polyimides, bismaleimides, maleimides, cyanate esters, polyvinyl alcohols, polyesters, and polyureas. Preferred resins 1,4- cyclohexanedimethanol diglycidyl ether, 3 ,4-epoxycyclohexylmethyl 3,4- epoxycyclohexanecarboxylate, N,N-diglycidyl-4-glycidyl-oxyanilline, bisphenol A based epoxy resins, and mixmres thereof. These are commercially available. Suitable compounds (including polymers) can also be modified to form resins mat are blendable with the diluent and/or the carboxylic acid fluxing agent. Examples of such compounds are acrylics, rubbers (butyl, nitrile. etc.), polyamides, polyacrylates, polyethers. polysulfones. polyethylenes, polypropylenes, polysiloxanes, polyvinyl acetates/polyvinyl esters, polyolefms. cyanoacrylates, and polystyrenes. Generally, any compound can function as a resin if it can be modified to contain at least one of the following illustrative functional groups that act as reactive sites for polymerization: anhydrides, carboxylic acids, amides, amines, alcohols/phenols, nitriles, carbamates, isocyanates, sulfonamides, semicarbazones, oximes, hydrazones, cyanohydrins. ureas, phosphoric esters/acids, diiophosphoric esters/acids, phosphonic esters/acids, phosphites, phosphonamides. and sulfonic esters/acids. For example, a polyolefin which has no reactive sites for binding and has poor adhesive propeπies is typically not a suitable resin, however, a carboxylated polyolefin functions well when matched witii a suitable crosslinking agent. A combination of these and other resins, such as non-crosslinkable thermoplastic resins, may also be used as resins. Resins when employed can comprise up to about 80% , preferably between about 10% -80% , and more preferably about 60% -70% by volume of the thermally curable adhesive composition. In preparing the fluxing composition, the propoπions of the five components may be varied over a considerable range and still yield acceptable fluxing activity as well as good post cured material propeπies. Preferably, the fluxing composition employed does not produce gaseous byproducts mat can result in die formation of bubbles in the final cured composition. This can be achieved with ti ermally curable adhesive compositions preferably formulated as follows: a) Fluxing agent comprising about 5%-80% (vol.) of the composition; b) Neutralizing agent comprising about 0.1-90% (vol.) of the composition; c) Diluent comprising about 5 %-80% (vol.) of the composition; d) Free radical initiator comprising about 0%-3 % (wt) of the composition; and e) Resin comprising about 0%-80% (vol.) of the composition. It should be noted that some neutralizing agents can also function as resins. Therefore, when resins are employed, the amount can be kept to a minimum. Some thermally curable adhesive compositions having components within these ranges may exhibit undesirably high moismre absoφtion. low glass transition temperamres. or high coefficients of thermal expansions after cured, but tiiey remain useful as fluxing compositions in applications where these characteristics are not critical. Most preferably, the thermally curable adhesive composition after being cured has a coefficient of mermal expansion of about 25 ppm/°C, a glass transition temperamre in excess of 150 °C, electrical insulation resistance greater that 100 MegOhms according to IPC-TM-650 testing on the EPC-B-24 test board and moismre content of less than 2 % . These characteristics can be achieved with thermally curable adhesive compositions preferably comprising about 5%-35% (vol.) fluxing agent, a stoichiometric quantity of neutralizing agent and about 20%-80% (vol.) diluent. While, again, some of the fluxing agents within these ranges may exhibit high coefficient of thermal expansion or low glass transition temperamre when cured, they remain useful as fluxes in applications where these characteristics are not critical. In order for the thermally curable adhesive composition to achieve the largest spreading and wetting by the solder, it must achieve and maintain low viscosity up to die temperamre at which the solder melts and wets the metallizations. If the composition becomes too thick before the solder has melted, it will impede die flow of the solder melt and reduce the degree of metal soldering. For this reason, the curing of the composition must occur slowly relative to the time required to reach me melting point of the solder powder. This can be achieved by selection of the components with appropriate crosslinking temperamres and formulating the appropriate propoπions by use of a differential scanning calorimeter to control reaction rates and times. The thermally curable adhesive composition can also be used as a fluxing adhesive for use in sinterable conductive ink compositions that comprises: a) 1 % to 65 % (wt) of a high melting point metal or metal alloy powder, typically comprising Cu powder, however, other metals such as, for example, Ag, Au, Pt, Pd Be, Rh, Ni, Co, Fe, Mo. and high-melting point alloys tiiereof; b) 6% to 65 % (wt) of a low melting point metal or metal alloy powder (solder), typically comprising Sn, Bi, Pb, Cd, Zn, Ga, In, Hg, Sb, or an alloy thereof or other metal having a melting point mat is lower man that of the high melting metal powder in part (a); and c) 5 % to 50% (wt) of the thermally curable adhesive flux composition that also serves a flux composition and as an adhesive. Preferably the conductive ink composition comprises 13% to 65 % (wt) of the high melting point metal, 6% to 29% (wt) of the low melting point metal, and/or 5% to 35% (wt) of the tiiermally curable adhesive flux composition. Techniques for employing electrically conductive compositions are described in U.S. Patents 5,376,403, 5,538,789, and 5,565,267 which are incoφorated herein. During the curing process of the sinterable conductive ink compositions, in order for the solder alloy to readily wet the other powder and sinter, the principal requirement of me thermally curable adhesive composition is that the polymers not harden before melting of the solder powder is achieved. Additionally, after curing, the composition must act as an adhesive that strongly binds the cured ink composition to die printed circuit board substrate. The flux compositions of the instant invention are paπicularly suited for these applications. METHODOLOGY The thermally curable adhesive composition of me instant invention is paπicularly suited for attaching flip chips to a substrate wherein the fluxing agent serves also as an encapsulating adhesive. The compositions eliminate the need for the additional assembly steps of washing d e solder flux and then underfilling the chip-to-substrate gap with an encapsulating polymer adhesive, as is done in the prior an. An improved flip-chip process involves a single-step chip placement followed by solder reflow without the labor intensive underfill encapsulation steps. This improved process is possible if. prior to soldering, the bumped chips or substrate can be coated with a thick layer of the instant invention fluxing composition so that it effectively fluxes the soldering of d e interconnections then also hardens to form the solid encapsulant after soldering. The heat applied during the solder reflowing operation will also harden die adhesive to create a high-strength bond. 3597 Attachment of a substrate to a device is illustrated in Figure 1 wherein a flip chip 130 containing solder bumps 140 is positioned so that the solder bumps 140 and the active surface 150 are facing the substrate 100 and aligned with me metallization pattern 110 of the substrate 100. The thermally curable adhesive flux composition 120 is coated on the surface of die substrate and metallization pattern. Referring to Figure 2, die bumped chip 230 is moved into intimate contact with the metallization pattern 210. The thermally curable adhesive flux composition 220 wets the chip 230, insuring complete coverage of d e active surface 250 of the chip 230. The fillet 260 provides a continuous seal around the periphery of the chip 230 to protect the active surface 250 from environmental contamination. The fluxing agent contained in composition 220 coats the solder bumps 240 and the metallization pattern 10. The assembly 270 is reflowed in a conventional manner such as in an oven, causing the carboxylic acid in the fluxing agent of die composition to become reactive. reducing the oxides on the solder 240 and the metallization surface 210. and permitting alloying of the solder to the metal. After the reflow process, the fluxing agent in composition 220 and the other crosslinkable carbon-carbon double bonds in the composition, if present, crosslink to one another, hardening the composition to a solid form. Depending on the composition, a second hardening operation may be required by application of additional heat to completely harden die composition 220. During the reflow and hardening steps, the assembly is encapsulated by the composition. Since die encapsulant provides a continuous seal to protect die active surface 250 from environmental contamination, no further cleaning or encapsulating operations are required. It should be appreciated that although die drawings depict the encapsulation and connection of a flip chip 130 to a substrate, embodiments using other types of surface mounted components, cables, or connectors having solder bumps are within the scope of the invention. Similarly, instead of solder 3597 bumps, a solder paste comprising a solder powder and the thermally curable adhesive composition can be employed. Suitable solder powders comprise, for example, tin/lead, tin/lead/silver, and tin/lead/antimony solder powders. The inventive thermally curable adhesive composition is also suitable for soldering and mechanically attaching a flat cable to a printed circuit or flat panel display without the need for a separate connector. Another assembly technique involves formulating a curable adhesive composition which is solid at room temperamre, but melts without crosslinking at an elevated temperamre, e.g. Example 5. As shown in Figure 3. the molten curable adhesive composition 320 can be first applied to the solder bumped chip 130 and allowed to cool and harden to form a chip/adhesive/bump subassembly. This subassembly can be applied to the substrate 100 witii or without addition of any other flux. A small amount of heat may be used to soften the composition 320 so that it holds the chip 230 in place until die solder is reflowed as shown in Figure 4. If allowed to cool, this molten composition 320 can temporarily suppoπ the chip 230 in place for chip testing or burn in. The chip can tiius be easily removed should it malfunction. When it is desired to permanently attach the chip, the substrate and subassembly can be passed through a solder reflow oven thereby melting the solder bumps 340. activating die flux in composition 420. forming permanent solder joints, and crosslinking the adhesive in the composition as shown in Figure 5. Another approach to the above involves adding a diluent to a mixmre of solid and liquid fluxing agent to create a somewhat sticky mixmre. The mixmre is applied to die chip by warming as described above, then hardened to form a somewhat pressure-sensitive adhesive. Placement of the chip on the substrate will then hold die chip in place until d e solder is reflowed. As is apparent, the thermally curable adhesive composition can be dispensed on the substrate or the chip prior to performing the solder bump 11 reflowing. The novel flip-chip attachment process has a number of advantages. For example, during the reflow operation, the composition also hardens and encapsulates the flip chip assembly. This eliminates the additional steps of reflowing the solder bump and then underfilling and curing the encapsulant that results in reduced production efficiency in prior an processes. In addition, there is no need to underfill any material into the tiny gap in the flip chip assembly. Void formation from the underfilling procedure and separation of the polymer from the ceramic fillers during application in prior an processes are eliminated. The flux residues remaining in die gap are not only rendered harmless, but also become integral to the strucmre of the final assembly. Finally, there is no longer a size limit on the chip that can be attached. To achieve these advantages, the inventive thermally curable composition exhibit the following feamres: a) provides sufficient flux activity to promote me solder bump to readily wet the metallization on the substrate during solder reflow. without the presence of corrosive flux activators that can contaminate the silicon chip: b) promotes solder wetting and self-alignment of the chip to die pads on the substrate by action of the wetting force of the molten solder, during die solder reflow cycle, no hardening of the flux composition occurs until the solder bump has been melted: c) reduces or eliminates gaseous evolution during the reflow cycle that would odierwise create voids; d) hardens quickly and soon after solder bump melts: e) demonstrates little shrinkage of the composition during hardening to minimize the stress resulting from the hardening process and subsequent cooling; f) after cure, provides high electrical insulation resistance even in humid and hot environments; and g) forms strong adhesion of the cured composition to die chip, substrate and solder joints. EXPERIMENTAL EXAMPLE 1 Preparation of bisphenol A glycerolate di(2-octen-l-ylsuccinic) acid monoester 10.54 g of bisphenol A diglycidyl ether was heated to 70°C under stirring and then 4.46 g acrylic acid was added slowly under nitrogen atmosphere. After mamtaining the reaction at 70°C for 2 hours, 13.0 g of 2- octen-1-ylsuccinic anhydride was added and dien die temperamre was raised to 80 °C under mechanical stirring. The reactants are stirred at 80 °C for 2-3 hours to complete the reaction. The reactions involved in this synthesis include: H.C-CH^H,θ ^ -C^W < C l 2 -CH-CH. + 2CH,=CHCOOH _ CH-\ — / EXAMPLE 2 Preparation of bisphenol A diglycerolate dimaleic acid monoester 34.8 g of bisphenol A diglycidyl ether was heated to 70°C under continuous stirring and dien 14.4 g of acrylic acid was added slowly under nitrogen atmosphere. .After maintaining me reaction at 70°C for 2 hours, 19.6 g of maleic anhydirde was added and then the temperature was raised to 80 °C under mechanical stirring for 2-3 hours to complete the reaction. The reaction involved in diis synthesis is: 3^-^C EXAMPLE 3 Synthesis of pentaerythritol triacrylate maleic acid monoester 9.8 g of maleic anhydride was heated to 80 °C under nitrogen atmosphere until all the maleic anhydride is melted before 29.8 g of pentaerythritol triacrylate was added slowly under continuous stirring. The reaction was then maintained at 80 °C for 3r hours followed by cooling to room temperature. The reaction involved in this synthesis is: O (CH 2 =CHCOCCH 2 ) 3 CCH 2 OH + 3 (CH 2 =CHCOOCH 2 ) 3 CCH 2 OOCCH=CHCOOH EXAMPLE 4 Formulation of fluxing adhesive Stoichiometric amounts of glycidyl meu acrylate was added to the flux agent to neutralize the carboxyi groups. 24.6 g of glycidyl methacrylate was added to 75.4 g of bisphenol A glycerolate di(2-octen-l-ylsuccinic) acid monoester and the mixture was thoroughly stirred at 60°C for 10 min. The reaction that occurs after reflow is: H-C -CH-CH j OOCCH-CH j EXAMPLE 5 Formulation of fluxing adhesive Stoichiometric amounts of bisphenol A based epoxy was added to the flux agent to neutralize the carboxyi groups. 30.3 g bisphenol A based epoxy was added to 71.5 g bisphenol A glycerolate di(2-octen-l-ylsuccinic) acid monoester and the mixture was dioroughlv stirred at 60 °C for 10 min. The reaction that occurs after reflow is: EXAMPLE 6 Formulation of fluxing adhesive 15.3 g bisphenol A based epoxy and 10 g glycidyl methacrylate was added to 74.5 g bisphenol- A glycerolate di(2-octen-l-ylsuccinic) acid monoester and the mixmre was thoroughly stirred at 60 °C for 10 min. Then the mixmre was cooled to room temperamre for use. EXAMPLE 7 Formulation of fluxing adhesive 21.6 g glycidyl methacrylate and 10 g pentaerythritol tetraacrylate was added to 68.4 g bisphenol A glycerolate di(2-octen-l-ylsuccinic) acid monoester and the mixmre was thoroughly stirred at 60 °C for 10 min. The mixmre was cooled to room temperamre for use. EXAMPLE 8 Formulation of fluxing adhesive 21.6 g glycidyl metiiacrylate and 10 g pentaerythritol tetraacrylate was added to 68.4 g bisphenol A glycerolate dimaleic acid monoester and the mixmre was thoroughly stirred at 60 °C for 10 min. The mixmre was cooled to room temperamre for use. EXAMPLE 9 The inventive compositions were formulated as follows: Physical characteristics of the inventive curable adhesive compositions were measured. The results are set fonh in the following table. SIR is surface insulation resistance. Composition A consisted of an adhesive material that is described in U.S. Patent No. 5, 128,746 (Example 4) which contains a fluxing agent and hardener. The composition was prepared with the following components (by weight): 50% Shell EPON 825 epoxy resin (Shell Chemical Co.), 7% malic acid, 42% methylhexahydrophthalic anhydride (MA) and 1 % midazole. The malic acid and the epoxy resin were mixed and heated to about 150°C with stirring until die solution was clear. The solution was allowed to cool to room temperamre before the MA and imidazole were added and the mixmre was stirred until uniform. As is apparent, the inventive compositions yield superior physical propeπies. The solder spread was measured by placing a ball of solder on a surface and then applying a small amount of me curable adhesive composition (or composition A) to the solder. The surface was then heated to about 200°C and the area that the melted solder covered was measured. The solder spread values are normalized, that is. the solder spread in the case where no fluxing agent was employed is equal to 1. The surface insulation resistance (SIR) test was performed according to the IPC-TM-650 test method and using the IPC-B-24 test board, both available from me IPC, Lincolnwood. 111. The test was conducted at 85 °C and 20% relative humidity at the stan. The chamber is stabilized under these conditions for 3 hours, then the humidity is slowly increased to 85 % over a 15 minute period and the specimens were allowed to come to equilibrium for at least 1 hour before applying a bias voltage. The bias voltage for this test is 50 v. The test voltage is -100 v. Insulation resistance is measured at die stan and at 168 hours. Using this test method, all die formulations listed above exhibited significantly lower insulation resistance values if prepared without a carboxylic acid neutralizing agent. Many test boards made with me above formulations, but without me neutralizing agent exhibited electromigration. Although only preferred embodiments of d e invention are specifically disclosed and described above, it will be appreciated that many modifications and variations of die present invention are possible in light of the above teachings and within the purview of the appended claims without depaning from the spirit and intended scope of me invention.

Claims: What is Claimed is: 1. A thermally curable adhesive composition that comprises: (a) a fluxing agent that comprises a carboxyi group and that is selected from the group consisting of compounds represented by Formulae I, II, and III, and mixmres thereof, HOOCCH=CH(O)COR 18 OC(O)CH = CHCOOH (I) RΗ 2 C(HCOR π ) n CH 2 OR 3 (II) [X'X 2 X 3 X 4 ]C (III) wherein R 18 is an alkyl having 1 to 16 carbons, wherein n is an integer from 1 to 16, wherein each of R 1 . R : . ...R n , is independently selected from -C(O)CH = CHCOOH. and H. wherein X 1 . X\ X 3 , and X 4 , are each independently selected from -OLOH, -CH : OC(O)CH =CHCOOH. and H, with the proviso that not all of X 1 . X\ X\ and X 4 are H; (b) a carboxylic acid neutralizing agent: (c) optionally, an effective amount of a diluent; (d) optionally, an effective amount of a source of free radical initiators; and (e) optionally, an effective amount of a resin. 2. The thermally curable adhesive composition of claim 1 wherein the carboxylic acid neutralizing agent comprises a compound tiiat has d e strucmre R'-X-R 2 , wherein X is a functional group that is selected from an epoxide, -NH-, -CH(OH)-, and mixmres thereof, wherein R 1 and R : are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres thereof. 3. The thermally curable adhesive composition of claim 1 wherein the carboxylic acid neutralizing agent comprises a compound that is selected from the group consisting of compounds represented by Formulae VUI, IX, X, and XI, and mixtures thereof, H(CHOCH)R * (Vm) H(CHOCH)R 4 (CHOCH)H (DC) R'(CHOCH)R 2 (X) H(CHOCH)R 5 , (XI) wherein R 1 and R 2 are independently selected from (i) H. (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres thereof, and wherein R 4 is selected an alkyl. alkylene. aromatic group, and mixmres thereof, and wherein R 3 comprises a moiety having one or more carbon-carbon double bonds. 4. The thermally curable adhesive composition of claim 3 wherein R 1 , R 2 , and R 4 is selected from the group consisting of CH, =C(CH 3 )COOCH 2 -. contains at least one acrylate (-C(O)CH=CH 2 ) or methacrylate (-C(O)C(CH 3 )=CH 2 ) group. 5. The thermally curable adhesive composition of claim 1 wherein the fluxing agent is selected from the group consisting of bisphenol A glycerolate di(2-octen-l-lysuccininic) acid monoester and bisphenol A diglycerolate dimaleic acid monoester and the carboxylic acid neutralizing agent is selected from glycidyl methacrylate and bisphenol A epoxy. 6. A thermally curable adhesive composition mat comprises: (a) a fluxing agent that comprises a carboxyi group and that is selected from the group consisting of compounds represented by Formulae IV, V, VI and mixmres thereof, HOOCCH=CH(O)COR" 8 OC(O)CH=CHCOOH (IV) R'Η 2 C(HCOR" CH 2 OR' 3 (V) where R' 18 is a substimted alkyl moiety containing at least one acrylate or methacrylate moiety and said substimted alkyl moiety comprising a chain having 1 to 16 carbons, and wherein n is an integer from 1 to 16, wherein each of R" , R' 2 , ...R"\ is independently selected from -C(O)CH = CHCOOH, -C(O)CH = CH 2 , -C(O)C(CH,) =CH : . and H, and wherein Y 1 , Y 2 , Y 3 , and Y 4 , are each independently selected from -CH : OH, -CH 2 OCOCH = CH 2 . -CH 2 OCOC(CH 3 ) =CH 2 , -CH : OC(O)CH =CHCOOH and H with the proviso that not all Y 1 , Y 2 , Y 3 , and Y 4 are H: (b) a carboxylic acid neutralizing agent; (c) optionally, an effective amount of a diluent: (d) optionally, an effective amount of a source of free radical initiators: and (e) optionally, an effective amount of a resin. 7. The thermally curable adhesive composition of claim 6 wherein the carboxylic acid neutralizing agent comprises a compound mat has the strucmre R'-X-R 2 , wherein X is a functional group that is selected from an epoxide, -NH-, -CH(OH)-, and mixmres thereof, wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres thereof. 8. The thermally curable adhesive composition of claim 5 wherein me carboxylic acid neutralizing agent comprises a compound that is selected from the group consisting of compounds represented by Formulae Vm. IX, X, and XI, and mixtures thereof, H(CHOCH)R * (VUI) H(CHOCH)R 4 (CHOCH)H (IX) R * (CHOCH)R 2 (X) H(CHOCH)R 5 , (XI) wherein R 1 and R 2 are independentiy selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres thereof, and wherein R 4 is selected an alkyl, alkylene, aromatic group, and mixmres thereof, and wherein R 3 comprises a moiety having one or more carbon-carbon double bonds. 9. The tiiermally curable adhesive composition of claim 8 wherein R 1 , R 2 , and R 4 is selected from the group consisting of CH 2 =C(CH 3 )COOCH 2 -, contains at least one acrylate (-C(O)CH=CH 2 ) or methacrylate group. 10. The thermally curable adhesive composition of claim 6 wherein the fluxing agent is selected from the group consisting of bisphenol A glycerolate di(2-octen-l-ylsuccinic) acid monoester and bisphenol A diglycerolate dimaleic acid monoester and the carboxylic acid neutralizing agent is selected from glycidyl methacrylate and bisphenol A epoxy. 11. A thermally curable adhesive composition that comprises: (a) a fluxing agent that comprises a carboxyi group and R 19 -Ar-R 20 (VUJ) in which R 21 is -C(O)CH=CH-COOH, -C(O)CF 2 CF 2 CF 2 COOH, or H; (b) a carboxylic acid neutralizing agent; (c) optionally, an effective amount of a diluent; (d) optionally, an effective amount of a source of free radical initiators; and (e) optionally, an effective amount of a resin. 12. The thermally curable adhesive composition of claim 11 wherein the carboxylic acid neutralizing agent comprises a compound mat has the structure R * -X-R 2 , wherein X is a functional group that is selected from an epoxide, -NH-, -CH(OH)-, and mixtures thereof, wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixtures thereof. 13. The thermally curable adhesive composition of claim 11 wherein the carboxylic acid neutralizing agent comprises a compound that is selected from the group consisting of compounds represented by Formulae VUJ, IX, X, and XI, and mixtures thereof, HCCHOCIDR 1 (VUI) H(CHOCH)R 4 (CHOCH)H (DC) R'(CHOCH)R 2 (X) H(CHOCH)R 5 , (XT) wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres thereof, and wherein R 4 is selected an alkyl, alkylene. aromatic group, and mixmres thereof, and wherein R 3 comprises a moiety having one or more carbon-carbon double bonds. 14. The thermally curable adhesive composition of claim 13 wherein R\ R 2 , and R 4 is selected from the group consisting of CH 2 =C(CH 3 )COOCH 2 -, and mixmres diereof.and wherein R 3 contains at least one acrylate (-C(O)CH=CH 2 ) or methacrylate (-C(0)C(CH 3 )=CH 2 ) group. 15. The thermally curable adhesive composition of claim 11 wherein the fluxing agent is selected from the group consisting of bisphenol A glycerolate di(2-octen-l-ylsuccinic) acid monoester and bisphenol A diglycerolate dimaleic acid monoester and me carboxyhc acid neutralizing agent is selected from glycidyl methacrylate and bisphenol A epoxy. 16. An electrical component assembly, comprising: (a) an electrical component having a plurality of electrical terminations; (b) a component carrying substrate having a plurality of electrical terminations corresponding to the terminations of the electrical component; and (c) a thermally curable adhesive composition that comprises: (i) a fluxing agent that comprises a carboxyi group and mat is selected from the group consisting of compounds represented by Formulae I, II, and III. and mixmres thereof, HOOCCH =CH(O)COR 18 OC(O)CH = CHCOOH (I) R 2 H 2 C(HCOR n ) n CH 2 OR 3 (II) [X 1 X 2 X 3 X ]C (III) wherein R 18 is an alkyl having 1 to 16 carbons, wherein n is an integer from 1 to 16, wherein each of R 1 , R 2 , ...R n , is independently selected from -C(O)CH=CHCOOH, and H, wherein X 1 , X 2 , X 3 , and X 4 , are each independently selected from -CH OH. -CH 2 OC(O)CH = CHCOOH, and H, with the proviso that not all of X 1 , X 2 . X 3 , and X 4 are H; (ii) a carboxylic acid neutralizing agent; (iii) optionally, an effective amount of a diluent; (iv) optionally, an effective amount of a source of free radical initiators; and (v) optionally, an effective amount of a resin. 17. The electrical component assembly of claim 16 wherein the carboxylic acid neutralizing agent comprises a compound diat has the strucmre R'-X-R 2 , wherein X is a functional group mat is selected from an epoxide, - NH-, -CH(OH)-, and mixmres thereof, wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixtures thereof. 18. The electrical component of assembly claim 16 wherein the carboxylic acid neutralizing agent comprises a compound mat is selected from the group consisting of compounds represented by Formulae VUI, DC, X, and XI, and mixmres thereof, H(CHOCH)R I (Vπi) H(CHOCH)R (CHOCH)H (IX) R^CHOCH^ 2 (X) H(CHOCH)R 3" , (XI) wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixtures thereof, and wherein R 4 is selected an alkyl, alkylene. aromatic group, and mixmres thereof, and wherein R 3 comprises a moiety having one or more carbon-carbon double bonds. 19. The electrical component assembly of claim 18 wherein R 1 , R 2 , and R 4 is selected from the group consisting of CH 2 =C(CH 3 )COOCH 2 -, contains at least one acrylate (-C(O)CH=CH 2 or methacrylate (-C(O)C(CH 3 )=CH 2 ) group. 20. The electrical component assembly of claim 16 wherein the fluxing agent is selected from the group consisting of bisphenol A glycerolate di(2-octen-l-ylsuccinic) acid monoester and bisphenol A diglycerolate dimaleic acid monoester and the carboxylic acid neutralizing agent is selected from glycidyl methacrylate and bisphenol A epoxy. 21. An electrical component assembly, comprising: (a) an electrical component having a plurality of electrical terminations; (b) a component carrying substrate having a plurality of electrical terminations corresponding to the terminations of the electrical component; and (c) a thermally curable adhesive composition that comprises: (i) a fluxing agent mat comprises a carboxyi group and that is selected from the group consisting of compounds represented by Formulae IV, V, VI and mixmres thereof, HOOCCH=CH(O)COR" 8 OC(O)CH=CHCOOH (IV) R'Η 2 C(HCOR' π ) n CH 2 OR' 3 (V) [Y.Y 2 Y 3 Y ]C (VI) where R" 8 is a substimted alkyl moiety containing at least one acrylate or methacrylate moiety and said substimted alkyl moiety comprising a chain having 1 to 16 carbons, and wherein n is an integer from 1 to 16, wherein each of R", R' 2 , ...R"\ is independently selected from -C(O)CH=CHCOOH, -C(O)CH=CH 2 , -C(O)C(CH 3 ) =CH 2 , and H. and wherein Y 1 , Y 2 , Y 3 , and Y 4 , are each independently selected from -CH 2 OH. -CH 2 OCOCH=CH 2 , -CH 2 OCOC(CH 3 )=CH 2 , -CH 2 OC(O)CH = CHCOOH and H with the proviso that not all Y 1 , Y 2 , Y 3 , and Y 4 are H; (ii) a carboxylic acid neutralizing agent; (iii) optionally, an effective amount of a diluent; (iv) optionally, an effective amount of a source of free radical initiators; and (v) optionally, an effective amount of a resin. 22. The electrical component assembly of claim 21 wherein the carboxylic acid neutralizing agent comprises a compound mat has the strucmre R'-X-R 2 , wherein X is a functional group that is selected from an epoxide, - NH-, -CH(OH)-, and mixmres thereof, wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres thereof. 23. The electrical component assembly of claim 21 wherein the carboxylic acid neutralizing agent comprises a compound mat is selected from the group consisting of compounds represented by Formulae VIII. IX. X, and XI. and mixmres thereof, H(CHOCH)R' (VIII) H(CHOCH)R 4 (CHOCH)H (IX) R'(CHOCH)R 2 (X) H(CHOCH)R 5 , (XI) wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres diereof, and wherein R 4 is selected an alkyl, alkylene, aromatic group, and mixmres thereof, and wherein R 3 comprises a moiety having one or more carbon-carbon double bonds. 24. The electrical component assembly of claim 23 wherein R l , R 2 , and R 4 is selected from the group consisting of CH 2 =C(CH 3 )COOCH 2 -, and ^fc— y ^__y , and mixtures thereof,and wherein R 5 contains at least one acrylate (-C(O)CH=CH 2 ) or methacrylate (-C(O)C(CH 3 )=CH 2 ) group. 25. The electrical component assembly of claim 21 wherein the fluxing agent is selected from the group consisting of bisphenol A glycerolate di(2-octen-l-ylsuccinic) acid monoester and bisphenol A diglycerolate dimaleic acid monoester and the carboxylic acid neutralizing agent is selected from glycidyl methacrylate and bisphenol A epoxy. 26. An electrical component assembly, comprising: (a) an electrical component having a plurality of electrical terminations; (b) a component carrying substrate having a plurality of electrical terminations corresponding to the terminations of the electrical component; and (c) a thermally curable adhesive composition that comprises: (i) a fluxing agent mat comprises a carboxyi group and R 19 -Ar-R 20 (VHI) in whiicchh Ar is in which R 21 is -C(O)CH=CH-COOH, -C(O)CF 2 CF 2 CF 2 COOH, or H; (ii) carboxylic acid neutralizing agent; (iii) optionally, an effective amount of a diluent; (iv) optionally, an effective amount of a source of free radical initiators; and (v) optionally, an effective amount of a resin. 27. The electrical component assembly of claim 26 wherein the carboxylic acid neutralizing agent comprises a compound mat has the strucmre R l -X-R 2 , wherein X is a functional group that is selected from an epoxide, - NH-, -CH(OH)-, and mixmres thereof, wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres thereof. 28. The electrical component of assembly claim 26 wherein the carboxylic acid neutralizing agent comprises a compound that has the structure R l -X-R 2 , wherein X is a functional group that is selected from an epoxide, - NH-, -CH(OH)-, and mixtures diereof, wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres thereof. 29. The electrical component assembly of claim 28 wherein me R 1 , R 2 , and R 4 is selected from me group consisting of CH 2 =C(CH 3 )COOCH 2 -, R 5 contains at least one acrylate (-C(O)CH=CH 2 ) or methacrylate (-C(O)C(CH 3 )=CH 2 ) group. 30. The electrical component assembly of claim 26 wherein the fluxing agent is selected from the group consisting of bisphenol A glycerolate di(2-octen-l-ylsuccinic) acid monoester and bisphenol A diglycerolate dimaleic acid monoester and d e carboxylic acid neutralizing agent is selected from glycidyl methacrylate and bisphenol A epoxy. 31. A process for assembling an electronic component that comprises the steps of: (a) applying a solder and a curable adhesive composition onto component wherein the composition comprises: (i) a fluxing agent that comprises a carboxyi group and that is selected from the group consisting of compounds represented by Formulae I, π, and HI, and mixtures iereof, HOOCCH=CH(O)COR 18 OC(O)CH=CHCOOH (I) RΗ 2 C(HCOR n ) π CH 2 OR 3 (II) [X' T-X^C (ΠD wherein R 18 is an alkyl having 1 to 16 carbons, wherein n is an integer from 1 to 16, wherein each of R 1 , R 2 , ...R n , is independently selected from -C(O)CH=CHCOOH, and H, wherein X 1 , X 2 , X 3 , and X 4 , are each independently selected from -CH 2 OH, -CH 2 OC(O)CH=CHCOOH, and H, with the proviso that not all of X 1 , X 2 , X 3 , and X 4 are H; (ii) a carboxylic acid neutralizing agent; (iii) optionally, an effective amount of a diluent; (iv) optionally, an effective amount of a source of free radical initiators; (v) optionally, an effective amount of a resin; and (b) heating the solder and fluxing agent to attach the component. 32. The process of claim 31 wherein the carboxylic acid neutralizing agent comprises a compound that has die strucmre R'-X-R 2 , wherein X is a functional group that is selected from an epoxide, -NH-, -CH(OH)-, and mixmres diereof, wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres thereof. 33. The process of claim 31 wherein the carboxylic acid neutralizing agent comprises a compound diat is selected from the group consisting of compounds represented by Formulae VUI, DC. X, and XI, and mixmres thereof, H(CHOCH)R' (VIII) H(CHOCH)R 4 (CHOCH)H (IX) R 1 (CHOCH)R 2 (X) H(CHOCH)R 5 , (XI) wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres thereof, and wherein R 4 is selected an alkyl, alkylene, aromatic group, and mixtures thereof, and wherein R 3 comprises a moiety having one or more carbon-carbon double bonds. 34. The process of claim 33 wherein R 1 , R 2 , and R 4 is selected from the group consisting of CH 2 =C(CH 3 )COOCH 2 -, CH 2 =C(CH 3 )CH 2 (CH 2 ) 4 CH 2 -, and , and mixtures thereof, and wherein R 3 contains at least one acrylate (-C(O)CH=CH 2 ) or methacrylate (-C(O)C(CH 3 )=CH 2 ) group. 35. The process of claim 31 wherein the fluxing agent is selected from the group consisting of bisphenol A glycerolate di(2-octen-l-ylsuccinic) acid monoester and bisphenol A diglycerolate dimaleic acid monoester and d e carboxylic acid neutralizing agent is selected from glycidyl methacrylate and bisphenol A epoxy. 36. A process for assembling an electronic component that comprises the steps of: (a) applying a solder and a curable adhesive composition onto component wherein the composition comprises: (i) a fluxing agent that comprises a carboxyi group and that is selected from the group consisting of compounds represented by Formulae IV, V, VI and mixtures thereof, HOOCCH=CH(O)COR' 18 OC(O)CH=CHCOOH (TV) R' 2 H 2 C(HCOR' π ) n CH 2 OR' 3 (V) where R' 18 is a substimted alkyl moiety containing at least one acrylate or methacrylate moiety and said substimted alkyl moiety comprising a chain having 1 to 16 carbons, and wherein n is an integer from 1 to 16, wherein each of R", R' 2 , ...R' n , is independently selected from -C(O)CH=CHCOOH, -C(O)CH=CH 2 , -C(O)C(CH 3 )=CH 2 , and H, and wherein Y 1 , Y 2 , Y 3 , and Y\ are each independently selected from -CH 2 OH, -CH 2 OCOCH=CH 2 , -CH 2 OCOC(CH 3 )=CH 2 , -CH 2 OC(O)CH=CHCOOH and H with the proviso that not all Y\ Y 2 , Y 3 , and Y 4 are H; (ii) a carboxylic acid neutralizing agent: (iii) optionally, an effective amount of a diluent; (iv) optionally, an effective amount of a source of free radical initiators; (v) optionally, an effective amount of a resin; and (b) heating the solder and fluxing agent to attach die component. 37. The process of claim 36 wherein me carboxylic acid neutralizing agent comprises a compound that has the strucmre R^X-R 2 . wherein X is a functional group that is selected from an epoxide, -NH-, -CH(OH)-, and mixmres thereof, wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres thereof. 38. The process of claim 36 wherein the carboxylic acid neutralizing agent comprises a compound that is selected from the group consisting of compounds represented by Formulae VIII, IX, X, and XI, and mixmres thereof, H(CHOCH)R' (Viπ) H(CHOCH)R (CHOCH)H (DC) R' CHOCITR 2 (X) H(CHOCH)R 5 , (XI) wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (hi) aromatic moiety, and mixtures thereof, and wherein R 4 is selected an alkyl, alkylene, aromatic group, and mixmres thereof, and wherein R 3" comprises a moiety having one or more carbon-carbon double bonds. 39. The process of claim 35 wherein die R 1 . R 2 , and R 4 is selected from the group consisting of CH 2 = C(CH 3 )COOCH 2 -, CH 2 = C(CH 3 )CH 2 (CH 2 ) 4 CH 2 -, and ^ 2 ^- ^^^ ns at^ ^ a lea C ^ st o 2 - n " ^ e acrylate C - « ( H - 2 2- C " , and mixmres thereof,and wherein R 3 contai (O)CH = CH 2 ) or methacrylate (-C(O)C(CH 3 )=CH 2 ) group. 40. The process of claim 41 wherein the fluxing agent is selected from the group consisting of bisphenol A glycerolate di(2-octen-l-ylsuccmic) acid monoester and bisphenol A diglycerolate dimaleic acid monoester and the carboxylic acid neutralizing agent is selected from glycidyl methacrylate and bisphenol A epoxy. 41. A process for assembling an electronic component diat comprises the steps of: (a) applying a solder and a curable adhesive composition onto component wherein the composition comprises: (i) a fluxing agent that comprises a carboxyi group and R 19 -Ar-R 20 (VUI) in which Ar is > , Crc in which R 21 is -C(O)CH = CH-COOH. -C(O)CF 2 CF 2 CF : COOH, or H; (ii) a carboxylic acid neutralizing agent; (iii) optionally, an effective amount of a diluent; (iv) optionally, an effective amount of a source of free radical initiators; (v) optionally, an effective amount of a resin; and ( ) heating the solder and fluxing agent to attach the component. 42. The process of claim 41 wherein me carboxylic acid neutralizing agent comprises a compound that has the strucmre R'-X-R 2 , wherein X is a functional group that is selected from an epoxide, -NH-, -CH(OH)-, and mixtures thereof, wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres thereof. 43. The process of claim 41 wherein the carboxylic acid neutralizing agent comprises a compound diat is selected from the group consisting of compounds represented by Formulae VUI, DC, X, and XI, and mixtures thereof, H(CHOCH)R' (VTH) H(CHOCH)R 4 (CHOCH)H (DC) R' CHOCIDR 2 (X) H(CHOCH)R 3' , (XI) wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres diereof, and wherein R 4 is selected an alkyl, alkylene, aromatic group, and mixmres thereof, and wherein R 3 comprises a moiety having one or more carbon-carbon double bonds. 44. The process of claim 41 wherein R 1 , R\ and R 4 is selected from the group consisting of CH 2 =C(CH 3 )COOCH 2 -, CH 2 =C(CH 3 )CH 2 (CH 2 ) 4 CH 2 -, and and wherem KT contains at least one acrylate (-C(O)CH=CH 2 ) or methacrylate (-C(O)C(CH 3 )=CH 2 ) group. 45. The process of claim 41 wherein the fluxing agent is selected from the group consisting of bisphenol A glycerolate di(2-octen-l-ylsuccinic) acid monoester and bisphenol A diglycerolate dimaleic acid monoester and die carboxylic acid neutralizing agent is selected from glycidyl methacrylate and bisphenol A epoxy. 46. An electrically conductive ink composition formed by curing an adhesive composition comprising: a) 1 to 65 % (wt) of a high melting point metal mat is selected from the group consisting of Cu, Ag, Au, Pt, Pd Be, Rh, Ni, Co, Fe, Mo, and alloys diereof; b) 6 to 65 % (wt) of a solder diat is selected from the group consisting of Sn, Bi, Pb, Cd, Zn, Ga. In. Hg. Sb, and alloy diereof; and c) 5 % to 50% (wt) of die thermally curable adhesive flux composition mat comprises: (i) a fluxing agent mat comprises a carboxyi group and that is selected from the group consisting of compounds represented by Formulae I, II. and III. and mixmres thereof, HOOCCH = CH(O)COR l8 OC(O)CH=CHCOOH (I) R 2 H 2 C(HCOR π ) n CH 2 OR 3 (II) [X'X 2 X 3 X ]C (III) wherein R 18 is an alkyl having 1 to 16 carbons, wherein n is an integer from 1 to 16. wherein each of R 1 , R 2 . ...R n , is independently selected from -C(O)CH=CHCOOH, and H, wherein X 1 , X 2 , X 3 , and X 4 , are each independently selected from -CH 2 OH, -CH 2 OC(O)CH=CHCOOH, and H, with the proviso that not all of X 1 , X 2 , X 3 , and X 4 are H; (ii) a carboxylic acid neutralizing agent; (ϋi) optionally, an effective amount of a diluent; (iv) optionally, an effective amount of a source of free radical initiators; and (v) optionally, an effective amount of a resin. 47. The electrically conductive ink composition of claim 46 wherein the carboxylic acid neutralizing agent comprises a compound mat has the structure R'-X-R 2 , wherein X is a functional group diat is selected from an epoxide, -NH-, -CH(OH)-, and mixtures diereof, wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres diereof. 48. The electrically conductive ink composition of claim 46 wherein the carboxylic acid neutralizing agent comprises a compound d at is selected from e group consisting of compounds represented by Formulae VIII, IX, X, and XI, and mixmres diereof, H(CHOCH)R' (VUI) H(CHOCH)R (CHOCH)H (DC) R'(CHOCH)R : (X) H(CHOCH)R 3" , (XI) wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixtures diereof, and wherein R 4 is selected an alkyl. alkylene. aromatic group, and mixmres thereof, and wherein R 3 comprises a moiety having one or more carbon-carbon double bonds. 49. The electrically conductive ink composition of claim 45 wherein the R 1 , R 2 , and R 4 is selected from the group consisting of CH 2 =C(CH 3 )COOCH 2 -, CH 2 =C(CH 3 )CH 2 (CH 2 ) 4 CH , and , and mixtures thereof,and wherein R 5 contains at least one acrylate (-C(O)CH=CH 2 ) or methacrylate (-C(O)C(CH 3 )=CH 2 ) group. 50. The process of claim 46 wherein the fluxing agent is selected from die group consisting of bisphenol A glycerolate di(2-octen-l-ylsuccinic) acid monoester and bisphenol A diglycerolate dimaleic acid monoester and the carboxylic acid neutralizing agent is selected from glycidyl methacrylate and bisphenol A epoxy. 51. An electrically conductive ink composition formed by curing an adhesive composition comprising: a) 1 to 65 % (wt) of a high melting point metal that is selected from the group consisting of Cu, Ag, Au, Pt. Pd Be, Rh, Ni, Co, Fe, Mo. and alloys diereof; b) 6 to 65 % (wt) of a solder d at is selected from die group consisting of Sn, Bi, Pb, Cd, Zn, Ga, In. Hg, Sb, and alloy diereof; and c) 5 % to 50% (wt) of die diermally curable adhesive flux composition mat comprises: (i) a fluxing agent that comprises a carboxyi group and that is selected from the group consisting of compounds represented by Formulae IV, V, VI and mixtures diereof, HOOCCH=CH(O)COR' 18 OC(O)CH=CHCOOH (IV) R' 2 H 2 C(HCOR' n ) n CH 2 OR' 3 (V) [Y'YVY C (VI) where R' 18 is a substituted alkyl moiety containing at least one acrylate or methacrylate moiety and said substimted alkyl moiety comprising a chain having 1 to 16 carbons, and wherein n is an integer from 1 to 16, wherein each of R' 1 , R' 2 , ...R' n , is independently selected from -C(O)CH=CHCOOH, -C(O)CH=CH 2 , -C(O)C(CH 3 )=CH 2 , and H, and wherein Y 1 , Y 2 , Y 3 , and Y\ are each independently selected from -CH 2 OH, -CH 2 OCOCH=CH 2 , -CH 2 OCOC(CH 3 )=CH 2 , -CH 2 OC(O)CH=CHCOOH and H with the proviso that not all Y 1 , Y 2 , Y 3 , and Y 4 are H; (ii) a carboxylic acid neutralizing agent; (iii) optionally, an effective amount of a diluent; (iv) optionally, an effective amount of a source of free radical initiators; and (v) optionally, an effective amount of a resin. 52. The electrically conductive ink composition of claim 51 wherein the carboxylic acid neutralizing agent comprises a compound diat has die strucmre R'-X-R 2 , wherein X is a functional group that is selected from an epoxide, -NH-, -CH(OH)-, and mixmres thereof, wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres diereof. 53. The electrically conductive ink composition of claim 51 wherein the carboxylic acid neutralizing agent comprises a compound diat is selected from the group consisting of compounds represented by Formulae VUI, IX, X, and XI, and mixmres thereof, H(CHOCH)R' (VIII) H(CHOCH)R (CHOCH)H (IX) R 1 (CHOCH)R 2 (X) H(CHOCH)R 5 , (XI) wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres diereof, and wherein R 4 is selected an alkyl, alkylene, aromatic group, and mixtures thereof, and wherein R 5 comprises a moiety having one or more carbon-carbon double bonds. 54. The electrically conductive ink composition of claim 53 wherein the R l , R 2 , and R 4 is selected from me group consisting of and , and mixmres diereof, and wherein R 5 contains at least one acrylate (-C(O)CH = CH L ) or methacrylate (-C(O)C(CH 3 ) =CH 2 ) group. 55. The electrically conductive ink composition of claim 51 wherein me fluxing agent is selected from the group consisting of bisphenol A glycerolate di(2-octen-l-ylsuccinic) acid monoester and bisphenol A diglycerolate dimaleic acid monoester and die carboxylic acid neutralizing agent is selected from glycidyl methacrylate and bisphenol A epoxy. 56. An electrically conductive ink composition formed by curing an adhesive composition comprising: a) 1 to 65 % (wt) of a high melting point metal that is selected from the group consisting of Cu, Ag, Au, Pt, Pd Be, Rh, Ni, Co, Fe, Mo, and alloys thereof; b) 6 to 65 % (wt) of a solder d at is selected from the group consisting of Sn, Bi, Pb, Cd, Zn, Ga, In, Hg, Sb, and alloy thereof; and c) 5% to 50% (wt) of the thermally curable adhesive flux composition that comprises: (i) a fluxing agent that comprises a carboxyi group and R 19 -Ar-R 20 (VTH) m w ich Λr , -O " in which R 21 is -C(O)CH=CH-COOH, -C(O)CF 2 CF 2 CF 2 COOH, or H; (ii) a carboxylic acid neutralizing agent; (iii) optionally, an effective amount of a diluent; (iv) optionally, an effective amount of a source of free radical initiators; and (v) optionally, an effective amount of a resin. 57. The electrically conductive ink composition of claim 56 wherein me carboxylic acid neutralizing agent comprises a compound diat has the structure R'-X-R 2 , wherein X is a functional group that is selected from an epoxide, -NH-, -CH(OH)-, and mixmres diereof, wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixtures thereof. 58. The electrically conductive ink composition of claim 56 wherein the carboxylic acid neutralizing agent comprises a compound d at is selected from the group consisting of compounds represented by Formulae VTH, DC, X, and XI, and mixtures thereof, H(CHOCH)R' (VUI) H(CHOCH)R 4 (CHOCH)H (IX) R * (CHOCH)R 2 (X) H(CHOCH)R 5 , (XI) wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixtures thereof, and wherein R 4 is selected an alkyl, alkylene. aromatic group, and mixmres thereof, and wherein R 3 comprises a moiety having one or more carbon-carbon double bonds. 59. The electrically conductive ink composition of claim 58 wherein R 1 , R 2 , and R 4 is selected from the group consisting of CH 2 =C(CH 3 )COOCH 2 -, contains at least one acrylate (-C(O)CH=CH 2 ) or methacrylate (-C(O)C(CH 3 )=CH 2 ) group. 60. The electrically conductive ink composition of claim 56 wherein the fluxing agent is selected from the group consisting of bisphenol A glycerolate di(2-octen-l-ylsuccinic) acid monoester and bisphenol A diglycerolate dimaleic acid monoester and the carboxylic acid neutralizing agent is selected from glycidyl med acrylate and bisphenol A epoxy. 61. An electrical component assembly, comprising: (a) an electrical component having a plurality of electrical terminations; (b) a component carrying substrate having a plurality of electrical terminations corresponding to the terminations of the electrical component; and (c) a tiiermally curable adhesive composition that comprises: (i) a fluxing agent that comprises a carboxyi group and that is selected from the group consisting of compounds represented by Formulae I, II. and III, and mixmres thereof, HOOCCH=CH(O)COR 18 OC(O)CH = CHCOOH (I) R 2 H 2 C(HCOR n ) n CH 2 OR 3 (II) [X'X 2 X 3 X 4 ]C (III) wherein R 18 is an alkyl having 1 to 16 carbons, wherein n is an integer from 1 to 16, wherein each of R 1 , R 2 , ...R n . is independently selected from -C(O)CH = CHCOOH, and H. wherein X ! , X 2 , X 3 , and X 4 , are each independently selected from -CH 2 OH. -CH 2 OC(O)CH=CHCOOH, and H, with die proviso diat not all of X 1 , X 2 . X 3 . and X 4 are H: (ii) a carboxylic acid neutralizing agent: (iii) optionally, an effective amount of a diluent; (iv) optionally, an effective amount of a source of free radical initiators; and (v) optionally, an effective amount of a resin. 62. The electric component assembly of claim 61 wherein the carboxylic acid neutralizing agent comprises a compound mat has the strucmre R'-X-R 2 , wherein X is a functional group that is selected from an epoxide, - NH-, -CH(OH)-, and mixmres thereof, wherein R 1 and R 2 are independendy selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres thereof. 63. The electric component assembly of claim 61 wherein me carboxylic acid neutralizing agent comprises a compound d at is selected from the group consisting of compounds represented by Formulae VUI, DC, X, and XI, and mixtures thereof, H(CHOCH)R- (VΠD H(CHOCH)R 4 (CHOCH)H (IX) R^CHOC^R 2 (X) H(CHOCH)R 5 , (XI) wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixtures thereof, and wherein R 4 is selected an alkyl, alkylene, aromatic group, and mixmres thereof, and wherein R 5 comprises a moiety having one or more carbon-carbon double bonds. 64. The electric component assembly of claim 63 wherein R l , R 2 , and R 4 is selected from the group consisting of CH 2 =C(CH 3 )COOCH 2 -, in R 5 contains at least one acrylate (-C(O)CH=CH 2 ) or methacrylate (-C(O)C(CH 3 )=CH 2 ) group. 65. The electric component assembly of claim 61 wherein the fluxing agent is selected from me group consisting of bisphenol A glycerolate di(2- octen-1-ylsuccinic) acid monoester and bisphenol A diglycerolate dimaleic acid monoester and die carboxylic acid neutralizing agent is selected from glycidyl methacrylate and bisphenol A epoxy. 66. An electrical component assembly, comprising: (a) an electrical component having a plurality of electrical terminations; (b) a component carrying substrate having a plurality of electrical terminations corresponding to die terminations of the electrical component; and (c) a thermally curable adhesive composition that comprises: (i) a fluxing agent mat comprises a carboxyi group and diat is selected from the group consisting of compounds represented by Formulae IV, V, VI and mixmres diereof, HOOCCH = CH(O)COR" 8 OC(O)CH=CHCOOH (IV) R' 2 H 2 C(HCOR' n ) n CH 2 OR' 3 (V) [Y-Y 2 Y 3 Y 4 ]C (VI) where R" 8 is a substimted alkyl moiety containing at least one acrylate or methacrylate moiety and said substimted alkyl moiety comprising a chain having 1 to 16 carbons, and wherein n is an integer from 1 to 16, wherein each of R", R' 2 , ...R' n , is independently selected from -C(O)CH=CHCOOH, -C(O)CH=CH 2 , -C(O)C(CH 3 ) =CH 2 , and H, and wherein Y 1 , Y 2 , Y 3 , and Y 4 , are each independently selected from -CH 2 OH, -CH 2 OCOCH=CH 2 , -CH 2 OCOC(CH 3 )=CH 2 , -CH 2 OC(O)CH=CHCOOH and H with the proviso that not all Y 1 , Y 2 , Y 3 , and Y 4 are H; (ii) a carboxylic acid neutralizing agent; (iii) optionally, an effective amount of a diluent; (iv) optionally, an effective amount of a source of free radical initiators; and (v) optionally, an effective amount of a resin. 67. The electrical component assembly of claim 66 wherein the carboxylic acid neutralizing agent comprises a compound d at has die structure R * -X-R 2 , wherein X is a functional group that is selected from an epoxide, - NH-, -CH(OH)-, and mixmres diereof, wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres thereof. 68. The electrical component assembly of claim 66 wherein the carboxylic acid neutralizing agent comprises a compound diat is selected from the group consisting of compounds represented by Formulae VTII, DC, X, and XI, and mixmres thereof, H(CHOCH)R 1 (VUI) H(CHOCH)R 4 (CHOCH)H (DC) R'(CHOCH)R 2 (X) H(CHOCH)R 5 , (XT) wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixtures diereof, and wherein R 4 is selected an alkyl, alkylene. aromatic group, and mixmres thereof, and wherein R 5 comprises a moiety having one or more carbon-carbon double bonds. 69. The electrical component assembly of claim 65 wherein R 1 , R 2 , and R 4 is selected from the group consisting of CH 2 =C(CH 3 )COOCH 2 -, and , and mixtures diereof, and wherein R 5 contains at least one acrylate (-C(O)CH=CH 2 ) or methacrylate (-C(O)C(CH 3 )=CH,) group. 70. The electrical component assembly of claim 65 wherein me fluxing agent is selected from the group consisting of bisphenol A glycerolate di(2-octen-l-ylsuccinic) acid monoester and bisphenol A diglycerolate dimaleic acid monoester and die carboxylic acid neutralizing agent is selected from glycidyl methacrylate and bisphenol A epoxy. 71. An electrical component assembly, comprising: (a) an electrical component having a plurality of electrical terminations; (b) a component carrying substrate having a plurality of electrical terminations corresponding to d e terminations of e electrical component; and (c) a thermally curable adhesive composition mat comprises: (i) a fluxing agent that comprises a carboxyi group and R I9 -Ar-R 20 (VTJI) in which R 21 is -C(O)CH=CH-COOH, -C(O)CF 2 CF 2 CF 2 COOH, or H; (ii) a carboxylic acid neutralizing agent; (iii) optionally, an effective amount of a diluent; (iv) optionally, an effective amount of a source of free radical initiators; and (v) optionally, an effective amount of a resin. 72. The electrical component assembly of claim 71 wherein the carboxylic acid neutralizing agent comprises a compound mat has the strucmre R--X-R 2 , wherein X is a functional group that is selected from an epoxide, - NH-, -CH(OH)-, and mixmres thereof, wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres thereof. 73. The electrical component assembly of claim 71 wherein the carboxylic acid neutralizing agent comprises a compound at is selected from the group consisting of compounds represented by Formulae VIII, IX. X, and XI. and mixmres thereof, H(CHOCH)R' (VIE) H(CHOCH)R 4 (CHOCH)H (DC) R'(CHOCH)R 2 (X) H(CHOCH)R 5 , (XI) wherein R 1 and R 2 are independently selected from (i) H, (ii) alkyl or alkylene moiety having 1 to 18 carbons and (iii) aromatic moiety, and mixmres thereof, and wherein R 4 is selected an alkyl, alkylene, aromatic group, and mixmres thereof, and wherein R 3 comprises a moiety having one or more carbon-carbon double bonds. 74. The electrical component assembly of claim 73 wherein R 1 , R 2 , and R 4 is selected from the group consisting of CH 2 =C(CH 3 )COOCH , and mixtures thereof,and wherein R 5 contains at least one acrylate (-C(O)CH=CH 2 ) or methacrylate (-C(O)C(CH 3 )=CH 2 ) group. 75. The electrical component of claim 71 wherein the fluxing agent is selected from the group consisting of bisphenol A glycerolate di(2-octen-l- ylsuccinic) acid monoester and bisphenol A diglycerolate dimaleic acid monoester and die carboxylic acid neutralizing agent is selected from glycidyl methacrylate and bisphenol A epoxy.

Inventors: CAPOTE M ALBERT, ZHOU LIQUI, ZHOU ZHIMING, ZHU XIOQUI, CAPOTE, M., ALBERT, ZHOU, LIQUI, ZHOU, ZHIMING, ZHU, XIOQUI
Applicants: AGUILA TECHNOLOGIES INC, CAPOTE M ALBERT, ZHOU LIQUI, ZHOU ZHIMING, ZHU XIOQUI, AGUILA TECHNOLOGIES, INC., CAPOTE, M., ALBERT, ZHOU, LIQUI, ZHOU, ZHIMING, ZHU, XIOQUI
Application year: 1998
Main classification: B05D5
IPC codes: B23K35, B32B7, C08G59, C09D11, C09J4, H01B1, H01L21, H01L23, H05K1, H05K3