Surface acoustic wave apparatus

Abstract: A surface acoustic wave apparatus includes first and second series-coupled resonator filters on a surface-wave board. In each series-coupled resonator filter, the ground electrodes of IDTs disposed at both sides of the center IDT and adjacent to reflectors are connected to different ground electrodes formed on the same layer in the package, with at least two bonding wires.

Description: 1. Field of the Invention The present invention relates to surface acoustic wave (SAW) apparatuses, and more particularly, to a surface acoustic wave apparatus in which an SAW chip is accommodated into a package formed of a multilayer board. 2. Description of the Related Art In a conventional surface acoustic wave apparatus, a metallic, hermetically sealed case has been used as a packaging member for accommodating an SAW chip. Since a lead terminal is led from the hermetically sealed case, however, the apparatus cannot be surface-mounted. To allow surface-mounting, a surface acoustic wave apparatus using a multilayer board as a part of its packaging member has been proposed (for example, in Japanese Unexamined Patent Publication No. 4-263509). The document WO 96/15587 A1 discloses an acoustic wave filter constituted by arranging SAW resonators, whereby the SAW resonators comprise a plurality of comb-teeth electrodes inserted into between a plurality of comb-teeth electrodes opposed thereto so as to form a pair. In order to prevent the shortening of the service life of the resonator due to the heat generated by large current, WO 96/15587 A1 teaches to bond bonding wires to connecting electrodes for connecting one end of each of the comb-teeth-like electrodes constituting the resonator at positions on both sides of the center line of the comb-teeth-like electrodes. The document US 4,365,219 discloses a surface acoustic wave (SAW) filter assembly module comprising a plurality of SAW filter devices, whereby the SAW filter devices are built of two interdigital transducers, an input transducer and an output transducer. US 4,365,219 describes a structure and packaging method for the plurality of SAW filters to provide substantial isolation of output from input. In a conventional SAW apparatus in which an SAW filter chip is accommodated into a package, the ground electrodes of input and output inter-digital transducers (IDTs) are connected in common to the ground electrode of the package member in order to simplify wiring work. With such a structure, however, sufficient attenuation cannot be obtained at the outside of the pass band. The reason thereof will be described below by referring to Fig. 1 Fig. 1 is a rough sketch of an equivalent circuit diagram of a conventional surface acoustic wave apparatus used for describing the effects of inductances formed of bonding wires and the ground electrode of the package member. An SAW filter chip 1 is connected between an input end 2 and an output end 3. Between the input end 2 and the SAW filter chip 1, there exists an inductance L 1 formed of the input electrode made on the package member and an inductance L 2 formed of bonding wire connected between the input electrode of the package member and the hot-side electrode of the input IDT of the SAW filter chip 1. On the other hand, between the SAW filter chip 1 and the output end 3, there exists an inductance L 3 formed of bonding wire connected between the hot-side electrode of the output IDT of the SAW filter chip 1 and the output electrode made on the package member and an inductance L 4 formed of the output electrode. The ground electrodes of the input IDT and the output IDT are connected in common to the same ground pattern of the package member in order to reduce the number of terminals to be mounted to facilitate mounting work. In other words, the ground electrode of the input IDT of the SAW filter chip 1 is connected to the ground pattern of the package member with bonding wire. An inductance L 5 caused by this bonding wire is inserted between the ground electrode of the input IDT and the ground pattern of the package member. In the same way, an inductance L 6 is formed of bonding wire between the ground electrode of the output IDT and the ground pattern of the package member. An inductance L 7 is formed of the ground pattern of the package member. In the above conventional surface acoustic wave apparatus, sufficiently large attenuation cannot be obtained outside the pass band due to the effects of the inductances L 5 and L 6 , caused by the above bonding wires at the ground side, and the inductance L 7 , formed of the ground pattern of the package member. In the surface acoustic wave apparatus specified in Japanese Unexamined Patent Publication No. 4-263509, an SAW filter chip is accommodated into a package member using a multilayer board, and the ground electrode of the input IDT and the ground electrode of the output IDT in the SAW filter chip are connected to ground patterns formed on different layers of the package member to increase attenuation outside the pass band. In other words, as shown in Fig. 2, the ground electrode of the input IDT and the ground electrode of the output IDT in the SAW filter chip are electrically connected to different ground electrodes formed in the package member in the surface acoustic wave apparatus described in this related art. An inductance L 8 formed of bonding wire and a residual inductance L 9 caused by a first ground electrode formed in the package are inserted between the ground electrode of the input IDT and the ground. An inductance L 10 formed of bonding wire and an inductance L 11 caused by a second ground electrode formed in the package are inserted between the ground electrode of the output IDT and the ground. As described above, it is noted in the Publication that the inductances to the ground are completely separated between the input side and the output side, and thereby a decrease in attenuation outside the pass band is suppressed. A surface acoustic wave apparatus has been provided with advanced functions these days. A surface acoustic wave apparatus is proposed, for example, in which a plurality of SAW filters having different pass-band characteristics are accommodated into one package. In such a structure, when the ground electrodes of the input and output sides of a plurality of SAW filters are led independently and connected to ground electrodes formed in the package, the surface acoustic wave apparatus needs to be large. To reduce the dimensions of an entire surface acoustic wave apparatus, very fine electrodes need to be formed in order to independently connect the ground electrodes of the input and output sides of each SAW filter chip to ground electrodes formed in the package, and connection work with bonding wire becomes very complicated. Cost increases much and yield may be reduced. As an SAW filter has used higher frequencies, it becomes difficult to suppress noise just by independent connection of the input ground electrodes and the output ground electrodes because of a large effect of residual inductance. When a number of independent ground electrodes are formed in a package member, paths for leading the case ground of the package to the outside are limited and sufficient case grounding may not be obtained. Thus, noise may become large in the surface acoustic wave apparatus. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a compact, inexpensive surface acoustic wave apparatus in which the effects of residual inductance existing between the ground electrodes of an SAW chip and the ground electrodes of the package member are reduced to increase attenuation outside the pass band, and a decrease in attenuation outside the pass band is suppressed especially at the higher-frequency side. The invention is defined in appended claim 1. The object of the present invention is achieved through the provision of a surface acoustic wave apparatus in which a resonator filter chip including a surface-wave board; at least three interdigital transducers disposed on the surface-wave board; and a pair of reflectors formed at both sides of an area where the three interdigital transducers are formed, are accommodated into a multilayer package having a plurality of ground electrodes, wherein at least one of the ground electrodes of at least one of the interdigital transducers adjacent to the reflectors are connected to at least two different ground electrodes formed on the same layer of the package by at least two bonding wires. In the surface acoustic wave apparatus according to the present invention, the ground electrodes of both-side IDTs adjacent to the reflectors are connected to at least two different ground electrodes formed on the same layer of the package by at least two bonding wires. In other words, the surface acoustic wave apparatus is characterized in that the ground electrodes of both-side input and output IDTs adjacent to the reflectors are connected to at least two different ground electrodes formed in the package by at least two bonding wires. Thereby, ground paths from portions connected to the ground of the series-coupled resonator filter chip to package portions connecting to the external ground are enhanced. The effects of residual inductance at the ground side are reduced, attenuation outside the pass band is increased, and a decrease in attenuation especially at the higher frequency side than the pass band is suppressed. In the surface acoustic wave apparatus, since the ground electrodes of both-side IDTs adjacent to the reflectors are connected to at least two different ground electrodes formed on the same layer of the package, by at least two bonding wires, residual inductance at a portion from the ground edge of the SAW filter chip to a ground terminal of the package is reduced, and the ground paths from the package to an external terminal of the package are enhanced. Therefore, a decrease in attenuation at the higher frequency side than the pass band is suppressed. Thus, a surface acoustic wave apparatus having superior frequency-amplitude characteristics is provided. In the present invention, at least two bonding wires are connected to the ground electrodes of the both-side IDTs adjacent to the reflectors. At least two bonding wires may be connected to the ground electrode of one IDT of the both-side IDTs. Alternatively, at least two bonding wires may include a first bonding wire connected to one IDT of the IDTs adjacent to the reflectors and a second bonding wire connected to the ground electrode of the other IDT. The surface acoustic wave apparatus according to the present invention may be preferably configured such that a third bonding wire connected to the ground electrode of one of the IDTs adjacent to the reflectors is further provided in addition to the above at least two bonding wires, and one bonding wire of the at least two bonding wires is connected to a ground electrode of the package to which the third bonding wire is connected. The ground electrode of the IDT to which the third bonding wire is connected and a ground electrode of the package to which the third bonding wire is connected are connected not only by the third bonding wire but also by the one bonding wire of the at least two bonding wires. Thereby, ground paths between the ground electrode of the IDT and a ground electrode of the package both of which are connected by the third bonding wire are enhanced. Therefore, a decrease in attenuation outside the pass band, especially at the higher frequency side, is effectively suppressed. The surface acoustic wave apparatus according to the present invention may be preferably configured such that a fourth bonding wire connected to the ground electrode of the center interdigital transducer is further provided in addition to the above at least two bonding wires and the third bonding wire, provided as required, and one bonding wire of the at least two bonding wires is electrically connected to a ground electrode of the package to which the fourth bonding wire is connected. Since the ground electrode of the center IDT is electrically connected to a ground electrode of the package by the fourth bonding wire, and one bonding wire of the at least two bonding wires is electrically connected to a ground electrode of the package to which the fourth bonding wire is connected, paths for leading the case ground of the package to the outside are further enhanced. Therefore, a decrease in attenuation outside the pass band, especially at the higher frequency side, is further effectively suppressed. The surface acoustic wave apparatus according to the present invention may be configured such that two series-coupled resonator filters having different pass-band characteristics are provided, the inputs or the outputs of the two series-coupled resonator filters are connected in parallel, and each ground electrode is connected to an independent ground electrode on the same layer of the package by bonding wire. The present invention can also be applied to a two-stage surface acoustic wave apparatus in which two series-coupled resonator filters are connected. A pattern for leading the input and output grounds of such a surface acoustic wave apparatus to the outside can be simplified to some extent. Paths for a case ground can be enhanced to suppress a decrease in attenuation outside the pass band. It is preferred in the surface acoustic wave apparatus having the two series-coupled resonator fliters that a ground electrode formed in the package be electrically connected to at least three external electrodes formed on a surface of the package. Thereby, the case ground is further positively assured, and a decrease in attenuation at the higher frequency side than the pass band is effectively suppressed. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a rough sketch of an equivalent circuit diagram of a conventional surface acoustic wave apparatus used for describing the effects of residual inductances formed of bonding wires and the ground electrodes of a package member. Fig. 2 is a rough sketch of an equivalent circuit diagram of another conventional surface acoustic wave apparatus used for describing the effects of residual inductances formed of bonding wires and the ground electrodes of a package member. Fig. 3 is a rough plan of a surface acoustic wave apparatus according to a first embodiment of the present invention. Fig. 4 is a cross section of the surface acoustic wave apparatus according to the first embodiment of the present invention. Fig. 5 shows the frequency-amplitude characteristics of a first series-coupled resonator filter in the surface acoustic wave apparatus according to the first embodiment. Fig. 6 shows the frequency-amplitude characteristics of a second series-coupled resonator filter in the surface acoustic wave apparatus according to the first embodiment. Fig. 7 is a rough plan of a surface acoustic wave apparatus prepared for comparison. Fig. 8 shows the frequency-amplitude characteristics of a first series-coupled resonator filter in the surface acoustic wave apparatus prepared for comparison. Fig. 9 shows the frequency-amplitude characteristics of a second series-coupled resonator filter in the surface acoustic wave apparatus prepared for comparison. Fig. 10 shows the frequency-amplitude characteristics of a series-coupled resonator filter in a conventional surface acoustic wave apparatus. Fig. 11 is an equivalent circuit diagram of the surface acoustic wave apparatus according to the first embodiment used for describing residual inductance formed of bonding wires and package wiring. Fig. 12 is a cross section of a surface acoustic wave apparatus according to a second embodiment of the present invention. Fig. 13 is a rough plan in section of the surface acoustic wave apparatus according to the second embodiment of the present invention. Fig. 14 shows the frequency-amplitude characteristics of a first series-coupled resonator filter in the surface acoustic wave apparatus according to the second embodiment of the present invention. DESCRIPTION OF THE PREFERRED EMBODIMENTS Surface acoustic wave apparatuses according to embodiments of the present invention will be described below by referring to the drawings. First embodiment Fig. 3 is a typical plan of a surface acoustic wave apparatus according to an embodiment of the present invention. An electrical connection structure of the apparatus will be described below. Fig. 4 is a longitudinal section of the surface acoustic wave apparatus. In Fig. 3, the surface acoustic wave apparatus according to the present embodiment includes first and second series-coupled resonator filters 11 and 12 having different pass-band characteristics. The first and second series-coupled resonator filters 11 and 12 are configured by forming various electrodes described later on a surface-wave board 13, and as a whole a single SAW filter chip 10 is formed. The surface-wave board 13 is made from a piezoelectric material such as piezoelectric single crystal, including LiTaO 3 , LiNbO 3 , and quartz crystal, and piezoelectric ceramic, including lead-titanate-zirconate piezoelectric ceramic. The surface-wave board 13 may be an insulating board, such as alumina, on which a piezoelectric thin film, including ZnO, is formed. In this case, various electrodes described later are formed such that they contact the piezoelectric thin film, in other words, on the piezoelectric thin film or between the piezoelectric thin film and the insulating board. The first and second series-coupled resonator filters 11 and 12 are formed such that the pass band of the first series-coupled resonator filter is 860 to 885 MHz and the pass band of the second series-coupled resonator filter is 810 to 828 MHz. Various electrodes formed on the surface-wave board 13 will be described next. At the center of the SAW filter chip 10, an input electrode 14 is formed. The input electrode 14 is connected to the hot electrode of an IDT 16 disposed at the center of the first series-coupled resonator filter 11 through an impedance-matching IDT 15. The ground electrode of the IDT 16 is connected to a ground-electrode land 16a. IDTs 17 and 18 are formed at both sides of the IDT 16. Reflectors 19a and 19b are disposed at both sides of an area where IDTs 16 to 18 are formed in the direction in which a surface acoustic wave transmits. The hot electrodes of IDTs 17 and 18 are electrically connected to each other with an electrode pattern formed on the surface-wave board 13. An output-electrode land 20a is formed at a certain point in the electrode pattern. The hot electrodes of IDTs 17 and 18 are electrically connected to ground-electrode lands 20b and 20c, respectively. As shown in Fig. 3, in the first series-coupled resonator filter 11, the ground electrode of the center IDT 16 and the ground-electrode land 16a are enclosed by the electrode pattern 20d which connects the hot electrodes of IDTs 17 and 18 in common. The second series-coupled resonator filter 12 is electrically connected to the input electrode 14 through impedance-matching resonators 21 and 22. In the series-coupled resonator filter 12, a center IDT 23 serves as an output IDT, and IDTs 24 and 25 disposed at both sides of the IDT 23 serve as input IDTs. Reflectors 26a and 26b are formed at both sides of IDTs 23 to 25 in the direction in which a surface acoustic wave transmits. The hot electrode of IDT 23 is electrically connected to an output-electrode land 27a formed on the surface-wave board. An electrode connected to the ground of IDT 23 is connected to a ground-electrode land 27b. The ground electrodes of IDTs 24 and 25 disposed at both sides of IDT 23 are connected in common to a ground-electrode land 27c formed on the surface-wave board 13. In this case, the output-electrode land 27a is enclosed by an electrode pattern 27d which connects the ground electrodes of IDTs 24 and 25 in common. The hot electrodes of IDTs 24 and 25 are connected in common and further connected to the input electrode 14 described above. At the output side of the series-coupled resonator filter 12, the ground-electrode land 27b is enclosed by an electrode pattern 27e connecting to the hot electrode of IDTs 24 and 25. As described above, the various electrodes are formed on the surface acoustic board 13, and the SAW filter chip 10 includes a two-stage resonator filter having the input electrode 14 and the output-electrode lands 20a and 27a. In the surface acoustic wave filter apparatus according to the present embodiment, the SAW filter chip 10 is accommodated into a package 30 as shown in Fig. 4. The package 30 includes a package member 31 formed of a multilayer board and a cover member 32 made of a metal. The package member 31 is formed by, for example, a ceramic lamination technology, and has electrodes 31a to 31c in its inside at a plurality of heights. Fig. 4 indicates the heights of electrodes 31a to 31c in a sketch manner. Electrodes 31a to 31c have various patterns. Electrode 31a serves as a ground pattern and is connected to external electrodes 31d and 31e at both ends. Electrode 31b indicates ground electrodes among electrodes 33A to 33H shown in Fig. 3 and described later. Back to Fig. 3, an electrical connection structure by bonding wire between the SAW filter chip 10 and the ground electrodes formed in the package 30 will be described. Electrodes 33A to 33H indicated at the sides of the SAW filter chip 10 in Fig. 3 are formed on the same layer of the package member. Electrode 33B serves as an input electrode, electrodes 33F and 33H serve as output electrodes, and the other electrodes 33A, 33C, 33D, 33E, and 33G serve as ground electrodes. The input electrode 14 of the surface acoustic wave filter chip 10 is electrically connected to an input electrode 33B formed in the package member, by bonding wire 34a. An output electrode 33F of the package member is connected to an output-electrode land 20a by bonding wire 34b. An output electrode 33H is electrically connected to an output-electrode land 27a of the second series-coupled resonator filter 12 by bonding wire 34c. The ground electrode of IDT 17, which is one of the IDTs adjacent to the reflectors of the first series-coupled resonator filter 11, is connected to a ground-electrode land 20b. A ground-electrode land 20b is electrically connected to ground electrodes 33A and 33G by two bonding wires 34d and 34e. A ground-electrode land 20c connected to the ground electrode of IDT 18 is connected to a ground electrode 33G by bonding wire 34f. In other words, the ground electrodes of IDTs 17 and 18 are connected to ground electrodes 33A and 33G formed in the package, by bonding wires 34d, 34e, and 34f. At least two bonding wires, 34d and 34e, are connected to different ground electrodes 33A and 33G. A third bonding wire 34f is connected between a ground-electrode land 20c and a ground electrode 33G. A ground-electrode land 16a connected to the hot electrode of the center IDT 16 is connected to a ground electrode 33E by bonding wire 34j. Ground electrodes 33A and 33G are electrically connected through ground patterns formed in different layers of the package. In the second series-coupled resonator filter 12, electrodes connected to the ground of IDTs 24 and 25 adjacent to the reflectors are connected to a ground-electrode land 27c. A ground-electrode land 27c is electrically connected to ground electrodes 33C and 33D with bonding wires 34g and 34h. In other words, at least two bonding wires 34g and 34h are connected to different ground electrodes 33C and 33D. A fourth bonding wire 34i is connected between a ground-electrode land 27b and a ground electrode 33C. Fig. 5 shows the frequency-amplitude characteristics of the first series-coupled resonator filter 11 at the inside and outside of the pass band in the surface acoustic wave filter apparatus according to the present embodiment shown in Figs. 3 and 4. Fig. 6 shows the frequency-amplitude characteristics of the second series-coupled resonator filter 12 at the inside and outside of the pass band. For comparison, Figs. 8 and 9 show the frequency-amplitude characteristics of first and second series-coupled resonator filters 41 and 42 shown in Fig. 7, which constitute a surface acoustic wave filter apparatus. The surface acoustic wave filter apparatus 40 shown in Fig. 7 is the same as that shown in Fig. 3 except that neither bonding wire 34d nor bonding wire 34f, both shown in Fig. 3, is used. Therefore, the same reference numerals are assigned to the same portions and the descriptions thereof will be omitted. Therefore, the surface acoustic wave filter apparatus 40 shown in Fig. 7 is the same as that described in the above embodiment except that the ground electrodes of both-side IDTs adjacent to the reflectors in the first and second series-coupled resonator filters are not connected to different ground electrodes of the package by at least two bonding wires. It is clear from comparison between the characteristics shown in Figs. 5 and 6 and those shown in Figs. 8 and 9 that the surface acoustic wave filter apparatus of the present embodiment has larger attenuation at the outside of the pass band, especially at the higher-frequency side, for both the first and second series-coupled resonator filters than the surface acoustic wave filter apparatus shown in Fig. 7. Fig. 10 shows frequency-amplitude characteristics in a case in which ground terminals are independently connected to different ground electrodes formed in a package member at the input and output sides of a series-coupled resonator filter as described in Japanese Unexamined Patent Publication No. 4-263509. To facilitate comparison, the same filter as the first series-coupled resonator filter 11 shown in Fig. 3 except for connection with bonding wire at the ground electrodes was made to obtain the characteristics shown in Fig. 10. It is clearly understood from comparison between the frequency-amplitude characteristics shown in Fig. 10 and those shown in Figs. 5 and 8 that the characteristics shown in Fig. 10 indicate larger attenuation outside the pass band than the frequency-amplitude characteristics of the comparison example shown in Fig. 8, but the frequency-amplitude characteristics shown in Fig. 5 has further larger attenuation at the outside of the pass band, especially at the higher-frequency side. It is considered that the reasons why the surface acoustic wave filter apparatus of the present embodiment has a large attenuation outside the pass band as described above are that a residual inductance at portions from the ground terminals of the series-coupled resonator filter to the ground electrodes at the package side and a residual inductance at a ground pattern from the inside of the package to an external terminal are reduced, and a decrease in attenuation at the higher frequency side than the pass band is suppressed due to enhancement of the ground paths. Since the ground electrodes of the center IDTs 16 and 23 of the first and second series-coupled resonator filters 11 and 12 are enclosed by the electrode patterns 20d and 27e connecting in common the hot electrodes of IDTs 17 and 18 and IDTs 24 and 25 in the surface acoustic wave filter apparatus of the present embodiment, parasitic capacitances are generated therebetween. It is preferred that these parasitic capacitances be small. It is preferred that the sides opposing the hot electrodes, of the ground electrodes of IDTs 16 and 23 be small. In contrast, the ground electrodes of outer IDTs 17 and 18 and IDTs 24 and 25 can have larger electrode areas without increasing their sides opposing the hot electrodes. Therefore, an increase in the above parasitic capacitances is small. To increase the number of bonding wires connected to one electrode, the area of the electrode needs to be extended. It is preferred that the number of bonding wires be increased at the ground electrodes of outer IDTs in order to suppress an increase of parasitic capacitance. Therefore, in the present embodiment, since the number of bonding wires connected to the ground electrodes of outer IDTs 17, 18, 24, and 25 is increased as described above, an increase of the parasitic capacitance can be effectively suppressed. Second embodiment Figs. 12 and 13 are a cross section and a partially broken plan in section used for describing a surface acoustic wave apparatus according to a second embodiment of the present invention. The surface acoustic wave apparatus of the present embodiment is configured in the same way as in the surface acoustic wave apparatus of the first embodiment except for the ground patterns formed in the package. In other words, as shown in Fig. 12, the SAW filter chip 10 described in the first embodiment is accommodated into a package 30. The SAW filter chip 10 is secured on a ground pattern 41 formed on a ceramic layer 31e of a package member 31. The ground pattern 41 is formed on the upper surface of the ceramic layer 31e such that it has an almost rectangular shape smaller in area than the ceramic layer 31e, as shown in Fig. 13. The ground pattern 41 is led to peripheral edges of the ceramic layer 31e by lead sections 41a to 41c. In Fig. 13, the lead sections 41a to 41c separately reach three sides of the ceramic layer 31e. On the other hand, external electrodes 42 and 43 are formed at sides of the package member 31 such that they are electrically connected to ground electrodes 33C and 33E described before and also electrically connected to the ground pattern 41. The external electrodes 42 and 43 are joined to the cover member 32 made of a metal, at the upper surface of a ceramic layer 31g. Although not shown in the figure, the other ground electrodes 33A, 33D, and 33E, shown in Fig. 3, are electrically connected to the external electrodes 42 and 43 in the same way as for ground electrodes 33C and 33G. Therefore, in the surface acoustic wave apparatus according to the second embodiment, the ground pattern 41, which is electrically joined to the cover member 32 made from a metal, is formed of internal wiring of the package member 31 made from ceramic, and is led at three portions as described above, a sufficient case ground is obtained. Fig. 14 shows the frequency-amplitude characteristics of the first series-coupled resonator filter in the surface acoustic wave apparatus of the present embodiment. It is clear from comparison between the characteristics shown in Fig. 14 and that shown in Fig. 5, in which case grounding is obtained at two portions, that attenuation can further be increased at the higher frequency side than the pass band. The pass band of the first SAW resonator filter of the present embodiment is 860 to 885 MHz.

Claims: A surface acoustic wave apparatus in which a resonator filter chip (10) includes a surface-wave board (13), characterized in that at least three interdigital transducers (16, 17, 18; 23, 24, 25) are disposed on said surface-wave board (13), and a pair of reflectors (19a, 19b; 26a, 26b) are formed at both sides of an area where said three interdigital transducers (16, 17, 18; 23, 24, 25) are formed whereby said resonator filter chip (10) is accommodated into a multilayer package (30) having a plurality of ground electrodes (33A, 33C, 33D, 33E, 33G), wherein at least one of the ground electrodes (20b; 27c) of at least one of the interdigital transducers (17, 18; 24, 25) adjacent to said reflectors (19a, 19b; 26a, 26b) is connected to at least two different ground electrodes (33A, 33G; 33C, 33D) formed on the same layer (31 b) of said package (30) by at least two bonding wires (34d, 34e; 34g, 34h). A surface acoustic wave apparatus according to Claim 1, wherein said at least two bonding wires (34d, 34e; 34g, 34h) are connected to a ground electrode (20b; 27c) of the same interdigital transducer (17; 24). A surface acoustic wave apparatus according to Claims 1 or 2, further comprising a third bonding wire (34f) connected to the ground electrode (20c) of one of said interdigital transducers (17, 18) adjacent to said reflectors (19a, 19b), wherein one bonding wire (34e) of said at least two bonding wires (34d, 34e) is connected to a ground electrode (33G) of said package (30) to which said third bonding wire (34f) is connected. A surface acoustic wave apparatus according to one of Claims 1 to 3, further comprising a fourth bonding wire (34i) connected to the ground electrode (27b) of the center interdigital transducer (25), wherein one bonding wire (34g) of said at least two bonding wires (34g, 34h) is electrically connected to a ground electrode (33C) of said package (30) to which said fourth bonding wire (34i) is connected. A surface acoustic wave apparatus according to one of Claims 1 to 4, comprising two series-coupled resonator filters (11, 12) having different pass-band characteristics, wherein the inputs or the outputs of said two series-coupled resonator filters (11, 12) are connected in parallel, and each ground electrode is connected to an independent ground electrode on the same layer of said package (30) by a bonding wire. A surface acoustic wave apparatus according to one of Claims 1 to 5, wherein a ground electrode formed in said package (30) is electrically connected to at least three external electrodes formed on a surface of said package (30).

Inventors: IKADA KATSUHIRO, IKADA, KATSUHIRO
Applicants: MURATA MANUFACTURING CO, MURATA MANUFACTURING CO., LTD.
Application year: 1997
Main classification: H03H9
IPC codes: H03H9