CONSTRUCTIVE MODULE OF AN ELECTRONIC TELECOMMUNICATIONS EQUIPMENT, WITH AN INTERFACE TOWARDS A TESTING AND DIAGNOSING SYSTEM

Abstract: A constructive module (1) of an electronic telecommunications equipment is associated with means (4, 5, 6, 7, 8, 9) interfacing it with a testing and diagnosing system. Said means can be connected at least temporarily and in non-invasive fashion and comprise: actuation probes (4), driven by control signals provided by the testing and diagnosing system, for the automatic and programmed insertion of test signals into predetermined points of the module, and monitoring probes (5) for taking from the monitoring points and transferring to the testing and diagnosing system signals present in the module. The probes (4, 5) are connected with the testing and diagnosing system by means of shielded micro-coaxial cables (7, 9). Conditioning devices (17), associated with the cables (7) connected to the actuation probes (4), provide a galvanic isolation between the testing and diagnosing system and the modules (1) under test.

Description: CONSTRUCTIVE MODULE OF AN ELECTRONIC TELECOMMUNICATIONS EQUIPMENT, WITH AN INTERFACE TOWARDS A TESTING AND DIAGNOSING SYSTEM The invention described herein relates to electronic telecommunications equipment and in particular it concerns a constructive module for such an equipment, which module is provided with an interface towards a testing and diagnosing system. In electronic telecommunications equipment (e.g switching exchanges) it is often necessary to check and test the behaviour of the equipment or of parts thereof, both during the testing phase and during its regular operation One of the tests carried out on the system consists in actuating fault conditions and in monitoring and analysing the response of the equipment. The fault condition is generally obtained by forcing some points of the equipment to a pre-set signal level, e.g corresponding to logic 0 or logic 1 , depending on the manufacturing technology employed for the logic circuits mounted on the module. Other tests may require injecting current noises. Hereinafter, the terms "actuation" (with no other specifications) or "signal insertion" shall be used indifferently to indicate both fault actuation and noise injection Tests need to be automated, and this requires that the equipment parts to be tested (hereinafter referred to as "modules") may be associated, at least temporarily, to interfacing means which on the one hand are dπven by a testing and diagnosing system sending the signal insertion commands in programmed fashion, and which on the other hand transfer the responses of the modules to the testing and diagnosing system During the tests it is necessary to obtain conditions exactly corresponding, from the electrical point of view, with those which may occur during equipment operation, the normal operation of the equipment must not be disturbed in the absence of signal insertion and, vice versa, the insertion commands and the responses must not be altered by signals present in a module under test. Moreover, mounting the interface means on the module must not require modifications to the construction or design of the module. According to the present invention, a constructive module of an electronic equipment for telecommunications is provided which allows tests to be performed in such a way as to meet the aforesaid requirements, without placing particular constraints on the module design rules The module is associated with means for interfacing it with a testing and diagnosing system, which means can be mounted at least temporarily and in a non¬ invasive manner onto the module itself and comprise actuation probes, driven by command signals provided by said testing and diagnosing system, for the automatic and programmed insertion of test signals in pre-determined points of the module; monitoring probes, collecting signals present in the module from monitoring points and transferring such signals to the testing and diagnosing system; shielded micro-coaxial cables, connected on the one side to said actuation and monitoring probes and on the other side to connectors provided on the module, for transferring signals destined to the probes or coming therefrom, conditioning devices, which: are associated with the connectors for the cables supplying the actuation probes with the command signals; allow signal insertion into modules based on different technologies by using a same type of command provided by the testing and diagnosing system, and provide a galvanic isolation between the testing and diagnosing system and the module under test. For sake of greater clarity, reference is made to the enclosed drawings, where: - Figure 1 is a schematic view of a constructive module fitted with actuation and monitoring probes, according to the invention, - Figure 2 is a schematic representation of preferred embodiments of the means for connecting a probe to the module, - Figure 3 is an electrical diagram of the connection of an actuation probe, and - Figures 4 to 7 are circuit diagrams of actuation probes In Figure 1 , a constructive module 1 of an electronic telecommunications device (e g a printed circuit board) carries components 2 interconnected by means of the printed circuit made on the module itself The wiring pattem of the printed circuit is shown at 3 Board 1 carries actuation (or signal insertion) probes 4 and monitoring probes 5. Actuation probes 4 may be fault actuation probes or noise injection probes, controlled by a testing and diagnosing system, not represented. They are meant to connect points of the equipment to a pre-determined voltage level (corresponding to logic level 0 or logic level 1 , depending on the probe type) or to inject into these points a noise represented by an adjustable current. Monitoring probes 5 are meant to transfer towards the testing and diagnosing system the electrical responses of the points upon actuation of a fault or injection of a noise, or in general to monitor the normal operation of the equipment. It may be necessary to mount a few tens of probes 4, 5 on each board to be tested: the probes then need to be made as miniaturised units, in order to fit in spaces between the components mounted on the board and not to hamper mounting the boards thus equipped in the same housings (cabinets and drawers) meant to receive conventional boards without probes. In this way, no construction modifications are necessary either to the boards or to the housings: in particular, it is not necessary to make use of extension cards. Signal insertion probes, in the case of fault actuation, may be for example the probes described in our previous Italian patent application No. TO96A000168 filed on 6 March 1996, which discloses also the manufacture of said probes as miniaturised components, e.g. components made by the techniques known with the acronym SMD (Surface Mounting Device). Exemplary embodiments of said probes will be disclosed hereinafter. In case of noise injection, actuation probes can be simple current generators (a transistor with a resistor in series with the emitter), and therefore they can easily be miniaturised, e.g. by using the same technology as that used for manufacturing the fault actuation probes. The same holds true for monitoring probes, which can be made of simple resistors. Hereafter, to keep the description simpler, reference shall be made to fault actuation through the use of the probes according to the aforementioned patent application. The considerations which follow can also be applied to noise injection. A pair of conductors 6 come out from one side of the body of probes 4 for connection to the fault actuation points and to the predetermined voltage, through the access points available on a standard board 1. A shielded micro-coaxial cable 7, through which the command provided by the testing and diagnosing system is carried to the probe, comes out from the other side of the probe. Obviously, if actuation probes 4 send towards the testing and diagnosing system a signal indicating current absorption at the insertion point (as described in the aforementioned patent application), each probe will be associated with a pair of shielded cables 7. Similarly, a conductor 8 for connection with the point on board 1 wherefrom the response is taken and a shielded micro-coaxial cable 9 to send the response to the testing and diagnosing system will come out from monitoring probes 5. With regard to the connection between the probes and the board, depending on the manufacturing technology used for board 1 , access points are either the pins of the components or the through holes on printed circuit wiring 3, or the test points, provided for in the design of the board, for performing functional tests on the board (e.g. the pads for performing so-called "nail bed tests"). Access through component pins is chiefly applicable for less advanced packaging technologies, for instance dual-in-line or pin grid array (known by the acronym PGA), characterised by a wide enough pin pitch, and it requires soldering conductors 6, 8 directly to the pins. For more advanced component mounting technologies, such as the already mentioned SMD technology, where component pin pitch is rather small, access through the pins may be more difficult (or even impossible) once the component is mounted onto the board and it may cause short circuits which may distort the results of the test and possibly even damage the board. Under these conditions, the connection between the probes and the module can be accomplished as shown in Figure 2, by inserting the ends of conductors 6, 8 into metal supports (forks 10 or pits 11 ) inserted in turn into metallized holes 12 (e.g. the through holes normally provided for in the boards). That solution allows both a permanent connection of probes 4, 5 to board 1 (by soldering conductors 6, 8 to supports 10, 11) and a removable connection, by simply inserting the conductors in the supports The same kind of mounting depicted in Figure 2 can be adopted for the aforesaid pads, which generally include holes. Regardless of the mounting way chosen, therefore, it is possible to store a board fitted with the probes, in order to have it always available to repeat the tests, for instance when developing new versions of the equipment. It should be remembered that, to guarantee the effectiveness of the test, it is necessary to take into account that signal propagation phenomena may cause false switching in the circuits downstream of a fault insertion point, even if the actuation probe were ideal (free of parasitic parameters). For this reason even when it is physically possible to apply the actuation probe in correspondence of a transmitter ("driver") to be tested, it may be appropriate to cause the simulated fault at an intermediate point ct the connection between the driver and a receiver The choice of the insertion point can be performed while analysing the board behaviour, by means of software procedures of no interest for the purposes of this invention. It is evident that, if the board fitted with the probes is stored, it is not necessary to repeat the procedures for identifying the test points for subsequent tests. Going back to Figure 1 , the use of shielded micro-coaxial cables 7, 9, for signal transfer between the probes and the testing and diagnosing system guarantees the absence of interference between the test signals and the signals present on the board during the normal operation of the equipment the board is part of. Moreover, the cables also provide for a better control over wave form quality, thanks to controlled impedance, and they allow a fairly wide band of the signal collected by the monitoring probes to be maintained. Lastly, the cross sectional size of these cables does not cause any size problems, and therefore does not hamper mounting the boards in their respective housings, even when each board is equipped with several probes. At the opposite end to the one connected to probes 4, 5, coaxial cables 7, 9 terminate respectively in connectors 13, 14 (of a conventional type), which are connected to lines 15, 16 for connection to the testing system. Connectors 13 for the cables of probes 4 are associated with conditioning devices 17 whose purpose is dual. - to allow use of the same type of fault actuation commands for modules based on different technologies (TTL, CMOS, ECL) which may require forcing the insertion point to logic level 0 or logic level 1 and, for a given logic level, to a different voltage level; - to provide a galvanic isolation between the testing and diagnosing system and the boards under test, to avoid spuπous connections between grounds in different boards or racks through the probes. With this arrangement, the electrical diagram of connection of an actuation probe 4 is as depicted in Figure 3, where the elements described in the previous Figures are indicated by the same references. Vcci . M, Vcc2 indicate the power supply voltage and the ground of board 1 , and respectively the power supply voltage used by the testing and diagnosing system. Conditioning means 17 comprise an opto-isolator 18 whose photodiode is energised by the control signal generated by circuit 21 driving probe 4, whereas phototransistor 20 (e g. an n-p-n transistor) sends the control signal onto cable 7 through a circuit comprising a p-n-p transistor 22 which is to amplify and invert the signals. Thus, the probe is actuated when the photodiode emits light, and not vice versa, as would be the case in the absence of transistor 22. This is required to prevent transient noise on all probes every time the fault insertion command is activated or de-activated For sake of completeness of the description, hereinafter the structure and the operation of probes 4 are summarised. The basic component of probe 4 is a transistor 112, which preferably is an n-p-n bipolar transistor in the solutions shown in Figures 4 and 6 and is a p-n-p bipolar transistor in the solutions shown in Figures 5 and 7. The collector of transistor 112 corresponds to the terminal of probe 4 meant to be permanently or temporarily connected to the fault insertion point Pi. The emitter of transistor 1 12, on the other hand, corresponds to the terminal of the probe meant to be connected, here too permanently or temporarily, to the pre-determined signal level, which is assumed to be ground level M in Figs. 4 and 6, and power supply V cc in Figs. 5 and 7. In general terms, the embodiments using an n-p-π transistor (Figures 4 and 6) allow forcing point Pi to the Iower one of the reference voltage levels corresponding to the two logic levels, i.e. M (typically 0 Volts) or -V cc (e.g. -5V) and the embodiments using a p-n-p transistor(Figures 5 and 7) allow instead forcing point Pi to the higher reference voltage level, i.e. +V CC or M, respectively. In the diagrams of Figs. 4 and 5, probe 4 is connected to the testing and diagnosing system by means of a coaxial cable (corresponding to one of cables 7 in Fig. 1 ) of which shield 1 14 is connected to the reference voltage (ground M or power supply voltage ±V CC ), and hence to the emitter of transistor 1 12, and intemal conductor116 is connected to the base of transistor 1 12 through a bias resistor 1 18 whose resistance is, for example, of the order of 40 Ohm. A suitable command signal supplied through cable 1 14, 116 and resistor 1 18 brings transistor 12 to saturation when fault actuation is desired. In the embodiments shown in Figures 6 and 7 a resistor 120 whose resistance is, for example, of the order of one Ohm, is connected in series with the emitter of transistor 1 12. Thus the current flowing in transistor 1 12 (between collector and emitter)when transistor 112 is in saturation condition, i.e. when fault insertion is being performed, passes through resistor 120. The voltage across resistor 120 is a signal representative of the value of that current, which signal is sent back to the testing and diagnosing system through a coaxial cable (corresponding to the second one of cables7 in Fig.1 ) with a shield 121 which usually is connected electrically in 122 to shield 1 14of the cable driving the base of transistor 1 12, and an internal conductor 123 connected to the emitter of transistor 112. As a consequence, cable 121 , 123 carries a signal which is representative of current absorption in correspondence with fault insertion point Pi, thus allowing indications to be obtained on the electrical load induced on equipment A by the fault insertion. Probe 4 further comprises a capacitor 1 19 which is directly connected between the base and the emitter of transistor 112 to eliminate the effects of the parasitic capacitance (CQQ) existing between the collector and the base, which capacitance makes the presence of probe 4 connected to point Pi affect the signals passing in point Pi, particularly when fault insertion is not being performed. Actually, referring by way of example to Fig. 4, under these conditions, in correspondence with the rising edge of the signal present on point Pi the parasitic capacitance tends to create an electrical coupling between collector and base such as to bring, at least for a short instant, the base of transistor 1 12 to a level sufficient to make the base-emitter junction conduct. Consequently, there is a current flow through the collector and the emitter of transistor 112 itself. This results, in practice, into a rather "distorted" rising edge, that is voltage on point Pi does not grow steeply (step voltage) but rather with a more or less rounded edge influenced by the conduction phase induced into transistor 112. The same considerations apply identical to the embodiment of Fig. 6, and to the falling edges of the signals in the embodiments of Figs. 5 and 7. To eliminate the above drawbacks, capacitor 1 19 must have a capacitance value substantially higher, preferably by about two orders of magnitude, than said parasitic capacitance (which generally is of the order of 1 pF): for instance a capacitance of 40 pF is suitable for capacitor 119. Capacitor 1 19 can effectively contrast (and, for practical purposes, cancel out) the tracking of the collector of transistor 112 by the transistor base due to the parasitic capacitive coupling. The structure just described meets the requirements described above. As was clearly explained in the aforementioned patent application, the electrical structure of the actuation probes is such that they practically do not disturb the operation of the equipment under test in the absence of a simulated fault or injected noise. The use of shielded coaxial cables prevents mutual influence between test signals and signals present on the module during normal operation. Connecting the probes to access points provided in the manufacturing stage and using miniaturised probes eliminate the need for design and construction modifications either for the modules themselves or for the structures destined to house them. Lastly, conditioning means using opto-isolators prevent spurious connections between the grounds of different modules through the testing and diagnosing system. It is evident that what has been described is provided purely by way of non- limiting example and that variations and modifications are possible without departing from the scope of the invention.

Claims: Claims 1. Constructive module of electronic telecommunications equipment, characterised in that such module is associated with means (4, 5, 6, 7, 8, 9) for interfacing it with a testing and diagnosing system, which means can be mounted at least temporarily and in a non-invasive fashion onto the module itself (1 ) and comprise: - actuation probes (4), driven by control signals provided by said testing and diagnosing system, for the automatic and programmed insertion of test signals into pre-determined points of the module; - monitoring probes (5) to collect signals present in the module from monitoring points and transfer such signals to the testing and diagnosing system; - shielded micro-coaxial cables (7, 9), connected on the one side to said actuation and monitoring probes (4, 5) and on the other side to connectors (13, 14) provided on the module (1 ), for signal transfer towards or from the probes (4, 5); - conditioning means (17), associated with the connectors (13) for the cables intended to provide the control signals to the actuation probes (4), to allow signal insertion into modules based on different technologies by using the same type of control signal provided by the testing and diagnosing system and to provide a galvanic isolation between the testing and diagnosing system and the modules under test (1 ). 2. Module as per claim 1 , characterised in that said actuation probes (4) comprise probes for connecting pre-determined points of the module to a pre-determined voltage level to simulate in these points a possible fault condition, and probes for injecting an adjustable current, simulating an interference, into these points, and in that the monitoring probes (5) are arranged to collect the module responses from monitoring points connected with the insertion points and to transfer these responses to the testing and diagnosing system. 3. Module as per ciaims 1 and 2, characterised in that said probes are made as miniaturised components. 4. Module as per claim 3, characterised in that said probes are realised by using the same technology. 5. Module as per any of the claims 1 to 4, characterised in that the insertion and/or monitoring points comprise pins of electronic components (2) mounted on the module (1 ) and said probes (4, 5) are permanently fixed to these points. 6. Module as per any of claims 1 to 5, characterised in that the insertion and/or monitoring points comprise pads for contact with elements of an apparatus for performing functional tests on the module. 7. Module as per any of claims 1 to 6, characterised in that the insertion and/or monitoring points comprise metallized through holes (12) pierced along a wiring for the interconnection of electronic components (2) mounted on the module (1 ). 8. Module as per any of claims 5 to 7, characterised in that the insertion points are placed in correspondence with a component (2) in which the fault is to be simulated or a noise is to be injected. 9. Module as per claim 6 or 7, characterised in that the insertion points are intermediate points of a connection between a first component in which the fault is to be simulated or a noise is to be inserted and a second component which receives signals coming from the first component. 10. Module as per any of claims 6 to 9, characterised in that the probes (4, 5) have conductors (6, 8) for connection with the respective actuation or monitoring point, an end of said conductors being housed in metal supports (10, 11) inserted in turn in said holes (12) or in said pads. 11. Module as per any of claims 5 to 10, characterised in that said insertion points are pre-selected, by means of an automated procedure. 12. Module as per any of claims 1 to 11 , characterised in that said conditioning means (17) comprise an opto-isolator (18) and means (22) for amplifying and inverting the signal emitted by a photo-transistor (19) of the opto-isolator (18).

Inventors: BELFORTE PIERO, MAGGIONI FLAVIO, BELFORTE, PIERO, MAGGIONI, FLAVIO
Applicants: BELFORTE PIERO, CSELT CENTRO STUDI LAB TELECOM, MAGGIONI FLAVIO, BELFORTE, PIERO, CSELT CENTRO STUDI E LABORATORI TELECOMUNICAZIONI, MAGGIONI, FLAVIO
Application year: 1997
Main classification: G01R31
IPC codes: G01R1, G01R31, H04M3