METHOD FOR CONNECTING AREA GRID ARRAYS TO PRINTED WIRE BOARD

Abstract: A method and apparatus are provided for connecting area grid array semiconductor chips (30) to a printed wire board (40). A compliant lead matrix (10) includes a carrier (12) and a plurality of conductive leads (14) arranged parallel to one another and secured relative to the carrier (12) in the form of a matrix. The method includes orienting a first side (16) of the lead matrix (10) to be aligned with a reciprocal matrix of conductive surface pads (36) on the area grid array semiconductor chip (30). First ends (20) of the leads are electrically connected to the conductive surface pads (36) of the area grid array chip (30). The second side (18) of the lead matrix (10) is oriented to be aligned with a reciprocal matrix of conductive surface pads (46) on a printed wire board (40). Second ends (22) of the leads (14) of the lead matrix (10) are electrically connected to the conductive surface pads (46) of the printed wire board (40) thereby establishing an electrical connection between the area grid array chip (30) and the printed wire board (40).

Description: METHOD FOR CONNECTING AREA GRID ARRAYS TO PRINTED WIRE BOARD BACKGROUND OF THE INVENTION The present invention relates to mounting and connection devices and in particular mountmg and connecting microelectronic units such as semiconductor chips on prmted wire boards Early methods of mountmg and connecting semiconductor chips to printed wire boards frequently resulted in unreliable connections Specifically, the early methods provided an electrical connection between a semiconductor chip and a prmted wire board that consisted of a solder joint This type of connection was suitable for normal environments, such as a desk top use However, boards also can be used in other environments subjecting the board and chip to vibrations and temperature changes The vibrations frequently caused fatigue failures in the solder joints Temperature changes also caused connection failures due to the difference in the thermal coefficient of expansion for the semiconductor chips and the printed wire board For example, the prmted wire boards frequently have a thermal coefficient of expansion (for example, 18 x 10 " 6 inch/inch °C) that is about three times greater than the thermal coefficient of expansion for the semiconductor chips (for example, 6 x IO "6 inch/inch °C) Accordingly, when the chip mounted board was subject to temperature changes, the difference in the thermal coefficient of expansion between the semiconductor chip and printed wire board would exert strain on the solder joint therebetween ultimately resulting in a broken connection between the chip and the printed wire board Further improvements in connecting semiconductor chips to printed wire boards were developed to solve this problem Specifically, the semiconductor chips were configured to have leads arranged about the periphery or border of the chip This configuration is known as a peripheral grid array (PGA) chip To overcome the problems caused by the differing thermal coefficient of expansion between the PGA chips and the printed wire boards, the leads on the chip were formed into an S-shape so that the lead could compensate for the differing thermal coefficients of expansion for the PGA chip and the printed wire board duπng temperature changes or vibration See U S Patent 4 827.61 1, U S Patent 5,294,039, and U S Patent 5,317,479 However, because of the drive to miniaturize semiconductor chip and printed wire board assemblies, the S-shaped lead left too much space between the surface of the printed wire board and the semiconductor chip Accordingly, a C-shaped lead was developed to reduce the spacing between the surface of the chip and the printed wire board thereby yielding a mounted chip with a lower profile than with a S-shaped lead The shape of the C-lead however, still allowed the lead to compensate for the differmg thermal coefficients of expansion of the chip and printed wire board during temperature changes and vibrations The C-shaped lead and the S-shaped lead were sufficient to deal with the problem of differing thermal coefficients of expansion between the PGA semiconductor chips and the printed wire board until the advent of area grid array (AGA) semiconductor chips With area grid array (AGA) chips, the conductive connecting surface pads of the chip are arranged in a matrix or an array that is connected to a reciprocal matrix of connecting surfaces on the printed wire board These AGA chips are connected to the printed wire board matrix by solder joints shaped in the form of solder balls resulting the AGA chips sometimes being referred to as ball grid arrays (BGA) These solder balls or spheres are typically made from conventional solder (63 weight percent tin and 37 weight percent lead, 10 weight percent tin and 90 weight percent lead, or an equivalent alloy) However, like the original semiconductor solder joints, these solder ball joints connecting AGA chips to the printed wire board are not very reliable under temperature changes or mechanical stresses like vibrations Moreover, once an AGA chip is mounted on a printed wire board, it is difficult to access a connection point between a single conductive pad on the AGA chip and a reciprocal conductive pad on the printed wire board Accordingl} with a solder ball joint failure, the entire AGA chip must be removed from the printed wire board to correct the bad connection While AGA chips permit further miniaturization of printed wire boards by consolidating the space required to connect the chips to the board, the reliability problems associated with solder joints between semiconductor chips and printed wire boards resurfaced One attempted solution includes the use of solder columns instead of solder ball spheres The solder columns are typically made of solder alloy having a composition of 10 weight percent tin and 90 weight percent lead However, solder columns do not provide improved strength or reliability over solder balls. In addition, the high lead content of this solder alloy is highly undesirable because of heavy environmental pressures to avoid introducing additional lead into the environment Finally, some attempts have been made to use a conductive lead to connect an AGA chip to a printed wire board. For example, U S Patent 5,455,390 discloses a method for placing a plurality of conductive connecting leads between the conductive surface pads of the AGA chip and the connecting surface pads of the printed wire board. However, this method still results in connection failures due to the less reliable type of material (e.g., gold) used to make the conductive connecting leads SUMMARY OF THE INVENTION A method of the present invention interconnects area grid array chips to a printed wire board The method includes orienting a first side of a matrix of a plurality of conductive leads, secured relative to one another in parallel by an insulating carrier, so that the first ends of the matrix are aligned with a reciprocating matrix of conductive surface pads on an area grid array chip The leads are electrically connected to the connecting surfaces of the area grid array chip Next, the second side of the matrix of leads are oriented so that their second ends are aligned with a reciprocating matrix of connecting surface pads on a printed wire board The leads of the second side of the lead matrix are electrically connected to the connecting surface pads of the printed wire board thereby establishing an electrical connection between the area grid array and the printed wire board BRIEF DESCRIPTION OF THE DRAWINGS FIG 1 is an isometric view of a compliant lead matrix of the present invention FIG 2 is a sectional view of FIG 1 FIG 3 is an isometric view of an area grid array semiconductor chip FIG 4 is an isometric view of a printed wire board having a plurality of connecting surfaces arranged thereon FIG 5 is an isometric view of an area grid array chip with a stencil and solder pasted applied thereon. FIG 6 is an isometric view of a plurality of solder posts extending from a surface of an area grid array chip FIG 7 is a side view in elevation of a compliant lead matrix aligned with solder posts on an area grid array chip FIG 8 is a partial perspective view of a printed wire board with a stencil and solder paste applied thereon FIG 9 is a partial sectional view of a plurality of solder posts extending from the connecting surface of the printed wire board FIG 10 is a side view of a second side of a compliant lead matrix aligned with a plurality of solder posts on a printed wire board FIG 1 1 is a side view of a printed wire board and an area grid array chip electrically connected by a compliant lead matrix FIG 12 is a side view of a printed wire board and an area grid array chip electrically connected by a compliant lead matrix (with an insulating carrier of the lead matrix removed) FIG 13 is a side view of a single bow-shaped lead of the compliant lead matrix FIG 14 is a side view in elevation of a method of shaping the leads of the compliant lead matrix FIG 5 is a side view of a double bow-shaped lead of the compliant lead matrix FIG 16 is a side view in elevation of an alternative method of shaping the leads of the compliant lead matrix FIG 17 is a side view of a compliant lead matrix with double bow shaped leads electrically connecting a printed wire board and an area grid array (with an insulating layer of the lead matrix removed) FIG 18 is a side view of a compliant lead matrix with single bow shaped leads electrically connecting a printed wire board and an area grid array (with an insulating layer of the lead matrix removed) DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A compliant lead matrix of the present invention is illustrated generally in FIGS 1-2 at 10 The lead matrix 10 includes an insulating carrier 12 and a plurality of leads 14 The insulating carrier 12 has a first side 16, a second side 18, and a plurality of holes 19 formed therein Each lead 14 includes a first end 20, a second end 22, and a midportion 24 The leads 14 are made of an electrically conductive flexible material such as copper The leads 14 are preferably formed in cylindrical or rectangular shapes and are preferably plated with tin, a nickel-silver alloy or a tin-lead alloy The leads 14 preferably have a length between 50 to 100 millimeters with 80 millimeters being a preferred length The leads 14 preferably have a diameter of about 0 010 to 0 012 inches The insulating carrier 12 is made of nonconductive material preferably including any one of the following materials polyimide, ceramic material. BT, and FR4 The materials sold under the tradename BT and FR4 are well known to those skilled in the art and are available from sources such as DuPont Company of Wilmington, Delaware, Rogers of the State of Colorado, or Hitachi of Japan The insulating carrier 12 preferably is a laminate of materials such as a laminate of one layer of BT and one layer of FR4 bonded together In addition, the insulating material can be made of a water soluble mateπal such as cardboard The insulating carrier 12 preferably has a thickness of about 0 005 to 0 060 inches A matrix of holes 19 in the carrier 12 for receiving lead 14 is created by drilling the holes in the insulating carrier material The holes 19 are preferably spaced apart by a distance of about 0 050 inches The leads 14 are preferably formed and then mounted in the matrix of holes 19 of the insulating carrier 12 The leads 14 are aligned in parallel to one another and perpendicular to the insulating carrier 12 The leads 14 are arranged relative to the insulating carrier 12 so that the first ends 20 and the second ends 22 of the leads 14 are substantially equidistant from the insulating carrier 12 as shown in FIG 2 Alternatively, the leads 14 can be arranged in the insulating carrier 12 so that the first end 20 of the leads and the second end 22 of the leads 14 are not equidistant from the insulating carrier 12 Finally, the leads 14 preferably are arranged so that the each of the first ends 20 of the leads 14 are coplanar relative to each other and each of the second ends 22 of the leads 14 are coplanar relative to each other An area grid array (AGA) semiconductor chip 30 is shown in FIG 3 The AGA chip 30 includes a first connecting surface 32, a second surface 34 and a matrix of conductive connecting surface pads 36 on the first surface 32 The AGA chip 30 is a conventional semiconductor chip housing microelectronic circuitry which has input and output connections made available via the connecting surface pads 36 The AGA chip 30 is provided for mounting and connection on a printed wire board 40 such as shown in FIG 4 The printed wire board 40 has a first surface 42, a second surface 44, and an array of connection surfaces 46 Each connection surface 46 is capable of receiving an AGA chip 30 Accordingly, a plurality of AGA chips 30 can be mounted and connected to the printed wire board 40 Each connection surface 46 includes an array of conductive connecting surface pads 48 sized and arranged to electrically mate with an array of conductive connecting surface pads of an AGA chip The following method is used to interconnect the AGA chip 30 to the printed wire board 40 using the compliant lead matrix 10 of the present invention First, a solder paste is applied to the first surface 32 of the AGA chip 30 to form solders posts on the conductive surface pads 36 Specifical , a first stencil 50 is provided that has a matrix of holes 52 that matches the matrix of surface pads 36 on the AGA chip 30 As shown in FIG 5 the first stencil O is overiayed on the AGA chip 30 with the stencil holes 52 being aligned over the surface pads 36 of the AGA chip Next, a solder paste 54 is applied over the first stencil 50 so that the solder paste 54 fills the holes 52 and bonds onto the surface pads 36 of the AGA chip 30 Once the solder paste 54 has solidified, the first stencil 50 is removed leaving the AGA chip 30 with a matrix of solder posts 56 extending upwardly from the connecting surface pads 36 of the AGA chip 30, as shown in FIG. 6 The AGA chip 30 is now prepared to be connected to the compliant lead matrix 10 As shown in FIG 7, the AGA chip 30 is oriented so that its first connecting surface 32 is facing upward and the lead matrix 10 is oriented relative to the AGA chip 30 so mat the first end 20 of each lead 14 is aligned with a respective one of the solder posts 56, in an end to end relationship While in this position, a hot air gas flow or other means is used to cause the solder posts 56 to reflow establishing an electrical connection between the connecting surface pads 36 of the AGA chip 30 and the first ends 20 of the leads 14 of the lead matrix 10 Next, a solder paste is applied to the first surface 42 of the printed wire board 40 to form solders posts on the conductive surface pads 48 Specifically, a second stencil 60 is provided that has a matrix of holes 62 that matches the matrix of surface pads 48 on the printed wire board 40 The second stencil 60 is overiayed on the printed wire board 40 with the stencil holes 62 being aligned over the surface pads 48 of the printed wire board, as shown in FIG 8 Next, solder paste 58 is applied over the second stencil 60 so that the solder paste 58 fills the holes 62 and bonds onto the surface pads 48 of the printed wire board 40 Once the solder paste 58 has solidified, the second stencil 60 is removed, leaving the printed wire board 40 with a matrix of solder posts 64 extending upwardly from the connecting surface pads 48, as shown in FIG 9 The printed wire board 40 is now prepared to be connected to the compliant lead matrix 10 As shown in FIG 10. the printed wire board 40 is oriented so that its first connecting surface 42 is facing upward Next, the lead matrix 10 is oriented relative to the printed wire board 40 so that the second end 22 of each lead 14 is aligned with a respective one of the solder posts 62, in an end to end relationship While in this position, a hot air gas flow or other means is used to cause the solder to reflow establishing an electrical connection between the connecting surface pads 48 of the printed wire board 40 and the second ends 22 of the leads 14 of the lead matrix 10 This connection establishes an electrical connection between the AGA chip 30 and the printed wire board 40 via lead matrix 10, as shown in FIG 1 1 The compliant lead matrix 10 provides a high strength connection that is about five to seven times stronger than conventional lead connections (e g , gold leads having a diameter of about 2 millimeters) between an AGA chip and a printed wire board Means in addition to the compliant lead matrix can be employed to enhance the strength and reliability of electrical connection between an area grid array chip and a printed wire board, Specifically, in a preferred embodiment of the present invention the solder paste applied to the AGA chip for connecting the AGA chip to the leads of the lead matrix is a lead-free solder This lead-free solder preferably is a composition of tin and silver In one embodiment, the lead-free solder has a composition of 96 percent by weight of tin and 3 percent by weight of silver This lead-free solder has a higher melting temperature than conventional solder (63 weight percent tin and 37 weight percent lead) and therefore provides a reliable electrical connection under highly elevated temperature conditions In addition, this lead free solder is stronger than conventional solder having the capability to better survive mechanical vibrations and the effects of differing thermal coefficients of expansion between an AGA chip and a printed wire board All of these advantages of lead-free solder further accentuate the advantages of increased reliability and strength provided by the compliant lead matrix 10 Using lead-free solder makes trouble shooting for poor electrical connections or other failures easier since the lead-free solder is much less li elv to fail than other connections made with conventional solder therebv effectively reducing the number of likely failure sites. Using lead-free solder also reduces problems associated with reflow of solder between the AGA chip and the lead matrix 10 (that would otherwise occur when conventional solder is used at that connection site) when the conventional solder between the lead matrix and printed wire board is reflowed. Finally, lead-free solder is environmentally friendly reducing the introduction of additional lead in the environment. Once the electrical connection has been made between the AGA chip 30 and the printed wire board 40, the insulating carrier 12 of the lead matrix 10 can be removed. This can be readily accomplished when the insulating carrier 12 is made of a water soluble material such as cardboard. Water or some other suitable fluid is applied to the lead matrix 10 to dissolve the insulating carrier 12 thereby leaving only the leads 14 of the matrix 10 as shown in FIG. 12. This removal step can remove extra weight from the assembly of the AGA chip 30 and printed wire board 40 and can simplify any subsequent rework procedures if the AGA chip 30 needs to be replaced or another type of chip is substituted for the original AGA chip 30. The leads 14 of the lead matrix shown in FIGS. 1-12 are relatively straight. However, the leads can have a nonlinear shape (as shown in FIGS. 13 and 15) to provide additional strain relief in the connection between the AGA chip 30 and the printed wire board 40. As shown in FIG. 13, the leads 14a have a bow-curved shape in which the first end 20 of the lead 14a is in alignment with the second end 22 of the lead 14a but the first and second ends 20 and 22 are offset from the midportion 24 of the lead 14a. A curve 70 forms a transition between the first end 20 and the midportion 24 and a curve 71 forms a transition between the second end 22 and the midportion 24. To form the leads 14a in the shape shown in FIG. 13, two pairs of supports are provided (as shown in FIG. 14): an inner pair defined by a first support 80 and a second support 82. and an outer pair defined by a third support 84 and a fourth support 86 The supports are configured and arranged substantially similar to the insulating carrier 12 and are made of steel. Each support 80, 82. 84 and 86 has a matrix of holes formed therein, and the matrixes are aligned to match the matrix alignment of the matrix of leads 14a. After a complaint lead matrix assembly has been formed such as shown in FIGS. 1 and 2, the first support 80 is fit over the first ends 20 of the leads 14 of the lead matrix 10 and positioned immediately adjacent the insulating carrier 12 while the second support 82 is fit over the second ends 22 of the leads 14a and positioned immediately adjacent the insulating carrier 12 opposite the first support 80. Next, the third support 84 is releasably secured onto the first ends 20 of the leads 14a and the fourth support 86 is releasably secured onto the second ends 22 of the leads 14a. The insulating carrier 12, the first support 80, and second support 82 are then urged in a first direction (A) while the third support 84 and the fourth support 86 are urged in a second direction (B), opposite the first direction. The supports 80, 82, 84, and 86 are moved relative to one another for a distance sufficient to bend the leads 14a into the shape shown in FIG. 13 and then removed from the leads 14a of the lead matrix 10 The leads 14a are sufficiently resilient such that the steel supports (80, 82, 84 and 86) can be removed from the leads 14a without permanently altering the desired shape of the leads 14a shown in FIG. 13. The single bow shape lead 14a provides additional strain relief for the combined mechanical and electrical connection between the AGA chip 30 and the printed wire board 40. The bow shape of the lead 14a permits some movement of the AGA chip 30 relative to the printed wire board 40 without resulting in a failure of the electrical and mechanical connection therebetween whereas a connection formed purely from solder allows no degree of relative movement and a connection formed of a lead 14 of the matrix 10 permits little relative movement between the AGA chip and the printed wire board 40 This additional strain relief can be particularly important when the AGA chip and printed wire board assembly is subject to harsh environmental conditions such as vigorous mechanical vibrations or large temperature changes. Another alternate embodiment is shown in FIG 15 In this case, the leads 14b have a double bow-curved shape, in which the first ends 20 of the leads 14b are in alignment with the second ends 22 of the leads 14b and both the first and second ends 20 and 22 are in alignment with the midportions 24 of the leads 14b. In addition, a first intermediate portion 90 and a second intermediate portion 92 of the leads 14 are in alignment with each other but are offset from the first and second ends 20 and 22 and the midportion 24. A first curve 94 forms the transition between the first end 20 and the first intermediate portion 90 of the lead and a second curve 95 forms a transition between the second end 22 and the second intermediate portion 92. A third curve 96 forms the transition between the first intermediate portion 90 and the midportion 24 and a fourth curve 97 forms a transition between the second intermediate portion 92 and the midportion 24. To form the leads 14 in the shape shown in FIG. 15, two pairs of supports are again provided, along with a medial support (as shown in FIG. 16). An inner pair is defined by a fifth support 100 and a sixth support 102, while an outer pair is defined by a seventh support 104 and an eighth support 106. A medial support 108 is aligned between the other supports and adjacent the insulating carrier 12. The supports are configured and arranged substantially similar to the insulating carrier 12 and are preferably made of steel. Each support 100, 102, 104, 106, and 108 has a matrix of holes formed therein, and the matrixes are aligned to match the matrix alignment of the matrix of leads 14b. After a compliant lead matrix assembly has been formed such as shown in FIGS. 1 and 2, the medial support 108 is slid over the matrix of leads 14b so that the support 108 is releasably secured on the midportion 24 of the leads 14b immediately adjacent the insulating carrier 12 (either next to the first surface 16 or the second surface 18 of the insulating carrier 12). The fifth support 100 is then releasably secured onto the first intermediate portion 90 of the leads 14b and the sixth support 102 is releasably secured onto the second intermediate portion 92 of the leads 14b. Next, the seventh support 104 is releasably secured on the first ends 20 of the leads and the eighth support 106 is releasably secured onto the second ends 22 of the leads 14b. Then, the fifth support 100 and the sixth support 102 are urged in a first direction (A) while the seventh support 104 and eighth support 106 (along with the insulating carrier 12 and the medial support 108) are urged in a second direction (B), opposite the first direction The supports 100, 102, 104, 106 and 108 are moved relative to one another for a distance sufficient to bend the leads 14b into the shape shown in FIG 15 and then removed from the leads 14 of the lead matrix 10 The leads 14b are sufficiently resilient such that the steel supports (100, 102, 104, 106 and 108) can be removed from the leads 14b without permanently altering the desired shape of the leads 14b shown m FIG 15 Similar to the single bow shape lead 14a, the double bow shape lead 14b provides additional strain relief under harsh environmental conditions that would typically cause failure of a conventional solder connection The double bow lead 14b, however, has two curved portions so that the double bow shape provides even more strain relief than the single bow lead 14a FIG 17 illustrates an area grid array chip 30 connected to a printed wire board 40 using a compliant lead matrix 10 having a double bow shape lead 14b of the type shown in FIG 15 Alternatively, a compliant lead matrix having a single bow shape lead of the type shown in FIG 13 could be used in place of the double bow lead as shown in FIG 18 The method and apparatus of the present invention has several advantages and features First, the compliant lead matrix establishes a robust electrical connection between an area grid array semiconductor chip and a printed wire board The leads compensate for the differing thermal coefficients of expansion between the area grid array chip and the printed wire board when the assembly is subject to temperature changes and mechanical stresses such as vibrations The bow shaped lead and double bow shaped lead in the compliant lead matrix accentuate this compensating feature since the bow and double bow shapes provide additional strain relief The increased reliability provided b> the compliant lead matrix of the present invention can be further accentuated bv using lead-free solder to form the electrical connection between an area grid array chip and the compliant lead matrix In sum, the lead matrix of the present invention provides a convenient manner of establishing both a reliable electrical and a robust mechanical connection between a microelectronic component such as an area grid array chip and a printed wire board Although the present invention has been described with reference to preferred embodiments, workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention

Claims: WHAT IS CLAIMED IS 1 A method of securing a matrix of conductive leads to an area grid array comprising. providing an area grid array chip having a connecting surface with a matrix of conductive surface pads; orienting a plurality of conductive leads extending through and secured relative to a carrier, the leads aligned in parallel and being peφendicular to a plane defined by the carrier so that the ends of the leads are aligned with and in close proximity to the conductive surface pads on the area grid array chip; and electrically connecting the leads and the conductive surface pads of the area grid array chip 2 A method of connecting area grid arrays to a printed wire board comprising orienting a first side of a matrix of a plurality of conductive leads, secured relative to one another in parallel with a carrier, so that a first end of the leads are aligned with a reciprocal matrix of conductive surface pads on an area grid array semiconductor chip, electrically connecting the conductive surface pads of the area grid array semiconductor chip to the first ends of the leads of the lead matrix; orienting a second side of the lead matrix so that a second end of the leads are aligned with a reciprocal matrix of conductive surface pads of a printed wire board, electrically connecting the conductive surface pads of the printed wire board with the second ends of the leads of the lead matrix thereby establishing an electrical connection between the area grid array semiconductor chip and the printed wire board 3 A compliant lead matrix for connecting area grid arrays to printed wire boards comprising a carrier having a plurality of holes therein arranged in a matrix and a plurality of conductive leads extending through and being secured in the holes of the carrier to have ends of the leads exposed on each of a first and second side of the carrier, the leads aligned in parallel with a longitudinal axis of the leads being perpendicular to a plane defined by the carrier. 4. The compliant lead matrix of claim 3 wherein the leads of the matrix are shaped so that the ends of the leads extend parallel to a midportion of the leads with the ends of the leads being in alignment with each other but the ends not being in alignment with the mid portion of the leads. 5. The compliant lead matrix of claim 3 wherein the leads of the matrix are shaped so that the ends of the leads extend parallel to the midportion of the leads with the ends being in alignment with and parallel to the mid portion ofthe leads and an intermediate portion of the leads being parallel to but not in alignment with the ends and midportion of the leads. 6. A method of making a compliant lead matrix comprising: inserting a plurality of conductive leads into a plurality of holes in a carrier so that the leads extend through the carrier to have ends of the leads exposed on each of the first and second sides of the carrier, the leads aligned in parallel with a longitudinal axis ofthe leads being peφendicular to a plane defined by the carrier; overlaying a first support having a matrix of holes over the ends of the leads on the first side of the lead matrix so that the first support is releasably secured to the midportion of the leads on the first side of the matrix; overlaying a second support having a matrix of holes onto the ends of the leads on the first side of the lead matrix so that the first support is releasably secured to the ends of the leads on the first side of the matrix; overlaying a third support having a matrix of holes onto the ends of the leads of the second side of the lead matrix so that the second support is releasably secured to the ends of the second side of the leads; and pulling the first support and the carrier in a first direction while pulling the second and third supports in a second direction opposite the first direction to bend the leads so that the ends of the lead are not in alignment with the mid portion of the lead thereby forming the lead into the shape of a single bow; and removing the first, second, and third supports from the leads of the matrix. 7. A method of connecting area grid arrays to a printed wire board comprising: providing a compliant lead matrix including a carrier and a plurality of conductive leads, the carrier having a matrix of holes formed therein and a first side and a second side with the leads being mounted in parallel in the holes of the carrier so that ends of the leads are exposed on opposite sides of the carrier, providing an area grid array semiconductor chip having a connecting surface with a matrix of conductive surface pads; applying solder paste to the connecting surface ofthe area grid array chip to form solder posts extending upward from each of the conductive surface pads of the area grid array chip, orienting the ends of the leads on the first side of the carrier of the compliant lead matrix to be aligned with the solder posts on the area grid array chip so that the leads and the solder posts are arranged in an end to end relationship, applying a hot gas flow to the area grid array chip and the compliant lead matrix to cause reflow of the solder posts with the leads of the compliant lead matrix thereby producing an electrical connection between the leads and the conductive surface pads of the area grid array chip, applying a solder paste to a matrix of conductive surface pads of a prmted wire board to form solder posts extending upward from each of the conductive surface pads of the matrix of the printed wire board, orienting the leads on the second side of the carrier of the compliant lead matrix to be aligned with the solder posts on the printed wire board so that the leads and the solder posts are arranged in an end to end relationship, and applying a hot gas flow to the printed wire board and compliant lead matrix to cause reflow of the solder posts on the printed wire board with the ends of the leads on the second side of the compliant lead matrix thereby producing an electrical connection between the area grid array chip and the printed wire board The method of claim 7 and further comprising the step of after the second applying step, dissolving the carrier of the compliant lead matrix

Inventors: PAI DEEPAK KESHAV, PAI, DEEPAK, KESHAV
Applicants: CERIDIAN CORP, CERIDIAN CORPORATION
Application year: 1997
Main classification: H01L
IPC codes: H01L23, H05K3