Integrated circuit diode with a charge injecting node

Abstract: An integrated CMOS diode (8) with an injection ring (14) which enables construction of an integrated CMOS diode that has the performance characteristics of a high impedance value, when the diode is in the off state, and low impedance, when the diode is in the on state in addition to high breakdown voltages using standard CMOS processing techniques to construct the integrated circuit diode.

Description: This invention relates generally to integrated circuit diodes and more particularly concerns an integrated circuit diode with a charge injecting node. Acoustic inkjet printing applications use RF switch arrays to select an area on the page for printing. Currently, P-i-N diodes, which are discrete components are used in the RF switch arrays because they have the correct diode characteristics to operate correctly. Using discrete P-i-N diodes increases both the size and the cost of the RF switch arrays. Another impact of using discrete P-i-N diodes is that a discrete RC circuit is needed to isolate the P-i-N diode from a driver chip that will be used to drive the P-i-N diode. It would be preferable to use integrated diodes in building RF switch arrays but current technological limitations have prevented their use. This is because current CMOS integrated diodes are not capable of sustaining the performance requirements necessary for the RF switch array. A perfect diode would have a high impedance value when the diode is reversed biased and a low impedance value when the diode is forward biased. However, in all previous diodes built using CMOS technology these two requirements are contradictory due to the nature of doping profiles. A high impedance value when the diode is reversed biased means a high on-resistance value when the diode is forward biased and there is a capacitance value when the diode is reversed biased if there is a low impedance value when the diode is forward biased. An additional problem is that ordinary n+ or p+ CMOS diodes have low breakdown voltages and high capacitance values. Techniques have been found which allows for the fabrication of a CMOS integrated diode with diode characteristics more closely resembling the characteristics of a discrete P-i-N diode. A further diode is disclosed in EP 467 803 A further diode is disclosed in EP 467803 Accordingly, it is the primary aim of the invention to provide a CMOS integrated circuit diode, and a method of fabricating it, that has the performance characteristics of a high impedance value when the diode is reversed biased and a low impedance value when the diode is forward biased. The present invention provides a CMOS integrated circuit diode comprising: a first area lightly doped with a first carrier type, a second area contiguous with the first area and in a plan view completely surrounding the first area, and doped with a second carrier type, a third area contiguous with the second area and in a plan view completely surrounding the second area that is doped identically to the first area, and an injecting node, contiguous with the third area and in a plan view substantially surrounding the third area, that is heavily doped with the second carrier type. The present invention also provides an integrated circuit package as claimed in claim 10. In accordance with the present invention, the inclusion of an injection ring enables construction of an integrated CMOS diode that has the performance characteristics of both low capacitance and low impedance in addition to high breakdown voltages. In particular, a diode can be fabricated in which the diode RF switching characteristics of a high impedance value, when the diode is in the off state, and a low impedance value, when the diode is in the on state, are obtained while using standard CMOS processing techniques to construct the integrated circuit diode. Embodiments of the invention will now be described, by way o example, with reference to the accompanying drawings, in which: Figure 1 is a top view of a CMOS integrated circuit diode made according to an embodiment of the present invention; Figure 2 is a cross-sectional view of the CMOS integrated circuit diode shown in Figure 1 and taken through cross-section line 2-2; and Figure 3 is an alternative top view of a CMOS integrated circuit diode made according to an alternative embodiment of the present invention. Turning now to Figure 1, a top view of a CMOS integrated circuit diode 8 can be seen. Figure 2 shows a cross-sectional view of the CMOS integrated circuit diode 8 shown in Figure 1 and taken through cross-section line 2-2. This diode 8 is constructed using well known N-well CMOS fabrication processes; and therefore the details of those processes are not elaborated here. Instead, the following description concentrates on the layout of the diode 8. It should be noted that this device could be constructed using P-well CMOS fabrication processes with complementary doping and technology. The diode 8 itself is a cylindrical device with a centerline C. The diode 8 is constructed by implanting a ring to form a n-well cathode 12 in a substrate comprised of p+ substrate 26 and p- epi 18 leaving a p- epi anode 10 in the center. In this embodiment, the n-well cathode 12 is implanted approximately 4 µm deep as shown by depth D 1 but can be anywhere within the range of 3.5 µm to 4.5 µm. The n-well cathode 12 starts at a distance of approximately 30 µm from the centerline C and is approximately 18 µm wide, however dimensions of approximately 5 µm to 40 µm for distance from the centerline and a width of approximately 80 µm to 30 µm are acceptable depending on the particular breakdown and RF switching characteristics desired. In the specific example cited the diode 8 will have a breakdown voltage approximately 180 volts and a off capacitance of about 0.25pF. The n-well cathode 12 is connected to electrically by a n+ metal contact 20. Using the n+ metal contact 20 the n-well cathode 12 can now be connected to the external circuit using a metal line 22. The p- epi anode 10 of the diode 8 created by the n-well cathode 12 is connected to ground via a topside p- epi anode contact 16 shown in Figure 1. The p+ substrate 26 is connected to ground via a backside wafer contact (not shown). As shown in Figure 2 the depth of the p- epi 18 is approximately 15 µm (before processing) in this embodiment, although depths in any range from approximately 15 microns to 25 microns will be adequate. Decreasing the depth of the p- epi 18 increases the capacitance and off impedance, and decreases the breakdown voltage. It is anticipated that the device will fail at depths of less than 12 µm. However, increasing the depth of the p- epi 18 increases the on-impedance of the diode 8, therefore it is preferable to keep the depth to less than 25 µm. According to this embodiment, n+ injecting node 14 is formed as a broken ring outside of the n-well cathode 12 and separated from it by a portion of the p- epi 18 region. Ideally the n+ injecting node 14 would not be broken, however, breaking the ring is necessary for connections to other circuitry, in this design. It is conceivable that alternative designs would not require the n+ injecting node 14 ring to be broken, as shown in Figure 3. The n+ injecting node 14 is implanted approximately 0.3 µm deep but values from approximately 0.3 µm to 1 µm are acceptable. The n + injecting node 14 is approximately 6 µm wide but values of approximately 1 micron to 20 µm are also acceptable. The distance the n + injecting node 14 is spaced from the centerline C will vary depending on what breakdown voltage is desired. As an example, a distance of approximately 15 µm will result in a breakdown voltage of approximately 180 volts via simulations using a two dimensional device simulation program, specifically Technology Modeling Associates' Medici program, when parameters such as the ones given above are used for the other elements of the diode. For the n + injecting node 14 to operate correctly it must be spaced at least 1 µm from the n-well cathode 12 to avoid shorting out with the n+ injecting node 14 with the n-well cathode. However, the breakdown voltage decreases as the n+ injecting node 14 is placed closer to the n-well cathode 12, so it must be expected that the breakdown voltage will be very low if the minimum distance is used. The n+ injecting node 14 alters the characteristics of the diode 8 by biasing the diode in either a forward biased mode or a reverse biased mode during operation of the diode 8. When the n+ injecting node 14 is forward biased there is a negative bias on the n+ injecting node 14 as referenced against the p- epi anode 10 and the p- epi 18. The forward bias on the n+ injecting node 14 injects electrons into both the p- epi 18 and the p-epi anode 10. The n-well cathode 12 then drops to a voltage of approximately negative 0.7 volts, or 0.7 volts below the p- epi anode 10 and the p- epi 18, and the diode 8 remains turned on as long as there are electrons in the p- epi 18 and the p- epi anode 10. The injected electrons from the forward biased n+ injecting node 14 reduce the on-impedance of the diode 8 This biasing and impedance setting feature allows the diode to handle a large RF voltage signal when the diode is turned off and to handle a large RF current signal when the diode is turned on. The on-impedance of the diode 8 can be varied by changing the amount of current injected into the n+ injecting node 14. When there is no current, the diode 8 acts as a normal two-terminal diode because there are no injected electrons to reduce the on-impedance. However, as the current into the n+ injecting node 14 rises, more electrons are injected and the on-impedance is lowered. Tests on one device showed an on-impedance of 78.9 ohms with a small current of 0.4 mA into the n+ injecting node 14. As the current was increased to 3.1 mA the on-impedance dropped to 38.5 ohms. As the current was increased to 6.25 mA the on-impedance dropped to 35.9 ohms. When the n + injecting node 14 is reverse biased there is a positive bias on the n + injecting node 14 as referenced against the p- epi 18. When there is a forward bias on the n + injecting node 14 no electrons are injected into the p- epi 18. The diode 8 then behaves as it normally would, however with the n-well cathode 12 and p- epi 18 doping values the diode 8 has a low reversed biased capacitance.

Claims: A CMOS integrated circuit diode (8) comprising: a first area (10) lightly doped with a first carrier type, a second area (12) contiguous with the first area (10) and in a plan view completely surrounding the first area, and doped with a second carrier type, a third area (18), contiguous with the second area (12) and in a plan view completely surrounding the second area, that is doped identically to the first area (10), and an injecting node (14), contiguous with the third area and in a plan view substantially surrounding the third area (18), that is heavily doped with the second carrier type. The diode of claim 1, wherein the first area (10) is circular, the second area (12) is annular, the third area is annular (18), and the injecting node (14) is annular. The diode of claim 1 or 2, wherein the injecting node does not completely surround the third area (18). The diode of claim 1 or 2, wherein the injecting node (14) is in the form of a broken ring. The diode of any of the preceding claims, wherein the injecting node (14) completely surrounds the third area (18). The diode of any of the preceding claims, wherein the injecting node (14) has a width of at least 6 µm. The diode of any of the preceding claims wherein the injecting node (14) has a depth of at least 0.3 µm. The diode of any of the preceding claims, wherein the third area (18) is at least 1 µm wide. The diode of any of the preceding claims, wherein the first carrier type is a p type and the second carrier type is an n type whereby said first area is an anode area and said second area is a cathode area or wherein the first carrier type is an n type and the second carrier type is a p type whereby said first area is a cothode area and said second area is an anode area. An integrated circuit package incorporating a plurality of diodes (8) according to any of the preceding claims.

Inventors: BUHLER STEVEN A, LERMA JAIME, BUHLER, STEVEN A., LERMA, JAIME
Applicants: XEROX CORP, XEROX CORPORATION
Application year: 1997
Main classification: H01L29
IPC codes: H01L27, H01L21, H01L29