Test adapter module for providing access to a BGA device, system comprising the module and use of the module

Abstract: A system and method of constructing and using a test module (105) in situations where internal access to test points on a substrate are unavailable because devices (101) and (103) mounted on the substrate block physical access. The test module (105) is itself a solderable substrate and is imposed, for testing purposes, between the main substrate (102) and the mounted devices (101). For double-sided or stacked main boards, two or more such mudules (105) and (106) can be used interposed between the mounted devices (101) and (103) and the main substrate (102). Vias (205) in the module serve to make contact with the test points and to carry the signals to the edge of the module where cups (204) can be formed by cutting the edge vias in half (402).

Description: TECHNICAL FIELD OF THE INVENTION This invention relates in general to testing multi-processor computer systems and in particular, to a method and apparatus for performing testing of double-sided ball grid array devices. BACKGROUND OF THE INVENTION The basic problem of probe testing double-sided ball grid array (BGA) devices is that the double-sided device implementation on the processor board prohibits access by an oscilloscope or other test device of the critical points of the board that require monitoring. One known prior solution for single unit testing or de-bug testing is to partially depopulate the circuit board by removing SRAMs or other chips one side of the board. This allows access to the testing points, but since the board is only partially functional, the data from the tests on the board does not provide a true and accurate portrayal of the operations of the board. Thus, devices that are BGA mounted, and only single sided, it is possible to merely go to the backside vias and probe those vias to monitor the circuit. But on BGA devices that are double-sided, i.e., have top-side and bottom-side chip entities, there is no known way to probe that type of board while maintaining its full functionality. Another known prior solution is directed to multi-unit testing or full production testing, and this solution is to install test points on the board. However, the test points would add stubs to the circuit which, in turn, cause reflections in the circuits. Given the number of the BGA entities on the board, and the large number of sample points for each entity, the total number of sample points would be prohibitive. The reflection resulting from the large number of stubs cause degradation in the signals. Moreover, the test points add to the cost and complexity in the manufacturing of the boards. EP 0 520 841 A describes a process for enhancing bum-in of composite flip chip semiconductor devices allows for simultaneous bum-in of a plurality of devices without the need for individual test sockets. In one form, the process includes providing an interposer substrate material having a plurality of die receiving areas, represented as interposers. A plurality of conductive traces on the interposer substrate material is electrically coupled to a plurality of electrical vias which extend from a first surface of the interposer substrate material to a second surface. A semiconductor die is positioned in each of the die receiving areas, i.e. on each interposer, such that the die is electrically coupled to the plurality of vias. The semiconductor die are burned-in by subjecting the interposer substrate material to predetermined stresses. The interposer substrate material is singulated to separate the die receiving areas and form a plurality of composite flip chip semiconductor devices. It is the object of the present invention to provide a device that allows for de-bug testing without having to depopulate the boards and could also be used for production testing without causing the reflections in the board circuit and without introducing design changes to the board. This object is achieved by a test adapter module according to claim 1. SUMMARY OF THE INVENTION The above and other needs are met by a method and system that uses a printed circuit board or PCB card traces going between vias and the outer perimeter. The test board is inserted during the device manufacturing stage, or after an error has been detected for de-bugging purposes, the card is inserted so that it is positioned between the main BGA board and at least one of the surface mounted layers. The traces on the test board contact certain portions of the main board, thereby extending signals from that contacted portion to the edge of the test board. This then permits scope probe access to the outer perimeter of test board, which, if desired, could be designed slightly wider than the BGA main board. BGA balls (usually solder) are placed on both sides of the module, securing the device (such as on SRAM) to the module and the module to the main board. Since no depopulation of parts is necessary, the main board is fully functional and the testing will provide accurate test results for de-bug analysis. The module can be incorporated into the assembly manufacturing process. This would allow either random sampling or full lot testing of the main boards by automatic test equipment. This is particularly useful at the initial board production and when upgrades or modifications to the board are made. When the testing phase is completed, only the final assembly process has to be modified, i.e., the module is no longer installed. In prior systems where stubs were used, the removal of those stubs required changes in the board design. In one embodiment the PCB test board is constructed using a matrix of vias with the edge vias cut in half to better accommodate a test probe. A technical advantage of the invention is to use a PCB card as a scope probe adapter to allow testing access to the vias of the double-side BGA board. Another technical advantage of the invention is the use of wire tracing to contact different vias to test points located on the interior of the main board from the test points on the peripheral of the test module. A further technical advantage of the invention is the use of two modules in an over-and-under arrangement to increase the total number of vias being tested. A still further technical advantage of the invention is to use half vias as the testing points to increase the efficiency of the test cycle. The foregoing has outlined rather broadly the features and technical advantages of the present invention in order that the detailed description of the invention that follows may be better understood. Additional features and advantages of the invention will be described hereinafter which form the subject of the claims of the invention. It should be appreciated by those skilled in the art that the conception and the specific embodiment disclosed may be readily utilized as a basis for modifying or designing other structures for carrying out the same purposes of the present invention. It should also be realized by those skilled in the art that such equivalent constructions do not depart from the invention as set forth in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS For a more complete understanding of the present invention, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which: FIGURE 1A depicts an exploded view of the arrangement of the inventive module on a BGA board; FIGURE 1B is similar to FIGURE 1A, and depicts an over-and-under arrangement of the inventive module; FIGURE 2 depicts a card with nine inventive modules, each with a different wire trace for testing different points of functions of the BGA board and BGA device; FIGURE 3 depicts the cutout pattern used to cut the nine inventive modules of FIGURE 2; FIGURE 4 depicts a cutout inventive module with half vias at the edges for use as test points; FIGURE 5A shows the typical dimensions of module inner via; and FIGURE 5B shows the improved dimensions of a module edge via. DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGURE 1A depicts an exploded view of a BGA board with the inventive module. The arrangement forms a sandwich which comprises top-side BGA 101, which may be a SRAM device, or other surface mounted device, a PCB board 102 and bottom-side BGA 103. BGA balls 104 are solder balls that both secure the devices together and electrically connect the devices together. Scope probe adapter 105 is inserted between the top-side BGA 101 and PCB board 102. Adapter 105 can be inserted by a technician as part of a de-bug operation for analyzing a problem with a specific board, or adapter 105 can be inserted by a machine as part of the assembly operation for production run testing. In either case, all, some or just one of the surface mounted devices can be provided with a module. The sandwich stack shown in FIGURE 1A is what defines the need for the inventive scope probe adapter module. If the stack were a single-sided board, i.e., BGA part 103 was not attached, than the probe would not be needed, the back-side vias could be probed. With the double-sided top and bottom BGA parts 101,103 mounted on a single BGA board 102, there is no probe access to the vias. Scope probe adapter 105 fits between board 102 and BGA part 101 and allows probe access to the vias. The vias in board 102 are common to both top-side part 101 and bottom-side part 103, meaning that the vias electrically connect the top part and the bottom part through PCB board 102. FIGURE 2 depicts a production card having nine adapters, each for testing a different central via arrangement and shows the top art work which defines the metal that is deposited on the bare card that makes up the different scope probe adapter modules. As shown in FIGURE 2, peripheral testing points 204 are the probe access points, which are connected to central vias 205 by metal trace wiring 206. The central vias interconnect the BGA parts with each other through PCB board 102. There are 48 peripheral test points and 119 central vias. Thus, there are more vias that may require testing than available test points. A solution to this problem is shown in FIGURE 1B. The arrangement of FIGURE 1B is similar to that of FIGURE 1A, but includes a second adapter module 106, sandwiched between bottom-side BGA part 103 and PCB board 102. This doubles the number of available testing points, i.e., bottom adapter 106 can test different central vias than does top adapter 105. Depending on the type of devices mounted to board 102, the power arrangement, the signal type, the via arrangement and density, signal linking or reflection may be a concern. Since each wire trace 206 is essentially a small stub, having numerous stubs may cause signal linking or reflections in some situations. Thus, using an adapter module with fewer trace wires, such as module 201, which will allow for testing of a specific function without signal problems. Otherwise, a module with numerous wires, such as module 202, can be used which will allow for testing of a plurality of functions. In operation, the probe board can be different for each phase of testing and can be used in any order desired. Another feature of the invention is the formation of set of testing pads 402 (FIGURE 4), each of which forms a little cup to catch the end of a scope probe. The cup makes it easier and faster to align the probe with the testing point. The cup is formed by cutting a peripheral via in half. FIGURE 3 depicts a cutting pattern 301 for making the peripheral via cuts in the adapter module production card of FIGURE 2. Overlaying pattern diagram 300 of FIGURE 3 with module card 200 of FIGURE 2 shows one method of cutting in such a way that the cuts pass through the center of the peripheral vias 204 and 207, thus forming half vias. FIGURE 4 depicts a finished adapter module, separated from the production card with the peripheral test points comprising half vias 402. The module will perform with manual test operations, which could test signal at selected points on the main board or on the mounted module. The adapter allows the individual monitoring of signals with a high frequency oscilloscope for de-bugging purposes. The module is 0,5 mm (twenty (20) mils) wider than the device that it services. If the module was made wider than this, the hot air equipment would not properly solder the balls for the ball grid array. This is because the added width would tend to reduce the temperature of the hot air resulting in poor reflow of the solder balls in the center of the device. Making the module only slightly larger than the device it is testing will allow the automatic test machine easier access to the test points while still allowing for proper solder flow. The module can be extended to a wider width for automatic tests, but this would require corresponding changes in the setting of the hot air equipment. The module can be removed from the circuit board once the testing is completed, or the board may be shipped with the test module left in place. FIGURE 5A shows an inner via 403 typically being about 0,2 mm (0.008") in diameter and FIGURE 5B shows perimeter via being about 0,3 mm (0.012") in diameter. The thickness of the test module would typically be 0,8 mm (0.032"). In the embodiment shown, the vias would be plated solid so as to pass electrical signals and would have pad 501, 502, 503, 504 on the top and bottom surfaces so as to contact with both the main board and with a mounted device. Note, that if the via is too large, then during solder reflow operations solder will be wicked through the capillary formed by the via. Although the present invention and its advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the invention as defined by the appended claims. For example, the printed wire board test module can be constructed from any material and the signal connectivity need not be wire or copper, but could be light passages or be the passage of any type of signal to be measured. Also, for stacked or layered devices, several test modules could be used if desired, one between each layer of devices.

Claims: A test adapter module (105) for providing access to a BGA device (101) that is to be connected to a substrate (102); the substrate (102) having electrical points, arranged in a pattern, which are to be electrically connected to the BGA device (101), the module (105) comprising: a pattern of adapter vias, a plurality of test points (204, 207) arranged around a periphery of the adapter vias and a plurality of signal paths (206) connecting at least some of the test points (204) with selected adapter vias (205, 403); wherein the test adapter module (105) is to be inserted between the BGA device (101) and the substrate (102). whereby the pattern of adapter vias (205, 403) is aligned with the pattem of the substrate electrical points characterised in that test points (204, 207) are edge vias which have been cut approximately in half to form a catch portion forming a cup for receiving and aligning a testing probe. The test adaptermodule (105) of daims 1, wherein the test point vias (204, 207) have a larger diameter than the adapter vias (205, 403). The test adapter module of claim 1 or 2, wherein: the perimeter of the test adapter module (105) is approximately 0,5 mm (20 mils) greater than the perimeter of the BGA device (101). A system comprising: a test adapter module (105) of one of claims 1 to 3; and a substrate (102) having at least two BGA devices (101, 103) connected thereto, with at least one BGA device (101) connected to one side of the substrate (102) and at least one BGA device (103) connected to the other side of the substrate (102), wherein the substrate (102) has vias (403) thereon wherein the test adapter module (105) is to be inserted between one (101) of the BGA devices (101, 103) and the substrate (102). The system of claim 4, further comprising another test adapter module (106) that is inserted between the other (103) of the two BGA devices (101, 103) and the substrate (102). The system of claim 5, wherein: said another test adapter module (106) has a plurality of adapter vias arranged in a pattern that corresponds to and is aligned with the pattern of the substrate electrical points, whereby a corresponding via of the adapter is electrically connected to a corresponding via of said another test adapter module (106), said another test adapter module (106) has a plurality of test points arranged around a periphery of the adapter vias; and said another test adapter module (106) has a plurality of signal paths connecting at least some of the test points with selected adapter vias that are different in location than the adapter vias of the test adapter module (105). Use of a test adapter module (105) as defined in one of claims 1-3 in a manufacturing process of the board. Use of a test adapter module (105) as defined in one of claims 1-3 in a diagnostic operation being performed on the substrate (102).

Inventors: MORRIS TERREL L, ONDRICEK DOUGLAS S, MORRIS, TERREL L., ONDRICEK, DOUGLAS S.
Applicants: HEWLETT PACKARD CO, HEWLETT-PACKARD COMPANY
Application year: 1997
Main classification: G01R31
IPC codes: G01R1, G01R31, H01L21