RAPID PROCESS FOR ARRAYING AND SYNTHESIZING BEAD-BASED COMBINATORIAL LIBRARIES

Abstract: A mixture of beads of uniform size is deposited in an array by establishing discrete alignment areas each consisting of a droplet of adhesive or small area of continuous adhesive layer exposed through an aperture in a mask. Beads which are trapped by the attachment areas are released by either a solvent on a vacuum manifold, or by evaporation of the adhesive, preferably by means of a vacuum centrifuge. The beads are released into capillaries, in which cleavage of attached compounds, or synthesis of new compounds, can be carried out. An apparatus used for carrying out the invention is shown in the figure, which comprises a mask (10) with side walls, an adhesive-coated film (12), a capillary array (16), a gasket (17), and a chemically resistant well plate (18).

Description: RAPID PROCESS FOR ARRAYING AND SYNTHESIZING BEAD-BASED COMBINATORIAL LIBRARIES Field of the Invention This invention relates generally to the handling of bead-based combinatorial branes. and more particularly to an improved process and apparatus for depositing beads in two-dimensional arrays This invention also relates to an improved means of synthesizing combinatorial hbranes in an arrav foimat Background Of The Invention Synthesis of combinatorial compound hbranes on bead supports is a well-established method for generating chemical diversity for screening against targets of pharmacological relevance Such hbranes may be synthesized as bulk populations or discrete sub branes with or without identifier tags for deconvolution In most cases each bead carnes a single unique compound and is present in a mixture of beads containing other compounds To test the beads for activity against a pharmacological target, it is desirable to separate the beads so that each bead may be individually assayed against one or more targets The beads carrying active compounds can be identified and the structure of the compound elucidated It is aiso desirable to separate the beads into arrays that are geometrically compatible with robotic screening systems, for example 12 x 8 arrays oi other formats such as 384 or 1,536-well configurations An alternative approach to the and evaluation of bead-based hbranes is to array the beads pπor to synthesis of the library components This approach has the advantage that the synthetic histo A of each component is known from its position in the array, but has the disadvantage that the synthesis process itself is less facile, particularly for large libraries A process and apparatus that can be used for either approach would represent a substantial improvement over current practice Current methods of bead arraying include manual picking and hydrodynamic sorting, in which beads are allowed to flow though an aperture and once detected are deposited into wells Manual picking is extremely slow and tedious Hydrodynamic methods sort in senal mode and are therefore slow and prone to clogging Further, buoyancy vaπations within the bead librarv are known to cause problems Therefore there is a need for a simple, rapid method for bead arraying which reliably delivers single beads, or a predetermined desired number of beads to each point in die array, which is not affected by the presence of compound on the beads, and which can be configured to suit any desirable format Based on the foregoing, it can be seen that there is a pressing need in the art for improvements in bead arraying equipment and methods The principal object of this invention. therefore, is to provide an improved method for arraying beads, whether or not they have compounds attached to them Another object of the invention is to provide an improved method for delivery of beads to a desired geometπc array It is also an object of the invention to provide an improved apparatus for bead arraying which is inexpensive, easy to use and independent of the presence and identity of compounds on die beads It is a further object of this invention to provide an improved apparatus for synthesis of bead-based combinatoπal hbranes in arrav format, such apparatus being compatible with the manipulation of beads that already have compounds attached Summary Of The Invention In accordance with the invention, the arraying of beads for bead-based combinatoπal hbranes is earned out by establishing a bead-receiving surface composing two components a pattern of discrete bead attachment areas, each capable of holding a limited number of beads of uniform size; and an area, from which beads are free to separate, spacing die discrete bead attachment areas from one another The limited number of beads which each bead attachment area is capable of holding can be one or more than one, and is preferably the same as that for every other bead attachment area in the pattern A mixture of beads of uniform size is placed onto the bead-receiving surface, and, preferably by agitating the bead mixture, a predetermined number of beads from the mixture is caused to attach to each of the discrete bead attachment areas Beads not attached to the discrete bead attachment areas are removed Then the attached beads, which are in a pattern corresponding to the pattern of the bead attachment areas are released and deposited into an array In one embodiment of the invention, each discrete bead attachment area is a portion of a continuous adhesive layer exposed through an aperture in a mask The area from which the beads are free to separate is a surface of the mask In another embodiment, the step of establishing a bead-receiving surface is earned out by applying minute adhesive droplets to a substrate in a pattern The step of releasing the attached beads is preferably preceded by the step of aligning the attached beads with receptacles in an array conesponding to the pattern of bead attachment areas. and die depositing step is earned out by depositing the beads into the receptacles with which the\ --re aligned Where a porous substrate is used, and the bead attachment areas are areas of adhesive on the substrate, die attached beads can be released by washing the substrate with a solvent and thereby dissolving die bead attachment areas In the case of beads having attached compounds representing a combinatonal hbrarv. the depositing step is preferably followed by die step of cleaving a compound from each bead means of a reagent, while the beads remain in the receptacles The receptacles are preferably in the form of glass capillanes arranged so that they can be simultaneously immersed into reagents in the wells of a well plate after the depositing step is earned out Compounds can be cleaved from the beads by die reagents in the wells while the beads remain in the capillanes. and the cleaved compounds can dien be tested for pharmaceutical activity Synthesis of chemical compounds on bead arrays can be earned out using a similar procedure The process for synthesis of pre-arrayed hbranes according to die invention is earned out b\ arraying blank beads into capillanes The capillanes containing the beads are dipped into multiwell containers, each well containing a different chemical reagent Compounds are assembled on the beads by successive transfer of the capillary array into appropnate reagent plates Once complete, the compounds are released from die beads by transfer of the capillary array into a receptacle containing cleavage reagents A synthesizing process m accordance with the invention compnses the steps of establishing a bead-receiving surface compπsing a pattern of discrete bead attachment areas each capable of holding a limited number of beads of uniform size, and an area, from which beads are free to separate, spacing the discrete bead attachment areas from one another Here also, the limited number of beads for each bead attachment area is preferably the same as that for every other bead attachment area in the pattern A mixture of beads of uniform size is placed onto the bead-receiving surface, and a predetermined number of beads from die mixture is caused to attach to each of the discrete bead attachment areas Unattached beads are removed, and the attached beads are aligned widi capillanes m an array of capillanes corresponding to the pattern of bead attachment areas The attached beads are then released and deposited into the array of capillanes The capillanes of the array are introduced simultaneously into wells containing reagents for desired synthetic steps, and syntheses are earned out on the beads while the beads remain in the capillanes The synthesis may be followed by washing the beads in the capillanes to remove unbound reagents, and cleaving synthesized compounds Anodier feature of the invention resides in the structure of the apparatus used in die case in which the bead attachment areas are portions of a continuous adhesive layer The apparatus compnses a mask and substrate The mask is preferably the floor of a tray and has parallel first and second faces and an array of apertures, each aperture extending from the first face to the second face The apertures are of uniform size such that the number ofbcads that can be located abreast in each aperture is limited to a predetermined number At least in the case in which each aperture is intended to receive only one bead, die apertures are preferably circular The substrate is preferably a porous sheet of nitrocellulose removable from the mask, and has a face with a layer of adhesive, preferably ethylene glycol, situated against the second face of the mask and covering openings of the apertures in the second face Thus, a predetermined number of beads, at each aperture, can be deposited onto, and adhere to, the adhesive layer Means are preferably provided for holding die mask in a fixed relationship with an array of receptacles, so that beads deposited d rough the apertures of die mask onto the adhesive layer of die substrate can be readily aligned with the receptacles Vaπous other objects, details and advantages of the invention will be apparent from the following detailed descπption. when read in conjunction with die drawings Bπef Pescπption of the Drawings FIG 1 is an exploded perspective view illustrating a first embodiment of die invention. FIG 2 is a fragmentary sectional view of an assembly consisting of a mask and adhesive- coated film, illustrating a step in the arraying process. FIG. 3 is a fragmentary sectional view of an assembly consisting of the adhesive-coated film with beads adhering to the adhesive layer, illustrating a further step m die arraying process FIG 4 is a fragmentary sectional view of an assembly consisting of the film and an of capillary tubes used as receptacles for beads released from the adhesive layer on the film illustrating a further step in the arraying process, FIG 5 is a fragmentary sectional view showing capillary tubes inserted into wells in a well plate for cleaving of the compounds earned by the beads. FIG 6 is an exploded perspective view illustrating an alternative embodiment of die invention. FIG 7 is a fragmentary sectional view illustrating the deposition of a microscopic adhesive droplet onto a substrate in accordance with still another alternative embodiment of the invention, FIG 8 is a fragmentary sectional view showing a quantity of beads on die substrate, some of the beads being in contact with the deposited adhesive droplets. FIG 9 is a fragmentary sectional view of the same substrate, after the removal of excess beads, FIG 10 is an exploded view showing an assembly for depositing the beads from die substrate of FIG 9 into an array of capillanes. and for immersing the beads, in the capillanes. in reagent-contaming wells. FIG 1 1 is a fragmentary sectional view showing the capillary array of FIG 10 in a vacuum centπfuge. used to release beads from die substrate mto the capillanes. FIG 12 is another fragmentary sectional view, showing capillanes. containing beads, immersed in reagent-containing wells. FIG 13 is a perspective view showing an alternative form of mask, and FIG 14 is a perspective view showing the underside of die mask of FIG 13 Detailed Descnption FIG 1 shows the several components needed to carry out die arraying process in ac-cordance with a first embodiment of the invention These components include a mask 10 with side walls, an adhesive-coated film 12. a capillary array 16. a gasket 17, and a chemicalK resistant well plate 18 The mask 10 is a πgid element, preferably made from stainless steel so that it is chemically inert and can be electncally grounded to avoid die accumulation of a static electπcal charge which could have an attractive or repulsive effect on the beads. The mask is preferably m the form of a tray having a floor 20 and side walls 22, 24. 26 and 28 extending above die upper surface of the floor 20 The floor of the tray is provided wrth an array of circular, cylindπcal apertures 30. extending from die top face (the inside of die tray) to the bottom face (die underside of die In the illustrated mask, ninety six such apertures are provided, in a regular pattern having twelve columns and eight rows This pattern corresponds to die pattern of a conventional, ninety SLX well, rrucrotiter plate The centers of adjacent apertures are spaced from each other die same distance by which the centers of adjacent wells are spaced from each other, typically 09 cm. Other patterns of apertures can be used For example 384 apertures can be arranged in a 16 \ 24 array. 864 apertures can be arranged in a 24 x 36 array, and 1.536 apertures can be arranged m a 32 x 48 arrav The beads m a given mixture to be arrayed should be substantially uniform in size, preferably within a range of ± 20% of a nominal bead diameter The apertures are preferably circular, and of uniform size Their diameter depends on die size of the beads to be arrayed In order for the arraying apparatus to deposit single beads properly, die diameters of die apertures should be in die range of approximately 1 1 to 1 9 bead diameters Noticeabh improved results can be achieved when die diameters of die apertures are in the range of 1 25 to 1 75 bead diameters Optimization of die aperture size, cross-sectional geometry and array geometry may be earned out empiπcally with the objective of achieving reliable deposition of a single bead at each array point For most applications, the optimum aperture diameter is approumatelv 1 3 bead diameters To ensure that a bead enters each aperture in the mask reliably, it is important that the apertures be flush with the top face of the mask Otherwise, burrs and other liτegulaπties extending upwardly from the top face may interfere with the movement of die beads into one or more of the apertures When fabπcatuig a mask for arraying single beads, it is also important to machine the holes in such a way as to make sure that the openings of the apertures are regular circles When fabπcating a mask for multiple beads, the apertures can be of vaπous shapes other dian circular, for example oval The openings of the apertures at the underside of die mask should also be flush with die bottom face and regular so diat no buns or other megulaπties interfere widi die application of die adhesive layer to die underside of die mask, or with die initial attachment of die beads to die adhesive layer The apertures, which are typicalh 350 μm (0 350 mm) in diameter for a 270 μm bead size, can be formed by precision dnlling, or by am of vaπous known micro-machining techniques, including laser dnlling, etching, etc The adhesive-coated film 12 is applied to die underside of the mask in such a wav that tight contact is made with the bottom surface of die mask and widi die perimeter of the bottom opening of each aperture A preferred matenal for the film is nitrocellulose, which has the advantage that it is porous, so that a solvent for dislodging die beads from the adhesive will pass through it readily The film may be either ngid or flexible The film 12 mav be mechanically clamped to die underside of die mask by a frame 14 having a rectangular central opening 32 The frame is provided widi guide holes 34. which extend into bosses 36 projecting from the underside of d e frame The guide holes receive pins 38. which are affixed to the underside of the mask The guide holes and pins ensure tiiat, when the film is removed from die mask, it can be positioned in relation to the capillary array 16 so that the beads adhering to the adhesive la\er on the film are aligned widi die openings of the capillanes In the case of a ngid film, the frame can be eliminated, and the comers of die ngid film can be provided with guide holes to facilitate alignment of d e film with the capillary array In another alternative embodiment, which will be descπbed widi reference to FIG 6. die mask and die adhesive layer remain attached to each odier. and the sidewalls of the mask fit tightly over the sides of die capillary array so that the apertures in the mask are accurately aligned widi the upper ends of die capillanes The upper side of die adhesive-coated film 12, as seen m FIG 1, is coated wid a suitable adhesive to present a sticky surface to which the beads may attach The adhesive should be readily soluble in a bead-compatible solvent and easy to remove from the beads In the case of a polystyrene bead and a nitrocellulose film, ethylene glycol has been found to be a suitable adhesive because it can be removed readily by washing with methanol. and both ethylene glycol and methanol are compatible with analytical procedures using mass spectrometry The adhesive must be exposed on die side of die film to which die beads are to attach However, die adhesive laver need not be a discrete layer For example, in the case of ethylene glycol on a porous nitrocellulose film, the nitrocellulose film should be minimally saturated widi e iylene glycol That is, the ethvlene glycol can be made to permeate die entire film b\ soaking the film and diereafter removing excess ethylene glycol by pressing the film against absorbent surfaces or allowing the excess to flow off die film or evaporate or by using centπfugation The capillary array 16 compπscs a set of glass capillanes 40 fixed in a PTFE supporting block 42 Optionally . the tops of the capillanes may be flared and die capillanes may be removably seated in the block 42 The capillanes are disposed in an array of rows and columns corresponding to the apertures in the mask They have openings 44 in the upper surface of the block 42 These openings are large enough to allow beads to enter d e capillanes Openings are also provided at die lower ends of die capillanes. but die openings at the lower ends are small enough ύiat the beads cannot pass through them The lower portions of the capillanes project downward from die underside of block 42 Guide pins 45 extend upwardly from die comers of the block The well plate 18 is a conventional well plate of PTFE or other suitable chemically resistant matenal. with an array of wells 46 corresponding to die arrays of openings in the mask and capillanes The wells are capable of receiving the lower portions of the capillanes Preferably, the capillanes extend below block 42 bydie bottoms of the wells when block 42 rests on top of die well plate 18 To array the bead library, die mask 10 and die frame 14 with the adhesive-coated film are assembled as shown in FIG 2. with alignment pins 38 on the underside of the mask inserted into the guide holes in bosses 36 Dry beads 48 are poured onto die top face of the floor 20 of the mask The assembly consisting of the mask, the frame and die adhesive-coated film is then agitated gently so that die beads cover die entire top surface of the mask floor Beads will fall into the apertures 30 of die mask For example, beads 50. 52 and 54 in FIG 2 are shown in apertures 30 Since the di-ameter of e apertures is less than twice the diameter of the beads, only one bead can fit into each aperture, it is not possible for two or more beads to fit abreast of one another in a given aperture The beads that fall into the apertures of the mask contact an adhesive layer 56 on film 12 When the beads contact die adhesive, diey become entrapped The mask ensures diat only one bead can contact the adhesive in each aperture Wrth the adhesive-coated film 12 still attached to die mask, the mask is inverted, and excess beads are poured off Any beads not m the apertures, but tending to remain attached to the mask are removed by gently tapping the mask The frame 14. along with the adhesive-coated film and die beads adhering to it, is detached from the mask, inverted as shown in FIG 3. and attached to the capillary supporting block 42 as shown m FIG 4, with pins 45 of die capillary block fitting into the holes 34 to ensure alignment of the attached beads with die capillanes A solvent, for example a mixture consisting of 50% methanol and 50% water, is applied to the upper surface of the film 12 The solvent passes through the pores of the film and dissolves the adhesive, diereby releasing the beads into die capillanes as shown in FIG 4 The beads remain in the capillanes because the bottom openings 58 of the capillanes are smaller than the beads Optionally the release process may be aided by centπfugation of the entire assembly Cleaving of die compounds of interest from die beads is earned out by placing the capillary block onto the well plate so that die capillanes enter the wells as shown in FIG 5 The gasket built mto the capillary block provides a seal Each well 46 contains a cleavage reagent, for example an acid cleavage reagent such as tπfluoroacetic acid, or a base cleavage reagent such as tnethylaπune or hydrazine Solvents such as methylene chloπde or medianol may be included to cause the beads to swell, thereby opening the pores of die beads These additives also serve to dissolve die compounds diat are released by die cleavage reagent Dimethyl sulfide may also be included as a carbocation scavenger to prevent reattachment of compounds to the beads To retard evaporation of die cleavage reagent, a chemically resistant gasket and glass plate (not shown in FIG 5) may be placed over die upper ends of die capillanes The liquid m the wells 46 passes d rough the openings 58 at the lower ends of die capdlanes and comes into contact with the beads After a time, the compounds cleaved from die beads diffuse into die liquid in the wells The capillary block can then be removed, so diat testing can be earned out on the compounds in die wells The reason for the use of d e capillanes is that when die beads remain m prolonged contact with the cleavage reagent d e cleaved compounds have a tendency to reattach themselves to the beads The capillanes make it possible to remove the beads from the cleavage reagent and diereby prevent reattachment In cases where the compounds can be tested while attached to die beads, or where reattachment can be avoided by odier techniques, die beads can be released from the adhesive-coated film direcdy into wells in a well plate The capillanes provide die further option of using the apparatus for compound synd esis Synthesis can be earned out by arraying blank beads, or beads carrying a common precursor compound, mto capillanes using the mediod descnbed above The reagents for the synthesis are dispensed into a senes of multi-well plates, preferably by a robotic dispenser Compounds are assembled by introducing die capillary array containing die beads into die reagent plates Optionally, the reagent plates can be heated or cooled to control reaction temperature The capillanes may be sealed at the top to prevent evaporation by clamping a chemically resistant plate over the top of the array Optionally, the plate may be provided widi a gas port to introduce either gaseous reagents or an inert atmosphere to the beads via the capillanes Reagent plates may optionally be sealed widi a chemically resistant membrane which can be punctured by the capillanes during placement of the capillary array over the plate Successive reaction steps are accomplished by transferring the capillary array from one reagent plate to another, with optional intervening wash steps In the embodiment shown in FIG 6. for arraying and subsequent cleavage of beads, a mask 60 compπses a floor 62 with an array of apertures 64 Sidewalls 66 extend bodi upwardly and downwardly from the floor 62 The upwardly extendmg parts of the sidewalls. together with die floor 62, form a tray to receive a sheet 68 of porous nitrocellulose film, which is coated w th an adhesive, for example ethylene glycol This tray also serves to hold a solvent for dissolving the adhesive The downwardly extending parts of the sidewalls also cooperate with the floor of the mask to form a tray for holding beads These same downwardly extending parts of the sidewalls form a recess receiving the upper portion 70 of a well plate 72 This recess conforms to portion 70 of the well plate and ensures diat the apertures 64 of the mask are aligned widi the wells 74 In arraying beads using the apparatus of FIG 6, the sheet 68 of adhesive-coated film is placed on die upper surface of die mask so that die adhesive is in contact with the upper surface The mask is then mverted and beads are placed onto d e mask By agitation of die beads and/or die mask, beads are caused to enter die apertures and come into contact widi the adhesive layer The mask is men mverted once again and excess beads arc removed After the excess beads are removed, the mask is fitted onto die well plate, and a solvent, such as a mixture consisting of 50% methanol and 50% water, is poured onto e film in the upper part of the mask The solvent passes through the pores of the film and dissolves d e adhesive, diereby releasing the beads mto die wells 74 To expedite die passage of the solvent d rough die porous film, die assembly consisting of the mask 60. the sheet 68 and die well plate may be placed on a vacuum manifold or in a centπfuge The beads are released into the wells of die well plate and cleavage of die compounds earned by die beads, and subsequent testing steps may be canned out in the wells In an alternative embodiment (not illustrated), die mask 60 can be used in conjunction with a capillary block of the land illustrated in FIGs 4 and 5 In diis embodiment, the downwardly extending walls of die mask also serve to align the mask with the capillary block In expeπments earned out to determine die effectiveness of die above-descπbed process, polystyrene beads having a diameter of 270 μm were anayed using a 96 aperture, stainless steel mask having apertures widi a diameter of 350 μm Beads were reliably received in all of the apertures When the adhesive-coated film was removed, 94 of die arrav points had a smgle bead. one had two beads and one had no beads As mentioned previously, instead of using an apertured mask to establish a pattern of adhesive bead-attachment areas, it is possible to achieve die same objective by applying individual droplets of adhesive to a substrate bv using, for example, a dispenser of the type used in ink-jet printing As shown in FIG 7. in which a stainless steel tray 76 serves as a substrate, droplets 78 of an adhesive such as ed ylene glycol are deposited in a predetermined pattern by means of a piezoclectnc dispenser 80 The dispenser 80 is movable in two dimensions in a plane above the surface of tray 76 by a conventional x-y plotter dπve or similar mechanism The dispenser head is a head of die land used in ink jet printing, and. aldiough not shown in detail, it compπses a glass capillary tube having a bonded ceramic collar When a voltage is applied to die ceramic collar, the collar contracts, expelling extremely small droplets from die glass capillary Droplets as small as 0 2 nanohters have been dispensed reliably For die purpose of this invention, a typical adhesive droplet of about one nanoliter is generally adequate to capture an individual bead After the pattern of adhesive droplets is established on the surface of tray 76. a quantity of beads 82 is placed onto die surface of the tray, as shown in FIG 8 The beads are agitated, eidier by movement of the tray, or by other means, for example a stream of air The agitation ensures diat each adhesive droplet has attached to it a single bead or. if die droplet is larger, a predetermined number of beads greater dian one As shown in FIG 8, beads 84. 86, 88 and 90 are attached to droplets 92, 94, 96 and 98 respectively The sidewall 100 of the retains the beads After the beads are agitated and each adhesive droplet has the desired number of beads attached to it. the tray is mverted. as shown in FIG 9, and die excess beads are poured off. leaving only the attached beads in a pattern conesponding to the pattern in which the adhesive droplets As shown in FIG 10, tray 78 fits over a PTFE block 102. which supports a set of glass capillary tubes 104 The upper ends 106 of die capillary tubes are flush with the upper surface 108 of die block, and arranged in a pattern corresponding to die pattern of adhesive droplets on die tray in FIG 7 The upper ends of the set of capillanes are sunounded by a chemically resistant elastomeπc seal 1 10, which contacts the tray 78 when it is placed over die block The block 102 fits mto a rectangular supporting frame 112, having a shelf 114 extending around its inner walls The upper surface of the shelf is spaced from the lower edge 1 16 of die frame by a distance greater than the distance by which the capillary tubes project below the lower face of block 102 Thus, when die block is received in the frame, the capillanes are protected from damage As shown in FIG 11, die upper ends of die capillary tubes 104 are flared so that the\ are retained in block 102. and also to allow some tolerance in the alignment of the beads (e g 84 and 86) widi the capillary tubes The lower ends of die capillary tubes have small openings 1 18. which are smaller than the beads The assembly compnsing block 102, tray 78 and frame 1 16 is placed on a holder 120 of a vacuum centnfuge, the holder being pivotally supported by trunnions, one of which is seen at 122 Preferably other similar assemblies are simultaneously placed on od er holders in d e centnfuge for balance Operation of the centnfuge causes the adhesive droplets to evaporate and the beads to move to the lower ends of die capillary tubes No solvent is needed to remove die beads from the tray, and consequently it is not necessary for the tray to be porous Removal of d e beads from the adhesive droplets can be accomplished in minutes by applying a high vacuum at an elevated temperature (e g 65° C) Under these conditions in a centnfuge. the beads can be transfened direcdy mto the capillary tubes It is, of course, possible to effect removal of the beads from the adhesive droplets by using a solvent, in which case a tray having a porous floor may be used As shown in FIG 12, the block 102. with its capillary tubes each containing a bead, is placed on a well plate 124 so that the lower ends of die capillary tubes are immersed in reagent in the wells 126 The well plate is also shown in FIG 10 The downwardly extending parts of the walls of frame 1 16 serve to align the block with the well plate so that the capillary tubes enter die wells Reagent enters the capillanes through their openings 118 for contact widi the beads While, for cleaving of compounds from die beads, it is not ord-πanly necessary to seal die capillanes. in die case of syndiests of compounds on die beads, seals may be provided to isolate die reactions from one another Thus, as shown m FIG 12. an elastomcπc sheet 128 is provided between the underside of the block and die upper surface of the well plate The sheet 128 is preferably a chemically resistant fluoroelastomer such as the mateπal available under die trademark VTTON The sheet 128 is provided with perforations which are penetrated by die capillary tubes as they enter the wells The edges of die perforations engage the capillary tubes and provide a seal preventmg liquids and vapors from each well from entering adjacent wells At the upper surface of die block 102. a VTTON gasket 130 is provided undemeadi a glass plate 132. which also engages seal 1 10 The gasket and glass plate isolate die upper ends of die capillary tubes from one another The assembly can be heated, where desirable, depending on die nature of die reactions taking place Ports (not shown) can be provided in the glass plate 132 for the introduction of gases or an inert atmosphere In the case of cleaving of compounds, die isolation of die wells and capillary tubes is normally unnecessary . and dius the glass plate and VTTON sheets can be omitted ed between die block 102 and the well plate 124, as shown in FIG 10 When using droplets of adhesive to capture single beads, die droplets are typically in the range of 1-2 nanoliters so that the diameter of each adhesive droplet is less than the diameter of a bead Thus, only one bead is captured at any given location within the array If more than one bead is desired at an array position, the volume of the dispensed adhesive can be increased FIGs 13 and 14 shown an alternative form of mask in which a stainless steel floor 136. having a pattern of apertures 138. has a side wall 140 extending perpendicularly from one face and adapted to fit over block 102 (FIG 10) in such a way as to align the apertures 138 with die openings at the upper ends of die capillary tubes On the other side of die floor a wall 142 is provided to receive a porous adhesive-coated sheet, and to retain a solvent, e g a mixture consisting of 50% medianol and 50% water, for releasing beads from die sheet As will be apparent from the above descπption, the invention allows beads to be deposited rapidly and reliably in a desired geometπc array It is simple, inexpensive and easy to use. especially in compaπson to pπor techniques, which were generally more complex, slower and less reliable The invention allows compounds to be syndiesized in an array format and released for evaluation, dius it has the capability to accommodate eidier split-synthesis protocols with bulk beads, or directed arrays of compounds widi known synthetic histoπes Vanous modifications can be made to the apparatus and process descnbed For example, although a porous nitrocellulose film is preferred, odier mateπals, such as PTFE (polytetrafluoroethylene), porous nylon and PVDF (polyvmylidcne difluoπdc) films may be used Although a porous nitrocellulose film minimally saturated with ethylene glycol is prefened. it is possible to provide die adhesive in a discrete layer on a porous or non-porous film Vanous alternative adhesives. such as DMSO and glyccrol. may be used, although giycerol is somewhat less satisfactory because it is deliquescent Instead of using cleavage reagents such as tπfluoroacetic acid, tπediylanune or hydra-αne. altematn e methods such as photo cleavage can be used to remove die compounds of interest from the beads In carrying out the arraying process, it is possible to release die beads from die adhesive layer or droplets by applying die solvent directly to die side of die surface to which the beads are attached This may be done by placing the surface, widi the beads attached to it against the top surface of a well plate in which the wells contain the solvent, and dien inverting the well plate and film together so that the solvent can contact the adhesive and diereby release die beads In another modification, where it is desired to deposit multiple beads at each locauon in the array, the apertures in the mask can be of a size such that each one accommodates a predetermined number of beads, greater than one. abreast The apertures can be of vanous shapes odier than circular, for example oval Whereas the embodiments descnbed herein utilize planar bead attachment surfaces, it is possible to use non-planar surfaces such as cy ndπcal masks For example, a cylindπcal surface formed into a rotating drum will lend itself to continuous, automated operation It is also possible to compartmentalize the surface by partitions so that different sublibranes can be located in discrete areas of the array In a further modification of die invention, the mask can be provided widi apertures of a size less than that of the smallest bead to be arrayed, and attached to a plenum chamber on which a vacuum is drawn to trap the beads against die apertures by air pressure The apertures can be tapered so diat the smallest diameter of the aperture is smaller than that of die smallest bead, and d e entrance is larger than die largest bead Using this technique, a range of bead sizes can be accommodated Beads are deposited mto receptacles by releasmg the vacuum, thereby equalizmg die pressure on bodi sides of die mask Still other modifications can be made to die apparatus and process descnbed without departing from die scope of the invention as defined in the following claims

Claims: Claims What is claimed is 1 A process for arraying beads for bead-based combinatoπal hbranes which compπses establishing a bead-receiving surface compπsing a pattern of discrete bead attachment areas, each bead attachment area bemg capable of holdmg a limited number of beads of uniform size, and an area, from which beads are free to separate, spacmg the discrete bead attach- ment areas from one another, die limited number of beads for each bead attachment area bemg the same as iat for every odier bead attachment area the pattern. placing a mixture of beads of uniform size onto the surface. causing a predetermined number of beads from the mixture to attach to each of the discrete bead attachment areas removing from the surface beads which are not attached to d e discrete bead attachment areas, and thereafter releasing die attached beads from the discrete bead attachment areas and depositing diem in an arra\ 2 A process according to claim 1 in which each bead attachment area is of a size such tiiat the number of beads which attach to it is limited to one 3 A process according to claim 1 in which each discrete bead attachment area is exposed dirough an aperture in a mask, and which die area from which the beads are free to separate is a surface of die mask 4 A process according to claim 1 in which each discrete bead attachment area is an area of adhesive, and in which the area from which die beads are free to separate is a substantially adhesive-free area 5 A process according to claim 1 in which each discrete bead attachment area is an area of adhesive, in which die area from which me beads are free to separate is a substantial adhesive-free area, and in which me pattern of discrete bead attachment areas is established b\ exposing discrete areas of a continuous adhesive layer dirough a pattern of apertures in a mask, the substantially adhesive-free area bemg a surface of the mask 6 A process accordmg to claim 1 m which the step of establishing a bead-receiving surface is earned out by applying adhesive droplets to a substrate in a pattern, each adhesive droplet m the pattern constituting one of die bead attachment areas 7 A process accordmg to claim 1 in which each discrete bead attachment area is an area of adhesive on a porous substrate, and m which the step of releasmg the attached beads is earned out by washing the porous substrate with a solvent and diereby dissolving the bead attachment areas 8 The process accordmg to claim 1 in which die step of releasing the attached beads is preceded by die step of aligning the attached beads with receptacles in an array of receptacles correspondmg to die pattern of bead attachment areas, and die depositmg step is earned out by depositing die beads mto die receptacles with which they are aligned 9 The process accordmg to claim 1 in which die step of releasing the attached beads is preceded by die steps of aligning the attached beads with receptacles m an array of receptacles corresponding to die pattern of bead attachment areas, the depositmg step is earned out by washmg the beads mto die receptacles with which diey are aligned, and the depositmg step is followed by die step of cleaving a compound from each bead by means of a reagent, while the beads remain the receptacles 10 The process accordmg to claim 1 in which the step of releasmg the attached beads is preceded by die steps of aligning the attached beads with capillanes m an array of capillanes corresponding to the pattern of bead attachment areas, the depositing step is earned out by washing the beads mto die capillanes with which they are aligned, and die depositmg step is followed by die step of introducing the capillanes. containing beads, mto wells each containing a reagent, and cleaving compounds from die beads by means of the reagents in die wells, while the beads remain m the capillanes 11 The process accordmg to claim 1 in which die step of causing a predetermined number of bcads from the mixture to attach to each of e discrete bead attachment areas is earned out by agitation of the beads 12 The process accordmg to claim 1 in which the depositmg step is followed by the steps of washing the beads and cleaving compounds from die beads 13 The process accordmg to claim 1 in which the depositmg step is followed by die steps of washmg die beads and cleaving compounds from die beads, and further compπsing die step of testing the cleaved compounds for pharmaceutical activity 14 A chemical compound identified as having pharmaceutical activity by the process of claim 13 15 A process for synthesizing arrays of chemical compounds which compπses establishing a bead-receiving surface compnsing a pattern of discrete bead attachment areas, each bead attachment area bemg capable of holdmg a limited number of beads of uniform size, and an area, from which beads are free to separate, spacmg the discrete bead attachment areas from one anodier. the limited number of beads for each bead attachment area bemg the same as that for every other bead attachment area in the pattern. placing a mixture ofbcads of uniform size onto d e surface, causing a predetermined number of beads from die mixture to attach to each of the discrete bead attachment areas. removing from the surface beads which are not attached to die discrete bead attachment areas, aligning die attached beads with capillanes in an array of capillanes correspondmg to die pattern of bead attachment areas. releasmg the attached beads from the discrete bead attachment areas and depositmg d em mto die array of capillanes. and introducing die array of capillanes mto wells containing reagents for desired syndietic steps and carrying out syntheses on die beads while the beads are m die capillanes 16 The process according to claim 15 in which the step of carrying out syntheses on the beads is followed by washing the beads in the capillanes to remove unbound reagents, and cleaving synthesized compounds 17 Apparatus for arraying bead-based combinatonal hbranes compπsing a mask having parallel first and second faces and an array of apertures, each aperture extending from the first face to the second face, the apertures being of a uniform size such that the number of beads that can be located abreast in each aperture is limited to a predetermined number, a substrate having a face with a layer of adhesive on the face, the layer of adhesive being situated against the second face of the mask and coveπng openings of the apertures in the second face, whereby a predetermined number of beads in each aperture can be deposited onto, and adhere to, the adhesive layer 18 Apparatus according to claim 17 in which the mask constitutes at least part of the floor of a tray 19 Apparatus according to claim 17 in which the substrate is removable from the second face of the mask 20 Apparatus according to claim 17 in which each of the apertures has a first opening with a circular edge on the first face of the mask and a second opening with a circular edge on the second face of the mask, and in which the edges of the first and second openings are flush with the first and second faces of the mask respectively 21 Apparatus according to claim 17 in which the substrate is a porous sheet 22 Apparatus according to claim 17 in which the substrate is a sheet of nitrocellulose and the adhesive is ethylene glycol 23. Apparatus according to claim 17 including means providing an anay of receptacles and means attached to mask for holding the mask in a fixed relationship with the array of receptacles, whereby beads deposited through the apertures of the mask onto the adhesive layer of the substrate can be readily aligned with the receptacles.

Inventors: DUNNINGTON DAMIEN, TAYLOR PAUL J, DUNNINGTON, DAMIEN, TAYLOR, PAUL, J.
Applicants: DUNNINGTON DAMIEN, SMITHKLINE BEECHAM CORP, TAYLOR PAUL J, DUNNINGTON, DAMIEN, SMITHKLINE BEECHAM CORPORATION, TAYLOR, PAUL, J.
Application year: 1997
Main classification: G01N33
IPC codes: B01J4, B01J19, C07B61, C40B60, G01N33, G01N37