Electronic component and method of manufacturing

Abstract: An electronic component is disclosed which sufficiently suppresses stray capacitance and exhibits a high electromagnetic shielding effect, and is free from problems, such as flowing of a conductive agent into inappropriate areas and occurrence of a poor electrical connection. Electronic-component devices are mounted on an insulating substrate (20) having input (22) and output (24) electrodes and a ground electrode (23). Then, a metallic cap (60) is bonded and sealed onto the substrate via an insulating layer (25) to cover the electronic-component devices. A conductive layer (80) connected to the ground electrode is formed on part of the cap-mounting portion of the substrate and positioned at a level higher than the insulating layer. Thus, the opening of the cap is electrically connected to the conductive layer.

Description: The present invention relates generally to a method of manufacturing electronic components and, more particularly, of surface mounting-type electronic components, and electronic components obtainable by said method. As a surface mounting-type electronic component, the present inventor has proposed a piezoelectric component illustrated in Fig. 1. This piezoelectric component is a capacitor-integrating piezoelectric oscillator having one oscillator R and two capacitors C 1 and C 2 for use in a Colpitts oscillator circuit. The electric circuit of this component is shown in Fig. 2. Referring to Fig. 1, this piezoelectric component is formed of an insulating substrate 20, an oscillator device 40, a capacitor device 50, and a metallic cap 60. The substrate 20 is a rectangular thin sheet made from alumina ceramics, and three band-like electrodes 22, 23 and 24 are formed on the upper surface of the substrate 20 parallel to the widthwise direction of the substrate 20. The electrodes 22, 23 and 24.serve as an input electrode, a ground electrode and an output electrode, respectively. Both ends of the electrodes 22 through 24 are respectively extended to recessed through-holes 20a formed on the longitudinal lateral surfaces of the substrate 20 and are connected to the electrodes disposed on the lower surface of the substrate 20 via the electrodes formed on the inner surfaces of the through holes 20a. A frame-shaped insulating layer 25 made from a resin base paste or a glass base paste is printed on the top portion of the substrate 20 to which the cap 60 is bonded. The thickness of the insulating layer 25 is desirably determined to range, for example, from 20 to 40 µm, in order to reduce a level difference generated by the electrodes and also to sufficiently insulate the electrodes from the cap 60 which will be explained in greater detail below. The insulating layer 25 is baked or cured after it has been printed. Bonded onto the substrate 20 is a laminated block formed by integrating the oscillator device 40 and the capacitor device 50 by means of materials 30 through 32 which have both conducting and adhering functions, such as a conductive adhesive. This oscillator device 40 is a thickness shear vibration-mode device in which an electrode 42 is formed on an area covering about two thirds of the obverse surface of a piezoelectric ceramic substrate 41 starting from one end, while an electrode 43 is formed on an area covering approximately two thirds of the reverse surface of the substrate 41 starting from the other end. The inner ends of the electrodes 42 and 43 face each other in the intermediate portion of the device 40 across the piezoelectric substrate 41 so as to form a vibrating section. The outer ends 42a and 43a of the electrodes 42 and 43 are routed in a roundabout manner to the reverse surface of the piezoelectric substrate 41 via the respective edge faces of the substrate 41. Moreover, the capacitor device 50 has a dielectric substrate (for example, a ceramic substrate) 51 having the same length and width as the oscillator device 40. Two individual electrodes 52 and 53 are disposed on the obverse surface of the dielectric substrate 51 to extend from both ends to the center of the substrate 51, while one opposing electrode 54 is formed on the reverse surface of the substrate 51 to opposedly face the individual electrodes 52 and 53. Two capacitors C 1 and C 2 are formed in the opposing portion between the opposing electrode 54 and the individual electrodes 52 and 53. The outer ends 52a and 53a of the electrodes 52 and 53 are routed in a roundabout fashion to the reverse surface of the substrate 51 via the respective edge faces of the substrate 51. The reverse surface of the oscillator device 40 and the obverse surface of the capacitor device 50 are bonded at both ends with materials 33 and 34 having both conducting and adhering functions, such as a conductive adhesive. Simultaneously, a predetermined space for vibration can be formed between the vibrating section of the oscillator device 40 and the capacitor device 50 by virtue of the thickness of the materials 33 and 34. In this manner, one electrode 42 of the oscillator device 40 and one individual electrode 52 of the capacitor device 50 are connected, while the other electrode 43 of the oscillator device 40 and the other individual electrode 53 of the capacitor device 50 are coupled. It should be noted that resin-made frequency-adjusting damping materials 35 and 36 are applied onto both ends of the obverse surface of the oscillator device 40. After the oscillator device 40 and the capacitor device 50 are integrally attached to each other, the reverse surface of the capacitor device 50 is bonded onto the substrate 20 by means of the materials 30 through 32. Then, the outer end 52a of one individual electrode 52 of the capacitor device 52 is connected to the input electrode 22; the outer end 53a of the other individual electrode 53 is coupled to the output electrode 24; and the opposing electrode 54 is connected to the ground electrode 23. The cap 60 is fixed at its opening onto the substrate 20 with an adhesive 61 to cover the oscillator device 40 and the capacitor device 50. The adhesive 61, which is an epoxy-type adhesive, is applied to the bottom surface of the opening of the cap 60 which is then bonded to the insulating layer 25. Then, the adhesive 61 is cured. In the aforedescribed piezoelectric component using the metallic cap 60, there may be cases where the cap 60 is electrically grounded in order to inhibit stray capacitance and to shield electric noise entering from the exterior. As one of the methods for grounding the cap 60, the following technique is available. After the cap 60 is attached to the substrate 20, a conductive paste 70 is applied with a dispenser, as shown in Fig. 3, to connect the outer surface of the cap 60 to the ground electrode 23 of the substrate 20, thereby establishing an electrical connection between the cap 60 and the ground electrode 23. However, this method presents the following problems. The application of the conductive paste 70 with a dispenser is time-consuming, and also, additional work, i.e., the application of the paste 70, is required after the piezoelectric component has been completed, thereby lowering productivity. Further, the adhesive 61 forms a fillet on the exterior of the cap 60 to bond the cap 60 to the substrate 20, and it is necessary that the conductive paste 70 be applied to a position higher than the fillet in order to electrically connect the cap 60 to the ground electrode 23. It is very difficult, however, to apply the paste 70 to a position higher than the fillet while preventing the paste 70 from flowing into the through hole 20a of the substrate 20. In practice, the conductive paste 70 flows into the through hole 20a, as illustrated in Fig. 4, to disadvantageously lower solderability, or a poor electrical connection occurs between the cap 60 and the substrate 20, as shown in Fig. 5. US 5,382,929 discloses an electronic component comprising an insulating substrate having a ground electrode with an electronic component device mounted onto said insulating substrate. An insulating support is provided on said insulating substrate about its perimeter. A metal lid is disposed via a welding ring on top of the insulating support thereby covering said electronic component device. The insulating support comprises through-holes containing electric conductive electrodes providing electrical connection through welding ring 13 between the metallic lid and the ground electrode. It is an object of the present invention to provide a method for manufacturing an electronic component which can sufficiently suppress stray capacitance and produce a high electromagnetic shielding effect, and is free from problems, such as flowing of a conductive agent into an inappropriate area and occurrence of a poor electrical connection. This object is achieved with a method for manufacturing an electronic component having the features of claim 1 or an electronic component having the features of claim 6. The subclaims are directed to preferable embodiments. The metallic cap is bonded onto the insulating layer of the substrate on which the electronic-component devices are mounted. At this time, when the cap is pressurized to the substrate, the uncured adhesive applied to the opening of the cap is squeezed out due to the conductive layer to positively contact the opening of the cap to the conductive layer because the conductive layer is formed at a level higher than the insulating layer. Thus, the cap is electrically connected to the ground electrode via the conductive layer. In this state, the adhesive can be cured to seal the cap to the substrate. The insulating layer may be formed in a frame-like shape on the cap-mounting portion of the substrate, and then, the conductive layer may be formed across the insulating layer disposed on the ground electrode. In this case, the conductive layer may be applied onto the insulating layer according to a known method, such as printing, thereby simplifying the formation of the conductive layer. Alternatively, the insulating layer may be formed generally in a frame-like shape on the cap-mounting portion of the substrate and have gaps in positions corresponding to the ground electrode. Then, the conductive layer may be formed on the ground electrode on positions corresponding to the gaps of the insulating layer and made thicker than the insulating layer. In this case, the frame-like shape is formed by both the conductive layer and the insulating layer, thereby preventing the conductive layer from projecting from the cap-mounting portion. The electronic-component devices may comprise a piezoelectric device having first and second electrodes. The first and second electrodes may be respectively connected to the input and output electrodes of the substrate. Alternatively, the electronic-component devices may comprise a piezoelectric device and a capacitor device bonded to each other. In this case, first and second electrodes may be disposed on the piezoelectric device, and two individual electrodes respectively connected to the first and second electrodes of the piezoelectric device may be formed on one main surface of the capacitor device, while an opposing electrode opposedly facing the individual electrodes may be formed on the other main surface of the capacitor device. Then, the two individual electrodes of the capacitor device may be respectively connected to the input and output electrodes of the substrate, while the opposing electrode may be coupled to the ground electrode of the substrate. Hence, a capacitor-integrating piezoelectric oscillator for use in a Colpitts oscillator circuit can be obtained. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view illustrating an example of known electronic components; Fig. 2 is an electrical circuit diagram of the electronic component shown in Fig. 1; Fig. 3 is a perspective view of the electronic component shown in Fig. 1 when assembled; Fig. 4 is a cross-sectional view taken along line A-A of Fig. 3 illustrating the state in which a conductive agent flows into a through hole; Fig. 5 is a cross-sectional view taken along line A-A of Fig. 3 illustrating a poor electrical connection; Fig. 6 is an exploded perspective view of an electronic component manufactured according to an embodiment of the present invention; Fig. 7 is a perspective view of a substrate used in the electronic component shown in Fig. 6; Fig. 8 is a cross-sectional view taken along line B-B of Fig. 7; Fig. 9, which is comprised of Figs. 9A and 9B, is a cross-sectional view taken along line C-C of Fig. 7 illustrating the cap-bonding operation to electrically connect the cap and the conductive layer; Fig. 10 is a cross-sectional view taken along line C-C of Fig. 7 illustrating a modification of the electrical connection between the cap and the conductive layer shown in Fig. 9; Fig. 11 is a perspective view of a substrate used in an electronic component manufactured according to another embodiment of the present invention; Fig. 12 is a perspective view illustrating the pattern of an insulating layer formed on the substrate shown in Fig. 11; and Fig. 13 is a cross-sectional view taken along line D-D of Fig. 11. DESCRIPTION OF THE PREFERRED EMBODIMENTS Fig. 6 illustrates an electronic component according to an embodiment of the present invention. This embodiment is a capacitor-integrating piezoelectric oscillator similar to that shown in Fig. 1. Thus, the same elements as those shown in Fig. 1 are designated by like reference numerals, and an explanation thereof will be omitted. A conductive layer 80 is formed across the insulating layer 25 corresponding to areas on the ground electrode 23 before the devices 40 and 50 are mounted on the substrate 20. The conductive layer 80 is electrically connected to the ground electrode 23. This conductive layer 80 is produced by applying a conductive paste at a predetermined thickness (for example, 10 µm) by means such as screen printing and curing it. Accordingly, the top surface of the conductive layer 80 is located, as illustrated in Figs. 7 and 8, at a level higher than the top surface of the insulating layer 25. As the conductive paste, not only a conductive adhesive, but a baking-type silver paste or cream solder may be used. Although in this embodiment the conductive layer 80 is deposited on.two areas of the insulating layer 25, it may be formed on only one area. Moreover, if it is desirable to decrease the portion of the insulating layer 25 covered by the conductive layer 80, the insulating layer 25 on the ground electrode 23 may be made smaller in width. The conductive layer 80 may be made from the same material as the adhesive 30 through 32 used for fixing the devices 40 and 50, in which case, the conductive layer 80 may be applied simultaneously with the adhesive 30 through 32. This further eliminates an additional process step of applying the conductive layer 80, thereby maintaining the number of process steps. Further, the conductive layer 80 may be continuously formed in a band-like shape with the conductive adhesive 31 used for connecting the opposing electrode 54 of the capacitor device 50 to the ground electrode 23. This reduces the number of coating steps and also simplifies the coating pattern. Additionally, the conductive layer 80 may be formed after the substrate 20 is separated from the multiple substrate assembly. However, a plurality of conductive layers 80 may be formed at one time on the substrate assembly, thereby further enhancing productivity. An explanation will now be given of an assembly method for a piezoelectric oscillator using the above-described substrate 20, in particular, a method for bonding and sealing the cap 60, with reference to Fig. 9. After the conductive layer 80 is formed, as shown in Fig. 9A, across the insulating layer 25 corresponding to the area on the ground electrode 23, the devices 40 and 50 are mounted on the substrate 20. Then, the metallic cap 60 having the adhesive 61 at its opening is bonded onto the insulating layer 25. Until the adhesive 61 is cured, a weight of approximately 30 to 100 g for each conductive layer 80 is applied to the cap 60. At this time, a level difference is generated because of the conductive layer 80 disposed on the insulating layer 25, and when the cap 60 is pressed against the insulating layer 25, a pressurizing force concentrates on the conductive layer 80. Accordingly, the uncured adhesive 61 applied to the bottom surface of the opening of the cap 60 is squeezed out to both ends due to the presence of the conductive layer 80 so as to bring the metallic surface at the opening of the cap 60 into contact with the conductive layer 80. This makes it possible to electrically connect the cap 60 to the ground electrode 23 through the conductive layer 80. In this state, the adhesive 61 is heat-cured to seal the devices 40 and 50 inside the cap 60. It is thus possible to obtain an electronic component which can sufficiently suppress stray capacitance and exhibit a high electromagnetic shielding effect. If a level difference between the conductive layer 80 and the insulating layer 25 is approximately 10 µm, the sealing characteristics of the cap 60 are hardly influenced. In this manner, the conductive layer 80 is formed, not after the electronic component has been completed, but while the component is manufactured, thereby maintaining productivity. It is also possible to prevent a conductive agent from flowing into a through hole formed in the substrate and to ensure a good electrical connection between the cap and the ground electrode. In Fig. 9, the metallic cap 60 is mounted on the insulating layer 25 after the conductive paste 80 serving as the conductive layer has been cured. However, the cap 60 may be mounted while the conductive paste 80 is not yet cured, as illustrated in Fig. 10. Even though the conductive paste 80 is uncured, it generally has a higher hardness than the adhesive 61 for bonding the cap 60. Accordingly, when the cap 60 is pressurized, the opening of the cap 60 penetrates into the conductive paste 80 while the adhesive 61 is squeezed out, as illustrated in Fig. 10, thereby improving the reliability of an electrical connection between the cap 60 and the conductive paste 80. Thereafter, the paste 80 and the adhesive 61 may be heat-cured at the same time. A second embodiment of the present invention will now be described while referring to Figs. 11 through 13. In this embodiment, the insulating layer 25 has gaps 25a in positions corresponding to the ground electrode 23, and the conductive paste 80 is printed in the gaps 25a. If the thickness of the conductive paste 80 (for example, 20 to 30 µm) is larger than that of the insulating layer 25 (for example, 10 to 20 µm), the conductive paste 80 can be positioned at a level higher than the insulating layer 25, so that the opening of the cap 60 can be positively brought into contact with the conductive paste 80. The electronic component of the present invention is not restricted to a capacitor-integrating oscillator having an oscillator device and a capacitor device as disclosed in the above embodiments. For example, the capacitor device 50 shown in Fig. 6 may be omitted, and the oscillator device 40 may be directly connected to the input and output electrodes 22 and 24 of the substrate 20 with conductive agents 33 and 34, respectively. In this case, a predetermined gap should be provided to avoid an electrical connection between the electrodes 42 and 43 of the oscillator device 40 and the ground electrode 23. Additionally, instead of using the capacitor device, dielectric layers may be formed on the substrate. Thus, it is possible to provide a capacitor-integrating oscillator having a capacitor on the substrate or using a dielectric substrate. Further, the present invention is applicable to other types of electronic components, such as filters and circuit modules. As is seen from the foregoing description, the present invention offers the following advantages. A conductive layer connected to the ground electrode is formed on part of the cap-mounting portion of the substrate and positioned at a level higher than the insulating layer. Accordingly, the opening of the cap is pressed against the cap-mounting portion to ensure an intimate contact between the cap and the conductive layer, thereby reliably establishing an electrical connection therebetween. It is thus possible to provide an electronic component that can sufficiently inhibit stray capacitance and produce a high electromagnetic shielding effect. Moreover, the conductive layer can be formed according to a known method, such as screen printing, before the cap is mounted. This can eliminate time-consuming additional work, such as the application of a conductive paste with a dispenser after an electronic component is completed, and further, productivity can be maintained. It is also possible to solve the problems suffered by the conventional method, such as flowing of a conductive agent into inappropriate areas and occurrence of a poor electrical connection.

Claims: Method of manufacturing an electronic component comprising the steps of providing an insulating substrate (20) having an input electrode (22; 24), an output electrode (24; 22), and a ground electrode (23); providing an insulating layer (25) on a cap-mounting portion of said substrate (20); mounting an electronic component device (40, 50) on said insulating substrate (20) and providing a conductive layer (80) connected to said ground electrode (23) on part of said cap-mounting portion of the substrate in an area of said insulating layer (25), so that it is positioned at a level higher than said insulating layer (25); pressurizing a metallic cap (60) onto the arrangement of insulating layer (25) and conductive layer (80) in order to bond and seal said metallic cap (60) onto said insulating substrate (20) via contact with both said insulating layer (25) and said conductive layer (80) to cover said electronic component device (40, 50) and electrically connecting said cap (60) to said conductive layer (80). Method of manufacturing according to claim 1, wherein said conductive layer (80) is provided after said electronic component device (40, 50) was mounted onto said insulating substrate (20). Method of manufacturing according to claim 1, wherein said conductive layer (80) is provided prior to mounting said electronic component device (40, 50) on said insulating substrate (20). Method of manufacturing according to one of the claims 1 to 3, wherein said insulating layer (25) is formed in a frame-like shape on said cap-mounting portion of said substrate (20) and said conductive layer (80) is formed across said insulating layer (25) disposed on said ground electrode (23). Method of manufacturing according to one of the claims 1 to 3, wherein said insulating layer (25) is formed generally in a frame-like shape on said cap-mounting portion of said substrate (20) and is formed to have gaps (25a) in positions corresponding to said ground electrode (23), and said conductive layer (80) is formed on said ground electrode (23) on positions corresponding to the gaps (25a) of said insulating layer (25) and is made thicker than said insulating layer (25). Electronic component obtainable by a method according to one of the claims 1 to 5. Electronic component according to claim 6, wherein said electronic component device comprises a piezoelectric device (40) including first and second electrodes which are respectively connected to the input and output electrodes (22, 24) of said substrate (20). Electronic component according to claim 6, wherein said electronic component device comprises a piezoelectric device (40) and a capacitor device (50) bonded to each other, first and second electrodes being formed on said piezoelectric device (40), and two individual electrodes connected to the first and second electrodes of said piezoelectric device (40) being formed on one main surface of said capacitor device (50), while an opposing electrode opposedly facing said individual electrodes is formed on the other main surface of said capacitor device (50), and the two individual electrodes of said capacitor device (50) are respectively connected to said input and output electrodes (22, 24) of said substrate (20), while the opposing electrode of said capacitor device (50) is connected to the ground electrode (23) of said substrate (20).

Inventors: HIGUCHI MASATO, MAESAKA MICHINOBU, TATSUMI TETSUO, HIGUCHI, MASATO, MAESAKA, MICHINOBU, TATSUMI, TETSUO
Applicants: MURATA MANUFACTURING CO, MURATA MANUFACTURING CO., LTD.
Application year: 1997
Main classification: H03H9
IPC codes: H03H9, H01L23, H05K9, H03H3