GATE OXIDE VOLTAGE LIMITING DEVICES FOR DIGITAL CIRCUITS

Abstract: An oxide protection circuit prevents failure of the MOS transistors in a digital device. A voltage difference at a gate oxide of a digital device does not exceed a breakdown voltage magnitude. The gate oxide protection circuit includes a plurality of transistors which turn OFF or ON when a node reaches a predetermined voltage of Vrefp+Vt or Vrefn-Vt, where Vrefp and Vrefn are references applied at a gate of a PMOS or an NMOS transistor, and Vt equals a threshold voltage of the MOS transistor.

Description: GATE OXIDE VOLTAGE LIMITING DEVICES FOR DIGITAL CIRCUITS Technical Field The invention relates to digital devices, and more particularly, to protection circuitry for digital devices using CMOS technology. Background Art To save power, the core circuitry of a device, e.g., a microprocessor, operates on a predetermined voltage level, even though the device must communicate externally using an input/output (I/O) voltage level which is higher than the predetermined voltage used by the core of the device. For example, a microprocessor operates on logic levels of high (H) and low (L) having voltage levels of 2 volts (V) and 0V, respectively, although the device is connected to a 3.3V power rail for use in external communications. When the core of the device outputs a signal, the device uses an I/O buffer to convert the voltage levels of 0V and 2V to output voltage levels of 0V and 3.3V. Figure 1 is an illustration of an inverter 2 which may be used for such a voltage conversion. A source terminal of a PMOS transistor P is connected to a predetermined source voltage V CCI0 of 3.3V while a source terminal of an NMOS transistor N u is connected to a predetermined voltage V SSI0 of 0V (ground voltage) . The drain terminals of transistors P n and N n are connected to each other. The commonly connected gates of transistors P and N n receive an input signal at an input terminal IN. When an input signal of 0V from the internal device is applied at terminal IN, transistor N n is turned OFF, and transistor P is turned ON such that inverter 2 outputs a signal of 3.3V at an output terminal OUT. The inverter 2 outputs a signal of 0V at output terminal OUT in response to an input signal of 2V at input terminal IN. In the latter case, however, both transistors N tl and P will be ON since there is a gate-source voltage V gs of 1.3V, i.e., V CCIO - v IN . With both transistors P IX and N , ON, there is a static current drain through inverter 2, undesirably consuming power as a result of static current drain. Figure 2 is an illustration of an inverting level shifter 4 used for voltage conversion, improved by avoiding static current flow induced power consumption. This circuit configuration is very similar to that of cross-coupled inverters with a static dc path cut off by transistor N L1 when a high input signal is applied at input terminal IN. The source terminals of PMOS transistors P L3 and P L4 are connected to the source of voltage V CCI0 . The drain terminals of PMOS and NMOS transistors P u and are connected to each other, and the drain electrodes of PMOS and NMOS transistors P L4 and N are connected together. The gate of transistor P L3 is connected to output terminal OUT while a gate of transistor P L4 is connected to a drain terminal of transistor P L3 . The gate of transistor N L1 is connected to a reference voltage V rβfn , e.g., 2.0 V. The gate of transistor N L3 and the source terminal of transistor N L1 are connected to input terminal IN. The source terminal of transistor N L3 is connected to the source of predetermined ground voltage V gsιo . When an input signal of 0V from the internal device is applied at terminal IN, transistors P L3 and N L3 are turned OFF while transistors P and N L1 are turned ON, and level shifter 4 hence outputs a voltage level of 3.3V at terminal OUT. When an input signal of 2V is applied at input terminal IN, transistors P L3 and N L3 are turned ON while transistors P and N are turned OFF, and level shifter 4 outputs a voltage level of 0V at terminal OUT. After the voltage conversion, the voltage level of OV or 3.3V from inverting level shifter 4 is applied to an output driver circuit of the I/O buffer. Figure 3 is a schematic diagram of a conventional output driver circuit 6 connected to a capacitative load G load , representative of an external device connected to an output node N out . The source terminal of a PMOS transistor P D1 is connected to the source of voltage V CCI0 , e.g, 3.3V, while a source electrode of an NMOS transistor N D1 is connected to the source of predetermined voltage V SSI0 , e.g., OV. The drain of transistor P D1 is connected to the source of a PMOS transistor P D2 , and a drain of transistor N D1 is connected to a source of an NMOS transistor N D2 . The drains of transistors P D2 and N D2 are connected to an output node N out . The gate of transistor P D2 is connected to the source of voltage V ggI0 while a gate of the transistor is connected to reference voltage source V re£n , e.g., 2.0V or 3.3V. The gates of transistors P D1 and N D1 receive the converted voltage levels of OV and 3.3V, respectively. The transistors P D2 and N D2 of Figure 3 are optional. They are most often used to limit charge leakage through the device, or to lessen hot-electron caused device lifetime or performance degradation. When an input signal of OV is applied to the gates of transistors P D1 and N D1 , transistor N D1 turns OFF while transistor P D1 turns ON. Both transistors P D2 and N D2 are initially ON, but transistor N D2 turns OFF as the voltage level at node N out rises to 3.3V. When an input signal of 3.3V is applied to the gates of transistors P D1 and N D1 , transistor N D1 turns ON while transistor P D1 turns OFF. The transistor N D2 is ON, and node N out drops to OV, which forces transistor P D2 to turn OFF. As shown in Figures 1-3, inverter 2, level shifter 4 and output driver 6 are fabricated using CMOS technology. Due to advances, such devices are becoming smaller, the thickness of the transistor gate oxides is becoming thinner. For most semiconductor processes, when the thickness of the gate oxide becomes less than or equal to approximately 60 angstroms (A) , a voltage greater than approximately 2.4V-2.5V across the gate oxide causes the oxide to break down. For example, if an input signal of 2.0V is applied to the gate of transistor N L3 , level shifter 4 of Figure 2 outputs a voltage of OV at the output terminal OUT, and a voltage difference of 3.3V exists between the bulk and gate of transistor P b3 . If the gate oxide thickness is ≤ 60 A, the gate oxide will break down, causing level shifter 4 to fail. Likewise, inverter 2 and output driver 6 will fail if the gate oxide thickness of the transistors is less than about 60 A for most processes. Disclosure of the Invention An advantage of the present invention is in providing an integrated circuit which is not susceptible to gate oxide breakdown. A further advantage of the present invention is in providing an integrated circuit which can operate on a standard power rail. Still another advantage of the present invention is in increasing the reliability of an integrated circuit. Still another advantage of the present invention is in providing a means to prevent a gate oxide voltage from exceeding a break down voltage of the gate oxide of an MOS transistor. The above and other advantages of the invention are achieved, at least in part by an integrated circuit comprising a first component having input and output nodes, and coupled to a protection device. The first component has at least one first MOS transistor receiving an input signal of first and second levels to provide an output signal of third and fourth levels to the output node. The protection device comprises at least one second MOS transistor interconnected with the at least one first MOS transistor at a first node having a voltage level between one of (a) the fourth level and a first prescribed level and (b) the third level and a second prescribed level, to prevent voltages across gate oxide layers of the first and second • MOS transistors from exceeding a prescribed magnitude. The first component may be an inverting level shifter. The gate of transistors L pl , L p2 and L p3 are connected to a reference voltage V refp , and the gates of transistors L and L N2 are connected to a reference voltage V rβfn . The transistors L p3 and L p4 are also connected to a source of predetermined source voltage V CCI0 , and transistor L N3 is connected to a source of a second predetermined voltage V SS10 . The transistor L pl is connected between transistor L p3 and an output terminal OUT_LS. The source electrode of transistor L p2 is connected to both transistors L p3 and L M . The transistor L p5 is connected to transistor L p4 and output terminal OUT_LS. The transistor L N1 is connected to transistor L p2 , an input terminal IN and transistor L H3 . The transistor L H2 is connected between output terminal OUT_LS and transistor L N3 . During the transition of the input signal, transistors L pl , L p2 , and P L5 turn ON or OFF when the voltage levels at the drains of transistors P L3 and P L4 fall below a voltage level of v rβ£p +v tp , where v tp is a threshold voltage of the PMOS transistor. Similarly, transistors I^ and L N2 turn ON or OFF when the voltage levels at the drain of transistor L N3 reach above a voltage level of V refn -V tn , where V tn is a threshold voltage of the NMOS transistor. Such a protection circuit can be also applied to logic devices to design a family of gate oxide protected logic gates. For example, a gate oxide protected inverter comprises a plurality of PMOS transistors I Pι -I P3 and a plurality of NMOS transistors 1 ' 1 m - Tn e transistor I pl is serially connected to NMOS transistor I N1 , and PMOS transistors I p2 , l p3 and NMOS transistors I N2 , I N3 are serially connected. The gates of transistors I pl and l p3 are connected to reference voltage V rβ£p , and the gates of transistors I N1 and l κ2 are connected to the reference voltage V refn . The transistors l p2 and I M3 are connected to voltages V CCI0 and V asI0 , respectively. An electrode of transistor I pl is connected to a gate of transistor l p3 , and an electrode of transistor l N1 is connected to a gate of transistor I N3 . The transistors I pl , I p3 and transistors I N1 , I N2 switch ON and OFF, or vice versa, to limit the drain voltages of transistors I p2 and I N3 , respectively, when an electrode of the PMOS transistor or the NMOS transistor reaches a voltage level of V re£p +V tp or V rβ£n -V tn , respectively. A gate oxide protected I/O buffer can be designed using first and second gate oxide protected inverting level shifters, first and second gate oxide protected inverters and a gate oxide protected output driver circuit. The input nodes of the first and second level shifters receive a data signal from an internal logic gate of the digital device, and the output terminals of the first and second level shifters are connected to the input terminals of the first and second inverters, respectively. The output driver circuit comprises serially connected first and second PMOS transistors D pl and D p2 and first and second NMOS transistors D N1 and D H2 . The source electrode of PMOS transistor D pl is connected to a predetermined power voltage V CCI0 while a source electrode of NMOS transistor D N1 is connected to a predetermined voltage V SS10 . The drains of transistors D p2 and D N2 are connected to an output node C out . The gate of transistor D pl is connected to the first inverter at a first node while the gate of transistor D N1 is connected to the second inverter at a second node. The transistors D p2 and D N2 protect transistors D pl and D N1 while protecting themselves at the same time. During the transition to a high data signal, transistor D p2 turns itself OFF when the voltage at its source reaches V rβfp +V tp . During the transition to a low data signal from the internal device, transistor D N2 turns itself OFF when the voltage at its drain reaches v r β f n - y t „ * Additional advantages, objects and other features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention. The objects and advantages of the invention may be realized and attained as particularly pointed out in the appended claims. Brief Descri tion of prawjπgs The invention will be described in detail with reference to the following drawings in which like reference numerals refer to like elements wherein: Figure 1 is an illustration of a conventional inverter; Figure 2 is a schematic diagram of a conventional inverting level shifter; Figure 3 shows a schematic diagram of a conventional output driver circuit of an input/output buffer; Figure 4 depicts a gate oxide voltage limited inverting level shifter in accordance with the present inven ion; Figure 5 is an illustration of a gate oxide protected inverter in accordance with an embodiment of the present invention; Figure 6 is an example of an overvoltage NAND gate using the oxide protection scheme of the present inven ion; Figure 7 is an example of an overvoltage NOR gate using the oxide protection scheme of the present invention; and Figure 8 is an illustration of a gate oxide protected input output buffer in accordance with the present invention. Best Mode of Carrying Out the Invention Figure 4 illustrates a gate oxide voltage limited inverting level shifter 4' of the present invention. In addition to transistors L N1 , L N3 , L p3 and L p4 , level shifter 4* includes PMOS transistors L pl , L P2 and L p5 and NMOS transistor L N2 , which prevent the gate oxide voltage of any transistor from exceeding a breakdown voltage. For example, if the thickness of the gate oxides is approximately 60 A, the voltage difference at any gate oxide of level shifter 4 * does not exceed approximately 2.5V. The source of transistor L P2 is connected to the drain of transistor L p3 and the gate of transistor L p4 , and the drain of transistor L p2 is connected to the drain of transistor L N1 . The source of transistor L p5 is connected to the drain of transistor L p4 , and the drain is connected to output terminal OUT_LS. The gates of transistors L pl , L p2 and L p5 are connected to a reference voltage V rβ£p . The transistor L N2 includes a source connected to a drain of transistor L N3 , and a drain connected to output terminal 0UT_LS. Like transistor L M1 , the gate of transistor L N2 is connected to a reference voltage V rβ£n . The transistor L pl is connected between the gate of transistor L p3 and output terminal OUT__LS while the gate is connected to reference voltage V rβfp . Since the drain and source location depends on the current direction, the drain and source of transistor L pl will switch depending on whether the output signal at terminal OUT_LS is rising or falling. If the output signal is falling, a node NODE3 will become a source electrode, whereas, if the output signal is rising, node NODE3 will become a drain electrode. To protect all gate oxides from exceeding the oxide break down voltage, transistors L pl , L p2 , P L5 , L N1 and L N2 turn ON or OFF when the voltage levels at nodes NODE1, NODE2, NODE3 and NODE4 reach voltages V pl = (V rβ£p +V tp3 ) , v p2 = (v rβf n "t tnn22 ' l 'i V v „ p3 = ( »v v r ref p + v tpl ) and v p 4 =< v rβf p +v p 4 ) i respectively, where V tp3 , V tpl V tn2 and V tp4 represent the threshold voltages of transistors L p3 , L pl , L N3 and L P4 , respectively, in absolute value. A p- type substrate of the NMOS transistors is tied to ground voltage V agI0 , and an n-type substrate of the PMOS transistors is tied to predetermined supply voltage V CCIO . The reference voltage V re£p is ideally 1/3 V CCI0 , and reference voltage V rβ£n is ideally 2/3 cc i o - Alternatively, V re£n =V rβ£p =V CCI0 /2. For illustrative purposes, the gate oxide thickness is about 60 A, and the gate oxide breakdown voltage is about 2.4-2.5V. The voltage V CCI0 equals about 3.3V; the voltage V saI0 equals about OV or ground; V rβ£p equals about 1.0V; and the reference voltage V re£n equals about 2.0V. The threshold voltages, including body effect, of transistors L p3 , L pl L N3 and L p4 equal approximately 0.5V. Hence, the final operating voltages V pl , V p2 V p3 and V p4 equal approximately 1.5V. The output signal at output terminal OUT_LS switches from 0V to 3.3V, or vice versa, in response to a transition of the input signal at terminal IN from 2.0V to 0V, or vice versa. Table 1, shown below, illustrates the final operating states of transistors L H1 -L N3 and L pl -L p5 , and the output signal at output terminal OUT_LS when the input signal at input terminal IN reaches 0V or 2V. TΔBLE_1 A predetermined time period is required for the input signal to switch from an initial voltage level of 2.0 (or OV) to a final voltage level of OV (or 2V) , and the output signal to switch from an initial voltage level of OV (or 3.3V) to a final voltage level of 3.3V (or OV) . During this time, some of the transistors turn ON or OFF by themselves, and some of the transistors are driven ON or OFF due to the transitions of the input or output signals. Such switching operations protect the transistors, and prevent the voltage at any gate oxide from exceeding the gate oxide breakdown voltage. During the transition of the input signal from 2.0V to OV, the operation of level shifter 4' is as follows. The transistor L H1 turns ON when a gate- source voltage V gB becomes greater than a threshold voltage V tnl . The transistor L κ3 immediately turns OFF as the input signal switches to OV. The transistor L N2 is initially ON until the voltage level at node NODE2 rises to predetermined voltage V p2 of 1.5V (i.e., V rβ£n - V tn2 ) as the output signal rises from 0V to 3.3V. In other words, transistor L N2 turns itself OFF to protect transistor L N3 which is protected since there is only a voltage difference of 1.5 volts between the gate and drain of transistor L N3 . Since the voltage level of 1.0V is applied to the gate, transistor L pl is ON, and a conducting path is created between output terminal OUT_LS and the gate of transistor L p3 . As the output signal rises to 3.3V, transistor L p3 is forced OFF. since transistors L N1 and L p2 are ON, the voltage level at node NODEl discharges to predetermined voltage V pl of 1.5V (i.e., V rβ£p +V tp3 ) , causing transistor L p2 to turn OFF. The predetermined voltage V pl of 1.5V appears on the gate of transistor L p4 , and transistor L P4 turns ON. With V rβ£p at 1.0V, transistor P L5 turns ON. The switching of transistor L p2 from ON to OFF protects transistors L p3 and L p4 since there is now only a voltage difference of 1.8V between the gate oxide. A similar switching operation occurs when the input signal switches from OV to 2.0V. The transistor L N1 turns OFF since the gate-source voltage V gβ will be OV, and transistor L N3 will turn ON as the input signal rises to 2.0V. The node NODE2 is pulled to ground, and transistor L N2 turns ON such that terminal OUT_LS falls to OV. The transistor L P1 is ON until the voltage level at node NODE3, which is conductively coupled to terminal 0UT__LS, falls to predetermined voltage V p3 of about 1.5 (v re£p +v tpl ) . The transistor L p3 turns ON in response to the predetermined voltage at node NODE3, and the voltage level at node NODE1 is raised to turn transistor L p4 OFF. The transistor L p5 stays ON until the voltage level at node NODE4 reaches predetermined voltage V p4 of about 1.5V (V rβ£p +v tp4 ) . At this point, there is only a voltage difference of 1.5V between the gate and drain of transistor L p5 , i.e., transistor L p4 protects transistor L p5 from breaking down. Such an inventive aspect of the present invention can be also applied to a logic device. Figure 5 is an illustration of a gate oxide protected inverter 2 ' in accordance with the present invention. The inverter 2* includes serially connected PMOS transistor I pl and NMOS transistor l N1 , and serially connected PMOS transistors l p2 , I p3 and NMOS transistors I N2 , l N3 , which are connected to each other at nodes Nl and N2. The gates of transistors I pl and I p3 are connected to reference voltage V re£p , and the gates of transistors I N1 and I N2 are connected to reference voltage V re£n . An input signal is applied to an input node/terminal IN located at an electrode connection between transistors l p2 and I N2 while an output signal is provided to an output node/terminal OUT at an electrode connection between transistors I p3 and I N2 . The transistor I p2 includes a source connected to predetermined source voltage V CCI0 , e.g. 3.3V, and a drain connected to a source of transistor I p3 , which includes a drain coupled to output terminal OUT. The drain of transistor I N2 is also connected to output terminal OUT, and a source is connected to a drain of transistor I N3 The source of transistor l„, is connected to predetermined voltage V SS10 , e.g. OV or ground. The source and drain of transistors I PI and I N2 vary depending on whether the input signal is falling or rising. If the input signal is falling, node Nl and node N2 are, respectively, the drain and source of transistors I H1 and l pl . During the rise of the input signal, node Nl and node N2 are, respectively, the source and drain of transistors I m and l pl . The transistors I pl and I p3 and transistors I Nl and -N2 switch ON and OFF , or vice versa , to limit the drain voltages of transistors l p2 and I N3 , respectively, when nodes Nl , out_n, N2 and out_p reach predetermined vol tages V In' V 2n' V IP and V 2p< where v ln =(V rβ£n -V tnx ) , V 2n =(V rβfn -V tn2 ), V lp =(V rβ£p +V tpl ) and V2p=(V rβ£p +V tp3 ), and Vtnl, V tn2 , Vtpl and V tp3 represent threshold voltages. The threshold voltages of all the transistors may be approximately equal, e.g., 0.5V. Table 2 illustrates the final operating states of transistors I P1 -Ip 3 and I N1 -I N3 , and the output signal at output terminal OUT when the voltage level of the input signal reaches OV or 3.3V. TABLE 2 As the input signal increases to 3.3V, transistor I N1 gradually turns OFF as the voltage level at node Nl reaches predetermined voltage V ln (1.5V). The transistor I pl will turn ON while transistor I p2 will be driven OFF due to the conductive path to input terminal IN receiving a rising input signal. Both transistors I κ2 and I N3 are ON to drive the output signal at output terminal OUT to OV, but transistor I p3 will turn itself OFF when node out_p reaches predetermined voltage V 2p (1.5V). When the input signal falls to OV, transistor l H1 will turn ON since the gate-source voltage V gs will be 2V (V refn -0), and drives node Nl to OV, which forces transistor I N3 to turn OFF. The transistor I pl is initially ON, but will turn itself OFF when node N2 reaches predetermined voltage v lp (1.5V), which is enough to turn transistor I p2 ON. Since transistor I p3 is turned ON, terminal OUT will be charged to 3.3V. The transistor I N2 will turn itself OFF when node out_n charges to predetermined voltage V2n (1.5V). Such operations protect the transistors such as transistors I p2 and I N3 from exceeding the breakdown voltage. For example, there is only a voltage difference of 1.5V between node out_n and node Nl on the gate oxide of transistor I N3 , rather than 3.3V. Similarly, the gate oxide of transistor I p2 is protected since the voltage difference between predetermined source voltage V CCI0 and node N2 is only about 1.8V. Further, nodes out_p and out_n are protected outputs, meaning that the voltage swing at node out_p goes from approximately 1.5V to 3.3V, and the voltage swing at node output_n goes from approximately OV to 1.5V. The signals at these nodes can be directly hooked up to an output driver of an I/O buffer, thereby eliminating the need for additional transistors of a next inverter stage. The present invention is not limited to a predetermined source voltage of 3.3V, and is modifiable for connection with higher power rails. For example, if reference voltages V rβ£n and V rβ£p are changed to 2.5V and 2.5V in Figure 5, inverter 2' can be connected to a power rail of 5.0V. If the power rail is connected to a predetermined source voltage V cc i o of 3.3V and reference voltages V rβ£n and V rβ£p are 1.65V and 1.65V, the present invention protects gate oxides whose maximum allowable voltage is as low as about 1.65V. Generally, the lowest maximum allowable oxide voltage equals V CCI0 /2. The oxide protection scheme is applicable to other types of gates, such as NAND, NOR, XOR, etc. A family of "overvoltage logic" or "gate oxide protected logic" can be fabricated using the teachings of the present invention. Figures 6 and 7 are examples of an overvoltage NAND gate and an overvoltage NOR gate, respectively, using the oxide protection scheme of the present invention. A detailed description of the operation is omitted since one of ordinary skill in the art can readily appreciate the operation. Figure 8 is an illustration of a gate oxide protected I/O buffer in accordance with the present invention. In addition to gate oxide protected level shifters 4 P and 4 N and inverters 2 P and 2 H , the I/O buffer includes a gate oxide protected output driver circuit 6' comprising serially connected PMOS transistors D pl and D p2 and NMOS transistors D N1 and D N2 . The source terminal of PMOS transistor D pl is connected to predetermined source voltage V CCIO while the source terminal of an NMOS transistor D is connected to ground voltage V agro . A drain of transistor D pl is connected to a source of PMOS transistor D p2 , and a drain of transistor D H1 is connected to a source of NMOS transistor D H2 . The drains of transistors D p2 and D N2 are connected to output node C out connected to a capacitative load C lOΛΛ , where C load is representative of an off chip load. The transistors D pl and D p2 are the same size, i.e., the same transistor width and length. The same applies to transistors D H1 and D N2 . Such sizing is optimal to prevent breakdown of the transistors caused by electro-static discharge (ESD) . If the sizes are different, high voltage and current stresses can find weakness in the way the disjointly sized transistors were fabricated. The gates of transistors L pl , L p2 , L p5 , I pl , I p3 , L pl ,, L p2 ,, L p5 ,, l pl ,, l p3 , and D p2 are connected to reference voltage V rβ£p , e.g., 1.0V. The gates of transistors L H1 , L M2 , I N1 , l N2 , L N1 ,, L N2 ., I M1 ., I N2 . and D M2 are connected to reference voltage V rβfn , e.g., 2.0V. The source terminals of transistors L p3 , L p4 , I p2 , L p3> , L p4 , an I p2 , are connected to power supply voltage V CCI0 , e.g., 3.3V while the source terminals of transistors L N3 ' IN » L N 3 ' and N3> are connected to ground voltage V aaIO (OV) . The input terminals of the gate oxide protected level shifters 4 P and 4 N receive data signals PDATA and NDATA. The data signals PDATA and NDATA are generally the same voltage level, e.g., OV or 2.0V, at a given time, and are generated by an internal device, such as a memory device or a microprocessor. The output terminals POUT_LS and N0UT_LS are connected to input terminals P IN and N IN , respectively. The gate of transistor D P1 is connected to inverter 2 P at node out_p while the gate of transistor D N1 is connected to inverter 2 N at node out_n. When data signals PDATA and NDATA switch to a high logic level, e.g, 2.0V, a signal of about 0V is generated at terminals POUT_LS, NOUT_LS, P IN and N IN . In response, inverter 2 P outputs a signal of about 3.3V at terminal out_p while inverter 2 N charges terminal out_n to a voltage level of about V rβ£n -V tn2 ,, e.g., about 1.5V. A detailed description of each level shifter and inverter is omitted since the operations are the same as above for gate oxide protected level shifter 4' and inverter 2' of Figures 4 and 5, respectively. In response to the signals at terminals out_p and out_n, transistors D pl and D N1 turn OFF and ON, respectively. Since transistor D N2 is ON, the output terminal C out is pulled to ground, and transistor D p2 turns itself OFF when the voltage at the source reaches V re£p +V tp , e.g., 1.5V, where v tp is a threshold voltage of the PMOS transistor of the output driver circuit. If data signals PDATA and NDATA switch to a low logic level, e.g., OV, a signal of about 3.3V is generated at terminals POUT_LS, NOUT_LS, P 1N and N 1N . In response, inverter 2 N outputs a signal of OV at terminal out_n while inverter 2 P discharges terminal out_p to a voltage level of about V re£p +V tp3 • , e.g., 1.5V. In response to the signals at terminals out_p and out_n, transistors D pl and D N1 turn ON and OFF, respectively. Since transistor D p2 is ON, output terminal C out is raised to about 3.3V, and transistor D N2 turns itself OFF when the voltage at drain reaches V rβ£n -V tn , e.g, 1.5V, where V tn is a threshold voltage of the NMOS transistor of the output driver circuit. Unlike the prior art, the gate oxides of output driver circuit 6' are protected from exceeding the breakdown voltage. The transistors D p2 and D N2 protect transistors D pl and D N1 while protecting themselves at the same time. For example, terminal out_n has a voltage swing of about 1.5V (V rβ£n -V tn2> ) to OV and the drain of transistor D Nl has a voltage swing of about OV to 1.5V (V rβfn -V tn ) , respectively. Hence, a voltage exceeding an oxide breakdown voltage of 2.4V is prevented from being applied across the gate oxide of transistor D N1 . To function as an input (i.e. to receive signals from an external source), driver 6' can be tristated so it doesn't drive C ODT either high or low. This occurs if PDATA is high (2.0V) and NDATA is low (OV) . The node can then be driven from an external source, and NODE_EXT_IN can be fed into the core logic of the device. If voltage v cc of the core devices is equal to reference voltage V rβ£ (for example, 2.0V), a PMOS keeper may be used to restore full 0V to 2V levels on node NODE_EXT_IN. The foregoing embodiment is merely exemplary and not to be construed as limiting the oxide protection scheme. The present oxide protection scheme can be readily applied to other digital circuits. One of ordinary skill in the art can use the teachings of the present invention to other devices requiring oxide protection. The description of the present invention is intended to be illustrative, and not limiting the scope of the claims. Many alternatives, modifications and variations will be apparent to those skilled in the art.

Claims: CLAIMS 1. An integrated circuit, comprising; an input node for receiving an input signal of first and second levels and an output node; a first component, coupled to said input node, and having at least one first MOS transistor to provide an output signal of third and fourth levels to the output node in response to the input signal of said first and second levels, respectively; and a protection device comprising at least one second MOS transistor interconnected with said at least one first MOS transistor at a first node having a voltage level between one of (a) the third level and a first prescribed level and (b) the fourth level and a second prescribed level, to prevent voltages across gate oxide layers of said first and second MOS transistors from exceeding a prescribed magnitude. 2. The integrated circuit of claim 1, wherein said first and second levels are voltage levels of OV and 2V, respectively, and said third and fourth levels are voltage levels of 3.3V and OV, respectively. 3. The integrated circuit of claim 1, wherein said first component comprises a level shifter, said level shifter further having a third MOS transistor for receiving a predetermined source voltage, and fourth and fifth MOS transistors being coupled to said input node, said second MOS transistor being coupled to said first MOS transistor, and said first node having a voltage level between said third level and said first prescribed level. 4. The integrated circuit of claim 3, wherein said second MOS transistor of said protection device is further coupled to said third MOS transistor at said first node. 5. The integrated circuit of claim 4, wherein said protection device further comprises: a .sixth MOS transistor coupled to said fifth MOS transistor at a second node and coupled to the output node, said sixth MOS transistor being turned OFF when said second node reaches said second prescribed level during a transition of the input signal from the second level to the first level. 6. The integrated circuit of claim 5, wherein said protection device further comprises: a seventh MOS transistor coupled to said first MOS transistor at a third node, and coupled to the output node, and an eighth transistor coupled to said third MOS transistor at a fourth node and coupled to the output node, said seventh and eighth MOS transistors turning OFF when said third and fourth nodes reach third and fourth prescribed voltages, respectively, during a transition of the input signal from the first level to the second level. 7. The integrated circuit of claim 6, wherein control electrodes of second, seventh and eighth MOS transistor are coupled to a first reference voltage V ra£p , and a control electrode of said sixth MOS transistor are coupled to a second reference voltage V ra£n , and wherein said first, third and fourth prescribed voltages reach about V rβ£p +V t and said second prescribed voltage reaches about V rβ£n -V t , where V t equals a threshold voltage of the MOS transistor. 8. The integrated circuit of claim 7, wherein said first and third MOS transistors are PMOS transistors, and fourth and fifth MOS transistors are NMOS transistors. S .' The integrated circuit of claim 1, wherein said first component comprises an inverter including a third MOS transistor, said protection device being coupled to said first and third MOS transistors. 10. The integrated circuit of claim 9, wherein said protection device further comprises a fourth MOS transistor coupled to said output node and coupled to said third MOS transistor at a second node, said second and fourth MOS transistors being turned OFF when said first and second nodes reach said first and second prescribed voltages, respectively, during a transition of the input signal from the second level to the first level. 11. The integrated circuit of claim 10, wherein said protection device further comprises: a fifth MOS transistor coupled to said output node and coupled to said first MOS transistor at a third node; and a sixth MOS transistor coupled to said input node and coupled to said third MOS transistor at a fourth node, said fifth and sixth MOS transistors being turned OFF when said third and fourth nodes reach third and fourth prescribed voltages, respectively, during a transition of the input signal from the first level to the second level. 12. The integrated circuit of claim 11, wherein control electrodes of said second and fifth MOS transistors are adapted to be coupled to a first reference voltage v rβ£p , and control electrodes of said fourth and sixth MOS transistors are adapted to be coupled to a second reference voltage V re£n , and wherein said first and third prescribed voltages equal V ref p + t and said second and fourth prescribed voltages equal V rofn -V t , where V t equals a threshold voltage of the MOS transistor. 13. The integrated circuit of claim 12, wherein said first MOS transistor is a PMOS transistor, and said second MOS transistor is an NMOS transistor. 14. The integrated circuit of claim 1, wherein said first component comprises an output driver circuit further comprising a third MOS transistor, said protection device being coupled to said first and third MOS transistors. 15. The integrated circuit of claim 14, wherein said second MOS transistor is turned OFF when said first node reaches said first prescribed voltage in response to a transition of said input signal from the first level to the second level. 16. The integrated circuit of claim 15, wherein said protection device further comprises: a fourth MOS transistor coupled to the output node and coupled to said third MOS transistor at a second node, said fourth MOS transistor being turned OFF when said second node reaches said second prescribed voltage in response to a transition of said input signal from the second level to the first level. 17. The integrated circuit of claim 16, wherein a control electrode of said second MOS transistor is coupled to a first reference voltage V rβ£p , and a control electrode of said fourth MOS transistor coupled to a second reference voltage V rβ£n , and wherein said first prescribed voltage equals V rβ£p +v t , and said second prescribed voltage equals V rθfn -v t , where V t equals a threshold voltage of the MOS transistor. 18. The integrated circuit of claim 14, wherein said first MOS transistor includes a control electrode receiving a first control signal of said third level and V rβ£p +V t , and said third MOS transistor includes a control electrode receiving a second control signal of said first level and V re£n -V t . 19. The integrated circuit of claim 1, wherein said first component comprises an input output (I/O) buffer, said buffer having: a first level shifter connected to said input node; a first inverter having a first transistor coupled to a first reference voltage V re£1 , said first inverter being coupled to said first level shifter; and an output driver circuit connected to said output node, said output driver circuit and first inverter being coupled to each other at a second node having a voltage level between said first level and at least one of V rβ£1 -V tl and V rβfl +v tl , where V tl is a threshold voltage of said first transistor. 20. The integrated circuit of claim 19, wherein said first component further comprises: a second level shifter connected to said input node; and a second inverter having a second transistor coupled to a second reference voltage V rβ£2 , said second inverter being coupled to said second level shifter, wherein said output driver circuit and said second inverter are coupled to each other at a third node having a voltage level between said second level and at least one of V re£2 -v t2 and V rβ£2 +V t2 , where V t2 is a threshold voltage of said second transistor. 21. An input output (I/O) buffer, comprising: a first level shifter coupled to an input node for receiving an input signal of first and second voltage levels; a first inverter having a first switching means coupled to a first predetermined reference voltage V rβ£1 , said first inverter being coupled to said first level shifter; and an output driver circuit coupled to an output node, said output driver circuit and first inverter being coupled to each other at a first output node having a voltage level between at least one of (a) a third voltage level and V refl +v tl , and (b) a fourth voltage level and V rβfl -v tl , where V tl is a threshold voltage of said first switching means. 22. The I/O buffer of claim 21 further comprising: a second level shifter connected to said input node; and a second inverter having a second switching means coupled to a second predetermined reference voltage V rβ£2 , said second inverter being coupled to said second level shifter, wherein said output driver circuit and said second inverter are coupled to each other at a second output node having a voltage level between at least one of (a) said third voltage level and V rβ£2 +V t2 , and (b) said fourth voltage level and V re£2 -V t2 and where V t2 is a threshold voltage of said second transistor. 23. The I/O buffer of claim 21, wherein each of said first and second level shifters comprises: first and second MOS transistors adapted to be coupled to a power rail; a third MOS transistor coupled to said input node; and a fourth MOS transistor coupled to said input node and adapted to receive a prescribed voltage. 24. The I/O buffer of claim 23, wherein each of said first and second level shifters further comprises: a first switching element coupled to said first and second MOS transistors at a first node and coupled to said third MOS transistor; and a second switching element coupled to said fourth transistor at a second node and coupled to an output node, said first and second switching elements being turned OFF when said first and second nodes reach first and second predetermined voltages, respectively, during a transition of the input signal from the second voltage level to the first voltage level. 25. The I/O buffer of claim 24, said level shifter further comprises: a third switching element coupled to said first MOS transistor at a third node, and coupled to the output node; and a fourth switching element coupled to said second MOS transistor at a fourth node and coupled to the output node, said third and fourth switching elements turning OFF when said third and fourth nodes reach third and fourth predetermined voltages, respectively, during a transition of the input signal from the first voltage level to the second voltage level. 26. The I/O buffer of claim 25, wherein said first, second, third and fourth switching elements are MOS transistors, control terminals of first, third and fourth switching elements being adapted to be connected to a first reference voltage V rβ£p , and a control electrode of said second transistor being adapted to be connected to a second reference voltage V rβ£n , and wherein said first, third and fourth predetermined voltages equal V re£p +v t and said second predetermined voltage equals V rβ£n -V t , where V t equals a threshold voltage of the MOS transistor. 27. The I/O buffer of claim 22, wherein each of said first and second inverter comprises an inverter having a first MOS transistor adapted to be coupled to a power rail and a second MOS transistor adapted to receive a prescribed voltage. 28. The I/O buffer of claim 27, wherein each of said first and second switching means comprises: a first switching element coupled to said first MOS transistor at a first node; and a second switching element coupled to said output driver circuit and coupled to said second MOS transistor at a second node, said first and second switching elements being turned OFF when said first and second nodes reach first and second predetermined voltages, respectively, during a transition of the input signal from the first voltage level to the second voltage level. 29. The I/O buffer of claim 28, wherein said each of said first and second switching elements further comprises: a third switching element coupled to said output driver circuit and coupled to said first MOS transistor at a third node; and a fourth switching element coupled to said second MOS transistor at a fourth node, said third and fourth switching elements being turned OFF when said third and fourth nodes reach third and fourth predetermined voltages, respectively, during a transition of the input signal from the second voltage level to the first voltage level. 30. The I/O buffer claim 29, wherein said first, second, third and fourth switching elements are MOS transistors, control terminals of said first and third switching elements being adapted to receive a first reference voltage V rβ£p , and control terminals of said second and fourth switching elements being adapted to receive a second reference voltage V rβ£n , and wherein said first and third predetermined voltages equal V rθfp +V t and said second and fourth predetermined voltages equal V rβ£n -V t , where v t equals a threshold voltage of the MOS transistor. 31. The I/O buffer of claim 30, wherein said second node is connected to said second output node, and said third node is connected to said first output node such that (a) voltages V rβfl +V tl and V rβ£2 +V t2 equal V rβ£p +v t , and (b) voltages V refl -V tl and V re£2 -V t2 equal V rβ£n - V t . 32. The I/O buffer of claim 22, wherein said output driver circuit comprises a first MOS transistor adapted to be coupled to a power rail and said first output node of said inverter, and a second MOS transistor adapted to receive a prescribed voltage and said second output node of said second inverter. 33. The I/O buffer of claim 32, wherein output driver circuit further comprises: a first switching element coupled to the output node and coupled to said first MOS transistor at a first node, said first switching element being turned OFF when said first node reaches a first predetermined voltage in response to a transition of said input signal from the first voltage level to the second voltage level; and a second switching element coupled to the output node and coupled to said second MOS transistor at a second node, said second switching element being turned OFF when said second node reaches a second predetermined voltage in response to a transition of said input signal from the second voltage level to the first voltage level. 34. The I/O buffer of claim 33, wherein said first and second switching elements are MOS transistors, a control electrode of said first switching element being coupled to a first reference voltage V re£p , and a control electrode of said second switching element being coupled to a second reference voltage v re£n , and wherein said first predetermined voltage equals V rβ£p +v t , and said second predetermined voltage equals V rβ£n -V t , where V t equals a threshold voltage of the MOS transistor.

Inventors: MALEY READING, MALEY, READING
Applicants: ADVANCED MICRO DEVICES INC, ADVANCED MICRO DEVICES, INC.
Application year: 1996
Main classification: H03K19
IPC codes: H03K19