Method and apparatus for manufacture of semiconductor devices

Abstract: A semiconductor device manufacturing apparatus includes a cassette accommodating portion for accommodating a first cassette for storing an original therein, a conveying portion for unloading the original out of the first cassette in the cassette accommodating portion and for conveying the original into the apparatus so that the original is used or processed therein, a cassette mounting portion for mounting a second cassette having a shape different from that of the first cassette; and a conveying portion for discriminating whether the original unloaded out of the first cassette, for use or process in the apparatus, is to be moved, after the use or the process, back to the first cassette or the second cassette on the basis of information related to the original and stored in the apparatus, and then for moving the original to one of the first cassette and second cassette.

Description: This invention relates generally to a method and apparatus for manufacture of semiconductor devices. More particularly, the invention is concerned with automation of reticle conveyance, for example, in a semiconductor device manufacturing apparatus wherein an original such as a photomask or reticle is to be used. US-A-4676637 describes an exposure apparatus for transferring a pattern of a mask to a substrate. The apparatus includes a storage magazine to accommodate a plurality of masks in respective cassettes in the magazine, and a transport unit to remove a mask from its cassette in the storage magazine and place it on a mask stage for exposure of a substrate. After the exposure process is complete, the handling unit returns the mask to its cassette in the storage magazine. During transportation to the mask stage, the mask is inspected for surface contamination, and if contaminated it is returned to the magazine, from where an operator manually removes the mask assembly for cleaning and subsequent replacement in the magazine. In order to prevent adhesion of foreign particles to a reticle, to meet the requirement of further miniaturization of a semiconductor device, semiconductor device manufacturing apparatuses use a mechanism for automatically unloading a reticle from a reticle cassette, which accommodates reticles therein, and for automatically conveying the reticle to an exposure station. Also, in order to avoid adhesion of foreign particles to a reticle, an operator manages the number of operations in which that the reticle is used, to determine execution of a reticle cleaning operation, an inspection operation for adhesion of foreign particles on the reticle, and an inspection operation for any fault of a pattern of the reticle and so on. In such operation environment and apparatus environment, reticle cassettes to be used in a reticle cleaning system, a reticle foreign-particle inspecting system, a reticle pattern-fault inspecting system or the like, have different shapes peculiar to these systems, respectively. There is no unification or compatibility in the shape. For this reason, if a reticle having been cleaned by the reticle cleaning system is to be loaded into the semiconductor device manufacturing apparatus, it is necessary to transfer the reticle from a reticle cassette for the reticle cleaning system into a reticle cassette for the semiconductor device manufacturing apparatus. To this end, the operator carries a reticle cassette having a reticle kept therein and a vacant reticle cassette for the semiconductor device manufacturing apparatus, into a clean room and executes transfer of the reticle between them. This necessitates that the operator goes into the clean room every time a reticle is to be transferred. Since the number of reticles to be used is increasing, it causes prolonged work time of the operator for the reticle transfer operations. Also, the manual reticle transfer operation does not avoid particle adhesion completely even if it is done carefully. A reticle transfer mechanism has been proposed in an attempt to decreasing the work time and reducing particle adhesion. However, in such mechanism, there is an operation for loading a cassette into which a reticle is to be transferred. Since the cassette has to be loaded manually by an operator, there is a possibility that a reticle which is not to be transferred is transferred by an error of the operator so that the reticle which is not going to be used is loaded into the semiconductor device apparatus. If this occurs, the operation of the semiconductor device manufacturing will be stopped or an erroneous operation will occur. Further, the reticle transfer mechanism has to be installed in a clean room. This requires a very large clean room, and it causes increases of cost of the apparatus or settings. In is an object of the present invention to provide a method or apparatus for manufacture of semiconductor devices, for example, wherein transfer of an original such as a reticle is executed efficiently while reducing adhesion of foreign particles to the reticle. In accordance with an aspect of the present invention, there is provided a semiconductor device manufacturing method according to claim 1 and apparatus according to claim 4. The apparatus for use with the method may further comprise display means for displaying, to an operator, whether the original is moved to the first cassette or the second cassette. Said control means may use information supplied thereto from an operational unit for controlling the apparatus, or information stored in said apparatus, to execute the discrimination. In the structure described above, the original unloaded out of the cassette accommodated in said cassette accommodating means may be conveyed to said apparatus and may be used or processed therein. Discrimination may be made as to whether the original having been used or processed is to be moved back to the same cassette so that the original is to be used or processed in the same apparatus, or it is to be moved back to a separate cassette, having a different shape, so that the original is to be used in an apparatus for use with the cassette of different shape, wherein discrimination may be made on the basis of selected one of original management information supplied from operational means to control means, for controlling the conveying means, and original management information prepared in said apparatus. The original with which the discrimination has been executed may be moved back to an appropriate cassette, in accordance with the original management information selected by an operator. After the original is moved back into a cassette in cassette conveying means by said conveying means, the control means may operate to cause display means to perform display, for an operator, concerning the cassette into which the original has been moved back. In accordance with this aspect of the present invention, after the original is used or processed, an apparatus which is to be uses subsequently is discriminated automatically without any manual operation or additional mechanism, and the original is transferred automatically to a cassette which is to be used with the subsequent apparatus. This prevents adhesion of particles to the original during the original transfer operation. Since the original transfer operation is based on the information within the apparatus, unwanted stoppage of the operation due to an error in original transfer, for example, is avoided. The work time of the operator reduces, and the rate of operation of the apparatus as well as the operation efficiency of the operator increase. A second aspect of the invention provides a method for manufacturing a semiconductor device using the apparatus of the first aspect. Embodiments of the present invention will now be described with reference to the accompanying drawings, in which: Figure 1 is a schematic and perspective view of a portion of a semiconductor device manufacturing apparatus according to a first embodiment of the present invention, which portion relates to conveyance of a reticle. Figure 2 is a plan view for explaining movement of a reticle in the semiconductor device manufacturing apparatus of the Figure 1 embodiment. Figure 3 is a schematic and perspective view of a portion of a semiconductor device manufacturing apparatus according to a second embodiment of the present invention, which portion relates to conveyance of a reticle. Referring to Figures 1 and 2 showing a semiconductor device manufacturing apparatus according to a first embodiment of the present invention, denoted in Figure 1 at 6 is a reticle, and denoted at 2 is a reticle cassette for storing a reticle therein. In this embodiment, a plurality of reticle cassettes 2 can be accommodated. Denoted at 7 is a cassette library, and denoted at 3 is a cassette opening/closing mechanism annexed to the cassette library 7. Denoted at 5 is a cassette opening/closing mechanism for opening and closing a cassette 4 with an upper cover 4a and a lower base 4b, having a shape different from that of the cassette 2. Denoted at 12 is a cassette table on which the cassette 4 can be placed, and denoted at 9 is a reticle stage on which a reticle is to be placed for execution of an exposure process. Denoted at 1 is a reticle hand for unloading or loading a reticle out of or into the cassette 2 or the cassette 4, through vacuum attraction. Denoted at 8 is reticle hand driving means which serves to perform (i) rotational drive for changing the orientation of the reticle hand 1 toward the cassette 2, the cassette 4 or the reticle stage 9, for example, (ii) horizontal drive for expanding or contracting the reticle hand 1 along a horizontal direction, and (iii) vertical drive for moving the reticle hand upwardly and downwardly. Denoted at 11 is control means for controlling the reticle hand driving means 8, the cassette library 7 and the cassette table 12. Denoted at 10 is a display for displaying information about the state of operation of the reticle hand as well as the information related to the cassette into which or out of which a reticle has been loaded or unloaded. The control means is connected to a superordinate operational unit 23 to which a plurality of semiconductor device manufacturing apparatuses can be connected. The cassette 4 of different shape has the same shape as of a cassette to be used in a reticle cleaning apparatus. The operation of the apparatus will be described with reference to Figures 1 and 2. For use of a reticle in the semiconductor device manufacturing apparatus, an operator loads the cassette 2 having a reticle 6 stored therein into the semiconductor device manufacturing apparatus. Simultaneously therewith, a vacant cassette 4 usable with the cleaning apparatus is loaded. The control means 11 and the display means 10 are manipulated, and the reticle loading operation of the semiconductor device manufacturing apparatus starts. In response, the semiconductor device manufacturing apparatus performs discrimination as to whether there is reticle management information supplied from the operational unit 23, for selection of reticle management information to be used. If there is reticle management information supplied from the operational unit 23, it is read into the control means 11. If there is no reticle management information supplied from the operational unit 23, reticle management information having already stored in the apparatus is read into the control means 11. In response to the reading of the reticle management information, the control means 11 operates to actuate the cassette library 7 to move a designated cassette 2 to the position, the same level as the reticle hand 1, and to open a door of the cassette 2 through the cassette opening/closing mechanism 3. As the door of the cassette 2 opens, the reticle hand 1 is rotationally moved toward the cassette 2 and, then, it is moved forwardly into the cassette 2. Subsequently, the reticle hand 1 is moved upwardly so that the reticle 6 within the cassette 2 is placed on the reticle hand 1. Thereafter, the reticle hand 1 holds the reticle 6 in the cassette 2 through vacuum attraction, whereby the reticle 6 is fixedly supported by the reticle hand 1. As the reticle 6 is held by vacuum attraction, the reticle hand 1 is moved backwardly and is rotationally moved toward the reticle stage 9. Then, it is moved forwardly and downwardly and, then, backwardly, whereby the reticle 6 is conveyed onto the reticle stage 9. As a result of this, the reticle 6 is displaced in the direction of an arrow 13 from the position of the cassette 2 in Figure 2, and it is conveyed onto the reticle stage 9. As the reticle 6 is conveyed onto the reticle stage 9, the control means 11 rewrites the data, in the reticle management information, regarding the number of operations in which the reticle has been used, to thereby renew that number. If the reticle management information used is the one having been supplied from the superordinate operational unit 23, the renewed reticle management information is transmitted back to the operational unit 23. A pattern of the reticle 6 placed on the reticle stage 9 is projected and printed onto a semiconductor wafer (not shown) through the semiconductor device manufacturing apparatus. When a predetermined exposure process or processes are completed and the use of the reticle 6 is to be finished, for collection of the reticle 6 into the cassette 2, the operator starts the operation for unloading the reticle 6 from the semiconductor device manufacturing apparatus by using the control means 11 and the display 10. In response, the control means 11 checks the data, in the reticle management information, regarding the number of operations in which the reticle has been used (i.e., the number of operations in which the reticle has been conveyed onto the reticle stage 9 for execution of the pattern printing process). If this number is less than a predetermined limitation number for use of the reticle, the control means 11 performs the operation reverse to the reticle loading operation, whereby the reticle 6 is collected into the cassette 2 from the reticle stage 9. In response, completion of collection of the reticle 6 into the cassette 2 is displayed by the display 10. The motion of the reticle 2 described above corresponds to an arrow 14 in Figure 2, and it means that the reticle 6 is unloaded from the reticle stage 9 into the cassette 2. If the data in the reticle management information, concerning the number of operations in which the reticle has been used, is equal to the predetermined limitation number, the control means 11 controls the reticle hand 1 to collect the reticle 6 toward the cassette 4 side. More specifically, the reticle hand 1 is rotationally moved toward the reticle stage 9, and then it is moved forwardly and upwardly to hold the reticle 6 through vacuum attraction. Subsequently, the reticle hand 1 is moved backwardly and is rotationally moved toward the cassette 4. As the reticle hand 1 is moved rotationally toward the cassette 4, the cassette opening/closing mechanism 5 opens the upper cover 4a and the lower base 4b of the cassette 4. After the cassette 4 is opened, the reticle hand 1 is moved forwardly and downwardly to place the reticle 6 on the lower base 4b. As the reticle 6 is placed on the lower base 4b, the reticle hand 1 moves back and the opening/closing mechanism 5 closes the cassette 4. As the cassette 4 closing motion completes, the display 10 displays information that the reticle 6 has not moved back to the unloaded cassette 2 but it has been collected into the cassette 4. Also, the display 10 displays that the reticle 6 is the one which should be cleaned. The operation described above corresponds to an arrow 16 in Figure 2, and it means that the reticle 6 has been unloaded from the reticle stage 9 into the cassette 4. The reticle 6 is cleaned by the cleaning apparatus (not shown) and, if the operator inputs a command to load the cleaned reticle 6 into the semiconductor device manufacturing apparatus, the cassette 4 unloaded from the reticle cleaning apparatus is placed on the cassette table 12. Also, at the same time, a vacant cassette 2 is set in the cassette library 7. After these cassettes are set in the semiconductor device manufacturing apparatus, the operator manipulates the control means 11 and the display 10 to start the reticle loading operation for loading the reticle into the semiconductor device manufacturing apparatus. In response, for selection of reticle management information to be used, the semiconductor device manufacturing apparatus checks whether there is reticle management information supplied from the superordinate operational unit 23. If there is reticle management information supplied from the operational unit 23, the reticle management information from the operational unit 23 is read into the control means 11. If there is no reticle management information from the operational unit 23, reticle management information having already stored in the apparatus is read into the control means 11. As the reticle management information is read, the control means 11 operates to cause the cassette opening/closing driving means 5 of the cassette table 12 to open the upper cover 4a and the lower base 4b of the cassette 4. As the cassette 4 opens, the reticle hand 1 is rotationally moved toward the cassette 4 and, then, it is moved forwardly and upwardly to hold the reticle 6 by vacuum attraction. As the reticle 6 is held fixed by vacuum attraction, the reticle hand 1 is moved backwardly and it is moved rotationally toward the reticle stage 9. Subsequently, it is moved forwardly and downwardly, and then, backwardly whereby the reticle 6 is conveyed onto the reticle stage 9. With this operation, the reticle 6 is moved along an arrow 15 from the position of the cassette 4 in Figure 2, and it is conveyed onto the reticle stage 9. As the reticle 6 is conveyed onto the reticle stage 9, the control means 11 erases the data, in the reticle management information, concerning the number of operations in which the reticle has been used, and it newly starts management of that number. If the used reticle management information is the one having been supplied from the operational unit 23, the renewed reticle management information is transmitted back to the operational unit 23. After the reticle 6 is used so that it is to be collected back to a cassette, the operator manipulates the control means 11 and the display 10 to start the operation for unloading the reticle 6 from the semiconductor device manufacturing apparatus. In response, the control means 11 checks the data, in the reticle management information, regarding the number of operations in which the reticle has been used. If this number is less than a predetermined limitation number for use of the reticle, the control means 11 performs the operation reverse to the reticle loading operation, by which the reticle 6 is collected into the cassette 2 from the reticle stage 9. Completion of collection of the reticle 6 into the cassette 2 is displayed by the display 10. This operation corresponds to an arrow 14 in Figure 2, and it means that the reticle 6 has been collected into the cassette 2 from the reticle stage 9. Figure 3 is a perspective view of a portion of a semiconductor device manufacturing apparatus according to a second embodiment of the present invention, which portion relates to reticle conveyance. This embodiment differs from the first embodiment in that: the cassette 4 of different shape shown in Figure 1 is replaced by a cassette 19 which is adapted to accommodate a plurality of reticles 6; and the cassette 4, the cassette table 12 and the cassette opening/closing driving means 5 are replaced by the cassette 19 for plural reticles 6, an upper cassette cover 17 for accommodating the cassette 19, a cassette table 20, and a cassette cover opening/closing mechanism 18. The cassette cover opening/closing mechanism 18 serves to open or close a combination of the upper cassette cover 17 and the cassette table 20 on which the cassette 19 is placed. The cassette 19 placed on the cassette table 20 is moved by means of an elevator mechanism 22 and a mounting table 21, along a Z direction, namely, upwardly and downwardly. The cassette 19 has the same shape as of a cassette used in a reticle particle-inspection apparatus, for example. The operation of the semiconductor device manufacturing apparatus of this embodiment will be explained with reference to Figure 3. When a reticle is going to be used in the semiconductor device manufacturing apparatus, the operator uses a reticle particle-inspection apparatus (not shown) to perform a reticle 6 to be used, in respect to adhesion of foreign particles thereto. The reticle 6 having its inspection completed is accommodated in the cassette 19, and the cassette 19 is held on the cassette table 20 and within the upper cassette cover 17. The operator mounts the cassette 19, held by the cassette table 20 and the upper cassette cover 17, on the semiconductor device manufacturing apparatus and, at the same time, mounts a vacant cassette 2 which is used as a standard cassette in the semiconductor device manufacturing apparatus. Then, the operator manipulates the control means 11 and the display 10 to start the reticle loading operation of the semiconductor device manufacturing apparatus. In response, the semiconductor device manufacturing apparatus checks, for selection of reticle management information to be used, whether there is reticle management information supplied from the operational unit 23. If there is reticle management information supplied from the operational unit 23, it is read into the control means 11. If there is no reticle management information supplied from the operational unit 23, the reticle management information having already stored in the apparatus is read into the control means 11. As the reticle management information is read, the control means 11 operates to cause the cassette cover opening/closing mechanism 18 to separate the upper cassette cover 17 and the cassette table 20 from each other. This brings the cassette 19 into a state in which it can be separated and moved downwardly. As the cassette 19 is brought into a state in which it can be separated and moved downwardly, the elevator mechanism 22 moves the mounting table 21 downwardly until the position in the cassette 19 where the reticle 6 selected by the operator is placed comes to the same level as of the reticle hand 1. As the elevator mechanism 21 moves the mounting table 21 to the position of the same level as the reticle hand 1, the reticle hand 1 is moved rotationally toward the cassette 19. Then, it is moved forwardly and upwardly into the cassette 2, so that the reticle hand 1 holds the reticle 6 in the cassette 2 by vacuum attraction. As the reticle 8 is held fixed by vacuum attraction, the reticle hand 1 is moved backwardly and, additionally, it is rotationally moved toward the reticle stage 9. Subsequently, it is moved forwardly and downwardly and, then, backwardly, by which the reticle 6 is conveyed onto the reticle stage 9. With this operation, the reticle 6 is conveyed to the reticle stage 9, from the position of the cassette 12. As the reticle 6 is conveyed onto the reticle stage 9, the control means 11 rewrites the data in the reticle management information, related to the reticle 6, and it renews the data regarding the number of operations in which the reticle has been used or the data regarding the apparatus which is going to be used subsequently. If the used reticle management information is the one having been supplied from the operational unit 23, the renewed reticle management information is transmitted back to the operational unit 23. Upon completion of use of the reticle 6, for collecting the reticle 6 into the cassette, the operator uses the control unit 11 and the display 10 to start the operation for unloading the reticle 6 out of the semiconductor device manufacturing apparatus. In response, the control means 11 checks the data regarding the number of operations in which the reticle has been used or the data regarding the apparatus to be used subsequently. If, in relation to use of the reticle 6, the same apparatus is to be used again, the control means 11 performs the operation reverse to the reticle loading operation for loading the reticle 6 from the reticle stage 9, such that the reticle 6 is accommodated into the cassette 11, and collection of the reticle 6 into the cassette 11 is displayed by the display 10. With this operation, the reticle 6 is collected from the reticle stage 9 to the cassette 11. If a different apparatus is to be used subsequently, the control means 11 controls the reticle hand 1 to collect the reticle 6 into the cassette 2. More specifically, the reticle hand 1 is rotationally moved toward the reticle stage 9 and, then it is moved forwardly and upwardly into the cassette 2. The reticle hand 1 then holds the reticle 6 in the cassette 2 by vacuum attraction, and it is then moved backwardly and rotationally toward the cassette 2. As the reticle hand 1 is rotationally moved toward the cassette 2, the cassette library 7 opens the cassette 2 by using the cassette opening/closing mechanism 3. As the cassette 2 opens, the reticle hand 1 is moved forwardly and downwardly to place the reticle 6 in the cassette 2. As the reticle 6 is placed in the cassette 2, the reticle hand 1 moves backwardly. As the reticle hand 1 moves backwardly, the cassette opening/closing mechanism 3 of the cassette library 7 closes the cassette 2. As the cassette 2 closes, the reticle 6 does not move back to the cassette 19 from which the reticle 6 has been unloaded, and the display 10 displays that the reticle is collected into the cassette 2. Also, the display 10 displays the necessity of moving the reticle to a different apparatus. With this operation, the reticle 6 is collected from the reticle stage 9 into the cassette 2. If a reticle 6 having been unloaded from a separate apparatus is to be loaded into the semiconductor device manufacturing apparatus, the operator places a cassette 2 having been unloaded from the separate apparatus on the cassette library. Also, the operator places the cassette table 20 having the cassette 19 held thereon as well as the upper cassette cover 17, on the mounting table 21. After these cassettes are set in the semiconductor device manufacturing apparatus, the operator manipulates the control means 11 and the display 10 to start the reticle loading operation of the semiconductor device manufacturing apparatus. In response, for selection of reticle management information to be used, the semiconductor device manufacturing apparatus checks whether there is reticle management information supplied from the operational unit 23. If there is reticle management information supplied from the operational unit 23, it is read into the control means 11. If there is no reticle management information supplied from the operational unit 23, the reticle management information having already stored in the apparatus is read into the control unit 11. As the reticle management information is read, the control means 11 moves the cassette 2 in the cassette library 7 to the position of the same level as the reticle hand 1. As the cassette 2 is moved up to this position, the cassette opening/closing mechanism 5 opens the door of the cassette 2. As the door of the cassette 2 opens, the reticle hand is rotationally moved toward the cassette 2 and, then, it is moved forwardly and upwardly, whereby the reticle is held through vacuum attraction. As the reticle is held fixed by vacuum attraction, the reticle hand 1 is moved backward and is moved rotationally toward the reticle stage 9. Subsequently, it is moved forwardly and downwardly and, then, backwardly, whereby the reticle is conveyed onto the reticle stage 9. With this operation, the reticle 6 is conveyed onto the reticle stage 9, from the position of the cassette 2. As the reticle 6 is conveyed onto the reticle stage 9, the control means 11 rewrites the data in the reticle management information and renews the data in the reticle management information, regarding the number of operations in which the reticle has been used or the data regarding an apparatus to be used subsequently. If the used reticle management information is the one having been supplied from the operational unit 23, the renewed reticle management information is transmitted back to the operational unit 23. While the invention has been described with reference to the structures disclosed herein, it is not confined to the details set forth and this application is intended to cover such modifications or changes as may come within the purposes of the improvements or the scope of the following claims.

Claims: A semiconductor device manufacturing method, comprising the steps of: placing a first cassette (2) in a cassette library (7) wherein the first cassette (2) is opened and closed by means of an opening and closing mechanism (3); placing a second cassette (4) of a shape different from that of the first cassette (2) on a cassette table (12), wherein the second cassette (4) is opened and closed by means of an opening and closing mechanism (5); opening the first cassette (2) by means of the said opening and closing mechanism (3); unloading a reticle (6) from the first cassette (2) opened by the said opening and closing mechanism (3) and placing the reticle (6) on a reticle stage (9) ; performing a process step for the manufacture of a semiconductor device using the reticle (6) placed on the reticle stage (9); unloading the reticle (6) from the reticle stage (9) and conveying it by means of a reticle hand (1) after completion of the process step; controlling the said opening and closing mechanism (3) to open and close the first cassette (2) and controlling the reticle hand (1) to move the reticle (6) into the first cassette (2) by means of said reticle hand (1) when said reticle (6) is to be accommodated in the first cassette (2); or controlling the said opening and closing mechanism (5) to open and close the second cassette (4) and controlling the reticle hand (1) to move the reticle (6) into the- second cassette (4) when said reticle (6) is to be accommodated in the second cassette (4); and wherein the control means (11) determines to return the reticle (6) to the first cassette (2) if the number of operations in which the reticle (6) has been used is less than a predetermined number, and the control means (11) determines to move the reticle (6) into the second cassette (4) if the number of operations in which the reticle (6) has been used is equal to a predetermined number. A method according to claim 1 wherein the reticle (6) has been moved into the second cassette (4), further comprising the step of: cleaning the reticle (6). A method according to claim 1 or claim 2, wherein the second cassette (4, 19) is adapted to accommodate a plurality of reticles (6) therein. A semiconductor device manufacturing apparatus for use in the method of claims 1 to 3, comprising: a cassette library (7) for accommodating at least one first cassette (2); an opening and closing mechanism (3) for opening and closing the first cassette (2); a reticle stage (9) for holding a reticle (6); a reticle hand (1) for conveying a reticle (6) to and from said reticle stage; characterised by further comprising: a cassette table (12) for holding thereon a second cassette (4) of a shape different from that of the first cassette (2); another opening and closing mechanism (5) for opening and closing the second cassette (4); and control means (11) designed to determine whether a reticle (6) is to be moved from said reticle stage (9) to either said first (2) or said second (4) cassette, on the basis of the number of operations in which the reticle has been used; and being designed to control either the said opening and closing mechanism (3) or the said other opening and closing mechanism (5) An apparatus according to claim 4, further comprising display means (10) for displaying to an operator whether the reticle (6) is moved from the reticle stage (9) to the first cassette (2) or to the second cassette (4). An apparatus according to claim 4, wherein the control means (11) uses reticle control information supplied thereto from an operational unit (23), which is designed to control the apparatus and said information stored in said apparatus, to execute the determination step.

Inventors: NAKAMURA GEN, NAKAMURA, GEN, Nakamura, Gen, c/o Kosugi Jigyosho Canon K. K.
Applicants: CANON KK, CANON KABUSHIKI KAISHA
Application year: 1996
Main classification: H01L21
IPC codes: B65G49, H01L21, G03F7