Oil- and water-repellent coating composition

Abstract: Condensation-curable coating compositions are prepared from a mixture of and organic resin (A) and a flurosilicone (B). Water or an organic solvent may be used to provide a vehicle for application of the composition. The cured coatings of the invention exhibit superior water and oil repellency.

Description: The present invention provides coating compositions adapted for application to various substrates, and more particularly fluorosilicone coating compositions that form films having excellent water and oil repellency. Organic resin coating agents containing silicone are known in the art. For instance, coating compositions for metal substrates are disclosed in JP-B 6-68096 which comprise the hydrolysis-condensation products of an organotrialkoxysilane and acrylic polymer. In JP-A 2-652, coating compositions comprising hydrolysis-condensation products of an organotrialkoxysilane and phenolic resin are proposed. However, the water and oil repellency of these coating materials are unsatisfactory. JP-B 7-45586 reports that, after forming a protective film made of hydrolysis-condensation products of an organotrialkoxysilane on the surface of a plastic molding, and subsequently treating with a gaseous perfluoroalkyl-group-containing organosilane, a plastic molding with excellent water repellency and oil repellency is produced. However, this method consists of a two-step surface treatment and is complex. Therefore, there is a need for coating material that exhibits both water repellency and oil repellency simply by coating and curing. The present invention overcomes the problems of the prior in that upon curing, it provides a film having excellent water and oil repellency without the need for subsequent treatment. Accordingly, these properties can be imparted to a variety of substrates. Our invention provides a coating composition comprising: (A) 100 parts by weight of an organic resin; and (B) 0.01-50 parts by weight of a fluorosilicone having the empirical formula: {F(CF 2 ) a -R 1 -R 2 b SiO (3-b)/2 } n (R 2 c SiO (4-c)/2 ) m wherein R 1 is an alkylene group or alkyleneoxyalkylene group, each R 2 is independently an alkyl group or aryl group, a is an integer of 4 or greater, b is 0-2, c is 0-3, n is a number greater than 0, and m is 0 or greater; and (C) optionally, a diluent selected from organic solvents and water. The organic resins (A) used in our coating composition may be any conventional coating agent, such as a thermoplastic organic resin and a thermosetting organic resin, but not a silicone resin. Accordingly, as used herein, the term "organic resin" specifically excludes silicone resins. Examples of suitable thermoplastic organic resins include vinyl chloride resins such as poly(vinyl chloride) or vinyl chloride-vinyl acetate copolymer; vinylidene chloride resins such as poly(vinylidene chloride), vinylidene chloride-vinyl chloride copolymer, vinylidene chloride-acrylonitrile copolymer, vinylidene chloride-acrylic acid ester copolymer, and vinylidene chloride-maleic acid ester copolymer; vinyl acetate resins such as poly(vinyl acetate) or vinyl acetate-methyl methacrylate copolymer; poly(vinyl alcohol); poly(vinyl acetals) such as, poly(vinyl formal), poly(vinylacetoacetal), and poly(vinyl butyral); poly(vinyl ethers) such as poly(vinyl methyl ether), poly(vinyl ethyl ether), poly(vinyl isobutyl ether), vinyl methyl ether-maleic anhydride copolymer, and vinyl methyl ether-cyclopentadiene copolymer; acrylic resins or methacrylic resins such as poly(methyl methacrylate), methyl methacrylate-styrene copolymer, poly(acrylonitrile), and poly(acrylic acid ester); styrene resins such as polystyrene or styrene-butadiene-acrylonitrile copolymer; polyethylene; polypropylene; ethylene-propylene copolymer; polyamides; fluororesins such as poly(tetrafluoro-ethylene), poly(chlorotrifluoroethylene), poly(vinyl fluoride), poly(vinylidene fluoride), tetrafluoro-ethylene-hexafluoropropylene copolymer, and trifluoroethylene-vinyl chloride copolymer; polycarbonates; chlorinated polyethers such as polyether, Delrin™, Celcon™, chlorinated polyether, and acetal resins; coumaroneindene resin; and petroleum resins. Examples of suitable thermosetting organic resins include phenolic resins; urea resins such as butylurea resin; melamine resins such as butylated melamine resin; guanamine resins such as methylated benzoguanamine and butylated benzoguanamine; furan resins such as phenol-furfural resin and furfuryl alcohol resin; unsaturated polyester resins; epoxy resins; polyurethane resins; xylene resins such as phenol-modified xylene resin and rosin-modified xylene resin; toluene resins; and alkyd resins. In addition to the above resins, suitable synthetic resins for component (A) include aminoalkyd resins such as urea-alkyd, melamine-alkyd, urea-melamine-alkyd, and benzoguanamine-alkyd; modified alkyd resins such as styrene-substituted alkyd, rosin-modified alkyd, phenol-alkyd condensation product, epoxy-modified alkyd, and acrylic-modified alkyd; vinyl sol products such as vinyl chloride plastisol and vinyl chloride organosol, and modified epoxy resins such as epoxy-phenol, epoxy-amino, epoxy-alkyd-melamine, epoxy-ester, epoxy-isocyanate, and epoxy-acrylic. Further resins that are suitable as component (A) include cellulose derivatives such as cellulose acetate, cellulose acetate butyrate, nitrocellulose, cellulose propionate, and ethylcellulose; rubber derivatives such as chlorinated rubber, hydrochlorinated rubber, and cyclized rubber; natural starting material such as Japanese lacquer and casein; polyesters such as poly(ethylene terephthalate); rosin esters such as ester gum; diallyl phthalate resin; polyimide resins; rosin; penta resin (the reaction product of pentaerithritol and rosin); maleic acid resin; and amino resins. Above all, thermoplastic organic resins are preferable. If transparency is especially required, acrylic resins, methacrylic resins, and polycarbonates are preferable. The fluorosilicone (B) used in our composition has the empirical formula: {F(CF 2 ) a -R 1 -R 2 bSiO (3-b)/2 } n (R 2 c SiO (4-c)/2 ) m wherein R 1 is an alkylene or alkyleneoxyalkylene group, each R 2 is independently an alkyl or aryl group, a is an integer of 4 or greater, b is 0-2, c is 0-3, n is a number greater than 0, and m is 0 or greater. Examples of R 1 alkylene groups include ethylene, methylethylene, ethylethylene, propylethylene, butylethylene, propylene, butylene, 1-methylpropylene, pentylene, hexylene, heptylene, octylene, nonylene, and decylene. Examples of R 1 alkyleneoxyalkylene groups include ethyleneoxyethylene, ethyleneoxypropylene, ethyleneoxybutylene, propyleneoxyethylene, propyleneoxypropylene, propyleneoxybutylene, butyleneoxyethylene, and butyleneoxypropylene. Representatve examples of R 2 alkyl groups include the methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, hexadecyl, and octadecyl. Examples of R 2 aryl groups include the phenyl, tolyl, and xylyl. In (B), a is an integer of 4 or greater, preferably 4-12, and more preferably 4, 6, or 8. Likewise, b is an integer from 0-2, c is an integer from 0-3; n is greater than 0; and m is 0 or greater. It is preferable that the ratio of m/n is from 0-200. The structure of our fluorosilicone (B) can be a straight chain, branched-chain-containing a straight chain, net shaped, or a 3-dimensional structure. It is preferable to use a siloxane unit that is expressed by F(CF 2 ) a -R 1 -SiO 3/2 wherein R 1 is an alkylene or alkyleneoxyalkylene group and a is 4 or greater, in the molecule. The softening point of the fluorosilicone (B) is preferably 30°C or higher, more preferably 50-250°C. When the fluorosilicone has a straight chain structure and a softening point of 30°C or greater, it is preferable that 10 mole% or greater of the R 2 is an aryl group such as a phenyl group. The fluorosilicone (B) is prepared by hydrolyzing a perfluoro group-containing organosilane that is expressed by the general formula F(CF 2 ) a -R 1 -R 2 b SiX 3-b wherein R 1 , R 2 , a, and b are the same as above, X is a halogen atom such as chlorine or bromine or an alkoxy group such as a methoxy, ethoxy, propoxy, and butoxy, followed by a condensation reaction. Another method of preparing fluorosilicone (B) involves the cohydrolysis of the perfluoro-group-containing organosilane of the above-mentioned general formula and an organosilane that has the general formula R 2 c SiX (4-c) wherein R 2 , X, and c are the same as above, in the presence of an organic solvent and an aqueous acidic solution, followed by a condensation reaction. Methods for cohydrolysis include (1) dissolving a mixture of the silanes of the above general formulas in an organic solvent, thereafter making dropwise addition of the same into an aqueous acidic solution with stirring or (2) stirring the organic-solvent-containing solution while adding an aqueous acidic solution to it. The organic solvent is preferably one that can dissolve the above-mentioned silanes as well as the formed fluorosilicone. Suitable solvents include ethers such as diethyl ether and tetrahydrofuran; ketones such as acetone and methyl isobutyl ketone; fluorine-containing solvents such as a,a,a-trifluorotoluene or hexafluoroxylene; and volatile silicone solvents such as hexamethyldisiloxane, hexamethylcyclotrisiloxane, and octamethylcyclotetrasiloxane. The concentration of the above-mentioned silane in an organic solvent is preferably such that the concentration of the fluorosilicone formed therefrom is 10-80 wt%. Suitable examples of the above-mentioned aqueous acidic solution include aqueous solutions of sulfuric acid, nitric acid, and hydrochloric acid. Above all, an aqueous solution of hydrochloric acid is preferable, in which case it is necessary that the hydrogen chloride is 5 wt% or greater. The temperature of the reaction mixture during and after the dropwise addition is preferably maintained between 0-120°C. If necessary, an organic solvent or water may be added to the fluorosilicone solution thus obtained. Upon standing, forms separate aqueous and solvent layers. After separation of the aqueous layer, the fluorosilicone-containing organic solvent layer is washed with water until the organic solvent layer is neutral. It is preferable to further dewater the solvent phase. The dewatering is performed by co-boiling (azeotropy) of the organic solvent using a water-separating column. The organic solvents that are preferably used are those having a low solubility in water. The fluorosilicone thus obtained contains a certain amount of residual silanol group or alkoxy group, and its amount is usually 0.01-10 wt%, preferably 0.05-5 wt%. The amount of fluorosilicone (B) used in this invention is 0.01-50 parts by weight, preferably 0.02-20 parts by weight, per 100 parts by weight of organic resin (A). If (B) is less than 0.01 part by weight, the water repellency of the cured coating is unsatisfactory. If more than 50 parts by weight (B) is used, the physical properties of the cured film becomes inferior. Examples of our fluorosilicone ingredient include compounds that are represented by the following average unit formulas: {(CH 3 ) 3 SiO 1/2 } 0.9 (SiO 4/2 ) 1.0 {F(CF 2 ) 4 C 2 H 4 SiO 3/2 } 0.1 {(CH 3 ) 2 SiO 2/2 } 1.8 {F(CF 2 ) 4 C 2 H 4 SiO 3/2 } 12.2 {(CH 3 )SiO 3/2 } 0.7 {F(CF 2 ) 4 C 2 H 4 SiO 3/2 } 5.5 (SiO 4/2 ) 0.35 {F(CF 2 ) 4 C 2 H 4 SiO 3/2 } 4.34 (F(CF 2 ) 4 C 2 H 4 SiO 3/2 ) {(CH 3 )SiO 3/2 } 0.5 {F(CF 2 ) 4 C 2 H 4 OC 2 H 4 SiO 3/2 } 2.0 {F(CF 2 ) 8 C 2 H 4 (CH 3 )SiO} 1 {(C 6 H 5 ) 2 SiO} 10 {(CH 3 ) 2 SiO} 18 {(C 6 H 5 )SiO 3/2 } 2 {F(CF 2 ) 8 C 2 H 4 SiO 3/2 } 1 {(C 6 H 5 )SiO 3/2 } 9 {F(CF 2 ) 4 C 2 H 4 SiO 3/2 } 1 {(CH 3 ) 3 SiO 1/2 } 1.2 {SiO 4/2 } 1 {(C 6 H 5 )SiO 3/2 } 9 {F(CF 2 ) 4 C 2 H 4 SiO 3/2 } 1 {(CH 3 ) 3 SiO 1/2 } 1.2 {SiO 4/2 } 1 {F(CF 2 ) 4 C 2 H 4 SiO 3/2 } 1 {(C 6 H 5 ) 2 SiO} 9 {F(CF 2 ) 4 C 2 H 4 SiO 3/2 } 1 {F(CF 2 ) 8 C 2 H 4 (CH 3 )SiO} 1 {(C 6 H 5 ) 2 SiO} 8 {(C 6 H 5 )SiO 3/2 } 1 . {(CH 3 ) 3 SiO 1/2 } 0.7 {SiO 4/2 } 1 {(C 6 H 5 ) 2 SiO} 10 {F(CF 2 ) 8 C 2 H 4 SiO 3/2 } 1 {(CH 3 ) 3 SiO 1/2 } 0.7 {SiO 4/2 } 1 {(C 6 H 5 ) 2 SiO} 8 {F(CF 2 ) 8 C 2 H 4 (CH 3 )SiO} 1 {(C 6 H 5 )SiO 3/2 ) 10 {F(CF 2 ) 8 C 2 H 4 SiO 3/2 } 1 {(C 6 H 5 ) 2 SiO 2/2 } 10 {F(CF 2 ) 8 C 2 H 4 SiO 3/2 } 1 {(C 6 H 5 ) 2 SiO} 5 {(C 6 H 5 )SiO 3/2 } 5 {F(CF 2 ) 8 C 2 H 4 SiO 3/2 } 1 An organic solvent or water, ingredient (C), is optionally used in our composition to dilute the organic resin (A). While it is preferable that the organic resin (A) be used in the form of a solution, a dispersion or suspension of same in an aqueous or organic solvent dispersant may also be used. Examples of suitable organic solvents used in connection with the organic resin (A) include aromatic hydrocarbons such as benzene, toluene, and xylene; aliphatic hydrocarbons such as pentane, hexane, and heptane; alicyclic hydrocarbons such as cyclohexane, cycloheptane, and cyclooctane; halogenated hydrocarbons such as chlorobenzene, perchloroethylene, trifluoromethylbenzene, 1,3-bis(trifluoromethyl)benzene, and methylpentafluorobenzene; esters such as ethyl acetate or butyl acetate; ketones such as acetone, methyl ethyl ketone, and methyl isobutyl ketone; ethers such as dimethyl ether, diethyl ether, and tetrahydrofuran; and alcohols such as methanol, ethanol, and isopropyl. The organic solvent used with the organic resin (A), in the solution or dispersion, is to control viscosity, but usually it is 1-10,000 parts by weight, preferably 10-1,000 parts by weight, based on 100 parts by weight of ingredient (A). In addition to ingredients (A) - (C), the present invention may also include a silane coupling agent to improve the adhesion of the composition to various substrates. Likewise, a curing catalyst for improving the curability of the composition may be added, as long as it does not impair the objective of our invention. Examples of silane coupling agents include compounds of the following formulas: H 2 NCH 2 CH 2 Si (OC 2 H 5 ) 3 NH 2 CH 2 CH 2 NH (CH 2 ) 3 Si (OCH 3 ) 3 CH 2 =CHSi (OCH 3 ) 3 CH 2 = CHSi (OC 2 H 5 ) 3 CH 2 =CHSi (OOCCH 3 ) 3 HS (CH 2 ) 3 Si (OCH 3 ) 3 One or more coupling agents may be used in our coating compositions, the total amount is between 0.01-10 wt% of the composition. Curing catalysts which promote condensation cure are effectively used in the present invention. Examples include the tin salts of carboxylic acids such as dibutyltin acetate, dibutyltin laurate, dibutyltin dioctoate, stannous octoate, stannous naphthenate, stannous oleate, stannous isobutyrate, stannous linoleate, stannous stearate, stannous benzoate, stannous naphthoate, stannous laurate, stannous O-thymate, stannous β-benzoylpropionate, stannous crotonate, stannous tropate, stannous p-bromobenzoate, stannous palmitoleate, stannous cinnamate, and stannous phenylacetate; iron salts, manganese salts, and cobalt salts of these carboxylic acids; complex salts of dialkyl titanate and tetraalkyl titanate; and organosiloxy titanate. If desired, other additives such as a coloring materials, pigments, dyes, light-absorbing agents, fluorescent paints, photosensitizers, color couplers, or fillers, such as silica, can be added to the compositions of the present invention. The compositions of the present invention are prepared by homogeneous mixing of the above-mentioned ingredients (A)-(C). It is preferable, however, to dilute ingredient (A) with ingredient (C), followed by adding ingredient (B). Methods for applying the present invention to the surface of various substrates include: (1) coating using a brush, bar coater, and spin coater; (2) spraying; and (3) dipping a substrate in our composition. After the surface of a substrate is coated with the invention, the organic solvent or water, of ingredient (C), is removed at room temperature or with heating, such that a cured film is formed. It is preferable to heat the coated substrate at 50-150°C for 20 sec to 3 h so a cured film is formed. Examples of substrates that are coated with the present invention include various glasses, such as soda, heat-ray-reflecting, automobile glass, ship glass, and aircraft glass; metal plates such as copper, iron, stainless steel, aluminum, and zinc; paper such as wood-free paper or kraft paper; synthetic resins such as polyesters, polycarbonates, polystyrene, acrylic, methacrylic, and nylon, or their films; fibers such as natural and synthetic; ceramics; and plastics. It is preferable that the surface of the substrate is washed with an organic solvent or a detergent beforehand. The present invention forms cured films having excellent water and oil repellency, and exhibit low surface energy when applied to the surface of various substrates. The cured films also have excellent stain resistance, mold-releasing properties, heat resistance, weather resistance, and chemical resistance. Thus, they are used for various purposes that require these characteristics, such as an adhesion inhibitor for water droplets, snow, ice, oil, thermoplastic powders, and resin powders; stain-inhibitive coating materials; and coating agents for peeling or mold releasing. EXAMPLES Application examples are presented below to illustrate the novel features and utility of the present invention. In the application examples, the water repellency of the films was evaluated by measuring the contact angle with respect to water. The oil repellency was evaluated by measuring the contact angle with respect to methylene iodide or hexadecane. In both cases, the contact angle was measured using the following method. A microsyringe was used to drop water and methylene iodide or hexadecane on 5 sites of a cured film at 20°C. The contact angle was measured using a contact-angle gauge (Kyowa Kaimenkagaku Co., Ltd.) and the average value obtained at the five sites was regarded as the contact angle for the film. Synthesis Example 1 A mixture of 16 g of water, 12 g of isopropyl alcohol, and 70 g of 1,3-bis(trifluoromethyl)benzene were put in a flask; while the mixture was stirred, a mixture of 114 g of nonafluorohexyltrichlorosilane of the formula C 4 F 9 C 2 H 4 SiCl 3 and 50 g of 1 ,3-bis(tri-fluoromethyl)benzene were added dropwise to the flask. After addition, the resulting mixture was stirred for 2 h. It was then allowed to stand to separate into an aqueous layer and an organic solvent layer. The organic solvent layer was successively washed with pure water, a 10 wt% aqueous sodium bicarbonate solution, and pure water. After the washings, the organic solvent was removed by heating to obtain 86 g of a fluorosilicone resin of the formula (C 4 F 9 C 2 H 4 SiO 3/2 ) x (wherein x is 7 on average). The resin was a colorless liquid at room temperature. Synthesis Example 2 A mixture of 24 g of water, 18 g of isopropyl alcohol, and 70 g of 1,3-bis(trifluoromethyl)benzene was put in a flask. While the mixture was stirred, a mixture of 23 g of hexadecafluorodecyltrichlorosilane of the formula C 8 F 17 C 2 H 4 SiCl 3 , 101 g of diphenyldi-chlorosilane, 70 g of 1,3-bis(trifluoromethyl)benzene, and 50 g of toluene was added dropwise to the flask. After addition, the resulting mixture was stirred for 2 h. It was then allowed to stand and separate the aqueous layer from the organic solvent layer. The organic solvent layer was successively washed with pure water, a 10 wt% aqueous sodium bicarbonate solution, and pure water. After washing, the organic solvent was removed by heating to obtain 87 g of a fluorosilicone resin of the formula {C 8 F 17 C 2 H 4 SiO 3/2 } n {(C 6 H 5 ) 2 SiO} m (wherein n is 1 on the average and m is 10 on the average. The resin was a white solid with a softening point of 70°C. Application Example 1 A coating composition was prepared by adding 0.1 g of the fluorosilicone resin prepared in Synthesis Example 1 to a 1:1 mixture of (1) 10 g of a toluene/butyl mixed solution of an acryl polyol resin (solids content: 50 wt%) (AcrydicO A-801, Dainippon Ink and Chemicals, Inc.) and (2) 10 g of 1,3-bis(trifluoro-methyl)benzene. A clean, smooth glass plate was dipped for 10 min in the composition thus prepared. After 10 minutes, the glass plate was removed from the composition and was air-dried at room temperature for 1 h. It was then heated at 150°C for 1 h to form a film on the glass plate. The contact angle of the film thus obtained was measured and is reported in Table I. Application Example 2 A coating composition was prepared as in Application Example 1, except that the amount of fluorosilicone resin (prepared in Synthesis Example 1) of Application Example 1 was changed to 0.2 g. The composition was then coated on a glass plate and dried and heat-cured as above to form a film. The contact angle of the film was measured and the result is shown in Table I. Comparative Example 1 A coating composition was prepared as in Application Example 1, except that the fluorosilicone resin (prepared in Synthesis Example 1) of Application Example 1 was not used. The composition was then coated on a glass plate and dried and heat-cured to form a film. The contact angle of the film was measured and the result is shown in Table I. Contact Angle Water Methylene Iodide Application Example 1 100 68 Application Example 2 107 67 Comparative Example 1 85 33 Application Example 3 A coating composition was prepared by adding 1 g of the fluorosilicone resin synthesized in Synthesis Example 2 to 20 g of a tetrahydrofuran solution of a polycarbonate resin (solids content: 10 wt%). A clean smooth glass plate was coated with the composition thus prepared so the amount coated was 300 g/m 2 ; it was then air-dried at room temperature for 1 h. This was heated at 150°C for 1 h to form a film on the glass plate. The contact angle of the film thus obtained was measured and its external appearance was visually evaluated. The results are shown in Table II. Comparative Example 2 A coating composition was prepared as in Application Example 3 except that the fluorosilicone resin (prepared in Synthesis Example 2) was not used. The composition was coated on a glass plate, dried and heat-cured as above to form a film. The contact angle of the film was measured and its external appearance was visually evaluated. The results are shown in Table II. Comparative Example 3 A coating composition was prepared as in Application Example 3, except that the fluorosilicone resin (prepared in Synthesis Example 2 and used in Application Example 3) was replaced by a methylsilicone resin (SH2400, Dow Corning Toray Silicone™ Co., Ltd.). The composition was coated on a glass plate, dried and heat-cured to form a film. The contact angle of the film was measured and its external appearance was visually evaluated. The results are shown in Table II. Comparative Example 4 A coating composition was prepared as in Application Example 3, except that the fluorosilicone resin (prepared in Synthesis Example 2) was replaced by a phenylmethylsilicone resin (SH804, Dow Corning Toray Silicone ™ Co., Ltd.). The composition was coated on a glass plate, dried and heat-cured above to form a film. The contact angle of the film was measured and its external appearance was visually evaluated. The results are shown in Table II. Contact Angle of Film External Appearance Water Hexadecane Application Example 3 108.0 54.3 Transparent Comparative Example 2 87.0 10 and below Transparent Comparative Example 3 99.2 29.2 White Turbidity Comparative Example 4 92.7 19.2 Transparent

Claims: A curable coating composition comprising: (A) 100 parts by weight of an organic resin excluding silicone resins; and (B) 0.01-50 parts by weight of a fluorosilicone having the empirical formula: {F(CF 2 ) a -R 1 -R 2 b SiO (3-b)/2 }n(R 2 c SiO (4-c)/2 ) m wherein R 1 is an alkylene group or alkyleneoxyalkylene group, each R 2 is independently an alkyl group or aryl group, a is an integer of 4 or greater, b is 0-2, c is 0-3, n is a number greater than 0, and m is O or greater. A composition of Claim 1 further comprising (C) a diluent selected from water or organic solvents. A composition of Claim 1 or 2 wherein said organic resin is a thermoplastic organic resin. A composition of Claim 1 or 2 wherein said organic resin is a thermosetting organic resin. An article of manufacture comprising a substrate presenting at least one surface, and said at least one surface is coated with a curable coating composition of any of Claims 1-4.

Inventors: KOBAYASHI HIDEKI DOW CORNING T, MASATOMI TORU DOW CORNING TORA, KOBAYASHI, HIDEKI, MASATOMI, TORU, Kobayashi, Hideki, Dow Corning Toray Co., Ltd., Masatomi, Toru, Dow Corning Toray Co., Ltd.
Applicants: DOW CORNING TORAY SILICONE, DOW CORNING TORAY SILICONE COMPANY LTD.
Application year: 1996
Main classification: C09D7
IPC codes: C09D183, C09D201, C09D7