MICROMACHINED HOLES FOR OPTICAL FIBER CONNECTION

Abstract: Novel embodiments and manufacturing methods for optical fiber connector plugs and sleeves are disclosed, in which precision through-hole (24) is fabricated on a thin slab (22), preferably using preferential etching technique on a semiconductor wafer, such as silicon or gallium arsenide. In the embodiment of plug, optical fiber (26) is inserted into the through-hole (24), with the orientation perpendicular to the surface of the slab. In the embodiement of sleeve (49), plugs (47, 48) with slopped side surfaces are seated on the V-square recesses provided on both sides of the thin slab sleeve (49).

Description: Description Micromachined Holes For Optical Fiber Connection Technical Field This invention pertains generally to the field of optical fibers, and particularly to structures for connecting an optical fiber to another optical fiber or to an optical device such as laser diode, detector, and modulator. Background Art This application is related to PCT Patent Application Serial No. PCT/US95/09296 filed 18 July 1995, "Face-Lock Interconnection Means For Optical Fibers And Other Optical Components, And Manufacturing Methods Of The Same". Most of the novel embodiments disclosed in the present application are described in the referred parent application PCT/US95/09296 to enhance the understanding of the claimed novel embodiments of the application PCT/US95/09296. But, the embodiments disclosed and claimed in the present application are not claimed in the application PCT/US95/09296. Optical fibers have been used widely for many applications, most notably for optical fiber communication. As the optical fiber communication is inching toward individual offices and residential area, the cost of optical fiber interconnection becomes the major issue. The optical fiber interconnection includes fiber-to-fiber connection, fiber-to-light source connection, fiber-to-detector connection, and an optical fiber to other optical components. The interconnection costs are high due to the small size of the optical beams involved. A typical laser diode has a light-emitting spot in the order of one or two microns. Single-mode fiber, the most commonly used one, has about 9-micron core (and 125 micron cladding). When two single-mode fibers, or a single-mode fiber and a laser diode, are connected, the alignment should be within one or two micron in terms of the transverse offset. In an conventional connector, in order to achieve such an alignment accuracy when connecting two optical fibers, each of the fibers is inserted in an elongated precision plug with nominally 125 micron inside diameter (ID). The two mating plugs are then inserted into an elongated precision sleeve. The required tight dimensional requirements of these elongated parts drive up the cost of the optical fiber connection. The difficulty escalates quickly when the number of optical fibers increases in so-called array interconnection. Surface emitting laser diodes and detectors are produced in a two-dimensional array on a semiconductor wafer. The positional accuracy of these optical components on the wafers is better than one micron as they are registered by photolithographic method. However, such a precision has not been achieved in the conventional array connectors for optical fibers, while there are increasing requirement for a large array interconnection for local area network, optical data processing, and optical computing. Disclosure of Invention Accordingly, it is the primary objective of the present invention to devise an alternative approach for connecting optical fibers to another optical fibers, light sources, detectors, lenses, and other optical components. It is the ultimate objective of the present invention to lower the costs of optical interconnections involving optical fibers, integrated optic waveguides, light sources, detectors, lenses, and other related optical components, so as to maximize the contribution of the fiber optics to the construction of information superhighway i nfrastructure . In the present invention, a through-hole is fabricated in a thin slab, and the optical fiber is inserted into the hole to be terminated on the front mating surface of the thin slab. The optical fiber is oriented largely perpendicular to the thin slab. The hole position may be registered on the thin slab by a conventional photolithographic procedure, which have sub-micron registration accuracy, and then the hole is fabricated by micromachining technique. Such a fabrication technique can produce holes with limited depth because the micromachining techniques are basically surface technology. A proper supporting body may be added to the rear side of the thin slab so as to maintain the fiber in place and in the perpendicular orientation. Semiconductor wafers made of silicon, gallium arsenide, and indium phosphite are especially suitable materials as the thin slab because their unique preferential etching characteristics result in sharply defined precision V-square holes with a tapered entrance for easy insertion of optical fiber. The both plugs and sleeves may be fabricated using such a technique. Brief Description of Drawings FIG. 1 shows schematically a conventional connector embodiment for aligning optical fibers, especially in an array form, using pins and holes. FIG. 2 shows a sectional side view of the connector embodiment of FIG. 1 . FIG. 3 shows schematically another conventional connector embodiment for aligning fibers using micromachined V- grooves . FIG. 4 shows schematically a novel embodiment of the present invention for an array of optical fibers. FIG. 5 shows a thin slab coated with mask layers on the surfaces. FIG. 6 shows the same as in FIG. 5, except that openings are made on the masks. FIG. 7 shows the same as in FIG. 7, except that a hole is created through the thin slab by a micromachining technique. FIG. 8 shows two wafers fabricated by a micromachining technique utilizing an anisotropic preferential etching method; with optical fibers terminated in different ways. FIG. 9 shows a wafer with mask layers on the both sides, a side sectional view on the left and a surface view on the right, in which the mask layer on the front side has an opening for etching. FIG. 10 shows the same as in FIG. 9, except that the wafer has been preferentially etched from the front side to make a V-square hole. FIG. 11 shows the surface view of FIG. 10. FIG. 12 shows a wafer that has been preferentially etched from the rear side so as to orient the V-square hole opposite from that of FIG. 10. FIG. 13 shows an extension of the embodiment of FIG. 12 into an array form. FIG. 14 shows a wafer on which two identical openings are provided on the mask layers on the both sides. FIG. 15 shows the wafer of FIG. 14 after it has been preferentially etched from the both sides to have a twin V-square hole, thus forming a connector sleeve. FIG. 16 shows a wafer with a large-size square mask, and small-size square masks inside the large-size square mask. FIG. 17 shows the embodiment of FIG. 16 after preferential etching that produces a connector plug. FIG. 18 shows two connector plugs made by the method illustrated in FIGS. 16 and 17, and a connector sleeve made by the method illustrated in FIGS. 14 and 15. FIG. 1 9 shows an extension of the embodiments of FIG. 18 into a combined array form; an array for the fibers and an array for the plugs. FIG. 20 repeats the hole shown in FIG. 1 1. FIG. 21 shows a number of holes with slightly varying clearances. FIG. 22 shows the same array of the through-holes as shown in FIG.4, except that each hole of FIG. 4 has been replaced by a set of through-holes of FIG. 21. FIG. 23 shows basically the same as in FIG. 8, except that the optical fiber is tapered along the length, and the hole clearance is made slightly smaller, so that the fiber is tightly fit at a certain location along the tapered length. FIG. 24 shows the same as in FIG. 23, except that the fiber has been cut and polished to complete the termination. FIG. 25 repeats the plug shown in FIG. 8. FIG. 26 shows the same as in FIG. 25, except that an identical plug is provided to stabilize the orientation of the optical fiber. FIG. 27 shows that a supporting bulk with an over-sized through- hole is attached behind the micromachined plug of FIG. 25. FIG. 28 shows the same as in FIG. 18, except that a bulk with an over-sized through-hole is attached behind each of the micromachined plugs and the sleeve. FIG. 29 shows the same as in FIG. 28 after the mating is completed. Best Mode for carrying Out the Invention FIG. 1 shows one conventional way of connecting an array of optical fibers (1 ) and (2) to another array with fibers (3) and (4) using a set of elongated alignment pins (5). FIG. 2 shows the sectional side view along Q-Q'. An example of this prior art can be found in U.S. Patent 4,341 ,439 (Malcom H. Hodge). As another conventional approach, FIG. 3 shows one part of connector with an array of optical fibers (6), (7), an (8) laid in V- grooves micromachined on a substrate (9), which is preferably a silicon wafer. A pair of such a part is brought together in an attempt to achieve fiber-to-fiber butt connection. Examples of this kind of prior art can be found in U.S. Patents 5,315,678 (Maekawa, et.al.) and 4,725 , 1 14 (Murphy). In these examples, we notice that the most critical element in aligning two optical fibers is positioning the end of the fibers precisely on the mating plane. Thus, the problem is two-dimensional in its nature. However, the conventional optical connectors achieve the optical alignment via elongated elements such as plugs, sleeves, pins, and grooves, thus converting the optical interconnection problem from the largely two-dimensional nature to a three- dimensional one. This is the origin of the difficulty experienced in the conventional interconnection approaches. In particular, the conventional interconnection approaches cannot benefit from the modern photolithographic technique that has sub micron registration accuracy because the lithography (photolithography, X-ray lithography, etc.) is largely a surface technology while the conventional connection means are three-dimensional in its nature. In the present invention, an optical alignment remains largely as a two-dimensional surface problem. More specifically, the alignment in the present invention mainly relies on the precise positioning of through holes on the mating surface of a thin slab. The positions of the holes are registered by the conventional precision photolithography that has sub-micron accuracy. Then the holes are etched through the thin slab utilizing various micromachining techniques such as chemical etching, ion-milling, sputter etching, etc. that are common in micro-electronics and micro-mechanical industries. In this approach, the depth of the holes is comparable to the hole size (aspect ratio around one). FIG. 4 shows schematically embodiment of the present invention in which an array of optical fibers, ( 10), are terminated on a thin slab with a group of shallow through-holes ( 1 1 ) in a perpendicular orientation. The center- to- center distances S i and S2 can be made precise within one micron using the photolithography, especially on a silicon slab. FIG. 5 through FIG. 7 illustrates a sequence of one micromachining technique for fabricating the holes shown in FIG. 4, in which side views of a thin substrate or slab ( 12) are shown. First, as shown in FIG. 5, thin masking layers ( 13) and ( 14) are applied on the both sides of the slab ( 12). The layer will be typically about one micron thick. Then, as shown in FIG. 6 openings ( 15) and ( 16) are made on one side. Optionally, matched openings ( 17) and ( 18) may be made on the other side. Then, holes ( 19) and (20) are etched through the openings using a proper micromachining technique. FIG. 7 shows in a highly schematic manner the result of the etching. The mask layers (13) and (14) may be removed as indicated, or may remain as they are very thin. Depending on the technique used, the side walls of the holes ( 19) and (20) may be smooth or rough; also they may be straight or tapered in the diameter. In general, the slab thickness cannot be much larger than the hole diameter if one want to obtain a rather precise hole diameter. Actually the slab thickness should be about the same as, or smaller than, the hole diameter for a precision fabrication. Since most of the optical fibers have 125 um cladding diameter, the hole size should be close to 125 um. This makes slab thickness about 100 to 200 um thick. SUBSTmJTE SHEET (RULE 26) Now a preferred micromachining technique will be introduced through FIG. 8 through FIG. 28. This preferred micromachining technique is based on the well-known anisotropic preferential etching characteristics of certain semiconductor wafers. For example, V-grooves and V-squares may be fabricated on a silicon wafer with ( 100) orientation. Actually the prior art introduced above related to FIG. 3, namely U.S. Patents 5,315,678 (Maekawa, et.al.) and 4,725, 1 14 (Murphy) teaches how to utilize such V-grooves for aligning optical fibers. In the present invention, we will teach how to utilize V-square through-holes for aligning optical fibers. The orientation of optical fibers are orthogonal between the prior arts and the present invention. FIG. 8 shows sectional side views of two wafers (21 ) and (22) with such through-holes (23) and (24); one on the left having been etched from the front side (fiber-mating side), and the other on the right side having been etched from the rear side. The etching technique to produce such through-holes will be described below in detail using FIG. 9 through FIG. 13. The fabrication is based on the well-known preferential etching of a silicon wafer with either ( 100) or ( 1 10) facet. The same or similar technique can be used on other crystal wafers such as gallium arsenide or indium phosphite. For example, on a ( 100) silicon wafer, V-squares can be fabricated in which the side walls have a definite angle with respect to the surface regardless of the square size. The detailed fabrication steps are as follows: as indicated in FIG. 9 (a sectional view on the left, and a surface view on the right), a mask layer (27) is patterned on one side and another layer (28) on the other side (this second mask is to prevent etching of the back side) on the silicon wafer using photolithography technique, which has sub micron resolution in positioning a desired pattern on a pre- determined position. Then the wafer (21 ) is immersed in an etchant that etches the wafer in <100> direction much faster than in < 1 1 1 > direction (by a factor of about 50 to 1 ,000). The result of the preferential etching is shown in FIG. 10 (a sectional view) and FIG. 1 1 (a surface view). The side-walls inside the V-square (23) shown in FIG. 10 are the hard-to-etch facets, namely the ( 1 1 1 ) facets. Accordingly, the depth of the V-groove depends mainly on the width SWπniTΕ SHEET (RULE 26} W 3 of the opening of the mask (27). The mask layer (28) is stripped off when the etching is completed to complete the fabrication of the through-hole (23). The angle of the side walls is universal and constant for the wafer as it is defined by the (111 ) facets of the silicon. Accordingly, if the size of the hole W2 and the wafer thickness T are known, the value for the mask opening W3 can be calculated. When the optical fiber is entering from the left side of the through-hole as in FIG. 8, it would be convenient to have the through-hole tapered out to the left side of the wafer, as shown in FIG. 12. This can be realized by providing an opening on the mask layer (29) on the left-side as shown. The mask layer (30) in FIG. 12 may be made of a transparent thin-film dielectric material such as glass or silicon nitride. It does not have to be removed since it may work as a window for optical fiber being inserted in the through-hole (24). FIG. 13 shows a straightforward extension of the embodiment and the technique described in FIG. 9 through FIG. 12 to an array form, in which two through-holes (31 ) and (32) are prepared in the same manner, and two optical fibers (33) and (34) may be terminated on the front surface as indicated. The center-to-center distance S3 between the through-holes (31 ) and (32) may be made precise with better than one-micron accuracy. FIG. 14 shows a slight variation in which the mask layers (35 ) and (36) have openings, when the wafer (37) is etched, a twin V- square through-hole (38) is produced. As will be shown later (FIG. 18) this part will constitute a connector sleeve (49). Now, we will describe a method to prepare the edge of the connector plug such as shown in FIG. 4. FIG. 16 shows a wafer (39) that has a large square mask (40) for the plug outlining, and an array of small square openings (41 ) for making holes for fibers (( 1 1 ) in FIG. 4). Preferential etching will then result in an array connector plug (42) with the V-edges (43), (44), (45), and (46). When the smaller square openings (41 ) are on the front side of the wafer (39), the resulting hole-fiber orientation will be like the one shown on the left side in FIG. 8; and when the smaller square openings (41 ) are on the rear side, it will be like the one shown on the right side in FIG. 8. The number of holes in FIG. 17 can range from one to a few hundreds, or even more. Making one hole takes as much etching time as making one thousands. As the distance between two neighboring holes may be closer than 0.5 mm, one can accommodate more than 10,000 holes on a 3" silicon wafer. FIG. 18 shows two plugs (47) and (48) fabricated following the procedure described in FIGS. 16 and 17, with one hole and one fiber each; and a sleeve (49) fabricated following the procedure described in FIGS. 14 and 15. Since the side-walls have the same slope angle, and the dimensions are registered precisely, the plugs (47) and (48) can be connected through the sleeve 49 with a precise alignment. FIG. 19 shows an simple extension of FIG. 18 to a combined array form; an array for the fibers and an array for the plugs. FIG. 20 repeats the square-hole drawing of FIG. 1 1. When the through-hole (23) is fabricated, the hole clearance W2 should be very close to the diameter of the optical fiber for precision fiber alignment. For a given value W2 , the value for W2 could vary slightly, in FIGS. 10 and 1 1 , due to the variation of the thickness T of wafer (21 ) and undercut of the masked edges by the etchant. For example, the hole clearance W2 could turn out to be anywhere between 124 and 130 microns while the optical fiber diameter itself can vary between 123 to 127 microns. In the worst case the hole size W 2 could be larger than an optical fiber by seven microns, or the hole size W2 could be smaller than the fiber diameter. In order to accommodate this variations in the hole size and the fiber diameter, a number of through-holes with varying dimensions can be fabricated, as depicted in FIG. 21 , which shows three through-holes (52), (53), and (54), which have three different sizes of mask openings W3, W3\ and W3", and three corresponding sizes of the through-holes W2, W2' and W2" (as examples, these three values could be 127, 125 and 123 microns, respectively) . One of these three through-holes would match to a given optical fiber better than the other holes. The number of holes may be more than three. The resulting embodiment is shown in FIG. 22, which is a variation of the surface layout shown in FIG. 4: each of the through-holes in FIG. 4 is replaced by three through-holes in FIG. 22. The fiber connector plugs as shown in FIG. 4 and FIG. 22 may be mated not only to an identical connector plugs as shown in FIG. 18, but also to an array of laser diodes, detectors, LED's, and other optical components in a matched array form. More teachings on this application is described in the related PCT Patent Application Serial No. PCT/US95/09296 filed 18 July 1995, "Face-Lock Interconnection Means For Optical Fibers And Other Optical Components, And Manufacturing Methods Of The Same". Another approach to improve the fiber fitting in a hole is shown in FIG. 23, in which an optical fiber is tapered in its diameter along the length so that it fits tightly in the hole (57) at a certain position. After filling the hole (57) with a cementing material (58), the fiber (56) may be prepared as shown in FIG. 24 by breaking off the tip and polishing the end. In describing the novel embodiments above, we illustrated only thin slabs and optical fibers, such as shown in FIG. 25. This was to clarify the novel features of the embodiments. There are many ways of stabilizing the optical fiber (60) in FIG. 25. One way is shown in FIG. 26 in which an identical plug (61 ) is used to anchor the fiber (60). Another approach is shown in FIG. 27 in which a bulk body (63) is supporting the thin-slab plug (59) from the rear side. The supporting body does not have to be precise in the hole size and position since the thin-slab plug performs the alignment function. Actually it would be necessary that the bore size of the supporting bulk (63) is oversized for easy plug assembly and fiber insertion. FIG. 28 shows the same configuration of FIG. 18, except that supporting bulks are explicitly shown. FIG. 29 shows the same after the mating of plugs (47) and (48) is completed. In order to assure the axial alignment of the mating optical fibers (67) and (68) in FIG. 29, it would be helpful to make the clearance of the sleeve (49) slightly smaller so that a gap exists between the plugs (47) and (48) after the full engagement. This is because, in general, the center of a micromachined V-squares remains invariant even when the hole size may vary due to the slight variation of the thickness of wafers ("T" in FIG. 10) and undercutting of edges during preferential etching. This "invariance of the center" is the powerful ally in achieving the SUBSTTTUTE SHEET (RULE 26) precision alignment by the novel embodiments described in the present patent application. Obviously many modifications and variations of the present invention are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims the invention may be practiced otherwise than as specifically described. SUBSTITUTE SHEET (RULE

Claims: Claims 1. An optical fiber connector plug comprising an optical fiber (26); and a substantially planar thin slab (22) provided with a front surface (22A), a rear surface (22B), and a through-hole (24); wherein the through-hole (24) is registered and fabricated with the aid of the lithography so as to ensure precise location of the through-hole (24), and the bore size of the through-hole (24) is slightly larger than the diameter of the optical fiber (26), the optical fiber (26) is terminated on the front surface (22A) of the thin slab, and the optical fiber (26) is oriented substantially perpendicular to the front surface (22A) of the slab (22). 2. The invention according to claim 1 wherein the optical fiber is tapered in its diameter so that the optical fiber makes a tight fit with the through-hole at a certain position on the tapered section. 3. The invention according to claim 1 wherein the through-hole is created by etching out by a micromachining technique. 4. The invention according to claim 3 wherein the micromachining technique consists of wet chemical etching. 5. The invention according to claim 3 wherein the micromachining technique consists of a dry-etching. 6. The invention according to claim 5 wherein the dry etching technique consists of ion-milling. 7. The invention according to claim 5 wherein the dry etching technique consists of sputter-etching. 8. The invention according to claim 1 wherein the thin-slab is made of a material with preferential etching characteristics so as to permit fabrication of precise through-hole. 9. The invention according to claim 8 wherein the material is silicon. 10. The invention according to claim 9 wherein the thin slab made of silicon has (100) orientation so as to allow fabrication of a V-shape through-hole with a well-defined universal wall angle with respect to the surface of the thin slab. 1 1. The invention according to claim 8 wherein the material is gallium arsenide. 12. The invention according to claim 8 wherein the material is indium phosphite. 13. The invention according to claim 8 wherein the through- hole is etched from the rear side of the thin slab so as to make the bore size of the through-hole is larger on the rear side than on the front side. 14. The invention according to claim 8 wherein the outside boundaries of the slab are formed by the preferential etching so that the slab is substantially rectangular in shape, and the side lengths are precise, and the side edges have sloped surfaces with the slope angle same as the slope angle of the inside walls that is characterized by the preferential etching. 15. An optical fiber connector sleeve comprising a substantially thin slab (37) with a front surface (37A), rear surface (37B) and a through-hole (38); wherein the through-hole (38) is registered by lithographic method to ensure precise size and location, and the bore size of the through-hole (38) is larger on the front surface (37A) and the rear surface (37B) as compared to the bore size in the mid-point between the two surfaces so that connector plugs may be seated on the front and the rear surfaces of the thin slab for optical fiber alignment. SΛ$TiTUTE SHEET (RULE 26) 16. The invention according to claim 15 wherein the thin-slab is made of a material with preferential etching characteristics so as to permit fabrication of precise through-hole. 17. The invention according to claim 16 wherein the material is silicon. 18. The invention according to claim 17 wherein the thin slab made of silicon has (100) orientation so as to allow fabrication of a twin V-shape through-hole with a well-defined universal wall angle with respect to the surface of the thin slab. 19. The invention according to claim 16 wherein the material is gallium arsenide. 20. The invention according to claim 16 wherein the material is indium phosphite. 21 . An optical fiber connector plug comprising a plurality of optical fibers (33 and 34); and a substantially planar thin slab with a front surface, rear surface and a plurality of through-holes (31 and 32); wherein the through-holes (31 and 32) are registered and fabricated with the aid of the lithography so as to ensure precise locations of the through-holes (31 and 32) and precise intervals among the through-holes (31 and 32), the bore sizes of the through- holes (31 and 32) are slightly larger than the diameter of the optical fibers (33 and 34), one of the optical fibers (33 or 34) is inserted into one of the through-holes (31 or 32) from the rear side so as to terminate the end of the optical fiber (33 or 34) on the front surface of the thin slab, and the optical fibers (33 and 34) are oriented substantially perpendicular to the front surface of the slab. 22. An optical fiber connector sleeve comprising a thin slab with a front surface, rear surface and a plurality of through-holes; wherein the through-holes are registered and fabricated with the aid of the lithography so as to ensure precise locations of the through- SUBSTΠUTE SHEET (RULE 26) holes and precise intervals among the through-holes, and the bore sizes of the through-holes are larger on the front surface and the rear surface as compared to the bore sizes in the mid-point between the two surfaces so that connector plugs may be seated on the front and the rear surfaces of the thin slab for optical fiber alignment. 23. An optical fiber connector plug comprising an optical fiber, a substantially planar thin slab with a front surface, rear surface and a plurality of through-holes (52, 53 and 54); wherein the through- holes are registered and fabricated with the aid of the lithography so as to ensure precise locations of the through-holes and precise intervals among the through-holes, and the bore sizes of the through-holes are slightly larger than the diameter of the optical fiber, and the clearance of the through-holes are slightly different from each other so that one of the three through-holes may be selected for the fiber connection and the optical fiber is inserted into the selected through-hole from the rear side so as to terminate the end of the optical fiber on the front surface of the thin slab, and the optical fiber is oriented substantially perpendicular to the front surface of the slab.

Inventors: SHEEM SANG K, SHEEM, SANG, K.
Applicants: SHEEM SANG K, SHEEM, SANG, K.
Application year: 1996
Main classification: G02B6
IPC codes: G02B6