POLYMERIC COMPOSITIONS

Abstract: A composition comprising an ehtylene containing polymer, a cross-linking agent and a treated filler material. The treated filler material comprises a treating agent which is a polymer comprising acrylonitrile and at least one other monomer. A preferred treated filler material is a treated carbon black and a preferred ethylene containing polymer is an ethylene vinyl acetate (EVA) polymer. A semiconductive composition of the present invention may be advantageously utilized in electrical wire and cable application.

Description: POLYMERIC COMPOSITIONS Field of the Invention The present invention relates to a composition comprising a treated filler material, preferably a treated carbonaceous filler material, a crosslinking agent and an ethylene containing polymer. A preferred treated filler material comprises carbon black and preferred ethylene containing polymers are ethylene-vinyl acetate (EVA), ethylene- propylene (EPR) and ethylene propylene diene monomer (EPDM). Background of the Invention The treating of carbon black with polymeric binders is disclosed in the art. Previous patents disclose the art of incoφorating additives to produce pelletized treated filler materials, in particular pelletized treated carbon blacks, with improved handling characteristics, for example, low dust. The construction of insulated electrical conductors, i.e., wire and cables designed for medium and high voltage applications, is known in the art. Typical constructions include a core conductor which comprises one or more strands of a conducting metal or alloy such as copper or aluminum; a layer of a semiconductive shielding compound; a layer of insulation such as crosslinked polyethylene or ethylene-propyiene rubber and a layer of a semiconductive insulation shield compound overlaying the insulation. The conductor shield, the insulation shield and the overlaying semiconductive shield layer may be formed by either a two pass or by a single pass triple extrusion process. A two pass operation refers to a process whereby the conductor shield and the insulation layer are extruded in tandem and then crosslinked prior to extrusion of the semiconductor insulation layer. A single pass triple extrusion process refers to a process in which the conductor shield, the insulation layer and the semiconductive shield are ail extruded in a common extrusion head and crosslinked simultaneously. The single pass triple extrusion process minimizes production steps and hence is a preferred method of manufacture. However, the single pass triple extrusion process generally makes the semiconductive shield layer more fully bonded to the insulation layer, than in a two pass operation. Generally, in order to splice insulated electrical wires, or make terminal connections, the semiconductive shield layer should be stripped from the insulation layer. Stripping the semiconductive shield layer from the insulation shield layer is often very difficult. In a situation where the semiconductive shield layer contains carbon black, a carbon containing residue on the surface of the insulation shield often results . The carbon residue may disadvantageously promote treeing in the insulation layer which will ultimately lead to electrical breakdown of the cable. It is therefore advantageous and desirable for a semiconductive shield layer to have a low strip force (be easily separable) when being removed from the insulation layer and for the semiconductive shield layer to leave minimal amounts of carbon residue on the surface of the insulation shield. Strippable conductive shield compositions are those which can be separated from a crosslinked insulation layer without leaving appreciable amounts of residue on the insulation layer. Usually, the force required to separate a strippable conductive shield composition is significantly lower than the separation force required for bonded shield compositions. There is a significant cost difference between strippable and bonded semiconductive shield compositions based on existing technological approaches. It would be advantageous, to produce more cost effective strippable formulations than those developed from the technical approaches utilized to date. Summary of the Invention The present invention provides a composition comprising: 25-75%, by weight, based on the total weight of the composition, of an ethylene containing polymer; 24-74%, by weight, based on the total weight of the composition, of a treated filler material; and 1-10%, by weight, based on the total weight of the composition, of a crosslinking agent; wherein the treated filler material comprises 0.05-40%, by weight, based on the weight of the treated filler material, of a treating agent, and said treating agent is a polymer comprising acrylonitrile and at least one monomer selected from butadiene, isoprene, ethylene, propene. butene, hexene, octene, styrene. vinyl toluene, alpha methyl styrene, vinylidene chloride, vinyl chloride, acrylic acid, a C, - C alkyl ester of acrylic acid, methacrylic acid, or a Ct - C 8 alkyl ester of methacrylic acid; with acrylonitrile comprising 0.5-55%, by weight, based on the weight of the treating agent. Preferably the ethylene containing polymer is an ethylene vinyl acetate (EVA) polymer, ethylene propylene rubber (EPR) or ethylene propylene diene monomer (EPDM) More preferably, the ethylene containing polymer is an EVA polymer wherein the EVA polymer comprises 16-55%, by weight, based on the weight of the EVA polvmer of a vinyl acetate monomer A preferred treated filler material is a treated carbonaceous material, more preferably a treated carbon black A preferred treating agent compπses acrylonitrile and butadiene More preferably, the treating agent compπses an acrylonitrile butadiene, or a carboxylated acrylonitrile butadiene polymer containing 20-55%, by weight, based on the weight of the treating agent, of an acrylonitrile monomer Preferred crosslinking agents are an organic peroxide, such as dicumyl peroxide, sulfur, or a sulfur donor system A preferred composition of the present invention is semiconductive The present invention also includes an article of manufacture produced utilizing the composition of the present invention A preferred article of manufacture is cable insulation compπsing a semiconductive composition of the present invention bonded to an insulation layer, wherein the insulation layer preferably includes an ethylene homopolymer or copolymer An advantage of the compositions of the present invention which are semiconductive is that the semiconductive compositions may be utilized as strippable semiconductive shield compositions in wire and cable insulation applications Further details and advantages of the present invention are set forth in the following more detailed description Detailed Description of the Invention According to the present invention, a composition comprises 25-75%, by weight, based on the total weight of the composition, of an ethylene containing polymer, 24-74%, preferably 30-45%, by weight, based on the total weight of the composition, of a treated filler material, and 1-10%, preferably 1-6%, by weight, based on the total weight of the composition, of a crosslinking agent, wherein the treated filler material compπses 0 05-40%, preferably 0 5-20%, more preferably 4-15%, by weight, based on the weight of the treated filler material, of a treating agent, and said treating agent is a polymer comprising acrvlonitπle and at least one monomer selected from: butadiene, isoprene, ethylene, propene. butene, hexene, octene, styrene, vinyl toluene, alpha methyl styrene, vinylidene chloride, vinyl chloride, acrylic acid, a C| - C 8 alkyl ester of acrylic acid, methacrylic acid, or a C| - C R alkyl ester of methacrylic acid; with acrylonitrile comprising 0.5-55%, preferably 20-55%, more preferably 30-45%, by weight, based on the weight of the treating agent. The ethylene containing polymer of the composition of the present invention is preferably: an ethylene vinyl acetate (EVA) polymer, ethylene propylene rubber (EPR) or ethylene propylene diene monomer (EPDM). More preferably, the ethylene containing polymer is an EVA polymer wherein the EVA polymer comprises 16-55%, preferably 18- 45%, by weight, based on the weight of the EVA polymer of a vinyl acetate monomer. A preferred treated filler material is a treated carbonaceous material, more preferably a treated carbon black. A preferred treating agent comprises: acrylonitrile and butadiene. More preferably, the treating agent comprises an acrylonitrile butadiene, or carboxylated acrylonitrile butadiene polymer containing 20-55%, by weight, based on the weight of the treating agent, of an acrylonitrile monomer. Preferred crosslinking agents are an organic peroxide, such as dicumyl peroxide, sulfur, or a sulfur donor system. A preferred composition of the present invention is semiconductive. The composition of the present invention may include other conventional additives such as coagents, processing additives, hydrocarbon oils, stabilizers, accelerators, antioxidants, curing agents, vinyl silane and the like. Preferably the composition is curable. The compositions of the present invention may be produced in any manner known to the art for combining polymers and particulate components. A preferred method for producing the compositions of the present invention is compounding using a batch or continuous mixer such as a Banbury mixer, Twin Screw extruder or Buss kneader. The compositions of the present invention may be cured in manners conventional in the art. A treated filler material comprises a filler material and a treating agent. Suitable filler materials for use in the composition of the present invention include, but are not limited to, carbonaceous filler materials such as carbon black and graphite, and metal oxides such as silica. A preferred filler material for use in the present invention is a carbonaceous material, more preferably carbon black. The carbon black may be any carbon black such as a furnace carbon black, a thermal carbon black, an acetylene black, and a carbon black produced by a gasification process. While any carbon black may be utilized in the compositions of the present invention, preferably the carbon black component of the treated filler material has an iodine number (I 2 No.) of 10 to 1800 mg/g, preferably 18 to 250 mg/g, and a fluffy dibutyl phthalate absoφtion value (DBP) of 40 to 350 cc/lOOg, preferably 90 to 180 cc/lOOg. A preferred treated filler material is a carbon black treated with 0.05% to 40%, preferably 0.5% to 20%, and more preferably 4% to 15%, by weight, based on the weight of the treated carbon black, of a treating agent, wherein the treating agent comprises a polymer comprising acrylonitrile and at least one monomer selected from: butadiene, isoprene, ethylene, propene, butene, hexene, octene, styrene, vinyl toluene, alpha methyl styrene, vinylidene chloride, vinyl chloride, acrylic acid, a C C g alkyl ester of acrylic acid, methacrylic acid, or a C, - C 8 alkyl ester of methacrylic acid; with acrylonitrile comprising 0.5-55%, preferably 20-55%, more preferably 30-45%, by weight, based on the weight of the treating agent. A preferred treating agent comprises: acrylonitrile and butadiene. More preferably, the treating agent comprises an acrylonitrile butadiene or carboxylated acrylonitrile butadiene polymer containing 20-55%, more preferably 30- 45%, by weight, based on the weight of the treating agent, of an acrylonitrile monomer. A treated filler material suitable for use in the compositions of the present invention may be produced in any manner known in the art, such as by physically blending the components, melt mixing the components or combining the components while pelletizing the filler. The treated filler material may be produced, in dry form, by a conventional pelletizing process. For example, treated filler material for use in the compositions of the present invention may be produced by contacting a filler, e.g. a fluffy carbon black, in a pin pelletizer with an aqueous dispersion containing a treating agent to form wet pellets and then heating the wet pellets under controlled temperature and time parameters such that the water is removed from the pellets without the treating agent undergoing substantial decomposition. Pin pelletizers which may be utilized to produce a treated filler material for use in compositions of the present invention are known in the art and include the pin pelletizer described in U.S. Patent No. 3,528,785, the disclosure of which is hereby incoφorated by reference. U.S. Patent No. 3,528,785 also describes a conventional pelletizing process which may be utilized to produce a treated filler material for use in the compositions of the present invention. The present invention also includes an article of manufacture produced utilizing the composition of the present invention. A preferred article of manufacture is an extruded article, such as a profile, tube, tape or film. Also preferred as an article of manufacture of the present invention is a medium, or high, voltage cable comprising: a metal conductor core; a semiconductive shield; an insulation layer; and an outer semiconductive layer, wherein a semiconductive composition of the present invention is utilized in the semiconductive shield and/or the outer semiconductive layer. The articles of manufacture of the present invention may be produced using conventional techniques utilized by those of ordinary skill in the art. The effectiveness and advantages of various aspects and embodiments of the present invention will be further illustrated by the following examples wherein the following testing procedures were utilized. The following testing procedures were utilized in the determination and evaluation of the analytical properties of the carbon blacks utilized in the following examples. The DBP (dibutyl phthalate adsoφtion value) of the carbon blacks utilized in the examples, expressed as cubic centimeters DBP per 100 grams carbon black (cc/lOOg), was determined according to the procedure set forth in ASTM D2414. The Iodine number (I No.) of the carbon blacks utilized in the examples, expressed as milligrams per gram (mg/g), was determined according to ASTM test procedure DI S 10. The peel force was determined by producing a plaque of the composition utilizing a heated hydraulic press (temperature 130° C) to produce 1.2 millimeters (mm) thick plaque. A 2mm thick polyethylene plaque containing 1 % dicumyl peroxide was produced in a similar manner. The two plaques were laminated together under a pressure of 100 psi and exposed to a curing cycle of 180° C for 15 minutes. The resulting laminate was allowed to cool to ambient temperature under pressure. The strip force required to delaminate the composition layer from the polyethylene layer, at a peeling angle of 180° and a separation speed of 3.94 inches/minute was recorded as peel force. The error of the test is typically +/-0.1 lb/0.5 in. Examples Fourteen compositions, A-N, were produced utilizing two carbon blacks, CB I and CB2, as filler material. Carbon blacks CBI and CB2 had the properties set forth in Table 1 below. Table 1 Iodine No. Fluffy DBP Carbon Black mg/g cc/lOOg CBI 68 140 CB2 20 131 Compositions B, C, E, G, I, K, L, M and N were examples of compositions of the present invention and were produced utilizing a treated carbon black comprising carbon black and HYCAR® 1571 a carboxylated acrylonitrile butadiene latex polymer produced and sold by BF Goodrich, Akron, Ohio. Compositions A, D, F, H and J were control compositions produced utilizing untreated carbon black pellets. The treated carbon blacks utilized in compositions B,C, E, G, I, K, L, M and N, were produced by combining fluffy carbon black with HYCAR® 1571 a carboxylated acrylonitrile butadiene latex polymer and water, to form wet pellets, in a continuous pin pelletizer. The control carbon black pellets utilized in compositions A, D, F, H and J were produced in similar fashion except without addition of any treating agent. The resultant wet pellets were dried at a temperature which was sufficient to remove the water without causing decomposition of the polymer. In these experiments, drying temperatures in the range of 120° C to 180° C were found to be acceptable. The compositions were produced using a Banbury mixer by compounding the carbon black pellets with ELVAX EVA resins (manufactured and sold by DuPont, Wilmington, Deleware) to produce compositions comprising 40-42%, by weight, based on the weight of the composition, carbon black, 0.5%, by weight, based on the weight of the composition, AGERITE MA antioxidant (manufactured and sold by R.T. Vanderbilt Company Inc., Norwalk, Connecticut), 1.0%, by weight, based on the weight of the composition, VUL-CUP R peroxide curing agent (manufactured and sold by Hercules Inc., Wilmington, Delaware) with the remainder of the compositon being EVA resin and treating agent. The mixing temperature was maintained below 150° C to minimize premature cure of the compound. The peel force of each composition was then determined utilizing the procedure described above. The results are provided in Table 2 below Table 2 Treating Carbon Black ELVAX Comp¬ Carbon Agent Loading %, EVA Peel osition Black %, by by weight | Resin Force weight* Grade lb/0.5in A CBI 0 42 265 9.9 B CBI 1 42 265 7.5 C CBI 4 42 265 6.2 D CBI 0 45 265 7.7 E CBI 1 45 265 6.8 F CB I 0 40 170 3.6 G CBI 2 40 170 2.2 H CB I 0 40 40L03 2.8 I CBI 2 40 40L03 2.1 J CB2 0 40 40L03 2.9 K CB2 0.5 40 40L03 2.8 L CB2 1 40 40L03 2.8 M CB2 2 40 40L03 2.6 N CB2 4 40 40L03 2.3 * The treating agent %, by weight, based on the weight of the treated carbon black. t The carbon black loading %, by weight, based on the weight of the composition. Treating agent = HYCAR® 1571 acrylonitrile butadiene polymer latex These results show the reduced peel force of the compositions of the present invention (B, C, E, G, I, K, L, M and N) resulting from the use of the treated carbon blacks. This effect is noticeable for different levels of treating agent and in different EVA resins. It should be clearly understood that the forms of the present invention herein described are illustrative only and are not intended to limit the scope of the invention.

Claims: CLAIMS 1. A polymer composition comprising: 25-75%, by weight, based on the total weight of the composition, of an ethylene containing polymer; 24-74%, by weight, based on the total weight of the composition, of a treated filler material; and 1-10%, by weight, based on the total weight of the composition, of a crosslinking agent; wherein the treated filler material comprises 0.05-40%, by weight, based on the weight of the treated filler material, of a treating agent, and said treating agent is a polymer comprising acrylonitrile and at least one monomer selected from: butadiene, isoprene, ethylene, propene, butene, hexene, octene, styrene, vinyl toluene, alpha methyl styrene, vinylidene chloride, vinyl chloride, acrylic acid, a C - C 8 alkyl ester of acrylic acid, methacrylic acid, or a - C 8 alkyl ester of methacrylic acid; with acrylonitrile comprising 0.5-55%, by weight, based on the weight of the treating agent. 2. The composition of claim 1 wherein the ethylene containing polymer is selected from the group consisting of: an ethylene vinyl acetate (EVA) polymer, ethylene propylene rubber (EPR) and ethylene propylene diene monomer (EPDM). 3. The composition of claim 2 wherein the ethylene containing polymer is an EVA polymer wherein the EVA polymer comprises 16-55%, by weight, based on the weight of the EVA polymer of a vinyl acetate monomer. 4. The composition of claim 1 wherein the filler material is selected from the group consisting of: carbon black, graphite and metal oxides. 5. The composition of claim 4 wherein the filler material is carbon black. 6. The composition of claim 5 wherein the treating agent is a polymer selected from: acrylonitrile-butadiene and carboxylated acrylonitrile-butadiene. 7. The composition of claim 6 wherein the acrylonitrile monomer is present in an amount of 20-55%, by weight, based on the weight of the treating agent. 8. The composition of claim 1 wherein the crosslinking agent is selected from the group consisting of: an organic peroxide, sulfur, and a sulfur donor system. 9. The composition of claim 1 wherein the composition is is semiconductive. 10. The composition of claim 1 wherein the treated filler material is present in an amount of 30-45%, by weight, based on the total weight of the composition. 11. The composition of claim 1 wherein the amount of treating agent is 0.5-20%, by weight, based on the weight of the treated filler material. 12. The composition of claim 1 1 wherein the amount of treating agent is 4-15%, by weight, based on the weight of the treated filler material. 13. The composition of claim 1 wherein the crosslinking agent is present in an amount of 1-6%, by weight, based on the total weight of the composition. 14. The composition of claim 1 wherein the treating agent comprises 20-55%, by weight of acrylonitrile, based on the weight of the treating agent. 15. The composition of claim 1 wherein the treating agent comprises 30-45%, by weight of acrylonitrile, based on the weight of the treating agent. 16. The composition of claim 5 wherein the carbon black before treatment has an I 2 No. of 10-1800 mg g. 17. The composition of claim 16 wherein the carbon black before treatment has a DBP of 40-350 cc/100g. 18. The composition of claim 1 further comprising at least one component selected from the group consisting of: a coagent, a processing additive, a hydrocarbon oil, a stabilizer, an accelerator, an antioxidant, vinyl silane and a curing agent. 19. An article of manufacture formed from the composition of claim 1. 20. An article of manufacture formed from composition of claim 3. 21. The article of manufacture of claim 19 wherein the article is a cable. 22. The article of manufacture of claim 19 wherein the article is an extruded article selected from the group consisting of: a profile, a tube, a tape and a film. 23. The article of manufacture of claim 19 wherein the composition of claim 1 is a semiconductive composition and the article of manufacture is an electric cable comprising: a metal conductor core; a semiconductive shield; an insulation layer; and an outer semiconductive layer, wherein the composition of claim 1 is utilized in at least one of: the semiconductive shield or the outer semiconductive layer. 24. The article of manufacture of claim 23 wherein the composition of claim 1 is directly bonded to the insulation layer and the insulation layer comprises an ethylene homopolymer or copolymer.

Inventors: REED THOMAS F, WHITEHOUSE ROBERT S, REED, THOMAS, F., WHITEHOUSE, ROBERT, S.
Applicants: CABOT CORP, CABOT CORPORATION
Application year: 1996
Main classification: C08L23
IPC codes: C08K9, C08L9, C08L23, H01B3