Low hydrogen overvoltage cathode and process for production thereof

Abstract: A cathode of sufficiently low hydrogen over voltage is provided which is useful in electrolysis of water or of an aqueous alkali metal chloride solution such as sodium chloride solution. A process for producing the cathode is also provided. The low hydrogen overvoltage cathode comprises an electroconductive base material coated with an alloy layer containing nickel and molybdenum, the alloy layer containing the nickel at a content ranging from 35 to 90% by weight and the molybdenum at a content ranging from 10 to 65% by weight, and showing, in X-ray diffraction with CuKα line, a main peak at an angle ranging from 42 to 45° with a peak half-width ranging from 0.4 to 7°. One process for producing the low hydrogen overvoltage cathode of the present invention comprises plating an electroconductive base material by an arc discharge type ion plating method with a target containing nickel at a content ranging from 35 to 90% by weight and molybdenum at a content ranging from 10 to 65% by weight at a potential of the electroconductive base material ranging from -100 to 50 V with introduction of a gas containing at least one of hydrogen, carbon, nitrogen, and oxygen as a reaction gas. Another process for producing the low hydrogen overvoltage cathode of the present invention comprises co-electrodepositing nickel and molybdenum onto an electroconductive base material in a plating bath, the plating bath containing at least nickel ions, molybdate ions, and a complexing agent at an Mo/(Ni+Mo) ratio ranging from 5 to 20 mol% at a total concentration of nickel ions and the molybdate ions ranging from 0.1 to 0.5 mol/L in the plating bath kept at a pH ranging from 7 to 9.

Description: The present invention relates to a low hydrogen overvoltage cathode for electrolysis of water or aqueous alkali metal chloride such as sodium chloride, and also to a process for producing the low hydrogen overvoltage cathode. Description of the Related Art: Industrial electrolysis of water or an aqueous alkali metal chloride consumes a large amount of electric power, so that various energy saving techniques are being developed for the industrial electrolysis. The energy-saving technique means substantial decrease of electrolysis voltage including theoretical electrolysis voltage, solution resistance, diaphragm resistance, cathode overvoltage, and anode overvoltage. In particular, the overvoltages, which largely depend on the electrode material and the electrode surface state, attracted attention of many research scientists, and many developments have been made therefor. In the ion-exchange process for sodium chloride electrolysis, the decrease of anode overvoltage was noticed, and has been studied actively. Consequently, anodes have been completed which do not involve problems regarding the anode overvoltage, and are widely used industrially. On the other hand, many proposals have been presented regarding the low hydrogen overvoltage cathode, namely an active cathode which can have a hydrogen overvoltage lowered by 200-250 mV in comparison with a usual iron cathode exhibiting a hydrogen overvoltage of 400 mV. For example, a hydrogen absorbing alloy or a platinum group metal oxide is deposited on an electrode base material surface (Japanese Patent Laid-Open Publications 59-25940 and 6-146046); and a coating layer of an alloy of a transition metal such as iron, cobalt, and nickel, and tungsten or molybdenum is formed by plating on an electrode base material surface (Japanese Patent Publication 40-9130). However, the former electrode having a hydrogen absorbing alloy or a platinum group oxide deposited thereon uses an expensive material to result in a high production cost, whereas the latter electrode covered with an alloy can be produced at a low cost but is not sufficient in reducing the hydrogen overvoltage. Thus the both types of electrodes still involve problems. To improve the electrode plated with the alloy of iron, cobalt, or nickel, and molybdenum, a water-soluble polyamine is added in the alloy plating bath (Japanese Patent Laid-Open Publication 55-65376). However, this involves the disadvantages that the polyamine is soluble only in a narrow pH range to make difficult the control of the plating bath industrially, and the decrease of the hydrogen overvoltage is still insufficient. Most of the active cathodes having been disclosed so far are constituted of an electrode base material and a catalyst layer of a specific composition formed thereon to decrease the hydrogen overvoltage. The coating layer is formed in various ways. For example, the catalytic substance is electrically deposited by wet plating from a bath containing a dispersed active substance or containing a dissolved metal salt as disclosed in the aforementioned patents; a catalytic metal substance in a molten state is directly sprayed onto a base material (Japanese Patent Laid-Open Publication 61-41786); a metal salt solution is applied onto a base material, dried, and subjected to reduction or other treatment to form a catalytic substance layer (Japanese Patent Laid-Open Publication 61-295386); and so forth. However, in the former wet plating method disadvantageously, the alloy composition for coating is limited owing to the difference in electrodeposition potential. Further, the composition of the active substances or the metal components in the plating bath tends to change with the time of plating, requiring strict control of the bath to obtain stably a homogeneous alloy layer. On the other hand, in the latter two methods disadvantageously, alloy formation is difficult with elements having large difference in vapor pressure because of the required high-temperature treatment for coating, and an amorphous or fine crystalline structure of high performance can not readily be obtained because of enhanced crystallization in the high-temperature treatment. For avoiding the crystallization, a sputtering method is proposed (Japanese Patent Laid-Open Publication 7-268676). However, the sputtering method has still a problem that the film formation rate is low. Summary of the Invention: The inventors of the present invention made comprehensive studies to solve the above problems involved in the low hydrogen overvoltage cathode. Consequently, it has been found that a low hydrogen overvoltage can be attained by the cathode produced by an arc discharge type ion plating technique in which a target-constituting atoms are vaporized and ionized, and the resultant catalytic substance is deposited to coat a base material. It has also been found that a cathode covered with a substance of a composition and structure having low hydrogen overvoltage performance can be produced by a wet plating technique by controlling the composition and the pH of the plating bath without complicating the conventional plating system by a bath additive. An object of the present invention is to provide a low hydrogen overvoltage cathode for electrolysis of water or an alkali chloride such as sodium chloride. Another object of the present invention is to provide a process for producing the above cathode. The low hydrogen overvoltage cathode of the present invention comprises an electroconductive base material coated with an alloy layer containing nickel and molybdenum, the alloy layer containing the nickel at a content ranging from 35 to 90% by weight and the molybdenum at a content ranging from 10 to 65% by weight, and showing, in X-ray diffraction with CuKα line, a main peak at an angle ranging from 42 to 45° with a peak half-width ranging from 0.4 to 7°. The one process for producing the low hydrogen overvoltage cathode of the present invention comprises plating an electroconductive base material by an arc discharge type ion plating method with a target containing nickel at a content ranging from 35 to 90% by weight and molybdenum at a content ranging from 10 to 65% by weight at a potential of the electroconductive base material ranging from -100 to 50 V with introduction of a gas containing at least one of hydrogen, carbon, nitrogen, and oxygen as a reaction gas. The other process for producing the low hydrogen overvoltage cathode of the present invention comprises co-electrodepositing at least nickel and molybdenum onto an electroconductive base material in a plating bath, the plating bath containing nickel ions, molybdate ions, and a complexing agent at an Mo/(Ni+Mo) ratio ranging from 5 to 20 mol% at a total concentration of nickel ions and the molybdate ions ranging from 0.1 to 0.5 mol/L in the plating bath kept at a pH ranging from 7 to 9. The alloy layer preferably contains at least one of 4d transition metals, noble metals, and lanthanoid elements in an amount of from 0.1 to 10% by weight in addition to nickel and molybdenum. Brief Description of the Drawings: Fig. 1 shows an X-ray diffraction pattern of the alloy layer obtained in Example 3. Fig. 2 shows an X-ray diffraction pattern of the alloy layer obtained in Example 6. Fig. 3 shows an X-ray diffraction pattern of the alloy layer obtained in Comparative Example 2. Fig. 4 shows an X-ray diffraction pattern of the alloy layer obtained in Comparative Example 4. Fig. 5 shows an X-ray diffraction pattern of the alloy layer obtained in Example 13. Fig. 6 shows an X-ray diffraction pattern of the alloy layer obtained in Comparative Example 5. Fig. 7 shows an X-ray diffraction pattern of the alloy layer obtained in Comparative Example 11. Detailed Description of the Preferred Embodiment: The electroconductive base material to be coated with the alloy layer in the present invention includes nickel, iron, copper, titanium, stainless steel, and other metals which are resistant to caustic alkali. The shape of the electroconductive base material is not limited, and may be in a shape suitable for the cathode of the electrolytic cell: for example, in a shape of a flat plate, a curved plate, an expandable metal, a punched metal, a net, and a perforated panel. The electroconductive base material is preferably subjected to usual pretreatment such as degreasing, vacuum heating, and ion bombardment. For strengthening the adhesiveness between the base material and the alloy layer, effective is plating of the base material with a suitable nickel alloy on the base material, or deposition of electroconductive fine particles of carbon, a platinum group metal, or the like onto the base material to roughen the surface. The alloy layer has preferably a thickness in the range of from 5 to 500 µm, since a thinner alloy layer is not effective enough for reducing the hydrogen overvoltage and a thicker alloy layer is liable to come off. The processes for forming the alloy layer of the composition and constitution of the present invention are explained specifically. One process is arc discharge type ion plating (AIP), and another process is wet plating. Firstly the AIP technique is described. The target used for the AIP is prepared in the same manner as those in usual ion plating. The target-constituting elements are mixed physically by means of a ball mill or the like, and shaped by press molding by CIP (cold isostatic pressing), HIP (hot isostatic pressing), or a like method. The method for preparation of the target is not limited thereto, provided that the target-constituting element can be mixed uniformly and finely. The elements are not necessarily required to be alloyed in the prepared target. In the AIP technique, the composition of the coating alloy is nearly the same as the composition of the target in principle, so that the coating composition can be controlled as desired by controlling the composition of the target. Nickel and molybdenum having vapor pressures greatly different from each other cannot readily be formed in a form of a coating alloy layer by thermal spraying conducted at a higher temperature. However, such elements different greatly in vapor pressure and not suitable for thermal spraying can readily be alloyed according to the process of the present invention by vaporizing the target atoms at a relatively low temperature by arc discharge. The alloy layer thickness can be controlled readily by the time of layer formation. The nickel-molybdenum alloy layer is formed at a rate of several micrometres for 10 minutes. This rate of the alloy layer formation can be raised by using plural targets simultaneously. Thus, a thick alloy layer can readily be formed in comparison with other ion plating technique or a sputtering technique. By the AIP technique, the alloy layer having the composition and constitution of the present invention is obtained by controlling the target composition and the layer forming conditions. Specifically, a target is employed which contains nickel at a content of from 35 to 90% by weight and molybdenum at a content of from 10 to 65% by weight, and the layer formation is conducted by applying a potential of from -100 to 50 V to a base material. In the case where at least one of 4d transition metals, noble metals, and lanthanoid elements is to be incorporated into the alloy layer, a target is preferably used which contains the intended element other than nickel and molybdenum in an amount of from 0.1 to 10% by weight in addition to nickel and molybdenum. The layer formation is conducted with introduction of a reaction gas containing at least one of hydrogen, carbon, nitrogen, and oxygen. The hydrogen-containing gas is a gas containing hydrogen atoms as a gas component, including H 2 , and H 2 O. The carbon-containing gas includes CH 4 , and C 2 H 8 . The nitrogen-containing gas includes N 2 , and NH 3 . The oxygen-containing gas includes O 2 , and CO. The reaction gas is not limited to those mentioned here. By the arc discharge type ion plating under the aforementioned conditions, a low hydrogen overvoltage cathode can be produced which comprises an electroconductive base material coated with an alloy layer containing nickel and molybdenum at a nickel content of from 35 to 90% by weight and at a molybdenum content of from 10 to 65% by weight, and showing, in X-ray diffraction with CuKα line, a main peak at an angle ranging from 42 to 45° with a half-width ranging from 0.4 to 7°. The potential applied to the base material is more preferably in the range of from -60 to 30 V. In the ion plating, the target-constituting atoms are ionized and deposited onto the base material to cover it. At the potential of the base material outside the claimed potential range of the present invention, the kinetic energy of the coating ions is excessively large to cause significant temperature rise of the base material by collision of the ions against the base material, making impracticable the formation of the coating layer of the crystal structure set forth in the claims. Further, at the larger absolute value of the potential of the base material, the layer composition deviates greatly from the target composition to make impracticable the formation of the intended composition of the alloy layer. Next, the wet plating technique is explained below. In the wet plating technique, the counter electrode for the plating is not specially limited, and a soluble electrode such as a nickel plate, and an insoluble electrode such as a platinum plate and a Ti Plate plated by Pt may be used as the counter electrode. For producing the alloy layer of the composition and structure of the present invention, the plating bath composition for the wet plating is controlled to be within the specified concentration range. Specifically, the plating bath is controlled to contain nickel ions, molybdate ions, and a complexing agent at a Mo/(Ni+Mo) ratio ranging from 5 to 20 mol% at a total concentration of nickel ions and the molybdate ions ranging from 0.1 to 0.5 mol/L. The sources of nickel and molybdenum are not specially limited. The nickel source includes nickel salts such as nickel sulfate, nickel chloride, and mixtures thereof. The molybdenum source includes sodium molybdate, potassium molybdate, and ammonium molybdate. The complexing agent is not specially limited, and may be any complexing agent which can readily form a complex with a nickel ion. The complexing agent includes citric acid, tartaric acid, and pyrophosphoric acid. The amount of the complexing agent is not specially limited, usually being used in an amount of from 0.1 to 2 moles per mole of the total of the nickel ions and the molybdate ions in the plating bath. The pH of the plating bath should be controlled to be within the specified range in order to produce the alloy layer of the composition and structure of the present invention. Specifically, the pH is controlled to be in the range of from 7 to 9. The chemicals for adjusting the pH is not limited, and includes inorganic acids such as sulfuric acid and hydrochloric acid, and inorganic bases such as sodium hydroxide and aqueous ammonia. The composition and structure of the alloy layer in the present invention depend also on the plating bath temperature and the plating current density. These are controlled by selecting the usual conditions as shown in Examples in Japanese Patent Publication 40-9130, Japanese Patent Laid-Open Publication 55-65376, and so forth. The plating bath temperature is selected in the range of from 20 to 70°C. At a lower temperature, the plating efficiency will be lower, and the process is uneconomical, whereas at a higher temperature, the resulting alloy coating layer becomes brittle disadvantageously. The plating current density is preferably in the range of from 2 to 20 A/dm 2 . At a lower plating current density, the molybdenum content of the alloy layer will be lower than the specified content range of the present invention, which causes high cathode overvoltage, whereas at the higher current density, the plating efficiency is lower, and the process is uneconomical. In the wet plating, the intended performance of the alloy layer can be obtained by keeping the above conditions, independently of a third component added for increase of the surface layer present in the plating bath and incorporated into the alloy layer. The alloy layer coating the surface of the electroconductive base material in the present invention should comprise at least nickel and molybdenum and show a peak of the X-ray diffraction pattern with a half-width ranging from 0.4 to 7°. To achieve the half-width, the temperature during and after the formation of the alloy layer is very important. If the alloy layer is treated at a high temperature above 150°C, the crystallinity of the alloy becomes higher and the half-width deviates from the above specified value. For example, a nickel-molybdenum cathode, which is produced by flame spraying as described in Japanese Patent Laid-Open Publication 55-100988 is treated inevitably at a high temperature, producing an alloy layer having the diffraction peak half-width outside the specified value range of the present invention. Like this, a heat treatment at a temperature higher than 150°C during or after the alloy layer production prevents formation of crystal structure having the peak of the specified half-width of the present invention or destroys the crystal structure to result in an electrode giving a significantly high cathode overvoltage. Therefore, heat treatment after the plating is undesirable. In particular, heat treatment at 150°C or a higher temperature sharpen the X-ray diffraction peak, and causes formation of a molybdenum single crystal or an intermetallic compound crystal of nickel and molybdenum to change the crystal structure, leading to remarkably high cathode over voltage. The composition of the coating alloy layer is preferably in the range of the nickel content of from 40 to 85% by weight and the molybdenum content of from 15 to 60 % by weight, more preferably the nickel content of from 45 to 80% by weight and the molybdenum content of from 20 to 55 % by weight in the present invention. At a content of nickel or molybdenum outside the claimed range, the region of simple nickel or simple molybdenum becomes larger to prevent nickel-molybdenum alloy formation, resulting in remarkable rise of the overvoltage. Even at the content of nickel and molybdenum within the claimed range, the alloy having the X-ray diffraction peak outside the claimed peak position range or the claimed half-width range is different in crystal structure from that showing the low hydrogen overvoltage, and results in high overvoltage. The hydrogen overvoltage is further lowered advantageously by incorporating at least one of 4d transition metals, noble metals, and lanthanoid elements in an amount of from 0.1 to 10% by weight into the nickel-molybdenum coating layer. The present invention is described more specifically by reference to Examples without limiting the invention in any way. Examples 1-7 Samples of Examples 1-7 were prepared by arc discharge type ion plating by use of a target composed of 60% by weight of nickel and 40% by weight of molybdenum (50 atom% Ni, and 50 atom% Mo) onto a nickel plate as a base material (40 × 50 mm 2 ) having the surface degreased and cleaned. The arc type ion plating was conducted by means of the ion plating apparatus SIA-400T (manufactured by Showa Shinku K.K.) at a vacuum of 1×10 -3 Torr at an arc current of 100 A for 50 minutes to form a coating layer. Thereby, an electrode was prepared which has an Ni-Mo alloy coating layer of about 20-30 µm thick on the base material. The layer formation conditions are shown in Table 1, and the properties of the coating layers are shown in Table 2. The alloy composition of the coating layer was determined by an X-ray microanalyzer, and is shown by a calculation on the basis of Ni concentration + Mo concentration = 100. The position of the main peak and the half-width were derived from CuKα X-ray diffraction pattern. The hydrogen overvoltage was measured by a current interrupter method at 90°C in 32.5% sodium hydroxide solution at a current density of 40 A/dm 2 . Fig. 1 and Fig. 2 show respectively the X-ray diffraction pattern of the coating layer obtained in Example 3 and Example 6. Comparative Example 1-2 Coating layers were formed in the same manner as in Example 1 except that the potential of the base material was set at -300 V. The layer formation conditions and the layer properties are shown respectively in Table 1 and Table 2. The resulting coating layers had the half-width outside the claimed range, showing the overvoltages of as high as about 280-320 mV. Fig. 3 shows the X-ray diffraction pattern of the coating layer obtained in Comparative Example 2. Examples 8-10 Samples of Examples 8-10 were prepared by arc discharge type ion plating by use of a target composed of 60% by weight of nickel and 40% by weight of molybdenum, or a target containing further 5% by weight of silver or lanthanum in addition to nickel and molybdenum. The layer formation conditions are shown in Table 3, and the properties of the resulting coating layers are shown in Table 4. Examples 11-14 Coating films were formed by use of four kinds of targets having compositions of 10-65% by weight of molybdenum and the balance of nickel under a vacuum of 1×10 -3 Torr at an arc current of 100 A for 50 minutes under the conditions shown in Table 5. The properties of the formed coating layers are shown in Table 6. Comparative Examples 3-4 In Comparative Examples 3 and 4, targets employed had a composition of 95% by weight of nickel and 5% by weight of molybdenum, or 25% by weight of nickel and 75% by weight of molybdenum. The coating layers were formed in the same manner as in Example 11. The layer formation conditions are shown in Table 5, and the properties of the coating layers are shown in Table 6. In Comparative Example 3, the overvoltage was high owing to the contents of nickel and molybdenum outside the claimed ranges. In Comparative Example 4, the overvoltage was high owing to the contents of nickel and molybdenum, and the peak position outside the claimed ranges. Fig. 4 shows the X-ray diffraction pattern of the coating layer obtained in Comparative Example 4. Example 15 A plating bath was prepared which contained 0.228 mol/L of nickel sulfate (hexahydrate), 0.012 mol/L of sodium molybdate (dihydrate), and 0.344 mol/L of trisodium citrate (dihydrate). The pH of the bath was adjusted to 8.0 by addition of aqueous 28% ammonia. The electrode base material was a nickel disc plate (electrode area of 78.5 mm 2 ) having been degreased with alcohol and etched by nitric acid. The counter electrode was a nickel plate. The plating was conducted at a bath temperature controlled at 50°C at a current density of 5 A/dm 2 for 24 minutes to prepare an electrode having a nickel-molybdenum alloy deposited on the electrode base material. As the results of measurement by an X-ray microanalyzer, the alloy layer contained molybdenum at a concentration of 39.0% by weight. The main peak of CuKα X-ray diffraction of the alloy layer was positioned at an angle of 43.7°, and the half-width thereof was 5.3°. The hydrogen overvoltage was measured with this electrode in a 32.5% sodium hydroxide solution at 90°C, and was found to be 108 mV at a current density of 40 A/dm 2 . Examples 16-22 and Comparative Examples 5-13 The experiments were conducted in the same manner as in Example 15 regarding the nickel source, the molybdenum source, the complexing agent, the electrode base material, the pretreatment of the electrode base material, the counter electrode, the measurement method of molybdenum concentration in the alloy layer, the measurement method of X-ray diffraction, and the hydrogen overvoltage measurement conditions. In Examples 16-17 and Comparative Examples 5-6, the alloy layers were prepared by changing the molar ratio, Mo/(Ni+Mo), in the plating bath. Table 7 shows the molybdenum concentrations, the main peak positions and the peak half-widths of the alloy layers, and the hydrogen overvoltage of the resulting electrodes. In Table 7, the hydrogen overvoltage was higher in Comparative Examples 5 and 6 owing to the Mo/(Mo+Ni) molar ratio outside the claimed range of the present invention. Similarly, in Examples 18-19 and Comparative Examples 7-8, coating layers were formed on the electrode base material by changing the total concentration of nickel and molybdenum in the plating bath. Table 8 shows the molybdenum concentrations, the main peak positions, the peak half-widths, and the hydrogen overvoltages of the resulting alloy layers. In Examples 20-22 and Comparative Examples 9-10, coating layers were formed on the electrode base material by changing the pH of the plating bath. Table. 9 shows the molybdenum concentrations, the main peak positions, the peak half-widths, and the hydrogen overvoltages of the resulting alloy layers. As shown in Table 8, the hydrogen overvoltage was higher in Comparative Examples 7 and 8 owing to the total concentration of nickel and molybdenum outside the claimed range, and as shown in Table 9, the hydrogen overvoltage is higher in Comparative Examples 9-10 owing to the pH of the plating bath outside the claimed range of the present invention. Separately, coating alloy layers were formed, and were heat-treated in the air at 150°C for one hour. Table 10 shows the positions and half-widths of the main peaks and the crystal structures of the alloy layers identified by X-ray diffraction, and hydrogen overvoltages of the electrodes. Table 10 shows that the heat treatment at 150°C narrowed the peak half-width and gave rise to a new diffraction peak of an intermetallic compound of Ni 4 Mo, and caused rise of the overvoltage. Figs. 5, 6, and 7 show respectively the X-ray diffraction pattern of the alloy layer of Example 16, Comparative Example 5, or Comparative Example 11. It has been shown that the active cathode produced according to the present invention exhibits an overvoltage of as low as 110-150 mV in electrolysis under conditions of 90°C and current density of 40 A/dm 2 in a 32.5% sodium hydroxide solution, and has excellent cathode properties. Such cathode performance is achieved by an electrode comprising an electroconductive base material coated with an alloy layer containing at least nickel and molybdenum, the alloy layer being produced by controlling the production conditions to contain molybdenum at a content ranging from 10 to 65% by weight, and to show only a peak in X-ray diffraction with CuKα line at an angle ranging from 42 to 45° with a peak half-width ranging from 0.4 to 7°. The cathode of the present invention saves the electric power consumption in electrolysis of an aqueous alkali metal chloride solution to contribute greatly energy saving in chlorine-alkali industries. A cathode of sufficiently low hydrogen over voltage is provided which is useful in electrolysis of water or of an aqueous alkali metal chloride solution such as sodium chloride solution. A process for producing the cathode is also provided. The low hydrogen overvoltage cathode comprises an electroconductive base material coated with an alloy layer containing nickel and molybdenum, the alloy layer containing the nickel at a content ranging from 35 to 90% by weight and the molybdenum at a content ranging from 10 to 65% by weight, and showing, in X-ray diffraction with CuKα line, a main peak at an angle ranging from 42 to 45° with a peak half-width ranging from 0.4 to 7°. One process for producing the low hydrogen overvoltage cathode of the present invention comprises plating an electroconductive base material by an arc discharge type ion plating method with a target containing nickel at a content ranging from 35 to 90% by weight and molybdenum at a content ranging from 10 to 65% by weight at a potential of the electroconductive base material ranging from -100 to 50 V with introduction of a gas containing at least one of hydrogen, carbon, nitrogen, and oxygen as a reaction gas. Another process for producing the low hydrogen overvoltage cathode of the present invention comprises co-electrodepositing nickel and molybdenum onto an electroconductive base material in a plating bath, the plating bath containing at least nickel ions, molybdate ions, and a complexing agent at an Mo/(Ni+Mo) ratio ranging from 5 to 20 mol% at a total concentration of nickel ions and the molybdate ions ranging from 0.1 to 0.5 mol/L in the plating bath kept at a pH ranging from 7 to 9.

Claims: A low hydrogen overvoltage cathode comprising an electroconductive base material coated with an alloy layer containing nickel and molybdenum, the alloy layer containing the nickel at a content ranging from 35 to 90% by weight and the molybdenum at a content ranging from 10 to 65% by weight, and showing, in X-ray diffraction with CuKα line, a main peak at an angle ranging from 42 to 45° with a peak half-width ranging from 0.4 to 7°. The low hydrogen overvoltage cathode according to claim 1, wherein the alloy layer contains at least one of 4d transition metals, noble metals, and lanthanoid elements at a content ranging from 0.1 to 10% by weight. A process for producing the low hydrogen overvoltage cathode of claims 1 and 2 comprising plating an electroconductive base material by an arc discharge type ion plating method with a target containing nickel at a content ranging from 35 to 90% by weight and molybdenum at a content ranging from 10 to 65% by weight, or in addition to nickel and molybdenum at least one of 4d transition metals, noble metals, and lanthanoid elements at a content ranging from 0.1 to 10% by weight at a potential of the electroconductive base material ranging from -100 to 50 V with introduction of a gas containing at least one of hydrogen, carbon, nitrogen, and oxygen as a reaction gas. A process for producing the low hydrogen overvoltage cathode of claims 1 and 2 comprising co-electrodepositing at least nickel and molybdenum onto an electroconductive base material in a plating bath, the plating bath containing nickel ions, molybdate ions, and a complexing agent at an Mo/(Ni+Mo) ratio ranging from 5 to 20 mol% at a total concentration of nickel ions and the molybdate ions ranging from 0.1 to 0.5 mol/L in the plating bath kept at a pH ranging from 7 to 9. The low hydrogen overvoltage cathode according to claim 1 or 2, produced by plating an electroconductive base material by an arc discharge type ion plating method with a target containing nickel at a content ranging from 35 to 90% by weight and molybdenum at a content ranging from 10 to 65% by weight, or in addition to nickel and molybdenum at least one of 4d transition metals, noble metals, and lanthanoid elements at a content ranging from 0.1 to 10% by weight at a potential of the electroconductive base material ranging from -100 to 50 V with introduction of a gas containing at least one of hydrogen, carbon, nitrogen, and oxygen as a reaction gas.

Inventors: HORIKOSHI HIDEHARU, SAKAKI TAKASHI, SUETSUGU KAZUMASA, YOSHIMITSU KANJI, HORIKOSHI, HIDEHARU, SAKAKI, TAKASHI, SUETSUGU, KAZUMASA, YOSHIMITSU, KANJI
Applicants: TOSOH CORP, TOSOH CORPORATION
Application year: 1996
Main classification: C25B11
IPC codes: C25B11