Information storage apparatus and information processing method using the same and connector pin assembly

Abstract: The invention relates to a method of accessing information stored in a non-volatile semiconductor memory (13) of an information storage card (11) using an interfacing holder (21) and an information processing host device, the method comprising the steps of: inserting the information storage card (11) into the interfacing holder (21); inserting the interfacing holder (21) into the information processing host device; and detecting a presence or absence of a conductive state designating member (16) on a designating area (15) of the information storage card (11) to inhibit or allow writing of information to the non-volatile semiconductor memory (13) of the information storage card (11).

Description: The present invention relates generally to an information storage apparatus for sharing data among electronic devices such as information processing devices and an information processing apparatus using the information storage apparatus, and more particularly to a write prohibit mechanism for protecting internal data in an external storage apparatus. More specifically, the invention relates to an information storage apparatus and an information processing apparatus incorporating such an information storage apparatus as well as a method for accessing information in such an apparatus and a connector pin assembly. An information storage apparatus and information processing apparatus is known from Patent Abstracts of Japan, vol. 013 No. 261(P885), 16 June, 1989 & JP 01 055691 A. Here, a state indicating means is provided as part of a support member in form of a housing of the information storage apparatus. The state indicating means comprises a terminal provided on the surface of the support member and having a ground potential to function as write protection. Another part of the state-indicating means is an insulating seal which can be attached over the terminal. When the insulating seal is attached a data writing is prohibited. Alternatively, the complete support member can have ground potential and the data write protection can be realized by adhering the insulating seal at a specific position on the surface of the support member. GB 2 208 029 A discloses an information storage apparatus including a copy protection. The information storage apparatus is a disc-like memory. The specific area of a housing is covered by a conductive film by means of a metal evaporation for example. Within this area throughholes are provided, in particular throughholes which correspond to letters of the alphabet. A processing device has a plurality of electrodes and projections and a read-out from the information storage apparatus is only enabled if the projections suitably fit into the throughholes such that the electrodes can make contact to the conductive film. That is, if the projections are correspondingly arranged to the arrangement pattern of the throughholes then the electrodes can make contact and read-out is enabled. In a conventional method of sharing data among information processing devices, an attachable/detachable external storage apparatus in which data can be written is generally used. This type of external storage apparatus is normally provided with a write prohibit mechanism for protecting precious internal storage data from being erroneously erased. In a typical write prohibit mechanism, for example, as used in a magnetic tape or a floppy disk, the shape of a portion of a casing of the external storage apparatus is made changeable and the change in shape is optically or mechanically detected on the information processing device side. Figs. 5A and 5B illustrate an example of the conventional write prohibit mechanism which is employed, for example, in a 3.5 inch floppy disk. A floppy disk 1 has, in proper places, a sliding shutter 2 for data write/read, a bearing unit 3 for rotating a built-in magnetic disk, a label attachment section 4 on which a label indicating a title, etc. is attached, and a write protect tab 5. As is shown in FIGS. 5A and 5B, the write protect tab 5 comprises a slider 5a and an opening window 5b which is closed and opened in accordance the movement of the slider 5a. Specifically, in the write prohibit mechanism using the write protect tab 5, the two shapes of the window 5b, i.e. the open shape and closed shape, which is determined by the movement of the slider 5a, are detected by means of a contact switch, etc. Thus, the write permit state and the write prohibit state can be discriminated on the information processing device side. In another data write prohibit mechanism, an electric write path is cut off by a microswitch, as in a memory card in which data write is electrically effected. In the write prohibit mechanisms, a change in physical shape is made mechanically. Therefore, there is an advantage in that the write permit state or write prohibit state can be recognized by the eye. In each mechanism, however, the external storage apparatus needs to have certain dimensions and thickness. On the other hand, there is a method in which a write prohibit state is stored as internal data in an external storage apparatus. Advantageously, this method can be applied to any type of external storage apparatus, irrespective of the size and thickness thereof. In this method, however, the write permit state or write prohibit state cannot be recognized until the external storage apparatus is mounted in an information processing device and actually operated. US-A-5 375 037 discloses to insert an information storage card (18) into an interfacing holder (10) and to insert the interfacing holder (10) into an information processing host device (22). PATENT ABSTRACTS OF JAPAN vol. 013, no. 261 (P-885), 16 June 1989 (1989-06-16) -& JP 01 055691 A (MATSUSHITA ELECTRIC IND CO LTD), 2 March 1989 (1989-03-02) discloses the detection of a presence or absence of a conductive state indicating member (4) to inhibit or allow writing to the memory (3) on a memory card (1). As has been described above, in the prior art, the external storage apparatus needs to have certain dimensions and thickness in order that one can recognize the write prohibit state. The aim of the invention is to provide a small and thin information storage apparatus permitting one to visually recognize the write prohibit state thereof and making it possible to realize a write prohibit mechanism at low cost and an information processing apparatus using this information storage apparatus. Thus, the object of the invention is to provide a small and thin information processing apparatus, a method and a connector pin assembly, permitting one to visually recognize the write protect state thereof and making it possible to realize a write prohibit mechanism at low cost. This object is solved by a method for accessing information according to claim 1. Furthermore, this object is solved by an information processing apparatus according to claim 5. Further advantageous embodiments and improvements of the invention can be taken from the dependent claims. In this invention, by virtue of the above-described structures, the write prohibit state can be discriminated an the basis of the change in electrical state and can also be recognized visually, even with use of a small and thin information storage apparatus. This invention can be more fully understood from the following detailed description when taken in conjunction with the accompanying drawings, in which: Fig. 1A schematically shows a plan pattern of a memory module according to an embodiment of the invention; Fig. 1B is a cross-sectional view taken along line IB-IB in Fig. 1A; Fig. 2A is a perspective view of the sealed surface side of a semiconductor memory package built in a memory module; Fig. 2B is a perspective view of the terminal surface side of the memory package shown in Fig. 2A; Fig. 2C is a cross-sectional view taken along line IIC-IIC in Fig. 2A; Fig. 3 illustrates a case where a memory module is inserted in a card-shaped holder prepared separately from an electronic device and the holder is mounted in the electronic device; Fig. 4 is a cross-sectional view schematically showing the structure of a main part of the card-shaped holder; and Figs. 5A and 5B are schematic plan views of a floppy disk, for describing prior art and problems thereof. An embodiment of the present invention will now be described with reference to the accompanying drawings. Figs. 1A and 1B schematically show the structure of a memory module 11 of the present invention. Fig. 1A is a plan view of the memory module 11, and Fig. 1B is a cross-sectional view taken along line IB-IB in Fig. 1A. The memory module 11 is used as an external storage apparatus such as a floppy disk. A semiconductor memory package 13 (described later in detail) serving as storage medium is mounted in a small card-shaped support member 12 formed of, e.g, plastic material. The support member 12 has a label attachment section 14 on which an indication label for indicating an index of data stored in the semiconductor memory package 13, and a seal attachment section 15 on which a conductive seal serving as means for prohibiting inadvertent data write in the semiconductor memory package 13. The size of the support member 12 is, for example, 37 mm x 45 mm (less than half the size specified in IS07813) and the thickness thereof is 0.76 mm ± 0.08 mm specified in IS07813. In the present embodiment, the size of the memory module 11 is set to be less than half the size specified in IS07813 so that it can be used as floppy disk. One corner of the support member 12, for example, one corner of a side to be inserted into a drive apparatus, is cut out. Thereby, reverse insertion into the drive apparatus is prevented. The cut-out portion serves not only as means for preventing reverse insertion but also as limiting the use of the memory module 11. For example, if the semiconductor memory package 13 operable at 5 V and the semiconductor memory package 13 operable at 3.3 V are prepared, the former alone may be provided with the cut-out corner portion. Thus, the insertion of the memory package 13 operable at 3.3 V into the drive apparatus can be prevented, and the memory chip within the memory module 11 can be protected against electric destruction due to a variation in power voltage. The label attachment section 14 has a recess with a depth corresponding to the thickness of a label to be attached. The label attachment section 14 extends from the upper surface to the lower surface so as to cover one side edge of the support member 12. The seal attachment section 15 has a circular recess with a diameter of, e.g. 10 mm. The seal attachment section 15 indicates an attachment position of a conductive seal and prevents the conductive seal from projecting upwards from the upper surface of the support member 12, thereby maintaining the flatness of the surface of the memory module 11. Thus, when the memory module 11 is pulled out from or inserted into the drive apparatus, the seal is prevented from being peeled off or scratched. The conductive seal functions as write protector for constituting a write prohibit mechanism. The conductive seal is formed inexpensively, for example, by coating an adhesive on one surface of paper sheet and coating a conductive material such as aluminum on the other surface thereof. The conductive seal has a circular shape with a diameter of, e.g. 8 mm so that it can be attached within the seal attachment section 15 on the support member 12. Specifically, the conductive seal is attached on the seal attachment section 15 on the support member 12, thereby visually indicating that data write in the semiconductor memory package 13 is prohibited. In addition, the write prohibit mechanism is easily achieved since the data write prohibit state can be automatically recognized on the basis of the conductive state effected by the conductive seal. Figs. 2A to 2C schematically show the structure of the semiconductor memory package 13. Fig. 2A is a perspective view of the sealed surface side of the package 13, Fig. 2B is a perspective view of the terminal surface side of the package, and Fig. 2C is a cross-sectional view taken along line IIC-IIC in Fig. 2A. The semiconductor memory package 13 is constituted such that a 16 Mbit NAND type flash EEPROM chip 13b functioning as storage medium or non-volatile semiconductor memory device is mounted on a resin-based substrate 13a. Input/output terminals (not shown) of the chip 13b are connected to wiring on a major surface of the substrate 13a by means of bonding wires 13c. The chip 13b, as well as the bonding regions, is resin-sealed by a sealing resin 13d by a one-side transfer mold method. The wiring on the major surface of the resin-based substrate 13a is exposed to the non-sealed side (bottom side) of the substrate 13a via through-holes and led out as flat external connection terminals 13e. In the present embodiment, the semiconductor memory package 13 has a size of 16.62 mm x 27.59 mm on the terminal surface side, which is less than half the area of the support member 12 in its longitudinal direction. The memory package 13 is attached to the support member 12 such that the supper surfaces of the external connection terminals 13e are substantially flush with the surface of the support member 12 on which the seal attachment section 15, etc. are formed. When the memory module 11 having the above structure is used as external storage apparatus such as a floppy disk, a drive apparatus such as a floppy disk drive is needed. Fig. 3 illustrates a case where the memory module 11 is mounted in a mounting unit of an electronic device such as an information processing device, by using a drive apparatus prepared separately from the electronic device. For example, when the memory module 11 is used as floppy disk, the memory module 11 is first inserted into a card-shaped holder 21, and the card-shaped holder 21 is then mounted in the mounting unit of the electronic device. The card holder 21 has a size specified, for example, in PCMCIA (e.g. type 11), has an input/output interface and incorporates a memory controller (not shown) functioning as drive apparatus for writing and reading data. Fig. 4 schematically shows the structure of a main part of the card-shaped holder 21. Specifically, the holder 21 has a connector unit 22. A connector pin holder section 23 is provided inside the connector unit 22 in which the memory module 11 is mounted. The connector pin holder section 23 is provided with a plurality of connector pins 24 to be put in contact with the external connection terminals 13e of the semiconductor memory package 13, and connector pins 25 to be put in contact with the seal attachment section an the support member 12. The connector pins 24 are connected to the memory controller incorporated in the card-shaped holder 21. Although Fig. 4 shows only one connector pin 25, the number of connector pins 25 is at least two and the two connector pins 25 are arranged at a distance of 1 mm or more from each other. The connector pins 25 are connected to a discriminating circuit (not shown) provided within the electronic device or card-shaped holder 21. The discriminating circuit discriminates the data write permit state and the data write prohibit state on the basis of the conductive state and non-conductive state between the connector pins 25. For example, when the conductive seal 16 is not attached to the memory module 11, the connector pins 25 are put in contact with a non-conductive part (seal attachment section 15) on the support member 12. In this case, since the support member 12 has no electrical conductivity, electrical conduction between the connector pins 25 is not effected. Thus, the write permit state is discriminated by the discriminating circuit. On the other hand, when the conductive seal 16 is attached to the memory module 11, the connector pins 25 are put in contact with the conductive seal 16. Since the conductive seal 16 is electrically conductive, electrical conduction between the connector pins 25 is effected by the conductive seal 16. Thus, the write prohibit state is discriminated by the discriminating circuit. As has been described above, the memory module 11 is set in the write prohibit state by attaching the conductive seal 16 to the seal attachment section 15 on the support member 12. If the conductive seal 16 is attached, the user can visually recognize the write prohibit state of the memory module 11. In addition, if the memory module 11 is mounted in the card-shaped holder 21, electrical conduction is effected between the connector pins 25 and the memory controller can also recognize the write prohibit state of the module 11. According to the present embodiment, the write prohibit state can be discriminated on the basis of the change in electrical state, and also the write prohibit state can be visually recognized. Specifically, when the memory module is set in the write prohibit state, the conductive seal is attached to a predetermined position. Thereby, the write prohibit state is visually indicated and electrically detected. According to this embodiment, therefore, the write prohibit state can fully be recognized and detected with use of a small, thin memory module, as compared to a conventional large, thick memory module in which the write prohibit state is set by making use of the change in shape thereof. In other words, even if the memory module is small and thin, the write prohibit state can be visually recognized and electrically detected. In the present method in which the write prohibit state is set by attaching the conductive seal, the memory module can easily be restored to the write permit state from the write prohibit state by removing the conductive seal. Therefore, as compared to a conventional method in which a hole is formed in the module, the memory module can be more easily restored from the write prohibit state to the write permit state and the strength of the memory module is not degraded. In addition, according to the present method in which the data write prohibit state is discriminated on the basis of the presence/absence of the conductive seal, the write prohibit mechanism is realized at lower cost, than in the conventional method in which the write prohibit state is set by making use of the change in shape. The above embodiment is directed to a case where the write prohibit state is set by attaching the conductive seal to the non-conductive memory module. The present invention, however, is applicable to a case where the write permit state is set by attaching a conductive seal. In the present method, the conductive state obtained by attaching the conductive seal can be associated with either the write prohibit state or the write permit state, depending on whether the conductive state effected between the connector pins 25 by the attachment of the conductive seal is associated with the write prohibit state or with the write permit state. Suppose that the attachment of the conductive seal is associated with the write-prohibit state. In this case, if defective contact occurs between the conductive seal and the connector pins due to some cause, the write permit state is erroneously recognized and necessary data would be erased. On the other hand, if the attachment of the conductive seal is associated with the write permit state, the seal needs to be attached prior to the write operation. The frequency of actual use of the memory module in the write permit state is much higher than that in the write prohibit state. Consequently, the seal is worn earlier and the reliability of the detection of the conductive state must be ensured to compensate the earlier wear of the seal. In the present embodiment, in order to ensure the reliability of the detection of the conductive state, the conductive state effected by the attachment of the conductive seal is associated with the write prohibit state in which the module is used much less frequently. However, the user can properly decide, depending an the purpose of use, etc., whether the conductive state is associated with the write prohibit state or the write permit state. If an electrically conductive memory module is used, an electrically non-conductive seal may be attached to set the write prohibit state or write permit state. In the above embodiment, the memory module is inserted in the card-shaped holder and the card-shaped holder containing the module is mounted in the electronic device. However, the memory module may be directly mounted in the mounting unit of the electronic device having the drive apparatus. The present invention is applicable not only to the memory module but also to various storage mediums such as floppy disks or magnetic tapes. The conductive or non-conductive seal may be replaced with a conductive or non-conductive coating material such as ink. In this case, too, the same advantage as in the above embodiment can be obtained. Other modifications can be made without departing from the spirit of the present invention. As has been described above in detail, according to the present invention, there is provided a small and thin information storage apparatus permitting one to visually recognize the write prohibit state thereof and making it possible to realize a write prohibit mechanism at low cost and an information processing apparatus using this information storage apparatus.

Claims: A method of accessing information stored in a non-volatile semiconductor memory (13) of an information storage card (11) using an interfacing holder (21) and an information processing host device, the method comprising the steps of: a) inserting the information storage card (11) into the interfacing holder (21); b) inserting the interfacing holder (21) into the information processing host device; and c) detecting a presence or absence of a conductive state designating member (16) on a designating portion (15) of the information storage card (11) to inhibit or allow writing of information to the non-volatile semiconductor memory (13) of the information storage card (11), and characterized in that said state designating portion (15) is adapted for visibly and detachably receiving a conductive state indicating member (16). A method according to claim 1, wherein the interfacing holder and an information processing host device, the interfacing holder (21) comprises at least two detecting electrodes (25) and step c) comprises the steps of: c1) establishing contact between the at least two detecting electrodes (25) and a state designating member (16) on the information storage card (11) and c2) detecting a conductivity of the state designating member (16) using the at least two detecting electrodes (25), wherein when the conductive state designating member (16) is present on the information storage card (11), the interfacing holder (21) prohibits writing of information to the non-volatile semiconductor memory (13) of the information storage card. A method according to claim 2, further comprising the steps of applying the state designating member (16) to the information storage card (11). A method according to claim 2, wherein the designating portion (15) is adapted to be contacted by the at least two detecting electrodes, the method comprising the steps of: detecting a non-conductivity of the designating area (15) of the information storage card (11) using the at least two detecting electrodes (25) to allow writing of information to the non-volatile semiconductor memory (13) of the information storage card (11). A connector pin assembly for use in an information processing apparatus for receiving an information storage device (11), the information storage device (11) having a state designating portion (15) for designating whether or not writing of information to the information storage device (11) is prohibited, the connector pin assembly comprising: a connector pin supporter (21); a plurality of first connector pins (24), supported by the connector pin supporter (21), the plurality of first connector pins (24) being adapted to establish contact with a plurality of respective external connection terminals (13e) of information storage device (11); and a plurality of second connector pins (25), supported by the connector pin supporter (21), the plurality of second connector pins (25) being adapted to establish contact with the state designating portion (15) characterized in that said state designating portion (15) is adapted for visibly and detachably receiving a conductive state indicating member (16). The connector pin assembly of claim 5, wherein said information storage device comprises a semiconductor memory (13). The connector pin assembly of claim 5 or 6, said connector pin support (21) further comprising a cavity therein, at least one side wall of the external support member having an opening to receive the information storage device (11), the cavity including at least a pair of opposing inner faces; and wherein said plurality of first connector pins (24), are formed on one of the pair of opposing inner faces, for providing an electrical coupling for the information storage device (11) to access the semiconductor memory (13); and said plurality of connector pins (25), are formed on the one of the pair of opposing inner faces, for providing contact with the state indicating area (15). The connector pin assembly of claims 6 or 7 further comprising; a discriminating circuit operably coupled to the second connector pins for acknowledging writing of information to the semiconductor memory (13) being possible by detecting absence and a conductive state indication member on the state indicated area; and a memory controller for controlling access to the semiconductor memory (13). The connector pin assembly of any of claims 5 to 8, wherein the discriminating circuit detects a conductive state between the at least two second connector pins determine that writing information to the semiconductor memory is not possible. The connector pin assembly of any of claims 6 to 8, wherein the discriminating circuit detects a non-conductive state between the at least two second connector pins to determine that writing information to the semiconductor memory (13) is possible. The connector pin assembly of any of claims 9 and 10, wherein the connector pin supporter is a card-shaped holder adapted for mounting in an information processing host device. The connector pin assembly of claim 11, wherein the connector pin supporter has a size specified by PCMCIA standards. The connector pin assembly of claim 12, wherein the at least two second connector pins are arranged at a distance of at least approximately 1 mm from each other. The connector pin assembly of any of claims 9 and 10, wherein the at least two second connector pins are arranged at a distance of at least approximately 1 mm from each other. The connector pin assembly of any of claims 6 to 14 wherein said storage medium (13) has a first portion having an external connection terminal (13e) and a second portion (15) where a conductive state designating member (16) for designating a state in which writing of information to the storage medium is prohibited is provided. The connector pin assembly of claim 15, wherein said discriminating circuit is operably coupled to the plurality of second connector pins (25) for discriminating whether writing information to the semiconductor memory (13) is prohibited by detecting a conductive/non-conductive state between the plurality of connector pins (25). The connector pin assembly of claim 15, wherein said discriminating circuit discriminates whether or not writing information to the semiconductor memory (13) is possible by detecting an absence or a presence of a conductive state indicating member (16) on the state designating portion (15). The connector pin assembly of claim 16, wherein the discriminating circuit detects the absence of the state indicating member (16) on the state designating portion (15) by detecting a non-conductivity of the state designating portion (15) The connector pin assembly of claim 16, wherein the discriminating circuit detects the presence of the state indicating member (16) on the state designating portion (15) by detecting a conductivity of the state designating portion (15). The connector pin assembly of any of claims 6 to 19, further comprising a memory controller to control writing and reading data to the semiconductor memory (13). The connector pin assembly of claim 20, wherein the memory controller is capable of controlling a NAND flash EEPROM as the semiconductor memory medium. The connector pin assembly of any of claims 5 to 21, wherein a cross section of at least one of the plurality of first connector pins represents a rounded portion and a straight portion. The connector pin assembly of any of claims 5 to 22 wherein a cross section of at least one of the plurality of second connector pins represents a rounded portion and a straight portion. The connector pin assembly according to any of claims 5 to 23, wherein the contact between the plurality of second connector pins and the state designating portion includes a physical contact. The connector pin assembly according to claim 24, wherein the contact between the plurality of first connector pins and the plurality of respective external connection terminals includes an electrical contact.

Inventors: IWASAKI HIROSHI, IWASAKI, HIROSHI, Iwasaki, Hiroshi, Intellectual Property Division
Applicants: TOSHIBA KK, KABUSHIKI KAISHA TOSHIBA
Application year: 1996
Main classification: G11C7
IPC codes: G11C8, G11C7