INTEGRATED CIRCUIT CHIP CARD AND THE METHOD AND SYSTEM FOR THE MANUFACTURE OF SAME

Abstract: An integrated circuit chip card made by a plurality of lamina (11, 12, 13) and forming a chip module cavity (15) complementarily-shaped to the sides of the contact stratum of a chip module (14) for achieving a nested relation. A method and system of manufacturing an integrated circuit chip wherein one of said webs (A, B, C) forming the lamina (11, 12, 13) may be processed in parallel and wherein one of said webs has integrated chip modules (14) premounted thereon for subsequent lamination with the other webs (A, B, C), and wherein the registration of the webs (A, B, C) and seating of the integrated circuit chip module (14) within a cavity (15) occurs at substantially the same time, and while chemical bonding media therebetween remains fluid and open. The cards may be cut from the laminate while the chemical bond is not yet cured.

Description: INTEGRATED CIRCUIT CHIP CARD AND THE METHOD AND SYSTEM FOR THE MANUFACTURE OF SAME Background of the Invention The invention relates to an integrated circuit chip card of the multi-ply laminated type and a method and system for inserting the chip while registering the plies in a fast and efficient parallel process. The invention is particularly directed to the formation of a chip- retaining cavity within multi-plies of a chip card having close tolerances and providing for ply registration to occur after the chip insertion step. The use of integrated circuit chip cards, also known as "smart cards," has rapidly advanced over the last several years. Such types of cards have integrated circuit chips assembled within them which may hold considerable data and can be electronically interactive with various reading and writing devices. One of the largest current markets for these types of cards involves the storage of money values in the memory circuit, wherein the money value decreases incrementally with use, for example, telephone debit cards. Particularly large demand for these types of cards has arisen in France and Germany, but the acceptance and usage is quickly growing worldwide. Integrated circuit chip cards are also useful in combination with other forms of coded information, such as magnetic strips or conventional alpha-numeric characters. Other applications utilize integrated circuit chip modules in substantially unmarked cards with limited indicia thereon for confidentiality and security purposes. Typically, integrated circuit chip modules are manufactured on strips and wound on reels in a two-across arrangement, wherein an array of conductors is formed on an upper "contact" stratum of the chip for electrically communicating with the semiconductor chip underneath. Usually, an epoxy or other protective resinous globule coats the semiconductor chip for protection. The integrated circuit chip modules are severable from the chip strips by die cutting around the conductor arrays and excising them from the reels for assembly with a plastic debit card, or the like. The industry has chosen a standard thickness for "smart cards" of 0.030 inches (0.762mm). Accordingly, the manufacturing and assembly techniques must be directed toward accommodating integrated circuit chip modules within this small thickness. While there may be applications wherein the conductor array may be disposed outward from the outer surface of the card, it is generally preferable that the conductor array in a contact type of integrated circuit chip module be flush, i.e., coplanar, with the interactive outer surface of the card. Other types of "smart cards" employ contactless integrated circuit chip modules for which the chip module may be covered and fully embedded within the chip stratum, since no electrical contact communication is required with an interactive reader, scanner, writing device, terminal, etc. For both contact and contactless types of smart cards, it has been a continual effort of card manufacturers to increase productivity with faster chip installation, card printing, machining, splicing, milling and cutting procedures. Integrated circuit chip modules are inherently fragile and require careful punching from chip strips to rapidly and precisely position them into waiting chip cavities, or the like, in the cards. The two most common commercial ways to make cards are by milling and die-casting. When the milling method is used, individual cards, which are usually made from a laminate using heat and pressure methodology, are fed to a milling machine, which mills out the chip module cavity. Printing on the cards may be done either prior to or after they are cut into their final size and shape. Thereafter the chip is glued into the cavity. In die-casting, typically an ABS plastic is used. This requires the cards to be cast one at a time, with the cavity and other dimensions finished to size. The cards are individually press printed and the chips are glued into the cast cavity. Die-casting may be lower cost because there is no milling or machining procedure. A third technique requires embossing the cardstock to create a recess or cavity sufficient to accommodate an integrated circuit chip module and adhering the integrated circuit chip module within the cavity. An overlayment of another ply or plies may be provided in these foregoing methods to secure the chip modules or "coat" the card, which overlayment may also include cut-outs therethrough for electrical connection external to the card as in U.S. Patent Nos. 4,216,577 and 4,222,516 to Badet et al. In such devices, the conductor array is disposed on the side of a support stratum which also supports the integrated circuit bulb at the same side of the stratum. This type of card utilizes a chip assembly that takes advantage of raised embossments used for credit card indicia whereby additional covering of lamina or sheets may be provided in the region of the chip module to protect the integrated circuit or otherwise afford communication openings to the conductor arrays. These types of cards are generally of the monolithic variety with a cover plate over the integrated circuit chip module. A fourth methodology has attempted to laminate a plurality of die-cut plies of generally equal external proportions to form a laminate having an integrated circuit chip module retained in cavities formed in one or more of the die-cuts in the plies. Generally, it is desirable to make "smart cards" out of a plastic material that has flexibility and durability. The aforementioned use of ABS is quite common to meet these needs. Also, smart cards are commonly made of polyvinyl chloride (PVC), polyvinyl chloride acetate (PVC A) and to a lesser extent, polyethylene. Typically, cards of multi- lamina construction use the same plastic material for each of the plies. However, when an overlayment is required at one or both faces of the card, it can be achieved by using a different material, usually a polyester, such as "Mylar" brand, or a polyamide, such as "Kapton" brand. A difficulty experienced in the previous attempts at multi-ply lamination through web processes is the problem in maintaining registration of the plies because each has a different "throw length" inherently caused by differential stretching on printing presses, die-cutting apparatus, or punch press rolls, drums, and the like. Because of the different stretching of the plies on these drums or rolls, collating them in proper registration for accurate lamination has not been generally successful, particularly because the alignment must also be maintained for printing, magnetic striping, chip insertion, and the like. Additionally there are problems with heat and pressure methods because they are too slow to be commercially feasible. Some previously patented integrated circuit chip card laminates are disclosed in U.S. Patent Nos. 4,727,246; 4,795,895 and 4,889,980 to Hara et al. However, specific methods for overcoming misregistrations and chip insertion misalignments are not taught. These types of laminates also essentially result in a configuration wherein the entire card becomes the integrated circuit module structure itself as opposed to the desire in the industry for assembling an integrated circuit chip module itself within the plastic plies to form a smart card. Other laminated-type of integrated circuit chip cards are shown in U.S. Patent No. 4,725,924 to Juan and U.S. Patent No. 5,214,566 to Dupre et al. These patents also do not disclose means for obtaining proper registration of the printed plies and the ability to correct for misalignments so that the I/C chip modules are not improperly inserted. The prior art generally shows the assembly of laminated-type of cards where the chip insertion step is achieved after the registration of the plies. Thus, in those circumstances, the chip is forced to be installed in the pre-registered plies even though there may be a ply misregistration or misalignment of a chip cavity. There is no ability to correct registration once it is completed which thereby causes inefficiency, damage and delay in the process when subsequently attempting to install a chip in a misaligned laminate. Other well known laminating technology is found U.S. Patent No. 4,863,546 to Melzer et al. , and in a modularized card lamination system called "Open Production Concept" sold by Melzer Machinebau GmbH in Germany. Also, one Melzer Machinebau GmbH methodology has attempted to form chip cavities prior to lamination. This method creates other problems because the heat and pressure deform the pre-formed cavities. A need has therefore arisen for the additional step of inserting the chip module before applying the heat and pressure to try to minimize the cavity distortions. The latter step is not satisfactory however because the whole chip module and cavity move under the heat and pressure, which also resulted a misalignment. This process for modular assembly envisions making both open contact and closed, or contactless laminated chip cards. The system utilizes a pin band drive apparatus for feeding the lamina to the laminator from an unwinder. The system may be used to laminate up to six plies and employs a drilling unit or a cavity punching unit to form pockets in the layers. This process utilizes what is known as a "punch-and-stick" operation, wherein chips, i.e. modules, are excised from a chip strip and pushed into the chip cavity formed in a laminate, which has already been registered. Accordingly the chip may be subjected to any pre-registration misalignments and is required to be moved through two parts of a cavity, one formed to accommodate the integrated circuit chip bulb and the other for retaining the conductor array (contact stratum). This system, as in others, preferably utilizes a suction robot arm, which guides the chip in three dimensions, thus subjecting the process to further error in attempting to deposit a chip into a multi-part cavity drilled or milled from a laminate. The process of Patent No. 4,863,546 also suffers from a disadvantage in that it has an objective to eliminate relative motion amongst the plies. This does not suggest a method for inserting a chip to accommodate misalignments in-line as the process goes on and wherein the chip insertion is achieved before ply registration takes place. The prior art integrated circuit chip card-laminating technology predominantly uses heat and pressure lamination "baking" the laminate over several minutes and plasticizing the laminas. Also, other previous methods involve injection molding, which also puts the material into a molten state. In those processes, there is substantially no "open time" where the laminas would have a relatively fluidized zone of contact between them for a few seconds after the bonding is initiated. The prior art further teaches the manufacturing of cards from webs of cardstock at a two-across rate. It would be beneficial to improve this process and make from one to several cards across a web of cardstock. This achievement would be additionally advantageous if the process would assure proper ply registration and chip module insertion at high speed by eliminating time-consuming heat and pressure steps. The retention cavity structures for integrated circuit chip modules in "smart" applications, such as for credit cards, prepaid telephone cards, bank cards, identification cards, etc., have included shaping the chip-retaining cavities to facilitate not only adhesive or thermal bonding, but also a mechanical locking by the card cavity itself. For example, in U.S. Patent Nos. 4,947,531 to Brisson and 4,990,759 to Gloton et al., upper openings of the chip cavities include formations for overlying a part of the integrated circuit chip module, typically over the contact stratum wherein the conductor array resides. These chip installation techniques involve deforming a portion of the periphery of the chip cavity before or after the chip has been inserted. In another manner, a card that is shown in EP-A-0 623 897 (Gilles Leroux) provides a rectilinear chip cavity which has opposing overhangs scallop-milled at about a 10° angle and required for forming an opening that snaps over the top surface area of the integrated circuit chip module during insertion. In this card, the contact stratum of the module holding the conductor array is physically bowed, or bent, along a horizontal x or y axis and then placed into the cavity whereupon it is released to resiliently snap underneath the opposing overhangs of the card cavity. The chip module cavity is not a through-bore but is a double recess formed in a single lamina and requires chip insertion from its only open top end. These kinds of chip retention structures are inherently inefficient by requiring the additional steps of deforming either the cavity or subjecting the chip module to potential damage by bending it to snap under the overhang of an opening. Other deficiencies in the prior art have been found in connection with the usual epoxy globule that a manufacturer places around the semiconductor circuit portion of the chip module to protect it. If too much epoxy is deposited, when the chip is inserted into a cavity it will not seat properly. Milling or injection molding processes cause distortions in thin-walled cards usually by creating waviness in the card surfaces in the area of the cavities particularly on the back surface of the card. It is therefore an important goal of the invention to provide a method for making a laminated integrated circuit chip card which can be run at high speed and achieve proper registration of the chip modules within chip cavities that are preformed in one or more of the plies. It is an allied objective of the invention in one form thereof to fully eliminate conventional milling, drilling, die-casting and embossment techniques, and instead rely solely on the formation of a cavity in a multi-laminate construction wherein the thicknesses of the card plies are dictated by the configuration of the integrated circuit chip module. Therefore, a concomitant goal is to provide an undistorted lamina beneath the chip module. It is a further desired achievement of the invention to provide for a separate parallel production of multiple webs for subsequent collating and laminating together, wherein the registration of the webs occurs after chip insertion into the cavity, so that misalignments and tolerance errors can be accommodated. It is therefore an allied goal of the invention to avoid the requirement of punching and sticking an integrated circuit chip module into a cavity on a pre-registered laminate. It is further an object of the invention to accomplish chip module insertion by placing a cavity onto the chip module around its conductor array in the contact stratum, rather than placing the chip module into a pre-formed cavity. It is a concomitant objective therein to first adhere an integrated circuit chip module to an intermediate lamina at an aperture therethrough and to secondly laminate an upper lamina over the chip at a complementarily formed cavity therein, so that the cavity is moved and positionally adjusted to the chip rather than moving and positionally adjusting the chip to the cavity. Yet another advancement in the art is sought wherein a method would be provided for collating and laminating a multi-ply smart card assembly and installing an integrated circuit chip module in a manner whereby one or more cards across can be manufactured with in-line registration occurring after chip installation but prior to the die cutting of the chips from the laminated webs of material. It is hence a further objective of the invention to allow for the accommodation of differently sized chips by varying the thicknesses of at least two webs of a multi-web laminate, whereby the two web's thicknesses conform to and are dictated by, respectively, the height of the integrated circuit chip and the thickness of the conductor array forming the contact stratum that is electrically connected to the integrated circuit chip. It is a related goal of the invention to provide for chemically bonding the plies together. It is still another goal to provide for chemically bonding the plies together, wherein said bonding provides a pre-set, or "open," time, so that web registration can occur after chip module insertion. It is yet another object to achieve a bonding process at ambient temperatures well below the plasticity or melting point of the webs, wherein minimal heating may be optionally used to drive off solvents and dry - not fluidize - a bonding medium. It is an allied goal to therefore provide a method and system wherein the process utilizes pin feed tractors for engaging registration holes of all the webs during said open time. Said multi-ply laminas thereby settling down on the tractor feed pins for registration thereof and for the nesting accommodation of the integrated circuit chip module within the cavities formed by apertures cut through one or more of said webs or lamina. In this regard it is also a desired result of the invention to provide for an upper lamina of the card to have a generally reverse bevel-shaped aperture and the chip module being similarly punched from a chip strip to have a complementarily-shaped peripheral edge whereby to be hidden and tucked below the reverse bevelled cavity of the upper lamina; creating very close edge tolerances at the outer exposed surface around the periphery edge of the conductor array. It is yet another target of the invention to provide for the pre-installation of integrated circuit chip modules on one ply of a to-be-formed multi-laminate smart card, which may be rewound on a reel, or cut in sheets, and stockpiled for ultimate lamination, or some other purpose, at a later time. It is further an object of the invention to provide for a prelamination of a non-die cut bottom lamina to an intermediate lamina carrying said chip modules, whereby to be subsequently laminated to an upper lamina having cut-outs for the I/C chip contacts. These and other objectives will be seen to have been achieved by the invention described herein and claimed in the claims appended hereto. Summary of the Invention The present invention is an integrated circuit chip card and method for its manufacture preferably by laminating two or more, preferably three, webs of cardstock material, each being a lamina for the finally formed laminate, wherein the thicknesses of certain of the webs are dependent upon the heights of the integrated circuit (I/C) portion of the chip module and the contact stratum electrically communicating with the I/C chip. In a preferred embodiment, at least one lamina is die-cut to form a chip module cavity and at least one other lamina remains intact having no die-cut therein. An upper lamina of the card provides a cavity therethrough for accommodating said contact stratum of the I/C chip module whereby only the facial portion of the contact stratum having the conductor array is exposed and side edges of the contact stratum are substantially hidden from view within said lamina. The integrated circuit chip card is made by first printing and die-cutting an upper web with registration holes and a complementarily-shaped chip cavity, then marking head-of-form (HOF), or other, registration indicia at regular intervals therealong. This first web may then be rewound for subsequent collating and laminating with other plies. A lower, or third, web is similarly die-cut with registration holes and printed as appropriate, but receives no die cut cavity and remains smooth. A middle, or second, ply is separately fed through a die cutter for making throughbores at regular intervals therealong for receipt of the integrated circuit chip portion of the chip module therethrough. The second web also has die cut registration holes as in the first and third webs for engaging a pin feed tractor pull means and receiving registration indicia. The second web is then mated with I/C chip modules which are fed from an unwinding chip strip wound on a reel and punched therefrom to have edges generally complementarily-shaped to fit into the complementarily-shaped cavities of the first web. Adhesive is applied adjacent the through-bore apertures and the excised chips are placed with the I/C chip portions fitted into said throughbores. The thickness of the second web is sized to be generally equal to the depth of the I/C chip portion. This second web may then be rewound on a reel for subsequent collating and laminating with the other two webs. The three webs are ultimately collated and laminated after being unwound and controlled on pin feed tractors which engage the registration holes. An optical scanner scans for the HOF registration indicia or marks to verify registration or to adjust die cutter(s) positioning. Each web preferably has locations spaced thereacross for four cards to be made. Opposing interior faces of the webs are treated with a chemical solvent and/or adhesive at ambient temperature (unheated) whereby fluidized bonding interfaces are formed therebetween. The three webs are then fed to laminating rollers which bring the webs together and presses them down on the pins of pin bands and/or tractors. Lamination occurs when at least two of the webs have a fluidized bonding interface therebetween and they pass through laminating rollers that press them together. Each complementarily-shaped cavity of the first web is brought atop a contact stratum of an integrated circuit chip module, whereby the edges of the contact strata nest under the complementarily-shaped interior walls of the cavities of the first web. Pin feed tractors with opposing web guide plates and/or pin bands engage the webs as the laminating rollers press all of the webs together and as the fluidized bonding interfaces still remain open, or pre-set, allowing a translation of the webs to occur and which also allows the contact stratum of each integrated circuit chip to seat itself within its respective cavity of the top web for final registration. The bond then sets-up within seconds later, although the bond is not fully cured. Next, the laminate is pulled outwardly by a pin feed tractor and directed to a four post reciprocating punch and die that cuts the finished cards from the three web laminate. The relative positions of the webs are monitored throughout by sensing the HOF marks usually located at the beginning or end of the printed impressions, or throw lengths, of the webs. The final die cutting of the multi-ply cards is monitored by an optical sensor that also senses the HOF marks, so that each card is cut with less than +/- 0.003 inches tolerance. Accordingly, the three webs may be die cut, printed and stockpiled (wound) in parallel steps and then brought together for collating and laminating at a time chosen by the manufacturer. One alternate method provides for the simultaneous printing and die cutting the first and third webs from a single web on a rotary press, which die cuts the apertures in the first ply and places the marginal registration holes in both. Thus, because they have the same throw lengths, i.e., unpredictable variations in length caused by stretching or contracting, registration between these two webs is assured. The exterior faces of the first and third webs are printed by the press as necessary. In this way, preferably a four-across arrangement is provided where one-half of the single web forms the first web and the other half forms the third web. A center set of in-board registration holes is die cut therethrough, so that the single web can be cut into the first and third webs with each having two sets of marginal pin feed registration holes for engagement by the pins of an in-feed tractor for the lamination onto the middle or second web. Because the two plies are also cut and printed at the same time with simultaneous HOF marking, registration between them is further assured for collating and laminating with the second web. Another option is to initially laminate the third web to the bottom of the second web and then later collate and laminate the second/third web combination with the upper web, so that the registration of only the first and second webs would take place in the final lamination. Yet another alternate involves separating the second web in predetermined lengths in- line to form sheets of the second web with the I/C chip modules held thereon while always under pin control. The formed sheets are held on tractor pins and/or pin bands located after laminating nip rollers and laminated to the upper and lower webs. The sheets are separated from the second web preferably by cutting or removing cross strips from the web, so that during final registration on the pins of feed tractors or pin bands the sheets may shift lengthwise a slight amount relative to the upper and lower webs into final registration without hitting the leading edge of the second web from which each has just been cut. Other options involve separating in-line the upper and/or bottom webs into sheets for lamination to the intermediate web. In the preferred in-line sheet-forming methods, one of the webs is always maintained intact as a web and the sheet or sheets are maintained under pin feed control through the final registration. Optionally, registration indicia can be eliminated, so that the web could be rolled or made into sheets for sale, for example, to a card manufacturer that subsequently would mark its own registration means on the web. Brief Description of the Drawings Fig. 1 is a perspective view looking downwardly onto a fully assembled multi -ply laminated card having an integrated circuit chip module mounted therein in accordance with the invention; Fig. 2 is a perspective view of a broken away portion of the intermediate ply of the card of Fig. 1, showing in phantom lines where the card edges will be die cut, and also showing two I/C chip modules ready for insertion of the I/C chip circuit portions thereof into apertures die cut therethrough; Figs. 2A and 2B illustrate two alternate forms of the intermediate ply for providing additional I/C circuitry; Fig. 3 is an exploded view of the integrated circuit chip card as in Fig. 1 showing the preferred three plies of the laminate; Fig. 4 is a cross-sectional view of the card showing the top or first web being laminated over the second web wherein a reverse bevel chip cavity of the first web is placed atop the contact stratum of an integrated circuit chip having complimentarily bevel cut edges; Fig. 5 is a cross-sectional view as in Fig. 4 but showing the complete lamination of the top web over the second web with the generally bevelled edges of the contact stratum nestled under the reverse bevel chip cavity of the first web; Fig. 6 is a cross-sectional view of a card similar to Figs. 4 and 5 but in an alternate embodiment, wherein the cavity in the top ply and the edges of the contact stratum are cut orthogonally to the faces of the plies, rather than bevelled; Fig. 7 is a broken-away portion of a chip strip showing two-across pairs of integrated circuit chip modules and marginal pin feed holes; Fig. 8 is a schematic elevational view of the apparatus used for die cutting chip apertures and registration holes, applying adhesive, unwinding and feeding chip module reels, punching modules therefrom, and placing them at four-across locations on the second web of the to-be-formed card, and further showing the rewinding of the second web with the four- across chip modules mounted thereto; Fig. 8 A is a front view of the chip module inserting assembly for the apparatus as shown in Fig. 8 looking downstream thereat; Fig. 8B is a side view of the assembly shown in Fig. 8B; Fig. 9 is a side elevational view of a feed tractor having pins mounted on an endless belt for engagement with the marginal registration holes of the multiple plies, and having biasing plates for urging the plies downwardly to position their registration holes over the feed tractor pins; Fig. 10 is a cross-sectional view at the sprocket of the feed tractor of Figs. 9 and 12, showing the engagement and registration of the registration holes of the laminating webs as they engage and settle down on the pins of the feed tractor; Fig. 11 is a plan view partially broken-away of the laminated webs having chip modules mounted four-across and showing in dashed lines the card edge locations just before die cutting the cards from the webs; Fig. 12 is a perspective view looking downwardly on a feed tractor for pulling the webs and showing the laminated webs in phantom lines being pulled by the pins of the feed tractor at the registration holes thereof, with the biasing plates at both of the pin bands urging the web registration holes downwardly onto the tractor pins; Fig. 13 is an elevational schematic view of a rotary press and punch for printing the exterior faces of the top and bottom webs, punching marginal registration holes in both and die cutting the chip cavities in the top web, the equipment being usable individually for both the top and bottom webs, and also for the simultaneous cutting and printing of a single web which is cut down the center to form the first and third webs; Fig. 14 A is a collator and laminator apparatus with continuous pin band control shown in a schematic elevational view wherein the rolls of three webs are unwound, aligned, collated, laminated, registered and bonded, with separators optionally usable for making the upper and/or lower webs into sheets in-line prior to laminating; Fig. 14B is the collator and laminator apparatus of Fig. 14A shown in the schematic elevational view and further including a separator for making the intermediate web into a sheet in-line prior to laminating; and, Fig. 14C is a schematic illustration of the in-line separation of the lower web into sheets and lamination to the intermediate web using the apparatus of Fig. 14A. Fig. 15 is a reciprocating four-head punch apparatus shown in a schematic elevational view for receipt of the multiple laminate from the apparatus of Fig. 14 to die cut the multi-ply integrated circuit chip cards of the invention in final form from the laminate and thereby removing the excess material; and, Fig. 16 is a plan view of a broken-away portion of a web for the alternate step of simultaneously cutting and printing the top and bottom webs on the apparatus of Fig. 13 from a single web, the top web shown having the contact stratum apertures for the chip modules and the bottom web left imperforate. Detailed Description of the Invention The invention will now be more fully described in connection with the above-described drawings wherein like reference numerals throughout refer to the same elements. The invention comprises both articles of manufacture and methods and systems for making them. The articles of manufacture are generally shown in Figs. 1-7 and the methods and systems are primarily shown in relation to Figs. 8-16. In Fig. 1 a completed I/C chip card 10 is shown. In the preferred embodiment, the card 10 comprises three plies 11, 12, 13 which are laminated and secure therein an I/C chip module 14. Figs. 2 and 3 illustrate in greater detail the card 10 wherein Fig. 3 provides an exploded perspective view showing the first or upper ply 11 having a rectilinear aperture 15 cut therethrough for accommodating the contact stratum of the I/C chip module 14, which stratum comprises an array of conductors electrically communicating with the semiconductor chip below. The second or intermediate ply 12 includes a generally circular aperture 16 cut therethrough for retaining the semiconductor or integrated circuit chip portion of the module 14 therein. A bottom or third ply 13 is smooth, i.e., imperforate, and provides an undersurface to the aperture 16 whereby in combination with the apertures 15 and 16 a chip cavity is formed. Opposing inward surfaces of the plies 11, 12 and 13, have a "satin" finish known in the industry for facilitating bonding therebetween as will be explained. These "satin" finishes provide textured interfaces between the plies in order to improve adhesion during lamination and which also increases the bonding strength in comparison to smooth untextured plastic surfaces. It is envisioned that card 10 preferably made of either acrylonitrile butadiene styrene (ABS) or polyvinyl chloride (PVC). Other materials also suitable for the card 10 include polypropylene, polyethylene, and polyvinyl chloride acetate (PVCA). Fig. 2 also illustrates another article of manufacture encompassed by the invention. A web B of material has rectangular portions shown in dashed lines which could later be die cut to form the card plies 12, as shown in Fig. 3. The web B can be manufactured with I/C chip modules 14 bonded at the aperture 16 and then rolled onto a drum, or alternately cut into sheets. The web B may be stored for later manufacture or otherwise immediately directed to a collator/laminator for lamination to form the card 10. The card shapes need not be polygonal but may take on any shape needed. One branch of the credit card, debit card, telephone card and "smart card" industry has chosen a standard thickness for the cards to be about 0.030" (0.762mm). For these cards, the length and width also have been standardized to a nominal size of 2.125" wide (53.98mm) by 3.37" long (85.73mm). These dimensions are not critical to the invention and many other standards for card sizes can be accommodated by the invention. Therefore, other lengths, widths and thicknesses can be achieved by the lamination, registration and die cutting steps of the present invention. It is envisioned that a card thickness might range from about 0.020" (0.508mm) up to about 0.040" (1.016mm). Because the ultimate card shapes are die cut from a laminate in the present invention, the lengths, widths and even shapes are not critical and have wide range. For example, cards may be shaped to suit particular needs or marketing goals and have shapes such as stars, crescents, circles, ovals, etc. Also, for example, "key shapes" have been used for portable phones. These shapes and sizes are basically limited by the die cutting and punching equipment capability for particular laminate thicknesses. The materials comprising the card should be printable and preferably be able to achieve a print quality equal to or better than "Ko-Pack Rotary L.P.", although a lesser quality does not affect practicing the invention. The card to be formed should be capable of being embedded with chip modules in conformance with ISO specification nos. 7810-7816. A non-chip card laminate may also be formed by an altemate form of the method as will be explained. Turning now to Figs. 4-5, cross-sectional views of the card 10 are illustrated for better understanding. The card plies 11,12,13 will be understood as being die cut from webs of material generally designated, respectively, A, B and C. The I/C chip module 14 has a contact stratum generally identified by reference numeral 114 and the semiconductor memory or integrated circuit chip portion is denoted at reference numeral 214. In Fig. 4, the web A, from which ply 11 will be cut, is shown spaced slightly above web B, wherein the aperture 15 may be described as having generally reversed-bevelled sidewalls 115, which are complementary with peripheral die cut edges 314 of the contact stratum 114. The semiconductor portion 214 resides within the aperture 16 of a card ply 12 to be cut from the web B and an undersurface 414 of the contact stratum 114 rests on top of the web B and is secured thereto by an adhesive 514 deposited between the undersurface 414 and the web B. The adhesive 514 may also optionally fill portions of aperture 16 surrounding the semiconductor chip portion 214. The web C is flushly laminated underneath web B and forms a bottom wall to the cavity formed by apertures 15 and 16 protectively below the I/C chip module 14. Fig. 5 shows the fully laminated configuration of the webs A, B and C of Fig. 4 from which the card 10 will be cut therefrom as described below. It will be seen that aperture 16 also may be slightly flared at its walls 116 facilitating easier chip insertion and the placement of the adhesive 514 around the semiconductor chip portion 214. In general, chip modules such as I/C chip module 14, have a height of approximately 0.023" , wherein the contact stratum 114 containing the conductor arrays is thin and wafer-like having a thickness of about 0.007", and the semiconductor chip portion 214 has a height of about 0.016". In the preferred embodiment, it is an object of the invention to provide to form the webs A and B to have a combined thickness equal to the heights of the contact stratum and semiconductor chip portions, including any protective covering material, of the I C chip modules. Thereby, the apertures 15 and 16, as a result, are cut fully through the webs A and B for accommodating, respectively, the height of the contact stratum 114 and height of the semiconductor chip portion 214. Thus, the inventive card 10 allows varying the thicknesses of these plies as needed to meet particular chip sizes. In the exemplary embodiment, the thickness of the ply C therefore would be 0.007", so that the thicknesses A+B+C would equal the standard 0.030" (0.762mm) card thickness. With regard to the numerous types of I/C chip modules manufactured, the usual range of thicknesses for web A is about 0.004"-0.007" to accommodate the most common contact strata heights. Of course, this thickness could be increased if necessary. Typically, the thickness for web B would be in the range of about 0.016"-0.022" and web C in the range of about 0.004"-0.010". The invention also envisions the lamination of webs which themselves might be laminates. For example, web A might be comprised of a lamination of multiple webs of the same or different materials, as might webs B and C. Therefore, the invention is not limited to the lamination of homogeneous webs A, B and C. Furthermore, the invention is not limited to I/C chip cards but also may provide cards and methods for laminating cards that are not "smart" and might be the usual type of credit cards with or without raised embossment for lettering and other symbols, with or without magnetic striping for containing the usual coded information. The complementary configurations of the aperture 15 at the reverse bevelled sidewalls 115 and the contact stratum 114 at peripheral bevelled edges 314 serve to allow for the nesting accommodation of the contact stratum 114 underneath the sidewalls 115 whereby to create a joint line between the card aperture 15 and contact stratum 114 having a very close tolerance gap at reference T of less than or equal to about 0.005", which minuscule seam is highly desirable in the industry by creating a virtually smooth surface across the top face of the ply 11 of the card 10. The outward opening of the aperture 15 is about 0.007" smaller than the inward opening at the web B is in the preferred embodiment. Accordingly, if symmetrically die cut this leaves about 0.0035" outward-to-inward difference along each of the side edges of the contact stratum 114. Closer tolerances under the aperture sidewalls 115 along the chip module edges 314 are not as critical because they are hidden and therefore leaves some room for manufacturing tolerance error, while achieving a snug, nested accommodation of the I/C chip module 14 and tight seams at the outer surface. The term "bevelled" in regard to the sidewalls 115 and edges 314 is used herein but encompasses a broader definition than a straight slope taper. The term encompasses, among other equivalent configurations, the transition of the apertures 15 and edges 314 from a smaller area to a larger area, as shown in Figs. 4 and 5, which transitional shapes for example could be hyperbolic, parabolic, circular, radiused, nonuniform or jagged irregular contours, all which may be formed by the punches, die cutters, and the like, useful for cutting through cardstock and cutting chips from reels. Also, the use of the term "reverse" for the bevelling of the walls 115 simply means that the sidewalls 115 are cut inwardly and downwardly away from the exposed opening of the aperture 15 at the outward surface of web A. The aperture 15 accordingly has an inverted funnel shape as illustrated. The invention however also envisions a reverse bevel for less than the entire periphery of the apertures 15 and contact strata 114 whereby only a portion or separated portions may be complementarily bevelled. It will be appreciated that the bevelling of the sidewalls 115 and edges 314 create a slope that is generally greater than 45° from the orthogonal direction in the preferred embodiment wherein the web A has an aperture 15 that flares about 0.0035" from the outward opening to the inward opening adjacent web B. Accordingly, a significantly greater taper angle can be provided than in those prior art techniques wherein chip modules are required to be bent for insertion. Additionally, the preferred embodiment envisions bevelling the sidewalls 115 in the same way wherever a bevel is made, so that there is no need to vary the bevel cross-section, such as for scalloping techniques in the prior art usually obtained by milling. Accordingly, a relatively wide-flare bevelled cavity wall construction can be obtained, since the bevel may be achieved in tapers of greater than 45 ° from a line orthogonal to web B and thereby provide a generous hidden cavity area for the complementary positioning atop the contact stratum of a chip module. In the preferred form of the invention, the contact stratum 114 of the chip module 14 has both its longitudinal and transverse dimensions measured at the inward face, i.e. the face adjacent web B, wider than at the outward face at the exposed surface of web A. Stated another way, both the longitudinal and transverse dimensions ofthe aperture-defining portions for the aperture 15 of the web A are less than the corresponding longitudinal and transverse dimensions of the chip stratum 114, thereby preventing the chip module from passing through the aperture 15 even if the contact stratum 114 were bent. Fig. 6 shows an optional embodiment for the formation of the apertures through the first and second lamina wherein the top web is shown at A', the intermediate web at B' and the bottom web at C. The web A' has an aperture 15' and the web B' has an aperture 16' which are not bevelled cut but instead are cut orthogonally through the webs A' and B' so that the sidewalls are straight as shown at 115' and 116'. Accordingly, the I/C chip module 14' likewise has a peripheral edge 314' of its contact stratum 114' at a complementarily cut straight peripheral edge. Other purposes of the bevelled cuts shown in Figs. 4 and 5 for the aperture of 15 and edges 314 of the contact stratum 114 will be further explained in connection with the manufacturing method for the card 10 explained hereinafter. Fig. 7 shows a broken-away portion of a chip strip 17 wound on a partially-shown chip reel D in a known way, wherein two-across pairs of I/C chip modules 14 strips are provided by a manufacturer to its purchasers who may punch the modules 14 from the strips 17 for inclusion in smart cards and the like. The chip strip 17 has square pin feed holes 18 generally like those of 35mm film and also includes round registration pin feed holes 19 generally at the corners of the modules 14. The holes 18 and 19 are useful to card manufacturers in aligning and feeding the modules 14 as the chip reel D is rotated to unwind and the chip modules 14 are punched-out for placement into smart cards. The method of making the card 10 comprises the bringing together of webs A, B and C, wherein the card plies 11, 12, 13 are cut from a lamination of the webs A, B and C. The chip modules 14 are excised from the chip strips 17 and mounted to the intermediate web B. Web B is laminated to web C and web A is laminated to web B with the cavity 15 thereof over the chip module 14. The multi-web laminate is then registered and finally die cut to form the individual cards 10. For the purposes of explaining the invention, the term "collating" refers to the gathering of the webs A, B and C together in proper order for lamination. The term "aligning" refers to the positioning of the webs A, B and C relative to each other whereby the apertures 15 are positioned to nest over the chip modules 14 and the card locations and printing on the webs A and C are positioned to match and form the front and back of the card 10 when die cut. The alignment of the webs A, B and C is initiated during the set-up of the coUator/laminator before operation and is maintained throughout operation by the tractor pins in the exemplary embodiments. Alignment is therefore a continuous apparatus function. "Registering" refers to the final micro-positioning of the webs A, B and C as they are laminated and settle on the tractor or pin band pins into their final relative positioning, from which the cards 10 may be die-cut. More specifically, the manufacturing method for the making of the card 10 will be understood in connection with Figs. 8-16. In general, the processing of the webs A, B and C is achieved by feeding them through apparatus that has pin feed tractors for controlling engagement at the marginal registration holes of the webs, generally denoted at reference numeral 20 throughout, as shown in Fig. 12 for example. Therein, a tractor 21 for gripping and feeding the webs is illustrated in a standard tractor construction for use throughout the apparatus of the present system for engaging the marginal registration holes 20. It should be noted that the uses of the terms "pin band", "tractor feed", "pin feeds", "infeed", or "outfeed" "tractors", are generally interchangeable and refer to the function of engaging pin holes of the webs or sheets to move them under pin control. It will be understood by those skilled in the art that the pin bands can be one long continuous set of pins on bands, as in Figs. 14 A - C, or individual smaller versions of same, like tractor 21 of Fig. 9, used in series for engaging the registration holes 20 of the web and separated sheets to maintain them under continuous pin control. Stated another way, the pin band 61 of Figs. 14 A - C, hereinafter discussed, is in a giant tractor and tractors 21 (Fig. 9) or 66 (Figs. A and B), are midget tractors. These holes 20 function similar to the registration holes 18, 19 of the chip strip 17 on the chip reel D. The speed of the unwinding rotation of the chip reel D can be adjusted. In Fig. 12, the tractor 21 is shown in a perspective view engaging the three web laminate A/B/C, shown in phantom lines for illustration. Accurately registering the webs A, B and C in combination with precisely placing the modules 14 are major goals that can be achieved by the inventive method. The registration holes 20 are cut through all of the webs A, B and C preferably along opposite marginal edges. The illustrative tractor 21 has a pair of pin band assemblies 22 to grip the registration holes 20 at each margin. The assemblies 22 comprise endless bands 23 which have one-quarter inch pins 24 located at intervals therealong matching the intervals of the registration holes 20. At one end of the bands 23, drive sprockets 25 drive them and are connected by an axle 26. They are servo-motor-controlled, so that the speed of bands 23 can be adjusted. At the other end of the tractor 21 , guide wheels 27 guide the bands therearound and are connected by an axle 28 therebetween. A frame 29 also shown in Fig. 9 supports the pin band assemblies 22. The length of the tractor 21 is sized to accommodate web control requirements. One convenient length is 14" which accommodates four standard credit cards oriented with their greatest dimension lengthwise of the web. In order to keep the webs of cardstock material engaged to the pins 24, the tractor 21 includes guide plates 30 having slots S through which the pins 24 project for engagement thereabove into the registration holes 20. Guide plates 30' guidingly reside over the margins of the webs to the sides of the registration holes 20 as shown in Fig. 9 and partly shown in Fig. 12. T e guide plates 30' include similar slots S' matching slots S so that the pins can extend and move therethrough in a known way. The portion of the upper guide plate 30' shown in Fig. 12 is in dashed lines and raised slightly above the lower guide plate 30 for purposes of illustration. In the operable condition, it would be arranged closer to margins as shown in Figs. 9 and 10, so that the webs do not wander off the pins. The method for making the card 10 will be further understood as providing parallel, independent steps. The parallel steps can be undertaken simultaneously or at different time frames, whereby the webs A, B and C may be separately prepared before collating and laminating. The webs can thus be prepared either for immediate lamination and final cutting- out of the I/C chip cards or for lamination at a later time. The method will therefore be appreciated as offering great scheduling flexibility to a manufacturer in addition to the aforestated ability to accurately register the plies and precisely place chip modules therein. Now, turning to Fig. 8, an apparatus 31 is provided for the processing of web B and for the ultimate cutting therefrom of the ply 12 lamina of the card 10. The processing of web B will be understood as moving from left-to-right wherein a roll 32 of cardstock material, such as ABS or PVC, is provided to form the web B. The roll 32 is controlled by a hydraulic assist roll lift 33. The web is fed through a conventional splice platform 34 for connecting/splicing different webs together if necessary, and then to an in-feed nip roller 35 and a rotary punch 36, which die cuts the marginal registration holes 20 and the apertures 16. The apertures 16 are generally circular for receipt of the semiconductor chip portion 214 of the chip modules 14. The rotary punch 36 operates in conjunction with an optical scanner for controlling the tension and feed of web B also for verifying registration . An exit nip roller 37 controls the outlet of the web B from the rotary punch 36 and directs the web to an in-feed tractor 38 being substantially identical to the tractor 21 described above. The speed of the web B is controlled by a servo-motor driving the pins of the tractor 38. In preferred form, the web B is ten inches wide and allows for the locations of four cards across the web. Therefore four-across apertures 16 are sequentially punched across the web at correct locations relative to where the cards will be ultimately cut, generally as shown in dashed lines in Fig. 2. Because the chip strips 17 typically are not provided in such large widths or lengths, the preferred form of the invention envisions the utilization of four chip reels D1 ,D2,D3,D4, each having at least one chip strip 17 wound thereon and controlled by chip reel unwinders/rewinders 40,41,42,43 respectively. Multiple chip strips may be spliced together for reaching large volume capacity. Typically, double rows of 900 chip modules per row are on a chip strip. The preferred embodiment herein envisions splicing 5 strips to have about 4500 modules per side or row. Additionally, the chip strips 17 need not be limited to two across and thus may have more rows or just one. Each of the unwinders/rewinders 40,41,42,43 has a chip reel having the two-across pair of modules 14, as depicted in Fig. 7 for the chip reel D. Each chip unwinder/rewinder accordingly has sprocket engaging fingers for advancing the chip reels D1,D2,D3,D4. Manufacturers generally pre-test chip modules and if defective ones are found they are marked. The chip unwinders/rewinders 40,41,42,43 include optical scanners for locating these marks and, when one is found, will trigger fast forwarding to the next sequential pair of the chip modules 14. Just ahead of each of the chip unwinders/rewinders 40,41,42,43, an adhesive applicator 39 is provided. Both the adhesive applicators 39 and the chip unwinders/rewinders 40,41 ,42,43 are staggered lengthwise and transverse to the web B to be able to rotate and bring the chip modules 14 to be positioned directly above the apertures 16 at four locations across the web B and at four different spots taken lengthwise along the web. Thus, the reels D1,D2,D3,D4 are operated to meet the travel of web B, unlike prior art techniques requiring a robot arm to swing a chip module over and into a chip module cavity. Downstream of the unwinders/rewinders 40,41,42,43 is an outfeed tractor 44 which, in cooperation with the tractor 38, is operated by servo-motors to control the speed of the web B relative to the chip reels D1,D2,D3,D4 and the unwinders/rewinders 40,41,42,43. The web B is also controlled to position four apertures 16 each directly underneath the adhesive applicator 39, wherein preferably a hot melt adhesive, shown at 514 in Fig. 4, is placed around the apertures 16. Alternately, the adhesive can be applied directly to the chip module at its contact stratum 114 and/or the semi- conductor chip portion 214. Then the web B is moved forward to dispose an aperture 16 below each of the unwinders/rewinders 40,41,42,43, which each cooperate with a chip punch for vertically punching the chip modules 14 from the chip strips 17 on the reels D1,D2,D3,D4. First, however, an initial punching, which can be done off-line or in-line, excises about 95% of the material surrounding the contact stratum 114 and the remaining 5% is cut by a second vertical tap or punch disposed on the vertical, or the Z, axis, directly above the apertures 16. At the initial punching, a punch is used that is shaped to cut the contact stratum 114 at a bevel to form the bevelled edges 314 fully or partially around the chip module 514. The chips are then completely punched by the second punch from the chip strips 17 on the chip reels D1,D2,D3,D4 into the apertures 16. The cycle is simultaneous at each of the four unwinders/rewinders 40,41,42,43 and only a vertical punch-and-stick motion is required for insertion. This means that the chip strips 17 and web B are brought together and no X-Y horizontal axes movement of a knocked-out chip module is required, such as in the robotic arm placement apparatus in the prior art. In the disclosed embodiment, the punch-and stick operation occurs at about 100 strokes/minute. The 95 % pre-cutout is an exemplary embodiment but other percentages may be pre-cut depending upon the particular strip and cutter employed. This pre-cut serves to bevel the contact stratum edge and facilitate an easy knock-out of the chip module from the chip strip, preferably the pre-cutting leaves just enough material to hold the module in the strip. With more specificity, the apparatus for unwinding, punching chip modules and rewinding the chip strips 17, attention is directed to Figs. 8A and 8B. Therein, the unwinder/rewinder 40 is illustrated in greater detail. The unwinders/rewinders 41, 42 and 43 are substantially identical except that the inserting cylinder is placed at different locations to be staggered across the web in order to insert chip modules at the other three of the four- across card locations that are simultaneously processed in the preferred embodiment. Punch- and-stick devices for unwinders/rewinders 41, 42 and 43 are shown in dashed lines for ease of understanding their functions and locations in the system. Generally, two factors determine the orientation of the unwinder/rewinder assemblies 40, 41, 42 and 43, relative to the moving web B: (1) the head/foot arrangement of the chip modules on a chip strip provided by the manufacture; and (2) the orientation of the card locations on the web B. They are transverse in the disclosed embodiment so that the exemplary chip modules 14 are correctly placed for the proper use of the intended cards 10. If the chip modules (i.e. contact stratum and/or chip circuitry (semi-conductor portion)) were oriented 90° differently, then the unwinder/rewinders 40, 41, 42 and 43 could be placed parallel - not transverse - to the web B. Likewise, if the card locations were rotated 90° from the lengthwise arrangement as shown in Fig. 12, the unwinder/rewinder would also be parallel to the web. As would be clear, the unwinders/rewinders 40, 41 , 42, 43 can be arranged at any angle relative to the web B, particularly since a myriad of card shapes and chip module configurations can be adapted to the present method. The method and system herein are not limited to rectangular shapes and accordingly generally any angular position could be made to insert the chip modules, subject to equipment space restraints. With attention now directed to Fig. 8A, the unwinder/rewinder 40 is shown looking downstream toward it in the direction of the movement of the web B, which is from left-to- right in reference to Fig. 8. The unwinder 40 would be substantially identical to the unwinders/rewinders 41 , 42 and 43, except for the locations of the punch-and-stick cylinders, as will be explained. The unwinder/rewinder 40 includes an inserter assembly 90 that includes an unwinder reel 91 and a rewinder reel 92. The chip strip 17 is fed from the chip unwinder reel 91, which is motorized, to guide pully assemblies 93. The chip strip 17 is then pulled across a frame surface 94 over which the web B travels. The chip strip 17 is pulled by a wheel friction assembly 95 that includes a tensioner 96. The tensioner 96 biases the chip strip 17 against a two-part sprocket 97 which has sprocket fingers for engaging the chip strip feed holes 18 similar to the way a 35mm camera engages film. The sprockets 97 also are provided to index the chip strip 17 for registering the rows of chip modules 14 over the apertures 16 of the web B. The chip strip 17 is then directed around a guide wheel 98 to be rewound on the rewinder reel 92. The rewinder reel 92 is driven by a motor 99 as shown in the side elevational view of Fig. 8B. Also shown in Fig. 8B, is a stepper motor 100 for indexing the movement of the sprockets 97 to move the chip strip 17 incrementally for each positioning of a chip module 14. The unwinder reel 91 would be substantially coplanar with the rewinder reel 92 and is therefore hidden therebehind in the view shown in Fig. 8B. The inserter assembly 90 is mounted on a frame 101. Beneath the sprockets 97, a position adjuster 102 and chip placement unit 103 provide for adjusting the motion of the chip strip 17 for the placement of the chip modules 14 first from one side of the chip strip 17 and then the other. In Fig. 8 A it will be also seen that the inserter assembly 90 includes a punch cylinder 104 which resides above a die 105. The punch cylinder 104 is positioned to place chip modules into the rightmost aperture 16 in the direction of travel of the web B as shown by the arrow W in Fig. 8B, which travels, as explained, from the left-to-right in Fig. 8. Locations for the other unwinders/rewinders 41, 42 and 43 are shown at phantom line illustrations of punch cylinders 104', 104" and 104'". These locations correspond to the other three card locations when four cards-across are to be made. The stepper motor 100 therefore incrementally advances one chip at a time to the punch cylinder 104 which punches out the remaining 5% of material holding the chip module 14 to the chip strip 17 and deposits it into an aperture 16 of web B. When one side of a chip strip is fully punched, the chip strip 17 is rewound and then re-fed from the unwinder reel 91 so that the other row of chip modules are punched from the chip strip 17. The inserter assembly 90 therefore shifts to move the chip strip 17 to have the unused row of chip modules sequentially advanced to the punch cylinder 104 and die 105. A support frame 106 is provided to support underneath the plate 94, over which the web B passes. It will be also seen that the chip reel Dl is generally used to refer to both of the reels 91 and 92 collectively, because they are generally in-line across the web B as depicted in Fig. 8. Thus, at any given time, the chip reel Dl and the chip strip 17 will be either fully on the reel 91, or the reel 92, or otherwise in the process of being wound or unwound from one to the other during operation. Also, the locations of the dies for the unwinders 41, 42 and 43 are generally referenced, respectively, at numerals 105', 105" and 105' ", illustrating their positioning across the frame 106 for each of the respective positions downstream of the unwinder 40. Each of the punch cylinders 104, 104' , 104" and 104'" are solenoid activated to extend their respective plungers and punch or strikeout a chip module 14 from attachment to the chip strip 17 and place it into contact with the hot melt adhesive that has been applied to the web B. It is envisioned for the preferred embodiment that the chip strips 17 are die-cut off-line to excise about 95% of the chip strip material holding the contact strata 114 of the chip modules 14. In the preferred embodiment, the die-cutting of 95% of the attaching part of the chip strip 17 is accomplished on rotary or flat bed cutting equipment. The die-cuts are made on the bevel to provide the bevelled edge 314 as previously described. It is envisioned that a micro perforator cutting tool be used having approximately 70 teeth per inch to yield the 95% excision in the exemplary embodiment, whereby the punch cylinders 104, 104', 104" and 104"' punch out the last 5% of the strip attachment to the chip module as chip module 14 is inserted onto the web B. While the 95% removal is effective, it is not mandatory, and other percentages may be removed, as stated above. Furthermore, no pre-cutting can be done and the entire punching-out of the chip module could be in-line by modifying the punch cylinders 104, 104', 104" and 104"' to create the bevelled edge profile. As noted above, in Fig. 8B that the chip strip 17 is a splicing of several smaller chip strips to create two rows, each side having approximately 4,500 chip modules in the preferred embodiment. When the first row is run through the inserter assembly 90, the chip strip 17 is re-wound and re-mounted on the reels 91, 92 in the reverse direction and shifted, so that the other row is then lined-up ready for the punching-out of the chip modules 14 from that side of the chip strip 17. The unwinding and re-winding of each of the chip reels Dl , D2, D3 and D4 would be substantially identical, in order that two passes of each of the chip strips occurs. In regard to an alternate manner of adhering the modules to the web B mentioned above, the adhesive applicators 39 may be repositioned and used in combination with the unwinders/rewinders 40,41 ,42,43 to place adhesive at the undersides 414 of the contact strata 114, rather than directly on the web B. The web B is then draped between the outfeed tractor 44 of the apparatus 31 and a rewind feed tractor 45 and fed to a rewinder apparatus 46 which rewinds the web B with the correctly placed modules 14 around a drum 47. The tractors 44 and 45 are also the same as the tractor 21. The drum 47 can then be stockpiled for lamination at a later date or the drum 47 could be eliminated and the web B could be immediately directed to a collator/laminator for lamination with webs A and C, which will be explained. Optionally the web B might be cut into sheets, for example, having 16 card locations (4 lengthwise x 4 across). In the preferred embodiment, a conventional hot melt pressure sensitive adhesive is useful for bonding the I/C chip modules 14 to the web B, such as adhesive #590-371 made by Findley Adhesives, Inc. (Wauwatosa, WI). The adhesive preferably has low viscosity, good heat stability and will retain some flexibility upon drying. Turning now to Fig. 11, a portion of web A is shown having the four-across card locations as in the web B and shown in phantom lines. The web A includes the marginal registration holes 20 and the apertures 15 for receipt of the contact stratum 114 of chip modules 14. The dashed lines at the card locations also indicate areas where any printing would take place for the front face of a smart card, such as identifying marks, names, account numbers, code symbols, trademarks, etc. The web C is substantially the same as web A shown in Fig. 11 with the exception that no apertures 15 would be provided, because it forms a smooth bottom of the cavities formed by the apertures 15 of web A and 16 of web B, as explained. Printing would occur, however, in the same card locations on the web C for creating the backside of a credit card, telephone card, smart card, etc. Therefore, the method envisions in the preferred embodiment the processing of webs A and C on the same apparatus for subsequent lamination to web B. The only differences being that web A receives the die cut apertures 15, and the printing on the webs A and C generally would not be the same. Using the same rotary press does not guarantee equal stretching or shrinkage, known as "throw lengths", but these variations in webs would be less than if different rotary presses were implemented to process them. With reference to Fig. 13, a narrow web rotary press 48 is shown for processing web A or C. The apparatus 48 is a twelve-color ultraviolet letter press which prints and die cuts webs A or C as shown in the direction of the arrows. A reference is also shown in dashed lines for a combination web A/C prepared in connection with an alternate method for the dual processing of the webs A and C from a single web, which will be further explained in connection with Fig. 16. The apparatus 48 includes hardened punches and dies for producing the apertures 15 and for making the control registration holes 20 with the same tooling. The apparatus 48 also provides for producing the HOF sensing marks, i.e., registration indicia and optically scanning them for verifying registration and die cutter positioning. The HOF marking facilitates splicing webs, if necessary. More specifically, the press 48 includes an unwinder 49 for unwinding a roll of cardstock material and directing the web to a six-color C.I.C. printing unit 50 and then to a six-color stack print unit 51. Sensing marks for creating registration indicia will be included in all of the printing plates for identifying head-of-form (HOF) and optical web control. The HOF marking is preferably made before every image. In the exemplary embodiment the card locations are 3 1 ." long and there are four cards lengthwise for every 14" of web, thus leaving about 1 /β" therebetween. Accordingly, the HOF indicia will be preferably made every 3 £" for every row of card image locations and at a minimum made every 14" of web length. After the printing, the web is fed through an optical scanner 52 for sensing the registration indicia. Prior to punching, if overlayment of webs A or C is required, such as by providing a thin transparent layer of Mylar brand overlayment, it would take place subsequent to the printing unit 51 but before punching. The web A or C is then fed to a 14" rotary punch unit 53 in the exemplary embodiment, which cuts the registration holes 20 and has a punch shaped to form the reverse bevelled sidewalls 115 of the aperture 15 in web A, as shown in Fig. 4. After punching, the web A or C is then fed to a rewinder 54 and can then be taken to apparatus for collating and laminating with web B. Optionally, webs A or C may be fed to a sheet cutter 55 and cut into flat stackable sheets for later lamination. If cut into sheets, the lengths are cut so that the HOF registration indicia sensing marks would appear at least once on each sheet for web control during lamination. At this juncture in the method, the webs A, B and C are ready to be collated, aligned, laminated, registered and then die cut to form the cards 10. The webs A, B and C must be brought together so that the card image locations of webs A and C, and any printing thereon, are in alignment along with the alignment of the apertures 15 and 16 , whereby the I/C chip modules 14 can be precisely arranged within the cavities formed by the apertures 15 and 16. In the preferred embodiment, all of the webs A, B and C must be doctored to remove any defective sections of web. The lamination of webs A, B and C is accomplished by coUator/laminator apparatus 56 shown in Fig. 14. The apparatus 56 comprises a hydraulic assist roll lift and pneumatic core shaft holder 57 for controlling rewound the web C on the roll 54 obtained from the apparatus 48. The web C is controlled by an automatic unwinder 58 having sensor loop height control and web tensioner 158 which directs the web to an adhesive or chemical solvent applicator 59 for the appUcation of same. The webs A and C both preferably have the inward "satin" or textured unprinted faces for bonding to the opposite faces of the web B. The web B would also preferably have "satin" or textured faces on both sides to facilitate bonding. The web C is drivingly engaged by a continuous pin band 61 for controlling the web C and pulling it through the adhesive applicator 59. The web C is directed to laminating nip rollers 62 where webs B and C are laminated. The apparatus 56 also includes a separating means in the form of hot blade separator and roller 162 which may be optionally operated for separating web C into sheets as an alternate method described later herein. The web B is arranged on the drum 47 shown, which drum was obtained from the apparatus 31 of Fig. 8, and is controlled on an overhead unwinder 60 having hoists, loaders, pneumatic core holders, feeders, pullers and tensioners of the kind generally known in the industry. The web B is guided by a roller 159 therearound to the laminating nip rollers 62. It is important to the invention to utilize an adhesive or chemical solvent that creates fluidized bonding interfaces between webs A-B and B-C wherein there is not an immediate fixing of the plies, but rather the interface bonding remains "open", or pre-set, until all webs are properly brought together for final registration. The method therefore envisions adhesion by chemical bonding at ambient temperatures. Heat may be employed to dry the adhesive and drive off solvents, but no thermo-bonding using heat to plasticize the webs and pressure to force plasticized lamina together as used in the prior art, is employed. Prior techniques for laminating employ high pressure and temperatures to plasticize the laminas, e.g. approximately 170°F. for PVC and approximately 205°F for ABS, which temperatures have to be maintained for a long dwell times in order for the mass of plastic to reach the necessary fusion temperature. Heat is therefore not used to fluidize a bonding agent as in the prior art, but rather just the opposite, i.e., to dry (make tacky) the chemical bond and control the open time thereof. The adhesive bonding agent is applied at ambient room temperatures. An example of an adhesive solvent formulation which allows for an open time of about 2 to 3 seconds for PVC and ABS comprises: 20% VYHH (86% vinyl chloride and 14% vinyl acetate) - solution vinyl resin, 40% MEK (Methyl Ethyl Keytone) and 40% toluene. Another formulation allowing an open time of about 1 to 1.5 seconds for PVC and ABS comprises: 25% VAGF (81 % vinyl chloride; 4% vinyl acetate; and, 15% hydroxyalkyi acrylate) - solution vinyl resin and 75% acetone, and equivalents. The web B is pulled through the laminating nip roller 62 on top of web C by means of the continuous pin band 61 drivingly engaging the registration holes of both of the webs. The pin band 61 would also serve to keep the web B under control in an alternate method wherein the web B is separated into sheets. A hot blade separator 161 shown in Fig. 14B is alternately provided for the separation of web B into sheets and whereby the pin band 61 maintains web control in cooperation with an outfeed tractor 66, so that web and sheet control is achieved before and after the hot blade separator 161. In the preferred embodiment for an all-web non-sheeted process, both the webs B and C are maintained in integral web-form and are directed to laminating nip rollers 65 where web B receives thereover the web A. The web A is fed from a roll 54 which has been similarly obtained from the apparatus 48 of Fig. 13. The roll 54 is held on an automatic unwinder assembly 64 substantially the same as the overhead unwinder assembly 60 for the roll 47. The web A is directed to an adhesive applicator 63 and then guided over a roller 163 to the laminating nip rollers 65. The webs A, B and C are pulled through the laminating nip roller 65 by means of the continuous pin band 61 engaging the registration holes 20 of the webs A, B and C. As the laminating webs A, B and C pass through the laminating nip roller 65, the opposing rollers thereof press the laminas together and press air bubbles outwardly thereof. The outfeed tractor 66 is substantially identical to the tractor described in Fig. 9 and it and the pin band 61 are driven by servo motors in a standard way. The pin band 61 is preferably one long tractor, whereas the tractor 66 is shorter, like the tractor 21. As the tractor 66 and pin band 61 pull the laminate A/B/C through the laminating nip rollers 65, the laminate registers and the adhesive at the bonding interfaces between webs A-B and B-C remains in an open, pre-set condition. In the prefeπed embodiment for the apparatus 56, a hot air dryer 83 is arranged downstream of the laminating nip rollers. Therein, heat is applied to drive off solvents and make the bond tacky. The heat at the hot air dryer 83 is not used to fluidize the bond or plasticize the lamina contrary to the utilization of heat in the high pressure, high temperature techniques of the prior art. The hot air dryer 83 operates at a control temperature preferably in the range of 200-210°F. The dwell time is brief, about 1.2 to 1.3 seconds at normal operating speeds for the exemplary embodiment. The dryer does not plasticize the lamina and their surface temperatures are maintained substantially below their plasticity or softening temperatures. The method will accordingly be understood as providing for a chemical bonding or welding to form the laminate A/B/C that avoids the previously known techniques for lamination of plastic stock, such as made from PVC or ABS, wherein the industry presently fuses these layers together under high temperature and pressure for long dwell times of from about 10 minutes up to one hour or more while in a sheet - not a web - process. A further inhibiting factor in conventional lamination methods is that a cooling down period is thereafter required, which may add an additional 30-60 minutes of time. The laminate A/B/C is puUed through the hot air dryer 83 by the outfeed tractor 66, which again has substantially the same construction as the tractor 21 of Fig. 12. The tractor 66 acts in combination with the continuous pin band 61, each having identical pins, generally denoted at 24, for engaging the registration holes 20. Alternately, the lamina, webs A, B and C, may be briefly heated at about 200 °F before, or after, the application of the adhesive bonding agent in order to tackify the adhesive to a preferred viscosity and control the open time thereof. In any such heating the actual temperature of the lamina is kept well below the softening point of the web material. Also, line speeds can be varied to accommodate the open time of a particular bonding agent used. In any event, the lamina are not heat-distorted as in conventional laminating processes, heretofore used for card-making. With reference to Fig. 10, a detailed cross-sectional view of the tractor 66 is shown, which is substantially identical to the generally described tractor 21 shown in Fig. 9. It will be seen that the webs A, B and C have their registration holes engageable by the pins 24 and are pressed together by the laminating nip rollers 65 and guided between the guide plates 30 and 30'. Because the interfaces between the plies have the open bonding condition, they are allowed to shift relative to each other so that the pins 24 may fully engage all the registration holes 20. Subsequent relative shifting movement is permitted for attaining proper registration on the pins 24. The pin band 61 has identical pins 24 for achieving web registration in combination with the tractor 66. Also, in further reference to Fig. 4, it will be understood that the laminating nip rollers 65 push downwardly in the direction of the arrow, so that the bevelled sidewalls 115 are brought down to nest around the bevelled edges 314 of the I/C chip modules 14. In order that conect registration can take place, as the drive sprocket 25 rotates to bring the pins 24 into alignment, it is important that webs A, B and C settle down on the pins and do not wander upwardly out of position. Therefore, it will be seen that the pins 24 are made to include a base 24a which is mounted to the band 23. A shaft 24b extends from the base 24a and terminates in a bullet-nosed end 24c. The combined height H of the laminate A/B/C as stated is approximately 0.030" thick to meet an industry standard. This is usually achieved with a tolerance of approximately +/- 0.0008". Accordingly, the length of shaft 24b generally denoted at H' should be no less than height H, so that the webs A, B and C do not slip upwardly onto the bullet-nosed end 24c, but instead are concentrically retained at the shaft 24b until the fluid bonding interfaces set up, although not reaching full adhesive curing. In the disclosed embodiment the line speed of the coUator/laminator 56 is from about 90 to about 110 feet/minute which provides a substantiaUy greater card production rate than the prior art. Line speeds can be adjusted depending upon the open time of the adhesive and chemical solvent utilized or the open time of the adhesive might be varied by changing formulation or applying heat to dry and tackify the fluid bonding interfaces. Once the laminate A/B/C passes the tractor 66, the setting between the interfaces of the registered webs can occur, because the translational motion of the laminated webs by then will have taken place to reach the desired registration and a secure nesting of the contact stratum 114 is made, as shown in Fig. 5. It is significant that the invention encompasses bringing a cavity or aperture onto a chip module rather than placing a chip module into a cavity. SpecificaUy, the aperture 15 is brought atop the contact stratum 114 of the chip module 14, shown in the step sequence from Fig. 4 to Fig. 5, which motion is achieved at the laminating nip rollers 65. A nesting or seating motion of the contact stratum 114 relative to the sidewall 115 is allowed to occur as the laminate A/B/C then passes through the lamination nip rollers 65 wherein the webs are urged together and the webs settle on the pins 24. In the apparatus 56, the laminating nip rollers 62,65 and 82 (when alternately used) are relieved in the area sunounding the I/C chip modules 14 so that, as opposing rollers thereof smooth the laminate and air bubbles are forced out, there is no harmful force bearing on them. When the laminate A/B/C exits the tractor 66, it is directed to a four-post reciprocating die cutter 67 shown schematically in Fig. 15. The laminate A/B/C is draped between the tractor 66 and an in-feed tractor 68, which is operated by a drive unit servo¬ motor, the feed and movement speed of which is controlled by an optical scanner and servo- control 69. A second feed tractor 70 directs the laminate to a precision die cutter 71, which is preferably a reciprocating, not a rotary, press. Generally, rotary cutters do not achieve the desired edge profile in the thickness of material here involved. One such type of device is made by PRECO Industries, Inc., Lenexa, Kansas, which manufactures an automatic optical registration and precision die cutter that allows for the scanning of the HOF sensing marks and completes repetitive precise cutting of the laminated webs at the same relative location for each row of cards. Thus, throughout the method steps explained herein the relative positions of the printed images on the surfaces of webs A and C and the apertures 15 and 16 are maintained, so that web registration, alignment, chip module placement, and card cutting, are achieved in-tine in a reliable and an accurate fashion. Enlarging the pin feed holes on any of the webs A, B or C is an option useful for registration when a web has an intolerable throw length discrepancy from the other webs. In the exemplary embodiment for the invention, the immediate cutting of the laminate A B/C into the I C chip cards 10 can occur while the bonding interfaces are not fully cured and are still in a semi-fluid, viscous, condition. The uncured bonding is however quite sufficient for maintaining the plies, 11 , 12 and 13 in the desired final registration alignment, and sufficiently set to allow the cards 10 to be die cut from the laminate A/B/C. A final cured chemical bonding is not reached as the laminate moves from the apparatus 56 to the reciprocating die cutter 67. If, however, there is a delay before feeding the laminate to the die cutter 67, or if the laminate A/B/C might altemately be die cut into sheets for later cutting of the cards, then a final curing of the bonding interfaces would eventuaUy take place and the cards 10 might be cut out from the laminate in the cured condition. Thus, the invention encompasses the cutting of cards from a laminate either where the bonding interfaces are still semi-fluid (not cured) or are fixed (fully cured). Once the cards 10 have been cut by the die cutter 71 , the laminate is pulled by an out¬ feed tractor 72 to a roller assembly 73, which directs the waste matrix 74 upwardly as shown by the arrow and drives the cards 10 in the direction of the aπow 75 to be accumulated in a stack at 76. The tractors 70 and 72 are also substantially identical to the tractor 21. The method also allows for the application of magnetic striping onto the laminated webs A, B and C before cutting the cards 10 from the matrix. The ability to apply magnetic striping in a web process is an important improvement over the prior art techniques, which have required magnetic striping, e.g. for encoding of various information, to be done only in a sheet process. The present method may employ magnetic tape, thermo transfers, or slurry extrusion forms of striping. The prior art has been generally limited to taping or screen printing and does not make possible the application of an extruded slurry to form the magnetic striped portion. Thus the present invention allows for this magnetic striping to be appUed to a web without requiring the laminate to be cut into sheets or cards. Preferably the magnetic extruded slurry, thermo transfer or tape is applied to web C before the laminate A B/C is formed, but could be applied to the web C of the formed laminate A/B/C in a step undertaken between the apparatus 56 of Fig. 14 and the die cutter 67 of Fig. 15, which die cutter 67 would subsequently cut the cards 10 from the matrix. The foregoing method is prefened. However, if excessive throw length variations occur due to materials, apparatus variations, or processing conditions the following altemate methods may be employed. Altemate Methods 1. An altemate method utilizes the simultaneous processing of the top and bottom webs A and C by the rotary press 48. Specifically, in reference to Fig. 16, it will be seen that a web A'C is formed to have one-half of the web comprising a top web, noted at A', and a bottom web, noted at C for, respectively, ultimately forming the top plies 11 ' and bottom plies 13' of the I/C chip cards 10 of the invention. The rotary press 48 is provided to punch registration holes 77 at marginal edges similar to the registration holes 20 shown in Fig. 11, for example, but further additionally punching two strips of central registration holes 78, which are evenly spaced to either side of the centerline 79 of the web A'C. The web A'C is preferably formed to have the same width as previously-described webs A and C, i.e., 10" (254mm), with four 2Vβ" (53.98mm) wide card locations across, but wherein the zones or web margins within which the registration holes are punched are nanower. In the exemplary embodiment, the registration holes 20 are located in (14.29mm) wide margin zones along the edges of the webs A, B and C. In web A'C, the registration holes 77 are located within t " (7.94mm) wide marginal zones and the registration holes 78 are also punched within zones ? 1<5 " (7.94mm) wide to either side of the centerline 79. In this way, a 10" (254mm) wide web can also be processed by the apparatus 48 with only the slight alteration of the die cutter. It will be understood that the side forming the web C does not receive any chip module apertures, but the side forming the web A' receives, as for web A, the die cutting of the reverse-bevelled apertures 15', as shown. The purpose for the simultaneous processing of web A'C, is to duplicate the identical stretching or shrinkage throw lengths of these webs so that after they are separated along centerline 79, they can be repositioned by scanning the registration indicia in accurate placement relative to each other for lamination at the coUator/laminator apparatus 56 of Fig. 14. Usually, by processing the webs A' and C simultaneously on the same rotary press, they are stretched or shrunk in the same way to have substantially the same throw lengths, so that when they are separated and later laminated, registration is more readily assured. As a result, there is only the need to accommodate any throw length discrepancies with regard to the intermediate web B. This altemate therefore also addresses the collating problems caused by these stretching and shrinkage factors known to the printing industry, since printing takes place on circular plates but the ultimate product produced is of course a three dimensional flat object, such as a credit card. This altemate method using the A'C composite web allows for the side-by-side printing and punching of registration holes in the top and bottom webs A'and C. After they are split along centerline 79, the separated webs A' and C can be collated in the same sequence in which they were printed. The positions of the sensing marks and registration holes would therefore conespond. 2. It is further envisioned as an important altemate method that the web B may be separated into sheets and then laminated to the webs A and C as shown in the steps describing the coUator/laminator 56. This altemate therefore may be used to further accommodate web inconsistencies by allowing shorter lengths of web B to be relatively translated to the webs A and C, inasmuch as the webs A and C are preferably made on the same rotary press. Accordingly, for this altemate, the hot blade separator 161 in Fig. 14B would be employed in connection so that the web B is severed and the sheets cut therefrom are under control on the pin band 61 and the trailing web is also under control on the pin band 61. The use of a hot blade separator causes the plastic material to contract and form a gap so that as the sheets settle on the pins of the pin band 61 they do not "shingle" back against the following web. Lamination of sheet of web B to web C occurs at laminating nip rollers 82 instead of the laminating nip rollers 62. The use of a hot cutting device such as the hot blade separator 161 is employed in the exemplary embodiment, but other alternates that provide for removing the strip of material to form the separated sheets could be used such as lasers, mechanical cutting blades, band-type cutters and the like. The web B is cut into sheets that would have a shorter length than a comparative length in the web process. For example, if the sheets were to be cut in a length to have four card locations lengthwise of the sheet, they would be cut approximately 1/16" (1.6mm) less than a conesponding length in the web method previously described preferably by using a hot blade separator, which causes the web to shrink approximately 1/16" (1.6mm). In the prefened embodiment four card locations would occupy a 14" (35.56cm) length of the webs A, B and C. Accordingly, in this altemate the sheet lengths are about 13 15/16" (35.40cm) long and have sixteen cards (four across x four lengthwise). As an option, the web B could be made to initially have the shortened length of 13 15/16" (35.40mm) for the four card location and simply be cut at each said length. This is required so that as the sheets are cut they have room to translate slightly backward into registration, if necessary, without deleteriously "shingling" back over the front edge of a succeeding sheet. The registration of individual sheets of web B handles the throw length inconsistencies better than a web process, since each sheet only need to be registered on the webs A or C. The webs A and C, as noted, would have less tendency for inconsistency because they are made on the same rotary press. In the foregoing option wherein web B is initially made to already have the shortened length, the pin holes 20 thereof could optionally be enlarged, or oversized, to allow for more registration translation leeway. A corollary altemative to the lamination of sheets of the web B is a combination with the foregoing altemate no. 1 whereby the webs A', C are commonly formed on the rotary press, then separated and rolled onto drums ready for lamination. In this way, a web B is similarly cut lengthwise to match the number of card locations on the nanower webs A', C, then the nanower web B would be unrolled from the drum 47 to be pulled by the pin band 61 to the hot blade separator 161 where it is severed to be separated into sheets and laminated over web C as previously described for laminations to web C at the laminating roUers 82 in this altemate 2. Of course, the number of cards, size of cards, and card locations could widely vary depending upon the needs of a particular industry. Additionally, a web B might be initially processed to have the same width as the webs A', C without the need to cut it lengthwise. This corollary altemate would accommodate circumstances where there are greater throw length inconsistencies by virtue of the formation of the webs A', C simultaneously on the rotary press 48 in combination with the sheeting of web B. Accordingly, webs A' and C would have substantially identical stretch or shrinkage discrepancies and the sheets of web B would be individually registered with the webs A' and C to achieve even further registration accuracy. Preferably, one web will remain intact (continuous) and any or all of the other webs are cut into sheets in the in-line web process described. 3. Another altemate method envisions the pre-cutting of the web B into sheets rather than rerolling it on the roll 47 shown in Fig. 10. This requires another modification of the coUator/laminator apparatus 56 by the replacement of the overhead rewinder 60 with a sheet feeder. The sheet feeder would feed the sheets of web B to the pin band 61. This also envisions cutting the sheets to be a little bit shorter, i.e., on the order of about one-sixteenth inch less than the 14" length in the exemplary embodiment for a 4x4 card array, so that the sheets are allowed to translate backward during registration and not harmfully impinge against a successive sheet being fed therebehind. Therefore, when forming the sheets of web B in the above-described alternates, it is envisioned that rather than 14 (35.56cm) full inches, a 1/16" (1.6mm) buffer are cut out to prevent the sheets from shingling as the webs longitudinally translate when the registration holes settle down on the tractor pins during lamination. Thereby, the final laminate registration of web B in this altemate again only needs to be made for each sheet in respect of the webs A or C. Because the webs A and C are preferably made on the same letter press 48, they would inherently have less chance for throw length discrepancies between them. The lamination/registration is therefore the same as altemate 2. 4. A most prefened altemate method envisions separating webs A and/or C into sheets and laminating them to an uncut web B. As in the preceding altemate, if the webs A and C were made on the same press, they would have closely similar stretch or shrinkage discrepancies, and their relative motion for registration with web B is substantially the same at both sides of web B. However, they need not be made on the same press apparatus for this altemate. In this altemate embodiment, the web B is kept integral and either or both of webs A and C would be separated into sheets, respectively, at hot blade separator 162 or 165, after they are unwound from their respective rolls 54. Fig. 14C schematically shows the separation of web C into sheets at the hot blade separator 162 for subsequent lamination to web B at laminating nip rollers 62. As in altemate 2, when webs A or C are separated into sheets, they are also cut short the same amount as set forth for web B sheeting in order to prevent shingling back against the edge of the web following them behind. Thus, forming sheets from webs in-line preferably includes making the separated sheets shorter. Web B is the thickest web in the disclosed embodiment, and is therefore the most dimensionally stable. Similar to the requirement for web and sheet control in the foregoing altemate 2, the utilization of the pin band 61 and the tractor 66 comes into action for maintaining both web and sheet control to either side of the separators, which would be required to keep the sheeted webs A and/or C under control, so that as a sheet is cut, both the sheet and the trailing edge of the web coming from the rolls 54 are both controlled by a tractor. For the sheeting of the web C, reference is made to Figs. 14A and 14C wherein the hot blade separator 162 is employed to separate the web C into sheets. The pin band 61 controls the cut sheets downstream of the hot blade separator 162 and the intact web upstream of the hot blade separator 162. Lamination of the sheets of the web C to the web B occurs at the laminating nip rollers 62 under control of the pins 24 on the pin band 61. If web A is required to be separated into sheets, then a hot blade separator 165 is employed to sever web A into sheets wherein the sheets are controlled on the pin band 61 and the in-feeding remaining web portion of intact web A is also under control on the pin band 61. Lamination to web B occurs at the laminating nip rollers 65. It would therefore be clear that either or both of webs A and C could be cut into sheets for lamination to the web B therebetween, whereupon at lamination the laminate A/B/C settles down on the pins of the pin band 61. It would be appreciated that in the foregoing alternates for separate the webs into sheets, it is important that to the upstream and downstream side of the hot blade separators a pin band or tractor is provided to keep both the cut sheets and the intact web in alignment under pin band and/or tractor control. For the prefened altemate embodiments, the separating of webs into sheets occurs before lamination at the respective laminating nip rollers. Also, in the foregoing sheet- forming alternates, one web preferably stays intact. However, it is an altemative to separate all webs into sheets along a common line, or joint, of separation, which would require the continuous pin band control of all sheets and the pre-cut intact webs up to and through card- cutting and separation of the waste matrix 74 at apparatus 67. Yet another way to separate all webs into sheets would be to steppingly stagger their lines of separation so that the sheets overlap and do not have common links of separation, whereby pin band control would only be needed through the final lamination step at the apparatus 56. 5. Still another altemative comprises the lamination of a web A or web C onto web B in a first phase registration; then a subsequent lamination and registration of the other web. This is also a benefit when there are problems with disparate throw lengths between web B and webs A or C. A/C or B/C are thus pre-registered and laminated first. Additionally, first laminating a web A atop a web B may be beneficial when encountering I/C chip modules that offer minimal areas of adhesive surface underneath the contact strata 114. 6. The invention offers an additional advantage by allowing for the stockpiling of web B, whether in roll or sheet form, for lamination at a later date. This also allows for a manufacturer to make webs A, B or C separately and then bring them together when needed. Such could take advantage of equipment and personnel scheduling so that the webs could be processed, i.e., printed, die-cut, marked, etc., at optimal times. In addition, frequently the chip manufacturer's placement of the globule of epoxy over the semiconductor chip portion lacks precision, such that the height of the chip module is greater than intended. In this regard, if the I/C chip modules 14 were mounted at web B, for forming the ply 12 of the card 10, the height of the chip portion 214 and the epoxy covering might be greater than the thickness of web B. Accordingly, the invention further envisions the optional step of directing the processed web B with the chip modules thereon to a grinder or sanding apparatus to remove any excess epoxy around the semiconductor chip portions 214 of the chip modules 14. Otherwise, excess epoxy might create seating problems. For purposes of this disclosure the term "integrated circuit chip portion", "semi¬ conductor chip portion", or "I/C chip portion" all referenced generally at 214 have been discussed herein as including the protective material, usually epoxy that manufacturers employ. Therefore, the epoxy is included in reference to the height or part of the chip modules accommodated by the apertures 16. 7. It is also possible to make a web B with chip modules 14 thereon pursuant to the present invention, but having no registration indicia and/or no registration holes. A purchaser could then place its own markings and registration holes, as needed. Also, the web could be cut into individual cards with chip modules on them as cartridge like units for subsequent use. 8. Yet another option provided is the ability to create additional cavities for increased chip circuitry or memory capacity, as shown in Figs. 2 A and 2B. Therein the aperture 16 is linked to other apertures 16A and 16B in Fig. 2, or individually to other apertures 16C and 16D in Fig. 2B. The apertures 16A-D form discrete cavities for additional I/C chips, semi¬ conductor circuitry, or the like, and would be covered by the webs A and C at either side. 9. It will also be appreciated by those skilled in the art that the present lamination method and altematives would be highly effective for the manufacture of credit cards and the like that are not of the "smart" variety by means of the registration occurring while the bonding interfaces remain fluid and allowing the webs to translate into a final registration position before the bonding interfaces set. In this optional method, the webs A and B could be processed with the registration holes punched therethrough and the HOF sensing marks placed thereon, but the die cutting of the aperture 15 in ply 11 or aperture 16 in ply 12 would be eliminated when no chip modules are involved. The printing of the webs A and C would be the same. 10. Within the scope of the disclosed method it is also possible to form a chip module retentive cavity through only the upper web A, wherein web B would be non-cut and provide a bottom wall to the cavity cut through web A. In this way, the web C might be eliminated or provided as the third lamina. If the web C were eliminated then any printing, marking of symbols, etc. would be made on the exposed surface of web B. The same method could be used for laminating wherein the webs are brought together and registration occurs as the registration holes settle down on the pins. Of course, in this embodiment, web B does not have the cavity 16 for receiving the semi-conductor chip portion of the chip module but could have adhesive placed on it at the chip module locations to secure the chip module for receipt within the cavity of the web A. The step of placing the chip module onto web B is made on the surface of web B, but without the receipt of the semi-conductor chip portion within a cavity or aperture. Thus, the aperture 16 as shown in Fig. 2 is eliminated. Preferably, the webs A and B could be laminated immediately after the chip module has been placed on the web B and without winding web B on a roll. It is envisioned for this embodiment that it is desirable to mount chip modules that have a flat bottom surface enabling the adhesive bonding onto web B. 11. Except for altemate 10, the foregoing embodiments have envisioned the through- cutting of both the webs A and B to form the apertures 15 and 16, respectively. However, it is also within the scope of the invention for web B to have a recess formed therein, which forms a pocket for the semi-conductor portion 214 of the chip module 14. The recess or pocket could be made by, for example, die punching, vaporization through laser milling, or mechanical milling and the like. The chip module 14 could be placed by the chip insertion steps as in the prefeπed embodiment followed by the lamination of web A and subsequent web registration during the open period of the chemical bond with the chip module 10 nesting within the cavity 15 of the web A. The above-described steps for the prefened and altemate embodiments would take place in the same respective fashion whereby cards 10 might be cut having at least plies 11 and 12, and optionally 13. The provision of web C would be optional in this arrangement inasmuch as the bottom surface of web B would remain imperforate with no die cutting of an aperture therethrough. 12. The invention further envisions the altemative method of forming a lamination of the webs A, B and C as in the prefened embodiment but absent the die-cutting of chip module cavities through either of the webs A and B. In this altemate, the webs A, B and C may be laminated in the method of the prefened embodiment. The registration indicia also may be optionally applied to the webs A, B and C, and the method may also optionally include the printing of the exposed surfaces of the webs A and C. Thereafter, the webs are collated at the apparatus 56 as shown in Fig. 14 and the bonding media applied at the interfaces between the first and second webs A and B respectively and between the second and third webs B and C, respectively. The webs either all together, or in pairs, are laminated and subsequently registered while the bonding media remains open. Subsequently, the lamination may be cut into cards immediately while the bonding media is not fully set, or optionally cut into cards later after setting (curing) has fully occuned. This altemative also envisions the optional step of milling a chip module cavity into the webs A and B, or optionally web A alone, followed by the insertion of a chip module 14 from a chip reel D. Accordingly, the invention encompasses the lamination of webs to form a cardstock material from which cards may be cut without inserting a chip module during the formation of the laminate. It will be appreciated that lamination occurs in the methods herein disclosed where two or more laminas are brought together, for example, at laminating nip rollers, wherein a fluidized bonding interfaced has been created between laminas. 13. A modification to the foregoing altemate 12 is to provide a lamination of the webs A, B and C to form cardstock wherein the process does not include step of placing registration indicia on the webs. Thereby, the laminate could be made for use by a customer in its own card-making process. 14. It will be further understood that the method described in here may be utilized to provide a lamination of the web A over the web B whereby the web C would be eliminated and the semi-conductor portion 214 as shown in Fig. 5 would be exposed. This altemate with web C eliminated allows the outward exposure of the semi-conductor chip portion for outside communication as might be needed in certain and future applications for integrated I C chip modules. Additionally, the chip module 14 might have its own bottom i.e. a bigger mass of protective material, for example epoxy, which could be ground to be flat and co¬ planar with the bottom of the web B in an in-line grinding step. This altemative would also allow for the possible receipt of a hologram, or other substance having a thickness too great to be attached to a card surface, capable of being attached at the exposed, semi-conductor chip portion of the chip module 14. Achievements of the Invention Accordingly, the invention provides an I/C chip card-making method that accommodates the heights of I/C chip modules by varying the thicknesses of the laminated plies to accept different chip module dimensions. The invention also successfully achieves and an in-line alignment of the webs, and chip module insertion within a cavity, before final registration by allowing bonding interfaces to remain fluid for relative web translation into final registration and for the motion of a chip module relative to a cavity or aperture. Importantly, the chip cavity is brought down atop the chip module rather than inserting a chip module into a pre-registered cavity. Further, the invention allows for the bevelling or tapering of the chip module cavity to accommodate complementarily-shaped edges of the contact stratum thereof to be nested beneath the sidewalls of the beveled cavity and allow room for the two to move relative to each for seating. The method achieves quite close tolerances between the edges of the aperture on the card face and the contact stratum exposed at the face of the card. The method uses a chemically-welded, cold bonding lamination at ambient conditions that does not plasticize laminas, such as by heat and pressure. The cards may be cut from the matrix while the chemical bond is still not cured, but is still fluid. Another advantage offered by the invention is the capability of providing magnetic striping to the exposed surface of the web C in a web process before the lamination with webs A and B. Altemately, the magnetic striping could be placed on the web C after the lamination. The magnetic striping can be achieved by the application of an extruded slurry, the attachment of an adhesive magnetic strip, or by means of a thermo-transfer magnetic striping. The advantage is that the magnetic striping may be applied in a web process which offers significant benefits over the prior art techniques. It will be further appreciated by those skilled in the art that the inventive method also allows for the sheeting of one or more of the webs A, B or C, as explained herein above, in order to accommodate, as necessary, accumulated throw length variations of an undesirable amount. The method for forming the prefeπed embodiment of the IC chip card 10 offers a distinct advantage over prior art techniques which have inserted chip modules into a blind or hollow cavity. Those prior techniques, hydraulic back pressure during chip module insertion can occur due to the enclosed cavities since ambient air must be rapidly displaced in order to accommodate the chip module. This prior art deficiency is overcome in the method for the formation of the present I/C chip card by the utilization of the through-holes 15 and 16 wherein the cavities are open at both sides and during lamination no hydraulic back pressure is encountered. The present invention also overcomes prior art deficiencies encountered by milling techniques to form a cavity. Because the apertures through the webs A and B are die cut and the webs subsequentiy laminated to the web C, the exposed back surface of web C receives no milling pressure or other harmful forces and therefore provides a flat, smooth back to the I/C chip card 10. Previous industry methodology involving milling, and molding also often result in a wavy, rippled or distorted surface undemeath the cavity and or the exposed back face of the card. The present invention is further advantageous over the high heat and pressure laminating processes heretofore employed by virtue of eliminating these temperatures and achieving a relatively "cold" weld. Thereby, the printing dots in the images formed on the exposed surfaces of the card may be made distortion free because the laminas are not plasticized under high pressure and temperature which can distort the printing screen. This a particular concern when high quality graphics are required. Other achievements will be understood from the foregoing description. The foregoing articles of manufacture, methods and systems for the manufacture of same have been discussed in connection with the prefeπed and altemate embodiments thereof, which should not be construed as limiting the scope of the claims appended hereto and the broad range of equivalents encompassed therein.

Claims: What Is Claimed Is: 3 201. In combination, an integrated circuit (I/C) chip card substrate having a pluraUty of cavities and a pluraUty of I/C chip modules, each of said I/C chip modules having a memory portion and a contact portion, the contact portion being positioned on and extending above the exterior surface of said substrate, the memory portion disposed within one of said substrate cavities, the I/C chip modules being bonded to the substrate. 202. The combination of claim 201 wherein said substrate includes marginal registration holes for driving engagement by a pin feed means. 203. The combination of claim 201 wherein said cavities have a depth substantially equal to the height of said memory portions. 204. The combination of claim 201 wherein said substrate has a thickness in the range of from about 0.016" to about 0.022". 205. The combination of claim 201 wherein a bond is formed between the contact portions and the substrate. 206. The combination of claim 201 wherein said cavities extend through said substrate. 207. In combination, an integrated circuit (I/C) chip card substrate having a plurality of regularly spaced cavities and a pluraUty of I/C chip modules, each of said I/C chip modules having a portion at least partly disposed within one of said substrate cavities, the I/C chip modules being bonded to the substrate. 208. The combination of claim 207 wherein said substrate includes means for subsequent registration during lamination to another substrate for forming an I/C chip card. 209. The combination of claim 207 wherein said cavities have a depth substantially equal to the height of said I/C module portions disposed therewithin. 210. In combination, an integrated circuit (I/C) chip card having a cavity and at least one I/C chip module adhesively-bonded to the card at said cavity, said I/C chip module having a memory portion and a contact portion and being positioned on and extending above an exterior face of said card, the memory portion being disposed within said cavity, and said contact portion being wafer-like and having means for electrical communication with the chip portion. 211. In combination, an integrated circuit (I/C) chip card having a cavity and at least one I/C chip module adhesively-bonded to the card at said cavity, said I/C chip module having at least a portion thereof being disposed within said cavity. 212. A method for making a laminate with I/C chip modules, each I/C chip module having a first portion and a second portion, said method including the steps of: (a) feeding a first web of material to a first station for forming I/C chip module apertures at regular intervals fully therethrough, each sized to accommodate the second portions of I/C chip modules; (b) feeding a second web of material to a second station for forming I/C chip module apertures at regular intervals fully therethrough, each sized to accommodate the first portions of I/C chip modules; (c) applying adhesive to said second web of material for bonding I/C chip modules to said second web of material; (d) placing I/C chip modules onto said second web of material with the first portion of each I/C chip module disposed within a respective module aperture of said second web and bonding the second portion of each said I/C chip module to said second web of material; and (e) laminating said first and second webs of material together to dispose the second portion of said I/C chip modules within the I/C chip module apertures of the first web of material. 213. The method of claim 212 including the step of forming registration holes in said first and second webs and engaging said registration holes with pins of a pin drive means. 214. The method of claim 213 including forming at a temperature below the softening temperature of the web material, fluidized bonding layers between said first and second webs. 215. The method of claim 214 including the step of maintaining said fluidized bonding layers in an open state during said laminating step. 216. The method of claim 213 including the step of registering the webs of material following the step of placing the I/C chip modules. 217. The method of claim 216 wherein the step of registering the webs of material occurs during the step of laminating. 218. The method of claim 216 including feeding the laminate to a means for cutting cards from the laminate, each card having at least one I/C chip module. 219. The method of claim 213 including applying aUgnment indicia to said first and second webs of material. 220. The method of claim 219 including electronically sensing said aUgnment indicia to verify the positions of said first and second webs of material. 221. A method for forming laminated cards having at least three laminae and at least one I/C chip module mounted within each card, comprising the steps of: (a) forming apertures through first and second laminae shaped for accommodating portions of 1/C chip modules therein; (b) adhesively attaching I/C chip modules to said second lamina to anange first portions of said I/C chip modules within the apertures of said second lamina; (c) applying fluidizing bonding media at intended interfaces between the first and second laminae, and between the second and third laminae; (d) laminating said at least three laminae to form a laminate having the second portions of said I/C chip modules to be disposed within said apertures of the first lamina; and (e) cutting cards from said laminate having at least one I/C chip module within each card. 222. The method of claim 221 including the step of registering the laminae during the laminating step and while said fluidizing bonding media remains open. 223. The method of claim 221 including forming registration holes in the laminae. 224. The method of claim 223 including drivingly engaging the registration holes of said laminae during said laminating step. 225. The method of claim 221 including the step of applying alignment indicia to the laminae. 226. The method of claim 221 wherein the laminating step includes placing the first lamina apertures over and around said second portions of said I/C chip modules to dispose the I/C chip modules within the first lamina apertures. 227. A method for installing I/C chip modules onto a chip canier web, including the steps of: (a) continuously feeding a chip canier web to a first station for forming apertures through the chip canier web for accommodating first portions of I/C chip modules; (b) continuously incrementally feeding a strip holding a pluraUty of chip modules to a station for removing in an axial path individual I/C chip modules from the strip and immediately subsequently co-axially placing them onto said chip carrier web to dispose the first portions of the I/C chip modules into conesponding apertures; and (c) bonding the second portions of I/C chip modules to said chip carrier web. 228. The method of claim 227 including applying alignment indicia to said chip carrier web at said first station. 229. The method of claim 227 including forming registration holes through the chip carrier web. 230. The method of claim 227 including continuously feeding said chip carrier web in a horizontal (X-direction) path to said station for removing and placing, said station co-axiaUy removing and placing the I/C chip modules in a vertical (Z-direction) path. 231. The method of claim 228 wherein said step of continuously incrementally feeding comprises feeding a strip of chip modules having a double row of chip modules. 232. A method for laminating webs to opposite faces of an I/C chip carrier web, comprising the steps of: (a) feeding an upper web of material having apertures therethrough sized and conespond ingly spaced to accommodate therein portions of I/C chip modules mounted on a chip carrier web; (b) feeding a lower web of material; (c) feeding a chip canier web between the upper and lower webs; (d) applying fluidizing bonding media at intended interfaces between said upper and chip carrier webs and between said chip carrier and lower webs; (e) laminating said three webs together to dispose said apertures of said upper web around other portions of said I/C chip modules on said chip carrier web. 233. The method of claim 232 wherein said laminating step includes registering the three webs while said fluidizing bonding media remains open. 234. The method of claim 233 wherein said step of applying fluidizing bonding media comprises applying a chemical bonding media. 235. The method of claim 234 further including the step of applying heat to dry the bonding media at a temperature less than the plasticizing temperatures of said three webs. 236. The method of claim 235 including the step of (0 cutting said three laminated webs continuously in line subsequent to said laminating step without cooldown of said bonding media and thereby creating individual I/C chip cards. 237. The method as in claim 233 wherein said registering step registers the lower and upper webs relative to the chip carrier web. 238. The method as in claim 232 wherein said method steps (a) - (e) operating at speeds of up to about 110 feet/min. 239. A method for making a multi-web laminate containing I/C chip modules having at least first and second portions, said method including the steps of: (a) feeding a first web of material having a width sized to form a plurality of I/C chip cards thereacross to a first station for forming therethrough, at preselected locations on one part of the first web, apertures sized to accommodate therein the first portions of I/C chip modules; (b) separating the one part of the first web from a remaining second part of said first web forming an upper web having said apertures and said remaining second part forming a lower web. (c) feeding a second web of material having a width sized to a form plurality of cards thereacross to a second station for punching sequences of apertures thereacross at pre-selected locations sized to accommodate the second portions of I/C chip modules; (d) adhesively bonding of I/C chip modules to said second web to dispose the second portions thereof at said apertures therethrough; (e) feeding the upper and lower webs to a third station for applying fluidizing bonding media to second web-contacting faces of said upper and lower webs; and, (f) feeding said upper, lower and second webs, with said second web between the second web-contacting faces of said upper and lower webs, to a fourth station for laminating the three webs and positioning said apertures of said upper web around the first portions of said I/C chip modules on said second web. 240. The method of claim 239 including registering said three webs during the laminating step at said fourth station while said fluidizing bonding media remains open. 241. The method of claim 240 wherein the registration step includes registering the upper web apertures relative to the I/C chip modules. 242. The method of claim 239 including forming marginal registration holes in said upper, lower and second webs. 243. The method of claim 239 wherein following the laminating step, the step of (h) feeding the laminate to a means for cutting a plurality of cards therefrom, each card having at least one I/C chip module. 244. The method of claim 239 including preceding step (a), the steps of selecting first and second webs of material having thicknesses wherein, upon lamination of the upper web to the second web, the combined thicknesses are substantially equal to the heights of the I/C chip modules. 245. A method for forming laminated cards with I/C chip modules mounted therein, said method including the steps of: (a) introducing a plurality of webs; (b) forming apertures in a first web and a second web for subsequent registration therebetween for accommodating parts of I/C chip modules in said apertures; (c) adhesively mounting I/C chip modules on said second web with one part of said I/C chip modules inserted within said apertures; (d) applying fluidizing bonding media at intended interfaces between said plurality of webs; (e) forming regularly spaced transverse joints of separation across at least one of said plurality of webs and creating non-shingling sheet segments between said joints; (f) feeding said plurality of webs to a laminating station; and (g) laminating said plurality of webs together to have another part of said I/C chip modules inserted within said first web apertures. 246. A method for forming laminated cards with I/C chip modules mounted therein, said method including the steps of: (a) introducing a plurality of webs; (b) forming apertures in a first web and a second web for subsequent registration therebetween for accommodating parts of I/C chip modules in said apertures; 0 c (c) adhesively mounting I/C chip modules on said second web with one part of said I/C chip modules inserted within said apertures; (d) forming regularly spaced transverse joints of separation across at least one of said plurality of webs and creating non-shingling sheet segments between said joints; (e) applying fluidizing bonding media at intended interfaces between said plurality of webs; (f) feeding said plurality of webs to a laminating station; and (g) laminating said pluraUty of webs together to have another part of said I/C chip modules inserted within said first web apertures. 247. The method of claim 245 or 246 including the subsequent step of (h) continuous in line cutting of chip cards from said laminate after lamination. 248. The method of claim 245 or 246 wherein registration holes are formed through the plurality of webs. 249. The method of claim 245 or 246 including the step of registering the pluraUty of webs during the laminating step while said fluidizing bonding media remains open. 250. The method of claim 245 or 246 wherein the step of applying fluidizing bonding media comprises applying a chemical bonding agent and maintaimng the temperature thereof below the plasticizing temperature of the plurality of webs. 251. The method of claims 245 or 246 wherein said steps (d) - (g) occur at a continuous line speed of up to about 110 feet/min. 252. A method for making a multi-web laminate containing I/C chip modules, said modules having at least first and second portions, said method including the steps of: (a) feeding a first web of material having a width sized to form a plurality of I/C chip cards thereacross to a first station for forming therethrough, at pre¬ selected locations on one part of the web, apertures sized to accommodate therein the first portions of I/C chip modules; (b) separating the part of the first web having said apertures to form an upper web having said apertures and a lower web formed from the remainder of the first web. (c) feeding a second web of material having a width sized to form a plurality of cards thereacross to a second station for punching apertures therethrough at pre-selected locations sized to accommodate the second portions of the I/C chip modules; (d) adhesively bonding the I/C chip modules to said second web to dispose the second portions thereof at said apertures therethrough; (e) feeding the upper and lower webs to a third station for applying a fluidizing bonding media to second web-contacting faces of the upper and lower webs; (f) forming regularly spaced transverse joints of separation across the second web and creating non-shingling sheet segments between said joints; Oi) feeding said upper, second and lower webs to a fourth station for laminating said upper web at said second web-contacting face thereof to a face of said second web and for laminating said lower web at said second web-contacting face thereof to an opposite face of the second web to form a laminate and to position said apertures of said upper web around the first portions of said I/C chip modules on said second web. A method for making a multi-ply laminate containing I/C chip modules, said modules having at least first and second portions, said method including the steps of: (a) feeding a first web of material having a width sized to form a plurality of I/C chip cards thereacross to a first station for forming therethrough, at pre¬ selected locations on one part of the web, apertures sized to accommodate therein the first portions of I/C chip modules; (b) separating the part of the first web having said apertures to form an upper web having said apertures and a lower web formed from the remainder of the first web. (c) feeding a second web of material having a width sized to form a plurality of cards thereacross to a second station for punching apertures therethrough at pre-selected locations sized to accommodate the second portions of the I/C chip modules; (d) adhesively bonding the I/C chip modules to said second web to dispose the second portions thereof at said apertures therethrough; (e) forming regularly spaced transverse joints of separation across the second web and creating non-shingling sheet segments between said joints; (f) feeding the upper and lower webs to a third station for applying a fluidizing bonding media to second web-contacting faces of the upper and lower webs; (g) feeding said upper, second and lower webs to a fourth station for laminating said upper web at said second web-contacting face thereof to a face of said second web and for laminating said lower web at said second web-contacting face thereof to an opposite face of the second web to form a laminate and to position said apertures of said upper web around the first portions of said I/C chip modules on said second web. 254. The method of claim 252 or 253 including registering said upper, second and lower webs during said laminating step at said fourth station while said fluidizing bonding media remaining open. 255. The method of claim 252 or 253 including forming registration holes in said upper, second and lower webs. 256. The method of claim 252 or 253 wherein the step of feeding to a third station for applying a fluidizing bonding media includes applying a chemical bonding agent and maintaining the temperature below the plasticizing temperature of the webs. 257. The method of claims 252 or 253 wherein the steps (e) - (g) are canied out at line speeds of up to about 110 feet/min. 258. The method of claims 252 or 253 including the step of (h) cutting the laminate into I/C chip cards. 259. A method for forming laminated cards with I/C chip modules mounted therein, including the steps of: (a) introducing a first web, a second web and a third web; 0-0 forming apertures in said first web and said second web for subsequent registration therebetween and for accommodating portions of I/C chip modules in said apertures; (c) adhesively mounting I/C chip modules at said apertures of said second web; (d) applying fluidizing bonding media at intended interfaces between said webs; (e) forming regularly spaced separation joints across said first and third webs to create sheet-like segments between the joints to allow for relative non- shingUng translation of the first and third webs; and (f) laminating said sheet-like segments of the first web, said second web and said sheet-like segments of the third web to form a laminate and dispose portions of said I/C chip modules within said first and second web apertures. A method for forming laminated cards with I/C chip modules mounted therein, including the steps of: (a) introducing a first web, a second web and a third web; (b) forming apertures in said first web and said second web for subsequent registration therebetween and for accommodating portions I/C chip modules in said apertures; (c) adhesively mounting I/C chip modules at said apertures of said second web; (d) forming regularly spaced separation joints across said first and third webs to create sheet-like segments between the joints to allow for relative non- shingUng translation of the first and second webs; (e) applying fluidizing bonding media at intended interfaces between said webs; and (f) laminating said sheet-Uke segments of the first web, said second web and said sheet-Uke segments of the third web to form a laminate and dispose portions of said I/C chip modules within said first and second web apertures. 261. The method of claim 259 or 260 including the subsequent step of cutting I/C chip cards from said laminate. 262. A method for forming laminated cards with I/C chip modules mounted therein; including the steps of: (a) introducing a plurality of webs; (b) forming apertures in a first web and a second web for subsequent registration therebetween and for accommodating portions of I/C chip modules in said apertures; (c) adhesively mounting I/C chip modules at said apertures of said second web; (d) applying fluidizing bonding media at intended interfaces between the webs; (e) forming regularly spaced separation joints across said first web to create sheet-like segments between the joints to aUow for relative non-shingling translation of the first web; and (f) laminating said webs to form a laminate and dispose portions of said I/C chip modules within said first and second web apertures. 263. A method for forming laminated cards with I/C chip modules mounted therein; including the steps of: (a) introducing a plurality of webs; (b) forming apertures in a first web and a second web for subsequent registration therebetween and for accommodating portions of I/C chip modules in said apertures; (c) adhesively mounting I/C chip modules at said apertures of said second web; (d) forming regularly spaced separation joints across said first web to create sheet-like segments between the joints to allow for relative non-shingling translation of the first web; (e) applying fluidizing bonding media at intended interfaces between the webs; and (f) laminating said webs to form a laminate and dispose portions of said I/C chip modules within said first and second web apertures. 264. The method of claim 262 or 263 including the subsequent step of cutting I/C chip cards from said laminate 265. A method for forming laminated cards with I/C chip modules mounted therein, including the steps of: (a) introducing a plurality of webs; (b) forming apertures in a first web and a second web for subsequent registration therebetween and for accommodating portions of I C chip modules within said apertures; (c) adhesively mounting I/C chip modules at said apertures of said second web; (d) applying fluidizing bonding media at intended interfaces between the webs; (e) forming regularly spaced separation joints across a third web to create sheet¬ like segments between the joints to allow for relative non-shingling translation of the third web; (f) laminating said webs to form a laminate and dispose portions of said I/C chip modules within said first and second web apertures. A method for forming laminated cards with I/C chip modules mounted therein, including the steps of: (a) introducing a plurality of webs; (b) forming apertures in a first web and a second web for subsequent registration therebetween and for accommodating portions of I/C chip modules within said apertures; (c) adhesively mounting I/C chip modules at said apertures of said second web; (d) forming regularly spaced separation joints across a third web to create sheet- Uke segments between the joints to allow for relative non-shingling translation of the third web; (e) applying fluidizing bonding media at intended interfaces between the webs; (0 laminating said webs to form a laminate and dispose portions of said I/C chip modules within said first and second web apertures. 267. The method of claim 265 or 266 including the subsequent sep of cutting I/C chip cards from said laminate. 268. A method for forming laminated cards from a plurality of plastic laminae, including the steps of: (a) collating said laminae to be laminated; (b) applying fluidizing chemical bonding media to at least one surface of opposing interfacing surfaces between said laminae and maintaining the temperatures at said opposing interfacing surfaces at less than the plasticizing temperature of the laminae; (c) laminating said laminae at said opposing interfacing surfaces to form a laminate; and (d) excising laminated cards from said laminate. 269. The method of claim 268 including the step of registering the laminae during the laminating step, wherein said fluidizing chemical bonding media remains open. 270. The method of claim 268 wherein said laminae are all non-jointed continuous webs. 271. The method of claim 268 including the step of forming separation joints across at least one of said laminae to create sheet-like sections between the joints. 272. The method of claim 271 wherein the step of forming separation joints occurs before the step of applying fluidizing chemical bonding media. 273. The method of claim 271 wherein the step of forming separation joints occurs after the step of applying fluidizing chemical bonding media. 274. The method of claim 268 including a step prior to step (a) comprising forming registration holes in the laminae. 275. The method of claim 268 including forming apertures in at least one lamina and inserting an I/C chip module within said aperture. 276. The method of claim 268 including forming at least one blind hole in at least one of said lamina. 277. The method of claim 277 including concealing said at least one blind hole during the laminating step. 278. The method of claim 268 wherein the step of collating the lamina is simultaneous for all laminae. 279. The method of claim 268 wherein the step of laminating is simultaneous for aU laminae. 280. The method of claim 268 wherein the step of collating the lamina is non- simultaneous for at least one lamina. 281. The method of claim 268 wherein the step of laminating is non-simultaneous for at least one lamina. 282. The method of claim 268 wherein the step of applying fluidizing chemical bonding media comprises applying the media to coat generally the entire surface of each of said at least one surface of the opposing interfacing surfaces between said laminae. 283. The method of claim 268 wherein the step of applying fluidizing chemical bonding media comprises applying the media to coat less than the entire surfaces of said at least one surface of the opposing interfacing surfaces between said laminae. 284. In a system for manufacturing laminated cards from at least two or more webs of material: (a) means for independently supporting at least two separate sources of webs of material; 0-0 means for advancing webs of material to successive stations; (c) means for coUating the webs together; (d) means for applying a fluidizing bonding media to at least one of opposing surfaces of webs to be laminated; (e) means for bringing a web of material together with another web of material to laminate them while maintaining fluidizing bonding on the opposing surfaces therebetween; and (f) means for bringing said webs into final registration as they are brought together to laminate them while said fluidizing bonding media remains open. 285. The system as in claim 284 further including means for forming separation joints across one or more webs of material to create sheet-like sections between the joints. 286. In a system for manufacturing cards with I/C chip modules mounted therein, each module having a first portion and a second portion: (a) means for independently supporting separate sources of at least first and second webs of material; (b) means for advancing the first and second webs of material to successive stations; (c) a first station for punching through the first web of material at preselected locations and forming apertures sized to accommodate therein the first portions of I/C chip modules; (d) a second station for punching through the second web of material at preselected locations and forming apertures sized to accommodate the second portions of I/C modules; (e) means for supporting and advancing a strip carrying I/C chip modules to a position adjacent the apertures formed in the second web of material; (f) a third station for applying adhesive to the second web of material and for removing I/C chip modules from the strip and placing the chip modules onto said second web of material with the second portions thereof inserted within the apertures of the second of material and said first portions placed at said adhesive to bond the I/C chip modules to the second web of material; and (g) a fourth station for collating and laminating the first and second webs of material together including means for applying fluidizing bonding media between the first and second webs of material and means for bringing the first web of material together with the second web of material while maintaining fluidized bonding surfaces therebetween and positioning the apertures of the first web of material over the first portions of the I/C chip modules and thereby forming a lamianate with I/C chip modules mounted therein. 287. The system as in claim 286, wherein the fourth station further including means for forming separation joints across at least one of the webs of material to create sheet¬ like sections between the joints. 288. A system for placing I/C chip modules onto a chip carrier web comprising: (a) means for incrementally moving a chip carrier web along a first path; (b) means for incrementally advancing a strip containing I/C chip modules to dispose I/C chip modules adjacent the chip carrier web at preselected locations thereon; (c) means for applying adhesive to said chip carrier web at said preselected locations thereon; and (d) means for removing I/C chip modules from said strip and placing the removed I/C chip modules onto said chip carrier web at said preselected locations in a single path being orthogonal to said first path and causing contact between the I/C chip modules and the adhesive to bond the I/C chip modules to the chip canier web. 301. An integrated circuit (I/C) chip card comprising: (a) an I/C chip module having a first portion and a second portion joined to the first portion, said first portion being wider at an inner part than at an outer part thereof. (b) a card having at least first, second and third laminated plies for retaining said I/C chip module interiorly thereof, said first portion of the I/C chip module being substantially coplanar at said outer part thereof with an outward face of the first of said laminated plies, said first laminated ply having an aperture therethrough at least a portion of which is wider at an inward face adjacent the second ply than at said outward face, the second ply having an aperture therethrough receiving at least a part of the second portion of the I/C chip module, said third ply underlying said second ply and the I/C chip module. 302. The I/C chip card of claim 301 wherein said first portion of the I/C chip module has substantiaUy opposing sides being wider at said inner part than at said outer part. 303. The I/C chip card of claim 301 wherein said third ply is continuous at least throughout a region adjacent the I/C chip module and includes an upper face in contact with a bottom face of said second ply thereby forming a bottom of an I/C chip module cavity formed by the apertures through said first and second plies.. 304. The I/C chip card of claim 301 including means for adhering said I/C chip module to said second ply. 305. The I/C chip card of claim 301 wherein said aperture in said second ply is formed by aperture-defining portions, at least one of said portions being wider at the interface with said first ply than at said underlying third ply. 306. The IJC chip card of claim 301 wherein said laminated plies are bonded together by chemical welding. 307. The I/C chip card of claim 306 wherein said chemical welding includes a solvent. 308. The I/C chip card of claim 301 wherein said first ply has a thickness substantiaUy equal to the thickness of said first portion of the I/C chip module. 309. The I/C chip card of claim 308 wherein said second ply has a thickness substantially equal to the thickness of said second portion of the I/C chip module. 310. The I/C chip card of claim 304 wherein said inner part of the first portion of the I/C chip module being adhered to said second ply. 311. The I/C chip card of claim 301 wherein said first portion of the I/C chip module has a periphery complementary to said aperture in said first ply. 312. The I/C chip card of claim 305 wherein said aperture -defining portions are wider at the interface with said first ply than at said third ply. 313. An I/C chip card having at least three pUes laminated together and an I/C chip module aπanged in apertures formed through an apertured plurality of said at least three plies, one of said at least three plies being substantially imperforate and forming a bottom surface underlying said I/C chip module, said apertured pluraUty of said at least three pUes having a combined thickness substantially equal to the height of said I/C chip module and wherein a first portion of said I/C chip module has an outer face being substantially co-planar with an outward face of a first ply of said apertured plurality of plies , an aperture through said first ply having a smaller opening at the outward face thereof than at an opposite inward face of said first ply, said first portion of said I/C chip module having a periphery being complementary to the aperture through said first ply, said outer face of the first portion being smaUer than an opposite inner face thereof, said first portion having said inner face thereof bonded to a second ply of said apertured pluraUty of pUes, and said second ply being bonded to the inward face of said first ply and to said at least one substantially imperforate ply. 314. The I/C chip card of claim 313 wherein said at least one substantiaUy imperforate ply is continuous at least throughout a region adjacent said I/C chip module and includes an upper face in contact with the bottom face of said second ply thereby forming a bottom of a chip cavity formed by the apertures through said fust and second pUes. 315. The I/C chip card of claim 313 wherein said at least three plies of said card are bonded together by a chemical weld. 316. The I/C chip card of claim 313 wherein said fust ply has a thickness substantially equal to the height of said first portion of said I/C chip module. 317. The I/C chip card of claim 316 wherein said second ply has a thickness substantially equal to the height of a second portion of said I/C chip module. 318. A multi-ply card having an integrated circuit (I/C) chip module retained therein having an outwardly exposed first portion and a second portion, said plies having at least two interior interfaces thereof bonded together; a first ply having an aperture therethrough for accommodating the first portion of said I/C chip module and a second ply having a cavity for accommodating said second portion of said I/C chip module, said aperture through said first ply being reverse bevelled to form a smaUer opening at an outer surface than an opening at an inner surface thereof, said I/C chip module having at least one complementarily bevelled portion of said first portion aπanged adjacent said reverse bevelled aperture of said first ply and extending inwardly from said smaller opening of said first ply to said opening at the inner surface of the first ply. 319. The I/C chip card of claim 318 including means for adhering said I/C chip module to said second ply. 320. The I/C chip card of claim 318 wherein said cavity of said second ply is an aperture formed by aperture-defining portions being wider at an interface with said first ply than at an interface with a third ply. 321. The I/C chip card of claim 318 wherein the plies of said multi -ply card are bonded together by I/C chemical welds. 322. The I/C chip card of claim 321 wherein said second ply has a thickness substantiaUy equal to the thickness of said second portion of the I/C chip module. 323. The I/C chip card of claim 319 wherein said first portion includes an inner face, said inner face being adhered to said second ply. 324. The multiply card of claim 318 including a third ply bonded to said second ply. 325. A method for forming laminated cards from a plurality of webs including the steps of: (a) applying a magnetic stripe slurry to one of said webs; (b) collating said webs to be laminated; (c) applying fluidizing bonding media at interfaces between interfacing webs; (d) laminating said webs to form a laminate; and, (e) cutting cards from said laminate, each card including a portion of a magnetic stripe. 326. The method of claim 325 including forming apertures through at least two interfacing webs prior to collating, and inserting portions of integrated circuit (I/C) chip modules within said apertures. 327. The method of claim 325 including forming registration holes through the webs. 328. The method of claim 327 including registering said webs during laminating. PTO\0 3 8910O2\CI-AIM200

Inventors: BREEN THOMAS J, TAYLOR CHARLES W, BREEN, THOMAS, J., TAYLOR, CHARLES, W.
Applicants: BREEN THOMAS J, RAND MCNALLY & CO, TAYLOR CHARLES W, BREEN, THOMAS, J., RAND MCNALLY & COMPANY, TAYLOR, CHARLES, W.
Application year: 1996
Main classification: H01L23
IPC codes: B42D15, G06K19, H01L23