Aqueous resin dispersion

Abstract: The invention provides an aqueous resin dispersion that comprises 1) an acrylic resin (A), 2) an aromatic epoxy resin (B), and 3) a bisphenol F product (C) that are dispersed in an aqueous medium at a pH of from about 4 to 11. The invention also provides an aqueous base-coat agent, coated substrates and coating methods that comprises the aqueous resin dispersion.

Description: Field of the Invention This invention relates to an aqueous resin dispersion. The invention also relates to an aqueous base-coat, particularly for metal surfaces, and substrates and methods that comprise the resin composition. Background Base-coats and paints which mainly contain the aromatic epoxy resin can exhibit good qualities of processing, durability and coating properties. Accordingly, they are used often for coating, especially metal. The aromatic epoxy resin itself, however, can not dissolve and disperse into aqueous solution. On the other hand, usual base-coats and paints for metal are studied further from the view of resources-saving, energy-saving and preventing environmental pollution. There are various suggestions about base-coats and paints which mainly contain the aromatic epoxy resin. For example, the method for dispersing the aromatic epoxy resin with surfactant into water is well known, but such surfactants tend to impart had effects on storage stability and other properties of base-coats and paints. Certain self-emulsive aromatic epoxy resin comprising an aromatic epoxy resin that is modified by acrylic system resin with carboxyl group has been suggested. For example, Japanese Patent Application Laid-Open No. 53-14963 and Japanese Patent Application Laid-Open No. 55-9433 have reported that partial reactant with excess carboxyl groups, which are produced from reacting with acrylic resin and aromatic epoxy resin are dispersed stably with ammonia or amine in aqueous medium, namely the esterification. Japanese Patent Application Laid-Open No. 57-105418 and Japanese Patent Application Laid-Open No. 58-198513 have reported that a low molecular compound is produced by that aromatic epoxy resin reacts partially with methacrylic acid, and comprises epoxy group and acryloyl group in a molecule, and the low molecular compound and monomer mixture containing acrylic acid or methacrylic acid are polymerized, namely the modified esterification, namely the modified esterification, and the produced polymer is neutralized with basic compound, and an aqueous dispersion composition is obtained. Also, Japanese Patent Application Laid-Open No. 53-1228 reports that a polymerized epoxy resin is obtained by polymerizing a monomer mixture including a carboxylic monomer with a free-radical generation agent such as a benzoyl peroxide in the presence of an aromatic epoxy resin, namely the graft copolymerization, and the graft-copolymerized epoxy resin is able to be dispersed stably into an aqueous medium containing base. JP-A-63,077,916 relates to the manufacture of resol-type phenolic resins for water-soluble coatings for the inner surface of cans. Said resins are manufactured by treating phenols selected from bisphenol A and/or bisphenol F with aldehydes in aromatic solvents in the presence of alkali catalysts. Self-emulsive-type aromatic epoxy resin obtained by the above-described documents can form a rigid film by itself because it does not contain a surfactant in paints. But the self-emulsive-type aromatic epoxy resin is mixed with an aqueous amino resin which has a good hardening property in order to achieve increased hardening speed practically. By mixing with the amino resin, a hardening speed of film is able to be improved without deterioration of film property to a certain extent. However, if the amount which can get a practically satisfactory hardening speed is mixed, the processing and adhesion properties can deteriorate. Especially, painting inside a can give rise to sanitation problem because low molecular compounds which originate from amino resin are dissolved into contents of the can during heat sterilization. Also, it has been reported that a phenol resin is mixed with the self-emulsive-type aromatic epoxy resin; however, such prior efforts have shown that phenol resin can not contribute to improving hardening speed. Further, in the case that a base-coat agent for a metal-adhered can by the above-described work is used, sufficient adhesion to metal materials of cans and amide adhesive agents can not be obtained and a suitable base-coat for short-time baking can not be obtained. Summary of the Invention One object of the present invention is to improve hardening speed and adhesion with an aqueous resin dispersion comprising a self-emulsive-type aromatic epoxy resin. Another object of the invention is to improve properties of adhesion and processing of painted film and to overcome sanitation problems by using a self-emulsive-type aromatic epoxy resin together with an aqueous amino resin. In one aspect, this invention provides an aqueous resin dispersion comprising 1) an acrylic resin (A) obtainable by copolymerisation of a mixture of a monobasic carboxylic acid monomer and at least one (other) monomer copolymerizable therewith, 2) an aromatic epoxy resin (B) comprising from about 0.2 to 1.5 of epoxy groups per molecule and 3) a bisphenol F product (C) which is an optionally etherificated compound of the general formula (II) wherein a, b, m and p are independently 1, 2, 3 or 4, n is 0 or an integer of more than 1, R 1 , R 2 , R 3 and R 4 are independently hydrogen or an alkyl group comprising 1-10 carbon atoms, preferably 1-7 carbon atoms, more preferably 1-4 carbon atoms, with that at least one of R 1 , R 2 , R 3 and R 4 being hydrogen, wherein said bisphenol F product (C) comprises less than about 39 wt%, relative to (C), of the compound of the general formula (I), wherein a, b, R 1 , R 2 , R 3 and R 4 are as defined above, in an aqueous medium having a pH of from about 4 to 11. The bisphenol F product (C) in this invention is characterized by that the content of the compound shown in Formula (I) is preferably 15 to less than 39 wt%, more preferably 20 to less than 39 wt%. In preferred aspects, the invention provides an aqueous resin dispersion wherein acrylic resin (A), aromatic epoxy resin (B) and bisphenol F product (C) which comprises less than 39 wt% of the compound shown in Formula (I) are dispersed into an aqueous medium with ammonia or amines in order to adjust pH 4-11. Also, this invention relates to an aqueous base-coat agent comprising the present aqueous resin dispersion. The above-mentioned resin and reaction product of this invention may be added solely into a medium or may be reacted further to obtain an aqueous resin dispersion. Such preparatory reaction may be performed in arbitrary combinations and order with the above-mentioned (A), (B) and (C) components. For example, the acrylic resin (A) can be reacted with the aromatic epoxy resin (B) beforehand and an obtained partial-bonded product (P) may be added to the bisphenol F product (C). These preparatory reaction may be performed with usual graft copolymerization, esterification, modified esterification and so on. Also, the acrylic resin (A) and the aromatic epoxy resin (B) may be associated and added to the bisphenol F product (C) and then dispersed. This invention further provides an aqueous base-coat agent for metal, comprising the above aqueous resin dispersion. The aqueous base-coat agent of this invention is superior to prior agents comprising an aqueous resin dispersion of self-emulsive-type aromatic epoxy resin in properties of peel strength, water-proof properties, corrosion resistance and flavor. Detailed Description of the Invention The acrylic resin (A) of the present invention may be obtained by the copolymerization of mixture which comprises a mono basic carboxylic acid monomer, such as acrylic acid or methacrylic acid, and at least one (other) monomer copolymerizable therewith, in an organic solvent at 80°C to 150°C using a conventional radical initiator. It is preferred that this acrylic resin (A) includes 10-70 weight% of the mono basic carboxylic acid (i.e. containing a single COOH group) as the monomer unit in one molecule. The above copolymerizable monomer may be selected from at least one kind of an acrylate ester such as methyl acrylate, ethyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, n-amyl acrylate, isoamyl acrylate, n-hexyl acrylate, 2-ethyl hexyl acrylate, n-octyl acrylate, decyl acrylate and dodecyl acrylate; methacrylate ester such as methyl methacrylate, propyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, n-amyl methacrylate, n-hexyl methacrylate, n-octyl methacrylate, 2-ethyl hexyl methacrylate, decyl methacrylate and dodecyl methacrylate; styrene monomer such as styrene, vinyltoluene, 2-methylstyrene, t-butylstyrene and chlorostyrene; monomer containing hydroxyl group such as hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate and hydroxypropyl methacrylate; N-substituted methacrylic monomer such as N-methylol methacrylamide and N-butoxymethyl methacrylamide; monomer containing epoxy group such as glycidyl acrylate and glycidyl methacrylate; and acrylonitrile. The mono basic carboxylic acid monomer is preferably used in an amount of 10-70 weight%, more preferably 20-50 weight%. If the amount is lower than 10 weight%, dispersion stability of the resin in an aqueous medium, adhesion of the painted film to metal, solvent-resistance and/or flavor aptitude can deteriorate. If the amount is higher than 70 weight%, water-resistance and boil-resistance can deteriorate. The number average molecular weight of the acrylic system resin (A) is preferably 2,000-100,000, more preferably 5,000-50,000. If the number average molecular weight is less than 2,000, the crosslinked density of the paints is increased and, as the result, the processing becomes difficult. If the amount is lager than 50,000, particularly 100,000, gels may be generated in the reaction with aromatic system epoxy resin (B). It is preferable that aromatic epoxy resin (B) in this invention is obtained by the condensation of phenols such as bisphenol A and bisphenol F with epihalohydrin in the presence of an alkali catalyst. The aromatic epoxy resin (B) has preferably an average of 0.2-1.5 of epoxy group per molecular, more preferably 0.4-1.2 of epoxy group, still more preferably 0.4-1.0 of epoxy group. The number average molecular weight of the resin (B) is preferably more than 300, more preferably 900, still more preferably more than 2,000, particularly preferably 2,000-20,000, for practical using. The following commercial products may be used as the aromatic epoxy resin (B) of this invention; Epicoat 828, Epicoat 1001, Epicoat 1004, Epicoat 1007, Epicoat 1009, Epicoat 1010, Epicoat 4009, Epicoat 4010 (Shell Chemicals Co., Ltd.), PKHH (Phenoxy Associate. Co.,Ltd.), and YDF 2004, ZX-1356, YP-50S and ZX-1395 (Tobu Kasei. Co., Ltd.). And, as the aromatic epoxy resin (B), the denaturated epoxy resin which the above epoxy group is suitably reacted with the dehydrated castor oil, the fatty acid of soybean oil, the fatty acid of vegetable oil such as the fatty acid of coconut oil, or denaturaters such as bisphenol A, bisphenol F, and bisphenol F type epoxy resin. The partially bonded product (P) may be prepared from resin (A) and the aromatic epoxy resin (B) beforehand. The preparation method of the partially bonded product is not particularly limited. The partially bonded product (P) can be obtained by the ordinary partial reaction. For example, the above-mentioned ordinary methods such as the etherification, the denaturated etherification and the graft method may be used. These reactions can be performed preferably in the hydrophilic solvent described below at 50-150°C, for 150 minutes to 5 hours. The bisphenol F product (C) in this invention is a product obtained by the reaction of bisphenol F with a formaldehyde compound. If necessary, the product (C) may be etherificated by a conventional etherification method. This product (C) can be represented by the following Formula (II). It is not necessary that each numerical value of m and p in the repeating unit of Formula (II) is always the same in all repeating units. These values show merely hydroxyl methylation, and further etherification in a repeating unit to some extent can be suitable. In the above Formula (II), a and b are independently 1,2,3 or 4; n is 0 or an integer more than 1; R 1 , R 2 , R 3 and R 4 are independently hydrogen or lower alkyl group, except that at least one of R 1 , R 2 , R 3 and R 4 is hydrogen. Bisphenol F product (C) can be prepared by reacting bisphenol F with formaldehyde at 50-80°C for 1-5 hours, preferably at 55-70°C for 2-4 hours, on condition that the mole ratio of bisphenol F to formaldehyde is 1 to 0.05-2.0, more preferably 1 to 1.0-2.0, with 0.3-2.0 mole of an alkali catalyst, preferably 1.0-2.0 mole. And if the product (C) is etherificated further, a lower alcohol such as methanol, ethanol, propanol and butanol can be used in the etherification. The alkali catalyst is preferably a strong base such as NaOH and KOH, or NaCO 3 and NH 3 can be used solely or together. Formalin and paraformaldehyde suitably can be used as the formaldehyde reagent. By this reaction, the condensation reaction of bisphenol F is increased relative to hydroxyl methylation of the phenol core, and the formation of a monomer which is hydroxy methylated merely on the ring of bisphenol F shown in Formula (I) is comparably decreased. In preferred aspects of the invention, the amount of monomer shown in Formula (I) is less than 39 weight% of the whole product, preferably 15 to less than 39 weight %, more preferably 20 to less than 39 weight%. In the above Formula (I), a and b are independently 1,2,3,or 4; R 1 , R 2 , R 3 and R 4 are independently hydrogen or lower alkyl group, except that at least one of R 1 , R 2 , R 3 and R 4 is hydrogen. Preferred compounds of the above Formula (I) are shown in the following Formula (III). (In the above Formula (III), a and b are independently 1, 2, 3 or 4; R 1 and R 2 are independently hydrogen or lower alkyl group.) Preferably, the hydroxyl group of phenol core in the compounds shown in the above Formula (III) is not etherificated, and more preferably both R 1 and R 2 of the compounds shown in the above Formula (III) are hydrogen, namely, the compounds are not etherificated. The above-mentioned lower alkyl group of the ether group (i.e. R 1 -R 4 in Formula I and II and R 1 -R 2 in Formula III) may be an alkyl group comprising 1-10 of carbon atoms, preferably 1-7 of carbon atoms, and more preferably 1-4 of carbon atoms. For specific example, such lower alkyl group may be methyl, ethyl, n-propyl, i-propyl, butyl, n-butyl, i-butyl, sec-butyl, t-butyl, pentyl, n-pentyl, i-pentyl, neo-pentyl, sec-pentyl groups and so on, preferably butyl groups. The product amount of the compound shown in the above Formula (I) of bisphenol F product (C) can be confirmed by the GPC (gel permeation chromatography) measurement method. Methylol concentration can be confirmed by a nuclear magnetic resonance method. The usage weight ratio of bisphenol F product (C) to acrylic resin is suitably about 0.2-0.3, preferably 0.2-2.0, more preferably 0.4-1.5. The usage ratio of the acrylic resin (A) to aromatic epoxy resin (B) is suitably in the range of from 2 to 1 to 1 to 6 at solid conversion. The reaction can be controlled by measurement oxosilane percentage, viscometric measurement or the molecular weight distribution measurement using gel permeation chromatography (GPC). The final content amount ratio of oxosilane group of the partial reactant is 5-95%, preferably 30-70% which is the reduction ratio of the aromatic epoxy resin to the oxosilane content amount. If the reduction ratio of the oxosilane groups is less than 5%, the partial reactant of acrylic resin-aromatic epoxy resin tends to separate during storage because the partial reactant may not self-emulsificate sufficiently in an aqueous solution. If the reduction ratio is more than 95%, the property of processing of painted film tends to deteriorate. The aqueous dispersion in this invention can be dispersed in an aqueous solution after adding ammonium or amines to superfluous carboxyl groups complex resin composite (D). The addition amount of ammonium or amines is to the extent of pH 4-11 of the final composite. As the above-mentioned amines the following suitably may be used: alkyl amine group such as trimethyl amine, triethyl amine and butyl amine; alcohol amine group such as 2-dimethyl amino, diethanol amine, triethanol amine and aminomethylpropanol; and morpholine; also polyhydric amine such as ethylene diamine and diethylene triamine. The aqueous solution in this invention may be suitably water solely, or a mixture of water with a hydrophilic organic solvent, which mixture contains at least 10 wt% of water. As the hydrophilic organic solvent, the followings may be suitably used: the alkyl alcohol groups such as methanol, ethanol, n-propanol, isopropanol, n-butanol, sec-butanol, tert-butanol, and isobutanol; the ether alcohol groups such as methyl cellosolve, ethyl cellosolve, propyl cellosolve, butyl cellosolve, methyl carbitol, and ethyl carbitol; the ether ester groups such as methyl cellosolve acetate and ethyl cellosolve acetate; dioxane; dimethyl formaldehyde; and diacetone alcohol. The aqueous resin dispersion of this invention can be used as a base-coat agent by adding surfactant and an antifoamer to improve the painting performance according to necessity. As the applied material or substrate, metal plates such as nontreated steel plates, treated steel plates, zinc plates, tin plates and so on are suitable. As the painting method, roll painting such as the natural roll coating and reverse roll coating are preferable; also dip painting, spray painting, electrochemical deposition painting, etc. can be suitable. Baking conditions after substrate application can be suitably e.g. baking and drying at 210-280°C (plate temperature) for 10-60 seconds, or at 150-230°C (plate temperature) for 2-30 minutes. The aqueous resin dispersion in this invention can be used for, for example, an anti-rust primer combined with a suitable anti-rust agent, pigment, filler, etc., according to usage. It is to be understood that the following examples are not intended to limit the scope of the present invention. Production Example 1 Production of acrylic resin (A1) solution (1) Styrene 105.0 (w/w) (2) Ethyl acrylate 105.0 (w/w) (3) Methacrylic acid 105.0 (w/w) (4) Benzoyl peroxide 3.0 (w/w) (5) N-butanol 696.4 (w/w) (6) Benzoyl peroxide 0.3 (w/w) (7) Benzoyl peroxide 0.3 (w/w) The above (5) n-butanol was prepared in a four-neck distillation flask and heated at 100°C under N 2 gas stream, and the mixture of the above (1), (2), (3) and(4) was dropped into the flask, after 1 hour from dropping the above (6) was added, and after further 1 hour the above (7) was added into the flask, and kept for 1 hour at same temperature, and the acrylic resin (Al) solution was obtained thereby, wherein the solid content ratio was 30 wt% the acidity was 196, and the number average molecular weight was 12,000. Production Example 2 Production of epoxy resin (B1) solution (1) Epycoat 1009 (Oil Shell Epoxy Co., Ltd.) 400.0(w/w) (2) Ethyleneglycol monobutylether 300.0(w/w) (3) Methylethylketone 300.0 (w/w) The above (1), (2) and (3) were prepared in a four-neck distillation flask and heated at 110°C under N 2 gas stream to dissolve, and the acrylic resin (B1) solution was obtained thereby, wherein the solid content ratio was 40 wt%, the epoxy equivalent was 2850, and the number average molecular weight was 3750 and 1.3 of epoxy groups were in a molecule. Production Example 3 Production of epoxy resin (B2) solution (1) ZX-1356 (Touto Kasei Co., Ltd.) 400.0 (w/w) (2) Ethyleneglycol monobutylether 300.0 (w/w) (3) Methylethylketone 300.0 (w/w) In the same way as described in Production Example 2, the above (1), (2) and (3) were prepared in a four-neck distillation flask and heated at 110°C under N 2 gas stream to dissolve, and the acrylic resin (B2) solution was obtained thereby, wherein the solid content ratio was 40 wt%, the epoxy equivalent was 27,700, and the number average molecular weight was 13,500 and 0.5 of epoxy groups were in a molecule. Production Example 4 Production of epoxy resin (B3) solution (1) Phenoxy PKHH (Phenoxy Associate Co., Ltd.) 400.0 (w/w) (2) ethyleneglycol monobutylether 300.0 (w/w) (3) Methylethylketone 300.0 (w/w) In the same way as described in Production Example 2, the above (1), (2) and (3) were prepared in a four-neck distillation flask and heated at 110°C under N 2 gas stream to dissolve, and the acrylic resin (B3) solution was obtained thereby, wherein the solid content ratio was 40 wt%, the epoxy equivalent was 55,000, and the number average molecular weight was 10,000 and 0.2 of epoxy groups were in a molecule. Production Example 5 Production of bisphenol F reacting product (C1) solution (1) Dihydroxydiphenylmethane (Bisphenol F-ST by Mitsui Toatsu Chemistry Co.) 298.9 (w/w) (2) Formalin (37% aqueous solution) 581.6 (w/w) (3) Sodium hydroxide (25% aqueous solution) 119.6 (w/w) The above (1), (2) and (3) were prepared in a four-neck distillation flask, and reacted at 60°C for 5 hours under N 2 gas and neutralized with HCl, and xylene/n-butanol/cyclohexane (1/1/1) and plenty of water were added, and then the mixture was left for 5 hours. And an aqueous layer containing the produced salt was separated and removed, and the layer dehydrated under reduced pressure, and bis-phenol F reaction product (Cl) solution was obtained thereby, wherein solid content ratio was about 35 wt%. As the results of measuring molecular amount with GPC, the product (Cl) comprised 30 wt% of monomer which was introduced from methylol, 20 wt% of dimer which was introduced from methylol, 20 wt% of trimer which was introduced from methylol and 30 wt% of tetramer or more. Production Example 6 Production ot bis-phenol F reaction product (C2) solution (1) Dihydroxydiphenylmethane (Bisphenol F-ST by Mitsui Toatsu Chemistry Co.) 298.9 (w/w) (2) Formalin (37% aqueous solution) 581.6 (w/w) (3) Sodium hydroxide (25% aqueous solution) 119.6 (w/w) (4) Ammonia 10.4 (w/w) In the same way as described in Production Example 5, the above (1), (2), (3) and (4) were prepared in a four-neck distillation flask, and reacted at 70°C for 3 hours under N 2 gas and neutralized with HCl, and xylene/n-butanol/cyclohexane (1/1/1) and plenty of water were added, and then the mixture was left for 5 hours. And an aqueous layer containing the produced salt was separated and removed, and the layer dehydrated under reduced pressure, and bis-phenol F reaction product (C2) solution was obtained thereby, wherein solid content ratio was about 35 wt%. As the results of measuring molecular amount with GPC, the product (C2) comprised 20 wt% of monomer which was introduced from methylol, 15 wt% of dimer which was introduced from methylol, 25 wt% of trimer which was introduced from methylol and 40 wt% of tetramer or more. Production Example 7 Production of bis-phenol F reaction product (C3) solution (1) Dihydroxydiphenylmethane (Bisphenol F-ST by Mitsui Toatsu Chemistry Co.) 298.9 (w/w) (2) Formalin (37% aqueous solution) 581.6 (w/w) (3) Sodium hydroxide (25% aqueous solution) 119.6 (w/w) The above (1), (2) and (3) were prepared in a four-neck distillation flask, and reacted at 60°C for 5 hours under N 2 gas and neutralized with HCl, and xylene/n-butanol/cyclohexane (1/1/1) and plenty of water were added, and then the mixture was left for 5 hours. And an aqueous layer containing the produced salt was separated and removed, and the layer dehydrated under reduced pressure, and reacted at 100°C for 3 hours, and butyletherificated, and bis-phenol F reaction product (C3) solution was obtained thereby, wherein solid content ratio was about 35 wt%. As the results of measuring molecular amount with GPC, the product (C3) comprised 25 wt% of monomer which was introduced from methylol, 25 wt% of dimer which was introduced from methylol, 20 wt% of trimer which was introduced from methylol and 30 wt% of tetramer or more. Production Example 8 Production of bis-phenol F reaction product (C4) solution (1) Dihydroxydiphenylmethane (Bisphenol F-ST by Mitsui Toatsu Chemistry Co.) 171.7 (w/w) (2) Formalin (37% aqueous solution) 555.0 (w/w) (3) Sodium hydroxide (25% aqueous solution) 273.9 (w/w) In the same way as described in Production Example 5, the above (1), (2) and (3) were prepared in a four-neck distillation flask, and reacted at 50°C for 2 hours under N 2 gas and neutralized with HCl, and xylene/n-butanol/cyclohexane (1/1/1) and plenty of water were added, and then the mixture was left for 5 hours. And an aqueous layer containing the produced salt was separated and removed, and the layer dehydrated under reduced pressure, and bis-phenol F reaction product (C4) solution was obtained thereby, wherein solid content ratio was about 35 wt%. As the results of measuring molecular amount with GPC, the product (C4) comprised 45 wt% of monomer which was introduced from methylol, 25 wt% of dimer which was introduced from methylol, 20 wt% of trimer which was introduced from methylol and 10 wt% of tetramer or more. Production Example 9 Production of bis-phenol F reaction product (C5) solution (1) Dihydroxydiphenylmethane (Bisphenol F-ST by Mitsui Toatsu Chemistry Co.) 190.5 (w/w) (2) Formalin (37% aqueous solution) 542.0 (w/w) (3) Sodium hydroxide (25% aqueous solution) 267.5 (w/w) In the same way as described in Production Example 5, the above (1), (2) and (3) were prepared in a four-neck distillation flask, and reacted at 50°C for 2 hours under N 2 gas and neutralized with HCI, and xylene/n-butanol/cyclohexane (1/1/1) and plenty of water were added, and then the mixture was left for 5 hours. And an aqueous layer containing the produced salt was separated and removed, and the layer dehydrated under reduced pressure, and bis-phenol F reaction product (CS) solution was obtained thereby, wherein solid content ratio was about 35 wt%. As the results of measuring molecular amount with GPC, the product (C4) comprised 75 wt% of monomer which was introduced from methylol, 15 wt% of dimer which was introduced from methylol and 10 wt% of trimer which was introduced from methylol. Example 1 (1) Acrylic resin (A1 above) solution 150.0 (w/w) (2) Epoxy resin (B1 above) solution 450.0 (w/w) (3) Dimethylaminoethanol 1.4 (w/w) (4) Dimethylaminoethanol 7.0 (w/w) (5) Ion-exchange water 1000.0 (w/w) (6) Bisphenol F product (Cl above) solution 71.4 (w/w) (7) Ethyleneglycol monobutylether 80.0 (w/w) (8) Ion-exchange water 200.0 (w/w) The above (1), (2) and (3) were prepared in a four-neck distillation flask and heated at l10°C for 3 hours to react, and the mixture was cooled at 60°C, and the above (4) was added and stirred well, and (5) was added gradually, and the above (6) was added. After solvents and water were extracted at 50-60°C under vacuum, the above (7) was added the mixture, and the solid content ratio was adjusted by the above (8), and the aqueous dispersion component was obtained thereby, wherein 8 wt% of containing ratio of the solvent which was bonded partially with the epoxy group having an average of 1.3 per molecule, and 25 wt% of solid content ratio. Example 2 (1) Acrylic resin (A1 above) solution 83.3 (w/w) (2) Epoxy resin (B1 above) solution 250.0 (w/w) (3) Dimethylaminoethanol 1.2 (w/w) (4) Epoxy resin (B2 above) solution 250.0 (w/w) (5) Dimethylaminoethanol 3.9 (w/w) (6) Ion-exchange water 1000.0 (w/w) (7) Bisphenol F product (C1 above) solution 71.4 (w/w) (8) Ethyleneglycol monobutylether 80.0 (w/w) (9) Ion-exchange water 200.0 (w/w) The above (1), (2) and (3) were prepared in a four-neck distillation flask and heated at 110°C for 3 hours to react, and the above (4) was added and (5) was added and stirred well, and the above (6) was added gradually, and (7) was added also. After solvents and water were extracted at 50-60°C under vacuum, the above (8) was added the mixture, and the solid content ratio was adjusted by the above (9), and the aqueous dispersion component was obtained thereby, wherein 8 wt% of containing ratio of the solvent which was bonded partially with the epoxy group having an average of 0.9 per molecule, and 25 wt% of solid content ratio. Example 3 (1) Acrylic resin (A1 above) solution 52.3 (w/w) (2) Epoxy resin (B1 above) solution 157.0 (w/w) (3) Dimethylaminoethanol 0.7 (w/w) (4) Epoxy resin (B3 above) solution 363.3 (w/w) (5) Dimethylaminoethanol 4.1 (w/w) (6) Ion-exchange water 1000.0 (w/w) (7) Bisphenol F product (C1 above) solution 71.4 (w/w) (8) Ethyleneglycol monobutylether 80.0 (w/w) (9) Ion-exchange water 200.0 (w/w) In the same way as described in Example 2, the aqueous dispersion component was obtained thereby, wherein 8 wt% of containing ratio of the solvent which was bonded partially with the epoxy group having an average of 0.5 per molecule, and 25 wt% of solid content ratio. Example 4 (1) Acrylic resin (A1 above) solution 150.0 (w/w) (2) Epoxy resin (B1 above) solution 450.0 (w/w) (3) Dimethylaminoethanol 1.4 (w/w) (4) Dimethylaminoethanol 7.0 (w/w) (5) Ion-exchange water 1000.0 (w/w) (6) Bisphenol F product (C2 above) solution 71.4 (w/w) (7) Ethyleneglycol monobutylether 80.0 (w/w) (8) Ion-exchange water 200.0 (w/w) In the same way as described in Example 1, the aqueous dispersion component was obtained thereby, wherein 8 wt% of containing ratio of the solvent which was bonded partially with the epoxy group having an average of 1.3 per molecule, and 25 wt% of solid content ratio. Example 5 (1) Acrylic resin (A1 above) solution 150.0 (w/w) (2) Epoxy resin (B1 above) solution 250.0 (w/w) (3) Dimethylaminoethanol 1.2 (w/w) (4) Epoxy resin (B2 above) solution 250.0 (w/w) (5) Dimethylaminoethanol 3.9 (w/w) (6) Ion-exchange water 1000.0 (w/w) (7) Bisphenol F product (C2 above) solution 71.4 (w/w) (8) Ethyleneglycol monobutylether 80.0 (w/w) (9) Ion-exchange water 200.0 (w/w) The above (1), (2) and (3) were prepared in a four-neck distillation flask and heated at 110°C for 3 hours to react, and the above (4) was added and (5) was added and stirred well, and the above (6) was added gradually, and (7) was added also. After solvents and water were extracted at 50-60°C under vacuum, the above (8) was added the mixture, and the solid content ratio was adjusted by the above (9), and the aqueous dispersion component was obtained thereby, wherein 8 wt% of containing ratio of the solvent which was bonded partially with the epoxy group having an average of 0.9 per molecule, and 25 wt% of solid content ratio. Example 6 (1) Epycoat 1009 (Oil Shell Epoxy Co.) 180.0 (w/w) (2) Ethyleneglycol monobutylether 90.0 (w/w) (3) Methacrylic acid 1.0 (w/w) (4) Sodium hydroxide 0.1 (w/w) (5) Hydroquinone 0.002 (w/w) (6) N-butanol 130.0 (w/w) (7) Styrene 15.8 (w/w) (8) Ethyl acrylate 15.8 (w/w) (9) Methacrylic acid 13.5 (w/w) (10) N-butanol 45.1 (w/w) (11) Azobisisobutyronitrile 2.3 (w/w) (12) Azobisisobutyronitrile 0.2 (w/w) (13) Azobisisobutyronitrile 0.2 (w/w) (14) Dimethylaminoethanol 11.2 (w/w) (15) Ion-exchange water 1000.0 (w/w) (16) Bisphenol F product (C1) solution 71.4 (w/w) (17) Ethyleneglycol monobutylether 80.0 (w/w) (18) Ion-exchange water 200.0 (w/w) The above (1) to (5) were prepared in a four-neck distillation flask and the interior temperature was increased to 120-130°C, and the mixture was reacted under nitrogen gas stream, and cooled at the point that the acid value of the mixture was less than 0.2, and (6) was added at 100°C, and the mixture solution of the above (7) to (11) was added over 2 hours while maintaining the temperature at 100°C and stirring. After 1 hour after that addition, the above (12) was added, and after a further 1 hour the above (13) was added, and stirred for 1 hour while maintaining the same temperature, and then the mixture was cooled to 50°C. Continuously, the above (14) was added, and the above (15) was added gradually with stirring, and the above (16) was added. After solvents and water were extracted at 50-60°C under vacuum, and the above (17) was added, and the solid content ratio was adjusted by the above (18), and the aqueous dispersion component was obtained thereby, wherein 8 wt% of containing ratio of the solvent which was bonded partially with the epoxy group having an average of 1.1 per molecule, and 25 wt% of solid content ratio. Example 7 (1) Epycoat 1009 (Oil Shell Epoxy Co.) 180.0 (w/w) (2) Ethyleneglycol monobutylether 100.0 (w/w) (3) N-butanol 80.0 (w/w) (4) Styrene 15.8 (w/w) (5) Ethyl acrylate 15.8 (w/w) (6) Methacrylic acid 13.5 (w/w) (7) N-butanol 45.1 (w/w) (8) Benzoyl peroxide 3.6 (w/w) (9) Benzoyl peroxide 0.4 (w/w) (10) Benzoyl peroxide 0.4 (w/w) (11) Dimethylaminoethanol 11.2 (w/w) (12) Ion-exchange water 1000.0 (w/w) (13) Bisphenol F product (C1 above) solution 71.4 (w/w) (14) Ethyleneglycol monobutylether 80.0 (w/w) (15) Ion-exchange water 200.0 (w/w) The above (1) to (3) were prepared in a four-neck distillation flask and the interior temperature was increased to 110°C, and dissolved under nitrogen gas stream, and the mixture solution of the above (4) to (8) was added over 2 hours at 110°C, and, after 1 hour from that addition, the above (9) was added, and after further 1 hour the above (10) was added, and the mixture stirred for 1 hour while maintaining the same temperature, and then the mixture was cooled at 50°C. Continuously, the above (11) was added, and the above (12) was added gradually with stirring, and the above (13) was added. After solvents and water were extracted at 50-60°C under vacuum, and the above (14) was added, and the solid content ratio was adjusted by the above (15), and the aqueous dispersion component was obtained thereby, wherein 8 wt% of containing ratio of the solvent which was bonded partially with the epoxy group having an average of 1.3 per molecule, and 25 wt% of solid content ratio. Example 8 (1) Acrylic resin (A1 above) solution 52.3 (w/w) (2) Epoxy resin (B1 above) solution 157.0 (w/w) (3) Dimethylaminoethanol 0.7 (w/w) (4) Epoxy resin (B3 above) solution 366.3 (w/w) (5) Dimethylaminoethanol 4.1 (w/w) (6) Ion-exchange water 1000.0 (w/w) (7) Bisphenol F product (C3 above) solution 71.4 (w/w) (8) Ethyleneglycol monobutylether 80.0 (w/w) (9) Ion-exchange water 200.0 (w/w) In the same way as described in Example 2, the aqueous dispersion component was obtained thereby, wherein 8 wt% of containing ratio of the solvent which was bonded partially with the epoxy group having an average of 0.5 per molecule, and 25 wt% of solid content ratio. Comparative Example 1 (1) Acrylic resin (A1 above) solution 150.0 (w/w) (2) Epoxy resin (B1 above) solution 450.0 (w/w) (3) Dimethylaminoethanol 1.4 (w/w) (4) Dimethylaminoethanol 7.0 (w/w) (5) Ion-exchange water 1000.0 (w/w) (6) Bisphenol F product (C4 above) solution 71.4 (w/w) (7) Ethyleneglycol monobutylether 80.0 (w/w) (8) Ion-exchange water 200.0 (w/w) The above (1), (2) and (3) were prepared in a four-neck distillation flask and heated at 110°C for 3 hours to react, and the mixture was cooled at 60°C, and the above (4) was added and stirred well, and (5) was added gradually, and the above (6) was then added. After solvents and water were extracted at 50-60°C under vacuum, the above (7) was added the mixture, and the solid content ratio was adjusted by the above (8), and the aqueous dispersion component was obtained thereby, wherein 8 wt% of containing ratio of the solvent which was bonded partially with the epoxy group having an average of 1.3 per molecule, and 25 wt% of solid content ratio. Comparative Example 2 (1) Acrylic resin (A1 above) solution 150.0 (w/w) (2) Epoxy resin (B1 above) solution 450.0 (w/w) (3) Dimethylaminoethanol 1.4 (w/w) (4) Dimethylaminoethanol 7.0 (w/w) (5) Ion-exchange water 1000.0 (w/w) (6) Bisphenol F product (C5 above) solution 71.4 (w/w) (7) Ethyleneglycol monobutylether 80.0 (w/w) (8) Ion-exchange water 200.0 (w/w) The above (1), (2) and (3) were prepared in a four-neck distillation flask and heated at 110°C for 3 hours to react, and the mixture was cooled at 60°C, and the above (4) was added and stirred well, and (5) was added gradually, and the above (6) was added. After solvents and water were extracted at 50-60°C under vacuum, the above (7) was added the mixture, and the solid content ratio was adjusted by the above (8), and the aqueous dispersion component was obtained thereby, wherein 8 wt% of containing ratio of the solvent which was bonded partially with the epoxy group having an average of 1.3 per molecule, and 25 wt% of solid content ratio. Performance Assessment The aqueous dispersion components obtained by Examples 1-8 and Comparative Examples 1 and 2 were evaluated about the storage stability as paints, and also some properties of the painted film on plates prepared with the below-described conditions for the assessment. The results of this assessment are shown in Table 1 below. Preparation Conditions for Plate To prepare the plate for the present Assessment, firstly a certain appropriate base-coat was painted with 2.5-3.0 µm of thickness on each of a steel plate which had 0.22 m of thickness and were treated by chrome, and the obtained aqueous dispersion components were painted by roller painting on the base-coat treated plates respectively, and then baked and dried for 25 seconds at 250°C of plate temperature. The results shown in Table 1 were obtained by the below-described assessments methods. 1. Storage Stability of Paints The prepared paints were stored in incubators at 50°C, and their external appearances and properties were evaluated periodically. "o" shows the good stability, and "x" shows that gelation, sedimentation, separation and so on appeared during storage. 2. Peeling Test The film of 1,2-amino lauric acid polymer which has 2.3 of the relative viscosity was caught between the plates which were painted with the obtained components respectively, and adhered by the heat pressing at 200°C for 30 seconds, and cooled. And then the test sample flakes which had 5 mm of thick for adhering were prepared by cutting, and these test flakes were performed T-type peeling test by Schoppers fiber tensil tester at 25°C. And, as another test, the adhered test sample was dipped into 90°C of hot water, and cooled and dried, and performed T-type peeling test. 3. Water-Proof Property The painted surface conditions of the test samples were examined after dipping into water at 125°C for 40 minutes. 4. Processing Property The painted plates test samples were cut to a size of 40 mm x 50 mm, and folded in two to have the outside surfaces being the painted surfaces and to have the tested portions being 40 mm in size. And aluminum plates 0.30 mm thick were caught between the folded test samples respectively, and 3 Kg of weight was dropped down to each folded portion of test sample from 45 cm of height. And then the outside of folded portion was pressed a sponge which was soaked salt solution, and the other side of the sponge was connected with a metal plate which was an electrode, and 6 V x 10 seconds of electric current was sent between the metal plate and the folded portion, and after 10 seconds, the electric value between the metal plate and the folded portion was evaluated. 5. Resistance to salt solution Each test flake which was notched "x" on the surface by knife was dipped into 125°C of 1% salt solution for 40 minutes, and stored at 50°C for 1 week, and the degree of corrosion at the portion near the "x"-notch was evaluated. In Table 1, "o" shows that no corrosion appeared, "▵" shows that a little corrosion appeared and "x" shows that much corrosion appeared. 6. Resistance to flavor Inhibition The test flake was bottled into a bottle which was made from heat-resistant glass and filled with water treated by active carbon, and bottling the ratio of water amount (ml) to the painted area (cm 2 ) was 1 to 1. A lid was placed on the bottle, and sterilized at 125°C for 45 minutes, and the flavor of inside water was tested. In Table 1, "0" shows that the flavor did not change, "A" shows that a little change of flavor appeared and "x" shows that the flavor changed very much. As shown in the results of assessments, the paints of the present invention are superior to the paints of Comparative Examples at, especially, resistance to corrosion, water proof performance, processing property and peel strength. Also, the paints which contain 0.2-1.0 of epoxy groups are especially superior with respect to processing properties and peel strength. The present invention can provide the exceedingly superior base-coat paint by using bisphenol F reaction product (C) which contains less than 39 wt% of monomer as phenol resin, without deteriorating properties of prior aqueous resin dispersion of self-emulsive-type aromatic epoxy resin. Storage Quality Peel Strength (kg/5 mm) Water Resistance Processing Resistance mA Corrosion Resistance Flavor Initial Value 90°C ∼ 7 days Ex. 1 ○ 4.8 4.3 ○ 49.2 ○ ○ Ex. 2 ○ 6.2 5 ○ 23 ○ ○ Ex. 3 ○ 5.9 4.9 ○ 27.1 ○ ○ Ex. 4 O 4.5 4.3 ○ 48.8 ○ ○ Ex. 5 ○ 5.7 5.3 ○ 20.5 ○ ○ Ex. 6 ○ 4.7 4.5 ○ 55 ○ ○ Ex. 7 ○ 4.8 4.6 ○ 50 ○ ○ Ex. 8 ○ 6.3 5.4 ○ 19.8 ○ ○ Comparison Ex. 1 ○ 1.6 1 ○ 55 Δ Δ Comparison Ex. 2 ○ 0.8 0.5 Δ 58 Δ Δ

Claims: An aqueous resin dispersion comprising 1) an acrylic resin (A) obtainable by copolymerisation of a mixture of a monobasic carboxylic acid monomer and at least one (other) monomer copolymerizable therewith, 2) an aromatic epoxy resin (B) comprising from about 0.2 to 1.5 of epoxy groups per molecule and 3) a bisphenol F product (C) which is an optionally etherificated compound of the general formula (II) wherein a, b, m and p are independently 1,2,3 or 4, n is 0 or an integer of more than 1, R 1 , R 2 , R 3 and R 4 are independently hydrogen or an alkyl group comprising 1-10 carbon atoms, preferably 1-7 carbon atoms, more preferably 1-4 carbon atoms, with that at least one of R 1 , R 2 , R 3 and R 4 being hydrogen, wherein said bisphenol F product (C) comprises less than about 39 wt%, relative to (C), of the compound of the general formula (I), wherein a, b, R 1 , R 2 , R 3 and R 4 are as defined above, in an aqueous medium having a pH of from about 4 to 11. An aqueous resin dispersion comprising a partially bonded compound (P), which is produced from the acrylic resin (A) and the aromatic epoxy resin (B) according to claim 1, and the bisphenol F product (C) according to claim 1, in an aqueous medium at a pH of from 4 to 1. The aqueous resin dispersion of claim 1 or 2, wherein the bisphenol F product (C) contains from about 15 wt% to less than 39 wt%, relative to (C), of the compound of the general Formula (I): The aqueous resin dispersion of any one of claims 1-3, wherein the aromatic epoxy resin (B) contains from about 0.4-1.2 of epoxy groups per molecule. The aqueous resin dispersion of any one of claims 1-4, wherein the number average molecular weight of the aromatic epoxy resin (B) is from about 2,000 to 20,000. An aqueous resin dispersion of any one of claims 1 through 5 wherein the bisphenol F product is a reaction product of bisphenol F and a formaldehyde compound. The aqueous dispersion of any one of claims 1-6 wherein the dispersion contains ammonia or other amine to adjust the pH from about 4 to 11. An aqueous base-coat agent for metal comprising the aqueous resin dispersion of any one of claims 1-7. A metal substrate comprising a coating layer of a resin dispersion of any one of claims 1-7. The metal substrate of claim 9 wherein the substrate is a non-treated steel substrate, a treated steel substrate, a zinc plate or a tin plate. The metal substrate of claim 9 wherein the resin dispersion is applied to the interior of a can. A method of providing a coated metal substrate comprising applying a coating layer of an aqueous resin dispersion of any one of claims 1-7 on a metal substrate and drying the applied coating layer.

Inventors: HARADA SANJI, IHARA MASAHIRO, NAKAMURA TETSUHISA, SHIONO TERUO, TUYAMA TAKESHI, YAMADA MASAMI, HARADA, SANJI, IHARA, MASAHIRO, NAKAMURA, TETSUHISA, SHIONO, TERUO, TUYAMA, TAKESHI, YAMADA, MASAMI
Applicants: TOYO INK MFG CO, TOYO INK MANUFACTURING CO., LTD.
Application year: 1996
Main classification: C08L63
IPC codes: C08L33, C08L63, C08L25, C08L61