Wafer polishing machine

Abstract: A semi-conductor wafer polishing machine (10) having a polishing pad assembly (14), and a wafer holder (12) includes a support (24) positioned adjacent the polishing pad assembly (14). This support (24) has at least one fluid inlet (36) connectable to a source of fluid at a higher pressure, at least one fluid outlet (38) connectable to a fluid drain at a lower pressure, and at least one bearing surface (40) over which fluid flows from the source to the drain. The polishing pad (14) is supported by the fluid over the bearing surface (40) for low-friction movement with respect to the support (24). Similar fluid bearings can be used in the wafer holder (12). An array of generally parallel grooves is provided on a belt support surface to reduce hydroplaning of a polishing belt. A turbine drive system rotates a wafer chuck in a wafer holder (12).

Description: This invention relates to chemical mechanical polishing machines for planarizing semi-conductor wafers, as per the preamble of claim 1. An example of such an apparatus is disclosed by JP 2 269 553 A. Chemical mechanical polishing machines for semi-conductor wafers are well known in the art, as described for example in U.S. Patents 5,335,453, 5,329,732, 5,287,663, 5,297,361 and 4,811,522. Typically, such polishing machines utilize mechanical bearings for the polishing pad and the wafer holder. Such mechanical bearings can provide disadvantages in operation. Mechanical bearings can become contaminated with the abrasive slurry used in the polishing process. If mechanical bearings provide point or line support for a polishing pad platen, the possibility of cantilever bending of the platen arises. Bearing vibrations can result in undesirable noise, and bearing adjustment typically requires a mechanical adjustment of the assembly. This adjustment is typically a high-precision, time-consuming adjustment. It is an object of the present invention to provide a chemical mechanical polishing machine having fluid bearings that to a large extent overcome the problems set out above. The present invention provides a semiconductor wafer polishing machine comprising at least one polishing pad assembly and at least one wafer holder positioned to hold a semiconductor wafer against the polishing pad assembly, a support positioned adjacent the polishing pad assembly, at least one of said support and said polishing pad assembly comprising a plurality of fluid inlets connectable to at least one source of fluid at a higher pressure, characterised by further comprising a plurality of fluid outlets connectable to at least one fluid drain at a lower pressure and a plurality of bearing surfaces over which fluid flows from a respective inlet to a respective outlet, said polishing pad assembly supported by the fluid over the bearing surfaces for low-friction movement with respect to the support. The following detailed description provides a number of examples of the manner in which the chemical mechanical polishing machine of this invention can incorporate fluid bearings to support the polishing pad and the wafer, with machines that move the polishing pads in linear and rotational motions. In the drawings: Figure 1 is a perspective view of a first embodiment of a chemical mechanical polishing machine incorporating the present invention. Figure 2 is a perspective view of a belt support assembly included in the embodiment of Figure 1. Figure 3 is a top view of hydrostatic bearings included in the belt support assembly of Figure 2. Figure 4 is a perspective view of portions of a chemical mechanical polishing machine which incorporates a second preferred embodiment of this invention. Figure 5 is a perspective view of the belt support assembly of the embodiment of Figure 4. Figure 6 is a perspective view at an expanded scale of a portion of the belt support assembly of Figure 5. Figure 7 is a top view of the belt support assembly of Figure 5. Figure 8 is a vertical cross sectional view of portions of a chemical mechanical polishing machine which incorporates another embodiment of this invention. Figure 9 is a top view taken along line 11-11 of Figure 8. Figure 10 is a cross sectional view taken along line 12-12 of Figure 8. Figure 11 is a perspective view of an alternative table support suitable for use in the embodiment of Figure 8 . Figure 12 is a cross-sectional view of a wafer holder that incorporates fluid bearings. Figure 13 is a side elevational view of a component of the wafer holder of Figure 12. Turning now to the drawings, Figures 1-3 relate to a chemical mechanical wafer polishing machine 10 that incorporates a first preferred embodiment of this invention. This wafer polishing machine 10 includes a wafer holder 12 which holds a wafer W against a polishing pad assembly 14. The polishing pad assembly 14 includes a belt 16 which carries on its outer surface one or more polishing pads 18. The belt 16 travels over rollers 20 which are driven in rotation to cause the belt to move linearly past the wafer holder 12. The belt 16 is supported with respect to movement away from the wafer W by a belt support assembly 22 which is shown more clearly in Figure 2. The belt support assembly 22 includes a support 24 which is fixedly mounted in position with respect to the rollers 20. This support 24 defines a hemispherical recess 26 which supports a belt platen 28. The belt platen 28 defines a lower hemispherical surface 30 that is received within the recess 26 to form a ball joint. The uppermost portion of the platen 28 defines a belt support surface 32. The belt 16 may be wetted and the belt support surface 32 may be grooved to prevent the belt 16 from hydro-planing. Alternatively, the belt support surface 32 may be formed of a low-friction bearing material. Further details regarding the wafer polishing machine 10 can be found in U.S. patent application Serial No. 08/287,658 filed August 9, 1994, assigned to the assignee of this invention. Figure 3 is a top view into the recess 26 with the platen 28 removed. As shown in Figure 3, the recess 26 defines a total of five fluid bearings 34 in this embodiment. One of these fluid bearings 34 is larger than the other four and is positioned centrally. The remaining four fluid bearings 34 are positioned symmetrically around the central fluid bearing. Each of the fluid bearings includes a central fluid inlet 36 which is connectable to a source of fluid under pressure and a respective fluid outlet 38 that is annular in shape and extends around the fluid inlet 36. Each fluid outlet 38 is connectable to a drain of fluid at a lower pressure than that of the source. The region of the recess 26 between the fluid inlet 36 and the fluid outlet 38 forms a bearing surface 40. In use, fluid is pumped from the fluid inlet 36 across the bearing surface 40 to the fluid outlet 38. In this way a film of fluid is formed over the bearing surface 40, and it is this film of fluid that supports the hemispherical surface 30 of the platen 28. The larger central fluid bearing 34 supports the platen 28 against movement away from the belt 16. The four smaller fluid bearings 34 provide self-centering characteristics in order maintain the platen 28 centered in the recess 26. Returning to Figures 1 and 2, the recess 26 and the hemispherical surface 30 are shaped such that the center of rotation 42 of the ball joint formed by the support 24 and the platen 28 is positioned substantially at the front surface of the wafer W that is being polished. In this way, tilting moments on the platen 28 are minimized and any tendency of the ball joint formed by the platen 28 and the support 24 to press the belt 16 with greater force into the leading edge of the wafer W is minimized or eliminated. Figures 4-7 relate to a second preferred embodiment of this invention in which the belt 16 is supported by a belt support assembly 60. This belt support assembly 60 includes a support 62 which acts as a manifold for pressurized fluid and includes a raised peripheral rim 66 (Figure 5). A plurality of cylindrical tubes 68 are contained within the rim 66, and each of these tubes 68 defines an exposed annular end surface 70. The manifold is connected to the interiors of the tubes 68 via fluid inlets 72, and a plurality of fluid outlets 74 are provided as shown in Figure 7. Individual ones of the tubes 68 are sealed to the support 62 by seals 78 that allow a controlled amount of movement of the tubes 68. For example, the seal 78 can be formed of an elastomeric O-ring which bears against a lower cap of the tube 68, and the fluid inlet 72 can be a hollow fastener that secures the tube 68 to the support 62 and compresses the seal 78. As best shown in Figures 6 and 7, interstitial spaces 76 between adjacent tubes 68 allow fluid to flow out of the tubes 68 to the fluid outlets Simply by way of example, the tubes 68 can define an array having a diameter of about 20.32cm (eight inches), and 187 tubes can be used, each having an outside diameter of 1.27cm (1/2 inch) and an inside diameter of 0.95cm (3/8 inch), and the fluid inlets 72 can be about 0.076cm (0.030 inches) in diameter. In use, the manifold is connected to a source of fluid such as water at an elevated pressure, and the fluid outlets 74 are connected to a fluid drain at a lower pressure such as atmospheric pressure. Fluid flows into the tubes 68 via the fluid inlet 72, across the end surfaces 70 which act as bearing surfaces, via the interstitial spaces 76 and the fluid outlets 74 to the fluid drain. The fluid flow over the end surfaces 70 provides broad-area support for the belt 16. Figures 8 - 11 relate to a fourth preferred embodiment of this invention which utilizes a wafer polishing machine having a rotary polishing pad assembly 140. This assembly 140 includes a polishing pad 142 that is supported on a polishing table or platen 144. The polishing table 144 is in turn supported on a table support 146 against motion perpendicular to the polishing pad 142. The polishing table 144 is guided in rotary motion by a shaft 148 that is supported in bearings 150. A vacuum coupling 152 allows connection to a vacuum source that applies vacuum to vacuum hold down grooves 160 in order to hold the polishing pad 142 in place. The shaft 148 is coupled via a shaft coupling 154 and a gear box 156 to a direct drive motor 158. This motor 158 rotates the table 144 and the polishing pad 142 during polishing operations. This embodiment provides a set of fluid bearings 161 on the upper surface of the table support 146 to provide broad-area, low-friction support for the polishing table 144. As best shown in Figure 10, each of the fluid bearings 161 includes a central fluid inlet 162 connectable to a source of a suitable fluid such as water at an elevated pressure. A fluid outlet 164 is defined around the entire set of fluid bearings 161, and this fluid outlet 164 is connectable to a fluid drain at a lower pressure than that of the fluid source. A bearing surface 166 is formed by the table support 146, and fluid flows over the bearing surface 166 as it travels from the fluid inlets 162 to the fluid outlet 164. The polishing table 144 is supported by this fluid film over the bearing surfaces 166. As shown in Figure 11 an alternate design for the table support 180 includes four fluid bearings 181, each having a respective fluid inlet 182, fluid outlet 184 and bearing surface 186. In this embodiment each fluid outlet 184 surrounds only one respective fluid inlet 182. As best shown in Figures 12 and 13, yet another embodiment-of this invention provides a ball joint similar to that of Figures 1-3 in a wafer holder 200. The wafer holder 200 includes a wafer chuck 202 which supports a wafer W on one side and includes a hemispherical element 204 on the other side. The element 204 defines a hemispherical bearing surface 206 and a circular array of fluid deflectors, which in this embodiment are crescent-shaped cutouts 208. Figure 13 shows several of these cutouts 208, which can for example be formed with an edge of an endmill in a milling machine. For example 25-250 cutouts 208 can be arrayed symmetrically around the element 204 near the chuck 202. The hemispherical surface 206 is preferably centered about a center of rotation 210 that is centered on the front face of the wafer W. As shown in Figure 12, the element 204 is supported in a support 212 that defines a hemispherical recess to receive the element 204. Fluid bearings 214 are formed in the support, including fluid inlets 214, fluid outlets 216 and bearing surfaces 218. The fluid bearings 214 function identically to the fluid bearings discussed above in connection with Figure 3, and can be arranged in a similar pattern. The support 212 also includes an array of fluid inlets 220 that direct pressurized fluid against the cutouts 208 to rotate the element 204 in the support 212 during a polishing operation. Preferably, each fluid inlet 220 is oriented almost tangentially to the hemispherical surface 206. For example, there may be 5 to 50 fluid inlets 220, and they are sized to rotate the element 204 at a speed of 1/2 to 50 RPM. The fluid inlets 220 are surrounded on both sides by annular fluid outlets 222 that drain fluid after it has interacted with the cutouts 208. If the holder 200 is intended for use with the support 212 above the element 204, means can be provided to prevent the element 204 from dropping out of the support 212. For example, a mechanical retainer or a vacuum holddown system (not shown) that do not interfere with articulation of the element 204 can be used. The cutouts 208, fluid inlets 220 and fluid outlets 222 cooperate to form a turbine drive system. If desired, the support 212 can be rotated by any suitable drive system to rotate the wafer W, and the turbine drive system can be used to resist torque tending to rotate the element 204 with respect to the support 212, without contributing to the rotation of the wafer W. The fluid bearings described above provide a number of important advantages. The constant flow of fluid out of the bearing allows for no slurry contamination. The hydrostatic bearings described above provide excellent stiffness and wide-area support, thereby reducing or eliminating cantilever bending of the platen. These bearings are nearly frictionless and vibrationless, and therefore they provide the further advantage of reduced noise. These bearings are extremely stable and robust, and they can readily be adjusted merely by controlling fluid pressure. This lends itself to simple, closed-loop feedback control systems. The preferred bearing fluid is liquid water, which is slurry compatible. These bearings are extremely reliable with hardly any maintenance or wear. Of course, it should be understood that a wide range of changes and modifications can be made to the preferred embodiments described above. For example, other fluids including gasses can be used in place of water. If desired the fluid bearings can be formed on the platen rather than the support, and the fluid inlet and outlet may be formed on different components. The hemispherical surfaces described above may depart from a true hemisphere to some extent, for example to provide self-centering forces. It is therefore intended that the foregoing detailed description be regarded as illustrative rather than limiting.

Claims: A semiconductor wafer polishing machine (10) comprising at least one polishing pad assembly (14) and at least one wafer holder (12) positioned to hold a semiconductor wafer (W) against the polishing pad assembly, a support (22) positioned adjacent the polishing pad assembly, at least one of said support and said polishing pad assembly comprising a plurality of fluid inlets (36) connectable to at least one source of fluid at a higher pressure, characterised by further comprising a plurality of fluid outlets (38) connectable to at least one fluid drain at a lower pressure and a plurality of bearing surfaces (40) over which fluid flows from a respective inlet (36) to a respective outlet (38), said polishing pad assembly supported by the fluid over the bearing surfaces for low-friction movement with respect to the support. A semiconductor wafer polishing machine as claimed in claim 1 wherein the polishing pad assembly comprises at least one polishing pad (18) and a belt (16) supporting the at least one polishing pad for linear translation. A semiconductor wafer polishing machine as claimed in claim 1 wherein the polishing pad assembly comprises a polishing pad (142), a rotatable platen (144) supporting the polishing pad, and bearings coupled to the platen to guide the platen in rotational motion with respect to the support about a rotational axis. A semiconductor wafer polishing machine as claimed in claim 3 wherein the bearings coupled to the platen comprise at least four bearing surfaces (181) symmetrically positioned around the rotational axis. A semiconductor wafer polishing machine as claimed in claim 1 wherein each bearing surface (181) is annular, and wherein each fluid inlet (182) is surrounded by the respective fluid bearing surface. A semiconductor wafer polishing machine as claimed in claim 5 wherein each fluid outlet (184) is positioned around the respective bearing surface (181). A semiconductor wafer polishing machine as claimed in claim 5 wherein the fluid outlets (164) are positioned around the plurality of bearing surfaces (166). A semiconductor wafer polishing machine as claimed in claim 1 wherein the support holds a plurality of tubes (68), each tube comprising an exposed annular end surface (70), wherein each fluid inlet (72) is positioned within the respective tube and wherein each bearing surface comprises the annular end surface of the respective tube. A semiconductor wafer polishing machine as claimed in claim 8 further comprising a plurality of seals (78), each seal interposed between the support and the respective tube, said seals accommodating relative motion of the tubes with respect to the support. A semiconductor wafer polishing machine as claimed in claim 8 wherein the tubes define interstitial passages between adjacent tubes, and wherein the fluid outlets (74) communicate with at least some of the interstitial passages (76). A semiconductor wafer polishing machine as claimed in claim 1 wherein said polishing pad assembly comprises at least one polishing pad and platen (28) supporting the polishing pad, said platen comprising a hemispherical surface (30) and wherein the plurality of bearing surfaces (40) are arranged around a hemispherical recess (26) in the support, said recess receiving the hemispherical surface to form a ball joint. A semiconductor wafer polishing machine as claimed in claim 11 wherein the at least one polishing pad is supported on a belt (16), and wherein the belt is supported by the platen (28). A semiconductor wafer polishing machine as claimed in claim 11 wherein the platen rotates about a centre of rotation, and wherein the hemispherical surface is shaped such that the centre of rotation is positioned at a surface of the water being polished. A semiconductor wafer polishing machine as claimed in claim 11 wherein each bearing surface is annular, and wherein each bearing surface surrounds the respective fluid inlet and is surrounded by the respective by the respective fluid outlet.

Inventors: NAGORSKI BOGUSLAW A, TALIEH HOMAYOUN, WELDON DAVID EDWIN, NAGORSKI, BOGUSLAW A., TALIEH, HOMAYOUN, WELDON, DAVID EDWIN
Applicants: LAM RES CORP, LAM RESEARCH CORPORATION
Application year: 1995
Main classification: B24B37
IPC codes: H01L21, B24B37, B24B21