High bandwidth semiconductor memory devices

Abstract: The present invention relates to semiconductor memory devices with high bandwidth architecture. The semiconductor memory device includes arrays (22) comprising a plurality of reference blocks storing a plurality of memory cells, a plurality of word lines (WL) extending in a length direction of the chip, a plurality of complementary bit line pairs (BL, BL ) extending in another length direction of the chip, a plurality of complementary data I/O line pairs (IO, IO ) arranged on the upper portion of the arrays and extending in the said other direction and each being connected to each pair of bit lines, and a plurality of column selection lines (CSL) arranged in the said other length direction and adjacent to the data I/O line pairs, for controlling connection of each pair of bit lines and the data I/O lines.

Description: The present invention relates to a semiconductor memory device and more particularly to a semiconductor memory device and an arrangement of signal lines therein to realize high bandwidth. In designing a semiconductor memory device, one of most important details is to select an appropriate chip architecture. Parameters indicating performance of the semiconductor memory device, for example, power-consumption, high speed operation, chip size, etc. are dependent upon the chip architecture. In practical design of chip architecture, as would be apparent to one skilled in the art, flexibility of the chip architecture enables its base structure to be maintained without any changes, even when changing or adding a peripheral circuit or increasing the semiconductor memory device density. Known memory device designs are described in EP0454998A2 wherein the preamble of claim 1 is based, EP0593152A2, and EP0544247A2. One object of developing a semiconductor memory device is to achieve a high bandwidth in proportion to a high density semiconductor memory device. In other words, the concept of the semiconductor memory device has been changed from one of a simple high density memory device to one of a memory device having a high bandwidth and synchronized with the speed of the system. For example, in the case of a memory device of 64M or more, in particular RAM bus dynamic RAM or synchronous dynamic RAM with a mother version as 256M dynamic RAM, one operational cycle should process data of 256 bits. Therefore, to satisfy the development trend of the semiconductor memory device toward high bandwidth, the architecture of the memory device to be used with a mother version of 256 bits should have an internal bandwidth of 256 bits (one cycle). Memory device designers of various manufactures are studying architectures with possible high bandwidth. In the meanwhile, the higher the density of the memory device, the larger the size of chip. As a result, it is difficult to read and write data due to the incremental loading of each line. FIG. 1 shows a construction of chip architecture for 256M in a conventional semiconductor memory device. The circuit construction of internal columns based on the chip architecture shown in FIG. 1 is disclosed in, for instance, U.S. Patent No. 5,247,482, entitled "Semiconductor Memory Device With High Speed Write Operation". Where a conventional folded bit line structure is selected in order to constitute 256M DRAM, 32K word lines and 16K bit lines are necessary. Of course, 512 cells will be able to be connected to one bit line, but it is common that 256 cells are connected to one bit line. Therefore, an array of 2M can be activated by one word line. Here, it is assumed that a refresh cycle corresponds to 16K, two word lines would be enabled in the length direction of the chip by the activation of a time of a row address strobe signal RAS . Thereby, in the whole of the 256M, arrays of 8M would be activated. If the arrays are activated as depicted in FIG. 1 and two pairs of I/O lines are positioned in a sense amplifier area, the number of data to be possessed in 2M array is 4, which number corresponds to the number of I/O lines. Thus, In the whole of the 256M, 16 data can be possessed. Since this differs greatly from a desired internal bandwidth of 256 bits, practical achievement of high bandwidth is impossible. Also, in this chip architecture, line loading of the I/O line as well as junction loading of gate transistors for connecting the I/O line to a bit line are great, which can lead to difficulties in developing the requisite voltage of the I/O line upon performance of a read operation. Further, upon performance of a write operation, since the data I/O line shown in FIG. 1 is directly connected to the bit line through the gate transistor, the junction loading and bit line are detrimentally affected. For that reason, it is appreciated that the construction of FIG. 1 is not suitable as that of a high density memory device. FIG. 2 shows another embodiment of a conventional semiconductor memory device, through which high bandwidth can be achieved, compared with that of FIG. 1 and in which the line loading of FIG. 1. is greatly reduced. FIG. 2 is disclosed in 1991 SYMPOSIUM ON VLSI CIRCUITS, pp. 133-134, "Circuit Techniques For a Wide Word I/O Path 64 Mega DRAM". For details of FIG. 2, the above paper will be helpful. In the figure, the loading of the I/O line is reduced by using a sub I/O line and a local I/O line. Also, the predetermined number of sense amplifiers are integrated to the sub I/O line, thereby to transmit data to the local I/O line through a differential amplifier. This prior art may have an internal bandwidth to some extent, but it is disadvantageous that the number of NMOS transistors through which data is transmitted is large, upon performance of a write operation. FIG. 3 is a block diagram illustrating the data I/O lines of FIG. 2. Upon performance of a write operation, data on the local I/O line is transmitted to a transistor 2 of FIG. 2 by the enabling of a signal SEC SELECT having column information of a selected block; but if a signal YWRITE for determining a sub I/O line is enabled, the data is transmitted to the sub I/O line through a transistor 4. If an information signal S/A SELECT of a predetermined bit line selected in a plurality of bit lines connected to a single sub I/O line is enabled, the data is transmitted to the bit line through a transistor 10. As mentioned above, when the write operation is performed, since the data transmission is made from the I/O line to the bit line only through three NMOS transistors, it is markedly disadvantageous in performing write operations in a highly integrated memory device having great line loading. It is an object of the present invention is to provide a semiconductor memory device and a method for arranging signal lines therein which are embodied by chip architecture where a high bandwidth can be realized. According to the present invention, there is provided a semiconductor memory chip as indicated in claim 1. Preferably, each column selection line is arranged between said data I/O line and said complementary data I/O line. The semiconductor memory chip may include: a plurality of unit arrays comprising said plurality of reference blocks arranged in the said length direction; a row decoder for enabling said plurality of word lines; a column decoder for enabling said plurality of bit lines; and a plurality of main data I/O lines extending in the sad other length direction, each pair of said plurality of main data I/O lines being connected to each pair of said plurality of data I/O lines, thereby activating said unit arrays in the said length direction of the chip, upon activation of the chip. The semiconductor memory chip may include: a plurality of unit arrays comprising said plurality of reference blocks arranged in the said length direction; a sub array comprising said plurality of unit arrays arranged in the said other length direction; a column gate for connecting each pair of said bit lines to each pair of said plurality of data I/O lines; a plurality of column selection lines for controlling said column gate; a plurality of main data I/O lines controllably connected to each pair of said plurality of data I/O lines; and a multiplexer for connecting each pair of said plurality of data I/O lines to a pair of said plurality of main data I/O lines, thereby allowing the access of data of the number of pairs of said main data I/O lines from each of said unit arrays. Preferably, the semiconductor memory chip includes: a plurality of unit arrays comprising said plurality of reference blocks arranged in the said length direction; a sub array comprising said plurality of unit arrays arranged in the said other length direction; a read selection signal line for selecting one among each pair of said plurality of bit lines connected to one pair of data I/O lines in correspondence with an input of a column address, upon performance of a read operation; a write selection signal line for selecting one among each pair of said plurality of bit lines connected to one pair of data I/O lines in correspondence with the input of the column address, upon performance of a write operation; a column gate for connecting each pair of said plurality of bit lines to each pair of said plurality of data I/O lines; a column selection line extending in the said other length direction, for controlling each said column gate; and a plurality of main data I/O lines connected to each pair of said plurality of data I/O lines through a multiplexer. The read selection signal line and said write selection signal line preferably extend in the said length direction of the chip. The present invention also provides a method of manufacturing a semiconductor memory chip as indicated in claim 7. Preferably, the column selection line is arranged between said data I/O line and said complementary data I/O line. The present invention will now be described by way of example with reference to the accompanying drawings, in which like numbers indicate the same or similar elements: FIG. 1 is a schematic block diagram illustrating a configuration of chip architecture in a conventional semiconductor memory device; FIG. 2 is a circuit diagram illustrating configuration of data I/O lines in a conventional semiconductor memory device; FIG. 3 is a schematic block diagram illustrating data I/O lines of FIG. 2; FIG. 4 is a block diagram illustrating a configuration of chip architecture having a multi I/O line of a semiconductor memory device according to the principles of the present invention, which is comprised of FIGS. 4A and 4B arranged in a parallel pattern in an on-chip; FIG. 5 is a diagram illustrating an example of a method for arranging the data I/O line and a column selection line of FIG. 4; FIG. 6 is a detailed circuit diagram illustrating an embodiment of the column circuits of the chip architecture of FIG. 4; FIGS. 7A and 7B are timing diagrams illustrating read and write operations of a bit line sensing circuit 24 of FIG. 6; FIG. 8 is a schematic block diagram illustrating data I/O paths of FIG. 6; FIG. 9 is a block diagram illustrating an embodiment of a multiplexer 20 of FIG. 4; FIG. 10 is a circuit diagram illustrating an embodiment of a unit multiplexer 60 in the multiplexer 20 of FIG. 9; and FIG. 11 is a circuit diagram illustrating an embodiment of a circuit for generating a signal IOPP input to the multiplexer 20 of FIG. 10. In the following description, numerous specific details, such as a vertical structure of I/O lines, bit line sensing circuits, multiplexers and so on, are set forth in order to provide a thorough understanding of the present invention. It will be understood by those skilled in the art that other embodiments of the present invention may be practised without these specific details, or with equivalent or alternative features. The term "unit array" as used herein refers to a cell array which can be activated by a single word line. The term "sub array" is used to describe a cell array which can be selected by a single row decoder group and a single column decoder group, which comprises a plurality of unit arrays commonly having a data I/O line connected to a single multiplexer group. FIG. 4 is a block diagram illustrating a configuration of chip architecture for a semiconductor memory device according to the principles of the present invention. The following description on the architecture of FIGS. 4A and 4B will be well understood. As compared to the conventional chip architecture of FIG. 1. FIG. 4 shows a new chip architecture according to the principles of the present invention, which discloses 256M DRAM as an embodiment thereof. In the figure, there are provided four banks, two of which are placed in upper and lower portions of FIG. 4A and the others are placed in upper and lower portions of FIG. 4B. Reference numeral 22 designates a single sub array, and 12 designates a single unit array. As shown in the figure, two sub arrays 22 exist in each bank and 16 unit arrays 12 exist in each sub array 22. Here, each unit array 12 comprises 2M (M is equal to 2 20 ), each sub array 22 comprises 32M, and each bank comprises 64M. In the meanwhile, a row decoder 18 is vertically arranged (by which 64M is divided into 32M), and as shown in FIG. 4, the activation of memory cells is made in the direction of word lines. Thus, the unit arrays existing on a same line to each other in the direction of length of the chip are activated. In the above configuration, the bit lines, data I/O lines, and column selection lines are respectively arranged in a perpendicular direction to the word lines. At two sub arrays 22 adjacent to each other in one bank of FIG. 4A or 4B, one shows only data I/O lines IO, and the other shows only column selection lines CSL. This is to avoid confusion in understanding the configurations of data I/O lines IO and the column selection lines CSL. Each sub array 22 has the same number of the data I/O lines IO and column selection lines CSL as indicated in the figure. To avoid interference between signals, it is desirable that the column selection lines be arranged without being directly adjacent to each other, and that data I/O line IO and complementary data I/O line IO be arranged without being directly adjacent to each other. One main feature of the architecture shown in FIG. 4 is that a large amount of data can be read at a time without having a local data I/O line as shown in FIG. 2, and a write operation can be performed at high speed. This will be understood through the following description. Under the above configuration, a method for achieving a high bandwidth in a chip architecture constructed according to the present invention will be discussed hereinafter. The unit array 12 constituting a basic block of the 32M sub array 22 comprises 16 128K blocks including 512 word lines and 512 bit lines (i.e. 256 pairs of bit lines). One unit array 12 includes 4096 (256 column x 16) pairs of bit lines. Here, when performing a refresh operation on a 16K unit, a single word line and an array of 2M are activated in the one bank of 64M, and the number of data I/O lines in the array of 2M is as follows. If 2 n pairs of bit lines are connected to a single data I/O line, 4096/2 n (being equal to 2 m ) pairs of data I/O lines are formed. When the predetermined number of data I/O lines is integrated through a multiplexer 20, a number 2 k of main data I/O lines MIO (which has a form of pair) can be obtained. In other words, in the array of 2M, 4096/2 n (being equal to 2 m ) data I/O lines and a number 2 k of main data I/O lines MIO as shown in FIG. 4 are obtained by a time of activation of a row address signal RAS . In the whole of the 256M, data of 2 k x 4 bits can be obtained. For example, when 8 pairs of bit lines are connected to a single data I/O line, the number of pairs of data I/O lines in the array of 2M is 512 (2 n = 8), and in case of integrating 8 pairs of data I/O lines into a single main data I/O line MIO, the number of pairs of main data I/O lines MIO is 64. Therefore, if the 64 pairs of main data I/O lines MIO are arranged in one sub array 22, data of 256 bits can be obtained in the 256M whole. The chip architecture constructed according to the present invention has, in case of needing a large number of bits in a semiconductor memory device, a flexible ability for adjusting the number of pairs of bit lines connected to data I/O lines and the number of pairs of data I/O lines connected to a main data I/O line MIO. FIG. 5 is a diagram illustrating an example of a method for arranging the data I/O lines and column selection lines of FIG. 4, which is useful in easily understanding the architecture of FIG. 4. In the figure, each of the column selection lines CSL is repeatedly arranged between each of the data I/O lines IO and the complementary data I/O lines IO on-chip. Even if it is assumed that the conventional method, as shown in FIG. 2, for arranging signal lines having data I/O lines and column information is arranged in a different direction from the data I/O lines, the information signal S/A SELECT requires data I/O lines, an SEC SELECT line having column information, a YREAD and a YWRITE in the identical direction to the each other. That is, two data I/O lines, one signal line SEC SELECT, and one line of signal YREAD or YWRITE are arranged in the identical direction to each other. It is inevitable that many data I/O lines are required for achieving high bandwidth. For that reason, a basic structure having at least four lines is repeatedly arranged, thus rendering the chip size too large. However, in FIG. 5, since data I/O line and column selection line basically constructed with 3 lines are repeatedly arranged, the size of chip is reduced. Further, since the arrangement of the chip is made on the upper portion of the array, a sufficient number of data I/O lines required for achieving the high bandwidth can be arranged. In the meanwhile, since the column selection line is positioned between the data I/O lines, the probability of coupling between the data I/O lines IO and IO is suppressed. Since the column selection lines are not adjacent to each other, the identical effect is obtained. Of course, it is to be understood that the arrangement of FIG. 5 shows one preferred embodiment of the present invention. In addition, on the on-chip substrate, as shown in FIG. 5, between a layer where the data I/O lines IO and IO and the column selection line CSL exist and a substrate, a bit line layer and a word line layer respectively are arranged. Here, the bit lines are arranged in the same length direction as the data I/O line IO and IO and the column selection lines CSL and parallel to each other. The word lines are arranged in the direction perpendicular to the data I/O lines IO and IO and the column selection lines CSL. In FIG. 5, the method of arranging the data I/O lines IO and IO and the column selection lines CSL is made using a base structure having three IO -CSL-IO lines, but it should be noted that another base structures such as, for example, IO-CSL- IO , or IO- IO -CSL may be arranged in the repeated manner. FIG. 6 is a detailed circuit diagram illustrating an embodiment of the column circuits, i.e., a bit line sensing circuit of the chip architecture of FIG. 4. In the figure, the bit line sensing circuit indicated by a dotted block 24 is directly associated with a bit line sensing operation. In this configuration of bit line sensing circuit 24, a sense amplifier comprises a p-type sense amplifier 32 and an n-type sense amplifier 34, which are arranged on bit lines BL and BL , for developing data transmitted on the bit lines. Further, a write transistor 36 has as a gate input a write selection signal WS and is connected to data I/O line IO at a drain terminal thereof, and a write transistor 38 has as a gate input a column selection signal CSL (hereinafter referred to as a "column selection line" or "column selection signal") and has a channel connected between a source terminal of the write transistor 36 and the bit line BL. A charging transistor 40 has as a gate input the column selection signal CSL and is connected to a ground terminal GND at a source terminal thereof, and a write transistor 42 has as a gate input the write selection signal WS and is connected to the data I/O line IO at a drain terminal thereof. A write transistor 44 has as a gate input the column selection signal CSL and has a channel connected between a source terminal of the write transistor 42 and the bit line BL , and a read transistor 46 is connected to the bit line BL at its gate terminal and connected to a drain terminal of the charging transistor 40 at a source terminal thereof. A read transistor 48 has as a gate input a read selection signal RS and has a channel connected between a drain terminal of the write transistor 46 and the data I/O line IO , and a read transistor 50 is connected to the bit line BL at a gate terminal thereof and is connected to the drain terminal of the charging transistor 40 at a source terminal thereof. Also, a read transistor 52 has as a gate input the read selection signal RS and has a channel connected between a drain terminal of the read transistor 50 and the data I/O line IO. In addition to the components described above, there are further provided a memory cell 26 which is selected by the activation of the word line WL, an equalization circuit 28I for equalizing left bit lines BL and BL , a separating transistor 30I for separating the left bit lines BL and BL , an equalization circuit 28J for equalizing right bit lines BL and BL , and a separating transistor 30J for separating the right bit lines BL and BL . Of course, these are known in the art. The read selection signal RS and write selection signal WS are arranged in the direction perpendicular to the data I/O lines IO and IO and column selection signal CSL, i.e., in the direction of the word line WL. Control signals of FIG. 6, that is, EQ1, ISOI, LA, LA , ISOJ and EQJ are described in Korean Patent Application No. 92-12436 filed on July 13, 1992, entitled "A Row Redundancy Circuit Sharing a Fuse Box". It should be noted that this configuration of the bit line sensing circuit 24 as shown in FIG. 6 can be variously made in accordance with that of the chip architecture of FIG. 4 according to the present invention. An explanation of the sensing operation, such as read and write operation of cell data, of the bit line sensing circuit 24 will now be given in detail with reference to FIGS. 7A and 7B. Firstly, upon performance of the read operation of FIG. 7A, it is well known that the row address and column address are input in synchronism with the activation of a row address strobe signal RAS and a column address strobe signal CAS and then a specific memory cell is designated. The present invention shows an embodiment where data of 256 bits is outputted from a 256M DRAM. As previously mentioned with reference to FIG. 4, a pair of data I/O lines are connected to the 8 pairs of bit lines. Thus, one column selection line CSL serves to select eight pairs of bit lines connected to a specific pair of data I/O lines. In FIG. 7A, the read selection signal RS serves to select a desired pair of bit lines among the eight pairs of bit lines. Here, the read selection signal RS is generated as a specific one by combination of decoded addresses DCA 0, 1 and 2. Then, In FIG. 6, the data stored in the memory cell 26 is transmitted to the bit line BL by enabling of the word line WL and a potential difference between the bit lines BL and BL in accordance with level of the data is generated, thus developing the potential by the n-type sense amplifier 34. Hence, only one of the read transistors 46 and 50 is turned on in correspondence to the voltage level of the bit lines BL and BL . At this time, the charging transistor 40 is previously turned on by the column selection signal CSL. Each of the read transistors 48 and 52 is turned on by the read selection signal RS. Then, a precharged voltage to the data I/O line IO or IO becomes discharged in dependence upon such switching paths as mentioned above. As a result, a voltage difference is generated between the data I/O lines IO and IO , and the generated voltage difference is amplified by an amplifying means such as data I/O sense amplifier (not shown, which is an unnecessary means when the voltage difference is sufficiently generated between the data I/O lines IO and IO ) to be transmitted to the main data I/O line MIO. Consequently, one of n pairs of bit lines (in the present description, n is equal to 8) is selected by the read selection signal RS, and the selected pair of bit lines is transmitted to the data I/O line through the read transistor 48 or 52. And, through the aforementioned path, data on the bit line is transmitted to the main data I/O line MIO. Referring to the description above with reference to FIG. 4, since 16 basic blocks of 128K are included within the unit array 12 and at the same time, the number of main data I/O lines MIO transmitting data on each basic block is 4, 64 data within a single sub array 22 can be obtained through 64 main data I/O lines MIO. On the other hand, upon performance of the write operation of FIG. 7B, when given data is received through a data input buffer (not shown) from the exterior of the chip and then transmitted to the main data I/O line MIO or MIO , the transmitted data proceeds to the data I/O lines IO or IO . A write operation for the transmitted data is operated at a high speed by the enabling of the column selection signal CSL of a given selected column and by the write signal WS (which signal selects one of 8 pairs of bit lines), through the write transistors 36 and 38 or 42 and 44, that is, through two NMOS transistors. FIG. 8 is a schematic block diagram illustrating the data I/O path of FIG. 6, which schematically shows the processes of read and write operations. Under the architecture constructed according to the principle of the present invention, it will be appreciated, the separate local data I/O line as shown in FIG. 2 is not required to achieve a high bandwidth of 256 bits. Therefore, the solution of the problem of line loading can be found in only the main data I/O line and data I/O line, thus reducing the seriousness of the loading problem when compared with that in FIG. 2. Furthermore, the architecture constructed according to the principles of the present invention has more evident advantages in improvement of write speed and reduction of size of the high density memory device as compared with those of FIG. 2. In the conventional prior art, five signal lines, for example, local data I/O line LOCAL I/O, sub data I/O line SUB I/O, write enable signal line YWRITE, read enable signal line YREAD and column selection line CSL are arranged in the column direction. However, in the present invention, three signal lines, for example, main data I/O line MIO, data I/O line IO and column selection line CSL are arranged. This contributes to the high integrity of the semiconductor memory device. Also, under the architecture constructed according to the principle of the present invention, the word line WL, read selection line RS and write selection line WS are arranged in the direction of the length of the memory device, and the bit line, data I/O line IO and column selection line CSL are arranged in the direction perpendicular to the word lines, thus effectively receiving and generating multi-bit data. As previously described, when 2 n pairs of data I/O lines are connected with a pair of data I/O lines, 2 m pairs of data I/O lines and 2 m pairs of column selection lines are accordingly required. Thus, the basic block according to the present invention has a layout where a pair of data I/O lines and one column selection line are regularly arranged in the direction perpendicular to the word line. This results in reduction of layout area occupied for drawing multi-bit I/O data. The construction of FIG. 4 for multiplexing the data I/O line IO and main data I/O line MIO will be described with reference to FIG. 9. This figure shows an embodiment of a multiplexer 20 of FIG. 4, in which a plurality of unit multiplexers 60 are included in the single multiplexer 20. Here, since the architecture of FIG. 4 is constructed to output data of 256 bits, it will be appreciated that one unit multiplexer 60 is contained per 8 pairs of data I/O lines. FIG. 10 is a circuit diagram illustrating an embodiment of the unit multiplexer 60 in the multiplexer 20 of FIG. 9. Under this configuration, there are provided a transmission gate 62 with as gate inputs the column selection signal CSL and its complementary signal CSL and arranged between the data I/O line IO and main data I/O line MIO, a transmission gate 64 with as gate inputs the column selection signals CSL and CSL and arranged between the complementary data I/O line IO and main data I/O line MIO , a NOR gate 68 which inputs the complementary column selection signal CSL and a signal IOPP, a PMOS transistor 70 which receives as its gate input an output signal of the NOR gate 68 and has a channel arranged between the main data I/O lines MIO and MIO, for equalizing the two signal lines, and PMOS transistors 72 and 74 which commonly receive as their gate inputs the output signal of the NOR gate 68 and have a channel arranged in parallel between the main data I/O line MIO and MIO , for precharging each of the two signal lines. It should be noted in the construction of FIGS. 9 and 10 that only selected data I/O lines IO and IO and the column selection line CSL corresponding thereto are enabled, thus transmitting an output to the main data I/O lines MIO and MIO . FIG. 11 is a circuit diagram illustrating an embodiment of a circuit for generating a signal IOPP input to the multiplexer 20 of FIG. 10. In this figure, enabling processes of input signals DCA and COL were described with reference to FIG. 7. As previously explained, a semiconductor memory device and method for arranging signal lines therein which are embodied by chip architecture where a high bandwidth can be realized without having increment of size of chip has been described. In addition, the semiconductor memory device and method for arranging signal lines therein has advantages that the layout in the column direction as well as in the row direction can be constructed in a simple manner by activating the array in the length direction of a chip, and line loading problems can be minimized by requiring only two data I/O lines serving to transmit data between cell arrays and input/output terminals of the chip. Furthermore, the semiconductor memory device and method for arranging signal lines therein has an advantage that a desired number of high bandwidth can be achieved by adjusting the connections of bit lines and data I/O lines and of data I/O lines and main data I/O lines.

Claims: A semiconductor memory chip comprising: an array (22) comprising a plurality of reference blocks containing a plurality of memory cells; a plurality of word lines (WL) extending in a length direction of the chip; a plurality of bit lines (BL) extending in another length direction of the chip, each pair of said plurality of bit lines comprising a bit line and a complementary bit line; a plurality of data I/O lines (IO) extending in the said other length direction, each pair of said plurality of data I/O lines comprising a data I/O line and a complementary data I/O line, and each controllably connected to each pair of said bit lines; and a plurality of column selection lines (CSL) for controlling the connection of each pair of said plurality of bit lines to each pair of said plurality of data I/O lines, characterised in that the plurality of column selection lines are arranged in the said other length direction and adjacent to said data I/O line and said complementary data I/O line. The semiconductor memory chip as claimed in claim 1, wherein each column selection line is arranged between said data I/O line and said complementary data I/O line. A semiconductor memory chip as claimed in claim 1 or claim 2 including: a plurality of unit arrays comprising said plurality of reference blocks arranged in the said length direction; a row decoder for enabling said plurality of word lines; a column decoder for enabling said plurality of bit lines; and a plurality of main data I/O lines extending in the said other length direction, each pair of said plurality of main data I/O lines being connected to each pair of said plurality of data I/O lines, thereby activating said unit arrays in the said length direction of the chip, upon activation of the chip. A semiconductor memory chip according to claim 1 including: a plurality of unit arrays comprising said plurality of reference blocks arranged in the said length direction; a sub array comprising said plurality of unit arrays arranged in the said other length direction; a column gate for connecting each pair of said bit lines to each pair of said plurality of data I/O lines; a plurality of column selection lines for controlling said column gate; a plurality of main data I/O lines connected to each pair of said plurality of data I/O lines; and a multiplexer for connecting each pair of said plurality of data I/O lines to a pair of said plurality of main data I/O lines, thereby allowing the access of data of the number of pairs of said main data I/O lines from each of said unit arrays. A semiconductor memory chip according to claim 1 including: a plurality of unit arrays comprising said plurality of reference blocks arranged in the said length direction; a sub array comprising said plurality of unit arrays arranged in the said other length direction; a read selection signal line for selecting one among each pair of said plurality of bit lines connected to one pair of data I/O lines in correspondence with an input of a column address, upon performance of a read operation; a write selection signal line for selecting one among each pair of said plurality of bit lines connected to one pair of data I/O lines in correspondence with the input of the column address, upon performance of a write operation; a column gate for connecting each pair of said plurality of bit lines to each pair of said plurality of data I/O lines; a column selection line extending in the said other length direction, for controlling each said column gate; and a plurality of main data I/O lines connected to each pair of said plurality of data I/O lines through a multiplexer. The semiconductor memory chip as claimed in claim 5, wherein said read selection signal line and said write selection signal line extend in the said length direction of the chip. A method of manufacturing a semiconductor memory chip comprising: forming an array (22) comprising a plurality of reference blocks, arranged in a matrix form, containing a plurality of memory cells; forming a plurality of word lines (WL) for selecting rows of said plurality of memory cells, said plurality of word lines extending in a length direction of the chip; forming a plurality of bit lines (BL) for selecting columns of said plurality of memory cells, each pair of said plurality of bit lines comprising a bit line and a complementary bit line and extending in an other length direction of the chip; forming a plurality of data I/O lines (IO) extending in the said other length direction, each pair of said plurality of data I/O lines comprising a data I/O line and a complementary data I/O line and controllably connected to each pair of said plurality of bit lines; and forming a column selection line (CSL) for controlling connection of each pair of said plurality of bit lines to each pair of said data I/O line, characterised in that the column selection line is formed extending in the said other length direction adjacent to said data I/O line and said complementary data I/O line. A method according to claim 7, in which said column selection line is arranged between said data I/O line and said complementary data I/O line.

Inventors: JEONG SE-JIN, SEO DONG-IL, JEONG, SE-JIN, SEO, DONG-IL
Applicants: SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO., LTD.
Application year: 1995
Main classification: G11C7
IPC codes: H01L27, G11C11, G11C7, H01L21