TWO-PHASE THERMAL BAG COMPONENT

Abstract: A two-phase liquid cooling system for an electronic component comprised of flexible sealed bag which is partially filled with a liquid coolant. Sufficient residual non-condensing gas is maintained in the bag so that some of the gas dissolves in the liquid coolant when the device is not operating and at ambient temperature. During warm-up, the residual gas comes out of solution and creates nucleation sites that assist in initiating boiling. The bag is air and fluid-impermeable, and has sufficient flexibility such that as coolant vaporizes, the bag expands to maintain the internal bag pressure substantially the same as the ambient environmental pressure. The bag may also be provided with a metal heat spreader plate which passes through a wall of the bag and assists with transferring heat from the component to the coolant. The heat spreader plate may be specially treated to allow the flexible bag material to be directly heat sealed to the plate and to provide nucleation sites to enhance coolant boiling.

Description: TWO-PHASE THERMAL BAG COMPONENT CROSS-REFERENCE TO RELATED APPLICATION This application is a continuation-in-part of our co- pending application serial number 08/120,153 filed September 10, 1993 entitled "Two-Phase Component Cooler". FIELD OF THE INVENTION This invention relates generally to an apparatus for dissipating the heat generated by electronic components, such as integrated circuits, and, in particular, to a flexible bag-like container which contains a coolant in both a liquid phase and vapor phase to provide enhanced heat dissipation. BACKGROUND OF THE INVENTION Traditional methods of cooling electronic systems, such as com- puters have most commonly involved air as the heat transfer medium within the system. In such systems, heat generated by electronic com¬ ponents is typically transferred to the air surrounding the components and then to an ultimate sink, generally the room in which the electronic system is located. Heat transfer between the components and the surrounding air may be enhanced by increasing the surface area of contact between the elec¬ tronic components and the air, for example, by using a heat sink, which itself may have fins to further increase the surface area available for heat transfer. Air circulation within the system may occur by natural convection or may be further enhanced by forcing the air to circulate about the com r ponents by means of a fan or blower. As electronic equipment becomes more sophisticated and yet more compact in size, the density of the heat-dissipating components mounted on a particular circuit board has necessarily increased. This is also true of the integrated circuit packages themselves, with the number and density of active devices, such as transistors, within a given package steadily increas¬ ing over time. Unfortunately, these trends of increasing complexity and decreasing size have meant that the amount of heat dissipated within a given volume has also increased. With current-day integrated circuit technologies, the time is fast approaching when conventional air convection cooling methods, even those using forced air circulation with large heat sinks, will not ade¬ quately maintain certain high density integrated circuit packages within their peπnissible operating temperature range. Consider, for example, the Pentium^M series of microprocessor chips recently introduced by Intel Corporation of Santa Clara, California. Depending on its operating speed, a Pentium^M P-5 chip typically dis¬ sipates on the order of 15 watts in a package which has less than two square inches of surface area, and a Pentium ™ M p-6 chip dissipates from 22 to 30 watts. Other microprocessor chips, such as the Alpha^M microprocessor recently introduced by Digital Equipment Corporation of Maynard, Mas¬ sachusetts are projected to produce heat dissipations of 25 watts or higher in the same two square inches in their highest speed versions. If conventional air convection cooling techniques are to be used, such chips would require very high air flow rates over finned heat sinks in order to maintain the chips in their desired operating temperature range. Although such forced air cooling requirements are technically feasible, practical considerations rule out their use in current day personal computer applications. One reason is that the blowers or fans necessary to generate such a high air flow rate would necessarily create an unacceptable noise level in an operating environment such as an office which is expected to remain relatively quiet. This problem is further exacerbated in applications such as laptop and notebook computers, where the additional noise and weight of a forced air cooling system is simply neither practical nor desired. Consequently, there has been renewed interest in adapting liquid cooling techniques, which make use of natural convection of a coolant, to the problem of cooling high-powered integrated circuits. -These techniques generally fall into two broad groups, including single-phase and two-phase cooling systems. In a single-phase liquid cooling system, the coolant remains in the liquid phase over the normal and expected system operating temperature range. In a two-phase system, the coolant changes from the liquid phase to the vapor phase during at least one point in the normal operating temperature range. One example of a single-phase liquid cooling system makes use of a hermetic enclosure filled with a high-boiling point liquid coolant which completely encloses the heat generating component. The enclosure may also be provided with external fins. Heat is transferred from the heat dis¬ sipating component to the liquid coolant by conduction and from the coolant to the walls of the enclosure by natural convection; the enclosure itself may further be cooled by circulating air around it. Such a cooling method can be effective, but involves other problems such as chemical incompatibilities between the component and the coolant over the long-term, and the dif¬ ficulty of obtaining access to the component for maintenance. Other single-phase systems do not directly immerse the integrated circuit component in the liquid, but instead confine just the coolant to a container which is then placed in intimate contact with the component. Heat is thus conducted from the component through the container wall into the liquid, which then dissipates the heat by natural convection. One embodiment of the latter single-phase system uses a container in the form of a sealed flexible bag which is completely filled with a liquid coolant. The bag is typically constructed from a flexible plastic film which is relatively impermeable to both the air and the enclosed liquid. Metal inserts or thermal vias, which pass through the wall of the bag, may also be used with this type of system to more efficiently conduct the heat from the component to the coolant. Examples of such coolant bag systems are shown in U.S. Patent Nos. 4,997,032 and 5,000,256 assigned to Minnesota Mining and Manufacturing Company of St. Paul, Minnesota. While such single-phase bag systems can be useful in certain situa¬ tions, they have several disadvantages. Because they use a single-phase coolant, the available heat transfer rate is still relatively low. Conse¬ quently, they cannot typically be used with the high heat dissipating elec¬ tronic components such as microprocessors. In addition, the bags have a relatively large volume which conflicts with the current trend of reducing system size as much as possible, and thus single-phase bag systems have not found widespread practical application. Two-phase liquid cooling systems have increasingly been used to overcome the limitations associated with single-phase systems. In a two- phase system, as the component heats up, a liquid coolant is vaporized. The vapor then travels to a condenser section of the system, where the coolant vapor is converted back into a liquid. The liquid is returned by some means to the heat dissipating component and the boiling and condens¬ ing cycle is continuously repeated. Such a two-phase device is shown in U.S. Patent No. 3,741,292 assigned to International Business Machines Corporation of Armonk, New York. In that system, the heat dissipating component is placed within a hermetic enclosure and directly immersed in a pool of low boiling point, dielectric liquid coolant. The heat dissipated by the component causes the liquid to boil, and the resulting vapor is collected in an enclosure space located above the liquid pool. The enclosure space is filled with inwardly extending fins which serve as a condenser for the coolant vapor. As the vapor condenses, it runs back into the liquid pool under the influence of gravity. Other two-phase cooling systems, so called heat pipe systems, do not directly immerse the component into the coolant. Such systems consist of an elongated hermetic container made with thermally conductive walls, for exam le, from copper. One end of the container acts as an evaporator and the other end acts as a condenser. A wick or other capillary device, such as a fine mesh screen, extends along the interior of the container. During manufacture of the heat pipe, the container is partially filled with low boiling point liquid coolant, and any residual, non condensing gases, such as air, are purged, and the container is then sealed. The heat dissipat¬ ing component is mounted to the evaporator end of the pipe, and heat is transferred by conduction through the container wall. As the coolant evaporates, or boils, the resulting vapor travels down the container to the other end where it condenses back to a liquid. The liquid is then returned to the evaporator end by means of the wick. Although the direct immersion and heat pipe techniques can transfer heat away from the heat dissipating component quite efficiently, they also have their limitations. More specifically, both techniques use rigid, hermetically sealed containers. When the ambient temperature changes, the pressure inside the container changes, with a consequent change in the boil¬ ing point of the coolant. Thus, the cooling capacity of the system changes when the ambient temperature changes. In addition, because the container is evacuated, there exists a sig¬ nificant pressure differential along the walls of the container. As the con- tainer is exposed to repeated heating and cooling cycles, the repeated change in pressure differential causes the walls of the container to flex. Eventually, the container fatigues, causing small leaks. When a leak does occur, air is drawn into the container. Later on, when the component is then reactivated, the presence of air increases the pressure inside the con¬ tainer and may cause some of the liquid to be driven out of the container, thereby compromising the cooling capability of the device. Consequently, such devices are typically not considered to be useful in environments where long-term low-maintenance operation is required. Furthermore, the change in internal pressure results in a further increase in the coolant boiling point, which may also be altered by the presence of any residual air introduced into the system bv leaks. Such devices thus cannot be expected to have a single predictable boiling temperature, and are therefore difficult to control over a wide temperature range. Prior art two-phase systems are also prone to a phenomenon called overshoot. This occurs during device warmup as a result of the fact that the coolant does not begin to boil when the device temperature initially reaches the nominal boiling point. Instead, the tendency is for the tempera¬ ture to continue to increase past the boiling point, and then for boiling to suddenly erupt. Once coolant boiling finally does occur, the device temperature returns to its normal operating range. However, in the meantime, the system has been temporarily subjected to a temperature well above the boiling point. Overshoot is a highly undesirable condition as it stresses the cooling system components and in some cases may even cause the components to temporarily operate outside their expected temperature range. What is needed is a cooling device which will adequately cool current-day high-powered integrated circuits in a compact, reliable package, which avoids the problems associated with prior art systems. Specifically, the cooling device should have a heat transfer rate higher than the heat transfer rates available with known single-phase sys- tems, without requiring that the heat-dissipating component be immersed in a coolant liquid. Furthermore, the cooling device should not exhibit the problems of present day two-phase systems, but rather should be immune to leaking, have a predictable boiling point, and avoid overshoot. SUMMARY OF THE INVENTION Briefly, the inventive liquid cooling device comprises a sealed bag or other closed container formed of a flexible material which is imperme¬ able to both air and liquid coolant. A portion of the bag is disposed adjacent to the heat-dissipating component and the interior of the bag is partially filled with a liquid coolant having a boiling point below the normal maximum operating temperature of the heat-dissipating component. Because the bag is only partially filled with coolant, the system cycles in two-phase operation, with the coolant alternately vaporizing at the bag por- tion adjacent to the component and condensing at bag portions distant from the component. The portion of the bag which is not filled with coolant is filled with coolant vapor and non-condensing gas and the bag is sufficiently flexible such that the interior bag pressure remains substantially at the ambient environmental pressure both at ambient temperature and over the entire operating temperature range. In accordance with one preferred arrangement, the flexible bag is made from a material which has a sufficient film strength and a sufficiently high melting point to withstand the normal operating pressures and tempera¬ tures produced by the heat-dissipating component. One illustrative material suitable for use with the preferred arrangement is a laminate with a central aluminum layer to act as a vapor barrier, one more outer layers formed of a polyester to provide film strength, structural rigidity, and abrasion resistance, and an inner layer formed of a composite polypropylene for heat sealing. Such laminates, known as Meals Ready to Eat (MRE) materials are well known in the food packaging industry. Preferably, the liquid coolant disposed within the bag is a thermally- stable, environmentally-safe fluorochemical with a boiling point at atmospheric pressure in the vicinity of 60°C which is well below the maxi¬ mum operating temperature of 80-90°C of most commercial-grade elec¬ tronic components. In accordance with another embodiment, a heat spreader plate is preferably disposed between the interior of the bag and the heat-dissipating component, which heat spreader plate acts as a thermal via between the coolant and the heat-dissipating component. Since it is a primary surface for transfer of heat from the heat-dissipating component to the coolant, the heat spreader plate provides a stable, predictable surface at which the phase change from liquid to vapor will take place within the cooling system and, in accordance with another embodiment of the invention, the plate is treated to provide nucleation sites to enhance this boiling. The heat spreader plate is formed of material having high thermal conductivity, such as aluminum, and extends through the wall of the bag. Accordingly, the heat spreader plate has a first portion outside the bag which thermally contacts the heat-dissipating component and a second por¬ tion inside the bag which thermally contacts the coolant liquid. The bag may " be sealed around the edges of the heat spreader plate by means of O- ring or other compression seals, but, in accordance with another embodi¬ ment, the heat spreader plate is first treated to allow the bag material to be directly bonded to the spreader plate. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is an isometric view of a liquid cooling apparatus con¬ structed in accordance with the principles of the invention; FIG. IB is an isometric view of the inventive cooling apparatus inserted into an enclosure which holds the apparatus in a vertical orienta¬ tion; FIG. 2 is a cross-sectional view of the cooling apparatus shown in FIGS. 1A and IB taken along section line 2-2 shown in FIG. 1A; FIG. 2 A is a cross-sectional view showing in detail a clip for hold- ing the cooling apparatus in place against a heat-dissipating component; FIG. 3 is a cross-sectional view of an alternative embodiment of a heat spreader plate for use with the present invention making use of fms to provide greater surface area for heat transfer; FIG. 4 is a top plan view of a heat spreader plate; FIG. 5 is an alternative arrangement showing the bag disposed in a horizontal orientation; FIG. 6 is a cross-sectional view showing integrated circuit chips dis¬ posed underneath the bag; and FIGS. 7A, 7B, and 7C are cross-sectional and top views of a pleated portion of the bag. DETAILED DESCRD7TION OF THE PREFERRED EMBODIMENTS FIG. 1A illustrates a heat transfer apparatus 10 for cooling an elec¬ tronic component such as an integrated circuit or chip package 12. The integrated circuit package 12 is mounted on a circuit board 14 of the type that is commonly used in computer and other electronic systems. Integrated circuit package 12 is a relatively high-powered com- ponent which may dissipate 10 watts or more and which itself may contain many hundreds of thousands of active electronic devices. Most commonly, the integrated circuit package 12 is a microprocessor chip or other such highly-sophisticated component, but may also consist of several integrated circuits mounted on a heat spreader plate as will hereinafter be described. In addition, the integrated circuit package may be a multi-chip module hav¬ ing more than one chip within a single ceramic or plastic package. Components 16 other than the integrated circuit package 12 are also typically mounted on the circuit board 14. For clarity, FIG. 1A does not show that many additional integrated circuit chips are normally included on the circuit board 14. The circuit board 14 includes connectors 18 enabling the integrated circuit package 12 and other components 16 to communicate with circuits on other circuit boards. The circuit board 14 is intended to be mounted in a vertically - oriented position in a circuit board enclosure 15, as shown generally in FIG. IB, and the circuit board 14 is typically inserted and extracted from the enclosure 15 using levers 20. Returning to FIG. 1A, the heat transfer apparatus 10 according to the invention will be described more particularly. The invention comprises a flexible, sealed bag 22 which is shaped to conform to the available space on the circuit board 14 above the integrated circuit package 12, while at the same time having a low enough profile so as not to interfere with adjacent circuit boards 14 when installed in the enclosure 15 (FIG. IB). In addition, the bag 22 is shaped so that vapor which is generated in the lower evaporator portion 25 of the bag 22 condenses in the upper condenser por¬ tion 23 and returns to the evaporator portion 25 by gravity. The bag 22 is typically manufactured separately from the integrated circuit chip 12, and is formed of a flexible sheet material which is impermeable to air, other gases, and liquids. The material may be a single or multi-layer plastic film and is usually a type of thermoplastic film, because the latter is readily available and is often heat-sealable. The preferred material for the bag 22 is a multi-layer film formed of a thin aluminum or other metallic layer laminated on both sides with one or more layers of a modified polyester terphthalate (PET) film and is held together with a laminating adhesive on one side, and polypropylene film on the other side. One example or such a multi-layered film is sold as Meals Ready to Eat (MRE) type film by the American National Can Company of Mt. Vernon, Ohio. The bag can also be made of any other similar material which can withstand the normal operating temperature of the components, typically 70-110 degrees centigrade (°C). The sheet material should be suf¬ ficiently flexible that the internal pressure in the bag interior remains at, or near, the ambient environmental pressure over the entire operating tempera¬ ture range to which the bag is exposed. Since the internal bag pressure changes little during operation, the coolant boils at, or very near, its boiling point at ambient pressure. Thus, the device 10 does not have the extended temperature ranges which characterize the prior art devices. The bag 22 is attached to the circuit board 14 and to the integrated circuit package 12. To permit attachment of the bag 22 to the circuit board 14, the periphery 21 of the bag 22 is formed more rigidly than the center, and includes holes 24 adapted to receive fasteners such as screws or the like which hold the periphery 21 of the bag 22 against standoffs 29. The rigid periphery 21 of the bag 22 may be formed by heat-sealing the two layers of the plastic film together to form a rigid lip or by heat-sealing or attaching the plastic film layers to a third more rigid frame. The peripheral portions 26 of the bag adjacent the chip 12 are also somewhat rigid and adapted and/or shaped to be held in position against the integrated circuit package 12 with one or more clips 28. The clips hold the lower side of the bag 22 against the outer surface of the package 12 in a manner that will be described in greater detail below. As shown in the cross-sectional view of FIG. 2, the interior 30 of the bag 22 is partially filled by a quantity of liquid coolant 31. In particular, as indicated by level line 21a, the liquid 31 typically occupies from 75 to 90 percent of the bag interior 30 when the bag is in storage, i.e. , at room temperature. The bag 22 must only be partially filled with coolant, so that two-phase operation occurs, as described below. However, the bag should be filled with enough coolant so that at least a portion of the heat spreader 34 is always immersed in liquid during operation. Thus, even at the maximum operating temperature of the condenser (e.g. , when a max¬ imum amount of coolant is in the gas phase), the liquid level is approximately as shown by level line 21b. The coolant liquid 31 preferably comprises a liquid (at the ambient environmental temperature) which is thermally conductive, chemically inert, non-toxic, non-ozone-depleting, and thermally stable, and which is also preferably electrically non-conductive to prevent short .circuiting of external electronic components should the bag 22 be ruptured for any rea- son. The thermal stability of the liquid 31 enables it to maintain its physi¬ cal and chemical properties throughout repetitive thermal cycles of the integrated circuit package 12 during normal use. Preferred liquids include the well-known Fluorinert^- -^ electronic fluids which are commercially available from the Minnesota Mining and Manufacmring Company of St. Paul, Minnesota (Fluorinert is a trademark of the Minnesota Mining and Manufacturing Company of St. Paul, Min¬ nesota). A coolant liquid which is particularly suitable for use with the invention is FluorinertTM FC-72 liquid, which has a relatively low boiling point of approximately 56 degrees Centigrade (°C). The boiling point of FC-72 is thus well below the maximum operating temperature range specified of 80-90°C for the typical integrated circuit package 12. Other coolants 31 which are suitable for use with the invention includes, but is not limited to methylene chloride, ethyl alcohol, methanol, and other chemi¬ cals, as long as they exhibit a predictable boiling point over a range of operating temperatures. Contrary to prior art designs, the bag 22 is not purged of residual gases during manufacture. Instead, residual, non-condensing gases, such as air, are sealed within the system in order to promote boiling, in a manner that is described in detail below. As temperature inside the bag 22 increases, because the bag 22 is formed of a flexible material, the amount of gas inside the bag is not affected by the ambient pressure. The bag 22 is thus less prone to the long term leaking problems associated with certain other prior art devices in which .the bag or other container is evacuated of such gases or completely filled with coolant 31. In addition, as explained below, the residual gases dissolve in the coolant liquid 31 and assist in initiating boiling. The process of boiling is of particular concern to the present inven¬ tion, because, unlike prior art arrangements using similar bags, a cooling system constructed in accordance with the principles of the present inven¬ tion requires that the liquid 31 enter a vapor state when the temperature of the integrated circuit package 12 rises to a predetermined temperature. More particularly, as heat is dissipated by the integrated circuit package 12, the temperature of the coolant 31 approaches the boiling point. Once boiling begins, thermal transfer is enhanced (as compared to convec¬ tion) since the coolant phase change requires that increased amounts of heat be transferred to the coolant. The transferred heat energy is, in turn, transported in the form of coolant vapor into a space 33 formed above the liquid level 21a, 21b. The vapor in the space 33 then eventually condenses along the upper walls of the bag 22 and returns to a liquid state, where it drops back down the pool of liquid 31 by the force of gravity. The coolant thus experiences repeated phase changes. Sufficient residual gas is maintained in the system so that some of the gas dissolves in the liquid coolant 31 when the device is not operating and is at ambient temperature. During warmup, the residual gas comes out of solution and creates nucleation sites that assist in initiating boiling and thus minimize the aforementioned "overshoot" phenomenon. As shown in FIG. 2, bag 22 may not be directly attached to a plastic integrated circuit 12. Rather, a heat spreader plate 34 can be positioned to contact the integrated circuit package 12 substantially along one of the major outer surfaces thereof. Spreader plate 34 can be manufactured as an integral part of the integrated circuit 12 package or manufactured separately. Alternatively, one or more individual integrated circuit devices can be mounted directly on the heat spreader plate 34 opposite the bag 22. The heat spreader plate 34 extends through a hole in the bag 22, and provides a high thermal conductivity heat transfer path or via directly between the integrated circuit package 12 and the coolant 31. As such, the transfer of heat into the coolant 31 is not hindered by any thermal resistance of the bag 22 in areas adjacent the integrated circuit package 12. Moreover, since only the heat spreader plate 34, and not the outer surface of the integrated circuit package 12 contacts the coolant 31 , the integrated circuit package 12 need not be compatible with long term exposure to the coolant fluids used within the bag 22. The heat spreader plate 34 is typically made of a material having high heat conductivity such as copper, diamond-copper composite, aluminum, or, in some cases, high-conductivity plastic. Additional nucleation sites to enhance coolant boiling may be provided on the surface of the heat spreader plate 34 by specially treating the inner surface of the heat spreader plate 34 (i.e., the surface exposed to the liquid) to provide a pitted surface. If the pits are of suitable size and shape, they will provide nucleation sites which ensure that the coolant 31 boils substantially at its boiling point. The heat spreader plate 34 may be mounted to the integrated circuit package 12 using epoxy, solder, cement, compression seals, thermal grease or other arrangements, and may be held in place against the chip 12 using contact springs or clips 28, as previously described. FIG. 2 A is a more detailed view of a preferred C-shaped clip 28, as arranged to hold the bag 22, heat spreader 34 and package 12 together. A T-shaped channel 38 is formed in the outer periphery of the lower portion of the spreader plate 34, and is adapted to receive the clip 28, which in turn has a T-shaped end 40 adapted to fit into the channel 38. The clip 28 is thereby fastened to the plate 34 and fits over the lower edge of the chip package 12, holding the assembly against the surface of chip package 12. The heat spreader plate 34 may be smooth or flat for cooling relatively lower power components. However pin fins or tab (continuous) fins may be formed in the heat spreader plate 34 to help draw the coolant into the hottest areas of the spreader plate 34. For example, in the design shown in FIG. 3, heat spreader plate 34 has pin fins 37 formed thereon on an inner surface 50 which faces into the bag interior. In such an applica¬ tion, of course, the bag 22 might have a larger cross dimension in order to accommodate the pins 37. Another possibility is to provide a spreader plate as shown in FIG. 4. In that arrangement, a raised portion 44 of the plate 34 extends into the fluid 31 , and may have slots 42 cut into it. This further increases the sur¬ face area and makes additional sites available for boiling. The sizes of the slots 42 are chosen to optimize bubble formation and coolant return. Returning attention briefly to FIG. 2, the bag 22 is attached in a suitable manner, such as, preferably by heat-sealed directly to the heat spreader plate 34. To insure a reliable heat seal, the heat spreader plate 34 may be specially treated before heat-sealing is performed. -In accordance with another embodiment of the invention, the heat spreader plate 34 is formed of aluminum. The aluminum is treated by a conventional anodizing process. However, after the spreader plate 34 has been anodized, the nickel acetate or other sealing solution that is typically applied to seal the anodized surface is not applied. The unsealed, anodized aluminum plate 34 thus provides a porous surface for better adherence of the bag 22 with small cracks and other irregularities in the surface providing sites for the melted thermoplastic to adhere. The porous surface presented by the anodized aluminum also provides additional nucleation sites to further assist in encouraging boiling at an early stage. Instead of heat-sealing the bag 22 to the plate 34, conventional O- ring arrangements may also be used to hold the bag 22 in compression seal against the surface of the heat spreader plate 34. In another embodiment, the aluminum surface may be treated with an organic solvent primer such as that sold under the trademark Morprime 10-B, by Morton International, Inc. of Chicago, Illinois. Such primers provide good adhesion for the polypropylene bag material. The heat spreader plate 34 may also be formed of sintered metal. It has been found that if the sintered metal parts are compacted to approximately 60%-70% density to produce an average pure size on the order of 100 microns, the pores will produce additional nucleation sites to encourage early boiling and discourage overshoot. Other orientations of the bag 21 are also possible. For example, instead of being clipped to package 12, the bag 22 may be mounted over package 12 by placing standoffs 28 on both sides of the package 12. This embodiment, as shown cross section in FIG. 5, is of particular use in applications where the printed circuit board 14 cannot be guaranteed to be placed in a vertical orientation, such as in laptop or desktop computers. In this embodiment, the bag 22 is simply pressed in position over the integrated circuit package 12. In general, wicking is typically not required to reliably return the condensed coolant to the liquid coolant pool, and that gravity can usually be relied upon for this purpose. However, there can be certain instances, as shown in FIG. 6, in which wicking material 60 may be provided inside the bag 22 along the interior bag surfaces, with certain advantages. Such an arrangement is particularly convenient in arrangements where the outer sur- face 52 of the bag 22 contacts additional heat-dissipating components 55 which may be mounted on the circuit board 14 beneath the bag 22. The wick 60 can typically be provided as a polyester or polypropylene woven fabric, or as a metal screen. When present, the wick 52 pulls liquid coolant by capillary action up along the upper surfaces of the bag 22 adjacent the additional chips 55 which may need some cooling but not quite as much cooling as the primary chip package 12. However, when a wick is used the coolant preferably has a high sur¬ face tension. The aforementioned preferred Fluorinert*M material has a very low surface tension, and does not wick particularly well, so that other cooling fluids such as water, methanol, or acetone are preferred in this application. It has been found that over time, depending upon the material chosen for the bag 22, that the bag 22 may tend to sag under the force of gravity, so that the interior area of the bag 22 adjacent the spreader 34 may increase, causing the minimum coolant level 21b to decrease (FIG. 2). Thus, it is desirable in some instances to pre-form pleats in the bag 22, as shown in the cross sectional view of Fig. 7A, to minimize the effects of such sagging. The pleats, which act as strucmral stiffeners, may be circular or square in shape, as shown in Fig. 7B and 7C respectively, or may be of other shapes. Heat sealed dimples may also be used to physically attach the film to the heat spreader 34 to prevent sagging. There are several advantages of this invention which will now be understood by those of skill in the art. For example, the single bag 22 provides two-phase cooling, without the need for a separate condenser and evaporator unit, tubes or other interconnecting apparatus. In addition, the cooling system 10 does not require fans, blowers or other noise generating components and thus is ideal for use in applications where noise is of prime consideration such as offices and the like. Further, the bag 22 has a low profile, and is lighter than the usual metal heat sinks associated with large integrated circuit chips 12. Finally, the use of the polypropylene bag 22 in connection with an anodized aluminum heat transfer plate 34 provides good and reliable heat seal connection, thereby providing an enclosure space 30 which is predictably free from leaks and other failures, and thus requires no maintenance over the long term. The advantages of two-phase cooling are provided in an arrangement in which single-phase cooling has heretofore only thought been possible. The invention is adaptable to a wide variety of devices including laptop computers, server computers and other applications in which quiet, inexpensive and reliable cooling of integrated circuit chips is important. For example, a cooling system built in accordance with the principles of the

Claims: invention in the manner shown in FIGS. 1A and IB has been found suffi¬ cient to cool a 42 watt chip package 12 to a temperature of 57 degrees centigrade which is far below the 70 degree mean operating, temperature specified for the Pentium^M chip by Intel Corporation. The terms and expressions which have been employed above are used as terms of description and not of limitation, and there is no intention, in the use of such terms and expressions, of excluding any equivalents of the feamres shown and described or portions thereof, but it is recognized that various modifications are possible within the scope of the invention claimed. What is claimed is: CLAIMS 1. An apparams for absorbing heat generated by a heat generating com- ponent comprising: a flexible, sealed bag having an internal compartment formed therein, the bag being disposed along an outer surface of the com- ponent; a quantity of liquid only partially filling the internal compart- ment formed within the bag such that simultaneous boiling and con- densing of the liquid occurs in the bag when the component generates heat during operation. 2. An apparams as in claim 1 wherein the flexible bag has a hole formed therein adjacent the outer surface of the component, and additionally comprising: a heat spreader plate extending through the hole formed in the bag, the heat spreader plate having a high thermal conductivity, the spreader plate having a first portion extending externally of said bag for thermal contact with the outer surface of the component and a second portion extending internally into said compartment formed in said bag; and means for sealingly connecting the plate to the bag. i 3. An apparams as in claim 2 wherein the plate is formed of a bare, 2 unsealed anodized aluminum. l 4. An apparams as in claim 2 wherein the bag is heat sealed to the plate. 1 5. An apparams as in claim 2 wherein the bag is adhered to the plate using 2 a Morprime adhesive. 1 6. An apparams as in claim 1 wherein the liquid is electrically non- 2 conductive and thermally conductive. 1 7. An apparatus as in claim 1 wherein the liquid has a boiling point below 2 the normal operating temperature of the component. 1 8. An apparams as in claim 1 wherein the liquid is a fluorochemical known 2 as FC-72. ι 9. An apparams as in claim 1 wherein the bag is formed of a thermoplastic 2 material having a melting point above the normal operating tempera- 3 ture of the electronic component. 10. An apparams as in claim 9 wherein the bag material is a laminate hav- ing one or more layers formed of polypropylene. 11. An apparams as in claim 9 wherein the bag material is formed of polyester terphthalate. 12. An apparams as in claim 9 wherein the bag material is formed of polyimide. 13. An apparams as in claim 9 wherein the laminate includes a thin aluminum layer. 14. An apparatus as in claim 2 wherein the portion of the heat spreader plate extending into the bag has a flat profile. 15. An apparams as in claim 2 wherein the portion of the heat spreader plate extending into the bag includes grooves. 16. An apparams as in claim 2 wherein the portion of the heat spreader plate extending into the bag includes fins. 17. An apparams as in claim 16 in which the fins are pin fins. i 18. An apparams as in claim 16 in which the fins are continuous. 1 19. An apparams as in claim 2 additionally including a wick inserted into 2 the bag. 1 20. An apparams as in claim 19 wherein said wick is formed of 2 polypropylene. 1 21. An apparams as in claim 19 wherein said wick is formed of polyester 2 terphthalate. 1 22. An apparams as in claim 16 wherein the fluid has a higher surface ten- 2 sion than a fluorochemical fluid. 1 23. An apparams as in claim 2 wherein additional components are disposed 2 adjacent the bag but away from the heat spreader plate. 1 24. An apparams as in claim 1 wherein the flexible bag is formed of a 2 material that is impermeable to air and other gases. l 25. An apparams for cooling a heat dissipating component, the apparams operating in an environment with an ambient pressure over a temperature range and comprising: a hermetic enclosure having an interior, the enclosure includ- ing first and second thermally conductive walls, the first thermally conductive wall for contact with the component and for conducting heat dissipated by the component into the interior of the enclosure, and the second thermally conductive wall having sufficient flexibility such that the pressure within the enclosure remains sub- stantially at the ambient pressure over the entire operating tempera- ture range of the heat dissipating component; and a liquid coolant disposed within the hermetic enclosure, the liquid coolant having a sufficiently low boiling point such that the liquid coolant is changed to a vapor by the heat dissipated by the component while the component is operating within its normal operating temperature range. apparatus as in claim 25 wherein the first thermally conductive wall comprises: a heat transfer plate extending through a formed in the enclosure, the heat transfer plate formed of bare, unsealed anodized aluminum along at least a periphery thereof, the transfer plate hav- ing a first portion extending externally of said enclosure for thermal 7 contact with an outer surface of the heat dissipating component, and 8 a second portion extending internally into said compartment. ι 27. An apparams as in claim 25 wherein the second thermally conductive 2 wall is formed of a laminate of an inner aluminum layer and one or 3 more outer layers of a polyethylene material having a melting point 4 above the normal operating temperature of the heat dissipating com- 5 ponent. ι 28. An apparams as in claim 25 additionally comprising: 2 a heat transfer plate extending through a hole formed in the 3 enclosure, the heat transfer plate formed of bare anodized aluminum 4 along at least a periphery thereof, the transfer plate having a first 5 portion extending externally of said enclosure for thermal contact 6 with an outer surface of the heat dissipating component, and a sec- 7 ond portion extending internally into said compartment; and 8 wherein the second thermally conductive wall is formed of a 9 laminate of an inner aluminum layer and one or more outer layers of lo a thermoplastic material having a melting point above the normal π operating temperature of the heat dissipating component, and the 12 second thermally conductive wall is sealed to said heat transfer plate 13 along the outer periphery thereof. 29. Cooling apparams operating in an environment with an ambient temperature and an ambient pressure, the apparatus-cooling a heat dissipating electronic component having a normal operating temperature range, and comprising: a sealed bag having an interior and a wall of flexible sheet material which is impermeable to air and other gases, the bag having an internal pressure; a quantity of coolant material parti? !ly filling the bag inter- ior, the coolant being a liquid at the ambient temperature and having a boiling point which is below the electronic component normal operating temperature range, the remainder of the bag interior being filled with a gas or coolant vapor so that, at the ambient tempera- ture, the bag internal pressure is substantially the same as the ambient pressure; and means for holding the bag wall in thermal contact with the electronic component. 30. Cooling apparams according to claim 29 further comprising a heat spreader plate comprised of a material having a high thermal conductivity and extending through said bag wall and wherein the means for holding also holds the spreader plate against the electronic component. 31. Cooling apparams according to claim 29 wherein the quantity of coolant material is sufficient to fill from 5% to 90% of the bag interior. 32. Cooling apparams according to claim 29 wherein the sheet material is sufficiently flexible that the bag internal pressure remains substantially the same as the ambient pressure over the electronic component normal operating temperature range. 1 33. Cooling apparams according to claim 29 wherein the bag comprises an evaporator portion where the coolant material vaporizes and a condenser portion where the coolant material con- ■ denses and wherein the coolant material returns from the condenser portion to the evaporator portion under the influence of gravity. 1 34. Cooling apparams according to claim 29 further comprising a 2 wicking material for returning the coolant material from the con- 3 denser portion to the evaporator portion. l 35. Cooling apparams as in claim 29 in which pleats are formed in the sealed bag adjacent the electronic component. 36. Cooling apparams as in claim 35 in which said pleats-are generally formed as elongated sections disposed in parallel with one another. 37. Cooling apparams as in claim 35 in which said pleats are generally formed as concentric circular sections. 38. Cooling apparams as in claim 35 in which said pleats are generally formed as formed as dots sealed to said heat plate. 39. A method for fabricating a cooling apparams comprising a sealed bag having at least one wall of flexible, thermoplastic sheet material with a hole therein and an aluminum plate having edges and extend- ing through the hole, the method comprising the steps of: A. anodizing without sealing the bare aluminum plate; and B. causing the sheet material to be adhered to the aluminum plate edges. l 40. A method as in claim 39 wherein step B consists of heat sealing. l 41. A method as in claim 39 wherein step B consists of using an adhesive adapted for adhering thermoplastic to aluminum. 1 42. A method as in claim 39 wherein step B consists of priming the aluminum plate with Morprime 10-B. ι 43. A method for fabricating a cooling apparatus comprising the steps of: 2 A. fabricating a sealed bag having at least one wall of flexible, 3 thermoplastic sheet material with a hole therein; 4 B. fabricating a bare aluminum plate having edges; 5 C. anodizing without sealing the aluminum plate; 6 D. positioning the anodized aluminum plate in the hole; and 7 E. adhering the sheet material to the anodized aluminum plate 8 edges. 1 44. A method for fabricating a cooling apparams according to claim 39 2 wherein step A comprises the steps of: 3 Al . selecting the sheet material to be two sheets of a multi-layer 4 laminated material; and 5 A2. heat-sealing the two sheets of laminated material together to 6 form the bag. i 45. A method for fabricating a cooling apparams according to claim 9 wherein step B comprises the steps of: B2. fabricating the aluminum plate with finned surfaces.

Inventors: LARSON RALPH I, PHILLIPS RICHARD L, LARSON, RALPH, I., PHILLIPS, RICHARD, L.
Applicants: AAVID LAB INC, AAVID LABORATORIES, INC.
Application year: 1995
Main classification: H05K7
IPC codes: F28D15, H01L23, H05K7