Micro mechanical component and production process thereof

Abstract: A micro mechanical component of the present invention comprises a base, and at least one drive portion supported on the base and relatively driving to the base, in which the drive portion is formed from a diamond layer. Thus, because the drive portion has excellent mechanical strength and modulus of elasticity, the operational performance can be greatly improved as a micro mechanical component processed in a fine shape, from the conventional level. Further, because the drive portion exhibits excellent device characteristics under severe circumstances, the range of applications as a micro mechanical component can be widely expanded from the conventional range.

Description: BACKGROUND OF THE INVENTION Field of the Invention: The present invention relates to a micro mechanical component, which is formed by the fine pattern technology used in fabricating semiconductor integrated circuits and which has advanced functions even if formed in a micro shape, and to a production process thereof. Related background Art: A variety of micro mechanical components have recently been developed, applying the fine pattern technology fostered as the fabrication technology of semiconductor integrated circuits to semiconductor materials such as silicon. Produced as such micro mechanical components are micro actuators such as gears, valves, and motors, and micro sensors such as pressure sensors, acceleration sensors, and flow rate sensors. The prior art relates to such micro mechanical components is described in detail for example in the reference; "IEEE Transactions on Electron Devices, Vol. 39, No. 3, pp. 566-575, March 1992" US-A-5,242,711 discloses a micro mechanical component in form of a gear rotatable around a shank which is supported on a base and covered by a stopper. As the shank is formed after the base, the junction between the base and the shank may be weak. GB-A-2 228 745 discloses the forming of diamond layers on a thin basal diamond film, which has been formed beforehand, i. e. by gas phase synthesis. SUMMARY OF THE INVENTION In the above conventional micro mechanical components, normal semiconductor materials are used as constituent materials. The semiconductor materials such as silicon etc. are, however, inferior to the other materials in respect of physical properties such as the mechanical strength and the modulus of elasticity. Thus, the conventional micro mechanical components had a problem that the operational performance thereof was considerably restricted. Besides, surfaces of the semiconductor materials such as silicon etc. are liable to be oxidized and to be eroded by some acids. Thus, the conventional micro mechanical components had a problem that the range of applications thereof was considerably limited. The present invention has, therefore, been accomplished in view of the above problem, and an object thereof is to provide a micro mechanical component improved well in operational performance and expanded greatly in range of applications, and a production process thereof. To achieve the above object, a micro mechanical component of the present invention comprises a base and at least one drive portion supported on the base and relatively driving to the base, in which the drive portion and the base are formed of a diamond layer. The diamond layer is a thin film having a thickness of not more than 1 mm. The base comprises a support portion formed in a flat plate shape. The shank is formed in a circular cylinder and located on the support portion so that an axis thereof a is set as vertically upright to the support portion. The main portion of the shank contacts the drive portion during the rotation around the shank being integrally made of diamond with the base, and a stopper is formed in a disk shape and located on the shank, so that an axis thereof is coincident with the axis of the shank, which are integrally formed of diamond. The drive portion comprises a sleeve portion formed in an annular shape through a through hole of which the shank is set, and a plurality of teeth each formed in a rectangular prism shape and located on the sleeve portion so that axes thereof are radially arranged along directions perpendicular to an axis of the through hole, which are integrally formed, thereby forming a gear rotating the sleeve portion around the shank in response to an external force imposed on the teeth. To achieve the above object, a process for producing the micro mechanical component of the present invention, wherein diamond layers are formed based on vapor phase synthesis, comprises the steps of: forming a first diamond layer on the surface of a substrate ; forming a first dummy layer on the first diamond layer; forming a second diamond layer on the surfaces of the dummy layer and the first diamond layer, thus forming a common diamond layer; forming at least one drive portion made of diamond on the first dummy layer and forming at least a main portion of a shank made of diamond and being surrounded by the drive portion by removing predetermined regions of the common diamond layer using an etching method; forming a second dummy layer on the common diamond layer, the drive portion and the shank, thus forming a common dummy layer comprising the first and second dummy layers; removing a predetermined region of the common dummy layer which is located above the shank by an etching method; forming a third diamond layer on the surfaces of the common dummy layer and the shank; removing a predetermined region of the third diamond layer by an etching method, thus forming a stopper on the shank as well as a base made of diamond comprising the stopper, the shaft and a support portion; removing the common dummy layer by a wet etching method, thus enabling the drive portion being freely rotatable around the shaft. The step of forming the drive portion and the base is preferably a step of forming the diamond layer as a thin film having a thickness of not more than 1 . mm. The step of forming the common dummy form said common dummy layer of a material having a promoting effect on nuclear growth of diamond. The step of forming the common dummy layer form said dummy layer of a material that causes the nuclear growth of diamond in a nucleation density of not less than 1 × 10 5 cm -2 . This step is preferably a step of forming the dummy layer from either one of at least one element selected from the group consisting of Mo, Si, Ni, Ti, and W; a carbide of the said element, and SiO 2 . This step is preferably a step of forming the dummy layer from either one of a nitride of at least one element selected from the group consisting of Si, Zr, Ti, Al, Ta, and W, a boride of the element, a carbide of the element, an oxide of element, and a boron nitride. Here is shown a comparison of physical properties between diamond and Si in Table 1. COMPARISON OF PHYSICAL PROPERTIES BETWEEN DIAMOND AND Si Si Diamond Diamond/Si Young's Modulus (10 11 Pa) 1.9 10.5 5.5 Knoop Hardness (Kg/mm) 850 7000 8.2 Yield Strength (10 9 Pa) 7 50 7.1 Thermal Conductivity (W/cm°C) 1.57 20 12.7 Thermal Expansion Coefficient (10 -6 /°C) 2.33 1.0 0.43 Specific Heat (J/mol) 8.6 6.2 0.72 Density (g/cm 3 ) 2.3 3.5 1.52 Generally diamond has a relatively large energy band gap, as large as about 5.5. eV, thus revealing excellent temperature stability and chemical inactivity. Then, comparing it with Si etc., diamond is effective as a material showing excellent device characteristics under severe circumstances, for example at high temperature or under strong radiation. Further, diamond has a large withstand voltage of about 10 6 to about 10 7 V·cm -1 , large electron mobility and hole mobility of about 2000 cm 2 ·V -1 ·s -1 and about 1800 cm 2 ·V -1 ·s -1 , respectively, a large electron saturation speed of about 2 × 10 7 cm·s -1 , and a small dielectric contact of about 5.7. In addition, the thermal conductivity of diamond is about 20 W·cm -1 ·K -1 at room temperature, which is about five times greater than that of Cu and which is the highest among solid substances. Further, the diffusivity of heat is for example as low as about 4.5 × 10 -6 K -1 at temperature of 750 °C. Thus, comparing with Si etc., diamond is effective as a material exhibiting excellent performance characteristics, for example high frequency and large output. Further, because diamond has a large Young's modulus of about 10.5 × 10 11 Pa, the modulus of elasticity thereof is excellent. Therefore, comparing with Si etc., diamond is effective as a material exhibiting excellent mechanical strength even if shaped thinner and finer. In the micro mechanical component of the present invention, the at least one drive portion supported on the base and relatively driving thereto is formed from diamond. Because of it, the drive portion has excellent mechanical strength and modulus of elasticity, which enhances the operational performance as a micro mechanical component machined in a fine shape, considerably from the conventional level. since the drive portion reveals the excellent device characteristics under severe circumstances, the range of applications as a micro mechanical component can be expanded greatly from the conventional range. When the base is formed from diamond, the operational performance and the application range are further improved as a micro mechanical component. In the process for producing the micro mechanical component of the present invention, diamond is deposited on the substrate, based on the vapor phase synthesis, to form the drive portion, whereby the diamond thin film becomes a dense deposit of small-grain-size crystals. Thus, the drive portion has excellent modulus of elasticity and good mechanical strength even in a thinner and finer shape as compared with when formed of Si. Accordingly, the micro mechanical component can be produced with a largely improved operational performance as compared with the conventional level and with a greatly expanded range of applications as compared with the conventional components. When the base is formed by depositing diamond on the substrate, based on the vapor phase synthesis, the micro mechanical component can be produced with further improved operational performance and a further expanded range of applications. The present invention will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only, and thus are not to be considered as limiting the present invention. Further scope of applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view to show structure of a gear in an embodiment according to the present invention; and Fig. 2A to Fig. 2I are cross sections to show production steps of the gear of Fig. 1 in order. DESCRIPTION OF THE PREFERRED EMBODIMENTS The constitution and operation of the embodiments according to the present invention will be described referring to Fig. 1 to Fig. 2I. In the description of the drawings same elements will be denoted by same reference numerals and redundant description will be omitted. It should be noted that dimensional ratios in the drawings do not always coincide with those in the description. Fig. 1 is a perspective view, partly broken, to show structure of a gear in the present embodiment. In this gear, an i-type diamond layer 80 is laid on the top surface of substrate 70. The i-type diamond layer 80 is integrally constructed of a support portion 80a of a flat plate, a shank 80b of a circular cylinder, a stopper 80c of a disk, and peripheral portions 80d each of a rectangular prism. The support portion 80a is formed in such an arrangement that the entire back surface is placed on the top surface of substrate 70. The shank 80b is formed in such a manner that the axis thereof is vertically upright on the central region of the surface of support portion 80a. The stopper 80c is formed on the top of the shank 80b so that the axis thereof coincides with the axis of shank 80b. The peripheral portions 80d are formed on the peripheral regions of the surface of support portion 80a so that axes thereof radially extend along directions perpendicular to the axis of the shank 80b. Around the shank 80b between the support portion 80a and the stopper 80c, an i-type diamond layer 100 is formed as separate from the adjacent portions. The i-type diamond layer 100 is integrally constructed of a sleeve portion 100a of an annular plate and teeth 100b each of a rectangular prism. The shank 80b is set through a through hole, which is an internal wall concentric to an outer wall, of the sleeve portion 100a. Eight teeth 100b are formed in such an arrangement that axes thereof radially extend along directions perpendicular to the axis of sleeve portion 100a on the side wall thereof. The substrate 70 is a chip separated out from a wafer, which is made of a semiconductor material such as Si. The i-type diamond layer 80 is formed by depositing non-doped diamond, based on the CVD process. This i-type diamond layer 80 has high resistance in dopant concentration of about 10 14 cm -3 and also has a film thickness of about 20 µm. The i-type diamond film 100 is formed by depositing non-doped diamond, based on the CVD process. This i-type diamond film 100 has high resistance in dopant concentration of about 10 16 cm -3 and a film thickness of about 10 µm. Here, the size of substrate 70 is about 7 mm in length, about 9 mm in width, and about 1.1 mm in height. Thicknesses of support portion 80a, shank 80b, stopper 80c, and peripheral portions 80d are about 10 µm, about 11 µm, about 10 µm, and about 200 µm, respectively. Diameters of shank 80b and stopper 80c are about 20 µm and about 40 µm, respectively. Thicknesses of sleeve portion 100a and teeth 100b are about 9 µm and about 10 µm, respectively. The inner diameter and outer diameter of sleeve portion 100a are about 30 µm and about 60 µm, respectively. A distance between two teeth 100 b opposed to each other is about 120 µm and a longitudinal length of each of eight teeth 100b is about 22 µm. The size of the gear thus processed in a fine shape is desirably about 1 µm to about 10 mm in length, about 1 µm to about 10 mm in width, and about 10 µm to about 10 mm in height as a whole from the viewpoint of expansion of application range; more precisely, the size is preferably about 50 µm to about 10 mm in length, about 50 µm to about 10 mm in width, and about 50 µm to about 10 mm in height as a whole from the viewpoint of securing sufficient mechanical strength. A thickness of each diamond thin film is desirably in the range of about 0.1 µm to about 1 mm from the viewpoint of expansion of application range; more precisely, it is desirably in the range of about 10 µm to about 1 mm from the viewpoint of securing sufficient mechanical strength. In such a gear, a gap is secured at a predetermined margin between the inner wall of sleeve portion 100a and the side wall of the shank 80b, so : that the i-type diamond film 100 rotates around the shank 80b when the teeth 100b receive an external force. Here, the i-type diamond layer 80 functions as a base fixed to the substrate 70 while the i-type diamond layer 100 functions as a drive portion supported by the base and relatively driving thereto in response to an externally loaded stress. These two layers each are formed of a diamond thin film. Since the i-type diamond film 100 has excellent mechanical strength and modulus of elasticity as a drive portion as in the first embodiment, operational performance as a micro gear can be greatly improved from the conventional level accordingly. Also, the i-type diamond layer 80 and i-type diamond film 100 have excellent device characteristics under severe circumstances, whereby the range of applications as a micro gear can be expanded. A process for producing the present embodiment is next described. Fig. 2A to Fig. 2I are cross sections to show production steps of the gear of the present embodiment in order. First, based on the normal CVD process, a wafer or a chip separated out from a wafer is set as substrate 70 inside the chamber, the atmosphere in the chamber is set to the pressure of about 40 Torr, and the temperature of substrate 70 is set to about 930 °C. Subsequently, H 2 of concentration 99.9999 % and CH 4 of concentration 99.9999 % are supplied as reaction gases at a flow rate of about 200 sccm and at a flow rate of about 1 sccm, respectively, into the chamber. Then a thermochemical reaction is induced over the surface of substrate 70 by RF radiation of frequency about 2.45 GHz and power about 400 W, thereby forming an i-type diamond layer 81 on the top surface of substrate 70 (Fig. 2A). Next, based on the normal resistance heating evaporation method, the wafer or chip is set inside the heating furnace and the atmosphere in the heating furnace is set to the temperature of about 100 °C. Then molybdenum or a silicon nitride is introduced into the heating furnace to be deposited over the surface of the i-type diamond layer 81, thereby forming a dummy layer 91 having a predetermined thickness. Subsequently, based on the normal photolithography technology, a mask layer of SiO 2 is formed in an annular pattern on the surface of dummy layer 91. Then, based on the normal RIE process, the wafer or chip is set inside the etching container, the atmosphere in the etching container is set to the pressure of about 0.02 Torr, and the temperature of substrate 70 to about 30° C. Next, Ar of concentration about 100 % and O 2 of concentration about 100 % are supplied as etching gases at a flow rate of about 100 sccm and at a flow rate of about 1 sccm, respectively, into the etching container. Then a chemical reaction is induced over the surface of the dummy layer 91 by RF radiation of frequency about 1.356 MHz and power about 100 W, thereby removing a predetermined region of the dummy layer 91 not covered with the mask material (Fig. 2B). Next, based on the normal CVD process, the wafer or chip is again set inside the chamber, the atmosphere in the chamber is set to the pressure of about 40 Torr, and the temperature of substrate 70 to about 930 °C. Subsequently, H 2 of concentration 99.9999 % and CH 4 of concentration 99.9999 % are supplied as reaction gases at a flow rate of about 200 seem and at a flow rate of about 1 sccm, respectively, into the chamber. Then a thermochemical reaction is induced over the surfaces of the i-type diamond layer 81 and dummy layer 91 by RF radiation of frequency about 2.45 GHz and power about 400 W to form an i-type diamond layer 82 on the surfaces of the i-type diamond layer 81 and dummy layer 91 (Fig. 2C). In the following description, the i-type diamond layers 81, 82 are called as the i-type diamond layer 83 as a whole. Next, based on the normal photolithography technology, a mask layer of SiO 2 is formed in a predetermined pattern on the surface of i-type diamond layer 83. Subsequently, based on the normal RIE process, the wafer or chip is set inside the etching container; the atmosphere in the etching container is set to the pressure of about 0.02 Torr, and the temperature of substrate 70 to about 30 °C. Then Ar of concentration about 100 % and O 2 of concentration about 100 % are supplied as etching gases at a flow rate of about 100 sccm and at a flow rate of about 1 sccm, respectively, into the etching container. Next, a chemical reaction is induced over the surface of the i-type diamond layer 83 by RF radiation of frequency about 1.356 MHz and power about 100 W to remove predetermined regions of the i-type diamond layer 83 not covered with the mask material, thereby forming the i-type diamond layer 100 (Fig. 2D). The volume percentage of O 2 to Ar in the etching . gases is preferably about 1 %. Then the etch selectivity of the i-type diamond layer 83 to the mask material of SiO 2 is about 40 times, and the etch rate thereof is about 15 nm/min. Next, based on the normal resistance heating evaporation method, the wafer or chip is again set in . the heating furnace, and the atmosphere in the heating furnace is set to the temperature of about 100 °C. Then molybdenum or silicon nitride is introduced into the heating furnace to be deposited on the surfaces of the i-type diamond layer 83 and i-type diamond film 100, whereby a dummy layer 92 with a predetermined thickness is formed (Fig. 2E). In the following description, the dummy layers 91, 92 are totally called as a dummy layer 90. Next, based on the normal photolithography technology, a mask layer of SiO 2 is formed in a . predetermined pattern on the surface of dummy layer 90. Subsequently, based on the normal RIE process, the wafer or chip is set inside the etching container, the atmosphere in the etching container is set to the pressure of about 0.02 Torr, and the temperature of substrate 70 to about 30 °C. Then Ar of concentration about 100 % and O 2 of concentration about 100 % are supplied as etching gases at a flow rate of about 100 sccm and at a flow rate of about 1 sccm, respectively, into the etching container. Then a chemical reaction is induced over the surface of the dummy layer 90 by RF radiation of frequency about 1.356 MHz and power about 100 W to remove a predetermined region of the dummy layer 90 not covered with the mask material, which is located above the shank 80b (Fig. 2F). Next, based on the normal CVD process, the wafer or' chip is again set in the chamber, the atmosphere in the chamber is set to the pressure of about 40 Torr, and the temperature of substrate 70 to about 930 °C. Subsequently, H 2 of concentration 99.9999 % and CH 4 of concentration 99.9999 % are supplied as reaction gases at a flow rate of about 200 sccm and at a flow rate of about 1 sccm, respectively, into the chamber. Then a thermochemical reaction is induced over the surfaces of the i-type diamond layer 83 and dummy layer 90 by RF radiation of frequency about 2.45 GHz and power about 400 W to form an i-type diamond layer 84 on the surfaces of the i-type diamond layer 83 and dummy layer 90 (Fig. 2G). In the following description, the i-type diamond layers 83, 84 are called together as an i-type diamond layer 80. Next, based on the normal photolithography technology, a mask layer of SiO 2 is formed in a predetermined pattern on the surface of the i-type diamond layer 80. Subsequently, based on the normal RIE process, the wafer or chip is set inside the etching container, the atmosphere in the etching container is set to the pressure of about 0.02 Torr, and the temperature of substrate 70 to about 30 °C. Then Ar of concentration about 100 % and O 2 of concentration about 100 % are supplied as etching gases at a flow rate of about 100 sccm and at a flow rate of about 1 sccm, respectively, into the etching container. Next, a chemical reaction is induced over the surface of the i-type diamond layer 80 by RF radiation of frequency about 1.356 MHz and power about 100 W to remove a predetermined region of the i-type diamond layer 80 not covered with the mask material, thus forming the stopper 80c (Fig. 2H). Next, based on the normal wet etching process, the wafer or chip is immersed in a HF base etchant to remove the dummy layer 90, thereby completing the gear (Fig. 2I). By the production process of the gear, the i-type diamond layer 80 and i-type diamond film 100 are formed based on the chemical vapor phase epitaxy using the reaction gases consisting of CH 4 and H 2 , whereby these diamond thin films each are densely deposited in the form of small-grain-size crystals. Thus, the i-type diamond layer 80 and i-type diamond film 100 have excellent modulus of elasticity and good mechanical strength based on a thinner and finer shape as compared with when formed of Si. Accordingly, the micro gear can be produced with greatly improved operational performance and with a greatly expanded range of applications as compared with the conventional gears. Experiments of the present embodiment are next . described. Gas such as air was supplied between two peripheral portions 80d in the i-type diamond layer 80, so that the i-type diamond film 100 rotated at high speed around the shank 80b of the i-type diamond layer 80. This experiment showed that the gear was rarely abraded after rotation over 10 hours and thus the rotation was not stopped. It should be noted that the present invention is by no means limited to the above embodiments, but may have a variety of modifications. For example, the above embodiment showed the examples in which the gear was formed of diamond in a fine pattern based on the chemical vapor phase epitaxy. However, sensors or actuators of other types can also be formed of diamond in a fine pattern based on the CVD process, achieving substantially the same effects as in the above embodiment. In the above embodiment, molybdenum was employed for the dummy layers used in the production steps. However, the material forming the dummy layers may be either one of at least one element selected from the group consisting of Mo, Si, Ni, Ti, and W, a carbide of the element, and SiO 2 , or either one of nitride of at least one element selected'from the group consisting of Si, Zr, Ti, Al, Ta, and W, a boride of the element, a carbide of the element, an oxide of the element, and a boron nitride. As long as the nuclear growth of diamond is caused in the nucleation density of at least about 1 × 10 5 to 1 × 10 6 cm -2 , thereby achieving substantially the same effects as in the above embodiments. As detailed above, at least one drive portion supported on the base and relatively driving thereto is formed of diamond in the micro mechanical components of the present invention. Diamond is effective as a material to show good device characteristics under severe circumstances, for example at a high temperature or with strong radiation, effective as a material to show good performance characteristics, for example high frequency or large output, and effective as a material to show good mechanical strength even in a thinner and finer shape as compared with Si etc. Therefore, because the drive portion has excellent mechanical strength and modulus of elasticity, the operational performance is greatly improved as a micro mechanical component processed in a fine shape as compared with the conventional components. Further, because the drive portion has excellent device characteristics under severe circumstances, the range of applications as a micro mechanical component is greatly expanded from the conventional range. Further, if the base is formed of diamond, the operational performance and application range are further improved as a micro mechanical component. In the production processes of the micro mechanical components of the present invention, the drive portion is formed by depositing diamond on the base, based on the chemical vapor phase epitaxy, whereby the diamond thin film is densely deposited in the form of small-grain-size crystals. Thus, the drive portion has excellent modulus of elasticity and good mechanical strength even in a thinner and finer shape as compared with when formed of Si. Accordingly, the micro mechanical components can be produced with greatly improved operational performance and with a widely expanded application range as compared with the conventional components. Further, when the base is formed by depositing diamond on the substrate, based on the chemical vapor phase epitaxy, the micro mechanical components can be produced with further improved operational performance and application range. From the invention thus described, it will be obvious that the invention may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims. The basic Japanese Application No. 54047/1994 filed on March 24, 1994 is hereby incorporated by reference.

Claims: A mirco mechanical component comprising: a base (80); and at least one drive portion (100) freely rotating around a shank (80b) and relatively driving to said base (80); wherein the drive portion (100) and the base (80) both are formed of a diamond layer; wherein said diamond layer is a thin film having a hickness of not more than 1 mm; wherein said base (80) comprises a support portion (80a) formed in a flat plate shape, the shank (80b) which is formed in a circular cylinder and located on said support portion (80a) so that an axis thereof is set as vertically upright to said support portion (80a), the main portion of said shank (80b) contacting the drive portion (100) during the rotation around the shank being integrally made of diamond with the base (80), and a stopper (80c) formed in a disk shape and located on said shank (80b) so that an axis thereof is coincident with the axis of said shank (80b), which are integrally formed of diamond; and wherein said drive portion (100) comprises a sleeve portion (100a) formed in an annular shape through a through hole of which said shank (80b) is set, and a plurality of teeth (100b) each formed in a rectangular prism shape and located on said sleeve portion (100a) so that axes thereof are radially arranged along directions perpendicular to an axis of said through hole, which are integrally formed, thereby forming a gear rotating said sleeve portion (100a) around said shank (100b) in response to an external force imposed on said teeth. A process for producing a micro mechanical component, wherein diamond layers are formed based on vapor phase synthesis, comprising the steps of: forming a first diamond layer (81) on the surface of a substrate (70); forming a first dummy layer (91) on said first diamond layer (81); forming a second diamond layer (82) on the surfaces of the dummy layer (91) and the first diamond layer (81), thus forming a common diamond layer (83); forming at least one drive portion (100) made of diamond on the first dummy layer (91) and forming at least a main portion of a shank (80b) made of diamond and being surounded by the drive portion (100) by removing predetermined regions of the common diamond layer (83) using an etching method; forming a second dummy layer (92) on the common diamond layer (83), the drive portion (100) and the shank (80b), thus forming a common dummy layer (90) comprising the first and second dummy layers (91, 92); removing a predetermined region of the common dummy layer (90) which is located above the shank (80b) by an etching method; forming a third diamond layer (84) on the surfaces of the common dummy layer (90) and the shank (80b); removing a predetermined region of the third diamond layer (84) by an etching method, thus forming a stopper (80c) on the shank (80b) as well as a base (80) made of diamond comprising the stopper (80c), the shaft (80b) and a support portion (80a); removing the common dummy layer (90) by a wet etching method, thus enabling the drive portion (100) being freely rotatable around the shaft (80b). A process for producing a micro mechanical component according to claim 2, wherein said drive portion (100) and said base (80) each are formed of a diamond layer as a thin film having a thickness of not more than 1 mm. A process for producing a micro mechanical component according to claim 2, wherein said process steps of forming said common dummy layer (90) form said dummy layer (90) of a material having a promoting effect on nuclear growth of diamond. A process for producing a micro mechanical component according to one of claims 2 to 4, wherein said process steps of forming said common dummy layer (90) form said dummy layer (90) of a material which causes the nuclear growth of diamond in a nucleation density of not less than 1 x 10 5 cm -2 . A process for producing a micro mechanical componer.t according to claim 5, wherein said process steps of forming said common dummy layer (90) form said dummy layer (90) from either one of at least one element selected from the group consisting of Mo, Si, Ni, Ti, and W, and a carbide of said element. A process for producing a micro mechanical component according to claim 5, wherein wherein said process steps of forming said common dummy layer (90) form said dummy layer (90) from either one of a nitride of at least one element selected from the group consisting of Si, Zr, Ti, Al, Ta, and W, a boride of said element, a carbide of said element, an oxide of said element, and a boron nitride.

Inventors: NISHIBAYAHI YOSHIKI, SHIKATA SHIN-ICHI, SHIOMI HIROMU, NISHIBAYAHI. YOSHIKI, SHIKATA, SHIN-ICHI, SHIOMI, HIROMU, NISHIBAYAHI. YOSHIKI, C/O ITAMI WORKS OF SUMIMOTO, SHIKATA, SHIN-ICHI, C/O ITAMI WORKS OF SUMIMOTO, SHIOMI, HIROMU, C/O ITAMI WORKS OF SUMIMOTO ELEC.
Applicants: SUMITOMO ELECTRIC INDUSTRIES, SUMITOMO ELECTRIC INDUSTRIES, LTD.
Application year: 1995
Main classification: G01P15
IPC codes: B81B3, G01C19, G01H3, G01H11, G01L9, G01P15, B81C1, G01Q70, G01Q80