THREE AXIS PACKAGING

Abstract: Apparatus for mounting and making electrical connections to sensor devices (S1, S2, S3) for use in three axis sensing including a flexible circuit (20) and a substrate (30) shaped so that when a portion of the flexible tape (20) is secured to the substrate (30) the sensor devices (S1, S2, S3) can be mounted on the substrate (30) for sensing in the desired three directions. The sensors are connected to conductors in the flexible tape by wirebonds or by other means.

Description: THREE AXIS PACKAGING BACKGROUND The present invention relates generally to apparatus for mounting and making electrical connections to solid state sensors, which is typically referred to as packaging. The present invention relates specifically to the mounting and electrical connecting of sensors for the sensing of a condition occurring in mutually perpendicular planes which may be referred to as three axis sensing. Three axis sensing is useful for determining the location and or orientation of a device which is carrying the apparatus and is moving in a known magnetic field created for the purpose of determining the location of the apparatus. One application for such an apparatus is in the field of medical devices where miniaturized three axis sensing may be used in conjunction with a magnetic field having known characteristics to determine the location and orientation of a portion of a medical device. In many medical devices, of which a catheter is one example, a three-axis sensing apparatus must be extremely small to be able to be inserted into a small channel or passageway within the device. Thus a need exists for a three axis mounting and electrically connecting apparatus for sensing devices that can be inserted into a small elongated passageway. SUMMARY OF THE INVENTION The present invention solves these and other needs by providing an apparatus including an elongated flexible circuit having conductors and a substrate of a certain shape for providing a stiffness to the portion of the flexible circuit on which sensor devices are mounted. The substrate has a shape which includes a first portion having a surface lying in a plane which includes a desired first sensing direction and a desired second sensing direction for mounting a first and a second sensor. The substrate further includes a second portion having a surface lying in a plane which includes a desired third sensing direction. Sensor devices are electrically connected to the conductors of the flexible circuit by wire bonds or other means. DESCRIPTION OF THE DRAWINGS FIG. 1 shows a partial perspective view of an apparatus for mounting and electrically connecting sensor devices according to the present invention, with a portion of a passageway shown in phantom. FIG. la is an outline drawing of a sensor device. FIG. lb and lc are plan views of a flexible electric circuit. FIG. 2 is an elevation drawing of a first alternate embodiment. FIG. 3 is an elevation drawing of a second alternate embodiment. DETAILED DESCRIPTION An apparatus for mounting sensor devices for plural axis sensing and making electrical connections to the devices is shown in the drawings and generally designated 10. Apparatus 10 includes a flexible tape circuit 20 and substrate or stiffener 30. As shown in FIG. 1 substrate 30 has a first portion 32 having a surface 34 lying in a plane as formed by the x-axis and the y-axis and a second portion 36 having a surface 38 lying in a plane formed by the x-axis and the z-axis. Substrate 30 has a transition portion 40 extending from first portion 32 and connecting to second portion 36 and having a surface 42. Transition portion 40 is in the form of a twist that rotates through 90 degrees. Substrate 30 is made from a formable metal material and provides a greater stiffness to a portion of flexible circuit 20. Materials that have been found to work include Aluminum or Beryllium Copper. Flexible circuit 20 includes dielectric 22 and conductors 24. Flexible circuit 20 has a portion of dielectric 22 bonded to surfaces 34, 38 and 42 of substrate 30. In FIG. 1 sensor device SI at surface 34 is oriented to be sensitive along the y-axis and sensor device S2 is oriented to be sensitive along the x-axis. Sensor device S3 on surface 38 is oriented to be sensitive along the y-axis. Flexible circuit 20 includes tape 22 and conductors 24. Surface 26 of flexible circuit 20 located near end 28 does not include dielectric and conductors 24 are exposed to allow electrical connections to be made. Flexible circuit 20 is typically made using a polyimide dielectric and copper conductors. Photolithography and etching processes are used in the fabrication. The construction of the flexible tape may be varied. Planar views of one satisfactory prototype are shown in FIG. lb and lc, and a description of the materials and approximate dimensions is as follows: DIELECTRIC MATERIAL = POLYIMIDE WIDTH = .076" LENGTH= 78.74" POLYMIDE THICKNESS = .002" CONDUCTOR MATERIAL = COPPER COPPER THICKNESS = .0007" EXPOSED COPPER PLATED WITH 20-40 MICROINCHES NICKEL 80 MICROINCHES WIREBONDABLE GOLD TO BE PLATED OVER NICKEL COPPER LINE WIDTH TOP = .005" SPACE BETWEEN COPPER LINES ON TOP = .005" METALLIZATION TO EDGE CLEARANCE = .0155" COPPER WIDTH ON BOTTOM 2 BUSES = .020" EACH SPACE BETWEEN BUSES = .005" BOTTOM BUSES CONNECTED TO THE TOP LINES AS SHOWN WITH THRU VIAS VIAS MAY BE FILLED WITH A CONDUCTIVE PASTE BOTTOM SIDE TO BE COATED WITH A DIELECTRIC TOP SIDE TO BE COATED WITH A DIELECTRIC EXCEPT FOR THE .600" TIP CIRCUIT SENSOR END TO BE BONDED TO .006" THICK BERYLLIUM COPPER ASSUME SENSOR CHIP SIZE .025" X .035" ALLOW .020" AROUND THE CHIP TO BRING OUT THE WIRE BONDS EACH CHIP FOOTPRINT WILL THEN BE .065" X .075" OP AMP CHIP SIZE IS .063 " X .154" In the prototype previously described the Beryllium Copper is 0.575" long before forming a 90 degree twist between the first and second 0.100" of the circuit after it is bonded to the beryllium copper. An outline drawing of a sensor device S having a direction of sensitivity 46 and further having a length, 1, a width, w, and a diagonal measurement 44, is shown in FIG. la. Sensors S are preferably of magnetoresistive material. An advantage of the embodiment of FIG. 1 is that it accomplishes the three axis mounting of sensor devices in a way that allows apparatus 10 to be inserted in a passageway or orifice having a diameter measurement, d, that is less than diagonal measurement 44 of sensor device S. That is, the arrangement of FIG. 1 accomplishes the three axis sensing without presenting face 48 of sensor device S to the orifice or passageway 50. Unlike Hall-effect sensors which require the sensed field to be perpendicular to the plane of the sensor and therefore required a cube type of mounting, the sensor of the present invention are efficient in the cross-sectional area needed for mounting. In a first alternate embodiment as illustrated in FIG 2, substrate 60 is generally L shaped and includes leg 62, surface 64, leg 66 which is perpendicular to leg 62 and surface 68. Flexible circuit 70 includes dielectric 72 and conductors 74. Flexible circuit 70 has a portion of dielectric 72 bonded to surface 64 and a portion of dielectric 72 bonded to surface 68. In this arrangement sensor device S4 could be oriented to be sensitive along the x-axis, and sensor device S5 could be oriented to be sensitive along the z-axis with both sensors lying in a common plane represented by the plane formed by the x-axis and the z-axis. Sensor device S6 is mounted to surface 68 of flexible tape and is oriented to be sensitive along the y-axis or to a condition in the plane formed by the y-axis and the z-axis. All sensor devices are electrically connected to flexible circuit 70 by, for example, wire bonds 75 between bonding pads on the sensor devices and conductors 74 in flexible circuit 70. In a second alternate embodiment, as shown in FIG. 3, substrate 80 has a cross section having a uniform thickness portion 82 that includes surface 84 and parallel surface 86. Tapered portion 88 has a thickness that increases in thickness in a direction going away from uniform thickness portion 82. Tapering portion 88 terminates in an end surface 90. Flexible circuit 92 includes dielectric 94 and conductors 95. Flexible circuit 92 has portion 96 bonded to surface 84 of portion 97 bonded to surface 86 and portion 98 bonded to surface 90. In FIG. 3 sensor device S7 at surface 84 is oriented to be sensitive along the x-axis and sensor device S8 at surface 86 is oriented to be sensitive along the z-axis. Sensor device S9 at surface 90 is oriented to be sensitive along the y-axis. An advantage of FIG. 3 is that sensor devices mounted on surfaces 84 and 86 do not contribute to the overall height of apparatus 10. The substrate of FIG. 3 is in the shape of an Erlenmeyer flask. The electrical connection between the flexiblle circuit and the chips may be made by wire bonds, flip chip or tape-automated bonding. Commonly owned international PCT application entitled "Miniature Magnetometer" and having a filing date of July 20, 1995, application number PCT US95/ (Attorney Docket B1015825WP) is hereby incorporated by reference.

Claims: CLAIMS 1. Apparatus for mounting and making electrical connections to a plurality of sensor devices for sensing magnetic field components in a plurality of directions, with each said sensing device having a sensing direction lying in a plane of each said sensing device, said apparatus with said sensor devices for insertion into an elongated passageway, comprising: an elongated flexible tape having a first surface, a second surface parallel to said first surface and conductors; a substrate having a shape and a stiffness greater than a stiffness of said flexible tape, a portion of said first surface secured to said substrate and conforming to at least a portion of said shape with a first surface portion of said second surface lying in a first plane which includes a desired first sensing direction for mounting a first sensor device, and a second portion of said second surface lying in a second plane which includes a desired second sensing direction for mounting a second sensor device, said second plane perpendicular to said first plane; and means for making said electrical connections between said sensor devices and said conductors. 2. Apparatus of claim 1 wherein said shape of said substrate is L shaped. 3. Apparatus of claim 1 wherein said substrate comprises a first elongated portion having a first surface parallel to said first plane, a second portion that tapers from narrow to wide in a direction away from said first portion and terminates in a second surface parallel to said second plane. 4. Apparatus of claim 1 wherein said substrate has a first planar portion having a fourth surface parallel to said first plane, a second planar portion having a fifth surface parallel to said second plane, and a planar twist portion extending between said first planar portion and said second planar portion. 5. Apparatus of claim 2 wherein said first plane includes a desired third sensing direction for mounting a third sensor device. 6. Apparatus of claim 3 wherein said first portion has a second surface parallel to said first plane 7. Apparatus for mounting and making electrical connections to a plurality of sensor devices for sensing magnetic field components in a plurality of directions, with each said sensing device being planar and having a length, a width, a diagonal and a sensing direction lying in a plane of each said sensing device, said apparatus with said sensor devices for insertion into an elongated passageway having a diameter, comprising: an elongated substrate having a first surface which includes a desired first direction of measurement and a desired second direction of measurement, a second surface including a desired third direction of measurement; an elongated flexible tape having conductors, said flexible tape secured to said first surface and to said second surface with at least a first sensor device mounted to said flexible tape at said first surface for sensing in said desired first direction and at least a second sensor device mounted to said flexible tape at said second surface for sensing in said desired second direction; means for making said electrical connections between said sensor devices and said conductors. 8. Apparatus of claim 7 wherein a third sensing device is mounted to said flexible tape at said first surface for sensing in said third desired direction. 9. Apparatus of claim 2 wherein said diagonal of said sensor device is smaller than said diameter of said passageway. 10. Apparatus for mounting and making electrical connections to first, second and third sensor devices for sensing magnetic field components in first, second and third mutually perpendicular directions, with each said sensing device being planar and having a sensing direction lying in a plane of each said sensing device, said apparatus with said sensor devices for insertion into an elongated passageway having a diameter, comprising: an elongated substrate having a first surface which includes said first and said second mutually perpendicular directions, a second surface which includes said third mutually perpendicular direction; an elongated flexible tape having a width, and conductors, said flexible tape secured to said first surface and to said second surface with said first sensor device and said second sensor device mounted to said flexible tape at said first surface for sensing in said first and said second mutually perpendicular directions and a third sensor device mounted to said flexible tape at said second surface for sensing in said third mutually perpendicular direction; means for making said electrical connections between said sensor devices and said conductors. 11. Apparatus of claim 10 wherein said first surface is located on a first substrate portion, said second surface is located on a second substrate portion and said substrate further comprises a 90 degree twist portion connecting said first substrate portion and said second substrate portion. 12. Apparatus of claim 11 wherein said means for making electrical connections is wirebond means.

Inventors: PANT BHARAT B, SPIELBERGER RICHARD K, PANT, BHARAT, B., SPIELBERGER, RICHARD, K.
Applicants: HONEYWELL INC, HONEYWELL INC.
Application year: 1995
Main classification: G01R33
IPC codes: G01R33, H01L23, H05K1, H05K3