Urethane modified epoxy resin

Abstract: There is provided an urethane modified epoxy resin either obtained by reaction of 100 weight portions of a preliminary condensate [A] produced by reaction of an epoxy resin and an acid of a phosphorus compound or its salt or ester and 5 to 60 weight portions of an isocyanate group-terminated urethane prepolymer [B] produced by reaction of a hydroxy compound and an organic polyisocyanate compound, or obtained by preparing an urethane modified epoxy resin [D] from 100 weight portions of an epoxy resin and 5 to 60 weight portions of the same isocyanate group-terminated urethane prepolymer [B] as the above and causing the resin [D] to react with an acid of the same phosphorus compound as the above or its salt or ester. Such an urethane modified epoxy resin can advantageously be used with an active organic hardening agent to produce an adhesive resin composition, which is highly effective for bonding iron and non-ferrous metals particularly in terms of shearing strength and peeling strength.

Description: This invention relates to an urethane modified epoxy resin and a highly water-proof, chemical-proof and adhesive resin composition to be suitably used as an adhesive agent and, more particularly, it relates to a resin composition that can be suitably used as an adhesive agent for iron and non-ferrous metals such as aluminum, zinc, copper and other transition metals and provides, when set, an excellent bonding strength in terms of shearing strength and peeling strength and the like. Epoxy resin type adhesive agents are known to be highly effective for bonding metals, glass, concrete, stones and other objects. On the other hand, as they find a broader scope of application in recent years, more and more rigorous requirements are posed on them in terms of peeling strength, shearing strength, thermoresistant adhesive property, water resistant adhesive property, creep characteristics, durability and the like. While epoxy resin generally shows a relatively high shearing strength, it does not provide a satisfactory level of peeling strength and flexibility required for structures. In order for epoxy resin to operate more satisfactory, therefore, thermoplastic resin is normally added to it so that they are chemically combined to give rise to a reaction product or simply blended to produce an alloy. For example, Japanese Patent Application Opened No. 61-228015 discloses an urethane modified epoxy resin obtained by chemically reacting of an urethane-prepolymer produced from a polyhydroxyl compound and a polyisocyanate compound with an epoxy resin. Japanese Patent Application Opened No. 62-53527 teaches another urethane modified epoxy resin obtained by chemically reacting of an urethane-prepolymer produced from high and low molecular weight polyhydroxyl compounds and a polyisocyanate compound with a compound containing epoxy and hydroxyl groups. Japanese Patent Application Opened No. 58-63758 discloses a condensation product of epoxy resin and phosphoric acid or a phosphate. While the above cited urethane modified epoxy resins may show an appropriate level of flexibility and be highly effective for bonding steel plates, they do not operate satisfactorily for bonding non-ferrous metals. Although phosphorus epoxy resin products are effective for bonding non-ferrous metals such as zinc-plated steel plates and aluminum, and also stainless steel, their shearing strength and peeling strength are very poor and far from satisfactory. Therefore, it is the object of the present invention to provide an adhesive epoxy resin composition that operates satisfactorily as an adhesive agent for metals including ferrous and, especially, non-ferrous metals, showing an excellent level of shearing strength and peeling strength. After a series of intensive research efforts, the inventors of the present invention discovered that an urethane modified epoxy resin obtained by causing a condensation product of a specific epoxy resin and an acid of a specific phosphorus compound or its salt or ester to react with a specific urethane prepolymer is highly effective as an adhesive agent for non-ferrous metals if used with an active organic hardening agent to form a resin composition. The inventors of the present invention also found that an urethane modified epoxy resin obtained by causing epoxy resin to react with a specific urethane prepolymer and then the reaction product to react with an acid of a specific phosphorus compound or its salt or ester as described above also operates effectively as an adhesive agent. The present invention is based on these findings. According to the invention a new phosphorus and urethane modified epoxy resin is obtained by reacting a) 100 weight portions of an epoxy resin containing on average within a molecule about two epoxy groups and 0.1 or more than 0.1 hydroxy groups; b) 5 to 75 weight portions of an isocyanate group-terminated urethane prepolymer [B] produced by reaction of a hydroxy compound and an organic polyisocyanate compound, and c) an acid of a phosphorus compound having within a molecule at least a P-OH bond or its salt or ester provided that the equivalent number of hydroxy groups contained in the epoxy resin is greater than the equivalent number of isocyanate groups contained in the urethane prepolymer [B] and that the phosphorus compound is used in an amount such that the ratio of epoxy groups in the epoxy resin to hydroxy groups in the phosphorus compound is 1:(0.02 to 0.8). The invention also includes processes for producing the resin, for producing an intermediate condensate by reaction of an epoxy resin and phosphorus compound and a process for producing the resin from a preformed urethane modified epoxy resin and phosphorus compound, as well as adhesive compositions containing the new resin and a hardener and their use to adhere metals. More specifically, according to an aspect of the invention, there is provided an urethane modified epoxy resin obtained by reaction of 100 weight portions of a preliminary condensate [A] produced by reaction of an epoxy resin containing in average within a molecule about two epoxy groups and 0.1 or more than 0.1 hydroxy groups and an acid of a phosphorus compound having within a molecule at least a P-OH bond or its salt or ester at a ratio of one (1) equivalent of epoxy group in the epoxy resin to an equivalent between 0.02 and 0.8 of hydroxy group in the phosphorus compound and 5 to 60 weight portions of an isocyanate group-terminated urethane prepolymer [B] produced by reaction of a hydroxy compound and an organic polyisocyanate compound, provided that the equivalent number of hydroxy groups contained in the preliminary condensate [A] is greater than the equivalent number of isocyanate groups contained in the urethane prepolymer [B]. According to another aspect the invention, there is also provided an adhesive resin composition containing an urethane modified epoxy resin as described above and an active organic hardening agent. According to still another aspect of the invention, there is also provided an urethane modified epoxy resin obtained by preparing an urethane modified epoxy resin [D] from 100 weight portions of an epoxy resin containing in average within a molecule about two epoxy groups and 0.1 or more than 0.1 hydroxy groups and 5 to 60 weight portions of an isocyanate group-terminated urethane prepolymer [B] produced by reaction of a hydroxy compound and an organic polyisocyanate compound, provided that the equivalent number of hydroxy groups contained in the epoxy resin is greater than the equivalent number of isocyanate groups contained in the urethane prepolymer [B], and causing the urethane modified epoxy resin [D] to react with an acid of a phosphorus compound having within a molecule at least a P-OH bond or its salt or ester at a ratio of one (1) equivalent of epoxy group in the epoxy resin to an equivalent between 0.02 and 0.6 of hydroxy group in the phosphorus compound. According to a further aspect of the invention, there is also provided an adhesive resin composition containing an urethane modified epoxy resin as described above and an active organic hardening agent. An adhesive epoxy resin composition according to the invention shows excellent peeling strength and shearing strength particularly when used for bonding non-ferrous metals as compared with known resin compositions for general purpose adhesives and adhesives for structures. For the purpose of the present invention, "an epoxy resin containing in average within a molecule about two epoxy groups and 0.1 or more than 0.1 hydroxy groups" is a reaction product of a substituted or unsubstituted divalent phenol and a compound selected from epihalohydrins, methylepihalohydrins, ethylepihalohydrins and dihalohydrins. The reaction product they contain on average of about two (usually up to two but sometimes more than two) glycidylether groups expressed by a general formula below. where R is a hydrogen atom, a methyl group or an ethyl group. The average number of epoxy groups and epoxy groups is determined by analysis to determine the equivalents of such groups and the molecular weight. For the purpose of the invention, the divalent phenol refers to a phenol compound comprising one or more than one aromatic nuclei that have two replaceable hydroxy groups and may be selected from mono nuclear divalent phenols and poly-nuclear divalent phenols. Mono-nuclear divalent phenols that can be used for the present invention include resorcinol, hydroquinone, pyrocatechol, fluorogylcinol. dihydroxynaphthalene and dihydroxyanthraquinone. Poly-nuclear divalent phenols that can be used for the present invention are expressed by a general formula below. where X 1 and X 2 may be same or differ from each other, each representing an alkyl group such as a methyl, n-propyl, n-butyl or n-hexyl group, preferably an alkyl group having up to four (4) carbon atoms, a halogen atom such as a chlorine, bromine, iodine or fluorine atom or an alkoxy group such as a methoxy, methoxymethyl, ethoxy, ethoxyethyl, n-butoxy or amyloxy group, preferably an alkoxy group having up to four (4) carbon atoms and m and n are integers from 0 to 4 that may be same or different, while R represents an alkylene or alkylidine group having one (1) to three (3) carbon atoms, -CO-, -O-, -S-, -SO- or -SO 2 -. Examples of such divalent phenols include 2,2-bis-(p hydroxyphenyl)-propane, 2,4'-dihydroxydiphenylmethane, bis-(4 hydroxyphenyl)-methane, bis-(4-hydroxy-2,6-dimethyl-3-methoxyphenyl)methane, 1,1-bis-(4-hydroxyphenyl)-ethane, 2,2-bis-(3,5-dichloro-4-hydroxyphenyl)-propane, 2,2-bis-(2-isopropyl-4-hydroxyphenyl)-propane, bis-(4-hydroxyphenyl)-sulfone, 2,4'-dihydroxydiphenylsulfone, 5-chloro-2, 4'-dihydroxydiphenylsulfone and the like. Examples of epihalohydrins, methylepihalohydrins, ethylepihalohydrins and dihalohydrins that can be used for the purpose of the present invention include epichlorohydrin, epibromohydrin, methylepichlorohydrin, methylepibromohydrin, ethylepichlorohydrin, ethylepibromohydrin, dichlorohydrin, dibromohydrin and the like, of which epichlorohydrin and methylepichlorohydrin are particularly preferable. The ratio at which a divalent phenol and a compound selected from epihalohydrins, methylepihalohydrins, ethylepihalohydrins and dihalohydrins are used to react with each other is preferably one (1) mol of the former to one (1) to twenty (20) mols of the latter, more preferably one (1) mol of the former to five (5) to fifteen (15) mols of the latter and the epoxy equivalent (weight) of the obtained substituted or unsubstituted glycidylether compound is preferably between 120 and 500. The epoxy equivalent weight of the epoxy resin (and of modified epoxy resins) can be determined by ASTM-1652. For the purpose of the invention, an acid of a phosphorus compound having within a molecule at least a P-OH bond is preferably selected from orthophosphoric acid, metaphosphoric acid, pyrophosphoric acid, phosphorous acid, polyphosphoric acid and phosphonic acid, of which orthophosphoric acid is most preferable. For the purpose of the invention, a salt of an acid of a phosphorus compound is preferably selected from salts of the above acids such as potassium salts, sodium salts, lithium salts, calcium salts, zinc salts, aluminum salts, tin salts and barium salts, of which potassium dihydrogen phosphate and sodium dihydrogen phosphate are most preferable. For the purpose of the invention, an ester of an acid of a phosphorus compound is preferably selected from mono- or di-esters of the above acids such as alkyl esters and hydroxyalkyl esters having up to eight (8) carbon atoms in the alkyl groups. More specifically, preferable candidates include esters having one or more than one ethyl, n-propyl, isopropyl n-butyl, 2-ethylhexyl, hydroxyethyl, hydroxybutyl, hydroxypropyl or hydroxypentyl groups. More preferable candidates are ethyl, n-propyl, isopropyl and n-butyl, mono- or di-esters. For the purpose of the invention, the reaction between an epoxy resin and a phosphorus compound as described above is conducted at a ratio of one (1) equivalent of epoxy group in the epoxy resin to an equivalent between 0.02 and 0.8, preferably between 0.04 and 0.5, of hydroxy group in the phosphorus compound and the epoxy equivalent of the produced preliminary condensate (A) is preferably not more than 1,000. While the reaction between an epoxy resin and a phosphorus compound may be conducted under a noncatalytic condition for the purpose of the invention, it may alternatively be conducted in the presence of a basic catalyst. Catalysts that can preferably be used for the purpose of the invention include inorganic alkalis such as sodium hydroxide and potassium hydroxide, tertiary amines such as triethylamine, triethanolamine and dimethylamine, imidazoles and quaternary ammonium salts such as tetramethylammoniumchloride. For the purpose of the invention, the reaction is conducted at temperature between 50 and 100°C for a period between one (1) and five (5) hours. For the purpose of the invention, hydroxy compounds that can be used to produce an isocyanate group-terminated urethane prepolymer (B) include di- or polyvalent polyetherpolyols, polyesterpolyols, caster oil derivatives and tolu oil derivatives. Polyols having a molecular weight between 500 and 3,000 may preferably be used. Examples of polyetherpolyols that can be used for the purpose of the invention include diols such as polyoxyethylenepolyol, polyoxypropyleneglycol, polyoxybutyleneglycol and polytetramethyleneglycol and trivalent polyetherpolyols obtained by adding one or more than one propyleneglycols to glycerol or trimethylolpropane. Examples of polyesterpolyols that can be used for the purpose of the invention may be prepared from polyvalent alcohols such as ethyleneglycol, propylenegrycol, diethyleneglycol, 1,4-butanediol, 1,6-hexanediol, 2-methyl-1,5-pentanediol, 2,2-dimethyl propanediol, glycerol and trimethylolpropane and polybasic acids such as adipic acid, terephthalic acid, isophthalic acid, glutaric acid, azelaic acid, dimer acid and pyromellitic acid. Additionally, lactonepolyols may also preferably be used. Any of the above listed hydroxy compounds may be combined for use for any appropriate proportion for the purpose of the invention. Of the components of the urethane prepolymer (B), the isocyanate compound can be selected from toluylene diisocyanate, methylenediphenyl diisocyanate, hexane diisocyanate and isophorone diisocyanate, of which toluylene diisocyanate and isophorone diisocyanate may preferably be used. An isocyanate group-terminated urethane prepolymer (B) is prepared for the purpose of the invention by combining one or more than one of the above listed hydroxy compounds and an isocyanate compound selected from the above listed chemicals so that its content of the isocyanate group(s) may be found between 1 and 15%, preferably between 2 and 10%, by weight based on the weight of the isocyanate group-terminated prepolymer [B]. The reaction between the preliminary condensate (A) of an epoxy resin and an acid of a phosphorus compound having within a molecule at least a P-OH bond or its salt or ester and the urethane prepolymer (B) is usually conducted at a ratio by weight of 100:5 to 100:60, preferably 100:10 to 100:40, provided that the equivalent number of hydroxy groups contained in the preliminary condensate (A) is greater than the equivalent number of isocyanate groups contained in the urethane prepolymer (B). For the purpose of the invention, the reaction is conducted at temperature between 60 and 140°C, preferably between 70 and 110°C under a noncatalytic condition, although it may alternatively be conducted in the presence of a tertiary amine, lead octylate, or dibutyltinlaurate or the like as a catalyst. Next, a technique that can be used for causing the epoxy resin to react with the urethane prepolymer [B] to produce an urethane modified epoxy resin [D] and then making the reaction product [D] further to react with the phosphorus compound to produce an urethane modified epoxy resin according to the invention will be described. Firstly, the epoxy resin and the urethane prepolymer [B] are reacted with each other at a ratio by weight preferably in the range of 100:5 to 100:60, more preferably 100:10 to 100:40. Note, however, that the equivalent number of hydroxy groups contained in the epoxy resin has to be greater than that of isocyanate groups contained in the urethane prepolymer in order to completely consume the urethane prepolymer [B] in the reaction. The above reaction is preferably conducted at temperature between 60 and 140°C, more preferably between 70 and 100°C. While the reaction may be conducted under a noncatalytic condition, although it may alternatively be conducted in the presence of a tertiary amine, lead octylate or dibutyltinlaurate as a catalyst. Secondly, the reaction between the urethane modified epoxy resin [D] and the phosphorus compound is suitably conducted at a ratio of one (1) equivalent of epoxy group in the epoxy resin to an equivalent between 0.02 and 0.6, preferably between 0.03 and 0.5, of hydroxy group in the phosphorus compound. The ratio is usually in the range 1:(0.02-0.6) based on the epoxy group in the modified resin [D]. While the above reaction may be conducted under a noncatalytic condition, it may alternatively be conducted in the presence of a basic catalyst. Catalysts that can preferably be used include inorganic alkalis such as sodium hydroxide and potassium hydroxide, tertiary amines such as triethylamine, triethanolamine and dimethylamine, imidazoles and quaternary ammonium salts such as tetramethylammoniumchloride. The reaction is preferably conducted at temperature between 50 and 100°C. The obtained urethane modified epoxy resin can be hardened to show an excellent peeling strength as well as an outstanding shearing strength with regard to steel plates and non-ferrous metals when crosslinked by an active organic hardening agent. The active organic hardening agent may be selected from aliphatic polyamines, aromatic polyamines, polyamides, acid anhydrides, polymercaptans and latent hardening agents that can be used for hardening various epoxy resins. Latent hardening agents that can be used for the purpose of the invention include dicyandiamide and its derivatives, imidazoles, boron trifluoride-amine complexes, acid hydrazides such as succinic acid hydrazide and diaminomaleonitrile and derivatives. The hardened product obtained by adding a hardening agent and heating shows an excellent shearing strength and an outstanding peeling strength. The active organic hardening agent is added at a ratio with which the equivalent number of active hydrogen atoms of the hardening agent is found between 0.90 to 1.10 relative to that of equivalents of epoxy groups of the urethane and phosphorus modified epoxy resin. As described in detail above, an urethane modified epoxy resin according to the invention can advantageously be used with an active organic hardening agent to produce an adhesive resin composition, which is highly effective for bonding iron and non-ferrous metals such as aluminum, zinc, copper and other transient metals particularly in terms of shearing strength and peeling strength. The present invention will be described by way of manufacturing examples and other examples, although the present invention is by no means limited thereto. "Portions" in the following description refers to "portions by weight". Manufacturing Examples of Preliminary Condensate (A) of an Epoxy Resin and a Phosphorus Compound Manufacturing Example 1 3 Portions of an orthophosphoric acid was mixed with 100 portions of a bis-phenol-A type diglycidylether ("Adecaresin EP 4100" - trade name: available from ASAHI DENKA KOGYO K.K., epoxy equivalent 190) and the mixture was left for reaction at 75°C for two (2) hours to produce a preliminary condensate (A-1). Manufacturing Examples 2-10 Preliminary condensates (A-2 through 10) were prepared in a manner as described above for Manufacturing Example 1 with the ratios of an epoxy resin and a phosphorus compound and the reaction parameters listed in Table 1 below. Comparative Manufacturing Example. 15 Portions of an orthophosphoric acid was dropped into and mixed with 100 portions of a bis-phenol-A type diglycidylether ("Adecaresin EP - 4100" - trade name: available from ASAHI DENKA KOGYO K.K., epoxy equivalent 190) at 65°C for reaction (P-OH/epoxy group=0.85) only to gelate the mixture. Manufacturing Examples of Isocyanate Group-Terminated Urethane Prepolymer (B) Manufacturing Example 11 100 Portions of a polyoxypropyleneglycol having a molecular weight of 1,000 was mixed with 35 portions of a toluylenediisocyanate and the mixture was made to react at 85°C for three (3) hours to produce a prepolymer (B-1) containing isocyanate groups by 6.3%. Manufacturing Examples 12-17 Prepolymers (B-2 through 7) were prepared in a manner as described above for Manufacturing Example 11 with the ratios of a hydroxy compound and an isocyanate compound and the reaction parameters listed in Table 2 below. Manufacturing Examples of Urethane Modified Epoxy Resin Example 1 100 Portions of the preliminary condensate (A-1) of an epoxy resin and a phosphorus compound was held to 80°C and 20 portions of the urethane prepolymer (B-1) was dropped thereto to cause the mixture to react for four (4) hours and produce an urethane modified epoxy resin with an epoxy equivalent of 285. Examples 2 through 11 Urethane modified epoxy resins (Examples 2 through 11) were prepared in a manner as described above for Example 1 with the ratios of a preliminary condensate and an urethane prepolymer and the reaction parameters listed in Table 3 below. Comparative Example 1 100 Portions of a bis-phenol-A type diglycidylether ("Adecaresin EP-4100" - trade name: available from ASAHI DENKA KOGYO K.K., epoxy equivalent 190) 20 portions of the urethane prepolymer (B-1) was mixed to cause the mixture to react at 80°C for four (4) hours and produce an urethane modified epoxy resin. Comparative Example 2 100 Portions of the preliminary condensate (A-1) of an epoxy resin and a phosphorus acid was held at 80°C and 3 portions of the urethane prepolymer (B-1) was added thereto to cause the mixture to react for four (4) hours and produce an urethane modified epoxy resin with an epoxy equivalent of 210. Comparative Example 3 100 Portions of the preliminary condensate (A-1) of an epoxy resin and a phosphoric acid was held at 80°C and 80 portions of the urethane prepolymer (B-2) was added thereto to cause the mixture to react for seven (7) hours and produce an urethane modified epoxy resin with an epoxy equivalent of 210. Comparative Example 4 100 Portions of the preliminary condensate (A-1) of an epoxy resin and a phosphoric acid was held at 80°C and 100 portions of the urethane prepolymer (B-1) was added thereto to cause the mixture to react for two (2) hours only to gelate the resin. Adhesiveness Test (I) 100 Portions of an urethane modified epoxy resin, 2 to 9 portions of a dicyandiamide as a hardening agent and 50 portions of a calcium carboxide were mixed and kneaded by means of a three-roll device to produce a specimen of thermally hardenable resin composition for each of the Examples and Comparative Examples described above. The rate at which the hardening agent was added was such that the equivalent number of its active hydrogen was found 0.9 relative to that of epoxy groups of the epoxy resin. Subsequently, the specimens were applied to test plates for hardening at 170°C for 30 minutes and then subjected to a shearing strength test and a peeling strength test according to the related JIS Test Standards. The test plates were aluminum plates (JIS A-5052P) and zinc plated steel plates. Table 4 below shows some of the obtained results. Adhesiveness Test (II) 100 Portions of an urethane modified epoxy resin and 100 portions of a calcium carboxide were kneaded by means of a three-roll device and thereafter a 12 to 40 portions of a hardening agent was added thereto to produce a specimen of thermally hardenable resin composition for each of the Examples and Comparative Examples described above. A modified polyamideamine (available from ASAHI DENKA KOGYO K.K.) having an active hydrogen equivalent number of 115 used as a hardening agent was mixed such that the equivalent number of active hydrogen was equal to 1.0 relative to that of the epoxy resin. Subsequently, the specimens were applied to test plates for hardening at 20°C for 7 days and then subjected to a shearing strength test and a peeling strength test as in the case of Test (I) above. Table 5 below shows some of the obtained results. Next, urethane modified epoxy resins, each obtained by causing a specific epoxy resin to react with the urethane prepolymer [B] and then making to react a specific phosphorus compound with the reaction product, will be described below. For the isocyanate group-terminated urethane prepolymer (B), urethane prepolymers No. B-1 through B-7 listed in Table 2 were used. Manufacturing Examples of Urethane Modified Epoxy Resin [D] Manufacturing Example 18 100 Portions of an epoxy resin was held to 80°C and 20 portions of the urethane prepolymer (B-1) was dropped thereto to cause the mixture to react for three (3) hours and produce an urethane modified epoxy resin (D-1) with an epoxy equivalent of 230. Manufacturing Examples 19 through 25 Urethane modified epoxy resins (D-2 through D-8) were prepared in a manner as described above for Manufacturing Example 18 with the ratios of an epoxy resin and an urethane prepolymer and the reaction parameters listed in Table 6 below. Manufacturing Examples of Urethane Modified Epoxy Resin Example 12 100 Portions of the urethane modified epoxy resin (D-1) and 3 portions of orthophosphoric acid was mixed and caused to react with each other at 55°C for two (2) hours to produce an urethane modified epoxy resin with an epoxy equivalent of 310. Examples 13 through 19 Urethane modified epoxy resins (Examples 13 through 19) were prepared in a manner as described above for Example 12 with the ratios of a urethane modified epoxy resin and a phosphoric compound and the reaction parameters listed in Table 7 below. The specimens of Examples 12 through 19 were then subjected to adhesiveness tests as described above by Test (I) and (II). The obtained results are listed in Tables 8 and 9 below along with those for Comparative Examples 1 through 3.

Claims: A urethane and phosphorus modified epoxy resin obtained by reacting a) 100 weight portions of an epoxy resin containing on average within a molecule about two epoxy groups and 0.1 or more than 0.1 hydroxy groups; b) 5 to 75 weight portions of an isocyanate group-terminated urethane prepolymer [B] produced by reaction of a hydroxy compound and an organic polyisocyanate compound, and c) an acid of a phosphorus compound having within a molecule at least a P-OH bond or its salt or ester provided that the equivalent number of hydroxy groups contained in the epoxy resin is greater than the equivalent number of isocyanate groups contained in the urethane prepolymer [B] and that the phosphorus compound is used in an amount such that the ratio of epoxy groups in the epoxy resin to hydroxy groups in the phosphorus compound is 1:(0.02 to 0.8). A modified epoxy resin according claim 1 which is obtained by reaction of 100 weight portions of a preliminary condensate [A] produced by reaction of the said epoxy resin and the phosphorus compound at a ratio of one (1) equivalent of epoxy group in the epoxy resin to an equivalent between 0.02 and 0.8 (preferably 0.04 to 0.5) of hydroxy group in the phosphorus compound and 5 to 60 weight portions (preferably 10 to 40 weight portions) of an isocyanate group-terminated urethane prepolymer [B] produced by reaction of a hydroxy compound and an organic polyisocyanate compound, provided that the equivalent number of hydroxy groups contained in the preliminary condensate [A] is greater than the equivalent number of isocyanate groups contained in the urethane prepolymer [B]. A modified epoxy resin according to claim 2 in which the epoxy equivalent weight of the preliminary condensate [A] is not more 1000. A modified epoxy resin according to claim 1 which is obtained by preparing a urethane modified epoxy resin [D] from 100 weight portions of the epoxy resin and 5 to 60 weight portions (preferably 10 to 40 weight portions) of the isocyanate group terminated urethane prepolymer [B] provided that the equivalent number of hydroxy groups contained in the epoxy resin is greater than the equivalent number of isocyanate groups contained in the urethane prepolymer [B], and causing the urethane modified epoxy resin [D] to react with the phosphorus compound at a ratio of one equivalent of epoxy groups in the epoxy resin to 0.02 to 0.6 (preferably 0.03 to 0.5) equivalents of hydroxy groups in the phosphorus compound. A modified epoxy resin according to any preceding claim in which the phosphorus compound is selected from orthophosphoric acid, metaphosphoric acid, pyrophosphoric acid, phosphorous acid, polyphosphoric acid and phosphonic acid, potassium salts, sodium salts, lithium salts, calcium salts, zinc salts, aluminum salts, tin salts and barium salts and mono- or di-esters of the above acids such as alkyl esters and hydroxyalkyl esters having up to eight (8) carbon atoms in the alkyl groups, preferably selected from orthophosphoric acid, potassium dihydrogen phosphate and sodium dihydrogen phosphate and mono- or di-esters of orthophosphoric acid. A modified epoxy resin according to any preceding claim in which the epoxy resin starting material has an epoxy equivalent weight in the range of 120 to 500. A process for producing a modified epoxy resin by reacting a) 100 weight portions of an epoxy resin containing on average within a molecule about two epoxy groups and 0.1 or more than 0.1 hydroxy groups; b) 5 to 75 weight portions of an isocyanate group-terminated urethane prepolymer [B] produced by reaction of a hydroxy compound and an organic polyisocyanate compound, and c) an acid of a phosphorus compound having within a molecule at least a P-OH bond or its salt or ester provided that the equivalent number of hydroxy groups contained in the epoxy resin is greater than the equivalent number of isocyanate groups contained in the urethane prepolymer [B] and that the phosphorus compound is used in an amount such that the ratio of epoxy groups in the epoxy resin to hydroxy groups in the phosphorus compound is 1:(0.02 to 0.8). A process according to claim 7 including the steps of a) reacting the said epoxy resin and the phosphorus compound at a ratio of one (1) equivalent of epoxy group in the epoxy resin to an equivalent between 0.02 and 0.8 (preferably 0.04 to 0.5) of hydroxy group in the phosphorus compound to produce a preliminary condensate [A] and b) reacting the preliminary condensate [A] with 5 to 60 weight portions (preferably 10 to 40 weight portions) of an isocyanate group-terminated urethane prepolymer [B] produced by reaction of a hydroxy compound and an organic polyisocyanate compound, provided that the equivalent number of hydroxy groups contained in the preliminary condensate [A] is greater than the equivalent number of isocyanate groups contained in the urethane prepolymer [B]. A process according to claim 8 in which the epoxy equivalent weight of the preliminary condensate [A] is not more than 1000. A process according to claim 7 including the steps of a) reacting 100 weight portions of an epoxy resin containing on average within a molecule about two epoxy groups and 0.1 or more than 0.1 hydroxy groups to produce a urethane modified resin [D], and b) causing the urethane modified epoxy resin [D] to react with the phosphorus compound at a ratio of one equivalent of epoxy groups in the epoxy resin to 0.02 to 0.6 (preferably 0.03 to 0.5) equivalents of hydroxy groups in the phosphorus compound. A process for producing a urethane and phosphorus modified epoxy resin by reacting a preformed urethane modified epoxy resin [D] formed from 100 weight portions of an epoxy resin containing on average within a molecule about two epoxy groups and 5 to 60 weight portions (preferably 10 to 40 weight portions) of an isocyanate group-terminated urethane prepolymer [B] produced by reaction of a hydroxy compound and an organic polyisocyanate compound, with 0.1 or more than 0.1 hydroxy groups with an acid of a phosphorus compound having within a molecule at least a P-OH bond or its salt or ester such that the ratio of equivalents of epoxy groups in the resin [D] to equivalents of hydroxy groups in the phosphorus compound is in the range 1:(0.02 to 0.6). A process for producing a condensate [A] by reacting 100 weight portions of an epoxy resin containing on average within a molecule about two epoxy groups and 0.1 or more than 0.1 hydroxy groups with an acid of a phosphorus compound having within a molecule at least a P-OH bond or its salt or ester at a ratio of equivalents of epoxy groups in the epoxy resin to hydroxy groups in the phosphorus compound in the range of 1:(0.02 to 0.6). A process according to any of claims 8 to 12 in which the reaction of the epoxy resin or of the urethane modified epoxy resin [D] with the phosphorus compound is conducted in the presence of a basic catalyst, preferably selected from inorganic alkalis such as sodium hydroxide and potassium hydroxide, tertiary amines such as triethylamine, triethanolamine and dimethylamine, imidazoles and quaternary ammonium salts such as tetramethylammoniumchloride, suitably at a temperature in the range 50 to 100°C. An adhesive resin composition containing a urethane and phosphorus modified epoxy resin according to any of claims 1 to 6 and an active organic hardening agent. An adhesive resin composition according to claim 14 in which the hardening agent is selected from aliphatic polyamines, aromatic polyamines, polyamides, acid anhydrides, polymercaptans and latent hardening agents selected from dicyandiamide and its derivatives, imidazoles, boron trifluoride-amine complexes, acid hydrazides such as succinic acid hydrazide and diaminomaleonitrile and derivatives. An adhesive resin composition according to claim 14 or claim 15 in which the equivalent number of active hydrogen atoms of the hardening agent is found between 0.90 to 1.10 relative to that of equivalents of epoxy groups of the urethane and phosphorus modified epoxy resin. Use of a composition according to any of claims 14 to 16 as an adhesive to bond metals. Use according to claim 17 in which the metal is selected from ferrous metals, for instance iron, and non-ferrous metals, preferably selected from aluminium, zinc and copper. Use according to claim 17 or 18 in which the composition is contacted with the substrates to be adhered and is cured by heating.

Inventors: AKIMOTO KOJI, KOKURA MAKOTO, URIHARA KAZUHIRO, AKIMOTO, KOJI, KOKURA, MAKOTO, URIHARA, KAZUHIRO, Akimoto, Koji, c/o Asahi Denka Kogyo K.K., Kokura, Makoto, c/o Asahi Denka Kogyo K.K., Urihara, Kazuhiro, c/o Asahi Denka Kogyo K.K.
Applicants: ASAHI DENKA KOGYO KK, ASAHI DENKA KOGYO KABUSHIKI KAISHA
Application year: 1995
Main classification: C08G59
IPC codes: C08G18, C08L63, C08G59, C09J163