Method for refining silicon

Abstract: The present invention relates to a process for removing impurities from molten silicon by treatment of molten silicon (4) contained in a vessel (2) with a slag (5) having the capability of removing the impurities, particularly boron, from molten silicon. The slag (5) is continuously or substantially continuously added to the molten silicon (4) and then continuously or substantially continuously inactivated or removed from the silicon melt (4) as soon as equilibrium between the slag (6) and molten silicon (4) is reached with respect to the impurity elements or element to be removed.

Description: The present invention relates to a process for purifying metallurgical grade silicon, particularly to provide silicon for the manufacture of solar cells. More specifically the present invention relates to a process for removing impurities from molten silicon by slag treatment. For a number of applications it is required that silicon should have a very low impurity level for a number of elements. Thus, for solar cell the silicon should have a boron content below 0.4 ppmw and a phosphorus content below 0.7 ppmw. A plurality of purifying processes and combinations of processes have been proposed in order to obtain solar cell silicon having the required low content of impurities. Thus in the publication "Thermodynamics for removal of boron from metallurgical silicon by flux treatment of molten silicon" by Suzuki and Sano published on the 10th European photovoltaic solar energy conference in Lisbon, Portugal, 8-12 April 1991, removal of boron by flux or slag treatment is investigated. It was found that treatment of silicon with the slag systems CaO-SiO 2 , CaO-MgO-SiO 2 , CaO-BaO-SiO 2 and CaO-CaF 2 -SiO 2 gave a maximum distribution coefficient of boron, defined as the ratio between ppmw B in slag and ppmw B in silicon, of about 2.0 when the slag system CaO-BaO-SiO 2 was used. It was further found that the boron distribution coefficient increases with increasing basicity of the slag, reaching a maximum and then decreases. The experiments made by Suzuki and Sano were carried out by placing 10 g of silicon and 10 g of slag in a graphite crucible, melting the mixture and keeping the mixture molten for two hours. The low distribution coefficient of boron between slag and molten silicon means that a high amount of slag has to be used and that the slag treatment has to be repeated a number of times in order to bring the boron content down from 20-100 ppm, which is the normal boron content of metallurgical silicon, to below 1 ppm, which is the required boron content for solar cell silicon. The process described in the paper of Sano and Suzuki is thus both very costly and time consuming. Norwegian patent application No. 901150 describes a method for the removal of boron from metallurgical grade silicon by slag treatment in which molten silicon is treated with a slag comprising a chlorine containing compound. Preferably a CaO-SiO 2 -CaCl 2 containing slag is used. The slag is added to molten silicon and heated thereafter the slag is removed. According to this process the boron content is reduced from about 15 ppm to about 5 ppm by using a slag to silicon weight ratio between 0.5 and 0.8. In the slag treatment process described above the total amount of slag is kept in contact with molten silicon for a relatively long period of time. The boron distribution coefficient, L B = 2 does not indicate that slag extraction processes described above are efficient means for the removal of large contents of boron from silicon. The efficiency of the slag extraction may be estimated by some simplified theoretical arguments. some symbols are defined: [B] o - The boron content of the ingoing silicon (ppmw) (B) o - The boron content of the ingoing slag (ppmw) [B] p - The boron content of the outgoing silicon (ppmw) (B) p - The boron content of the outgoing slag (ppmw) M A - The amount of silicon alloy (mass units, e.g. kg) M S - The amount of slag (mass units, e.g. kg) M A and M S are assumed to be constant during the reaction. That will be a good approximation when the total content of boron in the system is low, and the exchange of matter between the two phases is small compared to the total mass of the system. If the amount to be exchanged is large, the situation will be more complex, but a similar calculation is possible. A real reaction will go towards equilibrium, but never reach it. For the present purpose it is assumed: 1. The boron distribution coefficient, L B is constant. 2. The establishment of equilibrium between slag and silicon is rapid at the interface, and any deviation from the overall equilibrium is due to the boron transport within the phases. 3. The ingoing alloy and slag materials are the only sources of boron, and no boron is lost from the system. In the processes described above where all slag is added before any slag is removed and there is a long contact time between slag and molten silicon, the slag and the silicon will, at best, be homogeneous in equilibrium at the time the slag is removed from the silicon. The potential boron purification for the above slag treatment process where equilibrium is obtained between slag and silicon can be calculated as follows: M A [B] + M S (B) = M A [B] o + M S (B) o By combining this equation with the equation: L B = ppmw B in slag ppmw B in silicon and rearrangement, the boron content of the outgoing silicon can be calculated as: [ B ] p = [ B ] o + M S M A ( B ) o 1+ M S M A L B This equation gives the boron content of the slag treated silicon as function of slag consumption per unit of metallurgical silicon. The impurity content of slag materials sets the limit for the purity that can be obtained for the silicon, this limit being: [ B ] p → ( B ) o L B for M S M A → ∞ The change of the boron content during the slag treatment process where the slag and silicon are allowed to reach equilibrium is shown in Figure 1. It can be seen from Figure 1 that in order to reach a boron content of about 1 ppmw in silicon originally containing about 10 ppmw it is necessary to use a slag to silicon ratio well above 3. Thus a large amount of slag has to be used in order to obtain a boron content below 1 ppmw when using the conventional slag extraction process. It is an object of the present invention to provide a slag treatment process for removing impurities from silicon, particularly boron, which makes it possible to obtain an improved refining efficiency compared with the prior art processes. According to the present invention, there is provided, a process for removing impurities from molten silicon by the treatment of molten silicon contained in a vessel with a slag having the capability of removing boron and/or other impurities from molten silicon, the process being characterised in that slag is continuously or substantially continuously added to the molten silicon and in that the slag is continuously or substantially continuously inactivated or removed from the silicon metal as soon as equilibrium between the slag and molten silicon with respect to the impurity elements or element to be removed, is reached. According to one embodiment of the present invention, the slag may be inactivated by adding one or more ingredients to the slag which increase the density of the slag in order to obtain a slag which settles on the bottom of the vessel in which the slag treatment is carried out. Preferably, barium compounds and/or strontium compounds are used as the ingredients for increasing the density of the slag. In order further to inactivate the slag which settles in a slag layer at the bottom of the vessel in which the treatment is carried out, the temperature in the slag layer may be reduced by means of suitable cooling means arranged in the lower part of the vessel. Thus the lower part of the vessel may be equipped with cooling pipes intended for the circulation of a cooling fluid. According to another embodiment, slag having a higher density than molten silicon may be continuously or substantially continuously added to the top of the molten silicon bath and continuously or substantially continuously tapped from the bottom of the vessel where the treatment is carried out. According to yet another embodiment, slag having a lower density than molten silicon may be continuously or substantially continuously supplied to the molten silicon through the bottom or through the lower part of the vessel containing the molten silicon whereby the slag will rise to the top of the molten silicon where the slag is continuously or substantially continuously removed from the vessel. Slag based on Na 2 O - SiO 2 is an example of slag having a lower density than silicon. According to another embodiment of the process according to the present invention, the slag treatment may be carried out with a countercurrent flow of slag and silicon. The countercurrent flow of slag and silicon can either be carried out continuously in one vessel or alternatively in two or more vessels by moving the molten silicon and molten slag in countercurrent flow though the two or more vessels. In this way slag having the lowest content of the impurities which are to be extracted from the silicon to the slag, is contacted with silicon having the lowest content of these impurities. The slag consumption may thus be further reduced. It has been found that the slag consumption can be greatly reduced by the process of the present invention compared to the processes where the total amount of slag is brought to equilibrium with the silicon. Any conventional slag composition used for refining silicon can be used in the process of the present invention. A preferred slag comprises CaO - SiO 2 , but other known slags can also be used. When the slag in accordance with the process of the present invention is added continuously or substantially continuously and continuously or substantially continuously inactivated or removed from the silicon melt, the material balance for a small amount, dM S , of slag added to the silicon will be: M A d[B] = ((B) o - (B))dM S If this equation is combined with the equation for the boron distribution coefficient, L B and solved with appropriate boundary conditions it is found that the boron content of the outgoing silicon can be calculated as: [ B ] p = ( B ) o L B + [ B ] o - ( B ) o L B exp - M S M A L B The impurity content of the slag materials sets the same limit for the purity that can be obtained for the treated silicon as the purity which can be obtained according to the prior art method with equilibrium between slag and silicon. However, as can be seen from Figure 1, the change in boron content in the molten silicon during the slag treatment is much faster with the method of the present invention than with the prior art methods. Thus it can be seen from Figure 1 that a boron content of less than about 0.5 ppmw can be obtained by treating silicon having a boron content of 10 - 50 ppmw with a slag to silicon weight ratio of less than 3. The process of the present invention can be carried out in any suitable apparatus comprising at least one vessel for containing the molten silicon and slag and having means for adding liquid slag to the top of the silicon melt or at the bottom of the silicon melt. The vessel must further be equipped with heating means for melting the silicon and keeping the melt at a preset temperature. Suitable apparatus for carrying out the process of the present invention include arc furnaces, plasma heated furnaces and induction heated furnaces and resistance heated furnaces. The method of the present invention may be carried out in various ways and will now be further described by way of example and with reference to the accompanying drawings. Figure 1 is a diagram showing theoretical boron extraction from silicon as a function of slag consumption for the method of the present invention (marked "present invention") and for the method described above where the total amount of slag is kept in contact with molten silicon for a relatively long period of time (marked "prior art"). According to the prior art system, a boron distribution coefficient of L B = 2.0 has been used in calculating the theoretical boron extraction. Figure 2 shows an arc furnace for the slag extraction of boron from molten silicon used in carrying out the method of the present invention. In Figure 2 there is shown an arc furnace comprising a graphite crucible 2 having a volume of 50 dm 3 equipped with an electrode 3 for melting silicon 4 and slag materials. The furnace 1 is further equipped with means 5 for the continuous supply of slag to the furnace. The furnace has a maximum load of 70 kW. In order to inactivate the slag, the furnace has a rather poor heat insulation at the bottom. Example 1 (Present invention) 20 kilogram of silicon containing 40 ppmw boron was melted in the furnace 1. 40 kilogram of a low boron slag having a composition of 60% by weight CaO and 40% by weight of SiO 2 was added continuously to the silicon through the slag supply means 5, while heat was added at a rate that gave almost instantaneous melting. The melting was verified by probing into the furnace. The density of the slag was higher than the density of silicon thus causing the slag to settle in a slag layer 6 below the silicon layer in the furnace. After finishing the slag addition, the refined silicon was tapped from the furnace 1. The mean load during the test was 58.5 KW. The boron content of the refined silicon was approximately 1 ppmw and as can be seen from Figure 1, this is very close to the theoretical value obtainable for the method according to the present invention. Example 2 (Prior art) For comparison purposes a test was carried out in which 40 kilogram of slag having the same composition as in Example 1 was melted in the furnace 1 whereafter 20 kilogram of silicon containing 40 ppmw boron was added continuously to the molten slag, while the charge was heated at a rate that gave almost instantaneous melting. The two melts were kept in contact for about half an hour after complete melting, whereafter the silicon was tapped from the furnace. The boron content of the silicon was 11 ppmw, which is slightly above the theoretical value of the prior art process shown in Figure 1. The mean load during the test was 65.7 KW. This comparison example shows a high degree of equilibration between the silicon and the bottom slag, which indicates a weak inactivation of the slag. Since the cooling through the bottom lining is fairly constant, the load gives an indication of the cooling which will take place in the bottom slag layer. The test was repeated with lower load of 53.4 KW. The boron content of silicon then became 20 ppmw, which is much higher than the theoretical value of prior art in Figure 1. Example 1 compared with Example 2 shows that the process of the present invention gives a strongly increased boron removal compared to the process according to the state of the art.

Claims: A process for removing impurities from molten silicon (4) which comprises treating the molten silicon (4) contained in a vessel (2) with a slag (5) having the capability of removing the impurities, particularly boron, from the molten silicon (4), characterised in that the slag (5) is continuously or substantially continuously added to the molten silicon (4), and the slag (6) is continuously or substantially continuously inactivated or removed from the silicon melt (4) as soon as equilibrium between the slag and molten silicon (4) is reached with respect to the impurity elements or element to be removed. A process as claimed in Claim 1, characterised in that the slag (6) is inactivated by adding one or more ingredients to the slag (6) which increases the density of the slag (6). A process as claimed in Claim 2, characterised in that the barium compounds and/or strontium compounds are added to the slag in order to increase the density of the slag (6). A process as claimed in Claim 1, characterised in that the slag (5) having a higher density than the molten silicon (4) is continuously or substantially continuously added to the top of the silicon melt (4) and continuously or substantially continuously tapped from the bottom of the vessel (2) in which the treatment is carried out. A process as claimed in Claim 1, characterised in that a slag (5) having a higher density than the molten silicon (4) is continuously or substantially continuously added to the top of the silicon melt (4) and allowed to settle as a slag layer (6) at the bottom of the vessel (2) in which the treatment is carried out. A process as claimed in Claim 5, characterised in that the slag layer (6) is kept at a lower temperature than the silicon melt (4). A process as claimed in Claim 1, characterised in that a slag having a lower density than silicon is supplied to the molten silicon bath (4) through the bottom or though the lower part of the wall of the vessel (2) containing the molten silicon (4), and the slag is allowed to rise to the top of the molten silicon bath (4) where it is continuously or substantially continuously removed. A process as claimed in Claim 1, characterised in that the slag treatment is carried out with a countercurrent flow of slag and silicon. A process as claimed in Claim 8, characterised in that the countercurrent flow of slag and silicon is carried out by moving the molten silicon and molten slag in countercurrent flow through two or more vessels.

Inventors: SCHEI ANDERS, SCHEI, ANDERS
Applicants: ELKEM MATERIALS, ELKEM ASA
Application year: 1995
Main classification: C01B33
IPC codes: C22B9, C01B33