ELECTRIC POWER DISTRIBUTION SYSTEM

Abstract: An electric power distribution system having a plurality of conductive plates (204-206), wherein each conductive plate includes an arrangement of contact pads (208) that are electrically connected to other contact pads via integrally formed conductive traces. These conductive plates can be vertically stacked, with electrical contact between selected contact pads on different conductive plates being provided by conductive pins (210). Each conductive plate is selectively coated with an insulating layer to obviate unwanted electrical contact.

Description: ELECTRIC POWER DISTRIBUTION SYSTEM FIELD OF THE INVENTION This invention relates generally to a distribution system for electrical signals, and in particular to an electrical power distribution system, and is more particularly directed toward distribution of electrical power in a vehicle. BACKGROUND OF THE INVENTION The first motorized vehicles had little in the way of an electrical system. All that was required was some way to generate and distribute an ignition potential to each of the cylinders of the small, internal combustion engine that powered these early vehicles. The need to see the road ahead during nighttime operation gave rise to the first electrical accessory: headlights. Interior illumination was added for the operator's convenience, and a single tail light was considered adequate. Turn signal lights followed, but the simple vehicle radio receiver did not make its appearance until a nurriber of years later. The modern automobile is an impressive collection of electrical hardware: from stereo sound equipment to air conditioning; from power windows, mirrors and seats to keyless entry systems; from vehicle alarms to seat position memory to electrically heated seats. The complexity of vehicle electrical systems has grown almost exponentially since the automobile's introduction. Automotive and truck electrical systems are a formidable combination of high-current and low-current circuitry. In many cases, relays are required for control purposes, and all circuits must be adequately fused to protect expensive components and to guard against the danger of fire. In order to facilitate the replacement of fuses and relays, and to simplify interconnection of electrical hardware, many different electric power distribution systems have been tried. One approach that has been tried with fair consistency is to centralize fuse and relay mounting, then route input and output connections from this central location. The first systems built using this approach included a great deal of point-to-point wiring. Hand wiring is very costly, and manual wiring operations are a source of wiring errors that negatively impact product quality. In addition, massive wiring bundles create a hazard of shorts or fire. Another approach has been the construction of customized distribution networks stamped as strips from thin metal sheets - "stamp tracks." These stamp tracks are formed metal sheets that have contact tabs protruding through openings in custom designed plastic shells. Although this approach yields a higher quality product, tooling costs are very high, since virtually every automobile model requires a unique distribution system. At least some of this uniqueness aspect is driven by the proliferation of fuse and relay packages. A distribution product must be able to accommodate the fuse and relay components selected by the manufacturer. Yet another approach has centered around the use of flexible circuit board technology, or "flex circuits." Flex circuits are constructed by depositing conductive material between two flexible insulating layers. Although the unique distribution requirements of each vehicle model would require unique flex circuits for each application, tooling costs are much lower than the metal stamping/custom plastic housing approach described previously. The principal disadvantage of the flex circuit approach is that the conductive layers are very thin, and the high current densities required in vehicle power distribution lead to overheating and eventual failure. Consequently, a need arises for a vehicle electric power distribution system that can be customized for a particular vehicle with relative ease, that avoids high tooling costs for custom designed components, that is reliable in a high current environment, that will accommodate a wide range of fuse and relay packages, and that is relatively inexpensive to manufacture. SUMMARY OF THE INVENTION These needs and others are satisfied by the electrical circuit plates and electric power distribution apparatus of the present invention. The apparatus includes a plurality of our conductive circuit plates stacked to provide an electrical distribution system. Each plate has an arrangement of contact pads, wherein at least some of the contact pads are electrically connected to selected other contact pads of the same conductive plate via integrally formed conductive traces. The apparatus further includes a plurality of conductive pins providing electrical contact between selected contact pads of different selected conductive plates. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1(a) is an enlarged top plan view of a stamped conductive plate of the present invention; FIG. 1(b) is a partial enlarged plan view taken along line lb of FIG. 1(a); FIG. 2(a) is a top plan view of another erribodiment of the present invention; FIG. 2(b) is a cross-section view taken along lines 2(b) -2(b) of FIG. 2(a); FIG. 2(c) is a bottom plan view of the conductive circuit plate of FIG. 2(a); FIG. 2(d) is a side elevational view of another embodiment of the present invention; FIG. 2(e) is an enlarged view of the layout of the three conductive circuit plates used in FIG. 2(d) ; FIG. 2(f) illustrates yet another layout of the three conductive circuit plates used in FIG. 2(d) ; FIG. 3(a) is a side section view of vertically stacked conductive circuit plates in a housing; FIG. 3(b) is a stylized sectional depiction of conductive pins penetrating the conductive circuit plates; FIGS. 4 (a) - (c) are top, side, and rear views, respectively, of a pin terminal suitable for use with the present invention; FIGS. 5 (a) -(c) are top, side, and front views of a terminal spring suitable for use with the pin terminal of FIG. 4; FIG. 6 is a stylized section view of an electric power distribution apparatus showing interconnection with a circuit board; FIG. 7(a) is an enlarged plan view of an alternative embodiment of a conductive plate in accordance with the present invention, with a portion of an insulating layer cut away; FIG. 7(b) is a partial enlarged plan view taken along line 7b of FIG. 7(a); FIG. 8 is a top plan view of a conductive plate in accordance with the present invention; FIG. 9 is a bottom plan view of the conductive plate of FIG. 8; FIG. 10 is a side section view illustrating the conductive plates of the alternative embodiment in a vertically stacked configuration; FIG. 11 is a top plan view of another feature of the present invention depicting the conductive plates in a stacked side-by-side configuration with conductive extender portions and conductive bridges; FIG. 12 is a top plan view of the top layer of the stacked configuration of FIG. 11; FIG. 13 is a top plan view of the middle layer of the stacked configuration of FIG. 11; FIG. 14 is a top plan view of the bottom layer of the stacked configuration of FIG. 11; FIG. 15 is a side elevational view of the stacked configuration of FIG. 11 FIG. 16 is a side section view of a vertically stacked arrangement of conductive plates in combination with a printed circuit board; FIG. 17 is a bottom plan view of the embodiment of FIG. 16 illustrating the placement of electronic components on the circuit board; and FIG. 18 is a schematic diagram of the circuitry illustrated in FIG. 17. DESCRIPTION OF A PREFERRED EMBODIMENT We have developed a reliable, low-cost electric power distribution system which finds particular use in a vehicle. However, the invention described is not limited to vehicle applications and can be used for any operation which requires a power distribution panel capable of supporting a wide range electrical wiring architecture. We provide a conduct circuit plate that has a repeating pattern of openings and shaped cut-outs. The shaped cut- outs are arranged so that the material left surrounding the openings define electrical circuit paths extending from and interconnecting each opening. The desired circuit path is created by selectively electrically isolating openings and their surrounding material from other openings and their surrounding material. Multiple circuit plates are stacked to provide a desired distribution panel. An interconnection between the stacked circuit plates is accomplished by using connective pins positioned in the openings to interconnect the circuits defined on successive circuit plates. The placement of the openings is such that they accommodate standard circuit elements i.e., fuses, relays, etc. which may be installed in the formed circuit paths. With the addition of these active circuit elements, a complete panel is capable of serving as the central processor for the entire vehicle. The invention can best be understood with reference to the accompanying drawing figures. FIGS. 1(a) and 1(b) are top plan views of one example of a conductive circuit plate prepared according to the invention, and generally depicted by the numeral 100. Preferably, the conductive circuit plate is fabricated by stamping from a conductive metal sheet having a thickness of from about 0.5 to about 1.3mm. Many different conductive materials of varied thicknesses would be acceptable, depending upon the intended use of the circuit plates. For vehicle uses, the preferred metal is copper. The conductive plate shown is stamped from .08 mm CDA 110 half hard copper. In a preferred embodiment, to facilitate subsequent soldering operations, the conductive circuit plate 100 is solder plated or coated to provide a solder layer thickness of about .005 to about .01 mm. The conductive material may be preplated or coated before the stamping operation, or a plating or coating may be added later. One of the preferred solder compositions for a copper base is a tin solder composition. Of course, other suitable compositions, known to those skilled in the applicable art, may be substituted for the solder just described. A feature of the conductive circuit plate (100) is a plurality of interconnected first contact pads (101) . The first contact pads (101) are formed by stamping a plurality of cut-outs (101C) between vertical center lines (101A) and horizontal center lines (101b) . The vertical and horizontal portions of each cut-out (101c) are rectangular stampings. As shown, the cut-out (101c) is a Greek type cross as defined on page 309 of Webster's Ninth Collegiate Dictionary. The cut-outs (101c) are spaced in a predetermined pattern. In this instance, vertical center lines (lOle) through the vertical legs of the crosses (101c) are parallel with the contact pad center lines (101a) and the horizontal cross center lines (lOld) are parallel with the horizontal pad center lines (101b) . Also, the conductive plate 100 has as an option a plurality of second contact pads (107) and third contact pads (108) . The contact pads (101) are preferably all identical, and the second contact pads (107) are generally adjacent one end of the conductive plate. The contact pads (107) , as shown, are not identical, but if desired they may be. The third contact pads (108) are generally adjacent the other end of the conductive plate. The contact pads (101) are arranged to provide a right angle grid pattern as shown in FIG. 1(b). That is, vertical groups of contact pads (101) have vertical center lines (101A) extending parallel to each other, and the horizontal groups of contact pads have horizontal center lines (101B) extending parallel to each other. The horizontal center lines (101B) intersect the vertical center lines (101A) at right angles. The vertical center lines (101A) are each equally spaced apart from each other, and preferably spaced apart to accommodate a minifuse, such as an ATM-style minifuse manufactured by the Bussmann Division of Cooper Industries. The horizontal center lines (101B) are also each equally spaced apart from each other and preferably spaced apart to accommodate a minifuse as described above. Thus, both the vertical and horizontal contact pad center lines are spaced apart substantially the same distance. In the preferred embodiment, the contact pad center lines are spaced apart a distance of about 7.9 to about 8.1 mm. Of course, the rectangular array arrangement of contact pads need not be strictly adhered to. It may be discovered that a triangular, hexagonal, circular, elliptical, or other combination of these arrangements of contact pads best serves a particular application. With a triangular or hexagonal array of contact pads, for example, the coordinate system formed by the contact pad centerlines would no longer be rectangular in nature, but would form, in one instance, concentric triangles or hexagons. Centerline spacings would still be arranged to conform to the contact spacing of industry standard components. For any array of contact pads, center-to-center spacing would be such to accommodate components with standard lead spacing (or an integral multiple of a standard spacing) in more than one direction, thus providing a great deal of component orientation flexibility. The first contact pads (101) are shown as having a substantially square shape. However, the shape of the contact pads is best determined by the ultimate use of the circuit plates. Use may dictate that the contact pads be non-rectangular, triangular, circular, elliptical, or any desired shape as shown hereinafter. Generally, the circuit plate (100) has at least 9 first contact pads (101) . Although the first contact pads (101) are depicted in the figure as having holes (106) of a uniform size therethrough, the contact pads could also be fabricated without openings, or with openings of varying dimensions. The second and third contact pads (107- 108) have irregular shapes that are used to hold various other components such as relays and other size fuses. The contact pads (101, 107, 108) are shown electrically connected to selected other contact pads by integrally formed conductive traces (102) . In the preferred embodiment, there are at least three conductive traces (102) for each pad (101) . These conductive traces (102) are formed by the stamping die used for conductive circuit plate fabrication, although other methods of forming these traces are not precluded, and will occur to those of skill in this fabrication art. Both the conductive circuit plate and the conductive traces could be fabricated by using an etching process, for example. In application, some of these conductive traces (102) are removed by a subsequent operation to ensure that electrical connection is made only between selected ones of the contact pads (101, 107, 108) , as discussed in greater detail hereinafter. The conductive circuit plate (100) also includes a plurality of first connector electrical contacts (103) at one end of the circuit plate, and a plurality of second electrical contacts (104) at the other end of the circuit plate. The electrical contacts (103-104) are integrally formed during fabrication, and are coplanar with and extend outwardly from the conductive circuit plate main body section. FIG. 1 shows these contacts (103-104) as joined at a point distal from the main body of the conductive circuit plate by bars of material (105, 109) . The contacts are formed in this way during the fabrication process to keep the contacts from being bent or otherwise damaged. The bars of material (105, 109) can be removed by a cutting operation at a later stage of manufacture. In the alternative, of course, the bars of material (105, 109) need not be used at all. Another feature is that openings or holes (110) in the second and third contact pads (107-108) are not centered on these pads and are located to facilitate electrical connection to the conductive circuit plate in different arrangements than the rectangular array of contact pads described above. The mounting holes (110) are provided with varied spacings to accommodate electrical connection to electrical components of different sizes, and different mounting or socketing arrangements. FIGS. 2 (a) -2(c) illustrate yet other features of the present invention. These depict an insulated conductive circuit plate having conductive circuit plate (100A) without the bars (105, 109) , and at least partially coated or attached thereto with a non-electrical conductive material (201) . In the preferred embodiment, this is an electrically insulating material such as Rynite FR530, 94V- 0, manufactured by E.I. DuPont Company and described as a PET (polyethylene terephthalates) thermoplastic polyester, but any of a number of insulating plastic or other materials would serve in this application, as is well-known in the art. Preferably, the spacing or insulating material can be applied using an injection molding process, wherein the conductive circuit plate (100, 100A) is supported by pins or other supporting structure within the mold, and mold inserts determine the areas where the insulating material (201) is prevented from flowing. As a general statement, it can be said that the conductive circuit plate (100A) is at least partially covered or coated by the insulating material, with the exception of areas (202) near the central portions of the contact pads (101) and which surrounds the openings (106, 110), areas (203) over the conductive traces (102) that interconnect selected contact pads (101) , and areas (204) as noted. These areas are kept clear of the insulating material so that the traces (102) may be easily removed and portions of the contacts removed. Also shown in FIG. 2(a) are the electrical contacts (103- 104) , now freed from the restraining bars of material (105, 109) illustrated in FIG. 1. It should be noted that the material from which the conductive circuit plate is fabricated permits a rotation or bending of the electrical contacts (103-104) , so that the plane of one or more of the electrical contacts (103) may be made perpendicular to the plane of the conductive layer itself. Although not shown in the figure, this ability to change the plane in which one or more of the electrical contacts is oriented adds greater flexibility in terms of interconnection with external power distribution networks, which may include electrical connectors and attached electrical wires. FIG. 2(b) illustrates the relative thickness of the insulating material (201) . As shown in the figure, the insulating material (201) extends outward from one surface of the conductive circuit plate only, although this application technique need not be strictly adhered to for proper assembly. The distance the material extends is determined by the desired spacing between two adjacent plates 104A. FIG. 2(b) shows the vacated areas of the circuit plate, some of which are described above, where insulating material is not permitted to flow. FIG. 2(c) is a bottom plan view of the coated conductive circuit plate showing the circuit plate (100A) after the electrically insulating material (201) has been applied. As noted above, in this embodiment, the electrical insulating material is applied principally to only one side of the conductive circuit plate (100A) . However, as has also been noted, this design practice need not be strictly adhered to for the invention to function properly. FIG. 2(d) shows a side schematic of three insulated conductive circuit plates stacked vertically, one on top of another, with electrical contacts (103-104) extending outwardly therefrom. In this embodiment, the middle or second insulated circuit plate has had the contacts (103- 104) removed prior to being assembled, and the bottom or third circuit plate has had one set of contacts (104) removed. Depending upon the ultimate use, selected contacts from the groups (103-104) of conductors on each circuit plate may be removed. The insulating material that adheres to each of the conductive circuit plates prevents unwanted electrical contact between different conductive circuit plates. The insulating material also serves another purpose. The insulating layers also provide equal spacing for the conductive plates, and help maintain the conductive plates in a substantially parallel relationship. As mentioned above, with reference to FIG. 2(a), the insulating material is deliberately kept away form certain areas; namely, the areas around the central porions of the contact pads, and the areas around the integrally formed conductive traces. This is because a subsequent operation serves to selectively remove the integrally formed conductive traces between selected contact pads where electrical contact is not desired. Of course, the conductive traces need not be removed completely, but may simply be severed on one end and bent out of the plane of the circuit plate to avoid electrical contact. Coating or encapsulating the conductive circuit plate in the manner described acts to hold the conductive circuit plate together, even if it should become necessary to completely sever the electrical and physical connections between selected portions of the layer and the main body of the layer. Although it is not shown in the figure, the stamping operation that is used to form the conductive circuit plate can be constructed in such a way that it "kicks" portions of the conductive layer, such as the corners of the contact pads, out of the plane of the remainder of the conductive layer, so that these "kicked out" portions may be embedded more securely in the insulating material, thus forming a stronger structure. Further, as will be discussed in more detail below, the openings previously described in the contact pads may require enlarging to conform to the inventive assembly process, and will also require soldering to ensure good electrical contact with selected other conductive layers. This is specifically why the central portions of the contact pads are left free of insulating material. FIG. 2(e) illustrates how a conductive path is formed within the apparatus. Three different conductive circuit plates (204-206) are shown in the figure. One of the significant economies of the inventive apparatus is the fact that the conductive circuit plates are substantially identical prior to the shearing operation that removes or disconnects selected conductive traces. A single stamping tool is used to fabricate the conductive circuit plates, and a single mold-in-place operation coats or encapsulates the conductive circuit plates. It is not until the shearing operation that removes or disconnects selected conductive traces and/or enlarges selected contact pad openings, that each conductive circuit plate begins to assume a unique identity. The conductive circuit plates (204-206) of FIG. 2(e) would be, in the preferred embodiment, first coated with a solder composition and then coated or encapsulated with insulating material prior to the shearing operation that defines specific conductive paths, but, for the sake of clarity, the solder coating and insulating material is not shown. Power may be applied to an upper conductive circuit plate (206) through an electrical contact (104) . Note that conductive traces that originally connected adjacent contact pads around the periphery of the shaded area (207) of the upper conductive circuit plate (206) have been removed by a shearing operation, so that the shaded area (207) is electrically isolated from the surrounding region. The conductive path leads to a first contact pad (208) , to which an electrical connector (not shown) would ordinarily be affixed to accommodate one terminal of a fuse, as indicated. A second adjacent contact pad (209) has also been electrically isolated from the remainder of the shaded region (207) , so that another electrical connector may be provided to contact the remaining terminal of the fuse. Of course, electrical connectors are generally provided as a part of a conductive pin penetrating the conductive layers. For the sake of clarity, only one of the conductive pins (210) is shown, and much of its length is indicated in dashed lines, since the length has been exaggerated to present a clear view of the conductive circuit plates (204- 206) . The conductive path extends through the first contact pad (207) , through the fuse, to the second contact pad (209) . At this point, the conductive pin (210) makes electrical contact with the contact pad (209) , and extends the conductive path in the direction of a second conductive circuit plate (205) . For this particular conductive path, the second conductive circuit plate (205) is not involved, so the opening in the contact pad (211) through which the conductive pin (210) traverses has been enlarged so that the pin (210) does not make electrical contact at this point. Note also that the second conductive circuit plate (205) has had both sets of electrical contacts (103-104) removed by a shearing operation, since these contacts are not needed in this example. The conductive path continues via the conductive pin (210) to a bottom conductive circuit plate (204) , where the pin makes electrical contact with the contact pad (212) through which it passes. The shaded area (213) of the bottom conductive circuit plate (204) has been electrically isolated from the surrounding portions by removal of the conductive traces that originally connected adjacent contact pads around the periphery of the shaded area (213) . The conductive path continues to an electrical contact (103) extending outwardly from the conductive circuit plate, through which power may now be distributed via an external distribution network that connects to the electrical contact (103) via a mating connector and cable assembly (not shown) . FIG. 2(f) is an alternative representation of a conductive circuit layout. Power is applied to an electrical contact (104) on an upper circuit plate (206) , where it is distributed to a middle plate (205) by the conductive pin arrangement described above (all pins not shown, for the sake of clarity) . From a contact pad on the middle plate (205) , power is distributed over the contact pads shown in the shaded area (220) , where power is fed back to the top layer (206) through a set of contact pads (226 and 221) connected by a conductive pin (not shown) . A fuse or other suitably spaced component can then be placed between contact pads (221 and 227) , using the electrical terminals in which the pins terminate, as described above, with output power proceeding to one of the electrical contacts (223) at the edge of the top circuit plate (206) . Power is also fed through to the top circuit plate from contact (229) to contact (222) , where it is applied to a relay package (224) which is shown schematically. When a control signal (electrical ground) is applied to the appropriate relay contact through the input electrical connector (225) , the relay energizes, and the output voltage appears at the appropriate output contact (228) on the top plate (206) . Whenever the electrical path changes from one circuit plate to another, it must do so through a conductive pin. Even though all of the conductive pins in FIG. 2f are not shown, for the sake of clarity, a conductive pin must make electrical contact with pads (222 and 229) in order to complete the desired circuit path. Similarly, a conductive pin must penetrate pads (221 and 226) in order to bring the power input circuit back to the top plate (206) . Of course, conductive pins ordinarily penetrate all of the circuit layers, and openings in the contact pads through which the conductive pins penetrate must be enlarged to avoid pin contact where no contact is desired, even though this is not shown in FIG. 2f in every instance where such opening enlargement is desirable. The assembly views of FIG. 3 further serve to illustrate a complete assembly of conductive circuit plates. In FIG. 3(a) , four conductive circuit plates (301- 304) , complete with associated insulating material (307, for example) , are stacked vertically, with a plurality of conductive pins or connectors (310) providing electrical contact between selected contact pads of different selected conductive circuit plates. Some of the openings (such as 309) previously described in the central portions of the contact pads are made substantially larger than the outside diameter of the conductive pins (310) , so that no electrical contact will be made with the associated pin. Other openings (308) are actually extruded slightly, as shown, so that the pin is an interference fit in the opening, and good mechanical contact, as well as electrical contact, can be made between contact pad and pin. After the pins are inserted through the openings in the contact pads, they are soldered to each pad with which they come into contact. Selected conductive pins can be provided with electrical connectors on at least one end. In FIG. 3 (a) , each of the pins (310) is shown with an electrical connector (311) at one end. The electrical connector (311) shown in this view is integrally formed as a part of the pin, but the connector could be formed in alternative ways (to be discussed below) . Various electrical components (312) , fuses in this illustration, are shown mounted so that the components (312) make electrical contact with the electrical connectors (311) . It should be noted that the inventive distribution apparatus is designed to accommodate various electrical components used in vehicle electric power distribution systems, including, but not limited to: maxi-fuses or circuit breakers, mini-relays, micro-relays, and minifuses or circuit breakers. All of these component types are well-known in the automotive arts. In addition, since various component spacings are accommodated by the arrangement of contact pads on the conductive circuit plates, and because various designs of pins and associated electrical connectors are contemplated by the invention, virtually any automotive electrical component that might be a useful part of such an electric power distribution system, whether extant or yet to be developed, can be accommodated. FIG. 3(a) also shows a housing, in this view composed of a bottom portion (313) and a top portion (314) , that substantially surrounds the vertically stacked conductive circuit plates. The housing shown is manufactured of thermoplastic polyester, 30% glass filled. Of course, other housing geometries and materials are possible. The housing (313, 314) includes an opening (315) designed to accommodate connection with an external electrical power distribution network. In this case, the opening (315) is designed to accommodate a connector housing (not shown) containing electrical connectors designed to mate with electrical contacts (305, 306) integrally formed with the conductive circuit plates. The connector housing may include a wiring harness for routing of input or output power. FIG. 3(b) is a somewhat stylized representation of conductive pins in an alternative arrangement. Each pin (320) has a terminal spring or cap (321) that is separately manufactured, and is attached to the elongated pin portion (320) by mechanical means (such as a snap-fit) , or by brazing, soldering, or similar well-known technique. FIGS. 4 and 5 show the details of the multiple-piece conductive pin design. FIG. 4(a) is a top view of the pin terminal (401) , in which details of its construction can be seen. The tubular lower portion (403) of the pin terminal is formed by a stamping operation that causes the material of the lower portion to be rolled into a nearly circular cross section, thus leaving a longitudinal slot (402) extending throughout the entire length of the lower body (403) of the pin (401) . The extreme lower portion is also slightly rounded by the forming operation, leaving a hole in the pin, at the bottom, that is slightly smaller than the inside diameter of the rolled structure. FIGS. 4(b) and (c) are side and rear elevational views, respectively, showing the geometry of the upper portion (404) of the pin (401) . Preferably, the pin terminal (401) is fabricated from 0.7 ± .07 mm CDA 110 half hard copper, with .005/.01 mm inch solder plate (which may be preplated stock) . Of course, the foregoing discussion should not be interpreted to preclude the use of other materials and geometries. FIG. 5 shows details of construction of a terminal spring designed to operate in conjunction with the pin terminal just described. The terminal spring fits snugly on the pin terminal to provide a secure mechanical and electrical connection. Preferably, the terminal spring (501) is constructed of stainless steel, so that the integrally formed spring member (503) will provide the requisite contact force to mating electrical connectors. Because of the method of its fabrication, the terminal spring also includes a slot (502) extending longitudinally over its full length. FIG. 5(a) is a top view, while FIG. 5(b) is a side section view and FIG. 5(c) is a front view of the terminal spring. Yet another inventive feature is visible in FIG. 6, a somewhat stylized depiction of the electric power distribution apparatus. The distribution apparatus illustrated shows five conductive circuit plates (601) separated by layers of insulating material (602) , with conductive pins (603) providing electrical contact between selected contact pads of different selected conductive circuit plates. This embodiment illustrates that some of the conductive pins (603) terminate before penetrating all conductive layers, in contrast to what has been shown and described with reference to the other pertinent drawing figures. Also attached to the conductive pins is a printed circuit board of conventional design. The printed circuit board, in addition to supporting electronic components (605) (such as integrated circuits, resistors, capacitors, etc.) , the printed circuit board may also include one or more connectors (606) for providing power or other electronic signal input and output. Thus, the electric power distribution described herein can easily be interfaced with a range of electronic components, and the entire assembly can be placed in a housing, creating a rugged electronic module for vehicle installation that can support data logging, digital electronic control features, etc. In another embodiment of the invention, the overall form factor of the conductive circuit plate is slightly modified, and the shape of the conductive pads is altered. These features are illustrated in FIG. 7. FIG. 7 is a top view of another conductive circuit plate, generally depicted by the numeral (700) . The circuit plate (700) is coated or plated with a thin solder coating. One surface of the solder coated plate (700) has molded or coated thereon preferably an electrically insulating layer (701) . Insulating layer (701) at least partially covers the surface of the conductive circuit plate (700) , in much the same manner as described above with reference to the conductive circuit plate (100) and insulation (201) . For the sake of clarity, the electrically insulating material (701) has been cut away in this view, to reveal details of conductive circuit plate fabrication. It should be noted that the specific electrical insulation properties of this insulating material are not critical, since the insulating material is present primarily to provide an interlock for vertical stacking, which will be described in detail below, and to provide spacing of contacts for alignment with external connectors. Of course, the insulating material does space apart the circuit layers as well, as described above. The conductive plate is still a generally rectangular grid arrangement of vertical center lines (702a) and horizontal center lines (702b) . The contact pads (702) have openings or extrusions (703) through the center of the contact pads (702) . However, the contact pads (702) do not have the distinctly square form factor identifiable in the previously described embodiment. The contact pads (702) are formed by stamping a plurality of cut-outs (705) wherein the vertical and horizontal legs have flared ends. These provide the contact pads (702) with a plurality of narrow attachment or gripping tabs (704) . The specific purpose of the narrow gripping tabs (704) will be treated in detail below. The cut-outs (705) have a shape generally described in Webster's Ninth New Collegiate Dictionary, page 309, as a formee cross whereas cut-outs (101C) of FIG. 1(b) is described as a Greek cross. Of course, the cross of the present invention has also been described similar to a four leaf clover in that it has rounded edges rather than the pointed edges of the formee cross. The cut-outs (702) are spaced in a predetermined pattern. In this instance, vertical center lines (702e) through the vertical legs of the crosses (702) are parallel with the contact pad center lines (702a) and the horizontal cross center lines (702d) are parallel with the horizontal pad center lines (702b) . Integrally formed conductive traces (706) are shown in dotted lines on FIG. 7(a) for illustrative purposes on only some of the conductive pads (702) . . As shown, all of the conductive pads have interconnecting traces (706) which extend between the wide ends of each stamped cut out (705) . As illustrated in FIG. 7(a) , the conductive pads are generally square with the gripping tabs (704) extending from each corner. The conductive traces (706) of this embodiment are noticeably wider than the conductive traces (102) of FIG. 1. The conductive traces (706) have enhanced current-carrying capability. In a fashion similar to that described above, the conductive circuit plates (700) in accordance with the present invention are preferably identically formed from a single stamping die, and are provided with an electrically insulating material in a single mold. This initial uniformity of the conductive layer (700) is a major factor in the overall economy of the inventive approach to vehicle power distribution. As noted with reference to the previously described embodiment, the stamping operation that forms the basic conductive layer can "kick out" the corners of the contact pads so that these corners can be embedded in the encapsulating plastic, thus forming a stronger overall structure. In the embodiment of FIG. 7, the narrow tabs of material (704) may be kicked out in the stamping operation. These tabs of material (704) extend outwardly from the conductive circuit plate (700) a greater distance than the kicked out corners of the rectangular contact pads of the prior embodiment. The kicked out tabs provide a strong attachment structure for the insulating material that is molded on the one surface. As was the case with the prior embodiment, the electrically insulating material (701) is deliberately kept away from certain areas of the conductive circuit plate (700) in order not to interfere with subsequent operations. In particular, the insulating material is not allowed to form near the openings or extrusions (703) in the conductive pads, nor around the conductive traces (706) . Since selected ones of the openings or extrusions (703) may require enlargement to avoid contact with conductive pins (described in more detail below) , and the shearing tool must be able to make contact with the conductive traces (705) to be removed, the insulating material is kept clear of these areas. To form the desired interconnection among selected contact pads (702) , selected conductive traces (705) are removed are sheared subsequent to the application of the electrically insulating material (701) . One advantage of this lack of insulating material in the immediate vicinity of the conductive traces (706) is that the conductive traces that have been removed or sheared can be identified by visual inspection. As a part of the removing or shearing operation, or, in the alternative, in another subsequent operation, openings or extrusions (703) in the contact pads with which electrical contact is not desired are enlarged as openings (703a) (FIG. 10) . Since the outer surfaces of the circuit plate (700) are solder coated, the inner surface (703c) of the extrusion is solder coated. Thus, the extrusion (703) provides a relatively large surface area (703c) to electrically contact the pins (401) . Also, the soldering of the pins (401) to the extrusion (703) is relatively accurate and quick, especially when both the pins (401) and the extrusion surface (703c) have solder coatings thereon. The extrusion surface (703c) provides a press fit for the pins (401) and holds them in place before and after the pins (401) are soldered to the contact plate extrusions (703) . The extrusion operation may be combined with the shearing and enlargement operations as well, or the extrusion can be accomplished as part of a separate process. Because of the solder coating of both the conductive plates and the conductive pins used to complete electrical connection between layers, the assembly can be adequately soldered simply by heating, such as in a solder reflow process. Consequently, a standard reflow oven can be used to effect the soldering operation and/or the pins can be heated to curse solder reflow. FIG. 7 also serves to illustrate the deployment of integrally formed extended electrical contacts (708) extending outwardly from the conductive circuit plate (700) and coplanar therewith. In this embodiment, two adjacent sides have fully formed extended electrical contact (708) extending outwardly therefrom, while the remaining two adjacent sides have truncated contacts (707) extending outwardly. Although the extended contacts (708) are integral with the circuit plate (700) they may be separate and connected to the circuit plate (700) via mechanical electrical connection such as a rivet, welding, or mechanical interference fit via a punch and die operation as shown (709) (see FIG. 7b) . Since these component parts are solder coated prior to attachment, heating of the assembly melts the solder internal to these connections, aiding in proper electrical attachment. All the circuit plates could be formed with four sided truncated contacts (707) . The contacts (708) could then be welded, brazed, riveted or mechanically attached to those truncated contacts (707) as desired and prior to assembling the circuit plates (700) for the desired application. Thus, a number of different size connector or extended contacts can be used with the same stamped circuit plate. These configurations of the conductive circuit plate represent the basic building blocks for expanded configurations to be described below. FIG. 8 is a top plan view of the conductive circuit plate (700) illustrating a layer of molded electrically insulating material (701) on one surface of the circuit plate (700) . It will be noted from this view of the insulated circuit plate (700) that there are evacuated regions (802) in the layer (701) immediately surrounding and exposing the openings (703) in the contact pads and additional evacuated regions (803) in the layer (701) immediately above and exposing the conductive traces interconnecting selected contact pads. A raised seat portion (801) of the integral molded electrically insulating material adhering to the other surface of the circuit plate and is also visible in this view, and shown in more detail in FIG. 8. FIG. 9 is a bottom plan view of the encapsulated circuit plate (700) illustrating yet another feature not incorporated in the circuit plate of FIG. 1. The seat 801 is a perimetric ridge of electrically insulating material formed on the other surface of the conductive circuit plate (700) . As will be noted from a comparison of the views of FIGS. 8 and 9, this perimetric ridge (801) has interior dimensions that are the same or slightly exceed the exterior dimensions of the insulating material layer (701) on the upper surface. Thus, when electrically conductive plates (700) are stacked vertically, the perimetric ridge (801) of one plate (700) closely surrounds the perimeter of the insulating material on the mating conductive plate in an interlocking manner, thus ensuring proper lateral alignment of mating vertically stacked plates (700) , while providing electrical insulation and appropriate spacing between plates. FIG. 10 is a side section view of three vertically stacked conductive circuit plates (700) . The interlocking aspect of the electrically insulating layers can also be appreciated from this view, as the perimetric ridge (801) on the bottom surface of one circuit plate (700) surrounds and interlocks with the electrically insulating layer (701) of the conductive circuit plate (700) immediately below it. The edges of the perimetric ridge (801) are chamfered slightly, as illustrated, to ease alignment for stacking purposes. Also, if desired, the outer perimeter of the insulation (701) may be chamfered to permit easy insertion into the ridge (801) . Conductive pins 401, whose construction has previously been described, are shown penetrating the stacked conductive layers (700) through the extrusions (703) in the contact pads. Their configuration of extrusions (703) is shown. Electrical contact is enhanced by providing the contact area greater than that of just an opening. Yet another aspect of the invention is illustrated in FIG. 11, which is a top plan view of a side-by-side arrangement of stacked conductive circuit plates configured as a power distribution module for use in a vehicle. The adjacent, coplanar conductive circuit plates of sides A and B are arranged in mirror-image symmetry. The adjacent sides containing the extended or connector electrical contacts (708) are oriented toward the left and bottom edges on side A, while the fully extended contacts (708) appear on the right and bottom edges on side B. Additional electrical contact extender portions 1101- 1102 are shown electrically connected to selected ones of the truncated contacts (707) disposed along the top edge of sides A and B. These contact extender portions 1001-1002 may be fabricated from the same material as the conductive circuit plates themselves, that is, .08 mm CDA 110 half hard copper, although other suitable conductive materials may also suffice. These electrical contact extender portions 1101-1102 are attached to the truncated contacts (707) both electrically and mechanically, through brazing, riveting, or soldering, for example, or a combination of these, in order to ensure both electrical contact and adequate structural integrity. The remaining truncated electrical contacts that are not selected for connection to electrical contact extender portions may be truncated even further, flush with the perimeter of the electrically insulating encapsulating layer, for example. FIGS. 12-14 are top plan views of the top, middle, and bottom conductive layers, respectively, of the stacked conductive layer configuration described above with reference to FIG. 11. FIG. 13 depicts the middle layer of the configuration, and shows that all of the electrical contacts (707) depending from the conductive circuit plates (700) of the middle layer are truncated. Of course, it is not necessary to truncate all of the electrical contacts on the conductive circuit plates of the central levels in a stacked configuration, but this truncation can make it easier to configure the electrical contacts for alignment with a mating electrical connector, and it helps to minimize the possibility of a short between closely spaced contacts. FIG. 13 also illustrates electrical interconnection between adjacent, coplanar conductive circuit plates (700) of sides A and B. Conductive jumpers 1301, which may be formed from the same material as the conductive circuit plates and electrical contact extender portions, are disposed between selected facing truncated contacts (707) of adjacent conductive circuit plates (700) . These conductive jumpers are electrically and mechanically connected to the selected ones of the truncated electrical contacts (707) by brazing, riveting, or soldering, or a combination of these, just as described above with reference to the electrical contact extender portions of FIG. 11. Since the hazard of a short circuit involving one of the unused truncated contacts is minimal, the unused contacts do not require further truncation, but may be shortened if desired. FIG. 14 illustrates the interconnection of electrical contact extender portions 1401-1403 to selected ones of the truncated electrical contacts (707) of the bottom level of the power distribution module. As will be noted in FIGS. 11 and 14, the electrical contact extender portions can provide both interconnection between adjacent, coplanar circuit plates and an off-module electrical connection capability (as in 1101) , a way of tying multiple connections from one circuit plate to an off-module point (as in 1402) , or a single extended connection to an off- module contact point (1403) . FIG. 15 is a side elevational view of the power distribution module depicted in FIG. 11. Because the conductive jumpers 1301 joining adjacent coplanar circuit plates are formed from the same relatively stiff material as the circuit plates themselves, the completed power distribution module forms a relatively rigid and robust structure. Of course, the completed module would normally be disposed within a plastic housing (not shown) to provide weather resistance, additional structural strength, and means for supporting and securing electrical connector housings. FIGS. 16 and 17 illustrate the use of vertically stacked conductive circuit plates each having an appropriate spacer (701) and ridge (801) thereon in combination with a conventional printed circuit board. FIG. 16 is a side sectional view of a plurality of conductive circuit plates 700 arranged in a stacked vertical configuration, much as described with reference to FIG. 10 above. In addition, FIG. 16 illustrates the interconnection of electronic circuitry disposed on a printed circuit board 1601 with the electrical circuitry of the stacked conductive plate arrangement. Electronic components 1602 are disposed on the printed circuit board 1601 in accordance with commonly accepted printed circuit board design guidelines. In a preferred form, the printed circuit board 1601 is a single-sided board having plated-through holes to facilitate connection with conductive pins that penetrate both the printed circuit board and the conductive plates that form the remaining layers. The use of a single sided printed circuit board is not a disadvantage, however, since necessary crossover connections can be implemented on one of the conductive plate layers, if necessary. The ability to achieve a high circuit density is one of the advantages of the inventive configuration. FIG. 18 is a schematic diagram of the electronic circuitry disposed on the printed circuit board of FIG. 17. As shown, even complicated circuitry such as microprocessor based control modules, may be implemented through a combination of a printed circuit board and a plurality of conductive plates in a stacked arrangement. The inventors have described herein an electric power distribution apparatus that is inexpensive to produce, easily adapted for specific model applications, and durably packaged. Although several of the inventive features are described with particularity in the appended claims, it should be understood that there may be variations of the inventive concept that, while not explicitly claimed, nonetheless fall within the spirit and scope of the invention.

Claims: What is claimed is: CLAIMS 1. A conductive circuit plate comprising: a first surface and a second surface; at least 9 integral substantially identical contact pads formed in said circuit plate; a plurality of integral conductive traces formed in said circuit plate, said conductive traces electrically connecting adjacent first contact pads; and a plurality of contacts extending from said circuit plate. 2. The circuit plate of claim 1 wherein each of said first contact pads has an opening therethrough, and each of said first contact pads has at least three conductive traces extending to adjacent contact pads. 3. The circuit plate of claim 2 wherein some of said contact pad openings are sized to electrically contact a contact pin. 4. The circuit plate of claim 2 wherein some of said contact pad openings are sized to electrically contact a contact pin, and at least one electrically isolated contact pad opening is sized larger than a contact pin. 5. The circuit plate of claim 3 wherein the first surface has a first insulating layer thereon. 6. The circuit plate of claim 5 wherein said contact pads are aligned along a plurality of spaced parallel first center lines and a plurality of spaced parallel second center lines; and a plurality of said contact pad openings being pin extrusions. 7. The circuit plate of claim 6, wherein portions of said contact pads are shaped to provide grips to aid in holding the first molded insulation layer on said first surface. 8. The circuit plate of claim 5 wherein said second surface has molded thereon a second layer, said second insulation layer being sized to provide a stacking base for the first insulating layer wherein a second circuit plate can be aligned and stacked with a first circuit plate. 9. The circuit plate of claim 8 wherein the second insulation layer is a molded perimetric ridge, said perimetric ridge having an inner dimensions which is substantially equal to the outer dimensions of said first molded insulation layer, said first molded insulation layer said perimetric ridge being integral with each other. 10. The circuit plate of 9 wherein the contact pads are formed by a plurality of cross cut-outs. 11. The circuit plate of claim 10 wherein said circuit plate has a thickness of about 0.5 to about 1.3 mm and has thereon a solder coating of about 0.005 to about 0.01 mm, and said insulation layers are molded onto said solder coatings. 12. The circuit plate of claim 11 wherein each of said contact pads has a plurality of narrow attachments tabs extending therefrom. 13. A plurality of the circuit plates of claim 1 comprising a plurality of means for electrically connecting selected contact pads of one circuit plate to selected contact pads of another circuit plate. 14. A plurality of the circuit plates of claim 3 wherein a plurality of first contact pins contact selected contact pad openings of one circuit plate and selected contact pad openings of a second circuit plate. 15. A plurality of the circuit plates of claim 4 comprising, at least one first contact pin electrically connected to a contact pad opening of one first circuit plate, said first contact pin passing through a non- electrical contacting enlarged contact pad opening of another circuit plate, said first contact pin electrically connected to a contact pad opening of a third circuit plate; at least one second contact pin electrically connected to a contact pad opening in any two circuit plates; and said first, second and third circuit plates being aligned with each other and spaced from each other. 16. The plurality of circuit plates of claim 15 wherein said first contact pin is soldered to contact pad extrusions in the one and third circuit plates and said second contact pin is soldered to contact pad extrusions in any two of said one, second and third circuit plates. 17. The plurality of circuit plates of claim 16 wherein an insulating layer separates said first, second and third circuit plates, and an arrangement of said contact pads on said first circuit plate is substantially identical to the arrangement of said contact pads on said second and third circuit plates and sid first, second, third circuit plates being aligned, said contact pads on each circuit plate having parallel center lines spaced about 7.9 to about 8.1 mm apart. 18. An electric power distribution apparatus comprising: a plurality of vertically stacked conductive circuit plates, each layer including a rectangular array of contact pads, wherein at least some of the contact pads are electrically connected to selected other contact pads of the same conductive circuit plate via integrally formed conductive traces; and a plurality of conductive pins providing electrical contact between selected contact pads of different selected conductive circuit plates. 19. The apparatus of claim 18, wherein each of the conductive circuit plates is at least partially coated with an electrically insulating material. 20. The apparatus of claim 19, wherein the electrically insulating material is plastic. 21. The apparatus of claim 18, wherein each of the conductive circuit plates is at least partially encapsulated by an electrically insulating material. 22. The apparatus of claim 21, wherein the electrically insulating material covers substantially all of the conductive circuit plate, except for at least a portion of the contact pads and at least a portion of the conductive traces. 23. The apparatus of claim 18, wherein at least one of the conductive circuit plates includes at least one integrally formed electrical contact coplanar therewith, the contact extending outwardly from the conductive circuit plate, making electrical contact with at least one of the contact pads, and arranged to provide electrical contact with an external electric power distribution network. 24. The apparatus of claim 18, wherein at least one of the conductive pins includes an electrical connector on at least one end. 25. The apparatus of claim 24, wherein an electrical component is arranged to make electrical contact with the electrical connector. 26. The apparatus of claim 24, wherein the electrical connector is integrally formed with the conductive pin. 27. The apparatus of claim 18, further including a housing substantially surrounding the vertically stacked conductive circuit plates, the housing having at least one opening therethrough to accommodate a connection with an external electric power distribution network. 28. A vehicle electric power distribution apparatus comprising: a plurality of vertically stacked conductive circuit plates, each layer including a rectangular array of contact pads, wherein at least some of the contact pads are electrically connected to selected other contact pads of the same conductive circuit plate via integrally formed conductive traces; at least one of the conductive circuit plates including at least one integrally formed electrical contact coplanar therewith, the contact extending outwardly from the conductive circuit plate, making electrical contact with at least one of the contact pads, and arranged to provide electrical contact with an external electric power distribution network; electrically insulating material covering at least a portion of each conductive circuit plate; a plurality of conductive pins providing electrical contact between selected contact pads of different selected conductive circuit plates, wherein at least one of the conductive pins includes an electrical connector on at least one end; at least one electrical component arranged to make contact with the electrical connector; and a housing substantially surrounding the vertically stacked conductive circuit plates, the housing including at least one opening therethrough to accommodate a connection with an external electric power distribution network. 29. An electric power distribution apparatus comprising: a plurality of conductive plates including contact pads arranged in a predetermined pattern, wherein at least some of the contact pads are electrically connected to selected other contact pads via integrally formed conductive traces; and a plurality of conductive pins providing electrical contact between selected contact pads of different selected conductive circuit plates. 30. The apparatus of claim 29, wherein the contact pads are arranged in a rectangular array. 31. The apparatus of claim 30, wherein the array is square, and the contact pads are separated by a center-to- center distance of about 0.8 mm. 32. The apparatus of claim 29, wherein the conductive pins include a lower tubular portion and an upper connector portion. 33. The apparatus of claim 32, wherein the lower tubular portion is formed by a stamping operation that leaves a longitudinal slot extending substantially throughout the lower tubular portion. 34. The apparatus of claim 32, wherein the lower tubular portion and the upper connector portion are integrally formed. 35. The apparatus of claim 29, wherein the conductive plates are fabricated from conductive material having a thickness of from .020 to .050 inch. 36. The apparatus of claim 35, wherein the conductive material is copper. 37. The apparatus of claim 29, wherein the conductive plates are formed by a stamping operation. 38. The apparatus of claim 29, wherein the conductive plates are at least partially coated with an insulating material. 39. The apparatus of claim 29, wherein the conductive plates are stacked vertically. 40. An electric power distribution apparatus comprising: a plurality of conductive plates stacked vertically, wherein the conductive plates are: formed by a stamping operation to include an arrangement of contact pads wherein at least some of the contact pads are separated from adjacent contact pads by integrally formed conductive traces, and such that the conductive plates are substantially identical after stamping; at least partially coated with an insulating material such that the conductive plates are electrically isolated from one another; and subjected to a subsequent shearing operation to selectively remove undesired conductive traces to form desired conductive paths, thus rendering each conductive plate substantially unique from other conductive plates; and a plurality of conductive pins providing electrical contact between selected contact pads of different selected conductive circuit plates. 41. An electrical power distribution apparatus comprising: at least three conductive circuit plates, each having a substantially identical outer dimension and outer planar profile; each conductive circuit plate being spaced from each other and extending substantially parallel to each other; an appropriate insulation means separating said conductive plates from each other; each conductive plate having the same number of first and second contact pads, some of said contact pads being electrically connected to each other, said first contact pads on one of said conductive plates being directly over corresponding first contact pads of the other conductive plates, a plurality of electrical connectors extending through each of the conductive plates, some of said electrical connectors selectively and electrically contacting some of the conductive plates; a plurality of electrical contacts electrically connected to one or more conductive plates; electrical terminals selectively and electrically connected to said electrical connectors; a plurality of electrical circuits which pass from one electrical contact through a plurality of first pads on one conductive plate and at least one first pad on another conductive plate and to another electrical contact; said circuits being closeable by an appropriate connection to an external power distribution network. 42. A vehicle electric power distribution apparatus comprising: a first plurality of adjacent, coplanar, electrically conductive circuit layers, each layer including a rectangular array of contact pads, wherein at least some of the contact pads are electrically connected to selected other contact pads of the same conductive circuit layer via integrally formed conductive traces; a second plurality of adjacent, coplanar electrically conductive circuit layers vertically spaced from and laterally aligned with the first plurality of conductive circuit layers,* and a plurality of conductive pins providing electrical contact between selected contact pads of different selected vertically spaced and laterally aligned conductive circuit layers. 43. The vehicle electric power distribution apparatus of claim 42, wherein the electrically conductive circuit layers include integrally formed electrical contacts coplanar therewith, the contacts extending outwardly from the conductive circuit layer and making electrical contact with at least one of the contact pads. 44. The vehicle electric power distribution apparatus of claim 43, further including at least one electrically conductive bridge disposed between facing electrical contacts of adjacent coplanar conductive circuit layers. 45. The vehicle electric power distribution apparatus of claim 43, further including at least one electrical contact extender portion electrically and mechanically connected to one or more of the electrical contacts on exterior sides of one or more adjacent coplanar conductive circuit layers. 46. An electric power distribution apparatus comprising: a plurality of vertically stacked conductive circuit plates, each plate including a first surface and a second surface, at least 9 integral substantially identical contact pads formed in said circuit plate, a plurality of integral conductive traces formed in said circuit plate, said conductive traces electrically connecting adjacent first contact pads, and a plurality of contacts extending from the periphery of said circuit plate; each of said first contact pads having an opening therethrough sized to electrically contact a conductive pin; the top surface having molded thereon a first insulating layer with insulating first cut-outs surrounding said contact pad openings and trace cut-outs surrounding said traces; said second surface having molded thereon a second layer, said second insulation layer being sized to provide a stacking base for the first insulation layer such that a second circuit plate can be aligned and stacked with a first circuit plate; a plurality of conductive pins providing electrical contact between selected contact pads of different selected conductive circuit plates; portions of said contact pads being shaped to provide grips to aid in holding the first molded insulation layer on said first surface; and each circuit plate having a thickness of about 0.5 to about 1.3 mm and having thereon a solder coating of about 0.005 to about 0.01 mm, and said insulation layers are molded onto said solder coatings. 47. The apparatus of claim 46, wherein the apparatus is heated to melt the solder coating and effect electrical and mechanical contact between the conductive pins and the conductive plates. 48. The apparatus of claim 47, wherein the apparatus is heated in a reflow oven.

Inventors: BAILEY WILLIAM R, HAPP LAWRENCE R, KORCZYNSKI JACEK, LESESKY ALAN, BAILEY, WILLIAM, R., HAPP, LAWRENCE, R., KORCZYNSKI, JACEK, LESESKY, ALAN
Applicants: BAILEY WILLIAM R, COOPER IND INC, HAPP LAWRENCE R, KORCZYNSKI JACEK, LESESKY ALAN, BAILEY, WILLIAM, R., COOPER INDUSTRIES, INC., HAPP, LAWRENCE, R., KORCZYNSKI, JACEK, LESESKY, ALAN
Application year: 1995
Main classification: H02B1
IPC codes: B60R16, H01R9, H02B1, H05K1, H05K3