Conductive polymeric composite particles and processes thereof

Abstract: A process for the preparation of conductive polymeric particles with linear and crosslinked portions, which comprises mixing a monomer with at least one conductive filler, solvent, at least one polymerization initiator, and a chain transfer component; effecting solution polymerization by heating until from about 80 to about 100 weight percent of the monomer has been polymerized; drying the mixture by removing the solvent to yield an intimate blend of polymer with conductive filler; dispersing the aforementioned blend of polymer and conductive filler in at least one monomer with at least one polymerization initiator, a crosslinking agent and a chain transfer agent to form an organic phase; dispersing the resulting organic phase mixture in water containing a stabilizing component to obtain a suspension of particles with an average volume diameter of from about 0.05 to about 5 microns in water; polymerizing the resulting suspension by heating; and subsequently optionally washing and drying the polymeric product.

Description: This invention is generally directed to conductive composite particles and processes for the preparation thereof, and more specifically the present invention relates to small conductive polymeric composite particles, each comprising a polymer and a conductive filler distributed, preferably evenly throughout the polymer matrix of composite. The present invention also relates to processes for the preparation of polymeric composite particles. Metals such as are used for carrier cores in electrostatographic developers are conductive or semiconductive materials, and the polymeric materials used to coat the surface of the metal cores are usually insulating. Therefore, carrier particles coated completely with polymer or a mixture of polymers can lose their conductivity and become insulating. Although this is desired for some applications, for conductive magnetic brush systems (CMB) the carrier particles should be conductive. Since the carrier polymer coating can be utilized to control carrier tribo, a conductive carrier coating is needed to design carriers with the desired conductivity and triboelectrical properties. Conductive polymers are very costly, and are not suitable for preparing low cost coatings, thus a conductive polymer composite comprising a low cost polymer and a conductive filler, such as conductive carbon black, is considered a more suitable alternative. A polymer composite coating of metal materials, such as carrier beads, is known and can generally be obtained by two general approaches, solution and powder coating. Solution coating of carriers with a polymer composite solution comprised of a polymer, a conductive filler and solvent can be utilized to prepare conductive carrier, however, trapping of solvent in the solution coating can adversely interfere with the use of coated materials, for example the residual solvent trapped in the carrier coating reduces the carrier life, and the release of solvent in the developer housing can cause other problems related to the harmful effects of absorbed solvent to various copying machine parts and the toxicity of solvent. Moreover, the solvent recovery operation involved in the solution coating processes is costly. The powder coating of metal surfaces can eliminate the need for solvent, and therefore, many of the problems associated with solution coating; however, it requires a polymer powder with a very small size, for example less than 1 to 5 micrometres (microns). Although polymer powders are available for carrier powder coating, submicron or micron-sized polymer composite particles containing conductive filler to prepare conductive coated carriers that maintain their triboelectrical characteristics for extended time periods exceeding, for example, 200,000 images and which possess the other advantages illustrated herein are desired. The preparation of polymeric particles for powder coatings can be accomplished, for example, by in situ particle polymerization. In the in situ particle polymerization process, polymer particles are prepared by using suspension dispersion, emulsion and semisuspension polymerization. Suspension polymerization can be utilized to prepare polymer particles and polymeric composite particles containing, for example, a conductive filler. However, this process does not, for example, effectively enable particles with a size of less than 5 micrometres (microns). Although emulsion and dispersion polymerization can be utilized to prepare polymeric particles of a small size, for example less than 5 micrometres (microns), these processes wherein particle formation is achieved by nucleation and growth do not, it is believed, enable synthesis of particles containing fillers such as conductive fillers. Semisuspension polymerization processes are known, as described for example in US-A-5,236,629. US-A-5236629 describes a process for the preparation of conductive submicron polymeric particles which comprises mixing at least one monomer with a polymerization initiator, a crosslinking component and a chain transfer component; effecting bulk polymerization until from about 10 to about 50 weight percent of the monomer has been polymerized; terminating polymerization by cooling the partially polymerized monomer; adding thereto from about 1 to about 50 weight percent of a conductive filler, or conductive fillers, followed by mixing thereof; dispersing the aforementioned mixture of conductive filler or fillers, and partially polymerized product in water containing a stabilizing component to obtain a suspension of particles with an average diameter of from about 0.05 to about 1 micrometres (micron) in water; polymerizing the resulting suspension by heating; and subsequently washing and drying the product. There are some disadvantages with the process of US-A-5236629 which can be overcome by the modified semisuspension polymerization process of the present invention. For example, although most carbon blacks, which are known to be free radical inhibitors, can be used in the process of US-A-5236629, those carbon blacks which are very strong inhibitors, for example some highly oxidized carbon blacks, can inhibit the polymerization of the process of US-A-5236629. It is, therefore, an object of this invention to provide conductive small polymeric composite particles and processes for the preparation thereof which overcome many of the disadvantages mentioned above. According to the present invention, there is provided a process for the preparation of conductive polymeric particles with linear and crosslinked portions, which comprises mixing a monomer with at least one conductive filler, solvent, at least one polymerization initiator, and a chain transfer component; effecting solution polymerization by heating until from 80 to 100 weight percent of the monomer has been polymerized; drying the mixture by removing the solvent to yield an intimate blend of polymer with conductive filler; dispersing the aforementioned blend of polymer and conductive filler in at least one monomer with at least one polymerization initiator, a crosslinking agent and a chain transfer agent to form an organic phase; dispersing the resulting organic phase mixture in water containing a stabilizing component to obtain a suspension of particles with an average volume diameter of from 0.05 to 5 micrometres (microns) in water; polymerizing the resulting suspension by heating; and subsequently optionally washing and drying the polymeric product. In a preferred aspect, a mixture of monomers is selected, the mixture containing from 2 monomers to 20 monomers. In one embodiment, the process of the present invention comprises the preparation of conductive polymeric particles containing a conductive filler distributed substantially throughout the polymer matrix of the particles, and which particles can be selected as carrier powder coatings. In another embodiment, the process of the present invention comprises the preparation of conductive polymeric composite particles with an average volume particle size diameter of from between 0.05 micrometres (micron) to 5 micrometres (5 microns). The conductivity of the generated submicron polymeric composite particles can be modified by, for example, varying the weight percent of conductive filler component present in effective amounts of, for example, from between 1 weight percent to 50 weight percent, and also by varying the composition of the conductive filler component. Thus, in embodiments conductive submicron polymeric composite particles with a conductivity of from between about 10- 10 (ohm-cm) -1 to about 10 -1 (ohm-cm) -1 can be prepared. In embodiments, the particles with average diameter of 0.05 to 5 micrometres (microns) conductive composite particles are comprised of polymer and a conductive filler distributed evenly throughout the polymer matrix of the composite product, and which product can be obtained by a modified semisuspension polymerization method in which at least one monomer is mixed with a conductive filler, solvent, one or more polymerization initiators, and a chain transfer component; effecting solution polymerization by heating until from 80 to 100 weight percent of the monomer has been polymerized; drying the mixture by removing the solvent; dispersing the aforementioned mixture of conductive filler or fillers and polymer in at least one monomer with one or more polymerization initiators, a crosslinking agent and a chain transfer agent; dispersing the resulting mixture in water containing a stabilizing component to obtain a suspension of particles with an average diameter of from 0.05 to 5 micrometres (microns) in water; polymerizing the resulting suspension by heating; and subsequently optionally the product is washed and dried. In the modified semisuspension polymerization process of the present invention it is possible to select very strongly inhibiting carbon blacks. Furthermore, the nature of the conductive filler dispersion in the process of US-A-5,236,629 is one of free filler particles physically dispersed in the polymer matrix, while in the modified semisuspension polymerization process of the present invention the filler, such as carbon black, contains the polymer made in the solution polymerization step chemically grafted or strongly adsorbed onto its surface thereby enhancing its dispersion stability. Therefore, with the present invention there are fewer problems associated with free filler particles that can occur in the US-A-5236621 process if the bulk polymerization step is not conducted to the optimum conversion. The modified semisuspension polymerization process of the present invention also provides advantages in obtaining a more uniform dispersion of filler in the final particles primarily because of the grafted or adsorbed polymer on the filler surface. While some additives are difficult to disperse in various monomers, depending on the surface compatibility of the filler and monomers, the modified semisuspension polymerization process overcomes this difficulty by chemically grafting or adsorbing polymer on the filler surface during the solution polymerization. This solution polymerization step, therefore, compatibilizes the filler with the monomer, thereby ensuring better filler dispersion than in the process of US-A-5236629. This results in fewer final particles without filler, which is particularly important for conductive particles, as there can be a significant decrease in conductivity when even a small fraction of nonconductive particles, that is particles without filler, are mixed in with the conductive particles. Thus the modified semisuspension polymerization process described in the present application offers a different process with significant improvements over the process disclosed in US-A-5,236,629. These advantages include (1) superior uniformity of the conductive filler in the final particles because of the solution polymerization step in which polymer is grafted or adsorbed onto the surface of the filler; (2) fewer particles containing no conductive filler due to improved dispersion; (3) higher conductivity in the final particles at the same weight percent loading of conductive filler because of the better filler dispersion; (4) fewer potential problems with free conductive filler particles contaminating the final product and causing, for example, problems with contamination in the developer housing when the particles are coated on carrier cores; and (5) the ability to use fillers which are very strong free radical polymerization inhibitors such as some highly oxidized carbon blacks. With the present invention, a process to obtain conductive submicron or micron-sized polymer particles of less than 1 to 5 microns in average volume diameter as determined by a scanning electron microscope, each containing conductive fillers evenly dispersed in the polymer. These polymeric particles contain from 1 to 50 weight percent of a conductive filler, such as carbon black, which is evenly distributed throughout the polymer matrix. This modified semisuspension polymerization process permits the preparation of low cost, clean, and dry submicron conductive polymeric particles that can be selected as carrier powder coatings. The present invention thus provides small conductive submicron polymeric composites comprised of a polymer and a conductive filler distributed uniformly throughout the polymer matrix of the composite. The invention provides low cost, clean and dry conductive small polymeric composite particles comprised of from 50 to 99 weight percent of polymer and from 1 to 50 weight percent of conductive filler distributed throughout the polymer matrix of the composite as measured by TEM. The invention provides conductive submicron polymeric composite particles with a conductivity from 10 -10 (ohm-cm) -1 to 10 -1 (ohm-cm) -1 . The invention provides conductive submicron polymeric composite particles with an average particle diameter size of from 0.05 micrometres (micron) to 5 micrometres (microns). The invention provides conductive small polymeric composites which can be selected for two component carrier powder coatings, reference US-A-4,937,166 and 4,935,326, and processes for preparing such carriers; and wherein improved dispersion of conductive fillers can be achieved in submicron conductive carrier coating polymeric composite particles. The present invention provides simple processes for the formation of small conductive polymeric particles, and more specifically from 1 to 5 micrometre (micron) size (average volume throughout) conductive polymeric particles. The invention provides simple and economical semisuspension polymerization processes for the preparation of low cost, clean, and dry small conductive polymeric particles, and more specifically submicron or micron-size conductive polymeric particles useful as carrier powder coatings. Additionally, there are provided as a result of the enhanced degree of control and flexibility, processes for the preparation of polymeric particles containing a conductive filler, or fillers with improved flow and fusing properties; and particles that can be selected for conductive carrier powder coating with a triboelectric charge in the range, for example, of from about -40 to about + 40 microcoulombs per gram as determined by the known Faraday Cage process. The present invention can be accomplished in embodiments by the provision of processes for the preparation of small conductive polymer particles, each containing a conductive filler or fillers distributed evenly throughout the polymer matrix of particles, referred to herein as modified semisuspension polymerization processes in which at least one monomer is mixed with a carbon black, or a metal oxide like tin oxide, a solvent, one or more polymerization initiators, and a chain transfer component; effecting solution polymerization by heating until from 80 to 100 weight percent of the monomer has been polymerized; drying the mixture by removing the solvent to yield a blend of polymer and conductive filler that contains from 10 percent to 80 percent filler; and dispersing the aforementioned mixture of conductive filler or fillers and polymer in at least one monomer with one or more polymerization initiators, a crosslinking agent and a chain transfer agent. The viscosity of the organic phase can in embodiments be an important factor in controlling dispersion of the conductive filler in the particles, and which viscosity can be adjusted by the percentage of polymer in the mixture. Typical viscosities are in the range of from 0.01 to 100 Pa.s (10 centipoises to 100,000 centipoises). The aforementioned mixture is then dispersed in water containing a stabilizing component with, for example, a high shear mixer to permit the formation of a suspension containing small, less than 10 micrometres (microns), and more specifically from submicron to 5 micrometres (microns), for example, particles therein, and thereafter, transferring the resulting suspension product to a reactor, followed by polymerization until complete conversion to the polymer product is achieved. The polymer product can then be cooled, washed and dried. More specifically, the process of the present invention is comprised of (1) mixing a monomer or comonomers with one or more conductive fillers, solvent, polymerization initiators, and a chain transfer component; (2) effecting solution polymerization by increasing the temperature of the aforementioned mixture to from about 45°C to 120°C until from 80 to 100 weight percent of monomer or comonomers has been polymerized; (3) drying this mixture by removing the solvent to yield an intimate blend of polymer and conductive filler; (4) dispersing this blend of polymer and conductive filler in monomer or comonomers with at least one polymerization initiator, a crosslinking component and a chain transfer component to provide an organic phase; the molecular weight and concentration of polymer in this organic phase affects the viscosity of the organic phase which is an important factor in controlling the conductive filler distribution in the particles; (5) dispersing the organic phase in from 2 to 5 times its volume of water containing from 1 to 5 weight percent of a stabilizing component to form a suspension with a particle size diameter of from 0.05 micrometre (micron) to 5 micrometre (micron) particles containing from 1 to 50 weight percent of a conductive filler, or conductive fillers using a high shear mixer; (6) transferring the resulting suspension to a reactor and polymerizing the suspension by increasing its temperature to from 45°C to 120°C to allow the complete conversion of monomer or comonomers to polymer; (7) cooling the product and washing the product with water and/or an alcohol like methanol; (8) separating polymer particles from the water/methanol by means of filtration or centrifugation; and (9) drying the polymeric particles. The present invention is directed to the preparation of small conductive polymeric particles, that is with, for example, an average particle diameter in the range of from 0.05 micrometre (micron) to 5 micrometres (microns), and preferably from 0.1 to 1.0 micrometre (micron) as measured by SEM containing 1 to 50 percent and preferably 10 to 20 percent of conductive filler distributed throughout the polymer matrix of particles, and which polymer particles have a number and weight average molecular weight of from between 3,000 to 500,000 and from between 5,000 to 2,000,000, as determined by gel permeation chromatography, respectively, in embodiments. Further, the process of the present invention is directed to the preparation of conductive polymeric particles of average diameter of from 0.1 micrometre (micron) to 1.0 micrometre (micron) containing 10 to 20 weight percent of a conductive filler and 80 to 90 weight percent of a polymeric material. This polymeric material can be comprised of linear and crosslinked portions with a number average molecular weight of the linear portion being from 3,000 to 50,000 and a weight average molecular weight of from 100,000 to 500,000 and from 0.1 to 25 weight percent of a crosslinked portion, and which polymer product is useful for carrier coatings. More specifically, the process of the present invention in embodiments is directed to the preparation of conductive polymeric particles of an average diameter in the range of between 0.1 to 1.0 micrometre (micron), conductive filler distributed evenly throughout the polymer matrix particle as measured by TEM with a linear portion having a number average molecular weight in the range of from 3,000 to 50,000, and a weight average molecular weight of from 100,000 to 500,000 and from 0.1 to 25 weight percent of a crosslinked portion. This process is as indicated herein and specifically comprises (1) mixing a monomer or comonomers with a conductive filler with the ratio of monomer or comonomers to conductive filler being from 10/1 to 1/10, a solvent with the ratio of monomer or comonomers to solvent being from 20/1 to 1/20, at least one polymerization initiator with the ratio of monomer or comonomers to initiator being from 100/2 to 100/20, and a chain transfer component with the ratio of monomer or comonomers to the chain transfer component being from about 100/0.01 to 100/1; (2) effecting solution polymerization by increasing the temperature of the mixture to from 45°C to 120°C until from 80 to 100 weight percent of monomer or comonomers has been converted to polymer with a number average molecular weight of from 3,000 to 50,000 and a weight average molecular weight of from 5,000 to 40,000, (3) drying this mixture by removing solvent; (4) dispersing this polymer/filler blend in monomer or monomers with the ratio of polymer/filler blend to monomers being from 5/100 to 100/100 with at least one polymerization initiator with the ratio of monomer or comonomers to initiator being from 100/2 to 100/20, a crosslinking component with the ratio of monomer or comonomers to the crosslinking component being from 100/0.01 to 100/5, and a chain transfer component with the ratio of monomer or comonomers to the chain transfer component being from 100/0.01 to 100/1 to yield an organic phase; (5) dispersing the resulting organic phase from 2 to 5 times its volume in water containing from 1 to 5 weight percent of a stabilizing component, preferably polyvinylalcohol having a weight average molecular weight of from 1,000 to 10,000 to form a suspension containing particles with a particle size diameter of from 0.1 to 1.0 micrometre (micron) by using high shear mixer; (4) transferring the resulting suspension to a reactor and polymerizing the suspension by increasing its temperature to from 45°C to 120°C to allow the complete conversion of monomer or comonomers to polymer; (5) washing the resulting product with equal volumes of methanol and/or water from 3 to 5 times; (6) separating polymeric particles from water/methanol by means of filtration or centrifugation; and (7) drying of the polymeric particles. Optionally, the drying step (3) above can be eliminated and the solvent can be removed by an appropriate technique after the monomers have been added as in step (4). In embodiments, the present invention is directed to a process for the preparation of conductive small polymeric particles which comprises mixing at least one monomer with a carbon black, solvent, one or more polymerization initiators, and a chain transfer component; effecting solution polymerization by heating until from 80 to 100 weight percent of the monomer has been polymerized; drying the mixture by removing the solvent; dispersing the aforementioned mixture of conductive filler or fillers and polymer in at least one monomer with one or more polymerization initiators, a crosslinking agent and a chain transfer agent; dispersing this mixture in water containing a stabilizing component to obtain a suspension of particles with an average diameter of from 0.05 to 5 micrometres (microns) in water; polymerizing the resulting suspension by heating; and subsequently washing and drying the product. Illustrative examples of monomer or comonomers present in an amount of, for example, from 80 to 99 weight percent, and more preferably from 80 to 90 weight percent include vinyl monomers comprised of styrene and its derivatives such as styrene, α-methylstyrene, p-chlorostyrene and the like; unsaturated monocarboxylic acids and their derivatives such as acrylic acid, methyl acrylate, ethyl acrylate, butyl acrylate, dodecyl acrylate, octyl acrylate, phenyl acrylate, methacrylic acids, methyl methacrylate, ethyl methacrylate, butyl methacrylate, octyl methacrylate, acrylonitrile and acrylamide; dicarboxylic acids having a double bond and their derivatives such as maleic acid, monobutyl maleate, dibutylmaleate; vinyl esters such as vinyl chloride, vinyl acetate and vinyl benzoate; vinyl ketones such as vinyl methyl ketone and vinyl ether ketone; and vinyl ethyl ether and vinyl isobutyl ether; vinyl naphthalene; unsaturated mono-olefins such as isobutylene and the like; vinylidene halides such as vinylidene chloride and the like; N-vinyl compounds such as N-vinyl pyrrole and fluorinated vinyl compounds such as pentafluoro styrene, allyl pentafluorobenzene and the like; and mixtures thereof. Illustrative examples of polymerization initiators present in an amount of, for example, from 0.1 to 20 weight percent of monomer, and more preferably from 1 to 5 weight percent include azo compounds such as 2,2'azodimethylvaleronitrile, 2,2'azoisobutyronitrile, azobiscyclohexanenitrile, 2-methylbutyronitrile and the like, and peroxide such as benzoyl peroxide, lauryl peroxide, 1-1-(t-butylperoxy)-3,3,5-trimethylcyclohexane, n-butyl-4,4-di-(t-butylperoxy)valerate, dicumyl peroxide and the like. Crosslinkers selected for the process of the present invention are known and can be comprised of compounds having two or more polymerizable double bonds. Examples of such compounds include aromatic divinyl compounds such as divinylbenzene and divinylnaphthalene; carboxylic acid esters having two double bounds such as ethylene glycol diacrylate, ethylene glycol dimethylacrylate and the like; and divinyl compounds such as divinyl ether, divinyl sulfite, divinyl sulfone and the like. Among these, divinylbenzene is particularly useful. The crosslinking component is preferably present in an amount of from 0.1 to 5 parts by weight in 100 parts and, more preferably, from 0.2 to 1 part by weight of the monomer or comonomers. Examples of conductive fillers present in effective amounts, for example, from 1 to 50 weight percent and more preferably from 5 to 30 weight percent, and the like, and which amounts can in embodiments be based on (1) how much filler is needed for minimum effect on conductivity, and (2) achieving a conductivity plateau including conductive carbon blacks such as acetylene black, available from Chevron Chemical, VULCAN BLACK™, BLACK TM PEARL L®, KETJENBLACK EC600JD®, available from AKZ0, CONDUCTEX SC ULTRA™, available from Columbian Chemical, metal oxides such as iron oxides, TiO, SnO 2 , metal powders such as iron powder, and the like. Stabilizers present in an amount of, for example, from 0.1 to 5 weight percent and, more preferably, from 1 to 4 weight percent of water are selected from the group consisting of both nonionic and ionic water soluble polymeric stabilizers such as methyl cellulose, ethyl cellulose, hydroxypropyl cellulose, block copolymer such as PLURONIC E87'" available from BASF, the sodium salt of carboxyl methyl cellulose, polyacrylate acids and their salts, polyvinyl alcohol, gelatins, starches, gums, alginates, zein, casein and the like; and barrier stabilizers such as tricalcium phosphate, talc, barium sulfate and the like. Polyvinyl alcohol with a weight average molecular weight of from 1,000 to 10,000 is particularly useful. Chain transfer components selected, which primarily function to control molecular weight by inhibiting chain growth, include mercaptans such as laurylmercaptan, butylmercaptan and the like, or halogenated hydro carbons such as carbon tetrachloride or carbon tetrabromide, and the like. The chain transfer agent is preferably present in an amount of from 0.01 to 1 weight percent and more preferably from 0.1 to 0.5 weight percent monomer or comonomers. Also, stabilizer present on the surface of the polymeric particles can be washed using an alcohol such as, for example, methanol and the like, or water. Separation of washed particles from solution can be achieved by any classical separation technique such as filtration, centrifugation and the like. Classical drying techniques such as vacuum drying, freeze drying, spray drying, fluid bed drying and the like can be selected for drying of the polymeric particles. Illustrative specific examples of polymer or copolymers present in an amount of 50 to 99 weight percent, more preferably from 70 to 95 weight percent, and from 5 to 300 percent in embodiments containing, for example, both a linear and a crosslinked portion in which the ratio of crosslinked portion to linear portion is from 0.001 to 0.25 and the number and weight average molecular weight of the linear portion is from 3000 to 500,000 and from 5,000 to 2,000,000, respectively, include vinyl polymers of polystyrene and its copolymers, polymethylmethacrylate and its copolymers, unsaturated polymers or copolymers such as styrene-butadiene copolymers, fluorinated polymers or copolymers such as polypentafluorostyrene, polyallylpentafluorobenzene and the like. The particles of the present invention can be selected as carrier powder coatings, which carriers contain, for example, a steel core, and can be admixed with toner compositions comprised of resin particles, pigment particles and optional additives such as charge control components, reference US-A-4,560,635, enabling the formation of a developer composition useful in electrophotographic imaging and printing processes. The following Examples are being submitted to further define various species of the present invention. These Examples are intended to be illustrative only and are not intended to limit the scope of the present invention. Also, parts and percentages are by weight unless otherwise indicated. EXAMPLE I In a 1 liter glass reactor 150 grams of REGAL 330® carbon black were added to 500 grams of toluene with 5 grams of 2'-azobis(2,4-dimethylvaleronitrile), 2 grams of benzoyl peroxide, 5 grams of dodecanethiol (chain transfer agent) and 150 grams of methyl methacrylate monomer. The resulting mixture was polymerized at 50°C for 24 hours. The temperature was then increased to 70°C for 3 hours to complete the polymerization. The resulting product was vacuum dried. 176 grams of this solution polymerized blend of PMMA (polymethylmethacrylate) and carbon black (CB) were dispersed in 510 grams of methyl methacrylate monomer for 48 hours, and then 40 grams of 2,2'-azobis(2,4-dimethylvaleronitrile), 16.0 grams of benzoyl peroxide and 3.0 grams of divinylbenzene crosslinking agent were added, and mixed until dispersed. This monomer/polymer/CB phase was then mixed with 2,200 milliliters of water containing four weight percent of polyvinyl alcohol (weight average molecular weight 3,000) and vigorously stirred at 10,000 rpm for 5 minutes to produce a microsuspension of polymeric particles in water. The suspension polymerization temperature was raised to 60°C for 2 hours, and then to 85°C for 1 hour. The microsuspension product was washed in 5 liters of methanol. A second wash was accomplished with methanol/water (50:50 ratio) and a third wash with deionized water. After the final wash, the product was freeze dried. Using a scanning electron microscope (SEM), photomicrographs of the dry product showed the average particle size of the polymer product was 0.8 micron with a glass transition temperature of 113°C as measured by DSC. Evaluation showed the powder product conductivity was 10 -2 (ohm.cm) -1 , as determined by measuring the electrical resistance of a pressed powder pellet, Transmission Electron Microscopy showed less than 1 percent unpigmented particles. 0.7 gram of the resulting polymethyl methacrylate particles containing carbon black were mixed with 100 grams of Hoeganoes core carrier with an average bead diameter of 90 micrometres (microns) in a Munson type mixer at room temperature. The coated materials were then fused on the surface of the carrier at 177°C (350°F) in a rotary kiln furnace. The product was sieved through a 177 micrometre (micron) screen to remove coarse materials. The coarse fraction was found to be about 0.08 weight percent. The sieved materials were scanned for surface coverage using the SEM. The results evidenced 100 percent surface coverage of polymer. A functional evaluation of the resulting carrier in the Xerox Corporation 5100 two component development system indicated it had a triboelectric charge (tribo) of 26 microcoulombs per gram (µc/g) and a conductivity of 10 -8 (ohm-cm) -1 as determined by the Faraday Cage method. Thermal gravimetric analysis evidenced that the carbon black content was 12.7 weight percent, indicating all the carbon black remained in the interior of the particles, and that there was no free carbon black. EXAMPLE II The process of Example I was repeated except that styrene monomer was used instead of methyl methacrylate. The resulting product has an average particle size of 0.7 micrometre (micron)with a conductivity of 10 -3 (ohm-cm) -1 and glass transition temperature of 102°C. The same carrier coating as described in Example I was used resulting in a 0.6 weight percent coarse fraction. The coated carrier'had a tribo of 15 microcoulombs per gram and a conductivity of 10 -8 (ohm-cm) -1 . EXAMPLE III The process of Example I was repeated except that 150 grams of CONDUCTEX 975™ carbon black were used. The resulting polymeric product had an average particle size diameter of 0.7 micrometre (micron) and a glass transition temperature of 115°C. The same carrier coating as described in Example I was used resulting in a coarse fraction of 0.5 weight percent. The coated carrier had a tribo charge of 28 microcoulombs per gram and a conductivity of 10 -6 (ohm-cm) -1 as determined by the Faraday Cage method. EXAMPLE IV The process of Example I was repeated except 50 grams of acetylene black (Chevron Shawinigan Company) were used. The resulting polymeric product had an average particle size of 0.6 micrometre (micron) with glass transition temperature of 111°C. The same carrier coating process as described in Example I was used resulting in a coarse fraction of 0.3 weight percent. The coated carrier had a tribo charge of 31 microcoulombs per gram and a conductivity of 10 -10 (ohm-cm) -1 . EXAMPLE V The process of Example I was repeated except that pentafluorostyrene monomer was used. The resulting product had an average particle size of 0.9 micrometre (micron) and glass transition temperature of 106°C. The same carrier coating as described in Example I was used resulting in a 0.2 weight percent coarse fraction. The coated carrier had a tribo charge of -25 microcoulombs per gram. COMPARATIVE EXAMPLE 1 An experiment analogous to Example I was conducted using the process disclosed in US-A-5,236,629. REGAL 330® carbon black (82 grams) was dispersed in 510 grams of methyl methacrylate monomer with 40 grams of 2,2'-azobis(2,4-dimethylvaleronitrile), 16.0 grams of benzoyl peroxide and 3.0 grams of divinylbenzene crosslinking agent. This organic phase was partially bulk polymerized by heating to 45°C until 12 weight percent of the monomer had been converted to polymer, and then cooled to 10°C. The resulting mixture was then mixed with 2,200 milliliters of water containing four weight percent polyvinyl alcohol (molecular weight M w 3,000) and vigorously stirred at 10,000 rpm for 5 minutes. The suspension polymerization temperature was raised to 60°C for 2 hours, and then to 85°C for 1 hour. The microsuspension product was washed and dried as in Example I. SEM photomicrographs of the dry product showed the average particle size diameter of the polymer product was 0.9 micrometre (micron). Evaluation showed the powder conductivity was 10 -3 (ohm-cm) -1 , compared to 10 -2 (ohm-cm) -1 for Example I as determined by measuring the electrical resistance of a pressed powder pellet. Transmission electron microscopy showed approximately 3 to 4 percent of unpigmented particles, compared to less than 1 percent for Example I. 0.7 gram of the resulting polymethyl methacrylate particles containing carbon black were mixed with 100 grams of Hoeganoes core carrier with an average bead diameter of 90 micrometres (microns) in a Munson type mixer at room temperature. The coated materials were then fused on the surface of the carrier at 177°C (350°F) in a rotary kiln furnace. The functional evaluation of the resulting carrier in the Xerox Corporation 5100 two component development system indicated a triboelectric charge (tribo) of 28 microcoulombs per gram (µc/gram), compared to 26 µc/gram for Example I, and a conductivity of 10 -9 (ohm-cm) -1 , as compared to 10 -8 (ohm-cm)-1 for Example I. Thermal gravimetric analysis evidenced that the carbon black content was 12.6 weight percent. The modified semisuspension polymerization process of the present invention produced more conductive polymer particles and more conductive carrier than the process of US-A-5236629. Conductivity and tribocharge were measured as indicated herein, see Comparative Example 2 for example. COMPARATIVE EXAMPLE 2 Comparative Example 1 was repeated except that the bulk polymerization was stopped when only 6 weight percent of the monomer had been converted to polymer. SEM photomicrographs of the dry product showed the average particle size of the polymer product was 0.5 micrometre (micron). Evaluation showed the powder conductivity was 10 -6 (ohm-cm) -1 , compared to 10 -2 (ohm-cm) -1 for Example I as determined by measuring the electrical resistance of a pressed powder pellet. Transmission electron microscopy showed approximately 10 to 15 percent of unpigmented particles, compared to less than 1 percent for Example 1. 0.7 gram of the resulting polymethyl methacrylate particles containing carbon black were mixed with 100 grams of Hoeganoes core carrier with an average bead diameter of 90 micrometres (microns) in a Munson type mixer at room temperature. The coated materials were then fused on the surface of the carrier at 177°C (350°F) in a rotary kiln furnace. The functional evaluation of the resulting carrier in the Xerox Corporation 5100 two component development system indicated a triboelectric charge (tribo) of 29 microcoulombs per gram (µc/gram), compared to 26 µc/gram for Example I, and a conductivity of 10 -13 (ohm-cm) -1 , as compared to 10 -8 (ohm-cm) -1 for Example I. Thermal gravimetric analysis evidenced that the carbon black content was 6.9 weight percent compared to 12.7 percent in Example I signifying that during the suspension polymerization step free carbon black diffused out of the polymerizing particles into the aqueous phase. This explanation is further evidenced by the observation that large amounts of free carbon black were observed in the supernatant during the washing of the particles. This Example indicates that the modified semisuspension polymerization process of the present invention is more robust than the of US-A-5236629 process, and that product conductivity can decrease significantly, for example by from about 1 to about 5 orders of magnitude.

Claims: A process for the preparation of conductive polymeric particles with linear and crosslinked portions, which comprises mixing a monomer with at least one conductive filler, solvent, at least one polymerization initiator, and a chain transfer component; effecting solution polymerization by heating until from 80 to 100 weight percent of the monomer has been polymerized; drying the mixture by removing the solvent to yield an intimate blend of polymer with conductive filler; dispersing the aforementioned blend of polymer and conductive filler in at least one monomer with at least one polymerization initiator, a crosslinking agent and a chain transfer agent to form an organic phase; dispersing the resulting organic phase mixture in water containing a stabilizing component to obtain a suspension of particles with an average volume diameter of from 0.05 to 5 micrometres in water; polymerizing the resulting suspension by heating; and subsequently optionally washing and drying the polymeric product. A process in accordance with claim 1 wherein a mixture of monomers is selected, the mixture containing from 2 monomers to 20 monomers. A process in accordance with claim 1 or claim 2 wherein heating is accomplished at a temperature of from 45°C to 120°C. A process in accordance with any one of claims 1 to 3 wherein the number average molecular weight of the suspension polymerization product is between 3,000 to 500,000, and the weight average molecular weight of the suspension polymerization product is between 5,000 to 2,000,000. A process in accordance with any one of claims 1 to 4 wherein the monomer or monomers are selected from: α-methylstyrene, p-chlorostyrene, unsaturated monocarboxylic acids and the derivatives thereof; dicarboxylic acids with a double bond and their derivatives; vinyl ketones; vinyl naphthalene; unsaturated mono-olefins; vinylidene halides; N-vinyl compounds; fluorinated vinyl compounds. A process in accordance with any one of claims 1 to 5 wherein the filler is selected from: conductive carbon blacks, metal oxides, metals, and mixtures thereof. A process in accordance with any one of claims 1 to 6 wherein the polymerization initiator is selected from azo compounds and peroxides. A process in accordance with any one of claims 1 to 7 wherein the stabilizing component is selected from nonionic and ionic water soluble polymeric stabilizers. A process in accordance with any one of claims 1 to 8 wherein the crosslinking component is selected from compounds having two or more polymerizable double bonds. A process in accordance with any one of claims 1 to 9 wherein the chain transfer component is selected from the group consisting of mercaptans and halogenated hydrocarbons.

Inventors: CREATURA JOHN A, CUNNINGHAM MICHAEL F, MAHABADI HADI K, WRIGHT DENISE Y, CREATURA, JOHN A., CUNNINGHAM, MICHAEL F., MAHABADI, HADI K., WRIGHT, DENISE Y.
Applicants: XEROX CORP, XEROX CORPORATION
Application year: 1995
Main classification: C08F292
IPC codes: G03G9, C08F292, C08J3, C08F2