Method and apparatus for mounting a part at a specfific position

Abstract: The present invention relates to a method of mounting a part at a specific position, in particular mounting an electronic part or an auxiliary part as for supporting the electronic part onto a substrate such as a printed circuit board, comprising the steps of picking up the part by an attracting nozzle, transferring the part and placing same within a detection area of an optical detection means, said optical detection means emits parallel light beams for detecting projected width data of the part, subjecting the part to a recognition process, wherein said projected width data are obtained under rotation of the part, and mounting the part at the desired position. Furthermore, the present invention relates to an apparatus for performing the above-mentioned method. In order to improve the recognition accuracy and to allow also recognition of parts which have not got a rectangular or square cross-section if viewed from the top, in particular a cylindrical part, it is suggested to determine a first projected position of said part attracted by said nozzle within said detection area, rotate said part by a predetermined rotary angle from said first position to a second position within said detection area and to determine said second projected position. Said apparatus is characterized in that a calculating section is provided for determining a first projected position of said part attracted by said nozzle within said detection area, said control unit rotating said part by a predetermined rotary angle from said first position to a second position within said detection area and in that said calculating section determines said second projected position.

Description: The present invention relates to a method of mounting a part at a specific position, in particular mounting an electronic part or an auxiliary part as for supporting the electronic part onto a substrate such as a printed circuit board, comprising the steps of picking up the part by an attracting nozzle, transferring the part and placing same within a detection area of an optical detection means, said optical detection means emits parallel light beams for detecting projected width data of the part, subjecting the part to a recognition process, wherein said projected width data are obtained under rotation of the part, and mounting the part at the desired position. Furthermore, the present invention relates to an apparatus for mounting a part at a specific position, particularly mounting an electronic part or an auxiliary part as for supporting the electronic part onto a substrate such as a printed circuit board, comprising a movable mounting head unit having at least one attracting nozzle for picking up at least one part from a part supply unit, an optical detecting means emitting parallel light beams in a detection area for detecting a projected width data of the part, a control unit for controlling the movement of the nozzle in response to said projected width data, in particular for performing the above-mentioned method. As to this invention, a method of recognizing a part is provided which is suited for a cylindrical part, in which deviation in the part pickup position is checked and a mounting position is corrected accordingly using optical detection means comprising a parallel light beam emitting section and a light receiving section of a surface mounter for picking up the small part by a pickup nozzle and mounting it on a board. A type of surface mounter has been generally known in which small parts such as ICs, resistors, and capacitors are picked up by a parts pickup head unit having a pickup nozzle from a parts supply section, transferred over a positioned printed circuit board, and mounted to a specified position on the printed circuit board. In order to mount the part correctly in specified position on the printed circuit board, this type of mounter is required, if there is deviation in the part pickup position, to correct the deviation accordingly. Therefore, a method has been known as disclosed in the Japanese Unexamined Patent Application Hei 6-21697 in which the head unit is provided with a parallel light beam emitting section and a light receiving section, projected width of the part is detected by emitting the parallel light beam to the part while rotating the pickup nozzle with the picked up part located between the light emitting and receiving sections of the optical detection means, and a mounting position correction amount is obtained (see also EP-A-0 582 086). Specifically, this method is used for chip parts of square shapes in which the projected width of the part is detected by the optical means while the pickup nozzle which has picked up the part is being rotated; the rotation angle, minimum projected width, projection center position of the part when the projected width of the part becomes the minimum are obtained from the detection data, and mounting position correction amounts in X, Y and rotary directions are calculated from those data. The shape of the parts mounted by the mounter is varied. A special part is of a low height cylindrical shape, or a part of a cylindrical cross section (hereinafter called a cylindrical part). Also when the cylindrical part is mounted, if the nozzle center is displaced from the part center, correction of the mounting position is required accordingly. However, conventional method of recognition is not suited for the cylindrical parts. In other words, with the conventional method described above, a rotary position is sought where the projected width of the part detected by the optical detection means becomes the minimum while the pickup nozzle which has picked up the part is being rotated. The mounting position correction amount is determined from the nozzle rotation angle and minimum projected width at that rotary position. If the part picked up by the pickup nozzle is cylindrical, the projected width corresponds to the diameter, and remains unchanged even if the pickup nozzle is rotated. Therefore, the method of seeking the rotary position where the projected width becomes the minimum cannot be used. It is therefore an objective of the present invention to provide an improved method and an improved apparatus for mounting a cylindrical part, wherein the detection of the part is improved so that the mounting position is correctly determined and the picked up state of the part is more accurately recognized, although the part's shape deviates from a square or rectangular shape, and wherein particularly a cylindrical part is correctly recognized. According to the present invention, the above-mentioned objective concerning the method is performed by the method according to claim 1. The method includes the steps of determining a first projected position of said cylindrical part attracted by said nozzle within said detection area, rotating said part by a predetermined rotary angle from said first position to a second position within said detection area and determining said second projected position. Thus, by detecting projected positions of said part at different rotary states, it is determined the position of the part relative to the detection area so that said cylindrical part is recognized accurately. According the invention, said first and second projected positions of said part are determined by detecting central projected positions of the part. Thus, it is possible to calculate displacement amount of the parts and relative to the nozzle center via the distance between the projected nozzle center and the projected central position of the part, at least at both of the rotary angles. According to the invention, said part is formed as a cylindrical part having its central axis parallel or identical to an axis of said nozzle and perpendicular to a plane which is defined by the detection area. Said part being formed by cylindrical means so that the part has a cylindrical cross-section viewed in the direction of the light beam, preferably said cylindrical part is of a low height. The cylindrical part is not limited to an electronic part constituting an electronic element but may also be an auxiliary part which is mounted on printed circuit boards for supporting the electronic parts. According to yet another aspect of the invention, said predetermined rotary angle is preferably set to 90° instead of setting to an arbitrary angle. As a result, the deviations of the center of the cylindrical part from the nozzle center are checked in two directions which are normal (i.e. perpendicular) to each other, so that the mounting position correction amounts for both X and Y directions are easily and immediately obtained. According to yet another aspect of the invention, said part being subject to the light beams rotated via said nozzle around an axis substantially perpendicular to the light beams, and during rotation said projected position, said projection width and said rotary angle are repeatedly detected at least until a maximum or minimum displacement distance is determined between said projected position of said part and a known projected position corresponding to the nozzle center, and wherein said displacement distance reaches said maximum or said minimum when a line connected from a part center to the nozzle center extends substantially perpendicular to the parallel light beams and is within said detection area. This allows also easy and accurate determination of the pickup state of the cylindrical part. According to the present invention, the above-mentioned objective concerning the apparatus is performed by an apparatus according to claim 15. A calculating section is provided for determining a first projected position of said part attracted by said nozzle within said detection area, said control unit rotating said part by a predetermined rotary angle from said first position to a second position within said detection area and in that said calculating section determines said second projected position. According to a further aspect of the invention, said apparatus has at least a surface of the nozzle matt and/or dark coloured painted and/or has said nozzle formed with black resin. Such anti-reflected surface properties of the nozzle improves the accuracy of the detection of the part, as normally, light reflected at the nozzle would cause adverse effect on the part detection. According to yet another aspect of the invention, an apparatus of the nozzle is provided with a connecting means which allow the nozzle to be detachably inserted into a receiving means of a nozzle holder, so that said nozzle is attached into said receiving means substantially without play. Therefore, pickup, recognition and mounting of the part are performed without play of the central axis of the pickup nozzle, so that stability and accuracy during those actions are assured. According to a further aspect of the invention, said receiving means comprises two plates which are disposed relatively to each other bi-directional, and which allow to bring the upper part of the nozzle into abutting contact with the plates, and wherein spring means are provided for pressing the upper part of the nozzle against the bi-directional plates. Preferably, both of said spring means and said upper part of said nozzle are provided with a similarly formed section, which is to be brought into fittingly engagement. Accordingly, there is no play between the receiving means and the upper edge of the nozzle in all three dimensional directions. Preferred embodiments of the invention are laid down in further dependent claims. Hereinafter, the present invention is illustrated and explained in greater detail by means of preferred embodiments in conjunction with accompanying drawings, wherein: Figure 1 is a schematic plan view of a mounting apparatus including a mounting head unit and a component supply unit according to the invention, Figure 2 is a schematic front elevational view showing the mounting apparatus according to figure 1, Figure 3 shows an enlarged view of the mounting head unit according to figure 1, Figure 4 is a block diagram showing the control system of the apparatus according to figure 1, Figure 5 is a schematic perspective view of a cylindrical part picked up by the pickup nozzle according to figure 1, Figure 6 is a flow chart showing first and second embodiments of a recognition method of the apparatus according to figure 1, Figure 7 is a schematic plan view of the detection area and a part in different positions which illustrates the first embodiment of a method according to figure 6, Figure 8 is a schematic plan view of the detection area and the part in different rotated positions illustrating the second embodiment of the method according to figure 6, Figure 9 is a flow chart showing a third embodiment of a recognition method according to figure 1, Figure 10 is a schematic plan view of the detection area including a part at a maximum position and including a schematic side view of a light receiving section and a graph illustrating the positional displacement of the part according to figure 9, Figure 11 shows a schematic side view of a nozzle and a part within the detection area according to figure 1, Figure 12a shows a schematic perspective view of a nozzle holder of a nozzle head unit according to figure 1, Figure 12b shows a schematic perspective view of a detachable nozzle to be received in the nozzle holder of figure 12a, and Figure 13 shows a schematic front elevational view of a pickup nozzle inserted into the nozzle holder of figure 12a. FIGs. 1 and 2 show an entire structure of a surface mounter according to an embodiment of this invention. Referring to these drawings, a conveyor (2) for conveying a printed circuit board (3) is arranged on a base (1) of a surface mounter so that the printed circuit board (3) is conveyed on the conveyor (2) and stopped at a specified mounting work position. On both sides of the conveyor (2) are arranged parts supply sections (4). The parts supply section (4) is provided with parts feeders such as multiple row tape feeders (4a). A head unit (5) for mounting parts is provided above the base (1). The head unit (5) is made to be capable of moving between the parts supply section (4) and the parts mounting section where the printed circuit board (3) is placed. In this embodiment, the movement is possible in directions of X axis (the direction of the conveyor 2) and Y axis (the direction normal to the X axis in a horizontal plane). In other words, on the base (1) are arranged stationary rails (7) in the direction of Y axis, and a ball screw shaft (8) driven for rotation by a Y axis servomotor (9). A head unit support member (11) is arranged on the stationary rails (7). A nut (12) provided on the stationary rail (7) engages with the ball screw shaft (8). An X direction guide member (13) and a ball screw shaft (14) driven by an X axis servomotor (15) are arranged on the support member (11). A head unit (5) is movably supported by the guide member (13). A nut (not shown) provided on the head unit (5) engages with the ball screw shaft (14). The support member (11) is moved by the Y axis servomotor (9) in the Y axis direction. The head unit (5) is moved by the X axis servomotor (15) in the X axis direction relative to the support member (11). The Y axis servomotor (9) and the X axis servomotor (15) are respectively provided with position detection means (10) and (16) respectively comprising an encoder and others. As shown in FIG. 3, the head unit (5) is provided with a pickup nozzle (21) for picking up an electronic part (20) and for movements in directions of both Z axis (vertical) and rotation about an R axis (nozzle center axis), and with a Z axis servomotor (22) (vertical drive means) and an R axis servomotor (24) for the nozzle member (21). The Z axis servomotor (22) and the R axis servomotor (24) are respectively provided with position detection means (23) and (25) respectively comprising an encoder and others. At the lower part of the head unit (5) is provided a laser unit (27) constituting optical detection means. As shown in FIG. 3, the laser unit (27) comprises a laser beam generating section (parallel light beam emitting section) (28) and a light receiving section (29) located to face each other on both sides of a space where the pickup nozzle (21) is located. When the laser beam emitted from the laser beam generating section (28) is received by the light receiving section (29) and the part (20) picked up by the pickup nozzle (21) is at a specified recognition height, part of the laser beam is intercepted by the part (20), and the projection of the part (20) is detected. FIG. 4 shows an embodiment of a control system. In the figure, the mounter is provided with a main controller (30) comprising a shaft controller (driver) (31), input-output means (32), and a main operation section (33). The servomotors (9, 15, 22, and 24) respectively of the Y axis, X axis, Z axis, and R axis, and position detection means (10, 16, 23, and 25) provided respectively on those servomotors are connected to the shaft controller (31) which controls the drive of the servomotors (9, 15, 22, and 24). The laser unit (27) is electrically connected to a laser unit operation section (34) provided in the head unit (5). The laser unit operation section (34) is connected through the input-output means (32) to the main operation section (33). An embodiment of the part recognition method used in the mounting work using such a mounter will be described in reference to the operation diagram of FIG. 7 and using the flow chart of FIG. 6. The part (20) as an object of the method of this invention is of a low height cylindrical shape as shown in FIG. 5, and does not have polarity (rotary angle of the part is not restricted when it is mounted). One of such parts is a pad (a part like a base) for supporting an electric part. The cylindrical part (20) is picked up by the pickup nozzle (21). The flow chart of FIG. 6 shows a process of a series of mounting steps from picking up the part and mounting it, and steps other than those for recognition characteristic of this invention are shown roughly. When the mounting process of this flow chart is started, the head unit (5) lowers to the parts supply section (4) and at the same time the pickup nozzle (21) lowers and picks up the cylindrical part (20) from the parts supply section (4) (step S1). After picking up the part, the pickup nozzle (21) rises to a specified recognition height corresponding to the laser unit (27) (step S2) and recognition is performed using the laser unit (27). In this recognition process, first the pickup nozzle (21) is set to a first rotary angle  1 and under this state projection (shadow) of the cylindrical part (20) is detected by-the laser unit (27), and a part projection center position C 1 and a part projection width W 1 are detected (step S3). Here the first rotary angle  1 may be arbitrary, for example the same with the angle at which the part is picked up (without rotating the pickup nozzle 21 after picking up the part). Next, the pickup nozzle (21) is set to a second rotary angle  2 by rotating 90 degrees from the first rotary angle  1 (steps S4 and S5). Under this state, a part projection center position C 2 and a part projection width W 2 are detected in a similar process to that of the step S3 (step S6). When the detections of projections at the first and second rotary angles  1 and  2 are over, the part is determined if it is picked up correctly (step S7). Here, if the part is picked up correctly, the part projection width W 1 is equal to the part projection width W 2 and corresponds to the diameter of the cylindrical part. Based on comparison of the part projection widths W 1 and W 2 with diameter data of the part, it is determined if the part is picked up correctly and, if not, the part is discarded (step S8). If the part is picked up correctly, a mounting position correction amounts of Xc in the X direction and Yc in the Y direction are obtained from the part projection center positions C 1 and C 2 at the first and second rotary angles  1 and  2 , and at the same time a rotary angle c of the pickup nozzle (21) when the part is picked up is determined (step S9). How to obtain the correction amount will be described below in reference to FIG. 7. If it is assumed that the part (20) is in the position I in the figure when the pickup nozzle (21) is at the first rotary angle  1 , the part (20) is in the position II at the second rotary angle  2 as rotated by 90 degrees from the first position I about the nozzle center O. If a point on the light receiving section (29) corresponding to the center O of the pickup nozzle (21) is assumed as C 0 (C 0 will be hereinafter referred to as "the quasi nozzle center"), the distance between the part projection center position C 1 and the quasi nozzle center C 0 when the part (20) is in the position I is assumed as a 1 , and the distance between the part projection center position C 2 and the quasi nozzle center C 0 when the part (20) is in the position II is assumed as a 2 , the distances a 1 and a 2 correspond to amounts of deviation of the part center C from the nozzle center O in the Y and X directions respectively when the pickup nozzle (21) is at the first rotary angle  1 . Therefore in the step S9, it is determined that the correction amount Xc in the X direction is a 2 , and that Yc in the Y direction is a 2 . Next the head unit (5) is moved to a position added with the correction amount (step S10), the rotary angle of the pickup nozzle (21) is adjusted, the pickup nozzle (21) lowered to the printed circuit board, and the part is mounted on the printed circuit board. According to this method, even if the part (20) is picked up with a deviation, the correction amounts for the mounting position are determined according to the detection of the part projection using the laser unit (27). The part (20) is mounted by the pickup nozzle (21) accurately in the correct position corrected with the correction amounts on the printed circuit board. When the cylindrical part (20) is handled in particular, the part projection center position C 1 with the pickup nozzle (21) at the first rotary angle  1 and the part projection center position C 2 with the pickup nozzle (21) at the first rotary angle  2 are measured, deviation in the part pickup position is checked from the measured data, and the correction amounts for the mounting position are determined easily and accurately. In the example above, while the rotary angle of the pickup nozzle (21) at the time of mounting the part is assumed as  1 , the distance a 1 shown in FIG. 7 as the Y direction correction amount, and the distance a 2 as the X direction correction amount, it may also be assumed that the rotary angle of the pickup nozzle (21) at the time of mounting the part as  2 , the distance a 1 as the X direction correction amount, and the distance a 2 as the Y direction correction amount. In the above example, the angle between the first rotary angle  1 and the second rotary angle  2 is set to 90 degrees. However, even if the angle is set to a value other than 90 degrees, the mounting position correction amount can be obtained. This will be described in reference to FIG. 8. With the pickup nozzle (21) at the first rotary angle  1 , it is assumed that the tilt angle of a line stretched between the nozzle center O and the part center C with respect to the X direction as a, the distance between the nozzle center O and the part center C or C' (part deviation amount) as d, and the distances between the part projection center position and the quasi nozzle center position as a 1 and a 2 at the first and second rotary angles  1 and  2 respectively. Then, the following equations hold: (Equation 1) a 1 = d·sin γ 1 a 2 = d·sin(γ + a) = d·sin γ·cos a + d·cos γ·sin a 2 The correction amounts Xc and Yc in the X and Y directions are Xc = d·cos γ and Yc = d·sin γ. From the equations 1 ○ and 2 ○ above, these correction amounts are determined as follows: (Equation 2) Xc = (a 2 - a 1 ·cos a)/sin a Yc = a 1 Therefore, the mounting position correction amounts can be determined from the preset angle a and the distances a 1 and a 2 if the preset angle a is any multiple of 0 and 180 degrees. However, if the angle is set to 90 degrees as shown in FIGs. 6 and 7, the mounting position correction amounts can be determined most easily. Another embodiment of the part recognition method will be described according to the flow chart of FIG. 9 in reference to FIG. 10 for explaining the function. When the mounting process of this flow chart is started, the part is picked up (step S21), after the part is picked up, the pick up nozzle (21) is raised to a specified recognition height (step S22), and the recognition process is carried out using the laser unit (27). This recognition process is as follows: While the pickup nozzle (21) is being rotated, the part projection position, projection width, and rotary angle are detected at every small rotary angle. This detection is repeated until the pickup nozzle is rotated up to a specified angle e (for example 180 degrees). This provides, as will be described in detail later, data of relationship between the nozzle rotary angles and the part projection positions. When the pickup nozzle is rotated up to a specified angle e, displacement amount (a) of the part projection position and rotary angle (a) when the displacement amount (a) becomes the maximum or the minimum are determined according to the data collected up to that time (step S25). Next, the part is checked if it is picked up correctly by comparing the projection width with the part diameter known from the parts data (step S26). If not correct, the part is discarded (step S27). If the part is picked up correctly, the correction amounts Xc and Yc in the X and Y directions are determined from the displacement amount (a) and the rotary angle (α) determined in the step S25. At the same time, the rotary angle c of the pickup nozzle at the time of picking up the part is determined (step S28). How to determine the correction amounts in the steps S23 through S25 and ensuing step S28 will be specifically described in reference to FIG. 10. When the pickup nozzle (21) is rotated at the time of the part recognition after the part is picked up, the cylindrical part (20) picked up by the pickup nozzle (21) rotates about the nozzle center O as shown with an arrow in FIG. 10. If the part center C is displaced from the nozzle center O, the part projection width W does not change but the part projection position (part position in the Y direction) changes according to the rotation of the pickup nozzle (21). The change in the position with respect to the nozzle rotation angle depicts a sine curve as shown in the same figure. When the part projection position becomes the maximum (at the position A in the figure) or becomes the minimum (at the position B in the figure), the part center C is displaced in the Y direction with respect to the nozzle center 0. The displacement amount (a) of the part projection center position with respect to the quasi nozzle center C 0 at this time corresponds to the deviation amount of the pickup position. Therefore in the above step S28, the nozzle rotation angle (α) when the part projection position becomes the maximum (or minimum) is determined as the nozzle rotation angle c at the time of mounting the part, and the correction amounts Xc and Yc in the X and Y directions are determined as 0 and (a), respectively. Next, the head unit (5) is moved to a position added with the correction amount (step S29), the rotation angle of the pickup nozzle (21) is adjusted, the pickup nozzle (21) is lowered to the printed circuit board, and the part is mounted. Also by this method as an embodiment, the correction amount for the part mounting position can be determined simply and accurately according to the detection of the part projection using the laser unit (27). In particular, the deviation of the part pickup position is checked by the displacement amount (a) when the displacement amount of the part projection position becomes the maximum (or minimum) and the correction amount for the mounting position is determined simply and accurately. According to the steps S23 and S24 of the flow chart of FIG. 9 of this embodiment, the pickup nozzle (21) is rotated by a specified angle e (180 degrees). However, the pickup nozzle may be rotated by an angle at which the maximum or minimum displacement amount of the part projection position is found. The specific structure of the mounter to which the method of this invention is applied is not limited to the one shown in the drawings but any structure may be used as long as the head unit (5) is provided with a pickup nozzle (21) capable of vertical and rotary movements, and with driving means for driving the nozzle, as well as a laser unit (27). Also, the specific structure of the pickup nozzle (21) can be made in various ways. Specific examples which are advantageous for improving accuracy in parts recognition and mounting will be described below. The pickup nozzle (21) is usually made of metal such as stainless steel. However, a pickup nozzle having high metallic gloss or brightness may produce random reflection of the light beam irradiated from the laser generating section (28) on the nozzle surface at the time of the part recognition using the laser unit (27), and the reflected light beam might cause adverse effect on the part detection. Therefore, it is preferable for improving accuracy of the projection detection by the laser unit (27) by preventing random reflection on the nozzle surface, to finish the nozzle (21) surface with matted paint or form the nozzle (21) with black resin. The pickup nozzle (21) is detachably attached to the nozzle shaft so that the nozzle system may be replaced with different ones according to the kinds of parts to be picked up. In particular, if the pickup nozzle (21) and the nozzle holder (45) for attaching the nozzle (21) are formed as shown in FIGs. 12(a), 12(b), and 13, the pickup nozzle (21) is attached firmly without play, while permitting the pickup nozzle (21) to be detachable. In other words, in these drawings, in the upper part of the pickup nozzle (21) is provided an oblong square column portion (41) provided at its middle height on one side with a groove (42) of a triangular cross section. A nozzle hole (43) is made through from the top of the square column (41) to the bottom end of the nozzle. On the other hand, the nozzle holder (45) to be attached and fixed to the lower end of the nozzle shaft is provided with a bidirectional plate (46) facing two adjoining sides of four sides of the square column portion (41), and with two plate springs (47) facing other two sides of the square column portion (41). The lower end portion of each plate spring (47) is formed with an engagement portion (47a) of a triangular cross section projecting inward. The upper ends of the plate (46) and the plate springs (47) are secured to an upper block (49) of the nozzle holder (45). The upper block (49) is formed with a center through hole, and a cylindrical extension (48) to be fit into the nozzle hole (43) in the pickup nozzle (21). According to this structure, the square column portion (41) of the pickup nozzle (21) is fit from under into the nozzle holder (45), and as shown in FIG. 13, the two sides of the square column portion (41) come into contact with the inner surfaces of the plates (46) of the nozzle holder (45). At the same time, the engagement portions (47a) of the plate springs (47) engage with the grooves (42) on the other two sides of the square column portion (41). Thus, the pickup nozzle (21) is held on the nozzle holder (45). Under that state, as the square column portion (41) of the pickup nozzle (21) is pressed against the plates (46) by the plate springs (47), play in the X and Y directions is prevented and at the same time play in the rotary direction is also prevented as the square column portion (41) comes into surface contact with the bidirectional plate (46). Furthermore, play in the vertical directions is also prevented as the engagement portion (47a) of the plate spring (47) comes in press contact with the slope portion of the groove (42) so as to push up the square column portion (41) and presses it against the upper block (49). Therefore, the pickup, recognition, and mounting of the part are made without causing play in the pickup nozzle (21), and stability and accuracy in those actions are assured. Furthermore, since the projection (48) is inserted into the nozzle hole (43) in the pickup nozzle (21), vacuum pressure applied to the pickup nozzle (21) is prevented from leaking. As described above, the part recognizing method makes it possible to obtain the mounting position correction amount according to detection of the part projection using the optical detection means comprising a parallel light beam irradiating section and the light receiving section after the part is picked up. In particular, the mounting position correction amount is effectively obtained when the cylindrical part is the subject. As described above, the part projection center positions are measured with the pickup nozzle which has picked up the part at the first rotary angle and at the second rotary angle as rotated by a preset angle from the first rotary angle, and the part mounting position correction amount is determined from the distance between the part projection center position and the quasi nozzle center position at each of the rotary angles. As a result, when the cylindrical part is the subject, the mounting position correction amount commensurate with the deviation in the pickup position is determined easily and accurately. In particular, when the second rotary angle is set to the one as rotated by 90 degrees from the first rotary angle, the mounting position correction amounts in the two perpendicularly intersecting directions can be determined easily and accurately. Alternatively, the part projection position is measured while the pickup nozzle which has picked up the part is being rotated, the displacement amount is determined when the displacement amount of the part projection position becomes the maximum or minimum, and from the results the mounting position correction amount is determined. As a result, the mounting position correction amount is determined commensurate with the deviation in the picked up position easily and accurately when the cylindrical part is the subject.

Claims: Method of mounting a part (20) at a specific position, in particular mounting an electronic part or an auxiliary part as for supporting the electronic part onto a substrate such as a printed circuit board (3), comprising the steps of picking up the part (20) by an attracting nozzle (21), transferring the part (20) and placing same within a detection area of an optical detection means (28,29), said optical detection means emits parallel light beams for detecting projected width data of the part (20), subjecting the part (20) to a recognition process, wherein said projected width data are obtained under rotation of the part (20), and mounting the part (20) at the desired position, said part is formed as a cylindrical part (20) having its central axis parallel or identical to an axis of said nozzle (21) and perpendicular to a plane which is defined by the detection area, comprising the steps of determining a first projected position of said part (20) attracted by said nozzle (21) within said detection area, by detecting a first central position (C 1 ) of the first projection of said part (20) within said detection area, rotating said part (20) by a predetermined rotary angle ( 2 , a ) from said first position to a second position within said detection area and determining said second projected position by detecting a second central position (C 2 ) of the second projection of said part (20) within said detection area and calculating a correction amount (Xc), which extends in line with the parallel light beams by the equation: Xc = (a 2 - a 1 cos a)/sin a, and a correction amount Yc, which extends perpendicular to Xc and within said detection area by the equation: Yc = a 1 , wherein a 1 and a2 are defined by the distances between the detected central positions (C 1 ,C 2 ) of the projections of the part (20) and the projected position corresponding to the nozzle center (0) in a direction, which is in line with Yc, and wherein the angle a corresponds to said predetermined rotary angle ( 2 , a ). Method according to claim 1, characterized in that said part (20) is placed with a first rotary angle ( 1 ;γ) in its first projected position, said first rotary angle ( 1 ;γ) being set arbitrary. Method according to claim 1 or 2, characterized in that said central positions (C 1 ,C 2 ) of the projections of the part (20) are detected by measuring regions of part projections and determining said central positions (C 1 ,C 2 ) of said regions. Method according to at least one of the preceding claims 1 to 3, characterized in that at said first and second projected positions of said part (20), respectively, first and second part projection widths (W 1 ,W 2 ) are also detected. Method according to claim 4, characterized in that after detection of projected widths (W 1 ,W 2 ) is finished, it is determined whether the part (20) is picked up correctly, whereas the first part projection width (W 1 ), the second part projection width (W2) and the diameter of said cylindrical part (20) are equal if the part (20) is picked up correctly, and whereas the part (20) is discarded if the part (20) is not picked up correctly. Method according to at least one of the preceding claims 1 to 5, characterized in that after it is determined that the part (20) is picked up correctly, mounting position correction amounts (Xc,Yc,c) are determined from distances between said detected central positions (C 1 ,C 2 ) and a position (C0) corresponding to the nozzle center (O) at both of said rotary angles ( 1 , 2 ;γ, a ) and wherein a correction amount for the rotary angle of the pick up nozzle (21) around a vertical nozzle axis is determined when the part (20) is picked up. Method according to at least one of the preceding claims 1 to 6, characterized in that said predetermined rotary angle ( 2 ; a ) is set to an arbitrary angle. Method according to at least one of claims 1 to 7, characterized in that said predetermined rotary angle ( 2 ) is set to 90°. Method according to claim 8, characterized in that said two distances (a 1 ,a 2 ) between the part projection center positions (C 1 ,C 2 ) and said position of the nozzle center (0) at both rotary angles ( 1 , 2 ;γ, a ) correspond to the mounting position correction amounts (X c ,Y c ), respectively, in two directions perpendicular to each other. Method according to claim 8 or 9, characterized in that said first or said predetermined rotary angle corresponds to a corrected rotary angle for the mounting position. Method according to at least one of claims 1 to 5, characterized in that said part (20) being subject to the light beams is rotated via said nozzle (21) around an axis (R-axis) substantially perpendicular to the light beams, and during rotation said projected position, said projection width and said rotary angle (8) are repeatedly detected. Method according to claim 11, characterized in that said detection is repeated at every small rotary angle until the part (20) is rotated up to a specified angle (e), which is preferably equal to 180°. Method according to one of claims 11 or 12, characterized by determining a maximum or minimum displacement distance (a) between said projected position of said part (20) and a projected position corresponding to the nozzle center (0), said displacement distance (a) reaches said maximum or said minimum when a connecting line from a part center (C) to the nozzle center (0) extends substantially perpendicular to the parallel light beams and within said detection area. Method according to claim 13, characterized in that said projected positions of said part (20) are determined by detecting central positions of the projections of the parts (20), and in that said maximum or minimum displacement distance corresponds to the correction amount (a) for a mounting position and a rotary angle, to which said part (20) is moved from said first projected position of said part (20) to said projected position having maximum or minimum displacement distance, corresponds to a corrected rotary angle (c) for the mounting position. Apparatus for mounting a part (20) at a specific position, particularly mounting an electronic part or an auxiliary part as for supporting the electronic part onto a substrate such as a printed circuit board (3), comprising a movable mounting head unit (5) having at least one attracting nozzle (21) for picking up at least one part (20) from a part supply unit (4), an optical detecting means (28,29) emitting parallel light beams in a detection area for detecting a projected width data of the part (20), a control unit for controlling the movement of the nozzle (21) in response to said projected width data, said part (20) is formed as a cylindrical part having its central axis parallel to or identical to an axis of said nozzle (21) and perpendicular to a plane which is defined by said detection area, in particular for performing the method of claim 1, wherein a calculating section is provided for determining a first projected position of said part (20) attracted by said nozzle (21) within said detection area by detecting a first central position (C 1 ) of the first projection of said part (20) within said detection area, said control unit rotating said part (20) by a predetermined rotary angle ( 2 , a ) from said first position to a second position within said detection area, said calculating section determines said second projected position by detecting a second central position (C 2 ) of the second projection of said part (20) within said detection area, and wherein the calculating section is adopted to calculate a correction amount (Xc), which extends in line with the parallel light beams by the equation: Xc = (a 2 - a 1 cos a)/sin a, and a correction amount Yc, which extends perpendicular to Xc and within said detection area by the equation: Yc = a 1 , wherein a 1 and a 2 are defined by the distances between the detected central positions (C 1 ,C 2 ) of the projections of the part (20) and the projected position corresponding to the nozzle center (0) in a direction, which is in line with Yc, and wherein the angle a corresponds to said predetermined rotary angle ( 2 , a ). Apparatus according to claim 15, characterized in that at least a surface of the nozzle (21) is painted with a matted and/or a dark colour or in that said nozzle (21) is formed with black resin. Apparatus according to claim 15 or 16, characterized in that an upper part of the nozzle (21) is provided with a connecting means, which allows the nozzle (21) to be detachabley inserted into a receiving means of a nozzle holder (45), so that said nozzle (21) is attached into said receiving means substantially without play. Apparatus according to claim 17, characterized in that said receiving means comprises two plates (46), which are disposed relatively to each other bi-directional, and which allow to bring the upper part of the nozzle (21) into abutting contact with the plates (46), and in that spring means are provided for pressing the upper part of the nozzle (21) against the bi-directional plates (46). Apparatus according to claim 18, characterized in that said upper part of said nozzle (21) is provided with an oblong square column portion (41), which has formed at substantially its middle height a groove (42) of a triangular cross-section, and in that said nozzle is provided with a nozzle hole (43) which extends from the top of the square column (41) to the bottom end of the nozzle (21). Apparatus according to claim 18, characterized in that said bi-directional plates (46) of said nozzle holder (45) are disposed relatively to the upper part of the nozzle (21) such that two adjoining sides of four sides of the square column portion (41) are facing two bi-directional plates (46) and in that said spring means are formed as two-plate springs (47) facing the other two adjoining sides of the square column portion (41). Apparatus according to claim 20, characterized in that each of said plate springs (47) is formed at its lower end portion with an engagement portion (47a) of a triangular cross-section, which projects inward and which fits into the grooves (42) of the nozzle (21) in an inserted status of the nozzle (21).

Inventors: HASHIMOTO KAZUHISA, HASHIMOTO, KAZUHISA, HASHIMOTO, KAZUHISA C/O YAMAHA HATSUDOKI K.K.
Applicants: YAMAHA MOTOR CO LTD, YAMAHA HATSUDOKI KABUSHIKI KAISHA
Application year: 1995
Main classification: H05K13
IPC codes: H05K13