A RADIATION DETECTION SYSTEM AND PROCESSES FOR PREPARING THE SAME

Abstract: The invention provides a radiation detection system, comprising a continuous film of a wide band gap semiconductor, radiation-detecting, polycrystalline material formed from a multiplicity of crystalline grains, wherein the grains are sintered together to form a single, coherent, continuous film.

Description: A RADIATION DETECTION SYSTEM AND PROCESSES FOR PREPARING THE SAKE The present invention relates to a radiation detection system containing a continuous film of a vide band gap semiconductor, radiation-detecting, polycrystalline material and processes for the preparation of said continuous film for use therein, as well as to an image receptor for an imaging system, comprising a thin, continuous film of a wide band gap, semiconductor radiation-detecting material. Mercuric iodide (Hgl_) , cadmium tβll ridβ (CdTe) , cadmium zinc telluride (CdZnTe) , and lead iodide (Pbl,) single crystals are well-known, wide band gap semiconductor X-ray and gamma radiation detectors which oparate at room temperature. The problem is that the production of high quality, single crystals is very expensive; wherever it is necessary to cover large areas with relatively small area crystals, it is necessary to arrange them ir. the form of mosaics, which in turn increases the cost of the detection system. The cost of crystal growth of both high melting point crystals, such as CdTe and CdZnTe (see Table l hereinbelσw) , and of low melting point crystals such as Pbl. is high. Therefore, only crystals of a very small size {••=10 mm ) and thickness (~100 μm) have been produced, which decreases the possibility of using them in motaics for very large-area detection systems. The state of the art of Pbl, single crystal technology in 1995 is such that until the present timu, these very small crystals have been fabricated only into low energy detectors. The semiconductor having the lowest melting point, Hgl,- has an additional problem: Hgl- single crystals are produced from the vapor phase, and growth of large crystals, from which 5 x 5 cm detector plates can be sliced, may require a duration of approximately 3 months for the growth process. In addition, the sawing and polishing operation involves a 60% loβa of material. All of the above-mentioned factors contribute to the high cost of these crystals and the detectors fabricated therefrom. The present invention provides for the production of large, textured plates of any desired size end thickness, produced from different polycrystalline semiconductors, as will be described and exemplified further below. The present invention also enables the fabrication of polycrystalline, continuous films for radiation detection systems. The term "continuous films" as used herein is intended to denote that no short circuits between upper and lower electrodes are possible. More particularly, the present inventicn provides a radiation detection system, comprising a continuous film of a wide band gap semiconductor, radiation-detecting, polycrystalline material formed from a multiplicity of crystalline grains, wherein said grains are sintered together to form a single, coherent, continuous film. In preferred embodiments of the present invention, said continuous film is selected from the group consisting of mercuric iodide, cadmium telluride, cadmium zinc telluride, and lead iodide films. Thus, according to the present invention, there are provided large-area, coherent, continuous semiconductor films, preferably having an area of between 10 2cm2 and 10 4cm2, and a thickness of between about 1-500 μ , which can be partially or fully textured (50-100%) , with grain size from 1 μm to 5 mm. The present invention also provides processes for the preparation of these films. More speci ically, the present invention provides a process for the preparation of a continuous film of a wide gap semiconductor, radiation- detecting, polycrystalline material, comprising (a) preparing grains of polycrystalline powder aturial having a purity of at least 99.9999 (6N) %; (b) depositing said granular material on a conductive substrεte; and (c) sintering said grains of polycrystalline material together, to form a single, coherent, continuous film. In preferred embodiments of said process, said purified grains of polycrystalline powder material ar prepared by evaporation in a vacuum medium at a temperature of about 100-300 β C, by sequential repeated evaporation. In a first embodiment of the process of the present invention, an upper plate of a conductive metal is placed on top of said powder, and the resulting assembly is compressed at a temperature of about 100-220°c, and at a pressure of about 100-5,000 Kg/cm 2 . In a second embodiment of the process of the present invention, said granular material from step (a) is mixed with an organic binder in a solvent, and then deposited on said substrate, followed by annealing at a temperature of about 60-120"C. While this deposition embodiment may be carried out by painting, spraying, or printing on the substrate, in especially preferred embodiments it is carried out by mask printing. In yet a third preferred embodiment of ^he process of the present invention, sa d purified, granular material from step (a) is placed in a heated area of a vacuum chamber at a temperature of about 90-220°C, and said conductive substrate is placed in an N_ cooled area of said vacuum chamber, whereby said purified granular material is sublimed and deposited on said substrate, and said melding is carried out by heating and annealing at a temperature of about 50-100 β C in the presence of N~. The films produced by the processes o~ the present invention can be used in various radiation detection systems, such as in energy-dispersive X-ray and gamma ray imaging systems based on semiconductor film defectors. While the above-de ined processes will b.i specifically exemplified hereinafter, it is believed that a brief, general description of preferred embodiments of the various steps of variations of the presently-claimed process (which variations will be referred to hereinafter aε "hot pressing," "slurry deposition," and "vapor phase deposition") will better serve to elucidate th<j invention. 1. Hot Pressing The process is composed of the following steps: a) Purification of the starting materials by sublimation four times at 100-200*0, in a glass ampoule and under continuous pumping by a vacuum pump; melting for from 1 hour to 3 days at 250-300 e C, and closed ampoule sublimation. b) Choosing a substrate, which is introduced into the bottom section of the mold. The substrate may be glass, polycrystalline Alumina, or Teflon, and must be precontacted with metal electrodes, preferably in the form of photo¬ lithographic deposition of fine strips. Alternatively, the substrate plate could serve as a bottom electrode if it is a metal such as gold, palladium, silicon or germanium. c) The purified powder is introduced on top of the substrate of step (b) . d) An upper plate of palladium or gold is placed on top of the powder, in order to prevent reaction with the upper pressing punch of the steel mold. e) The assembly is compressed, the temperature is increased to about 100-220 β C, and maintained for a minimum _ of 4 hours during pressure of 100-5,000 Kg/cm . f) After completion, the Hgl 2 plate is removed from the mold. The upper palladium or gold can serve as electrode; however, it is preferably removed, and another electrode is deposited, in the form of strips or a continuous film of palladium, gold, carbon, germanium, etc. 2. Slurry Deposition The process consists of the following steps: a) As in step (a) of the hot pressing process. b) As in step (b) of the hot pressing process. c) The purified powders are mixed wi~h an organic binder in a solvent, and deposited by painting, spraying, or printing on the substrate with bottom electrode. d) The plate is heated to 60-l20 β c, and removed. e) As in step (f) of the hot pressing process. 3. Vapor Phase Deposition The process consists of the following steps: a) As in step (a) of the hot pressing process. b) Purified Hgl, is placed in the hottar space of a vacuum chamber, at 90-220 β C. c) The substrate and lower electrode, as in step (b) of the hot pressing process, is placed in the LN -cooled end of the vacuum chamber. d) Hgl 2 is sublimed and deposited on tht substrate. e) A thermal heating and annealing tc 50-100'C for 30-60) miinn.. iiss ddoonnee,, aafftteerr aaddddiinngg N. to the process to avoid re-evaporation of the Hgl_ phase. f) The plate is removed. An upper electrode is deposited, as in step (f) of the hot pressing process. The resulting detector plates, which can have any desired size and thickness, are covered by εn upper metal electrode and can act as X-ray and nuclear radiation counters, in the energy range from 6-660 . The large- sized plates are particularly suited to be integrated into a large X-ray camera system, in which the analog photoelectric radiation signals can be countered to digital signals and used in a computerized, controlled imaging system which can store the necessary imaging information and be used, e.g., as a replacement for X-ray films in medic&J and dental applications, or in other imaging system applications. Thus, the present invention provides low-cost, large-area detectors which allow applications which were, until now, prohibitively expensive. As is known, room temperature operating, }'.-ray or gamma ray radiation semiconductor detectors require a wide band gap. Table 1 below lists most known semiconductor detectors used today for this purpose [M. Schieber, et al., in: "Semiconductors for Room Temperature Radiation Detector Applications," R.B. James, T.Σ. Schlesinger, P. Siffert, and E. Franks, Eds., Materials Research Soc. Svmoos. Proc. Vol. 302, p. 189 (1993)]. In order to be operable at room temperature, the material requires a band gap, e.g., larger than βι.5 e , in order to overcome thermal eluctronic noise. In order to have good stopping power and absorption of the radiation energy, and in order to be able tσ efficiently transport the electrical charge carriers pioduced by the radiation, it requires a high atomic Z number. The detector is required to have a large drift length λ. which is the product of the charge carriers' mobility-. , lifetime i and electric field, ε , wherein >. = uτe . The electric field depends on the electrical resistance: the larger the resistance, the larger the field which can transport the electrical charges. From studying the semiconductor materials listed below in Table 1, it can be seen that the small band gap of the best-known semiconductor detectors si(Li) and HPGe causes a need for cryogenic cooling and prevents room temperature operation, despite the excellent drift length. In addition, one can see that due to the low Z, one needs a much larger thickness of si(Li) and HPGe in order to stop the radiation flux, as compared to all other detector materials except GaAs. TABLE 1 Solid βtate semiconductor x-ray and Gamma Ray Detectors Among the large band gap materials, Hgl and Pbl_ [J. Zhahg, et al. Mucl. Tngtr. and Meth.. Vol. A322, p. 499 (1992)] have the largest atomic number and hence the best absorption capability, as can be seen in Table l. Another technological consideration is the temperature at which the material is produced. The lower melting point simplifies and lowers tne cost of production of Hgl, and Pbl, detectors, relative to the other semiconductors listed in Table 1. Nevertheless, as mentioned above, the cost of single crystal production of Hgl is very high since these crystals must be grown only from the vapor phase [M. Schieber, et al. , J. Crvs . Growth. Vol. 65, p. 353 (1983)], which takes approximately 3 months for larger crystals. Pbl, crystals can be used only for very small detector crystals having an are? of several mm and a very small thickness [V.H. Gerrish, in: Seniconductors for Roo Temperature Radiation De-ector Appliςations. .B. James, T.E. Schlesinger, F. Siffert, and E. Franks, Eds., Materials PCMJS95/12222 - 10 - Research Soc. Svπroos. Proc. Vol. 302, p. 189 (1993)], which do not absorb much radiation. The present invention is based on the replacement of high-cost, single crystal radiation detectors vhich act as spectrometers and can identify the energy oi the incident radiation, with low-cost detectors produced from polycrystalline films having the same large band gaps as the single crystals of the same materials. The replacement is pertinent for applications in which the radiation flux has to be measured without identi ication of the energy, since either the energy is known, or the knowledge is not significant. Such detectors are called radiation counters, since they count the radiation events. Counters are fabricated from lower quality, single crystals, which are produced in the same, very expensive fabrication process as the higher quality spectrometers. In applications in which large-area detection systems are required, such as for imaging purposes, large single crystals of, e.g., Hgl,, of a size of about 50 x 50 mm, have to be sliced and polished, causing a loss of about 60% of the total volume of the crystal. The slices are then placed side-by-side in a large mosaic, until the desired size of the detecting system is reached, such an imaging system is very expensive, due to the long time required to produce and slice the crystals and then to mosaic them into a large-area detection system. In an especially preferred embodiment of the present invention, there is provided an energy dispersive x-ray and gamma ray imaging system, based on semiconductor thin film detectors. X-ray imaging is applied in medical diagnostic systems such as those used in x-ray radiography, x-ray computed topography (CT) , Bingle photon emission computed topography (SPECT) , and position emission topography (PET) . In addition, x-ray imaging systems are also used in astronomy and astrophysics for mapping x-ray fields, solar flare imaging, x-ray sky surveys, and surveys of various galactic regions from satellite-borne instruments. Many types of image receptors are used for modern x-ray imaging systems. These include direct-exposure x-ray films, image plates, image intensi iers, gas field ionization chambers, scintillation detector systems, high purity germanium, and Si(Li) systems. The absorption efficiency, energy resolution and cooling requirements are shown in Table 1 below, and all image receptors shov good spatial resolution. The image receptors shown in Table 2 are two-dimensional (2D), such as x-ray films, image plates and image intensifiers, and bulk detectors such as gas ionization counters, scintillators and semiconductor or radiation detectors [Si(Li)J, Hgl 2 , CdTe and CdZnTe. TABLE ? Absorption Efficiency. Energy Resolution and Coolinα ReσuirementB for Rav-imagin-r D-ivift-t. The absorption efficiency depends strongly on the atomic number Z, which is higner for Hgl, than for all other solid state detectors listed in Table 1. The energy resolution is best for semiconductor detectors which directly convert the x-ray photons into electric charges, contrary to scintillators which convert the x-ray photons into visible light which is afterwards converted electronically with diodes or photomultipliers into electrical charges. Cryogenic cooling is required for semiconductor detectors which have a smaller energy band gap Eg, such as high purity Ge (HPGe) with Eα^O.SeV and Li drifted Si [Si(Li)] with Egm.lev. H l 2 , CdTe and CdZnTe have an £3 of 2.2, 1.45 and 1.50 eV respectively, which are large enough to allow room temperature operation without cryogenic cooling. Prom the various image receptors shown in Table 2, it is obvious that the high Z and high Eg semiconductor radiation detectors combine the optimal properties required for x-ray imaging applications. The only literature reported so far for imaging applications is in the field of gamma ray camera using bulk detectors of Hgl- , using 8 by 8 pixels [C. Ortale, et al. , Nucl. Inst. and Methods. Vol. 213, p. 95 (1983)] and progressing to a 32 by 32 pixel array [see, e.g., B.E. Patt r et al. , NurJ , nst. and Methods. Vol. 283, p. 215 (1989)] with a pixel size of 0.8x0.8 mm and a thickness of 2 mm, with interele ent spacing of «2 mm. The latter camera has a front end area of 5x5 cm . No such cameras are reported for CdTe or CdZnTe, due to manufacturing problems which still remain in producing high quality and uniform single crystals. The difficulties encountered in producing a bulk Hgl, imaging array are: (a) Growth of very large crystals, from which large-sized slices can be cut, is very difficult and time-consuming. It takes 2-3 months for one large crystal to grow. (b) The crystals have to be sliced using Kl aqueous solution, which gives very uneven sunaces requiring polishing, causes over 60% loss of material, and introduces structural imperfections caused by the slicing and polishing operations. - 14 - In contradistinction to the prior art systems used and suggested to date, the present invention, instead of growing a three-dimensional crystal and then slicing and polishing the slices, is based on depositing a thin, continuous film of a se iconductive radiation-detecting material on a conductive substrate. More particularly, the present inventicn provides an image receptor for an imaging system comprising a thin, continuous film of a wide band gap, semi-conductor radiation-detecting material deposited on a conductive substrate layer forming a bottom electrode, said film being covered by an upper conductive layer forπing an upper electrode; wherein at least one of said layers is provided with a plurality of conductive areas separated from each other by a plurality of non-conductive areas, and wherein a multiplicity of said conductive areas are individually, respectively connected, via a charge-sensitive pre-ampli ier, to an imaging electronic systen. As indicated in a first preferred embodiment of the present invention, either said bottom electrode or said upper electrode i s subdivided into a plurality cf conductive areas separated from each other by non-conductive areas, e.g., said substrate can be continuously covered by a grid of top-patterned electrode pixels of »20-200 μm width and «20-200 μm length, each detector connected individually to the electronic circuit. In a further preferred embodiment ' the present invention, said imaging system comprises a thin, continuous film of a wide band gap, semiconductor radiation-detecting PCIYUS95/12222 - 15 - material deposited on a substrate layer having a plurality of conductive areas separated from each other by a plurality of non-conductive areas forming a bottom e.ectrode, said film being covered by an upper layer having 4 plurality of conductive areas separated from each other by a plurality of non-conductive areas. Preferably, in said embodiment the conductive areas of said substrate layer are arranged as a first series of spaced-apart strips and the conductive areas of said upper layer are arranged as a second series cϊ spaced-apart strips, said first and second series of strips being arranged relative to each other to form a gric-like array. Especially preferred is an arrangement wherein said upper and substrate layers are respectively patterned with vertical and horizontal conductive strips, to produce a cross-grid representing a pixel of about 2 -200 μm width and about 20-200 μm length. Thus, the present invention now provides a new x-ray and low-energy gamma ray system based on sem conductor thin films rather than bulk crystals. The system operates mainly in energy-dispersive mode, but can also b«; used in the current mode. It is based on room temperature operating, large band gap semiconductor radiation detectors, such as Hgl„, CdTe, CdZnTe or Pbl,, deposited as evenly textured films of 1 to 100 μm thickness, either on patterned, more conductive semiconductor substrates such as £i, Ge or GaAs, which can serve directly as the bottom electrode, or on insulating substrates such as MgO or sapphire (Al 2 o 3 ) which are coated prior to deposition with patterned conducting (gold or palladium) stripes, which should alεo serve as the bottom electrode. The width of the stripes is 10-100 μm. Since the preparation of Hgl textured films has never been reported, the present invention also relates to a novel thin film deposition system, λs mentioned above, the semiconductor film is then coated with conducting (gold or palladium) patterned stripes which represent the top electrode. The detector system is then pasεivated by coating with a very thin layer cf paralene, humiseal, or other inert coating, and via printed circuit it is connected to a low noise, high voltage power supply to bias the detector system and to the electronic measuring system. The use of semiconducting bulk crystals radiation detectors has been recently described n USA Patent 5,245,919. The semiconductor material chosen s CdZnTe. This system is designed for gamma ray topographic imaging systems. The principle is that collimatad τ-rays are detected by a semiconductor rather than by i scintillation crystal camera (usually sodium iodide) . The semiconductor transforms the attenuated r-rays directly * .nto electrical charges rather than first transforming them into visible light, and afterwards, through a photo ultiplier or diode, transforms the visible light into electrical charges. In contradistinction to the teachings of said patent, the novelty of the present approach is to use thin films rather than blocks of bulk crystals and a wide range rather than collimated radiation. Other methods of imaging which also do not teach the novel feature of the present invention include: a) A photocapacitive image converter described in Patent No. 4,331,813. This patent is based on a Metal- insulator-semiconductor, in which the semiconductor is Si, Ge or Gaλs. The radiation is then converted into electrical signals. The disadvantage of this method is that it does not discriminate the nuclear radiation and m fact can be used for any kind of radiation; and b) Multi-Element-Amorphous-Silicon-Array for real time imaging described by Patent 5,079,426. This method is based on a thin film field effect transistor, a dielectric larger and amorphous silicon which converts the radiation into signals. As in the case of the photoconductive method, this method is not specifically designed for nuclear radiation and instead measures any wide range radiation, including infra red radiation. The present description will be limited to the energy- dispersive mode rather than the current mode. The electronic counting system consists of a pulse count system, by which each of the bottom electrode stripes (rows) and top electrode stripes (columns) is connected to a first stage, charge-sensitive, low noise hybrid (or asic) preamplifier, which is further amplified by a shaping amplifier. The collected charges are compared, discriminated and converted from analog to digital signals, stored in a computer, and the computed imagu is displayed. At 100 keV, the semiconductor films detector can stop between »0.l-10% of the radiation, depending on the thickness of the film. All problems, particularly the conversion of bulk detector to thin fil-r. camera, are addressed and resolve - 2 The front end of the camera, which i3 5x5 err , is composed of 300 vertical and 300 horizontal stripes, 100 μm x 5 cm each, separated by 66 μm uncoated stripes. Thus, there are 90,000 intersections of norizontal and vertical stripes in one camera module, having a total of 2 90,000 pixels per 5x5 cm detector front end plate. For imaging larger areas, such aε for X-ray imagxng mammography where 20x15 cm 2 plates are used, 12 interconnected 5x5 cm2 modules can be assembled. The invention will now be described in connection with certain preferred embodiments with reference to the following illustrative figures and examples, so that it may be more fully understood. Kith specific reference now to the figures and examples in detail, it is stressed that the particulars shown are by way of example and for purposes of illustrative discussion of the preferred embodiments of the present invention only, and are presented in the cause of providing what is believed to be the most useful and readily understood description of the principles and conceptual aspects of the invention. In this regard, no attempt is made to show structural details of the invention in more detail than is necessary for a fundamental understanding of the invention, the description taken with the drawings and th« given examples making apparent to those skilled in the art how the several forms of the invention may be embodied in practice. In the drawings: Fig. 1 is a schematic drawing of the hot pressing system for producing semiconductor polycrystalline plates; and Fig. 2 is a graph showing the time profile of the hot pressure heat treatment for mercuric iodide or lead iodide; Fig. 3 shows an example of radiation response to 60 keV gamma radiation of a polycrystalline Hgl 2 detector plate produced according to the method of the present invention; Fig. 4 is a photolithograph of a multi-layer mβtal/Hgl,/ metal th n film structure, showing 50x50 mm 2 pixels; Fig. 5 is a photolithograph of a multi-layer Si/HgI_/metal thin film structure, showing 50x50 mm 2 pixels; Fig. 6 is a schematic view of a Hgl_ thin film deposition syste ; and Fig. 7 is a block diagram of the electronic system of a bulk Hgl 2 detector camera, adapted to a thir. film detector camera. As stated above, the present invention is based on using any of the semiconductor materials listed in Table 1 as polycrystalline detector materials. That means that, instead of growing the crystals as single crystals in a very lengthy, time-consuming cycle, which can take many months as in the case of Hgl,, the present invention provides techniques which produce Hgl_ or other seniconductors as polycrystalline ceramic materials, of any desired thickness and size, in a maximum length of time of about 24 hours. The process is based on either hot pressing or slurry deposition of the semiconductor powders such aε Hgl, or Pbl 2 mixtures with organic solvents such as alcohol, CC1 , or special polymers used as binders, having lonrj molecules and deposited by painting or spraying, followed by drawing or screen printing annealing in a temperature range below the temperature of phase transformation or melting point. Polycrystalline, purified, H -3^ 2 P ow der material is preferably used in both cases. In the hot pressing technique, the powder is subjected to a pressure of about 1 2 ton/cm in a press, as shown in Fig. 1, and then heated while under pressure in the thermal cycle shown in Fig. 2. This high pressure prevents evaporation of Hgl,, which has a high vapor pressure (its boiling point is 354 β c) , and the annealing temperature of approximately 220 β C allows a reσrystalliβation of the strained grains. The sintering produces a very high density process, so that the produced Hgl_ plate can be contacted by the upper and lower electrodes and can withstand the reasonable bias voltage (wlO V/cm) required to collect the electrical charges produced by the radiation. Since Hgl_ undergoes a destructive phase transformation at 125°C, it requires an additional annealing time at about that temperature, as shown in Fig. 2. Other advantages of the hot pressing technology are that the detector plates thus produced are very compact; they have a very high density, and their size and thickness is only limited by the size of the die and the total pressure generated by the press. The upper electrodes of the Hgl- plates are made with gold, palladium, germanium, or silicon, and may be of any desired shape. An alternative method of generating large-area polycrystalline detector sheets is by slurry deposition. Purified polycrystalline powder is mixed with an organic binder, βuch as polyvinyl acrylate and trimethyl sorbitant in equal amounts, dissolved in a 65% ethanol/water solution, and then deposited by spraying, painting, spinning, or screen printing on an insulating substrate, which αan be either polycrystalline alumina, Teflon, or a metal electrode such as platinum or gold, or semiconductor uch as silicon or germanium, already patterned with additional electrical contacts such as palladium or gold electrode strips or other shapes of electrodes. The substrate plate and the slurry-deposited suspension of semiconductor powder are then heated at 50-95°C to evaporate the alcohol in atmosphere and then heated, in the case of Hgl_ to approximately 110 β C, for a heat treatment of from 4-24 hours. The inert, contacted Hgl- plate is then introduced into a dark mαtal box, lined inside with Teflon insulation, and the radiation-receiving end is covered with a carbon or very thin aluminum foil window. The detector box is then connected to an electronic read-out system. An example of the radiation response of such a polycrystalline Hgl 2 detector plate to 60 kev gamma radiation is shown in Fig. 3. If compared with a single Hgl. crystal of similar size and thickness, the polycrystalline Hgl, detector plate produced according to the present invention detects about 15% ralative to the amount of radiation detected by the single crystal spectrometer. EXAMPLE 1 30 g of high purity Hgl_ powders, reduced to a grain size *5-l0 micrometer, were placed in a steel mold on a gold foil of 6 mm diameter. The powder was covered by another gold foil of similar size, and then pressed. Under pressure, the temperature was raised to no°C for 10 hours, and then slowly lowered to room temperature for 10 more hours. The Hgl- plate thus obtained was sintered to the gold plates. The gold foils could serve as electrodes, or, if removed, the Hgl. plate could alternatively be coated by graphite suspension ("Aguadag") on both sides, to be used as the electrode contacts, dried, and then very thin Pd or Pt wires of 0.1 mm diameter attached to both electrodes with "Aquadag" and dried. In Example 1, the gold foils were left to serve as the electrodes. After introduction into the testing chamber (Fig. 2) , the produced plate showed a response to X-rays as shown in Fig. 3. All further examples also showed an X-ray response similar to that shown in Fig. 3. EXAMPLE 2 The procedure of Example 1 was repeated; however, the Hgl- plate was separated from the gold foils, and Pd contacts were evaporated, as shown in Pig. 1. EXAMPLE 3 The procedure of Example 1 was repeated; but the heating cycle during hot pressure was 10 hours at 2O0 w C, with cooling to I27°c for 10 hours, and then slowly cooling to room temperature. EXAMPLE 4 The procedure of Example 1 was repeatec; but the gold substrate was replaced with sintered alumina 2 mm thick, coated with patterned gold strips, as shown in Fig. 1. EXAMPLE 5 The procedure of Example l was repeated, using Teflon-coated metal foils, which are easier to separate from the Hgl_ plate. The electrodes were coated as in Example 2. EXAMPLE 6 The procedure of Example 5 was followed, using glass plates coated with electrodes on the top and bottom in the steel mold. EXAMPLE 7 The procedure of Example 1 was followed, using larger grains (»1 mm) of Hgl,, obtained by purification after vacuum evaporation of H ∑ 2 non-purified powders. EXAMPLE β The procedure of Example 7 was followed, using purified lead iodide instead of Hgl-. A Pbl plate wa-s produced. EXAMPLE 9 loo g of Hgl powder was mixed with polyvinyl etacrylate and trimethyl sorbitate. The. mixture was painted on the substrate, dried for about 2 hours, and neat-treated at I20 g c for one hour. The upp<sr electrode of Pd was then deposited, and the sample was ;.ntroduced into the testing chamber (Fig. 2). The results were similar to those of Fig. 3. EXAMPLE 10 The procedure of Example 9 was followed, using a glass substrata of 1 mm thickness, prepatterne-. as shown in Fig. 1. EXAMPLE 11 The prαoedure of Example 10 was followed, but using a gold substrate having a thickness of 0.5 mm. EXAMPLE 12 The procedures of Examples 9, 10 and 11 were followed, but evaporating Pd or Au electrodes on the Hgl 2 plate, patterned as shown in Fig. 1. EXAMPLE 13 The procedure of Example 9 was followed, but applying a thick layer of Hgl , mixed with the organic oinder by using the spinning method, similar to the way in which photoresist solution is applied during a photolithography process. The alumina substrate, covered with the bottom electrode, was spun at 5,000 rpra. A small amount of the slurry mixture, enough to apply a layer approximately 100 μm thick, adhered to the substrate. The rotational speed used enabled the slurry layer to be very flat and homogeneous. The upper contacts were applied as in the other examples, and the plate was tested for X-ray response. EXAMPLE 14 The procedure of Example 13 was followed, but the deposition of Hgl_ was made with a commercially available spraying system using air pressure and a nozzle, through which the slurry was sprayed on the precontacted glass plate. EXAMPLE 15 Hςl powders were placed at the bottom of a glass vacuum chamber, heated to about 1C0°C, and deposited by evaporating an Hgl_ layer on a liquid N_-cooled glass substrate, precontacted with the bottom electrode, yielding an Hgl layer 1-50 μm thick. The temperature was then slowly raised while the vacuum was released and replaced by 1 at . of N-, slowly heated to 50 β C, and then cooled to room temperature. The Hgl- polycrystalline plate was then covered with the upper electrode, and tested for response to the x-ray radiation. EXAMPLE 16 The procedure of Example 15 was followed, but other substrates were used, such as germanium or sintered alumina, and the bottom electrodes were pre-patterned by palladium or gold strips. EXAMPLE 17 A mixture of Hgl and binder was placed in a container having a sieve at the bottom wi .th an area of ~20 x 30 cm2 2 and holes of a size of «250 x 250 μm , through which said mixture can pass. The mixture was then squeezed through the sieve by either manual or machine press, and printed on a substrate of glass or alumina which was previously evaporated with 100 μm-width metal electrodes in horizontal rows, of Au, Pd or Pt. A thickness cf approximately 40 μm of Hgl- was thus obtained; by repeated printing, a thickness of 100 μm can be reached. The film was then annealed at 60 β C for 5 hours. The upper vertical columns of electrodes, also 100 μm wide, were applied on thin glass or plastic foil by evaporation, and superposed on the Hgl thic> film by mask alignment. Thus, active pixels of 100 x 100 μa 2 were formed at the intersections of the horizontal and vertical electrode . Referring now to Figs. 4 and 5, there is seen a thin film of Hgl deposited on a thin gold or palladium metallized, insulating, single crystal substrate such as MgO or sapphire (Fig. 4), or on a semiconducting substrate such as Si or Ge (Fig. 5) , both of which are 50x50 mm in dimensions. The Hg - film is patterned bottort and top with horizontal and vertical stripes respectively, of 100 μ x 50 mm length and separated by 66 r .τn contactless stripes, yielding 300x300 pixels, with or without guard rings. The advantages of the system of the present invention are a much lower production cost, and the ability to produce large-area imaging detectors consistent witn modern thin film technology. The lower cost is based on the much shorter time required to produce an Hgl. film on a substrate (Figs. 4 and 5) , rather than that required to grow, slice and polish the large crystals, i.e., 2-3 hours as compared to 2-3 months. The disadvantage of the thin film detection system is a smaller abβorption of only 0.1-1.0% of the total radiation, against 100% of the bulk crystals (for 100 key radiation) . However, even such a low absorption of radiation by the thin films allows achievement of spectral resolution comparable with x-ray films (Table 2), which also absorb less than 0.1% of the total radiation although spectral resolution is not required to characterize the counts per pixel. Hgl, and also other semiconductor detectors such as CdTe and CdZnTe, can be used not only in direct imaging as x-ray films, but also in both current mode and energy dispersive imaging systems. The latter allows measurement of very small numbers of interactions in the detector, also decreasing total exposure to high doses of radiation. Energy dispersive imaging also allows counting of radiation events by analog electronics, and, by analog-to-digital conversion, digitizing of information and storage of same in a computer-to-image display. Fig. 6 depicts a thin deposition system apparatus which can be used by (a) direct evaporation of Hgl ; (b) separate evaporation of Hg and l_ and condensation on the substrate; or (c) chemical vapor deposition, such as Hg(tdh), precursor and I_ compounds. The apparatus consists cf a two-part, t vertical Pyrex or quartz ampoule connected to a vacuum system. In the bottom part of the ampoule it. the precursor source section, containing either highly-purified Hgl- or, in different separate sub-containers, Hg mata., inorganic or Organometallic Hg compound, and free iodine. The temperature is controlled in the bottom part by τ orβcursor ' which is separately monitored. The upper part of the ampoule contains a substrate holder, to which the semiconductor or metallized and patterned substrate is attached. The substrate holder is locally heated by a resistance heater (not shown) or by radiative heating, which determines T . t , the temperature of the substrate. In order to provide the hot wall environment, the Pyrex or quartz ampoule is introduced in a separately controlled, semi-transparent resistance furnace, the temperature of which is called T furMOβ . The deposition conditions are fulfilled if τ furnace > T pr-acursor > *, ub .f Typical temperatures used re T furnace " 130 ' C ' τ prββursβr = 12 ' C ' and T subst B 115 » C. 2 For substrates larger than 50 x 50 mm , the system has to be scaled up, and the substrate has to be moved by a mechanical x-y driving system to assure homogenous deposition. Other wide band gap semiconductors, such as CdTe and CdZnTe, are available as thin films on substrates such as Si with GaAs layers, on top of which either CdTe or Cd - Z Te layers are deposited, with x»0.05 or 0.20. These CdTe/GaAs/Si multilayer structures are teing used as substrates for CdHgTe infrared detectors, but can also be used for thick film X-ray detectors if they are patterned to the desired number of bottom electrode stripes, to provide the proper number of imaging pixels. Thin films of bl 2 can be deposited in an apparatus similar to that shown in Fig. 6. The semiconductor thin films described above are patterned by photolithography for the vapor phase deposition of the top metal electrode stripes, made of palladium, gold or platinum. After photolithography, the finished detector structures (see Figs. 4 and 5) are thoroughly rinsed in high purity, deionized and triple-distilled water, to remove the chemicals left from the photolithography process. The structures are then passivated by covering with a thin layer of paralene, after which they are ready for packaging for electronic readout. The patterned, contacted and passivated detector plate, 3 measuring 5x5x0.2 cm , is then placed on a polycrystalline alumina or Teflon plate which has the printed circuit board contacts on the bottom thereo . The plate serves as the first stage of amplification, composed of a low noise 2N4416 FET and a low noise feedback resisto , mounted on a 3 ceramic chip of 0.5x0.5x0.1 cm preamplifier substrate. The module is composed of stripes of 100 μm x 5 cm each, separated by 66 μm non-contacted stripes. The horizontal stripes are called rows, and the vertical stripes are called columns. There are 300 rows and 300 columnβ. The total number of preamplifiers required fcr one csmera module is 600, i.e., each row and each cclumn is connected to its own preampli ier. In order to house 600 hybrid preamplifier chips and allow the use of several modules, tne front end of the camera plate, with 100 preamplifier chips, is placed on top of a cube-shaped box accommodating 100 chips per face (the four side walls and bottom wall thus housing together 500 chips, + 100 chips on the top) . The walls of the box are connected by preprinted circuit board, which is connected on one side to the input of the detectcr and the bias voltage, and on the other side to the preamplifiers output connected to the remaining electronic circuitry, which is similar to that described below for the Hgl_ bulk detector camera (see Fig. 7) . Referring now to Fig. 7, the electronic system used for the Hgl 2 bulk detectcr crystal camera will be briefly described in order to present a more complete description. The overall electronics are adapted for the thin film detector of the present invention. Thus, the detector output from the preamplifier is further amplified and shaped, and collected charges arc transferred from the preamplifier to the shaping amplifier, which is a hybrid designed to be flexible enough to be used with other pulse- oriented radiation detector systems. A single stage of differentiation and four stages of active integration are used to achieve near Gaussian shaping. A high-impedance analog input buffer is provided, which may be used or bypassed. A 6 μs pole-zero cancellation circuit is included, but this value may be easily changed by adding an external variable resistor. The output of the shaping amplifiers is processed in the following way: The signals are comparec , using a fast comparator with a level discriminator set just above the noise in order to produce a digital signal, indicating that an event has occurred. This signal is then passed to an analog-to-digital dataway-to-logic circuit, w.iich determines the validity of an event by coincidence timing. If the event is determined to be valid, it encodes the spatial position of the event and produces the appropriate multiplexer control signal so that the analog signal can be processed by the analog to digital converters to determine the pulse height (energy information) . All of the encoding logic is realized using programmable logic arrays (Altera EP 1800J) . This allows for significant reduction in the size of the final circuit over full-size discrete gate logic. All of the encoding logic and the ADC functions fit onto a single AT size card. The entire data acquisition is supervised by an IBM PC-AT computer. The computer is a single AT size board (TI80486), with a second card used for I/O control (SCSI, etc.). The board is equipped with 10 MB of RAM. A 200 MB IDE drive, and a 1.4 MB, 3.5-inch floppy disk drive, are also included in the final system. A custom system board, including the standard AT back-plane and additional busses for the camera signals, is built to hold the cards making up the camera system. The cards fit into a subchassis in tne back end of the camera. The high voltage power supply for biasing the deteαtor, the low voltage power supply for the electronics, the hard disk drive, and the floppy disk drive, are mounted in a separate subchassis in the back end of the camera. The system is capable of input rates exceeding 10 counts per second. Finally, the camera system includes software to control the data acquisition and display images. The software is written in the "C" language for OS/2, using the OS/2 presentation manager as the interface. A special driver is written to allow the software to communicate with the electronics. The computer display during image acquisition can use the following item selection: 1) File I/O (save, load, etc.) 2) Acquisition parameters, such as time/count limits 3) Operating modes, such as choice of display of acquired image vs. reconstructed image, type of reconstruction, etc. ) Options 5) Utilities 6) Help functions, intended to be compatible with the OS/2 PM, and allowing OS/2 PM conversior. as much as is practical. The display consists of the following distinct areas: a) Menu area b) Gray scale image display c) Spectrum (daughter window) d) Image characteristics (total count; sum of all counts; maximum counts; value of brightest pixel; multiple counts; number of counts where signals are present in two adjacent rows or columns simultaneously, due to charge splitting; delta counts, and number of counts. The system includes mouse control, so that the user may select a particular pixel and display the energy spectrum for that pixel. The spectrum is displayed n the daughter window, which also shows the pixel location [r,c] to which the spectrum corresponds, the cursor location in the spectrum, and the corresponding number of counts [cursor; counts] at the location. As will be realized, the present invention has many applications. Thus, according to the invention, there is now provided a single module, miniature semiconductor, >-ray ana gamma ray, thin film, radiation detector camera composed of Hgl-, 2 CdTe, CdZnTe, or Pbl_ thin films, having c. 3x5 cm viewing window operating in current mode or in β αrgy dispersive mode. The imaging system cf the present invention αan also be used with a multi-modular X-ray and gamr-a ray camera, replacing large area X-ray films of about 23X15 cm , i.e., composed of 12 modules of miniature cameras of 5x5 cm 2 or with a multi-modula , miniature, single mcdule X-ray and gamma ray camera of 27.5x42.5 cm 2, .e., «47 modules of 2 5x5 cm or other radiology pictures. The imaging system of the present invention can be applied in nuclear medicine, and can be used as an intra-operative tool for use in surgical procedures such as subclinical tumor removal, identi ica ion of transplant perfusion, determination of vascular graft viability, removal of benign bone lesions, etc. State of the art techniques available to the surgeon are limited to single-detector gamma and beta probes. The advantages of the imaging systems with respect to the non-imaging intra-operative probes include improvements Ln localization and sensitivity coupled with spectrally-rer.olved imaging, with potential for scatter subtraction. similarly, the present invention can be applied to astrophysics for mapping x-ray fields such as solar flare telescopes or gamma bursts; for use in idαntification of counterfeit banknotes; for use in identification and comparison of paintings in museums; for use in identification and comparison of antique archeological artifacts; for use in imaging of ground meat inn canned meat to identify undesired bones; for use in identifying nuclear waste; for use in identifying smuggled nuclear material, and for use in airport security imaging systems. It will be evident to those skilled in the art that the invention is net limited to the details ot the foregoing illustrated embodiments and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the soope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range cf equivalency cf the claims are therefore intended to be embraced thereii:.

Claims: WHAT 18 CLAIMED IS: 1. A radiation detection system, comprising a continuous film of a wide band gap semiconductor, radiacion-detecting, polycrystalline material formed from a multiplicity of crystalline grains, wherein said grains are sintered together to form a single, coherent, continuous film. 2. A radiation detection system according to claim 1, wherein said single, coherent, continuous film is a mercuric iodide film. 3. A radiation detection system according to claim 1, wherein said βingle, coherent, continuous film is a cadmium telluride film. 4. A radiation detection system according to claim 1, wherein said single, coherent, continuous film is a cadmium zinc telluride film. 5. A radiation detection system according to claim 1, wherein said single, coherent, continuous film is a lead iodide film. 6. A radiation detection system according to claim 1, wherein said multiplicity of polycrystalline grains and the film formed therefrom have a purity of at least 93.9999 (6N) percent. 7. A radiation detection system according to claim 1, wherein said film has an area of between about 10 2cm2 and 10 cm 2 . 8. A radiation detection system according to claim 1, wherein said film has a thickness of between about 1-500 μm. 9. A radiation detection system according to claim 1, wherein said film is at least partially textured. 10. A radiation detection system according to claim 1, wherein said film is fully textured. 11. An image receptor for an imaging syεtαm according to claim 1, comprising: a thin, continuous film of a wide band gap, semiconductor radiation detecting material deposited on a conductive substrate layer forming a bottom electrode, said film being covered by an upper conductive l^yer forming an upper electrode, wherein at least one of said layers is provided with a plurality ot conductive ivreas separated from each other by a plurality of non-conductive areas, and wherein a multiplicity of said conductive areas are individually, respectively connected, via a cnarge-eensitive pre-amplifier, to an imaging electronic system. 12. An image receptor or an imaging εystum according to claim 11, comprising a thin, continuous film of a wide band gap, semiconductor radiation detecting material deposited on a substrate layer having a plurality of conductive areas separated from each other by a plurality of non-conductive areas forming a bottom electrode, said film keing covered by an upper layer having a plurality of c nductive areas separated from each other by a plurality of non-conductive areas. 13. An image receptor for an imaging system according to claim 12, wherein the conductive areas of said substrate layer are arranged as a first series of spaced-apart strips and the conductive areas of said upper layer are arranged as a second series of spaced-apart strips, said first and second series of strips being arranged relative to each other to form a grid-like array. 14. An image receptor or an imaging s stem according to claim 13, wherein said upper and substrate layers are respectively patterned with vertical and horizontal conductive strips, to produce a cross-grid representing a pixel of about 20-200 μm width and about 20-r.GQ μn length. 15. An image receptor for an imaging system according to claim 11, wherein said conductive areas are separated from each other by a dielectric material selected from the group consisting of Sio^, MgO, and l^O^. 16. An image receptor for an imaging system according to claim li, wherein said substrate is covered with a uniform, thin film electrode material selected from the group consisting of palladium, gold, platinum and cermanium. 17. An image receptor for an imaging system according to claim 11, wherein said substrate is covered by a semiconductor thin film on top of a bottom electrode having a thickness of l-ioo μm. IB. An image receptor for an imaging system according to claim 11, wherein said substrate is covered by a grid of top-patterned electrode pixels of about 20-200 μm width and about 20-200 μ length, each detector being individually connected to the imaging electronic system. 19. An image receptor for an imaging system according to claim li, whenever used in an X-ray and gamma ray imaging syste . 20. An image receptor for an imaging system according to claim li, wherein said thin film is a CdTe thin film. 21. An image receptor for an imaging systi-m according to claim 11, wherein said thin film is a Hgl, thin film. 22. An image receptor for an imaging systαm according to claim 11, wherein said thin film is a CdZnTe thin film. 23. An image receptor for an imaging system according to claim 11, wherein said thin film is a Pbl, thin film. 24. A process for the preparation of a continuous film of a wide gap semiconductor, radiation- detecting, polycrystalline material, comprising: (a) preparing grains of polycrystalline powder material having a purity of at least 99.9999 (6N) %; (b) depositing said granular material on a conductive substrate; and (c) sintering said grains of polycrystalline material together, to form a single, coherent, continuous film. 25. A process according to claim 24, wherein said purified grains of polycrystalline powder material are prepared by evaporation in a vacuum medium. 26. A process according to claim 24, wherein said evaporation is carried out at a temperature of about 100-300 β C. 27. A prooesε according to claim 25, wherein said purification is carried out by sequer.tial repeated evaporation. 28. A process according to claim 24, whsrein an upper plate of a conductive noble metal is placed en top of said powder, and the resulting assembly is compressed at a temperature of about 100-220 β C, and at a pressure of about 100-5,000 Kg/cm 2 . 29. A process according to claim 24, wherein said granular material from step (a) is mixed with an organic binder in a solvent, and then deposited on said substrate, followed by annealing at a temperature of about 60-120 β C 30. A process according to claim 29, wherein said deposition is carried out by mask printing. 31. A process according to claim 24, wherein said purified, granular material from step (a) is placed in a heated area of a vacuum chamber at a temperature of about 90-220•c, and said conductive substrate is placed in an LN, cooled area of said vacuum chamber, whereby said purified granular material is sublimed and deposited on said substrate, and said melding is carried out by heating and annealing at a temperature of about 50-100°C in the presence of N 2 -

Inventors: HAREL ZE EV, NISSENBAUM JACOB BARUCH, SCHIEBER MICHAEL MISHO, HAREL, ZE'EV, NISSENBAUM, JACOB, BARUCH, SCHIEBER, MICHAEL, MISHO
Applicants: HAREL ZE EV, NISSENBAUM JACOB BARUCH, SCHIEBER MICHAEL MISHO, T T I TARGET TECHNOLOGIES ISRA, YISSUM RES DEV CO, HAREL, ZE'EV, NISSENBAUM, JACOB, BARUCH, SCHIEBER, MICHAEL, MISHO, T.T.I (TARGET TECHNOLOGIES ISRAEL) LTD., YISSUM RESEARCH DEVELOPMENT COMPANY OF THE HEBREW
Application year: 1995
Main classification: G01T1
IPC codes: G01T1, H01L27, H01L31