Method of chemical vapor deposition and reactor therefor

Abstract: A method of a chemical vapor deposition and the reactor therefor according to the present invention uses or has a cold-wall type reaction chamber 3 equipped with a gas inlet 5 for a reactant raw material gas(es)4 at one end and a gas outlet 6 for a reaction gas at the other end, installed in roughly horizontal, holding a semiconductor substrate(s) 1 in the chamber 3 with a main surface of the substrate 1 aligned in roughly horizontal, flowing a reactant raw material gas(es) 4 in roughly horizontal in one direction ,and growing a semiconductor crystalline thin film 2 on the heated semiconductor substrate(s) 1, and the substrate 1 is arranged in a range of (L + W ) from the gas inlet 5 of the reactant raw material gas(es) 4 in the flowing direction and in a location of W/G ratio is 15 or larger, where W indicates an internal width of the reaction chamber 3, L indicates a distance from the gas inlet 5 of the reactant raw material gas(es) 4 to the leading edge of the substrate 1 located at the most upstream position on the gas inlet side and G indicates a distance between the main surface of the substrate 1 and the ceiling thereabove.

Description: The present invention relates to a method of chemical vapor deposition, where a reactant raw material gas(es) is transported onto a semiconductor crystalline substrate(s) to grow a semiconductor crystalline thin film(s) thereon, and to a reactor therefor. A horizontal chemical vapor deposition rector, as shown conceptually in a simplified form in Fig.6 of the accompanying drawings, is comprised of a cold-wall type reaction chamber 3 being composed of a gas inlet 5 for reactant raw material gas 4 at one end and a gas outlet 6 at the other end being aligned horizontally and holding a semiconductor crystalline substrate 1 ( hereafter simply referred to as a substrate) generally horizontally in the chamber 3, and grows a desired semiconductor thin film 2 on the substrate 1, while the substrate 1 is heated and the reactant raw material gas 4 flows through the substrate 1 in one direction in the reaction chamber 3. In the horizontal reactor for chemical vapor deposition of the prior art, as shown in Fig. 7 of the accompanying drawings, which is a sectional front view of the chamber 3 shown in Fig.6 as seen from the side of the gas inlet 5, the internal height H of the chamber 3 is so determined as to accommodate a susceptor ( not shown ) laid on the bottom of the reaction chamber 3 on which a substrate 1 is held and a mechanical driving device for substrate transportation ( both not shown ). With respect to the internal width W of the chamber 3 as shown in Fig.7, it is so determined that a proper gap is added to a diameter of a susceptor ( not shown ) or a diameter D of a substrate 1 thereon for receiving or drawing out. In chemical vapor deposition using a traditional type of reaction chamber 3 designed in such a manner as described above, when, in particular, a low impurity content semiconductor thin film 2 is grown on a substrate 1 having a high impurity content whose concentration is higher than that of the thin film 2 by at least two figures, a transition width T located at the interface between the substrate 1 and the semiconductor thin film 2, where the impurity level in the semiconductor thin film 2 changes gradually from the concentration of the substrate 1 to a desired concentration, is unfavorably spread and thus many trials have been carried out to reduce the transition width T. To find a better condition for minimizing the transition width T, there have been carried out studies of the causes of the transition width T. Traditionally two causes have been considered for the formation of the transition width T, which are out-diffusion O in a solid and autodoping A. The out-diffusion O in a solid is a phenomenon that an impurity diffuses into a semiconductor thin film 2 from a substrate 1 depending on a growth temperature of the semiconductor thin film 2. This phenomenon is always dependent on impurity concentration, heating temperature and heating time. To diminish the phenomenon, one of two ways is chosen, either lowering heating temperature or shortening heating time. However, when the heating temperature is lowered in order to suppress the out-diffusion 0, automatically affecting the growth rate to be lowered by itself, the growth rate is required to be reduced further to prevent the surface appearance of a crystalline thin film from roughening. Under the conditions, the growth time, in other words the heating time extended to attain a desired thickness of the film, causes not only the enhancement of the out-diffusion in a solid, which reduces the suppression effect of the out-diffusion, but also the reduction of the production efficiency. On the other hand, the autodoping A is a phenomenon that an impurity removed from the substrate 1 into the gas phase therearound is incorporated back into the growing surface of a semiconductor crystalline thin film 2. This phenomenon is also able to be suppressed by either lowering heating temperature or by shortening heating time. However, both of the above means have disadvantages, the same as the case of the out-diffusion O mentioned above, and both of the means give only small suppression effect to the autodoping A, and also cause a decrease of the production efficiency by lowering the growth rate. In company with the recent general trend of increasingly higher integrated electronic devices using semiconductor single crystalline thin films produced by gas phase epitaxial deposition, much thinner semiconductor crystalline film has been required, and more recently there has been a new requirement that the film thickness is equal to or less than the transition width T generally available in the past. Attention is also drawn to US-A-4689247 which relates to a method for forming a large area thin film for a solar cell and discloses a method in which a reaction gas passes over a substrate at a high speed and with turbulent flow in a reaction space and thereby a thin film with a large area and a uniform thickness is provided. It is an object of the present invention to provide a method of chemical vapor deposition and a reactor therefor, whereby a semiconductor crystalline film having a transition width smaller than that grown by the traditional chemical vapor deposition technique can be obtained in the same reaction condition. The present invention in one aspect provides a method of chemical vapor deposition in a cold-wall type reaction chamber equipped with a gas inlet for reactant raw material gas at one end and a gas outlet for reaction gas at the other end, installed generally horizontally, comprising holding a semiconductor substrate in the chamber with a main surface of the substrate aligned generally horizontally, flowing reactant raw material gas generally horizontally in one direction, heating the semiconductor substrate to a temperature for growing a silicon crystalline film on the semiconductor substrate, said temperature being sufficient to create natural convection between the semiconductor substrate and internal side walls of the reaction chamber due to temperature differences therebetween, and growing a silicon crystalline thin film on the heated semiconductor substrate; characterized in that the substrate is arranged in a range of (L + W) from the gas inlet of the reactant raw material gas in the flowing direction and in a location wherein a ratio of W/G is 15 or larger, where W indicates internal width of the reaction chamber, L indicates distance from the gas inlet to the leading edge of the substrate located at the most upstream position at the gas inlet side, and G indicates distance between the main surface of the substrate and a ceiling of the chamber thereabove. Preferably the semiconductor substrate is so selected that the diameter thereof is less than the internal width W of the reaction chamber. It is also preferred that each of the gaps between the semiconductor substrate and the internal side walls of the chamber is so selected as to be 3cm or wider. The invention in another aspect provides a reactor for chemical vapor deposition, comprising a cold-wall type reaction chamber for growing a silicon crystalline thin film on a heated semiconductor substrate and equipped with a gas inlet for reactant raw material gas at one end and a gas outlet for reaction gas at the other end for flowing reactant raw material gas generally horizontally in one direction, installed generally horizontally, a supporting means for the semiconductor substrate being held in the chamber with a main surface of the substrate aligned generally horizontally, and means for heating the semiconductor substrate to a temperature for growing a silicon crystalline film on the semiconductor substrate, said temperature being sufficient to create natural convection between the semiconductor substrate and internal side walls of the reaction chamber due to temperature differences there between; characterized in that the supporting means for the substrate is arranged in a range of (L + W) from the gas inlet of the reactant raw material gas in the flowing direction and in a location wherein a ratio of W/G is 15 or larger, where W indicates internal width of the reaction chamber, L indicates distance from the gas inlet to the leading edge of the substrate located at the most upstream position at the gas inlet side, and G indicates distance between the main surface of the substrate and a ceiling of the chamber thereabove. The invention in a further aspect provides a reactor for chemical vapor deposition, comprising a cold-wall type reaction chamber for growing a silicon crystalline thin film on a heated semiconductor substrate and equipped with a gas inlet for reactant raw material gas at one end and a gas outlet for reaction gas at the other end for flowing reactant raw material gas generally horizontally in one direction, installed generally horizontally, a supporting means for the semiconductor substrate being held in the chamber with a main surface of the substrate aligned generally horizontally, and means for heating the semiconductor substrate to a temperature for growing a silicon crystalline film on the semiconductor substrate, said temperature being sufficient to create natural convection between the semiconductor substrate and internal side walls of the reaction chamber due to temperature differences therebetween; characterized in that the dimensions of the reaction chamber are so selected that the internal length thereof in the flowing direction of the reactant raw material gas is longer than (L + W) and a ratio W/H is 15 or larger, where W indicates internal width of the reaction chamber, H indicates internal height of the chamber, and L indicates distance from the gas inlet of the reactant raw material gas to the leading edge of the substrate located at the most upstream position at the gas inlet side. The invention will be further described, by way of example only, with reference to the accompanying drawings, in which: Fig.1 is conceptual representation of a main part in a reactor for chemical vapor deposition according to a first embodiment of the present invention and, in particular, Fig.1 (a) is a perspective view of the reaction chamber , Fig.1 (b) is a top plan view thereof and Fig.1 (c) is a vertical sectional view thereof; Fig.2 is a graph showing experimental results of vapor phase epitaxial growth conducted in a first embodiment and indicates the relation between W/G ratio in a reaction chamber and rotation number of a vertical vortex that is generated by natural convection during passage of reactant raw material gas over a heated region; Fig.3 is another graph showing experimental results of vapor phase epitaxial growth conducted in a first embodiment and indicates the relation between W/G ratio in a reaction chamber and transition region width of a semiconductor crystalline thin film; Fig. is a schematic sectional view of a reaction chamber in a second embodiment of the invention; Fig. 5 is an impurity concentration profile in the thickness direction; Fig. 6 is a perspective view illustrating a stream pattern of natural convection of reactant raw material gas generated in a conventional horizontal type reactor for a chemical vapor deposition; Fig. 7 is a vertical sectional view of Fig.6 illustrating a stream pattern of vertical vortexes of reactant raw material gases generated in the reaction chamber. The present inventors have investigated the autodoping phenomenon, which is one of the causes of increasing transition width, by using a horizontal type reactor for chemical vapor deposition. The details of the investigation are as follows: In a cold-wall type reaction chamber aligned generally horizontally holding a substrate therein, when reactant raw material gas is led into the chamber and flows over the substrate generally horizontally and in one direction, while heating the substrate for growing a crystalline thin film thereon, vortexes due to natural convection generated by a temperature difference between the reaction chamber and the heated area carry impurity which was removed from the substrate, in particular from the backside thereof, and then return the impurity to the neighboring point of the substrate in each time when the vortexes have the opportunity to be incorporated with the growing surface of the crystalline thin film. The inventors have found that the vortexes carrying a impurity from the substrate are one of the causes of the autodoping phenomenon. In a conventional type of a horizontal reactor for a chemical vapor deposition as shown in Figs.6 and 7, which has a large space above a substrate 1 in the reaction chamber 3, large vertical vortexes 12 due to natural convection 11 are generated in such a manner that a part of the reactant raw material gas 4 is moved upward above the central region of the heated substrate 1 and moved downward in the vicinity of the cooled side walls 7 of the chamber 3 as the reactant raw material gas 4 flows inside the chamber 3 in the downstream direction. By a theoretical analysis through calculations using Grashof number and Rayleigh number as parameters on the basis of hydrodynamics, a generation frequency of the vertical vortexes 12 due to natural convection 11 is found to be proportional to the third power of the internal height H of the reaction chamber 3 on an assumed condition that the substrate 1 is held directly on the internal bottom surface of the reaction chamber 3. When a space above the substrate 1 is wider, the impurity in the natural convection originated from the substrate 1 increases the probability to be incorporated with the substrate 1, resulting in larger autodoping and wider transition width. In a horizontal type reactor for chemical vapor deposition comprising a cold wall type reaction chamber, a series of experiments to grow semiconductor crystalline thin films 2 have been carried out by narrowing the distance G between the main surface of a substrate 1 and the ceiling of the reaction chamber 3 gradually for measuring each transition width at each distance G, and at the same time, rotation number of a vortex 12 under each condition was estimated by calculations and gas flow visualization experiments. Both the rotation number of the vortex and the transition width were studied with respect to W/G ratio, where W/G ratio indicates the ratio of the internal width W of the reaction chamber 3 to the distance G between the main surface of the substrate 1 and the ceiling of the chamber thereabove. One of the results of the study showed that in the case when an internal width W of a reaction chamber 3 was 40 cm in length, a distance G of 2 cm between a main surface of a substrate 1 and the ceiling thereabove , that is W/G ratio was 20, the rotation number of the vortex 12 due to natural convection 11 generated above the substrate 1 during the passage of a mixture of raw material gases 4 over a heated region, whose diameter was 30 cm, was suppressed to about 0.5 rotations. In Figs. 6 and 7, the internal width W is a distance between both the internal walls 7, 7 of the reaction chamber 3. A study covering several experiments showed that in the case when the W/G ratio was 15 or larger, the rotation number of the vertical vortex 12 was suppressed to 1 or less within the distance of ( L + W ) in the flowing direction of the raw material gases 4 and therefore the autodoping phenomenon was reduced to be as small as possible, where L indicates distance from the gas inlet 5 for the reactant raw material gases 4 to the leading edge of the substrate 1 located at the most upstream position at the inlet side. When the W/H ratio is selected to be 15 or larger, since the substrate 1 is held in the reaction chamber 3, the W/G ratio is automatically regulated to be 15 or larger, where H indicates the internal height of the reaction chamber 3 at the position where the substrate 1 is held. As mentioned above, when the W/G ratio or W/H ratio is selected to be 15 or larger and the distance G between the main surface of the substrate 1 and the ceiling thereabove is reduced, the rotation number of a vertical vortex 12 due to natural convection 11 is suppressed above a heated region within the distance of ( L + W ) from the gas inlet 5 in the flowing direction of the reactant raw material gases 4, resulting in suppression of the autodoping phenomenon to be as small as possible and thereby the transition width T is decreased. On the other hand, a stagnant layer of the reactant raw material gases 4 is formed in the vicinity of all the sidewalls 7, 7 of the reaction chamber 3, where the flow rate is very low. The thickness of the stagnant layer is found to be 3 cm at the minimum and has no relation to the internal width W of the reaction chamber 3 or the diameter D of the substrate 1 held inside the chamber 3. When an impurity migrates from a substrate 1, in particular from the back surface thereof, into the stagnant layer, the probability of autodoping is high because the impurity stays a long time in the stagnant layer where the flow rate is low. Consequently, when a chemical vapor deposition is carried out under the condition that both of the outer sides of the substrate 1 are separated from the internal walls 7, 7 by 3 cm or wider in length respectively, since any part of the substrate 1 is not located within the stagnant layer site, none of the autodoping originated from the stagnant layer is generated, so that the entire substrate 1 is kept under the same environmental condition with respect to the flow of the reactant raw material gases 4. Next, detailed embodiments of reactors operated under normal atmospheric pressure according to the present invention will be explained with reference to the accompanying drawings. Embodiment 1. Fig.1 shows a reactor for chemical vapor deposition according to a first embodiment of the present invention. A substrate 1 is placed in a reaction chamber 3 and a mixture of reactant raw material gases 4 flows over the substrate 1 heated at a desired temperature to grow a semiconductor crystalline thin film 2 on the substrate 1. There are several methods to heat up the substrate 1 to a desired temperature, for example a method to provide radiation energy such as infrared rays to the substrate 1 through reaction chamber walls, a method wherein a resistance heater is provided beneath the substrate 1 and heated by electricity, and a method wherein a induction heater is provided beneath the substrate 1. When a semiconductor such as a silicon crystalline thin film 2 is grown by chemical vapor deposition, walls 7, 7 of the reaction chamber 3 are kept at a low temperature in order that semiconductor crystal does not deposit on the internal surfaces of the walls, while the substrate 1 is heated. Under such a reaction environment, only the substrate 1 is heated to a high temperature, but the area around the substrate 1 remains at a temperature a little higher than room temperature. A chamber that produces such a temperature environment around the substrate 1 is generally called a cold-type chamber. Natural convection 11 is apt to occur inside the cold-type chamber due to the great temperature difference between one substrate 1 and the walls of the reaction chamber 3. A series of silicon single crystalline thin films were grown on silicon crystalline substrates in the first embodiment of the reactor for chemical vapor deposition of the present invention and the results obtained are described below in detail. A silicon single crystalline substrate 1, which had a conductance of p-type, a resistivity of about 0.02 ohm · cm and a diameter D of 20 cm , was placed on a susceptor, not shown, in the reaction chamber 3 and heated up to 1100 °C, where the susceptor has a diameter a little smaller than the internal width of the reaction chamber 3. The configuration of the reaction chamber 3 for chemical vapor deposition in the first embodiment was set as follows; the distance L from the gas inlet 5 for a mixture of reactant raw material gases 4 to the leading edge of the substrate 1 was 20 cm, the gap d1, d2 between the internal side walls 7, 7 of the reaction chamber 3 and the nearest portions of the outer edge of the substrate 1 was 5 cm each, the internal width W of the chamber 3 was 30 cm, and the distance G between the main surface of the substrate 1 and the ceiling of the chamber thereabove was so selected as to change gradually in the range of 1.5 cm to 6 cm, which means that the W/G ratio was in a range of 5 to 20. A series of vapor phase epitaxial growths were conducted under the following conditions. A mixture of reactant raw material gases 4 was prepared by mixing 3.6 l/ min. of trichlorosilane gas with hydrogen gas and the mixture was supplied horizontally into the reaction chamber 3 in one direction at a flow rate of 100 l/min. through the gas inlet 5 of the reaction chamber 3. In this condition, the rotation number of each of vortexes was determined by calculations on the basis of hydrodynamics and visualization experiments so as to study a relation between the rotation number and W/G ratio, where the vortexes were generated due to natural convection of reactant raw material gases 4 on the susceptor as a heated region, while the mixture of raw material gases 4 flowed above the substrate. As clearly shown in Fig.2, it was found that the rotation number N of the vertical vortexes 12 became 1 rotation or less when the W/G ratio was 15 or larger. This means that a condition is achievable in which an impurity removed from the very leading edge of the substrate 1 into the surrounding gas phase does not incorporate back into the single crystalline thin film 2. Then, to verify the practical effect of the aforementioned conditions, a series of silicon single crystalline thin films 2 were grown to measure a transition width for each condition. The growth conditions were essentially the same as those of the aforementioned experiments on the investigation of the vertical vortexes 12. In these experiments, substrates 1 were exposed in a hydrogen atmosphere at 1190 °C for 90 seconds in order to clean the surfaces of the substrates 1 prior to the growth of the silicon single crystalline films 2. A period of time when a trichlorosilane mixed reaction gas is introduced into a reaction chamber 3 to grow a silicon single crystalline thin film 2 was set to be 1 min. Diborane as a dopant gas was mixed into the reactant raw material gas so that the resistivity of the silicon single crystalline thin film 2 is controlled to be 10 ohm · cm in p-type. In the above growth conditions, each of the silicon single crystalline thin films 2 grown to be about 3 µm in thickness was measured by secondary ion mass spectroscopy ( SIMS ) to investigate dopant concentration profile in the silicon single crystalline thin films 2 formed on the substrates 1. A relation between the transition width and the W/G ratio is shown in Fig.3. It was found from Fig.3 that the transition width was changed in a correlating manner to the change of W/G ratio, even if the condition of the reactant raw material gas was kept the same, and the transition width was not lowered further less than 0.5 µm. The lowest value of the transition width was determined by an out-diffusion in a solid occurring during a pretreatment for cleaning the surface of the substrate 1 and following the growth of a semiconductor crystalline thin film 2. That is, it was found that a silicon single crystalline thin film 2, in which the influence of autodoping was suppressed as much as possible and the transition width was small, could be grown when the W/G ratio was selected to be 15 or larger. Embodiment 2 Fig. 4 is a schematic sectional view of a reaction chamber 3 in a reactor of a second embodiment of the present invention. The reaction chamber 3 has a recess at a part of the bottom and a susceptor 9 is located in the recess 8. The W/G ratio is selected to be 15 or larger, where G indicates the distance from the main surface of a substrate 1 held on the susceptor 9 to the ceiling of the chamber thereabove. In the reaction chamber 3, because the main surface of the substrate 1 is level with the internal bottom surface other than the recess 8, when the substrate 1 is placed on the susceptor 9, a mixture of raw material gases 4 flows smoothly without any obstruction to the flow at the leading edge of the substrate 1 as well as at the leading edge of the susceptor 9, so that disturbance in the stream of the mixture of raw material gases 4 scarcely occurs and thus the objects of the present invention can be achieved. On the other hand, it may be possible to suppress a natural convection occurring between the main surface of a substrate and the ceiling of the chamber thereabove by the effect of an increased flow rate of a gas. However, an extremely large flow rate is required in order to effectively minimize the influence of autodoping. That is to say, to try to minimize a transition width by an increased gas flow rate is never a recommendable way from the view point of the production cost of a wafer with a chemical vapor deposition thin film thereon. The detailed description given in the embodiments 1 and 2 relates to a vapor phase epitaxial growth conducted to grow a silicon single crystalline thin film on a silicon single crystalline substrate. While a single substrate is used for explaining the above embodiments 1 and 2, the present invention can naturally be applicable to cases where a plurality of substrates are held in a reaction chamber only if they are located within an interval of ( L + W ) from the gas inlet of reactant raw material gas in the gas flowing direction. The present invention is also effective to grow a polycrystalline thin film on a substrate by chemical vapor deposition. In the method of chemical vapor deposition and the reactor therefor according to the present invention, as is made clear from the explanation above, a space above a substrate held in the reaction chamber is designed to be small and the location of a substrate is arranged within a certain interval in the reaction chamber, and thus the occurrence of natural convection in the space is suppressed. The suppression effect of natural convection in the space is effective to minimize autodoping caused by an impurity coming out from for example the back surface of a substrate during chemical vapor deposition and thus the transition width on a substrate is uniformly suppressed across the entire surface of the substrate.

Claims: A method of chemical vapor deposition in a cold-wall type reaction chamber (3) equipped with a gas inlet (5) for reactant raw material gas (4) at one end and a gas outlet (6) for reaction gas at the other end, installed generally horizontally, comprising holding a semiconductor substrate (1) in the chamber (3) with a main surface of the substrate (1) aligned generally horizontally, flowing reactant raw material gas (4) generally horizontally in one direction, heating the semiconductor substrate (1) to a temperature for growing a silicon crystalline film (2) on the semiconductor substrate (1), said temperature being sufficient to create natural convection between the semiconductor substrate (1) and internal side walls of the reaction chamber (3) due to temperature differences therebetween, and growing a silicon crystalline thin film (2) on the heated semiconductor substrate (1); characterized in that the substrate (1) is arranged in a range of (L + W) from the gas inlet (5) of the reactant raw material gas (4) in the flowing direction and in a location wherein a ratio of W/G is 15 or larger, where W indicates internal width of the reaction chamber (3), L indicates distance from the gas inlet (5) to the leading edge of the substrate (1) located at the most upstream position at the gas inlet side, and G indicates distance between the main surface of the substrate (1) and a ceiling of the chamber (3) thereabove. A method as claimed in Claim 1, characterized in that the semiconductor substrate (1) is so selected that the diameter thereof is less than the internal width W of the reaction chamber (3). A method as claimed in Claim 1 or 2, characterized in that each of the gaps (d1, d2) between the semiconductor substrate (1) and the internal side walls (7,7) of the chamber (3) is so selected as to be 3cm or wider. A reactor for chemical vapor deposition, comprising a cold-wall type reaction chamber (3) for growing a silicon crystalline thin film (2) on a heated semiconductor substrate (1) and equipped with a gas inlet (5) for reactant raw material gas (4) at one end and a gas outlet (6) for reaction gas at the other end for flowing reactant raw material gas (4) generally horizontally in one direction, installed generally horizontally, a supporting means for the semiconductor substrate (1) being held in the chamber (3) with a main surface of the substrate (1) aligned generally horizontally, and means for heating the semiconductor substrate (1) to a temperature for growing a silicon crystalline film (2) on the semiconductor substrate (1), said temperature being sufficient to create natural convection between the semiconductor substrate (1) and internal side walls of the reaction chamber (3) due to temperature differences there between; characterized in that the supporting means for the substrate (1) is arranged in a range of (L + W) from the gas inlet (5) of the reactant raw material gas (4) in the flowing direction and in a location wherein a ratio of W/G is 15 or larger, where W indicates internal width of the reaction chamber (3), L indicates distance from the gas inlet (5) to the leading edge of the substrate (1) located at the most upstream position at the gas inlet side, and G indicates distance between the main surface of the substrate (1) and a ceiling of the chamber (3) thereabove. A reactor for chemical vapor deposition, comprising a cold-wall type reaction chamber (3) for growing a silicon crystalline thin film (2) on a heated semiconductor substrate (1) and equipped with a gas inlet (5) for reactant raw material gas (4) at one end and a gas outlet (6) for reaction gas at the other end for flowing reactant raw material gas (4) generally horizontally in one direction, installed generally horizontally, a supporting means for the semiconductor substrate (1) being held in the chamber (3) with a main surface of the substrate (1) aligned generally horizontally, and means for heating the semiconductor substrate (1) to a temperature for growing a silicon crystalline film (2) on the semiconductor substrate (1), said temperature being sufficient to create natural convection between the semiconductor substrate (1) and internal side walls of the reaction chamber (3) due to temperature differences therebetween; characterized in that the dimensions of the reaction chamber (3) are so selected that the internal length thereof in the flowing direction of the reactant raw material gas (4) is longer than (L + W) and a ratio W/H is 15 or larger, where W indicates internal width of the reaction chamber (3), H indicates internal height of the chamber (3), and L indicates distance from the gas inlet (5) of the reactant raw material gas (4) to the leading edge of the substrate (1) located at the most upstream position at the gas inlet side.

Inventors: HABUKA HITOSHI, KATAYAMA MASATAKE, MAYUZUMI MASANORI, TATE NAOTO, HABUKA, HITOSHI, KATAYAMA, MASATAKE, MAYUZUMI, MASANORI, TATE, NAOTO
Applicants: SHINETSU HANDOTAI KK, SHIN-ETSU HANDOTAI COMPANY LIMITED
Application year: 1995
Main classification: C30B25
IPC codes: C23C16, C30B25, H01L21