An electronic component and its manufacturing method

Abstract: For the purpose of preventing the properties of an electronic element from changing, the present invention discloses a structure comprising: a framework having an opening plane on each of the first and second sides thereof; an electronic element mounted inside of said framework and provided with electrodes; a first plate directly joined onto said opening plane at the first side of the framework and provided with feedthrough holes thereon; a second plate directly joined onto said opening plane at the second side of the framework; conductors disposed inside of said feedthrough holes by hermetic sealing and connected to said electrodes; and external electrodes disposed on the outside surface of said first plate and connected to said conductors.

Description: BACKGROUND OF THE INVENTION [Field of Applications in Industry] This invention relates to an electronic component and its manufacturing method. [Prior Art] An electronic element such as a SAW filter, a SAW oscillator, a quartz vibrator or the like, for example, has been usually employing a structure wherein the corresponding electronic element is hermetically sealed in a container to prevent the characteristics thereof from being changed by the ambient conditions. Since it was a usual practice with the foregoing structures of the prior art electronic components to use an adhesive and soldering material for fixing a cover for the purpose of hermetically sealing the container and also mounting the electronic element itself, the adhesive and soldering material employed tended to affect the characteristics of the electronic element adversely. More specifically, part of the adhesive and soldering material is splashed and attached on the electronic element causing the characteristics thereof to change. SUMMARY The object of the present invention is to provide an electronic component, which is free of an impurity such as an adhesive and soldering material attached thereon, thereby its characteristics being prevented from changing, and also its manufacturing method. For achieving the foregoing object, the electronic component of the present invention comprises: a framework with its first side and second side left uncovered; an electronic element mounted inside of the framework, and provided with electrodes; a first plate directly fixed onto the foregoing first side of the framework, and provided with feedthrough holes; a second plate directly fixed onto the foregoing second side of the framework; conductors disposed inside of the foregoing feedthrough holes by hermetical sealing, and connected to the foregoing electrodes; and external electrodes disposed on the outside surface of the foregoing first plate, and connected to the foregoing conductors. The manufacturing method for the electronic component of the present invention comprises the steps of: (a) producing a framework with its first side and second side left uncovered by processing a base material on its first side and also its second side; (b) fixing a first plate on the first uncovered side of the foregoing framework; (c) mounting an electronic element inside of the foregoing framework; (d) fixing a second plate on the second uncovered side of the foregoing framework; and (e) performing a direct joining between the foregoing framework and first plate and also between the foregoing framework and second plate by heating the whole assembly obtained in the preceding steps. The electronic component of the present invention and its manufacturing method is disclosed in claims 1 and 10 respectively. Thus, the electronic element is hermetically sealed in a space formed by the framework, first plate and second plate. In this case, since the first plate and second plate are directly joined to the first side and second side of the framework, respectively, the characteristics changes that have been experienced with the prior art electronic element due to splashes of an adhesive and soldering material do not take place. Also, according to the foregoing manufacturing method, the first uncovered side and second uncovered side of the framework are formed by a processing applied to the base material separately, and no cracking or breakage of the framework is caused to occur on the surfaces thereof, where the framework comes into a direct contact with the first plate or the second plate. As a result, the direct joining between the framework and the first plate as well as the framework and the second plate is securely performed. More specifically, in case where the opening on the framework is formed by scraping from only the first side, burrs are created at the edges without fail, and the burrs are flown at the time of fixing the first or second plate to fill in the gaps between the framework and first plate, and also between the framework and second plate to interfere with the direct joining between the both respective bodies. In order to prevent creation of such burrs, the openings in the framework are formed by a machining process applied separately to the first side and second side of the framework. BRIEF DESCRIPTION OF DRAWINGS Fig. 1 is a cross-sectional view to show important structures of an electronic component as an exemplary embodiment of the present invention. Fig. 2 is an exploded perspective view of an electronic component as an exemplary embodiment of the present invention. Fig. 3 is a series of cross-sectional views to show a manufacturing process of a framework and a process of joining the framework with a first plate as an exemplary embodiment of the manufacturing method for an electronic component of the present invention. Fig. 4 is a series of cross-sectional views to show an electronic element mounting process and a process of joining a framework with a second plate as an exemplary embodiment of the manufacturing method for an electronic component of the present invention. Fig. 5 shows cross-sectional views of processes of conductor insertion as an exemplary embodiment of the manufacturing method for an electronic component of the present invention. Fig. 6 is a cross-sectional view to show an insertion process of conductors as another exemplary embodiment of the manufacturing method for an electronic component of the present invention. Fig. 7 is a cross-sectional view to show an insertion process of a conductor as still another exemplary embodiment of the manufacturing method for an electronic component of the present invention. Fig. 8 is a series of cross-sectional views to show another exemplary embodiment of the manufacturing method for an electronic component of the present invention. Fig. 9 is a cross-sectional view to show an insertion process of a conductor as another exemplary embodiment of the manufacturing method for an electronic component of the present invention. Fig. 10 is a cross-sectional view to show an insertion process of a conductor as still another exemplary embodiment of the manufacturing method for an electronic component of the present invention. Fig. 11 is a cross-sectional view to show an insertion process of a conductor as still another exemplary embodiment of the manufacturing method for an electronic component of the present invention. Fig. 12 is a series of cross-sectional views to show fabrication of an external electrode as an exemplary embodiment of the manufacturing method for an electronic component of the present invention. DETAILED DESCRIPTION OF THE INVENTION Next, a detailed description will be made on the present invention with the help of examples. Example 1 Fig. 1 is a cross-sectional view to show important structures of an electronic component as an example of the present invention, and Fig. 2 is a perspective view to show how the composing elements of the electronic component are assembled. In Fig. 1 and Fig. 2, a framework 1 is made of electrically insulating borosilicate glass, for example. Inside of an opening space 2 of the framework 1 is contained a SAW oscillator 3 as an electronic element, for example. A first plate 4 and second plate 5, both made of borosilicate glass, are directly joined to a first side opening plane and second side opening plane of the framework 1, respectively, each of which is situated on the respective side of the framework 1 and facing each other. Also, two feedthrough holes 6 and 7 are made in the first plate 4, and a conductor 8 is disposed inside of these feedthrough holes 6 and 7 and sealed hermetically. One end of the conductor 8 is respectively connected to electrodes 3a and 3b formed on the SAW oscillator 3, and the other end is connected to external electrodes 9 and 10 formed on the outside surface of the first plate 4. The framework 1 measures, for example, 2 mm wide and 4 mm long on the outside, and 1.4 mm wide and 3.2 mm long on the inside. The SAW oscillator 3 measures, for example, 1.3 mm wide and 3.1 mm long. The diameter of the feedthrough holes is, for example, 0.3 mm. The framework 1 measures 400 um thick, the first plate 4 measures 300 um thick, the second plate 5 measures 200 um thick and the SAW oscillator 3 measures 380 um thick. Since the SAW oscillator 3 is thinner than the framework 1, there is a space 13 formed without fail between the first side opening plane of the framework 1 and the inside surface of the first plate 4 as shown in Fig. 1. Therefore, the oscillation of the SAW oscillator 3 can not be interfered at all. Further, the conductor 8 is connected through this space 13 to the electrodes 3a and 3b. Although the SAW oscillator 3 is pressed towards the second plate 5 only by the conductor 8 at two places, any displacement of the SAW oscillator 3 in any directions, to and fro or right and left, on the second plate 5 does not occur. Accordingly, the SAW oscillator 3 can be hermetically sealed in the space formed by the framework 1, the first plate 4 and the second plate 5. In this case, the first plate 4 and second plate 5 are directly joined to the first side and second side of the framework 1, respectively, and any changes in the electronic element's characteristics due to splashes of an adhesive and soldering material as occurred with the prior art devices can not be observed. Since the opening space 2 in the framework 1 is made by a machining process applied from both the first side opening plane and second side opening plane, it is possible, as shown in Fig. 1, to make the approximately middle point, where the first side opening plane and second side opening plane of the framework 1 meet, stick out towards the SAW oscillator 3. The magnitude of the foregoing protrusion is not specifically defined, but it may extend as much as 100 um, for example. Accordingly, there will not be any burrs created by the machining process on the upper and lower edges of the opening space 2 in the framework 1. Therefore, the burrs are not falling between the framework 1 and the plates 4 and 5, thereby enabling the first side opening plane of the framework 1 and first plate 4, and the second side opening plane of the framework 1 and second plate 5 to join together perfectly. Besides, in Fig. 1, it is possible to dispose shielding electrodes 11 and 12 at a specified place on the outside surface or the inside surface of the first plate 4 and second plate 5, respectively, for the purpose of electromagnetic shielding. It is also possible to have recessed places 4a and 4b formed on both ends of the first plate 4, which are located apart from each other along the length thereof, and also to have end surface electrodes 9a and 10a, which form extensions of the external electrodes 9 and 10, respectively, disposed on the foregoing recessed places 4a and 4b. The electronic component of the present invention thus completed will be mounted on a printed wiring board by way of the external electrodes 9 and 10, or the end surface electrodes 9a and 10a disposed on the recessed places 4a and 4b. Example 2 In connection with the manufacturing method for an electronic component of the present invention, a case where a SAW oscillator is used as an electronic element of the electronic component will be explained. Fig. 3 through Fig. 12 are cross-sectional views to explain important portions of the manufacturing method for an electronic component as an exemplary embodiment of the present invention, and the reference numerals used in the foregoing figures are the same as those referred to in Fig. 1 and Fig. 2 used in explaining Example 1. With the present example, a plurality of identical electronic components are first fabricated on a wafer at a time so that all the electronic components are arranged orderly on the wafer surface lengthwise as well as breadthwise, and then the wafer is broken up into individual pieces of the electronic component. Fig. 3 through Fig. 12 deal with important portions of only one electronic component out of many formed on the wafer material. Example 2A First, the manufacturing method for a framework and the fixing process to put the framework together with plates will be explained with the help of Fig. 3. A mirror surfaced plate of a base material made of glass is processed from its first side plane 1a. Then, the base material is processed from its second side plane 1b to complete a framework 1 of specified configurations. As the foregoing processing means may be used, for example, sand blasting, scraping and the like. At this time, the processing is performed so that the approximately middle point, where the first side plane 1a and second side plane 1b of the framework 1 meet each other, is made to stick out towards inside of the framework 1. As a result, there will not be any burrs created on the upper and lower edges of the opening space in the framework 1. On the other hand, two feedthrough holes 6 and 7 are formed on a first plate 4 at specified positions thereof. The diameter of each respective feedthrough hole 6 or 7 varies from place to place along its length such that the diameter is smallest at the middle point of the hole's entire length and increases towards the both surfaces. Next, the first plate 4 having the two feedthrough holes 6 and 7 is fixed on the framework 1 to cover the first opening plane 1a. At this time, the surfaces, where the framework 1 and first plate 4 are put together, are mirror finished. With the present example, it is also possible to make the configuration of the feedthrough holes 6 and 7 so as to have each respective diameter thereof reduced towards the surface where the SAW oscillator 3 is mounted. Example 2B A mounting process of the SAW oscillator will be explained with the help of Fig. 4. The whole processes hereafter are performed in a dry nitrogen gas atmosphere. With the foregoing example 2A, the inside of the opening space 2 is depressurized by evacuating through the feedthrough holes 6 and 7. Under this condition, the SAW oscillator 3 having two electrodes 3a and 3b is held by sucking on its back side surface by means of a sucking jig 14, and lowered in position as illustrated in Fig. 4(A). When the SAW oscillator 3 is lowered in position halfway in the opening space 2, the lowering of the sucking jig 14 is stopped there and, at the same time, the sucking is ceased. Then, the SAW oscillator 3 is separated from the sucking jig 14 due to the depressurization of the oepning space 2 provided through the feedthrough holes 6 and 7, and falls on the first plate 4 as shown in Fig. 4(B). Since the foregoing fall of the SAW oscillator 3 extends over only a distance of 100 um, there will not be any damages inflicted on the SAW oscillator 3. Besides, the positions of the electrodes 3a and 3b of the SAW oscillator 3 match exactly with those of the feedthrough holes 6 and 7 exposed in the opening space 2, respectively. The two feedthrough holes 6 and 7 and two electrodes 3a and 3b are designed to be formed at positions opposite with each other, respectively. Under this state, the second plate 5 is fixed on the second side opening plane of the framework 1 as illustrated in Fig. 4(C). In order to assemble these together, the areas of the joining surfaces of the framework 1, first plate 4 and second plate 5, where these are put together, have to be kept mirror finished. Then, the entire assembly comprised of the framework 1, first plate 4, second plate 5 and SAW oscillator 3 is heated at 300 °C for 5 minutes. As a result, the framework 1 and first plate 4, and the framework 1 and second plate 5 are directly joined together on each respective joining surface in a perfect manner. Alternatively, it is possible first to press together the framework 1 and first plate 4, and the framework 1 and second plate 5, and then heat the resultant assembly. It is also possible, instead of employing a heating process, to press together and simultaneously heat the framework 1 and first plate 4, and the framework 1 and second plate 5. Thus, by applying pressure in addition to heating, joining between the framework 1 and both the plates 4 and 5 is performed more securely and effectively. More specifically, an application of a pressure to a joining surface results in secure and direct joining between two surfaces even when a small amount of dusts or the like exists on the joining surface because the areas surrounding the dusts or the like are strongly pressed and joined to gether. Example 2C Next, an insertion process of a conductor 8 will be explained with the help of Fig. 5. After the framework 1 and first plate 4, and the framework 1 and second plate 5 have been put together, respectively, as explained in the foregoing example, the assembly is turned upside down as shown in Fig. 5(A), and a spherical conductor 8 is placed in each of the feedthrough holes 6 and 7. Since the configuration of the feedthrough holes 6 and 7 is formed such that the diameter of each hole becomes larger towards both the upper and lower surfaces from a boundary line which is situated a little towards the bottom from the mid-point, and also the opening diameter on the outer surface of the first plate 4 is made larger than that on the inner surface thereof, the spherical conductor 8 rolls into each of the feedthrough holes 6 and 7 smoothly. Under this state, an ultrasonic joining head 15 is pressed on the conductor 8 as shown in Fig. 5(B). When ultrasonic vibrations are applied to the ultrasonic joining head 15, the spherical conductor 8 is softened thereby sealing the inside of each of the feedthrough holes 6 and 7. At the same time, electrical connections between the conductor 8 and the electrodes 3a and 3b formed on the SAW oscillator 3 are securely performed. As the conductor 8 is preferred to be a solder coated with at least one metal of oxygen affinity selected from Zn, Sb, Al, Ti, Si, Cu and Cd, for example. Accordingly, the metal of oxygen affinity is coupled with oxygen atoms existing on the inner surfaces of the feedthrough holes 6 and 7 of the first plate 4, and then further coupled with the solder. As a result, the feedthrough holes 6 and 7 are perfectly sealed by the conductor 8. The same effect as above can also be obtained by mixing the solder with the foregoing metals of oxygen affinity. Besides, the tip of the ultrasonic joining head 15 is preferred to be concaved as indicated by 16 in Fig. 5(B). This concaved curvature helps the conductor 8 be pressed downwards along the feedthrough holes 6 and 7 smoothly, resulting in prevention of the conductor 8 from flowing out of the feedthrough holes 6 and 7. When the feedthrough holes 6 and 7 are hermetically sealed by the conductor 8, a dry nitrogen gas can be filled in the space enclosed by the first plate 4, second plate 5 and framework 1 with a resulting effect of preventing the foregoing enclosed space from suffering a moisture condensation encountered under a low temperature operation. It is further possible to make the configuration of the feedthrough holes 6a and 7a such that the diameter thereof increases from the mid-point of the feedthrough holes towards the surfaces of the plate 4 as illustrated in Fig. 6. Also, as shown in Fig. 7, the configuration of the feedthrough holes 6b and 7b can be formed so that the diameter thereof is smaller at the side of SAW oscillator 3 than that at the opposite side. In place of a spherical conductor 8, a pulverized or granular conductor 8a as shown in Fig. 6, or a linear or columnar conductor 8b as shown in Fig. 7 can also be used. Example 2D Another exemplary embodiment of the present invention in connection with the insertion process of the conductor 8 will be explained with the help of Fig. 8. With the present example, a SAW oscillator is mounted after a conductor has been inserted into a feedthrough hole of a first plate. As shown in Fig. 8, a first plate 4, which has two feedthrough holes 6c and 7c, is first made to adhere to the first side opening plane 1a of the framework 1. Each of the two feedthrough holes 6c and 7c has a larger diameter at the side where a SAW oscillator 3 is mounted than the diameter at the opposite side. A spherical conductor 8 is made to roll into each of the feedthrough holes 6c and 7c from the side having a larger diameter. Then, the SAW oscillator 3 is placed and fixed inside of the framework 1 so that the electrodes 3a and 3b formed on the SAW oscillator 3 are made to attach to each of the conductor 8. A second plate 5 is then disposed on the second side opening plane of the framework 1. Subsequently, the whole assembly is heated to 300 °C to complete integration through joining the framework 1 directly to the first plate 4 and second plate 5 at the respective contacting surfaces. Fig. 9 is an enlarged view of an important part of the manufacturing process of Fig. 8. Upon heating the whole assembly as in the foregoing, the conductor 8 is softened to seal off the feedthrough holes 6c and 7c, and, at the same time, is melted and fused with the electrodes 3a and 3b to complete the electrical connections therebetween. It is also possible, as shown in Fig. 10, to insert an ultrasonic joining jig 15 into each of the feedthrough holes 6c and 7c from the smaller diameter side thereof, and soften the conductor 8 by applying ultrasonic vibrations to make certain the sealing of the feedthrough holes 6c and 7c, and also the connections with the electrodes 3a and 3b. Example 2E Still another exemplary embodiment of the present invention in connection with the conductor 8 will be explained with the help of Fig. 11. Fig. 11 shows a structure wherein a conductor 8c is bump formed on an electrode 3a or electrode 3b. After the conductor 8c has been inserted into the feedthrough holes 6c and 7c, it is softened by heating or use of an ultrasonic joining jig to seal off the feedthrough holes 6c and 7c in the same way as descrobed in Example 2D, differing therefrom only in that the conductor 8c has already been put together with the electrodes 3a and 3b at the time of bump forming. Example 2F Next, an exemplary embodiment of the present invention inconnection with a process, whereby external electrodes and end surface electrodes are formed, will be explained. With the manufacturing process as illustrated in Fig. 4 or Fig. 8, a plurality of identical electronic components are first fabricated on a wafer at a time so that all the electronic components are arranged orderly on the wafer surface lengthwise as well as breadthwise (9 rows by 15 lines, all together 135 pieces, for example), and then the wafer is broken up into individual pieces of the electronic component. Fig. 12 shows cross-sectional views of important portions of a recessed place 4a of No. 1 electronic component and a recessed place 4b of No. 2 electronic component. The foregoing No. 1 and No. 2 electronic components are the two neighboring electronic components among many formed on a wafer in an orderly manner as explained above. A concaved area is created between the foregoing two neighboring electronic components at the place, where the two neighboring electronic components are separated by cutting and also where the would-be recessed place 4a of No. 1 electronic component and the would-be recessed place 4b of No. 2 electronic component meet each other. The concaved area is formed by sand blasting at the same time when the feedthrough holes 6 and 7 are formed. As shown in Fig. 12(A), an electrode film 17 is first formed over the surface of a first plate 4 by applying an electro-conductive material through a continuous printing method. As the electro-conductive material can be used a resin paste containing copper powder, for example. Consequently, the electrode film 17 covers the recessed places 4a and 4b of the first plate 4 with a vacant space formed thereon. Then, the entire body in the state of Fig. 12(A) is placed in a vacuum chamber. Subsequently, the electrode film 17 covering the recessed places 4a and 4b is expanded, as shown in Fig. 12(B), and finally ruptured. Part of the ruptured electrode film 17 is disposed on the end surfaces of the recessed places 4a and 4b. As a result, as shown in Fig. 12(C), end surface electrodes 9a and 10a are formed on the recessed places 4a and 4b, respectively. Afterwards, each individual electronic component is separated by cutting along the broken lines 18 by means of a method of dicing or the like. Accordingly, external electrodes 9 and 10 and also end surface electrodes 9a and 10a are formed over the surface of the first plate 4. Besides, a shielding electrode 11 can be formed at the same time according to the foregoing external electrode forming process. In this case, a resin paste is applied by use of a specified mask. Also, another shielding electrode 12 can be formed at a specified place on the outer surface of the second plate by applying a resin paste containing copper powder. It is further possible to employ a scribing method instead of the dicing method for separating the electronic components. In this case, a more number of the electronic components can be produced from a given size of wafer because of thinner cutting lines. A SAW oscillator has been used as an electronic element with the foregoing Examples 1 to 2F, but a SWA filter or an oscillator such as a quartz oscillator and the like can also be used in place of the SAW oscillator. In addition, instead of borosilicate glass as used for the framework 1, the first plate 4 and the second plate 5, such electrically insulating materials as glass like soda glass and the like, and crystals like quartz, silicon or the like can also be used. Instead of sand blasting, an ultrasonic processing method can also be used to work on the framework. All in all, the same effect can be expected from those alternative materials and methods as observed in the foregoing examples.

Claims: An electronic component comprising: a case (1, 4, 5) in which feedthrough holes (6,7) are formed, an electronic element (3) having an electrodes (3a, 3b) disposed within said case, external electrodes (9, 10) disposed on an outside of said case, and conductors (8) disposed inside of said feedthrough holes for connecting said electrodes and said external electrodes, characterized in that said case includes a framework (1), a first plate (4) and a second plate (5), each of said framework, said first plate and said second plate is formed independently from each other, said framework has an opening space (2), between a first side and a second side thereof, an inner peripheral surface of said framework is slanting with a ridge situated at a place between said first side and said second side of said framework and protruding toward an inside direction of said framework, each of said first side and said second side of said framework has a surface without burrs, said framework being produced by working on said base material from both said first side and said second side, said first plate (4) is directly joined while covering said opening at said first side of said framework, said second plate is directly joined while covering said opening at said second side of said framework; said second plate has a flattened surface, and said electronic component is placed on said flattened surface of said second plate and inside of said framework. The electronic component according to Claim 1, wherein said framework, first plate and second plate are formed of glass. The electronic component according to Claim 1, wherein the thickness of said first plate and that of said second plate are almost the same. The electronic component according to Claim 1, wherein the thickness of the first plate having said feedthrough holes is made larger than that of said second plate. The electronic component according to Claim 1, wherein the thickness of said framework is made larger than that of said electronic element. The electronic component according to Claim 1, wherein said feedthrough holes are made to have larger diameters on the side where said electronic element is mounted than the diameters of the opposite side. The electronic component according to Claim 1, wherein said conductors are formed of solder and a metal of oxygen affinity covering said solder. The electronic component according to Claim 7, wherein said metal of oxygen affinity comprises at least one metal selected from Zn, Sb, Al, Ti, Si, Cu and Cd. The electronic component according to claim 1, wherein said opening space of said framework is prepared by working on both sides of said first side and said second side. A manufacturing method for an electronic component comprising: producing a case (1, 4, 5), and mounting an electronic element (3) inside of said case characterized by the steps of: a) producing a framework (1) having a first side, a second side and an opening space (2) by working on a base material from both said first side and said second side, and forming a first side surface without burrs and a second side surface without burrs of said framework, wherein the framework has an inner peripheral surface with a slanting ridge between said first and second side of said framework protruding toward an inside direction of said framework, b) fixing directly a first plate (4) having feedthrough holes onto said first side surface without burrs of said framework while covering said opening space, c) fixing directly a second place (5) onto said second side surface without burrs of said framework while covering said opening space, wherein said second plate has a flattened surface, and d) placing said electronic element having electrodes for connection to external electrodes through said feedthrough holes on said second plate and inside of said framework. The manufacturing method according to claim 10, wherein said framework, said first plate and said second plate are formed of glass. The manufacturing method according to claim 10, wherein said (b) step and said (c) step includes the steps of assembling a whole assembly by each of said first plate and said second plate mounted to said framework, and heating said whole assembly while a pressing force is applied to said whole assembly. The manufacturing method according to claim 10, wherein said (b) step includes a step of pressing said first plate and said framework, and thereafter heating said first plate and said framework, and said (c) step includes a step of pressing said second plate and said framework, and thereafter heating said second plate and said framework. The manufacturing method according to claim 10, further comprising a step of disposing a conductor in a feedthrough hole formed said first plate with connecting an electrode of said electronic element, wherein after said electronic element mounted in said framework, said conductor is disposed in said feedthorugh hole. The manufacturing method according to claim 14, wherein said electronic element is mounted inside said framework while the inside of said framework being kept under a condition of a negative atmosphere pressure. The manufacturing method according to claim 14, wherein the step of disposing said conductor includes a step of placing said conductor in said feedthrough hole, and thereafter performing connections between said conductor and said electrode, while at the same time said feedthrough hole being sealed, by said conductor melted by an ultrasonic joining jig used against said conductor. The manufacturing method for an electronic component according to Claim 16, wherein the tip of said ultrasonic joining jig has a concaved shape. The manufacturing method for an electronic component according to Claim 14, wherein the diameters of said feedthrough holes are larger at the side of said electronic element than at the opposite side thereof. The manufacturing method according to claim 14, wherein said (b) step and said (c) step includes the steps of assembling a whole assembly by each of said first plate and said second plate to mounted to said framework, and heating said whole assembly while a pressing force being applied to said whole assembly. The manufacturing method according to claim 10, further comprising a step of disposing a conductor in a feedthorugh hole formed in said first plate for connecting an electrode of said electronic element with an external electrode, wherein after said conductor is disposed in said feedthrough hole, said electronic element mounted in said framework. The manufacturing method for an electronic component according to Claim 20, wherein the diameters of said feedthrough holes are larger at the side of said electronic element than at the opposite side thereof. The manufacturing method according to claim 20, further comprising a step of performing a perfect sealing on said feedthrough hole by inserting an ultrasonic joining jig to reach and contact said conductor and by melting said conductor, and at the same time performing a perfect connection between said conductor and said electrode. The manufacturing method according to claim 20, wherein said (b) step and said (c) step includes the steps of assembling a whole assembly by each of said first plate and said second plate to mounted to said framework, and heating said whole assembly while a pressing force being applied to said whole assembly. The manufacturing method according to claim 10, 14 or 20, further comprising a step of disposing an end surface electrode (9a, 10a) on an outer surface of said case, wherein said first plate has a feedthrough and a concaved recess. The manufacturing method according to claim 24, wherein said step of disposing said end surface electrode includes forming a concaved place at said first plate, and said end surface electrode is disposed on said concaved recess. The electronic component according to claim 1, wherein said second plate has at least one surface which is flat and even which also forms a bottom of said case, and said electronic element is disposed on said one surface. The electronic component according to claim 1, wherein said electronic element has at least one of a SAW filter, a Saw oscillator, a quartz vibrator. The electronic component according to claim 9, further comprising an end surface electrode (9a, 10a) on an outer surface of said case. The manufacturing method according to claim 10, wherein said second plate has at least one surface which is flat and even, a side of said second plate which is fixed to said framework, and a bottom of said case which is formed of said one surface. The manufacturing method according to claim 10, wherein said electronic element has at least one of a SAW filter, a Saw oscillator, and a quartz vibrator.

Inventors: ANDO DAIZO, NAKAMURA TADASHI, OISHI KUNIHIKO, UMEDA SHINJI, ANDO, DAIZO, NAKAMURA, TADASHI, OISHI, KUNIHIKO, UMEDA, SHINJI
Applicants: MATSUSHITA ELECTRIC IND CO LTD, MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Application year: 1995
Main classification: H03H9
IPC codes: H03H9, H03H3