THERMAL STABILIZED RESIN COMPOSITIONS

Abstract: Thermally stabilized resin compositions are provided which contain one or more cyclic iminoether compounds represented by formula (I), cyclic iminoester compounds represented by formula (II), or both and an amine thermal stabilizer, wherein X is as described herein, and A and B are each, independently, a single bond, substituted or unsubstituted alkylene selected from the group consisting of methylene, ethylene, propylene, butylene, 1-methylethylene, 1,1-dimethylethylene, 1,2-dimethylene, 1-ethylethylene, 1,1-diethylethylene, 1-propylethylene, 1-butylene, 1-hexylethylene, and 1-methyltrimethylene.

Description: HAL STABILIZED RESIN COMPOS ! T I QMS TECHNICAL FIELD: The present invention relates to stabilized resin compositions. More particulary, the invention relates to stabilized resin composi¬ tions having excellent stability to deterioration by thermal oxidation. BACKGROUND ART: Many polymer materials tend to deteriorate to low molecular weight chains upon exposure to heat or light due to thermal oxidation with oxygen. Thermal oxidation depends on the structure of the resins, and it is possible to estimate the difference in thermal stability based on the difference in structure. Moreover, the thermal stability requirements of a single resin will often depend on its intended use, since the environment in which the resin is used, particularly the temperature and light conditions, can differ depending on the use of the final product made from the resin. Another factor which can dominate the thermal stability require ¬ ment is whether the resin will be used in a molding process. Even when molding materials are used in circumstances that are not normally extreme, it is essential to give thermal stability to a resin when it is molded at a temperature which is close to or higher than its degradation temperature. For example, even when a partial structure of an aromatic polymer has excellent thermal stability and stiffness due to its high glass transition temperature, many problems can be encountered comm¬ ercially because the resin degradation temperature is similar to the processing temperature. Some resins having a polar site in their chain structure, or having an extremely low glass transition temperature, also have ther¬ mal stability problems when molded or used. These differences in thermal stability, even in resins having the same structure, act as a quality difference which can dominate the competitiveness of commodities made from such resins. s One solution which has been proposed is to incorporate stabilizers (thermal stabilizer, UV stabilizer) into resins in order to improve their stability. Stabilizers such as thermal stabilizers, UV stabilizers, hydroly- sis stabilizers, and antistatic agents have been developed and it is possible to choose them based on the product end use and/or the parti¬ cular type of stability desired, i.e., heat or light stability. Generally, the most frequently encountered form of degradation is from heat, especially when the resin is molded or used. Accordingly, various methods have been proposed in order to improve the thermal stability of resins such as modification of resin structure and addi¬ tion of stabilizers. U.S. Patent No. 3,723,427 discloses a tris(hydroxylbenzyl) cyan- urate stabilizer also known as a hindered phenolic primary thermal stabilizer. U.S. Patent No. 3,758,549 proposes a thioester type secondary thermal stabilizer and discloses mixing the secondary stabi ¬ lizer with a phenolic primary thermal stabilizer. U.S. Patent No. 3,966,675 and No. 4,414,408 disclose improving resin stability by mixing a primary stabilizer with a secondary stabi- lizer to provide a "synergistic" effect. U.S. Patent No. 4,069,200 discloses a method to improve the ther¬ mal stability of polyolefin resin by using a single hindered phenol primary thermal stabilizer, such as 6-t-buty1-2,3-dimethy1-4-(dime¬ thylaminomethyl.-phenol, 6-t-octyl-2,3-dimethyl-4-(dimethylaminomethyl )-phenol, 6-t-butyl-4-(dimethylaminomethyl)-5,6,7,8-tetrahydro-l-naph- thol, 5-t-butyl-2,3-dimethyl-4-hydroxybenzylphosphonate or by mixing the above-mentioned hindered phenol type primary thermal stabilizer with a thioester type secondary thermal stabilizer such as dilaurylthiodipropionate or distearylthiodipropionate. U.S. Patent No. 4,185,003 discloses a method to improve the stability of a copolyetherester by mixing a phenol type thermal stabi¬ lizer such as N,N'-hexamethylenebis(3,5-di-t-butyl-4-hydroxyhydroci- nnamide) with hindered amine light stabilizer. U.S. Patent No. 4,405,749 seeks to improve the stability of a polyester resin by using l,3,5-tris-(2-hydroxyethyl)-s-triazine-2,4,6 -(lH,3H,5H)trion and an ester of 3,5-di-t-butyl-4-hydroxyhydrocinnamic acid. Japanese Patent No. 88-38371 proposes a method for preparing a stabilizer having a high content of the dimer of 2,2,4-trimethyl-l,2- dihydroquinoline. Japanese Patent No. 88-40817 discloses a method to use these 2,2,4-trimethyl-l,2-dihydroquinoline type compounds and a phenothiadine type compound. And Japanese Patent No. 88-40819 proposes a method to improve resin stability by mixing a 2,2,4-trimethyl-l,2-dihydroquinoline type compound and 2-mercaptobenzoimidazole or 2-mercaptomethylbenzoimida- zole into the resin. DISCLOSURE OF INVENTION _ Accordingly, one object of the present invention is to provide thermally stabilized resin compositions which provide significant improvements in the thermal stability, compared to the use of conven¬ tional thermal stabilizers, by the addition of a combination of a thermal stabilizer with either or both of a cyclic iminoether or iminoester compound. This and other objects of the present invention have been satis¬ fied by the discovery that the addition of a cyclic iminoether, a cyclic iminoester, or both, in combination with an amine thermal stab- lizer provides resin compositions having improved thermal stability compared to conventionally stabilized resins. The present invention relates to thermally stabilized compositions which comprise, as a thermal stabilizer, one or more cyclic iminoether compounds or cyclic iminoester compounds and an amine compound. The cyclic iminoether or iminoester and amine compounds of the present invention are added to the resin in an amount sufficient to provide thermal stability. Preferably, 0.02~5.0 wt% of one or more cyclic iminoether com¬ pounds represented by formula ( I ) or cyclic iminoester compounds represented by formula (II) and 0.02~3.0 wt% of an amine compound are added to the resin as thermal stabilizer: ( I ) ( II ) Wherein, X is a single bond or a divalent organic group selected from C ,~C,e.alkylene, arylene selected from the group consisting of phenylene, naphthalene, and biphenylene, cyclic alkylene selected from the group consisting of cyclohexylene and eyelohexanedimethylene and C ,~Cιoalkylene containing a hetero atom, A and B are each, independently, a single bond, substituted or unsubstituted alkylene selected from the group consisting of methy ¬ lene, ethylene, propylene, butylene, 1-methylethylene, 1,1-dimethyle¬ thylene, 1,2-dimethylene, 1-ethylethylene, 1,1-diethylethylene, 1-pro¬ pylethylene, 1-butylene, 1-hexylethylene, and 1-methyltrimethylene. Preferably, X is a single bond or phenylene. X is most preferably a para-phenylene ring when it is to be used in resins having a high melting point since the para phenylene com¬ pounds have high melting points themselves. When low melting point resins are used, X is preferably metaphenylene. X can also be a group of formula (UI). -C-N-Y-N-C- II I I II O R . R .0 (ffl) Wherein, R , and R , are each, independently, selected from the group consisting of hydrogen, methyl, ethyl, propyl , butyl, hexyl, octyl, decyl, phenyl, tolyl, cyclohexyl, and benzyl. Y is a divalent organic group selected from the group consisting of ethylene, propylene, butylene, pentamethylene, hexamethylene, octamethylene, nonamethylene, decamethylene, phenylene, naphthalene and diphenylene or a group of formula (IV). (IV) Wherein, Z is a member selected from the group consisting of -0-, -CO-, -S-, -SO .-, -CH .-, -CH 2 CH 2 -. or -C(CH 3 ) 2 -, cyclopenty- lene, eyelohexylene, methylene-phenylene and methylene-phenylene- methylene. The iminoether rings or iminoester rings preferably have 5~7 membered rings, and A and B can be the same or different. In the present invention, the thermal stability of resins is sur- prisingly and significantly improved due to a synergistic effect caused by mixing the cycloiminoether and/or cycloiminoester compounds with the amine compounds. The total amount of thermal stabilizer (total of cycloiminoether, cycloiminoester and amine) added for improving thermal stability is ' 0.04~6.0% by weight of resin. When the total amount is less than 0.04% by weight, no significant improvement in thermal stability is seen. When the amount exceeds 6.0% by weight, any additional improvement in thermal stability is not proportional to the additional amount of additives used (i.e., the added costs outweigh the added benefits). There are many commercially available grafted resins which already contain a cycliciminoether or cycliciminoester. These include polystyrene or polyacrylonitrile grafted vith a cyclic imino- ether. Such grafted resins can be used in the plane of the cyclic iminoether ( I ) or iminoester ( II ) of the present invention. Cyclic iminoether compounds that can be used in the present invention are known as bisoxazoline compounds when the number of car- bon atoms in each of A and B is 2, and are known as bis(5,6-dihydro -oxazines) when A and B have 3 carbons each. Suitable cycloimino- ethers for use alone, or in mixtures of two or more, include 2,2'-bis (2-oxazoline), 2,2'-bis(4-methyl-2-oxazoline), 2,2'-bis(4,4-dimethyl-2 -oxazoline), 2,2'-bis(4-ethyl-2-oxazoline), 2,2'-bis(4,4-diethyl-2- oxazoline), 2,2'-bis(4-propyl-2-oxazoline), 2,2'-bis(4-butyl-2-oxazo- line), 2,2'-bis(4-hexyl-2-oxazoline), 2,2'-bis(4-phenyl-2-oxazoline), 2,2'-bis(4-cyclohexyl-2-oxazoline), 2,2'-bis(5,6-dihydro-4H-l,3-. oxazine), 2,2'-bis(4-methyl-5,6-dihydro-4H-l,3-oxazine), 2,2'-bis( 4-ethyl-5,6-dihydro-4H-l,3-oxazine), 2,2'-bis(4,4-dimethy1-5,6- dihydro-4H-l,3-oxazine), 2,2'-o-phenylenebis(2-oxazoline), 2,2'-m-phenylenebis(2-oxazoline), 2,2'-p-pheny1enebis(4-methy1-2-oxazo1ine), 2,2'-p-ρhenylenebis(4,4-dimethy1-2-oxazoline), 2,2'-m-phenylenebis(4-methyl-2-oxazoline), 2,2'-m-phenylenebis(4,4-dimethy1-2-oxazoline), 2,2'-ethylenebis(2-oxazoline), 2,2'-tetramethylenebis(2-oxazoline), 2,2'-hexamethylenebis(2-oxazoline), 2,2'-octamethylenebis(2-oxazoline), 2,2'-decamethylenebis(2-oxazoline), 2,2'-ethy1enebis(4-methy1-2-oxazo1ine), 2,2'-tetramethylenebis(4-methyl-2-oxazoline), 2,2'-hexamethylenebis(4-methyl-2-oxazoline), 2,2'-octamethylenebis(4-methyl-2-oxazoline), 2,2'-decamethylenebis(4-methyl-2-oxazoline), 2,2'-ethylenebis(4,4 ' -dimethyl-2-oxazoline), 2,2'-tetramethylenebis(4,4 ' -dimethyl-2-oxazoline), 2,2 -hexamethylenebis(4,4 ' -dimethy1-2-oxazoline). 2,2 -octamethylenebis(4,4 ' -dimethy1-2-oxazoline), 2,2 -decamethylenebis(4,4 ' -dimethy1-2-oxazoline), 2,2 -diphenoxyethanebis(2-oxazoline), 2,2 -dieye1ohexy1enebis(2-oxazoline), 2,2 -diphenylenebis(4-methy1-2-oxazoline), N,N -ethylenebis(2-carbamoyl-2-oxazoline), N.N -trimethylenebis(2-carbamoyl-2-oxazoline), N,N -tetramethylenebis(2-carbamoyl-2-oxazoline), N,N -hexamethylenebis(2-carbamoyl-2-oxazoline), N,N -octamethy1enebis(2-carbamoy1-2-oxazo1ine), N,N -decamethylenebis(2-carbamoy1-2-oxazoline), N.N -phenylenebis(2-carbamoyl-2-oxazoline), N,N -ethylenebis(2-carbamoy1-4-methy1-2-oxazoline), N,N -tetramethylenebis(2-carbamoy1-4,4-dimethyl-2-oxazoline), N.N -ethylenebis(2-carbamoy1-5,6-dihydro-4H-l,3-oxazine), N.N -trimethylenebis(2-carbamoy1-5,6-dihydro-4H-l,3-oxazine), N.N -tetramethylenebis(2-carbamoyl-5,6-dihydro-4H-l,3-oxazine), N.N -hexamethylenebis(2-carbamoyl-5,6-dihydro-4H-l,3-oxazine), N.N -octamethylenebis(2-carbamoy1-5,6-dihydro-4H-l,3-oxazine), N.N -decamethylenebis(2-carbamoyl-5,6-dihydro-4H-l,3-oxazine), N.N -phenylenebis(2-carbamoy1-5,6-dihydro-4H-l,3-oxazine), N,N -ethylenebis(2-carbamoy1-4-methy1-5,6-dihydro-4H-l,3-oxazine), N,N -hexamethylenebis(2-carbamoyl-4,4-dimethy1-5,6-dihydro-4H-l,3 -oxazine), N,N -dimethyl-N,N ' -ethylenebis(2-carbamoyl-2-oxazoline), N,N -dimethyl-N,N ' -tetramethylenebis(2-carbamoyl-2-oxazoline), N,N -dimethy1-N,N'-tetra-nethylenebis(5.6-dihydro-4H-l,3-oxazine), 2,2 -ethylenebis(5,6-dihydro-4H-l,3-oxazine), 2,2 -prophylenebis(5,6-dihydro-4H-l,3-oxazine), 2,2 -hexamethylenebis(5,6-dihydro-4H-l,3-oxazine), 2.2 -p-phenylenebis(5,6-dihydro-4H-l,3-oxazine), 2,2 -m-phenylenebis(5,6-dihydro-4H-l,3-oxazine), 2,2'-naphthy1enebis(5,6-dihydro-4H-1,3-oxazine), and 2,2'-p,p'-diphenylenebis(5,6-dihydro-4H-l,3-oxazine). Cycloiminoester compounds represented by formula ( II ) of the present invention, which can be used alone or in combinations of two or more, include 2,2'-bis(3,l-benzooxazine-4-on), 2,2'-methylenebis(3,l-benzooxazine-4-on) , 2,2'-ethylenebis(3,l-benzooxazine-4-on), 2,2'-hexamethylenebis(3,l-benzooxazine-4-on), 2,2'-octamethylenebis(3,l-benzooxazine-4-on), 2,2'-decamethylenebis(3,l-benzooxazine-4-on), 2,2'-p-phenylenebis(3,l-benzooxazine-4-on), 2,2'-m-phenylenebis(3,l-benzooxazine-4-on), 2,2'-naphthylenebis(3,l-benzooxazine-4-on), 2,2'-(4,4'-diphenylene)bis(3,l-benzooxazine-4-on), 2,2'-(1,4-cyclohexylene)bis(3,l-benzooxazine-4-on), 2,2'-bis(4.5-dihydro-l,3,6H-oxazine-6-on), 2,2'-p-pheny1enebis(4,5-dihydro-1,3,6H-oxazine-6-on), 2,2'-p-phenylenebis(4-methyl-5-hydro-l,3,6H-oxazine-6-on), 2,2'-p-phenylenebis(5(4H)-oxazolon), 2,2'-tetramethylenebis(4-methyl-5(4H)-oxazolon), 2,2'-hexamethylenebis(4-methyl-5(4H)-oxazolon), 2,2'-tetramethylenebis(4,4-dimethyl-5(4H)-oxazolon), 2,2'-hexamethylenebis(4,4-dimethyl-5(4H)-oxazolon), and 2,2'-p-phenylenebis(4,4-dimethyl-5(4H)-oxazolon). If the cycloiminoether or cycloiminoester compound is used alone, the thermal stability of the resin is slightly improved while mole¬ cular weight is increased due to reaction with the polymer chain. But if an amine thermal stabilizer is used in admixture with the cycloiminoether or cycloiminoester of the present invention, the resin has significantly improved thermal stability compared to the thermal stability obtained by using conventional thermal stabilizers. Suitable amine thermal stabilizers include 2,2,4-trimethyl-l,2- -dihydroquinoline (a conventional thermal stabilizer) or its polymer, phenyl-( 9-naphthyl)amine, phenyl-( α-naphthyl)amine, α-naphthylamine , N,N'-di-sec-butyl-p-phenylenediamine. N,N'-diphenyl-p-pneylenediami- ne, N,N'-di- 3-naphthyl-p-phenylenediamine, 4,4'-tetramethyldiaminodi phenylmethane, aldol- a-naphthylamino, N,N'-bis(l-methyl-heptyl)-p-ph enylenediamine, N,N'-bis(l-ethyl-3-methylphenyl)-p-phenylenediamine, p-iso-propoxyldiphenylamine, 6-ethoxy-2, 2,4-trimethyl-l,2-dihydroquin oline, N-phenyl-N'-isopropyl-p-phenylenediamine, 4,4'-bis(4-α , α-di methylbenzoyl)diphenylamine, 2,6-di-t-butyl-α-dimethylamino-p-cresol, N-cyclohexyl-N'-phenyl-p-phenylenediamine, dioctyl-p-phenylenediamine, phenylhexyl-p-phenylenediamine, phenyl-octyl-p-phenylenediamine, dihep tyl-p-phenylenediamine, oxalylbis(benzylidenedihydrazide), 6-(4-hy droxy-3,5-di-t-butylani1ino)-2,4-bisocty1-thio-l,3,5-triazine, 3-(N- salicyloyl)amino-l,2,4-triazole, p.p'-dioctyl diphenylamine, di-o-to lyl-guanidine salt of dicatecholborate, di-o-tollthiourea, thiocarba nilide, zinc diethyl dithiocarbamate, 2-mercaptobenzimidazole, zinc 2-mercaptobenzimidazolate, 2-mercaptomethylbenzimidazole, zinc 2-mer captomethylbenzimidazolate, N-l,3-dimethylbutyl-N'-phenyl-p-phenylene diamine. diethylhydroxylamine, 1,3-dibutylthiourea, 1,3-diethylth iourea, phenothiazine, N-(2-ethyl-phenyl-)-N'-(2-ethoxy-5-t-butylphe noDoxalic acid diamine, o-tolyl-biguanide, N.N'-diphenylethylenedia mine, N,N'-diphenyl propylenediamine, N,N'-di-o-tolyl-ethylenediamine, N-lauryl-p-aminophenol, N-stearyl-p-aminophenol, ethylenethiourea, p.p -dimethoxydiphenylamine, N-octyl-N'-phenyl-p-phenylenediamine and N.N' -di-(1,4-dimethy1-pentyl)-p-phenylenediamine. Resins which are stabilized by the composition of the present invention include most conventional thermoplastic and thermosetting resins. Suitable resins include conventional plastics such as poly¬ ethylene LLDPE(1inear low density polyethylene), polypropylene, poly- butylene, polystyrene, polyvinylchloride, polyacrylonitrile, and ABS (acrylonitrile-butadiene-styrene), engineering plastics such as poly- acetal, polyester, polyamide, polycarbonate, and polyphenylene oxide, rubbers such as natural rubber, butadiene rubber, nitrile rubber, isoprene, chloroprene and acryl rubber, thermoplastic elastomers such as styrene-butadiene elastomer, urethane elastomer, olefin elastomer, ester elastomer and amide elastomer, and mixtures of these resins. The best improvements in thermal stability are seen when the thermal stabilizers of the present invention are added to resins having a carboxyl group in the molecular chain, such as polyesters, and to resins having an amine end group in the chain, such as poly- amides and polyurethanes. Engineering plastics such as rubber, thermoplastic elastomer, polyester and polyamide are especially stabilized by the compositions of the present invention. In preparing the compositions of the present invention, the thermal stabilizers of formula ( I ), formula(II) and the amine thermal stabilizers can be added either during the polymerization of the resin used in the composition, or after the resin has been prepared. If the stabilizers are added after polymerization of the resin, the stabili¬ zers can be added using an intensive mixing means, such as a single or twin screw extruder, with the stabilizers being added through either the primary opening along with the resin, or through a secondary open^ ing along the extruder path. Having generally described this invention, a further understanding can be obtained by reference to certain specific examples which are provided herein for purposes of illustration only and are not intended to be limiting unless otherwise specified. EXAMPLES The various properties in the examples and comparative examples were measured in accordance with the following procedures. 1. Tensile strength(kg/α-): measured by ASTM-D-638 2. Elongation(%): measured by ASTM-D-638 3. Impact strength(kg • αn/cπ): measured by ASTM-D-256(NOTCHED IZOD method) 4. Thermal stability(%): After being heat-treated at specific temperature for specific time, thermal stability is expressed as the ratio of maintained properties to initial properties. Measured properties, temperature and time are varied according to materials. In the examples presented herein, the following symbols have the meanings given below. 1. A0N(amine type thermal stabilizer) 2,2,4-trimethyl-l,2-dihydroquinoline polymerized 2,2,4-trimethy1-1,2-dihydroquinoline phenyl- β-naphthylamine N,N'-di- β-naphthyl-p-phenylenediamine N,N'-diphenyl-p-phenylenediamine N-phenyl-N'-isopropyl-p-phenylenediamine 4,4'-bis(4-α , α-dimethylbenzoyl)diphenylamine N-cyclohexyl-N'-phenyl-p-phenylenediamine mercaptomethylbenzimidazole N,N'-di-o-to1y1-ethy1enediamine S A 0 (cyclic iminoether or iminoester compound) (A~ I ; cyclic iminoether compound J ~M; cyclic iminoester compound) A 2,2'-bis(2-oxazoline) B 2,2'-bis(4-methyl-2-oxazoline) C 2,2'-bis(4,4-dimethyl-2-oxazoline) D 2,2'-bis(4-phenyl-2-oxazoline) E 2,2'-bis(5,6-dihydro-4H-l,3-oxazine) F N,N'-trimethylenebis(2-carbamoy1-2-oxazoline) G 2,2'-metaphenylenebis(2-oxazoline) H 2,2'-hexamethylenebis(2-oxazoline) N,N'-dimethy1-N,N'-tetramethylenebis(5,6-dihydro-4H-l,3- oxazoline) J 2.2'-bis(3,l-benzooxazine-4-on) K 2,2'-ethylenebis(3,l-benzooxazine-4-on) L 2,2'-( ,4'-diphenylene)bis(3,l-benzooxazine-4-on) M 2,2'-tetramethylenebis(4-methyl-5(4H)-oxazolon) < Example 1 > SPESIN KP 210(K0L0N INC. KOREA), polybutylene terephthalate resin (PBT) having an intrinsic viscosity of 1.0 dfl/g was added through the main feeder of two axis screw type extruder, and 0.5 wt% of each 2,2, 4-trimethyl-l,2-dihydroquinoline and 2,2'-m-phenylenebis(2-oxazoline) as thermal a stabilizer, based on the total 100 wt% of PBT, were added through a secondary feeder, respectively, and mixed to prepare therma- lly stabilized resin compositions. The temperature of the various zones of the extruder was 200T , 230 * 0, 245TJ . 250TJ , 240TJ in the order, from main feeder to die, and the rpm of the screw was 200. Mixed resins were extruded as spaghetti form, cooled in cooling water of 35TJ and pelletized through pelletizer. The moisture of the stabilized PBT prepared by the present pro¬ cess was removed at a temperature of 100TJ for 6 hrs by using a hot air dryer, and samples for measuring properties were injection molded by using an injection molding machine having 150 tons of clamping for The resultant properties are provided in Table 2. < Example 2~6 > The same procedure was carried out as described in Example 1 with the amount of components and properties provided in Table 1 and 2, respectively. < Comparative Example 1 > The same procedure was carried out as described in Example 1 except using a single amine-type thermal stabilizer with the amount of component povided in Table 1. < Comparative Example 2 > The same procedure was carried out as described in Example 1 except using a single cyclic iminoester thermal stabilizer with the amount of component provided in Table 1. < Comparative Example 3 > The same procedure was carried out as described in Example 1 except no additives or stabilizers were used. < Comparative Example 4 > The same procedure was carried out as described in Example 1 except using 0.5 wt% of tetrakis[methylene-3-(3,5-di-t-butyl-4-hydroxy -phenyl)propionate]methane as a phenol type thermal stabilizer. < Comparative Example 5 > The same procedure was carried out as described in Example 1 except using 0.2 wt% of tetrakis[methylene-3-(3,5-di-t-butyl-4-hydroxy -phenyl)propionate]methane as a phenol type thermal stabilizer and 0.4 wt% of tris(t-butyl-phenyl)phosphite as thermal stabilizer. < Comparative Example 6> The same procedure was carried out as described in Example 1 except using 0.2 wt% of tetrakis[methylene-3-(3,5-di-t-butyl-4-hydroxy -phenyl)propionate]methane as a phenol type thermal stabilizer and 0.4 wt% of N,N'-diphenyl-p-phenylenediamine as thermal stabilizer. < Comparative Example 7 > The same procedure was carried out as described in Example 1 except using 0.2 wt% of tetrakis[methylene-3-(3,5-di-t-butyl-4-hydroxy -phenyl)propionate]methane as a phenol type thermal stabilizer and o.4 wt% of distearylthiodipropionate as thermal stabilizer. < Comparative Example 8 > The same procedure was carried out as described in Example 1 except using 0.4 wt% of tetrakis[methylene-3-(3,5-di-t-butyl-4-hydroxy -phenyl)propionate]methane as a phenol type thermal stabilizer and 0.5 wt% of 2,2'-metaphenylenebis(2-oxazoline) as thermal stabilizer. Comparative Example 9 > The same procedure was carried out as described in Example 1 except using 0.4 wt% of tris(t-butyl-phenyl)phosphite and 0.5 wt% of 2,2'-meta-phenylenebis(2-oxazoline) as thermal stabilizer. < Comparative Example 10 > The same procedure was carried out as described in Example 1 except using 0.4 wt% of distearylthiodipropionate and 0.5 wt% of 2,2'- meta-phenylenebis(2-oxazoline) as thermal stabilizer. < Example 7 > 2kg of dimethylterephthalate, 1.4kg of 1,4-butanediol and 2g of tetrabutyltitanate as catalyst was added to a reactor equipped with a stainless steel stirrer, temperature and pressure controller and the reaction temperature was raised to 140TJ slowly at normal pressure. The reaction temperature was raised over the period of 1.5 hrs to 210TJ and the methanol which is the by-product of the ester exchange reaction, was removed from the reactor. After 630g of methanol was removed, and esterification was completed, 11.3g(0.5 wt% on the basis of polymer) of 2,2'-bis(5,6- dihydro-4H-l,3-oxazine) and 6.8g(0.3 wt% on the basis of polymer) of 4.4'-bis(4- a , α-dimethylbenzoyDdiphenylamine as thermal stabilizer were added thereto and stirred. The temperature was elevated to 250TJ and the pressure was abated from normal pressure to 0.1 mmHg slowly. The condensation reaction was carried out for 35 minutes under 0.1 mmHg and polymerization was completed. The intrinsic viscosity, measured at 23TJ in o-chlorophenol was 0.87 dfl/g, with a melting point of 223TJ . The PBT resin obtained was dried and extruded the same as in Example 1, and then thermal stability thereof was measured. The results are provided in Table 1. < Comparative Example 11 > The same procedure was carried out as described in Example 7 except that 11.3g(0.5 wt% on the basis of polymer) of 2,2'-bis(5,6- dihydro-H-1,3-oxazine) as thermal stabilizer was added. < Comparative Example 12 > The same procedure was carried out as described in Example 7 except that 6.8g(0.3 wt% on the basis of polymer) of 4,4'-bis(4-α , α- dimethylbenzoyDdiphenylamine) as thermal stabilizer was added. < Comparative Example 13 > The same procedure was carried out as described in Example 7 except that 22.7g(1.0 wt% on the basis of polymer) of tetrakis[methyl¬ ene-3-(3,5-di-t-butyl-hydroxy-phenyl)propionate]methane as a thermal stabilizer was added. < Comparative Example 14 > The same procedure was carried out as described in Example 7 except that 6.8g of tetrakis[methylene-3-(3,5-di-t-butylhydroxy-phenyl )propionate]methane and 11.3g(0.5 wt% on the basis of polymer) of distearylthiodipropionate as thermal stabilizer was added. < Example 8~13, Comparative Example 15—18 > The same procedure was carried out as described in Example 7 except that the composition was modified as specified in Table 1 and the temperature of the various extruder zones was established as 200TJ , 220TJ , 240TJ , 240TJ , 240TJ in the case of polycaprolactam(poly- amide-6), and 240TJ , 270TJ , 280TJ , 285TJ , 280TJ , 270TJ in the case of polyhexamethylenediadipate(polyamide-66). The results are provided in Table 5. < Comparative Example 19 > The same procedure was carried out as described in Example 8 with using polyamide-6 resin and 0.5 wt% of N,N'-hexamethylene-bis(3,5 -di-t-butyl-4-hydroxy-hydrocinnamide) as thermal stabilizer and 0.9 wt% of 2,2'-(4,4'-diphenylene)bis(3,l-benzooxazine-4-on). < Example 14 > The same procedure was carried out as described in Example 1 except that polyethyleneterephthalate resin having an inherent vis¬ cosity of 0.63 dfl/g was used, and the temperature of the various extruder zones was established as 240TJ . 260TJ , 285TJ , 290TJ , 280TJ , 280TJ , and 10 wt% of polypropyleneglycol benzoate as plasticizer, and 30 wt% of glass fiber having a length of 3.2-----. a diameter of 13/m , and treated with aminosilane coupling agent, as reinforcing agents were added through a secondary opening. Simultaneously, 0.5 wt% of N,N'-di- 0-naphthyl-p-phenylenediamine and 1.0 wt% of 2,2'-bis(5,6-dihydro-4H-l,3-oxazine) was added thereto to prepare fiber reinforced PET resin. The properties were measured by the same method as Example 1 and the results are provided in Table 7. < Example 15~16 > The same procedure was carried out as described in Example 1 with the amount of components and properties provided in Table 6 and 7, respectively. < Comparative Example 24 > The same procedure was carried out as described in Example 17 except using 0.5 wt% of tetrakis[methylene-3-(3,5-di-t-butyl-4-hydroxy -phenyl)propionate]methane and 0.8 wt% of 2,2'-4,4'-diphenylene)bis(3, l-benzooxazine-4-on). < Example 19 > The same procedure was carried out as described in Example 17 except that 45 wt% of polycarbonate(UPIL0N S-2000) resin and 45 wt% of polybutylene terephthalate resin having an inherent viscosity of 1.18 dfl/g was added through the primary opening, and 10 wt% of methacrylate -styrene-butadiene rubber was added as an impact-resistant reagent through a secondary opening and simultaneously the thermal stabilizers provided in Table 8 were added through a secondary opening to prepare a blended resin of polycarbonate and polybutyleneterephthalate. < Comparative Example 25 > The same procedure was carried out as described in Example 17 except using 0.5 wt% of tetrakis[methylene-3-(3,5-di-t-butyl-4-hydroxy -phenyl)propionate]methane as thermal stabilizer and 0.5 wt% of 2-(2- hydroxy-5-t-octylphenyl)benzotriazole as UV absorber. < Comparative Example 26 > The same procedure was carried out as described in Example 17 except using 0.2 wt% of tetrakis[methylene-3-(3,5-di-t-butyl-4-hydroxy -phenyl)propionate]methane as thermal stabilizer and 0.4 wt% of distearylthiodipropionate as thermal stabilizer. < Example 20 > The same procedure was carried out as described in Example 7 except that l,500g of dimethylterephthaiate, l,300g of 1,4-butanediol, 1.185g of poly(tetramethyleneoxide)glycol having a number average mole cular weight of 1,000 and 4g of tetrabutyltitanate as catalyst were added to reactor and ester-exchange reaction was carried out at a tem¬ perature of 200TJ . Then ll.lg(0.4 wt% on the basis of polymer) of 4,4'-bis(4-α , α-dimethylbenzoyl)diphenylamine and 16.7g(0.6 wt% on the basis of polymer) of 2,2'-meta-phenylene(2-oxazoline) were added thereto and condensation reaction was carried out. The temperature was raised over the period of 1 hr to 250TJ and the pressure was abated from normal pressure to 0.1 mmHg. The condensation reaction was continuously carried out for 45 min under 0.1 mmHg pressure and polymerization was completed. The moisture of the polyetherester block copolymer prepared by the present process was removed at a temperature of 110TJ for 6 hrs, and then removed at a temperature of 100TJ by using a hot air dryer. Samples for measuring properties were injection molded by using an injection molder having 150 tons of clamping force, and the heat the resistance was estimated. The results are provided in Table 11. < Comparative Example 27 > The same procedure was carried out as described in Example 20 except using 0.4 wt% of tetrakis[methylene-3-(3,5-di-t-butyl-4-hydroxy -phenyl)propionate]methane as thermal stabilizer and 0.8 wt% of tris( t-butyl)phenyl-phosphite as thermal stabilizer. < Comparative Example 28 > The same procedure was carried out as described in Example 20 except using 0.4 wt% of tetrakis[methylene-3-(3,5-di-t-butyl-4-hydroxy -phenyl)propionate]methane as thermal stabilizer and 0.8 wt% of N,N'- diphenyl-p-phenylenediamine as thermal stabilizer. < Comparative Example 29 > The same procedure was carried out as described in Example 20 except using 0.4 wt% of tetrakis[methylene-3-(3,5-di-t-butyl-4-hydroxy -phenyl)propionate]methane as thermal stabilizer and 0.8 wt% of distearylthiodipropionate as thermal stabilizer. < Comparative Example 30 > The same procedure was carried out as described in Example 20 except using 0.4 wt% of tetrakis[methylene-3-(3,5-di-t-butyl-4-hydroxy -phenyl)propionate]methane as thermal stabilizer and 0.8 wt% of 2,2'-m -phenylenebis(2-oxazoline) as thermal stabilizer. < Comparative Example 31 > The same procedure was carried out as described in Example 20 except using 0.4 wt% of tris(t-butyl-phenyl)phosphite .and 0.8 wt% of 2,2'-m-phenylenebis(2-oxazoline) as thermal stabilizer. < Comparative Example 32 > The same procedure was carried out as described in Example 20 except using 0.4 wt% of distearylthiodipropionato and 0.8 wt% of 2,2' -m-phenylenebis(2-oxazoline). < Example 21 > The same procedure was carried out as described in Example 1 except that E390FNAT(ELAST0LLAN INC. Japan), a thermoplastic poly- urethane elastomer was added through the primary opening and 0.4 wt% of N,N'-di-o-tolyl-ethylenediamine and 0.5 wt% of 2,2'-tetramethylene bis(4-methyl-5(4H)-oxazoline) as thermal stabilizer (based on the total of polyurethane resin) were added through a secondary opening. The temperature of the extruder zones were 100TJ , 140TJ , 200TJ , 220TJ , 200TJ and 200TJ . Samples were injection molded and thermal stability was evaluated , providing the results reported in Table 13. < Comparative Example 33~35 > The same procedure was carried out as described in Example 21 with the amount of thermal stabilizer provided in Table 12. < Example 22 > The same procedure was carried out as described in Example 1, except that CARIFLEX TR 1186(SHELL), a thermoplastic styrene elastomer was added through the primary opening and the thennal stabilizers pro¬ vided in Table 14 (based on the total 100% of resin) were added through a secondary opening. The temperatures of the zones of the extruder were 100TJ , 130TJ , 170TJ , 180TJ , 200TJ and 180TJ . Samples were injection molded and thermal stability was evaluated , providing the results shown in Table 15. < Comparative Example 36—-38 > The same procedure was carried out as described in Example 22 with the amount of thermal stabilizer provided in Table 14. < Example 23 > The same procedure was carried out as described in Example 1 except that SANTOPRENE 101-80(MONSANTO), a thermoplastic polyolefin elastomer was added through the primary opening and the thermal stabilizers provided in Table 16 (based on the total 100% of olefin resin) were added through a secondary opening. The temperatures of the various zones of extruder were 100TJ , 140TJ , 180TJ , 180TJ , 200TJ , and 190TJ . Samples were injection molded and thermal stability was evaluated , providing the results summarized in Table 17. < Comparative Example 39—41 > The same procedure was carried out as described in Example 23 with the amount of thermal stabilizer provided in Table 16. <Tab I e 1 » AON SAO Section Resin type amount(wt%) type amount(wt%) Example 1 P BT A 0.5 A 1.0 Example 2 P BT B 0.3 C 0.5 Example 3 P BT C 0.7 F 0.3 Example 4 P BT G 0.4 G 0.6 Example 5 P BT J 0.3 J 1.5 D & 0.4, Example 6 P BT G 0.4 H each Comparative PBT D 0.6 — — Example 1 Comparative P BT — — K 1.0 Example 2 Comparative P BT — — — — Example 3 Comparative P BT — — — — Example 4 Comparative P BT — — — — Example 5 Comparative P BT — — — — Example 6 Comparative P BT — — — — Example 7 Comparative P BT — — — — Example 8 Comparative P BT — — — — Example 9 Comparative P BT — — — Example 10 | - -* P BT: Polybutyleneterephthalate < T a b I e 2 > Elongation Impact strength Thermal stability Section (%) (kg • en/en) (%) Example 1 187 4.2 62 Example 2 172 4.1 60 Example 3 164 4.3 58 Example 4 176 4.2 62 Example 5 152 3.9 48 Example 6 163 4.0 59 Comparative 63 2.7 23 Example 1 Comparative 112 3.1 32 Example 2 Comparative 17 2.3 19 Example 3 Comparative 36 2.5 26 Example 4 Comparative 49 2.7 21 Example 5 Comparative , 57 2.5 23 Example 6 Comparative 55 2.4 31 Example 7 Comparative 43 2.2 19 Example 8 Comparative 52 2.6 18 Example 9 Comparative 36 2.5 26 Example 10 -8. Thermal stability : After 0.25 inch of a bar specimen was heat treated at 200TJ for 20 hrs, the thermal stability was expressed as the ratio of maintained NOTCHED IZOD impact strength impact strength after heat treatment Thermal stability = initial impact strength <Tab I e 3 -= ► Inherent melting Impact strength Thermal Section viscosity point (kg • CH/CB) stability (TJ) (%) Example 7 0.87 223 4.3 62 Comparative 0.73 224 3.8 26 Example 11 Comparative 0.82 222 2.9 28 Example 12 Comparative 0.79 224 2.6 27 Example 13 Comparative 0.78 223 2.8 38 Example 14 < T a b I β 4 > AON SAO Section Resin type amount(wt%) type amount(wt%) Example 8 P A- 6 F 1.0 J 0.7 Example 9 P A- 6 H 0.8 K 0.4 Example 10 P A- 6 J 0.5 L 0.9 Example 11 P A -66 D 1.0 M 0.8 Example 12 P A -66 E 0.5 A 2.0 B & 0.4, Example 13 P A -66 H 1.0 L each Comparative P A- 6 F 0.5 — — Example 15 Comparative P A- 6 — — L 1.0 Example 16 Comparative P A- 6 — — — — Example 17 Comparative P A -66 — — — — Example 18 Comparative P A- 6 — — L 0.9 Example 19 • P A - 6 polyamide-6 P A - 6 6 polyamide-66 < T a b I β 5 >- Elongation Impact strength Thermal stability Section (%) (kg • cm/cm) (%) Example 8 203 6.3 78 Example 9 198 7.2 67 Example 10 186 5.8 76 Example 11 62 6.4 79 Example 12 73 5.2 86 Example 13 57 4.7 89 Comparative 82 4.3 39 Example 15 Comparative 74 4.6 47 Example 16 Comparative 42 4.2 32 Example 17 Comparative 53 3.9 46 Example 18 Comparative 69 4.1 41 Example 19 5K Thermal stability After polyamide 6 was heat-treated at 200TJ for 200 hrs, and polyamide 66 was heat-treated at 230TJ for 200 hrs, thermal stability was measured using the same method as Table 2. <Tab I θ 6> AON S AO Section Resin type amount(wt%) type amount(wt%) Example 14 FR-PET A 0.5 A 1.0 Example 15 FR-PET B 0.3 C 0.5 Example 16 FR-PET C 0.7 F 0.3 Comparative FR-PET — — — — Example 20 Comparative FR-PET — — — — Example 21 Comparative FR-PET — — — — Example 22 Comparative FR-PET — — — — Example 23 K FR-PET: Glass fiber reinforced polyethylene terephthalate resin <Tab I e " 7> Tensile Impact strength Thermal stability Section strength (kg • CB/CD) (%) (%) Example 14 1,470 7.4 72 Example 15 1.450 8.2 74 Example 16 1,500 8.6 69 Comparative 1,420 7.1 36 Example 20 Comparative 1,480 7.7 42 Example 21 Comparative 1,440 7.0 48 Example 22 Comparative 1,440 7.2 45 Example 23 JK Thermal stability : After a dumbbell type specimen was heat treated at 210TJ for 500 hrs, thermal stability was measured using the ratio of maintained tensile strength. < T a b I Θ 8 =» AON S AO Section Resin type amount(wt%) type amount(wt%) Example 17 G F-P C L 0.8 I 1.0 Example 18 G F- P C E 1.0 D 0.6 Comparative G F - P C — — — — Example 24 Example 19 PC/PBT C 0.6 C 0.7 Comparative PC/PBT — — — — Example 25 Comparative PC/PBT — — — — Example 26 K G F — P C : Glass fiber reinforced polycarbonate PC/PBT : Composite resin of polycarbonate and polybutylene¬ terephthalate < T a b I e © > Elongation Impact strength Thermal stability Section (%) (kg - cm/en) (%) Example 17 6 11 55 Example 18 5 10 60 Comparative 4 6 33 Example 24 Example 19 123 72 74 Comparative 110 68 47 Example 25 Comparative 121 65 49 Example 26 K Thermal stability After 0.25 inch of a bar specimen was heat treated at 200TJ for 400 hrs. the thermal stability was measured using the same method as Table 2. <Ta b I e 10> AON SAO Section Resin type amount(wt%) type amount(wt%) Example 20 T P E E G 0.5 G 1.0 Comparative T P E E — — — — Example 27 Comparative T P E E — — — — Example 28 Comparative T P E E — — — — Example 29 Comparative T P E E — — — — Example 30 Comparative T P E E — — — — Example 31 Comparative T P E E — — — — Example 32 • X T P E E : Thermoplastic polyetherester block copolymerized elastomer <Tab I β 1 1 > Elongation Impact strength Thermal stability Section (%) (kg * cm/cm) (%) Example 20 710 NB 92 Comparative 695 N B 52 Example 27 Comparative 687 NB 74 Example 28 Comparative 703 N B 61 Example 29 Comparative 716 N B 49 Example 30 Comparative 726 N B 48 Example 31 Comparative 719 NB 54 Example 32 - Thermal stability : After a dumbbell specimen was heat treated at 150TJ for 200 hrs, the thermal stability was measured using the ratio of maintained elongation. < T a b i β 1 2 > AON SAO Section Resin type amount(wt%) type amount(wt%) Example 21 T P U J 0.5 M 0.5 Comparative T P U J 0.5 — — Example 33 Comparative T P U — — M 0.5 Example 34 Comparative T P U — — — — Example 35 5K T P U : Thermoplastic polyurethane elastomer <Tab I β 13> Elongation Impact strength Thermal stability Section (%) (kg - cm/cm) (%) Example 21 432 NB 43 Comparative 365 N B 18 Example 33 Comparative 421 N B 24 Example 34 Comparative 332 NB 21 Example 35 58. Thermal stability After a dumbbell specimen was heat treated at 120TJ for 100 hrs, the thermal stability was measured using the same method as Table 11. < T a b I e 1 4 > AON S AO Section Resin type amount(wt%) type amount(wt%) Example 22 T P S A 1.0 L 1.0 Comparative T P S A 1.0 — — Example 36 Comparative T P S — — L 1.0 Example 37 Comparative T P S — — — — Example 38 55. T P S : Thermoplastic polystyrene elastomer <Tab I e 15> Elongation Impact strength Thermal stability Section (%) (kg - cm/cm) (%) Example 22 798 — 62 Comparative 782 — 31 Example 36 Comparative 752 — 29 Example 37 Comparative 774 — 21 Example 38 K Thermal stability After a dumbbell specimen was heat treated at 120TJ for 100 hrs, the thermal stability was measured using the same method as Table 11. < T a b I e 1 6 > AON SAO - Section Resin type amount(wt%) type amount(wt%) Example 23 T P 0 B 0.7 A 1.0 Comparative T P 0 B 0.7 — — Example 39 Comparative T P 0 — — A 1.0 Example 40 Comparative T P 0 — — — — Example 41 58. T P 0 : Thermoplastic polyolefine elastomer <Tab I e 1 V> Elongation Impact strength Thermal stability Section (%) (kg * cm/cm) (%) Example 23 416 — 49 Comparative 407 — 32 Example 39 Comparative 415 — 26 Example 40 Comparative 392 — 19 Example 41 58. Thermal stability After a dumbbell specimen was heat treated at 120TJ for 100 hrs, the thermal stability was measured using the same method as Table 11.

Claims: WHAT I S CLA I MED I S ; 1. A thermally stabilized resin composition comprising a resin to which contains a thermally stabilizing effective amount of one or more cyclic iminoether compounds represented by formula ( I ) or cyclic iminoester compounds represented by formula ( II) or both, and an amine thermal stabilizer; ( I ) ( π ) Wherein, X is a single bond or a divalent organic group selected from C 2 —Cjo alkylene, arylene selected from the group consisting of phenylene, naphthalene, and biphenylene. cyclic alkylene selected from the group consisting of cyclohexylene and cyclohexanedimethylene and C 2 ** ■ -C,o alkylene containing a hetero atom, or X is a group of formula ( HI ) -C-N-Y-N-C- II I I II O R , R ,0 (m) Wherein, R ,and R ,, are each, independently, selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, hexyl, octyl, decyl, phenyl, tolyl, cyclohexyl, and benzyl, Y is a divalent organic group selected from the group consisting of ethylene, propylene, butylene, pentamethylene, hexamethylene, octamethylene, nonamethylene, decamethylene, phenylene, naphthalene and diphenylene or a group of formula (IV): (IV) Wherein, Z is a member selected from the group consisting of -0-, -CO-, -S-, -SO ,-, -CH ,-, -CH^CH ,-, or -C(CH 3 ) ,-, cyclopenty- lene, eyelohexylene, methylene-phenylene and methylene-phenylene- methylene; and A and B are each, independently, a single bond, substituted or unsubstituted alkylene selected from the group consisting of methy¬ lene ethylene, propylene, butylene, 1-methylethylene, 1,1-dimethyleth¬ ylene, 1,2-dimethylene, 1-ethylethylene, 1,1-diethylethylene, 1-pro¬ pylethylene, 1-butylene, 1-hexylethylene, and 1-methyltrimethylene. 2. The thermally stabilized resin composition according to claim 1, wherein said one or more of cyclic iminoether compounds of formula ( I ) or cyclic iminoester compounds of formula (II) or both are present in an amount of from 0.02 to 5.0 vt% .and said amine thermal stabilizer is present in an amount from 0.02 to 3.0 wt%. 3. The thermally stabilized resin composition according to claim 1, wherein said amine thermal stabilizer is selected from the group consisting of substituted phenylene-diamine, quinoline, diphen- ylamine, naphthylamine, mercaptobenzimidazole and thiourea. 4. The thermally stabilized resin composition according to claim 1, wherein X is a single bond or phenylene. 5. The thermally stabilized resin composition according to claim 1, wherein the total amount of cyclic iminoether of formula ( I ), cyclic iminoester of formula (II) and amine thermal stabilizer is from 0.04 to 6.0 wt%. 6. The thermally stabilized resin composition according to claim 2, wherein the total amount of cyclic iminoether of formula ( I ), cyclic iminoester of formula (II) and amine thermal stabilizer is from 0.04 to 6.0 wt%. 7. The thermally stabilized resin composition according to claim 1, wherein said resin is a member selected from the group con¬ sisting of polyethylene LLDPE(liner low density polyethylene), poly¬ propylene, polybutylene, polystyrene, polyvinylchloride, polyacrylon- itrile, ABS(acrylonitrile-butadiene-styrene), polyacetal, polyester, polyamide, polycarbonate, polyphenylene oxide, natural rubber, butadi¬ ene rubber, nitrile rubber, isoprene, chloroprene, acryl rubber, sty- rene-butadiene elastomer, urethane elastomer, olefin elastomer, ester elastomer, amide elastomer, and istures thereof. 8. The thermally stabilized resin composition according to claim 1, wherein said resin is rubber, thermoplastic elastomer, polyester or polyamide.

Inventors: JANG SANG HEE, KIM KYUNG MIN, PARK EUN HA, JANG, SANG, HEE, KIM, KYUNG, MIN, PARK, EUN, HA
Applicants: JANG SANG HEE, KIM KYUNG MIN, KOLON INC, PARK EUN HA, JANG, SANG, HEE, KIM, KYUNG, MIN, KOLON INDUSTRIES, INC., PARK, EUN, HA
Application year: 1994
Main classification: C08K5
IPC codes: C08K5, C08L7, C08L9, C08L67, C08L77, C08L101