Ink ejecting device

Abstract: An ink ejecting device includes ink channels (304) intercommunicating with slits (311B) and air channels (327) intercommunicating with other slits (311A). The ink channels (304) and the air channels (327) have a narrow shape with a rectangular cross-section, and all of the ink channels are filled with ink and the air channels are filled with air. An LSI chip applies a voltage V to a pattern conducting to metal electrodes positioned in air channels located at both sides of an ink channel from which the ink is to be ejected and connects the other patterns connected to metal electrodes in other air channels not adjacent the ejecting ink channel and a pattern conducting to the metal electrodes of the non-ejecting ink channels to a ground line. Therefore, the ink ejecting device of the above structure requires no insulation between ink and electrodes as the working electrodes do not contact the ink.

Description: The invention relates to an ink ejecting device. Of non-impact type printing devices which have recently taken the place of conventional impact type printing devices and have greatly propagated in the market, ink-ejecting type printing devices have been known as being operated on the simplest principle and as being effectively used to easily perform multi-gradation and coloration. Of these devices, a drop-on-demand type for ejecting only ink droplets' which are used for printing has rapidly propagated because of its excellent ejection efficiency and low running cost. The drop-on-demand types are representatively known as a Kyser type, as disclosed in U.S. Patent No. 3,946.398, or as a thermal ejecting type, as disclosed in U.S. Patent No. 4,723,129. The former, or Kyser type, is . difficult to design in a compact size. The latter, the thermal ejecting type requires the ink to have a heat-resistance property because the ink is heated at a high temperature. Accordingly, these devices have significant problems. A shear mode type printer, as disclosed in U.S. Patent No. 4,879,568, has been proposed as a new type to simultaneously solve the above disadvantages. As shown in Figs. 7A and 7B, the shear mode type of ink ejecting device 600 comprises a bottom wall 601, a ceiling wall 602 and a shear mode actuator wall 603 therebetween. The actuator wall 603 comprises a lower wall 607 which is adhesively attached to the bottom wall 601 and polarized in the direction indicated by an arrow 611. An upper wall 605 is adhesively attached to the ceiling wall 602 and polarized in the direction indicated by an arrow 609. A pair of actuator walls 603 thus formed forms an ink channel 613 therebetween. A space 615 which is narrower than. the ink channel 613 is also formed between neighboring pairs of actuator walls 603 in an alternating relationship to the ink channels 613. A nozzle plate 617, having nozzles 618 formed therein, is fixedly secured to one end of each ink channel 613, and electrodes 619 and 621 are provided as metallized layers on both side surfaces of each actuator wall 603. Each of the electrodes 619,621 is covered by an insulating layer (not shown) to insulate it from the ink. The electrodes 619,621 which face the space 615 are connected to a ground 623, and the electrodes 619,621 which are provided in the ink channel 613 are connected to a silicon chip 625 which forms an actuator driving circuit. Next, a manufacturing method for the ink ejecting device 600 as described above will be described. First, a piezoelectric ceramic layer, which is polarized in a direction as indicated by an arrow 611, is adhesively attached to the bottom wall 601 and a piezoelectric ceramic layer, which is polarized in a direction as indicated by an arrow 609, is adhesively attached to the ceiling wall 602. The thickness of each piezoelectric ceramic layer is equal to the height of each of the lower walls 607 and the upper walls 605. Subsequently, parallel grooves are formed on the piezoelectric ceramic layers by rotating a diamond cutting disc or the like to form the lower walls 607 and the upper walls 605. Further, the electrodes 619 are formed on the side surfaces of the lower walls 607 by a vacuum-deposition method, and the insulating layer, as described above is provided onto the electrodes 619. Likewise, the electrodes 621 are provided on the side surfaces of the upper walls 605 and the insulating layer is further provided on the electrodes 621. The vertex portions of the upper walls 605 and the lower walls 607 are adhesively attached to one another to form the ink channels 613 and the spaces 615. Subsequently, the nozzle plate 617, having the nozzles 618 formed therein, is adhesively attached to one end of the ink channels 613 and the spaces 615 so that the nozzles 618 face the ink channels 613. The other end of the ink channels 613 and the spaces 615 is connected to the silicon chip 625 and the ground 623. A voltage is applied to the electrodes 619,621 of each ink channel 613 from the silicon chip 625, whereby each actuator wall 603 suffers a piezoelectric shear mode deflection in such a direction that the volume of each ink channel 613 increases. The voltage application is stopped after a predetermined time elapses, and the volume of each ink channel 613 is restored from a volume-increased state to a natural state, so that the ink in the ink channels 613 is pressurized and an ink droplet is ejected from the nozzles 618. However, in the ink ejecting device 600 constructed as described above, the electrodes 619,621 facing the spaces 615 are connected to the ground 623 and the electrodes 619,621 provided in the ink channels 613 are connected to the silicon chip 625 forming the actuator driving circuit so that the voltage is applied to the electrodes 619,621 in each ink channel 613 to eject the ink. Therefore, the electrodes 619,621 in the ink channels 613 must be coated with the insulating layer to be insulated from the ink. If no insulating layer is provided, short-circuiting would occur due to the highly conductive ink. Further, even if conductivity of the ink is not so high, the electrodes 619,621 are deteriorated due to electrical or chemical corrosion thereof and thus deflection of the actuator wall 603 is not sufficiently performed so that printing quality is lowered. Accordingly, the insulating layer must be provided to insulate the ink and the electrodes 619,621 from each other and equipment and a process for forming the insulating layer are required. As a result, there occurs a problem that productivity is lowered and cost is increased. In U.S. Patent No. 4,879,568 disclosing the ink ejecting device 600, ink is provided only to the ink channels 613. No ink is provided to the spaces 615. However, the structure and method for supplying the ink to this multi-channel ink ejecting device are not disclosed. If it is considered that through holes intercommunicating. with the ink channels 613 are provided at the bottom wall 601 or the ceiling wall 602 in correspondence with the respective ink channels 613 to supply the ink into the ink channels 613 while preventing the supply of ink into the spaces 615, it is difficult to form the through holes because of the small size and the yield is low. In addition, the processing or assembly work requires a long time and is unsuitable for mass production. There has been recently proposed another ink ejecting device as disclosed in U.S. Patent No. 5,016,028, which can perform higher integration and miniaturization by using a shear mode (thickness shear mode) in deflection modes of piezoelectric material for the occurrence of pressure. The construction of this ink ejecting device will be hereunder described with reference to the accompanying drawings. As shown in Fig. 8, the ink ejecting device 1 comprises a piezoelectric ceramic plate 2, a cover plate 3, a nozzle plate 31, and a base plate 41. The piezoelectric ceramic plate 2 is formed of ceramic material of lead zirconate titanate (PZT) having ferroelectricity. The piezoelectric ceramic plate 2 is polarized in the direction indicated by arrow 5. It is then subjected to cutting using a rotating diamond blade 30 to form grooves 28 therein as shown in Fig. 12. During the cutting, the cutting direction of the diamond blade 30 is varied from a direction 30A through a direction 30B to 30C, thereby forming a groove 28 comprising a channel groove portion 17, an arc-shaped groove 19 and a shallow groove portion 16. The channel groove portion 17 is formed by cutting in the direction 30A by the diamond blade 30. Then the cutting direction is varied from the direction 30A to the direction 30B to change the depth of the cutting work. At this time, the arc-shaped groove portion 19, which is a curved surface having the same curvature as the diamond blade 30, is formed. Subsequently, the cutting direction is varied from the direction 30B to the direction 30C to form the shallow groove portion 16. As shown in Fig. 8, plural grooves 28 are formed on the piezoelectric ceramic plate 2 which has been subjected to cutting as described above. The grooves 28 have the same depth and are arranged in parallel to one another. The shallow groove portion 16 is formed in the neighborhood of one end surface 15 of the piezoelectric ceramic plate 2. The dimensions of the. channel groove portion 17 and the shallow groove portion 16 is determined by the thickness and the cutting depth of the diamond cutter blade 30. The pitch and the number of the grooves 28 is determined by controlling the feeding pitch of a working table and the frequency of groove cutting in the process of forming the grooves 28. The curvature of the curved surface of the arc-shaped groove portion 19 is determined by the diameter of the diamond blade 30. This method is used in semiconductor manufacturing and, needless to say, this method is an effective technique which is usable to perform high integration, etc. required for the ink ejecting device because extremely thin diamond blades of about 0.02mm thickness are sold in the market. Partition walls 11, which serve as the side surfaces of the grooves 28, are polarized in the direction indicated by the arrow 5. Metal electrodes 13, 18 and 9 are deposited on the side surfaces of the channel groove portion 17 and the arc-shaped groove portion 19 and the inner surface of the shallow groove portion by a deposition method. As shown in Fig. 10, during the formation of the metal electrodes 13, 18 (Fig. 8) and 9, the piezoelectric ceramic plate 2 is inclined with respect to the vapor emitting direction of a deposition source (not shown). Upon emission of metal vapor from the deposition source, the metal electrodes 13, 18, 9 and 10 are formed at the upper half portion of the side surface of the channel groove portion 17, at a portion from the upper portion of the side surface of the arc-shaped groove portion 19 to a half portion of the side surface of the channel groove portion 17, on the inner surface of the shallow portion 16 and on the upper surface of the partition wall 11 by a shadow effect of the partition walls 11. Subsequently, the piezoelectric ceramic plate 2 is rotated by 180 degrees, whereby the remainder of the metal electrodes 13, 18, 9 and 10 are formed in the same manner as described above. Thereafter, the unnecessary metal electrode 10 which is formed on the upper surface of the partition wall 11 is removed by a lapping method or the like. Through this process, the metal electrode 13 is formed on both side surfaces of the channel groove portion 17 and is electrically connected to the metal electrode formed on the inner surface of the shallow groove portion 16 through the metal electrode 18 formed on the side surface of the arc-shaped groove portion 19. The cover plate 3 shown in Fig. 8 is formed of a ceramic or a resin material. An ink inlet port 21 and a manifold 22 are formed in the cover plate 3 by grinding or cutting. Thereafter, the surface of the piezoelectric ceramic plate 2 on which the grooves 28 are formed and the surface of the cover plate 3 on which the manifold 22 is formed are adhesively attached to each other with adhesive agent 4 of epoxy group (Fig. 12) or the like. Accordingly, the upper surfaces of the grooves 28 are covered by the cover plate 3, and plural ink channels 12 (Fig. 12) which are arranged at a predetermined interval in a lateral direction are formed in the ink ejecting device 1. Subsequently, ink is filled into all the ink channels 12. The end surfaces of the piezoelectric ceramic plate 2 and the cover plate 3 are adhesively attached to a nozzle plate 31 in which nozzles 32 are formed so as to confront the respective ink channels. The nozzle plate 31 is formed of plastic such as polyalkylene (for example, ethylene) terephthalate, polyimide, polyether imide, polyether ketone, polyether sulfone, polycarbonate, cellulose acetate or the like. The base plate 41 is adhesively attached using an adhesive agent of the epoxy group to the surface of the piezoelectric ceramic plate 2 which is opposite to the surface on which the grooves 28 are formed. The base plate 41 is formed with conductive-layer patterns 42 at the positions corresponding to the respective ink channels. The conductive-layer patterns 42 and the metal electrode 9 on the shallow groove portion 16 are connected to each other through a wiring 43 by a well-known wire bonding method or the like. Next, the structure of the control unit will be described with reference to Fig. 11. Fig. 11 is a block diagram showing the control unit. The conductive-layer patterns 42 formed on the base plate 41 are individually connected to an LSI chip 51. A clock line 52, a data line 53, a voltage line' 54 and a ground line 55 are also connected to the LSI chip 51. On the basis of sequential clock pulses supplied from the clock line 52, the LSI chip 51 determines in accordance with data appearing on the data line 53, which nozzle 32 should eject ink droplets. On the basis of this judgment, the LSI chip 51 applies a voltage V from the voltage line 54 to a conductive-layer pattern 42 which is electrically connected to the metal electrode 13 of an ink channel 12 to be driven, and connects the ground line 55 to the conductive-layer patterns 42 which are electrically connected to the metal electrodes 13 of the ink channels 12 other than the ink channel 12 to be driven. Next, the operation of' the ink ejecting device will be described with reference to Figs. 12 and 13. In accordance with prescribed data, the LSI chip 51 judges that the ink is ejected from an ink channel 12B of the ink ejecting device 1. On the basis of this judgment, a positive driving voltage V is applied to the metal electrodes 13E and 13F through the conductive-layer pattern 42; the metal electrode 9 and the metal electrode 18 which correspond to the ink channel 12B, and the metal electrodes 13D and 13G are grounded. At this time, a driving electric field, directed as indicated by arrow 14B, occurs in the partition wall 11B and a driving electric field directed as indicated by arrow 14C occurs in the partition wall 11C. In this case, the directions 14B and 14C of the driving electric fields are perpendicular to the polarization direction 5, so that the partition walls 11B and 11C are rapidly deflected toward the inner side of the ink channel 12B due to an effect of the piezoelectric thickness shear mode. Through this deflection, the volume of the ink channel 12B is reduced, and the ink pressure rapidly increases so that a pressure wave occurs, and the ink droplet is ejected from the nozzle 32 (Fig. 8) which intercommunicates with the ink channel 12B. Further, when the application of the driving voltage V is stopped, the partition walls 11B and 11C are returned to their original position before deflection (see Fig. 12), and the ink pressure in the ink channel 12B is reduced so that the ink is supplied from the . ink inlet port 21 (Fig. 8) through the manifold 22 (Fig. 8) into the ink channel 12B. In the ink ejecting device as described above, the partition walls 11B and 11C at both sides of the ink channel 12B are deflected (deformed) to eject the ink from the ink channel 12B as shown in Fig. 13. However, a portion of the partition wall 11 which corresponds to the side surface of the arc-shaped groove portion 19 is little deflected. Therefore, deflection of a portion of the partition wall 11 which corresponds to the side surface of the channel groove portion 17 contributes to the occurrence of the ink pressure for ink ejecting. That is, the ink filled in the channel groove portion 17 is pressurized, and ink droplet having a predetermined volume is ejected from the nozzle 32 at a prescribed ejecting velocity. Thus, the pressure occurrence which contributes to the ejecting is induced at the channel groove portion 17. The shallow groove portion 16 and the arc-shaped groove portion 19 do not contribute to the pressure occurrence. Accordingly, there is a problem that the cost of the piezoelectric material for the shallow groove portion 16 and a portion of the arc-shaped groove portion 19 for forming the shallow groove portion 16 for electrical connection with the patterns 42 of the base plate 41, and the material cost of the piezoelectric ceramic plate are high. Here, electrically, the piezoelectric material constituting the partition walls 11 serves as a kind of capacitor. Therefore, the shallow groove portion 16 and the arc-shape groove portion 19 which substantially do not contribute to the occurrence of pressure are also formed of piezoelectric material. Accordingly, there is a problem that the electrostatic capacity as the capacitor is increased, and thus the efficiency of energy consumed for the pressure occurrence to electrical input energy is low. GB-A-2264086, upon which the precharacterising portion of appended claim 1 is based, describes a piezoelectric drop-on-demand ink jet printer having a plurality of alternate ink channels and non-ejecting channels. These are formed as grooves in a base, separated by a plurality of partition walls. An object of the invention is to provide an ink ejecting device in which no insulation is required between ink and electrodes. Another object of the invention is to provide an ink ejecting device requiring no insulation layer for insulating ink and electrodes from each other, having high productivity and being highly suitable for mass production. Another object of the invention is to provide an ink ejecting device requiring a small amount of piezoelectric ceramic material and having high energy efficiency. In order to attain the above objects, an ink ejecting device is provided comprising: a plurality of ink channels; a plurality of non-ejecting channels, the non-ejecting channels being provided alternately between said ink channels; a plurality of partition walls forming said ink channels and said non-ejecting channels, at least a portion of said partition walls formed of a piezoelectric ceramic material; and a plurality of first electrodes formed on the piezoelectric ceramic material of said partition walls; characterised by communicating portions communicating with respective associated ones of one or both of said ink channels and said non-ejecting channels; and a plurality of other electrodes provided on a portion of said communicating portions and a portion of said respective associated channels, said other electrodes being electrically connected to said first electrodes provided on the piezoelectric material facing said associated channels. Preferred embodiments of the invention will be described in detail with reference to the following figures in which: Fig. 1 is a perspective view showing an ink ejecting device according to the first embodiment; Fig. 2 is a block diagram showing a controller of the ink ejecting device of the first embodiment; Fig. 3A is a schematic view showing the operation of the ink ejecting device of the first embodiment; Fig. 3B is a schematic view showing the operation of the ink ejecting device of the first embodiment; Fig. 4 is a perspective view showing an ink ejecting device of the second embodiment; Fig. 5 is a perspective view showing a piezoelectric ceramic plate of the second embodiment; Fig. 6 is a schematic view showing the ink ejecting device of the second embodiment; Fig. 7A is a schematic view showing a conventional ink ejecting device; Fig. 7B is a schematic view showing a conventional ink ejecting device; Fig. 8 is a plan, cut away perspective view showing an ink ejecting device according to a related art; Fig. 9 is a diagram showing a processing method for creating grooves of a related art; Fig. 10 is a diagram showing a related art processing method for forming electrodes on the piezoelectric plate; Fig. 11 is a block diagram showing a controller of the ink ejecting device of the related art; Fig. 12 is a diagram showing the operation of the ink ejecting device of the related art; Fig. 13 is a diagram showing the operation of the ink ejecting device of the related art. Preferred embodiments according to the invention will be hereunder described with reference to the accompanying drawings. As shown in Fig. 1, the ink ejecting device 100 comprises a piezoelectric ceramic plate 102, a cover plate 110, a nozzle plate 14 and a manifold member 101. The piezoelectric ceramic plate 102 is formed of ceramic material of lead zirconate titanate group (PZT). A plurality of grooves 103 are formed on the piezoelectric ceramic plate 102 by a cutting using a diamond blade or the like. Partition walls 106, which serve as the side surfaces of the grooves 103 are polarized in a direction as indicated by an arrow 105. The grooves 103 are designed to have the same depth and to be in parallel to one another so as to be opened at both end surfaces 102A and 102B of the piezoelectric ceramic plate 102. A metal electrode 8 is formed at an upper half portion of both side surfaces of the inner surface of each groove 103 by a sputtering or other method. The cover plate 110 is formed of alumina, and slits 111A and 111B are formed on the facing end surfaces 110A and 110B thereof, respectively. The pitch of the slits 111A, 111B is set to two times the pitch of the grooves 103 and the slits 111A and 111B are alternately arranged so as deviate from one another by a half pitch. The slits 111A, 111B are therefore provided in correspondence with the grooves 103. Further, patterns 124 and 125 are formed on the surface 110C of the cover plate 110. Thereafter, the surface of the piezoelectric ceramic plate 102, on which the grooves 103 are processed, is adhesively attached to the surface opposite to the surface 110C of the cover plate 110 with epoxy-based adhesive agent 120 (Fig. 3). Accordingly, in the ink ejecting device 100 are formed ink channels 104, from a portion of the grooves 103, serving as ejecting channels which intercommunicate with the slits 111B, and air channels 127, from the remaining grooves 103, serving as non-ejecting areas which intercommunicate with the slits 111A. The ink channels 104 and the air channels 127 are narrow and have a rectangular cross-section. Ink is filled in the ink channels 104 and air is filled in the air channels 127. After the adhesion of the cover plate 110, a metal electrode 109 is formed on an area located on the surface 110C of the cover plate 110 at the end surface 110A side from the bottom surface of the slits 111A and at a part of the side surface of the inner surface of each slit 111A. At this time, the metal electrode 109 is also formed on the metal electrode 8 of each air channel 127 intercommunicating with a slit 111A. Thus, the metal electrodes 8 are electrically connected to the metal electrodes 109 formed on the side surfaces of the slits 111A. Therefore, a metal electrode 8 formed on a partition wall 106 which is located at one side of an air channel 127 to partially define an ink channel 104, is electrically connected to a metal electrode 8 formed on another partition wall 106, which is located at one side of another air channel 127 and completes the definition of the ink channel 104 which is sandwiched between the two partition walls 106. The metal electrodes 109 are electrically connected to the patterns 124. Further, a metal electrode 117 is formed at an area located on the surface 110C extending from approximately the middle of the cover plate 110 to the end surface 110B side, of the surface 110C of the cover plate 110, and over the inner surface of each slit 111B. The metal electrode 117 is also formed on the metal electrode 8 of each ink channel 104 intercommunicating with the slit 111B. Thus, the metal electrode 8 is also electrically connected to the metal electrode 117 formed on the side surface of the slit 111B. Therefore, the metal electrodes 8 of all the ink channels 104 are electrically connected to one another through the metal electrode 117. The metal electrode 117 is electrically connected to the pattern 125. The end surfaces 102A and 102B of the piezoelectric ceramic plate 102 and the end surfaces 110A and 110B of the cover plate 110 are masked so that no metal electrodes 109 and 117 are formed on these end surfaces. A nozzle plate 14 having nozzles 12 which are located at positions corresponding to the ink channels 104 is adhesively attached to the end surface 102A of the piezoelectric ceramic plate 102 and the end surface 110A of the slit 111A side of the cover plate 110. The nozzle plate 14 is formed of plastic material such as polyalkylene (for example, ethylene) terephthalate, polyimide, polyether imide, polyether ketone, polyether sulfone, polycarbonate, cellulose acetate or the like. Thereafter, the manifold member 101 is adhesively attached to the end surface 102B of the piezoelectric ceramic plate 102, the end surface 110B of the cover plate 110 and the surface 110C of the cover plate 110. A manifold 122 is.formed in the manifold member 101. The manifold 122 surrounds the slits 111B. The patterns 124 and 125, formed on the cover plate 110, are connected to a wiring pattern on a flexible print board (not shown). The wiring pattern on the flexible print board is connected to a rigid board (not shown) which is connected to a controller to be described later. Next, the structure of the controller will be described with reference to Fig. 2. Each of the patterns 124 and 125 formed on the cover plate 110 is individually connected to an LSI chip 151 through the flexible print board and the rigid board. A clock line 152, a data line 153, a voltage line 154 and a ground line 155 are also connected to the LSI chip 151. In response to continuous clock pulses supplied from the clock line 152, the LSI chip 151 identifies a nozzle 12 from which an ink ejecting operation of ink droplet is first started on the basis of data input on the data line 153. The LSI chip 151 then applies a voltage V, from the voltage line 154 to the pattern 124 which is connected to the metal electrodes 8 of the air channels 127 at both sides of the ink channel 104 from which the ink to be ejected. Further, the LSI chip 151 connects the other patterns 124 and the pattern 125, connected to the metal electrodes 8 of the other ink channels 104, to the ground line 155. Next, the operation of the ink ejecting device 100 will be described. In order to eject ink droplets from an ink channel 104B, shown in Fig. 3B, a voltage pulse is applied through the patterns 124 to metal electrodes 8C, 8F on the ink channel 104B side of air channels 127B and 127C, respectively located on either side of the ink channel 104B. The other metal electrodes 8 are grounded through the other patterns 124 and the pattern 125. Through this operation, an electric field in the direction indicated by arrow 113B occurs in the partition wall 106B while an electric field in the direction indicated by arrow 113C occurs in the partition wall 106C so that the partition walls 106B and 106C move to separate from each other. Accordingly, the volume of the ink channel 104B is increased, and the pressure in the ink channel 104B in the vicinity of the nozzle 12 is reduced. This state is maintained for a time represented by L/a. During this time, the ink is supplied from the manifold 122 through the slit 111B associated with ink channel 104B. L/a is the time required for the pressure wave in the ink channel 104 to propagate in one way in the longitudinal direction of an ink channel 104 (from the slit 111B to the nozzle plate 14 or in the opposite way thereto). The time is determined on the basis of the length L of the ink channel 104 and acoustic velocity a of the ink. According to the propagation theory of a pressure wave, when the time L/a elapses from the rise-up as described above, the pressure in the ink channel 104B is inverted and varies to a positive pressure. The voltage applied to the electrodes 8C and 8F is returned to 0V in synchronization with the. timing when the pressure in the ink channel 104B is inverted and varies to a positive pressure. Through this operation, the partition walls 106B and 106C are returned to a state before deflection (Fig. 3A), and the ink is pressurized. At this time, the positively-varied pressure is added with the pressure which is generated when the partition walls 106B and 106C are returned to the state before deflection, so that a relatively-high pressure is supplied to the ink in the ink channel 104B and an ink droplet is ejected from the nozzle 12. In the above embodiment, the driving voltage is applied so that the volume of the ink channel 104B is increased, and then the application of the driving voltage is stopped, so that the volume of the ink channel 104B is reduced to its natural state, the ink droplet is ejected from the ink channel 104B. However, it may be adopted that the driving voltage is first applied so that the volume of the ink channel 104B is reduced to eject the ink droplet from the ink channel 104B, and then the application of the driving voltage is stopped so that the volume of the ink channel 104B is increased from its reduced state to its natural state to supply the ink into the ink channel 104B. As described above, in the ink ejecting device 100 of this embodiment, the voltage pulse is applied through one of the patterns 124 to the metal electrodes 8C and 8F on the ink channel 104B side of the air channels 127B and 127C on either side of the ink channel 104B from which the ink is to be ejected, and the other metal electrodes 8 are grounded through the other patterns 124 and the pattern 125, whereby the ink droplet is ejected from the nozzle 12 of the ink channel 104. Therefore, no voltage is applied to the metal electrodes 8 of the ink channel 104 filled with ink. As a result, there is no deterioration of the metal electrodes 8 due to the presence of ink. Accordingly, unlike the prior art, no insulating layer for insulating the ink and the metal electrodes 8 from each other is required and, thus, no equipment and process for the insulation are required. Therefore, production can be improved and the cost can be reduced. In addition, no voltage is applied to the metal electrodes 8 of the ink channel 104 filled with the ink and, thus, the metal electrodes 8 have excellent anti-corrosion. Therefore, the durability of the metal electrodes 8 is high and the life of the ink ejecting device 100 is lengthened. Further, the air channels 127 are filled with air and, thus, the partition walls 106 are easily deformed so that the driving voltage may be low. In this embodiment, since the slits 111B are formed on the end surface 110B of the cover plate 110, only the ink channels 104 communicate with the manifold 122. No air channel 127 communicates with the manifold 122. Therefore, no ink is supplied to the air channels 127 and the deflection of the partition walls 106B and 106C to eject the ink droplet from the ink channel 104B has no effect on the other ink channels, such as adjacent ink channels 104A and 104C. Accordingly, the ink droplet is efficiently ejected from each ink channel 104 and a high print quality is obtained. Further, in the ink ejecting device 100 of the embodiment, after the cover plate 110 is adhesively attached to the piezoelectric ceramic plate 102, the metal electrode 109 is formed at an area on the surface 110C of the cover plate 110 of the end surface 110A side from the bottom surface of the slit 111A and at a part of the side surface of the inner surface of the slit 111A, so that the metal electrode 8 at one side of an air channel 127 is electrically connected to the metal electrode 8 at the ink channel 104 side of another air channel 127, the ink channel 104 being sandwiched between these air channels 127. In addition, the metal electrode 117 is formed at an. area on the surface 110C of the cover plate 110 extending from approximately the middle thereof to the end surface 110B side of the surface 110C, and over the entire inner surface of each slit 111B, and thus the electrodes 8 of all the ink channels 104 are electrically connected to one another. Therefore, the metal electrodes 109 and 117 are electrically connected to the patterns 124 and 125 which are formed on the surface 110C which is a plane of the cover plate 110 and, thus, the patterns 124 and 125 and the wiring pattern of the flexible print board can be efficiently and easily electrically connected to each other. Further, the patterns 124 and 125 can be designed in a suitable shape and size to perform an accurate electrical connection. Additionally, the patterns 124 and 125 of the cover plate 110 may be directly connected to the rigid board connected to the controller without a flexible print board. By setting the width of the air channels 127 to be smaller than the width of the ink channels 104, the width of the piezoelectric ceramic plate 102 can be reduced. In this embodiment, the grooves 103 are formed on one side surface of the piezoelectric ceramic plate 102. However, it may be adopted that the piezoelectric ceramic plate is designed to have a large thickness, and grooves are formed on both sides thereof to provide ink channels and air channels. Next, a second embodiment according to the invention will be described. As shown in Figs. 4, 5 and 6, an ink ejecting device 300 comprises a piezoelectric ceramic plate 302, a cover plate 320, a nozzle plate (not shown) and a manifold member 301. The piezoelectric ceramic plate 302 is formed of ceramic material of lead zirconate titanate group (PZT). A plurality of grooves 303 are formed in the piezoelectric ceramic plate 302 by cutting using a diamond blade or the like. Partition walls 306, which serve as the side surfaces of the grooves 303, are polarized in a direction as indicated by an arrow 305. The grooves 303 are processed to the same depth and in parallel to one another so as to be open at both end surfaces 302A and 302B of the piezoelectric ceramic plate 302. On the end surface 302A of the piezoelectric ceramic plate 302, slits 311A are formed so as to communicate with every other groove 303, and on the end surface 302B of the piezoelectric ceramic plate 302, slits 311B are formed so as to communicate with every other groove 303. The slits 311A and 311B are alternately formed, and each slit 311A and each slit 311B are formed in the neighboring grooves 303. The slits 311A are provided in the two outermost grooves 303. Further, patterns 324 and 325 are formed on the surface 302C, opposite to the side of the piezoelectric ceramic plate 302 containing the grooves 303. Thereafter, metal electrodes 308, 309 and 310 are formed by a deposition source (not shown) located at an upper oblique position with respect to the groove-processed surface and the end surface 302A of the piezoelectric ceramic plate 302, as shown in Fig. 4 (deposited from directions as indicated by arrows 330A and 330B). In this case, a masking treatment is performed to prevent a metal electrode from being formed on the end surface 302A of the piezoelectric ceramic plate 302 and the vertex portions of the partition walls 306. Accordingly, as shown in Fig. 4, each metal electrode 308 is formed at upper half portions on both side surfaces of each groove 303, and each metal electrode 309 is formed at a part of the side surface and a part of the bottom surface at the end surface 302A side of each groove 303 having no slit 311A formed therein. Each metal electrode 310 is formed at the end surface 302A side of the side surface of each slit 311A. The metal electrodes 308 and the metal electrodes 309 of each groove 303 are electrically connected to each other, and the respective metal electrodes 308 and the metal electrodes 310 of each groove 303 are electrically connected to each other. Thereafter, metal electrodes 316 and 317 are formed by a deposition source (not shown) located at an upper oblique position with respect to the surface 302C and the end surface 302B of the piezoelectric ceramic plate 302 (deposited from directions as indicated by arrows 331A and 331B). Masking is used to prevent a metal electrode from being formed on the end surface 302B of the piezoelectric ceramic plate 302 and an area on the surface 302C of the piezoelectric ceramic plate 302 on which the patterns 324 and 325 are formed. Accordingly, as shown in Fig. 6, each metal electrode 316 is formed in an area on the surface 302C of the end surface 302A side and from the bottom surface of each slit 311A along a part of the side surface of the inner surface of each slit 311A. At this time, the metal electrodes 316 are formed on the metal electrodes 310 formed in the slits 311A, so that the metal electrodes 316 formed on the side surfaces of the slits 311A are electrically connected to the metal electrodes 308 through the metal electrodes 310. Therefore, a metal electrode 308 formed on a partition wall 306 which is located at one side of a groove 303 having a slit 311A formed therein is electrically connected to a 'metal electrode 308 formed on another partition wall 306 which is located in another groove 303A, the two partition walls 306 defining the groove 303B therebetween. Further, each metal electrode 316 is electrically connected to a pattern 324. As shown in Figs. 5 and 6, the metal electrode 317 is formed at the area from approximately the middle of the surface 302C of the piezoelectric ceramic plate 302 to the end surface 302B side thereof and over the entire inner surface of the slits 311B. The metal electrodes 317 are formed on the metal electrodes 308 of the grooves 303B intercommunicating with the slits 311B so that the electrodes 308 are electrically connected to the metal electrodes 317 formed on the side surfaces of the slits 311B. Therefore, the metal electrodes 308 of all the grooves 303B in which the slits 311B are formed are electrically connected to the metal electrode 317. Further, the metal electrode 317 is electrically connected to the patterns 325. Next, the cover plate 320, which is formed of alumina, and the surface of the piezoelectric ceramic plate 302, in which the grooves 303 are cut, are adhesively attached with adhesive agent of epoxy group (not shown). Accordingly, in the ink ejecting device 300, the upper surfaces of the grooves 303 are covered and ink channels 304 intercommunicating with the slits 311B and the air channels 327 serving as non-ejecting areas intercommunicating with the slits 311A are constructed. The ink channels 304 correspond to the grooves 303B and the air channels 327 correspond to the grooves 303A. The ink channels 304 and the air channels 327 have a narrow shape with a rectangular cross-section. The ink channels 304 are filled with ink and the air channels 327 are filled with air. A nozzle plate (not shown), provided with nozzles (not shown) at the positions corresponding to the positions of the respective ink channels 304, is adhesively attached to the end surface 302A of the piezoelectric ceramic plate 302 and the end surface of the cover plate 320. The nozzle plate is formed of a plastic material such as polyalkylene (for example, ethylene) terephthalate, polyimide, polyether imide, polyether ketone, polyether sulfone, polycarbonate, cellulose acetate or the like. A manifold member 301 is adhesively attached to the end surface 302B of the piezoelectric ceramic plate 302 and the slit 311B side of the surface 302C of the piezoelectric ceramic plate 302. The manifold member 301 is formed with a manifold 322 and the manifold 322 surrounds the slits 311B. The patterns 324 and 325 formed on the surface 302C of the piezoelectric ceramic plate 302 are connected to a wiring pattern of a flexible print board (not shown). The wiring pattern of the flexible print board is connected to a rigid board (not shown) connected to a controller as described later. The same effect as in the first embodiment can be also obtained in the above construction of the second embodiment. Therefore, unlike the related art, even when the arc-shaped groove portion 19 (Fig. 9) and the shallow groove portion 16 (Fig. 9) are not provided, all the metal electrodes 8, 308 of the ink channels 104, 304, can be connected and the metal electrodes 8, 308 of the air channels 127, 327, 111 formed at both sides of the partitions 106, 306 constituting the ink channels 104, 304 can be electrically connected. Accordingly, a smaller amount of material is required for the piezoelectric ceramic plate 102, 302 as compared with the conventional piezoelectric ceramic plate 2 and the cost can be reduced. Further, since the metal electrodes 109, 316 and 117, 317 are electrically connected to the patterns 124, 324 and 125, 325 formed on the plane 110C, 302C which is a surface of the piezoelectric ceramic plate 110, 302, the patterns 124, 324 and 125, 325 and the wiring pattern of the flexible print board can be electrically connected to each other efficiently and easily. Still further, the electrical connection can be surely performed by suitably selecting the shape and size of the patterns 124, 324 and 125, 325. Further, in consideration of the above driving operation of the ink ejecting device 100, 300 in order to perform the ejecting of an ink droplet, a prescribed voltage is required to be applied from a driver in accordance with a signal input to the partition walls 106, 306 which serve as the side surfaces of the grooves 103, 303 and are formed of piezoelectric material. Electrically, the piezoelectric material constituting the partition walls 106, 306 acts as a kind of capacitor. Here, electrostatic capacity (C) of the capacitor is determined by the width dimension (t) of the partition walls 106, 306 of piezoelectric material, the electrode area (s) of the metal electrodes 8, 308 formed on the side surfaces and the dielectric constant (ε11 T ) of the piezoelectric material, and the following equation is satisfied: C = ε11 T · ε0·s/t (ε0: dielectric constant of a vacuum). In the ink ejecting device 100, 300 of the above embodiments, the length of the partition walls 106, 306 of piezoelectric material substantially corresponds to the length of the conventional channel groove portion 17 (Fig.9), and. the conventional arc-shaped groove portion 19 and shallow groove portion are not formed, so that the electrode area s as described above is smaller and the electrostatic capacity C is lower than those in the conventional ink ejecting device 1. Therefore, the energy efficiency is improved over the related art. In the first and second embodiments the piezoelectric ceramic plates 102, 302 are formed of ceramic material of lead zirconate titanate (PZT), and shear-mode deflection is induced to the partition walls 106, 306 However, the piezoelectric ceramic plates may be formed of ceramic material of lead titanate (PT), and longitudinal-mode deflection may be induced to the partition walls to eject ink. It is to be understood that the invention is not restricted to the particular forms shown in the foregoing embodiments. Various modifications and alternations can be made thereto without departing from the scope of the inventions encompassed by the appended claims.

Claims: An ink ejecting device, comprising: a plurality of ink channels (104,304); a plurality of non-ejecting channels (127,327), the non-ejecting channels (127,327) being provided alternately between said ink channels (104,304); a plurality of partition walls (106,306) forming said ink channels (104,304) and said non-ejecting channels (127,327), at least a portion of said partition walls (106,386) formed of a piezoelectric ceramic material; and a plurality of first electrodes (8,308) formed on the piezoelectric ceramic material of said partition walls (106,306); characterised by communicating portions (111B,311B,111A,311A) communicating with respective associated ones of one or both of said ink channels (104,304) and said non-ejecting channels (127,327); and a plurality of other electrodes (117,317,109,310) provided on a portion of said communicating portions (111B,311B,111A,311A) and a portion of said respective associated channels (104,304; 127,327), said other electrodes (117,317,109,310) being electrically connected to said first electrodes (8,308) provided on the piezoelectric material facing said associated channels (104,304; 127,327). The ink ejecting device as claimed in claim 1, wherein: said communicating portions (111B,311B,111A,311A) include first communicating portions (111B,311B), each of which communicates with an associated one of said ink channels (104,304), and a plurality of second communicating portions (111A,311A) each of which communicates with an associated one of said non-ejecting channels (127,327). The ink ejecting device as claimed in any one of claims 1 and 2, wherein: said other electrodes (117,317,109,310) include a plurality of second electrodes (117,317) and a plurality of third electrodes (109,310), said second electrodes (117,317) provided on a portion of said first communicating portions (111B,311B) and a portion of said ink channels (104,304), said second electrodes (117,317) being electrically connected to said first electrodes (8,308) provided on the piezoelectric material facing said ink channels (104,304), said third electrodes (109,310) provided on a portion of said second communicating portions (111A,311A) and a portion of said non-ejecting channels (127,327), said third electrodes (109,310) being electrically connected to said first electrodes (8,308) provided on the piezoelectric material facing said non-ejecting channels (127,327). The ink ejecting device as claimed in claim 3, further comprising: a fourth electrode (117,317) formed adjacent to some of said plurality of communicating portions (111B,311B,111A,311A) and connected to one of a) said plurality of second electrodes (117,317) and b) said plurality of third electrodes (109,310); and a plurality of fifth electrodes (109,310) formed adjacent to the other of said plurality of communicating portions (111B,311B,111A,311A) and connected to the other of a) said plurality of second electrodes (117,317) and b) said plurality of third electrodes (109,310). The ink ejecting device as claimed in claim 3 or 4 wherein all of said first electrodes (8,308) provided in said ink channels (104,304) are electrically connected to each other through said second electrodes (117,317) which are electrically connected to said fourth electrode (117,317) and are grounded; a pair of said first electrodes (8,308) provided on the walls of the piezoelectric ceramic material defining each non-ejecting channel (127,327) are electrically connected to each other through said third electrodes (109,310) which are electrically connected to an associated one of said fifth electrodes (109,316) and when a voltage is applied to said first electrodes (8,308) in said non-ejecting channels (127,317) by a voltage source, ink is ejected from said ink channels (104,304). The ink ejecting device as claimed in any one of claims 2 to 5, further comprising: a first plate (302) of a piezoelectric ceramic material; a plurality of grooves (303) formed on one surface of said first plate (302), said partition walls (306) being formed for each of said grooves (303); and a second plate (320) provided on said first plate (302) so as to close said grooves (303) to form said ink channels (304) and non-ejecting channels (327), wherein said first communicating portions (311B) are provided along one edge of said first plate (302) and said second communicating portions (311A) are provided along another edge of said first plate (302) which is an opposite edge to the one edge, ink is supplied to only the ink channels (304) through said first communicating portions (311B). The ink ejecting device as claimed in claim 2; further comprising: a first plate (102) of a piezoelectric ceramic material; a plurality of grooves (103) formed on one surface of said first plate, said . partition walls (106) being formed for 'each of said grooves (103); a second plate (110) provided on said first plate (102) so as to close said grooves (103) to form said ink channels (104) and said non-ejecting channels (127); a fourth electrode (117) formed on a surface of said second plate (110) and adjacent to first communicating portions (111B) of said communicating portions (111A,111B), said fourth electrode (117) being electrically connected through said second electrodes (117) to said first electrodes (8) provided on the piezoelectric ceramic material facing one of said ink channels (104), wherein said first communicating portions (111B) are formed in said second plate (110), wherein said second communicating portions (111A) are provided in said second plate (110); and a plurality of third electrodes (109), each third electrode (109) provided on a portion of inner surfaces one of said second communicating portions (111A) and on a portion adjacent to said one of said second communicating portions (111A) on the surface of said second plate (110), each said third electrode (109) being electrically connected to a pair of first electrodes (8) provided on the piezoelectric ceramic material facing said non-ejecting channels (127) on opposite sides of a ink channel (104). The ink ejecting device as claimed in any one of claims 5, 6 or 7 wherein at least two said partition walls (106,306) form one of said grooves (103,303), said first electrodes (8,308) formed on said partition walls (106,306) facing said ink channels (104,304) are electrically connected to each other and grounded, and at least two of said first electrodes (8,308) formed on said partition walls (106,306) facing said non-ejecting channels (127,317) and forming one ink channel (104,304) are electrically connected to each other and selectively supplied with a voltage. The ink ejecting device as claimed in claim 2, further comprising: a plate (302) of a piezoelectric ceramic material; a plurality of grooves (303) formed on said piezoelectric ceramic plate (302), said partition walls (306) being formed for each of said grooves (303); and a cover plate (320) provided on said plate (302) so as to close said grooves (303) to form said first channels (304); a fourth electrode (317) formed on said piezoelectric ceramic plate (302) adjacent to said first communicating portions (311B); wherein said first communicating portions (311B) are provided in said piezoelectric ceramic plate (302), each of said first communicating portion (311B) communicating with an associated one of said ink channels (304). The ink ejecting device as claimed in claim 9, further comprising: a plurality of third electrodes (310,316); wherein said second communicating portions (311A) provided in said piezoelectric ceramic plate (302), each of said second communicating portions (311A) communicating with an associated one of said non-ejecting channels (327); and a plurality of third electrodes (310,316) are provided on a portion of inner surfaces of said second communicating portions (311A) and on a portion adjacent to said second communicating portions (311A) on a second surface of said piezoelectric ceramic plate (302), said third electrodes (316) being electrically connected to said first electrodes (308) provided on the piezoelectric ceramic material facing said non-ejecting channels (327). The ink ejecting device as claimed in claim 10, wherein said first communicating portions (311B) are provided on a first side of said piezoelectric ceramic plate (302) and said second communicating portions (311A) are provided on a second side of said piezoelectric ceramic plate (302) which is an opposite side of the first side, ink is supplied to only the ink channels (304) through said first communicating portions (311B). The ink ejecting device as claimed in claim 10 or 11 wherein selectively energizing electrodes (324) which are provided to a front surface of said partition walls (306) confronting second channels (327) generates an electric field in the piezoelectric ceramic material of the corresponding partition walls (306). The ink ejecting device as claimed in any one of claims 1, 2 and 9 to 12 wherein the first electrodes (8,308) facing the ink channels (104,304) are grounded. The ink ejecting device as claimed in claim 7, 10 or 11, further comprising fifth electrodes (109,316) wherein all of said first electrodes (8,308) provided in said ink channels (104,304) are electrically connected to each other through said second electrodes (117,317) which are electrically connected to said fourth electrode (117,317) and are grounded, first electrodes (8,308) provided on a wall of the piezoelectric ceramic material in each non-ejecting channel (127,327) of a pair of said non-ejecting channels (127,327) sandwiching one of said ink channels (104,304) are electrically connected to each other by said third electrodes (109,310) and said fifth electrodes (109,316) and a voltage is selectively applied to said first electrodes (8,308) in said non-ejecting channels (127,327), whereby ink is in use ejected from said ink channels (104,304). The ink ejecting device as claimed in any one of claims 1 to 14 wherein the piezoelectric ceramic material forming said partition walls (106,306) is polarized in a first direction and a direction of an electric field generated in the piezoelectric ceramic material is perpendicular to the first direction.

Inventors: ASAI HIROKI, SUGAHARA HIROTO, ZHANG QIMING, ASAI, HIROKI, SUGAHARA, HIROTO, ZHANG, QIMING, Asai, Hiroki, Brother Kogyo K. K., Sugahara, Hiroto, Brother Kogyo K.K., Zhang, Qiming, Brother Kogyo K.K.
Applicants: BROTHER IND LTD, BROTHER KOGYO KABUSHIKI KAISHA
Application year: 1994
Main classification: B41J2
IPC codes: B41J2