Silicone compositions for the formation of cured release coatings

Abstract: The present invention relates to silicone release coating compositions comprising (A) a mixture of (i) a dimethylsiloxane-methylvinylsiloxane-methylphenyl-siloxane copolymer and (ii) a dimethylsiloxane- methylvinylsiloxane copolymer, (B) an organohydrogenpolysiloxane, (C) a platinum catalyst, and (D) an organic solvent. These silicone release coating compositions provide small release resistance values both at low and high peeling velocities and do not impair the residual adhesion of tacky substances that come into contact with the coating.

Description: The present invention relates to a silicone composition that cures to form a release coating. The silicone composition of our invention provides the surfaces of various types of substrates such as papers, laminated papers, synthetic plastic films, and metal foils with the ability to release tacky substances by formation of a cured organopolysiloxane coating on the substrate surface. Silicone compositions that cure to form release coatings (silicone release compositions) are applied to release liners for pressure-sensitive adhesive tapes and sheets to form thereon a cured coating that is capable of releasing tacky substances. The release coatings used in such applications must exhibit small release resistance values both at low peel velocities (below approximately 0.3 m/minute) and at high peel velocities (above approximately 50 m/minute). Japanese Patent Publication 2-187466 teaches an example of such a silicone release composition. It consists of a platinum catalyst, an organohydrogenpolysiloxane, and a diorganopolysiloxane mixture composed of a dimethylsiloxane-methylvinylsiloxane copolymer and a dimethylsiloxane-methylvinylsiloxane-diphenylsiloxane copolymer containing 0.5 to 3.0 mole percent of mono or diphenylsiloxane units. This composition gives high release resistance values in general and also reduces the residual adhesion of tacky substances brought into contact with its cured release coating. Thus, depending on the application, its performance is not always satisfactory. The present invention introduces a silicone release composition which cures to form a release coating that exhibits small release resistance values at both low and high peeling velocities. Our silicone release coating composition does not impair the residual adhesion of tacky substances that are brought into contact with its cured release coating. The present invention is a silicone release coating composition comprising: (A) 100 weight parts of a mixture of: (i) 90.0 to 99.0 weight percent of a polydiorganosiloxane having the general formula: wherein R 1 is independently selected from a hydroxyl group, a vinyl group, a methyl group, and a phenyl group, x, y, and z are positive integers such that 0.86 ≤ x/(x + y + z) < 0.94, 0.03 < y/(x + y + z) ≤ 0.07, and 0.03 ≤ z/ (x + y + z) ≤ 0.07, and (ii) 1.0 to 10.0 weight percent of a polydiorganosiloxane having the general formula: wherein R 2 is independently selected from a hydroxyl group, a vinyl group, and a methyl group, p is a positive integer and q represents 0 or a positive integer such that 0.995 ≤ p/(p + q) ≤ 1.0 and 0 ≤ q/(p + q) ≤ 0.005; provided that in case q represents 0, R 2 must be a vinyl group; (B) 3 to 50 weight parts of an organohydrogenpolysiloxane compound having at least 3 silicon-bonded hydrogen atoms in each compound; (C) a platinum catalyst; and (D) an arbitrary amount of organic solvent. The polydiorganosiloxane mixture comprising Component (A) in the present invention comprises the polydiorganosiloxane Component (i) and the polydiorganosiloxane Component (ii). The polydiorganosiloxane of Component (i) is a dimethylsiloxane-methylphenylsiloxane-methylvinylsiloxa ne copolymer having the following general formula: wherein R 1 is independently selected from a hydroxyl group, a vinyl group, a methyl group, and a phenyl group, x, y, and z are positive integers such that 0.86 ≤ x/(x + y + z) < 0.94, 0.03 < y/(x + y + z) ≤ 0.07, and 0.03 ≤ z/(x + y + z) ≤ 0.07. With respect to the y/(x + y + z) conditions, values of y/(x + y + z) ≤ 0.03 result in large release resistance values at low peeling velocities, while values in excess of 0.07 result in large release resistance values both at low and high peeling velocities. Values in the range of 0.04 to 0.06 are preferred for y/(x + y + z). With respect to the z/(x + y + z) conditions, values of z/(x + y + z) less than 0.03 result in large release resistance values at high peeling velocities, while values in excess of 0.07 result in large release resistance values at low peeling velocities. Values in the range of 0.04 to 0.06 are preferred for z/(x + y + z). The value of (x + y + z) is preferably such that a 30 weight percent toluene solution of Component (i) has a viscosity at 25°C of at least 500 mm 2/s (centistokes) and preferably of 3,000 to 20,000 mm 2/s (centistokes). The content of Component (i) in Component (A) falls in the range of 90.0 to 99.0 weight percent. The polydiorganosiloxane of Component (ii) is a dimethylsiloxane-methylvinylsiloxane copolymer having the following general formula: wherein R 2 is independently selected from a hydroxyl group, a vinyl group, and a methyl group, p is a positive integer and q represents 0 or a positive integer such that 0.995 ≤ p/(p + q) ≤ 1.0 and 0 ≤ q/(p + q) ≤ 0.005; provided that in case q represents 0, R 2 must be a vinyl group. With respect to the q/(p + q) conditions, values of q/(p + q) in excess of 0.005 result in large release resistance values at low peeling velocities. Values in the range of 0 to 0.003 are preferred for q/(p + q). The value of (p + q) is preferably such that a 30 weight percent toluene solution of Component (ii) has a viscosity at 25°C of at least 500 mm 2/s (centistokes) and preferably of 3,000 to 20,000 mm 2/s (centistokes). The content of Component (ii) in Component (A) falls in the range of 1.0 to 10.0 weight percent and it is preferred that it range between 3.0 to 7.0 weight percent. When the content of Component (ii) falls below 1.0 weight percent, large release resistance values are exhibited at low peeling velocities. However, if the content of Component (ii) is in excess of 10.0 weight percent this causes in a reduction in the residual adhesion of tacky substances that are applied to the cured release coating. The organohydrogenpolysiloxane compound of Component (B) in the present invention functions as a crosslinker. This component must contain at least 3 silicon-bonded hydrogen atoms in each molecule, but the bonding positions of these silicon-bonded hydrogen atoms are not specifically restricted. The silicon-bonded organic groups present in addition to the silicon-bonded hydrogen comprise monovalent hydrocarbon groups that are free of aliphatic unsaturation alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, and hexyl; aryl groups such as phenyl, tolyl, and xylyl; and aralkyl groups such as benzyl and phenethyl. This component preferably has a viscosity at 25°C of 1 to 1,000 mm 2/s (centistokes). Highly preferred linear organohydrogenpolysiloxanes of this invention have the formula YMe 2 SiO(Me 2 SiO) p (MeYSiO) q SiMe 2 Y wherein Y denotes a hydrogen atom or a methyl radical. An average of at least three Y radicals per compound must be hydrogen atoms. The subscript p can have an average value of zero or more; q must have a value of at least one; and the sum of p plus q has a value of from 1 to 1000. Component (B) is added at 3 to 50 weight parts per 100 weight parts Component (A). The present invention composition exhibits inadequate cure when less than 3 weight parts of Component (B) are added. The release resistance values of the cured release coating tend to vary with elapsed time when Component (B) is added in excess of 50 weight parts. The platinum catalyst comprising Component (C) in the present invention is a catalyst that accelerates the cure of our claimed composition. This Component is exemplified by platinum, such as platinum black, platinum supported on silica, and platinum supported on active carbon, and by platinum compounds, such as chloroplatinic acid, alcohol solutions of chloroplatinic acid, chloroplatinic acid-olefin complexes, and chloroplatinic acid-alkenylsiloxane complexes. A preferred platinum-containing catalyst is a form of chloroplatinic acid, either as the commonly available hexahydrate form or as the anhydrous form, as taught by US-A 2,823,218. A particularly useful catalyst is the composition that is obtained when chloroplatinic acid is reacted with an aliphatically unsaturated organosilicon compound such as divinyltetramethyldisiloxane, as disclosed by US-A 3,419,593, because of its easy dispersibility in organosilicone systems. Other catalysts which are useful in the present invention include US-A(s) 3,159,601; 3,159,662; 3,220,972; 3,296,291; 3,516,946; 3,814,730 and 3,928,629. Component (C) is added in a catalytic quantity, and is preferably added in a quantity that provides 1 to 1,000 ppm platinum metal per the sum of the quantities of Components (A) and (B). The organic solvent of Component (D) of our invention should be inert with respect to Components (A), (B), and (C). Solvents suitable as Component (D) include, hydrocarbons such as toluene, xylene, hexane, and heptane and chlorinated hydrocarbons. The compositions of the present invention may also contain those additives known for use in silicone release compositions insofar as the object of the invention is not impaired. These additives are exemplified by inorganic fillers such as silica, pigments, heat stabilizers, organic resin powders, any inhibitors such as the acetylenic alcohols of US-A 3,445,420, such as ethynylcyclohexanol and methylbutynol; conjugated ene-ynes US-A(s) 4,465,818 and 4,472,563; the unsaturated carboxylic esters of US-A 4,256,870, such as diallyl maleate and dimethyl maleate; and the maleates and fumarates of US-A(s) 4,562,096 and 4,774,111, such as diethyl fumarate, diallyl fumarate, and bis-(methoxyisopropyl) maleate. The half esters and amides of US-A 4,533,575; and the inhibitor mixtures of US-A 4,476,166. All of the above references teach inhibitors suitable for use in the release coating compositions of the instant invention. The amount of inhibitor to be used is not critical and can be any amount that will retard the above described catalyzed reaction at room temperature while not preventing said reaction at elevated temperature. No specific amount of inhibitor can be suggested to obtain a specified bath life at room temperature since the desired amount of any particular inhibitor to be used will depend upon the concentration and type of the platinum group metal containing catalyst, the nature and amounts of Components (A), (B), (C) and (D) and the presence or absence of optional ingredients. It is preferred for purposes of this invention that from zero to 5 weight percent of inhibitor be used in the compositions of the instant invention, said weight percent being based on the total weight of the composition. Other inhibiting compounds in a total amount sufficient to further retard the curing reaction at room temperature such as those described in US-A 5,036,117, are also suitable for use in the present invention. Suitable other inhibiting compounds include compounds having one or more primary or secondary alcohol groups, carboxylic acids (including compounds which yield carboxylic acids when exposed to water at room temperature), cyclic ethers, and water. Included are the primary and secondary alcohols; diols and triols, such as ethylene glycol, propylene glycol and glycerine; partial ethers of diols and triols, such as 2-methoxyethanol, 2-methoxypropanol, and 2-methoxyisopropanol; tetrahydrofuran; water and aqueous solutions of mineral acids, alkalis, and salts. Primary and secondary alcohols, preferably having fewer than 10 carbon atoms are the most preferred for the compositions of this invention. Examples thereof include methanol, 1-butanol, 2-butanol, tetradecanol and other alkanols, such as ethanol, normal-, and isopropanol, iso-butanol, and the normal-, secondary-, and iso-pentanols, -hexanols, -heptanols, and -octanols; benzyl alcohol, phenol, and other aromatic alcohols such as methylphenyl carbinol, and 2-phenylethyl alcohol; allyl alcohol, and cyclohexanol. It is highly preferred that said other inhibiting compounds is benzyl alcohol or water. The amount of said other inhibiting compounds used in the compositions of this invention is not critical and is merely that amount which will provide a longer bath life than an identical composition without the inhibiting compound. Thus, amount of said other inhibiting compounds can be as high as 10 percent or more by weight, based on the weight of Component (A), however superior results with respect to bath life and cure time can be obtained using a lesser amount. Preferably, the amount of said other inhibiting compound will fall within the range of 0.1 to 5 percent, and most preferably 1 to 3 percent based on the weight of Component (A). The compositions of the present invention are prepared simply by mixing Components (A), (B), (C), and (D) and any optional components to homogeneity. It is preferred that Components (A), (B), and (D) be mixed first and that the platinum catalyst comprising Component (C) then be mixed in. Our invention also provides a process for preparing a laminate of a substrate and an adhesive wherein the adhesive will release from the substrate. The process comprises the steps of (I) coating a curable silicone release composition on the surface of the substrate wherein the composition comprises the release coating composition delineated above, (II) exposing the coating to an energy source selected from (i) heat and (ii) actinic radiation in an amount sufficient to cure the coating, and (III) applying a pressure sensitive adhesive on the coating. An inhibitor and other inhibiting compounds may also be used as described above. By "actinic radiation" it is meant ultraviolet light; electron beam radiation; and alpha-, beta-, gamma- and x-rays. By "heat" it is meant infrared radiation, hot-air, and microwave radiation. Of course actinic radiation is frequently accompanied by heat and the use of a combination of the two falls within the present process. The pressure sensitive adhesive can be non-silicone-based, such as the well-known acrylic or rubber types or silicone-based, such as the peroxide-or platinum-curable polydicrganosiloxane-based adhesives. Coating and curing of the compositions of this invention on the surface of various substrates such as different types of papers, laminated papers, and synthetic plastic films, will yield a coating thereon that is capable of releasing tacky substances. The composition of our invention can also be used as a release coating for applications other than release liners. The present invention is explained below in greater detail through working examples. The viscosity values reported in the examples were measured at 25°C. The cured coatings afforded by our silicone release compositions were subjected to tests of the release resistance value, silicone migration, and residual adhesion (%) of tacky substance by the following methods. Release resistance value The silicone release composition was coated in the reported quantity on the surface of paper and the cured film was prepared. This film was coated with an acrylic-based pressure-sensitive adhesive (Oribine™ BPS5127, from Toyo Ink Mfg. Company, Limited), which was dried by heating for 2 minutes at 70°C. Backing paper was subsequently applied to the preparation, which was thereafter held for 24 hours at 25°C and 60% humidity under a load of 20 g/cm 2 . The force (g f ) required for removal was then measured by peeling off the backing paper at an angle of 180°. These measurements were carried out at velocities of 0.3 m/minute, 50 m/minute, and 100 m/minute using a Tensilcn and a high-speed peeling test instrument. The specimen width was 2.5 cm in all cases. Silicone migration Release paper was fabricated by coating the silicone release composition in the reported quantity on the surface of paper and producing the cured film. A clean polyester film was laid onto the surface of the release paper, and this preparation was held at 25°C for 30 minutes while loaded with 100 kg/cm 2 using a press. The polyester film was then peeled off, and a line was drawn with an ink marker on the surface of the polyester film that had been in contact with the release paper. The degree of beading by the ink was evaluated as follows. The absence of beading by the ink indicated that silicone migration had not occurred, while the occurrence of ink beading indicated that silicone migration had taken place. Residual adhesion The silicone release composition was coated in the reported quantity on the surface of paper and the cured film was prepared. Pressure-sensitive adhesive tape (Nitto™ Polyester Pressure-Sensitive Tape 31B, from Nitto Denko Kabushiki Kaisha) was applied to the surface of the film, and the assembly was then aged for 20 hours at 70°C under a load of 20 g/cm 2 . The pressure-sensitive adhesive tape was subsequently removed and applied to a stainless steel sheet. After holding for 30 minutes at 25°C under a load of 20 g/cm 2 . The pressure-sensitive adhesive tape was then peeled at 180° and 0.3 m/minute with the force (g f ) required for peeling measured. The blank test consisted of application of the same type of pressure-sensitive adhesive tape to a Teflon™ sheet under the same conditions as above followed by measurement of the force (g f ) required to peel the tape, again using the same conditions as above. The residual adhesion (%) was calculated using the obtained measurement values and the following equation: Example 1 The following were dissolved in 1,420 weight parts toluene: 94 weight parts of a trimethylsiloxy-endblocked dimethylsiloxane-methylvinylsiloxane-methyl phenylsiloxane copolymer (having a viscosity in the 30 weight percent toluene solution of this copolymer of 3,000 mm 2/s [centistokes]), comprising 90 mole percent dimethylsiloxane units, 5 mole percent methylvinylsiloxane units, and 5 mole percent methylphenylsiloxane units, and 6 weight parts of a dimethylvinylsiloxy-endblocked dimethylpolysiloxane (having a viscosity in the 30 weight percent toluene solution of this dimethylpolysiloxane of 15,000 mm 2/s [centistokes]). The following were then homogeneously dissolved into this solution: 7 weight parts of trimethylsiloxy-endblocked methylhydrogenpolysiloxane (having a viscosity of 20 mm 2/s [centistokes]) and 2 weight parts 3-methyl-1-butyn-3-ol. A silicone release composition was finally prepared by mixing into the resulting solution a sufficient amount of a 3 weight percent isopropanolic chloroplatinic acid solution to yield 200 ppm platinum metal. The resulting silicone release composition was coated on the surface of polyethylene-laminated high-grade paper so as to yield a value of approximately 0.6 g/m 2 for the sum of Components (A), (B), and (C). A cured film was produced by heating the coated paper at 130°C for 20 seconds. This cured film was subjected to tests for its release resistance value, silicone migration, and residual adhesion as delineated above. These results are reported in Table 1. Example 2 The following were dissolved in 1,420 weight parts toluene: 96 weight parts of a dimethylvinylsiloxy-endblocked dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxa ne copolymer (having a viscosity in the 30 weight percent toluene solution of this copolymer of 5,000 mm 2/s [centistokes]), comprising 92.5 mole percent dimethylsiloxane units, 4 mole percent methylvinylsiloxane units, and 3.5 mole percent methylphenylsiloxane units, and 4 weight parts trimethylsiloxy-endblocked dimethylsiloxane-methylvinylsiloxane copolymer (having a viscosity in the 30 weight percent toluene solution of this copolymer of 5,000 mm 2/s [centistokes]) comprising 99.7 mole percent dimethylsiloxane units and 0.3 mole percent methylvinylsiloxane units. The following were then homogeneously dissolved into this solution: 1 weight part 3-methyl-1-butyn-3-ol and 10 weight parts trimethylsiloxy-endblocked dimethylsiloxane- methylhydrogensiloxane copolymer (having a viscosity of 70 mm 2/s [centistokes]) comprising 30 mole percent dimethylsiloxane units and 70 mole percent methylhydrogensiloxane units. A silicone release composition was finally prepared by mixing into the resulting solution a sufficient amount of a 3 weight percent isopropanolic chloroplatinic acid solution to yield 200 ppm platinum metal. The resulting silicone release composition was coated on the surface of polyethylene-laminated high-grade paper to yield a value of approximately 0.6 g/m 2 for the sum of Components (A), (B), and (C). A cured film was produced by heating the coated paper at 130°C for 20 seconds. This cured film was subjected to tests for its release resistance value, silicone migration, and residual adhesion. The results are also reported in Table 1. Comparative Example 1 A silicone release composition was prepared as in Example 1, but in this case using a trimethylsiloxy-endblocked dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxa ne copolymer (having a viscosity in the 30 weight percent toluene solution of this copolymer of 3,000 mm 2/s [centistokes]) comprising 94 mole percent dimethylsiloxane units, 5 mole percent methylvinylsiloxane units, and 1 mole percent methylphenylsiloxane units in place of the trimethylsiloxy-endblocked dimethylsiloxane (90 mole percent)-methylvinylsiloxane (5 mole percent)-methylphenylsiloxane (5 mole percent) copolymer that was used in Example 1. The resulting silicone release composition was coated on the surface of polyethylene-laminated high-grade paper so as to yield a value of approximately 0.6 g/m 2 for the sum of Components (A), (B), and (C). A cured film was produced by heating at 130°C for 20 seconds. This cured film was subjected to the tests for its release resistance value, silicone migration, and residual adhesion. The results are reported in Table 1. Comparative Example 2 A silicone release composition was prepared as in Example 1, but in this case using a trimethylsiloxy-endblocked dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxa ne copolymer (having a viscosity in the 30 weight percent toluene solution of this copolymer of 5,000 mm 2/s [centistokes]) comprising 84 mole percent dimethylsiloxane units, 6 mole percent methylvinylsiloxane units, and 10 mole percent methylphenylsiloxane units in place of the trimethylsiloxy-endblocked dimethylsiloxane (90 mole percent) -methylvinylsiloxane (5 mole percent)-methylphenylsiloxane (5 mole percent) copolymer that was used in Example 1. The resulting silicone release composition was coated on the surface of polyethylene-laminated high-grade paper so as to yield a value of approximately 0.6 g/m 2 for the sum of Components (A), (B), and (C). A cured film was produced by heating the coated paper at 130°C for 20 seconds. This cured film was subjected to tests for its release resistance value, silicone migration, and residual adhesion. These results are reported in Table 1. Comparative Example 3 A silicone release composition was prepared as in Example 1, but in this case using a dimethylvinylsiloxy -endblocked dimethylsiloxane-methylvinylsiloxane copolymer (having a viscosity in the 30 weight percent toluene solution of the copolymer of 15,000 mm 2/s [centistokes]) comprising 98 mole percent dimethylsiloxane units and 2 mole percent methylvinylsiloxane units in place of the dimethylvinylsiloxy-endblocked dimethylpolysiloxane that was used in Example 1. The resulting silicone release composition was coated on the surface of polyethylene-laminated high-grade paper so as to yield a value of approximately 0.6 g/m 2 for the sum of Components (A), (B), and (C). A cured film was produced by heating the coated paper at 130°C for 20 seconds. This cured film was subjected to tests for its release resistance value, silicone migration, and residual adhesion. These results are reported in Table 1. Comparative Example 4 A silicone release composition was prepared as in Example 1, but in this case using a dimethylhydroxysiloxy- endblocked dimethylpolysiloxane (having a viscosity of about 10,000 centistokes) in place of the dimethylvinylsiloxy- endblocked dimethylpolysiloxane that was used in Example 1. The resulting silicone release composition was coated on the surface of polyethylene-laminated high-grade paper so as to yield a value of approximately 0.6 g/m 2 for the sum of Components (A), (B), and (C). A cured film was produced by heating at 130°C for 20 seconds. This cured film was subjected to tests for its release resistance value, silicone migration, and residual adhesion. These results are reported in Table 1. Comparative Example 5 A silicone release composition was prepared as in Example 1, but in this case altering the amounts in Example 1 to 99.5 weight parts for the trimethylsiloxy-endblocked dimethylsiloxane (90 mole percent) -methylvinylsiloxane (5 mole percent)-methylphenylsiloxane (5 mole percent) copolymer and to 0.5 weight parts for the dimethylvinylsiloxy-endblocked dimethylpolysiloxane. The resulting silicone release composition was coated on the surface of polyethylene-laminated high-grade paper so as to yield a value of approximately 0.6 g/m 2 for the sum of Components (A), (B), and (C). A cured film was produced by heating the coated paper at 130°C for 20 seconds. This cured film was subjected to tests for its release resistance value, silicone migration, and residual adhesion. These results are reported in Table 1. Comparative Example 6 A silicone release composition was prepared as in Example 1, but in this case altering the amounts in Example 1 to 80 weight parts for the trimethylsiloxy-endblocked dimethylsiloxane (90 mole percent)-methylvinylsiloxane (5 mole percent)-methylphenylsiloxane (5 mole percent) copolymer and to 20 weight parts for the dimethylvinylsiloxy-endblocked dimethylpolysiloxane. The resulting silicone release composition was coated on the surface of polyethylene-laminated high-grade paper so as to yield a value of approximately 0.6 g/m 2 for the sum of Components (A), (B), and (C). A cured film was produced by heating the coated paper at 130°C for 20 seconds. This cured film was subjected to tests for its release resistance value, silicone migration, and residual adhesion. These results are reported in Table 1. Comparative Example 7 A silicone release composition was prepared as in Example 1, but in this case using a trimethylsiloxy-endblocked dimethylsiloxane-methylvinylsiloxane-diphenylsiloxane copolymer (90 mole percent dimethylsiloxane units, 5 mole percent methylvinylsiloxane units, 5 mole percent diphenylsiloxane units) in place of the trimethylsiloxy-endblocked dimethylsiloxane (90 mole percent)-methylvinylsiloxane (5 mole percent)-methylphenylsiloxane (5 mole percent) copolymer that was used in Example 1. The resulting silicone release composition was coated on the surface of polyethylene-laminated high-grade paper so as to yield a value of approximately 0.6 g/m 2 for the sum of Components (A), (B), and (C). A cured film was produced by heating the coated paper at 130°C for 20 seconds. This cured film was subjected to tests for its release resistance value, silicone migration, and residual adhesion. These results are reported in Table 1. release resistance values (g f /2.5 cm) residual adhesion (%) silicone migration 0.03 m/min 50 m/min 100 m/min Example 1 8 45 65 98 no Example 2 8 35 60 99 no Comparative Example 1 26 60 85 98 no Comparative Example 2 34 70 100 94 yes Comparative Example 3 28 65 90 98 no Comparative Example 4 20 50 70 90 yes Comparative Example 5 32 50 75 99 no Comparative Example 6 7 80 105 92 yes Comparative Example 7 41 93 135 93 yes

Claims: A silicone release coating composition comprising: (A) 100 weight parts of a mixture of: (i) 90.0 to 99.0 weight percent of a polydiorganosiloxane having the general formula: wherein R 1 is independently selected from the group consisting of a hydroxyl group, a vinyl group, a methyl group, and a phenyl group, x, y, and z are positive integers such that 0.86 ≤ x/(x + y + z) < 0.94, 0.03 < y/(x + y + z) ≤ 0.07, and 0.03 ≤ z/(x + y + z) ≤ 0.07 and (ii) 1.0 to 10.0 weight percent of a polydiorganosiloxane having the general formula: wherein R 2 is independently selected from the group consisting of a hydroxyl group, a vinyl group, and a methyl group, p is a positive integer and q represents 0 or a positive integer such that 0.995 ≤ p/ (p + q) ≤ 1.0 and 0 ≤ q/(p + q) ≤ 0.005 ; provided that in case q represents 0, R 2 must be a vinyl group; (B) 3 to 50 weight parts of an organohydrogenpolysiloxane compound having at least 3 silicon-bonded hydrogen atoms in each compound; (C) a curing amount of platinum catalyst; and (D) an arbitrary amount of organic solvent. A composition according to Claim 1, wherein y is a positive integer such that the value of y/(x + y + z) is from 0.04 to 0.06. A composition according to Claim 1, wherein z is a positive integer such that the value of z/(x + y + z) is from 0.04 to 0.06. A composition according to Claim 1, wherein (i) and (ii) have a viscosity at 25°C of 3,000 to 20,000 mm 2/s (centistokes) in a 30 weight percent solution of toluene. A composition according to Claim 1, wherein the composition further comprises an inhibitor selected from acetylenic alcohols, conjugated ene-ynes, maleates, and fumarates. A composition according to Claim 5, wherein the composition further comprises another inhibiting compound selected from compounds having one or more primary or secondary alcohol groups, carboxylic acids, compounds which yield carboxylic acids when exposed to water at room temperature, cyclic ethers, and water. A process for preparing a laminate of a substrate and an adhesive wherein the adhesive will release from the substrate, the process comprising the steps of: (I) coating a curable silicone release composition on the surface of the substrate wherein the composition comprises the composition of Claim 1; (II) exposing the coating to an energy source selected from (i) heat and (ii) actinic radiation in an amount sufficient to cure the coating; and (III) applying a pressure sensitive adhesive on the coating. A process according to Claim 7, wherein the substrate is paper.

Inventors: TOGASHI ATSUSHI, YAMADA TAKATERU, TOGASHI, ATSUSHI, DOW CORNING TORAY SILICONE, YAMADA, TAKATERU, DOW CORNING TORAY SILICONE
Applicants: DOW CORNING TORAY SILICONE, DOW CORNING TORAY SILICONE COMPANY, LIMITED
Application year: 1994
Main classification: C08L83
IPC codes: C09D183, C08L83, C09J7