A power semiconductor circuit

Abstract: A power semiconductor device circuit (1a) has an insulated gate field effect power semiconductor device (2) with first and second main electrodes (3 and 4) and a gate electrode (6). A gate control circuit (6a, 6c, 6c, 6d) provides a conductive path between the gate electrode (5) and a gate voltage supply terminal (G). The gate control circuit (6) has a resistance (R3) coupled between the gate electrode (5) and the gate voltage supply terminal (G). A switching device (Q1, D1, Q2) has first and second main electrodes coupled to the gate voltage supply terminal G and the gate electrode 5, respectively, so that the main current path between the first and second main electrodes is coupled in parallel with the resistance (R2), the switching device Q1, D1, Q2 having a first non-conducting state and a second conducting state for providing in the second conducting state an additional resistance in parallel with the resistance (R2), the switching device being arranged to switch from one of the first and second states to the other when the voltage at the gate voltage supply terminal (G) changes in order to turn the power semiconductor device (2) on or off or upon the detection of a fault condition within the power semiconductor device so as to alter the overall resistance of the conductive path between the gate electrode (Figure 1) and the gate voltage supply terminal (G).

Description: This invention relates to a power semiconductor circuit comprising an insulated gate field effect power semiconductor device, a gate control circuit for controlling the application of voltages to the insulated gate electrode of the power semiconductor device, and a fault detection circuit for switching off the power semiconductor device when an abnormal condition is detected. US-A-4928053 describes a power semiconductor device circuit in which the power semiconductor device is an n-channel power MOSFET intended to be used as a high-side switch for an inductive load. As will be understood by those skilled in the art, a 'high-side switch' in the case of an n-channel device is a switch which is coupled between the load and the more positive of the two voltage supply lines. In the circuit described in US-A-4928053, a voltage clamping circuit in the form of a zener diode is coupled between the positive voltage supply terminal to which one main electrode of the power semiconductor device is coupled and the gate electrode of the power semiconductor device. The main current path, that is the current path between its main electrodes, of an n-channel MOS transistor is coupled between the gate and the other main electrode of the power semiconductor device. The gate electrode of the n-channel MOST is coupled together with the gate electrode of a p-channel MOST to the other supply line which is, as shown, at ground. The main current path of the p-channel MOS transistor is coupled between the gate electrode of the power MOSFET and a gate drive circuit. In operation of the circuit described in US-A-4928053 when an overvoltage occurs due to the switching of the inductive load, the zener diode breaks down and the n-channel MOS transistor provides a conduction path, bypassing the power semiconductor device, for dissipation of the energy in the inductive load. At the same time, the p-channel MOS is switched off so isolating the power MOSFET from the gate drive circuit. Published Abstract 1-082708 of JP-A-64-82708 in the Patent Abstracts of Japan discloses a MOSFET driving circuit designed to enable fast switching operation by the provision of parallel branch networks of diodes and resistances in a gate circuit of the MOSFET. The diodes are so arranged that different paths through the network are used when switching on and when switching off the MOSFET. Fast switching of the diodes occurs with reverse recovery values according to the direction of charge flow and the switched resistance value. Published German patent application DE-A-39 36 544 discloses a switch arrangement for the protection of a MOSFET when an abnormal condition such as a short-circuit or excess temperature is detected in operation of the MOSFET. The gate control circuit of the MOSFET comprises a controllable resistance in the form of a depletion-mode FET coupled between the gate electrode of the MOSFET and a gate voltage supply terminal. A short-circuit is detected by comparing the source to drain voltage of the MOSFET with a reference voltage, an excess value being used to turn on a switch which discharges the gate-source capacitance of the MOSFET. This switch is also coupled to the gate of the depletion-mode FET to reduce its gate voltage and thereby to increase the resistance of the depletion-mode FET when the switch is turned on. In this way, the MOSFET can be turned off when a short-circuit is detected. In the Figure 2 embodiment of DE-A-39 36 544, a temperature sensor is also included together with logic gates and a delay circuit so that detection of an excess temperature can be used to turn on the switch which then functions in the same way to turn off the MOSFET. It is an aim of the present invention to provide a power semiconductor device circuit having a gate control circuit to facilitate switching on or off of the power semiconductor device in response to the voltage at the gate voltage supply terminal, and also to facilitate switching off the power semiconductor device when an abnormal condition is detected by a fault detection circuit. According to the present invention, there is provided a power semiconductor device circuit as set out in Claim 1. Attention is directed to the final paragraph of the description with regard to the non-limiting role in this Claim of the reference signs relating to features in the drawings. Thus, in a circuit in accordance with the invention, the overall resistance of the conductive path between the gate voltage supply terminal and the gate electrode of the power semiconductor device can be modified or altered by controlling the conduction of the switching transistor connected in parallel with the first resistance in response to changes in the voltage at the gate voltage supply terminal or upon detection of a fault condition. This should enable the switching speed of the power semiconductor device to benefit from any ac signal type low impedance gate drive circuit coupled to the gate voltage supply terminal during normal operation of the power semiconductor device but allow the overall resistance of the conductive path between the gate electrode and the gate voltage supply terminal to be adjusted under abnormal conditions of the power semiconductor device to reduce the problems any such low impedance drive might otherwise cause. In an abnormal condition as detected by the fault detection circuit, the power semiconductor device is switched off by the turn on of the other transistor whose main electrodes are coupled respectively to the gate electrode of the power semiconductor device and to a voltage supply. The gate control circuit may also include a further switching device coupled between the gate voltage supply terminal and the gate electrode of the power semiconductor device to facilitate turn off of the power semiconductor device when the voltage at the gate voltage supply terminal changes in order to turn off the power semiconductor device, the further switching device being in parallel with the switching transistor. The further switching device may comprise a rectifying diode coupled in parallel with the first resistance. The rectifying diode may be arranged to conduct when the gate voltage supply terminal changes in order to turn the power semiconductor device off. As an alternative the further switching device may comprise a transistor and means may be provided for applying a control signal to the control electrode of the transistor to cause the transistor to switch between the first and second states. Thus, for example, the further switching device may comprise an insulated gate field effect transistor and the control signal applying means may comprise a coupling between the control electrode of the transistor and the gate electrode of the power semiconductor device for causing this transistor to be rendered conducting when the gate voltage is removed from the gate voltage supply terminal thereby reducing the overall resistance between the gate electrode and the gate voltage supply terminal. A resistance may be coupled in series with this transistor or the switching transistor to enable the switching speed of the power semiconductor device to be adjusted. The gate control circuit thus enables the desired relatively high resistance to be provided in the conductive path between the gate voltage supply terminal and the gate electrode of the power semiconductor device during normal turn on of the device and enables the resistance of the conductive path to be reduced automatically when the gate voltage is removed in order to switch off the power semiconductor device so reducing the time taken for the power semiconductor to be switched off. The means for applying the control signal to the switching transistor may comprise a further resistance coupled in series with the main current path between first and second main electrodes of a further transistor to a voltage supply, the first main electrode of the further transistor being coupled to the further resistance and to the control electrode of the switching transistor so that the switching transistor is normally conducting, the further transistor having a control electrode coupled to the output of the fault detection circuit for causing this further transistor to be rendered conducting and so switching the switching transistor to its non-conducting first state when an abnormal condition is indicated by the output signal from the fault detection circuit. A voltage clamping circuit may be coupled between one of the first and second main electrodes and the gate electrode of the power semiconductor device for causing the power semiconductor device to be switched from a non-conducting to a conducting state when the voltage at the one main electrode exceeds a predetermined limit. It should be noted that US Patent No 5173848 describes a motor controller in which the series resistance between the gate drive circuit and the insulated gate of an insulated gate bipolar transistor (IGBT) has a switchable FET (Field Effect Transistor) coupled in parallel with a resistance in the conductive path to the insulated gate of the IGBT. The switchable FET is normally conducting; however a sensing circuit is provided to switch off the FET when the load voltage of the IGBT falls below a given value to cause a relatively slow transition from turn on to turn off to avoid an overshoot voltage. Embodiments of the invention will now be described with reference to the accompanying drawings, in which: Figure 1 is a circuit diagram of a power semiconductor device circuit which is not in accordance with the invention; Figure 2 is a circuit diagram of a modified version of the Figure 1 circuit; Figure 3 is a circuit diagram for a first embodiment of a power semiconductor device circuit in accordance with the invention; Figure 4 is a circuit diagram for a second embodiment of a power semiconductor device circuit in accordance with the invention; Figure 5 is a circuit diagram for a third embodiment of a power semiconductor device circuit in accordance with the invention; and Figure 6 is a circuit diagram of a modified version of the third embodiment. It should of course be understood that the reference numerals are used throughout the drawings to refer to like parts. Thus, although the circuits of Figures 1 and 2 are not embodiments of the present invention, like device features and like circuit features are used in the embodiments of Figures 3 to 6. Referring now to the drawings, there are illustrated various examples of power semiconductor device circuits 1a, 1b, 1c, 1d each comprising an insulated gate field effect power semiconductor device 2 having first and second main electrodes 3 and 4 and a gate electrode 5 and a gate control circuit 6a, 6b, 6c, 6d providing a conductive path between the gate electrode 5 and a gate voltage supply terminal G, the gate control circuit 6 comprising a resistance R3 coupled between the gate electrode 5 and the gate voltage supply terminal G and a switching device Q1, D1, Q2 having first and second main electrodes coupled to the gate voltage supply terminal G and the gate electrode 5, respectively, so that the main current path between the first and second main electrodes is coupled in parallel with the resistance R3, the switching device Q1, D1, Q2 having a first non-conducting state and a second conducting state for providing in the second conducting state an additional resistance in parallel with the resistance R3, the switching device being arranged to switch from one of the first and second states to the other when the voltage at the gate voltage supply terminal G changes in order to turn the power semiconductor device 2 so as to alter the overall resistance of the conductive path between the gate electrode 5 and the gate voltage supply terminal G. Thus, in these circuits, the overall resistance R TOT of the conductive path between the gate voltage supply terminal G and the gate electrode 5 of the power semiconductor device 2 can be modified or altered by controlling the conduction of a transistor Q1, Q2 connected in parallel with the resistance R3 in response to the change in the voltage at the gate voltage supply terminal or detection of a fault condition. This should enable the switching speed of the power semiconductor device to benefit from any ac signal type low impedance gate drive circuit coupled to the gate voltage supply terminal during normal operation of the power semiconductor device but allow the overall resistance of the conductive path between the gate electrode and the gate voltage supply terminal to be adjusted under abnormal conditions of the power semiconductor device to reduce the problems any such low impedance drive might otherwise cause. Referring now to the example illustrated in Figure 1, the power semiconductor device circuit 1a has first and second power supply lines 7 and 8. In this example, the power semiconductor device 2 is an n-channel enhancement mode power MOSFET forming a low-side switch for a load L. The diode D shown in the power MOSFET 2 symbol represents the diode formed between the drain and body (channel-defining region) of a DMOS type vertical MOSFET. The load L may be an inductive load such as may occur in an automobile, for example an electric motor or a coil such as an ignition coil. The second power supply line 8 is thus at a positive voltage compared to the first power supply line 7 which will generally be at ground (earth) potential. The gate electrode 5 of the power MOSFET 2 is coupled to the gate terminal G by, in this example, a first resistor R1, the gate control circuit 6a and a second resistor R2. Any suitable form of gate drive circuit (not shown) may be provided for supplying a gate voltage to the gate terminal G. The power semiconductor device circuit 2 may include temperature sensors, clamping circuits and dV/dt limiting circuits of a suitable nature which may be integrated with the power semiconductor device 2. The gate control circuit 6a shown in Figure 1 comprises a third resistor R3 provided between and in series with the first and second resistors R1 and R2 and an n-channel enhancement mode insulated gate field transistor (IGFET) Q1 having its main current path (ie that between source and drain) coupled across the resistance R3 with the source electrode s of the IGFET Q1 coupled to the junction J1 between the second and third resistors R2 and R3 by a fourth resistor R4 and the drain electrode d of the IGFET Q1 coupled to the junction J2 between the first and third resistors R1 and R3. The gate electrode g of the IGFET Q1 is coupled to its drain electrode d. Figure 1 shows the back gate electrode bg of the IGFET Q1 as uncoupled. However in practice the back gate electrode bg will either be coupled to the source electrode s in conventional manner or to the first supply line 7. In operation of the power semiconductor device circuit 1a, the power semiconductor device 2, in normal operation, is switched on by the application of an appropriate positive voltage to the gate voltage supply terminal G by the gate drive circuitry (not shown). During this phase the IGFET Q1 remains non-conducting or off and the total resistance of the conductive path between the gate voltage supply terminal G and the gate electrode 5 is the sum of the resistance R1, R2 and R3. In order to turn off the power semiconductor device 2, the gate drive circuitry removes the gate voltage. At this stage, the voltage at the drain d (and thus the gate g) of the IGFET Q1 becomes higher than the voltage at its source and the IGFET Q1 becomes conducting thus connecting the resistor R4 and the small resistance of the IGFET Q1 in parallel with the third resistor R3 so reducing the overall resistance R TOT of the conductive path between the gate voltage supply terminal G and the gate electrode 5 of the power MOSFET 2. The gate control circuit 6a thus enables the desired relatively high resistance to be provided in the conductive path between the gate voltage supply terminal G and the gate electrode 5 of the power semiconductor device 2 during normal turn on of the power semiconductor device 2 and enables the resistance of the conductive path to be reduced automatically when the gate voltage is removed in order to switch off the power semiconductor device so reducing the time taken for the power device 2 to be switched off. Figure 2 illustrates a modified version 1a' of the circuit 1a shown in Figure 1 in which the transistor Q1 of the gate control circuit 6a' is replaced by a rectifying diode D1 which is preferably in the form of a thin-film, generally polycrystalline silicon, diode formed on an insulating layer provided over the semiconductor body within which the power semiconductor device 2 is formed. In operation of the circuit 1a' shown in Figure 2, when the gate drive circuitry removes the gate voltage, the diode D1 (which is reverse-biassed while the gate voltage is applied to cause the power semiconductor device 2 to conduct) becomes forward-biassed and thus conducts so that the forward resistance of the diode D1 is placed in parallel with the third resistor R3, so reducing the overall resistance R TOT of the conductive path between the gate voltage supply terminal G and the gate electrode 5 of the power MOSFET 2. The use of the diode D1 in place of the transistor Q1 is advantageous because generally the forward voltage of the diode D1 will be lower than the voltage drop across the transistor Q1 when it is conducting so enabling the overall resistance R TOT to be reduced even further allowing the gate of the power semiconductor device 2 to be pulled closer to the source voltage (ie the voltage on line 7) when the gate voltage supply terminal G is pulled to the source voltage in order to turn off the power semiconductor device 2. For example, in this case the gate 5 of the power semiconductor device 2 may, depending upon the precise electrical characteristics of the various components, be pulled down to approximately 0.7 volts as compared to 1.0 volts in the example of Figure 1. Consequently the turn-off delay time and fall time of the gate 5 voltage will be less than in the example of Figure 1. Figure 3 illustrates an embodiment of a power semiconductor device circuit 1b in accordance with the invention. In the example illustrated in Figure 3, a voltage clamping circuit 9 is coupled between the second main (the drain in the example shown) electrode 4 and the gate electrode 5 of the power semiconductor device 2 so that, in the event of an overvoltage due, for example, to the switching of an inductive load L, the voltage clamping circuit 9 acts to raise the gate voltage of the power MOSFET 2 to turn the power MOSFET 2 back on to enable the excessive energy in the inductive load L to be dissipated by the conduction of the power MOSFET 2. The voltage clamping circuit 9 may be of any suitable type. For example, the voltage clamping circuit 9 may consist simply of a chain of zener diodes which breakdown when the voltage at the second main electrode 4 exceeds the predetermined value or a circuit similar to that described in US-A-4928053, EP-A-372820 or EP-A-523800 could be used. The gate control circuit 6b comprises an n-channel enhancement mode IGFET Q2 having its main current path connected in series with a resistor R5 across the resistor R3 so that the resistor R5 is coupled to the junction J1 and the drain electrode of the transistor Q2 is coupled to the junction J2. The insulated gate electrode of the transistor Q2 is coupled via a resistor R6 to a junction J3 between the junction J1 and the resistor R2 and via the main current path of an n-channel enhancement mode IGFET Q3 to the supply line 7. The gate electrode of the transistor Q3 is coupled to a control input signal terminal C. A fault detection circuit 10 is coupled to the gate terminal G via the resistor R2 and to the first power supply line. The fault detection circuit 10 has a control output 10a for supplying a control output signal for switching off the power semiconductor device 2 when an abnormal condition is detected. The fault detection circuit 10 may be any circuit suitable for indicating an abnormal condition which requires that the power semiconductor device 2 be switched off. Thus, for example, the fault detection circuit 10 may be designed to detect when the temperature of the power semiconductor device 2 exceeds a predetermined desirable maximum temperature. In such a case any suitable overtemperature detection circuit may be used, for example that described in our copending European Patent Application Publication No. 523799. As another alternative or additional fault detection circuit, a circuit such as described in our copending European Patent Application Publication No. 479362 may be used to detect when the temperature difference across a semiconductor body incorporating the power semiconductor device exceeds a predetermined limit. The control output 10a of the fault detection circuit 10 is coupled to the control gate of an n-channel enhancement mode IGFET or transistor Q4 having its drain electrode coupled via resistor R1 to the gate electrode of the power semiconductor device 2 and directly to the junction J2 and its source electrode coupled to the first power supply line 7. In this example, the control output 10a of the fault detection circuit 10 is also coupled to the control electrode of the transistor Q3 at the point C. Figure 4 illustrates a modified version of a circuit 1c in accordance with the invention which differs from that shown in Figure 3 simply by the fact that the resistor R6 is coupled to a separate reference voltage V c rather than the junction J3. This allows the voltage Vc to be closer to the gate voltage than the voltage at junction J3 in Figure 3 so enabling a higher voltage to be applied to the gate of transistor Q2. In operation of the circuit 1b or 1c, the power semiconductor device 2 when normally off is switched on by the application of an appropriate gate voltage to the gate terminal G. During the normal turn-on process, the transistor Q3 is not conducting and so the gate of transistor Q2 is high and the transistor Q2 is conducting coupling the resistor R5 and the resistance of the series transistor Q2 in parallel with the resistor R3. The situation will be similar during turn off of the power semiconductor device 2 by removal of the gate voltage. Thus, under normal operating conditions, the total resistance from the gate terminal G to the gate electrode 5 is R1 + R2 + Rx where 1 Rx = 1 R3 + 1 R5 the resistance of the transistor Q2 when conducting being negligible. If the fault detection circuit 10 detects an abnormal condition, for example an overtemperature, of the power semiconductor device 2, a control output signal is provided on the output 10a to turn on the transistor Q4 so coupling the gate electrode 5 of the power semiconductor device 2 to the supply line 7 and so turning off the power semiconductor device 2. At the same time the control output signal is provided via the junction C to the control electrode of the transistor Q3 rendering the transistor Q3 conducting which lowers the gate voltage of the transistor Q2 which becomes non-conducting. The resistor R5 and transistor Q2 thus no longer provide a conductive path in parallel with the resistor R3 and accordingly the overall resistance of the conductive path from the gate terminal G to the gate electrode 5 is increased to R1 + R2 + R3. Thus, the resistance of the path from the junction J2 to the gate terminal G is increased so facilitating the pulling down by the transistor Q4 of the power semiconductor device 2 gate electrode and increasing the resistance of the conductive path to the gate drive circuit (not shown) coupled to the gate terminal G to make it more difficult for the gate drive circuit to try and maintain the power semiconductor device 2 in a conducting state. Thus, this circuit assists in inhibiting the gate drive circuit from acting in opposition to the fault detection circuit 10 which is aiming to switch the power semiconductor device 2 off. Consider now the situation where the power semiconductor device 2 is being used to switch, for example, an inductive load such as a motor or coil. When the power semiconductor device 2 is turned off by removal of the gate voltage the inductive load L causes a rapid rise in the voltage at the second main electrode 4 which, if the predetermined voltage is reached, causes the voltage clamping circuit 9 to conduct in order to raise the gate voltage of the power semiconductor device 2 to render it conducting so as to dissipate the energy in the inductive load L and thus avoid any destructive breakdown of the power semiconductor device 2. Although not shown in Figure 3 or 4, a control circuit may be provided to supply an auxiliary control signal to the junction C when the voltage clamping circuit 9 is rendered conducting to raise the voltage of the gate of the transistor Q3 so rendering the transistor Q3 conducting to lower the gate voltage of the transistor Q2 which becomes non-conducting. The resistor R5 and transistor Q2 in this case then no longer provide a conductive path in parallel with the resistor R3 and accordingly the overall resistance of the conductive path from the gate terminal G to the gate electrode 5 is increased to R1 + R2 + R3. In particular, the resistance of the path from the voltage clamping circuit 9 to the gate terminal G is increased so that the current through the voltage clamping circuit 9 cannot be dissipated by the gate drive circuit (not shown) but is used directly to raise the gate voltage of the power semiconductor device 2 so increasing the speed at which the voltage clamping circuit 9 turns on the power semiconductor device 2. Figure 5 illustrates a further example of a circuit 1d in accordance with the invention. In this example, the gate control circuit 6d includes both the transistor Q1 and series resistor R4 for increasing the speed of normal turn-off of the power semiconductor device 2 as described above with reference to Figure 1 and an arrangement similar to that shown in Figure 3. Figure 6 illustrates a modified version 1d' of the circuit 1d in accordance with the invention. In this example, the gate control circuit 6d' includes both the diode D1 for increasing the speed of normal turn-off of the power semiconductor device 2 as described above with reference to Figure 2 and an arrangement similar to that shown in Figure 3. The resistor R3 may, typically, have a value of 50kΩ (kilo-ohms) while the resistors R4, R5 and R6 may have typically values of 100 or 200 kΩ, 1 to 10 kΩ and 100 or 200 kΩ, respectively, and the resistors R1 and R2 values of 100Ω to 1 kΩ. One or more input protection zener diodes may be connected between the gate input terminal G and the supply line 7 as indicated by the zener diode ZD in Figure 4. The transistors Q1, Q2, Q3 are generally lateral IGFETs and together with the resistors R1, R2, R3, R4, R5, R6 may be integrated in the same semiconductor body as the power semiconductor device 2. The resistors may be diffused resistors provided within the semiconductor body or thin film (eg polycrystalline) resistors provided on and insulated from the surface of the semiconductor body as appropriate. It will have been noticed in the drawings that the back gates bg of the transistors Q1, Q2, Q3 are not shown shorted to their respective sources as is conventional. In fact this may be the case, or the back gates could be coupled to a suitable reference potential, for example by being connected to the supply line 7. The circuit could also include other monitoring and control elements for example sensors for detecting the temperature of the power semiconductor device. The power semiconductor device 2 need not necessarily be a power MOSFET but could for example be an insulated gate bipolar transistor IGBT. Also, although the power semiconductor device 2 is an n-channel device in the examples described above, the present invention could be applied to a p-channel device with appropriate changes in voltages etc. Similarly, although the Figures show a low-side switch the present invention could be applied to a high-side switch. From reading the present disclosure, other modifications and variations will be apparent to persons skilled in the art. Such modifications and variations may involve other features which are already known in the semiconductor art and which may be used instead of or in addition to features already described herein. It has been stated above that the drawings illustrate examples of embodiments of the invention and, in order to avoid any misunderstanding, it is hereby further stated that, in the following claims, where technical features mentioned in any claim are followed by reference signs relating to features in the drawings and placed between parentheses, these reference signs have been included in accordance with Rule 29(7) EPC for the sole purpose of facilitating comprehension of the claim, by reference to an example.

Claims: A power semiconductor device circuit comprising an insulated gate field effect power semiconductor device (2) having first and second main electrodes (3, 4) and a gate electrode (5), a gate control circuit (6b, 6c, 6d, 6d') which provides a conductive path between a gate voltage supply terminal (G) and the gate electrode (5) of the power semiconductor device (2), and a fault detection circuit (10) which detects an abnormal condition in operation of the power semiconductor device (2) and which has a control output (10a) providing an output signal to the gate control circuit (6b, 6c, 6d, 6d'), wherein the gate control circuit (6b, 6c, 6d, 6d') comprises a first resistance (R3) which is coupled between the gate voltage supply terminal (G) and the gate electrode (5) of the power semiconductor device (2) and a switching transistor (Q2) which has first and second main electrodes (s, d) coupled to the gate voltage supply terminal (G) and to the gate electrode (5) of the power semiconductor device (2), respectively, so coupling the main current path of the switching transistor (Q2) in parallel with the first resistance (R3), the switching transistor (Q2) having a control electrode for switching the switching transistor (Q2) between a non-conducting first state and a conducting second state for providing in the second state an additional resistance in parallel with the first resistance (R3) to facilitate turn on of the power semiconductor device (2), the switching of the switching transistor (Q2) from the conducting second state to the non-conducting first state serving to increase the overall resistance of the conductive path between the gate electrode (5) and the gate voltage supply terminal (G), the gate control circuit (6b, 6c, 6d, 6d') including circuit means (R2, R5, R6, Q3) coupling the control electrode (g) of the switching transistor (Q2) to the control output (10a) of the fault detection circuit (10) for applying a control signal to the control electrode (g) of the switching transistor (Q2) to cause the switching transistor (Q2) to switch from one of its first and second states to the other, and thereby to alter the overall resistance of the conductive path between the gate voltage supply terminal (G) and the gate electrode (5) of the power semiconductor device (2), in response to changes in the voltage at the gate voltage supply terminal (G) in order to turn the power semiconductor device (2) on or off and in response to changes in the output signal of the fault detection circuit (10) in order to turn off the switching transistor (Q2) when an abnormal condition for the power semiconductor device (2) exists, and wherein the control output (10a) of the fault detection circuit (10) is coupled also to a control electrode of another transistor (Q4) which is thereby rendered conducting upon the detection of an abnormal condition of the power semiconductor device (2), which other transistor (Q4) has first and second main electrodes coupled respectively to a voltage supply and to the gate electrode (5) of the power semiconductor device (2) to turn off the power semiconductor device (2) when this other transistor (Q4) is rendered conducting upon detection of the abnormal condition by the fault detection circuit (10). A power semiconductor device circuit according to Claim 1, wherein the circuit means for applying the control signal to the switching transistor (Q2) comprises a further resistance (R6) coupled in series with the main current path between first and second main electrodes (s, d) of a further transistor (Q3), the first main electrode (d) of the further transistor (Q3) being coupled to the further resistance (R6) and to the control electrode (g) of the switching transistor (Q2) so that the switching transistor (Q2) is normally conducting, the further transistor (Q3) having a control electrode (g) coupled to the control output (10a) of the fault detection circuit (10) for causing the further transistor (Q3) to be rendered conducting, and thereby switching the switching transistor (Q2) to its non-conducting first state, when the fault detection circuit (10) provides an output signal indicating the existence of an abnormal condition. A power semiconductor device circuit according to Claim 2 or Claim 3, wherein another resistance (R5) is coupled in series with the switching transistor (Q2). A power semiconductor device circuit according to any one of the preceding Claims, wherein a voltage clamping circuit (9) is coupled between one (4) of the first and second main electrodes and the gate electrode (5) of the power semiconductor device (2) for causing the power semiconductor device (2) to be switched from a non-conducting to a conducting state when the voltage at the one main electrode (4) exceeds a predetermined limit. A power semiconductor device circuit according to Claim 4, wherein a protective zener diode is coupled between the gate voltage supply terminal (G) and the other (3) of the first and second main electrodes of the power semiconductor device (2). A power semiconductor device circuit according to any one of the preceding Claims, wherein the gate control circuit (6d, 6d') also comprises a further switching device (Q1, D1) coupled between the gate voltage supply terminal (G) and the gate electrode (5) of the power semiconductor device (2) to facilitate turn off of the power semiconductor device (2) when the voltage at the gate voltage supply terminal (G) changes in order to turn off the power semiconductor device (2), the further switching device (Q1, D1) being in parallel with the switching transistor (Q2). A power semiconductor device circuit according to Claim 6, wherein the further switching device comprises an insulated gate field effect transistor (Q1) which has first and second main electrodes (s, d) coupled to the gate voltage supply terminal (G) and to the gate electrode (5) of the power semiconductor device (2) and which has its control electrode (g) coupled to the gate electrode (5) of the power semiconductor device (2) for causing, when the voltage at the gate voltage supply terminal (G) changes in order to turn off the power semiconductor device (2), this transistor (Q1) to be rendered conducting and thereby reducing the overall resistance between the gate voltage supply terminal (G) and the gate electrode (5) of the power semiconductor device (2). A power semiconductor device circuit according to Claim 6, wherein the further switching device comprises a rectifying diode (D1) which is arranged so as to conduct when the voltage at the gate voltage supply terminal (G) changes in order to turn off the power semiconductor device (2). A power semiconductor device circuit according to any one of the preceding Claims, wherein the both the switching transistor (Q2) and said other transistor (Q4) are n-channel enhancement-mode insulated gate field effect transistors which are integrated in the same semiconductor body as the power semiconductor device (2).

Inventors: KELLY BRENDAN PATRICK, MOODY PAUL TIMOTHY, KELLY, BRENDAN PATRICK, MOODY, PAUL TIMOTHY, KELLY, BRENDAN PATRICK, C/O PHILIPS SEMICONDUCTORS, MOODY, PAUL TIMOTHY, C/O PHILIPS SEMICONDUCTORS
Applicants: KONINKL PHILIPS ELECTRONICS NV, PHILIPS ELECTRONICS UK LTD, KONINKLIJKE PHILIPS ELECTRONICS N.V., PHILIPS ELECTRONICS UK LIMITED
Application year: 1994
Main classification: H03K17
IPC codes: H03K17, H01L29, H01L27