Soldering flux

Abstract: An aqueous soldering flux composition which is characterized in that it contains as component (A) (i) one or more hydrohalides or hydrophosphates of guanidine or a substituted guanidine, or (ii) one or more hydrohalides or hydrophosphates of a five-membered nitrogen containing heterocyclic amine of the formula C x N y H₃ in which x is 1 or 2 and y is 4 or 5, or mixtures of (i) and (ii) and as component (B) one or more hydrohalides or hydrophosphates of aliphatic amines selected from aliphatic monoamines of formula CH₃(CH₂) n NR₂ and aliphatic diamines of formula R₂N(CH₂) m NR₂ in which n is 0 to 10, m is 5 to 10 and R is hydrogen, methyl, ethyl, propyl or butyl, said components (A) and (B) being present in the relative proportions of 25 to 100% by weight of (A) and 75 to 0% of (B).

Description: This invention is concerned with soldering fluxes particularly with such fluxes which are useful for soldering the radiators of motor vehicles and heat exchanger assemblies. Various soldering procedures are used in the manufacture of car radiators and heat exchanger assemblies. One of these is the baking procedure which involves coating tubes with solder, clamping an assembly of the tubes and of other radiator components in a jig, spraying with flux or dipping the assembly in flux and baking the assembly in an oven. This procedure requires the assembly to remain in the oven at elevated temperature usually for several minutes. The oven temperature may be anything from 250 to 470°C but is more likely to be in the range 280 to 400°C. During this procedure the solder will melt and flow into the crevices in the joints of the assembly thereby providing the necessary bonding. Another soldering process used in these industries is end-dipping and this also involves exposure to high temperature. The flux used in these soldering processes must therefore have a sufficiently long high temperature life to ensure that it will provide sufficient protection to the surfaces to be joined until the radiator has attained a temperature sufficient to melt the solder and thereby permit bonding. Other desirable properties of fluxes are that they should produce low levels of char and residue and of course have a good fluxing efficiency. Examples of fluxes which have previously been developed for such uses are described in British Patents Nos. 1517116 and 1553069. The earlier of these discloses a soldering flux which comprises an aqueous solution containing a mixture of 25 to 75% by weight of a hydrobromide of an aliphatic hydroxyamine and 75 to 25% by weight of a hydrobromide of an aliphatic amine. The latter is a development of this which describes and claims a flux which comprises an aqueous solution containing a mixture of diethanolamine hydrobromide and ethylamine hydrobromide together with ammonium bromide. After soldering using these fluxes the used flux will contain an accumulation of metal ions including copper II and zinc II ions. The used flux is usually chemically treated with lime or sodium hydroxide until a pH of about 9 is reached which causes the metal ions to precipitate as insoluble hydroxides. The metal free waste is then discharged to drain. The treatment with alkali (e.g. lime) is carried out to remove metal ions for environmental reasons. The applicant has now found that when used flux from commercial fluxes such as those described above is made alkaline a significant proportion of metal ions may be retained in solution rather than precipitated out as insoluble hydroxide. This has been found to occur with fluxes containing aliphatic amines of the type R 2 N(CR 2 ) n NR 2 or R 2 N(CR 2 ) n OH in which n is 2 to 4 and R is hydrogen, methyl or ethyl. This presents an environmental problem because copper and zinc ions which were supposed to have been removed have not been and are therefore being discharged to drain. Another fluxing agent suitable for soldering electronic components is described in WO 86/00844. It is characterized by consisting of a solution which preferably comprises 2-12% by weight of non-ionic surface active agent, 1-10% by weight of water and at least 70% by weight of volatile solvent together with minor quantities of activators which are capable of reacting with impurities on the surfaces subjected to soldering, such as halides and carboxylic acids. The present invention provides for the use of a soldering flux in soldering a radiator or heat exchanger, the flux has good soldering properties and reduces or obviates the aforementioned environmental problem. Accordingly, the present invention provides for the use of an aqueous soldering flux composition in soldering a radiator or heat exchanger, the flux composition comprising as component (A); (i) one or more hydrohalides or hydrophosphates of guanidine or a substituted guanidine, or (ii) one or more hydrohalides or hydrophosphates of a five-membered nitrogen containing heterocyclic amine of the formula: C x N y H 3 or C 2 N 4 H 4 in which x is 1 or 2 and y is 4 or 5, or mixtures of (i) and (ii) and as component (B) one or more hydrohalides or hydrophosphates of aliphatic amines selected from aliphatic monoamines of formula CH 3 (CH 2 ) n NR 2 and aliphatic diamines of formula R 2 N(CH 2 ) m NR 2 in which n is 0 to 10, m is 5 to 10 and R is hydrogen, methyl, ethyl, propyl or butyl, said components (A) and (B) being present in the relative proportions of 25 to 100% by weight of (A) and 75 to 0% of (B). Preferably component (A)(i) will comprise a hydrobromide of guanidine, for example guanidine hydrobromide, cyanoguanidine hydrobromide or a mixture thereof, although other substituted guanidine hydrobromides may be used. Preferably component (A)(ii) will comprise 5-aminotetrazole hydrobromide or 3-amino-1,2,4-triazole hydrobromide. If component (B) is present it will preferably comprise a hydrobromide, for example ethylamine hydrobromide, 1,6-diaminohexane hydrobromide, 1,5-diaminopentane hydrobromide or a mixture thereof, although other aliphatic amine hydrohalides falling within the definition given above may be employed. The flux used in accordance with the present invention has good fluxing efficiency, a long high temperature life and produces low char and low residues. Furthermore, analysis shows that after use and subsequent treatment with lime the flux according to the present invention does not retain any significant quantities of copper II or zinc II ions, those ions are precipitated as the insoluble hydroxides. While the applicant does not wish to be bound by theory it is thought that this favourable result occurs because the metal ions cannot form stable chelate complexes with the organic compounds due to unfavourable ring size or the instability resulting from the donation of electron pair(s) to a metal ion. With the present invention in the case of guanidine or 5-aminotetrazole chelation does not occur because any chelate complex with a metal ion would have to have a ring size of less than 5 atoms and would therefore suffer from steric strain and be unstable. In the case of 3-amino-1,2,4-triazole chelation is not possible because of the unsuitable stereochemistry of the donor sites on the rigid five-member heterocyclic ring. Cyanoguanidine acts as a monodentate ligand due to the instability resulting from bidentate coordination. In the case of 1,6-diaminohexane a ring of more than 6 atoms would be formed which would be strained and therefore also not particularly stable. Ethylamine has only one electron donor site and so chelation cannot occur. In the case of the prior art on the other hand copper II and zinc II ions can form soluble chelate complexes with aliphatic amines such as diethanol amine and therefore do not precipitate out when the lime is added. An ammonium halide or phosphate may be included in the flux in an amount of up to 400% by weight, preferably up to 150% by weight, and more preferably, 20 to 75% by weight of the total weight of components (A) and (B). The flux may further include a hydrohalic acid or phosphoric acid or a mixture thereof in an amount of up to 800% by weight of the total weight of the components (A) and (B). The hydrohalides or hydrophosphates used in the flux can be made by adding a hydrohalic acid or phosphoric acid to guanidine carbonate, a substituted guanidine, a heterocyclic amine of the formula: C x N y H 3 or C 2 N 4 H 4 in which x is 1 or 2 and y is 4 or 5, or the relevant free amine. Often more hydrohalic acid or phosphoric acid will be added than is stoichiometrically necessary to react with the carbonate or substituted guanidine or the relevant free amine and so some free hydrohalic or phosphoric acid will be present. Soldering fluxes of the kind described herein are usually made up in concentrated form for sale to customers. They will then be diluted with water prior to use unless they are needed for a particularly difficult fluxing job in which case they might be applied in concentrated form. Typically a soldering flux in concentrated form for dilution with water prior to use will comprise from 2 to 40 grams of component (A) per 100ml of water. Normally, after dilution to a strength ready for use, the flux will typically contain 0.1 to 1.5 grams of component (A) per 100ml of water. The compositions of the present invention may also contain one or more wetting agents and/or corrosion inhibitors. Examples of suitable corrosion inhibitors are benzotriazole and imidazole. A method of making a soldering flux as described above comprises the steps of adding guanidine carbonate, a substituted guanidine, or a hetrocyclic amine of the formula: C x N y H 3 or C 2 N 4 H 4 where x is 1 or 2 and y is 4 or 5, and/or an aliphatic amine selected from aliphatic monoamines of formula CH 3 (CH 2 ) n NR 2 and aliphatic diamines of formula R 2 N(CH 2 ) m NR 2 in which n is 0 to 10, m is 5 to 10 and R is hydrogen, methyl, ethyl, propyl or butyl, to an aqueous hydrohalic acid or phosphoric acid, then adding aqueous ammonia to the mixture and thereafter adding water to produce the desired concentration. The flux compositions of the present invention find particular application in the soldering of radiators or heat exchangers using techniques which are well known in the art. Radiators or heat exchangers which may be soldered using the fluxes of the present invention are typically made from copper/brass, for example radiator tubes being made of brass and the radiator fins being made of copper, preferably copper containing small amounts of arsenic to prevent annealing on heating. These radiator components may be soldered using a range of tin/lead alloys, an Sn30:Pb70 alloy being particularly preferred. In another aspect the present invention provides a novel aqueous soldering flux composition which comprises as component (A) one or more hydrohalides or hydrophosphates of a five-membered nitrogen containing heterocyclic amine of the formula C x N y H 3 or C 2 N 4 H 4 in which x is 1 or 2 and y is 4 or 5, and as component (B) one or more hydrohalides or hydrophosphates of aliphatic amines selected from aliphatic monoamines of formula CH 3 (CH 2 ) n NR 2 and aliphatic diamines of formula R 2 N(CH 3 ) m NR 2 in which n is 0 to 10, m is 5 to 10 and R is hydrogen, n, ethyl, propyl or butyl, said components (A) and (B) being present in the relative proportions of 25% to 100% by weight of (A) and 75% to 0% of (B). Preferably the flux further includes an ammonium halide or phosphate in an amount of up to 400% by weight of the total weight of components (A) and (B). More preferably component A comprises 5-aminotetrazole hydrobromide or 3-amino-1,2,4,-triazole hydrobromide. The following are Examples of fluxes according to the invention:- Example 1 Guanidine hydrobromide 5.7 g Ammonium bromide 8.0 g Wetting agent 0.4 g Water, to provide total volume of 100 ml Example 2 Guanidine hydrobromide 5.7 g Ethylamine hydrobromide 5.1 g Ammonium bromide 8.0 g Wetting agent 0.4 g Water, to provide total volume of 100 ml Example 3 Cyanoguanidine hydrobromide 3.4 g Ammonium bromide 8.0 g Wetting agent 0.4 g Water, to provide total volume of 100 ml Example 4 Cyanoguanidine hydrobromide 3.4 g Ethylamine hydrobromide 5.1 g Ammonium bromide 8.0 g Wetting agent 0.4 g Water, to provide total volume of 100 ml Example 5 Guanidine hydrochloride 5.0 g Ethylamine hydrochloride 7.0 g Ammonium chloride 2.2 g Wetting agent 0.5 g Water, to provide total volume of 100 ml Example 6 Guanidine hydrochloride 6.0 g Ammonium chloride 4.0 g Wetting agent 0.5 g Water, to provide total volume of 100 ml Example 7 5-Aminotetrazole hydrobromide 7.5 g Ethylamine hydrobromide 10.0 g Ammonium bromide 5.0 g Wetting agent 0.5 g Water, to provide total volume of 100 ml Example 8 5-Aminotetrazole hydrobromide 7.0 g Ammonium bromide 6.0 g Wetting agent 0.8 g Water, to provide total volume of 100 ml Example 9 3-Amino-1,2,4-triazole hydrobromide 8.0 g Ethylamine hydrobromide 10.0 g Ammonium bromide 5.0 g Wetting agent 0.8 g Water, to provide total volume of 100 ml Example 10 3-Amino-1,2,4-triazole hydrobromide 6.0 g Ammonium bromide 8.0 g Wetting agent 0.8 g Water, to provide total volume of 100 ml Example 11 5-Aminotetrazole hydrochloride 6.0 g Ethylamine hydrochloride 7.0 g Ammonium chloride 2.0 g Wetting agent 0.7 g Water, to provide total volume of 100 ml Example 12 3-Amino-1,2,4-triazole hydrochloride 5.0 g Ammonium chloride 4.0 g Wetting agent 0.5 g Water, to provide total volume of 100 ml Example 13 Guanidine hydrobromide 5.7 g Ethylamine hydrobromide 4.5 g Imidazole hydrobromide 3.0 g Wetting agent 1.0 g Water, to provide total volume of 100 ml Example 14 Guanidine trihydrophosphate 4.5 g Ethylamine trihydrophosphate 3.6 g Ammonium dihydrogenphosphate 1.0 g Wetting agent 1.0 g Water, to provide total volume of 100 ml Example 15 Guanidine trihydrophosphate 3.5 g Ethylamine hydrobromide 7.0 g Ammonium bromide 3.0 g Wetting agent 1.0 g Water, to provide total volume of 100 ml Each of the above compositions also contains the relevant free hydrohalic acid, or phosphoric acid, in an amount such as to provide the final composition with a pH of below 2.0. The above are flux concentrates, which may be used as such in difficult soldering conditions, but will normally be diluted by the user with up to 20 times their volume of water according to the conditions of use. All of these fluxes have good fluxing efficiency, a long high temperature life, produce low levels of char and low flux residues and do not retain significant amounts of copper or zinc under alkaline conditions of pH about 9. Such fluxes will normally be made up by adding guanidine carbonate, cyanoguanidine, or a heterocyclic amine of the formula: C x N y H 3 or C 2 N 4 H 4 in which x is 1 or 2 and y is 4 or 5, and ethylamine as appropriate, to an aqueous hydrohalic acid or phosphoric acid. Aqueous ammonia and a wetting agent and corrosion inhibitor will then be added, followed by water to produce the desired concentration. A specific example is given below by way of illustration. Example 16 Compound Concentration g/l HBr (48% solution in water) 512.0 NH 3 (aq) (0.88 sp. grav.) 32.0 Guanidine carbonate 36.0 Non-ionic surfactant 5.0 water to provide total volume of 1 litre Procedure Guanidine carbonate is added slowly to hydrobromic acid followed by NH 3 (aq) and the non-ionic surfactant. Total volume is then adjusted to 1 litre by adding water. Example 17 Hydrobromic acid (48%, 584.1 g) was weighed into a container and diluted with water (100 ml). Guanidine carbonate (67.6 g) was added portionwise and the mixture stirred until effervescence ceased. Ethylamine (70% solution, 71.8 g) was added with stirring, followed by ammonia (30% solution, 23.23 g) and the addition of non-ionic surfactants (7g). The volume was then made upto 1 litre with water. Example 18 Hydrobromic acid (48% solution, 394 g) was weighed into a container and diluted with water (100 ml). Guanidine carbonate (11 g) was added portionwise and stirred until effervescence ceased. Ammonia (30% solution, 34.80 g) was then added, followed by the addition of non-ionic surfactants (7g). The volume was then made upto 1 litre with water. Example 19 A copper-brass radiator core pretinned with a tin/lead alloy (Sn30:Pb70) was assembled ready for soldering. The various parts to be joined were coated with the flux of Example 17 in the form of a diluted composition comprising 1 part flux to 9 parts of water by immersion or spraying. The fluxed radiator core was then loaded into a baking oven. The temperature reached 370°C within 2½ to 3 minutes. On exit from the oven the tube to fin joints of the radiator had been successfully made. Example 20 A radiator end plate was soldered to the tubes of a radiator by the following method. The end plate and the tube ends were each coated with the flux of Example 18 in the form of a diluted composition comprising 1 part to 2 parts of water by immersion or spraying. The fluxed assembly was then placed onto a molten solder (Sn30:Pb70) weir such that the solder contacted the tube ends and plate plungings so that a capillary joint was made. The solder temperature was 470°C.

Claims: Use of an aqueous soldering flux composition in soldering a radiator or heat exchanger, the flux composition comprising as component (A); (i) one or more hydrohalides or hydrophosphates of guanidine or a substituted guanidine, or (ii) one or more hydrohalides or hydrophosphates of a five-membered nitrogen containing heterocylic amine of the formula C x N y H 3 or C 2 N 4 H 4 in which x is 1 or 2 and y is 4 or 5, or mixtures of (i) and (ii) and as component (B); one or more hydrohalides or hydrophosphates of aliphatic amines selected from aliphatic monoamines of formula CH 3 (CH 2 ) n NR 2 and aliphatic diamines of formula R 2 N(CH 2 ) m NR 2 in which n is 0 to 10, m is 5 to 10 and R is hydrogen, methyl, ethyl, propyl, or butyl, said components (A) and (B) being present in the relevant proportions of 25 to 100% by weight of (A) and 75 to 0% of (B). Use as claimed in claim 1 wherein the flux further includes an ammonium halide or phosphate in an amount of up to 400% by weight of the total weight of components (A) and (B). Use as claimed in claim 2 wherein the flux further includes the ammonium halide or phosphate in an amount of up to 150% by weight of the total weight of components (A) and (B). Use as claimed in any one of claims 1 to 3 in which component (A) (i) of the flux comprises guanidine hydrobromide, cyanoguanidine hydrobromide or a mixture thereof. Use as claimed in any one of claims 1 to 3 in which component (A) (ii) of the flux comprises 5-aminotetrazole hydrobromide or 3-amino-1,2,4-triazole hydrobromide. Use as claimed in any one of claims 1 to 5 in which component (B) of the flux comprises ethylamine hydrobromide, 1-6-diaminohexane hydrobromide, 1,5-diaminopentane hydrobromide or a mixture thereof. Use as claimed in any one of claims 1 to 6 wherein the flux further includes a hydrohalic acid or phosphoric acid or a mixture thereof in an amount of up to 800% by weight of the total weight of components (A) and (B). Use as claimed in any one of the preceding claims wherein the flux is in a concentrated form comprising from 2 to 40g of component (A) per 100ml of water. Use as claimed in any one of claims 1 to 7 wherein the flux is in a strength ready for use which contains 0.1 to 1.5g of component (A) per 100 ml of water. Use as claimed in any one of the preceding claims wherein the flux additionally includes therein one or more corrosion inhibitors and/or wetting agents. An aqueous soldering flux composition which comprises as component (A) one or more hydrohalides or hydrophosphates of a five-membered nitrogen containing heterocyclic amine of the formula C x N y H 3 or C 2 N 4 H 4 in which x is 1 or 2 and y is 4 or 5, and as component (B) one or more hydrohalides or hydrophosphates of aliphatic amines selected from aliphatic monoamines of formula CH 3 (CH 2 ) n NR 2 and aliphatic diamines of formula R 2 N(CH 3 ) m NR 2 in which n is 0 to 10, m is 5 to 10 and R is hydrogen, methyl, ethyl, propyl or butyl, said components (A) and (B) being present in the relative proportions of 25% to 100% by weight of (A) and 75% to 0% of (B). An aqueous soldering flux composition as claimed in claim 11 wherein the flux further includes an ammonium halide or phosphate in an amount of up to 400% by weight of the total weight of components (A) and (B). A soldering flux as claimed in claim 11 or claim 12 in which the component A comprises 5-aminotetrazole hydrobromide or 3-amino-1,2,4,-triazole hydrobromide.

Inventors: BALUCH DOSTEN, INGHAM ANTHONY ELLIS, BALUCH, DOSTEN, INGHAM, ANTHONY ELLIS
Applicants: COOKSON GROUP PLC
Application year: 1994
Main classification: B23K35
IPC codes: B23K35, B23K1