Semiconductor apparatus having wiring structure of an integrated circuit in which a plurality of logic circuits of the same structure are arranged in the same direction

Abstract: In a semiconductor apparatus, a first circuit (3) provided on a major surface of a semiconductor substrate. The first circuit includes a plurality of logic circuits (51...5n) of an identical structure, the logic circuits having input terminals supplied with identical signals. First metal wiring (30) is provided on the semiconductor substrate in a direction identical to a direction of arrangement of the logic circuits, the first metal wiring being connected to one of the input terminals of each of the logic circuits. A second circuit (6) provided on the major surface of the semiconductor substrate in an outside area which does not overlap an area extending in a direction perpendicular to the direction of arrangement of the logic circuits, the second circuit supplying an identical signal to the input terminals of the logic circuits of the first circuit. A second metal wiring (40) is connected between an output terminal of the second circuit and a substantially middle point of the first metal wiring. The second metal wiring has a portion situated in parallel to the logic circuits. Thereby, an influence of wiring delay due to a difference in distances among the logic circuits can be reduced and a high-speed operation is achieved.

Description: The present invention relates to a semiconductor apparatus capable of reducing to a minimum a wiring delay of an input signal in an integrated circuit in which a plurality of logic circuits are arranged in the same direction, thereby achieving high-speed operations. In semiconductor apparatus such as IC and LSI, a plurality of logic circuits of the same structure are, in most cases, arranged on a substrate in the same direction. A general semiconductor memory apparatus such as an SRAM comprises two parts: a part wherein a plurality of logic circuits of the same structure, e.g. memory cell arrays, row decoders/column decoders, section decoders and section amplifiers, are arranged in the same direction on the most area of a semiconductor substrate (i.e. chip), and a part surrounding the chip, wherein address buffers, control signal buffers and data input/output (I/O) buffers are arranged. Normally, signals are transmitted among the logic circuits via a single metal wiring layer or multiple metal wiring layers formed on the chip. The metal wiring layers are arranged so that the wiring area may reduce to a minimum in consideration of the influence on the chip size. In addition, the metal wiring layers are arranged to have a minimum length in consideration of the influence of parasitic capacitance C and/or parasitic resistance R upon signals. FIG. 1 shows an example of a circuit constituting a semiconductor memory. Specifically, FIG. 1 shows arrangement of metal wiring for connecting an address buffer 6, a row decoder 3 and a decoder control circuit 9. The number of address buffers 6 is equal to the number (N) of addresses, and each address buffer 6 outputs a signal A/ A ( A is a complimentary signal of signal A). The decoder control circuit 9 outputs a control signal EN for the decoder. In the row decoder 3, a 2 N -number of logic circuits (51, 52,...,5m) having (N+1) inputs are arranged in the same direction, and input terminals of each logic circuit are supplied with an address signal A/ A and a control signal EN. In these metal wirings, parasitic capacitance C and parasitic resistance R are present as distributed constants, and a delay of input signals occurs. Such a delay of input signals further increases since an input capacitance at each input terminal functions as a load. The degree of propagation delay of the output A/ A increases as it reaches, or input to, a point farther from the address buffer 6, i.e., in the order from a point a at an output terminal of a driver provided within the buffer 6, a point b at an input terminal of the logic circuit 51 closest to the address buffer 6, and a point c at an input terminal of the logic circuit 5m remotest from the address buffer 6. FIGS. 2 and 3 are characteristic graphs illustrating delay states of the input signals at the points a , b and c . The number of arranged logic circuits constituting the row decoder 3 increases in accordance with an increase in memory capacity, and the propagation delay from the point b to point c increases accordingly. In a signal line for transmitting a control signal EN from the decoder control circuit 9, similar propagation delay occurs with respect to the control signal EN input to a point d at an output terminal of a driver provided in the decoder control circuit 9, a point e at an input terminal of the logic circuit 5m closest to the decoder control circuit 9 and a point f at an input terminal of the logic circuit 51 farthest from the decoder control circuit 9. The propagation delay has considerable influence upon the circuit operation. Such influence of propagation delay upon the circuit operation will now be described with reference to FIG. 4. Suppose that the decoder control signal EN is changed from a high (H) level to a low (L) level at point d by the driver of the decoder control circuit 9. At this time, owing to the aforementioned wiring delay, the control signal EN is changed from H level to L level with a delay at point f. There are two cases where the output A/ A of the address buffer 6 changes from L level to H level and it changes from H level to L level. When the output A/ A has changed from L to H, it is possible that the level of the output A/ A may temporarily change from L to H to L at the logic circuit 5 of the row decoder 3 and the decoder 3 may be activated. In order to avoid this, the output A/ A of the address buffer 6 is changed after the control signal EN has been completely changed from H to L at point f . In the case where the output A/ A of the address buffer 6 has changed from H to L, too, the output level changes from H to L with a delay at point c at the input terminal of the logic circuit 5m owing to the wiring delay. The decoder control signal EN is changed from L to H after the output A/ A has been completely changed from H to L at point c . This is intended to prevent the decoder 3 from being temporarily activated when the output level is changed from L to H to L at the logic circuit 5m of the row decoder 3. As has been described above, the row decoder 3 is activated when the decoder control signal EN is changed from L level to H level. At this time, of course, the change of level of the decoder control signal from L to H is delayed by the wiring delay at point f , and the logic circuit 51 of the row decoder 3, which has the input terminal at point f , is activated lastly. As has been described above, the time needed until the row decoder 3 is activated is determined by the wiring delay. The greater the wiring delay, the longer the time needed for the activation of the row decoder 3. In particular, as is shown in FIG. 1, if the address buffer 6 for generating the input signal is arranged in an outside area which does not overlap an area extending in a direction perpendicular to the direction of arrangement of the logic circuits of the row decoder 3, the difference in distance between the input terminal of the logic circuit situated close to the address buffer 6 and the input terminal of the logic circuit situated away form the address buffer 6 results in a difference in wiring delay. The greater the wiring distance, the more the high-speed operation of the semiconductor apparatus becomes difficult. From the documents Patent Abstracts of Japan 11 (165), (E-510) and JP-61296761 a semiconductor memory device is known which comprises a first circuit including a plurality of logic circuits having a common input line WL, first metal wiring connecting the common inputs of the logical cells and a second circuit provided outside the first circuit and not overlapping; furthermore a metal wiring connecting the second circuit and the first metal wiring. Additionally, it is disclosed that the length of the second conductive layer which is connected to the other conductive layer may be made shorter than that of the first conductive layer which is connected to one side of the second conductive layer, in order to shorten the time delay of the signal propagation. Documents Patent Abstracts of Japan 17 (35), (E-1310) and JP-4255246 relate to a semiconductor integrated circuit and a design method thereof. The integrated circuit is equally divided into four blocks comprising a plurality of basic units. Power is supplied to each of the basic units via a symmetric wiring network. Each of the wiring extends hereby in two directions from a centre connecting point such that the wirings extend symmetrically from the middle point. The next wiring extends then perpendicular to the first branching wiring, again in such way that the wires extending to both directions of the middle point are of equal length. This perpendicular arrangement of each branching wiring is repeated until power is supplied to each of the basic units. Document US-A-4,630,241 discloses a redundancy memory device and a method of programming for a programmable circuit in a redundancy circuit system including a RAM having normal and square memory cell rows constructed on a common chip. The redundancy circuit system further comprises a spare subsystem for a faulty normal subsystem according to a combination of blown-out fuses and non-blown-out fuses once as programmable elements, which can ensure reliable blowing fuses without increasing the size of the redundancy circuit system and reducing the integration density thereof. The present invention has been made in order to solve the above problem and the object of the present invention is to provide a semiconductor apparatus having an improved wiring structure of an integrated circuit in which a plurality of logic circuits of an identical structure are arranged in the same direction, whereby wiring delay of metal wiring of input signal lines is reduced to a minimum and a high-speed operation is achieved. This object is solved by the features according to claim 1. According to the above structure, the present invention can provide a semiconductor apparatus wherein an influence of wiring delay due to a difference in distances among the logic circuits provided on the major surface of the semiconductor substrate can be reduced and a high-speed operation is achieved. This invention can be more fully understood from the following detailed description when taken in conjunction with the accompanying drawings, in which: FIG. 1 shows an example of a circuit of a semiconductor apparatus constituting a conventional semiconductor memory; FIG. 2 is a characteristic graph showing the state of delay of an input signal at points a , b and c in FIG. 1; FIG. 3 is a characteristic graph showing the state of delay of an input signal at points a , b and c in FIG. 1; FIG. 4 is a view for explaining how the activation of a row decoder 3 as shown in FIG. 1 is subjected to temporal influence by a wiring delay; FIG. 5 shows a layout of circuit elements of a conventional circuit layout; FIG. 6 shows a structure of a main circuit portion of a semiconductor apparatus according to a first embodiment of the present invention; FIG. 7 shows a layout of circuit elements shown in FIG. 6 on a semiconductor substrate; FIG. 8 is a view for explaining a wiring delay at points a , b and c in the circuit of the conventional semiconductor apparatus as shown in FIG. 1; FIG. 9 is a view for explaining a wiring delay at points a , b and c in the circuit of the semiconductor apparatus of the present invention as shown in FIG. 6; FIG. 10 shows a structure of a main circuit portion of a semiconductor apparatus according to a second embodiment of the invention; FIG. 11 shows a further structure of a main circuit portion of a semiconductor apparatus not covered by the present invention; and FIG. 12 shows a further structure of a main circuit portion of a semiconductor apparatus not covered by the present invention. An embodiment of the present invention will now be described with reference to the accompanying drawings. FIG. 5 shows a layout of circuit elements of a semiconductor apparatus according to the present invention on a semiconductor substrate 1. In this layout, there are provided a portion wherein a plurality of circuits of the same structure, each including a memory cell array 2, a row decoder 3, a column decoder 4, a section decoder/sense amplifier 5, are repeatedly provided on a major area, and a portion provided around chips wherein address buffers 6, control signal buffers 7, data output buffers 8 are arranged. Normally, transmission signals between circuits is effected by single-layer or multi-layer metal wiring. FIG. 6 is a circuit diagram of a semiconductor memory, showing an arrangement of metal wiring for connecting the address buffer 6, row decoder 3 and decoder control circuit 9. The number of address buffers 6 is equal to the number (N) of addresses. Each address buffer 6 outputs a signal A/ A ( A is a complementary signal of A). The decoder control circuit 9 outputs a decoder control signal EN. In the row decoder 3, an 2 N -number of logic circuits (51, 52,..., 5n) are arranged in the same direction. The address buffer 6 and row decoder 3 are arranged on the semiconductor substrate 1, as shown in FIG. 7. The address buffer 6 is situated in an outside area D which does not overlap an area C extending in a direction B perpendicular to a direction A of arrangement of the row decoder 3. First wiring 30 is connected to input terminals of the logic circuits 51,..., 5n and is provided in parallel to the direction of arrangement of the logic circuits 51,..., 5n. The first wiring 30 includes a point c connected to the input terminal of the logic circuit 51 closest to the address buffer 6, a point d connected to the input terminal of the logic circuit 5n farthest from the address buffer 6, and a point b which is a substantially middle point of the first wiring 30. Second wiring 40 is connected between a point a at the output terminal of the address buffer 6 and the substantially middle point b of the first wiring 30. The second wiring 40 includes a portion W extending in parallel to the first wiring 30. The second wiring 40 is connected at one end to the substantially middle point b of the first wiring 30 since this manner of connection is advantageous in reducing the difference in distance between the output terminal of the address buffer 6 and each logic circuit. The number of logic circuits is normally an even number. The substantially middle point b of the first wiring 30 lies between the n/2-th logic circuit and (n/2)+1-th logic circuit. A signal line for connecting the decoder control circuit 9 and the logic circuits 51,..., 5n of the row decoder 3 includes a point e connected to the input terminal of the logic circuit 5n closest to the decoder control circuit 9 and a point f connected to the input terminal of the logic circuit 51 farthest from the decoder control circuit 9. As regards the first wiring 30, a distance l1 between points b and c is substantially equal to a distance 12 between points b and d . In the prior art as shown in FIG. 1, the difference between the distance from the output terminal of the address buffer 6 to the input terminal of the logic circuit 51 closest to the address buffer 6 and the distance from the output terminal of the address buffer 6 to the logic circuit 5n farthest from the address buffer 6 is about 11 + 12. By contrast, in the embodiment as shown in FIG. 6, the difference can substantially be halved to (l1 + l2)/2. The wiring between the circuit portion of the address buffer 6 and the output terminal point a or between the circuit portions of the logic circuits and, e.g. points b , c and d of the first wiring 30 is formed of a refractory metal such as tungsten or a metal such as aluminum. Alternatively, such wiring may be made of polysilicon or silicide. The wiring between the circuit portions of the logic circuits and, e.g. points b , c and d of the first wiring 30, the first wiring 30 and the second wiring 40 may be respectively formed of multiple Al wiring layers. In this wiring structure, the address signal A/ A is output from the output terminal point a of the address buffer 6. The address signal A/ A is input to the input terminals of the logic circuits 51,..., 5n via the connection node (point b ) between the first wiring 30 and second wiring 40. The propagation characteristics of the signal at this time will now be explained. FIG. 8 is a propagation characteristic diagram of the signal in the conventional wiring structure as shown in FIG. 1, and FIG. 9 is a propagation characteristic diagram of the wiring structure of the present embodiment as shown in FIG. 6. In each of FIGS. 8 and 9, the ordinate indicates a signal potential (V) at H or L level, and the abscissa indicates a propagation time. As compared to the conventional signal propagation waveform, in the propagation waveform according to this embodiment, the signal propagation is slower at the nearest input point b whereas it is faster at the farthest input point c or d . Thus, the difference in propagation time of the same signal between the nearest and farthest input points is decreased. In other words, the influence due to wiring delay decreases and the high-speed operation of the semiconductor apparatus can be achieved. In the semiconductor apparatus as shown in FIG. 6, a resistance component R and a capacitance component C are similarly present in the first wiring 30, which is the input wiring of the row decoder 3, and the second wiring 40, which is the output wiring of the address buffer 6. In addition, an input capacitance Cin connected to the input terminals of the logic circuits is additionally present in the first wiring 30. Accordingly, the propagation delay per unit length of the first wiring 30 is R*(C+Cin), which is obviously greater than the propagation delay R*C per unit length of the second wiring 40. In the prior art as shown in FIG. 8, the difference in wiring delay between points b and c is considerably great. By contrast, according to the present embodiment, the second wiring 40 with a low degree of wiring delay is extended and the first wiring 30 with a high degree of wiring delay is shortened, thereby decreasing the difference in wiring delay between points b and c and increasing a signal propagation speed in general. A second embodiment of the present invention will now be described with reference to FIG. 10. Like FIG. 6, FIG. 10 shows schematically a circuit configuration of a wiring structure of an address buffer 6 and a row decoder 3 of the semiconductor memory apparatus as shown in FIG. 5. In FIG. 10, wiring of signal lines between the decoder control circuit and row decoder is omitted. The row decoder 3 comprises logic circuits 51 to 5n. The row decoder 3 as shown in FIG. 10 is constituted by dividing the row decoder shown in FIG. 6 into a first row decoder 3-1 and a second row decoder 3-2. The first row decoder 3-1 comprises a first logic circuit to an n/2-th logic circuit, and the second row decoder 3-2 comprises an n/2+1-th logic circuit to an n-th logic circuit. The first wiring 30 is connected to the input terminals of the logic circuits 51 to 5n and is provided in parallel to the direction of arrangement of the logic circuits 51 to 5n. The second wiring 40 is provided between the output terminal point a of the address buffer 6 and a predetermined point b in the first wiring 30. Like the embodiment as shown in FIG. 6, the second wiring 40 has a portion extending in parallel to the first wiring 30. In the area of this parallel portion, the wirings 30 and 40 are provided substantially in parallel to each other. In order to decrease the difference in wiring distance, it is desirable to set the predetermined point b of the first wiring 30 connected to the second wiring 40 at a middle point of the first wiring 30. The middle point lies between the n/2-th logic circuit 5(n/2) and the (n/2)+1-th logic circuit 5(n/2)+1. Accordingly, if the input terminal of the first logic circuit 51 is set at point c and the input terminal of the n-th logic circuit 5n is set at point d , the distance l 1 between points b and c of the first wiring 30 is substantially equal to the distance l 2 between points b and d . Thereby, the difference in wiring distance, which is conventionally about l 1 + l 2 , can be substantially halved to (l 1 + l 2 )/2 in the present embodiment. A further structure of a main circuit portion will now be described with reference to FIG. 11. Like FIG. 6, FIG. 11 shows schematically a circuit configuration of a wiring structure of an address buffer 6 and a row decoder 3 of the semiconductor memory apparatus as shown in FIG. 5. In FIG. 11, wiring of signal lines between the decoder control circuit and row decoder is omitted. The row decoder 3 in which logic circuits 51 to 5n are repeatedly arranged and the address buffer 6 are arranged, as shown in FIG. 7, like the first embodiment. As in the first embodiment, signals are transmitted from the address buffer 6 to the row decoder 3 via the first wiring 30 and second wiring 40. The row decoder 3 comprises logic circuits 51 to 5n. The row decoder 3 employed in this embodiment is constituted by dividing the row decoder of the first embodiment into a first row decoder 3-1 and a second row decoder 3-2. The first row decoder 3-1 comprises a first logic circuit to an n/2-th logic circuit, and the second row decoder 3-2 comprises an (n/2)+1-th logic circuit to an n-th logic circuit. The first wiring comprises two wirings 31 and 32. The second wiring comprises two wirings 41 and 42. The wiring 31 is connected to the input terminals of the logic circuits 51 to 5(n/2) of the first row decoder 3-1 and is arranged in the direction of arrangement of the logic circuits. The wiring 32 is connected to the input terminals of the logic circuits 5((n/2)+1) to 5n of the second row decoder 3-2 and is provided in the direction of the arrangement of the logic circuits. Wiring 41 is connected between the output terminal point a of the address buffer 6 and a predetermined point b1 of the wiring 42. The wiring 42 is provided between the predetermined point b1 and predetermined points b2 and b3 of the wirings 31 and 32. It is desirable that the predetermined points b1, b2 and b3 be set at substantially middle points of the wiring 31, wiring 32 and second wiring 42, respectively. The wiring 42 has portions extending in parallel to the wirings 31 and 32. In the area of these portions, the wirings 31, 32 and 42 are substantially in parallel to one another. In this embodiment, the difference in distance of passage of the same signal is more reduced than in the first embodiment. In other words, the influence due to the wiring delay is decreased and the high-speed operation of the semiconductor apparatus can be achieved. However, in the wiring structure of this embodiment, since the length of the second wiring is increased and the wiring area is enlarged, an increase in integration density of the semiconductor apparatus cannot fully be achieved. Thus, it is preferable to adopt a multi-layer (two-layer, three-layer, etc.) wiring structure. FIG. 12 shows a further structure in which the second wiring 42 is connected to two first wirings 31 and 32. The wiring area can be made less than that in the embodiment of FIG. 11, although the difference in distance of passage of the same signal is greater. In the above embodiments, the row decoder 3 is employed as a first circuit. However, in the present invention, the first circuit is limited to the row decoder 3, but it may be a column decoder. In this case, a control signal buffer may be used as a second circuit for outputting an input signal input to the column decoder. The semiconductor apparatus is not limited to the semiconductor memory apparatus but it may be a logical integrated circuit.

Claims: A semiconductor device comprising: a semiconductor substrate (1); a first circuit (3) provided on a major surface of said semiconductor substrate (1), including a plurality of logic circuits (51 ... 5n) of identical structure and being arranged in a predetermined direction, said logic circuit having a plurality of input terminals; a second circuit (6) provided adjacent to the first circuit on the major surface of said semiconductor substrate (1) in the direction of the arrangement of said logic circuits (51 ... 5n) for supplying identical signals (A/ A ) to said input terminals of said logic circuits (51 ... 5n), said second circuit (6) not overlapping with the arrangement of said logic circuits (51 ... 5n) ; a single first metal wiring portion (30) provided on said semiconductor substrate (1), extending parallel to the arrangement of said logic circuit (51 ... 5n), all of said plurality of logic circuits (51 ... 5n) being connected to said single first metal wiring portion (30) via one of said input terminals of each of said logic circuits; a second metal wiring portion (40) provided on said semiconductor substrate (1), being connected between an output terminal of said second circuit (6) and a substantially middle point of said first metal wiring portion (30) and having a section situated parallel to the arrangement of said logic circuit (51 ... 5n). The semiconductor apparatus according to claim 1, characterized in that said second metal wiring portion (40) is connected at one end to a point between an (n/2)-th logic circuit and an (n/2)+1-th logic circuit of an n-number of said logic circuits.

Inventors: MASUDA MASAMI, MASUDA, MASAMI, MASUDA, MASAMI, C/O INT. PROP. DIV. K. K. TOSHIBA
Applicants: TOSHIBA KK, KABUSHIKI KAISHA TOSHIBA
Application year: 1994
Main classification: H01L23
IPC codes: G11C11, H01L23, H01L21