Defluxing agent and cleaning apparatus

Abstract: A defluxing agent for non-chlorine type defluxing after soldering may use, as a constituent component thereof, an organic solvent mixture containing 50-95 parts by weight of an aromatic solvent of 6-20 carbon atoms and 5-50 parts by weight of at least one solvent selected from ester solvents of 3-15 carbon atoms, ketone solvents of 2-15 carbon atoms and alcohol solvents of 1-15 carbon atoms, and containing no chlorine or fluorine. Alternatively, the defluxing agent may use, as a constituent component thereof, an organic solvent mixture containing 50-95 parts by weight of butyl acetate and/or amyl acetate and 5-50 parts by weight of at least one solvent selected from ester solvents of 3-15 carbon atoms, ketone solvents of 2-15 carbon atoms and alcohol solvents of 1-15 carbon atoms, said organic solvent mixture containing no chlorine or fluorine, or a mixture containing 50-90 parts by weight of xylene and 10-50 parts by weight of of xylene and 10-50 parts by weight of cyclohexanone and/or methyl β-methoxyisobutyrate.

Description: The present invention relates to a defluxing agent and the use thereof for non-chlorine-type defluxing after soldering. The production and use of chlorine-type organic solvents which deplete the ozone layer are recently being ever more regulated by the legislatures of participant nations to the Montreal Protocol. Since chlorine-type organic solvents have been used in the past as defluxing agents for cleaning flux after soldering, there has been a great acceleration in the development of defluxing agents which do not use chlorine-type organic solvents. During the production of electronic circuit parts by soldering, the post-solder flux has conventionally been cleaned for removal using 1,1,1-trichloroethane. 1,1,1-trichloroethane not only has a high ability to dissolve rosin, the main component of postsolder flux, but it also has a low toxicity and no inflammation point, giving it superior safety as a defluxing agent, and it has thus been indispensable for the cleaning of flux. Since 1,1,1-trichloroethane is to be completely banned in 1996, from that time on the cleaning of postsolder flux during the production of electronic circuit parts by soldering will become more difficult, and because the long-term reliability of the electronic circuit components will be reduced as a result of corrosive substances contained in the flux, the development of a substitute defluxing agent for 1,1,1-trichloroethane has become an urgent issue. With the prolonged heating during soldering the acid components of the rosin contained in the flux react with the solder to cause chemical reactions such as the production of salts (metal carboxylic acid salts), etc., thus becoming insoluble to the solvent, and therefore the substitute defluxing agent for 1,1,1-trichloroethane must not simply dissolve the rosin prior to heating but must also dissolve the altered flux components which have reacted due to heat. Nevertheless, because in the past most research has centered on chlorine-type solvents such as 1,1,1-trichloroethane, no non-chlorine-type solvents which dissolve heat-altered flux have been known. The present invention provides, with the purpose of overcoming the above mentioned problems, a defluxing agent which uses as a constituent component thereof a mixture containing 50-90 parts by weight of xylene and 10-50 parts by weight of cyclohexanone and/or methyl β-methoxyisobutyrate, and its use in cleaning a soldered member which has been soldered with flux. Flux consists of rosin (which consists mainly of abietic acid and derivatives thereof), an activator (normally an amine hydrochloride or the like) and an organic solvent, and after it is applied to the area to be soldered it is heated for soldering, and the residual flux must be cleaned away lest it become a cause of metal corrosion and impair the overall appearance. For simple dissolution of the rosin, there are known a variety of solvents including monohydric alcohols such as methyl alcohol, ethyl alcohol, n-propanol, isopropanol, n-butanol, etc.; esters such as ethyl acetate, isopropyl acetate, etc.; polyhydric alcohol derivatives such as ethylene glycol monomethylether, ethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, etc., and the like. However, the monohydric alcohols, esters and polyhydric alcohol derivatives mentioned here cannot dissolve heat-altered flux after soldering. In recent years, various defluxing agents comprising non-chlorine-type organic solvents have been developed and marketed, but like the above mentioned solvents, they have all had the disadvantage of leaving residues to one degree or another after the cleaning of heat-altered flux. Furthermore, in Japanese Unexamined Patent Application (KOKAI) NO. 63-56353 there is proposed a method of cleaning with a fluorinated hydrocarbon after passage through hydrochloric acid, nitric acid or the like, but since the degree of cleaning is insufficient, there is still the problem of the production of residues. This is thought to be due to the residual components which cannot be thoroughly removed since they do not mix with the acidic aqueous solution used for the initial immersion cleaning or the fluorinated hydrocarbon used for the subsequent immersion. The present inventors have, as a result of diligent research, surprisingly discovered that particular effectiveness is achieved with an organic solution (Not in accordance with the invention) containing 50-95 parts by weight of a C6-C20 aromatic solvent and 5-50 parts by weight of a C3-C15 ester, C2-C15 ketone and/or C1-C15 alcohol solvent, or 50-90 parts by weight of butyl acetate and/or amyl acetate either alone or as a total and 5-50 parts by weight of a C6-C20 aromatic solvent and 5-50 parts by weight of a C3-C15 ester, C2-C15 ketone and/or C1-C15 alcohol solvent, and that defluxing agents containing these organic solvents are capable of satisfactorily dissolving the heat-altered rosin components. The dissolution mechanism of the altered rosin components by this defluxing agent is not clear, but it is presumed to be the following. That is, it is thought that the main essential component, an aromatic solvent in which the rosin itself has a high solubility, or inexpensive butyl acetate or benzyl acetate which provides both high solubility and a high degree of safety for humans, combined with the further addition of a polar component, the C3-C15 ester, C2-C15 ketone and/or C1-C15 alcohol solvent for dissociation of metal carboxylic acid salt which is believed to be the cause of the lowered solubility of the heated rosin, results in the dissociation of the metal salt, and the dissociated rosin components are then dissolved by the above mentioned main solvent to display the superior cleaning properties. The reason for the above limits to the carbon numbers is that if they are below the given ranges there will be inconveniences of use such as lowering of the solubility and lowering of the flash point, thus increasing its danger, while on the other hand if the carbon numbers are above these ranges there will also be inconveniences of use such as lowering of the solubility and lowering of the volatility, thus increasing the time required for drying. The type of the main solvent and polar component used in the defluxing agent may be freely selected depending on the use but within the scope of this invention it is as defined in claim 1. As a result of investigation of the solubility of the heat-altered flux by the present inventors, it was discovered that the solubility parameter (SP) of the mixed solution should be 8.0-11.0, and preferably 8.5-10.0, while preferably the dispersion force solubility parameter (δ d ) is 7.3-8.7 the polarity solubility parameter (δ p ) is 0.5-4.2 and the hydrogen bonding solubility parameter (δ h ) is 1.0-9.5. [Regarding δ d , δ p and δ h , see p.114 of the "Bonding Handbook (2nd Edition)", published 1982 by the Nihon Bonding Association.] The aromatic solvent to be used as the main component may be benzene, toluene, xylene, ethylbenzene, cumene, mesitylene, naphthalene, tetralin, benzyl acetate, dibenzyl ether, dodecylbenzene, acetophenone, methyl benzoate, ethyl benzoate, or the like. Particularly preferable are xylene, because it is inexpensive, and tetralin, dibenzyl ether, dodecylbenzene and benzyl acetate, because they are inexpensive and have a high inflammation point. Also, the polar solvent to be added to the main component aromatic solvent or butyl acetate or amyl acetate, is not particularly restricted so long as it does not create a phase separation with the above mentioned components, and from the point of view of safety for the environment, etc. and drying speed after cleaning, it preferably contains no chlorine and has a boiling point of 50°C-250°C at one atmospheric pressure. As examples there may be mentioned alcohols such as methyl alcohol, ethyl alcohol, n-propanol, isopropanol, n-butanol, isobutanol, pentanol, hexanol, heptanol, etc.; phenols such as phenol, cresol, xylenol, etc.; ethers such as dipropyl ether, dibutyl ether, dihexyl ether, anisole, phenetole, dioxane, tetrahydrofuran, etc.; ketones such as acetone, methyl ethyl ketone, pentanone, hexanone, methyl isobutyl ketone, heptanone, diisobutyl ketone, cyclohexanone, acetophenone, etc.; esters such as ethyl formate, methyl acetate, ethyl acetate, propyl acetate, hexyl acetate, etc.; nitrogenous compounds such as acetonitrile, amines, etc.; sulfuric compounds such as dimethylsulfoxide; and compounds with two or more functional groups such as 2-methoxyethanol, 2-ethoxyethanol, diethylene glycol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, etc. In addition, as a result of recent progress in high density mounting onto circuit boards of electronic components, plastic parts and adhesives have come to be widely used in the process of assembly of the circuit boards. Here, the plastic parts or adhesives of the circuit boards sometimes have problems of swelling and dissolution as a result of the organic solvent. Also, attempts to suppress this effect on the parts often reduces the cleaning properties of the solvent. Particularly preferable as solvents which have no effect on such parts and retain strong cleaning properties are toluene, xylene, benzyl acetate, dibenzyl ether, dodecylbenzene, acetophenone, cyclohexanone, methyl β-methoxyisobutyrate, methyl α-hydroxyisobutyrate, isopropyl alcohol and their derivatives. The composition ratio of each of these solvents may be adjusted depending on the purpose. As mentioned above, since the above mentioned organic solvents dissolve heat-altered rosin even without an acid, the present invention provides the following defluxing agent which contains no acid. The most suitable system is one which uses a mixture containing 50-90 parts by weight of xylene, 10-50 parts by weight of cyclohexanone and/or methyl β-methoxyisobutyrate, and optionally 0.5-10 parts by weight of acetic acid. Obviously it more preferable to add an acid thereto. In addition, the defluxing agent according to the present invention preferably contains no water since there is a high possibility that it will have an adverse effect on the metal part, but depending on the use there is virtually no problem if it contains water in an amount of 2.0 wt% or less. A corrosion inhibitor may be added if necessary to minimize corrosion of the soldered or other metal. Metal phosphates, silicates, chromates, sulfonates, nitrites, vanadium-containing acids, and ammonium salts; organic phosphoric compounds such as alkyl phosphites, triaryl phosphates; C 1 -C 10 alkylamines; thiourea, sorbitan monooleic acid esters, and benzotriazole, etc. are preferably used. The amount thereof to be added is preferably 10 ppm - 10%. If too little is added the corrosion inhibiting effect will be small, while if too much is added the cleaning properties will be reduced. Furthermore, if a metal with a high susceptibility to corrosion is present in the part to be cleaned, then a dehydrating agent may be added to the acid-added defluxing agent in order to prevent corrosion. The dehydrating agent is not particularly restricted so long as it has a dehydrating effect, but preferred for use are phosphorous pentaoxide, magnesium perchlorate, a silica gel or molecular sieve, boron triacetate, anhydrous copper sulfate, chrome (III) acetate, acetic anhydride, and the like. A surfactant may be added to the defluxing agent if necessary. The presence of the surfactant improves the cleaning properties by lowering the surface tension of the agent and facilitating permeation of the agent into the minute sections. There are no particular restrictions on the type of the surfactant so long as it is surface active, but it is preferable to use a cationic surfactant or an anionic surfactant such as, for example, a carboxylic acid salt, sulfonate salt, sulfuric acid ester, phosphoric acid ester or the like, a nonionic surfactant such as polyethylene glycol, a polyhydric alcohol or the like, an amphoteric surfactant, fluorine-type surfactant, etc. The amount to be added is preferably 1 ppm - 1%, because if it lower it will lower the surface action and if higher it will impair the cleaning properties. The temperature of the defluxing agent may be room temperature, and if necessary the temperature may be raised to above room temperature for the cleaning. The method of cleaning using this defluxing agent is not particularly limited, but it is preferable to use the immersion method, shower method, spray method, paddle method, bubble method, ultrasonic method, etc. The viscosity of the defluxing agent used is preferably 10 cp or lower, and especially 3 cp or lower, in order to allow easy dispersion and increase the cleaning properties. Also, as mentioned previously, the surface tension is preferably 40 dyn/cm or lower, and especially 30 dyn/cm or lower, in order to facilitate permeation. By using as the main component an aromatic solvent in which the rosin itself has a high solubility, or butyl acetate or benzyl acetate which provides both high solubility and a high degree of safety for humans, and further adding thereto an ester-, ketone- and/or alcohol-type solvent as a polar solvent, for dissociation of the metal carboxylic acid salt, the metal is thus dissociated and the rosin components are subsequently dissolved by the above mentioned main solvent to allow satisfactorily dissolution of even the rosin components which have been partially altered by heat during the soldering, thus purifying the soldered portion. In this manner, complete cleaning of flux with a non-chlorine-type solvent becomes possible. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an IR analysis chart for flux residue heated together with solder. Fig. 2A and 2B are drawings of cleaning apparatuses in which the defluxing agent of the invention may be used. Fig. 3 is a graph showing the results of placing floating bodies on the cleaning bath. Fig. 4 is a front cross-sectional view of a cleaning apparatus. Fig. 5 is a side cross-sectional view of a cleaning apparatus. Fig. 6 is a drawing showing the pressure-regulating mechanism at the N 2 intake opening of a cleaning apparatus. Fig. 7 is a drawing showing the pressure-regulating mechanism at the discharge opening of a cleaning apparatus. EXAMPLES Reference Example Three types of solder (In-40Pb, Sn-37Pb, In-48Sn) and commercially available Flux MH-820V (product of Tamura Kaken Co.) heated at 215°C for 25 minutes were cleaned with IPA, but a portion of the flux residue remained as uncleanable. This flux residue was dissolved and extracted with tetrahydrofuran (THF) and analyzed. The results were as follows. (1) As may be seen in the IR analysis shown in Fig. 1, the IPA insoluble matter contained a large amount of metal carboxylic acid salts which were not contained in the IPA soluble matter. (2) The residual components contained metals, halogens, etc. (XPS analysis). (3) No increase in the molecular weight of the residual components was observed, and no polymerization reaction of the rosin occurred by the long-term heating (GPC analysis). Furthermore, when the surfaces of the three types of solder were subjected to elemental analysis after flux cleaning with THF, the following became clear. (4) When In-40Pb and Sn-37Pb solder are used, the portions with residual reflown flux have extremely lower amounts of In and Sn in comparison with the portions with no residual flux. Conversely, the distribution of Pb is greater in the portions with residual flux (because the number of Pb atoms per unit volume is relatively increased). Also, with In-48Sn solder no notable difference is found in the elemental distribution due to the presence or absence of residual flux (XMA analysis). The following considerations are made in light of the above. i) At the time of soldering, the In and Sn atoms in the solder react with the carboxyl groups (-COOH) in the rosin (flux) to produce carboxylic acid salts (rosin-COOIn, rosin-COOSn) which are insoluble in IPA. At such time the amounts of In and Sn on the surface of the solder are reduced. ii) If the heating tim (soldering) time is extended, the production of carboxylic acid salts also increases causing them to be leftover as post-cleaning residue. Example 1 Sn-37Pb, In-48Sn and In-40Pb solder was placed on a Au metallized portion on a substrate and commercially available Flux MH-820V (Tamura Kaken) was applied thereon, after which it was heated in perfluorocarbon vapor at 215°C for 30 minutes. After the heating, it was immersed in a defluxing agent of xylene/methyl β-methoxyisobutyrate/cyclohexanone = 70/15/15 at room temperature for 30 minutes. When observation was then made for the presence of flux residue production, no residue was found. This combination of xylene/methyl β-methoxyisobutyrate/cyclohexanone = 70/15/15 exhibited a highest cleaning power among solvents without addition of an acid thereto. Example 2 Sn-37Pb, In-48Sn and In-40Pb solder was placed on a Au metallized portion on a substrate and commercially available Flux MH-820V (Tamura Kaken) was applied thereon, after which it was heated in perfluorocarbon vapor at 215°C for 30 minutes. After the heating, it was immersed for 10 minutes at room temperature in a defluxing agent of xylene/cyclohexanone/methyl β-methoxyisobutyrate/acetic acid = 70/15/15/2.5 to which molecular sieve (4A) had been added to 10 wt%. When observation was then made for the presence of flux residue production, no residue was found. Also, no damage to the soldered metal was found upon this immersion in the defluxing agent. Fig. 2A shows an overall view of a cleaning apparatus which comprises a wash basin 7 filled with cleaning liquid, a rinse basin 8 for rinsing the defluxing agent, and a conveying mechanism 6 for conveying the object to be washed (a circuit wiring board 4), and the inside of the apparatus is an N 2 atmosphere. Fig. 2B is a drawing which shows the inside of the cleaning basin 7, where 1 is the defluxing agent, 2 is N 2 gas, 3 is a layer of floating bodies, 4 is a soldered circuit wiring board (object to be cleaned) and 5 is a conveying jig. As an illustration of the use of this cleaning apparatus, a mixed solution of xylene 70/cyclohexanone 15/methyl β-methoxyisobutyrate/acetic acid 2.5 (not in accordance with the invention) was placed in the cleaning basin of the defluxing apparatus, two types of polyethylene hollow balls ( 20 mm,  50 mm) were floated on the surface of the solution, and the circuit board was cleaned. When the circuit board was pulled out of the cleaning basin, the hollow balls were not taken out with it. After 10 hours, a different circuit board was cleaned, and when both boards were compared, no differences were found in them. In this illustration, it is thought that the substance with no affinity for the defluxing agent, which was floated on the surface of the defluxing agent 1 to isolate it from the outside air, minimized evaporation (vaporization) of the defluxing agent and thus prevented changes in the composition of the agent. In order to confirm this, a solution of xylene 70/cyclohexanone 15/methyl β-methoxyisobutyrate/acetic acid 2.5 was placed in a container with a round bottom of diameter 78 mm and a height of 86 mm, and a comparison was made between the weight reduction by evaporation of a solution on whose surface 10 mm spheres were floated and one on whose surface they were not. The results are shown in Fig. 3. Figs. 4-7 show cleaning apparatuses. Fig. 4 is a front cross-sectional view and Fig. 5 is a side cross-sectional view. A cleaning basin 11 containing a defluxing agent and a first rinse basin 12 and a second rinse basin 13 containing rinsing solutions are arranged inside an airtight surrounding case 14. For introduction of nitrogen gas into the surrounding case 14, N 2 gas is introduced from an N 2 source via a pressure-regulating valve 16 and an electromagnetic valve 17, into the compartment through the holes of a perforated copper pipe situated near the inner roof of the surrounding case 14, while it is discharged via a discharge valve 19 out through a discharge duct 20. Since the organic solvent of the defluxing agent and rinsing solution is generally heavier than air, if the opening for discharge of the N 2 gas is provided at a position lower than that of the opening for introduction of the N 2 gas, then efficient discharge of the solvent vapor will become possible, and thus the amount of the N 2 gas introduced may be reduced. In this surrounding case, an object to be cleaned work 21 is placed in a wash basket which is hung by a chain 23 and can be moved forward and backward, and up and down, by a motor 25 along a beam 24 equipped with a guide which runs across it near the roof. The beam 24 is supported by a supporting leg frame 26. The apertures for the supply and removal of the objects to be cleaned into and out of the surrounding case 14 must be opened and closed, and this causes a problem since air entering the surrounding case 14 raises the oxygen concentration, and running costs are thus increased as extra time and N 2 gas must be consumed to lower the oxygen concentration. Here, a front compartment 29 and a rear compartment 30 are provided outside of the loading aperture 27 and unloading aperture 28, and N 2 is also flow into these front and rear compartments 29, 30 which are used as buffers to overcome the above mentioned problem. Furthermore, in order to quickly lower the oxygen concentration to shorten the operating time of the cleaning apparatus it is necessary to supply/discharge nitrogen gas at a large volume, but the constant flow of a large volume of nitrogen is not economically feasible. Here, by detecting the oxygen concentration in the enclosed space and reducing (or stopping) the nitrogen flow when the oxygen concentration becomes sufficiently low, and then increasing the flow when the oxygen concentration increases once again, either the intake or outlet, or both, of the nitrogen gas may be controlled to reduce the amount of nitrogen gas used. The same control may be effected by detecting the concentration of the organic solvent gas instead of the oxygen concentration. Fig. 6 shows a situation in which an oxygen concentration sensor 35 is used to detect the oxygen concentration in the surrounding case 14, and electromagnetic valves 37, 38 are operated by a microcontroller 36 in response to the detected oxygen concentration to adjust the flow of the N 2 gas introduced into the surrounding case 14. For example, when the flow of N 2 gas of 2 kgf/cm 2 passing through electromagnetic valve 37 is adjusted to 10 1/min and that passing through electromagnetic valve 38 to 100 1/min, the O 2 concentration inside the surrounding case 14 will be 3 vol% and 5 vol%, respectively. Fig. 7 shows the inside of the pressure-regulating valve at the discharge end. The gas inside the surrounding case 14 passes through a discharge duct 41 to reach a discharge valve 42, and finally to reach a discharge disposal section 43. The discharge valve 42 is rotatable around a pivot 44, and the valve opens and closes by the balance between its own weight and the force of the gas pushing on the valve from out of the surrounding case 14. When such a discharge valve was designed and operated so that the pressure inside the surrounding case 14 was 5 hPa greater than the outside air, the pressure differential between the inside and outside of the surrounding case actually became 2-3 hPa as a result of back pressure of the discharge and leaks in the compartment as a whole. In Fig. 7, F 1 indicates the closing force due to the weight of the discharge valve, and F 2 indicates the raising force of the gas pushing on the valve. As explained above, with a defluxing agent according to the present invention, satisfactory defluxing is possible without leaving corrosive substances in the soldered portion, thus improving the reliability of electronic circuit components. Also, there is none of the global environmental destruction which occurs with the conventional chlorine-type defluxing agents. Furthermore, since the placing of floating bodies on the cleaning bath makes it possible to prevent changes in the composition of the defluxing agent which is a mixture of a plurality of organic solvents, stable defluxing of a circuit wiring board may be accomplished. It is thus possible to ensure the long-term reliability of electronic devices.

Claims: A defluxing agent which uses as a constituent component thereof a mixture containing 50-90 parts by weight of xylene and 10-50 parts by weight of cyclohexanone and/or methyl β-methoxyisobutyrate. Use of a defluxing agent according to claim 1 in cleaning a soldered member which has been soldered with flux.

Inventors: IGUSA NOBUO, OCHIAI MASAYUKI, TAKACHI ISAMU, WATANABE KEIJI, YAMAGISHI YASUO, YANO EI, IGUSA, NOBUO, OCHIAI, MASAYUKI, TAKACHI, ISAMU, WATANABE, KEIJI, YAMAGISHI, YASUO, YANO, EI
Applicants: FUJITSU LTD, FUJITSU LIMITED
Application year: 1994
Main classification: C23G5
IPC codes: B23K1, C11D11, C23G5, C11D7, H05K3