Dielectric resonator and manufacturing method thereof

Abstract: In a dielectric resonator, through holes (2a-2d) are formed between opposing two surfaces (S1, S2) of a dielectric block (1), an outer conductor (6) is provided on an outer peripheral surface of the dielectric block, and a plurality of inner conductors (3a-3d, 4a-4d) are formed on the inner surfaces of the through holes, isolated by non-conducting portions (5a-5d) where the inner conductor is not provided. Near the open end of the inner conductor of the resonator hole, a non-conducting portion (8b, 9a) is formed by partially removing the inner conductor in the axial direction, at a position opposing to an adjacent through hole, or a position near the outer conductor, so as to increase odd mode or even mode characteristic impedance near the open end, and inductive coupling is enhanced.

Description: The invention relates to a dielectric resonator and manufacturing method thereof. Conventionally, a dielectric resonator in which a plurality of resonators are formed in a rectangular parellopiped dielectric block and which is used as a bandpass filter, for example, consisting of plural stages of resonators has been used. The applicant of the present invention has proposed such a dielectric resonator in Japanese Patent Laying-Open No. 5-199013. Figs. 25 and 26 show an example of such a dielectric resonator, in which Fig. 25 is a perspective view of the dielectric resonator and Fig. 26 is a vertical section taken along the line Y-Y of Fig. 25. Referring to Figs. 25 and 26, a dielectric block 1 includes a first surface S1 and a second surface S2 opposing to each other. Four through holes 2a, 2b, 2c and 2d piercing through the first and second surfaces S1 and S2 are formed in dielectric block 1. In respective through holes, inner conductors 3a, 4a, 3b, 4b, 3c, 4c, 3d and 4d are formed separated from each other by non-conducting portions 5a, 5b, 5c and 5d, respectively. At the non-conducting portions 5a to 5d, the surface of the dielectric block material is exposed in the shape of a ring. The example shown in Fig. 26 is a bandpass filter including four stages, in which stray capacitance is generated at non-conducting portions 5a to 5d where the inner conductor is not provided, the inner conductors 3a to 3d function as resonance conductors having the second surface S2 as the short-circuited surface and the first surface S1 as the stray surface, and adjacent resonance conductors are coupled to a common line. However, in the dielectric resonator described above, the axial length L of the inner conductors 3a to 3d serving as the resonance conductors is determined dependent on the position of the non-conducting portion, and the stray capacitance at the edge of the resonance conductor is determined by the width B of the non-conducting portions 5a to 5d, as shown in Fig. 26. Therefore, when the axial length of the resonance conductor is to be shortened, the width of the non-conducting portions 5a to 5d changes together with the axial length of the resonance conductor. As a result, both the resonance frequency and the coupling strength between adjacent resonators change simultaneously, making it difficult to obtain desired characteristics. There is described in EP 0538894 A1 a dielectric resonator device in which inner electrodes are provided in a dielectric block, and another electrode is formed on an outer face of the dielectric block. Lengths of the inner electrodes are determined according to resonance frequencies of the respective resonators, while widths of non-electrode formed regions are determined according to the amounts of coupling between the respective resonators. An aim of the invention is to provide a dielectric resonator which allows setting or adjustment of resonance frequency of the resonator of each stage, as well as setting or adjustment of coupling strength between resonators at a desired value, and to provide manufacturing method thereof. Another aim of the invention is to provide a dielectric resonator in which resonance frequency of the resonator can be set or adjusted independent from the coupling strength between resonators, and to provide manufacturing method thereof. A still another aim of the invention is to provide a dielectric resonator in which resonance frequency can be adjusted in either a direction increasing coupling strength of adjacent resonators or a direction decreasing the coupling strength, and to provide manufacturing method thereof. A still further aim of the invention is to provide a dielectric resonator in which coupling strength between adjacent resonators can be changed by relatively large amount, and to provide the manufacturing method thereof. According to the invention there is provided a dielectric resonator, comprising: a dielectric block having a pair of opposing end surfaces; an outer conductor formed on an outer peripheral surface of said dielectric block; a plurality of resonator holes each having a circumference and an axis and extending from at least one of the opposing end surfaces into the dielectric block; and an inner conductor on an inner peripheral surface of each of said resonator holes, each inner conductor having an open end and an end connected to said outer conductor to serve as a short-circuited end, characterised by a non-conducting portion formed on the inner peripheral surface of and near and below the open end of any of said resonator holes, the non-conducting portion having a predetermined length substantially parallel to the axis of the hole and having a width substantially less than the circumference of the hole. According to the invention there is also provided a method of manufacturing a dielectric resonator, the method comprising: forming a plurality of resonator holes in a dielectric block having a pair of opposing end surfaces, each hole having a circumference and an axis and extending from at least one of the opposing end surfaces into the dielectric block; forming an inner conductor on an inner peripheral surface of each of said resonator holes and having an open end and an end connected to serve as a short circuited end therein, forming an outer conductor on an outer peripheral surface of said dielectric block, characterised by forming a non-conducting portion by removing from the inner peripheral surface of and near and below the open end of any of said resonator holes one portion of said inner conductor, said non-conducting portion having a predetermined length substantially parallel to the axis of the hole and having a width substantially less than the circumference of the hole. Therefore, the substantial length of a resonator embodying the invention, corresponds to the length of the inner conductor serving as the resonance conductor is made shorter than when the non-conducting portion with the inner conductor removed is not formed, so that the resonance frequency is slightly increased. In addition, electrostatic capacitance between the non-conducting portion provided by removing the conductor and an end (open end) of the inner conductor serving as the resonance conductor provided at an adjacent resonator hole is reduced, so that characteristic impedance near the end of the inner conductor is increased, and the inductive coupling can be changed. More preferably, the non-conducting portion where the inner conductor is removed, is provided at a position opposing to an adjacent resonator hole. Therefore, according to this embodiment, the odd mode characteristic impedance near the end of the inner conductor serving as the resonance conductor is increased, thus enhancing inductive coupling. In another preferred embodiment of the invention, the non-conducting portion with the conductor removed is formed at a position near the outer conductor. Therefore, according to this embodiment, even mode characteristic impedance near the end of the inner conductor serving as the resonance conductor is increased, thus reducing inductive coupling. In a still another preferred embodiment, non-conducting portions with the conductor removed are formed at a position opposing to an adjacent resonator hold and at a position near the outer conductor, respectively. Therefore, in this embodiment, the odd mode characteristic impedance and even mode characteristic impedance near the end of the inner conductor serving as the resonance conductor are determined, and coupling strength between adjacent resonator is determined in accordance with both characteristic impedances. Further, in another more preferred embodiment of the present invention, the non-conducting portion with the conductor removed is formed at an intermediate position between the position opposing to the adjacent resonator and the position adjacent to the outer conductor. Therefore, in this embodiment, both the even mode and odd mode characteristic impedances are determined, and coupling strength between the resonators can be determined. Therefore, by determining the position where the non-conducting portion with the conductor removed is to be formed intermediate between the position opposing to the adjacent resonator and the position near the outer conductor, both the resonance frequency and coupling strength can be set (finely adjusted). The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings. IN THE DRAWINGS: Fig. 1 is a perspective view of a dielectric resonator in accordance with a first embodiment of the present invention. Fig. 2 is a vertical section taken along the line Y1-Y1 of Fig. 1, before fine adjustment. Fig. 3 is a cross section taken along the line X1-X1 of Fig. 1 before fine adjustment. Fig. 4 is an equivalent circuit diagram of the dielectric resonator shown in Fig. 1. Fig. 5 is a vertical section at a portion taken along the line Y2-Y2 of Fig. 1 after fine adjustment. Fig. 6 is a vertical section taken along the line Y1-Y1 of Fig. 1 after fine adjustment. Fig. 7A is a cross section taken along the line X1-X1 of Fig. 1 after fine adjustment. Fig. 7B is a partial cross section of a portion taken along the line X2-X2 of Fig. 1 after fine adjustment. Fig. 8 is a vertical section taken along the line Y1-Y1 of Fig. 1 after fine adjustment, in accordance with a modification of the first embodiment of the present invention. Fig. 9 is a vertical section taken along the line Y2-Y2 of Fig. 1 after fine adjustment in accordance with a modification of the first embodiment of the present invention. Fig. 10 is a partial cross section taken along the line X1-X1 of Fig. 1 after fine adjustment in accordance with a modification of the first embodiment of the present invention. Fig. 11 is a vertical sectional view of the dielectric resonator in accordance with a second embodiment of the present invention. Fig. 12 is a vertical sectional view of the dielectric resonator in accordance with a third embodiment of the present invention. Fig. 13 is a vertical sectional view of the dielectric resonator in accordance with a fourth embodiment of the present invention. Fig. 14 is a perspective view of the dielectric resonator in accordance with the fifth embodiment of the present invention. Fig. 15 is a vertical sectional view taken along the line Y-Y of Fig. 14. Fig. 16 is a perspective view of the dielectric resonator in accordance with a sixth embodiment of the present invention. Fig. 17 is a vertical sectional view taken along the line Y1-Y1 of Fig. 16. Fig. 18 is a cross section taken along the line X1-X1 of the dielectric resonator of Fig. 16 before fine adjustment. Fig. 19 is a cross section taken along the line X2-X2 of Fig. 16. Fig. 20 is a vertical section taken along the line Y2-Y2 of the dielectric resonator shown in Fig. 16 after fine adjustment. Fig. 21 is a vertical section taken along the line Y1-Y1 of the dielectric resonator of Fig. 16 after fine adjustment. Fig. 22 is a cross section taken along the line X1-X1 of the dielectric resonator shown in Fig. 16 after fine adjustment. Fig. 23 is a perspective view of the dielectric resonator in accordance with a seventh embodiment of the present invention. Fig. 24 is a vertical section taken along the line Y-Y of Fig. 23. Fig. 25 is a perspective view of a conventional dielectric resonator. Fig. 26 is a vertical section taken along the line Y-Y of Fig. 25. DESCRIPTION OF THE PREFERRED EMBODIMENTS Figs. 1 to 3 show the dielectric resonator in accordance with the first embodiment of the present invention, in which Fig. 1 is a perspective view, Fig. 2 is a vertical section taken along the line Y1-Y1 of Fig. 1 before fine adjustment and Fig. 3 is a cross section taken along the line X1-X1 of Fig. 1 before fine adjustment. Referring to Fig. 1, dielectric block 1 is approximately rectangular parallelepiped. Four through holes 2a, 2b, 2c and 2d piercing through opposing first surface S1 and second surface S2 are formed in dielectric block 1. An outer conductor 6 is formed on the first surface S1, the second surface S2 and each of four side surfaces S3, S4, S5 and S6 of dielectric block 1. A signal input/output conductor 7a is provided bridging side surfaces S3 and S4, and signal input/output conductor 7b is provided bridging side surfaces S3 and S6, each insulated from the outer conductor 6. Further, referring to Fig. 2, a plurality of inner conductors 3a, 4a, 3b, 4b, 3c, 4c, 3d and 4d are formed on the inner surfaces of through holes 2a, 2b, 2c and 2d, separated by first non-conducting portions 5a, 5b, 5c and 5d, respectively. At the first non-conducting portions 5a to 5d, the surface of the dielectric block material is exposed in a ring-shape. In the example shown in Fig. 2, stray capacitance is generated at the first non-conducting portions 5a to 5d where the inner conductor is not provided, and each of the inner conductors 3a to 3d functions as a resonance conductor having the wavelength of λ4 having the second surface S2 as the short-circuited surface and the first surface S1 as the stray surface. Referring to Fig. 3, the electrostatic capacitance between inner conductor 3a and signal input/output conductor 7a and between the inner conductor 3d and the signal input/output conductor 7b are utilized as external coupling capacitances Cea and Ceb, respectively. Fig. 4 is an equivalent circuit diagram of the dielectric resonator having the structure shown in Figs. 1 to 3. Referring to Fig. 4, resonators Ra, Rb, Rc and Rd are formed at through holes 2a, 2b, 2c and 2d; stray capacitances Csa, Csb, Csc and Csd are formed at the first non-conducting portions 5a, 5b, 5c and 5d shown in Fig. 2; and external coupling capacitances Cea and Ceb are formed between inner conductor 3a and signal input/output conductor 7a and between inner conductor 3d and signal input/output conductor 7b. In this manner, a bandpass filter having four stages coupled to a comb line is provided. Now, a method of manufacturing the dielectric resonator in accordance with the first embodiment of the present invention will be described. The first non-conducting portions 5a to 5d shown in Fig. 2 are formed by the following manner. A rotary grinder is inserted to each of the through holes 2a to 2d from the first surface S1 of dielectric block 1. While rotating the rotary grinder, the center of rotation of the grinder is revolved in the circumferential direction of the through hole (so called planetary movement), whereby the inner conductor and part of the dielectric body are partially removed. Thus, the first non-conductive portions are formed. By moving the rotary grinder in the axial direction of the through hole while continuing the planetary movement, the width of the first non-conducting portion can be increased. The width and position of formation in the through hole of the first non-conducting portion is predetermined in accordance with the resonance frequency of the resonator of each stage and the required stray capacitance. In the step of rough adjustment, the dielectric resonator is connected to a network analyzer, and the width of the first non-conducting portion of each stage is widened toward the inner conductors 3a to 3d serving as the resonance conductor or toward the inner conductors 4a to 4d extending from the outer conductor while measuring the filtering characteristics, whereby the resonance frequency of the resonator of each stage and the coupling strength between the resonators are roughly adjusted. The method of subsequent fine adjustment will be described. Fig. 5 is a vertical section taken along the line Y2-Y2 of Fig. 1 after fine adjustment of the dielectric resonator shown in Figs. 1 to 3. Referring to Fig. 5, inner conductors 3b and 4b are formed separated by the first non-conducting portion 5b on the inner surface of through hole 2b. In the step of fine adjustment, the inner conductor is partially removed along the axial direction of the through hole 2b, continuous from the first non-conducting portion 5b toward the side of inner conductor 3b serving as the resonance conductor, at a position opposing to an adjustment through hole 2a. Thus a second non-conducting portion 8b is formed. The second non-conducting portion 8b is formed by moving the rotary grinder from the first non-conducting portion 5b to the axial direction of the through hole 2b so as to remove the inner conductor. Thus substantial axial length of the inner conductor 3b serving as the resonance conductor is shortened, the electrostatic capacitance between the portion near the end of inner conductor 3b and the portion near the end of inner conductor 3a is reduced, odd mode characteristic impedance near the end portion is increased, and inductive coupling become stronger. The dielectric resonator having the second non-conducting portion may be regarded as a resonator having stepped coupling structure in which the impedance at the portion A including the second non-conducting portion is different from the impedance of remaining portion B. Fig. 6 shows an example in which the second non-conducting portion is formed at a position different from the example of Fig. 5, and it is a vertical section taken along the line Y1-Y1 of Fig. 1 of the dielectric resonator shown in Figs. 1 to 3, after fine adjustment. In the embodiment shown in Fig. 5, the second non-conducting portion 8b is formed at a position opposing to the adjacent through hole 2a. However, in this embodiment, the second non-conducting portion 9a is formed by removing inner conductor 3a along the axial direction of the through hole 2a, continuous from the first non-conducting portion 5a, at a position adjacent to the outer conductor formed on the side surface S5 of Fig. 1. Consequently, the substantial axial length of inner conductor 3a as the resonance conductor is made shorter, the electrostatic capacitance between the outer conductor and the portion near the end of inner conductor 3a is reduced, even mode characteristic impedance near the end of inner conductor 3a is increased, and thus the inductive coupling between the resonators becomes weaker. In the example shown in Fig. 6, a second non-conducting portion 9b is also formed near the end of inner conductor 3b of through hole 2b. Figs. 7A and 7B are partial cross sections taken along the lines X1-X1 and X2-X2 of Fig. 1 after fine adjustment, respectively. Referring to Figs. 7A and 7B, electrostatic capacitance Cij is formed between end portions of inner conductors 3a and 3b, electrostatic capacitance C1 is formed between portions near inner conductors 3a and 3b and outer conductor 6, where suffix A represents the portion at which the second non-conducting portion is formed, and the suffix B denotes the portion other than the second non-conducting portion. The even mode characteristic impedances and odd mode characteristic impedances Ze A , Ze B , Zo A and Zo B are represented by the following equations: Ze A = ε r /( Ci A · Vc ) Ze B = ε r /( Ci B · Vc ) Zo A = ε r /{( Ci A = 2C ij A )· Vc } Zo B = ε r /{( Ci B + 2 Cij B )· Vc } where Vc represents the velocity of light. Coupling between adjacent resonators are expressed by the following elusions: When Ze A /Ze B < Zo A /Zo B , coupling is inductive coupling. When Ze A /Ze B > Zo A /Zo B , coupling is capacitive coupling. In the above described embodiments, either the second conducting portions 8a and 8b or 9a and 9b are formed. However, the second conducting portions may be formed both at the position opposing to the adjacent through hole and the position near the outer conductor. For example, in order to increase the resonance frequency of the resonator provided by inner conductor 3a, the portion represented by 8a or 9a may be removed. When inductive coupling with the resonator provided by inner conductor 3b is to be increased, the portion represented by 8a may be removed. Meanwhile, if the coupling strength is to be reduced, the portion represented by 9a may be removed. In order to adjust resonance frequency while maintaining constant coupling strength, portions represented by 8a and 9a may be both removed. Fig. 8 is a vertical section taken along the line Y1-Y1 of Fig. 1 after fine adjustment, in accordance with a modification of the first embodiment of the present invention, and Fig. 9 is a vertical section taken along the line Y2-Y2 of Fig. 1. In the example shown in Figs. 5 to 7, the second non-conducting portion is formed either at a position opposing to the adjacent through hole or a position near the outer conductor, or the second conducting portions are formed at both of these positions. In the example shown in Figs. 8 and 9, the second non-conducting portion is formed at a position intermediate between the position opposing to the adjacent through hole and the position adjacent to the outer conductor. Referring to Figs. 8 and 9, the second non-conducting portions 10a and 10b are formed by removing the inner conductors along the axial direction of the through holes continuous from the first non-conducting portions 5a and 5b, each at approximately the central position between the position opposing to the adjacent through hole and the position near the outer conductor, in the through holes 2a and 2b. In this case, the resonance frequency of the resonators provided by inner conductors 3a and 3b can be adjusted by changing the amount of removal at the second non-conducting portions 10a and 10b, and the coupling strength between the resonators can be adjusted by changing the position at which the second non-conducting portions are formed. Namely, by providing the second non-conducting portions 10a and 10b at positions near to the position opposing to the adjacent trough holes, the electrostatic capacitance Cij shown in Fig. 7 can be reduced, the odd mode characteristic impedance is increased and the coupling strength can be increased. Conversely, by providing the second non-conducting portions 10a and 10b nearer to the position adjacent to outer conductor, the electrostatic capacitance Ci is reduced, the even mode characteristic impedance is increased, and the coupling strength between the resonators can be reduced. Fig. 11 is a vertical section of the dielectric resonator in accordance with the second embodiment of the present invention. In the example shown in Figs. 5 to 10 above, the second non-conducting portion is provided continuous from the first non-conducting portion. However, in the embodiment shown in Fig. 11, the second non-conducting portion is not continuous to the first non-conducting portion, but near and independent from the first non-conducting portion. Fig. 11 is a vertical section taken along the line Y1-Y1 of Fig. 1 after fine adjustment and in this example, the second non-conducting portions 11a and 11b are formed near the end portions of inner conductors 3a and 3b, near the first non-conducting portions 5a and 5b. In this example, the electrostatic capacitance between the portions near the ends of inner conductors 3a and 3b and outer conductor is reduced. Fig. 12 is a vertical section of the dielectric resonator in accordance with the third embodiment of the present invention. In the embodiments above, the second non-conducting portion was formed to have a rectangular shape. However, the shape may be varied by changing the shape of the rotary grinder used for removing the inner conductor, or by changing the method of removal. For example, the second non-conducting portion may have a tapered shape as shown in Fig. 12, or elliptical shaped as shown in the fourth embodiment of Fig. 13. Fig. 14 is a perspective view of the dielectric resonator in accordance with the fifth embodiment of the present invention and Fig. 15 is a vertical section taken along the line Y-Y of Fig. 14. In the embodiment shown in Fig. 1, the first non-conducting portion is provided at a certain depth of the through hole. However, in the embodiment shown in Figs. 14 and 15, the first non-conducting portion is formed at one opening of the through hole. By providing the first non-conducting portions 5a to 5d at one opening of the through holes 2a to 2d, stray capacitance can be formed between the end portion of each of the inner conductors 3a to 3d and the outer conductor 6 formed at the first surface S1 of the dielectric body. In this example, the second non-conducting portions 9a to 9d are formed at end portions of the inner conductors 3a to 3d, continuous from the first non-conducting portions 5a to 5d. Figs. 16 to 22 show the sixth embodiment of the present invention showing an example in which the present invention is applied to a dielectric resonator having stepped inner conductors, in which Fig. 16 is a perspective view, Fig. 17 is a vertical section taken along the line Y1-Y1 of Fig. 16, Fig. 18 is a cross section taken along the line X1-X1 of Fig. 16 and Fig. 19 is a cross section taken along the line X2-X2 of Fig. 16, before fine adjustment, respectively, and Fig. 20 is a vertical section taken along the line Y2-Y2 of Fig. 16, Fig. 21 is a vertical section taken along the line Y1-Y1 of Fig 16 and Fig. 22 is a cross section taken along the line X1-X1 of Fig. 16, after fine adjustment, respectively. Referring to Figs. 16 and 17, inner diameter of each of the through holes 2a and 2b is made different on the side of the first surface (stray surface) S1 and the second surface (short circuited surface) S2. Namely, the inner diameter on the side of the stray surface is larger as shown in Fig. 18, and the inner diameter on the side of the short-circuited surface is smaller as shown in Fig. 19. By providing a step at the inner conductor of the dielectric resonator, the resonators are capacitively coupled. Further, referring to Fig. 20, when the second non-conducting portion 8b is formed continuous from the first non-conducting portion 5b at a position opposing to the adjacent through hole, the electrostatic capacitance at portions near the end portions of the inner conductors is reduced, odd mode characteristic impedance is increased, capacitive coupling is reduced and the coupling strength between the resonators is reduced. Further, referring to Fig. 21, by providing the second non-conducting portions 9a and 9b continuous from the first non-conducting portions 5a and 5b at positions near the outer conductor, the electrostatic capacitance between the portions near the end portion of the inner conductors 3a and 3b and outer conductor 6 is reduced, even mode characteristic impedance is increased, capacitive coupling is enhanced and the coupling strength between the resonator is increased. In the dielectric resonator having the stepped inner conductor, the second non-conducting portions may be provided both at the position opposing to the adjacent through hole and at the position adjacent to the outer conductor, so as to independently adjust electrostatic capacitances Cij and Ci shown in Fig. 22 and to adjust coupling strength between the resonators as well as the resonance frequency. Figs. 23 and 24 show the dielectric resonator in accordance with the seventh embodiment of the present invention, in which Fig. 23 is a perspective view and Fig. 24 is a vertical section taken along the line Y-Y of Fig. 23. In the examples shown in Figs. 16 to 22, the outer conductor is formed on the first surface S1 of the dielectric block. In the embodiment shown in Figs. 23 and 24, the first surface S1 is an open surface. If the inner conductor has stepped structure, it is possible to adjust the electrostatic capacitance with the inner conductor 6 by using the first surface S1 of the dielectric block 6 as an open surface and by providing the second non-conducting portions 9a and 9b at openings of through holes 2a and 2b. Though a λ/4 resonator having a short-circuited surface at one end of the inner conductor has been described in the embodiments above, the present invention can be similarly applied to a λ/2 resonator in which the inner conductor serving as the resonance conductor has both ends open. Though the inner conductor is provided on the inner surface of the through hole of the dielectric block in each of the embodiments above, the resonator hole in which the inner conductor is provided may not be a through hole.

Claims: A dielectric resonator, comprising: a dielectric block (1) having a pair of opposing end surfaces; an outer conductor (6) formed on an outer peripheral surface of said dielectric block; a plurality of resonator holes (2a-2d) each having a circumference and an axis and extending from at least one of the opposing end surfaces into the dielectric block; and an inner conductor (3a-3d, 4a-4d) on an inner peripheral surface of each of said resonator holes, each inner conductor having an open end and an end connected to said outer conductor to serve as a short-circuited end, characterised by a non-conducting portion (8b) formed on the inner peripheral surface of and near and below the open end of any of said resonator holes, the non-conducting portion having a predetermined length substantially parallel to the axis of the hole and having a width substantially less than the circumference of the hole. The dielectric resonator according to claim 1, wherein said non-conducting portion (8b) in one resonator hole (2a-2d) opposes an adjacent resonator hole (2a-2d). The dielectric resonator according to claim 1, wherein said non-conducting portion (8b) in one resonator hole (2a-2d) is positioned near said outer conductor (6). The dielectric resonator according to claim 1, 2 or 3, wherein one said non-conducting portion (8b) in one resonator hole (2a-2d) opposes an adjacent resonator hole (2a-2d) and another said non-conducting portion (8b) in said one resonator hole (2a-2d) is positioned near said outer conductor (6). The dielectric resonator according to claim 1, wherein said non-conducting portion (8b) in one resonator hole (2a-2d) is between a position which opposes an adjacent resonator hole (2a-2d) and a position near said outer conductor (6). The dielectric resonator according to any preceding claim, further comprising: a ring-shaped non-conducting portion (5b) near the open end of any of said resonator holes (2a-2d) which include said one non-conducting portion (8b) for electrically insulating said outer conductor (6) and said inner conductor, wherein the non-conducting portion (8b) is formed in the vicinity of the ring-shaped non-conducting portion. The dielectric resonator according to claim 6 wherein said non-conducting portion (8b) is formed continuously with said ring-shaped non-conducting portion (5b). The dielectric resonator according to claim 6, wherein said non-conducting portion (8b) is independent of said ring-shaped non-conducting portion (5b). The dielectric resonator according to claim 6, 7 or 8, wherein said ring-shaped non-conducting portion (5b) is at the open end of said resonator hole (2a-2d). The dielectric resonator according to any preceding claim, wherein said resonator holes (2a-2d) have a first inner diameter on the side of said open end, and a second inner diameter on the side of said short-circuited end, said first diameter being different from said second diameter. The dielectric resonator according to any preceding claim, wherein said outer conductor (6) is formed on an outer peripheral surface of said dielectric block (1) except on said one of the pair of end surfaces, and said one of the end surfaces is an open end. The dielectric resonator according to any preceding claim, further comprising a pair of input/output electrodes formed at portions of said outer conductor and capacitively coupled with those of said plurality of inner conductors which are positioned at opposing ends. A method of manufacturing a dielectric resonator, the method comprising: forming a plurality of resonator holes (2a-2d) in a dielectric block (1) having a pair of opposing end surfaces, each hole having a circumference and an axis and extending from at least one of the opposing end surfaces into the dielectric block; forming an inner conductor on an inner peripheral surface of each of said resonator holes (2a-2d) and having an open end and an end connected to serve as a short circuited end (3a-3d) therein, forming an outer conductor (6) on an outer peripheral surface of said dielectric block, characterised by forming a non-conducting portion (8b) by removing from the inner peripheral surface of and near and below the open end of any of said resonator holes one portion of said inner conductor, said non-conducting portion (8b) having a predetermined length substantially parallel to the axis of the hole and having a width substantially less than the circumference of the hole. The method of manufacturing a dielectric resonator according to claim 13, wherein one said portion of said inner conductor in one resonator hole (2a-2d) is removed at a position which opposes an adjacent resonator hole (2a-2d). The method of manufacturing a dielectric resonator according to claim 13, wherein one said portion of said inner conductor in one resonator hole (2a-2d) is removed at a position near said outer conductor (6). The method of manufacturing a dielectric resonator according to claim 13, 14 or 15, wherein one said portion of said inner conductor in one resonator hole (2a-2d) is removed at a position which opposes an adjacent resonance hole (2a-2d) and another said portion of said inner conductor in said one resonator hole (2a-2d) is removed at a position near said outer conductor (6). The method of manufacturing a dielectric resonator according to claim 13, wherein one said portion of said inner conductor in one resonator hole (2a-2d) is removed from a position which is between a position which opposes an adjacent resonance hole (2a-2d) and a position near said outer conductor (6).

Inventors: KATO HIDEYUKI, MATSUMOTO HARUO, TADA HITOSHI, TSUJIGUCHI TATSUYA, KATO, HIDEYUKI, MATSUMOTO, HARUO, TADA, HITOSHI, TSUJIGUCHI, TATSUYA, KATO, HIDEYUKI, C/O MURATA MANUFACTURING CO., LTD., MATSUMOTO, HARUO, C/O MURATA MANUFACT. CO., LTD., TADA, HITOSHI, C/O MURATA MANUFACTURING CO., LTD., TSUJIGUCHI, TATSUYA, C/O MURATA MANUFACT. CO., LTD
Applicants: MURATA MANUFACTURING CO, MURATA MANUFACTURING CO., LTD.
Application year: 1994
Main classification: H01P1
IPC codes: H01P1, H01P11, H01P7